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Sample records for plasmid-encoded copper resistance

  1. The multidrug resistance IncA/C transferable plasmid encodes a novel domain-swapped dimeric protein-disulfide isomerase.

    Science.gov (United States)

    Premkumar, Lakshmanane; Kurth, Fabian; Neyer, Simon; Schembri, Mark A; Martin, Jennifer L

    2014-01-31

    The multidrug resistance-encoding IncA/C conjugative plasmids disseminate antibiotic resistance genes among clinically relevant enteric bacteria. A plasmid-encoded disulfide isomerase is associated with conjugation. Sequence analysis of several IncA/C plasmids and IncA/C-related integrative and conjugative elements (ICE) from commensal and pathogenic bacteria identified a conserved DsbC/DsbG homolog (DsbP). The crystal structure of DsbP reveals an N-terminal domain, a linker region, and a C-terminal catalytic domain. A DsbP homodimer is formed through domain swapping of two DsbP N-terminal domains. The catalytic domain incorporates a thioredoxin-fold with characteristic CXXC and cis-Pro motifs. Overall, the structure and redox properties of DsbP diverge from the Escherichia coli DsbC and DsbG disulfide isomerases. Specifically, the V-shaped dimer of DsbP is inverted compared with EcDsbC and EcDsbG. In addition, the redox potential of DsbP (-161 mV) is more reducing than EcDsbC (-130 mV) and EcDsbG (-126 mV). Other catalytic properties of DsbP more closely resemble those of EcDsbG than EcDsbC. These catalytic differences are in part a consequence of the unusual active site motif of DsbP (CAVC); substitution to the EcDsbC-like (CGYC) motif converts the catalytic properties to those of EcDsbC. Structural comparison of the 12 independent subunit structures of DsbP that we determined revealed that conformational changes in the linker region contribute to mobility of the catalytic domain, providing mechanistic insight into DsbP function. In summary, our data reveal that the conserved plasmid-encoded DsbP protein is a bona fide disulfide isomerase and suggest that a dedicated oxidative folding enzyme is important for conjugative plasmid transfer.

  2. Acquisition of Carbapenem Resistance by Plasmid-Encoded-AmpC-Expressing Escherichia coli.

    Science.gov (United States)

    van Boxtel, Ria; Wattel, Agnes A; Arenas, Jesús; Goessens, Wil H F; Tommassen, Jan

    2017-01-01

    Although AmpC β-lactamases can barely degrade carbapenems, if at all, they can sequester them and prevent them from reaching their targets. Thus, carbapenem resistance in Escherichia coli and other Enterobacteriaceae can result from AmpC production and simultaneous reduction of antibiotic influx into the periplasm by mutations in the porin genes. Here we investigated the route and genetic mechanisms of acquisition of carbapenem resistance in a clinical E. coli isolate carrying bla CMY-2 on a plasmid by selecting for mutants that are resistant to increasing concentrations of meropenem. In the first step, the expression of OmpC, the only porin produced in the strain under laboratory conditions, was lost, leading to reduced susceptibility to meropenem. In the second step, the expression of the CMY-2 β-lactamase was upregulated, leading to resistance to meropenem. The loss of OmpC was due to the insertion of an IS1 element into the ompC gene or to frameshift mutations and premature stop codons in this gene. The bla CMY-2 gene was found to be located on an IncIγ plasmid, and overproduction of the CMY-2 enzyme resulted from an increased plasmid copy number due to a nucleotide substitution in the inc gene. The clinical relevance of these genetic mechanisms became evident from the analysis of previously isolated carbapenem-resistant clinical isolates, which appeared to carry similar mutations. Copyright © 2016 American Society for Microbiology.

  3. Acquisition of carbapenem resistance by plasmid-encoded-AmpC-expressing Escherichia coli

    NARCIS (Netherlands)

    Tommassen - van Boxtel, Ria; Wattel, Agnes A.; Arenas Busto, Jesus; Goessens, Wil H.F.; Tommassen, J

    2017-01-01

    Although AmpC β-lactamases can barely degrade carbapenems, if at all, they can sequester them and prevent them from reaching their targets. Thus, carbapenem resistance in Escherichia coli and other Enterobacteriaceae can result from AmpC production and simultaneous reduction of antibiotic influx

  4. Estimating the Transfer Range of Plasmids Encoding Antimicrobial Resistance in a Wastewater Treatment Plant Microbial Community

    DEFF Research Database (Denmark)

    Li, Liguan; Dechesne, Arnaud; He, Zhiming

    2018-01-01

    sludge microbial community was challenged in standardized filter matings with one of three multidrug resistance plasmids (pKJK5, pB10, and RP4) harbored by Escherichia coli or Pseudomonas putida. Different donor–plasmid combinations had distinct transfer frequencies, ranging from 3 to 50 conjugation...... events per 100000 cells of the WWTP microbial community. In addition, transfer was observed to a broad phylogenetic range of 13 bacterial phyla with several taxa containing potentially pathogenic species. Preferential transfer to taxa belonging to the predicted evolutionary host range of the plasmids...... ARG transmission. However, the contribution of microbial communities in WWTPs to ARG dissemination remains poorly understood. Here, we examined for the first time plasmid permissiveness of an activated sludge microbial community by utilizing an established fluorescent bioreporter system. The activated...

  5. Dissemination of plasmid-encoded AmpC β-lactamases in antimicrobial resistant Salmonella serotypes originating from humans, pigs and the swine environment.

    Science.gov (United States)

    Keelara, Shivaramu; Thakur, Siddhartha

    2014-09-17

    The aim of this study was to characterize and determine the inter-serovar exchange of AmpC β-lactamase conferring plasmids isolated from humans, pigs and the swine environment. Plasmids isolated from a total of 21 antimicrobial resistant (AMR) Salmonella isolates representing human clinical cases (n=6), pigs (n=6) and the swine farm environment (n=9) were characterized by replicon typing and restriction digestion, inter-serovar transferability by conjugation, and presence of AmpC β-lactamase enzyme encoding gene blaCMY-2 by southern hybridization. Based on replicon typing, the majority (17/21, 81%) of the plasmids belonged to the I1-Iγ Inc group and were between 70 and 103kb. The potential for inter-serovar plasmid transfer was further confirmed by the PCR detection of AMR genes on the plasmids isolated from trans-conjugants. Plasmids from Salmonella serovars Anatum, Ouakam, Johannesburg and Typhimurium isolated from the same cohort of pigs and their environment and S. Heidelberg from a single human clinical isolate had identical plasmids based on digestion with multiple restriction enzymes (EcoRI, HindIII and PstI) and southern blotting. We demonstrated likely horizontal inter-serovar exchange of plasmid-encoding AmpC β-lactamases resistance among MDR Salmonella serotypes isolated from pigs, swine farm environment and clinical human cases. This study provides valuable information on the role of the swine farm environment and by extension other livestock farm environments, as a potential reservoir of resistant bacterial strains that potentially transmit resistance determinants to livestock, in this case, swine, humans and possibly other hosts by horizontal exchange of plasmids. Copyright © 2014 Elsevier B.V. All rights reserved.

  6. Inactivation efficiency of plasmid-encoded antibiotic resistance genes during water treatment with chlorine, UV, and UV/H2O2.

    Science.gov (United States)

    Yoon, Younggun; Chung, Hay Jung; Wen Di, Doris Yoong; Dodd, Michael C; Hur, Hor-Gil; Lee, Yunho

    2017-10-15

    This study assessed the inactivation efficiency of plasmid-encoded antibiotic resistance genes (ARGs) both in extracellular form (e-ARG) and present within Escherichia coli (intracellular form, i-ARG) during water treatment with chlorine, UV (254 nm), and UV/H 2 O 2 . A quantitative real-time PCR (qPCR) method was used to quantify the ARG damage to amp R (850 bp) and kan R (806 bp) amplicons, both of which are located in the pUC4K plasmid. The plate count and flow cytometry methods were also used to determine the bacterial inactivation parameters, such as culturability and membrane damage, respectively. In the first part of the study, the kinetics of E. coli inactivation and ARG damage were determined in phosphate buffered solutions. The ARG damage occurred much more slowly than E. coli inactivation in all cases. To achieve 4-log reduction of ARG concentration at pH 7, the required chlorine exposure and UV fluence were 33-72 (mg × min)/L for chlorine and 50-130 mJ/cm 2 for UV and UV/H 2 O 2 . After increasing pH from 7 to 8, the rates of ARG damage decreased for chlorine, while they did not vary for UV and UV/H 2 O 2 . The i-ARGs mostly showed lower rates of damage compared to the e-ARGs due to the protective roles of cellular components against oxidants and UV. The contribution of OH radicals to i-ARG damage was negligible in UV/H 2 O 2 due to significant OH radical scavenging by cellular components. In all cases, the ARG damage rates were similar for amp R versus kan R , except for the chlorination of e-ARGs, in which the damage to amp R occurred faster than that to kan R . Chlorine and UV dose-dependent ARG inactivation levels determined in a wastewater effluent matrix could be reasonably explained by the kinetic data obtained from the phosphate buffered solutions and the expected oxidant (chlorine and OH radicals) demands by water matrix components. These results can be useful in optimizing chlorine and UV-based disinfection systems to achieve ARG

  7. Antibiotic Trapping by Plasmid-Encoded CMY-2 beta-Lactamase Combined with Reduced Outer Membrane Permeability as a Mechanism of Carbapenem Resistance in Escherichia coli

    NARCIS (Netherlands)

    Goessens, W.H.F.; van der Bij, A.K.; van Boxtel, R.; Pitout, J.D.D.; van Ulsen, J.P.; Melles, D.C.; Tommassen, J.

    2013-01-01

    A liver transplant patient was admitted with cholangitis, for which meropenem therapy was started. Initial cultures showed a carbapenem-susceptible (CS) Escherichia coli strain, but during admission, a carbapenem-resistant (CR) E. coli strain was isolated. Analysis of the outer membrane protein

  8. Antibiotic trapping by plasmid-encoded cmy-2-lactamase combined with reduced outer membrane permeability as a mechanism of carbapenem resistance in escherichia coli

    NARCIS (Netherlands)

    W.H.F. Goessens (Wil); A.K. van der Bij (Akke); R. van Boxtel (Ria); J.D.D. Pitout (J. D D); P. van Ulsen (Peter); D.C. Melles (Damian); J. Tommassen (Jan)

    2013-01-01

    textabstractA liver transplant patient was admitted with cholangitis, for which meropenem therapy was started. Initial cultures showed a carbapenem-susceptible (CS) Escherichia coli strain, but during admission, a carbapenem-resistant (CR) E. coli strain was isolated. Analysis of the outer membrane

  9. High diversity of genes and plasmids encoding resistance to third-generation cephalosporins and quinolones in clinical Escherichia coli from commercial poultry flocks in Italy

    DEFF Research Database (Denmark)

    Niero, Giulia; Bortolaia, Valeria; Vanni, Michele

    2018-01-01

    = 98) and layers (n = 22) between 2008 and 2012. 3GC-resistant isolates were screened for extended-spectrum and AmpC β-lactamase (ESBL/AmpC), while all isolates were tested for plasmid-mediated quinolone resistance (PMQR) genes. ESBL/AmpC- and PMQR-positive isolates were typed by pulsed-field gel......% of isolates from turkeys, broilers and layers, respectively. We identified seven ESBL/AmpC-encoding plasmid types, usually conjugative (78%), with a marked prevalence of IncI1/pST3 plasmids carrying blaCTX-M-1. PMQR occurred less frequently among isolates from turkeys (0.9%) compared to those from broilers (5......%) and layers (4%). The PMQR genes qnrS, qnrB19 and oqxA/B were located on three plasmid types and two non-typeable plasmids, mostly (85%) conjugative. ESBL/AmpC- and PMQR-positive isolates were genetically unrelated and 64% of them were additionally resistant to aminoglycosides, sulfonamides and tetracyclines...

  10. Complete nucleotide sequence of pGA45, a 140,698-bp incFIIY plasmid encoding blaIMI-3-mediated carbapenem resistance, from river sediment

    Directory of Open Access Journals (Sweden)

    Bingjun eDang

    2016-02-01

    Full Text Available Plasmid pGA45 was isolated from the sediment of Haihe River using E. coli CV601 (gfp-tagged as recipients and indigenous bacteria from sediment as donors. This plasmid confers reduced susceptibility to imipenem which belongs to carbapenem group. Plasmid pGA45 was fully sequenced on an Illumina HiSeq 2000 sequencing system. The complete sequence of plasmid pGA45 was 140,698 bp in length with an average G+C content of 52.03%. Sequence analysis shows that pGA45 belongs to incFIIY group and harbors a backbone region shares high homology and gene synteny to several other incF plasmids including pNDM1_EC14653, pYDC644, pNDM-Ec1GN574, pRJF866, pKOX_NDM1 and pP10164-NDM. In addition to the backbone region, plasmid pGA45 harbors two notable features including one blaIMI-3-containing region and one type VI secretion system region. The blaIMI-3-containing region is responsible for bacteria carbapenem resistance and the type VI secretion system region is probably involved in bacteria virulence, respectively. Plasmid pGA45 represents the first complete nucleotide sequence of the blaIMI-harboring plasmid from environment sample and the sequencing of this plasmid provided insight into the architecture used for the dissemination of blaIMI carbapenemase genes.

  11. Genome Sequences of Two Copper-Resistant Escherichia coli Strains Isolated from Copper-Fed Pigs

    DEFF Research Database (Denmark)

    Lüthje, Freja L.; Hasman, Henrik; Aarestrup, Frank Møller

    2014-01-01

    The draft genome sequences of two copper-resistant Escherichia coli strains were determined. These had been isolated from copper-fed pigs and contained additional putative operons conferring copper and other metal and metalloid resistances.......The draft genome sequences of two copper-resistant Escherichia coli strains were determined. These had been isolated from copper-fed pigs and contained additional putative operons conferring copper and other metal and metalloid resistances....

  12. A Novel IncA/C1 Group Conjugative Plasmid, Encoding VIM-1 Metallo-Beta-Lactamase, Mediates the Acquisition of Carbapenem Resistance in ST104 Klebsiella pneumoniae Isolates from Neonates in the Intensive Care Unit of V. Monaldi Hospital in Naples.

    Science.gov (United States)

    Esposito, Eliana P; Gaiarsa, Stefano; Del Franco, Mariateresa; Crivaro, Valeria; Bernardo, Mariano; Cuccurullo, Susanna; Pennino, Francesca; Triassi, Maria; Marone, Piero; Sassera, Davide; Zarrilli, Raffaele

    2017-01-01

    The emergence of carbapenemase producing Enterobacteriaceae has raised major public health concern. The aim of this study was to investigate the molecular epidemiology and the mechanism of carbapenem resistance acquisition of multidrug-resistant Klebsiella pneumoniae isolates from 20 neonates in the neonatal intensive care unit (NICU) of the V. Monaldi Hospital in Naples, Italy, from April 2015 to March 2016. Genotype analysis by pulsed-field gel electrophoresis (PFGE) and multi-locus sequence typing (MLST) identified PFGE type A and subtypes A1 and A2 in 17, 2, and 1 isolates, respectively, and assigned all isolates to sequence type (ST) 104. K. pneumoniae isolates were resistant to all classes of β-lactams including carbapenems, fosfomycin, gentamicin, and trimethoprim-sulfamethoxazole, but susceptible to quinolones, amikacin, and colistin. Conjugation experiments demonstrated that resistance to third-generation cephems and imipenem could be transferred along with an IncA/C plasmid containing the extended spectrum β-lactamase bla SHV -12 and carbapenem-hydrolyzing metallo-β-lactamase bla V IM-1 genes. The plasmid that we called pIncAC_KP4898 was 156,252 bp in size and included a typical IncA/C backbone, which was assigned to ST12 and core genome (cg) ST12.1 using the IncA/C plasmid MLST (PMLST) scheme. pIncAC_KP4898 showed a mosaic structure with bla V IM-1 into a class I integron, bla SHV -12 flanked by IS6 elements, a mercury resistance and a macrolide 2'-phosphotransferase clusters, ant(3″), aph(3″), aacA4, qnrA1, sul1 , and dfrA14 conferring resistance to aminoglycosides, quinolones, sulfonamides, and trimethoprim, respectively, several genes predicted to encode transfer functions and proteins involved in DNA transposition. The acquisition of pIncAC_KP4898 carrying bla V IM-1 and bla SHV -12 contributed to the spread of ST104 K. pneumoniae in the NICU of V. Monaldi Hospital in Naples.

  13. A Novel IncA/C1 Group Conjugative Plasmid, Encoding VIM-1 Metallo-Beta-Lactamase, Mediates the Acquisition of Carbapenem Resistance in ST104 Klebsiella pneumoniae Isolates from Neonates in the Intensive Care Unit of V. Monaldi Hospital in Naples

    Directory of Open Access Journals (Sweden)

    Eliana P. Esposito

    2017-11-01

    Full Text Available The emergence of carbapenemase producing Enterobacteriaceae has raised major public health concern. The aim of this study was to investigate the molecular epidemiology and the mechanism of carbapenem resistance acquisition of multidrug-resistant Klebsiella pneumoniae isolates from 20 neonates in the neonatal intensive care unit (NICU of the V. Monaldi Hospital in Naples, Italy, from April 2015 to March 2016. Genotype analysis by pulsed-field gel electrophoresis (PFGE and multi-locus sequence typing (MLST identified PFGE type A and subtypes A1 and A2 in 17, 2, and 1 isolates, respectively, and assigned all isolates to sequence type (ST 104. K. pneumoniae isolates were resistant to all classes of β-lactams including carbapenems, fosfomycin, gentamicin, and trimethoprim–sulfamethoxazole, but susceptible to quinolones, amikacin, and colistin. Conjugation experiments demonstrated that resistance to third-generation cephems and imipenem could be transferred along with an IncA/C plasmid containing the extended spectrum β-lactamase blaSHV -12 and carbapenem-hydrolyzing metallo-β-lactamase blaV IM-1 genes. The plasmid that we called pIncAC_KP4898 was 156,252 bp in size and included a typical IncA/C backbone, which was assigned to ST12 and core genome (cg ST12.1 using the IncA/C plasmid MLST (PMLST scheme. pIncAC_KP4898 showed a mosaic structure with blaV IM-1 into a class I integron, blaSHV -12 flanked by IS6 elements, a mercury resistance and a macrolide 2′-phosphotransferase clusters, ant(3″, aph(3″, aacA4, qnrA1, sul1, and dfrA14 conferring resistance to aminoglycosides, quinolones, sulfonamides, and trimethoprim, respectively, several genes predicted to encode transfer functions and proteins involved in DNA transposition. The acquisition of pIncAC_KP4898 carrying blaV IM-1 and blaSHV -12 contributed to the spread of ST104 K. pneumoniae in the NICU of V. Monaldi Hospital in Naples.

  14. Comparative metagenomic analysis of plasmid encoded functions in the human gut microbiome

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    Marchesi Julian R

    2010-01-01

    Full Text Available Abstract Background Little is known regarding the pool of mobile genetic elements associated with the human gut microbiome. In this study we employed the culture independent TRACA system to isolate novel plasmids from the human gut microbiota, and a comparative metagenomic analysis to investigate the distribution and relative abundance of functions encoded by these plasmids in the human gut microbiome. Results Novel plasmids were acquired from the human gut microbiome, and homologous nucleotide sequences with high identity (>90% to two plasmids (pTRACA10 and pTRACA22 were identified in the multiple human gut microbiomes analysed here. However, no homologous nucleotide sequences to these plasmids were identified in the murine gut or environmental metagenomes. Functions encoded by the plasmids pTRACA10 and pTRACA22 were found to be more prevalent in the human gut microbiome when compared to microbial communities from other environments. Among the most prevalent functions identified was a putative RelBE toxin-antitoxin (TA addiction module, and subsequent analysis revealed that this was most closely related to putative TA modules from gut associated bacteria belonging to the Firmicutes. A broad phylogenetic distribution of RelE toxin genes was observed in gut associated bacterial species (Firmicutes, Bacteroidetes, Actinobacteria and Proteobacteria, but no RelE homologues were identified in gut associated archaeal species. We also provide indirect evidence for the horizontal transfer of these genes between bacterial species belonging to disparate phylogenetic divisions, namely Gram negative Proteobacteria and Gram positive species from the Firmicutes division. Conclusions The application of a culture independent system to capture novel plasmids from the human gut mobile metagenome, coupled with subsequent comparative metagenomic analysis, highlighted the unexpected prevalence of plasmid encoded functions in the gut microbial ecosystem. In

  15. Copper Resistance of the Emerging Pathogen Acinetobacter baumannii.

    Science.gov (United States)

    Williams, Caitlin L; Neu, Heather M; Gilbreath, Jeremy J; Michel, Sarah L J; Zurawski, Daniel V; Merrell, D Scott

    2016-10-15

    Acinetobacter baumannii is an important emerging pathogen that is capable of causing many types of severe infection, especially in immunocompromised hosts. Since A. baumannii can rapidly acquire antibiotic resistance genes, many infections are on the verge of being untreatable, and novel therapies are desperately needed. To investigate the potential utility of copper-based antibacterial strategies against Acinetobacter infections, we characterized copper resistance in a panel of recent clinical A. baumannii isolates. Exposure to increasing concentrations of copper in liquid culture and on solid surfaces resulted in dose-dependent and strain-dependent effects; levels of copper resistance varied broadly across isolates, possibly resulting from identified genotypic variation among strains. Examination of the growth-phase-dependent effect of copper on A. baumannii revealed that resistance to copper increased dramatically in stationary phase. Moreover, A. baumannii biofilms were more resistant to copper than planktonic cells but were still susceptible to copper toxicity. Exposure of bacteria to subinhibitory concentrations of copper allowed them to better adapt to and grow in high concentrations of copper; this copper tolerance response is likely achieved via increased expression of copper resistance mechanisms. Indeed, genomic analysis revealed numerous putative copper resistance proteins that share amino acid homology to known proteins in Escherichia coli and Pseudomonas aeruginosa Transcriptional analysis revealed significant upregulation of these putative copper resistance genes following brief copper exposure. Future characterization of copper resistance mechanisms may aid in the search for novel antibiotics against Acinetobacter and other highly antibiotic-resistant pathogens. Acinetobacter baumannii causes many types of severe nosocomial infections; unfortunately, some isolates have acquired resistance to almost every available antibiotic, and treatment options

  16. Copper Resistance of the Emerging Pathogen Acinetobacter baumannii

    Science.gov (United States)

    Williams, Caitlin L.; Neu, Heather M.; Gilbreath, Jeremy J.; Michel, Sarah L. J.; Zurawski, Daniel V.

    2016-01-01

    ABSTRACT Acinetobacter baumannii is an important emerging pathogen that is capable of causing many types of severe infection, especially in immunocompromised hosts. Since A. baumannii can rapidly acquire antibiotic resistance genes, many infections are on the verge of being untreatable, and novel therapies are desperately needed. To investigate the potential utility of copper-based antibacterial strategies against Acinetobacter infections, we characterized copper resistance in a panel of recent clinical A. baumannii isolates. Exposure to increasing concentrations of copper in liquid culture and on solid surfaces resulted in dose-dependent and strain-dependent effects; levels of copper resistance varied broadly across isolates, possibly resulting from identified genotypic variation among strains. Examination of the growth-phase-dependent effect of copper on A. baumannii revealed that resistance to copper increased dramatically in stationary phase. Moreover, A. baumannii biofilms were more resistant to copper than planktonic cells but were still susceptible to copper toxicity. Exposure of bacteria to subinhibitory concentrations of copper allowed them to better adapt to and grow in high concentrations of copper; this copper tolerance response is likely achieved via increased expression of copper resistance mechanisms. Indeed, genomic analysis revealed numerous putative copper resistance proteins that share amino acid homology to known proteins in Escherichia coli and Pseudomonas aeruginosa. Transcriptional analysis revealed significant upregulation of these putative copper resistance genes following brief copper exposure. Future characterization of copper resistance mechanisms may aid in the search for novel antibiotics against Acinetobacter and other highly antibiotic-resistant pathogens. IMPORTANCE Acinetobacter baumannii causes many types of severe nosocomial infections; unfortunately, some isolates have acquired resistance to almost every available antibiotic

  17. Spectroscopy of Cu(II)-PcoC and the multicopper oxidase function of PcoA, two essential components of Escherichia coli pco copper resistance operon.

    Science.gov (United States)

    Huffman, David L; Huyett, Jennifer; Outten, F Wayne; Doan, Peter E; Finney, Lydia A; Hoffman, Brian M; O'Halloran, Thomas V

    2002-08-06

    The plasmid-encoded pco copper resistance operon in Escherichia coli consists of seven genes that are expressed from two pco promoters in response to elevated copper; however, little is known about how they mediate resistance to excess environmental copper. Two of the genes encode the soluble periplasmic proteins PcoA and PcoC. We show here that inactivation of PcoC, and PcoA to a lesser extent, causes cells to become more sensitive to copper than wild-type nonresistant strains, consistent with a tightly coupled detoxification pathway. Periplasmic extracts show copper-inducible oxidase activity, attributed to the multicopper oxidase function of PcoA. PcoC, a much smaller protein than PcoA, binds one Cu(II) and exhibits a weak electronic transition characteristic of a type II copper center. ENDOR and ESEEM spectroscopy of Cu(II)-PcoC and the (15)N- and Met-CD(3)-labeled samples are consistent with a tetragonal ligand environment of three nitrogens and one aqua ligand "in the plane". A weakly associated S-Met and aqua are likely axial ligands. At least one N is a histidine and is likely trans to the in-plane aqua ligand. The copper chemistry of PcoC and the oxidase function of PcoA are consistent with the emerging picture of the chromosomally encoded copper homeostasis apparatus in the E. coli cell envelope [Outten, F. W., Huffman, D. L., Hale, J. A., and O'Halloran, T. V. (2001) J. Biol. Chem. 276, 30670-30677]. We propose a model for the plasmid system in which Cu(I)-PcoC functions in this copper efflux pathway as a periplasmic copper binding protein that docks with the multiple repeats of Met-rich domains in PcoA to effect oxidation of Cu(I) to the less toxic Cu(II) form. The solvent accessibility of the Cu(II) in PcoC may allow for metal transfer to other plasmid and chromosomal factors and thus facilitate removal of Cu(II) from the cell envelope.

  18. Copper-resistant bacteria enhance plant growth and copper phytoextraction.

    Science.gov (United States)

    Yang, Renxiu; Luo, Chunling; Chen, Yahua; Wang, Guiping; Xu, Yue; Shen, Zhenguo

    2013-01-01

    In this study, we investigated the role of rhizospheric bacteria in solubilizing soil copper (Cu) and promoting plant growth. The Cu-resistant bacterium DGS6 was isolated from a natural Cu-contaminated soil and was identified as Pseudomonas sp. DGS6. This isolate solubilized Cu in Cu-contaminated soil and stimulated root elongation of maize and sunflower. Maize was more sensitive to inoculation with DGS6 than was sunflower and exhibited greater root elongation. In pot experiment, inoculation with DGS6 increased the shoot dry weight of maize by 49% and sunflower by 34%, and increased the root dry weight of maize by 85% and sunflower by 45%. Although the concentrations of Cu in inoculated and non-inoculated seedlings did not differ significantly, the total accumulation of Cu in the plants increased after inoculation. DGS6 showed a high ability to solubilize P and produce iron-chelating siderophores, as well as significantly improved the accumulation of P and Fe in both maize and sunflower shoots. In addition, DGS6 produced indole-3-acetic acid (IAA) and ACC deaminase, which suggests that it may modulate ethylene levels in plants. The bacterial strain DGS6 could be a good candidate for re-vegetation of Cu-contaminated sites. Supplemental materials are available for this article. Go to the publisher's online edition of International Journal of Phytoremediation to view the supplemental file.

  19. Corrosion resistance of copper canister weld material

    International Nuclear Information System (INIS)

    Gubner, Rolf; Andersson, Urban

    2007-03-01

    The proposed design for a final repository for spent fuel and other long-lived residues is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast iron insert fitted inside a copper canister. SKB has since several years developed manufacturing processes for the canister components using a network of manufacturers. For the encapsulation process SKB has built the Canister Laboratory to demonstrate and develop the encapsulation technique in full scale. The critical part of the encapsulation of spent fuel is the sealing of the canister which is done by welding the copper lid to the cylindrical part of the canister. Two welding techniques have been developed in parallel, Electron Beam Welding (EBW) and Friction Stir Welding (FSW). During the past two decades, SKB has developed the technology EBW at The Welding Institute (TWI) in Cambridge, UK. The development work at the Canister Laboratory began in 1999. In electron beam welding, a gun is used to generate the electron beam which is aimed at the joint. The beam heats up the material to the melting point allowing a fusion weld to be formed. The gun was developed by TWI and has a unique design for use at reduced pressure. The system has gone through a number of improvements under the last couple of years including implementation of a beam oscillation system. However, during fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow they will tend to concentrate impurities at the new grain boundaries that might pose adverse effects on the corrosion resistance of welds. As a new method for joining, SKB has been developing friction stir welding (FSW) for sealing copper canisters for spent nuclear fuel in cooperation with TWI since 1997. FSW was invented in 1991 at TWI and is a thermo

  20. Corrosion resistance of copper canister weld material

    Energy Technology Data Exchange (ETDEWEB)

    Gubner, Rolf; Andersson, Urban [Corrosion and Metals Research Institute, Sto ckholm (Sweden)

    2007-03-15

    The proposed design for a final repository for spent fuel and other long-lived residues is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast iron insert fitted inside a copper canister. SKB has since several years developed manufacturing processes for the canister components using a network of manufacturers. For the encapsulation process SKB has built the Canister Laboratory to demonstrate and develop the encapsulation technique in full scale. The critical part of the encapsulation of spent fuel is the sealing of the canister which is done by welding the copper lid to the cylindrical part of the canister. Two welding techniques have been developed in parallel, Electron Beam Welding (EBW) and Friction Stir Welding (FSW). During the past two decades, SKB has developed the technology EBW at The Welding Institute (TWI) in Cambridge, UK. The development work at the Canister Laboratory began in 1999. In electron beam welding, a gun is used to generate the electron beam which is aimed at the joint. The beam heats up the material to the melting point allowing a fusion weld to be formed. The gun was developed by TWI and has a unique design for use at reduced pressure. The system has gone through a number of improvements under the last couple of years including implementation of a beam oscillation system. However, during fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow they will tend to concentrate impurities at the new grain boundaries that might pose adverse effects on the corrosion resistance of welds. As a new method for joining, SKB has been developing friction stir welding (FSW) for sealing copper canisters for spent nuclear fuel in cooperation with TWI since 1997. FSW was invented in 1991 at TWI and is a thermo

  1. A plasmid-encoded UmuD homologue regulates expression of Pseudomonas aeruginosa SOS genes.

    Science.gov (United States)

    Díaz-Magaña, Amada; Alva-Murillo, Nayeli; Chávez-Moctezuma, Martha P; López-Meza, Joel E; Ramírez-Díaz, Martha I; Cervantes, Carlos

    2015-07-01

    The Pseudomonas aeruginosa plasmid pUM505 contains the umuDC operon that encodes proteins similar to error-prone repair DNA polymerase V. The umuC gene appears to be truncated and its product is probably not functional. The umuD gene, renamed umuDpR, possesses an SOS box overlapped with a Sigma factor 70 type promoter; accordingly, transcriptional fusions revealed that the umuDpR gene promoter is activated by mitomycin C. The predicted sequence of the UmuDpR protein displays 23 % identity with the Ps. aeruginosa SOS-response LexA repressor. The umuDpR gene caused increased MMC sensitivity when transferred to the Ps. aeruginosa PAO1 strain. As expected, PAO1-derived knockout lexA-  mutant PW6037 showed resistance to MMC; however, when the umuDpR gene was transferred to PW6037, MMC resistance level was reduced. These data suggested that UmuDpR represses the expression of SOS genes, as LexA does. To test whether UmuDpR exerts regulatory functions, expression of PAO1 SOS genes was evaluated by reverse transcription quantitative PCR assays in the lexA-  mutant with or without the pUC_umuD recombinant plasmid. Expression of lexA, imuA and recA genes increased 3.4-5.3 times in the lexA-  mutant, relative to transcription of the corresponding genes in the lexA+ strain, but decreased significantly in the lexA- /umuDpR transformant. These results confirmed that the UmuDpR protein is a repressor of Ps. aeruginosa SOS genes controlled by LexA. Electrophoretic mobility shift assays, however, did not show binding of UmuDpR to 5' regions of SOS genes, suggesting an indirect mechanism of regulation.

  2. A plasmid-encoded nicotinamidase (PncA) is essential for infectivity of Borrelia burgdorferi in a mammalian host.

    Science.gov (United States)

    Purser, Joye E; Lawrenz, Matthew B; Caimano, Melissa J; Howell, Jerrilyn K; Radolf, Justin D; Norris, Steven J

    2003-05-01

    Borrelia burgdorferi, a spirochaete that causes Lyme borreliosis, contains 21 linear and circular plasmids thought to be important for survival in mammals or ticks. Our results demonstrate that the gene BBE22 encoding a nicotinamidase is capable of replacing the requirement for the 25 kb linear plasmid lp25 during mammalian infection. Transformation of B. burgdorferi lacking lp25 with a shuttle vector containing the lp25 gene BBE22 (pBBE22) restored infectivity in mice to a level comparable to that of wild-type Borrelia. This complementation also restored the growth and host adaptation of lp25-B. burgdorferi in dialysis membrane chambers (DMCs) implanted in rats. A single Cys to Ala conversion at the putative active site of BBE22 abrogated the ability of pBBE22 to re-establish infectivity or growth in DMCs. Additional Salmonella typhimurium complementation studies and enzymatic analysis demonstrated that the BBE22 gene product has nicotinamidase activity and is most probably required for the biosynthesis of NAD. These results indicate that some plasmid-encoded products fulfil physiological functions required in the enzootic cycle of pathogenic Borrelia.

  3. Extended-Spectrum-Beta-Lactamase- and Plasmid-Encoded Cephamycinase-Producing Enterobacteria in the Broiler Hatchery as a Potential Mode of Pseudo-Vertical Transmission.

    Science.gov (United States)

    Projahn, Michaela; Daehre, Katrin; Roesler, Uwe; Friese, Anika

    2017-01-01

    Antimicrobial resistance through extended-spectrum beta-lactamases (ESBLs) and transferable (plasmid-encoded) cephamycinases (pAmpCs) represents an increasing problem in human and veterinary medicine. The presence of ESBL-/pAmpC-producing commensal enterobacteria in farm animals, such as broiler chickens, is considered one possible source of food contamination and could therefore also be relevant for human colonization. Studies on transmission routes along the broiler production chain showed that 1-day-old hatchlings are already affected. In this study, ESBL-/pAmpC-positive broiler parent flocks and their corresponding eggs, as well as various environmental and air samples from the hatchery, were analyzed. The eggs were investigated concerning ESBL-/pAmpC-producing enterobacteria on the outer eggshell surface (before/after disinfection), the inner eggshell surface, and the egg content. Isolates were analyzed concerning their species, their phylogroup in the case of Escherichia coli strains, the respective resistance genes, and the phenotypical antibiotic resistance. Of the tested eggs, 0.9% (n = 560) were contaminated on their outer shell surface. Further analyses using pulsed-field gel electrophoresis showed a relationship of these strains to those isolated from the corresponding parent flocks, which demonstrates a pseudo-vertical transfer of ESBL-/pAmpC-producing enterobacteria into the hatchery. Resistant enterobacteria were also found in environmental samples from the hatchery, such as dust or surfaces which could pose as a possible contamination source for the hatchlings. All 1-day-old chicks tested negative directly after hatching. The results show a possible entry of ESBL-/pAmpC-producing enterobacteria from the parent flocks into the hatchery; however, the impact of the hatchery on colonization of the hatchlings seems to be low. ESBL-/pAmpC-producing enterobacteria occur frequently in broiler-fattening farms. Recent studies investigated the prevalence and

  4. Electroerosion resistance of tungsten-copper and molybdenum-copper pseudoalloys

    International Nuclear Information System (INIS)

    Nerus, L.N.; Verkhoturov, A.D.; Marek, B.A.; Mukha, I.M.

    1977-01-01

    Results of the study of electroerosion resistance of W-Cu and Mo-Cu pseudoalloys in a wide range of concentrations are presented. Tungsten alloys with 10-20% copper and pure molybdenum have exhibited the best erosion resistance at electrospark machining

  5. Copper oxide resistive switching memory for e-textile

    Directory of Open Access Journals (Sweden)

    Jin-Woo Han

    2011-09-01

    Full Text Available A resistive switching memory suitable for integration into textiles is demonstrated on a copper wire network. Starting from copper wires, a Cu/CuxO/Pt sandwich structure is fabricated. The active oxide film is produced by simple thermal oxidation of Cu in atmospheric ambient. The devices display a resistance switching ratio of 102 between the high and low resistance states. The memory states are reversible and retained over 107 seconds, with the states remaining nondestructive after multiple read operations. The presented device on the wire network can potentially offer a memory for integration into smart textile.

  6. COPPER RESISTANT STRAIN CANDIDA TROPICALIS RomCu5 INTERACTION WITH SOLUBLE AND INSOLUBLE COPPER COMPOUNDS

    Directory of Open Access Journals (Sweden)

    Ie. P. Prekrasna

    2015-10-01

    Full Text Available The focus of the study was interaction of Candida tropicalis RomCu5 isolated from highland Ecuador ecosystem with soluble and insoluble copper compounds. Strain C. tropicalis RomCu5 was cultured in a liquid medium of Hiss in the presence of soluble (copper citrate and CuCl2 and insoluble (CuO and CuCO3 copper compounds. The biomass growth was determined by change in optical density of culture liquid, composition of the gas phase was measured on gas chromatograph, redox potential and pH of the culture fluid was defined potentiometrically. The concentration of soluble copper compounds was determined colorimetrically. Maximal permissible concentration of Cu2+ for C. tropicalis RomCu5 was 30 000 ppm of Cu2+ in form of copper citrate and 500 ppm of Cu2+ in form of CuCl2. C. tropicalis was metabolically active at super high concentrations of Cu2+, despite the inhibitory effect of Cu2+. C. tropicalis immobilized Cu2+ in the form of copper citrate and CuCl2 by it accumulation in the biomass. Due to medium acidification C. tropicalis dissolved CuO and CuCO3. High resistance of C. tropicalis to Cu2+ and ability to interact with soluble and insoluble copper compounds makes it biotechnologically perspective.

  7. Plasmid-Mediated Resistance in Enterobacteriaceae Changing Landscape and Implications for Therapy

    NARCIS (Netherlands)

    Schultsz, Constance; Geerlings, Suzanne

    2012-01-01

    Antimicrobial resistance is increasing worldwide, and pathogenic microorganism's that are resistant to all available antimicrobial agents are increasingly reported. Emerging plasmid-encoded extended-spectrum beta-lactamases (ESBLs) and carbapenemases are increasingly reported worldwide.

  8. Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria

    DEFF Research Database (Denmark)

    Elguindi, J; Moffitt, S; Hasman, Henrik

    2010-01-01

    of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper...... on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells, which contributed directly to bacterial killing....

  9. X-ray crystal structure of the passenger domain of plasmid encoded toxin(Pet), an autotransporter enterotoxin from enteroaggregative Escherichia coli (EAEC)

    Energy Technology Data Exchange (ETDEWEB)

    Domingo Meza-Aguilar, J. [Departamento de Salud Pública Facultad de Medicina UNAM, Ciudad Universitaria Coyoacán 04510, D.F. (Mexico); Laboratorio de Patogenicidad Bacteriana, Unidad de Hemato Oncología e Investigación, Hospital Infantil de México Federico Gómez 06720, D.F. (Mexico); Fromme, Petra [Department of Chemistry and Biochemistry, Arizona State University, Physical Sciences BLDG D-102, Tempe, AZ 85287 (United States); Torres-Larios, Alfredo [Instituto de Fisiología Celular UNAM, Ciudad Universitaria Coyoacán 04510, D.F. (Mexico); Mendoza-Hernández, Guillermo [Instituto de Química UNAM, Ciudad Universitaria Coyoacán 04510, D.F (Mexico); Hernandez-Chiñas, Ulises [Departamento de Salud Pública Facultad de Medicina UNAM, Ciudad Universitaria Coyoacán 04510, D.F. (Mexico); Laboratorio de Patogenicidad Bacteriana, Unidad de Hemato Oncología e Investigación, Hospital Infantil de México Federico Gómez 06720, D.F. (Mexico); Arreguin-Espinosa de los Monteros, Roberto A. [Instituto de Química UNAM, Ciudad Universitaria Coyoacán 04510, D.F (Mexico); and others

    2014-03-07

    Highlights: • X-ray crystal structure of the passenger domain of Plasmid encoded toxin at 2.3 Å. • Structural differences between Pet passenger domain and EspP protein are described. • High flexibility of the C-terminal beta helix is structurally assigned. - Abstract: Autotransporters (ATs) represent a superfamily of proteins produced by a variety of pathogenic bacteria, which include the pathogenic groups of Escherichia coli (E. coli) associated with gastrointestinal and urinary tract infections. We present the first X-ray structure of the passenger domain from the Plasmid-encoded toxin (Pet) a 100 kDa protein at 2.3 Å resolution which is a cause of acute diarrhea in both developing and industrialized countries. Pet is a cytoskeleton-altering toxin that induces loss of actin stress fibers. While Pet (pdb code: 4OM9) shows only a sequence identity of 50% compared to the closest related protein sequence, extracellular serine protease plasmid (EspP) the structural features of both proteins are conserved. A closer structural look reveals that Pet contains a β-pleaded sheet at the sequence region of residues 181–190, the corresponding structural domain in EspP consists of a coiled loop. Secondary, the Pet passenger domain features a more pronounced beta sheet between residues 135 and 143 compared to the structure of EspP.

  10. Effects of Copper Addition on Copper Resistance, Antibiotic Resistance Genes, and intl1 during Swine Manure Composting

    Science.gov (United States)

    Yin, Yanan; Gu, Jie; Wang, Xiaojuan; Song, Wen; Zhang, Kaiyu; Sun, Wei; Zhang, Xin; Zhang, Yajun; Li, Haichao

    2017-01-01

    Copper is one of the most abundant heavy metals present in swine manure. In this study, a laboratory-scale aerobic composting system was amended with Cu at three levels (0, 200, and 2000 mg kg-1, i.e., control, Cu200, and Cu2000 treatments, respectively) to determine its effect on the fate of copper resistance genes [copper resistance genes (CRGs): pcoA, cusA, copA, and tcrB], antibiotic resistance genes [antibiotic resistance genes (ARGs): erm(A) and erm(B)], and intl1. The results showed that the absolute abundances of pcoA, tcrB, erm(A), erm(B), and intl1 were reduced, whereas those of copA and cusA increased after swine manure composting. Redundancy analysis showed that temperature significantly affected the variations in CRGs, ARGs, and intl1. The decreases in CRGs, ARGs, and intI1 were positively correlated with the exchangeable Cu levels. The bacterial community could be grouped according to the composting time under different treatments, where the high concentration of copper had a more persistent effect on the bacterial community. Network analysis determined that the co-occurrence of CRGs, ARGs, and intI1, and the bacterial community were the main contributors to the changes in CRGs, ARG, and intl1. Thus, temperature, copper, and changes in the bacterial community composition had important effects on the variations in CRGs, ARGs, and intl1 during manure composting in the presence of added copper. PMID:28316595

  11. Resistivity of epitaxial copper nanolines with trapezoidal cross-section

    International Nuclear Information System (INIS)

    Lu, Zonghuan; Frey, David M.; Merkh, Thomas; Lord, Robert; Washington, Morris A.; Lu, Toh-Ming

    2016-01-01

    The resistivity of epitaxial Cu nanolines with line width ranging from 20 to 180 nm and line height from 40 to 50 nm was measured using a four-point probe technique. The Cu nanolines were fabricated using ebeam lithography with a polymethyl methacrylate bilayer resist system for improved line edge smoothness. The cross-section profile of the lines was examined using the focused ion beam milling technique. The results indicate that the cross-section should be more accurately described as trapezoidal rather than as rectangular. Using the trapezoidal profile, the electrical resistivity was calculated from the measured resistance data. Modeling based on the Fuchs–Sondheimer (FS) theory using the trapezoidal profile was also carried out. The results were compared with the experimentally calculated resistivity data. For Cu lines with line width less than 30 nm, the measured resistivity was shown to be up to 20% higher than the value predicted by the FS theory. Further examination of Cu lines using atomic force microscopy and scanning electron microscopy was conducted to extract the surface roughness and line edge roughness information. Their contribution to the resistivity increase was estimated to be only up to 3% for the Cu nanolines fabricated, which did not significantly contribute to the overall resistivity for Cu lines with line width less than 30 nm. Other possible factors affecting the resistivity of the Cu nanolines were also discussed, including the oxide formation on the surface of the Cu lines. - Highlights: • Epitaxial copper nanolines were fabricated using ebeam lithography. • The effect of line cross-section profiles on electrical resistivity was studied. • Trapezoidal cross−section gives better resistivity estimation for lines down to 20 nm. • Impact of surface roughness and line edge roughness to resistivity is small. • Oxidization layer has an effect on the resistivity increase.

  12. Field dependent surface resistance of niobium on copper cavities

    Directory of Open Access Journals (Sweden)

    T. Junginger

    2015-07-01

    Full Text Available The surface resistance R_{S} of superconducting cavities prepared by sputter coating a niobium film on a copper substrate increases significantly stronger with the applied rf field compared to cavities of bulk material. A possible cause is that the thermal boundary resistance between the copper substrate and the niobium film induces heating of the inner cavity wall, resulting in a higher R_{S}. Introducing helium gas in the cavity, and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by less than 120 mK when R_{S} increases with E_{acc} by 100  nΩ. This is more than one order of magnitude less than what one would expect from global heating. Additionally, the effects of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for the current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered R_{S}.

  13. Improvement of oxidation resistance of copper by atomic layer deposition

    Energy Technology Data Exchange (ETDEWEB)

    Chang, M.L.; Cheng, T.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 106, Taiwan (China); Lin, M.C. [Research Center for Biomedical Devices and Prototyping Production, Taipei Medical University, No. 250, Wu-Hsing Street, Taipei 110, Taiwan (China); Lin, H.C., E-mail: hclinntu@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 106, Taiwan (China); Chen, M.J., E-mail: mjchen@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 106, Taiwan (China)

    2012-10-01

    Graphical abstract: Results of glancing incident angle diffraction (GIXD) show the bare-Cu specimen was attacked by oxidation, whereas the coated-Cu specimens prevented from this problem. Highlights: Black-Right-Pointing-Pointer Deposition of Al{sub 2}O{sub 3} films on pure copper by an atomic layer deposition (ALD) technique. Black-Right-Pointing-Pointer Analysis of properties of the films coated at various substrate temperatures using the ALD technique. Black-Right-Pointing-Pointer Identification of the improvement of oxidation resistance of pure copper by the ALD-Al{sub 2}O{sub 3} films. Black-Right-Pointing-Pointer Assessment of the durability of the ALD-Al{sub 2}O{sub 3} films by adhesion strength. - Abstract: Al{sub 2}O{sub 3} films were deposited by the atomic layer deposition (ALD) technique onto pure copper at temperatures in the range 100-200 Degree-Sign C. The chemical composition, microstructure, and mechanic properties of the ALD-deposited Al{sub 2}O{sub 3} films were systematically analyzed. The variations in the film characteristics with substrate temperature were observed. Oxidation trials revealed that 20-nm-thick Al{sub 2}O{sub 3} films deposited at a substrate temperature as low as 100 Degree-Sign C suppress oxidative attack on pure copper. The Al{sub 2}O{sub 3} films also showed excellent durability of adhesion strength, according to predictions using the Coffin-Manson model based on the results of accelerated temperature cycling tests. These features indicate that ALD-deposited Al{sub 2}O{sub 3} film is a very promising candidate to be a protective coating for pure copper.

  14. Limited Dissemination of Extended-Spectrum β-Lactamase- and Plasmid-Encoded AmpC-Producing Escherichia coli from Food and Farm Animals, Sweden.

    Science.gov (United States)

    Börjesson, Stefan; Ny, Sofia; Egervärn, Maria; Bergström, Jakob; Rosengren, Åsa; Englund, Stina; Löfmark, Sonja; Byfors, Sara

    2016-04-01

    Extended-spectrum β-lactamase (ESBL)- and plasmid-encoded ampC (pAmpC)-producing Enterobacteriaceae might spread from farm animals to humans through food. However, most studies have been limited in number of isolates tested and areas studied. We examined genetic relatedness of 716 isolates from 4,854 samples collected from humans, farm animals, and foods in Sweden to determine whether foods and farm animals might act as reservoirs and dissemination routes for ESBL/pAmpC-producing Escherichia coli. Results showed that clonal spread to humans appears unlikely. However, we found limited dissemination of genes encoding ESBL/pAmpC and plasmids carrying these genes from foods and farm animals to healthy humans and patients. Poultry and chicken meat might be a reservoir and dissemination route to humans. Although we found no evidence of clonal spread of ESBL/pAmpC-producing E. coli from farm animals or foods to humans, ESBL/pAmpC-producing E. coli with identical genes and plasmids were present in farm animals, foods, and humans.

  15. CopM is a novel copper-binding protein involved in copper resistance in Synechocystis sp. PCC 6803

    Science.gov (United States)

    Giner-Lamia, Joaquín; López-Maury, Luis; Florencio, Francisco J

    2015-01-01

    Copper resistance system in the cyanobacterium Synechocystis sp. PCC 6803 comprises two operons, copMRS and copBAC, which are expressed in response to copper in the media. copBAC codes for a heavy-metal efflux–resistance nodulation and division (HME-RND) system, while copMRS codes for a protein of unknown function, CopM, and a two-component system CopRS, which controls the expression of these two operons. Here, we report that CopM is a periplasmic protein able to bind Cu(I) with high affinity (KD ∼3 × 10−16). Mutants lacking copM showed a sensitive copper phenotype similar to mutants affected in copB, but lower than mutants of the two-component system CopRS, suggesting that CopBAC and CopM constitute two independent resistance mechanisms. Moreover, constitutive expression of copM is able to partially suppress the copper sensitivity of the copR mutant strain, pointing out that CopM per se is able to confer copper resistance. Furthermore, constitutive expression of copM was able to reduce total cellular copper content of the copR mutant to the levels determined in the wild-type (WT) strain. Finally, CopM was localized not only in the periplasm but also in the extracellular space, suggesting that CopM can also prevent copper accumulation probably by direct copper binding outside the cell. PMID:25545960

  16. Reliability of copper based alloys for electric resistance spot welding

    International Nuclear Information System (INIS)

    Jovanovicj, M.; Mihajlovicj, A.; Sherbedzhija, B.

    1977-01-01

    Durability of copper based alloys (B-5 and B-6) for electric resistance spot-welding was examined. The total amount of Be, Ni and Zr was up to 2 and 1 wt.% respectively. Good durability and satisfactory quality of welded spots were obtained in previous laboratory experiments carried out on the fixed spot-welding machine of an industrial type (only B-5 alloy was examined). Electrodes made of both B-5 and B-6 alloy were tested on spot-welding grips and fixed spot-welding machines in Tvornica automobila Sarajevo (TAS). The obtained results suggest that the durability of electrodes made of B-5 and B-6 alloys is more than twice better than of that used in TAS

  17. Accumulation and resistance to copper of two biotypes of Cynodon dactylon.

    Science.gov (United States)

    Wang, Youbao; Zhang, Li; Yao, Jing; Huang, Yongjie; Yan, Mi

    2009-04-01

    The effects of copper accumulation and resistance in two biotypes of Cynodon dactylon were studied. Results showed that at a low concentration of copper (Cynodon dactylon was generally unaffected. As copper concentration increased, negative effects on the growth of Cynodon dactylon became apparent. The critical concentration at which the plant exhibited poisoning symptoms was different for the two biotypes of Cynodon dactylon. At 500 mg/kg copper concentration in soil, the biotype from the polluted area showed significantly higher tolerance of copper than the biotype from the unpolluted area.

  18. Multi-polar resistance switching and memory effect in copper phthalocyanine junctions

    International Nuclear Information System (INIS)

    Qiao Shi-Zhu; Kang Shi-Shou; Li Qiang; Zhong Hai; Kang Yun; Yu Shu-Yun; Han Guang-Bing; Yan Shi-Shen; Mei Liang-Mo; Qin Yu-Feng

    2014-01-01

    Copper phthalocyanine junctions, fabricated by magnetron sputtering and evaporating methods, show multi-polar (unipolar and bipolar) resistance switching and the memory effect. The multi-polar resistance switching has not been observed simultaneously in one organic material before. With both electrodes being cobalt, the unipolar resistance switching is universal. The high resistance state is switched to the low resistance state when the bias reaches the set voltage. Generally, the set voltage increases with the thickness of copper phthalocyanine and decreases with increasing dwell time of bias. Moreover, the low resistance state could be switched to the high resistance state by absorbing the phonon energy. The stability of the low resistance state could be tuned by different electrodes. In Au/copper phthalocyanine/Co system, the low resistance state is far more stable, and the bipolar resistance switching is found. Temperature dependence of electrical transport measurements demonstrates that there are no obvious differences in the electrical transport mechanism before and after the resistance switching. They fit quite well with Mott variable range hopping theory. The effect of Al 2 O 3 on the resistance switching is excluded by control experiments. The holes trapping and detrapping in copper phthalocyanine layer are responsible for the resistance switching, and the interfacial effect between electrodes and copper phthalocyanine layer affects the memory effect. (interdisciplinary physics and related areas of science and technology)

  19. Contribution of plasmid-encoded peptidase S8 (PrtP) to adhesion and transit in the gut of Lactococcus lactis IBB477 strain.

    Science.gov (United States)

    Radziwill-Bienkowska, Joanna Maria; Robert, Véronique; Drabot, Karolina; Chain, Florian; Cherbuy, Claire; Langella, Philippe; Thomas, Muriel; Bardowski, Jacek Karol; Mercier-Bonin, Muriel; Kowalczyk, Magdalena

    2017-07-01

    The ability of Lactococcus lactis to adhere to the intestinal mucosa can potentially prolong the contact with the host, and therefore favour its persistence in the gut. In the present study, the contribution of plasmid-encoded factors to the adhesive and transit properties of the L. lactis subsp. cremoris IBB477 strain was investigated. Plasmid-cured derivatives as well as deletion mutants were obtained and analysed. Adhesion tests were performed using non-coated polystyrene plates, plates coated with mucin or fibronectin and mucus-secreting HT29-MTX intestinal epithelial cells. The results indicate that two plasmids, pIBB477a and b, are involved in adhesion of the IBB477 strain. One of the genes localised on plasmid pIBB477b (AJ89_14230), which encodes cell wall-associated peptidase S8 (PrtP), mediates adhesion of the IBB477 strain to bare, mucin- and fibronectin-coated polystyrene, as well as to HT29-MTX cells. Interactions between bacteria and mucus secreted by HT29-MTX cells were further investigated by fluorescent staining and confocal microscopy. Confocal images showed that IBB477 forms dense clusters embedded in secreted mucus. Finally, the ability of IBB477 strain and its ΔprtP deletion mutant to colonise the gastrointestinal tract of conventional C57Bl/6 mice was determined. Both strains were present in the gut for up to 72 h. In summary, adhesion and persistence of IBB477 were analysed by in vitro and in vivo approaches, respectively. Our studies revealed that plasmidic genes encoding cell surface proteins are more involved in the adhesion of IBB477 strain than in the ability to confer a selective advantage in the gut.

  20. Direct patterning of highly-conductive graphene@copper composites using copper naphthenate as a resist for graphene device applications.

    Science.gov (United States)

    Bi, Kaixi; Xiang, Quan; Chen, Yiqin; Shi, Huimin; Li, Zhiqin; Lin, Jun; Zhang, Yongzhe; Wan, Qiang; Zhang, Guanhua; Qin, Shiqiao; Zhang, Xueao; Duan, Huigao

    2017-11-09

    We report an electron-beam lithography process to directly fabricate graphene@copper composite patterns without involving metal deposition, lift-off and etching processes using copper naphthenate as a high-resolution negative-tone resist. As a commonly used industrial painting product, copper naphthenate is extremely cheap with a long shelf time but demonstrates an unexpected patterning resolution better than 10 nm. With appropriate annealing under a hydrogen atmosphere, the produced graphene@copper composite patterns show high conductivity of ∼400 S cm -1 . X-ray diffraction, conformal Raman spectroscopy and X-ray photoelectron spectroscopy were used to analyze the chemical composition of the final patterns. With the properties of high resolution and high conductivity, the patterned graphene@copper composites could be used as conductive pads and interconnects for graphene electronic devices with ohmic contacts. Compared to common fabrication processes involving metal evaporation and lift-off steps, this pattern-transfer-free fabrication process using copper naphthenate resist is direct and simple but allows comparable device performance in practical device applications.

  1. Copper-resistant halophilic bacterium isolated from the polluted Maruit Lake, Egypt.

    Science.gov (United States)

    Osman, O; Tanguichi, H; Ikeda, K; Park, P; Tanabe-Hosoi, S; Nagata, S

    2010-04-01

    To isolate and characterize copper-resistant halophilic bacteria from the polluted Maruit Lake, Egypt and identify the role of plasmids in toxic metal resistance. We isolated strain MA2, showing high copper resistance up to the 1.5 mmol l(-1) concentration; it was also resistant to other metals such as nickel, cobalt and zinc and a group of antibiotics. Partial 16S rRNA analysis revealed that strain MA2 belonged to the genus Halomonas. Copper uptake, measured by atomic absorption spectrophotometery, was higher in the absence of NaCl than in the presence of 0.5-1.0 mol l(-1) NaCl during 5-15 min of incubation. Cell fractionation and electron microscopic observation clarified that most of the copper accumulated in the outer membrane and periplasmic fractions of the cells. Plasmid screening yielded two plasmids: pMA21 (11 kb) and pMA22 (5 kb). Plasmid curing resulted in a strain that lost both the plasmids and was sensitive to cobalt and chromate but not copper, nickel and zinc. This cured strain also showed weak growth in the presence of 0.5-1.0 mol l(-1) NaCl. Partial sequencing of both plasmids led to the identification of different toxic metals transporters but copper transporters were not identified. The highest cell viability was found in the presence of 1.0 mol l(-1) NaCl at different copper concentrations, and copper uptake was optimal in the absence of NaCl. Plasmid pMA21 encoded chromate, cobalt, zinc and cadmium transporters, whereas pMA22 encoded specific zinc and RND (resistance, nodulation, cell division) efflux transporters as well as different kinds of metabolic enzymes. Copper resistance was mainly incorporated in the chromosome. Strain MA2 is a fast and efficient tool for copper bioremediation and the isolated plasmids show significant characteristics of both toxic metal and antibiotic resistance.

  2. Temperature effect on crack resistance and fracture micromechanisms in tungsten-copper pseudoalloy

    International Nuclear Information System (INIS)

    Babak, A.V.; Gopkalo, E.E.; Krasovskij, A.Ya.; Nadezhdin, G.N.; Uskov, E.I.

    1988-01-01

    Results of the mechanical- and-physical study of peculiarities of the tungsten-copper pseudoalloy fracture in the temperature range of 293-2273 K are presented. It is shown that the studied material possesses maximum crack resistance in the vicinity of the upper temperature range boundary of the ductile-brittle transition and minimum resistance to cracks propagation when it contains melted copper. It is established that the peculiarities of changes in crack-resistance correspond to peculiarities of fracture micromechanisms for tungsten-copper pseudoalloy in the studied tempearture range

  3. Assessment of strains of Pseudomonas syringae pv. tomato from Tanzania for resistance to copper and streptomycin

    DEFF Research Database (Denmark)

    Shenge, K.C.; Wydra, K.; Mabagala, M.B.

    2008-01-01

    Fifty-six strains of Pseudomonas syringae pv. tomato (P.s. pv. tomato) were collected from tomato-producing areas in Tanzania and assessed for resistance to copper and antibiotics. The collection was done from three tomato-producing regions (Morogoro, Arusha and Iringa), representing three...... different ecological conditions in the country. After isolation and identification, the P. s. pv. tomato strains were grown on King's medium B (KB) amended with 20% copper sulphate (w/v). The strains were also assessed for resistance to antibiotics. Results indicated that there was widespread resistance...... strains of the pathogen were moderately resistant to copper sulphate, such that 54.0% of them were able to grow on the KB medium amended with 20% (w/v) of the copper compound....

  4. Relationship between copper, glycopeptide, and macrolide resistance among Enterococcus faecium strains isolated from pigs in Denmark between 1997 and 2003

    DEFF Research Database (Denmark)

    Hasman, Henrik; Aarestrup, Frank Møller

    2005-01-01

    A significant relationship between copper resistance (tcrB), glycopeptide resistance (Tn1546), and macrolide resistance [erm(B)] in Enterococcus faecium isolated from pigs was found. The tcrB gene was located closely upstream of the Tn1546 element. However, the continued use of copper sulfate has...... not been able to maintain high levels of macrolide and glycopeptide resistance....

  5. A horizontally gene transferred copper resistance locus confers hyper‐resistance to antibacterial copper toxicity and enables survival of community acquired methicillin resistant Staphylococcus aureus USA300 in macrophages

    Science.gov (United States)

    Purves, Joanne; Thomas, Jamie; Riboldi, Gustavo P.; Zapotoczna, Marta; Tarrant, Emma; Andrew, Peter W.; Londoño, Alejandra; Planet, Paul J.; Geoghegan, Joan A.; Waldron, Kevin J.

    2018-01-01

    Summary Excess copper is highly toxic and forms part of the host innate immune system's antibacterial arsenal, accumulating at sites of infection and acting within macrophages to kill engulfed pathogens. We show for the first time that a novel, horizontally gene transferred copper resistance locus (copXL), uniquely associated with the SCCmec elements of the highly virulent, epidemic, community acquired methicillin resistant Staphylococcus aureus (CA‐MRSA) USA300, confers copper hyper‐resistance. These genes are additional to existing core genome copper resistance mechanisms, and are not found in typical S. aureus lineages, but are increasingly identified in emerging pathogenic isolates. Our data show that CopX, a putative P1B‐3‐ATPase efflux transporter, and CopL, a novel lipoprotein, confer copper hyper‐resistance compared to typical S. aureus strains. The copXL genes form an operon that is tightly repressed in low copper environments by the copper regulator CsoR. Significantly, CopX and CopL are important for S. aureus USA300 intracellular survival within macrophages. Therefore, the emergence of new S. aureus clones with the copXL locus has significant implications for public health because these genes confer increased resistance to antibacterial copper toxicity, enhancing bacterial fitness by altering S. aureus interaction with innate immunity. PMID:29521441

  6. Effects of chlortetracycline and copper supplementation on antimicrobial resistance of fecal Escherichia coli from weaned pigs.

    Science.gov (United States)

    Agga, G E; Scott, H M; Amachawadi, R G; Nagaraja, T G; Vinasco, J; Bai, J; Norby, B; Renter, D G; Dritz, S S; Nelssen, J L; Tokach, M D

    2014-06-01

    Feed-grade chlortetracycline (CTC) and copper are both widely utilized in U.S. pig production. Cluster randomized experiment was conducted to evaluate the effects of CTC and copper supplementation in weaned pigs on antimicrobial resistance (AMR) among fecal Escherichia coli. Four treatment groups: control, copper, CTC, or copper plus CTC were randomly allocated to 32 pens with five pigs per pen. Fecal samples were collected weekly from three pigs per pen for six weeks. Two E. coli isolates per fecal sample were tested for phenotypic and genotypic resistance against antibiotics and copper. Data were analyzed with multilevel mixed effects logistic regression, multivariate probit analysis and discrete time survival analysis. CTC-supplementation was significantly (99% [95% CI=98-100%]) associated with increased tetracycline resistance compared to the control group (95% [95% CI=94-97%]). Copper supplementation was associated with decreased resistance to most of the antibiotics tested, including cephalosporins, over the treatment period. Overall, 91% of the E. coli isolates were multidrug resistant (MDR) (resistant to ≥3 antimicrobial classes). tetA and blaCMY-2 genes were positively associated (PpcoD were negatively associated with MDR. tetA and blaCMY-2 were positively associated with each other and in turn, these were negatively associated with both tetB and pcoD genes; which were also positively associated with one another. Copper minimum inhibitory concentration was not affected by copper supplementation or by pcoD gene carriage. CTC supplementation was significantly associated with increased susceptibilities of E. coli to copper (HR=7 [95% CI=2.5-19.5]) during treatment period. In conclusion, E. coli isolates from the nursery pigs exhibited high levels of antibiotic resistance, with diverse multi-resistant phenotypic profiles. The roles of copper supplementation in pig production, and pco-mediated copper resistance among E. coli in particular, need to be further

  7. Investigation of surface resistance of copper in classical and anomalous skin-effect region

    International Nuclear Information System (INIS)

    Kutovoj, V.A.; Egorov, A.M.

    2008-01-01

    The surface resistance of copper in classical and anomalous skin-effect region has been investigated, and the surface resistance improvement factor equal to the ratio of the surface resistance of copper at room temperature to that of helium temperature, depending on the electromagnetic field frequency, has been determined. The improvement factor has been shown to have inverse power law dependence on frequency. The frequencies at which the improvement factor of copper equals 10 have been determined. It has been found that the quality factor of a resonance high-frequency system made of copper, operating at temperature T ≥ 4.2 K can be increased 10 times or more as against a quality factor of a resonance high-frequency system operating at room temperature

  8. A genomic island provides Acidithiobacillus ferrooxidans ATCC 53993 additional copper resistance: a possible competitive advantage.

    Science.gov (United States)

    Orellana, Luis H; Jerez, Carlos A

    2011-11-01

    There is great interest in understanding how extremophilic biomining bacteria adapt to exceptionally high copper concentrations in their environment. Acidithiobacillus ferrooxidans ATCC 53993 genome possesses the same copper resistance determinants as strain ATCC 23270. However, the former strain contains in its genome a 160-kb genomic island (GI), which is absent in ATCC 23270. This GI contains, amongst other genes, several genes coding for an additional putative copper ATPase and a Cus system. A. ferrooxidans ATCC 53993 showed a much higher resistance to CuSO(4) (>100 mM) than that of strain ATCC 23270 (<25 mM). When a similar number of bacteria from each strain were mixed and allowed to grow in the absence of copper, their respective final numbers remained approximately equal. However, in the presence of copper, there was a clear overgrowth of strain ATCC 53993 compared to ATCC 23270. This behavior is most likely explained by the presence of the additional copper-resistance genes in the GI of strain ATCC 53993. As determined by qRT-PCR, it was demonstrated that these genes are upregulated when A. ferrooxidans ATCC 53993 is grown in the presence of copper and were shown to be functional when expressed in copper-sensitive Escherichia coli mutants. Thus, the reason for resistance to copper of two strains of the same acidophilic microorganism could be determined by slight differences in their genomes, which may not only lead to changes in their capacities to adapt to their environment, but may also help to select the more fit microorganisms for industrial biomining operations. © Springer-Verlag 2011

  9. Characterization of copper resistant ciliates: Potential candidates for ...

    African Journals Online (AJOL)

    Jane

    2011-08-17

    Aug 17, 2011 ... algae (Rehman and Shakoori, 2001), yeast (Shakoori et al., 2005) ... organisms, this study was undertaken to determine the efficiency of ...... copper, mercury and zinc to ciliates from activated sludge plants. Bull. Environ.

  10. Molecular typing of Salmonella typhi strains from Dhaka (Bangladesh) and development of DNA probes identifying plasmid-encoded multidrug-resistant isolates

    NARCIS (Netherlands)

    P.W.M. Hermans (Peter); S.K. Saha; W.J. van Leeuwen (Wibeke); H.A. Verbrugh (Henri); A.F. van Belkum (Alex); W.H.F. Goessens (Wil)

    1996-01-01

    textabstractSeventy-eight Salmonella typhi strains isolated in 1994 and 1995 from patients living in Dhaka, Bangladesh, were subjected to phage typing, ribotyping, IS200 fingerprinting, and PCR fingerprinting. The collection displayed a high degree of genetic

  11. Corrosion resistance of a copper canister for spent nuclear fuel

    International Nuclear Information System (INIS)

    1983-04-01

    The report presents an evaluation of copper as canister material for spent nuclear fuel. The evaluation is made from the viewpoint of corrosion and applies to a concept of 1977. Supplementary corrosion studies have been performed. The report includes 9 appendices which deal with experimental data. (G.B.)

  12. Plasmid Conjugation in E. coli and Drug Resistance | Igwe ...

    African Journals Online (AJOL)

    This study aimed at determining the antibiotics susceptibility pattern of E. coli isolates claimed to be multidrug resistance using disc diffusion method. It also determined the presence of transferable resistance plasmids through conjugation and evaluated the medical significance of plasmid encoding E. coli and drug ...

  13. Damage saturation effects on volume and resistivity changes induced by fission-fragment irradiation of copper

    International Nuclear Information System (INIS)

    Birtcher, R.C.; Blewitt, T.H.

    1981-01-01

    Damage production and saturation has been monitored in copper by simultaneous electrical resistivity- and length-change measurements. Damage was introduced by 235 U fission fragments at either 7 or 85 K. At both temperatures, the resistivity and length changes were linearly related to each other for resistivity changes less than 80% saturation resistivity. The linear relationship was the same for both irradiation temperatures and was the same as that observed previously for 10 B fission fragment irrations at 4 K. These results are interpreted to show that the resistivity change per defect is unaffected by irradiation under conditions which lead to interstitial clustering. (orig.)

  14. Recovery of Cephalosporin Resistant Escherichia coli and Salmonella from Pork, Beef and Chicken Marketed in Nova Scotia

    Directory of Open Access Journals (Sweden)

    Kevin R Forward

    2004-01-01

    Full Text Available BACKGROUND: Antimicrobial use in farm animals is a potentially important contributor to the emergence of antimicrobial resistance. Resistant Salmonella may lead to serious human infections and resistant Escherichia coli may transfer plasmid-encoded resistance genes to other pathogens.

  15. Copper Pollution Increases the Resistance of Soil Archaeal Community to Changes in Water Regime.

    Science.gov (United States)

    Li, Jing; Liu, Yu-Rong; Cui, Li-Juan; Hu, Hang-Wei; Wang, Jun-Tao; He, Ji-Zheng

    2017-11-01

    Increasing efforts have been devoted to exploring the impact of environmental stresses on soil bacterial communities, but the work on the archaeal community is seldom. Here, we constructed microcosm experiments to investigate the responses of archaeal communities to the subsequent dry-rewetting (DW) disturbance in two contrasting soils (fluvo-aquic and red soil) after 6 years of copper pollution. Ten DW cycles were exerted on the two soils with different copper levels, followed by a 6-week recovery period. In both soils, archaeal diversity (Shannon index) in the high copper-level treatments increased over the incubation period, and archaeal community structure changed remarkably as revealed by the non-metric multidimensional scaling ordinations. In both soils, copper pollution altered the response of dominant operational taxonomic units (OTUs) to the DW disturbance. Throughout the incubation and recovery period, the resistance of archaeal abundance to the DW disturbance was higher in the copper-polluted soils than soils without pollution. Taken together, copper pollution altered the response of soil archaeal diversity and community composition to the DW disturbance and increased the resistance of the archaeal abundance. These findings have important implications for understanding soil microbial responses to ongoing environmental change.

  16. Specific features in the behavior of electrical resistivity of the pine biocarbon preform/copper composite

    Science.gov (United States)

    Burkov, A. T.; Orlova, T. S.; Smirnov, B. I.; Smirnov, I. A.; Misiorek, H.; Jezowski, A.

    2010-11-01

    The electrical resistivity ρ( T) of the novel type of composites prepared by infiltrating melted copper in vacuum in empty sap channels of white pine high-porosity biocarbon preforms has been measured in the temperature range 5-300 K. Biocarbon preforms have been prepared by pyrolysis of tree wood in an argon flow at two carbonization temperatures, 1000 and 2400°C. The electrical resistivity of the composites has been found to vary relatively weakly with temperature and to pass through a characteristic minimum near 40-50 K, which can be ascribed to iron and manganese impurities penetrating into copper from the carbon preform when liquid copper is infiltrated into it. It has been shown that the electrical resistivity ρ( T) of the composites is governed primarily by the specific microstructure of the preform, which is made up of parallel channels with an average diameter of about 50 μm interrupted by systems of thin capillaries. The small cross section of the copper-filled capillaries accounts for these regions providing the major contribution to the electrical resistivity of the composites. An increase in the wood carbonization temperature brings about a noticeable increase in the effective capillary cross section and a decrease in the electrical resistivity ρ( T) of the composite.

  17. Corrosion and biofouling resistance evaluation of 90-10 copper-nickel

    Energy Technology Data Exchange (ETDEWEB)

    Powell, Carol [Consultant to Copper Development Association, UK, Square Covert, Caynham, Ludlow, Shropshire (United Kingdom)

    2004-07-01

    Copper-nickel alloys for marine use were developed for naval applications in the early part of the 20. century with a view to improving the corrosion resistance of condenser tubes and seawater piping. They still enjoy widespread use today not only for many navies but also in commercial shipping, floating production, storage and off loading vessels (FPSOs), and in multistage flash desalination. The two popular alloys contain 90% or 70% copper and differ in strength and maximum sea water velocity levels they can handle but it is the 90-10 copper-nickel (CuNi10Fe1Mn) which is the more economic and extensively used. An additional benefit of this alloy is its high resistance to biofouling: in recent years this has led to sheathing developments particularly for structures and boat hulls. This paper provides a review of the corrosion and biofouling resistance of 90-10 copper-nickel based on laboratory test data and documented experience of the alloy in marine environments. Particular attention is given to exposure trials over 8 years in Langstone Harbour, UK, which have recently been completed by Portsmouth University on behalf of the Nickel Institute. These examined four sheathing products; plate and foil as well as two composite products with rubber backing. The latter involved copper-nickel granules and slit sheet. The trial results are consistent with the behaviour of the alloy in the overall review. There is an inherent high resistance to marine biofouling when freely exposed. Prolonged exposure to quiet conditions can result in some growth of marine organisms but this is loosely attached and can readily be removed by wiping or a light scraping. The good corrosion resistance of 90-10 copper-nickel in sea water is also confirmed and associated with the formation of a thin, complex, protective and predominantly cuprous oxide surface film, which forms and matures naturally on exposure to seawater. Sound initial oxide film formation is also known to help protect against

  18. Emergence and nosocomial spread of carbapenem-resistant OXA-232-producing Klebsiella pneumoniae in Brunei Darussalam

    NARCIS (Netherlands)

    Abdul Momin, Muhd Haziq Fikry; Liakopoulos, Apostolos; Phee, Lynette M.; Wareham, David W.

    2017-01-01

    Objectives Carbapenem-resistant Enterobacteriaceae (CRE) are identified as a major global health concern. The success of CRE is facilitated by the emergence, acquisition and spread of successful clones carrying plasmid-encoded resistance genes. In this study, an outbreak of carbapenem-resistant

  19. Plasmids encoding PKI(1-31), a specific inhibitor of cAMP-stimulated gene expression, inhibit the basal transcriptional activity of some but not all cAMP-regulated DNA response elements in JEG-3 cells.

    Science.gov (United States)

    Grove, J R; Deutsch, P J; Price, D J; Habener, J F; Avruch, J

    1989-11-25

    Plasmids that encode a bioactive amino-terminal fragment of the heat-stable inhibitor of the cAMP-dependent protein kinase, PKI(1-31), were employed to characterize the role of this protein kinase in the control of transcriptional activity mediated by three DNA regulatory elements in the JEG-3 human placental cell line. The 5'-flanking sequence of the human collagenase gene contains the heptameric sequence, 5'-TGAGTCA-3', previously identified as a "phorbol ester" response element. Reporter genes containing either the intact 1.2-kilobase 5'-flanking sequence from the human collagenase gene or just the 7-base pair (bp) response element, when coupled to an enhancerless promoter, each exhibit both cAMP and phorbol ester-stimulated expression in JEG-3 cells. Cotransfection of either construct with plasmids encoding PKI(1-31) inhibits cAMP-stimulated but not basal- or phorbol ester-stimulated expression. Pretreatment of cells with phorbol ester for 1 or 2 days abrogates completely the response to rechallenge with phorbol ester but does not alter the basal expression of either construct; cAMP-stimulated expression, while modestly inhibited, remains vigorous. The 5'-flanking sequence of the human chorionic gonadotropin-alpha subunit (HCG alpha) gene has two copies of the sequence, 5'-TGACGTCA-3', contained in directly adjacent identical 18-bp segments, previously identified as a cAMP-response element. Reporter genes containing either the intact 1.5 kilobase of 5'-flanking sequence from the HCG alpha gene, or just the 36-bp tandem repeat cAMP response element, when coupled to an enhancerless promoter, both exhibit a vigorous cAMP stimulation of expression but no response to phorbol ester in JEG-3 cells. Cotransfection with plasmids encoding PKI(1-31) inhibits both basal and cAMP-stimulated expression in a parallel fashion. The 5'-flanking sequence of the human enkephalin gene mediates cAMP-stimulated expression of reporter genes in both JEG-3 and CV-1 cells. Plasmids

  20. Experimental investigation of copper matrix longitudinal resistance in a composite Nb-Ti wire

    International Nuclear Information System (INIS)

    Gubkin, I.N.; Kozlenkova, N.I.; Nikulin, A.D.; Polikarpova, M.V.; Filkin, V.Ya.

    1994-01-01

    The longitudinal resistance of multifilamentary superconducting wires is among the major parameters used in design and optimization of superconducting magnetic systems. To enhance the conductivity of the copper matrix, it is made of pipes and rods of enhanced quality copper produced by electron beam melting (resistance ratio between two temperatures, 295 K and 4.2 K, R 295 /R 4.2 > 200). Yet for readily obtainable conductors this parameter is much lower. The reduction of the copper-matrix electrical conductivity may be attributed to wire-production technology involving processes such as extrusion, drawing and intermediate thermal processing, as well as to the size effect. Copper-matrix longitudinal resistance was studied as a function of wire diameter on specimens of multifilamentary Nb-Ti wire with filaments coated by a Nb layer. Experimental results are compared with the Sondheimer calculations for a monofilament conductor as well as with the Gavalloni calculations for an ideal wire with hexagonally located filaments. It has been shown that the best fit with the experiment is provided by the Sondheimer approximation. Comparison of the results of this work with other authors' data obtained for the specimens with no niobium barrier, allows the authors to single out the influence of a pure size effect and diffusion of Ti on the resistivity

  1. Copper pollution decreases the resistance of soil microbial community to subsequent dry-rewetting disturbance.

    Science.gov (United States)

    Li, Jing; Wang, Jun-Tao; Hu, Hang-Wei; Ma, Yi-Bing; Zhang, Li-Mei; He, Ji-Zheng

    2016-01-01

    Dry-rewetting (DW) disturbance frequently occurs in soils due to rainfall and irrigation, and the frequency of DW cycles might exert significant influences on soil microbial communities and their mediated functions. However, how microorganisms respond to DW alternations in soils with a history of heavy metal pollution remains largely unknown. Here, soil laboratory microcosms were constructed to explore the impacts of ten DW cycles on the soil microbial communities in two contrasting soils (fluvo-aquic soil and red soil) under three copper concentrations (zero, medium and high). Results showed that the fluctuations of substrate induced respiration (SIR) decreased with repeated cycles of DW alternation. Furthermore, the resistance values of substrate induced respiration (RS-SIR) were highest in non-copper-stressed (zero) soils. Structural equation model (SEM) analysis ascertained that the shifts of bacterial communities determined the changes of RS-SIR in both soils. The rate of bacterial community variance was significantly lower in non-copper-stressed soil compared to the other two copper-stressed (medium and high) soils, which might lead to the higher RS-SIR in the fluvo-aquic soil. As for the red soil, the substantial increase of the dominant group WPS-2 after DW disturbance might result in the low RS-SIR in the high copper-stressed soil. Moreover, in both soils, the bacterial diversity was highest in non-copper-stressed soils. Our results revealed that initial copper stress could decrease the resistance of soil microbial community structure and function to subsequent DW disturbance. Copyright © 2015. Published by Elsevier B.V.

  2. Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain

    International Nuclear Information System (INIS)

    Glushko, O.; Marx, V.M.; Kirchlechner, C.; Zizak, I.; Cordill, M.J.

    2014-01-01

    Substantial recovery (decrease) of electrical resistance during and after unloading is demonstrated for copper films on polyethylene terephthalate substrates subjected to a tensile strain with different peak values. Particularly, the films strained to 5% exhibit full resistance recovery after unloading despite clearly visible plastic deformation of the film. The recovery of electrical resistance in connection with the mechanical behavior of film/substrate couple is discussed with the help of in situ scanning electron microscopy and X-ray diffraction analysis. - Highlights: • Tensile tests on 200 nm Cu films on PET substrate are performed. • Electrical resistance is recorded in-situ during loading and unloading. • Significant recovery (decrease) of resistance is observed during and after unloading. • Films strained to 5% demonstrate full resistance recovery. • Viscoelastic relaxation of PET is responsible for recovery of Cu film resistance

  3. Characterization of copper resistant ciliates: Potential candidates for ...

    African Journals Online (AJOL)

    Jane

    2011-08-17

    , bioremediation. ... on metal interactions in protist ciliates. Ciliated protozoa .... Generally, protozoan cultures grow in mineral salts me- ... utilizing these metal ions as essential requirement or by ...... Lead resistant yeast.

  4. Investigation of Superficial Resistance of Different Purity Copper at Boiling Nitrogen Temperature Depending on Treatment of Current-Conducting Layer

    International Nuclear Information System (INIS)

    Kutovoj, V.A.; Nikolaenko, A.A.; Stoev, P.I.

    2007-01-01

    Results of this scientific work show influence of annealing temperature and deformation degree of initial MOB copper and after electron beam refining on superficial resistance at temperature of boiling nitrogen. It is shown, that 30 % deformation and annealing in 873...923 K temperature range results in appreciable reduction of superficial resistance at the investigated samples of copper. The lowest values of superficial resistance after thermal and mechanical treatment were observed in the samples after electron beam refinement

  5. Evolution of copper arsenate resistance for enhanced enargite bioleaching using the extreme thermoacidophile Metallosphaera sedula.

    Science.gov (United States)

    Ai, Chenbing; McCarthy, Samuel; Liang, Yuting; Rudrappa, Deepak; Qiu, Guanzhou; Blum, Paul

    2017-12-01

    Adaptive laboratory evolution (ALE) was employed to isolate arsenate and copper cross-resistant strains, from the copper-resistant M. sedula CuR1. The evolved strains, M. sedula ARS50-1 and M. sedula ARS50-2, contained 12 and 13 additional mutations, respectively, relative to M. sedula CuR1. Bioleaching capacity of a defined consortium (consisting of a naturally occurring strain and a genetically engineered copper sensitive strain) was increased by introduction of M. sedula ARS50-2, with 5.31 and 26.29% more copper recovered from enargite at a pulp density (PD) of 1 and 3% (w/v), respectively. M. sedula ARS50-2 arose as the predominant species and modulated the proportions of the other two strains after it had been introduced. Collectively, the higher Cu 2+ resistance trait of M. sedula ARS50-2 resulted in a modulated microbial community structure, and consolidating enargite bioleaching especially at elevated PD.

  6. Interfacial Microstructure and Its Influence on Resistivity of Thin Layers Copper Cladding Steel Wires

    Science.gov (United States)

    Li, Hongjuan; Ding, Zhimin; Zhao, Ruirong

    2018-04-01

    The interfacial microstructure and resistivity of cold-drawn and annealed thin layers copper cladding steel (CCS) wires have been systematically investigated by the methods of scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS), and resistivity testing. The results showed that the Cu and Fe atoms near interface diffused into each other matrixes. The Fe atoms diffused into Cu matrixes and formed a solid solution. The mechanism of solid solution is of substitution type. When the quantity of Fe atoms exceeds the maximum solubility, the supersaturated solid solution would form Fe clusters and decompose into base Cu and α-Fe precipitated phases under certain conditions. A few of α-Fe precipitates was observed in the copper near Cu/Fe interfaces of cold-drawn CCS wires, with 1-5 nm in size. A number of α-Fe precipitates of 1-20 nm in size can be detected in copper near Cu/Fe interfaces of CCS wires annealed at 850°C. When annealing temperature was less than 750°C, the resistivity of CCS wires annealed was lower than that of cold-drawn CCS wires. However, when annealing temperature was above 750°C, the resistivity of CCS wires was greater than that of cold-drawn CCS wires and increased with rising the annealing temperature. The relationship between nanoscale α-Fe precipitation and resistivity of CCS wires has been well discussed.

  7. Method For Creating Corrosion Resistant Surface On An Aluminum Copper Alloy

    Science.gov (United States)

    Mansfeld, Florian B.; Wang, You; Lin, Simon H.

    1997-06-03

    A method for treating the surface of aluminum alloys hang a relatively high copper content is provided which includes the steps of removing substantially all of the copper from the surface, contacting the surface with a first solution containing cerium, electrically charging the surface while contacting the surface in an aqueous molybdate solution, and contacting the surface with a second solution containing cerium. The copper is substantially removed from the surface in the first step either by (i) contacting the surface with an acidic chromate solution or by (ii) contacting the surface with an acidic nitrate solution while subjecting the surface to an electric potential. The corrosion-resistant surface resulting from the invention is excellent, consistent and uniform throughout the surface. Surfaces treated by the invention may often be certified for use in salt-water services.

  8. Measurement of resistance switching dynamics in copper sulfide memristor structures

    Science.gov (United States)

    McCreery, Kaitlin; Olson, Matthew; Teitsworth, Stephen

    Resistance switching materials are the subject of current research in large part for their potential to enable novel computing devices and architectures such as resistance random access memories and neuromorphic chips. A common feature of memristive structures is the hysteretic switching between high and low resistance states which is induced by the application of a sufficiently large electric field. Here, we describe a relatively simple wet chemistry process to fabricate Cu2 S / Cu memristive structures with Cu2 S film thickness ranging up to 150 micron. In this case, resistance switching is believed to be mediated by electromigration of Cu ions from the Cu substrate into the Cu2 S film. Hysteretic current-voltage curves are measured and reveal switching voltages of about 0.8 Volts with a relatively large variance and independent of film thickness. In order to gain insight into the dynamics and variability of the switching process, we have measured the time-dependent current response to voltage pulses of varying height and duration with a time resolution of 1 ns. The transient response consists of a deterministic RC component as well as stochastically varying abrupt current steps that occur within a few microseconds of the pulse application.

  9. Large IncHI2-plasmids encode extended-spectrum β-lactamases (ESBLs) in Enterobacter spp. bloodstream isolates, and support ESBL-transfer to Escherichia coli.

    Science.gov (United States)

    Nilsen, E; Haldorsen, B C; Sundsfjord, A; Simonsen, G S; Ingebretsen, A; Naseer, U; Samuelsen, O

    2013-11-01

    We investigated the prevalence of extended-spectrum β-lactamases (ESBLs) in Enterobacter spp. bloodstream isolates from 19 hospital laboratories in Norway during 2011. A total of 62/230 (27%) isolates were resistant to third-generation cephalosporins and four (1.7%) were ESBL-positive; blaCTX -M-15 (n = 3) and blaSHV -12 (n = 1). This is comparable to the prevalence of ESBLs in clinical isolates of Escherichia coli and Klebsiella pneumoniae in Norway during the same period. All ESBL-positive isolates were multidrug resistant (MDR) and harboured plasmid-mediated quinolone resistance. Three isolates supported transfer of large IncHI2-plasmids harbouring ESBL- and MDR-encoding genes to E. coli recipients by in vitro conjugation. © 2013 The Authors Clinical Microbiology and Infection © 2013 European Society of Clinical Microbiology and Infectious Diseases.

  10. Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network

    Science.gov (United States)

    Valencia, Daniel; Wilson, Evan; Jiang, Zhengping; Valencia-Zapata, Gustavo A.; Wang, Kuang-Chung; Klimeck, Gerhard; Povolotskyi, Michael

    2018-04-01

    Orientation effects on the specific resistance of copper grain boundaries are studied systematically with two different atomistic tight-binding methods. A methodology is developed to model the specific resistance of grain boundaries in the ballistic limit using the embedded atom model, tight- binding methods, and nonequilibrium Green's functions. The methodology is validated against first-principles calculations for thin films with a single coincident grain boundary, with 6.4% deviation in the specific resistance. A statistical ensemble of 600 large, random structures with grains is studied. For structures with three grains, it is found that the distribution of specific resistances is close to normal. Finally, a compact model for grain-boundary-specific resistance is constructed based on a neural network.

  11. Superhydrophobic copper surfaces fabricated by fatty acid soaps in aqueous solution for excellent corrosion resistance

    Energy Technology Data Exchange (ETDEWEB)

    Xu, Wenlong; Hu, Yuanyuan; Bao, Wenda; Xie, Xiaoyu; Liu, Yiran; Song, Aixin, E-mail: songaixin@sdu.edu.cn; Hao, Jingcheng

    2017-03-31

    Highlights: • The superhydrophobic property can be realized in a much quicker process (7.5 min) in aqueous solution than in ethanol. • The fabrication process of superhydrophobic metal surfaces greatly increases the safety in industrial manufacture in commercial scale. • The superhydrophobic copper surfaces show excellent corrosion resistance. - Abstract: A simple and safe one-step immersion method was developed to obtain the stable superhydrophobic copper surfaces with excellent corrosion resistance ability using fatty acids in water-medium instead of ethanol. An organic alkali, N,N-dimethylcyclohexylamine (DMCHA), was chosen to solve the poor solubility of fatty acids in water and the high Krafft point of carboxylate salts with inorganic counterions. The superhydrophobic property can be realized in a much quicker process (7.5 min) in aqueous solution than in ethanol (more than 2 d), which is universally feasible for the fabrication of superhydrophobic metal surfaces in industry scale, thereby greatly increasing the safety in industrial manufacture.

  12. Effect of Contact Pressure on the Resistance Contact Value and Temperature Changes in Copper Busbar Connection

    Directory of Open Access Journals (Sweden)

    Agus Risdiyanto

    2012-12-01

    Full Text Available This paper discussed the influence of tightness or contacts pressure on copper busbar joints to determine changes in the value of the initial contact resistance and the maximum temperature at the joint due to high current load. The test sample was copper busbar 3 x 30 mm with configuration of bolted overlapping joint. Increasing contact pressure at the joint was measured to find out its effect on the value of contact resistance. The applied pressure was 6 to 36 MPa. Procedure of contact resistance measurement refer to the ASTM B539 standard using four-wire method. The sample subsequently loaded with the current of 350 A for 60 minutes and the maximum temperature at the joint was measured. The result showed that increasing contact pressure at the busbar joint will reduce the contact resistance and maximum temperature. The increase of contact pressure from 6 to 30 MPa causes decreasing contact resistance from 16 μΩ to 11 μΩ. Further increasing of contact pressure more than 30 MPa did not affect the contact resistance significantly. The lowest temperatur of busbar joint of 54°C was reached at a contact pressure of 36 Mpa.

  13. The corrosion rate of copper in a bentonite test package measured with electric resistance sensors

    Energy Technology Data Exchange (ETDEWEB)

    Rosborg, Bo [Division of Surface and Corrosion Science, KTH, Stockholm (Sweden); Kosec, Tadeja; Kranjc, Andrej; Kuhar, Viljem; Legat, Andraz [Slovenian National Building and Civil Engineering Institute, Ljubljana (Slovenia)

    2012-12-15

    LOT1 test parcel A2 was exposed for six years in the Aespoe Hard Rock Laboratory, which offers a realistic environment for the conditions that will prevail in a deep repository for high-level radioactive waste disposal in Sweden. The test parcel contained copper electrodes for real-time corrosion monitoring in bentonite ring 36, where the temperature was 24 deg C, and copper coupons in bentonite rings 22 and 30, where the temperature was higher. After retrieval of the test parcel in January 2006, a bentonite test package consisting of bentonite rings 35 - 37 was placed in a container and sealed with a thick layer of paraffin. Later the same year new copper electrodes were installed in the test package. In January 2007 electric resistance (ER) sensors of pure copper with a thickness of 35 {mu}m were also installed in the test package mainly to facilitate the interpretation of the results from the real-time corrosion monitoring with electrochemical techniques. The ER measurements have shown that the corrosion rate of pure copper exposed in an oxic bentonite/ saline groundwater environment at room temperate decreases slowly with time to low but measurable values. The corrosion rates estimated from the regularly performed EIS measurements replicate the ER data. Thus, for this oxic environment in which copper acquires corrosion potentials of the order of 200 mV (SHE) or higher, electrochemical measurements provide believable data. Comparing the recorded ER data with an estimate of the average corrosion rate based on comparing cross-sections from exposed and protected sensor elements, it is obvious that the former overestimates the actual corrosion rate, which is understandable. It seems as if electrochemical measurements can provide a better estimate of the corrosion rate; however, this is quite dependent on the use of proper measuring frequencies and evaluation methods. In this respect ER measurements are more reliable. It has been shown that real-time corrosion

  14. The corrosion rate of copper in a bentonite test package measured with electric resistance sensors

    International Nuclear Information System (INIS)

    Rosborg, Bo; Kosec, Tadeja; Kranjc, Andrej; Kuhar, Viljem; Legat, Andraz

    2012-12-01

    LOT1 test parcel A2 was exposed for six years in the Aespoe Hard Rock Laboratory, which offers a realistic environment for the conditions that will prevail in a deep repository for high-level radioactive waste disposal in Sweden. The test parcel contained copper electrodes for real-time corrosion monitoring in bentonite ring 36, where the temperature was 24 deg C, and copper coupons in bentonite rings 22 and 30, where the temperature was higher. After retrieval of the test parcel in January 2006, a bentonite test package consisting of bentonite rings 35 - 37 was placed in a container and sealed with a thick layer of paraffin. Later the same year new copper electrodes were installed in the test package. In January 2007 electric resistance (ER) sensors of pure copper with a thickness of 35 μm were also installed in the test package mainly to facilitate the interpretation of the results from the real-time corrosion monitoring with electrochemical techniques. The ER measurements have shown that the corrosion rate of pure copper exposed in an oxic bentonite/ saline groundwater environment at room temperate decreases slowly with time to low but measurable values. The corrosion rates estimated from the regularly performed EIS measurements replicate the ER data. Thus, for this oxic environment in which copper acquires corrosion potentials of the order of 200 mV (SHE) or higher, electrochemical measurements provide believable data. Comparing the recorded ER data with an estimate of the average corrosion rate based on comparing cross-sections from exposed and protected sensor elements, it is obvious that the former overestimates the actual corrosion rate, which is understandable. It seems as if electrochemical measurements can provide a better estimate of the corrosion rate; however, this is quite dependent on the use of proper measuring frequencies and evaluation methods. In this respect ER measurements are more reliable. It has been shown that real-time corrosion

  15. Radiation enhanced copper clustering processes in Fe-Cu alloys during electron and ion irradiations as measured by electrical resistivity

    International Nuclear Information System (INIS)

    Ishino, S.; Chimi, Y.; Bagiyono; Tobita, T.; Ishikawa, N.; Suzuki, M.; Iwase, A.

    2003-01-01

    To study the mechanism of radiation-enhanced clustering of copper atoms in Fe-Cu alloys, in situ electrical resistivity measurements are performed during irradiation with 100 MeV carbon ions and with 2 MeV electrons at 300 K. Two kinds of highly pure Fe-Cu alloys with Cu content of 0.02 and 0.6 wt% are used. The results are summarized as follows: - Although there is a steep initial resistivity increase below about 10 μdpa, the resistivity steadily decreases after this initial transient in Fe-0.6wt%Cu alloy, while in Fe-0.02wt%Cu alloy, the resistivity either decreases slowly or stays almost constant. The rate of change in resistivity depends on copper concentration. - The rate of change in resistivity per dpa is larger for electron irradiation than for ion irradiation. - Change in dose rate from 10 -8 to 10 -9 dpa/s slightly enhances the rate of resistivity change per dpa. The decrease in resistivity with dose is considered to be due to clustering or precipitation of copper atoms. The initial abrupt increase in resistivity is too large to be accounted for by initial introduction of point defects before copper clustering. Tentatively the phenomenon is explained as due to the formation of embryos of copper precipitates with a large strain field around them. Quantitative evaluation of the results using resistivity contribution of a unit concentration of Frenkel pairs and that of copper atoms gives an important conclusion that more than one copper atom are removed from solid solution by one Frenkel pair. The clustering efficiency is surprisingly high in the present case compared with the ordinary radiation-induced or radiation-enhanced precipitation processes

  16. Prevalence of quinolone resistance genes, copper resistance genes, and the bacterial communities in a soil-ryegrass system co-polluted with copper and ciprofloxacin.

    Science.gov (United States)

    Tuo, Xiaxia; Gu, Jie; Wang, Xiaojuan; Sun, YiXin; Duan, Manli; Sun, Wei; Yin, Yanan; Guo, Aiyun; Zhang, Li

    2018-04-01

    The presence of high concentrations of residual antibiotics and antibiotic resistance genes (ARGs) in soil may pose potential health and environmental risks. This study investigated the prevalence of plasmid-mediated quinolone resistance (PMQR) genes, copper resistance genes (CRGs), and the bacterial communities in a soil-ryegrass pot system co-polluted with copper and ciprofloxacin (CIP; 0, 20, or 80 mg kg -1 dry soil). Compared with the samples on day 0, the total relative abundances of the PMQR genes and mobile genetic elements (MGEs) were reduced significantly by 80-89% in the ryegrass and soil by the cutting stage (after 75 days). The abundances of PMQR genes and MGEs were reduced by 63-81% in soil treated with 20 mg kg -1 CIP compared with the other treatments, but the abundances of CRGs increased by 18-42%. The presence of 80 mg kg -1 CIP affected the microbial community structure in the soil by increasing the abundances of Acidobacteria and Thaumarchaeota, but decreasing those of Firmicutes. Redundancy analysis indicated that the pH and microbial composition were the main factors that affected the variations in PMQR genes, MGEs, and CRGs, where they could explain 42.2% and 33.3% of the variation, respectively. Furthermore, intI2 may play an important role in the transfer of ARGs. We found that 80 mg kg -1 CIP could increase the abundances of ARGs and CRGs in a soil-ryegrass pot system. Copyright © 2018 Elsevier Ltd. All rights reserved.

  17. Spread of clonally related Escherichia coli harboring an IncA/C1 plasmid encoding IMP-8 and its recruitment into an unrelated MCR-1-containing isolate.

    Science.gov (United States)

    Elena, Alan; Cejas, Daniela; Magariños, Francisco; Jewtuchowicz, Virginia; Facente, Andrea; Gutkind, Gabriel; Di Conza, José; Radice, Marcela

    2018-04-16

    Ten IMP-8-producing Escherichia coli isolates were recovered from the surveillance cultures of a neonatal intensive care unit, of which eight were clonally related. A 168.2-kb- bla IMP-8 plasmid was fully sequenced, and it corresponded to the recently described IncA/C1-ST13. This plasmid was detected in all isolates, even in those no clonally related. One unrelated isolate was also resistant to colistin and positive for mcr-1. This marker was located in a 62.7-kb-IncI2 plasmid, which was also fully sequenced. Copyright © 2018 American Society for Microbiology.

  18. Study of the surface resistance of niobium sputter-coated copper cavities

    CERN Document Server

    Benvenuti, Cristoforo; Campisi, I E; Darriulat, Pierre; Peck, M A; Russo, R; Valente, A M

    1999-01-01

    A systematic study of the superconducting properties of niobium films deposited on the inner wall of copper radiofrequency cavities is presented. Films are grown by sputtering with different discharge gases (Xe, Kr, Ar and Ar/Ne mixtures) on substrates prepared under different conditions. The measured quantities include the surface resistance at 1.5 GHz, the critical temperature and the penetration depth. The surface resistance is analyzed in terms of its dependence on temperature, RF field and the density of trapped fluxons. Once allowance for electron scattering is made by means of a single mean free path parameter, good agreement with BCS theory is observed. The residual resistance is observed to be essentially noncorrelated with the superconducting properties, although influenced by specific coating conditions. On occasions, very low residual resistances, in the nano-ohm range, have been maintained over a broad range of RF field, indicating the absence of fundamental limitations specific to the film techn...

  19. On the field dependent surface resistance of niobium on copper cavities

    CERN Document Server

    Junginger, Tobias

    2015-01-01

    The surface resistance Rs of superconducting cavities prepared by sputter coating a thin niobium film on a copper substrate increases significantly stronger with the applied RF field compared to cavities of bulk material. A possible cause is that due to the thermal boundary resistance between the copper substrate and the niobium film Rs is enhanced due to global heating of the inner cavity wall. Introducing helium gas in the cavity and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by only 60+/-60 mK when Rs increases with Eacc by 100 nOhm. This is more than one order of magnitude less than what one would expect from global heating. Additionally the effect of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered Rs.

  20. Thermal resistance of indium coated sapphire–copper contacts below 0.1K

    CERN Document Server

    Eisel, T; Koettig, T

    2014-01-01

    High thermal resistances exist at ultra-low temperatures for solid-solid interfaces. This is especially true for pressed metal-sapphire joints, where the heat is transferred by phonons only. For such pressed joints it is difficult to achieve good physical, i.e. thermal contacts due to surface irregularities in the microscopic or larger scale. Applying ductile indium as an intermediate layer reduces the thermal resistance of such contacts. This could be proven by measurements of several researchers. However, the majority of the measurements were performed at temperatures higher than 1 K. Consequently, it is difficult to predict the thermal resistance of pressed metal-sapphire joints at temperatures below 1 K. In this paper the thermal resistances across four different copper-sapphire-copper sandwiches are presented in a temperature range between 30 mK and 100 mK. The investigated sandwiches feature either rough or polished sapphire discs (empty set 20 mm x 1.5 mm) to investigate the phonon scattering at the bo...

  1. Tendency of the 18-8 type corrosion-resistant steel to cracking in automatic building-up of copper and copper base alloys in argon

    International Nuclear Information System (INIS)

    Abramovich, V.R.; Andronik, V.A.

    1978-01-01

    Studied was the tendency of the 18-8 type corrosion-resistant steel to cracking during automatic building-up of copper and bronze in argon. The investigation was carried out on the 0kh18n10t steel in argon. It had been established, that the degree of copper penetration into the steel inceases with the increase in the time of the 0Kh18n10t steel contact with liquid copper. Liquid copper and copper base alloys have a detrimental effect on mechanical properties of the steel under external tensile load during intercontant. It is shown that in building-up of copper base alloys on the steel-0Kh18n10t, tendency of the steel to cracking decreases with increase in stiffness of a surfaced weld metal plate and with decrease in building-up energy per unit length. The causes of macrocracking in steel at building-up non-ferrous metals are explained. The technological procedures to avoid cracking are suggested

  2. Comparison of oxidation resistance of copper treated by beam-line ion implantation and plasma immersion ion implantation

    International Nuclear Information System (INIS)

    An Quanzhang; Li Liuhe; Hu Tao; Xin Yunchang; Fu, Ricky K.Y.; Kwok, D.T.K.; Cai Xun; Chu, Paul K.

    2009-01-01

    Copper which has many favorable properties such as low cost, high thermal and electrical conductivity, as well as easy fabrication and joining is one of the main materials in lead frames, interconnects, and foils in flexible circuits. Furthermore, copper is one of the best antibacterial materials. However, unlike aluminum oxide or chromium oxide, the surface copper oxide layer does not render sufficient protection against oxidation. In this work, in order to improve the surface oxidation resistance of Cu, Al and N were introduced into copper by plasma immersion ion implantation (PIII) and beam-line ion implantation (BII). The implantation fluences of Al and N were 2 x 10 17 ions cm -2 and 5 x 10 16 ions cm -2 , respectively. The implanted and untreated copper samples were oxidized in air at 260 deg. C for 1 h. The X-ray diffraction (XRD), scanning electron microscopy (SEM), as well as X-ray photoelectron spectroscopy (XPS) results indicate that both implantation methods can enhance the oxidation resistance of copper but to different extent. PIII is superior to BII in enhancing the oxidation resistance of copper. The effects and possible mechanisms are discussed.

  3. The plasmid-encoded Ipf and Klf fimbriae display different expression and varying roles in the virulence of Salmonella enterica serovar Infantis in mouse vs. avian hosts.

    Directory of Open Access Journals (Sweden)

    Gili Aviv

    2017-08-01

    Full Text Available Salmonella enterica serovar Infantis is one of the prevalent Salmonella serovars worldwide. Different emergent clones of S. Infantis were shown to acquire the pESI virulence-resistance megaplasmid affecting its ecology and pathogenicity. Here, we studied two previously uncharacterized pESI-encoded chaperone-usher fimbriae, named Ipf and Klf. While Ipf homologs are rare and were found only in S. enterica subspecies diarizonae and subspecies VII, Klf is related to the known K88-Fae fimbria and klf clusters were identified in seven S. enterica subspecies I serovars, harboring interchanging alleles of the fimbria major subunit, KlfG. Regulation studies showed that the klf genes expression is negatively and positively controlled by the pESI-encoded regulators KlfL and KlfB, respectively, and are activated by the ancestral leucine-responsive regulator (Lrp. ipf genes are negatively regulated by Fur and activated by OmpR. Furthermore, induced expression of both klf and ipf clusters occurs under microaerobic conditions and at 41°C compared to 37°C, in-vitro. Consistent with these results, we demonstrate higher expression of ipf and klf in chicks compared to mice, characterized by physiological temperature of 41.2°C and 37°C, respectively. Interestingly, while Klf was dispensable for S. Infantis colonization in the mouse, Ipf was required for maximal colonization in the murine ileum. In contrast to these phenotypes in mice, both Klf and Ipf contributed to a restrained infection in chicks, where the absence of these fimbriae has led to moderately higher bacterial burden in the avian host. Taken together, these data suggest that physiological differences between host species, such as the body temperature, can confer differences in fimbriome expression, affecting Salmonella colonization and other host-pathogen interplays.

  4. Research surface resistance of copper normal and abnormal skin-effects depending on the frequency of electromagnetic field

    International Nuclear Information System (INIS)

    Kutovyi, V.A.; Komir, A.I.

    2013-01-01

    The results of the frequency dependence of surface resistance of copper in diffuse and specular reflection of electrons from the conductive surface of the high-frequency resonance of the system depending on the frequency of the electromagnetic field in the normal and anomalous skin effect. Found, the surface resistance of copper is reduced by more than 10 times at the temperature of liquid helium, as compared with a surface resistivity at room temperature, at frequencies f ≤ 173 MHz, for diffuse reflection of conduction electrons from the surface of the conductive layer, and the specular reflection - at frequencies f ≤ 346 MHz

  5. Spatial Pattern of Copper Phosphate Precipitation Involves in Copper Accumulation and Resistance of Unsaturated Pseudomonas putida CZ1 Biofilm.

    Science.gov (United States)

    Chen, Guangcun; Lin, Huirong; Chen, Xincai

    2016-12-28

    Bacterial biofilms are spatially structured communities that contain bacterial cells with a wide range of physiological states. The spatial distribution and speciation of copper in unsaturated Pseudomonas putida CZ1 biofilms that accumulated 147.0 mg copper per g dry weight were determined by transmission electron microscopy coupled with energy dispersive X-ray analysis, and micro-X-ray fluorescence microscopy coupled with micro-X-ray absorption near edge structure (micro-XANES) analysis. It was found that copper was mainly precipitated in a 75 μm thick layer as copper phosphate in the middle of the biofilm, while there were two living cell layers in the air-biofilm and biofilm-medium interfaces, respectively, distinguished from the copper precipitation layer by two interfaces. The X-ray absorption fine structure analysis of biofilm revealed that species resembling Cu₃(PO₄)₂ predominated in biofilm, followed by Cu-Citrate- and Cu-Glutathione-like species. Further analysis by micro-XANES revealed that 94.4% of copper were Cu₃(PO₄)₂-like species in the layer next to the air interface, whereas the copper species of the layer next to the medium interface were composed by 75.4% Cu₃(PO₄)₂, 10.9% Cu-Citrate-like species, and 11.2% Cu-Glutathione-like species. Thereby, it was suggested that copper was initially acquired by cells in the biofilm-air interface as a citrate complex, and then transported out and bound by out membranes of cells, released from the copper-bound membranes, and finally precipitated with phosphate in the extracellular matrix of the biofilm. These results revealed a clear spatial pattern of copper precipitation in unsaturated biofilm, which was responsible for the high copper tolerance and accumulation of the biofilm.

  6. Fabrication of silicon-embedded low resistance high-aspect ratio planar copper microcoils

    Science.gov (United States)

    Syed Mohammed, Zishan Ali; Puiu, Poenar Daniel; Aditya, Sheel

    2018-01-01

    Low resistance is an important requirement for microcoils which act as a signal receiver to ensure low thermal noise during signal detection. High-aspect ratio (HAR) planar microcoils entrenched in blind silicon trenches have features that make them more attractive than their traditional counterparts employing electroplating through a patterned thick polymer or achieved through silicon vias. However, challenges met in fabrication of such coils have not been discussed in detail until now. This paper reports the realization of such HAR microcoils embedded in Si blind trenches, fabricated with a single lithography step by first etching blind trenches in the silicon substrate with an aspect ratio of almost 3∶1 and then filling them up using copper electroplating. The electroplating was followed by chemical wet etching as a faster way of removing excess copper than traditional chemical mechanical polishing. Electrical resistance was further reduced by annealing the microcoils. The process steps and challenges faced in the realization of such structures are reported here followed by their electrical characterization. The obtained electrical resistances are then compared with those of other similar microcoils embedded in blind vias.

  7. Co-selection of antibiotic resistance via copper shock loading on bacteria from a drinking water bio-filter.

    Science.gov (United States)

    Zhang, Menglu; Chen, Lihua; Ye, Chengsong; Yu, Xin

    2018-02-01

    Heavy metal contamination of source water frequently occurred in developing countries as a result of accidents. To address the problems, most of the previous studies have focused on engineering countermeasures. In this study, we investigated the effects of heavy metals, particularly copper, on the development of antibiotic resistance by establishing a copper shock loading test. Results revealed that co-selection occurred rapidly within 6 h. Copper, at the levels of 10 and 100 mg/L, significantly increased bacterial resistance to the antibiotics tested, including rifampin, erythromycin, kanamycin, and a few others. A total of 117 antimicrobial-resistance genes were detected from 12 types of genes, and the relative abundance of most genes (particularly mobile genetic elements intⅠand transposons) was markedly enriched by at least one fold. Furthermore, the copper shock loading altered the bacterial community. Numerous heavy metal and antibiotic resistant strains were screened out and enriched. These strains are expected to enhance the overall level of resistance. More noticeably, the majority of the co-selected antibiotic resistance could sustain for at least 20 h in the absence of copper and antimicrobial drugs. Resistance to vancomycin, erythromycin and lincomycin even could remain for 7 days. The prominent selection pressure by the copper shock loading implies that a real accident most likely poses similar impacts on the water environment. An accidental release of heavy metals would not only cause harm to the ecological environment, but also contribute to the development of bacterial antibiotic resistance. Broader concerns should be raised about the biological risks caused by sudden releases of pollutants by accidents. Copyright © 2017. Published by Elsevier Ltd.

  8. Thermal shock resistances of a bonding material of C/C composite and copper

    International Nuclear Information System (INIS)

    Kurumada, Akira; Oku, Tatsuo; Kawamata, Kiyohiro; Motojima, Osamu; Noda, Nobuaki; McEnaney, B.

    1997-01-01

    The purpose of this study is to contribute to the development and the safety design of plasma facing components for fusion reactor devices. We evaluated the thermal shock resistance and the thermal shock fracture toughness of a bonding material which was jointed a carbon-fiber-reinforced carbon composite (C/C composite) to oxygen-free copper. We also examined the microstructures of the bonding layers using a scanning electron microscope before and after thermal shock tests. The bonding material did not fracture during thermal shock tests. However, thermal cracks and delamination cracks were observed in the bonding layers. (author)

  9. Dependence of the surface resistance of niobium coated copper cavities on the coating temperature

    International Nuclear Information System (INIS)

    Darriulat, P.; Durand, C.; Janot, P.; Rensing, N.; Weingarten, W.; Bosland, P.; Gobin, J.; Martignac, J.

    1996-01-01

    Six hydro-formed copper 1.5 GHz cavities have been baked and coated with niobium at different temperatures between 100 deg C and 200 deg C, while keeping the other discharge parameters unchanged. Their surface resistance has been measured as a function RF field and trapped magnetic field. Its dependence on deposition temperature confirms earlier indications obtained using 350 MHz LEP cavities that 150 deg C leads to optimal performances. The critical temperatures of Nb/Cu and bulk niobium cavities have also been measured. (author)

  10. Ti plasmid-encoded genes responsible for catabolism of the crown gall opine mannopine by Agrobacterium tumefaciens are homologs of the T-region genes responsible for synthesis of this opine by the plant tumor.

    Science.gov (United States)

    Kim, K S; Farrand, S K

    1996-06-01

    Agrobacterium tumefaciens NT1 harboring pSaB4, which contains the 14-kb BamHI fragment 4 from the octopine/mannityl opine-type Ti plasmid pTi15955, grew well with agropine (AGR) but slowly with mannopine (MOP) as the sole carbon source. When a second plasmid encoding a dedicated transport system for MOP was introduced, these cells grew well with both AGR and MOP. Transposon insertion mutagenesis and subcloning identified a 5.7-kb region of BamHI fragment 4 that encodes functions required for the degradation of MOP. DNA sequence analysis revealed seven putative genes in this region: mocD (moc for mannityl opine catabolism) and mocE, oriented from right to left, and mocRCBAS, oriented from left to right. Significant identities exist at the nucleotide and derived amino acid sequence levels between these moc genes and the mas genes that are responsible for opine biosynthesis in crown gall tumors. MocD is a homolog of Mas2, the anabolic conjugase encoded by mas2'. MocE and MocC are related to the amino half and the carboxyl half, respectively, of Mas1 (MOP reductase), the second enzyme for MOP biosynthesis. These results indicate that the moc and mas genes evolved from a common origin. MocR and MocS are related to each other and to a putative repressor for the AGR degradation system encoded by the rhizogenic plasmid pRiA4. MocB and MocA are homologs of 6-phosphogluconate dehydratase and glucose-6-phosphate dehydrogenase, respectively. Mutations in mocD and mocE, but not mocC, are suppressed by functions encoded by the chromosome or the 450-kb megaplasmid present in many Agrobacterium isolates. We propose that moc genes derived from genes located elsewhere in the bacterial genome and that the tumor-expressed mas genes evolved from the bacterial moc genes.

  11. Construction and Identification of a Recombinant Plasmid Encoding Echinococcus granulosus Oncosphere Antigen (EG95Abstract Background: Cystic echinococcosis (CE, as a zoonotic disease cause to health threat and economic losses. Despite implemented cont

    Directory of Open Access Journals (Sweden)

    Nahideh MAZAHERI

    2017-12-01

    Full Text Available AbstractBackground: Cystic echinococcosis (CE, as a zoonotic disease cause to health threat and economic losses. Despite implemented control programs, few countries have been able to decrease or eliminate this infection. Vaccination of the intermediate host offers an additional strategy to control the parasite transmission and EG95 antigen is considered more than the others in the vaccine issue. According to the high protection induced by the EG95 recombinant vaccine, this study was designed to construct recombinant plasmid formulation of EG95 antigen.Methods: In 2015, the Echinococcus granulosus eggs were recovered from an infected dog in Parasitological laboratory of Tarbiat Modares University in Tehran, Iran. Following hatching, the oncospheres of E. granulosus were activated to increase the presence of the desired mRNA. The extracted mRNA was transcribed to the cDNA which used as template in RT-PCR. Then the EG95 gene cloned into pET28a vector and the recombinant plasmids expression was  investigated in prokaryotic and eukaryotic cells.Results:  The recombinant plasmid encoding EG95 antigen was successfully constructed and identified by PCR, restriction enzyme digestion and sequencing. In vitro expression of the EG95 antigen was confirmed in prokary­otic and eukaryotic systems by SDS-PAGE and western blotting analysis.Conclusion: Because of potential advantages of DNA vaccines, including ability to induce long-term immune responses, low production cost and stability in different temperatures, this study carried out to construct the EG95 gene into a vector. This recombinant vector can be evaluated in further studies as a DNA vaccine may provide new prospects for the development of a vaccine against cystic hydatid disease.

  12. Splitting of the resistive transition of copper oxide superconductors: Intrinsic double superconducting transitions versus extrinsic effects

    International Nuclear Information System (INIS)

    Pomar, A.; Curras, S.R.; Veira, J.A.; Vidal, F.

    1996-01-01

    To prove the possible existence of an intrinsic double superconducting transition in the high-temperature copper oxide superconductors (HTSC), an effect recently attributed by various groups to different intrinsic properties of these materials (including unconventional wave pairing), we present in this paper high resolution data of the electrical resistivity, ρ(T), around the superconducting transition of different single crystal and polycrystal YBa 2 Cu 3 O 7-δ samples. The analysis of the temperature derivative of these ρ(T) data strongly suggests that (i) with a temperature resolution well to within 20 mK, the intrinsic resistive transition of the HTSC does not present any double transition anomaly and (ii) the double peak structure observed in dρ(T)/dT by some authors is probably an extrinsic effect (associated with stoichiometric inhomogeneities in some cases, and with experimental artifacts in other cases). copyright 1996 The American Physical Society

  13. Computer model of copper resistivity will improve the efficiency of field-compression devices

    International Nuclear Information System (INIS)

    Burgess, T.J.

    1977-01-01

    By detonating a ring of high explosive around an existing magnetic field, we can, under certain conditions, compress the field and multiply its strength tremendously. In this way, we can duplicate for a fraction of a second the extreme pressures that normally exist only in the interior of stars and planets. Under such pressures, materials may exhibit behavior that will confirm or alter current notions about the fundamental structure of matter and the ongoing processes in planetary interiors. However, we cannot design an efficient field-compression device unless we can calculate the electrical resistivity of certain basic metal components, which interact with the field. To aid in the design effort, we have developed a computer code that calculates the resistivity of copper and other metals over the wide range of temperatures and pressures found in a field-compression device

  14. Coupled stress-strain and electrical resistivity measurements on copper based shape memory single crystals

    Directory of Open Access Journals (Sweden)

    Gonzalez Cezar Henrique

    2004-01-01

    Full Text Available Recently, electrical resistivity (ER measurements have been done during some thermomechanical tests in copper based shape memory alloys (SMA's. In this work, single crystals of Cu-based SMA's have been studied at different temperatures to analyse the relationship between stress (s and ER changes as a function of the strain (e. A good consistency between ER change values is observed in different experiments: thermal martensitic transformation, stress induced martensitic transformation and stress induced reorientation of martensite variants. During stress induced martensitic transformation (superelastic behaviour and stress induced reorientation of martensite variants, a linear relationship is obtained between ER and strain as well as the absence of hys teresis. In conclusion, the present results show a direct evidence of martensite electrical resistivity anisotropy.

  15. Effect of oxide insertion layer on resistance switching properties of copper phthalocyanine

    Science.gov (United States)

    Joshi, Nikhil G.; Pandya, Nirav C.; Joshi, U. S.

    2013-02-01

    Organic memory device showing resistance switching properties is a next-generation of the electrical memory unit. We have investigated the bistable resistance switching in current-voltage (I-V) characteristics of organic diode based on copper phthalocyanine (CuPc) film sandwiched between aluminum (Al) electrodes. Pronounced hysteresis in the I-V curves revealed a resistance switching with on-off ratio of the order of 85%. In order to control the charge injection in the CuPc, nanoscale indium oxide buffer layer was inserted to form Al/CuPc/In2O3/Al device. Analysis of I-V measurements revealed space charge limited switching conduction at the Al/CuPc interface. The traps in the organic layer and charge blocking by oxide insertion layer have been used to explain the absence of resistance switching in the oxide buffer layered memory device cell. Present study offer potential applications for CuPc organic semiconductor in low power non volatile resistive switching memory and logic circuits.

  16. Variation in adult stress resistance does not explain vulnerability to climate change in copper butterflies.

    Science.gov (United States)

    Klockmann, Michael; Wallmeyer, Leonard; Fischer, Klaus

    2017-03-15

    Ongoing climate change is a major threat to biodiversity. However, although many species clearly suffer from ongoing climate change, others benefit from it, for example, by showing range expansions. However, which specific features determine a species' vulnerability to climate change? Phenotypic plasticity, which has been described as the first line of defence against environmental change, may be of utmost importance here. Against this background, we here compare plasticity in stress tolerance in 3 copper butterfly species, which differ arguably in their vulnerability to climate change. Specifically, we investigated heat, cold and desiccation resistance after acclimatization to different temperatures in the adult stage. We demonstrate that acclimation at a higher temperature increased heat but decreased cold tolerance and desiccation resistance. Contrary to our predictions, species did not show pronounced variation in stress resistance, though plastic capacities in temperature stress resistance did vary across species. Overall, our results seemed to reflect population-rather than species-specific patterns. We conclude that the geographical origin of the populations used should be considered even in comparative studies. However, our results suggest that, in the 3 species studied here, vulnerability to climate change is not in the first place determined by stress resistance in the adult stage. As entomological studies focus all too often on adults only, we argue that more research effort should be dedicated to other developmental stages when trying to understand insect responses to environmental change. © 2017 Institute of Zoology, Chinese Academy of Sciences.

  17. Characterization of hafnium oxide resistive memory layers deposited on copper by atomic layer deposition

    Energy Technology Data Exchange (ETDEWEB)

    Briggs, B.D.; Bishop, S.M. [SUNY College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, NY 12203 (United States); Leedy, K.D. [Air Force Research Laboratory, 2241 Avionics Circle, Wright Patterson Air Force Base, Dayton, OH 45433 (United States); Cady, N.C., E-mail: ncady@albany.edu [SUNY College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, NY 12203 (United States)

    2014-07-01

    Hafnium oxide-based resistive memory devices have been fabricated on copper bottom electrodes. The HfO{sub x} active layers in these devices were deposited by atomic layer deposition (ALD) at 250 °C with tetrakis(dimethylamido)hafnium(IV) as the metal precursor and an O{sub 2} plasma as the reactant. Depth profiles of the HfO{sub x} by X-ray photoelectron spectroscopy and secondary ion mass spectroscopy revealed a copper concentration on the order of five atomic percent throughout the HfO{sub x} film. In addition to the Cu doped HfO{sub x}, a thin layer (20 nm) of Cu{sub x}O is present at the surface. This surface layer is believed to have formed during the ALD process, and greatly complicates the analysis of the switching mechanism. The resistive memory structures fabricated from the ALD HfO{sub x} exhibited non-polar resistive switching, independent of the top metal electrode (Ni, Pt, Al, Au). Resistive switching current voltage (I–V) curves were analyzed using Schottky emission and ionic hopping models to gain insight into the physical mechanisms underpinning the device behavior. During the forming process it was determined that, at voltages in excess of 2.5 V, an ionic hopping model is in good agreement with the I–V data. The extracted ion hopping distance ∼ 4 Å was within the range of interatomic spacing of HfO{sub 2} during the forming process consistent with ionic motion of Cu{sup 2+} ions. Lastly the on state I–V data was dominated at larger voltages by Schottky emission with an estimated barrier height of ∼ 0.5 eV and a refractive index of 2.59. The consequence of the Schottky emission analysis indicates the on state resistance to be a product of a Pt/Cu{sub 2}O/Cu filament(s)/Cu{sub 2}O/Cu structure. - Highlights: • HfO{sub 2} was grown via atomic layer deposition at 250 and 100 °C on Cu substrates. • A Cu{sub 2}O surface layer and Cu doping were observed in post-deposition of HfO{sub 2}. • Resistive memory devices were fabricated and

  18. Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

    International Nuclear Information System (INIS)

    Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

    2017-01-01

    Highlights: • Air atmosphere plasmacould generatehydrophilic groups of photo-resistive film. • Better wettability of photo-resistive filmled tohigher plating uniformity of copper pillars. • New flow isreduced cost, simplified process and elevated productivity. - Abstract: The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O_2−CF_4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of C−O, O−C=O, C=O and −NO_2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

  19. Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

    Energy Technology Data Exchange (ETDEWEB)

    Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China); Gong, Lijun [Research and Development Department, Guangzhou Fastprint Circuit Tech Co., Ltd., Guangzhou 510663 (China); He, Wei, E-mail: heweiz@uestc.edu.cn [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China); Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou 515000 (China)

    2017-07-31

    Highlights: • Air atmosphere plasmacould generatehydrophilic groups of photo-resistive film. • Better wettability of photo-resistive filmled tohigher plating uniformity of copper pillars. • New flow isreduced cost, simplified process and elevated productivity. - Abstract: The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O{sub 2}−CF{sub 4} low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of C−O, O−C=O, C=O and −NO{sub 2} by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

  20. Effects on Tomato Bacterial Canker of Resistance Inducers and Copper Compounds in Greenhouse

    OpenAIRE

    Baştaş, Kubilay

    2014-01-01

    Bacterial canker of tomato caused by Clavibacter michiganensis subsp. michiganensis produces considerable economic losses in many countries because effective control measures are lacking. In this study, the effectiveness of some chemicals, a plant growth regulator (Prohexadione-Ca (PC)), two plant activators (hydrogen peroxide (HP)) and harpin protein (Hrp), fungicides, maneb+copper (MC), copper compounds (copper sulfate pentahydrate (CSP) copper hydroxide (CH) and copper oxychloride (CO)) an...

  1. High resistance to sulfur poisoning of Ni with copper skin under electric field

    Energy Technology Data Exchange (ETDEWEB)

    Xu, Xiaopei; Zhang, Yanxing [College of Physics and Materials Science, Henan Normal University, Xinxiang, Henan 453007 (China); Yang, Zongxian, E-mail: yzx@henannu.edu.cn [College of Physics and Materials Science, Henan Normal University, Xinxiang, Henan 453007 (China); Collaborative Innovation Center of Nano Functional Materials and Applications, Kaifeng, Henan Province (China)

    2017-02-12

    The effects of sulfur poisoning on the (1 0 0), (1 1 0) and (1 1 1) surfaces of pure Ni and Cu/Ni alloy are studied in consideration of the effect of electric field. The effects of Cu dopants on the S poisoning characteristics are analyzed by the means of the density functional theory results in combination with thermodynamics data using the ab initio atomistic thermodynamic method. When the Cu concentration increases to 50% on the surface layer of the Cu/Ni alloy, the (1 1 0) surface becomes the most vulnerable to the sulfur poisoning. Ni with a copper skin can mostly decrease the sulfur poisoning effect. Especially under the electric field of 1.0 V/Å, the sulfur adsorption and phase transition temperature can be further reduced. We therefore propose that Ni surfaces with copper skin can be very effective to improve the resistance to sulfur poisoning of the Ni anode under high electric field. - Highlights: • The electric field and Cu dopant effects on S poisoning feature of Ni are analyzed. • The present of large electric field can enhance S tolerance. • Cu dopant concentration affect the surface electronic structure of Ni. • 100% Cu doping on surface Ni layer can mostly decrease the sulfur poison.

  2. APPLICATION OF METAL RESISTANT BACTERIA BY MUTATIONAL ENHANCMENT TECHNIQUE FOR BIOREMEDIATION OF COPPER AND ZINC FROM INDUSTRIAL WASTES

    Directory of Open Access Journals (Sweden)

    M. R. Shakibaie ، A. Khosravan ، A. Frahmand ، S. Zare

    2008-10-01

    Full Text Available In this research, using mutation in the metal resistant bacteria, the bioremediation of the copper and zinc from copper factory effluents was investigated. Wastewater effluents from flocculation and rolling mill sections of a factory in the city of Kerman were collected and used for further experiments. 20 strains of Pseudomonas spp. were isolated from soil and effluents surrounding factory and identified by microbiological methods. Minimum inhibitory concentrations for copper (Cu and zinc (Zn were determined by agar dilution method. Those strains that exhibited highest minimum inhibitory concentrations values to the metals (5mM were subjected to 400-3200 mg/L concentrations of the three mutagenic agents, acriflavine, acridine orange and ethidium bromide. After determination of subinhibitory concentrations, the minimum inhibitory concentrations values for copper and zinc metal ions were again determined, which showed more than 10 fold increase in minimum inhibitory concentrations value (10 mM for Cu and 20 mM for Zn with P≤0.05. The atomic absorption spectroscopy of dried biomass obtained from resistant strains after exposure to mutagenic agents revealed that strains 13 accumulate the highest amount of intracellular copper (0.35% Cu/mg dried biomass and strain 10 showed highest accumulation of zinc (0.3% Zn/mg dried biomass respectively with P≤0.05. From above results it was concluded that the treatment of industrial waste containing heavy metals by artificially mutated bacteria may be appropriate solution for effluent disposal problems.

  3. The effect of boron implantation on the corrosion behaviour, microhardness and contact resistance of copper and silver surfaces

    International Nuclear Information System (INIS)

    Henriksen, O.; Johnson, E.; Johansen, A.; Sarholt-Kristensen, L.

    1986-01-01

    In order to investigate the influence of boron implantation on the corrosion resistance of electrical contacts, a number of pure copper, pure silver and copper edge connector samples have been implanted with boron (40 keV) to fluences of 5.10 20 m -2 and 2.10 21 m -2 . Atmospheric corrosion tests of the implanted species were conducted using the following exposures: H 2 S (12.5 ppm, 4 days), SO 2 (25 ppm, 21 days), saltfog (5% NaCl, 1 day), moist air (93% RH, 56 days), and hot/dry air (70 C, 56 days). The boron implantations lead to a significant reduction in the sulphidation rate of copper and silver. The corrosive film formed during exposure in H 2 S and SO 2 atmospheres is confined to pitted regions on the implanted areas, while a thick and relatively uniform film formation is observed on the unimplanted samples. The corrosion resistance of copper and silver in saltfog atmosphere is somewhat improved by boron implantation, whilst the results from exposures to moist air or hot/dry air are inconclusive. The improved corrosion behaviour is accompanied by an increase in the contact resistance and in the microhardness of the implanted samples. (orig.)

  4. Correlation models between environmental factors and bacterial resistance to antimony and copper.

    Directory of Open Access Journals (Sweden)

    Zunji Shi

    Full Text Available Antimony (Sb and copper (Cu are toxic heavy metals that are associated with a wide variety of minerals. Sb(III-oxidizing bacteria that convert the toxic Sb(III to the less toxic Sb(V are potentially useful for environmental Sb bioremediation. A total of 125 culturable Sb(III/Cu(II-resistant bacteria from 11 different types of mining soils were isolated. Four strains identified as Arthrobacter, Acinetobacter and Janibacter exhibited notably high minimum inhibitory concentrations (MICs for Sb(III (>10 mM,making them the most highly Sb(III-resistant bacteria to date. Thirty-six strains were able to oxidize Sb(III, including Pseudomonas-, Comamonas-, Acinetobacter-, Sphingopyxis-, Paracoccus- Aminobacter-, Arthrobacter-, Bacillus-, Janibacter- and Variovorax-like isolates. Canonical correspondence analysis (CCA revealed that the soil concentrations of Sb and Cu were the most obvious environmental factors affecting the culturable bacterial population structures. Stepwise linear regression was used to create two predictive models for the correlation between soil characteristics and the bacterial Sb(III or Cu(II resistance. The concentrations of Sb and Cu in the soil was the significant factors affecting the bacterial Sb(III resistance, whereas the concentrations of S and P in the soil greatly affected the bacterial Cu(II resistance. The two stepwise linear regression models that we derived are as follows: MIC(Sb(III=606.605+0.14533 x C(Sb+0.4128 x C(Cu and MIC((Cu(II=58.3844+0.02119 x C(S+0.00199 x CP [where the MIC(Sb(III and MIC(Cu(II represent the average bacterial MIC for the metal of each soil (μM, and the C(Sb, C(Cu, C(S and C(P represent concentrations for Sb, Cu, S and P (mg/kg in soil, respectively, p<0.01]. The stepwise linear regression models we developed suggest that metals as well as other soil physicochemical parameters can contribute to bacterial resistance to metals.

  5. Control of Copper Resistance and Inorganic Sulfur Metabolism by Paralogous Regulators in Staphylococcus aureus*

    Science.gov (United States)

    Grossoehme, Nicholas; Kehl-Fie, Thomas E.; Ma, Zhen; Adams, Keith W.; Cowart, Darin M.; Scott, Robert A.; Skaar, Eric P.; Giedroc, David P.

    2011-01-01

    All strains of Staphylococcus aureus encode a putative copper-sensitive operon repressor (CsoR) and one other CsoR-like protein of unknown function. We show here that NWMN_1991 encodes a bona fide Cu(I)-inducible CsoR of a genetically unlinked copA-copZ copper resistance operon in S. aureus strain Newman. In contrast, an unannotated open reading frame found between NWMN_0027 and NWMN_0026 (denoted NWMN_0026.5) encodes a CsoR-like regulator that represses expression of adjacent genes by binding specifically to a pair of canonical operator sites positioned in the NWMN_0027–0026.5 intergenic region. Inspection of these regulated genes suggests a role in assimilation of inorganic sulfur from thiosulfate and vectorial sulfur transfer, and we designate NWMN_0026.5 as CstR (CsoR-like sulfur transferase repressor). Expression analysis demonstrates that CsoR and CstR control their respective regulons in response to distinct stimuli with no overlap in vivo. Unlike CsoR, CstR does not form a stable complex with Cu(I); operator binding is instead inhibited by oxidation of the intersubunit cysteine pair to a mixture of disulfide and trisulfide linkages by a likely metabolite of thiosulfate assimilation, sulfite. CsoR is unreactive toward sulfite under the same conditions. We conclude that CsoR and CstR are paralogs in S. aureus that function in the same cytoplasm to control distinct physiological processes. PMID:21339296

  6. Control of copper resistance and inorganic sulfur metabolism by paralogous regulators in Staphylococcus aureus.

    Science.gov (United States)

    Grossoehme, Nicholas; Kehl-Fie, Thomas E; Ma, Zhen; Adams, Keith W; Cowart, Darin M; Scott, Robert A; Skaar, Eric P; Giedroc, David P

    2011-04-15

    All strains of Staphylococcus aureus encode a putative copper-sensitive operon repressor (CsoR) and one other CsoR-like protein of unknown function. We show here that NWMN_1991 encodes a bona fide Cu(I)-inducible CsoR of a genetically unlinked copA-copZ copper resistance operon in S. aureus strain Newman. In contrast, an unannotated open reading frame found between NWMN_0027 and NWMN_0026 (denoted NWMN_0026.5) encodes a CsoR-like regulator that represses expression of adjacent genes by binding specifically to a pair of canonical operator sites positioned in the NWMN_0027-0026.5 intergenic region. Inspection of these regulated genes suggests a role in assimilation of inorganic sulfur from thiosulfate and vectorial sulfur transfer, and we designate NWMN_0026.5 as CstR (CsoR-like sulfur transferase repressor). Expression analysis demonstrates that CsoR and CstR control their respective regulons in response to distinct stimuli with no overlap in vivo. Unlike CsoR, CstR does not form a stable complex with Cu(I); operator binding is instead inhibited by oxidation of the intersubunit cysteine pair to a mixture of disulfide and trisulfide linkages by a likely metabolite of thiosulfate assimilation, sulfite. CsoR is unreactive toward sulfite under the same conditions. We conclude that CsoR and CstR are paralogs in S. aureus that function in the same cytoplasm to control distinct physiological processes.

  7. Diversity and role of plasmids in adaptation of bacteria inhabiting the Lubin copper mine in Poland, an environment rich in heavy metals

    Directory of Open Access Journals (Sweden)

    Lukasz eDziewit

    2015-03-01

    Full Text Available The Lubin underground mine, is one of three mining divisions in the Lubin-Glogow Copper District in Lower Silesia province (Poland. It is the source of polymetallic ore that is rich in copper, silver and several heavy metals. Black shale is also significantly enriched in fossil organic matter in the form of long-chain hydrocarbons, polycyclic aromatic hydrocarbons, organic acids, esters, thiophenes and metalloporphyrins. Biological analyses have revealed that this environment is inhabited by extremophilic bacteria and fungi. Kupfershiefer black shale and samples of water, bottom and mineral sediments from the underground (below 600 m Lubin mine were taken and twenty bacterial strains were isolated and characterized. All exhibited multi-resistant and hypertolerant phenotypes to heavy metals. We analyzed the plasmidome of these strains in order to evaluate the diversity and role of mobile DNA in adaptation to the harsh conditions of the mine environment. Experimental and bioinformatic analyses of 11 extrachromosomal replicons were performed. Three plasmids, including a broad-host-range replicon containing a Tn3 family transposon, carried genes conferring resistance to arsenic, cadmium, cobalt, mercury and zinc. Functional analysis revealed that the resistance modules exhibit host specificity, i.e. they may increase or decrease tolerance to toxic ions depending on the host strain. The other identified replicons showed diverse features. Among them we identified a catabolic plasmid encoding enzymes involved in the utilization of histidine and vanillate, a putative plasmid-like prophage carrying genes responsible for NAD biosynthesis, and two repABC-type plasmids containing virulence-associated genes. These findings provide an unique molecular insight into the pool of extrachromosomal replicons and highlight their role in the biology and adaptation of extremophilic bacteria inhabiting terrestrial deep subsurface.

  8. Crystal structure and dimerization equilibria of PcoC, a methionine-rich copper resistance protein from Escherichia coli

    Energy Technology Data Exchange (ETDEWEB)

    Wernimont, A.K.; Huffman, D.L.; Finney, L.A.; Demeler, B.; O' Halloran, T.V.; Rosenzweig, A.C.

    2010-03-08

    PcoC is a soluble periplasmic protein encoded by the plasmid-born pco copper resistance operon of Escherichia coli. Like PcoA, a multicopper oxidase encoded in the same locus and its chromosomal homolog CueO, PcoC contains unusual methionine rich sequences. Although essential for copper resistance, the functions of PcoC, PcoA, and their conserved methionine-rich sequences are not known. Similar methionine motifs observed in eukaryotic copper transporters have been proposed to bind copper, but there are no precedents for such metal binding sites in structurally characterized proteins. The high-resolution structures of apo PcoC, determined for both the native and selenomethionine-containing proteins, reveal a seven-stranded barrel with the methionines unexpectedly housed on a solvent-exposed loop. Several potential metal-binding sites can be discerned by comparing the structures to spectroscopic data reported for copper-loaded PcoC. In the native structure, the methionine loop interacts with the same loop on a second molecule in the asymmetric unit. In the selenomethionine structure, the methionine loops are more exposed, forming hydrophobic patches on the protein surface. These two arrangements suggest that the methionine motifs might function in protein-protein interactions between PcoC molecules or with other methionine-rich proteins such as PcoA. Analytical ultracentrifugation data indicate that a weak monomer-dimer equilibrium exists in solution for the apo protein. Dimerization is significantly enhanced upon binding Cu(I) with a measured {Delta}({Delta}G{sup o}) {le} -8.0 kJ/mole, suggesting that copper might bind at the dimer interface.

  9. The effects of low-level ionizing radiation and copper exposure on the incidence of antibiotic resistance in lentic biofilm bacteria.

    Science.gov (United States)

    McArthur, J Vaun; Dicks, Christian A; Bryan, A Lawrence; Tuckfield, R Cary

    2017-09-01

    Environmental reservoirs of antibiotic resistant bacteria are poorly understood. Understanding how the environment selects for resistance traits in the absence of antibiotics is critical in developing strategies to mitigate this growing menace. Indirect or co-selection of resistance by environmental pollution has been shown to increase antibiotic resistance. However no attention has been given to the effects of low-level ionizing radiation or the interactions between radiation and heavy metals on the maintenance or selection for antibiotic resistance (AR) traits. Here we explore the effect of radiation and copper on antibiotic resistance. Bacteria were collected from biofilms in two ponds - one impacted by low-level radiocesium and the other an abandoned farm pond. Through laboratory controlled experiments we examined the effects of increasing concentrations of copper on the incidence of antibiotic resistance. Differences were detected in the resistance profiles of the controls from each pond. Low levels (0.01 mM) of copper sulfate increased resistance but 0.5 mM concentrations of copper sulfate depressed the AR response in both ponds. A similar pattern was observed for levels of multiple antibiotic resistance per isolate. The first principal component response of isolate exposure to multiple antibiotics showed significant differences among the six isolate treatment combinations. These differences were clearly visualized through a discriminant function analysis, which showed distinct antibiotic resistance response patterns based on the six treatment groups. Copyright © 2017 Elsevier Ltd. All rights reserved.

  10. Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

    Science.gov (United States)

    Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

    2017-07-01

    The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2sbnd CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of Csbnd O, Osbnd Cdbnd O, Cdbnd O and sbnd NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

  11. Evaluation of a new laser-resistant fabric and copper foil-wrapped endotracheal tube.

    Science.gov (United States)

    Sosis, M B; Braverman, B; Caldarelli, D D

    1996-07-01

    The risk of an endotracheal tube's combustion during laser airway surgery necessitates the use of special anesthetic techniques and equipment to prevent this complication. This study was designed to evaluate the Laser-Trach(TM), a new laser-resistant rubber endotracheal tube for use during laser airway surgery. The Laser-Trach endotracheal tubes that were evaluated were size 6.0 mm internal diameter (ID) red rubber endotracheal tubes which had been commercially wrapped by Kendall-Sheridan (Mansfield, Mass.) with copper foil tape and overwrapped with fabric. The fabric layer was saturated with water prior to our tests, as recommended by the manufacturer. The Laser-Trach endotracheal tubes were compared with plain (bare) size 6.0 mm ID Rusch red rubber endotracheal tubes. The tubes under study were positioned horizontally on wet towels in air and had 5 L x min(-1) of oxygen flowing through them. They were subjected to continuous laser radiation at 40 W from either a CO2 or an Nd-YAG laser. The Nd-YAG laser was propagated via a 600-micron fiber bundle. Each laser was directed perpendicularly at the shaft of the endotracheal tube being studied, and its output was continued until a blowtorch fire occurred or 60 seconds had elapsed. Sixty seconds of CO2 laser fire did not ignite any of the eight Laser-Trach endotracheal tubes tested. However, blowtorch ignition of all eight bare rubber tubes tested occurred after 0.87 +/- 0.21 (mean +/- SD) seconds of CO2 laser fire. Nd-YAG laser contact with the Laser-Trach endotracheal tubes caused the perforation and blowtorch ignition of all eight tubes tested after 18.79 +/- 7.83 seconds. This was a significantly (Presistant to the C02 laser. However, this endotracheal tube is not recommended for use with the Nd-YAG laser.

  12. Plasmid-Mediated Resistance to Thrombin-Induced Platelet Microbicidal Protein in Staphylococci: Role of the qacA Locus

    OpenAIRE

    Kupferwasser, Leon Iri; Skurray, Ronald A.; Brown, Melissa H.; Firth, Neville; Yeaman, Michael R.; Bayer, Arnold S.

    1999-01-01

    Thrombin-induced platelet microbicidal protein 1 (tPMP-1) is a small, cationic peptide released from rabbit platelets following thrombin stimulation. In vitro resistance to this peptide among strains of Staphylococcus aureus correlates with the survival advantage of such strains at sites of endothelial damage in humans as well as in experimental endovascular infections. The mechanisms involved in the phenotypic resistance of S. aureus to tPMP-1 are not fully delineated. The plasmid-encoded st...

  13. Copper bis(diphosphine) complexes: radiopharmaceuticals for the detection of multi-drug resistance in tumours by PET

    International Nuclear Information System (INIS)

    Lewis, J.S.; Dearling, J.L.S.; Blower, P.J.; Sosabowski, J.K.; Zweit, J.; Carnochan, P.; Kelland, L.R.; Coley, H.M.

    2000-01-01

    Experience with imaging of the multi-drug resistance (MDR) phenotype in tumours using technetium-99m sestamibi, a substrate of the P-glycoprotein (Pgp) transporter, suggests that better quantification of images and separation of MDR from other variables affecting tracer uptake in tumours are required. One approach to these problems is the development of short half-life positron-emitting tracers which are substrates of Pgp. Several lipophilic cationic copper(I) bis(diphosphine) complexes labelled with copper-64 have been synthesised and evaluated in vitro as substrates for Pgp. The synthesis is rapid and efficient with no need for purification steps. The chemistry is suitable for use with very short half-life radionuclides such as copper-62 (9.7 min) and copper-60 (23.7 min). Incubation of the complexes with human serum in vitro showed that they are sufficiently stable in serum to support clinical imaging, and the more lipophilic members of the series are taken up rapidly by cells (Chinese hamster ovary and human ovarian carcinoma) in vitro with great avidity. Uptake in human ovarian carcinoma cells is significantly reduced after several months of conditioning in the presence of doxorubicin, which induces increased Pgp expression. Uptake in hooded rat sarcoma (HSN) cells, which express Pgp, is significantly increased in the presence of the MDR modulator cyclosporin A. Biodistribution studies in hooded rats show rapid blood clearance, excretion through both kidneys and liver, and low uptake in other tissues. The one complex investigated in HSN tumour-bearing rats showed uptake in tumour increasing up to 30 min p.i. while it was decreasing in other tissues. We conclude that diphosphine ligands offer a good basis for development of radiopharmaceuticals containing copper radionuclides, and that this series of complexes should undergo further evaluation in vivo as positron emission tomography imaging agents for MDR. (orig.)

  14. Effects of chlortetracycline and copper on tetracyclines and copper resistance genes and microbial community during swine manure anaerobic digestion.

    Science.gov (United States)

    Wang, Rui; Chen, Meixue; Feng, Feng; Zhang, Junya; Sui, Qianwen; Tong, Juan; Wei, Yuansong; Wei, Dongbin

    2017-08-01

    As antibiotic and heavy metals are over used in the livestock industry, animal manure is a reservoir of antibiotic resistance genes (ARGs). Anaerobic digestion has been reported to have the potential to reduce ARGs. However, few studies investigated whether reduction of ARGs would be affected by different external pressures including antibiotics and heavy metals during anaerobic digestion. The purpose of this study was thus to investigate effects of both chlortetracycline (CTC) and Cu on reduction of ARGs, heavy metal resistance genes (HMRGs) and mobile genetic elements (MGEs) during the swine manure anaerobic digestion. The results showed that the predominant ARGs (tetO, tetW, tetX, tetL) could be effectively reduced (approximately 1.00 log copies/g TS) through mesophilic anaerobic digestion. Microbial community evolution was the main driver. It was interesting that Treponema might indicate the termination of anaerobic digestion and compete with ARGs host bacteria. Addition of CTC, Cu and CTC+Cu affected microbial community change and hindered removal of ARGs, especially, CTC+Cu seriously affected Treponema and ARGs during anaerobic digestion. Copyright © 2017 Elsevier Ltd. All rights reserved.

  15. Effects of chlortetracycline and copper supplementation on the prevalence, distribution, and quantity of antimicrobial resistance genes in the fecal metagenome of weaned pigs.

    Science.gov (United States)

    Agga, Getahun E; Scott, H Morgan; Vinasco, Javier; Nagaraja, T G; Amachawadi, Raghavendra G; Bai, Jianfa; Norby, Bo; Renter, David G; Dritz, Steve S; Nelssen, Jim L; Tokach, Mike D

    2015-05-01

    Use of in-feed antibiotics such as chlortetracycline (CTC) in food animals is fiercely debated as a cause of antimicrobial resistance in human pathogens; as a result, alternatives to antibiotics such as heavy metals have been proposed. We used a total community DNA approach to experimentally investigate the effects of CTC and copper supplementation on the presence and quantity of antimicrobial resistance elements in the gut microbial ecology of pigs. Total community DNA was extracted from 569 fecal samples collected weekly over a 6-week period from groups of 5 pigs housed in 32 pens that were randomized to receive either control, CTC, copper, or copper plus CTC regimens. Qualitative and quantitative PCR were used to detect the presence of 14 tetracycline resistance (tet) genes and to quantify gene copies of tetA, tetB, blaCMY-2 (a 3rd generation cephalosporin resistance gene), and pcoD (a copper resistance gene), respectively. The detection of tetA and tetB decreased over the subsequent sampling periods, whereas the prevalence of tetC and tetP increased. CTC and copper plus CTC supplementation increased both the prevalence and gene copy numbers of tetA, while decreasing both the prevalence and gene copies of tetB. In summary, tet gene presence was initially very diverse in the gut bacterial community of weaned pigs; thereafter, copper and CTC supplementation differentially impacted the prevalence and quantity of the various tetracycline, ceftiofur and copper resistance genes resulting in a less diverse gene population. Published by Elsevier B.V.

  16. Surfactant-free electrodeposition of reduced graphene oxide/copper composite coatings with enhanced wear resistance

    Science.gov (United States)

    Mai, Y. J.; Zhou, M. P.; Ling, H. J.; Chen, F. X.; Lian, W. Q.; Jie, X. H.

    2018-03-01

    How to uniformly disperse graphene sheets into the electrolyte is one of the main challenges to synthesize graphene enhanced nanocomposites by electrodeposition. A surfactant-free colloidal solution comprised of copper (II)-ethylene diamine tetra acetic acid ([CuIIEDTA]2-) complexes and graphene oxide (GO) sheets is proposed to electrodeposit reduced graphene oxide/copper (RGO/Cu) composite coatings. Anionic [CuIIEDTA]2- complexes stably coexist with negatively charged GO sheets due to the electrostatic repulsion between them, facilitating the electrochemical reduction and uniform dispersion of GO sheets into the copper matrix. The RGO/Cu composite coatings are well characterized by XRD, Raman, SEM and XPS. Their tribological behavior as a function of RGO content in composite coatings and normal loads are investigated. Also the chemical composition and topography of the wear tracks for the composite coatings are analyzed to deduce the lubricating and anti-wear mechanism of RGO/Cu composite coatings.

  17. Copper amendment of agricultural soil selects for bacterial antibiotic resistance in the field

    DEFF Research Database (Denmark)

    Berg, J.; Tom-Petersen, A.; Nybroe, O.

    2005-01-01

    -amendment significantly increased the frequency of Cu-resistant isolates. A panel of isolates were characterized by Gram-reaction, amplified ribosomal DNA restriction analysis and resistance profiling against seven antibiotics. More than 95% of the Cu-resistant isolates were Gram-negative. Cu-resistant Gram...

  18. Fabrication of Nano-Crossbar Resistive Switching Memory Based on the Copper-Tantalum Pentoxide-Platinum Device Structure

    Science.gov (United States)

    Olga Gneri, Paula; Jardim, Marcos

    Resistive switching memory has been of interest lately not only for its simple metal-insulator-metal (MIM) structure but also for its promising ease of scalability an integration into current CMOS technologies like the Field Programmable Gate Arrays and other non-volatile memory applications. There are several resistive switching MIM combinations but under this scope of research, attention will be paid to the bipolar resistive switching characteristics and fabrication of Tantalum Pentaoxide sandwiched between platinum and copper. By changing the polarity of the voltage bias, this metal-insulator-metal (MIM) device can be switched between a high resistive state (OFF) and low resistive state (ON). The change in states is induced by an electrochemical metallization process, which causes a formation or dissolution of Cu metal filamentary paths in the Tantalum Pentaoxide insulator. There is very little thorough experimental information about the Cu-Ta 2O5-Pt switching characteristics when scaled to nanometer dimensions. In this light, the MIM structure was fabricated in a two-dimensional crossbar format. Also, with the limited available resources, a multi-spacer technique was formulated to localize the active device area in this MIM configuration to less than 20nm. This step is important in understanding the switching characteristics and reliability of this structure when scaled to nanometer dimensions.

  19. Effectiveness of 5-Pyrrolidone-2-carboxylic Acid and Copper Sulfate Pentahydrate Association against Drug Resistant Staphylococcus Strains.

    Science.gov (United States)

    Governa, Paolo; Miraldi, Elisabetta; De Fina, Gianna; Biagi, Marco

    2016-04-01

    Bacterial resistance is an ongoing challenge for pharmacotherapy and pharmaceutical chemistry. Staphylococcus aureus is the bacterial species which makes it most difficult to treat skin and soft tissue infections and it is seen in thousands of hospitalization cases each year. Severe but often underrated infectious diseases, such as complicated nasal infections, are primarily caused by MRSA and S. epidermidis too. With the aim of studying new drugs with antimicrobial activity and effectiveness on drug resistant Staphylococcus strains, our attention in this study was drawn on the activity of a new association between two natural products: 5-pyrrolidone-2-carboxylic acid (PCA), naturally produced by certain Lactobacillus species, and copper sulfate pentahydrate (CS). The antimicrobial susceptibility test was conducted taking into account 12 different Staphylococcus strains, comprising 6 clinical isolates and 6 resistant strains. PCA 4%, w/w, and CS 0.002%, w/w, association in distilled water solution was found to have bactericidal activity against all tested strains. Antimicrobial kinetics highlighted that PCA 4%, w/w, and CS 0.002% association could reduce by 5 log10 viable bacterial counts of MRSA and oxacillin resistant S. epidennidis in less than 5 and 3 minutes respectively. Microscopic investigations suggest a cell wall targeting mechanism of action. Being very safe and highly tolerated, the natural product PCA and CS association proved to be a promising antimicrobial agent to treat Staphylococcus related infections.

  20. Increase of the electrical resistance of thin copper film due to 14 MeV neutron irradiation

    International Nuclear Information System (INIS)

    Agrawal, S.K.; Kumar, U.; Nigam, A.K.; Singh, S.P.

    1981-01-01

    The variation in the electrical resistance of thin copper film (500 A 0 thick), grown on the glass slide has been measured with increasing 14 MeV neutron irradiation time. The electrical resistance vs irradiation time curve shows an interesting behaviour after an irradiation of 40 minutes. However, there is a net increase in the electrical resistance with increasing neutron dose. The maximum increase in the observed electrical resistance after an irradiation of 115 mins, is 4.45%. The microstructural studies of irradiated film were made using TEM and TED techniques. The TEM patterns up to an irradiation time of 1.00 hr do not show any appreciable change in the microstructure. The TED patterns also do not show any appreciable change in the diffraction pattern up to an irradiation time of 1.0 hr. But after an irradiation time of 1.5 hrs, two extra rings appear in the TED pattern which disappear with increasing neutron irradiation time

  1. Effect of implanted doses of N+-ions on the contact resistance of copper contacts

    International Nuclear Information System (INIS)

    Dubravec, B.; Kovac, P.; Lipka, F.; Padysak, M.

    1997-01-01

    The paper deals with the effect of implanted doses of N + ions on the contact resistance. Dependencies of the contact resistance versus contact force R c =f(F c ) and microhardness of implanted surfaces were measured for three implanted profiles. The influence of the aggressive environs on the contact resistance of implanted contact is given too

  2. Detection of an IncA/C plasmid encoding VIM-4 and CMY-4 β-lactamases in Klebsiella oxytoca and Citrobacter koseri from an inpatient in a cardiac rehabilitation unit.

    Science.gov (United States)

    Caltagirone, Mariasofia; Bitar, Ibrahim; Piazza, Aurora; Spalla, Melissa; Nucleo, Elisabetta; Navarra, Antonella; Migliavacca, Roberta

    2015-07-01

    A 62-year-old patient was transferred to the cardiac rehabilitation unit of the I.R.C.C.S. Fondazione S. Maugeri after undergoing a heart transplantation at the Acute Care Hospital I.R.C.C.S. S. Matteo of Pavia. On 1 August 2013 and during hospitalization in the rehabilitation unit, Klebsiella oxytoca and Citrobacter koseri clinical isolates were simultaneously recovered from the patient's preputial swab. Both the K. oxytoca and C. koseri strains were carbapenem- resistant by MicroScan System (Beckman Coulter). Carbapenem-resistant K. pneumoniae had previously been reported in the same rehabilitation facility. The aim of the study was to identify the carbapenem resistance mechanisms among the enterobacterial species recovered. Phenotypic screening tests useful to detect the β-lactamases/carbapenemases were performed. Carbapenem MICs were obtained by Etest. AmpC and MBL encoding genes were identified by PCR and sequencing. Conjugation assays and plasmid characterization were performed. Both of the K. oxytoca and C. koseri isolates were multi drug resistant, showing resistance to amoxicillin-clavulanic acid, three generation cephalosporins, ertapenem (K. oxytoca MIC, >32 mg/L; C. koseri MIC, 4 mg/L), imipenem (K. oxytoca MIC, 4 mg/L; C. koseri MIC, 12 mg/L), thrimethoprim sulphamethoxazole and gentamicin. Susceptibility was retained to fluoroquinolones, colistin and tigecycline. Molecular characterization confirmed the co-presence of blaCMY-4 and blaVIM-4 determinants in a 150 Kb transferable plasmid of IncA/C group. This case is the first detection in Italy of the K. oxytoca and C. koseri clinical isolates co-producing the CMY-4 and VIM-4 enzymes.

  3. Durable Corrosion Resistance of Copper Due to Multi-Layer Graphene

    Directory of Open Access Journals (Sweden)

    Abhishek Tiwari

    2017-09-01

    Full Text Available Ultra-thin graphene coating has been reported to provide considerable resistance against corrosion during short-term exposures, however, there is great variability in the corrosion resistance due to graphene coating in different studies. It may be possible to overcome the problem of hampered corrosion protection ability of graphene that is caused due to defective single layer graphene by applying multilayer graphene. Systematic electrochemical characterization showed that the multilayer graphene coating developed in the study provided significant corrosion resistance in a chloride solution and the corrosion resistance was sustained for long durations (~400 h, which is attributed to the multilayer graphene.

  4. Trophic-metabolic activity of earthworms (Lumbricidae as a zoogenic factor of maintaining reclaimed soils’ resistance to copper contamination

    Directory of Open Access Journals (Sweden)

    Y. L. Kulbachko

    2014-07-01

    which restricts movement of excess chemicals, maintains stability and increases resistance to soil contamination, in particular, with copper. Besides, it is possible to accelerate the artificial forest edaphotop naturalization on reclaimed land, and to increase its ecological value

  5. Efficiency of copper and cupronickel substratum to resist development of diatom biofilms

    Digital Repository Service at National Institute of Oceanography (India)

    Patil, J.S.; Anil, A.C.

    Incorporated, pp. 445-486 French, M.S., Evans, L.V., 1988. The effects of copper and zinc on growth of the fouling diatoms Amphora and Amphiprora. Biofouling. 1, 3-18 Fitridge, I., Dempster, T., Guenther, J., de Nys, R., 2012. The impact and control...–694. Muthukrishnan et al. 2014Muthukrishnan, T., Abed, R.M.M., Dobretsov, S., Kidd, B., Finnie, A.A., 2014. Long-term microfouling on commercial biocidal fouling control coatings. Biofouling. 30(10), 1155-1164. Parsons TR, Maita Y, Lalli CM (1984) A manual...

  6. Host-Specific Patterns of Genetic Diversity among IncI1-I gamma and IncK Plasmids Encoding CMY-2 beta-Lactamase in Escherichia coli Isolates from Humans, Poultry Meat, Poultry, and Dogs in Denmark

    DEFF Research Database (Denmark)

    Hansen, Katrine Hartung; Bortolaia, Valeria; Nielsen, Christine Ahl

    2016-01-01

    and commensal E. coli isolates collected from 2006 to 2012 from humans, retail poultry meat, broilers, and dogs. Multilocus sequence typing (MLST), antimicrobial susceptibility testing, and conjugation were performed in conjunction with plasmid replicon typing, plasmid multilocus sequence typing (p......MLST), restriction fragment length polymorphism (RFLP), and sequencing of selected bla(CMY-2)-harboring plasmids. MLST revealed high strain diversity, with few E. coli lineages occurring in multiple host species and sample types. bla(CMY-2) was detected on plasmids in 83 (89%) isolates. Most (75%) of the plasmids...... were conjugative and did not (96%) cotransfer resistance to antimicrobials other than cephalosporins. The main replicon types identified were IncI1-I gamma (55%) and IncK (39%). Isolates from different host species mainly carried distinct plasmid subtypes. Seven of the 18 human isolates harbored IncI1...

  7. Effects of Copper and Sulfur Additions on Corrosion Resistance and Machinability of Austenitic Stainless Steel

    International Nuclear Information System (INIS)

    Kim, Soon Tae; Park, Yong Soo; Kim, Hyung Joon

    1999-01-01

    Effects of Cu and S on corrosion resistance and machinability of austenitic stainless steel were investigated using immersion test, metallographic examination, Auger surface analysis and tool life test with single point turning tools. Corrosion resistance of the experimental Cu containing alloys in 18.4N H 2 SO 4 at 80 ∼ 120 .deg. C and 3N HCl at 40 .deg. C decreased as S content increased. However, one of the experimental alloys (Fe- 18%Cr- 21%Ni-3.2%Mo- 1.6%W- 0.2%N- 3.1%Cu- 0.091%S) showed general and pitting corrosion resistance equivalent to that of CW12MW in highly concentrated SO 4 2- environment. The alloy also showed pitting corrosion resistance superior to super stainless steel such as 654SMO in Cl - environment. The reasons why the increase in S content deteriorated the corrosion resistance were first, that the number and size of (Mn, Cr)S sulfides having corrosion resistance lower than that of matrix increased, leading to pitting corrosion and second, that rapid dissolution of the matrix around the pits was caused by adsorbed S. However, the alloy containing 3.1 %Cu and 0.091 % S maintained high general and pitting corrosion resistance due to heavily enriched noble Cu through selective dissolution of active Fe and Ni. The tool life for 3.1 % Cu + 0.091 % S added alloy was about four times that of 0.06%Cu + 0.005% S added alloy due to high shear strain rate generated by Cu addition giving easy cross slip of dislocation, lubrication of ductile (Mn, Cr)S sulfides adhering to tool crater surface and low cutting force resulting from thin continuous sulfides formed in chips during machining

  8. Single vs. double dose of copper oxide wire particles (COWP) for treatment of anthelmintic resistant Haemonchus contortus in weanling lambs.

    Science.gov (United States)

    Schweizer, Nikki M; Foster, Derek M; Knox, William B; Sylvester, Hannah J; Anderson, Kevin L

    2016-10-15

    Haemonchus contortus parasitism is a major disease of sheep, with these parasites frequently demonstrating multi-drug class anthelmintic resistance. Copper oxide wire particles (COWP) have shown potential as adjuncts or alternatives to anthelmintics in resistant flocks. The purpose of this study was to compare the efficacy of two different COWP treatment regimens or placebo in the control of H. contortus in weaned lambs within a flock historically shown to have multi-drug resistant H. contortus using the DrenchRite ® assay. Data from 43 lambs within 3 treatment groups in a double blind study were included in the experiment. Treatments were administered as a total of 2 boluses, each given on separate occasions (day 0 and day 42), so that each lamb received either 2 placebos, a single dose of 2g COWP followed by placebo, or two doses of 1g COWP. Strongyle-type fecal egg counts (FEC) were performed at initial treatment (day 0), on day 10, at second treatment (day 42), on day 52, and at study end (day 84). At the start of the trial, mean±standard deviation FEC were 1634.4±825.2, 2241.7±1496.8, and 2013.3±1194.2epg for the 2g, 1g×2, and control groups, respectively. At the end of the trial, FEC were 757.1±825.3, 483.4±557.2, and 1660.0±1345.3epg for the 2g, 1g×2, and control groups, respectively. Lambs given a 2g single dose of COWP or a 1g dose of COWP twice had reductions in strongyle-type FEC (p≤0.01) from trial start to trial end, whereas lambs given placebo did not. Average daily gains did not differ significantly among groups. Although copper is potentially toxic to sheep, no signs of toxicity were observed during this trial, which was consistent with similar studies at this treatment dose. The study indicated that administering COWP to lambs at weaning reduced FEC. Copyright © 2016 Elsevier B.V. All rights reserved.

  9. Pyruvic oxime nitrification and copper and nickel resistance by a Cupriavidus pauculus, an active heterotrophic nitrifier-denitrifier.

    Science.gov (United States)

    Ramirez, Miguel; Obrzydowski, Jennifer; Ayers, Mary; Virparia, Sonia; Wang, Meijing; Stefan, Kurtis; Linchangco, Richard; Castignetti, Domenic

    2014-01-01

    Heterotrophic nitrifiers synthesize nitrogenous gasses when nitrifying ammonium ion. A Cupriavidus pauculus, previously thought an Alcaligenes sp. and noted as an active heterotrophic nitrifier-denitrifier, was examined for its ability to produce nitrogen gas (N2) and nitrous oxide (N2O) while heterotrophically nitrifying the organic substrate pyruvic oxime [CH3-C(NOH)-COOH]. Neither N2 nor N2O were produced. Nucleotide and phylogenetic analyses indicated that the organism is a member of a genus (Cupriavidus) known for its resistance to metals and its metabolism of xenobiotics. The microbe (a Cupriavidus pauculus designated as C. pauculus strain UM1) was examined for its ability to perform heterotrophic nitrification in the presence of Cu(2+) and Ni(2+) and to metabolize the xenobiotic phenol. The bacterium heterotrophically nitrified well when either 1 mM Cu(2+) or 0.5 mM Ni(2+) was present in either enriched or minimal medium. The organism also used phenol as a sole carbon source in either the presence or absence of 1 mM Cu(2+) or 0.5 mM Ni(2+). The ability of this isolate to perform a number of different metabolisms, its noteworthy resistance to copper and nickel, and its potential use as a bioremediation agent are discussed.

  10. Facile fabrication of superhydrophobic surface with excellent mechanical abrasion and corrosion resistance on copper substrate by a novel method.

    Science.gov (United States)

    Su, Fenghua; Yao, Kai

    2014-06-11

    A novel method for controllable fabrication of a superhydrophobic surface with a water contact angle of 162 ± 1° and a sliding angle of 3 ± 0.5° on copper substrate is reported in this Research Article. The facile and low-cost fabrication process is composed from the electrodeposition in traditional Watts bath and the heat-treatment in the presence of (heptadecafluoro-1,1,2,2-tetradecyl) triethoxysilane (AC-FAS). The superhydrophobicity of the fabricated surface results from its pine-cone-like hierarchical micro-nanostructure and the assembly of low-surface-energy fluorinated components on it. The superhydrophobic surface exhibits high microhardness and excellent mechanical abrasion resistance because it maintains superhydrophobicity after mechanical abrasion against 800 grit SiC sandpaper for 1.0 m at the applied pressure of 4.80 kPa. Moreover, the superhydrophobic surface has good chemical stability in both acidic and alkaline environments. The potentiodynamic polarization and electrochemical impedance spectroscopy test shows that the as-prepared superhydrophobic surface has excellent corrosion resistance that can provide effective protection for the bare Cu substrate. In addition, the as-prepared superhydrophobic surface has self-cleaning ability. It is believed that the facile and low-cost method offer an effective strategy and promising industrial applications for fabricating superhydrophobic surfaces on various metallic materials.

  11. Pyruvic Oxime Nitrification and Copper and Nickel Resistance by a Cupriavidus pauculus, an Active Heterotrophic Nitrifier-Denitrifier

    Directory of Open Access Journals (Sweden)

    Miguel Ramirez

    2014-01-01

    Full Text Available Heterotrophic nitrifiers synthesize nitrogenous gasses when nitrifying ammonium ion. A Cupriavidus pauculus, previously thought an Alcaligenes sp. and noted as an active heterotrophic nitrifier-denitrifier, was examined for its ability to produce nitrogen gas (N2 and nitrous oxide (N2O while heterotrophically nitrifying the organic substrate pyruvic oxime [CH3–C(NOH–COOH]. Neither N2 nor N2O were produced. Nucleotide and phylogenetic analyses indicated that the organism is a member of a genus (Cupriavidus known for its resistance to metals and its metabolism of xenobiotics. The microbe (a Cupriavidus pauculus designated as C. pauculus strain UM1 was examined for its ability to perform heterotrophic nitrification in the presence of Cu2+ and Ni2+ and to metabolize the xenobiotic phenol. The bacterium heterotrophically nitrified well when either 1 mM Cu2+ or 0.5 mM Ni2+ was present in either enriched or minimal medium. The organism also used phenol as a sole carbon source in either the presence or absence of 1 mM Cu2+ or 0.5 mM Ni2+. The ability of this isolate to perform a number of different metabolisms, its noteworthy resistance to copper and nickel, and its potential use as a bioremediation agent are discussed.

  12. Antibiotic resistance, ability to form biofilm and susceptibility to copper alloys of selected staphylococcal strains isolated from touch surfaces in Polish hospital wards

    Directory of Open Access Journals (Sweden)

    Anna Różańska

    2017-08-01

    Full Text Available Abstract Background Despite the employment of sanitary regimes, contact transmission of the aetiological agents of hospital infections is still exceedingly common. The issue of microbe transmission becomes particularly important when facing multidrug-resistant microorganisms such as methicillin-resistant staphylococci. In the case of deficiencies in cleaning and disinfection procedures, hospital equipment made of copper alloys can play an important role, complementing traditional hospital hygiene procedures. The objective of this study was to characterize staphylococcal strains isolated from touch surfaces in Polish hospital wards in terms of their drug resistance, ability to form biofilm and susceptibility to antimicrobial activity of copper alloys. Methods The materials for the study were 95 staphylococcal strains isolated from touch surfaces in 13 different hospital wards from Małopolska province (the south of Poland. Phenotypic and genotypic antibiotic resistance were checked for erythromycin, clindamycin, gentamycin, ciprofloxacin, trimethoprim/sulfamethoxazole and mupirocin. Biofilm formation ability for the tested strains was checked with the use of culture on Congo red agar. Susceptibility to copper, tin bronze, brass and new silver was tested using a modification of the Japanese standard. Results Over 67% of the analysed staphylococcal strains were methicillin-resistant (MR. Four strains were resistant to all of the tested antibiotics, and 14 were resistant to all except mupirocin. Strains classified as MR had significantly increased resistance to the remaining antibiotic groups. About one-third of the analysed strains revealed biofilm-forming ability. Among the majority of species, biofilm-forming and non-biofilm-forming strains were distributed evenly; in the case of S. haemolyticus only, negative strains accounted for 92.8%. Susceptibility to copper alloys was different between strains and rather lower than in the case of the SA

  13. Molecular Characterization of Plasmids Encoding CTX-M β-Lactamases and their Associated Addiction Systems Circulating Among Escherichia coli from Retail Chickens, Chicken Farms, and Slaughterhouses in Korea.

    Science.gov (United States)

    Jo, Su-Jin; Woo, Gun-Jo

    2016-02-01

    Extended-spectrum β-lactamases (ESBLs), particularly those of the CTX-M types, are the predominant resistance determinants of Escherichia coli that are rapidly spreading worldwide. To determine CTX-M types, E. coli isolates were collected from retail chickens (n = 390) and environmental samples from chicken farms (n = 32) and slaughterhouses (n = 67) in Korea. Fifteen strains harboring blaCTX-M genes were isolated from 358 E. coli isolates. The most common CTX-M type was eight of CTX-M-15, followed by six of CTX-M-1 and one of CTX-M- 14. The blaCTX-M genes were identified in the isolates from retail chickens (n = 9), followed by feces, water pipes, floors, and walls. Conjugations confirmed the transferability of the plasmids carrying blaCTX-M genes to the recipient E. coli J53 strain. Furthermore, eight addiction systems carried by the replicons in CTX-M types were confirmed. The dominant system was identified as ccdAB, vagCD, and pndAC in donor strains and transconjugants. The clonal relationship between the two strains carrying blaCTX-M genes indicates that E. coli may transmit from the farm to retail chickens, suggesting a possible public health risk. Our findings demonstrate that the detection of CTX-M types in E. coli isolates is important for tracking ESBL production in animals, and suggest linkage of multiple addiction systems in plasmids bearing blaCTX-M genes.

  14. Resistance to the Peptidyl Transferase Inhibitor Tiamulin Caused by Mutation of Ribosomal Protein L3

    OpenAIRE

    Bøsling, Jacob; Poulsen, Susan M.; Vester, Birte; Long, Katherine S.

    2003-01-01

    The antibiotic tiamulin targets the 50S subunit of the bacterial ribosome and interacts at the peptidyl transferase center. Tiamulin-resistant Escherichia coli mutants were isolated in order to elucidate mechanisms of resistance to the drug. No mutations in the rRNA were selected as resistance determinants using a strain expressing only a plasmid-encoded rRNA operon. Selection in a strain with all seven chromosomal rRNA operons yielded a mutant with an A445G mutation in the gene coding for ri...

  15. Study of the Effect of Sulfide Ions on the Corrosion Resistance of Copper for Use in Containers for High Level radioactive waste

    International Nuclear Information System (INIS)

    Urbal Espinoza, Andrea Elizabeth

    2000-01-01

    The work 'Study of sulfide ion on Resisting Copper Corrosion' is part of the project 'Study of Copper Corrosion in Underground Water Solution in Reducer Conditions', which the Department of Nuclear Materials, Chilean Nuclear Energy Commission is carrying out. These activities are important because of this metal's potential applications for handling and controlling contaminating wastes that are a product of using nuclear energy in electric generation. Copper has important mechanical properties and is also resistant to disintegration in corrosive environments, which is an important condition for its use in manufacturing of high level radioactive waste containers. This work is based on a study of cyclic volta metric curves, anodic and cathodic polarization and potentiostatic measurements, with which the potential range, sweep speed system, electrochemical reactions involved and corrosion speed could be defined. The microstructural characterization of the films was done by Scanning Electron Microscopy (SEM), and the chemical composition and surface contamination of the film were studied by photoelectron spectroscopy induced by X- rays (XPS), and the crystalline structure by X- ray Diffraction (XRD). Some noticeable results, such as low potentials (less than .7 V, in cathode direction) and high concentrations of sulfur make the formation of copper sulfides (I) and (II) possible; unlike the potential over .6 V, in anodic direction, where copper oxides (I) and (II) are formed, but they are inhibited by high sulfur concentrations. The morphological study of the copper surface has shown that the film that forms is more abundant and granular at higher cathodic potentials, forming small pits on the surface. The effect of the presence of sulfur ions is minimal, and the metal's deterioration is inhibited by other ions in the groundwater. The corrosion rate is greater as the sulfur concentration rises, and a time period of 20,000 years can be predicted for the total corrosion of

  16. Pressure resistance of copper benzene-1,3,5-tricarboxylate - carbon aerogel composites

    Science.gov (United States)

    Domán, Andrea; Nagy, Balázs; Nichele, Laura P.; Srankó, Dávid; Madarász, János; László, Krisztina

    2018-03-01

    The protective effect of a resorcinol - formaldehyde based carbon aerogel (CA) support was compared in two different forms of the hybrid made of copper benzene-1,3,5-tricarboxilate (HKUST-1) and CA. HKUST-1:CA with identical mass ratio (1:1). HKUST-1+CAis a physical mixture while in HKUST-1@CA the metal organic framework (MOF) crystals were grown on CA under solvothermal conditions. The effect of water vapour and the external pressure (25-200 bar) was investigated. TG/DTG data show that the prehistory of the samples has a strong influence on their thermal behaviour and nitrogen data suggest that part of the MOF grows in the wider pores of the HKUST-1@CA sample. Although there are no dramatic differences in the water adsorption isotherms, the physical mixture is slightly more proficient. In dry samples under compression the crystalline structure of the free HKUST-1 is well conserved. The nanoscale structure of the hybrids is sensitive to applied pressure and formation of mesopores of wide size distribution occurs. No significant difference was found between the corresponding CH4 adsorption isotherms of the composite samples, either in the as-prepared samples or after compression at 100 bar. After being exposed to high external pressure the CH4 uptake seems to be governed by the MOF.

  17. Fabricating Copper Nanotubes by Electrodeposition

    Science.gov (United States)

    Yang, E. H.; Ramsey, Christopher; Bae, Youngsam; Choi, Daniel

    2009-01-01

    Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.

  18. Degradation rates and mechanisms of acid-resistant coatings in copper-leaching tanks

    DEFF Research Database (Denmark)

    Møller, Victor Buhl

    coating where the lifetime was estimated to 1:6 ± 0:2 and 1:4 ± 0:1 years, respectively. Part IV A series of newly designed and constructed diffusion cells were used to measure sulfuric acid diffusion rates through the coatings. A mathematical model was developed to simulate the experimental data...... potential in the mineral industry has not yet been thoroughly investigated. This particular industry poses unique challenges, with high operational temperatures (around 75 °C) and combined acidicerosive environments. The use of organic coatings to protect tanks, pipes, and secondary exposure areas, may....... Part I An in-depth literature study was performed to uncover and review uses and limitations ofacid-resistant coatings in the chemical industry, with a comparison to alternative resistant materialsbased on metals and ceramics. In addition, coating degradation phenomena caused by acid exposure, were...

  19. Effects of crystallographic texture on stress-migration resistance in copper thin films

    International Nuclear Information System (INIS)

    Koike, J.; Wada, M.; Sanada, M.; Maruyama, K.

    2002-01-01

    The crystallographic texture of heat-treated Cu thin films and its effects on stress-migration resistance were studied as a function of film thickness within a range of 50-900 nm. All as-deposited films had (111) texture. After heat treatment at 723 K, texture transition from (111) to (100) was observed in films of thickness greater than 300 nm. The (111) texture films after heat treatment showed severe stress migration; in contrast, the (100) texture films showed no noticeable stress migration. The observed stress-migration resistance in the (100) texture films can be attributed to the absence of twins and to lower thermal stress as compared with the (111) texture films

  20. Investigation of Hafnium oxide/Copper resistive memory for advanced encryption applications

    Science.gov (United States)

    Briggs, Benjamin D.

    The Advanced Encryption Standard (AES) is a widely used encryption algorithm to protect data and communications in today's digital age. Modern AES CMOS implementations require large amounts of dedicated logic and must be tuned for either performance or power consumption. A high throughput, low power, and low die area AES implementation is required in the growing mobile sector. An emerging non-volatile memory device known as resistive memory (ReRAM) is a simple metal-insulator-metal capacitor device structure with the ability to switch between two stable resistance states. Currently, ReRAM is targeted as a non-volatile memory replacement technology to eventually replace flash. Its advantages over flash include ease of fabrication, speed, and lower power consumption. In addition to memory, ReRAM can also be used in advanced logic implementations given its purely resistive behavior. The combination of a new non-volatile memory element ReRAM along with high performance, low power CMOS opens new avenues for logic implementations. This dissertation will cover the design and process implementation of a ReRAM-CMOS hybrid circuit, built using IBM's 10LPe process, for the improvement of hardware AES implementations. Further the device characteristics of ReRAM, specifically the HfO2/Cu memory system, and mechanisms for operation are not fully correlated. Of particular interest to this work is the role of material properties such as the stoichiometry, crystallinity, and doping of the HfO2 layer and their effect on the switching characteristics of resistive memory. Material properties were varied by a combination of atomic layer deposition and reactive sputtering of the HfO2 layer. Several studies will be discussed on how the above mentioned material properties influence switching parameters, and change the underlying physics of device operation.

  1. Laser cladding of copper with molybdenum for wear resistance enhancement in electrical contacts

    International Nuclear Information System (INIS)

    Ng, K.W.; Man, H.C.; Cheng, F.T.; Yue, T.M.

    2007-01-01

    Laser cladding of Mo on Cu has been attempted with the aim of enhancing the wear resistance and hence increasing the service life of electrical contacts made of Cu. In order to overcome the difficulties arising from the large difference in thermal properties and the low mutual solubility between Cu and Mo, Ni was introduced as an intermediate layer between Mo and Cu. The Ni and Mo layers were laser clad one after the other to form a sandwich layer of Mo/Ni/Cu. Excellent bonding between the clad layer and the Cu substrate was ensured by strong metallurgical bonding. The hardness of the surface of the clad layer is seven times higher than that of the Cu substrate. Pin-on-disc wear tests consistently showed that the abrasive wear resistance of the clad layer was also improved by a factor of seven as compared with untreated Cu substrate. The specific electrical contact resistance of the clad surface was about 5.6 x 10 -7 Ω cm 2

  2. Critical-temperature inhomogeneities and resistivity rounding in copper oxide superconductors

    International Nuclear Information System (INIS)

    Maza, J.; Vidal, F.

    1991-01-01

    By using effective-medium approaches, we obtain the onset of the electrical-resistivity rounding, above the normal-superconducting transition, associated with inhomogeneities of the mean-field critical temperature T c0 at scales larger than the superconducting correlation length. These results are compared with available data in single-crystal and single-phase (to within 4%) polycrystalline YBa 2 Cu 3 O 7-δ samples. This comparison shows that the measured resistivity rounding cannot be explained by these types of local T c0 inhomogeneities. Complementarily, our calculations allow us to check some proposals on T c0 inhomogeneities associated with local sample strains or oxygen-content variations. The interplay between T c0 inhomogeneities and superconducting order-parameter fluctuations (SCOPF) leads to the conclusion that in the mean-field-like region (MFR) above the superconducting transition, the T c0 inhomogeneity contribution to the measured resistivity rounding in high-quality (single-phase) cuprate oxide superconductors is negligible. In contrast, our analysis confirms that in the MFR these effects may be explained quantitatively on the grounds of the Lawrence-Doniach theory for SCOPF

  3. Influence of surface condition on the corrosion resistance of copper alloy condenser tubes in sea water

    Energy Technology Data Exchange (ETDEWEB)

    Sato, S; Nagata, K; Yamauchi, S

    1979-07-01

    Investigation was made on the influence of various surface conditions of aluminum brass tube. The corrosion behavior of aluminum brass tube, with nine kinds of surface conditions, was studied in stagnant 0.1N NaHCo/sub 3/ solution and flowing sea water (natural, Fe/sup + +/ containing and S/sup - -/ containing water). Surface treatments investigated contained bright annealing, special annealing to form carbon film, hot oxidizing and pickling. Anodic polarization measurements in 0.1N NaHCO/sub 3/ solution showed that the oxidized surface was superior and that the pickled surface was inferior. However, relation between these characteristics and corrosion resistance in sea water has not been established. Electrochemical characteristics in flowing sea water were dependent on the surface conditions in the very beginning of immersion time; nobler corrosion potential for the surface with carbon film, higher polarization resistance for the bright annealed and the oxidized surface, and faster decrease of polarization resistance in S/sup - -/ containing sea water for the pickled surface. However, these differences disappeared in the immersion time of only 2 to 7 days. It was revealed, by the statistical analysis on the corrosion depth in corrosion test in flowing sea water and in jet impingement test, that the corrosion behavior was not influenced by surface conditions, but was significantly influenced by quality of sea water and sponge ball cleaning. Sulfide ion of 0.05 ppm caused severe pitting corrosion, and sponge ball cleaning of 5 chances a week caused erosion corrosion. From above results, it was concluded that surface conditions of aluminum brass were not important to sea water corrosion, and that quality of sea water and operating condition such as sponge ball cleaning were more significant.

  4. Molecular Characterization of Copper and Cadmium Resistance Determinants in the Biomining Thermoacidophilic Archaeon Sulfolobus metallicus

    Directory of Open Access Journals (Sweden)

    Alvaro Orell

    2013-01-01

    Full Text Available Sulfolobus metallicus is a thermoacidophilic crenarchaeon used in high-temperature bioleaching processes that is able to grow under stressing conditions such as high concentrations of heavy metals. Nevertheless, the genetic and biochemical mechanisms responsible for heavy metal resistance in S. metallicus remain uncharacterized. Proteomic analysis of S. metallicus cells exposed to 100 mM Cu revealed that 18 out of 30 upregulated proteins are related to the production and conversion of energy, amino acids biosynthesis, and stress responses. Ten of these last proteins were also up-regulated in S. metallicus treated in the presence of 1 mM Cd suggesting that at least in part, a common general response to these two heavy metals. The S. metallicus genome contained two complete cop gene clusters, each encoding a metallochaperone (CopM, a Cu-exporting ATPase (CopA, and a transcriptional regulator (CopT. Transcriptional expression analysis revealed that copM and copA from each cop gene cluster were cotranscribed and their transcript levels increased when S. metallicus was grown either in the presence of Cu or using chalcopyrite (CuFeS2 as oxidizable substrate. This study shows for the first time the presence of a duplicated version of the cop gene cluster in Archaea and characterizes some of the Cu and Cd resistance determinants in a thermophilic archaeon employed for industrial biomining.

  5. Cloning and heterologous expression of the plasmid- encoded shsp ...

    African Journals Online (AJOL)

    AMAJU

    2011-02-14

    Feb 14, 2011 ... In addition to strong heat and acid tolerance, recombinant E. ... ethanol stress, which is the first physiological function found to be linked to the S. thermophilus .... The transgenic Saccharomyces cerevisiae cells expres-.

  6. Neonatal intramuscular injection of plasmid encoding glucagon-like

    Indian Academy of Sciences (India)

    Glucagon-like peptide-1 (GLP-1) has been implicated in the regulation of neuroendocrine and behavioural responses, but it is yet to be determined whether and how neonatal GLP-1 overexpression may modify hippocampal GR expression and thus programme adolescent behaviour in rats. Two-dayold pups were injected ...

  7. Plasmid-encoded diacetyl (acetoin) reductase in Leuconostoc pseudomesenteroides

    DEFF Research Database (Denmark)

    Rattray, Fergal P; Myling-Petersen, Dorte; Larsen, Dianna

    2003-01-01

    A plasmid-borne diacetyl (acetoin) reductase (butA) from Leuconostoc pseudomesenteroides CHCC2114 was sequenced and cloned. Nucleotide sequence analysis revealed an open reading frame encoding a protein of 257 amino acids which had high identity at the amino acid level to diacetyl (acetoin...

  8. Efflux pump-mediated benzalkonium chloride resistance in Listeria monocytogenes isolated from retail food.

    Science.gov (United States)

    Jiang, Xiaobing; Yu, Tao; Liang, Yu; Ji, Shengdong; Guo, Xiaowei; Ma, Jianmin; Zhou, Lijun

    2016-01-18

    In this study, efflux pump-mediated benzalkonium chloride (BC) resistance, including plasmid-encoded (Qac protein family and BcrABC) and chromosome-borne efflux pumps, was investigated in Listeria monocytogenes from retail food in China. Among the 59 L. monocytogenes strains, 13 (22.0%) strains were resistant to BC. The PCR results showed that bcrABC was harbored by 2 of 13 BC resistant strains. However, none of the qac genes were detected among the 59 strains. The bcrABC was absent in both of the plasmid cured strains, indicating that this BC resistance determinant was plasmid-encoded in the two bcrABC-positive strains. In the presence of reserpine, most of the bcrABC-negative strains had decreases in the MICs of BC, suggesting the existence of other efflux pumps and their role in BC resistance. After exposed to reserpine, the reduction in BC MICs was observed in the two cured strains, indicating that efflux pumps located on chromosome was also involved in BC resistance. Our findings suggest that food products may act as reservoirs for BC resistant isolates of L. monocytogenes and plasmid- and chromosome-encoded efflux pumps could mediate the BC resistance of L. monocytogenes, which is especially relevant to the adaption of this organism in food-related environments with frequent BC use. Copyright © 2015 Elsevier B.V. All rights reserved.

  9. Study by electrical resistivity measurements of the radiation induced defects in gold-copper alloys

    International Nuclear Information System (INIS)

    Alamo, A.

    1983-09-01

    Point defect production rate in Cu 3 Au and CuAu ordered and disordered alloys was studied by electrical resistivity measurements, as function of electron energy ranging from 0.4 to 2.5 MeV. The irradiations were performed at 20 K. The production curves are analysed using a displacement model for diatomic materials and the following values are found for the average displacement threshold energies: Esub(d)sup(Cu) approximately 22 eV and Esub(d)sup(Au) approximately 18 eV, for both alloys. Elementary defect migration was examined during isochronal annealing performed after irradiations. A simple type of self-interstitial seems to migrate in the ordered alloys: probably a split-interstitial of Cu-Cu type. Interstitial migration seems to be very difficult and complex in the disordered alloys. Vacancy mobility was detected after recovery at temperature above 300 K and was responsible of an increase of long range order. Fast neutron irradiations at 20 K produce disordering in the initially ordered alloys. Ratios of 38 and 18 antistructure defects per atomic displacement are estimated for Cu 3 Au and CuAu respectively [fr

  10. Effect of copper nanoparticles administered in ovo on the activity of proliferating cells and on the resistance of femoral bones in broiler chickens

    DEFF Research Database (Denmark)

    Mroczek-Sosnowska, Natalia; Lukasiewicz, Monika; Adamek, Dobrochna

    2017-01-01

    The objective of this study was to evaluate bone resistance after in ovo administration of copper nanoparticles (NanoCu) and to determine the number of cells positive for proliferating cell nuclear antigen (PCNA) in the femoral bones of broiler chickens (n = 12 per group). The study demonstrated...... that femoral bones from the NanoCu group were characterised by a higher weight and volume and by significantly greater resistance to fractures compared to the Control group. NanoCu promoted the proliferation of PCNA-positive cells in the long bones of chickens. A significantly higher number of PCNA......-positive cells in the bones of birds in the NanoCu group compared with the Control group (137 and 122, respectively) indicate a stimulatory effect during embryogenesis. Considering the improvement in bone resistance to fractures and the effect of NanoCu on the number of PCNA-positive cells in femoral bones, Nano...

  11. The effects of bio-available copper on macrolide antibiotic resistance genes and mobile elements during tylosin fermentation dregs co-composting.

    Science.gov (United States)

    Zhang, Bo; Wang, Meng Meng; Wang, Bing; Xin, Yanjun; Gao, Jiaqi; Liu, Huiling

    2018-03-01

    In this study, aerobic co-composting of tylosin fermentation dregs (TFDs) and sewage sludge with different adding concentrations of copper (Cu) was investigated to inspect the fate of antibiotic resistance genes (ARGs), metal resistance genes (MRGs) and mobile genetic elements (MGEs). Results showed that two concentrations of Cu did affect not only the abiotic factors but the relative abundances of resistance genes. High concentration of Cu inhibited the metabolic capacity of microbial community and the nitrogen-fixing process while had little effect on the degradation of TYL and TOC. The abundance of ermT, mefA, mphA increased partly attributed to the toxic effects and co-selective pressure from heavy metal reflected by MRGs. There was significant correlation among some environmental factors like pH, bio-Cu, organic matters and ARGs. Copyright © 2017 Elsevier Ltd. All rights reserved.

  12. Copper and copper-nickel alloys as zebra mussel antifoulants

    Energy Technology Data Exchange (ETDEWEB)

    Dormon, J.M.; Cottrell, C.M.; Allen, D.G.; Ackerman, J.D.; Spelt, J.K. [Univ. of Toronto, Ontario (Canada)

    1996-04-01

    Copper has been used in the marine environment for decades as cladding on ships and pipes to prevent biofouling by marine mussels (Mytilus edulis L.). This motivated the present investigation into the possibility of using copper to prevent biofouling in freshwater by both zebra mussels and quagga mussels (Dreissena polymorpha and D. bugensis collectively referred to as zebra mussels). Copper and copper alloy sheet proved to be highly effective in preventing biofouling by zebra mussels over a three-year period. Further studies were conducted with copper and copper-nickel mesh (lattice of expanded metal) and screen (woven wire with a smaller hole size), which reduced the amount of copper used. Copper screen was also found to be strongly biofouling-resistant with respect to zebra mussels, while copper mesh reduced zebra mussel biofouling in comparison to controls, but did not prevent it entirely. Preliminary investigations into the mechanism of copper antifouling, using galvanic couples, indicated that the release of copper ions from the surface of the exposed metal into the surrounding water is directly or indirectly responsible for the biofouling resistance of copper.

  13. Identification and characterization of antibiotic resistance genes in Lactobacillus reuteri and Lactobacillus plantarum.

    Science.gov (United States)

    Egervärn, M; Roos, S; Lindmark, H

    2009-11-01

    The study aimed to identify the resistance genes mediating atypical minimum inhibitory concentrations (MICs) for tetracycline, erythromycin, clindamycin and chloramphenicol within two sets of representative strains of the species Lactobacillus reuteri and Lactobacillus plantarum and to characterize identified genes by means of gene location and sequencing of flanking regions. A tet(W) gene was found in 24 of the 28 Lact. reuteri strains with atypical MIC for tetracycline, whereas four of the six strains with atypical MIC for erythromycin were positive for erm(B) and one strain each was positive for erm(C) and erm(T). The two Lact. plantarum strains with atypical MIC for tetracycline harboured a plasmid-encoded tet(M) gene. The majority of the tet(W)-positive Lact. reuteri strains and all erm-positive Lact. reuteri strains carried the genes on plasmids, as determined by Southern blot and a real-time PCR method developed in this study. Most of the antibiotic-resistant strains of Lact. reuteri and Lact. plantarum harboured known plasmid-encoded resistance genes. Examples of putative transfer machineries adjacent to both plasmid- and chromosome-located resistance genes were also demonstrated. These data provide some of the knowledge required for assessing the possible risk of using Lact. reuteri and Lact. plantarum strains carrying antibiotic resistance genes as starter cultures and probiotics.

  14. Switching operation and degradation of resistive random access memory composed of tungsten oxide and copper investigated using in-situ TEM.

    Science.gov (United States)

    Arita, Masashi; Takahashi, Akihito; Ohno, Yuuki; Nakane, Akitoshi; Tsurumaki-Fukuchi, Atsushi; Takahashi, Yasuo

    2015-11-27

    In-situ transmission electron microscopy (in-situ TEM) was performed to investigate the switching operation of a resistive random access memory (ReRAM) made of copper, tungsten oxide and titanium nitride (Cu/WOx/TiN). In the first Set (Forming) operation to initialize the device, precipitation appeared inside the WOx layer. It was presumed that a Cu conducting filament was formed, lowering the resistance (on-state). The Reset operation induced a higher resistance (the off-state). No change in the microstructure was identified in the TEM images. Only when an additional Reset current was applied after switching to the off-state could erasure of the filament be seen (over-Reset). Therefore, it was concluded that structural change relating to the resistance switch was localized in a very small area around the filament. With repeated switching operations and increasing operational current, the WOx/electrode interfaces became indistinct. At the same time, the resistance of the off-state gradually decreased. This is thought to be caused by Cu condensation at the interfaces because of leakage current through the area other than through the filament. This will lead to device degradation through mechanisms such as endurance failure. This is the first accelerated aging test of ReRAM achieved using in-situ TEM.

  15. Susceptibility of 169 USA300 methicillin-resistant Staphylococcus aureus isolates to two copper-based biocides, CuAL42 and CuWB50.

    Science.gov (United States)

    Luna, Vicki Ann; Hall, Tony J; King, Debbie S; Cannons, Andrew C

    2010-05-01

    To test the activity of two copper-based biocides, CuAL42 and CuWB50, and benzalkonium chloride against 169 isolates of methicillin-resistant Staphylococcus aureus (MRSA) pulsotype USA300, a virulent, multiply resistant, widespread clone in the USA. Tests including MIC, MBC and time-kill studies were performed multiple times. The MIC range, MIC(50) and MIC(90) (0.59-18.75, 4.69 and 4.69 ppm, respectively) and the MBC range, MBC(50) and MBC(90) (1.17-18.75, 4.69 and 9.38 ppm, respectively) for CuAL42 were identical with those obtained with CuWB50, except that the MBC range for CuWB50 was wider (0.59-37.5 ppm). In time-kill studies, a 6 log(10) reduction of cfu was achieved within 1 h (150 ppm) and 0.5 h (300 ppm) for CuAL42, and 1.5 h (150 ppm) and 0.75 h (300 ppm) for CuWB50. Both copper-based biocides can effectively kill USA300 MRSA and may facilitate the eradication of the organism from healthcare settings.

  16. A novel copper complex induces ROS generation in doxorubicin resistant Ehrlich ascitis carcinoma cells and increases activity of antioxidant enzymes in vital organs in vivo

    International Nuclear Information System (INIS)

    Mookerjee, Ananda; Roy, Syamal; Choudhuri, Soumitra K; Basu, Jayati Mookerjee; Majumder, Surajit; Chatterjee, Shilpak; Panda, Gouri S; Dutta, Pranabananda; Pal, Smarajit; Mukherjee, Pratima; Efferth, Thomas

    2006-01-01

    In search of a suitable GSH-depleting agent, a novel copper complex viz., copper N-(2-hydroxyacetophenone) glycinate (CuNG) has been synthesized, which was initially found to be a potential resistance modifying agent and later found to be an immunomodulator in mice model in different doses. The objective of the present work was to decipher the effect of CuNG on reactive oxygen species (ROS) generation and antioxidant enzymes in normal and doxorubicin-resistant Ehrlich ascites carcinoma (EAC/Dox)-bearing Swiss albino mice. The effect of CuNG has been studied on ROS generation, multidrug resistance-associated protein1 (MRP1) expression and on activities of superoxide dismutase (SOD), catalase (CAT) and glutathione peroxidase (GPx). CuNG increased ROS generation and reduced MRP1 expression in EAC/Dox cells while only temporarily depleted glutathione (GSH) within 2 h in heart, kidney, liver and lung of EAC/Dox bearing mice, which were restored within 24 h. The level of liver Cu was observed to be inversely proportional to the level of GSH. Moreover, CuNG modulated SOD, CAT and GPx in different organs and thereby reduced oxidative stress. Thus nontoxic dose of CuNG may be utilized to reduce MRP1 expression and thus sensitize EAC/Dox cells to standard chemotherapy. Moreover, CuNG modulated SOD, CAT and and GPx activities to reduce oxidative stress in some vital organs of EAC/Dox bearing mice. CuNG treatment also helped to recover liver and renal function in EAC/Dox bearing mice. Based on our studies, we conclude that CuNG may be a promising candidate to sensitize drug resistant cancers in the clinic

  17. Genome Sequences of Three Highly Copper-Resistant Salmonella enterica subsp. I Serovar Typhimurium Strains Isolated from Pigs in Denmark

    DEFF Research Database (Denmark)

    Qin, Yanan; Hasman, Henrik; Aarestrup, Frank Møller

    2014-01-01

    Salmonella typhimurium is the causative agent of typhoid fever, which causes nearly 21.7 million illnesses and 217,000 deaths around the world each year. Here, we describe the draft genome sequences of the Salmonella typhimurium strains S7, S15, and S23, isolated from copper-fed pigs in Denmark...

  18. Zinc and copper in animal feed – development of resistance and co-resistance to antimicrobial agents in bacteria of animal origin

    Directory of Open Access Journals (Sweden)

    Siamak Yazdankhah

    2014-09-01

    Full Text Available Farmed animals such as pig and poultry receive additional Zn and Cu in their diets due to supplementing elements in compound feed as well as medical remedies. Enteral bacteria in farmed animals are shown to develop resistance to trace elements such as Zn and Cu. Resistance to Zn is often linked with resistance to methicillin in staphylococci, and Zn supplementation to animal feed may increase the proportion of multiresistant E. coli in the gut. Resistance to Cu in bacteria, in particular enterococci, is often associated with resistance to antimicrobial drugs like macrolides and glycopeptides (e.g. vancomycin. Such resistant bacteria may be transferred from the food-producing animals to humans (farmers, veterinarians, and consumers. Data on dose-response relation for Zn/Cu exposure and resistance are lacking; however, it seems more likely that a resistance-driven effect occurs at high trace element exposure than at more basal exposure levels. There is also lack of data which could demonstrate whether Zn/Cu-resistant bacteria may acquire antibiotic resistance genes/become antibiotics resistant, or if antibiotics-resistant bacteria are more capable to become Zn/Cu resistant than antibiotics-susceptible bacteria. Further research is needed to elucidate the link between Zn/Cu and antibiotic resistance in bacteria.

  19. Zinc and copper in animal feed - development of resistance and co-resistance to antimicrobial agents in bacteria of animal origin

    OpenAIRE

    Yazdankhah, Siamak; Rudi, Knut; Bernhoft, Aksel

    2014-01-01

    Farmed animals such as pig and poultry receive additional Zn and Cu in their diets due to supplementing elements in compound feed as well as medical remedies. Enteral bacteria in farmed animals are shown to develop resistance to trace elements such as Zn and Cu. Resistance to Zn is often linked with resistance to methicillin in staphylococci, and Zn supplementation to animal feed may increase the proportion of multiresistant E. coli in the gut. Resistance to Cu in bacteria, in particular ente...

  20. Copper tolerance in Becium homblei

    Energy Technology Data Exchange (ETDEWEB)

    Reilly, C; Stone, J

    1971-04-09

    Analyses show that Becium homblei has apparently no mechanism for limiting copper uptake. As growth proceeds, the concentration of metal increases in leaves and stems. Much of the copper is bound to structural material of the cells. There is a significant difference between the amount of extractable material in root and leaf tissues. These differences, in conjunction with the extrinsic factor of regular bush fires, were important factors in the evolution of this copper-resistant species of Becium. 9 references.

  1. Corrosion resisting properties of 90/10 copper-nickel-iron alloy with particular reference to offshore oil and gas applications

    Energy Technology Data Exchange (ETDEWEB)

    Gilbert, P T

    1979-01-01

    The use of a copper-nickel-iron alloy for seawater pipeline systems and various other applications on offshore oil and gas platforms is now proving attractive, according to the UK's Yorkshire Imperial Metals Ltd. The alloy has already proved a useful and reliable material in many applications: It has given good results in seawater-cooled condensers and heat exchangers and seawater piping systems, in power stations, ships, desalination plant, and refrigeration service. Its antifouling and corrosion-resistant properties are valuable in these applications. The main limitations that have to be observed in its use are (1) the design, construction, and operation of systems within prescribed velocity and turbulence limits, to avoid the occurrence of impingement attack, and (2) problems that may arise because of badly polluted seawater.

  2. Measurement of the Residual Resistivity Ratio of the Bus Bars Copper Stabilizer of the 13 kA Circuits of the LHC

    CERN Document Server

    Apollonio, A; Solfaroli Camillocci, M; Schmidt, R; Verweij, A; Siemko, A; Claudet, S; Steckert, J; Thiesen, H

    2012-01-01

    After the incident of September 2008, the operational beam energy of the LHC has been set to 3.5 TeV, since not all joints of the superconducting (SC) bus bars between magnets have the required quality for 7 TeV operation. This decision is based on simulations to determine the safe current in the main dipole and quadrupole circuits, reproducing the thermal behaviour of a quenched superconducting joint by taking into account all relevant factors that affect a possible thermal runaway. One important parameter is the Residual Resistivity Ratio (RRR) of the copper stabilizer of the bus bar connecting the superconducting magnets. A dedicated campaign to measure the RRR for the main 13 kA circuits of the LHC in all sectors was performed during the Christmas stop in December 2010 and January 2011. The measurement method as well as the data analysis and results are presented in this paper.

  3. Measurement of the Residual Resistivity Ratio of the busbars copper stabilizer of the 13kA circuits of the LHC

    CERN Document Server

    Apollonio, A; Solfaroli, M; Schmidt, R; Verweij, A

    2012-01-01

    After the incident of September 2008, the operational beam energy of the LHC has been set to 3.5 TeV, since not all joints of the superconducting busbars between magnets have the required quality for 7 TeV operation. This choice is based on simulations to determine the safe current in the main dipole and quadrupole magnets, reproducing the thermal behavior of a quenched superconducting joint by taking into account all relevant factors that affect a possible thermal runaway. One important parameter of the simulation is the RRR (Residual Resistivity Ratio) of the copper stabilizer of the busbar connecting superconducting magnets. A dedicated campaign to measure this quantity for the main 13kA circuits of the LHC on all sectors was performed during the Christmas stop in December 2010 and January 2011. The measurement method as well as the data analysis and results are presented in this note.

  4. Influence of Heat Treatment and Composition Variations on Microstructure, Hardness, and Wear Resistance of C 18000 Copper Alloy

    OpenAIRE

    Osorio-Galicia, Ramon; Gomez-Garcia, Carlos; Alcantara, Miguel Angel; Herrera-Vazquez, Andres

    2012-01-01

    The hardness and wear behavior properties of two C 18000 copper alloys with variations in Ni, Si, and Cr concentrations, both within the range of C18000 chemical analysis standard, were studied after the alloy samples had been prepared by melting and casting in sand molds and then heat-treated in solution using two-stage aging for different heating time periods. The results obtained from sample sets of the aforementioned two alloys, C 0 and C 1 , show that the alloy C 1 , with slightly higher...

  5. Copper hypersensitivity

    DEFF Research Database (Denmark)

    Fage, Simon W; Faurschou, Annesofie; Thyssen, Jacob P

    2014-01-01

    hypersensitivity, a database search of PubMed was performed with the following terms: copper, dermatitis, allergic contact dermatitis, contact hypersensitivity, contact sensitization, contact allergy, patch test, dental, IUD, epidemiology, clinical, and experimental. Human exposure to copper is relatively common...

  6. Altered localisation of the copper efflux transporters ATP7A and ATP7B associated with cisplatin resistance in human ovarian carcinoma cells

    International Nuclear Information System (INIS)

    Kalayda, Ganna V; Wagner, Christina H; Buß, Irina; Reedijk, Jan; Jaehde, Ulrich

    2008-01-01

    Copper homeostasis proteins ATP7A and ATP7B are assumed to be involved in the intracellular transport of cisplatin. The aim of the present study was to assess the relevance of sub cellular localisation of these transporters for acquired cisplatin resistance in vitro. For this purpose, localisation of ATP7A and ATP7B in A2780 human ovarian carcinoma cells and their cisplatin-resistant variant, A2780cis, was investigated. Sub cellular localisation of ATP7A and ATP7B in sensitive and resistant cells was investigated using confocal fluorescence microscopy after immunohistochemical staining. Co-localisation experiments with a cisplatin analogue modified with a carboxyfluorescein-diacetate residue were performed. Cytotoxicity of the fluorescent cisplatin analogue in A2780 and A2780cis cells was determined using an MTT-based assay. The significance of differences was analysed using Student's t test or Mann-Whitney test as appropriate, p values of < 0.05 were considered significant. In the sensitive cells, both transporters are mainly localised in the trans-Golgi network, whereas they are sequestrated in more peripherally located vesicles in the resistant cells. Altered localisation of ATP7A and ATP7B in A2780cis cells is likely to be a consequence of major abnormalities in intracellular protein trafficking related to a reduced lysosomal compartment in this cell line. Changes in sub cellular localisation of ATP7A and ATP7B may facilitate sequestration of cisplatin in the vesicular structures of A2780cis cells, which may prevent drug binding to genomic DNA and thereby contribute to cisplatin resistance. Our results indicate that alterations in sub cellular localisation of transport proteins may contribute to cisplatin resistance in vitro. Investigation of intracellular protein localisation in primary tumour cell cultures and tumour tissues may help to develop markers of clinically relevant cisplatin resistance. Detection of resistant tumours in patients may in turn

  7. Altered localisation of the copper efflux transporters ATP7A and ATP7B associated with cisplatin resistance in human ovarian carcinoma cells

    Directory of Open Access Journals (Sweden)

    Reedijk Jan

    2008-06-01

    Full Text Available Abstract Background Copper homeostasis proteins ATP7A and ATP7B are assumed to be involved in the intracellular transport of cisplatin. The aim of the present study was to assess the relevance of sub cellular localisation of these transporters for acquired cisplatin resistance in vitro. For this purpose, localisation of ATP7A and ATP7B in A2780 human ovarian carcinoma cells and their cisplatin-resistant variant, A2780cis, was investigated. Methods Sub cellular localisation of ATP7A and ATP7B in sensitive and resistant cells was investigated using confocal fluorescence microscopy after immunohistochemical staining. Co-localisation experiments with a cisplatin analogue modified with a carboxyfluorescein-diacetate residue were performed. Cytotoxicity of the fluorescent cisplatin analogue in A2780 and A2780cis cells was determined using an MTT-based assay. The significance of differences was analysed using Student's t test or Mann-Whitney test as appropriate, p values of Results In the sensitive cells, both transporters are mainly localised in the trans-Golgi network, whereas they are sequestrated in more peripherally located vesicles in the resistant cells. Altered localisation of ATP7A and ATP7B in A2780cis cells is likely to be a consequence of major abnormalities in intracellular protein trafficking related to a reduced lysosomal compartment in this cell line. Changes in sub cellular localisation of ATP7A and ATP7B may facilitate sequestration of cisplatin in the vesicular structures of A2780cis cells, which may prevent drug binding to genomic DNA and thereby contribute to cisplatin resistance. Conclusion Our results indicate that alterations in sub cellular localisation of transport proteins may contribute to cisplatin resistance in vitro. Investigation of intracellular protein localisation in primary tumour cell cultures and tumour tissues may help to develop markers of clinically relevant cisplatin resistance. Detection of resistant tumours

  8. Effect of red mud addition on tetracycline and copper resistance genes and microbial community during the full scale swine manure composting.

    Science.gov (United States)

    Wang, Rui; Zhang, Junya; Sui, Qianwen; Wan, Hefeng; Tong, Juan; Chen, Meixue; Wei, Yuansong; Wei, Dongbin

    2016-09-01

    Swine manure has been considered as the reservoir of antibiotic resistance genes (ARGs). Composting is one of the most suitable technologies for treating livestock manures, and red mud was proved to have a positive effect on nitrogen conservation during composting. This study investigated the abundance of eight tetracycline and three copper resistance genes, the bacterial community during the full scale swine manure composting with or without addition of red mud. The results showed that ARGs in swine manure could be effectively removed through composting (reduced by 2.4log copies/g TS), especially during the thermophilic phase (reduced by 1.5log copies/g TS), which the main contributor might be temperature. Additionally, evolution of bacterial community could also have a great influence on ARGs. Although addition of red mud could enhance nitrogen conservation, it obviously hindered removal of ARGs (reduced by 1.7log copies/g TS) and affected shaping of bacterial community during composting. Copyright © 2016 Elsevier Ltd. All rights reserved.

  9. Plasmid-Mediated Quinolone Resistance in Shigella flexneri Isolated From Macaques

    Directory of Open Access Journals (Sweden)

    Anthony J. Mannion

    2018-03-01

    Full Text Available Non-human primates (NHPs for biomedical research are commonly infected with Shigella spp. that can cause acute dysentery or chronic episodic diarrhea. These animals are often prophylactically and clinically treated with quinolone antibiotics to eradicate these possible infections. However, chromosomally- and plasmid-mediated antibiotic resistance has become an emerging concern for species in the family Enterobacteriaceae. In this study, five individual isolates of multi-drug resistant Shigella flexneri were isolated from the feces of three macaques. Antibiotic susceptibility testing confirmed resistance or decreased susceptibility to ampicillin, amoxicillin-clavulanic acid, cephalosporins, gentamicin, tetracycline, ciprofloxacin, enrofloxacin, levofloxacin, and nalidixic acid. S. flexneri isolates were susceptible to trimethoprim-sulfamethoxazole, and this drug was used to eradicate infection in two of the macaques. Plasmid DNA from all isolates was positive for the plasmid-encoded quinolone resistance gene qnrS, but not qnrA and qnrB. Conjugation and transformation of plasmid DNA from several S. flexneri isolates into antibiotic-susceptible Escherichia coli strains conferred the recipients with resistance or decreased susceptibility to quinolones and beta-lactams. Genome sequencing of two representative S. flexneri isolates identified the qnrS gene on a plasmid-like contig. These contigs showed >99% homology to plasmid sequences previously characterized from quinolone-resistant Shigella flexneri 2a and Salmonella enterica strains. Other antibiotic resistance genes and virulence factor genes were also identified in chromosome and plasmid sequences in these genomes. The findings from this study indicate macaques harbor pathogenic S. flexneri strains with chromosomally- and plasmid-encoded antibiotic resistance genes. To our knowledge, this is the first report of plasmid-mediated quinolone resistance in S. flexneri isolated from NHPs and warrants

  10. Investigations into the corrosion resistance of copper aluminium alloys. Effect of phosphorus as corrosion resistant third alloying element in the ternary system CuAl20P1

    International Nuclear Information System (INIS)

    Allwardt, A.

    1997-01-01

    The effect of phosphorus on the corrosion resistance of Al-bronzes is studied in detail in this work. A literature review showed that there are a lot of things known about the microstructure and the mechanical properties of Al-bronzes. In spite of their corrosion resistance the corrosion properties and the structure of the protective oxide films of Al-bronzes were seldom a matter of interest. Systematic studies of the influence of different alloying elements on the oxide film and the corrosion properties are rare. Therefore, it is not possible to predict the corrosion resistance of Al-bronzes, made by alloying particular elements. The high corrosion resistance of the new alloy CuAl 20 P 1 was the reason to investigate the influence of phosphorus on the corrosion properties of Al-bronzes in more detail. A systematic study of the microstructure and the corrosion properties of Cu, CuP x , CuAl 20 and CuAl 20 P x offers an insight into the effect of aluminium and phosphorus on the formation of the oxide film on Al-bronzes. It was found that there exists a critical amount of 1 at.-% of phosphorus. Above and below this amount the corrosion resistance becomes worse. This behaviour could be explained by XPS-and electrochemical measurements. Although there are still some questions about the influence of phosphorus on the corrosion resistance of Al-bronzes, this work has produced some important results, which in the future may be helpful to develop new high corrosion resistant Al-bronzes more efficiently: - on clean surface Al-bronze, the oxidation of Al and Cu takes place simultaneously, - Al promotes the formation of Cu 2 O but impedes the formation of Cu(II)-oxide/-hydride in neutral solutions, - P impedes the formation of Cu 2 O and as a consequence promotes the formation of aluminium oxide. This results in a higher amount of Al in the oxide film on the surface of the alloy, which leads to a better corrosion resistance. (author) figs., tabs., 106 refs

  11. Quinolone resistance: much more than predicted

    Directory of Open Access Journals (Sweden)

    Alvaro eHernandez

    2011-02-01

    Full Text Available Since quinolones are synthetic antibiotics, it was predicted that mutations in target genes would be the only mechanism through which resistance could be acquired, because there will not be quinolone resistance genes in nature. Contrary to this prediction, a variety of elements ranging from efflux pumps, target-protecting proteins and even quinolone-modifying enzymes have been shown to contribute to quinolone resistance. The finding of some of these elements in plasmids indicates that quinolone resistance can be transferable. As a result, there has been a developing interest on the reservoirs for quinolone resistance genes and on the potential risks associated with the use of these antibiotics in non-clinical environments. As a matter of fact, plasmid-encoded, quinolone-resistance qnr genes originated in the chromosome of aquatic bacteria, thus the use of quinolones in fish farming might constitute a risk for the emergence of resistance. Failure to predict the development of quinolone resistance reinforces the need of taking into consideration the wide plasticity of biological systems for future predictions. This plasticity allows pathogens to deal with toxic compounds, including those with a synthetic origin as quinolones.

  12. Biosorption of lead, copper and cadmium by an indigenous isolate Enterobacter sp. J1 possessing high heavy-metal resistance

    International Nuclear Information System (INIS)

    Lu, W.-B.; Shi, J.-J.; Wang, C.-H.; Chang, J.-S.

    2006-01-01

    This study was undertaken to investigate biosorption kinetics and equilibria of lead (Pb), copper (Cu) and cadmium (Cd) ions using the biomass of Enterobacter sp. J1 isolated from a local industry wastewater treatment plant. Efficiency of metal ion recovery from metal-loaded biomass to regenerate the biosorbent was also determined. The results show that Enterobacter sp. J1 was able to uptake over 50 mg of Pb per gram of dry cell, while having equilibrium adsorption capacities of 32.5 and 46.2 mg/g dry cell for Cu and Cd, respectively. In general, Langmuir and Freundlich models were able to describe biosorption isotherm fairly well, except that prediction of Pb adsorption was relatively poor with Langmuir model, suggesting a different mechanism for Pb biosorption. Adjusting the pH value to 3.0 led to nearly complete desorption of Cd from metal-loaded biomass, while over 90% recovery of Pb and Cu ions was obtained at pH ≤ 2. After four repeated adsorption/desorption cycles, biomass of Enterobacter sp. J1 retained 75, 79 and 90% of original capacity for adsorption of Pb, Cu and Cd, respectively, suggesting good reusability of the biosorbent. A combinative model was proposed to describe the kinetics of heavy-metal adsorption by Enterobacter sp. J1 and the model appeared to have an excellent prediction of the experimental data. The model simulation results also seemed to suggest that intracellular accumulation may occur during the uptake of Pb

  13. Biosorption of lead, copper and cadmium by an indigenous isolate Enterobacter sp. J1 possessing high heavy-metal resistance

    Energy Technology Data Exchange (ETDEWEB)

    Lu, W.-B. [Department of Cosmetic Science, Chung Hwa College of Medical Technology, Tainan, Taiwan (China); Shi, J.-J. [Department of Chemical Engineering, National Cheng Kung University, Tainan, Taiwan (China); Wang, C.-H. [Department of Biological Engineering, Yung Ta Institute of Technology and Commerce, Pingtung, Taiwan (China); Chang, J.-S. [Department of Chemical Engineering, National Cheng Kung University, Tainan, Taiwan (China)]. E-mail: changjs@mail.ncku.edu.tw

    2006-06-30

    This study was undertaken to investigate biosorption kinetics and equilibria of lead (Pb), copper (Cu) and cadmium (Cd) ions using the biomass of Enterobacter sp. J1 isolated from a local industry wastewater treatment plant. Efficiency of metal ion recovery from metal-loaded biomass to regenerate the biosorbent was also determined. The results show that Enterobacter sp. J1 was able to uptake over 50 mg of Pb per gram of dry cell, while having equilibrium adsorption capacities of 32.5 and 46.2 mg/g dry cell for Cu and Cd, respectively. In general, Langmuir and Freundlich models were able to describe biosorption isotherm fairly well, except that prediction of Pb adsorption was relatively poor with Langmuir model, suggesting a different mechanism for Pb biosorption. Adjusting the pH value to 3.0 led to nearly complete desorption of Cd from metal-loaded biomass, while over 90% recovery of Pb and Cu ions was obtained at pH {<=} 2. After four repeated adsorption/desorption cycles, biomass of Enterobacter sp. J1 retained 75, 79 and 90% of original capacity for adsorption of Pb, Cu and Cd, respectively, suggesting good reusability of the biosorbent. A combinative model was proposed to describe the kinetics of heavy-metal adsorption by Enterobacter sp. J1 and the model appeared to have an excellent prediction of the experimental data. The model simulation results also seemed to suggest that intracellular accumulation may occur during the uptake of Pb.

  14. Determination of the threshold-energy surface for copper using in-situ electrical-resistivity measurements in the high-voltage electron microscope

    International Nuclear Information System (INIS)

    King, W.E.; Merkle, K.L.; Meshii, M.

    1981-01-01

    A detailed study of the anisotropy of the threshold energy for Frenkel-pair production in copper was carried out experimentally, using in-situ electrical-resistivity measurements in the high-voltage electron microscope. These electrical-resistivity measurements, which are sensitive to small changes in point-defect concentration, were used to determine the damage or defect production rate. Damage-rate measurements in copper single crystals were carried out for approx.40 incident electron-beam directions and six electron energies from 0.4 to 1.1 MeV. The total cross section for Frenkel-pair production is proportional to the measured damage rate and can be theoretically calculated if the form of the threshold-energy surface is known. Trial threshold-energy surfaces were systematically altered until a ''best fit'' of the calculated to the measured total cross sections for Frenkel-pair production was obtained. The average threshold energy of this surface is 28.5 eV. The minimum threshold energy is 18 +- 2 eV and is located near . A ring of very high threshold energy (>50 eV) surrounds the direction. A damage function for single-defect production was derived from this surface and was applied to defect-production calculations at higher recoil energies. This function rises rather sharply from a value of zero at 17 eV to 0.8 at 42 eV. It has the value of 0.5 at 24.5 eV. Above 30 eV the slope of the curve begins to decrease, reflecting the presence of the high-energy regions of the threshold-energy surface. Both topographical and quantitative comparisons of the present surface with those in the literature were presented. Based on a chi 2 goodness-of-fit test, the present surface was found to predict the experimentally observed total cross sections for Frenkel-pair production significantly better than the other available surfaces. Also, the goodness of fit varied substantially less with energy and direction for the present surface

  15. The copper metallome in prokaryotic cells

    DEFF Research Database (Denmark)

    Rensing, Christopher Günther T; Alwathnani, Hend A.; McDevitt, Sylvia F.

    2016-01-01

    and protozoans also utilize heavy metals such as copper and zinc in the killing of phagocytized bacteria. It seems, therefore, not surprising that many bacteria including pathogens harbor additional copper resistance determinants. However, the occurrence of these resistance determinants is more widespread than...

  16. Copper and copper-nickel-alloys - An overview

    Energy Technology Data Exchange (ETDEWEB)

    Klassert, Anton; Tikana, Ladji [Deutsches Kupferinstitut e.V. Am Bonneshof 5, 40474 Duesseldorf (Germany)

    2004-07-01

    With the increasing level of industrialization the demand for and the number of copper alloys rose in an uninterrupted way. Today, the copper alloys take an important position amongst metallic materials due to the large variety of their technological properties and applications. Nowadays there exist over 3.000 standardized alloys. Copper takes the third place of all metals with a worldwide consumption of over 15 millions tons per year, following only to steel and aluminum. In a modern industrial society we meet copper in all ranges of the life (electro-technology, building and construction industry, mechanical engineering, automotive, chemistry, offshore, marine engineering, medical applications and others.). Copper is the first metal customized by humanity. Its name is attributed to the island Cyprus, which supplied in the antiquity copper to Greece, Rome and the other Mediterranean countries. The Romans called it 'ore from Cyprus' (aes cyprium), later cuprum. Copper deposited occasionally also dapper and could be processed in the recent stone age simply by hammering. Already in early historical time copper alloys with 20 to 50 percent tin was used for the production of mirrors because of their high reflecting power. Although the elementary nickel is an element discovered only recently from a historical perspective, its application in alloys - without any knowledge of the alloy composition - occurred at least throughout the last 2.000 years. The oldest copper-nickel coin originates from the time around 235 B.C.. Only around 1800 AD nickel was isolated as a metallic element. In particular in the sea and offshore technology copper nickel alloys found a broad field of applications in piping systems and for valves and armatures. The excellent combination of characteristics like corrosion resistance, erosion stability and bio-fouling resistance with excellent mechanical strength are at the basis of this success. An experience of many decades supports the use

  17. Plasmid-mediated resistance to thrombin-induced platelet microbicidal protein in staphylococci: role of the qacA locus.

    Science.gov (United States)

    Kupferwasser, L I; Skurray, R A; Brown, M H; Firth, N; Yeaman, M R; Bayer, A S

    1999-10-01

    Thrombin-induced platelet microbicidal protein 1 (tPMP-1) is a small, cationic peptide released from rabbit platelets following thrombin stimulation. In vitro resistance to this peptide among strains of Staphylococcus aureus correlates with the survival advantage of such strains at sites of endothelial damage in humans as well as in experimental endovascular infections. The mechanisms involved in the phenotypic resistance of S. aureus to tPMP-1 are not fully delineated. The plasmid-encoded staphylococcal gene qacA mediates multidrug resistance to multiple organic cations via a proton motive force-dependent efflux pump. We studied whether the qacA gene might also confer resistance to cationic tPMP-1. Staphylococcal plasmids encoding qacA were found to confer resistance to tPMP-1 in an otherwise susceptible parental strain. Deletions which removed the region containing the qacA gene in the S. aureus multiresistance plasmid pSK1 abolished tPMP-1 resistance. Resistance to tPMP-1 in the qacA-bearing strains was inoculum independent but peptide concentration dependent, with the level of resistance decreasing at higher peptide concentrations for a given inoculum. There was no apparent cross-resistance in qacA-bearing strains to other endogenous cationic antimicrobial peptides which are structurally distinct from tPMP-1, including human neutrophil defensin 1, protamine, or the staphylococcal lantibiotics pep5 and nisin. These data demonstrate that the staphylococcal multidrug resistance gene qacA also mediates in vitro resistance to cationic tPMP-1.

  18. Tribological properties of copper-based composites with copper coated NbSe2 and CNT

    International Nuclear Information System (INIS)

    Chen, Beibei; Yang, Jin; Zhang, Qing; Huang, Hong; Li, Hongping; Tang, Hua; Li, Changsheng

    2015-01-01

    Graphical abstract: Morphology of copper coated NbSe 2 and CNT; friction coefficient and wear rate of copper-based composites. - Highlights: • NbSe 2 and CNT were coated with copper layers by the means of electroless plating. • The mechanical and tribological properties of copper composites were studied. • The enhancement mechanisms of copper coated NbSe 2 and CNT were proposed. • Copper–copper coated (12 wt.%NbSe 2 –3 wt.%CNT) composite had the best wear resistance. - Abstract: Copper-based composites with copper coated NbSe 2 and/or CNT were fabricated by the powder metallurgy technique. The morphology and phase composition of copper coated NbSe 2 and carbon nanotube (CNT) were observed using high solution transmission electronic microscope (HRTEM), scanning electronic microscope (SEM equipped with EDS) and X-ray diffraction (XRD). The density, hardness, and bending strength of as-prepared copper-based composites were measured, and their tribological properties were investigated using UMT-2 tester. Results indicated that all copper-based composites showed decreased density and bending strength, but increased hardness in comparison with copper matrix. Besides, the incorporation of copper coated NbSe 2 improved the friction-reducing and anti-wear properties of copper matrix. Addition of copper coated CNT greatly enhanced the mechanical and tribological properties. In particular, when the content of copper coated CNT was 3 wt.%, the corresponding composite exhibited the best tribological properties. This was because NbSe 2 was distributed chaotically in matrix, which greatly improved the friction-reducing property of copper, while CNT with superior mechanical strength enhanced the wear resistance by increasing the load-carrying capacity. More importantly, copper layers coated on NbSe 2 and CNT favored the good interfacial combination between fillers and copper matrix showing beneficial effect for the stresses transferring from matrix to fillers

  19. Effect of copper addition on mechanical properties, corrosion resistance and antibacterial property of 316L stainless steel

    Energy Technology Data Exchange (ETDEWEB)

    Xi, Tong [School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024 (China); Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Shahzad, M. Babar [Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Xu, Dake [School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024 (China); Sun, Ziqing; Zhao, Jinlong [Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Yang, Chunguang, E-mail: cgyang@imr.ac.cn [Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Qi, Min [School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024 (China); Yang, Ke, E-mail: kyang@imr.ac.cn [Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China)

    2017-02-01

    The effects of addition of different Cu content (0, 2.5 and 3.5 wt%) on mechanical properties, corrosion resistance and antibacterial performance of 316L austenitic stainless steel (SS) after solution and aging treatment were investigated by mechanical test, transmission electron microscope (TEM), X-ray diffraction (XRD), electrochemical corrosion, X-ray photoelectron spectroscopy (XPS) and antibacterial test. The results showed that the Cu addition and heat treatment had no obvious influence on the microstructure with complete austenite features. The yield strength (YS) after solution treatment was almost similar, whereas the aging treatment obviously increased the YS due to formation of tiny Cu-rich precipitates. The pitting and protective potential of the solution treated Cu-bearing 316L SS in 0.9 wt% NaCl solution increased with increasing Cu content, while gradually declined after aging, owing to the high density Cu-rich precipitation. The antibacterial test proved that higher Cu content and aging were two compulsory processes to exert good antibacterial performance. The XPS results further indicated that aging enhanced the Cu enrichment in passive film, which could effectively stimulate the Cu ions release from the surface of passive film. - Highlights: • Higher Cu addition and aging guaranteed an excellent antibacterial property. • The Cu addition and heat treatment had no obvious influence on the microstructure. • The lower corrosion resistance for aging was attributed to Cu-rich precipitates.

  20. Silver nanosheet-coated copper nanowire/epoxy resin nanocomposites with enhanced electrical conductivity and wear resistance

    Energy Technology Data Exchange (ETDEWEB)

    Zeng, Ningning; Ma, Jingyi; Zhang, Yujuan; Yang, Guangbin; Zhang, Shengmao, E-mail: zsm@henu.edu.cn; Zhang, Pingyu [Henan University, Engineering Research Center for Nanomaterials (China)

    2017-03-15

    Silver (Ag) nanosheet-coated Cu nanowires (denoted as Cu@AgNWs) were prepared with a facile transmetalation reaction method. The effect of reaction conditions on the morphology and microstructure of the as-prepared Cu@AgNWs was investigated, and the thermal stability of Cu@AgNWs was evaluated by thermogravimetric analysis. In the meantime, the as-prepared Cu@AgNWs were used as the nanofillers of epoxy resin (EP), and their effect on the electrical conductivity and wear resistance of the EP-matrix composites was examined. Results indicate that the as-prepared Cu@AgNWs consist of CuNW core and Ag nanosheet shell. The Ag nanosheet shell can well inhibit the oxidation of the CuNW core, thereby providing the as-prepared Cu@AgNWs with good thermal stability even at an elevated temperature of 230 °C. The reaction temperature, Cu/Ag molar ratio, Cu dispersion concentration, and the dropping speed of silver ammonia reagent are suggested to be 40 °C, 5:1, 1% (mass fraction), and poured directly, respectively. Resultant Cu@AgNWs exhibit desired morphology and performance and can effectively increase the electrical conductivity and wear resistance of EP. This could make it feasible for the Cu@AgNW-EP composite to be applied as an electrostatic conductive material.

  1. Influence of liquid copper-silver brazing alloy on properties of high-strength and heat resistant alloys and steels

    International Nuclear Information System (INIS)

    Semenov, V.N.

    1999-01-01

    The influence of temperature, heating rate, microstructure, the duration of Cu-Ag melt attack during brazing, the thickness and the material of barrier coating on properties of materials (Ni-Cr alloys, Cr-Ni steals, a Fe-Ni base EhJ-702 alloy) being brazed is studied. The tests of specimens with a brazing alloy are carried out in the temperature range of 780-1000 deg C. It is revealed that heat resistant alloys under brazing conditions experience brittle fracture. Multiphase structure coarse grain, increased hydrogen content mechanical stress concentrators are found to intensity embrittlement of the materials. The use of barrier coating displaying a chemical affinity to the brazing alloy results in a decrease of the tendency to embrittlement

  2. Resistance of Coatings for Boiler Components of Waste-to-Energy Plants to Salt Melts Containing Copper Compounds

    Science.gov (United States)

    Galetz, Mathias Christian; Bauer, Johannes Thomas; Schütze, Michael; Noguchi, Manabu; Cho, Hiromitsu

    2013-06-01

    The accelerating effect of heavy metal compounds on the corrosive attack of boiler components like superheaters poses a severe problem in modern waste-to-energy plants (WTPs). Coatings are a possible solution to protect cheap, low alloyed steel substrates from heavy metal chloride and sulfate salts, which have a relatively low melting point. These salts dissolve many alloys, and therefore often are the limiting factor as far as the lifetime of superheater tubes is concerned. In this work the corrosion performance under artificial salt deposits of different coatings, manufactured by overlay welding, thermal spraying of self-fluxing as well as conventional systems was investigated. The results of our studies clearly demonstrate the importance of alloying elements such as molybdenum or silicon. Additionally, the coatings have to be dense and of a certain thickness in order to resist the corrosive attack under these severe conditions.

  3. A cytosolic copper storage protein provides a second level of copper tolerance in Streptomyces lividans.

    Science.gov (United States)

    Straw, Megan L; Chaplin, Amanda K; Hough, Michael A; Paps, Jordi; Bavro, Vassiliy N; Wilson, Michael T; Vijgenboom, Erik; Worrall, Jonathan A R

    2018-01-24

    Streptomyces lividans has a distinct dependence on the bioavailability of copper for its morphological development. A cytosolic copper resistance system is operative in S. lividans that serves to preclude deleterious copper levels. This system comprises of several CopZ-like copper chaperones and P 1 -type ATPases, predominantly under the transcriptional control of a metalloregulator from the copper sensitive operon repressor (CsoR) family. In the present study, we discover a new layer of cytosolic copper resistance in S. lividans that involves a protein belonging to the newly discovered family of copper storage proteins, which we have named Ccsp (cytosolic copper storage protein). From an evolutionary perspective, we find Ccsp homologues to be widespread in Bacteria and extend through into Archaea and Eukaryota. Under copper stress Ccsp is upregulated and consists of a homotetramer assembly capable of binding up to 80 cuprous ions (20 per protomer). X-ray crystallography reveals 18 cysteines, 3 histidines and 1 aspartate are involved in cuprous ion coordination. Loading of cuprous ions to Ccsp is a cooperative process with a Hill coefficient of 1.9 and a CopZ-like copper chaperone can transfer copper to Ccsp. A Δccsp mutant strain indicates that Ccsp is not required under initial copper stress in S. lividans, but as the CsoR/CopZ/ATPase efflux system becomes saturated, Ccsp facilitates a second level of copper tolerance.

  4. IL6 induces TAM resistance via kinase-specific phosphorylation of ERα in OVCA cells.

    Science.gov (United States)

    Wang, Yue; Niu, Xiu Long; Guo, Xiao Qin; Yang, Jing; Li, Ling; Qu, Ye; Xiu Hu, Cun; Mao, Li Qun; Wang, Dan

    2015-06-01

    About 40-60% of ovarian cancer (OVCA) cases express ERα, but only a small proportion of patients respond clinically to anti-estrogen treatment with estrogen receptor (ER) antagonist tamoxifen (TAM). The mechanism of TAM resistance in the course of OVCA progression remains unclear. However, IL6 plays a critical role in the development and progression of OVCA. Our recent results indicated that IL6 secreted by OVCA cells may promote the resistance of these cells to TAM via ER isoforms and steroid hormone receptor coactivator-1. Here we demonstrate that both exogenous (a relatively short period of treatment with recombinant IL6) and endogenous IL6 (generated as a result of transfection with a plasmid encoding sense IL6) increases expression of pERα-Ser118 and pERα-Ser167 in non-IL6-expressing A2780 cells, while deleting endogenous IL6 expression in IL6-overexpressing CAOV-3 cells (by transfection with a plasmid encoding antisense IL6) reduces expression of pERα-Ser118 and pERα-Ser167, indicating that IL6-induced TAM resistance may also be associated with increased expression of pERα-Ser118 and pERα-Ser167 in OVCA cells. Results of further investigation indicate that IL6 phosphorylates ERα at Ser118 and Ser167 by triggering activation of MEK/ERK and phosphotidylinositol 3 kinase/Akt signaling, respectively, to activate the ER pathway and thereby induce OVCA cells resistance to TAM. These results indicate that IL6 secreted by OVCA cells may also contribute to the refractoriness of these cells to TAM via the crosstalk between ER and IL6-mediated intracellular signal transduction cascades. Overexpression of IL6 not only plays an important role in OVCA progression but also promotes TAM resistance. Our results indicate that TAM-IL6-targeted adjunctive therapy may lead to a more effective intervention than TAM alone. © 2015 Society for Endocrinology.

  5. Copper Test

    Science.gov (United States)

    ... in the arm and/or a 24-hour urine sample is collected. Sometimes a health practitioner performs a liver ... disease , a rare inherited disorder that can lead to excess storage of copper in the liver, brain, and other ...

  6. In Vitro and In Vivo Effectiveness of an Innovative Silver-Copper Nanoparticle Coating of Catheters To Prevent Methicillin-Resistant Staphylococcus aureus Infection

    Science.gov (United States)

    Ballo, Myriam K. S.; Pulgarin, César; Hopf, Nancy; Berthet, Aurélie; Kiwi, John; Moreillon, Philippe; Bizzini, Alain

    2016-01-01

    In this study, silver/copper (Ag/Cu)-coated catheters were investigated for their efficacy in preventing methicillin-resistant Staphylococcus aureus (MRSA) infection in vitro and in vivo. Ag and Cu were sputtered (67/33% atomic ratio) on polyurethane catheters by direct-current magnetron sputtering. In vitro, Ag/Cu-coated and uncoated catheters were immersed in phosphate-buffered saline (PBS) or rat plasma and exposed to MRSA ATCC 43300 at 104 to 108 CFU/ml. In vivo, Ag/Cu-coated and uncoated catheters were placed in the jugular vein of rats. Directly after, MRSA (107 CFU/ml) was inoculated in the tail vein. Catheters were removed 48 h later and cultured. In vitro, Ag/Cu-coated catheters preincubated in PBS and exposed to 104 to 107 CFU/ml prevented the adherence of MRSA (0 to 12% colonization) compared to uncoated catheters (50 to 100% colonization; P < 0.005) and Ag/Cu-coated catheters retained their activity (0 to 20% colonization) when preincubated in rat plasma, whereas colonization of uncoated catheters increased (83 to 100%; P < 0.005). Ag/Cu-coating protection diminished with 108 CFU/ml in both PBS and plasma (50 to 100% colonization). In vivo, Ag/Cu-coated catheters reduced the incidence of catheter infection compared to uncoated catheters (57% versus 79%, respectively; P = 0.16) and bacteremia (31% versus 68%, respectively; P < 0.05). Scanning electron microscopy of explanted catheters suggests that the suboptimal activity of Ag/Cu catheters in vivo was due to the formation of a dense fibrin sheath over their surface. Ag/Cu-coated catheters thus may be able to prevent MRSA infections. Their activity might be improved by limiting plasma protein adsorption on their surfaces. PMID:27353266

  7. Electrical conduction in composites containing copper core–copper ...

    Indian Academy of Sciences (India)

    Unknown

    of Mott's small polaron hopping conduction model. ... sample exhibited a metallic conduction confirming the formation of a percolative chain of ..... value of εp. Also the oxide layer formation on the initially unoxidized copper particles will increase the resistivity level of the nanocomposite. This is borne out by results shown in ...

  8. Laser sintering of copper nanoparticles

    International Nuclear Information System (INIS)

    Zenou, Michael; Saar, Amir; Ermak, Oleg; Kotler, Zvi

    2014-01-01

    Copper nanoparticle (NP) inks serve as an attractive potential replacement to silver NP inks in functional printing applications. However their tendency to rapidly oxidize has so far limited their wider use. In this work we have studied the conditions for laser sintering of Cu-NP inks in ambient conditions while avoiding oxidation. We have determined the regime for stable, low-resistivity copper (< ×3 bulk resistivity value) generation in terms of laser irradiance and exposure duration and have indicated the limits on fast processing. The role of pre-drying conditions on sintering outcome has also been studied. A method, based on spectral reflectivity measurements, was used for non-contact monitoring of the sintering process evolution. It also indicates preferred spectral regions for sintering. Finally, we illustrated how selective laser sintering can generate high-quality, fine line (<5 µm wide) and dense copper circuits. (paper)

  9. Pathogenic adaptations to host-derived antibacterial copper

    Science.gov (United States)

    Chaturvedi, Kaveri S.; Henderson, Jeffrey P.

    2014-01-01

    Recent findings suggest that both host and pathogen manipulate copper content in infected host niches during infections. In this review, we summarize recent developments that implicate copper resistance as an important determinant of bacterial fitness at the host-pathogen interface. An essential mammalian nutrient, copper cycles between copper (I) (Cu+) in its reduced form and copper (II) (Cu2+) in its oxidized form under physiologic conditions. Cu+ is significantly more bactericidal than Cu2+ due to its ability to freely penetrate bacterial membranes and inactivate intracellular iron-sulfur clusters. Copper ions can also catalyze reactive oxygen species (ROS) generation, which may further contribute to their toxicity. Transporters, chaperones, redox proteins, receptors and transcription factors and even siderophores affect copper accumulation and distribution in both pathogenic microbes and their human hosts. This review will briefly cover evidence for copper as a mammalian antibacterial effector, the possible reasons for this toxicity, and pathogenic resistance mechanisms directed against it. PMID:24551598

  10. Unraveling the Amycolatopsis tucumanensis copper-resistome.

    Science.gov (United States)

    Dávila Costa, José Sebastián; Kothe, Erika; Abate, Carlos Mauricio; Amoroso, María Julia

    2012-10-01

    Heavy metal pollution is widespread causing serious ecological problems in many parts of the world; especially in developing countries where a budget for remediation technology is not affordable. Therefore, screening for microbes with high accumulation capacities and studying their stable resistance characteristics is advisable to define cost-effective any remediation strategies. Herein, the copper-resistome of the novel copper-resistant strain Amycolatopsis tucumanensis was studied using several approaches. Two dimensional gel electrophoresis revealed that proteins of the central metabolism, energy production, transcriptional regulators, two-component system, antioxidants and protective metabolites increased their abundance upon copper-stress conditions. Transcriptome analysis revealed that in presence of copper, superoxide dismutase, alkyl hydroperoxide reductase and mycothiol reductase genes were markedly induced in expression. The oxidative damage of protein and lipid from A. tucumanensis was negligible compared with that observed in the copper-sensitive strain Amycolatopsis eurytherma. Thus, we provide evidence that A. tucumamensis shows a high adaptation towards copper, the sum of which is proposed as the copper-resistome. This adaptation allows the strain to accumulate copper and survive this stress; besides, it constitutes the first report in which the copper-resistome of a strain of the genus Amycolatopsis with bioremediation potential has been evaluated.

  11. Encapsulation of electroless copper patterns into diamond films

    Energy Technology Data Exchange (ETDEWEB)

    Pimenov, S.M.; Shafeev, G.A.; Lavrischev, S.V. [General Physics Institute, Moscow (Russian Federation)] [and others

    1995-12-31

    The results are reported on encapsulating copper lines into diamond films grown by a DC plasma CVD. The process includes the steps of (i) laser activation of diamond for electroless metal plating, (ii) electroless copper deposition selectively onto the activated surface regions, and (iii) diamond regrowth on the Cu-patterned diamond films. The composition and electrical properties of the encapsulated copper lines were examined, revealing high purity and low electrical resistivity of the encapsulated electroless copper.

  12. Human Intestinal Cells Modulate Conjugational Transfer of Multidrug Resistance Plasmids between Clinical Escherichia coli Isolates

    DEFF Research Database (Denmark)

    Machado, Ana Manuel; Sommer, Morten

    2014-01-01

    Bacterial conjugation in the human gut microbiota is believed to play a major role in the dissemination of antibiotic resistance genes and virulence plasmids. However, the modulation of bacterial conjugation by the human host remains poorly understood and there is a need for controlled systems...... to study this process. We established an in vitro co-culture system to study the interaction between human intestinal cells and bacteria. We show that the conjugation efficiency of a plasmid encoding an extended spectrum beta-lactamase is reduced when clinical isolates of Escherichia coli are co...... of the intestinal cells exposed to bacteria leading to a two-fold reduction in conjugation efficiency. These results show that human gut epithelial cells can modulate bacterial conjugation and may have relevance to gene exchange in the gut....

  13. Attaching Copper Wires to Magnetic-Reed-Switch Leads

    Science.gov (United States)

    Kamila, Rudolf

    1987-01-01

    Bonding method reliably joins copper wires to short iron-alloy leads from glass-encased dry magnetic-reed switch without disturbing integrity of glass-to-metal seal. Joint resistant to high temperatures and has low electrical resistance.

  14. Demands made on high-purity copper for special purposes

    International Nuclear Information System (INIS)

    Roettges, D.

    1977-01-01

    The properties (electrical resistivity, residual impurities) of high-purity copper produced on a technical scale are reported as well as its practical applications. The paper discusses a high-oxygen copper (SV) with low residual resistivity at low temperatures and an oxygen-free (hydrogen-stable) copper (BE electronic) with low gas content. The SV quality has been specially developed for use as stabilizer in superconductors while the BE quality is used in high and ultrahigh vacuum. (GSC) [de

  15. The Bauschinger Effect in Copper

    DEFF Research Database (Denmark)

    Pedersen, Ole Bøcker; Brown, L .M.; Stobbs, W. M.

    1981-01-01

    A study of the Bauschinger effect in pure copper shows that by comparison with dispersion hardened copper the effect is very small and independent of temperature. This suggests that the obstacles to flow are deformable. A simple composite model based on this principle accounts for the data semi......-quantitatively and also accounts for the stored energy of cold-work. An interesting feature of the model is that it shows very clearly that, although dislocation pile-ups may exist, the flow stress of the composite is entirely due to the resistance to dislocation motion in the tangles of forest dislocations....

  16. EFECTO EN LA RESISTENCIA DE LAS ESCORIAS DE FUNDICIÓN DE COBRE COMO AGREGADO FINO EN EL COMPORTAMIENTO RESISTENTE DEL HORMIGÓN EFFECT OF SMELTING COPPER SLAG AS FINE AGGREGATE ON THE RESISTANT BEHAVIOR OF CONCRETE

    Directory of Open Access Journals (Sweden)

    Patricio Cendoya

    2009-04-01

    Full Text Available Las escorias de fundición de cobre son residuos industriales provenientes de la fundición del cobre las cuales procesadas en forma de granallas y sometidas a un proceso de molienda adquieren características similares a las de un árido fino. La presente investigación estudia la influencia que tiene su incorporación en el comportamiento mecánico a flexotracción y compresión en hormigones que emplean como árido fino una combinación de arenas del río Bío-Bío con proporciones de 25%, 40% y 50% en volumen de escorias de fundición de cobre. El árido fino resultante se utiliza en la confección de hormigones dosificados para relaciones de agua cemento de 0,45 y 0,52 asociadas a resistencias especificadas a la flexotracción de 3,6 y 4,3 MPa. Se mide la trabajabilidad en el hormigón fresco, la densidad, la carga de rotura por flexotracción y la carga de rotura por compresión en el hormigón endurecido comparando los resultados con un hormigón de referencia que no contiene escorias. Los resultados señalan que la docilidad de la mezcla se incrementa debido a la textura lisa de las escorias, se produce un aumento de la densidad del hormigón endurecido y las resistencias tanto a flexotracción como compresión se incrementan en función del contenido de escorias de fundición de cobre utilizado en la mezcla.Copper slag is a by product of the copper smelting industry. We took granulated copper slag and milled it until it acquired characteristics similar to those of a fine aggregate, which was then incorporated into concrete, in combination with Bio-Bio river sand in proportions of 25%, 40% and 50% by volume of copper slag. We then examined the impact of the different combinations on the mechanical behaviour to flexotraction and compression in the resulting concrete. Our specification was to produce concrete for water-cement ratios of 0,45 and 0,52 associated to breakage resistances to flexotraction of 3.6 and 4.3 MPa, respectively. We

  17. Thermal conductivity of tungsten–copper composites

    International Nuclear Information System (INIS)

    Lee, Sang Hyun; Kwon, Su Yong; Ham, Hye Jeong

    2012-01-01

    Highlights: ► We present the temperature dependence of the thermophysical properties for tungsten–copper composite from room temperature to 400 °C. The powders of tungsten–copper were produced by the spray conversion method and the W–Cu alloys were fabricated by the metal injection molding. Thermal conductivity and thermal expansion of tungsten–copper composite was controllable by volume fraction copper. - Abstract: As the speed and degree of integration of semiconductor devices increases, more heat is generated, and the performance and lifetime of semiconductor devices depend on the dissipation of the generated heat. Tungsten–copper alloys have high electrical and thermal conductivities, low contact resistances, and low coefficients of thermal expansion, thus allowing them to be used as a shielding material for microwave packages, and heat sinks for high power integrated circuits (ICs). In this study, the thermal conductivity and thermal expansion of several types of tungsten–copper (W–Cu) composites are investigated, using compositions of 5–30 wt.% copper balanced with tungsten. The tungsten–copper powders were produced using the spray conversion method, and the W–Cu alloys were fabricated via the metal injection molding. The tungsten–copper composite particles were nanosized, and the thermal conductivity of the W–Cu alloys gradually decreases with temperature increases. The thermal conductivity of the W–30 wt.% Cu composite was 238 W/(m K) at room temperature.

  18. Copper tolerance of Trichoderma species

    Directory of Open Access Journals (Sweden)

    Jovičić-Petrović Jelena

    2014-01-01

    Full Text Available Some Trichoderma strains can persist in ecosystems with high concentrations of heavy metals. The aim of this research was to examine the variability of Trichoderma strains isolated from different ecosystems, based on their morphological properties and restriction analysis of ITS fragments. The fungal growth was tested on potato dextrose agar, amended with Cu(II concentrations ranging from 0.25 to 10 mmol/l, in order to identify copper-resistant strains. The results indicate that some isolated strains of Trichoderma sp. show tolerance to higher copper concentrations. Further research to examine the ability of copper bioaccumulation by tolerant Trichoderma strains is needed. [Projekat Ministarstva nauke Republike Srbije, br. TR 31080 i br. III 43010

  19. Functional Analysis of Genes Comprising the Locus of Heat Resistance in Escherichia coli.

    Science.gov (United States)

    Mercer, Ryan; Nguyen, Oanh; Ou, Qixing; McMullen, Lynn; Gänzle, Michael G

    2017-10-15

    The locus of heat resistance (LHR) is a 15- to 19-kb genomic island conferring exceptional heat resistance to organisms in the family Enterobacteriaceae , including pathogenic strains of Salmonella enterica and Escherichia coli The complement of LHR-comprising genes that is necessary for heat resistance and the stress-induced or growth-phase-induced expression of LHR-comprising genes are unknown. This study determined the contribution of the seven LHR-comprising genes yfdX1 GI , yfdX2 , hdeD GI , orf11 , trx GI , kefB , and psiE GI by comparing the heat resistances of E. coli strains harboring plasmid-encoded derivatives of the different LHRs in these genes. (Genes carry a subscript "GI" [genomic island] if an ortholog of the same gene is present in genomes of E. coli ) LHR-encoded heat shock proteins sHSP20, ClpK GI , and sHSP GI are not sufficient for the heat resistance phenotype; YfdX1, YfdX2, and HdeD are necessary to complement the LHR heat shock proteins and to impart a high level of resistance. Deletion of trx GI , kefB , and psiE GI from plasmid-encoded copies of the LHR did not significantly affect heat resistance. The effect of the growth phase and the NaCl concentration on expression from the putative LHR promoter p2 was determined by quantitative reverse transcription-PCR and by a plasmid-encoded p2:GFP promoter fusion. The expression levels of exponential- and stationary-phase E. coli cells were not significantly different, but the addition of 1% NaCl significantly increased LHR expression. Remarkably, LHR expression in E. coli was dependent on a chromosomal copy of evgA In conclusion, this study improved our understanding of the genes required for exceptional heat resistance in E. coli and factors that increase their expression in food. IMPORTANCE The locus of heat resistance (LHR) is a genomic island conferring exceptional heat resistance to several foodborne pathogens. The exceptional level of heat resistance provided by the LHR questions the

  20. Multilevel Dual Damascene copper interconnections

    Science.gov (United States)

    Lakshminarayanan, S.

    Copper has been acknowledged as the interconnect material for future generations of ICs to overcome the bottlenecks on speed and reliability present with the current Al based wiring. A new set of challenges brought to the forefront when copper replaces aluminum, have to be met and resolved to make it a viable option. Unit step processes related to copper technology have been under development for the last few years. In this work, the application of copper as the interconnect material in multilevel structures with SiO2 as the interlevel dielectric has been explored, with emphasis on integration issues and complete process realization. Interconnect definition was achieved by the Dual Damascene approach using chemical mechanical polishing of oxide and copper. The choice of materials used as adhesion promoter/diffusion barrier included Ti, Ta and CVD TiN. Two different polish chemistries (NH4OH or HNO3 based) were used to form the interconnects. The diffusion barrier was removed during polishing (in the case of TiN) or by a post CMP etch (as with Ti or Ta). Copper surface passivation was performed using boron implantation and PECVD nitride encapsulation. The interlevel dielectric way composed of a multilayer stack of PECVD SiO2 and SixNy. A baseline process sequence which ensured the mechanical and thermal compatibility of the different unit steps was first created. A comprehensive test vehicle was designed and test structures were fabricated using the process flow developed. Suitable modifications were subsequently introduced in the sequence as and when processing problems were encountered. Electrical characterization was performed on the fabricated devices, interconnects, contacts and vias. The structures were subjected to thermal stressing to assess their stability and performance. The measurement of interconnect sheet resistances revealed lower copper loss due to dishing on samples polished using HNO3 based slurry. Interconnect resistances remained stable upto 400o

  1. Body of Knowledge (BOK) for Copper Wire Bonds

    Science.gov (United States)

    Rutkowski, E.; Sampson, M. J.

    2015-01-01

    Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications

  2. Comparative genomics of an IncA/C multidrug resistance plasmid from Escherichia coli and Klebsiella isolates from intensive care unit patients and the utility of whole-genome sequencing in health care settings.

    Science.gov (United States)

    Hazen, Tracy H; Zhao, LiCheng; Boutin, Mallory A; Stancil, Angela; Robinson, Gwen; Harris, Anthony D; Rasko, David A; Johnson, J Kristie

    2014-08-01

    The IncA/C plasmids have been implicated for their role in the dissemination of β-lactamases, including gene variants that confer resistance to expanded-spectrum cephalosporins, which are often the treatment of last resort against multidrug-resistant, hospital-associated pathogens. A bla(FOX-5) gene was detected in 14 Escherichia coli and 16 Klebsiella isolates that were cultured from perianal swabs of patients admitted to an intensive care unit (ICU) of the University of Maryland Medical Center (UMMC) in Baltimore, MD, over a span of 3 years. Four of the FOX-encoding isolates were obtained from subsequent samples of patients that were initially negative for an AmpC β-lactamase upon admission to the ICU, suggesting that the AmpC β-lactamase-encoding plasmid was acquired while the patient was in the ICU. The genomes of five E. coli isolates and six Klebsiella isolates containing bla(FOX-5) were selected for sequencing based on their plasmid profiles. An ∼ 167-kb IncA/C plasmid encoding the FOX-5 β-lactamase, a CARB-2 β-lactamase, additional antimicrobial resistance genes, and heavy metal resistance genes was identified. Another FOX-5-encoding IncA/C plasmid that was nearly identical except for a variable region associated with the resistance genes was also identified. To our knowledge, these plasmids represent the first FOX-5-encoding plasmids sequenced. We used comparative genomics to describe the genetic diversity of a plasmid encoding a FOX-5 β-lactamase relative to the whole-genome diversity of 11 E. coli and Klebsiella isolates that carry this plasmid. Our findings demonstrate the utility of whole-genome sequencing for tracking of plasmid and antibiotic resistance gene distribution in health care settings. Copyright © 2014, American Society for Microbiology. All Rights Reserved.

  3. New experimental methodology, setup and LabView program for accurate absolute thermoelectric power and electrical resistivity measurements between 25 and 1600 K: Application to pure copper, platinum, tungsten, and nickel at very high temperatures

    International Nuclear Information System (INIS)

    Abadlia, L.; Mayoufi, M.; Gasser, F.; Khalouk, K.; Gasser, J. G.

    2014-01-01

    In this paper we describe an experimental setup designed to measure simultaneously and very accurately the resistivity and the absolute thermoelectric power, also called absolute thermopower or absolute Seebeck coefficient, of solid and liquid conductors/semiconductors over a wide range of temperatures (room temperature to 1600 K in present work). A careful analysis of the existing experimental data allowed us to extend the absolute thermoelectric power scale of platinum to the range 0-1800 K with two new polynomial expressions. The experimental device is controlled by a LabView program. A detailed description of the accurate dynamic measurement methodology is given in this paper. We measure the absolute thermoelectric power and the electrical resistivity and deduce with a good accuracy the thermal conductivity using the relations between the three electronic transport coefficients, going beyond the classical Wiedemann-Franz law. We use this experimental setup and methodology to give new very accurate results for pure copper, platinum, and nickel especially at very high temperatures. But resistivity and absolute thermopower measurement can be more than an objective in itself. Resistivity characterizes the bulk of a material while absolute thermoelectric power characterizes the material at the point where the electrical contact is established with a couple of metallic elements (forming a thermocouple). In a forthcoming paper we will show that the measurement of resistivity and absolute thermoelectric power characterizes advantageously the (change of) phase, probably as well as DSC (if not better), since the change of phases can be easily followed during several hours/days at constant temperature

  4. New experimental methodology, setup and LabView program for accurate absolute thermoelectric power and electrical resistivity measurements between 25 and 1600 K: application to pure copper, platinum, tungsten, and nickel at very high temperatures.

    Science.gov (United States)

    Abadlia, L; Gasser, F; Khalouk, K; Mayoufi, M; Gasser, J G

    2014-09-01

    In this paper we describe an experimental setup designed to measure simultaneously and very accurately the resistivity and the absolute thermoelectric power, also called absolute thermopower or absolute Seebeck coefficient, of solid and liquid conductors/semiconductors over a wide range of temperatures (room temperature to 1600 K in present work). A careful analysis of the existing experimental data allowed us to extend the absolute thermoelectric power scale of platinum to the range 0-1800 K with two new polynomial expressions. The experimental device is controlled by a LabView program. A detailed description of the accurate dynamic measurement methodology is given in this paper. We measure the absolute thermoelectric power and the electrical resistivity and deduce with a good accuracy the thermal conductivity using the relations between the three electronic transport coefficients, going beyond the classical Wiedemann-Franz law. We use this experimental setup and methodology to give new very accurate results for pure copper, platinum, and nickel especially at very high temperatures. But resistivity and absolute thermopower measurement can be more than an objective in itself. Resistivity characterizes the bulk of a material while absolute thermoelectric power characterizes the material at the point where the electrical contact is established with a couple of metallic elements (forming a thermocouple). In a forthcoming paper we will show that the measurement of resistivity and absolute thermoelectric power characterizes advantageously the (change of) phase, probably as well as DSC (if not better), since the change of phases can be easily followed during several hours/days at constant temperature.

  5. Antwerp Copper Plates

    DEFF Research Database (Denmark)

    Wadum, Jørgen

    1999-01-01

    In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes.......In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes....

  6. Copper and Copper Proteins in Parkinson's Disease

    Science.gov (United States)

    Rivera-Mancia, Susana; Diaz-Ruiz, Araceli; Tristan-Lopez, Luis; Rios, Camilo

    2014-01-01

    Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson's disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson's disease and that a mutation in ATP7B could be associated with Parkinson's disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology. PMID:24672633

  7. Separation of copper-64 from copper phthalocyanine

    International Nuclear Information System (INIS)

    Battaglin, R.I.M.

    1979-01-01

    The separation of copper-64 from irradiated copper phthalocyanine by Szilard-Chalmers effect is studied. Two methods of separation are used: one of them is based on the dissolution of the irradiated dry compound in concentrated sulfuric acid following its precipitation in water. In the other one the compound is irradiated with water in paste form following treatment with water and hydrochloric acid. The influence of the crystal form of the copper phthalocyanine on the separation yield of copper-64 is shown. Preliminary tests using the ionic exchange technique for purification and changing of copper-64 sulfate to chloride form are carried out. The specific activity using the spectrophotometric technique, after the determination of the copper concentration in solution of copper-64, is calculated. (Author) [pt

  8. Nucleotide sequence of the Agrobacterium tumefaciens octopine Ti plasmid-encoded tmr gene

    NARCIS (Netherlands)

    Heidekamp, F.; Dirkse, W.G.; Hille, J.; Ormondt, H. van

    1983-01-01

    The nucleotide sequence of the tmr gene, encoded by the octopine Ti plasmid from Agrobacterium tumefaciens (pTiAch5), was determined. The T-DNA, which encompasses this gene, is involved in tumor formation and maintenance, and probably mediates the cytokinin-independent growth of transformed plant

  9. Chromosomal and plasmid-encoded factors of Shigella flexneri induce secretogenic activity ex vivo.

    Directory of Open Access Journals (Sweden)

    Christina S Faherty

    Full Text Available Shigella flexneri is a Gram-negative, facultative intracellular pathogen that causes millions of cases of watery or bloody diarrhea annually, resulting in significant global mortality. Watery diarrhea is thought to arise in the jejunum, and subsequent bloody diarrhea occurs as a result of invasion of the colonic epithelium. Previous literature has demonstrated that Shigella encodes enterotoxins, both chromosomally and on the 220 kilobase virulence plasmid. The ShigellaEnterotoxins 1 and 2 (ShET1 and ShET2 have been shown to increase water accumulation in the rabbit ileal loop model. In addition, these toxins increase the short circuit current in rabbit tissue mounted in Ussing chambers, which is a model for the ion exchange that occurs during watery diarrhea. In this study, we sought to validate the use of mouse jejunum in Ussing chamber as an alternative, more versatile model to study bacterial pathogenesis. In the process, we also identified enterotoxins in addition to ShET1 and ShET2 encoded by S. flexneri. Through analysis of proteins secreted from wildtype bacteria and various deletion mutants, we have identified four factors responsible for enterotoxin activity: ShET1 and Pic, which are encoded on the chromosome; ShET2 (encoded by sen or ospD3, which requires the type-III secretion system for secretion; and SepA, an additional factor encoded on the virulence plasmid. The use of mouse jejunum serves as a reliable and reproducible model to identify the enterotoxins elaborated by enteric bacteria. Moreover, the identification of all Shigella proteins responsible for enterotoxin activity is vital to our understanding of Shigella pathogenicity and to our success in developing safe and effective vaccine candidates.

  10. Immunological response and protection of mice immunized with plasmid encoding Toxoplasma gondii glycolytic enzyme malate dehydrogenase.

    Science.gov (United States)

    Hassan, I A; Wang, S; Xu, L; Yan, R; Song, X; XiangRui, L

    2014-12-01

    Toxoplasma gondii Malate dehydrogenase (TgMDH) plays an important role as part of the energy production cycle. In this investigation, immunological changes and protection efficiency of this protein delivered as a DNA vaccine have been evaluated. Mice were intramuscularly immunized with pTgMDH, followed by challenge with virulent T. gondii RH strain, 2 weeks after the booster immunization. Compared to the control groups, the results showed that pTgMDH has stimulated specific humoral response as demonstrated by significant high titers of total IgG and subclasses IgG1 and IgG2a , beside IgA and IgM, but not IgE. Analysis of cytokine profiles revealed significant increases of IFN-γ, IL-4 and IL-17, while no significant changes were detected in TGF-β1. In cell-mediated response, both T lymphocytes subpopulations CD4(+) and CD8(+) were positively recruited as significant percentages were recorded in response to immunization with TgMDH. Significant long survival rate, 17 days, has been observed in the TgMDH vaccinated group, in contrast with control groups which died within 8-9 days after challenge. These results demonstrated that TgMDH could induce significant immunological responses leading to a considerable level of protection against acute toxoplasmosis infection. © 2014 John Wiley & Sons Ltd.

  11. Centromere pairing by a plasmid-encoded type I ParB protein

    DEFF Research Database (Denmark)

    Ringgaard, Simon; Löwe, Jan; Gerdes, Kenn

    2007-01-01

    The par2 locus of Escherichia coli plasmid pB171 encodes two trans-acting proteins, ParA and ParB, and two cis-acting sites, parC1 and parC2, to which ParB binds cooperatively. ParA is related to MinD and oscillates in helical structures and thereby positions ParB/parC-carrying plasmids regularly......, hence identifying the N terminus of ParB as a requirement for ParB-mediated centromere pairing. These observations suggest that centromere pairing is an important intermediate step in plasmid partitioning mediated by the common type I loci....

  12. Antibiotic Resistance in an Indian Rural Community: A ‘One-Health’ Observational Study on Commensal Coliform from Humans, Animals, and Water

    Science.gov (United States)

    Purohit, Manju Raj; Chandran, Salesh; Shah, Harshada; Diwan, Vishal; Tamhankar, Ashok J.; Stålsby Lundborg, Cecilia

    2017-01-01

    Antibiotic-resistant bacteria are an escalating grim menace to global public health. Our aim is to phenotype and genotype antibiotic-resistant commensal Escherichia coli (E. coli) from humans, animals, and water from the same community with a ‘one-health’ approach. The samples were collected from a village belonging to demographic surveillance site of Ruxmaniben Deepchand (R.D.) Gardi Medical College Ujjain, Central India. Commensal coliforms from stool samples from children aged 1–3 years and their environment (animals, drinking water from children's households, common source- and waste-water) were studied for antibiotic susceptibility and plasmid-encoded resistance genes. E. coli isolates from human (n = 127), animal (n = 21), waste- (n = 12), source- (n = 10), and household drinking water (n = 122) carried 70%, 29%, 41%, 30%, and 30% multi-drug resistance, respectively. Extended spectrum beta-lactamase (ESBL) producers were 57% in human and 23% in environmental isolates. Co-resistance was frequent in penicillin, cephalosporin, and quinolone. Antibiotic-resistance genes blaCTX-M-9 and qnrS were most frequent. Group D-type isolates with resistance genes were mainly from humans and wastewater. Colistin resistance, or the mcr-1 gene, was not detected. The frequency of resistance, co-resistance, and resistant genes are high and similar in coliforms from humans and their environment. This emphasizes the need to mitigate antibiotic resistance with a ‘one-health’ approach. PMID:28383517

  13. Characterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements

    Energy Technology Data Exchange (ETDEWEB)

    Treger, Mikhail; Noyan, I. C. [Department of Applied Physics and Applied Mathematics, Columbia University, New York 10027 (United States); Witt, Christian [GlobalFoundries, T.J. Watson Research Center, Yorktown Heights, New York 10598 (United States); Cabral, Cyril; Murray, Conal; Jordan-Sweet, Jean [IBM, T.J. Watson Research Center, Yorktown Heights, New York 10598 (United States); Rosenberg, Robert [State University of New York, the University at Albany, Albany, NY 12203 (United States); Eisenbraun, Eric [College of Nanoscale Science and Engineering, University at Albany, Albany, NY 12203 (United States)

    2013-06-07

    Concurrent in-situ four-point probe resistivity and high resolution synchrotron x-ray diffraction measurements were used to characterize room temperature recrystallization in electroplated Cu thin films. The x-ray data were used to obtain the variation with time of the integrated intensities and the peak-breadth from the Cu 111 and 200 reflections of the transforming grains. The variation of the integrated intensity and resistivity data with time was analyzed using the Johnson-Mehl-Avrami-Kolmogorov (JMAK) model. For both 111-textured and non-textured electroplated Cu films, four-point probe resistivity measurements yielded shorter transformation times than the values obtained from the integrated intensities of the corresponding Cu 111 reflections. In addition, the JMAK exponents fitted to the resistivity data were significantly smaller. These discrepancies could be explained by considering the different material volumes from which resistivity and diffraction signals originated, and the physical processes which linked these signals to the changes in the evolving microstructure. Based on these issues, calibration of the resistivity analysis with direct structural characterization techniques is recommended.

  14. Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics

    International Nuclear Information System (INIS)

    Chung, Wan-Ho; Hwang, Hyun-Jun; Kim, Hak-Sung

    2015-01-01

    In this work, the hybrid copper inks with precursor and nanoparticles were fabricated and sintered via flash light irradiation to achieve highly conductive electrode pattern with low porosity. The hybrid copper ink was made of copper nanoparticles and various copper precursors (e.g., copper(II) chloride, copper(II) nitrate trihydrate, copper(II) sulfate pentahydrate and copper(II) trifluoroacetylacetonate). The printed hybrid copper inks were sintered at room temperature and under ambient conditions using an in-house flash light sintering system. The effects of copper precursor weight fraction and the flash light irradiation conditions (light energy and pulse duration) were investigated. Surfaces of the sintered hybrid copper patterns were analyzed using a scanning electron microscope. Also, spectroscopic characterization techniques such as Fourier transform infrared spectroscopy and X-ray diffraction were used to investigate the crystal phases of the flash light sintered copper precursors. High conductivity hybrid copper patterns (27.3 μΩ cm), which is comparable to the resistivity of bulk copper (1.68 μΩ cm) were obtained through flash light sintering at room temperature and under ambient conditions. - Highlights: • The hybrid copper inks with precursor and nanoparticles were fabricated. • The hybrid copper ink was sintered via flash light irradiation. • The resistivity of sintered hybrid copper ink was 27.3 μΩ cm. • Highly conductive copper film with low porosity could be achieved

  15. Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics

    Energy Technology Data Exchange (ETDEWEB)

    Chung, Wan-Ho; Hwang, Hyun-Jun [Department of Mechanical Convergence Engineering, Hanyang University, 17 Haendang-Dong, Seongdong-Gu, Seoul 133-791 (Korea, Republic of); Kim, Hak-Sung, E-mail: kima@hanyang.ac.kr [Department of Mechanical Convergence Engineering, Hanyang University, 17 Haendang-Dong, Seongdong-Gu, Seoul 133-791 (Korea, Republic of); Institute of Nano Science and Technology, Hanyang University, Seoul 133-791 (Korea, Republic of)

    2015-04-01

    In this work, the hybrid copper inks with precursor and nanoparticles were fabricated and sintered via flash light irradiation to achieve highly conductive electrode pattern with low porosity. The hybrid copper ink was made of copper nanoparticles and various copper precursors (e.g., copper(II) chloride, copper(II) nitrate trihydrate, copper(II) sulfate pentahydrate and copper(II) trifluoroacetylacetonate). The printed hybrid copper inks were sintered at room temperature and under ambient conditions using an in-house flash light sintering system. The effects of copper precursor weight fraction and the flash light irradiation conditions (light energy and pulse duration) were investigated. Surfaces of the sintered hybrid copper patterns were analyzed using a scanning electron microscope. Also, spectroscopic characterization techniques such as Fourier transform infrared spectroscopy and X-ray diffraction were used to investigate the crystal phases of the flash light sintered copper precursors. High conductivity hybrid copper patterns (27.3 μΩ cm), which is comparable to the resistivity of bulk copper (1.68 μΩ cm) were obtained through flash light sintering at room temperature and under ambient conditions. - Highlights: • The hybrid copper inks with precursor and nanoparticles were fabricated. • The hybrid copper ink was sintered via flash light irradiation. • The resistivity of sintered hybrid copper ink was 27.3 μΩ cm. • Highly conductive copper film with low porosity could be achieved.

  16. Resistance to the peptidyl transferase inhibitor tiamulin caused by mutation of ribosomal protein l3.

    Science.gov (United States)

    Bøsling, Jacob; Poulsen, Susan M; Vester, Birte; Long, Katherine S

    2003-09-01

    The antibiotic tiamulin targets the 50S subunit of the bacterial ribosome and interacts at the peptidyl transferase center. Tiamulin-resistant Escherichia coli mutants were isolated in order to elucidate mechanisms of resistance to the drug. No mutations in the rRNA were selected as resistance determinants using a strain expressing only a plasmid-encoded rRNA operon. Selection in a strain with all seven chromosomal rRNA operons yielded a mutant with an A445G mutation in the gene coding for ribosomal protein L3, resulting in an Asn149Asp alteration. Complementation experiments and sequencing of transductants demonstrate that the mutation is responsible for the resistance phenotype. Chemical footprinting experiments show a reduced binding of tiamulin to mutant ribosomes. It is inferred that the L3 mutation, which points into the peptidyl transferase cleft, causes tiamulin resistance by alteration of the drug-binding site. This is the first report of a mechanism of resistance to tiamulin unveiled in molecular detail.

  17. Gastrointestinal and in vitro release of copper, cadmium, indium, mercury and zinc from conventional and copper-rich amalgams

    International Nuclear Information System (INIS)

    Brune, D.; Gjerdet, N.; Paulsen, G.

    1983-01-01

    Particles of a conventional lathe-cut, a spherical non-gamma 2 and a copper amalgam have been gastrointestinally administered to rats for the purpose of evaluation of the dissolution resistance. The animals were sacrificed after 20 hrs. The contents of copper, cadmium, indium, mercury and zinc in kidney, liver, lung or blood were measured using nuclear tracer techniques. From a copper amalgam an extreme release of copper was demonstrated. This study simulates the clinical conditions of elemental release from swallowed amalgam particles after amalgam insertion or after removal of old amalgam fillings. Specimens of the same types of amalgams were also exposed to artificial saliva for a period of 10 days. The amounts of copper and mercury released were measured with flame and flameless atomic absorption spectrophotometry respectively. The levels of copper and mercury released from the copper amalgam were approximately 50 times those of the two other amalgam types studied. (author)

  18. Improving the efficiency of copper indium gallium (Di-)selenide (CIGS) solar cells through integration of a moth-eye textured resist with a refractive index similar to aluminum doped zinc oxide

    Energy Technology Data Exchange (ETDEWEB)

    Burghoorn, M.; Kniknie, B.; Deelen, J. van; Ee, R. van [The Netherlands Organisation for Applied Scientific Research (TNO), De Rondom 1, 5612 AP, Eindhoven (Netherlands); Xu, M. [The Netherlands Organisation for Applied Scientific Research (TNO), De Rondom 1, 5612 AP, Eindhoven (Netherlands); Delft University of Technology, Optics Group, Van der Waalsweg 8, 2628 CH, Delft (Netherlands); Vroon, Z. [The Netherlands Organisation for Applied Scientific Research (TNO), De Rondom 1, 5612 AP, Eindhoven (Netherlands); Zuyd Hogeschool, Nieuw Eyckholt 300, 6419 DJ, Heerlen (Netherlands); Belt, R. van de [Kriya Materials BV, Urmonderbaan 22, 6167 RD, Geleen (Netherlands); Buskens, P., E-mail: pascal.buskens@tno.nl, E-mail: buskens@dwi.rwth-aachen.de [The Netherlands Organisation for Applied Scientific Research (TNO), De Rondom 1, 5612 AP, Eindhoven (Netherlands); DWI – Leibniz Institute for Interactive Materials, Forckenbeckstrasse 50, 52056, Aachen (Germany)

    2014-12-15

    Textured transparent conductors are widely used in thin-film silicon solar cells. They lower the reflectivity at interfaces between different layers in the cell and/or cause an increase in the path length of photons in the Si absorber layer, which both result in an increase in the number of absorbed photons and, consequently, an increase in short-circuit current density (J{sub sc}) and cell efficiency. Through optical simulations, we recently obtained strong indications that texturing of the transparent conductor in copper indium gallium (di-)selenide (CIGS) solar cells is also optically advantageous. Here, we experimentally demonstrate that the J{sub sc} and efficiency of CIGS solar cells with an absorber layer thickness (d{sub CIGS}) of 0.85 μm, 1.00 μm and 2.00 μm increase through application of a moth-eye textured resist with a refractive index that is sufficiently similar to AZO (n{sub resist} = 1.792 vs. n{sub AZO} = 1.913 at 633 nm) to avoid large optical losses at the resist-AZO interface. On average, J{sub sc} increases by 7.2%, which matches the average reduction in reflection of 7.0%. The average relative increase in efficiency is slightly lower (6.0%). No trend towards a larger relative increase in J{sub sc} with decreasing d{sub CIGS} was observed. Ergo, the increase in J{sub sc} can be fully explained by the reduction in reflection, and we did not observe any increase in J{sub sc} based on an increased photon path length.

  19. Influence of carbon content on the copper-telluride phase formation and on the resistive switching behavior of carbon alloyed Cu-Te conductive bridge random access memory cells

    International Nuclear Information System (INIS)

    Devulder, Wouter; De Schutter, Bob; Detavernier, Christophe; Opsomer, Karl; Franquet, Alexis; Meersschaut, Johan; Muller, Robert; Van Elshocht, Sven; Jurczak, Malgorzata; Goux, Ludovic; Belmonte, Attilio

    2014-01-01

    In this paper, we investigate the influence of the carbon content on the Cu-Te phase formation and on the resistive switching behavior in carbon alloyed Cu 0.6 Te 0.4 based conductive bridge random access memory (CBRAM) cells. Carbon alloying of copper-tellurium inhibits the crystallization, while attractive switching behavior is preserved when using the material as Cu-supply layer in CBRAM cells. The phase formation is first investigated in a combinatorial way. With increasing carbon content, an enlargement of the temperature window in which the material stays amorphous was observed. Moreover, if crystalline phases are formed, subsequent phase transformations are inhibited. The electrical switching behavior of memory cells with different carbon contents is then investigated by implementing them in 580 μm diameter dot TiN/Cu 0.6 Te 0.4 -C/Al 2 O 3 /Si memory cells. Reliable switching behavior is observed for carbon contents up to 40 at. %, with a resistive window of more than 2 orders of magnitude, whereas for 50 at. % carbon, a higher current in the off state and only a small resistive window are present after repeated cycling. This degradation can be ascribed to the higher thermal and lower drift contribution to the reset operation due to a lower Cu affinity towards the supply layer, leading cycle-after-cycle to an increasing amount of Cu in the switching layer, which contributes to the current. The thermal diffusion of Cu into Al 2 O 3 under annealing also gives an indication of the Cu affinity of the source layer. Time of flight secondary ion mass spectroscopy was used to investigate this migration depth in Al 2 O 3 before and after annealing, showing a higher Cu, Te, and C migration for high carbon contents

  20. Influence of carbon content on the copper-telluride phase formation and on the resistive switching behavior of carbon alloyed Cu-Te conductive bridge random access memory cells

    Science.gov (United States)

    Devulder, Wouter; Opsomer, Karl; Franquet, Alexis; Meersschaut, Johan; Belmonte, Attilio; Muller, Robert; De Schutter, Bob; Van Elshocht, Sven; Jurczak, Malgorzata; Goux, Ludovic; Detavernier, Christophe

    2014-02-01

    In this paper, we investigate the influence of the carbon content on the Cu-Te phase formation and on the resistive switching behavior in carbon alloyed Cu0.6Te0.4 based conductive bridge random access memory (CBRAM) cells. Carbon alloying of copper-tellurium inhibits the crystallization, while attractive switching behavior is preserved when using the material as Cu-supply layer in CBRAM cells. The phase formation is first investigated in a combinatorial way. With increasing carbon content, an enlargement of the temperature window in which the material stays amorphous was observed. Moreover, if crystalline phases are formed, subsequent phase transformations are inhibited. The electrical switching behavior of memory cells with different carbon contents is then investigated by implementing them in 580 μm diameter dot TiN/Cu0.6Te0.4-C/Al2O3/Si memory cells. Reliable switching behavior is observed for carbon contents up to 40 at. %, with a resistive window of more than 2 orders of magnitude, whereas for 50 at. % carbon, a higher current in the off state and only a small resistive window are present after repeated cycling. This degradation can be ascribed to the higher thermal and lower drift contribution to the reset operation due to a lower Cu affinity towards the supply layer, leading cycle-after-cycle to an increasing amount of Cu in the switching layer, which contributes to the current. The thermal diffusion of Cu into Al2O3 under annealing also gives an indication of the Cu affinity of the source layer. Time of flight secondary ion mass spectroscopy was used to investigate this migration depth in Al2O3 before and after annealing, showing a higher Cu, Te, and C migration for high carbon contents.

  1. Application of Copper-Chitosan Nanoparticles Stimulate Growth and Induce Resistance in Finger Millet (Eleusine coracana Gaertn.) Plants against Blast Disease.

    Science.gov (United States)

    Sathiyabama, Muthukrishnan; Manikandan, Appu

    2018-02-28

    Copper-chitosan nanoparticle (CuChNp) was synthesized and used to study its effect on finger millet plant as a model plant system. Our objective was to explore the efficacy of CuChNp application to control blast disease of finger millet. CuChNp was applied to finger millet either as a foliar spray or as a combined application (involving seed coat and foliar spray). Both the application methods enhanced growth profile of finger millet plants and increased yield. The increased yield was nearly 89% in combined application method. Treated finger millet plants challenged with Pyricularia grisea showed suppression of blast disease development when compared to control. Nearly 75% protection was observed in the combined application of CuChNp to finger millet plants. In CuChNp treated finger millet plants, a significant increase in defense enzymes was observed, which was detected both qualitatively and quantitatively. The suppression of blast disease correlates well with increased defense enzymes in CuChNp treated finger millet plants.

  2. Genomic insights into a new acidophilic, copper-resistant Desulfosporosinus isolate from the oxidized tailings area of an abandoned gold mine.

    Science.gov (United States)

    Mardanov, Andrey V; Panova, Inna A; Beletsky, Alexey V; Avakyan, Marat R; Kadnikov, Vitaly V; Antsiferov, Dmitry V; Banks, David; Frank, Yulia A; Pimenov, Nikolay V; Ravin, Nikolai V; Karnachuk, Olga V

    2016-08-01

    Microbial sulfate reduction in acid mine drainage is still considered to be confined to anoxic conditions, although several reports have shown that sulfate-reducing bacteria occur under microaerophilic or aerobic conditions. We have measured sulfate reduction rates of up to 60 nmol S cm(-3) day(-1) in oxidized layers of gold mine tailings in Kuzbass (SW Siberia). A novel, acidophilic, copper-tolerant Desulfosporosinus sp. I2 was isolated from the same sample and its genome was sequenced. The genomic analysis and physiological data indicate the involvement of transporters and additional mechanisms to tolerate metals, such as sequestration by polyphosphates. Desulfosporinus sp. I2 encodes systems for a metabolically versatile life style. The genome possessed a complete Embden-Meyerhof pathway for glycolysis and gluconeogenesis. Complete oxidation of organic substrates could be enabled by the complete TCA cycle. Genomic analysis found all major components of the electron transfer chain necessary for energy generation via oxidative phosphorylation. Autotrophic CO2 fixation could be performed through the Wood-Ljungdahl pathway. Multiple oxygen detoxification systems were identified in the genome. Taking into account the metabolic activity and genomic analysis, the traits of the novel isolate broaden our understanding of active sulfate reduction and associated metabolism beyond strictly anaerobic niches. © FEMS 2016. All rights reserved. For permissions, please e-mail: journals.permissions@oup.com.

  3. Cloning and expression analysis of a blue copper- binding protein ...

    African Journals Online (AJOL)

    Jane

    2011-07-20

    Jul 20, 2011 ... decreased to constitutive level at 72 h after inoculation in resistant Gh21 line ... lignification of cell wall or scavenging of reactive oxygen species (ROS) during powdery mildew attack ... or other ions in plants (Lin and Wu, 1994), whose .... nutrient-uptake and copper accumulation in protein of copper-tolerant.

  4. Grain boundary corrosion of copper canister material

    International Nuclear Information System (INIS)

    Fennell, P.A.H.; Graham, A.J.; Smart, N.R.; Sofield, C.J.

    2001-03-01

    The proposed design for a final repository for spent fuel and other long-lived residues in Sweden is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will then be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast inner container fitted inside a corrosion-resistant copper canister. During fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow they will tend to concentrate impurities within the copper at the new grain boundaries. The work described in this report was undertaken to determine whether there is any possibility of enhanced corrosion at grain boundaries within the copper canister. The potential for grain boundary corrosion was investigated by exposing copper specimens, which had undergone different heat treatments and hence had different grain sizes, to aerated artificial bentonite-equilibrated groundwater with two concentrations of chloride, for increasing periods of time. The degree of grain boundary corrosion was determined by atomic force microscopy (AFM) and optical microscopy. AFM showed no increase in grain boundary 'ditching' for low chloride groundwater. In high chloride groundwater the surface was covered uniformly with a fine-grained oxide. No increases in oxide thickness were observed. No significant grain boundary attack was observed using optical microscopy either. The work suggests that in aerated artificial groundwaters containing chloride ions, grain boundary corrosion of copper is unlikely to adversely affect SKB's copper canisters

  5. Role of copper oxides in contact killing of bacteria.

    Science.gov (United States)

    Hans, Michael; Erbe, Andreas; Mathews, Salima; Chen, Ying; Solioz, Marc; Mücklich, Frank

    2013-12-31

    The potential of metallic copper as an intrinsically antibacterial material is gaining increasing attention in the face of growing antibiotics resistance of bacteria. However, the mechanism of the so-called "contact killing" of bacteria by copper surfaces is poorly understood and requires further investigation. In particular, the influences of bacteria-metal interaction, media composition, and copper surface chemistry on contact killing are not fully understood. In this study, copper oxide formation on copper during standard antimicrobial testing was measured in situ by spectroscopic ellipsometry. In parallel, contact killing under these conditions was assessed with bacteria in phosphate buffered saline (PBS) or Tris-Cl. For comparison, defined Cu2O and CuO layers were thermally generated and characterized by grazing incidence X-ray diffraction. The antibacterial properties of these copper oxides were tested under the conditions used above. Finally, copper ion release was recorded for both buffer systems by inductively coupled plasma atomic absorption spectroscopy, and exposed copper samples were analyzed for topographical surface alterations. It was found that there was a fairly even growth of CuO under wet plating conditions, reaching 4-10 nm in 300 min, but no measurable Cu2O was formed during this time. CuO was found to significantly inhibit contact killing, compared to pure copper. In contrast, thermally generated Cu2O was essentially as effective in contact killing as pure copper. Copper ion release from the different surfaces roughly correlated with their antibacterial efficacy and was highest for pure copper, followed by Cu2O and CuO. Tris-Cl induced a 10-50-fold faster copper ion release compared to PBS. Since the Cu2O that primarily forms on copper under ambient conditions is as active in contact killing as pure copper, antimicrobial objects will retain their antimicrobial properties even after oxide formation.

  6. Aquatic Life Criteria - Copper

    Science.gov (United States)

    Documents pertain to Aquatic Life Ambient Water Quality criteria for Copper (2007 Freshwater, 2016 Estuarine/marine). These documents contain the safe levels of Copper in water that should protect to the majority of species.

  7. Grape berry bacterial inhibition by different copper fungicides

    Directory of Open Access Journals (Sweden)

    Martins Guilherme

    2016-01-01

    Full Text Available Copper fungicides are widely used in viticulture. Due to its large spectrum of action, copper provides an efficient control over a great number of vine pathogens. Previous studies showed that, high levels of cupric residues can impact grape-berry microbiota, in terms of the size and population structure, reducing the diversity and the abundance. Due to the importance of grape-berry bacterial in crop health, and the potential impact of copper fungicides over the microbiota, we determined Minimum Inhibitory Concentration (MIC of different copper formulations for bacterial species isolated from grape berries. We study the Minimum Inhibitory Concentration (MIC of different copper formulations (copper sulphate (CuSO4 pure, Bordeaux mixture (CuSO4 + Ca(OH2, copper oxide (Cu2O, copper hydroxide (Cu(OH2 over 92 bacterial strains isolated from grape berries in different stages of the ripening process. The results of MIC measurements revealed that the different copper formulations have a variable inhibitory effect and among the different isolates, some species are the most resistant to all copper formulations than others. This study confirm that usage of cupric phytosanitary products should be reasonable independently of the farming system; they also provide evidence of the importance of the choice of which copper formulations are to be used regarding their impact on the grape berry bacterial microbiota.

  8. Copper Bioleaching in Chile

    OpenAIRE

    Juan Carlos Gentina; Fernando Acevedo

    2016-01-01

    Chile has a great tradition of producing and exporting copper. Over the last several decades, it has become the first producer on an international level. Its copper reserves are also the most important on the planet. However, after years of mineral exploitation, the ease of extracting copper oxides and ore copper content has diminished. To keep the production level high, the introduction of new technologies has become necessary. One that has been successful is bioleaching. Chile had the first...

  9. Effect of Copper on Passivity and Corrosion Behavior of Fe-xC-5Cu ...

    African Journals Online (AJOL)

    ... copper/microstructure is discussed. Alloying Cu showed a beneficial effect on hypoeutectoid steel and harmful effect on hypereutectoid steel. The improved corrosion resistance is related to cementite morphology and by a copper dissolution/re-deposition process. Keywords: Corrosion; Copper; cementite; EIS; Passivation ...

  10. Demystifying Controlling Copper Corrosion

    Science.gov (United States)

    The LCR systematically misses the highest health and corrosion risk sites for copper. Additionally, there are growing concerns for WWTP copper in sludges and discharge levels. There are many corrosion control differences between copper and lead. This talk explains the sometimes c...

  11. Assessment of copper resistance to stress-corrosion cracking in nitrite solutions by means of joint analysis of acoustic emission measurements, deformation diagrams, qualitative and quantitative fractography, and non-linear fracture mechanics

    Energy Technology Data Exchange (ETDEWEB)

    Khanzhin, V.G.; Nikulin, S.A. [Moscow State Inst. of Steel and Alloys (Russian Federation)

    2005-06-01

    A study of stress-corrosion cracking (SCC) of copper in 0.1M NaNO{sub 2} aqueous solution is presented. The fracture kinetics was monitored by measuring the acoustic emission (AE) signals. Macro- and micro-fractography analysis, using scanning electron microscopy (SEM), was employed to investigate the fracture mechanisms. Estimates of stress intensity factor, KI, and J-integral were derived in order to assess the resistance of copper to stress corrosion cracking. Two kinds of SCC tests under continuous circulation of the corrosive solution were employed in the present study: 1. Constant extension rate (2x10{sup -6}/s) tests on pre-cracked, middle tension (MT) panel specimens. 2. Tests on pre-cracked, compact tension (CT) specimens at a fixed (by a fixing bolt) opening of the crack walls ({delta} = 0.3 mm, K{sub i} = 27 MPax{radical}m). The time base for these tests was about two months. After the completion of the SCC test, the CT specimen was additionally tested, under a constant-rate (0.02 mm/s) off-center extension. In the both kinds of tests, the SCC fracture kinetics is found to exhibit two typical stages: Stage 1: SCC initiation stage (after a certain incubation period, T{sub i}, measured to be T{sub i} {approx_equal} 3-4 hours for MT specimens under constant extension, the corresponding stress was {sigma} {approx_equal} 40-70 MPa, and T{sub i} {approx_equal} 200 hours for CT specimens under a fixed crack wall opening). Stage 2: Active fracture process (SCC macro-fracture) distinguished by strong AE pulses (which are registered after time T{sub 2} {approx_equal} 8 hours for MT specimens and T{sub 2} {approx_equal} 800 hours for CT specimens). Fractography analysis has shown that the zone of SCC fracture in MT specimens extends to approximately 1,500 {mu}m. A 400-700 {mu}m deep zone of brittle transgranular fracture, which included small areas showing characteristic SCC 'striations', was observed adjacent to the fatigue pre-crack area. At higher

  12. Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites

    OpenAIRE

    Ugarteche, Caroline Velasques; Furlan, Kaline Pagnan; Pereira, Rafaela do Vale; Trindade, Gabriel; Binder, Roberto; Binder, Cristiano; Klein, Aloisio Nelmo

    2015-01-01

    Copper is a well know material for use as heat sink or heat exchanger. However, copper has a considerable low tensile strength and temperature limit. A material that has a good thermal conductivity, low cost, but also resistance is the desired. Effects of copper on the sintering and thermal properties of iron-copper composites produced by powder metallurgy and Fe on copper-iron composites have been investigated. Copper and iron were varied from 20 to 80 vol.% in the samples, alternating the c...

  13. Radiation-effects limits on copper in superconducting magnets

    Energy Technology Data Exchange (ETDEWEB)

    Guinan, M.W.

    1983-05-25

    The determination of the response of copper stabilizers to neutron irradiation in fusion-reactor superconducting magnets requires information in four areas: (1) neutron flux and spectrum determination, (2) resistivity changes at zero field, (3) resistivity changes at field, and (4) the cyclic irradiation and annealing. Applications of our current understanding of the limits of copper stabilizers in fusion-reactor designs are explored in two examples. Recommendations for future additions to the data base are discussed.

  14. Radiation-effects limits on copper in superconducting magnets

    International Nuclear Information System (INIS)

    Guinan, M.W.

    1983-01-01

    The determination of the response of copper stabilizers to neutron irradiation in fusion-reactor superconducting magnets requires information in four areas: (1) neutron flux and spectrum determination, (2) resistivity changes at zero field, (3) resistivity changes at field, and (4) the cyclic irradiation and annealing. Applications of our current understanding of the limits of copper stabilizers in fusion-reactor designs are explored in two examples. Recommendations for future additions to the data base are discussed

  15. Improving the efficiency of copper indium gallium (Di-selenide (CIGS solar cells through integration of a moth-eye textured resist with a refractive index similar to aluminum doped zinc oxide

    Directory of Open Access Journals (Sweden)

    M. Burghoorn

    2014-12-01

    Full Text Available Textured transparent conductors are widely used in thin-film silicon solar cells. They lower the reflectivity at interfaces between different layers in the cell and/or cause an increase in the path length of photons in the Si absorber layer, which both result in an increase in the number of absorbed photons and, consequently, an increase in short-circuit current density (Jsc and cell efficiency. Through optical simulations, we recently obtained strong indications that texturing of the transparent conductor in copper indium gallium (di-selenide (CIGS solar cells is also optically advantageous. Here, we experimentally demonstrate that the Jsc and efficiency of CIGS solar cells with an absorber layer thickness (dCIGS of 0.85 μm, 1.00 μm and 2.00 μm increase through application of a moth-eye textured resist with a refractive index that is sufficiently similar to AZO (nresist = 1.792 vs. nAZO = 1.913 at 633 nm to avoid large optical losses at the resist-AZO interface. On average, Jsc increases by 7.2%, which matches the average reduction in reflection of 7.0%. The average relative increase in efficiency is slightly lower (6.0%. No trend towards a larger relative increase in Jsc with decreasing dCIGS was observed. Ergo, the increase in Jsc can be fully explained by the reduction in reflection, and we did not observe any increase in Jsc based on an increased photon path length.

  16. Potassium sorbate-A new aqueous copper corrosion inhibitor

    International Nuclear Information System (INIS)

    Abelev, Esta; Starosvetsky, David; Ein-Eli, Yair

    2007-01-01

    This work presents the novel nature of 2,4-hexadienoic acid potassium salt (potassium sorbate (KCH 3 CH=CHCH=CHCO 2 )) as an effective copper aqueous corrosion inhibitor. The influence of pH and potassium sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in potassium sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of potassium sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-sorbate at the metal surface

  17. Characterization of Multidrug Resistant ESBL-Producing Escherichia coli Isolates from Hospitals in Malaysia

    Directory of Open Access Journals (Sweden)

    King-Ting Lim

    2009-01-01

    Full Text Available The emergence of Escherichia coli that produce extended spectrum β-lactamases (ESBLs and are multidrug resistant (MDR poses antibiotic management problems. Forty-seven E. coli isolates from various public hospitals in Malaysia were studied. All isolates were sensitive to imipenem whereas 36 were MDR (resistant to 2 or more classes of antibiotics. PCR detection using gene-specific primers showed that 87.5% of the ESBL-producing E. coli harbored the blaTEM gene. Other ESBL-encoding genes detected were blaOXA, blaSHV, and blaCTX-M. Integron-encoded integrases were detected in 55.3% of isolates, with class 1 integron-encoded intI1 integrase being the majority. Amplification and sequence analysis of the 5′CS region of the integrons showed known antibiotic resistance-encoding gene cassettes of various sizes that were inserted within the respective integrons. Conjugation and transformation experiments indicated that some of the antibiotic resistance genes were likely plasmid-encoded and transmissible. All 47 isolates were subtyped by PFGE and PCR-based fingerprinting using random amplified polymorphic DNA (RAPD, repetitive extragenic palindromes (REPs, and enterobacterial repetitive intergenic consensus (ERIC. These isolates were very diverse and heterogeneous. PFGE, ERIC, and REP-PCR methods were more discriminative than RAPD in subtyping the E. coli isolates.

  18. Identification of dfrA14 in two distinct plasmids conferring trimethoprim resistance in Actinobacillus pleuropneumoniae.

    Science.gov (United States)

    Bossé, Janine T; Li, Yanwen; Walker, Stephanie; Atherton, Tom; Fernandez Crespo, Roberto; Williamson, Susanna M; Rogers, Jon; Chaudhuri, Roy R; Weinert, Lucy A; Oshota, Olusegun; Holden, Matt T G; Maskell, Duncan J; Tucker, Alexander W; Wren, Brendan W; Rycroft, Andrew N; Langford, Paul R

    2015-08-01

    The objective of this study was to determine the distribution and genetic basis of trimethoprim resistance in Actinobacillus pleuropneumoniae isolates from pigs in England. Clinical isolates collected between 1998 and 2011 were tested for resistance to trimethoprim and sulphonamide. The genetic basis of trimethoprim resistance was determined by shotgun WGS analysis and the subsequent isolation and sequencing of plasmids. A total of 16 (out of 106) A. pleuropneumoniae isolates were resistant to both trimethoprim (MIC >32 mg/L) and sulfisoxazole (MIC ≥256 mg/L), and a further 32 were resistant only to sulfisoxazole (MIC ≥256 mg/L). Genome sequence data for the trimethoprim-resistant isolates revealed the presence of the dfrA14 dihydrofolate reductase gene. The distribution of plasmid sequences in multiple contigs suggested the presence of two distinct dfrA14-containing plasmids in different isolates, which was confirmed by plasmid isolation and sequencing. Both plasmids encoded mobilization genes, the sulphonamide resistance gene sul2, as well as dfrA14 inserted into strA, a streptomycin-resistance-associated gene, although the gene order differed between the two plasmids. One of the plasmids further encoded the strB streptomycin-resistance-associated gene. This is the first description of mobilizable plasmids conferring trimethoprim resistance in A. pleuropneumoniae and, to our knowledge, the first report of dfrA14 in any member of the Pasteurellaceae. The identification of dfrA14 conferring trimethoprim resistance in A. pleuropneumoniae isolates will facilitate PCR screens for resistance to this important antimicrobial. © The Author 2015. Published by Oxford University Press on behalf of the British Society for Antimicrobial Chemotherapy.

  19. Nanoscale Copper and Copper Compounds for Advanced Device Applications

    Science.gov (United States)

    Chen, Lih-Juann

    2016-12-01

    Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

  20. Novel Conserved Genotypes Correspond to Antibiotic Resistance Phenotypes of E. coli Clinical Isolates.

    Science.gov (United States)

    Swick, Michelle C; Evangelista, Michael A; Bodine, Truston J; Easton-Marks, Jeremy R; Barth, Patrick; Shah, Minita J; Bormann Chung, Christina A; Stanley, Sarah; McLaughlin, Stephen F; Lee, Clarence C; Sheth, Vrunda; Doan, Quynh; Hamill, Richard J; Steffen, David; Becnel, Lauren B; Sucgang, Richard; Zechiedrich, Lynn

    2013-01-01

    Current efforts to understand antibiotic resistance on the whole genome scale tend to focus on known genes even as high throughput sequencing strategies uncover novel mechanisms. To identify genomic variations associated with antibiotic resistance, we employed a modified genome-wide association study; we sequenced genomic DNA from pools of E. coli clinical isolates with similar antibiotic resistance phenotypes using SOLiD technology to uncover single nucleotide polymorphisms (SNPs) unanimously conserved in each pool. The multidrug-resistant pools were genotypically similar to SMS-3-5, a previously sequenced multidrug-resistant isolate from a polluted environment. The similarity was evenly spread across the entire genome and not limited to plasmid or pathogenicity island loci. Among the pools of clinical isolates, genomic variation was concentrated adjacent to previously reported inversion and duplication differences between the SMS-3-5 isolate and the drug-susceptible laboratory strain, DH10B. SNPs that result in non-synonymous changes in gyrA (encoding the well-known S83L allele associated with fluoroquinolone resistance), mutM, ligB, and recG were unanimously conserved in every fluoroquinolone-resistant pool. Alleles of the latter three genes are tightly linked among most sequenced E. coli genomes, and had not been implicated in antibiotic resistance previously. The changes in these genes map to amino acid positions in alpha helices that are involved in DNA binding. Plasmid-encoded complementation of null strains with either allelic variant of mutM or ligB resulted in variable responses to ultraviolet light or hydrogen peroxide treatment as markers of induced DNA damage, indicating their importance in DNA metabolism and revealing a potential mechanism for fluoroquinolone resistance. Our approach uncovered evidence that additional DNA binding enzymes may contribute to fluoroquinolone resistance and further implicate environmental bacteria as a reservoir for

  1. Kinetics of the conversion of copper sulfide to blister copper

    Directory of Open Access Journals (Sweden)

    Carrillo, F.

    2002-10-01

    Full Text Available The desulfurization of copper sulfide by air and oxygen has been studied in two laboratory reactors where the gas is blown onto the melt surface. Rates of oxidation in a vertical resistance furnace may be explained by the mass transfer control in the gas phase. However, results for a horizontal tube suggest that the chemical resistance is controlling.

    La desulfuración del sulfuro cuproso con aire y oxígeno se ha estudiado en dos reactores de laboratorio, en los cuales el gas se sopla sobre la superficie del fundido. La velocidad de reacción en un horno de resistencias verticales se puede explicar considerando como controlante la resistencia a la transferencia de materia de la fase gas. Sin embargo, los resultados del horno horizontal indican que la resistencia química es la controlante.

  2. The antibiotic resistance “mobilome”: searching for the link between environment and clinic

    Science.gov (United States)

    Perry, Julie A.; Wright, Gerard D.

    2013-01-01

    Antibiotic resistance is an ancient problem, owing to the co-evolution of antibiotic-producing and target organisms in the soil and other environments over millennia. The environmental “resistome” is the collection of all genes that directly or indirectly contribute to antibiotic resistance. Many of these resistance determinants originate in antibiotic-producing organisms (where they serve to mediate self-immunity), while others become resistance determinants only when mobilized and over-expressed in non-native hosts (like plasmid-encoded β-lactamases). The modern environmental resistome is under selective pressure from human activities such as agriculture, which may influence the composition of the local resistome and lead to gene transfer events. Beyond the environment, we are challenged in the clinic by the rise in both frequency and diversity of antibiotic resistant pathogens. We assume that clinical resistance originated in the environment, but few examples of direct gene exchange between the environmental resistome and the clinical resistome have been documented. Strong evidence exists to suggest that clinical aminoglycoside and vancomycin resistance enzymes, the extended-spectrum β-lactamase CTX-M and the quinolone resistance gene qnr have direct links to the environmental resistome. In this review, we highlight recent advances in our understanding of horizontal gene transfer of antibiotic resistance genes from the environment to the clinic. Improvements in sequencing technologies coupled with functional metagenomic studies have revealed previously underappreciated diversity in the environmental resistome, and also established novel genetic links to the clinic. Understanding mechanisms of gene exchange becomes vital in controlling the future dissemination of antibiotic resistance. PMID:23755047

  3. The antibiotic resistance "mobilome": searching for the link between environment and clinic.

    Science.gov (United States)

    Perry, Julie A; Wright, Gerard D

    2013-01-01

    Antibiotic resistance is an ancient problem, owing to the co-evolution of antibiotic-producing and target organisms in the soil and other environments over millennia. The environmental "resistome" is the collection of all genes that directly or indirectly contribute to antibiotic resistance. Many of these resistance determinants originate in antibiotic-producing organisms (where they serve to mediate self-immunity), while others become resistance determinants only when mobilized and over-expressed in non-native hosts (like plasmid-encoded β-lactamases). The modern environmental resistome is under selective pressure from human activities such as agriculture, which may influence the composition of the local resistome and lead to gene transfer events. Beyond the environment, we are challenged in the clinic by the rise in both frequency and diversity of antibiotic resistant pathogens. We assume that clinical resistance originated in the environment, but few examples of direct gene exchange between the environmental resistome and the clinical resistome have been documented. Strong evidence exists to suggest that clinical aminoglycoside and vancomycin resistance enzymes, the extended-spectrum β-lactamase CTX-M and the quinolone resistance gene qnr have direct links to the environmental resistome. In this review, we highlight recent advances in our understanding of horizontal gene transfer of antibiotic resistance genes from the environment to the clinic. Improvements in sequencing technologies coupled with functional metagenomic studies have revealed previously underappreciated diversity in the environmental resistome, and also established novel genetic links to the clinic. Understanding mechanisms of gene exchange becomes vital in controlling the future dissemination of antibiotic resistance.

  4. A copper-induced quinone degradation pathway provides protection against combined copper/quinone stress in Lactococcus lactis IL1403.

    Science.gov (United States)

    Mancini, Stefano; Abicht, Helge K; Gonskikh, Yulia; Solioz, Marc

    2015-02-01

    Quinones are ubiquitous in the environment. They occur naturally but are also in widespread use in human and industrial activities. Quinones alone are relatively benign to bacteria, but in combination with copper, they become toxic by a mechanism that leads to intracellular thiol depletion. Here, it was shown that the yahCD-yaiAB operon of Lactococcus lactis IL1403 provides resistance to combined copper/quinone stress. The operon is under the control of CopR, which also regulates expression of the copRZA copper resistance operon as well as other L. lactis genes. Expression of the yahCD-yaiAB operon is induced by copper but not by quinones. Two of the proteins encoded by the operon appear to play key roles in alleviating quinone/copper stress: YaiB is a flavoprotein that converts p-benzoquinones to less toxic hydroquinones, using reduced nicotinamide adenine dinucleotide phosphate (NADPH) as reductant; YaiA is a hydroquinone dioxygenase that converts hydroquinone putatively to 4-hydroxymuconic semialdehyde in an oxygen-consuming reaction. Hydroquinone and methylhydroquinone are both substrates of YaiA. Deletion of yaiB causes increased sensitivity of L. lactis to quinones and complete growth arrest under combined quinone and copper stress. Copper induction of the yahCD-yaiAB operon offers protection to copper/quinone toxicity and could provide a growth advantage to L. lactis in some environments. © 2014 John Wiley & Sons Ltd.

  5. Solution-processed copper-nickel nanowire anodes for organic solar cells

    Science.gov (United States)

    Stewart, Ian E.; Rathmell, Aaron R.; Yan, Liang; Ye, Shengrong; Flowers, Patrick F.; You, Wei; Wiley, Benjamin J.

    2014-05-01

    This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%.This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%. Electronic supplementary information (ESI) available. See DOI: 10.1039/c4nr01024h

  6. He bubble sites in implanted copper alloy

    International Nuclear Information System (INIS)

    Moreno, D.; Eliezer, D.

    1996-01-01

    Structural materials in fusion reactors will be exposed to helium implantation over a broad range of energies. The deformation and partial exfoliation of surface layers due to hydrogen isotopes and helium contribute to the total erosion of the first wall. For this reason, one of the most important criteria in the choice of materials for the first wall of fusion reactors is the material's damage resistance. Recent advances in developing nuclear fusion reactors reveal that efficient heat removal from plasma-facing components is very important. Copper and copper alloys are considered an attractive choice for transporting such a high heat flux without thermal damage as they have high thermal conductivity. In the present study the authors report on the structural changes in a copper alloy, due to the helium implantation on the very near surface area, observed by transmission electron microscopy

  7. Grain boundary corrosion of copper canister weld material

    International Nuclear Information System (INIS)

    Gubner, Rolf; Andersson, Urban; Linder, Mats; Nazarov, Andrej; Taxen, Claes

    2006-01-01

    The proposed design for a final repository for spent fuel and other long-lived residues in Sweden is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will then be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast inner container fitted inside a corrosion-resistant copper canister. During fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow, they will tend to concentrate impurities within the copper at the new grain boundaries. The work described in this report was undertaken to determine whether there is any possibility of enhanced corrosion at grain boundaries within the copper canister, based on the recommendations of the report SKB-TR--01-09 (INIS ref. 32025363). Grain boundary corrosion of copper is not expected to be a problem for the copper canisters in a repository. However, as one step in the experimental verification it is necessary to study grain boundary corrosion of copper in an environment where it may occur. A literature study aimed to find one or several solutions that are aggressive with respect to grain boundary corrosion of copper. Copper specimens cut from welds of real copper canisters where exposed to aerated ammonium hydroxide solution for a period of 14 days at 80 degrees C and 10 bar pressure. The samples were investigated prior to exposure using the scanning Kelvin probe technique to characterize anodic and cathodic areas on the samples. The degree of corrosion was determined by optical microscopy. No grain boundary corrosion could be observed in the autoclave experiments, however, a higher rate of corrosion was observed for the weld material compared to the base material. The work suggests that grain boundary corrosion of copper weld material is most unlikely to adversely affect SKB's copper canisters under the conditions in the repository

  8. Grain boundary corrosion of copper canister weld material

    Energy Technology Data Exchange (ETDEWEB)

    Gubner, Rolf; Andersson, Urban; Linder, Mats; Nazarov, Andrej; Taxen, Claes [Corrosion and Metals Research Inst. (KIMAB), Stockholm (Sweden)

    2006-01-15

    The proposed design for a final repository for spent fuel and other long-lived residues in Sweden is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will then be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast inner container fitted inside a corrosion-resistant copper canister. During fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow, they will tend to concentrate impurities within the copper at the new grain boundaries. The work described in this report was undertaken to determine whether there is any possibility of enhanced corrosion at grain boundaries within the copper canister, based on the recommendations of the report SKB-TR--01-09 (INIS ref. 32025363). Grain boundary corrosion of copper is not expected to be a problem for the copper canisters in a repository. However, as one step in the experimental verification it is necessary to study grain boundary corrosion of copper in an environment where it may occur. A literature study aimed to find one or several solutions that are aggressive with respect to grain boundary corrosion of copper. Copper specimens cut from welds of real copper canisters where exposed to aerated ammonium hydroxide solution for a period of 14 days at 80 degrees C and 10 bar pressure. The samples were investigated prior to exposure using the scanning Kelvin probe technique to characterize anodic and cathodic areas on the samples. The degree of corrosion was determined by optical microscopy. No grain boundary corrosion could be observed in the autoclave experiments, however, a higher rate of corrosion was observed for the weld material compared to the base material. The work suggests that grain boundary corrosion of copper weld material is most unlikely to adversely affect SKB's copper canisters under the conditions in the repository.

  9. Copper and silver halates

    CERN Document Server

    Woolley, EM; Salomon, M

    2013-01-01

    Copper and Silver Halates is the third in a series of four volumes on inorganic metal halates. This volume presents critical evaluations and compilations for halate solubilities of the Group II metals. The solubility data included in this volume are those for the five compounds, copper chlorate and iodate, and silver chlorate, bromate and iodate.

  10. DNA sequence analysis of plasmids from multidrug resistant Salmonella enterica serotype Heidelberg isolates.

    Directory of Open Access Journals (Sweden)

    Jing Han

    Full Text Available Salmonella enterica serovar Heidelberg is among the most detected serovars in swine and poultry, ranks among the top five serotypes associated with human salmonellosis and is disproportionately associated with invasive infections and mortality in humans. Salmonella are known to carry plasmids associated with antimicrobial resistance and virulence. To identify plasmid-associated genes in multidrug resistant S. enterica serovar Heidelberg, antimicrobial resistance plasmids from five isolates were sequenced using the 454 LifeSciences pyrosequencing technology. Four of the isolates contained incompatibility group (Inc A/C multidrug resistance plasmids harboring at least eight antimicrobial resistance genes. Each of these strains also carried a second resistance plasmid including two IncFIB, an IncHI2 and a plasmid lacking an identified Inc group. The fifth isolate contained an IncI1 plasmid, encoding resistance to gentamicin, streptomycin and sulfonamides. Some of the IncA/C plasmids lacked the full concert of transfer genes and yet were able to be conjugally transferred, likely due to the transfer genes carried on the companion plasmids in the strains. Several non-IncA/C resistance plasmids also carried putative virulence genes. When the sequences were compared to previously sequenced plasmids, it was found that while all plasmids demonstrated some similarity to other plasmids, they were unique, often due to differences in mobile genetic elements in the plasmids. Our study suggests that Salmonella Heidelberg isolates harbor plasmids that co-select for antimicrobial resistance and virulence, along with genes that can mediate the transfer of plasmids within and among other bacterial isolates. Prevalence of such plasmids can complicate efforts to control the spread of S. enterica serovar Heidelberg in food animal and human populations.

  11. Copper-beryllium alloys for technical applications

    International Nuclear Information System (INIS)

    Heller, W.

    1976-01-01

    Data of physical properties are compiled for the most commonly used copper-beryllium alloys (CuBe 2, CuBe 1.7, CuCoBe, and CuCoAgBe), with emphasis on their temperature dependence and their variation with particular annealing and hardening treatments. The purpose is to provide a reference source and to indicate the versatility of these materials with respect to other copper alloys and to pure copper. The special features of CuBe alloys include high mechanical strength with reasonably high electrical conductivity, as well as good wear and corrosion resistance. For example, CuBe 2 has a yield strength of up to 1200 N/mm 2 , about three times that of pure copper, whilst the electrical conductivity of CuCoBe can be as high as 28 MS/m, nearly half that of pure copper. Typical applications are springs and electrical contacts. The importance of a proper heat treatment is discussed in some detail, notably the metallurgy and effects of low-temperature annealing (precipitation-hardening). A chapter on manufacturing processes covers machining, brazing, welding, and cleaning. This is followed by some remarks on safety precautions against beryllium poisoning. CuBe alloys are commercially available in the form of wires, strips, rods, and bars. Typical dimensions, specifications, a brief cost estimate, and addresses of suppliers are listed. (Author)

  12. Computational Investigation of Effects of Grain Size on Ballistic Performance of Copper

    Science.gov (United States)

    He, Ge; Dou, Yangqing; Guo, Xiang; Liu, Yucheng

    2018-01-01

    Numerical simulations were conducted to compare ballistic performance and penetration mechanism of copper (Cu) with four representative grain sizes. Ballistic limit velocities for coarse-grained (CG) copper (grain size ≈ 90 µm), regular copper (grain size ≈ 30 µm), fine-grained (FG) copper (grain size ≈ 890 nm), and ultrafine-grained (UG) copper (grain size ≈ 200 nm) were determined for the first time through the simulations. It was found that the copper with reduced grain size would offer higher strength and better ductility, and therefore renders improved ballistic performance than the CG and regular copper. High speed impact and penetration behavior of the FG and UG copper was also compared with the CG coppers strengthened by nanotwinned (NT) regions. The comparison results showed the impact and penetration resistance of UG copper is comparable to the CG copper strengthened by NT regions with the minimum twin spacing. Therefore, besides the NT-strengthened copper, the single phase copper with nanoscale grain size could also be a strong candidate material for better ballistic protection. A computational modeling and simulation framework was proposed for this study, in which Johnson-Cook (JC) constitutive model is used to predict the plastic deformation of Cu; the JC damage model is to capture the penetration and fragmentation behavior of Cu; Bao-Wierzbicki (B-W) failure criterion defines the material's failure mechanisms; and temperature increase during this adiabatic penetration process is given by the Taylor-Quinney method.

  13. Antibacterial Effect of Copper on Microorganisms Isolated from Bovine Mastitis

    Science.gov (United States)

    Reyes-Jara, Angelica; Cordero, Ninoska; Aguirre, Juan; Troncoso, Miriam; Figueroa, Guillermo

    2016-01-01

    The antimicrobial properties of copper have been recognized for several years; applying these properties to the prevention of diseases such as bovine mastitis is a new area of research. The aim of the present study was to evaluate in vitro the antimicrobial activity of copper on bacteria isolated from subclinical and clinical mastitis milk samples from two regions in Chile. A total of 327 microorganisms were recovered between March and September 2013, with different prevalence by sample origin (25 and 75% from the central and southern regions of Chile, respectively). In the central region, Escherichia coli and coagulase negative Staphylococci (CNS) were the most frequently detected in clinical mastitis cases (33%), while in the southern region S. uberis, S. aureus, and CNS were detected with frequencies of 22, 21, and 18%, respectively. Antibiotic susceptibility studies revealed that 34% of isolates were resistant to one or more antibiotics and the resistance profile was different between bacterial species and origins of isolation of the bacteria. The minimum inhibitory concentration of copper (MIC-Cu) was evaluated in all the isolates; results revealed that a concentration as low as 250 ppm copper was able to inhibit the great majority of microorganisms analyzed (65% of isolates). The remaining isolates showed a MIC-Cu between 375 and 700 ppm copper, and no growth was observed at 1000 ppm. A linear relationship was found between the logarithm of viable bacteria number and time of contact with copper. With the application of the same concentration of copper (250 ppm), CNS showed the highest tolerance to copper, followed by S. uberis and S. aureus; the least resistant was E. coli. Based on these in vitro results, copper preparations could represent a good alternative to dipping solutions, aimed at preventing the presence and multiplication of potentially pathogenic microorganisms involved in bovine mastitis disease. PMID:27199953

  14. Deposition and characterisation of copper for high density interconnects

    International Nuclear Information System (INIS)

    McCusker, N.

    1999-09-01

    Copper has been deposited by sputtering and investigated for application as high density interconnects, with a view to maximising its performance and reliability. A sputter deposition process using gettering has been developed, which produces consistently pure, low resistivity films. A relationship between film thickness and resistivity has been explained by studying the grain growth process in copper films using atomic force microscopy. The Maydas-Shatzkes model has been used to separate the contributions of grain boundary and surface scattering to thin film resistivity, in copper and gold. Stress and texture in copper film have been studied. Annealing has been used to promote grain growth and texture development. Electromigration has been studied in copper and aluminium interconnects using a multi-line accelerated test set-up. A difference in failure distributions and void morphologies has been explained by an entirely different damage mechanism. The importance of surface/interface migration in electromigration damage of copper lines has been established and explained using a grain boundary-grooving model. A tantalum overlayer was found to extend the lifetime of copper lines. A composite sputtering target has been used to deposit copper/zirconium alloy films. The composition of the alloys was studied by Rutherford backscattering, Auger and secondary neutral mass spectrometry. The alloy films had an improved electromigration lifetime. A surface controlled mechanism is proposed to explain the advantage. A metal oxide semiconductor (MOS) capacitor technique is used to investigate barrier reliability. Tungsten is shown to be an effective diffusion barrier for copper, up to 700 deg. C. (author)

  15. Copper Homeostasis in Escherichia coli and Other Enterobacteriaceae.

    Science.gov (United States)

    Rensing, Christopher; Franke, Sylvia

    2007-04-01

    An interesting model for studying environmental influences shaping microbial evolution is provided by a multitude of copper resistance and copper homeostasis determinants in enteric bacteria. This review describes these determinants and tries to relate their presence to the habitat of the respective organism, as a current hypothesis predicts that the environment should determine an organism's genetic makeup. In Escherichia coli there are four regulons that are induced in the presence of copper. Two, the CueR and the CusR regulons, are described in detail. A central component regulating intracellular copper levels, present in all free-living enteric bacteria whose genomes have so far been sequenced, is a Cu(I)translocating P-type ATPase. The P-type ATPase superfamily is a ubiquitous group of proteins involved in the transport of charged substrates across biological membranes. Whereas some components involved in copper homeostasis can be found in both anaerobes and aerobes, multi-copper oxidases (MCOs) implicated in copper tolerance in E. coli, such as CueO and the plasmid-based PcoA, can be found only in aerobic organisms. Several features indicate that CueO, PcoA, and other related MCOs are specifically adapted to combat copper-mediated oxidative damage. In addition to these well-characterized resistance operons, there are numerous other genes that appear to be involved in copper binding and trafficking that have not been studied in great detail. SilE and its homologue PcoE, for example, are thought to effect the periplasmic binding and sequestration of silver and copper, respectively.

  16. Copper carrier protein in copper toxic sheep liver

    Energy Technology Data Exchange (ETDEWEB)

    Harris, A L; Dean, P D.G.

    1973-01-01

    The livers of copper-toxic sheep have been analyzed by gel electrophoresis followed by staining the gels for copper with diethyldithiocarbamate and for protein with amido schwartz. These gels were compared with similar gels obtained from the livers of normal and copper-deficient animals. The copper-toxic livers contained an extra protein band which possessed relatively weakly bound copper. Possible origins of this protein are discussed. 8 references, 1 figure, 2 tables.

  17. COPPER CABLE RECYCLING TECHNOLOGY

    International Nuclear Information System (INIS)

    Chelsea Hubbard

    2001-01-01

    The United States Department of Energy (DOE) continually seeks safer and more cost-effective technologies for use in deactivation and decommissioning (D and D) of nuclear facilities. The Deactivation and Decommissioning Focus Area (DDFA) of the DOE's Office of Science and Technology (OST) sponsors large-scale demonstration and deployment projects (LSDDPs). At these LSDDPs, developers and vendors of improved or innovative technologies showcase products that are potentially beneficial to the DOE's projects and to others in the D and D community. Benefits sought include decreased health and safety risks to personnel and the environment, increased productivity, and decreased costs of operation. The Idaho National Engineering and Environmental Laboratory (INEEL) generated a list of statements defining specific needs and problems where improved technology could be incorporated into ongoing D and D tasks. One such need is to reduce the volume of waste copper wire and cable generated by D and D. Deactivation and decommissioning activities of nuclear facilities generates hundreds of tons of contaminated copper cable, which are sent to radioactive waste disposal sites. The Copper Cable Recycling Technology separates the clean copper from contaminated insulation and dust materials in these cables. The recovered copper can then be reclaimed and, more importantly, landfill disposal volumes can be reduced. The existing baseline technology for disposing radioactively contaminated cables is to package the cables in wooden storage boxes and dispose of the cables in radioactive waste disposal sites. The Copper Cable Recycling Technology is applicable to facility decommissioning projects at many Department of Energy (DOE) nuclear facilities and commercial nuclear power plants undergoing decommissioning activities. The INEEL Copper Cable Recycling Technology Demonstration investigated the effectiveness and efficiency to recycle 13.5 tons of copper cable. To determine the effectiveness

  18. Canine Copper-Associated Hepatitis

    NARCIS (Netherlands)

    Dirksen, Karen; Fieten, Hille

    2017-01-01

    Copper-associated hepatitis is recognized with increasing frequency in dogs. The disease is characterized by centrolobular hepatic copper accumulation, leading to hepatitis and eventually cirrhosis. The only way to establish the diagnosis is by histologic assessment of copper distribution and copper

  19. Posttranslational regulation of copper transporters

    NARCIS (Netherlands)

    van den Berghe, P.V.E.

    2009-01-01

    The transition metal copper is an essential cofactor for many redox-active enzymes, but excessive copper can generate toxic reactive oxygen species. Copper homeostasis is maintained by highly conserved proteins, to balance copper uptake, distribution and export on the systemic and cellular level.

  20. Microstructure and Service Properties of Copper Alloys

    Directory of Open Access Journals (Sweden)

    Polok-Rubiniec M.

    2016-09-01

    Full Text Available This elaboration shows the effect of combined heat treatment and cold working on the structure and utility properties of alloyed copper. As the test material, alloyed copper CuTi4 was employed. The samples were subjected to treatment according to the following schema: 1st variant – supersaturation and ageing, 2nd variant – supersaturation, cold rolling and ageing. The paper presents the results of microstructure, hardness, and abrasion resistance. The analysis of the wipe profile geometry was realized using a Zeiss LSM 5 Exciter confocal microscope. Cold working of the supersaturated solid solution affects significantly its hardness but the cold plastic deformation causes deterioration of the wear resistance of the finally aged CuTi4 alloy.

  1. Improved Oxidation Resistance of Zirconium Resulting from Addition of Small Amounts of Copper; Amelioration de la Resistance a l'Oxydation du Zirconium par de Faibles Additions de Cuivre; Povyshenie soprotivlyaemosti k okisleniyu tsirkoniya posle dobavlenij nebol'shikh kolichestv medi; Aumento de la Resistencia del Circonio a la Oxidacion por Agregado de Pequenas Cantidades de Cobre

    Energy Technology Data Exchange (ETDEWEB)

    Loriers, H.; Darras, R.; Baque, P. [Centre d' Etudes Nucleaires de Saclay (France)

    1966-02-15

    The authors have tried to explain the process by which the addition of small amounts of copper improves the resistance of zirconium to oxidation by pressurized carbon dioxide between 600 and 700 Degree-Sign C. The resulting alloys, particularly that with 2.5% copper, seem to offer interesting possibilities as cladding or structural materials for the fuel elements of reactors of the heavy water-carbon dioxide type. The corrosion of zirconium by carbon dioxide amounts essentially to oxidation, in which two processes are involved: (1) the building up of a layer of monoclinic zirconia, through which oxygen diffuses by migration of the anionic vacancies: (2) the dissolution and diffusion of oxygen, which penetrates into the metal. The combination of gravimetric data and measurements of the thickness of the oxide layers permits evaluation of the two corresponding diffusion coefficients. This calculation has been extended, by analogy, to the case of binary zirconium-copper alloys with a concentration of copper less than or equal to 4% by weight. Comparison of the results obtained shows that the apparent diffusion coefficient of oxygen in the oxide layer that is formed decreases as the copper content of the alloy in question increases; as regards the apparent diffusion coefficient of the oxygen in the alloy, though this is only slightly modified at 600 Degree-Sign C, at 700 Degree-Sign C it too decreases when the copper content is increased to 2.5%. The improved oxidation resistance associated with slowing down of the diffusion processes results, in particular, in prolongation of parabolic-type kinetics whereas, in the case of non-alloyed zirconium or other alloys, cracking in the oxide layer rapidly leads to linear oxidation kinetics as a result of the phenomenon of peeling. (author) [French] Les auteurs ont cherche a interpreter l'amelioration apportee par de faibles additions de cuivre a la resistance a l'oxydation du zirconium par le gaz carbonique sous pression entre

  2. Utilization of Copper Alloys for Marine Applications

    Science.gov (United States)

    Drach, Andrew

    Utilization of copper alloy components in systems deployed in marine environment presents potential improvements by reducing maintenance costs, prolonging service life, and increasing reliability. However, integration of these materials faces technological challenges, which are discussed and addressed in this work, including characterization of material performance in seawater environment, hydrodynamics of copper alloy components, and design procedures for systems with copper alloys. To characterize the hydrodynamic behavior of copper alloy nets, mesh geometry of the major types of copper nets currently used in the marine aquaculture are analyzed and formulae for the solidity and strand length are proposed. Experimental studies of drag forces on copper alloy net panels are described. Based on these studies, empirical values for normal drag coefficients are proposed for various types of copper netting. These findings are compared to the previously published data on polymer nets. It is shown that copper nets exhibit significantly lower resistance to normal currents, which corresponds to lower values of normal drag coefficient. The seawater performance (corrosion and biofouling) of copper alloys is studied through the field trials of tensioned and untensioned specimens in a one-year deployment in the North Atlantic Ocean. The corrosion behavior is characterized by weight loss, optical microscopy, and SEM/EDX analyses. The biofouling performance is quantified in terms of the biomass accumulation. To estimate the effects of stray electrical currents on the seawater corrosion measurements, a low cost three-axis stray electric current monitoring device is designed and tested both in the lab and in the 30-day field deployment. The system consists of a remotely operated PC with a set of pseudo-electrodes and a digital compass. The collected data is processed to determine magnitudes of AC and DC components of electric field and dominant AC frequencies. Mechanical behavior of

  3. Photoelectrochemistry of copper(I) acetylide films electrodeposited onto copper electrodes

    Energy Technology Data Exchange (ETDEWEB)

    Zotti, G.; Cattarin, S.; Mengoli, G.; Fleischmann, M.; Peter, L.M.

    1986-01-01

    Films of copper acetylide (Cu/sub 2/C/sub 2/) were grown electrochemically on copper and characterized by transmittance and reflectance techniques. The photoelectrochemical properties of the filmed electrodes in alkaline solution indicate that Cu/sub 2/C/sub 2/ behaves as a p-type semiconducting material (1.5 eV band gap). The photocurrents depend on film thickness and aging and high resistivity or recombination losses limit the quantum yield to some 4% for thicknesses of practical importance (250 nm).

  4. Inkjet printed electronics using copper nanoparticle ink

    OpenAIRE

    Kang, Jin Sung; Kim, Hak Sung; Ryu, Jongeun; Thomas Hahn, H.; Jang, Seonhee; Joung, Jae Woo

    2010-01-01

    Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200 °C of low temperature in N2 gas condition. The printed electrodes were made with various widths and thickness. In order to control the thickness of the printed electrode, number of printing was varied. Resistivity of printed electrode was calculated from the cross-sectional area measure...

  5. Ligand-Doped Copper Oxo-hydroxide Nanoparticles are Effective Antimicrobials

    Science.gov (United States)

    Bastos, Carlos A. P.; Faria, Nuno; Ivask, Angela; Bondarenko, Olesja M.; Kahru, Anne; Powell, Jonathan

    2018-04-01

    Bacterial resistance to antimicrobial therapies is an increasing clinical problem. This is as true for topical applications as it is for systemic therapy. Topically, copper ions may be effective and cheap antimicrobials that act through multiple pathways thereby limiting opportunities to bacteria for resistance. However, the chemistry of copper does not lend itself to facile formulations that will readily release copper ions at biologically compatible pHs. Here, we have developed nanoparticulate copper hydroxide adipate tartrate (CHAT) as a cheap, safe, and readily synthesised material that should enable antimicrobial copper ion release in an infected wound environment. First, we synthesised CHAT and showed that this had disperse aquated particle sizes of 2-5 nm and a mean zeta potential of - 40 mV. Next, when diluted into bacterial medium, CHAT demonstrated similar efficacy to copper chloride against Escherichia coli and Staphylococcus aureus, with dose-dependent activity occurring mostly around 12.5-50 mg/L of copper. Indeed, at these levels, CHAT very rapidly dissolved and, as confirmed by a bacterial copper biosensor, showed identical intracellular loading to copper ions derived from copper chloride. However, when formulated at 250 mg/L in a topically applied matrix, namely hydroxyethyl cellulose, the benefit of CHAT over copper chloride was apparent. The former yielded rapid sustained release of copper within the bactericidal range, but the copper chloride, which formed insoluble precipitates at such concentration and pH, achieved a maximum release of 10 ± 7 mg/L copper by 24 h. We provide a practical formulation for topical copper-based antimicrobial therapy. Further studies, especially in vivo, are merited.

  6. Transferability of a tetracycline resistance gene from probiotic Lactobacillus reuteri to bacteria in the gastrointestinal tract of humans.

    Science.gov (United States)

    Egervärn, Maria; Lindmark, Hans; Olsson, Johan; Roos, Stefan

    2010-02-01

    The potential of Lactobacillus reuteri as a donor of antibiotic resistance genes in the human gut was investigated by studying the transferability of the tetracycline resistance gene tet(W) to faecal enterococci, bifidobacteria and lactobacilli. In a double-blind clinical study, seven subjects consumed L. reuteri ATCC 55730 harbouring a plasmid-encoded tet(W) gene (tet(W)-reuteri) and an equal number of subjects consumed L. reuteri DSM 17938 derived from the ATCC 55730 strain by the removal of two plasmids, one of which contained the tet(W) gene. Faecal samples were collected before, during and after ingestion of 5 x 10(8) CFU of L. reuteri per day for 14 days. Both L. reuteri strains were detectable at similar levels in faeces after 14 days of intake but neither was detected after a two-week wash-out period. After enrichment and isolation of tetracycline resistant enterococci, bifidobacteria and lactobacilli from each faecal sample, DNA was extracted and analysed for presence of tet(W)-reuteri using a real-time PCR allelic discrimination method developed in this study. No tet(W)-reuteri signal was produced from any of the DNA samples and thus gene transfer to enterococci, bifidobacteria and lactobacilli during intestinal passage of the probiotic strain was non-detectable under the conditions tested, although transfer at low frequencies or to the remaining faecal bacterial population cannot be excluded.

  7. Increased prevalence of antibiotic-resistant E. coli in gulls sampled in southcentral Alaska is associated with urban environments

    Science.gov (United States)

    Atterby, Clara; Ramey, Andrew M.; Gustafsson Hall, Gabriel; Jarhult, Josef; Borjesson, Stefan; Bonnedahl, Jonas

    2016-01-01

    BackgroundAntibiotic-resistant bacteria pose challenges to healthcare delivery systems globally; however, limited information is available regarding the prevalence and spread of such bacteria in the environment. The aim of this study was to compare the prevalence of antibiotic-resistant bacteria in large-bodied gulls (Larus spp.) at urban and remote locations in Southcentral Alaska to gain inference into the association between antibiotic resistance in wildlife and anthropogenically influenced habitats.MethodsEscherichia coli was cultured (n=115 isolates) from fecal samples of gulls (n=160) collected from a remote location, Middleton Island, and a more urban setting on the Kenai Peninsula.ResultsScreening of E. coli from fecal samples collected from glaucous-winged gulls (Larus glaucescens) at Middleton Island revealed 8% of isolates were resistant to one or more antibiotics and 2% of the isolates were resistant to three or more antibiotics. In contrast, 55% of E. coli isolates derived from fecal samples collected from large-bodied gulls (i.e. glaucous, herring [Larus argentatus], and potentially hybrid gulls) on the Kenai Peninsula were resistant to one or more antibiotics and 22% were resistant to three or more antibiotics. In addition, total of 16% of the gull samples from locations on the Kenai Peninsula harbored extended-spectrum cephalosporin-resistant E. coli isolates (extended-spectrum beta-lactamases [ESBL] and plasmid-encoded AmpC [pAmpC]), in contrast to Middleton Island where no ESBL- or pAmpC-producing isolates were detected.ConclusionOur findings indicate that increased prevalence of antibiotic resistance is associated with urban environments in Southcentral Alaska and presumably influenced by anthropogenic impacts. Further investigation is warranted to assess how migratory birds may maintain and spread antimicrobial-resistant bacteria of relevance to human and animal health.

  8. Micromachining with copper lasers

    Science.gov (United States)

    Knowles, Martyn R. H.; Bell, Andy; Foster-Turner, Gideon; Rutterford, Graham; Chudzicki, J.; Kearsley, Andrew J.

    1997-04-01

    In recent years the copper laser has undergone extensive development and has emerged as a leading and unique laser for micromachining. The copper laser is a high average power (10 - 250 W), high pulse repetition rate (2 - 32 kHz), visible laser (511 nm and 578 nm) that produces high peak power (typically 200 kW), short pulses (30 ns) and very good beam quality (diffraction limited). This unique set of laser parameters results in exceptional micro-machining in a wide variety of materials. Typical examples of the capabilities of the copper laser include the drilling of small holes (10 - 200 micrometer diameter) in materials as diverse as steel, ceramic, diamond and polyimide with micron precision and low taper (less than 1 degree) cutting and profiling of diamond. Application of the copper laser covers the electronic, aerospace, automotive, nuclear, medical and precision engineering industries.

  9. Homogeneous weldings of copper

    International Nuclear Information System (INIS)

    Campurri, C.; Lopez, M.; Fernandez, R.; Osorio, V.

    1995-01-01

    This research explored the metallurgical and mechanical properties of arc welding of copper related with influence of Argon, Helium and mixtures of them. Copper plates of 6 mm thickness were welded with different mixtures of the mentioned gases. The radiography of welded specimens with 100% He and 100% Ar does not show show any porosity. On the other hand, the copper plates welded different gas mixtures presented uniform porosity in the welded zone. The metallographies show recrystallized grain in the heat affected zone, while the welding zone showed a dendritic structure. The results of the tensile strength vary between a maximum of 227 MPa for 100% He and a minimum of 174 MOa for the mixture of 60% He and 40% Ar. For the elongation after fracture the best values, about 36%, were obtained for pure gases. As a main conclusion, we can say that arc welding of copper is possible without loosing the mechanical and metallurgical properties of base metal. 6 refs

  10. copper(II)

    Indian Academy of Sciences (India)

    Unknown

    bis(2,2,6,6-tetramethyl-3,5-heptadionato)copper(II) ... Abstract. Equilibrium concentrations of various condensed and gaseous phases have been thermodyna- ... phere, over a wide range of substrate temperatures and total reactor pressures.

  11. Bacterial Killing by Dry Metallic Copper Surfaces▿

    OpenAIRE

    Santo, Christophe Espírito; Lam, Ee Wen; Elowsky, Christian G.; Quaranta, Davide; Domaille, Dylan W.; Chang, Christopher J.; Grass, Gregor

    2010-01-01

    Metallic copper surfaces rapidly and efficiently kill bacteria. Cells exposed to copper surfaces accumulated large amounts of copper ions, and this copper uptake was faster from dry copper than from moist copper. Cells suffered extensive membrane damage within minutes of exposure to dry copper. Further, cells removed from copper showed loss of cell integrity. Acute contact with metallic copper surfaces did not result in increased mutation rates or DNA lesions. These findings are important fir...

  12. LEP copper accelerating cavities

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    These copper cavities were used to generate the radio frequency electric field that was used to accelerate electrons and positrons around the 27-km Large Electron-Positron (LEP) collider at CERN, which ran from 1989 to 2000. The copper cavities were gradually replaced from 1996 with new superconducting cavities allowing the collision energy to rise from 90 GeV to 200 GeV by mid-1999.

  13. Copper intoxication in sheep

    Energy Technology Data Exchange (ETDEWEB)

    Gazaryan, V.S.; Sogoyan, I.S.; Agabalov, G.A.; Mesropyan, V.V.

    1966-01-01

    Of 950 sheep fed hay from a vineyard sprayed regularly with copper sulfate, 143 developed clinical copper poisoning and 103 died. The Cu content of the hay was 10.23 mg%, of the liver of dead sheep 17-52 mg%, and of the blood serum of affected sheep 0.86 mg%. The symptoms and the histological findings in kidneys and liver are described.

  14. Copper wire bonding

    CERN Document Server

    Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

    2014-01-01

    This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

  15. Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate

    Directory of Open Access Journals (Sweden)

    Jiushuai Xu

    2014-04-01

    Full Text Available Copper films were grown on (3-Mercaptopropyltrimethoxysilane (MPTMS, (3-Aminopropyltriethoxysilane (APTES and 6-(3-(triethoxysilylpropylamino-1,3,5- triazine-2,4-dithiol monosodium (TES self-assembled monolayers (SAMs modified acrylonitrile-butadiene-styrene (ABS substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM and X-ray diffraction (XRD. Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111 preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance.

  16. Copper Contamination Impairs Herbivore Initiation of Seaweed Inducible Defenses and Decreases Their Effectiveness.

    Directory of Open Access Journals (Sweden)

    Alexandria M Warneke

    Full Text Available Seaweed-herbivore interactions are often mediated by environmental conditions, yet the roles of emerging anthropogenic stressors on these interactions are poorly understood. For example, chemical contaminants have unknown consequences on seaweed inducible resistance and herbivore response to these defenses despite known deleterious effects of contaminants on animal inducible defenses. Here, we investigated the effect of copper contamination on the interactions between a snail herbivore and a brown seaweed that displays inducible resistance to grazing. We examined seaweed inducible resistance and its effectiveness for organisms exposed to copper at two time points, either during induction or after herbivores had already induced seaweed defenses. Under ambient conditions, non-grazed tissues were more palatable than grazed tissues. However, copper additions negated the preference for non-grazed tissues regardless of the timing of copper exposure, suggesting that copper decreased both how herbivores initiated these inducible defenses and their subsequent effectiveness. Copper decreased stimulation of defenses, at least in part, by suppressing snail grazing pressure-the cue that turns inducible defenses on. Copper decreased effectiveness of defenses by preventing snails from preferentially consuming non-grazed seaweed. Thus, contaminants can potentially stress communities by changing seaweed-herbivore interactions mediated via inducible defenses. Given the ubiquity of seaweed inducible resistance and their potential influence on herbivores, we hypothesize that copper contamination may change the impact of these resistant traits on herbivores.

  17. Modification of medical metals by ion implantation of copper

    Science.gov (United States)

    Wan, Y. Z.; Xiong, G. Y.; Liang, H.; Raman, S.; He, F.; Huang, Y.

    2007-10-01

    The effect of copper ion implantation on the antibacterial activity, wear performance and corrosion resistance of medical metals including 317 L of stainless steels, pure titanium, and Ti-Al-Nb alloy was studied in this work. The specimens were implanted with copper ions using a MEVVA source ion implanter with ion doses ranging from 0.5 × 10 17 to 4 × 10 17 ions/cm 2 at an energy of 80 keV. The antibacterial effect, wear rate, and inflexion potential were measured as a function of ion dose. The results obtained indicate that copper ion implantation improves the antibacterial effect and wear behaviour for all the three medical materials studied. However, corrosion resistance decreases after ion implantation of copper. Experimental results indicate that the antibacterial property and corrosion resistance should be balanced for medical titanium materials. The marked deteriorated corrosion resistance of 317 L suggests that copper implantation may not be an effective method of improving its antibacterial activity.

  18. Copper current collectors reduce long-term fouling of air cathodes in microbial fuel cells

    KAUST Repository

    Myung, Jaewook; Yang, Wulin; Saikaly, Pascal; Logan, Bruce E

    2018-01-01

    Long-term operation of wastewater-fed, microbial fuel cells (MFCs) with cathodes made of activated carbon and stainless steel (SS) current collectors can result in decreased performance due to cathode fouling. Copper has good antimicrobial properties, and it is more electrically conductive than SS. To demonstrate that a copper current collector could produce a more fouling resistant cathode, MFCs with air cathodes using either SS or copper current collectors were operated using domestic wastewater for 27 weeks. The reduction in biofouling over time was shown by less biofilm formation on the copper cathode surface compared to SS cathodes, due to the antimicrobial properties of copper. Maximum power densities from 17–27 weeks were 440 ± 38 mW/m2 using copper and 370 ± 21 mW/m2 using SS cathodes. The main difference in the microbial community was a nitrifying community on the SS cathodes, which was not present on the copper cathodes.

  19. Copper current collectors reduce long-term fouling of air cathodes in microbial fuel cells

    KAUST Repository

    Myung, Jaewook

    2018-02-05

    Long-term operation of wastewater-fed, microbial fuel cells (MFCs) with cathodes made of activated carbon and stainless steel (SS) current collectors can result in decreased performance due to cathode fouling. Copper has good antimicrobial properties, and it is more electrically conductive than SS. To demonstrate that a copper current collector could produce a more fouling resistant cathode, MFCs with air cathodes using either SS or copper current collectors were operated using domestic wastewater for 27 weeks. The reduction in biofouling over time was shown by less biofilm formation on the copper cathode surface compared to SS cathodes, due to the antimicrobial properties of copper. Maximum power densities from 17–27 weeks were 440 ± 38 mW/m2 using copper and 370 ± 21 mW/m2 using SS cathodes. The main difference in the microbial community was a nitrifying community on the SS cathodes, which was not present on the copper cathodes.

  20. Tedizolid susceptibility in linezolid- and vancomycin-resistant Enterococcus faecium isolates.

    Science.gov (United States)

    Klupp, E-M; Both, A; Belmar Campos, C; Büttner, H; König, C; Christopeit, M; Christner, M; Aepfelbacher, M; Rohde, H

    2016-12-01

    Vancomycin-resistant enterococci (VRE) are of ever-increasing importance, most notably in high-risk patient populations. Therapy options are often limited for these isolates, and apart from tigecycline and daptomycin, oxazolidinone linezolid is frequently administered. The broad usage of linezolid, however, has driven the emergence of linezolid-resistant VRE strains (LR-VRE), further shortening therapeutic options. Second-generation oxazolidinone tedizolid has the advantage of being active against a specific subset of LR-VRE, i.e. isolates expressing the plasmid-encoded chloramphenicol-florfenicol resistance (cfr) gene. Here we tested tedizolid activity in a collection of 30 LR Enterococcus faecium VRE (MIC range 32-256 mg/l) isolated between 2012 and 2015 from clinical and screening specimens. By pulsed field gel electrophoresis (PFGE) isolates were assigned to 16 clonal lineages. In three cases, linezolid-susceptible progenitor isolates of LR-VRE were isolated, thus demonstrating the de-novo emergence of the linezolid-resistant phenotype. PCR did not detect cfr, cfr(B) or novel oxazolidinone resistance gene optrA in LR-VRE. All isolates, however, carried mutations within the 23S rDNA. Compared to linezolid, tedizolid MICs were lower in all isolates (MIC range 2-32 mg/l), but remained above the FDA tedizolid breakpoint for E. faecalis at 0.5 mg/l. Thus, related to the predominant resistance mechanism, tedizolid is of limited value for treatment of most LR-VRE and represents a therapeutic option only for a limited subset of isolates.

  1. Composite sheet made of molybdenum and dispersion-strengthened copper

    International Nuclear Information System (INIS)

    Nicholson, R.D.; Fusco, R.S.

    1990-01-01

    This patent describes a roll-bonded composite sheet product having at least one layer of dispersion-strengthened copper and at least one layer of molybdenum. The composite is characterized by a sharply defined, cleavage-resistant interface between the copper and the molybdenum with substantially no detectable diffusion of one metal into the other across the interface. The composite is resistant to delamination and being capable of maintaining structural integrity upon repeated high temperature firings at temperatures up to 900 degrees C

  2. A brief review of cavity swelling and hardening in irradiated copper and copper alloys

    International Nuclear Information System (INIS)

    Zinkle, S.J.

    1990-01-01

    The literature on radiation-induced swelling and hardening in copper and its alloy is reviewed. Void formation does not occur during irradiation of copper unless suitable impurity atoms such as oxygen or helium are present. Void formation occurs for neutron irradiation temperatures of 180 to 550 degree C, with peak swelling occurring at ∼320 degree C for irradiation at a damage rate of 2 x 10 -7 dpa/s. The post-transient swelling rate has been measured to be ∼0.5%/dpa at temperatures near 400 degree C. Dispersion-strengthened copper has been found to be very resistant to void swelling due to the high sink density associated with the dispersion-stabilized dislocation structure. Irradiation of copper at temperatures below 400 degree C generally causes an increase in strength due to the formation of defect clusters which inhibit dislocation motion. The radiation hardening can be adequately described by Seeger's dispersed barrier model, with a barrier strength for small defect clusters of α ∼ 0.2. The radiation hardening apparently saturates for fluences greater than ∼10 24 n/m 2 during irradiation at room temperature due to a saturation of the defect cluster density. Grain boundaries can modify the hardening behavior by blocking the transmission of dislocation slip bands, leading to a radiation- modified Hall-Petch relation between yield strength and grain size. Radiation-enhanced recrystallization can lead to softening of cold-worked copper alloys at temperatures above 300 degree C

  3. The Soil Mobilome

    DEFF Research Database (Denmark)

    Luo, Wenting

    Soil is considered a reservoir of diverse bacterial cellular functions, of which resistance mechanisms towards biological antimicrobial agents are of substantial interest to us. Previous findings report that the long-term accumulation of copper in an agricultural soil significantly affects......-selected for among natural bacterial populations. One possible explanation is the horizontal transfer of resistance genes among soil bacteria mediated by mobile genetic elements, such as plasmids, integrons, transposons and bacteriophages, of which copper and antibiotic resistance genes can be linked on the same...... mobile elements. To test this hypothesis, we collected non-polluted and CuSO4- contaminated soil samples and attempted to describe the co-selection of plasmid-encoded copper and antimicrobial resistance via both an endogenous plasmid isolation approach as well as a plasmid metagenomic approach...

  4. Copper : recession and recovery

    International Nuclear Information System (INIS)

    Warwick-Ching, T.

    2002-01-01

    In 2002, the world output for copper will fall for the first time in nearly a decade because of financial pressure and voluntary constraints. Cutbacks at copper mines amount to 760,000 tonnes per year. These cutbacks have occurred mostly in the United States which holds the largest share of high cost mines. This paper discussed recent developments in both copper supply and demand. The United States is unique as both a large consumer and producer of copper. At 1.35 million tonnes, US mine output in 2001 was at its lowest since 1987. The cutbacks in mining in general were described in this paper with particular reference to the huge loss of mining and metallurgical activity in the United States during a prolonged period of low prices in the mid 1980s. The author noted that this period was followed by an exceptional decade when much of the industry rebounded. Only 8 mines closed outright in the United States and a handful in Canada since the recession of the 1980s, but that is partly because mines got bigger and there are fewer small mines in North America. There are only 4 electrolytic refineries and 3 smelters still active in the entire United States, of which 2 are operating at a fraction of capacity. It was noted that only the buoyancy of China prevented a much bigger decline in copper demand on a global scale

  5. Effects of a copper-tolerant grass (Agrostis capillaris) on the ecosystem of a copper-contaminated arable soil

    Energy Technology Data Exchange (ETDEWEB)

    Boon, G.T. [State Univ. Groningen (Netherlands); Bouwman, L.A.; Bloem, J.; Roemkens, P.F.A.M. [Research Inst. for Agrobiology and Soil Fertility, Haren (Netherlands)

    1998-10-01

    To test how a dysfunctioning ecosystem of a severely metal-polluted soil responds to renewed plant growth, a pot experiment was conducted with soil from an experimental arable field with pH and copper gradients imposed 13 years ago. In this experiment, four pH/copper combinations from this field were either planted with a pH- and copper-resistant grass cultivar or remained fallow. During a 10-week period, the dynamics of the microbial activity and of the abundances of bacteria, protozoa. and nematodes were measured, as were the dynamics of several chemical soil parameters. After 13 years of copper, which had resulted in severely reduced crop growth, no effects were observed on bacterial numbers, respiration, or protozoan numbers, but bacterial growth was strongly reduced in the low pH plots, and even more so in low pH plots enriched with copper. Of the organisms, only nematodes were negatively affected under conditions of high copper load at low pH. In these plots, numbers belonging to all feeding categories were strongly reduced. Planting of a copper-tolerant grass variety, Agrostis capillaris L. var. Parys Mountain, resulted within 10 weeks in faster bacterial growth and more protozoa and bacterivorous nematodes in comparison with fallow controls; these effects were markedly strongest in the acidic, copper-enriched soils. During incubation, fungivorous nematodes increased in all treatments, in fallow and in planted pots and in the pots with high-copper, low-pH soil. The results of this experiment suggest that introduction of plant growth is one of the major causes of increased biological activity in acidic contaminated soils. Planting such soils with metal-tolerant plant species can reestablish the necessary food base to support soil organism growth, and this can lead to numerous positive effects, reversing the loss of soil functions due to the high copper levels under acidic conditions.

  6. Effect of thickness and temperature of copper phthalocyanine films on their properties

    Directory of Open Access Journals (Sweden)

    Alieva Kh. S.

    2012-06-01

    Full Text Available The research has shown that copper phthalocyanine films, having a set of unique properties, can be successfully used as gas-sensitive coating of resistive structures. The thickness of the film, in contrast to its temperature, is not the determining factor for high sensitivity. Low operating temperature of structures with copper phthalocyanine films allows to exploit them in economy mode.

  7. Surface Impedance of Copper MOB Depending on the Annealing Temperature and Deformation Degree

    International Nuclear Information System (INIS)

    Kutovoj, V.A.; Nikolaenko, A.A.; Stoev, P.I.; Vinogradov, D.V.

    2006-01-01

    Results of researches of influence of annealing temperature and deformation degree on mechanical features of copper MOB are presented. It is shown that minimal surface resistance is observed in copper samples that were subject to pre-deformation and were annealed in the range of temperatures 873...923 K

  8. Electrical conduction in composites containing copper core-copper

    Indian Academy of Sciences (India)

    Composites of nanometre-sized copper core-copper oxide shell with diameters in the range 6.1 to 7.3 nm dispersed in a silica gel were synthesised by a technique comprising reduction followed by oxidation of a suitably chosen precursor gel. The hot pressed gel powders mixed with nanometre-sized copper particles ...

  9. Effects of copper supplement on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture.

    Science.gov (United States)

    Rodríguez, L Mato; Alatossava, T

    2008-10-01

    To determine the effects of supplemented copper (Cu2+) on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture. Thirteen strains belonging to Lactobacillus delbrueckii, Lactobacillus helveticus, Lactobacillus rhamnosus, Streptococcus thermophilus or Propionibacterium freudenreichii species were exposed to various copper concentrations in the proper growth medium at relevant growth temperatures, and the effects of supplemented copper on bacterial growth and cell viability were determined by optical density and pH measurements, also by platings. Among the species considered, L. delbrueckii was the most copper resistant and S. thermophilus the most sensitive to copper. Anaerobic conditions increased this sensitivity significantly. There was also a considerable amount of variation in copper resistance at strain level. Copper resistance is both a species- and strain-dependent property and may reflect variability in copper-binding capacities by cell wall components among species and strains. In addition, the chemical state of copper may be involved. This study revealed that copper resistance is a highly variable property among starter and adjunct strains, and this variability should be considered when strains are selected for Emmental cheese manufacture.

  10. Electrochemical impedance study of copper in phosphate buffered solution

    International Nuclear Information System (INIS)

    Salimon, J.; Mohamad, M.; Yamin, B.M.; Kalaji, M.

    2003-01-01

    The processes occurring on the copper electrode surface in phosphate buffered solution were investigated using the Electrochemical Impedance Spectroscopy. The electrochemical behaviors of copper through their charge transfer resistance and double-layer capacitance at the onset of the hydrogen evolution region and the anodic passivation layer formation and diffusion of copper species at anodic potential regions are discussed. The specific adsorption of anions (hydroxide and/or H/sub 2/PO/sub 4/) occurred at potential less negative than -0.9V. Adsorbed hydrogen appeared at hydrogen evolution region at potential range of -1.5 to -1.0 V. The deposition of insoluble copper species occurred at anodic potential regions. (author)

  11. Axenic aerobic biofilms inhibit corrosion of copper and aluminum.

    Science.gov (United States)

    Jayaraman, A; Ornek, D; Duarte, D A; Lee, C C; Mansfeld, F B; Wood, T K

    1999-11-01

    The corrosion behavior of unalloyed copper and aluminum alloy 2024 in modified Baar's medium has been studied with continuous reactors using electrochemical impedance spectroscopy. An axenic aerobic biofilm of either Pseudomonas fragi K or Bacillus brevis 18 was able to lessen corrosion as evidenced by a consistent 20-fold increase in the low-frequency impedance value of copper as well as by a consistent four- to seven-fold increase in the polarization resistance of aluminum 2024 after six days exposure compared to sterile controls. This is the first report of axenic aerobic biofilms inhibiting generalized corrosion of copper and aluminum. Addition of the representative sulfate-reducing bacterium (SRB) Desulfovibrio vulgaris (to simulate consortia corrosion behavior) to either the P. fragi K or B. brevis 18 protective biofilm on copper increased the corrosion to that of the sterile control unless antibiotic (ampicillin) was added to inhibit the growth of SRB in the biofilm.

  12. Dependence of stability of metastable superconductors on copper fraction

    International Nuclear Information System (INIS)

    Elrod, S.A.; Lue, J.W.; Miller, J.R.; Dresner, L.

    1980-12-01

    The stability of composite superconductors operating in the metastable regime depends upon such factors as matrix resistivity, cooled surface dimensions, fraction of critical current, and volume fraction of stabilizer. By assuming constant thermophysical properties, we developed analytic expressions for the energy and voltage of the minimum propagating zone (MPZ). With other factors held constant, these expressions have been used to predict composite superconductor stability as a function of copper fraction: lower copper fractions lead to higher MPZ energies. MPZ voltages have been measured for three NbTi/Cu composites having different copper fractions and different critical current densities for several magnetic fields and transport currents. Experimental MPZ voltages have been used to calculate an effective heat transfer coefficient, which is subsequently used to calculate the MPZ energy. The experimental MPZ energies support the theoretical expectation that lower copper fractions lead to higher stability in the metastable regime

  13. Copper produced from powder by HIP to encapsulate nuclear fuel elements

    International Nuclear Information System (INIS)

    Ekbom, L.B.; Bogegaard, S.

    1989-02-01

    In the Swedish nuclear waste mangement program, nuclear fuel elements are proposed to be encapsulated in copper canisters. To fill the space between the fuel elements two methods have been proposed. Originally lead was proposed to be cast into the canister. According to a second method the space between the fuel rods is filled with copper powder and hot isostatic pressed (HIP) to seal the canister lid and to densify the powder to homogenous copper. This latter method has the advantage that each fuel rod is individually encapsulated in a very corrosion resistant material. This investigation was performed to find out to what extent pure copper powder can be hot isosatic pressed to full density and to achieve properties comparable to that of the oxygen free high conductivity (OFHC) copper of the canister. OFHC copper was molten under helium gas protection and atomized to a fine spherical powder in a pilot plant. The powder was transfered to a glove box with an argon atmosphere. The powder was filled into a steel container, which was evacuated and sealed. HIP was done at 550 degree C and 200 MPa for one hour. The resulting copper was found to have a good ductility and mechanical properties comparable to that of ordinary copper. The constant strainrate stress corrosion test used to test the canister copper showed that the HIP-ed copper has the same good properties as OFHC copper. (authors)

  14. Study of copper fluorination

    International Nuclear Information System (INIS)

    Gillardeau, J.

    1967-02-01

    This report deals with the action of fluorine on copper. Comprehensive descriptions are given of the particular technological methods and of the preparation of the reactants. This fluorination reaction has been studied at medium and low fluorine pressures. A nucleation and growth phenomenon is described. The influence of a pollution of the gas phase on the fluorination process is described. The solid-state reaction between cupric fluoride and cooper has also been studied. A special study has been made of the growth of copper deposits by thermal decomposition of gaseous fluorides. (author) [fr

  15. Two-step flash light sintering of copper nanoparticle ink to remove substrate warping

    Energy Technology Data Exchange (ETDEWEB)

    Ryu, Chung-Hyeon; Joo, Sung-Jun [Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791 (Korea, Republic of); Kim, Hak-Sung, E-mail: kima@hanyang.ac.kr [Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791 (Korea, Republic of); Institute of Nano Science and Technology, Hanyang University, Seoul, 133-791 (Korea, Republic of)

    2016-10-30

    Highlights: • We performed the two-step flash light sintering for copper nanoparticle ink to remove substrate warping. • 12 J/cm{sup 2} of preheating and 7 J/cm{sup 2} of main sintering energies were determined as optimum conditions to sinter the copper nanoparticle ink. • The resistivity of two-step sintered copper nanoparticle ink was 3.81 μΩ cm with 5B adhesion level, 2.3 times greater than that of bulk copper. • The two-step sintered case showed a high conductivity without any substrate warping. - Abstract: A two-step flash light sintering process was devised to reduce the warping of polymer substrates during the sintering of copper nanoparticle ink. To determine the optimum sintering conditions of the copper nanoparticle ink, the flash light irradiation conditions (pulse power, pulse number, on-time, and off-time) were varied and optimized. In order to monitor the flash light sintering process, in situ resistance and temperature monitoring of copper nanoink were conducted during the flash light sintering process. Also, a transient heat transfer analysis was performed by using the finite-element program ABAQUS to predict the temperature changes of copper nanoink and polymer substrate. The microstructures of the sintered copper nanoink films were analyzed by scanning electron microscopy. Additionally, an X-ray diffraction and Fourier transform infrared spectroscopy were used to characterize the crystal phase change of the sintered copper nanoparticles. The resulting two-step flash light sintered copper nanoink films exhibited a low resistivity (3.81 μΩ cm, 2.3 times of that of bulk copper) and 5B level of adhesion strength without warping of the polymer substrate.

  16. The Proteome of Biologically Active Membrane Vesicles from Piscirickettsia salmonis LF-89 Type Strain Identifies Plasmid-Encoded Putative Toxins

    Directory of Open Access Journals (Sweden)

    Cristian Oliver

    2017-09-01

    Full Text Available Piscirickettsia salmonis is the predominant bacterial pathogen affecting the Chilean salmonid industry. This bacterium is the etiological agent of piscirickettsiosis, a significant fish disease. Membrane vesicles (MVs released by P. salmonis deliver several virulence factors to host cells. To improve on existing knowledge for the pathogenicity-associated functions of P. salmonis MVs, we studied the proteome of purified MVs from the P. salmonis LF-89 type strain using multidimensional protein identification technology. Initially, the cytotoxicity of different MV concentration purified from P. salmonis LF-89 was confirmed in an in vivo adult zebrafish infection model. The cumulative mortality of zebrafish injected with MVs showed a dose-dependent pattern. Analyses identified 452 proteins of different subcellular origins; most of them were associated with the cytoplasmic compartment and were mainly related to key functions for pathogen survival. Interestingly, previously unidentified putative virulence-related proteins were identified in P. salmonis MVs, such as outer membrane porin F and hemolysin. Additionally, five amino acid sequences corresponding to the Bordetella pertussis toxin subunit 1 and two amino acid sequences corresponding to the heat-labile enterotoxin alpha chain of Escherichia coli were located in the P. salmonis MV proteome. Curiously, these putative toxins were located in a plasmid region of P. salmonis LF-89. Based on the identified proteins, we propose that the protein composition of P. salmonis LF-89 MVs could reflect total protein characteristics of this P. salmonis type strain.

  17. Plasmid-encoded biosynthetic genes alleviate metabolic disadvantages while increasing glucose conversion to shikimate in an engineered Escherichia coli strain.

    Science.gov (United States)

    Rodriguez, Alberto; Martínez, Juan A; Millard, Pierre; Gosset, Guillermo; Portais, Jean-Charles; Létisse, Fabien; Bolivar, Francisco

    2017-06-01

    Metabolic engineering strategies applied over the last two decades to produce shikimate (SA) in Escherichia coli have resulted in a battery of strains bearing many expression systems. However, the effects that these systems have on the host physiology and how they impact the production of SA are still not well understood. In this work we utilized an engineered E. coli strain to determine the consequences of carrying a vector that promotes SA production from glucose with a high-yield but that is also expected to impose a significant cellular burden. Kinetic comparisons in fermentors showed that instead of exerting a negative effect, the sole presence of the plasmid increased glucose consumption without diminishing the growth rate. By constitutively expressing a biosynthetic operon from this vector, the more active glycolytic metabolism was exploited to redirect intermediates toward the production of SA, which further increased the glucose consumption rate and avoided excess acetate production. Fluxomics and metabolomics experiments revealed a global remodeling of the carbon and energy metabolism in the production strain, where the increased SA production reduced the carbon available for oxidative and fermentative pathways. Moreover, the results showed that the production of SA relies on a specific setup of the pentose phosphate pathway, where both its oxidative and non-oxidative branches are strongly activated to supply erythrose-4-phosphate and balance the NADPH requirements. This work improves our understanding of the metabolic reorganization observed in E. coli in response to the plasmid-based expression of the SA biosynthetic pathway. Biotechnol. Bioeng. 2017;114: 1319-1330. © 2017 Wiley Periodicals, Inc. © 2017 Wiley Periodicals, Inc.

  18. Molecular Cloning, Expression and Characterization of Plasmid Encoding Rhomboid 4 (ROM4 of Tachyzoite of Toxoplasma gondii RH Strain

    Directory of Open Access Journals (Sweden)

    Mohammad Taghi RAHIMI

    2017-12-01

    Full Text Available AbstractBackground: The objective of this study was to clone, express and characterize the gene encoding rhomboid 4 (ROM4 proteins, a vital gene in surface adhesion and host cell invasion process of tachyzoite of T. gondii in an appropriate expression vector and eukaryotic cell for production of recombinant protein.Methods: Toxoplasma RNA was isolated from tachyzoites (RH strain and complementary DNA was synthesized. Oligonucleotide primer pair was designed based on Toxoplasma ROM4 gene sequence with XhoI and EcoRI restriction sites at 5´ end of forward and reverse primers, respectively. ROM4 gene was amplified by PCR, cloned into pTG19-T vector and the recombinant plasmid was sequenced. The gene was subcloned into pcDNA3 plasmid and expressed in CHO cells as eukaryotic cell. SDS-PAGE and western blotting were performed for protein determination and verification.Results: Cloning of ROM4 gene in pTG19-T vector was confirmed by colony-PCR and enzymatic digestion. The results of enzymatic digestion and gene sequencing confirmed successful cloning and subcloning procedures. The nucleotide sequence of the cloned ROM4 gene showed 99% homology compared to the corresponding sequences of original gene. SDS-PAGE and western blotting analyses of the purified protein revealed a single band having expected size of 65 kDa.Conclusion: This eukaryotic expression system is an appropriate system for high-level recombinant protein production of ROM4 gene from T. gondii tachyzoites used as antigenic component for serological assay and vaccine development.

  19. Development of electrochemical reporter assay using HeLa cells transfected with vector plasmids encoding various responsive elements

    Energy Technology Data Exchange (ETDEWEB)

    Shiku, Hitoshi, E-mail: shiku@bioinfo.che.tohoku.ac.jp [Graduate School of Environmental Studies, Tohoku University, 6-6-11-604 Aramaki-Aoba, Sendai 980-8579 (Japan); Takeda, Michiaki; Murata, Tatsuya [Graduate School of Environmental Studies, Tohoku University, 6-6-11-604 Aramaki-Aoba, Sendai 980-8579 (Japan); Akiba, Uichi; Hamada, Fumio [Graduate School of Engineering and Resource Science, Akita University, 1-1 Tegata gakuen-machi, Akita 010-8502 (Japan); Matsue, Tomokazu, E-mail: matsue@bioinfo.che.tohoku.ac.jp [Graduate School of Environmental Studies, Tohoku University, 6-6-11-604 Aramaki-Aoba, Sendai 980-8579 (Japan)

    2009-04-27

    Electrochemical assay using HeLa cell lines transfected with various plasmid vectors encoding SEAP (secreted alkaline phosphatase) as the reporter has been performed by using SECM (scanning electrochemical microscopy). The plasmid vector contains different responsive elements that include GRE (glucocorticoid response elements), CRE (cAMP responsive elements), or {kappa}B (binding site for NF{kappa}B (nuclear factor kappa B)) upstream of the SEAP sequence. The transfected HeLa cells were patterned on a culture dish in a 4 x 4 array of circles of diameter 300 {mu}m by using the PDMS (poly(dimethylsiloxane)) stencil technique. The cellular array was first exposed to 100 ng mL{sup -1} dexamethasone, 10 ng mL{sup -1} forskolin, or 100 ng mL{sup -1} TNF-{alpha} (tumor necrosis factor {alpha}) after which it was further cultured in an RPMI culture medium for 6 h. After incubation, the cellular array was soaked in a measuring solution containing 4.7 mM PAPP (p-aminophenylphosphate) at pH 9.5, following which electrochemical measurements were performed immediately within 40 min. The SECM method allows parallel evaluation of different cell lines transfected with pGRE-SEAP, pCRE-SEAP, and pNF{kappa}B-SEAP patterned on the same solid support for detection of the oxidation current of PAP (p-aminophenol) flux produced from only 300 HeLa cells in each stencil pattern. The results of the SECM method were highly sensitive as compared to those obtained from the conventional CL (chemiluminescence) protocol with at least 5 x 10{sup 4} cells per well.

  20. DNA vaccination with a plasmid encoding LACK-TSA fusion against Leishmania major infection in BALB/c mice.

    Science.gov (United States)

    Maspi, N; Ghaffarifar, F; Sharifi, Z; Dalimi, A; Khademi, S Z

    2017-12-01

    Vaccination would be the most important strategy for the prevention and elimination of leishmaniasis. The aim of the present study was to compare the immune responses induced following DNA vaccination with LACK (Leishmania analogue of the receptor kinase C), TSA (Thiol-specific-antioxidant) genes alone or LACK-TSA fusion against cutaneous leishmaniasis (CL). Cellular and humoral immune responses were evaluated before and after challenge with Leishmania major (L. major). In addition, the mean lesion size was also measured from 3th week post-infection. All immunized mice showed a partial immunity characterized by higher interferon (IFN)-γ and Immunoglobulin G (IgG2a) levels compared to control groups (pTSA fusion. Mean lesion sizes reduced significantly in all immunized mice compared with control groups at 7th week post-infection (pTSA and TSA groups than LACK group after challenge (pTSA antigens against CL. Furthermore, this study demonstrated that a bivalent vaccine can induce stronger immune responses and protection against infectious challenge with L. major.

  1. A novel pAA virulence plasmid encoding toxins and two distinct variants of the fimbriae of enteroaggregative Escherichia coli

    DEFF Research Database (Denmark)

    Jønsson, Rie; Struve, Carsten; Boll, Erik J.

    2017-01-01

    phylogenetically distinct, strains harboring the major pilin subunits from both AAF/III and AAF/V. Whole-genome and plasmid sequencing revealed that in these six strains the agg3A and agg5A genes were located on a novel pAA plasmid variant. Moreover, the plasmid also encoded several other virulence genes including...... some not previously found on pAA plasmids. Thus, this plasmid endows the host strains with a remarkably high number of EAEC associated virulence genes hereby likely promoting strain pathogenicity....

  2. Identification of novel substrates of Shigella T3SA through analysis of its virulence plasmid-encoded secretome

    Science.gov (United States)

    Pinaud, Laurie; Ferrari, Mariana L.; Friedman, Robin; Jehmlich, Nico; von Bergen, Martin; Phalipon, Armelle; Sansonetti, Philippe J.

    2017-01-01

    Many human Gram-negative bacterial pathogens express a Type Three Secretion Apparatus (T3SA), including among the most notorious Shigella spp., Salmonella enterica, Yersinia enterocolitica and enteropathogenic Escherichia coli (EPEC). These bacteria express on their surface multiple copies of the T3SA that mediate the delivery into host cells of specific protein substrates critical to pathogenesis. Shigella spp. are Gram-negative bacterial pathogens responsible for human bacillary dysentery. The effector function of several Shigella T3SA substrates has largely been studied but their potential cellular targets are far from having been comprehensively delineated. In addition, it is likely that some T3SA substrates have escaped scrutiny as yet. Indeed, sequencing of the virulence plasmid of Shigella flexneri has revealed numerous open reading frames with unknown functions that could encode additional T3SA substrates. Taking advantage of label-free mass spectrometry detection of proteins secreted by a constitutively secreting strain of S. flexneri, we identified five novel substrates of the T3SA. We further confirmed their secretion through the T3SA and translocation into host cells using β-lactamase assays. The coding sequences of two of these novel T3SA substrates (Orf13 and Orf131a) have a guanine-cytosine content comparable to those of T3SA components and effectors. The three other T3SA substrates identified (Orf48, Orf86 and Orf176) have significant homology with antitoxin moieties of type II Toxin-Antitoxin systems usually implicated in the maintenance of low copy plasmids. While Orf13 and Orf131a might constitute new virulence effectors contributing to S. flexneri pathogenicity, potential roles for the translocation into host cells of antitoxins or antitoxin-like proteins during Shigella infection are discussed. PMID:29073283

  3. Identification of novel substrates of Shigella T3SA through analysis of its virulence plasmid-encoded secretome.

    Directory of Open Access Journals (Sweden)

    Laurie Pinaud

    Full Text Available Many human Gram-negative bacterial pathogens express a Type Three Secretion Apparatus (T3SA, including among the most notorious Shigella spp., Salmonella enterica, Yersinia enterocolitica and enteropathogenic Escherichia coli (EPEC. These bacteria express on their surface multiple copies of the T3SA that mediate the delivery into host cells of specific protein substrates critical to pathogenesis. Shigella spp. are Gram-negative bacterial pathogens responsible for human bacillary dysentery. The effector function of several Shigella T3SA substrates has largely been studied but their potential cellular targets are far from having been comprehensively delineated. In addition, it is likely that some T3SA substrates have escaped scrutiny as yet. Indeed, sequencing of the virulence plasmid of Shigella flexneri has revealed numerous open reading frames with unknown functions that could encode additional T3SA substrates. Taking advantage of label-free mass spectrometry detection of proteins secreted by a constitutively secreting strain of S. flexneri, we identified five novel substrates of the T3SA. We further confirmed their secretion through the T3SA and translocation into host cells using β-lactamase assays. The coding sequences of two of these novel T3SA substrates (Orf13 and Orf131a have a guanine-cytosine content comparable to those of T3SA components and effectors. The three other T3SA substrates identified (Orf48, Orf86 and Orf176 have significant homology with antitoxin moieties of type II Toxin-Antitoxin systems usually implicated in the maintenance of low copy plasmids. While Orf13 and Orf131a might constitute new virulence effectors contributing to S. flexneri pathogenicity, potential roles for the translocation into host cells of antitoxins or antitoxin-like proteins during Shigella infection are discussed.

  4. A novel plasmid-encoded serotype conversion mechanism through addition of phosphoethanolamine to the O-antigen of Shigella flexneri.

    Directory of Open Access Journals (Sweden)

    Qiangzheng Sun

    Full Text Available Shigella flexneri is the major pathogen causing bacillary dysentery in developing countries. S. flexneri is divided into at least 16 serotypes based on the combination of antigenic determinants present in the O-antigen. All the serotypes (except for serotype 6 share a basic O-unit containing one N-acetyl-d-glucosamine and three l-rhamnose residues, whereas differences between the serotypes are conferred by phage-encoded glucosylation and/or O-acetylation. Serotype Xv is a newly emerged and the most prevalent serotype in China, which can agglutinate with both MASF IV-1 and 7,8 monoclonal antibodies. The factor responsible for the presence of MASF IV-1 (E1037 epitope has not yet been identified. In this study, we analyzed the LPS structure of serotype Xv strains and found that the MASF IV-1 positive phenotype depends on an O-antigen modification with a phosphoethanolamine (PEtN group attached at position 3 of one of the rhamnose residues. A plasmid carried gene, lpt-O (LPS phosphoethanolamine transferase for O-antigen, mediates the addition of PEtN for serotype Xv and other MASF IV-1 positive strains. These findings reveal a novel serotype conversion mechanism in S. flexneri and show the necessity of further extension of the serotype classification scheme recognizing the MASF IV-1 positive strains as distinctive subtypes.

  5. The Proteome of Biologically Active Membrane Vesicles from Piscirickettsia salmonis LF-89 Type Strain Identifies Plasmid-Encoded Putative Toxins.

    Science.gov (United States)

    Oliver, Cristian; Hernández, Mauricio A; Tandberg, Julia I; Valenzuela, Karla N; Lagos, Leidy X; Haro, Ronie E; Sánchez, Patricio; Ruiz, Pamela A; Sanhueza-Oyarzún, Constanza; Cortés, Marcos A; Villar, María T; Artigues, Antonio; Winther-Larsen, Hanne C; Avendaño-Herrera, Ruben; Yáñez, Alejandro J

    2017-01-01

    Piscirickettsia salmonis is the predominant bacterial pathogen affecting the Chilean salmonid industry. This bacterium is the etiological agent of piscirickettsiosis, a significant fish disease. Membrane vesicles (MVs) released by P. salmonis deliver several virulence factors to host cells. To improve on existing knowledge for the pathogenicity-associated functions of P. salmonis MVs, we studied the proteome of purified MVs from the P. salmonis LF-89 type strain using multidimensional protein identification technology. Initially, the cytotoxicity of different MV concentration purified from P. salmonis LF-89 was confirmed in an in vivo adult zebrafish infection model. The cumulative mortality of zebrafish injected with MVs showed a dose-dependent pattern. Analyses identified 452 proteins of different subcellular origins; most of them were associated with the cytoplasmic compartment and were mainly related to key functions for pathogen survival. Interestingly, previously unidentified putative virulence-related proteins were identified in P. salmonis MVs, such as outer membrane porin F and hemolysin. Additionally, five amino acid sequences corresponding to the Bordetella pertussis toxin subunit 1 and two amino acid sequences corresponding to the heat-labile enterotoxin alpha chain of Escherichia coli were located in the P. salmonis MV proteome. Curiously, these putative toxins were located in a plasmid region of P. salmonis LF-89. Based on the identified proteins, we propose that the protein composition of P. salmonis LF-89 MVs could reflect total protein characteristics of this P. salmonis type strain.

  6. Antimicrobial resistance among enterococci from pigs in three European countries

    DEFF Research Database (Denmark)

    Aarestrup, Frank Møller; Hasman, Henrik; Jensen, Lars Bogø

    2002-01-01

    to the amounts of antimicrobial agents used in food animal production in those countries. Similar genes were found to encode resistance in the different countries, but the tet(L) and let(S) genes were more frequently found among isolates from Spain. A recently identified transferable copper resistance gene......Enterococci from pigs in Denmark, Spain, and Sweden were examined for susceptibility to antimicrobial agents and copper and the presence of selected resistance genes. The greatest levels of resistance were found among isolates from Spain and Denmark compared to those from Sweden, which corresponds...... was found in all copper-resistant isolates from the different countries....

  7. Brazing copper to dispersion-strengthened copper

    Science.gov (United States)

    Ryding, David G.; Allen, Douglas; Lee, Richard H.

    1996-11-01

    The advanced photon source is a state-of-the-art synchrotron light source that will produce intense x-ray beams, which will allow the study of smaller samples and faster reactions and processes at a greater level of detail than has ben possible to date. The beam is produced by using third- generation insertion devices in a 7-GeV electron/positron storage ring that is 1,104 meters in circumference. The heat load from these intense high-power devices is very high, and certain components must sustain total heat loads of 3 to 15 kW and heat fluxes of 30 W/mm$_2). Because the beams will cycle on and off many times, thermal shock and fatigue will be a problem. High heat flux impinging on a small area causes a large thermal gradient that results in high stress. GlidCop, a dispersion-strengthened copper, is the desired design material because of its high thermal conductivity and superior mechanical properties as compared to copper and its alloys. GlidCop is not amenable to joining by fusion welding, and brazing requires diligence because of high diffusivity. Brazing procedures were developed using optical and scanning electron microscopy.

  8. Electrokinetic remediation of copper mine tailings

    DEFF Research Database (Denmark)

    Hansen, Henrik K.; Rojo, Adrián; Ottosen, Lisbeth M.

    2007-01-01

    Important process parameters to optimize in electrokinetic soil remediation are those influencing remediation time and power consumption since these directly affect the cost of a remediation action. This work shows how the electrokinetic remediation (EKR) process could be improved by implementing...... bipolar electrodes in the porous material. The bipolar electrodes in EKR meant two improvements: (1) a shorter migration pathway for the contaminant, and (2) an increased electrical conductivity in the remediation system. All together the remediation proceeded faster with lower electrical resistance than...... in similar experiments but without the bipolar electrodes. The new electrokinetic remediation design was tested on copper mine tailings with different applied electric fields, remediation times and pre-treatment. The results showed that the copper removal was increased from 8% (applying 20V for 8 days...

  9. Impact of co-carriage of IncA/C plasmids with additional plasmids on the transfer of antimicrobial resistance in Salmonella enterica isolates.

    Science.gov (United States)

    Han, Jing; Pendleton, Sean J; Deck, Joanna; Singh, Ruby; Gilbert, Jeffrey; Johnson, Timothy J; Sanad, Yasser M; Nayak, Rajesh; Foley, Steven L

    2018-04-20

    Antimicrobial resistance in Salmonella enterica is often plasmid encoded. A key resistance plasmid group is the incompatibility group (Inc) A/C plasmids that often carry multiple resistance determinants. Previous studies showed that IncA/C plasmids were often co-located with other plasmids. The current study was undertaken to evaluate the impact of plasmid co-carriage on antimicrobial resistance and plasmid transfer. A total of 1267 Salmonella isolates, representing multiple serotypes and sources were previously subjected to susceptibility testing and 251 isolates with resistance to at least 5 antimicrobial agents were identified for further study. Each isolate was subjected to PCR-based replicon typing, and those with IncA/C plasmids were selected for plasmid isolation, PCR-based mapping of IncA/C plasmid backbone genes, and conjugation assays to evaluate resistance plasmid transferability. Of the 87 identified IncA/C positive isolates, approximately 75% carried a plasmid with another identified replicon type, with the most common being I1 (39%), FIA, FIIA, FIB and HI2 (each 15%). PCR-based mapping indicated significant diversity in IncA/C backbone content, especially in regions encoding transfer-associated and hypothetical proteins. Conjugation experiments showed that nearly 68% of the isolates transferred resistance plasmids, with 90% containing additional identified plasmids or larger (>50 kb) non-typeable plasmids. The majority of IncA/C-positive strains were able to conjugally transfer antimicrobial resistance to the recipient, encoded by IncA/C and/or co-carried plasmids. These findings highlight the importance of co-located plasmids for resistance dissemination either by directly transferring resistance genes or by potentially providing the needed conjugation machinery for IncA/C plasmid transfer. Copyright © 2018. Published by Elsevier B.V.

  10. Copper and Copper Proteins in Parkinson’s Disease

    Directory of Open Access Journals (Sweden)

    Sergio Montes

    2014-01-01

    Full Text Available Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson’s disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson’s disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson’s disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson’s disease and that a mutation in ATP7B could be associated with Parkinson’s disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology.

  11. Low-temperature thermal conductivity of highly porous copper

    International Nuclear Information System (INIS)

    Tomás, G; Bonfait, G; Martins, D; Cooper, A

    2015-01-01

    The development and characterization of new materials is of extreme importance in the design of cryogenic apparatus. Recently Versarien ® PLC developed a technique capable of producing copper foam with controlled porosity and pore size. Such porous materials could be interesting for cryogenic heat exchangers as well as of special interest in some devices used in microgravit.y environments where a cryogenic liquid is confined by capillarity.In the present work, a system was developed to measure the thermal conductivity by the differential steady-state mode of four copper foam samples with porosity between 58% and 73%, within the temperatures range 20 - 260 K, using a 2 W @ 20 K cryocooler. Our measurements were validated using a copper control sample and by the estimation of the Lorenz number obtained from electrical resistivity measurements at room temperature. With these measurements, the Resistivity Residual Ratio and the tortuosity were obtained. (paper)

  12. Creative Copper Crests

    Science.gov (United States)

    Knab, Thomas

    2011-01-01

    In this article, the author discusses how to create an art activity that would link the computer-created business cards of fourth-grade students with an upcoming school-wide medieval event. Creating family crests from copper foil would be a great connection, since they, like business cards, are an individual's way to identify themselves to others.…

  13. and copper(II)

    Indian Academy of Sciences (India)

    Unknown

    (II) and copper(II)–zinc(II) complexes. SUBODH KUMAR1, R N PATEL1*, P V KHADIKAR1 and. K B PANDEYA2. 1 Department of Chemistry, APS University, Rewa 486 003, India. 2 CSJM University, Kanpur 208 016, India e-mail: (R N Patel) ...

  14. Reagent conditions of the flotation of copper, copper - molybdenum and copper -zinc ores in foreing countries

    International Nuclear Information System (INIS)

    Nevaeva, L.M.

    1983-01-01

    Reagents-collectors and frothers, used abroad in reagent regimes of flotation of copper, copper-molybdenum and copper zinc ores, have been considered. Xanthogenates, aerofloats, xanthogenformiates, thionocarbamates are mainly used as reagents-collectors. Methylizobutylcarbinol and Daufros are used as reagents-frothers

  15. Hypoxia targeting copper complexes

    International Nuclear Information System (INIS)

    Dearling, J.L.

    1998-11-01

    The importance and incidence of tumour hypoxia, its measurement and current treatments available, including pharmacological and radiopharmacological methods of targeting hypoxia, are discussed. A variety of in vitro and in vivo methods for imposing hypoxia have been developed and are reviewed. Copper, its chemistry, biochemistry and radiochemistry, the potential for use of copper radionuclides and its use to date in this field is considered with particular reference to the thiosemicarbazones. Their biological activity, metal chelation, in vitro and in vivo studies of their radiocopper complexes and the potential for their use as hypoxia targeting radiopharmaceuticals is described. The reduction of the copper(II) complex to copper(l), its pivotal importance in their biological behaviour, and the potential for manipulation of this to effect hypoxia selectivity are described. An in vitro method for assessing the hypoxia selectivity of radiopharmaceuticals is reported. The rapid deoxygenation and high viability of a mammalian cell culture in this system is discussed and factors which may affect the cellular uptake of a radiopharmaceutical are described. The design, synthesis and complexation with copper and radiocopper of a range of bis(thiosemicarbazones) is reported. Synthesis of these compounds is simple giving high yields of pure products. The characteristics of the radiocopper complexes ( 64 Cu) including lipophilicity and redox activity are reported (reduction potentials in the range -0.314 - -0.590 V). High cellular uptakes of the radiocopper complexes of the ligands, in hypoxic and normoxic EMT6 and CHO320 cells, were observed. Extremes of selectivity are shown ranging from the hypoxia selective 64 Cu(II)ATSM to normoxic cell selective 64 Cu(II)GTS. The selectivities observed are compared with the physico chemical characteristics of the complexes. A good correlation exists between selectivity of the complex and its Cu(II)/Cu(I) reduction potential, with hypoxia

  16. Use of Fatty Acid Methyl Ester Profiles to Compare Copper-Tolerant and Copper-Sensitive Strains of Pantoea ananatis.

    Science.gov (United States)

    Nischwitz, C; Gitaitis, R; Sanders, H; Langston, D; Mullinix, B; Torrance, R; Boyhan, G; Zolobowska, L

    2007-10-01

    acid/14-methylpentadecenoic acid) also had an impact on the differences observed between copper-sensitive parents and copper-resistant mutants. Finding these changes in bacterial fatty acid composition could lead to the development of a laboratory assay to identify copper-tolerant strains using gas chromatography as well as providing clues to further elucidate the mode of action of copper tolerance.

  17. Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

    Science.gov (United States)

    Curtis, Calvin J; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S

    2014-11-04

    Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

  18. Direct write of copper-graphene composite using micro-cold spray

    Directory of Open Access Journals (Sweden)

    Sameh Dardona

    2016-08-01

    Full Text Available Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have good adhesion to the substrate with ∼65x the copper bulk resistivity.

  19. Mechanical and corrosion behaviors of developed copper-based metal matrix composites

    Science.gov (United States)

    Singh, Manvandra Kumar; Gautam, Rakesh Kumar; Prakash, Rajiv; Ji, Gopal

    2018-03-01

    This work investigates mechanical properties and corrosion resistances of cast copper-tungsten carbide (WC) metal matrix composites (MMCs). Copper matrix composites have been developed by stir casting technique. Different sizes of micro and nano particles of WC particles are utilized as reinforcement to prepare two copper-based composites, however, nano size of WC particles are prepared by high-energy ball milling. XRD (X-rays diffraction) characterize the materials for involvement of different phases. The mechanical behavior of composites has been studied by Vickers hardness test and compression test; while the corrosion behavior of developed composites is investigated by electrochemical impedance spectroscopy in 0.5 M H2SO4 solutions. The results show that hardness, compressive strength and corrosion resistance of copper matrix composites are very high in comparison to that of copper matrix, which attributed to the microstructural changes occurred during composite formation. SEM (Scanning electron microscopy) reveals the morphology of the corroded surfaces.

  20. Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054 (China); Sowade, Enrico; Baumann, Reinhard R. [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz, 09126 (Germany); Feng, Zhe-Sheng, E-mail: fzs@uestc.edu.cn [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054 (China)

    2017-02-28

    Highlights: • Copper patterns were fabricated by reactive inkjet printing and two-step electroless plating. • Cu particles produced via reactive inkjet printing act as catalyst for copper electroless plating. • High conductivity can be obtained without many printing passes and high temperature sintering. • This approach can largely avoid nozzle-clogging problems. • This approach presents a potential way in the flexible printed electronics with simple process. - Abstract: A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

  1. Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    International Nuclear Information System (INIS)

    Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan; Sowade, Enrico; Baumann, Reinhard R.; Feng, Zhe-Sheng

    2017-01-01

    Highlights: • Copper patterns were fabricated by reactive inkjet printing and two-step electroless plating. • Cu particles produced via reactive inkjet printing act as catalyst for copper electroless plating. • High conductivity can be obtained without many printing passes and high temperature sintering. • This approach can largely avoid nozzle-clogging problems. • This approach presents a potential way in the flexible printed electronics with simple process. - Abstract: A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

  2. Streptococcus mutans copper chaperone, CopZ, is critical for biofilm formation and competitiveness.

    Science.gov (United States)

    Garcia, S S; Du, Q; Wu, H

    2016-12-01

    The oral cavity is a dynamic environment characterized by hundreds of bacterial species, saliva, and an influx of nutrients and metal ions such as copper. Although there is a physiologic level of copper in the saliva, the oral cavity is often challenged with an influx of copper ions. At high concentrations copper is toxic and must therefore be strictly regulated by pathogens for them to persist and cause disease. The cariogenic pathogen Streptococcus mutans manages excess copper using the copYAZ operon that encodes a negative DNA-binding repressor (CopY), the P1-ATPase copper exporter (CopA), and the copper chaperone (CopZ). These hypothetical roles of the copYAZ operon in regulation and copper transport to receptors led us to investigate their contribution to S. mutans virulence. Mutants defective in the copper chaperone CopZ, but not CopY or CopA, were impaired in biofilm formation and competitiveness against commensal streptococci. Characterization of the CopZ mutant biofilm revealed a decreased secretion of glucosyltransferases and reduced expression of mutacin genes. These data suggest that the function of copZ on biofilm and competitiveness is independent of copper resistance and CopZ is a global regulator for biofilm and other virulence factors. Further characterization of CopZ may lead to the identification of new biofilm pathways. © 2015 John Wiley & Sons A/S. Published by John Wiley & Sons Ltd.

  3. Copper substrate as a catalyst for the oxidation of chemical vapor deposition-grown graphene

    International Nuclear Information System (INIS)

    Li, Zhiting; Zhou, Feng; Parobek, David; Shenoy, Ganesh J.; Muldoon, Patrick; Liu, Haitao

    2015-01-01

    We report the catalytic effect of copper substrate on graphene–oxygen reaction at high temperature. Previous studies showed that graphene grown on copper are mostly defect-free with strong oxidation resistance. We found that a freshly prepared copper-supported graphene sample can be completely oxidized in trace amount of oxygen (<3 ppm) at 600 °C within 2 h. Both X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) suggest that upon ambient air exposure, oxygen molecules diffuse into the space between graphene and copper, resulting in the formation of copper oxide which acts as catalytic sites for the graphene-oxygen reaction. This result has important implications for the characterization, processing, and storage of copper-supported graphene samples. - Graphical abstract: The copper substrate enhances the thermel oxidation of single-layer graphene. - Highlights: • A copper-supported graphene can be oxidized in Ar (O 2 <3 ppm, 600 °C, 2 h). • O 2 intercalates between graphene and copper upon exposure to air. • The copper foil should not be considered as an inert substrate

  4. An Investigation of Low Biofouling Copper-charged Membranes

    Science.gov (United States)

    Asapu, Sunitha

    with increased biofouling resistance. The goal of this project was to develop low-biofouling nanofiltration cellulose acetate (CA) membranes through functionalization with metal chelating ligands charged with biocidal metal ions, i.e. copper ions. To this end, glycidyl methacrylate (GMA), an epoxy, was used to attach a chelating agent, iminodiacetic acid (IDA) to facilitate the charging of copper to the membrane surface. Both CA and CA-GMA membranes were cast using the phase-inversion method. The CA-GMA membranes were then charged with copper ions to make them low biofouling. Pore size distribution analysis of CA and copper charged membranes were conducted using various molecular weights of polyethylene glycol (PEG). CA and copper-charged membranes were characterized using Fourier Transform Infrared (FTIR), contact angle to measure hydrophilicity changes, and using scanning electron microscope (SEM) coupled with X-ray energy dispersive spectroscopy EDS to monitor copper leaching. Permeation experiments were conducted with distilled (DI) water, protein solutions, and synthetic brackish water containing microorganisms. The DI water permeation of the copper-charged membranes was initially lower than the CA membranes. The membranes were then subjected to bovine serum albumin (BSA) and lipase filtration. The copper-charged membranes showed higher pure water flux values for both proteins as compared to CA membranes. The rejection of BSA and lipase was the same for both the copper charged and CA membranes. The filtration with the synthetic brackish water showed that copper-charged membranes had higher flux values as compared to CA membranes, and biofouling analysis showed more bacteria on the CA membranes as compared to copper-charged membranes. Therefore, the copper-charged membranes made here have shown a potential to be used as low-biofouling membranes in the future.

  5. Copper thin film for RFID UHF antenna on flexible substrate

    International Nuclear Information System (INIS)

    Tran, Nhan Ai; Tran, Huy Nam; Dang, Mau Chien; Fribourg-Blanc, Eric

    2010-01-01

    A process flow using photolithography and sputtering was studied for copper antenna fabrication on thin poly(ethylene terephthalate) (PET) substrate. The lift-off route was chosen for its flexibility at laboratory scale. It was clarified that the cleaning of PET is an important step that necessitates mild oxygen plasma etching. Then copper is sputter deposited after photolithographic definition of the antenna. Care is necessary since PET, as a very flexible substrate, is temperature sensitive. The temperature increase generated by the impact of deposited copper should be maintained below the glass transition temperature of the polymer to avoid detrimental deformation. dc power of 40 to 50 W was found to be the maximum possible sputtering power for commercial PET. It was found that the resistivity of the thin film is below two times the bulk resistivity of copper for a deposition pressure below 4×10 −3  mbar and thickness above 450 nm. These results enable the reliable fabrication of copper RFID UHF antennae on a PET substrate for further testing of new tag designs. The present paper summarizes the effort to test new designs of antennae for RadioFrequency IDentification (RFID) Ultra High Frequency (UHF) tags, for use in various applications (e.g. object tracking and environment monitoring) in Vietnam

  6. Determinants of virulence and of resistance to ceftiofur, gentamicin, and spectinomycin in clinical Escherichia coli from broiler chickens in Québec, Canada.

    Science.gov (United States)

    Chalmers, Gabhan; Cormier, Ashley C; Nadeau, Marie; Côté, Geneviève; Reid-Smith, Richard J; Boerlin, Patrick

    2017-05-01

    Antimicrobials are frequently used for the prevention of avian colibacillosis, with gentamicin used for this purpose in Québec until 2003. Ceftiofur was also used similarly, but voluntarily withdrawn in 2005 due to increasing resistance. Spectinomycin-lincomycin was employed as a replacement, but ceftiofur use was partially reinstated in 2007 until its definitive ban by the poultry industry in 2014. Gentamicin resistance frequency increased during the past decade in clinical Escherichia coli isolates from broiler chickens in Québec, despite this antimicrobial no longer being used. Since this increase coincided with the use of spectinomycin-lincomycin, co-selection of gentamicin resistance through spectinomycin was suspected. Therefore, relationships between spectinomycin, gentamicin, and ceftiofur resistance determinants were investigated here. The distribution of 13 avian pathogenic E. coli virulence-associated genes and their association with spectinomycin resistance were also assessed. A sample of 586 E. coli isolates from chickens with colibacillosis in Québec between 2009 and 2013 was used. The major genes identified for resistance to ceftiofur, gentamicin, and spectinomycin were bla CMY , aac(3)-VI, and aadA, respectively. The aadA and aac(3)-VI genes were strongly associated and shown to be located on a modified class 1 integron. The aadA and bla CMY genes were negatively associated, but when present together, were generally located on the same plasmids. No statistical positive association was observed between aadA and virulence genes, and virulence genes were only rarely detected on plasmids encoding spectinomycin resistance. Thus, the use of spectinomycin-lincomycin may likely select for gentamicin but not ceftiofur resistance, nor for any of the virulence-associated genes investigated. Copyright © 2017 Elsevier B.V. All rights reserved.

  7. The Effect of Copper

    African Journals Online (AJOL)

    environment, where fishes are found, stuns them ... of earthen ponds are springing up near cocoa ... farm, which posses toxicological risk to farmed ... Veg. oil. 1.0. 1.0. 1.0. 1.0. 1.0. Copper sulphate 0. 1.0. 2.5. 5.0. 7.5. Total ..... Cellulase Production by Wild Strains of Aspergillus Niger, ... Mangrove Area of Lagos, Nigeria.

  8. Copper Pyrimidine based MOFs

    Indian Academy of Sciences (India)

    Synthesized hydrothermally in a 23-mL Teflon lined stainless steel bomb by heating copper(II) 2-pyrazinecarboxylate (31 mg, 0.1 mmol) and tin(II) iodide (75 mg, 0.2 mmol) in 4 mL water at 150±C for 24 h. The reaction vessel was subsequently cooled to 70±C at 1±C/min and held at that temperature for 6 h before returning ...

  9. Supersonic copper clusters

    International Nuclear Information System (INIS)

    Powers, D.E.; Hansen, S.G.; Geusic, M.E.; Michalopoulos, D.L.; Smalley, R.E.

    1983-01-01

    Copper clusters ranging in size from 1 to 29 atoms have been prepared in a supersonic beam by laser vaporization of a rotating copper target rod within the throat of a pulsed supersonic nozzle using helium for the carrier gas. The clusters were cooled extensively in the supersonic expansion [T(translational) 1 to 4 K, T(rotational) = 4 K, T(vibrational) = 20 to 70 K]. These clusters were detected in the supersonic beam by laser photoionization with time-of-flight mass analysis. Using a number of fixed frequency outputs of an exciplex laser, the threshold behavior of the photoionization cross section was monitored as a function of cluster size.nce two-photon ionization (R2PI) with mass selective detection allowed the detection of five new electronic band systems in the region between 2690 and 3200 A, for each of the three naturally occurring isotopic forms of Cu 2 . In the process of scanning the R2PI spectrum of these new electronic states, the ionization potential of the copper dimer was determined to be 7.894 +- 0.015 eV

  10. Native copper as a natural analogue for copper canisters

    International Nuclear Information System (INIS)

    Marcos, N.

    1989-12-01

    This paper discusses the occurrence of native copper as found in geological formations as a stability analogue of copper canisters that are planned to be used for the disposal of spent nuclear fuel in the Finnish bedrock. A summary of several publications on native copper occurrences is presented. The present geochemical and geohydrological conditions in which copper is met with in its metallic state show that metallic copper is stable in a wide range of temperatures. At low temperatures native copper is found to be stable where groundwater has moderate pH (about 7), low Eh (< +100 mV), and low total dissolved solids, especially chloride. Microscopical and microanalytical studies were carried out on a dozen of rock samples containing native copper. The results reveal that the metal shows no significant alteration. Only the surface of copper grains is locally coated. In the oldest samples there exist small corrosion cracks; the age of the oldest samples is over 1,000 million years. A review of several Finnish groundwater studies suggests that there are places in Finland where the geohydrological conditions are favourable for native copper stability. (orig.)

  11. Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

    Science.gov (United States)

    Chen, Wenjun; Deng, Dunying; Cheng, Yuanrong; Xiao, Fei

    2015-07-01

    The easy oxidation of copper is one critical obstacle to high-performance copper-filled isotropically conductive adhesives (ICAs). In this paper, a facile method to prepare highly reliable, highly conductive, and low-cost ICAs is reported. The copper fillers were treated by organic acids for oxidation prevention. Compared with ICA filled with untreated copper flakes, the ICA filled with copper flakes treated by different organic acids exhibited much lower bulk resistivity. The lowest bulk resistivity achieved was 4.5 × 10-5 Ω cm, which is comparable to that of commercially available Ag-filled ICA. After 500 h of 85°C/85% relative humidity (RH) aging, the treated ICAs showed quite stable bulk resistivity and relatively stable contact resistance. Through analyzing the results of x-ray diffraction, x-ray photoelectron spectroscopy, and thermogravimetric analysis, we found that, with the assistance of organic acids, the treated copper flakes exhibited resistance to oxidation, thus guaranteeing good performance.

  12. Conductivity of laser printed copper structures limited by nano-crystal grain size and amorphous metal droplet shell

    International Nuclear Information System (INIS)

    Winter, Shoshana; Zenou, Michael; Kotler, Zvi

    2016-01-01

    We present a study of the morphology and electrical properties of copper structures which are printed by laser induced forward transfer from bulk copper. The percentage of voids and the oxidation levels are too low to account for the high resistivities (∼4 to 14 times the resistivity of bulk monocrystalline copper) of these structures. Transmission electron microscope (TEM) images of slices cut from the printed areas using a focused ion beam (FIB) show nano-sized crystal structures with grain sizes that are smaller than the electron free path length. Scattering from such grain boundaries causes a significant increase in the resistivity and can explain the measured resistivities of the structures. The TEM images also show a nano-amorphous layer (∼5 nm) at the droplet boundaries which also contributes to the overall resistivity. Such morphological characteristics are best explained by the ultrafast cooling rate of the molten copper droplets during printing. (paper)

  13. LIGNOCELLULOSE NANOCOMPOSITE CONTAINING COPPER SULFIDE

    OpenAIRE

    Sanchi Nenkova; Peter Velev; Mirela Dragnevska; Diyana Nikolova; Kiril Dimitrov

    2011-01-01

    Copper sulfide-containing lignocellulose nanocomposites with improved electroconductivity were obtained. Two methods for preparing the copper sulfide lignocellulose nanocomposites were developed. An optimization of the parameters for obtaining of the nanocomposites with respect to obtaining improved electroconductivity, economy, and lower quantities and concentration of copper and sulfur ions in waste waters was conducted. The mechanisms and schemes of delaying and subsequent connection of co...

  14. Copper and nickel alloys and titanium for seawater applications

    International Nuclear Information System (INIS)

    Richter, H.

    1977-01-01

    Copper and nickel alloys and titanium have been successfully used for heat exchangers on ships, in power plants and for chemical apparatus and piping systems because of their resistance against corrosion in sea water. Aluminium brass and copper nickel alloys, the standard materials for condensers and coolers, however, may be attacked, the corrosion depending on water quality, water velocity, and structural conditions. The mechanisms of corrosion are discussed. Under severe conditions the use of titanium may be indicated. The use of nickel base alloys is advantageous at elevated temperatures, e.g. for chemical reactions and for evaporation processes. Examples are given for application and for prevention of corrosion. (orig.) [de

  15. Comparison and analysis of the efficiency of heat exchange of copper rod and copper wires current lead

    International Nuclear Information System (INIS)

    Fang, J.; Yu, T.; Li, Z.M.; Wei, B.; Qiu, M.; Zhang, H.J.

    2013-01-01

    Highlights: •An optimized design of HTS binary current leads is proposed. •Temperature distributions of two different current leads are calculated. •Experiments are done to certify the calculated temperature distributions. •The experiments proved that the copper wires increase security margins. -- Abstract: Current leads are the key components that connect the low-temperature and high temperature parts of the cryogenic system. Owing to the wide range of temperatures, current leads are the main sources of heat leakage. Since the HTS tapes have no resistance and the generated Joule heat is almost zero, HTS binary current leads can reduce heat leakage compared to the conventional leads. However, heat will still be generated and conducted to the cryogenic system through the copper parts of the HTS current leads. In order to reduce heat leakage by the copper parts of the HTS current leads, this paper presents an optimized design of the copper parts of HTS binary current leads. Inside the leads, the copper wires were applied as an alternative to the copper rod without changing the overall dimensions. Firstly, the differential function of heat transfer was derived. By solving the function, the optimum number of the copper wires and the temperature distribution of two different current leads were gotten. Then the experiment of the temperature distribution was done, and the experimental results were basically the same with the calculative results. The simulation and related experiments proved that the copper wire can increase security margins and reduce maximum temperatures under the same shunt current

  16. Comparison and analysis of the efficiency of heat exchange of copper rod and copper wires current lead

    Energy Technology Data Exchange (ETDEWEB)

    Fang, J., E-mail: fangseer@sina.com [School of Electrical Engineering, Beijing Jiaotong University, Beijing (China); Yu, T. [School of Electrical Engineering, Beijing Jiaotong University, Beijing (China); Li, Z.M.; Wei, B.; Qiu, M.; Zhang, H.J. [China Electric Power Research Institute, Haidian District, Beijing (China)

    2013-11-15

    Highlights: •An optimized design of HTS binary current leads is proposed. •Temperature distributions of two different current leads are calculated. •Experiments are done to certify the calculated temperature distributions. •The experiments proved that the copper wires increase security margins. -- Abstract: Current leads are the key components that connect the low-temperature and high temperature parts of the cryogenic system. Owing to the wide range of temperatures, current leads are the main sources of heat leakage. Since the HTS tapes have no resistance and the generated Joule heat is almost zero, HTS binary current leads can reduce heat leakage compared to the conventional leads. However, heat will still be generated and conducted to the cryogenic system through the copper parts of the HTS current leads. In order to reduce heat leakage by the copper parts of the HTS current leads, this paper presents an optimized design of the copper parts of HTS binary current leads. Inside the leads, the copper wires were applied as an alternative to the copper rod without changing the overall dimensions. Firstly, the differential function of heat transfer was derived. By solving the function, the optimum number of the copper wires and the temperature distribution of two different current leads were gotten. Then the experiment of the temperature distribution was done, and the experimental results were basically the same with the calculative results. The simulation and related experiments proved that the copper wire can increase security margins and reduce maximum temperatures under the same shunt current.

  17. Copper toxicity in housed lambs

    Energy Technology Data Exchange (ETDEWEB)

    Adamson, A H; Valks, D A; Appleton, M A; Shaw, W B

    1969-09-27

    Copper toxicity among 170 lambs artificially reared indoors at High Mowthorpe NAAS Experimental Husbandry Farm is reported. Although only three lambs were lost it is not unreasonable to suggest that the liver copper levels of the lambs which were slaughtered would have been high and losses could have been much heavier had there been any further copper supplementation. Even a copper level of 20 ppm in lamb concentrates given to lambs reared artificially indoors is dangerous, and intakes of much less than 38 mg per lamb per day can be fatal if given of a prolonged period. 5 references, 1 table.

  18. Effects of combinative surface modification on the stability and conductivity of the copper particles

    International Nuclear Information System (INIS)

    Zeng, Yike; Li, Tongtong; Fu, Ming; Jiang, Shenglin; Zhang, Guangzu

    2014-01-01

    Highlights: • A combinative method is used to improve the performance of the copper powder. • The method integrates passivation, silver-coating, and coupling agent treatment. • The stability of the copper powder has been improved after the modification. • The sheet resistance of the conductive film is reduced to 15 mΩ. -- Abstract: The specific goal of the present study is to evaluate the surface performance of the copper particles and get excellent copper powder by surface modification. This paper proposes a combinative modification method integrating passivation, silver-coated, and coupling agent. As a result, after 600 h at room temperature the copper powder has the stabilization improved and is well combined with organic matters, and the sheet resistance of the film fabricated by the copper conductive filler is reduced to 15 mΩ. The performance of the copper powder has been greatly enhanced by the combinative modification, and the cost of the copper conductive filler is decreased significantly by this method. The results indicate that the combinative surface modification method can be used for practical electronic application

  19. Monitoring Interactions Inside Cells by Advanced Spectroscopies: Overview of Copper Transporters and Cisplatin.

    Science.gov (United States)

    Lasorsa, Alessia; Natile, Giovanni; Rosato, Antonio; Tadini-Buoninsegni, Francesco; Arnesano, Fabio

    2018-02-12

    Resistance, either at the onset of the treatment or developed after an initial positive response, is a major limitation of antitumor therapy. In the case of platinum- based drugs, copper transporters have been found to interfere with drug trafficking by facilitating the import or favoring the platinum export and inactivation. The use of powerful spectroscopic, spectrometric and computational methods has allowed a deep structural insight into the mode of interaction of platinum drugs with the metal-binding domains of the transporter proteins. This review article focuses on the mode in which platinum drugs can compete with copper ion for binding to transport proteins and consequent structural and biological effects. Three types of transporters are discussed in detail: copper transporter 1 (Ctr1), the major responsible for Cu+ uptake; antioxidant-1 copper chaperone (Atox1), responsible for copper transfer within the cytoplasm; and copper ATPases (ATP7A/B), responsible for copper export into specific subcellular compartments and outside the cell. The body of knowledge summarized in this review can help in shaping current chemotherapy to optimize the efficacy of platinum drugs (particularly in relation to resistance) and to mitigate adverse effects on copper metabolism. Copyright© Bentham Science Publishers; For any queries, please email at epub@benthamscience.org.

  20. Copper infiltrated high speed steels based composites

    International Nuclear Information System (INIS)

    Madej, M.; Lezanski, J.

    2003-01-01

    High hardness, mechanical strength, heat resistance and wear resistance of M3/2 high speed steel (HSS) make it an attractive material. Since technological and economical considerations are equally important, infiltration of high-speed steel skeleton with liquid cooper has proved to be a suitable technique whereby fully dense material is produced at low cost. Attempts have been made to describe the influence of the production process parameters and alloying additives, such as tungsten carbide on the microstructure and mechanical properties of copper infiltrated HSS based composites. The compositions of powder mixtures are 100% M3/2, M3/2+10% Wc, M3/2=30% WC. The powders were uniaxially cold compacted in a cylindrical die at 800 MPa. The green compacts were sintered in vacuum at 1150 o C for 60 minutes. Thereby obtained porous skeletons were subsequently infiltrated with cooper, by gravity method, in vacuum furnace at 1150 o C for 15 minutes. (author)

  1. Spectrographic determination of impurities in copper and copper oxide

    International Nuclear Information System (INIS)

    Sabato, S.F.; Lordello, A.R.

    1990-11-01

    An emission spectrographic method for the determination of Al, Bi, Ca, Cd, Cr, Fe, Ge, Mg, Mn, Mo, Ni, Pb, Sb, Si, Sn and Zn in copper and copper oxide is described. Two mixtures (Graphite and ZnO: graphite and GeO sub(2)) were used as buffers. The standard deviation lies around 10%. (author)

  2. Nickel, copper and cobalt coalescence in copper cliff converter slag

    Directory of Open Access Journals (Sweden)

    Wolf A.

    2016-01-01

    Full Text Available The aim of this investigation is to assess the effect of various additives on coalescence of nickel, copper and cobalt from slags generated during nickel extraction. The analyzed fluxes were silica and lime while examined reductants were pig iron, ferrosilicon and copper-silicon compound. Slag was settled at the different holding temperatures for various times in conditions that simulated the industrial environment. The newly formed matte and slag were characterized by their chemical composition and morphology. Silica flux generated higher partition coefficients for nickel and copper than the addition of lime. Additives used as reducing agents had higher valuable metal recovery rates and corresponding partition coefficients than fluxes. Microstructural studies showed that slag formed after adding reductants consisted of primarily fayalite, with some minute traces of magnetite as the secondary phase. Addition of 5 wt% of pig iron, ferrosilicon and copper-silicon alloys favored the formation of a metallized matte which increased Cu, Ni and Co recoveries. Addition of copper-silicon alloys with low silicon content was efficient in copper recovery but coalescence of the other metals was low. Slag treated with the ferrosilicon facilitated the highest cobalt recovery while copper-silicon alloys with silicon content above 10 wt% resulted in high coalescence of nickel and copper, 87 % and 72 % respectively.

  3. Culture-Dependent and Independent Studies of Microbial Diversity in Highly Copper-Contaminated Chilean Marine Sediments

    NARCIS (Netherlands)

    Besaury, L.; Marty, F.; Buquet, S.; Mesnage, V.; Muijzer, G.; Quillet, L.

    2013-01-01

    Cultivation and molecular-based approaches were used to study microbial diversity in two Chilean marine sediments contaminated with high (835 ppm) and very high concentrations of copper (1,533 ppm). The diversity of cultivable bacteria resistant to copper was studied at oxic and anoxic conditions,

  4. Synthesis of cytochrome c oxidase 1 (SCO1) inhibits insulin sensitivity by decreasing copper levels in adipocytes.

    Science.gov (United States)

    Wei, Xiang-Bo; Guo, Liang; Liu, Yang; Zhou, Shui-Rong; Liu, Yuan; Dou, Xin; Du, Shao-Yue; Ding, Meng; Peng, Wan-Qiu; Qian, Shu-Wen; Huang, Hai-Yan; Tang, Qi-Qun

    2017-09-23

    Dysregulation of insulin signaling leads to type 2 diabetes mellitus (T2DM) and other metabolic disorders. Obesity is an important contributor to insulin resistance, and although the understanding of this relationship has improved in recent years, the mechanism of obesity-induced insulin resistance is not completely understood. Disorders of copper metabolism tend to accompany the development of obesity, which increases the risk of insulin resistance. Synthesis of cytochrome c oxidase 1 (SCO1) functions in the assembly of cytochrome c oxidase (COX) and cellular copper homeostasis. However, the role of SCO1 in the regulation of metabolism remains unknown. Here, we found that obese mice had higher expression of SCO1 and lower levels of copper in white adipose tissue (WAT) than did the control mice. Overexpression of SCO1 in adipocytes was associated with copper deficiency. Copper increased insulin sensitivity by decreasing the level of phosphatase and tensin homolog (PTEN) protein. Ectopic expression of SCO1 led to insulin resistance and was accompanied by a decrease in intracellular copper level, and addition of copper abolished the inhibitory effect of SCO1 on insulin sensitivity. Our results demonstrated a novel role of SCO1 in modulating insulin sensitivity via the regulation of copper concentration in WAT and suggested a potential therapeutic target for T2DM. Copyright © 2017. Published by Elsevier Inc.

  5. Structural changes in a copper alloy due to helium implantation

    International Nuclear Information System (INIS)

    Moreno, D.; Eliezer, D.

    1996-01-01

    The most suitable nuclear fusion reaction for energy production occurs between the two heavy hydrogen isotopes, deuterium and tritium. Structural materials in fusion reactors will be exposed to helium implantation over a broad range of energies. The deformation and partial exfoliation of surface layers due to hydrogen isotopes and helium contribute to the total erosion of the first wall. For this reason, one of the most important criteria in the choice of materials for the first wall of fusion reactors is the material's damage resistance. Recent advances in developing nuclear fusion reactors reveal that efficient heat removal from plasma-facing components is very important. Copper and copper alloys are considered an attractive choice for transporting such a high heat flux without thermal damage as they have high thermal conductivity. In the present study the authors report on the structural changes in a copper alloy, due to the helium implantation on the very near surface area, observed by transmission electron microscopy

  6. The effect of copper deficiency on fetal growth and liver anti-oxidant capacity in the Cohen diabetic rat model

    Energy Technology Data Exchange (ETDEWEB)

    Ergaz, Zivanit, E-mail: zivanit@hadassah.org.il [Hebrew University Hadassah Medical School, Jerusalem (Israel); Shoshani-Dror, Dana [Hebrew University Hadassah Medical School, Jerusalem (Israel); Guillemin, Claire [Department of Pharmacology and Therapeutics, McGill University, Montreal (Canada); Neeman-azulay, Meytal; Fudim, Liza [Hebrew University Hadassah Medical School, Jerusalem (Israel); Weksler-Zangen, Sarah [Diabetes Research Unit, Hebrew University Hadassah Medical School and Hospital, Jerusalem (Israel); Stodgell, Christopher J.; Miller, Richard K. [Department of Obstetrics and Gynecology, University of Rochester, Rochester, MN (United States); Ornoy, Asher [Hebrew University Hadassah Medical School, Jerusalem (Israel)

    2012-12-01

    High sucrose low copper diet induces fetal growth restriction in the three strains of the Cohen diabetic rats: an inbred copper deficient resistant (CDr), an inbred copper deficient sensitive (CDs that become diabetic on high sucrose low copper diet -HSD) and an outbred Wistar derived Sabra rats. Although those growth restricted fetuses also exhibit increased oxidative stress, antioxidants do not restore normal growth. In the present study, we evaluated the role of copper deficiency in the HSD induced fetal growth restriction by adding to the drinking water of the rats 1 ppm or 2 ppm of copper throughout their pregnancy. Fetal and placental growth in correlation with fetal liver copper content and anti-oxidant capacity was evaluated on day 21 of pregnancy. HSD compared to regular chow induced fetal growth restriction, which was most significant in the Cohen diabetic sensitive animals. The addition of 1 ppm and 2 ppm copper to the drinking water normalized fetal growth in a dose dependent manner and reduced the degree of hyperglycemia in the diabetes sensitive rats. The CDs fetuses responded to the HSD with lower catalase like activity, and less reduced superoxide dismutase levels compared to the Sabra strain, and had high malondialdehyde levels even when fed regular chow. Immunostaining was higher for nitrotyrosine among the CDr and higher for hypoxia factor 1 α among the CDs. We conclude that in our model of dietary-induced fetal growth restriction, copper deficiency plays a major etiologic role in the decrease of fetal growth and anti-oxidant capacity. -- Highlights: ► High sucrose low copper diet restricted fetal growth in the Cohen diabetic rat model ► Maternal copper blood levels directly correlated with fetal liver copper content ► Copper supplementation decreased embryonic resorption in the inbred strains ► Copper supplementation reduced hyperglycemia in the sucrose sensitive inbred strain ► Copper supplementation alleviated growth restriction and

  7. The effect of copper deficiency on fetal growth and liver anti-oxidant capacity in the Cohen diabetic rat model

    International Nuclear Information System (INIS)

    Ergaz, Zivanit; Shoshani-Dror, Dana; Guillemin, Claire; Neeman-azulay, Meytal; Fudim, Liza; Weksler-Zangen, Sarah; Stodgell, Christopher J.; Miller, Richard K.; Ornoy, Asher

    2012-01-01

    High sucrose low copper diet induces fetal growth restriction in the three strains of the Cohen diabetic rats: an inbred copper deficient resistant (CDr), an inbred copper deficient sensitive (CDs that become diabetic on high sucrose low copper diet -HSD) and an outbred Wistar derived Sabra rats. Although those growth restricted fetuses also exhibit increased oxidative stress, antioxidants do not restore normal growth. In the present study, we evaluated the role of copper deficiency in the HSD induced fetal growth restriction by adding to the drinking water of the rats 1 ppm or 2 ppm of copper throughout their pregnancy. Fetal and placental growth in correlation with fetal liver copper content and anti-oxidant capacity was evaluated on day 21 of pregnancy. HSD compared to regular chow induced fetal growth restriction, which was most significant in the Cohen diabetic sensitive animals. The addition of 1 ppm and 2 ppm copper to the drinking water normalized fetal growth in a dose dependent manner and reduced the degree of hyperglycemia in the diabetes sensitive rats. The CDs fetuses responded to the HSD with lower catalase like activity, and less reduced superoxide dismutase levels compared to the Sabra strain, and had high malondialdehyde levels even when fed regular chow. Immunostaining was higher for nitrotyrosine among the CDr and higher for hypoxia factor 1 α among the CDs. We conclude that in our model of dietary-induced fetal growth restriction, copper deficiency plays a major etiologic role in the decrease of fetal growth and anti-oxidant capacity. -- Highlights: ► High sucrose low copper diet restricted fetal growth in the Cohen diabetic rat model ► Maternal copper blood levels directly correlated with fetal liver copper content ► Copper supplementation decreased embryonic resorption in the inbred strains ► Copper supplementation reduced hyperglycemia in the sucrose sensitive inbred strain ► Copper supplementation alleviated growth restriction and

  8. Effect of Physical Property and Surface Morphology of Copper Foil at Electrodeposition Parameter

    Energy Technology Data Exchange (ETDEWEB)

    Woo, Tae Gyu; Park, Il Song; Lee, Man Hyung; Seol, Kyeong Won [Chonbuk National University, Jeonju (Korea, Republic of)

    2014-06-15

    The effect of additives, current density and plated temperature on the surface morphology and physical property, during copper electrodeposition on polyimide (PI) film was investigated. Two kinds of additives, Cl and leveler (additive B), were used in this study. Electrochemical experiments were performed in conjunction with SEM, XRD and four-point probe to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity was controlled by the concentration of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated in the electrolyte without additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm Cl and 100 ppm additive B. Large particles were observed on the surface of the copper layer electroplated using a current density of 25 mA/cm{sup 2}, but a uniform surface and lower resistivity were obtained using a current density of 10 mA/cm{sup 2}. One of the required important properties of FCCL is flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density, rather than a high current density. Moreover, a reasonable current density is 20 mA/cm{sup 2}, considering the productivity and mechanical properties of copper foil.

  9. The electrical characteristics of copper slags in a 270 kVA DC arc furnace

    International Nuclear Information System (INIS)

    Derin, Bora; Sahin, Filiz Cinar; Yucel, Onuralp

    2003-01-01

    The electrical resistance of slags is the main criteria to determine the design and the operation conditions of slag resistance furnace (SRF) depending on temperature and composition. In this study, a 270 kVA DC electric arc furnace were used to determine the electrical characteristic of molten ancient copper slags. The specific conductivity of the slag was estimated by using furnace geometric factor given in the literature as an empirical formula and by using furnace resistance measured during smelting of the copper slag with or without different additives such as coke, CaO and Al 2 O 3 . (Original)

  10. Culture-dependent and independent studies of microbial diversity in highly copper-contaminated Chilean marine sediments.

    Science.gov (United States)

    Besaury, Ludovic; Marty, Florence; Buquet, Sylvaine; Mesnage, Valérie; Muyzer, Gerard; Quillet, Laurent

    2013-02-01

    Cultivation and molecular-based approaches were used to study microbial diversity in two Chilean marine sediments contaminated with high (835 ppm) and very high concentrations of copper (1,533 ppm). The diversity of cultivable bacteria resistant to copper was studied at oxic and anoxic conditions, focusing on sulfate-, thiosulfate-, and iron-reducing bacteria. For both sediments, the cultivable bacteria isolated at oxic conditions were mostly affiliated to the genus Bacillus, while at anoxic conditions the majority of the cultivable bacteria found were closely related to members of the genera Desulfovibrio, Sphingomonas, and Virgibacillus. Copper resistance was between 100 and 400 ppm, with the exception of a strain affiliated to members of the genus Desulfuromonas, which was resistant up to 1,000 ppm of copper. In parallel, cloning and sequencing of 16S rRNA was performed to study the total bacterial diversity in the sediments. A weak correlation was observed between the isolated strains and the 16S rRNA operational taxonomic units detected. The presence of copper resistance genes (copA, cusA, and pcoA) was tested for all the strains isolated; only copA was detected in a few isolates, suggesting that other copper resistance mechanisms could be used by the bacteria in those highly copper-contaminated sediments.

  11. Structural measurements and cell line studies of the copper-PEG-Rifampicin complex against Mycobacterium tuberculosis.

    Science.gov (United States)

    Manning, Thomas; Mikula, Rachel; Wylie, Greg; Phillips, Dennis; Jarvis, Jackie; Zhang, Fengli

    2015-02-01

    The bacterium responsible for tuberculosis is increasing its resistance to antibiotics resulting in new multidrug-resistant Mycobacterium tuberculosis (MDR-TB) and extensively drug-resistant tuberculosis (XDR-TB). In this study, several analytical techniques including NMR, FT-ICR, MALDI-MS, LC-MS and UV/Vis are used to study the copper-Rifampicin-Polyethylene glycol (PEG-3350) complex. The copper (II) cation is a carrier for the antibiotic Rifampicin as well as nutrients for the bacterium. The NIH-NIAID cell line containing several Tb strains (including antibiotic resistant strains) is tested against seven copper-PEG-RIF complex variations. Copyright © 2014 Elsevier Ltd. All rights reserved.

  12. Copper: From neurotransmission to neuroproteostasis

    Directory of Open Access Journals (Sweden)

    Carlos M Opazo

    2014-07-01

    Full Text Available Copper is critical for the Central Nervous System (CNS development and function. In particular, different studies have shown the effect of copper at brain synapses, where it inhibits Long Term Potentation (LTP and receptor pharmacology. Paradoxically, according to recent studies copper is required for a normal LTP response. Copper is released at the synaptic cleft, where it blocks glutamate receptors, which explain its blocking effects on excitatory neurotransmission. Our results indicate that copper also enhances neurotransmission through the accumulation of PSD95 protein, which increase the levels of AMPA receptors located at the plasma membrane of the post-synaptic density. Thus, our findings represent a novel mechanism for the action of copper, which may have implications for the neurophysiology and neuropathology of the CNS. These data indicate that synaptic configuration is sensitive to transient changes in transition metal homeostasis. Our results suggest that copper increases GluA1 subunit levels of the AMPA receptor through the anchorage of AMPA receptors to the plasma membrane as a result of PSD-95 accumulation. Here, we will review the role of copper on neurotransmission of CNS neurons. In addition, we will discuss the potential mechanisms by which copper could modulate neuronal proteostasis (neuroproteostasis in the CNS with focus in the Ubiquitin Proteasome System, which is particularly relevant to neurological disorders such Alzheimer’s disease (AD where copper and protein dyshomeostasis may contribute to neurodegeneration. An understanding of these mechanisms may ultimately lead to the development of novel therapeutic approaches to control metal and synaptic alterations observed in AD patients.

  13. Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate

    Science.gov (United States)

    Wang, C. P.; Dai, T.; Lu, Y.; Shi, Z.; Ruan, J. J.; Guo, Y. H.; Liu, X. J.

    2017-08-01

    Copper thin films with thickness of about 500 nm doped with different aluminum concentrations have been prepared by magnetron sputtering on Si substrate and their crystal structure, microstructure, and electrical resistivity after annealing at various temperatures (200°C to 600°C) for 1 h or at 400°C for different durations (1 h to 11 h) investigated by grazing-incidence x-ray diffraction (GIXRD) analysis, scanning electron microscopy (SEM), and four-point probe (FPP) measurements. Cu-1.8Al alloy thin film exhibited good thermal stability and low electrical resistivity (˜5.0 μΩ cm) after annealing at 500°C for 1 h or 400°C for 7 h. No copper silicide was observed at the Cu-Al/Si interface by GIXRD analysis or SEM for this sample. This result indicates that doping Cu thin film with small amounts of Al can achieve high thermal stability and low electrical resistivity, suggesting that Cu-1.8Al alloy thin film could be used for barrierless Cu metallization on Si substrate.

  14. Nanocarbon-copper thin film as transparent electrode

    International Nuclear Information System (INIS)

    Isaacs, R. A.; Zhu, H.; Preston, Colin; LeMieux, M.; Jaim, H. M. Iftekhar; Hu, L.; Salamanca-Riba, L. G.; Mansour, A.; Zavalij, P. Y.; Rabin, O.

    2015-01-01

    Researchers seeking to enhance the properties of metals have long pursued incorporating carbon in the metallic host lattice in order to combine the strongly bonded electrons in the metal lattice that yield high ampacity and the free electrons available in carbon nanostructures that give rise to high conductivity. The incorporation of carbon nanostructures into the copper lattice has the potential to improve the current density of copper to meet the ever-increasing demands of nanoelectronic devices. We report on the structure and properties of carbon incorporated in concentrations up to 5 wt. % (∼22 at. %) into the crystal structure of copper. Carbon nanoparticles of 5 nm–200 nm in diameter in an interconnecting carbon matrix are formed within the bulk Cu samples. The carbon does not phase separate after subsequent melting and re-solidification despite the absence of a predicted solid solution at such concentrations in the C-Cu binary phase diagram. This material, so-called, Cu covetic, makes deposition of Cu films containing carbon with similar microstructure to the metal possible. Copper covetic films exhibit greater transparency, higher conductivity, and resistance to oxidation than pure copper films of the same thickness, making them a suitable choice for transparent conductors

  15. Copper alloys for high heat flux structure applications

    International Nuclear Information System (INIS)

    Zinkle, S.J.; Fabritsiev, S.A.

    1994-01-01

    The mechanical and physical properties of copper alloys are reviewed and compared with the requirements for high heat flux structural applications in fusion reactors. High heat flux structural materials must possess a combination of high thermal conductivity and high mechanical strength. The three most promising copper alloys at the present time are oxide dispersion-strengthened copper (Cu-Al 2 O 3 ) and two precipitation-hardened copper alloys (Cu-Cr-Zr and Cu-Ni-Be). These three alloys are capable of room temperature yield strengths >400 MPa and thermal conductivities up to 350 W/m-K. All of these alloys require extensive cold working to achieve their optimum strength. Precipitation-hardened copper alloys such Cu-Cr-Zr are susceptible to softening due to precipitate overaging and recrystallization during brazing, whereas the dislocation structure in Cu-Al 2 O 3 remains stabilized during typical high temperature brazing cycles. All three alloys exhibit good resistance to irradiation-induced softening and void swelling at temperatures below 300 degrees C. The precipitation-strengthened allows typically soften during neutron irradiation at temperatures above about 300 degrees C and therefore should only be considered for applications operating at temperatures 2 O 3 ) is considered to be the best candidate for high heat flux structural applications

  16. Nanocarbon-copper thin film as transparent electrode

    Energy Technology Data Exchange (ETDEWEB)

    Isaacs, R. A.; Zhu, H.; Preston, Colin; LeMieux, M.; Jaim, H. M. Iftekhar; Hu, L., E-mail: binghu@umd.edu; Salamanca-Riba, L. G., E-mail: riba@umd.edu [Materials Science and Engineering Department, University of Maryland, College Park, Maryland 20742 (United States); Mansour, A. [Carderock Division, Naval Surface Warfare Center, West Bethesda, Maryland 20817 (United States); Zavalij, P. Y. [Department of Chemistry and Biochemistry, University of Maryland, College Park, Maryland 20742 (United States); Rabin, O. [Materials Science and Engineering Department, University of Maryland, College Park, Maryland 20742 (United States); Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742 (United States)

    2015-05-11

    Researchers seeking to enhance the properties of metals have long pursued incorporating carbon in the metallic host lattice in order to combine the strongly bonded electrons in the metal lattice that yield high ampacity and the free electrons available in carbon nanostructures that give rise to high conductivity. The incorporation of carbon nanostructures into the copper lattice has the potential to improve the current density of copper to meet the ever-increasing demands of nanoelectronic devices. We report on the structure and properties of carbon incorporated in concentrations up to 5 wt. % (∼22 at. %) into the crystal structure of copper. Carbon nanoparticles of 5 nm–200 nm in diameter in an interconnecting carbon matrix are formed within the bulk Cu samples. The carbon does not phase separate after subsequent melting and re-solidification despite the absence of a predicted solid solution at such concentrations in the C-Cu binary phase diagram. This material, so-called, Cu covetic, makes deposition of Cu films containing carbon with similar microstructure to the metal possible. Copper covetic films exhibit greater transparency, higher conductivity, and resistance to oxidation than pure copper films of the same thickness, making them a suitable choice for transparent conductors.

  17. Effect of grain size on corrosion of nanocrystalline copper in NaOH solution

    International Nuclear Information System (INIS)

    Luo Wei; Xu Yimin; Wang Qiming; Shi Peizhen; Yan Mi

    2010-01-01

    Research highlights: → Coppers display an active-passive-transpassive behaviour with duplex passive film. → Grain size variation has little effect on the overall corrosion behaviour of Cu. → Little effect on corrosion may be due to duplex passivation in NaOH solution. → Bulk nanocrystalline Cu show bamboo-like flake corrosion structure. - Abstract: Effect of grain size on corrosion of bulk nanocrystalline copper was investigated using potentiodynamic polarization measurements in 0.1 M NaOH solution. Bulk nanocrystalline copper was prepared by inert gas condensation and in situ warm compress (IGCWC) method. The grain sizes of all bulk nanocrystalline samples were determined to be 48, 68 and 92 nm using X-ray diffraction (XRD). Results showed that bulk coppers displayed an active-passive-transpassive behaviour with duplex passive films. From polycrystalline to nanocrystalline, grain size variation showed little effect on the overall corrosion resistance of copper samples.

  18. Examination of Critical Length Effect in Copper Interconnects With Oxide and Low-k Dielectrics

    International Nuclear Information System (INIS)

    Thrasher, Stacye; Gall, Martin; Justison, Patrick; Hernandez, Richard; Kawasaki, Hisao; Capasso, Cristiano; Nguyen, Timothy

    2004-01-01

    As technology moves toward faster microelectronic devices with smaller feature sizes, copper is replacing aluminum-copper alloy and low-k dielectric is replacing oxide as the materials of choice for advanced interconnect integrations. Copper not only brings to the table the advantage of lower resistivity, but also exhibits better electromigration performance when compared to Al(Cu). Low-k dielectric materials are advantageous because they reduce power consumption and improve signal delay. Due to these advantages, the industry trend is moving towards integrating copper and low-k dielectric for high performance interconnects. The purpose of this study is to evaluate the critical length effect in single-inlaid copper interconnects and determine the critical product (jl)c, for a variety of integrations, examining the effect of ILD (oxide vs. low-k), geometry, and stress temperature

  19. Advanced Copper Composites Against Copper-Tolerant Xanthomonas perforans and Tomato Bacterial Spot.

    Science.gov (United States)

    Strayer-Scherer, A; Liao, Y Y; Young, M; Ritchie, L; Vallad, G E; Santra, S; Freeman, J H; Clark, D; Jones, J B; Paret, M L

    2018-02-01

    Bacterial spot, caused by Xanthomonas spp., is a widespread and damaging bacterial disease of tomato (Solanum lycopersicum). For disease management, growers rely on copper bactericides, which are often ineffective due to the presence of copper-tolerant Xanthomonas strains. This study evaluated the antibacterial activity of the new copper composites core-shell copper (CS-Cu), multivalent copper (MV-Cu), and fixed quaternary ammonium copper (FQ-Cu) as potential alternatives to commercially available micron-sized copper bactericides for controlling copper-tolerant Xanthomonas perforans. In vitro, metallic copper from CS-Cu and FQ-Cu at 100 μg/ml killed the copper-tolerant X. perforans strain within 1 h of exposure. In contrast, none of the micron-sized copper rates (100 to 1,000 μg/ml) from Kocide 3000 significantly reduced copper-tolerant X. perforans populations after 48 h of exposure compared with the water control (P copper-based treatments killed the copper-sensitive X. perforans strain within 1 h. Greenhouse studies demonstrated that all copper composites significantly reduced bacterial spot disease severity when compared with copper-mancozeb and water controls (P copper composites significantly reduced disease severity when compared with water controls, using 80% less metallic copper in comparison with copper-mancozeb in field studies (P copper composites have the potential to manage copper-tolerant X. perforans and tomato bacterial spot.

  20. Zinc Finger Nuclease: A New Approach to Overcome Beta-Lactam Antibiotic Resistance

    Science.gov (United States)

    Shahbazi Dastjerdeh, Mansoureh; Kouhpayeh, Shirin; Sabzehei, Faezeh; Khanahmad, Hossein; Salehi, Mansour; Mohammadi, Zahra; Shariati, Laleh; Hejazi, Zahra; Rabiei, Parisa; Manian, Mostafa

    2016-01-01

    Background: The evolution of antibiotic-resistant bacteria (ARB) and antibiotic-resistance genes (ARGs) has been accelerated recently by the indiscriminate application of antibiotics. Antibiotic resistance has challenged the success of medical interventions and therefore is considered a hazardous threat to human health. Objectives: The present study aimed to describe the use of zinc finger nuclease (ZFN) technology to target and disrupt a plasmid-encoded β-lactamase, which prevents horizontal gene transfer-mediated evolution of ARBs. Materials and Methods: An engineered ZFN was designed to target a specific sequence in the ampicillin resistance gene (ampR) of the pTZ57R plasmid. The Escherichia coli bacteria already contained the pZFN kanamycin-resistant (kanaR) plasmid as the case or the pP15A, kanaR empty vector as the control, were transformed with the pTZ57R; the ability of the designed ZFN to disrupt the β-lactamase gene was evaluated with the subsequent disturbed ability of the bacteria to grow on ampicillin (amp) and ampicillin-kanamycin (amp-kana)-containing media. The effect of mild hypothermia on the ZFN gene targeting efficiency was also evaluated. Results: The growth of bacteria in the case group on the amp and amp-kana-containing media was significantly lower compared with the control group at 37°C (P < 0.001). Despite being more efficient in hypothermic conditions at 30°C (P < 0.001), there were no significant associations between the incubation temperature and the ZFN gene targeting efficiency. Conclusions: Our findings revealed that the ZFN technology could be employed to overcome ampicillin resistance by the targeted disruption of the ampicillin resistance gene, which leads to inactivation of β-lactam synthesis. Therefore, ZFN technology could be engaged to decrease the antibiotic resistance issue with the construction of a ZFN archive against different ARGs. To tackle the resistance issue at the environmental level, recombinant phages

  1. Copper tolerance in Frankia sp. strain EuI1c involves surface binding and copper transport.

    Science.gov (United States)

    Rehan, Medhat; Furnholm, Teal; Finethy, Ryan H; Chu, Feixia; El-Fadly, Gomaah; Tisa, Louis S

    2014-09-01

    Several Frankia strains have been shown to be copper-tolerant. The mechanism of their copper tolerance was investigated for Frankia sp. strain EuI1c. Copper binding was shown by binding studies. Unusual globular structures were observed on the surface of the bacterium. These globular structures were composed of aggregates containing many relatively smaller "leaf-like" structures. Scanning electron microscopy with energy-dispersive X-ray (SEM-EDAX) analysis of these structures indicated elevated copper and phosphate levels compared to the control cells. Fourier transform infrared spectroscopy (FTIR) analysis indicated an increase in extracellular phosphate on the cell surface of copper-stressed cells. Bioinformatics' analysis of the Frankia sp. strain EuI1c genome revealed five potential cop genes: copA, copZ, copC, copCD, and copD. Experiments with Frankia sp. strain EuI1c using qRT-PCR indicated an increase in messenger RNA (mRNA) levels of the five cop genes upon Cu(2+) stress. After 5 days of Cu(2+) stress, the copA, copZ, copC, copCD, and copD mRNA levels increased 25-, 8-, 18-, 18-, and 25-fold, respectively. The protein profile of Cu(2+)-stressed Frankia sp. strain EuI1c cells revealed the upregulation of a 36.7 kDa protein that was identified as FraEuI1c_1092 (sulfate-binding periplasmic transport protein). Homologues of this gene were only present in the genomes of the Cu(2+)-resistant Frankia strains (EuI1c, DC12, and CN3). These data indicate that copper tolerance by Frankia sp. strain EuI1c involved the binding of copper to the cell surface and transport proteins.

  2. Copper Powder and Chemicals: edited proceedings of a seminar

    Energy Technology Data Exchange (ETDEWEB)

    1980-12-01

    Various papers are presented covering the following topics: Status of Copper Chemical Industry in India, Copper Powder from Industrial Wastes, Manufacture of Copper Hydroxide and High Grade Cement Copper from Low Grade Copper Ore, Manufacture of Copper Sulphate as a By-Product, Hydrometallurgical Treatments of Copper Converter and Smelter Slage for Recovering Copper and other Non-Ferrous Metals, Recovery of Copper from Dilute Solutions, Use of Copper Compounds as Fungicides in India, Copper in Animal Husbandry, and Use of Copper Powder and Chemicals for Marine Applications. The keynote paper given at the Seminar was on Conservation of Copper for Better Use.

  3. Substrate specificity of the OqxAB multidrug resistance pump in Escherichia coli and selected enteric bacteria

    DEFF Research Database (Denmark)

    Hansen, Lars Hestbjerg; Jensen, Lars Bogø; Sørensen, Heidi Iskou

    2007-01-01

    Objectives: A plasmid-encoded multidrug eff lux pump, OqxAB, identified in Escherichia coli of porcine origin, was tested for substrate specificity against selected antibiotics, detergents and disinfectants. The ability of horizontal transfer to food-borne pathogens of the Enterobacteriaceae family......: The plasmid-encoded OqxAB pump has a wide substrate specificity and can be transferred between Enterobacteriaceae conferring reduced susceptibility to a multitude of substrates. These results could indicate some dependence on the outer membrane proteins present in the different species....

  4. The effect of neutron spectrum on the mechanical and physical properties of pure copper and copper alloys

    International Nuclear Information System (INIS)

    Fabritsiev, S.A.; Pokrovsky, A.S.; Sandakov, V.A.; Zinkle, S.J.; Rowcliffe, A.F.; Edwards, D.J.; Garner, F.A.; Singh, B.N.; Barabash, V.R.

    1996-01-01

    The electrical resistivity and tensile properties of copper and oxide dispersion strengthened (DS) copper alloys have been measured before and after fission neutron irradiation to damage levels of 0.5 to 5 displacements per atom (dps) at ∼100 to 400 degrees C. Some of the specimens were irradiated inside a 1.5 mm Cd shroud in order to reduce the thermal neutron flux. The electrical resistivity data could be separated into two components, a solid transmutation component Δρ tr which was proportional to thermal neutron fluence and a radiation defect component Δρ rd which was independent of the displacement dose. The saturation value for Δρ rd was ∼1.2 nanohm-meters for pure copper and ∼1.6 nanohm-meters for the DS copper alloys irradiated at 100 degrees C in positions with a fast-to-thermal neutron flux ratio of 5. Considerable radiation hardening was observed in all specimens at irradiation temperatures below 200 degrees C. The yield strength was relatively insensitive to neutron spectrum in specimens strengthened by dispersoids or cold- working. 17 refs., 7 figs., 1 tab

  5. Weight loss studies of fastener materials corrosion in contact with timbers treated with copper azole and alkaline copper quaternary compounds

    Energy Technology Data Exchange (ETDEWEB)

    Kear, Gareth [Building Research Association of New Zealand (BRANZ) Ltd., Science and Engineering Services, Private Bag 50 908, Porirua City 5240 (New Zealand)], E-mail: G.Kear@soton.ac.uk; Wu Haizhen; Jones, Mark S. [Building Research Association of New Zealand (BRANZ) Ltd., Science and Engineering Services, Private Bag 50 908, Porirua City 5240 (New Zealand)

    2009-02-15

    Corrosion rates of mild steel, AISI 316 stainless steel and hot-dipped galvanised steel in contact with preservative-treated Pinus radiata have been determined using four distinct accelerated (49 {+-} 1 deg. C) and non-accelerated (21 {+-} 2 deg. C) weight loss methodologies. The data were measured as a function of timber moisture content and copper concentration over periods of exposure ranging from 2 weeks to 14 months. The results show that the corrosion resistance of the stainless steel was not influenced by classification or magnitude of preservative loading. Corrosion rates of this material were multiple orders of magnitude lower than those of the mild and galvanised steels. In most instances, corrosion rates of hot-dipped galvanised layers in contact with alkaline copper quaternary-treated timbers were up to a factor of 10 times, or greater, than those measured for copper-chrome-arsenate treatments. A direct negative influence of copper ion concentration on the corrosion resistance of mild steel was also observed for each preservative type.

  6. 21 CFR 73.1647 - Copper powder.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Copper powder. 73.1647 Section 73.1647 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Drugs § 73.1647 Copper powder. (a) Identity. (1) The color additive copper powder is a very fine free-flowing metallic powder prepared from virgin electrolytic copper. It...

  7. Copper uptake and retention in liver parenchymal cells isolated from nutritionally copper-deficient rats

    NARCIS (Netherlands)

    Berg, van den G.J.; de Goeij, J.J.M.; Bock, I.; Gijbels, M.J.J.; Brouwer, A.; Lei, K.Y.; Hendriks, H.F.J.

    1991-01-01

    Copper uptake and retention were studied in primary cultures of liver parenchymal cells isolated from copper-deficient rats. Male Sprague-Dawley rats were fed a copper-deficient diet (<1 mg Cu/kg) for 10 wk. Copper-deficient rats were characterized by low copper concentrations in plasma and liver,

  8. Copper uptake and retention in liver parenchymal cells isolated from nutritionally copper-deficient rats

    NARCIS (Netherlands)

    Berg, G.J. van den; Goeij, J.J.M. de; Bock, I.; Gijbels, M.J.J.; Brouwer, A.; Lei, K.Y.; Hendruiks, H.F.J.

    1991-01-01

    Copper uptake and retention were studied in primary cultures of liver parenchymal cells isolated from copper-deficient rats. Male Sprague-Dawley rats were fed a copper-deficient diet (< 1 mg Cu/kg) for 10 wk. Copper-deficient rats were characterized by low copper concentrations in plasma and liver,

  9. Effects of irradiation on the copper normal metal of a composite superconductor

    International Nuclear Information System (INIS)

    Williams, J.M.; Klabunde, C.E.; Redman, J.K.; Coltman, R.R. Jr.; Chaplin, R.L.

    1978-01-01

    This report presents a new body of magnetoresistance data for copper that were obtained in neutron irradiation experiments at 4K and 330K. These data are combined with previously obtained results on initial damage rates and saturation effects to yield a projection of total resistivity vs neutron dose (expressed in displacements per atom) for copper in service at < 10 K in a magnetic field

  10. NID Copper Sample Analysis

    Energy Technology Data Exchange (ETDEWEB)

    Kouzes, Richard T.; Zhu, Zihua

    2011-09-12

    The current focal point of the nuclear physics program at PNNL is the MAJORANA DEMONSTRATOR, and the follow-on Tonne-Scale experiment, a large array of ultra-low background high-purity germanium detectors, enriched in 76Ge, designed to search for zero-neutrino double-beta decay (0νββ). This experiment requires the use of germanium isotopically enriched in 76Ge. The MAJORANA DEMONSTRATOR is a DOE and NSF funded project with a major science impact. The DEMONSTRATOR will utilize 76Ge from Russia, but for the Tonne-Scale experiment it is hoped that an alternate technology, possibly one under development at Nonlinear Ion Dynamics (NID), will be a viable, US-based, lower-cost source of separated material. Samples of separated material from NID require analysis to determine the isotopic distribution and impurities. DOE is funding NID through an SBIR grant for development of their separation technology for application to the Tonne-Scale experiment. The Environmental Molecular Sciences facility (EMSL), a DOE user facility at PNNL, has the required mass spectroscopy instruments for making isotopic measurements that are essential to the quality assurance for the MAJORANA DEMONSTRATOR and for the development of the future separation technology required for the Tonne-Scale experiment. A sample of isotopically separated copper was provided by NID to PNNL in January 2011 for isotopic analysis as a test of the NID technology. The results of that analysis are reported here. A second sample of isotopically separated copper was provided by NID to PNNL in August 2011 for isotopic analysis as a test of the NID technology. The results of that analysis are also reported here.

  11. INTRACELLULAR COPPER ACCUMULATION ENHANCES THE GROWTH OF KINEOCOCCUS RADIOTOLERANS DURING CHRONIC IRRADIATION

    International Nuclear Information System (INIS)

    Bagwell, C; Charles Milliken, C

    2007-01-01

    The actinobacteria Kineococcus radiotolerans is highly resistant to ionizing radiation, desiccation, and oxidative stress; though the underlying biochemical mechanisms are unknown. The purpose of this study was to explore a possible linkage between the uptake of transition metals and extreme resistance to ionizing radiation and oxidative stress. The effects of 6 different divalent cationic metals on growth were examined in the absence of ionizing radiation. None of the metals tested were stimulatory, though cobalt was inhibitory to growth. In contrast, copper supplementation dramatically increased cell growth during chronic irradiation. K. radiotolerans exhibited specific uptake and intracellular accumulation of copper compared to only a weak response to both iron and manganese supplementation. Copper accumulation sensitized cells to hydrogen peroxide. Acute irradiation induced DNA damage was similar between the copper-loaded culture as the age-synchronized no copper control culture, though low molecular weight DNA was more persistent during post-irradiation recovery in the Cu-loaded culture. Still, the estimated times for genome restoration differed by only 1 hr between treatments. While we cannot discount the possibility that copper fulfills an unexpectedly important biochemical role in a radioactive environment; K. radiotolerans has a high capacity for intracellular copper sequestration, and presumably efficiently coordinated oxidative stress defenses and detoxification systems, which confers cross-protection from the damaging affects ionizing radiation

  12. Evolution of the microstructure in electrochemically deposited copper films at room temperature

    DEFF Research Database (Denmark)

    Pantleon, Karen; Somers, Marcel A. J.

    2007-01-01

    The room temperature evolution of the microstructure in copper electrodeposits (self-annealing) was investigated by means of X-ray diffraction analysis and simultaneous measurement of the electrical resistivity as a function of time with an unprecedented time resolution. Independent of the copper...... the crystallographic texture changes by a multiple twinning mechanism. The kinetics of self-annealing is strongly affected by the thickness of the deposit. Storage of the copper films at sub-zero temperatures effectively hinders self-annealing and does not affect the kinetics of self-annealing upon reheating to room...... temperature....

  13. Gallium and copper radiopharmaceutical chemistry

    International Nuclear Information System (INIS)

    Green, M.A.

    1991-01-01

    Gallium and copper radionuclides have a long history of use in nuclear medicine. Table 1 presents the nuclear properties of several gallium and copper isotopes that either are used in the routine practice of clinical nuclear medicine or exhibit particular characteristics that might make them useful in diagnostic or therapeutic medicine. This paper will provide some historic perspective along with an overview of some current research directions in gallium and copper radiopharmaceutical chemistry. A more extensive review of gallium radiopharmaceutical chemistry has recently appeared and can be consulted for a more in-depth treatment of this topic

  14. Copper complexes as 'radiation recovery' agents

    International Nuclear Information System (INIS)

    Sorenson, J.R.J.

    1989-01-01

    Copper and its compounds have been used for their remedial effects since the beginning of recorded history. As early as 3000 BC the Egyptians used copper as an antiseptic for healing wounds and to sterilise drinking water; and later, ca 1550 BC, the Ebers Papyrus reports the use of copper acetate, copper sulphate and pulverised metallic copper for the treatment of eye infections. These historical uses of copper and its compounds are particularly interesting in the light of modern evidence concerning the use of certain copper complexes for the treatment of radiation sickness and more recently as an adjunct to radiotherapy for cancer patients. (author)

  15. Corrosion characterization of in-situ titanium diboride (TiB2) reinforced aluminium-copper (Al-Cu) alloy by two methods: Salts spray fog and linear polarization resistance (LPR)

    Science.gov (United States)

    Rosmamuhamadani, R.; Talari, M. K.; Yahaya, Sabrina M.; Sulaiman, S.; Ismail, M. I. S.; Hanim, M. A. Azmah

    2018-05-01

    Aluminium-copper (Al-Cu) alloys is the one of most Metal Matrix Composites (MMCs) have important high-strength Al alloys. The aluminium (Al) casting alloys, based on the Al-Cu system are widely used in light-weight constructions and transport applications requiring a combination of high strength and ductility. In this research, Al-Cu master alloy was reinforced with 3 and 6wt.% titanium diboride (TiB2) that obtained from salts route reactions. The salts used were were potassium hexafluorotitanate (K2TiF6) and potassium tetrafluoroborate (KBF4). The salts route reaction process were done at 800 °C. The Al-Cu alloy then has characterized on the mechanical properties and microstructure characterization. Salts spray fog test and Gamry-electrode potentiometer instruments were used to determine the corrosion rate of this alloys. From results obtained, the increasement of 3wt.%TiB2 contents will decrease the value of the corrosion rate. In corrosion test that conducted both of salt spray fog and Gamry-electrode potentiometer, the addition of 3wt.%TiB2 gave the good properties in corrosion characterization compare to Al-Cu-6wt.%TiB2 and Al-Cu cast alloy itself. As a comparison, Al-Cu with 3wt.%TiB2 gave the lowest value of corrosion rate, which means alloy has good properties in corrosion characterization. The results obtained show that in-situ Al-Cu alloy composites containing the different weight of TiB2 phase were synthesized successfully by the salt-metal reaction method.

  16. Copper oxide thin films anchored on glass substrate by sol gel spin coating technique

    Science.gov (United States)

    Krishnaprabha, M.; Venu, M. Parvathy; Pattabi, Manjunatha

    2018-05-01

    Owing to the excellent optical, thermal, electrical and photocatalytic properties, copper oxide nanoparticles/films have found applications in optoelectronic devices like solar/photovoltaic cells, lithium ion batteries, gas sensors, catalysts, magnetic storage media etc. Copper oxide is a p-type semiconductor material having a band gap energy varying from 1.2 eV-2.1 eV. Syzygium Samarangense fruit extract was used as reducing agent to synthesize copper oxide nanostructures at room temperature from 10 mM copper sulphate pentahydrate solution. The synthesized nanostructures are deposited onto glass substrate by spin coating followed by annealing the film at 200 °C. Both the copper oxide colloid and films are characterized using UV-Vis spectroscopy, field emission scanning electron microscopy (FESEM) and energy dispersive spectroscopy (EDS) techniques. Presence of 2 peaks at 500 nm and a broad peak centered around 800 nm in the UV-Vis absorbance spectra of copper oxide colloid/films is indicative of the formation of anisotropic copper oxide nanostructures is confirmed by the FESEM images which showed the presence of triangular shaped and rod shaped particles. The rod shaped particles inside island like structures were found in unannealed films whereas the annealed films contained different shaped particles with reduced sizes. The elemental analysis using EDS spectra of copper oxide nanoparticles/films showed the presence of both copper and oxygen. Electrical properties of copper oxide nanoparticles are affected due to quantum size effect. The electrical studies carried out on both unannealed and annealed copper oxide films revealed an increase in resistivity with annealing of the films.

  17. Carbon Nanotube Fiber Pretreatments for Electrodeposition of Copper

    OpenAIRE

    Hannula, Pyry-Mikko; Junnila, Minttu; Janas, Dawid; Aromaa, Jari; Forsén, Olof; Lundström, Mari

    2018-01-01

    There is increasing interest towards developing carbon nanotube-copper (CNT-Cu) composites due to potentially improved properties. Carbon nanotube macroscopic materials typically exhibit high resistivity, low electrochemical reactivity, and the presence of impurities, which impede its use as a substrate for electrochemical deposition of metals. In this research, different CNT fiber pretreatment methods, such as heat treatment, immersion in Watts bath, anodization, and exposure to boric acid (...

  18. Copper tailings in stucco mortars

    Directory of Open Access Journals (Sweden)

    Osvaldo Pavez

    Full Text Available Abstract This investigation addressed the evaluation of the use of copper tailings in the construction industry in order to reduce the impact on the environment. The evaluation was performed by a technical comparison between stucco mortars prepared with crushed conventional sand and with copper tailings sand. The best results were achieved with the stucco mortars containing tailings. The tailings presented a fine particles size distribution curve different from that suggested by the standard. The values of compressive strength, retentivity, and adherence in the stucco mortars prepared with copper tailings were much higher than those obtained with crushed sand. According to the results from this study, it can be concluded that the preparation of stucco mortars using copper tailings replacing conventional sand is a technically feasible alternative for the construction industry, presenting the benefit of mitigating the impact of disposal to the environment.

  19. Niobium Titanium and Copper wire samples

    CERN Multimedia

    2009-01-01

    Two wire samples, both for carrying 13'000Amperes. I sample is copper. The other is the Niobium Titanium wiring used in the LHC magnets. The high magnetic fields needed for guiding particles around the Large Hadron Collider (LHC) ring are created by passing 12’500 amps of current through coils of superconducting wiring. At very low temperatures, superconductors have no electrical resistance and therefore no power loss. The LHC is the largest superconducting installation ever built. The magnetic field must also be extremely uniform. This means the current flowing in the coils has to be very precisely controlled. Indeed, nowhere before has such precision been achieved at such high currents. Magnet coils are made of copper-clad niobium–titanium cables — each wire in the cable consists of 9’000 niobium–titanium filaments ten times finer than a hair. The cables carry up to 12’500 amps and must withstand enormous electromagnetic forces. At full field, the force on one metre of magnet is comparable ...

  20. The copper deposits of Michigan

    Science.gov (United States)

    Butler, B.S.; Burbank, W.S.

    1929-01-01

    The copper district of Keweenaw Point, in the northern peninsula of Michigan, is the second largest producer of copper in the world.  The output of the district since 1845 has been more than 7,500,000,000 pounds and showed a rather steady and consistent increase from the beginning of production to the end of the World War in 1918, since which there has been a marked decrease.

  1. Copper atomic-scale transistors.

    Science.gov (United States)

    Xie, Fangqing; Kavalenka, Maryna N; Röger, Moritz; Albrecht, Daniel; Hölscher, Hendrik; Leuthold, Jürgen; Schimmel, Thomas

    2017-01-01

    We investigated copper as a working material for metallic atomic-scale transistors and confirmed that copper atomic-scale transistors can be fabricated and operated electrochemically in a copper electrolyte (CuSO 4 + H 2 SO 4 ) in bi-distilled water under ambient conditions with three microelectrodes (source, drain and gate). The electrochemical switching-on potential of the atomic-scale transistor is below 350 mV, and the switching-off potential is between 0 and -170 mV. The switching-on current is above 1 μA, which is compatible with semiconductor transistor devices. Both sign and amplitude of the voltage applied across the source and drain electrodes ( U bias ) influence the switching rate of the transistor and the copper deposition on the electrodes, and correspondingly shift the electrochemical operation potential. The copper atomic-scale transistors can be switched using a function generator without a computer-controlled feedback switching mechanism. The copper atomic-scale transistors, with only one or two atoms at the narrowest constriction, were realized to switch between 0 and 1 G 0 ( G 0 = 2e 2 /h; with e being the electron charge, and h being Planck's constant) or 2 G 0 by the function generator. The switching rate can reach up to 10 Hz. The copper atomic-scale transistor demonstrates volatile/non-volatile dual functionalities. Such an optimal merging of the logic with memory may open a perspective for processor-in-memory and logic-in-memory architectures, using copper as an alternative working material besides silver for fully metallic atomic-scale transistors.

  2. Atmospheric corrosion effects on copper

    International Nuclear Information System (INIS)

    Franey, J.P.

    1985-01-01

    Studies have been performed on the naturally formed patina on various copper samples. Samples have been obtained from structures at AT and T Bell Laboratories, Murray Hill, NJ (40,2,1 and <1 yr) and the Statue of Liberty (100 yr). The samples show a distinct layering effect, that is, the copper base material shows separate oxide and basic sulfate layers on all samples, indicating that patina is not a homogeneous mixture of oxides and basic sulfates

  3. Chronic copper poisoning in lambs

    Energy Technology Data Exchange (ETDEWEB)

    Ross, D B

    1964-08-08

    This communication presented evidence of the elevation of plasma GOT (glutamic oxaloacetic transaminase or aspartate transaminase) concentration during the development of copper toxicity in some experimental lambs, and also demonstrated that plasma GOT concentration can be used to assess the course of the disease during treatment. A group of Kerry Hill lambs were fed 1 1/2 lb per day of a proprietary concentrate containing 40 parts of copper per million on a dry-matter basis in addition to hay and water ad lib. Data was included for the plasma GOT concentrations of the lambs, bled weekly after weaning from pasture to this diet. There was some variation between the individual lambs, and in one there was no increase in plasma GOT by the 20th week when all the surviving lambs were slaughtered. The concentrations of copper found in the caudate lobe of the liver and in the kidney cortex post mortem were given. The overall findings showed that the liver gave a reliable indication of the copper status of an animal whereas the kidney cortex copper concentration was a better criterion for the diagnosis of copper poisoning and was in agreement with the results of Eden, Todd, and Grocey and Thompson. Observations demonstrated the benefits resulting from the early diagnosis of chronic copper poisoning in lambs, when treatment of affected animals may be commenced before the haemolytic crisis develops. Treatment included reducing the copper intake and dosing with ammonium molybdate and sodium sulfate, and the plasma GOT concentration may be used to assess the rate of recovery. 4 references, 3 tables.

  4. Copper sulphate poisoning in horses

    Energy Technology Data Exchange (ETDEWEB)

    Bauer, M

    1975-01-01

    In the archives of the Clinic for Internal Diseases of Domestic Animals at the Veterinary Faculty of Zagreb University some thirty cases of horse disease diagnosed as copper sulphate poisoning were noted. The data correspond in many respects to the clinical findings of copper sulphate poisoning in other domestic animals. A series of experimental horse poisonings were undertaken in order to determine the toxicity of copper sulphate. The research results are as follows: Horses are sensitive to copper sulphate. Even a single application of 0.125 g/kg body weight in 1% concentration by means of incubation into the stomach causes stomach and gut disturbances and other poisoning symptoms. Poisoning occurs in two types: acute and chronic. The former appears after one to three applications of copper sulphate solution and is characterized by gastroenteritis, haemolysis, jaundice and haemoglobinuria with signs of consecutive damage of kidney, liver and other organs. The disease, from the first application to death lasts for two weeks. Chronic poisoning is caused by ingestion of dry copper sulphate in food (1% solution dried on hay or clover) for two or more months. There are chronic disturbances of stomach and gut and loss of weight, and consecutive (three to four) haemolytic crises similar to those of acute poisoning. From the beginning of poisoning to death six or more months can elapse.

  5. Comparison of inorganic inhibitors of copper, nickel and copper-nickels in aqueous lithium bromide solution

    International Nuclear Information System (INIS)

    Munoz, A. Igual; Anton, J. Garcia; Guin-tilde on, J.L.; Herranz, V. Perez

    2004-01-01

    The electrochemical behavior of copper, nickel and two copper-nickel (Cu90/Ni10 and Cu70/Ni30) alloys in 850 g/L LiBr solution in the absence and presence of three different inorganic inhibitors (chromate CrO 4 2- , molybdate MoO 4 2- , and tetraborate B 4 O 7 2- ) has been studied. Differences in inhibition efficiency are discussed in terms of potentiodynamic and cyclic measurements. The best protection is obtained by adding chromate to the 850 g/L LiBr solution while the inhibition efficiencies of molybdate and tetraborate ions were not markedly high. Very aggressive anions, such as bromides, in the present experimental conditions, notably reduce the action of the less efficient molecules (molybdate and tetraborate), but not that of the most efficient ones (chromate). The results of the investigation show that the inhibiting properties depend on the nickel content in the alloy; this element improves the general corrosion resistance of the material in the sense that it shifts free corrosion potential towards more noble values and density corrosion currents towards lower levels. The nickel content in the alloy also enlarges the passivating region of the materials in chromate and molybdate-containing solution; furthermore it decreases the current passivating values to lower values. Nickel addition improves the localized corrosion resistance in the bromide media

  6. Re-examination of the threshold energy surface in copper

    International Nuclear Information System (INIS)

    King, W.E.; Benedek, R.; Merkle, K.L.; Meshii, M.

    1981-01-01

    Radiation-induced defect production in copper has been studied using in-situ electrical resistivity damage-rate measurements in the HVEM and molecular dynamics simulations. Analysis of the results yields a threshold energy surface characterized by two isolated pockets of low threshold energy centered at and surrounded by regions of much higher threshold energy; the corresponding damage function exhibits a plateau at 0.65 Frenkel pairs. A Frenkel pair resistivity of (2.75/sub -0.2/ + 0 6 ) x 10 - 4 Ω-cm is proposed. A model damage function is constructed and compared to results from ion irradiation damage-rate measurements. 7 figures

  7. Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors

    Science.gov (United States)

    Curtis, Calvin J [Lakewood, CO; Miedaner, Alexander [Boulder, CO; Van Hest, Maikel [Lakewood, CO; Ginley, David S [Evergreen, CO; Nekuda, Jennifer A [Lakewood, CO

    2011-11-15

    Liquid-based indium selenide and copper selenide precursors, including copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent, are used to form crystalline copper-indium-selenide, and/or copper indium gallium selenide films (66) on substrates (52).

  8. Use of copper radioisotopes in investigating disorders of copper metabolism

    International Nuclear Information System (INIS)

    Camakaris, J.; Voskoboinik, I.; Brooks, H.; Greenough, M.; Smith, S.; Mercer, J.

    1998-01-01

    Full text: Copper is an essential trace element for life as a number of vital enzymes require it. Copper deficiency can lead to neurological disorders, osteoporosis and weakening of arteries. However Cu is also highly toxic and homeostatic mechanisms have evolved to maintain Cu at levels which satisfy requirements but do not cause toxicity. Toxicity is mediated by the oxidative capacity of Cu and its ability to generate toxic free radicals. There are several acquired and inherited diseases due to either Cu toxicity or Cu deficiency. The study of these diseases facilitates identification of genes and proteins involved in copper homeostasis, and this in turn will provide rational therapeutic approaches. Our studies have focused on Menkes disease in humans which is an inherited and usually lethal copper deficiency. Using copper radioisotopes 64 Cu (t 1/2 = 12.8 hr) and 67 Cu (t 1/2 = 61 hr) we have studied the protein which is mutated in Menkes disease. This is a transmembrane copper pump which is responsible for absorption of copper into the body and also functions to pump out excess Cu from cells when Cu is elevated. It is therefore a vital component of normal Cu homeostasis. We have provided the first biochemical evidence that the Menkes protein functions as a P-type ATPase Cu pump (Voskoboinik et al., FEBS Letters, in press) and these data will be discussed. The assay involved pumping of radiocopper into purified membrane vesicles. Furthermore we have transfected normal and mutant Menkes genes into cells and are carrying out structure-function studies. We are also studying the role of amyloid precursor protein (APP) as a Cu transport protein in order to determine how Cu regulates this protein and its cleavage products. These studies will provide vital information on the relationship between Cu and APP and processes which lead to Alzheimers disease

  9. Copper and CuNi alloys substrates for HTS coated conductor applications protected from oxidation

    Energy Technology Data Exchange (ETDEWEB)

    Segarra, M; Diaz, J; Xuriguera, H; Chimenos, J M; Espiell, F [Dept. of Chemical Engineering and Metallurgy, Univ. of Barcelona, Barcelona (Spain); Miralles, L [Lab. d' Investigacio en Formacions Geologiques. Dept. of Petrology, Geochemistry and Geological Prospecting, Univ. of Barcelona, Barcelona (Spain); Pinol, S [Inst. de Ciencia de Materials de Barcelona, Bellaterra (Spain)

    2003-07-01

    Copper is an interesting substrate for HTS coated conductors for its low cost compared to other metallic substrates, and for its low resistivity. Nevertheless, mechanical properties and resistance to oxidation should be improved in order to use it as substrate for YBCO deposition by non-vacuum techniques. Therefore, different cube textured CuNi tapes were prepared by RABIT as possible substrates for deposition of high critical current density YBCO films. Under the optimised conditions of deformation and annealing, all the studied CuNi alloys (2%, 5%, and 10% Ni) presented (100) left angle 001 right angle cube texture which is compatible for YBCO deposition. Textured CuNi alloys present higher tensile strength than pure copper. Oxidation resistance of CuNi tapes under different oxygen atmospheres was also studied by thermogravimetric analysis and compared to pure copper tapes. Although the presence of nickel improves mechanical properties of annealed copper, it does not improve its oxidation resistance. However, when a chromium buffer layer is electrodeposited on the tape, oxygen diffusion is slowed down. Chromium is, therefore, useful for protecting copper and CuNi alloys from oxidation although its recrystallisation texture, (110), is not suitable for coated conductors. (orig.)

  10. Double coating protection of Nd–Fe–B magnets: Intergranular phosphating treatment and copper plating

    International Nuclear Information System (INIS)

    Zheng, Jingwu; Chen, Haibo; Qiao, Liang; Lin, Min; Jiang, Liqiang; Che, Shenglei; Hu, Yangwu

    2014-01-01

    In this work, a double coating protection technique of phosphating treatment and copper plating was made to improve the corrosion resistance of sintered Nd–Fe–B magnets. In other words, the intergranular region of sintered Nd–Fe–B is allowed to generate passive phosphate conversion coating through phosphating treatment, followed by the copper coating on the surface of sintered Nd–Fe–B. The morphology and corrosion resistance of the phosphated sintered Nd–Fe–B were observed using SEM and electrochemical method respectively. The phosphate conversion coating was formed more preferably on the intergranular region of sintered Nd–Fe–B than on the main crystal region; just after a short time of phosphating treatment, the intergranular region of sintered Nd–Fe–B has been covered by the phosphate conversion coating and the corrosion resistance is significantly improved. With the synergistic protection of the intergranular phosphorization and the followed copper electrodeposition, the corrosion resistance of the sintered Nd–Fe–B is significantly better than that with a single phosphate film or single plating protection. - Highlights: • We combined intergranular phosphating and copper plating to protect Nd–Fe–B. • The phosphate conversion coating was formed preferably on the intergranular region. • The phosphating coating can obviously improve the corrosion resistance of Nd–Fe–B. • The corrosion resistance of Nd–Fe–B was improved by double coating protection

  11. Double coating protection of Nd–Fe–B magnets: Intergranular phosphating treatment and copper plating

    Energy Technology Data Exchange (ETDEWEB)

    Zheng, Jingwu; Chen, Haibo; Qiao, Liang [College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014 (China); Lin, Min [Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Material Technology and Engineering Chinese Academy of Science, Ningbo 315201 (China); Jiang, Liqiang; Che, Shenglei [College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014 (China); Hu, Yangwu, E-mail: 346648086@qq.com [College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310014 (China); Wenzhou Institute of Industry and Science, Wenzhou 325000 (China)

    2014-12-15

    In this work, a double coating protection technique of phosphating treatment and copper plating was made to improve the corrosion resistance of sintered Nd–Fe–B magnets. In other words, the intergranular region of sintered Nd–Fe–B is allowed to generate passive phosphate conversion coating through phosphating treatment, followed by the copper coating on the surface of sintered Nd–Fe–B. The morphology and corrosion resistance of the phosphated sintered Nd–Fe–B were observed using SEM and electrochemical method respectively. The phosphate conversion coating was formed more preferably on the intergranular region of sintered Nd–Fe–B than on the main crystal region; just after a short time of phosphating treatment, the intergranular region of sintered Nd–Fe–B has been covered by the phosphate conversion coating and the corrosion resistance is significantly improved. With the synergistic protection of the intergranular phosphorization and the followed copper electrodeposition, the corrosion resistance of the sintered Nd–Fe–B is significantly better than that with a single phosphate film or single plating protection. - Highlights: • We combined intergranular phosphating and copper plating to protect Nd–Fe–B. • The phosphate conversion coating was formed preferably on the intergranular region. • The phosphating coating can obviously improve the corrosion resistance of Nd–Fe–B. • The corrosion resistance of Nd–Fe–B was improved by double coating protection.

  12. Acibenzolar-S-methyl induces lettuce resistance against ...

    African Journals Online (AJOL)

    ... contributing to the enhancement of plant resistance. The effect was comparable with copper treatment. As a marker of resistance, PR protein activity chitinase showed remarkable increase, depending on decreasing bacterial growth in planta. Key words: Acibenzolar-S-methyl, induced resistance, Xanthomonas campestris ...

  13. NID Copper Sample Analysis

    Energy Technology Data Exchange (ETDEWEB)

    Kouzes, Richard T.; Zhu, Zihua

    2011-02-01

    The current focal point of the nuclear physics program at PNNL is the MAJORANA DEMONSTRATOR, and the follow-on Tonne-Scale experiment, a large array of ultra-low background high-purity germanium detectors, enriched in 76Ge, designed to search for zero-neutrino double-beta decay (0νββ). This experiment requires the use of germanium isotopically enriched in 76Ge. The DEMONSTRATOR will utilize 76Ge from Russia, but for the Tonne-Scale experiment it is hoped that an alternate technology under development at Nonlinear Ion Dynamics (NID) will be a viable, US-based, lower-cost source of separated material. Samples of separated material from NID require analysis to determine the isotopic distribution and impurities. The MAJORANA DEMONSTRATOR is a DOE and NSF funded project with a major science impact. DOE is funding NID through an SBIR grant for development of their separation technology for application to the Tonne-Scale experiment. The Environmental Molecular Sciences facility (EMSL), a DOE user facility at PNNL, has the required mass spectroscopy instruments for making these isotopic measurements that are essential to the quality assurance for the MAJORANA DEMONSTRATOR and for the development of the future separation technology required for the Tonne-Scale experiment. A sample of isotopically separated copper was provided by NID to PNNL for isotopic analysis as a test of the NID technology. The results of that analysis are reported here.

  14. NID Copper Sample Analysis

    International Nuclear Information System (INIS)

    Kouzes, Richard T.; Zhu, Zihua

    2011-01-01

    The current focal point of the nuclear physics program at PNNL is the MAJORANA DEMONSTRATOR, and the follow-on Tonne-Scale experiment, a large array of ultra-low background high-purity germanium detectors, enriched in 76 Ge, designed to search for zero-neutrino double-beta decay (0νββ). This experiment requires the use of germanium isotopically enriched in 76 Ge. The DEMONSTRATOR will utilize 76 Ge from Russia, but for the Tonne-Scale experiment it is hoped that an alternate technology under development at Nonlinear Ion Dynamics (NID) will be a viable, US-based, lower-cost source of separated material. Samples of separated material from NID require analysis to determine the isotopic distribution and impurities. The MAJORANA DEMONSTRATOR is a DOE and NSF funded project with a major science impact. DOE is funding NID through an SBIR grant for development of their separation technology for application to the Tonne-Scale experiment. The Environmental Molecular Sciences facility (EMSL), a DOE user facility at PNNL, has the required mass spectroscopy instruments for making these isotopic measurements that are essential to the quality assurance for the MAJORANA DEMONSTRATOR and for the development of the future separation technology required for the Tonne-Scale experiment. A sample of isotopically separated copper was provided by NID to PNNL for isotopic analysis as a test of the NID technology. The results of that analysis are reported here.

  15. Improving Beneficiation of Copper and Iron from Copper Slag by Modifying the Molten Copper Slag

    Directory of Open Access Journals (Sweden)

    Zhengqi Guo

    2016-04-01

    Full Text Available In the paper, a new technology was developed to improve the beneficiation of copper and iron components from copper slag, by modifying the molten slag to promote the mineralization of valuable minerals and to induce the growth of mineral grains. Various parameters, including binary basicity, dosage of compound additive, modification temperature, cooling rate and the end point temperature of slow cooling were investigated. Meanwhile, optical microscope, scanning electron microscope and energy dispersive spectrometer (SEM-EDS was employed to determine the mineralogy of the modified and unmodified slag, as well as to reveal the mechanisms of enhancing beneficiation. The results show that under the proper conditions, the copper grade of rougher copper concentrate was increased from 6.43% to 11.04%, iron recovery of magnetic separation was increased significantly from 32.40% to 63.26%, and other evaluation indexes were changed slightly, in comparison with unmodified copper slag. Moreover, matte and magnetite grains in the modified slag aggregated together and grew obviously to the mean size of over 50 μm, resulting in an improvement of beneficiation of copper and iron.

  16. Swelling of pure copper and copper alloys after high fluence irradiation in FFTF [Fast Flux Test Facility] at approximately 4500C

    International Nuclear Information System (INIS)

    Garner, F.A.; Brager, H.R.

    1986-03-01

    The swelling of pure copper and various copper-base alloys has been determined at 47.2 dpa after irradiation in FFTF-MOTA at ∼450 0 C. Data are also becoming available at 63.3 dpa. The alloys tend to fall into two broad categories, those that swell appreciably, sometimes with an S-shaped behavior, and those that resist swelling to very high neutron exposures. It appears that copper may have an intrinsic swelling rate of ∼1%/dpa that is often not reached due to its tendency toward saturation of swelling. The most swelling-resistant alloys examined to date are CuAl25, MZC and Cu-2.0Be

  17. Renal cortex copper concentration in acute copper poisoning in calves

    Directory of Open Access Journals (Sweden)

    Luis E. Fazzio

    2012-01-01

    Full Text Available The aim of this study was to estimate the diagnostic value of renal cortex copper (Cu concentration in clinical cases of acute copper poisoning (ACP. A total of 97 calves that died due to subcutaneous copper administration were compiled in eleven farms. At least, one necropsy was conducted on each farm and samples for complementary analysis were taken. The degree of autolysis in each necropsy was evaluated. The cases appeared on extensive grazing calf breeding and intensive feedlot farms, in calves of 60 to 200 kg body weight. Mortality varied from 0.86 to 6.96 %, on the farms studied. The first succumbed calf was found on the farms between 6 and 72 hours after the susbcutaneous Cu administration. As discrepancies regarding the reference value arose, the local value (19.9 parts per million was used, confirming the diagnosis of acute copper poisoning in 93% of the analyzed kidney samples. These results confirm the value of analysis of the cortical kidney Cu concentration for the diagnosis of acute copper poisoning.

  18. Copper metallurgy at the crossroads

    Directory of Open Access Journals (Sweden)

    Habashi F.

    2007-01-01

    Full Text Available Copper technology changed from the vertical to the horizontal furnace and from the roast reaction to converting towards the end of the last century. However, the horizontal furnace proved to be an inefficient and polluting reactor. As a result many attempts were made to replace it. In the past 50 years new successful melting processes were introduced on an industrial scale that were more energy efficient and less polluting. In addition, smelting and converting were conducted in a single reactor in which the concentrate was fed and the raw copper was produced. The standing problem in many countries, however, is marketing 3 tonnes of sulfuric acid per tonne of copper produced as well as emitting large amounts of excess SO2 in the atmosphere. Pressure hydrometallurgy offers the possibility of liberating the copper industry from SO2 problem. Heap leaching technology has become a gigantic operation. Combined with solvent extraction and electrowinning it contributes today to about 20% of copper production and is expected to grow. Pressure leaching offers the possibility of liberating the copper industry from SO2 problem. The technology is over hundred years old. It is applied for leaching a variety of ores and concentrates. Hydrothermal oxidation of sulfide concentrates has the enormous advantage of producing elemental sulfur, hence solving the SO2 and sulfuric acid problems found in smelters. Precipitation of metals such as nickel and cobalt under hydrothermal conditions has been used for over 50 years. It has the advantage of a compact plant but the disadvantage of producing ammonium sulfate as a co-product. In case of copper, however, precipitation takes place without the need of neutralizing the acid, which is a great advantage and could be an excellent substitute for electrowinning which is energy intensive and occupies extensive space. Recent advances in the engineering aspects of pressure equipment design open the door widely for increased

  19. Comparative Sequence Analysis of Multidrug-Resistant IncA/C Plasmids from Salmonella enterica.

    Science.gov (United States)

    Hoffmann, Maria; Pettengill, James B; Gonzalez-Escalona, Narjol; Miller, John; Ayers, Sherry L; Zhao, Shaohua; Allard, Marc W; McDermott, Patrick F; Brown, Eric W; Monday, Steven R

    2017-01-01

    Determinants of multidrug resistance (MDR) are often encoded on mobile elements, such as plasmids, transposons, and integrons, which have the potential to transfer among foodborne pathogens, as well as to other virulent pathogens, increasing the threats these traits pose to human and veterinary health. Our understanding of MDR among Salmonella has been limited by the lack of closed plasmid genomes for comparisons across resistance phenotypes, due to difficulties in effectively separating the DNA of these high-molecular weight, low-copy-number plasmids from chromosomal DNA. To resolve this problem, we demonstrate an efficient protocol for isolating, sequencing and closing IncA/C plasmids from Salmonella sp. using single molecule real-time sequencing on a Pacific Biosciences (Pacbio) RS II Sequencer. We obtained six Salmonella enterica isolates from poultry, representing six different serovars, each exhibiting the MDR-Ampc resistance profile. Salmonella plasmids were obtained using a modified mini preparation and transformed with Escherichia coli DH10Br. A Qiagen Large-Construct kit™ was used to recover highly concentrated and purified plasmid DNA that was sequenced using PacBio technology. These six closed IncA/C plasmids ranged in size from 104 to 191 kb and shared a stable, conserved backbone containing 98 core genes, with only six differences among those core genes. The plasmids encoded a number of antimicrobial resistance genes, including those for quaternary ammonium compounds and mercury. We then compared our six IncA/C plasmid sequences: first with 14 IncA/C plasmids derived from S. enterica available at the National Center for Biotechnology Information (NCBI), and then with an additional 38 IncA/C plasmids derived from different taxa. These comparisons allowed us to build an evolutionary picture of how antimicrobial resistance may be mediated by this common plasmid backbone. Our project provides detailed genetic information about resistance genes in

  20. Comparative Sequence Analysis of Multidrug-Resistant IncA/C Plasmids from Salmonella enterica

    Directory of Open Access Journals (Sweden)

    Maria Hoffmann

    2017-08-01

    Full Text Available Determinants of multidrug resistance (MDR are often encoded on mobile elements, such as plasmids, transposons, and integrons, which have the potential to transfer among foodborne pathogens, as well as to other virulent pathogens, increasing the threats these traits pose to human and veterinary health. Our understanding of MDR among Salmonella has been limited by the lack of closed plasmid genomes for comparisons across resistance phenotypes, due to difficulties in effectively separating the DNA of these high-molecular weight, low-copy-number plasmids from chromosomal DNA. To resolve this problem, we demonstrate an efficient protocol for isolating, sequencing and closing IncA/C plasmids from Salmonella sp. using single molecule real-time sequencing on a Pacific Biosciences (Pacbio RS II Sequencer. We obtained six Salmonella enterica isolates from poultry, representing six different serovars, each exhibiting the MDR-Ampc resistance profile. Salmonella plasmids were obtained using a modified mini preparation and transformed with Escherichia coli DH10Br. A Qiagen Large-Construct kit™ was used to recover highly concentrated and purified plasmid DNA that was sequenced using PacBio technology. These six closed IncA/C plasmids ranged in size from 104 to 191 kb and shared a stable, conserved backbone containing 98 core genes, with only six differences among those core genes. The plasmids encoded a number of antimicrobial resistance genes, including those for quaternary ammonium compounds and mercury. We then compared our six IncA/C plasmid sequences: first with 14 IncA/C plasmids derived from S. enterica available at the National Center for Biotechnology Information (NCBI, and then with an additional 38 IncA/C plasmids derived from different taxa. These comparisons allowed us to build an evolutionary picture of how antimicrobial resistance may be mediated by this common plasmid backbone. Our project provides detailed genetic information about

  1. The effects of impurities on the properties of OFP copper specified for the copper iron canister

    International Nuclear Information System (INIS)

    Bowyer, W.H.

    1999-09-01

    A brief literature study has addressed the effects of impurities on OF copper to which 50 ppm of phosphorus has been added. This copper is the candidate material for the corrosion resistant coating to be applied to the container under development by SKB for the disposal of high level nuclear waste. The levels of impurities expected in this grade of copper and the final use have controlled the focus of the work. It is concluded that the impurities of greatest importance in the context of the proposed application are sulphur, phosphorus, bismuth and lead. The addition of 50 ppm of phosphorus should ensure very low oxygen content in the copper such that, As, Ni, Mn, Cr, Fe, Sn, Zn, Si, Al, Sb and Cd present as impurities all remain in solution in the copper at all temperatures of interest. In this state they will exert no material effect on the fitness for purpose of the material. Sulphur is expected to be present in amounts exceeding the solubility limit such that it will occur as grain boundary films or particles. Such segregation can cause embrittlement and it will be more serious as grain size increases. There is no evidence to support the assertion that the phosphorus addition modifies the segregation behaviour of sulphur. There is evidence that sulphur will combine with V, Zr, or Ti, even when they are present at extremely low levels, but there is no indication of the likely effects of these combinations on the segregation behaviour or embrittling effects. There is clear evidence that when creep failure occurs by intergranular cracking, sulphur causes the creep strain to fracture to be reduced to less than 1%. The amount of sulphur required for this is very low (i.e. less than the amount permitted in the specification) and dependant on grain size. The transition from transgranular to intergranular failure in creep is influenced by temperature, stress, grain size, and composition. The addition of phosphorus increases the temperature at which the transition occurs

  2. The effects of impurities on the properties of OFP copper specified for the copper iron canister

    Energy Technology Data Exchange (ETDEWEB)

    Bowyer, W.H. [Meadow End Farm, Farnham (United Kingdom)

    1999-09-01

    A brief literature study has addressed the effects of impurities on OF copper to which 50 ppm of phosphorus has been added. This copper is the candidate material for the corrosion resistant coating to be applied to the container under development by SKB for the disposal of high level nuclear waste. The levels of impurities expected in this grade of copper and the final use have controlled the focus of the work. It is concluded that the impurities of greatest importance in the context of the proposed application are sulphur, phosphorus, bismuth and lead. The addition of 50 ppm of phosphorus should ensure very low oxygen content in the copper such that, As, Ni, Mn, Cr, Fe, Sn, Zn, Si, Al, Sb and Cd present as impurities all remain in solution in the copper at all temperatures of interest. In this state they will exert no material effect on the fitness for purpose of the material. Sulphur is expected to be present in amounts exceeding the solubility limit such that it will occur as grain boundary films or particles. Such segregation can cause embrittlement and it will be more serious as grain size increases. There is no evidence to support the assertion that the phosphorus addition modifies the segregation behaviour of sulphur. There is evidence that sulphur will combine with V, Zr, or Ti, even when they are present at extremely low levels, but there is no indication of the likely effects of these combinations on the segregation behaviour or embrittling effects. There is clear evidence that when creep failure occurs by intergranular cracking, sulphur causes the creep strain to fracture to be reduced to less than 1%. The amount of sulphur required for this is very low (i.e. less than the amount permitted in the specification) and dependant on grain size. The transition from transgranular to intergranular failure in creep is influenced by temperature, stress, grain size, and composition. The addition of phosphorus increases the temperature at which the transition occurs

  3. Electrical resistivity measurements in superconducting ceramics

    International Nuclear Information System (INIS)

    Muccillo, R.; Bressiani, A.H.A.; Muccillo, E.N.S.; Bressiani, J.C.

    1988-01-01

    Electrical resistivity measurements have been done in (Y, Ba, Cu, O) - and (Y, A1, Ba, Cu, O) - based superconducting ceramics. The sintered specimens were prepared by applying gold electrodes and winding on the non-metalized part with a copper strip to be immersed in liquid nitrogen for cooling. The resistivity measurements have been done by the four-probe method. A copper-constantan or chromel-alumel thermocouple inserted between the specimen and the copper cold finger has been used for the determination of the critical temperature T c . Details of the experimental set-up and resistivity versus temperature plots in the LNT-RT range for the superconducting ceramics are the major contributions of this communication. (author) [pt

  4. Electrical resistivity measurements in superconducting ceramics

    International Nuclear Information System (INIS)

    Muccillo, R.; Bressiani, A.H.A.; Muccillo, E.N.S.; Bressian, J.C.

    1988-01-01

    Electrical resistivity measurements have been done in (Y,Ba,Cu,O)- and (Y,Al,Ba,Cu,O)-based superconducting ceramics. The sintered specimens were prepared by applying gold electrodes and winding on the non-metalized part with a copper strip to be immersed in liquid nitrogen for cooling. The resistivity measurements have been done by the four-probe method. A copper constantan or chromel-alumel thermocouple inserted between the specimen and the copper cold finger has been used for the determination of the critical temperature T c . Details of the experimental set-up and resistivity versus temperature plots in the LNT-RT range for the superconducting ceramics are the major contributions of this communication. (author) [pt

  5. Investigation of copper nuclei

    International Nuclear Information System (INIS)

    Delfini, M.G.

    1983-01-01

    An extensive study has been performed on copper isotopes in the mass region A=63-66. The results of a precise measurement are presented on the properties of levels of 64 Cu and 66 Cu. They were obtained by bombarding the 63 Cu and 65 Cu nuclei with neutrons. The gamma spectra collected after capture of thermal, 2-keV, 24-keV neutrons have been analysed and combined to give a rather extensive set of precise level energies and gamma transition strengths. From the angular distribution of the gamma rays it is possible to obtain information concerning the angular momentum J of several low-lying states. The level schemes derived from such measurements have been used as a test for calculations in the framework of the shell model. The spectral distributions of eigenstates in 64 Cu for different configuration spaces are presented and discussed. In this study the relative importance of configurations with n holes in the 1f7/2 shell with n up to 16, are investigated. It is found that the results strongly depend on the values of the single-particle energies. The results of the spectral-distribution method were utilized for shell-model calculations. From the information obtained from the spectral analysis it was decided to adopt a configuration space which includes up to one hole in the 1f7/2 shell and up to two particles in the 1g9/2 shell. Further, restrictions on seniority and on the coupling of the two particles in the 1g9/2 orbit have been applied and their effects have been studied. It is found that the calculated excitation energies reproduce the measured values in a satisfactory way, but that some of the electromagnetic properties are less well in agreement with experimental data. (Auth.)

  6. LIGNOCELLULOSE NANOCOMPOSITE CONTAINING COPPER SULFIDE

    Directory of Open Access Journals (Sweden)

    Sanchi Nenkova

    2011-04-01

    Full Text Available Copper sulfide-containing lignocellulose nanocomposites with improved electroconductivity were obtained. Two methods for preparing the copper sulfide lignocellulose nanocomposites were developed. An optimization of the parameters for obtaining of the nanocomposites with respect to obtaining improved electroconductivity, economy, and lower quantities and concentration of copper and sulfur ions in waste waters was conducted. The mechanisms and schemes of delaying and subsequent connection of copper sulfides in the lignocellulosic matrix were investigated. The modification with a system of 2 components: cupric sulfate pentahydrate (CuSO4. 5H2O and sodium thiosulfate pentahydrate (Na2S2O3.5H2O for wood fibers is preferred. Optimal parameters were established for the process: 40 % of the reduction system; hydromodule M=1:6; and ratio of cupric sulfate pentahydrate:sodium thiosulfate pentahydrate = 1:2. The coordinative connection of copper ions with oxygen atoms of cellulose OH groups and aromatic nucleus in lignin macromolecule was observed.

  7. Current trends in copper theft prevention

    Energy Technology Data Exchange (ETDEWEB)

    Mastrofrancesco, A. [Electrical Safety Authority, ON (Canada)

    2009-07-01

    Copper is used in electrical wiring, water and gas piping, currency, and in household items. An increase in the price and demand for copper has made copper theft a profitable venture for some thieves. Copper consumed in North America is typically supplied by recycling. Scrap dealers may pay near-market prices for pure copper wires. However, copper theft poses a serious threat to the safety of utility workers and the public. Power outages caused by copper theft are now affecting grid reliability. This paper examined technologies and techniques used to prevent copper theft as part of a security strategy for utilities. Attempts to steal copper can leave utility substations unsecured and accessible to children. The theft of neutral grounds will cause the local distribution company (LDC) to malfunction and may cause power surges in homes as well as appliance fires. Utilities are now looking at using a hybrid steel and copper alternative to prevent copper theft. Asset identification techniques are also being used to identify the original owners of the copper and more easily prosecute thieves. Automated monitoring techniques are also being used to increase substation security. Utilities are also partnering with law enforcement agencies and pressuring governments to require scrap dealers to record who they buy from. It was concluded that strategies to prevent copper theft should be considered as part of an overall security strategy for utilities. tabs., figs.

  8. Removal of Copper by Eichhornia crassipes and the Characterization of Associated Bacteria of the Rhizosphere System

    Directory of Open Access Journals (Sweden)

    Raisa Kabeer

    2014-06-01

    Full Text Available Excess doses of trace element contamination make conventional water treatment methods less effective and more expensive, where in alternative biotechnological applications open up new opportunities with their reduced cost and lesser impacts to the environment. In the present investigation, effectiveness of aquatic macrophyte Eichhornia crassipes was tested for the removal of copper in laboratory conditions. Water samples were collected from macrophytes natural habitat and water tubs used for growing E. crassipes and analysed along with plant tissues for Cu content. The work also characterized the associated microbiota of the rhizosphere system of the E. crassipes as well as the wetland system of its occurrence. Copper concentration of the wetland water samples ranged from 0.009 to 0.03ppm. Six bacterial genera (Acinetobacter, Alcaligenes, Bacillus, Kurthia, Listeria and Chromobacterium were represented in rhizosphere of E.crassipes and 4 bacterial genera (Acinetobacter, Bacillus, Listeria and Chromobacterium were recorded in wetland water samples. Copper resistance studies of the bacterial isolates showed that out of 26 isolates from rhizosphere and 19 strains from water samples,12 of them showed low resistance (80% of copper during 15 days experiment. Copper accumulation was found to be high in the root followed by leaf and petiole. Results of the present study concluded that E. crassipes is an efficient plant for the removal of copper.

  9. Laser cladding of stainless steel with a copper-silver alloy to generate surfaces of high antimicrobial activity

    Science.gov (United States)

    Hans, Michael; Támara, Juan Carlos; Mathews, Salima; Bax, Benjamin; Hegetschweiler, Andreas; Kautenburger, Ralf; Solioz, Marc; Mücklich, Frank

    2014-11-01

    Copper and silver are used as antimicrobial agents in the healthcare sector in an effort to curb infections caused by bacteria resistant to multiple antibiotics. While the bactericidal potential of copper and silver alone are well documented, not much is known about the antimicrobial properties of copper-silver alloys. This study focuses on the antibacterial activity and material aspects of a copper-silver model alloy with 10 wt% Ag. The alloy was generated as a coating with controlled intermixing of copper and silver on stainless steel by a laser cladding process. The microstructure of the clad was found to be two-phased and in thermal equilibrium with minor Cu2O inclusions. Ion release and killing of Escherichia coli under wet conditions were assessed with the alloy, pure silver, pure copper and stainless steel. It was found that the copper-silver alloy, compared to the pure elements, exhibited enhanced killing of E. coli, which correlated with an up to 28-fold increased release of copper ions. The results show that laser cladding with copper and silver allows the generation of surfaces with enhanced antimicrobial properties. The process is particularly attractive since it can be applied to existing surfaces.

  10. Mechanochemical reduction of copper sulfide

    DEFF Research Database (Denmark)

    Balaz, P.; Takacs, L.; Jiang, Jianzhong

    2002-01-01

    The mechanochemical reduction of copper sulfide with iron was induced in a Fritsch P-6 planetary mill, using WC vial filled with argon and WC balls. Samples milled for specific intervals were analyzed by XRD and Mossbauer spectroscopy. Most of the reaction takes place during the first 10 min...... of milling and only FeS and Cu are found after 60 min. The main chemical process is accompanied by phase transformations of the sulfide phases as a result of milling. Djurleite partially transformed to chalcocite and a tetragonal copper sulfide phase before reduction. The cubic modification of FeS was formed...... first, transforming to hexagonal during the later stages of the process. The formation of off-stoichiometric phases and the release of some elemental sulfur by copper sulfide are also probable....

  11. Radiation effects limits on copper in superconducting magnets

    International Nuclear Information System (INIS)

    Guinan, M.W.

    1984-01-01

    The determination of the response of copper stabilizers to neutron irradiation in fusion reactor superconducting magnets requires information in four areas. (1) Neutron flux and spectrum determination are a major factor in the accuracy with which stabilizer response can be predicted. Since magnet stability depends on the weakest link, calculations must be made in sufficient detail to fully account for steep flux gradients and local pertubations from penetrations. (2) Resistivity changes at zero field in magnet spectra are generally calculated from the damage energy cross-section or the equivalent displacement (dpa) rate. (3) Resistivity changes at field for conceptual designs are generally determined from the changes predicted at zero field by the use of a Kohler plot. The cyclic irradiation and annealing, expected to be characteristic of fusion reactor magnet operation, is presently the largest source of uncertainty in determining the limits of neutron exposure for copper stabilizers. Applications of our current understanding of the limits of copper stabilizers in fusion reactor designs are explored in two examples. Recommendations for future additions to the data base are discussed

  12. Biliary copper excretion by hepatocyte lysosomes in the rat. Major excretory pathway in experimental copper overload

    International Nuclear Information System (INIS)

    Gross, J.B. Jr.; Myers, B.M.; Kost, L.J.; Kuntz, S.M.; LaRusso, N.F.

    1989-01-01

    We investigated the hypothesis that lysosomes are the main source of biliary copper in conditions of hepatic copper overload. We used a rat model of oral copper loading and studied the relationship between the biliary output of copper and lysosomal hydrolases. Male Sprague-Dawley rats were given tap water with or without 0.125% copper acetate for up to 36 wk. Copper loading produced a 23-fold increase in the hepatic copper concentration and a 30-65% increase in hepatic lysosomal enzyme activity. Acid phosphatase histochemistry showed that copper-loaded livers contained an increased number of hepatocyte lysosomes; increased copper concentration of these organelles was confirmed directly by both x ray microanalysis and tissue fractionation. The copper-loaded rats showed a 16-fold increase in biliary copper output and a 50-300% increase in biliary lysosomal enzyme output. In the basal state, excretory profiles over time were similar for biliary outputs of lysosomal enzymes and copper in the copper-loaded animals but not in controls. After pharmacologic stimulation of lysosomal exocytosis, biliary outputs of copper and lysosomal hydrolases in the copper-loaded animals remained coupled: injection of colchicine or vinblastine produced an acute rise in the biliary output of both lysosomal enzymes and copper to 150-250% of baseline rates. After these same drugs, control animals showed only the expected increase in lysosomal enzyme output without a corresponding increase in copper output. We conclude that the hepatocyte responds to an increased copper load by sequestering excess copper in an increased number of lysosomes that then empty their contents directly into bile. The results provide direct evidence that exocytosis of lysosomal contents into biliary canaliculi is the major mechanism for biliary copper excretion in hepatic copper overload

  13. Figurines in Pietrele: Copper Age ideology

    Directory of Open Access Journals (Sweden)

    Svend Hansen

    2011-12-01

    Full Text Available Major trends in figurine production of the copper age settlement of Pietrele (Romania are discussed. The bone figurines are seen as an ideological innovation of the Early Copper Age system in the Eastern Balkans.

  14. Copper tolerance and virulence in bacteria

    Science.gov (United States)

    Ladomersky, Erik; Petris, Michael J.

    2015-01-01

    Copper (Cu) is an essential trace element for all aerobic organisms. It functions as a cofactor in enzymes that catalyze a wide variety of redox reactions due to its ability to cycle between two oxidation states, Cu(I) and Cu(II). This same redox property of copper has the potential to cause toxicity if copper homeostasis is not maintained. Studies suggest that the toxic properties of copper are harnessed by the innate immune system of the host to kill bacteria. To counter such defenses, bacteria rely on copper tolerance genes for virulence within the host. These discoveries suggest bacterial copper intoxication is a component of host nutritional immunity, thus expanding our knowledge of the roles of copper in biology. This review summarizes our current understanding of copper tolerance in bacteria, and the extent to which these pathways contribute to bacterial virulence within the host. PMID:25652326

  15. Plasmid-mediated AmpC-type beta-lactamase isolated from Klebsiella pneumoniae confers resistance to broad-spectrum beta-lactams, including moxalactam.

    Science.gov (United States)

    Horii, T; Arakawa, Y; Ohta, M; Ichiyama, S; Wacharotayankun, R; Kato, N

    1993-01-01

    Klebsiella pneumoniae NU2936 was isolated from a patient and was found to produce a plasmid-encoded beta-lactamase (MOX-1) which conferred resistance to broad spectrum beta-lactams, including moxalactam, flomoxef, ceftizoxime, cefotaxime, and ceftazidime. Resistance could be transferred from K. pneumoniae NU2936 to Escherichia coli CSH2 by conjugation with a transfer frequency of 5 x 10(-7). The structural gene of MOX-1 (blaMOX-1) was cloned and expressed in E. coli HB101. The MIC of moxalactam for E. coli HB101 producing MOX-1 was > 512 micrograms/ml. The apparent molecular mass and pI of this enzyme were calculated to be 38 kDa and 8.9, respectively. Hg2+ and Cu2+ failed to block enzyme activity, and the presence of EDTA in the reaction buffer did not reduce the enzyme activity. However, clavulanate and cloxacillin, serine beta-lactamase inhibitors, inhibited the enzyme activity competitively (Kis = 5.60 and 0.35 microM, respectively). The kinetic study of MOX-1 suggested that it effectively hydrolyzed broad-spectrum beta-lactams. A hybridization study confirmed that blaMOX-1 is encoded on a large resident plasmid (pRMOX1; 180 kb) of strain NU2936. By deletion analysis, the functional region was localized within a 1.2-kb region of the plasmid. By amino acid sequencing, 18 of 33 amino acid residues at the N terminus of MOX-1 were found to be identical to those of Pseudomonas aeruginosa AmpC. These findings suggest that MOX-1 is a plasmid-mediated AmpC-type beta-lactamase that provides enteric bacteria resistance to broad-spectrum beta-lactams, including moxalactam. Images PMID:8517725

  16. Electric and electrochemical properties of surface films formed on copper in the presence of bicarbonate anions

    International Nuclear Information System (INIS)

    Sirkiae, P.; Saario, T.; Maekelae, K.; Laitinen, T.; Bojinov, M.

    1999-01-01

    Copper is used as an outer shield of cast iron canisters planned for storage of spent nuclear fuel. The copper shield is responsible for the corrosion protection of the canister. The aim of the present work was to study the influence of bicarbonate (HCO 3 - ) anions on the stability of the copper oxide film. The work consists of a brief literature survey and an experimental part, in which voltammetry, electrochemical impedance spectroscopy and dc resistance measurements via the Contact Electric Resistance (CER) technique were used. The studies reported in the literature indicated that HCO 3 - ions increase the solubility of copper in the stability region of Cu(II). Thus they render the oxide film formed on copper susceptible to local damage and to localised corrosion at high potentials. Unfortunately, despite the great importance of bicarbonates in copper corrosion, most of the environments used in the electrochemical and corrosion studies are not comparable with repository conditions. In the existing studies either the bicarbonate concentrations or pH of the solutions were too high. In addition, no such studies were available, in which not only the effect of carbonate ions, but also possible synergetic effects of them with other aggressive ions would have been clarified. The voltammetric results of the experimental part of this work point to a bilayer structure of the anodic film on copper in neutral solutions containing HCO 3 - ions. The transport of ionic defects through a thin continuous p-type semiconductor layer was concluded to be the rate limiting step of the anodic oxidation of copper in the stability region of monovalent copper and in the mixed oxide (Cu(I)/Cu(II) oxide) region. Films formed in the divalent copper region did not show well-pronounced semiconductor behaviour. Substantial evidence was found in the voltammetric, CER and impedance results for the increased defectiveness of the anodic film in the Cu(II) region. The oxidation rate of copper in

  17. Electric and electrochemical properties of surface films formed on copper in the presence of bicarbonate anions

    Energy Technology Data Exchange (ETDEWEB)

    Sirkiae, P.; Saario, T.; Maekelae, K.; Laitinen, T.; Bojinov, M. [VTT Manufacturing Technology, Espoo (Finland)

    1999-11-01

    Copper is used as an outer shield of cast iron canisters planned for storage of spent nuclear fuel. The copper shield is responsible for the corrosion protection of the canister. The aim of the present work was to study the influence of bicarbonate (HCO{sub 3}{sup -}) anions on the stability of the copper oxide film. The work consists of a brief literature survey and an experimental part, in which voltammetry, electrochemical impedance spectroscopy and dc resistance measurements via the Contact Electric Resistance (CER) technique were used. The studies reported in the literature indicated that HCO{sub 3}{sup -} ions increase the solubility of copper in the stability region of Cu(II). Thus they render the oxide film formed on copper susceptible to local damage and to localised corrosion at high potentials. Unfortunately, despite the great importance of bicarbonates in copper corrosion, most of the environments used in the electrochemical and corrosion studies are not comparable with repository conditions. In the existing studies either the bicarbonate concentrations or pH of the solutions were too high. In addition, no such studies were available, in which not only the effect of carbonate ions, but also possible synergetic effects of them with other aggressive ions would have been clarified. The voltammetric results of the experimental part of this work point to a bilayer structure of the anodic film on copper in neutral solutions containing HCO{sub 3}{sup -}ions. The transport of ionic defects through a thin continuous p-type semiconductor layer was concluded to be the rate limiting step of the anodic oxidation of copper in the stability region of monovalent copper and in the mixed oxide (Cu(I)/Cu(II) oxide) region. Films formed in the divalent copper region did not show well-pronounced semiconductor behaviour. Substantial evidence was found in the voltammetric, CER and impedance results for the increased defectiveness of the anodic film in the Cu(II) region. The

  18. Influence of sulfide concentration on the corrosion behavior of pure copper in synthetic seawater

    International Nuclear Information System (INIS)

    Taniguchi, Naoki; Kawasaki, Manabu

    2008-01-01

    Corrosion rate and stress corrosion cracking (SCC) behavior of pure copper under anaerobic conditions were studied by immersion tests and slow strain rate tests (SSRT) in synthetic seawater containing Na 2 S. The corrosion rate was increased with sulfide concentration both in simple saline solution and in bentnite-sand mixture. The results of SSRT showed that copper was susceptible to intergranular attack; selective dissolution at lower sulfide concentration (less than 0.005 M) and SCC at higher sulfide concentration (0.01 M). It was expected that if the sulfide concentration in groundwater is less than 0.001 M, pure copper is possible to exhibit superior corrosion resistance under anaerobic condition evident by very low corrosion rates and immunity to SCC. In such a low sulfide environment, copper overpack has the potential to achieve super-long lifetimes exceeding several tens of thousands years according to long-term simulations of corrosion based on diffusion of sulfide in buffer material

  19. Effect of Sulfide Concentration on Copper Corrosion in Anoxic Chloride-Containing Solutions

    Science.gov (United States)

    Kong, Decheng; Dong, Chaofang; Xu, Aoni; Man, Cheng; He, Chang; Li, Xiaogang

    2017-04-01

    The structure and property of passive film on copper are strongly dependent on the sulfide concentration; based on this, a series of electrochemical methods were applied to investigate the effect of sulfide concentration on copper corrosion in anaerobic chloride-containing solutions. The cyclic voltammetry and x-ray photoelectron spectroscopy analysis demonstrated that the corrosion products formed on copper in anaerobic sulfide solutions comprise Cu2S and CuS. And the corrosion resistance of copper decreased with increasing sulfide concentration and faster sulfide addition, owing to the various structures of the passive films observed by the atomic force microscope and scanning electron microscope. A p-type semiconductor character was obtained under all experimental conditions, and the defect concentration, which had a magnitude of 1022-1023 cm-3, increased with increasing sulfide concentration, resulting in a higher rate of both film growth and dissolution.

  20. Human copper transporter 2 is localized in late endosomes and lysosomes and facilitates cellular copper uptake

    NARCIS (Netherlands)

    Berghe, van den P.V.E; Folmer, D.E.; Malingré, H.E.M.; Beurden, van E.; Klomp, A.E.M.; Sluis, van de B.; Merkx, M.; Berger, R.J.; Klomp, L.W.J.

    2007-01-01

    High-affinity cellular copper uptake is mediated by the CTR (copper transporter) 1 family of proteins. The highly homologous hCTR (human CTR) 2 protein has been identified, but its function in copper uptake is currently unknown. To characterize the role of hCTR2 in copper homoeostasis,

  1. Copper nitrate redispersion to arrive at highly active silica-supported copper catalysts

    NARCIS (Netherlands)

    Munnik, P.|info:eu-repo/dai/nl/328228524; Wolters, M.|info:eu-repo/dai/nl/304829560; Gabrielsson, A.; Pollington, S.D.; Headdock, G.; Bitter, J.H.|info:eu-repo/dai/nl/160581435; de Jongh, P.E.|info:eu-repo/dai/nl/186125372; de Jong, K.P.|info:eu-repo/dai/nl/06885580X

    2011-01-01

    In order to obtain copper catalysts with high dispersions at high copper loadings, the gas flow rate and gas composition was varied during calcination of silica gel impregnated with copper nitrate to a loading of 18 wt % of copper. Analysis by X-ray diffraction (XRD), N2O chemisorption, and

  2. Copper and Anesthesia: Clinical Relevance and Management of Copper Related Disorders

    OpenAIRE

    Langley, Adrian; Dameron, Charles T.

    2013-01-01

    Recent research has implicated abnormal copper homeostasis in the underlying pathophysiology of several clinically important disorders, some of which may be encountered by the anesthetist in daily clinical practice. The purpose of this narrative review is to summarize the physiology and pharmacology of copper, the clinical implications of abnormal copper metabolism, and the subsequent influence of altered copper homeostasis on anesthetic management.

  3. 21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). 73.1125 Section 73.1125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color...

  4. 21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). 73.2125 Section 73.2125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and...

  5. Degradation of graphene coated copper in simulated proton exchange membrane fuel cell environment: Electrochemical impedance spectroscopy study

    Science.gov (United States)

    Ren, Y. J.; Anisur, M. R.; Qiu, W.; He, J. J.; Al-Saadi, S.; Singh Raman, R. K.

    2017-09-01

    Metallic materials are most suitable for bipolar plates of proton exchange membrane fuel cell (PEMFC) because they possess the required mechanical strength, durability, gas impermeability, acceptable cost and are suitable for mass production. However, metallic bipolar plates are prone to corrosion or they can passivate under PEMFC environment and interrupt the fuel cell operation. Therefore, it is highly attractive to develop corrosion resistance coating that is also highly conductive. Graphene fits these criteria. Graphene coating is developed on copper by chemical vapor deposition (CVD) with an aim to improving corrosion resistance of copper under PEMFC condition. The Raman Spectroscopy shows the graphene coating to be multilayered. The electrochemical degradation of graphene coated copper is investigated by electrochemical impedance spectroscopy (EIS) in 0.5 M H2SO4 solution at room temperature. After exposure to the electrolyte for up to 720 h, the charge transfer resistance (Rt) of the graphene coated copper is ∼3 times greater than that of the bare copper, indicating graphene coatings could improve the corrosion resistance of copper bipolar plates.

  6. Effect of copper content on the properties of electroless Ni–Cu–P coatings prepared on magnesium alloys

    International Nuclear Information System (INIS)

    Liu, Junjun; Wang, Xudong; Tian, Zhiyong; Yuan, Ming; Ma, Xijuan

    2015-01-01

    Highlights: • Electroless Ni–Cu–P coatings were obtained on ZK61M magnesium alloys. • The crystallinity and compactness increases with the increasing of copper content. • The introduction of copper element in the coatings contributes to the formation of passivation film. • The coatings with higher corrosion resistance were obtained from the solution with a higher CuSO 4 concentration. - Abstract: The Ni–Cu–P coatings were obtained by electroless plating method on ZK61M magnesium alloys. The effect of copper content on the properties of electroless Ni–Cu–P coatings on magnesium alloys was further studied. The coatings surface and cross-section morphologies were observed with scanning electron microscope. The crystal structure and corrosion resistance of Ni–Cu–P coatings were evaluated by X-ray diffractometer and electrochemical tests. The experimental results showed that the Ni–Cu–P coatings were uniform and compact, and the corrosion resistance of these coatings was superior to Ni–P coatings owing to the introduction of copper. The crystallinity and compactness of the Ni–Cu–P coatings gradually enhanced with the increasing of copper content in the coatings. The introduction of copper element in the Ni–Cu–P coatings contributes to the formation of passivation film. The Ni–Cu–P coatings with higher corrosion resistance were obtained from the solution with a higher CuSO 4 concentration.

  7. Refining processes in the copper casting technology

    OpenAIRE

    Rzadkosz, S.; Kranc, M.; Garbacz-Klempka, A.; Kozana, J.; Piękoś, M.

    2015-01-01

    The paper presents the analysis of technology of copper and alloyed copper destined for power engineering casts. The casts quality was assessed based on microstructure, chemical content analysis and strength properties tests. Characteristic deoxidising (Logas, Cup) and modifying (ODM2, Kupmod2) formulas were used for the copper where high electrical conductivity was required. Chosen examples of alloyed copper with varied Cr and Zr content were studied, and the optimal heat treatment parameter...

  8. 21 CFR 184.1261 - Copper sulfate.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Copper sulfate. 184.1261 Section 184.1261 Food and... Substances Affirmed as GRAS § 184.1261 Copper sulfate. (a) Copper sulfate (cupric sulfate, CuSO4·5H2O, CAS... the reaction of sulfuric acid with cupric oxide or with copper metal. (b) The ingredient must be of a...

  9. Cupriferous peat: embryonic copper ore

    Energy Technology Data Exchange (ETDEWEB)

    Fraser, D C

    1961-07-01

    A Canadian peat was found to contain up to 10% (dry weight) Cu, and a mechanism for Cu accumulation in peat was discussed. Wet chemical techniques and x-ray diffraction were utilized to identify Cu compounds. Copper was organically bound in peat as a chelate complex and did not occur as an oxide, sulfide, or as elemental Cu. Because of the low S content of peat the Cu was assumed to be bound to nitrogen or oxygen-containing components. Copper, having a greater affinity for N, tended to form the more stable Cu-N chelate. The element was concentrated as circulating cupriferous ground waters filtered through the peat.

  10. Tunable synthesis of copper nanotubes

    International Nuclear Information System (INIS)

    Kaniukov, E; Yakimchuk, D; Kozlovsky, A; Shlimas, D; Zdorovets, M; Kadyrzhanov, K

    2016-01-01

    Simple method of tunable synthesis of copper nanotubes based on template synthesis was developed. A comprehensive study of the structural, morphological and electrical characteristics of the obtained nanostructures was carried out. Characterization of structural features was made by methods of scanning electron microscopy, energy dispersive spectroscopy and X-ray diffractometry analysis. Evaluation of wall thickness is made by methods of gas permeability. Electrical conductivity of nanotubes was define in the study of their current-voltage characteristics. The possibility to control of copper nanotubes physical properties by variation of the deposition parameters was shown. (paper)

  11. Modeling pore corrosion in normally open gold- plated copper connectors.

    Energy Technology Data Exchange (ETDEWEB)

    Battaile, Corbett Chandler; Moffat, Harry K.; Sun, Amy Cha-Tien; Enos, David George; Serna, Lysle M.; Sorensen, Neil Robert

    2008-09-01

    The goal of this study is to model the electrical response of gold plated copper electrical contacts exposed to a mixed flowing gas stream consisting of air containing 10 ppb H{sub 2}S at 30 C and a relative humidity of 70%. This environment accelerates the attack normally observed in a light industrial environment (essentially a simplified version of the Battelle Class 2 environment). Corrosion rates were quantified by measuring the corrosion site density, size distribution, and the macroscopic electrical resistance of the aged surface as a function of exposure time. A pore corrosion numerical model was used to predict both the growth of copper sulfide corrosion product which blooms through defects in the gold layer and the resulting electrical contact resistance of the aged surface. Assumptions about the distribution of defects in the noble metal plating and the mechanism for how corrosion blooms affect electrical contact resistance were needed to complete the numerical model. Comparisons are made to the experimentally observed number density of corrosion sites, the size distribution of corrosion product blooms, and the cumulative probability distribution of the electrical contact resistance. Experimentally, the bloom site density increases as a function of time, whereas the bloom size distribution remains relatively independent of time. These two effects are included in the numerical model by adding a corrosion initiation probability proportional to the surface area along with a probability for bloom-growth extinction proportional to the corrosion product bloom volume. The cumulative probability distribution of electrical resistance becomes skewed as exposure time increases. While the electrical contact resistance increases as a function of time for a fraction of the bloom population, the median value remains relatively unchanged. In order to model this behavior, the resistance calculated for large blooms has been weighted more heavily.

  12. 21 CFR 73.2647 - Copper powder.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Copper powder. 73.2647 Section 73.2647 Food and... ADDITIVES EXEMPT FROM CERTIFICATION Cosmetics § 73.2647 Copper powder. (a) Identity and specifications. The color additive copper powder shall conform in identity and specifications to the requirements of § 73...

  13. High efficiency graphene coated copper based thermocells connected in series

    Science.gov (United States)

    Sindhuja, Mani; Indubala, Emayavaramban; Sudha, Venkatachalam; Harinipriya, Seshadri

    2018-04-01

    Conversion of low-grade waste heat into electricity had been studied employing single thermocell or flowcells so far. Graphene coated copper electrodes based thermocells connected in series displayed relatively high efficiency of thermal energy harvesting. The maximum power output of 49.2W/m2 for normalized cross sectional electrode area is obtained at 60ºC of inter electrode temperature difference. The relative carnot efficiency of 20.2% is obtained from the device. The importance of reducing the mass transfer and ion transfer resistance to improve the efficiency of the device is demonstrated. Degradation studies confirmed mild oxidation of copper foil due to corrosion caused by the electrolyte.

  14. High Efficiency Graphene Coated Copper Based Thermocells Connected in Series

    Directory of Open Access Journals (Sweden)

    Mani Sindhuja

    2018-04-01

    Full Text Available Conversion of low-grade waste heat into electricity had been studied employing single thermocell or flowcells so far. Graphene coated copper electrodes based thermocells connected in series displayed relatively high efficiency of thermal energy harvesting. The maximum power output of 49.2 W/m2 for normalized cross sectional electrode area is obtained at 60°C of inter electrode temperature difference. The relative carnot efficiency of 20.2% is obtained from the device. The importance of reducing the mass transfer and ion transfer resistance to improve the efficiency of the device is demonstrated. Degradation studies confirmed mild oxidation of copper foil due to corrosion caused by the electrolyte.

  15. ESD coating of copper with TiC and TiB2 based ceramic matrix composites

    Science.gov (United States)

    Talas, S.; Mertgenç, E.; Gökçe, B.

    2016-08-01

    In automotive industry, the spot welding is a general practice to join smaller sections of a car. This welding is specifically carried out in short time and in an elevated number with certain pressure applied on copper electrodes. In addition, copper electrodes are expected to endure against cyclic mechanical pressure and temperature that is released during the passage of the current. The deformation and oxidation behaviour of copper electrodes during service appear with increasing temperature of medium and they also need to be cleaned and cooled or replaced for the continuation of joining process. The coating of copper electrodes with ceramic matrix composites can provide alternative excellent high temperature strength and ensures both economic and efficient use of resources. This study shows that the ESD coating of copper electrodes with a continuous film of ceramic phase ensures an improved resistance to thermal effects during the service and the change in content of film may be critical for cyclic alloying.

  16. Effects of aluminum and copper chill on mechanical properties and microstructures of Cu-Zn-Al alloys with sand casting

    Science.gov (United States)

    Ardhyananta, Hosta; Wibisono, Alvian Toto; Ramadhani, Mavindra; Widyastuti, Farid, Muhammad; Gumilang, Muhammad Shena

    2018-04-01

    Cu-Zn-Al alloy is one type of brass, which has high strength and high corrosion resistant. It has been applied on ship propellers and marine equipment. In this research, the addition of aluminum (Al) with variation of 1, 2, 3, 4% aluminum to know the effect on mechanical properties and micro structure at casting process using a copper chill and without copper chill. This alloy is melted using furnace in 1100°C without holding. Then, the molten metal is poured into the mold with copper chill and without copper chill. The speciment of Cu-Zn-Al alloy were chracterized by using Optical Emission Spectroscopy (OES), Metallography Test, X-Ray Diffraction (XRD), Hardness Test of Rockwell B and Charpy Impact Test. The result is the addition of aluminum and the use of copper chill on the molds can reduce the grain size, increases the value of hardness and impact.

  17. Facile preparation of monodisperse, impurity-free, and antioxidation copper nanoparticles on a large scale for application in conductive ink.

    Science.gov (United States)

    Zhang, Yu; Zhu, Pengli; Li, Gang; Zhao, Tao; Fu, Xianzhu; Sun, Rong; Zhou, Feng; Wong, Ching-ping

    2014-01-08

    Monodisperse copper nanoparticles with high purity and antioxidation properties are synthesized quickly (only 5 min) on a large scale (multigram amounts) by a modified polyol process using slightly soluble Cu(OH)2 as the precursor, L-ascorbic acid as the reductant, and PEG-2000 as the protectant. The resulting copper nanoparticles have a size distribution of 135 ± 30 nm and do not suffer significant oxidation even after being stored for 30 days under ambient conditions. The copper nanoparticles can be well-dispersed in an oil-based ink, which can be silk-screen printed onto flexible substrates and then converted into conductive patterns after heat treatment. An optimal electrical resistivity of 15.8 μΩ cm is achieved, which is only 10 times larger than that of bulk copper. The synthesized copper nanoparticles could be considered as a cheap and effective material for printed electronics.

  18. Effect of copper addition and section thickness on the mechanical and physical properties of grey cast iron

    International Nuclear Information System (INIS)

    Malik, F.A.; Zahid, M.; Hassan, M.A.; Sheikh, M.A.; Alam, S.; Qazi, M.A.

    1995-01-01

    Copper is a graphitizer at the stage of solidification and it acts as antiferritizer during transformation cooling range. Due to this, copper additions to grey cast iron prevent at formation of free ferrite in heavy sections. It also reduces the chilling in thin sections, therefore uniform structure is imparted to grey iron by the copper addition. This gives the appropriate strength and hardness properties to grey iron. Thus copper addition gives certain advantages in relation to the machinability and wear resistance which are important for many engineering properties requires by high duty cast iron. The application of copper as allying element is acceptable due to its price and availability as compared to other alloying elements. (author)

  19. Yeast Starter as a Biotechnological Tool for Reducing Copper Content in Wine

    Directory of Open Access Journals (Sweden)

    Angela Capece

    2018-01-01

    Full Text Available Copper is widely used in agriculture as a traditional fungicide in organic farming to control downy mildew on grapes, consequently it is possible to find this metal during all stages of the vinification process. Low amounts of copper play a key role on the function of key cell enzymes, whereas excess quantities can exert amount-dependent cytotoxicity, resulting in general cellular damage. Nowadays the excessive copper ions in wines is removed by addition of adsorbents, but these additives can influence the sensory characteristics of wine, as well as detrimental to the health of consumers. It is well known that high concentrations of Cu2+ can be toxic to yeasts, inhibiting growth and activity, causing sluggish fermentation and reducing alcohol production. In this study, 47 S. cerevisiae strains were tested for copper tolerance by two different tests, growth on copper added medium and fermentative activity in copper added grape must. The results obtained by the two different tests were comparable and the high strain variability found was used to select four wild strains, possessing this characteristic at the highest (PP1-13 and A20 and the lowest level (MPR2-24 and A13. The selected strains were tested in synthetic and natural grape must fermentation for ability to reduce copper content in wine. The determination of copper content in wines and yeast cells revealed that at the lowest copper residual in wine corresponded the highest content in yeast cells, indicating a strong strain ability to reduce the copper content in wine. This effect was inversely correlated with strain copper resistance and the most powerful strain in copper reduction was the most sensitive strain, MPR2-24. This wild strain was finally tested as starter culture in cellar pilot scale fermentation in comparison to a commercial starter, confirming the behavior exhibited at lab scale. The use of this wild strain to complete the alcoholic fermentation and remove the copper from

  20. Measurements of copper corrosion in the LOT Project at the Aespoe Hard Rock Laboratory

    International Nuclear Information System (INIS)

    Rosborg, B.; Karnland, O.; Quirk, G.; Werme, L.

    2003-01-01

    Real-time monitoring, of corrosion by means of electrochemical noise and other electrochemical techniques may offer interesting possibilities to estimate the kind and degree of corrosion in a sample or component, and further visualize the corrosion resistance of pure copper in repository environments. As a pilot effort, three cylindrical copper electrodes for such measurements, each of about 100 cm 2 surface area, have been installed in a test parcel in the Aespoe Hard Rock Laboratory and electrochemical measurements using InterCorr's SmartCET system were initiated in May 2001. The first results from real-time monitoring of copper corrosion in the Aespoe HRL under actual repository environment conditions by means of linear polarisation resistance, harmonic distortion analysis and electrochemical noise techniques are presented, and compared with the results obtained from one of the retrieved test parcels. (authors)

  1. Copper nanoparticles in zeolite Y

    NARCIS (Netherlands)

    Seidel, A.; Loos, J.; Boddenberg, B.

    1999-01-01

    CuCl has been dispersed in the supercages of a Y-type zeolite by heating a mechanical salt/host mixture in vacuo. The occluded salt was subsequently reduced to copper metal in a hydrogen atmosphere. Virtually complete reduction of the salt is achieved at 460°C. Under the same conditions,

  2. Effects of copper on mitosis

    Energy Technology Data Exchange (ETDEWEB)

    Kostal, L

    1971-01-01

    The author deals with the effects of copper on mitosis. He found that a Cu concentration of 1 mg per liter is very toxic and strongly inhibits the course of mitosis in Vicia fabia. The effects of 0.5 mg and 0.25 mg Cu concentrations per liter were similar but a much weaker character.

  3. Copper complexes as chemical nucleases

    Indian Academy of Sciences (India)

    Unknown

    anticancer drug famotidine has been shown as a better catalyst than CuCl2 for sulfite ... Effect of addition of bis-chelate copper(II) complexes (dpq, •; phen, ; ..... Reproduction, Development & Genetics for their help in the DNA cleavage studies ...

  4. Copper, lead and zinc production

    International Nuclear Information System (INIS)

    Ayers, J.; Ternan, S.

    2001-01-01

    This chapter provides information on the by-products and residues generated during the production of copper, lead and zinc. The purpose of this chapter is to describe by-products and residues which are generated, how these may be avoided or minimised, and available options for the utilization and management of residues. (author)

  5. on THICKNESS OF COPPER (|) OXIDE

    African Journals Online (AJOL)

    2006-12-20

    Dec 20, 2006 ... known materials to be used as semiconductor devices. The oxide is. Observed to be an attractive starting material for the production of solar cells for low cost terrestrial conversion of solar energy to electricity. Copper (I) oxide is one Of the earliest known photovoltaic materials and the first in which the ...

  6. Lab Tracker and Copper Calculator

    Science.gov (United States)

    ... have to do with factors of asymmetric neurologic development, such as being right or left-handed. The copper is often seen most prominently in the basal ganglia, the area deep within the brain that coordinates movements. The face of the giant ...

  7. Crystallization of copper metaphosphate glass

    Science.gov (United States)

    Bae, Byeong-Soo; Weinberg, Michael C.

    1993-01-01

    The effect of the valence state of copper in copper metaphosphate glass on the crystallization behavior and glass transition temperature has been investigated. The crystallization of copper metaphosphate is initiated from the surface and its main crystalline phase is copper metaphosphate (Cu(PO)3),independent of the (Cu sup 2+)/(Cu(total)). However, the crystal morphology, the relative crystallization rates, and their temperature dependences are affected by the (Cu sup 2+)/(Cu (total)) ratio in the glass. On the other hand, the totally oxidized glass crystallizes from all over the surface. The relative crystallization rate of the reduced glass to the totally oxidized glass is large at low temperature, but small at high temperature. The glass transition temperature of the glass increases as the (Cu sup 2+)/(Cu(total)) ratio is raised. It is also found that the atmosphere used during heat treatment does not influence the crystallization of the reduced glass, except for the formation of a very thin CuO surface layer when heated in air.

  8. COPPER CORROSION AND SOLUBILITY RESEARCH

    Science.gov (United States)

    This poster provides a very cursory summary of TTEB in-house copper research experimental systems, and extramural research projects. The field studies summarized are the Indian Hill (OH) study of the use of orthophosphate for reducing cuprosolvency in a high alkalinity water, an...

  9. Spectroscopic studies of copper enzymes

    International Nuclear Information System (INIS)

    Dooley, D.M.; Moog, R.; Zumft, W.; Koenig, S.H.; Scott, R.A.; Cote, C.E.; McGuirl, M.

    1986-01-01

    Several spectroscopic methods, including absorption, circular dichroism (CD), magnetic CD (MCD), X-ray absorption, resonance Raman, EPR, NMR, and quasi-elastic light-scattering spectroscopy, have been used to probe the structures of copper-containing amine oxidases, nitrite reductase, and nitrous oxide reductase. The basic goals are to determine the copper site structure, electronic properties, and to generate structure-reactivity correlations. Collectively, the results on the amine oxidases permit a detailed model for the Cu(II) sites in these enzymes to be constructed that, in turn, rationalizes the ligand-binding chemistry. Resonance Raman spectra of the phenylhydrazine and 2,4-dinitrophenyl-hydrazine derivatives of bovine plasma amine oxidase and models for its organic cofactor, e.g. pyridoxal, methoxatin, are most consistent with methoxatin being the intrinsic cofactor. The structure of the Cu(I) forms of the amine oxidases have been investigated by X-ray absorption spectroscopy (XAS); the copper coordination geometry is significantly different in the oxidized and reduced forms. Some anomalous properties of the amine oxidases in solution are explicable in terms of their reversible aggregation, which the authors have characterized via light scattering. Nitrite and nitrous oxide reductases display several novel spectral properties. The data suggest that new types of copper sites are present

  10. Nickel–copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray

    International Nuclear Information System (INIS)

    Lee, Jong-Gun; Kim, Do-Yeon; Kang, Byungjun; Kim, Donghwan; Song, Hee-eun; Kim, Jooyoung; Jung, Woonsuk; Lee, Dukhaeng; Al-Deyab, Salem S.; James, Scott C.; Yoon, Sam S.

    2015-01-01

    High-performance electrodes are fabricated through supersonic spraying of nickel and copper particles. These electrodes yield low specific resistivities, comparable to electrodes produced by screen-printed silver paste and light-induced plating. The appeal of this fabrication method is the low cost of copper and large area scalability of supersonic spray-coating techniques. The copper and nickel electrode was fabricated in the open air without any pre- or post-treatment. The spray-coated copper–nickel electrode was characterized by optical microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction, and energy dispersive spectroscopy. Although both SEM and TEM images confirmed voids trapped between flattened particles in the fabricated electrode, this electrode’s resistivity was order 10 −6 Ω cm, which is comparable to the bulk value for pure copper

  11. Silane pre-treatments on copper and aluminium

    International Nuclear Information System (INIS)

    Deflorian, F.; Rossi, S.; Fedrizzi, L.

    2006-01-01

    A large part of aluminium products are coated with an organic layer in order to improve the corrosion resistance. Copper surfaces are also sometimes protected with an organic coating to improve the durability or the aesthetic properties. Examples of industrial applications are household appliances and heat exchanger components. For these applications it is not rare to have the industrial need to treat at the same time components made of aluminium and copper. In order to extend the service life of the organic coated copper a specific surface pre-treatment is often required. Nevertheless, probably because of the limited market of this application, no specific pre-treatments for copper are industrially developed, with the exception of cleaning procedures, but simply extensions of existing pre-treatments optimised for other metals (aluminium, zinc) are used. The application of silane pre-treatments as adhesion promoters for organic coated metals is remarkably increasing in the last decade, because silanes offer very good performance together with high environmental compatibility. The idea is therefore to try to develop a specific silane based pre-treatment for copper. The starting point is the existing silane products for aluminium, optimising the composition and the application conditions (concentration, temperature, pH of the bath, etc.) in order to develop a high performance copper alloy pre-treatment increasing the protective properties and the adhesion of a successively applied organic coating. Moreover these pre-treatments could be used for aluminium alloys too and therefore could be suggested for multi-metals components. The deposits were analysed using FTIR spectroscopy and optical and electron microscopic observations. A careful electrochemical characterisation, mainly by electrochemical impedance spectroscopy measurements (EIS) was carried out to highlight the presence of silane and to evaluate the performance of the different deposits. In order to study an

  12. A Study of Protection of Copper Alloys

    International Nuclear Information System (INIS)

    Kim, E. A.; Kim, S. H.; Kim, C. R.

    1974-01-01

    Volatile treatment of high capacity boiler water with hydrazine and ammonia is studied. Ammonia comes from the decomposition of excess hydrazine injected to treat dissolved oxygen. Ammonia is also injected for the control of pH. To find an effect of such ammonia on the copper alloy, the relations between pH and iron, and ammonia and copper are studied. Since the dependence of corrosion of iron on pH differs from that of copper, a range of pH was selected experimentally to minimize the corrosion rates of both copper and iron. Corrosion rates of various copper alloys are also compared

  13. Electrochemical remediation of copper contaminated clay soils

    Energy Technology Data Exchange (ETDEWEB)

    Korolev, V.A.; Babakina, O.A.; Mitojan, R.A. [Moscow State Univ. (Russian Federation)

    2001-07-01

    The study objective focused on electrochemical remediation copper polluted soils in the presence of adjuvant substances and conditions that are more effective for the treatment. Some of these substances were studied in different researches. Moreover, authors obtained a result of extraction copper rate higher than 90%. In this connection the following problems were set: - Influence organic and inorganic substances on copper mobility in soil under the DC current. - Moisture effect on copper migration in clay. - Electrochemical remediation soils different mineralogical composition. - A washing conditions contribution to electrochemical remediation of soil from copper. - Accuracy rating experimental dates. (orig.)

  14. Optimization of copper electroplating process applied for microfabrication on flexible polyethylene terephthalate substrate

    International Nuclear Information System (INIS)

    Le, Nguyen Ngan; Hue Phan, Thi Cam; Le, Anh Duy; Dung Dang, Thi My; Dang, Mau Chien

    2015-01-01

    Electroplating is an important step in microfabrication in order to increase thickness of undersized parts up to a few micrometers with a low-cost, fast method that is easy to carry out, especially for metals such as copper, nickel, and silver. This important step promotes the development of the fabrication technology of electronic devices on a flexible substrate, also known as flexible electronic devices. Nevertheless, this technology has some disadvantages such as low surface uniformity and high resistivity. In this paper, parameters of copper electroplating were studied, such as the ratio of copper (II) sulfate (CuSO_4) concentration to sulfuric acid (H_2SO_4) concentration and electroplating current density, in order to obtain low resistivity and high surface uniformity of the copper layer. Samples were characterized by scanning electron microscopy (SEM), four-point probe, and surface profiler. The results showed that the sample resistivity could be controlled from about 2.0 to about 3.5 μΩ · cm, and the lowest obtained resistivity was 1.899 μΩ · cm. In addition, surface uniformity of the electroplated copper layer was also acceptable. The thickness of the copper layer was about 10 μm with an error of about 0.5 μm. The most suitable conditions for the electroplating process were CuSO_4 concentration of 0.4 mol l"−"1, H_2SO_4 concentration of 1.0 mol l"−"1, and low electroplating current density of 10–20 mA cm"−"2. All experiments were performed on a flexible polyethylene terephthalate (PET) substrate. (paper)

  15. The Use of Copper Pesticides in Germany and the Search for Minimization and Replacement Strategies

    Directory of Open Access Journals (Sweden)

    Stefan Kuehne

    2017-02-01

    Full Text Available Copper pesticides used to control fungal and bacterial diseases such as grapes downy mildew (Plasmopara viticola, downy mildew of hops (Pseudoperonospora humili, apple scab (Venturia spp., fireblight (Erwinia amylovora and potato late blight (Phytophthora infestans, play an important role in plant protection. In a 2013 survey of copper application in Germany we found, that while the amounts of copper used per hectare in conventional grape (0.8 kg ha−1, hop (1.7 kg ha−1 and potato-farming (0.8 kg ha−1 were well below those used in organic farming (2.3, 2.6 and 1.4 kg ha−1, respectively, they were nearly identical to those used in apple growing (1.4 kg ha−1. Due to the smaller farming area, only 24% (26.5 tonnes of the total amount of copper was applied in organic farming compared to 76% (84.8 tonnes in conventional farming. Since 2001, the Federal Agency for Agriculture and Food (BLE promoted a copper research and minimization strategy which was funded with a total of C10.2 million. Our status quo analysis of research in this field shows that some progress is being made concerning alternative compounds, resistant varieties and decision support systems. However, it also shows that new approaches are not yet able to replace copper pesticides completely, especially in organic farming. In integrated pest management, copper preparations are important for the necessary active substance rotation and successful resistance management. The availability of such products is often essential for organic grapes, hops and fruit production and for extending the organic farming of these crops. We conclude that the complete elimination of copper pesticides is not yet practicable in organic farming as the production of several organic crops would become unprofitable and may lead to organic farmers reverting to conventional production. Several existing copper reduction strategies were, however, identified, and some, like modified forecast models adapted to

  16. Reactivity test between beryllium and copper

    International Nuclear Information System (INIS)

    Kawamura, H.; Kato, M.

    1995-01-01

    Beryllium has been expected for using as plasma facing material on ITER. And, copper alloy has been proposed as heat sink material behind plasma facing components. Therefore, both materials must be joined. However, the elementary process of reaction between beryllium and copper alloy does not clear in detail. For example, other authors reported that beryllium reacted with copper at high temperature, but it was not obvious about the generation of reaction products and increasing of the reaction layer. In the present work, from this point, for clarifying the elementary process of reaction between beryllium and copper, the out-of-pile compatibility tests were conducted with diffusion couples of beryllium and copper which were inserted in the capsule filled with high purity helium gas (6N). Annealing temperatures were 300, 400, 500, 600 and 700 degrees C, and annealing periods were 100, 300 and 1000h. Beryllium specimens were hot pressed beryllium, and copper specimens were OFC (Oxygen Free Copper)

  17. Differences in hepatic processing of dietary and intravenously administered copper in rats

    NARCIS (Netherlands)

    Kuipers, F; vandenBerg, GJ; Havinga, R; Vonk, RJ

    1997-01-01

    The biliary pathway represents the major excretory route for copper (Cu), It has been su red that glutathione (GSH) plays a role in this process, However, biliary secretion of endogenous Cu is unaffected in canalicular multispecific organic anion transporter (cmoat)/multi-drug resistance protein

  18. Copper economy in Chlamydomonas: Prioritized allocation and reallocation of copper to respiration vs. photosynthesis

    Science.gov (United States)

    Kropat, Janette; Gallaher, Sean D.; Urzica, Eugen I.; Nakamoto, Stacie S.; Strenkert, Daniela; Tottey, Stephen; Mason, Andrew Z.; Merchant, Sabeeha S.

    2015-01-01

    Inorganic elements, although required only in trace amounts, permit life and primary productivity because of their functions in catalysis. Every organism has a minimal requirement of each metal based on the intracellular abundance of proteins that use inorganic cofactors, but elemental sparing mechanisms can reduce this quota. A well-studied copper-sparing mechanism that operates in microalgae faced with copper deficiency is the replacement of the abundant copper protein plastocyanin with a heme-containing substitute, cytochrome (Cyt) c6. This switch, which is dependent on a copper-sensing transcription factor, copper response regulator 1 (CRR1), dramatically reduces the copper quota. We show here that in a situation of marginal copper availability, copper is preferentially allocated from plastocyanin, whose function is dispensable, to other more critical copper-dependent enzymes like Cyt oxidase and a ferroxidase. In the absence of an extracellular source, copper allocation to Cyt oxidase includes CRR1-dependent proteolysis of plastocyanin and quantitative recycling of the copper cofactor from plastocyanin to Cyt oxidase. Transcriptome profiling identifies a gene encoding a Zn-metalloprotease, as a candidate effecting copper recycling. One reason for the retention of genes encoding both plastocyanin and Cyt c6 in algal and cyanobacterial genomes might be because plastocyanin provides a competitive advantage in copper-depleted environments as a ready source of copper. PMID:25646490

  19. What is the Potential for More Copper Fabrication in Zambia?

    OpenAIRE

    World Bank

    2011-01-01

    The copper fabrication industry lies between: (1) the industry that produces copper (as a commodity metal from mined ores as well as from recycling), and (2) the users of copper in finished products such as electronic goods. Copper fabrication involves the manufacture of products such as copper wire, wire rod, low-voltage cable, and other copper based semi-manufactures. Copper is clearly a...

  20. Accumulation and hyperaccumulation of copper in plants

    Science.gov (United States)

    Adam, V.; Trnkova, L.; Huska, D.; Babula, P.; Kizek, R.

    2009-04-01

    Copper is natural component of our environment. Flow of copper(II) ions in the environment depends on solubility of compounds containing this metal. Mobile ion coming from soil and rocks due to volcanic activity, rains and others are then distributed to water. Bio-availability of copper is substantially lower than its concentration in the aquatic environment. Copper present in the water reacts with other compounds and creates a complex, not available for organisms. The availability of copper varies depending on the environment, but moving around within the range from 5 to 25 % of total copper. Thus copper is stored in the sediments and the rest is transported to the seas and oceans. It is common knowledge that copper is essential element for most living organisms. For this reason this element is actively accumulated in the tissues. The total quantity of copper in soil ranges from 2 to 250 mg / kg, the average concentration is 30 mg / kg. Certain activities related to agriculture (the use of fungicides), possibly with the metallurgical industry and mining, tend to increase the total quantity of copper in the soil. This amount of copper in the soil is a problem particularly for agricultural production of food. The lack of copper causes a decrease in revenue and reduction in quality of production. In Europe, shows the low level of copper in total 18 million hectares of farmland. To remedy this adverse situation is the increasing use of copper fertilizers in agricultural soils. It is known that copper compounds are used in plant protection against various illnesses and pests. Mining of minerals is for the development of human society a key economic activity. An important site where the copper is mined in the Slovakia is nearby Smolníka. Due to long time mining in his area (more than 700 years) there are places with extremely high concentrations of various metals including copper. Besides copper, there are also detected iron, zinc and arsenic. Various plant species

  1. Arabidopsis copper transport protein COPT2 participates in the cross talk between iron deficiency responses and low-phosphate signaling.

    Science.gov (United States)

    Perea-García, Ana; Garcia-Molina, Antoni; Andrés-Colás, Nuria; Vera-Sirera, Francisco; Pérez-Amador, Miguel A; Puig, Sergi; Peñarrubia, Lola

    2013-05-01

    Copper and iron are essential micronutrients for most living organisms because they participate as cofactors in biological processes, including respiration, photosynthesis, and oxidative stress protection. In many eukaryotic organisms, including yeast (Saccharomyces cerevisiae) and mammals, copper and iron homeostases are highly interconnected; yet, such interdependence is not well established in higher plants. Here, we propose that COPT2, a high-affinity copper transport protein, functions under copper and iron deficiencies in Arabidopsis (Arabidopsis thaliana). COPT2 is a plasma membrane protein that functions in copper acquisition and distribution. Characterization of the COPT2 expression pattern indicates a synergic response to copper and iron limitation in roots. We characterized a knockout of COPT2, copt2-1, that leads to increased resistance to simultaneous copper and iron deficiencies, measured as reduced leaf chlorosis and improved maintenance of the photosynthetic apparatus. We propose that COPT2 could play a dual role under iron deficiency. First, COPT2 participates in the attenuation of copper deficiency responses driven by iron limitation, possibly to minimize further iron consumption. Second, global expression analyses of copt2-1 versus wild-type Arabidopsis plants indicate that low-phosphate responses increase in the mutant. These results open up new biotechnological approaches to fight iron deficiency in crops.

  2. Low-cost optical fabrication of flexible copper electrode via laser-induced reductive sintering and adhesive transfer

    Science.gov (United States)

    Back, Seunghyun; Kang, Bongchul

    2018-02-01

    Fabricating copper electrodes on heat-sensitive polymer films in air is highly challenging owing to the need of expensive copper nanoparticles, rapid oxidation of precursor during sintering, and limitation of sintering temperature to prevent the thermal damage of the polymer film. A laser-induced hybrid process of reductive sintering and adhesive transfer is demonstrated to cost-effectively fabricate copper electrode on a polyethylene film with a thermal resistance below 100 °C. A laser-induced reductive sintering process directly fabricates a high-conductive copper electrode onto a glass donor from copper oxide nanoparticle solution via photo-thermochemical reduction and agglomeration of copper oxide nanoparticles. The sintered copper patterns were transferred in parallel to a heat-sensitive polyethylene film through self-selective surface adhesion of the film, which was generated by the selective laser absorption of the copper pattern. The method reported here could become one of the most important manufacturing technologies for fabricating low-cost wearable and disposable electronics.

  3. Uptake and internalisation of copper by three marine microalgae: comparison of copper-sensitive and copper-tolerant species.

    Science.gov (United States)

    Levy, Jacqueline L; Angel, Brad M; Stauber, Jennifer L; Poon, Wing L; Simpson, Stuart L; Cheng, Shuk Han; Jolley, Dianne F

    2008-08-29

    Although it has been well established that different species of marine algae have different sensitivities to metals, our understanding of the physiological and biochemical basis for these differences is limited. This study investigated copper adsorption and internalisation in three algal species with differing sensitivities to copper. The diatom Phaeodactylum tricornutum was particularly sensitive to copper, with a 72-h IC50 (concentration of copper to inhibit growth rate by 50%) of 8.0 microg Cu L(-1), compared to the green algae Tetraselmis sp. (72-h IC50 47 microg Cu L(-1)) and Dunaliella tertiolecta (72-h IC50 530 microg Cu L(-1)). At these IC50 concentrations, Tetraselmis sp. had much higher intracellular copper (1.97+/-0.01 x 10(-13)g Cu cell(-1)) than P. tricornutum (0.23+/-0.19 x 10(-13)g Cu cell(-1)) and D. tertiolecta (0.59+/-0.05 x 10(-13)g Cu cell(-1)), suggesting that Tetraselmis sp. effectively detoxifies copper within the cell. By contrast, at the same external copper concentration (50 microg L(-1)), D. tertiolecta appears to better exclude copper than Tetraselmis sp. by having a slower copper internalisation rate and lower internal copper concentrations at equivalent extracellular concentrations. The results suggest that the use of internal copper concentrations and net uptake rates alone cannot explain differences in species-sensitivity for different algal species. Model prediction of copper toxicity to marine biota and understanding fundamental differences in species-sensitivity will require, not just an understanding of water quality parameters and copper-cell binding, but also further knowledge of cellular detoxification mechanisms.

  4. Electrochemical in-situ impregnation of wood using a copper nail as source for copper

    DEFF Research Database (Denmark)

    Ottosen, Lisbeth M.; Block, Thomas; Nymark, Morten

    2011-01-01

    A new method for copper impregnation of wood in structures was suggested and tested in laboratory scale with specimen of new pine sapwood. A copper nail and a steel screw were placed in the wood, and an electric direct current field was applied, so the copper nail was anode and the screw...... was cathode. At the anode, copper ions were generated. The copper ions were transported into the wood by electromigration (movement of ions in an applied electric field) towards the cathode, and a volume between the two electrodes was thereby impregnated. Copper also moved to a lesser degree in the opposite...

  5. Laboratory investigation into the development of resistance of Daphnia manga (straus) to environmental pollutants

    Energy Technology Data Exchange (ETDEWEB)

    LeBlanc, G.A.

    1982-04-01

    The purpose of this study was to determine the ability of Daphnia magna (Straus) to develop resistance to selected environmental pollutants through physiological adaptation or the selection of genetically fit organisms. The results of the study demonstrated that daphnids pre-exposed to copper, lead or zinc for 20 h had become significantly resistant to the toxic effects of these metals. Similar tests performed with sodium lauryl sulfate, however, resulted in no increased resistance. Exposure of successive generations of daphnids to copper resulted in the development of significant resistance to copper. However, this resistance was determined to be the result of physiological adaptation and was not due to the selection of genetically fit organisms. Multigeneration exposures to sodium lauryl sulfate failed to produce any increased resistance to the toxic effects of this compound.Exposure of successive generations to sodium lauryl sulfate increased each generation's sensitivity to the toxicity of this compound. To determine if resistance to one pollutant might confer resistance to others, the resistance, to zinc and lead, of daphnids pre-exposed to copper was assessed. Copper-resistant daphnids demonstrated no increased resistance to the toxic effects of zinc or lead.

  6. Copper Leaching from Copper-ethanolamine Treated Wood: Comparison of Field Test Studies and Laboratory Standard Procedures

    OpenAIRE

    Nejc Thaler; Miha Humar

    2014-01-01

    Copper-based compounds are some of the most important biocides for the protection of wood in heavy duty applications. In the past, copper was combined with chromium compounds to reduce copper leaching, but a recent generation of copper-based preservatives uses ethanolamine as a fixative. To elucidate the leaching of copper biocides from wood, Norway spruce (Picea abies) wood was treated with a commercial copper-ethanolamine solution with two different copper concentrations (cCu = 0.125% and 0...

  7. Normal state resistance and low temperature magnetoresistance of superconducting cables for accelerator magnets

    International Nuclear Information System (INIS)

    Sampson, W.B.; Garber, M.; Ghosh, A.K.

    1988-01-01

    The normal state resistivity of the superconducting NbTi cable used in accelerator magnets is usually specified by the resistance per unit length at room temperature (295 K) and the residual resistance ratio (RRR). Using these resistance parameters, the amount of copper in the multifilamentary wire can be calculated. This method is consistent with the traditional etch and weigh technique, and as such is a alternative and convenient way of specifying the copper to superconductor ratio. In principle the magnetoresistance can be calculated from the RRR and the ''Kohler Plot'', for copper. In practice however, measurements of magnetoresistance for a wide variety of SSC inner cables show considerable disagreement with calculation. In this paper the magnetoresistance data on cables with RRR ranging from 50 to 175 are analyzed taking into account the conductor geometry and the effect of the small interfilamentary spacing on the resistivity of copper. 8 refs., 5 figs., 1 tab

  8. Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides

    Science.gov (United States)

    Yuqing, XIONG; Hengjiao, GAO; Ni, REN; Zhongwei, LIU

    2018-03-01

    Copper thin films were deposited by plasma-enhanced atomic layer deposition at low temperature, using copper(I)-N,N‧-di-sec-butylacetamidinate as a precursor and hydrogen as a reductive gas. The influence of temperature, plasma power, mode of plasma, and pulse time, on the deposition rate of copper thin film, the purity of the film and the step coverage were studied. The feasibility of copper film deposition on the inner wall of a carbon fibre reinforced plastic waveguide with high aspect ratio was also studied. The morphology and composition of the thin film were studied by atomic force microscopy and x-ray photoelectron spectroscopy, respectively. The square resistance of the thin film was also tested by a four-probe technique. On the basis of on-line diagnosis, a growth mechanism of copper thin film was put forward, and it was considered that surface functional group played an important role in the process of nucleation and in determining the properties of thin films. A high density of plasma and high free-radical content were helpful for the deposition of copper thin films.

  9. Research of oxygen free copper of Upcast {sup registered} technology for electric and electronic uses

    Energy Technology Data Exchange (ETDEWEB)

    Knych, Tadeusz; Smyrak, Beata; Walkowicz, Monika [AGH-Univ. of Science and Technology, Cracow (Poland)

    2011-01-15

    Rapid development of electronics and electrical engineering imposes a necessity to search for new materials enabling fast and lossless transmission of electrical signals. Increasingly common application of electronic systems and elements of electrical engineering contributed to the development of a new group of products representing highly advanced properties. Modern solutions concerning the materials to be used for manufacturing of the above specified products concentrate mainly on high purity copper. As a standard Oxygen Free Copper (OFC) or high purity Oxygen Free High Conductivity Copper (OFHC) are used for production of this kind of wires. OFHC copper purity class of 4N (99.99 %) contains approximately 1 to 3 ppm of oxygen and the total amount of impurities on the level not exceeding 22 ppm. This type of copper is additionally characterized by excellent deformation capabilities as well as corrosion and hydrogen embrittlement resistance. This article presents the analysis of the results of the complex research program on identification of the properties pertaining to wire rods produced oxygen free copper from Upcast line and ETP wire rod produced on Contirod {sup registered} line - in both cases the same type of cathode was used. Additionally, a subsequent analysis of the annealing susceptibility of wires obtained from Cu-OF rod (Upcast {sup registered}) and Cu-ETP wire rod (Contirod {sup registered}) was carried out. The comparative research on the recrystallization temperature proved to be the most interesting point. (orig.)

  10. Copper removal and microbial community analysis in single-chamber microbial fuel cell.

    Science.gov (United States)

    Wu, Yining; Zhao, Xin; Jin, Min; Li, Yan; Li, Shuai; Kong, Fanying; Nan, Jun; Wang, Aijie

    2018-04-01

    In this study, copper removal and electricity generation were investigated in a single-chamber microbial fuel cell (MFC). Result showed that copper was efficiently removed in the membrane-less MFC with removal efficiency of 98.3% at the tolerable Cu 2+ concentration of 12.5 mg L -1 , the corresponding open circuit voltage and maximum power density were 0.78 V and 10.2 W m -3 , respectively. The mechanism analysis demonstrated that microbial electrochemical reduction contributed to the copper removal with the products of Cu and Cu 2 O deposited at biocathode. Moreover, the microbial community analysis indicated that microbial communities changed with different copper concentrations. The dominant phyla were Proteobacteria and Bacteroidetes which could play key roles in electricity generation, while Actinobacteria and Acidobacteria were also observed which were responsible for Cu-resistant and copper removal. It will be of important guiding significance for the recovery of copper from low concentration wastewater through single-chamber MFC with simultaneous energy recovery. Copyright © 2018 Elsevier Ltd. All rights reserved.

  11. Botanicals and Phosphonate Show Potential to Replace Copper for Control of Potato Late Blight

    Directory of Open Access Journals (Sweden)

    Hans-Rudolf Forrer

    2017-11-01

    Full Text Available Potato late blight (PLB caused by Phytophthora infestans (Pi is the most harmful disease in potato production worldwide. In organic farming, copper is used despite its persistence in soil and toxicity to soil organisms. To replace copper, suspensions of powders from three promising botanicals, including bark of buckthorn (Frangula alnus, FA, roots of medicinal rhubarb (Rheum palmatum and galls of the nutgall tree (Galla chinensis, were tested in multi-year field experiments. The current study shows for the first time that botanicals could replace copper under field conditions and best PLB reduction on leaves was achieved with FA, reaching a level close to that of 2 to 3 kg copper per hectare and year. Better results than with copper were achieved with Phosfik® (Ph, a phosphonate-based product. For both FA and Ph, the mode of action is based on induced resistance, for Ph also on direct fungicidal effects. A disadvantage of Ph is the accumulation of residues in potato tubers. Nevertheless, two to three applications with 2 to 3 L/ha of Ph would be feasible to not exceed a minimal risk level (MLR of 20 mg/kg of phosphorous acid as proposed by the European Food Safety Authority. Due to an excellent environmental profile and a complex mode of action counteracting Pi resistance, phosphonate-based products would be most suitable for sustainable PLB management in integrated pest management (IPM programmes.

  12. Study on the CMP characteristics of a copper passivity layer formed by dipping in an oxidizer

    International Nuclear Information System (INIS)

    Choi, Youn-Ok; Lee, Woo-Sun; Choi, Gwon-Woo; Lee, Kang-Yeon; Kim, Nam-Oh

    2011-01-01

    Copper has been the material for ultra-large-scale integrated circuits owing to its excellent electromigration resistance and low electrical resistance. The polishing mechanism of metal chemical mechanical polishing (CMP) has been reported to be a repeated process of passive oxide layer formation through the use of on oxidizer and then the abrasion action of the slurry. However, because copper is softer and more sensitive to corrosion than tungsten, the slurry composition and the polishing mechanism during the copper CMP process may be more complicated. In a general Cu-CMP process, a mixture of an alumina-based slurry and an oxidizer in proper proportion is used in order to form a passive oxide layer such as CuO and CuO 2 . However, a conventional CMP process consumes an unnecessary amount of slurry to formed the passive layer. Therefore, in this paper, we propose a new method. The copper samples were oxidized by dipping in an oxidizer for an appropriate time to minimize the consumption of slurry before the CMP process. Then, we performed the CMP process. In order to compare the polishing characteristics of the copper thin film, we discuss the CMP removal rate and non-uniformity, as well as the microstructure of the surface and a layer cross-section based on a scanning.

  13. Thermal conductivity of glass copper-composite

    International Nuclear Information System (INIS)

    Kinoshita, Makoto; Terai, Ryohei; Haidai, Haruki

    1980-01-01

    Glass-metal composites are to be one of the answers for promoting thermal conduction in the glassy solids containing high-level radioactive wastes. In order to investigate the effect of metal addition on thermal conductivity of glasses, glass-copper composites were selected, and the conductivities of the composites were measured and discussed in regards to copper content and microstructure. Fully densified composites were successfully prepared by pressure sintering of the powder mixtures of glass and copper at temperatures above the yield points of the constituent glasses if the copper content was not so much. The conductivity was measured by means of a comparative method, in which the thermal gradient of the specimen was compared with that of quartz glass as standard under thermally steady state. Measurements were carried out at around 50 0 C. The thermal conductivity increased with increasing content of copper depending on the kind of copper powder used. The conductivities of the composites of the same copper content differed considerably each another. Fine copper powder was effective on increasing conductivity, and the conductivity became about threefold of that of glass by mixing the fine copper powder about 10 vol%. For the composites containing the fine copper powder less than 5 vol%, the conductivity obeyed so-called logarithmic rule, one of the mixture rules of conductivity, whereas for composites containing more than 5 vol%, the conductivity remarkably increased apart from the rule. This fact suggests that copper becomes continuous in the composite when the copper content increased beyond 5 vol%. For the composites containing coarse copper powder, the conductivity was increased not significantly, and obeyed an equation derived from the model in which conductive material dispersed in less conductive one. (author)

  14. Copper disinfection ban causes storm.

    Science.gov (United States)

    Lester, Alan

    2013-05-01

    Since 1 February this year, under the EU's Biocidal Products Directive, it has been illegal to sell or use water treatment systems that use elemental copper, a practice employed historically by a significant number of UK healthcare facilities to combat Legionella. Alan Lester, managing director of specialist supplier of 'environmentally-friendly' water treatment systems, Advanced Hydro, says the ban has caused 'a storm of giant proportion,' with advocates of copper ion-based treatment systems arguing that this disinfection method dates back 3,000 years to Egyptian times, making it an 'undoubtedly proven' technology. Here he explains why the ban came into force, considers why the UK's Health and Safety Executive (HSE) is seeking a derogation, looks at the ban's likely impact, and gives a personal viewpoint on the 'pros and cons' of some of the alternative treatment technologies, including a titanium dioxide-based system marketed by Advanced Hydro itself in the UK.

  15. LEP Radio Frequency Copper Cavity

    CERN Multimedia

    The pulse of a particle accelerator. 128 of these radio frequency cavities were positioned around CERN's 27-kilometre LEP ring to accelerate electrons and positrons. The acceleration was produced by microwave electric oscillations at 352 MHz. The electrons and positrons were grouped into bunches, like beads on a string, and the copper sphere at the top stored the microwave energy between the passage of individual bunches. This made for valuable energy savings as it reduced the heat generated in the cavity.

  16. Copper as a target for prostate cancer therapeutics: copper-ionophore pharmacology and altering systemic copper distribution

    Science.gov (United States)

    Denoyer, Delphine; Pearson, Helen B.; Clatworthy, Sharnel A.S.; Smith, Zoe M.; Francis, Paul S.; Llanos, Roxana M.; Volitakis, Irene; Phillips, Wayne A.; Meggyesy, Peter M.; Masaldan, Shashank; Cater, Michael A.

    2016-01-01

    Copper-ionophores that elevate intracellular bioavailable copper display significant therapeutic utility against prostate cancer cells in vitro and in TRAMP (Transgenic Adenocarcinoma of Mouse Prostate) mice. However, the pharmacological basis for their anticancer activity remains unclear, despite impending clinical trails. Herein we show that intracellular copper levels in prostate cancer, evaluated in vitro and across disease progression in TRAMP mice, were not correlative with copper-ionophore activity and mirrored the normal levels observed in patient prostatectomy tissues (Gleason Score 7 & 9). TRAMP adenocarcinoma cells harbored markedly elevated oxidative stress and diminished glutathione (GSH)-mediated antioxidant capacity, which together conferred selective sensitivity to prooxidant ionophoric copper. Copper-ionophore treatments [CuII(gtsm), disulfiram & clioquinol] generated toxic levels of reactive oxygen species (ROS) in TRAMP adenocarcinoma cells, but not in normal mouse prostate epithelial cells (PrECs). Our results provide a basis for the pharmacological activity of copper-ionophores and suggest they are amendable for treatment of patients with prostate cancer. Additionally, recent in vitro and mouse xenograft studies have suggested an increased copper requirement by prostate cancer cells. We demonstrated that prostate adenocarcinoma development in TRAMP mice requires a functional supply of copper and is significantly impeded by altered systemic copper distribution. The presence of a mutant copper-transporting Atp7b protein (tx mutation: A4066G/Met1356Val) in TRAMP mice changed copper-integration into serum and caused a remarkable reduction in prostate cancer burden (64% reduction) and disease severity (grade), abrogating adenocarcinoma development. Implications for current clinical trials are discussed. PMID:27175597

  17. Multilayer graphene as an effective corrosion protection coating for copper

    Science.gov (United States)

    Ravishankar, Vasumathy; Ramaprabhu, S.; Jaiswal, Manu

    2018-04-01

    Graphene grown by chemical vapor deposition (CVD) has been studied as a protective layer against corrosion of copper. The layer number dependence on the protective nature of graphene has been investigated using techniques such as Tafel analysis and Electroimpedance Spectroscopy. Multiple layers of graphene were achieved by wet transfer above CVD grown graphene. Though this might cause grain boundaries, the sites where corrosion is initiated, to be staggered, wet transfer inherently carries the disadvantage of tearing of graphene, as confirmed by Raman spectroscopy measurements. However, Electroimpedance Spectroscopy (EIS) reflects that graphene protected copper has a layer dependent resistance to corrosion. Decrease in corrosion current (Icorr) for graphene protected copper is presented. There is only small dependence of corrosion current on the layer number, Tafel plots clearly indicate passivation in the presence of graphene, whether it be single layer or multiple layers. Notwithstanding the crystallite size, defect free layers of graphene with staggered grain boundaries combined with passivation could offer good corrosion protection for metals.

  18. Copper anode corrosion affects power generation in microbial fuel cells

    KAUST Repository

    Zhu, Xiuping; Logan, Bruce E.

    2013-01-01

    Non-corrosive, carbon-based materials are usually used as anodes in microbial fuel cells (MFCs). In some cases, however, metals have been used that can corrode (e.g. copper) or that are corrosion resistant (e.g. stainless steel, SS). Corrosion could increase current through galvanic (abiotic) current production or by increasing exposed surface area, or decrease current due to generation of toxic products from corrosion. In order to directly examine the effects of using corrodible metal anodes, MFCs with Cu were compared with reactors using SS and carbon cloth anodes. MFCs with Cu anodes initially showed high current generation similar to abiotic controls, but subsequently they produced little power (2 mW m-2). Higher power was produced with microbes using SS (12 mW m-2) or carbon cloth (880 mW m-2) anodes, with no power generated by abiotic controls. These results demonstrate that copper is an unsuitable anode material, due to corrosion and likely copper toxicity to microorganisms. © 2013 Society of Chemical Industry.

  19. Copper anode corrosion affects power generation in microbial fuel cells

    KAUST Repository

    Zhu, Xiuping

    2013-07-16

    Non-corrosive, carbon-based materials are usually used as anodes in microbial fuel cells (MFCs). In some cases, however, metals have been used that can corrode (e.g. copper) or that are corrosion resistant (e.g. stainless steel, SS). Corrosion could increase current through galvanic (abiotic) current production or by increasing exposed surface area, or decrease current due to generation of toxic products from corrosion. In order to directly examine the effects of using corrodible metal anodes, MFCs with Cu were compared with reactors using SS and carbon cloth anodes. MFCs with Cu anodes initially showed high current generation similar to abiotic controls, but subsequently they produced little power (2 mW m-2). Higher power was produced with microbes using SS (12 mW m-2) or carbon cloth (880 mW m-2) anodes, with no power generated by abiotic controls. These results demonstrate that copper is an unsuitable anode material, due to corrosion and likely copper toxicity to microorganisms. © 2013 Society of Chemical Industry.

  20. Radiation induced segregation and point defects in binary copper alloys

    International Nuclear Information System (INIS)

    Monteiro, W.A.

    1984-01-01

    Considerable progress, both theoretical and experimental, has been made in establishing and understanding the influence of factors such as temperature, time, displacement rate dependence and the effect of initial solute misfit on radiation induced solute diffusion and segregation. During irradiation, the composition of the alloy changes locally, due to defect flux driven non-equilibrium segregation near sinks such as voids, external surfaces and grain boundaries. This change in composition could influence properties and phenomena such as ductility, corrosion resistance, stress corrosion cracking, sputtering and blistering of materials used in thermo-nuclear reactors. In this work, the effect of 1 MeV electron irradiation on the initiation and development of segregation and defect diffusion in binary copper alloys has been studied in situ, with the aid of a high voltage electron microscope. The binary copper alloys had Be, Pt and Sn as alloying elements which had atomic radii less than, similar and greater than that of copper, respectively. It has been observed that in a wide irradiation temperature range, stabilization and growth of dislocation loops took place in Cu-Sn and Cu-Pt alloys. Whereas in the Cu-Be alloy, radiation induced precipitates formed and transformed to the stable γ phase. (Author) [pt

  1. Gallium and copper radiopharmaceutical chemistry

    International Nuclear Information System (INIS)

    Green, M.A.; John, E.K.; Barnhart, A.J.

    1990-01-01

    Several isotopes of gallium and copper exhibit nuclear properties that make them attractive for applications in nuclear medicine, most notably Ga-67, Ga-68, Cu-67 and Cu-62. Of these, gamma-emitting Ga-67 has historically found the greatest clinical use, based on the observation that tracer gallium(III) citrate rapidly produces Ga-67 transferrin upon intravenous injection and then slowly affords selective Ga-67 localization in sites of abscess and certain tumors. Copper-67 has received attention as a potential label for tissue-selective monoclonal antibodies, since its associated γ-photons can be used for external imaging and its β - -emissions could be used for radiation therapy. Positron-emitting gallium-68 and copper-62, being available from parent/daughter generator systems, have attracted interest as potential labels for radiopharmaceuticals used in positron emission tomography (PET) because they could reduce the dependence of this imaging technology on hospital-based cyclotrons. The 10 min. half-life of Cu-62 is particularly well-suited to the time frame of PET studies of tissue perfusion, an application for which Cu(II)-bis(thiosemicarbazone) derivatives appear promising. The 68 min. half-life of Ga-68 makes it appropriate for PET studies over longer imaging time spans

  2. Bulk Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

    Science.gov (United States)

    2014-05-13

    grain size of copper: e.g., Bi,76 Ag,77 Fe,78 Zn,79 W,80 Sb,81 Zr ,82,83 Nb ,84 and Ta.28,29 In gen- eral, the addition of solutes in these systems has...grain size (in percent) as a function of the homologous temperature of Cu for several different solutes: Bi, W, Ag, Fe, Nb , Zr (in increasing order of...electrons in metals, increasing the density of grain boundaries in nanocrystalline materials greatly increases the electrical resistivity (which has

  3. A novel anti-influenza copper oxide containing respiratory face mask.

    Science.gov (United States)

    Borkow, Gadi; Zhou, Steve S; Page, Tom; Gabbay, Jeffrey

    2010-06-25

    Protective respiratory face masks protect the nose and mouth of the wearer from vapor drops carrying viruses or other infectious pathogens. However, incorrect use and disposal may actually increase the risk of pathogen transmission, rather than reduce it, especially when masks are used by non-professionals such as the lay public. Copper oxide displays potent antiviral properties. A platform technology has been developed that permanently introduces copper oxide into polymeric materials, conferring them with potent biocidal properties. We demonstrate that impregnation of copper oxide into respiratory protective face masks endows them with potent biocidal properties in addition to their inherent filtration properties. Both control and copper oxide impregnated masks filtered above 99.85% of aerosolized viruses when challenged with 5.66+/-0.51 and 6.17+/-0.37 log(10)TCID(50) of human influenza A virus (H1N1) and avian influenza virus (H9N2), respectively, under simulated breathing conditions (28.3 L/min). Importantly, no infectious human influenza A viral titers were recovered from the copper oxide containing masks within 30 minutes (masks. Similarly, the infectious avian influenza titers recovered from the copper oxide containing masks were masks 5.03+/-0.54 log(10)TCID(50). The copper oxide containing masks successfully passed Bacterial Filtration Efficacy, Differential Pressure, Latex Particle Challenge, and Resistance to Penetration by Synthetic Blood tests designed to test the filtration properties of face masks in accordance with the European EN 14683:2005 and NIOSH N95 standards. Impregnation of copper oxide into respiratory protective face masks endows them with potent anti-influenza biocidal properties without altering their physical barrier properties. The use of biocidal masks may significantly reduce the risk of hand or environmental contamination, and thereby subsequent infection, due to improper handling and disposal of the masks.

  4. Control of biofouling on titanium condenser tubes with the use of electroless copper plating

    International Nuclear Information System (INIS)

    Anandkumar, B.; George, R.P.; Kamachi Mudali, U.; Ramachandran, D.

    2015-01-01

    In sea water environments titanium condenser tubes face serious issues of biofouling and biomineralization. Electroless plating of nanocopper film is attempted inside the tubes for the control of biofilm formation. Using advanced techniques like AFM, SEM, and XPS, electroless copper plated flat Ti specimens were characterized. Examination of Cu coated Ti surfaces using AFM and SEM showed more reduction in the microroughness compared to anodized Ti surface. Cu 2p 3/2 peak in XPS spectral analysis showed the shift in binding energy inferring the reduction of the hydroxide to metallic copper. Tubular specimens were exposed to sea water up to three months and withdrawn at monthly intervals to evaluate antibacterial activity and long term stability of the coating. Total viable counts and epifluorescence microscopy analyses showed two orders decrease in bacterial counts on copper coated Ti specimens when compared to as polished control Ti specimens. Molecular biology techniques like DGGE and protein expression analysis system were done to get insight into the community diversity and copper tolerance of microorganisms. DGGE gel bands clearly showed the difference in the bacterial diversity inferring from the 16S rRNA gene fragments (V3 regions). Protein analysis showed distinct protein spots appearing in electroless copper coated Ti biofilm protein samples in addition to protein spots common to both the biofilms of Cu coated and as polished Ti. The results indicated copper accumulating proteins in copper resistant bacterial species of biofilm. Reduced microroughness of the surface and toxic copper ions resulted in good biofouling control even after three months exposure to sea water. (author)

  5. Breakdown resistance of refractory metals compared to copper

    CERN Document Server

    Taborelli, M; Kildemo, M

    2004-01-01

    The behaviour of Mo, W and Cu with respect to electrical breakdown in ultra high vacuum has been investigated by means of a capacitor discharge method. The maximum stable electric field without breakdown and the field enhancement factor, beta have been measured between electrodes of the same material in a sphere/plane geometry for anode and cathode, respectively. The maximum stable field increases as a function of the number of breakdown events for W and Mo. In contrast, no systematic increase is observed for Cu. The highest values obtained are typically 500 MV/m for W, 350 MV/m for Mo and only 180 MV/m for Cu. This conditioning, found for the refractory metals, corresponds to a simultaneous decrease of beta and is therefore related to the field emission properties of the surface and their modification upon sparking. Accordingly, high beta values and no applicable field increase occur for Cu even after repeated breakdown. The results are compared with RF breakdown experiments [1] performed on prototype 30 GHz...

  6. The Extracellular Domain of Human High Affinity Copper Transporter (hNdCTR1), Synthesized by E. coli Cells, Chelates Silver and Copper Ions In Vivo.

    Science.gov (United States)

    Sankova, Tatiana P; Orlov, Iurii A; Saveliev, Andrey N; Kirilenko, Demid A; Babich, Polina S; Brunkov, Pavel N; Puchkova, Ludmila V

    2017-11-03

    There is much interest in effective copper chelators to correct copper dyshomeostasis in neurodegenerative and oncological diseases. In this study, a recombinant fusion protein for expression in Escherichia coli cells was constructed from glutathione-S-transferase (GST) and the N-terminal domain (ectodomain) of human high affinity copper transporter CTR1 (hNdCTR1), which has three metal-bound motifs. Several biological properties of the GST-hNdCTR1 fusion protein were assessed. It was demonstrated that in cells, the protein was prone to oligomerization, formed inclusion bodies and displayed no toxicity. Treatment of E. coli cells with copper and silver ions reduced cell viability in a dose- and time-dependent manner. Cells expressing GST-hNdCTR1 protein demonstrated resistance to the metal treatments. These cells accumulated silver ions and formed nanoparticles that contained AgCl and metallic silver. In this bacterial population, filamentous bacteria with a length of about 10 µm were often observed. The possibility for the fusion protein carrying extracellular metal binding motifs to integrate into the cell's copper metabolism and its chelating properties are discussed.

  7. The Extracellular Domain of Human High Affinity Copper Transporter (hNdCTR1, Synthesized by E. coli Cells, Chelates Silver and Copper Ions In Vivo

    Directory of Open Access Journals (Sweden)

    Tatiana P. Sankova

    2017-11-01

    Full Text Available There is much interest in effective copper chelators to correct copper dyshomeostasis in neurodegenerative and oncological diseases. In this study, a recombinant fusion protein for expression in Escherichia coli cells was constructed from glutathione-S-transferase (GST and the N-terminal domain (ectodomain of human high affinity copper transporter CTR1 (hNdCTR1, which has three metal-bound motifs. Several biological properties of the GST-hNdCTR1 fusion protein were assessed. It was demonstrated that in cells, the protein was prone to oligomerization, formed inclusion bodies and displayed no toxicity. Treatment of E. coli cells with copper and silver ions reduced cell viability in a dose- and time-dependent manner. Cells expressing GST-hNdCTR1 protein demonstrated resistance to the metal treatments. These cells accumulated silver ions and formed nanoparticles that contained AgCl and metallic silver. In this bacterial population, filamentous bacteria with a length of about 10 µm were often observed. The possibility for the fusion protein carrying extracellular metal binding motifs to integrate into the cell’s copper metabolism and its chelating properties are discussed.

  8. Speciation and leachability of copper in mine tailings from porphyry copper mining

    DEFF Research Database (Denmark)

    Hansen, Henrik K.; Yianatos, Juan B; Ottosen, Lisbeth M.

    2005-01-01

    Mine tailing from the El Teniente-Codelco copper mine situated in VI Region of Chile was analysed in order to evaluate the mobility and speciation of copper in the solid material. Mine tailing was sampled after the rougher flotation circuits, and the copper content was measured to 1150mgkg^-^1 dry...... matter. This tailing was segmented into fractions of different size intervals: 0-38, 38-45, 45-53, 53-75, 75-106, 106-150, 150-212, and >212@mm, respectively. Copper content determination, sequential chemical extraction, and desorption experiments were carried out for each size interval in order...... to evaluate the speciation of copper. It was found that the particles of smallest size contained 50-60% weak acid leachable copper, whereas only 32% of the copper found in largest particles could be leached in weak acid. Copper oxides and carbonates were the dominating species in the smaller particles...

  9. Preparation of copper and silicon/copper powders by a gas ...

    Indian Academy of Sciences (India)

    Administrator

    aCentre for Materials Research, Department of Imaging and Applied Physics, ... Copper powder; Si/Cu composite particle; gas evaporation–condensation method; characteriza- tion. .... from the liquid metal surface, the mixed vapour of copper.

  10. Copper Bioleaching in China: Review and Prospect

    OpenAIRE

    Shenghua Yin; Leiming Wang; Eugie Kabwe; Xun Chen; Rongfu Yan; Kai An; Lei Zhang; Aixiang Wu

    2018-01-01

    The commercial application of copper bioleaching, an environmentally-friendly approach for low-grade and secondary mineral resources recycling, has increased worldwide since the 2000s. As the world’s second-largest economic entity and the largest developing country, China has the largest demand for metal resources, significantly advancing the theory and industrial technology of copper bioleaching. This paper reviews the exploration and application of copper bioleaching in China. Two typical b...

  11. World Copper Market Outlook: 2003-2014

    OpenAIRE

    Florela Stoian

    2015-01-01

    This paper presents synthetically the copper market outlook (demand, supply, and prices) during 2003-2014, highlighting the impact of economic crisis of 2008-2009 on the world copper market. During the crisis, the decline in demand caused increases in excess supply of metal, as the supply has followed an upward trend, contributing to the imbalances of the copper market and putting pressure on stock prices at LME London Metal Exchange.

  12. Electrochemical synthesis of highly crystalline copper nanowires

    International Nuclear Information System (INIS)

    Kaur, Amandeep; Gupta, Tanish; Kumar, Akshay; Kumar, Sanjeev; Singh, Karamjeet; Thakur, Anup

    2015-01-01

    Copper nanowires were fabricated within the pores of anodic alumina template (AAT) by template synthesis method at pH = 2.9. X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) were used to investigate the structure, morphology and composition of fabricated nanowires. These characterizations revealed that the deposited copper nanowires were highly crystalline in nature, dense and uniform. The crystalline copper nanowires are promising in application of future nanoelectronic devices and circuits