WorldWideScience

Sample records for planning including interconnected

  1. Advanced methodology for generation expansion planning including interconnected systems

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, M.; Yokoyama, R.; Yasuda, K. [Tokyo Metropolitan Univ. (Japan); Sasaki, H. [Hiroshima Univ. (Japan); Ogimoto, K. [Electric Power Development Co. Ltd., Tokyo (Japan)

    1994-12-31

    This paper reviews advanced methodology for generation expansion planning including interconnected systems developed in Japan, putting focus on flexibility and efficiency in a practical application. First, criteria for evaluating flexibility of generation planning considering uncertainties are introduced. Secondly, the flexible generation mix problem is formulated as a multi-objective optimization with more than two objective functions. The multi-objective optimization problem is then transformed into a single objective problem by using the weighting method, to obtain the Pareto optimal solution, and solved by a dynamics programming technique. Thirdly, a new approach for electric generation expansion planning of interconnected systems is presented, based on the Benders Decomposition technique. That is, large scale generation problem constituted by the general economic load dispatch problem, and several sub problems which are composed of smaller scale isolated system generation expansion plans. Finally, the generation expansion plan solved by an artificial neural network is presented. In conclusion, the advantages and disadvantages of this method from the viewpoint of flexibility and applicability to practical generation expansion planning are presented. (author) 29 refs., 10 figs., 4 tabs.

  2. Operational Plan Ontology Model for Interconnection and Interoperability

    Science.gov (United States)

    Long, F.; Sun, Y. K.; Shi, H. Q.

    2017-03-01

    Aiming at the assistant decision-making system’s bottleneck of processing the operational plan data and information, this paper starts from the analysis of the problem of traditional expression and the technical advantage of ontology, and then it defines the elements of the operational plan ontology model and determines the basis of construction. Later, it builds up a semi-knowledge-level operational plan ontology model. Finally, it probes into the operational plan expression based on the operational plan ontology model and the usage of the application software. Thus, this paper has the theoretical significance and application value in the improvement of interconnection and interoperability of the operational plan among assistant decision-making systems.

  3. Beta Test Plan for Advanced Inverters Interconnecting Distributed Resources with Electric Power Systems

    Energy Technology Data Exchange (ETDEWEB)

    Hoke, A.; Chakraborty, S.; Basso, T.; Coddington, M.

    2014-01-01

    This document provides a preliminary (beta) test plan for grid interconnection systems of advanced inverter-based DERs. It follows the format and methodology/approach established by IEEE Std 1547.1, while incorporating: 1. Upgraded tests for responses to abnormal voltage and frequency, and also including ride-through. 2. A newly developed test for voltage regulation, including dynamic response testing. 3. Modified tests for unintentional islanding, open phase, and harmonics to include testing with the advanced voltage and frequency response functions enabled. Two advanced inverters, one single-phase and one three-phase, were tested under the beta test plan. These tests confirmed the importance of including tests for inverter dynamic response, which varies widely from one inverter to the next.

  4. Operation planning studies for the integration of the 60 Hz Itaipu units in the Brazilian interconnected system

    Energy Technology Data Exchange (ETDEWEB)

    Chipp, H.J.; Oliveira, J.C.C. [ELETROBRAS, Rio de Janeiro, RJ (Brazil); Correa, L.R.A. [FURNAS, Rio de Janeiro, RJ (Brazil); Mendonca, W.C.; Marchi, R.D. [Itaipu Binacional, Foz do Iguacu, PR (Brazil); Botelho, M.J. [ELETROSUL, Curitiba, PR (Brazil)

    1987-12-31

    This paper describes the operation planning studies necessary to interconnect the first two 60 Hz generator units of the Itaipu power plant to the Brazilian interconnected system. The criteria, main problems identified and operative solutions encountered are presented in this paper. 10 refs., 4 figs., 5 tabs.

  5. Simulation Methodology for Analysis of Substrate Noise Impact on Analog / RF Circuits Including Interconnect Resistance

    CERN Document Server

    Soens, C; Wambacq, P; Donnay, S

    2011-01-01

    This paper reports a novel simulation methodology for analysis and prediction of substrate noise impact on analog / RF circuits taking into account the role of the parasitic resistance of the on-chip interconnect in the impact mechanism. This methodology allows investigation of the role of the separate devices (also parasitic devices) in the analog / RF circuit in the overall impact. This way is revealed which devices have to be taken care of (shielding, topology change) to protect the circuit against substrate noise. The developed methodology is used to analyze impact of substrate noise on a 3 GHz LC-tank Voltage Controlled Oscillator (VCO) designed in a high-ohmic 0.18 $\\mu$m 1PM6 CMOS technology. For this VCO (in the investigated frequency range from DC to 15 MHz) impact is mainly caused by resistive coupling of noise from the substrate to the non-ideal on-chip ground interconnect, resulting in analog ground bounce and frequency modulation. Hence, the presented test-case reveals the important role of the o...

  6. Water supply as a constraint on transmission expansion planning in the Western interconnection

    Science.gov (United States)

    Tidwell, Vincent C.; Bailey, Michael; Zemlick, Katie M.; Moreland, Barbara D.

    2016-12-01

    Consideration of water supply in transmission expansion planning (TEP) provides a valuable means of managing impacts of thermoelectric generation on limited water resources. Toward this opportunity, thermoelectric water intensity factors and water supply availability (fresh and non-fresh sources) were incorporated into a recent TEP exercise conducted for the electric interconnection in the Western United States. The goal was to inform the placement of new thermoelectric generation so as to minimize issues related to water availability. Although freshwater availability is limited in the West, few instances across five TEP planning scenarios were encountered where water availability impacted the development of new generation. This unexpected result was related to planning decisions that favored the development of low water use generation that was geographically dispersed across the West. These planning decisions were not made because of their favorable influence on thermoelectric water demand; rather, on the basis of assumed future fuel and technology costs, policy drivers and the topology of electricity demand. Results also projected that interconnection-wide thermoelectric water consumption would increase by 31% under the business-as-usual case, while consumption would decrease by 42% under a scenario assuming a low-carbon future. Except in a few instances, new thermoelectric water consumption could be accommodated with less than 10% of the local available water supply; however, limited freshwater supplies and state-level policies could increase use of non-fresh water sources for new thermoelectric generation. Results could have been considerably different if scenarios favoring higher-intensity water use generation technology or potential impacts of climate change had been explored. Conduct of this exercise highlighted the importance of integrating water into all phases of TEP, particularly joint management of decisions that are both directly (e.g., water

  7. A Vision of China-Arab Interconnection Transmission Network Planning with UHVDC Technology

    Science.gov (United States)

    Wu, Dan; Liu, Yujun; Yin, Hongyuan; Xu, Qingshan; Xu, Xiaohui; Ding, Maosheng

    2017-05-01

    Developments in ultra-high-voltage (UHV) power systems and clean energy technologies are paving the way towards unprecedented energy market globalization. In accordance with the international community’s enthusiasm for building up the Global Energy Internet, this paper focuses on the feasibility of transmitting large-size electricity from northwest China to Arab world through a long-distance transnational power interconnection. The complete investigations on the grids of both the sending-end and receiving-end is firstly presented. Then system configuration of the transmission scheme and corridor route planning is proposed with UHVDC technology. Based on transmission costs’ investigation about similar transmission projects worldwide, the costs of the proposed transmission scheme are estimated through adjustment factors which represent differences in latitude, topography and economy. The proposed China-Arab transmission line sheds light on the prospects of power cooperation and resource sharing between China and Arab states, and appeals for more emphasis on green energy concentrated power interconnections from a global perspective.

  8. Optical interconnects

    CERN Document Server

    Chen, Ray T

    2006-01-01

    This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical

  9. 76 FR 39129 - Tensolite, LLC D/B/A Carlisle Interconnect Assemblies Including On-Site Leased Workers From Volt...

    Science.gov (United States)

    2011-07-05

    ... Eligibility To Apply for Worker Adjustment Assistance In accordance with Section 223 of the Trade Act of 1974..., Vancouver, Washington. The workers produce radio frequency products and interconnect assemblies. The...

  10. Diabetes Nutrition: Including Sweets in Your Meal Plan

    Science.gov (United States)

    ... and stick to a healthy meal plan. Artificial sweeteners Examples of artificial sweeteners include: Acesulfame potassium (Sunett, ... can cause diarrhea in some people. Naturally derived sweeteners Naturally derived sweeteners, stevia (Truvia, PureVia) and agave ...

  11. Interconnected networks

    CERN Document Server

    2016-01-01

    This volume provides an introduction to and overview of the emerging field of interconnected networks which include multi layer or multiplex networks, as well as networks of networks. Such networks present structural and dynamical features quite different from those observed in isolated networks. The presence of links between different networks or layers of a network typically alters the way such interconnected networks behave – understanding the role of interconnecting links is therefore a crucial step towards a more accurate description of real-world systems. While examples of such dissimilar properties are becoming more abundant – for example regarding diffusion, robustness and competition – the root of such differences remains to be elucidated. Each chapter in this topical collection is self-contained and can be read on its own, thus making it also suitable as reference for experienced researchers wishing to focus on a particular topic.

  12. Transurban interconnectivities

    DEFF Research Database (Denmark)

    Jørgensen, Claus Møller

    2012-01-01

    This essay discusses the interpretation of the revolutionary situations of 1848 in light of recent debates on interconnectivity in history. The concept of transurban interconnectivities is proposed as the most precise concept to capture the nature of interconnectivity in 1848. It is argued......, radicalism and nationalism in 1848. In the concluding paragraph, the limitations of the notion of urban–rural nterconnectivity are discussed in order to clarify the nature of transurban interconnectivity. 1848 revolutions; European history; interconnectivity; transurban; urban political movements...

  13. Optical Backplane Interconnection

    Science.gov (United States)

    Hendricks, Herbert D.

    1991-01-01

    Optical backplane interconnection (OBIT), method of optically interconnecting many parallel outputs from data processor to many parallel inputs of other data processors by optically changing wavelength of output optical beam. Requires only one command: exact wavelength necessary to make connection between two desired processors. Many features, including smallness advantageous to incorporate OBIT into integrated optical device. Simplifies or eliminates wiring and speeds transfer of data over existing electrical or optical interconnections. Computer hookups and fiber-optical communication networks benefit from concept.

  14. Planning for Planetary Science Mission Including Resource Prospecting Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Advances in computer-aided mission planning can enhance mission operations and science return for surface missions to Mars, the Moon, and beyond. While the...

  15. Electrical interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Frost, John S.; Brandt, Randolph J.; Hebert, Peter; Al Taher, Omar

    2015-10-06

    An interconnect includes a first set of connector pads, a second set of connector pads, and a continuous central portion. A first plurality of legs extends at a first angle from the continuous central portion. Each leg of the first plurality of legs is connected to a connector pad of a first set of connector pads. A second plurality of legs extends at a second angle from the continuous central portion. Each leg of the second plurality of legs is connected to a connector pad of the second set of connector pads. Gaps are defined between legs. The gaps enable movement of the first set of connector pads relative to the second set of connector pads.

  16. Framework for city planning including nature-based solutions (NBS)

    Science.gov (United States)

    Alkan Olsson, Johanna; Sörensen, Johanna; Persson, Anna

    2017-04-01

    A common strategy to lower the demand for intense land use and energy consumption is the densification of urban areas. While this might be a fruitful strategy for its main objectives, one concern is that space for green areas and surface water will be decreased. Therefore, densification increases the need of strategies to develop and increase the quality of nature-based solutions (NBS) in urban areas. Smarter city planning strategies are needed, both for maintenance of existing NBS and for implementation of NBS in new developments. City planning must be based on well-evaluated solutions, which in turn must be based on a decent data material for each city. Today there is however several type of difficulties related to adequate provision of data to ensure a better implementation of NBS. The challenges arise from issues such as lack of information about for example costs of maintenance of existing NBS, citizens' perceptions and preferred use of NBS to difficulties of a more technical character such as the format of available GIS information. This study focuses on this information gap regarding NBS that persists in most cities today. The project aims to develop a framework that can help city planners to overcome the gaps and facilitate the inclusion of high quality nature-based solutions where developed or maintained. The framework, which is detailed by identifying information gaps through a literature review and selected interviews with urban planners and experts in the area of NBS, is based on the idea that well-structured and user-friendly data supporting city-planning strategies are essential to facilitate the implementation of NBS. What can be understood as well structured and user-friendly data depends on the goals and needs expressed in the strategic plans, which mean that there is a need for a close interaction between the development data and the strategic political goals expressed in the plans.

  17. Interconnections 180

    CERN Multimedia

    CERN Visual Media Office; Noemi Caraban Gonzales

    2013-01-01

    Throughout the LS1 (Long Shutdown 1 planned for 2013-14), the consolidation of the 13 kA splices consists of the opening of M sleeves to access the bus-bars and install the consolidation system features (shunt, electrical insulation and mechanical restraint system). Once the features are installed, the sleeves are rewelded (10000 welds in total). The interconnect regions between adjacent cryomagnets consist of a number of lines spanning from one machine element to another. Within a magnet-to-magnet connection several welds are made. An automatic orbital weld without filler material closes the three main bus-bar lines M1, M2 and M3 (M1 and M2 for the main quadrupole bus-bars and M3 for the main dipole bus-bars). These welds are performed in a radial clearance of only 45 mm. A very reliable weld process is required. The weld configuration shall also ease future interventions. Automatic orbital TIG welding associated to specific weld geometry meets all these requirements. Edge weld preparation has the following ...

  18. Including the public in pandemic planning: a deliberative approach

    Directory of Open Access Journals (Sweden)

    Braunack-Mayer Annette J

    2010-08-01

    Full Text Available Abstract Background Against a background of pandemic threat posed by SARS and avian H5N1 influenza, this study used deliberative forums to elucidate informed community perspectives on aspects of pandemic planning. Methods Two deliberative forums were carried out with members of the South Australian community. The forums were supported by a qualitative study with adults and youths, systematic reviews of the literature and the involvement of an extended group of academic experts and policy makers. The forum discussions were recorded with simultaneous transcription and analysed thematically. Results Participants allocated scarce resources of antiviral drugs and pandemic vaccine based on a desire to preserve society function in a time of crisis. Participants were divided on the acceptability of social distancing and quarantine measures. However, should such measures be adopted, they thought that reasonable financial, household and psychological support was essential. In addition, provided such support was present, the participants, in general, were willing to impose strict sanctions on those who violated quarantine and social distancing measures. Conclusions The recommendations from the forums suggest that the implementation of pandemic plans in a severe pandemic will be challenging, but not impossible. Implementation may be more successful if the public is engaged in pandemic planning before a pandemic, effective communication of key points is practiced before and during a pandemic and if judicious use is made of supportive measures to assist those in quarantine or affected by social isolation measures.

  19. Fuel cell system with interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Zhien; Goettler, Richard; Delaforce, Philip Mark

    2016-03-08

    The present invention includes a fuel cell system having an interconnect that reduces or eliminates diffusion (leakage) of fuel and oxidant by providing an increased densification, by forming the interconnect as a ceramic/metal composite.

  20. Optimality of Profit-Including Prices Under Ideal Planning

    Science.gov (United States)

    Samuelson, Paul A.

    1973-01-01

    Although prices calculated by a constant percentage markup on all costs (nonlabor as well as direct-labor) are usually admitted to be more realistic for a competitive capitalistic model, the view is often expressed that, for optimal planning purposes, the “values” model of Marx's Capital, Volume I, is to be preferred. It is shown here that an optimal-control model that maximizes discounted social utility of consumption per capita and that ultimately approaches a steady state must ultimately have optimal pricing that involves equal rates of steady-state profit in all industries; and such optimal pricing will necessarily deviate from Marx's model of equal rates of surplus value (markups on direct-labor only) in all industries. PMID:16592102

  1. 12 CFR 563b.105 - What information must I include in my business plan?

    Science.gov (United States)

    2010-01-01

    ... information must I include in my business plan? (a) Prior to filing an application for conversion, you must adopt a business plan reflecting your intended plans for deployment of the proposed conversion proceeds. Your business plan is required, under § 563b.150, to be included in your conversion application. At...

  2. 40 CFR 62.14590 - What should I include in my waste management plan?

    Science.gov (United States)

    2010-07-01

    ... POLLUTANTS Federal Plan Requirements for Commercial and Industrial Solid Waste Incineration Units That Commenced Construction On or Before November 30, 1999 Waste Management Plan § 62.14590 What should I include in my waste management plan? A waste management plan must include consideration of the reduction or...

  3. Interconnection of Distributed Energy Resources

    Energy Technology Data Exchange (ETDEWEB)

    Reiter, Emerson [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2017-04-19

    This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

  4. 30 CFR 250.110 - What must I include in my welding plan?

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 2 2010-07-01 2010-07-01 false What must I include in my welding plan? 250.110... must I include in my welding plan? You must include all of the following in the Welding Plan that you... qualified personnel weld; (c) Practices and procedures for safe welding that address: (1) Welding...

  5. An efficient reduction algorithm for computation of interconnect delay variability for statistical timing analysis in clock tree planning

    Indian Academy of Sciences (India)

    Sivakumar Bondada; Soumyendu Raha; Santanu Mahapatra

    2010-08-01

    In this paper, we propose a novel and efficient algorithm for modelling sub-65 nm clock interconnect-networks in the presence of process variation. We develop a method for delay analysis of interconnects considering the impact of Gaussian metal process variations. The resistance and capacitance of a distributed RC line are expressed as correlated Gaussian random variables which are then used to compute the standard deviation of delay Probability Distribution Function (PDF) at all nodes in the interconnect network. Main objective is to find delay PDF at a cheaper cost. Convergence of this approach is in probability distribution but not in mean of delay. We validate our approach against SPICE based Monte Carlo simulations while the current method entails significantly lower computational cost.

  6. 12 CFR 516.20 - What information must I include in my draft business plan?

    Science.gov (United States)

    2010-01-01

    ... business plan? 516.20 Section 516.20 Banks and Banking OFFICE OF THRIFT SUPERVISION, DEPARTMENT OF THE... What information must I include in my draft business plan? If you must submit a draft business plan... described in the savings association's draft business plan; and (d) Demonstrate how applicable...

  7. 25 CFR 170.411 - What may a long-range transportation plan include?

    Science.gov (United States)

    2010-04-01

    ... RESERVATION ROADS PROGRAM Planning, Design, and Construction of Indian Reservation Roads Program Facilities Long-Range Transportation Planning § 170.411 What may a long-range transportation plan include? A...) Social and economic development planning to identify transportation improvements or needs to accommodate...

  8. 40 CFR 60.3012 - What should I include in my waste management plan?

    Science.gov (United States)

    2010-07-01

    ... Compliance Times for Other Solid Waste Incineration Units That Commenced Construction On or Before December 9, 2004 Model Rule-Waste Management Plan § 60.3012 What should I include in my waste management plan? A waste management plan must include consideration of the reduction or separation of waste-stream...

  9. 34 CFR 76.104 - A State shall include certain certifications in its State plan.

    Science.gov (United States)

    2010-07-01

    ... 34 Education 1 2010-07-01 2010-07-01 false A State shall include certain certifications in its State plan. 76.104 Section 76.104 Education Office of the Secretary, Department of Education STATE... include certain certifications in its State plan. (a) A State shall include the following...

  10. 40 CFR 35.4140 - What must be included in my group's work plan?

    Science.gov (United States)

    2010-07-01

    ... Tag § 35.4140 What must be included in my group's work plan? (a) Your scope of work must clearly... 40 Protection of Environment 1 2010-07-01 2010-07-01 false What must be included in my group's work plan? 35.4140 Section 35.4140 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY GRANTS...

  11. Interconnections 180

    CERN Multimedia

    180

    2013-01-01

    The LHC's main magnets operate at a temperature of 1.9 K (-271.3°C), colder than the 2.7 K (-270.5°C) of outer space. This ensures that the cables supplying power to the magnets operate in a superconducting state; they conduct electricity with no resistance. The cold magnets are insulated from the surrounding tunnel – kept at room temperature – with multiple layers of thermal insulation. Over the next 18 months, 1695 interconnections between LHC magnets will be opened and their insulation consolidated. In the video above, narrated by Jean-Philippe Tock of the Technology department, technicians demonstrate the process on an interconnection between spare LHC magnets. A "W bellows" system slides out of the way to reveal accelerator components inside. The technicians add aluminium sheeting and further insulating material before closing the W bellows for a leak-proof connection. The section is then brought to a pressure of 10-6 mbar, to further limit the possibility of heat leaks from the cold magnets. Insul...

  12. 40 CFR 262.105 - What must be included in the laboratory environmental management plan?

    Science.gov (United States)

    2010-07-01

    ... policy, signed by the University's senior management, which must include commitments to regulatory...) Policies and procedures for managing environmental documents and records applicable to this Environmental... identified in the Environmental Management Plan must be informed of relevant policies, procedures or...

  13. Low power interconnect design

    CERN Document Server

    Saini, Sandeep

    2015-01-01

    This book provides practical solutions for delay and power reduction for on-chip interconnects and buses.  It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system.  Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.   ·         Provides practical solutions for delay and power reduction for on-chip interconnects and buses; ·         Focuses on Deep Sub micron technology devices and interconnects; ·         Offers in depth analysis of delay, including details regarding crosstalk and parasitics;  ·         Describes use of the Schmitt Trigger as a versatile alternative approach to buffer insertion for del...

  14. Interconnection networks

    Science.gov (United States)

    Faber, V.; Moore, J.W.

    1988-06-20

    A network of interconnected processors is formed from a vertex symmetric graph selected from graphs GAMMA/sub d/(k) with degree d, diameter k, and (d + 1)exclamation/ (d /minus/ k + 1)exclamation processors for each d greater than or equal to k and GAMMA/sub d/(k, /minus/1) with degree d /minus/ 1, diameter k + 1, and (d + 1)exclamation/(d /minus/ k + 1)exclamation processors for each d greater than or equal to k greater than or equal to 4. Each processor has an address formed by one of the permutations from a predetermined sequence of letters chosen a selected number of letters at a time, and an extended address formed by appending to the address the remaining ones of the predetermined sequence of letters. A plurality of transmission channels is provided from each of the processors, where each processor has one less channel than the selected number of letters forming the sequence. Where a network GAMMA/sub d/(k, /minus/1) is provided, no processor has a channel connected to form an edge in a direction delta/sub 1/. Each of the channels has an identification number selected from the sequence of letters and connected from a first processor having a first extended address to a second processor having a second address formed from a second extended address defined by moving to the front of the first extended address the letter found in the position within the first extended address defined by the channel identification number. The second address is then formed by selecting the first elements of the second extended address corresponding to the selected number used to form the address permutations. 9 figs.

  15. Fuel cell system with interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Zhien; Goettler, Richard

    2016-12-20

    The present invention includes an integrated planar, series connected fuel cell system having electrochemical cells electrically connected via interconnects, wherein the anodes of the electrochemical cells are protected against Ni loss and migration via an engineered porous anode barrier layer.

  16. 45 CFR 286.75 - What must be included in the Tribal Family Assistance Plan?

    Science.gov (United States)

    2010-10-01

    ... ASSISTANCE (ASSISTANCE PROGRAMS), ADMINISTRATION FOR CHILDREN AND FAMILIES, DEPARTMENT OF HEALTH AND HUMAN... to specific populations, including teen parents and individuals who are transitioning off TANF... towards those goals; (6) Assurance that a 45-day public comment period on the Tribal TANF plan...

  17. Interconnectivity: Benefits and Challenges

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2010-09-15

    Access to affordable and reliable electricity supplies is a basic prerequisite for economic and social development, prosperity, health, education and all other aspects of modern society. Electricity can be generated both near and far from the consumption areas as transmission lines, grid interconnections and distribution systems can transport it to the final consumer. In the vast majority of countries, the electricity sector used to be owned and run by the state. The wave of privatisation and market introduction in a number of countries and regions which started in the late 1980's has in many cases involved unbundling of generation from transmission and distribution (T and D). This has nearly everywhere exposed transmission bottlenecks limiting the development of well-functioning markets. Transmission on average accounts for about 10-15% of total final kWh cost paid by the end-user but it is becoming a key issue for effective operation of liberalised markets and for their further development. An integrated and adequate transmission infrastructure is of utmost importance for ensuring the delivery of the most competitively priced electricity, including externalities, to customers, both near and far from the power generating facilities. In this report, the role of interconnectivity in the development of energy systems is examined with the associated socio-economic, environmental, financial and regulatory aspects that must be taken into account for successful interconnection projects.

  18. Centrality in Interconnected Multilayer Networks

    CERN Document Server

    De Domenico, Manlio; Omodei, Elisa; Gómez, Sergio; Arenas, Alex

    2013-01-01

    Real-world complex systems exhibit multiple levels of relationships. In many cases, they require to be modeled by interconnected multilayer networks, characterizing interactions on several levels simultaneously. It is of crucial importance in many fields, from economics to biology, from urban planning to social sciences, to identify the most (or the less) influent nodes in a network. However, defining the centrality of actors in an interconnected structure is not trivial. In this paper, we capitalize on the tensorial formalism, recently proposed to characterize and investigate this kind of complex topologies, to show how several centrality measures -- well-known in the case of standard ("monoplex") networks -- can be extended naturally to the realm of interconnected multiplexes. We consider diagnostics widely used in different fields, e.g., computer science, biology, communication and social sciences, to cite only some of them. We show, both theoretically and numerically, that using the weighted monoplex obta...

  19. In-memory interconnect protocol configuration registers

    Energy Technology Data Exchange (ETDEWEB)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  20. In-memory interconnect protocol configuration registers

    Science.gov (United States)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  1. 'Including health in systems responsible for urban planning': a realist policy analysis research programme.

    Science.gov (United States)

    Harris, Patrick; Friel, Sharon; Wilson, Andrew

    2015-07-23

    Realist methods are increasingly being used to investigate complex public health problems. Despite the extensive evidence base clarifying the built environment as a determinant of health, there is limited knowledge about how and why land-use planning systems take on health concerns. Further, the body of research related to the wider determinants of health suffers from not using political science knowledge to understand how to influence health policy development and systems. This 4-year funded programme of research investigates how the land-use planning system in New South Wales, Australia, incorporates health and health equity at multiple levels. The programme uses multiple qualitative methods to develop up to 15 case studies of different activities of the New South Wales land-use planning system. Comparison cases from other jurisdictions will be included where possible and useful. Data collection includes publicly available documentation and purposively sampled stakeholder interviews and focus groups of up to 100 participants across the cases. The units of analysis in each case are institutional structures (rules and mandates constraining and enabling actors), actors (the stakeholders, organisations and networks involved, including health-focused agencies), and ideas (policy content, information, and framing). Data analysis will focus on and develop propositions concerning the mechanisms and conditions within and across each case leading to inclusion or non-inclusion of health. Data will be refined using additional political science and sociological theory. Qualitative comparative analysis will compare cases to develop policy-relevant propositions about the necessary and sufficient conditions needed to include health issues. Ethics has been approved by Sydney University Human Research Ethics Committee (2014/802 and 2015/178). Given the nature of this research we will incorporate stakeholders, often as collaborators, throughout. We outline our research translation

  2. Last electrical interconnections

    CERN Multimedia

    CERN audiovisual service

    2009-01-01

    Sector 3-4 was closely followed by Sector 5-6, where interconnections were completely closed two days later. All the helium pressure release ports were installed in the sector back in April, but the sector remained open so that tests and repairs could be made on the copper stabilized busbar interconnections: in total ten busbar interconnections were repaired.

  3. Including oxygen enhancement ratio in ion beam treatment planning: model implementation and experimental verification

    Science.gov (United States)

    Scifoni, E.; Tinganelli, W.; Weyrather, W. K.; Durante, M.; Maier, A.; Krämer, M.

    2013-06-01

    We present a method for adapting a biologically optimized treatment planning for particle beams to a spatially inhomogeneous tumor sensitivity due to hypoxia, and detected e.g., by PET functional imaging. The TRiP98 code, established treatment planning system for particles, has been extended for including explicitly the oxygen enhancement ratio (OER) in the biological effect calculation, providing the first set up of a dedicated ion beam treatment planning approach directed to hypoxic tumors, TRiP-OER, here reported together with experimental tests. A simple semi-empirical model for calculating the OER as a function of oxygen concentration and dose averaged linear energy transfer, generating input tables for the program is introduced. The code is then extended in order to import such tables coming from the present or alternative models, accordingly and to perform forward and inverse planning, i.e., predicting the survival response of differently oxygenated areas as well as optimizing the required dose for restoring a uniform survival effect in the whole irradiated target. The multiple field optimization results show how the program selects the best beam components for treating the hypoxic regions. The calculations performed for different ions, provide indications for the possible clinical advantages of a multi-ion treatment. Finally the predictivity of the code is tested through dedicated cell culture experiments on extended targets irradiation using specially designed hypoxic chambers, providing a qualitative agreement, despite some limits in full survival calculations arising from the RBE assessment. The comparison of the predictions resulting by using different model tables are also reported.

  4. Multi-net optimization of VLSI interconnect

    CERN Document Server

    Moiseev, Konstantin; Wimer, Shmuel

    2015-01-01

    This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimal...

  5. Integrated Optical Interconnect Architectures for Embedded Systems

    CERN Document Server

    Nicolescu, Gabriela

    2013-01-01

    This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.   Provides state-of-the-art research on the use of optical interconnects in Embedded Systems; Begins with coverage of the basics for high-performance computing and optical interconnect; Includes a variety of on-chip optical communication topologies; Features coverage of system integration and opti...

  6. 43 CFR 11.31 - What does the Assessment Plan include?

    Science.gov (United States)

    2010-10-01

    ... performed pursuant to the NCP. (4) The Assessment Plan shall contain procedures and schedules for sharing... listed in the NCP and applicable EPA guidance for quality control and quality assurance plans; (3)...

  7. Fast thermal simulations and temperature optimization for hyperthermia treatment planning, including realistic 3D vessel networks.

    Science.gov (United States)

    Kok, H P; van den Berg, C A T; Bel, A; Crezee, J

    2013-10-01

    Accurate thermal simulations in hyperthermia treatment planning require discrete modeling of large blood vessels. The very long computation time of the finite difference based DIscrete VAsculature model (DIVA) developed for this purpose is impractical for clinical applications. In this work, a fast steady-state thermal solver was developed for simulations with realistic 3D vessel networks. Additionally, an efficient temperature-based optimization method including the thermal effect of discrete vasculature was developed. The steady-state energy balance for vasculature and tissue was described by a linear system, which was solved with an iterative method on the graphical processing unit. Temperature calculations during optimization were performed by superposition of several precomputed temperature distributions, calculated with the developed thermal solver. The thermal solver and optimization were applied to a human anatomy, with the prostate being the target region, heated with the eight waveguide 70 MHz AMC-8 system. Realistic 3D pelvic vasculature was obtained from angiography. Both the arterial and venous vessel networks consisted of 174 segments and 93 endpoints with a diameter of 1.2 mm. Calculation of the steady-state temperature distribution lasted about 3.3 h with the original DIVA model, while the newly developed method took only ≈ 1-1.5 min. Temperature-based optimization with and without taking the vasculature into account showed differences in optimized waveguide power of more than a factor 2 and optimized tumor T90 differed up to ≈ 0.5°C. This shows the necessity to take discrete vasculature into account during optimization. A very fast method was developed for thermal simulations with realistic 3D vessel networks. The short simulation time allows online calculations and makes temperature optimization with realistic vasculature feasible, which is an important step forward in hyperthermia treatment planning.

  8. Nanophotonic Devices for Optical Interconnect

    DEFF Research Database (Denmark)

    Van Thourhout, D.; Spuesens, T.; Selvaraja, S.K.;

    2010-01-01

    We review recent progress in nanophotonic devices for compact optical interconnect networks. We focus on microdisk-laser-based transmitters and discuss improved design and advanced functionality including all-optical wavelength conversion and flip-flops. Next we discuss the fabrication uniformity...... of the passive routing circuits and their thermal tuning. Finally, we discuss the performance of a wavelength selective detector....

  9. New transmission interconnection reduces consumer costs

    Energy Technology Data Exchange (ETDEWEB)

    Anon.

    2008-09-15

    The Central American electric interconnection system (SIEPAC) project will involve the construction of a 1830 km 230 kV transmission system that will link Guatemala, El Salvador, Honduras, Costa Rica, Nicaragua, and Panama. The system is expected to alleviate the region's power shortages and reduce electricity costs for consumers. Costs for the SIEPAC project have been estimated at $370 million. The system will serve approximately 37 million customers, and will include 15 substations. The contract for building the electrical equipment has been awarded to Schweitzer Engineering Laboratories (SEL) who plan to manufacture components at a plant in Mexico. The equipment will include high speed line protection, automation, and control systems. Line current differential systems and satellite-synchronized clocks will also be used. The new transmission system is expected to be fully operational by 2009. 1 fig.

  10. 34 CFR 611.2 - What management plan must be included in a Teacher Quality Enhancement Grants Program application?

    Science.gov (United States)

    2010-07-01

    ... TEACHER QUALITY ENHANCEMENT GRANTS PROGRAM General Provisions § 611.2 What management plan must be... 34 Education 3 2010-07-01 2010-07-01 false What management plan must be included in a Teacher Quality Enhancement Grants Program application? 611.2 Section 611.2 Education Regulations of the Offices...

  11. 29 CFR 778.214 - Benefit plans; including profit-sharing plans or trusts providing similar benefits.

    Science.gov (United States)

    2010-07-01

    ... fide plan for providing old age, retirement, life, accident, or health insurance or similar benefits... such employees. Accordingly, reference should be made to § 5.32 of this title as well as to § 778.215... satisfaction of his obligation to provide the specified benefits are also excludable from the regular rate...

  12. Final Restoration Plan for Rose Atoll National Wildlife Refuge, including Environmental Assessment

    Data.gov (United States)

    US Fish and Wildlife Service, Department of the Interior — The Restoration Plan for Rose Atoll NWR consists of removing the metal debris remaining from the grounding of a Taiwanese fishing vessel in 1993, and monitoring the...

  13. Wildlife Inventory Plan : Clarence Cannon National Wildlife Refuge including Delair and Gardner Divisions

    Data.gov (United States)

    US Fish and Wildlife Service, Department of the Interior — The Clarence Cannon National Wildlife Refuge Wildlife Inventory Plan outlines the strategy, techniques and purpose of a wildlife inventory on the Refuge. Futhermore...

  14. Corrective distal radius osteotomy: including bilateral differences in 3-D planning.

    Science.gov (United States)

    Dobbe, J G G; Vroemen, J C; Strackee, S D; Streekstra, G J

    2013-07-01

    After a fracture of the distal radius, the bone segments may heal in a suboptimal position. This condition may lead to a reduced hand function, pain and finally osteoarthritis, sometimes requiring corrective surgery. Recent studies report computer-assisted 3-D planning techniques in which the mirrored contralateral unaffected radius serves as reference for planning the position of the distal radius before corrective osteotomy surgery. Bilateral asymmetry, however, may introduce length errors into this type of preoperative planning that can be compensated for by taking into account the concomitant ulnae asymmetry. This article investigates a method for planning a correction osteotomy of the distal radius, while compensating for bilateral length differences using a linear regression model that describes the relationship between radii and ulnae asymmetry. The method is evaluated quantitatively using CT scans of 20 healthy individuals, and qualitatively using CT scans of patients suffering from a malunion of the distal radius. The improved planning method reduces absolute length deviations by a factor of two and markedly reduces positioning variation, from 2.9 ± 2.1 to 1.5 ± 0.6 mm. We expect the method to be of great value for future 3-D planning of a corrective distal radius osteotomy.

  15. System-Cost-Optimized Smart EVSE for Residential Application: Final Technical Report including Manufacturing Plan

    Energy Technology Data Exchange (ETDEWEB)

    Zhu, Charles [Delta Products, Triangle Park, NC (United States)

    2015-05-15

    In the 2nd quarter of 2012, a program was formally initiated at Delta Products to develop smart-grid-enabled Electric Vehicle Supply Equipment (EVSE) product for residential use. The project was funded in part by the U.S. Department of Energy (DOE), under award DE-OE0000590. Delta products was the prime contractor to DOE during the three year duration of the project. In addition to Delta Products, several additional supplier-partners were engaged in this research and development (R&D) program, including Detroit Edison DTE, Mercedes Benz Research and Development North America, and kVA. This report summarizes the program and describes the key research outcomes of the program. A technical history of the project activities is provided, which describes the key steps taken in the research and the findings made at successive stages in the multi-stage work. The evolution of an EVSE prototype system is described in detail, culminating in prototypes shipped to Department of Energy Laboratories for final qualification. After the program history is reviewed, the key attributes of the resulting EVSE are described in terms of functionality, performance, and cost. The results clearly demonstrate the ability of this EVSE to meet or exceed DOE's targets for this program, including: construction of a working product-intent prototype of a smart-grid-enabled EVSE, with suitable connectivity to grid management and home-energy management systems, revenue-grade metering, and related technical functions; and cost reduction of 50% or more compared to typical market priced EVSEs at the time of DOE's funding opportunity announcement (FOA), which was released in mid 2011. In addition to meeting all the program goals, the program was completed within the original budget and timeline established at the time of the award. The summary program budget and timeline, comparing plan versus actual values, is provided for reference, along with several supporting explanatory notes. Technical

  16. Regulatory Issues Surrounding Merchant Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Kuijlaars, Kees-Jan; Zwart, Gijsbert [Office for Energy Regulation (DTe), The Hague (Netherlands)

    2003-11-01

    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections.

  17. Thin film interconnect processes

    Science.gov (United States)

    Malik, Farid

    Interconnects and associated photolithography and etching processes play a dominant role in the feature shrinkage of electronic devices. Most interconnects are fabricated by use of thin film processing techniques. Planarization of dielectrics and novel metal deposition methods are the focus of current investigations. Spin-on glass, polyimides, etch-back, bias-sputtered quartz, and plasma-enhanced conformal films are being used to obtain planarized dielectrics over which metal films can be reliably deposited. Recent trends have been towards chemical vapor depositions of metals and refractory metal silicides. Interconnects of the future will be used in conjunction with planarized dielectric layers. Reliability of devices will depend to a large extent on the quality of the interconnects.

  18. 21 CFR 822.10 - What must I include in my surveillance plan?

    Science.gov (United States)

    2010-04-01

    ... SERVICES (CONTINUED) MEDICAL DEVICES POSTMARKET SURVEILLANCE Postmarket Surveillance Plan § 822.10 What... answer the surveillance question, e.g., clinical parameters or outcomes; (d) The surveillance approach or... consent document, if applicable; (j) Institutional Review Board information, if applicable; (k)...

  19. 40 CFR 62.14431 - What must my waste management plan include?

    Science.gov (United States)

    2010-07-01

    ... POLLUTANTS Federal Plan Requirements for Hospital/Medical/Infectious Waste Incinerators Constructed on or... components of solid waste from the health care waste stream in order to reduce the amount of toxic emissions... American Hospital Association publication entitled “Ounce of Prevention: Waste Reduction Strategies...

  20. Zee electrical interconnect

    Science.gov (United States)

    Rust, Thomas M. (Inventor); Gaddy, Edward M. (Inventor); Herriage, Michael J. (Inventor); Patterson, Robert E. (Inventor); Partin, Richard D. (Inventor)

    2001-01-01

    An interconnect, having some length, that reliably connects two conductors separated by the length of the interconnect when the connection is made but in which one length if unstressed would change relative to the other in operation. The interconnect comprises a base element an intermediate element and a top element. Each element is rectangular and formed of a conducting material and has opposed ends. The elements are arranged in a generally Z-shape with the base element having one end adapted to be connected to one conductor. The top element has one end adapted to be connected to another conductor and the intermediate element has its ends disposed against the other end of the base and the top element. Brazes mechanically and electrically interconnect the intermediate element to the base and the top elements proximate the corresponding ends of the elements. When the respective ends of the base and the top elements are connected to the conductors, an electrical connection is formed therebetween, and when the conductors are relatively moved or the interconnect elements change length the elements accommodate the changes and the associated compression and tension forces in such a way that the interconnect does not mechanically fatigue.

  1. Hurricane Sandy science plan: impacts of storm surge, including disturbed estuarine and bay hydrology

    Science.gov (United States)

    Caskie, Sarah A.

    2013-01-01

    Hurricane Sandy devastated some of the most heavily populated eastern coastal areas of the Nation. With a storm surge peaking at more than 19 feet, the powerful landscape-altering destruction of Hurricane Sandy is a stark reminder of why the Nation must become more resilient to coastal hazards. In response to this natural disaster, the U.S. Geological Survey (USGS) received a total of $41.2 million in supplemental appropriations from the Department of the Interior (DOI) to support response, recovery, and rebuilding efforts. These funds support a science plan that will provide critical scientific information necessary to inform management decisions for recovery of coastal communities, and aid in preparation for future natural hazards. This science plan is designed to coordinate continuing USGS activities with stakeholders and other agencies to improve data collection and analysis that will guide recovery and restoration efforts. The science plan is split into five distinct themes: • Coastal topography and bathymetry • Impacts to coastal beaches and barriers

  2. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2017-04-04

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  3. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2016-05-03

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  4. The Importance of Documenting and Including Traditional Wisdom in Community-Based Ecotourism Planning

    Directory of Open Access Journals (Sweden)

    Vesna Đukić

    2017-01-01

    Full Text Available This article accords to the theory of community-based tourism, which represents a concept that respects natural and cultural resources of a particular community and encourages participation of its members in the process of tourist product creation. The article operates in the planning phase and aims to give insights into the process of establishing the groundwork for community-based tourism. The key element is documenting and illustrating everything that could be a part of what is known as “traditional wisdom,” namely, the skills and knowledge of traditional life practices. The methods of case study, content analysis, and observation of the village of Omoljica, Serbia, were used. The positive aspect of this locality is reflected in the existing short-term initiatives of organizations and individuals engaging in preserving traditional practices, but without systematic, long-term planning and management of community-based tourism, these individual efforts to revalue traditional life practices would stay unrecognizable and invisible for visitors and stakeholders. Thus, the main goal of this article is to understand the relation between short-term bottom-up initiatives and long-term top-down strategic planning of specific ecotourism destinations, one that would embrace the traditional ways of rural community life. The contribution of this study, in addition to documenting and illustrating “traditional wisdom” of the specific rural community placed in the protected area which encompasses a particular local social system, will be reflected in the creation of a set of guidelines for sustainable, rural, community-based ecotourism as a soft-driver development of protected areas near big cities of the postsocialist countries.

  5. Vocabulary of interconnections. Vocabulaire des interconnexions

    Energy Technology Data Exchange (ETDEWEB)

    1990-03-01

    A French vocabulary of terms used in the field of interconnection of electric power systems, is provided in order to standardize terminology at Hydro-Quebec. The vocabulary encompasses many subfields directly or indirectly related to interconnections, such as overhead lines, load forecasting, network operation, and interconnection contracts and conventions. International French terminology is adopted throughout, except for specifically North American realities for which new terms have been proposed. English equivalents of terms are provided for informative purposes and are not standardized. An index of the English terms is included. 128 refs.

  6. Partial Synchronization of Interconnected Boolean Networks.

    Science.gov (United States)

    Chen, Hongwei; Liang, Jinling; Lu, Jianquan

    2017-01-01

    This paper addresses the partial synchronization problem for the interconnected Boolean networks (BNs) via the semi-tensor product (STP) of matrices. First, based on an algebraic state space representation of BNs, a necessary and sufficient criterion is presented to ensure the partial synchronization of the interconnected BNs. Second, by defining an induced digraph of the partial synchronized states set, an equivalent graphical description for the partial synchronization of the interconnected BNs is established. Consequently, the second partial synchronization criterion is derived in terms of adjacency matrix of the induced digraph. Finally, two examples (including an epigenetic model) are provided to illustrate the efficiency of the obtained results.

  7. Cave Buttes Dam Master Plan, Phoenix, Arizona and Vicinity (Including New River).

    Science.gov (United States)

    1982-03-01

    Broom. This area is especially suitable for recreation trails. Just north of Jomax Road is a low area which contains a mesquite bosque . The shade and... Camino Park 40.00 40.00 0 McDowell Mountain Park 1,280.00 0 200.00 Tempe: Papago Park 450.00 56.00 0 Kiwanis Park 125.00 90.00 35.00 Wickenburg...and other support features are cost shareable items. 4a. Picnic Area. Picnic facilities are planned in a centrally located, densely vegetated bosque

  8. Interconnecting Urban Planning with Multi-Scale Urban Quality: Review of Macro Scale Urban Redevelopment Project on Micro Scale Urban Quality in Shenzhen

    NARCIS (Netherlands)

    Deng, X.

    2015-01-01

    The Shenzhen planning system has been effective in promoting economic growth through the prodigious urbanization of land. It has given priority to the ‘macro-level’ planning goals of economic growth through physical development. Questions can be raised about the physical and social outcomes from the

  9. Interconnecting Urban Planning with Multi-Scale Urban Quality: Review of Macro Scale Urban Redevelopment Project on Micro Scale Urban Quality in Shenzhen

    NARCIS (Netherlands)

    Deng, X.

    2015-01-01

    The Shenzhen planning system has been effective in promoting economic growth through the prodigious urbanization of land. It has given priority to the ‘macro-level’ planning goals of economic growth through physical development. Questions can be raised about the physical and social outcomes from the

  10. Welded solar cell interconnection

    Science.gov (United States)

    Stofel, E. J.; Browne, E. R.; Meese, R. A.; Vendura, G. J.

    1982-01-01

    The efficiency of the welding of solar-cell interconnects is compared with the efficiency of soldering such interconnects, and the cases in which welding may be superior are examined. Emphasis is placed on ultrasonic welding; attention is given to the solar-cell welding machine, the application of the welding process to different solar-cell configurations, producibility, and long-life performance of welded interconnects. Much of the present work has been directed toward providing increased confidence in the reliability of welding using conditions approximating those that would occur with large-scale array production. It is concluded that there is as yet insufficient data to determine which of three methods (soldering, parallel gap welding, and ultrasonic welding) provides the longest-duration solar panel life.

  11. 40 CFR 60.2065 - What should I include in my waste management plan?

    Science.gov (United States)

    2010-07-01

    ... include consideration of the reduction or separation of waste-stream elements such as paper, cardboard... 40 Protection of Environment 6 2010-07-01 2010-07-01 false What should I include in my waste... for Commercial and Industrial Solid Waste Incineration Units for Which Construction Is Commenced After...

  12. Potential roles of optical interconnections within broadband switching modules

    Science.gov (United States)

    Lalk, Gail R.; Habiby, Sarry F.; Hartman, Davis H.; Krchnavek, Robert R.; Wilson, Donald K.; Young, Kenneth C., Jr.

    1991-04-01

    An investigation of potential physical design bottlenecks in future broadband telecommunication switches has led to the identification of several areas where optical interconnections may play a role in the practical realization of required system performance. In the model used the speed and interconnection densities as well as requirements for ease-of-access and efficient power utilization challenge conventional partitioning and packaging strategies. Potential areas where optical interconnections may relieve some of the physical design bottlenecks include fiber management at the customer interface to the switch routing and distribution of high-density interconnections within the fabric of the switch and backplane interconnections to increase system throughput.

  13. Crosstalk in modern on-chip interconnects a FDTD approach

    CERN Document Server

    Kaushik, B K; Patnaik, Amalendu

    2016-01-01

    The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

  14. Carbon nanotubes for interconnects process, design and applications

    CERN Document Server

    Dijon, Jean; Maffucci, Antonio

    2017-01-01

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes c...

  15. Hierarchical production planning model in flexible job shop including a preemption and sequence-dependent setup times

    Directory of Open Access Journals (Sweden)

    Juan Carlos Osorio Gómez

    2010-04-01

    Full Text Available Production planning and control are complex problems for manufacturing organisations. Hierarchical production planning and control is one way to address the problem as it can reduce its complexity and reach good solutions in reasonable computational time. This paper presents a hierarchical approach to resolving production programming in a flexible job shop configuration; this problem includes pre-emption and sequence-dependent setup times. Al-though non-optimal (as expected, good solutions were obtained as shown in the validation of the method.

  16. Variation Tolerant On-Chip Interconnects

    CERN Document Server

    Nigussie, Ethiopia Enideg

    2012-01-01

    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  17. Optical Interconnects for Future Data Center Networks

    CERN Document Server

    Bergman, Keren; Tomkos, Ioannis

    2013-01-01

    Optical Interconnects for Future Data Center Networks covers optical networks and how they can provide high bandwidth, energy efficient interconnects with increased communication bandwidth. This volume, with contributions from leading researchers in the field, presents an integrated view of the expected future requirements of data centers and serves as a reference for some of the most advanced and promising solutions proposed by researchers from leading universities, research labs, and companies. The work also includes several novel architectures, each demonstrating different technologies such as optical circuits, optical switching, MIMO optical OFDM, and others. Additionally, Optical Interconnects for Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

  18. Interconnecting with VIPs

    Science.gov (United States)

    Collins, Robert

    2013-01-01

    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  19. QCD Interconnection Effects

    CERN Document Server

    Sjöstrand, Torbjörn

    1999-01-01

    Heavy objects like the W, Z and t are short-lived compared with typical hadronization times. When pairs of such particles are produced, the subsequent hadronic decay systems may therefore become interconnected. We study such potential effects at Linear Collider energies.

  20. Coplanar interconnection module

    Science.gov (United States)

    Steward, R. D.; Windsor, H. F.

    1970-01-01

    Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.

  1. 40 CFR 60.2630 - What should I include in my waste management plan?

    Science.gov (United States)

    2010-07-01

    ... of waste-stream elements such as paper, cardboard, plastics, glass, batteries, or metals; or the use... 40 Protection of Environment 6 2010-07-01 2010-07-01 false What should I include in my waste... Compliance Times for Commercial and Industrial Solid Waste Incineration Units that Commenced Construction On...

  2. Random walk centrality in interconnected multilayer networks

    CERN Document Server

    Solé-Ribalta, Albert; Gómez, Sergio; Arenas, Alex

    2015-01-01

    Real-world complex systems exhibit multiple levels of relationships. In many cases they require to be modeled as interconnected multilayer networks, characterizing interactions of several types simultaneously. It is of crucial importance in many fields, from economics to biology and from urban planning to social sciences, to identify the most (or the less) influential nodes in a network using centrality measures. However, defining the centrality of actors in interconnected complex networks is not trivial. In this paper, we rely on the tensorial formalism recently proposed to characterize and investigate this kind of complex topologies, and extend two well known random walk centrality measures, the random walk betweenness and closeness centrality, to interconnected multilayer networks. For each of the measures we provide analytical expressions that completely agree with numerically results.

  3. Interconnecting Urban Planning with Multi-Scale Urban Quality: Review of Macro Scale Urban Redevelopment Project on Micro Scale Urban Quality in Shenzhen

    OpenAIRE

    Deng, X.

    2015-01-01

    The Shenzhen planning system has been effective in promoting economic growth through the prodigious urbanization of land. It has given priority to the ‘macro-level’ planning goals of economic growth through physical development. Questions can be raised about the physical and social outcomes from the development process at the ‘micro-level’, not least in the level of ‘quality’ of the physical environment at the micro scale and the creation of a ‘place identity’ (Chen, 2010; Hang, 2006; Wu, 201...

  4. Smart Voyage Planning Model Sensitivity Analysis Using Ocean and Atmospheric Models Including Ensemble Methods

    Science.gov (United States)

    2012-09-01

    ATMOSPHERIC MODELS INCLUDING ENSEMBLE METHODS Scott E. Miller Lieutenant Commander, United States Navy B.S., University of South Carolina, 2000 B.S...Typical gas turbine fuel consumption curve and relationship to sea state .......51  Figure 16.  DDG 58 speed reduction curves for bow seas...Day Time Group ECDIS-N Electronic Chart Display and Information System – Navy ECMWF European Center for Medium Range Weather Forecasts EFAS

  5. Types of solutions improving passenger transport interconnectivity

    Directory of Open Access Journals (Sweden)

    Monika BĄK

    2012-01-01

    Full Text Available The objective of the paper is to present different types of solutions which could improve interconnectivity of passenger transport especially within interconnections between long and short transport distance. The topic has particular relevance at the European level because the European transport networks’ role as integrated international networks is compromised by poor interconnectivity and because the next generation of European transport policies will have to be sensitive to the differences between short, medium and long-term transport markets and the market advantages of each transport mode. In this context, a realistic assessment of intermodal opportunities is a key ingredient to future policy development.Effective interconnection requires the provision of integrated networks and services which are attractive to potential users and this is likely to require co-operation between a range of authorities and providers in the public and private sectors and may necessitate a wider vision than might otherwise prevail.The paper is based on the results of the project realised by the team of the University of Gdansk in the EU funded 7 Framework Programme - INTERCONNECT (Interconnection between short- and long-distance transport networks with partners in the UK, Germany, Denmark, Poland, Spain and Italy. Different types of solutions will be summarized in the paper including e.g. local link infrastructure solutions, improved local public transport services, improvements at the interchange, solutions involving improved procedures for check-in or luggage transfer & documentation, pricing and ticketing solutions, solutions involving marketing, information and sales.

  6. Photovoltaic sub-cell interconnects

    Energy Technology Data Exchange (ETDEWEB)

    van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

    2017-05-09

    Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

  7. Electromagnetism and interconnections

    CERN Document Server

    Charruau, S

    2009-01-01

    This book covers the theoretical problems of modeling electrical behavior of the interconnections encountered in everyday electronic products. The coverage shows the theoretical tools of waveform prediction at work in the design of a complex and high-speed digital electronic system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or the development of simulation tools software for high speed electronic system design automation will find this book an illuminating resource.

  8. Interconnected network of cameras

    Science.gov (United States)

    Hosseini Kamal, Mahdad; Afshari, Hossein; Leblebici, Yusuf; Schmid, Alexandre; Vandergheynst, Pierre

    2013-02-01

    The real-time development of multi-camera systems is a great challenge. Synchronization and large data rates of the cameras adds to the complexity of these systems as well. The complexity of such system also increases as the number of their incorporating cameras increases. The customary approach to implementation of such system is a central type, where all the raw stream from the camera are first stored then processed for their target application. An alternative approach is to embed smart cameras to these systems instead of ordinary cameras with limited or no processing capability. Smart cameras with intra and inter camera processing capability and programmability at the software and hardware level will offer the right platform for distributed and parallel processing for multi- camera systems real-time application development. Inter camera processing requires the interconnection of smart cameras in a network arrangement. A novel hardware emulating platform is introduced for demonstrating the concept of the interconnected network of cameras. A methodology is demonstrated for the interconnection network of camera construction and analysis. A sample application is developed and demonstrated.

  9. Elective breast radiotherapy including level I and II lymph nodes: A planning study with the humeral head as planning risk volume.

    Science.gov (United States)

    Surmann, Kathrin; van der Leer, Jorien; Branje, Tammy; van der Sangen, Maurice; van Lieshout, Maarten; Hurkmans, Coen W

    2017-01-18

    The aim of this study was to assess the dose to the humeral head planning risk volume with the currently used high tangential fields (HTF) and compare different planning techniques for breast radiotherapy including axillary level I and II lymph nodes (PTVn) while sparing the humeral head. Ten patients with left-sided breast cancer were enrolled in a planning study with 16 fractions of 2.66 Gy. Four planning techniques were compared: HTF, HTF with sparing of the humeral head, 6-field IMRT with sparing of the humeral head and VMAT with sparing of the humeral head. The humeral head + 10 mm was spared by restricting V40Gy HTF (V40Gy on average 20.7 cc). When sparing the humeral head in HTF, PTVn V90% decreased significantly from 97.9% to 89.4%. 6-field IMRT and VMAT had a PTVn V90% of 98.2% and 99.5% respectively. However, dose to the lungs, heart and especially the contralateral breast increased with VMAT. The humeral head is rarely spared when using HTF. When sparing the humeral head, the 6-field IMRT technique leads to adequate PTV coverage while not increasing the dose to the OARs.

  10. EUROPEAN ENERGY INTERCONNECTION EFFECTS ON THE ROMANIAN ECONOMY

    Directory of Open Access Journals (Sweden)

    Ionescu Mihaela

    2014-07-01

    Full Text Available In this paper the author wants to exemplify the extent to which economic growth in Romania is influenced by the current power system infrastructure investments in Europe. Electricity transmission infrastructure in Romania is at a turning point. The high level of security of supply, delivery efficiency in a competitive internal market are dependent on significant investment, both within the country and across borders. Since the economic crisis makes investment financing is increasingly difficult, it is necessary that they be targeted as well. The European Union has initiated the “Connecting Europe” through which investments are allocated to European energy network interconnection of energy. The action plan for this strategy will put a greater emphasis on investments that require hundreds of billions of euro in new technologies, infrastructure, improve energy intensity, low carbon energy technologies. Romania's energy challenge will depend on the new interconnection modern and smart, both within the country and other European countries, energy saving practices and technologies. This challenge is particularly important as Romania has recovered severe gaps in the level of economic performance compared to developed countries. Such investment will have a significant impact on transmission costs, especially electricity, while network tariffs will rise slightly. Some costs will be higher due to support programs in renewable energy nationwide.Measures are more economically sustainable to maintain or even reinforce the electricity market, which system can be flexible in order to address any issues of adequacy. These measures include investments in border infrastructure (the higher the network, so it is easier to evenly distribute energy from renewable sources, to measure demand response and energy storage solutions.An integrated European infrastructure will ensure economic growth in countries interconnected and thus Romania. Huge energy potential of

  11. Interconnection policy: a theoretical survey

    Directory of Open Access Journals (Sweden)

    César Mattos

    2003-01-01

    Full Text Available This article surveys the theoretical foundations of interconnection policy. The requirement of an interconnection policy should not be taken for granted in all circumstances, even considering the issue of network externalities. On the other hand, when it is required, an encompassing interconnection policy is usually justified. We provide an overview of the theory on interconnection pricing that results in several different prescriptions depending on which problem the regulator aims to address. We also present a survey on the literature on two-way interconnection.

  12. Advancement of photonic interconnects for spaceborne systems

    Science.gov (United States)

    Bristow, Julian P.; Lehman, John A.; Morgan, Robert A.; Deruiter, John L.

    1997-07-01

    Optical interconnects have long promised significant advantages over their electrical counterparts. Specific advantages include increased bandwidths at long (ten meters or more) interconnection distances, immunity to EMI effects, negligible crosstalk, reduced size, and lower weight. Optical interconnects have been developed for, and are being used in, a range of ground based and aircraft applications, however they are only now beginning to gain acceptance in spaceborne systems. In addition to the maturity demanded from components destined for ground-based applications and the wider temperature excursions characteristic of airborne applications, spaceborne components must also be able to survive the radiation environments associated with their intended applications. The additional qualification required has resulted in delayed introduction of photonic interconnects. We describe the tradeoffs involved in implementing for the first time a spaceborne fiber optic data bus with a clock speed of 1.2 Gbps. The tradeoffs include emitter, detectors, fiber, connectors and packaging. We have selected a series of commercial grade optoelectronic devices which were then qualified for use in spaceborne environments and have developed a space quantifiable packaging scheme. We have designed and implemented the optoelectronic subsystem of the data bus and have simulated its operation. We also describe recent advances in Vertical Cavity Surface Emitting Lasers (VCSELs) for spaceborne databuses. VCSELs also offer advantages in simplicity of packaging and electronic control. We summarize available initial radiation data on these devices and project their impact on spaceborne photonic interconnects.

  13. SIP Trunking — General Requirements for Interconnecting Enterprise Networks

    Directory of Open Access Journals (Sweden)

    Stephan Massner

    2013-10-01

    Full Text Available Based on defined User-to-Network Interconnection (UNI as well as Network-to-Network Interconnection (NNI types various interconnection modes are practicable. These modes allow a further description of interconnection models as well as architecture models including interconnection functions and related interfaces. Topics covered in this article comprise functional entities and related interfaces interconnecting Internet Protocol (IP network domains as well as interfaces between these border functions. Mainly focussed functionalities are Session Border Controllers (SBC from various vendors handling Voice over IP (VoIP session control traffic, SIP traffic specifically. Furthermore, partial and not standardised topics belonging to sub-functions and reference points are disclosed. Prerequisites in view of the continuous work are treated of beyond analyses and classifications of standardisation even if not all open-end questions can be answered completely in subsequent studies 

  14. Optical transceivers for interconnections in satellite payloads

    Science.gov (United States)

    Karppinen, Mikko; Heikkinen, Veli; Juntunen, Eveliina; Kautio, Kari; Ollila, Jyrki; Sitomaniemi, Aila; Tanskanen, Antti

    2013-02-01

    The increasing data rates and processing on board satellites call for the use of photonic interconnects providing high-bitrate performance as well as valuable savings in mass and volume. Therefore, optical transmitter and receiver technology is developed for aerospace applications. The metal-ceramic-packaging with hermetic fiber pigtails enables robustness for the harsh spacecraft environment, while the 850-nm VCSEL-based transceiver technology meets the high bit-rate and low power requirements. The developed components include 6 Gbps SpaceFibre duplex transceivers for intra-satellite data links and 40 Gbps parallel optical transceivers for board-to-board interconnects. Also, integration concept of interchip optical interconnects for onboard processor ICs is presented.

  15. Developing Generic Dynamic Models for the 2030 Eastern Interconnection Grid

    Energy Technology Data Exchange (ETDEWEB)

    Kou, Gefei [ORNL; Hadley, Stanton W [ORNL; Markham, Penn N [ORNL; Liu, Yilu [ORNL

    2013-12-01

    The Eastern Interconnection Planning Collaborative (EIPC) has built three major power flow cases for the 2030 Eastern Interconnection (EI) based on various levels of energy/environmental policy conditions, technology advances, and load growth. Using the power flow cases, this report documents the process of developing the generic 2030 dynamic models using typical dynamic parameters. The constructed model was validated indirectly using the synchronized phasor measurements by removing the wind generation temporarily.

  16. Fuel cell electrode interconnect contact material encapsulation and method

    Science.gov (United States)

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

    2016-05-31

    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  17. Interconnection of subsystems in closed-loop systems

    DEFF Research Database (Denmark)

    Niemann, Hans Henrik; Poulsen, Niels Kjølstad

    2009-01-01

    The focus in this paper is analysis of stability and controller design for interconnected systems. This includes both the case with known and unknown interconnected sub-system. The key element in both the stability analysis and controller design is the application of the Youla-Jabr-Bongiorno-Kuce...

  18. Self-management interventions including action plans for exacerbations versus usual care in patients with chronic obstructive pulmonary disease.

    Science.gov (United States)

    Lenferink, Anke; Brusse-Keizer, Marjolein; van der Valk, Paul Dlpm; Frith, Peter A; Zwerink, Marlies; Monninkhof, Evelyn M; van der Palen, Job; Effing, Tanja W

    2017-08-04

    Chronic Obstructive Pulmonary Disease (COPD) self-management interventions should be structured but personalised and often multi-component, with goals of motivating, engaging and supporting the patients to positively adapt their behaviour(s) and develop skills to better manage disease. Exacerbation action plans are considered to be a key component of COPD self-management interventions. Studies assessing these interventions show contradictory results. In this Cochrane Review, we compared the effectiveness of COPD self-management interventions that include action plans for acute exacerbations of COPD (AECOPD) with usual care. To evaluate the efficacy of COPD-specific self-management interventions that include an action plan for exacerbations of COPD compared with usual care in terms of health-related quality of life, respiratory-related hospital admissions and other health outcomes. We searched the Cochrane Airways Group Specialised Register of trials, trials registries, and the reference lists of included studies to May 2016. We included randomised controlled trials evaluating a self-management intervention for people with COPD published since 1995. To be eligible for inclusion, the self-management intervention included a written action plan for AECOPD and an iterative process between participant and healthcare provider(s) in which feedback was provided. We excluded disease management programmes classified as pulmonary rehabilitation or exercise classes offered in a hospital, at a rehabilitation centre, or in a community-based setting to avoid overlap with pulmonary rehabilitation as much as possible. Two review authors independently assessed trial quality and extracted data. We resolved disagreements by reaching consensus or by involving a third review author. Study authors were contacted to obtain additional information and missing outcome data where possible. When appropriate, study results were pooled using a random-effects modelling meta-analysis. The primary

  19. Visualizing interconnections among climate risks

    Science.gov (United States)

    Tanaka, K.; Yokohata, T.; Nishina, K.; Takahashi, K.; Emori, S.; Kiguchi, M.; Iseri, Y.; Honda, Y.; Okada, M.; Masaki, Y.; Yamamoto, A.; Shigemitsu, M.; Yoshimori, M.; Sueyoshi, T.; Hanasaki, N.; Ito, A.; Sakurai, G.; Iizumi, T.; Nishimori, M.; Lim, W. H.; Miyazaki, C.; Kanae, S.; Oki, T.

    2015-12-01

    It is now widely recognized that climate change is affecting various sectors of the world. Climate change impact on one sector may spread out to other sectors including those seemingly remote, which we call "interconnections of climate risks". While a number of climate risks have been identified in the Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5), there has been no attempt to explore their interconnections comprehensively. Here we present a first and most exhaustive visualization of climate risks drawn based on a systematic literature survey. Our risk network diagrams depict that changes in the climate system impact natural capitals (terrestrial water, crop, and agricultural land) as well as social infrastructures, influencing the socio-economic system and ultimately our access to food, water, and energy. Our findings suggest the importance of incorporating climate risk interconnections into impact and vulnerability assessments and call into question the widely used damage function approaches, which address a limited number of climate change impacts in isolation. Furthermore, the diagram is useful to educate decision makers, stakeholders, and general public about cascading risks that can be triggered by the climate change. Socio-economic activities today are becoming increasingly more inter-dependent because of the rapid technological progress, urbanization, and the globalization among others. Equally complex is the ecosystem that is susceptible to climate change, which comprises interwoven processes affecting one another. In the context of climate change, a number of climate risks have been identified and classified according to regions and sectors. These reports, however, did not fully address the inter-relations among risks because of the complexity inherent in this issue. Climate risks may ripple through sectors in the present inter-dependent world, posing a challenge ahead of us to maintain the resilience of the system. It is

  20. Large data centers interconnect bottlenecks.

    Science.gov (United States)

    Ghiasi, Ali

    2015-02-09

    Large data centers interconnect bottlenecks are dominated by the switch I/O BW and the front panel BW as a result of pluggable modules. To overcome the front panel BW and the switch ASIC BW limitation one approach is to either move the optics onto the mid-plan or integrate the optics into the switch ASIC. Over the last 4 years, VCSEL based optical engines have been integrated into the packages of large-scale HPC routers, moderate size Ethernet switches, and even FPGA's. Competing solutions based on Silicon Photonics (SiP) have also been proposed for integration into HPC and Ethernet switch packages but with better integration path through the use of TSV (Through Silicon Via) stack dies. Integrating either VCSEL or SiP based optical engines into complex ASIC package that operates at high temperatures, where the required reliability is not trivial, one should ask what is the technical or the economic advantage before embarking on such a complex integration. High density Ethernet switches addressing data centers currently in development are based on 25G NRZ signaling and QSFP28 optical module that can support up to 3.6 Tb of front panel bandwidth.

  1. Printed interconnects for photovoltaic modules

    Energy Technology Data Exchange (ETDEWEB)

    Fields, J. D.; Pach, G.; Horowitz, K. A. W.; Stockert, T. R.; Woodhouse, M.; van Hest, M. F. A. M.

    2017-01-01

    Film-based photovoltaic modules employ monolithic interconnects to minimize resistance loss and enhance module voltage via series connection. Conventional interconnect construction occurs sequentially, with a scribing step following deposition of the bottom electrode, a second scribe after deposition of absorber and intermediate layers, and a third following deposition of the top electrode. This method produces interconnect widths of about 300 um, and the area comprised by interconnects within a module (generally about 3%) does not contribute to power generation. The present work reports on an increasingly popular strategy capable of reducing the interconnect width to less than 100 um: printing interconnects. Cost modeling projects a savings of about $0.02/watt for CdTe module production through the use of printed interconnects, with savings coming from both reduced capital expense and increased module power output. Printed interconnect demonstrations with copper-indium-gallium-diselenide and cadmium-telluride solar cells show successful voltage addition and miniaturization down to 250 um. Material selection guidelines and considerations for commercialization are discussed.

  2. Optical interconnections to focal plane arrays

    Energy Technology Data Exchange (ETDEWEB)

    Rienstra, J.L.; Hinckley, M.K.

    2000-11-01

    The authors have successfully demonstrated an optical data interconnection from the output of a focal plane array to the downstream data acquisition electronics. The demonstrated approach included a continuous wave laser beam directed at a multiple quantum well reflectance modulator connected to the focal plane array analog output. The output waveform from the optical interconnect was observed on an oscilloscope to be a replica of the input signal. They fed the output of the optical data link to the same data acquisition system used to characterize focal plane array performance. Measurements of the signal to noise ratio at the input and output of the optical interconnection showed that the signal to noise ratio was reduced by a factor of 10 or more. Analysis of the noise and link gain showed that the primary contributors to the additional noise were laser intensity noise and photodetector receiver noise. Subsequent efforts should be able to reduce these noise sources considerably and should result in substantially improved signal to noise performance. They also observed significant photocurrent generation in the reflectance modulator that imposes a current load on the focal plane array output amplifier. This current loading is an issue with the demonstrated approach because it tends to negate the power saving feature of the reflectance modulator interconnection concept.

  3. Graph theory and interconnection networks

    CERN Document Server

    Hsu, Lih-Hsing

    2008-01-01

    The advancement of large scale integrated circuit technology has enabled the construction of complex interconnection networks. Graph theory provides a fundamental tool for designing and analyzing such networks. Graph Theory and Interconnection Networks provides a thorough understanding of these interrelated topics. After a brief introduction to graph terminology, the book presents well-known interconnection networks as examples of graphs, followed by in-depth coverage of Hamiltonian graphs. Different types of problems illustrate the wide range of available methods for solving such problems. The text also explores recent progress on the diagnosability of graphs under various models.

  4. A practical eco-environmental distribution network planning model including fuel cells and non-renewable distributed energy resources

    Energy Technology Data Exchange (ETDEWEB)

    Soroudi, Alireza [Department of Electrical Engineering, Sharif University of Technology, Tehran (Iran); Ehsan, Mehdi [Department of Electrical Engineering, Sharif University of Technology, Tehran (Iran); Center of Excellence in Power System Management and Control, Sharif University of Technology, Tehran (Iran); Zareipour, Hamidreza [Department of Electrical and Computer Engineering, University of Calgary, Alberta (Canada)

    2011-01-15

    This paper presents a long-term dynamic multi-objective planning model for distribution network expansion along with distributed energy options. The proposed model optimizes two objectives, namely costs and emissions and determines the optimal schemes of sizing, placement and specially the dynamics (i.e., timing) of investments on distributed generation units and network reinforcements over the planning period. An efficient two-stage heuristic method is proposed to solve the formulated planning problem. The effectiveness of the proposed model is demonstrated by applying it to a distribution network and comparing the simulation results with other methods and models. (author)

  5. Interconnecting PV on New York City's Secondary Network Distribution System

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, K; Coddington, M; Burman, K; Hayter, S; Kroposki, B; Watson, and A

    2009-11-01

    less expensive distributed PV system interconnections. To assess ways to improve the interconnection process, NREL conducted a four-part study with support from DOE. The NREL team then compiled the final reports from each study into this report. In Section 1PV Deployment Analysis for New York City we analyze the technical potential for rooftop PV systems in the city. This analysis evaluates potential PV power production in ten Con Edison networks of various locations and building densities (ranging from high density apartments to lower density single family homes). Next, we compare the potential power production to network loads to determine where and when PV generation is most likely to exceed network load and disrupt network protection schemes. The results of this analysis may assist Con Edison in evaluating future PV interconnection applications and in planning future network protection system upgrades. This analysis may also assist other utilities interconnecting PV systems to networks by defining a method for assessing the technical potential of PV in the network and its impact on network loads. Section 2. A Briefing for Policy Makers on Connecting PV to a Network Grid presents an overview intended for nontechnical stakeholders. This section describes the issues associated with interconnecting PV systems to networks, along with possible solutions. Section 3. Technical Review of Concerns and Solutions to PV Interconnection in New York City summarizes common concerns of utility engineers and network experts about interconnecting PV systems to secondary networks. This section also contains detailed descriptions of nine solutions, including advantages and disadvantages, potential impacts, and road maps for deployment. Section 4. Utility Application Process Reviewlooks at utility interconnection application processes across the country and identifies administrative best practices for efficient PV interconnection.

  6. Renewable Systems Interconnection: Executive Summary

    Energy Technology Data Exchange (ETDEWEB)

    Kroposki, B.; Margolis, R.; Kuswa, G.; Torres, J.; Bower, W.; Key, T.; Ton, D.

    2008-02-01

    The U.S. Department of Energy launched the Renewable Systems Interconnection (RSI) study in 2007 to address the challenges to high penetrations of distributed renewable energy technologies. The RSI study consists of 14 additional reports.

  7. SU-8 cantilever chip interconnection

    DEFF Research Database (Denmark)

    Johansson, Alicia Charlotte; Janting, Jakob; Schultz, Peter;

    2006-01-01

    the electrodes on the SU-8 chip to a printed circuit board. Here, we present two different methods of electrically connecting an SU-8 chip, which contains a microfluidic network and free-hanging mechanical parts. The tested electrical interconnection techniques are flip chip bonding using underfill or flip chip...... bonding using an anisotropic conductive film (ACF). These are both widely used in the Si industry and might also be used for the large scale interconnection of SU-8 chips. The SU-8 chip, to which the interconnections are made, has a microfluidic channel with integrated micrometer-sized cantilevers...... that can be used for label-free biochemical detection. All the bonding tests are compared with results obtained using similar Si chips. It is found that it is significantly more complicated to interconnect SU-8 than Si cantilever chips primarily due to the softness of SU-8....

  8. 76 FR 16405 - Notice of Attendance at PJM INterconnection, L.L.C., Meetings

    Science.gov (United States)

    2011-03-23

    ... Energy Regulatory Commission Notice of Attendance at PJM INterconnection, L.L.C., Meetings The Federal... Commission staff may attend upcoming PJM Interconnection, L.L.C., (PJM) meetings, as well as other... proceedings before the Commission including the following: Docket No. EL05-121, PJM Interconnection,...

  9. Architecture for on-die interconnect

    Science.gov (United States)

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.

    2016-03-15

    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  10. Misalignment corrections in optical interconnects

    Science.gov (United States)

    Song, Deqiang

    Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or

  11. 47 CFR 64.1401 - Expanded interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Expanded interconnection. 64.1401 Section 64...) MISCELLANEOUS RULES RELATING TO COMMON CARRIERS Expanded Interconnection § 64.1401 Expanded interconnection. (a... 69, subpart G of this chapter, shall offer expanded interconnection for interstate special...

  12. Family planning as part of reproductive health, including the HIV / AIDS aspects, in Zimbabwe and Southern Africa

    NARCIS (Netherlands)

    Verkuyl, Douwe Arie Anne

    2003-01-01

    This thesis explores the demand for family planning (FP) in the region and demonstrates that just at the time that demand takes off the brain drain and economic situation make it unlikely that the required services will be provided. This, increasingly, results in unsafe abortions. FP in Zimbabwe is

  13. Including parameterization of the discrete ablation process into a planning and simulation environment for robot-assisted laser osteotomy.

    Science.gov (United States)

    Burgner, Jessica; Kahrs, Lüder Alexander; Raczkowsky, Jörg; Wörn, Heinz

    2009-01-01

    Material processing using laser became a widely used method especially in the scope of industrial automation. The systems are mostly based on a precise model of the laser process and the according parameterization. Beside the industrial use the laser as an instrument to treat human tissue has become an integral part in medicine as well. Human tissue as an inhomogeneous material to process, poses the question of how to determine a model, which reflects the interaction processes with a specific laser.Recently it could be shown that the pulsed CO2 laser is suitable to ablate bony and cartilage tissue. Until now this thermo-mechanical bone ablation is not characterized as a discrete process. In order to plan and simulate the ablation process in the correct level of detail, the parameterization is indispensable. We developed a planning and simulation environment, determined parameters by confocal measurements of bony specimen and use these results to transfer planned cutting trajectories into a pulse sequence and corresponding robot locations.

  14. Manufacturing of planar ceramic interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R. [Pacific Northwest National Lab., Richland, WA (United States)

    1996-12-31

    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  15. High-speed photonics interconnects

    CERN Document Server

    Chrostowski, Lukas

    2013-01-01

    Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed

  16. Modeling the individual plants for the planning of the energetic operation of the national interconnected power system; Uma modelagem a usinas individualizadas para o planejamento da operacao energetica do sistema interligado nacional

    Energy Technology Data Exchange (ETDEWEB)

    Marques, T.C.; Cruz Junior, G.; Vinhal, C. [Universidade Federal de Goias (UFG), Goiania, GO (Brazil). Escola de Engenharia Eletrica e de Computacao], Emails: thyago@eeec.ufg.br, gcruz@eeec.ufg.br, vinhal@eeec.ufg.br

    2009-07-01

    This paper presents an operational policy for the mid term hydrothermal scheduling of the Brazilian Interconnected Power System (BIPS) based on the individual representation of the hydro and thermo power plants, the detailed representation of the plants' features and the indirect representation of the inflow stochasticity through a forecasting model. These characteristics differs the operational policy which is in use nowadays in BIPS, which is based on four interconnected subsystems represented by composite reservoirs. Several case studies are presented to evaluate the performance of the operational policy, from the simple case with a single hydro plant system to the complete case of the whole BIPS under real conditions. For this last case an operational adjustment procedure was implemented to assure the market attendance considering interchange constraints between the subsystems. (author)

  17. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Hans Martin

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic...

  18. Technical proposal for including health in the procedures for assessing the environmental impact of policies, plans, programmes, projects and activities

    Directory of Open Access Journals (Sweden)

    Almudena García Nieto

    2015-05-01

    Full Text Available Health was an element of general licensing procedures until Spain joined the EU in 1986, when the health report became diluted. The purpose of this article is to provide an overview of this topic’s current regulatory framework and to try to briefly describe health priorities and the channels for feasibly integrating the health variable in the environmental assessment of plans, programmes and projects from the public and private sectors. The current existence of the Environmental Assessment Act and the Public Health Act may help to achieve this.When preparing a strategic environmental study and an environmental impact study, the health impact assessment should be considered an essential step in these environmental procedures and have the same legal treatment as the “compulsory and determinant reports” of said procedures.Thus, it is concluded that the regulatory development of the aspects relating to the assessment of the health impact of the plans, programmes and projects envisaged in the Environmental Assessment Act is essential, the health impact assessment being the tool for doing so.

  19. An electro-optic waveform interconnect based on quantum interference

    CERN Document Server

    Qin, Li-Guo; Gong, Shang-Qing

    2016-01-01

    The ability to modulate an optical field via an electric field is regarded as a key function of electro-optic interconnects, which are used in optical communications and information processing systems. One of the main required devices for such interconnects is the electro-optic modulator (EOM). Current EOM based on the electro-optic effect and the electro-absorption effect often is bulky and power inefficient due to the weak electro-optic properties of its constituent materials. Here we propose a new mechanism to produce an arbitrary-waveform EOM based on the quantum interference, in which both the real and imaginary parts of the susceptibility are engineered coherently with the superhigh efficiency. Based on this EOM, a waveform interconnect from the voltage to the modulated optical absorption is realised. We expect that such a new type of electro-optic interconnect will have a broad range of applications including the optical communications and network.

  20. On interconnections, control, and feedback

    NARCIS (Netherlands)

    Willems, JC

    1997-01-01

    The purpose of this paper is to study interconnections and control of dynamical systems in a behavioral context. We start with an extensive physical example which serves to illustrate that the familiar input-output feedback loop structure is not as universal as we have been taught to believe, This l

  1. On interconnections, control, and feedback

    NARCIS (Netherlands)

    Willems, JC

    The purpose of this paper is to study interconnections and control of dynamical systems in a behavioral context. We start with an extensive physical example which serves to illustrate that the familiar input-output feedback loop structure is not as universal as we have been taught to believe, This

  2. Local Network Wideband Interconnection Alternatives.

    Science.gov (United States)

    1984-01-01

    greater than 1.5 Mbps and two standard televison channels. 1.1 SCOPE Interconnection of local area networks within the continental United States is...may influence : a. Media selection, b. Interface design, c. The use of the 1.5 Mbps data transmission capacity, and d. Adherence to the full-motion video

  3. Crosstalk Model and Estimation Formula for VLSI Interconnect Wires

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    We develop an interconnect crosstalk estimation model on the assumption of linearity for CMOS device. First, we analyze the terminal response of RC model on the worst condition from the S field to the time domain. The exact 3 order coefficients in S field are obtained due to the interconnect tree model. Based on this, a crosstalk peak estimation formula is presented. Unlike other crosstalk equations in the literature, this formula is only used coupled capacitance and grand capacitance as parameter. Experimental results show that, compared with the SPICE results, the estimation formulae are simple and accurate. So the model is expected to be used in such fields as layout-driven logic and high level synthesis, performance-driven floorplanning and interconnect planning.

  4. Quality assessment of delineation and dose planning of early breast cancer patients included in the randomized Skagen Trial 1

    DEFF Research Database (Denmark)

    Francolini, Giulio; Thomsen, Mette S; Yates, Esben S

    2017-01-01

    Background and purpose: To report on a Quality assessment (QA) of Skagen Trial 1, exploring hypofractionation for breast cancer patients with indication for regional nodal radiotherapy. Material and methods: Deviations from protocol regarding target volume delineations and dose parameters (Dmin, ...... coverage in most patients. Inter-observer variability in contouring was low. Dose parameters were in harmony with protocol regardless original or GS segmentation.......Background and purpose: To report on a Quality assessment (QA) of Skagen Trial 1, exploring hypofractionation for breast cancer patients with indication for regional nodal radiotherapy. Material and methods: Deviations from protocol regarding target volume delineations and dose parameters (Dmin......, Dmax, D98%, D95% and D2%) from randomly selected dose plans were assessed. Target volume delineation according to ESTRO guidelines was obtained through atlas based automated segmentation and centrally approved as gold standard (GS). Dice similarity scores (DSC) with original delineations were measured...

  5. Applying the model of Goal-Directed Behavior, including descriptive norms, to physical activity intentions: A contribution to improving the Theory of Planned Behavior

    Science.gov (United States)

    The theory of planned behavior (TPB) has received its fair share of criticism lately, including calls for it to retire. We contributed to improving the theory by testing extensions such as the model of goal-directed behavior (MGDB, which adds desire and anticipated positive and negative emotions) ap...

  6. High-Penetration Photovoltaic Planning Methodologies

    Energy Technology Data Exchange (ETDEWEB)

    Gao, David Wenzhong [Alternative Power Innovations, LLC, Broomfield, CO (United States); Muljadi, Eduard [National Renewable Energy Lab. (NREL), Golden, CO (United States); Tian, Tian [National Renewable Energy Lab. (NREL), Golden, CO (United States); Miller, Mackay [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2017-02-24

    The main objective of this report is to provide an overview of select U.S. utility methodologies for performing high-penetration photovoltaic (HPPV) system planning and impact studies. This report covers the Federal Energy Regulatory Commission's orders related to photovoltaic (PV) power system interconnection, particularly the interconnection processes for the Large Generation Interconnection Procedures and Small Generation Interconnection Procedures. In addition, it includes U.S. state interconnection standards and procedures. The procedures used by these regulatory bodies consider the impacts of HPPV power plants on the networks. Technical interconnection requirements for HPPV voltage regulation include aspects of power monitoring, grounding, synchronization, connection to the overall distribution system, back-feeds, disconnecting means, abnormal operating conditions, and power quality. This report provides a summary of mitigation strategies to minimize the impact of HPPV. Recommendations and revisions to the standards may take place as the penetration level of renewables on the grid increases and new technologies develop in future years.

  7. Immortality of Cu damascene interconnects

    Science.gov (United States)

    Hau-Riege, Stefan P.

    2002-04-01

    We have studied short-line effects in fully-integrated Cu damascene interconnects through electromigration experiments on lines of various lengths and embedded in different dielectric materials. We compare these results with results from analogous experiments on subtractively-etched Al-based interconnects. It is known that Al-based interconnects exhibit three different behaviors, depending on the magnitude of the product of current density, j, and line length, L: For small values of (jL), no void nucleation occurs, and the line is immortal. For intermediate values, voids nucleate, but the line does not fail because the current can flow through the higher-resistivity refractory-metal-based shunt layers. Here, the resistance of the line increases but eventually saturates, and the relative resistance increase is proportional to (jL/B), where B is the effective elastic modulus of the metallization system. For large values of (jL/B), voiding leads to an unacceptably high resistance increase, and the line is considered failed. By contrast, we observed only two regimes for Cu-based interconnects: Either the resistance of the line stays constant during the duration of the experiment, and the line is considered immortal, or the line fails due to an abrupt open-circuit failure. The absence of an intermediate regime in which the resistance saturates is due to the absence of a shunt layer that is able to support a large amount of current once voiding occurs. Since voids nucleate much more easily in Cu- than in Al-based interconnects, a small fraction of short Cu lines fails even at low current densities. It is therefore more appropriate to consider the probability of immortality in the case of Cu rather than assuming a sharp boundary between mortality and immortality. The probability of immortality decreases with increasing amount of material depleted from the cathode, which is proportional to (jL2/B) at steady state. By contrast, the immortality of Al-based interconnects is

  8. 47 CFR 101.519 - Interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection. 101.519 Section 101.519... SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All DEMS... the public all information necessary to allow interconnection of DEMS networks....

  9. 47 CFR 51.305 - Interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Interconnection. 51.305 Section 51.305 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) COMMON CARRIER SERVICES (CONTINUED) INTERCONNECTION Additional Obligations of Incumbent Local Exchange Carriers § 51.305 Interconnection. (a) An incumbent...

  10. 18 CFR 292.306 - Interconnection costs.

    Science.gov (United States)

    2010-04-01

    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any...

  11. 14 CFR 23.701 - Flap interconnection.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flap interconnection. 23.701 Section 23.701... Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a system must— (1) Be synchronized by a mechanical interconnection between the movable flap surfaces that...

  12. 47 CFR 69.124 - Interconnection charge.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Interconnection charge. 69.124 Section 69.124... Computation of Charges § 69.124 Interconnection charge. (a) Until December 31, 2001, local exchange carriers not subject to price cap regulation shall assess an interconnection charge expressed in dollars...

  13. Driving Interconnected Networks to Supercriticality

    Directory of Open Access Journals (Sweden)

    Filippo Radicchi

    2014-04-01

    Full Text Available Networks in the real world do not exist as isolated entities, but they are often part of more complicated structures composed of many interconnected network layers. Recent studies have shown that such mutual dependence makes real networked systems potentially exposed to atypical structural and dynamical behaviors, and thus there is an urgent necessity to better understand the mechanisms at the basis of these anomalies. Previous research has mainly focused on the emergence of atypical properties in relation to the moments of the intra- and interlayer degree distributions. In this paper, we show that an additional ingredient plays a fundamental role for the possible scenario that an interconnected network can face: the correlation between intra- and interlayer degrees. For sufficiently high amounts of correlation, an interconnected network can be tuned, by varying the moments of the intra- and interlayer degree distributions, in distinct topological and dynamical regimes. When instead the correlation between intra- and interlayer degrees is lower than a critical value, the system enters in a supercritical regime where dynamical and topological phases are no longer distinguishable.

  14. Fast process flow, on-wafer interconnection and singulation for MEPV

    Energy Technology Data Exchange (ETDEWEB)

    Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis; Sanchez, Carlos Anthony

    2017-08-29

    A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.

  15. Fast process flow, on-wafer interconnection and singulation for MEPV

    Energy Technology Data Exchange (ETDEWEB)

    Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis; Sanchez, Carlos Anthony

    2017-01-31

    A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.

  16. Interconnects for nanoscale MOSFET technology: a review

    Institute of Scientific and Technical Information of China (English)

    Amit Chaudhry

    2013-01-01

    In this paper,a review of Cu/low-k,carbon nanotube (CNT),graphene nanoribbon (GNR) and optical based interconnect technologies has been done.Interconnect models,challenges and solutions have also been discussed.Of all the four technologies,CNT interconnects satisfy most of the challenges and they are most suited for nanometer scale technologies,despite some minor drawbacks.It is concluded that beyond 32 nm technology,a paradigm shift in the interconnect material is required as Cu/low-k interconnects are approaching fundamental limits.

  17. Interconnects for nanoscale MOSFET technology: a review

    Science.gov (United States)

    Chaudhry, Amit

    2013-06-01

    In this paper, a review of Cu/low-k, carbon nanotube (CNT), graphene nanoribbon (GNR) and optical based interconnect technologies has been done. Interconnect models, challenges and solutions have also been discussed. Of all the four technologies, CNT interconnects satisfy most of the challenges and they are most suited for nanometer scale technologies, despite some minor drawbacks. It is concluded that beyond 32 nm technology, a paradigm shift in the interconnect material is required as Cu/low-k interconnects are approaching fundamental limits.

  18. Energy Zones Study: A Comprehensive Web-Based Mapping Tool to Identify and Analyze Clean Energy Zones in the Eastern Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Koritarov, Vladimir [Argonne National Lab. (ANL), Argonne, IL (United States); Kuiper, James [Argonne National Lab. (ANL), Argonne, IL (United States); Hlava, Kevin [Argonne National Lab. (ANL), Argonne, IL (United States); Orr, Andrew [Argonne National Lab. (ANL), Argonne, IL (United States); Rollins, Katherine [Argonne National Lab. (ANL), Argonne, IL (United States); Brunner, Donna [Argonne National Lab. (ANL), Argonne, IL (United States); Green, Herman [Argonne National Lab. (ANL), Argonne, IL (United States); Makar, Jeffrey [Argonne National Lab. (ANL), Argonne, IL (United States); Ayers, Andrew [Argonne National Lab. (ANL), Argonne, IL (United States); Holm, Michael [Argonne National Lab. (ANL), Argonne, IL (United States); Simunich, Kathy [Argonne National Lab. (ANL), Argonne, IL (United States); Wang, Jianhui [Argonne National Lab. (ANL), Argonne, IL (United States); McLamore, Michael [Argonne National Lab. (ANL), Argonne, IL (United States); Shamsuddin, Shabbir [Argonne National Lab. (ANL), Argonne, IL (United States); Kavicky, James [Argonne National Lab. (ANL), Argonne, IL (United States); Portante, Edgar [Argonne National Lab. (ANL), Argonne, IL (United States); Conzelmann, Guenter [Argonne National Lab. (ANL), Argonne, IL (United States); Molburg, John [Argonne National Lab. (ANL), Argonne, IL (United States); Clark, Corrie [Argonne National Lab. (ANL), Argonne, IL (United States); Snyder, Seth [Argonne National Lab. (ANL), Argonne, IL (United States); Darling, Seth [Argonne National Lab. (ANL), Argonne, IL (United States); Braun, Joseph [Argonne National Lab. (ANL), Argonne, IL (United States); Botterud, Audun [Argonne National Lab. (ANL), Argonne, IL (United States); Gasper, John [Argonne National Lab. (ANL), Argonne, IL (United States); Richmond, Pamela [Argonne National Lab. (ANL), Argonne, IL (United States); Beardsley, Brett [Argonne National Lab. (ANL), Argonne, IL (United States); Schlueter, Scott [Argonne National Lab. (ANL), Argonne, IL (United States); Augustine, Chad [National Renewable Energy Lab. (NREL), Golden, CO (United States); Heimiller, Donna [National Renewable Energy Lab. (NREL), Golden, CO (United States); Hurlbut, David J. [National Renewable Energy Lab. (NREL), Golden, CO (United States); Milbrandt, Anelia [National Renewable Energy Lab. (NREL), Golden, CO (United States); Schneider, Thomas R. [National Renewable Energy Lab. (NREL), Golden, CO (United States); Hadley, Stanton W. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Gracia, Jose R. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Mays, Gary T. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Belles, Randy [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Omitaomu, Olufemi A. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Fernandez, Steven [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Hadjerioua, Boualem [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Stewart, Kevin M. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Kodysh, Jeffrey [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Smith, Travis [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2013-09-01

    This report describes the work conducted in support of the Eastern Interconnection States’ Planning Council (EISPC) Energy Zones Study and the development of the Energy Zones Mapping Tool performed by a team of experts from three National Laboratories. The multi-laboratory effort was led by Argonne National Laboratory (Argonne), in collaboration with the National Renewable Energy Laboratory (NREL) and Oak Ridge National Laboratory (ORNL). In June 2009, the U.S. Department of Energy (DOE) and the National Energy Technology Laboratory published Funding Opportunity Announcement FOA-0000068, which invited applications for interconnection-level analysis and planning. In December 2009, the Eastern Interconnection Planning Collaborative (EIPC) and the EISPC were selected as two award recipients for the Eastern Interconnection. Subsequently, in 2010, DOE issued Research Call RC-BM-2010 to DOE’s Federal Laboratories to provide research support and assistance to FOA-0000068 awardees on a variety of key subjects. Argonne was selected as the lead laboratory to provide support to EISPC in developing a methodology and a mapping tool for identifying potential clean energy zones in the Eastern Interconnection. In developing the EISPC Energy Zones Mapping Tool (EZ Mapping Tool), Argonne, NREL, and ORNL closely collaborated with the EISPC Energy Zones Work Group which coordinated the work on the Energy Zones Study. The main product of the Energy Zones Study is the EZ Mapping Tool, which is a web-based decision support system that allows users to locate areas with high suitability for clean power generation in the U.S. portion of the Eastern Interconnection. The mapping tool includes 9 clean (low- or no-carbon) energy resource categories and 29 types of clean energy technologies. The EZ Mapping Tool contains an extensive geographic information system database and allows the user to apply a flexible modeling approach for the identification and analysis of potential energy zones

  19. Interconnectivity structure of a general interdependent network.

    Science.gov (United States)

    Van Mieghem, P

    2016-04-01

    A general two-layer network consists of two networks G_{1} and G_{2}, whose interconnection pattern is specified by the interconnectivity matrix B. We deduce desirable properties of B from a dynamic process point of view. Many dynamic processes are described by the Laplacian matrix Q. A regular topological structure of the interconnectivity matrix B (constant row and column sum) enables the computation of a nontrivial eigenmode (eigenvector and eigenvalue) of Q. The latter eigenmode is independent from G_{1} and G_{2}. Such a regularity in B, associated to equitable partitions, suggests design rules for the construction of interconnected networks and is deemed crucial for the interconnected network to show intriguing behavior, as discovered earlier for the special case where B=wI refers to an individual node to node interconnection with interconnection strength w. Extensions to a general m-layer network are also discussed.

  20. Development of a Prototype Model to Establish an Economic Earthwork Plan that Includes the Selection of a Dump Site/Borrow Pit

    Directory of Open Access Journals (Sweden)

    Seung Hak Lee

    2017-01-01

    Full Text Available Earthwork in road construction projects is the major activity that accounts for about 20%–30% of the total construction cost, and the internal/external hauling plan is the key factor for determining the successful completion of the project. However, the hauling plan at the site, which includes the selection of the dump site and borrow pit, is usually determined by the site manager’s subjective and empirical discretion alone. Therefore, this study has developed a prototype model that provides the optimal internal/external hauling plan. It includes the determination of the most economical dump sites and borrow pits (location and number among other candidate sites as well. The transshipment problem theory is incorporated into the optimized algorithm with the consideration of various factors affecting earthwork cost. Direct costs from an optimized transport based on an existing model against another from this model were compared to prove its feasibility. As a result, the reduction of earthwork cost including the dump site/borrow pits reached 4%–8%. This result implies that this prototype model would also be useful in reducing both the earthwork cost and the occurrence of exhaust gas from earthwork equipment by providing optimized transportation paths.

  1. National Offshore Wind Energy Grid Interconnection Study

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB Inc; Liu, Shu [ABB Inc; Ibanez, Eduardo [National Renewable Energy Laboratory; Pennock, Ken [AWS Truepower; Reed, Greg [University of Pittsburgh; Hanes, Spencer [Duke Energy

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  2. Data base for Interconnect welds

    CERN Document Server

    Wildner, E

    2007-01-01

    The interconnect work for the LHC equipment involves a large amount of data and files generated by the machines and the tooling. Different kinds of technologies for different kinds of interconnections result in different data, file types and file formats. This data should normally be stored in the MTF, file by file. This was too time consuming and error prone. In order to free time for quality control to improve the correct handling of the data files and information a data-base system was developed to organize and handle as automatically as possible dataflow and checks. This was the first goal set up. This is now in operation and is giving satisfaction in industry and at CERN. An important bonus of a data base system is that we can get an overview of the quality of the data and make possible feed back to the process. For the moment we cannot see clear correlation between data and non conformities which means that the tuning of the tooling is satisfactory. It is important to have efficient access to the data t...

  3. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Science.gov (United States)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  4. Polyguide polymeric technology for optical interconnect circuits and components

    Science.gov (United States)

    Booth, Bruce L.; Marchegiano, Joseph E.; Chang, Catherine T.; Furmanak, Robert J.; Graham, Douglas M.; Wagner, Richard G.

    1997-04-01

    The expanding information revolution has been made possible by the development of optical communication technology. To meet the escalating demand for information transmitted and processed at high data rates and the need to circumvent the growing electronic circuit bottlenecks, mass deployment of not only optical fiber networks but manufacturable optical interconnect circuits, components and connectors for interfacing fibers and electronics that meet economic and performance constraints are absolutely necessary. Polymeric waveguide optical interconnection are considered increasingly important to meet these market needs. DuPont's polyguide polymeric integrated optic channel waveguide system is thought by many to have considerable potential for a broad range of passive optical interconnect applications. In this paper the recent advances, status, and unique attributes of the technology are reviewed. Product and technology developments currently in progress including parallel optical ink organization and polymer optical interconnect technology developments funded by DARPA are used as examples to describe polyguide breadth and potential for manufacture and deployment of optical interconnection products for single and multimode telecom and datacom waveguide applications.

  5. Investigation of performance degradation of SOFC using chromium-containing alloy interconnects

    DEFF Research Database (Denmark)

    Beeaff, D.R.; Dinesen, A.; Hendriksen, Peter Vang

    2007-01-01

    -side interconnect plate and the other sample containing a similar fuel cell but no steel interconnect. The interconnect-bearing sample was evaluated for thermochemical compatibility of cell components, including interconnect materials, under conditions typical of and/or expected during the lifetime of an installed......O filler. Longterm degradation of each sample was determined using a current density of 250 mA.cm(-2) using humidified hydrogen as the fuel and air as the oxygen source. Additionally, the stack element was cycled and an investigation into the effect of cathode atmosphere was undertaken to elucidate...

  6. Dynamic interconnection component using wireless infrared technology

    Institute of Scientific and Technical Information of China (English)

    JIA Dagong; WANG Guanghui; ZHANG Yimo; ZHANG Yinxin; JING Wencai; ZHOU Ge

    2007-01-01

    An efficient dynamic interconnection model using wireless infrared technology and the theory of optical interconnections was constructed to design a dual-channel interconnection component.There were three conditions between the rotating optical field and the stationary optical field:end separation,angle misalignment and lateral misalignment.The calculation formulas were given for these three conditions.A dual-channel optical interconnection component was designed based on the dynamic interconnection model and the data transmission rate of the component was measured.The experimental result showed that the dualchannel optical interconnection component could transmit optical signals across the rotating interface.The maximum transmission rate can reach 2.14 Mb/s.

  7. Beam Vacuum Interconnects for the LHC Cold Arcs

    CERN Document Server

    Veness, R J M; Gröbner, Oswald; Lepeule, P; Reymermier, C; Schneider, G; Skoczen, Blazej; Kleimenok, V; Nikitin, I N

    1999-01-01

    The design of the beam vacuum interconnect is described in this paper. Features include a novel RF bridge design to maximise lateral flexibility during cryostat Cold arcs of the LHC will consist of twin aperture dipole, quadrupole and corrector magnets in cryostats, operating at 1.9 K. Beam vacuum chambers, along with all connecting elements require flexible 'interconnects' between adjacent cryostats to allow for thermal and mechanical offsets foreseen during machine operation and alignment. In addition, the beam vacuum chambers contain perforated beam screens to intercept beam induced heat loads at an intermediate temperature. These must also be connected with low impedance RF bridges in the interconnect zones.alignment and so-called 'nested' bellows to minimise the required length of the assembly.

  8. New challenges to electrical interconnection systems in Central America; Nuevos retos que plantea la integracion electrica Centroamericana

    Energy Technology Data Exchange (ETDEWEB)

    Gonzalez Pinzon, Luz Amalia [IRHE, Panama (Panama)

    1996-07-01

    The electrical interconnection between Central America countries is a project of regional integration, whose purpose is to optimize the advantage of interconnecting of six electrical systems of their respective countries. This require the establishment of legal procedures to operate the high voltage transmission grid from Guatemala to Panama. The mid and long term planning of the interconnected electrical grid, is a new challenge for the electrical companies, considering that as up to now, they have been satisfying small markets. The possibility to use nuclear energy to satisfy a bigger market is now feasible and deserves to be considered since the beginning of the interconnection project. (author)

  9. Statistical Elmore delay of RC interconnect tree

    Institute of Scientific and Technical Information of China (English)

    Dong Gang; Yang Yang; Chai Chang-Chun; Yang Yin-Tang

    2010-01-01

    As feature size keeps scaling down, process variations can dramatically reduce the accuracy in the estimation of interconnect performance. This paper proposes a statistical Elmore delay model for RC interconnect tree in the presence of process variations. The suggested method translates the process variations into parasitic parameter extraction and statistical Elmore delay evaluation. Analytical expressions of mean and standard deviation of interconnect delay can be obtained in a given fluctuation range of interconnect geometric parameters. Experimental results demonstrate that the approach matches well with Monte Carlo simulations. The errors of proposed mean and standard deviation are less than 1% and 7%, respectively. Simulations prove that our model is efficient and accurate.

  10. Theory of Planned Behavior including self-stigma and perceived barriers explain help-seeking behavior for sexual problems in Iranian women suffering from epilepsy.

    Science.gov (United States)

    Lin, Chung-Ying; Oveisi, Sonia; Burri, Andrea; Pakpour, Amir H

    2017-03-01

    To apply the Theory of Planned Behavior (TPB) and the two additional concepts self-stigma and perceived barriers to the help-seeking behavior for sexual problems in women with epilepsy. In this 18-month follow-up study, TPB elements, including attitude, subjective norm, perceived behavioral control, and behavioral intention along with self-stigma and perceived barriers in seeking help for sexual problems were assessed in n=818 women with epilepsy (94.0% aged ≤40years). The basic TPB model (model 1) and the TPB model additionally including self-stigma and perceived barriers (Model 2) were analyzed using structural equation modeling (SEM). Both SEM models showed satisfactory model fits. According to model, attitude, subjective norms, perceived behavioral control, and intention explained 63.1% of the variance in help-seeking behavior. Variance was slightly higher (64.5%) when including self-stigma and perceived barriers (model 2). In addition, the fit indices of the models were better highlighting the importance of self-stigma and perceived barriers in help-seeking behavior for sexual problems. Theory of Planned Behavior is useful in explaining help-seeking behavior for sexual problems in women with epilepsy. Self-stigma and perceived barriers are additional factors that should be considered in future interventions aiming to adopt TPB to improve help-seeking behavior for sexual problems. Copyright © 2017 Elsevier Inc. All rights reserved.

  11. Energetic diversification in the interconnected electric system; Diversificacion energetica en el sistema electrico interconectado

    Energy Technology Data Exchange (ETDEWEB)

    Villanueva M, C.; Beltran M, H.; Serrano G, J.A. [UNAM, Facultad de Ingenieria, 04510 Mexico D.F. (Mexico)]. e-mail: cvillanueva@fi-b.unam.mx

    2007-07-01

    In the interconnected electric system of Mexico the demanded electricity in different timetable periods it is synthesized in the annual curve of load duration, which is characterized by three regions. The energy in every period is quantified according to the under curve areas in each region, which depend of the number of hours in that the power demand exceeds the minimum and the intermediate demands respectively that are certain percentages of the yearly maximum demand. In that context, the generating power stations are dispatched according to the marginal costs of the produced electricity and the electric power to be generated every year by each type of central it is located in some of the regions of the curve of load duration, as they are their marginal costs and their operation characteristic techniques. By strategic reasons it is desirable to diversify the primary energy sources that are used in the national interconnected system to generate the electricity that demand the millions of consumers that there are in Mexico. On one hand, when intensifying the use of renewable sources and of nucleo electric centrals its decrease the import volumes of natural gas, which has very volatile prices and it is a fuel when burning in the power stations produces hothouse gases that are emitted to the atmosphere. On the other hand, when diversifying the installed capacity of the different central types in the interconnected system, a better adaptation of the produced electricity volumes is achieved by each type to the timetable variation, daily, weekly and seasonal of the electric demand, as one manifests this in the curve of load duration. To exemplify a possible diversification plan of the installed capacity in the national interconnected system that includes nucleo electric centrals and those that use renewable energy, charts are presented that project of 2005 at 2015 the capacity, energy and ost of the electricity of different central types, located in each one of the

  12. 14 CFR 121.1111 - Electrical wiring interconnection systems (EWIS) maintenance program.

    Science.gov (United States)

    2010-01-01

    ... Airworthiness and Safety Improvements § 121.1111 Electrical wiring interconnection systems (EWIS) maintenance... unless the maintenance program for that airplane includes inspections and procedures for electrical... 14 Aeronautics and Space 3 2010-01-01 2010-01-01 false Electrical wiring interconnection...

  13. Virtual interconnection platform initiative scoping study

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Kou, Gefei [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Pan, Zuohong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Liu, Yilu [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); King Jr., Thomas J. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2016-01-01

    Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

  14. Multimode siloxane polymer components for optical interconnects

    Science.gov (United States)

    Bamiedakis, Nikolaos; Beals, Joseph, IV; Penty, Richard V.; White, Ian H.; DeGroot, Jon v., Jr.; Clapp, Terry V.; De Shazer, David

    2009-02-01

    This paper presents an overview of multimode waveguides and waveguide components formed from siloxane polymer materials which are suitable for use in optical interconnection applications. The components can be cost-effectively integrated onto conventional PCBs and offer increased functionality in optical transmission. The multimode waveguides exhibit low loss (0.04 dB/cm at 850 nm) and low crosstalk (benefit from the multimode nature of the waveguides allowing low loss combining (4 dB for an 8×1 device). A large range of power splitting ratios between 30% and 75% is achieved with multimode coupler devices. Examples of system applications benefiting from the use of these components are briefly presented including a terabit capacity optical backplane, a radio-over-fibre multicasting system and a SCM passive optical network.

  15. Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Martin

    2010-01-01

    We have previously described 'Interconnection Blocks' which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin s...

  16. Interconnections in ULSI: Correlation and Crosstalk

    Science.gov (United States)

    1992-12-31

    cide interconnects. Finally. in Section V. we present the 2L conclusions. -_-. - ax, II. THEORY + A"- a- ) A. Coupling Between Optical Interconnects - To... TesIs . Note that the circulating urrent pattems hardly carry any net current in the x.direction. Therefore, the conductance of the stmctue will be very

  17. Interconnection of J-lossless behaviours

    NARCIS (Netherlands)

    Rao, S.

    In this paper, motivated by the phenomenon of the interconnection of lossless electrical networks, a class of behaviours known as J-lossless behaviours is introduced, where J is a symmetric two-variable polynomial matrix. It is shown that for certain values of J, interconnection of J-lossless

  18. Colligation or, The Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Franksen, Ole Immanuel; Falster, Peter

    2000-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in oure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  19. Epidemics in interconnected small-world networks

    NARCIS (Netherlands)

    Liu, M.; Li, D.; Qin, P.; Liu, C.; Wang, H.; Wang, F.

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks

  20. Interconnection of J-lossless behaviours

    NARCIS (Netherlands)

    Rao, Shodhan

    2010-01-01

    In this paper, motivated by the phenomenon of the interconnection of lossless electrical networks, a class of behaviours known as J-lossless behaviours is introduced, where J is a symmetric two-variable polynomial matrix. It is shown that for certain values of J, interconnection of J-lossless behav

  1. Interconnection of systems : the network paradigm

    NARCIS (Netherlands)

    Maschke, B.M.; Schaft, A.J. van der

    1996-01-01

    In this paper we propose first to recall the different interconnection structures appearing in network models and to show their exact correspondence with Dirac structures. This definition of interconnection is purely implicit hence does not discriminate between inputs and outputs among the interconn

  2. 47 CFR 95.141 - Interconnection prohibited.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection prohibited. 95.141 Section 95.141 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES PERSONAL RADIO SERVICES General Mobile Radio Service (GMRS) § 95.141 Interconnection prohibited. No...

  3. Updating Technical Screens for PV Interconnection: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Ellis, A.; Lynn, K.; Razon, A.; Key, T.; Kroposki, B.; Mather, B.; Hill, R.; Nicole, K.; Smith, J.

    2012-08-01

    Solar photovoltaics (PV) is the dominant type of distributed generation (DG) technology interconnected to electric distribution systems in the United States, and deployment of PV systems continues to increase rapidly. Considering the rapid growth and widespread deployment of PV systems in United States electric distribution grids, it is important that interconnection procedures be as streamlined as possible to avoid unnecessary interconnection studies, costs, and delays. Because many PV interconnection applications involve high penetration scenarios, the process needs to allow for a sufficiently rigorous technical evaluation to identify and address possible system impacts. Existing interconnection procedures are designed to balance the need for efficiency and technical rigor for all DG. However, there is an implicit expectation that those procedures will be updated over time in order to remain relevant with respect to evolving standards, technology, and practical experience. Modifications to interconnection screens and procedures must focus on maintaining or improving safety and reliability, as well as accurately allocating costs and improving expediency of the interconnection process. This paper evaluates the origins and usefulness of the capacity penetration screen, offers potential short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen.

  4. 47 CFR 90.477 - Interconnected systems.

    Science.gov (United States)

    2010-10-01

    ...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is...

  5. Modeling interconnect corners under double patterning misalignment

    Science.gov (United States)

    Hyun, Daijoon; Shin, Youngsoo

    2016-03-01

    Publisher's Note: This paper, originally published on March 16th, was replaced with a corrected/revised version on March 28th. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assistance. Interconnect corners should accurately reflect the effect of misalingment in LELE double patterning process. Misalignment is usually considered separately from interconnect structure variations; this incurs too much pessimism and fails to reflect a large increase in total capacitance for asymmetric interconnect structure. We model interconnect corners by taking account of misalignment in conjunction with interconnect structure variations; we also characterize misalignment effect more accurately by handling metal pitch at both sides of a target metal independently. Identifying metal space at both sides of a target metal.

  6. Decentralized Control for a Class of Similar Composite Systems with Interconnections with Unsatisfying Interconnection Condition

    Institute of Scientific and Technical Information of China (English)

    WANG Zheng; LI Zhong-hai; ZHANG Si-ying; HOU Xue-zhang

    2001-01-01

    In this paper, a class of similar composite systems is discussed, whose interconnections areasymmetrical and mismatched. The interconnection condition is proposed. Based on it, the interconnectionsare divided into two parts. One satisfies the interconnection condition, by means of the two--step method,the decentralized controllers are designed. The other does not satisfy the interconnection condition, but thisis offsetted by good quality of the system itself. Based on these, a sufficient condition is given by some linearmatrix inequalities, which makes the studied systems quadratic stabile via linear decentralized controllers bymaking use of the information of interconnections better.

  7. Electric currents in networks of interconnected memristors.

    Science.gov (United States)

    Nedaaee Oskoee, Ehsan; Sahimi, Muhammad

    2011-03-01

    Chua [IEEE Trans. Circuit Theory 1, 507 (1971).] argued that, in addition to the standard resistors, capacitors, and inductors, there must be a fourth fundamental element in electrical circuits, which he called a memory resistor or memristor. Strukov et al. [Nature (London) 453, 80 (2008)] showed how memristive behavior arises in some thin semiconducting films. Unlike other passive elements, however, a memristor with large sizes cannot be fabricated, because scale up of a memristor to dimensions of the order of microns causes loss of the memristive effect by decreasing the width of the doped region relative to the overall size of the memristor. A microscale memristor is, however, essential to most of the potential applications. One way of fabricating such a microscale memristor without losing the memristive effect is to make a network of very small interconnected memristors. We report the results of numerical simulations of electrical currents in such networks of interconnected memristors, as well as memristors and Ohmic conductors. The memristor networks exhibit a rich variety of interesting properties, including weakly and strongly memristive regimes, a possible first-order transition at the connectivity threshold, generation of second harmonics in the strongly memristive regime, and the universal dependence of the network's strength on the frequency. Moreover, we show that the polarity of the memristors can play an important role in the overall properties of the memristor network, in particular its speed of switching, which may have a potentially important application to faster computers. None of these properties are exhibited by linear resistor networks, or even by nonlinear resistor networks without a memory effect.

  8. Five-year examination of utilization and drug cost outcomes associated with benefit design changes including reference pricing for proton pump inhibitors in a state employee health plan.

    Science.gov (United States)

    Johnson, Jill T; Neill, Kathryn K; Davis, Dwight A

    2011-04-01

    The Arkansas State Employee Benefits Division (EBD) is a self-insured program comprising public school and other state employees, their spouses, and dependents. Previous research published in JMCP (2006) showed drug cost savings of $2.20 per member per month (PMPM; 37.6%) or annualized savings of $3.4 million associated with a benefit design change and coverage of the proton pump inhibitor (PPI) omeprazole over-the-counter (OTC) beginning in March 2004. On May 1, 2005, brand esomeprazole was excluded from coverage, with current users grandfathered for 4 months until September 2005. Reference pricing for PPIs, including esomeprazole but excluding generic omeprazole, was implemented on September 1, 2005, and the beneficiary cost share for all PPIs except generic omeprazole was determined from comparison of the PPI actual price to the $0.90 omeprazole OTC reference price per unit. To examine PPI utilization and drug costs before and after (a) excluding esomeprazole from coverage (with grandfathering current users) and (b) implementing a therapeutic maximum allowable cost (TMAC), or reference-pricing benefit design, for the PPI class in a large state employee health plan with fairly stable enrollment of approximately 127,500 members in 2005 through 2008 and approximately 128,000 members in 2009 Q1. The pharmacy claims database for the EBD was used to examine utilization and cost data for PPIs in a longitudinal analysis for the 61-month period from March 1, 2004, through March 31, 2009. Pharmacy claims data were compared for the period 14 months prior to esomeprazole exclusion (preperiod), 4 months during the esomeprazole exclusion (postperiod 1), and the ensuing 43 months of PPI reference pricing (postperiod 2). PPI cost and utilization data for the intervention group of approximately 127,500 beneficiaries were compared with a group of 122 self-insured employers with a total of nearly 1 million beneficiaries whose pharmacy benefits did not include reference pricing for

  9. Applying the Model of Goal-Directed Behavior, Including Descriptive Norms, to Physical Activity Intentions: A Contribution to Improving the Theory of Planned Behavior.

    Science.gov (United States)

    Esposito, Gabriele; van Bavel, René; Baranowski, Tom; Duch-Brown, Néstor

    2016-08-01

    The theory of planned behavior (TPB) has received its fair share of criticism lately, including calls for it to retire. We contribute to improving the theory by testing extensions such as the model of goal-directed behavior (MGDB, which adds desire and anticipated positive and negative emotions) applied to physical activity (PA) intention. We also test the inclusion of a descriptive norms construct as an addition to the subjective norms construct, also applied to PA, resulting in two additional models: TPB including descriptive norms (TPB + DN) and MGDB including descriptive norms (MGDB + DN). The study is based on an online survey of 400 young adult Internet users, previously enrolled in a subject pool. Confirmatory factor analysis (CFA) showed that TPB and TPB + DN were not fit for purpose, while MGDB and MGDB + DN were. Structural equation modelling (SEM) conducted on MGDB and MGDB + DN showed that the inclusion of descriptive norms took over the significance of injunctive norms, and increased the model's account of total variance in intention to be physically active.

  10. A novel interconnect-optimal repeater insertion model with target delay constraint in 65 nm CMOS

    Institute of Scientific and Technical Information of China (English)

    Zhu Zhang-Ming; Qian Li-Bo; Yang Yin-Tang

    2009-01-01

    Repeater optimization is the key for SOC (System on Chip) interconnect delay design. This paper proposes a novel optimal model for minimizing power and area overhead of repeaters while meeting the target performance of on-chip interconnect lines. It also presents Lagrangian function to find the number of repeaters and their sizes required for minimizing area and power overhead with target delay constraint. Based on the 65 nanometre CMOS technology, the computed results of the intermediate and global lines show that the proposed model can significantly reduce area and power of interconnected lines, and the better performance will be achieved with the longer line. The results compared with the reference paper demonstrate the validity of this model. It can be integrated into repeater design methodology and CAD (computer aided design) tool for interconnect planning in nanometre SOC.

  11. Interconnecting Microgrids via the Energy Router with Smart Energy Management

    Directory of Open Access Journals (Sweden)

    Yingshu Liu

    2017-08-01

    Full Text Available A novel and flexible interconnecting framework for microgrids and corresponding energy management strategies are presented, in response to the situation of increasing renewable-energy penetration and the need to alleviate dependency on energy storage equipment. The key idea is to establish complementary energy exchange between adjacent microgrids through a multiport electrical energy router, according to the consideration that adjacent microgrids may differ substantially in terms of their patterns of energy production and consumption, which can be utilized to compensate for each other’s instant energy deficit. Based on multiport bidirectional voltage source converters (VSCs and a shared direct current (DC power line, the energy router serves as an energy hub, and enables flexible energy flow among the adjacent microgrids and the main grid. The analytical model is established for the whole system, including the energy router, the interconnected microgrids and the main grid. Various operational modes of the interconnected microgrids, facilitated by the energy router, are analyzed, and the corresponding control strategies are developed. Simulations are carried out on the Matlab/Simulink platform, and the results have demonstrated the validity and reliability of the idea for microgrid interconnection as well as the corresponding control strategies for flexible energy flow.

  12. An approach to the optical interconnect made in standard CMOS process

    Institute of Scientific and Technical Information of China (English)

    Yu Changliang; Mao Luhong; Xiao Xindong; Xie Sheng; Zhang Shilin

    2009-01-01

    A standard CMOS optical interconnect is proposed, including an octagonal-annular emitter, a field oxide,metal 1-PSG/BPSG-metal 2 dual waveguide, and an ultra high-sensitivity optical receiver integrated with a fingered P/N-well/P-sub dual photodiode detector. The optical interconnect is implemented in a Chartered 3.3-V 0.35-μm standard analog CMOS process with two schemes for the research of the substrate noise coupling effect on the optical interconnect performance: with or without a GND-guardring around the emitter. The experiment results show that the optical interconnect can work at 100 kHz, and it is feasible to implement optical interconnects in standard CMOS processes.

  13. MFT - Muon Forward Tracker Sensor Interconnection Techniques

    CERN Document Server

    Catania, Alessandro

    2016-01-01

    Most detectors nowadays take the form of an active pixel sensor, which enables the detection and characterization of particles. This pixel sensor needs to be interconnected to some circuit board in order for this data to be read out and analyzed. Therefore various interconnection techniques are being tested out to assess the read out performance and data validity. One of these interconnection techniques is conductive gluing which is being tested in order to observe if it is a viable solution for this project and other project.

  14. Uniform wire segmentation algorithm of distributed interconnects

    Institute of Scientific and Technical Information of China (English)

    Yin Guoli; Lin Zhenghui

    2007-01-01

    A uniform wire segmentation algorithm for performance optimization of distributed RLC interconnects was proposed in this paper. The optimal wire length for identical segments and buffer size for buffer insertion are obtained through computation and derivation, based on a 2-pole approximation model of distributed RLC interconnect. For typical inductance value and long wires under 180nm technology, experiments show that the uniform wire segmentation technique proposed in the paper can reduce delay by about 27% ~ 56% , while requires 34%~69% less total buffer usage and thus 29% to 58% less power consumption. It is suitable for long RLC interconnect performance optimization.

  15. At the speed of light? electricity interconnections for Europe

    Energy Technology Data Exchange (ETDEWEB)

    Nies, S.

    2010-07-01

    interconnections and the missing links among them, detailing projects and needs region by region, including various dimensions of the relationship between the EU and third countries. Part IV lays out recommendations for EU and national policy makers. Contents: Executive Summary; Introduction; Independent Variables and Legacies; A Complex European Governance; Existing Lines and Missing Links; Perspectives and Policy Recommendations

  16. Recent Development of SOFC Metallic Interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Wu JW, Liu XB

    2010-04-01

    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  17. Traffic congestion in interconnected complex networks.

    Science.gov (United States)

    Tan, Fei; Wu, Jiajing; Xia, Yongxiang; Tse, Chi K

    2014-06-01

    Traffic congestion in isolated complex networks has been investigated extensively over the last decade. Coupled network models have recently been developed to facilitate further understanding of real complex systems. Analysis of traffic congestion in coupled complex networks, however, is still relatively unexplored. In this paper, we try to explore the effect of interconnections on traffic congestion in interconnected Barabási-Albert scale-free networks. We find that assortative coupling can alleviate traffic congestion more readily than disassortative and random coupling when the node processing capacity is allocated based on node usage probability. Furthermore, the optimal coupling probability can be found for assortative coupling. However, three types of coupling preferences achieve similar traffic performance if all nodes share the same processing capacity. We analyze interconnected Internet autonomous-system-level graphs of South Korea and Japan and obtain similar results. Some practical suggestions are presented to optimize such real-world interconnected networks accordingly.

  18. The Interconnections of the LHC Cryomagnets

    CERN Document Server

    Jacquemod, A; Skoczen, Blazej; Tock, J P

    2001-01-01

    The main components of the LHC, the next world-class facility in high-energy physics, are the twin-aperture high-field superconducting cryomagnets to be installed in the existing 26.7-km long tunnel. After installation and alignment, the cryomagnets have to be interconnected. The interconnections must ensure the continuity of several functions: vacuum enclosures, beam pipe image currents (RF contacts), cryogenic circuits, electrical power supply, and thermal insulation. In the machine, about 1700 interconnections between cryomagnets are necessary. The interconnections constitute a unique system that is nearly entirely assembled in the tunnel. For each of them, various operations must be done: TIG welding of cryogenic channels (~ 50 000 welds), induction soldering of main superconducting cables (~ 10 000 joints), ultrasonic welding of auxiliary superconducting cables (~ 20 000 welds), mechanical assembly of various elements, and installation of the multi-layer insulation (~ 200 000 m2). Defective junctions cou...

  19. Traffic congestion in interconnected complex networks

    CERN Document Server

    Tan, Fei; Xia, Yongxiang; Tse, Chi K

    2014-01-01

    Traffic congestion in isolated complex networks has been investigated extensively over the last decade. Coupled network models have recently been developed to facilitate further understanding of real complex systems. Analysis of traffic congestion in coupled complex networks, however, is yet to come. In this paper, we try to explore the effect of interconnections on traffic congestion in interconnected BA scale-free networks. We find that assortative coupling can alleviate traffic congestion better than disassortative and random coupling when the node processing capacity is allocated based on node usage probability. Furthermore, the optimal coupling probability can be found for assortative coupling. However, three types of coupling preferences achieve similar traffic performance if all nodes share the same processing capacity. We analyze interconnected Internet AS-level graphs of Japan and South Korea and obtain similar results. Some practical suggestions are presented to optimize such real-world interconnect...

  20. One-dimensional nano-interconnection formation.

    Science.gov (United States)

    Ji, Jianlong; Zhou, Zhaoying; Yang, Xing; Zhang, Wendong; Sang, Shengbo; Li, Pengwei

    2013-09-23

    Interconnection of one-dimensional nanomaterials such as nanowires and carbon nanotubes with other parts or components is crucial for nanodevices to realize electrical contacts and mechanical fixings. Interconnection has been being gradually paid great attention since it is as significant as nanomaterials properties, and determines nanodevices performance in some cases. This paper provides an overview of recent progress on techniques that are commonly used for one-dimensional interconnection formation. In this review, these techniques could be categorized into two different types: two-step and one-step methods according to their established process. The two-step method is constituted by assembly and pinning processes, while the one-step method is a direct formation process of nano-interconnections. In both methods, the electrodeposition approach is illustrated in detail, and its potential mechanism is emphasized.

  1. Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug 'n' play functionality

    DEFF Research Database (Denmark)

    Perozziello, Gerardo; Bundgaard, Frederik; Geschke, Oliver

    2008-01-01

    A crucial challenge in packaging of microsystems is microfluidic interconnections. These have to seal the ports of the system, and have to provide the appropriate interface to other devices or the external environment. Integrated fluidic interconnections appear to be a good solution...... for interconnecting polymer microsystems in terms of cost, space and performance. Following this path we propose a new reversible, integrated fluidic interconnection composed of custom-made cylindrical rings integrated in a polymer house next to the fluidic network. This allows plug 'n' play functionality between...... external metal ferrules and the system. Theoretical calculations are made to dimension and model the integrated fluidic interconnection. Leakage tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits....

  2. Corrective Action Investigation Plan for Corrective Action Unit 204: Storage Bunkers, Nevada Test Site, Nevada (December 2002, Revision No.: 0), Including Record of Technical Change No. 1

    Energy Technology Data Exchange (ETDEWEB)

    NNSA/NSO

    2002-12-12

    The Corrective Action Investigation Plan contains the U.S. Department of Energy, National Nuclear Security Administration Nevada Operations Office's approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 204 under the Federal Facility Agreement and Consent Order. Corrective Action Unit 204 is located on the Nevada Test Site approximately 65 miles northwest of Las Vegas, Nevada. This CAU is comprised of six Corrective Action Sites (CASs) which include: 01-34-01, Underground Instrument House Bunker; 02-34-01, Instrument Bunker; 03-34-01, Underground Bunker; 05-18-02, Chemical Explosives Storage; 05-33-01, Kay Blockhouse; 05-99-02, Explosive Storage Bunker. Based on site history, process knowledge, and previous field efforts, contaminants of potential concern for Corrective Action Unit 204 collectively include radionuclides, beryllium, high explosives, lead, polychlorinated biphenyls, total petroleum hydrocarbons, silver, warfarin, and zinc phosphide. The primary question for the investigation is: ''Are existing data sufficient to evaluate appropriate corrective actions?'' To address this question, resolution of two decision statements is required. Decision I is to ''Define the nature of contamination'' by identifying any contamination above preliminary action levels (PALs); Decision II is to ''Determine the extent of contamination identified above PALs. If PALs are not exceeded, the investigation is completed. If PALs are exceeded, then Decision II must be resolved. In addition, data will be obtained to support waste management decisions. Field activities will include radiological land area surveys, geophysical surveys to identify any subsurface metallic and nonmetallic debris, field screening for applicable contaminants of potential concern, collection and analysis of surface and subsurface soil samples from biased locations

  3. Epidemics spreading in interconnected complex networks

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Y. [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Institute of High Performance Computing, Agency for Science, Technology and Research (A-STAR), Singapore 138632 (Singapore); Xiao, G., E-mail: egxxiao@ntu.edu.sg [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore)

    2012-09-03

    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  4. Navigability of interconnected networks under random failures

    Science.gov (United States)

    De Domenico, Manlio; Solé-Ribalta, Albert; Gómez, Sergio; Arenas, Alex

    2014-01-01

    Assessing the navigability of interconnected networks (transporting information, people, or goods) under eventual random failures is of utmost importance to design and protect critical infrastructures. Random walks are a good proxy to determine this navigability, specifically the coverage time of random walks, which is a measure of the dynamical functionality of the network. Here, we introduce the theoretical tools required to describe random walks in interconnected networks accounting for structure and dynamics inherent to real systems. We develop an analytical approach for the covering time of random walks in interconnected networks and compare it with extensive Monte Carlo simulations. Generally speaking, interconnected networks are more resilient to random failures than their individual layers per se, and we are able to quantify this effect. As an application––which we illustrate by considering the public transport of London––we show how the efficiency in exploring the multiplex critically depends on layers’ topology, interconnection strengths, and walk strategy. Our findings are corroborated by data-driven simulations, where the empirical distribution of check-ins and checks-out is considered and passengers travel along fastest paths in a network affected by real disruptions. These findings are fundamental for further development of searching and navigability strategies in real interconnected systems. PMID:24912174

  5. Environmental protection by cost minimization: Least Cost Planning for traffic. Includes a guide for the application in local communities; Umweltentlastung durch Kostenminimierung: Least Cost Planning im Verkehr. Mit Leitfaden fuer die Anwendung in Kommunen

    Energy Technology Data Exchange (ETDEWEB)

    Bracher, T.; Diegmann, V.; Eckart, C.F.; Liwicki, M.; Lobenberg, G.; Wetzel, C. [Gesellschaft fuer Informatik, Verkehrs- und Umweltplanung mbH (IVU), Berlin (Germany); Bergmann, M.; Uricher, A.; Lueers, A. [Oeko-Institut, Inst. fuer Angewandte Oekologie e.V., Freiburg im Breisgau (Germany); Becker, U.; Karl, G.; Karl, B.; Voellings, A. [Technische Univ. Dresden (Germany). Lehrstuhl fuer Verkehrsoekologie

    1999-08-01

    An intermodal approach for the evaluation of transportation services on the municipal level was developed. Both non-motorised and motorised transportation were included. The approach aims at helping communities to provide an economically and ecologically viable transport policy. Least Cost Transportation Planning (LCTP) was developed to transfer the successful concept of Least Cost Planning from the energy sector to transportation. The conclusion from an analysis of LCTP literature and present evaluation methods was that an improved approach should be intermodal and integrate users, public bodies and transport companies as well as all planning sectors. An approach was developed firstly to identify and clarify transportation expenditures and incomes of a city within a year, and secondly for the evaluation of planning alternatives. This was illustrated for the access system of an industrial area with adjacent railway services in the town of Freiburg. Three alternatives were compared: the extension of a tramway line, the upgrading of the present bus system, and the development of a service and bicycle provision concept for rail stations and companies. Besides income and expenditure for each alternative, the effects on transport demand, the impact on air pollution and noise and on space consumption were presented. As a result, the bicycle concept is in most items better than its alternatives. The final report has three volumes and there is an extra guideline for implementing the method within municipalities. It includes a set of excel sheet tables for an easy application (all in German). (orig.) [German] Fuer die Verkehrsplanung wurde ein verkehrstraegeruebergreifendes Bewertungsverfahren fuer Kommunen entwickelt, das motorisierte und nicht motorisierte Verkehrstraeger einbezieht. Das Verfahren soll Gemeinden unterstuetzen, eine oekonomische und oekologisch vertraegliche Verkehrspolitik zu verfolgen. Least Cost Transportation Planning (LCTP) zielt darauf ab, das fuer

  6. Integration of oncologic margins in three-dimensional virtual planning for head and neck surgery, including a validation of the software pathway

    NARCIS (Netherlands)

    Kraeima, Joep; Schepers, Rutger H.; van Ooijen, Peter M. A.; Steenbakkers, Roel J. H. M.; Roodenburg, Jan L. N.; Witjes, Max J. H.

    2015-01-01

    Purpose: Three-dimensional (3D) virtual planning of reconstructive surgery, after resection, is a frequently used method for improving accuracy and predictability. However, when applied to malignant cases, the planning of the oncologic resection margins is difficult due to visualisation of tumours i

  7. Oahu Wind Integration and Transmission Study (OWITS): Hawaiian Islands Transmission Interconnection Project

    Energy Technology Data Exchange (ETDEWEB)

    Woodford, D.

    2011-02-01

    This report provides an independent review included an initial evaluation of the technical configuration and capital costs of establishing an undersea cable system and examining impacts to the existing electric transmission systems as a result of interconnecting the islands.

  8. Phase 2 Report: Oahu Wind Integration and Transmission Study (OWITS); Hawaiian Islands Transmission Interconnection Project

    Energy Technology Data Exchange (ETDEWEB)

    Woodford, D.

    2011-02-01

    This report provides an independent review including an initial evaluation of the technical configuration and capital costs of establishing an undersea cable system and examining impacts to the existing electric transmission systems as a result of interconnecting the islands

  9. Monolithic interconnected modules (MIMs) for thermophotovoltaic energy conversion

    Science.gov (United States)

    Wilt, David; Wehrer, Rebecca; Palmisiano, Marc; Wanlass, Mark; Murray, Christopher

    2003-05-01

    Monolithic interconnected modules (MIMs) are under development for thermophotovoltaic (TPV) energy conversion applications. MIM devices are typified by series-interconnected photovoltaic cells on a common, semi-insulating substrate and generally include rear-surface infrared (IR) reflectors. The MIM architecture is being implemented in InGaAsSb materials without semi-insulating substrates through the development of alternative isolation methodologies. Motivations for developing the MIM structure include: reduced resistive losses, higher output power density than for systems utilizing front surface spectral control, improved thermal coupling and ultimately higher system efficiency. Numerous design and material changes have been investigated since the introduction of the MIM concept in 1994. These developments as well as the current design strategies are addressed.

  10. Recommendations for a Barrier Island Breach Management Plan for Fire Island National Seashore, including the Otis Pike High Dune Wilderness Area, Long Island, New York

    Science.gov (United States)

    Williams, S. Jeffress; Foley, Mary K.

    2007-01-01

    The U.S Army Corps of Engineers, New York District is developing engineering plans, including economic costs and benefits, for storm damage reduction along an 83 mile stretch of the coastal barrier islands and beaches on the south shore of Long Island, NY from Fire Island Inlet east to the Montauk Point headland. The plan, expected to include various alternatives for storm protection and erosion mitigation, is referred to as the Fire Island to Montauk Point Reformulation Plan (FIMP). These plans are expected to follow the Corps of Engineers’ Environmental Operating Principles striving for long term environmental sustainability and balance between environmental protection and protection of human health and property. Fire Island National Seashore (FIIS), a 19,579 acre unit of the National Park System includes a 32 mile long coastal barrier island located within the FIMP project area. A seven-mile section of the park, Otis Pike Fire Island High Dune Wilderness Area, is also a designated Federal Wilderness Area. The FIIS includes not only the barrier island and sand dunes, but also several islands, sand flats and wetlands landward of the barrier, submerged parts of Great South Bay shoreface, extending approximately 4,000 feet into the bay with the inner shelf region extending approximately 1,000 feet seaward of the Fire Island shoreline. The Fire Island barrier islands, a sand-starved system dominated by highly dynamic processes, are struggling to maintain their integrity in the face of sea-level rise and storms. Adding to the dilemma is that development on the barriers and the mainland has increased greatly during the past 50 years. As such, managers and decision makers in federal agencies, state agencies and local governments are challenged to balance tradeoffs between protection of lives and property, public access and long term conservation of natural habitats and processes and the plants and animals that depend on these habitats. National Park Service (NPS

  11. Analytical delay models for RLC interconnects under ramp input

    Institute of Scientific and Technical Information of China (English)

    REN Yinglei; MAO Junfa; LI Xiaochun

    2007-01-01

    Analytical delay models for Resistance Inductance Capacitance (RLC)interconnects with ramp input are presented for difierent situations,which include overdamped,underdamped and critical response cases.The errors of delay estimation using the analytical models proposed in this paper are less bv 3%in comparison to the SPICE-computed delay.These models are meaningful for the delay analysis of actual circuits in which the input signal is ramp but not ideal step input.

  12. The Importance of Documenting and Including Traditional Wisdom in Community-Based Ecotourism Planning: A Case Study of the Nature Park Ponjavica in the Village of Omoljica (Serbia)

    National Research Council Canada - National Science Library

    Đukić, Vesna; Volić, Ivana

    2017-01-01

    ... of its members in the process of tourist product creation. The article operates in the planning phase and aims to give insights into the process of establishing the groundwork for community-based tourism...

  13. Corrective Action Investigation Plan for Corrective Action Unit 410: Waste Disposal Trenches, Tonopah Test Range, Nevada, Revision 0 (includes ROTCs 1, 2, and 3)

    Energy Technology Data Exchange (ETDEWEB)

    NNSA/NV

    2002-07-16

    This Corrective Action Investigation Plan contains the U.S. Department of Energy, National Nuclear Security Administration Nevada Operations Office's approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 410 under the Federal Facility Agreement and Consent Order. Corrective Action Unit 410 is located on the Tonopah Test Range (TTR), which is included in the Nevada Test and Training Range (formerly the Nellis Air Force Range) approximately 140 miles northwest of Las Vegas, Nevada. This CAU is comprised of five Corrective Action Sites (CASs): TA-19-002-TAB2, Debris Mound; TA-21-003-TANL, Disposal Trench; TA-21-002-TAAL, Disposal Trench; 09-21-001-TA09, Disposal Trenches; 03-19-001, Waste Disposal Site. This CAU is being investigated because contaminants may be present in concentrations that could potentially pose a threat to human health and/or the environment, and waste may have been disposed of with out appropriate controls. Four out of five of these CASs are the result of weapons testing and disposal activities at the TTR, and they are grouped together for site closure based on the similarity of the sites (waste disposal sites and trenches). The fifth CAS, CAS 03-19-001, is a hydrocarbon spill related to activities in the area. This site is grouped with this CAU because of the location (TTR). Based on historical documentation and process know-ledge, vertical and lateral migration routes are possible for all CASs. Migration of contaminants may have occurred through transport by infiltration of precipitation through surface soil which serves as a driving force for downward migration of contaminants. Land-use scenarios limit future use of these CASs to industrial activities. The suspected contaminants of potential concern which have been identified are volatile organic compounds; semivolatile organic compounds; high explosives; radiological constituents including depleted

  14. Strategic siting and regional grid interconnections key to low-carbon futures in African countries

    Science.gov (United States)

    Deshmukh, Ranjit; Ndhlukula, Kudakwashe; Radojicic, Tijana; Reilly-Moman, Jessica; Phadke, Amol; Kammen, Daniel M.; Callaway, Duncan S.

    2017-01-01

    Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental–impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with “no-regrets” options—or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6–20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. Overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation. PMID:28348209

  15. Laser printing of 3D metallic interconnects

    Science.gov (United States)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  16. Whispering-gallery microcavity semiconductor lasers suitable for photonic integrated circuits and optical interconnects

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    The characteristics of whispering-gallery-like modes in the equilateral triangle and square microresonators are introduced,including directional emission triangle and square microlasers connected to an output waveguide.We propose a photonic interconnect scheme by connecting two directional emission microlasers with an optical waveguide on silicon integrated circuit chip.The measurement indicates that the triangle microlasers can work as a resonance enhanced photodetector for optical interconnect.

  17. An Improved Interconnection Network Based on NIN

    Institute of Scientific and Technical Information of China (English)

    Li Fei; Li Zhi-tang

    2004-01-01

    The Novel Interconnection Network (NIN)based on inverted-graph topology and crossbar switch is a kind of lower latency and higher throughput interconnection network. But it bas a vital disadvantage, high hardware complexity. In order to reduce system hardware cost, an improved NIN (ININ) structure is proposed. As same as NIN,ININ has constant network diameter. Besides of keeping ad vantages of NIN, hardware cost of ININ is lower than NIN.Furthermore, we design a new deadlock-free routing algorithm for the improved NIN.

  18. A Thermal Model for Carbon Nanotube Interconnects

    Science.gov (United States)

    Mohsin, Kaji Muhammad; Srivastava, Ashok; Sharma, Ashwani K.; Mayberry, Clay

    2013-01-01

    In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT) interconnects and compared with the earlier work. For 1 µm length single-wall carbon nanotube, 3 dB frequency in S12 parameter reduces to ~120 GHz from 1 THz considering Joule heating. It has been found that bias voltage has little effect on scattering parameters, while length has very strong effect on scattering parameters.

  19. Packaging considerations for planar optical interconnection systems.

    Science.gov (United States)

    Acklin, B; Jahns, J

    1994-03-10

    We discuss various aspects of building an integrated optoelectronic system that is based on the concept of planar optics. A particular optical interconnection system has been fabricated and demonstrated. It provides parallel interconnections with 1024 optical channels that could be useful as an optical backplane in an optoelectronic multichip module. We consider the design and the fabrication of the optical system, schemes for the hybrid integration with optoelectronic device arrays, and the thermal management of an integrated system. The proposed hybrid integration scheme is based on mature technologies such as thermal anodic bonding and flip-chip bonding. Possibilities for efficient heat sinking are described.

  20. Cost and Availability Analysis of 2- and 3-Connected WDM Networks Physical Interconnection

    DEFF Research Database (Denmark)

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Pedersen, Jens Myrup

    2012-01-01

    Our future in personal and professional lives is becoming more attached to the evolution of communication technologies and their applications. Consequently, the way Next Generation Network are currently being planned and deployed, might have a great impact on common people depending on how networks...... are physically interconnected. Ideally networks should be cheap, reliable, flexible, and energy efficient, among other properties. However, some of these properties are contradictory, i.e. higher fault tolerant networks usually imply higher deployment costs. Therefore, the interconnection decision is a search...... the nodes has a significant impact on the cost and availability of the network....

  1. Generalized Interconnect Delay Time and Crosstalk Models: I. Applications of Interconnect Optimization Design

    Science.gov (United States)

    Lee, Trent Gwo-Yann; Tseng, Tseung-Yuen; Wong, Shyh-Chyi; Yang, Cheng-Jer; Liang, Mong Song; Cheng, Huang-Chung

    2001-12-01

    New analytical models for estimating the delay time of single line and coupled interconnect for ramp input waveform are derived. The accuracy of the signal delay time and crosstalk noise voltage models for various driver resistances, loading capacitances, and input-ramping rates has also been verified by simulation program with integrated circuit emphasis (SPICE) simulation. Based on the delay and crosstalk models, interconnect optimization design can be discussed thoroughly. The proposed guaranteed-performance interconnect design method is also discussed. These models are useful for performance estimation and layout optimization in VLSI synthesis as well as process optimization in technology development.

  2. Simulation and Optimization of MQW based optical modulator for on chip optical interconnect

    Directory of Open Access Journals (Sweden)

    Sumita Mishra

    2011-05-01

    Full Text Available Optical interconnects are foreseen as a potential solution to improve the performance of data transmission in high speed integrated circuits since electrical interconnects operating at high bit rates have several limitations which creates a bottleneck at the interconnect level. The objective of the work is to model and then simulate the MQWM based optical interconnect transmitter. The power output of the simulated modulator is then optimized with respect to various parameters namely contrast ratio, insertion loss and bias current. The methodology presented here is suitable for investigation of both analog and digital modulation performance but it primarily deals with digital modulation. We have not included the effect of carrier charge density in multiple quantum well simulation.

  3. Electromigration of damascene copper of IC interconnect

    Science.gov (United States)

    Meyer, William Kevin

    Copper metallization patterned with multi-level damascene process is prone to electromigration failure, which affects the reliability and performance of IC interconnect. In typical products, interconnect that is not already constrained by I·R drop or Joule self-heating operates at 'near threshold' conditions. Measurement of electromigration damage near threshold is very difficult due to slow degradation requiring greatly extended stress times, or high currents that cause thermal anomalies. Software simulations of the electromigration mechanism combined with characterization of temperature profiles allows extracting material parameters and calculation of design rules to ensure reliable interconnect. Test structures capable of demonstrating Blech threshold effects while allowing thermal characterization were designed and processed. Electromigration stress tests at various conditions were performed to extract both shortline (threshold) and long-line (above threshold) performance values. The resistance increase time constant shows immortality below Je·L (product of current density and segment length) of 3200 amp/cm. Statistical analysis of times-to-failure show that long lines last 105 hours at 3.1 mA/mum2 (120°C). While this is more robust than aluminum interconnect, the semiconductor industry will be challenged to improve that performance as future products require.

  4. Systems theory of interconnected port contact systems

    NARCIS (Netherlands)

    Eberard, D.; Maschke, B.M.; Schaft, A.J. van der

    2005-01-01

    Port-based network modeling of a large class of complex physical systems leads to dynamical systems known as port-Hamiltonian systems. The key ingredient of any port-Hamiltonian system is a power-conserving interconnection structure (mathematically formalized by the geometric notion of a Dirac struc

  5. Patterned electrodeposition of interconnects using microcontact printing

    NARCIS (Netherlands)

    Hovestad, A.; Rendering, H.; Maijenburg, A.W.

    2012-01-01

    Microcontact printing combined with electroless deposition is a potential low cost technique to make electrical interconnects for opto-electronic devices. Microcontact printed inhibitors locally prevent electroless deposition resulting in a pre-defined pattern of metal tracks. The inhibition of elec

  6. Vector Lyapunov Functions for Stochastic Interconnected Systems

    Science.gov (United States)

    Boussalis, D.

    1985-01-01

    Theoretical paper presents set of sufficient conditions for asymptotic and exponential stability with probability 1 for class of stochastic interconnected systems. Theory applicable to complicated, large-scale mechanical or electrical systems, and, for several design problems, it reduces computational difficulty by relating stability criteria to fundamental structural features of system.

  7. Adapting Memory Hierarchies for Emerging Datacenter Interconnects

    Institute of Scientific and Technical Information of China (English)

    江涛; 董建波; 侯锐; 柴琳; 张立新; 孙凝晖; 田斌

    2015-01-01

    Efficient resource utilization requires that emerging datacenter interconnects support both high performance communication and efficient remote resource sharing. These goals require that the network be more tightly coupled with the CPU chips. Designing a new interconnection technology thus requires considering not only the interconnection itself, but also the design of the processors that will rely on it. In this paper, we study memory hierarchy implications for the design of high-speed datacenter interconnects—particularly as they affect remote memory access—and we use PCIe as the vehicle for our investigations. To that end, we build three complementary platforms: a PCIe-interconnected prototype server with which we measure and analyze current bottlenecks; a software simulator that lets us model microarchitectural and cache hierarchy changes;and an FPGA prototype system with a streamlined switchless customized protocol Thunder with which we study hardware optimizations outside the processor. We highlight several architectural modifications to better support remote memory access and communication, and quantify their impact and limitations.

  8. Colligation or, The Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Franksen, Ole Immanuel; Falster, Peter

    2000-01-01

    The concept of interconnection is fundamental to the modelling of disrete physical systems. On the bais of centuries of scientific experience, everyone will agree that the concept is part of a logically consistent approach, permitting us to draw conclusions, verifiable by observations, from basic......" by Charles Sanders Peirce....

  9. QCD Interconnection Studies at Linear Colliders

    CERN Document Server

    Khoze, V A; Khoze, Valery A.; Sjöstrand, Torbjörn

    1999-01-01

    Heavy objects like the W, Z and t are short-lived compared with typical hadronization times. When pairs of such particles are produced, the subsequent hadronic decay systems may therefore become interconnected. We study such potential effects at Linear Collider energies.

  10. Impulse free interconnection of dynamical systems

    NARCIS (Netherlands)

    Vinjamoor, Harsh; Belur, Madhu N.

    2010-01-01

    In this paper we address the problem that impulses might occur when a to-be-controlled plant is connected to a suitable controller. In the behavioral literature this issue is dealt when studying the so-called 'regular feedback interconnection' (RFI) of the plant and the controller behaviors. We addr

  11. An new representation for interconnection network structures

    Institute of Scientific and Technical Information of China (English)

    刘丽华; 陈建二; 陈松乔; 贾维嘉

    2002-01-01

    An important theoretic interest is to study the relations between different interconnection networks, and to compare the capability and performance of the network structures. The most popular way to do the investigation is network emulation. Based on the classical voltage graph theory, the authors develop a new representation scheme for interconnection network structures. The new approach is a combination of algebraic methods and combinatorial methods. The results demonstrate that the voltage graph theory is a powerful tool for representing well-known interconnection networks and in implementing optimal network emulation algorithms, and in particular, show that all popular interconnection networks have very simple and intuitive representations under the new scheme. The new representation scheme also offers powerful tools for the study of network routings and emulations. For example, we present very simple constructions for optimal network emulations from the cube-connected cycles networks to the butterfly networks, and from the butterfly networks to the hypercube networks. Compared with the most popular way of network emulation, this new scheme is intuitive and easy to realize, and easy to apply to other network structures.

  12. Vector Lyapunov Functions for Stochastic Interconnected Systems

    Science.gov (United States)

    Boussalis, D.

    1985-01-01

    Theoretical paper presents set of sufficient conditions for asymptotic and exponential stability with probability 1 for class of stochastic interconnected systems. Theory applicable to complicated, large-scale mechanical or electrical systems, and, for several design problems, it reduces computational difficulty by relating stability criteria to fundamental structural features of system.

  13. Some LCP Decompositions of Multistage Interconnection Networks

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Some useful layered cross product decompositons are derived both for general bit permutation networks and for(2n-1)-stage multistage interconnection networks. Several issues in related works are clarified and the rearrangeability of some interesting networks are considered. In particular, the rearrangeability of one class of networks is formulated as a new type of combinatorial design problmes.

  14. Impulse free interconnection of dynamical systems

    NARCIS (Netherlands)

    Vinjamoor, Harsh; Belur, Madhu N.

    2010-01-01

    In this paper we address the problem that impulses might occur when a to-be-controlled plant is connected to a suitable controller. In the behavioral literature this issue is dealt when studying the so-called 'regular feedback interconnection' (RFI) of the plant and the controller behaviors. We addr

  15. Colligation, Or the Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Falster, Peter

    1998-01-01

    The concept of interconnection is fundamental to the modelling of discrete, physical systems. On the basis of centuries of scientific experience, everyone will agree that the concept is part of a logically consistent approach, permitting us to draw conclusions, verifiable by observation, from bas...

  16. 47 CFR 95.1313 - Interconnection prohibited.

    Science.gov (United States)

    2010-10-01

    ... facilities of the public switched telephone network to permit the transmission of messages or signals between points in the wireline or radio network of a public telephone company and persons served by multi-use... prohibited. MURS stations are prohibited from interconnection with the public switched...

  17. Laser printed interconnects for flexible electronics

    Science.gov (United States)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  18. Analytical Model based on Green Criteria for Optical Backbone Network Interconnection

    DEFF Research Database (Denmark)

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Pedersen, Jens Myrup

    2011-01-01

    to the evaluation of the environmental impact of networks from physical interconnection point of view. Networks deployment, usage, and disposal are analyzed as contributing elements to ICT’s (Information and Communications Technology) CO2 emissions. This paper presents an analytical model for evaluating...... and quantifying the CO2 emissions of optical backbone networks during their lifetime. The main goal of this work is to present the model and illustrate how to evaluate the physical interconnection of backbones from an environmental perspective. This model can be applied as a new type of decision support criteria...... for backbone’s interconnection, since minimization of CO2 emissions is becoming an important factor. In addition, two case studies are presented to illustrate the use and application of this model, and the need for de facto and international standards to reduce CO2 emissions through good network planning....

  19. Are the fish of the upper and lower Mekong interconnected?

    Institute of Scientific and Technical Information of China (English)

    KANG Bin; PERRETT Lisa; LI Yungang; HE Daming

    2009-01-01

    The Mekong supports one of the richest inland fisheries in the world, with many of the fish migrating long distance to spawn. Little is known about the fisheries and migration strategies of the Upper Mekong whilst it is supposed that many fish species move between the Lower and Upper Mekong. Most likely, natural fish migration in the fiver has been altered by dam construction across the mainstream of the Upper Mekong. In this paper, the interconnectivity of fish species between different sections of the Mekong and negative impacts of dams on migratory fish are studied. Of the 162 fish species in the Upper Mekong and the 869 species in the Lower Mekong, 61 species are common. Results show that there is no significant difference at order level between the UM and LM. Similarity coefficients are used to evaluate interconnectivity at species, genus and family levels among four different sections of the Upper Mekong with each other and with the Lower Mekong as a whole. The highest similarity is found between the middle and lower reach of the Upper Mekong at species and genus levels and the middle and upper reach at family level. Of the eight cascade dams, Mengsong Dam in planning is considered as the biggest threat to migratory fish from the Lower Mekong and should be particularly concerned.

  20. Probabilistic immortality of Cu damascene interconnects

    Science.gov (United States)

    Hau-Riege, Stefan P.

    2002-02-01

    We have studied electromigration short-line effects in Cu damascene interconnects through experiments on lines of various lengths L, stressed at a variety of current densities j, and embedded in different dielectric materials. We observed two modes of resistance evolution: Either the resistance of the lines remains constant for the duration of the test, so that the lines are considered immortal, or the lines fail due to abrupt open-circuit failure. The resistance was not observed to gradually increase and then saturate, as commonly observed in Al-based interconnects, because the barrier is too thin and resistive to serve as a redundant current path should voiding occur. The critical stress for void nucleation was found to be smaller than 41 MPa, since voiding occurred even under the mildest test conditions of j=2 MA/cm2 and L=10.5 μm at 300 °C. A small fraction of short Cu lines failed even at low current densities, which deems necessary a concept of probabilistic immortality rather than deterministic immortality. Experiments and modeling suggest that the probability of immortality is described by (jL2/B), where B is the effective elastic modulus of the metallization scheme. By contrast, the immortality of Al-based interconnects with shunt layers is described by (jL) if no voids nucleate, and (jL/B) if voids do nucleate. Even though the phenomenology of short-line effects differs for Al- and Cu-based interconnects, the immortality of interconnects of either materials system can be explained by the phenomena of nucleation barriers for void formation and void-growth saturation. The differences are due solely to the absence of a shunt layer and the low critical stress for void nucleation in the case of Cu.

  1. Geothermal Power and Interconnection: The Economics of Getting to Market

    Energy Technology Data Exchange (ETDEWEB)

    Hurlbut, D.

    2012-04-01

    This report provides a baseline description of the transmission issues affecting geothermal technologies. The report begins with a comprehensive overview of the grid, how it is planned, how it is used, and how it is paid for. The report then overlays onto this 'big picture' three types of geothermal technologies: conventional hydrothermal systems; emerging technologies such as enhanced engineered geothermal systems (EGS) and geopressured geothermal; and geothermal co-production with existing oil and gas wells. Each category of geothermal technology has its own set of interconnection issues, and these are examined separately for each. The report draws conclusions about each technology's market affinities as defined by factors related to transmission and distribution infrastructure. It finishes with an assessment of selected markets with known geothermal potential, identifying those that offer the best prospects for near-term commercial development and for demonstration projects.

  2. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  3. National Offshore Wind Energy Grid Interconnection Study Full Report

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  4. BALANCED TRUNCATED MODELS OF RC INTERCONNECT CIRCUITS AND THEIR SIMULATION

    Institute of Scientific and Technical Information of China (English)

    Yuan Baoguo; Wang Ben; Wang Shengguo

    2005-01-01

    The Balanced Truncation Method (BTM) is applied to an even distributed RC interconnect case by using Wang's closed-forms of even distributed RC interconnect models. The results show that extremely high order RC interconnect can be high-accurately approximated by only third order balanced model. Related simulations are executed in both time domain and frequency domain. The results may be applied to VLSI interconnect model reduction and design.

  5. Installation and Quality Assurance of the Interconnections between Cryo-assemblies of the LHC Long Straight Sections

    CERN Document Server

    Garion, C; Tock, J P

    2006-01-01

    The interconnections between the cryomagnets and cryogenic utilities in the LHC long Straight Sections constitute the last machine installation activity. They are ensuring continuity of the beam and insulation vacuum systems, cryogenic fluid and electrical circuits and thermal insulation. The assembly is carried out in a constraining tunnel environment with restricted space. Therefore, the assembly sequence has to be well defined and specific tests have to be performed during the interconnection work to secure the reliability of the system and thus to ensure the global accelerator availability. The LHC has 8 long straight insertion zones composed of special cryomagnets involving specific interconnection procedures and QA plans. The aim of this paper is to present the installation and quality assurance procedures implemented for the LHC LSS interconnections. Technologies such as manual and automatic welding and resistive soldering will be described as well as the different quality controls, such as visual and ...

  6. Materials for high-density electronic packaging and interconnection

    Science.gov (United States)

    1990-01-01

    Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

  7. Review And Update Of Fiber Optic Interconnect Standardization

    Science.gov (United States)

    Makuch, John A.

    1980-09-01

    An unofficial discussion of the status of interconnect standardization is presented. It includes an over-view of U.S. and international status in such groups as the EIA P-6 and IEC SC-46E committees. The rationale for choosing the 4 tier system is explained, along with a table showing the structure of the system, as Basic, Generic, Sectional and Detail specifications. The implications of the recent OMB Circular A-119 on Federal Participation in the Development and Use of Voluntary Standards is discussed, particularly as it amplifies the already pressing question of adequate level of resource commitment to the standards question activity.

  8. JOULE HEATING INDUCED INTERCONNECT FAILURE IN 3D IC TECHNOLOGY

    OpenAIRE

    Li, Menglu

    2016-01-01

    With the slow-down of Moore’s law of scaling transistors, the industry is looking for 3D IC technology to extend the Moore’s law by stacking chips vertically. In the 3D IC technology, Joule heating is the most serious reliability concern because of increased power density. Moreover, there are new interconnects in the package to support vertical stacking, including the Through Silicon Via (TSV) inside silicon die, μ-bumps between different dies, and redistribution layer (RDL) to fan out the cu...

  9. Record of Decision for the Electrical Interconnection of the Windy Point Wind Energy Project.

    Energy Technology Data Exchange (ETDEWEB)

    United States. Bonneville Power Administration.

    2006-11-01

    The Bonneville Power Administration (BPA) has decided to offer contract terms for interconnection of 250 megawatts (MW) of power to be generated by the proposed Windy Point Wind Energy Project (Wind Project) into the Federal Columbia River Transmission System (FCRTS). Windy Point Partners, LLC (WPP) propose to construct and operate the proposed Wind Project and has requested interconnection to the FCRTS. The Wind Project will be interconnected at BPA's Rock Creek Substation, which is under construction in Klickitat County, Washington. The Rock Creek Substation will provide transmission access for the Wind Project to BPA's Wautoma-John Day No.1 500-kilovolt (kV) transmission line. BPA's decision to offer terms to interconnect the Wind Project is consistent with BPA's Business Plan Final Environmental Impact Statement (BP EIS) (DOE/EIS-0183, June 1995), and the Business Plan Record of Decision (BP ROD, August 15, 1995). This decision thus is tiered to the BP ROD.

  10. Characterization of a Cobalt-Tungsten Interconnect

    DEFF Research Database (Denmark)

    Harthøj, Anders; Holt, Tobias; Caspersen, Michael

    2012-01-01

    A ferritic steel interconnect for a solid oxide fuel cell must be coated in order to prevent chromium evaporation from the steel substrate. The Technical University of Denmark and Topsoe Fuel Cell have developed an interconnect coating based on a cobalt-tungsten alloy. The purpose of the coating...... is to act both as a diffusion barrier for chromium and provide better protection against high temperature oxidation than a pure cobalt coating. This work presents a characterization of a cobalt-tungsten alloy coating electrodeposited on the ferritic steel Crofer 22 H which subsequently was oxidized in air...... of oxidation time. The coating had completely oxidized during the 300 h oxidation time. GDOES measurements showed that the tungsten was located in an inner zone in the coating/substrate interface. The outer layer of the coating did not contain any tungsten after oxidation but consisted mainly of cobalt...

  11. Development of Interconnect Technologies for Particle Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Tripathi, Mani [Univ. of California, Davis, CA (United States)

    2015-01-29

    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  12. A Thermal Model for Carbon Nanotube Interconnects

    Directory of Open Access Journals (Sweden)

    Clay Mayberry

    2013-04-01

    Full Text Available In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT interconnects and compared with the earlier work. For 1 µm length single-wall carbon nanotube, 3 dB frequency in S12 parameter reduces to ~120 GHz from 1 THz considering Joule heating. It has been found that bias voltage has little effect on scattering parameters, while length has very strong effect on scattering parameters.

  13. Interconnection of bundled solid oxide fuel cells

    Science.gov (United States)

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

    2014-01-14

    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  14. 14 CFR 23.957 - Flow between interconnected tanks.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an...

  15. 14 CFR 25.701 - Flap and slat interconnection.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flap and slat interconnection. 25.701....701 Flap and slat interconnection. (a) Unless the airplane has safe flight characteristics with the... sides of the plane of symmetry must be synchronized by a mechanical interconnection or...

  16. 47 CFR 69.121 - Connection charges for expanded interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Connection charges for expanded interconnection... interconnection. (a) Appropriate connection charge subelements shall be established for the use of equipment and facilities that are associated with offerings of expanded interconnection for special access and...

  17. Algorithms for interconnection and decomposition problems with multidimensional systems

    NARCIS (Netherlands)

    Napp Avelli, Diego; Trentelman, Harry L.

    2007-01-01

    The notion of interconnection is the basis of control in the behavioral approach. In this setting, feedback interconnection of systems is based on the still more fundamental concept of regular interconnection, which has been introduced previously. In this paper, the following problem is addressed: g

  18. Corrective Action Investigation Plan for Corrective Action Unit 529: Area 25 Contaminated Materials, Nevada Test Site, Nevada, Rev. 0, Including Record of Technical Change No. 1

    Energy Technology Data Exchange (ETDEWEB)

    U.S. Department of Energy, National Nuclear Security Administration Nevada Site Office

    2003-02-26

    This Corrective Action Investigation Plan contains the U.S. Department of Energy, National Nuclear Security Administration Nevada Site Office's approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 529, Area 25 Contaminated Materials, Nevada Test Site (NTS), Nevada, under the Federal Facility Agreement and Consent Order. CAU 529 consists of one Corrective Action Site (25-23-17). For the purpose of this investigation, the Corrective Action Site has been divided into nine parcels based on the separate and distinct releases. A conceptual site model was developed for each parcel to address the translocation of contaminants from each release. The results of this investigation will be used to support a defensible evaluation of corrective action alternatives in the corrective action decision document.

  19. Viewing Integrated-Circuit Interconnections By SEM

    Science.gov (United States)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  20. Market Based Analysis of Power System Interconnections

    Science.gov (United States)

    Obushevs, Artjoms; Turcik, Mario; Oleinikova, Irina; Junghans, Gatis

    2011-01-01

    Analysis in this Article is focused on usage of transmission grid under liberalized market with implicit transmission capacity allocation method, e.g. Nordic market. Attention is paid on fundamental changes in transmission utilization and its economical effective operation. For interconnection and power flow analysis and losses calculation model of Nordic grid was developed and transmission losses calculation method was created. Given approach will improve economical efficiency of system operation in electricity market conditions.

  1. Stackable Electronic Computer Modules And Interconnections

    Science.gov (United States)

    Bolotin, Gary S.

    1996-01-01

    Design concept for multiprocessor computer system calls for digital electronic processing circuits of various functionalities contained within identically shaped and sized regular polygonal modules interconnected and stacked by use of rings around edges. Rings contain wide-band bus circuits configured to provide connections to adjacent modules in same layer of stack and/or to modules in different layers. Provides flexibility of configuration to implement any of large variety of designs.

  2. High Performance Interconnect Network for Tianhe System

    Institute of Scientific and Technical Information of China (English)

    廖湘科; 庞征斌; 王克非; 卢宇彤; 谢旻; 夏军; 董德尊; 所光

    2015-01-01

    In this paper, we present the Tianhe-2 interconnect network and message passing services. We describe the architecture of the router and network interface chips, and highlight a set of hardware and software features effectively supporting high performance communications, ranging over remote direct memory access, collective optimization, hardware-enable reliable end-to-end communication, user-level message passing services, etc. Measured hardware performance results are also presented.

  3. Hybrid silicon evanescent approach to optical interconnects

    OpenAIRE

    Liang, Di; Fang, Alexander W.; Chen, Hui-Wen; Sysak, Matthew N; Koch, Brian R.; Lively, Erica; Raday, Omri; Kuo, Ying-hao; Jones, Richard; Bowers, John E

    2009-01-01

    We discuss the recently developed hybrid silicon evanescent platform (HSEP), and its application as a promising candidate for optical interconnects in silicon. A number of key discrete components and a wafer-scale integration process are reviewed. The motivation behind this work is to realize silicon-based photonic integrated circuits possessing unique advantages of III–V materials and silicon-on-insulator waveguides simultaneously through a complementary metal-oxide semiconductor fabrication...

  4. Benefit and cost competitiveness analysis of wind and solar power inter-continent transmission under global energy interconnection mode

    Science.gov (United States)

    Wei, Xiaoxia; Ding, Jian; Liu, Jie; Wei, Tiezhong

    2017-01-01

    Relying on the global energy Interconnection, considering the energy implementation, carrying out clean energy alternative is mainly to use the clean energy to take place of fossil energy. Under the green development scenario, This research gives the global energy interconnection development model, makes the Artic and the Equation as the connection points, gives the Northern hemisphere interconnection model and equator interconnection model unite the whole world energy. This research also identifies the factors effecting the transmission changes cost, including generation cost, transmission cost and landing cost. And take two continents connection as the prediction example, estimate these two continents cost benefit and variable power-jointed scheme cost competitiveness. It showed that under the global energy interconnection mode, the trans-continent mode had better benefit, and the landing cost is good to be used, can solve the pollution and energy restriction.

  5. Exploring the interconnections between gender, health and nature.

    Science.gov (United States)

    MacBride-Stewart, S; Gong, Y; Antell, J

    2016-12-01

    Public health has recognized that nature is good for health but there are calls for a review of its gendered aspects. This review attempts to develop and explore a broad analytical theme - the differing interconnections between gender, health and nature. The paper summarizes the interconnections that have been subject to extensive academic enquiry between gender and health, health and space, and gender and space. A combination of key terms including place; gender; health; outdoor space; green space; natural environment; national parks; femininity; masculinity; recreation; physical activity; sustainability; ecofeminism; feminism; environmental degradation; and environmental justice were used to search the electronic databases Sociological Abstracts, Web of Science and Scopus to identify relevant articles. We took two approaches for this review to provide an overview and analysis of the range of research in the field, and to present a framework of research that is an analysis of the intersection of gender, health and nature. Four dimensions are distinguished: (1) evaluations of health benefits and 'toxicities' of nature; (2) dimensions and qualities of nature/space; (3) environmental justice including accessibility, availability and usability; and (4) identification of boundaries (symbolic/material) that construct differential relationships between nature, gender and health. This paper offers an understanding of how environmental and social conditions may differentially shape the health of women and men. The dimensions direct analytical attention to the diverse linkages that constitute overlapping and inseparable domains of knowledge and practice, to identify complex interconnections between gender, health and nature. This review therefore analyses assumptions about the health benefits of nature, and its risks, for gender from an in-depth, analytical perspective that can be used to inform policy. Copyright © 2016 The Royal Society for Public Health. Published by

  6. Reconfigurable Optical Interconnections Using Dynamic Optoelectronic Holograms

    Science.gov (United States)

    Schulze, Elmar

    1988-04-01

    Increasing complexity and processing speed of electronic circuits and a high device density have led to serious problems in electrical interconnections. Their limitations arise from their signal transmission capacity. power consumption. crosstalk. and reliability. Optical links may solve such problems by offering high data rates of several gigabits per second. large fanouts of up to 100 loads. good reliability and less power expenditure. Optical fibers, integrated optical waveguides or free-space transmission links may be applicable. For the free-space links, lenses. mirrors and holograms can be used to guide the light waves. In this paper, reconfigurable optical interconnection schemes are proposed and described which are based on optoelectronic holograms. Their interference patterns can be changed dynamically. To establish connections as free-space links, the light beams emitted from even hundreds of light sources are imaged onto an array of small dynamic holograms. Their interference patterns are optically and electronically controllable. These holograms diffract and focus each of the incident light beams individually onto the receiving photo-diodes. By changing the hologram interference patterns dynamically. an optical switch is obtained. It renders the establishment of reconfigurable optical interconnections. As optoelectronic holograms very-high-resolution spatial light modulators are proposed.

  7. The first LHC sector is fully interconnected

    CERN Multimedia

    2006-01-01

    Sector 7-8 is the first sector of the LHC to become fully operational. All the magnets, cryogenic line, vacuum chambers and services are interconnected. The cool down of this sector can soon commence. LHC project leader Lyn Evans, the teams from CERN's AT/MCS, AT/VAC and AT/MEL groups, and the members of the IEG consortium celebrate the completion of the first LHC sector. The 10th of November was a red letter day for the LHC accelerator teams, marking the completion of the first sector of the machine. The magnets of sector 7-8, together with the cryogenic line, the vacuum chambers and the distribution feedboxes (DFBs) are now all completely interconnected. Sector 7-8 has thus been closed and is the first LHC sector to become operational. The interconnection work required several thousand electrical, cryogenic and insulating connections to be made on the 210 interfaces between the magnets in the arc, the 30 interfaces between the special magnets and the interfaces with the cryogenic line. 'This represent...

  8. Corrective Action Investigation Plan for Corrective Action Unit 516: Septic Systems and Discharge Points, Nevada Test Site, Nevada, Rev. 0, Including Record of Technical Change No. 1

    Energy Technology Data Exchange (ETDEWEB)

    None

    2003-04-28

    This Corrective Action Investigation Plan (CAIP) contains the U.S. Department of Energy (DOE), National Nuclear Security Administration Nevada Sites Office's (NNSA/NSO's) approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 516, Septic Systems and Discharge Points, Nevada Test Site (NTS), Nevada, under the Federal Facility Agreement and Consent Order. CAU 516 consists of six Corrective Action Sites: 03-59-01, Building 3C-36 Septic System; 03-59-02, Building 3C-45 Septic System; 06-51-01, Sump Piping, 06-51-02, Clay Pipe and Debris; 06-51-03, Clean Out Box and Piping; and 22-19-04, Vehicle Decontamination Area. Located in Areas 3, 6, and 22 of the NTS, CAU 516 is being investigated because disposed waste may be present without appropriate controls, and hazardous and/or radioactive constituents may be present or migrating at concentrations and locations that could potentially pose a threat to human health and the environment. Existing information and process knowledge on the expected nature and extent of contamination of CAU 516 are insufficient to select preferred corrective action alternatives; therefore, additional information will be obtained by conducting a corrective action investigation. The results of this field investigation will support a defensible evaluation of corrective action alternatives in the corrective action decision document. Record of Technical Change No. 1 is dated 3/2004.

  9. Corrective Action Investigation Plan for Corrective Action Unit 536: Area 3 Release Site, Nevada Test Site, Nevada (Rev. 0 / June 2003), Including Record of Technical Change No. 1

    Energy Technology Data Exchange (ETDEWEB)

    None

    2003-06-27

    This Corrective Action Investigation Plan contains the U.S. Department of Energy, National Nuclear Security Administration Nevada Site Office's approach to collect the data necessary to evaluate corrective action alternatives (CAAs) appropriate for the closure of Corrective Action Unit (CAU) 536: Area 3 Release Site, Nevada Test Site, Nevada, under the Federal Facility Agreement and Consent Order. Corrective Action Unit 536 consists of a single Corrective Action Site (CAS): 03-44-02, Steam Jenny Discharge. The CAU 536 site is being investigated because existing information on the nature and extent of possible contamination is insufficient to evaluate and recommend corrective action alternatives for CAS 03-44-02. The additional information will be obtained by conducting a corrective action investigation (CAI) prior to evaluating CAAs and selecting the appropriate corrective action for this CAS. The results of this field investigation are to be used to support a defensible evaluation of corrective action alternatives in the corrective action decision document. Record of Technical Change No. 1 is dated 3-2004.

  10. Compact Models and Measurement Techniques for High-Speed Interconnects

    CERN Document Server

    Sharma, Rohit

    2012-01-01

    Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.

  11. Parallel Interconnection of Broadcast Systems with Multiple FIFO Channels

    Science.gov (United States)

    de Juan Marín, Ruben; Cholvi, Vicent; Jiménez, Ernesto; Muñoz-Escoí, Francesc D.

    This paper proposes new protocols for the interconnection of FIFO- and causal-ordered broadcast systems, thus increasing their scalability. They use several interconnection links between systems, which avoids bottleneck problems due to the network traffic, since messages are not forced to go throughout a single link but instead through the several links we establish. General architectures to interconnect FIFO- and causal-ordered systems are proposed. Failure management is also discussed and a performance analysis is given, detailing the benefits introduced by these interconnection approaches that are able to easily increase the resulting interconnection bandwidth.

  12. Economic and environmental benefits of interconnected systems. The Spanish example

    Energy Technology Data Exchange (ETDEWEB)

    Chicharro, A.S.; Dios Alija, R. de [Red Electrica de Espana, Madrid (Spain)

    1996-12-31

    The interconnected systems provide large technical and economic benefits which, evaluated and contrasted with the associated network investment cost, usually produce important net savings. There are continental electrical systems formed by many interconnected subsystems. The optimal size of an interconnection should be defined within an economic background. It is necessary to take into account the global environmental effects. The approach and results of studies carried out by Red Electrica is presented, in order to analyse both economic and environmental benefits resulting from an increase in the present Spanish interconnection capacities. From both economic and environmental points of view, the development of the interconnected systems is highly positive. (author). 4 refs.

  13. Monolithically interconnected GaAs solar cells: A new interconnection technology for high voltage solar cell output

    Science.gov (United States)

    Dinetta, L. C.; Hannon, M. H.

    1995-01-01

    Photovoltaic linear concentrator arrays can benefit from high performance solar cell technologies being developed at AstroPower. Specifically, these are the integration of thin GaAs solar cell and epitaxial lateral overgrowth technologies with the application of monolithically interconnected solar cell (MISC) techniques. This MISC array has several advantages which make it ideal for space concentrator systems. These are high system voltage, reliable low cost monolithically formed interconnections, design flexibility, costs that are independent of array voltage, and low power loss from shorts, opens, and impact damage. This concentrator solar cell will incorporate the benefits of light trapping by growing the device active layers over a low-cost, simple, PECVD deposited silicon/silicon dioxide Bragg reflector. The high voltage-low current output results in minimal 12R losses while properly designing the device allows for minimal shading and resistance losses. It is possible to obtain open circuit voltages as high as 67 volts/cm of solar cell length with existing technology. The projected power density for the high performance device is 5 kW/m for an AMO efficiency of 26% at 1 5X. Concentrator solar cell arrays are necessary to meet the power requirements of specific mission platforms and can supply high voltage power for electric propulsion systems. It is anticipated that the high efficiency, GaAs monolithically interconnected linear concentrator solar cell array will enjoy widespread application for space based solar power needs. Additional applications include remote man-portable or ultra-light unmanned air vehicle (UAV) power supplies where high power per area, high radiation hardness and a high bus voltage or low bus current are important. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. There is also a high potential for a large number of consumer products. Dual

  14. Supramolecular Organic Nanowires as Plasmonic Interconnects.

    Science.gov (United States)

    Armao, Joseph J; Domoto, Yuya; Umehara, Teruhiko; Maaloum, Mounir; Contal, Christophe; Fuks, Gad; Moulin, Emilie; Decher, Gero; Javahiraly, Nicolas; Giuseppone, Nicolas

    2016-02-23

    Metallic nanostructures are able to interact with an incident electromagnetic field at subwavelength scales by plasmon resonance which involves the collective oscillation of conduction electrons localized at their surfaces. Among several possible applications of this phenomenon, the theoretical prediction is that optical circuits connecting multiple plasmonic elements will surpass classical electronic circuits at nanoscale because of their much faster light-based information processing. However, the placement and coupling of metallic elements smaller than optical wavelengths currently remain a formidable challenge by top-down manipulations. Here, we show that organic supramolecular triarylamine nanowires of ≈1 nm in diameter are able to act as plasmonic waveguides. Their self-assembly into plasmonic interconnects between arrays of gold nanoparticles leads to the bottom-up construction of basic optical nanocircuits. When the resonance modes of these metallic nanoparticles are coupled through the organic nanowires, the optical conductivity of the plasmonic layer dramatically increases from 259 to 4271 Ω(-1)·cm(-1). We explain this effect by the coupling of a hot electron/hole pair in the nanoparticle antenna with the half-filled polaronic band of the organic nanowire. We also demonstrate that the whole hybrid system can be described by using the abstraction of the lumped circuit theory, with a far field optical response which depends on the number of interconnects. Overall, our supramolecular bottom-up approach opens the possibility to implement processable, soft, and low cost organic plasmonic interconnects into a large number of applications going from sensing to metamaterials and information technologies.

  15. Updating Interconnection Screens for PV System Integration

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Mather, B.; Kroposki, B.; Lynn, K.; Razon, A.; Ellis, A.; Hill, R.; Key, T.; Nicole, K.; Smith, J.

    2012-02-01

    This white paper evaluates the origins and usefulness of the capacity penetration screen, offer short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen. Short-term and longer-term alternatives approaches are offered as examples; however, specific modifications to screening procedures should be discussed with stakeholders and must ultimately be adopted by state and federal regulatory bodies.

  16. Environmental Regulation Impacts on Eastern Interconnection Performance

    Energy Technology Data Exchange (ETDEWEB)

    Markham, Penn N [ORNL; Liu, Yilu [ORNL; Young II, Marcus Aaron [ORNL

    2013-07-01

    In the United States, recent environmental regulations will likely result in the removal of nearly 30 GW of oil and coal-fired generation from the power grid, mostly in the Eastern Interconnection (EI). The effects of this transition on voltage stability and transmission line flows have previously not been studied from a system-wide perspective. This report discusses the results of power flow studies designed to simulate the evolution of the EI over the next few years as traditional generation sources are replaced with environmentally friendlier ones such as natural gas and wind.

  17. Cryogenic microstripline-on-Kapton microwave interconnects

    CERN Document Server

    Harris, A I; Lau, J M; Church, S E; Samoska, L A; Cleary, K

    2012-01-01

    Simple broadband microwave interconnects are needed for increasing the size of focal plane heterodyne radiometer arrays. We have measured loss and cross-talk for arrays of microstrip transmission lines in flex circuit technology at 297 and 77 K, finding good performance to at least 20 GHz. The dielectric constant of Kapton substrates changes very little from 297 to 77 K, and the electrical loss drops. The small cross-sectional area of metal in a printed circuit structure yields overall thermal conductivities similar to stainless steel coaxial cable. Operationally, the main performance tradeoffs are between crosstalk and thermal conductivity. We tested a patterned ground plane to reduce heat flux.

  18. Repairable chip bonding/interconnect process

    Science.gov (United States)

    Bernhardt, Anthony F.; Contolini, Robert J.; Malba, Vincent; Riddle, Robert A.

    1997-01-01

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

  19. Manipulating Multistage Interconnection Networks Using Fundamental Arrangements

    Directory of Open Access Journals (Sweden)

    E. Gur

    2010-12-01

    Full Text Available Optimizing interconnection networks is a prime object in switching schemes. In this work the authors present a novel approach for obtaining a required channel arrangement in a multi-stage interconnectionnetwork, using a new concept – a fundamental arrangement. The fundamental arrangement is an initial N-1 stage switch arrangement that allows obtaining any required output channel arrangement given an input arrangement, using N/2 binary switches at each stage. The paper demonstrates how a fundamental arrangement can be achieved and how, once this is done, any required arrangement may be obtained within 2(N-1 steps.

  20. NITINOL Interconnect Device for Optical Fiber Waveguides

    Science.gov (United States)

    1981-07-01

    LE EL,~NAVSEA REPORT NO. S27L~kV-NL 4P fNSWNC TR 81-129 1 JULY 1981 0 NITINOL INTERC&INECT DEVICE FOR OPTICAL FIBER WAVEGUIDES FINAL REPORT A...ACCESSION NO. 3. RECIPIENT’S CATALOG NUMBER NSWC TR 81-129I 1-19 -A )ci , ’ 4 TI TL E (and Sbtitle) S. TYPE OF REPORT & PERIOD COVERED NITINOL ... NITINOL Optical Fibers 20. ABSTRACT (Continue on reverse side if neceeewy and identify by block number) Two different interconnect devices for optical

  1. Scaling silicon photonic switch fabrics for data center interconnection networks.

    Science.gov (United States)

    Nikolova, Dessislava; Rumley, Sébastien; Calhoun, David; Li, Qi; Hendry, Robert; Samadi, Payman; Bergman, Keren

    2015-01-26

    With the rapidly increasing aggregate bandwidth requirements of data centers there is a growing interest in the insertion of optically interconnected networks with high-radix transparent optical switch fabrics. Silicon photonics is a particularly promising and applicable technology due to its small footprint, CMOS compatibility, high bandwidth density, and the potential for nanosecond scale dynamic connectivity. In this paper we analyze the feasibility of building silicon photonic microring based switch fabrics for data center scale optical interconnection networks. We evaluate the scalability of a microring based switch fabric for WDM signals. Critical parameters including crosstalk, insertion loss and switching speed are analyzed, and their sensitivity with respect to device parameters is examined. We show that optimization of physical layer parameters can reduce crosstalk and increase switch fabric scalability. Our analysis indicates that with current state-of-the-art devices, a high radix 128 × 128 silicon photonic single chip switch fabric with tolerable power penalty is feasible. The applicability of silicon photonic microrings for data center switching is further supported via review of microring operations and control demonstrations. The challenges and opportunities for this technology platform are discussed.

  2. Pressure activated interconnection of micro transfer printed components

    Science.gov (United States)

    Prevatte, Carl; Guven, Ibrahim; Ghosal, Kanchan; Gomez, David; Moore, Tanya; Bonafede, Salvatore; Raymond, Brook; Trindade, António Jose; Fecioru, Alin; Kneeburg, David; Meitl, Matthew A.; Bower, Christopher A.

    2016-05-01

    Micro transfer printing and other forms of micro assembly deterministically produce heterogeneously integrated systems of miniaturized components on non-native substrates. Most micro assembled systems include electrical interconnections to the miniaturized components, typically accomplished by metal wires formed on the non-native substrate after the assembly operation. An alternative scheme establishing interconnections during the assembly operation is a cost-effective manufacturing method for producing heterogeneous microsystems, and facilitates the repair of integrated microsystems, such as displays, by ex post facto addition of components to correct defects after system-level tests. This letter describes pressure-concentrating conductor structures formed on silicon (1 0 0) wafers to establish connections to preexisting conductive traces on glass and plastic substrates during micro transfer printing with an elastomer stamp. The pressure concentrators penetrate a polymer layer to form the connection, and reflow of the polymer layer bonds the components securely to the target substrate. The experimental yield of series-connected test systems with >1000 electrical connections demonstrates the suitability of the process for manufacturing, and robustness of the test systems against exposure to thermal shock, damp heat, and mechanical flexure shows reliability of the resulting bonds.

  3. A Privacy-Preserving Distributed Optimal Scheduling for Interconnected Microgrids

    Directory of Open Access Journals (Sweden)

    Nian Liu

    2016-12-01

    Full Text Available With the development of microgrids (MGs, interconnected operation of multiple MGs is becoming a promising strategy for the smart grid. In this paper, a privacy-preserving distributed optimal scheduling method is proposed for the interconnected microgrids (IMG with a battery energy storage system (BESS and renewable energy resources (RESs. The optimal scheduling problem is modeled to minimize the coalitional operation cost of the IMG, including the fuel cost of conventional distributed generators and the life loss cost of BESSs. By using the framework of the alternating direction method of multipliers (ADMM, a distributed optimal scheduling model and an iteration solution algorithm for the IMG is introduced; only the expected exchanging power (EEP of each MG is required during the iterations. Furthermore, a privacy-preserving strategy for the sharing of the EEP among MGs is designed to work with the mechanism of the distributed algorithm. According to the security analysis, the EEP can be delivered in a cooperative and privacy-preserving way. A case study and numerical results are given in terms of the convergence of the algorithm, the comparison of the costs and the implementation efficiency.

  4. An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

    Institute of Scientific and Technical Information of China (English)

    Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

    2011-01-01

    On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency,therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements.The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a globalbus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided designof nanometer scale on-chip buses.

  5. Message Passing Framework for Globally Interconnected Clusters

    Science.gov (United States)

    Hafeez, M.; Asghar, S.; Malik, U. A.; Rehman, A.; Riaz, N.

    2011-12-01

    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  6. Short-Range Optical Wireless Communications for Indoor and Interconnects Applications

    Institute of Scientific and Technical Information of China (English)

    WANG Ke; Ampalavanapillai Nirmalathas; Christina Lim; SONG Tingting; LIANG Tian; Kamal Alameh; Efstratios Skafidas

    2016-01-01

    Optical wireless communications have been widely studied during the past decade in short⁃range applications, such as indoor high⁃speed wireless networks and interconnects in data centers and high⁃performance computing. In this paper, recent developments in high⁃speed short⁃range optical wireless communications are reviewed, including visible light communications (VLCs), infrared in⁃door communication systems, and reconfigurable optical interconnects. The general architecture of indoor high⁃speed optical wire⁃less communications is described, and the advantages and limitations of both visible and infrared based solutions are discussed. The concept of reconfigurable optical interconnects is presented, and key results are summarized. In addition, the challenges and potential future directions of short⁃range optical wireless communications are discussed.

  7. Thin-film chip-to-substrate interconnect and methods for making same

    Science.gov (United States)

    Tuckerman, David B.

    1991-01-01

    Integrated circuit chips are electrically connected to a silica wafer interconnection substrate. Thin film wiring is fabricated down bevelled edges of the chips. A subtractive wire fabrication method uses a series of masks and etching steps to form wires in a metal layer. An additive method direct laser writes or deposits very thin metal lines which can then be plated up to form wires. A quasi-additive or subtractive/additive method forms a pattern of trenches to expose a metal surface which can nucleate subsequent electrolytic deposition of wires. Low inductance interconnections on a 25 micron pitch (1600 wires on a 1 cm square chip) can be produced. The thin film hybrid interconnect eliminates solder joints or welds, and minimizes the levels of metallization. Advantages include good electrical properties, very high wiring density, excellent backside contact, compactness, and high thermal and mechanical reliability.

  8. High-density flexible interconnect for two-dimensional ultrasound arrays.

    Science.gov (United States)

    Fiering, J O; Hultman, P; Lee, W; Light, E D; Smith, S W

    2000-01-01

    We present a method for fabricating flexible multilayer circuits for interconnection to 2-D array ultrasound transducers. In addition, we describe four 2-D arrays in which such flexible interconnect is implemented, including transthoracic arrays with 438 channels operating at up to 7 MHz and intracardiac catheter arrays with 70 channels operating at up to 7 MHz. We employ thin and thick film microfabrication techniques to batch produce the interconnect circuits with minimum dimensions of 12-mum lines, 40-mum vias, and 150-mum array pitch. The arrays show 50-Omega insertion loss of -60 to -84 dB and a fractional bandwidth of 27 to 67%. The arrays are used to obtain real time, in vivo volumetric scans.

  9. Wind/PV Generation for Frequency Regulation and Oscillation Damping in the Eastern Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yong [The University of Tennessee, Knoxville; Gracia, Jose R [ORNL; Hadley, Stanton W [ORNL; Liu, Yilu [ORNL

    2013-12-01

    This report presents the control of renewable energy sources, including the variable-speed wind generators and solar photovoltaic (PV) generators, for frequency regulation and inter-area oscillation damping in the U.S. Eastern Interconnection (EI). In this report, based on the user-defined wind/PV generator electrical control model and the 16,000-bus Eastern Interconnection dynamic model, the additional controllers for frequency regulation and inter-area oscillation damping are developed and incorporated and the potential contributions of renewable energy sources to the EI system frequency regulation and inter-area oscillation damping are evaluated.

  10. Performance optimization of a free space optical interconnect system with a metal-semiconductor-metal detector

    Science.gov (United States)

    Al-Ababneh, Nedal; Khader, Ateka

    2011-08-01

    In this paper we study the possibility and the potentiality of using metal semiconductor-metal photodetector (MSM-PD) in three-dimensional parallel free space optical interconnect (FSOI) systems. The signal-to-noise ratio (SNR) and time response are used as performance measures to optimize the geometry of MSM-PD used in FSOI systems. Both SNR and time response are evaluated, analyzed, and their dependence on feature parameters of the MSM-PD, including finger size, spacing, and number of fingers, are considered. Based on the results obtained, we show that the use of MSM-PD in FSOI improves the interconnect speed at a given acceptable SNR.

  11. Application of MIMO technology for next-generation optical and millimeter-wave interconnects

    Science.gov (United States)

    Fan, Shu-Hao; Guidotti, Daniel; Chang, Gee-Kung

    2012-01-01

    Millimeter-wave wireless interconnects is an emerging technology for ultra-short-reach off-chip transmission, providing spatial flexibility and power-efficient high-speed data transportation. Integrated with carrier-over-fiber technology, we propose a low-phase-noise multi-wireless-transceiver architecture to improve the bit-error-rate performance of conventional wireless interconnects. Multiplexing schemes, including frequency division multiplexing, spatial multiplexing, and beam isolation, can be facilitated by carrier-over-fiber techniques. We introduce a potential application of the multi-input-multi-output high-speed analog multiplexing with open-loop analog circuits and digital feedback.

  12. Electronics box having internal circuit cards interconnected to external connectors sans motherboard

    Science.gov (United States)

    Hockett, John E. (Inventor)

    2005-01-01

    An electronics chassis box includes a pair of opposing sidewalls, a pair of opposing end walls, a bottom surface, a top cover, and ring connectors assemblies mounted in selective ones of the walls of the electronic box. Boss members extend from the bottom surface at different heights upon which circuit cards are mounted in spatial relationship to each other. A flex interconnect substantially reduces and generally eliminates the need of a motherboard by interconnecting the circuit cards to one another and to external connectors mounted within the ring connector assemblies.

  13. Renewable Electricity Futures: Operational Analysis of the Western Interconnection at Very High Renewable Penetrations

    Energy Technology Data Exchange (ETDEWEB)

    Brinkman, Gregory [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2015-09-01

    The goal of this work was to perform a detailed, sub-hourly analysis of very high penetration scenarios for a single interconnection (the Western Interconnection). The scenarios analyzed for this study included a variety of generation infrastructure buildouts and power system operational assumptions, with three different portfolios of renewable generators. The primary conclusion of this study is that sub-hourly operation of the grid is possible with renewable generation levels between 80% and 90%. Dynamic studies will need to be done to understand any impacts on reliability during contingencies and transient events.

  14. Development of Readout Interconnections for the Si-W Calorimeter of SiD

    Energy Technology Data Exchange (ETDEWEB)

    Woods, M.; Fields, R.G.; Holbrook, B.; Lander, R.L.; Moskaleva, A.; Neher, C.; Pasner, J.; Tripathi, M.; /UC, Davis; Brau, J.E.; Frey, R.E.; Strom, D.; /Oregon U.; Breidenbach, M.; Freytag, D.; Haller, G.; Herbst, R.; Nelson, T.; /SLAC; Schier, S.; Schumm, B.; /UC, Santa Cruz

    2012-09-14

    The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.

  15. IP Telephony Interconnection Reference Challenges, Models, and Engineering

    CERN Document Server

    Boucadair, Mohamed; Neves, Pedro Miguel; Einarsson, Olafur Pall

    2011-01-01

    Addressing the growth of IP telephony service offerings within the corporate and residential realm, IP Telephony Interconnection Reference: Challenges, Models, and Engineering examines the technical and regulatory issues related to IP telephony interconnection at the large scale. It describes business and interconnection models, reviews emerging architectures such as IMS and TISPAN, identifies commonly-encountered issues, and supplies solutions to technical issues. The authors offer a detailed overview of SPEERMINT activity and proposed architecture, the current work undertaken in i3 Forum, an

  16. Probability density function modeling for sub-powered interconnects

    Science.gov (United States)

    Pater, Flavius; Amaricǎi, Alexandru

    2016-06-01

    This paper proposes three mathematical models for reliability probability density function modeling the interconnect supplied at sub-threshold voltages: spline curve approximations, Gaussian models,and sine interpolation. The proposed analysis aims at determining the most appropriate fitting for the switching delay - probability of correct switching for sub-powered interconnects. We compare the three mathematical models with the Monte-Carlo simulations of interconnects for 45 nm CMOS technology supplied at 0.25V.

  17. Improvement of system security with unified-power-flow controller at suitable locations under network contingencies of interconnected systems

    OpenAIRE

    Thukaram, D; Jenkins, L.; Visakha, K

    2005-01-01

    The operation and planning of large interconnected power systems are becoming increasingly complex. To maintain security of such systems, it is desirable to estimate the effect of contingencies and plan suitable measures to improve system security/stability. The paper presents an approach for selection of unified-power-flow-controller (UPFC-) suitable locations considering normal and network contingencies after evaluating the degree of severity of the contingencies. The ranking is evaluated u...

  18. Research on optical multistage butterfly interconnection and optoelectronic logic operations

    Science.gov (United States)

    Sun, De-Gui; Wang, Na-Xin; He, Li-Ming; Xu, Mai; Liang, Guo-Dong; Zheng, Jie

    We briefly study butterfly interconnection construction and propose an experimental approach to implementing multistage butterfly interconnection networks by using a special interconnection grating with the reflection ladder structure and liquid crystal light valves (LCLVs), and implementing the optical butterfly interconnections and primary optical digital logic operations. With this foundation, we analyse and discuss the features of the approach by computer simulations. In terms of our theoretical analyses, we improve the ring-circuit approach, based on the reflection ladder structure gratings, into a more suitable form based on transmission gratings, and we substitute the LCLVs with optoelectronic switches. Finally we give the experimental results of both the transmission grating and optoelectronic switches.

  19. 78 FR 73239 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-12-05

    ... technologies. (Institute of Electrical and Electronics Engineers (IEEE) Standard 1547 for Interconnecting... Electricity Consumers Resource Council, American Chemistry Council, American Forest & Paper...

  20. Cost based interconnection charges as a way to induce competition

    DEFF Research Database (Denmark)

    Falch, Morten

    The objective of this paper is to analyse the relationship between regulation of interconnection charges and the level of competition. One of the most important issues in the debate on interconnect regulation has been use of forward looking costs for setting of interconnection charges. This debate...... has been ongoing within the EU as well as in US. This paper discusses the European experiences and in particular the Danish experiences with use of cost based interconnection charges, and their impact on competition in the telecom market....

  1. 78 FR 21928 - Demand Response Coalition v. PJM Interconnection, L.L.C.; Notice of Complaint

    Science.gov (United States)

    2013-04-12

    ... Energy Regulatory Commission Demand Response Coalition v. PJM Interconnection, L.L.C.; Notice of... Regulatory Commission (Commission), 18 CFR 385.206, the Demand Response Coalition \\1\\ (Complainant) filed a... are therefore unenforceable. \\1\\ The Demand Response Coalition includes Comverge, Inc.,...

  2. Electrical Properties of Graphene for Interconnect Applications

    Directory of Open Access Journals (Sweden)

    Antonio Maffucci

    2014-05-01

    Full Text Available A semi-classical electrodynamical model is derived to describe the electrical transport along graphene, based on the modified Boltzmann transport equation. The model is derived in the typical operating conditions predicted for future integrated circuits nano-interconnects, i.e., a low bias condition and an operating frequency up to 1 THz. A generalized non-local dispersive Ohm’s law is derived, which can be regarded as the constitutive equation for the material. The behavior of the electrical conductivity is studied with reference to a 2D case (the infinite graphene layer and a 1D case (the graphene nanoribbons. The modulation effects of the nanoribbons’ size and chirality are highlighted, as well as the spatial dispersion introduced in the 2D case by the dyadic nature of the conductivity.

  3. Functionality Inspection of Interconnected Fire Protection Systems

    DEFF Research Database (Denmark)

    Kærup, René; Jomaas, Grunde

    2014-01-01

    systems, such as a smoke detection system, sprinkler system, warning system and fire ventilation system. However, only smoke detections systems and sprinkler systems require inspection from an independent accredited company, whereas the other systems’ functionality is entirely up to the professionals...... that install them and the owner’s maintenance schedule, both of which do not require any supervision from the authorities. Herein, 12 complex buildings, in which all fire protections systems were inspected by an independent accredited company, were studied to see whether or not the buildings adhere to the fire...... safety design in their operational phase. The results showed that the functionality of the interconnected fire protection systems was not as designed in the performance-based analysis. Furthermore, due to the lack of this functionality the fire safety level is not at high as the authorities’ demand...

  4. Tomographic reconstruction of an integrated circuit interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Levine, Z.H. [National Institute of Standards and Technology, Gaithersburg, Maryland 20899 (United States); Kalukin, A.R. [Physics Department, Rensselaer Polytechnic Institute, Troy, New York 12180-3590 (United States); Frigo, S.P.; McNulty, I. [Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois 60439 (United States); Kuhn, M. [Digital Equipment Corporation, Hudson, Massachusetts 01749 (United States)

    1999-01-01

    An Al{endash}W-silica integrated circuit interconnect sample was thinned to several {mu}m and scanned across a 200 nm focal spot of a Fresnel zone plate operating at photon energy of 1573 eV. The experiment was performed on beamline 2-ID-B of the Advanced Photon Source, a third-generation synchrotron facility. Thirteen scanned projections of the sample were acquired over the angular range {plus_minus}69.2{degree}. At least 301{times}301 pixels were acquired at each angle with a step size of 77{times}57 nm. A three-dimensional image with an approximate uncertainty of 400 nm was reconstructed from projection data using a standard algorithm. The two layers of the integrated circuit and the presence of the focused ion beam markers on the surface of the sample are clearly shown in the reconstruction. {copyright} {ital 1999 American Institute of Physics.}

  5. What to include in your birth plan

    Science.gov (United States)

    ... unmedicated, or "natural," childbirth, and others know they absolutely do not want to have an unmedicated childbirth. ... want for labor and delivery? Do you want music? Lights? Pillows? Photos? Make a list of items ...

  6. Security Constrained Distributed Optimal Power Flow of Interconnected Power Systems

    Institute of Scientific and Technical Information of China (English)

    BINKOU Alhabib; YU Yixin

    2008-01-01

    The security constrained distributed optimal power flow (DOPF) of interconnected power systems is presented. The centralized OPF problem of the multi-area power systems is decomposed into independent DOPF subproblems, one for each area. The dynamic security region (DSR) to guarantee the transient stability constraints and static voltage stability region (SVSR) constraints, and line current limits are included as constraints. The solutions to the DOPF subproblems of the different areas are coordinated through a pricing mechanism until they converge to the centralized OPF solution. The nonlinear DOPF subproblem is solved by predictor-corrector interior point method (PCIPM). The IEEE three-area RTS-96 system is worked out in order to demonstrate the effectiveness of the proposed method.

  7. New clustering algorithm for interconnection of MANET and internet

    Institute of Scientific and Technical Information of China (English)

    万象; 姚尹雄; 王豪行

    2004-01-01

    This paper presents core-agent based clustering (CBC) algorithm, a novel heuristic clustering scheme for interconnection of MANET and Internet using power, movement probability and hop length as constraints. CBC includes two phases as cluster initialization and cluster maintenance. In phase one, the selection of clusterheads obeys the first two constraints, whereas the father node of each clustering node is chosen according to above three ones. Phase two concerns the case of node insertion or removal. Easy access and little alteration of conventional mobile IP are some characters of this algorithm. Simulation results demonstrate that CBC has many advantages as less average hop length, good robustness and less overheads, and the clustered network architecture behaves stably when topology changes.

  8. Interconnecting Multidiscilinary Data Infrastructures: From Federation to Brokering Framework

    Science.gov (United States)

    Nativi, S.

    2014-12-01

    Standardization and federation activities have been played an essential role to push interoperability at the disciplinary and cross-disciplinary level. However, they demonstrated not to be sufficient to resolve important interoperability challenges, including: disciplinary heterogeneity, cross-organizations diversities, cultural differences. Significant international initiatives like GEOSS, IODE, and CEOS demonstrated that a federation system dealing with global and multi-disciplinary domain turns out to be rater complex, raising more the already high entry level barriers for both Providers and Users. In particular, GEOSS demonstrated that standardization and federation actions must be accompanied and complemented by a brokering approach. Brokering architecture and its implementing technologies are able to implement an effective interoperability level among multi-disciplinary systems, lowering the entry level barriers for both data providers and users. This presentation will discuss the brokering philosophy as a complementary approach for standardization and federation to interconnect existing and heterogeneous infrastructures and systems. The GEOSS experience will be analyzed, specially.

  9. Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors

    CERN Document Server

    Andricek, L; Macchiolo, A.; Moser, H.-G.; Nisius, R.; Richter, R.H.; Terzo, S.; Weigell, P.

    2014-01-01

    The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tunability, charge collection, cluster sizes and hit efficiencies. Targeting at ...

  10. Very Large Scale Optical Interconnect Systems For Different Types of Optical Interconnection Networks

    Directory of Open Access Journals (Sweden)

    Ahmed Nabih Zaki Rashed

    2012-04-01

    Full Text Available The need for scalable systems in market demands in terms of lower computing costs and protection of customer investment in computing: scaling up the system to quickly meet business growth is obviously a better way of protecting investment: hardware, software, and human resources. A scalable system should be incrementally expanded, delivering linear incremental performance with a near linear cost increase, and with minimal system redesign (size scalability, additionally, it should be able to use successive, faster processors with minimal additional costs and redesign (generation scalability. On the architecture side, the key design element is the interconnection network. The interconnection network must be able to increase in size using few building blocks and with minimum redesign, deliver a bandwidth that grows linearly with the increase in system size, maintain a low or (constant latency, incur linear cost increase, and readily support the use of new faster processors. The major problem is the ever-increasing speed of the processors themselves and the growing performance gap between processor technology and interconnect technology. Increased central processing unit (CPU speeds and effectiveness of memory latency-tolerating techniques.

  11. Geothermal Power and Interconnection: The Economics of Getting to Market

    Energy Technology Data Exchange (ETDEWEB)

    Hurlbut, David [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2012-04-23

    This report provides a baseline description of the transmission issues affecting geothermal technologies. It is intended for geothermal experts in either the private or public sector who are less familiar with how the electricity system operates beyond the geothermal plant. The report begins with a comprehensive overview of the grid, how it is planned, how it is used, and how it is paid for. The report then overlays onto this "big picture" three types of geothermal technologies: conventional hydrothermal systems; emerging technologies such as enhanced engineered geothermal systems (EGS) and geopressured geothermal; and geothermal co-production with existing oil and gas wells. Each category of geothermal technology has its own set of interconnection issues, and these are examined separately for each. The report draws conclusions about each technology’s market affinities as defined by factors related to transmission and distribution infrastructure. It finishes with an assessment of selected markets with known geothermal potential, identifying those that offer the best prospects for near-term commercial development and for demonstration projects.

  12. Circuit and interconnect design for high bit-rate applications

    NARCIS (Netherlands)

    Veenstra, H.

    2006-01-01

    This thesis presents circuit and interconnect design techniques and design flows that address the most difficult and ill-defined aspects of the design of ICs for high bit-rate applications. Bottlenecks in interconnect design, circuit design and on-chip signal distribution for high bit-rate applicati

  13. Updating Small Generator Interconnection Procedures for New Market Conditions

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.

    2012-12-01

    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  14. 76 FR 35210 - Peetz Logan Interconnect, LLC; Notice of Filing

    Science.gov (United States)

    2011-06-16

    ... From the Federal Register Online via the Government Publishing Office ] DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Peetz Logan Interconnect, LLC; Notice of Filing Take notice that on June 3, 2011, Peetz Logan Interconnect, LLC (PLI) filed a response to a staff deficiency letter...

  15. Perspectives on the metallic interconnects for solid oxide fuel cells

    Institute of Scientific and Technical Information of China (English)

    ZHU Wei-zhong; YAN Mi

    2004-01-01

    The various stages and progress in the development of interconnect materials for solid oxide fuel cells (SOFCs) over the last two decades are reviewed. The criteria for the application of materials as interconnects are highlighted. Interconnects based on lanthanum chromite ceramics demonstrate many inherent drawbacks and therefore are only useful for SOFCs operating around 1000 ℃. The advance in the research of anode-supported flat SOFCs facilitates the replacement of ceramic interconnects with metallic ones due to their significantly lowered working temperature. Besides, interconnects made of metals or alloys offer many advantages as compared to their ceramic counterpart. The oxidation response and thermal expansion behaviors of various prospective metallic interconnects are examined and evaluated. The minimization of contact resistance to achieve desired and reliable stack performance during their projected lifetime still remains a highly challenging issue with metallic interconnects. Inexpensive coating materials and techniques may play a key role in pro moting the commercialization of SOFC stack whose interconnects are constructed of some current commercially available alloys. Alternatively, development of new metallic materials that are capable of forming stable oxide scales with sluggish growth rate and sufficient electrical conductivity is called for.

  16. High Speed Global On-Chip Interconnects and Transceivers

    NARCIS (Netherlands)

    Mensink, E.

    2007-01-01

    The data rate of global on-chip interconnects (up to 10 mm) is limited by a large distributed resistance and capacitance. This thesis describes methods to increase the achievable data rate of global on-chip interconnects with minimal chip area and power consumption, while maintaining data integrity.

  17. Interconnection of Dirac structures via kernel/image representation

    NARCIS (Netherlands)

    Iftime, Orest V.; Sandovici, Adrian

    2011-01-01

    Dirac structures are used to mathematically formalize the power-conserving interconnection structure of physical systems. For finite-dimensional systems several representations are available and it is known that the composition (or interconnection) of two Dirac structures is again a Dirac structure.

  18. Laser induced forward transfer of interconnects for 3D integration

    NARCIS (Netherlands)

    Oosterhuis, G.; Prenen, A.; Huis in 't veld, A.J.

    2011-01-01

    Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSVs) for chip stacking, but also for other interconnect steps like re-distribution layers and solder bumps. Especially in applications with a low number (<100 mm-2) of relatively large

  19. Solar-cell interconnect design for terrestrial photovoltaic modules

    Science.gov (United States)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1984-01-01

    Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

  20. Optimum intermediate fibers for reducing interconnection loss: exact solution.

    Science.gov (United States)

    Yablon, Andrew D; Sumetsky, M

    2007-03-15

    We derive an exact analytical solution for a transmission line of N single-mode intermediate optical fibers that minimize the interconnection loss between any two dissimilar fiber modes that are well described by that paraxial scalar wave equation. Our solution shows that N optimum intermediate fibers reduce the original interconnection loss by a factor of least 1/(N+1) and that the total interconnection loss is only a function of N and the original direct interconnection loss. Our solution is not restricted to axisymmetric fibers or mode fields and therefore could be useful for reducing the interconnection loss between microstructured optical fibers, between certain slab waveguides, or between fibers and optical sources or detectors.

  1. FUNDAMENTAL STUDIES OF THE DURABILITY OF MATERIALS FOR INTERCONNECTS IN SOLID OXIDE FUEL CELLS

    Energy Technology Data Exchange (ETDEWEB)

    Frederick S. Pettit; Gerald H. Meier

    2003-06-30

    This report describes the result of the first eight months of effort on a project directed at improving metallic interconnect materials for solid oxide fuel cells (SOFCs). The results include cyclic oxidation studies of a group of ferritic alloys, which are candidate interconnect materials. The exposures have been carried out in simulated fuel cell atmospheres. The oxidation morphologies have been characterized and the ASR has been measured for the oxide scales. The effect of fuel cell electric current density on chromia growth rates has been considered The thermomechanical behavior of the scales has been investigated by stress measurements using x-ray diffraction and interfacial fracture toughness measurements using indentation. The ultimate goal of this thrust is to use knowledge of changes in oxide thickness, stress and adhesion to develop accelerated testing methods for evaluating SOFC interconnect alloys. Finally a theoretical assessment of the potential for use of ''new'' metallic materials as interconnect materials has been conducted and is presented in this report. Alloys being considered include materials based on pure nickel, materials based on the ''Invar'' concept, and coated materials to optimize properties in both the anode and cathode gases.

  2. Initial results for the silicon monolithically interconnected solar cell product

    Science.gov (United States)

    Dinetta, L. C.; Shreve, K. P.; Cotter, J. E.; Barnett, A. M.

    1995-01-01

    This proprietary technology is based on AstroPower's electrostatic bonding and innovative silicon solar cell processing techniques. Electrostatic bonding allows silicon wafers to be permanently attached to a thermally matched glass superstrate and then thinned to final thicknesses less than 25 micron. These devices are based on the features of a thin, light-trapping silicon solar cell: high voltage, high current, light weight (high specific power) and high radiation resistance. Monolithic interconnection allows the fabrication costs on a per watt basis to be roughly independent of the array size, power or voltage, therefore, the cost effectiveness to manufacture solar cell arrays with output powers ranging from milliwatts up to four watts and output voltages ranging from 5 to 500 volts will be similar. This compares favorably to conventionally manufactured, commercial solar cell arrays, where handling of small parts is very labor intensive and costly. In this way, a wide variety of product specifications can be met using the same fabrication techniques. Prototype solar cells have demonstrated efficiencies greater than 11%. An open-circuit voltage of 5.4 volts, fill factor of 65%, and short-circuit current density of 28 mA/sq cm at AM1.5 illumination are typical. Future efforts are being directed to optimization of the solar cell operating characteristics as well as production processing. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. These features make this proprietary technology an excellent candidate for a large number of consumer products.

  3. Landfill Gas Electricity Project Interconnection Webinar

    Science.gov (United States)

    This page contains information about a webinar LMOP offered to LMOP Partners to address questions associated with connecting electricity generating systems to the grid during LFG energy project planning and implementation.

  4. 76 FR 39870 - PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of Date...

    Science.gov (United States)

    2011-07-07

    ... Energy Regulatory Commission PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection... presents an opportunity to exercise buyer market power; (2) whether the Fixed Resource Requirement (FRR... FRR option that allow parties to self-supply while deterring buyer market power. Parties will have...

  5. Thermal Runaways in LHC Interconnections: Experiments

    CERN Document Server

    Willering, G P; Bottura, L; Scheuerlein, C; Verweij, A P

    2011-01-01

    The incident in the LHC in September 2008 occurred in an interconnection between two magnets of the 13 kA dipole circuit. This event was traced to a defect in one of the soldered joints between two superconducting cables stabilized by a copper busbar. Further investigation revealed defective joints of other types. A combination of (1) a poor contact between the superconducting cable and the copper stabilizer and (2) an electrical discontinuity in the stabilizer at the level of the connection can lead to an unprotected quench of the busbar. Once the heating power in the unprotected superconducting cable exceeds the heat removal capacity a thermal run-away occurs, resulting in a fast melt-down of the non-stabilized cable. We have performed a thorough investigation of the conditions upon which a thermal run-away in the defect can occur. To this aim, we have prepared heavily instrumented samples with well-defined and controlled defects. In this paper we describe the experiment, and the analysis of the data, and w...

  6. Maximizing Algebraic Connectivity in Interconnected Networks

    CERN Document Server

    Shakeri, Heman; Sahneh, Faryad Darabi; Poggi-Corradini, Pietro; Scoglio, Caterina

    2015-01-01

    Algebraic connectivity, the second eigenvalue of the Laplacian matrix, is a measure of node and link connectivity on networks. When studying interconnected networks it is useful to consider a multiplex model, where the component networks operate together with inter-layer links among them. In order to have a well-connected multilayer structure, it is necessary to optimally design these inter-layer links considering realistic constraints. In this work, we solve the problem of finding an optimal weight distribution for one-to-one inter-layer links under budget constraint. We show that for the special multiplex configurations with identical layers, the uniform weight distribution is always optimal. On the other hand, when the two layers are arbitrary, increasing the budget reveals the existence of two different regimes. Up to a certain threshold budget, the second eigenvalue of the supra-Laplacian is simple, the optimal weight distribution is uniform, and the Fiedler vector is constant on each layer. Increasing t...

  7. Interconnection arrangement of routers of processor boards in array of cabinets supporting secure physical partition

    Science.gov (United States)

    Tomkins, James L.; Camp, William J.

    2007-07-17

    A multiple processor computing apparatus includes a physical interconnect structure that is flexibly configurable to support selective segregation of classified and unclassified users. The physical interconnect structure includes routers in service or compute processor boards distributed in an array of cabinets connected in series on each board and to respective routers in neighboring row cabinet boards with the routers in series connection coupled to routers in series connection in respective neighboring column cabinet boards. The array can include disconnect cabinets or respective routers in all boards in each cabinet connected in a toroid. The computing apparatus can include an emulator which permits applications from the same job to be launched on processors that use different operating systems.

  8. Effect of the Interconnected Network Structure on the Epidemic Threshold

    CERN Document Server

    Wang, Huijuan; D'Agostino, Gregorio; Havlin, Shlomo; Stanley, H Eugene; Van Mieghem, Piet

    2013-01-01

    Most real-world networks are not isolated. In order to function fully, they are interconnected with other networks, and this interconnection influences their dynamic processes. For example, when the spread of a disease involves two species, the dynamics of the spread within each species (the contact network) differs from that of the spread between the two species (the interconnected network). We model two generic interconnected networks using two adjacency matrices, A and B, in which A is a 2N*2N matrix that depicts the connectivity within each of two networks of size N, and B a 2N*2N matrix that depicts the interconnections between the two. Using an N-intertwined mean-field approximation, we determine that a critical susceptable-infected-susceptable (SIS) epidemic threshold in two interconnected networks is 1/{\\lambda}1(A+\\alpha B), where the infection rate is \\beta within each of the two individual networks and \\alpha\\beta in the interconnected links between the two networks and {\\lambda}1(A+\\alpha B) is th...

  9. Architectural evaluation of beam-steered shuffle optical interconnect

    Science.gov (United States)

    Murdocca, Miles J.; Batchu, Ravi V.; Dennison, Michael

    1996-06-01

    We report on a reconfigurable optical interconnection approach in which static communication graphs are extracted from high level programs and are mapped onto a two stage optical beam-steered/perfect shuffle interconnect. An array of processing elements (PEs) is partitioned into functional units of equal size that are served by one optical input/output (I/O) port per PE. PEs within a functional unit can use any of the optical I/O ports served by that functional unit. An optical beam-steering mechanism in conjunction with an optical perfect shuffle interconnects the functional units. At the highest level, computer programs are written in the Id dataflow programming language. At the next level, dataflow graphs (communication graphs that represent the natural parallelism in a computation) are automatically extracted from the high-level programs. At the lowest level, the dataflow graphs are mapped onto the optical beam-steered/perfect shuffle interconnect. This mapping step is facilitated by a mechanism that redirects optical beams to that the physical interconnect takes the form of the dataflow graph. An intended application is to create low latency realizations of specialized hardware on-the-fly, such as for rapid prototyping. An advantage of this approach over competing all-electronic or static free-space optical interconnection approaches is that the optical interconnect has low depth (two stages) with low fan-out (typically 1 to 3). In previous work, the behaviors of the mappings are studied for randomly generated dataflow graphs. In the work reported here, the behaviors of the mappings are studied for extracted dataflow graphs. We conclude that this interconnection approach is effective for extracted dataflow graphs, using only a single pass through the network, if the interconnect is augmented with a small crossbar within each functional unit.

  10. Phase 1 - Evaluation of a Functional Interconnect System for Solid Oxide Fuel Cells

    Energy Technology Data Exchange (ETDEWEB)

    James M. Rakowski

    2006-09-30

    This project is focused on evaluating the suitability of materials and complex multi-materials systems for use as solid oxide fuel cell interconnects. ATI Allegheny Ludlum has generated promising results for interconnect materials which incorporate modified surfaces. Methods for producing these surfaces include cladding, which permits the use of novel materials, and modifications via unique thermomechanical processing, which allows for the modification of materials chemistry. The University of Pittsburgh is assisting in this effort by providing use of their in-place facilities for dual atmosphere testing and ASR measurements, along with substantial work to characterize post-exposure specimens. Carnegie Mellon is testing interconnects for chromia scale spallation resistance using macro-scale and nano-scale indentation tests. Chromia spallation can increase electrical resistance to unacceptable levels and interconnect systems must be developed that will not experience spallation within 40,000 hours at operating temperatures. Spallation is one of three interconnect failure mechanisms, the others being excessive growth of the chromia scale (increasing electrical resistance) and scale evaporation (which can poison the cathode). The goal of indentation fracture testing at Carnegie Mellon is to accelerate the evaluation of new interconnect systems (by inducing spalls at after short exposure times) and to use fracture mechanics to understand mechanisms leading to premature interconnect failure by spallation. Tests include bare alloys from ATI and coated systems from DOE Laboratories and industrial partners, using ATI alloy substrates. West Virginia University is working towards developing a cost-effective material for use as a contact material in the cathode chamber of the SOFC. Currently materials such as platinum are well suited for this purpose, but are cost-prohibitive. For the solid-oxide fuel cell to become a commercial reality it is imperative that lower cost

  11. System Impacts from Interconnection of Distributed Resources: Current Status and Identification of Needs for Further Development

    Energy Technology Data Exchange (ETDEWEB)

    Basso, T. S.

    2009-01-01

    This report documents and evaluates system impacts from the interconnection of distributed resources to transmission and distribution systems, including a focus on renewable distributed resource technologies. The report also identifies system impact-resolution approaches and actions, including extensions of existing approaches. Lastly, the report documents the current challenges and examines what is needed to gain a clearer understanding of what to pursue to better avoid or address system impact issues.

  12. Sea Breeze Juan de Fuca transmission project : combined interconnect impact and facility study : summary report

    Energy Technology Data Exchange (ETDEWEB)

    Morissette, V.; Azar, R. [SNC Lavalin Transmission and Distribution, Burnaby, BC (Canada)

    2009-05-08

    The Juan de Fuca (JDF) cable is a 550 MW High Voltage Direct Current (HVDC) submarine transmission line that will link Port Angeles, in Washington State, to South Vancouver Island. The objective of this combined interconnection impact and facility study is to determine the impact of this interconnection to the BC Transmission Corporation (BCTC) system in early 2010, specifically on Vancouver Island. The study involved the following tasks: load flow study; transient stability study; EMTP study; harmonic impedance analysis; insulation coordination study; evaluation of remedial action schemes (RAS); interconnection impact study report; and facility project plan study. The steady state and dynamic performance of the BCTC system on central Vancouver Island were assessed based on both normal operation and the predefined contingency conditions. Three load condition cases were considered, notably heavy winter 2010, light summer 2010 and light summer 2011. Cost estimates were provided along with lead times for the construction of transmission, station, protection and control, and telecom facilities and their auxiliary systems. It was concluded that the JDF cable will complement the existing grid and will add needed reliability, capacity and flexibility to transmission operations in the region. The JDF cable will strengthen British Columbia's electrical reliability and will meet Vancouver Island's electricity needs. According to the study, the cable will not result in any considerable steady state problems under both normal and contingency conditions. refs., tabs., figs.

  13. Reactive power interconnection requirements for PV and wind plants : recommendations to NERC.

    Energy Technology Data Exchange (ETDEWEB)

    McDowell, Jason (General Electric, Schenectady, NY); Walling, Reigh (General Electric, Schenectady, NY); Peter, William (SunPower, Richmond, CA); Von Engeln, Edi (NV Energy, Reno, NV); Seymour, Eric (AEI, Fort Collins, CO); Nelson, Robert (Siemens Wind Turbines, Orlando, FL); Casey, Leo (Satcon, Boston, MA); Ellis, Abraham; Barker, Chris. (SunPower, Richmond, CA)

    2012-02-01

    Voltage on the North American bulk system is normally regulated by synchronous generators, which typically are provided with voltage schedules by transmission system operators. In the past, variable generation plants were considered very small relative to conventional generating units, and were characteristically either induction generator (wind) or line-commutated inverters (photovoltaic) that have no inherent voltage regulation capability. However, the growing level of penetration of non-traditional renewable generation - especially wind and solar - has led to the need for renewable generation to contribute more significantly to power system voltage control and reactive power capacity. Modern wind-turbine generators, and increasingly PV inverters as well, have considerable dynamic reactive power capability, which can be further enhanced with other reactive support equipment at the plant level to meet interconnection requirements. This report contains a set of recommendations to the North-America Electricity Reliability Corporation (NERC) as part of Task 1-3 (interconnection requirements) of the Integration of Variable Generation Task Force (IVGTF) work plan. The report discusses reactive capability of different generator technologies, reviews existing reactive power standards, and provides specific recommendations to improve existing interconnection standards.

  14. On-chip photonic interconnects a computer architect's perspective

    CERN Document Server

    Nitta, Christopher J; Akella, Venkatesh

    2013-01-01

    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  15. Robust decentralized adaptive stabilization for a class of interconnected systems

    Institute of Scientific and Technical Information of China (English)

    Zhaojing WU; Xuejun XIE; Siying ZHANG

    2004-01-01

    The robust decentralized adaptive output-feedback stabilization for a class of interconnected systems with static and dynamic interconnections by using the MT-filters and backstepping design method is studied. By introducing a new filtered tramformation, the adaptive laws were derived for measurement. Under the assumption of the nonlinear growth conditions imposed on the nonlinear interconnections and by constructing the error system and using a new proof method, the global stability of the closed-loop system was effectively analyzed, and the exponential convergence of all the signals except for parameter estimates were guaranteed.

  16. Disturbance Attenuation State-Feedback Control for Uncertain Interconnected Systems

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    This paper studies the problem of robust H∞ control design for a class of uncertain interconnected systems viastate feedback. This class of systems are described by a state space model, which contains unknown nonlinear interactionand time-varying norm-bounded parametric uncertainties in state equation. Using the Riccati-equation-based approach wedesign state feedback control laws, which guarantee the decentralized stability with disturbance attenuation for the inter-connected uncertain systems. A simple example of an interconnected uncertain linear system is presented to illustrate theresults.

  17. Interconnectivity analysis of supercritical CO₂-foamed scaffolds.

    Science.gov (United States)

    Lemon, Greg; Reinwald, Yvonne; White, Lisa J; Howdle, Steven M; Shakesheff, Kevin M; King, John R

    2012-06-01

    This paper describes a computer algorithm for the determination of the interconnectivity of the pore space inside scaffolds used for tissue engineering. To validate the algorithm and its computer implementation, the algorithm was applied to a computer-generated scaffold consisting of a set of overlapping spherical pores, for which the interconnectivity was calculated exactly. The algorithm was then applied to micro-computed X-ray tomography images of supercritical CO(2)-foamed scaffolds made from poly(lactic-co-glycolic acid) (PLGA), whereby the effect of using different weight average molecular weight polymer on the interconnectivity was investigated.

  18. Hybrid silicon evanescent approach to optical interconnects

    Science.gov (United States)

    Liang, Di; Fang, Alexander W.; Chen, Hui-Wen; Sysak, Matthew N.; Koch, Brian R.; Lively, Erica; Raday, Omri; Kuo, Ying-Hao; Jones, Richard; Bowers, John E.

    2009-06-01

    We discuss the recently developed hybrid silicon evanescent platform (HSEP), and its application as a promising candidate for optical interconnects in silicon. A number of key discrete components and a wafer-scale integration process are reviewed. The motivation behind this work is to realize silicon-based photonic integrated circuits possessing unique advantages of III-V materials and silicon-on-insulator waveguides simultaneously through a complementary metal-oxide semiconductor fabrication process. Electrically pumped hybrid silicon distributed feedback and distributed Bragg reflector lasers with integrated hybrid silicon photodetectors are demonstrated coupled to SOI waveguides, serving as the reliable on-chip single-frequency light sources. For the external signal processing, Mach-Zehnder interferometer modulators are demonstrated, showing a resistance-capacitance-limited, 3 dB electrical bandwidth up to 8 GHz and a modulation efficiency of 1.5 V mm. The successful implementation of quantum well intermixing technique opens up the possibility to realize multiple III-V bandgaps in this platform. Sampled grating DBR devices integrated with electroabsorption modulators (EAM) are fabricated, where the bandgaps in gain, mirror, and EAM regions are 1520, 1440 and 1480 nm, respectively. The high-temperature operation characteristics of the HSEP are studied experimentally and theoretically. An overall characteristic temperature ( T 0) of 51°C, an above threshold characteristic temperature ( T 1) of 100°C, and a thermal impedance ( Z T ) of 41.8°C/W, which agrees with the theoretical prediction of 43.5°C/W, are extracted from the Fabry-Perot devices. Scaling this platform to larger dimensions is demonstrated up to 150 mm wafer diameter. A vertical outgassing channel design is developed to accomplish high-quality III-V epitaxial transfer to silicon in a timely and dimension-independent fashion.

  19. Interacting Social Processes on Interconnected Networks

    Science.gov (United States)

    Alvarez-Zuzek, Lucila G.; La Rocca, Cristian E.; Vazquez, Federico; Braunstein, Lidia A.

    2016-01-01

    We propose and study a model for the interplay between two different dynamical processes –one for opinion formation and the other for decision making– on two interconnected networks A and B. The opinion dynamics on network A corresponds to that of the M-model, where the state of each agent can take one of four possible values (S = −2,−1, 1, 2), describing its level of agreement on a given issue. The likelihood to become an extremist (S = ±2) or a moderate (S = ±1) is controlled by a reinforcement parameter r ≥ 0. The decision making dynamics on network B is akin to that of the Abrams-Strogatz model, where agents can be either in favor (S = +1) or against (S = −1) the issue. The probability that an agent changes its state is proportional to the fraction of neighbors that hold the opposite state raised to a power β. Starting from a polarized case scenario in which all agents of network A hold positive orientations while all agents of network B have a negative orientation, we explore the conditions under which one of the dynamics prevails over the other, imposing its initial orientation. We find that, for a given value of β, the two-network system reaches a consensus in the positive state (initial state of network A) when the reinforcement overcomes a crossover value r*(β), while a negative consensus happens for r βc. We develop an analytical mean-field approach that gives an insight into these regimes and shows that both dynamics are equivalent along the crossover line (r*, β*). PMID:27689698

  20. Report on the use of the French-German interconnection in 2006

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2007-07-01

    For years, most of the European electricity interconnections were managed using administrative mechanisms (priority lists or pro-rata), and a priority of access was granted to long-term contracts between incumbent operators. With the liberalization process, cross-border power flows tended to increase, and congestions occurred more frequently, calling for efficient congestion management methods. Furthermore, the European Regulation 1228/2003 on conditions for access to the network for cross-border exchanges in electricity came into force. Among other issues, it stipulated that 'network congestion problems shall be addressed with non-discriminatory market based solutions which give efficient economic signals to the market participants and transmission system operators involved'. In other words, cross-border capacity auctions had to be implemented. Due to repeated critical situations in December 2004 the past pro-rata procedure used for Germany to France exports was replaced as from 5 April 2005 by the introduction of a one-sided explicit auction for the day-ahead capacities by RWE Transportnetz Strom GmbH and EnBW Transportnetze AG. In addition the capacities have been auctioned quarterly and monthly since 1 July 2005. During the summer of 2005, the Federal Network Agency and the Commission de Regulation de l'energie (CRE) set the priority for further developing the auctions in 2006 by having a coordinated congestion management mechanism for both directions. The general principles of the auction design were publicly consulted by the regulators together with further questions on cross-border exchanges in the autumn of 2005. The market participants' statements were assessed by the regulatory authorities and considered through the development of a common Road-map for the congestion management methods at the French-German border, published on 3 November 2005. In addition to the implementation of explicit auctions, this road-map included the

  1. Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

    Science.gov (United States)

    Peter, Geoffrey John M.

    With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect

  2. Extraction of ULSI Interconnect Resistance at High Frequencies

    Institute of Scientific and Technical Information of China (English)

    XIAO Xia; JIAN Duanduan; YAO Suying; ZHANG Shengcai; RUAN Gang

    2005-01-01

    Correct extraction of the ultra-large-scale integrated (ULSI) interconnect components at hight frequencies is very important for evaluating electrical performances of high-speed ULSI circuits.In this paper, the extraction of the interconnect resistance at high frequencies is derived from the Ohm′s law and verified by the software FastHenry.The results are also compared with those of another resistance formula originated from the effective area of the current flowing. The applicability of these two formulae is discussed.The influence of the interconnect geometry on the resistance at high frequencies is studied.The computation indicates that the effect of frequency on the resistance is weak when the skin depth is larger than half of the short side of the rectangular interconnect cross section.With further increase of frequency, the resistance increases obviously. Results imply that conductor with a square cross section exhibits the largest resistance for rectangular conductors of constant cross section area.

  3. Bus Encoder for Crosstalk Avoidance in RLC Modeled Interconnects

    Directory of Open Access Journals (Sweden)

    G. Nagendra Babu

    2012-02-01

    Full Text Available Most of the encoding methods proposed in recent years have dealt with only RC modeled VLSI interconnects. For deep sub micron technologies (DSM, on-chip inductive effects have increased due to faster clock speeds, smaller signal rise times and longer length of on-chip interconnects. All these issues raise the concern for cross talk, propagation delay and power dissipation of overall. Therefore, this research work introduces an efficient Bus Encoder using Bus Inverting (BI method. The proposed design dramatically reduces both cross talk and power dissipation in RLC modeled interconnects which makes it suitable for current high-speed low-power VLSI interconnects. The proposed model demonstrates an overall reduction of power dissipation and cross talk induced delay by 55.43% and 45.87%, respectively.

  4. 78 FR 7523 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-02-01

    ... explored methods to address then current queue management challenges in a manner consistent with..., e.g., IEEE Standard 1547 for Interconnecting Distributed Resources with Electric Power Systems and...

  5. Lightweight Metal RubberTM Sensors and Interconnects Project

    Data.gov (United States)

    National Aeronautics and Space Administration — The objective of the proposed program is to develop lightweight and highly elastic electrically conducting interconnects and strain sensor arrays for next generation...

  6. Free-Space Optical Interconnect Employing VCSEL Diodes

    Science.gov (United States)

    Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

    2009-01-01

    Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

  7. In-plane biocompatible microfluidic interconnects for implantable microsystems.

    Science.gov (United States)

    Johnson, Dean G; Frisina, Robert D; Borkholder, David A

    2011-04-01

    Small mammals, particularly mice, are very useful animal models for biomedical research. Extremely small anatomical dimensions, however, make design of implantable microsystems quite challenging. A method for coupling external fluidic systems to microfluidic channels via in-plane interconnects is presented. Capillary tubing is inserted into channels etched in the surface of a Si wafer with a seal created by Parylene-C deposition. Prediction of Parylene-C deposition into tapered channels based on Knudsen diffusion and deposition characterizations allows for design optimization. Low-volume interconnects using biocompatible, chemical resistant materials have been demonstrated and shown to withstand pressure as high as 827 kPa (120 psi) with an average pull test strength of 2.9 N. Each interconnect consumes less than 0.018 mm3 (18 nL) of volume. The low added volume makes this an ideal interconnect technology for medical applications where implant volume is critical.

  8. Performance evaluation of interconnected logistics networks confronted to hub disruptions

    OpenAIRE

    2016-01-01

    International audience; This paper investigates performance of interconnected logistics networks confronted to disruptions at hub level. With traditional supply chain network design, companies define and optimize their own logistics networks, resulting in current logistics systems being a set of independent heterogeneous logistics networks. The concept of PI aims to integrate independent logistics networks into a global, open, interconnected system. Prior research has shown that the new organ...

  9. Interconnection Optimization for Multi-Cluster Avionics Networks

    OpenAIRE

    2013-01-01

    National audience; The increasing complexity and heterogeneity of avionics networks make resource optimization a challenging task. In contrast to many previous approaches pursuing the optimization of traffic-source mapping and backbone network analysis, our work presented herein mainly focuses on the optimization of interconnection devices for multi-cluster avionics networks. In this paper, we introduce an optimized interconnection device, integrating novel frame packing strategies and schedu...

  10. WDM Nanoscale Laser Diodes for Si Photonic Interconnects

    Science.gov (United States)

    2016-07-25

    IEEE , (12 2012): 0. doi: TOTAL: 1 Number of Papers published in non peer-reviewed journals: 0.00 (c) Presentations Number of Presentations: Non Peer...out: Integration of VCSELs with Si, IEEE OPTICAL INTERCONNECTS CONFERENCE 2014. 06-MAY-14, Coronado, CA. : , G. Zhou, D.G. Deppe, X. Yang, Y. Zhang...SC. : , Dennis Deppe, Mingxin Li, Guowei Zhao, Xu Yang. Impact of VCSEL Scaling on Speed and BIt Energy for High Speed Interconnects, IEEE Summer

  11. Corrective Action Investigation Plan for Corrective Action Unit 254: Area 25 R-MAD Decontamination Facility, Nevada Test Site, Nevada (includes ROTC No. 1, date 01/25/1999)

    Energy Technology Data Exchange (ETDEWEB)

    DOE/NV

    1999-07-29

    This Corrective Action Investigation Plan contains the US Department of Energy, Nevada Operations Office's approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 254 under the Federal Facility Agreement and Consent Order. Corrective Action Unit 254 consists of Corrective Action Site (CAS) 25-23-06, Decontamination Facility. Located in Area 25 at the Nevada Test Site (NTS), CAU 254 was used between 1963 through 1973 for the decontamination of test-car hardware and tooling used in the Nuclear Rocket Development Station program. The CAS is composed of a fenced area measuring approximately 119 feet by 158 feet that includes Building 3126, an associated aboveground storage tank, a potential underground storage area, two concrete decontamination pads, a generator, two sumps, and a storage yard. Based on site history, the scope of this plan is to resolve the problem statement identified during the Data Quality Objectives process that decontamination activities at this CAU site may have resulted in the release of contaminants of concern (COCs) onto building surfaces, down building drains to associated leachfields, and to soils associated with two concrete decontamination pads located outside the building. Therefore, the scope of the corrective action field investigation will involve soil sampling at biased and random locations in the yard using a direct-push method, scanning and static radiological surveys, and laboratory analyses of all soil/building samples. Historical information provided by former NTS employees indicates that solvents and degreasers may have been used in the decontamination processes; therefore, potential COCs include volatile/semivolatile organic compounds, Resource Conservation and Recovery Act metals, petroleum hydrocarbons, polychlorinated biphenyls, pesticides, asbestos, gamma-emitting radionuclides, plutonium, uranium, and strontium-90. The results of this

  12. Chip-to-board interconnects for high-performance computing

    Science.gov (United States)

    Riester, Markus B. K.; Houbertz-Krauss, Ruth; Steenhusen, Sönke

    2013-02-01

    Super computing is reaching out to ExaFLOP processing speeds, creating fundamental challenges for the way that computing systems are designed and built. One governing topic is the reduction of power used for operating the system, and eliminating the excess heat generated from the system. Current thinking sees optical interconnects on most interconnect levels to be a feasible solution to many of the challenges, although there are still limitations to the technical solutions, in particular with regard to manufacturability. This paper explores drivers for enabling optical interconnect technologies to advance into the module and chip level. The introduction of optical links into High Performance Computing (HPC) could be an option to allow scaling the manufacturing technology to large volume manufacturing. This will drive the need for manufacturability of optical interconnects, giving rise to other challenges that add to the realization of this type of interconnection. This paper describes a solution that allows the creation of optical components on module level, integrating optical chips, laser diodes or PIN diodes as components much like the well known SMD components used for electrical components. The paper shows the main challenges and potential solutions to this challenge and proposes a fundamental paradigm shift in the manufacturing of 3-dimensional optical links for the level 1 interconnect (chip package).

  13. On Maintenance of Inter-connectivity Among Multi-representations

    Institute of Scientific and Technical Information of China (English)

    WANG Yan-hui; MENG Hao; LIU Xiao-meng

    2006-01-01

    As the problems of conceptual and representational differences will arise among multi-representations, inter-connectivity maintenance among multi-representations exists as a foundational task in building multi-scale data model. Since the existing methods are still not satisfactory in practice, the inter-connectivity among multiple representations can be only achieved if the multi-scale model is capable of explicitly inter-relating them and dealing with their differences. So, this paper firstly explores the relation among multiple representations from the same entity, such as multi-semantic, multi-geometry, multi-attributes, hierarchical semantic relations and so on. Based on these, this paper proposes aggregation-based semantic hierarchical matching rules (ASHMR) as the basis of tackling inter-connectivity among multi-representations, and defines the available hierarchical semantic knowledge, namely semantically equal, semantically related and semantically irrelevant. According to different change among multi-representations from different types of objects, the applications and techniques of the corresponding hierarchy inter-connectivity matching criterion are explored. And taken the road intersections as examples, a case in point is given in details for describing the strategies of inter-connectivity maintenance, showing that this method is feasible to deal with inter-connectivity.

  14. About message routing in different hypercube interconnection network types

    Directory of Open Access Journals (Sweden)

    M. Popa

    1999-10-01

    Full Text Available The paper treats the problem of message routing in different hypercube interconnection network types. Because the communication algorithms frequently use a few basic communication operations, the purpose was to optain relationships for the total communication time at the implementation of these basic operations in different hypercube interconnection types. The basic communication operations considered were: simple message transfer between two processors, one to all broadcast, all to all broadcast, one to all personalized communication, and all to all personalized communication. For establishing the desired relationships, the starting point were the relationships for the total communication time for the above mentioned operations implemented on three basic interconnection networks: classical hypercube, ring and mesh. The different hypercube interconnection network types considered were: the cube connected cycles network, the extended hypercube, the hypernet network, the k array n hypercube and the composed hypercube. The obtained relationships are useful to establish the performances of the considered networks, from the total communication time point of view, making comparisons between them and between them and the classical hypercube interconnection network with the same number of nodes. The most advantageous interconnection network from the above mentioned point of view, is the composed hypercube with the dynamic position of the nodes.

  15. Isothermal test as a WLR monitor for Cu interconnects

    Science.gov (United States)

    Marathe, Amit P.; Pham, Van; Chan, Jay; Weidner, Jorg-Oliver; Heinig, Volker; Thierbach, Steffi

    2000-08-01

    The need for higher interconnect current densities has been increasing rapidly for advanced integrated circuits. Cu interconnects have emerged as viable candidates to replace Aluminium due to the lower sheet resistivity and increased electro migration lifetime of Cu. Previously, we had reported the use of the isothermal test as a WLR monitor for detecting process defects such as voids in the Aluminium interconnects. This paper further extends the application of the isothermal test methodology for detecting and characterizing process defects in Cu interconnect technology. Package electro migration test are time consuming and may be impractical in detecting process defects in a timely manner. Isothermal test, on the other hand, can be effectively used as a fast WLR process monitor. This paper reports the influence of direction of test current as well as different types of test structures, such as a single level NIST structure and a via chain structure and a via chain structure, on the isothermal test results for Cu interconnects. The isothermal test data has been shown to be helpful in evaluating the location and severity of the process defects through a proper choice of test structures. Joule heating due to high current density is found to be the major driving force for the sensitivity of isothermal test failures. A good correlation is also seen with the package electro migration data. A simple wafer level isothermal test has thus been successfully demonstrated as a reliability tool for process monitoring in Cu VLSI interconnects.

  16. Utility interconnection issues for wind power generation

    Science.gov (United States)

    Herrera, J. I.; Lawler, J. S.; Reddoch, T. W.; Sullivan, R. L.

    1986-01-01

    This document organizes the total range of utility related issues, reviews wind turbine control and dynamic characteristics, identifies the interaction of wind turbines to electric utility systems, and identifies areas for future research. The material is organized at three levels: the wind turbine, its controls and characteristics; connection strategies as dispersed or WPSs; and the composite issue of planning and operating the electric power system with wind generated electricity.

  17. ESnet Program Plan 1994

    Energy Technology Data Exchange (ETDEWEB)

    Merola, S.

    1994-11-01

    This Program Plan characterizes ESnet with respect to the current and future needs of Energy Research programs for network infrastructure, services, and development. In doing so, this document articulates the vision and recommendations of the ESnet Steering Committee regarding ESnet`s development and its support of computer networking facilities and associated user services. To afford the reader a perspective from which to evaluate the ever-increasing utility of networking to the Energy Research community, we have also provided a historical overview of Energy Research networking. Networking has become an integral part of the work of DOE principal investigators, and this document is intended to assist the Office of Scientific Computing in ESnet program planning and management, including prioritization and funding. In particular, we identify the new directions that ESnet`s development and implementation will take over the course of the next several years. Our basic goal is to ensure that the networking requirements of the respective scientific programs within Energy Research are addressed fairly. The proliferation of regional networks and additional network-related initiatives by other Federal agencies is changing the process by which we plan our own efforts to serve the DOE community. ESnet provides the Energy Research community with access to many other peer-level networks and to a multitude of other interconnected network facilities. ESnet`s connectivity and relationship to these other networks and facilities are also described in this document. Major Office of Energy Research programs are managed and coordinated by the Office of Basic Energy Sciences, the Office of High Energy and Nuclear Physics, the Office of Magnetic Fusion Energy, the Office of Scientific Computing, and the Office of Health and Environmental Research. Summaries of these programs are presented, along with their functional and technical requirements for wide-area networking.

  18. Primary, secondary and tertiary frequency control in dynamic security analyses of electric power interconnections

    Directory of Open Access Journals (Sweden)

    Ivanović Milan

    2012-01-01

    Full Text Available This paper presents the incorporation of primary, secondary and tertiary frequency control in the dynamic security analyses of electric power interconnections. This was done in accordance with the wider environment of the existing state of the Serbian power system. The improved software for dynamic security analysis has been tested on the regional transmission network, which includes power systems of Serbia, Montenegro, Bosnia and Herzegovina, Croatia, Hungary, Macedonia, Romania, Bulgaria, Greece and Albania.

  19. Impacts of Demand-Side Resources on Electric Transmission Planning

    Energy Technology Data Exchange (ETDEWEB)

    Hadley, Stanton W. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Sanstad, Alan H. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

    2015-01-01

    Will demand resources such as energy efficiency (EE), demand response (DR), and distributed generation (DG) have an impact on electricity transmission requirements? Five drivers for transmission expansion are discussed: interconnection, reliability, economics, replacement, and policy. With that background, we review the results of a set of transmission studies that were conducted between 2010 and 2013 by electricity regulators, industry representatives, and other stakeholders in the three physical interconnections within the United States. These broad-based studies were funded by the US Department of Energy and included scenarios of reduced load growth due to EE, DR, and DG. While the studies were independent and used different modeling tools and interconnect-specific assumptions, all provided valuable results and insights. However, some caveats exist. Demand resources were evaluated in conjunction with other factors, and limitations on transmission additions between scenarios made understanding the role of demand resources difficult. One study, the western study, included analyses over both 10- and 20-year planning horizons; the 10-year analysis did not show near-term reductions in transmission, but the 20-year indicated fewer transmission additions, yielding a 36percent capital cost reduction. In the eastern study the reductions in demand largely led to reductions in local generation capacity and an increased opportunity for low-cost and renewable generation to export to other regions. The Texas study evaluated generation changes due to demand, and is in the process of examining demand resource impacts on transmission.

  20. A Guidebook on Grid Interconnection and Islanded Operation of Mini-Grid Power Systems Up to 200 kW

    Energy Technology Data Exchange (ETDEWEB)

    Greacen, Chris [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Engel, Richard [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Quetchenbach, Thomas [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

    2013-04-01

    A Guidebook on Grid Interconnection and Islanded Operation of Mini-Grid Power Systems Up to 200 kW is intended to help meet the widespread need for guidance, standards, and procedures for interconnecting mini-grids with the central electric grid as rural electrification advances in developing countries, bringing these once separate power systems together. The guidebook aims to help owners and operators of renewable energy mini-grids understand the technical options available, safety and reliability issues, and engineering and administrative costs of different choices for grid interconnection. The guidebook is intentionally brief but includes a number of appendices that point the reader to additional resources for indepth information. Not included in the scope of the guidebook are policy concerns about “who pays for what,” how tariffs should be set, or other financial issues that are also paramount when “the little grid connects to the big grid.”

  1. Planning manual for utility application of WECS

    Energy Technology Data Exchange (ETDEWEB)

    Park, G.L. (ed.)

    1979-06-01

    A two-part approach for evaluating the feasibility of wind electric conversion systems (WECS) for utility application is presented and explained. Assessment of wind energy potential, sites, interconnection, and capital and production costing is included. The first part is a brief preliminary procedure used to determine whether the expense and effort of a detailed investigation is justified. The preliminary procedure requires assumptions which limit its accuracy. If the result indicates that WECS have probable potential for a specific utility application, then a set of modifications to detailed conventional planning procedures is developed. The modifications include discussion of wind velocity estimation and effects of site features on wind velocity, institutional problems, siting, choosing generation cases with WECS, reliability considerations, production costing, and operating problems. Appendices include an annotated bibliography, wind measurement methods, procedure for estimating WECS capacity factor, and a method for generating correlated wind velocity samples for use in production cost programs.

  2. Study on application of a high-speed trigger-type SFCL (TSFCL) for interconnection of power systems with different reliabilities

    Science.gov (United States)

    Kim, Hye Ji; Yoon, Yong Tae

    2016-11-01

    Interconnection of power systems is one effective way to improve power supply reliability. However, differences in the reliability of each power system create a greater obstacle for the stable interconnection of power systems, as after interconnection a high-reliability system is affected by frequent faults in low reliability side systems. Several power system interconnection methods, such as the back-to-back method and the installation of either transformers or series reactors, have been investigated to counteract the damage caused by faults in the other neighboring systems. However, these methods are uneconomical and require complex operational management plans. In this work, a high-speed trigger-type superconducting fault current limiter (TSFCL) with large-impedance is proposed as a solution to maintain reliability and power quality when a high reliability power system is interconnected with a low reliability power system. Through analysis of the reliability index for the numerical examples obtained from a PSCAD/EMTDC simulator, a high-speed TSFCL with a large-impedance is confirmed to be effective for the interconnection between power systems with different reliabilities.

  3. Printed polymer photonic devices for optical interconnect systems

    Science.gov (United States)

    Subbaraman, Harish; Pan, Zeyu; Zhang, Cheng; Li, Qiaochu; Guo, L. J.; Chen, Ray T.

    2016-03-01

    Polymer photonic device fabrication usually relies on the utilization of clean-room processes, including photolithography, e-beam lithography, reactive ion etching (RIE) and lift-off methods etc, which are expensive and are limited to areas as large as a wafer. Utilizing a novel and a scalable printing process involving ink-jet printing and imprinting, we have fabricated polymer based photonic interconnect components, such as electro-optic polymer based modulators and ring resonator switches, and thermo-optic polymer switch based delay networks and demonstrated their operation. Specifically, a modulator operating at 15MHz and a 2-bit delay network providing up to 35.4ps are presented. In this paper, we also discuss the manufacturing challenges that need to be overcome in order to make roll-to-roll manufacturing practically viable. We discuss a few manufacturing challenges, such as inspection and quality control, registration, and web control, that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible polymer photonic systems. We have overcome these challenges, and currently utilizing our inhouse developed hardware and software tools, communication, sensing, medicine, security, imaging, energy, lighting etc.

  4. Financial Economy and Financial System: Basis of Structural Interconnection

    Directory of Open Access Journals (Sweden)

    Khorosheva Olena I.

    2014-02-01

    Full Text Available The goal of the article lies in identification of grounds of interconnection of the financial economy and financial system. The study was conducted with consideration of main provisions of the theory of finance and concept of financial economy, which is a set of means used in the process of reproduction of finance by their owner for formation and / or maintenance of the own system of values in the viable state. For the first time ever the structure of the financial system is identified as an aggregate of financial economies and financial market. The article justifies a necessity of expansion of boundaries of perception of the state financial economy, which is offered to include public financial economy of the state level and the set of financial economies of the state as a subject of economic activity. Such an approach forms a base for justification of the synthesis of participation of the state in financial relations as the owner and as the basic macro-economic regulator. Prospects of further study in this direction are: development of classification of financial economies; revelation of specific features of impact of shadow finance on development of the national financial economy; and assessment of possibilities of inclusion of structured financial products into the system of values of financial economies in Ukraine.

  5. Interconnected operations services in a vertically integrated utility

    Energy Technology Data Exchange (ETDEWEB)

    Hoffman, S.P. [ComEd, Lombard, IL (United States)

    1999-11-01

    The North American electric industry has historically been composed of regulated Vertically Integrated Utilities (VIU). Vertical integration means that the same company owns generation, transmission, and distribution facilities. Regulated utilities were ensured cost recovery for all justifiable expenses. The entire industry is in the process of deregulation. The industry-wide trend is to competitive generation, while transmission and distribution remain regulated. Many variations, in both timing and structure, exist in states that have enacted deregulation and retail choice legislation. Some have combined retail choice with an ISO and power exchange; others have opted for retail choice without either. In the past, Interconnected Operations Services (IOS) were obtained by informal means within the same company. Generation is now being actively bought and sold as companies align their strategic direction with different sectors of the emerging electric industry. In the future, these IOS will have to be obtained by formal arrangements. The formal arrangements will need to encompass parameters including service definitions, compensation, performance measurement, and performance incentives. These formal arrangements are presently taking different forms in the industry depending on the stage of deregulation in each area, and on the particular agreements made by each Control Area. This paper describes how VIUs obtained and dispatched the IOS needed for reliability, and what challenges will be faced with respect to these services.

  6. Interconnection, Integration, and Interactive Impact Analysis of Microgrids and Distribution Systems

    Energy Technology Data Exchange (ETDEWEB)

    Kang, Ning [Argonne National Lab. (ANL), Argonne, IL (United States); Wang, Jianhui [Argonne National Lab. (ANL), Argonne, IL (United States); Singh, Ravindra [Argonne National Lab. (ANL), Argonne, IL (United States); Lu, Xiaonan [Argonne National Lab. (ANL), Argonne, IL (United States)

    2017-01-01

    Distribution management systems (DMSs) are increasingly used by distribution system operators (DSOs) to manage the distribution grid and to monitor the status of both power imported from the transmission grid and power generated locally by a distributed energy resource (DER), to ensure that power flows and voltages along the feeders are maintained within designed limits and that appropriate measures are taken to guarantee service continuity and energy security. When microgrids are deployed and interconnected to the distribution grids, they will have an impact on the operation of the distribution grid. The challenge is to design this interconnection in such a way that it enhances the reliability and security of the distribution grid and the loads embedded in the microgrid, while providing economic benefits to all stakeholders, including the microgrid owner and operator and the distribution system operator.

  7. Oriented graphene films for use as high-performance thermal and electrical interconnects

    Science.gov (United States)

    Moafi, Ali; Wong, Kevin; Lau, Desmond; Partridge, Jim G.; McCulloch, Dougal G.

    2008-12-01

    Carbon thin films can be prepared with properties that make them suitable for applications in electronics including heat sinks, electrical interconnects transistors and chemical sensors. In this work, we examine the microstructure and normalised through film electrical resistance of oriented and non-oriented carbon films deposited onto silicon substrates at room temperature using a Filtered Cathodic Vacuum Arc (FCVA). Electrical measurements have also been performed on carbon films which were lithographically patterned to produce test structures resembling vertical interconnects. Twopoint, through-film current-voltage measurements of NiCr/Carbon/Si structures showed that the electrical resistance of the carbon films could be varied by several orders of magnitude simply by selecting different substrate bias voltages. Importantly, carbon films composed of vertically aligned graphene sheets were found to provide low resistance, linear current-voltage characteristics, indicating the formation of Ohmic junctions at the NiCr and Si interfaces of the NiCr/Carbon/Si structure.

  8. Fuzzified PSO Algorithm for OPF with FACTS Devices in Interconnected Power Systems

    Science.gov (United States)

    Jothi Swaroopan, N. M.; Somasundaram, P.

    This paper presents a new computationally efficient improved stochastic algorithm for solving Optimal Power Flow (OPF) in interconnected power systems with FACTS devices. This proposed technique is based on the combined application of Fuzzy logic strategy incorporated in Particle Swarm Optimization (PSO) algorithm, hence named as Fuzzified PSO (FPSO). The FACTS devices considered here include Static Var Compensator (SVC), Static Synchronous Compensator (STATCOM), Thyristor Controlled Series Capacitor (TCSC) and Unified Power Flow Controller (UPFC). The proposed method is tested on single area IEEE 30-bus system and interconnected two area systems. The optimal solutions obtained using Evolutionary Programming (EP), PSO and FPSO are compared and analyzed. The analysis reveals that the proposed algorithm is relatively simple, efficient and reliable.

  9. Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects

    Science.gov (United States)

    Tsou, Chia-Hung; Liu, Kai-Ning; Lin, Heng-Tien; Ouyang, Fan-Yi

    2016-12-01

    With the development of intelligent electronic products, usage of fine-pitch interconnects has become mainstream in high performance electronic devices. Electrochemical migration (ECM) of interconnects would be a serious reliability problem under temperature, humidity and biased voltage environments. In this study, ECM behavior of nanopaste Ag interconnects with pitch size from 20 μm to 50 μm was evaluated by thermal humidity bias (THB) and water drop (WD) tests with deionized water through in situ leakage current-versus-time (CVT) curve. The results indicate that the failure time of ECM in fine-pitch samples occurs within few seconds under WD testing and it increases with increasing pitch size. The microstructure examination indicated that intensive dendrite formation of Ag through the whole interface was found to bridge the two electrodes. In the THB test, the CVT curve exhibited two stages, incubation and ramp-up; failure time of ECM was about 173.7 min. In addition, intensive dendrite formation was observed only at the protrusion of the Ag interconnects due to the concentration of the electric field at the protrusion of the Ag interconnects.

  10. High temperature corrosion of metallic interconnects in solid oxide fuel cells

    OpenAIRE

    Martínez Bastidas, David

    2006-01-01

    Research and development has made it possible to use metallic interconnects in solid oxide fuel cells (SOFC) instead of ceramic materials. The use of metallic interconnects was formerly hindered by the high operating temperature, which made the interconnect degrade too much and too fast to be an efficient alternative. When the operating temperature was lowered, the use of metallic interconnects proved to be favourable since they are easier and cheaper to produce than ceramic interconnects....

  11. Corrective Action Investigation Plan for Corrective Action Unit 165: Areas 25 and 26 Dry Well and Washdown Areas, Nevada Test Site, Nevada (including Record of Technical Change Nos. 1, 2, and 3) (January 2002, Rev. 0)

    Energy Technology Data Exchange (ETDEWEB)

    U.S. Department of Energy, National Nuclear Security Administration Nevada Operations Office (NNSA/NV)

    2002-01-09

    This Corrective Action Investigation Plan contains the U.S. Department of Energy, National Nuclear Security Administration Nevada Operations Office's approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 165 under the Federal Facility Agreement and Consent Order. Corrective Action Unit 165 consists of eight Corrective Action Sites (CASs): CAS 25-20-01, Lab Drain Dry Well; CAS 25-51-02, Dry Well; CAS 25-59-01, Septic System; CAS 26-59-01, Septic System; CAS 25-07-06, Train Decontamination Area; CAS 25-07-07, Vehicle Washdown; CAS 26-07-01, Vehicle Washdown Station; and CAS 25-47-01, Reservoir and French Drain. All eight CASs are located in the Nevada Test Site, Nevada. Six of these CASs are located in Area 25 facilities and two CASs are located in Area 26 facilities. The eight CASs at CAU 165 consist of dry wells, septic systems, decontamination pads, and a reservoir. The six CASs in Area 25 are associated with the Nuclear Rocket Development Station that operated from 1958 to 1973. The two CASs in Area 26 are associated with facilities constructed for Project Pluto, a series of nuclear reactor tests conducted between 1961 to 1964 to develop a nuclear-powered ramjet engine. Based on site history, the scope of this plan will be a two-phased approach to investigate the possible presence of hazardous and/or radioactive constituents at concentrations that could potentially pose a threat to human health and the environment. The Phase I analytical program for most CASs will include volatile organic compounds, semivolatile organic compounds, Resource Conservation and Recovery Act metals, total petroleum hydrocarbons, polychlorinated biphenyls, and radionuclides. If laboratory data obtained from the Phase I investigation indicates the presence of contaminants of concern, the process will continue with a Phase II investigation to define the extent of contamination. Based on the

  12. Spontaneous synchronization driven by energy transport in interconnected networks

    CERN Document Server

    Nicosia, Vincenzo; Latora, Vito; Arenas, Alex

    2014-01-01

    The existence of intertwined dynamical processes in interconnected networks is a distinctive aspect of complex systems. For example, cerebral circulation delivers oxygenated blood to the brain through blood vessels, and in turn the neural system in the brain is responsible, through neural network connections, for mediating changes in cerebral blood flow. To understand the effects of the coupling between different processes we study the case of two interconnected networks, one accounting for energy transport and the other for a synchronization dynamics. We observe the emergence of switch-like spontaneous synchronization, similar to that seen in the transition between resting-state and cognitive activity in the human brain, for a wide range of control parameters and for different network topologies. We suggest that similarly interconnected dynamical processes could be responsible for spontaneous synchronization transitions observed in natural systems.

  13. Communication issues in parallel systems with optical interconnections

    Science.gov (United States)

    Berthome, Pascal; Ferreira, A.

    1995-02-01

    In classical massively parallel computers, the complexity of the interconnection networks is much higher than the complexity of the processing elements themselves. Optical interconnections may provide a way to reconsider very large parallel architectures. We compare some optically interconnected parallel multicomputer models with regard to their communication capabilities. We first establish a distinction of such systems, based on the independence of the communication elements embedded in the processors (transmitters and receivers). Then, motivated by the fact that in multicomputers some communication operations have to be very efficiently performed, we study two fundamental communication problems, namely, one-to-all and all-to-all, under the hypothesis of bounded fanout. Our results take also into account a bounded number of available wavelengths.

  14. Generation adequacy and transmission interconnection in regional electricity markets

    Energy Technology Data Exchange (ETDEWEB)

    Cepeda, Mauricio [EDF R and D Division and LARSEN, 27 Avenue Lombart, 92260 Fontenay-aux-Roses (France); Saguan, Marcelo [University of Paris XI-GRJM Group, 27 Avenue Lombart, 92260 Fontenay-aux-Roses (France); Finon, Dominique [CIRED and CNRS, 45 bis avenue de La Belle Gabrielle, 94736 Nogent sur Marne-cedex (France); Pignon, Virginie [EDF R and D Division, 2 avenue du General de Gaulle, 92127 Clamart-cedex (France)

    2009-12-15

    The power system capacity adequacy has public good features that cannot be entirely solved by electricity markets. Regulatory intervention is then necessary and established methods have been used to assess adequacy and help regulators to fix this market failure. In regional electricity markets, transmission interconnections play an important role in contributing to adequacy. However, the adequacy problem and related policy are typically considered at a national level. This paper presents a simple model to study how the interconnection capacity interacts with generation adequacy. First results indicate that increasing interconnection capacity between systems improves adequacy up to a certain level; further increases do not procure additional adequacy improvements. Furthermore, besides adequacy improvement, increasing transmission capacity under asymmetric adequacy criteria or national system characteristics could create several concerns about externalities. These results imply that regional coordination of national adequacy policies is essential to internalise adequacy of cross-border effects. (author)

  15. Carbon nanotube based VLSI interconnects analysis and design

    CERN Document Server

    Kaushik, Brajesh Kumar

    2015-01-01

    The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

  16. Distributed Robustness Analysis of Interconnected Uncertain Systems Using Chordal Decomposition

    DEFF Research Database (Denmark)

    Pakazad, Sina Khoshfetrat; Hansson, Anders; Andersen, Martin Skovgaard

    2014-01-01

    Large-scale interconnected uncertain systems commonly have large state and uncertainty dimensions. Aside from the heavy computational cost of performing robust stability analysis in a centralized manner, privacy requirements in the network can also introduce further issues. In this paper, we...... utilize IQC analysis for analyzing large-scale interconnected uncertain systems and we evade these issues by describing a decomposition scheme that is based on the interconnection structure of the system. This scheme is based on the so-called chordal decomposition and does not add any conservativeness...... to the analysis approach. The decomposed problem can be solved using distributed computational algorithms without the need for a centralized computational unit. We further discuss the merits of the proposed analysis approach using a numerical experiment....

  17. Modeling Interconnect Variability Using Efficient Parametric Model Order Reduction

    CERN Document Server

    Li, Peng; Li, Xin; Pileggi, Lawrence T; Nassif, Sani R

    2011-01-01

    Assessing IC manufacturing process fluctuations and their impacts on IC interconnect performance has become unavoidable for modern DSM designs. However, the construction of parametric interconnect models is often hampered by the rapid increase in computational cost and model complexity. In this paper we present an efficient yet accurate parametric model order reduction algorithm for addressing the variability of IC interconnect performance. The efficiency of the approach lies in a novel combination of low-rank matrix approximation and multi-parameter moment matching. The complexity of the proposed parametric model order reduction is as low as that of a standard Krylov subspace method when applied to a nominal system. Under the projection-based framework, our algorithm also preserves the passivity of the resulting parametric models.

  18. Parallel optical interconnects utilizing VLSI/FLC spatial light modulators

    Science.gov (United States)

    Genco, Sheryl M.

    1991-12-01

    Interconnection architectures are a cornerstone of parallel computing systems. However, interconnections can be a bottleneck in conventional computer architectures because of queuing structures that are necessary to handle the traffic through a switch at very high data rates and bandwidths. These issues must find new solutions to advance the state of the art in computing beyond the fundamental limit of silicon logic technology. Today's optoelectronic (OE) technology in particular VLSI/FLC spatial light modulators (SLMs) can provide a unique and innovative solution to these issues. This paper reports on the motivations for the system, describes the major areas of architectural requirements, discusses interconnection topologies and processor element alternatives, and documents an optical arbitration (i.e., control) scheme using `smart' SLMs and optical logic gates. The network topology is given in section 2.1 `Architectural Requirements -- Networks,' but it should be noted that the emphasis is on the optical control scheme (section 2.4) and the system.

  19. Net Metering and Interconnection Procedures-- Incorporating Best Practices

    Energy Technology Data Exchange (ETDEWEB)

    Jason Keyes, Kevin Fox, Joseph Wiedman, Staff at North Carolina Solar Center

    2009-04-01

    State utility commissions and utilities themselves are actively developing and revising their procedures for the interconnection and net metering of distributed generation. However, the procedures most often used by regulators and utilities as models have not been updated in the past three years, in which time most of the distributed solar facilities in the United States have been installed. In that period, the Interstate Renewable Energy Council (IREC) has been a participant in more than thirty state utility commission rulemakings regarding interconnection and net metering of distributed generation. With the knowledge gained from this experience, IREC has updated its model procedures to incorporate current best practices. This paper presents the most significant changes made to IREC’s model interconnection and net metering procedures.

  20. A one-semester course in modeling of VSLI interconnections

    CERN Document Server

    Goel, Ashok

    2014-01-01

    Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-i

  1. Real-time synthesis of sparsely interconnected neural associative memories.

    Science.gov (United States)

    Chan, Hubert Y.; Zak, Stanislaw H.

    1998-06-01

    The problem of implementing associative memories using sparsely interconnected generalized Brain-State-in-a-Box (gBSB) network is addressed in this paper. In particular, a "designer" neural network that synthesizes the associative memories is proposed. An upper bound on the time required for the designer network to reach a solution is determined. A neighborhood criterion with toroidal geometry for the cellular gBSB network is analyzed, in which the number of adjacent cells is independent of the generic cell location. A design method of neural associative memories with prespecified interconnecting weights is presented. The effectiveness of the proposed synthesis method is demonstrated with numerical examples.

  2. Compact models and performance investigations for subthreshold interconnects

    CERN Document Server

    Dhiman, Rohit

    2014-01-01

    The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wi

  3. Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

    CERN Document Server

    Marenco, N; Reinert, W

    2008-01-01

    Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and fine-pitch solder balling to finally form a Chip-Scale System-in-Package (CSSiP).

  4. Decentralized impulsive control for a class of uncertain interconnected systems

    Institute of Scientific and Technical Information of China (English)

    成新明; 关治洪; 刘新芝

    2004-01-01

    A great deal of stabilization criteria has been obtained from study of stabilizing interconnected systems. The results obtained are usually based on continuous systems by state feedback. In this paper, decentralized impulsive control is presented to stabilize a class of uncertain interconnected systems based on Lyapunov theory. The system under consideration involves parameter uncertainties and unknown nonlinear interactions among subsystems. Some new criteria of stabilization under impulsive control are established. Two numerical examples are offered to prove the effectiveness and practicality of the proposed method.

  5. EEG simulation by 2D interconnected chaotic oscillators

    Energy Technology Data Exchange (ETDEWEB)

    Kubany, Adam, E-mail: adamku@bgu.ac.i [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel); Mhabary, Ziv; Gontar, Vladimir [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel)

    2011-01-15

    Research highlights: ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. An inverse problem solution (PRCGA) is proposed. Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  6. Fundamentals of reliability engineering applications in multistage interconnection networks

    CERN Document Server

    Gunawan, Indra

    2014-01-01

    This book presents fundamentals of reliability engineering with its applications in evaluating reliability of multistage interconnection networks. In the first part of the book, it introduces the concept of reliability engineering, elements of probability theory, probability distributions, availability and data analysis.  The second part of the book provides an overview of parallel/distributed computing, network design considerations, and more.  The book covers a comprehensive reliability engineering methods and its practical aspects in the interconnection network systems. Students, engineers, researchers, managers will find this book as a valuable reference source.

  7. Interconnects for intermediate temperature solid oxide fuel cells

    Science.gov (United States)

    Huang, Wenhua

    Presently, one of the principal goals of solid oxide fuel cells (SOFCs) research is to reduce the stack operating temperature to between 600 and 800°C. However, one of the principal technological barriers is the non-availability of a suitable material satisfying all of the stability requirements for the interconnect. In this work two approaches for intermediate temperature SOFC interconnects have been explored. The first approach comprises an interconnect consisting of a bi-layer structure, a p-type oxide (La0.96Sr0.08MnO 2.001/LSM) layer exposed to a cathodic environment, and an n-type oxide (Y0.08Sr0.88Ti0.95Al0.05O 3-delta/YSTA) layer exposed to anodic conditions. Theoretical analysis based on the bi-layer structure has established design criteria to implement this approach. The analysis shows that the interfacial oxygen partial pressure, which determines the interconnect stability, is independent of the electronic conductivities of both layers but dependent on the oxygen ion layer interconnects, the oxygen ion conductivities of LSM and YSTA were measured as a function of temperature and oxygen partial pressure. Based on the measured data, it has been determined that if the thickness of YSTA layer is around 0.1cm, the thickness of LSM layer should be around 0.6 mum in order to maintain the stability of LSM. In a second approach, a less expensive stainless steel interconnect has been studied. However, one of the major concerns associated with the use of metallic interconnects is the development of a semi-conducting or insulating oxide scale and chromium volatility during extended exposure to the SOFC operating environment. Dense and well adhered Mn-Cu spinet oxide coatings were successfully deposited on stainless steel by an electrophoretic deposition (EPD) technique. It was found that the Mn-Cu-O coating significantly reduced the oxidation rate of the stainless steel and the volatility of chromium. The area specific resistance (ASR) of coated Crofer 22 APU is

  8. DECENTRALIZED STABILIZATION OF A CLASS OF INTERCONNECTED SYSTEMS

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    This paper is concerned with the decentralized stabilization of continuous and discrete linear interconnected systems with the structural constraints about the interconnection matrices. For the continuous case,the main improvement in the paper as compared with the corresponding results in the literature is to extend the considered class of systems from S to S*(both will be defined in the paper)without resulting in high decentralized gain and difficult numerical computation. The algorithm for obtaining decentralized state feedback control to stable the overall system is presented. The discrete case and some very useful results are discussed as well.

  9. Testing Interconnections using Conductive Adhesives for Application in PV Modules

    Energy Technology Data Exchange (ETDEWEB)

    Broek, K.M.; De Jong, P.C.; Kloos, M.J.H. [ECN Solar Energy, Petten (Netherlands); Van den Nieuwenhof, M.A.C.J.; Bots, T.L.; Meuwissen, M.H.H.; Steijvers, H.L.A.H. [TNO Science and Industry, Eindhoven (Netherlands)

    2006-09-15

    In current module production the electrical interconnections are soldered to the solar cells. For current modules with thin cells and new module concepts with back contact cells, the replacement of solder by conductive adhesives can be advantageous. However, the current IEC tests were developed for soldered interconnections, which have other failure mechanisms. Therefore, three additional tests have been developed for the testing of conductive adhesives to be used in solar modules. In combination with computer simulation techniques developed in the same project, the tests will contribute to a better understanding of failure mechanisms of PV modules with conductive adhesives.

  10. Novel paradigm for integrated photonics circuits: transient interconnection network

    Science.gov (United States)

    Fazio, Eugenio; Belardini, Alessandro; Bastiani, Lorenzo; Alonzo, Massimo; Chauvet, Mathieu; Zheludev, Nikolay I.; Soci, Cesare

    2017-01-01

    Self-confined beams and spatial solitons were always investigated for a purely academic point of view, describing their formation and cross-interaction. We propose a novel paradigm for integrated photonics circuits based on self-confined interconnections. We consider that circuits are not designed since beginning; a network of writing lasers provide the circuit configuration inside which information at a different wavelength travels. we propose new designs for interconnections and both digital and analog switching gates somehow inspired by Nature, following analog decision routes used in biological networks like brain synapsis or animal path finding.

  11. Research study: Device technology STAR router user's guide. [automated layout of large scale integration discretionary interconnection masks

    Science.gov (United States)

    Wright, R. A.

    1979-01-01

    The STAR Router program developed to perform automated layout of LSI discretionary interconnection masks is described. The input and output for the router are standard PR2D data files. A state-of-the-art cellular path-finding procedure, based on Lee's algorithm, which produces fast, shortest distance routing of microcircuit net data is included.

  12. A Visually Attractive "Interconnected Network of Ideas" for Organizing the Teaching and Learning of Descriptive Inorganic Chemistry

    Science.gov (United States)

    Rodgers, Glen E.

    2014-01-01

    A visually attractive interconnected network of ideas that helps general and second-year inorganic chemistry students make sense of the descriptive inorganic chemistry of the main-group elements is presented. The eight network components include the periodic law, the uniqueness principle, the diagonal effect, the inert-pair effect, the…

  13. A Visually Attractive "Interconnected Network of Ideas" for Organizing the Teaching and Learning of Descriptive Inorganic Chemistry

    Science.gov (United States)

    Rodgers, Glen E.

    2014-01-01

    A visually attractive interconnected network of ideas that helps general and second-year inorganic chemistry students make sense of the descriptive inorganic chemistry of the main-group elements is presented. The eight network components include the periodic law, the uniqueness principle, the diagonal effect, the inert-pair effect, the…

  14. (Climate) Change in young people's minds - From categories towards interconnections between the anthroposphere and natural sphere.

    Science.gov (United States)

    Körfgen, Annemarie; Keller, Lars; Kuthe, Alina; Oberrauch, Anna; Stötter, Hans

    2017-02-15

    The grand challenges of the 21st century will increasingly require societies to reconsider the pathways taken thus far. Engagement with climate change is of ever-growing importance to young people. They will be confronted with the effects of climate change throughout their entire lives and, as future decision-makers, they will vitally shape societal developments. Education will thus play a crucial role in the transformation to a sustainable society. In terms of awareness-raising, an important first step in preparing young people for the challenges of the 21st century is to understand what content is connected with climate change. As complex challenges, such as climate change, demand ways of thinking that go beyond categories, interconnections between the anthroposphere and the natural sphere have to be taken into consideration. This study provides an insight into the questions and topics young people develop whilst becoming involved in climate change in an in-school learning setting and in an out-of-school learning setting (a high mountain environment). The analysis focuses on the question of in which spheres students predominantly make their thematic choices and how far the interconnections between different spheres are formed. Our results show that the choice of the learning setting influences the topics students connect with climate change. Interconnections between sub-spheres of the anthroposphere and natural sphere are made only occasionally. These findings serve as a basis for reconsidering the content and foundation of climate change communication with young people. We recommend that climate change educational programmes should include phases that allow the following: a) involvement with climate change issues related to single spheres in the first phase, and b) consideration of the interconnections between spheres when becoming involved with climate change issues in the second phase. As the educational setting can considerably influence the focus of the

  15. Corrective Action Investigation Plan for Corrective Action Unit 214: Bunkers and Storage Areas Nevada Test Site, Nevada: Revision 0, Including Record of Technical Change No. 1 and No. 2

    Energy Technology Data Exchange (ETDEWEB)

    U.S. Department of Energy, National Nuclear Security Administration Nevada Site Office

    2003-05-16

    This Corrective Action Investigation Plan contains the U.S. Department of Energy, National Nuclear Security Administration Nevada Site Office's approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 214 under the Federal Facility Agreement and Consent Order. Located in Areas 5, 11, and 25 of the Nevada Test Site, CAU 214 consists of nine Corrective Action Sites (CASs): 05-99-01, Fallout Shelters; 11-22-03, Drum; 25-99-12, Fly Ash Storage; 25-23-01, Contaminated Materials; 25-23-19, Radioactive Material Storage; 25-99-18, Storage Area; 25-34-03, Motor Dr/Gr Assembly (Bunker); 25-34-04, Motor Dr/Gr Assembly (Bunker); and 25-34-05, Motor Dr/Gr Assembly (Bunker). These sites are being investigated because existing information on the nature and extent of potential contamination is insufficient to evaluate and recommend corrective action alternatives (CAAs). The suspected contaminants and critical analyte s for CAU 214 include oil (total petroleum hydrocarbons-diesel-range organics [TPH-DRO], polychlorinated biphenyls [PCBs]), pesticides (chlordane, heptachlor, 4,4-DDT), barium, cadmium, chronium, lubricants (TPH-DRO, TPH-gasoline-range organics [GRO]), and fly ash (arsenic). The land-use zones where CAU 214 CASs are located dictate that future land uses will be limited to nonresidential (i.e., industrial) activities. The results of this field investigation will support a defensible evaluation of viable corrective action alternatives that will be presented in the corrective action decision document.

  16. Flexible Peripheral Component Interconnect Input/Output Card

    Science.gov (United States)

    Bigelow, Kirk K.; Jerry, Albert L.; Baricio, Alisha G.; Cummings, Jon K.

    2010-01-01

    The Flexible Peripheral Component Interconnect (PCI) Input/Output (I/O) Card is an innovative circuit board that provides functionality to interface between a variety of devices. It supports user-defined interrupts for interface synchronization, tracks system faults and failures, and includes checksum and parity evaluation of interface data. The card supports up to 16 channels of high-speed, half-duplex, low-voltage digital signaling (LVDS) serial data, and can interface combinations of serial and parallel devices. Placement of a processor within the field programmable gate array (FPGA) controls an embedded application with links to host memory over its PCI bus. The FPGA also provides protocol stacking and quick digital signal processor (DSP) functions to improve host performance. Hardware timers, counters, state machines, and other glue logic support interface communications. The Flexible PCI I/O Card provides an interface for a variety of dissimilar computer systems, featuring direct memory access functionality. The card has the following attributes: 8/16/32-bit, 33-MHz PCI r2.2 compliance, Configurable for universal 3.3V/5V interface slots, PCI interface based on PLX Technology's PCI9056 ASIC, General-use 512K 16 SDRAM memory, General-use 1M 16 Flash memory, FPGA with 3K to 56K logical cells with embedded 27K to 198K bits RAM, I/O interface: 32-channel LVDS differential transceivers configured in eight, 4-bit banks; signaling rates to 200 MHz per channel, Common SCSI-3, 68-pin interface connector.

  17. Silicon Modulators, Switches and Sub-systems for Optical Interconnect

    Science.gov (United States)

    Li, Qi

    Silicon photonics is emerging as a promising platform for manufacturing and integrating photonic devices for light generation, modulation, switching and detection. The compatibility with existing CMOS microelectronic foundries and high index contrast in silicon could enable low cost and high performance photonic systems, which find many applications in optical communication, data center networking and photonic network-on-chip. This thesis first develops and demonstrates several experimental work on high speed silicon modulators and switches with record performance and novel functionality. A 8x40 Gb/s transmitter based on silicon microrings is first presented. Then an end-to-end link using microrings for Binary Phase Shift Keying (BPSK) modulation and demodulation is shown, and its performance with conventional BPSK modulation/ demodulation techniques is compared. Next, a silicon traveling-wave Mach- Zehnder modulator is demonstrated at data rate up to 56 Gb/s for OOK modulation and 48 Gb/s for BPSK modulation, showing its capability at high speed communication systems. Then a single silicon microring is shown with 2x2 full crossbar switching functionality, enabling optical interconnects with ultra small footprint. Then several other experiments in the silicon platform are presented, including a fully integrated in-band Optical Signal to Noise Ratio (OSNR) monitor, characterization of optical power upper bound in a silicon microring modulator, and wavelength conversion in a dispersion-engineered waveguide. The last part of this thesis is on network-level application of photonics, specically a broadcast-and-select network based on star coupler is introduced, and its scalability performance is studied. Finally a novel switch architecture for data center networks is discussed, and its benefits as a disaggregated network are presented.

  18. Chemical looping combustion of coal in interconnected fluidized beds

    Institute of Scientific and Technical Information of China (English)

    SHEN LaiHong; ZHENG Min; XIAO Jun; ZHANG Hui; XIAO Rui

    2007-01-01

    Chemical looping combustion is the indirect combustion by use of oxygen carrier.It can be used for CO2 capture in power generating processes. In this paper,chemical looping combustion of coal in interconnected fluidized beds with inherent separation of CO2 is proposed. It consists of a high velocity fluidized bed as an air reactor in which oxygen carrier is oxidized, a cyclone, and a bubbling fluidized bed as a fuel reactor in which oxygen carrier is reduced by direct and indirect reactions with coal. The air reactor is connected to the fuel reactor through the cyclone. To raise the high carbon conversion efficiency and separate oxygen carrier particle from ash, coal slurry instead of coal particle is introduced into the bottom of the bubbling fluidized bed. Coal gasification and the reduction of oxygen carrier with the water gas take place simultaneously in the fuel reactor. The flue gas from the fuel reactor is CO2 and water. Almost pure CO2 could be obtained after the condensation of water. The reduced oxygen carrier is then returned back to the air reactor, where it is oxidized with air. Thermodyanmics analysis indicates that NiO/Ni oxygen carrier is the optimal one for chemical looping combustion of coal.Simulation of the processes for chemical looping combustion of coal, including coal gasification and reduction of oxygen carrier, is carried out with Aspen Plus software. The effects of air reactor temperature, fuel reactor temperature, and ratio of water to coal on the composition of fuel gas, recirculation of oxygen carrier particles, etc., are discussed. Some useful results are achieved. The suitable temperature of air reactor should be between 1050-1150Cand the optimal temperature of the fuel reactor be between 900-950℃.

  19. Chemical looping combustion of coal in interconnected fluidized beds

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    Chemical looping combustion is the indirect combustion by use of oxygen carrier. It can be used for CO2 capture in power generating processes. In this paper, chemical looping combustion of coal in interconnected fluidized beds with inherent separation of CO2 is proposed. It consists of a high velocity fluidized bed as an air reactor in which oxygen carrier is oxidized, a cyclone, and a bubbling fluidized bed as a fuel reactor in which oxygen carrier is reduced by direct and indirect reactions with coal. The air reactor is connected to the fuel reactor through the cyclone. To raise the high carbon conversion efficiency and separate oxygen carrier particle from ash, coal slurry instead of coal particle is introduced into the bottom of the bubbling fluidized bed. Coal gasification and the reduction of oxygen carrier with the water gas take place simultaneously in the fuel reactor. The flue gas from the fuel reactor is CO2 and water. Almost pure CO2 could be obtained after the con- densation of water. The reduced oxygen carrier is then returned back to the air reactor, where it is oxidized with air. Thermodyanmics analysis indicates that NiO/Ni oxygen carrier is the optimal one for chemical looping combustion of coal. Simulation of the processes for chemical looping combustion of coal, including coal gasification and reduction of oxygen carrier, is carried out with Aspen Plus software. The effects of air reactor temperature, fuel reactor temperature, and ratio of water to coal on the composition of fuel gas, recirculation of oxygen carrier par- ticles, etc., are discussed. Some useful results are achieved. The suitable tem- perature of air reactor should be between 1050―1150℃and the optimal temperature of the fuel reactor be between 900―950℃.

  20. Upgrade of the LHC magnet interconnections thermal shielding

    Energy Technology Data Exchange (ETDEWEB)

    Musso, Andrea; Barlow, Graeme; Bastard, Alain; Charrondiere, Maryline; Deferne, Guy; Dib, Gaëlle; Duret, Max; Guinchard, Michael; Prin, Hervé; Craen, Arnaud Vande; Villiger, Gilles [CERN European Organization for Nuclear Research, Meyrin 1211, Geneva 23, CH (Switzerland); Chrul, Anna [The Henryk Niewodniczanski Institute of Nuclear Physics, Polish Academy of Sciences, ul.Radzikowskiego 152, 31-324 Krakow (Poland); Damianoglou, Dimitrios [NTUA National Technical University of Athens, Heeron Polytechniou 9, 15780 Zografou (Greece); Strychalski, Michał [Wroclaw University of Technology, Faculty of Mechanical and Power Engineering, Wyb. Wyspianskiego 27, Wroclaw, 50-370 (Poland); Wright, Loren [Lancaster University, Bailrigg, Lancaster, LA1 4YW (United Kingdom)

    2014-01-29

    The about 1700 interconnections (ICs) between the Large Hadron Collider (LHC) superconducting magnets include thermal shielding at 50-75 K, providing continuity to the thermal shielding of the magnet cryostats to reduce the overall radiation heat loads to the 1.9 K helium bath of the magnets. The IC shield, made of aluminum, is conduction-cooled via a welded bridge to the thermal shield of the adjacent magnets which is actively cooled. TIG welding of these bridges made in the LHC tunnel at installation of the magnets induced a considerable risk of fire hazard due to the proximity of the multi-layer insulation of the magnet shields. A fire incident occurred in one of the machine sectors during machine installation, but fortunately with limited consequences thanks to prompt intervention of the operators. LHC is now undergoing a 2 years technical stop during which all magnet's ICs will have to be opened to consolidate the magnet electrical connections. The IC thermal shields will therefore have to be removed and re-installed after the work is completed. In order to eliminate the risk of fire hazard when re-welding, it has been decided to review the design of the IC shields, by replacing the welded bridges with a mechanical clamping which also preserves its thermal function. An additional advantage of this new solution is the ease in dismantling for maintenance, and eliminating weld-grinding operations at removal needing radioprotection measures because of material activation after long-term operation of the LHC. This paper describes the new design of the IC shields and in particular the theoretical and experimental validation of its thermal performance. Furthermore a status report of the on-going upgrade work in the LHC is given.

  1. Upgrade of the LHC magnet interconnections thermal shielding

    Science.gov (United States)

    Musso, Andrea; Barlow, Graeme; Bastard, Alain; Charrondiere, Maryline; Chrul, Anna; Damianoglou, Dimitrios; Deferne, Guy; Dib, Gaëlle; Duret, Max; Guinchard, Michael; Prin, Hervé; Strychalski, Michał; Craen, Arnaud Vande; Villiger, Gilles; Wright, Loren

    2014-01-01

    The about 1700 interconnections (ICs) between the Large Hadron Collider (LHC) superconducting magnets include thermal shielding at 50-75 K, providing continuity to the thermal shielding of the magnet cryostats to reduce the overall radiation heat loads to the 1.9 K helium bath of the magnets. The IC shield, made of aluminum, is conduction-cooled via a welded bridge to the thermal shield of the adjacent magnets which is actively cooled. TIG welding of these bridges made in the LHC tunnel at installation of the magnets induced a considerable risk of fire hazard due to the proximity of the multi-layer insulation of the magnet shields. A fire incident occurred in one of the machine sectors during machine installation, but fortunately with limited consequences thanks to prompt intervention of the operators. LHC is now undergoing a 2 years technical stop during which all magnet's ICs will have to be opened to consolidate the magnet electrical connections. The IC thermal shields will therefore have to be removed and re-installed after the work is completed. In order to eliminate the risk of fire hazard when re-welding, it has been decided to review the design of the IC shields, by replacing the welded bridges with a mechanical clamping which also preserves its thermal function. An additional advantage of this new solution is the ease in dismantling for maintenance, and eliminating weld-grinding operations at removal needing radioprotection measures because of material activation after long-term operation of the LHC. This paper describes the new design of the IC shields and in particular the theoretical and experimental validation of its thermal performance. Furthermore a status report of the on-going upgrade work in the LHC is given.

  2. Maskless laser writing of microscopic metallic interconnects

    Science.gov (United States)

    Maya, Leon

    1995-01-01

    A method of forming a metal pattern on a substrate. The method includes depositing an insulative nitride film on a substrate and irradiating a laser beam onto the nitride film, thus decomposing the metal nitride into a metal constituent and a gaseous constituent, the metal constituent remaining in the nitride film as a conductive pattern.

  3. Early resistance change and stress/electromigrationmodeling in aluminium interconnects

    NARCIS (Netherlands)

    Petrescu, V.; Mouthaan, A.J.; Schoenmaker, W.

    1997-01-01

    A complete description for early resistance change and two dimensional simulation of mechanical stress evolution in confined Al interconnects, related to the electromigration, is given in this paper. The model, combines the stress/ vacancy concentration evolution with the early resistance change of

  4. Fast wafer-level detection and control of interconnect reliability

    Science.gov (United States)

    Foley, Sean; Molyneaux, James; Mathewson, Alan

    2000-08-01

    Many of the technological advances in the semiconductor industry have led to dramatic increases in device density and performance in conjunction with enhanced circuit reliability. As reliability is improved, the time taken to characterize particular failure modes with traditional test methods is getting substantially longer. Furthermore, semiconductor customers expect low product cost and fast time-to-market. The limits of traditional reliability testing philosophies are being reached and new approaches need to be investigated to enable the next generation of highly reliable products to be tested. This is especially true in the area of IC interconnect, where significant challenges are predicted for the next decade. A number of fast, wafer level test methods exist for interconnect reliability evaluation. The relative abilities of four such methods to detect the quality and reliability of IC interconnect over very short test times are evaluated in this work. Four different test structure designs are also evaluated and the results are bench-marked against conventional package level Median Time to Failure results. The Isothermal test method combine with SWEAT-type test structures is shown to be the most suitable combination for defect detection and interconnect reliability control over very short test times.

  5. 100 GHz Externally Modulated Laser for Optical Interconnects Applications

    DEFF Research Database (Denmark)

    Ozolins, Oskars; Pang, Xiaodan; Iglesias Olmedo, Miguel

    2017-01-01

    We report on a 116 Gb/s on-off keying (OOK), four pulse amplitude modulation (PAM) and 105-Gb/s 8-PAM optical transmitter using an InP-based integrated and packaged externally modulated laser for high-speed optical interconnects with up to 30 dB static extinction ratio and over 100-GHz 3-d...

  6. Toward Interpreting Failure in Sintered-Silver Interconnection Systems

    Energy Technology Data Exchange (ETDEWEB)

    Wereszczak, Andrew A [ORNL; Waters, Shirley B [ORNL

    2016-01-01

    The mechanical strength and subsequent reliability of a sintered-silver interconnection system is a function of numerous independent parameters. That system is still undergoing process development. Most of those parameters (e.g., choice of plating) are arguably and unfortunately taken for granted and are independent of the silver s cohesive strength. To explore such effects, shear strength testing and failure analyses were completed on a simple, mock sintered-silver interconnection system consisting of bonding two DBC ceramic substrates. Silver and gold platings were part of the test matrix, as was pre-drying strategies, and the consideration of stencil-printing vs. screen-printing. Shear strength of sintered-silver interconnect systems was found to be was insensitive to the choice of plating, drying practice, and printing method provided careful and consistent processing of the sintered-silver are practiced. But if the service stress in sintered silver interconnect systems is anticipated to exceed ~ 60 MPa, then the system will likely fail.

  7. Democracy and Spiritual Awareness: Interconnections and Implications for Educational Leadership

    Science.gov (United States)

    Woods, Glenys J.; Woods, Philip A.

    2008-01-01

    This article sets out theorisations of developmental democracy and spiritual awareness formulated in previous work by the authors. These are used to explore collegial leadership in a case study Steiner school, with the aim of illuminating and illustrating the transformative demands of developmental democracy and its interconnection with spiritual…

  8. Parallel optical interconnects - Implementation of optoelectronics in multiprocessor architectures

    Science.gov (United States)

    Frietman, E. E. E.; Dekker, L.; van Nifterick, W.; Jongeling, T. J. M.

    1990-03-01

    Optoelectronic logic element circuitries are described which can be used for the implementation of a wide variety of interconnection schemes. Particular attention is given to the design, construction, and application of an electrooptic communication system (EOCS) using dedicated free space multiple data distributors and integrated optically writable input buffer arrays with fully parallel access. Some experimental results obtained on the complete EOCS are presented.

  9. Integrated interconnect technologies for 3D nanoelectronic systems

    CERN Document Server

    Bakir, Muhannad S

    2008-01-01

    This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.

  10. Novel interconnect methodologies for ultra-thin chips on foils

    NARCIS (Netherlands)

    Sridhar, A.; Cauwe, M.; Fledderus, H.; Kusters, R.H.L.; Brand, J. van den

    2012-01-01

    Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requireme

  11. On the Computation of Lyapunov Functions for Interconnected Systems

    DEFF Research Database (Denmark)

    Sloth, Christoffer

    2016-01-01

    This paper addresses the computation of additively separable Lyapunov functions for interconnected systems. The presented results can be applied to reduce the complexity of the computations associated with stability analysis of large scale systems. We provide a necessary and sufficient condition...

  12. Bandwidth Analysis of Functional Interconnects Used as Test Access Mechanism

    NARCIS (Netherlands)

    Van den Berg, A.; Ren, P.; Marinissen, E.J.; Gaydadjiev, G.; Goossens, K.

    2010-01-01

    Test data travels through a System on Chip (SOC) from the chip pins to the Core-Under-Test (CUT) and vice versa via a Test Access Mechanism (TAM). Conventionally, a TAM is implemented using dedicated communication infrastructure. However, also existing functional interconnect, such as a bus or Netwo

  13. Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

    NARCIS (Netherlands)

    Oosterhuis, G.; Veld, B.H. in 't; Ebberink, G.; Del Cerro, D.A.; Eijnden, E. van den; Chall, P.; Zon, B. van der

    2010-01-01

    Laser Induced Forward Transfer (LIFT) is a single step, dry deposition process which shows great potential for interconnect fabrication. TNO, in cooperation with ALSI and University of Twente have studied the feature size and resistivity of copper structures deposited using picosecond (ps) LIFT. Sma

  14. Use of Fiber Optic Interconnects for Signal Integrity

    Science.gov (United States)

    Phal, Yamuna D.; Phal, Deovrat D.

    2016-05-01

    Signal integrity (SI) is always a concern when it comes to high-speed data transmission. Even in space, there is a need for high-speed data transmission such as in the communication systems, monitoring various sub- systems and for other on-board experiments and applications.From Electromagneticperspective, using fiber-optic interconnect is highly recommended to avoid interference issues. This field has been explored for quite some time now, but mostly limited to applications that are on earth. Using these interconnects for harsh and extreme environments i.e. in space, requires reliability and ruggedness of interconnects and the system.This study suggests methods for optical fiber based communication systems for internal unit communication, communication within various instruments, as well as inter-board communication. A conclusion in terms of what areas need to be explored for enabling high-speed data transmission for space applications would be discussed in details. This study also explores and compares the existing technologies in the fiber-optic interconnects for space applications.

  15. Cascaded wavelength division multiplexing for byte-wide optical interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Deri, R. J.; Garrett, H. E.; Germelos, S.; Haigh,R. E.; Henderer, B. D.; Lowry, M. E.; Walker, J.D.

    1997-11-17

    We demonstrate a wavelength division multiplexing approach for byte-wide optical interconnects over multimode fiber optic ribbon cable using filters based on common plastic ferrules. A dual wavelength link with eight cascaded filter stages exhibits bit error rates {le}l0{sup -l4}.

  16. Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

    Directory of Open Access Journals (Sweden)

    Salman Shafqat

    2017-09-01

    Full Text Available The exciting field of stretchable electronics (SE promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS-type process recipes using bulk integrated circuit (IC microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

  17. Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

    NARCIS (Netherlands)

    Oosterhuis, G.; Veld, B.H. in 't; Ebberink, G.; Del Cerro, D.A.; Eijnden, E. van den; Chall, P.; Zon, B. van der

    2010-01-01

    Laser Induced Forward Transfer (LIFT) is a single step, dry deposition process which shows great potential for interconnect fabrication. TNO, in cooperation with ALSI and University of Twente have studied the feature size and resistivity of copper structures deposited using picosecond (ps) LIFT. Sma

  18. Interconnects and On-Chip Data Communication Techniques

    NARCIS (Netherlands)

    Mensink, E.; Schinkel, Daniel; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria

    Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In this paper, a ‘mixed-signal’ approach is taken to analyze on-chip interconnects and it is investigated how data-rates can be improved. It is shown that complex signaling schemes such as OFDM and CDMA

  19. Two Component Injection Moulding for Moulded Interconnect Devices

    DEFF Research Database (Denmark)

    Islam, Aminul

    The moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their potential in reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...

  20. 78 FR 14532 - Small Generator Interconnection Agreements and Procedures; Workshop

    Science.gov (United States)

    2013-03-06

    ...,049 (2013), 78 FR 7524 (2013). This workshop is not intended to address the substance of any... Energy Regulatory Commission Small Generator Interconnection Agreements and Procedures; Workshop Take... workshop is to discuss certain topics related to the proposals in the Small Generator...

  1. 78 FR 29672 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-05-21

    ... Federal Register of Friday, February 1, 2013 (78 FR 7524). The regulations revised the pro forma Small....'' In FR Doc. 2013-01366 appearing on page 7523 in the Federal Register of Friday, February 1, 2013, the... Energy Regulatory Commission 18 CFR Part 35 Small Generator Interconnection Agreements and...

  2. Crosstalk in dynamic optical interconnects in photorefractive crystals

    DEFF Research Database (Denmark)

    Andersen, Peter E.; Petersen, Paul Michael; Buchhave, Preben

    1994-01-01

    We have investigated the crosstalk between two neighboring gratings in photorefractive Bi12SiO20 optical interconnects. The gratings are induced by the interference between one reference beam and two object beams. By applying a suitable phase shift in one of the object beams, we can selectively...

  3. Optical interconnection networks for high-performance computing systems.

    Science.gov (United States)

    Biberman, Aleksandr; Bergman, Keren

    2012-04-01

    Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers.

  4. Process chains for the manufacturing of moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Mohammad Aminul; Hansen, Hans Nørgaard; Tang, Peter Torben

    2009-01-01

    Moulded interconnect device (MID) can be defined as an injection-molded plastic part that incorporates both electrical and mechanical functionalities in a single device. It is a relatively new area with enormous potential for industrial applications. At present, there are a number of available pr...

  5. An Intra-Server Interconnect Fabric for Heterogeneous Computing

    Institute of Scientific and Technical Information of China (English)

    曹政; 刘小丽; 李强; 刘小兵; 王展; 安学军

    2014-01-01

    With the increasing diversity of application needs and computing units, the server with heterogeneous pro-cessors is more and more widespread. However, conventional SMP/ccNUMA server architecture introduces communication bottleneck between heterogeneous processors and only uses heterogeneous processors as coprocessors, which limits the efficiency and flexibility of using heterogeneous processors. To solve this problem, this paper proposes an intra-server inter-connect fabric that supports both intra-server peer-to-peer interconnection and I/O resource sharing among heterogeneous processors. By connecting processors and I/O devices with the proposed fabric, heterogeneous processors can perform direct communication with each other and run in stand-alone mode with shared intra-server resources. We design the proposed fabric by extending the de-facto system I/O bus protocol PCIe (Peripheral Computer Interconnect Express) and implement it with a single chip cZodiac. By making full use of PCIe’s original advantages, the interconnection and the I/O sharing mechanism are light weight and efficient. Evaluations that have been carried out on both the FPGA (Field Programmable Gate Array) prototype and the cycle-accurate simulator demonstrate that our design is feasible and scalable. In addition, our design is suitable for not only the heterogeneous server but also the high density server.

  6. Planning under uncertainties; Planejamento sob incertezas

    Energy Technology Data Exchange (ETDEWEB)

    Gorenstin, Boris Garbati; Novella, Pedro di; Costa, Joari Paulo da [Centro de Pesquisas de Energia Eletrica, Rio de Janeiro, RJ (Brazil); Paciomik, Newton [ELETROBRAS, Rio de Janeiro, RJ (Brazil)

    1995-12-31

    This article presents a methodology for planning the expansion of interconnected hydro-thermal power generation systems considering uncertainty factors. Its utilization implies in structural changes in the planning process which begins to make use of expansion strategies instead of the traditional expansion plans. The main characteristics of such methodology are presented and an example of its application to the Brazilian power system is given 1 ref., 2 figs., 4 tabs.

  7. Compact models for nanophotonic structures and on-chip interconnects

    Science.gov (United States)

    Alam, Mehboob

    Over the last few years, scaling in deep submicron technologies has shifted the paradigm from device-dominated to interconnect-dominated design methodology. Consequently, there is an increasing interest towards the miniaturization of the guiding medium in nanoscale integrated circuits by exploring plasmon-based waveguides to alleviate the scaling issues associated with today's copper interconnect. In this thesis, we seek short and long-term solutions of on-chip interconnect by developing accurate compact models of on-chip interconnects and impedance characterization of nanophotonic structures. The developed system models are compact and accurate over the operating frequency range and the adopted approach have provided many critical insights and produced many important results. This thesis first presents a new modeling strategy that represents the nanostructure by its equivalent impedance. By applying either quasistatic approximation or separately solving for voltage and current for dominant mode, we reduce the field problem to a circuit problem. The impedance expressed in terms of circuit components is dependent on the material constant as well as the operating frequency. The modeling methodology is successfully applied to nanoparticles and oscillating nanosphere. The proposed model characterizes plasmon resonance in these nanostructures, thereby providing basic building block to develop spice models of complex plasmon-based waveguide for sub-wavelength propagation. We also presented several techniques to develop compact models of on-chip interconnects and passive components for accurate estimation of power, noise and delay of high speed integrated circuits. The automated method generates reduced order models that are accurate across either a narrow or a wide-range of frequencies. The proposed methods are based on Krylov subspace method with interpolation points dynamically selected using either spline based algorithm or discrete wavelet transform. Narrow and

  8. Atchafalaya Alligator Harvest Plan

    Data.gov (United States)

    US Fish and Wildlife Service, Department of the Interior — 1988 Alligator Harvest Plan for Atchafalaya National Wildlife Refuge including management plan, environmental assessment, and public notice documents.

  9. Smart Antenna Skins, including Conformal Array, MMICs and Applications

    NARCIS (Netherlands)

    Bogaart, F.L.M. van den

    2000-01-01

    Low-cost technologies are presented for future space-borne and airborne SAR systems. These technologies include state-of-the art highly integrated circuits to miniaturise front-end, solutions to lower-cost interconnection technologies, new beamforming aspects and new architectures. The MMICs address

  10. Smart Antenna Skins, including Conformal Array, MMICs and Applications

    NARCIS (Netherlands)

    Bogaart, F.L.M. van den

    2000-01-01

    Low-cost technologies are presented for future space-borne and airborne SAR systems. These technologies include state-of-the art highly integrated circuits to miniaturise front-end, solutions to lower-cost interconnection technologies, new beamforming aspects and new architectures. The MMICs address

  11. Role of Wind Power in Primary Frequency Response of an Interconnection: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Y. C.; Gevorgian, V.; Ela, E.; Singhvi, V.; Pourbeik, P.

    2013-09-01

    The electrical frequency of an interconnection must be maintained very close to its nominal level at all times. Large frequency deviations can lead to unintended consequences such as load shedding, instability, and machine damage, among others. Turbine governors of conventional generating units provide primary frequency response (PFR) to ensure that frequency deviations are not significant duringlarge transient events. Increasing penetrations of variable renewable generation, such as wind and solar power, and planned retirements of conventional thermal plants - and thus a reduction in the amount of suppliers with PFR capabilities - causes concerns about a decline of PFR and system inertia in North America. The capability of inverter-coupled wind generation technologies to contribute toPFR and inertia, if appropriately equipped with the necessary control features, can help alleviate concerns. However, these responses differ from those supplied by conventional generation and inertia, and it is not entirely understood how variable renewable generation will affect the system response at different penetration levels. This paper evaluates the impact of wind generation providing PFRand synthetic inertial response on a large interconnection.

  12. Fatigue properties of Graphene interconnects on flexible substrates

    Science.gov (United States)

    Paradee, Gary

    This thesis represents the first determination of the fatigue behavior of Graphene as interconnect material electronic components on flexible substrates. The potential application of this interconnect material is for displays on flexible substrates where fatigue resistance is required due to the stress placed on the interconnect during mechanical bending. As the display is cyclically deformed (fatigued) during normal operation, cracks in the interconnect layer initiate and propagate leading to the lineout failure condition. The major contribution of this work is to show that Graphene is a superior interconnect material to the present state of the art Indium Tin Oxide (ITO) due to its electrical, optical and mechanical properties. The experimental approach in this thesis is based on Graphene samples which were fabricated on Silicon Nitrite (Si3N4)/Polyethylene Naphthalate (PEN) substrates. For comparison, both patterned and uniform ITO films ITO films on Si3N4/PEN were fabricated. The results of the in-depth characterization of Graphene are reported and based on Atomic Force Microscopy (AFM), Raman Spectroscopy and Scanning Electron Microscopy (SEM) are reported. The fatigue characteristics of ITO were determined at stress amplitudes ranging from 2000 MPa to 400 MPa up to 5000 cycles. The fatigue characteristics of Graphene were determined at stress amplitudes ranging from 80 GPa to 40 GPa up to 5000 cycles. The fatigue S-N curves were determined and showed that Graphene's endurance limit is 40 GPa. Beyond the endurance limit, there is no observable high cycle or low cycle fatigue indication for Graphene on a flexible substrate such as PEN. The microstructural analysis by SEM and AFM did not reveal normal fatigue crack growth and propagation. This thesis presents the first comprehensive behavior of Graphene in a bending fatigue stress environment present in numerous flexible electronic applications. The design and stress environments for safe operation has been

  13. Metal Interconnects for Solid Oxide Fuel Cell Power Systems

    Energy Technology Data Exchange (ETDEWEB)

    S. Elangovan

    2006-04-01

    Interconnect development is identified by the US Department of energy as a key technical area requiring focused research to meet the performance and cost goals under the Solid State Energy Conversion Alliance initiative. In the Phase I SECA Core Technology Program, Ceramatec investigated a commercial ferritic stainless steel composition for oxidation resistance properties by measuring the weight gain when exposed to air at the fuel cell operating temperature. A pre-treatment process that results in a dense, adherent scale was found to reduce the oxide scale growth rate significantly. A process for coating the surface of the alloy in order to reduce the in-plane resistance and potentially inhibit chromium oxide evaporation was also identified. The combination of treatments provided a very low resistance through the scale. The resistance measured was as low as 10 milliohm-cm2 at 750 C in air. The oxide scale was also found to be stable in humidified air at 750 C. The resistance value was stable over several thermal cycles. A similar treatment and coating for the fuel side of the interconnect also showed an exceptionally low resistance of one milliohm-cm2 in humidified hydrogen at 750 c, and was stable through multiple thermal cycles. Measurement of interconnect resistance when it was exposed to both air and humidified hydrogen on opposite sides also showed low, stable resistance after additional modification to the pre-treatment process. Resistance stacks, using an interconnect stack with realistic gas flows, also provided favorable results. Chromium evaporation issue however requires testing of fuel stacks and was outside of the scope of this project. based on results to-date, the alloy selection and the treatment processes appear to be well suited for SOFC interconnect application.

  14. Beyond the Internet of Things everything interconnected

    CERN Document Server

    Mastorakis, George; Mavromoustakis, Constandinos; Pallis, Evangelos

    2017-01-01

    The major subjects of the book cover modeling, analysis and efficient management of information in Internet of Everything (IoE) applications and architectures. As the first book of its kind, it addresses the major new technological developments in the field and will reflect current research trends, as well as industry needs. It comprises of a good balance between theoretical and practical issues, covering case studies, experience and evaluation reports and best practices in utilizing IoE applications. It also provides technical/scientific information about various aspects of IoE technologies, ranging from basic concepts to research grade material, including future directions.

  15. 76 FR 45248 - PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C...

    Science.gov (United States)

    2011-07-28

    ... Energy Regulatory Commission PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM... Load Group, PJM Power Providers Group, and PSEG Companies. All interested parties are invited to attend... Load Group Dr. Roy Shanker, Consultant, PJM Power Providers Group Dr. William Hogan, Professor,...

  16. Corrective Action Investigation Plan for Corrective Action Unit 5: Landfills, Nevada Test Site, Nevada (Rev. No.: 0) includes Record of Technical Change No. 1 (dated 9/17/2002)

    Energy Technology Data Exchange (ETDEWEB)

    IT Corporation, Las Vegas, NV

    2002-05-28

    This Corrective Action Investigation Plan contains the U.S. Department of Energy, National Nuclear Security Administration Nevada Operations Office's approach to collect the data necessary to evaluate corrective action alternatives appropriate for the closure of Corrective Action Unit (CAU) 5 under the Federal Facility Agreement and Consent Order. Corrective Action Unit 5 consists of eight Corrective Action Sites (CASs): 05-15-01, Sanitary Landfill; 05-16-01, Landfill; 06-08-01, Landfill; 06-15-02, Sanitary Landfill; 06-15-03, Sanitary Landfill; 12-15-01, Sanitary Landfill; 20-15-01, Landfill; 23-15-03, Disposal Site. Located between Areas 5, 6, 12, 20, and 23 of the Nevada Test Site (NTS), CAU 5 consists of unlined landfills used in support of disposal operations between 1952 and 1992. Large volumes of solid waste were produced from the projects which used the CAU 5 landfills. Waste disposed in these landfills may be present without appropriate controls (i.e., use restrictions, adequate cover) and hazardous and/or radioactive constituents may be present at concentrations and locations that could potentially pose a threat to human health and/or the environment. During the 1992 to 1995 time frame, the NTS was used for various research and development projects including nuclear weapons testing. Instead of managing solid waste at one or two disposal sites, the practice on the NTS was to dispose of solid waste in the vicinity of the project. A review of historical documentation, process knowledge, personal interviews, and inferred activities associated with this CAU identified the following as potential contaminants of concern: volatile organic compounds, semivolatile organic compounds, polychlorinated biphenyls, pesticides, petroleum hydrocarbons (diesel- and gasoline-range organics), Resource Conservation and Recovery Act Metals, plus nickel and zinc. A two-phase approach has been selected to collect information and generate data to satisfy needed resolution

  17. Arbitration in crossbar interconnect for low latency

    Energy Technology Data Exchange (ETDEWEB)

    Ohmacht, Martin; Sugavanam, Krishnan

    2013-02-05

    A system and method and computer program product for reducing the latency of signals communicated through a crossbar switch, the method including using at slave arbitration logic devices associated with Slave devices for which access is requested from one or more Master devices, two or more priority vector signals cycled among their use every clock cycle for selecting one of the requesting Master devices and updates the respective priority vector signal used every clock cycle. Similarly, each Master for which access is requested from one or more Slave devices, can have two or more priority vectors and can cycle among their use every clock cycle to further reduce latency and increase throughput performance via the crossbar.

  18. Arbitration in crossbar interconnect for low latency

    Science.gov (United States)

    Ohmacht, Martin; Sugavanam, Krishnan

    2013-02-05

    A system and method and computer program product for reducing the latency of signals communicated through a crossbar switch, the method including using at slave arbitration logic devices associated with Slave devices for which access is requested from one or more Master devices, two or more priority vector signals cycled among their use every clock cycle for selecting one of the requesting Master devices and updates the respective priority vector signal used every clock cycle. Similarly, each Master for which access is requested from one or more Slave devices, can have two or more priority vectors and can cycle among their use every clock cycle to further reduce latency and increase throughput performance via the crossbar.

  19. Muscle and bone, two interconnected tissues.

    Science.gov (United States)

    Tagliaferri, Camille; Wittrant, Yohann; Davicco, Marie-Jeanne; Walrand, Stéphane; Coxam, Véronique

    2015-05-01

    As bones are levers for skeletal muscle to exert forces, both are complementary and essential for locomotion and individual autonomy. In the past decades, the idea of a bone-muscle unit has emerged. Numerous studies have confirmed this hypothesis from in utero to aging works. Space flight, bed rest as well as osteoporosis and sarcopenia experimentations have allowed to accumulate considerable evidence. Mechanical loading is a key mechanism linking both tissues with a central promoting role of physical activity. Moreover, the skeletal muscle secretome accounts various molecules that affect bone including insulin-like growth factor-1 (IGF-1), basic fibroblast growth factor (FGF-2), interleukin-6 (IL-6), IL-15, myostatin, osteoglycin (OGN), FAM5C, Tmem119 and osteoactivin. Even though studies on the potential effects of bone on muscle metabolism are sparse, few osteokines have been identified. Prostaglandin E2 (PGE2) and Wnt3a, which are secreted by osteocytes, osteocalcin (OCN) and IGF-1, which are produced by osteoblasts and sclerostin which is secreted by both cell types, might impact skeletal muscle cells. Cartilage and adipose tissue are also likely to participate to this control loop and should not be set aside. Indeed, chondrocytes are known to secrete Dickkopf-1 (DKK-1) and Indian hedgehog (Ihh) and adipocytes produce leptin, adiponectin and IL-6, which potentially modulate bone and muscle metabolisms. The understanding of this system will enable to define new levers to prevent/treat sarcopenia and osteoporosis at the same time. These strategies might include nutritional interventions and physical exercise. Copyright © 2015 Elsevier B.V. All rights reserved.

  20. Analysis of drought impacts on electricity production in the Western and Texas interconnections of the United States.

    Energy Technology Data Exchange (ETDEWEB)

    Harto, C. B.; Yan, Y. E.; Demissie, Y. K.; Elcock, D.; Tidwell, V. C.; Hallett, K.; Macknick, J.; Wigmosta, M. S.; Tesfa, T. K. (Environmental Science Division); (Sandia National Laboratory); (National Renewable Energy Laboratory); (Pacific Northwest National Laboratory)

    2012-02-09

    Electricity generation relies heavily on water resources and their availability. To examine the interdependence of energy and water in the electricity context, the impacts of a severe drought to assess the risk posed by drought to electricity generation within the western and Texas interconnections has been examined. The historical drought patterns in the western United States were analyzed, and the risk posed by drought to electricity generation within the region was evaluated. The results of this effort will be used to develop scenarios for medium- and long-term transmission modeling and planning efforts by the Western Electricity Coordination Council (WECC) and the Electric Reliability Council of Texas (ERCOT). The study was performed in response to a request developed by the Western Governors Association in conjunction with the transmission modeling teams at the participating interconnections. It is part of a U.S. Department of Energy-sponsored, national laboratory-led research effort to develop tools related to the interdependency of energy and water as part of a larger interconnection-wide transmission planning project funded under the American Recovery and Reinvestment Act. This study accomplished three main objectives. It provided a thorough literature review of recent studies of drought and the potential implications for electricity generation. It analyzed historical drought patterns in the western United States and used the results to develop three design drought scenarios. Finally, it quantified the risk to electricity generation for each of eight basins for each of the three drought scenarios and considered the implications for transmission planning. Literature on drought impacts on electricity generation describes a number of examples where hydroelectric generation capacity has been limited because of drought but only a few examples of impact on thermoelectric generation. In all documented cases, shortfalls of generation were met by purchasing power

  1. Future manufacturing techniques for stacked MCM interconnections

    Science.gov (United States)

    Carson, R. F.; Seigal, P. K.; Craft, D. C.; Lovejoy, M. L.

    1994-06-01

    As multichip modules (MCMs) grow in chip count and complexity, increasingly large numbers of input/output (I/O) channels will be required for connection to other MCMs or printed wiring boards. In applications such as digital signal processing, large increases in processing density (number of operations in a given volume) can be obtained in stacked MCM arrangements. The potential pin counts and required I/O densities in these stacked architectures will push beyond the limits of present interlevel coupling techniques. This problem is particularly acute if easy separation of layers is needed to meet MCM testing and yield requirements. Solutions to this problem include the use of laser-drilled, metal-filled electrical vias in the MCM substrate and also optoelectronic data channels that operate in large arrays. These arrays will emit and detect signals traveling perpendicular to the surface of the MCM. All of these approaches will require packaging and alignment that makes use of advanced MCM manufacturing techniques.

  2. 78 FR 73112 - Monitoring System Conditions-Transmission Operations Reliability Standards; Interconnection...

    Science.gov (United States)

    2013-12-05

    ..., performance, and maintenance of real-time monitoring and analysis capabilities for reliability coordinators... Reliability Standards; Interconnection Reliability Operations and Coordination Reliability Standards AGENCY... Transmission Operations and Interconnection Reliability Operations and Coordination Reliability Standards...

  3. 76 FR 16240 - Mandatory Reliability Standards for Interconnection Reliability Operating Limits

    Science.gov (United States)

    2011-03-23

    ... Reliability Operating Limits AGENCY: Federal Energy Regulatory Commission, DOE. ACTION: Final rule. SUMMARY... instances of exceeding Interconnection Reliability. Operating Limits. The Commission also approves the... system operating limits other than interconnection reliability operating limits. DATES: Effective...

  4. 77 FR 6110 - Bishop Hill Interconnection LLC; Supplemental Notice that Initial Market-Based Rate Filing...

    Science.gov (United States)

    2012-02-07

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Bishop Hill Interconnection LLC; Supplemental Notice that Initial Market... in the above-referenced proceeding of Bishop Hill Interconnection LLC's application for...

  5. 75 FR 12536 - Midwest Independent Transmission System Operator, Inc. Complainant v PJM Interconnection, LLC...

    Science.gov (United States)

    2010-03-16

    ... Interconnection, LLC Respondent; Notice of Complaint March 9, 2010. Take notice that on March 8, 2010, pursuant to... System Operator, Inc. (Complainant) filed a formal complaint against PJM Interconnection, LLC...

  6. 77 FR 5008 - Minco Wind Interconnection Services, LLC; Supplemental Notice That Initial Market-Based Rate...

    Science.gov (United States)

    2012-02-01

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Minco Wind Interconnection Services, LLC; Supplemental Notice That Initial... notice in the above-referenced proceeding of Minco Wind Interconnection Services, LLC's application...

  7. 75 FR 32458 - Virginia Electric and Power Company v. PJM Interconnection, LLC; Notice of Complaint

    Science.gov (United States)

    2010-06-08

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Virginia Electric and Power Company v. PJM Interconnection, LLC; Notice of... Power Company (Complainant) filed a formal complaint against PJM Interconnection, LLC...

  8. 75 FR 12535 - Midwest Independent Transmission System Operator, Inc., Complainant v. PJM Interconnection, LLC...

    Science.gov (United States)

    2010-03-16

    ... Interconnection, LLC Respondent; Notice of Complaint March 9, 2010. Take notice that on March 8, 2010, pursuant to... complaint against PJM Interconnection, LLC (Respondent) alleging that the Respondent is in violation of...

  9. 78 FR 69664 - Notice of Intent To Prepare a Supplemental Draft Environmental Impact Statement-Interconnection...

    Science.gov (United States)

    2013-11-20

    ... Statement--Interconnection of the Proposed Wilton IV Wind Energy Center Project, North Dakota (DOE/EIS-0469...), intends to prepare a Supplemental Draft Environmental Impact Statement (SDEIS) for the interconnection...

  10. 11. Strategic planning.

    Science.gov (United States)

    2014-05-01

    There are several types of planning processes and plans, including strategic, operational, tactical, and contingency. For this document, operational planning includes tactical planning. This chapter examines the strategic planning process and includes an introduction into disaster response plans. "A strategic plan is an outline of steps designed with the goals of the entire organisation as a whole in mind, rather than with the goals of specific divisions or departments". Strategic planning includes all measures taken to provide a broad picture of what must be achieved and in which order, including how to organise a system capable of achieving the overall goals. Strategic planning often is done pre-event, based on previous experience and expertise. The strategic planning for disasters converts needs into a strategic plan of action. Strategic plans detail the goals that must be achieved. The process of converting needs into plans has been deconstructed into its components and includes consideration of: (1) disaster response plans; (2) interventions underway or planned; (3) available resources; (4) current status vs. pre-event status; (5) history and experience of the planners; and (6) access to the affected population. These factors are tempered by the local: (a) geography; (b) climate; (c) culture; (d) safety; and (e) practicality. The planning process consumes resources (costs). All plans must be adapted to the actual conditions--things never happen exactly as planned.

  11. Internet plan and planning

    Directory of Open Access Journals (Sweden)

    Kahriman Emina

    2008-01-01

    Full Text Available Paper discuss specific features of internet plan as well as planning as management process in general in the contemporary environment. No need to stress out that marketing plan and marketing planning is core activity in approaching to market. At the same time, there are a lot specific c request in preparing marketing plan comparing to business planning due to marketing plan is an essential part. The importance of internet plan and planning rely on specific features of the internet network but as a part of general corporate as well as marketing strategy.

  12. Characteristic Impedance of a Microstrip-Like Interconnect Line in Presence of Ground Plane Aperture

    Directory of Open Access Journals (Sweden)

    Rohit Sharma

    2007-01-01

    Full Text Available We propose new empirical expressions for the characteristic impedance of a microstrip-like interconnect line in presence of ground plane aperture. The existing characteristic impedance expressions are modified so as to include the effect of the ground plane aperture. The variation in the characteristic impedance vis-à-vis the aperture size is established. The proposed expressions are general and valid for a range of dielectric materials concerning MICs, RFICs, and PCBs. The results are validated by measurements performed on a vector network analyzer.

  13. Evaluation of a Functional Interconnect System for SOFC's

    Energy Technology Data Exchange (ETDEWEB)

    Matthew Bender; James Rakowski

    2010-12-31

    The overall objective of this project was to validate the concept and application of a functional interconnect, based on a ferritic stainless steel, for a solid oxide fuel cell through manufacturing trials, laboratory testing, and field experience. The materials of construction and their surfaces were to be optimized for the particular service conditions and include low-cost ferritic stainless steels, novel postprocess treatments, and third-party coatings. This work aimed to optimize specific aspects of substrate alloy chemistry and to study the effects of long-term exposures on resistive oxide film structure and chemistry, interaction with applied surface coatings, and effectiveness of novel surface treatments.

  14. Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors

    Energy Technology Data Exchange (ETDEWEB)

    Andricek, L. [Halbleiterlabor der Max-Planck-Gesellschaft, Otto Hahn Ring 6, D-81739 München (Germany); Beimforde, M.; Macchiolo, A.; Moser, H.-G. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut), Föhringer Ring 6, D-80805 München (Germany); Nisius, R., E-mail: Richard.Nisius@mpp.mpg.de [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut), Föhringer Ring 6, D-80805 München (Germany); Richter, R.H. [Halbleiterlabor der Max-Planck-Gesellschaft, Otto Hahn Ring 6, D-81739 München (Germany); Terzo, S.; Weigell, P. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut), Föhringer Ring 6, D-80805 München (Germany)

    2014-09-11

    The performance of pixel modules built from 75 μm thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 μm thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. Targeting at a usage at the high luminosity upgrade of the LHC accelerator called HL-LHC, the results were obtained before and after irradiation up to fluences of 10{sup 16}n{sub eq}/cm{sup 2}.

  15. CRISIS AND THE INTERCONNECTIONS BETWEEN WORLD’S ECONOMIES

    Directory of Open Access Journals (Sweden)

    Emilia Ungureanu

    2010-12-01

    Full Text Available This paper has like primary objective to present the crisis that hit the global economy since 1929 and the interconnections between different regions and countries. We will present also the big financial crisis that struck countries all around the world in the 21 century and the effects on the Romanian Economy. Each time when a develop country has passed through a turning point (crisis, even if the determinant factors were of a different nature, this thing led to a negative influence of the countries from the region and not only, showing by this the strong existing interconnection between the countries of the modern world (Asian crisis example, and especially the big financial crisis of the 21 century.

  16. Advanced Modulation Techniques for High-Performance Computing Optical Interconnects

    DEFF Research Database (Denmark)

    Karinou, Fotini; Borkowski, Robert; Zibar, Darko

    2013-01-01

    We experimentally assess the performance of a 64 × 64 optical switch fabric used for ns-speed optical cell switching in supercomputer optical interconnects. More specifically, we study four alternative modulation formats and detection schemes, namely, 10-Gb/s nonreturn-to-zero differential phase......-shift keying with balanced direct detection, 10-Gb/s polarization division multiplexed (PDM) quadrature phase-shift keying, 40-Gb/s single-polarization 16-ary quadrature amplitude modulation (16QAM), and 80-Gb/s PDM-16QAM, with coherent intradyne detection, in conjunction with an optimized version...... of the optical shared memory supercomputer interconnect system switch fabric. In particular, we investigate the resilience of the aforementioned advanced modulation formats to the nonlinearities of semiconductor optical amplifiers, used as ON/OFF gates in the supercomputer optical switch fabric under study...

  17. Fractal Characteristics Analysis of Blackouts in Interconnected Power Grid

    DEFF Research Database (Denmark)

    Wang, Feng; Li, Lijuan; Li, Canbing

    2017-01-01

    The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG. The distri......The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG....... The distribution characteristics of blackouts in various sub-grids are demonstrated based on the Kolmogorov-Smirnov (KS) test. The fractal dimensions (FDs) of the IPG and its sub-grids are then obtained by using the KS test and the maximum likelihood estimation (MLE). The blackouts data in China were used...

  18. Evaluation of Global Wind Power and Interconnected Wind Farms

    Science.gov (United States)

    Archer, C. L.; Jacobson, M. Z.

    2005-12-01

    The world wind power potential is evaluated in this study. Wind speeds are calculated at 80 m, the hub height of modern, 77-m diameter, 1500 W turbines. Since relatively few observations are available at 80 m, the Least Square extrapolation technique is utilized to obtain estimates of wind speeds at 80 m given observed wind speeds at 10 m (widely available) and a network of sounding stations. Globally, about 13% of all reporting stations experience annual mean wind speeds >= 6.9 m/s at 80 m (i.e., wind power class 3 or greater) and can therefore be considered suitable for low-cost wind power generation. This estimate is believed to be conservative. Of all continents, North America has the largest number of stations in class >= 3 (453). Areas with great potential are found in Northern Europe along the North Sea, the southern tip of the South American continent, the island of Tasmania in Australia, the Great Lakes region, and the northeastern and northwestern coasts of North America. Assuming that statistics generated from all stations analyzed here are representative of the global distribution of winds, global wind power generated at locations with mean annual wind speeds >= 6.9 m/s at 80 m is found to be approximately 72 TW (54,000 Mtoe) for the year 2000. Even if only 20% of this power could be captured, it could satisfy 100% of the world's energy demand for all purposes (6,995-10,177 Mtoe) and over seven times the world electricity needs (1.6-1.8 TW). Several practical barriers need to be overcome to fully realize this potential. Wind intermittency could be perceived as one of them. However, interconnecting wind farms through the transmission grid, also known as distributed wind power, is a simple and effective way of reducing deliverable wind power swings caused by wind intermittency. As more farms are interconnected in an array, wind speed correlation among sites decreases and so does the probability that all sites experience the same wind regime at the same

  19. Prediction of interconnect delay variations using pattern matching

    Science.gov (United States)

    Chin, Eric Y.; Holwill, Juliet A.; Neureuther, Andrew R.

    2007-03-01

    An exploratory Process Variation Net Scanning (PVNS) approach to estimate interconnect delay variations is presented. It is shown that the geometrical response of lithographic nonidealities can be quickly predicted to first order with Pattern Matching. This concept can be extended to other process nonidealities by developing Maximum Lateral Impact Functions to capture the effects of variations in conductor sidewall angle and thickness from etch and CMP processes. The geometrical response for each variation can then be used to model the effective change in resistance and capacitance and perturb the corresponding values in the extracted netlist. The impact of PVNS is demonstrated using a 90nm digital design, and the runtime analysis indicates that this approach may potentially be twice as fast as traditional extraction. This allows for fast electrical analysis of independent process variations on different interconnect layers instead of traditional best and worst case corner analyses.

  20. Exploiting the Capabilities of the Interconnection Network on Dawning-1000

    Institute of Scientific and Technical Information of China (English)

    XIAO Limin; ZHU Mingfa

    1999-01-01

    On Dawning-1000, the two-dimension mesh interconnection network enables low-latency, high-bandwidth communication, however, these capabilities have not been realized because of the high processing overhead imposed by existing communication software. Active Messages provide an efficient communication mechanism with small overhead, which may expose the raw capabilities of the underlying hardware. In addition, one of the most promising techniques, user-level communication, is often used to improve the performance of the traditional protocols such as TCP and UDP, andis also adopted in implementing the novel abstractions like Active Messages. Thus a user-level Active Messages model is designed and implemented on Dawning-1000. Preliminary experiments show that the combination of Active Messages mechanism and user-level communication technique is quite efficient in reducing software overhead associated with sending and receiving messages, and in exploiting the capabilitiesof the interconnection network.

  1. A Prototype Embedded Microprocessor Interconnect for Distributed and Parallel Computing

    Directory of Open Access Journals (Sweden)

    Bryan Hughes

    2008-08-01

    Full Text Available Parallel computing is currently undergoing a transition from a niche use to widespread acceptance due to new, computationally intensive applications and multi-core processors. While parallel processing is an invaluable tool for increasing performance, more time and expertise are required to develop a parallel system than are required for sequential systems. This paper discusses a toolkit currently in development that will simplify both the hardware and software development of embedded distributed and parallel systems. The hardware interconnection mechanism uses the Serial Peripheral Interface as a physical medium and provides routing and management services for the system. The topics in this paper are primarily limited to the interconnection aspect of the toolkit.

  2. Optimal interconnection trees in the plane theory, algorithms and applications

    CERN Document Server

    Brazil, Marcus

    2015-01-01

    This book explores fundamental aspects of geometric network optimisation with applications to a variety of real world problems. It presents, for the first time in the literature, a cohesive mathematical framework within which the properties of such optimal interconnection networks can be understood across a wide range of metrics and cost functions. The book makes use of this mathematical theory to develop efficient algorithms for constructing such networks, with an emphasis on exact solutions.  Marcus Brazil and Martin Zachariasen focus principally on the geometric structure of optimal interconnection networks, also known as Steiner trees, in the plane. They show readers how an understanding of this structure can lead to practical exact algorithms for constructing such trees.  The book also details numerous breakthroughs in this area over the past 20 years, features clearly written proofs, and is supported by 135 colour and 15 black and white figures. It will help graduate students, working mathematicians, ...

  3. Interconnection and Competition Among Asymmetric Networks in the Internet Backbone Market

    NARCIS (Netherlands)

    Jahn, E.; Prüfer, J.

    2006-01-01

    We examine the interrelation between interconnection and competition in the internet backbone market.Networks asymmetric in size choose among different interconnection regimes and compete for end-users.We show that a direct interconnection regime, Peering, softens competition compared to indirect in

  4. Integration of a waveguide self-electrooptic effect device and a vertically coupled interconnect waveguide

    Science.gov (United States)

    Vawter, G. Allen

    2008-02-26

    A self-electrooptic effect device ("SEED") is integrated with waveguide interconnects through the use of vertical directional couplers. Light initially propagating in the interconnect waveguide is vertically coupled to the active waveguide layer of the SEED and, if the SEED is in the transparent state, the light is coupled back to the interconnect waveguide.

  5. 76 FR 45249 - PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical Conference

    Science.gov (United States)

    2011-07-28

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical... President--Market Operations and Demand Resources, PJM Interconnection, L.L.C. 11:15 a.m.-11:30 p.m. Break... Interconnection, L.L.C. Robert A. Weishaar, Jr., Counsel to PJM Industrial Customer Coalition, McNees,...

  6. 47 CFR 69.155 - Per-minute residual interconnection charge.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Per-minute residual interconnection charge. 69... Per-minute residual interconnection charge. (a) Local exchange carriers may recover a per-minute residual interconnection charge on originating access. The maximum such charge shall be the lower of:...

  7. 77 FR 34378 - PJM Interconnection, L.L.C.; Notice of Complaint

    Science.gov (United States)

    2012-06-11

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Complaint Take notice that on June 1, 2012, pursuant to section 206 of the Federal Power Act (FPA), 16 U.S.C. 824(e), PJM Interconnection, L... Interconnection L.L.C. (Operating Agreement) to base the calculation of marginal transmission line losses on...

  8. 75 FR 40815 - PJM Interconnection, L.L.C.; Notice of Filing

    Science.gov (United States)

    2010-07-14

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Filing July 7, 2010. Take notice that on July 1, 2010, PJM Interconnection, L.L.C. (PJM) filed revised sheets to Schedule 1 of the Amended and Restated Operating Agreement of PJM Interconnection, L.L.C. (Operating Agreement) and the...

  9. 77 FR 3766 - PJM Interconnection, L.L.C.; Notice of Staff Technical Conference

    Science.gov (United States)

    2012-01-25

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Staff Technical Conference On... explore the issues presented by PJM Interconnection, L.L.C.'s (PJM) filing.\\1\\ Take notice that the... Commission's questions by February 10, 2012. \\1\\ PJM Interconnection, L.L.C., 137 FERC ] 61,204...

  10. 75 FR 22773 - PJM Interconnection, L.L.C.; Notice of Filing

    Science.gov (United States)

    2010-04-30

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Filing April 23, 2010. Take notice that on April 22, 2010, PJM Interconnection, L.L.C. (PJM) filed revised tariff sheets to its Schedule 1... Interconnection, L.L.C., 130 FERC ] 61,230 (2010). Any person desiring to intervene or to protest this filing...

  11. 47 CFR 90.476 - Interconnection of fixed stations and certain mobile stations.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection of fixed stations and certain... Systems § 90.476 Interconnection of fixed stations and certain mobile stations. (a) Fixed stations and...)(11), 90.35(c)(42), and 90.267 are not subject to the interconnection provisions of §§ 90.477 and...

  12. 78 FR 19259 - Notice of Attendance at PJM Interconnection, L.L.C. Meetings

    Science.gov (United States)

    2013-03-29

    ... Energy Regulatory Commission Notice of Attendance at PJM Interconnection, L.L.C. Meetings The Federal... Commission staff may attend upcoming PJM Interconnection, L.L.C. (PJM) Members Committee and Markets and... Interconnection, L.L.C. Docket No. EL08-14, Black Oak Energy LLC, et al., v. FERC Docket No. EL10-52,...

  13. 77 FR 24646 - Open Access and Priority Rights on Interconnection Facilities

    Science.gov (United States)

    2012-04-25

    ... Energy Regulatory Commission 18 CFR Part 40 Open Access and Priority Rights on Interconnection Facilities... Inquiry, the Commission seeks comment on open access and priority rights for capacity on interconnection... ] 61,051 Docket Nos. Open Access and Priority Rights on Interconnection AD12-14-000 Facilities...

  14. Interconnection France-England; Interconnexion France-Angleterre

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    These documents defines the interconnection France-England rules for the 2000 MW DC submarine cable directly linking the transmission networks of England and Wales and France. Rights to use Interconnector capacity from 1 April 2001 are to be offered through competitive tenders and auctions, full details of which are set out in the Rules. The contract and a guide to the application form are provided. (A.L.B.)

  15. Nonlinear H∞ filtering for interconnected Markovian jump systems

    Institute of Scientific and Technical Information of China (English)

    Zhang Xiaomei; Zheng Yufan

    2006-01-01

    The problem of nonlinear H∞ filtering for interconnected Markovian jump systems is discussed. The aim of this note is the design of a nonlinear Markovian jump filter such that the resulting error system is exponentially meansquare stable and ensures a prescribed H∞ performance. A sufficient condition for the solvability of this problem is given in terms of linear matrix inequalities(LMIs). A simulation example is presented to demonstrate the effectiveness of the proposed design approach.

  16. A Unified Access Model for Interconnecting Heterogeneous Wireless Networks

    Science.gov (United States)

    2015-05-01

    with each other via a central controller. The 2 access technologies used were 802.11 ( WiFi ) and a Carrier-Sense Multiple Access (CSMA) protocol ...wireless subnets could communicate with each other. 3. Results and Discussion Using the 3-VM LTE/ WiFi configuration, we placed a User Datagram Protocol ...control plane protocols . A network model that can abstract disparate MAC layers in heterogeneous networks and interconnect them using a unified and

  17. Vertically aligned multiwalled carbon nanotubes as electronic interconnects.

    OpenAIRE

    Gopee, Vimal C.

    2017-01-01

    The drive for miniaturisation of electronic circuits provides new materials challenges for the electronics industry. Indeed, the continued downscaling of transistor dimensions, described by Moore’s Law, has led to a race to find suitable replacements for current interconnect materials to replace copper. Carbon nanotubes have been studied as a suitable replacement for copper due to its superior electrical, thermal and mechanical properties. One of the advantages of using carbon nanotubes is th...

  18. A 3D bus interconnect for network line cards

    OpenAIRE

    Engel, J; Kocak, T

    2004-01-01

    In this paper, we propose a 3D bus architecture as a processor-memory interconnection system to increase the throughput of the memory system currently used on line cards. The 3D bus architecture allows multiple processing elements on a line card to access a shared memory. The main advantage of the proposed architecture is to increase the network processor off-chip memory bandwidth while diminishing the latency otherwise caused by the single bus competition.

  19. Synthesis of micro-sized interconnected Si-C composites

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Donghai; Yi, Ran; Dai, Fang

    2016-02-23

    Embodiments provide a method of producing micro-sized Si--C composites or doped Si--C and Si alloy-C with interconnected nanoscle Si and C building blocks through converting commercially available SiO.sub.x (0

  20. Performance evaluation of two highly interconnected Data Center networks

    DEFF Research Database (Denmark)

    Andrus, Bogdan-Mihai; Mihai Poncea, Ovidiu; Vegas Olmos, Juan José;

    2015-01-01

    In this paper we present the analysis of highly interconnected topologies like hypercube and torus and how they can be implemented in data centers in order to cope with the rapid increase and demands for performance of the internal traffic. By replicating the topologies and subjecting them...... of the network was increased by a factor of 32. The performance measurements are supported by abstract metrics that also give a cost and complexity indication in choosing the right topology for the required application....

  1. Overvoltages related to distributed generation-power system interconnection transformer

    Energy Technology Data Exchange (ETDEWEB)

    Zamanillo, G.R.; Gomez, J.C.; Florena, E.F. [Rio Cuarto National University (IPSEP/UNRC), Cordoba (Argentina). Electric Power Systems Protection Institute], Email: jcgomez@ing.unrc.edu.ar

    2009-07-01

    The energy crisis that experiences the world drives to carry to an extreme, the use of all energy sources which are available. The sources need to be connected to the electric network in their next point, requiring of electric-electronic interfaces. The traditional electric power systems are changing their characteristics, in what concerns to structure, operation and on overvoltage generation. This change is not taking place in coordinated form among the involved sectors. The interconnection of a Distributed Generator (DG) directly with the power system is objectionable and risky. It is required of an interconnection transformer which performs several functions. Rigid specifications do not exist in this respect, for the variety of systems in use in the world, nevertheless there are utilities recommendations. Overvoltages caused by the DG, which arise due to the change of structure of the electric system, are explained. The transformer connection selection, presents positive and negative aspects that impact the utility and the user in a different or many times in an antagonistic way. The phenomenon of balanced and unbalanced ferroresonance overvoltage is studied. This phenomenon can takes place when using DG, either with synchronous or asynchronous generator, and for any type of connection of the transformer. The necessary conditions so that the phenomenon appears are presented. Eight interconnection transformer connection ways were studied. It is concluded that the solutions to reach by means of the employment of the DG, offer technical-economic advantages so much to the utility as to the user. It is also concluded in this work that the more advisable interconnection type is function of the system connection type. (author)

  2. Thin Film Compound Semiconductor Devices for Photonic Interconnects

    Science.gov (United States)

    Calhoun, Kenneth Harold

    The research conducted for this doctoral dissertation involved the experimental investigation of thin film compound devices for use as photonic interconnection components in both external and direct modulated interconnection configurations. The devices were fabricated using a modified epitaxial liftoff procedure developed at Georgia Tech. This technique, by which single crystal semiconductor layers were separated from their growth substrate and subsequently deposited onto host substrates, allowed the development of novel photonic interconnection elements. It also facilitated the investigation of fundamental optical phenomena in compound semiconductors. Specifically, this work focused on an experimental study of the Franz-Keldysh electrorefractive effect in thin film semiconductor structures. This aspect of the research resulted in the first reported direct measurement of electrorefraction in GaAs at large electric fields (10 ^5 V/cm) and at photon energies within several meV of the band edge of GaAs. Related to this effort was the investigation of thin film, surface-normal optical modulators based on the bulk Franz-Keldysh effect. The novel modulators fabricated for this research demonstrated the largest contrast ratios ever reported for surface-normal Franz-Keldysh devices. Further investigation indicated that, with additional optimization, these thin film elements can achieve further improvements in performance. Such devices would present a low cost, easily manufactured alternative to conventional modulators, which are typically quite complex and expensive to fabricate. Finally, as an alternative to externally modulated interconnection schemes, a novel stacked wafer architecture was demonstrated. This configuration, which facilitated through-wafer optical communication, utilized thin film InP/InGaAsP emitters and detectors which were quasi-monolithically integrated onto silicon substrates using the modified epitaxial liftoff process. This through-wafer scheme is

  3. Interconnection of the speech and socio-emotional development

    OpenAIRE

    Gamser, Jana

    2013-01-01

    The following thesis researches the relation between a child's speech and his socio-emotional development and their interconnection. Theoretical part of the paper serves to present some characteristics of development in the childhood stage and the influence of the child's entire life array on it. I continue by exposing important topics within speech and socio-emotional development. First, I present different phases of speech development, the process of acquiring communication skills and d...

  4. Accuracy and Validation of Measured and Modeled Data for Distributed PV Interconnection and Control

    Energy Technology Data Exchange (ETDEWEB)

    Stewart, Emma; Kiliccote, Sila; Arnold, Daniel; von Meier, Alexandra; Arghandeh, R.

    2015-07-27

    The distribution grid is changing to become an active resource with complex modeling needs. The new active distribution grid will, within the next ten years, contain a complex mix of load, generation, storage and automated resources all operating with different objectives on different time scales from each other and requiring detailed analysis. Electrical analysis tools that are used to perform capacity and stability studies have been used for transmission system planning for many years. In these tools, the distribution grid was considered a load and its details and physical components were not modeled. The increase in measured data sources can be utilized for better modeling, but also control of distributed energy resources (DER). The utilization of these sources and advanced modeling tools will require data management, and knowledgeable users. Each of these measurement and modeling devices have accuracy constraints, which will ultimately define their future ability to be planned and controlled. This paper discusses the importance of measured data accuracy for inverter control, interconnection and planning tools and proposes ranges of control accuracy needed to satisfy all concerns based on the present grid infrastructure.

  5. Electrophysiological recording of the brain, visualization, prediction, and interconnectivity

    Science.gov (United States)

    Talakoub, Omid

    The human brain is a complex network of interconnected neurons. The aim of neuroscience and neuroengineering is to decode the neural activity, visualize it and try to better understand how neurons communicate with each other. This dissertation comprises four contributions to the area. These four topics are discussing how functional relationship between brain activity and movement can be found and whether common features found in different regions are correlated (phase-locked). First, the method of chirplet decomposition offers a new way to visualize the time-frequency content of non-stationary signals with higher resolution than previously possible. The use of Wigner-Ville distribution together with chirplet decomposition allows a clearer visualization in terms of both the temporal and frequency details with detail higher than previously achieved using other methods including Choi-Williams and spectrogram. Second, an improved method of averaging of neural signals over repeated trials is introduced whereby slight variations in the alignment of the neural signal over time is corrected through the use of nonlinear shifts. In earlier studies, time alignment has been performed using linear shift (e.g. alignment with movement onset), but this process alone is not sufficient when the signal timing changes differently over time. To overcome this issue, nonlinear transformations were found to remove any temporal variabilities in the way the task was performed. Third, a multilinear model is demonstrated showing how limb velocity in a reach task can be predicted from neuroelectrical activity. The model, after fitting, suggested that high frequency oscillations have sufficient information for both detection of movement onset and reconstruction of its movement. The use of a linear model reduces the overall computational requirements and simplifies the reconstruction of movement kinematics. Finally, a fourth method involving the measurement of coherence over time reveals how

  6. Electroabsorption modulators for CMOS compatible optical interconnects in III-V and group IV materials

    Science.gov (United States)

    Roth, Jonathan Edgar

    While electrical systems excel at information processing, photonics is useful in systems for high-bandwidth, low-loss signal transmission. As photonics technology has become increasingly widespread and has been deployed at shorter distance scales than traditional long-haul networks, it has become important to efficiently integrate photonics components with electrical integrated circuits. Optoelectronic modulators used as transmitters are an important class of device for use in optical interconnects. Many optoelectronic modulator designs use waveguides. Coupling light into waveguides requires a difficult alignment step. This dissertation will describe a number of optoelectronic modulators that do not have the tight alignment constraints associated with waveguide-based modulators. The eased alignment constraints may be important for the practical manufacturing and packaging of systems using optical interconnects. Most currently deployed photonics technologies also use substrates other than silicon and materials incompatible with CMOS manufacturing. Recently we discovered a strong quantum-confined Stark effect in Ge/SiGe quantum well structures that can be used to create efficient optoelectronic modulators on silicon substrates. Optoelectronic modulators using this technology can be fabricated with conventional CMOS foundry processes, possibly on the same chips as CMOS circuits. In this dissertation, an optical interconnect operating in the C-band will be presented. We believe this is the first such device employing an optical transmitter flip-chip bonded to silicon CMOS. A number of novel modulators will be presented, which are fabricated on silicon substrates, and employ Ge/SiGe quantum well structures. These modulators include a novel architecture known as the side-entry modulator, which is designed for monolithic integration with electronics. One side-entry modulator achieved over 3 dB of contrast in the telecommunications C-band for a voltage swing of 1V. Such a

  7. Enhancing Ecoefficiency in Shrimp Farming through Interconnected Ponds

    Directory of Open Access Journals (Sweden)

    Ramón Héctor Barraza-Guardado

    2015-01-01

    Full Text Available The future development of shrimp farming needs to improve its ecoefficiency. The purpose of this study was to evaluate water quality, flows, and nitrogen balance and production parameters on a farm with interconnected pond design to improve the efficiency of the semi-intensive culture of Litopenaeus vannamei ponds. The study was conducted in 21 commercial culture ponds during 180 days at densities of 30–35 ind m−2 and daily water exchange <2%. Our study provides evidence that by interconnecting ponds nutrient recycling is favored by promoting the growth of primary producers of the pond as chlorophyll a. Based on the mass balance and flow of nutrients this culture system reduces the flow of solid, particulate organic matter, and nitrogen compounds to the environment and significantly increases the efficiency of water (5 to 6.5 m3 kg−1 cycle−1, when compared with traditional culture systems. With this culture system it is possible to recover up to 34% of the total nitrogen entering the system, with production in excess of 4,000 kg ha−1 shrimp. We believe that the production system with interconnected ponds is a technically feasible model to improve ecoefficiency production of shrimp farming.

  8. Reusable, adhesiveless and arrayed in-plane microfluidic interconnects

    Science.gov (United States)

    Lo, R.; Meng, E.

    2011-05-01

    A reusable, arrayed interconnect capable of providing multiple simultaneous connections to and from a microfluidic device in an in-plane manner without the use of adhesives is presented. This method uses a 'pin-and-socket' design in which an SU-8 anchor houses multiple polydimethysiloxane septa (the socket) that each receive a syringe needle (the pin). A needle array containing multiple commercially available 33G (203 µm outer diameter) needles (up to eight) spaced either 2.54 or 1 mm (center-to-center) pierces the septa to access the microfluidic device interior. Finite element modeling and photoelastic stress experiments were used to determine the stress distribution during needle insertion; these results guided the SU-8 septa housing and septa design. The impact of needle diameter, needle tip style, insertion rate and number of needles on pre-puncture, post-puncture and removal forces was characterized. Pressurized connections to SU-8 channel systems withstood up to 62 kPa of pressurized water and maintained 25 kPa of pressurized water for over 24 h. The successful integration and functionality of the interconnect design with surface micromachined Parylene C microchannels was verified using Rhodamine B dye. Dual septa systems to access a single microchannel were demonstrated. Arrayed interconnects were compatible with integrated microfluidic systems featuring electrochemical sensors and actuators.

  9. Power System Study for Renewable Energy Interconnection in Malaysia

    Science.gov (United States)

    Askar, O. F.; Ramachandaramurthy, V. K.

    2013-06-01

    The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

  10. Method to Determine Maximum Allowable Sinterable Silver Interconnect Size

    Energy Technology Data Exchange (ETDEWEB)

    Wereszczak, A. A.; Modugno, M. C.; Waters, S. B.; DeVoto, D. J.; Paret, P. P.

    2016-05-01

    The use of sintered-silver for large-area interconnection is attractive for some large-area bonding applications in power electronics such as the bonding of metal-clad, electrically-insulating substrates to heat sinks. Arrays of different pad sizes and pad shapes have been considered for such large area bonding; however, rather than arbitrarily choosing their size, it is desirable to use the largest size possible where the onset of interconnect delamination does not occur. If that is achieved, then sintered-silver's high thermal and electrical conductivities can be fully taken advantage of. Toward achieving this, a simple and inexpensive proof test is described to identify the largest achievable interconnect size with sinterable silver. The method's objective is to purposely initiate failure or delamination. Copper and invar (a ferrous-nickel alloy whose coefficient of thermal expansion (CTE) is similar to that of silicon or silicon carbide) disks were used in this study and sinterable silver was used to bond them. As a consequence of the method's execution, delamination occurred in some samples during cooling from the 250 degrees C sintering temperature to room temperature and bonding temperature and from thermal cycling in others. These occurrences and their interpretations highlight the method's utility, and the herein described results are used to speculate how sintered-silver bonding will work with other material combinations.

  11. Improving pore interconnectivity in polymeric scaffolds for tissue engineering.

    Science.gov (United States)

    Aydin, H M; El Haj, A J; Pişkin, E; Yang, Y

    2009-08-01

    A new scaffold fabrication technique aiming to enhance pore interconnectivity for tissue engineering has been developed. Medical grade poly(lactic acid) was utilized to generate scaffolds by a solvent-evaporating/particulate-leaching technique, using a new dual-porogen system. Water-soluble sodium chloride particles were used to control macro-pore size in the range 106-255 microm, while organic naphthalene was utilized as a porogen to increase pore interconnections. The three-dimensional (3D) morphology of the scaffolds manufactured with and without naphthalene was examined by optical coherence tomography and scanning electron microscopy. The mechanical properties of the scaffolds were characterized by compression tests. MG63 osteoblast cells were seeded in the scaffolds to study the cell attachment and viability evaluated by confocal microscopy. It was revealed that introducing naphthalene as the second porogen in the solvent-evaporating/particulate-leaching process resulted in improvement of the pore interconnectivity. Cells grew in both scaffolds fabricated with and without naphthalene. They exhibited strong green fluorescence when using a live/dead fluorescent dye kit, indicating that the naphthalene in the scaffold process did not affect cell viability.

  12. High-bandwidth remote flat panel display interconnect system

    Science.gov (United States)

    Peterson, Darrel G.

    1999-08-01

    High performance electronic displays (CRT, AMLCD, TFEL, plasma, etc.) require wide bandwidth electrical drive signals to produce the desired display images. When the image generation and/or image processing circuitry is located within the same line replaceable unit (LRU) as the display media, the transmission of the display drive signals to the display media presents no unusual design problems. However, many aircraft cockpits are severely constrained for available space behind the instrument panel. This often forces the system designer to specify that only the display media and its immediate support circuitry are to be mounted in the instrument panel. A wide bandwidth interconnect system is then required to transfer image data from the display generation circuitry to the display unit. Image data transfer rates of nearly 1.5 Gbits/second may be required when displaying full motion video at a 60 Hz field rate. In addition to wide bandwidth, this interconnect system must exhibit several additional key characteristics: (1) Lossless transmission of image data; (2) High reliability and high integrity; (3) Ease of installation and field maintenance; (4) High immunity to HIRF and electrical noise; (5) Low EMI emissions; (6) Long term supportability; and (7) Low acquisition and maintenance cost. Rockwell Collins has developed an avionics grade remote display interconnect system based on the American National Standards Institute Fibre Channel standard which meets these requirements. Readily available low cost commercial off the shelf (COTS) components are utilized, and qualification tests have confirmed system performance.

  13. Fabrication of interconnected microporous biomaterials with high hydroxyapatite nanoparticle loading

    Energy Technology Data Exchange (ETDEWEB)

    Zhang Wei; Yao Donggang [School of Polymer Textile and Fiber Engineering, Georgia Institute of Technology, Atlanta, GA (United States); Zhang Qingwei; Lelkes, Peter I [School of Biomedical Engineering, Science, and Health Systems, Drexel University, Philadelphia, PA 19104 (United States); Zhou, Jack G, E-mail: yao@gatech.ed [Department of Mechanical Engineering and Mechanics, Drexel University, Philadelphia, PA 19104 (United States)

    2010-09-15

    Hydroxyapatite (HA) is known to promote osteogenicity and enhance the mechanical properties of biopolymers. However, incorporating a large amount of HA into a porous biopolymer still remains a challenge. In the present work, a new method was developed to produce interconnected microporous poly(glycolic-co-lactic acid) (PLGA) with high HA nanoparticle loading. First, a ternary blend comprising PLGA/PS (polystyrene)/HA (40/40/20 wt%) was prepared by melt blending under conditions for formation of a co-continuous phase structure. Next, a dynamic annealing stage under small-strain oscillation was applied to the blend to facilitate nanoparticle redistribution. Finally, the PS phase was sacrificially extracted, leaving a porous matrix. The results from different characterizations suggested that the applied small-strain oscillation substantially accelerated the migration of HA nanoparticles during annealing from the PS phase to the PLGA phase; nearly all HA particles were uniformly presented in the PLGA phase after a short period of annealing. After dissolution of the PS phase, a PLGA material with interconnected microporous structure was successfully produced, with a high HA loading above 30 wt%. The mechanisms beneath the experimental observations, particularly on the enhanced particle migration process, were discussed, and strategies for producing highly particle loaded biopolymers with interconnected microporous structures were proposed.

  14. Next Generation Space Interconnect Standard (NGSIS): a modular open standards approach for high performance interconnects for space

    Science.gov (United States)

    Collier, Charles Patrick

    2017-04-01

    The Next Generation Space Interconnect Standard (NGSIS) effort is a Government-Industry collaboration effort to define a set of standards for interconnects between space system components with the goal of cost effectively removing bandwidth as a constraint for future space systems. The NGSIS team has selected the ANSI/VITA 65 OpenVPXTM standard family for the physical baseline. The RapidIO protocol has been selected as the basis for the digital data transport. The NGSIS standards are developed to provide sufficient flexibility to enable users to implement a variety of system configurations, while meeting goals for interoperability and robustness for space. The NGSIS approach and effort represents a radical departure from past approaches to achieve a Modular Open System Architecture (MOSA) for space systems and serves as an exemplar for the civil, commercial, and military Space communities as well as a broader high reliability terrestrial market.

  15. A metallic interconnect for a solid oxide fuel cell stack

    Science.gov (United States)

    England, Diane Mildred

    A solid oxide fuel cell (SOFC) electrochemically converts the chemical energy of reaction into electrical energy. The commercial success of planar, SOFC stack technology has a number of challenges, one of which is the interconnect that electrically and physically connects the cathode of one cell to the anode of an adjacent cell in the SOFC stack and in addition, separates the anodic and cathodic gases. An SOFC stack operating at intermediate temperatures, between 600°C and 800°C, can utilize a metallic alloy as an interconnect material. Since the interconnect of an SOFC stack must operate in both air and fuel environments, the oxidation kinetics, adherence and electronic resistance of the oxide scales formed on commercial alloys were investigated in air and wet hydrogen under thermal cycling conditions to 800°C. The alloy, Haynes 230, exhibited the slowest oxidation kinetics and the lowest area-specific resistance as a function of oxidation time of all the alloys in air at 800°C. However, the area-specific resistance of the oxide scale formed on Haynes 230 in wet hydrogen was unacceptably high after only 500 hours of oxidation, which was attributed to the high resistivity of Cr2O3 in a reducing atmosphere. A study of the electrical conductivity of the minor phase manganese chromite, MnXCr3-XO4, in the oxide scale of Haynes 230, revealed that a composition closer to Mn2CrO4 had significantly higher electrical conductivity than that closer to MnCr 2O4. Haynes 230 was coated with Mn to form a phase closer to the Mn2CrO4 composition for application on the fuel side of the interconnect. U.S. Patent No. 6,054,231 is pending. Although coating a metallic alloy is inexpensive, the stringent economic requirements of SOFC stack technology required an alloy without coating for production applications. As no commercially available alloy, among the 41 alloys investigated, performed to the specifications required, a new alloy was created and designated DME-A2. The oxide scale

  16. New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response

    Directory of Open Access Journals (Sweden)

    El-Sayed A. El-Badawy

    2008-02-01

    Full Text Available Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton. Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

  17. Neuro-Fuzzy Computational Technique to Control Load Frequency in Hydro-Thermal Interconnected Power System

    Science.gov (United States)

    Prakash, S.; Sinha, S. K.

    2015-09-01

    In this research work, two areas hydro-thermal power system connected through tie-lines is considered. The perturbation of frequencies at the areas and resulting tie line power flows arise due to unpredictable load variations that cause mismatch between the generated and demanded powers. Due to rising and falling power demand, the real and reactive power balance is harmed; hence frequency and voltage get deviated from nominal value. This necessitates designing of an accurate and fast controller to maintain the system parameters at nominal value. The main purpose of system generation control is to balance the system generation against the load and losses so that the desired frequency and power interchange between neighboring systems are maintained. The intelligent controllers like fuzzy logic, artificial neural network (ANN) and hybrid fuzzy neural network approaches are used for automatic generation control for the two area interconnected power systems. Area 1 consists of thermal reheat power plant whereas area 2 consists of hydro power plant with electric governor. Performance evaluation is carried out by using intelligent (ANFIS, ANN and fuzzy) control and conventional PI and PID control approaches. To enhance the performance of controller sliding surface i.e. variable structure control is included. The model of interconnected power system has been developed with all five types of said controllers and simulated using MATLAB/SIMULINK package. The performance of the intelligent controllers has been compared with the conventional PI and PID controllers for the interconnected power system. A comparison of ANFIS, ANN, Fuzzy and PI, PID based approaches shows the superiority of proposed ANFIS over ANN, fuzzy and PI, PID. Thus the hybrid fuzzy neural network controller has better dynamic response i.e., quick in operation, reduced error magnitude and minimized frequency transients.

  18. Traversing and labeling interconnected vascular tree structures from 3D medical images

    Science.gov (United States)

    O'Dell, Walter G.; Govindarajan, Sindhuja Tirumalai; Salgia, Ankit; Hegde, Satyanarayan; Prabhakaran, Sreekala; Finol, Ender A.; White, R. James

    2014-03-01

    Purpose: Detailed characterization of pulmonary vascular anatomy has important applications for the diagnosis and management of a variety of vascular diseases. Prior efforts have emphasized using vessel segmentation to gather information on the number or branches, number of bifurcations, and branch length and volume, but accurate traversal of the vessel tree to identify and repair erroneous interconnections between adjacent branches and neighboring tree structures has not been carefully considered. In this study, we endeavor to develop and implement a successful approach to distinguishing and characterizing individual vascular trees from among a complex intermingling of trees. Methods: We developed strategies and parameters in which the algorithm identifies and repairs false branch inter-tree and intra-tree connections to traverse complicated vessel trees. A series of two-dimensional (2D) virtual datasets with a variety of interconnections were constructed for development, testing, and validation. To demonstrate the approach, a series of real 3D computed tomography (CT) lung datasets were obtained, including that of an anthropomorphic chest phantom; an adult human chest CT; a pediatric patient chest CT; and a micro-CT of an excised rat lung preparation. Results: Our method was correct in all 2D virtual test datasets. For each real 3D CT dataset, the resulting simulated vessel tree structures faithfully depicted the vessel tree structures that were originally extracted from the corresponding lung CT scans. Conclusion: We have developed a comprehensive strategy for traversing and labeling interconnected vascular trees and successfully implemented its application to pulmonary vessels observed using 3D CT images of the chest.

  19. New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response

    Directory of Open Access Journals (Sweden)

    El-Sayed A. El-Badawy

    2008-02-01

    Full Text Available Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton. Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

  20. GRIPS Plan

    Energy Technology Data Exchange (ETDEWEB)

    1978-07-31

    The GRIPS (Geothermal Resources Impact Projection Study) Commission was established by a Joint Powers Agreement between the California Counties of Lake, Mendocino, Napa, and Sonoma. The objectives of GRIPS are primarily to develop and use a cooperative environmental data collection and use system including natural, social, and economic considerations to facilitate their independent decisions and those of State and Federal agencies related to the environmental effects of geothermal development. This GRIPS Plan was prepared from a wide range of studies, workshops, and staff analyses. The plan is presented in four parts: summary and introduction; environmental data status report; planned programs; and budget. (MHR)

  1. A novel analytical thermal model for multilevel nano-scale interconnects considering the via effect

    Institute of Scientific and Technical Information of China (English)

    Zhu Zhang-Ming; Li Ru; Hao Bao-Tian; Yang Yin-Tang

    2009-01-01

    Based on the heat diffusion equation of multilevel interconnects, a novel analytical thermal model for multilevel nano-scale interconnects considering the via effect is presented, which can compute quickly the temperature of multilevel interconnects, with substrate temperature given. Based on the proposed model and the 65 nm complementary metal oxide semiconductor (CMOS) process parameter, the temperature of nano-scale interconnects is computed. The computed results show that the via effect has a great effect on local interconnects, but the reduction of thermal conductivity has little effect on local interconnects. With the reduction of thermal conductivity or the increase of current density, however, the temperature of global interconnects rises greatly, which can result in a great deterioration in their performance. The proposed model can be applied to computer aided design (CAD) of very large-scale integrated circuits (VLSIs) in nano-scale technologies.

  2. When Will Interconnection Go Smoothly?%互联互通何时畅通无阻?

    Institute of Scientific and Technical Information of China (English)

    钱静

    2003-01-01

    At the beginning of this year, Mll placed great emphasis on the regulation of interconnection and decided to introduce some new regulation methods to settle the disputes on interconnection. The year of 2003 is thus called interconnection year'. In early this June Mll announced the punishment to three companies who had violated the rule of interconnection, which indicated great determinacy of Mll to solve the problem of interconnection. What makes interconnection so difficult to carry on? In this issue the "New Telecom Salon" focuses on the subject of interconnection. We invited the vice president of China Netcom Group, the director of China Telecom Group and the director of Policy Research Department at China Academy of Telecom Research of MII to be our guests.

  3. Preliminary investigation of interconnected systems interactions for the safety injection system of Indian Point-3

    Energy Technology Data Exchange (ETDEWEB)

    Alesso, H.P.; Lappa, D.A.; Smith, C.F.; Sacks, I.J.

    1983-03-04

    The rich diversity of ideas and techniques for analyzing interconnected systems interaction has presented the NRC with the problem of identifying methods appropriate for their own review and audit. This report presents the findings of a preliminary study using the Digraph Matrix Analysis method to evaluate interconnected systems interactions for the safety injection system of Indian Point-3. The analysis effort in this study was subjected to NRC constraints regarding the use of Boolean logic, the construction of simplified plant representations or maps, and the development of heuristic measures as specified by the NRC. The map and heuristic measures were found to be an unsuccessful approach. However, from the effort to model and analyze the Indian Point-3 safety injection system, including Boolean logic in the model, singleton and doubleton cut-sets were identified. It is recommended that efforts excluding Boolean logic and utilizing the NRC heuristic measures not be pursed further and that the Digraph Matrix approach (or other comparable risk assessment technique) with Boolean logic included to conduct the audit of the Indian Point-3 systems interaction study.

  4. 76 FR 49841 - Transmission Planning and Cost Allocation by Transmission Owning and Operating Public Utilities

    Science.gov (United States)

    2011-08-11

    ... process, procedures for joint evaluation and sharing of information regarding the respective transmission... data and information between neighboring transmission planning regions at least annually. 9. Finally... of power flows over an interconnected transmission system. In particular, the...

  5. 76 FR 46793 - PJM Interconnection, L.L.C.; PJM Power Providers Group v. PJM Interconnection, L.L.C.; Notice...

    Science.gov (United States)

    2011-08-03

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission PJM Interconnection, L.L.C.; PJM Power Providers Group v. PJM Interconnection, L.L.C.; Notice Establishing Post-Technical Comment Period As indicated in the June 29,...

  6. New transmission planning methodology for requesting proposals for wind generation

    Science.gov (United States)

    Isaacs, Andrew L.

    The increasing interest in renewable energy technologies during the last decade has caused conventional transmission and generation expansion planning methodologies to be strained and in some cases abandoned. This is due both to the quantity of generator interconnection requests and the constraints imposed by deregulated energy industry structures. One technique used to control the influx of renewable generation while maintaining competitive principles is a Request for Proposals (RFP). However, lack of transmission planning due to a disconnection between generation and transmission owners, difficulty in identifying viable projects, and high risk for proponents stand as obstacles to the goals of an RFP. This research proposes a procedure which minimizes the effect of these obstacles; meeting the purchaser requirements for low price and combining conventional planning concepts with feedback from competitive structures. The general features of the method include definition of generation limits and study area, expansion plan design, transmission cost evaluation, optimal selection of requested generation levels, and final selection of successful proponents. The method is shown to be effective in creating an RFP where proponents are well-informed and provided with cost certainty to reduce bid price, buyers are able to determine end costs of their energy, and good expansion planning principles are maintained. A case study using a real system in New Mexico demonstrates these concepts.

  7. HABITAT MANAGEMENT PLAN, INTEGRATED PEST MANAGEMENT PLAN, AND VISITOR SERVICES PLAN FOR SAM D. HAMILTON NOXUBEE NATIONAL WILDLIFE REFUGE

    Data.gov (United States)

    US Fish and Wildlife Service, Department of the Interior — This document contains 3 major plans including the Habitat Management Plan, the Integrated Pest Management Plan and the Visitor Services Plan. These plans provide...

  8. Production process for advanced space satellite system cables/interconnects.

    Energy Technology Data Exchange (ETDEWEB)

    Mendoza, Luis A.

    2007-12-01

    This production process was generated for the satellite system program cables/interconnects group, which in essences had no well defined production process. The driver for the development of a formalized process was based on the set backs, problem areas, challenges, and need improvements faced from within the program at Sandia National Laboratories. In addition, the formal production process was developed from the Master's program of Engineering Management for New Mexico Institute of Mining and Technology in Socorro New Mexico and submitted as a thesis to meet the institute's graduating requirements.

  9. A New Family of Interconnection Networks of Fixed Degree Three

    Institute of Scientific and Technical Information of China (English)

    Shu-Ming Zhou; Wen-Jun Xiao

    2004-01-01

    A new family of interconnection networks WGn is proposed, that is constant degree 3 Cayley graph,and is isomorphic to a Cayley graph of the wreath product Z2lSn when the generator set is chosen properly. Its different algebraic properties is investigated and a routing algorithm is given with the diameter upper bounded by 3n2 - 6n + 4. The embedding properties and the fault tolerance are devired. In conclusion, we present a comparison of some familiar networks with constant degree 3.

  10. On some interconnections between combinatorial optimization and extremal graph theory

    Directory of Open Access Journals (Sweden)

    Cvetković Dragoš M.

    2004-01-01

    Full Text Available The uniting feature of combinatorial optimization and extremal graph theory is that in both areas one should find extrema of a function defined in most cases on a finite set. While in combinatorial optimization the point is in developing efficient algorithms and heuristics for solving specified types of problems, the extremal graph theory deals with finding bounds for various graph invariants under some constraints and with constructing extremal graphs. We analyze by examples some interconnections and interactions of the two theories and propose some conclusions.

  11. Parallel optical interconnects: implementation of optoelectronics in multiprocessor architectures.

    Science.gov (United States)

    Frietman, E E; van Nifterick, W; Dekker, L; Jongeling, T J

    1990-03-10

    Performance and efficiency of multiple processor computers depend strongly on the network that interconnects the distinct collaborating processors. Constrained connectivity forces much of the potential computing speed to be used to compensate for the limitation in connections. The availability of a multiple parallel I/O connections allows full unrestricted connectivity and is an essential prerequisite for an interprocessor network that is able to meet the ever growing communication demands. This paper emphasizes the design, building and application of an electrooptic communication system [EOCS]. The EOCS uses dedicated free space multiple data distributors and integrated optically writable inputbuffer arrays with fully parallel access.

  12. Two component micro injection moulding for moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Aminul

    2008-01-01

    Moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their capability of reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...... and a reasonable adhesion between them. • Selective metallization of the two component plastic part (coating one polymer with metal and leaving the other one uncoated) To overcome these two main issues in MID fabrication for micro applications, the current Ph.D. project explores the technical difficulties...

  13. Power economy using point-to-point optical interconnect links

    Science.gov (United States)

    Hartman, Davis H.; Reith, Leslie A.; Habiby, Sarry F.; Lalk, Gail R.; Booth, Bruce L.; Marchegiano, Joseph E.; Hohman, James L.

    1991-04-01

    Future communications networks will be required to provide the switching of very broad-band digita'' channels (typically 155. 52 Mb/s or higher) for as many as 60 customers. Power consumption and cable management are a major factor in the systems level design considerations. It is shown that through the use of ultra-low threshold laser diode arrays optical fiber ribbon cables and a thoughtful packaging strategy significant electrical power advantage can be accrued over conventional electrical interconnection approaches. 1_a

  14. A reconfigurable optoelectronic interconnect technology for multi-processor networks

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Y.C.; Cheng, J. [Univ. of New Mexico, Albuquerque, NM (United States). Center for High Technology Materials; Zolper, J.C.; Klem, J. [Sandia National Labs., Albuquerque, NM (United States)

    1995-05-01

    This paper describes a new optical interconnect architecture and the integrated optoelectronic circuit technology for implementing a parallel, reconfigurable, multiprocessor network. The technology consists of monolithic array`s of optoelectronic switches that integrate vertical-cavity surface-emitting lasers with three-terminal heterojunction phototransistors, which effectively combined the functions of an optical transceiver and an optical spatial routing switch. These switches have demonstrated optical switching at 200 Mb/s, and electrical-to-optical data conversion at > 500 Mb/s, with a small-signal electrical-to-optical modulation bandwidth of {approximately} 4 GHz.

  15. NIRVANA GOSIP (Government Open Systems Interconnect Profile) requirements

    Energy Technology Data Exchange (ETDEWEB)

    Wood, B.J.

    1990-08-01

    NIRVANA is an effort to standardize electrical computer-aided design workstations at Sandia National Laboratories in Albuquerque, New Mexico. The early effect of this project will be the introduction of at least 60 new engineering workstations at Sandia National Laboratories, Albuquerque, and at Allied Signal, Kansas City Division. These workstations are expected to begin arriving in September 1990. This paper outlines the requirements that a NIRVANA Network must satisfy to comply with the Government Open Systems Interconnect Profile (GOSIP). The author also identifies several issues involved in achieving GOSIP compliance. 4 refs., 1 fig.

  16. Ferroelectric devices, interconnects, and methods of manufacture thereof

    KAUST Repository

    Alshareef, Husam N.

    2013-12-12

    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  17. Decentralized control and filtering in interconnected dynamical systems

    CERN Document Server

    Mahmoud, Magdi S

    2011-01-01

    Based on the many approaches available for dealing with large-scale systems (LSS), Decentralized Control and Filtering in Interconnected Dynamical Systems supplies a rigorous framework for studying the analysis, stability, and control problems of LSS. Providing an overall assessment of LSS theories, it addresses model order reduction, parametric uncertainties, time delays, and control estimator gain perturbations. Taking readers on a guided tour through LSS, the book examines recent trends and approaches and reviews past methods and results from a contemporary perspective. It traces the progre

  18. Substrate-facilitated nanoparticle sintering and component interconnection procedure.

    Science.gov (United States)

    Allen, Mark; Leppäniemi, Jaakko; Vilkman, Marja; Alastalo, Ari; Mattila, Tomi

    2010-11-26

    Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.

  19. Novel Composite Materials for SOFC Cathode-Interconnect Contact

    Energy Technology Data Exchange (ETDEWEB)

    J. H. Zhu

    2009-07-31

    This report summarized the research efforts and major conclusions of our University Coal Research Project, which focused on developing a new class of electrically-conductive, Cr-blocking, damage-tolerant Ag-perovksite composite materials for the cathode-interconnect contact of intermediate-temperature solid oxide fuel cell (SOFC) stacks. The Ag evaporation rate increased linearly with air flow rate initially and became constant for the air flow rate {ge} {approx} 1.0 cm {center_dot} s{sup -1}. An activation energy of 280 KJ.mol{sup -1} was obtained for Ag evaporation in both air and Ar+5%H{sub 2}+3%H{sub 2}O. The exposure environment had no measurable influence on the Ag evaporation rate as well as its dependence on the gas flow rate, while different surface morphological features were developed after thermal exposure in the oxidizing and reducing environments. Pure Ag is too volatile at the SOFC operating temperature and its evaporation rate needs to be reduced to facilitate its application as the cathode-interconnect contact. Based on extensive evaporation testing, it was found that none of the alloying additions reduced the evaporation rate of Ag over the long-term exposure, except the noble metals Au, Pt, and Pd; however, these noble elements are too expensive to justify their practical use in contact materials. Furthermore, the addition of La{sub 0.8}Sr{sub 0.2}MnO{sub 3} (LSM) into Ag to form a composite material also did not significantly modify the Ag evaporation rate. The Ag-perovskite composites with the perovskite being either (La{sub 0.6}Sr{sub 0.4})(Co{sub 0.8}Fe{sub 0.2})O{sub 3} (LSCF) or LSM were systematically evaluated as the contact material between the ferritic interconnect alloy Crofer 22 APU and the LSM cathode. The area specific resistances (ASRs) of the test specimens were shown to be highly dependent on the volume percentage and the type of the perovskite present in the composite contact material as well as the amount of thermal cycling

  20. Shield Insertion to Minimize Noise Amplitude in Global Interconnects

    Directory of Open Access Journals (Sweden)

    Kalpana.A.B

    2012-09-01

    Full Text Available Shield insertion is an effective technique for minimise crosstalk noise and signal delay uncertainty .To reduce the effects of coupling uniform or simultaneous shielding may be used on either or both sides of a signal line. Shields are ground or power lines placed between two signal wires to prevent direct coupling between them as the shield width increases, the noise amplitude decreases, in this paper inserting a shield line between two coupled interconnects is shown to be more effective in reducing crosstalk noise for different technology nodes .