WorldWideScience

Sample records for phase sintered solders

  1. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  2. Liquid phase sintered superconducting cermet

    International Nuclear Information System (INIS)

    Ray, S.P.

    1990-01-01

    This patent describes a method of making a superconducting cermet having superconducting properties with improved bulk density, low porosity and in situ stabilization. It comprises: forming a structure of a superconducting ceramic material having the formula RM 2 Cu 3 O (6.5 + x) wherein R is one or more rare earth elements capable of reacting to form a superconducting ceramic, M is one or more alkaline earth metal elements selected from barium and strontium capable of reacting to form a superconducting ceramic, x is greater than 0 and less than 0.5; and a precious metal compound in solid form selected from the class consisting of oxides, sulfides and halides of silver; and liquid phase sintering the mixture at a temperature wherein the precious metal of the precious metal compound is molten and below the melting point of the ceramic material. The liquid phase sintering is carried out for a time less than 36 hours but sufficient to improve the bulk density of the cermet

  3. Glass phase expelling during liquid phase sintering of YSZ

    International Nuclear Information System (INIS)

    Souza, Milton Ferreira de; Souza, Dulcina Pinatti Ferreira de

    1998-01-01

    Expelling of the liquid phase during sintering of Zr O 2 -6.5 mol % Y 2 O 3 - 0.5 mol % Pr 2 O 3 ceramic was observed as a result of grain coarsening. ZrO 2 - 7.0 mol % Y 2 O 3 samples, without Pr 2 O 3 addition, do not show this effect under the same sintering conditions. The expelling process is caused by surface tension forces and attracting van der Waals forces between the grains, coupled with the existence of two glass phases on the grain boundaries. The amount of expelled glass phase increases with grain growth, but saturates above 16 μm average grain size. (author)

  4. Preliminary investigation of liquid phase sintering in ferrous systems

    International Nuclear Information System (INIS)

    Klein, J.

    1975-04-01

    Liquid phase sintering was utilized to achieve, by a simple compaction and sintering procedure involving short times and moderate temperatures, a virtually full dense high carbon Fe:C alloy and high boron Fe:B alloy. Parameters such as powder characteristics and mixing, compacting pressure, heating program and the liquid phase fraction were found to influence the sintered density. The response of the Fe:C alloy to a heat treatment is reported along with preliminary experiments in the iron base ternary system Fe:W:C. Residual porosities observed in microstructures of certain liquid phase sintered compacts were accounted for by a proposed capillary flow of the liquid phase and a local densification competing against an overall densification. Some general recommendations are made for liquid phase sintering of powder aggregates. 15 fig., 7 tables

  5. Sintering, microstructural and dilatometric studies of combustion synthesized Synroc phases

    International Nuclear Information System (INIS)

    Muthuraman, M.; Patil, K.C.; Senbagaraman, S.; Umarji, A.M.

    1996-01-01

    Sintering, microstructure, and linear thermal expansion properties of Synroc-B and constituent phases, viz. perovskite CaTiO 3 , zirconolite ZrTi 2 O 7 , hollandite (ideal formula BaAl2Ti 6 O 16 ) have been investigated. Synroc-B powder when pelletized and sintered at 1250 C for 2 h achieved >95% theoretical density. Sintered Synroc-B has a linear thermal expansion coefficient α of 8.72 x 10 -6 K -1 and Vicker's microhardness 9.88 GPa. The linear thermal expansion curves did not show any hysteresis indicating the absence of microcracking in the sintered bodies

  6. Powder metallurgy: Solid and liquid phase sintering of copper

    Science.gov (United States)

    Sheldon, Rex; Weiser, Martin W.

    1993-01-01

    Basic powder metallurgy (P/M) principles and techniques are presented in this laboratory experiment. A copper based system is used since it is relatively easy to work with and is commercially important. In addition to standard solid state sintering, small quantities of low melting metals such as tin, zinc, lead, and aluminum can be added to demonstrate liquid phase sintering and alloy formation. The Taguchi Method of experimental design was used to study the effect of particle size, pressing force, sintering temperature, and sintering time. These parameters can be easily changed to incorporate liquid phase sintering effects and some guidelines for such substitutions are presented. The experiment is typically carried out over a period of three weeks.

  7. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  8. Liquid Phase Sintering of Highly Alloyed Stainless Steel

    DEFF Research Database (Denmark)

    Mathiesen, Troels

    1996-01-01

    Liquid phase sintering of stainless steel is usually applied to improve corrosion resistance by obtaining a material without an open pore system. The dense structure normally also give a higher strength when compared to conventional sintered steel. Liquid phase sintrering based on addition...... of boride to AISI 316L type steels have previously been studied, but were found to be sensitive to intergranular corrosion due to formation of intermetallic phases rich in chromium and molybdenum. In order to improve this system further, new investigations have focused on the use of higher alloyed stainless...... steel as base material. The stainless base powders were added different amounts and types of boride and sintered in hydrogen at different temperatures and times in a laboratory furnace. During sintering the outlet gas was analyzed and subsequently related to the obtained microstructure. Thermodynamic...

  9. Sintering prevention and phase transformation of FePt nanoparticles

    International Nuclear Information System (INIS)

    Ding, Y.; Majetich, S.A.; Kim, J.; Barmak, K.; Rollins, H.; Sides, P.

    2004-01-01

    Two approaches attempted to overcome FePt nanoparticle sintering during the transformation to the high coercivity L1 0 phase, which currently limits the use of these nanoparticles in data storage media. High-pressure treatment of dilute nanoparticle solutions failed to prevent sintering due to surfactant decomposition above 360 deg. C. By pre-annealing nanoparticle monolayers to decompose the surfactant, and then coating with an immiscible SiO 2 matrix, sintering was prevented with annealing temperatures up to 700 deg. C

  10. 2D phase field modeling of sintering of silver nanoparticles

    NARCIS (Netherlands)

    Chockalingam, K.; Kouznetsova, V.; van der Sluis, O.; Geers, M.G.D.

    2016-01-01

    The sintering mechanism of silver nanoparticles is modelled by incorporating surface, volume and grain boundary diffusion in a phase field model. A direction-dependent tensorial mobility formulation is adopted, capturing the fact that diffusion mainly occurs along the directions tangential to the

  11. Preparation and sintering of Zr(C,N,O) phases

    International Nuclear Information System (INIS)

    Tamborenea, S.; Mazzoni, A.D.; Aglietti, E.F.

    2003-01-01

    The Zr(C,O,N) compounds form a great mono-phase zone belonging to the pseudoternary ZrO-ZrN-ZrC system.Theses phases have cubic crystalline structure with a o parameter depending on the C, O 2 and N 2 content.These phases have many potential applications in the manufacture of ceramic pieces utilizable as electronic conductors.The Zr (C,O,N) phases can be obtained from ZrO 2 by carbonitriding reactions: that is carbothermal reduction and simultaneous nitriding.In this work a series of experiences of carbonitriding of zirconia under different conditions (temperatures between 1400 and 1600degC, times of 120 min, carbon content between 20 and 40%) in order to obtain suitable powders to be sintered.The XRD analysis shows the Zr(C,O,N) as the main products and β -ZrON as the only secondary product in proportions depending on the obtaining conditions.The variables employed were the C content and the reaction temperature.The Zr(C,O,N) content varies between 40 and 90% and tends to increase with the temperature and the carbon content whereas the β -ZrON phase varies between the 40 and 10 % decreasing its proportion with temperature and the carbon content.The oxidation resistance of these phases was studied by DTA-TG tests in air.Results show complete oxidation reaction at ∼500degC in air.The sintering of these materials was made on disks obtained by pressing of powders of Zr(C,N,O) contents higher than 90%.Sintering was performed in nitrogen atmosphere and temperatures between 1450 and 1620degC.Disks were characterized by pycnometry and Hg volumeter.The densities obtained were between 5 and 6,6g/cm 3 with a tendency to increase with the Zr(C,N,O) phase content, the temperature and the sintering time.Sintered disks were characterized by dilatometry in N 2

  12. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  13. Effect Of Compaction Pressure And Sintering Temperature On The Liquid Phase Sintering Behavior Of Al-Cu-Zn Alloy

    Directory of Open Access Journals (Sweden)

    Lee S.H.

    2015-06-01

    Full Text Available The liquid phase sintering characteristics of Al-Cu-Zn alloy were investigated with respect to various powder metallurgy processing conditions. Powders of each alloying elements were blended to form Al-6Cu-5Zn composition and compacted with pressures of 200, 400, and 600 MPa. The sintering process was performed at various temperatures of 410, 560, and 615°C in N2 gas atmosphere. Density and micro-Vickers hardness measurements were conducted at different processing stages, and transverse rupture strength of sintered materials was examined for each condition, respectively. The microstructure was characterized using optical microscope and scanning electron microscopy. The effect of Zn addition on the liquid phase sintering behavior during P/M process of the Al-Cu-Zn alloy was also discussed in detail.

  14. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  15. Progress in Dual (Piezoelectric-Magnetostrictive Phase Magnetoelectric Sintered Composites

    Directory of Open Access Journals (Sweden)

    Rashed Adnan Islam

    2012-01-01

    Full Text Available The primary aims of this review article are (a to develop the fundamental understanding of ME behavior in perovskite piezoelectric-spinel magnetostrictive composite systems, (b to identify the role of composition, microstructural variables, phase transformations, composite geometry, and postsintering heat treatment on ME coefficient, and (c to synthesize, characterize, and utilize the high ME coefficient composite. The desired range of ME coefficient in the sintered composite is 0.5–1 V/cm⋅Oe. The studies showed that the soft piezoelectric phase quantified by smaller elastic modulus, large grain size of piezoelectric phase (~1 μm, and layered structures yields higher magnitude of ME coefficient. It is also found that postsintering thermal treatment such as annealing and aging alters the magnitude of magnetization providing an increase in the magnitude of ME coefficient. A trilayer composite was synthesized using pressure-assisted sintering with soft phase [0.9 PZT–0.1 PZN] having grain size larger than 1 μm and soft ferromagnetic phase of composition Ni0.8Cu0.2Zn0.2Fe2O4 [NCZF]. The composite showed a high ME coefficient of 412 and 494 mV/cm⋅Oe after sintering and annealing, respectively. Optimized ferrite to PZT thickness ratio was found to be 5.33, providing ME coefficient of 525 mV/cm⋅Oe. The ME coefficient exhibited orientation dependence with respect to applied magnetic field. Multilayering the PZT layer increased the magnitude of ME coefficient to 782 mV/cm⋅Oe. Piezoelectric grain texturing and nanoparticulate assembly techniques were incorporated with the layered geometry. It was found that with moderate texturing, d33 and ME coefficient reached up to 325 pC/N and 878 mV/cm⋅Oe, respectively. Nanoparticulate core shell assembly shows the promise for achieving large ME coefficient in the sintered composites. A systematic relationship between composition, microstructure, geometry, and properties is

  16. Phase characterisation in spark plasma sintered TiPt alloy

    CSIR Research Space (South Africa)

    Chikosha, S

    2011-12-01

    Full Text Available stream_source_info chikosha_2011.pdf.txt stream_content_type text/plain stream_size 4354 Content-Encoding UTF-8 stream_name chikosha_2011.pdf.txt Content-Type text/plain; charset=UTF-8 PHASE CHARACTERISATION IN SPARK... to form “necks”  Radiant Joule heat and pressure drives “neck” growth and material transfer © CSIR 2006 www.csir.co.za Page 6 Objective  Produce TiPt alloy compacts by Spark plasma sintering (SPS) of equiatomic...

  17. Microstructure Evolution and Mechanical Properties Improvement in Liquid-Phase-Sintered Hydroxyapatite by Laser Sintering

    Directory of Open Access Journals (Sweden)

    Songlin Duan

    2015-03-01

    Full Text Available CaO-Al2O3-SiO2 (CAS as a liquid phase was introduced into hydroxyapatite (HAp to prepare bone scaffolds. The effects of the CAS content (1, 2, 3, 4 and 5 wt% on microstructure and mechanical properties of HAp ceramics were investigated. The optimal compression strength, fracture toughness and Vickers hardness reached 22.22 MPa, 1.68 MPa·m1/2 and 4.47 GPa when 3 wt% CAS was added, which were increased by 105%, 63% and 11% compared with those of HAp ceramics without CAS, respectively. The improvement of the mechanical properties was attributed to the improved densification, which was caused by the solid particle to rearrange during liquid phase sintering. Moreover, simulated body fluid (SBF study indicated the HAp ceramics could maintain the mechanical properties and form a bone-like apatite layer when they were immersed in SBF. Cell culture was used to evaluate biocompatibility of the HAp ceramics. The results demonstrated MG-63 cells adhered and spread well.

  18. The Effects of Solid Phase Additives on Sintering Properties of Alumina Bioceramic

    Institute of Scientific and Technical Information of China (English)

    WANG Xin-yu; LI Shi-pu; HE Jian-hua; JIANG Xin; LI Jian-hua

    2003-01-01

    In order to reduce the sintering temperature and improve the preparing conditions of alumina bioceramics,the Mg-Zr-Y composite solid phase additives were added into high purity Al2O3 micro-powder by chemical coprecipitation method.The powder was shaped under 200MPa cold isostatic pressure,and then the biscuits were sintered at 1600℃ under normal pressure.The sintered alumina materials were tested and the sintering mechanism was discussed.The results show that physical properties of the material were improved comparatively.The Mg-Zr-Y composite solid additives could promote the sintering of alumina bioceramics and the mechanism is solid phase sintering.

  19. Maps of Fe-Al phases formation kinetics parameters during isothermal sintering

    Energy Technology Data Exchange (ETDEWEB)

    Pochec, Ewelina, E-mail: epochec@wat.edu.pl [Department of Advanced Materials and Technology, Military University of Technology (Poland); Jozwiak, Stanislaw; Karczewski, Krzysztof; Bojar, Zbigniew [Department of Advanced Materials and Technology, Military University of Technology (Poland)

    2012-10-10

    Highlights: Black-Right-Pointing-Pointer The sintering temperature and compaction pressure have a strong influence on the sinters structure. Black-Right-Pointing-Pointer The measurements confirmed the presence of the high-aluminium phases from Fe-Al equilibrium system in tested sinters. Black-Right-Pointing-Pointer The kinetics of Fe-Al phase formation can be described by Johnson-Mehl-Avrami modelling. - Abstract: The influence of technological parameters (compaction pressure and sintering temperature) on Fe-Al phase formation was investigated. The kinetics of phase transformation preceding and during an SHS reaction was studied in isothermal conditions by DSC using the JMA (Johnson-Mehl-Avrami) model. This model allowed us to determine basic kinetic parameters, including the Avrami exponent, which characterises the rate and manner of particular phase nucleation. The activation energy (E{sub a}) of particular phase formation was determined by the Kissinger method. XRD analysis and SEM observations of sintered material showed that not only Fe{sub 2}Al{sub 5} phase and low-aluminium solid solution in iron but also aluminium-rich FeAl{sub 2} and FeAl{sub 3} phases are formed during the sintering of an FeAl50 elementary powder mixture in isothermal conditions with an SHS reaction. The above conclusions were confirmed by iron-based solid solution lattice parameter studies and microhardness measurements.

  20. Liquid phase sintered SiC. Processing and transformation controlled microstructure tailoring

    Directory of Open Access Journals (Sweden)

    V.A. Izhevskyi

    2000-10-01

    Full Text Available Microstructure development and phase formation processes during sintering of silicon carbide based materials with AlN-Y2O3, AlN-Yb2O3, and AlN-La2O3 sintering additives were investigated. Densification of the materials occurred by liquid-phase sintering mechanism. Proportion of alpha- and beta-SiC powders in the initial mixtures was a variable parameter, while the molar ratio of AlN/RE2O3, and the total amount of additives (10 vol. % were kept constant. Shrinkage behavior during sintering in interrelation with the starting composition of the material and the sintering atmosphere was investigated by high temperature dilatometry. Kinetics of b-SiC to a-SiC phase transformation during post-sintering heat treatment at temperatures 1900-1950 °C was studied, the degree of phase transformation being determined by quantitative x-ray analysis using internal standard technique. Evolution of microstructure resulting from beta-SiC to alpha-SiC transformation was followed up by scanning electron microscopy on polished and chemically etched samples. Transformation-controlled grain growth mechanism similar to the one observed for silicon nitride based ceramics was established. Possibility of in-situ platelet reinforced dense SiC-based ceramics fabrication with improved mechanical properties by means of sintering was shown.

  1. Sintering of YBaCu0, implications of the phase diagram

    International Nuclear Information System (INIS)

    Gervais, M.; Douy, A.; Dubois, B.; Coutures, J.P.; Odier, P.

    1989-01-01

    The motivations of this experimental work are to underline the implications between the phases diagram constitution and the sintering of YBaCu0 superconductors. This preliminary work is focussed on the solid → liquid transformations of this system, in the vicinity of the (123) phase. Two transformations are observed at 915 and 935 0 C depending of the composition of the compound. They both have an important role on the sintering process and the chemical homogeneity of the ceramic. No such transformations seems to occur in the domain (123)-(211)-BaCu0 2 , the sintered sample has therefore a better chemical homogeneity [fr

  2. Microstructural anomalies in a W-Ni alloy liquid phase sintered under microgravity conditions

    International Nuclear Information System (INIS)

    Liu, Y.; Iacocca, R.G.; Johnson, J.L.; German, R.M.; Kohara, Shiro

    1995-01-01

    The gravitational role in liquid phase sintering (LPS) is a problem of great interest in both materials science and engineering practice. Gravity-induced microstructural gradients in grain size, grain shape, and solid volume fraction have been well documented in liquid phase sintered tungsten heavy alloys and have been analyzed by a number of theoretical models. However, gravity may have many unknown effects on LPS, which can only be revealed by experiments conducted under microgravity conditions

  3. Liquid Phase Sintering of (Ti,Zr)C with WC-Co.

    Science.gov (United States)

    Ma, Taoran; Borrajo-Pelaez, Rafael; Hedström, Peter; Blomqvist, Andreas; Borgh, Ida; Norgren, Susanne; Odqvist, Joakim

    2017-01-11

    (Ti,Zr)C powder was sintered with WC-Co following an industrial process, including an isotherm at 1410 °C. A series of interrupted sintering trials was performed with the aim of studying the sintering behavior and the microstructural evolution during both solid-state and liquid-state sintering. Reference samples, using the same elemental compositions but with the starting components TiC and ZrC instead of (Ti,Zr)C, were also sintered. The microstructure was investigated using scanning electron microscopy and energy dispersive X-ray spectroscopy. It is found that the (Ti,Zr)C phase decomposes into Ti-rich and Zr-rich nano-scale lamellae before the liquid-state of the sintering initiates. The final microstructure consists of the binder and WC as well as two different γ phases, rich in either Ti (γ₁) or Zr (γ₂). The γ₂ phase grains have a core-shell structure with a (Ti,Zr)C core following the full sintering cycle. The major differences observed in (Ti,Zr)C with respect to the reference samples after the full sintering cycle were the referred core-shell structure and the carbide grain sizes; additionally, the microstructural evolution during sintering differs. The grain size of carbides (WC, γ₁, and γ₂) is about 10% smaller in WC-(Ti,Zr)C-Co than WC-TiC-ZrC-Co. The shrinkage behavior and hardness of both composites are reported and discussed.

  4. Liquid Phase Sintering of (Ti,ZrC with WC-Co

    Directory of Open Access Journals (Sweden)

    Taoran Ma

    2017-01-01

    Full Text Available (Ti,ZrC powder was sintered with WC-Co following an industrial process, including an isotherm at 1410 °C. A series of interrupted sintering trials was performed with the aim of studying the sintering behavior and the microstructural evolution during both solid-state and liquid-state sintering. Reference samples, using the same elemental compositions but with the starting components TiC and ZrC instead of (Ti,ZrC, were also sintered. The microstructure was investigated using scanning electron microscopy and energy dispersive X-ray spectroscopy. It is found that the (Ti,ZrC phase decomposes into Ti-rich and Zr-rich nano-scale lamellae before the liquid-state of the sintering initiates. The final microstructure consists of the binder and WC as well as two different γ phases, rich in either Ti (γ1 or Zr (γ2. The γ2 phase grains have a core-shell structure with a (Ti,ZrC core following the full sintering cycle. The major differences observed in (Ti,ZrC with respect to the reference samples after the full sintering cycle were the referred core-shell structure and the carbide grain sizes; additionally, the microstructural evolution during sintering differs. The grain size of carbides (WC, γ1, and γ2 is about 10% smaller in WC-(Ti,ZrC-Co than WC-TiC-ZrC-Co. The shrinkage behavior and hardness of both composites are reported and discussed.

  5. Growth kinetics of the intermetallic phase in diffusion-soldered (Cu-5 at.%Ni)/Sn/(Cu-5 at.%Ni) interconnections

    NARCIS (Netherlands)

    Wierzbicka-Miernik, A.; Miernik, K.; Wojewoda-Budka, J.; Szyszkiewicz, K.; Filipek, R.; Litynska-Dobrzynska, L.; Kodentsov, A.; Zieba, P.

    2013-01-01

    A stereological analysis was carried out in order to obtain the kinetics parameters of the (Cu1-xNix)6Sn5 growth in the diffusion soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections where previously anomalous fast growth of this phase was described. The n-parameter in the equation x = ktn was

  6. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

    International Nuclear Information System (INIS)

    Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

    2011-01-01

    Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

  7. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  8. Phase and microstructural characterization of Mo–Si–B multiphase intermetallic alloys produced by pressureless sintering

    International Nuclear Information System (INIS)

    Taleghani, P.R.; Bakhshi, S.R.; Borhani, G.H.; Erfanmanesh, M.

    2014-01-01

    Highlights: • Active and ultra-fine Mo–Si–B powders were produced by mechanical alloying. • The phases of MoSi 2 and MoB were obtained by sintering Mo–57Si–10B at 1400 °C for 2 h. • Composite based on MoB/MoSi 2 was obtained by sintering Mo–47Si–23B at 1300 °C for 3 h. • High content of MoB in the composite based on MoB/MoSi 2 increased density. • High hardness of the composite based on MoB/MoSi 2 is related to MoB matrix. -- Abstract: In this study Mo–47Si–23B and Mo–57Si–10B powders (at.%) was milled for 20 h in attritor ball mill with a rotational speed of 365 rpm and the ball/powder mass ratio 20/1. After degassing of As-mechanically alloyed powders at 450 °C, the powders were pressed into cylindrical samples with 25 mm diameter under 600 MPa pressure. The samples were sintered by using of a tube resistance furnace under Ar atmosphere. Phase and microstructure characteristic of mechanically alloyed powders and sintered samples, were investigated by scanning electron microscopy, X-ray diffraction and energy dispersive spectroscopy. Also hardness test was performed. Homogeneous distribution of active and ultra-fine powders were obtained after milling for 20 h. Mo–57Si–10B alloy with MoB and MoSi 2 dominant phases was produced by sintering at 1400 °C for 2 h. Dominant phases similar to Mo–57Si–10B alloy sintered at 1400 °C for 2 h could be synthesized in Mo–47Si–23B alloy after sintering at 1300 °C for 3 h, but volume fraction of MoB phase was different. The Mo–47Si–23B alloy contained a higher phase fraction of MoB compound as compared to Mo–57Si–10B alloy. Very high density in Mo–47Si–23B alloys was obtained, due to the presence of high volume fraction of MoB phase. Formation heat of MoB acted as a positive potential to increase driving force of sintering and consequently bulk density. Finally, a uniform and fine distribution of MoSi 2 particles in MoB continuous matrix in the microstructure of Mo-47Si

  9. Formation and properties of two-phase bulk metallic glasses by spark plasma sintering

    Energy Technology Data Exchange (ETDEWEB)

    Xie Guoqiang, E-mail: xiegq@imr.tohoku.ac.jp [Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577 (Japan); Louzguine-Luzgin, D.V. [WPI Advanced Institute for Materials Research, Tohoku University, Sendai 980-8577 (Japan); Inoue, Akihisa [Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577 (Japan); WPI Advanced Institute for Materials Research, Tohoku University, Sendai 980-8577 (Japan)

    2011-06-15

    Research highlights: > Two-phase bulk metallic glasses with high strength and good soft magnetic properties as well as satisfying large-size requirements were produced by spark plasma sintering. > Effects of sintering temperature on thermal stability, microstructure, mechanical and magnetic properties were investigated. > Densified samples were obtained by the spark plasma sintering at above 773 K. - Abstract: Using a mixture of the gas-atomized Ni{sub 52.5}Nb{sub 10}Zr{sub 15}Ti{sub 15}Pt{sub 7.5} and Fe{sub 73}Si{sub 7}B{sub 17}Nb{sub 3} glassy alloy powders, we produced the two-phase bulk metallic glass (BMG) with high strength and good soft magnetic properties as well as satisfying large-size requirements by the spark plasma sintering (SPS) process. Two kinds of glassy particulates were homogeneously dispersed each other. With an increase in sintering temperature, density of the produced samples increased, and densified samples were obtained by the SPS process at above 773 K. Good bonding state among the Ni- and Fe-based glassy particulates was achieved.

  10. Mineral Phases and Release Behaviors of As in the Process of Sintering Residues Containing As at High Temperature

    Directory of Open Access Journals (Sweden)

    Xingrun Wang

    2014-01-01

    Full Text Available To investigate the effect of sintering temperature and sintering time on arsenic volatility and arsenic leaching in the sinter, we carried out experimental works and studied the structural changes of mineral phases and microstructure observation of the sinter at different sintering temperatures. Raw materials were shaped under the pressure of 10 MPa and sintered at 1000~1350°C for 45 min with air flow rate of 2000 mL/min. The results showed that different sintering temperatures and different sintering times had little impact on the volatilization of arsenic, and the arsenic fixed rate remained above 90%; however, both factors greatly influenced the leaching concentration of arsenic. Considering the product’s environmental safety, the best sintering temperature was 1200°C and the best sintering time was 45 min. When sintering temperature was lower than 1000°C, FeAsS was oxidized into calcium, aluminum, and iron arsenide, mainly Ca3(AsO42 and AlAsO4, and the arsenic leaching was high. When it increased to 1200°C, arsenic was surrounded by a glass matrix and became chemically bonded inside the matrix, which lead to significantly lower arsenic leaching.

  11. Fe-Zn intermetallic phases prepared by diffusion annealing and spark-plasma sintering

    Czech Academy of Sciences Publication Activity Database

    Pokorný, P.; Cinert, Jakub; Pala, Zdeněk

    2016-01-01

    Roč. 50, č. 2 (2016), s. 253-256 ISSN 1580-2949 R&D Projects: GA ČR GB14-36566G Institutional support: RVO:61389021 Keywords : Fe-Zn intermetallics * spark-plasma sintering * diffusion annealing * phase composition * hardness Subject RIV: JK - Corrosion ; Surface Treatment of Materials Impact factor: 0.436, year: 2016

  12. X-ray powder diffraction analysis of liquid-phase-sintered silicon carbide ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Ortiz, A.L.; Sanchez-Bajo, F. [Universidad de Extremadura, Badajoz (Spain). Dept. de Electronica e Ingenieria Electromecanica; Cumbrera, F.L. [Universidad de Extremadura, Badajoz (Spain). Dept. de Fisica

    2002-07-01

    In an attempt to gain a comprehensive understanding of the microstructural evolution in liquid-phase-sintered silicon carbide ceramics, the effect of the starting {beta}-SiC powder has been studied. Pellets of two different {beta}-SiC starting powders were sintered with simultaneous additions of Al{sub 2}O{sub 3} and Y{sub 2}O{sub 3} at 1950 C for 1 hour in flowing argon atmosphere. Here we have used X-ray diffraction to obtain the relative abundance of the resulting SiC polytypes after sintering. The significant influence of the defects concentration on the {beta} to {alpha} transformation rate has been determined using the Rietveld method. (orig.)

  13. Enhanced Densification of PM Steels by Liquid Phase Sintering with Boron-Containing Master Alloy

    Science.gov (United States)

    Vattur Sundaram, Maheswaran; Surreddi, Kumar Babu; Hryha, Eduard; Veiga, Angela; Berg, Sigurd; Castro, Fransisco; Nyborg, Lars

    2018-01-01

    Reaching high density in PM steels is important for high-performance applications. In this study, liquid phase sintering of PM steels by adding gas-atomized Ni-Mn-B master alloy was investigated for enhancing the density levels of Fe- and Mo- prealloyed steel powder compacts. The results indicated that liquid formation occurs in two stages, beginning with the master alloy melting (LP-1) below and eutectic phase formation (LP-2) above 1373 K (1100 °C). Mo and C addition revealed a significant influence on the LP-2 temperatures and hence on the final densification behavior and mechanical properties. Microstructural embrittlement occurs with the formation of continuous boride networks along the grain boundaries, and its severity increases with carbon addition, especially for 2.5 wt pct of master alloy content. Sintering behavior, along with liquid generation, microstructural characteristics, and mechanical testing revealed that the reduced master alloy content from 2.5 to 1.5 wt pct (reaching overall boron content from 0.2 to 0.12 wt pct) was necessary for obtaining good ductility with better mechanical properties. Sintering with Ni-Mn-B master alloy enables the sintering activation by liquid phase formation in two stages to attain high density in PM steels suitable for high-performance applications.

  14. Shape distortion and dimensional precision in tungsten heavy alloy liquid phase sintering

    International Nuclear Information System (INIS)

    Wuwen Yi; German, R.M.; Lu, P.K.

    2001-01-01

    Microstructure effects on densification and shape distortion in liquid phase sintering of tungsten heavy alloy were investigated. Microstructure parameters such as the solid volume fraction, dihedral angle, initial porosity, and pore size were varied to measure densification and distortion behavior during LPS using W-Ni-Cu alloys. Green compacts were formed using ethylene-bis-stearamide as a pore-forming agent with the amount of polymer controlling the initial porosity. Different initial pore sizes were generated by varying the polymer particle size. Dihedral angle was varied by changing the Ni:Cu ratio in the alloys. Finally, the solid volume fraction was adjusted via the tungsten content. Distortion was quantified using profiles determined with a coordinate measuring machine to calculate a distortion parameter. Sintering results showed that solid volume fraction and dihedral angle are the dominant factors on densification and distortion during liquid phase sintering. Distortion decreases with increasing solid volume fraction and dihedral angle, while initial porosity and pore size have no observable effect on distortion at nearly full densification. Various strategies emerge to improve distortion control in liquid phase sintering. (author)

  15. The mechanism of hard metal TiC-TiNi composite liquid-phase sintering

    International Nuclear Information System (INIS)

    Akimov, V.V.

    2006-01-01

    The sintering conditions are investigated for hard alloys on their production from powders of titanium nickelide with particle size of 10-25 μ and titanium carbide with particles of 5-10 μ at temperatures of 1280-1350 deg C under pressure of 0.1 MPa with holding at heat for 180-900 s. The analysis of experimental data shows that optimum sintering conditions are determined by the quantity of a binding phase TiNi. In the systems with a binding phase content no more than 40 % a heterogeneous structure with nonuniform aggregates of TiC and TiNi phases is observed. With increasing a binding phase amount up to 50-70 % and a temperature up to 1350 deg C, titanium nickelide melts and spreads uniformly among carbide grains. This results in a low porosity of the composite material and in an increase of thermodynamic stability of the system [ru

  16. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  17. Room-temperature saturated ferroelectric polarization in BiFeO3 ceramics synthesized by rapid liquid phase sintering

    International Nuclear Information System (INIS)

    Wang, Y.P.; Zhou, L.; Zhang, M.F.; Chen, X.Y.; Liu, J.-M.; Liu, Z.G.

    2004-01-01

    Single-phased ferroelectromagnet BiFeO 3 ceramics with high resistivity were synthesized by a rapid liquid phase sintering technique. Saturated ferroelectric hysteresis loops were observed at room temperature in the ceramics sintered at 880 deg. C for 450 s. The spontaneous polarization, remnant polarization, and the coercive field are 8.9 μC/cm 2 , 4.0 μC/cm 2 , and 39 kV/cm, respectively, under an applied field of 100 kV/cm. It is proposed that the formation of Fe 2+ and an oxygen deficiency leading to the higher leakage can be greatly suppressed by the very high heating rate, short sintering period, and liquid phase sintering technique. The latter was also found effective in increasing the density of the ceramics. The sintering technique developed in this work is expected to be useful in synthesizing other ceramics from multivalent or volatile starting materials

  18. Effect of the sintering temperature and time on phase assemblage and electrical conductivity of zirconia-scandia-ceria

    International Nuclear Information System (INIS)

    Grosso, R.L.; Muccillo, E.N.S.

    2012-01-01

    ZrO 2 -based solid electrolytes have been extensively studied over the last decades for application in solid oxide fuel cells (SOFCs). Zirconia containing scandia and ceria solid electrolyte is a potential candidate in SOFCs operating at intermediate temperatures (600 - 800 deg C). In this work, commercial ZrO 2 containing 10 mol% Sc 2 O 3 and 1 mol% CeO 2 was sintered by the conventional and two-step methods. Several sintering conditions were evaluated by varying the temperature as well as the residence time. High values of sintered density (> 98%) were obtained. A careful selection of the sintering conditions is necessary in order to obtain a single cubic phase, as revealed by X-ray diffraction results. The grain growth can be controlled in specimens sintered by the two-step method. The electrical conductivity show similar behavior for the grain component independent on the sintering method. (author)

  19. Liquid Phase Sintered Ceramic Bone Scaffolds by Combined Laser and Furnace

    Directory of Open Access Journals (Sweden)

    Pei Feng

    2014-08-01

    Full Text Available Fabrication of mechanically competent bioactive scaffolds is a great challenge in bone tissue engineering. In this paper, β-tricalcium phosphate (β-TCP scaffolds were successfully fabricated by selective laser sintering combined with furnace sintering. Bioglass 45S5 was introduced in the process as liquid phase in order to improve the mechanical and biological properties. The results showed that sintering of β-TCP with the bioglass revealed some features of liquid phase sintering. The optimum amount of 45S5 was 5 wt %. At this point, the scaffolds were densified without defects. The fracture toughness, compressive strength and stiffness were 1.67 MPam1/2, 21.32 MPa and 264.32 MPa, respectively. Bone like apatite layer was formed and the stimulation for apatite formation was increased with increase in 45S5 content after soaking in simulated body fluid, which indicated that 45S5 could improve the bioactivity. Furthermore, MG-63 cells adhered and spread well, and proliferated with increase in the culture time.

  20. Liquid phase sintered ceramic bone scaffolds by combined laser and furnace.

    Science.gov (United States)

    Feng, Pei; Deng, Youwen; Duan, Songlin; Gao, Chengde; Shuai, Cijun; Peng, Shuping

    2014-08-21

    Fabrication of mechanically competent bioactive scaffolds is a great challenge in bone tissue engineering. In this paper, β-tricalcium phosphate (β-TCP) scaffolds were successfully fabricated by selective laser sintering combined with furnace sintering. Bioglass 45S5 was introduced in the process as liquid phase in order to improve the mechanical and biological properties. The results showed that sintering of β-TCP with the bioglass revealed some features of liquid phase sintering. The optimum amount of 45S5 was 5 wt %. At this point, the scaffolds were densified without defects. The fracture toughness, compressive strength and stiffness were 1.67 MPam1/2, 21.32 MPa and 264.32 MPa, respectively. Bone like apatite layer was formed and the stimulation for apatite formation was increased with increase in 45S5 content after soaking in simulated body fluid, which indicated that 45S5 could improve the bioactivity. Furthermore, MG-63 cells adhered and spread well, and proliferated with increase in the culture time.

  1. The Promotion of Liquid Phase Sintering of Boron-Containing Powder Metallurgy Steels by Adding Nickel

    Directory of Open Access Journals (Sweden)

    Wu Ming-Wei

    2015-01-01

    Full Text Available Boron is a feasible alloying element for liquid phase sintering (LPS of powder metallurgy (PM steels. This study investigated the effect of nickel (Ni, which is widely used in PM steels, on the liquid phase sintering of boron-containing PM steels. The results showed that the addition of 1.8wt% Ni does not apparently modify the LPS mechanism of boron-containing PM steels. However, adding 1.8wt% Ni slightly improves the LPS densification from 0.60 g/cm3 to 0.65 g/cm3, though the green density is reduced. Thermodynamic simulation demonstrated that the presence of Ni lowers the temperature region of liquid formation, resulting in enhanced LPS densification. Moreover, original graphite powders remains in the steels sintered at 1200 ºC. These graphite powders mostly dissolve into the base iron powder when the sintering temperature is increased from 1200 ºC to 1250 ºC.

  2. Liquid phase sintering of carbides using a nickel-molybdenum alloy

    International Nuclear Information System (INIS)

    Barranco, J.M.; Warenchak, R.A.

    1987-01-01

    Liquid phase vacuum sintering was used to densify four carbide groups. These were titanium carbide, tungsten carbide, vanadium carbide, and zirconium carbide. The liquid phase consisted of nickel with additions of molybdenum of from 6.25 to 50.0 weight percent at doubling increments. The liquid phase or binder comprised 10, 20, and 40 percent by weight of the pressed powders. The specimens were tested using 3 point bending. Tungsten carbide showed the greatest improvement in bend rupture strength, flexural modulus, fracture energy and hardness using 20 percent binder with lesser amounts of molybdenum (6.25 or 12.5 wt %) added to nickel compared to pure nickel. A refinement in the carbide microstructure and/or a reduction in porosity was seen for both the titanium and tungsten carbides when the alloy binder was used compared to using the nickel alone. Curves depicting the above properties are shown for increasing amounts of molybdenum in nickel for each carbide examined. Loss of binder phase due to evaporation was experienced during heating in vacuum at sintering temperatures. In an effort to reduce porosity, identical specimens were HIP processed at 15 ksi and temperatures averaging 110 C below the sintering g temperature. The tungsten carbide and titanium carbide series containing 80 and 90 weight percent carbide phase respectively showed improvement properties after HIP while properties decreased for most other compositions

  3. Phase transformations in the reaction cell of TiNi-based sintered systems

    Science.gov (United States)

    Artyukhova, Nadezhda; Anikeev, Sergey; Yasenchuk, Yuriy; Chekalkin, Timofey; Gunther, Victor; Kaftaranova, Maria; Kang, Ji-Hoon; Kim, Ji-Soon

    2018-05-01

    The present work addresses the structural-phase state changes of porous TiNi-based compounds fabricated by reaction sintering (RS) of Ti and Ni powders with Co, Mo, and no additives introduced. The study also emphasizes the features of a reaction cell (RC) during the transition from the solid- to liquid-phase sintering. Mechanisms of phase transformations occurring in the solid phase, involving the low-melting Ti2Ni phase within the RC, have been highlighted. Also, the intermediate Ti2Ni phase had a crucial role to provide both the required RS behavior and modified phase composition of RS samples, and besides, it is found to be responsible for the near-equiatomic TiNi saturation of the melt. Both cobalt and molybdenum additives are shown to cause additional structuring of the transition zone (TZ) at the Ti2Ni‑TiNi interface and broadening of this zone. The impact of Co and Mo on the Ti2Ni phase is evident through fissuring of this phase layer, which is referred to solidified stresses increased in the layer due to post-alloying defects in the structure.

  4. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  5. Microstructure and phase stability of W-Cr alloy prepared by spark plasma sintering

    Czech Academy of Sciences Publication Activity Database

    Vilémová, Monika; Illková, Ksenia; Lukáč, František; Matějíček, Jiří; Klečka, Jakub; Leitner, J.

    2018-01-01

    Roč. 127, February (2018), s. 173-178 ISSN 0920-3796 R&D Projects: GA ČR(CZ) GA17-23964S Institutional support: RVO:61389021 Keywords : Tungsten-chromium alloy * Phase stability * Decomposition * Thermal conductivity * Self-passivating alloys * Spark plasma sintering Subject RIV: JJ - Other Materials OBOR OECD: Materials engineering Impact factor: 1.319, year: 2016 https://www.sciencedirect.com/science/article/pii/S092037961830005X

  6. Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Cheng-Xiang [School of Material Science and Engineering, and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin (China); Department of Material Science and Engineering, Virginia Tech (United States); Li, Xin, E-mail: xinli@tju.edu.cn [School of Material Science and Engineering, and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin (China); Lu, Guo-Quan [School of Material Science and Engineering, and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin (China); Department of Material Science and Engineering, Virginia Tech (United States); Mei, Yun-Hui [School of Material Science and Engineering, and Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin (China)

    2016-04-13

    The nanosilver sintering die-attach technique has been a promising alternative for wide band gap semiconductors. However, it is less preferable in industry because of its high sintering temperature. Recently research has been initiated to develop transient liquid phase sintering (TLPS) solder paste for use in electronics packaging. In this article, in order to lower the sintering temperature of nanosilver paste, we develop a novel tin (up to 10 wt%) doped silver paste (TDSP) and a sintering profile with the highest processing temperature of 235 °C based on TLPS. Sintered TDSP is Ag/Ag{sub 3}Sn/Ag–Sn solid solution composites. The composites have a microstructure of Ag matrix grains reinforced by Ag{sub 3}Sn and Ag–Sn solid solution within the matrix grains. And this microstructure endows the sintered Ag+4%Sn with a pressureless bonding strength of 23 MPa. The improved mechanical properties of sintered TDSP are attributed to second-phase strengthening and solid solution strengthening mechanisms. However, the overmuch formation of brittle Ag{sub 3}Sn phase is the main reason resulting in sharp decrease of bonding strength when the Sn content over 5 wt%. The new TDSP technology is expected to be applicable to a wide range of power semiconductors devices, such as organic devices and printed circuit boards. Furthermore, it provides new strategies for low-temperature sintering.

  7. Phase identification and morphology study of hematite (Fe2O3) with sintering time varitions

    Science.gov (United States)

    Yazirin, Cepi; Puspitasari, Poppy; Sasongko, Muhammad Ilman Nur; Tsamroh, Dewi Izzatus; Risdanareni, Puput

    2017-09-01

    Iron oxide has been the interest of many studies due to its applications in various scientific and industrial fields including in environment, corrosion, soil science, and exhaust emissions. Iron oxide (Fe2O3) has potential applications in catalytic reactions in electronic devices such as semiconductors, paint formulations, and lithium rechargeable batteries. Fe2O3 can be synthesized through the process of stirring, decomposition of organic iron, sol-gel, combustion, and evaporating solvents. Most of the methods used involve several steps and take a long time. The aim of this research was to investigate the phase and morphology characterization of iron oxide (Fe2O3) powder with solvent ethylene glycol after being sintered for 1 hour, 2 hours and 3 hours. The characterization tools utilized were XRD, SEM-EDX, and FTIR. The results of XRD analysis showed that the Fe2O3 sintered for 1 hour had the smallest crystallite size with a diameter of 21.05 nm. In the XRD test, the beam of X-ray was shot directly at the grain being tested. The results of SEM analysis showed thatthe Fe2O3 sintered for 1 hour produced the best result due to its crystallite size of 12.36 nm and hada shape of homogeneous nanosphere; the duration of sintering indeed had a great influence on the grain size of iron oxide (Fe2O3). In addition, the results of the elemental composition analysis indicate that the longer the sintering process, the higher the concentration of O but the lower the Fe.

  8. Fabrication of Cr-doped UO2 Fuel Pellet using Liquid Phase Sintering

    International Nuclear Information System (INIS)

    Kim, Dong Joo; Yang, Jae Ho; Kim, Keon Sik; Rhee, Young Woo; Kim, Jong Hun; Oh, Jang Soo; Koo, Yang Hyun

    2013-01-01

    An enhancement of the thermal conductivity of a pellet can be obtained by the addition of a higher thermal conductive material in the pellet. In addition, the resistance to the PCI can be increased through a plasticity increase of the pellet. Thermal conductivity of ceramic materials is generally lower than that of metallic materials. The thermal conductivity of uranium oxide which is a typical ceramic material is low as well. The steep temperature gradient in the fuel pellet results from the low thermal conductivity. Therefore, the thermal conductivity improvement of a nuclear fuel pellet can enhance the fuel performance in various aspects. The lower centerline temperature of a fuel pellet affects the enhancement of fuel safety as well as fuel pellet integrity during nuclear reactor operation. Besides, the nuclear reactor power can be uprated due to the higher safety margin. So, many researches to enhance the thermal conductivity of nuclear fuel pellet have been performed in various ways. To improve the thermal conductivity of UO 2 pellet, an appropriate arrangement of the high thermal conductive material in UO 2 matrix is one of the various methods. We intended to control a placement of chromium as the high thermal conductive material. The metallic chromium and chromium oxide were arranged in a grain boundary of UO 2 using a liquid phase sintering method. The liquid phase sintering of Cr-doped UO 2 pellet could be adjusted using a control of an oxygen potential in sintering atmosphere

  9. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

    Science.gov (United States)

    Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

    2018-04-01

    Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

  10. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  11. Multi-phase EBSD mapping and local texture analysis in NdFeB sintered magnets

    Energy Technology Data Exchange (ETDEWEB)

    Woodcock, T.G., E-mail: t.woodcock@ifw-dresden.de [IFW Dresden, Institute for Metallic Materials, PO Box 270116, 01171 Dresden (Germany); Gutfleisch, O. [IFW Dresden, Institute for Metallic Materials, PO Box 270116, 01171 Dresden (Germany)

    2011-02-15

    A combination of electron backscatter diffraction and energy-dispersive X-ray spectroscopy has been used to identify the crystal structure and composition of all the phases present in commercially available NdFeB sintered magnets and to map their spatial distribution. The Nd{sub 2}Fe{sub 14}B and NdO grains were shown to have low defect densities. The fcc Nd-rich and Nd{sub 2}O{sub 3} grains had intra-grain misorientation angles of up to 14{sup o}, which was shown to be due to defects. Large numbers ({approx}100) of data points for each phase were used to study texture in the NdO, Nd{sub 2}O{sub 3} and Nd{sub 2}Fe{sub 14}B phases. The Nd{sub 2}Fe{sub 14}B grains exhibited a <0 0 1> fibre texture. The Nd oxide phases showed no strong texture, which implied that no strongly preferred orientation relationships between those phases and Nd{sub 2}Fe{sub 14}B exist. The result was shown to be valid for optimally annealed samples exhibiting high coercivity and as-sintered samples exhibiting low coercivity.

  12. Mechanisms and mechanics of shape loss during supersolidus liquid-phase sintering

    Science.gov (United States)

    Lal, Anand

    Rapid sinter densification of relatively coarse prealloyed powders is possible by exceeding the solidus temperature in an approach termed supersolidus liquid phase sintering (SLPS). However, narrow processing windows for densification without distortion often limit this process. The liquid films at the grain boundaries that are responsible for densification also reduce the structural rigidity of components. Hence, components tend to slump under their own weight. Thus, the present study investigates shape loss during SLPS and rationalizes the processing and material factors with regard to separating densification from distortion. Experiments are performed on various prealloyed powders, including bronze, 316L stainless steel, and T15 tool steel. Differential thermal analysis, dilatometry, and in situ video imaging of sintering compacts are used to follow melting, densification, and distortion, respectively. Further, density and dimensional measurements are performed on sintered compacts. Results indicate a dependence of distortion on the sintering temperature and time, compact size, and melting behavior of the alloy. It is shown that the sintering temperature window, where high-density, precise components are obtained, can be widened for 316L stainless steel by boron addition. For the first time, a beam bending technique is used to measure the macroscopic apparent viscosity of semisolid bronze. The viscosity drops with temperature above the solidus and lies in the range of 108 to 106 Pa-s. Additionally, the in situ transverse rupture strength of bronze is measured to demonstrate the softening above the solidus temperature. Further, microstructural measurements are performed to enable correlation with the slumping behavior and viscosity. A model combining the deformation mechanisms, driving forces, and microstructural characteristics is developed to predict the conditions for densification and distortion onset. The microstructure is also correlated with the magnitude

  13. Study of effect of sintering time on the 2223 phase growth Bi-Pb-Sr-Ca-Cu-O superconductor by Rietveld method

    International Nuclear Information System (INIS)

    Parikin; Prasuad, W; Gunawan

    1996-01-01

    It has been reported that the sintering time is as important for the preparation of superconductor as the sintering temperature and method. This paper reports on the finding of the optimum sintering time in the preparation of the 2223 phase bismuth (Bi) superconductor. The samples were synthesized with nominal composition 1.84 : 0.34 : 1.91 : 2.03 : 3.06 from raw materials by solid state reaction and sintered at 860 o C for five days. The resintering were done three times, i.e. 24, 48 and 96 hours. The Rietveld analysis shows that the 2223 phase grows continuously as a function of the sintering time. The highest percentage of the 2223 phase (80.64%) were obtained at 96 hours sintering time. The result suggests that the 2223 phase can be obtained effectively by sintering with sufficiently long time

  14. Mechanical properties of molybdenum alloyed liquid phase-sintered tungsten-based composites

    International Nuclear Information System (INIS)

    Kemp, P.B.; German, R.M.

    1995-01-01

    Tungsten-based composites are fabricated from mixed elemental powders using liquid phase sintering, usually with a nickel-iron matrix. During sintering, the tungsten undergoes grain growth, leading to microstructure coarsening that lowers strength but increases ductility. Often the desire is to increase strength at the sacrifice of ductility, and historically, this has been performed by postsintering deformation. There has been considerable research on alloying to adjust the as-sintered mechanical properties to match those of swaged alloys. Prior reports cover many additions, seemingly including much of the periodic table. Unfortunately, many of the modified alloys proved disappointing, largely due to degraded strength at the tungsten-matrix interface. Of these modified alloys, the molybdenum-containing systems exhibit a promising combination of properties, cost, and processing ease. For example, the 82W-8Mo-7Ni-3Fe alloy gives a yield strength that is 34% higher than the equivalent 90W-7Ni-3Fe alloy (from 535 to 715 MPa) but with a 33% decrease in fracture elongation (from 30 to 20% elongation). This article reports on experiments geared to promoting improved properties in the W-Mo-Ni-Fe alloys. However, unlike the prior research which maintained a constant Ni + Fe content and varied the W:Mo ratio, this study considers the Mo:(Ni + Fe) ratio effect for 82, 90, and 93 wt pct W

  15. Investigation of the sintering of barytocalcite with BaCO{sub 3} as a secondary phase for immobilizing carbon-14

    Energy Technology Data Exchange (ETDEWEB)

    Massoni, Nicolas, E-mail: nicolas.massoni@cea.fr [CEA, DEN, DTCD, SECM, Marcoule, BP17171, F-30207 Bagnols-sur-Cèze (France); Le Gallet, Sophie [Laboratoire Interdisciplinaire Carnot de Bourgogne, UMR 6303 CNRS-Université Bourgogne Franche-Comté, 9 Av. Alain Savary, BP 47870, 21078 Dijon Cedex (France)

    2016-08-01

    The effect of a secondary phase (BaCO{sub 3}) on the sintering of synthetic barytocalcite has been investigated. It was found that this phase impacts the sintering positively by lowering the sintering activation energy from 230 to 160 kJ mol{sup −1}, by increasing the shrinkage rate and by reaching higher densities. However, BaCO{sub 3,} originally dispersed in the powder, was segregated by diffusion during sintering with a large part of it being located at the grain boundaries. The dense pellet is made of both phases barytocalcite and BaCO{sub 3}, what should be avoided to give the best leaching resistance. Thus the BaCO{sub 3} presence should be limited as much as possible by controlling the reactants stoichiometry during the synthesis. - Highlights: • Lowers the sintering activation energy from 230 to 160 kJ mol{sup −1}. • Changes the sintering process from volume diffusion to grain boundary diffusion. • Increases the shrinkage rate and allows to reach higher densities of the pellet.

  16. Contribution to the study of the sintering of ex-carbonyl iron in the α and γ phases using the micro-fractographic technique

    International Nuclear Information System (INIS)

    Oxley Gaborit de Montjou, M.Th.

    1966-01-01

    The micro-fractographic study of the sintering of ex-carbonyl iron has shown or confirmed a number of phenomena of which the principal are as followed: Sintering in the a phase: -) existence of two stages of sintering differentiated by the type of rupture (inter or trans-crystalline); -) marked influence of the content of oxygen in the atmosphere and in the initial compressed sample on the speed of sintering; -) formation of striations on the grain-boundary surfaces and on the inner surface of pores caused by the presence of oxygen. Sintering in the γ phase: -) a pronounced decrease in the speed of sintering: the grains in the initial powder remain in the granular state within the final α crystal in the iron sintered in the lower γ range even after several hours of sintering; -) this granular structure can be eliminated by intermediate compression thus enabling the sintering process to proceed. A considerable decrease in the speed of sintering if the A 3 point is passed one or more times in the α range sintering. A high speed sintering if the treatment in the γ range is carried out at or above 1300 C. The results of this study agree with micrographic investigation as well as with dilatometric measurements and known auto-diffusion coefficients. (author) [fr

  17. Densification and volumetric change during supersolidus liquid phase sintering of prealloyed brass Cu28Zn powder: Modeling and optimization

    Directory of Open Access Journals (Sweden)

    Mohammadzadeh A.

    2014-01-01

    Full Text Available An investigation has been made to use response surface methodology and central composite rotatable design for modeling and optimizing the effect of sintering variables on densification of prealloyed Cu28Zn brass powder during supersolidus liquid phase sintering. The mathematical equations were derived to predict sintered density, densification parameter, porosity percentage and volumetric change of samples using second order regression analysis. As well as the adequacy of models was evaluated by analysis of variance technique at 95% confidence level. Finally, the influence and interaction of sintering variables, on achieving any desired properties was demonstrated graphically in contour and three dimensional plots. In order to better analyze the samples, microstructure evaluation was carried out. It was concluded that response surface methodology based on central composite rotatable design, is an economical way to obtain arbitrary information with performing the fewest number of experiments in a short period of time.

  18. Role of sintering time, crystalline phases and symmetry in the piezoelectric properties of lead-free KNN-modified ceramics

    International Nuclear Information System (INIS)

    Rubio-Marcos, F.; Marchet, P.; Merle-Mejean, T.; Fernandez, J.F.

    2010-01-01

    Lead-free KNN-modified piezoceramics of the system (Li,Na,K)(Nb,Ta,Sb)O 3 were prepared by conventional solid-state sintering. The X-ray diffraction patterns revealed a perovskite phase, together with some minor secondary phase, which was assigned to K 3 LiNb 6 O 17 , tetragonal tungsten-bronze (TTB). A structural evolution toward a pure tetragonal structure with the increasing sintering time was observed, associated with the decrease of TTB phase. A correlation between higher tetragonality and higher piezoelectric response was clearly evidenced. Contrary to the case of the LiTaO 3 modified KNN, very large abnormal grains with TTB structure were not detected. As a consequence, the simultaneous modification by tantalum and antimony seems to induce during sintering a different behaviour from the one of LiTaO 3 modified KNN.

  19. Role of sintering time, crystalline phases and symmetry in the piezoelectric properties of lead-free KNN-modified ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Rubio-Marcos, F., E-mail: frmarcos@icv.csic.es [Electroceramic Department, Instituto de Ceramica y Vidrio, CSIC, Kelsen 5, 28049 Madrid (Spain); Marchet, P.; Merle-Mejean, T. [SPCTS, UMR 6638 CNRS, Universite de Limoges, 123, Av. A. Thomas, 87060 Limoges (France); Fernandez, J.F. [Electroceramic Department, Instituto de Ceramica y Vidrio, CSIC, Kelsen 5, 28049 Madrid (Spain)

    2010-09-01

    Lead-free KNN-modified piezoceramics of the system (Li,Na,K)(Nb,Ta,Sb)O{sub 3} were prepared by conventional solid-state sintering. The X-ray diffraction patterns revealed a perovskite phase, together with some minor secondary phase, which was assigned to K{sub 3}LiNb{sub 6}O{sub 17}, tetragonal tungsten-bronze (TTB). A structural evolution toward a pure tetragonal structure with the increasing sintering time was observed, associated with the decrease of TTB phase. A correlation between higher tetragonality and higher piezoelectric response was clearly evidenced. Contrary to the case of the LiTaO{sub 3} modified KNN, very large abnormal grains with TTB structure were not detected. As a consequence, the simultaneous modification by tantalum and antimony seems to induce during sintering a different behaviour from the one of LiTaO{sub 3} modified KNN.

  20. Phase-Pure of BiFeO3 Ceramic Based on Citric Acid - Assisted Gel by Sintering Time Variation

    Science.gov (United States)

    Suastiyanti, Dwita; Ismojo

    2017-07-01

    Bismuth ferrite powder (BiFeO3/BFO) with high purity was synthesized by sol-gel process. It was used Bi5O(OH)9(NO3)4 and Fe(NO3)3.9H2O as main compound sources. Citric acid (C6H8O7) was used as fuell. As multiferroic material, BFO promises important technological applications in several devices like data strorage, spinotronics, sensor, actuator devices etc. This research would know the optimum process condition of sol-gel process to produce BFO powder by varying of sintering time. The novelty of this research is how to produce BFO in single phase by simple method. It was used calcination condition at 160°C for 4 hours and sintering condition at 600°C with varying of sintering time of 4, 6 and 8 hours. Thermogravimetric Analysis/Differential Thermal Analysis (TGA/DTA), X Ray Diffraction (XRD) and Scanning Electron Microscope (SEM) were used to characterize the powder. Loss of mass and heat flow were seen at TGA/DTA test at 160°C approximately (used as reference of calcination temperature). BFO powder sintered at for 8 hours has no secondary phase, meanwhile for another sintering time (4 and 6 hours) it has Bi2O3 as secondary phase. It is also show at SEM observation result that powder with sintering time of 8 hours has finer grain than of 4 and 6 hours sintering at the same temperature. The grains of BFO powder has heterogenous in size, shape and still agglomerated.

  1. Immobilization of Radioactive Rare Earth oxide Waste by Solid Phase Sintering

    International Nuclear Information System (INIS)

    Ahn, Byung Gil; Park, Hwan Seo; Kim, Hwan Young; Lee, Han Soo; Kim, In Tae

    2010-01-01

    In the pyroprocessing of spent nuclear fuels, LiCl-KCl waste salt containing radioactive rare earth chlorides are generated. The radioactive rare earth oxides are recovered by co-oxidative precipitation of rare earth elements. The powder phase of rare earth oxide waste must be immobilized to produce a monolithic wasteform suitable for storage and ultimate disposal. The immobilization of these waste developed in this study involves a solid state sintering of the waste with host borosilicate glass and zinc titanate based ceramic matrix (ZIT). And the rare-earth monazite which synthesised by reaction of ammonium di-hydrogen phosphate with the rare earth oxides waste, were immobilized with the borosilicate glass. It is shown that the developed ZIT ceramic wasteform is highly resistant the leaching process, high density and thermal conductivity.

  2. Compressive deformation of liquid phase-sintered porous silicon carbide ceramics

    Directory of Open Access Journals (Sweden)

    Taro Shimonosono

    2014-12-01

    Full Text Available Porous silicon carbide ceramics were fabricated by liquid phase sintering with 1 wt% Al2O3–1 wt% Y2O3 additives during hot-pressing at 1400–1900 °C. The longitudinal strain at compressive fracture increased at a higher porosity and was larger than the lateral strain. The compressive Young's modulus and the strain at fracture depended on the measured direction, and increased with the decreased specific surface area due to the formation of grain boundary. However, the compressive strength and the fracture energy were not sensitive to the measured direction. The compressive strength of a porous SiC compact increased with increasing grain boundary area. According to the theoretical modeling of the strength–grain boundary area relation, it is interpreted that the grain boundary of a porous SiC compact is fractured by shear deformation rather than by compressive deformation.

  3. Sintering and densification; new techniques: sinter forging

    International Nuclear Information System (INIS)

    Winnubst, A.J.A.

    1998-01-01

    In this chapter pressure assisted sintering methods will be described. Attention will mainly be paid to sinter forging as a die-wall free uniaxial pressure sintering technique, where large creep strains are possible. Sinter forging is an effective tool to reduce sintering temperature and time and to obtain a nearly theoretically dense ceramic. In this way grain size in tetragonal zirconia ceramics can be reduced down to 100 nm. Another important phenomenon is the reduction of the number density and size of cracks and flaws resulting in higher strength and improved reliability, which is of utmost importance for engineering ceramics. The creep deformation during sinter forging causes a rearrangement of the grains resulting in a reduction of interatomic spaces between grains, while grain boundary (glassy) phases can be removed. The toughness and in some cases the wear resistance is enhanced after sinter forging as a result of the grain-boundary-morphology improvement. (orig.)

  4. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  5. Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing

    International Nuclear Information System (INIS)

    Li, Yi; Lim, Adeline B.Y.; Luo, Kaiming; Chen, Zhong; Wu, Fengshun; Chan, Y.C.

    2016-01-01

    The evolution of microstructure in Cu/In–48Sn/Cu solder bump interconnects at a current density of 0.7 × 10"4 A/cm"2 and ambient temperature of 55 °C has been investigated. During electromigration, tin (Sn) atoms migrated from cathode to anode, while indium (In) atoms migrated from anode to cathode. As a result, the segregation of the Sn-rich phase and the In-rich phase occurred. A Sn-rich layer and an In-rich layer were formed at the anode and the cathode, respectively. The accumulation rate of the Sn-rich layer was 1.98 × 10"−"9 cm/s. The atomic flux of Sn was calculated to be approximately 1.83 × 10"1"3 atoms/cm"2s. The product of the diffusivity and the effective charge number of Sn was determined to be approximately 3.13 × 10"−"1"0 cm"2/s. The In–48Sn/Cu IMC showed a two layer structure of Cu_6(Sn,In)_5, adjacent to the Cu, and Cu(In,Sn)_2, adjacent to the solder. Both the cathode IMC and the anode IMC thickened with increasing electromigration time. The IMC evolution during electromigration was strongly influenced by the migration of Cu atoms from cathode to anode and the accumulation of Sn-rich and In-rich layers. During electromigration, the Cu(In,Sn)_2 at the cathode interface thickened significantly, with a spalling characteristic, due to the accumulation of In-rich layer and the migration of Cu atoms - while the Cu(In,Sn)_2 at the anode interface reduced obviously, due to the accumulation of Sn-rich layer. The mechanism of electromigration-induced failure in Cu/In–48Sn/Cu interconnects was the cathode Cu dissolution-induced solder melt, which led to the rapid consumption of Cu in the cathode pad during liquid-state electromigration and this finally led to the failure. - Highlights: • Sn migrates to the anode, while In migrates to the cathode, during EM in Cu/In–48Sn/Cu. • The atomic flux of Sn has been calculated. • The interfacial IMCs were identified as: Cu_6(Sn,In)_5 + Cu(In,Sn)_2. • The interface evolution is strongly

  6. Anisotropy of the ferromagnetic L10 phase in the Mn-Al-C alloys induced by high-pressure spark plasma sintering

    Science.gov (United States)

    Tyrman, Muriel; Ahmim, Smail; Pasko, Alexandre; Etgens, Victor; Mazaleyrat, Frédéric; Quetel-Weben, Simon; Perrière, Loïc; Guillot, Ivan

    2018-05-01

    The metastable τ-phase of MnAl equi-atomic compound belongs to a family of ferromagnetic alloys with L10 crystal structure. Stabilization of the phase by adding 2 at. % using manganese carbide (Mn23C6) enhances the magnetization in relation with the increase in lattice volume. It is thus a promising candidate for rare-earth-free permanent magnets. Coercivity of Mn-Al-C alloys being still weak, there is an interest to see to which extend sintering/transformation of the ɛ-phase by Spark Plasma Sintering (SPS) can increase the coercivity and the anisotropy. The structural and the magnetic properties were studied for samples sintered at 550 °C under uniaxial pressure of 100, 200, 300 and 400 MPa. Coercivity, remanence and anistotropy appears with the sintering pressure. The high pressure applied while sintering produces preferential orientation of the flake-shaped grains which influences the remanence.

  7. Modeling of microstructure evolution in direct metal laser sintering: A phase field approach

    Science.gov (United States)

    Nandy, Jyotirmoy; Sarangi, Hrushikesh; Sahoo, Seshadev

    2017-02-01

    Direct Metal Laser Sintering (DMLS) is a new technology in the field of additive manufacturing, which builds metal parts in a layer by layer fashion directly from the powder bed. The process occurs within a very short time period with rapid solidification rate. Slight variations in the process parameters may cause enormous change in the final build parts. The physical and mechanical properties of the final build parts are dependent on the solidification rate which directly affects the microstructure of the material. Thus, the evolving of microstructure plays a vital role in the process parameters optimization. Nowadays, the increase in computational power allows for direct simulations of microstructures during materials processing for specific manufacturing conditions. In this study, modeling of microstructure evolution of Al-Si-10Mg powder in DMLS process was carried out by using a phase field approach. A MATLAB code was developed to solve the set of phase field equations, where simulation parameters include temperature gradient, laser scan speed and laser power. The effects of temperature gradient on microstructure evolution were studied and found that with increase in temperature gradient, the dendritic tip grows at a faster rate.

  8. Thermal properties and thermal shock resistance of liquid phase sintered ZrC-Mo cermets

    International Nuclear Information System (INIS)

    Landwehr, Sean E.; Hilmas, Gregory E.; Fahrenholtz, William G.; Talmy, Inna G.; Wang Hsin

    2009-01-01

    The linear thermal expansion coefficient (CTE), heat capacity, and thermal conductivity, were investigated as a function of temperature for hot pressed ZrC and liquid phase sintered ZrC-Mo cermets. The ZrC and the ZrC-Mo cermets had the same CTE at 50 deg. C (∼5.1-5.5 ppm deg. C -1 ), but the CTE of ZrC increased to ∼12.2 ppm deg. C -1 at 1000 deg. C compared to ∼7.2-8.5 ppm deg. C -1 for the ZrC-Mo cermets. Heat capacity was calculated using a rule of mixtures and previously reported thermodynamic data. Thermal diffusivity was measured with a laser flash method and was, in turn, used to calculate thermal conductivity. Thermal conductivity increased linearly with increasing temperature for all compositions and was affected by solid solution formation and carbon deficiency of the carbide phases. Hot pressed ZrC had the highest thermal conductivity (∼30-37 W m -1 K -1 ). The nominally 20 and 30 vol% Mo compositions of the ZrC-Mo cermets had a lower thermal conductivity, but the thermal conductivity generally increased with increasing Mo content. Water quench thermal shock testing showed that ZrC-30 vol% Mo had a critical temperature difference of 350 deg. C, which was ∼120 deg. C higher than ZrC. This increase was due to the increased toughness of the cermet compared to ZrC.

  9. Development of ceramics based fuel, Phase I, Kinetics of UO2 sintering by vibration compacting of UO2 powder (Introductory report)

    International Nuclear Information System (INIS)

    Ristic, M.M.

    1962-10-01

    After completing the Phase I of the task related to development of ceramics nuclear fuel the following reports are presented: Kinetics of UO 2 sintering; Vibrational compacting and sintering of UO 2 ; Characterisation of of UO 2 powder by DDK and TGA methods; Separation of UO 2 powder

  10. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  11. Microstructural Evolution of Ni-Sn Transient Liquid Phase Sintering Bond during High-Temperature Aging

    Science.gov (United States)

    Feng, Hongliang; Huang, Jihua; Peng, Xianwen; Lv, Zhiwei; Wang, Yue; Yang, Jian; Chen, Shuhai; Zhao, Xingke

    2018-05-01

    For high-temperature-resistant packaging of new generation power chip, a chip packaging simulation structure of Ni/Ni-Sn/Ni was bonded by a transient liquid-phase sintering process. High-temperature aging experiments were carried out to investigate joint heat stability. The microstructural evolution and mechanism during aging, and mechanical properties after aging were analyzed. The results show that the 30Ni-70Sn bonding layer as-bonded at 340°C for 240 min is mainly composed of Ni3Sn4 and residual Ni particles. When aged at 350°C, because of the difficulty of nucleation for Ni3Sn and quite slow growth of Ni3Sn2, the bonding layer is stable and the strength of that doesn't change obviously with aging time. When aging temperature increased to 500°C, however, the residual Ni particles were gradually dissolved and the bonding layer formed a stable structure with dominated Ni3Sn2 after 36 h. Meanwhile, due to the volume shrinkage (4.43%) from Ni3Sn2 formation, a number of voids were formed. The shear strength shows an increase, resulting from Ni3Sn2 formation, but then it decreases slightly caused by voids. After aging at 500°C for 100 h, shear strength is still maintained at 29.6 MPa. In addition, the mechanism of void formation was analyzed and microstructural evolution model was also established.

  12. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  13. Phase evolution and dielectric properties of MgTi2O5 ceramic sintered with lithium borosilicate glass

    International Nuclear Information System (INIS)

    Shin, Hyunho; Shin, Hee-Kyun; Jung, Hyun Suk; Cho, Seo-Yong; Hong, Kug Sun

    2005-01-01

    Phase evolution, densification, and dielectric properties of MgTi 2 O 5 dielectric ceramic, sintered with lithium borosilicate (LBS) glass, were studied. Reaction between LBS glass and MgTi 2 O 5 was significant in forming secondary phases such as TiO 2 and (Mg,Ti) 2 (BO 3 )O. The glass addition was not necessarily deleterious to the dielectric properties due to the formation of TiO 2 : permittivity increased and temperature coefficient of resonance frequency could be tuned to zero with the addition of LBS glass, although the inevitable glass-induced decrease of quality factor was not retarded by the formation of TiO 2 . The sintered specimen with 10 wt% LBS fired at 950 deg. C for 2 h showed permittivity of 19.3, quality factor of 6800 GHz, and τ f of -16 ppm/ deg. C

  14. Changes of Fe matrix lattice constant during liquid phase sintering of Fe-Cu-C compacts by x-ray diffraction techniques

    International Nuclear Information System (INIS)

    Mazli Mustapha; Abdul Kadir Masrom; Mohammad, M.; Meh, B.; Zawati Harun

    2002-01-01

    The dissolution of graphite and copper during sintering of PM steels prepared from iron, copper and graphite powder mixes were studied using X-Ray Diffraction method. This paper present the investigation carried out to study the changes of iron's lattice constant during liquid phase sintering of the compacts. The electrical conductivity measurement method was also used for determining the extent of carbon and copper dissolution and its influence on the formation of sintered compacts. In the experiment, the Fe-Cu-C powders were compacted into a pellets using hand press machine and were then sintered in a 5% H 2 + 95% N 2 gas atmosphere at different sintering temperature in the range of 400 degree C and 1200 degree C. The effect of sintering parameters on the mechanical properties of the sintered compacts was studied to find a correlation between mechanical behaviour, microstructure, and the resistivity in order to develop nondestructive testing method. It was observed that measurement of Fe matrix lattice constant and electrical conductivity of sintered compacts could be a viable method in studying all stages of sintering process. (Author)

  15. Pre-sintered Y-TZP sandblasting: effect on surface roughness, phase transformation, and Y-TZP/veneer bond strength

    Directory of Open Access Journals (Sweden)

    Carla Müller Ramos-Tonello

    Full Text Available Abstract Sandblasting is a common method to try to improve the Y-TZP/veneer bond strength of dental prostheses, however, it may put stress on zirconia surfaces and could accelerate the t→m phase transformation. Y-TZP sandblasting before sintering could be an alternative to improve surface roughness and bonding strength of veneering ceramic. Objectives. The aim of this study was to analyze the effect of Y-TZP pre-sintering sandblasting on surface roughness, phase transformation, and the Y-TZP/veneer shear bond strength. Material and Methods. The Y-TZP specimen surface underwent sandblasting with aluminum oxide (50 μm pre-sintering (Z-PRE and post-sintering (Z-POS. Z-CTR was not subjected to surface treatment. After ceramic veneer application, the specimens were subjected to shear bond testing. Surface roughness was analyzed by confocal microscopy. Y-TZP monoclinic and tetragonal phases were evaluated by micro-Raman spectroscopy. Shear bond strength and surface roughness data were analyzed by One-way ANOVA and Tukey tests (α=0.05. Differences in the wave numbers and the broadening bands of the Raman spectra were compared among groups. Results. Z-POS (9.73±5.36 MPa and Z-PRE (7.94±2.52 MPa showed the highest bond strength, significantly higher than that of Z-CTR (5.54±2.14 MPa. The Ra of Z-PRE (1.59±0.23 µm was much greater and significantly different from that of Z-CTR (0.29±0.05 µm and Z-POS (0.77±0.13 µm. All groups showed bands typical of the tetragonal (T and monoclinic (M phases. Y-TZP sandblasting before sintering resulted in rougher surfaces but did not increase the shear bond strength compared to post-sintering and increased surface defects. Conclusions. Surface treatment with Al3O2, regardless of the moment and application, improves the results of Y-TZP/veneer bonding and is not a specific cause of t→m transformation.

  16. Adaptive Laser Sintering System for In-space Printed Electronics, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The goal of this project is to enhance the Optomec Aerosol Jet(R) technology for additive manufacturing by introduction of an Adaptive Laser Sintering System (ALSS)...

  17. In situ evaluation of supersolidus liquid phase sintering phenomena of stainless steel 316L: Densification and distortion

    Science.gov (United States)

    Bollina, Ravi

    Supersolidus liquid phase sintering (SLPS) is a variant of liquid phase sintering. In SLPS, prealloyed powders are heated between the solidus and liquidus temperature of the alloy. This thesis focuses on processing of stainless steel 316L via SLPS by adding boron. Various amounts of boron were added to study the effect of boron on densification and distortion. The sintering window for water atomized 316L with 0.2% boron ranges from 1430 to 1435°C and 1225 to 1245°C for water atomized 316L with 0.8% boron. The rate of change of liquid content with temperature dVL/dt decreases from 1.5%/°C to 0.1%/°C for in increase in boron content from 0 to 0.8%, giving a wider range and better control during sintering. Further; effect of boron on mechanical properties and corrosion properties was researched. It was possible to achieve tensile strength of 476+/-21 MPa and an yield strength of 250+/-5 MPa with an elongation of 15+/-2 % in water atomized 316L with 0.8% boron. Fracture analysis indicates the presence of a brittle boride phase along the grain boundary causing intergranular fracture resulting in poor ductility. The crux of this thesis discusses the evolution of apparent viscosity and its relation to the microstructure. Beam bending viscometry was successfully used to evaluate the in situ apparent viscosity evolution of water atomized 316L with 0.2 and 0.8% boron additions. The apparent viscosity drops from 174 GPa.s at 1200°C to 4 GPa.s at 1275°C with increasing fractional liquid coverage in the water atomized 316L with 0.8% boron. The apparent viscosity calculated from bending beam and was used as an input into a finite element model (FEM) derived from constitutive equations and gives an excellent, fit between simulation and experiment. The densification behavior of boron doped stainless steel was modelled using Master Sintering Curve (MSC) (based on work of sintering) for the first time. It is proven that MSC can be used to identify change in densification rate

  18. Effect of the application of surface treatments before and after sintering on the flexural strength, phase transformation and surface topography of zirconia.

    Science.gov (United States)

    Kurtulmus-Yilmaz, Sevcan; Aktore, Huseyin

    2018-05-01

    To evaluate the effects of airborne-particle abrasion (APA) and Er,Cr:YSGG laser irradiation on 4-point-flexural strength, phase transformation and morphologic changes of zirconia ceramics treated at pre-sintered or post-sintered stage. Three hundred and forty-two bar shaped zirconia specimens were milled with different sizes according to the flexural strength test (n = 10), X-ray diffraction (XRD) (n = 4) and field emission scanning electron microscope (FE-SEM) (n = 4) analyses. For each test protocol, specimens were divided into 4 main groups whether the surface treatments applied before or after sintering and whether the specimens received heat treatment or not as pre-sintered, post-sintered no-heat and post-sintered heat-treated groups, and a group was served as control. Main groups were further divided into 6 equal subgroups according to surface treatment method applied (2 W-, 3 W-, 4 W-, 5 W-, 6 W-laser irradiations and APA). Surface treatments were applied to pre-sintered groups before sintering and to post-sintered groups after sintering. Post-sintered heat-treated groups were subjected to veneer ceramic firing simulation after surface treatments. Flexural strength and flexural modulus values were statistically analysed and monoclinic phase content was calculated. Weibull analysis was used to evaluate strength reliability and fractographic analysis was conducted. Highest flexural strength values were detected at post-sintered no-heat APA and 4W-laser groups (P SEM images pre-sintered groups. Application of surface treatments at pre-sintered stage may be detrimental for zirconia ceramics in terms of flexural strength. Treating the surface of zirconia ceramic before sintering process is not recommended due to significant decrease in flexural strength values. 2 W-4 W Er,Cr:YSGG laser irradiations can be regarded as alternative surface treatment methods when zirconia restoration would be subjected to veneer ceramic firing procedures

  19. Uniform magnetization reversal in dual main-phase (Ce,Nd)2Fe14B sintered magnets with inhomogeneous microstructure

    International Nuclear Information System (INIS)

    Zhang, Le-le; Li, Zhu-bai; Zhang, Xue-feng; Ma, Qiang; Liu, Yan-li; Li, Yong-feng; Zhao, Qian

    2017-01-01

    The element distribution and the magnetic properties were investigated in (Ce,Nd)–Fe–B sintered magnets prepared by mixing Nd 13.5 Fe 80 B 6.5 and Ce 9 Nd 4.5 Fe 80 B 6.5 powders with different mass ratios. Two main phases exist, but element diffusion is evident, and the chemical composition of the main phase is widely different from that of the master alloy. The Ce element tends to be expelled from the Ce-rich Re 2 Fe 14 B phase. Compared with the Ce-rich main phase, the Nd-rich Re 2 Fe 14 B phase is more stable in structure. Although the microstructure is inhomogeneous and the magnetocrystalline anisotropy is variable, the magnetization reversal is uniform in these dual main-phase magnets, which should ascribe to the existence of the exchange coupling, and magnetization reversal undergoes the nucleation of the reversed domain in irreversible magnetization. It is expected to further improve the coercivity by optimizing the distribution of the Nd-rich main phase in preparing the resource-saving (Ce,Nd) 2 Fe 14 B sintered magnets. (paper)

  20. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  1. Preparation and Characterization of TiB2-(Supra-Nano-Dual-Phase High-Entropy Alloy Cermet by Spark Plasma Sintering

    Directory of Open Access Journals (Sweden)

    Shulei Zhang

    2018-01-01

    Full Text Available This paper introduces the preparation method and characterization results of TiB2 ceramics with CoCrFeNiAl high-entropy alloy (HEA as a sintering aid by Spark Plasma Sintering (SPS. Good wettability between HEA and TiB2 was proved by the sessile drop method, indicating promising prospects for this composite. The sintering results showed that the addition of HEA could dramatically promote the sinterability of TiB2. TiB2-5 wt. % HEA dense ceramics prepared at the optimal temperature of 1650 °C showed fine morphology without formation of brittle phases. The liquid phase in the ceramics was highly consistent with the so-called “supra-nano-dual-phase materials (SNDPM”, with near-ideal strength. This study represents the first time that a ceramic-SNDPM composite has been fabricated since the invention of such structures.

  2. Temperature, Crystalline Phase and Influence of Substrate Properties in Intense Pulsed Light Sintering of Copper Sulfide Nanoparticle Thin Films.

    Science.gov (United States)

    Dexter, Michael; Gao, Zhongwei; Bansal, Shalu; Chang, Chih-Hung; Malhotra, Rajiv

    2018-02-02

    Intense Pulsed Light sintering (IPL) uses pulsed, visible light to sinter nanoparticles (NPs) into films used in functional devices. While IPL of chalcogenide NPs is demonstrated, there is limited work on prediction of crystalline phase of the film and the impact of optical properties of the substrate. Here we characterize and model the evolution of film temperature and crystalline phase during IPL of chalcogenide copper sulfide NP films on glass. Recrystallization of the film to crystalline covellite and digenite phases occurs at 126 °C and 155 °C respectively within 2-7 seconds. Post-IPL films exhibit p-type behavior, lower resistivity (~10 -3 -10 -4  Ω-cm), similar visible transmission and lower near-infrared transmission as compared to the as-deposited film. A thermal model is experimentally validated, and extended by combining it with a thermodynamic approach for crystal phase prediction and via incorporating the influence of film transmittivity and optical properties of the substrate on heating during IPL. The model is used to show the need to a-priori control IPL parameters to concurrently account for both the thermal and optical properties of the film and substrate in order to obtain a desired crystalline phase during IPL of such thin films on paper and polycarbonate substrates.

  3. Systematics of Structural, Phase Stability, and Cohesive Properties of η'-Cu6(Sn,In)5 Compounds Occurring in In-Sn/Cu Solder Joints

    Science.gov (United States)

    Ramos, S. B.; González Lemus, N. V.; Deluque Toro, C. E.; Cabeza, G. F.; Fernández Guillermet, A.

    2017-07-01

    Motivated by the high solubility of In in ( mC44) η'-Cu6Sn5 compound as well as the occurrence of an In-doped η'-intermetallic in the microstructure of Cu/In-Sn/Cu solder joints, a theoretical study has been carried out to investigate the various physical effects of incorporating In at Sn Wyckoff sites of the binary η'-phase. Systematic ab initio calculations using the projected augmented wave method and Vienna Ab initio Simulation Package were used to determine the composition dependence of the structural and cohesive properties of η'-Cu6(Sn,In)5 compounds, compared with those expected from the binary end-member compounds Cu6Sn5 and Cu6In5. The molar volume shows significant deviations from Vegard's law. The predicted composition dependence of the cohesive properties is discussed using two complementary approaches, viz. a valence-electron density approach as well as a bond-number approach, both accounting for the roughly linear dependence of the cohesive energy on the In content. A microscopic interpretation for this general trend is given in terms of the key contributions to chemical bonding in this class of compounds, namely Cu d-electron overlap and hybridization of Cu d-states with In and Sn p-electron states. Moreover, a crystallographic site approach is developed to accurately establish the phase-stabilizing effect of incorporating In at specific Wyckoff positions of the ( mC44) η'-Cu6Sn5 structure.

  4. The corrosion mechanism of the sintered (Ce, Nd)-Fe-B magnets prepared by double main phase and single main phase approaches

    Science.gov (United States)

    Shi, Xiaoning; Zhu, Minggang; Zhou, Dong; Song, Liwei; Guo, Zhaohui; Li, Jia; Li, Wei

    2018-05-01

    The sintered (Ce, Nd)-Fe-B magnets were produced widely by Double Main Phase (DMP) method in China as the magnetic properties of the DMP magnets are superior to those of single main phase (SMP) magnets with the same nominal composition. In this work, the microstructure and corrosion mechanism of the sintered (Ce0.2Nd0.8)30FebalB (wt.%) magnets prepared by DMP and SMP method were studied in detail. Compared to SMP magnets, the DMP magnets have more positive corrosion potential, lower corrosion current density, larger electron transfer resistance, and lower mass loss of the free corrosion experiment in 0.5mol/l Na2SO4 aqueous solution. All of the results show that the DMP magnets have better corrosion resistance than SMP magnets. The back scattered electron images show that the crystalline grains of the DMP magnets are sphericity with a smooth surface while the SMP ones have plenty of edges and corners. Besides, the distribution of Ce/Nd is much more uneven in both magnetic phase and rare earth (Re)-rich phase of the DMP magnets than those of SMP magnets. After corrosion, DMP magnets show eroded magnetic phase and intact Re-rich phase, which indicate that galvanic corrosion of the Re-rich phase acting as the cathode appears.

  5. Microstructure and phase analysis of Zirconia-ODS (Oxide Dispersion Strengthen) alloy sintered by APS with milling time variation

    Science.gov (United States)

    Sugeng, Bambang; Bandriyana, B.; Sugeng, Bambang; Salam, Rohmad; Sumariyo; Sujatno, Agus; Dimyati, Arbi

    2018-03-01

    Investigation on the relationship between the process conditions of milling time and the microstructure on the synthesis of the zirconia-ODS steel alloy has been performed. The elemental composition of the alloy was determined on 20 wt% Cr and zirconia dispersoid of 0.50 wt%. The synthesis was carried out by powder metallurgy method with milling time of 3, 5 and 7 hours, static compression of 20 Ton and sintering process for 4 minutes using the APS (Arc Plasma Sintering) equipment. SEM-EDX and XRD test was carried out to characterize the phase and morphology of the alloy and the effect to the mechanical properties was evaluated by the Vickers Hardness testing. The synthesis produced sample of ODS steel with good dense and very little porous with the Fe-Cr phase that clearly observed in the XRD peak pattern. In addition milling time increased the homogeneously of Fe-Cr phase formulation, enhanced the grain refinement of the structure and increase the hardness of the alloy.

  6. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  7. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  8. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  9. Morphological analysis and modelling of sintering and of sintered materials

    International Nuclear Information System (INIS)

    Jernot, Jean-Paul

    1982-01-01

    This research thesis addresses the study of solid phase sintering of metallic powders, and aims at describing as precisely as possible the different involved matter transport mechanisms, first by using a thermodynamic approach to sintering. Sintering diagrams are also used to determine prevailing mechanisms. The microstructure of sintered materials has been studied by using image quantitative analysis, thus by using a morphological approach to sintering. Morphological parameters allow, on the one hand, the evolution of powders during sintering to be followed, and, on the other hand, sintered products to be correctly characterised. Moreover, the author reports the study of the evolution of some physical properties of sintered materials with respect to their microstructure parameters. This leads to the development of a modelling of the behaviour of these materials [fr

  10. In-situ anatase phase stabilization of titania photocatalyst by sintering in presence of Zr4+ organic salts

    Science.gov (United States)

    Strini, Alberto; Sanson, Alessandra; Mercadelli, Elisa; Bendoni, Riccardo; Marelli, Marcello; Dal Santo, Vladimiro; Schiavi, Luca

    2015-08-01

    The direct in-situ stabilization of an anatase-based nanocrystalline photocatalyst (Degussa P25) was obtained by sintering the catalyst powder in presence of Zr4+ organic salts. This approach allows the doping of an already-formed nanocrystalline photocatalyst instead of introducing the dopant in the crystal lattice during the catalyst synthesis. The procedure was demonstrated by the production of thick ceramic layers using the screen printing technique. This new method allows to easily stabilize the anatase phase 200 °C higher than the undoped P25 maintaining the same photocatalytic activity. The process was studied using specifically formulated screen-printing inks added with Zr4+ organic salt at 1% and 2% Zr/Ti molar ratio. The anatase phase stability was investigated in the 500-900 °C temperature range analysing the resulting catalysts with XRD, TEM and (S)TEM-EDS. The catalytic activity of the screen-printed layers was assessed by measuring the degradation of toluene in air at ambient concentration (500 nmol m-3) and low UV-A irradiance (180 μW cm-2). The described in-situ stabilization method could be potentially applied to any deposition process involving already formed anatase photocatalyst, allowing higher sintering temperature and then an improved mechanical stability of the active layers without photocatalytic activity degradation.

  11. Investigation of microstructural evolution and electrical properties for Ni-Sn transient liquid-phase sintering bonding

    Science.gov (United States)

    Feng, Hong-Liang; Huang, Ji-Hua; Yang, Jian; Zhou, Shao-Kun; Zhang, Rong; Wang, Yue; Chen, Shu-Hai

    2017-11-01

    Ni/Ni-Sn/Ni sandwiched simulated package structures were successfully bonded under low temperature and low pressure by Ni-Sn transient liquid-phase sintering bonding. The results show that, after isothermally holding for 240 min at 300 °C and 180 min at 340 °C, Sn was completely transformed into Ni3Sn4 intermetallic compounds. When the Ni3Sn4 phases around Ni particles were pressed together, the porosity of the bonding layer increased, which obviously differed from the normal sintering densification process. With further analysis of this phenomenon, it was found that large volume shrinkage (14.94% at 340 °C) occurred when Ni reacted with Sn to form Ni3Sn4, which caused void formation. A mechanistic model of the microstructural evolution in the bonding layer was proposed. Meanwhile, the resistivity of the bonding layer was measured and analyzed by using the four-probe method; the microstructural evolution was well reflected by the resistivity of the bonding layer. The relationship between the resistivity and microstructure was also discussed in detail.[Figure not available: see fulltext.

  12. Experimental evidence for several spheroid growth mechanisms in the liquid-phase sintered tungsten-base composites

    International Nuclear Information System (INIS)

    Zukas, E.G.; Rogers, P.S.Z.; Rogers, R.S.

    1976-01-01

    The generally accepted mechanism for spheroid growth during sintering of tungsten-base composites in the presence of a liquid phase is the dissolution of the small spheroids with simultaneous precipitation of tungsten from the molten matrix onto the larger spheroids, the process being driven by the difference in surface energy between the larger and smaller spheroids. From theoretical considerations, the slope of the straight line of log diameter versus log time should be 1 / 3 for this process. The experimental evidence for the dissolution and reprecipitation mechanism is meager, being based primarily on the spheroid growth rate during the latter stages of liquid-phase sintering. Experimental evidence is presented that shows spheroid growth taking place in systems where the tungsten and the matrix are mutually insoluble thereby making dissolution and reprecipitation impossible. Furthermore, the results from these studies and others using the usual matrix compositions indicate that spheroid growth takes place predominantly by the combination or coalescence of two or more spheroids. Deposition of tungsten from the molten matrix also occurs, although not necessarily on spheroid surfaces which have the lowest surface energy. Thus, many mechanisms, each depending on temperature and other variables, operate simultaneously. A satisfactory theoretical treatment must include them all

  13. Effect of liquid-phase sintering as a means of quality enhancement of pseudoalloys based on copper

    Science.gov (United States)

    Gordeev, Yu I.; Abkaryan, A. K.; Zeer, G. M.; Lepeshev, A. A.; Zelenkova, E. G.

    2017-01-01

    The effects of the liquid phase of a metal binder on the microstructure and properties of self-diffusion gradient composite (Cu - Al - ZnO) were investigated. For the compositions considered, it was revealed that at the temperature of about 550 °C, a liquid phase binder forms from nanoparticles Cu - Al. Applying a proper amount of a (Cu - Al) binder appeared to be beneficial for fabricating gradient composites with the desired self-diffusion process. It is also favorable for mass transfer of additives nanoparticles into the volume of a matrix during sintering and for the desired fine microstructure and mechanical properties. For the experimental conditions considered in this study, the best mechanical properties can be obtained when 6 mass % (Cu - Al) of ligature were used, which gave hardness HB at 120, electroerosion wear - 0.092 • 10-6 g / cycle, resistivity - 0.025 mcOm.

  14. Rapid liquid phase sintered Mn doped BiFeO3 ceramics with enhanced polarization and weak magnetization

    Science.gov (United States)

    Kumar, Manoj; Yadav, K. L.

    2007-12-01

    Single-phase BiFe1-xMnxO3 multiferroic ceramics have been synthesized by rapid liquid phase sintering method to study the influence of Mn substitution on their crystal structure, dielectric, magnetic, and ferroelectric behaviors. From XRD analysis it is seen that Mn substitution does not affect the crystal structure of the BiFe1-xMnxO3 system. An enhancement in magnetization was observed for BiFe1-xMnxO3 ceramics. However, the ferooelectric hysteresis loops were not really saturated, we observed a spontaneous polarization of 10.23μC /cm2 under the applied field of 42kV/cm and remanent polarization of 3.99μC/cm2 for x =0.3 ceramic.

  15. Establishing Antibacterial Multilayer Films on the Surface of Direct Metal Laser Sintered Titanium Primed with Phase-Transited Lysozyme

    Science.gov (United States)

    Guan, Binbin; Wang, Haorong; Xu, Ruiqing; Zheng, Guoying; Yang, Jie; Liu, Zihao; Cao, Man; Wu, Mingyao; Song, Jinhua; Li, Neng; Li, Ting; Cai, Qing; Yang, Xiaoping; Li, Yanqiu; Zhang, Xu

    2016-11-01

    Direct metal laser sintering is a technology that allows the fabrication of titanium (Ti) implants with a functional gradation of porosity and surface roughness according to three-dimensional (3D) computer data. The surface roughness of direct metal laser sintered titanium (DMLS-Ti) implants may provide abundant binding sites for bacteria. Bacterial colonization and subsequent biofilm formation can cause unsatisfactory cell adhesion and implant-related infections. To prevent such infections, a novel phase-transited lysozyme (PTL) was utilized as an initial functional layer to simply and effectively prime DMLS-Ti surfaces for subsequent coating with antibacterial multilayers. The purpose of the present study was to establish a surface with dual biological functionality. The minocycline-loaded polyelectrolyte multilayers of hyaluronic acid (HA) and chitosan (CS) formed via a layer-by-layer (LbL) self-assembly technique on PTL-functionalized DMLS-Ti were designed to inhibit pathogenic microbial infections while allowing the DMLS-Ti itself and the modified coatings to retain acceptable biocompatibility. The experimental results indicate that the DMLS-Ti and the hydrogel treated surfaces can inhibit early bacterial adhesion while completely preserving osteoblast functions. This design is expected to gain considerable interest in the medical field and to have good potential for applications in multifunctional DMLS-Ti implants.

  16. Establishing Antibacterial Multilayer Films on the Surface of Direct Metal Laser Sintered Titanium Primed with Phase-Transited Lysozyme.

    Science.gov (United States)

    Guan, Binbin; Wang, Haorong; Xu, Ruiqing; Zheng, Guoying; Yang, Jie; Liu, Zihao; Cao, Man; Wu, Mingyao; Song, Jinhua; Li, Neng; Li, Ting; Cai, Qing; Yang, Xiaoping; Li, Yanqiu; Zhang, Xu

    2016-11-08

    Direct metal laser sintering is a technology that allows the fabrication of titanium (Ti) implants with a functional gradation of porosity and surface roughness according to three-dimensional (3D) computer data. The surface roughness of direct metal laser sintered titanium (DMLS-Ti) implants may provide abundant binding sites for bacteria. Bacterial colonization and subsequent biofilm formation can cause unsatisfactory cell adhesion and implant-related infections. To prevent such infections, a novel phase-transited lysozyme (PTL) was utilized as an initial functional layer to simply and effectively prime DMLS-Ti surfaces for subsequent coating with antibacterial multilayers. The purpose of the present study was to establish a surface with dual biological functionality. The minocycline-loaded polyelectrolyte multilayers of hyaluronic acid (HA) and chitosan (CS) formed via a layer-by-layer (LbL) self-assembly technique on PTL-functionalized DMLS-Ti were designed to inhibit pathogenic microbial infections while allowing the DMLS-Ti itself and the modified coatings to retain acceptable biocompatibility. The experimental results indicate that the DMLS-Ti and the hydrogel treated surfaces can inhibit early bacterial adhesion while completely preserving osteoblast functions. This design is expected to gain considerable interest in the medical field and to have good potential for applications in multifunctional DMLS-Ti implants.

  17. Phase Transformation of Andalusite-Mullite and Its Roles in the Microstructure and Sinterability of Refractory Ceramic

    Science.gov (United States)

    Li, Bowen; He, Mengsheng; Wang, Huaguang

    2017-07-01

    Andalusite has been realized as a special mineral for the production of refractory ceramics due to its unique property to automatically decompose into mullite and silica during heating at high temperature. The phase transformation from andalusite to mullite plays a critical role for the effective applications of andalusite. This study investigated the microstructural characteristics and sinterability of andalusite powder during high-temperature decomposition. The andalusite powder was bonded with kaolin and prepared as a cylinder green body at 20 MPa; it was then fired at 1423 K to 1723 K (1150 °C to 1450 °C). The microstructures and mechanical strengths of the sintered ceramics were studied by the compressive test, X-ray diffraction, and scanning electron microscopy. The results showed that newly born mullite appeared as rodlike microcrystals and dispersed around the initial andalusite. At 1423 K (1150 °C), the mullitization of andalusite was started, but the complete mullitization was not found until firing at 1723 K (1450 °C). The compressive strength of the ceramics increased from 93.7 to 294.6 MPa while increasing the fire temperature from 1423 K to 1723 K (1150 °C to 1450 °C). Meanwhile, the bulk density of the ceramics was only slightly changed from 2.15 to 2.19 g/cm3.

  18. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  19. Characterization of SiCf/SiC and CNT/SiC composite materials produced by liquid phase sintering

    International Nuclear Information System (INIS)

    Lee, J.K.; Lee, S.P.; Cho, K.S.; Byun, J.H.; Bae, D.S.

    2011-01-01

    This paper dealt with the microstructure and mechanical properties of SiC based composites reinforced with different reinforcing materials. The composites were fabricated using reinforcing materials of carbon nanotubes (CNT) and Tyranno Lox-M SiC chopped fibers. The volume fraction of carbon nanotubes was also varied in this composite system. An Al 2 O 3 -Y 2 O 3 powder mixture was used as a sintering additive in the consolidation of the SiC matrix. The characterization of the composites was investigated by means of SEM and three point bending tests. These composites showed a dense morphology of the matrix region, by the creation of a secondary phase. The composites reinforced with SiC chopped fibers possessed a flexural strength of about 400 MPa at room temperature. The flexural strength of the carbon nanotubes composites had a tendency to decrease with increased volume fraction of the reinforcing material.

  20. In-situ anatase phase stabilization of titania photocatalyst by sintering in presence of Zr{sup 4+} organic salts

    Energy Technology Data Exchange (ETDEWEB)

    Strini, Alberto, E-mail: alberto.strini@itc.cnr.it [Istituto per le Tecnologie della Costruzione (ITC-CNR), via Lombardia, 49, I-20098 San Giuliano Milanese (MI) (Italy); Sanson, Alessandra; Mercadelli, Elisa [Istituto di Scienza e Tecnologia dei Materiali Ceramici (ISTEC-CNR), via Granarolo, 64, I-48018 Faenza (RA) (Italy); Bendoni, Riccardo [Istituto di Scienza e Tecnologia dei Materiali Ceramici (ISTEC-CNR), via Granarolo, 64, I-48018 Faenza (RA) (Italy); Dipartimento di Scienze e Tecnologie Chimiche e Centro NAST - Università di Roma Tor Vergata, via della Ricerca Scientifica, I-00133 Roma (Italy); Marelli, Marcello; Dal Santo, Vladimiro [CNR–Istituto di Scienze e Tecnologie Molecolari, via Golgi, 19, I-20133 Milano (Italy); Schiavi, Luca [Istituto per le Tecnologie della Costruzione (ITC-CNR), via Lombardia, 49, I-20098 San Giuliano Milanese (MI) (Italy)

    2015-08-30

    Graphical abstract: - Highlights: • Existing commercial (P25) anatase was stabilized in-situ with Zr(IV) doping. • Highly active catalytic layers were obtained by screen-printing. • Increased thermal stability was demonstrated up to 200 °C without activity loss. • Enhanced activity was obtained because of the Zr(IV) doping. • Zirconium diffusion was assessed by STEM-EDS analysis. - Abstract: The direct in-situ stabilization of an anatase-based nanocrystalline photocatalyst (Degussa P25) was obtained by sintering the catalyst powder in presence of Zr{sup 4+} organic salts. This approach allows the doping of an already-formed nanocrystalline photocatalyst instead of introducing the dopant in the crystal lattice during the catalyst synthesis. The procedure was demonstrated by the production of thick ceramic layers using the screen printing technique. This new method allows to easily stabilize the anatase phase 200 °C higher than the undoped P25 maintaining the same photocatalytic activity. The process was studied using specifically formulated screen-printing inks added with Zr{sup 4+} organic salt at 1% and 2% Zr/Ti molar ratio. The anatase phase stability was investigated in the 500–900 °C temperature range analysing the resulting catalysts with XRD, TEM and (S)TEM-EDS. The catalytic activity of the screen-printed layers was assessed by measuring the degradation of toluene in air at ambient concentration (500 nmol m{sup −3}) and low UV-A irradiance (180 μW cm{sup −2}). The described in-situ stabilization method could be potentially applied to any deposition process involving already formed anatase photocatalyst, allowing higher sintering temperature and then an improved mechanical stability of the active layers without photocatalytic activity degradation.

  1. In-situ anatase phase stabilization of titania photocatalyst by sintering in presence of Zr4+ organic salts

    International Nuclear Information System (INIS)

    Strini, Alberto; Sanson, Alessandra; Mercadelli, Elisa; Bendoni, Riccardo; Marelli, Marcello; Dal Santo, Vladimiro; Schiavi, Luca

    2015-01-01

    Graphical abstract: - Highlights: • Existing commercial (P25) anatase was stabilized in-situ with Zr(IV) doping. • Highly active catalytic layers were obtained by screen-printing. • Increased thermal stability was demonstrated up to 200 °C without activity loss. • Enhanced activity was obtained because of the Zr(IV) doping. • Zirconium diffusion was assessed by STEM-EDS analysis. - Abstract: The direct in-situ stabilization of an anatase-based nanocrystalline photocatalyst (Degussa P25) was obtained by sintering the catalyst powder in presence of Zr 4+ organic salts. This approach allows the doping of an already-formed nanocrystalline photocatalyst instead of introducing the dopant in the crystal lattice during the catalyst synthesis. The procedure was demonstrated by the production of thick ceramic layers using the screen printing technique. This new method allows to easily stabilize the anatase phase 200 °C higher than the undoped P25 maintaining the same photocatalytic activity. The process was studied using specifically formulated screen-printing inks added with Zr 4+ organic salt at 1% and 2% Zr/Ti molar ratio. The anatase phase stability was investigated in the 500–900 °C temperature range analysing the resulting catalysts with XRD, TEM and (S)TEM-EDS. The catalytic activity of the screen-printed layers was assessed by measuring the degradation of toluene in air at ambient concentration (500 nmol m −3 ) and low UV-A irradiance (180 μW cm −2 ). The described in-situ stabilization method could be potentially applied to any deposition process involving already formed anatase photocatalyst, allowing higher sintering temperature and then an improved mechanical stability of the active layers without photocatalytic activity degradation

  2. Crystallite-growth, phase transition, magnetic properties, and sintering behaviour of nano-CuFe2O4 powders prepared by a combustion-like process

    International Nuclear Information System (INIS)

    Köferstein, Roberto; Walther, Till; Hesse, Dietrich; Ebbinghaus, Stefan G.

    2014-01-01

    The synthesis of nano-crystalline CuFe 2 O 4 powders by a combustion-like process is described herein. Phase formation and evolution of the crystallite size during the decomposition process of a (CuFe 2 )—precursor gel were monitored up to 1000 °C. Phase-pure nano-sized CuFe 2 O 4 powders were obtained after reaction at 750 °C for 2 h resulting in a crystallite size of 36 nm, which increases to 96 nm after calcining at 1000 °C. The activation energy of the crystallite growth process was calculated as 389 kJ mol −1 . The tetragonal⇄cubic phase transition occurs between 402 and 419 °C and the enthalpy change (ΔH) was found to range between 1020 and 1229 J mol −1 depending on the calcination temperature. The optical band gap depends on the calcination temperature and was found between 2.03 and 1.89 eV. The shrinkage and sintering behaviour of compacted powders were examined. Dense ceramic bodies can be obtained either after conventional sintering at 950 °C or after a two-step sintering process at 800 °C. Magnetic measurements of both powders and corresponding ceramic bodies show that the saturation magnetization rises with increasing calcination-/sintering temperature up to 49.1 emu g −1 (2.1 µ B fu −1 ), whereas the coercivity and remanence values decrease. - Graphical abstract: A cheap one-pot synthesis was developed to obtain CuFe 2 O 4 nano-powders with different crystallite sizes (36–96 nm). The optical band gaps, phase transition temperatures and enthalpies were determined depending on the particle size. The sintering behaviour of nano CuFe 2 O 4 was studied in different sintering procedures. The magnetic behaviour of the nano-powders as well as the corresponding ceramic bodies were investigated. - Highlights: • Eco-friendly and simple synthesis for nano CuFe 2 O 4 powder using starch as polymerization agent. • Monitoring the phase evolution and crystallite growth kinetics during the synthesis. • Determination of the optical band gap

  3. Observation of WC grain shapes determined by carbon content during liquid phase sintering of WC-Co alloys

    International Nuclear Information System (INIS)

    Sona Kim; Hyoun-Ee Kim; Seok-Hee Han; Jong-Ku Park

    2001-01-01

    In the composite materials of WC-Co alloys, the faceted WC grains as a hard phase are dispersed in the ductile matrix of cobalt. Properties of WC-Co alloys are affected by microstructural factors such as volume fraction of WC phase, size of WC grains, and carbon content (kinds of constituent phases). Although the properties of WC-Co alloys are inevitably affected by the shape of WC grains, the shape of WC grains has not been thrown light on the properties of WC-Co alloys yet, because it has been regarded to have a uniform shape regardless of alloy compositions. It is proved that the WC grains have various shapes varying reversibly with carbon content in the sintered WC-Co compacts. This dependency of grain shape on the carbon content is attributed to asymmetric atomic structure of WC crystal. The {10 1 - 0} prismatic planes are distinguished into two groups with different surface energy according to their atomic structures. The prismatic planes of high surface energy tend to disappear in the compacts with high carbon content. In addition, these high energy prismatic planes tend to split into low energy surfaces in the large WC grains. (author)

  4. Effects of Heat Treatment on the Microstructures and High Temperature Mechanical Properties of Hypereutectic Al-14Si-Cu-Mg Alloy Manufactured by Liquid Phase Sintering Process

    Science.gov (United States)

    Heo, Joon-Young; Gwon, Jin-Han; Park, Jong-Kwan; Lee, Kee-Ahn

    2018-05-01

    Hypereutectic Al-Si alloy is an aluminum alloy containing at least 12.6 wt.% Si. It is necessary to evenly control the primary Si particle size and distribution in hypereutectic Al-Si alloy. In order to achieve this, there have been attempts to manufacture hypereutectic Al-Si alloy through a liquid phase sintering. This study investigated the microstructures and high temperature mechanical properties of hypereutectic Al-14Si-Cu-Mg alloy manufactured by liquid phase sintering process and changes in them after T6 heat treatment. Microstructural observation identified large amounts of small primary Si particles evenly distributed in the matrix, and small amounts of various precipitation phases were found in grain interiors and grain boundaries. After T6 heat treatment, the primary Si particle size and shape did not change significantly, but the size and distribution of CuAl2 ( θ) and AlCuMgSi ( Q) changed. Hardness tests measured 97.36 HV after sintering and 142.5 HV after heat treatment. Compression tests were performed from room temperature to 300 °C. The results represented that yield strength was greater after heat treatment (RT 300 °C: 351 93 MPa) than after sintering (RT 300 °C: 210 89 MPa). Fracture surface analysis identified cracks developing mostly along the interface between the primary Si particles and the matrix with some differences among temperature conditions. In addition, brittle fracture mode was found after T6 heat treatment.

  5. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  6. Design of Low-Melting Point Compositions Suitable for Transient Liquid Phase Sintering of PM Steels Based on a Thermodynamic and Kinetic Study

    Science.gov (United States)

    Bernardo, Elena; de Oro, Raquel; Campos, Mónica; Torralba, José Manuel

    2014-04-01

    The possibility of tailoring the characteristics of a liquid metal is an important asset in a wide number of processing techniques. For most of these processes, the nature and degree of the interaction between liquid and solid phases are usually a focus of interest since they determine liquid properties such as wettability and infiltration capacity. Particularly, within the powder metallurgy (PM) technology, it is considered one of the key aspects to obtain high performance steels through liquid phase sintering. In this work, it is proved how thermodynamic and kinetics software is a powerful tool to study the liquid/solid interactions. The assessment of different liquid phase promoters for transient liquid phase sintering is addressed through the use of ThermoCalc and DICTRA calculations. Besides melting temperatures, particular attention is given to the solubility phenomena between the phases and the kinetics of these processes. Experimental validation of thermodynamic results is carried out by wetting and infiltration experiments at high temperatures. Compositions presenting different liquid/solid solubility are evaluated and directly correlated to the behavior of the liquid during a real sintering process. Therefore, this work opens the possibility to optimize liquid phase compositions and predict the liquid behavior from the design step, which is considered of high technological value for the PM industry.

  7. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  8. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  9. Cu-Nb3Sn superconducting wires prepared by ''Copper Liquid Phase Sintering method'' using the Nb-H

    International Nuclear Information System (INIS)

    Resende, A.T. de.

    1985-01-01

    Cu-30% Nb in weighting were prepared by the method of Copper sintering liquid phase the method was improved by substitution of Nb power by Nb-H powder, obtaining a high density material with good mechanical properties, which was reduced to fine. Wire, Without heat treatment. The Cu-Nb 3 Sn wires were obtained by external diffusion process depositing tin in the Cu-30%Nb wires, and by internal diffusion process using the Sn-8.5% Cu in weighting, which was reduced to rods of 3.5 mm. These Cu-30%Nb rods were enclosed in copper tubes and deformed mechanically by rotary swaging and drawing. During the drawing step some wires were fractured, that were analysed and correlated with the microstructure of the Sn-8.5 Wt% Cu alloy. External and internal diffusion samples; after a fast thermal treatment for Sn diffusion, were submited to the temperature of 700 0 C to provide the reaction between Sn and Nb, leading to the Nb 3 Sn phase. Samples with several reaction times, and its influence on T c and J c critical parameters and normal resistivity were prepared and analysed. (author) [pt

  10. Spark Plasma Sintering (SPS)-Assisted Synthesis and Thermoelectric Characterization of Magnéli Phase V6O11

    KAUST Repository

    Joos, Markus

    2018-01-11

    The Magnéli phase V6O11 was synthesized in gram amounts from a powder mixture of V6O11/V7O13 and vanadium metal, using the spark plasma sintering (SPS) technique. Its structure was determined with synchrotron X-ray powder diffraction data from a phase-pure sample synthesized by conventional solid-state synthesis. A special feature of Magnéli-type oxides is a combination of crystallographic shear and intrinsic disorder that leads to relatively low lattice thermal conductivities. SPS prepared V6O11 has a relatively low thermal conductivity of κ = 2.72 ± 0.06 W (m K)-1 while being a n-type conductor with an electrical conductivity of σ = 0.039 ± 0.005 (μΩ m)-1, a Seebeck coefficient of α = -(35 ± 2) μV K-1, which leads to a power factor of PF = 4.9 ± 0.8 × 10-5W (m K2)-1 at ∼600 K. Advances in the application of Magnéli phases are mostly hindered by synthetic and processing challenges, especially when metastable and nanostructured materials such as V6O11 are involved. This study gives insight into the complications of SPS-assisted synthesis of complex oxide materials, provides new information about the thermal and electrical properties of vanadium oxides at high temperatures, and supports the concept of reducing the thermal conductivity of materials with structural building blocks such as crystallographic shear (CS) planes.

  11. Spark Plasma Sintering (SPS)-Assisted Synthesis and Thermoelectric Characterization of Magnéli Phase V6O11

    KAUST Repository

    Joos, Markus; Cerretti, Giacomo; Veremchuk, Igor; Hofmann, Patrick; Frerichs, Hajo; Anjum, Dalaver H.; Reich, Tobias; Lieberwirth, Ingo; Panthö fer, Martin; Zeier, Wolfgang G.; Tremel, Wolfgang

    2018-01-01

    The Magnéli phase V6O11 was synthesized in gram amounts from a powder mixture of V6O11/V7O13 and vanadium metal, using the spark plasma sintering (SPS) technique. Its structure was determined with synchrotron X-ray powder diffraction data from a phase-pure sample synthesized by conventional solid-state synthesis. A special feature of Magnéli-type oxides is a combination of crystallographic shear and intrinsic disorder that leads to relatively low lattice thermal conductivities. SPS prepared V6O11 has a relatively low thermal conductivity of κ = 2.72 ± 0.06 W (m K)-1 while being a n-type conductor with an electrical conductivity of σ = 0.039 ± 0.005 (μΩ m)-1, a Seebeck coefficient of α = -(35 ± 2) μV K-1, which leads to a power factor of PF = 4.9 ± 0.8 × 10-5W (m K2)-1 at ∼600 K. Advances in the application of Magnéli phases are mostly hindered by synthetic and processing challenges, especially when metastable and nanostructured materials such as V6O11 are involved. This study gives insight into the complications of SPS-assisted synthesis of complex oxide materials, provides new information about the thermal and electrical properties of vanadium oxides at high temperatures, and supports the concept of reducing the thermal conductivity of materials with structural building blocks such as crystallographic shear (CS) planes.

  12. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  13. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  14. Evaluation of liquid-phase sintering SiC using as additive the system Al2O3/DyO3

    International Nuclear Information System (INIS)

    Oliveira, M.R.; Atilio, I.; Garcia, G.C.R.; Ribeiro, S.

    2012-01-01

    The objective of this work was to study the liquid-phase sintering SiC with additives that has not been studied yet, Al 2 O 3 /Dy 2 O 3 , with 10% in volume. The powders were mixed, dried, and pressed in uniaxial and isostatic pressing. It was studied the melting temperature of the additives and bars were sintered at temperatures of 1900, 1950 e 2000 deg C, with averaged linear shrinkage of 17%, phase transformations of β-SiC into α-SiC and formation of Dy 3 Al 5 O 12 at all temperatures. The results showed that for further densification, the temperature of 1950 deg C is enough for a higher densification, with a low wetting angle, transformations of SiC and formation of Dy 3 Al 5 O 12 . (author)

  15. Single-phase highly densified SrBi{sub 2}Ta{sub 2}O{sub 9} compacts produced by high-pressure sintering

    Energy Technology Data Exchange (ETDEWEB)

    Pereira, Altair Soria; Souza, Ricson Rocha de; Sousa, Vania Caldas de, E-mail: altair@if.ufrgs.br [Universidade Federal do Rio Grande do Sul (UFRGS), Porto Alegre (Brazil)

    2016-07-01

    Full text: The development of high-performance lead-free piezoelectric ceramics is an important scientific and technological challenge, as environmental and health issues have imposed restrictions to the use of lead zirconate titanates, the most employed material in ferroelectric devices [1]. Strontium bismuth tantalate (SBT),SrBi{sub 2}Ta{sub 2}O{sub 9}, is an interesting alternative ferroelectric material as its polarization can be modified at low voltages and it shows limited polarization switching fatigue. However, the production of highly densified single-phase bulk SBT by conventional sintering procedures is strongly compromised by stoichiometric changes due to bismuth loss. In this work, high-pressure sintering has been exploited as an alternative procedure to obtain SBT highly-densified single-phase compacts. Using toroidal-type high-pressure chambers, samples were produced by reaction sintering of BiTaO{sub 4} and SrCO{sub 3} powders, mixed in the stoichiometric ratio corresponding to SrBi{sub 2}Ta{sub 2}O{sub 9}, at pressures of 2.5 GPa and 7.7 GPa, and temperatures up to 1250°C, during 10 min. X-ray diffraction and scanning electron microscopy associated to energy-dispersive X-ray spectroscopy were used to follow the phase composition and the microstructure evolution as a function of the processing conditions. A single-phase SBT compact, with a relative density of 93% and a homogeneous microstructure, was produced by sintering at 2.5 GPa/900°C [2]. References: [1] K. Panda, J. Mater. Sci. 44, 5049-5062 (2009). [2] Ricson R.Souza, Rejane K. Kirchner, Jose R. Jurado, Altair S. Pereira, Vania C. Sousa. Journal of Solid State Chemistry 233, 259-268 (2016). (author)

  16. Monte carlo simulation of anisotropic grain growth in liquid phase sintering

    International Nuclear Information System (INIS)

    Han, Yoon Soo; Kim, Do Kyung

    2003-01-01

    One of the key techniques in modern engineering ceramic system is microstructural control of anisotropic grain growth because grain orientation and shape proved to have an influence on mechanic, dielectric and electric behavior of ceramics. But until now, computer simulation for grain growth has not sufficiently addressed to this subject. The reason is that simulation algorithm was laborious because it has to contain mass transfer through liquid phase and especially anisotropic grain growth has to be considered based on interfacial properties in real system. The goal of present study is simulation of anisotropic grain growth in liquid phase by Q-states model. To give anisotropic inherency to grains, constraint on mobility to specific boundaries was applied. For comparison, we measured grain size distribution and deduced grain growth kinetics from relation ship between average grain size and time. As a result, the grain size distribution functions become broader and the peak height decreases as the anisotropy is increased. The growth exponent 0.67 and 0.47 found by linear fitting have slightly different values in comparison with work of Grest et al. but similar is trend to the decrease of exponent with anisotropy

  17. Processing and Characterization of Liquid-Phase Sintered NiTi Woven Structures

    Science.gov (United States)

    Erdeniz, Dinc; Weidinger, Ryan P.; Sharp, Keith W.; Dunand, David C.

    2018-03-01

    Porous NiTi is of interest for bone implants because of its unique combination of biocompatibility (encouraging osseointegration), high strength (to prevent fracture), low stiffness (to reduce stress shielding), and shape memory or superelasticity (to deploy an implant). A promising method for creating NiTi structures with regular open channels is via 3D weaving of NiTi wires. This paper presents a processing method to bond woven NiTi wire structures at contact points between wires to achieve structural integrity: (i) a slurry consisting of a blend of NiTi and Nb powders is deposited on the surface of the NiTi wires after the weaving operation; (ii) the powders are melted to create a eutectic liquid phase which collects at contact points; and (iii) the liquid is solidified and binds the NiTi woven structures. The bonded NiTi wire structures exhibited lower transformation temperatures compared to the as-woven NiTi wires because of Nb diffusion into the NiTi wires. A bonded woven sample was deformed in bending and showed near-complete recovery up to 6% strain and recovered nearly half of the deformation up to 19% strain.

  18. Sintering of Synroc D

    International Nuclear Information System (INIS)

    Robinson, G.

    1982-01-01

    Sintering has been investigated as a method for the mineralization and densification of high-level nuclear defense waste powder. Studies have been conducted on Synroc D composite powder LS04. Optimal densification has been found to be highly dependent on the characteristics of the starting material. Powder subjected to milling, which was believed to reduce the level of agglomeration and possibly particle size, was found to densify better than powder not subjected to this milling. Densities of greater than 95% of theoretical could be achieved for samples sintered at 1150 to 1200 0 C. Mineralogy was found to be as expected for Synroc D for samples sintered in a CO 2 /CO atmosphere where the Fe +2 /Fe +3 ratio was maintained at 1.0 to 5.75. In a more oxidizing, pure CO 2 atmosphere a new phase, not previously identified in Synroc D, was found

  19. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  20. Effect of low-melting point phases on the microstructure and properties of spark plasma sintered and hot deformed Nd-Fe-B alloys

    Science.gov (United States)

    Zhang, Li; Wang, Meiyu; Yan, Xueliang; Lin, Ye; Shield, Jeffrey

    2018-04-01

    The effect of adding a low melting point Pr-Cu-Al alloy during spark plasma sintering of melt-spun Nd-Fe-B ribbons is investigated. Regions of coarse grains were reduced and overall grain refinement was observed after the addition of Pr68Cu25Al7, leading to an enhancement of coercivity from 12.7 kOe to 20.4 kOe. Hot deformation of the samples in the spark plasma sintering system resulted in the formation of platelet-like grains, producing crystallographic alignment and magnetic anisotropy. The hot deformation process improved the remanence and energy product but reduced the coercivity. The decrease of coercivity resulted from grain growth and aggregation of Pr and Nd elements at triple-junction phases.

  1. Sintering Theory and Practice

    Science.gov (United States)

    German, Randall M.

    1996-01-01

    Although sintering is an essential process in the manufacture of ceramics and certain metals, as well as several other industrial operations, until now, no single book has treated both the background theory and the practical application of this complex and often delicate procedure. In Sintering Theory and Practice, leading researcher and materials engineer Randall M. German presents a comprehensive treatment of this subject that will be of great use to manufacturers and scientists alike. This practical guide to sintering considers the fact that while the bonding process improves strength and other engineering properties of the compacted material, inappropriate methods of control may lead to cracking, distortion, and other defects. It provides a working knowledge of sintering, and shows how to avoid problems while accounting for variables such as particle size, maximum temperature, time at that temperature, and other problems that may cause changes in processing. The book describes the fundamental atomic events that govern the transformation from particles to solid, covers all forms of the sintering process, and provides a summary of many actual production cycles. Building from the ground up, it begins with definitions and progresses to measurement techniques, easing the transition, especially for students, into advanced topics such as single-phase solid-state sintering, microstructure changes, the complications of mixed particles, and pressure-assisted sintering. German draws on some six thousand references to provide a coherent and lucid treatment of the subject, making scientific principles and practical applications accessible to both students and professionals. In the process, he also points out and avoids the pitfalls found in various competing theories, concepts, and mathematical disputes within the field. A unique opportunity to discover what sintering is all about--both in theory and in practice What is sintering? We see the end product of this thermal

  2. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  3. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  4. Magnetism in grain-boundary phase of a NdFeB sintered magnet studied by spin-polarized scanning electron microscopy

    Energy Technology Data Exchange (ETDEWEB)

    Kohashi, Teruo, E-mail: teruo.kohashi.fc@hitachi.com; Motai, Kumi [Central Research Laboratory, Hitachi, Ltd., Hatoyama, Saitama 350-0395 (Japan); Nishiuchi, Takeshi; Hirosawa, Satoshi [Magnetic Materials Research Laboratory, Hitachi Metals Ltd., Osaka 618-0013 (Japan)

    2014-06-09

    The magnetism in the grain-boundary phase of a NdFeB sintered magnet was measured by spin-polarized scanning electron microscopy (spin SEM). A sample magnet was fractured in the ultra-high-vacuum chamber to avoid oxidation, and its magnetizations in the exposed grain-boundary phase on the fracture surface were evaluated through the spin polarization of secondary electrons. Spin-SEM images were taken as the fracture surface was milled gradually by argon ions, and the magnetization in the grain-boundary phase was quantitatively obtained separately from that of the Nd{sub 2}Fe{sub 14}B phase. The obtained magnetization shows that the grain-boundary phase of this magnet has substantial magnetization, which was confirmed to be ferromagnetic.

  5. Flash sintering of ceramic materials

    Science.gov (United States)

    Dancer, C. E. J.

    2016-10-01

    During flash sintering, ceramic materials can sinter to high density in a matter of seconds while subjected to electric field and elevated temperature. This process, which occurs at lower furnace temperatures and in shorter times than both conventional ceramic sintering and field-assisted methods such as spark plasma sintering, has the potential to radically reduce the power consumption required for the densification of ceramic materials. This paper reviews the experimental work on flash sintering methods carried out to date, and compares the properties of the materials obtained to those produced by conventional sintering. The flash sintering process is described for oxides of zirconium, yttrium, aluminium, tin, zinc, and titanium; silicon and boron carbide, zirconium diboride, materials for solid oxide fuel applications, ferroelectric materials, and composite materials. While experimental observations have been made on a wide range of materials, understanding of the underlying mechanisms responsible for the onset and latter stages of flash sintering is still elusive. Elements of the proposed theories to explain the observed behaviour include extensive Joule heating throughout the material causing thermal runaway, arrested by the current limitation in the power supply, and the formation of defect avalanches which rapidly and dramatically increase the sample conductivity. Undoubtedly, the flash sintering process is affected by the electric field strength, furnace temperature and current density limit, but also by microstructural features such as the presence of second phase particles or dopants and the particle size in the starting material. While further experimental work and modelling is still required to attain a full understanding capable of predicting the success of the flash sintering process in different materials, the technique non-etheless holds great potential for exceptional control of the ceramic sintering process.

  6. Hydroxyapatite and zirconia composites: Effect of MgO and MgF2 on the stability of phases and sinterability

    International Nuclear Information System (INIS)

    Evis, Zafer; Usta, Metin; Kutbay, Isil

    2008-01-01

    Composites of hydroxyapatite with cubic zirconia with MgO or MgF 2 were pressureless sintered at temperatures from 1000 to 1300 deg. C. The reactions and transformations of phases were monitored with X-ray diffraction. For the hydroxyapatite and zirconia composites with MgO, calcium diffused from hydroxyapatite into the zirconia, and hydroxyapatite decomposed to tri-calcium phosphate at sintering temperatures higher than 1000 deg. C. Above about 1200 deg. C, CaZrO 3 was formed. Composites containing the MgF 2 decomposed slower than the composites with MgO which was verified by the changes in the lattice volume of the hydroxyapatite left in the composites. Fluorine ions in MgF 2 diffused into hydroxyapatite which resulted in thermal stability at high sintering temperatures. Composites with MgF 2 had higher hardness than those with MgO. The lowest porosity was found in a composite initially containing 10 wt% cubic zirconia and 5 wt% MgF 2

  7. Phase Evolution and Mechanical Properties of AlCoCrFeNiSi x High-Entropy Alloys Synthesized by Mechanical Alloying and Spark Plasma Sintering

    Science.gov (United States)

    Kumar, Anil; Swarnakar, Akhilesh Kumar; Chopkar, Manoj

    2018-05-01

    In the current investigation, AlCoCrFeNiSi x (x = 0, 0.3, 0.6 and 0.9 in atomic ratio) high-entropy alloy systems are prepared by mechanical alloying and subsequently consolidated by spark plasma sintering. The microstructural and mechanical properties were analyzed to understand the effect of Si addition in AlCoCrFeNi alloy. The x-ray diffraction analysis reveals the supersaturated solid solution of the body-centered cubic structure after 20 h of ball milling. However, the consolidation promotes the transformation of body-centered phases partially into the face-centered cubic structure and sigma phases. A recently proposed geometric model based on the atomic stress theory has been extended for the first time to classify single phase and multi-phases on the high-entropy alloys prepared by mechanical alloying and spark plasma sintering process. Improved microhardness and better wear resistance were achieved as the Si content increased from 0 to 0.9 in the present high-entropy alloy.

  8. Production of sintered alumina from powder; optimization of the sinterized parameters for the maximum mechanical resistence

    International Nuclear Information System (INIS)

    Rocha, J.C. da.

    1981-02-01

    Pure, sinterized alumina and the optimization of the parameters of sinterization in order to obtain the highest mechanical resistence are discussed. Test materials are sinterized from a fine powder of pure alumina (Al 2 O 3 ), α phase, at different temperatures and times, in air. The microstructures are analysed concerning porosity and grain size. Depending on the temperature or the time of sinterization, there is a maximum for the mechanical resistence. (A.R.H.) [pt

  9. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  10. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  11. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  12. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  13. The role of the bimodal distribution of ultra-fine silicon phase and nano-scale V-phase (AlSi2Sc2) on spark plasma sintered hypereutectic Al–Si–Sc alloys

    International Nuclear Information System (INIS)

    Raghukiran, Nadimpalli; Kumar, Ravi

    2016-01-01

    Hypereutectic Al–Si and Al–Si–Sc alloys were spark plasma sintered from corresponding gas-atomized powders. The microstructures of the Al–Si and Al–Si–Sc alloys possessed remarkably refined silicon particles in the size range of 0.38–3.5 µm and 0.35–1.16 µm respectively in contrast to the silicon particles of size greater than 100 µm typically found in conventionally cast alloys. All the sintered alloys exhibited significant ductility of as high as 85% compressive strain without failure even with the presence of relatively higher weight fraction of the brittle silicon phase. Moreover, the Al–Si–Sc alloys have shown appreciable improvement in the compressive strength over their binary counterparts due to the presence of intermetallic compound AlSi 2 Sc 2 of size 10–20 nm distributed uniformly in the matrix of those alloys. The dry sliding pin-on-disc wear tests showed improvement in the wear performance of the sintered alloys with increase in silicon content in the alloys. Further, the Al–Si–Sc ternary alloys with relatively lesser silicon content exhibited appreciable improvement in the wear resistance over their binary counterparts. The Al–Si–Sc alloys with bimodal distribution of the strengthening phases consisting of ultra-fine (sub-micron size) silicon particles and the nano-scale AlSi 2 Sc 2 improved the strength and wear properties of the alloys while retaining significant amount of ductility.

  14. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  15. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  16. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  17. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  18. Phase and Microstructural Correlation of Spark Plasma Sintered HfB2-ZrB2 Based Ultra-High Temperature Ceramic Composites

    Directory of Open Access Journals (Sweden)

    Ambreen Nisar

    2017-07-01

    Full Text Available The refractory diborides (HfB2 and ZrB2 are considered as promising ultra-high temperature ceramic (UHTCs where low damage tolerance limits their application for the thermal protection system in re-entry vehicles. In this regard, SiC and CNT have been synergistically added as the sintering aids and toughening agents in the spark plasma sintered (SPS HfB2-ZrB2 system. Herein, a novel equimolar composition of HfB2 and ZrB2 has shown to form a solid-solution which then allows compositional tailoring of mechanical properties (such as hardness, elastic modulus, and fracture toughness. The hardness of the processed composite is higher than the individual phase hardness up to 1.5 times, insinuating the synergy of SiC and CNT reinforcement in HfB2-ZrB2 composites. The enhanced fracture toughness of CNT reinforced composite (up to a 196% increment surpassing that of the parent materials (ZrB2/HfB2-SiC is attributed to the synergy of solid solution formation and enhanced densification (~99.5%. In addition, the reduction in the analytically quantified interfacial residual tensile stress with SiC and CNT reinforcements contribute to the enhancement in the fracture toughness of HfB2-ZrB2-SiC-CNT composites, mandatory for aerospace applications.

  19. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  20. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  1. Preparation of tazheranite powders by solid phase reaction and conductivity of sintered bodies. Kosoho ni yoru tazheranite no funmatsu gosei to dodensei

    Energy Technology Data Exchange (ETDEWEB)

    Kuramochi, H; Kobayashi, H; Mitamura, T [Saitama University, Saitama (Japan). Faculty of Enginering; Mori, T; Yamamura, H [Tosoh Co., Tokyo (Japan)

    1992-09-01

    Single phase powder of Ca0.2Zr(0.8-x)TixOy was synthesized by replacing a part of ZrO2 in tazheranite which belongs to cubic crystal mineral of 3 constituents of CaO/ZrO2/ TiO2 with TiO2 to study the conductivity. Predetermined powder amounts of CaCO3, ZrO2 and TiO2 were respectively weighed and mixed with wet condition, the carbonate was decomposed at 1,000 centigrade, and after mixed again with wet condition, the mixture was dried and calcined again at 1,200 to 1,300 centigrade for 2 to 20 hours to get the powder. This powder was crushed and classified to make molded items by uniaxial pressing and the items were fired at 1,400 to 1,600 centigrade for 1 to 10 hours. The conductivity of sintered bodies was measured by the complex impedance method. The following results could be obtained: The targeted powder could be synthesized at the composition range of x=0.04 to 0.10 and the apparent x of single phase area was widened to 0.15 at the firing temperature of 1,500 centigrade. The activation energies of the conductivity of sintered items were 120 to 130kJ/mol, indicating that the electric conductivity was dominated by the ion conduction and was not affected by TiO2 amount, and the formed phase. The grain resistance increased and the grain boundary resistance decreased with the increase of TiO2 amount. 17 refs., 9 figs.

  2. Drastic decrease of Ba(Zn1/3Ta2/3O3 sintering temperature by lithium salts and glass phase addition

    Directory of Open Access Journals (Sweden)

    Marinel, S.

    2011-04-01

    Full Text Available The complex perovskite oxide Ba(Zn1/3Ta2/3O3 (BZT has been studied for its attractive dielectric properties which make this material interesting for applications such as multilayer ceramics capacitors or hyperfrequency resonators. Nevertheless, BZT ceramic requires high temperature to be correctly sintered (≅1450°C, that is too high to envisage a silver co-sintering (Tf(Ag = 961°C. For this reason, the lowering of the sintering temperature of BZT by glass phase’s additions has been investigated. This material is sinterable at low temperature with combined glass phase –lithium salt additions, and exhibits, at 1MHz very low dielectric losses combined with relatively high dielectric constant and a good stability of this later versus temperature. The 5 wt% of ZnO-SiO2-B2O3 glass phase and 1 wt% of LiF added BZT sample sintered at 900°C exhibits a relative density higher than 95% and attractive dielectric properties: a dielectric constant εr of 32, low dielectrics losses (tan (δ-3 and a temperature coefficient of permittivity τε of -10ppm/°C. Their good dielectric properties and their compatibility with silver electrodes, make these ceramics suitable for L.T.C.C applications.Se ha estudiado el óxido complejo con estructura tipo perovskita Ba (Zn1/3Ta2/3 O3 (BZT. Sus atractivas propiedades dieléctricas le hacen muy interesante para aplicaciones como condensadores cerámicos multicapa o resonadores de microondas. No obstante, los cerámicos de BZT requieren temperaturas de sinterización superiores a 1450 ° C, que es muy alta para abordar un proceso de co-sinterización con electrodos de plata (Tf (Ag = 961 ° C. Para ello, se ha estudiado la bajada de la temperatura de sinterización del BZT mediante la adición de una fase vítrea. La suma combinada de la fase vítrea y la sal de litio lleva la sinterización de este material a temperaturas bajas. Las propiedades dieléctricas presentan pérdidas muy bajas, constante diel

  3. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  4. Sintering of a class F fly ash

    Energy Technology Data Exchange (ETDEWEB)

    Joseph J. Biernacki; Anil K. Vazrala; H. Wayne Leimer [Tennessee Technological University, Cookeville, TN (United States). Department of Chemical Engineering

    2008-05-15

    The sinterability of a class F fly ash was investigated as a function of processing conditions including sintering temperature (1050-1200{sup o}C) and sintering time (0-90 min). Density, shrinkage, splitting tensile strength, water absorption and residual loss on ignition (RLOI) were evaluated as measures of sintering efficiency. Scanning electron microscopy (SEM), X-ray microanalysis and X-ray diffraction was used to examine microstructure and phase development due to processing. The results show that premature densification can inhibit complete carbon removal and that carbon combustion is influenced by both internal and external mass transfer conditions. 18 refs., 10 figs., 1 tab.

  5. Modeling of sintering of functionally gradated materials

    International Nuclear Information System (INIS)

    Gasik, M.; Zhang, B.

    2001-01-01

    The functionally gradated materials (FGMs) are distinguished from isotropic materials by gradients of composition, phase distribution, porosity, and related properties. For FGMs made by powder metallurgy, sintering control is one of the most important factors. In this study sintering process of FGMs is modeled and simulated with a computer. A new modeling approach was used to formulate equation systems and the model for sintering of gradated hard metals, coupled with heat transfer and grain growth. A FEM module was developed to simulate FGM sintering in conventional, microwave and hybrid conditions, to calculate density, stress and temperature distribution. Behavior of gradated WC-Co hardmetal plate and cone specimens was simulated for various conditions, such as mean particle size, green density distribution and cobalt gradation parameter. The results show that the deformation behavior and stress history of graded powder compacts during heating, sintering and cooling could be predicted for optimization of sintering process. (author)

  6. Growth of superconducting Bi2Sr2CaCu2O8+δ films by sedimentation deposition and liquid phase sintering and annealing technique

    International Nuclear Information System (INIS)

    Manahan, R.L.C.; Sarmago, R.V.

    2006-01-01

    We report on a technique of growing highly c-axis oriented Bi 2 Sr 2 CaCu 2 O 8+δ (Bi-2212) thick films on MgO substrate using a combined sedimentation-deposition and liquid phase sintering and annealing process. The temperature profiles employed partial melting followed by rapid cooling to temperature below the melting point. Scanning electron micrographs show that the films have a smooth surface. No evidence of grain boundaries on the film's surface can be seen. The critical temperatures of the samples range from ∼67 K to ∼81 K. This method presents a quick and easy preparation for high quality epitaxial Bi-2212 films

  7. New materials through a variety of sintering methods

    Science.gov (United States)

    Jaworska, L.; Cyboroń, J.; Cygan, S.; Laszkiewicz-Łukasik, J.; Podsiadło, M.; Novak, P.; Holovenko, Y.

    2018-03-01

    New sintering techniques make it possible to obtain materials with special properties that are impossible to obtain by conventional sintering techniques. This issue is especially important for ceramic materials for application under extreme conditions. Following the tendency to limit critical materials in manufacturing processes, the use of W, Si, B, Co, Cr should be limited, also. One of the cheapest and widely available materials is aluminum oxide, which shows differences in phase composition, grain size, hardness, strain and fracture toughness of the same type of powder, sintered via various methods. In this paper the alumina was sintered using the conventional free sintering process, microwave sintering, Spark Plasma Sintering (SPS), high pressure-high temperature method (HP-HT) and High Pressure Spark Plasma Sintering (HP SPS). Phase composition analysis, by X-ray diffraction of the alumina materials sintered using various methods, was carried out. For the conventional sintering method, compacts are composed of α-Al2O3 and θ-Al2O3. For compacts sintered using SPS, microwave and HP-HT methods, χ-Al2O3 and γ-Al2O3 phases were additionally present. Mechanical and physical properties of the obtained materials were compared between the methods of sintering. On the basis of images from scanning electron microscope quantitative analysis was performed to determine the degree of grain growth of alumina after sintering.

  8. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  9. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  10. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  11. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  12. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  13. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  14. Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

    Directory of Open Access Journals (Sweden)

    Zaihua Li

    2017-07-01

    Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

  15. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  16. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  17. Microwave sintering of hydroxyapatite-based composites

    International Nuclear Information System (INIS)

    Fang, Y.; Roy, D.M.; Cheng, J.; Roy, R.; Agrawal, D.K.

    1993-01-01

    Composites of hydroxyapatite/partially stabilized zirconia (HAp/PSZ) and hydroxyapatite/silicon carbide whiskers (HAp/SiC) were sintered at 1100-1200 degrees C by microwave at 2.45 GHz. Characterization of the sintered composites was carried out by density, microstructure, phase composition, and fracture toughness measurements. The results show that although not yet fully densified, a much higher sintered density in the HAp/PSZ composite was achieved by microwave sintering than by conventional sintering at the same temperature. A relative density of 93% was achieved by 20 min. microwave processing at 1200 degrees C. Comparatively, 2 h conventional sintering of the same material at 1200 degrees C led to only 75.5% relative density. K IC of this microwave sintered HAp/PSZ of 93% density was found to be 3.88 MPa√m, which is 250% of the value for pure HAp of the same density. A further increase in K IC could be expected if full or nearly full densification was achieved. Sintering of PSZ particles in the HAp/PSZ composite was also observed in the microwave processed sample. Microwave sintering of HAp/SiC was not successful in the current study due to the oxidation of SiC in air at high temperature. 8 refs., 4 figs., 1 tab

  18. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  19. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  20. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  1. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  2. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  3. Thermoelectric Coolers with Sintered Silver Interconnects

    Science.gov (United States)

    Kähler, Julian; Stranz, Andrej; Waag, Andreas; Peiner, Erwin

    2014-06-01

    The fabrication and performance of a sintered Peltier cooler (SPC) based on bismuth telluride with sintered silver interconnects are described. Miniature SPC modules with a footprint of 20 mm2 were assembled using pick-and-place pressure-assisted silver sintering at low pressure (5.5 N/mm2) and moderate temperature (250°C to 270°C). A modified flip-chip bonder combined with screen/stencil printing for paste transfer was used for the pick-and-place process, enabling high positioning accuracy, easy handling of the tiny bismuth telluride pellets, and immediate visual process control. A specific contact resistance of (1.4 ± 0.1) × 10-5 Ω cm2 was found, which is in the range of values reported for high-temperature solder interconnects of bismuth telluride pellets. The realized SPCs were evaluated from room temperature to 300°C, considerably outperforming the operating temperature range of standard commercial Peltier coolers. Temperature cycling capability was investigated from 100°C to 235°C over more than 200 h, i.e., 850 cycles, during which no degradation of module resistance or cooling performance occurred.

  4. Development of ceramics based fuel, Phase I, Kinetics of UO{sub 2} sintering by vibration compacting of UO{sub 2} powder (Introductory report); Razvoj goriva na bazi keramike, I faza, Kinetika sinterovanja UO{sub 2} vibraciono kompaktiranje praha UO{sub 2} (Uvodni izvestaj)

    Energy Technology Data Exchange (ETDEWEB)

    Ristic, M M [Institute of Nuclear Sciences Vinca, Laboratorija za reaktorske materijale, Beograd (Serbia and Montenegro)

    1962-10-15

    After completing the Phase I of the task related to development of ceramics nuclear fuel the following reports are presented: Kinetics of UO{sub 2} sintering; Vibrational compacting and sintering of UO{sub 2}; Characterisation of of UO{sub 2} powder by DDK and TGA methods; Separation of UO{sub 2} powder.

  5. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  6. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  7. Two steps sintering alumina doped with niobia

    International Nuclear Information System (INIS)

    Gomes, L.B.; Hatzfeld, J.; Heck, M.; Pokorny, A.; Bergmann, C.P.

    2014-01-01

    In this work, high surface area commercial alumina was doped with niobia and sintered in two steps in order to obtain dense materials with lower processing temperatures. The powders were milled and uniaxially pressed (200 MPa). The first step of sintering took place at 1100°C for 3, 6, 9 and 12 hours, followed by the second step at 1350°C for 3 hours. The relative density, porosity and water absorption of the samples were determined by the Archimedes method. The crystalline phases were analyzed by X-ray Diffraction (XRD) and the morphology of the samples after sintering, evaluated by Scanning Electron Microscopy (SEM). The results indicate that the use of niobia combined with the two steps sintering promotes an increase in the density of the material, even at lower sintering temperatures. (author)

  8. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  9. Hydrothermal Cold Sintering

    Science.gov (United States)

    Kang, Xiaoyu

    Solid state sintering transforms particle compact to a physically robust and dense polycrystalline monolith driven by reduction of surface energy and curvature. Since bulk diffusion is required for neck formation and pore elimination, sintering temperature about 2/3 of melting point is needed. It thus places limitations for materials synthesis and integration, and contributes to significant energy consumption in ceramic processing. Furthermore, since surface transport requires lower temperature than bulk processes, grain growth is often rapid and can be undesired for physical properties. For these reasons, several techniques have been developed including Liquid Phase Sintering (LPS), Hot Pressing (HP) and Field Assisted Sintering Technique (FAST), which introduce either viscous melt, external pressure or electric field to speed up densification rates at lower temperature. However, because of their inherent reliability on bulk diffusion, temperatures required are often too high for integrating polymers and non-noble metals. Reduction of sintering temperature below 400 °C would require a different densification mechanism that is based on surface transport with external forces to drive volume shrinkage. Densification method combining uniaxial pressure and solution under hydrothermal condition was first demonstrated by Kanahara's group at Kochi University in 1986 and was brought to our attention by the work of Kahari, etc, from University of Oulu on densification of Li2MoO 4 in 2015. This relatively new process showed promising ultra-low densification temperature below 300 °C, however little was known about its fundamental mechanism and scope of applications, which became the main focus of this dissertation. In this work, a uniaxial hydraulic press, a standard stainless steel 1/2 inch diameter die with heating band were utilized in densifying metal oxides. Applied pressure and sintering temperature were between 100 MPa and 700 MPa and from room temperature to 300

  10. Effect of wrapped Zn plate on the densification of Al-MWCNTs composites produced by cold pressing and liquid phase sintering

    Energy Technology Data Exchange (ETDEWEB)

    Joo, M.R. [Department of Materials Science and Engineering, Yonsei University, Seoul 120-749 (Korea, Republic of); Choi, H.J. [School of Advanced Materials Engineering, Kookmin University, Seoul 136-702 (Korea, Republic of); Shin, S.E. [Department of Materials Science and Engineering, Yonsei University, Seoul 120-749 (Korea, Republic of); Bae, D.H., E-mail: donghyun@yonsei.ac.kr [Department of Materials Science and Engineering, Yonsei University, Seoul 120-749 (Korea, Republic of)

    2016-09-30

    To produce highly dense and cost-effective Al-multi-walled carbon nanotube (Al-MWCNT) composites, the composite powders are wrapped by a Zn plate and then cold-pressed. The green compacts are then sintered at 550 °C, which shows ~99%density after sintering for 24 h. During sintering, Zn atoms fill the voids at the powder boundaries by capillary action and are then dissolved into the Al matrix because of the high solubility of Zn in Al, thus assisting densification of the composite powder. The Al/Zn-based composites containing 4 vol% MWCNTs show compressive yield strength (~380 MPa) and high work hardening capacity.

  11. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  12. Sintered cobalt-rare earth intermetallic product

    International Nuclear Information System (INIS)

    Benz, M.G.

    1975-01-01

    This patent describes a sintered product having substantially stable permanent magnet properties in air at room temperature. It comprises compacted particulate cobalt--rare earth alloy consisting essentially of a Co 5 R intermetallic phase and a CoR intermetallic phase which is richer in rare earth metal content than the Co 5 R phase, where R is a rare earth metal. The Co 5 R intermetallic phase is present in an amount of at least 65 percent by weight of the sintered product and the CoR intermetallic phase which is richer in rare earth metal content than the Co 5 R phase is present in a positive amount having a value ranging up to about 35 percent by weight of the product. The sintered product has a density of at least 87 percent and has pores which are substantially noninterconnecting and wherein the component grains have an average size less than 30 microns

  13. Improving NASICON Sinterability through Crystallization under High Frequency Electrical Fields

    Directory of Open Access Journals (Sweden)

    Ilya eLisenker

    2016-03-01

    Full Text Available The effect of high frequency (HF electric fields on the crystallization and sintering rates of a lithium aluminum germanium phosphate (LAGP ion conducting ceramic was investigated. LAGP with the nominal composition Li1.5Al0.5Ge1.5(PO43 was crystallized and sintered, both conventionally and under effect of electrical field. Electrical field application, of 300V/cm at 1MHz, produced up to a 40% improvement in sintering rate of LAGP that was crystallized and sintered under the HF field. Heat sink effect of the electrodes appears to arrest thermal runaway and subsequent flash behavior. Sintered pellets were characterized using XRD, SEM, TEM and EIS to compare conventionally and field sintered processes. The as-sintered structure appears largely unaffected by the field as the sintering curves tend to converge beyond initial stages of sintering. Differences in densities and microstructure after 1 hour of sintering were minor with measured sintering strains of 31% vs. 26% with and without field, respectively . Ionic conductivity of the sintered pellets was evaluated and no deterioration due to the use of HF field was noted, though capacitance of grain boundaries due to secondary phases was significantly increased.

  14. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  15. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  16. Contribution to the study of the sintering mechanisms of uranium powders in the {alpha}, {beta}, and {gamma} phases; Contribution a l'etude des mecanismes de frittage de poudre d'uranium en phases {alpha}, {beta}, et {gamma}

    Energy Technology Data Exchange (ETDEWEB)

    Pinteau, B [Commissariat a l' Energie Atomique, Saclay (France). Centre d' Etudes Nucleaires

    1964-06-01

    This study of the sintering mechanisms of uranium powders prepared by calci-thermy has been effected using continuous dilatometric measurements of the shrinkage of samples previously compressed at room temperature in purified argon gas. The tests carried out in the {alpha}, {beta} and {gamma} phases have led to the observation that the first step of the sintering appears to be governed by a volume self-diffusion mechanism; the activation heat values found for the sintering mechanisms are close to those deduced during studies of volume self-diffusion using the direct radio-tracer method. Furthermore it has been possible to show that in the {gamma} domain a second sintering mechanism occurs involving much longer sintering times; the heats of activation are much lower and this appears to indicate that there occurs a mechanism involving pore elimination by grain boundary diffusion of the vacancies. Furthermore, the dilatometric tests have shown the simultaneous influence of two important parameters in this work: grain boundaries and the diffusion coefficients. In the second part of the report are given results concerning the examination of sintered samples by various methods with a view to elucidating their structure and some of their physical properties. In this way it has been possible, by carrying out metallographic examinations after etching by ionic bombardment, to determine the changes in the porosity of the three phases {alpha}, {beta} and {gamma}, as well as the structure and the nature of the inclusions in each sample. Density and porosity measurements have also been carried out. The variations in these two sets of results make it possible to confirm the preceding dilatometric end micro-graphic examinations. Finally a detailed dilatometric study of the samples sintered in the {gamma} phase has shown the effect of oxide layers, associated with the existence of porosity, on the amplitudes and temperatures of the allotropic transformations, these latter being

  17. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

    Science.gov (United States)

    Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

    2018-03-01

    The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

  18. Sintered cobalt-rare earth intermetallic product

    International Nuclear Information System (INIS)

    Benz, M.C.

    1975-01-01

    A process is described for preparing novel sintered cobalt--rare earth intermetallic products which can be magnetized to form permanent magnets having stable improved magnetic properties. A cobalt--rare earth metal alloy is formed having a composition which at sintering temperature falls outside the composition covered by the single Co 5 R intermetallic phase on the rare earth richer side. The alloy contains a major amount of the Co 5 R intermetallic phase and a second solid CoR phase which is richer in rare earth metal content than the Co 5 R phase. The specific cobalt and rare earth metal content of the alloy is substantially the same as that desired in the sintered product. The alloy, in particulate form, is pressed into compacts and sintered to the desired density. The sintered product is comprised of a major amount of the Co 5 R solid intermetallic phase and up to about 35 percent of the product of the second solid CoR intermetallic phase which is richer in rare earth metal content than the Co 5 R phase

  19. Mechanical characteristics of microwave sintered silicon carbide

    Indian Academy of Sciences (India)

    Unknown

    sintered process, SiC grain gets oxidized producing SiO2 (∼ 32 wt%) and deteriorates the quality of the product substantially. Partially sintered .... product, could be due to oxidation of SiC, e.g. 50% weight gain of a green SiC sample ... because, the charging current is 90° advanced in phase, ideally, with respect to the ...

  20. Sintering and microstructure of ice: a review

    International Nuclear Information System (INIS)

    Blackford, Jane R

    2007-01-01

    Sintering of ice is driven by the thermodynamic requirement to decrease surface energy. The structural morphology of ice in nature has many forms-from snowflakes to glaciers. These forms and their evolution depend critically on the balance between the thermodynamic and kinetic factors involved. Ice is a crystalline material so scientific understanding and approaches from more conventional materials can be applied to ice. The early models of solid state ice sintering are based on power law models originally developed in metallurgy. For pressure sintering of ice, these are based on work on hot isostatic pressing of metals and ceramics. Recent advances in recognizing the grain boundary groove geometry between sintering ice particles require models that use new approaches in materials science. The newer models of sintering in materials science are beginning to incorporate more realistic processing conditions and microstructural complexity, and so there is much to be gained from applying these to ice in the future. The vapour pressure of ice is high, which causes it to sublime readily. The main mechanism for isothermal sintering of ice particles is by vapour diffusion; however other transport mechanisms certainly contribute. Plastic deformation with power law creep combined with recrystallization become important mechanisms in sintering with external pressure. Modern experimental techniques, low temperature scanning electron microscopy and x-ray tomography, are providing new insights into the evolution of microstructures in ice. Sintering in the presence of a small volume fraction of the liquid phase causes much higher bond growth rates. This may be important in natural snow which contains impurities that form a liquid phase. Knowledge of ice microstructure and sintering is beneficial in understanding mechanical behaviour in ice friction and the stability of snow slopes prone to avalanches. (topical review)

  1. A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices

    Science.gov (United States)

    Feng, Hongliang; Huang, Jihua; Yang, Jian; Zhou, Shaokun; Zhang, Rong; Chen, Shuhai

    2017-07-01

    A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging. A model Ni/Ni-Sn/Ni sandwiched structure was assembled by using 30Ni-70Sn mixed powder as the reactive system. The results show that the bonding layer is composed of Ni3Sn4 and residual fine Ni particles with a small amount of Ni3Sn2 at 340°C for 240 min, which has a heat-resistant temperature higher than 790°C. The microstructural evolution and thermal characteristic of the bonding layer for various times at 300°C and 340°C were also studied, respectively. This reveals that, after isothermally holding for 240 min at 300°C and for 180 min at 340°C, Sn has been completely transformed into Ni-Sn intermetallic compounds (IMCs) and the bonding layer is mainly composed of Ni3Sn4 and residual Ni particles. The analysis result for the mechanical properties of the joint shows that the hardness of the bonding layer at 340°C for 240 min is uniform and that the average value reaches 3.66 GPa, which is close to that of the Ni3Sn4 block material. The shear test shows that, as the holding time increases from 60 min to 180 min at 340°C, because of the existence of Sn, the disparity of shear strength between room temperature and 350°C is large. But when the holding time is 180 min or longer, Sn has been completely transformed into Ni-Sn IMCs. Their performances are very similar whether at room temperature or 350°C.

  2. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  3. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  4. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  5. Effects of sintering temperature on the pyrochlore phase in PZT nanotubes and their transformation to the perovskite phase by coating with PbO multilayers.

    Science.gov (United States)

    Han, Jin Kyu; Choi, Yong Chan; Jeon, Do Hyen; Lee, Min Ku; Bu, Sang Don

    2014-11-01

    We report the phase evolution of Pb(Zr0.52Ti0.48)O3 nanotubes (PZT-NTs), from the pyrochlore to perovskite phase, with an outer diameter of about 420 nm and a wall thickness of about 10 nm. The PZT-NTs were fabricated in pores of porous anodic alumina membrane (PAM) using a spin coating of PZT sol-gel solution and subsequent annealing at 500-700 degrees C in oxygen gas. The pyrochlore phase was found to be formed at 500 degrees C, and also found not to be transformed into the perovskite phase, even though annealing was performed at higher temperatures to 700 degrees C. Elementary distribution analysis of PZT-NTs embedded in PAM reveal that Pb diffusion from nanotubes into pore walls of PAM is one of the main reasons. By employing firstly an additional PbO coating on the pyrochlore nanotubes and then subsequent annealing at 700 degrees C, we have successfully achieved an almost pure perovskite phase in nanotubes. These results suggest that PbO acts as a Pb-compensation agent in the Pb- deficient PZT-NTs. Moreover, our method can be used in the synthesis of all metal-oxide materials, including volatile elements.

  6. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  7. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  8. Sintering of nonstoichiometric UO2

    International Nuclear Information System (INIS)

    Susnik, D.; Holc, J.

    1983-01-01

    Activated sintering of UO 2 pellets at 1100 deg C is described. In CO 2 atmosphere is UO 2 is nonstoichiometric and pellets from active UO 2 powders sinter at 900 deg C to high density. At 1100 deg C the final sintered density is practically achieved at heating on sintering temperature. After reduction and cooling in H 2 atmosphere which is followed sintering in CO 2 the structure is identical to the structured UO 2 pellets sintered at high temperature in H 2 . Density of activated sintered UO 2 pellets is stable, even after additional sintering at 1800 deg C. (author)

  9. Contribution to the study of the sintering of ex-carbonyl iron in the {alpha} and {gamma} phases using the micro-fractographic technique; Contribution a l'etude du frittage du fer ex-carbonyle en phases {alpha} et {gamma} par examen des surfaces de rupture au microscope electronique

    Energy Technology Data Exchange (ETDEWEB)

    Oxley Gaborit de Montjou, M.Th. [Commissariat a l' Energie Atomique, Saclay (France). Centre d' Etudes Nucleaires

    1966-07-01

    The micro-fractographic study of the sintering of ex-carbonyl iron has shown or confirmed a number of phenomena of which the principal are as followed: Sintering in the a phase: -) existence of two stages of sintering differentiated by the type of rupture (inter or trans-crystalline); -) marked influence of the content of oxygen in the atmosphere and in the initial compressed sample on the speed of sintering; -) formation of striations on the grain-boundary surfaces and on the inner surface of pores caused by the presence of oxygen. Sintering in the {gamma} phase: -) a pronounced decrease in the speed of sintering: the grains in the initial powder remain in the granular state within the final {alpha} crystal in the iron sintered in the lower {gamma} range even after several hours of sintering; -) this granular structure can be eliminated by intermediate compression thus enabling the sintering process to proceed. A considerable decrease in the speed of sintering if the A{sub 3} point is passed one or more times in the {alpha} range sintering. A high speed sintering if the treatment in the {gamma} range is carried out at or above 1300 C. The results of this study agree with micrographic investigation as well as with dilatometric measurements and known auto-diffusion coefficients. (author) [French] L'etude microfractographique du frittage du fer ex-carbonyle a permis de mettre en evidence ou verifier plusieurs phenomenes dont les principaux sont les suivants: Pour le frittoge en phase {alpha}: -) existence de deux stades de frittage differencies par le type de rupture (inter et transcristalline); -) importance de la teneur en oxygene dans l'atmosphere et dans le comprime initial sur la vitesse de frittage; -) formation de stries dues a la presence d'oxygene sur les plans de joints et a l'interieur des pores. Pour le frittage en phase {gamma}: -) un ralentissement tres prononce de la cinetique du frittage: les granules de la poudre initiale demeurent a l'etat de

  10. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  11. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  12. Penetration and characteristics of an intergranular-liquid phase during sintering of CaSi2O5-dropped 8 mol%-yttria-stabilized zirconia estimation by impedance spectroscopy

    International Nuclear Information System (INIS)

    Jung, Young-Soo; Choi, Jung-Hae; Lee, Jong-Heun

    2004-01-01

    The grain-boundary resistivity of CaSi 2 O 5 -dropped 8 mol%-yttria-stabilized zirconia (8YSZ) was determined by impedance spectroscopy using sub-millimeter-scale electrodes. During sintering, a liquid that formed at the top surface of the specimen penetrated into the 8YSZ and induced enhanced grain growth near the surface region. The grain-boundary resistivity of the specimen surface was observed to be 150 times higher than that of the interior. The deterioration of the grain-boundary conductivity was explained in terms of the presence of an intergranular siliceous phase

  13. Densification of LSGM electrolytes using activated microwave sintering

    Science.gov (United States)

    Kesapragada, S. V.; Bhaduri, S. B.; Bhaduri, S.; Singh, P.

    Lanthanum gallate doped with alkaline rare earths (LSGM) powders were densified using an activated microwave sintering process for developing a dense stable electrolyte layer for applications in intermediate temperature-solid oxide fuel cells (IT-SOFCs). Due to heat generation in situ, the process of sintering gets activated with faster kinetics compared to a conventional sintering process. The effect of various microwave process parameters on the microstructure and phase formation was studied. The sintered pellets were characterized using scanning electron microscopy-energy dispersive analysis (SEM-EDAX), and X-ray diffraction (XRD). The density of LSGM pellets microwave sintered at 1350 °C for 20 min is greater than 95% theoretical density with a fine grained microstructure (˜2-3 μm) and without the presence of other phase(s).

  14. Sintering of beryllium oxide

    International Nuclear Information System (INIS)

    Caillat, R.; Pointud, R.

    1955-01-01

    This study had for origin to find a process permitting to manufacture bricks of beryllium oxide of pure nuclear grade, with a density as elevated as possible and with standardized shape. The sintering under load was the technique kept for the manufacture of the bricks. Because of the important toxicity of the beryllium oxide, the general features for the preliminary study of the sintering, have been determined while using alumina. The obtained results will be able to act as general indication for ulterior studies with sintering under load. (M.B.) [fr

  15. Interpretation of Frenkel’s theory of sintering considering evolution of activated pores: III. Determination of equilibrium sintering time

    Directory of Open Access Journals (Sweden)

    Yu C.L.

    2015-01-01

    Full Text Available In this article, the Frenkel’s theory of liquid-phase sintering was interpreted regarding pores as the activated volume. The mathematical model established by Nikolić et al. was used to infer the equilibrium sintering time at varied sintering temperatures during the isothermal sintering of codierite glass by Giess et al. Through the calculation, the equilibrium time at 800ºC, 820ºC, 840ºC and 860ºC is inferred to be 7014.42mins, 1569.65mins, 368.92mins and 114.61mins, respectively. The equilibrium time decreases as the temperature increases. And the theoretical value is in good accordance with the experimental results. Thus, the model established by Nikolić et al. can be applied successfully to predict the equilibrium sintering time of the cordierite glass at varied temperatures during isothermal sintering.

  16. Pressureless spark plasma–sintered Bioglass®45S5 with enhanced mechanical properties and stress–induced new phase formation

    Czech Academy of Sciences Publication Activity Database

    Bertolla, Luca; Dlouhý, Ivo; Tatarko, P.; Viani, A.; Mahajan, A.; Chlup, Zdeněk; Reece, M.J.; Boccaccini, A. R.

    2017-01-01

    Roč. 37, č. 7 (2017), s. 2727-2736 ISSN 0955-2219 R&D Projects: GA MŠk LM2015069; GA ČR GA14-11234S; GA MŠk(CZ) LQ1601 Institutional support: RVO:68081723 Keywords : Biomaterials * Bioglass * Spark plasma sintering * Mechanical propertiesa Subject RIV: JH - Ceramics, Fire-Resistant Materials and Glass OBOR OECD: Ceramics Impact factor: 3.411, year: 2016

  17. Science of sintering

    International Nuclear Information System (INIS)

    Kuczynski, G.

    1977-01-01

    Although the methods of integration of materials by sintering, have been used since the early history of humanity, the actual understanding of the process involved came only in the last three decades. As in the most human endeavors, the art preceded theory. The comprehension of the elementary processes occuring during sintering comes from the studies of model system. Although the elementary processes occuring during sintering are today quite well understood, the problem of shrinkage of a powder compact which was at the origin of Sintering Science is still far from solved. This is due to the complexity of the internal geometry of the compacts. The recent attempts to apply statistics to this problem, seem to offer some promise

  18. Uranium dioxide. Sintering test

    International Nuclear Information System (INIS)

    Anon.

    Description of a sintering method and of the equipment devoted to uranium dioxide powder caracterization and comparison between different samples. Determination of the curve giving specific volume versus pressure and micrographic examination of a pellet at medium pressure [fr

  19. Kinetics of UO2 sintering

    International Nuclear Information System (INIS)

    Ristic, M.M.

    1962-01-01

    Detailed conclusions related to the UO 2 sintering can be drawn from investigating the kinetics of the sintering process. This report gives an thorough analysis of the the data concerned with sintering available in the literature taking into account the Jander and Arrhenius laws. This analysis completes the study of influence of the O/U ratio and the atmosphere on the sintering. Results presented are fundamentals of future theoretical and experimental work related to characterisation of the UO 2 sintering process

  20. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  1. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  2. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  3. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  4. Comparison of Ti(C,N)-based cermets processed by hot-pressing sintering and conventional pressureless sintering

    International Nuclear Information System (INIS)

    Xu, Qingzhong; Ai, Xing; Zhao, Jun; Qin, Weizhen; Wang, Yintao; Gong, Feng

    2015-01-01

    Highlights: • The HP sintered Ti(C,N)-based cermets exhibit high hardness with fine grain size. • The PLS sintered cermets possess high mechanical properties with low porosity. • The applied pressure can rearrange particles and contribute to grain refinement. • The heating rate can greatly affect the solid and liquid phase sintering of cermets. - Abstract: A suitable sintering method is important to obtain the Ti(C,N)-based cermets with superior properties. In this paper, Ti(C,N)-based cermets were fabricated by hot-pressing sintering (HP) and conventional pressureless sintering (PLS) technology, respectively, to investigate the influence of different sintering methods on the microstructure and mechanical properties of cermets materials. The microstructure, fracture morphology, indention cracks and phase composition were observed and detected using scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The transverse rupture strength (TRS), Vickers hardness (HV) and fracture toughness (K IC ) were also measured. The results reveal that all of the Ti(C,N)-based cermets exhibit core–rim microstructures with black cores, white cores and grey rims embedded into metal binder phases. The grain size of the samples fabricated by HP is much finer and the structure is more compact than those fabricated by PLS, while there exist pores in the HP sintered samples. The sintering process has no influence on the phase composition of cermets, but affects the phase content and crystallinity. The samples fabricated by PLS present higher transverse rupture strength, fracture toughness and density than samples fabricated by HP. However, the HP sintered samples possess a higher hardness

  5. Study of ceramics sintering under high pressures

    International Nuclear Information System (INIS)

    Kunrath Neto, A.O.

    1990-01-01

    A systematic study was made on high pressure sintering of ceramics in order to obtain materials with controlled microstructure, which are not accessible by conventional methods. Some aspects with particular interest were: to achieve very low porosity, with fine grains; to produce dispersed metastable and denser phases which can act as toughening agents; the study of new possibilities for toughening enhancement. (author)

  6. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  7. Microwave sintering of nano size powder β-TCP bioceramics

    Directory of Open Access Journals (Sweden)

    Mirhadi B.

    2014-01-01

    Full Text Available A nano sized beta tricalcium phosphate (β-TCP powder was conventional sintered (CS and microwave sintered (MW, in order to obtain dense β-TCP ceramics. In this work the effect of microwave sintering conditions on the microstructure, phase composition and mechanical properties of materials based on tricalcium phosphate (TCP was investigated by SEM (scanning electron microscopyand XRD(X-ray diffraction and then compared with conventional sintered samples. Nano-size β-TCP powders with average grain size of 80 nm were prepared by the wet chemical precipitation method with calcium nitrate and diammonium hydrogen phosphate as calcium and phosphorus precursors, respectively. The precipitation process employed was also found to be suitable for the production of submicrometre β-TCP powder in situ. The β-TCP samples microwave (MW sintered for 15 min at 1100°C, with average grain size of 3μm, showed better densification, higher density and certainly higher hardness than samples conventionally sintered for 2 h at the same temperature. By comparing sintered and MW sintered β-TCP samples, it was concluded that MW sintered β-TCP samples have superior mechanical properties.

  8. Ir-based refractory superalloys by pulse electric current sintering (PECS) process (II prealloyed powder)

    Science.gov (United States)

    Huang, C.; Yamabe-Mitarai, Y.; Harada, H.

    2002-02-01

    Five prealloyed powder samples prepared from binary Ir-based refractory superalloys were sintered at 1800 °C for 4 h by Pulse Electric Current Sintering (PECS). No metal loss was observed during sintering. The relative densities of the sintered specimens all exceeded 90% T.D. The best one was Ir-13% Hf with the density of 97.82% T.D. Phases detected in sintered samples were in accordance with the phase diagram as expected. Fractured surfaces were observed in two samples (Ir-13% Hf and Ir-15% Zr). Some improvements obtained by using prealloyed powders instead of elemental powders, which were investigated in the previous studies, were presented.

  9. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

    2014-01-05

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

  10. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    International Nuclear Information System (INIS)

    Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

    2014-01-01

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

  11. Microstructure and properties of TiC-high manganese steel cermet prepared by different sintering processes

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Zhi; Lin, Tao, E-mail: lintao@ustb.edu.cn; He, Xinbo; Shao, Huiping; Zheng, Jianshu; Qu, Xuanhui

    2015-11-25

    In the paper, the TiC −50 wt.% high manganese steel cermet was made with different sintering processes including vacuum sintering, hot pressing, microwave sintering and spark plasma sintering (SPS). The microstructure, porosity and fracture morphology of the samples were analyzed with scanning electron microscopy (SEM). Phase analysis was carried out using X-ray diffraction (XRD). The density, hardness, transverse rupture strength (TRS) and wear resistance were investigated for the effect of the sintering processes. The results showed that the core–shell structure was not clearly observed for the TiC particles in microstructures and the high manganese steel matrix is BCC structure. Hot pressing, microwave sintering and SPS are useful processes for densification of the cermet. Nearly full density and higher hardness can be reached by these three processes at a lower sintering temperature and in a shorter sintering time. However, higher TRS can be reached by means of alloying completely in a longer sintering time, for example vacuum sintering. Pre-sintering in a long sintering time at a lower sintering temperature is also useful for improving the TRS. Finally, vacuum sintering is an effective process for producing this composite with the lowest cost in the mass production. - Highlights: • TiC-high manganese steel cermets were prepared by four sintering processes. • The core–shell structure was not clearly observed for the TiC particles in microstructures. • Th high manganese steel matrix is BCC structure instead of FCC structure. • Pre-sintering before microwave sintering is also useful for improving the TRS. • Vacuum sintering can be effective way for prepare this cermet in mass production.

  12. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  13. Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties

    Energy Technology Data Exchange (ETDEWEB)

    Alayli, N. [Université Paris 13, Sorbonne Paris Cité, Laboratoire des Sciences des Procédés et des Matériaux, Centre National de la Recherche Scientifique, Unité Propre de Recherche 3407, 99 avenue Jean Baptiste Clément, F-93430 Villetaneuse (France); Université de Versailles-Saint-Quentin-en-Yvelines, Sorbonne Universités, Université Pierre et Marie Curie, Université Paris 06, Centre National de la Recherche Scientifique/INSU, Laboratoire Atmosphères Milieux Observations Spatiales-IPSL, Quartier des Garennes, 11 Boulevard d' Alembert, F-78280 Guyancourt (France); Schoenstein, F., E-mail: frederic.schoenstein@univ-paris13.fr [Université Paris 13, Sorbonne Paris Cité, Laboratoire des Sciences des Procédés et des Matériaux, Centre National de la Recherche Scientifique, Unité Propre de Recherche 3407, 99 avenue Jean Baptiste Clément, F-93430 Villetaneuse (France); Girard, A. [Office National d' Étude et de Recherches Aérospatiales, Laboratoire d' Étude des Microstructures, Centre National de la Recherche Scientifique, Unité Mixte de Recherche 104, 29 avenue de la Division Leclerc, F-92322 Châtillon (France); and others

    2014-11-14

    Processing parameters of Spark Plasma Sintering (SPS) technique were constrained to process nano sized silver particles bound in a paste for interconnection in power electronic devices. A novel strategy combining debinding step and consolidation processes (SPS) in order to elaborate nano-structured silver bulk material is investigated. Optimum parameters were sought for industrial power electronics packaging from the microstructural and morphological properties of the sintered material. The latter was studied by Scanning Electron Microscope (SEM) and X-Ray Diffraction (XRD) to determine the density and the grain size of crystallites. Two types of samples, termed S1 (bulk) and S2 (multilayer) were elaborated and characterized. They are homogeneous with a low degree of porosity and a good adhesion to the substrate and the process parameters are compatible with industrial constraints. As the experimental results show, the mean crystallite size is between 60 nm and 790 nm with a density between 50% and 92% resulting in mechanical and thermal properties that are better than that of lead free solder. The best SPS sintering parameters, the applied pressure, the temperature and the processing time were determined as being 3 MPa, 300 °C and 1 min respectively when the desizing time of the preprocessing step was kept below 5 min at 150 °C. Using these processing parameters, acceptable for automotive packaging industry, a semi-conductor power chip was successfully connected to a metalized substrate by sintered silver with thermal and electrical properties better than those of current solders and with thermomechanical properties allowing absorption of thermoplastic stresses. - Highlights: • The sintered silver joints have nanometric structure. • The grain growth was controlled by the SPS sintering parameters. • New connection material improve thermal and electrical properties of current solders. • Interconnection's plastic strain can absorb thermo

  14. Scattering effect of the well-ordered MgB{sub 4} impurity phase in two-step sintered polycrystalline MgB{sub 2} with glycine addition

    Energy Technology Data Exchange (ETDEWEB)

    Cai, Qi; Liu, Yongchang; Guo, Qianying; Ma, Zongqing [Tianjin University, State Key Lab of Hydraulic Engineering Simulation and Safety, School of Materials Science and Engineering, Tianjin (China)

    2017-04-15

    Glycine-doped MgB{sub 2} bulk was prepared by two-step sintering in this study, first at 750 C and then 900 C. The MgB{sub 4} particles are induced to precipitate where the dislocations concentrated after C substitution or along the steps of screw dislocation during crystal growth, forming ordered MgB{sub 4} arrays throughout the MgB{sub 2} grain. By means of atomic force microscope, the detected magnetic domains are arranged in agreement with the ordered MgB{sub 4} particles after the measurement of magnetic hysteresis loop, which supported that the nano-scale MgB{sub 4} domain structure brought strong scattering effects and indicated that atomic force microscopy could test the role of the impurities. As a result, the extrapolating upper critical field H{sub c2}(0 K) is enhanced to 22.8 T for the sample with ordered MgB{sub 4}, while only 18.1 T for the un-doped sample underwent the same sintering program. Besides, carbon substitution contributed to the enhancement of H{sub c2} as well. (orig.)

  15. Sintering of composite

    International Nuclear Information System (INIS)

    Bordia, R.K.; Scherer, G.W.

    1988-01-01

    Several constitutive laws have been used in the literature to predict the response of sintering bodies under external and internal stress fields. These analyses are based on the assumptions of linear and isotropic behavior. The authors provide a critical examination of these equations and show that some of the available constitutive laws predict a negative Poisson's ratio. These laws have been used to analyze sintering of ceramic matrix composites with rigid inclusions and predict large values of the internal stresses and significant retardation of the densification of composites. Since a negative value of Poisson's ratio has never been observed in sinter - forging experiments, the authors conclude that either the stresses are small (as predicted by the constitutive laws with positive Poisson's ratio) or the basic assumption of linearity and isotropy used in all the analyses is incorrect. Finally, the authors discuss some phenomena that could be important in understanding the densification of ceramic matrix composites

  16. Rare earth elements in sinters from the geothermal waters (hot springs) on the Tibetan Plateau, China

    Science.gov (United States)

    Feng, Jin-Liang; Zhao, Zhen-Hong; Chen, Feng; Hu, Hai-Ping

    2014-10-01

    The mineralogical and geochemical composition of sinters from the geothermal areas on the Tibetan Plateau was determined. They occur as siliceous, salty and calcareous sinters but biogenic siliceous sinters were also found. The analyses indicate that there are no distinct inter -element relationships between individual rare earth elements (REEs) and other elements. Formed from the same geothermal water, the mineralogical and chemical composition of the sinters is influenced by their genesis and formation conditions. The REE distributions depend on the origin of the sinters. Fe-Mn phases in sinters tend to scavenge more REEs from geothermal water. Neither the REE fractionation nor the Ce anomaly seems to be associated with Fe-Mn phases in the sinters. The fourth tetrads of some sinters display weak W-type (concave) effects. In contrast, the third tetrads present large effects in some sinters due to positive Gd anomalies. The origin of the positive Eu anomalies in some sinters seems to be caused by preferential dissolution of feldspars during water-rock interaction. The complexing ligands in geothermal water may contribute significantly to the fractionation of REEs in sinters. The dominant CO32- and HCO3- complexing in geothermal water favors enrichment of heavy REEs in calcareous sinters.

  17. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  18. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  19. Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

    International Nuclear Information System (INIS)

    Gao Fan; Rajathurai, Karunaharan; Cui, Qingzhou; Zhou, Guangwen; NkengforAcha, Irene; Gu Zhiyong

    2012-01-01

    Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using a flux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosolder melting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale to microscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of the microscale solder balls formed on Si substrate was measured by direct electron microscopic imaging. These results provide new insights into micro- and nanoscale phase transition and liquid droplet coalescence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ball grid array formation.

  20. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    Energy Technology Data Exchange (ETDEWEB)

    Gómez, Virginia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Irusta, Silvia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Balas, Francisco [Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Instituto de Carboquímica – Consejo Superior de Investigaciones Científicas (ICB-CSIC), 50018 Zaragoza (Spain); Santamaria, Jesus, E-mail: Jesus.Santamaria@unizar.es [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain)

    2013-07-15

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10{sup 6} particles/cm{sup 3}) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals.

  1. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    International Nuclear Information System (INIS)

    Gómez, Virginia; Irusta, Silvia; Balas, Francisco; Santamaria, Jesus

    2013-01-01

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10 6 particles/cm 3 ) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals

  2. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  3. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  4. Growth of superconducting Bi{sub 2}Sr{sub 2}CaCu{sub 2}O{sub 8+{delta}} films by sedimentation deposition and liquid phase sintering and annealing technique

    Energy Technology Data Exchange (ETDEWEB)

    Manahan, R.L.C. [Condensed Matter Physics Laboratory, National Institute of Physics, University of the Philippines, Llamas Science Hall, Rm. 3122, E. Quirino Street, Diliman, Quezon City 1101 (Philippines)]. E-mail: rcmanahan@nip.upd.edu.ph; Sarmago, R.V. [Condensed Matter Physics Laboratory, National Institute of Physics, University of the Philippines, Llamas Science Hall, Rm. 3122, E. Quirino Street, Diliman, Quezon City 1101 (Philippines)

    2006-10-01

    We report on a technique of growing highly c-axis oriented Bi{sub 2}Sr{sub 2}CaCu{sub 2}O{sub 8+{delta}} (Bi-2212) thick films on MgO substrate using a combined sedimentation-deposition and liquid phase sintering and annealing process. The temperature profiles employed partial melting followed by rapid cooling to temperature below the melting point. Scanning electron micrographs show that the films have a smooth surface. No evidence of grain boundaries on the film's surface can be seen. The critical temperatures of the samples range from {approx}67 K to {approx}81 K. This method presents a quick and easy preparation for high quality epitaxial Bi-2212 films.

  5. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  6. Hexagonal OsB2: Sintering, microstructure and mechanical properties

    International Nuclear Information System (INIS)

    Xie, Zhilin; Lugovy, Mykola; Orlovskaya, Nina; Graule, Thomas; Kuebler, Jakob; Mueller, Martin; Gao, Huili; Radovic, Miladin; Cullen, David A.

    2015-01-01

    Highlights: • ReB 2 -type hexagonal OsB 2 powder has been densified by spark plasma sintering. • The sintered OsB 2 contains ∼80 wt.% hexagonal and ∼20 wt.% orthorhombic phases. • The average grain size of the sintered OsB 2 sample was 0.56 ± 0.26 μm. • H = 31 ± 9 GPa and E = 574 ± 112 GPa measured by nanoindentation. - Abstract: The metastable high pressure ReB 2 -type hexagonal OsB 2 bulk ceramics was produced by spark plasma sintering. The phase composition, microstructure, and mechanical behavior of the sintered OsB 2 were studied by X-ray diffraction, optical microscopy, TEM, SEM, EDS, and nanoindentation. The produced ceramics was rather porous and contained a mixture of hexagonal (∼80 wt.%) and orthorhombic (∼20 wt.%) phases as identified by X-ray diffraction and EBSD analysis. Two boron-rich phases, which do not contain Os, were also identified by TEM and SEM/EDS analysis. Nanoindentation measurements yielded a hardness of 31 ± 9 GPa and Young’s modulus of 574 ± 112 GPa, indicating that the material is rather hard and very stiff; however, it is very prone to crack formation and propagation, which is indicative of a very brittle nature of this material. Improvements in the sintering regime are required in order to produce dense, homogeneous and single phase hexagonal OsB 2 bulk ceramics

  7. Nanospot soldering polystyrene nanoparticles with an optical fiber probe laser irradiating a metallic AFM probe based on the near-field enhancement effect.

    Science.gov (United States)

    Cui, Jianlei; Yang, Lijun; Wang, Yang; Mei, Xuesong; Wang, Wenjun; Hou, Chaojian

    2015-02-04

    With the development of nanoscience and nanotechnology for the bottom-up nanofabrication of nanostructures formed from polystyrene nanoparticles, joining technology is an essential step in the manufacturing and assembly of nanodevices and nanostructures in order to provide mechanical integration and connection. To study the nanospot welding of polystyrene nanoparticles, we propose a new nanospot-soldering method using the near-field enhancement effect of a metallic atomic force microscope (AFM) probe tip that is irradiated by an optical fiber probe laser. On the basis of our theoretical analysis of the near-field enhancement effect, we set up an experimental system for nanospot soldering; this approach is carried out by using an optical fiber probe laser to irradiate the AFM probe tip to sinter the nanoparticles, providing a promising technical approach for the application of nanosoldering in nanoscience and nanotechnology.

  8. Translucence in dental prosthesis based on zirconia ceramics: effect of the sintering parameters

    International Nuclear Information System (INIS)

    Santos, C.

    2011-01-01

    In this work the translucence of Zirconia dental ceramics was evaluated as function of sintering conditions (temperature and isothermal holding time). Samples with 15x15x1mm, were sintered at 1450 to 1600 deg C, with holding of 2h or 4h. Sintered samples were characterized by relative density, crystalline phases and microstructural aspects. Full density was obtained in samples sintered at 1530 and 1600 deg C, which presented higher grain sizes. Na increasing of translucence was observed in samples sintered at 1530 and 1600, correlating these properties with increasing of density and grain size of the samples. (author)

  9. Sintering of SiC ceramics, via liquid phase, with Al{sub 2}O{sub 3}-Yb{sub 2}O{sub 3} additives; Sinterizacao de ceramicas de SiC, via fase liquida, com aditivos de Al{sub 2}O{sub 3}-Yb{sub 2}O{sub 3}

    Energy Technology Data Exchange (ETDEWEB)

    Atilio, I.; Oliveira, M.R.; Garcia, G.C.R.; Ribeiro, S., E-mail: isabelaatilio@hotmail.com [Universidade de Sao Paulo (USP/EEL), Lorena, SP (Brazil). Escola de Engenharia. Dept. de Engenharia de Materiais

    2012-07-01

    The objective of this work was to study the sintering of SiC, through liquid phase, using the additive system Al{sub 2}O{sub 3} and Yb{sub 2}O{sub 3} for the first time. The samples were sintered at temperatures of 1900, 1950 and 2000 deg C for 60 minutes. The melting point of the system was determined according to DIN 51730. It has been found the ability of wetting of SiC in the system. The densification results were: 86,36% at 1900 deg C, 88,25% at 1950 deg C and 82,09% at 2000 deg C. The average linear shrinkage was approximately 17%. There was a conversion of β-SiC in α-SiC at all temperatures and sintering phase formation Yb{sub 3}Al{sub 5}O{sub 12}. The melting temperature was 1850 deg C for de system, consistent with the value in the phase diagram, and the wetting angle of 20 deg. The system (Yb{sub 2}O{sub 3}-Al{sub 2}O{sub 3}) is promising to make liquid phase sintering of SiC, for presenting a good result of wettability. (author)

  10. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  11. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  12. Improving NASICON Sinterability through Crystallization under High-Frequency Electrical Fields

    Energy Technology Data Exchange (ETDEWEB)

    Lisenker, Ilya; Stoldt, Conrad R., E-mail: stoldt@colorado.edu [Department of Mechanical Engineering, University of Colorado Boulder, Boulder, CO (United States)

    2016-03-31

    The effect of high-frequency (HF) electric fields on the crystallization and sintering rates of a lithium aluminum germanium phosphate (LAGP) ion conducting ceramic was investigated. LAGP with the nominal composition Li{sub 1.5}Al{sub 0.5}Ge{sub 1.5}(PO{sub 4}){sub 3} was crystallized and sintered, both conventionally and under effect of electrical field. Electrical field application, of 300 V/cm at 1 MHz, produced up to a 40% improvement in sintering rate of LAGP that was crystallized and sintered under the HF field. Heat sink effect of the electrodes appears to arrest thermal runaway and subsequent flash behavior. Sintered pellets were characterized using X-ray diffraction, scanning electron microscope, TEM, and electrochemical impedance spectroscopy to compare conventionally and field-sintered processes. The as-sintered structure appears largely unaffected by the field as the sintering curves tend to converge beyond initial stages of sintering. Differences in densities and microstructure after 1 h of sintering were minor with measured sintering strains of 31 vs. 26% with and without field, respectively. Ionic conductivity of the sintered pellets was evaluated, and no deterioration due to the use of HF field was noted, though capacitance of grain boundaries due to secondary phases was significantly increased.

  13. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  14. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  15. Non-pressurized sintered silicon carbide with titanium carbide reinforcement

    International Nuclear Information System (INIS)

    Adler, J.

    1992-01-01

    A non-pressurized compression of SiC-TiC composite materials can be achieved via liquid phase sintering by the application of oxidic additives. Materials with TiC proportions up to 40% by volume of TiC and densities of 97 to 98% TD were produced at sintering temperatures around 1875 C. With SiC sintered in the liquid phase an increase of toughness at fracture of 80% compared with conventionally non-pressurized sintered SiC was achieved with B/C additive. No further increase could be achieved by the addition of TiC particles. However, the oxidation resistance at 1200 C was worsened. (orig.) [de

  16. Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants

    Science.gov (United States)

    Zhao, Xingke; Xie, Feiming; Fan, Jinsheng; Liu, Dayong; Huang, Jihua; Chen, Shuhai

    2018-06-01

    With the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn-3Ag-0.5Cu-xP solder alloys, with various drop sizes as well as different phosphorus (P) content, was evaluated using the Dorsey method based on the sessile drop test. The results show that the accuracy of the surface tension calculations depends on both of sessile drop size and the liquid metal composition. With a proper drop size, in the range of 4.5 mm to 5.3 mm in equivalent spherical diameters, the deviation of the surface tension calculation can be limited to 1.43 mN·m-1 and 6.30 mN·m-1 for SnAgCu and SnAgCu-P, respectively. The surface tension of SnAgCu-xP solder alloys decreases quickly to a minimum value when the P content reaches 0.5 wt% and subsequently increases slowly with the P content further increasing. The formation of a P-enriched surface layer and Sn4P3 intermetallic phases is regarded to be responsible for the decreasing and subsequent increasing of surface tension, respectively.

  17. Effects of the sintering temperature on the diffused phase transition and the spin-glassy behavior in Pb0.95La0.05(Fe2/3W1/3)0.65Ti0.35O3 ceramics

    International Nuclear Information System (INIS)

    Hong, Cheng-Shong; Chu, Sheng-Yuan; Hsu, Chi-Cheng

    2010-01-01

    In this paper, the effect of the sintering temperature on the low-field dielectric behavior of nonstoichiometric Pb 0.95 La 0.05 (Fe 2/3 W 1/3 ) 0.65 Ti 0.35 O 3 relaxor ferroelectrics is investigated. The x-ray patterns and the scanning electron microscope images are used to detect the pyrochlore phase and the perovskite structure. The electric properties of the resistivity, the space charge polarization, the temperature-dependent dielectric constant and dielectric loss are discussed. The diffused phase transition and the ordering state are fitted and discussed by using the empirical law and two ordering models. Furthermore, the glassy behavior is determined by using the Curie-Weiss law and the spin-glass model. According to the experimental data and fitting results, the dielectric picture is changed from the short range order relaxorlike behavior to the long range order normal ferroelectric state as increasing the sintering temperature and the glassy behavior is weakened at the lowest and highest sintering temperature at which the pyrochlore phase PWO 4 is induced. Therefore, it is suggested that the 1:1 ordered domain is enhanced by increasing the sintering temperature and the glassy behavior is related to not only the ordering degree also the polar defect pairs. For more ordering degree and polar defect pairs, the glassy is weakened and the correlation of neighboring polar microregions is enhanced.

  18. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  19. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  20. PHASE EVOLUTION AND MICROWAVE DIELECTRIC PROPERTIES OF (Li0.5Bi0.5)(W1-xMox)O4(0.0 ≤ x ≤ 1.0) CERAMICS WITH ULTRA-LOW SINTERING TEMPERATURES

    Science.gov (United States)

    Zhou, Di; Guo, Jing; Yao, Xi; Pang, Li-Xia; Qi, Ze-Ming; Shao, Tao

    2012-11-01

    The (Li0.5Bi0.5)(W1-xMox)O4(0.0 ≤ x ≤ 1.0) ceramics were prepared via the solid state reaction method. The sintering temperature decreased almost linearly from 755°C for (Li0.5Bi0.5)WO4 to 560°C for (Li0.5Bi0.5)MoO4. When the x≤0.3, a wolframite solid solution can be formed. For x = 0.4 and x = 0.6 compositions, both the wolframite and scheelite phases can be formed from the X-ray diffraction analysis, while two different kinds of grains can be revealed from the scanning electron microscopy and energy-dispersive X-ray spectrometer results. High performance of microwave dielectric properties were obtained in the (Li0.5Bi0.5)(W0.6Mo0.4)O4 ceramic sintered at 620°C with a relative permittivity of 31.5, a Qf value of 8500 GHz (at 8.2 GHz), and a temperature coefficient value of +20 ppm/°C. Complex dielectric spectra of pure (Li0.5Bi0.5)WO4 ceramic gained from the infrared spectra were extrapolated down to microwave range, and they were in good agreement with the measured values. The (Li0.5Bi0.5)(W1-xMox)O4(0.0 ≤ x ≤ 1.0) ceramics might be promising for low temperature co-fired ceramic technology.

  1. Influence of sintering atmospheres on the aluminium sintering characteristics

    International Nuclear Information System (INIS)

    Mintzer, S.; Bermudez Belkys, S.

    1993-01-01

    This paper describes the aluminium powder (Al) cool compacted (at 95% from theoretical density) which was sintered at 903 K during 4 hours at different atmospheres; oxidizing (air), inert Argon (Ar), Nitrogen (N) and high vacuum. The results obtained show: a) porosity measurements; greater porosity when sintering in Ar and air. b) Metallographic and Scanning observations: many fine pores (< 1 μm) and pore lines distributed at random, at air sintering and greater pores distributed preferentially near the surface, in Ar and N atmospheres. c) Dimensional changes: tendency to contraction of the samples at N and vacuum sintering and expansion in Ar or air. d) Mechanical properties: greater strength and fluence stresses at air and N sintering. The analysis of the results is performed considering sintering modes in presence of an oxide layer and dropped inert gases. (Author)

  2. Addition of niobia in alumina and its effects at its sintered microstructure

    International Nuclear Information System (INIS)

    Gomes, L.B.; Lima, M.M.O.; Pereira, A.S.; Bergmann, C.P.

    2016-01-01

    In this work, niobia was used as sintering additive of alumina in concentrations of 0.15, 0.5, 2 and 4 wt%. Homogenized powders was uniaxially pressed (200MPa) forming ceramic pellets with 10 mm diameter. The green bodies were sintered at 1400, 1500 and 1600°C for 60 minutes using a heating rate of 2,5°C.min -1 . After sintering, the specimens were polished using diamond paste with different particle sizes. The specimen's microstructure was analyzed by Scanning Electron Microscopy (SEM) and crystalline phases were determined by X-ray Diffraction (XRD). Results indicate that when niobia and alumina react they form AlNbO4 by liquid phase sintering. This phase is located among alumina grain. It was also verified that niobia addition promotes grain growth, acting as sintering agent, and this effect grows as niobia content and sintering temperature increase. (author)

  3. One step sintering of homogenized bauxite raw material and kinetic study

    Science.gov (United States)

    Gao, Chang-he; Jiang, Peng; Li, Yong; Sun, Jia-lin; Zhang, Jun-jie; Yang, Huan-ying

    2016-10-01

    A one-step sintering process of bauxite raw material from direct mining was completed, and the kinetics of this process was analyzed thoroughly. The results show that the sintering kinetics of bauxite raw material exhibits the liquid-phase sintering behavior. A small portion of impurities existed in the raw material act as a liquid phase. After X-ray diffraction analyses, scanning electron microscopy observations, and kinetics calculations, sintering temperature and heating duration were determined as the two major factors contributing to the sintering process and densification of bauxite ore. An elevated heating temperature and longer duration favor the densification process. The major obstacle for the densification of bauxite material is attributed to the formation of the enclosed blowhole during liquid-phase sintering.

  4. Photoacoustic spectroscopy investigation of sintered zinc-tin-oxide ceramics

    Directory of Open Access Journals (Sweden)

    Ivetić Tamara B.

    2007-01-01

    Full Text Available In this paper the changes that occurred in differently activated ZnO-SnO2 and sintered samples were investigated using photoacoustic spectroscopy. ZnO and SnO2 powders, mixed in the molar ratio 2:1, were mechanically activated in a planetary ball mill for 10-160 min. The mixtures were pres­sed and isothermally sintered at 1300°C for two hours. X-ray diffraction analysis of the obtained sintered samples was performed in order to investigate changes of the phase composition and confirmed only the presence of a pure zinc stannate (Zn2SnO4 phase in all the sintered samples as a result of the solid state reaction and reaction sintering between the starting ZnO and SnO2 powders. The microstructure of the sintered sam­ples was examined by scanning electron microscopy and showed that mechanical activation leads to the formation of a structure with reduced particle size which accelerates spinel formation. Grain growth of the spinel phase slows down the densification process and together with the agglomerates formed during mechanical activation causes the appearance of a porous microstructure. The photoacoustic (PA phase and amplitude spectra of the sintered samples were recorded as a function of the chopped frequency of the laser beam used (red laser with a power of 25 mW, λ=632 nm in a thermal-transmission detection configuration. PA experimental data were analyzed using the Rosenzweig-Gersho thermal-piston model, which enabled determination of the thermal diffusivity, ZT (m2s-1, diffusion coefficient of the minority free carriers D (m2s-1 and the optical absorption coefficient (m-1. The detected differences of the measured thermal-electrical properties of the obtained Zn2SnO4 ceramics indicate changes in the material induced by the different preparation procedure of the starting powders before the sintering process.

  5. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  6. Evaluation of Sintering Behavior of Premix Al-Zn-Mg-Cu Alloy Powder

    Directory of Open Access Journals (Sweden)

    Haris Rudianto

    2015-01-01

    Full Text Available Sintering of light aluminium alloys powder has been investigated as a way to substitute steels in automotive and aerospace industries. Premix Al-5.5Zn-2.5Mg-0.5Cu composite powder called Alumix 431D was analyzed in this research. Sintering was carried out under ultra high purity nitrogen gas and before reaching sintering temperature, green samples were delubricated at 400°C for 30 min. The powder possesses high sinterability by reaching 96% relative density at 580°C sintering temperature. Formation of liquid phase seems to support achieving high sintering density. Optimum mechanical properties also were obtained under those conditions. T6 heat treatment was done to improve the mechanical properties by formation of precipitation strengthening, and MgZn2 appears to be dominant strengthening precipitate. X-ray diffraction, optical microscopy, and SEM-EDS were used to characterize powder, and sintered and heat treated samples.

  7. The effects of surface finish and grain size on the strength of sintered silicon carbide

    Science.gov (United States)

    You, Y. H.; Kim, Y. W.; Lee, J. G.; Kim, C. H.

    1985-01-01

    The effects of surface treatment and microstructure, especially abnormal grain growth, on the strength of sintered SiC were studied. The surfaces of sintered SiC were treated with 400, 800 and 1200 grit diamond wheels. Grain growth was induced by increasing the sintering times at 2050 C. The beta to alpha transformation occurred during the sintering of beta-phase starting materials and was often accompanied by abnormal grain growth. The overall strength distributions were established using Weibull statistics. The strength of the sintered SiC is limited by extrinsic surface flaws in normal-sintered specimens. The finer the surface finish and grain size, the higher the strength. But the strength of abnormal sintering specimens is limited by the abnormally grown large tabular grains. The Weibull modulus increases with decreasing grain size and decreasing grit size for grinding.

  8. Improved microstructure and thermoelectric properties of iodine doped indium selenide as a function of sintering temperature

    Science.gov (United States)

    Dhama, Pallavi; Kumar, Aparabal; Banerji, P.

    2018-04-01

    In this paper, we explored the effect of sintering temperature on the microstructure, thermal and electrical properties of iodine doped indium selenide in the temperature range 300 - 700 K. Samples were prepared by a collaborative process of vacuum melting, ball milling and spark plasma sintering at 570 K, 630 K and 690 K. Single phase samples were obtained at higher sintering temperature as InSe is stable only at lower temperature. With increasing sintering temperature, densities of the samples were found to improve with larger grain size formation. Negative values of Seebeck coefficient were observed which indicates n-type carrier transport. Seebeck coefficient increases with sintering temperature and found to be the highest for the sample sintered at 690 K. Thermal conductivity found to be lower in the samples sintered at lower temperatures. The maximum thermoelectric figure of merit found to be ˜ 1 at 700 K due to the enhanced power factor as a result of improved microstructure.

  9. SINTERING EFFECTS ON THE DENSIFICATION OF NANOCRYSTALLINE HYDROXYAPATITE

    Directory of Open Access Journals (Sweden)

    M. Amiriyan

    2011-06-01

    Full Text Available The effects of sintering profiles on the densification behaviour of synthesized nanocrystalline hydroxyapatite (HA powder were investigated in terms of phase stability and mechanical properties. A wet chemical precipitation method was successfully employed to synthesize a high purity and single phase HA powder. Green HA compacts were prepared and subjected to sintering in air atmosphere over a temperature range of 700° C to 1300° C. In this study two different holding times were compared, i.e. 1 minute versus the standard 120 minutes. The results revealed that the 1 minute holding time sintering profile was indeed effective in producing a HA body with high density of 98% theoretical when sintered at 1200° C. High mechanical properties such as fracture toughness of 1.41 MPa.m1/2 and hardness of 9.5 GPa were also measured for HA samples sintered under this profile. Additionally, XRD analysis indicated that decomposition of the HA phase during sintering at high temperatures was suppressed.

  10. Spark plasma sintering of titanium aluminide intermetallics and its composites

    Science.gov (United States)

    Aldoshan, Abdelhakim Ahmed

    Titanium aluminide intermetallics are a distinct class of engineering materials having unique properties over conventional titanium alloys. gamma-TiAl compound possesses competitive physical and mechanical properties at elevated temperature applications compared to Ni-based superalloys. gamma-TiAl composite materials exhibit high melting point, low density, high strength and excellent corrosion resistance. Spark plasma sintering (SPS) is one of the powder metallurgy techniques where powder mixture undergoes simultaneous application of uniaxial pressure and pulsed direct current. Unlike other sintering techniques such as hot iso-static pressing and hot pressing, SPS compacts the materials in shorter time (< 10 min) with a lower temperature and leads to highly dense products. Reactive synthesis of titanium aluminide intermetallics is carried out using SPS. Reactive sintering takes place between liquid aluminum and solid titanium. In this work, reactive sintering through SPS was used to fabricate fully densified gamma-TiAl and titanium aluminide composites starting from elemental powders at different sintering temperatures. It was observed that sintering temperature played significant role in the densification of titanium aluminide composites. gamma-TiAl was the predominate phase at different temperatures. The effect of increasing sintering temperature on microhardness, microstructure, yield strength and wear behavior of titanium aluminide was studied. Addition of graphene nanoplatelets to titanium aluminide matrix resulted in change in microhardness. In Ti-Al-graphene composites, a noticeable decrease in coefficient of friction was observed due to the influence of self-lubrication caused by graphene.

  11. Studies on the sintering behaviour of uranium dioxide powder compacts

    International Nuclear Information System (INIS)

    Das, P.; Chowdhury, R.

    1988-01-01

    Uranium dioxide fuel pellets are normally made from their precursor ammonium diuranate, followed by calcination, subsequent reduction to sinterable grade powders and a post operation treatment of pressing and sintering. The low temperature calcined powders, usually exhibiting non-crystalline behaviour (under X-ray diffraction studies) progressively transforms into a crystalline variety on subsequent heat treatment at higher temperature. It is observed however that powders calcined between 800 to 900 0 C exhibit enhanced densification behaviour when sintered at higher temperatures. The isothermal shrinkage versus time plot of the sintered compacts are well described by a hyperbolic relationship which takes care of the observed shrinkage (λ) as caused due to a cumulative effect from the initial sintering of the powder compacts at zero time (α) and that caused due to the structural transformation from a non-crystalline modification with increased thermal treatment (β). The derived equation is a modification of the sintering mechanism of the viscous flow type proposed by Frenkel, involving sintering of an amorphous phase, the viscosity of the latter is presumed to increase with increasing thermal treatment to assume the final modified form as λ=t/(α+βt), where t = time, λ = shrinkage and α and β are the unknown parameters. (orig.)

  12. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  13. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  14. High temperature creep deformation of glass-phase containing MoSi sub 2 sintered compacts. Glass so wo fukumu MoSi sub 2 shoketsutai no koon henkei

    Energy Technology Data Exchange (ETDEWEB)

    Shobu, K.; Watanabe, T.; Tani, E. (Government Industrial Research Inst., Kyushu, Saga (Japan))

    1991-07-25

    As such deformation mechanisms as diffusion, grain boundary sliding and motion of dislocation are known for high temperature deformation of polycrystallines, these atomic theoretical mechanism and quantitative side are not resolved perfectly. In this report, high temperature plasticity of sintered MoSi {sub 2} containing glass phase was examined and obtained some results shown as follows: its transient feature was same as usually observed one; and according to observe its structure, the deformation mechanism was mainly based on grain boundary sliding, and viscous flow of glass phase and diffusion therethrough; stress feature in deformation was shown a transient phenomenon at about 10MPa, and stress index approached to 3 under low stress and to 1 under high stress, in other words stress feature was controlled by viscous flow under high stress and by grain boundary sliding under low stress; and the stress index of grain boundary sliding was supposed to be 3 at low inclined angle and responsive grain boundary and 2 at high inclined angle. 4 refs., 5 figs.

  15. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  16. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  17. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  18. Boric oxide or boric acid sintering aid for sintering ceramics

    International Nuclear Information System (INIS)

    Lawler, H.A.

    1979-01-01

    The invention described relates to the use of liquid sintering aid in processes involving sintering of ceramic materials to produce dense, hard articles having industrial uses. Although the invention is specifically discussed in regard to compositions containing silicon carbide as the ceramic material, other sinterable carbides, for example, titanium carbide, may be utilized as the ceramic material. A liquid sintering aid for densifying ceramic material is selected from solutions of H 3 BO 3 , B 2 O 3 and mixtures of these solutions. In sintering ceramic articles, e.g. silicon carbide, a shaped green body is formed from a particulate ceramic material and a resin binder, and the green body is baked at a temperature of 500 to 1000 0 C to form a porous body. The liquid sintering aid of B 2 O 3 and/or H 3 BO 3 is then dispersed through the porous body and the treated body is sintered at a temperature of 1900 to 2200 0 C to produce the sintered ceramic article. (U.K.)

  19. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  20. Sintering and electrical properties of strontium-doped lanthanum manganite

    Energy Technology Data Exchange (ETDEWEB)

    Tarrago, Diego Pereira; Sousa, Vania Caldas de [Universidade Federal do Rio Grande do Sul (LABIOMAT/PPGEM/UFRGS), Porto Alegre, RS (Brazil). Programa de Pos-Graduacao em Engenharia de Minas, Metalurgica e de Materiais. Lab. de Biomateriais], Email: dptarrago@gmail.com; Moreno Buriel, Berta; Chinarro Martini, Eva; Jurado Egea, Jose Ramon [Consejo Superior de Investigaciones Cientificas (ICV/CSIC), Madrid (Spain). Inst. de Ceramica y Vidrio; Malfatti, Celia de Fraga [Universidade Federal do Rio Grande do Sul (LAPEC/PPGEM/UFRGS), Porto Alegre, RS (Brazil). Programa de Pos-Graduacao em Engenharia de Minas, Metalurgica e de Materiais. Lab. de Pesquisa em Corrosao

    2010-07-01

    Lanthanum strontium manganites (LSM) are potential materials for cathode applications in solid oxide fuel cells (SOFC) due to their good catalytic activity, chemical stability and compatibility with electrolyte materials in high temperatures. The sinterability of single phase La{sub 1-x}Sr{sub x}Mn{sub O3} (x=0.18) perovskite powders and the electrical properties of the resulting samples are analyzed in this study. Using a heating microscope, the powders were pressed and sintered at different pressures and temperatures, resulting in an open porosity of 33.36% when compacted at 125 MPa and sintered at 1200 degree C. Top and cross-section s canning electron microscopy (SEM) micrographs revealed interconnected pores in the sintered body and, hence, a suitable microstructure for the application. The activation energy for conductance was 0.04 eV and the tested LSM bulk started to exhibit adequate electrical properties at about 500 degree C. (author)

  1. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  2. Effect of Ni addition to the Cu substrate on the interfacial reaction and IMC growth with Sn3.0Ag0.5Cu solder

    Science.gov (United States)

    Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Li, Yulong

    2018-04-01

    The formation and growth of intermetallic compound (IMC) layer at the interface between Sn3.0Ag0.5Cu (SAC305) solder and Cu- xNi ( x = 0, 0.5, 1.5, 5, 10 wt%) substrate during reflowing and aging were investigated. The soldering was conducted at 270 °C using reflowing method, following by aging treatment at 150 °C for up to 360 h. The experimental results indicated that the total thickness of IMC increased with increasing aging time. The scallop-like Cu6Sn5 and planar-like Cu3Sn IMC layer were observed between SAC305 solder and purely Cu substrate. As the content of Ni element in Cu substrate was 0.5% or 1.5%, the scallop-like Cu6Sn5 and planar-like Cu3Sn IMC layer were still found between solder and Cu-Ni substrate and the total thickness of IMC layer decreased with the increasing Ni content. Besides, when the Ni content was up to 5%, the long prismatic (Cu,Ni)6Sn5 phase was the only product between solder and substrate and the total thickness of IMC layer increased significantly. Interestingly, the total thickness of IMC decreased slightly as the Ni addition was up to 10%. In the end, the grains of interfacial IMC layer became coarser with aging time increasing while the addition of Ni in Cu substrate could refine IMC grains.

  3. Formation of high oxide ion conductive phases in the sintered oxides of the system Bi2O3-Ln2O3 (Ln = La-Yb)

    International Nuclear Information System (INIS)

    Iwahara, H.; Esaka, T.; Sato, T.; Takahashi, T.

    1981-01-01

    The electrical conduction in various phases of the system Bi 2 O 3 -Ln 2 O 3 (Ln = La, Nd, Sm, Dy, Er, or Yb) was investigated by measuring ac conductivity and the emf of the oxygen gas concentration cell. High-oxide-ion conduction was observed in the rhombohedral and face-centered cubic (fcc) phase in these systems. The fcc phase could be stabilized over a wide range of temperature by adding a certain amount of Ln 2 O 3 . In these cases, the larger the atomic number of Ln, the lower the content of Ln 2 O 3 required to form the fcc solid solution, except in the case of Yb 2 O 3 . The oxide ion conductivity of this phase decreased with increasing content of Ln 2 O 3 . Maximum conductivity was obtained at the lower limit of the fcc solid solution formation range in each system, which was more than one order of magnitude higher than those of conventional stabilized zirconias. Lattice parameters of the fcc phase were calculated from the x-ray diffraction patterns. The relationship between the oxide ion conductivity and the lattice parameter was also discussed

  4. Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li Mingyu; Bang Hansur

    2004-01-01

    This study investigates the influence of aging treatment on fracture behavior of Sn-Pb eutectic solder alloys at different loading rate regime during tensile tests under the scanning electron microscope. In high homologous temperature, the solder exhibit the creep behavior that could be confirmed through the phenomena of grain boundary sliding (GBS) to both as-cast and aged specimens. Owing to the large grain scale after high temperature storage, boundary behavior was limited to some extent for the difficulty in grain rotation and boundary migration. Instead, drastic intragranular deformation occurred. Also, the phase coarsening weakened the combination between lead-rich phase and tin matrix. Consequently, surface fragmentation was detected for the aged specimens. Furthermore, the fracture mechanism changed from intergranular dominated to transgranular dominated with increasing loading rate to both specimens during early stage

  5. Mechanisms of sintering

    International Nuclear Information System (INIS)

    Mohan, Ashok; Soni, N.C.; Moorthy, V.K.

    1980-01-01

    The basic mechanisms by which the material moves during sintering have not only held a strange fascination but are also very important in determining the properties of the end product. Kuczynski's exponent method has been subsequently refined by several schools to make it increasingly reliable. There is now a fairly good understanding of mechanisms in some of the materials. However in others the issue is complicated by their basic nature. The problems of ambiguity in criterion and that of more than one mechanism being simultaneously operative have been tackled with dexterity by Ashby for drawing sintering mechanism diagrams. The method has been modified to give Relative Contribution Diagrams (RCD). These yield additional information and have been used for analysis. The main criticism against this is that it uses a very large number of rate equations and material properties, which can communicate their inaccuracies to the diagram. A case study of UO 2 was undertaken and it has been shown quantitatively that inaccuracies in a smaller number of properties only affect the diagrams to any significant extent. (auth.)

  6. Laser sintering of copper nanoparticles

    International Nuclear Information System (INIS)

    Zenou, Michael; Saar, Amir; Ermak, Oleg; Kotler, Zvi

    2014-01-01

    Copper nanoparticle (NP) inks serve as an attractive potential replacement to silver NP inks in functional printing applications. However their tendency to rapidly oxidize has so far limited their wider use. In this work we have studied the conditions for laser sintering of Cu-NP inks in ambient conditions while avoiding oxidation. We have determined the regime for stable, low-resistivity copper (< ×3 bulk resistivity value) generation in terms of laser irradiance and exposure duration and have indicated the limits on fast processing. The role of pre-drying conditions on sintering outcome has also been studied. A method, based on spectral reflectivity measurements, was used for non-contact monitoring of the sintering process evolution. It also indicates preferred spectral regions for sintering. Finally, we illustrated how selective laser sintering can generate high-quality, fine line (<5 µm wide) and dense copper circuits. (paper)

  7. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  8. Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

    Energy Technology Data Exchange (ETDEWEB)

    Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

    2015-03-15

    Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

  9. Elevated-Temperature Mechanical Properties of Lead-Free Sn-0.7Cu- xSiC Nanocomposite Solders

    Science.gov (United States)

    Mohammadi, A.; Mahmudi, R.

    2018-02-01

    Mechanical properties of Sn-0.7 wt.%Cu lead-free solder alloy reinforced with 0 vol.%, 1 vol.%, 2 vol.%, and 3 vol.% 100-nm SiC particles have been assessed using the shear punch testing technique in the temperature range from 25°C to 125°C. The composite materials were fabricated by the powder metallurgy route by blending, compacting, sintering, and finally extrusion. The 2 vol.% SiC-containing composite showed superior mechanical properties. In all conditions, the shear strength was adversely affected by increasing test temperature, and the 2 vol.% SiC-containing composite showed superior mechanical properties. Depending on the test temperature, the shear yield stress and ultimate shear strength increased, respectively, by 3 MPa to 4 MPa and 4 MPa to 5.5 MPa, in the composite materials. The strength enhancement was mostly attributed to the Orowan particle strengthening mechanism due to the SiC nanoparticles, and to a lesser extent to the coefficient of thermal expansion mismatch between the particles and matrix in the composite solder. A modified shear lag model was used to predict the total strengthening achieved by particle addition, based on the contribution of each of the above mechanisms.

  10. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  11. The Effect of Barium Non-Stoichiometry on the Phase Structure, Sintering and Electrical Conductivity of BaZr0.7Pr0.1Y0.2O3

    KAUST Repository

    Mohamed Shibly, Kaamil

    2015-05-05

    This thesis attempts to test the effects of barium non stoichiometry and varying calcination temperatures on the microstructure and electrical conductivity of BaxZr0.7Pr0.1Y0.2O3- δ (x = 0.9, 1.0, 1.1). BZPY powders were fabricated using a combustion method, with the quantity of barium carefully controlled to create powders with a 10% molar excess or deficiency of barium. Then, portions of the precursor were calcined at 900 ºC, 1000 ºC, 1100 ºC, 1200 ºC and 1300 ºC for 5 h. The resulting calcined powders were pressed into pellets and sintered at 1600 ºC for 10 h, in a powder bath of the same chemical composition. In all, three chemically different powders were synthesized, and each composition was subjected to five different calcination temperatures, resulting in fifteen different samples to characterise. The precursor from the combustion method was characterised by using an STA to perform both TG and DSC simultaneously. The chemical composition of the precursor and calcined samples was analysed using ICP-OES. XRD was used to characterise the phases of both the powders and the sintered pellets. Lattice parameter indexing using Topaz and Scherrer\\'s equation were used to extract the lattice parameters and crystallite sizes respectively. The microstructure of the pellets was examined using an SEM, the grain size measured using a linear intercept method and pore size using ImageJ. Finally, EIS was used to measure the conductivity of the pellets in dry and wet Argon atmospheres, with silver electrodes. Unfortunately, neither changes to barium stoichiometry nor partial calcination could improve the performance of BZPY. Partially calcined samples did not give rise to dense pellets, barium deficient samples showed inferior conductivity and barium excess samples, while showing higher conductivity than the barium deficient pellets at high temperature, were fragile and had to be handled carefully. Ultimately, the attempt to improve the performance of BZPY did not

  12. Effect of Gold on the Microstructural Evolution and Integrity of a Sintered Silver Joint

    Science.gov (United States)

    Muralidharan, Govindarajan; Leonard, Donovan N.; Meyer, Harry M.

    2017-07-01

    There is a need for next-generation, high-performance power electronic packages and systems employing wide-bandgap devices to operate at high temperatures in automotive and electric grid applications. Sintered silver joints are currently being evaluated as an alternative to Pb-free solder joints. Of particular interest is the development of joints based on silver paste consisting of nano- or micron-scale particles that can be processed without application of external pressure. The microstructural evolution at the interface of a pressureless-sintered silver joint formed between a SiC die with Ti/Ni/Au metallization and an active metal brazed (AMB) substrate with Ag metallization at 250°C has been evaluated using scanning electron microscopy (SEM), x-ray microanalysis, and x-ray photoelectron spectroscopy (XPS). Results from focused ion beam (FIB) cross-sections show that, during sintering, pores in the sintered region near to the Au layer tend to be narrow and elongated with long axis oriented parallel to the interface. Further densification results in formation of many small, relatively equiaxed pores aligned parallel to the interface, creating a path for easy crack propagation. X-ray microanalysis results confirm interdiffusion between Au and Ag and that a region with poor mechanical strength is formed at the edge of this region of interdiffusion.

  13. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  14. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  15. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  16. Microwave-assisted sintering of non-stoichiometric strontium bismuth niobate ceramic: Structural and dielectric properties

    Energy Technology Data Exchange (ETDEWEB)

    Singh, Rajveer [Department of Physics and Astrophysics, University of Delhi, New Delhi 110007 (India); Department of Physics, Atmaram Sanatan Dharma College, University of Delhi, Dhaula Kuan, New Delhi 110021 (India); Luthra, Vandna [Department of Physics, Gargi College, University of Delhi, Siri Fort Road, New Delhi 110049 (India); Tandon, R.P., E-mail: ram_tandon@hotmail.com [Department of Physics and Astrophysics, University of Delhi, New Delhi 110007 (India)

    2016-11-01

    In recent years the microwave sintering has been utilized for the synthesis of materials in enhancement of the properties. In this paper strontium bismuth niobate (Sr{sub 0.8}Bi{sub 2.2}Nb{sub 2}O{sub 9}:SBN) bulk ceramic has been synthesized by microwave reactive sintering and conventional heating techniques. A relative density of 99.6% has been achieved for microwave sintered SBN, which is higher than that of (98.81%) conventionally sintered SBN. The phase formation of SBN synthesized by both processes has been confirmed by X-ray diffraction (XRD). The surface morphology of SBN was observed by scanning electron microscopy (SEM). The microstructure was found to be more uniform in case of SBN sintered by microwave sintering. The dielectric properties of SBN were studied as a function of frequency in the temperature range of 30–500 °C. Both the samples synthesized by two different processes were found to follow Curie–Weiss law above the transition temperature. The Curie temperature was found to be higher for microwave sintered SBN. The dielectric constant and the transition temperature were observed to be higher for SBN ceramic synthesized by microwave sintering technique. The ac and dc activation energy values were also found to be higher for microwave sintered SBN as compared to conventional sintering technique.

  17. Production of pure sintered alumina

    International Nuclear Information System (INIS)

    Rocha, J.C. da; Huebner, H.W.

    1982-01-01

    With the aim of optimizing the sintering parameters, the strength of a large number of alumina samples was determined which were produced under widely varying sintering conditions and with different amounts of MgO content. The strength as a function of sintering time or temperature was found to go through a maximum. With increasing time, this maximum is shifted to lower temperatures, and with decreasing temperature to longer times. Data pairs of sintering times and temperatures which yeld the strength maximum were determined. The value of the strength at the maximum remains unchanged. The strength is high (= 400 MN/m 2 , at a grain size of 3 um and a porosity of 2 per cent) and comparable to foreign aluminas produced for commercial purposes, or even higher. The increase in the sintering time from 1 h to 16 h permits a reduction of the sintering temperature from 1600 to 1450 0 C without losing strength. The practical importance of this fact for a production of sintered alumina on a large scale is emphasized. (Author) [pt

  18. Ash chemistry and sintering, verification of the mechanisms

    Energy Technology Data Exchange (ETDEWEB)

    Hupa, M.; Skrifvars, B.J. [Aabo Akademi, Turku (Finland)

    1996-12-01

    In this project four sintering mechanisms have been studied, i.e., partial melting with a viscous liquid, partial melting with a non-viscous liquid, chemical reaction sintering and solid state sintering. The work has aimed at improving the understanding of ash sintering mechanisms and quantifying their role in combustion and gasification. The work has been oriented in particular on the understanding of biomass ash behavior. The work has not directly focused on any specific technical application. However, results can also be applied on other fuels such as brown coal, petroleum coke, black liquor and different types of wastes (PDF, RDF, MSW). In one part of study the melting behavior was calculated for ten biomass ashes and compared with lab measurements of sintering tendencies. The comparison showed that the T{sub 15} temperatures, i.e. those temperatures at which the ashes contained 15 % molten phase, correlated fairly well with the temperature at which the sintering measurements detected sintering. This suggests that partial melting can be predicted fairly accurate for some ashes already with the today existing thermodynamic calculation routines. In some cases, however the melting calculations did not correlate with the detected sintering temperatures. In a second part detailed measurements on ash behavior was conducted both in a semi full scale CFB and a lab scale FBC. Ashes and deposits were collected and analyzed in several different ways. These analyses show that the ash chemistry shifts radically when the fuel is shifted. Fuels with silicate based ashes behaved totally different than those with an oxide or salt based ash. The chemistry was also affected by fuel blending. The ultimate goal has been to be able to predict the ash thermal behavior during biomass thermal conversion, using the fuel and ash elemental analyses and a few operational key parameters as the only input data. This goal has not yet today been achieved. (author)

  19. Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

    2015-11-15

    The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

  20. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  1. Phase Evaluation in Al2O3 Fiber-Reinforced Ti2AlC During Sintering in the 1300 degrees C-1500 degrees C Temperature Range

    Science.gov (United States)

    2011-01-01

    Ganguly, T. El-Raghy, and M. W. Barsoum, “ Electrical Transpot, Thermal Transport and Elastic Properties of M2AlC (M = Ti, Cr, Nb and V) Phases...2000). 49T. El-Raghy, S. Chakraborty, and M. W. Barsoum, “Synthesis and Char- acterization of Hf2PbC, Zr2PbC and M2SnC (M=Ti, Hf, Nb and Zr ),” J. Eur...elastically stiff, have relatively low thermal expansion coefficients, good thermal and electri- cal conductivities, and are resistant to chemical attack.5

  2. Impact of impurity content on the sintering resistance and phase stability of dysprosia- and yttria-stabilized zirconia thermal barrier coatings

    Czech Academy of Sciences Publication Activity Database

    Curry, N.; Janikowski, W.; Pala, Zdeněk; Vilémová, Monika; Markocsan, N.

    2014-01-01

    Roč. 23, 1-2 (2014), s. 160-169 ISSN 1059-9630. [International Thermal Spray Conference (ITSC2013). Busan, 13.05.2013-15.05.2013] Institutional support: RVO:61389021 Keywords : atmospheric plasma spray (APS) * thermal and phase stability of coatings * thermal barrier coatings (TBCs) * thermal conductivity * zirconia Subject RIV: JH - Ceramics, Fire-Resistant Materials and Glass Impact factor: 1.344, year: 2014 http://link.springer.com/article/10.1007%2Fs11666-013-0014-9/fulltext.html

  3. Influence of sintering temperature on the properties of pulsed electric current sintered hybrid coreshell powders

    Czech Academy of Sciences Publication Activity Database

    Mahmed, N.; Larismaa, J.; Heczko, Oleg; Cura, M.E.; Hannula, S.-P.

    2013-01-01

    Roč. 33, č. 12 (2013), s. 2233-2239 ISSN 0955-2219 R&D Projects: GA ČR(CZ) GAP107/11/0391 Institutional support: RVO:68378271 Keywords : sintering * silver * iron oxide * SiO 2 * phase transformation Subject RIV: BM - Solid Matter Physics ; Magnetism Impact factor: 2.307, year: 2013 http://dx.doi.org/10.1016/j.jeurceramsoc.2012.12.023

  4. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  5. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  6. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  7. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  8. Effect of boric acid sintering aid on densification of barium ferrite

    Indian Academy of Sciences (India)

    Unknown

    Physical properties like density and porosity have been studied for all compositions. The phase identification and microstructural investigation on the fractured surface have been carried out to understand the effect of sintering aid on the densification characteristics. Keywords. Barium ferrite; sintering aid; densification. 1.

  9. Influence of Coke Ratio on the Sintering Behavior of High-Chromium Vanadium-Titanium Magnetite

    Directory of Open Access Journals (Sweden)

    Songtao Yang

    2017-06-01

    Full Text Available High-chromium vanadium and titanium magnetite (HCVTM sinter has poor properties. The coke ratio has an important effect on the behavior of HCVTM sintering as it affects the mineral phases in the high-chromium vanadium and titanium sinter (HCVTS via changing the sintering temperature and atmosphere. In this work, the sintering behavior of HCVTM mixed with varying coke ratios was investigated through sintering pot tests, X-ray diffraction (XRD, gas chromatographic analysis, and mineral phase analysis. The results show that, with the increase of the coke ratio from 4.0% to 6.0%, leading to the increase of the combustion ratio of the flue gas, the vertical sintering rate and sinter productivity decrease. Meanwhile, with the change of the coke ratio, the content of magnetite, silicate, and perovskite increase, while the hematite and calcium ferrite decrease. In addition, the tumble strength and reduction ability of HCVTS decrease, and its degradation strength increase. It was found that the appropriate coke ratio for the sintering process was 5.0 wt %.

  10. Two-step flash light sintering of copper nanoparticle ink to remove substrate warping

    Energy Technology Data Exchange (ETDEWEB)

    Ryu, Chung-Hyeon; Joo, Sung-Jun [Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791 (Korea, Republic of); Kim, Hak-Sung, E-mail: kima@hanyang.ac.kr [Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791 (Korea, Republic of); Institute of Nano Science and Technology, Hanyang University, Seoul, 133-791 (Korea, Republic of)

    2016-10-30

    Highlights: • We performed the two-step flash light sintering for copper nanoparticle ink to remove substrate warping. • 12 J/cm{sup 2} of preheating and 7 J/cm{sup 2} of main sintering energies were determined as optimum conditions to sinter the copper nanoparticle ink. • The resistivity of two-step sintered copper nanoparticle ink was 3.81 μΩ cm with 5B adhesion level, 2.3 times greater than that of bulk copper. • The two-step sintered case showed a high conductivity without any substrate warping. - Abstract: A two-step flash light sintering process was devised to reduce the warping of polymer substrates during the sintering of copper nanoparticle ink. To determine the optimum sintering conditions of the copper nanoparticle ink, the flash light irradiation conditions (pulse power, pulse number, on-time, and off-time) were varied and optimized. In order to monitor the flash light sintering process, in situ resistance and temperature monitoring of copper nanoink were conducted during the flash light sintering process. Also, a transient heat transfer analysis was performed by using the finite-element program ABAQUS to predict the temperature changes of copper nanoink and polymer substrate. The microstructures of the sintered copper nanoink films were analyzed by scanning electron microscopy. Additionally, an X-ray diffraction and Fourier transform infrared spectroscopy were used to characterize the crystal phase change of the sintered copper nanoparticles. The resulting two-step flash light sintered copper nanoink films exhibited a low resistivity (3.81 μΩ cm, 2.3 times of that of bulk copper) and 5B level of adhesion strength without warping of the polymer substrate.

  11. Non-contact estimation of the bond quality in soldered thin laminate by laser generated lamb waves; Laser reiki ramuha ni yoru handazuke sekisohaku no setsugo seijo no hisesshoku hyoka

    Energy Technology Data Exchange (ETDEWEB)

    Kasama, H.; Futatsugi, T.; Cho, H.; Takemoto, M. [Aoyama-Gakuin University, Tokyo (Japan). Faculty of Science and Engineering

    1998-03-20

    The bond quality of a solder-bonded copper laminated plate was modeled into rigid contact (rc) and slip contact (sc) to calculate the velocity dispersion of lamb waves. The velocity dispersion of laser generated lamb waves was measured, and the bond quality or the thickness of a solder layer was evaluated by non-contact. In the model whose bond surface is rc, the velocity dispersion of lamb waves can be calculated under conditions where the stress and displacement in an interface are continuous. In the model whose bond surface is sc, it can be calculated under conditions where an interface slips freely. Weak bond indicates the velocity dispersion between rc and sc. In this model, the velocity dispersion can also be calculated by a change in the thickness of a solder layer and used for quantitative evaluation of a bond interface. A three-layer solder bond manufactured for trial could be evaluated from the velocity dispersion of laser lamb waves. At the room temperature, the change in bond quality near the solder melting point of bond laminate that was judged as rc was investigated. When the solidus temperature is exceeded, the amplitude of lamb waves and the velocity dispersion changed largely. The amplitude of lamb waves increases as the liquid phase ratio increases. The bond quality near the solder melting point can be evaluated using lamb waves. 9 refs., 10 figs., 2 tabs.

  12. Fabrication mechanism of FeSe superconductors with high-energy ball milling aided sintering process

    International Nuclear Information System (INIS)

    Zhang, Shengnan; Liu, Jixing; Feng, Jianqing; Wang, Yao; Ma, Xiaobo; Li, Chengshan; Zhang, Pingxiang

    2015-01-01

    FeSe Superconducting bulks with high content of superconducting PbO-type β-FeSe phase were prepared with high-energy ball milling (HEBM) aided sintering process. During this process, precursor powders with certain Fe/Se ratio were ball milled first then sintered. The influences of HEBM process as well as initial Fe/Se ratio on the phase evolution process were systematically discussed. With HEBM process and proper initial Fe/Se ratio, the formation of non-superconducting hexagonal δ-FeSe phase were effectively avoided. FeSe bulk with the critical temperature of 9.0 K was obtained through a simple one-step sintering process with lower sintering temperature. Meanwhile, the phase evolution mechanism of the HEBM precursor powders during sintering was deduced based on both the thermodynamic analysis and step-by-step sintering results. The key function of the HEBM process was to provide a high uniformity of chemical composition distribution, thus to successfully avoide the formation of intermediate product during sintering, including FeSe 2 and Fe 7 Se 8 . Therefore, the fundamental principal for the synthesis of FeSe superconductors were concluded as: HEBM aided sintering process, with the sintering temperature of >635 °C and a slow cooling process. - Highlights: • A novel synthesis technique was developed for FeSe based superconductors. • FeSe bulks with high Tc and high β-FeSe phase content has been obtained. • Phase evolution process for the HEBM aided sintering process was proposed

  13. Sinterability and microstructure evolution during sintering of ferrous powder mixtures

    Directory of Open Access Journals (Sweden)

    Kétner Bendo Demétrio

    2013-01-01

    Full Text Available The present work is focused on ferrous powder metallurgy and presents some results of a development of a suitable masteralloy for use as an additive to iron powder for the production of sintered steels. The masteralloy was produced by melting a powder mixture containing approximately Fe + 20% Ni + 20% Mn + 20% Si + 1% C (wt%, in order to obtain a cast billet that was converted into fine powder by crushing and milling. It was observed presence of SiC in the masteralloy after melting that is undesirable in the alloy. Si element should be introduced by using ferrosilicon. Sintered alloys with distinct contents of alloying elements were prepared by mixing the masteralloy powder to plain iron powder. Samples were produced by die compaction of the powder mixtures and sintering at 1200 °C in a differential dilatometer in order to record their linear dimensional behaviour during heating up and isothermal sintering, aiming at studying the sinterability of the compacts. Microstructure development during sintering was studied by SEM, XRD and microprobe analyses.

  14. Sintering-alkaline processing of borosilicate ores of Tajikistan

    International Nuclear Information System (INIS)

    Nazarov, F.A.

    2018-01-01

    The aim of the work is to study the processes of decomposition of boron-containing ore by sintering with NaOH, finding the optimal parameters of the decomposition process, studying the kinetics of processes and developing the technological foundations for ore processing. The processes of borosilicate ore processing were studied by sintering with NaOH. Possible mechanisms of chemical reactions of the process of sintering-alkaline decomposition of boron-containing ore are established, the results of which are substantiated by physicochemical methods of analysis. A principal technological scheme for processing of borosilicate ores by a sintering-alkaline method has been developed. In the first chapter, data on alkaline and caking processes for processing boron-containing and aluminium comprising raw materials are available in the literature. Based on this, the directions of our own research are outlined. The second chapter is devoted to the study of the chemical and mineralogical compositions of borosilicate ores and their concentrates with the help of X-ray phase and chemical analysis methods, the stoichiometric calculation of the formation of aluminum, iron, and boron salts has been carried out, and a thermodynamic analysis of the processes of sintering borosilicate ores with alkali has been considered. The third chapter presents the results of a study of sintering-alkaline method of processing of initial borosilicate ore of the Ak-Arkhar Deposit and its concentrate without calcination and after calcination. The kinetics of sintering of borosilicate ores with sodium hydroxide was studied. The optimal conditions of borosilicate ore sintering before and after the preliminary calcination with alkali were determined. Optimal parameters of the sintering process have been found: sintering temperature 800-8500 deg C, duration of the process - 60 minutes, mass ratio of NaOH to raw materials 2: 1. The conditions for sintering of borosilicate concentrate with alkali have been

  15. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  16. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  17. Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

    Directory of Open Access Journals (Sweden)

    Soares D.

    2006-01-01

    Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

  18. Economical surface treatment of die casting dies to prevent soldering in high pressure casting

    International Nuclear Information System (INIS)

    Fraser, D.T.; Jahedi, M.Z.

    2001-01-01

    This paper describes the use of a gas oxidation treatment of H13 tool steel to develop a compact iron oxide layer at the surface of core pins to prevent soldering in high pressure die casting. The performance of oxide layers in the protection of die steel against soldering during high pressure die casting was tested in a specially designed die using removable core pins and Al-11 Si-3 Cu casting alloy. The gas oxidation treatment can be applied at low temperatures and to large areas of the die surface. In addition this process is very cost effective compared to other coating processes such as physical vapour deposition (PVD), or thermo-reactive diffusion (TRD) coatings. This work demonstrated that surface treatment producing pure magnetite (Fe 3 O 4 ) layers are more protective than oxide layers containing a combination of Fe 3 O 4 (magnetite) and Fe 3 O 3 (haematite). The magnetite layer acts as a barrier between the die steel/casting alloy interface and prevents the formation of inter-metallic phases. Optical microscopy and scanning electron microscope were used to determine the thickness of the oxide layer, while X-ray diffraction was performed to determine the oxide phase structure

  19. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  20. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  1. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  2. An investigation on preparation of CIGS targets by sintering process

    Energy Technology Data Exchange (ETDEWEB)

    Zhang Ning, E-mail: zhn98@126.co [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China); Zhuang Daming; Zhang Gong [Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China)

    2010-01-15

    Pressureless sintering process was used to fabricate CIGS targets with Cu{sub 2}Se, In{sub 2}Se{sub 3}, and Ga{sub 2}Se{sub 3} as raw powders mixed according to the stoichiometry of CuIn{sub 0.72}Ga{sub 0.28}Se{sub 2} (CIGS). The results showed that only CuIn{sub 0.7}Ga{sub 0.3}Se{sub 2} phase can be detected in the sintered targets. The pores in sintered specimen become smaller and distribute more homogeneously under the conditions of finer powders and higher cold pressure. Both mass loss caused by the formation of volatile phase relating to Ga and volume expansion occur during the sintering process, which result in the decrease of density. The tendency of anti-densification becomes stronger under the conditions of coarser powders and higher cold pressure. The sintering process and causes for anti-densification were discussed. Finally, a hot pressing process was carried out, which was proved to be fairly effective to increase the density of CIGS target. The fabricated target can be used for magnetron-sputtering deposition of CIGS absorbers.

  3. Assessment of polyphase sintered iron-cobalt-iron boride cermets

    International Nuclear Information System (INIS)

    Nowacki, J.; Pieczonka, T.

    2004-01-01

    Sintering of iron, cobalt and boron powders has been analysed. As a result iron-iron boride, Fe-Fe 2 B and iron/cobalt boride with a slight admixture of molybdenum, Fe - Co - (FeMoCo) 2 B cermets have been produced. Iron was introduced to the mixture as the Astalloy Mo Hoeganaes grade powder. Elemental amorphous boron powder was used, and formation of borides occurred both during heating and isothermal sintering periods causing dimensional changes of the sintered body. Dilatometry was chosen to control basic phenomena taking place during multiphase sintering of investigated systems. The microstructure and phase constituents of sintered compacts were controlled as well. The cermets produced were substituted to: metallographic tests, X-ray analysis, measurements of hardness and of microhardness, and of wear in the process of sliding dry friction. Cermets are made up of two phases; hard grains of iron - cobalt boride, (FeCo) 2 B (1800 HV) constituting the reinforcement and a relatively soft and plastic eutectic mixture Fe 2 B - Co (400-500 HV) constituting the matrix. (author)

  4. Method of sintering ceramic materials

    Science.gov (United States)

    Holcombe, Cressie E.; Dykes, Norman L.

    1992-01-01

    A method for sintering ceramic materials is described. A ceramic article is coated with layers of protective coatings such as boron nitride, graphite foil, and niobium. The coated ceramic article is embedded in a container containing refractory metal oxide granules and placed within a microwave oven. The ceramic article is heated by microwave energy to a temperature sufficient to sinter the ceramic article to form a densified ceramic article having a density equal to or greater than 90% of theoretical density.

  5. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  6. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  7. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  8. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  9. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  10. Preparation of silicon carbide/carbon fiber composites through high-temperature spark plasma sintering

    Directory of Open Access Journals (Sweden)

    Ehsan Ghasali

    2017-12-01

    Full Text Available This study discusses the potentials of spark plasma sintering (SPS integrated with high temperature process that can enable sintering of SiC/Cf composites without any sintering aids. The random distribution of carbon fibers was obtained through mixing composite components in ethanol by using a shaker mill for 10 min. The corresponding sintering process was carried out at 1900 and 2200 °C with 50 MPa pressure applied at maximum temperature. The results showed that 89 ± 0.9 and 97 ± 0.8% of the theoretical density can be obtained for sintering temperatures of 1900 and 2200 °C, respectively. The densification curves were plotted to monitor sintering behavior with punch displacement changes. The appropriate bonding between SiC particles and carbon fibers was detected using FE-SEM for sample which was sintered at 2200 °C. The clear maximum in hardness (2992 ± 33 Vickers, bending strength (427 ± 26 MPa and fracture toughness (4.2 ± 0.3 MPa m1/2 were identified for sample sintered at 2200 °C. XRD investigations supposed that SiC and carbon were the only crystalline phases in both sintered samples.

  11. Preparation of Ti3Al intermetallic compound by spark plasma sintering

    Science.gov (United States)

    Ito, Tsutomu; Fukui, Takahiro

    2018-04-01

    Sintered compacts of single phase Ti3Al intermetallic compound, which have excellent potential as refractory materials, were prepared by spark plasma sintering (SPS). A raw powder of Ti3Al intermetallic compound with an average powder diameter of 176 ± 56 μm was used in this study; this large powder diameter is disadvantageous for sintering because of the small surface area. The samples were prepared at sintering temperatures (Ts) of 1088, 1203, and 1323 K, sintering stresses (σs) of 16, 32, and 48 MPa, and a sintering time (ts) of 10 min. The calculated relative densities based on the apparent density of Ti3Al provided by the supplier were approximately 100% under all sintering conditions. From the experimental results, it was evident that SPS is an effective technique for dense sintering of Ti3Al intermetallic compounds in a short time interval. In this report, the sintering characteristics of Ti3Al intermetallic compacts are briefly discussed and compared with those of pure titanium compacts.

  12. Effect of Ca-Fe oxides additives on NOx reduction in iron ore sintering

    Institute of Scientific and Technical Information of China (English)

    Zhi-yuan Yu; Xiao-hui Fan; Min Gan; Xu-ling Chen

    2017-01-01

    As the emission control regulations get stricter, the NOx reduction in the sintering process becomes an important environmental concern owing to its role in the formation of photochemical smog and acid rain. The NOx emissions from the sintering machine account for 48% of total amount from the iron and steel industry.Thus, it is essential to reduce NOx emissions from the sintering machine, for the achievement of clean production of sinter.Ca-Fe oxides, serving as the main binding phase in the sinter, are therefore used as additives into the sintering mixture to reduce NOx emissions.The results show that the NOx re-duction ratio achieves 27.76% with 8% Ca-Fe oxides additives since the Ca-Fe oxides can advance the ig-nition and inhibit the nitrogen oxidation compared with the conventional condition.Meanwhile, the exist-ence of Ca-Fe oxides was beneficial to the sinter quality since they were typical low melting point com-pounds.The optimal mass fraction of Ca-Fe oxides additives should be less than 8% since the permeability of sintering bed was significantly decreased with a further increase of the Ca-Fe oxides fines, inhibiting the mineralization reaction of sintering mixture.Additionally, the appropriate particle size can be obtained when mixing an equal amount of Ca-Fe oxides additives of -0.5 mm and 0.5-3.0 mm in size.

  13. Tool design and materials for electro sinter forging (ESF)

    DEFF Research Database (Denmark)

    Cannella, Emanuele; Nielsen, Chris Valentin

    ) process, the main requirement is the electrical current passing through the electrical conducting powder. To obtain this, a closed-die setup with electrical insulating properties was used. Furthermore, the alignment between the compacting punch and die needed to be ensured by pre-aligning or alternatively...... by using an alignment system. The present work is focused on the designing phase of a tool for the electro sinter forging of a disc, made from titanium powder. By applying a pre-alignment system, the setup resulted suitable for this application. A tool design for sintering rings is also showed....

  14. Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

    Energy Technology Data Exchange (ETDEWEB)

    Yakymovych, Andriy, E-mail: yakymovych@univie.ac.at [Department of Inorganic Chemistry – Functional Materials, University of Vienna, Währinger Str. 42, 1090 Vienna (Austria); Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo i Mephodiy Str. 8, 79005 Lviv (Ukraine); Mudry, Stepan; Shtablavyi, Ihor [Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo i Mephodiy Str. 8, 79005 Lviv (Ukraine); Ipser, Herbert [Department of Inorganic Chemistry – Functional Materials, University of Vienna, Währinger Str. 42, 1090 Vienna (Austria)

    2016-09-15

    Sn-Ag-Cu (SAC) alloys are commonly recognized as lead-free solders employed in the electronics industry. However, some disadvantages in mechanical properties and their higher melting temperatures compared to Pb-Sn solders prompt new research relating to reinforcement of existing SAC solders. One of the ways to reinforce these solder materials is the formation of composites with nanoparticles as filler materials. Accordingly, this study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu){sub 100−x}(nanoCo){sub x} solders with up to 0.8 wt% nano Co. The effect of nano-sized Co particles was investigated by means of differential thermal analysis (DTA), X-ray diffraction (XRD) in both liquid and solid states, and scanning electron microscopy (SEM). The experimental data of DTA are compared with available literature data for bulk Sn-3.0Ag-0.5Cu alloy to check the capability of minor nano-inclusions to decrease the melting temperature of the SAC solder. The combination of structural data in liquid and solid states provides important information about the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor Co additions and the phase formation during crystallization. Furthermore, scanning electron microscopy has shown the mutual substitution of Co and Cu atoms in the Cu{sub 6}Sn{sub 5} and CoSn{sub 3} phases, respectively. - Highlights: • Differential thermal analysis of nanocomposite (Sn-3.0Ag-0.5Cu){sub 100−x}(nanoCo){sub x} alloys. • Structural transformations of liquid Sn-3.0Ag-0.5Cu solder by minor Co additions. • Structure data of the solid quaternary (Sn-3.0Ag-0.5Cu){sub 100−x}(Co){sub x} alloys. • Substitution of Co and Cu atoms in the Cu{sub 6}Sn{sub 5} and CoSn{sub 3} phases.

  15. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  16. Final flotation waste kinetics of sintering at different heating regimes

    Directory of Open Access Journals (Sweden)

    Cocić Mira

    2016-01-01

    Full Text Available In the copper extraction, especially during the process of flotation enrichment and the pyrometallurgical processing, the waste materials that represent huge polluters of environment are being generated. In order to examine the application of Final flotation waste (FFW in the manufacturing of new materials from the glass-ceramic group phase and mineral composition were examined as well as thermal properties. FFW kinetics of sintering has been tested at different dyamics (1°C/min, 29°C/min and 43°C/min, in order to find the optimum conditions for sintering with a minimum amount of energy and time consumption. The samples were examined using: X-ray diffraction, X-ray fluorescence analysis, SEM (Scanning Electron Microscopy and thermal microscopy. The best results for the production of glass ceramic materials were obtained during the sintering at heating regime of 29°C/min. [Projekat Ministarstva nauke Republike Srbije, br. 176010

  17. Sintering of nano crystalline α silicon carbide by doping with boron ...

    Indian Academy of Sciences (India)

    Unknown

    tions, they concluded that either reaction sintering or liquid phase .... α-6H silicon carbide single crystal by three different laboratories ... silicon carbide particles by the overall reaction .... layer displacement is likely to occur in such a manner as.

  18. Microstructure and superconducting properties of Bi-2223/Ag tapes fabricated in the two-step sintering process

    International Nuclear Information System (INIS)

    Lu, X.Y.; Nagata, A.; Sugawara, K.

    2008-01-01

    The microstructure and superconducting properties of Bi-2223/Ag tapes fabricated in the two-step sintering process were investigated. The tapes were then subjected to two heat treatments with an intermediate rolling. All the tapes were sintered at 835 deg. C for 24 h at initial sintering stage. A two-step sintering procedure was then used in the final sintering stage. In the first step, the tapes are sintered at 840-865 deg. C for 1 h. In the second step, they were sintered at 835 deg. C for 120 h. The results show that the first step sintering temperature has significant influence on the microstructure and the critical current density J c . The observed microstructures are consistent well with the different J c performances of the tapes first-step-sintered at different temperatures. The tape first-step-sintered at 850 deg. C, which has small secondary phases, stronger c-axis grain alignment, higher proportion of Bi-2223 phase, and no cracks, exhibits the highest J c value

  19. Thermomechanical Modeling of Sintered Silver - A Fracture Mechanics-based Approach: Extended Abstract: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Paret, Paul P [National Renewable Energy Laboratory (NREL), Golden, CO (United States); DeVoto, Douglas J [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Narumanchi, Sreekant V [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2017-09-01

    Sintered silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based and lead-free solders, especially at higher temperatures (less than 200 degrees Celcius). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. We present a finite element method (FEM) modeling methodology that can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture mechanics-based approach is adopted in the FEM model, and J-integral/thermal cycle values are computed. In this paper, we outline the procedures for obtaining the J-integral/thermal cycle values in a computational model and report on the possible advantage of using these values as modeling parameters in a predictive lifetime model.

  20. Constrained Sintering in Fabrication of Solid Oxide Fuel Cells.

    Science.gov (United States)

    Lee, Hae-Weon; Park, Mansoo; Hong, Jongsup; Kim, Hyoungchul; Yoon, Kyung Joong; Son, Ji-Won; Lee, Jong-Ho; Kim, Byung-Kook

    2016-08-09

    Solid oxide fuel cells (SOFCs) are inevitably affected by the tensile stress field imposed by the rigid substrate during constrained sintering, which strongly affects microstructural evolution and flaw generation in the fabrication process and subsequent operation. In the case of sintering a composite cathode, one component acts as a continuous matrix phase while the other acts as a dispersed phase depending upon the initial composition and packing structure. The clustering of dispersed particles in the matrix has significant effects on the final microstructure, and strong rigidity of the clusters covering the entire cathode volume is desirable to obtain stable pore structure. The local constraints developed around the dispersed particles and their clusters effectively suppress generation of major process flaws, and microstructural features such as triple phase boundary and porosity could be readily controlled by adjusting the content and size of the dispersed particles. However, in the fabrication of the dense electrolyte layer via the chemical solution deposition route using slow-sintering nanoparticles dispersed in a sol matrix, the rigidity of the cluster should be minimized for the fine matrix to continuously densify, and special care should be taken in selecting the size of the dispersed particles to optimize the thermodynamic stability criteria of the grain size and film thickness. The principles of constrained sintering presented in this paper could be used as basic guidelines for realizing the ideal microstructure of SOFCs.

  1. Constrained Sintering in Fabrication of Solid Oxide Fuel Cells

    Science.gov (United States)

    Lee, Hae-Weon; Park, Mansoo; Hong, Jongsup; Kim, Hyoungchul; Yoon, Kyung Joong; Son, Ji-Won; Lee, Jong-Ho; Kim, Byung-Kook

    2016-01-01

    Solid oxide fuel cells (SOFCs) are inevitably affected by the tensile stress field imposed by the rigid substrate during constrained sintering, which strongly affects microstructural evolution and flaw generation in the fabrication process and subsequent operation. In the case of sintering a composite cathode, one component acts as a continuous matrix phase while the other acts as a dispersed phase depending upon the initial composition and packing structure. The clustering of dispersed particles in the matrix has significant effects on the final microstructure, and strong rigidity of the clusters covering the entire cathode volume is desirable to obtain stable pore structure. The local constraints developed around the dispersed particles and their clusters effectively suppress generation of major process flaws, and microstructural features such as triple phase boundary and porosity could be readily controlled by adjusting the content and size of the dispersed particles. However, in the fabrication of the dense electrolyte layer via the chemical solution deposition route using slow-sintering nanoparticles dispersed in a sol matrix, the rigidity of the cluster should be minimized for the fine matrix to continuously densify, and special care should be taken in selecting the size of the dispersed particles to optimize the thermodynamic stability criteria of the grain size and film thickness. The principles of constrained sintering presented in this paper could be used as basic guidelines for realizing the ideal microstructure of SOFCs. PMID:28773795

  2. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  3. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  4. The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

    Science.gov (United States)

    Sungkhaphaitoon, Phairote; Plookphol, Thawatchai

    2018-02-01

    In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0Ag-0.5Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and thermal properties. We evaluated the effects by means of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), differential scanning calorimetry (DSC), and a universal testing machine (UTM). The results showed that a part of the Sb was dissolved in the Sn matrix phase, and the remaining one participated in the formation of intermetallic compounds (IMCs) of Ag3(Sn,Sb) and Cu6(Sn,Sb)5. In the alloy containing the highest wt pct Sb, the added component resulted in the formation of SnSb compound and small particle pinning of Ag3(Sn,Sb) along the grain boundary of the IMCs. Our tests of the Sn-3.0Ag-0.5Cu solder alloys' mechanical properties showed that the effects produced by the addition of Sb varied as a function of the wt pct Sb content. The ultimate tensile strength (UTS) increased from 29.21 to a maximum value of 40.44 MPa, but the pct elongation (pct EL) decreased from 48.0 to a minimum 25.43 pct. Principally, the alloys containing Sb had higher UTS and lower pct EL than Sb-free solder alloys due to the strengthening effects of solid solution and second-phase dispersion. Thermal analysis showed that the alloys containing Sb had a slightly higher melting point and that the addition amount ranging from 0.5 to 3.0 wt pct Sb did not significantly change the solidus and liquidus temperatures compared with the Sb-free solder alloys. Thus, the optimal concentration of Sb in the alloys was 3.0 wt pct because the microstructure and the ultimate tensile strength of the SAC305 solder alloys were improved.

  5. Sintering diagrams of UO2

    International Nuclear Information System (INIS)

    Mohan, A.; Soni, N.C.; Moorthy, V.K.

    1979-01-01

    Ashby's method (see Acta Met., vol. 22, p. 275, 1974) of constructing sintering diagrams has been modified to obtain contribution diagrams directly from the computer. The interplay of sintering variables and mechanisms are studied and the factors that affect the participation of mechanisms in UO 2 are determined. By studying the physical properties, it emerges that the order of inaccuracies is small in most cases and do not affect the diagrams. On the other hand, even a 10% error in activation energies, which is quite plausible, would make a significant difference to the diagram. The main criticism of Ashby's approach is that the numerous properties and equations used, communicate their inaccuracies to the diagrams and make them unreliable. The present study has considerably reduced the number of factors that need to be refined to make the sintering diagrams more meaningful. (Auth.)

  6. Effect of temperature on sintered austeno-ferritic stainless steel microstructure

    Energy Technology Data Exchange (ETDEWEB)

    Munez, C.J. [Departamento de Ciencia e Ingenieria de Materiales, Escuela Superior de Ciencias Experimentales y Tecnologia, Universidad Rey Juan Carlos, 28933 Mostoles, Madrid (Spain)], E-mail: claudio.munez@urjc.es; Utrilla, M.V.; Urena, A. [Departamento de Ciencia e Ingenieria de Materiales, Escuela Superior de Ciencias Experimentales y Tecnologia, Universidad Rey Juan Carlos, 28933 Mostoles, Madrid (Spain)

    2008-09-08

    The influence of temperature on microstructural changes of sintered austeno-ferritic steels has been investigated. PM stainless steels have been obtained by sintering mixtures of austenitic and ferritic stainless steel powders. Only temperature-induced phase transformation was observed in austenite, as a result of elements interdiffusion between both phases. Microstructural characterization was completed with atomic force microscopy (AFM) and micro- and nano-indentation test, it is revealed an increase in the hardness with respect to the solutionized materials.

  7. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  8. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  9. Effect of two-stage sintering process on microstructure and mechanical properties of ODS tungsten heavy alloy

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Kyong H. [Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Kusong-dong, Yusong-gu, Taejon 305-701 (Korea, Republic of); Cha, Seung I. [International Center for Young Scientists, National Institute for Materials Science 1-1, Namiki, Tsukuba 305-0044 (Japan); Ryu, Ho J. [DUPIC, Korea Atomic Energy Research Institute, 150 Deokjin-dong, Yusong-gu, Taejon 305-353 (Korea, Republic of); Hong, Soon H. [Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Kusong-dong, Yusong-gu, Taejon 305-701 (Korea, Republic of)], E-mail: shhong@kaist.ac.kr

    2007-06-15

    Oxide dispersion strengthened (ODS) tungsten heavy alloys have been considered as promising candidates for advanced kinetic energy penetrator due to their characteristic fracture mode compared to conventional tungsten heavy alloy. In order to obtain high relative density, the ODS tungsten heavy alloy needs to be sintered at higher temperature for longer time, however, induces growth of tungsten grains. Therefore, it is very difficult to obtain controlled microstructure of ODS tungsten heavy alloy having fine tungsten grains with full densification. In this study, two-stage sintering process, consisted of primary solid-state sintering and followed by secondary liquid phase sintering, was introduced for ODS tungsten heavy alloys. The mechanically alloyed 94W-4.56Ni-1.14Fe-0.3Y{sub 2}O{sub 3} powders are solid-state sintered at 1300-1450 deg. C for 1 h in hydrogen atmosphere, and followed by liquid phase sintering temperature at 1465-1485 deg. C for 0-60 min. The microstructure of ODS tungsten heavy alloys showed high relative density above 97%, with contiguous tungsten grains after primary solid-state sintering. The microstructure of solid-state sintered ODS tungsten heavy alloy was changed into spherical tungsten grains embedded in W-Ni-Fe matrix during secondary liquid phase sintering. The two-stage sintered ODS tungsten heavy alloy from mechanically alloyed powders showed finer microstructure and higher mechanical properties than conventional liquid phase sintered alloy. The mechanical properties of ODS tungsten heavy alloys are dependent on the microstructural parameters such as tungsten grain size, matrix volume fraction and tungsten/tungsten contiguity, which can be controlled through the two-stage sintering process.

  10. Phosphorus containing sintered alloys (review)

    International Nuclear Information System (INIS)

    Muchnik, S.V.

    1984-01-01

    Phosphorus additives are considered for their effect on the properties of sintered alloys of different applications: structural, antifriction, friction, magnetic, hard, superhard, heavy etc. Data are presented on compositions and properties of phosphorus-containing materials produced by the powder metallurgy method. Phosphorus is shown to be an effective activator of sintering in some cases. When its concentration in the material is optimal it imparts the material such properties as strength, viscosity, hardness, wear resistance. Problems concerning powder metallurgy of amorphous phosphorus-containing alloys are reported

  11. Kinetics of sintering of uranium dioxide

    International Nuclear Information System (INIS)

    Soni, N.C.; Moorthy, V.K.

    1978-01-01

    The kinetics of sintering of UO 2 powders derived from ADU route and calcined at different temperatures was studied. The activation energy for sintering was found to depend on the calcination temperature, the density chosen and the sintering temperature range. The motive force for sintering is the excess free energy in the particle system. This exists in the powder compact in the form of surface energy and the excess lattice energy due to defects. The defects which can be eliminated at the operating temperature are responsible for the mobility and hence sintering. This concept of the motive force for sintering has been used to explain the difference in the activation energies observed in the present study. This would also explain phenomena such as attainment of limiting density, presence of optimum sintering temperature and the influence of calcination treatments on the sintering behaviour of powders. (author)

  12. Recycling of mill scale in sintering process

    Directory of Open Access Journals (Sweden)

    El-Hussiny N.A.

    2011-01-01

    Full Text Available This investigation deals with the effect of replacing some amount of Baharia high barite iron ore concentrate by mill scale waste which was characterized by high iron oxide content on the parameters of the sintering process., and investigation the effect of different amount of coke breeze added on sintering process parameters when using 5% mill scale waste with 95% iron ore concentrate. The results of this work show that, replacement of iron ore concentrate with mill scale increases the amount of ready made sinter, sinter strength and productivity of the sinter machine and productivity at blast furnace yard. Also, the increase of coke breeze leads to an increase the ready made sinter and productivity of the sintering machine at blast furnace yard. The productivity of the sintering machine after 5% decreased slightly due to the decrease of vertical velocity.

  13. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  14. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

    2016-07-04

    Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

  15. The pressureless sintering and mechanical properties of AlON ceramic

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, N., E-mail: zhangning5832@163.com [Key Lab. of Advanced Materials and Manufacturing Technology of Liaoning Province, Shenyang University, Shenyang, Liaoning 110044 (China); Liang, B.; Wang, X.Y.; Kan, H.M.; Zhu, K.W. [Key Lab. of Advanced Materials and Manufacturing Technology of Liaoning Province, Shenyang University, Shenyang, Liaoning 110044 (China); Zhao, X.J. [Department of Materials Science and Engineering, School of Materials and Metallurgy, Northeastern University, Shenyang, Liaoning 110004 (China)

    2011-07-25

    Highlights: {yields} A one-step pressureless sintering process was proposed, which is simple and viable. {yields} Cheap and easily available {alpha}-Al{sub 2}O{sub 3} and aluminum powders were chosen as raw materials substituting for expensive AlN ultrafine powders. {yields} The sintering temperature of AlON ceramic was reduced by 50 deg. C and the flexural strength was enhanced by 29.4%. - Abstract: Aluminum oxynitride (AlON) ceramic was synthesized by one-step pressureless sintering technology using low cost and easily available {alpha}-Al{sub 2}O{sub 3} and aluminum powders as raw materials. The sintering temperature was reduced because aluminum powders were nitridized into high activity AlN under the flowing nitrogen atmosphere. The curves of thermal analysis, microstructure and atomic distribution were investigated. The influence of sintering temperatures on phase composition, sintering densification and flexural strength was also explored. The experimental results showed that {alpha}-Al{sub 2}O{sub 3} and aluminum powders were acceptable substitutes for more expensive AlN ultrafine powders. Under the optimum sintering process at 1750 deg. C for 2 h, the sintered density and flexural strength of AlON ceramic were higher, 3.62 g/cm{sup 3} and 321 MPa, respectively. The sintering temperature was decreased by 50 deg. C because newly formed high activity AlN in situ reacted with Al{sub 2}O{sub 3} into Al{sub 23}O{sub 27}N{sub 5}, enhancing flexural strength by 29.4%. However, the sintering temperature could not be too high because grain growth and displacement of oxygen atoms from AlON ceramics by nitrogen atoms caused a decline in sintering densification and flexural strength.

  16. Sintering of micro-trusses created by extrusion-3D-printing of lunar regolith inks

    Science.gov (United States)

    Taylor, Shannon L.; Jakus, Adam E.; Koube, Katie D.; Ibeh, Amaka J.; Geisendorfer, Nicholas R.; Shah, Ramille N.; Dunand, David C.

    2018-02-01

    The development of in situ fabrication methods for the infrastructure required to support human life on the Moon is necessary due to the prohibitive cost of transporting large quantities of materials from the Earth. Cellular structures, consisting of a regular network (truss) of micro-struts with ∼500 μm diameters, suitable for bricks, blocks, panels, and other load-bearing structural elements for habitats and other infrastructure are created by direct-extrusion 3D-printing of liquid inks containing JSC-1A lunar regolith simulant powders, followed by sintering. The effects of sintering time, temperature, and atmosphere (air or hydrogen) on the microstructures, mechanical properties, and magnetic properties of the sintered lunar regolith micro-trusses are investigated. The air-sintered micro-trusses have higher relative densities, linear shrinkages, and peak compressive strengths, due to the improved sintering of the struts within the micro-trusses achieved by a liquid or glassy phase. Whereas the hydrogen-sintered micro-trusses show no liquid-phase sintering or glassy phase, they contain metallic iron 0.1-2 μm particles from the reduction of ilmenite, which allows them to be lifted with magnets.

  17. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  18. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 103 to 104 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary- β phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary- β phase agreed well with observed room temperature microstructures.

  19. Master Sintering Surface: A practical approach to its construction and utilization for Spark Plasma Sintering prediction

    Directory of Open Access Journals (Sweden)

    Pouchly V.

    2012-01-01

    Full Text Available The sintering is a complex thermally activated process, thus any prediction of sintering behaviour is very welcome not only for industrial purposes. Presented paper shows the possibility of densification prediction based on concept of Master Sintering Surface (MSS for pressure assisted Spark Plasma Sintering (SPS. User friendly software for evaluation of the MSS is presented. The concept was used for densification prediction of alumina ceramics sintered by SPS.

  20. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  1. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  2. Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

    International Nuclear Information System (INIS)

    Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

    2007-01-01

    In this paper, the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu 5 Zn 8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer, although the reflow soldering temperature of Sn-Zn-Bi (240 o C) was lower than that of Sn-Ag-Bi (250 o C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu, Ni) 6 Sn 5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface, and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems, indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 o C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu, Ni) 6 Sn 5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side, however the growth of the complex alloy including Sn, Ni, Cu and Zn on the Ni(P)/Cu metallization was suppressed

  3. Study of sintering on Mg-Zn-Ca alloy system

    Science.gov (United States)

    Annur, Dhyah; Lestari, Franciska P.; Erryani, Aprilia; Kartika, Ika

    2018-05-01

    Magnesium and its alloy have gained a lot of interest to be used in biomedical application due to its biodegradable and biocompatible properties. In this study, sintering process in powder metallurgy was chosen to fabricatenonporous Mg-6Zn-1Ca (in wt%) alloy and porous Mg-6Zn-1Ca-10 Carbamide alloy. For creating porous alloy, carbamide (CO(NH2)2 was added to alloy system as the space holder to create porous structure material. Effect of the space holder addition and sintering temperature on porosity, phase formation, mechanical properties, and corrosion properties was observed. Sintering process was done in a tube furnace under Argon atmosphere in for 5 hours. The heat treatment was done in two steps; heated up at 250 °C for 4 hours to decompose spacer particle, followed by heated up at 580 °C or 630 °C for 5 hours. The porous structure of the resulted alloys was examined using Scanning Electron Microscope (SEM), while the phase formation was characterized by X-ray diffraction (XRD) analysis. Mechanical properties were examined using compression testing. From this study, increasing sintering temperature up to 630 °C reduced the mechanical properties of Mg-Zn-Ca alloy.

  4. Conventional and two step sintering of PZT-PCN ceramics

    Science.gov (United States)

    Keshavarzi, Mostafa; Rahmani, Hooman; Nemati, Ali; Hashemi, Mahdieh

    2018-02-01

    In this study, PZT-PCN ceramic was made via sol-gel seeding method and effects of conventional sintering (CS) as well as two-step sintering (TSS) were investigated on microstructure, phase formation, density, dielectric and piezoelectric properties. First, high quality powder was achieved by seeding method in which the mixture of Co3O4 and Nb2O5 powder was added to the prepared PZT sol to form PZT-PCN gel. After drying and calcination, pyrochlore free PZT-PCN powder was synthesized. Second, CS and TSS were applied to achieve dense ceramic. The optimum temperature used for 2 h of conventional sintering was obtained at 1150 °C; finally, undesired ZrO2 phase formed in CS procedure was removed successfully with TSS procedure and dielectric and piezoelectric properties were improved compared to the CS procedure. The best electrical properties obtained for the sample sintered by TSS in the initial temperature of T 1 = 1200 °C and secondary temperature of T 2 = 1000 °C for 12 h.

  5. Two step sintering of zirconia-escandia-ceria

    International Nuclear Information System (INIS)

    Grosso, R.L.; Muccillo, E.N.S.

    2011-01-01

    Recent reports show that the ceramic system based on zirconia-scandia-ceria is a good candidate to act as solid electrolyte in solid oxide fuel cells operating at intermediate temperatures (600-800 °C). In this work, commercial ZrO_2 containing 10 mol% scandium oxide and 1 mol% cerium oxide was sintered by the two stage method. This technique was proposed to in order to obtain ceramic materials with high density along with fine grain sizes, because it avoids the grain growth occurring in the last stage of sintering. A number of experimental conditions were fully exploited by varying the dwell temperature (T_2) and the dwell time. The peak temperature (T_1) was chosen from linear shrinkage results. High (>98%) density values were obtained using this method. The medium grain size was evaluated for selected sintered samples. X-ray diffraction patterns reveal a secondary (rhombohedral) phase in sintered samples. The intensity of the secondary phase is a function of T_1 being small for relatively higher peak temperatures. (author)

  6. Coal fly ash utilization: Low temperature sintering of wall tiles

    International Nuclear Information System (INIS)

    Chandra, Navin; Sharma, Priya; Pashkov, G.L.; Voskresenskaya, E.N.; Amritphale, S.S.; Baghel, Narendra S.

    2008-01-01

    We present here a study of the sintering of fly ash and its mixture with low alkali pyrophyllite in the presence of sodium hexa meta phosphate (SHMP), a complex activator of sintering, for the purpose of wall tile manufacturing. The sintering of fly ash with SHMP in the temperature range 925-1050 deg. C produces tiles with low impact strength; however, the incremental addition of low alkali pyrophyllite improves impact strength. The impact strength of composites with ≥40% (w/w) pyrophyllite in the fly ash-pyrophyllite mix satisfies the acceptable limit (19.6 J/m) set by the Indian Standards Institute for wall tiles. Increasing the pyrophyllite content results in an increase in the apparent density of tiles, while shrinkage and water absorption decrease. The strength of fly ash tiles is attributed to the formation of a silicophosphate phase; in pyrophyllite rich tiles, it is attributed to the formation of a tridymite-structured T-AlPO 4 phase. Scanning electron micrographs show that the reinforcing rod shaped T-AlPO 4 crystals become more prominent as the pyrophyllite content increases in the sintered tiles

  7. SINTERING OF NASCENT CALCIUM OXIDE

    Science.gov (United States)

    The paper discusses the measurement of the sintering rate of CaO in a nitrogen atmosphere at temperatures of 700-1100 C. CaO prepared from ultrapure CaCO3 was compared with an impure CaO derived from limestone. Both materials yielded an initial surface area of 104 sq m/g. The rat...

  8. Nd-Fe-B sintered magnets fabrication by using atomized powders

    International Nuclear Information System (INIS)

    Goto, R; Sugimoto, S; Matsuura, M; Tezuka, N; Une, Y; Sagawa, M

    2011-01-01

    Nd-Fe-B sintered magnets are required to achieve high coercivity for improvement of their thermal stability. Dy is added to increase coercivity, however, this element decrease magnetization and energy products. Therefore, Dy-lean Nd-Fe-B sintered magnets with high coercivity are strongly demanded. To increase coercivity, it is necessary that microstructure of sintered magnets is consisted of both fine main phase particles and homogeneously distributed Nd-rich phases around the main phase. To meet those requirements, Nd-Fe-B atomized powders were applied to the fabrication process of sintered magnets. Comparing with the case of using strip casting (SC) alloys, jet-milled powders from atomized powders show homogeneous distribution of Nd-rich phase. After optimized thermal treatment, coercivities of sintered magnets from atomized powders and SC alloys reach 1050 kA·m-1 and 1220 kA·m-1, respectively. This difference in coercivity was due to initial oxygen concentration of starting materials. Consequently, Nd-rich phases became oxides with high melting points, and did not melt and spread during sintering and annealing.

  9. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  10. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  11. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  12. Modeling the microstructural evolution during constrained sintering

    DEFF Research Database (Denmark)

    Bjørk, Rasmus; Frandsen, Henrik Lund; Tikare, V.

    A numerical model able to simulate solid state constrained sintering of a powder compact is presented. The model couples an existing kinetic Monte Carlo (kMC) model for free sintering with a finite element (FE) method for calculating stresses on a microstructural level. The microstructural response...... to the stress field as well as the FE calculation of the stress field from the microstructural evolution is discussed. The sintering behavior of two powder compacts constrained by a rigid substrate is simulated and compared to free sintering of the same samples. Constrained sintering result in a larger number...

  13. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

    Energy Technology Data Exchange (ETDEWEB)

    Gain, Asit Kumar [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)], E-mail: eeycchan@cityu.edu.hk; Yung, Winco K.C. [Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon (Hong Kong)

    2009-05-25

    The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

  14. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

    International Nuclear Information System (INIS)

    Gain, Asit Kumar; Chan, Y.C.; Yung, Winco K.C.

    2009-01-01

    The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

  15. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  16. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  17. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  18. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...... to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry...

  19. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  20. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  1. Strain-enhanced sintering of iron powders

    Energy Technology Data Exchange (ETDEWEB)

    Amador, D.R.; Torralba, J.M. [Universidad Carlos III de Madrid, Departamento de Ciencias de Materiales e Ingenieria Metalurgica, Leganes, Madrid (Spain); Monge, M.A.; Pareja, R. [Universidad Carlos III de Madrid, Departamento de Fisica, Madrid (Spain)

    2005-02-01

    Sintering of ball-milled and un-milled Fe powders has been investigated using dilatometry, X-ray, density, and positron annihilation techniques. A considerable sintering enhancement is found in milled powders showing apparent activation energies that range between 0.44 and 0.80 eV/at. The positron annihilation results, combined with the evolution of the shrinkage rate with sintering temperature, indicate generation of lattice defects during the sintering process of milled and un-milled powders. The sintering enhancement is attributed to pipe diffusion along the core of moving dislocations in the presence of the vacancy excess produced by plastic deformation. Positron annihilation results do not reveal the presence of sintering-induced defects in un-milled powders sintered above 1200 K, the apparent activation energy being in good agreement with that for grain-boundary diffusion in {gamma}-Fe. (orig.)

  2. Designing a Tool System for Lowering Friction during the Ejection of In-Die Sintered Micro Gears

    DEFF Research Database (Denmark)

    Cannella, Emanuele; Nielsen, Emil Krabbe; Stolfi, Alessandro

    2017-01-01

    is affected by the influence of friction during the ejection phase, caused by radial expansion of the compacted and sintered powder. This paper presents the development of a pre-stressed tool system for the manufacture of micro gears made of aluminum. By using the hot isostatic pressing (HIP) sintering...

  3. Development of Au-Ge based candidate alloys as an alternative to high-lead content solders

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2010-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The changes in microstructure and microhardness associated with the addition of low melting point metals namely In, Sb and Sn to the Au......-Ge-In and Au-Ge-Sn combinations was determined to be the classic solid solution strengthening. The Au-Ge-Sb combination was primarily strengthened by the refined (Ge) dispersed phase. The aging temperature had a significant influence on the microhardness in the case of the Au-Ge-Sn candidate alloy...

  4. Sintered glass ceramic composites from vitrified municipal solid waste bottom ashes

    International Nuclear Information System (INIS)

    Aloisi, Mirko; Karamanov, Alexander; Taglieri, Giuliana; Ferrante, Fabiola; Pelino, Mario

    2006-01-01

    A glass ceramic composite was obtained by sinter-crystallisation of vitrified municipal solid waste bottom ashes with the addition of various percentages of alumina waste. The sintering was investigated by differential dilatometry and the crystallisation of the glass particles by differential thermal analysis. The crystalline phases produced by the thermal treatment were identified by X-ray diffraction analysis. The sintering process was found to be affected by the alumina addition and inhibited by the beginning of the crystal-phase precipitation. Scanning electron microscopy was performed on the fractured sintered samples to observe the effect of the sintering. Young's modulus and the mechanical strength of the sintered glass ceramic and composites were determined at different heating rates. The application of high heating rate and the addition of alumina powder improved the mechanical properties. Compared to the sintered glass ceramic without additives, the bending strength and the Young's modulus obtained at 20 deg. C/min, increased by about 20% and 30%, respectively

  5. Compactibility of Al/Al2O3 Isotropic Composite with Variation of Holding Time Sintering.

    Directory of Open Access Journals (Sweden)

    Eddy S Siradj

    2008-11-01

    Full Text Available The requirement of component with structural ability, light weight and also strength is increasing base on Metal Matrix Composites (MMCs by aluminum as matrix (AMCs. A structural ability is connected to composites compactibility which is depend on quality of interfacial bounding. Powder metallurgy is one of method to produce composite with powder mixing, compacting and sintering. Volume fractions reinforced and sintering time can influence composites compactibility. Volume fractions reinforced variable can produce different reinforcement effect. Beside that, on sintering enables the formation of new phase during sintering time. In this research, Al/Al2O3 isotropic composites are made with aluminum as matrix and alumina (Al2O3 as reinforced. Volume fraction reinforced used 10%. 20%. 30% and 40%. Sintering temperature and compaction pressure are each 600oC and 15 kN. The tests that applied are compression and metallographic test. The result that obtained is optimum compactibility of Al/Al2O3 composite reached at holding time 2 hour. During sintering, new phase can occur that is aluminum oxides (alumina, with unstable properties. The best volume fraction reinforced and holding time sintering are 40% and 2 hours.

  6. Optimization of the sintering atmosphere for high-density hydroxyapatite–carbon nanotube composites

    Science.gov (United States)

    White, Ashley A.; Kinloch, Ian A.; Windle, Alan H.; Best, Serena M.

    2010-01-01

    Hydroxyapatite–carbon nanotube (HA–CNT) composites have the potential for improved mechanical properties over HA for use in bone graft applications. Finding an appropriate sintering atmosphere for this composite presents a dilemma, as HA requires water in the sintering atmosphere to remain phase pure and well hydroxylated, yet CNTs oxidize at the high temperatures required for sintering. The purpose of this study was to optimize the atmosphere for sintering these composites. While the reaction between carbon and water to form carbon monoxide and hydrogen at high temperatures (known as the ‘water–gas reaction’) would seem to present a problem for sintering these composites, Le Chatelier's principle suggests this reaction can be suppressed by increasing the concentration of carbon monoxide and hydrogen relative to the concentration of carbon and water, so as to retain the CNTs and keep the HA's structure intact. Eight sintering atmospheres were investigated, including standard atmospheres (such as air and wet Ar), as well as atmospheres based on the water–gas reaction. It was found that sintering in an atmosphere of carbon monoxide and hydrogen, with a small amount of water added, resulted in an optimal combination of phase purity, hydroxylation, CNT retention and density. PMID:20573629

  7. Preparation and electromagnetic properties of low-temperature sintered ferroelectric-ferrite composite ceramics

    International Nuclear Information System (INIS)

    Yue Zhenxing; Chen Shaofeng; Qi Xiwei; Gui Zhilun; Li Longtu

    2004-01-01

    For the purpose of multilayer chip EMI filters, the new ferroelectric-ferrite composite ceramics were prepared by mixing PMZNT relaxor ferroelectric powder with composition of 0.85Pb(Mg 1/3 Nb 2/3 )O 3 -0.1Pb(Ni 1/3 Nb 2/3 )O 3 -0.05PbTiO 3 and NiCuZn ferrite powder with composition of (Ni 0.20 Cu 0.20 Zn 0.60 )O(Fe 2 O 3 ) 0.97 at low sintering temperatures. A small amount of Bi 2 O 3 was added to low sintering temperature. Consequently, the dense composite ceramics were obtained at relative low sintering temperatures, which were lower than 940 deg. C. The X-ray diffractometer (XRD) identifications showed that the sintered ceramics retained the presence of distinct ferroelectric and ferrite phases. The sintering studies and scanning electron microscope (SEM) observations revealed that the co-existed two phases affect the sintering behavior and grain growth of components. The electromagnetic properties, such as dielectric constant and initial permeability, change continuously between those of two components. Thus, the low-temperature sintered ferroelectric-ferrite composite ceramics with tunable electromagnetic properties were prepared by adjusting the relative content of two components. These materials can be used for multilayer chip EMI filters with various properties

  8. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  9. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  10. Thermodynamic assessment of the Sn-Co lead-free solder system

    Science.gov (United States)

    Liu, Libin; Andersson, Cristina; Liu, Johan

    2004-09-01

    The Sn-Co-Cu eutectic alloy can be a less expensive alternative for the Sn-Ag-Cu alloy. In order to find the eutectic solder composition of the Sn-Co-Cu system, the Sn-Co binary system has been thoroughly assessed with the calculation of phase diagram (CALPHAD) method. The liquid phase, the FCC and HCP Co-rich solid solution, and the BCT Sn-rich solid solution have been described by the Redlich-Kister model. The Hillert-Jarl-Inden model has been used to describe the magnetic contributions to Gibbs energy in FCC and HCP. The CoSn2, CoSn, Co3Sn2_β, and Co3Sn2_α phases have been treated as stoichiometric phases. A series of thermodynamic parameters have been obtained. The calculated phase diagram and thermodynamic properties are in good agreement with the experimental data. The obtained thermodynamic data was used to extrapolate the ternary Sn-Co-Cu phase diagram. The composition of the Sn-rich eutectic point of the Sn-Co-Cu system was found to be 224°C, 0.4% Co, and 0.7% Cu.

  11. Microstructural development and mechanical properties of iron based cermets processed by pressureless and spark plasma sintering

    International Nuclear Information System (INIS)

    Alvaredo, P.; Gordo, E.; Van der Biest, O.; Vanmeensel, K.

    2012-01-01

    Highlights: ► Processing of Fe-based cermets by pressureless sintering and spark plasma sintering. ► Influence of carbon content on the sintering mechanism and hardness. ► The cermet phase diagram was calculated and permits to explain the microstructure. ► SPS provides ferritic matrix and different carbide distribution than CPS samples. ► Pressureless sintered samples contain retained austenite at room temperature. - Abstract: Iron-based cermets are an interesting class of metal-ceramic composites in which properties and the factors influencing them are to be explored. In this work the metal matrix contains Cr, W, Mo and V as alloying elements, and the hard phase is constituted by 50 vol% of titanium carbonitride (TiCN) particles. The work studies the influence of the C content and the processing method on the sinterability, microstructure and hardness of the developed cermet materials. For that purpose, cermet samples with different C content in the matrix (0 wt%, 0.25 wt%, 0.5 wt%, 1.0 wt%) were prepared by conventional pressureless sintering (CPS) and, in order to achieve finer microstructures and to reduce the sintering time, by spark plasma sintering (SPS). The density and hardness (HV30) of the processed materials was evaluated, while their phase composition and microstructure was characterised by X-ray diffraction (XRD) and scanning electron microscopy (SEM), respectively. The equilibrium phase diagram of the composite material was calculated by ThermoCalc software in order to elucidate the influence of the carbon content on the obtained phases and developed microstructures.

  12. An in situ Study of NiTi Powder Sintering Using Neutron Diffraction

    Directory of Open Access Journals (Sweden)

    Gang Chen

    2015-04-01

    Full Text Available This study investigates phase transformation and mechanical properties of porous NiTi alloys using two different powder compacts (i.e., Ni/Ti and Ni/TiH2 by a conventional press-and-sinter means. The compacted powder mixtures were sintered in vacuum at a final temperature of 1373 K. The phase evolution was performed by in situ neutron diffraction upon sintering and cooling. The predominant phase identified in all the produced porous NiTi alloys after being sintered at 1373 K is B2 NiTi phase with the presence of other minor phases. It is found that dehydrogenation of TiH2 significantly affects the sintering behavior and resultant microstructure. In comparison to the Ni/Ti compact, dehydrogenation occurring in the Ni/TiH2 compact leads to less densification, yet higher chemical homogenization, after high temperature sintering but not in the case of low temperature sintering. Moreover, there is a direct evidence of the eutectoid decomposition of NiTi at ca. 847 and 823 K for Ni/Ti and Ni/TiH2, respectively, during furnace cooling. The static and cyclic stress-strain behaviors of the porous NiTi alloys made from the Ni/Ti and Ni/TiH2 compacts were also investigated. As compared with the Ni/Ti sintered samples, the samplessintered from the Ni/TiH2 compact exhibited a much higher porosity, a higher close-to-total porosity, a larger pore size and lower tensile and compressive fracture strength.

  13. Influences of chemical packing and the chemical composition in porcelain sintering: from theory to practice

    International Nuclear Information System (INIS)

    Conceicao, E.S.; Gouvea, D.; Romano, R.C.O.; Pileggi, R.G.

    2011-01-01

    Studies have been conducted using the size distribution particles as a tool to obtain maximum packing in porcelain bodies. However, little attention has been given for the maximum size of particles and its effect in the sintering. While some particles are relatively large (63 μ m) for some oxides in the porcelain composition, they could compromise the sintering if a liquid phase is formed during heat processing. In this work, a comparative analysis showed that compositions with a maximum green packing density does not always lead to a maximum final densification in sintering if there is no control of the maximum size of the particles. (author)

  14. Effect of sintering conditions on the magnetic disaccommodation in barium M-type hexaferrites

    International Nuclear Information System (INIS)

    Hernandez-Gomez, Pablo; Torres, Carlos; Francisco, Carlos de; Munoz, Jose Maria; Alejos, Oscar; Iniguez, Jose Ignacio; Raposo, Victor; Montero, Oscar

    2006-01-01

    The relaxation of the initial magnetic permeability has been measured in polycrystalline hexaferrites with nominal composition BaO.6Fe 2 O 3 (i.e. M-type). The samples have been sintered at different temperatures in CO 2 atmosphere and with different manufacturing conditions. In temperature range between 80 and 500 K, the magnetic disaccommodation shows presence of different relaxation processes, depending on both the sintering temperature and sintering time. The analogies and differences between the results obtained are discussed in terms of similar phase formation and different crystallite size

  15. Sintering mechanism of blast furnace slag-kaolin ceramics

    International Nuclear Information System (INIS)

    Mostafa, Nasser Y.; Shaltout, Abdallah A.; Abdel-Aal, Mohamed S.; El-maghraby, A.

    2010-01-01

    A general ceramics processing scheme by cold uniaxial pressing and conventional sintering process have been used to prepare ceramics from mixtures of blast furnace slag (BFS) and kaolin (10%, 30% and 50% kaolin). The properties of the ceramics were studied by measuring linear shrinkage, bulk density, apparent porosity and mechanical properties of samples heated at temperatures from 800 o C to 1100 o C. The formed crystalline phases were characterized using X-ray diffraction (XRD) and scanning electron microscope (SEM). Slag melt formed at relatively low temperatures (800-900 o C) modified the sintering process to liquid phase sintering mechanism. Combination of BFS with 10% kaolin gave the highest mechanical properties, densification and shrinkage at relatively low firing temperatures. The crystalline phases were identified as gehlenite (Ca 2 Al 2 SiO 7 ) in both BFS and BFS with 10% kaolin samples. Anorthite (CaAl 2 Si 2 O 8 ) phase increased with increasing kaolin contents. In the case of kaolin-rich mixtures (30% and 50% kaolin), increased expansion took place during firing at temperatures in the range 800-1000 o C. This effect could be attributed to the entrapment of released gases.

  16. On the Mechanism of Microwave Flash Sintering of Ceramics

    Directory of Open Access Journals (Sweden)

    Yury V. Bykov

    2016-08-01

    Full Text Available The results of a study of ultra-rapid (flash sintering of oxide ceramic materials under microwave heating with high absorbed power per unit volume of material (10–500 W/cm3 are presented. Ceramic samples of various compositions—Al2O3; Y2O3; MgAl2O4; and Yb(LaO2O3—were sintered using a 24 GHz gyrotron system to a density above 0.98–0.99 of the theoretical value in 0.5–5 min without isothermal hold. An analysis of the experimental data (microwave power; heating and cooling rates along with microstructure characterization provided an insight into the mechanism of flash sintering. Flash sintering occurs when the processing conditions—including the temperature of the sample; the properties of thermal insulation; and the intensity of microwave radiation—facilitate the development of thermal runaway due to an Arrhenius-type dependency of the material’s effective conductivity on temperature. The proper control over the thermal runaway effect is provided by fast regulation of the microwave power. The elevated concentration of defects and impurities in the boundary regions of the grains leads to localized preferential absorption of microwave radiation and results in grain boundary softening/pre-melting. The rapid densification of the granular medium with a reduced viscosity of the grain boundary phase occurs via rotation and sliding of the grains which accommodate their shape due to fast diffusion mass transport through the (quasi-liquid phase. The same mechanism based on a thermal runaway under volumetric heating can be relevant for the effect of flash sintering of various oxide ceramics under a dc/ac voltage applied to the sample.

  17. Report on in-situ studies of flash sintering of uranium dioxide

    Energy Technology Data Exchange (ETDEWEB)

    Raftery, Alicia Marie [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2017-01-24

    Flash sintering is a novel type of field assisted sintering that uses an electric field and current to provide densification of materials on very short time scales. The potential for field assisted sintering techniques to be used in producing nuclear fuel is gaining recognition due to the potential economic benefits and improvements in material properties. The flash sintering behavior has so far been linked to applied and material parameters, but the underlying mechanisms active during flash sintering have yet to be identified. This report summarizes the efforts to investigate flash sintering of uranium dioxide using dilatometer studies at Los Alamos National Laboratory and two separate sets of in-situ studies at Brookhaven National Laboratory’s NSLS-II XPD-1 beamline. The purpose of the dilatometer studies was to understand individual parameter (applied and material) effects on the flash behavior and the purpose of the in-situ studies was to better understand the mechanisms active during flash sintering. As far as applied parameters, it was found that stoichiometry, or oxygen-to-metal ratio, has a significant effect on the flash behavior (time to flash and speed of flash). Composite systems were found to have degraded sintering behavior relative to pure UO2. The critical field studies are complete for UO2.00 and will be analyzed against an existing model for comparison. The in-situ studies showed that the strength of the field and current are directly related to the sample temperature, with temperature-driven phase changes occurring at high values. The existence of an ‘incubation time’ has been questioned, due to a continuous change in lattice parameter values from the moment that the field is applied. Some results from the in-situ experiments, which should provide evidence regarding ion migration, are still being analyzed. Some preliminary conclusions can be made from these results with regard to using field assisted sintering to

  18. Sintering and microstructure evolution of columnar nickel-based superalloy sheets prepared by EB-PVD

    International Nuclear Information System (INIS)

    Chen, S.; Qu, S.J.; Liang, J.; Han, J.C.

    2010-01-01

    Research highlights: → EB-PVD technology is commonly used to deposit thermal barrier coatings (TBCs) and columnar structure is commonly seen in EB-PVD condensates. The unique columnar structure can provide outstanding resistance against thermal shock and mechanical strains for TBCs. However, a number of researchers have found that the columnar structure can affect the mechanical properties of EB-PVD alloy thin sheet significantly. As yet, works on how to reduce this kind of effects are seldom done. In the present article, we tried to reveal the sintering effects on microstructure evolution and mechanical properties of columnar Ni-based superalloy sheet. The results suggests that after sintering, the columnar structure degrades. Degradation depends on sintering temperature and time. Both the ultimate tensile strength and the elongation percentage are effectively improved after sintering. - Abstract: A ∼0.15 mm-thick columnar nickel-based superalloy sheet was obtained by electron beam physical vapor deposition (EB-PVD). The as-deposited alloy sheet was sintered at different conditions. The microstructure of the specimens before and after sintering was characterized by using scanning electron microscopy. An X'Pert texture facility was used to determine the crystallographic orientation of the as-deposited alloy sheet. The phase transformation was investigated by X-ray diffraction. Tensile tests were conducted at room temperature on as-deposited and sintered specimens. The results show that the as-deposited sheet is composed of typical columnar structures. After sintering, however, the columnar structure degrades. The degradation depends on sintering temperature and time. Both the ultimate tensile strength and the elongation percentage are effectively improved after sintering.

  19. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  20. Reactive sintering and microstructure development of tungsten carbide-AISI 304 stainless steel cemented carbides

    Energy Technology Data Exchange (ETDEWEB)

    Fernandes, C.M. [Department of Materials and Ceramics Engineering, CICECO, University of Aveiro, 3810-193 Aveiro (Portugal); CEMUC-Mechanical Engineering Department, University of Coimbra, Rua Luís Reis Santos, Pinhal de Marrocos, 3030-788 Coimbra (Portugal); Oliveira, F.J. [Department of Materials and Ceramics Engineering, CICECO, University of Aveiro, 3810-193 Aveiro (Portugal); Senos, A.M.R., E-mail: anamor@ua.pt [Department of Materials and Ceramics Engineering, CICECO, University of Aveiro, 3810-193 Aveiro (Portugal)

    2017-06-01

    Sintering of WC-stainless steel (SS) composites within a typical binder range from 6 up to 15 wt% SS was investigated through constant heating rate dilatometry, in vacuum conditions, complemented by differential thermal analysis and by the study of the high temperature wetting behavior of SS on WC. The densification starts ∼900 °C with a typical densification curve for all compositions, where three distinct regions are discernible: the first one with a slow densification rate, followed by a second region where a sharp increase in the densification rate up to a maximum value dependent on the binder amount is observed and, finally, a third one with a slowdown of the densification rate until the end of the thermal cycle. The attained final density at 1450 °C is dependent on the binder amount, increasing proportionally to its initial content. The final microstructure presents a normal grain size distribution and appreciable amounts of eta-phase, besides the major WC phase and residual iron rich phase. The reactive densification behavior and the role of the liquid phase are interpreted accordingly with structural and kinetic data. - Highlights: • Sintering of WC-AISI304 composites starts ∼900 °C and involves three stages. • Densification is largely dominated by a reactive liquid phase sintering process. • Eta-phase constitutes a transient liquid phase during sintering. • Sintering cycles are dependent on the initial binder content.

  1. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2016-04-15

    Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

  2. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  3. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  4. Sinterization of manganese ore tailings under natural air

    Energy Technology Data Exchange (ETDEWEB)

    Lima, M.M.F.; Souza, L.G.P.R.M.F. [Universidade Federal de Ouro Preto (UFOP), MG (Brazil)

    2014-07-01

    The manganese ore has wide application in metallurgy. However, from each of three hundred concentrations found, only one can be seen as a deposit. The aim of this study was to obtain and characterize a sinter from manganese ore tailing. The tailing was milled, classified (<400 ⧣) and calcinated (800°C - 3600s). The mixture had 12% moisture, 7 and 9% of activated charcoal. After homogenization, the sintering were carried out at 1140, 1145 and 1150°C during 1800, 7200 and 14400s at natural air. The sintered products were characterized by EDS analysis, BET surface area, apparent density, X-rays diffraction and SEM/EDS. The mass loss was approximately 14% and 16% in the calcination and sintering, respectively, due to the elimination of volatile products and water. The main phases characterized: SiO2, silicate with high content of manganese in the matrix and other silicates with different proportions of Ti, Na, Mn, Mg and Ca. (author)

  5. Physical chemistry and modelling of the sintering of actinide oxides

    International Nuclear Information System (INIS)

    Lechelle, Jacques

    2013-01-01

    This report gives a synthesis of the work I have carried out or to which I have numerically contributed to from 1996 up to 2012 in the Department of Plutonium Uranium and minor Actinides in Cadarache CEA Center. Their main goal is the study and the modeling of the sintering process of nuclear fuels which is the unifying thread of this document. Both in order to take into account the physical and chemical features of the actinide bearing oxide material and in order to combine the different transport phenomena leading to sintering, a sub-granular scale model is under development. Extension to a varying chemical composition as well as exchanges with the gaseous phase are foreseen. A simulation on a larger scale (pellet scale) is ongoing in the framework of a PhD thesis. Validation means have been tested with (U,Pu)O 2 material on the scale of the pellet (Small Angle Neutron Diffusion), on the scale of powder granules (X-Ray High Resolution Micro-Tomography) and with CeO 2 at the 'Institut de Chimie Separative' in Marcoule on a single crystal scale (Environmental Scanning Electron Microscope). The required microstructure homogeneity for nuclear fuels has led to a campaign of experimental studies about the role of Cr 2 O 3 as a sintering aid. Whole of these studies improve our understanding of fuel sintering and hence leads to an improved mastering of this process. (author) [fr

  6. Sintering of cermets on the base of corundum and molybdenum

    International Nuclear Information System (INIS)

    Fedotov, A.V.

    1987-01-01

    Liquid-phase sintering of cermets has been studied to develop rational technology allowing to produce a dense material at lower temperatures. Molybdenum of the MPCh mark with the specific surface ranged from 1900 to 4000 cm 2 /g and the corundum powder of the VK-94-1 mark with the specific surface of 6000 cm 2 /g containing upto 10% of the glass-phase have been used as initial materials. It is shown that application of the VK-94-1 ceramics powder for molybdenum content cermets allows to decrease the temperature of dense material production (∼ upto 100 deg C). To produce dense materials, it is necessary to restrict the initial porosity of compaction and to correspond it to the sintering conditions. The increase of molybdenum dispersion allows to produce material with the more homogeneous structure, higher density and strength. Molybdenum presence decreases recrystallization of corundum crystals and causes structure production resistant to high-temperature heating

  7. Influence of graphite contamination on the optical properties of transparent spinel obtained by spark plasma sintering

    International Nuclear Information System (INIS)

    Bernard-Granger, G.; Benameur, N.; Guizard, C.; Nygren, M.

    2009-01-01

    The optical properties of transparent spinel sintered by spark plasma sintering have been investigated for incident electromagnetic radiations with wavelengths in the range 0.2-2 μm. It is shown that residual porosities and second-phase graphite particles have a strong influence on the in-line transmittance. Because of the graphite particles, the in-line transmittance measured does not approach that of monocrystalline spinel for wavelengths above 1 μm

  8. Microwave sintering of ceramic materials

    Science.gov (United States)

    Karayannis, V. G.

    2016-11-01

    In the present study, the potential of microwave irradiation as an innovative energy- efficient alternative to conventional heating technologies in ceramic manufacturing is reviewed, addressing the advantages/disadvantages, while also commenting on future applications of possible commercial interest. Ceramic materials have been extensively studied and used due to several advantages they exhibit. Sintering ceramics using microwave radiation, a novel technology widely employed in various fields, can be an efficient, economic and environmentally-friendlier approach, to improve the consolidation efficiency and reduce the processing cycle-time, in order to attain substantial energy and cost savings. Microwave sintering provides efficient internal heating, as energy is supplied directly and penetrates the material. Since energy transfer occurs at a molecular level, heat is generated throughout the material, thus avoiding significant temperature gradients between the surface and the interior, which are frequently encountered at high heating rates upon conventional sintering. Thus, rapid, volumetric and uniform heating of various raw materials and secondary resources for ceramic production is possible, with limited grain coarsening, leading to accelerated densification, and uniform and fine-grained microstructures, with enhanced mechanical performance. This is particularly important for manufacturing large-size ceramic products of quality, and also for specialty ceramic materials such as bioceramics and electroceramics. Critical parameters for the process optimization, including the electromagnetic field distribution, microwave-material interaction, heat transfer mechanisms and material transformations, should be taken into consideration.

  9. The influence of sintering temperature on microstructure and mechanical properties of Ni-Al intermetallics fabricated by SPS

    Energy Technology Data Exchange (ETDEWEB)

    Thömmes, A., E-mail: thoemmes.alexander@gmail.com; Shevtsova, L. I., E-mail: edeliya2010@mail.ru; Laptev, I. S., E-mail: ilya-laptev-nstu@mail.ru; Mul, D. O., E-mail: ddariol@yandex.ru [Novosibirsk State Technical University, Novosibirsk, 630073 (Russian Federation); Mali, V. I., E-mail: vmali@mail.ru; Anisimov, A. G., E-mail: anis@hydro.nsc.ru [Lavrentyev Institute of Hydrodynamics SB RAS, Novosibirsk, 630090 (Russian Federation)

    2015-10-27

    In the present study PN85Yu15 was used as elemental powder to produce a sintered compound with Ni3Al as main phase. The Spark Plasma Sintering (SPS) technique is used to compact the powders. The powder was sintered in a temperature range between 1000°C and 1150°C to observe the influence of the sintering temperature on the microstructure and the mechanical properties. The microstructure was observed with optical microscope (OM), the phase composition was characterized by X-ray diffraction (XRD) technique. Density and microhardness were observed and compared the values with the results of other researchers. The compressive-, density- and microhardness tests show as clear result that with increasing the sintering temperature nearly all properties become better and also the microstructure studies show that porous places become less.

  10. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  11. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  12. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  13. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  14. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  15. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  16. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  17. Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Handwerker, Carol A.

    2018-01-01

    The limited number of independent β-Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β-Sn grain size have major effects on overall solder performance and reliability. This study analyzes whether additions of Al to Sn-Cu and Sn-Cu-Ag alloys can be used to change the grain size, morphology, and twinning structures of atomized (as-solidified) and re-melted (reflowed) β-Sn dendrites as determined using scanning electron microscopy and electron backscatter diffraction for as-solidified and reflow cycled (20-250°C, 1-5 cycles) Sn-Cu-Al and Sn-Ag-Cu-Al drip atomized spheres (260 μm diameter). The resulting microstructures were compared to as-solidified and reflow cycled Sn-Ag-Cu spheres (450 μm diameter) as well as as-solidified Sn-Ag-Cu, Sn-Cu, and Sn-Ag microstructures from the literature. Previous literature observations reporting reductions in undercooling and β-Sn grain size with Al micro-alloying additions could not be correlated to the presence of the Cu9Al4 phase or Al solute. The as-solidified spheres displayed no change in β-Sn dendrite structure or grain size when compared to non-Al-modified alloys, and the reflow cycled spheres produced high undercoolings (22-64°C), indicating a lack of potent nucleation sites. The current findings highlighted the role of Ag in the formation of the interlaced twinning structure and demonstrated that with deliberate compositional choices, formation of the alloy's β-Sn grain structure (cyclical twinning versus interlaced twinning) could be influenced, in both the as-solidified and reflow cycled states, though still not producing the fine-grain sizes and multiple orientations desired for improved thermomechanical properties.

  18. Effects of sintering atmosphere on the physical and mechanical properties of modified BOF slag glass

    Science.gov (United States)

    Dai, Wen-bin; Li, Yu; Cang, Da-qiang; Zhou, Yuan-yuan; Fan, Yong

    2014-05-01

    This study proposes an efficient way to utilize all the chemical components of the basic oxygen furnace (BOF) slag to prepare high value-added glass-ceramics. A molten modified BOF slag was converted from the melting BOF slag by reducing it and separating out iron component in it, and the modified BOF slag was then quenched in water to form glasses with different basicities. The glasses were subsequently sintered in the temperature range of 600-1000°C in air or nitrogen atmosphere for 1 h. The effects of different atmospheres on the physical and mechanical properties of sintered samples were studied by using differential scanning calorimetry (DSC), X-ray diffraction (XRD) and scanning electron microscopy (SEM) and by conducting experiment on evaluating the sintering shrinkage, water absorption and bulk density. It is found that the kinetics of the sintering process is significantly affected by sintering atmosphere. In particular, compared with sintering in air atmosphere, sintering in N2 atmosphere promotes the synergistic growth of pyroxene and melilite crystalline phases, which can contribute to better mechanical properties and denser microstructure.

  19. Influence of sintering temperature on screen printed Cu2ZnSnS4 (CZTS) films

    International Nuclear Information System (INIS)

    Wang Yu; Huang Yanhua; Lee, Alex Y.S.; Wang Chiou Fu; Gong Hao

    2012-01-01

    Highlights: ► The influences of sintering temperature on structure and properties of screen printed Cu 2 ZnSnS 4 (CZTS) were investigated. ► It was found that the direct optical band gap increased with increasing the sintering temperature. ► The screen printed CZTS film after sintering at 450 °C had a high photosensitivity (G i − G d )/G d of 14%. ► The hexagonal CuS phase aggregated after sintering at 500 °C and higher temperature. - Abstract: Screen printing is a useful and simple method for coating layers of several solar materials, but care must be taken in preparing stoichiometric CZTS film due to its instability at a high processing temperature and a small chemical potential domain. This paper reports screen printing prepared CZTS films and the influence of sintering temperature on CZTS properties. The thermostability, structural, electronic and optical properties are studied. The direct optical band gap energies of the films vary from 1.39 to 1.60 eV, while the resistivities change from 830 to 6 Ω cm after sintering at different temperatures up to 550 °C. A high photosensitivity of 14% is achieved for the sample sintered at 450 °C. The phenomena observed are also discussed.

  20. Nd:YAG transparent ceramics fabricated by direct cold isostatic pressing and vacuum sintering

    Science.gov (United States)

    Ge, Lin; Li, Jiang; Zhou, Zhiwei; Liu, Binglong; Xie, Tengfei; Liu, Jing; Kou, Huamin; Shi, Yun; Pan, Yubai; Guo, Jingkun

    2015-12-01

    The sintering behavior of neodymium doped yttrium aluminum garnet (Nd:YAG) ceramics was investigated on the basis of densification trajectory, microstructure evolution and transmittance. Nd:YAG ceramics with in-line transmittance of 83.9% at 1064 nm and 82.5% at 400 nm were obtained by direct cold isostatic pressing (CIP) at 250 MPa and solid-state reactive sintering at 1790 °C for 30 h under vacuum. Compared with the porosity and the average pore diameter of the sample from uniaxial dry-pressing followed by CIP, those from direct CIP are much smaller. The samples pressed at 250 MPa were sintered from 1500 °C to 1750 °C for 0.5-20 h to study their sintering behavior. At the temperature higher than 1500 °C, pure YAG phase is formed, followed by the densification and grain growth process. The relative density and the grain size increase with the increase of sintering time and temperature, and the sintering behavior is more sensitive to temperature than holding time. The mechanism controlling densification and grain growth at sintering temperature of 1550 °C is grain boundary diffusion.

  1. Magnetic properties of sintered high energy sm-co and nd-fe-b magnets

    Directory of Open Access Journals (Sweden)

    Talijan Nadežda M.

    2006-01-01

    Full Text Available Magnetic properties of permanent magnetic materials based on intermetallic compounds of Sm-Co and Nd-Fe-B are in direct dependence on the microstructure. In the first part of this paper, having in mind the importance of the regime of sintering and heat treatment to obtain the optimal magnetic structure, yet another approach in defining the most adequate technological parameters of the sintering process for applied heat treatment conditions was made. The goal of these investigations was to use the correlation that exists between sintering conditions (temperature and time and intensity of the diffraction peak of the (111 plane of the SmCo5 phase to optimize. In the second part a brief overview of high energy magnetic materials based on Nd-Fe-B is presented with special emphasis to the current research and development of high remanent nanocomposite magnetic materials based on Nd-Fe-B alloys with a reduced Nd content. Part of experimental results gained during research of the sintering process of SmCo5 magnetic materials were realized and published earlier. The scientific meeting devoted to the 60th anniversary of Frankel’s theory of sintering was an opportunity to show once more the importance and role of sintering in optimization of the magnetic microstructure of sintered Sm Co5 magnetic materials.

  2. Effect of sintering pressure on structure and magnetic properties of Zn0.99Ni0.01O bulk samples synthesized under different pressures

    International Nuclear Information System (INIS)

    Wang, Yongqiang; Yuan, Chaosheng; Su, Lei; Wang, Zheng; Hao, Junhong; Ren, Yufen

    2015-01-01

    A series of Zn 0.99 Ni 0.01 O bulk samples were prepared by a coprecipitation method, and then sintered at 600 °C under various pressures from normal pressure(NP) to 3 GPa. The effects of sintering pressure (P S ) on the structure, morphology and magnetic properties of the doping samples were investigated in detail. The XRD and HRTEM results reveal that all samples are of single-phase hexagonal structure. Compared with the sample sintered at normal pressure, the lattice parameters a and c of the samples sintered at high pressures (HP) show a sharply decrease. With the increase of sintering pressure, the particle size gradually increases as well as the particles get closer to each other. At 300 K, the sample sintered at normal pressure shows a superparamagnetic-like behavior, while the samples sintered at high pressures display typical ferromagnetic behaviors. The saturation magnetization of the samples sintered at high pressures is three orders of magnitude larger than that of the one sintered at normal pressure. Our results reveal that an appropriate sintering pressure can tune the magnetic properties of Ni-doped ZnO system by changing the lattice parameters, particle size and inter-particle spacing, which may be helpful to the practical applications. - Highlights: • A series of Zn 0.99 Ni 0.01 O bulk samples were sintered in different pressures. • The lattice constants of the samples sintered at high pressure clearly decrease. • The particle size increases gradually with the increase of sintering pressure. • The samples sintered at different pressures show different magnetic behaviors. • Appropriate sintering pressure can tune the magnetic properties of Zn–Ni–O system

  3. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  4. Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn

    International Nuclear Information System (INIS)

    Tao Dongping

    2008-01-01

    The activities of components of the ternary lead-free solder systems Al-Sn-Zn at 973 K, Zn-Cu-Sn at 1023 K and Bi-In-Sn at 1000 and 1050 K have been predicted by a novel molecular interaction volume model-MIVM and the results are in good agreement with experimental data. Then the activities of all components of the Bi-In-Sn at 550 K and the Bi-In-Sn-Zn quaternary system at 700 K have been further predicted and the results are reasonable and reliable. This shows that the model may be a superior alternative for describing interfacial chemical reactions between lead-free solder alloys and common base materials and for the calculation of their phase diagrams because MIVM has certain physical meaning from the viewpoint of statistical thermodynamics and requires only two infinite dilute activity coefficients for each sub-binary system

  5. Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests

    International Nuclear Information System (INIS)

    Ding, Ying; Wang, Chunqing; Tian, Yanhong; Li, Mingyu

    2007-01-01

    This study investigates the influence of aging treatment on deformation behavior of 96.5Sn3.5Ag eutectic solder alloys with lower strain rate ( -3 s -1 ) during tensile tests under the scanning electron microscope. Results showed that because of the existence of Ag 3 Sn intermetallic particles and the special microstructure of β-Sn phases in Sn3.5Ag solder, grain boundary sliding was not the dominant mechanism any longer for this Pb-free solder. While the interaction of dislocations with the relatively rigid Ag 3 Sn particles began to dominate. For the as-cast specimen, accompanied by partial intragranular cracks, intergranular fracture along the grain boundaries in Sn-Ag eutectic structure or the interphase boundaries between Sn-rich dendrites and Sn-Ag eutectic phases occurred primarily in early tensile stage. However, the boundary behavior was limited by the large Ag 3 Sn particles presented along the Sn-rich dendrites boundaries after aging. Plastic flow was observed in large area, and cracks propagated in a transgranular manner across the Sn-dendrites and Sn-Ag eutectic structure

  6. Evolution of the Thermal Conductivity of Sintered Silver Joints with their Porosity Predicted by the Finite Element Analysis of Real 3D Microstructures

    Science.gov (United States)

    Signor, L.; Kumar, P.; Tressou, B.; Nadot-Martin, C.; Miranda-Ordonez, José; Carr, J.; Joulain, K.; Milhet, X.

    2018-07-01

    Silver paste sintering is a very promising technology for chip bonding in future power electronics modules owing to its high melting temperature and the good electrical and thermal properties among other classic solder alloys. However, in its sintered form, these joints contain nanometric/submicrometric pores that affect their thermal performance. The present study gives insight into the relationship between the material thermal conductivity and the real three-dimensional porous structure using finite element modelling. It is shown that over a certain pore fraction threshold (˜ 13%), the pore morphology has a non-negligible influence on the thermal conductivity. Results are also compared to predictions obtained by analytical models available in the literature.

  7. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  8. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  9. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  10. Synergistic effect of carbon nanotube as sintering aid and toughening agent in spark plasma sintered molybdenum disilicide-hafnium carbide composite

    Energy Technology Data Exchange (ETDEWEB)

    Mukherjee, Biswajyoti; Asiq Rahman, O.S.; Sribalaji, M [Materials Science and Engineering, Indian Institute of Technology Patna, Bihta Kanpa Road, Bihta, Patna, Bihar 801103 (India); Bakshi, Srinivasa Rao [Department of Metallurgical and Materials Engineering, Indian Institute of Technology Madras, Chennai 600036 (India); Keshri, Anup Kumar, E-mail: anup@iitp.ac.in [Materials Science and Engineering, Indian Institute of Technology Patna, Bihta Kanpa Road, Bihta, Patna, Bihar 801103 (India)

    2016-12-15

    Hafnium carbide (HfC) along with sintering aids was consolidated at a relatively lower temperature i.e. 1600 °C (i.e. T=~0.41 T{sub m}) under a uniaxial load of 50 MPa by spark plasma sintering. Two different sintering aids such as molybdenum disilicide (MoSi{sub 2}) and carbon nanotube (CNT) were added to enhance the densification and lower the extent of grain growth in the sintered pellets. Density of the sintered pellet increased from 96.0±0.8% in HfC +5 wt% MoSi{sub 2} (HM) to 99.0±0.5% with the addition of 2 wt% CNT in HfC+5 wt% MoSi{sub 2} (HMC) at sintering temperature of 1600 °C. Further, the extent of grain growth drastically reduced from 204% in HM to 50% in HMC. Analysis of linear shrinkage during densification revealed that CNT addition increased densification rate and decreased the time required to reach the density of 99.0±0.5% at 1600 °C. Increased densification and lower degree of grain growth could be due to the synergistic effect offered by the CNT, which are as follows: (i) Lubrication effect of CNT, (ii) Lower activation energy for grain boundary diffusion (iii) Reduction in liquid phase sintering temperature and (iv) Grain boundary pinning. Fracture toughness of the sintered HM and HMC composite was obtained using indentation technique. By the addition of 2 wt% CNT in HM, drastic increase of 91% in fracture toughness was seen. This significant improvement in fracture toughness was due to the enhanced densification and relatively lower grain size of HMC. Also crack bridging, crack deflection, crack arrest, CNT and graphene sheet pull-out and swording played major role in toughening of HMC pellet.

  11. Alternative sintering methods compared to conventional thermal sintering for inkjet printed silver nanoparticle ink

    NARCIS (Netherlands)

    Niittynen, J.; Abbel, R.; Mäntysalo, M.; Perelaer, J.; Schubert, U.S.; Lupo, D.

    2014-01-01

    In this contribution several alternative sintering methods are compared to traditional thermal sintering as high temperature and long process time of thermal sintering are increasing the costs of inkjet-printing and preventing the use of this technology in large scale manufacturing. Alternative

  12. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  13. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  14. Fracture Toughness and Micro-Strain of Y-TZP Nanoceramics at Different Sintering Temperature

    Directory of Open Access Journals (Sweden)

    Rabiha S. Yaseen

    2017-11-01

    Full Text Available The objective of this research is to study the effect of sintering temperature on the mechanical properties and micro-strain of yttria tetragonal zirconia polycrystalls (Y-TZP nanostructure.   Where green disk formed by uniaxially press, sintered at (1500 – 1550 – 1600⁰C in air for 2hr then polished to mirror shape for fracture toughness and micro-hardness measurement by Vickers indenter at (60 kg to 100gm loads. Atomic force microscopy (AFM technique was use to measure the change in grain size and shape of the samples, X-ray diffraction (XRD evaluated to identify the phases and to measure the micro-strain of the samples.          The Results show that increasing sintering temperature will increase the grain size with increasing the average of micro-strain. Tetragonal  phase is the prevailing phase with small amount of cubic phase and the amount of monoclinic phase was under detection limite after sintering but there is increas in lattice dimension according to micro-strain calculation and grinding process produce micro-strain. With increasing the sintering temperature micro-hardness and fracture toughness will increas.

  15. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  16. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  17. The effect of lanthanum boride on the sintering, sintered microstructure and mechanical properties of titanium and titanium alloys

    International Nuclear Information System (INIS)

    Yang, Y.F.; Luo, S.D.; Qian, M.

    2014-01-01

    An addition of ≤0.5 wt% lanthanum boride (LaB 6 ) to powder metallurgy commercially pure Ti (CP-Ti), Ti–6Al–4V and Ti–10V–2Fe–3Al (all in wt%) resulted in improved sintered density, substantial microstructural refinement, and noticeably increased tensile elongation. The addition of LaB 6 led to scavenging of both oxygen (O) and chlorine (Cl) from the titanium powder during sintering, evidenced by the formation of La 2 O 3 and LaCl x O y . The pinning effect of La 2 O 3 , LaCl x O y and TiB inhibited prior-β grain growth and resulted in subsequent smaller α-laths. The formation of nearly equiaxed α-Ti phase is partially attributed to the nucleation effect of α-Ti on TiB. The improved sintered density was caused by B from LaB 6 rather than La, while excessive formation of La 2 O 3 and TiB with an addition of >0.5 wt% LaB 6 resulted in a noticeable decrease in sintered density. The improved tensile elongation with an addition of ≤0.5 wt% LaB 6 was mainly attributed to the scavenging of oxygen by LaB 6 , partially assisted by the improved sintered density. However, an addition of >0.5 wt% LaB 6 led to the formation of large La 2 O 3 aggregates and more brittle TiB whiskers and therefore decreased tensile elongation. Balanced scavenging of O is thus important. The optimal addition of LaB 6 was 0.5 wt% but this may change depending on the powder size of the LaB 6 to be used

  18. Effects of sintering temperature on the density and porosity

    African Journals Online (AJOL)

    2013-03-01

    bonding) between the salt beads at all the temperatures in which sintering was performed. .... and the sintering of some covalent solids and low- stability ceramics. The entire sintering process is gen- erally considered to occur in ...

  19. Study on the process of sintering matrix metallic Fe-Cu-25%Nb and Fe-Cu-25%Co during hot pressing

    International Nuclear Information System (INIS)

    Batista, A.C.; Oliveira, H.C.P.; Souza, M.H.; Assis, P.S.

    2016-01-01

    The sintering process promotes densification and the evolution of the microstructure of the material, with consequent significant increase in hardness and mechanical strength. However, few studies show the influence of pressure and temperature during sintering by hot pressing. In this sense, this work aims to evaluate the microstructural changes and properties with the variation of pressure and temperature and the type suffered by sintering metal powders during sintering by hot pressing. For this, two samples were studied by changing the sintering parameters: 25% Fe-50% Cu-25% Nb and 25% Fe-50% Cu-25% Co. Samples were analyzed by SEM / EDS in order to check the morphology and the presence of pores, as well as the interaction between the metallic constituents of each sample by the EDS analysis in line. They also determined the relative density, porosity and Vickers hardness (HV5). At the end of the study it was concluded that niobium alloy composite element by sintering activated suffered together with the liquid phase sintering. For cobalt alloys were observed by liquid phase sintering. The increase in the severity of the sintering conditions (temperature and pressure) led to an improvement in physical and mechanical properties of the alloys, which indicates that these parameters are directly related to the mechanisms of diffusion in the sintering process, improving the properties and diffusivity between elements. (author)

  20. Comparative studies on mechanical properties of WC-Co composites sintered by SPS and conventional techniques

    Directory of Open Access Journals (Sweden)

    Pristinskiy Yuri

    2017-01-01

    Full Text Available Spark plasma sintering (SPS is an extremely fast solidification technique for compounds that are difficult to sinter within the material group metals, ceramics, or composites thereof, SPS uses a uniaxial pressure and a very rapid heating cycle to consolidate these materials. With SPS the main benefit is the ability to control the WC grain size due to the short sintering times at high temperature. Additionally, its allows to avoid negative reactions between WC and cobalt and to minimize the formation of undesirable phases in sintered composites. The WC-6wt.% Co cermet prepared by SPS processing achieves the enhanced mechanical properties with the hardness of 18.3 GPa and the fracture toughness of 15.5 MPa·m1/2 in comparison to standard reference tungsten carbide/cobalt material.

  1. Structure and characteristics of functional powder composite materials obtained by spark plasma sintering

    Science.gov (United States)

    Oglezneva, S. A.; Kachenyuk, M. N.; Kulmeteva, V. B.; Ogleznev, N. B.

    2017-07-01

    The article describes the results of spark plasma sintering of ceramic materials based on titanium carbide, titanium carbosilicide, ceramic composite materials based on zirconium oxide, strengthened by carbon nanostructures and composite materials of electrotechnical purpose based on copper with addition of carbon structures and titanium carbosilicide. The research shows that the spark plasma sintering can achieve relative density of the material up to 98%. The effect of sintering temperature on the phase composition, density and porosity of the final product has been studied. It was found that with addition of carbon nanostructures the relative density and hardness decrease, but the fracture strength of ZrO2 increases up to times 2. The relative erosion resistance of the electrodes made of composite copper-based powder materials, obtained by spark plasma sintering during electroerosion treatment of tool steel exceeds that parameter of pure copper up to times 15.

  2. Material Evaluation and Process Optimization of CNT-Coated Polymer Powders for Selective Laser Sintering

    Directory of Open Access Journals (Sweden)

    Shangqin Yuan

    2016-10-01

    Full Text Available Multi-walled carbon nanotubes (CNTs as nano-reinforcements were introduced to facilitate the laser sintering process and enhance the thermal and mechanical properties of polymeric composites. A dual experimental-theoretical method was proposed to evaluate the processability and predict the process parameters of newly developed CNT-coated polyamide 12 (CNTs/PA12 powders. The thermal conductivity, melt viscosity, phase transition and temperature-dependent density and heat capacity of PA12 and CNTs/PA12 powders were characterized for material evaluation. The composite powders exhibited improved heat conduction and heat absorption compared with virgin polymer powders, and the stable sintering range of composite powders was extended and found to be favourable for the sintering process. The microstructures of sintered composites revealed that the CNTs remained at the powder boundaries and formed network architectures, which instantaneously induced the significant enhancements in tensile strength, elongation at break and toughness without sacrificing tensile modulus.

  3. Determinants of the quality of sintered steel for the automotive industry

    Directory of Open Access Journals (Sweden)

    Barbara Lisiecka

    2016-03-01

    Full Text Available The increasing demand on components obtained using powder metallurgy is driven by economic changes that have turned product quality into the most basic criterion which affects the interest in a component and its successful use. The improvement in quality should be expected in the beginning of the planning of the technological process and selection of adequate raw materials. High requirements concerning product quality management and production improvement stimulates the development of the current automotive industry where sintered steels represent the highest percentage of products. The multiphase sinters investigated in the study were prepared from two types of water–atomized steel powders: 316L and 409L. Optical microscopy, X–ray phase analysis and examinations of microhardness were performed in order to determine the microstructure and basic properties of sintered steels. The main assumption for this study was to analyse the microstructure and mechanical properties of sintered steels used for manufacturing of various car parts.

  4. Plasma sintering of ferritic steel reinforced with niobium carbide prepared by high energy milling

    International Nuclear Information System (INIS)

    Silva Junior, J.F. da; Almeida, E.O.; Gomes, U.U.; Alves Junior, C.; Messias, A.P.; Universidade Federal do Rio Grande do Norte

    2010-01-01

    Plasma is an ionized gas where ions are accelerated from anode to cathode surface, where the sample is placed. There are a lot of collisions on cathode surface by ions heating and sintering the sample. High energy milling (HEM) is often used to produce composite particles to be used on powder metallurgy. These particles can exhibit fine particles and high phase dispersion. This present work aim to study ferritic steels reinforced with 3%NbC prepared by HEM and sintered on plasma furnace. Ferritic steel and NbC powders were milled during 5 hours and characterized by SEM, XRD and laser scattering. Then, these composite powders were compacted in a cylindrical steel die and then sintered in a plasma furnace. Vickers microhardness tests and SEM and XRD analysis were performed on sintered samples. (author)

  5. Possible actions for the minimization of the environmental impact of the iron ore sintering fumes

    International Nuclear Information System (INIS)

    Garcia-Carcedo, F.; Ayala, N.; Isidro, A.; Moro, A.; Cornejo, N.; Ferreira, S.; Hernandez, A.; Cobo, A.; Alaiz, E.; Garcia, J. R.

    2004-01-01

    In sintering plants, gaseous emissions are generated which must comply with increasingly demanding environmental regulations. In the sintering process, about 40 kg of coke and 1,700 Nm''3 of air are used per ton of useful sinter. Sintering fumes have a gaseous phase formed mainly of N 2 , O 2 , CO 2 , H 2 O and CO and the minor components SO . SO 3 , NO and NO 2 . Other minor components include unburned organic products and CLH, and minimal proportions of other high impact compounds such as dioxins and furans are also present. Chlorides and heavy metals are present in the solid fraction. This paper reviews the situation of each emission in relation with the applicable regulations, and the possible means of reducing these emissions. (Author) 12 refs

  6. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

    2015-03-01

    Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

  7. Effect of sintering on structure and mechanical properties of alumina-15 vol% zirconia nanocomposite compacts

    International Nuclear Information System (INIS)

    Maneshian, Mohammad H.; Banerjee, Malay K.

    2010-01-01

    The sintering and densification behavior of high energy ball milled (HEBM-ed) alumina-15 vol% zirconia nanocomposite were carried out and the probable tetragonal to monoclinic phase transformation of ZrO 2 during sintering was investigated. Evolution of microstructure resulting from sintering was followed up by means of scanning electron microscopy (SEM) on polished samples, and the degree of phase transformation was determined by quantitative X-ray analysis (XRD). Moreover, synergetic effect of milling time and dopant composition on properties such as relative density, hardness, and fracture toughness was studied. The results have shown that mechanical properties of the composites were strongly dependent on the dopant content, structure and the fraction of tetragonal to monoclinic induced by HEBM and subsequent sintering. The extent of retention of t-ZrO 2 depends on the balance of magnitude of the strain energy arising from HEBM and releasing from sintering. In fact, compacts with aggressive HEBM history showed improved fracture toughness. Also it is shown the homogeneous microstructure obtained by HEBM and subsequent sintering promotes better densification.

  8. Sol-gel synthesis of lithium metatitanate as tritium breeding material under different sintering conditions

    Science.gov (United States)

    Lu, Wei; Wang, Jing; Pu, Wenjing; Li, Kaiping; Ma, Shubing; Wang, Weihua

    2018-04-01

    Lithium metatitanate (Li2TiO3) is a promising tritium breeding material candidate for solid blanket of D-T fusion reactors, due to its high mechanical strength, chemical stability, and tritium release rate. In this paper, Li2TiO3 powder with homogeneous crystal structure is synthesized by sol-gel method. The chemical reactions in gel thermal cracking and sintering process are studied by thermo gravimetric/differential scanning calorimetry (TG-DSC). The relationship between the sintering condition and the particle/grain size is characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). Results show that below 673 K the gel precursor is completely decomposed and Li2TiO3 phase initially forms. The LiTiO2 by-product formed under the reductive atmosphere in muffle furnace, could be oxidized continually to Li2TiO3 at higher sintering temperature (≥1273 K) for longer sintering time (≥10 h). Both grain and particle sizes rely on a linear growth with the increase of sintering time at 1273 K. Over 1473 K, significant agglomerations exist among particles. The optimal sintering condition is selected as 1273 K for 10 h, for the purer Li2TiO3 phase (>99%), smaller grain and particle size.

  9. Effect of microstructure changes on magnetic properties of spark plasma sintered Nd-Fe-B powders

    Directory of Open Access Journals (Sweden)

    Michalski B.

    2013-01-01

    Full Text Available In this study the SPS method was applied for low RE content (8,5% at. and high RE content (13,5 % at. MQ powders. The powders were sintered in a wide range of temperature, for 5 min., under pressure of 35 MPa. The low RE content grade, densified reluctantly and gained the density close to the theoretical value only for 850 °C. The coercivity decreased gradually with increasing sintering temperature. On the other hand, the densification of the higher RE content grade powder occurred much easier and the coercivity, close to the theoretical value, was achieved already at 650 °C. The coercivity of this material also decreased with increasing sintering temperature. Microstructural studies revealed that the SPS sintering process leads to partial decomposition of the Nd2Fe14B phase. The proportion of the RE-rich and iron phases increases parallel to the increasing sintering temperature. On the basis of the current results one can conclude that fabrication of high density MQ powders based magnets by the SPS method is possible, however the powders having higher RE content should be used for this purpose and the sintering temperature as low as possible, related to density, should be kept.

  10. Experimental sintering of ash at conduit conditions and implications for the longevity of tuffisites

    Science.gov (United States)

    Gardner, James E.; Wadsworth, Fabian B.; Llewellin, Edward W.; Watkins, James M.; Coumans, Jason P.

    2018-03-01

    Escape of gas from magma in the conduit plays a crucial role in mitigating explosivity. Tuffisite veins—ash-filled cracks that form in and around volcanic conduits—represent important gas escape pathways. Sintering of the ash infill decreases its porosity, eventually forming dense glass that is impermeable to gas. We present an experimental investigation of surface tension-driven sintering and associated densification of rhyolitic ash under shallow conduit conditions. Suites of isothermal (700-800 °C) and isobaric H2O pressure (20 and 40 MPa) experiments were run for durations of 5-90 min. Obsidian powders with two different size distributions were used: 1-1600 μm (mean size = 89 μm), and 63-400 μm (mean size = 185 μm). All samples evolved similarly through four textural phases: phase 1—loose and cohesion-less particles; phase 2—particles sintered at contacts and surrounded by fully connected tortuous pore space of up to 40% porosity; phase 3—continuous matrix of partially coalesced particles that contain both isolated spherical vesicles and connected networks of larger, contorted vesicles; phase 4—dense glass with 2-5% fully isolated vesicles that are mainly spherical. Textures evolve faster at higher temperature and higher H2O pressure. Coarse samples sinter more slowly and contain fewer, larger vesicles when fully sintered. We quantify the sintering progress by measuring porosity as a function of experimental run-time, and find an excellent collapse of data when run-time is normalized by the sintering timescale {λ}_s=η \\overline{R}/σ , where η is melt viscosity, \\overline{R} is mean particle radius, and σ is melt-gas surface tension. Because timescales of diffusive H2O equilibration are generally fast compared to those of sintering, the relevant melt viscosity is calculated from the solubility H2O content at experimental temperature and pressure. We use our results to develop a framework for estimating ash sintering rates under shallow

  11. A finite difference model of the iron ore sinter process

    OpenAIRE

    Muller, J.; de Vries, T.L.; Dippenaar, B.A.; Vreugdenburg, J.C.

    2015-01-01

    Iron ore fines are agglomerated to produce sinter, which is an important feed material for blast furnaces worldwide. A model of the iron ore sintering process has been developed with the objective of being representative of the sinter pot test, the standard laboratory process in which the behaviour of specific sinter feed mixtures is evaluated. The model aims to predict sinter quality, including chemical quality and physical strength, as well as key sinter process performance parameters such ...

  12. COMPACTION OF LITHIUM-SILICATE CERAMICS USING SPARK PLASMA SINTERING

    Directory of Open Access Journals (Sweden)

    Tomas Frantisek Kubatik

    2016-12-01

    Full Text Available This paper deals with the compaction of ceramics based on lithium-silicate by spark plasma sintering (SPS. The initial powder was prepared by calcination in a resistance furnace at a temperature of 1300 °C with the ratio of Li/Si = 1. Compacting by SPS was carried out at temperatures of 800 - 1000 °C with a maximum pressure of 80 MPa. Samples with open porosity of less than 1 % were prepared at the temperature of 1000 °C. According to the quantitative Rietveld refinement of x-ray diffraction data, the dominant phases in all samples were Li₂Si₂O₅ and Li₂SiO₃, together representing over 80 wt. % of the sintered material.

  13. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  14. DC resistivity of alumina and zirconia sintered with TiC

    Indian Academy of Sciences (India)

    as a conducting second phase with an aim to prepare conducting structural ceramics which can be precisely machined by EDM technique. TiC did not help in sintering the parent phase but it decreased the d.c. resistivity of the composite to 1 ohm.cm at ∼ 30 vol.% loading. The conductivity is explained by the effective media ...

  15. Synthesis and Optimization of the Sintering Kinetics of Actinide Nitrides

    International Nuclear Information System (INIS)

    Butt, Drryl P.; Jaques, Brian

    2009-01-01

    Research conducted for this NERI project has advanced the understanding and feasibility of nitride nuclear fuel processing. In order to perform this research, necessary laboratory infrastructure was developed; including basic facilities and experimental equipment. Notable accomplishments from this project include: the synthesis of uranium, dysprosium, and cerium nitrides using a novel, low-cost mechanical method at room temperature; the synthesis of phase pure UN, DyN, and CeN using thermal methods; and the sintering of UN and (U x , Dy 1-x )N (0.7 (le) X (le) 1) pellets from phase pure powder that was synthesized in the Advanced Materials Laboratory at Boise State University.

  16. Synthesis and Optimization of the Sintering Kinetics of Actinide Nitrides

    Energy Technology Data Exchange (ETDEWEB)

    Drryl P. Butt; Brian Jaques

    2009-03-31

    Research conducted for this NERI project has advanced the understanding and feasibility of nitride nuclear fuel processing. In order to perform this research, necessary laboratory infrastructure was developed; including basic facilities and experimental equipment. Notable accomplishments from this project include: the synthesis of uranium, dysprosium, and cerium nitrides using a novel, low-cost mechanical method at room temperature; the synthesis of phase pure UN, DyN, and CeN using thermal methods; and the sintering of UN and (Ux, Dy1-x)N (0.7 ≤ X ≤ 1) pellets from phase pure powder that was synthesized in the Advanced Materials Laboratory at Boise State University.

  17. Sintered-to-size FBR fuel

    International Nuclear Information System (INIS)

    Rasmussen, D.E.; Schaus, P.S.

    1984-04-01

    Fabrication of sintered-to-size PuO 2 -UO 2 fuel pellets was completed for testing of proposed FBR product specifications. Approximately 6000 pellets were fabricated to two nominal diameters and two densities by cold pressing and sintering to size. Process control and correlation between test and production batches are discussed

  18. Sintering characteristics of nano-ceramic coatings

    NARCIS (Netherlands)

    de Hosson, J.T.M.; Popma, R.

    2003-01-01

    This paper concentrates on sintering characteristics of nano-sized ceramic SiO2 particles. The sintering process is studied as a function of temperature using a conventional furnace and using a laser beam. The underlying idea is to combine the nanoceramic sol-gel concept with inkjet technology and

  19. Thermally stable sintered porous metal articles

    International Nuclear Information System (INIS)

    Gombach, A.L.; Thellmann, E.L.

    1980-01-01

    A sintered porous metal article is provided which is essentially thermally stable at elevated temperatures. In addition, a method for producing such an article is also provided which method comprises preparing a blend of base metal particles and active dispersoid particles, forming the mixture into an article of the desired shape, and heating the so-formed article at sintering temperatures

  20. Sintering of ultra high molecular weight polyethylene

    Indian Academy of Sciences (India)

    Abstract. Ultra high molecular weight polyethylene (UHMWPE) is a high performance polymer having low coefficient of friction, good abrasion resistance, good chemical ... In this study, we report our results on compaction and sintering behaviour of two grades of UHMWPE with reference to the powder morphology, sintering ...

  1. Mechanical characteristics of microwave sintered silicon carbide

    Indian Academy of Sciences (India)

    In firing of products by conventionally sintered process, SiC grain gets oxidized producing SiO2 (∼ 32 wt%) and deteriorates the quality of the product substantially. Partially sintered silicon carbide by such a method is a useful material for a varieties of applications ranging from kiln furniture to membrane material.

  2. Recrystallization and embrittlement of sintered tungsten

    International Nuclear Information System (INIS)

    Bega, N.D.; Babak, A.V.; Uskov, E.I.

    1982-01-01

    The recrystallization of sintered tungsten with a cellular structure of deformation is studied as related to its embrittlement. It is stated that in case of preliminary recrystallization the sintered tungsten crack resistance does not depend on the testing temperature. The tungsten crack resistance is shown to lower with an increase of the structure tendency to primary recrystallization [ru

  3. Master sintering curves of two different alumina powder compacts

    Directory of Open Access Journals (Sweden)

    Vaclav Pouchly

    2009-12-01

    Full Text Available Concept of Master Sintering Curve is a strong tool for optimizing sintering schedule. The sintering behaviour can be predicted, and sintering activation energy can be calculated with the help of few dilatometric measurements. In this paper an automatic procedure was used to calculate Master Sintering Curves of two different alumina compacts. The sintering activation energies were determined as 640 kJ/mol for alumina with particle size of 240 nm, respective 770 kJ/mol for alumina with particle size of 110 nm. The possibility to predict sintering behaviour with the help of Master Sintering Curve was verified.

  4. The Influence of Sintering Temperature of Reactive Sintered (Ti, MoC-Ni Cermets

    Directory of Open Access Journals (Sweden)

    Marek Jõeleht

    2015-09-01

    Full Text Available Titanium-molybdenum carbide nickel cermets ((Ti, MoC-Ni were produced using high energy milling and reactive sintering process. Compared to conventional TiC-NiMo cermet sintering the parameters for reactive sintered cermets vary since additional processes are present such as carbide synthesis. Therefore, it is essential to acquire information about the suitable sintering regime for reactive sintered cermets. One of the key parameters is the final sintering temperature when the liquid binder Ni forms the final matrix and vacancies inside the material are removed. The influence of the final sintering temperature is analyzed by scanning electron microscopy. Mechanical properties of the material are characterized by transverse rupture strength, hardness and fracture toughness.DOI: http://dx.doi.org/10.5755/j01.ms.21.3.7179

  5. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  6. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  7. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  8. Characterization and properties of sintered WC–Co and WC–Ni–Fe hard metal alloys

    International Nuclear Information System (INIS)

    Chang, Shih-Hsien; Chen, Song-Ling

    2014-01-01

    Highlights: • WC–Ni–Fe alloy sintered at 1400 °C had the highest hardness (HRA 85.3 ± 0.5). • The optimal WC–Ni–Fe sintered alloy possessed the highest TRS value (2524.5 ± 1.0 MPa). • The fracture toughness of the sintered WC–Ni–Fe alloys is mainly provided by the Ni–Fe binders. • WC–Ni–Fe sintered alloy possessed the highest fracture toughness of K IC (15.1 MPa m 1/2 ). • The WC–Ni–Fe sintered alloy had the much better corrosion resistance in 0.15 M HCl solution. -- Abstract: The aim of this study is to explore two different tungsten carbide binders (Co and Ni–Fe) and then impose various sintering temperature treatments. Experimental results show that the optimal sintering temperatures for WC–Co and WC–Ni–Fe hard metal alloys are 1350 °C and 1400 °C for 1 h, respectively. Meanwhile, the WC–Co and WC–Ni–Fe alloys undergo a well liquid-phase sintering and, thus, exhibit excellent mechanical properties. In addition, the sintered WC–Co and WC–Ni–Fe alloys show that when the relative density reached 99.76% and 99.68%, the hardness was enhanced to HRA 84.4 ± 0.5 and 85.3 ± 0.5, and the TRS increased to 2471.2 ± 1.0 and 2524.5 ± 1.0 MPa, respectively. Moreover, the corrosion test results show that the WC–Ni–Fe alloy sintered at 1400 °C had the lowest corrosion current (I corr ) of 1.11 × 10 −5 A cm −2 and the highest polarization resistance (R p ) of 2464.61 Ω cm 2 in 0.15 M HCl solution. Simultaneously, the fracture toughness of K IC increased to 15.1 MPa m 1/2 . Compared with sintered WC–Co alloys, the sintered WC–Ni–Fe hard metal alloys possessed much better corrosion resistance and mechanical properties

  9. Sintered ceramics having controlled density and porosity

    International Nuclear Information System (INIS)

    Brassfield, H.C.; DeHollander, W.R.; Nivas, Y.

    1980-01-01

    A new method was developed for sintering ceramic uranium dioxide powders, in which ammonium oxalate is admixed with the powder prior to being pressed into a cylindrical green body, so that the end-point density of the final nuclear-reactor fuel product can be controlled. When the green body is heated, the ammonium oxalate decomposes and leaves discrete porosity in the sintered body, which corresponds to the ammonium oxalate regions in the green body. Thus the end-point density of the sintered body is a function of the amount of ammonium oxalate added. The final density of the sintered product is about 90-97% of the theoretical. The addition of ammonium oxalate also allows control of the pore size and distribution throughout the fuel. The process leaves substantially no impurities in the sintered strucuture. (DN)

  10. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  11. Sinter ageing of equiatomic Al20Co20Cu20Zn20Ni20 high entropy alloy via mechanical alloying

    International Nuclear Information System (INIS)

    Mohanty, Sutanuka; Gurao, N.P.; Biswas, Krishanu

    2014-01-01

    The present investigation reports for the first time, the sinter ageing of equiatomic Al 20 Co 20 Cu 20 Ni 20 Zn 20 high entropy alloy (HEA), being synthesized by high energy ball milling of elemental powder blend under protective argon atmosphere, followed by consolidation of the milled powder by spark plasma sintering at different temperatures and applied pressure of 50 MPa. The detailed X-ray diffraction and transmission electron microscopy (TEM) studies indicate the presence of single phase, FCC β supersaturated solid solution in the ball milled powder. However, the sintering of the as-milled powder reveals the formation of α with ordered FCC (L1 2 ) structure within the grains of FCC γ. The microstructural analysis using TEM shows the precipitation of near cuboidal shaped α phase within the grains of γ. The size and shape of the precipitates depend on the sintering temperature. Hardness measurement of the sintered alloys suggests age hardening of the as-milled powder during sintering. The sinter age hardening of HEA is attributed to the fine scale precipitation of α phase. Detailed variation of the hardness and microstructural evolution are reported here to elucidate this novel finding

  12. Investigation of the sinterability of ZrO_2 (Y_2O3_)-bioglass dental ceramics by dilatometry

    International Nuclear Information System (INIS)

    Bicalho, Luiz de Araujo; Barboza, Miguel Ribeiro Justino; Santos, Claudinei dos; Habibe, Alexandre Fernandes; Magnago, Roberto de Oliveira

    2013-01-01

    The objective of this work is to study by dilatometry, the liquid phase sintering of ZrO_2 ceramics using bioglass as sintering additive. Y_2 O_3 - stabilized ZrO_2 powders were mixed with 3, 5 and 10 wt% of bioglass with the composition based on 3CaOP_2 O_5 -MgO-SiO_2 system. Specimens were prepared by cold uniaxial pressing under 80MPa and the green relative density was determined. The sintering behavior was studied by measuring the linear shrinkage of samples in a dilatometer in relation to the temperature. The heating and cooling rates used in this study were 10 deg C/min and the maximum sintering temperatures was 1300 deg C with a 120 min isothermal holding time. The results of the shrinkage and shrinkage rates in regard of the sintering temperature and time were related to the amount of bioglass added. The sintered samples were characterized by X-ray diffraction analysis and their relative density. SEM micrographs indicates similar microstructure, and an increase of bioglass content leads to increasing of monoclinic ZrO_2 phase content. The dilatometry results indicate a reduction of the temperature where a maximum shrinkage rate occurs, as function of bioglass increasing. Furthermore, the use of liquid phase reduces the maximum sintering temperature of 1447 deg C to 1250-1280 deg C. (author)

  13. Sintering of Si C by hot-pressing with addition of Al2O3 and concentrate of rare earths

    International Nuclear Information System (INIS)

    Hwang, M.K.; Silva, C.R.M.

    2004-01-01

    Silicon carbide (SiC) has essentially covalent bonds (∼88%). The high covalency bond is responsible for the good mechanical properties, although it induces a low self diffusion coefficient, making densification more difficult. For a successful densification is necessary to apply pressure on the samples, and/or the addition of sintering additives, which improves the densification. In this SiC samples with alumina (Al2O3) and concentrate of rare earth (CRE) addition were sintered by hot pressing in argon atmospheric at 20 MPa of pressure, heating rate of 20 deg C/min up to 1800 deg C and a dwell time of 1 h. Initially the CRE was calcined at 1000 deg C during 1 h. After that, three mixtures were prepared with distinct concentrations in high energy mill and the samples were sintered. The aim of this work is to improve SiC densification by the liquid phase formation during sintering owing to the additives reactions between itself. The pressure intensify the driving force for densification, taking the liquid phase to drain easier through the grain boundaries, making possible best accommodation and rearrangement of the grains. The application of the pressure on the samples during sintering contributes to improve densification and becomes possible sintering in lower temperature than conventional one. The phases of the sintered samples were analyzed by X-ray diffraction and the morphology were verified by scanning electron microscopy. (author)

  14. Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

    International Nuclear Information System (INIS)

    Park, M.S.; Stephenson, M.K.; Shannon, C.; Cáceres Díaz, L.A.; Hudspeth, K.A.; Gibbons, S.L.; Muñoz-Saldaña, J.; Arróyave, R.

    2012-01-01

    Cu/Sn soldering alloys have emerged as a viable alternative to Pb-based solders, and thus have been extensively explored in the past decade, although the fine-scale behavior of the resulting intermetallic compounds (IMCs), particularly during the early stages of interface formation, is still a source of debate. In this work, the microstructural evolution of Cu 6 Sn 5 , in a Cu/Sn soldering reaction at 523 K, was experimentally investigated by dipping a single Cu sample into molten Sn at a near-constant speed, yielding a continuous set of time evolution samples. The thickness, coarsening and morphology evolution of the Cu 6 Sn 5 layer is investigated through the use of scanning electron microscopy. The experimental results are also compared to phase-field simulations of the microstructural evolution of the Cu 6 Sn 5 layer. The influence of model parameters on the kinetics and morphological evolution of the IMC layer was examined. In general, good qualitative agreement is found between experiments and simulations and for a limited parameter set there appears to be good quantitative agreement between the growth kinetics of the Cu 6 Sn 5 layer, the grain boundary (GB) effect on grain coarsening, and the substrate/IMC interface roughness evolution. Furthermore, the parametric investigations of the model suggests that good agreement between experiments and simulations is achieved when the dominant transport mechanism for the reacting elements (Cu and Sn) is GB diffusion.

  15. On the sintering kinetics in UO2

    International Nuclear Information System (INIS)

    Marajofsky, A.

    1998-01-01

    The fabrication process of UO 2 pellets from powders involve pressing and a sintering anneal at high temperature (1650 deg. C to 1750 deg. C) during two or more hours in a hydrogen atmosphere. An alternative method is the oxidative sintering, made at lower temperature (1000 deg. C to 1300 deg. C) in a CO 2 or CO/CO 2 atmosphere. The sintering phenomena consist in the densification of the material by a thermal treatment below the fusion point. For a compact made by pressing a powder, sintering is the process of annulation of the porosity present in the compact or pellet. Several theories describe the sintering phenomena dividing it in three stages, initial, intermediate and final: in all of them the densification is a continuous growing function of time. Nevertheless it has been experimentally reported that a reduction of the density occurs in the third step of the sintering. The phenomena has been called solarization. Solarization has been attributed to the effect of the evolved gases from additives or to the CO 2 atmosphere in oxidative sintering. Thus, it is convenient to distinguish between solarization in oxidative or reducing conditions. Reducing solarization is a consequence of the tendency towards equilibrium of intergranular pores. In oxidative sintering it occurs in the reducing anneal after the sintering and is due to the change in the lattice parameter. This work shows examples of both types of solarization and qualitative interpretation of this phenomena. Both situations show the need of strict control of the sintering and powder production conditions. (author)

  16. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  17. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  18. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  19. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  20. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  1. Liquid phase sintered SiC ceramics from starting materials of different grade Cerâmicas à base de SiC sinterizadas via fase líquida a partir de matérias-primas de diferentes purezas

    Directory of Open Access Journals (Sweden)

    V. A. Izhevskyi

    2004-09-01

    Full Text Available Possibility of high performance ceramics manufactured from commercial SiC powder of technical grade has been shown. Sintering behavior and microstructure formation under conditions of liquid phase sintering (LPS with oxynitride sintering aids (AlN-Y2O3 of three SiC-based compositions have been investigated. Two of the compositions were based on Alcoa 1000 SiC powder of technical grade, and the third one, which was used as a reference, was based on H.C. Starck UF-15 fine grade commercial powder. Milling process used for Alcoa 1000 SiC powder granulometry improvement has been investigated in detail, while chemical treatment of milled SiC powders has been used for pick-up impurities removal. Dilatometric experiments showed that SiC powder of technical grade after appropriate treatment exhibits sinterability comparable with the fine grade SiC. Microstructural investigations performed on sintered samples showed that the final microstructure of the Alcoa 1000 SiC based materials was practically identical with the H.C. Starck SiC based reference ones. Preliminary investigations of hardness and fracture toughness were carried out revealing excellent results for the materials produced from cheaper, nationally produced starting powder.Neste trabalho é apresentada a possibilidade de obtenção de cerâmicas de SiC de alto desempenho a partir de matéria-prima comercial de grau técnico. Foi realizado o estudo de sinterização via fase líquida e desenvolvimento microestrutural de três composições à base de SiC tendo como aditivos de sinterização AlN e Y2O3 . Duas destas composições são à base de SiC-1000 da Alcoa, grau técnico, e a terceira, utilizada como referência, à base do UF-15 da H.C. Starck - Alemanha, pó comercial de granulometria fina. O processo de moagem do pó SiC-1000 da Alcoa foi acompanhado por medidas de distribuição granulométrica e posterior ataque químico, para remoção de impurezas. Os pós de grau técnico, ap

  2. Vacuum Pressureless Sintering of Ti-6Al-4V Alloy with Full Densification and Forged-Like Mechanical Properties

    Science.gov (United States)

    Zhang, Ce; Lu, Boxin; Wang, Haiying; Guo, Zhimeng; Paley, Vladislav; Volinsky, Alex A.

    2018-01-01

    Ti-6Al-4V ingots with a nearly 100% density, fine and homogeneous basket-weave microstructure, and better comprehensive mechanical properties (UTS = 935 MPa, Y.S. = 865 MPa, El. = 15.8%), have been manufactured by vacuum pressureless sintering of blended elemental powders. Coarse TiH2 powder, Al powder (2, 20 μm), V powder, and Al-V master alloy powder were used as raw materials to produce different powder mixtures ( D 50 = 10 μm). Then, the compacts made by cold isostatic pressing were consolidated by different sintering curves. A detailed investigation of different as-sintered samples revealed that a higher density can be obtained by generating transient molten Al in the sintering process. Coarse Al powder and a rapid heating rate under the melting point of Al contribute to molten Al formation. The presence of temporary liquid phase changes the sintering mechanism, accelerating the sintering neck formation, improving sinterability of the powder mixtures. Density of 99.5% was achieved at 1150 °C, which is markedly lower than the sintering temperatures reported for conventional blended elemental powder metallurgy routes. In addition, low interstitial content, especially for oxygen (0.17 wt.%), is obtained by strict process control.

  3. Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics

    International Nuclear Information System (INIS)

    Chung, Wan-Ho; Hwang, Hyun-Jun; Kim, Hak-Sung

    2015-01-01

    In this work, the hybrid copper inks with precursor and nanoparticles were fabricated and sintered via flash light irradiation to achieve highly conductive electrode pattern with low porosity. The hybrid copper ink was made of copper nanoparticles and various copper precursors (e.g., copper(II) chloride, copper(II) nitrate trihydrate, copper(II) sulfate pentahydrate and copper(II) trifluoroacetylacetonate). The printed hybrid copper inks were sintered at room temperature and under ambient conditions using an in-house flash light sintering system. The effects of copper precursor weight fraction and the flash light irradiation conditions (light energy and pulse duration) were investigated. Surfaces of the sintered hybrid copper patterns were analyzed using a scanning electron microscope. Also, spectroscopic characterization techniques such as Fourier transform infrared spectroscopy and X-ray diffraction were used to investigate the crystal phases of the flash light sintered copper precursors. High conductivity hybrid copper patterns (27.3 μΩ cm), which is comparable to the resistivity of bulk copper (1.68 μΩ cm) were obtained through flash light sintering at room temperature and under ambient conditions. - Highlights: • The hybrid copper inks with precursor and nanoparticles were fabricated. • The hybrid copper ink was sintered via flash light irradiation. • The resistivity of sintered hybrid copper ink was 27.3 μΩ cm. • Highly conductive copper film with low porosity could be achieved

  4. Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics

    Energy Technology Data Exchange (ETDEWEB)

    Chung, Wan-Ho; Hwang, Hyun-Jun [Department of Mechanical Convergence Engineering, Hanyang University, 17 Haendang-Dong, Seongdong-Gu, Seoul 133-791 (Korea, Republic of); Kim, Hak-Sung, E-mail: kima@hanyang.ac.kr [Department of Mechanical Convergence Engineering, Hanyang University, 17 Haendang-Dong, Seongdong-Gu, Seoul 133-791 (Korea, Republic of); Institute of Nano Science and Technology, Hanyang University, Seoul 133-791 (Korea, Republic of)

    2015-04-01

    In this work, the hybrid copper inks with precursor and nanoparticles were fabricated and sintered via flash light irradiation to achieve highly conductive electrode pattern with low porosity. The hybrid copper ink was made of copper nanoparticles and various copper precursors (e.g., copper(II) chloride, copper(II) nitrate trihydrate, copper(II) sulfate pentahydrate and copper(II) trifluoroacetylacetonate). The printed hybrid copper inks were sintered at room temperature and under ambient conditions using an in-house flash light sintering system. The effects of copper precursor weight fraction and the flash light irradiation conditions (light energy and pulse duration) were investigated. Surfaces of the sintered hybrid copper patterns were analyzed using a scanning electron microscope. Also, spectroscopic characterization techniques such as Fourier transform infrared spectroscopy and X-ray diffraction were used to investigate the crystal phases of the flash light sintered copper precursors. High conductivity hybrid copper patterns (27.3 μΩ cm), which is comparable to the resistivity of bulk copper (1.68 μΩ cm) were obtained through flash light sintering at room temperature and under ambient conditions. - Highlights: • The hybrid copper inks with precursor and nanoparticles were fabricated. • The hybrid copper ink was sintered via flash light irradiation. • The resistivity of sintered hybrid copper ink was 27.3 μΩ cm. • Highly conductive copper film with low porosity could be achieved.

  5. Titanium Powder Sintering in a Graphite Furnace and Mechanical Properties of Sintered Parts

    Directory of Open Access Journals (Sweden)

    Changzhou Yu

    2017-02-01

    Full Text Available Recent accreditation of titanium powder products for commercial aircraft applications marks a milestone in titanium powder metallurgy. Currently, powder metallurgical titanium production primarily relies on vacuum sintering. This work reported on the feasibility of powder sintering in a non-vacuum furnace and the tensile properties of the as-sintered Ti. Specifically, we investigated atmospheric sintering of commercially pure (C.P. titanium in a graphite furnace backfilled with argon and studied the effects of common contaminants (C, O, N on sintering densification of titanium. It is found that on the surface of the as-sintered titanium, a severely contaminated porous scale was formed and identified as titanium oxycarbonitride. Despite the porous surface, the sintered density in the sample interiors increased with increasing sintering temperature and holding time. Tensile specimens cut from different positions within a large sintered cylinder reveal different tensile properties, strongly dependent on the impurity level mainly carbon and oxygen. Depending on where the specimen is taken from the sintered compact, ultimate tensile strength varied from 300 to 580 MPa. An average tensile elongation of 5% to 7% was observed. Largely depending on the interstitial contents, the fracture modes from typical brittle intergranular fracture to typical ductile fracture.

  6. Melting and Sintering of Ashes

    DEFF Research Database (Denmark)

    Hansen, Lone Aslaug

    1997-01-01

    -1300°C, and a trend of higher fusion temperatures with increasing contents of Al-silicates and quartz was found.c) Fly ashes, bottom ashes and deposits from coal/straw co-firing were all found to consist mainly of metal-alumina and alumina-silicates. These ashes all melt in the temperature range 1000......The thesis contains an experimental study of the fusion and sintering of ashes collected during straw and coal/straw co-firing.A laboratory technique for quantitative determination of ash fusion has been developed based on Simultaneous Thermal Analysis (STA). By means of this method the fraction......, the biggest deviations being found for salt rich (i.e. straw derived) ashes.A simple model assuming proportionality between fly ash fusion and deposit formation was found to be capable of ranking deposition rates for the different straw derived fly ashes, whereas for the fly ashes from coal/straw co-firing...

  7. Thermodynamics and mechanisms of sintering

    International Nuclear Information System (INIS)

    Pask, J.A.

    1978-10-01

    A phenomenological overview and exploration of the thermodynamic and geometric factors play a role in the process of densification of model compact systems consisting of crystalline spheres of uniform size in regular and irregular packing that form grain boundaries at every contact point. A further assumption is the presence of isotropic surface and grain boundary energies. Although such systems are unrealistic in comparison with normal powder compacts, their potential sintering behavior can be analyzed and provided with a limiting set of behavior conditions which can be looked upon as one boundary condition. This approach is logically realistic since it is easier to understand and provide a basis for understanding the more complex real powder systems

  8. The Properties of Sintered Calcium Phosphate with [Ca]/[P] = 1.50

    Directory of Open Access Journals (Sweden)

    Moo-Chin Wang

    2012-10-01

    Full Text Available In order to obtain the properties of the sintered as-dried calcium phosphate with [Ca]/[P] = 1.50, the characteristics of sintered pellets have been investigated using X-ray diffraction (XRD, inductively coupled plasma-mass spectrometry (ICP-MS, Fourier-transform infrared (FT-IR spectra, Vickers hardness indentation and scanning electron microscopy (SEM. When the pellet samples were sintered between 700 °C and 1200 °C for 4 h, the hydroxyapatite (Ca10(PO46(OH2, HA still maintained the major phase, accompanied with the rhenanite (NaCaPO4 as the secondary phase and β-tricalcium phosphate (β-Ca3(PO42, β-TCP as the minor phases. In addition, the HA partially transformed to α-tricalcium phosphate (α-Ca3(PO42, α-TCP and tetracalcium phosphate (Ca4(PO42O, TTCP, when the pellet samples were sintered at 1300 °C and 1400 °C, respectively, for 4 h. The maximum density and Vickers Hardness (HV of sintered pellet samples were 2.85 g/cm3 (90.18% theoretical density (T.D. and 407, which appeared at 1200 °C and 900 °C, respectively.

  9. Improvement of conditions for ceramics sintering on the base of lead zirconate-titanate

    International Nuclear Information System (INIS)

    Glinchuk, M.D.; Kim, P.V.; Bykov, I.P.; Lyashchenko, A.B.

    1989-01-01

    Lead zirconate-titanate powders of different graininess are studied for their phase composition. The finest grains of the powder consist of lead zirconate-titanate with the rhombohedral structure. Grains of 3-5 μm size are a mixture of lead zirconate-titanate and lead titanate, the latter exceeding 50% (by weight) causes the effect of anomalous expansion in the process of sintering. Control of the technological parameters of the synthesis permits producing powder with favourable correlation of the above phases and grain sizes. Sintering of such a powder induces no effect of the anomalous expansion with an increased density of the product attained

  10. Calcination of Rod-like Hydroxyapatite Nanocrystals with an Anti-sintering Agent Surrounding the Crystals

    International Nuclear Information System (INIS)

    Okada, M.; Furuzono, T.

    2007-01-01

    Sintering-free nanocrystals of calcined hydroxyapatite (HAp) having a rod-like morphology were fabricated by calcination at 800 deg. C for 1 h with an anti-sintering agent surrounding original HAp particles and the agent was subsequently removed after calcination. The original HAp particles having a rod-like morphology with a size ranging from 30 to 80 nm (short axis) and 300 to 500 nm (long axis) were prepared by wet chemical process, and poly(acrylic acid, calcium salt) (PAA-Ca) was used as the anti-sintering agent. In the case of calcination without additives, the mean size of HAp crystals dispersed in an ethanol medium increased by about 4 times and the specific surface area of the crystals exhibited a 25% decrease compared to those of the original HAp particles because of calcination-induced sintering among the crystals. On the other hand, the HAp crystals calcined with the anti-sintering agent, PAA-Ca, could be dispersed in an ethanol medium at the same size as the original particles, and they preserved the specific surface area after calcination. These results indicate that PAA-Ca and/or its thermally decomposed product, CaO, surrounded the HAp particles and protected them against calcination-induced sintering during calcination. The HAp crystals calcined with PAA-Ca showed high crystallinity, and no other calcium phosphate phases could be detected after washing with water

  11. Fabrication and study of double sintered TiNi-based porous alloys

    Science.gov (United States)

    Sergey, Anikeev; Valentina, Hodorenko; Timofey, Chekalkin; Victor, Gunther; Ji-hoon, Kang; Ji-soon, Kim

    2017-05-01

    Double-sintered porous TiNi-based alloys were fabricated and their structural characteristics and physico-mechanical properties were investigated. A fabrication technology of powder mixtures is elaborated in this article. Sintering conditions were chosen experimentally to ensure good structure and properties. The porous alloys were synthesized by solid-state double diffusion sintering (DDS) of Ti-Ni powder and prepare to obtain dense, crack-free, and homogeneous samples. The Ti-Ni compound sintered at various temperatures was investigated by scanning electron microscopy. Phase composition of the sintered alloys was determined by x-ray diffraction. Analysis of the data confirmed the morphology and structural parameters. Mechanical and physical properties of the sintered alloys were evaluated. DDS at 1250 °C was found to be optimal to produce porous samples with a porosity of 56% and mean pore size of 90 μm. Pore size distribution was unimodal within the narrow range of values. The alloys present enhanced strength and ductility, owing to both the homogeneity of the macrostructure and relative elasticity of the bulk, which is hardened by the Ni-rich precipitates. These results suggest the possibility to manufacture porous TiNi-based alloys for application as a new class of dental implants.

  12. Reaction-sintered porous mineral-based mullite ceramic membrane supports made from recycled materials.

    Science.gov (United States)

    Dong, Yingchao; Zhou, Jian-Er; Lin, Bin; Wang, Yongqing; Wang, Songlin; Miao, Lifeng; Lang, Ying; Liu, Xingqin; Meng, Guangyao

    2009-12-15

    Bulk porous mullite supports for ceramic membranes were prepared directly using a mixture of industrial waste fly ash and bauxite by dry-pressing, followed by sintering between 1200 and 1550 degrees C. The effects of sintering temperature on the phase composition and shrinkage percent of porous mullite were studied. The XRD results indicate that secondary mullitization reaction took place above 1200 degrees C, and completed at 1450 degrees C. During sintering, the mixture samples first shrunk, then expanded abnormally between 1326 and 1477 degrees C, and finally shrunk again above 1477 degrees C. This unique volume self-expansion is ascribed to the secondary mullitization reaction between bauxite and fly ash. More especially, the micro-structural variations induced by this self-expansion sintering were verified by SEM, porosity, pore size distribution and nitrogen gas permeation flux. During self-expansion sintering, with increasing temperature, an abnormal increase in both open porosity and pore size is observed, which also results in the increase of nitrogen gas flux. The mineral-based mullite supports with increased open porosity were obtained. Furthermore, the sintered porous mullite membrane supports were characterized in terms of thermal expansion co-efficient and mechanical strength.

  13. Cold compaction behavior and pressureless sinterability of ball milled WC and WC/Cu powders

    Directory of Open Access Journals (Sweden)

    Hashemi Seyed R.

    2016-01-01

    Full Text Available In this research, cold compaction behavior and pressureless sinterability of WC, WC-10%wtCu and WC-30%wtCu powders were investigated. WC and WC/Cu powders were milled in a planetary ball mill for 20h. The milled powders were cold compacted at 100, 200, 300 and 400 MPa pressures. The compressibility behavior of the powders was evaluated using the Heckel, Panelli-Ambrosio and Ge models. The results showed that the Panelli-Ambrosio was the preferred equation for description the cold compaction behavior of the milled WC and WC-30%wtCu powders. Also, the most accurate model for describing the compressibility of WC-10%wtCu powders was the Heckel equation. The cold compacts were sintered at 1400°C. It was found that by increasing the cold compaction pressure of powder compacts before sintering, the sinterability of WC-30%wtCu powder compacts was enhanced. However, the cold compaction magnitude was not affected significantly on the sinterability of WC and WC-10%wtCu powders. The microstructural investigations of the sintered samples by Scanning Electron Microscopy (SEM confirmed the presence of porosities at the interface of copper-tungsten carbide phases.

  14. Double Step Sintering Behavior Of 316L Nanoparticle Dispersed Micro-Sphere Powder

    Directory of Open Access Journals (Sweden)

    Jeon Byoungjun

    2015-06-01

    Full Text Available 316L stainless steel is a well-established engineering material and lots of components are fabricated by either ingot metallurgy or powder metallurgy. From the viewpoints of material properties and process versatility, powder metallurgy has been widely applied in industries. Generally, stainless steel powders are prepared by atomization processes and powder characteristics, compaction ability, and sinterability are quite different according to the powder preparation process. In the present study, a nanoparticle dispersed micro-sphere powder is synthesized by pulse wire explosion of 316L stainless steel wire in order to facilitate compaction ability and sintering ability. Nanoparticles which are deposited on the surface of micro-powder are advantageous for a rigid die compaction while spherical micro-powder is not to be compacted. Additionally, double step sintering behavior is observed for the powder in the dilatometry of cylindrical compact body. Earlier shrinkage peak comes from the sintering of nanoparticle and later one results from the micro-powder sintering. Microstructure as well as phase composition of the sintered body is investigated.

  15. The evaluation of microstructure and mechanical properties of sintered sub-micron WC-Co powders

    International Nuclear Information System (INIS)

    Nor Izan Izura; Mohd Asri Selamat; Noraizham Mohamad Diah; Talib Ria Jaafar

    2007-01-01

    A cemented tungsten carbide (WC-Co) is widely used for a variety of machining, cutting, drilling and other applications. The properties of this tungsten heavy alloy are sensitive to processing and degraded by residual porosity. The sequence of high end powder metallurgy process include mixing, compacting and followed by multi-atmosphere sintering of green compact were analyzed. The sub micron (<1.0 μm) and less than 10.0 μm of WC powders are sintered with a metal binder 6% Co to provide pore-free part. The powder compacts were sintered at temperatures cycle in the range of 1200 degree Celsius-1550 degree Celsius in nitrogen-based sintering atmosphere. To date, however there have been few reported studies in the literature that the best sintering was carried out via liquid phase sintering in vacuum at approximately 1500 degree Celsius. from this study we found that in order to attain high mechanical properties, a fine grain size of powder is necessary. Therefore, the attention of this work is to develop and produce wear resistant component with better properties or comparable to the commercial ones. (author)

  16. Microstructural evaluation of the NbC-20Ni cemented carbides during sintering

    International Nuclear Information System (INIS)

    Rodrigues, D.; Cannizza, E.

    2016-01-01

    Full text: Fine carbides in a metallic matrix (binder) form the microstructure of the cemented carbides. Grain size and binder content are the main variables to adjust hardness and toughness. These products are produced by Powder Metallurgy, and traditional route involves mixing carbides with binder by high energy milling, pressing and sintering. During sintering, a liquid phase promotes densification, and a final relative density higher than 99% is expected. Sintering is carried out at high temperatures, and dissolution of the carbides changes the chemical composition of the binder. To control grain growth of the main carbide, which reduces hardness, small quantities of secondary carbides are used. These additives limit dissolution and precipitation of the main carbides reducing the final grain size. This paper focused the structural and chemical evolution during sintering using NbC-20Ni cermets. Mixtures of very fine NbC carbides and carbonyl Ni powders were produce by intense milling. These mixtures were pressed using uniaxial pressures from 50 to 200MPa. Shrinkage was evaluated using dilatometric measurements under an atmosphere of dynamic argon. Samples were also sintered under vacuum in high temperature industrial furnace. The sintered samples were characterized in terms of density hardness, toughness and microstructure. DRX was the main tool used to evaluate the structural evolution of the binder. In situ chemical analysis helped to understand the dissolution mechanisms. (author)

  17. Processing and characterization of device solder interconnection and module attachment for power electronics modules

    Science.gov (United States)

    Haque, Shatil

    This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

  18. Science of sintering and its future

    International Nuclear Information System (INIS)

    Ristic, M.M.

    1975-01-01

    Some new books published by M.Yu. Baljshin, V.A. Ivensen, V.V. Skorohod and others are characterized by the wish to give a complete approach to the problems of sintering theory. Bearing just this in mind while writing the book ''An Essay on the Generalization of Sintering Theory'' (G.V.Samsonov, M.M. Ristic with the collaborators) an idea was born: to ask the most eminent scientists in this field to present their own opinions on the theme ''The Science of Sintering and Modern Views on its Future''. There were formed 18 questions, given in the appendix to be answered. The received answers were presented in 10 chapters of this book. The fourth part of the book consists of papers of eminent scientists engaged in the field of sintering science (some of which were published here for the first time). This material is published in the book with the consent of the authors and these original contributions provide a more profound knowledge of sintering. The initial idea, that the book should have a monograph character and in which the answers would serve as some data on the latest notions of the science of sintering, was somewhat changed since the original opinions of individual scientists are given in the book and these, are sometimes very contradictory. This, in fact, gives the book a special charm because the unsolved problems in the science of sintering are most evidently stressed in this way

  19. Sinterization of manganese ore tailings under argon atmosphere

    Energy Technology Data Exchange (ETDEWEB)

    Valduga, M.M.F.; Lima, F.; Lima, R.M.F. [Universidade Federal de Ouro Preto (UFOP), MG (Brazil)

    2014-07-01

    Manganese is an element widely used in Metallurgy, however the Brazilian reserves has low grade. The aim of this work was to obtain and characterize the sinters from manganese ore tailings. The fines (less than 400⧣) were calcinated (800°C - 3600s) and homogenized with activated charcoal (7 and 10%) and CaO (5 and 10%). The sintering were carried out at 1135, 1140 and 1145°C during 7200 and 14400s under argon atmosphere. The sintered products were characterized by EDS analysis, BET surface area, apparent density, X-rays diffraction and SEM/EDS. The surface area was 0.03m2/g. The alkali element present (potassium) justified the low melting point of waste (1140°C). Due to the chemical complexity of the tailings, several phases were characterized in the products: pores, silicates with high content of manganese in the matrix, other silicates with different proportions of Al, Mn, Mg and Ca, pure Fe, SiO2, etc. (author)

  20. Mineralogy and microstructure of sintered lignite coal fly ash

    Energy Technology Data Exchange (ETDEWEB)

    Marina Ilic; Christopher Cheeseman; Christopher Sollars; Jonathan Knight [Faculty of Technology and Metallurgy, Belgrade (Yugoslavia)

    2003-02-01

    Lignite coal fly ash from the 'Nikola Tesla' power plant in Yugoslavia has been characterised, milled, compacted and sintered to form monolithic ceramic materials. The effect of firing at temperatures between 1130 and 1190{sup o}C on the density, water accessible porosity, mineralogy and microstructure of sintered samples is reported. This class C fly ash has an initial average particle size of 82 {mu}m and contains siliceous glass together with the crystalline phases quartz, anorthite, gehlenite, hematite and mullite. Milling the ash to an average particle size of 5.6 m, compacting and firing at 1170{sup o}C for 1 h produces materials with densities similar to clay-based ceramics that exhibit low water absorption. Sintering reduces the amount of glass, quartz, gehlenite and anhydrite, but increases formation of anorthite, mullite, hematite and cristobalite. SEM confirms the formation of a dense ceramic at 1170{sup o}C and indicates that pyroplastic effects cause pore formation and bloating at 1190{sup o}C. 23 refs., 6 figs., 2 tabs.

  1. Highly textured KNN-based piezoelectric ceramics by conventional sintering

    International Nuclear Information System (INIS)

    Zapata, Angelica Maria Mazuera; Silva Junior, Paulo Sergio da; Zambrano, Michel Venet

    2016-01-01

    Full text: Texturing in ferroelectric ceramics has played an important role in the enhancement of their piezoelectric properties. Common methods for ceramic texturing are hot pressing and template grain ground; nevertheless, the needed facilities to apply hot pressing and the processing of single crystal make the texture of ceramics expensive and very difficult. In this study, a novel method was investigated to obtain highly textured lead-free ceramics. A (K 0.5 Na 0.5 ) 0.97 Li 0. 0 3 Nb 0.8 Ta 0. 2 matrix (KNLNT), with CuO excess was sintered between 1070 and 1110 °C following a solid state reaction procedure. The CuO excess promotes liquid phase formation and a partial melting of the material. XRD patterns showed the intensity of (100) family peaks became much stronger with the increasing of sintering temperature and CuO. In addition, Lotgering factor was calculated and exhibited a texture degree between 40 % and 70 % for sintered samples having 13 and 16 wt. % CuO, respectively. These, highly textured ceramics, with adequate cut, can be used as substitutes single crystals for texturing of KNN-based lead-free ceramics. (author)

  2. Hexagonal OsB{sub 2}: Sintering, microstructure and mechanical properties

    Energy Technology Data Exchange (ETDEWEB)

    Xie, Zhilin [Department of Mechanical and Aerospace Engineering, University of Central Florida, Orlando, FL 32816 (United States); Lugovy, Mykola [Department of Mechanical and Aerospace Engineering, University of Central Florida, Orlando, FL 32816 (United States); Institute for Problems of Materials Science, 3 Krzhizhanivskii Str., Kyiv 03142 (Ukraine); Orlovskaya, Nina, E-mail: Nina.Orlovskaya@ucf.edu [Department of Mechanical and Aerospace Engineering, University of Central Florida, Orlando, FL 32816 (United States); Graule, Thomas; Kuebler, Jakob [Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for High Performance Ceramics, CH-8600 Dubendorf (Switzerland); Mueller, Martin [Laboratory of Mechanical Metallurgy, EPFL, CH-1015 Lausanne (Switzerland); Gao, Huili [Department of Mechanical Engineering, Texas A& M University, College Station, TX 77843 (United States); Radovic, Miladin [Department of Materials Science and Engineering, Texas A& M University, College Station, TX 77843 (United States); Cullen, David A. [Materials Science & Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831 (United States)

    2015-06-15

    Highlights: • ReB{sub 2}-type hexagonal OsB{sub 2} powder has been densified by spark plasma sintering. • The sintered OsB{sub 2} contains ∼80 wt.% hexagonal and ∼20 wt.% orthorhombic phases. • The average grain size of the sintered OsB{sub 2} sample was 0.56 ± 0.26 μm. • H = 31 ± 9 GPa and E = 574 ± 112 GPa measured by nanoindentation. - Abstract: The metastable high pressure ReB{sub 2}-type hexagonal OsB{sub 2} bulk ceramics was produced by spark plasma sintering. The phase composition, microstructure, and mechanical behavior of the sintered OsB{sub 2} were studied by X-ray diffraction, optical microscopy, TEM, SEM, EDS, and nanoindentation. The produced ceramics was rather porous and contained a mixture of hexagonal (∼80 wt.%) and orthorhombic (∼20 wt.%) phases as identified by X-ray diffraction and EBSD analysis. Two boron-rich phases, which do not contain Os, were also identified by TEM and SEM/EDS analysis. Nanoindentation measurements yielded a hardness of 31 ± 9 GPa and Young’s modulus of 574 ± 112 GPa, indicating that the material is rather hard and very stiff; however, it is very prone to crack formation and propagation, which is indicative of a very brittle nature of this material. Improvements in the sintering regime are required in order to produce dense, homogeneous and single phase hexagonal OsB{sub 2} bulk ceramics.

  3. Immobilization of Uranium Silicide in Sintered Iron-Phosphate Glass

    International Nuclear Information System (INIS)

    Mateos, Patricia; Russo, Diego; Rodriguez, Diego; Heredia, A; Sanfilippo, M.; Sterba, Mario

    2003-01-01

    This work is a continuation of a previous one performed in vitrification of uranium silicide in borosilicate and iron-silicate glasses, by sintering.We present the results obtained with an iron-phosphate glass developed at our laboratory and we compare this results with those obtained with the above mentioned glasses. The main objective was to develop a method as simple as possible, so as to get a monolithic glass block with the appropriate properties to be disposed in a deep geological repository.The thermal transformation of the uranium silicide was characterized by DTA/TG analysis and X-ray diffraction.We determined the evolution of the crystalline phases and the change in weight.Calcined uranium silicide was mixed with natural U 3 O 8 , the amount of U 3 O 8 was calculated to simulate an isotopic dilution of 4%.This material was mixed with powdered iron-phosphate glass (in wt.%: 64,9 P 2 O 5 ; 22,7 Fe 2 O 3 ; 8,1 Al 2 O 3 ; 4,3 Na 2 O) in different proportions (in wt%): 7%, 10% y 15%.The powders were pressed and sintered at temperatures between 585 y 670 °C. Samples of the sintered pellet were prepared for the lixiviation tests (MCC-1P: monolithic samples; deionised water; 90° C; 7, 14 and 28 days).The samples showed a quite good durability (0,6 g.m -2 .day -1 ), similar to borosilicate glasses.The microstructure of the glass samples showed that the uranium particles are much better integrated to the glass matrix in the iron-phosphate glasses than in the borosilicate or iron-silicate glasses.We can conclude that the sintered product obtained could be a good alternative for the immobilization of nuclear wastes with high content of uranium, as the ones arising from the conditioning of research reactors spent fuels

  4. Design of sintering-stable heterogeneous catalysts

    DEFF Research Database (Denmark)

    Gallas-Hulin, Agata

    One of the major issues in the use of metal nanoparticles in heterogeneous catalysis is sintering. Sintering occurs at elevated temperatures because of increased mobility of nanoparticles, leading to their agglomeration and, as a consequence, to the deactivation of the catalyst. It is an emerging...... problem especially for the noble metals-based catalysis. These metals being expensive and scarce, it is worth developing catalyst systems which preserve their activity over time. Encapsulation of nanoparticles inside zeolites is one of the ways to prevent sintering. Entrapment of nanoparticles inside...

  5. Solidification of HLLW into sintered ceramics

    International Nuclear Information System (INIS)

    O-Oka, K.; Ohta, T.; Masuda, S.; Tsunoda, N.

    1979-01-01

    Simulated HLLW from the PNC reprocessing plant at Tokai was solidified into sintered ceramics by normal sintering or hot-pressing with addition of some oxides. Among various ceramic products obtained so far, the most preferable was nepheline-type sintered solids formed with addition of SiO 2 and Al 2 O 3 to the simulated waste calcine. The solid shows advantageous properties in leach rate and mechanical strength, which suggest that the ceramic solids were prepared with additions of ZrO 2 or MnO 2 , and some of them showed good characteristics

  6. Effect of rigid inclusions on sintering

    International Nuclear Information System (INIS)

    Rahaman, M.N.; De Jonghe, L.C.

    1988-01-01

    The predictions of recent theoretical studies on the effect of inert, rigid inclusions on the sintering of ceramic powder matrices are examined and compared with experimental data. The densification of glass matrix composites with inclusion volume fractions of ≤0.15 can be adequately explained by Scherer's theory for viscous sintering with rigid inclusions. Inclusions cause a vast reduction in the densification rates of polycrystalline matrix composites even at low inclusion volume fractions. Models put forward to explain the sintering of polycrystalline matrix composites are discussed

  7. Immobilization of Uranium Silicides in Sintered Glass

    International Nuclear Information System (INIS)

    Mateos, P.; Russo, D.O.; Heredia, A.D.; Sanfilippo, M.

    2003-01-01

    High activity nuclear spent fuels vitrification by fusion is a well known technology which has industrial scale in France, England, Japan, EEUU. Borosilicates glasses are used in this process.Sintered glasses are an alternative to the immobilization task in which there is also a wide experience around the world.The available technics are: cold pressing and sintering , hot-pressing and hot isostatic pressing.This work compares Borosilicates and Iron silicates sintered glasses behaviour when different ammounts of nuclear simulated waste is added

  8. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  9. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  10. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  11. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  12. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  13. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  14. Microwave combustion and sintering without isostatic pressure

    International Nuclear Information System (INIS)

    Ebadian, M.A.

    1998-01-01

    In recent years interest has grown rapidly in the application of microwave energy to the processing of ceramics, composites, polymers, and other materials. Advances in the understanding of microwave/materials interactions will facilitate the production of new ceramic materials with superior mechanical properties. One application of particular interest is the use of microwave energy for the mobilization of uranium for subsequent redeposition. Phase III (FY98) will focus on the microwave assisted chemical vapor infiltration tests for mobilization and redeposition of radioactive species in the mixed sludge waste. Uranium hexachloride and uranium (IV) borohydride are volatile compounds for which the chemical vapor infiltration procedure might be developed for the separation of uranium. Microwave heating characterized by an inverse temperature profile within a preformed ceramic matrix will be utilized for CVI using a carrier gas. Matrix deposition is expected to commence from the inside of the sample where the highest temperature is present. The preform matrix materials, which include aluminosilicate based ceramics and silicon carbide based ceramics, are all amenable to extreme volume reduction, densification, and vitrification. Important parameters of microwave sintering such as frequency, power requirement, soaking temperature, and holding time will be investigated to optimize process conditions for the volatilization of uranyl species using a reactive carrier gas in a microwave chamber

  15. Fabrication and microstructure of CNTs activated sintered W–Nb alloys

    International Nuclear Information System (INIS)

    Sha, J.J.; Hao, X.N.; Li, J.; Wang, Z.

    2014-01-01

    Highlights: • Fabrication and microstructure of CNTs activated sintered W-Nb alloys were investigated. • CNTs could significantly enhance the sintering ability of W-Nb alloys at a low temperature. • The improved sintering was due to the enhanced diffusion of W atoms along the GBs induced by CNTs. • The grain size in CNTs activated sintered W-Nb alloys decreased with increasing the Nb content. -- Abstract: In order to fabricate highly dense W-based alloys at low temperature, in the present work, high-energy ball milling and hot pressing were applied to fabricate W–Nb alloys (mass fraction of Nb varied from 0.5% to 5%), where CNTs were used as the activated sintering additives. The phase composition and microstructure were characterized by XRD and SEM equipped with EDS, respectively. The study found coupled effects of CNTs activated sintering and Nb addition on the enhanced sintering ability and refined microstructure of W at 1500 °C. The main results are: (i) XRD characterization revealed that the high-energy ball milling could significantly reduce the crystallite size of W particles and increase lattice distortion, which would enhance the sintering behavior of W alloys. (ii) The addition of CNTs to W (W–0.1CNTs) led to the formation of nanoscale interfacial layer between W grains during hot pressing, resulting in considerable densification and grain growth. Based on this result, it suggested that the activated sintering of W in the present work is due to an enhanced diffusion of W atoms along the GBs induced by CNTs. (iii) With the addition of CNTs to W–Nb alloys, the densification was improved again, but was not so obvious. The optimal densification was obtained for the W–0.1CNTs–1Nb specimen. Moreover, the microstructure characterization in CNTs activated sintered W–Nb alloys indicated that the distribution of sphere-like W(Nb) solid solution particles and decreased W grain sizes with increasing Nb content are the main microstructure features

  16. Sintering of nano crystalline o silicon carbide doping with

    Indian Academy of Sciences (India)

    Sinterable silicon carbide powders were prepared by attrition milling and chemical processing of an acheson type -SiC. Pressureless sintering of these powders was achieved by addition of aluminium nitride together with carbon. Nearly 99% sintered density was obtained. The mechanism of sintering was studied by ...

  17. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  18. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  19. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  20. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established