Research on enhancement of natural circulation capability in lead–bismuth alloy cooled reactor by using gas-lift pump

Energy Technology Data Exchange (ETDEWEB)

Zuo, Juanli, E-mail: Jenyzuo@163.com; Tian, Wenxi, E-mail: wxtian@mail.xjtu.edu.cn; Chen, Ronghua, E-mail: ronghua.chen@stu.xjtu.edu.cn; Qiu, Suizheng; Su, Guanghui, E-mail: ghsu@mail.xjtu.edu.cn

2013-10-15

Highlights: • The gas-lift pump has been adopted to enhance the natural circulation capability. • LENAC code is developed in my study. • The calculation results by LENAC code show good agreement with experiment results. • Gas mass flow rate, bubble diameter, rising pipe length are important parameters. -- Abstract: The gas-lift pump has been adopted to enhance the natural circulation capability in the type of lead–bismuth alloy cooled reactors such as Accelerator Driven System (ADS) and Liquid–metal Fast Reactor (LMFR). The natural circulation ability and the system safety are obviously influenced by the two phase flow characteristics of liquid metal–inert gas. In this study, LENAC (LEad bismuth alloy NAtural Circulation capability) code has been developed to evaluate the natural circulation capability of lead–bismuth cooled ADS with gas-lift pump. The drift flow theory, void fraction prediction model and friction pressure drop prediction model have been incorporated into LENAC code. The calculation results by LENAC code show good agreement with experiment results of CIRCulation Experiment (CIRCE) facility. The effects of the gas mass flow rate, void fraction, gas quality, bubble diameter and the rising pipe height or the potential difference between heat exchanger and reactor core on natural circulation capability of gas-lift pump have been analyzed. The results showed that in bubbly flow pattern, for a fixed value of gas mass flow rate, the natural circulation capability increased with the decrease of the bubble diameter. In the bubbly flow, slug flow, churn flow and annular flow pattern, with the gas mass flow rate increasing, the natural circulation capability initially increased and then declined. And the flow parameters influenced the thermal hydraulic characteristics of the reactor core significantly. The present work is helpful for revealing the law of enhancing the natural circulation capability by gas-lift pump, and providing theoretical

Technology for On-Chip Qubit Control with Microfabricated Surface Ion Traps

Energy Technology Data Exchange (ETDEWEB)

Highstrete, Clark [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Quantum Information Sciences Dept.; Scott, Sean Michael [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). RF/Optoelectronics Dept.; Nordquist, Christopher D. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). RF/Optoelectronics Dept.; Sterk, Jonathan David [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Photonic Microsystem Technologies Dept.; Maunz, Peter Lukas Wilhelm [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Photonic Microsystem Technologies Dept.; Tigges, Christopher P. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Photonic Microsystem Technologies Dept.; Blain, Matthew Glenn [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Photonic Microsystem Technologies Dept.; Heller, Edwin J. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Microsystems Integration Dept.; Stevens, James E. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). MESAFab Operations 2 Dept.

2013-11-01

Trapped atomic ions are a leading physical system for quantum information processing. However, scalability and operational fidelity remain limiting technical issues often associated with optical qubit control. One promising approach is to develop on-chip microwave electronic control of ion qubits based on the atomic hyperfine interaction. This project developed expertise and capabilities at Sandia toward on-chip electronic qubit control in a scalable architecture. The project developed a foundation of laboratory capabilities, including trapping the ¹⁷¹Yb⁺ hyperfine ion qubit and developing an experimental microwave coherent control capability. Additionally, the project investigated the integration of microwave device elements with surface ion traps utilizing Sandia’s state-of-the-art MEMS microfabrication processing. This effort culminated in a device design for a multi-purpose ion trap experimental platform for investigating on-chip microwave qubit control, laying the groundwork for further funded R&D to develop on-chip microwave qubit control in an architecture that is suitable to engineering development.

Study on decay heat removal capability of reactor vessel auxiliary cooling system

International Nuclear Information System (INIS)

Nishi, Y.; Kinoshita, I.

1991-01-01

The reactor vessel auxiliary cooling system (RVACS) is a simple, Passive decay heat removal system for an LMFBR. However, the heat removal capacity of this system is small compared to that of an immersed type of decay heat exchanger. In this study, a high-porosity porous body is proposed to enhance the RVACS's heat transfer performance to improve its applicability. The objectives of this study are to propose a new method which is able to use thermal radiation effectively, to confirm its heat removal capability and to estimate its applicability limit of RVACS for an LMFBR. Heat transfer tests were conducted in an experimental facility with a 3.5 m heat transfer height to evaluate the heat transfer performance of the high-porosity porous body. Using the experimental results, plant transient analyses were performed for a 300 MWe pool type LMFBR under a Total Black Out (TBO) condition to confirm the heat removal capability. Furthermore, the relationship between heat removal capability and thermal output of a reactor were evaluated using a simple parameter model

Amdahl 470 Chip Package

CERN Multimedia

1975-01-01

In the late 70s the larger IBM computers were water cooled. Amdahl, an IBM competitor, invented an air cooling technology for it's computers. His company worked hard, developing a computer that was faster and less expensive than the IBM System/360 mainframe computer systems. This object contains an actual Amdahl series 470 computer logic chip with an air cooling device mounted on top. The package leads and cooling tower are gold-plated.

On-chip photonic interconnects a computer architect's perspective

CERN Document Server

Nitta, Christopher J; Akella, Venkatesh

2013-01-01

As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

Microfluidic Organ-on-a-Chip Models of Human IntestineSummary

Directory of Open Access Journals (Sweden)

Amir Bein

Full Text Available Microfluidic organ-on-a-chip models of human intestine have been developed and used to study intestinal physiology and pathophysiology. In this article, we review this field and describe how microfluidic Intestine Chips offer new capabilities not possible with conventional culture systems or organoid cultures, including the ability to analyze contributions of individual cellular, chemical, and physical control parameters one-at-a-time; to coculture human intestinal cells with commensal microbiome for extended times; and to create human-relevant disease models. We also discuss potential future applications of human Intestine Chips, including how they might be used for drug development and personalized medicine. Keywords: Organs-on-Chips, Gut-on-a-Chip, Intestine-on-a-Chip, Microfluidic

Nuclear demagnetisation cooling of a nanoelectronic device

Science.gov (United States)

Jones, Alex; Bradley, Ian; Guénault, Tony; Gunnarsson, David; Haley, Richard; Holt, Stephen; Pashkin, Yuri; Penttilä, Jari; Prance, Jonathan; Prunnila, Mika; Roschier, Leif

We present a new technique for on-chip cooling of electrons in a nanostructure: nuclear demagnetisation of on-chip, thin-film copper refrigerant. We are motivated by the potential improvement in the operation of nanoelectronic devices below 10 mK . At these temperatures, weak electron-phonon coupling hinders traditional cooling, yet here gives the advantage of thermal isolation between the environment and the on-chip electrons, enabling cooling significantly below the base temperature of the host lattice. To demonstrate this we electroplate copper onto the metallic islands of a Coulomb blockade thermometer (CBT), and hence provide a direct thermal link between the cooled copper nuclei and the device electrons. The CBT provides primary thermometry of its internal electron temperature, and we use this to monitor the cooling. Using an optimised demagnetisation profile we observe the electrons being cooled from 9 mK to 4 . 5 mK , and remaining below 5 mK for an experimentally useful time of 1200 seconds. We also suggest how this technique can be used to achieve sub- 1 mK electron temperatures without the use of elaborate bulk demagnetisation stages.

60 GHz system-on-chip (SoC) with built-in memory and an on-chip antenna

KAUST Repository

Ghaffar, Farhan A.

2014-04-01

A novel 60 GHz transmitter SoC with an on-chip antenna and integrated memory in CMOS 65 nm technology is presented in this paper. This highly integrated transmitter design can support a data rate of 2 GBPS with a transmission range of 1 m. The transmitter consists of a fundamental frequency 60 GHz PLL which covers the complete ISM band. The modulator following the PLL can support both BPSK and OOK modulation schemes. Both stored data on the integrated memory or directly from an external source can be transmitted. A tapered slot on chip antenna is integrated with the power amplifier to complete the front end of the transmitter design. Size of the complete transmitter with on-chip antenna is only 1.96 mm × 1.96 mm. The core circuits consume less than 100 mW of power. The high data rate capability of the design makes it extremely suitable for bandwidth hungry applications such as unencrypted HD video streaming and transmission.

60 GHz system-on-chip (SoC) with built-in memory and an on-chip antenna

KAUST Repository

Ghaffar, Farhan A.; Arsalan, Muhammad; Cheema, Hammad; Salama, Khaled N.; Shamim, Atif

2014-01-01

A novel 60 GHz transmitter SoC with an on-chip antenna and integrated memory in CMOS 65 nm technology is presented in this paper. This highly integrated transmitter design can support a data rate of 2 GBPS with a transmission range of 1 m. The transmitter consists of a fundamental frequency 60 GHz PLL which covers the complete ISM band. The modulator following the PLL can support both BPSK and OOK modulation schemes. Both stored data on the integrated memory or directly from an external source can be transmitted. A tapered slot on chip antenna is integrated with the power amplifier to complete the front end of the transmitter design. Size of the complete transmitter with on-chip antenna is only 1.96 mm × 1.96 mm. The core circuits consume less than 100 mW of power. The high data rate capability of the design makes it extremely suitable for bandwidth hungry applications such as unencrypted HD video streaming and transmission.

On-chip sample preparation for complete blood count from raw blood.

Science.gov (United States)

Nguyen, John; Wei, Yuan; Zheng, Yi; Wang, Chen; Sun, Yu

2015-03-21

This paper describes a monolithic microfluidic device capable of on-chip sample preparation for both RBC and WBC measurements from whole blood. For the first time, on-chip sample processing (e.g. dilution, lysis, and filtration) and downstream single cell measurement were fully integrated to enable sample preparation and single cell analysis from whole blood on a single device. The device consists of two parallel sub-systems that perform sample processing and electrical measurements for measuring RBC and WBC parameters. The system provides a modular environment capable of handling solutions of various viscosities by adjusting the length of channels and precisely controlling mixing ratios, and features a new 'offset' filter configuration for increased duration of device operation. RBC concentration, mean corpuscular volume (MCV), cell distribution width, WBC concentration and differential are determined by electrical impedance measurement. Experimental characterization of over 100,000 cells from 10 patient blood samples validated the system's capability for performing on-chip raw blood processing and measurement.

Perspectives on the Massachusetts Community Health Information Profile (MassCHIP): developing an online data query system to target a variety of user needs and capabilities.

Science.gov (United States)

Cohen, Bruce B; Franklin, Saul; West, James K

2006-01-01

The Massachusetts Community Health Information Profile (MassCHIP) has many distinctive features. These features evolved to maximize the usefulness of this query system for a broad group of users with varied needs, differing levels of knowledge about public health, and diverse experience using public health data. Three major features of MassCHIP help target our large user population. These features are as follows: (1) multiple avenues of entry to initiate queries ranging from an alphabetical list of simple topics to detailed International Classification of Disease codes; (2) the inclusion of data sets from other state agencies in addition to those of the Massachusetts Department of Public Health to reflect a broad view of public health; and (3) the capacity to retrieve data for multiple levels of geography, from the neighborhood through the state, including planning districts and hospitals. In this article, we discuss the history and design of MassCHIP, and focus on the features of MassCHIP that target a great variety of user needs and capabilities, and which are distinctive among Web-based data query systems.

Preliminary Analysis on Decay Heat Removal Capability of Helium Cooled Solid Breeder Test Blanket Module

International Nuclear Information System (INIS)

Ahn, Mu Young; Cho, Seung Yon; Kim, Duck Hoi; Lee, Eun Seok; Kim, Hyung Seok; Suh, Jae Seung; Yun, Sung Hwan; Cho, Nam Zin

2007-01-01

One of the main ITER goals is to test and validate design concepts of tritium breeding blankets relevant to DEMO or fusion power plants. Korea Helium-Cooled Solid Breeder (HCSB) Test Blanket Module (TBM) has been developed with overall objectives of achieving this goal. The TBM employs high pressure helium to cool down the First Wall (FW), Side Wall (SW) and Breeding Zone (BZ). Therefore, safety consideration is a part of the design process. Each ITER Party performing the TBM program is requested to reach a similar level of confidence in the TBM safety analysis. To meet ITER's request, Failure Mode and Effects Analysis (FMEA) studies have been performed on the TBM to identify the Postulated Initial Event (PIE). Although FMEA on the KO TBM has not been completed, in-vessel, in-box and ex-vessel Loss Of Coolant Accident (LOCA) are considered as enveloping cases of PIE in general. In this paper, accidental analyses for the three selected LOCA were performed to investigate the decay heat removal capability of the TBM. To simulate transient thermo-hydraulic behavior of the TBM for the selected scenarios, RELAP5/MOD3.2 code was used

Evaluation of the gravity-injection capability for core cooling after a loss-of-SDC event

International Nuclear Information System (INIS)

Seul, Kwang Won; Bang, Young Seok; Kim, Hho Jung

1999-01-01

In order to evaluate the gravity-drain capability to maintain core cooling after a loss-of-shutdown-cooling event during shutdown operation, the plant conditions of the Young Gwang Units 3 and 4 were reviewed. The six cases of possible gravity-drain paths using the water of the refueling water storage tank (RWST) were identified and the thermal hydraulic analyses were performed using RELAP5/MOD3.2 code. The core cooling capability was dependent on the gravity-drain paths and the drain rate. In the cases with the injection path and opening on the different leg side, the system was well depressurized after gravity-injection and the core boiling was successfully prevented for a long-term transient. However, in the cases with the injection path and opening on the cold leg side, the core coolant continued boiling although the system pressure remains atmospheric after gravity-injection because the cold water injected from the RWST was bypassed the core region. In the cases with the higher pressurizer opening than the RWST water level, the system was also pressurized by the water-hold in the pressurizer and the core was uncovered because the gravity-injection from the RWST stopped due to the high system pressure. In addition, from the sensitivity study on the gravity-injection flow rates, it was found that about 54 kg/s of RWST drain rate was required to maintain the core cooling. Those analysis results would provide useful information to operators coping with the event

Construction and test of the first Belle II SVD ladder implementing the origami chip-on-sensor design

International Nuclear Information System (INIS)

Irmler, C.; Bauer, A.; Bergauer, T.; Adamczyk, K.; Bacher, S.; Aihara, H.; Angelini, C.; Batignani, G.; Bettarini, S.; Bosi, F.; Aziz, T.; Babu, V.; Bahinipati, S.; Barberio, E.; Baroncelli, Ti.; Baroncelli, To.; Basith, A.K.; Behera, P.K.; Bhuyan, B.; Bilka, T.

2016-01-01

The Belle II Silicon Vertex Detector comprises four layers of double-sided silicon strip detectors (DSSDs), consisting of ladders with two to five sensors each. All sensors are individually read out by APV25 chips with the Origami chip-on-sensor concept for the central DSSDs of the ladders. The chips sit on flexible circuits that are glued on the top of the sensors. This concept allows a low material budget and an efficient cooling of the chips by a single pipe per ladder. We present the construction of the first SVD ladders and results from precision measurements and electrical tests

VLSI Design of SVM-Based Seizure Detection System With On-Chip Learning Capability.

Science.gov (United States)

Feng, Lichen; Li, Zunchao; Wang, Yuanfa

2018-02-01

Portable automatic seizure detection system is very convenient for epilepsy patients to carry. In order to make the system on-chip trainable with high efficiency and attain high detection accuracy, this paper presents a very large scale integration (VLSI) design based on the nonlinear support vector machine (SVM). The proposed design mainly consists of a feature extraction (FE) module and an SVM module. The FE module performs the three-level Daubechies discrete wavelet transform to fit the physiological bands of the electroencephalogram (EEG) signal and extracts the time-frequency domain features reflecting the nonstationary signal properties. The SVM module integrates the modified sequential minimal optimization algorithm with the table-driven-based Gaussian kernel to enable efficient on-chip learning. The presented design is verified on an Altera Cyclone II field-programmable gate array and tested using the two publicly available EEG datasets. Experiment results show that the designed VLSI system improves the detection accuracy and training efficiency.

Wake on LAN over Internet as web service system on chip

OpenAIRE

Maciá Pérez, Francisco; Gil Martínez-Abarca, Juan Antonio; Ramos Morillo, Héctor; Mora Gimeno, Francisco José; Marcos Jorquera, Diego; Gilart Iglesias, Virgilio

2009-01-01

In this paper we introduce a System on Chip (SoC) designed to run a particular Web Service (WS) in an Application-Specific Integrated Circuit (ASIC). The system has been designed devoid of processor and software and conceived as a hardware pattern for a trouble-free design of network services offered as WS in Service-Oriented Architecture (SOA). Therefore, the chip is not only able to act as SOAP Service Provider but, it is also capable of registering the service on its own in an external Bro...

Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

Science.gov (United States)

Bar-Cohen, Avram; Robinson, Franklin L.; Deisenroth, David C.

2018-01-01

Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

A proposed holistic approach to on-chip, off-chip, test, and package interconnections

Science.gov (United States)

Bartelink, Dirk J.

1998-11-01

The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must

Chip-to-Chip Half Duplex Spiking Data Communication over Power Supply Rails

Science.gov (United States)

Hashida, Takushi; Nagata, Makoto

Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at more than 100Mbps. A pair of transceivers consumes 1.35mA from 3.3V, at 130Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by 30dB, purifying power supply current for internal circuits. Bi-directional spiking communication was successfully examined in a 90-nm CMOS prototype setup of on-chip waveform capturing. A micro controller forwards clock pulses to and receives data streams from a comparator based waveform capturer formed on a different chip, through a single pair of power and ground traces. The bit error rate is small enough not to degrade waveform acquisition capability, maintaining the spurious free dynamic range of higher than 50dB.

Automated, Miniaturized and Integrated Quality Control-on-Chip (QC-on-a-Chip for Advanced Cell Therapy Applications

Directory of Open Access Journals (Sweden)

David eWartmann

2015-09-01

Full Text Available The combination of microfabrication-based technologies with cell biology has laid the foundation for the development of advanced in vitro diagnostic systems capable of evaluating cell cultures under defined, reproducible and standardizable measurement conditions. In the present review we describe recent lab-on-a-chip developments for cell analysis and how these methodologies could improve standard quality control in the field of manufacturing cell-based vaccines for clinical purposes. We highlight in particular the regulatory requirements for advanced cell therapy applications using as an example dendritic cell-based cancer vaccines to describe the tangible advantages of microfluidic devices that overcome most of the challenges associated with automation, miniaturization and integration of cell-based assays. As its main advantage lab-on-a-chip technology allows for precise regulation of culturing conditions, while simultaneously monitoring cell relevant parameters using embedded sensory systems. State-of-the-art lab-on-a-chip platforms for in vitro assessment of cell cultures and their potential future applications for cell therapies and cancer immunotherapy are discussed in the present review.

Thermal computations for electronics conductive, radiative, and convective air cooling

CERN Document Server

Ellison, Gordon

2010-01-01

IntroductionPrimary mechanisms of heat flowConductionApplication example: Silicon chip resistance calculationConvectionApplication example: Chassis panel cooled by natural convectionRadiationApplication example: Chassis panel cooled only by radiation 7Illustrative example: Simple thermal network model for a heat sinked power transistorIllustrative example: Thermal network circuit for a printed circuit boardCompact component modelsIllustrative example: Pressure and thermal circuits for a forced air cooled enclosureIllustrative example: A single chip package on a printed circuit board-the proble

A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

Energy Technology Data Exchange (ETDEWEB)

Irmler, C., E-mail: christian.irmler@oeaw.ac.at [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Higuchi, T. [University of Tokyo, Kavli Institute for Physics and Mathematics of the Universe, 5-1-5 Kashiwanoha, Kashiwa, Chiba 277-8583 (Japan); Ishikawa, A. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Joo, C. [Seoul National University, High Energy Physics Laboratory, 25-107 Shinlim-dong, Kwanak-gu, Seoul 151-742 (Korea, Republic of); Kah, D.H.; Kang, K.H. [Kyungpook National University, Department of Physics, 1370 Sankyuk Dong, Buk Gu, Daegu 702-701 (Korea, Republic of); Rao, K.K. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Kato, E. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Mohanty, G.B. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Negishi, K. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Onuki, Y.; Shimizu, N. [University of Tokyo, Department of Physics, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033 (Japan); Tsuboyama, T. [KEK, 1-1 Oho, Tsukuba, Ibaraki 305-0801 (Japan); Valentan, M. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria)

2013-12-21

B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO{sub 2} system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules.

A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

International Nuclear Information System (INIS)

Irmler, C.; Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I.; Higuchi, T.; Ishikawa, A.; Joo, C.; Kah, D.H.; Kang, K.H.; Rao, K.K.; Kato, E.; Mohanty, G.B.; Negishi, K.; Onuki, Y.; Shimizu, N.; Tsuboyama, T.; Valentan, M.

2013-01-01

B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO 2 system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules

Novel High Pressure Pump-on-a-Chip Technology, Phase II

Data.gov (United States)

National Aeronautics and Space Administration — HJ Science & Technology, Inc. proposes to develop a novel high pressure "pump-on-a-chip" (HPPOC) technology capable of generating high pressure and flow rate on...

Heat management in integrated circuits on-chip and system-level monitoring and cooling

CERN Document Server

Ogrenci-Memik, Seda

2016-01-01

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

Thermal-Aware Scheduling for Future Chip Multiprocessors

Directory of Open Access Journals (Sweden)

Pedro Trancoso

2007-04-01

Full Text Available The increased complexity and operating frequency in current single chip microprocessors is resulting in a decrease in the performance improvements. Consequently, major manufacturers offer chip multiprocessor (CMP architectures in order to keep up with the expected performance gains. This architecture is successfully being introduced in many markets including that of the embedded systems. Nevertheless, the integration of several cores onto the same chip may lead to increased heat dissipation and consequently additional costs for cooling, higher power consumption, decrease of the reliability, and thermal-induced performance loss, among others. In this paper, we analyze the evolution of the thermal issues for the future chip multiprocessor architectures and show that as the number of on-chip cores increases, the thermal-induced problems will worsen. In addition, we present several scenarios that result in excessive thermal stress to the CMP chip or significant performance loss. In order to minimize or even eliminate these problems, we propose thermal-aware scheduler (TAS algorithms. When assigning processes to cores, TAS takes their temperature and cooling ability into account in order to avoid thermal stress and at the same time improve the performance. Experimental results have shown that a TAS algorithm that considers also the temperatures of neighboring cores is able to significantly reduce the temperature-induced performance loss while at the same time, decrease the chip's temperature across many different operation and configuration scenarios.

Evaluation for In-Vessel Retention Capabilities with In-Vessel Injection and External Reactor Vessel Cooling

International Nuclear Information System (INIS)

Lee, Jeong Seong; Ryu, In Chul; Moon, Young Tae

2016-01-01

If the accident has not progressed to the point of substantial changes in the core geometry, establishing adequate cooling is as straightforward as re-establishing flow through the reactor core. However, if the accident has progressed to the point where the core geometry is substantially altered as a result of material melting and relocation, as was the case in the TMI-2 accident, the means of cooling the debris are not as straightforward. From this time on, the reactor core was either completely or nearly covered by water, with high pressure injection flow initiated shortly after three hours into the accident. However, the core debris was not coolable in this configuration and a substantial quantity of molten core material drained into the bypass region, with approximately twenty metric tons of molten debris draining into the reactor pressure vessel (RPV) lower head. Hence, the core configuration developed at approximately three hours into the accident was not coolable, even submerged in water. The purpose of this paper is to evaluate in-vessel retention capabilities with in-vessel injection (IVI) and external reactor vessel cooling (ERVC) available in a reactor application by using the integrated severe accident analysis code. The MAAP5 models were improved to facilitate evaluation of the in-vessel retention capability of APR1400. In-vessel retention capabilities have been analyzed for the APR1400 using the MAAP5.03 code. The results show that in-vessel retention is feasible when in-vessel injection is initiated within a relatively short time frame under the simulation condition used in the present study

Evaluation for In-Vessel Retention Capabilities with In-Vessel Injection and External Reactor Vessel Cooling

Energy Technology Data Exchange (ETDEWEB)

Lee, Jeong Seong; Ryu, In Chul; Moon, Young Tae [KEPCO Engineering and Construction Co. Ltd., Deajeon (Korea, Republic of)

2016-10-15

If the accident has not progressed to the point of substantial changes in the core geometry, establishing adequate cooling is as straightforward as re-establishing flow through the reactor core. However, if the accident has progressed to the point where the core geometry is substantially altered as a result of material melting and relocation, as was the case in the TMI-2 accident, the means of cooling the debris are not as straightforward. From this time on, the reactor core was either completely or nearly covered by water, with high pressure injection flow initiated shortly after three hours into the accident. However, the core debris was not coolable in this configuration and a substantial quantity of molten core material drained into the bypass region, with approximately twenty metric tons of molten debris draining into the reactor pressure vessel (RPV) lower head. Hence, the core configuration developed at approximately three hours into the accident was not coolable, even submerged in water. The purpose of this paper is to evaluate in-vessel retention capabilities with in-vessel injection (IVI) and external reactor vessel cooling (ERVC) available in a reactor application by using the integrated severe accident analysis code. The MAAP5 models were improved to facilitate evaluation of the in-vessel retention capability of APR1400. In-vessel retention capabilities have been analyzed for the APR1400 using the MAAP5.03 code. The results show that in-vessel retention is feasible when in-vessel injection is initiated within a relatively short time frame under the simulation condition used in the present study.

Debris filtering efficiency and its effect on long term cooling capability

International Nuclear Information System (INIS)

Jung, Min-Su; Kim, Kyu-Tae

2013-01-01

the containment sump into the reactor core on the long term cooling (LTC) capability after a loss of coolant accident (LOCA) was evaluated, which indicates that the debris-filter capability of the P-grid and G-grid designs may not have a detrimental effect on the LTC capability after a LOCA only if the sump mesh size is smaller than 2.54 mm in diameter

Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems.

Science.gov (United States)

Li, Lin; Yin, Heyu; Mason, Andrew J

2018-04-01

The integration of biosensors, microfluidics, and CMOS instrumentation provides a compact lab-on-CMOS microsystem well suited for high throughput measurement. This paper describes a new epoxy chip-in-carrier integration process and two planar metalization techniques for lab-on-CMOS that enable on-CMOS electrochemical measurement with multichannel microfluidics. Several design approaches with different fabrication steps and materials were experimentally analyzed to identify an ideal process that can achieve desired capability with high yield and low material and tool cost. On-chip electrochemical measurements of the integrated assembly were performed to verify the functionality of the chip-in-carrier packaging and its capability for microfluidic integration. The newly developed CMOS-compatible epoxy chip-in-carrier process paves the way for full implementation of many lab-on-CMOS applications with CMOS ICs as core electronic instruments.

Feasibility study on novel room air conditioner with natural cooling capability

International Nuclear Information System (INIS)

Han, Zongwei; Liu, Qiankun; Zhang, Yanqing; Zhang, Shuwei; Liu, Jiangzhen; Li, Weiliang

2016-01-01

Highlights: • A novel heat pipe combined evaporative cooling room air conditioner is constructed. • The mathematical model of the air conditioner is established. • The reliability of the model is verified by experiments. • The performance of the novel and conventional air conditioner is compared. • The applicability of the novel air conditioner in different areas is investigated. - Abstract: In order to improve the energy efficiency of room air conditioners, this paper proposed a new air conditioner that combined evaporative cooling technology, separate type heat pipe technology, and vapour compression refrigeration technology (called “combined air conditioner”). The mathematical model of the air conditioner was established and its reliability was verified by experiments. Based on the model, the simulation of the operating performance of the combined air conditioner and a conventional air conditioner was studied in typical climate regions during the cooling period, with the following results: In cold and dry areas like Shenyang, compared with the conventional air conditioner, the average cooling coefficient of performance (COP) of the combined air conditioner was increased by 27.40%. As the climate gradually became warmer and humidity gradually increased, the running time of the heat pipe cooling mode was gradually reduced, and then the energy-saving effect of the combined air conditioner became worse. For example, in the hot and humid Guangzhou, the energy saving rate was only 11.81%. Therefore, it was found that the combined air conditioner had good energy-saving potential in cold and dry areas.

Energy efficient hotspot-targeted embedded liquid cooling of electronics

International Nuclear Information System (INIS)

Sharma, Chander Shekhar; Tiwari, Manish K.; Zimmermann, Severin; Brunschwiler, Thomas; Schlottig, Gerd; Michel, Bruno; Poulikakos, Dimos

2015-01-01

Highlights: • We present a novel concept for hotspot-targeted, energy efficient ELC for electronic chips. • Microchannel throttling zones distribute flow optimally without any external control. • Design is optimized for highly non-uniform multicore chip heat flux maps. • Optimized design minimizes chip temperature non-uniformity. • This is achieved with pumping power consumption less than 1% of total chip power. - Abstract: Large data centers today already account for nearly 1.31% of total electricity consumption with cooling responsible for roughly 33% of that energy consumption. This energy intensive cooling problem is exacerbated by the presence of hotspots in multicore microprocessors due to excess coolant flow requirement for thermal management. Here we present a novel liquid-cooling concept, for targeted, energy efficient cooling of hotspots through passively optimized microchannel structures etched into the backside of a chip (embedded liquid cooling or ELC architecture). We adopt an experimentally validated and computationally efficient modeling approach to predict the performance of our hotspot-targeted ELC design. The design is optimized for exemplar non-uniform chip power maps using Response Surface Methodology (RSM). For industrially acceptable limits of approximately 0.4 bar (40 kPa) on pressure drop and one percent of total chip power on pumping power, the optimized designs are computationally evaluated against a base, standard ELC design with uniform channel widths and uniform flow distribution. For an average steady-state heat flux of 150 W/cm 2 in core areas (hotspots) and 20 W/cm 2 over remaining chip area (background), the optimized design reduces the maximum chip temperature non-uniformity by 61% to 3.7 °C. For a higher average, steady-state hotspot heat flux of 300 W/cm 2 , the maximum temperature non-uniformity is reduced by 54% to 8.7 °C. It is shown that the base design requires a prohibitively high level of pumping power (about

Development of High Performance Cooling Modules in Notebook PC's

Science.gov (United States)

Tanahashi, Kosei

The CPU power consumption in Notebook PCs is increasing every year. Video chips and HDDs are also continually using larger power for higher performance. In addition, since miniaturization is desired, the mounting of components is becoming more and more dense. Accordingly, the cooling mechanisms are increasingly important. The cooling modules have to dissipate larger amounts of heat in the same environmental conditions. Therefore, high capacity cooling capabilities is needed, while low costs and high reliability must be retained. Available cooling methods include air or water cooling systems and the heat conduction method. The air cooling system is to transmit heat by a cooling fan often using a heat pipe. The water cooling one employs the water to carry heat to the back of the display, which offers a comparatively large cooling area. The heat conduction method is to transfer the heat by thermal conduction to the case. This article describes the development of new and comparatively efficient cooling devices offering low cost and high reliability for air cooling system. As one of the development techniques, the heat resistance and performance are measured for various parts and layouts. Each cooling system is evaluated in the same measurement environment. With regards to the fans, an optimal shape of the fan blades to maximize air flow is found by using CFD simulation, and prototypes were built and tested.

A very cool cooling system

CERN Multimedia

Antonella Del Rosso

2015-01-01

The NA62 Gigatracker is a jewel of technology: its sensor, which delivers the time of the crossing particles with a precision of less than 200 picoseconds (better than similar LHC detectors), has a cooling system that might become the precursor to a completely new detector technique.   The 115 metre long vacuum tank of the NA62 experiment. The NA62 Gigatracker (GTK) is composed of a set of three innovative silicon pixel detectors, whose job is to measure the arrival time and the position of the incoming beam particles. Installed in the heart of the NA62 detector, the silicon sensors are cooled down (to about -20 degrees Celsius) by a microfluidic silicon device. “The cooling system is needed to remove the heat produced by the readout chips the silicon sensor is bonded to,” explains Alessandro Mapelli, microsystems engineer working in the Physics department. “For the NA62 Gigatracker we have designed a cooling plate on top of which both the silicon sensor and the...

Spray cooling heat transfer: Technology overview and assessment of future challenges for micro-gravity application

International Nuclear Information System (INIS)

Silk, Eric A.; Golliher, Eric L.; Paneer Selvam, R.

2008-01-01

Advanced on-board flight systems for future NASA space exploration programs consist of components such as laser-diode arrays (LDA's) and multi-chip modules (MCM's). Thermal management of these systems require high heat flux cooling capability (≥100 W/cm 2 ), tight temperature control (approx. ±2 deg. C), reliable start-up (on demand) and long term stability. Traditional multiphase thermal control technologies for space flight (e.g., loop heat pipes, capillary pumped loops, etc.) satisfy the temperature control, start-up and stability requirements, but their heat flux removal capabilities are limited. Spray cooling can provide high heat fluxes in excess of 100 W/cm 2 using fluorinerts and over 1000 W/cm 2 with water while allowing tight temperature control at low coolant fluid flow rates. Spray cooling has been flight proven in an open loop configuration through the Space shuttle's flash evaporator system (FES). However, several closed system issues require investigation to further advance the technology to a technology readiness level (TRL) appropriate for closed system space flight application. This paper provides a discussion of the current status of spray cooling technology as well as NASA's goals, current direction, and challenges associated with the implementation and practice of this technology in the micro-gravity environment

Feasibility study of self sustaining capability on water cooled thorium reactors for different power reactors

International Nuclear Information System (INIS)

Permana, S.; Takaki, N.; Sekimoto, H.

2007-01-01

Thorium fuel cycle can maintain the sustainable system of the reactor for self sustaining system for future sustainable development in the world. Some characteristics of thorium cycle show some advantages in relation to higher breeding capability, higher performance of burn-up and more proliferation resistant. Several investigations was performed to improve the breeding capability which is essential for maintaining the fissile sustainability during reactor operation in thermal reactor such as Shippingport reactor and molten salt breeder reactor (MSBR) project. The preliminary study of breeding capability on water cooled thorium reactor has been investigated for various power output. The iterative calculation system is employed by coupling the equilibrium fuel cycle burn-up calculation and cell calculation of PIJ module of SRAC2000. In this calculation, 1238 fission products and 129 heavy nuclides are employed. In the cell calculation, 26 heavy metals and 66 fission products and 1 pseudo FP are employed. The employed nuclear data library was JENDL 3.2. The reactor is fueled by 2 33U-Th Oxide and it has used the light water coolant as moderator. Some characteristics such as conversion ratio and void reactivity coefficient performances are evaluated for the systems. The moderator to fuel ratio (MFR) values and average burnups are studied for survey parameter. The parametric survey for different power outputs are employed from 10 MWt to 3000 MWt for evaluating the some characteristics of core size and leakage effects to the spectra profile, required enrichment, breeding capability, fissile inventory condition, and void reactivity coefficient. Different power outputs are employed in order to evaluate its effect to the required enrichment for criticality, breeding capability, void reactivity and fissile inventory accumulation. The obtained value of the conversion ratios is evaluated by using the equilibrium atom composition. The conversion ratio is employed based on the

Validation of Heat Transfer and Film Cooling Capabilities of the 3-D RANS Code TURBO

Science.gov (United States)

Shyam, Vikram; Ameri, Ali; Chen, Jen-Ping

2010-01-01

The capabilities of the 3-D unsteady RANS code TURBO have been extended to include heat transfer and film cooling applications. The results of simulations performed with the modified code are compared to experiment and to theory, where applicable. Wilcox s k-turbulence model has been implemented to close the RANS equations. Two simulations are conducted: (1) flow over a flat plate and (2) flow over an adiabatic flat plate cooled by one hole inclined at 35 to the free stream. For (1) agreement with theory is found to be excellent for heat transfer, represented by local Nusselt number, and quite good for momentum, as represented by the local skin friction coefficient. This report compares the local skin friction coefficients and Nusselt numbers on a flat plate obtained using Wilcox's k-model with the theory of Blasius. The study looks at laminar and turbulent flows over an adiabatic flat plate and over an isothermal flat plate for two different wall temperatures. It is shown that TURBO is able to accurately predict heat transfer on a flat plate. For (2) TURBO shows good qualitative agreement with film cooling experiments performed on a flat plate with one cooling hole. Quantitatively, film effectiveness is under predicted downstream of the hole.

Portable low-power thermal cycler with dual thin-film Pt heaters for a polymeric PCR chip.

Science.gov (United States)

Jeong, Sangdo; Lim, Juhun; Kim, Mi-Young; Yeom, JiHye; Cho, Hyunmin; Lee, Hyunjung; Shin, Yong-Beom; Lee, Jong-Hyun

2018-01-29

Polymerase chain reaction (PCR) has been widely used for major definite diagnostic tool, but very limited its place used only indoor such as hospital or diagnosis lab. For the rapid on-site detection of pathogen in an outdoor environment, a low-power cordless polymerase chain reaction (PCR) thermal cycler is crucial module. At this point of view, we proposed a low-power PCR thermal cycler that could be operated in an outdoor anywhere. The disposable PCR chip was made of a polymeric (PI/PET) film to reduce the thermal mass. A dual arrangement of the Pt heaters, which were positioned on the top and bottom of the PCR chip, improved the temperature uniformity. The temperature sensor, which was made of the same material as the heater, utilized the temperature dependence of the Pt resistor to ensure simple fabrication of the temperature sensor. Cooling the PCR chip using dual blower fans enabled thermal cycling to operate with a lower power than that of a Peltier element with a high power consumption. The PCR components were electrically connected to a control module that could be operated with a Li-ion battery (12 V), and the PCR conditions (temperature, time, cycle, etc.) were inputted on a touch screen. For 30 PCR cycles, the accumulated power consumption of heating and cooling was 7.3 Wh, which is easily available from a compact battery. Escherichia coli genomic DNA (510 bp) was amplified using the proposed PCR thermal cycler and the disposable PCR chip. A similar DNA amplification capability was confirmed using the proposed portable and low-power thermal cycler compared with a conventional thermal cycler.

Error correcting code with chip kill capability and power saving enhancement

Energy Technology Data Exchange (ETDEWEB)

Gara, Alan G [Mount Kisco, NY; Chen, Dong [Croton On Husdon, NY; Coteus, Paul W [Yorktown Heights, NY; Flynn, William T [Rochester, MN; Marcella, James A [Rochester, MN; Takken, Todd [Brewster, NY; Trager, Barry M [Yorktown Heights, NY; Winograd, Shmuel [Scarsdale, NY

2011-08-30

A method and system are disclosed for detecting memory chip failure in a computer memory system. The method comprises the steps of accessing user data from a set of user data chips, and testing the user data for errors using data from a set of system data chips. This testing is done by generating a sequence of check symbols from the user data, grouping the user data into a sequence of data symbols, and computing a specified sequence of syndromes. If all the syndromes are zero, the user data has no errors. If one of the syndromes is non-zero, then a set of discriminator expressions are computed, and used to determine whether a single or double symbol error has occurred. In the preferred embodiment, less than two full system data chips are used for testing and correcting the user data.

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

Directory of Open Access Journals (Sweden)

Amlan Ganguly

2018-02-01

Full Text Available With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

Ion Chromatography-on-a-chip for Water Quality Analysis

Science.gov (United States)

Kidd, R. D.; Noell, A.; Kazarians, G.; Aubrey, A. D.; Scianmarello, N.; Tai, Y.-C.

2015-01-01

We report progress towards developing a Micro-Electro-Mechanical Systems (MEMS)- based ion chromatograph (IC) for crewed spacecraft water analysis. This IC-chip is an offshoot of a NASA-funded effort to produce a high performance liquid chromatograph (HPLC)-chip. This HPLC-chip system would require a desalting (i.e. ion chromatography) step. The complete HPLC instrument consists of the Jet Propulsion Labortory's (JPL's) quadrupole ion trap mass spectrometer integrated with a state-of-the-art MEMS liquid chromatograph (LC) system developed by the California Institute of Technology's (Caltech's) Micromachining Laboratory. The IC version of the chip consist of an electrolysis-based injector, a separation column, two electrolysis pumps for gradient generation, mixer, and a built-in conductivity detector. The HPLC version of the chip also includes a nanospray tip. The low instrument mass, coupled with its high analytical capabilities, makes the LC chip ideally suitable for wide range of applications such as trace contaminant, inorganic analytical science and, when coupled to a mass spectrometer, a macromolecular detection system for either crewed space exploration vehicles or robotic planetary missions.

Flip chip assembly of thinned chips for hybrid pixel detector applications

International Nuclear Information System (INIS)

Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F

2014-01-01

There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

Electrode Cooling Effect on Out-Of-Phase Electrothermal Streaming in Rotating Electric Fields

Directory of Open Access Journals (Sweden)

Weiyu Liu

2017-11-01

Full Text Available In this work, we focus on investigating electrothermal flow in rotating electric fields (ROT-ETF, with primary attention paid to the horizontal traveling-wave electrothermal (TWET vortex induced at the center of the electric field. The frequency-dependent flow profiles in the microdevice are analyzed using different heat transfer models. Accordingly, we address in particular the importance of electrode cooling in ROT-ETF as metal electrodes of high thermal conductivity, while substrate material of low heat dissipation capability is employed to develop such microfluidic chips. Under this circumstance, cooling of electrode array due to external natural convection on millimeter-scale electrode pads for external wire connection occurs and makes the internal temperature maxima shift from the electrode plane to a bit of distance right above the cross-shaped interelectrode gaps, giving rise to reversal of flow rotation from a typical repulsion-type to attraction-type induction vortex, which is in good accordance with our experimental observations of co-field TWET streaming at frequencies in the order of reciprocal charge relaxation time of the bulk fluid. These results point out a way to make a correct interpretation of out-of-phase electrothermal streaming behavior, which holds great potential for handing high-conductivity analytes in modern microfluidic systems.

Development of an Integrated Cooling System Controller for Hybrid Electric Vehicles

Directory of Open Access Journals (Sweden)

Chong Wang

2017-01-01

Full Text Available A hybrid electrical bus employs both a turbo diesel engine and an electric motor to drive the vehicle in different speed-torque scenarios. The cooling system for such a vehicle is particularly power costing because it needs to dissipate heat from not only the engine, but also the intercooler and the motor. An electronic control unit (ECU has been designed with a single chip computer, temperature sensors, DC motor drive circuit, and optimized control algorithm to manage the speeds of several fans for efficient cooling using a nonlinear fan speed adjustment strategy. Experiments suggested that the continuous operating performance of the ECU is robust and capable of saving 15% of the total electricity comparing with ordinary fan speed control method.

Thin film metal sensors in fusion bonded glass chips for high-pressure microfluidics

International Nuclear Information System (INIS)

Andersson, Martin; Ek, Johan; Hedman, Ludvig; Johansson, Fredrik; Sehlstedt, Viktor; Stocklassa, Jesper; Snögren, Pär; Pettersson, Victor; Larsson, Jonas; Vizuete, Olivier; Hjort, Klas; Klintberg, Lena

2017-01-01

High-pressure microfluidics offers fast analyses of thermodynamic parameters for compressed process solvents. However, microfluidic platforms handling highly compressible supercritical CO 2 are difficult to control, and on-chip sensing would offer added control of the devices. Therefore, there is a need to integrate sensors into highly pressure tolerant glass chips. In this paper, thin film Pt sensors were embedded in shallow etched trenches in a glass wafer that was bonded with another glass wafer having microfluidic channels. The devices having sensors integrated into the flow channels sustained pressures up to 220 bar, typical for the operation of supercritical CO 2 . No leakage from the devices could be found. Integrated temperature sensors were capable of measuring local decompression cooling effects and integrated calorimetric sensors measured flow velocities over the range 0.5–13.8 mm s −1 . By this, a better control of high-pressure microfluidic platforms has been achieved. (paper)

Design and Verification of Digital Architecture of 65K Pixel Readout Chip for High-Energy Physics

CERN Document Server

Poikela, Tuomas; Paakkulainen, J

2010-01-01

The feasibility to design and implement a front-end ASIC for the upgrade of the VELO detector of LHCb experiment at CERN using IBM’s 130nm standard CMOS process and a standard cell library is studied in this thesis. The proposed architecture is a design to cope with high data rates and continuous data taking. The architecture is designed to operate without any external trigger to record every hit signal the ASIC receives from a sensor chip, and then to transmit the information to the next level of electronics, for example to FPGAs. This thesis focuses on design, implementation and functional verification of the digital electronics of the active pixel area. The area requirements are dictated by the geometry of pixels (55$mu$m x 55$mu$m), power requirements (20W/module) by restricted cooling capabilities of the module consisting of 10 chips and output bandwidth requirements by data rate (< 10 Gbit/s) produced by a particle flux passing through the chip. The design work was carried out using transaction...

Wax-bonding 3D microfluidic chips

KAUST Repository

Gong, Xiuqing; Yi, Xin; Xiao, Kang; Li, Shunbo; Kodzius, Rimantas; Qin, Jianhua; Wen, Weijia

2013-01-01

We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

Wax-bonding 3D microfluidic chips

KAUST Repository

Gong, Xiuqing

2013-10-10

We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

Multi-color fluorescent DNA analysis in an integrated optofluidic lab-on-a-chip

OpenAIRE

Dongre, C.; van Weerd, J.; van Weeghel, R.; Martinez-Vazquez, R.; Osellame, R.; Cerullo, G.; Besselink, G.A.J.; van den Vlekkert, H.H.; Hoekstra, Hugo; Pollnau, Markus

2010-01-01

Sorting and sizing of DNA molecules within the human genome project has enabled the genetic mapping of various illnesses. By employing tiny lab-on-a-chip devices for such DNA analysis, integrated DNA sequencing and genetic diagnostics have become feasible. However, such diagnostic chips typically lack integrated sensing capability. We address this issue by combining microfluidic capillary electrophoresis with laser-induced fluorescence detection resulting in optofluidic integration towards an...

Laser micromachining of biofactory-on-a-chip devices

Science.gov (United States)

Burt, Julian P.; Goater, Andrew D.; Hayden, Christopher J.; Tame, John A.

2002-06-01

Excimer laser micromachining provides a flexible means for the manufacture and rapid prototyping of miniaturized systems such as Biofactory-on-a-Chip devices. Biofactories are miniaturized diagnostic devices capable of characterizing, manipulating, separating and sorting suspension of particles such as biological cells. Such systems operate by exploiting the electrical properties of microparticles and controlling particle movement in AC non- uniform stationary and moving electric fields. Applications of Biofactory devices are diverse and include, among others, the healthcare, pharmaceutical, chemical processing, environmental monitoring and food diagnostic markets. To achieve such characterization and separation, Biofactory devices employ laboratory-on-a-chip type components such as complex multilayer microelectrode arrays, microfluidic channels, manifold systems and on-chip detection systems. Here we discuss the manufacturing requirements of Biofactory devices and describe the use of different excimer laser micromachined methods both in stand-alone processes and also in conjunction with conventional fabrication processes such as photolithography and thermal molding. Particular attention is given to the production of large area multilayer microelectrode arrays and the manufacture of complex cross-section microfluidic channel systems for use in simple distribution and device interfacing.

Numerical Simulation on Natural Convection Cooling of a FM Target

Energy Technology Data Exchange (ETDEWEB)

Park, Jong Pil; Park, Su Ki [KAERI, Daejeon (Korea, Republic of)

2016-05-15

The irradiated FM(Fission-Molly) target is unloaded from the irradiation hole during normal operation, and then cooled down in the reactor pool for a certain period of time. Therefore, it is necessary to identify the minimum decay time needed to cool down FM target sufficiently by natural convection. In the present work, numerical simulations are performed to predict cooling capability of a FM target cooled by natural convection using commercial computational fluid dynamics (CFD) code, CFX. The present study is carried out using CFD code to investigate cooling capability of a FM target cooled by natural convection. The steady state simulation as well as transient simulation is performed in the present work. Based on the transient simulation (T1), the minimum decay time that the maximum fuel temperature does not reach the design limit temperature (TONB-3 .deg. C) is around 15.60 seconds.

On-Chip Sensing of Thermoelectric Thin Film’s Merit

OpenAIRE

Xiao, Zhigang; Zhu, Xiaoshan

2015-01-01

Thermoelectric thin films have been widely explored for thermal-to-electrical energy conversion or solid-state cooling, because they can remove heat from integrated circuit (IC) chips or micro-electromechanical systems (MEMS) devices without involving any moving mechanical parts. In this paper, we report using silicon diode-based temperature sensors and specific thermoelectric devices to characterize the merit of thermoelectric thin films. The silicon diode temperature sensors and thermoelect...

Influence of the ambient temperature on the cooling efficiency of the high performance cooling device with thermosiphon effect

Science.gov (United States)

Nemec, Patrik; Malcho, Milan

2018-06-01

This work deal with experimental measurement and calculation cooling efficiency of the cooling device working with a heat pipe technology. The referred device in the article is cooling device capable transfer high heat fluxes from electric elements to the surrounding. The work contain description, working principle and construction of cooling device. The main factor affected the dissipation of high heat flux from electronic elements through the cooling device to the surrounding is condenser construction, its capacity and option of heat removal. Experimental part describe the measuring method cooling efficiency of the cooling device depending on ambient temperature in range -20 to 40°C and at heat load of electronic components 750 W. Measured results are compared with results calculation based on physical phenomena of boiling, condensation and natural convection heat transfer.

On-chip digital power supply control for system-on-chip applications

NARCIS (Netherlands)

Meijer, M.; Pineda de Gyvez, J.; Otten, R.H.J.M.

2005-01-01

The authors presented an on-chip, fully-digital, power-supply control system. The scheme consists of two independent control loops that regulate power supply variations due to semiconductor process spread, temperature, and chip's workload. Smart power-switches working as linear voltage regulators

Analysis on small long life reactor using thorium fuel for water cooled and metal cooled reactor types

International Nuclear Information System (INIS)

Permana, Sidik

2009-01-01

Long-life reactor operation can be adopted for some special purposes which have been proposed by IAEA as the small and medium reactor (SMR) program. Thermal reactor and fast reactor types can be used for SMR and in addition to that program the utilization of thorium fuel as one of the candidate as a 'partner' fuel with uranium fuel which can be considered for optimizing the nuclear fuel utilization as well as recycling spent fuel. Fissile U-233 as the main fissile material for thorium fuel shows higher eta-value for wider energy range compared with other fissile materials of U-235 and Pu-239. However, it less than Pu-239 for fast energy region, but it still shows high eta-value. This eta-value gives the reactor has higher capability for obtaining breeding condition or high conversion capability. In the present study, the comparative analysis on small long life reactor fueled by thorium for different reactor types (water cooled and metal cooled reactor types). Light water and heavy water have been used as representative of water-cooled reactor types, and for liquid metal-cooled reactor types, sodium-cooled and lead-bismuth-cooled have been adopted. Core blanket arrangement as general design configuration, has been adopted which consist of inner blanket region fueled by thorium oxide, and two core regions (inner and out regions) fueled by fissile U-233 and thorium oxide with different percentages of fissile content. SRAC-CITATION and JENDL-33 have been used as core optimization analysis and nuclear data library for this analysis. Reactor operation time can reaches more than 10 years operation without refueling and shuffling for different reactor types and several power outputs. As can be expected, liquid metal cooled reactor types can be used more effective for obtaining long life reactor with higher burnup, higher power density, higher breeding capability and lower excess reactivity compared with water-cooled reactors. Water cooled obtains long life core operation

Photonic network-on-chip design

CERN Document Server

Bergman, Keren; Biberman, Aleksandr; Chan, Johnnie; Hendry, Gilbert

2013-01-01

This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing photonic network-on-chip architectures for future many-core high performance chip multiprocessors. The discussion is built from the bottom up: starting with the design and implementation of key photonic devices and building blocks, reviewing networking and network-on-chip theory and existing research, and finishing with describing various architectures, their characteristics, and the impact they will have on a computing system. After acquainting

On-chip electrochromic micro display for a disposable bio-sensor chip

Science.gov (United States)

Zhu, Yanjun; Tsukamoto, Takashiro; Tanaka, Shuji

2017-12-01

This paper reports an on-chip electrochromic micro display made of polyaniline (PANi) which can be easily made on a CMOS chip. Micro-patterned PANi thin films were selectively deposited on pre-patterned microelectrodes by using electrodeposition. The optimum conditions for deposition and electrochromism were investigated. An 8-pixel on-chip micro display was made on a Si chip. The color of each PANi film could be independently but simultaneously controlled, which means any 1-byte digital data could be displayed on the display. The PANi display had a response time as fast as about 100 ms, which means the transfer data rate was as fast as 80 bits per second.

A full on-chip CMOS low-dropout voltage regulator with VCCS compensation

International Nuclear Information System (INIS)

Gao Leisheng; Zhou Yumei; Wu Bin; Jiang Jianhua

2010-01-01

A full on-chip CMOS low-dropout (LDO) voltage regulator with high PSR is presented. Instead of relying on the zero generated by the load capacitor and its equivalent series resistance, the proposed LDO generates a zero by voltage-controlled current sources for stability. The compensating capacitor for the proposed scheme is only 0.18 pF, which is much smaller than the capacitor of the conventional compensation scheme. The full on-chip LDO was fabricated in commercial 0.35 μm CMOS technology. The active chip area of the LDO (including the bandgap voltage reference) is 400 x 270 μm 2 . Experimental results show that the PSR of the LDO is -58.7 dB at a frequency of 10 Hz and -20 dB at a frequency of 1 MHz. The proposed LDO is capable of sourcing an output current up to 50 mA. (semiconductor integrated circuits)

Combination of Ultrasonic Vibration and Cryogenic Cooling for Cutting Performance Improvement of Inconel 718 Turning

Science.gov (United States)

Lin, S. Y.; Chung, C. T.; Cheng, Y. Y.

2011-01-01

The main objective of this study is to develop a thermo-elastic-plastic coupling model, based on a combination skill of ultrasonically assisted cutting and cryogenic cooling, under large deformation for Inconel 718 alloy machining process. The improvement extent on cutting performance and tool life promotion may be examined from this investigation. The critical value of the strain energy density of the workpiece will be utilized as the chip separation and the discontinuous chip segmentation criteria. The forced convection cooling and a hydrodynamic lubrication model will be considered and formulated in the model. Finite element method will be applied to create a complete numerical solution for this ultrasonic vibration cutting model. During the analysis, the cutting tool is incrementally advanced forward with superimposed ultrasonic vibration in a back and forth step-by-step manner, from an incipient stage of tool-workpiece engagement to a steady state of chip formation, a whole simulation of orthogonal cutting process under plane strain deformation is thus undertaken. High shear strength induces a fluctuation phenomenon of shear angle, high shear strain rate, variation of chip types and chip morphology, tool-chip contact length variation, the temperature distributions within the workpiece, chip and tool, periodic fluctuation in cutting forces can be determined from the developed model. A complete comparison of machining characteristics between some different combinations of ultrasonically assisted cutting and cryogenic cooling with conventional cutting operation can be acquired. Finally, the high-speed turning experiment for Inconel 718 alloy will be taken in the laboratory to validate the accuracy of the model, and the progressive flank wear, crater wear, notching and chipping of the tool edge can also be measured in the experiments.

A VLSI System-on-Chip for Particle Detectors

CERN Document Server

AUTHOR|(CDS)2078019

In this thesis I present a System-on-Chip (SoC) I designed to oer a self- contained, compact data acquisition platform for micromegas detector mon- itoring. I carried on my work within the RD-51 collab oration of CERN. With a companion ADC, my architecture is capable to acquire the signal from a detector electro de, pro cess the data and p erform monitoring tests. The SoC is built around on a custom 8-bit micropro cessor with internal mem- ory resources and emb eds the p eripherals to b e interf...

A scalable single-chip multi-processor architecture with on-chip RTOS kernel

NARCIS (Netherlands)

Theelen, B.D.; Verschueren, A.C.; Reyes Suarez, V.V.; Stevens, M.P.J.; Nunez, A.

2003-01-01

Now that system-on-chip technology is emerging, single-chip multi-processors are becoming feasible. A key problem of designing such systems is the complexity of their on-chip interconnects and memory architecture. It is furthermore unclear at what level software should be integrated. An example of a

Direct cooled power electronics substrate

Science.gov (United States)

Wiles, Randy H [Powell, TN; Wereszczak, Andrew A [Oak Ridge, TN; Ayers, Curtis W [Kingston, TN; Lowe, Kirk T [Knoxville, TN

2010-09-14

The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Experimental evaluation of cooling efficiency of the high performance cooling device

Science.gov (United States)

Nemec, Patrik; Malcho, Milan

2016-06-01

This work deal with experimental evaluation of cooling efficiency of cooling device capable transfer high heat fluxes from electric elements to the surrounding. The work contain description of cooling device, working principle of cooling device, construction of cooling device. Experimental part describe the measuring method of device cooling efficiency evaluation. The work results are presented in graphic visualization of temperature dependence of the contact area surface between cooling device evaporator and electronic components on the loaded heat of electronic components in range from 250 to 740 W and temperature dependence of the loop thermosiphon condenser surface on the loaded heat of electronic components in range from 250 to 740 W.

Experimental evaluation of cooling efficiency of the high performance cooling device

Energy Technology Data Exchange (ETDEWEB)

Nemec, Patrik, E-mail: patrik.nemec@fstroj.uniza.sk; Malcho, Milan, E-mail: milan.malcho@fstroj.uniza.sk [University of Žilina, Faculty of Mechanical Engineering, Department of Power Engineering, Univerzitna 1, 010 26 Žilina (Slovakia)

2016-06-30

This work deal with experimental evaluation of cooling efficiency of cooling device capable transfer high heat fluxes from electric elements to the surrounding. The work contain description of cooling device, working principle of cooling device, construction of cooling device. Experimental part describe the measuring method of device cooling efficiency evaluation. The work results are presented in graphic visualization of temperature dependence of the contact area surface between cooling device evaporator and electronic components on the loaded heat of electronic components in range from 250 to 740 W and temperature dependence of the loop thermosiphon condenser surface on the loaded heat of electronic components in range from 250 to 740 W.

On-chip concentration of bacteria using a 3D dielectrophoretic chip and subsequent laser-based DNA extraction in the same chip

International Nuclear Information System (INIS)

Cho, Yoon-Kyoung; Kim, Tae-hyeong; Lee, Jeong-Gun

2010-01-01

We report the on-chip concentration of bacteria using a dielectrophoretic (DEP) chip with 3D electrodes and subsequent laser-based DNA extraction in the same chip. The DEP chip has a set of interdigitated Au post electrodes with 50 µm height to generate a network of non-uniform electric fields for the efficient trapping by DEP. The metal post array was fabricated by photolithography and subsequent Ni and Au electroplating. Three model bacteria samples (Escherichia coli, Staphylococcus epidermidis, Streptococcus mutans) were tested and over 80-fold concentrations were achieved within 2 min. Subsequently, on-chip DNA extraction from the concentrated bacteria in the 3D DEP chip was performed by laser irradiation using the laser-irradiated magnetic bead system (LIMBS) in the same chip. The extracted DNA was analyzed with silicon chip-based real-time polymerase chain reaction (PCR). The total process of on-chip bacteria concentration and the subsequent DNA extraction can be completed within 10 min including the manual operation time.

Experimental investigations on cryogenic cooling by liquid nitrogen in the end milling of hardened steel

Science.gov (United States)

Ravi, S.; Pradeep Kumar, M.

2011-09-01

Milling of hardened steel generates excessive heat during the chip formation process, which increases the temperature of cutting tool and accelerates tool wear. Application of conventional cutting fluid in milling process may not effectively control the heat generation also it has inherent health and environmental problems. To minimize health hazard and environmental problems caused by using conventional cutting fluid, a cryogenic cooling set up is developed to cool tool-chip interface using liquid nitrogen (LN 2). This paper presents results on the effect of LN 2 as a coolant on machinability of hardened AISI H13 tool steel for varying cutting speed in the range of 75-125 m/min during end milling with PVD TiAlN coated carbide inserts at a constant feed rate. The results show that machining with LN 2 lowers cutting temperature, tool flank wear, surface roughness and cutting forces as compared with dry and wet machining. With LN 2 cooling, it has been found that the cutting temperature was reduced by 57-60% and 37-42%; the tool flank wear was reduced by 29-34% and 10-12%; the surface roughness was decreased by 33-40% and 25-29% compared to dry and wet machining. The cutting forces also decreased moderately compared to dry and wet machining. This can be attributed to the fact that LN 2 machining provides better cooling and lubrication through substantial reduction in the cutting zone temperature.

Lab-on a-Chip

Science.gov (United States)

1999-01-01

Labs on chips are manufactured in many shapes and sizes and can be used for numerous applications, from medical tests to water quality monitoring to detecting the signatures of life on other planets. The eight holes on this chip are actually ports that can be filled with fluids or chemicals. Tiny valves control the chemical processes by mixing fluids that move in the tiny channels that look like lines, connecting the ports. Scientists at NASA's Marshall Space Flight Center (MSFC) in Huntsville, Alabama designed this chip to grow biological crystals on the International Space Station (ISS). Through this research, they discovered that this technology is ideally suited for solving the challenges of the Vision for Space Exploration. For example, thousands of chips the size of dimes could be loaded on a Martian rover looking for biosignatures of past or present life. Other types of chips could be placed in handheld devices used to monitor microbes in water or to quickly conduct medical tests on astronauts. The portable, handheld Lab-on-a Chip Application Development Portable Test System (LOCAD-PTS) made its debut flight aboard Discovery during the STS-116 mission launched December 9, 2006. The system allowed crew members to monitor their environment for problematic contaminants such as yeast, mold, and even E.coli, and salmonella. Once LOCAD-PTS reached the ISS, the Marshall team continued to manage the experiment, monitoring the study from a console in the Payload Operations Center at MSFC. The results of these studies will help NASA researchers refine the technology for future Moon and Mars missions. (NASA/MSFC/D.Stoffer)

A full on-chip CMOS low-dropout voltage regulator with VCCS compensation

Energy Technology Data Exchange (ETDEWEB)

Gao Leisheng; Zhou Yumei; Wu Bin; Jiang Jianhua, E-mail: gaoleisheng@ime.ac.c [Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029 (China)

2010-08-15

A full on-chip CMOS low-dropout (LDO) voltage regulator with high PSR is presented. Instead of relying on the zero generated by the load capacitor and its equivalent series resistance, the proposed LDO generates a zero by voltage-controlled current sources for stability. The compensating capacitor for the proposed scheme is only 0.18 pF, which is much smaller than the capacitor of the conventional compensation scheme. The full on-chip LDO was fabricated in commercial 0.35 {mu}m CMOS technology. The active chip area of the LDO (including the bandgap voltage reference) is 400 x 270 {mu}m{sup 2}. Experimental results show that the PSR of the LDO is -58.7 dB at a frequency of 10 Hz and -20 dB at a frequency of 1 MHz. The proposed LDO is capable of sourcing an output current up to 50 mA. (semiconductor integrated circuits)

X-CHIP: an integrated platform for high-throughput protein crystallization and on-the-chip X-ray diffraction data collection

International Nuclear Information System (INIS)

Kisselman, Gera; Qiu, Wei; Romanov, Vladimir; Thompson, Christine M.; Lam, Robert; Battaile, Kevin P.; Pai, Emil F.; Chirgadze, Nickolay Y.

2011-01-01

The X-CHIP (X-ray Crystallography High-throughput Integrated Platform) is a novel microchip that has been developed to combine multiple steps of the crystallographic pipeline from crystallization to diffraction data collection on a single device to streamline the entire process. The X-CHIP (X-ray Crystallization High-throughput Integrated Platform) is a novel microchip that has been developed to combine multiple steps of the crystallographic pipeline from crystallization to diffraction data collection on a single device to streamline the entire process. The system has been designed for crystallization condition screening, visual crystal inspection, initial X-ray screening and data collection in a high-throughput fashion. X-ray diffraction data acquisition can be performed directly on-the-chip at room temperature using an in situ approach. The capabilities of the chip eliminate the necessity for manual crystal handling and cryoprotection of crystal samples, while allowing data collection from multiple crystals in the same drop. This technology would be especially beneficial for projects with large volumes of data, such as protein-complex studies and fragment-based screening. The platform employs hydrophilic and hydrophobic concentric ring surfaces on a miniature plate transparent to visible light and X-rays to create a well defined and stable microbatch crystallization environment. The results of crystallization and data-collection experiments demonstrate that high-quality well diffracting crystals can be grown and high-resolution diffraction data sets can be collected using this technology. Furthermore, the quality of a single-wavelength anomalous dispersion data set collected with the X-CHIP at room temperature was sufficient to generate interpretable electron-density maps. This technology is highly resource-efficient owing to the use of nanolitre-scale drop volumes. It does not require any modification for most in-house and synchrotron beamline systems and offers

X-CHIP: an integrated platform for high-throughput protein crystallization and on-the-chip X-ray diffraction data collection

Energy Technology Data Exchange (ETDEWEB)

Kisselman, Gera; Qiu, Wei; Romanov, Vladimir; Thompson, Christine M.; Lam, Robert [Ontario Cancer Institute, Princess Margaret Hospital, University Health Network, Toronto, Ontario M5G 2C4 (Canada); Battaile, Kevin P. [Argonne National Laboratory, Argonne, Illinois 60439 (United States); Pai, Emil F.; Chirgadze, Nickolay Y., E-mail: nchirgad@uhnresearch.ca [Ontario Cancer Institute, Princess Margaret Hospital, University Health Network, Toronto, Ontario M5G 2C4 (Canada); University of Toronto, Toronto, Ontario M5S 1A8 (Canada)

2011-06-01

The X-CHIP (X-ray Crystallography High-throughput Integrated Platform) is a novel microchip that has been developed to combine multiple steps of the crystallographic pipeline from crystallization to diffraction data collection on a single device to streamline the entire process. The X-CHIP (X-ray Crystallization High-throughput Integrated Platform) is a novel microchip that has been developed to combine multiple steps of the crystallographic pipeline from crystallization to diffraction data collection on a single device to streamline the entire process. The system has been designed for crystallization condition screening, visual crystal inspection, initial X-ray screening and data collection in a high-throughput fashion. X-ray diffraction data acquisition can be performed directly on-the-chip at room temperature using an in situ approach. The capabilities of the chip eliminate the necessity for manual crystal handling and cryoprotection of crystal samples, while allowing data collection from multiple crystals in the same drop. This technology would be especially beneficial for projects with large volumes of data, such as protein-complex studies and fragment-based screening. The platform employs hydrophilic and hydrophobic concentric ring surfaces on a miniature plate transparent to visible light and X-rays to create a well defined and stable microbatch crystallization environment. The results of crystallization and data-collection experiments demonstrate that high-quality well diffracting crystals can be grown and high-resolution diffraction data sets can be collected using this technology. Furthermore, the quality of a single-wavelength anomalous dispersion data set collected with the X-CHIP at room temperature was sufficient to generate interpretable electron-density maps. This technology is highly resource-efficient owing to the use of nanolitre-scale drop volumes. It does not require any modification for most in-house and synchrotron beamline systems and offers

Field-programmable lab-on-a-chip based on microelectrode dot array architecture.

Science.gov (United States)

Wang, Gary; Teng, Daniel; Lai, Yi-Tse; Lu, Yi-Wen; Ho, Yingchieh; Lee, Chen-Yi

2014-09-01

The fundamentals of electrowetting-on-dielectric (EWOD) digital microfluidics are very strong: advantageous capability in the manipulation of fluids, small test volumes, precise dynamic control and detection, and microscale systems. These advantages are very important for future biochip developments, but the development of EWOD microfluidics has been hindered by the absence of: integrated detector technology, standard commercial components, on-chip sample preparation, standard manufacturing technology and end-to-end system integration. A field-programmable lab-on-a-chip (FPLOC) system based on microelectrode dot array (MEDA) architecture is presented in this research. The MEDA architecture proposes a standard EWOD microfluidic component called 'microelectrode cell', which can be dynamically configured into microfluidic components to perform microfluidic operations of the biochip. A proof-of-concept prototype FPLOC, containing a 30 × 30 MEDA, was developed by using generic integrated circuits computer aided design tools, and it was manufactured with standard low-voltage complementary metal-oxide-semiconductor technology, which allows smooth on-chip integration of microfluidics and microelectronics. By integrating 900 droplet detection circuits into microelectrode cells, the FPLOC has achieved large-scale integration of microfluidics and microelectronics. Compared to the full-custom and bottom-up design methods, the FPLOC provides hierarchical top-down design approach, field-programmability and dynamic manipulations of droplets for advanced microfluidic operations.

CMOS active pixel sensor type imaging system on a chip

Science.gov (United States)

Fossum, Eric R. (Inventor); Nixon, Robert (Inventor)

2011-01-01

A single chip camera which includes an .[.intergrated.]. .Iadd.integrated .Iaddend.image acquisition portion and control portion and which has double sampling/noise reduction capabilities thereon. Part of the .[.intergrated.]. .Iadd.integrated .Iaddend.structure reduces the noise that is picked up during imaging.

Superconducting Switch for Fast On-Chip Routing of Quantum Microwave Fields

Science.gov (United States)

Pechal, M.; Besse, J.-C.; Mondal, M.; Oppliger, M.; Gasparinetti, S.; Wallraff, A.

2016-08-01

A switch capable of routing microwave signals at cryogenic temperatures is a desirable component for state-of-the-art experiments in many fields of applied physics, including but not limited to quantum-information processing, communication, and basic research in engineered quantum systems. Conventional mechanical switches provide low insertion loss but disturb operation of dilution cryostats and the associated experiments by heat dissipation. Switches based on semiconductors or microelectromechanical systems have a lower thermal budget but are not readily integrated with current superconducting circuits. Here we design and test an on-chip switch built by combining tunable transmission-line resonators with microwave beam splitters. The device is superconducting and as such dissipates a negligible amount of heat. It is compatible with current superconducting circuit fabrication techniques, operates with a bandwidth exceeding 100 MHz, is capable of handling photon fluxes on the order of 1 05 μ s-1 , equivalent to powers exceeding -90 dBm , and can be switched within approximately 6-8 ns. We successfully demonstrate operation of the device in the quantum regime by integrating it on a chip with a single-photon source and using it to route nonclassical itinerant microwave fields at the single-photon level.

Automated, Ultra-Sterile Solid Sample Handling and Analysis on a Chip

Science.gov (United States)

Mora, Maria F.; Stockton, Amanda M.; Willis, Peter A.

2013-01-01

There are no existing ultra-sterile lab-on-a-chip systems that can accept solid samples and perform complete chemical analyses without human intervention. The proposed solution is to demonstrate completely automated lab-on-a-chip manipulation of powdered solid samples, followed by on-chip liquid extraction and chemical analysis. This technology utilizes a newly invented glass micro-device for solid manipulation, which mates with existing lab-on-a-chip instrumentation. Devices are fabricated in a Class 10 cleanroom at the JPL MicroDevices Lab, and are plasma-cleaned before and after assembly. Solid samples enter the device through a drilled hole in the top. Existing micro-pumping technology is used to transfer milligrams of powdered sample into an extraction chamber where it is mixed with liquids to extract organic material. Subsequent chemical analysis is performed using portable microchip capillary electrophoresis systems (CE). These instruments have been used for ultra-highly sensitive (parts-per-trillion, pptr) analysis of organic compounds including amines, amino acids, aldehydes, ketones, carboxylic acids, and thiols. Fully autonomous amino acid analyses in liquids were demonstrated; however, to date there have been no reports of completely automated analysis of solid samples on chip. This approach utilizes an existing portable instrument that houses optics, high-voltage power supplies, and solenoids for fully autonomous microfluidic sample processing and CE analysis with laser-induced fluorescence (LIF) detection. Furthermore, the entire system can be sterilized and placed in a cleanroom environment for analyzing samples returned from extraterrestrial targets, if desired. This is an entirely new capability never demonstrated before. The ability to manipulate solid samples, coupled with lab-on-a-chip analysis technology, will enable ultraclean and ultrasensitive end-to-end analysis of samples that is orders of magnitude more sensitive than the ppb goal given

Cache-aware network-on-chip for chip multiprocessors

Science.gov (United States)

Tatas, Konstantinos; Kyriacou, Costas; Dekoulis, George; Demetriou, Demetris; Avraam, Costas; Christou, Anastasia

2009-05-01

This paper presents the hardware prototype of a Network-on-Chip (NoC) for a chip multiprocessor that provides support for cache coherence, cache prefetching and cache-aware thread scheduling. A NoC with support to these cache related mechanisms can assist in improving systems performance by reducing the cache miss ratio. The presented multi-core system employs the Data-Driven Multithreading (DDM) model of execution. In DDM thread scheduling is done according to data availability, thus the system is aware of the threads to be executed in the near future. This characteristic of the DDM model allows for cache aware thread scheduling and cache prefetching. The NoC prototype is a crossbar switch with output buffering that can support a cache-aware 4-node chip multiprocessor. The prototype is built on the Xilinx ML506 board equipped with a Xilinx Virtex-5 FPGA.

Research on and design of key circuits in RFID tag chip for container management

Directory of Open Access Journals (Sweden)

Wang Wenjie

2016-01-01

Full Text Available This paper introduces the design of semi-passive RFID tag chip capable of monitoring container safety. A system framework complying with requirements by ISO/IEC 18000-6C is firstly presented, and then differences from the key units of common passive chip, such as switch-state monitoring circuit, power management unit and anti-shake design in baseband processor, are elaborated. The main function of such a chip is to record the container opening frequency during transportation. Finally, the realizations of each unit’s function are simulated.

Fast differential scanning calorimetry of liquid samples with chips

DEFF Research Database (Denmark)

Splinter, R.; van Herwaarden, A. W.; van Wetten, I. A.

2015-01-01

Based on a modified version of standard chips for fast differential scanning calorimetry, DSC of liquid samples has been performed at temperature scan rates of up to 1000 °C/s. This paper describes experimental results with the protein lysozyme, bovine serum, and olive oil. The heating and cooling....... The bovine serum measurements show two main peaks, in good agreement with standard DSC measurements. Olive oil has been measured, with good agreement for the cooling curve and qualitative agreement for the heater curve, compared to DSC measurements....

Rapid on-site monitoring of Legionella pneumophila in cooling tower water using a portable microfluidic system.

Science.gov (United States)

Yamaguchi, Nobuyasu; Tokunaga, Yusuke; Goto, Satoko; Fujii, Yudai; Banno, Fumiya; Edagawa, Akiko

2017-06-08

Legionnaires' disease, predominantly caused by the bacterium Legionella pneumophila, has increased in prevalence worldwide. The most common mode of transmission of Legionella is inhalation of contaminated aerosols, such as those generated by cooling towers. Simple, rapid and accurate methods to enumerate L. pneumophila are required to prevent the spread of this organism. Here, we applied a microfluidic device for on-chip fluorescent staining and semi-automated counting of L. pneumophila in cooling tower water. We also constructed a portable system for rapid on-site monitoring and used it to enumerate target bacterial cells rapidly flowing in the microchannel. A fluorescently-labelled polyclonal antibody was used for the selective detection of L. pneumophila serogroup 1 in the samples. The counts of L. pneumophila in cooling tower water obtained using the system and fluorescence microscopy were similar. The detection limit of the system was 10 4  cells/ml, but lower numbers of L. pneumophila cells (10 1 to 10 3  cells/ml) could be detected following concentration of 0.5-3 L of the water sample by filtration. Our technique is rapid to perform (1.5 h), semi-automated (on-chip staining and counting), and portable for on-site measurement, and it may therefore be effective in the initial screening of Legionella contamination in freshwater.

Smartphone technology can be transformative to the deployment of lab-on-chip diagnostics.

Science.gov (United States)

Erickson, David; O'Dell, Dakota; Jiang, Li; Oncescu, Vlad; Gumus, Abdurrahman; Lee, Seoho; Mancuso, Matthew; Mehta, Saurabh

2014-09-07

The rapid expansion of mobile technology is transforming the biomedical landscape. By 2016 there will be 260 M active smartphones in the US and millions of health accessories and software "apps" running off them. In parallel with this have come major technical achievements in lab-on-a-chip technology leading to incredible new biochemical sensors and molecular diagnostic devices. Despite these advancements, the uptake of lab-on-a-chip technologies at the consumer level has been somewhat limited. We believe that the widespread availability of smartphone technology and the capabilities they offer in terms of computation, communication, social networking, and imaging will be transformative to the deployment of lab-on-a-chip type technology both in the developed and developing world. In this paper we outline why we believe this is the case, the new business models that may emerge, and detail some specific application areas in which this synergy will have long term impact, namely: nutrition monitoring and disease diagnostics in limited resource settings.

Component Cooling Heat Exchanger Heat Transfer Capability Operability Monitoring

International Nuclear Information System (INIS)

Mihalina, M.; Djetelic, N.

2010-01-01

.g. using CC Heat Exchanger bypass valves for CC temperature control, variation of plant heat loads, pumps performance, and day-night temperature difference, with lagging effects on heat transfer dynamics). Krsko NPP is continuously monitoring the Component Cooling (CC) Heat Exchanger performance using the on-line process information system (PIS). By defining the mathematical algorithm, it is possible to continuously evaluate the CC Heat Exchanger operability by verifying if the heat transfer rate calculation is in accordance with the heat exchanger design specification sheet requirements. These calculations are limited to summer periods only when the bypass valves are neither throttled nor open.(author).

Low-power digital ASIC for on-chip spectral analysis of low-frequency physiological signals

International Nuclear Information System (INIS)

Nie Zedong; Zhang Fengjuan; Li Jie; Wang Lei

2012-01-01

A digital ASIC chip customized for battery-operated body sensing devices is presented. The ASIC incorporates a novel hybrid-architecture fast Fourier transform (FFT) unit that is capable of scalable spectral analysis, a licensed ARM7TDMI IP hardcore and several peripheral IP blocks. Extensive experimental results suggest that the complete chip works as intended. The power consumption of the FFT unit is 0.69 mW at 1 MHz with 1.8 V power supply. The low-power and programmable features of the ASIC make it suitable for ‘on-the-fly’ low-frequency physiological signal processing. (semiconductor integrated circuits)

Injection and injection-compression moulding replication capability for the production of polymer lab-on-a-chip with nano structures

DEFF Research Database (Denmark)

Calaon, M.; Tosello, G.; Garnaes, J.

2017-01-01

The manufacturing precision and accuracy in the production of polymer lab-on-a-chip components with 100-130 nm deep nanochannels are evaluated using a metrological approach. Replication fidelity on corresponding process fingerprint test nanostructures over different substrates (nickel tool and po...

The heat removal capability of actively cooled plasma-facing components for the ITER divertor

Science.gov (United States)

Missirlian, M.; Richou, M.; Riccardi, B.; Gavila, P.; Loarer, T.; Constans, S.

2011-12-01

Non-destructive examination followed by high-heat-flux testing was performed for different small- and medium-scale mock-ups; this included the most recent developments related to actively cooled tungsten (W) or carbon fibre composite (CFC) armoured plasma-facing components. In particular, the heat-removal capability of these mock-ups manufactured by European companies with all the main features of the ITER divertor design was investigated both after manufacturing and after thermal cycling up to 20 MW m-2. Compliance with ITER requirements was explored in terms of bonding quality, heat flux performances and operational compatibility. The main results show an overall good heat-removal capability after the manufacturing process independent of the armour-to-heat sink bonding technology and promising behaviour with respect to thermal fatigue lifetime under heat flux up to 20 MW m-2 for the CFC-armoured tiles and 15 MW m-2 for the W-armoured tiles, respectively.

The heat removal capability of actively cooled plasma-facing components for the ITER divertor

International Nuclear Information System (INIS)

Missirlian, M; Richou, M; Loarer, T; Riccardi, B; Gavila, P; Constans, S

2011-01-01

Non-destructive examination followed by high-heat-flux testing was performed for different small- and medium-scale mock-ups; this included the most recent developments related to actively cooled tungsten (W) or carbon fibre composite (CFC) armoured plasma-facing components. In particular, the heat-removal capability of these mock-ups manufactured by European companies with all the main features of the ITER divertor design was investigated both after manufacturing and after thermal cycling up to 20 MW m - 2. Compliance with ITER requirements was explored in terms of bonding quality, heat flux performances and operational compatibility. The main results show an overall good heat-removal capability after the manufacturing process independent of the armour-to-heat sink bonding technology and promising behaviour with respect to thermal fatigue lifetime under heat flux up to 20 MW m - 2 for the CFC-armoured tiles and 15 MW m - 2 for the W-armoured tiles, respectively.

Mathematical model of an integrated circuit cooling through cylindrical rods

Directory of Open Access Journals (Sweden)

Beltrán-Prieto Luis Antonio

2017-01-01

Full Text Available One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhance the heat transfer using combined a conduction-convection systems. Mathematical model of such process is important for parametric design and also to gain information about temperature distribution along the surface of the transistor. In this paper, we aim to obtain the equations for heat transfer along the chip and the fin by performing energy balance and heat transfer by conduction from the chip to the rod, followed by dissipation to the surrounding by convection. Newton's law of cooling and Fourier law were used to obtain the equations that describe the profile temperature in the rod and the surface of the chip. Ordinary differential equations were obtained and the respective analytical solutions were derived after consideration of boundary conditions. The temperature along the rod decreased considerably from the initial temperature (in contatct with the chip surface. This indicates the benefit of using a cilindrical rod to distribute the heat generated in the chip.

On-chip nanofluidic integration of acoustic sensors towards high Q in liquid

Science.gov (United States)

Liang, Ji; Liu, Zifeng; Zhang, Hongxiang; Liu, Bohua; Zhang, Menglun; Zhang, Hao; Pang, Wei

2017-11-01

This paper reports an on-chip acoustic sensor comprising a piston-mode film bulk acoustic resonator and a monolithically integrated nanochannel. The resonator with the channel exhibits a resonance frequency (f) of 2.5 GHz and a quality (Q) factor of 436 in deionized water. The f × Q product is as high as 1.1 × 1012, which is the highest among all the acoustic wave sensors in the liquid phase. The sensor consumes 2 pl liquid volume and thus greatly saves the precious assays in biomedical testing. The Q factor is investigated, and real-time viscosity tests of glucose solution are demonstrated. The highly miniaturized and integrated sensor is capable to be arrayed with readout-circuitry, which opens an avenue for portable applications and lab-on-chip systems.

Performance evaluation of micro thermoelectric module for hot spot cooling

International Nuclear Information System (INIS)

Kim, Ook Joong; Lee, Kong Hoon

2008-01-01

The experimental and numerical study is carried out to investigate the availability of micro TEM for hot spot cooling of an IC chip. It is found that an acrylic plate integrating with copper plate and imbedded micro TEM represents good hot spot cooling of the IC chip when CO2 laser is used to hot spot heating. Effective active local cooling phenomena by the TEM are well investigated by experiment. The measured temperature drop in the hot spot point is compared to numerical result using the TAS program for every case. Numerical result shows good agreement with experiment using some appropriate thermal and thermoelectric properties of TEM and TIM obtained by trial and error. Measurement of thermo-physical properties such as contact thermal resistance and thickness of liquid TIM is difficult but can be estimated by numerical analysis

On-chip antenna: Practical design and characterization considerations

KAUST Repository

Shamim, Atif; Salama, Khaled N.; Sedky, S.; Soliman, E. A.

2012-01-01

This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

On-chip antenna: Practical design and characterization considerations

KAUST Repository

Shamim, Atif

2012-07-28

This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

Smartphone technology can be transformative to the deployment of lab-on-chip diagnostics

Science.gov (United States)

Erickson, David; O’Dell, Dakota; Jiang, Li; Oncescu, Vlad; Gumus, Abdurrahman; Lee, Seoho; Mancuso, Matthew; Mehta, Saurabh

2014-01-01

The rapid expansion of mobile technology is transforming the biomedical landscape. By 2016 there will be 260M active smartphones in the US and millions of health accessories and software “apps” running off them. In parallel with this have come major technical achievements in lab-on-a-chip technology leading to incredible new biochemical sensors and molecular diagnostic devices. Despite these advancements, the uptake of lab-on-a-chip technologies at the consumer level has been somewhat limited. We believe that the widespread availability of smartphone technology and the capabilities they offer in terms of computation, communication, social networking, and imaging will be transformative to the deployment of lab-on-a-chip type technology both in the developed and developing world. In this paper we outline why we believe this is the case, the new business models that may emerge, and detail some specific application areas in which this synergy will have long term impact, namely: nutrition monitoring and disease diagnostics in limited resource settings. PMID:24700127

Development of an atomic clock on an atom chip: Optimisation of the coherence time and preliminary characterisation

International Nuclear Information System (INIS)

Lacroute, Clement

2010-01-01

We describe the construction and preliminary characterization of an atomic clock on an atom chip. A sample of magnetically trapped 87 Rb atoms is cooled below 1 μK, close to Bose- Einstein condensation temperature. The trapped states |F = 1; m F = -1> and |F = 2;m F = 1> define our two-photon clock transition. Atoms are trapped around a field B0 = 3.23 G, where the clock frequency is first-order insensitive to magnetic field fluctuations. We have designed an atom chip that includes a microwave coplanar waveguide which drives the 6.835 GHz transition. The whole clock cycle is performed in the vicinity of the chip surface, making the physics package compact (5 cm) 3 . We first describe the experimental setup of the clock, and the optical bench that has been developed and characterized during this thesis. We then give the results obtained for atom cooling, which led to obtaining a 3 10 4 atoms Bose-Einstein condensate. We finally present the results obtained by Ramsey spectroscopy of the clock transition. We measure coherence times exceeding 10 seconds with our setup, dominated by atom losses. A preliminary measurement shows that the clock relative frequency stability is of 6 10 -12 at 1 s, limited by technical noise. Our goal is to reach a stability in the low 10 -13 at 1 s, i.e. better than commercial clocks and competitive with today's best compact clocks. (author)

Scalable fabrication of high-power graphene micro-supercapacitors for flexible and on-chip energy storage

Science.gov (United States)

El-Kady, Maher F.; Kaner, Richard B.

2013-02-01

The rapid development of miniaturized electronic devices has increased the demand for compact on-chip energy storage. Microscale supercapacitors have great potential to complement or replace batteries and electrolytic capacitors in a variety of applications. However, conventional micro-fabrication techniques have proven to be cumbersome in building cost-effective micro-devices, thus limiting their widespread application. Here we demonstrate a scalable fabrication of graphene micro-supercapacitors over large areas by direct laser writing on graphite oxide films using a standard LightScribe DVD burner. More than 100 micro-supercapacitors can be produced on a single disc in 30 min or less. The devices are built on flexible substrates for flexible electronics and on-chip uses that can be integrated with MEMS or CMOS in a single chip. Remarkably, miniaturizing the devices to the microscale results in enhanced charge-storage capacity and rate capability. These micro-supercapacitors demonstrate a power density of ~200 W cm-3, which is among the highest values achieved for any supercapacitor.

Silicon carbide transparent chips for compact atomic sensors

Science.gov (United States)

Huet, L.; Ammar, M.; Morvan, E.; Sarazin, N.; Pocholle, J.-P.; Reichel, J.; Guerlin, C.; Schwartz, S.

2017-11-01

Atom chips [1] are an efficient tool for trapping, cooling and manipulating cold atoms, which could open the way to a new generation of compact atomic sensors addressing space applications. This is in particular due to the fact that they can achieve strong magnetic field gradients near the chip surface, hence strong atomic confinement at moderate electrical power. However, this advantage usually comes at the price of reducing the optical access to the atoms, which are confined very close to the chip surface. We will report at the conference experimental investigations showing how these limits could be pushed farther by using an atom chip made of a gold microcircuit deposited on a single-crystal Silicon Carbide (SiC) substrate [2]. With a band gap energy value of about 3.2 eV at room temperature, the latter material is transparent at 780nm, potentially restoring quasi full optical access to the atoms. Moreover, it combines a very high electrical resistivity with a very high thermal conductivity, making it a good candidate for supporting wires with large currents without the need of any additional electrical insulation layer [3].

Smartphone-based biosensing platform evolution: implementation of electrochemical analysis capabilities

DEFF Research Database (Denmark)

Patou, François; Dimaki, Maria; Svendsen, Winnie Edith

2016-01-01

Lab-on-Chip technologies offer great opportunities for the democratization of in-vitro medical diagnostics to the consumer-market. Despite the limitations set by the strict instrumentation and control requirements of certain families of these devices, new solutions are emerging. Smartphones now...... routinely demonstrate their potential as an interface of choice for operating complex, instrumented Lab-on-Chips. The sporadic nature of home-based in-vitro medical diagnostics testing calls for the development of systems capable of evolving with new applications or new technologies for Lab-on-Chip devices....... We present in this work how we evolved the first generation of a smartphone/Lab-on-Chip platform designed for evolvability. We demonstrate how reengineering efforts can be confined to the mobile-software layer and illustrate some of the benefits of building evolvable systems. We implement...

Development and evaluation of a real-time fluorogenic loop-mediated isothermal amplification assay integrated on a microfluidic disc chip (on-chip LAMP) for rapid and simultaneous detection of ten pathogenic bacteria in aquatic animals.

Science.gov (United States)

Zhou, Qian-Jin; Wang, Lei; Chen, Jiong; Wang, Rui-Na; Shi, Yu-Hong; Li, Chang-Hong; Zhang, De-Min; Yan, Xiao-Jun; Zhang, Yan-Jun

2014-09-01

Rapid, low-cost, and user-friendly strategies are urgently needed for early disease diagnosis and timely treatment, particularly for on-site screening of pathogens in aquaculture. In this study, we successfully developed a real-time fluorogenic loop-mediated isothermal amplification assay integrated on a microfluidic disc chip (on-chip LAMP), which was capable of simultaneously detecting 10 pathogenic bacteria in aquatic animals, i.e., Nocardia seriolae, Pseudomonas putida, Streptococcus iniae, Vibrio alginolyticus, Vibrio anguillarum, Vibrio fluvialis, Vibrio harveyi, Vibrio parahaemolyticus, Vibrio rotiferianus, and Vibrio vulnificus. The assay provided a nearly-automated approach, with only a single pipetting step per chip for sample dispensing. This technique could achieve limits of detection (LOD) ranging from 0.40 to 6.42pg per 1.414μL reaction in less than 30 min. The robust reproducibility was demonstrated by a little variation among duplications for each bacterium with the coefficient of variation (CV) for time to positive (Tp) value less than 0.10. The clinical sensitivity and specificity of this on-chip LAMP assay in detecting field samples were 96.2% and 93.8% by comparison with conventional microbiological methods. Compared with other well-known techniques, on-chip LAMP assay provides low sample and reagent consumption, ease-of-use, accelerated analysis, multiple bacteria and on-site detection, and high reproducibility, indicating that such a technique would be applicable for on-site detection and routine monitoring of multiple pathogens in aquaculture. Copyright © 2014 Elsevier B.V. All rights reserved.

Thermoelectric cooler application in electronic cooling

International Nuclear Information System (INIS)

Chein Reiyu; Huang Guanming

2004-01-01

This study addresses thermoelectric cooler (TEC) applications in the electronic cooling. The cold side temperature (T c ) and temperature difference between TEC cold and hot sides (ΔT=T h -T c , T h =temperature of hot side of TEC) were used as the parameters. The cooling capacity, junction temperature, coefficient of performance (COP) of TEC and the required heat sink thermal resistance at the TEC hot side were computed. The results indicated that the cooling capacity could be increased as T c increased and ΔT was reduced. The maximum cooling capacity and chip junction temperature obtained were 207 W and 88 deg. C, respectively. The required heat sink thermal resistance on TEC hot side was 0.054 deg. C/W. Larger cooling capacity and higher COP could be obtained when the TEC was operated in the enforced regimes (ΔT c values and heat sink thermal resistance at the TEC hot side. A microchannel heat sink using water or air as the coolant was demonstrated to meet the low thermal heat sink resistance requirement for TEC operated at maximum cooling capacity conditions

On-chip power delivery and management

CERN Document Server

Vaisband, Inna P; Popovich, Mikhail; Mezhiba, Andrey V; Köse, Selçuk; Friedman, Eby G

2016-01-01

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

CERN Document Server

Karadzhinova, Aneliya; Härkönen, Jaakko; Luukka, Panja-riina; Mäenpää, Teppo; Tuominen, Eija; Haeggstrom, Edward; Kalliopuska, Juha; Vahanen, Sami; Kassamakov, Ivan

2014-01-01

In contemporary high energy physics experiments, silicon detectors are essential for recording the trajectory of new particles generated by multiple simultaneous collisions. Modern particle tracking systems may feature 100 million channels, or pixels, which need to be individually connected to read-out chains. Silicon pixel detectors are typically connected to readout chips by flip-chip bonding using solder bumps. High-quality electro-mechanical flip-chip interconnects minimizes the number of dead read-out channels in the particle tracking system. Furthermore, the detector modules must endure handling during installation and withstand heat generation and cooling during operation. Silicon pixel detector modules were constructed by flip-chip bonding 16 readout chips to a single sensor. Eutectic SnPb solder bumps were deposited on the readout chips and the sensor chips were coated with TiW/Pt thin film UBM (under bump metallization). The modules were assembled at Advacam Ltd, Finland. We studied the uniformity o...

The impact of CHIP premium increases on insurance outcomes among CHIP eligible children.

Science.gov (United States)

Nikolova, Silviya; Stearns, Sally

2014-03-03

Within the United States, public insurance premiums are used both to discourage private health policy holders from dropping coverage and to reduce state budget costs. Prior research suggests that the odds of having private coverage and being uninsured increase with increases in public insurance premiums. The aim of this paper is to test effects of Children's Health Insurance Program (CHIP) premium increases on public insurance, private insurance, and uninsurance rates. The fact that families just below and above a state-specific income cut-off are likely very similar in terms of observable and unobservable characteristics except the premium contribution provides a natural experiment for estimating the effect of premium increases. Using 2003 Medical Expenditure Panel Survey (MEPS) merged with CHIP premiums, we compare health insurance outcomes for CHIP eligible children as of January 2003 in states with a two-tier premium structure using a cross-sectional regression discontinuity methodology. We use difference-in-differences analysis to compare longitudinal insurance outcomes by December 2003. Higher CHIP premiums are associated with higher likelihood of private insurance. Disenrollment from CHIP in response to premium increases over time does not increase the uninsurance rate. When faced with higher CHIP premiums, private health insurance may be a preferable alternative for CHIP eligible families with higher incomes. Therefore, competition in the insurance exchanges being formed under the Affordable Care Act could enhance choice.

Modelling, Synthesis, and Configuration of Networks-on-Chips

DEFF Research Database (Denmark)

Stuart, Matthias Bo

This thesis presents three contributions in two different areas of network-on-chip and system-on-chip research: Application modelling and identifying and solving different optimization problems related to two specific network-on-chip architectures. The contribution related to application modelling...... is an analytical method for deriving the worst-case traffic pattern caused by an application and the cache-coherence protocol in a cache-coherent shared-memory system. The contributions related to network-on-chip optimization problems consist of two parts: The development and evaluation of six heuristics...... for solving the network synthesis problem in the MANGO network-on-chip, and the identification and formalization of the ReNoC configuration problem together with three heuristics for solving it....

A study of the external cooling capability for the prevention of reactor vessel failure

Energy Technology Data Exchange (ETDEWEB)

Chang, S H; Baek, W P; Moon, S K; Yang, S H; Kim, S H [Korea Advanced Institute of Science and Technology, Taejon (Korea, Republic of)

1995-07-15

This study (a 3-year program) aims to perform a comprehensive assessment of the feasibility of external vessel flooding with respect to advanced pressurized water reactor plants to be built in Korea. During the second year, appropriate correlations have been chosen to describe the phenomena resulted from the external flooding on the basis of review works. Also performed is to develop the computer program using the chosen correlations and to accomplish the thermal analysis for assessment of the cooling capability of external flooding. Accomplished works for second year are as follows. Review of analytical and experimental works related to the external flooding are performed, appropriate correlations are chosen to describe the phenomena resulted from the external flooding on the basis of first and second year review works. A computer program is also developed to predict the temperature distribution of reactor vessel lower head. Thermal analyses are performed to judge the feasibility of external flooding using developed computer program.

Comparison of a Ring On-Chip Network and a Code-Division Multiple-Access On-Chip Network

Directory of Open Access Journals (Sweden)

Xin Wang

2007-01-01

Full Text Available Two network-on-chip (NoC designs are examined and compared in this paper. One design applies a bidirectional ring connection scheme, while the other design applies a code-division multiple-access (CDMA connection scheme. Both of the designs apply globally asynchronous locally synchronous (GALS scheme in order to deal with the issue of transferring data in a multiple-clock-domain environment of an on-chip system. The two NoC designs are compared with each other by their network structures, data transfer principles, network node structures, and their asynchronous designs. Both the synchronous and the asynchronous designs of the two on-chip networks are realized using a hardware-description language (HDL in order to make the entire designs suit the commonly used synchronous design tools and flow. The performance estimation and comparison of the two NoC designs which are based on the HDL realizations are addressed. By comparing the two NoC designs, the advantages and disadvantages of applying direct connection and CDMA connection schemes in an on-chip communication network are discussed.

Design of Networks-on-Chip for Real-Time Multi-Processor Systems-on-Chip

DEFF Research Database (Denmark)

Sparsø, Jens

2012-01-01

This paper addresses the design of networks-on-chips for use in multi-processor systems-on-chips - the hardware platforms used in embedded systems. These platforms typically have to guarantee real-time properties, and as the network is a shared resource, it has to provide service guarantees...... (bandwidth and/or latency) to different communication flows. The paper reviews some past work in this field and the lessons learned, and the paper discusses ongoing research conducted as part of the project "Time-predictable Multi-Core Architecture for Embedded Systems" (T-CREST), supported by the European...

Influence of passivation process on chip performance

NARCIS (Netherlands)

Lu, J.; Kovalgin, Alexeij Y.; Schmitz, Jurriaan

2009-01-01

In this work, we have studied the performance of CMOS chips before and after a low temperature post-processing step. In order to prevent damage to the IC chips by the post-processing steps, a first passivation layers is needed on top of the IC chips. Two different passivation layer deposition

Recombinant drugs-on-a-chip: The usage of capillary electrophoresis and trends in miniaturized systems – A review

Energy Technology Data Exchange (ETDEWEB)

Morbioli, Giorgio Gianini; Mazzu-Nascimento, Thiago; Aquino, Adriano [Instituto de Química de São Carlos, Universidade de São Paulo, Av. Trabalhador São-carlense, 400, 13566-590 São Carlos, SP (Brazil); Instituto Nacional de Ciência e Tecnologia de Bioanalítica, Campinas, SP (Brazil); Cervantes, Cesar [Instituto de Química de São Carlos, Universidade de São Paulo, Av. Trabalhador São-carlense, 400, 13566-590 São Carlos, SP (Brazil); Carrilho, Emanuel, E-mail: emanuel@iqsc.usp.br [Instituto de Química de São Carlos, Universidade de São Paulo, Av. Trabalhador São-carlense, 400, 13566-590 São Carlos, SP (Brazil); Instituto Nacional de Ciência e Tecnologia de Bioanalítica, Campinas, SP (Brazil)

2016-09-07

We present here a critical review covering conventional analytical tools of recombinant drug analysis and discuss their evolution towards miniaturized systems foreseeing a possible unique recombinant drug-on-a-chip device. Recombinant protein drugs and/or pro-drug analysis require sensitive and reproducible analytical techniques for quality control to ensure safety and efficacy of drugs according to regulatory agencies. The versatility of miniaturized systems combined with their low-cost could become a major trend in recombinant drugs and bioprocess analysis. Miniaturized systems are capable of performing conventional analytical and proteomic tasks, allowing for interfaces with other powerful techniques, such as mass spectrometry. Microdevices can be applied during the different stages of recombinant drug processing, such as gene isolation, DNA amplification, cell culture, protein expression, protein separation, and analysis. In addition, organs-on-chips have appeared as a viable alternative to testing biodrug pharmacokinetics and pharmacodynamics, demonstrating the capabilities of the miniaturized systems. The integration of individual established microfluidic operations and analytical tools in a single device is a challenge to be overcome to achieve a unique recombinant drug-on-a-chip device. - Highlights: • Principal analytical tools for analysis of recombinant drugs are presented. • A critical comparison among different substrates for fabrication of miniaturized systems is made. • Applications of miniaturized systems to produce recombinant drugs are shown. • Future trends of miniaturized systems capable of integrating analytical and proteomic tools in a single device are envisioned.

Recombinant drugs-on-a-chip: The usage of capillary electrophoresis and trends in miniaturized systems – A review

International Nuclear Information System (INIS)

Morbioli, Giorgio Gianini; Mazzu-Nascimento, Thiago; Aquino, Adriano; Cervantes, Cesar; Carrilho, Emanuel

2016-01-01

We present here a critical review covering conventional analytical tools of recombinant drug analysis and discuss their evolution towards miniaturized systems foreseeing a possible unique recombinant drug-on-a-chip device. Recombinant protein drugs and/or pro-drug analysis require sensitive and reproducible analytical techniques for quality control to ensure safety and efficacy of drugs according to regulatory agencies. The versatility of miniaturized systems combined with their low-cost could become a major trend in recombinant drugs and bioprocess analysis. Miniaturized systems are capable of performing conventional analytical and proteomic tasks, allowing for interfaces with other powerful techniques, such as mass spectrometry. Microdevices can be applied during the different stages of recombinant drug processing, such as gene isolation, DNA amplification, cell culture, protein expression, protein separation, and analysis. In addition, organs-on-chips have appeared as a viable alternative to testing biodrug pharmacokinetics and pharmacodynamics, demonstrating the capabilities of the miniaturized systems. The integration of individual established microfluidic operations and analytical tools in a single device is a challenge to be overcome to achieve a unique recombinant drug-on-a-chip device. - Highlights: • Principal analytical tools for analysis of recombinant drugs are presented. • A critical comparison among different substrates for fabrication of miniaturized systems is made. • Applications of miniaturized systems to produce recombinant drugs are shown. • Future trends of miniaturized systems capable of integrating analytical and proteomic tools in a single device are envisioned.

Tunable on chip optofluidic laser

DEFF Research Database (Denmark)

Bakal, Avraham; Vannahme, Christoph; Kristensen, Anders

2016-01-01

On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range.......On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range....

A thermosyphon heat pipe cooler for high power LEDs cooling

Science.gov (United States)

Li, Ji; Tian, Wenkai; Lv, Lucang

2016-08-01

Light emitting diode (LED) cooling is facing the challenge of high heat flux more seriously with the increase of input power and diode density. The proposed unique thermosyphon heat pipe heat sink is particularly suitable for cooling of high power density LED chips and other electronics, which has a heat dissipation potential of up to 280 W within an area of 20 mm × 22 mm (>60 W/cm2) under natural air convection. Meanwhile, a thorough visualization investigation was carried out to explore the two phase flow characteristics in the proposed thermosyphon heat pipe. Implementing this novel thermosyphon heat pipe heat sink in the cooling of a commercial 100 W LED integrated chip, a very low apparent thermal resistance of 0.34 K/W was obtained under natural air convection with the aid of the enhanced boiling heat transfer at the evaporation side and the enhanced natural air convection at the condensation side.

Variation Tolerant On-Chip Interconnects

CERN Document Server

Nigussie, Ethiopia Enideg

2012-01-01

This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

Silicon Chip-to-Chip Mode-Division Multiplexing

DEFF Research Database (Denmark)

Baumann, Jan Markus; Porto da Silva, Edson; Ding, Yunhong

2018-01-01

A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes.......A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes....

Design, implementation, and testing of a cryogenic loading capability on an engineering neutron diffractometer

Energy Technology Data Exchange (ETDEWEB)

Woodruff, T. R.; Krishnan, V. B.; Vaidyanathan, R. [Department of Mechanical, Materials, and Aerospace Engineering, Advanced Materials Processing and Analysis Center (AMPAC), University of Central Florida, Orlando, Florida 32816 (United States); Clausen, B.; Sisneros, T.; Livescu, V.; Brown, D. W.; Bourke, M. A. M. [Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)

2010-06-15

A novel capability was designed, implemented, and tested for in situ neutron diffraction measurements during loading at cryogenic temperatures on the spectrometer for materials research at temperature and stress at Los Alamos National Laboratory. This capability allowed for the application of dynamic compressive forces of up to 250 kN on standard samples controlled at temperatures between 300 and 90 K. The approach comprised of cooling thermally isolated compression platens that in turn conductively cooled the sample in an aluminum vacuum chamber which was nominally transparent to the incident and diffracted neutrons. The cooling/heat rate and final temperature were controlled by regulating the flow of liquid nitrogen in channels inside the platens that were connected through bellows to the mechanical actuator of the load frame and by heaters placed on the platens. Various performance parameters of this system are reported here. The system was used to investigate deformation in Ni-Ti-Fe shape memory alloys at cryogenic temperatures and preliminary results are presented.

Plasmonic nanoparticles-decorated diatomite biosilica: extending the horizon of on-chip chromatography and label-free biosensing.

Science.gov (United States)

Kong, Xianming; Li, Erwen; Squire, Kenny; Liu, Ye; Wu, Bo; Cheng, Li-Jing; Wang, Alan X

2017-11-01

Diatomite consists of fossilized remains of ancient diatoms and is a type of naturally abundant photonic crystal biosilica with multiple unique physical and chemical functionalities. In this paper, we explored the fluidic properties of diatomite as the matrix for on-chip chromatography and, simultaneously, the photonic crystal effects to enhance the plasmonic resonances of metallic nanoparticles for surface-enhanced Raman scattering (SERS) biosensing. The plasmonic nanoparticle-decorated diatomite biosilica provides a lab-on-a-chip capability to separate and detect small molecules from mixture samples with ultra-high detection sensitivity down to 1 ppm. We demonstrate the significant potential for biomedical applications by screening toxins in real biofluid, achieving simultaneous label-free biosensing of phenethylamine and miR21cDNA in human plasma with unprecedented sensitivity and specificity. To the best of our knowledge, this is the first time demonstration to detect target molecules from real biofluids by on-chip chromatography-SERS techniques. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Performance of Metal Cutting on Endmills Manufactured by Cooling-Air and Minimum Quantity Lubrication Grinding

Science.gov (United States)

Inoue, Shigeru; Aoyama, Tojiro

Grinding fluids have been commonly used during the grinding of tools for their cooling and lubricating effect since the hard, robust materials used for cutting tools are difficult to grind. Grinding fluids help prevent a drop in hardness due to burning of the cutting edge and keep chipping to an absolute minimum. However, there is a heightened awareness of the need to improve the work environment and protect the global environment. Thus, the present study is aimed at applying dry grinding, cooling-air grinding, cooling-air grinding with minimum quantity lubrication (MQL), and oil-based fluid grinding to manufacturing actual endmills (HSS-Co). Cutting tests were performed by a vertical machining center. The results indicated that the lowest surface inclination values and longest tool life were obtained by cooling-air grinding with MQL. Thus, cooling-air grinding with MQL has been demonstrated to be at least as effective as oil-based fluid grinding.

Embedded Processor Based Automatic Temperature Control of VLSI Chips

Directory of Open Access Journals (Sweden)

Narasimha Murthy Yayavaram

2009-01-01

Full Text Available This paper presents embedded processor based automatic temperature control of VLSI chips, using temperature sensor LM35 and ARM processor LPC2378. Due to the very high packing density, VLSI chips get heated very soon and if not cooled properly, the performance is very much affected. In the present work, the sensor which is kept very near proximity to the IC will sense the temperature and the speed of the fan arranged near to the IC is controlled based on the PWM signal generated by the ARM processor. A buzzer is also provided with the hardware, to indicate either the failure of the fan or overheating of the IC. The entire process is achieved by developing a suitable embedded C program.

A review of digital microfluidics as portable platforms for lab-on a-chip applications.

Science.gov (United States)

Samiei, Ehsan; Tabrizian, Maryam; Hoorfar, Mina

2016-07-07

Following the development of microfluidic systems, there has been a high tendency towards developing lab-on-a-chip devices for biochemical applications. A great deal of effort has been devoted to improve and advance these devices with the goal of performing complete sets of biochemical assays on the device and possibly developing portable platforms for point of care applications. Among the different microfluidic systems used for such a purpose, digital microfluidics (DMF) shows high flexibility and capability of performing multiplex and parallel biochemical operations, and hence, has been considered as a suitable candidate for lab-on-a-chip applications. In this review, we discuss the most recent advances in the DMF platforms, and evaluate the feasibility of developing multifunctional packages for performing complete sets of processes of biochemical assays, particularly for point-of-care applications. The progress in the development of DMF systems is reviewed from eight different aspects, including device fabrication, basic fluidic operations, automation, manipulation of biological samples, advanced operations, detection, biological applications, and finally, packaging and portability of the DMF devices. Success in developing the lab-on-a-chip DMF devices will be concluded based on the advances achieved in each of these aspects.

A comparative design study of PB-BI cooled reactor cores with forced and natural convection cooling

International Nuclear Information System (INIS)

Mizuno, Tomoyasu; Enuma, Yasuhiro; Tanji, Mikio

2003-01-01

A comparative core design study is performed on Pb-Bi cooled reactors with forced and natural convection (FC and NC) cooling. Major interests of the study are core performance and core safety features. The designed core concepts with nitride fuel achieve reasonable breeding capability. The results of unprotected event analyses such as UTOP and ULOF show that both of concepts have possible features to withstand unprotected events due to negative reactivity feedback by Doppler effect, control rod drive line expansion, etc. These results lead to a conclusion that both of concepts have possible capability as one of future promising core concepts. A FC cooling core concept has more advantage if fuel recycle viewpoint is emphasized. (author)

CMOS Image Sensors: Electronic Camera On A Chip

Science.gov (United States)

Fossum, E. R.

1995-01-01

Recent advancements in CMOS image sensor technology are reviewed, including both passive pixel sensors and active pixel sensors. On- chip analog to digital converters and on-chip timing and control circuits permit realization of an electronic camera-on-a-chip. Highly miniaturized imaging systems based on CMOS image sensor technology are emerging as a competitor to charge-coupled devices for low cost uses.

Microtechnology in Space: NASA's Lab-on-a-Chip Applications Development Program

Science.gov (United States)

Monaco, Lisa; Spearing, Scott; Jenkins, Andy; Symonds, Wes; Mayer, Derek; Gouldie, Edd; Wainwright, Norm; Fries, Marc; Maule, Jake; Toporski, Jan

2004-01-01

NASA's Marshall Space Flight Center (MSFC) Lab on a Chip Application Development LOCAD) team has worked with microfluidic technology for the past few years in an effort to support NASA's Mission. In that time, such microfluidic based Lab-on-a-Chip (LOC) systems have become common technology in clinical and diagnostic laboratories. The approach is most attractive due to its highly miniaturized platform and ability to perform reagent handling (i-e., dilution, mixing, separation) and diagnostics for multiple reactions in an integrated fashion. LOCAD, along with Caliper Life Sciences has successfully developed the first LOC device for macromolecular crystallization using a workstation acquired specifically for designing custom chips, the Caliper 42. LOCAD uses this, along with a novel MSFC-designed and built workstation for microfluidic development. The team has a cadre of LOC devices that can be used to perform initial feasibility testing to determine the efficacy of the LOC approach for a specific application. Once applicability has been established, the LOCAD team, along with the Army's Aviation and Missile Command microfabrication facility, can then begin to custom design and fabricate a device per the user's specifications. This presentation will highlight the LOCAD team's proven and unique expertise that has been utilized to provide end to end capabilities associated with applying microfluidics for applications that include robotic life detection instrumentation, crew health monitoring and microbial and environmental monitoring for human Exploration.

Scalable on-chip quantum state tomography

Science.gov (United States)

Titchener, James G.; Gräfe, Markus; Heilmann, René; Solntsev, Alexander S.; Szameit, Alexander; Sukhorukov, Andrey A.

2018-03-01

Quantum information systems are on a path to vastly exceed the complexity of any classical device. The number of entangled qubits in quantum devices is rapidly increasing, and the information required to fully describe these systems scales exponentially with qubit number. This scaling is the key benefit of quantum systems, however it also presents a severe challenge. To characterize such systems typically requires an exponentially long sequence of different measurements, becoming highly resource demanding for large numbers of qubits. Here we propose and demonstrate a novel and scalable method for characterizing quantum systems based on expanding a multi-photon state to larger dimensionality. We establish that the complexity of this new measurement technique only scales linearly with the number of qubits, while providing a tomographically complete set of data without a need for reconfigurability. We experimentally demonstrate an integrated photonic chip capable of measuring two- and three-photon quantum states with statistical reconstruction fidelity of 99.71%.

On-chip immunoelectrophoresis of extracellular vesicles released from human breast cancer cells.

Directory of Open Access Journals (Sweden)

Takanori Akagi

Full Text Available Extracellular vesicles (EVs including exosomes and microvesicles have attracted considerable attention in the fields of cell biology and medicine. For a better understanding of EVs and further exploration of their applications, the development of analytical methods for biological nanovesicles has been required. In particular, considering the heterogeneity of EVs, methods capable of measuring individual vesicles are desired. Here, we report that on-chip immunoelectrophoresis can provide a useful method for the differential protein expression profiling of individual EVs. Electrophoresis experiments were performed on EVs collected from the culture supernatant of MDA-MB-231 human breast cancer cells using a measurement platform comprising a microcapillary electrophoresis chip and a laser dark-field microimaging system. The zeta potential distribution of EVs that reacted with an anti-human CD63 (exosome and microvesicle marker antibody showed a marked positive shift as compared with that for the normal immunoglobulin G (IgG isotype control. Thus, on-chip immunoelectrophoresis could sensitively detect the over-expression of CD63 glycoproteins on EVs. Moreover, to explore the applicability of on-chip immunoelectrophoresis to cancer diagnosis, EVs collected from the blood of a mouse tumor model were analyzed by this method. By comparing the zeta potential distributions of EVs after their immunochemical reaction with normal IgG, and the anti-human CD63 and anti-human CD44 (cancer stem cell marker antibodies, EVs of tumor origin circulating in blood were differentially detected in the real sample. The result indicates that the present method is potentially applicable to liquid biopsy, a promising approach to the low-invasive diagnosis of cancer.

Experimental investigation of temperature rise in bone drilling with cooling: A comparison between modes of without cooling, internal gas cooling, and external liquid cooling.

Science.gov (United States)

Shakouri, Ehsan; Haghighi Hassanalideh, Hossein; Gholampour, Seifollah

2018-01-01

Bone fracture occurs due to accident, aging, and disease. For the treatment of bone fractures, it is essential that the bones are kept fixed in the right place. In complex fractures, internal fixation or external methods are used to fix the fracture position. In order to immobilize the fracture position and connect the holder equipment to it, bone drilling is required. During the drilling of the bone, the required forces to chip formation could cause an increase in the temperature. If the resulting temperature increases to 47 °C, it causes thermal necrosis of the bone. Thermal necrosis decreases bone strength in the hole and, subsequently, due to incomplete immobilization of bone, fracture repair is not performed correctly. In this study, attempts have been made to compare local temperature increases in different processes of bone drilling. This comparison has been done between drilling without cooling, drilling with gas cooling, and liquid cooling on bovine femur. Drilling tests with gas coolant using direct injection of CO 2 and N 2 gases were carried out by internal coolant drill bit. The results showed that with the use of gas coolant, the elevation of temperature has limited to 6 °C and the thermal necrosis is prevented. Maximum temperature rise reached in drilling without cooling was 56 °C, using gas and liquid coolant, a maximum temperature elevation of 43 °C and 42 °C have been obtained, respectively. This resulted in decreased possibility of thermal necrosis of bone in drilling with gas and liquid cooling. However, the results showed that the values obtained with the drilling method with direct gas cooling are independent of the rotational speed of drill.

Perspective: Fabrication of integrated organ-on-a-chip via bioprinting.

Science.gov (United States)

Yang, Qingzhen; Lian, Qin; Xu, Feng

2017-05-01

Organ-on-a-chip has emerged as a powerful platform with widespread applications in biomedical engineering, such as pathology studies and drug screening. However, the fabrication of organ-on-a-chip is still a challenging task due to its complexity. For an integrated organ-on-a-chip, it may contain four key elements, i.e., a microfluidic chip, live cells/microtissues that are cultured in this chip, components for stimulus loading to mature the microtissues, and sensors for results readout. Recently, bioprinting has been used for fabricating organ-on-a-chip as it enables the printing of multiple materials, including biocompatible materials and even live cells in a programmable manner with a high spatial resolution. Besides, all four elements for organ-on-a-chip could be printed in a single continuous procedure on one printer; in other words, the fabrication process is assembly free. In this paper, we discuss the recent advances of organ-on-a-chip fabrication by bioprinting. Light is shed on the printing strategies, materials, and biocompatibility. In addition, some specific bioprinted organs-on-chips are analyzed in detail. Because the bioprinted organ-on-a-chip is still in its early stage, significant efforts are still needed. Thus, the challenges presented together with possible solutions and future trends are also discussed.

A primary battery-on-a-chip using monolayer graphene

Science.gov (United States)

Iost, Rodrigo M.; Crespilho, Frank N.; Kern, Klaus; Balasubramanian, Kannan

2016-07-01

We present here a bottom-up approach for realizing on-chip on-demand batteries starting out with chemical vapor deposition-grown graphene. Single graphene monolayers contacted by electrode lines on a silicon chip serve as electrodes. The anode and cathode are realized by electrodeposition of zinc and copper respectively onto graphene, leading to the realization of a miniature graphene-based Daniell cell on a chip. The electrolyte is housed partly in a gel and partly in liquid form in an on-chip enclosure molded using a 3d printer or made out of poly(dimethylsiloxane). The realized batteries provide a stable voltage (∼1.1 V) for many hours and exhibit capacities as high as 15 μAh, providing enough power to operate a pocket calculator. The realized batteries show promise for deployment as on-chip power sources for autonomous systems in lab-on-a-chip or biomedical applications.

Integrated lasers for polymer Lab-on-a-Chip systems

DEFF Research Database (Denmark)

Mappes, Timo; Vannahme, Christoph; Grosmann, Tobias

2012-01-01

We develop optical Lab-on-a-Chips on different platforms for marker-based and label-free biophotonic sensor applications. Our chips are based on polymers and fabricated by mass production technologies to integrate microfluidic channels, optical waveguides and miniaturized lasers.......We develop optical Lab-on-a-Chips on different platforms for marker-based and label-free biophotonic sensor applications. Our chips are based on polymers and fabricated by mass production technologies to integrate microfluidic channels, optical waveguides and miniaturized lasers....

3D Printing of Organs-On-Chips.

Science.gov (United States)

Yi, Hee-Gyeong; Lee, Hyungseok; Cho, Dong-Woo

2017-01-25

Organ-on-a-chip engineering aims to create artificial living organs that mimic the complex and physiological responses of real organs, in order to test drugs by precisely manipulating the cells and their microenvironments. To achieve this, the artificial organs should to be microfabricated with an extracellular matrix (ECM) and various types of cells, and should recapitulate morphogenesis, cell differentiation, and functions according to the native organ. A promising strategy is 3D printing, which precisely controls the spatial distribution and layer-by-layer assembly of cells, ECMs, and other biomaterials. Owing to this unique advantage, integration of 3D printing into organ-on-a-chip engineering can facilitate the creation of micro-organs with heterogeneity, a desired 3D cellular arrangement, tissue-specific functions, or even cyclic movement within a microfluidic device. Moreover, fully 3D-printed organs-on-chips more easily incorporate other mechanical and electrical components with the chips, and can be commercialized via automated massive production. Herein, we discuss the recent advances and the potential of 3D cell-printing technology in engineering organs-on-chips, and provides the future perspectives of this technology to establish the highly reliable and useful drug-screening platforms.

Single-chip serial channel enhances multi-processor systems

Energy Technology Data Exchange (ETDEWEB)

Millar, J.

1982-01-01

In this paper multiprocessor systems are described and explained. The impact that VLSI advancements are having on multiprocessor design is pointed out. The TMS 7041 single-chip microcomputer is described briefly, highlighting its multiprocessor communication capability. And finally, a typical multiprocessor system is shown, implementing the TMS 7041.

Error Control for Network-on-Chip Links

CERN Document Server

Fu, Bo

2012-01-01

As technology scales into nanoscale regime, it is impossible to guarantee the perfect hardware design. Moreover, if the requirement of 100% correctness in hardware can be relaxed, the cost of manufacturing, verification, and testing will be significantly reduced. Many approaches have been proposed to address the reliability problem of on-chip communications. This book focuses on the use of error control codes (ECCs) to improve on-chip interconnect reliability. Coverage includes detailed description of key issues in NOC error control faced by circuit and system designers, as well as practical error control techniques to minimize the impact of these errors on system performance. Provides a detailed background on the state of error control methods for on-chip interconnects; Describes the use of more complex concatenated codes such as Hamming Product Codes with Type-II HARQ, while emphasizing integration techniques for on-chip interconnect links; Examines energy-efficient techniques for integrating multiple error...

On-chip integrated lasers for biophotonic applications

DEFF Research Database (Denmark)

Mappes, Timo; Wienhold, Tobias; Bog, Uwe

Meeting the need of biomedical users, we develop disposable Lab-on-a-Chip systems based on commercially available polymers. We are combining passive microfluidics with active optical elements on-chip by integrating multiple solid-state and liquid-core lasers. While covering a wide range of laser ...

Identification of microfluidic two-phase flow patterns in lab-on-chip devices.

Science.gov (United States)

Yang, Zhaochu; Dong, Tao; Halvorsen, Einar

2014-01-01

This work describes a capacitive sensor for identification of microfluidic two-phase flow in lab-on-chip devices. With interdigital electrodes and thin insulation layer utilized, this sensor is capable of being integrated with the microsystems easily. Transducing principle and design considerations are presented with respect to the microfluidic gas/liquid flow patterns. Numerical simulation results verify the operational principle. And the factors affecting the performance of the sensor are discussed. Besides, a feasible process flow for the fabrication is also proposed.

On-chip generation of heralded photon-number states

Science.gov (United States)

Vergyris, Panagiotis; Meany, Thomas; Lunghi, Tommaso; Sauder, Gregory; Downes, James; Steel, M. J.; Withford, Michael J.; Alibart, Olivier; Tanzilli, Sébastien

2016-10-01

Beyond the use of genuine monolithic integrated optical platforms, we report here a hybrid strategy enabling on-chip generation of configurable heralded two-photon states. More specifically, we combine two different fabrication techniques, i.e., non-linear waveguides on lithium niobate for efficient photon-pair generation and femtosecond-laser-direct-written waveguides on glass for photon manipulation. Through real-time device manipulation capabilities, a variety of path-coded heralded two-photon states can be produced, ranging from product to entangled states. Those states are engineered with high levels of purity, assessed by fidelities of 99.5 ± 8% and 95.0 ± 8%, respectively, obtained via quantum interferometric measurements. Our strategy therefore stands as a milestone for further exploiting entanglement-based protocols, relying on engineered quantum states, and enabled by scalable and compatible photonic circuits.

ChIP on SNP-chip for genome-wide analysis of human histone H4 hyperacetylation

Directory of Open Access Journals (Sweden)

Porter Christopher J

2007-09-01

Full Text Available Abstract Background SNP microarrays are designed to genotype Single Nucleotide Polymorphisms (SNPs. These microarrays report hybridization of DNA fragments and therefore can be used for the purpose of detecting genomic fragments. Results Here, we demonstrate that a SNP microarray can be effectively used in this way to perform chromatin immunoprecipitation (ChIP on chip as an alternative to tiling microarrays. We illustrate this novel application by mapping whole genome histone H4 hyperacetylation in human myoblasts and myotubes. We detect clusters of hyperacetylated histone H4, often spanning across up to 300 kilobases of genomic sequence. Using complementary genome-wide analyses of gene expression by DNA microarray we demonstrate that these clusters of hyperacetylated histone H4 tend to be associated with expressed genes. Conclusion The use of a SNP array for a ChIP-on-chip application (ChIP on SNP-chip will be of great value to laboratories whose interest is the determination of general rules regarding the relationship of specific chromatin modifications to transcriptional status throughout the genome and to examine the asymmetric modification of chromatin at heterozygous loci.

An Energy-Efficient Reconfigurable Circuit Switched Network-on-Chip

NARCIS (Netherlands)

Wolkotte, P.T.; Smit, Gerardus Johannes Maria; Rauwerda, G.K.; Smit, L.T.

Network-on-Chip (NoC) is an energy-efficient on-chip communication architecture for multi-tile System-on-Chip (SoC) architectures. The SoC architecture, including its run-time software, can replace inflexible ASICs for future ambient systems. These ambient systems have to be flexible as well as

Energy Model of Networks-on-Chip and a Bus

NARCIS (Netherlands)

Wolkotte, P.T.; Smit, Gerardus Johannes Maria; Kavaldjiev, N.K.; Becker, Jens E.; Becker, Jürgen; Nurmi, J.; Takala, J.; Hamalainen, T.D.

2005-01-01

A Network-on-Chip (NoC) is an energy-efficient onchip communication architecture for Multi-Processor Systemon-Chip (MPSoC) architectures. In earlier papers we proposed two Network-on-Chip architectures based on packet-switching and circuit-switching. In this paper we derive an energy model for both

Spectroscopy study of imaging devices based on silicon Pixel Array Detector coupled to VATAGP7 read-out chips

International Nuclear Information System (INIS)

Linhart, V; Lacasta, C; Llosa, G; Stankova, V; Burdette, D; Chessi, E; Cochran, E; Honscheid, K; Kagan, H; Weilhammer, P; Cindro, V; Grosicar, B; Mikuz, M; Studen, A; Zontar, D; Clinthorne, N H

2011-01-01

Spectroscopic and timing response studies have been conducted on a detector module consisting of a silicon Pixel Array Detector bonded on two VATAGP7 read-out chips manufactured by Gamma-Medica Ideas using laboratory gamma sources and the internal calibration facilities (the calibration system of the read-out chips). The performed tests have proven that the chips have (i) non-linear calibration curves which can be approximated by power functions, (ii) capability to measure the energy of photons with energy resolution better than 2 keV (exact range and resolution depend on experimental setup), (iii) the internal calibration facility which provides 6 out of 16 available internal calibration charges within our region of interest (spanning the Compton edge of 511 keV photons). The peaks induced by the internal calibration facility are suitable for a fit of the calibration curves. However, they are not suitable for measurements of equivalent noise charge because their full width at half maximum varies with their amplitude. These facts indicate that the VATAGP7 chips are useful and precise tools for a wide variety of spectroscopic devices. We have also explored time walk of the module and peaking time of the spectroscopy signals provided by the chips. We have observed that (iv) the time walk is caused partly by the peaking time of the signals provided by the fast shaper of the chips and partly by the timing uncertainty related to the varying position of the photon interaction, (v) the peaking time of the spectroscopy signals provided by the chips increases with increasing pulse height.

Epidermal electronics with advanced capabilities in near-field communication.

Science.gov (United States)

Kim, Jeonghyun; Banks, Anthony; Cheng, Huanyu; Xie, Zhaoqian; Xu, Sheng; Jang, Kyung-In; Lee, Jung Woo; Liu, Zhuangjian; Gutruf, Philipp; Huang, Xian; Wei, Pinghung; Liu, Fei; Li, Kan; Dalal, Mitul; Ghaffari, Roozbeh; Feng, Xue; Huang, Yonggang; Gupta, Sanjay; Paik, Ungyu; Rogers, John A

2015-02-25

Epidermal electronics with advanced capabilities in near field communications (NFC) are presented. The systems include stretchable coils and thinned NFC chips on thin, low modulus stretchable adhesives, to allow seamless, conformal contact with the skin and simultaneous capabilities for wireless interfaces to any standard, NFC-enabled smartphone, even under extreme deformation and after/during normal daily activities. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

On-chip photonic microsystem for optical signal processing based on silicon and silicon nitride platforms

Science.gov (United States)

Li, Yu; Li, Jiachen; Yu, Hongchen; Yu, Hai; Chen, Hongwei; Yang, Sigang; Chen, Minghua

2018-04-01

The explosive growth of data centers, cloud computing and various smart devices is limited by the current state of microelectronics, both in terms of speed and heat generation. Benefiting from the large bandwidth, promising low power consumption and passive calculation capability, experts believe that the integrated photonics-based signal processing and transmission technologies can break the bottleneck of microelectronics technology. In recent years, integrated photonics has become increasingly reliable and access to the advanced fabrication process has been offered by various foundries. In this paper, we review our recent works on the integrated optical signal processing system. We study three different kinds of on-chip signal processors and use these devices to build microsystems for the fields of microwave photonics, optical communications and spectrum sensing. The microwave photonics front receiver was demonstrated with a signal processing range of a full-band (L-band to W-band). A fully integrated microwave photonics transceiver without the on-chip laser was realized on silicon photonics covering the signal frequency of up 10 GHz. An all-optical orthogonal frequency division multiplexing (OFDM) de-multiplier was also demonstrated and used for an OFDM communication system with the rate of 64 Gbps. Finally, we show our work on the monolithic integrated spectrometer with a high resolution of about 20 pm at the central wavelength of 1550 nm. These proposed on-chip signal processing systems potential applications in the fields of radar, 5G wireless communication, wearable devices and optical access networks.

Fully Automated On-Chip Imaging Flow Cytometry System with Disposable Contamination-Free Plastic Re-Cultivation Chip

Directory of Open Access Journals (Sweden)

Tomoyuki Kaneko

2011-06-01

Full Text Available We have developed a novel imaging cytometry system using a poly(methyl methacrylate (PMMA based microfluidic chip. The system was contamination-free, because sample suspensions contacted only with a flammable PMMA chip and no other component of the system. The transparency and low-fluorescence of PMMA was suitable for microscopic imaging of cells flowing through microchannels on the chip. Sample particles flowing through microchannels on the chip were discriminated by an image-recognition unit with a high-speed camera in real time at the rate of 200 event/s, e.g., microparticles 2.5 μm and 3.0 μm in diameter were differentiated with an error rate of less than 2%. Desired cells were separated automatically from other cells by electrophoretic or dielectrophoretic force one by one with a separation efficiency of 90%. Cells in suspension with fluorescent dye were separated using the same kind of microfluidic chip. Sample of 5 μL with 1 × 106 particle/mL was processed within 40 min. Separated cells could be cultured on the microfluidic chip without contamination. The whole operation of sample handling was automated using 3D micropipetting system. These results showed that the novel imaging flow cytometry system is practically applicable for biological research and clinical diagnostics.

3D Printing of Organs-On-Chips

Science.gov (United States)

Yi, Hee-Gyeong; Lee, Hyungseok; Cho, Dong-Woo

2017-01-01

Organ-on-a-chip engineering aims to create artificial living organs that mimic the complex and physiological responses of real organs, in order to test drugs by precisely manipulating the cells and their microenvironments. To achieve this, the artificial organs should to be microfabricated with an extracellular matrix (ECM) and various types of cells, and should recapitulate morphogenesis, cell differentiation, and functions according to the native organ. A promising strategy is 3D printing, which precisely controls the spatial distribution and layer-by-layer assembly of cells, ECMs, and other biomaterials. Owing to this unique advantage, integration of 3D printing into organ-on-a-chip engineering can facilitate the creation of micro-organs with heterogeneity, a desired 3D cellular arrangement, tissue-specific functions, or even cyclic movement within a microfluidic device. Moreover, fully 3D-printed organs-on-chips more easily incorporate other mechanical and electrical components with the chips, and can be commercialized via automated massive production. Herein, we discuss the recent advances and the potential of 3D cell-printing technology in engineering organs-on-chips, and provides the future perspectives of this technology to establish the highly reliable and useful drug-screening platforms. PMID:28952489

3D Printing of Organs-On-Chips

Directory of Open Access Journals (Sweden)

Hee-Gyeong Yi

2017-01-01

Full Text Available Organ-on-a-chip engineering aims to create artificial living organs that mimic the complex and physiological responses of real organs, in order to test drugs by precisely manipulating the cells and their microenvironments. To achieve this, the artificial organs should to be microfabricated with an extracellular matrix (ECM and various types of cells, and should recapitulate morphogenesis, cell differentiation, and functions according to the native organ. A promising strategy is 3D printing, which precisely controls the spatial distribution and layer-by-layer assembly of cells, ECMs, and other biomaterials. Owing to this unique advantage, integration of 3D printing into organ-on-a-chip engineering can facilitate the creation of micro-organs with heterogeneity, a desired 3D cellular arrangement, tissue-specific functions, or even cyclic movement within a microfluidic device. Moreover, fully 3D-printed organs-on-chips more easily incorporate other mechanical and electrical components with the chips, and can be commercialized via automated massive production. Herein, we discuss the recent advances and the potential of 3D cell-printing technology in engineering organs-on-chips, and provides the future perspectives of this technology to establish the highly reliable and useful drug-screening platforms.

Effect of on-chip filter on Coulomb blockade thermometer

International Nuclear Information System (INIS)

Roschier, L; Penttilä, J S; Gunnarsson, D; Prunnila, M; Meschke, M; Savin, A

2012-01-01

Coulomb Blockade Thermometer (CBT) is a primary thermometer based on electric conductance of normal tunnel junction arrays. One limitation for CBT use at the lowest temperatures has been due to environmental noise heating. To improve on this limitation, we have done measurements on CBT sensors fabricated with different on-chip filtering structures in a dilution refrigerator with a base temperature of 10 mK. The CBT sensors were produced with a wafer scale tunnel junction process. We present how the different on-chip filtering schemes affect the limiting saturation temperatures and show that CBT sensors with proper on-chip filtering work at temperatures below 20 mK and are tolerant to noisy environment.

Development of CCD Imaging System Using Thermoelectric Cooling Method

Directory of Open Access Journals (Sweden)

Youngsik Park

2000-06-01

Full Text Available We developed low light CCD imaging system using thermoelectric cooling method collaboration with a company to design a commercial model. It consists of Kodak KAF-0401E (768x512 pixels CCD chip,thermoelectric module manufactured by Thermotek. This TEC system can reach an operative temperature of -25deg. We employed an Uniblitz VS25S shutter and it has capability a minimum exposure time 80ms. The system components are an interface card using a Korea Astronomy Observatory (hereafter KAO ISA bus controller, image acquisition with AD9816 chip, that is 12bit video processor. The performance test with this imaging system showed good operation within the initial specification of our design. It shows a dark current less than 0.4e-/pixel/sec at a temperature of -10deg, a linearity 99.9+/-0.1%, gain 4.24e-adu, and system noise is 25.3e- (rms. For low temperature CCD operation, we designed a TEC, which uses a one-stage peltier module and forced air heat exchanger. This TEC imaging system enables accurate photometry (+/-0.01mag even though the CCD is not at 'conventional' cryogenic temperatures (140K. The system can be a useful instrument for any other imaging applications. Finally, with this system, we obtained several images of astronomical objects for system performance tests.

Exploration within the Network-on-Chip Paradigm

NARCIS (Netherlands)

Wolkotte, P.T.

2009-01-01

A general purpose processor used to consist of a single processing core, which performed and controlled all tasks on the chip. Its functionality and maximum clock frequency grew steadily over the years. Due to the continuous increase of the number of transistors available on-chip and the operational

Design of a 40-nm CMOS integrated on-chip oscilloscope for 5-50 GHz spin wave characterization

Science.gov (United States)

Egel, Eugen; Csaba, György; Dietz, Andreas; Breitkreutz-von Gamm, Stephan; Russer, Johannes; Russer, Peter; Kreupl, Franz; Becherer, Markus

2018-05-01

Spin wave (SW) devices are receiving growing attention in research as a strong candidate for low power applications in the beyond-CMOS era. All SW applications would require an efficient, low power, on-chip read-out circuitry. Thus, we provide a concept for an on-chip oscilloscope (OCO) allowing parallel detection of the SWs at different frequencies. The readout system is designed in 40-nm CMOS technology and is capable of SW device characterization. First, the SWs are picked up by near field loop antennas, placed below yttrium iron garnet (YIG) film, and amplified by a low noise amplifier (LNA). Second, a mixer down-converts the radio frequency (RF) signal of 5 - 50 GHz to lower intermediate frequencies (IF) around 10 - 50 MHz. Finally, the IF signal can be digitized and analyzed regarding the frequency, amplitude and phase variation of the SWs. The power consumption and chip area of the whole OCO are estimated to 166.4 mW and 1.31 mm2, respectively.

Simultaneous detection of multiple HPV DNA via bottom-well microfluidic chip within an infra-red PCR platform.

Science.gov (United States)

Liu, Wenjia; Warden, Antony; Sun, Jiahui; Shen, Guangxia; Ding, Xianting

2018-03-01

Portable Polymerase Chain Reaction (PCR) devices combined with microfluidic chips or lateral flow stripes have shown great potential in the field of point-of-need testing (PoNT) as they only require a small volume of patient sample and are capable of presenting results in a short time. However, the detection for multiple targets in this field leaves much to be desired. Herein, we introduce a novel PCR platform by integrating a bottom-well microfluidic chip with an infra-red (IR) excited temperature control method and fluorescence co-detection of three PCR products. Microfluidic chips are utilized to partition different samples into individual bottom-wells. The oil phase in the main channel contains multi-walled carbon nanotubes which were used as a heat transfer medium that absorbs energy from the IR-light-emitting diode (LED) and transfers heat to the water phase below. Cyclical rapid heating and cooling necessary for PCR are achieved by alternative power switching of the IR-LED and Universal Serial Bus (USB) mini-fan with a pulse width modulation scheme. This design of the IR-LED PCR platform is economic, compact, and fully portable, making it a promising application in the field of PoNT. The bottom-well microfluidic chip and IR-LED PCR platform were combined to fulfill a three-stage thermal cycling PCR for 40 cycles within 90 min for Human Papilloma Virus (HPV) detection. The PCR fluorescent signal was successfully captured at the end of each cycle. The technique introduced here has broad applications in nucleic acid amplification and PoNT devices.

Cooling Tower Overhaul of Secondary Cooling System in HANARO

Energy Technology Data Exchange (ETDEWEB)

Park, Young Chul; Lee, Young Sub; Jung, Hoan Sung; Lim, In Chul [KAERI, Daejeon (Korea, Republic of)

2007-07-01

HANARO, an open-tank-in-pool type research reactor of 30 MWth power in Korea, has been operating normally since its initial criticality in February, 1995. For the last about ten years, A cooling tower of a secondary cooling system has been operated normally in HANARO. Last year, the cooling tower has been overhauled for preservative maintenance including fills, eliminators, wood support, water distribution system, motors, driving shafts, gear reducers, basements, blades and etc. This paper describes the results of the overhaul. As results, it is confirmed that the cooling tower maintains a good operability through a filed test. And a cooling capability will be tested when a wet bulb temperature is maintained about 28 .deg. C in summer and the reactor is operated with the full power.

Monolithic integration of a silicon nanowire field-effect transistors array on a complementary metal-oxide semiconductor chip for biochemical sensor applications.

Science.gov (United States)

Livi, Paolo; Kwiat, Moria; Shadmani, Amir; Pevzner, Alexander; Navarra, Giulio; Rothe, Jörg; Stettler, Alexander; Chen, Yihui; Patolsky, Fernando; Hierlemann, Andreas

2015-10-06

We present a monolithic complementary metal-oxide semiconductor (CMOS)-based sensor system comprising an array of silicon nanowire field-effect transistors (FETs) and the signal-conditioning circuitry on the same chip. The silicon nanowires were fabricated by chemical vapor deposition methods and then transferred to the CMOS chip, where Ti/Pd/Ti contacts had been patterned via e-beam lithography. The on-chip circuitry measures the current flowing through each nanowire FET upon applying a constant source-drain voltage. The analog signal is digitized on chip and then transmitted to a receiving unit. The system has been successfully fabricated and tested by acquiring I-V curves of the bare nanowire-based FETs. Furthermore, the sensing capabilities of the complete system have been demonstrated by recording current changes upon nanowire exposure to solutions of different pHs, as well as by detecting different concentrations of Troponin T biomarkers (cTnT) through antibody-functionalized nanowire FETs.

A review on solder reflow and flux application for flip chip

Science.gov (United States)

Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

2017-09-01

This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

Synthesis of on-chip control circuits for mVLSI biochips

DEFF Research Database (Denmark)

Potluri, Seetal; Schneider, Alexander Rüdiger; Hørslev-Petersen, Martin

2017-01-01

them to laboratory environments. To address this issue, researchers have proposed methods to reduce the number of offchip pressure sources, through integration of on-chip pneumatic control logic circuits fabricated using three-layer monolithic membrane valve technology. Traditionally, mVLSI biochip......-chip control circuit design and (iii) the integration of on-chip control in the placement and routing design tasks. In this paper we present a design methodology for logic synthesis and physical synthesis of mVLSI biochips that use on-chip control. We show how the proposed methodology can be successfully...... applied to generate biochip layouts with integrated on-chip pneumatic control....

Integrated microelectronic capacitive readout subsystem for lab-on-a-chip applications

International Nuclear Information System (INIS)

Spathis, Christos; Georgakopoulou, Konstantina; Petrellis, Nikos; Efstathiou, Konstantinos; Birbas, Alexios

2014-01-01

A mixed-signal capacitive biosensor readout system is presented with its main readout functionality embedded in an integrated circuit, compatible with complementary metal oxide semiconductor-type biosensors. The system modularity allows its usage as a consumable since it eventually leads to a system-on-chip where sensor and readout circuitry are hosted on the same die. In this work, a constant current source is used for measuring the input capacitance. Compared to most capacitive biosensor readout circuits, this method offers the convenience of adjusting both the range and the resolution, depending on the requirements dictated by the application. The chip consumes less than 5 mW of power and the die area is 0.06 mm 2 . It shows a broad input capacitance range (capable of measuring bio-capacitances from 6 pF to 9.8 nF), configurable resolution (down to 1 fF), robustness to various biological experiments and good linearity. The integrated nature of the readout system is proven to be sufficient both for one-time in situ (consumable-type) bio-measurements and its incorporation into a point-of-care system. (paper)

Inherent polarization entanglement generated from a monolithic semiconductor chip

DEFF Research Database (Denmark)

Horn, Rolf T.; Kolenderski, Piotr; Kang, Dongpeng

2013-01-01

Creating miniature chip scale implementations of optical quantum information protocols is a dream for many in the quantum optics community. This is largely because of the promise of stability and scalability. Here we present a monolithically integratable chip architecture upon which is built...... a photonic device primitive called a Bragg reflection waveguide (BRW). Implemented in gallium arsenide, we show that, via the process of spontaneous parametric down conversion, the BRW is capable of directly producing polarization entangled photons without additional path difference compensation, spectral...... as a serious contender on which to build large scale implementations of optical quantum processing devices....

The human brain on a computer, the design neuromorphic chips aims to process information as does the mind

International Nuclear Information System (INIS)

Pajuelo, L.

2015-01-01

Develop chips that mimic the brain processes It will help create computers capable of interpreting information from image, sound and touch so that it may offer answers intelligent-not programmed before- according to these sensory data. chips neuromorphic may mimic the electrical activity neurons and brain synapses, and will be key to intelligence systems artificial (ia) that require interaction with the environment being able to extract information cognitive of what surrounds them. (Author)

A Low Cost Single Chip VDL Compatible Transceiver ASIC

Science.gov (United States)

Becker, Robert

2004-01-01

Recent trends in commercial communications system components have focussed almost exclusively on cellular telephone technology. As many of the traditional sources of receiver components have discontinued non-cellular telephone products, the designers of avionics and other low volume radio applications find themselves increasingly unable to find highly integrated components. This is particularly true for low power, low cost applications which cannot afford the lavish current consumption of the software defined radio approach increasingly taken by certified device manufacturers. In this paper, we describe a low power transceiver chip targeting applications from low VHF to low UHF frequencies typical of avionics systems. The chip encompasses a selectable single or double conversion design for the receiver and a low power IF upconversion transmitter. All local oscillators are synthesized and integrated into the chip. An on-chip I-Q modulator and demodulator provide baseband modulation and demodulation capability allowing the use of low power, fixed point signal processing components for signal demodulation. The goal of this program is to demonstrate a low cost VDL mode-3 transceiver using this chip to receive text weather information sent using 4-slot TDMA with no support for voice. The data will be sent from an experimental ground station. This work is funded by NASA Glenn Research Center.

Analog Multilayer Perceptron Circuit with On-chip Learning: Portable Electronic Nose

Science.gov (United States)

Pan, Chih-Heng; Tang, Kea-Tiong

2011-09-01

This article presents an analog multilayer perceptron (MLP) neural network circuit with on-chip back propagation learning. This low power and small area analog MLP circuit is proposed to implement as a classifier in an electronic nose (E-nose). Comparing with the E-nose using microprocessor or FPGA as a classifier, the E-nose applying analog circuit as a classifier can be faster and much smaller, demonstrate greater power efficiency and be capable of developing a portable E-nose [1]. The system contains four inputs, four hidden neurons, and only one output neuron; this simple structure allows the circuit to have a smaller area and less power consumption. The circuit is fabricated using TSMC 0.18 μm 1P6M CMOS process with 1.8 V supply voltage. The area of this chip is 1.353×1.353 mm2 and the power consumption is 0.54 mW. Post-layout simulations show that the proposed analog MLP circuit can be successively trained to identify three kinds of fruit odors.

Self-powered integrated systems-on-chip (energy chip)

KAUST Repository

Hussain, Muhammad Mustafa

2010-04-23

In today\\'s world, consumer driven technology wants more portable electronic gadgets to be developed, and the next big thing in line is self-powered handheld devices. Therefore to reduce the power consumption as well as to supply sufficient power to run those devices, several critical technical challenges need to be overcome: a. Nanofabrication of macro/micro systems which incorporates the direct benefit of light weight (thus portability), low power consumption, faster response, higher sensitivity and batch production (low cost). b. Integration of advanced nano-materials to meet the performance/cost benefit trend. Nano-materials may offer new functionalities that were previously underutilized in the macro/micro dimension. c. Energy efficiency to reduce power consumption and to supply enough power to meet that low power demand. We present a pragmatic perspective on a self-powered integrated System on Chip (SoC). We envision the integrated device will have two objectives: low power consumption/dissipation and on-chip power generation for implementation into handheld or remote technologies for defense, space, harsh environments and medical applications. This paper provides insight on materials choices, intelligent circuit design, and CMOS compatible integration.

Self-powered integrated systems-on-chip (energy chip)

Science.gov (United States)

Hussain, M. M.; Fahad, H.; Rojas, J.; Hasan, M.; Talukdar, A.; Oommen, J.; Mink, J.

2010-04-01

In today's world, consumer driven technology wants more portable electronic gadgets to be developed, and the next big thing in line is self-powered handheld devices. Therefore to reduce the power consumption as well as to supply sufficient power to run those devices, several critical technical challenges need to be overcome: a. Nanofabrication of macro/micro systems which incorporates the direct benefit of light weight (thus portability), low power consumption, faster response, higher sensitivity and batch production (low cost). b. Integration of advanced nano-materials to meet the performance/cost benefit trend. Nano-materials may offer new functionalities that were previously underutilized in the macro/micro dimension. c. Energy efficiency to reduce power consumption and to supply enough power to meet that low power demand. We present a pragmatic perspective on a self-powered integrated System on Chip (SoC). We envision the integrated device will have two objectives: low power consumption/dissipation and on-chip power generation for implementation into handheld or remote technologies for defense, space, harsh environments and medical applications. This paper provides insight on materials choices, intelligent circuit design, and CMOS compatible integration.

Experimental investigation on hard turning using mixed ceramic insert under accelerated cooling environment

Directory of Open Access Journals (Sweden)

Ramanuj Kumar

2018-05-01

Full Text Available The present study reports on the application of accelerated cooling environment (ACE in hard turning of AISI D2 steel (55 ± 1HRC using mixed ceramic insert (Al2O3 + TiCN which is rarely being investigated and to address the major problems of brittle fracture of tool tip that arises through cutting forces and friction at tool-work and chip-tool interface. In spraying process, some portion of spraying coolant vaporize due to heat when it reaches to cutting zone where as remaining portion of coolant easily penetrate in cutting zone through capillary action and reduces friction as well as heat in cutting zone. Abrasion and chipping are noticed to be dominant wear mechanism. Cutting speed and depth of cut are significant for flank wear as well as cutting temperature whereas feed is significant for average surface roughness. Serrated chips have been identified at higher cutting speed and higher feeds. Optimal parametric combination is found to be d1-f1-v2 (0.1mm-0.04 m/min-108 m/min and tool life and machining cost per part are 70 minutes and Rs 76.76 respectively. Investigation shows the worthy of application of ACE in hard turning in industrial sectors ecologically and economically. Empirical models reveal statistically significance due to higher coefficient of correlations.

On-chip detection of gel transition temperature using a novel micro-thermomechanical method.

Directory of Open Access Journals (Sweden)

Tsenguun Byambadorj

Full Text Available We present a new thermomechanical method and a platform to measure the phase transition temperature at microscale. A thin film metal sensor on a membrane simultaneously measures both temperature and mechanical strain of the sample during heating and cooling cycles. This thermomechanical principle of operation is described in detail. Physical hydrogel samples are prepared as a disc-shaped gels (200 μm thick and 1 mm diameter and placed between an on-chip heater and sensor devices. The sol-gel transition temperature of gelatin solution at various concentrations, used as a model physical hydrogel, shows less than 3% deviation from in-depth rheological results. The developed thermomechanical methodology is promising for precise characterization of phase transition temperature of thermogels at microscale.

Ultra-Sensitive Lab-on-a-Chip Detection of Sudan I in Food using Plasmonics-Enhanced Diatomaceous Thin Film.

Science.gov (United States)

Kong, Xianming; Squire, Kenny; Chong, Xinyuan; Wang, Alan X

2017-09-01

Sudan I is a carcinogenic compound containing an azo group that has been illegally utilized as an adulterant in food products to impart a bright red color to foods. In this paper, we develop a facile lab-on-a-chip device for instant, ultra-sensitive detection of Sudan I from real food samples using plasmonics-enhanced diatomaceous thin film, which can simultaneously perform on-chip separation using thin layer chromatography (TLC) and highly specific sensing using surface-enhanced Raman scattering (SERS) spectroscopy. Diatomite is a kind of nature-created photonic crystal biosilica with periodic pores and was used both as the stationary phase of the TLC plate and photonic crystals to enhance the SERS sensitivity. The on-chip chromatography capability of the TLC plate was verified by isolating Sudan I in a mixture solution containing Rhodamine 6G, while SERS sensing was achieved by spraying gold colloidal nanoparticles into the sensing spot. Such plasmonics-enhanced diatomaceous film can effectively detect Sudan I with more than 10 times improvement of the Raman signal intensity than commercial silica gel TLC plates. We applied this lab-on-a-chip device for real food samples and successfully detected Sudan I in chili sauce and chili oil down to 1 ppm, or 0.5 ng/spot. This on-chip TLC-SERS biosensor based on diatomite biosilica can function as a cost-effective, ultra-sensitive, and reliable technology for screening Sudan I and many other illicit ingredients to enhance food safety.

The GenoChip: a new tool for genetic anthropology.

Science.gov (United States)

Elhaik, Eran; Greenspan, Elliott; Staats, Sean; Krahn, Thomas; Tyler-Smith, Chris; Xue, Yali; Tofanelli, Sergio; Francalacci, Paolo; Cucca, Francesco; Pagani, Luca; Jin, Li; Li, Hui; Schurr, Theodore G; Greenspan, Bennett; Spencer Wells, R

2013-01-01

The Genographic Project is an international effort aimed at charting human migratory history. The project is nonprofit and nonmedical, and, through its Legacy Fund, supports locally led efforts to preserve indigenous and traditional cultures. Although the first phase of the project was focused on uniparentally inherited markers on the Y-chromosome and mitochondrial DNA (mtDNA), the current phase focuses on markers from across the entire genome to obtain a more complete understanding of human genetic variation. Although many commercial arrays exist for genome-wide single-nucleotide polymorphism (SNP) genotyping, they were designed for medical genetic studies and contain medically related markers that are inappropriate for global population genetic studies. GenoChip, the Genographic Project's new genotyping array, was designed to resolve these issues and enable higher resolution research into outstanding questions in genetic anthropology. The GenoChip includes ancestry informative markers obtained for over 450 human populations, an ancient human (Saqqaq), and two archaic hominins (Neanderthal and Denisovan) and was designed to identify all known Y-chromosome and mtDNA haplogroups. The chip was carefully vetted to avoid inclusion of medically relevant markers. To demonstrate its capabilities, we compared the FST distributions of GenoChip SNPs to those of two commercial arrays. Although all arrays yielded similarly shaped (inverse J) FST distributions, the GenoChip autosomal and X-chromosomal distributions had the highest mean FST, attesting to its ability to discern subpopulations. The chip performances are illustrated in a principal component analysis for 14 worldwide populations. In summary, the GenoChip is a dedicated genotyping platform for genetic anthropology. With an unprecedented number of approximately 12,000 Y-chromosomal and approximately 3,300 mtDNA SNPs and over 130,000 autosomal and X-chromosomal SNPs without any known health, medical, or phenotypic

The GenoChip: A New Tool for Genetic Anthropology

Science.gov (United States)

Elhaik, Eran; Greenspan, Elliott; Staats, Sean; Krahn, Thomas; Tyler-Smith, Chris; Xue, Yali; Tofanelli, Sergio; Francalacci, Paolo; Cucca, Francesco; Pagani, Luca; Jin, Li; Li, Hui; Schurr, Theodore G.; Greenspan, Bennett; Spencer Wells, R.

2013-01-01

The Genographic Project is an international effort aimed at charting human migratory history. The project is nonprofit and nonmedical, and, through its Legacy Fund, supports locally led efforts to preserve indigenous and traditional cultures. Although the first phase of the project was focused on uniparentally inherited markers on the Y-chromosome and mitochondrial DNA (mtDNA), the current phase focuses on markers from across the entire genome to obtain a more complete understanding of human genetic variation. Although many commercial arrays exist for genome-wide single-nucleotide polymorphism (SNP) genotyping, they were designed for medical genetic studies and contain medically related markers that are inappropriate for global population genetic studies. GenoChip, the Genographic Project’s new genotyping array, was designed to resolve these issues and enable higher resolution research into outstanding questions in genetic anthropology. The GenoChip includes ancestry informative markers obtained for over 450 human populations, an ancient human (Saqqaq), and two archaic hominins (Neanderthal and Denisovan) and was designed to identify all known Y-chromosome and mtDNA haplogroups. The chip was carefully vetted to avoid inclusion of medically relevant markers. To demonstrate its capabilities, we compared the FST distributions of GenoChip SNPs to those of two commercial arrays. Although all arrays yielded similarly shaped (inverse J) FST distributions, the GenoChip autosomal and X-chromosomal distributions had the highest mean FST, attesting to its ability to discern subpopulations. The chip performances are illustrated in a principal component analysis for 14 worldwide populations. In summary, the GenoChip is a dedicated genotyping platform for genetic anthropology. With an unprecedented number of approximately 12,000 Y-chromosomal and approximately 3,300 mtDNA SNPs and over 130,000 autosomal and X-chromosomal SNPs without any known health, medical, or phenotypic

Addressing On-Chip Power Converstion and Dissipation Issues in Many-Core System-on-a-Chip Based on Conventional Silicon and Emerging Nanotechnologies

Science.gov (United States)

Ashenafi, Emeshaw

Integrated circuits (ICs) are moving towards system-on-a-chip (SOC) designs. SOC allows various small and large electronic systems to be implemented in a single chip. This approach enables the miniaturization of design blocks that leads to high density transistor integration, faster response time, and lower fabrication costs. To reap the benefits of SOC and uphold the miniaturization of transistors, innovative power delivery and power dissipation management schemes are paramount. This dissertation focuses on on-chip integration of power delivery systems and managing power dissipation to increase the lifetime of energy storage elements. We explore this problem from two different angels: On-chip voltage regulators and power gating techniques. On-chip voltage regulators reduce parasitic effects, and allow faster and efficient power delivery for microprocessors. Power gating techniques, on the other hand, reduce the power loss incurred by circuit blocks during standby mode. Power dissipation (Ptotal = Pstatic and Pdynamic) in a complementary metal-oxide semiconductor (CMOS) circuit comes from two sources: static and dynamic. A quadratic dependency on the dynamic switching power and a more than linear dependency on static power as a form of gate leakage (subthreshold current) exist. To reduce dynamic power loss, the supply power should be reduced. A significant reduction in power dissipation occurs when portions of a microprocessor operate at a lower voltage level. This reduction in supply voltage is achieved via voltage regulators or converters. Voltage regulators are used to provide a stable power supply to the microprocessor. The conventional off-chip switching voltage regulator contains a passive floating inductor, which is difficult to be implemented inside the chip due to excessive power dissipation and parasitic effects. Additionally, the inductor takes a very large chip area while hampering the scaling process. These limitations make passive inductor based on-chip

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2013-01-01

Full Text Available The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.

Flexible production and logistics of wood chips; Joustava hakkeen valmistus ja logistiikka

Energy Technology Data Exchange (ETDEWEB)

Haemaelaeinen, M; Pankakari, P [Metsaeenergia Meter Ky, Louhi (Finland)

1997-12-31

The target of the project was to develop a multi-purpose chipper-lorry (MOHA), which could be used both as chipping and transportation unit. MOHA is capable of chipping trees directly from the lot, so the size of the storage plays no role. Even though the MOHA-unit can be used as an individual transportation unit, it can also be used for feeding any further dispatch unit equipped with interchangeable container system e.g. when the transportation distances are long and the ordered volumes of wood chips are large. Previous projects concerning chipping-logistics are based on various intermediate storage models, but the MOHA delivers the chips strait from the lot to the site of utilization. The raw material short-distance haulage is reduced from previous 150 - 250 m to 1 - 50 m. In this new delivery model chips are bunkered only at largest heating plants. At smaller heating plants no bunker storages are needed. MOHA collects self the load, delivers it, brings, if controlled properly, back-haul, and delivers it to another site of utilization

Flexible production and logistics of wood chips; Joustava hakkeen valmistus ja logistiikka

Energy Technology Data Exchange (ETDEWEB)

Haemaelaeinen, M.; Pankakari, P. [Metsaeenergia Meter Ky, Louhi (Finland)

1996-12-31

The target of the project was to develop a multi-purpose chipper-lorry (MOHA), which could be used both as chipping and transportation unit. MOHA is capable of chipping trees directly from the lot, so the size of the storage plays no role. Even though the MOHA-unit can be used as an individual transportation unit, it can also be used for feeding any further dispatch unit equipped with interchangeable container system e.g. when the transportation distances are long and the ordered volumes of wood chips are large. Previous projects concerning chipping-logistics are based on various intermediate storage models, but the MOHA delivers the chips strait from the lot to the site of utilization. The raw material short-distance haulage is reduced from previous 150 - 250 m to 1 - 50 m. In this new delivery model chips are bunkered only at largest heating plants. At smaller heating plants no bunker storages are needed. MOHA collects self the load, delivers it, brings, if controlled properly, back-haul, and delivers it to another site of utilization

The Design, Fabrication and Characterization of a Transparent Atom Chip

Directory of Open Access Journals (Sweden)

Ho-Chiao Chuang

2014-06-01

Full Text Available This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments.

The Design, Fabrication and Characterization of a Transparent Atom Chip

Science.gov (United States)

Chuang, Ho-Chiao; Huang, Chia-Shiuan; Chen, Hung-Pin; Huang, Chi-Sheng; Lin, Yu-Hsin

2014-01-01

This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments. PMID:24922456

Biosensors in Health Care: The Milestones Achieved in Their Development towards Lab-on-Chip-Analysis

Directory of Open Access Journals (Sweden)

Suprava Patel

2016-01-01

Full Text Available Immense potentiality of biosensors in medical diagnostics has driven scientists in evolution of biosensor technologies and innovating newer tools in time. The cornerstone of the popularity of biosensors in sensing wide range of biomolecules in medical diagnostics is due to their simplicity in operation, higher sensitivity, ability to perform multiplex analysis, and capability to be integrated with different function by the same chip. There remains a huge challenge to meet the demands of performance and yield to its simplicity and affordability. Ultimate goal stands for providing point-of-care testing facility to the remote areas worldwide, particularly the developing countries. It entails continuous development in technology towards multiplexing ability, fabrication, and miniaturization of biosensor devices so that they can provide lab-on-chip-analysis systems to the community.

Simulating the Effect of Modulated Tool-Path Chip Breaking On Surface Texture and Chip Length

Energy Technology Data Exchange (ETDEWEB)

Smith, K.S.; McFarland, J.T.; Tursky, D. A.; Assaid, T. S.; Barkman, W. E.; Babelay, Jr., E. F.

2010-04-30

One method for creating broken chips in turning processes involves oscillating the cutting tool in the feed direction utilizing the CNC machine axes. The University of North Carolina at Charlotte and the Y-12 National Security Complex have developed and are refining a method to reliably control surface finish and chip length based on a particular machine's dynamic performance. Using computer simulations it is possible to combine the motion of the machine axes with the geometry of the cutting tool to predict the surface characteristics and map the surface texture for a wide range of oscillation parameters. These data allow the selection of oscillation parameters to simultaneously ensure broken chips and acceptable surface characteristics. This paper describes the machine dynamic testing and characterization activities as well as the computational method used for evaluating and predicting chip length and surface texture.

Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package

International Nuclear Information System (INIS)

Wang, Jing; Zhao, Xin-Jie; Cai, Yi-Xi; Zhang, Chun; Bao, Wei-Wei

2015-01-01

Highlights: • A novel TEC cooling system for multi-chip LED module was successfully developed. • Influences of liquid velocity on the system thermal performance were investigated. • TEC system is more sensitive to the input current than that of the mere air cooling. • The junction temperature can be maintained below 61.8 °C (liquid cooling & TEC). - Abstract: In view of the characteristics of high power light-emitting diodes (LEDs), such as strict junction temperature (T j ) control, the enhanced cooling models based on the thermoelectric cooler (TEC) were presented to meet the thermal demand of high-power LED headlight. The cooling performance of different devices (air cooling & TEC, liquid cooling & TEC) was evaluated and compared by measuring the LED case temperature. Details of the heat transfer performance, particularly, the start-up performances of the TEC cooler, as well as the influence of the fan rotate speed or liquid velocity on the system thermal performance were obtained. It was found that the thermal performance had been elevated dramatically due to the reduction of the hot side temperature, and the thermoelectric cooler was more sensitive to the external fan speed or liquid velocity than purely air cooling or liquid cooling. In addition, the optimal current for air cooling & TEC was 3A, and 5A for liquid cooling + TEC. Investigations of the simulated ambient temperature on junction temperature, forward voltage, and output light were conducted. Results indicated that the case temperature changed linear basically with the increase in heating power or the simulated ambient temperature. When the ambient temperature was within its severe level (60–65 °C), the junction temperature could be calculated to 59.5 °C, and the corresponding output light was 1607.3 lm

Atom chips: mesoscopic physics with cold atoms

International Nuclear Information System (INIS)

Krueger, P.; Wildermuth, S.; Hofferberth, S.; Haller, E.; GAllego Garcia, D.; Schmiedmayer, J.

2005-01-01

Full text: Cold neutral atoms can be controlled and manipulated in microscopic potentials near surfaces of atom chips. These integrated micro-devices combine the known techniques of atom optics with the capabilities of well established micro- and nanofabrication technology. In analogy to electronic microchips and integrated fiber optics, the concept of atom chips is suitable to explore the domain of mesoscopic physics with matter waves. We use current and charge carrying structures to form complex potentials with high spatial resolution only microns from the surface. In particular, atoms can be confined to an essentially one-dimensional motion. In this talk, we will give an overview of our experiments studying the manipulation of both thermal atoms and BECs on atom chips. First experiments in the quasi one-dimensional regime will be presented. These experiments profit from strongly reduced residual disorder potentials caused by imperfections of the chip fabrication with respect to previously published experiments. This is due to our purely lithographic fabrication technique that proves to be advantageous over electroplating. We have used one dimensionally confined BECs as an ultra-sensitive probe to characterize these potentials. These smooth potentials allow us to explore various aspects of the physics of degenerate quantum gases in low dimensions. (author)

On-chip plasmon-induced transparency based on plasmonic coupled nanocavities.

Science.gov (United States)

Zhu, Yu; Hu, Xiaoyong; Yang, Hong; Gong, Qihuang

2014-01-17

On-chip plasmon-induced transparency offers the possibility of realization of ultrahigh-speed information processing chips. Unfortunately, little experimental progress has been made to date because it is difficult to obtain on-chip plasmon-induced transparency using only a single meta-molecule in plasmonic circuits. Here, we report a simple and efficient strategy to realize on-chip plasmon-induced transparency in a nanoscale U-shaped plasmonic waveguide side-coupled nanocavity pair. High tunability in the transparency window is achieved by covering the pair with different organic polymer layers. It is possible to realize ultrafast all-optical tunability based on pump light-induced refractive index change of a graphene cover layer. Compared with previous reports, the overall feature size of the plasmonic nanostructure is reduced by more than three orders of magnitude, while ultrahigh tunability of the transparency window is maintained. This work also provides a superior platform for the study of the various physical effects and phenomena of nonlinear optics and quantum optics.

Time-Predictable Communication on a Time-Division Multiplexing Network-on-Chip Multicore

DEFF Research Database (Denmark)

Sørensen, Rasmus Bo

This thesis presents time-predictable inter-core communication on a multicore platform with a time-division multiplexing (TDM) network-on-chip (NoC) for hard real-time systems. The thesis is structured as a collection of papers that contribute within the areas of: reconfigurable TDM NoCs, static...... TDM scheduling, and time-predictable inter-core communication. More specifically, the work presented in this thesis investigates the interaction between hardware and software involved in time-predictable inter-core communication on the multicore platform. The thesis presents: a new generation...... of the Argo NoC network interface (NI) that supports instantaneous reconfiguration, a TDM traffic scheduler that generates virtual circuit (VC) configurations for the Argo NoC, and software functions for two types of intercore communication. The new generation of the Argo NoC adds the capability...

Power and Thermal Management of System-on-Chip

DEFF Research Database (Denmark)

Liu, Wei

, are necessary at the chip design level. In this work, we investigate the power and thermal management of System-on- Chips (SoCs). Thermal analysis is performed in a SPICE simulation approach based on the electrical-thermal analogy. We investigate the impact of inter- connects on heat distribution...

Microfluidic organ-on-chip technology for blood-brain barrier research.

Science.gov (United States)

van der Helm, Marinke W; van der Meer, Andries D; Eijkel, Jan C T; van den Berg, Albert; Segerink, Loes I

2016-01-01

Organs-on-chips are a new class of microengineered laboratory models that combine several of the advantages of current in vivo and in vitro models. In this review, we summarize the advances that have been made in the development of organ-on-chip models of the blood-brain barrier (BBBs-on-chips) and the challenges that are still ahead. The BBB is formed by specialized endothelial cells and separates blood from brain tissue. It protects the brain from harmful compounds from the blood and provides homeostasis for optimal neuronal function [corrected]. Studying BBB function and dysfunction is important for drug development and biomedical research. Microfluidic BBBs-on-chips enable real-time study of (human) cells in an engineered physiological microenvironment, for example incorporating small geometries and fluid flow as well as sensors. Examples of BBBs-on-chips in literature already show the potential of more realistic microenvironments and the study of organ-level functions. A key challenge in the field of BBB-on-chip development is the current lack of standardized quantification of parameters such as barrier permeability and shear stress. This limits the potential for direct comparison of the performance of different BBB-on-chip models to each other and existing models. We give recommendations for further standardization in model characterization and conclude that the rapidly emerging field of BBB-on-chip models holds great promise for further studies in BBB biology and drug development.

Fully Printed Flexible Single-Chip RFID Tag with Light Detection Capabilities

Directory of Open Access Journals (Sweden)

Aniello Falco

2017-03-01

Full Text Available A printed passive radiofrequency identification (RFID tag in the ultra-high frequency band for light and temperature monitoring is presented. The whole tag has been manufactured by printing techniques on a flexible substrate. Antenna and interconnects are realized with silver nanoparticles via inkjet printing. A sprayed photodetector performs the light monitoring, whereas temperature measurement comes from an in-built sensor in the silicon RFID chip. One of the advantages of this system is the digital read-out and transmission of the sensors information on the RFID tag that ensures reliability. Furthermore, the use of printing techniques allows large-scale manufacturing and the direct fabrication of the tag on the desired surface. This work proves for the first time the feasibility of the embedment of large-scale organic photodetectors onto inkjet printed RFID tags. Here, we solve the problem of integration of different manufacturing techniques to develop an optimal final sensor system.

Runtime adaptive multi-processor system-on-chip: RAMPSoC

OpenAIRE

Göhringer, D.; Hübner, M.; Schatz, V.; Becker, J.

2008-01-01

Current trends in high performance computing show, that the usage of multiprocessor systems on chip are one approach for the requirements of computing intensive applications. The multiprocessor system on chip (MPSoC) approaches often provide a static and homogeneous infrastructure of networked microprocessor on the chip die. A novel idea in this research area is to introduce the dynamic adaptivity of reconfigurable hardware in order to provide a flexible heterogeneous set of processing elemen...

New generation of single-chip microcomputers focused on cost performance

Energy Technology Data Exchange (ETDEWEB)

Akao, Y.; Iwashita, H. (Hitachi, Ltd., Tokyo (Japan))

1993-06-01

A single-chip microcomputer which incorporates a CPU (central processing unit), memory, and peripheral functions in one chip has been increasingly applied to various fields as the heart of electronic equipment in terms of its economy, compactness, lightness, and suitability for mass production. In response to a wide variety of needs, a lineup must have substantial breadth with regard to performance, on-chip memory capacity, on-chip peripheral functions, operating voltage, and packaging. In particular, low-voltage high-speed operation, high integration, expanded address space, and improved software productivity, which are required for mobile communication terminals, are the common needs for single-chip microcomputers. In accordance with these needs, Hitachi has been actively developing new products. The present paper introduces Hitachi's lineup of single-chip microcomputers. 10 figs., 1 tab.

Microfluidic organ-on-chip technology for blood-brain barrier research

NARCIS (Netherlands)

van der Helm, Marieke Willemijn; van der Meer, Andries Dirk; Eijkel, Jan C.T.; van den Berg, Albert; Segerink, Loes Irene

2016-01-01

Organs-on-chips are a new class of microengineered laboratory models that combine several of the advantages of current in vivo and in vitro models. In this review, we summarize the advances that have been made in the development of organ-on-chip models of the blood-brain barrier (BBBs-on-chips) and

Review of the Technical Status on the Debris Bed Cooling Model

Energy Technology Data Exchange (ETDEWEB)

Kim, Eui Kwang; Cho, Chung Ho; Lee, Yong Bum

2007-09-15

Preliminary safety analyses of the KALIMER-600 design have shown that the design has inherent safety characteristics and is capable of accommodating double-fault initiators such as ATWS events without coolant boiling or fuel melting. However, for the future design of sodium cooled fast reactor, the evaluation of the safety performance and the determination of containment requirements may be worth due consideration of triple-fault accident sequences of extremely low probability of occurrence that leads to core melting. For any postulated accident sequence which leads to core melting, in-vessel retention of the core debris will be required as a design requirement for the future design of sodium cooled fast reactor. Also, proof of the capacity of the debris bed cooling is an essential condition to solve the problem of in-vessel retention of the core debris. In this study, review of the technical status on the debris bed cooling model was carried out for in-vessel retention of the core debris0.

Review of the Technical Status on the Debris Bed Cooling Model

International Nuclear Information System (INIS)

Kim, Eui Kwang; Cho, Chung Ho; Lee, Yong Bum

2007-09-01

Preliminary safety analyses of the KALIMER-600 design have shown that the design has inherent safety characteristics and is capable of accommodating double-fault initiators such as ATWS events without coolant boiling or fuel melting. However, for the future design of sodium cooled fast reactor, the evaluation of the safety performance and the determination of containment requirements may be worth due consideration of triple-fault accident sequences of extremely low probability of occurrence that leads to core melting. For any postulated accident sequence which leads to core melting, in-vessel retention of the core debris will be required as a design requirement for the future design of sodium cooled fast reactor. Also, proof of the capacity of the debris bed cooling is an essential condition to solve the problem of in-vessel retention of the core debris. In this study, review of the technical status on the debris bed cooling model was carried out for in-vessel retention of the core debris

A system-level multiprocessor system-on-chip modeling framework

DEFF Research Database (Denmark)

Virk, Kashif Munir; Madsen, Jan

2004-01-01

We present a system-level modeling framework to model system-on-chips (SoC) consisting of heterogeneous multiprocessors and network-on-chip communication structures in order to enable the developers of today's SoC designs to take advantage of the flexibility and scalability of network-on-chip and...... SoC design. We show how a hand-held multimedia terminal, consisting of JPEG, MP3 and GSM applications, can be modeled as a multiprocessor SoC in our framework....

Cooling Performance of ALIP according to the Air or Sodium Cooling Type

Energy Technology Data Exchange (ETDEWEB)

Ye, Huee-Youl; Yoon, Jung; Lee, Tae-Ho [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of)

2015-05-15

ALIP pumps the liquid sodium by Lorentz force produced by the interaction of induced current in the liquid metal and their associated magnetic field. Even though the efficiency of the ALIP is very low compared to conventional mechanical pumps, it is very useful due to the absence of moving parts, low noise and vibration level, simplicity of flow rate regulation and maintenance, and high temperature operation capability. Problems in utilization of ALIP concern a countermeasure for elevation of internal temperature of the coil due to joule heating and how to increase magnetic flux density of Na channel gap. The conventional ALIP usually used cooling methods by circulating the air or water. On the other hand, GE-Toshiba developed a double stator pump adopting the sodium-immersed self-cooled type, and it recovered the heat loss in sodium. Therefore, the station load factor of the plant could be reduced. In this study, the cooling performance with cooling types of ALIP is analyzed. We developed thermal analysis models to evaluate the cooling performance of air or sodium cooling type of ALIP. The cooling performance is analyzed for operating parameters and evaluated with cooling type. 1-D and 3-D thermal analysis model for IHTS ALIP was developed, and the cooling performance was analyzed for air or sodium cooling type. The cooling performance for air cooling type was better than sodium cooling type at higher air velocity than 0.2 m/s. Also, the air temperature of below 270 .deg. demonstrated the better cooling performance as compared to sodium.

Air-cooled fast discharge resistors for ITER magnets

International Nuclear Information System (INIS)

Tanchuk, Victor; Grigoriev, Sergey; Lokiev, Vladimir; Roshal, Alexander; Song, Inho; Buzykin, Oleg

2011-01-01

The ITER superconducting magnets will store up to 50 GJ of magnetic energy per operation cycle. In case of coil quench the energy stored in the coils must be extracted rapidly with a time constant from 7.5 to 14 s. It will be achieved by fast discharge resistors (FDR) normally bridged by circuit breakers and inserted in series with the superconducting coils. The fast discharge of the coils results practically in adiabatic heating of the resistive elements up to 200-300 deg. C. The resistors need to be cooled to the initial temperature over 6-8 h. Natural air circulation is proposed as a cooling method. In order to simulate the temperature response of the resistors to energy released in the resistive plates and to demonstrate their cooling capability within the required time by natural air circulation the numerical model of the resistor cooling circuit has been developed. As the calculations have shown, the developed FDR cooling system based on cooling by natural air circulation is capable of providing the required temperature operation regime of FDRs, but the supply channels are to be optimized so that the cooling time does not exceed the permissible one.

NUMERICAL STUDY ON COOLING EFFECT POTENTIAL FROM VAPORIZER DEVICE OF LPG VEHICLE

Directory of Open Access Journals (Sweden)

MUJI SETIYO

2017-07-01

Full Text Available Over fuel consumption and increased exhaust gas due to the A/C system have become a serious problem. On the other hand, the LPG-fueled vehicle provides potential cooling from LPG phase changes in the vaporizer. Therefore, this article presents the potential cooling effect calculation from 1998 cm3 spark ignition (SI engine. A numerical study is used to calculate the potential heat absorption of latent and sensible heat transfer during LPG is expanded in the vaporizer. Various LPG compositions are also simulated through the engine speed range from 1000 to 6000 rpm. The result shows that the 1998 cm3 engine capable of generating the potential cooling effect of about 1.0 kW at 1000 rpm and a maximum of up to 1.8 kW at 5600 rpm. The potential cooling effects from the LPG vaporizer contributes about 26% to the A/C system works on eco-driving condition.

Microfluidic Platform for the Long-Term On-Chip Cultivation of Mammalian Cells for Lab-On-A-Chip Applications.

Science.gov (United States)

Bunge, Frank; Driesche, Sander van den; Vellekoop, Michael J

2017-07-10

Lab-on-a-Chip (LoC) applications for the long-term analysis of mammalian cells are still very rare due to the lack of convenient cell cultivation devices. The difficulties are the integration of suitable supply structures, the need of expensive equipment like an incubator and sophisticated pumps as well as the choice of material. The presented device is made out of hard, but non-cytotoxic materials (silicon and glass) and contains two vertical arranged membranes out of hydrogel. The porous membranes are used to separate the culture chamber from two supply channels for gases and nutrients. The cells are fed continuously by diffusion through the membranes without the need of an incubator and low requirements on the supply of medium to the assembly. The diffusion of oxygen is modelled in order to find the optimal dimensions of the chamber. The chip is connected via 3D-printed holders to the macroscopic world. The holders are coated with Parlyene C to ensure that only biocompatible materials are in contact with the culture medium. The experiments with MDCK-cells show the successful seeding inside the chip, culturing and passaging. Consequently, the presented platform is a step towards Lab-on-a-Chip applications that require long-term cultivation of mammalian cells.

Timber Chips as the Insulation Material for Energy Saving in Prefabricated Offices

Directory of Open Access Journals (Sweden)

Yupeng Wang

2016-06-01

Full Text Available This research demonstrates the feasibility of a roof insulation method for prefabricated offices that uses vinyl packed timber chips to reduce air conditioning loads (hereinafter referred to as AC loads and which also improves indoor thermal comfort. The advantages of the new roof insulation method were revealed through comparing the impacts of four roof types on prefabricated offices. The AC load and indoor thermal comfort (surface temperature and air temperature were evaluated. The disposal of scrap timber discarded from building construction projects is costing money, and is also a waste of natural resources. The assessment of a new roof insulation method with timber chips demonstrates the advanced usage of timber chips, reducing the environmental load in the building construction process. On the other hand, since prefabricated offices have lower thermal storage capacities and are less airtight than RC (reinforced concrete or S (steel structured buildings, the AC load consumption and indoor thermal comfort exacerbation in prefabricated offices is more serious. Especially in summer, a large amount of solar energy absorption from the roof raises the indoor air temperature and significantly increases the cooling load. This research contributes to the environmental design for prefabricated offices, and develops a method for the reuse of wood chips.

Influence of non-edible vegetable based oil as cutting fluid on chip, surface roughness and cutting force during drilling operation of Mild Steel

Science.gov (United States)

Susmitha, M.; Sharan, P.; Jyothi, P. N.

2016-09-01

Friction between work piece-cutting tool-chip generates heat in the machining zone. The heat generated reduces the tool life, increases surface roughness and decreases the dimensional sensitiveness of work material. This can be overcome by using cutting fluids during machining. They are used to provide lubrication and cooling effects between cutting tool and work piece and cutting tool and chip during machining operation. As a result, important benefits would be achieved such longer tool life, easy chip flow and higher machining quality in the machining processes. Non-edible vegetable oils have received considerable research attention in the last decades owing to their remarkable improved tribological characteristics and due to increasing attention to environmental issues, have driven the lubricant industry toward eco friendly products from renewable sources. In the present work, different non-edible vegetable oils are used as cutting fluid during drilling of Mild steel work piece. Non-edible vegetable oils, used are Karanja oil (Honge), Neem oil and blend of these two oils. The effect of these cutting fluids on chip formation, surface roughness and cutting force are investigated and the results obtained are compared with results obtained with petroleum based cutting fluids and dry conditions.

A simple clockless Network-on-Chip for a commercial audio DSP chip

DEFF Research Database (Denmark)

Stensgaard, Mikkel Bystrup; Bjerregaard, Tobias; Sparsø, Jens

2006-01-01

We design a very small, packet-switched, clockless Network-on-Chip (NoC) as a replacement for the existing crossbar-based communication infrastructure in a commercial audio DSP chip. Both solutions are laid out in a 0.18 um process, and compared in terms of area, power consumption and routing...... to the existing crossbar, it allows all blocks to communicate. The total wire length is decreased by 22% which eases the layout process and makes the design less prone to routing congestion. Not least, the communicating blocks are decoupled by means of the NoC, providing a Globally-Asynchronous, Locally...

On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip

Directory of Open Access Journals (Sweden)

Jian Lu

2008-01-01

Full Text Available A novel concept of on-chip bondwire inductors and transformers with ferrite epoxy glob coating is proposed to offer a cost effective approach realizing power systems on chip (SOC. We have investigated the concept both experimentally and with finite element modeling. A Q factor of 30–40 is experimentally demonstrated for the bondwire inductors which represents an improvement by a factor of 3–30 over the state-of-the-art MEMS micromachined inductors. Transformer parameters including self- and mutual inductance and coupling factors are extracted from both modeled and measured S-parameters. More importantly, the bondwire magnetic components can be easily integrated into SOC manufacturing processes with minimal changes and open enormous possibilities for realizing cost-effective, high-current, high-efficiency power SOCs.

Embedded 3D Graphics Core for FPGA-based System-on-Chip Applications

DEFF Research Database (Denmark)

Holten-Lund, Hans Erik

2005-01-01

This paper presents a 3D graphics accelerator core for an FPGA based system, and illustrates how to build a System-on-Chip containing a Xilinx MicroBlaze soft-core CPU and our 3D graphics accelerator core. The system is capable of running uClinux and hardware accelerated 3D graphics applications......, and the video display which periodically reads from memory to display the final rendered graphics. The graphics core uses internal scratch-pad memory to reduce its external bandwidth requirement, this is achieved by implementing a tile-based rendering algorithm. Reduced external bandwidth means that the power...

Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking.

Science.gov (United States)

Uddin, Ashfaque; Milaninia, Kaveh; Chen, Chin-Hsuan; Theogarajan, Luke

2011-12-01

This paper presents a novel technique for the integration of small CMOS chips into a large area substrate. A key component of the technique is the CMOS chip based self-aligned masking. This allows for the fabrication of sockets in wafers that are at most 5 µm larger than the chip on each side. The chip and the large area substrate are bonded onto a carrier such that the top surfaces of the two components are flush. The unique features of this technique enable the integration of macroscale components, such as leads and microfluidics. Furthermore, the integration process allows for MEMS micromachining after CMOS die-wafer integration. To demonstrate the capabilities of the proposed technology, a low-power integrated potentiostat chip for biosensing implemented in the AMI 0.5 µm CMOS technology is integrated in a silicon substrate. The horizontal gap and the vertical displacement between the chip and the large area substrate measured after the integration were 4 µm and 0.5 µm, respectively. A number of 104 interconnects are patterned with high-precision alignment. Electrical measurements have shown that the functionality of the chip is not affected by the integration process.

Routing algorithms in networks-on-chip

CERN Document Server

Daneshtalab, Masoud

2014-01-01

This book provides a single-source reference to routing algorithms for Networks-on-Chip (NoCs), as well as in-depth discussions of advanced solutions applied to current and next generation, many core NoC-based Systems-on-Chip (SoCs). After a basic introduction to the NoC design paradigm and architectures, routing algorithms for NoC architectures are presented and discussed at all abstraction levels, from the algorithmic level to actual implementation.  Coverage emphasizes the role played by the routing algorithm and is organized around key problems affecting current and next generation, many-core SoCs. A selection of routing algorithms is included, specifically designed to address key issues faced by designers in the ultra-deep sub-micron (UDSM) era, including performance improvement, power, energy, and thermal issues, fault tolerance and reliability.   ·         Provides a comprehensive overview of routing algorithms for Networks-on-Chip and NoC-based, manycore systems; ·         Describe...

Lab-on-a-Chip Based Protein Crystallization

Science.gov (United States)

vanderWoerd, Mark J.; Brasseur, Michael M.; Spearing, Scott F.; Whitaker, Ann F. (Technical Monitor)

2001-01-01

We are developing a novel technique with which we will grow protein crystals in very small volumes, utilizing chip-based, microfluidic ("LabChip") technology. This development, which is a collaborative effort between NASA's Marshall Space Flight Center and Caliper Technologies Corporation, promises a breakthrough in the field of protein crystal growth. Our initial results obtained from two model proteins, Lysozyme and Thaumatin, show that it is feasible to dispense and adequately mix protein and precipitant solutions on a nano-liter scale. The mixtures have shown crystal growth in volumes in the range of 10 nanoliters to 5 microliters. In addition, large diffraction quality crystals were obtained by this method. X-ray data from these crystals were shown to be of excellent quality. Our future efforts will include the further development of protein crystal growth with LabChip(trademark) technology for more complex systems. We will initially address the batch growth method, followed by the vapor diffusion method and the liquid-liquid diffusion method. The culmination of these chip developments is to lead to an on orbit protein crystallization facility on the International Space Station. Structural biologists will be invited to utilize the on orbit Iterative Biological Crystallization facility to grow high quality macromolecular crystals in microgravity.

Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling

Science.gov (United States)

Ren, Zongqing; Lee, Jaeho

2018-01-01

Artificial nanostructures have improved prospects of thermoelectric systems by enabling selective scattering of phonons and demonstrating significant thermal conductivity reductions. While the low thermal conductivity provides necessary temperature gradients for thermoelectric conversion, the heat generation is detrimental to electronic systems where high thermal conductivity are preferred. The contrasting needs of thermal conductivity are evident in thermoelectric cooling systems, which call for a fundamental breakthrough. Here we show a silicon nanostructure with vertically etched holes, or holey silicon, uniquely combines the low thermal conductivity in the in-plane direction and the high thermal conductivity in the cross-plane direction, and that the anisotropy is ideal for lateral thermoelectric cooling. The low in-plane thermal conductivity due to substantial phonon boundary scattering in small necks sustains large temperature gradients for lateral Peltier junctions. The high cross-plane thermal conductivity due to persistent long-wavelength phonons effectively dissipates heat from a hot spot to the on-chip cooling system. Our scaling analysis based on spectral phonon properties captures the anisotropic size effects in holey silicon and predicts the thermal conductivity anisotropy ratio up to 20. Our numerical simulations demonstrate the thermoelectric cooling effectiveness of holey silicon is at least 30% greater than that of high-thermal-conductivity bulk silicon and 400% greater than that of low-thermal-conductivity chalcogenides; these results contrast with the conventional perception preferring either high or low thermal conductivity materials. The thermal conductivity anisotropy is even more favorable in laterally confined systems and will provide effective thermal management solutions for advanced electronics.

Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling.

Science.gov (United States)

Ren, Zongqing; Lee, Jaeho

2018-01-26

Artificial nanostructures have improved prospects of thermoelectric systems by enabling selective scattering of phonons and demonstrating significant thermal conductivity reductions. While the low thermal conductivity provides necessary temperature gradients for thermoelectric conversion, the heat generation is detrimental to electronic systems where high thermal conductivity are preferred. The contrasting needs of thermal conductivity are evident in thermoelectric cooling systems, which call for a fundamental breakthrough. Here we show a silicon nanostructure with vertically etched holes, or holey silicon, uniquely combines the low thermal conductivity in the in-plane direction and the high thermal conductivity in the cross-plane direction, and that the anisotropy is ideal for lateral thermoelectric cooling. The low in-plane thermal conductivity due to substantial phonon boundary scattering in small necks sustains large temperature gradients for lateral Peltier junctions. The high cross-plane thermal conductivity due to persistent long-wavelength phonons effectively dissipates heat from a hot spot to the on-chip cooling system. Our scaling analysis based on spectral phonon properties captures the anisotropic size effects in holey silicon and predicts the thermal conductivity anisotropy ratio up to 20. Our numerical simulations demonstrate the thermoelectric cooling effectiveness of holey silicon is at least 30% greater than that of high-thermal-conductivity bulk silicon and 400% greater than that of low-thermal-conductivity chalcogenides; these results contrast with the conventional perception preferring either high or low thermal conductivity materials. The thermal conductivity anisotropy is even more favorable in laterally confined systems and will provide effective thermal management solutions for advanced electronics.

Effect of air condition on AP-1000 containment cooling performance in station black out accident

International Nuclear Information System (INIS)

Hendro Tjahjono

2015-01-01

AP1000 reactor is a nuclear power plant generation III+ 1000 MWe which apply passive cooling concept to anticipate accidents triggered by the extinction of the entire supply of electrical power or Station Black Out (SBO). In the AP1000 reactor, decay heat disposal mechanism conducted passively through the PRHR-IRWST and subsequently forwarded to the reactor containment. Containment externally cooled through natural convection in the air gap and through evaporation cooling water poured on the outer surface of the containment wall. The mechanism of evaporation of water into the air outside is strongly influenced by the conditions of humidity and air temperature. The purpose of this study was to determine the extent of the influence of the air condition on cooling capabilities of the AP1000 containment. The method used is to perform simulations using Matlab-based analytical calculation model capable of estimating the power of heat transferred. The simulation results showed a decrease in power up to 5% for relative humidity rose from 10% to 95%, while the variation of air temperature of 10°C to 40°C, the power will decrease up to 15%. It can be concluded that the effect of air temperature increase is much more significant in lowering the containment cooling ability compared with the increase of humidity. (author)

Dr. Monaco Examines Lab-on a-Chip

Science.gov (United States)

2003-01-01

Dr. Lisa Monaco, Marshall Space Flight Center's (MSFC's) project scientist for the Lab-on-a-Chip Applications Development (LOCAD) program, examines a lab on a chip. The small dots are actually ports where fluids and chemicals can be mixed or samples can be collected for testing. Tiny channels, only clearly visible under a microscope, form pathways between the ports. Many chemical and biological processes, previously conducted on large pieces of laboratory equipment, can now be performed on these small glass or plastic plates. Monaco and other researchers at MSFC in Huntsville, Alabama, are customizing the chips to be used for many space applications, such as monitoring microbes inside spacecraft and detecting life on other planets. The portable, handheld Lab-on-a Chip Application Development Portable Test System (LOCAD-PTS) made its debut flight aboard Discovery during the STS-116 mission launched December 9, 2006. The system allowed crew members to monitor their environment for problematic contaminants such as yeast, mold, and even E.coli, and salmonella. Once LOCAD-PTS reached the International Space Station (ISS), the Marshall team continued to manage the experiment, monitoring the study from a console in the Payload Operations Center at MSFC. The results of these studies will help NASA researchers refine the technology for future Moon and Mars missions. (NASA/MSFC/D.Stoffer)

Laser Doppler Blood Flow Imaging Using a CMOS Imaging Sensor with On-Chip Signal Processing

Directory of Open Access Journals (Sweden)

Cally Gill

2013-09-01

Full Text Available The first fully integrated 2D CMOS imaging sensor with on-chip signal processing for applications in laser Doppler blood flow (LDBF imaging has been designed and tested. To obtain a space efficient design over 64 × 64 pixels means that standard processing electronics used off-chip cannot be implemented. Therefore the analog signal processing at each pixel is a tailored design for LDBF signals with balanced optimization for signal-to-noise ratio and silicon area. This custom made sensor offers key advantages over conventional sensors, viz. the analog signal processing at the pixel level carries out signal normalization; the AC amplification in combination with an anti-aliasing filter allows analog-to-digital conversion with a low number of bits; low resource implementation of the digital processor enables on-chip processing and the data bottleneck that exists between the detector and processing electronics has been overcome. The sensor demonstrates good agreement with simulation at each design stage. The measured optical performance of the sensor is demonstrated using modulated light signals and in vivo blood flow experiments. Images showing blood flow changes with arterial occlusion and an inflammatory response to a histamine skin-prick demonstrate that the sensor array is capable of detecting blood flow signals from tissue.

Laser doppler blood flow imaging using a CMOS imaging sensor with on-chip signal processing.

Science.gov (United States)

He, Diwei; Nguyen, Hoang C; Hayes-Gill, Barrie R; Zhu, Yiqun; Crowe, John A; Gill, Cally; Clough, Geraldine F; Morgan, Stephen P

2013-09-18

The first fully integrated 2D CMOS imaging sensor with on-chip signal processing for applications in laser Doppler blood flow (LDBF) imaging has been designed and tested. To obtain a space efficient design over 64 × 64 pixels means that standard processing electronics used off-chip cannot be implemented. Therefore the analog signal processing at each pixel is a tailored design for LDBF signals with balanced optimization for signal-to-noise ratio and silicon area. This custom made sensor offers key advantages over conventional sensors, viz. the analog signal processing at the pixel level carries out signal normalization; the AC amplification in combination with an anti-aliasing filter allows analog-to-digital conversion with a low number of bits; low resource implementation of the digital processor enables on-chip processing and the data bottleneck that exists between the detector and processing electronics has been overcome. The sensor demonstrates good agreement with simulation at each design stage. The measured optical performance of the sensor is demonstrated using modulated light signals and in vivo blood flow experiments. Images showing blood flow changes with arterial occlusion and an inflammatory response to a histamine skin-prick demonstrate that the sensor array is capable of detecting blood flow signals from tissue.

Localization of burn mark under an abnormal topography on MOSFET chip surface using liquid crystal and emission microscopy tools.

Science.gov (United States)

Lau, C K; Sim, K S; Tso, C P

2011-01-01

This article focuses on the localization of burn mark in MOSFET and the scanning electron microscope (SEM) inspection on the defect location. When a suspect abnormal topography is shown on the die surface, further methods to pin-point the defect location is necessary. Fault localization analysis becomes important because an abnormal spot on the chip surface may and may not have a defect underneath it. The chip surface topography can change due to the catastrophic damage occurred at layers under the chip surface, but it could also be due to inconsistency during metal deposition in the wafer fabrication process. Two localization techniques, liquid crystal thermography and emission microscopy, were performed to confirm that the abnormal topography spot is the actual defect location. The tiny burn mark was surfaced by performing a surface decoration at the defect location using hot hydrochloric acid. SEM imaging, which has the high magnification and three-dimensional capabilities, was used to capture the images of the burn mark. Copyright © 2011 Wiley Periodicals, Inc.

Hardware support for CSP on a Java chip multiprocessor

DEFF Research Database (Denmark)

Gruian, Flavius; Schoeberl, Martin

2013-01-01

Due to memory bandwidth limitations, chip multiprocessors (CMPs) adopting the convenient shared memory model for their main memory architecture scale poorly. On-chip core-to-core communication is a solution to this problem, that can lead to further performance increase for a number of multithreaded...... applications. Programmatically, the Communicating Sequential Processes (CSPs) paradigm provides a sound computational model for such an architecture with message based communication. In this paper we explore hardware support for CSP in the context of an embedded Java CMP. The hardware support for CSP are on......-chip communication channels, implemented by a ring-based network-on-chip (NoC), to reduce the memory bandwidth pressure on the shared memory.The presented solution is scalable and also specific for our limited resources and real-time predictability requirements. CMP architectures of three to eight processors were...

A Single-Chip CMOS Pulse Oximeter with On-Chip Lock-In Detection

Directory of Open Access Journals (Sweden)

Diwei He

2015-07-01

Full Text Available Pulse oximetry is a noninvasive and continuous method for monitoring the blood oxygen saturation level. This paper presents the design and testing of a single-chip pulse oximeter fabricated in a 0.35 µm CMOS process. The chip includes photodiode, transimpedance amplifier, analogue band-pass filters, analogue-to-digital converters, digital signal processor and LED timing control. The experimentally measured AC and DC characteristics of individual circuits including the DC output voltage of the transimpedance amplifier, transimpedance gain of the transimpedance amplifier, and the central frequency and bandwidth of the analogue band-pass filters, show a good match (within 1% with the circuit simulations. With modulated light source and integrated lock-in detection the sensor effectively suppresses the interference from ambient light and 1/f noise. In a breath hold and release experiment the single chip sensor demonstrates consistent and comparable performance to commercial pulse oximetry devices with a mean of 1.2% difference. The single-chip sensor enables a compact and robust design solution that offers a route towards wearable devices for health monitoring.

A Single-Chip CMOS Pulse Oximeter with On-Chip Lock-In Detection.

Science.gov (United States)

He, Diwei; Morgan, Stephen P; Trachanis, Dimitrios; van Hese, Jan; Drogoudis, Dimitris; Fummi, Franco; Stefanni, Francesco; Guarnieri, Valerio; Hayes-Gill, Barrie R

2015-07-14

Pulse oximetry is a noninvasive and continuous method for monitoring the blood oxygen saturation level. This paper presents the design and testing of a single-chip pulse oximeter fabricated in a 0.35 µm CMOS process. The chip includes photodiode, transimpedance amplifier, analogue band-pass filters, analogue-to-digital converters, digital signal processor and LED timing control. The experimentally measured AC and DC characteristics of individual circuits including the DC output voltage of the transimpedance amplifier, transimpedance gain of the transimpedance amplifier, and the central frequency and bandwidth of the analogue band-pass filters, show a good match (within 1%) with the circuit simulations. With modulated light source and integrated lock-in detection the sensor effectively suppresses the interference from ambient light and 1/f noise. In a breath hold and release experiment the single chip sensor demonstrates consistent and comparable performance to commercial pulse oximetry devices with a mean of 1.2% difference. The single-chip sensor enables a compact and robust design solution that offers a route towards wearable devices for health monitoring.

Silicon Nanophotonics for Many-Core On-Chip Networks

Science.gov (United States)

Mohamed, Moustafa

Number of cores in many-core architectures are scaling to unprecedented levels requiring ever increasing communication capacity. Traditionally, architects follow the path of higher throughput at the expense of latency. This trend has evolved into being problematic for performance in many-core architectures. Moreover, the trends of power consumption is increasing with system scaling mandating nontraditional solutions. Nanophotonics can address these problems, offering benefits in the three frontiers of many-core processor design: Latency, bandwidth, and power. Nanophotonics leverage circuit-switching flow control allowing low latency; in addition, the power consumption of optical links is significantly lower compared to their electrical counterparts at intermediate and long links. Finally, through wave division multiplexing, we can keep the high bandwidth trends without sacrificing the throughput. This thesis focuses on realizing nanophotonics for communication in many-core architectures at different design levels considering reliability challenges that our fabrication and measurements reveal. First, we study how to design on-chip networks for low latency, low power, and high bandwidth by exploiting the full potential of nanophotonics. The design process considers device level limitations and capabilities on one hand, and system level demands in terms of power and performance on the other hand. The design involves the choice of devices, designing the optical link, the topology, the arbitration technique, and the routing mechanism. Next, we address the problem of reliability in on-chip networks. Reliability not only degrades performance but can block communication. Hence, we propose a reliability-aware design flow and present a reliability management technique based on this flow to address reliability in the system. In the proposed flow reliability is modeled and analyzed for at the device, architecture, and system level. Our reliability management technique is

Coherent matter wave optics on an atom chip

DEFF Research Database (Denmark)

Krüger, Peter; Hofferberth, S.; Schumm, Thorsten

2006-01-01

Coherent manipulation of matter waves in microscopic trapping potentials facilitates both fundamental and technological applications. Here we focus on experiments with a microscopic integrated interferometer that demonstrate coherent operation on an atom chip.......Coherent manipulation of matter waves in microscopic trapping potentials facilitates both fundamental and technological applications. Here we focus on experiments with a microscopic integrated interferometer that demonstrate coherent operation on an atom chip....

Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

Science.gov (United States)

Hong, Sunkwang; Ho, Tawei; Zhang, Liping; Sawchuk, Alexander A.

2003-06-01

We describe the design and test of flip-chip bonded optoelectronic CMOS devices based on Peregrine Semiconductor's 0.5 micron Ultra-Thin Silicon on sapphire (UTSi) technology. The UTSi process eliminates the substrate leakage that typically results in crosstalk and reduces parasitic capacitance to the substrate, providing many benefits compared to bulk silicon CMOS. The low-loss synthetic sapphire substrate is optically transparent and has a coefficient of thermal expansion suitable for flip-chip bonding of vertical cavity surface emitting lasers (VCSELs) and detectors. We have designed two different UTSi CMOS chips. One contains a flip-chip bonded 1 x 4 photodiode array, a receiver array, a double edge triggered D-flip flop-based 2047-pattern pseudo random bit stream (PRBS) generator and a quadrature-phase LC-voltage controlled oscillator (VCO). The other chip contains a flip-chip bonded 1 x 4 VCSEL array, a driver array based on high-speed low-voltage differential signals (LVDS) and a full-balanced differential LC-VCO. Each VCSEL driver and receiver has individual input and bias voltage adjustments. Each UTSi chip is mounted on different printed circuit boards (PCBs) which have holes with about 1 mm radius for optical output and input paths through the sapphire substrate. We discuss preliminary testing of these chips.

Active cooling of a mobile phone handset

International Nuclear Information System (INIS)

Grimes, Ronan; Walsh, Ed; Walsh, Pat

2010-01-01

Power dissipation levels in mobile phones continue to increase due to gaming, higher power applications, and increased functionality associated with the internet. The current cooling methodologies of natural convection and radiation limit the power dissipation within a mobile phone to between 1-2 W depending on size. As power dissipation levels increase, products such as mobile phones will require active cooling to ensure that the devices operate within an acceptable temperature envelop from both user comfort and reliability perspectives. In this paper, we focus on the applied thermal engineering problem of an active cooling solution within a typical mobile phone architecture by implementing a custom centrifugal fan within the mobile phone. Its performance is compared in terms of flow rates and pressure drops, allowable phone heat dissipation and maximum phone surface temperature as this is the user constraint for a variety of simulated PCB architectures in the mobile phone. Perforated plates with varying porosity through different size orifices are used to simulate these architectures. The results show that the power level dissipated by a phone for a constant surface temperature may be increased by ∼50 - 75% depending on pressure drop induced by the internal phone architecture. Hence for successful implementation and efficient utilization of active cooling will require chip layout to be considered at the design stage.

On-chip particle trapping and manipulation

Science.gov (United States)

Leake, Kaelyn Danielle

The ability to control and manipulate the world around us is human nature. Humans and our ancestors have used tools for millions of years. Only in recent years have we been able to control objects at such small levels. In order to understand the world around us it is frequently necessary to interact with the biological world. Optical trapping and manipulation offer a non-invasive way to move, sort and interact with particles and cells to see how they react to the world around them. Optical tweezers are ideal in their abilities but they require large, non-portable, and expensive setups limiting how and where we can use them. A cheap portable platform is required in order to have optical manipulation reach its full potential. On-chip technology offers a great solution to this challenge. We focused on the Liquid-Core Anti-Resonant Reflecting Optical Waveguide (liquid-core ARROW) for our work. The ARROW is an ideal platform, which has anti-resonant layers which allow light to be guided in liquids, allowing for particles to easily be manipulated. It is manufactured using standard silicon manufacturing techniques making it easy to produce. The planner design makes it easy to integrate with other technologies. Initially I worked to improve the ARROW chip by reducing the intersection losses and by reducing the fluorescence and background on the ARROW chip. The ARROW chip has already been used to trap and push particles along its channel but here I introduce several new methods of particle trapping and manipulation on the ARROW chip. Traditional two beam traps use two counter propagating beams. A trapping scheme that uses two orthogonal beams which counter to first instinct allow for trapping at their intersection is introduced. This scheme is thoroughly predicted and analyzed using realistic conditions. Simulations of this method were done using a program which looks at both the fluidics and optical sources to model complex situations. These simulations were also used to

Programmable lab-on-a-chip system for single cell analysis

Science.gov (United States)

Thalhammer, S.

2009-05-01

The collection, selection, amplification and detection of minimum genetic samples became a part of everyday life in medical and biological laboratories, to analyze DNA-fragments of pathogens, patient samples and traces on crime scenes. About a decade ago, a handful of researchers began discussing an intriguing idea. Could the equipment needed for everyday chemistry and biology procedures be shrunk to fit on a chip in the size of a fingernail? Miniature devices for, say, analysing DNA and proteins should be faster and cheaper than conventional versions. Lab-on-a-chip is an advanced technology that integrates a microfluidic system on a microscale chip device. The "laboratory" is created by means of channels, mixers, reservoirs, diffusion chambers, integrated electrodes, pumps, valves and more. With lab-ona- chip technology, complete laboratories on a square centimetre can be created. Here, a multifunctional programmable Lab-on-a-Chip driven by nanofluidics and controlled by surface acoustic waves (SAW) is presented. This system combines serial DNA-isolation-, amplification- and array-detection-process on a modified glass-platform. The fluid actuation is controlled via SAW by interdigital transducers implemented in the chemical modified chip surface. The chemical surface modification allows fluid handling in the sub-microliter range. Minute amount of sample material is extracted by laser-based microdissection out of e.g. histological sections at the single cell level. A few picogram of genetic material are isolated and transferred via a low-pressure transfer system (SPATS) onto the chip. Subsequently the genetic material inside single droplets, which behave like "virtual" beaker, is transported to the reaction and analysis centers on the chip surface via surface acoustic waves, mainly known as noise dumping filters in mobile phones. At these "biological reactors" the genetic material is processed, e.g. amplified via polymerase chain reaction methods, and genetically

Dynamic On-Chip micro Temperature and Flow Sensor for miniaturized lab-on-a-chip instruments

Data.gov (United States)

National Aeronautics and Space Administration — The purpose of this project is to design, fabricate, and characterize a Dynamic On-Chip Flow and Temperature Sensor (DOCFlaTS) to mature and enable miniaturized...

Design and Development of a Portable Metal Chip Baler using A System Design Approach

Directory of Open Access Journals (Sweden)

Hassan Mohd Fahrul

2017-01-01

Full Text Available A large amount of metal chips at workplace will result in untidy and unsafe condition thus measurements of safety are needed in some industries, where the metal chips will be collected and put into a container until the volume is sufficient to be recycled. Due to that reason, the metal chips require a lot of spaces for storage before going to recycle. In this study, a portable metal chip baler as a device for compacting those metal chips is presented based on a system approach of engineering design. Basically, the system design evolves through four phases of development that are started from conceptual design, preliminary system design, detail design and development to system test and evaluation. The portable metal chip baler uses current technology such as pneumatic cylinder to compress the metal chips so that the system capable to operate efficiently. The output from this system is the metal chips are compacted into a block shape and a working prototype was developed to prove the concept of the system. As a summary, the conceptual design of portable metal chip baler was proven and was presented using the philosophy of the systems design approach. This tool may assists workers especially in the Small-Medium Enterprise (SME manufacturing industries, school or universities’ workshops for managing metal chips easily and systematically.

Lab-On-a-Chip Application Development (LOCAD): Bridging Technology Readiness for Exploration

Science.gov (United States)

Spearing, Scott F.; Jenkins, Andy

2004-01-01

At Marshall Space Flight Center we have established a capability to investigate the use of microfluidics for space flight. The Lab-On-a-Chip Application Development (LOCAD) team has created a program for advancing Technology Readiness Levels (TRL) of 1 and 2 to TRL 6 and 7, quickly and economically for Lab-On-a-Chip (LOC) applications. Scientists and engineers can utilize LOCAD'S process to efficiently learn about microfluidics and determine if microfluidics is applicable to their needs. Once the applicability has been determined, LOCAD can then perform tests to develop the new fluidic protocols which are different from macro-scale chemical reaction protocols. With this information new micro-fluidic devices can be created and tested. Currently, LOCAD is focused on using microfluidics for both Environmental Monitoring & Control, and Medical Systems. Eventually, handheld portable units utilizing LOC technology will perform rapid tests to determine water quality, and microbial contamination levels. Since LOC technology is drastically reduced in physical size, it thereby reduces power, weight, volume, and sample requirements, a big advantage considering the resource constraints associated with spaceflight. Another one of LOCAD's current activities is the development of a microfluidic system to aid in the search for life on Mars.

Organ-Tumor-on-a-Chip for Chemosensitivity Assay: A Critical Review

Directory of Open Access Journals (Sweden)

Navid Kashaninejad

2016-07-01

Full Text Available With a mortality rate over 580,000 per year, cancer is still one of the leading causes of death worldwide. However, the emerging field of microfluidics can potentially shed light on this puzzling disease. Unique characteristics of microfluidic chips (also known as micro-total analysis system make them excellent candidates for biological applications. The ex vivo approach of tumor-on-a-chip is becoming an indispensable part of personalized medicine and can replace in vivo animal testing as well as conventional in vitro methods. In tumor-on-a-chip, the complex three-dimensional (3D nature of malignant tumor is co-cultured on a microfluidic chip and high throughput screening tools to evaluate the efficacy of anticancer drugs are integrated on the same chip. In this article, we critically review the cutting edge advances in this field and mainly categorize each tumor-on-a-chip work based on its primary organ. Specifically, design, fabrication and characterization of tumor microenvironment; cell culture technique; transferring mechanism of cultured cells into the microchip; concentration gradient generators for drug delivery; in vitro screening assays of drug efficacy; and pros and cons of each microfluidic platform used in the recent literature will be discussed separately for the tumor of following organs: (1 Lung; (2 Bone marrow; (3 Brain; (4 Breast; (5 Urinary system (kidney, bladder and prostate; (6 Intestine; and (7 Liver. By comparing these microchips, we intend to demonstrate the unique design considerations of each tumor-on-a-chip based on primary organ, e.g., how microfluidic platform of lung-tumor-on-a-chip may differ from liver-tumor-on-a-chip. In addition, the importance of heart–liver–intestine co-culture with microvasculature in tumor-on-a-chip devices for in vitro chemosensitivity assay will be discussed. Such system would be able to completely evaluate the absorption, distribution, metabolism, excretion and toxicity (ADMET of

A Time-predictable Memory Network-on-Chip

DEFF Research Database (Denmark)

Schoeberl, Martin; Chong, David VH; Puffitsch, Wolfgang

2014-01-01

To derive safe bounds on worst-case execution times (WCETs), all components of a computer system need to be time-predictable: the processor pipeline, the caches, the memory controller, and memory arbitration on a multicore processor. This paper presents a solution for time-predictable memory...... arbitration and access for chip-multiprocessors. The memory network-on-chip is organized as a tree with time-division multiplexing (TDM) of accesses to the shared memory. The TDM based arbitration completely decouples processor cores and allows WCET analysis of the memory accesses on individual cores without...

Biomechanical Strain Exacerbates Inflammation on a Progeria-on-a-Chip Model

NARCIS (Netherlands)

Ribas, J.; Zhang, Y.S.; Pitrez, P.R.; Leijten, Jeroen Christianus Hermanus; Miscuglio, M.; Rouwkema, Jeroen; Dokmeci, M.R.; Nissan, X.; Ferreira, L.; Khademhosseini, A.

2017-01-01

A progeria-on-a-chip model is engineered to recapitulate the biomechanical dynamics of vascular disease and aging. The model shows an exacerbated injury response to strain and is rescued by pharmacological treatments. The progeria-on-a-chip is expected to drive the discovery of new drugs and to

Crosstalk in modern on-chip interconnects a FDTD approach

CERN Document Server

Kaushik, B K; Patnaik, Amalendu

2016-01-01

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

Modelling the clamping force distribution among chips in press-pack IGBTs using the finite element method

DEFF Research Database (Denmark)

Hasmasan, Adrian Augustin; Busca, Christian; Teodorescu, Remus

2012-01-01

In this paper, a FEM (finite element method) based mechanical model for PP (press-pack) IGBTs (insulated gate bipolar transistors) is presented, which can be used to calculate the clamping force distribution among chips under various clamping conditions. The clamping force is an important parameter...... for the chip, because it influences contact electrical resistance, contact thermal resistance and power cycling capability. Ideally, the clamping force should be equally distributed among chips, in order to maximize the reliability of the PP IGBT. The model is built around a hypothetical PP IGBT with 9 chips......, and it has numerous simplifications in order to reduce the simulation time as much as possible. The developed model is used to analyze the clamping force distribution among chips, in various study cases, where uniform and non-uniform clamping pressures are applied on the studied PP IGBT....

Photonics-on-a-chip: recent advances in integrated waveguides as enabling detection elements for real-world, lab-on-a-chip biosensing applications.

Science.gov (United States)

Washburn, Adam L; Bailey, Ryan C

2011-01-21

By leveraging advances in semiconductor microfabrication technologies, chip-integrated optical biosensors are poised to make an impact as scalable and multiplexable bioanalytical measurement tools for lab-on-a-chip applications. In particular, waveguide-based optical sensing technology appears to be exceptionally amenable to chip integration and miniaturization, and, as a result, the recent literature is replete with examples of chip-integrated waveguide sensing platforms developed to address a wide range of contemporary analytical challenges. As an overview of the most recent advances within this dynamic field, this review highlights work from the last 2-3 years in the areas of grating-coupled, interferometric, photonic crystal, and microresonator waveguide sensors. With a focus towards device integration, particular emphasis is placed on demonstrations of biosensing using these technologies within microfluidically controlled environments. In addition, examples of multiplexed detection and sensing within complex matrices--important features for real-world applicability--are given special attention.

Towards autonomous lab-on-a-chip devices for cell phone biosensing.

Science.gov (United States)

Comina, Germán; Suska, Anke; Filippini, Daniel

2016-03-15

Modern cell phones are a ubiquitous resource with a residual capacity to accommodate chemical sensing and biosensing capabilities. From the different approaches explored to capitalize on such resource, the use of autonomous disposable lab-on-a-chip (LOC) devices-conceived as only accessories to complement cell phones-underscores the possibility to entirely retain cell phones' ubiquity for distributed biosensing. The technology and principles exploited for autonomous LOC devices are here selected and reviewed focusing on their potential to serve cell phone readout configurations. Together with this requirement, the central aspects of cell phones' resources that determine their potential for analytical detection are examined. The conversion of these LOC concepts into universal architectures that are readable on unaccessorized phones is discussed within this context. Copyright © 2015 Elsevier B.V. All rights reserved.

Improved color metrics in solid-state lighting via utilization of on-chip quantum dots

Science.gov (United States)

Mangum, Benjamin D.; Landes, Tiemo S.; Theobald, Brian R.; Kurtin, Juanita N.

2017-02-01

While Quantum Dots (QDs) have found commercial success in display applications, there are currently no widely available solid state lighting products making use of QD nanotechnology. In order to have real-world success in today's lighting market, QDs must be capable of being placed in on-chip configurations, as remote phosphor configurations are typically much more expensive. Here we demonstrate solid-state lighting devices made with on-chip QDs. These devices show robust reliability under both dry and wet high stress conditions. High color quality lighting metrics can easily be achieved using these narrow, tunable QD downconverters: CRI values of Ra > 90 as well as R9 values > 80 are readily available when combining QDs with green phosphors. Furthermore, we show that QDs afford a 15% increase in overall efficiency compared to traditional phosphor downconverted SSL devices. The fundamental limit of QD linewidth is examined through single particle QD emission studies. Using standard Cd-based QD synthesis, it is found that single particle linewidths of 20 nm FWHM represent a lower limit to the narrowness of QD emission in the near term.

On-chip dual comb source for spectroscopy

OpenAIRE

Dutt, Avik; Joshi, Chaitanya; Ji, Xingchen; Cardenas, Jaime; Okawachi, Yoshitomo; Luke, Kevin; Gaeta, Alexander L.; Lipson, Michal

2016-01-01

Dual-comb spectroscopy is a powerful technique for real-time, broadband optical sampling of molecular spectra which requires no moving components. Recent developments with microresonator-based platforms have enabled frequency combs at the chip scale. However, the need to precisely match the resonance wavelengths of distinct high-quality-factor microcavities has hindered the development of an on-chip dual comb source. Here, we report the first simultaneous generation of two microresonator comb...

Reliability, Availability and Serviceability of Networks-on-Chip

CERN Document Server

Cota, Érika; Soares Lubaszewski, Marcelo

2012-01-01

This book presents an overview of the issues related to the test, diagnosis and fault-tolerance of Network on Chip-based systems. It is the first book dedicated to the quality aspects of NoC-based systems and will serve as an invaluable reference to the problems, challenges, solutions, and trade-offs related to designing and implementing state-of-the-art, on-chip communication architectures.

Unlimited cooling capacity of the passive-type emergency core cooling system of the MARS reactor

International Nuclear Information System (INIS)

Bandini, G.; Caira, M.; Naviglio, A.; Sorabella, L.

1995-01-01

The MARS nuclear plant is equipped with a 600 MWth PWR type nuclear steam supply system, with completely innovative engineered core safeguards. The most relevant innovative safety system of this plant is its Emergency Core Cooling System, which is completely passive (with only one non static component). The Emergency Core Cooling System (ECCS) of the MARS reactor is natural-circulation, passive-type, and its intervention follows a core flow decrease, whatever was the cause. The operation of the system is based on a cascade of three fluid systems, functionally interfacing through heat exchangers; the first fluid system is connected to the reactor vessel and the last one includes an atmospheric-pressure condenser, cooled by external air. The infinite thermal capacity of the final heat sink provides the system an unlimited autonomy. The capability and operability of the system are based on its integrity and on the integrity of the primary coolant boundary (both of them are permanently enclosed in a pressurized containment; 100% redundancy is also foreseen) and on the operation of only one non static component (a check valve), with 400% redundancy. In the paper, all main thermal hydraulic transients occurring as a consequence of postulated accidents are analysed, to verify the capability of the passive-type ECCS to intervene always in time, without causing undue conditions of reduced coolability of the core (DNB, etc.), and to verify its capability to guarantee a long-term (indefinite) coolability of the core without the need of any external intervention. (author)

Augmented cooling vest system subassembly: Design and analysis

International Nuclear Information System (INIS)

D’Angelo, Maurissa; D’Angelo, Joseph; Almajali, Mohammad; Lafdi, Khalid; Delort, Antoine; Elmansori, Mohamed

2014-01-01

Highlights: • Thermoelectric cooler (TEC) was employed to provide cooling air to cooling vest. • Aluminum cooling fins were used to exchange heat for hot and cold sides of TEC. • Performance of the system was determined and the experimental technique was described. • Heat sink is capable to remove additional heat and heat exchanger provides cooling air. • Future work is proposed to optimize the efficiency of the system. - Abstract: A prototype cooling engine consisting of thermoelectric coolers (TECs) was developed and designed. In this prototype, aluminum cooling fins were employed as the heat exchange method for both the hot and cold sides of the TEC. Aluminum fins were used to cool the ambient air through a heat exchanger and dissipate heat build up from the heat sink. This system was modeled and performance capabilities were determined. The experimental technique used to monitor parameters affecting the efficiency of the designed system was described. These parameters include the temperatures of the inlets and outlets of both heat exchanger and heat sink and the flow rate of the cooled air. The experiment was run under three input DC powers; 15 V, 18 V, and 21 V. As the power increased, both the flow rate and the temperature difference between the hot and cold side of thermoelectric cooler increased, demonstrating the heat sink capability to remove the additional heat. However, the temperature difference between the inlet and outlet of the heat exchanger decreases as the power increase. The findings demonstrated the effectiveness of this cooling system and future work is proposed to optimize the heat

Studies for an upgrade of ALICE Inner Tracking System: Pixel chip characterization

Directory of Open Access Journals (Sweden)

Park Jonghan

2017-01-01

Full Text Available Inner Tracking System (ITS of ALICE is used for vertex determination and tracking. Future heavy-ion program at the LHC aims to run with high luminosity. To address this challenge, upgrade program of ITS is underway, which aims at better position resolution (factor of 3, high detection efficiency (>99%, high-rate readout capabilities (100 kHz for Pb-Pb and moderate radiation hardness (> 700 krad. The new ITS will be composed with 7 layers of silicon pixel chip based on Monolithic Active Pixel Sensor (MAPS technology. The characterization test of various version of prototype chips at different phases of development has been performed. This contribution will provide the main characterization results obtained from the measurements performed at laboratories and using test beam for finalizing the pixel chip specification.

GaN-based integrated photonics chip with suspended LED and waveguide

Science.gov (United States)

Li, Xin; Wang, Yongjin; Hane, Kazuhiro; Shi, Zheng; Yan, Jiang

2018-05-01

We propose a GaN-based integrated photonics chip with suspended LED and straight waveguide with different geometric parameters. The integrated photonics chip is prepared by double-side process. Light transmission performance of the integrated chip verse current is quantitatively analyzed by capturing light transmitted to waveguide tip and BPM (beam propagation method) simulation. Reduction of the waveguide width from 8 μm to 4 μm results in an over linear reduction of the light output power while a doubling of the length from 250 μm to 500 μm only results in under linear decrease of the output power. Free-space data transmission with 80 Mbps random binary sequence of the integrated chip is capable of achieving high speed data transmission via visible light. This study provides a potential approach for GaN-based integrated photonics chip as micro light source and passive optical device in VLC (visible light communication).

Anti-seismic air condition's cooling capability increase of the second control area

International Nuclear Information System (INIS)

Pan Qiang

2008-01-01

Secondary area (SCA) air-conditioning system is an important ventilation system in plant. It should achieve the indoor temperature controllable. To resolve the problem of cooling capacity insufficiency, on the basis of ventilation and refrigeration theory, the thesis analyzes the design modification plan. (author)

On-chip enucleation of an oocyte by untethered microrobots

International Nuclear Information System (INIS)

Ichikawa, Akihiko; Sakuma, Shinya; Sugita, Masakuni; Shoda, Tatsuro; Tamakoshi, Takahiro; Arai, Fumihito; Akagi, Satoshi

2014-01-01

We propose a novel on-chip enucleation of an oocyte with zona pellucida by using a combination of untethered microrobots. To achieve enucleation within the closed space of a microfluidic chip, two microrobots, a microknife and a microgripper were integrated into the microfluidic chip. These microrobots were actuated by an external magnetic force produced by permanent magnets placed on the robotic stage. The tip of the microknife was designed by considering the biological geometric feature of an oocyte, i.e. the oocyte has a polar body in maturation stage II. Moreover, the microknife was fabricated by using grayscale lithography, which allows fabrication of three-dimensional microstructures. The microgripper has a gripping function that is independent of the driving mechanism. On-chip enucleation was demonstrated, and the enucleated oocytes are spherical, indicating that the cell membrane of the oocytes remained intact. To confirm successful enucleation using this method, we investigated the viability of oocytes after enucleation. The results show that the production rate, i.e. the ratio between the number of oocytes that reach the blastocyst stage and the number of bovine oocytes after nucleus transfer, is 100%. The technique will contribute to complex cell manipulation such as cell surgery in lab-on-a-chip devices. (paper)

Integration of microelectronic chips in microfluidic systems on printed circuit board

International Nuclear Information System (INIS)

Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

2012-01-01

A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

Effects of debris generated by chemical reactions on head loss through emergency-core cooling-system strainers

International Nuclear Information System (INIS)

Howe, K.; Ghosh, A.; Maji, A.K.; Letellier, B.C.; Johns, R.; Chang, T.Y.

2004-01-01

The effect of debris generated during a loss of coolant accident (LOCA) on the emergency core cooling system (ECCS) strainers has been studied via numerous avenues over the last several years. The research described in this manuscript examines the generation and effect of secondary materials -- not debris generated in the LOCA itself, but materials created by chemical reactions between exposed surfaces/debris and cooling system water. The secondary materials studied in the research were corrosion products from exposed metallic surfaces and paint chips that may precipitate out of solution, with a focus on the corrosion products of aluminium, iron, and zinc. The processes of corrosion and leaching of metals with subsequent precipitation is important because: (1) the surface area of exposed metal inside containment represents a large potential source term, even for slow chemical reactions; the chemical composition of the cooling system water (boric acid, lithium, etc.) may affect corrosion or precipitation in ways that have not been studied thoroughly in the past; and (3) an eyewitness report of the presence of gelatinous material in the Three Mile Island containment pool after the 1979 accident suggests the formation of a secondary material that has not been examined under the generic safety issue (GSI)-191 research program. This research was limited in scope and consisted only of small-scale tests. Several key questions were investigated: (1) do credible corrosion mechanisms exist for leaching metal ions from bulk solid surfaces or from zinc-based paint chips, and if so, what are the typical rate constants? (2) can corrosion products accumulate in the containment pool water to the extent that they might precipitate as new chemical species at pH and temperatures levels that are relevant to the LOCA accident sequence? and (3) how do chemical precipitants affect the head loss across an existing fibrous debris bed? A full report of the research is available. (authors)

El sonido de Atari: identidad sonora en los primeros chips de sonido programables

Directory of Open Access Journals (Sweden)

Pau Damià Riera Muñoz

2018-05-01

Full Text Available The sound identity of the first video games was defined by its sound chips, responsible for the music and sound effects in each platform. At the beginning of the industry, the sound of these chips followed a pattern, marked by the mass production of electronic components. These chips, in general, sounded very similar to each other, due largely to the fact that they worked with the same number of voices and identical waveforms. Soon, certain companies, such as Atari, would start producing their own sound chips and modules in order to improve the sound capabilities of their machines, thus dealing with the technological limitations of the time and finding their own sound identity.

High-performance, scalable optical network-on-chip architectures

Science.gov (United States)

Tan, Xianfang

The rapid advance of technology enables a large number of processing cores to be integrated into a single chip which is called a Chip Multiprocessor (CMP) or a Multiprocessor System-on-Chip (MPSoC) design. The on-chip interconnection network, which is the communication infrastructure for these processing cores, plays a central role in a many-core system. With the continuously increasing complexity of many-core systems, traditional metallic wired electronic networks-on-chip (NoC) became a bottleneck because of the unbearable latency in data transmission and extremely high energy consumption on chip. Optical networks-on-chip (ONoC) has been proposed as a promising alternative paradigm for electronic NoC with the benefits of optical signaling communication such as extremely high bandwidth, negligible latency, and low power consumption. This dissertation focus on the design of high-performance and scalable ONoC architectures and the contributions are highlighted as follow: 1. A micro-ring resonator (MRR)-based Generic Wavelength-routed Optical Router (GWOR) is proposed. A method for developing any sized GWOR is introduced. GWOR is a scalable non-blocking ONoC architecture with simple structure, low cost and high power efficiency compared to existing ONoC designs. 2. To expand the bandwidth and improve the fault tolerance of the GWOR, a redundant GWOR architecture is designed by cascading different type of GWORs into one network. 3. The redundant GWOR built with MRR-based comb switches is proposed. Comb switches can expand the bandwidth while keep the topology of GWOR unchanged by replacing the general MRRs with comb switches. 4. A butterfly fat tree (BFT)-based hybrid optoelectronic NoC (HONoC) architecture is developed in which GWORs are used for global communication and electronic routers are used for local communication. The proposed HONoC uses less numbers of electronic routers and links than its counterpart of electronic BFT-based NoC. It takes the advantages of

On-chip microsystems in silicon: opportunities and limitations

Science.gov (United States)

Wolffenbuttel, R. F.

1996-03-01

Integrated on-chip micro-instrumentation systems in silicon are complete data acquisition systems on a single chip. This concept has appeared to be the ultimate solution in many applications, as it enables in principle the metamorphosis of a basic sensing element, affected with many shortcomings, into an on-chip data acquisition unit that provides an output digital data stream in a standard format not corrupted by sensor non-idealities. Market acceptance would be maximum, as no special knowledge about the internal operation is required, self-test and self-calibration can be included and the dimensions are not different from those of the integrated circuit. The various aspects that are relevant in estimating the constraints for successful implementation of the integrated silicon smart sensor will be outlined in comparison with the properties of more conventional sensor fabrication technologies. It will be shown that the acceptance of on-chip functional integration in an application depends primarily on the added value in terms of improved specification or functionality that the resulting device provides in that application. The economic viability is therefore decisive rather than the technological constraints. This is in contrast to the traditional technology push prevailing in sensor research over market pull mechanisms.

Influence of cooling rate on residual stress profile in veneering ceramic: measurement by hole-drilling.

Science.gov (United States)

Mainjot, Amélie K; Schajer, Gary S; Vanheusden, Alain J; Sadoun, Michaël J

2011-09-01

The manufacture of dental crowns and bridges generates residual stresses within the veneering ceramic and framework during the cooling process. Residual stress is an important factor that control the mechanical behavior of restorations. Knowing the stress distribution within the veneering ceramic as a function of depth can help the understanding of failures, particularly chipping, a well-known problem with Yttria-tetragonal-zirconia-polycrystal based fixed partial dentures. The objective of this study is to investigate the cooling rate dependence of the stress profile in veneering ceramic layered on metal and zirconia frameworks. The hole-drilling method, often used for engineering measurements, was adapted for use with veneering ceramic. The stress profile was measured in bilayered disc samples 20 mm in diameter, with a 0.7 mm thick metal or Yttria-tetragonal-zirconia-polycrystal framework and a 1.5mm thick veneering ceramic. Three different cooling procedures were investigated. The magnitude of the stresses in the surface of the veneering ceramic was found to increase with cooling rate, while the interior stresses decreased. At the surface, compressive stresses were observed in all samples. In the interior, compressive stresses were observed in metal samples and tensile in zirconia samples. Cooling rate influences the magnitude of residual stresses. These can significantly influence the mechanical behavior of metal-and zirconia-based bilayered systems. The framework material influenced the nature of the interior stresses, with zirconia samples showing a less favorable stress profile than metal. Copyright © 2011 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

Man-portable personal cooling garment based on vacuum desiccant cooling

International Nuclear Information System (INIS)

Yang Yifan; Stapleton, Jill; Diagne, Barbara Thiané; Kenny, Glen P.; Lan, Christopher Q.

2012-01-01

A man-portable personal cooling garment based on the concept of vacuum desiccant cooling (VDC) was developed. It was demonstrated with cooling pads that a cooling capacity of 373.1 W/m 2 could be achieved in an ambient environment of 37 °C. Tests with human subjects wearing prototype cooling garments consisting of 12 VDC pads with an overall weight of 3.4 kg covering 0.4 m 2 body surface indicate that the garment could maintain a core temperature substantially lower than the control when the workload was walking on a treadmill of 2% inclination at 3 mph. The exercise was carried out in an environment of 40 °C and 50% relative humidity (RH) for 60 min. Tests also showed that the VDC garment could effectively reduce the metabolic heat accumulation in body with subject wearing heavily insulated nuclear, biological and chemical (NBC) suit working in the heat and allow the participant to work safely for 60 min, almost doubling the safe working time of the same participant when he wore NBC suit only. - Highlights: ► Heat stress mitigation is important for workers health, safety, and performance. ► Vacuum desiccant cooling (VDC) a novel concept for personal cooling. ► VDC garment man-portable and more efficient than commercial ice/pad vest. ► VDC garment suitable for personal cooling with NBC suit.

Combining nanocalorimetry and dynamic transmission electron microscopy for in situ characterization of materials processes under rapid heating and cooling

Energy Technology Data Exchange (ETDEWEB)

Grapes, Michael D., E-mail: mgrapes1@jhu.edu [Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218 (United States); Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 (United States); LaGrange, Thomas; Reed, Bryan W.; Campbell, Geoffrey H. [Condensed Matter and Materials Division, Lawrence Livermore National Laboratory, Livermore, California 94550 (United States); Friedman, Lawrence H.; LaVan, David A., E-mail: david.lavan@nist.gov [Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 (United States); Weihs, Timothy P., E-mail: weihs@jhu.edu [Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218 (United States)

2014-08-15

Nanocalorimetry is a chip-based thermal analysis technique capable of analyzing endothermic and exothermic reactions at very high heating and cooling rates. Here, we couple a nanocalorimeter with an extremely fast in situ microstructural characterization tool to identify the physical origin of rapid enthalpic signals. More specifically, we describe the development of a system to enable in situ nanocalorimetry experiments in the dynamic transmission electron microscope (DTEM), a time-resolved TEM capable of generating images and electron diffraction patterns with exposure times of 30 ns–500 ns. The full experimental system consists of a modified nanocalorimeter sensor, a custom-built in situ nanocalorimetry holder, a data acquisition system, and the DTEM itself, and is capable of thermodynamic and microstructural characterization of reactions over a range of heating rates (10{sup 2} K/s–10{sup 5} K/s) accessible by conventional (DC) nanocalorimetry. To establish its ability to capture synchronized calorimetric and microstructural data during rapid transformations, this work describes measurements on the melting of an aluminum thin film. We were able to identify the phase transformation in both the nanocalorimetry traces and in electron diffraction patterns taken by the DTEM. Potential applications for the newly developed system are described and future system improvements are discussed.

On-chip dual-comb source for spectroscopy.

Science.gov (United States)

Dutt, Avik; Joshi, Chaitanya; Ji, Xingchen; Cardenas, Jaime; Okawachi, Yoshitomo; Luke, Kevin; Gaeta, Alexander L; Lipson, Michal

2018-03-01

Dual-comb spectroscopy is a powerful technique for real-time, broadband optical sampling of molecular spectra, which requires no moving components. Recent developments with microresonator-based platforms have enabled frequency combs at the chip scale. However, the need to precisely match the resonance wavelengths of distinct high quality-factor microcavities has hindered the development of on-chip dual combs. We report the simultaneous generation of two microresonator combs on the same chip from a single laser, drastically reducing experimental complexity. We demonstrate broadband optical spectra spanning 51 THz and low-noise operation of both combs by deterministically tuning into soliton mode-locked states using integrated microheaters, resulting in narrow (lasers or microwave oscillators. We demonstrate high signal-to-noise ratio absorption spectroscopy spanning 170 nm using the dual-comb source over a 20-μs acquisition time. Our device paves the way for compact and robust spectrometers at nanosecond time scales enabled by large beat-note spacings (>1 GHz).

Efficient On-chip Optical Microresonator for Optical Comb Generation: Design and Fabrication

Science.gov (United States)

Han, Kyunghun

An optical frequency comb is a series of equally spaced frequency components. It has gained much attention since Nobel physics prize was awarded John L. Hall and Theodor W. Hansch for their contribution to the optical frequency comb technique in 2005. The optical frequency comb has been extensively studied because of its precision as a tool for spectroscopy, and is now widely used in bio- and chemical sensors, optical clocks, mode-locked dark pulse generation, soliton generation, and optical communication. Recently, thanks to the developments in nanotechnology, the optical frequency comb generation is made possible at a chip-scale level with microresonators. However, because the threshold power of the optical frequency comb generation is beyond the capability of the on-chip laser source, efficient microresonator is required. Here, we demonstrate an ultra-compact and highly efficient strip-slot direct mode coupler, aiming to achieve slotted silicon microresonator cladded with nonlinear polymer Poly-DDMEBT in SOI platform. As an application of the strip-slot direct mode coupling, a double slot fiber-to-chip edge coupler is demonstrated showing 2 dB insertion loss reduction compared to the conventional single tip edge coupler. For silicon nitride platform, we investigated evanescent wave coupling of microresonator, focusing on bus waveguide geometry optimization. The optimized waveguide width offers an efficient excitation of a fundamental mode in the resonator waveguide. This investigation can benefit low threshold comb generation by enhancing the extinction ratio. We experimentally demonstrated the high Q-factor micro-ring resonator with intrinsic Q of 12.6 million as well as the single FSR comb generation with 63 mW.

MHTGR inherent heat transfer capability

International Nuclear Information System (INIS)

Berkoe, J.M.

1992-01-01

This paper reports on the Commercial Modular High Temperature Gas-Cooled Reactor (MHTGR) which achieves improved reactor safety performance and reliability by utilizing a completely passive natural convection cooling system called the RCCS to remove decay heat in the event that all active cooling systems fail to operate. For the highly improbable condition that the RCCS were to become non-functional following a reactor depressurization event, the plant would be forced to rely upon its inherent thermo-physical characteristics to reject decay heat to the surrounding earth and ambient environment. A computational heat transfer model was created to simulate such a scenario. Plant component temperature histories were computed over a period of 20 days into the event. The results clearly demonstrate the capability of the MHTGR to maintain core integrity and provide substantial lead time for taking corrective measures

A Spacecraft Housekeeping System-on-Chip in a Radiation Hardened Structured ASIC

Science.gov (United States)

Suarez, George; DuMonthier, Jeffrey J.; Sheikh, Salman S.; Powell, Wesley A.; King, Robyn L.

2012-01-01

Housekeeping systems are essential to health monitoring of spacecraft and instruments. Typically, sensors are distributed across various sub-systems and data is collected using components such as analog-to-digital converters, analog multiplexers and amplifiers. In most cases programmable devices are used to implement the data acquisition control and storage, and the interface to higher level systems. Such discrete implementations require additional size, weight, power and interconnect complexity versus an integrated circuit solution, as well as the qualification of multiple parts. Although commercial devices are readily available, they are not suitable for space applications due the radiation tolerance and qualification requirements. The Housekeeping System-o n-A-Chip (HKSOC) is a low power, radiation hardened integrated solution suitable for spacecraft and instrument control and data collection. A prototype has been designed and includes a wide variety of functions including a 16-channel analog front-end for driving and reading sensors, analog-to-digital and digital-to-analog converters, on-chip temperature sensor, power supply current sense circuits, general purpose comparators and amplifiers, a 32-bit processor, digital I/O, pulse-width modulation (PWM) generators, timers and I2C master and slave serial interfaces. In addition, the device can operate in a bypass mode where the processor is disabled and external logic is used to control the analog and mixed signal functions. The device is suitable for stand-alone or distributed systems where multiple chips can be deployed across different sub-systems as intelligent nodes with computing and processing capabilities.

Digital Power Consumption Estimations for CHIPIX65 Pixel Readout Chip

CERN Document Server

Marcotulli, Andrea

2016-01-01

New hybrid pixel detectors with improved resolution capable of dealing with hit rates up to 3 GHz/cm2 will be required for future High Energy Physics experiments in the Large Hadron Collider (LHC) at CERN. Given this, the RD53 collaboration works on the design of the next generation pixel readout chip needed for both the ATLAS and CMS detector phase 2 pixel upgrades. For the RD53 demonstrator chip in 65nm CMOS technology, different architectures are considered. In particular the purpose of this work is estimating the power consumption of the digital architecture of the readout ASIC developed by CHIPIX65 project of the INFN National Scientific Committee. This has been done with modern chip design tools integrated with the VEPIX53 simulation framework that has been developed within the RD53 collaboration in order to assess the performance of the system in very high rate, high energy physics experiments.

STUDY OF CHIP IGNITION AND CHIP MORPHOLOGY AFTER MILLING OF MAGNESIUM ALLOYS

Directory of Open Access Journals (Sweden)

Ireneusz Zagórski

2016-12-01

Full Text Available The paper analyses the impact of specified technological parameters of milling (vc, fz, ap on time to ignition. Stages leading to chip ignition were analysed. Metallographic images of magnesium chip were presented. No significant difference was observed in time to ignition in different chip fractions. Moreover, the surface of chips was free of products of ignition and signs of strong oxidation.

Architectures for single-chip image computing

Science.gov (United States)

Gove, Robert J.

1992-04-01

This paper will focus on the architectures of VLSI programmable processing components for image computing applications. TI, the maker of industry-leading RISC, DSP, and graphics components, has developed an architecture for a new-generation of image processors capable of implementing a plurality of image, graphics, video, and audio computing functions. We will show that the use of a single-chip heterogeneous MIMD parallel architecture best suits this class of processors--those which will dominate the desktop multimedia, document imaging, computer graphics, and visualization systems of this decade.

Building blocks for a polarimeter-on-a-chip

International Nuclear Information System (INIS)

Stevenson, Thomas R.; Hsieh, W.-T.; Schneider, Gideon; Travers, Douglas; Cao, Nga; Wollack, Edward; Limon, Michele; Kogut, Alan

2006-01-01

For the 'Primordial Anisotropy Polarization Pathfinder Array (PAPPA)' balloon flight project, we have designed and made thin-film niobium microstrip circuits as building blocks for a 'polarimeter-on-a-chip' in which superconducting transmission lines are used to couple millimeter wave signals from planar antennas to superconducting transition edge sensor (TES) detectors. Our goal is to demonstrate technology for precision measurements of the polarization of the cosmic microwave background. To enable characterization and verification of our microstrip components, we have incorporated waveguide probes on each chip that can bring millimeter wave signals from a room temperature vector network analyzer to the superconducting circuits on the chip and back again for S-parameter measurements. We have designed a planar antenna and RF choke on the probes to efficiently couple radiation between waveguide and thin-film microstrip. To support the probe antennas in waveguides, we sculpted thin silicon cantilevers that extend from an edge of each silicon chip into a pair of waveguides within a specially designed split-block mount. This technique will allow us to make calibrated measurements at low temperatures of the velocity, impedance, and loss properties of our niobium transmission lines, the frequency response of microstrip filters, hybrid couplers, or terminations, and the performance of integrated detectors

Lab-on-a-chip platform for high throughput drug discovery with DNA-encoded chemical libraries

Science.gov (United States)

Grünzner, S.; Reddavide, F. V.; Steinfelder, C.; Cui, M.; Busek, M.; Klotzbach, U.; Zhang, Y.; Sonntag, F.

2017-02-01

The fast development of DNA-encoded chemical libraries (DECL) in the past 10 years has received great attention from pharmaceutical industries. It applies the selection approach for small molecular drug discovery. Because of the limited choices of DNA-compatible chemical reactions, most DNA-encoded chemical libraries have a narrow structural diversity and low synthetic yield. There is also a poor correlation between the ranking of compounds resulted from analyzing the sequencing data and the affinity measured through biochemical assays. By combining DECL with dynamical chemical library, the resulting DNA-encoded dynamic library (EDCCL) explores the thermodynamic equilibrium of reversible reactions as well as the advantages of DNA encoded compounds for manipulation/detection, thus leads to enhanced signal-to-noise ratio of the selection process and higher library quality. However, the library dynamics are caused by the weak interactions between the DNA strands, which also result in relatively low affinity of the bidentate interaction, as compared to a stable DNA duplex. To take advantage of both stably assembled dual-pharmacophore libraries and EDCCLs, we extended the concept of EDCCLs to heat-induced EDCCLs (hi-EDCCLs), in which the heat-induced recombination process of stable DNA duplexes and affinity capture are carried out separately. To replace the extremely laborious and repetitive manual process, a fully automated device will facilitate the use of DECL in drug discovery. Herein we describe a novel lab-on-a-chip platform for high throughput drug discovery with hi-EDCCL. A microfluidic system with integrated actuation was designed which is able to provide a continuous sample circulation by reducing the volume to a minimum. It consists of a cooled and a heated chamber for constant circulation. The system is capable to generate stable temperatures above 75 °C in the heated chamber to melt the double strands of the DNA and less than 15 °C in the cooled chamber

Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging.

Science.gov (United States)

Gurun, Gokce; Tekes, Coskun; Zahorian, Jaime; Xu, Toby; Satir, Sarp; Karaman, Mustafa; Hasler, Jennifer; Degertekin, F Levent

2014-02-01

Intravascular ultrasound (IVUS) and intracardiac echography (ICE) catheters with real-time volumetric ultrasound imaging capability can provide unique benefits to many interventional procedures used in the diagnosis and treatment of coronary and structural heart diseases. Integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with front-end electronics in single-chip configuration allows for implementation of such catheter probes with reduced interconnect complexity, miniaturization, and high mechanical flexibility. We implemented a single-chip forward-looking (FL) ultrasound imaging system by fabricating a 1.4-mm-diameter dual-ring CMUT array using CMUT-on-CMOS technology on a front-end IC implemented in 0.35-μm CMOS process. The dual-ring array has 56 transmit elements and 48 receive elements on two separate concentric annular rings. The IC incorporates a 25-V pulser for each transmitter and a low-noise capacitive transimpedance amplifier (TIA) for each receiver, along with digital control and smart power management. The final shape of the silicon chip is a 1.5-mm-diameter donut with a 430-μm center hole for a guide wire. The overall front-end system requires only 13 external connections and provides 4 parallel RF outputs while consuming an average power of 20 mW. We measured RF A-scans from the integrated single- chip array which show full functionality at 20.1 MHz with 43% fractional bandwidth. We also tested and demonstrated the image quality of the system on a wire phantom and an ex vivo chicken heart sample. The measured axial and lateral point resolutions are 92 μm and 251 μm, respectively. We successfully acquired volumetric imaging data from the ex vivo chicken heart at 60 frames per second without any signal averaging. These demonstrative results indicate that single-chip CMUT-on-CMOS systems have the potential to produce realtime volumetric images with image quality and speed suitable for catheter-based clinical applications.

Theoretical investigations on improving performance of cooling systems for fuel cell vehicles; Theoretische Untersuchungen zur Kuehlleistungssteigerung durch innovative Kuehlsysteme fuer Brennstoffzellen-Elektrofahrzeuge

Energy Technology Data Exchange (ETDEWEB)

Reichler, Mark

2008-04-01

In this work theoretical investigations are carried out for cooling systems, which are used in fuel cell vehicles. This work focuses mainly on the capability of increasing the heat rejection rate by using new alternative cooling systems and by improving the conventional cooling system. Fuel cell vehicles have a higher demand of heat rejection to the ambient than comparable vehicles with combustion engine. The performance of conventional liquid cooling systems, especially at high loads and high ambient temperatures, is often not sufficient anymore. Hence, cooling systems with improved performance are necessary for fuel cell vehicles. The investigations in this work are based on DaimlerChrysler's ''A-Class'' having a PEM-Fuel Cell system integrated. Specific computational models are developed for radiators and condensers to evaluate the performance of different cooling concepts. The models are validated with experimental data. Based on an intensive investigation in the open literature the state of the art of cooling systems for fuel cell vehicles is depicted. Furthermore new cooling concepts as an alternative to the liquid cooling system are presented. The method of cooling the fuel cell by using two-phase transition shows the greatest capability to increase the cooling performance. Hence, this concept is investigated in detail. Two different concepts with three different refrigerants (R113, R245fa und R236fa) are analyzed. Cooling performance of this concept shows improvement of 18.2 up to 32.6 % compared to the conventional liquid cooling system. Thus, a two phase cooling system represents an alternative cooling system for fuel cell vehicles, which should be closer investigated by experiments. (orig.)

A Single-Chip CMOS Pulse Oximeter with On-Chip Lock-In Detection

OpenAIRE

Diwei He; Stephen P. Morgan; Dimitrios Trachanis; Jan van Hese; Dimitris Drogoudis; Franco Fummi; Francesco Stefanni; Valerio Guarnieri; Barrie R. Hayes-Gill

2015-01-01

Pulse oximetry is a noninvasive and continuous method for monitoring the blood oxygen saturation level. This paper presents the design and testing of a single-chip pulse oximeter fabricated in a 0.35 ?m CMOS process. The chip includes photodiode, transimpedance amplifier, analogue band-pass filters, analogue-to-digital converters, digital signal processor and LED timing control. The experimentally measured AC and DC characteristics of individual circuits including the DC output voltage of the...

Evaluation of a Design Concept for the Combined Air-water Passive Cooling PAFS+

International Nuclear Information System (INIS)

Bae, Sung Won; Kwon, Taesoon

2014-01-01

The APR+ system provides the Passive Auxiliary Feed-water System (PAFS) for the passive cooling capability. However, the current design requirement for working time for the PAFS is about 8 hours only. Thus, current working time of PAFS can not meet the required 72 hours cooling capability for the long term SBO situation. To meet the 72 hours cooling, the pool capacity should be almost 3∼4 times larger than that of current water cooling tank. In order to continue the PAFS operation for 72 hours, a new passive air-water combined cooling system is proposed. This paper provides the feasibility study on the combined passive air-water cooling system. Figure 1 and 2 show the conceptual difference of the PAFS and combined passive air-water cooling system, respectively. Simple performance evaluation of the passive air cooling heat exchanger has been conducted by the MARS calculation. For the postulated FLB scenario, 4800 heat exchanger tubes and 5 m/s air velocity are not sufficient to sustain the PCCT pool level for 72 hour cooling. Further works on the system design and performance enhancing plan are required to fulfill the 72 hours long term passive cooling

Pipeline template for streaming applications on heterogeneous chips

OpenAIRE

Rodríguez, Andrés; Navarro, Ángeles; Asenjo-Plaza, Rafael; Corbera, Francisco; Vilches, Antonio; Garzarán, María

2015-01-01

We address the problem of providing support for executing single streaming applications implemented as a pipeline of stages that run on heterogeneous chips comprised of several cores and one on-chip GPU. In this paper, we mainly focus on the API that allows the user to specify the type of parallelism exploited by each pipeline stage running on the multicore CPU, the mapping of the pipeline stages to the devices (GPU or CPU), and the number of active threads. We use a rea...

The Impact Of Surface Shape Of Chip-Breaker On Machined Surface

Science.gov (United States)

Šajgalík, Michal; Czán, Andrej; Martinček, Juraj; Varga, Daniel; Hemžský, Pavel; Pitela, David

2015-12-01

Machined surface is one of the most used indicators of workpiece quality. But machined surface is influenced by several factors such as cutting parameters, cutting material, shape of cutting tool or cutting insert, micro-structure of machined material and other known as technological parameters. By improving of these parameters, we can improve machined surface. In the machining, there is important to identify the characteristics of main product of these processes - workpiece, but also the byproduct - the chip. Size and shape of chip has impact on lifetime of cutting tools and its inappropriate form can influence the machine functionality and lifetime, too. This article deals with elimination of long chip created when machining of shaft in automotive industry and with impact of shape of chip-breaker on shape of chip in various cutting conditions based on production requirements.

Fully integrated optical system for lab-on-a-chip applications

DEFF Research Database (Denmark)

Balslev, Søren; Olsen, Brian Bilenberg; Geschke, Oliver

2004-01-01

We present a lab-on-a-chip device featuring a microfluidic dye laser, wave-guides, microfluidic components and photo-detectors integrated on the chip. The microsystem is designed for wavelength selective absorption measurements in the visible range on a fluidic sample, which can be prepared....../mixed on-chip. The laser structures, wave-guides and micro-fluidic handling system are defined in a single UV-lithography step on a 10 μm thick SU-8 layer on top of the substrate. The SU-8 structures are sealed by a Borofloat glass lid, using polymethylmethacrylate (PMMA) adhesive bonding....

High power density reactors based on direct cooled particle beds

Science.gov (United States)

Powell, J. R.; Horn, F. L.

Reactors based on direct cooled High Temperature Gas Cooled Reactor (HTGR) type particle fuel are described. The small diameter particle fuel is packed between concentric porous cylinders to make annular fuel elements, with the inlet coolant gas flowing inwards. Hot exit gas flows out along the central channel of each element. Because of the very large heat transfer area in the packed beds, power densities in particle bed reactors (PBRs) are extremely high resulting in compact, lightweight systems. Coolant exit temperatures are high, because of the ceramic fuel temperature capabilities, and the reactors can be ramped to full power and temperature very rapidly. PBR systems can generate very high burst power levels using open cycle hydrogen coolant, or high continuous powers using closed cycle helium coolant. PBR technology is described and development requirements assessed.

On-chip spin-controlled orbital angular momentum directional coupling

Science.gov (United States)

Xie, Zhenwei; Lei, Ting; Si, Guangyuan; Du, Luping; Lin, Jiao; Min, Changjun; Yuan, Xiaocong

2018-01-01

Optical vortex beams have many potential applications in the particle trapping, quantum encoding, optical orbital angular momentum (OAM) communications and interconnects. However, the on-chip compact OAM detection is still a big challenge. Based on a holographic configuration and a spin-dependent structure design, we propose and demonstrate an on-chip spin-controlled OAM-mode directional coupler, which can couple the OAM signal to different directions due to its topological charge. While the directional coupling function can be switched on/off by altering the spin of incident beam. Both simulation and experimental measurements verify the validity of the proposed approach. This work would benefit the on-chip OAM devices for optical communications and high dimensional quantum coding/decoding in the future.

Revisiting lab-on-a-chip technology for drug discovery.

Science.gov (United States)

Neuži, Pavel; Giselbrecht, Stefan; Länge, Kerstin; Huang, Tony Jun; Manz, Andreas

2012-08-01

The field of microfluidics or lab-on-a-chip technology aims to improve and extend the possibilities of bioassays, cell biology and biomedical research based on the idea of miniaturization. Microfluidic systems allow more accurate modelling of physiological situations for both fundamental research and drug development, and enable systematic high-volume testing for various aspects of drug discovery. Microfluidic systems are in development that not only model biological environments but also physically mimic biological tissues and organs; such 'organs on a chip' could have an important role in expediting early stages of drug discovery and help reduce reliance on animal testing. This Review highlights the latest lab-on-a-chip technologies for drug discovery and discusses the potential for future developments in this field.

Numerical Study on the Design Concept of an Air-Cooled Condensation Heat Exchanger in a Long-term Passive Cooling System

International Nuclear Information System (INIS)

Kim, Myoung Jun; Moon, Joo Hyung; Bae, Youngmin; Kim, Young In; Park, Hyun Sik; Lee, Hee Joon

2016-01-01

SMART is the only licensed SMR in the world since the Nuclear Safety and Security Commission (NSSC) issued officially the Standard Design Approval (SDA) on 4 July 2012. Recently, the pre-project engineering (PPE) was officially launched for the construction of SMART and developing human resources capability. Both KAERI and King Abdullah City for Atomic and Renewable Energy (K.A. CARE) will conduct a three-year preliminary study to review the feasibility of building SMART and to prepare for its commercialization. SMART is equipped with passive cooling systems in order to enhance the safety of the reactor. The PRHRS (Passive Residual Heat Removal System) is the major passive safety system, which is actuated after an accident to remove the residual heat and the sensible heat from the RCS (Reactor Coolant System) through the steam generators (SGs) until the safe shutdown condition is reached. In this study, condensing heat transfer correlations in TSCON were validated using experimental data. It was shown that most of the condensation correlation gave satisfactory predictions of the cooling capacity of an-air cooled condensation heat exchanger

Numerical Study on the Design Concept of an Air-Cooled Condensation Heat Exchanger in a Long-term Passive Cooling System

Energy Technology Data Exchange (ETDEWEB)

Kim, Myoung Jun; Moon, Joo Hyung; Bae, Youngmin; Kim, Young In; Park, Hyun Sik [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of); Lee, Hee Joon [Kookmin University, Seoul (Korea, Republic of)

2016-10-15

SMART is the only licensed SMR in the world since the Nuclear Safety and Security Commission (NSSC) issued officially the Standard Design Approval (SDA) on 4 July 2012. Recently, the pre-project engineering (PPE) was officially launched for the construction of SMART and developing human resources capability. Both KAERI and King Abdullah City for Atomic and Renewable Energy (K.A. CARE) will conduct a three-year preliminary study to review the feasibility of building SMART and to prepare for its commercialization. SMART is equipped with passive cooling systems in order to enhance the safety of the reactor. The PRHRS (Passive Residual Heat Removal System) is the major passive safety system, which is actuated after an accident to remove the residual heat and the sensible heat from the RCS (Reactor Coolant System) through the steam generators (SGs) until the safe shutdown condition is reached. In this study, condensing heat transfer correlations in TSCON were validated using experimental data. It was shown that most of the condensation correlation gave satisfactory predictions of the cooling capacity of an-air cooled condensation heat exchanger.

Autonomic networking-on-chip bio-inspired specification, development, and verification

CERN Document Server

Cong-Vinh, Phan

2011-01-01

Despite the growing mainstream importance and unique advantages of autonomic networking-on-chip (ANoC) technology, Autonomic Networking-On-Chip: Bio-Inspired Specification, Development, and Verification is among the first books to evaluate research results on formalizing this emerging NoC paradigm, which was inspired by the human nervous system. The FIRST Book to Assess Research Results, Opportunities, & Trends in ""BioChipNets"" The third book in the Embedded Multi-Core Systems series from CRC Press, this is an advanced technical guide and reference composed of contributions from prominent re

On-chip patch antenna on InP substrate for short-range wireless communication at 140 GHz

DEFF Research Database (Denmark)

Dong, Yunfeng; Johansen, Tom Keinicke; Zhurbenko, Vitaliy

2017-01-01

This paper presents the design of an on-chip patch antenna on indium phosphide (InP) substrate for short-range wireless communication at 140 GHz. The antenna shows a simulated gain of 5.3 dBi with 23% bandwidth at 140 GHz and it can be used for either direct chip-to-chip communication or chip...

Global On-Chip Differential Interconnects with Optimally-Placed Twists

NARCIS (Netherlands)

Mensink, E.; Schinkel, Daniel; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria; Nauta, Bram

2005-01-01

Global on-chip communication is receiving quite some attention as global interconnects are rapidly becoming a speed, power and reliability bottleneck for digital CMOS systems. Recently, we proposed a bus-transceiver test chip in 0.13 μm CMOS using 10 mm long uninterrupted differential interconnects

Low-Cost Chemical-Responsive Adhesive Sensing Chips.

Science.gov (United States)

Tan, Weirui; Zhang, Liyuan; Shen, Wei

2017-12-06

Chemical-responsive adhesive sensing chip is a new low-cost analytical platform that uses adhesive tape loaded with indicator reagents to detect or quantify the target analytes by directly sticking the tape to the samples of interest. The chemical-responsive adhesive sensing chips can be used with paper to analyze aqueous samples; they can also be used to detect and quantify solid, particulate, and powder analytes. The colorimetric indicators become immediately visible as the contact between the functionalized adhesives and target samples is made. The chemical-responsive adhesive sensing chip expands the capability of paper-based analytical devices to analyze solid, particulate, or powder materials via one-step operation. It is also a simpler alternative way, to the covalent chemical modification of paper, to eliminate indicator leaching from the dipstick-style paper sensors. Chemical-responsive adhesive chips can display analytical results in the form of colorimetric dot patterns, symbols, and texts, enabling clear understanding of assay results by even nonprofessional users. In this work, we demonstrate the analyses of heavy metal salts in silica powder matrix, heavy metal ions in water, and bovine serum albumin in an aqueous solution. The detection is one-step, specific, sensitive, and easy-to-operate.

Surface enhanced raman spectroscopy on chip

DEFF Research Database (Denmark)

Hübner, Jörg; Anhøj, Thomas Aarøe; Zauner, Dan

2007-01-01

In this paper we report low resolution surface enhanced Raman spectra (SERS) conducted with a chip based spectrometer. The flat field spectrometer presented here is fabricated in SU-8 on silicon, showing a resolution of around 3 nm and a free spectral range of around 100 nm. The output facet...... is projected onto a CCD element and visualized by a computer. To enhance the otherwise rather weak Raman signal, a nanosurface is prepared and a sample solutions is impregnated on this surface. The surface enhanced Raman signal is picked up using a Raman probe and coupled into the spectrometer via an optical...... fiber. The obtained spectra show that chip based spectrometer together with the SERS active surface can be used as Raman sensor....

Study on irradiation effects of nucleus electromagnetic pulse on single chip computer system

International Nuclear Information System (INIS)

Hou Minsheng; Liu Shanghe; Wang Shuping

2001-01-01

Intense electromagnetic pulse, namely nucleus electromagnetic pulse (NEMP), lightning electromagnetic pulse (LEMP) and high power microwave (HPM), can disturb and destroy the single chip computer system. To study this issue, the authors made irradiation experiments by NEMPs generated by gigahertz transversal electromagnetic (GTEM) Cell. The experiments show that shutdown, restarting, communication errors of the single chip microcomputer system would occur when it was irradiated by the NEMPs. Based on the experiments, the cause on the effects on the single chip microcomputer system is discussed

On-chip Magnetic Separation and Cell Encapsulation in Droplets

Science.gov (United States)

Chen, A.; Byvank, T.; Bharde, A.; Miller, B. L.; Chalmers, J. J.; Sooryakumar, R.; Chang, W.-J.; Bashir, R.

2012-02-01

The demand for high-throughput single cell assays is gaining importance because of the heterogeneity of many cell suspensions, even after significant initial sorting. These suspensions may display cell-to-cell variability at the gene expression level that could impact single cell functional genomics, cancer, stem-cell research and drug screening. The on-chip monitoring of individual cells in an isolated environment could prevent cross-contamination, provide high recovery yield and ability to study biological traits at a single cell level These advantages of on-chip biological experiments contrast to conventional methods, which require bulk samples that provide only averaged information on cell metabolism. We report on a device that integrates microfluidic technology with a magnetic tweezers array to combine the functionality of separation and encapsulation of objects such as immunomagnetically labeled cells or magnetic beads into pico-liter droplets on the same chip. The ability to control the separation throughput that is independent of the hydrodynamic droplet generation rate allows the encapsulation efficiency to be optimized. The device can potentially be integrated with on-chip labeling and/or bio-detection to become a powerful single-cell analysis device.

Detection and classification of ebola on microfluidic chips

Science.gov (United States)

Lin, Xue; Jin, Xiangyu; Fan, Yunqian; Huang, Qin; Kou, Yue; Zu, Guo; Huang, Shiguang; Liu, Xiaosheng; Huang, Guoliang

2016-10-01

Point-of-care testing (POCT) for an infectious diseases is the prerequisite to control of the disease and limitation of its spread. A microfluidic chip for detection and classification of four strains of Ebola virus was developed and evaluated. This assay was based on reverse transcription loop-mediated isothermal amplification (RT-LAMP) and specific primers for Ebola Zaire virus, Ebola Sudan virus, Ebola Tai Forest virus and Ebola Bundibugyo virus were designed. The sensitivity of the microfluidic chip was under 103 copies per milliliter, as determined by ten repeated tests. This assay is unique in its ability to enable diagnosis of the Ebola infections and simultaneous typing of Ebola virus on a single chip. It offers short reaction time, ease of use and high specificity. These features should enable POCT in remote area during outbreaks of Ebola virus.

The study on the evaporation cooling efficiency and effectiveness of cooling tower of film type

International Nuclear Information System (INIS)

Li Yingjian; You Xinkui; Qiu Qi; Li Jiezhi

2011-01-01

Based on heat and mass transport mechanism of film type cooling, which was combined with an on-site test on counter flow film type cooling tower, a mathematical model on the evaporation and cooling efficiency and effectiveness has been developed. Under typical climatic conditions, air conditioning load and the operating condition, the mass and heat balances have been calculated for the air and the cooling water including the volume of evaporative cooling water. Changing rule has been measured and calculated between coefficient of performance (COP) and chiller load. The influences of air and cooling water parameters on the evaporative cooling efficiency were analyzed in cooling tower restrained by latent heat evaporative cooling, and detailed derivation and computation revealed that both the evaporative cooling efficiency and effectiveness of cooling tower are the same characteristics parameters of the thermal performance of a cooling tower under identical assumptions.

Avoiding Message-Dependent Deadlock in Network-Based Systems on Chip

NARCIS (Netherlands)

Hansson, A.; Goossens, K.; Rãdulescu, A.

2007-01-01

Networks on chip (NoCs) are an essential component of systems on chip (SoCs) and much research is devoted to deadlock avoidance in NoCs. Prior work focuses on the router network while protocol interactions between NoC and intellectual property (IP) modules are not considered. These interactions

On-chip steering of entangled photons in nonlinear photonic crystals.

Science.gov (United States)

Leng, H Y; Yu, X Q; Gong, Y X; Xu, P; Xie, Z D; Jin, H; Zhang, C; Zhu, S N

2011-08-16

One promising technique for working toward practical photonic quantum technologies is to implement multiple operations on a monolithic chip, thereby improving stability, scalability and miniaturization. The on-chip spatial control of entangled photons will certainly benefit numerous applications, including quantum imaging, quantum lithography, quantum metrology and quantum computation. However, external optical elements are usually required to spatially control the entangled photons. Here we present the first experimental demonstration of on-chip spatial control of entangled photons, based on a domain-engineered nonlinear photonic crystal. We manipulate the entangled photons using the inherent properties of the crystal during the parametric downconversion, demonstrating two-photon focusing and beam-splitting from a periodically poled lithium tantalate crystal with a parabolic phase profile. These experimental results indicate that versatile and precise spatial control of entangled photons is achievable. Because they may be operated independent of any bulk optical elements, domain-engineered nonlinear photonic crystals may prove to be a valuable ingredient in on-chip integrated quantum optics.

A survey of research and practices of network-on-chip

DEFF Research Database (Denmark)

Bjerregaard, Tobias; Mahadevan, Shankar

2006-01-01

The scaling of microchip technologies has enabled large scale systems-on-chip (SoC). Network-on-chip (NoC) research addresses global communication in SoC, involving (i) a move from computation-centric to communication-centric design and (ii) the implementation of scalable communication structures...

Lab-on-a-Chip Systems for Biomedical and Environmental Monitoring

NARCIS (Netherlands)

Gardeniers, Johannes G.E.; van den Berg, Albert

2003-01-01

During the last decade, pocket-size analytical equipment based on the "lab-on-a-chip" approach has become available. These chips, in combination with portable electronic equipment, are applicable in e.g. "point-of-care" ion analysis of body fluids, forensics, identification of explosives, tracking

Lab-on-a-Chip systems for biomedical and environmental monitoring

NARCIS (Netherlands)

Gardeniers, Johannes G.E.; van den Berg, Albert

2004-01-01

During the last decade, pocket-sized analytical equipment based on the lab-on-a-chip approach has become available. These chips, in combination with portable electronic equipment, are applicable in, for example, point-of-care ion analysis of body fluids, forensics, identification of explosives,

Efficient generation of single and entangled photons on a silicon photonic integrated chip

International Nuclear Information System (INIS)

Mower, Jacob; Englund, Dirk

2011-01-01

We present a protocol for generating on-demand, indistinguishable single photons on a silicon photonic integrated chip. The source is a time-multiplexed spontaneous parametric down-conversion element that allows optimization of single-photon versus multiphoton emission while realizing high output rate and indistinguishability. We minimize both the scaling of active elements and the scaling of active element loss with multiplexing. We then discuss detection strategies and data processing to further optimize the procedure. We simulate an improvement in single-photon-generation efficiency over previous time-multiplexing protocols, assuming existing fabrication capabilities. We then apply this system to generate heralded Bell states. The generation efficiency of both nonclassical states could be increased substantially with improved fabrication procedures.

Ultracold atoms on atom chips

DEFF Research Database (Denmark)

Krüger, Peter; Hofferberth, S.; Haller, E.

2005-01-01

Miniaturized potentials near the surface of atom chips can be used as flexible and versatile tools for the manipulation of ultracold atoms on a microscale. The full scope of possibilities is only accessible if atom-surface distances can be reduced to microns. We discuss experiments in this regime...

Microneedle Array Interface to CE on Chip

NARCIS (Netherlands)

Lüttge, Regina; Gardeniers, Johannes G.E.; Vrouwe, E.X.; van den Berg, Albert; Northrup, M.A.; Jensen, K.F; Harrison, D.J.

2003-01-01

This paper presents a microneedle array sampler interfaced to a capillary electrophoresis (CE) glass chip with integrated conductivity detection electrodes. A solution of alkali ions was electrokinetically loaded through the microneedles onto the chip and separation was demonstrated compared to a

A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

Directory of Open Access Journals (Sweden)

Chang-Hung Lee

2014-05-01

Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

A low-power integrated humidity CMOS sensor by printing-on-chip technology.

Science.gov (United States)

Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

2014-05-23

A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

Organ/body-on-a-chip based on microfluidic technology for drug discovery.

Science.gov (United States)

Kimura, Hiroshi; Sakai, Yasuyuki; Fujii, Teruo

2018-02-01

Although animal experiments are indispensable for preclinical screening in the drug discovery process, various issues such as ethical considerations and species differences remain. To solve these issues, cell-based assays using human-derived cells have been actively pursued. However, it remains difficult to accurately predict drug efficacy, toxicity, and organs interactions, because cultivated cells often do not retain their original organ functions and morphologies in conventional in vitro cell culture systems. In the μTAS research field, which is a part of biochemical engineering, the technologies of organ-on-a-chip, based on microfluidic devices built using microfabrication, have been widely studied recently as a novel in vitro organ model. Since it is possible to physically and chemically mimic the in vitro environment by using microfluidic device technology, maintenance of cellular function and morphology, and replication of organ interactions can be realized using organ-on-a-chip devices. So far, functions of various organs and tissues, such as the lung, liver, kidney, and gut have been reproduced as in vitro models. Furthermore, a body-on-a-chip, integrating multi organ functions on a microfluidic device, has also been proposed for prediction of organ interactions. We herein provide a background of microfluidic systems, organ-on-a-chip, Body-on-a-chip technologies, and their challenges in the future. Copyright © 2017 The Japanese Society for the Study of Xenobiotics. Published by Elsevier Ltd. All rights reserved.

Hand-held, mechanically cooled, radiation detection system for gamma-ray spectroscopy

Science.gov (United States)

Burks, Morgan Thomas; Eckels, Joel Del

2010-06-08

In one embodiment, a radiation detection system is provided including a radiation detector and a first enclosure encapsulating the radiation detector, the first enclosure including a low-emissivity infra-red (IR) reflective coating used to thermally isolate the radiation detector. Additionally, a second enclosure encapsulating the first enclosure is included, the first enclosure being suspension mounted to the second enclosure. Further, a cooler capable of cooling the radiation detector is included. Still yet, a first cooling interface positioned on the second enclosure is included for coupling the cooler and the first enclosure. Furthermore, a second cooling interface positioned on the second enclosure and capable of coupling the first enclosure to a cooler separate from the radiation detection system is included. Other embodiments are also presented.

Optics and molecules on atom chips

International Nuclear Information System (INIS)

Tscherneck, M; Holmes, M E; Quinto-Su, P A; Haimberger, C; Kleinert, J; Bigelow, N P

2005-01-01

In this paper we will report on four experiments which have been carried out in the last year in our group. All of these experiments are necessary steps towards the trapping and probing of ultracold molecules on a chip surface

Innovative low-mass cooling systems for the ALICE ITS Upgrade detector at CERN

CERN Document Server

Gomez Marzoa, Manuel

The Phase-1 upgrade of the LHC to full design luminosity, planned for 2019 at CERN, requires the modernisation of the experiments around the accelerator. The Inner Tracking System (ITS), the innermost detector at the ALICE experiment, will be upgraded by replacing the current apparatus by new silicon pixels arranged in 7 cylindrical layers. Each layer is composed by multiple independent modules, named staves, which provide mechanical support and cooling to the chips. This thesis aims to develop and validate experimentally an ultra-lightweight stave cooling system for the ITS Upgrade. The moderate thermal requirements, with a nominal power density of 0.15 W/cm^2 and a maximum chip temperature of 30ºC, are counterweighted by extreme low-mass restrictions, obliging to resort to lightweight, non-metallic materials, such as carbon fibre-reinforced polymers and plastics. Novel lightweight stave concepts were developed and experimentally validated, meeting the thermal requirements with minimal material inventory. T...

Towards pH sensing in blood-vessel-on-a-chip

NARCIS (Netherlands)

Tanumihardja, Esther; Olthuis, Wouter; van den Berg, Albert

2017-01-01

The Vascular Engineering on chip using differentiated Stem Cells (VESCEL) project aims to realize an on-chip model of human vasculature, where living cells are cultured and perfused in micrometer size compartments to mimic human vasculature function. This part of the VESCEL project aims to integrate

Passive UHF RFID Tag with Multiple Sensing Capabilities

Directory of Open Access Journals (Sweden)

José Fernández-Salmerón

2015-10-01

Full Text Available This work presents the design, fabrication, and characterization of a printed radio frequency identification tag in the ultra-high frequency band with multiple sensing capabilities. This passive tag is directly screen printed on a cardboard box with the aim of monitoring the packaging conditions during the different stages of the supply chain. This tag includes a commercial force sensor and a printed opening detector. Hence, the force applied to the package can be measured as well as the opening of the box can be detected. The architecture presented is a passive single-chip RFID tag. An electronic switch has been implemented to be able to measure both sensor magnitudes in the same access without including a microcontroller or battery. Moreover, the chip used here integrates a temperature sensor and, therefore, this tag provides three different parameters in every reading.

An FPGA design flow for reconfigurable network-based multi-processor systems on chip

NARCIS (Netherlands)

Kumar, A.; Hansson, M.A; Huisken, J.; Corporaal, H.

2007-01-01

Multi-processor systems on chip (MPSoC) platforms are becoming increasingly more heterogeneous and are shifting towards a more communication-centric methodology. Networks on chip (NoC) have emerged as the design paradigm for scalable on-chip communication architectures. As the system complexity

Progress on TSV technology for Medipix3RX chip

Science.gov (United States)

Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.

2017-12-01

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm×14.1 mm or 256×256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 μm original thickness, to 130 μm. The diameter of the vias is 40 μm, and the pitch between the vias is 120 μm. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.

Essential issues in SOC design designing complex systems-on-chip

CERN Document Server

Lin, Youn-long Steve

2007-01-01

Covers issues related to system-on-chip (SoC) design. This book covers IP development, verification, integration, chip implementation, testing and software. It contains valuable academic and industrial examples for those involved with the design of complex SOCs.

Manually operatable on-chip bistable pneumatic microstructures for microfluidic manipulations.

Science.gov (United States)

Chen, Arnold; Pan, Tingrui

2014-09-07

Bistable microvalves are of particular interest because of their distinct nature of requiring energy consumption only during the transition between the open and closed states. This characteristic can be highly advantageous in reducing the number of external inputs and the complexity of control circuitries since microfluidic devices as contemporary lab-on-a-chip platforms are transferring from research settings to low-resource environments with high integrability and a small form factor. In this paper, we first present manually operatable, on-chip bistable pneumatic microstructures (BPMs) for microfluidic manipulation. The structural design and operation of the BPM devices can be readily integrated into any pneumatically powered microfluidic network consisting of pneumatic and fluidic channels. It is mainly composed of a vacuum activation chamber (VAC) and a pressure release chamber (PRC), of which users have direct control through finger pressing to switch either to the bistable vacuum state (VS) or the atmospheric state (AS). We have integrated multiple BPM devices into a 4-to-1 microfluidic multiplexor to demonstrate on-chip digital flow switching from different sources. Furthermore, we have shown its clinical relevance in a point-of-care diagnostic chip that processes blood samples to identify the distinct blood types (A/B/O) on-chip.

Lab-on-a-Chip Pathogen Sensors for Food Safety

Directory of Open Access Journals (Sweden)

Bumsang Kim

2012-08-01

Full Text Available There have been a number of cases of foodborne illness among humans that are caused by pathogens such as Escherichia coli O157:H7, Salmonella typhimurium, etc. The current practices to detect such pathogenic agents are cell culturing, immunoassays, or polymerase chain reactions (PCRs. These methods are essentially laboratory-based methods that are not at all real-time and thus unavailable for early-monitoring of such pathogens. They are also very difficult to implement in the field. Lab-on-a-chip biosensors, however, have a strong potential to be used in the field since they can be miniaturized and automated; they are also potentially fast and very sensitive. These lab-on-a-chip biosensors can detect pathogens in farms, packaging/processing facilities, delivery/distribution systems, and at the consumer level. There are still several issues to be resolved before applying these lab-on-a-chip sensors to field applications, including the pre-treatment of a sample, proper storage of reagents, full integration into a battery-powered system, and demonstration of very high sensitivity, which are addressed in this review article. Several different types of lab-on-a-chip biosensors, including immunoassay- and PCR-based, have been developed and tested for detecting foodborne pathogens. Their assay performance, including detection limit and assay time, are also summarized. Finally, the use of optical fibers or optical waveguide is discussed as a means to improve the portability and sensitivity of lab-on-a-chip pathogen sensors.

Development of a synchrotron timing system on a programmable chip

International Nuclear Information System (INIS)

Lin Feiyu; Qiao Weimin; Wang Yanyu; Guo Yuhui

2009-01-01

A synchrotron requires extremely high time constraints for timing signals, so timing system is very important for a synchrotron control system. A FPGA+ARM+Linux+DSP architecture has been mainly used in timing control of the HIRFL-CSR control system. In this paper, we report the development of the SOPC(System On a Programmable Chip) based on FPGA and uClinux.It can integrate all the functions of ARM+Linux in one single FPGA chip, hence no need of the dedicated ARM chip, and the reduced cost. The maximum operation frequency of this system is 185 MHz. The hardware consumes less than 4% of total resources of FPGA chip. And both the hardware system and the operating system of the SOPC are reconfigurable. The SOPC system has a wide prospect of applications in accelerator engineering and many fields of scientific research. (authors)

All-electronic droplet generation on-chip with real-time feedback control for EWOD digital microfluidics.

Science.gov (United States)

Gong, Jian; Kim, Chang-Jin C J

2008-06-01

Electrowetting-on-dielectric (EWOD) actuation enables digital (or droplet) microfluidics where small packets of liquids are manipulated on a two-dimensional surface. Due to its mechanical simplicity and low energy consumption, EWOD holds particular promise for portable systems. To improve volume precision of the droplets, which is desired for quantitative applications such as biochemical assays, existing practices would require near-perfect device fabrication and operation conditions unless the droplets are generated under feedback control by an extra pump setup off of the chip. In this paper, we develop an all-electronic (i.e., no ancillary pumping) real-time feedback control of on-chip droplet generation. A fast voltage modulation, capacitance sensing, and discrete-time PID feedback controller are integrated on the operating electronic board. A significant improvement is obtained in the droplet volume uniformity, compared with an open loop control as well as the previous feedback control employing an external pump. Furthermore, this new capability empowers users to prescribe the droplet volume even below the previously considered minimum, allowing, for example, 1 : x (x < 1) mixing, in comparison to the previously considered n : m mixing (i.e., n and m unit droplets).

ALL-ELECTRONIC DROPLET GENERATION ON-CHIP WITH REAL-TIME FEEDBACK CONTROL FOR EWOD DIGITIAL MICROFLUIDICS

Science.gov (United States)

Gong, Jian; Kim, Chang-Jin “CJ”

2009-01-01

Electrowetting-on-dielectric (EWOD) actuation enables digital (or droplet) microfluidics where small packets of liquids are manipulated on a two-dimensional surface. Due to its mechanical simplicity and low energy consumption, EWOD holds particular promise for portable systems. To improve volume precision of the droplets, which is desired for quantitative applications such as biochemical assays, existing practices would require near-perfect device fabricaion and operation conditions unless the droplets are generated under feedback control by an extra pump setup off of the chip. In this paper, we develop an all-electronic (i.e., no ancillary pumping) real-time feedback control of on-chip droplet generation. A fast voltage modulation, capacitance sensing, and discrete-time PID feedback controller are integrated on the operating electronic board. A significant improvement is obtained in the droplet volume uniformity, compared with an open loop control as well as the previous feedback control employing an external pump. Furthermore, this new capability empowers users to prescribe the droplet volume even below the previously considered minimum, allowing, for example, 1:x (x < 1) mixing, in comparison to the previously considered n:m mixing (i.e., n and m unit droplets). PMID:18497909

Solid state silicon based condenser microphone for hearing aid, has transducer chip and IC chip between intermediate chip and openings on both sides of intermediate chip, to allow sound towards diaphragm

DEFF Research Database (Denmark)

2000-01-01

towards diaphragm. Surface of the chip (2) has electrical conductors (14) to connect chip with IC chip (3). USE - For use in miniature electroacoustic devices such as hearing aid. ADVANTAGE - Since sound inlet is covered by filter, dust, moisture and other impurities do not obstruct interior and sound...... inlet of microphone. External electrical connection can be made economically reliable and the thermal stress is avoided with the small size solid state silicon based condenser microphone....

46 CFR 92.20-50 - Heating and cooling.

Science.gov (United States)

2010-10-01

... 46 Shipping 4 2010-10-01 2010-10-01 false Heating and cooling. 92.20-50 Section 92.20-50 Shipping... AND ARRANGEMENT Accommodations for Officers and Crew § 92.20-50 Heating and cooling. (a) All manned... heating and cooling system for accommodations must be capable of maintaining a temperature of 21 °C (70 °F...

A flip chip process based on electroplated solder bumps

Science.gov (United States)

Salonen, J.; Salmi, J.

1994-01-01

Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

High Voltage Dielectrophoretic and Magnetophoretic Hybrid Integrated Circuit / Microfluidic Chip

Science.gov (United States)

Issadore, David; Franke, Thomas; Brown, Keith A.; Hunt, Thomas P.; Westervelt, Robert M.

2010-01-01

A hybrid integrated circuit (IC) / microfluidic chip is presented that independently and simultaneously traps and moves microscopic objects suspended in fluid using both electric and magnetic fields. This hybrid chip controls the location of dielectric objects, such as living cells and drops of fluid, on a 60 × 61 array of pixels that are 30 × 38 μm2 in size, each of which can be individually addressed with a 50 V peak-to-peak, DC to 10 MHz radio frequency voltage. These high voltage pixels produce electric fields above the chip’s surface with a magnitude , resulting in strong dielectrophoresis (DEP) forces . Underneath the array of DEP pixels there is a magnetic matrix that consists of two perpendicular sets of 60 metal wires running across the chip. Each wire can be sourced with 120 mA to trap and move magnetically susceptible objects using magnetophoresis (MP). The DEP pixel array and magnetic matrix can be used simultaneously to apply forces to microscopic objects, such as living cells or lipid vesicles, that are tagged with magnetic nanoparticles. The capabilities of the hybrid IC / microfluidic chip demonstrated in this paper provide important building blocks for a platform for biological and chemical applications. PMID:20625468

Operating Modes and Cooling Capabilities of the 3-Stage ADR Developed for the Soft-X-Ray Spectrometer Instrument on Astro-H

Science.gov (United States)

Shirron, Peter J.; Kimball, Mark O.; James, Bryan L.; Muench, Theo; DiPirro, Michael J.; Letmate, Richard V.; Sampson, Michael A.; Bialas, Tom G.; Sneiderman, Gary A.; Porter, Frederick S.;

Low-cost low-power UHF RFID tag with on-chip antenna

Energy Technology Data Exchange (ETDEWEB)

Xi Jingtian; Yan Na; Che Wenyi; Xu Conghui; Wang Xiao; Yang Yuqing; Jian Hongyan; Min Hao, E-mail: jtxi@fudan.edu.c [State Key Laboratory of ASIC and System, Auto-ID Laboratory, Fudan University, Shanghai 201203 (China)

2009-07-15

This paper presents an EPC Class 1 Generation 2 compatible tag with on-chip antenna implemented in the SMIC 0.18 {mu}m standard CMOS process. The UHF tag chip includes an RF/analog front-end, a digital baseband, and a 640-bit EEPROM memory. The on-chip antenna is optimized based on a novel parasitic-aware model. The rectifier is optimized to achieve a power conversion efficiency up to 40% by applying a self-bias feedback and threshold compensation techniques. A good match between the tag circuits and the on-chip antenna is realized by adjusting the rectifier input impedance. Measurements show that the presented tag can achieve a communication range of 1 cm with 1 W reader output power using a 1 x 1 cm{sup 2} single-turn loop reader antenna.

Implementation of Guaranteed Services in the MANGO Clockless Network-on-Chip

DEFF Research Database (Denmark)

Bjerregaard, Tobias; Sparsø, Jens

2006-01-01

(clockless implementation, standard socket access points, and guaranteed communication services) make MANGO suitable for a modular SoC design flow is explained. Among the advantages of using clockless circuit techniques are inherent global timing closure, low forward latency in pipelines, and zero dynamic......Shared, segmented, on-chip interconnection networks, known as networks-on-chip (NoC), may become the preferred way of interconnecting intellectual property (IP) cores in future giga-scale system-on-chip (SoC) designs. A NoC can provide the required communication bandwidth while accommodating...... the effects of scaling microchip technologies. Equally important, a NoC facilitates a truly modular and scalable design flow. The MANGO (message-passing asynchronous network-on-chip providing guaranteed services over open core protocol (OCP) interfaces) NoC is presented, and how its key characteristics...

Rotational microfluidic motor for on-chip microcentrifugation

Science.gov (United States)

Shilton, Richie J.; Glass, Nick R.; Chan, Peggy; Yeo, Leslie Y.; Friend, James R.

2011-06-01

We report on the design of a surface acoustic wave (SAW) driven fluid-coupled micromotor which runs at high rotational velocities. A pair of opposing SAWs generated on a lithium niobate substrate are each obliquely passed into either side of a fluid drop to drive rotation of the fluid, and the thin circular disk set on the drop. Using water for the drop, a 5 mm diameter disk was driven with rotation speeds and start-up torques up to 2250 rpm and 60 nN m, respectively. Most importantly for lab-on-a-chip applications, radial accelerations of 172 m/s2 was obtained, presenting possibilities for microcentrifugation, flow sequencing, assays, and cell culturing in truly microscale lab-on-a-chip devices.

Heterogeneous freezing of super cooled water droplets in micrometre range- freezing on a chip

Science.gov (United States)

Häusler, Thomas; Witek, Lorenz; Felgitsch, Laura; Hitzenberger, Regina; Grothe, Hinrich

2017-04-01

A new setup to analyse the freezing behaviour of ice nucleation particles (INPs) dispersed in aqueous droplets has been developed with the aim to analyse ensembles of droplets with sizes in the micrometre range, in which INPs are immersed. Major disadvantages of conventional drop-freezing experiments like varying drop sizes or interactions between the water- oil mixture and the INP, were solved by introducing a unique freezing- chip consisting of an etched and sputtered 15x15x1 mm gold-plated silicon or pure gold film (Pummer et al., 2012; Zolles et al., 2015). Using this chip, isolated micrometre-sized droplets can be generated with sizes similar to droplets in real world clouds. The experimental set-up for drop-freezing experiments was revised and improved by establishing automated process control and image evaluation. We were able to show the efficiency and accuracy of our setup by comparing measured freezing temperatures of different INPs (Snomax®, K- feldspar, birch pollen (Betula pendula) washing water, juniper pollen suspension (Juniperus communis) and ultrapure water) with already published results (Atkinson et al., 2013; Augustin et al., 2013; Pruppacher and Klett, 1997; Pummer et al., 2012; Wex et al., 2015; Zolles et al., 2015). Comparison of our measurements with literature data show the important impact of droplet size, INP concentration and number of active sites on the T50 values. Here, the new set-up exhibits its strength in reproducibility and accuracy which is due to the defined and isolated droplets. Finally, it opens a temperature window down to -37˚ C for freezing experiments which was not accessible with former traditional approaches .Atkinson, J. D., Murray, B. J., Woodhouse, M. T., Whale, T. F., Baustian, K. J., Carslaw, K. S., Dobbie, S., O'Sullivan, D., and Malkin, T. L.: The importance of feldspar for ice nucleation by mineral dust in mixed-phase clouds (vol 498, pg 355, 2013), Nature, 500, 491-491, 2013. Augustin, S., Wex, H

Experimental investigation of single-phase microjet cooling of microelectronics

Directory of Open Access Journals (Sweden)

Rusowicz Artur

2015-09-01

Full Text Available Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second. While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

Experimental investigation of single-phase microjet cooling of microelectronics

Science.gov (United States)

Rusowicz, Artur; Leszczyński, Maciej; Grzebielec, Andrzej; Laskowski, Rafał

2015-09-01

Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second). While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

Temperature Field Accurate Modeling and Cooling Performance Evaluation of Direct-Drive Outer-Rotor Air-Cooling In-Wheel Motor

Directory of Open Access Journals (Sweden)

Feng Chai

2016-10-01

Full Text Available High power density outer-rotor motors commonly use water or oil cooling. A reasonable thermal design for outer-rotor air-cooling motors can effectively enhance the power density without the fluid circulating device. Research on the heat dissipation mechanism of an outer-rotor air-cooling motor can provide guidelines for the selection of the suitable cooling mode and the design of the cooling structure. This study investigates the temperature field of the motor through computational fluid dynamics (CFD and presents a method to overcome the difficulties in building an accurate temperature field model. The proposed method mainly includes two aspects: a new method for calculating the equivalent thermal conductivity (ETC of the air-gap in the laminar state and an equivalent treatment to the thermal circuit that comprises a hub, shaft, and bearings. Using an outer-rotor air-cooling in-wheel motor as an example, the temperature field of this motor is calculated numerically using the proposed method; the results are experimentally verified. The heat transfer rate (HTR of each cooling path is obtained using the numerical results and analytic formulas. The influences of the structural parameters on temperature increases and the HTR of each cooling path are analyzed. Thereafter, the overload capability of the motor is analyzed in various overload conditions.

Improved On-Chip Measurement of Delay in an FPGA or ASIC

Science.gov (United States)

Chen, Yuan; Burke, Gary; Sheldon, Douglas

2007-01-01

An improved design has been devised for on-chip-circuitry for measuring the delay through a chain of combinational logic elements in a field-programmable gate array (FPGA) or application-specific integrated circuit (ASIC). In the improved design, the delay chain does not include input and output buffers and is not configured as an oscillator. Instead, the delay chain is made part of the signal chain of an on-chip pulse generator. The duration of the pulse is measured on-chip and taken to equal the delay.

A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

Science.gov (United States)

Huang, Che-Wei; Huang, Yu-Jie; Lu, Shey-Shi; Lin, Chih-Ting

2012-01-01

A fully integrated humidity sensor chip was designed, implemented, and tested. Utilizing the micro-stamping technology, the pseudo-3D sensor system-on-chip (SSoC) architecture can be implemented by stacking sensing materials directly on the top of a CMOS-fabricated chip. The fabricated sensor system-on-chip (2.28 mm × 2.48 mm) integrated a humidity sensor, an interface circuit, a digital controller, and an On-Off Keying (OOK) wireless transceiver. With low power consumption, i.e., 750 μW without RF operation, the sensitivity of developed sensor chip was experimentally verified in the relative humidity (RH) range from 32% to 60%. The response time of the chip was also experimentally verified to be within 5 seconds from RH 36% to RH 64%. As a consequence, the implemented humidity SSoC paves the way toward the an ultra-small sensor system for various applications.

Comparative growth analysis of cool- and warm-season grasses in a cool-temperate environment

International Nuclear Information System (INIS)

Belesky, D.P.; Fedders, J.M.

1995-01-01

Using both cool-season (C3) and warm-season (C4) species is a viable means of optimizing herbage productivity over varying climatic conditions in temperate environments. Despite well-documented differences in water, N, and radiation use, no consistent evidence demonstrates productivity differences among C3 and C4 perennial grass species under identical management. A field study was conducted to determine relative growth rates (RGR), nitrogen productivity (NP), and mean radiation productivity (RP) (dry matter production as a function of incident radiation) of cool- and warm-season grasses managed identically. Results were used to identify management practices thd could lead to optimal productivity in combinations or mixtures of cool- and warm-season grasses. Dry matter yields of warm-season grasses equaled or surpassed those of cool-season grasses, despite a 40% shorter growth interval. Certain cool- and warm-season grasses appear to be suitable for use in mixtures, based on distribution of herbage production; however, actual compatibility may be altered by defoliation management. Relative growth rates varied among years and were about 40% lower for canopies clipped to a 10-cm residue height each time 20-cm of growth accumulated compared with other treatments. The RGR of warm-season grasses was twice that of cool-season grasses Nitrogen productivity (g DM g-1 N d -1) and mean radiation productivity (g DM MJ-1) for warm-season grasses was also more than twice that of cool-season grasses. Radiation productivity of cool-season grasses was dependent on N, while this was not always the case for warm-season grasses. The superior production capability of certain warm-season compared with cool-season grasses in a cool-temperate environment can be sustained under a range of defoliation treatments and demonstrates suitability for use in frequently defoliated situations

Measurement of pO2 in a Pre-clinical Model of Rabbit Tumor Using OxyChip, a Paramagnetic Oxygen Sensor.

Science.gov (United States)

Hou, H; Khan, N; Kuppusamy, P

2017-01-01

The objective of this work was to establish a novel and robust technology, based on electron paramagnetic resonance (EPR) oximetry, as a practical tool for measurement of tumor oxygen. Previously, we have reported on the development of oxygen-sensing paramagnetic crystals (LiNc-BuO) encapsulated in a biocompatible polymer, called OxyChip. In this report we present our recent data on the use of OxyChip for pO 2 measurements in the tumor of a pre-clinical, large-animal rabbit model. The results establish that OxyChip is capable of noninvasive and repeated measurement of pO 2 in a large animal model.

Co-design of on-chip antennas and circuits for a UNII band monolithic transceiver

KAUST Repository

Shamim, Atif

2012-07-28

The surge of highly integrated and multifunction wireless devices has necessitated the designers to think outside the box for solutions that are unconventional. The new trends have provided the impetus for low cost and compact RF System-on-Chip (SoC) approaches [1]. The major advantages of SoC are miniaturization and cost reduction. A major bottleneck to the true realization of monolithic RF SoC transceivers is the implementation of on-chip antennas with circuitry. Though complete integrated transceivers with on-chip antennas have been demonstrated, these designs are generally for high frequencies. Moreover, they either use non-standard CMOS processes or additional fabrication steps to enhance the antenna efficiency, which in turn adds to the cost of the system [2-3]. Another challenge related to the on-chip antennas is the characterization of their radiation properties. Most of the recently reported work (summarized in Table I) shows that very few on-chip antennas are characterized. Our previous work [4], demonstrated a Phase Lock Loop (PLL) based transmitter (TX) with an on-chip antenna. However, the radiation from the on-chip antenna experienced strong interference due to 1) some active circuitry on one side of the chip and 2) the PCB used to mount the chip in the anechoic chamber. This paper presents, for the first time, a complete 5.2 GHz (UNII band) transceiver with separate TX and receiver (RX) antennas. To the author\\'s best knowledge, its size of 3 mm2 is the smallest reported for a UNII band transceiver with two on-chip antennas. Both antennas are characterized for their radiation properties through an on-wafer custom measurement setup. The strategy to co-design on-chip antennas with circuits, resultant trade-offs and measurement challenges have also been discussed. © 2010 IEEE.

The human brain on a computer, the design neuromorphic chips aims to process information as does the mind; El cerebro humano en un ordenador

Energy Technology Data Exchange (ETDEWEB)

Pajuelo, L.

2015-07-01

Develop chips that mimic the brain processes It will help create computers capable of interpreting information from image, sound and touch so that it may offer answers intelligent-not programmed before- according to these sensory data. chips neuromorphic may mimic the electrical activity neurons and brain synapses, and will be key to intelligence systems artificial (ia) that require interaction with the environment being able to extract information cognitive of what surrounds them. (Author)

The Effect of Variable Gravity on the Cooling Performance of a 16-Nozzle Spray Array

Science.gov (United States)

2008-09-01

Coolants and Capabilities [1]. spray cooling, have been studied in depth and are currently being used on various types of systems. Mudawar [1] presented many...meniscus. Surface modifications could be made to reduce this effect while enhancing overall operability. 58 Bibliography [1] Mudawar , I., “Assessment of

Microengineered physiological biomimicry: organs-on-chips.

Science.gov (United States)

Huh, Dongeun; Torisawa, Yu-suke; Hamilton, Geraldine A; Kim, Hyun Jung; Ingber, Donald E

2012-06-21

Microscale engineering technologies provide unprecedented opportunities to create cell culture microenvironments that go beyond current three-dimensional in vitro models by recapitulating the critical tissue-tissue interfaces, spatiotemporal chemical gradients, and dynamic mechanical microenvironments of living organs. Here we review recent advances in this field made over the past two years that are focused on the development of 'Organs-on-Chips' in which living cells are cultured within microfluidic devices that have been microengineered to reconstitute tissue arrangements observed in living organs in order to study physiology in an organ-specific context and to develop specialized in vitro disease models. We discuss the potential of organs-on-chips as alternatives to conventional cell culture models and animal testing for pharmaceutical and toxicology applications. We also explore challenges that lie ahead if this field is to fulfil its promise to transform the future of drug development and chemical safety testing.

Effect of closed loop cooling water transit time on containment cooling

International Nuclear Information System (INIS)

Smith, R.P.; Vossahlik, J.E.; Goodwin, E.F.

1996-01-01

Long term containment cooling analyses in nuclear plant systems are usually conducted assuming a quasi steady-state process, that is, a steady state evaluation of the cooling system is completed for each calculational step. In reality, fluid transport in the system, and heat addition to system components may affect the heat removal rate of the system. Transient effects occurring during system startup may affect the maximum temperatures experienced in the system. It is important to ensure that such transient effects do not affect operation of the system (e.g., cause a high temperature trip). To evaluate the effect of fluid transit delays, a closed loop cooling water system model has been developed that incorporates the fluid transport times when determining the closed loop cooling system performance. This paper describes the closed loop cooling system model as implemented in the CONTEMPT-LT/028 code. The evaluation of the transient temperature response of the closed loop cooling system using the model is described. The paper also describes the effect of fluid transit time on the overall containment cooling performance

SVX3: A deadtimeless readout chip for silicon strip detectors

International Nuclear Information System (INIS)

Zimmerman, T.; Huffman, T.; Srage, J.; Stroehmer, R.; Yarema, R.; Garcia-Sciveras, M.; Luo, L.; Milgrome, O.

1997-12-01

A new silicon strip readout chip called the SVX3 has been designed for the 720,000 channel CDF silicon upgrade at Fermilab. SVX3 incorporates an integrator, analog delay pipeline, ADC, and data sparsification for each of 128 identical channels. Many of the operating parameters are programmable via a serial bit stream, which allows the chip to be used under a variety of conditions. Distinct features of SVX3 include use of a backside substrate contact for optimal ground referencing, and the capability of simultaneous signal acquisition and digital readout allowing deadtimeless operation in the Fermilab Tevatron

Indian programme on molten salt cooled nuclear reactors

International Nuclear Information System (INIS)

DuIera, I.V.; Vijayan, P.K.; Sinha, R.K.

2013-01-01

Bhabha Atomic Research Centre (BARC) is developing a 600 MWth pebble bed high temperature reactor, cooled by natural circulation of molten fluoride salts and is capable of supplying process heat at 1000 ℃ to facilitate hydrogen production by splitting water. BARC has also initiated studies for a reactor concept in which salts of molten fluoride fuel and coolant in fluid form, flows through the reactor core of graphite moderator, resulting in nuclear fission within the molten salt. For thorium fuel cycle, this concept is very attractive, since the fuel can be re-processed on-line, enabling it to be an efficient neutron breeder. (author)

Impact of Personnel Capabilities on Organizational Innovation Capability

DEFF Research Database (Denmark)

Nielsen, Susanne Balslev; Momeni, Mostafa

2016-01-01

in this rapidly changing world. This research focuses on definition of the personnel aspect of innovation capability, and proposes a conceptual model based on the scientific articles of academic literature on organisations innovation capability. This paper includes an expert based validation in three rounds...... of the Delphi method. And for the purpose of a better appreciation of the relationship dominating the factors of the model, it has distributed the questionnaire to Iranian companies in the Food industry. This research proposed a direct relationship between Innovation Capability and the Personnel Capability...

"Hook"-calibration of GeneChip-microarrays: Chip characteristics and expression measures

Directory of Open Access Journals (Sweden)

Krohn Knut

2008-08-01

Full Text Available Abstract Background Microarray experiments rely on several critical steps that may introduce biases and uncertainty in downstream analyses. These steps include mRNA sample extraction, amplification and labelling, hybridization, and scanning causing chip-specific systematic variations on the raw intensity level. Also the chosen array-type and the up-to-dateness of the genomic information probed on the chip affect the quality of the expression measures. In the accompanying publication we presented theory and algorithm of the so-called hook method which aims at correcting expression data for systematic biases using a series of new chip characteristics. Results In this publication we summarize the essential chip characteristics provided by this method, analyze special benchmark experiments to estimate transcript related expression measures and illustrate the potency of the method to detect and to quantify the quality of a particular hybridization. It is shown that our single-chip approach provides expression measures responding linearly on changes of the transcript concentration over three orders of magnitude. In addition, the method calculates a detection call judging the relation between the signal and the detection limit of the particular measurement. The performance of the method in the context of different chip generations and probe set assignments is illustrated. The hook method characterizes the RNA-quality in terms of the 3'/5'-amplification bias and the sample-specific calling rate. We show that the proper judgement of these effects requires the disentanglement of non-specific and specific hybridization which, otherwise, can lead to misinterpretations of expression changes. The consequences of modifying probe/target interactions by either changing the labelling protocol or by substituting RNA by DNA targets are demonstrated. Conclusion The single-chip based hook-method provides accurate expression estimates and chip-summary characteristics

Thermoelectric mini cooler coupled with micro thermosiphon for CPU cooling system

International Nuclear Information System (INIS)

Liu, Di; Zhao, Fu-Yun; Yang, Hong-Xing; Tang, Guang-Fa

2015-01-01

In the present study, a thermoelectric mini cooler coupling with a micro thermosiphon cooling system has been proposed for the purpose of CPU cooling. A mathematical model of heat transfer, depending on one-dimensional treatment of thermal and electric power, is firstly established for the thermoelectric module. Analytical results demonstrate the relationship between the maximal COP (Coefficient of Performance) and Q c with the figure of merit. Full-scale experiments have been conducted to investigate the effect of thermoelectric operating voltage, power input of heat source, and thermoelectric module number on the performance of the cooling system. Experimental results indicated that the cooling production increases with promotion of thermoelectric operating voltage. Surface temperature of CPU heat source linearly increases with increasing of power input, and its maximum value reached 70 °C as the prototype CPU power input was equivalent to 84 W. Insulation between air and heat source surface can prevent the condensate water due to low surface temperature. In addition, thermal performance of this cooling system could be enhanced when the total dimension of thermoelectric module matched well with the dimension of CPU. This research could benefit the design of thermal dissipation of electronic chips and CPU units. - Highlights: • A cooling system coupled with thermoelectric module and loop thermosiphon is developed. • Thermoelectric module coupled with loop thermosiphon can achieve high heat-transfer efficiency. • A mathematical model of thermoelectric cooling is built. • An analysis of modeling results for design and experimental data are presented. • Influence of power input and operating voltage on the cooling system are researched

A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

Directory of Open Access Journals (Sweden)

Chih-Ting Lin

2012-08-01

Full Text Available A fully integrated humidity sensor chip was designed, implemented, and tested. Utilizing the micro-stamping technology, the pseudo-3D sensor system-on-chip (SSoC architecture can be implemented by stacking sensing materials directly on the top of a CMOS-fabricated chip. The fabricated sensor system-on-chip (2.28 mm × 2.48 mm integrated a humidity sensor, an interface circuit, a digital controller, and an On-Off Keying (OOK wireless transceiver. With low power consumption, i.e., 750 μW without RF operation, the sensitivity of developed sensor chip was experimentally verified in the relative humidity (RH range from 32% to 60%. The response time of the chip was also experimentally verified to be within 5 seconds from RH 36% to RH 64%. As a consequence, the implemented humidity SSoC paves the way toward the an ultra-small sensor system for various applications.

Materials Characterization of CIGS solar cells on Top of CMOS chips

NARCIS (Netherlands)

Lu, J.; Liu, W.; Kovalgin, A.Y.; Sun, Y.; Schmitz, J.; Venkatasubramanian, R.; Radousky, H.; Liang, H.

2011-01-01

In the current work, we present a detailed study on the material properties of the CIGS layers, fabricated on top of the CMOS chips, and compare the results with the fabrication on standard glass substrates. Almost identical elemental composition on both glass and CMOS chips (within measurement

Impact of high-pressure coolant supply on chip formation in milling

Science.gov (United States)

Klocke, F.; Döbbeler, B.; Lakner, T.

2017-10-01

Machining of titanium alloys is considered as difficult, because of their high temperature strength, low thermal conductivity and low E-modulus, which contributes to high mechanical loads and high temperatures in the contact zone between tool and workpiece. The generated heat in the cutting zone can be dissipated only in a low extent. When cutting steel materials, up to 75% of the process heat is transported away by the chips, contrary to only 25% when machining titanium alloys. As a result, the cutting tool heats up, which leads to high tool wear. Therefore, machining of titanium alloys is only possible with relatively low cutting speeds. This leads to low levels of productivity for milling processes with titanium alloys. One way to increase productivity is to use more cutting edges in tools with the same diameter. However, the limiting factor of adding more cutting edges to a milling tool is the minimum size of the chip spaces, which are sufficient for a stable chip evacuation. This paper presents experimental results on the chip formation and chip size influenced by high-pressure coolant supply, which can lead to smaller chips and to smaller sizes of the chip spaces, respectively. Both influences, the pressure of the supplied coolant and the volumetric flow rate were individually examined. Alpha-beta annealed titanium TiAl6V4 was examined in relation to the reference material quenched and tempered steel 42CrMo4+QT (AISI 4140+QT). The work shows that with proper chip control due to high-pressure coolant supply in milling, the number of cutting edges on the same diameter tool can be increased, which leads to improved productivity.

Application of the DRS chip for fast waveform digitizing

Energy Technology Data Exchange (ETDEWEB)

Ritt, Stefan, E-mail: stefan.ritt@psi.c [PSI, CH-5232 Villigen (Switzerland); Dinapoli, Roberto; Hartmann, Ueli [PSI, CH-5232 Villigen (Switzerland)

2010-11-01

The high demands of modern experiments in fast waveform digitizing led to the development of a whole family of switched capacitor arrays (SCA), called the Domino Ring Sampler (DRS). The most recent version, DRS4, is produced in a radiation hard 0.25 {mu}m CMOS process, and is capable of digitizing 9 differential input channels at sampling rates of up to 6 Giga-samples per second (GSPS) with an analogue bandwidth of 950 MHz (-3 dB). The channel depth can be configured between 1024 and 8192 cells, and the signal-to-noise ratio allows a resolution equivalent to more than 11 bits. Using an interleaved sampling technique, sampling rates up to 48 GSPS are possible. Compared with the previous versions, the DRS4 chip contains several improvements such as an on-chip PLL for sampling-frequency stabilization and various mechanisms to reduce the read out dead-time. The high bandwidth, low power consumption and short readout time make this chip attractive for many experiments, replacing traditional ADCs and TDCs. This includes time-of-flight detectors, cosmic gamma ray observatories, PET scanners and industrial applications.

Energy saving potential of an indirect evaporative cooler as a pre-cooling unit for mechanical cooling systems in Iran

Energy Technology Data Exchange (ETDEWEB)

Delfani, Shahram; Esmaeelian, Jafar; Karami, Maryam [Department of Installation, Building and Housing Research Center (BHRC), PO Box 13145-1696, Tehran (Iran, Islamic Republic of); Pasdarshahri, Hadi [Department of Mechanical Engineering, Tarbiat Modares University, PO Box 14115-143, Tehran (Iran, Islamic Republic of)

2010-11-15

The performance of indirect evaporative cooling system (IEC) to pre-cool air for a conventional mechanical cooling system has been investigated for four cities of Iran. For this purpose, a combined experimental setup consisting of an IEC unit followed by a packaged unit air conditioner (PUA) was designed, constructed and tested. Two air simulators were designed and used to simulate indoor heating load and outdoor design conditions. Using of experimental data and an appropriate analytical method, the performance and energy reduction capability of combined system has been evaluated through the cooling season. The results indicate IEC can reduce cooling load up to 75% during cooling seasons. Also, 55% reduction in electrical energy consumption of PUA can be obtained. (author)

Implantable Biomedical Signal Monitoring Using RF Energy Harvestingand On-Chip Antenna

Directory of Open Access Journals (Sweden)

Jiann-Shiun Yuan

2015-08-01

Full Text Available This paper presents the design of an energy harvesting wireless and battery-less silicon-on-chip (SoC device that can be implanted in the human body to monitor certain health conditions. The proposed architecture has been designed on TSMC 0.18μm CMOS ICs and is an integrated system with a rectenna (antenna and rectifier and transmitting circuit, all on a single chip powered by an external transmitter and that is small enough to be inserted in the human eye, heart or brain. The transmitting and receiving antennas operate in the 5.8- GHz ISM band and have a -10dB gain. The distinguishing feature of this design is the rectenna that comprises of a singlestage diode connected NMOS rectifier and a 3-D on-chip antenna that occupies only 2.5 × 1 × 2.8 mm3 of chip area and has the ability to communicate within proximity of 5 cm while giving 10% efficiency. The external source is a reader that powers up the RF rectifier in the implantable chip triggering it to start sending data back to the reader enabling an efficient method of health evaluation for the patient.

Generation and manipulation of entangled photons on silicon chips

Directory of Open Access Journals (Sweden)

Matsuda Nobuyuki

2016-08-01

Full Text Available Integrated quantum photonics is now seen as one of the promising approaches to realize scalable quantum information systems. With optical waveguides based on silicon photonics technologies, we can realize quantum optical circuits with a higher degree of integration than with silica waveguides. In addition, thanks to the large nonlinearity observed in silicon nanophotonic waveguides, we can implement active components such as entangled photon sources on a chip. In this paper, we report recent progress in integrated quantum photonic circuits based on silicon photonics. We review our work on correlated and entangled photon-pair sources on silicon chips, using nanoscale silicon waveguides and silicon photonic crystal waveguides. We also describe an on-chip quantum buffer realized using the slow-light effect in a silicon photonic crystal waveguide. As an approach to combine the merits of different waveguide platforms, a hybrid quantum circuit that integrates a silicon-based photon-pair source and a silica-based arrayed waveguide grating is also presented.

Analysis Of The Heat Exchanger Capability At One Line Cooling System Operation Mode Of The RSG-GAS

International Nuclear Information System (INIS)

Dibyo, Sukmanto; Kuntoro, Iman

2000-01-01

In the frame of minimizing the operation lost of the RSG-GAS reactor, operation using one line cooling system at certain power range is being evaluated. Analysis the performance of cooling system for determining maximum power should be carried out. Analysis was carried out based on heat exchanger calculation using actual operation data. Constraints imposed to the analysis are that inlet cooling system to the reactor core shall be less than 42 o C. The result shows that by using one line of primary and secondary coolant flow of 1780 m exp. 3/hr and 2000 m 3 /hr and secondary coolant temperature from the cooling tower of 38 o C, the primary coolant to the core will be reach 42 o C if reactor operated at power of 16 MW

CEA programme on gas cooled reactors

International Nuclear Information System (INIS)

Carre, F.; Fiorini, G.L.; Chapelot, Ph.; Gauthier, J.C.

2002-01-01

partly builds on the past experience of the CEA on gas cooled reactors (UNGG, HTR) and on the current effort to revive and update High Temperature Reactor technologies to support the development of modular helium cooled reactors (∼300 MWe) by Framatome-ANP and international partners. In this context, the CEA decided to focus prospective R and D work on the development of a consistent set of gas cooled nuclear systems ranging from medium term reactor projects for electricity generation and other applications (robust and secure export model, process heat, hydrogen production at very high temperature, plutonium burning) to a longer term vision of sustainable nuclear systems using fast neutrons with a closed and integrated fuel cycle. This range of gas cooled nuclear systems covers a wide variety of high temperature applications as well as a broad range of fuel cycles, including synergistic fuel cycles with light water reactors (i.e. burning plutonium and possibly also minor actinides from PWR spent fuels). A specific research and development programme is being currently implemented to support the development of this consistent set of gas cooled systems. The major emphasis is put on fuel particles re-fabrication and possible adaptations to fast neutrons, on high temperature materials, high temperature systems technology, and compact spent fuel processing and re-fabrication processes. This programme anticipates the construction of large experimental facilities in the next decade, such as an He integral test loop (2007), a technology testing reactor and a lab scaled integrated fuel cycle (2012). A substantial effort is also invested in the validation of computational tools and procedures for feasibility and performance studies. Strong connections with fundamental research (nuclear physics, materials science, nuclear chemistry) are essential to improve the modelling capability and to achieve effective breakthroughs for the development of high temperature and high irradiation

Pixel detector readout chip

CERN Multimedia

1991-01-01

Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

A Neuromorphic Approach for Tracking using Dynamic Neural Fields on a Programmable Vision-chip

OpenAIRE

Martel Julien N.P.; Sandamirskaya Yulia

2016-01-01

In artificial vision applications, such as tracking, a large amount of data captured by sensors is transferred to processors to extract information relevant for the task at hand. Smart vision sensors offer a means to reduce the computational burden of visual processing pipelines by placing more processing capabilities next to the sensor. In this work, we use a vision-chip in which a small processor with memory is located next to each photosensitive element. The architecture of this device is ...

Fast detection of genetic information by an optimized PCR in an interchangeable chip.

KAUST Repository

Wu, Jinbo

2012-02-01

In this paper, we report the construction of a polymerase chain reaction (PCR) device for fast amplification and detection of DNA. This device consists of an interchangeable PCR chamber, a temperature control component as well as an optical detection system. The DNA amplification happens on an interchangeable chip with the volumes as low as 1.25 μl, while the heating and cooling rate was as fast as 12.7°C/second ensuring that the total time needed of only 25 min to complete the 35 cycle PCR amplification. An optimized PCR with two-temperature approach for denaturing and annealing (Td and Ta) of DNA was also formulated with the PCR chip, with which the amplification of male-specific sex determining region Y (SRY) gene marker by utilizing raw saliva was successfully achieved and the genetic identification was in-situ detected right after PCR by the optical detection system.

Design and implementation of a multiaxial loading capability during heating on an engineering neutron diffractometer

Energy Technology Data Exchange (ETDEWEB)

Benafan, O., E-mail: othmane.benafan@nasa.gov [NASA Glenn Research Center, Structures and Materials Division, Cleveland, Ohio 44135 (United States); Advanced Materials Processing and Analysis Center, Materials Science and Engineering Department, University of Central Florida, Orlando, Florida 32816 (United States); Padula, S. A. [NASA Glenn Research Center, Structures and Materials Division, Cleveland, Ohio 44135 (United States); Skorpenske, H. D.; An, K. [Spallation Neutron Source, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831 (United States); Vaidyanathan, R. [Advanced Materials Processing and Analysis Center, Materials Science and Engineering Department, University of Central Florida, Orlando, Florida 32816 (United States)

2014-10-01

A gripping capability was designed, implemented, and tested for in situ neutron diffraction measurements during multiaxial loading and heating on the VULCAN engineering materials diffractometer at the spallation neutron source at Oak Ridge National Laboratory. The proposed capability allowed for the acquisition of neutron spectra during tension, compression, torsion, and/or complex loading paths at elevated temperatures. The design consisted of age-hardened, Inconel{sup ®} 718 grips with direct attachment to the existing MTS load frame having axial and torsional capacities of 100 kN and 400 N·m, respectively. Internal cooling passages were incorporated into the gripping system for fast cooling rates during high temperature experiments up to ~1000 K. The specimen mounting couplers combined a threaded and hexed end-connection for ease of sample installation/removal without introducing any unwanted loads. Instrumentation of this capability is documented in this work along with various performance parameters. The gripping system was utilized to investigate deformation in NiTi shape memory alloys under various loading/control modes (e.g., isothermal, isobaric, and cyclic), and preliminary results are presented. The measurements facilitated the quantification of the texture, internal strain, and phase fraction evolution in NiTi shape memory alloys under various loading/control modes.

Design and implementation of a multiaxial loading capability during heating on an engineering neutron diffractometer

International Nuclear Information System (INIS)

Benafan, O.; Padula, S. A.; Skorpenske, H. D.; An, K.; Vaidyanathan, R.

2014-01-01

A gripping capability was designed, implemented, and tested for in situ neutron diffraction measurements during multiaxial loading and heating on the VULCAN engineering materials diffractometer at the spallation neutron source at Oak Ridge National Laboratory. The proposed capability allowed for the acquisition of neutron spectra during tension, compression, torsion, and/or complex loading paths at elevated temperatures. The design consisted of age-hardened, Inconel ® 718 grips with direct attachment to the existing MTS load frame having axial and torsional capacities of 100 kN and 400 N·m, respectively. Internal cooling passages were incorporated into the gripping system for fast cooling rates during high temperature experiments up to ∼1000 K. The specimen mounting couplers combined a threaded and hexed end-connection for ease of sample installation/removal without introducing any unwanted loads. Instrumentation of this capability is documented in this work along with various performance parameters. The gripping system was utilized to investigate deformation in NiTi shape memory alloys under various loading/control modes (e.g., isothermal, isobaric, and cyclic), and preliminary results are presented. The measurements facilitated the quantification of the texture, internal strain, and phase fraction evolution in NiTi shape memory alloys under various loading/control modes

Use of a temperature-initiated passive cooling system (TIPACS) for the modular high-temperature gas-cooled reactor cavity cooling system (RCCS)

International Nuclear Information System (INIS)

Forsberg, C.W.; Conklin, J.; Reich, W.J.

1994-04-01

A new type of passive cooling system has been invented (Forsberg 1993): the Temperature-Initiated Passive Cooling System (TIPACS). The characteristics of the TIPACS potentially match requirements for an improved reactor-cavity-cooling system (RCCS) for the modular high-temperature gas-cooled reactor (MHTGR). This report is an initial evaluation of the TIPACS for the MHTGR with a Rankines (steam) power conversion cycle. Limited evaluations were made of applying the TIPACS to MHTGRs with reactor pressure vessel temperatures up to 450 C. These temperatures may occur in designs of Brayton cycle (gas turbine) and process heat MHTGRs. The report is structured as follows. Section 2 describes the containment cooling issues associated with the MHTGR and the requirements for such a cooling system. Section 3 describes TIPACS in nonmathematical terms. Section 4 describes TIPACS's heat-removal capabilities. Section 5 analyzes the operation of the temperature-control mechanism that determines under what conditions the TIPACS rejects heat to the environment. Section 6 addresses other design and operational issues. Section 7 identifies uncertainties, and Section 8 provides conclusions. The appendixes provide the detailed data and models used in the analysis

Use of a temperature-initiated passive cooling system (TIPACS) for the modular high-temperature gas-cooled reactor cavity cooling system (RCCS)

Energy Technology Data Exchange (ETDEWEB)

Forsberg, C.W.; Conklin, J.; Reich, W.J.

1994-04-01

A new type of passive cooling system has been invented (Forsberg 1993): the Temperature-Initiated Passive Cooling System (TIPACS). The characteristics of the TIPACS potentially match requirements for an improved reactor-cavity-cooling system (RCCS) for the modular high-temperature gas-cooled reactor (MHTGR). This report is an initial evaluation of the TIPACS for the MHTGR with a Rankines (steam) power conversion cycle. Limited evaluations were made of applying the TIPACS to MHTGRs with reactor pressure vessel temperatures up to 450 C. These temperatures may occur in designs of Brayton cycle (gas turbine) and process heat MHTGRs. The report is structured as follows. Section 2 describes the containment cooling issues associated with the MHTGR and the requirements for such a cooling system. Section 3 describes TIPACS in nonmathematical terms. Section 4 describes TIPACS`s heat-removal capabilities. Section 5 analyzes the operation of the temperature-control mechanism that determines under what conditions the TIPACS rejects heat to the environment. Section 6 addresses other design and operational issues. Section 7 identifies uncertainties, and Section 8 provides conclusions. The appendixes provide the detailed data and models used in the analysis.

On-Chip Microwave Quantum Hall Circulator

Directory of Open Access Journals (Sweden)

A. C. Mahoney

2017-01-01

Full Text Available Circulators are nonreciprocal circuit elements that are integral to technologies including radar systems, microwave communication transceivers, and the readout of quantum information devices. Their nonreciprocity arises from the interference of microwaves over the centimeter scale of the signal wavelength, in the presence of bulky magnetic media that breaks time-reversal symmetry. Here, we realize a completely passive on-chip microwave circulator with size 1/1000th the wavelength by exploiting the chiral, “slow-light” response of a two-dimensional electron gas in the quantum Hall regime. For an integrated GaAs device with 330  μm diameter and about 1-GHz center frequency, a nonreciprocity of 25 dB is observed over a 50-MHz bandwidth. Furthermore, the nonreciprocity can be dynamically tuned by varying the voltage at the port, an aspect that may enable reconfigurable passive routing of microwave signals on chip.

Solid state isotopic power source for computer chips

International Nuclear Information System (INIS)

Brown, P.M.

1992-01-01

This paper reports that recent developments in materials technology now make it possible to fabricate nonthermal thin-film isotopic energy converters (REC) with a specific power of 24 W/kg and 5 to 10 year working life at 5 to 10 Watts. This creates applications never before possible, such as placing the power supply directly on integrated circuit chips. The efficiency of the REC is about 25% which is two to three times greater than the 6 to 8% capabilities of current thermoelectric systems

Clock Technology Development for the Laser Cooling and Atomic Physics (LCAP) Program

Science.gov (United States)

Klipstein, W. M.; Thompson, R. J.; Seidel, D. J.; Kohel, J.; Maleki, L.

1998-01-01

The Time and Frequency Sciences and Technology Group at Jet Propulsion Laboratory (JPL) has developed a laser cooling capability for flight and has been selected by NASA to support the Laser-Cooling and Atomic Physics (LCAP) program. Current work in the group includes design and development for tee two laser-cooled atomic clock experiments which have been selected for flight on the International Space Station.

Performance characteristic of hybrid cooling system based on cooling pad and evaporator

Science.gov (United States)

Yoon, J. I.; Son, C. H.; Choi, K. H.; Kim, Y. B.; Sung, Y. H.; Roh, S. J.; Kim, Y. M.; Seol, S. H.

2018-01-01

In South Korea, most of domestic animals such as pigs and chickens might die due to thermal diseases if they are exposed to the high temperature consistently. In order to save them from the heat wave, numerous efforts have been carried out: installing a shade net, adjusting time of feeding, spraying mist and setting up a circulation fan. However, these methods have not shown significant improvements. Thus, this study proposes a hybrid cooling system combining evaporative cooler and air-conditioner in order to resolve the conventional problems caused by the high temperature in the livestock industry. The problem of cooling systems using evaporative cooling pads is that they are not effective for eliminating huge heat load due to their limited capacity. And, temperature of the supplied air cannot be low enough compared to conventional air-conditioning systems. On the other hand, conventional air-conditioning systems require relatively expensive installation cost, and high operating cost compared to evaporative cooling system. The hybrid cooling system makes up for the lack of cooling capacity of the evaporative cooler by employing the conventional air-conditioner. Additionally, temperature of supplied air can be lowered enough. In the hybrid cooling system, induced air by a fan is cooled by the evaporation of water in the cooling pad, and it is cooled again by an evaporator in the air-conditioner. Therefore, the more economical operation is possible due to additionally obtained cooling capacity from the cooling pads. Major results of experimental analysis of hybrid cooling system are as follows. The compressor power consumption of the hybrid cooling system is about 23% lower, and its COP is 17% higher than that of the conventional air-conditioners. Regarding the condition of changing ambient temperature, the total power consumption decreased by about 5% as the ambient temperature changed from 28.7°C to 31.7°C. Cooling capacity and COP also presented about 3% and 1

Designing network on-chip architectures in the nanoscale era

CERN Document Server

Flich, Jose

2010-01-01

Going beyond isolated research ideas and design experiences, Designing Network On-Chip Architectures in the Nanoscale Era covers the foundations and design methods of network on-chip (NoC) technology. The contributors draw on their own lessons learned to provide strong practical guidance on various design issues.Exploring the design process of the network, the first part of the book focuses on basic aspects of switch architecture and design, topology selection, and routing implementation. In the second part, contributors discuss their experiences in the industry, offering a roadmap to recent p

Seismic behaviour of gas cooled reactor components

International Nuclear Information System (INIS)

1990-08-01

On invitation of the French Government the Specialists' Meeting on the Seismic Behaviour of Gas-Cooled Reactor Components was held at Gif-sur-Yvette, 14-16 November 1989. This was the second Specialists' Meeting on the general subject of gas-cooled reactor seismic design. There were 27 participants from France, the Federal Republic of Germany, Israel, Japan, Spain, Switzerland, the United Kingdom, the Soviet Union, the United States, the CEC and IAEA took the opportunity to present and discuss a total of 16 papers reflecting the state of the art of gained experiences in the field of their seismic qualification approach, seismic analysis methods and of the capabilities of various facilities used to qualify components and verify analytical methods. Since the first meeting, the sophistication and expanded capabilities of both the seismic analytical methods and the test facilities are apparent. The two main methods for seismic analysis, the impedance method and the finite element method, have been computer-programmed in several countries with the capability of each of the codes dependent on the computer capability. The correlations between calculation and tests are dependent on input assumptions such as boundary conditions, soil parameters and various interactions between the soil, the buildings and the contained equipment. The ability to adjust these parameters and match experimental results with calculations was displayed in several of the papers. The expanded capability of some of the new test facilities was graphically displayed by the description of the SAMSON vibration test facility at Juelich, FRG, capable of dynamically testing specimens weighing up to 25 tonnes, and the TAMARIS facility at the CEA laboratories in Gif-sur-Yvette where the largest table is capable of testing specimens weighing up to 100 tonnes. The proceedings of this meeting contain all 16 presented papers. A separate abstract was prepared for each of these papers. Refs, figs and tabs

Advanced flip chip packaging

CERN Document Server

Lai, Yi-Shao; Wong, CP

2013-01-01

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

Various on-chip sensors with microfluidics for biological applications.

Science.gov (United States)

Lee, Hun; Xu, Linfeng; Koh, Domin; Nyayapathi, Nikhila; Oh, Kwang W

2014-09-12

In this paper, we review recent advances in on-chip sensors integrated with microfluidics for biological applications. Since the 1990s, much research has concentrated on developing a sensing system using optical phenomena such as surface plasmon resonance (SPR) and surface-enhanced Raman scattering (SERS) to improve the sensitivity of the device. The sensing performance can be significantly enhanced with the use of microfluidic chips to provide effective liquid manipulation and greater flexibility. We describe an optical image sensor with a simpler platform for better performance over a larger field of view (FOV) and greater depth of field (DOF). As a new trend, we review consumer electronics such as smart phones, tablets, Google glasses, etc. which are being incorporated in point-of-care (POC) testing systems. In addition, we discuss in detail the current optical sensing system integrated with a microfluidic chip.

Study on VCSEL laser heating chip in nuclear magnetic resonance gyroscope

Science.gov (United States)

Liang, Xiaoyang; Zhou, Binquan; Wu, Wenfeng; Jia, Yuchen; Wang, Jing

2017-10-01

In recent years, atomic gyroscope has become an important direction of inertial navigation. Nuclear magnetic resonance gyroscope has a stronger advantage in the miniaturization of the size. In atomic gyroscope, the lasers are indispensable devices which has an important effect on the improvement of the gyroscope performance. The frequency stability of the VCSEL lasers requires high precision control of temperature. However, the heating current of the laser will definitely bring in the magnetic field, and the sensitive device, alkali vapor cell, is very sensitive to the magnetic field, so that the metal pattern of the heating chip should be designed ingeniously to eliminate the magnetic field introduced by the heating current. In this paper, a heating chip was fabricated by MEMS process, i.e. depositing platinum on semiconductor substrates. Platinum has long been considered as a good resistance material used for measuring temperature The VCSEL laser chip is fixed in the center of the heating chip. The thermometer resistor measures the temperature of the heating chip, which can be considered as the same temperature of the VCSEL laser chip, by turning the temperature signal into voltage signal. The FPGA chip is used as a micro controller, and combined with PID control algorithm constitute a closed loop control circuit. The voltage applied to the heating resistor wire is modified to achieve the temperature control of the VCSEL laser. In this way, the laser frequency can be controlled stably and easily. Ultimately, the temperature stability can be achieved better than 100mK.

Analysis of Time-Dependent Tritium Breeding Capability of Water Cooled Ceramic Breeder Blanket for CFETR

Science.gov (United States)

Gao, Fangfang; Zhang, Xiaokang; Pu, Yong; Zhu, Qingjun; Liu, Songlin

2016-08-01

Attaining tritium self-sufficiency is an important mission for the Chinese Fusion Engineering Testing Reactor (CFETR) operating on a Deuterium-Tritium (D-T) fuel cycle. It is necessary to study the tritium breeding ratio (TBR) and breeding tritium inventory variation with operation time so as to provide an accurate data for dynamic modeling and analysis of the tritium fuel cycle. A water cooled ceramic breeder (WCCB) blanket is one candidate of blanket concepts for the CFETR. Based on the detailed 3D neutronics model of CFETR with the WCCB blanket, the time-dependent TBR and tritium surplus were evaluated by a coupling calculation of the Monte Carlo N-Particle Transport Code (MCNP) and the fusion activation code FISPACT-2007. The results indicated that the TBR and tritium surplus of the WCCB blanket were a function of operation time and fusion power due to the Li consumption in breeder and material activation. In addition, by comparison with the results calculated by using the 3D neutronics model and employing the transfer factor constant from 1D to 3D, it is noted that 1D analysis leads to an over-estimation for the time-dependent tritium breeding capability when fusion power is larger than 1000 MW. supported by the National Magnetic Confinement Fusion Science Program of China (Nos. 2013GB108004, 2015GB108002, and 2014GB119000), and by National Natural Science Foundation of China (No. 11175207)

Smart vision chips: An overview

Science.gov (United States)

Koch, Christof

1994-01-01

This viewgraph presentation presents four working analog VLSI vision chips: (1) time-derivative retina, (2) zero-crossing chip, (3) resistive fuse, and (4) figure-ground chip; work in progress on computing motion and neuromorphic systems; and conceptual and practical lessons learned.

Lab-on-a-Chip Instrument Development for Titan Exploration

Science.gov (United States)

Willis, P. A.; Greer, F.; Fisher, A.; Hodyss, R. P.; Grunthaner, F.; Jiao, H.; Mair, D.; Harrison, J.

2009-12-01

This contribution will describe the initial stages of a new ASTID-funded research program initiated in Fall 2009 aimed at lab-on-a-chip system development for astrobiological investigations on Titan. This technology development builds off related work at JPL and Berkeley [1-3] on the ultrasensitive compositional and chiral analysis of amino acids on Mars in order to search for signatures of past or present life. The Mars-focused instrument system utilizes a microcapillary electrophoresis (μCE) system integrated with on-chip perfluoropolyether (PFPE) membrane valves and pumps for automated liquid sample handling, on-chip derivitization of samples with fluorescent tags, dilution, and mixing with standards for data calibration. It utilizes a four-layer wafer stack design with CE channels patterned in glass, along with a PFPE membrane, a pneumatic manifold layer, and a fluidic bus layer. Three pneumatically driven on-chip diaphragm valves placed in series are used to peristaltically pump reagents, buffers, and samples to and from capillary electrophoresis electrode well positions. Electrophoretic separation occurs in the all-glass channels near the base of the structure. The Titan specific lab-on-a-chip system under development here focuses its attention on the unique organic chemistry of Titan. In order to chromatographically separate mixtures of neutral organics such as polycyclic aromatic hydrocarbons (PAHs), the Titan-specific microfluidic platform utilizes the related technique of microcapillary electrochromatography (μCEC). This technique differs from conventional μCE in that microchannels are filled with a porous stationary phase that presents surfaces upon which analyte species can adsorb/desorb. It is this additional surface interaction that enables separations of species critical to the understanding of the astrobiological potential of Titan that are not readily separated by the μCE technique. We have developed two different approaches for the integration

Modeling, analysis and optimization of network-on-chip communication architectures

CERN Document Server

Ogras, Umit Y

2013-01-01

Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. This book explores outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.

Preliminary Analysis on Heat Removal Capacity of Passive Air-Water Combined Cooling Heat Exchanger Using MARS

International Nuclear Information System (INIS)

Kim, Seung-Sin; Jeon, Seong-Su; Hong, Soon-Joon; Bae, Sung-Won; Kwon, Tae-Soon

2015-01-01

Current design requirement for working time of PAFS heat exchanger is about 8 hours. Thus, it is not satisfied with the required cooling capability for the long term SBO(Station Black-Out) situation that is required to over 72 hours cooling. Therefore PAFS is needed to change of design for 72 hours cooling. In order to acquirement of long terms cooling using PAFS, heat exchanger tube has to be submerged in water tank for long time. However, water in the tank is evaporated by transferred heat from heat exchanger tubes, so water level is gradually lowered as time goes on. The heat removal capacity of air cooling heat exchanger is core parameter that is used for decision of applicability on passive air-water combined cooling system using PAFS in long term cooling. In this study, the development of MARS input model and plant accident analysis are performed for the prediction of the heat removal capacity of air cooling heat exchanger. From analysis result, it is known that inflow air velocity is the decisive factor of the heat removal capacity and predicted air velocity is lower than required air velocity. But present heat transfer model and predicted air velocity have uncertainty. So, if changed design of PAFS that has over 4.6 kW heat removal capacity in each tube, this type heat exchanger can be applied to long term cooling of the nuclear power plant

On-chip graphene electrode, methods of making, and methods of use

KAUST Repository

Nayak, Pranati

2018-01-25

Embodiments of the present disclosure provide a device including an on-chip electrode platform including one or more three dimensional laser scribed graphene electrodes, methods of making the on-chip electrode platform, methods of analyzing (e.g., detecting, quantifying, and the like) chemicals and biochemicals, and the like.

Apparatus, System and Method for Fast Detection of Genetic Information by PCR in an Interchangeable Chip

KAUST Repository

Wen, Weijia

2011-03-03

A polymerase chain reaction (PCR) device for fast amplification and detection of DNA includes an interchangeable PCR chamber, a temperature control component, and an optical detection system. The DNA amplification is performed on an interchangeable chip with volumes as small as 1.25 µl, while the heating and cooling rate may be as fast as 12.7 °C/second ensuring that the total time needed of only 25 minutes to complete the 35 cycle PCR amplification. The PCR may be performed according to a two-temperature approach for denaturing and annealing (Td and Ta) of DNA with the PCR chip, with which the amplification of male-specific SRY gene marker by utilizing raw saliva may be achieved. The genetic identification may be in-situ detected after PCR by the optical detection system.

Preservation of forest wood chips

Energy Technology Data Exchange (ETDEWEB)

Kofman, P.D.; Thomsen, I.M.; Ohlsson, C.; Leer, E.; Ravn Schmidt, E.; Soerensen, M.; Knudsen, P.

1999-01-01

As part of the Danish Energy Research Programme on biomass utilisation for energy production (EFP), this project concerns problems connected to the handling and storing of wood chips. In this project, the possibility of preserving wood chips of the Norway Spruce (Picea Abies) is addressed, and the potential improvements by anaerobic storage are tested. Preservation of wood chips aims at reducing dry matter losses from extensive heating during storage and to reduce production of fungal spores. Fungal spores pose a health hazards to workers handling the chips. Further the producers of wood chips are interested in such a method since it would enable them to give a guarantee for the delivery of homogeneous wood chips also during the winter period. Three different types of wood chips were stored airtight and further one of these was stored in accordance with normal practise and use as reference. The results showed that airtight storage had a beneficial impact on the quality of the chips: no redistribution of moisture, low dry matter losses, unfavourable conditions for microbial activity of most fungi, and the promotion of yeasts instead of fungi with airborne spores. Likewise the firing tests showed that no combustion problems, and no increased risk to the environment or to the health of staff is caused by anaerobic storage of wood chips. In all, the tests of the anaerobic storage method of forest wood chips were a success and a large-scale test of the method will be carried out in 1999. (au)

A Miniaturized On-Chip Colorimeter for Detecting NPK Elements.

Science.gov (United States)

Liu, Rui-Tao; Tao, Lu-Qi; Liu, Bo; Tian, Xiang-Guang; Mohammad, Mohammad Ali; Yang, Yi; Ren, Tian-Ling

2016-08-04

Recently, precision agriculture has become a globally attractive topic. As one of the most important factors, the soil nutrients play an important role in estimating the development of precision agriculture. Detecting the content of nitrogen, phosphorus and potassium (NPK) elements more efficiently is one of the key issues. In this paper, a novel chip-level colorimeter was fabricated to detect the NPK elements for the first time. A light source-microchannel photodetector in a sandwich structure was designed to realize on-chip detection. Compared with a commercial colorimeter, all key parts are based on MEMS (Micro-Electro-Mechanical System) technology so that the volume of this on-chip colorimeter can be minimized. Besides, less error and high precision are achieved. The cost of this colorimeter is two orders of magnitude less than that of a commercial one. All these advantages enable a low-cost and high-precision sensing operation in a monitoring network. The colorimeter developed herein has bright prospects for environmental and biological applications.

On-Chip Correlator for Passive Wireless SAW Multisensor Systems

Directory of Open Access Journals (Sweden)

Liqiang Xie

2016-01-01

Full Text Available For decoding the asynchronous superposition of response signals from different sensors, it is a challenge to achieve correlation in a code division multiplexing (CDM based passive wireless surface acoustic wave (SAW multisensor system. Therefore, an on-chip correlator scheme is developed in this paper. In contrast to conventional CDM-based systems, this novel scheme enables the correlations to be operated at the SAW sensors, instead of the reader. Thus, the response signals arriving at the reader are the result of cross-correlation on the chips. It is then easy for the reader to distinguish the sensor that is matched with the interrogating signal. The operation principle, signal analysis, and simulation of the novel scheme are described in the paper. The simulation results show the response signals from the correlations of the sensors. A clear spike pulse is presented in the response signals, when a sensor code is matched with the interrogating code. Simulations verify the feasibility of the on-chip correlator concept.

Biosensors-on-chip: a topical review

International Nuclear Information System (INIS)

Chen, Sensen; Shamsi, Mohtashim H

2017-01-01

This review will examine the integration of two fields that are currently at the forefront of science, i.e. biosensors and microfluidics. As a lab-on-a-chip (LOC) technology, microfluidics has been enriched by the integration of various detection tools for analyte detection and quantitation. The application of such microfluidic platforms is greatly increased in the area of biosensors geared towards point-of-care diagnostics. Together, the merger of microfluidics and biosensors has generated miniaturized devices for sample processing and sensitive detection with quantitation. We believe that microfluidic biosensors (biosensors-on-chip) are essential for developing robust and cost effective point-of-care diagnostics. This review is relevant to a variety of disciplines, such as medical science, clinical diagnostics, LOC technologies including MEMs/NEMs, and analytical science. Specifically, this review will appeal to scientists working in the two overlapping fields of biosensors and microfluidics, and will also help new scientists to find their directions in developing point-of-care devices. (topical review)

Fundamental research on the cooling characteristic of passive containment cooling system

International Nuclear Information System (INIS)

Kawakubo, M.; Kikura, H.; Aritomi, M.; Inaba, N.; Yamauchi, T.

2004-01-01

The objective of this experimental study is to clarify the heat transfer characteristics of the Passive Containment Cooling System (PCCS) with vertical heat transfer tubes for investigating the influence of non-condensable gas on condensation. Furthermore, hence we obtained new experimental correlation formula to calculate the transients in system temperature and pressure using the simulation program of the PCCS. The research was carried out using a forced circulation experimental loop, which simulates atmosphere inside PCCS with vertical heat transfer tubes if a loss of coolant accident (LOCA) occurs. The experimental facility consists of cooling water supply systems, an orifice flowmeter, and a tank equipped with the heat transfer pipe inside. Cooling water at a constant temperature is injected to the test part of heat transfer pipe vertically installed in the tank by forced circulation. At that time, the temperature of the cooling water between inlet and outlet of the pipe was measured to calculate the overall heat transfer coefficient between the cooling water and atmosphere in the tank. Thus, the heat transfer coefficient between heat transfer surface and the atmosphere in the tank considering the influence of the non-condensable gas was clarified. An important finding of this study is that the amount of condensation in the steamy atmosphere including non-condensable gas depends on the cooling water Reynolds number, especially the concentration of non-condensable gas that has great influence on the amount of condensation. (authors)

Flip chip assembly of thinned chips for hybrid pixel detector applications

CERN Document Server

Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D

2014-01-01

There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

Various On-Chip Sensors with Microfluidics for Biological Applications

Directory of Open Access Journals (Sweden)

Hun Lee

2014-09-01

Full Text Available In this paper, we review recent advances in on-chip sensors integrated with microfluidics for biological applications. Since the 1990s, much research has concentrated on developing a sensing system using optical phenomena such as surface plasmon resonance (SPR and surface-enhanced Raman scattering (SERS to improve the sensitivity of the device. The sensing performance can be significantly enhanced with the use of microfluidic chips to provide effective liquid manipulation and greater flexibility. We describe an optical image sensor with a simpler platform for better performance over a larger field of view (FOV and greater depth of field (DOF. As a new trend, we review consumer electronics such as smart phones, tablets, Google glasses, etc. which are being incorporated in point-of-care (POC testing systems. In addition, we discuss in detail the current optical sensing system integrated with a microfluidic chip.

Spatially resolved photoionization of ultracold atoms on an atom chip

International Nuclear Information System (INIS)

Kraft, S.; Guenther, A.; Fortagh, J.; Zimmermann, C.

2007-01-01

We report on photoionization of ultracold magnetically trapped Rb atoms on an atom chip. The atoms are trapped at 5 μK in a strongly anisotropic trap. Through a hole in the chip with a diameter of 150 μm, two laser beams are focused onto a fraction of the atomic cloud. A first laser beam with a wavelength of 778 nm excites the atoms via a two-photon transition to the 5D level. With a fiber laser at 1080 nm the excited atoms are photoionized. Ionization leads to depletion of the atomic density distribution observed by absorption imaging. The resonant ionization spectrum is reported. The setup used in this experiment is suitable not only to investigate mixtures of Bose-Einstein condensates and ions but also for single-atom detection on an atom chip

Assessment of the transmutation capability an accelerator driven system cooled by lead bismuth eutectic alloy

International Nuclear Information System (INIS)

Bianchi, F.; Peluso, V.; Calabrese; Chen, X.; Maschek, W.

2007-01-01

1. PURPOSE The reduction of long-lived fission products (LLFP) and minor actinides (MA) is a key point for the public acceptability and economy of nuclear energy. In principle, any nuclear fast reactor is able to burn and transmute MA, but the amount of MA content has to be limited a few percent, having unfavourable consequences on the coolant void reactivity, Doppler effect, and delayed neutron fraction, and therefore on the dynamic behaviour and control. Accelerator Driven Systems (ADS) are instead able to safely burn and/or transmute a large quantity of actinides and LLFP, as they do not rely on delayed neutrons for control or power change and the reactivity feedbacks have very little importance during accidents. Such systems are very innovative being based on the coupling of an accelerator with a subcritical system by means of a target system, where the neutronic source needed to maintain the neutron reaction chain is produced by spallation reactions. To this end the PDS-XADS (Preliminary Design Studies on an experimental Accelerator Driven System) project was funded by the European Community in the 5th Framework Program in order both to demonstrate the feasibility of the coupling between an accelerator and a sub-critical core loaded with standard MOX fuel and to investigate the transmutation capability in order to achieve values suitable for an Industrial Scale Transmuter. This paper summarizes and compares the results of neutronic calculations aimed at evaluating the transmutation capability of cores cooled by Lead-Bismuth Eutectic alloy and loaded with assemblies based on (Pu, Am, Cm) oxide dispersed in a molybdenum metal (CERMET) or magnesia (CERCER) matrices. It also describes the constraints considered in the design of such cores and describes the thermo-mechanical behaviour of these innovative fuels along the cycle. 2. DESCRIPTION OF THE WORK: The U-free composite fuels (CERMET and CERCER) were selected for this study, being considered at European level

Development of biofactory-on-a-chip technology

Science.gov (United States)

Zhou, Xiao-Feng; Burt, Julian P.; Talary, Mark S.; Goater, Andrew D.; Pethig, Ron

2000-08-01

The miniaturised Biofactory-on-a-Chip devices described here are integrated systems capable of the rapid analysis of small volume particulate samples and have applications in areas such as medical and biological cell diagnostics, chemical detection and water quality control. The devices use the A.C. electrokinetic phenomena of dielectrophoresis, travelling wave dielectrophoresis and electrorotation to manipulate, separate and characterise particle systems by exploiting their dielectric properties. Biofactory fabrication makes use of conventional photolithographic processes along with precision excimer laser ablation based micromachining. Using this combination of technologies, a wide range of manufacturing issues have been addressed and are discussed here. For instance, reliable interconnection of multilayer electrodes has been achieved using laser machining of via- holes between lithographically produced electrodues. Also, accurate fluidic microchannel systems with varying curved cross-sections that allow the smooth transport of a sample through the device whilst eliminating problems of particle trapping have been developed using excimer laser machining. Although the biofactory devices presented here have been applied to the fractionation of micro-organisms such as E. coli from red blood cells, the flexibility of design allows these devices to perform a wide range of complex bioprocessing function in a single, low-cost and miniaturised package.

Low-noise cooling system for PC on the base of loop heat pipes

International Nuclear Information System (INIS)

Pastukhov, Vladimir G.; Maydanik, Yury F.

2007-01-01

The problem of current importance connected with a wide use of personal computers (PC) and a rapid growth of their performance is a decrease in the noise level created at the operation of cooling system fans. One of the possible ways of solving this problem may be the creation of passive or semi-passive systems on the base of loop heat pipes (LHPs) in which the heat sink is an external radiator cooled by natural and/or forced air convection. The paper presents the results of development and tests of several variants of such systems, which are capable of sustaining an operating temperature of 72-78 deg. C on the heat source thermal interface which dissipates 100 W at an ambient temperature of 22 deg. C. It is also shown that the use of additional means of active cooling in combination with LHPs allows to increase the value of dissipated heat up to 180 W and to decrease the system thermal resistance down to 0.29 deg. C/W

SNP typing on the NanoChip electronic microarray

DEFF Research Database (Denmark)

Børsting, Claus; Sanchez Sanchez, Juan Jose; Morling, Niels

2005-01-01

We describe a single nucleotide polymorphism (SNP) typing protocol developed for the NanoChip electronic microarray. The NanoChip array consists of 100 electrodes covered by a thin hydrogel layer containing streptavidin. An electric currency can be applied to one, several, or all electrodes...

Recent advances in lab-on-a-chip for biosensing applications

DEFF Research Database (Denmark)

Lafleur, Josiane P.; Jönsson, Alexander; Senkbeil, Silja

2016-01-01

The marriage of highly sensitive biosensor designs with the versatility in sample handling and fluidic manipulation offered by lab-on-a-chip systems promises to yield powerful tools for analytical and, in particular, diagnostic applications. The field where these two technologies meet is rapidly...... improvements to existing methods. Recent examples, showing a staggering variety of lab-on-a-chip systems for biosensing applications, are presented, tabularized for overview, and briefly discussed....

Study of a Microfluidic Chip Integrating Single Cell Trap and 3D Stable Rotation Manipulation

Directory of Open Access Journals (Sweden)

Liang Huang

2016-08-01

Full Text Available Single cell manipulation technology has been widely applied in biological fields, such as cell injection/enucleation, cell physiological measurement, and cell imaging. Recently, a biochip platform with a novel configuration of electrodes for cell 3D rotation has been successfully developed by generating rotating electric fields. However, the rotation platform still has two major shortcomings that need to be improved. The primary problem is that there is no on-chip module to facilitate the placement of a single cell into the rotation chamber, which causes very low efficiency in experiment to manually pipette single 10-micron-scale cells into rotation position. Secondly, the cell in the chamber may suffer from unstable rotation, which includes gravity-induced sinking down to the chamber bottom or electric-force-induced on-plane movement. To solve the two problems, in this paper we propose a new microfluidic chip with manipulation capabilities of single cell trap and single cell 3D stable rotation, both on one chip. The new microfluidic chip consists of two parts. The top capture part is based on the least flow resistance principle and is used to capture a single cell and to transport it to the rotation chamber. The bottom rotation part is based on dielectrophoresis (DEP and is used to 3D rotate the single cell in the rotation chamber with enhanced stability. The two parts are aligned and bonded together to form closed channels for microfluidic handling. Using COMSOL simulation and preliminary experiments, we have verified, in principle, the concept of on-chip single cell traps and 3D stable rotation, and identified key parameters for chip structures, microfluidic handling, and electrode configurations. The work has laid a solid foundation for on-going chip fabrication and experiment validation.

Silicon based cryogenic platform for the integration of qubit and classical control chips

Science.gov (United States)

Leonhardt, T.; Hollmann, A.; Jirovec, D.; Neumann, R.; Klemt, B.; Kindel, S.; Kucharski, M.; Fischer, G.; Bougeard, D.; Bluhm, H.; Schreiber, L. R.

Electrostatically confined electron-spin-qubits proved viable for quantum information processing. Yet their up-scaling not only demands improvement of physical qubits, but also the development and cryogenic integration of classical control hardware. Therefore, we created a platform to integrate quantum chips and classical electronics. These multilayer interposer chips incorporate passive circuit elements, high bandwidth coplanar wave guides and interconnects for electron spin resonant qubit control as well as low impedance DC microstrips reducing EM-crosstalk from AC to DC lines. We used the interposer for measurements of a Si/SiGe quantum dot at 30 mK. We also characterized a commercial voltage controlled oszillator (VCO) based on hetero-bipolar transistors. Tunable about 30 GHz it is ideal for electron spin resonant qubit control. Cooled from 300 to 4 K it exhibits a slightly increased output power and frequency, while the phase noise level is constant. The device remains functional up to magnetic fields of 6 T.

UW VLSI chip tester

Science.gov (United States)

McKenzie, Neil

1989-12-01

We present a design for a low-cost, functional VLSI chip tester. It is based on the Apple MacIntosh II personal computer. It tests chips that have up to 128 pins. All pin drivers of the tester are bidirectional; each pin is programmed independently as an input or an output. The tester can test both static and dynamic chips. Rudimentary speed testing is provided. Chips are tested by executing C programs written by the user. A software library is provided for program development. Tests run under both the Mac Operating System and A/UX. The design is implemented using Xilinx Logic Cell Arrays. Price/performance tradeoffs are discussed.

Thermo-Elastic Analysis of Internally Cooled Structures Using a Higher Order Theory

Science.gov (United States)

Arnold, Steven M.; Bednarcyk, Brett A.; Aboudi, Jacob

2001-01-01

This paper presents the results of a study on the thermomechanical behavior of internally cooled silicon nitride structures. Silicon nitride is under consideration for elevated temperature aerospace engine applications. and techniques for lowering the operating temperature of structures composed of this material are under development. Lowering the operating temperature provides a large payoff in terms of fatigue life and may be accomplished through the use of thermal barrier coatings (TBC's) and the novel concept of included cooling channels. Herein, an in-depth study is performed on the behavior of a flame-impinged silicon nitride plate with a TBC and internal channels cooled by forced air. The analysis is performed using the higher order theory for functionally graded materials (HOTFGM), which has been developed through NASA Glenn Research Center funding over the past several years. HOTFGM was chosen over the traditional finite element approach as a prelude to an examination of functionally graded silicon nitride structures for which HOTFGM is ideally suited. To accommodate the analysis requirement% of the internally cooled plate problem, two crucial enhancements were made to the two-dimensional Cartesian-based version of HOTFGM. namely, incorporation of internal boundary capabilities and incorporation of convective boundary conditions. Results indicate the viability and large benefits of cooling the plate via forced air through cooling channels. Furthermore, cooling can positively impact the stress and displacement fields present in the plate, yielding an additional payoff in terms of fatigue life. Finally, a spin-off capability resulted from inclusion of internal boundaries within HOTFGM; the ability to simulate the thermo-elastic response of structures with curved surfaces. This new capability is demonstrated, and through comparison with an analytical solution, shown to be viable and accurate.

Cytostretch, an Organ-on-Chip Platform

NARCIS (Netherlands)

Gaio, N.; van Meer, B.; Quiros Solano, W.F.; Bergers, L.; van de Stolpe, A; Mummery, CL; Sarro, P.M.; Dekker, R.

2016-01-01

Organ-on-Chips (OOCs) are micro-fabricated devices which are used to culture cells in order to mimic functional units of human organs. The devices are designed to simulate the physiological environment of tissues in vivo. Cells in some types of OOCs can be stimulated in situ by electrical and/or

Introduction to Open Core Protocol Fastpath to System-on-Chip Design

CERN Document Server

Schwaderer, W David

2012-01-01

This book introduces Open Core Protocol (OCP), not as a conventional hardware communications protocol but as a meta-protocol: a means for describing and capturing the communications requirements of an IP core, and mapping them to a specific set of signals with known semantics.  Readers will learn the capabilities of OCP as a semiconductor hardware interface specification that allows different System-On-Chip (SoC) cores to communicate.  The OCP methodology presented enables intellectual property designers to design core interfaces in standard ways. This facilitates reusing OCP-compliant cores across multiple SoC designs which, in turn, drastically reduces design times, support costs, and overall cost for electronics/SoCs. Provides a comprehensive introduction to Open Core Protocol, which is more accessible than the full specification; Designed as a hands-on, how-to guide to semiconductor design; Includes numerous, real “usage examples” which are not available in the full specification; Integrates coverag...

Workshop on beam cooling and related topics

International Nuclear Information System (INIS)

Bosser, J.

1994-01-01

The sessions of the Workshop on Beam Cooling and Related Topics, held in Montreux from 4-8 October 1993, are reported in these Proceedings. This meeting brought together international experts in the field of accelerator beam cooling. Its purpose was to discuss the status of the different cooling techniques currently in use (stochastic, electron, ionization, heavy-ion, and laser) and their actual performances, technological implications, and future prospects. Certain theoretical principles (muon cooling, cyclotron maser cooling) were discussed and are reported on in these Proceedings. Also of interest in this Workshop was the possibility of beam crystallization in accelerators using ultimate cooling. In the first part of these Proceedings, overview talks on the various cooling techniques, their implications, present performance, and future prospects are presented. More detailed reports on all the topics are then given in the form of oral presentations or poster sessions. Finally, the chairmen and/or convenors then present summary talks. (orig.)

Scalable Motion Estimation Processor Core for Multimedia System-on-Chip Applications

Science.gov (United States)

Lai, Yeong-Kang; Hsieh, Tian-En; Chen, Lien-Fei

2007-04-01

In this paper, we describe a high-throughput and scalable motion estimation processor architecture for multimedia system-on-chip applications. The number of processing elements (PEs) is scalable according to the variable algorithm parameters and the performance required for different applications. Using the PE rings efficiently and an intelligent memory-interleaving organization, the efficiency of the architecture can be increased. Moreover, using efficient on-chip memories and a data management technique can effectively decrease the power consumption and memory bandwidth. Techniques for reducing the number of interconnections and external memory accesses are also presented. Our results demonstrate that the proposed scalable PE-ringed architecture is a flexible and high-performance processor core in multimedia system-on-chip applications.

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

Science.gov (United States)

Shulaker, Max M.; Hills, Gage; Park, Rebecca S.; Howe, Roger T.; Saraswat, Krishna; Wong, H.-S. Philip; Mitra, Subhasish

2017-07-01

The computing demands of future data-intensive applications will greatly exceed the capabilities of current electronics, and are unlikely to be met by isolated improvements in transistors, data storage technologies or integrated circuit architectures alone. Instead, transformative nanosystems, which use new nanotechnologies to simultaneously realize improved devices and new integrated circuit architectures, are required. Here we present a prototype of such a transformative nanosystem. It consists of more than one million resistive random-access memory cells and more than two million carbon-nanotube field-effect transistors—promising new nanotechnologies for use in energy-efficient digital logic circuits and for dense data storage—fabricated on vertically stacked layers in a single chip. Unlike conventional integrated circuit architectures, the layered fabrication realizes a three-dimensional integrated circuit architecture with fine-grained and dense vertical connectivity between layers of computing, data storage, and input and output (in this instance, sensing). As a result, our nanosystem can capture massive amounts of data every second, store it directly on-chip, perform in situ processing of the captured data, and produce ‘highly processed’ information. As a working prototype, our nanosystem senses and classifies ambient gases. Furthermore, because the layers are fabricated on top of silicon logic circuitry, our nanosystem is compatible with existing infrastructure for silicon-based technologies. Such complex nano-electronic systems will be essential for future high-performance and highly energy-efficient electronic systems.

Chips 2020

CERN Document Server

2016-01-01

The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising  Moore-like exponential g...

Property-driven functional verification technique for high-speed vision system-on-chip processor

Science.gov (United States)

Nshunguyimfura, Victor; Yang, Jie; Liu, Liyuan; Wu, Nanjian

2017-04-01

The implementation of functional verification in a fast, reliable, and effective manner is a challenging task in a vision chip verification process. The main reason for this challenge is the stepwise nature of existing functional verification techniques. This vision chip verification complexity is also related to the fact that in most vision chip design cycles, extensive efforts are focused on how to optimize chip metrics such as performance, power, and area. Design functional verification is not explicitly considered at an earlier stage at which the most sound decisions are made. In this paper, we propose a semi-automatic property-driven verification technique. The implementation of all verification components is based on design properties. We introduce a low-dimension property space between the specification space and the implementation space. The aim of this technique is to speed up the verification process for high-performance parallel processing vision chips. Our experimentation results show that the proposed technique can effectively improve the verification effort up to 20% for the complex vision chip design while reducing the simulation and debugging overheads.

Utility of lab-on-a-chip technology for high-throughput nucleic acid and protein analysis

DEFF Research Database (Denmark)

Hawtin, Paul; Hardern, Ian; Wittig, Rainer

2005-01-01

On-chip electrophoresis can provide size separations of nucleic acids and proteins similar to more traditional slab gel electrophoresis. Lab-on-a-chip (LoaC) systems utilize on-chip electrophoresis in conjunction with sizing calibration, sensitive detection schemes, and sophisticated data analysi...

Embedded Adaptive Optics for Ubiquitous Lab-on-a-Chip Readout on Intact Cell Phones

Directory of Open Access Journals (Sweden)

Pakorn Preechaburana

2012-06-01

Full Text Available The evaluation of disposable lab-on-a-chip (LOC devices on cell phones is an attractive alternative to migrate the analytical strength of LOC solutions to decentralized sensing applications. Imaging the micrometric detection areas of LOCs in contact with intact phone cameras is central to provide such capability. This work demonstrates a disposable and morphing liquid lens concept that can be integrated in LOC devices and refocuses micrometric features in the range necessary for LOC evaluation using diverse cell phone cameras. During natural evaporation, the lens focus varies adapting to different type of cameras. Standard software in the phone commands a time-lapse acquisition for best focal selection that is sufficient to capture and resolve, under ambient illumination, 50 μm features in regions larger than 500 × 500 μm². In this way, the present concept introduces a generic solution compatible with the use of diverse and unmodified cell phone cameras to evaluate disposable LOC devices.

On-chip single photon filtering and multiplexing in hybrid quantum photonic circuits.

Science.gov (United States)

Elshaari, Ali W; Zadeh, Iman Esmaeil; Fognini, Andreas; Reimer, Michael E; Dalacu, Dan; Poole, Philip J; Zwiller, Val; Jöns, Klaus D

2017-08-30

Quantum light plays a pivotal role in modern science and future photonic applications. Since the advent of integrated quantum nanophotonics different material platforms based on III-V nanostructures-, colour centers-, and nonlinear waveguides as on-chip light sources have been investigated. Each platform has unique advantages and limitations; however, all implementations face major challenges with filtering of individual quantum states, scalable integration, deterministic multiplexing of selected quantum emitters, and on-chip excitation suppression. Here we overcome all of these challenges with a hybrid and scalable approach, where single III-V quantum emitters are positioned and deterministically integrated in a complementary metal-oxide-semiconductor-compatible photonic circuit. We demonstrate reconfigurable on-chip single-photon filtering and wavelength division multiplexing with a foot print one million times smaller than similar table-top approaches, while offering excitation suppression of more than 95 dB and efficient routing of single photons over a bandwidth of 40 nm. Our work marks an important step to harvest quantum optical technologies' full potential.Combining different integration platforms on the same chip is currently one of the main challenges for quantum technologies. Here, Elshaari et al. show III-V Quantum Dots embedded in nanowires operating in a CMOS compatible circuit, with controlled on-chip filtering and tunable routing.

Optical chromatography using a photonic crystal fiber with on-chip fluorescence excitation

CSIR Research Space (South Africa)

Ashok, AC

2010-03-01

Full Text Available The authors describe the realization of integrated optical chromatography, in conjunction with on-chip fluorescence excitation, in a monolithically fabricated poly-dimethylsiloxane (PDMS) microfluidic chip. The unique endlessly-single-mode guiding...

TSR: A storage and cooling ring for HIE-ISOLDE

Energy Technology Data Exchange (ETDEWEB)

Butler, P.A. [Oliver Lodge Laboratory, University of Liverpool, Liverpool L69 7ZE (United Kingdom); Blaum, K. [Max-Planck-Institut für Kernphysik, 69117 Heidelberg (Germany); Davinson, T. [School of Physics and Astronomy, University of Edinburgh, Edinburgh EH9 3JZ (United Kingdom); Flanagan, K.; Freeman, S.J. [School of Physics and Astronomy, University of Manchester, Manchester M13 9PL (United Kingdom); Grieser, M. [Max-Planck-Institut für Kernphysik, 69117 Heidelberg (Germany); Lazarus, I.H. [S.T.F.C. Daresbury Laboratory, Warrington WA4 4AD (United Kingdom); Litvinov, Yu.A. [Max-Planck-Institut für Kernphysik, 69117 Heidelberg (Germany); GSI Helmholtzzentrum für Schwerionenforschung, 64291 Darmstadt (Germany); Lotay, G. [Department of Physics, University of Surrey, Guildford GU2 7XH (United Kingdom); Page, R.D. [Oliver Lodge Laboratory, University of Liverpool, Liverpool L69 7ZE (United Kingdom); Raabe, R. [KU Leuven, Instituut voor Kern- en Stralingsfysica, 3001 Leuven (Belgium); Siesling, E.; Wenander, F. [CERN, 1211 Geneva 23 (Switzerland); Woods, P.J. [School of Physics and Astronomy, University of Edinburgh, Edinburgh EH9 3JZ (United Kingdom)

2016-06-01

It is planned to install the heavy-ion, low-energy ring TSR, currently at the Max-Planck-Institute for Nuclear Physics in Heidelberg, at the HIE-ISOLDE facility in CERN, Geneva. Such a facility will provide a capability for experiments with stored, cooled secondary beams that is rich and varied, spanning from studies of nuclear ground-state properties and reaction studies of astrophysical relevance, to investigations with highly-charged ions and pure isomeric beams. In addition to experiments performed using beams recirculating within the ring, the cooled beams can be extracted and exploited by external spectrometers for high-precision measurements. The capabilities of the ring facility as well as some physics cases will be presented, together with a brief report on the status of the project.

Versatile single-chip event sequencer for atomic physics experiments

Science.gov (United States)

Eyler, Edward

2010-03-01

A very inexpensive dsPIC microcontroller with internal 32-bit counters is used to produce a flexible timing signal generator with up to 16 TTL-compatible digital outputs, with a time resolution and accuracy of 50 ns. This time resolution is easily sufficient for event sequencing in typical experiments involving cold atoms or laser spectroscopy. This single-chip device is capable of triggered operation and can also function as a sweeping delay generator. With one additional chip it can also concurrently produce accurately timed analog ramps, and another one-chip addition allows real-time control from an external computer. Compared to an FPGA-based digital pattern generator, this design is slower but simpler and more flexible, and it can be reprogrammed using ordinary `C' code without special knowledge. I will also describe the use of the same microcontroller with additional hardware to implement a digital lock-in amplifier and PID controller for laser locking, including a simple graphics-based control unit. This work is supported in part by the NSF.

Assessment on the Reactor Containment Cooling Capability of Kori Unit 1 Under LOCA Conditions with Loss of Offsite Power

International Nuclear Information System (INIS)

Lee, Jin Yong; Park, Jong Woon; Kim, Hyeong Taek

2006-01-01

The fan cooler system is designed to remove heat from containment under postulated accident conditions. During a postulated LOCA concurrent with a Loss of Offsite Power (LOOP), the Component Cooling Water (CCW) pumps that supply cooling water to the fan cooler and the fan that supplies containment air to the fan cooler will temporarily lose power. Then, the high temperature steam in the containment atmosphere will pass over the fan cooler tubing without forced cooling water flow. In that case, boiling may occur in the fan cooler tubes causing steam bubbles to form and pass into the attached CCW piping creating steam voids. Prior to the CCW pumps restart, the presence of steam and subcooled water can induce the potential for water hammer. As the CCW pumps restart, the accumulated steam condenses and the pumped water can produce a water hammer when the void closes. The hydrodynamic loads caused by such a water hammer event could challenge the integrity and the function of the fan cooler and associated CCW system. With respect to this phenomena, the United States Nuclear Regulatory Commission (USNRC) issued the Generic Letter (GL) 96-06, which requests an assessment of the possibility of boiling and water hammer in the cooling water system. The objectives of this study are to develop a analysis method for predicting the thermal hydraulic status of containment fan cooler and then to assess the containment fan cooler of Kori Unit 1 using the developed model under a LOCA with LOOP

On-Chip Laser-Power Delivery System for Dielectric Laser Accelerators

Science.gov (United States)

Hughes, Tyler W.; Tan, Si; Zhao, Zhexin; Sapra, Neil V.; Leedle, Kenneth J.; Deng, Huiyang; Miao, Yu; Black, Dylan S.; Solgaard, Olav; Harris, James S.; Vuckovic, Jelena; Byer, Robert L.; Fan, Shanhui; England, R. Joel; Lee, Yun Jo; Qi, Minghao

2018-05-01

We propose an on-chip optical-power delivery system for dielectric laser accelerators based on a fractal "tree-network" dielectric waveguide geometry. This system replaces experimentally demanding free-space manipulations of the driving laser beam with chip-integrated techniques based on precise nanofabrication, enabling access to orders-of-magnitude increases in the interaction length and total energy gain for these miniature accelerators. Based on computational modeling, in the relativistic regime, our laser delivery system is estimated to provide 21 keV of energy gain over an acceleration length of 192 μ m with a single laser input, corresponding to a 108-MV/m acceleration gradient. The system may achieve 1 MeV of energy gain over a distance of less than 1 cm by sequentially illuminating 49 identical structures. These findings are verified by detailed numerical simulation and modeling of the subcomponents, and we provide a discussion of the main constraints, challenges, and relevant parameters with regard to on-chip laser coupling for dielectric laser accelerators.

On-chip mode division multiplexing technologies

DEFF Research Database (Denmark)

Ding, Yunhong; Frellsen, Louise Floor; Guan, Xiaowei

2016-01-01

Space division multiplexing (SDM) is currently widely investigated in order to provide enhanced capacity thanks to the utilization of space as a new degree of multiplexing freedom in both optical fiber communication and on-chip interconnects. Basic components allowing the processing of spatial...... photonic integrated circuit mode (de) multiplexer for few-mode fibers (FMFs)....

Organ-on-a-Chip: New Platform for Biological Analysis

Directory of Open Access Journals (Sweden)

Fan An

2015-01-01

Full Text Available Direct detection and analysis of biomolecules and cells in physiological microenvironment is urgently needed for fast evaluation of biology and pharmacy. The past several years have witnessed remarkable development opportunities in vitro organs and tissues models with multiple functions based on microfluidic devices, termed as “organ-on-a-chip”. Briefly speaking, it is a promising technology in rebuilding physiological functions of tissues and organs, featuring mammalian cell co-culture and artificial microenvironment created by microchannel networks. In this review, we summarized the advances in studies of heart-, vessel-, liver-, neuron-, kidney- and Multi-organs-on-a-chip, and discussed some noteworthy potential on-chip detection schemes.

A compact imaging spectroscopic system for biomolecular detections on plasmonic chips.

Science.gov (United States)

Lo, Shu-Cheng; Lin, En-Hung; Wei, Pei-Kuen; Tsai, Wan-Shao

2016-10-17

In this study, we demonstrate a compact imaging spectroscopic system for high-throughput detection of biomolecular interactions on plasmonic chips, based on a curved grating as the key element of light diffraction and light focusing. Both the curved grating and the plasmonic chips are fabricated on flexible plastic substrates using a gas-assisted thermal-embossing method. A fiber-coupled broadband light source and a camera are included in the system. Spectral resolution within 1 nm is achieved in sensing environmental index solutions and protein bindings. The detected sensitivities of the plasmonic chip are comparable with a commercial spectrometer. An extra one-dimensional scanning stage enables high-throughput detection of protein binding on a designed plasmonic chip consisting of several nanoslit arrays with different periods. The detected resonance wavelengths match well with the grating equation under an air environment. Wavelength shifts between 1 and 9 nm are detected for antigens of various concentrations binding with antibodies. A simple, mass-productive and cost-effective method has been demonstrated on the imaging spectroscopic system for real-time, label-free, highly sensitive and high-throughput screening of biomolecular interactions.

The MuCool Test Area and RF Program

International Nuclear Information System (INIS)

Torun, Y.; Huang, D.; Norem, J.; Palmer, Robert B.; Stratakis, Diktys; Bross, A.; Chung, M.; Jansson, A.; Moretti, A.; Yonehara, K.; Li, D.

2010-01-01

The MuCool RF Program focuses on the study of normal conducting RF structures operating in high magnetic field for applications in muon ionization cooling for Neutrino Factories and Muon Colliders. Here we give an overview of the program, which includes a description of the test facility and its capabilities, the current test program, and the status of a cavity that can be rotated in the magnetic field, which allows for a detailed study of the maximum stable operating gradient vs. magnetic field strength and angle.

On synthesis and optimization of cooling water systems with multiple cooling towers

CSIR Research Space (South Africa)

Gololo, KV

2011-01-01

Full Text Available -1 On Synthesis and Optimization of Cooling Water Systems with Multiple Cooling Towers Khunedi Vincent Gololo?? and Thokozani Majozi*? ? Department of Chemical Engineering, University of Pretoria, Lynnwood Road, Pretoria, 0002, South Africa ? Modelling...

Qubit entanglement between ring-resonator photon-pair sources on a silicon chip

Science.gov (United States)

Silverstone, J. W.; Santagati, R.; Bonneau, D.; Strain, M. J.; Sorel, M.; O'Brien, J. L.; Thompson, M. G.

2015-01-01

Entanglement—one of the most delicate phenomena in nature—is an essential resource for quantum information applications. Scalable photonic quantum devices must generate and control qubit entanglement on-chip, where quantum information is naturally encoded in photon path. Here we report a silicon photonic chip that uses resonant-enhanced photon-pair sources, spectral demultiplexers and reconfigurable optics to generate a path-entangled two-qubit state and analyse its entanglement. We show that ring-resonator-based spontaneous four-wave mixing photon-pair sources can be made highly indistinguishable and that their spectral correlations are small. We use on-chip frequency demultiplexers and reconfigurable optics to perform both quantum state tomography and the strict Bell-CHSH test, both of which confirm a high level of on-chip entanglement. This work demonstrates the integration of high-performance components that will be essential for building quantum devices and systems to harness photonic entanglement on the large scale. PMID:26245267

Price of forest chips decreasing

International Nuclear Information System (INIS)

Hakkila, P.

2001-01-01

Use of forest chips was studied in 1999 in the national Puuenergia (Wood Energy) research program. Wood combusting heating plants were questioned about are the main reasons restricting the increment of the use of forest chips. Heating plants, which did not use forest chips at all or which used less than 250 m 3 (625 bulk- m 3 ) in 1999 were excluded. The main restrictions for additional use of forest chips were: too high price of forest chips; lack of suppliers and/or uncertainty of deliveries; technical problems of reception and processing of forest chips; insufficiency of boiler output especially in winter; and unsatisfactory quality of chips. The price of forest chips becomes relatively high because wood biomass used for production of forest chips has to be collected from wide area. Heavy equipment has to be used even though small fragments of wood are processed, which increases the price of chips. It is essential for forest chips that the costs can be pressed down because competition with fossil fuels, peat and industrial wood residues is hard. Low market price leads to the situation in which forest owner gets no price of the raw material, the entrepreneurs operate at the limit of profitability and renovation of machinery is difficult, and forest chips suppliers have to sell the chips at prime costs. Price of forest chips has decreased significantly during the past decade. Nominal price of forest chips is now lower than two decades ago. The real price of chips has decreased even more than the nominal price, 35% during the past decade and 20% during the last five years. Chips, made of small diameter wood, are expensive because the price includes the felling costs and harvesting is carried out at thinning lots. Price is especially high if chips are made of delimbed small diameter wood due to increased the work and reduced amount of chips. The price of logging residue chips is most profitable because cutting does not cause additional costs. Recovery of chips is

New methodologies for old problems: tridimensional gastrointestinal organoids and guts-on-a-chip

Directory of Open Access Journals (Sweden)

Marna Eliana Sakalem

2018-01-01

Full Text Available Objectives: The present review intended to present a critical overview of the methodological and experimental advances concerning tridimensional cell culture models within the scope of gastrointestinal research. Methods: A literature review was performed and some of the main published articles in the area were mentioned. Main results: Classic studies and high impact results were presented, starting from the pioneer works with gastrointestinal organoids, with a small gut organoid, to the achievement of guts-on-a-chip and multi-organ-chips. It was also discussed which implications the construction of such co-cultures bring, as well as future applications arising from these new methodologies. Conclusions: Despite the still discrete number of publications, in quantitative terms, there are qualitative promising and consistent results addressing physiopathological aspects and new therapeutic perspectives of tridimensional in vitro cultures in the gastroenterology field. It is expected, thus, that such new methodological approaches, including organoids and guts-on-a-chip, may contribute decisively to the advance in knowledge on basic aspects, as well as on the translation to new therapeutic approaches in gastrointestinal diseases. Resumo: Objetivos: A presente revisão visou apresentar uma abordagem crítica dos avanços metodológicos e experimentais referentes a modelos de cultura celular tridimensionais no âmbito do sistema gastrintestinal. Métodos: Foi realizada revisão da literatura com ênfase nos principais artigos publicados na área. Resultados principais: São apresentados trabalhos clássicos e resultados de maior impacto, desde os trabalhos pioneiros com organoides do sistema gastrintestinal, com intestino delgado, até a obtenção de guts-on-a-chip e multi-organ-chips. Discutiu-se, ainda, as implicações decorrentes da elaboração de tais co-culturas, bem como as futuras aplicações decorrentes dessas novas metodologias. Conclus

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

DEFF Research Database (Denmark)

Minzari, Daniel; Jellesen, Morten Stendahl; Møller, Per

2009-01-01

Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb...... rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential....

Optimizing Polymer Lab-on-Chip Platforms for Ultrasonic Manipulation: Influence of the Substrate

Directory of Open Access Journals (Sweden)

Itziar González

2015-05-01

Full Text Available The choice of substrate material in a chip that combines ultrasound with microfluidics for handling biological and synthetic microparticles can have a profound effect on the performance of the device. This is due to the high surface-to-volume ratio that exists within such small structures and acquires particular relevance in polymer-based resonators with 3D standing waves. This paper presents three chips developed to perform particle flow-through separation by ultrasound based on a polymeric SU-8 layer containing channelization over three different substrates: Polymethyl methacrylate (PMMA; Pyrex; and a cracked PMMA composite-like structure. Through direct observations of polystyrene microbeads inside the channel, the three checked chips exhibit their potential as disposable continuous concentration devices with different spatial pressure patterns at frequencies of resonance close to 1 Mhz. Chips with Pyrex and cracked PMMA substrates show restrictions on the number of pressure nodes established in the channel associated with the inhibition of 3D modes in the solid structure. The glass-substrate chip presents some advantages associated with lower energy requirements to collect particles. According to the results, the use of polymer-based chips with rigid substrates can be advantageous for applications that require short treatment times (clinical tests handling human samples and low-cost fabrication.

Atom chip gravimeter

Science.gov (United States)

Schubert, Christian; Abend, Sven; Gebbe, Martina; Gersemann, Matthias; Ahlers, Holger; Müntinga, Hauke; Matthias, Jonas; Sahelgozin, Maral; Herr, Waldemar; Lämmerzahl, Claus; Ertmer, Wolfgang; Rasel, Ernst

2016-04-01

Atom interferometry has developed into a tool for measuring rotations [1], accelerations [2], and testing fundamental physics [3]. Gravimeters based on laser cooled atoms demonstrated residual uncertainties of few microgal [2,4] and were simplified for field applications [5]. Atomic gravimeters rely on the interference of matter waves which are coherently manipulated by laser light fields. The latter can be interpreted as rulers to which the position of the atoms is compared. At three points in time separated by a free evolution, the light fields are pulsed onto the atoms. First, a coherent superposition of two momentum states is produced, then the momentum is inverted, and finally the two trajectories are recombined. Depending on the acceleration the atoms experienced, the number of atoms detected in the output ports will change. Consequently, the acceleration can be determined from the output signal. The laser cooled atoms with microkelvin temperatures used in state-of-the-art gravimeters impose limits on the accuracy [4]. Therefore, ultra-cold atoms generated by Bose-Einstein condensation and delta-kick collimation [6,7] are expected to be the key for further improvements. These sources suffered from a low flux implying an incompatible noise floor, but a competitive performance was demonstrated recently with atom chips [8]. In the compact and robust setup constructed for operation in the drop tower [6] we demonstrated all steps necessary for an atom chip gravimeter with Bose-Einstein condensates in a ground based operation. We will discuss the principle of operation, the current performance, and the perspectives to supersede the state of the art. The authors thank the QUANTUS cooperation for contributions to the drop tower project in the earlier stages. This work is supported by the German Space Agency (DLR) with funds provided by the Federal Ministry for Economic Affairs and Energy (BMWi) due to an enactment of the German Bundestag under grant numbers DLR 50WM

Real-time studies of chemical reactions in lab-on-a-chip devices

NARCIS (Netherlands)

Brivio, M.

2005-01-01

The realization of a lab-on-a-chip system in which chemical reactions are carried out in a continuous flow mode and monitored on-line by a suitable analytical technique is the main topic of this thesis. Two types of a lab-on-a-chip were realized, both using mass spectrometry (MS) as the on-line

On-Chip Microfluidic Components for In Situ Analysis, Separation, and Detection of Amino Acids

Science.gov (United States)

Zheng, Yun; Getty, Stephanie; Dworkin, Jason; Balvin, Manuel; Kotecki, Carl

2013-01-01

The Astrobiology Analytical Laboratory at GSFC has identified amino acids in meteorites and returned cometary samples by using liquid chromatography-electrospray ionization time-of-flight mass spectrometry (LCMS). These organic species are key markers for life, having the property of chirality that can be used to distinguish biological from non-biological amino acids. One of the critical components in the benchtop instrument is liquid chromatography (LC) analytical column. The commercial LC analytical column is an over- 250-mm-long and 4.6-mm-diameter stainless steel tube filled with functionized microbeads as stationary phase to separate the molecular species based on their chemistry. Miniaturization of this technique for spaceflight is compelling for future payloads for landed missions targeting astrobiology objectives. A commercial liquid chromatography analytical column consists of an inert cylindrical tube filled with a stationary phase, i.e., microbeads, that has been functionalized with a targeted chemistry. When analyte is sent through the column by a pressurized carrier fluid (typically a methanol/ water mixture), compounds are separated in time due to differences in chemical interactions with the stationary phase. Different species of analyte molecules will interact more strongly with the column chemistry, and will therefore take longer to traverse the column. In this way, the column will separate molecular species based on their chemistry. A lab-on-chip liquid analysis tool was developed. The microfluidic analytical column is capable of chromatographically separating biologically relevant classes of molecules based on their chemistry. For this analytical column, fabrication, low leak rate, and stationary phase incorporation of a serpentine microchannel were demonstrated that mimic the dimensions of a commercial LC column within a 5 10 1 mm chip. The microchannel in the chip has a 75- micrometer-diameter oval-shaped cross section. The serpentine

On-chip Mach-Zehnder interferometer for OCT systems

Science.gov (United States)

van Leeuwen, Ton G.; Akca, Imran B.; Angelou, Nikolaos; Weiss, Nicolas; Hoekman, Marcel; Leinse, Arne; Heideman, Rene G.

2018-04-01

By using integrated optics, it is possible to reduce the size and cost of a bulky optical coherence tomography (OCT) system. One of the OCT components that can be implemented on-chip is the interferometer. In this work, we present the design and characterization of a Mach-Zehnder interferometer consisting of the wavelength-independent splitters and an on-chip reference arm. The Si3N4 was chosen as the material platform as it can provide low losses while keeping the device size small. The device was characterized by using a home-built swept source OCT system. A sensitivity value of 83 dB, an axial resolution of 15.2 μm (in air) and a depth range of 2.5 mm (in air) were all obtained.

ALICE chip processor

CERN Multimedia

Maximilien Brice

2003-01-01

This tiny chip provides data processing for the time projection chamber on ALICE. Known as the ALICE TPC Read Out (ALTRO), this device was designed to minimize the size and power consumption of the TPC front end electronics. This single chip contains 16 low-power analogue-to-digital converters with six million transistors of digital processing and 8 kbits of data storage.

Electron Spin Resonance Measurement with Microinductor on Chip

Directory of Open Access Journals (Sweden)

Akio Kitagawa

2011-01-01

Full Text Available The detection of radicals on a chip is demonstrated. The proposed method is based on electron spin resonance (ESR spectroscopy and the measurement of high-frequency impedance of the microinductor fabricated on the chip. The measurement was by using a frequency sweep of approximately 100 MHz. The ESR spectra of di(phenyl-(2,4,6-trinitrophenyliminoazanium (DPPH dropped on the microinductor which is fabricated with CMOS 350-nm technology were observed at room temperature. The volume of the DPPH ethanol solution was 2 μL, and the number of spins on the micro-inductor was estimated at about 1014. The sensitivity is not higher than that of the standard ESR spectrometers. However, the result indicates the feasibility of a near field radical sensor in which the microinductor as a probe head and ESR signal processing circuit are integrated.

Influence of Shading on Cooling Energy Demand

Science.gov (United States)

Rabczak, Sławomir; Bukowska, Maria; Proszak-Miąsik, Danuta; Nowak, Krzysztof

2017-10-01

The article presents an analysis of the building cooling load taking into account the variability of the factors affecting the size of the heat gains. In order to minimize the demand for cooling, the effect of shading elements installed on the outside on the windows and its effect on size of the cooling capacity of air conditioning system for the building has been estimated. Multivariate building cooling load calculations to determine the size of the reduction in cooling demand has derived. Determination of heat gain from the sun is laborious, but gives a result which reflects the influence of the surface transparent partitions, devices used as sunscreen and its location on the building envelope in relation to the world, as well as to the internal heat gains has great attention in obtained calculation. In this study, included in the balance sheet of solar heat gains are defined in three different shading of windows. Calculating the total demand cooling is made for variants assuming 0% shading baffles transparent, 50% shading baffles transparent external shutters at an angle of 45 °, 100% shading baffles transparent hours 12 from the N and E and from 12 from the S and W of the outer slat blinds. The calculation of the average hourly cooling load was taken into account the option assuming the hypothetical possibility of default by up to 10% of the time assumed the cooling season temperatures in the rooms. To reduce the consumption of electricity energy in the cooling system of the smallest variant identified the need for the power supply for the operation of the cooling system. Also assessed the financial benefits of the temporary default of comfort.

In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon

Science.gov (United States)

Tokel, Onur; Turnalı, Ahmet; Makey, Ghaith; Elahi, Parviz; ćolakoǧlu, Tahir; Ergeçen, Emre; Yavuz, Ã.-zgün; Hübner, René; Zolfaghari Borra, Mona; Pavlov, Ihor; Bek, Alpan; Turan, Raşit; Kesim, Denizhan Koray; Tozburun, Serhat; Ilday, Serim; Ilday, F. Ã.-mer

2017-10-01

Silicon is an excellent material for microelectronics and integrated photonics1-3, with untapped potential for mid-infrared optics4. Despite broad recognition of the importance of the third dimension5,6, current lithography methods do not allow the fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realized with techniques like reactive ion etching. Embedded optical elements7, electronic devices and better electronic-photonic integration are lacking8. Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1-µm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has an optical index different to that in unmodified parts, enabling the creation of numerous photonic devices. Optionally, these parts can be chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface—that is, `in-chip'—microstructures for microfluidic cooling of chips, vias, micro-electro-mechanical systems, photovoltaic applications and photonic devices that match or surpass corresponding state-of-the-art device performances.

In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon.

Science.gov (United States)

Tokel, Onur; Turnali, Ahmet; Makey, Ghaith; Elahi, Parviz; Çolakoğlu, Tahir; Ergeçen, Emre; Yavuz, Özgün; Hübner, René; Borra, Mona Zolfaghari; Pavlov, Ihor; Bek, Alpan; Turan, Raşit; Kesim, Denizhan Koray; Tozburun, Serhat; Ilday, Serim; Ilday, F Ömer

2017-10-01

Silicon is an excellent material for microelectronics and integrated photonics1-3 with untapped potential for mid-IR optics4. Despite broad recognition of the importance of the third dimension5,6, current lithography methods do not allow fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realised with techniques like reactive ion etching. Embedded optical elements, like in glass7, electronic devices, and better electronic-photonic integration are lacking8. Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1 µm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has a different optical index than unmodified parts, which enables numerous photonic devices. Optionally, these parts are chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface, i.e. , " in-chip" microstructures for microfluidic cooling of chips, vias, MEMS, photovoltaic applications and photonic devices that match or surpass the corresponding state-of-the-art device performances.

Passive cooling of a fixed bed nuclear reactor

International Nuclear Information System (INIS)

Petry, V.J.; Bortoli, A.L. de; Sefidwash, F.

2005-01-01

Small nuclear reactors without the need for on-site refuelling have greater simplicity, better compliance with passive safety systems, and are more adequate for countries with small electric grids and limited investment capabilities. Here the passive cooling characteristic of the fixed bed nuclear reactor (FBNR), that is being developed under the International Atomic Energy Agency (IAEA) Coordinated Research Project, is studied. A mathematical model is developed to calculate the temperature distribution in the fuel chamber of the reactor. The results demonstrate the passive cooling of this nuclear reactor concept. (authors)

A High-Voltage SOI CMOS Exciter Chip for a Programmable Fluidic Processor System.

Science.gov (United States)

Current, K W; Yuk, K; McConaghy, C; Gascoyne, P R C; Schwartz, J A; Vykoukal, J V; Andrews, C

2007-06-01

A high-voltage (HV) integrated circuit has been demonstrated to transport fluidic droplet samples on programmable paths across the array of driving electrodes on its hydrophobically coated surface. This exciter chip is the engine for dielectrophoresis (DEP)-based micro-fluidic lab-on-a-chip systems, creating field excitations that inject and move fluidic droplets onto and about the manipulation surface. The architecture of this chip is expandable to arrays of N X N identical HV electrode driver circuits and electrodes. The exciter chip is programmable in several senses. The routes of multiple droplets may be set arbitrarily within the bounds of the electrode array. The electrode excitation waveform voltage amplitude, phase, and frequency may be adjusted based on the system configuration and the signal required to manipulate a particular fluid droplet composition. The voltage amplitude of the electrode excitation waveform can be set from the minimum logic level up to the maximum limit of the breakdown voltage of the fabrication technology. The frequency of the electrode excitation waveform can also be set independently of its voltage, up to a maximum depending upon the type of droplets that must be driven. The exciter chip can be coated and its oxide surface used as the droplet manipulation surface or it can be used with a top-mounted, enclosed fluidic chamber consisting of a variety of materials. The HV capability of the exciter chip allows the generated DEP forces to penetrate into the enclosed chamber region and an adjustable voltage amplitude can accommodate a variety of chamber floor thicknesses. This demonstration exciter chip has a 32 x 32 array of nominally 100 V electrode drivers that are individually programmable at each time point in the procedure to either of two phases: 0deg and 180deg with respect to the reference clock. For this demonstration chip, while operating the electrodes with a 100-V peak-to-peak periodic waveform, the maximum HV electrode

A novel on-chip high to low voltage power conversion circuit

International Nuclear Information System (INIS)

Wang Hui; Wang Songlin; Mou Zaixin; Guo Baolong; Lai Xinquan; Ye Qiang; Li Xianrui

2009-01-01

A novel power supply transform technique for high voltage IC based on the TSMC 0.6 μm BCD process is achieved. An adjustable bandgap voltage reference is presented which is different from the traditional power supply transform technique. It can be used as an internal power supply for high voltage IC by using the push-pull output stage to enhance its load capability. High-order temperature compensated circuit is designed to ensure the precision of the reference. Only 0.01 mm 2 area is occupied using this novel power supply technique. Compared with traditional technique, 50% of the area is saved, 40% quiescent power loss is decreased, and the temperature coefficient of the reference is only 4.48 ppm/deg. C. Compared with the traditional LDO (low dropout) regulator, this power conversion architecture does not need external output capacitance and decreases the chip-pin and external components, so the PCB area and design cost are also decreased. The testing results show that this circuit works well.

A novel on-chip high to low voltage power conversion circuit

Energy Technology Data Exchange (ETDEWEB)

Wang Hui; Wang Songlin; Mou Zaixin; Guo Baolong [Institute of Mechano-electronic Engineering, Xidian University, Xi' an 71007 (China); Lai Xinquan; Ye Qiang; Li Xianrui, E-mail: whui94@126.co [Institute of Electronic CAD, Xidian University, Xi' an 710071 (China)

2009-03-15

A novel power supply transform technique for high voltage IC based on the TSMC 0.6 mum BCD process is achieved. An adjustable bandgap voltage reference is presented which is different from the traditional power supply transform technique. It can be used as an internal power supply for high voltage IC by using the push-pull output stage to enhance its load capability. High-order temperature compensated circuit is designed to ensure the precision of the reference. Only 0.01 mm{sup 2} area is occupied using this novel power supply technique. Compared with traditional technique, 50% of the area is saved, 40% quiescent power loss is decreased, and the temperature coefficient of the reference is only 4.48 ppm/deg. C. Compared with the traditional LDO (low dropout) regulator, this power conversion architecture does not need external output capacitance and decreases the chip-pin and external components, so the PCB area and design cost are also decreased. The testing results show that this circuit works well.

On-chip spectroscopy with thermally tuned high-Q photonic crystal cavities

Energy Technology Data Exchange (ETDEWEB)

Liapis, Andreas C., E-mail: andreas.liapis@gmail.com; Gao, Boshen; Siddiqui, Mahmudur R. [The Institute of Optics, University of Rochester, Rochester, New York 14627 (United States); Shi, Zhimin [Department of Physics, University of South Florida, Tampa, Florida 33620 (United States); Boyd, Robert W. [The Institute of Optics, University of Rochester, Rochester, New York 14627 (United States); Department of Physics and School of Electrical Engineering and Computer Science, University of Ottawa, Ottawa, Ontario K1N 6N5 (Canada)

2016-01-11

Spectroscopic methods are a sensitive way to determine the chemical composition of potentially hazardous materials. Here, we demonstrate that thermally tuned high-Q photonic crystal cavities can be used as a compact high-resolution on-chip spectrometer. We have used such a chip-scale spectrometer to measure the absorption spectra of both acetylene and hydrogen cyanide in the 1550 nm spectral band and show that we can discriminate between the two chemical species even though the two materials have spectral features in the same spectral region. Our results pave the way for the development of chip-size chemical sensors that can detect toxic substances.

Application of analytical capability to predict rapid cladding cooling and quench during the blowdown phase of a large break loss-of-coolant accident

International Nuclear Information System (INIS)