η-η transformation of interfacial Cu6Sn5 in solder joints

Zhongbing Luo,; Jie Zhao,; Qinqin Fu,
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP)

Janóczki, Mihály; Jakab, László
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates

Rejent, J.; Susan, D.; Vianco, P.
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Thermomechanical fatigue behavior of Sn-Ag solder joints

Bieler, T.; Choi, S.; Subramanian, K.
2000-01-01

German National Library of Science and Technology (GetInfo) (German)

Thermal Runaway of the 13 kA Busbar Joints in the LHC

Verweij, Arjan P
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

The role of intermetallic compounds in lead-free soldering

Harris, Paul G; Chaggar, Kaldev S
1998-01-01

German National Library of Science and Technology (GetInfo) (German)

The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

Kim, Jong-Min; Hwang, Chi-Won; Suganuma, Katsuaki
2004-01-01

German National Library of Science and Technology (GetInfo) (German)

The impact of thermal cycling regime on the shear strength of lead-free solder joints

Wickham, Martin; Hunt, Christopher; Dusek, Milos
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

The impact of process parameters on gold elimination from soldered connector assemblies

Vianco, P.T.; Kilgo, A.C.
2000-01-01

German National Library of Science and Technology (GetInfo) (German)

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Wu, Pei-Lin; Huang, Meng-Kuang; Tzan, Shyh-Rong
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

The effect of interface reaction with different finishes and SnAgCu on the reliability of solder joints

Zhou Peng,; Jiang Ting-biao,; Yang Dao-guo,
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

The Mechanical Behaviour of Solders*

Plumbridge, W.J.
1996-01-01

German National Library of Science and Technology (GetInfo) (German)

Technology of soldering of ZrO 2 ceramics with solders of the Ag-Cu-O system in air

Durov, O.
2004-01-01

German National Library of Science and Technology (GetInfo) (German)

Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints

Shi, Y.; Chen, Z.; Yan, Y.
2002-01-01

German National Library of Science and Technology (GetInfo) (German)

Study on properties of low-Ag content Sn-Ag-Zn lead-free solders

Tingbi Luo,; Xi Chen,; Jing Hu,
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Study on Cu particles-enhanced SnPb composite solder

Shi, Yaowu; Xia, Zhidong; Liu, Jianping
2004-01-01

German National Library of Science and Technology (GetInfo) (German)

Strength of Soldered Joints Formed under Microgravity Conditions

Dashwood, R.; Atkinson, A.; Thomas, B.
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers

Kim, H. K.; Totta, P. A.; Tu, K. N.
1996-01-01

German National Library of Science and Technology (GetInfo) (German)

Rigid-flexible interconnection realized by laser soldering through polyimide

Balogh, B.; Illyefalvi-Vitez, Z.; Baranyay, Z.
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders

Seongjun Kim,; Keun-Soo Kim,; Izuta, G.
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Reliability issues in Pb-free solder joint miniaturization

Liu, Changqing; Conway, Paul; Thomson, Rachel
2006-01-01

German National Library of Science and Technology (GetInfo) (German)

Reliability Assessment of Lead Free Soldered PWBs

Cho, I.J.; Chae, K.S.; Kim, S.T.
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag

Jung, Jae Pil; Kim, Mi Jin; Zhou, Y. (Norman)
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

Radiofrequency Characterization of Joints with a Cylindrical TE0np Resonator

Schimmel, Jörn; Numssen, Kai
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging

Yu, Sheng-lin; Sheng, Zhong; Zhang, Liang
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Powder materials from special steels and alloys for machine building enterprises

Kononenko, A.; Ternovoi, Yu.; Pitomets, O.
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Phase Characterization of Diffusion Soldered Ni/Al/Ni Interconnections

Sommadossi, S.; Mittemeijer, E.J.; Zieba, P.
2002-01-01

German National Library of Science and Technology (GetInfo) (German)

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

Anderson, Iver; Harringa, Joel; Kracher, Alfred
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Novel techniques for electronic component removal

Stennett, A.D.; Whalley, D.C.
1999-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructures in solder joints between Sn95.5Ag4Cu0.5 solder and Ag/Pd thick film

Kutilainen, Terho; Tian, Dewei
2003-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructures and degradation of heat sink very-thin quad flat package no-leads Pb-free Sn-Ag-Cu solder joints after thermal aging

Fredriksz, W.
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

Lepistö, Toivo; Sundelin, Janne; Ristolainen, Eero
2006-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium

Yu, Sheng-lin; Xue, Song-bai; Sheng, Zhong
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

Wu, C.; Huang, M.; Chan, Y.
2000-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures

Schreurs, P.; Erin, M.; Zhang, G.
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructural Modelling and Electronic Interconnect Reliability*

Wallach, E R; Winter, P R
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

Microstructural Investigation of Sn-Ag and Sn-Ag Solder Joints*

Herrmann,, A; Shangguan**, D; Chada,, S
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

Metallurgy of soldered joints in electronics : a photographic guide for the electronics assembly industry showing the structure of soldered joints and the reactions with adjacent metals

1990-01-01

German National Library of Science and Technology (GetInfo) (German)

Metallographic analysis of laser soldered chip resistors

Hurtony, T; Balogh, B; Pintér, Dániel
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Metallic thermal connectors for use in nuclear refrigeration

Landau, J.; Ihas, G. G.; Muething, K.
1977-01-01

German National Library of Science and Technology (GetInfo) (German)

Mechanism of fillet lifting in Sn-Bi alloys

Newbury, B.; Nicholson, J.; Pan, T.
2002-01-01

German National Library of Science and Technology (GetInfo) (German)

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

Qi, Guojun; Chen, Zhong; He, Min
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

Mechanical property and electrochemical corrosion behavior of Al/Sn-9Zn-XNi/Cu joints

Yingzhuo Huang,; Mingliang Huang,; Ning Kang,
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Measurement of Electromagnetic and Thermal Stresses on Conduction-Cooled Joints of the SST-1 Spare TF Coil

Kedia, Sunil; Pradhan, Subrata; Khristi, Yohan
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Life-time test of laser soldered joints on flexible boards

Illyefalvi-Vitez, Z.; Balogh, B.; Baranyay, Z.
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Lead-free reflow soldering for electronics assembly

Steen, H.A.H.; Vincent, J.H.; Harrison, M.R.
2001-01-01

German National Library of Science and Technology (GetInfo) (German)

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound

Kukimoto, Youichi; Kumamoto, Seishi; Suganuma, Katsuaki
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C

Korhonen, Tia-Marje; Lehman, Lawrence; Henderson, Donald
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints

Guo, Fu; Zhang, Ning; Lei, Yongping
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Investigating the mechanical strength of Vapor Phase soldered chip components joints

Krammer, O; Garami, T
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating

Mori, Hirotaro; Hwang, Chi-Won; Suganuma, Katsuaki
2003-01-01

German National Library of Science and Technology (GetInfo) (German)

Influence of the magnetic field profile on ITER conductor testing

A Nijhuis; Y Ilyin; H H J ten Kate
2006-01-01

German National Library of Science and Technology (GetInfo) (German)

Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating

Suganuma, Katsuaki; Kiso, Masayuki; Hwang, Chi-Won
2004-01-01

German National Library of Science and Technology (GetInfo) (German)

In-situ observation and simulation of the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy

Haga, Motoharu; Kim, Keun-Soo; Suganuma, Katsuaki
2003-01-01

German National Library of Science and Technology (GetInfo) (German)

Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials

Catelani, Marcantonio; Scarano, Valeria L; Bertocci, Francesco
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Impact of thermal aging on the thermal fatigue durability of Pb-free solder joints

Chauhan, Preeti; Mueller, Maik; Osterman, Michael
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

Che, Faxing; Xu, Luhua; Pang, John
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

High-speed mechanical impact reliability of solder interconnections in high-power LEDs

Hokka, J; Caers, J F J M; Zhao, X J
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Gapless rework and reliability of lead-free BGA assemblies

Yong-Won Lee,; Soon-Min Hong,; Young-Joon Moon,
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates

Lin, Y.; Chang, C.; Kao, C.
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Fluxless plasma bumping of lead-free solders and the reliability effects of under bump metallization thickness

Jung, Jae Pil; Moon, Joon Kwon; Zhou, Y
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

Failure analysis of lead-free solder joints for high-density packages

Horsley, Rob; Lau, John; Dauksher, Walter
2004-01-01

German National Library of Science and Technology (GetInfo) (German)

Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)

Chong, D.Y.R.; Che, F.X.; Pang, J.H.L.
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Evaluation of temperature and properties at interface of AISI 1040 steels joined by friction welding

Becenen, Ismail; Sahin, Mumin; Kuscu, Hilmi
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Harringa, J.; Anderson, I.
2004-01-01

German National Library of Science and Technology (GetInfo) (German)

Elemental distribution of parts and materials making up an electronic box

Dunn, B.D.
1998-01-01

German National Library of Science and Technology (GetInfo) (German)

Electrochemical migration of lead free solder joints

Yu, D.; Schmitt, E.; Jillek, W.
2006-01-01

German National Library of Science and Technology (GetInfo) (German)

Electric Resistance Brazing

Martin, Samuel
1931-01-01

German National Library of Science and Technology (GetInfo) (German)

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Bath, Jasbir; Toleno, Brian J.; Pan, Jianbiao
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

Shin, C.; Baik, Y.; Huh, J.
2001-01-01

German National Library of Science and Technology (GetInfo) (German)

Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints

Ji, Feng; Ye, Huan; Zhang, Liang
2011-01-01

German National Library of Science and Technology (GetInfo) (German)

Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces

Yu, L.M.; Xu, R.L.; Liu, Y.C.
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn–9Zn lead-free solder

Xue, Songbai; Wang, Hui; Chen, Wenxue
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems

Matsuura, Toshinori; Suganuma, Katsuaki; Kim, Keun-Soo
2006-01-01

German National Library of Science and Technology (GetInfo) (German)

Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints

Gao, Li; Xue, Song; Chen, Wen
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of solder joint integrity on the thermal performance of a TEC for a 980?nm pump laser module

Takyi, G.; Amalu, E.; Bernasko, P.K.
2011-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of heating on the electrical resistivity of conductive adhesive and soldered joints

Kim, Kyu; Chung, D.
2002-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate

Wang, Moo-Chin; Hon, Min-Hsiung; Wang, Hsin-Chien
2002-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

Lee, Hwa-Teng; Jao, Huei-Mei; Chen, Ming-Hung
2004-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

Zhang, Ning; Xia, Zhidong; Lei, Yongping
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests

Xia, Yanghua; Lu, Chuanyan; Xie, Xiaoming
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints

Qi, G.J.; Kumar, A.; Chen, Z.
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

Effect of 3.0wt. %Bi and 0.05wt. %Cr additions on the microstructure and tensile strength of the Sn3Ag0.5Cu/Cu solder joint

Yongjiu Han,; Fei Lin,; Guokui Ju,
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance

Kwon, D.; Azarian, M.H.; Pecht, M.
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Development of a lead-free solder: Sn-4.0Bi-3.7Ag-0.9Zn

Dong, Zhizhong; Yu, Liming; Gao, Zhiming
2011-01-01

German National Library of Science and Technology (GetInfo) (German)

Development of HTS Current Leads Prepared by the TFA-MOD Processed YBCO Tapes

Yamada, Yutaka; Sakai, Satoshi; Shiohara, Kei
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying

Chan, Y.; Lai, J.; Wu, C.
2000-01-01

German National Library of Science and Technology (GetInfo) (German)

Determination of Anand parameters for SnAgCuCe solder

Liang Zhang; Songbai Xue; Lili Gao
2009-01-01

German National Library of Science and Technology (GetInfo) (German)

Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

Yu, C.; Zhang, X.; Shrestha, S.
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

Corrosion behaviour of soldered joints of magnesium alloys and dissimilar materials

Grund, Thomas; Mücklich, Silke; Wielage, Bernhard
2006-01-01

German National Library of Science and Technology (GetInfo) (German)

Comparison of dynamic and static mechanical stress applied on soldered joints

Dušek, Karel; Urbánek, Michal
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test

Shi, Yaowu; Lei, Yongping; Li, Xiaoyan
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

Committing of electronic modules by ball pins and their reliability

Švecová, Olga; Kosína, Petr; Šandera, Josef
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate

Lu, C.W.A.; Zhong, Z.W.; Arulvanan, P.
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPs

Huang, Meng-Kuang; Lee, Chiapyng
2008-01-01

German National Library of Science and Technology (GetInfo) (German)

An alternative approach for the analysis of intermetallic compounds in SMT solder joints

Law, H.W.; Hui, I.K.
2000-01-01

German National Library of Science and Technology (GetInfo) (German)

Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes

Nai, S M L; Han, Y D; Jing, H Y
2010-01-01

German National Library of Science and Technology (GetInfo) (German)

A comparative study of silver‐epoxy and tin‐lead solder in their joints with copper, through mechanical and electrical measurements during debonding

Luo, X.; Chung, D. D. L.
1999-01-01

German National Library of Science and Technology (GetInfo) (German)

A Fuzzy Method for Global Quality Index Evaluation of Solder Joints in Surface Mount Technology

Acciani, Giuseppe; Fornarelli, Girolamo; Giaquinto, Antonio
2011-01-01

German National Library of Science and Technology (GetInfo) (German)

4AV.3.83 Electrical Parameters of the Solar Cells Soldered Joints in Comparison to Electrically Conductive Adhesive Joints

Dusek, K.; Machacek, Z.; Benda, V.
2009-01-01

German National Library of Science and Technology (GetInfo) (German)