η-η transformation of interfacial Cu6Sn5 in solder joints
Zhongbing Luo,; Jie Zhao,; Qinqin Fu,
German National Library of Science and Technology (GetInfo) (German)
X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP)
Janóczki, Mihály; Jakab, László
Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates
Rejent, J.; Susan, D.; Vianco, P.
Thermomechanical fatigue behavior of Sn-Ag solder joints
Bieler, T.; Choi, S.; Subramanian, K.
Thermal Runaway of the 13 kA Busbar Joints in the LHC
Verweij, Arjan P
The role of intermetallic compounds in lead-free soldering
Harris, Paul G; Chaggar, Kaldev S
The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging
Kim, Jong-Min; Hwang, Chi-Won; Suganuma, Katsuaki
The impact of thermal cycling regime on the shear strength of lead-free solder joints
Wickham, Martin; Hunt, Christopher; Dusek, Milos
The impact of process parameters on gold elimination from soldered connector assemblies
Vianco, P.T.; Kilgo, A.C.
The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
Wu, Pei-Lin; Huang, Meng-Kuang; Tzan, Shyh-Rong
The effect of interface reaction with different finishes and SnAgCu on the reliability of solder joints
Zhou Peng,; Jiang Ting-biao,; Yang Dao-guo,
The Mechanical Behaviour of Solders*
Technology of soldering of ZrO 2 ceramics with solders of the Ag-Cu-O system in air
Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints
Shi, Y.; Chen, Z.; Yan, Y.
Study on properties of low-Ag content Sn-Ag-Zn lead-free solders
Tingbi Luo,; Xi Chen,; Jing Hu,
Study on Cu particles-enhanced SnPb composite solder
Shi, Yaowu; Xia, Zhidong; Liu, Jianping
Strength of Soldered Joints Formed under Microgravity Conditions
Dashwood, R.; Atkinson, A.; Thomas, B.
Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
Kim, H. K.; Totta, P. A.; Tu, K. N.
Rigid-flexible interconnection realized by laser soldering through polyimide
Balogh, B.; Illyefalvi-Vitez, Z.; Baranyay, Z.
Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders
Seongjun Kim,; Keun-Soo Kim,; Izuta, G.
Reliability issues in Pb-free solder joint miniaturization
Liu, Changqing; Conway, Paul; Thomson, Rachel
Reliability Assessment of Lead Free Soldered PWBs
Cho, I.J.; Chae, K.S.; Kim, S.T.
Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag
Jung, Jae Pil; Kim, Mi Jin; Zhou, Y. (Norman)
Radiofrequency Characterization of Joints with a Cylindrical TE0np Resonator
Schimmel, Jörn; Numssen, Kai
Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging
Yu, Sheng-lin; Sheng, Zhong; Zhang, Liang
Powder materials from special steels and alloys for machine building enterprises
Kononenko, A.; Ternovoi, Yu.; Pitomets, O.
Phase Characterization of Diffusion Soldered Ni/Al/Ni Interconnections
Sommadossi, S.; Mittemeijer, E.J.; Zieba, P.
Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design
Anderson, Iver; Harringa, Joel; Kracher, Alfred
Novel techniques for electronic component removal
Stennett, A.D.; Whalley, D.C.
Microstructures in solder joints between Sn95.5Ag4Cu0.5 solder and Ag/Pd thick film
Kutilainen, Terho; Tian, Dewei
Microstructures and degradation of heat sink very-thin quad flat package no-leads Pb-free Sn-Ag-Cu solder joints after thermal aging
Microstructure, creep properties, and failure mechanism of SnAgCu solder joints
Lepistö, Toivo; Sundelin, Janne; Ristolainen, Eero
Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
Yu, Sheng-lin; Xue, Song-bai; Sheng, Zhong
Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging
Wu, C.; Huang, M.; Chan, Y.
Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures
Schreurs, P.; Erin, M.; Zhang, G.
Microstructural Modelling and Electronic Interconnect Reliability*
Wallach, E R; Winter, P R
Microstructural Investigation of Sn-Ag and Sn-Ag Solder Joints*
Herrmann,, A; Shangguan**, D; Chada,, S
Metallurgy of soldered joints in electronics : a photographic guide for the electronics assembly industry showing the structure of soldered joints and the reactions with adjacent metals
Metallographic analysis of laser soldered chip resistors
Hurtony, T; Balogh, B; Pintér, Dániel
Metallic thermal connectors for use in nuclear refrigeration
Landau, J.; Ihas, G. G.; Muething, K.
Mechanism of fillet lifting in Sn-Bi alloys
Newbury, B.; Nicholson, J.; Pan, T.
Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
Qi, Guojun; Chen, Zhong; He, Min
Mechanical property and electrochemical corrosion behavior of Al/Sn-9Zn-XNi/Cu joints
Yingzhuo Huang,; Mingliang Huang,; Ning Kang,
Measurement of Electromagnetic and Thermal Stresses on Conduction-Cooled Joints of the SST-1 Spare TF Coil
Kedia, Sunil; Pradhan, Subrata; Khristi, Yohan
Life-time test of laser soldered joints on flexible boards
Illyefalvi-Vitez, Z.; Balogh, B.; Baranyay, Z.
Lead-free reflow soldering for electronics assembly
Steen, H.A.H.; Vincent, J.H.; Harrison, M.R.
Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound
Kukimoto, Youichi; Kumamoto, Seishi; Suganuma, Katsuaki
Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C
Korhonen, Tia-Marje; Lehman, Lawrence; Henderson, Donald
Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints
Guo, Fu; Zhang, Ning; Lei, Yongping
Investigating the mechanical strength of Vapor Phase soldered chip components joints
Krammer, O; Garami, T
Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating
Mori, Hirotaro; Hwang, Chi-Won; Suganuma, Katsuaki
Influence of the magnetic field profile on ITER conductor testing
A Nijhuis; Y Ilyin; H H J ten Kate
Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating
Suganuma, Katsuaki; Kiso, Masayuki; Hwang, Chi-Won
In-situ observation and simulation of the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy
Haga, Motoharu; Kim, Keun-Soo; Suganuma, Katsuaki
Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials
Catelani, Marcantonio; Scarano, Valeria L; Bertocci, Francesco
Impact of thermal aging on the thermal fatigue durability of Pb-free solder joints
Chauhan, Preeti; Mueller, Maik; Osterman, Michael
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability
Che, Faxing; Xu, Luhua; Pang, John
High-speed mechanical impact reliability of solder interconnections in high-power LEDs
Hokka, J; Caers, J F J M; Zhao, X J
Gapless rework and reliability of lead-free BGA assemblies
Yong-Won Lee,; Soon-Min Hong,; Young-Joon Moon,
Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates
Lin, Y.; Chang, C.; Kao, C.
Fluxless plasma bumping of lead-free solders and the reliability effects of under bump metallization thickness
Jung, Jae Pil; Moon, Joon Kwon; Zhou, Y
Failure analysis of lead-free solder joints for high-density packages
Horsley, Rob; Lau, John; Dauksher, Walter
Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)
Chong, D.Y.R.; Che, F.X.; Pang, J.H.L.
Evaluation of temperature and properties at interface of AISI 1040 steels joined by friction welding
Becenen, Ismail; Sahin, Mumin; Kuscu, Hilmi
Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength
Harringa, J.; Anderson, I.
Elemental distribution of parts and materials making up an electronic box
Electrochemical migration of lead free solder joints
Yu, D.; Schmitt, E.; Jillek, W.
Electric Resistance Brazing
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints
Bath, Jasbir; Toleno, Brian J.; Pan, Jianbiao
Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints
Shin, C.; Baik, Y.; Huh, J.
Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints
Ji, Feng; Ye, Huan; Zhang, Liang
Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
Yu, L.M.; Xu, R.L.; Liu, Y.C.
Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn–9Zn lead-free solder
Xue, Songbai; Wang, Hui; Chen, Wenxue
Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems
Matsuura, Toshinori; Suganuma, Katsuaki; Kim, Keun-Soo
Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints
Gao, Li; Xue, Song; Chen, Wen
Effect of solder joint integrity on the thermal performance of a TEC for a 980?nm pump laser module
Takyi, G.; Amalu, E.; Bernasko, P.K.
Effect of heating on the electrical resistivity of conductive adhesive and soldered joints
Kim, Kyu; Chung, D.
Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate
Wang, Moo-Chin; Hon, Min-Hsiung; Wang, Hsin-Chien
Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints
Lee, Hwa-Teng; Jao, Huei-Mei; Chen, Ming-Hung
Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions
Zhang, Ning; Xia, Zhidong; Lei, Yongping
Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests
Xia, Yanghua; Lu, Chuanyan; Xie, Xiaoming
Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints
Qi, G.J.; Kumar, A.; Chen, Z.
Effect of 3.0wt. %Bi and 0.05wt. %Cr additions on the microstructure and tensile strength of the Sn3Ag0.5Cu/Cu solder joint
Yongjiu Han,; Fei Lin,; Guokui Ju,
Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance
Kwon, D.; Azarian, M.H.; Pecht, M.
Development of a lead-free solder: Sn-4.0Bi-3.7Ag-0.9Zn
Dong, Zhizhong; Yu, Liming; Gao, Zhiming
Development of HTS Current Leads Prepared by the TFA-MOD Processed YBCO Tapes
Yamada, Yutaka; Sakai, Satoshi; Shiohara, Kei
Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying
Chan, Y.; Lai, J.; Wu, C.
Determination of Anand parameters for SnAgCuCe solder
Liang Zhang; Songbai Xue; Lili Gao
Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures
Yu, C.; Zhang, X.; Shrestha, S.
Corrosion behaviour of soldered joints of magnesium alloys and dissimilar materials
Grund, Thomas; Mücklich, Silke; Wielage, Bernhard
Comparison of dynamic and static mechanical stress applied on soldered joints
Dušek, Karel; Urbánek, Michal
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Shi, Yaowu; Lei, Yongping; Li, Xiaoyan
Committing of electronic modules by ball pins and their reliability
Švecová, Olga; Kosína, Petr; Šandera, Josef
Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate
Lu, C.W.A.; Zhong, Z.W.; Arulvanan, P.
Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPs
Huang, Meng-Kuang; Lee, Chiapyng
An alternative approach for the analysis of intermetallic compounds in SMT solder joints
Law, H.W.; Hui, I.K.
Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes
Nai, S M L; Han, Y D; Jing, H Y
A comparative study of silver‐epoxy and tin‐lead solder in their joints with copper, through mechanical and electrical measurements during debonding
Luo, X.; Chung, D. D. L.
A Fuzzy Method for Global Quality Index Evaluation of Solder Joints in Surface Mount Technology
Acciani, Giuseppe; Fornarelli, Girolamo; Giaquinto, Antonio
4AV.3.83 Electrical Parameters of the Solar Cells Soldered Joints in Comparison to Electrically Conductive Adhesive Joints
Dusek, K.; Machacek, Z.; Benda, V.
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