Sample records for MIKROSCHALTKREISE (microelectronic circuits)
from WorldWideScience.org

Sample records 1 - 20 shown. Select sample records:



1

Unencapsulated Cross-Section Method for Microelectronic Packaged Devices

Liechty, G. D.; Hirsch, E. A.; Institute of Electrical and Electronics Engineers
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

25

Proceedings of the 1990 IEEE International Conference on Microelectronic Test Structures : March 5 - 7, 1990, San Diego, California ; [volume 3]

International Conference on Microelectronic Test Structures < 3, 1990, San Diego, Calif.>; Electron Devices Society; Institute of Electrical and Electronics Engineers
1990-01-01

German National Library of Science and Technology (GetInfo) (German)

26

Proceedings - MSE 2007, 2007 IEEE International Conference on Microelectronic Systems Education : 3 - 4 June 2007, San Diego, CA

Computer Society / Technical Committee on Design Automation; Computer Society / Technical Committee on VLSI; Computer Society / Test Technology Technical Council
2007-01-01

German National Library of Science and Technology (GetInfo) (German)

67

In-line characterization, yield reliability, and failure analyses in microelectronic manufacturing : 19 - 21 May 1999, Edinburgh, Scotland

European Optical Society; Conference on In Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing < 1999, Edinburgh>; Conference on Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing < 1999, Edinburgh>
1999-01-01

German National Library of Science and Technology (GetInfo) (German)

76

Electronic and photonic circuits and devices

Circuits and Systems Society; Components, Packaging, and Manufacturing Technology Society
1999-01-01

German National Library of Science and Technology (GetInfo) (German)

78

Digest of the Second Joint Symposium on Opto- and Microelectronic Devices and Circuits 2002 : March 10 - 16, 2002, Stuttgart, Germany

Joint Symposium on Opto- and Microelectronic Devices and Circuits < 2, 2002, Stuttgart>; Zhongguo-Guojia-Ziran-Kexue-Jijin-Weiyuanhui; Deutsche Forschungsgemeinschaft
2002-01-01

German National Library of Science and Technology (GetInfo) (German)

84
91

Conversion-Type Gold Plating on Electroless Nickel Plated Substrates for Microelectronic Packages

Kisco, M.; Gudeczauskas, D.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)