Sample records for circuits electronic
from WorldWideScience.org

Sample records 1 - 20 shown. Select sample records:



1

Zero Touch -Up

Harris, T.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

2

Wirebonding to Electrolessly Deposited Metallic Circuit Board Finishes

Cullen, D.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

5

WST, a `Total Systems Approach' to Pulse Plating

Holtzman, M.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

8

Top Ten Environmental Regulatory Issues Facing Printed Wiring Board Manufacturers!!

Servidio, L. C.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

11

The Impact of PCB Design Characteristics on Dimensional Stability

Schmidt, J. C.; Institute for Interconnecting and Packaging Electronic Circuits
1995-01-01

German National Library of Science and Technology (GetInfo) (German)

12

The Expanding Role of Flexible Circuits in Electronics

Fjelstad, J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

13

The Disappearance of Dicarboxylic Acid No-Clean Flux Activators with Time and Temperature

Tellefsen, K.; Stromgren, K.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

15

The Benefits of MOLDED INTERCONNECT DEVICE Product Design

Siegmund, J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

17

Test Coupons for PCB Quality Control and Evaluation

Iordache, O.; St-Martin, S.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

18

TEA CO~2 Laser Micro Via Fabrication in Standard and Emerging PWB Dielectrics

Morrison, J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

19

Shadow Moire Based Printed Wiring Board Flatness Inspection

Zwemer, D.; Hassell, P.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

21

Scoring

Duclos, J. E. J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

22

Score Planning Guide - Pocket Guide to Excellent V-Scoring

Simmons, M.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

23

Scaling Down for a More Efficient and Economical Electroless Process on Flex

Carlson, C.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

24

SMD Solder Joint Environmental Evaluation

Andrade, A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

25

Roll-to-Roll Automated Optical Inspection of Flexible Circuits

Burjoski, J. D.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

27

Reliability Evaluation of Circuits with Deep Nicks

Lo, C. C.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

28

Real Time Monitoring Tool for Copper Plating and Etching

Doss, S.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

29

Pulse Periodic Reverse Copper Plating of High Aspect Ratio Holes

Whitlaw, K. J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

31

Process Control of Products

Munson, T.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

32

Proceedings of the 5th Electronic Circuits and Systems Conference, September 8 - 9, 2005, Bratislava, Slovakia

Electronic Circuits and Systems Conference < 5, 2005, Bratislava>; Slovenská Technická Univerzita < Bratislava> / Fakulta Elektrotechniky a Informatiky; Slovenská Technická Univerzita < Bratislava> / Microelectronics Department
2005-01-01

German National Library of Science and Technology (GetInfo) (German)

33

Plasma Etching Characterization

Sedacca, S.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

34

Phosphorus Distribution in Phosphorized Copper Anodes

Strachan, R. W.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

35

On-Site Solder Purification for HASL

Fellman, J. D.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

36

Off-Contact Exposure Sensitivity Test for Dry Film Resist

Briney, G.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

37

Non-Woven Aramid in High Reliability Applications

Jones, S.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

38

New Technologies Streamline Processing of Silicone Materials for Electronic Protection

Goudie, S. K.; Institute for Interconnecting ad Packaging Electronic Circuits; Surface Mount Technology Association
1998-01-01

German National Library of Science and Technology (GetInfo) (German)

39

New Photodielectric Dry Film For Microvia Applications

Vaughan, D. A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

40

New High Performance Materials for Packages

Sugawara, I.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

41
42

New Applications for Nonwoven Aramid Reinforcement Which Demand Advanced Physical Properties

Kirayoglu, B.; Powell, D. J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

43

Netlist Escrow PWB Test Fixturing

Guthrie, T. L.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

44

NCMS Lead-Free Solder Project- Executive Summary

Rosser, J. G.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

45

Multilayer PCB Manufacture Using A Permanent Photoresist- It Can Be Done

McGrath, P.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

46

Microvia Materials: Enablers for High Density Interconnects

Paulus, J.; Petri, M.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

48

Metalliferous Caustic and Washing Solutions Recovery

Celi, A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

50

Material-Centric Process Flow Modeling of PWB Fabrication and Waste Disposal

Sandborn, P. A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

51

Material and Surface Characterization of Self-Reinforced Dielectric PIBO Film

Lopez, L. C.; Dalman, D. A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

52

Manufacture of 4 Layer MCM-L's Using Reel to Reel Manufacturing Methods

Weiss, D. G.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

54

Low-Environmental-Load PCB Material Manufactured Using a New Process

Sugawa, Y.; Hachijin, T.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

55

Laser Imaging onto Direct-Write Film

Murray, G.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

56

Laminate Influences on Dimensional Growth During Re-Lamination

Holmes, R.; Institute for Interconnecting and Packaging Electronic Circuits
1995-01-01

German National Library of Science and Technology (GetInfo) (German)

57

Introducing Via-in-Pad Blind Via Technology to Any PCB Multilayer Fabricator

Burgess, L. W.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

58
59

Inner-Layer Registration Error- Causes, Effect & Cure

Paur, T.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

60

Increasing Efficiencies in the Supply Chain

Burns, R. R.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

62

Improved PCB Manufacturing with Reverse Treated Copper Foils

Kelley, E. J.; Micha, R. A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

64

High Definition Imaging: Applicability for Dry Film Resist Processing

Carhart, R. A.; Institute for Interconnecting and Packaging Electronic Circuits
1995-01-01

German National Library of Science and Technology (GetInfo) (German)

66

Fine Pitch Industry Database

Rhodes, R. J.; Estes, T. A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

67

Final Report of the October Project/ITRI Microvia Project

Davignon, J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

68

Filled Vias...Critical Quality Issues

Clifford, T.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

71

Entering the Information Superhighway with Multilayerable Low Loss Materials

Guiles, C. L.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

72

Elimination of the Microetch in Innerlayer Processing

McKesson, D.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

74

Electrically Conductive Via Plug Material for PWB Applications

Felten, J. J.; Padlewski, S. A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

75

Dry, Laser-Assisted Cleaning Applications From High Technology To Heavy Industry

Engelsberg, A. C.; Robison, J. H.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

77

DNDO Based Positive Liquid Resists for Ultra Fine Line Processing

McMurdie, N. D.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

78

DCC[R] Connectors for Flexible Printed Circuits

Mutarelli, D.; Institute for Interconnecting and Packaging Electronic Circuits
1995-01-01

German National Library of Science and Technology (GetInfo) (German)

79

Conveyorized Horizontal Electroplate System for Printed Circuit Boards

Graves, J. E.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

80

Conversion-Type Gold Plating on Electroless Nickel Plated Substrates for Microelectronic Packages

Kisco, M.; Gudeczauskas, D.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

81

Continuous Flow Manufacturing...Pulling to Succeed

Bussell, R.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

82

Continuous Flow Manufacturing in a Focused Factory Environment

Bachman, C.; Lemicke, M.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

84

Compatibility of OSP Coatings With VOC Free Fluxes

Parker, J. L.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

86

Building Codes for Companies That Are Expanding or Building New Facilities

Sharp, J.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

90

Assembly of Advanced Surface Laminar Circuit[TM] PWB Substrates

Jimarez, M.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

91

Application of a Novel Stripline For Flexible Printed Wiring

Sharka, D. L.; Ortloff, W. A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

92

Anti-theft Technology for Printed Circuit Boards

McNamara, P. F.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

94

Alternative Metallic Finishes for PWB-an ITRI/October Project

Houghton, F. D. B.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

95

Advanced Coatings for Electronic Packaging Technology

Heffner, K. H.; Institute for Interconnecting and Packaging Electronic Circuits
1996-01-01

German National Library of Science and Technology (GetInfo) (German)

96

Additive-Free Plating of High Aspect Ratio Through-Holes

Woodman, A.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

97

A Predictive Model for Innerlayer Registration Yields

Leoni, H. B.; Brown, A. M.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

98

A New Family of Materials for Additive Processing

Kydd, P. H.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)

100

A Cost Analysis of Microvia Technologies: Photo vs Plasma vs Laser

Singer, A.; Bhatkal, R.; Institute for Interconnecting and Packaging Electronic Circuits (IPC)
1997-01-01

German National Library of Science and Technology (GetInfo) (German)