Robust micromachining of compliant mechanisms for out-of-plane microsensors

OpenAIRE

Khosraviani, Kourosh

2013-01-01

Micro-Electro-Mechanical-Systems (MEMS) take advantage of a wide range of very reliable, and well established existing microelectronics fabrication techniques. Due to the planar nature of these techniques, out-of-plane MEMS devices must be fabricated in-plane and assembled afterwards in order to create out-of-plane three-dimensional structures. Out-of-plane microstructures extend the design space of the MEMS based devices and overcome many limitations of the in-plane processing. Nevertheless,...

Structure optimization and simulation analysis of the quartz micromachined gyroscope

Directory of Open Access Journals (Sweden)

Xuezhong Wu

2014-02-01

Full Text Available Structure optimization and simulation analysis of the quartz micromachined gyroscope are reported in this paper. The relationships between the structure parameters and the frequencies of work mode were analysed by finite element analysis. The structure parameters of the quartz micromachined gyroscope were optimized to reduce the difference between the frequencies of the drive mode and the sense mode. The simulation results were proved by testing the prototype gyroscope, which was fabricated by micro-electromechanical systems (MEMS technology. Therefore, the frequencies of the drive mode and the sense mode can match each other by the structure optimization and simulation analysis of the quartz micromachined gyroscope, which is helpful in the design of the high sensitivity quartz micromachined gyroscope.

Manufacturing microsystems-on-a-chip with 5-level surface micromachining technology

Energy Technology Data Exchange (ETDEWEB)

Sniegowski, J.; Rodgers, M.S.

1998-05-01

An agile microsystem manufacturing technology has been developed that provides unprecedented 5 levels of independent polysilicon surface-micromachine films for the designer. Typical surface-micromachining processes offer a maximum of 3 levels, making this the most complex surface-micromachining process technology developed to date. Leveraged from the extensive infrastructure present in the microelectronics industry, the manufacturing method of polysilicon surface-micromachining offers similar advantages of high-volume, high-reliability, and batch-fabrication to microelectromechanical systems (MEMS) as has been accomplished with integrated circuits (ICs). These systems, comprised of microscopic-sized mechanical elements, are laying the foundation for a rapidly expanding, multi-billion dollar industry 2 which impacts the automotive, consumer product, and medical industries to name only a few.

Wafer level packaging of MEMS

International Nuclear Information System (INIS)

Esashi, Masayoshi

2008-01-01

Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

Fabrication of Microhotplates Based on Laser Micromachining of Zirconium Oxide

Science.gov (United States)

Oblov, Konstantin; Ivanova, Anastasia; Soloviev, Sergey; Samotaev, Nikolay; Lipilin, Alexandr; Vasiliev, Alexey; Sokolov, Andrey

We present a novel approach to the fabrication of MEMS devices, which can be used for gas sensors operating in harsh environment in wireless and autonomous information systems. MEMS platforms based on ZrO2/Y2O3 (YSZ) are applied in these devices. The methods of ceramic MEMS devices fabrication with laser micromachining are considered. It is shown that the application of YSZ membranes permits a decrease in MEMS power consumption at 4500C down to ∼75 mW at continuous heating and down to ∼ 1 mW at pulse heating mode. The application of the platforms is not restricted by gas sensors: they can be used for fast thermometers, bolometric matrices, flowmeteres and other MEMS devices working under harsh environmental conditions.

A wafer mapping technique for residual stress in surface micromachined films

International Nuclear Information System (INIS)

Schiavone, G; Murray, J; Smith, S; Walton, A J; Desmulliez, M P Y; Mount, A R

2016-01-01

The design of MEMS devices employing movable structures is crucially dependant on the mechanical behaviour of the deposited materials. It is therefore important to be able to fully characterize the micromachined films and predict with confidence the mechanical properties of patterned structures. This paper presents a characterization technique that enables the residual stress in MEMS films to be mapped at the wafer level by using microstructures released by surface micromachining. These dedicated MEMS test structures and the associated measurement techniques are used to extract localized information on the strain and Young’s modulus of the film under investigation. The residual stress is then determined by numerically coupling this data with a finite element analysis of the structure. This paper illustrates the measurement routine and demonstrates it with a case study using electrochemically deposited alloys of nickel and iron, particularly prone to develop high levels of residual stress. The results show that the technique enables wafer mapping of film non-uniformities and identifies wafer-to-wafer differences. A comparison between the results obtained from the mapping technique and conventional wafer bow measurements highlights the benefits of using a procedure tailored to films that are non-uniform, patterned and surface-micromachined, as opposed to simple standard stress extraction methods. The presented technique reveals detailed information that is generally unexplored when using conventional stress extraction methods such as wafer bow measurements. (paper)

Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program

Energy Technology Data Exchange (ETDEWEB)

Schriner, H.; Davies, B.; Sniegowski, J.; Rodgers, M.S.; Allen, J.; Shepard, C.

1998-05-01

Research and development in the design and manufacture of Microelectromechanical Systems (MEMS) is growing at an enormous rate. Advances in MEMS design tools and fabrication processes at Sandia National Laboratories` Microelectronics Development Laboratory (MDL) have broadened the scope of MEMS applications that can be designed and manufactured for both military and commercial use. As improvements in micromachining fabrication technologies continue to be made, MEMS designs can become more complex, thus opening the door to an even broader set of MEMS applications. In an effort to further research and development in MEMS design, fabrication, and application, Sandia National Laboratories has launched the Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program or SAMPLES program. The SAMPLES program offers potential partners interested in MEMS the opportunity to prototype an idea and produce hardware that can be used to sell a concept. The SAMPLES program provides education and training on Sandia`s design tools, analysis tools and fabrication process. New designers can participate in the SAMPLES program and design MEMS devices using Sandia`s design and analysis tools. As part of the SAMPLES program, participants` designs are fabricated using Sandia`s 4 level polycrystalline silicon surface micromachine technology fabrication process known as SUMMiT (Sandia Ultra-planar, Multi-level MEMS Technology). Furthermore, SAMPLES participants can also opt to obtain state of the art, post-fabrication services provided at Sandia such as release, packaging, reliability characterization, and failure analysis. This paper discusses the components of the SAMPLES program.

Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

Science.gov (United States)

Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.

1995-01-01

In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

Damping control of micromachined lowpass mechanical vibration isolation filters using electrostatic actuation with electronic signal processing

Science.gov (United States)

Dean, Robert; Flowers, George; Sanders, Nicole; MacAllister, Ken; Horvath, Roland; Hodel, A. S.; Johnson, Wayne; Kranz, Michael; Whitley, Michael

2005-05-01

Some harsh environments, such as those encountered by aerospace vehicles and various types of industrial machinery, contain high frequency/amplitude mechanical vibrations. Unfortunately, some very useful components are sensitive to these high frequency mechanical vibrations. Examples include MEMS gyroscopes and resonators, oscillators and some micro optics. Exposure of these components to high frequency mechanical vibrations present in the operating environment can result in problems ranging from an increased noise floor to component failure. Passive micromachined silicon lowpass filter structures (spring-mass-damper) have been demonstrated in recent years. However, the performance of these filter structures is typically limited by low damping (especially if operated in near-vacuum environments) and a lack of tunability after fabrication. Active filter topologies, such as piezoelectric, electrostrictive-polymer-film and SMA have also been investigated in recent years. Electrostatic actuators, however, are utilized in many micromachined silicon devices to generate mechanical motion. They offer a number of advantages, including low power, fast response time, compatibility with silicon micromachining, capacitive position measurement and relative simplicity of fabrication. This paper presents an approach for realizing active micromachined mechanical lowpass vibration isolation filters by integrating an electrostatic actuator with the micromachined passive filter structure to realize an active mechanical lowpass filter. Although the electrostatic actuator can be used to adjust the filter resonant frequency, the primary application is for increasing the damping to an acceptable level. The physical size of these active filters is suitable for use in or as packaging for sensitive electronic and MEMS devices, such as MEMS vibratory gyroscope chips.

Finite element modeling of micromachined MEMS photon devices

Science.gov (United States)

Evans, Boyd M., III; Schonberger, D. W.; Datskos, Panos G.

1999-09-01

The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.

Finite Element Modeling of Micromachined MEMS Photon Devices

International Nuclear Information System (INIS)

Datskos, P.G.; Evans, B.M.; Schonberger, D.

1999-01-01

The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness

MEMS fluidic actuator

Science.gov (United States)

Kholwadwala, Deepesh K [Albuquerque, NM; Johnston, Gabriel A [Trophy Club, TX; Rohrer, Brandon R [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Okandan, Murat [Albuquerque, NM

2007-07-24

The present invention comprises a novel, lightweight, massively parallel device comprising microelectromechanical (MEMS) fluidic actuators, to reconfigure the profile, of a surface. Each microfluidic actuator comprises an independent bladder that can act as both a sensor and an actuator. A MEMS sensor, and a MEMS valve within each microfluidic actuator, operate cooperatively to monitor the fluid within each bladder, and regulate the flow of the fluid entering and exiting each bladder. When adjacently spaced in a array, microfluidic actuators can create arbitrary surface profiles in response to a change in the operating environment of the surface. In an embodiment of the invention, the profile of an airfoil is controlled by independent extension and contraction of a plurality of actuators, that operate to displace a compliant cover.

Micromachined high-performance RF passives in CMOS substrate

International Nuclear Information System (INIS)

Li, Xinxin; Ni, Zao; Gu, Lei; Wu, Zhengzheng; Yang, Chen

2016-01-01

This review systematically addresses the micromachining technologies used for the fabrication of high-performance radio-frequency (RF) passives that can be integrated into low-cost complementary metal-oxide semiconductor (CMOS)-grade (i.e. low-resistivity) silicon wafers. With the development of various kinds of post-CMOS-compatible microelectromechanical systems (MEMS) processes, 3D structural inductors/transformers, variable capacitors, tunable resonators and band-pass/low-pass filters can be compatibly integrated into active integrated circuits to form monolithic RF system-on-chips. By using MEMS processes, including substrate modifying/suspending and LIGA-like metal electroplating, both the highly lossy substrate effect and the resistive loss can be largely eliminated and depressed, thereby meeting the high-performance requirements of telecommunication applications. (topical review)

Piezoelectric MEMS sensors: state-of-the-art and perspectives

International Nuclear Information System (INIS)

Tadigadapa, S; Mateti, K

2009-01-01

Over the past two decades, several advances have been made in micromachined sensors and actuators. As the field of microelectromechanical systems (MEMS) has advanced, a clear need for the integration of materials other than silicon and its compounds into micromachined transducers has emerged. Piezoelectric materials are high energy density materials that scale very favorably upon miniaturization and that has led to an ever-growing interest in piezoelectric films for MEMS applications. At this time, piezoelectric aluminum-nitride-based film bulk acoustic resonators (FBAR) have already been successfully commercialized. Future innovations and improvements in inertial sensors for navigation, high-frequency crystal oscillators and filters for wireless applications, microactuators for RF applications, chip-scale chemical analysis systems and countless other applications hinge upon the successful miniaturization of components and integration of piezoelectrics and metals into these systems. In this article, a comprehensive review of micromachined piezoelectric transducer technology will be presented. Piezoelectric materials in bulk and thin film forms will be reviewed and fabrication techniques for the integration of these materials for microsensor applications will be presented. Recent advances in various piezoelectric microsensors will be presented through specific examples. This review will conclude with a critical assessment of the future trends and promise of this technology. (topical review)

MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

Energy Technology Data Exchange (ETDEWEB)

TANNER,DANELLE M.; SMITH,NORMAN F.; IRWIN,LLOYD W.; EATON,WILLIAM P.; HELGESEN,KAREN SUE; CLEMENT,J. JOSEPH; MILLER,WILLIAM M.; MILLER,SAMUEL L.; DUGGER,MICHAEL T.; WALRAVEN,JEREMY A.; PETERSON,KENNETH A.

2000-01-01

The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

MEMS Accelerometer with Screen Printed Piezoelectric Thick Film

DEFF Research Database (Denmark)

Hindrichsen, Christian Carstensen; Lau-Moeller, R.; Bove, T.

2006-01-01

A bulk-micromachined piezoelectric MEMS accelerometer with screen printed piezoelectric Pb(ZrxTil )O3(PZT) thick film (TF) as the sensing material has been fabricated and characterized. The accelerometer has a four beam structure with a central seismic mass (3600x3600x500 pm3) and a total chip size...

Development of a Surface Micromachined On-Chip Flat Disk Micropump

Directory of Open Access Journals (Sweden)

M. I. KILANI

2009-08-01

Full Text Available The paper presents research progress in the development of a surface micromachined flat disk micropump which employs the viscous and centrifugal effects acting on a layer of fluid sandwiched between a rotating flat disk and a stationary plate. The pump is fabricated monolithically on-chip using Sandia’s Ultraplanar Multilevel MEMS Technology (SUMMiT™ where an electrostatic comb-drive Torsional Ratcheting Actuator (TRA drives the flat disk through a geared transmission. The paper reviews available analytical models for flow geometries similar to that of the described pump, and presents a set of experiments which depict its performance and possible failure modes. Those experiments highlight future research directions in the development of electrostatically-actuated, CMOS-compatible, surface micromachined pumps.

First reliability test of a surface micromachined microengine using SHiMMeR

Energy Technology Data Exchange (ETDEWEB)

Tanner, D.M.; Smith, N.F.; Bowman, D.J. [and others

1997-08-01

The first-ever reliability stress test on surface micromachined microengines developed at Sandia National Laboratories (SNL) has been completed. We stressed 41 microengines at 36,000 RPM and inspected the functionality at 60 RPM. We have observed an infant mortality region, a region of low failure rate (useful life), and no signs of wearout in the data. The reliability data are presented and interpreted using standard reliability methods. Failure analysis results on the stressed microengines are presented. In our effort to study the reliability of MEMS, we need to observe the failures of large numbers of parts to determine the failure modes. To facilitate testing of large numbers of micromachines. The Sandia High Volume Measurement of Micromachine Reliability (SHiMMeR) system has computer controlled positioning and the capability to inspect moving parts. The development of this parallel testing system is discussed in detail.

Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

NARCIS (Netherlands)

Tilmans, H.A.C.; Ziad, H.; Jansen, Henricus V.; Di Monaco, O.; Jourdain, A.; De Raedt, W.; Rottenberg, X.; De Backer, E.; Decoussernaeker, A.; Baert, K.

2001-01-01

Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as

The Laser MicroJet (LMJ): a multi-solution technology for high quality micro-machining

Science.gov (United States)

Mai, Tuan Anh; Richerzhagen, Bernold; Snowdon, Paul C.; Wood, David; Maropoulos, Paul G.

2007-02-01

The field of laser micromachining is highly diverse. There are many different types of lasers available in the market. Due to their differences in irradiating wavelength, output power and pulse characteristic they can be selected for different applications depending on material and feature size [1]. The main issues by using these lasers are heat damages, contamination and low ablation rates. This report examines on the application of the Laser MicroJet(R) (LMJ), a unique combination of a laser beam with a hair-thin water jet as a universal tool for micro-machining of MEMS substrates, as well as ferrous and non-ferrous materials. The materials include gallium arsenide (GaAs) & silicon wafers, steel, tantalum and alumina ceramic. A Nd:YAG laser operating at 1064 nm (infra red) and frequency doubled 532 nm (green) were employed for the micro-machining of these materials.

A Nuclear Microbattery for MEMS Devices

International Nuclear Information System (INIS)

Blanchard, James; Henderson, Douglass; Lal, Amit

2002-01-01

This project was designed to demonstrate the feasibility of producing on-board power for MEMS devices using radioisotopes. MEMS is a fast growing field, with hopes for producing a wide variety of revolutionary applications, including ''labs on a chip,'' micromachined scanning tunneling microscopes, microscopic detectors for biological agents, microsystems for DNA identification, etc. Currently, these applications are limited by the lack of an on-board power source. Research is ongoing to study approaches such as fuel cells, fossil fuels, and chemical batteries, but all these concepts have limitations. For long-lived, high energy density applications, on-board radioisotope power offers the best choice. We have succeeded in producing such devices using a variety of isotopes, incorporation methods, and device geometries. These experiments have demonstrated the feasibility of using radioisotope power and that there are a variety of options available for MEMS designers. As an example of an integrated, self-powered application, we have created an oscillating cantilever beam that is capable of consistent, periodic oscillations over very long time periods without the need for refueling. Ongoing work will demonstrate that this cantilever is capable of radio frequency transmission, allowing MEMS devices to communicate with one another wirelessly. Thus, this will be the first self-powered wireless transmitter available for use in MEMS devices, permitting such applications as sensors embedded in buildings for continuous monitoring of the building performance and integrity

PECVD silicon carbide surface micromachining technology and selected MEMS applications

NARCIS (Netherlands)

Rajaraman, V.; Pakula, L.S.; Yang, H.; French, P.J.; Sarro, P.M.

2011-01-01

Attractive material properties of plasma enhanced chemical vapour deposited (PECVD) silicon carbide (SiC) when combined with CMOS-compatible low thermal budget processing provides an ideal technology platform for developing various microelectromechanical systems (MEMS) devices and merging them with

Instrumentation for the Development of Reconfigurable Microwave/MM-Wave FGC Passive Elements Using MEMS Switches for 'Smart' Systems on a Chip

National Research Council Canada - National Science Library

Papapolymerou, Ioannis

2001-01-01

.... These projects are of major significance to the Department of Defense and include topics such as reconfigurable tuners and band-stop filters using MEMS switches, micromachined cavity diplexers...

Optimized design of micromachined electric field mills to maximize electrostatic field sensitivity

Directory of Open Access Journals (Sweden)

Yu Zhou

2016-07-01

Full Text Available This paper describes the design optimization of a micromachined electric field mill, in relation to maximizing its output signal. The cases studied are for a perforated electrically grounded shutter vibrating laterally over sensing electrodes. It is shown that when modeling the output signal of the sensor, the differential charge on the sense electrodes when exposed to vs. visibly shielded from the incident electric field must be considered. Parametric studies of device dimensions show that the shutter thickness and its spacing from the underlying electrodes should be minimized as these parameters very strongly affect the MEFM signal. Exploration of the shutter perforation size and sense electrode width indicate that the best MEFM design is one where shutter perforation widths are a few times larger than the sense electrode widths. Keywords: MEFM, Finite element method, Electric field measurement, MEMS, Micromachining

On using the dynamic snap-through motion of MEMS initially curved microbeams for filtering applications

KAUST Repository

Ouakad, Hassen M.; Younis, Mohammad I.

2014-01-01

Numerical and experimental investigations of the dynamics of micromachined shallow arches (initially curved microbeams) and the possibility of using their dynamic snap-through motion for filtering purposes are presented. The considered MEMS arches are actuated by a DC electrostatic load along with an AC harmonic load. Their dynamics is examined numerically using a Galerkin-based reduced-order model when excited near both their first and third natural frequencies. Several simulation results are presented demonstrating interesting jumps and dynamic snap-through behavior of the MEMS arches and their attractive features for uses as band-pass filters, such as their sharp roll-off from pass-bands to stop-bands and their flat response. Experimental work is conducted to test arches realized of curved polysilicon microbeams when excited by DC and AC loads. Experimental data of the micromachined curved beams are shown for the softening and hardening behavior near the first and third natural frequencies, respectively, as well as dynamic snap-through motion. © 2013 Elsevier Ltd.

MEMS digital parametric loudspeaker

KAUST Repository

Carreno, Armando Arpys Arevalo

2016-03-23

This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

MEMS digital parametric loudspeaker

KAUST Repository

Carreno, Armando Arpys Arevalo; Castro, David; Conchouso Gonzalez, David; Kosel, Jü rgen; Foulds, Ian G.

2016-01-01

This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

A low-noise MEMS accelerometer for unattended ground sensor applications

Science.gov (United States)

Speller, Kevin E.; Yu, Duli

2004-09-01

A low-noise micro-machined servo accelerometer has been developed for use in Unattended Ground Sensors (UGS). Compared to conventional coil-and-magnet based velocity transducers, this Micro-Electro-Mechanical System (MEMS) accelerometer offers several key benefits for battlefield monitoring. Many UGS require a compass to determine deployment orientation with respect to magnetic North. This orientation information is critical for determining the bearing of incoming signals. Conventional sensors with sensing technology based on a permanent magnet can cause interference with a compass when used in close proximity. This problem is solved with a MEMS accelerometer which does not require any magnetic materials. Frequency information below 10 Hz is valuable for identification of signal sources. Conventional seismometers used in UGS are typically limited in frequency response from 20 to 200 Hz. The MEMS accelerometer has a flat frequency response from DC to 5 kHz. The wider spectrum of signals received improves detection, classification and monitoring on the battlefield. The DC-coupled output of the MEMS accelerometer also has the added benefit of providing tilt orientation data for the deployed UGS. Other performance parameters of the MEMS accelerometer that are important to UGS such as size, weight, shock survivability, phase response, distortion, and cross-axis rejection will be discussed. Additionally, field test data from human footsteps recorded with the MEMS accelerometer will be presented.

EDITORIAL: The Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004)

Science.gov (United States)

Tanaka, Shuji; Toriyama, Toshiyuki

2005-09-01

This special issue of the Journal of Micromechanics and Microengineering features papers selected from the Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004). The workshop was held in Kyoto, Japan, on 28-30 November 2004, by The Ritsumeikan Research Institute of Micro System Technology in cooperation with The Global Emerging Technology Institute, The Institute of Electrical Engineers of Japan, The Sensors and Micromachines Society, The Micromachine Center and The Kyoto Nanotech Cluster. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of power MEMS was proposed in the late 1990s by Epstein's group at the Massachusetts Institute of Technology, where they continue to study MEMS-based gas turbine generators. Since then, the research and development of power MEMS have been promoted by the need for compact power sources with high energy and power density. Since its inception, power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. At the last workshop, various devices and systems, such as portable fuel cells and their peripherals, micro and small turbo machinery, energy harvesting microdevices, and microthrusters, were presented. Their power levels vary from ten nanowatts to hundreds of watts, spanning ten orders of magnitude. The first PowerMEMS workshop was held in 2000 in Sendai, Japan, and consisted of only seven invited presentations. The workshop has grown since then, and in 2004 there were 5 invited, 20 oral and 29 poster presentations. From the 54 papers in the proceedings, 12 papers have been selected for this special issue. I would like to express my appreciation to the members of the Organizing Committee and Technical Program Committee. This special issue was

Payload characterization for CubeSat demonstration of MEMS deformable mirrors

Science.gov (United States)

Marinan, Anne; Cahoy, Kerri; Webber, Matthew; Belikov, Ruslan; Bendek, Eduardo

2014-08-01

Coronagraphic space telescopes require wavefront control systems for high-contrast imaging applications such as exoplanet direct imaging. High-actuator-count MEMS deformable mirrors (DM) are a key element of these wavefront control systems yet have not been flown in space long enough to characterize their on-orbit performance. The MEMS Deformable Mirror CubeSat Testbed is a conceptual nanosatellite demonstration of MEMS DM and wavefront sensing technology. The testbed platform is a 3U CubeSat bus. Of the 10 x 10 x 34.05 cm (3U) available volume, a 10 x 10 x 15 cm space is reserved for the optical payload. The main purpose of the payload is to characterize and calibrate the onorbit performance of a MEMS deformable mirror over an extended period of time (months). Its design incorporates both a Shack Hartmann wavefront sensor (internal laser illumination), and a focal plane sensor (used with an external aperture to image bright stars). We baseline a 32-actuator Boston Micromachines Mini deformable mirror for this mission, though the design is flexible and can be applied to mirrors from other vendors. We present the mission design and payload architecture and discuss experiment design, requirements, and performance simulations.

CARES/Life Used for Probabilistic Characterization of MEMS Pressure Sensor Membranes

Science.gov (United States)

Nemeth, Noel N.

2002-01-01

Microelectromechanical systems (MEMS) devices are typically made from brittle materials such as silicon using traditional semiconductor manufacturing techniques. They can be etched (or micromachined) from larger structures or can be built up with material deposition processes. Maintaining dimensional control and consistent mechanical properties is considerably more difficult for MEMS because feature size is on the micrometer scale. Therefore, the application of probabilistic design methodology becomes necessary for MEMS. This was demonstrated at the NASA Glenn Research Center and Case Western Reserve University in an investigation that used the NASA-developed CARES/Life brittle material design program to study the probabilistic fracture strength behavior of single-crystal SiC, polycrystalline SiC, and amorphous Si3N4 pressurized 1-mm-square thin-film diaphragms. These materials are of interest because of their superior high-temperature characteristics, which are desirable for harsh environment applications such as turbine engine and rocket propulsion system hot sections.

MEMS-based microspectrometer technologies for NIR and MIR wavelengths

International Nuclear Information System (INIS)

Schuler, Leo P; Milne, Jason S; Dell, John M; Faraone, Lorenzo

2009-01-01

Commercially manufactured near-infrared (NIR) instruments became available about 50 years ago. While they have been designed for laboratory use in a controlled environment and boast high performance, they are generally bulky, fragile and maintenance intensive, and therefore expensive to purchase and maintain. Micromachining is a powerful technique to fabricate micromechanical parts such as integrated circuits. It was perfected in the 1980s and led to the invention of micro electro mechanical systems (MEMSs). The three characteristic features of MEMS fabrication technologies are miniaturization, multiplicity and microelectronics. Combined, these features allow the batch production of compact and rugged devices with integrated intelligence. In order to build more compact, more rugged and less expensive NIR instruments, MEMS technology has been successfully integrated into a range of new devices. In the first part of this paper we discuss the UWA MEMS-based Fabry-Perot spectrometer, its design and issues to be solved. MEMS-based Fabry-Perot filters primarily isolate certain wavelengths by sweeping across an incident spectrum and the resulting monochromatic signal is detected by a broadband detector. In the second part, we discuss other microspectrometers including other Fabry-Perot spectrometer designs, time multiplexing devices and mixed time/space multiplexing devices. (topical review)

Two-layer radio frequency MEMS fractal capacitors in PolyMUMPS for S-band applications

KAUST Repository

Elshurafa, Amro M.

2012-07-23

In this Letter, the authors fabricate for the first time MEMS fractal capacitors possessing two layers and compare their performance characteristics with the conventional parallel-plate capacitor and previously reported state-of-the-art single-layer MEMS fractal capacitors. Explicitly, a capacitor with a woven structure and another with an interleaved configuration were fabricated in the standard PolyMUMPS surface micromachining process and tested at S-band frequencies. The self-resonant frequencies of the fabricated capacitors were close to 10GHz, which is better than that of the parallel-plate capacitor, which measured only 5.5GHz. Further, the presented capacitors provided a higher capacitance when compared with the state-of-the-art-reported MEMS fractal capacitors created using a single layer at the expense of a lower quality factor. © 2012 The Institution of Engineering and Technology.

Adaptive Sliding Mode Control of MEMS AC Voltage Reference Source

Directory of Open Access Journals (Sweden)

Ehsan Ranjbar

2017-01-01

Full Text Available The accuracy of physical parameters of a tunable MEMS capacitor, as the major part of MEMS AC voltage reference, is of great importance to achieve an accurate output voltage free of the malfunctioning noise and disturbance. Even though strenuous endeavors are made to fabricate MEMS tunable capacitors with desiderated accurate physical characteristics and ameliorate exactness of physical parameters’ values, parametric uncertainties ineluctably emerge in fabrication process attributable to imperfections in micromachining process. First off, this paper considers applying an adaptive sliding mode controller design in the MEMS AC voltage reference source so that it is capable of giving off a well-regulated output voltage in defiance of jumbling parametric uncertainties in the plant dynamics and also aggravating external disturbance imposed on the system. Secondly, it puts an investigatory comparison with the designed model reference adaptive controller and the pole-placement state feedback one into one’s prospective. Not only does the tuned adaptive sliding mode controller show remarkable robustness against slow parameter variation and external disturbance being compared to the pole-placement state feedback one, but also it immensely gets robust against the external disturbance in comparison with the conventional adaptive controller. The simulation results are promising.

Unveiling the wet chemical etching characteristics of polydimethylsiloxane film for soft micromachining applications

International Nuclear Information System (INIS)

Kakati, A; Maji, D; Das, S

2017-01-01

Micromachining of a polydimethylsiloxane (PDMS) microstructure by wet chemical etching is explored for microelectromechanical systems (MEMS) and microfluidic applications. A 100 µ m thick PDMS film was patterned with different microstructure designs by wet chemical etching using a N-methyl-2-pyrrolidone (C 16 H 36 FN) and tetra-n-butylammonium fluoride (C 5 H 9 NO) mixture solution with 3:1 volume ratio after lithography for studying etching characteristics. The patterning parameters, such as etch rate, surface roughness, pH of etchant solution with time, were thoroughly investigated. A detailed study of surface morphology with etching time revealed nonlinear behaviour of the PDMS surface roughness and etch rate. A maximum rate of 1.45 µ m min −1 for 10 min etching with surface roughness of 360 nm was achieved. A new approach of wet chemical etching with pH controlled doped etchant was introduced for lower surface roughness of etched microstructures, and a constant etch rate during etching. Variation of the etching rate and surface roughness by pH controlled etching was performed by doping 5–15 gm l −1 of silicic acid (SiO 2xH2 O) into the traditional etchant solution. PDMS etching by silicic acid doped etchant solution showed a reduction in surface roughness from 400 nm to 220 nm for the same 15 µ m etching. This study is beneficial for micromachining of various MEMS and microfluidic structures such as micropillars, microchannels, and other PDMS microstructures. (paper)

A Novel Silicon Micromachined Integrated MCM Thermal Management System

Science.gov (United States)

Kazmierczak, M. J.; Henderson, H. T.; Gerner, F. M.

1997-01-01

"Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high

MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics

Science.gov (United States)

Marek, Jiri; Gómez, Udo-Martin

MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving

Calibration of High Frequency MEMS Microphones

Science.gov (United States)

Shams, Qamar A.; Humphreys, William M.; Bartram, Scott M.; Zuckewar, Allan J.

2007-01-01

Understanding and controlling aircraft noise is one of the major research topics of the NASA Fundamental Aeronautics Program. One of the measurement technologies used to acquire noise data is the microphone directional array (DA). Traditional direction array hardware, consisting of commercially available condenser microphones and preamplifiers can be too expensive and their installation in hard-walled wind tunnel test sections too complicated. An emerging micro-machining technology coupled with the latest cutting edge technologies for smaller and faster systems have opened the way for development of MEMS microphones. The MEMS microphone devices are available in the market but suffer from certain important shortcomings. Based on early experiments with array prototypes, it has been found that both the bandwidth and the sound pressure level dynamic range of the microphones should be increased significantly to improve the performance and flexibility of the overall array. Thus, in collaboration with an outside MEMS design vendor, NASA Langley modified commercially available MEMS microphone as shown in Figure 1 to meet the new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Over the years, several methods have been used for microphone calibration. Some of the common methods of microphone calibration are Coupler (Reciprocity, Substitution, and Simultaneous), Pistonphone, Electrostatic actuator, and Free-field calibration (Reciprocity, Substitution, and Simultaneous). Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones for wideband frequency ranges; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size. Hence a substitution-based, free-field method was developed to

Amorphous Diamond MEMS and Sensors

Energy Technology Data Exchange (ETDEWEB)

SULLIVAN, JOHN P.; FRIEDMANN, THOMAS A.; ASHBY, CAROL I.; DE BOER, MAARTEN P.; SCHUBERT, W. KENT; SHUL, RANDY J.; HOHLFELDER, ROBERT J.; LAVAN, D.A.

2002-06-01

This report describes a new microsystems technology for the creation of microsensors and microelectromechanical systems (MEMS) using stress-free amorphous diamond (aD) films. Stress-free aD is a new material that has mechanical properties close to that of crystalline diamond, and the material is particularly promising for the development of high sensitivity microsensors and rugged and reliable MEMS. Some of the unique properties of aD include the ability to easily tailor film stress from compressive to slightly tensile, hardness and stiffness 80-90% that of crystalline diamond, very high wear resistance, a hydrophobic surface, extreme chemical inertness, chemical compatibility with silicon, controllable electrical conductivity from insulating to conducting, and biocompatibility. A variety of MEMS structures were fabricated from this material and evaluated. These structures included electrostatically-actuated comb drives, micro-tensile test structures, singly- and doubly-clamped beams, and friction and wear test structures. It was found that surface micromachined MEMS could be fabricated in this material easily and that the hydrophobic surface of the film enabled the release of structures without the need for special drying procedures or the use of applied hydrophobic coatings. Measurements using these structures revealed that aD has a Young's modulus of {approx}650 GPa, a tensile fracture strength of 8 GPa, and a fracture toughness of 8 MPa{center_dot}m {sup 1/2}. These results suggest that this material may be suitable in applications where stiction or wear is an issue. Flexural plate wave (FPW) microsensors were also fabricated from aD. These devices use membranes of aD as thin as {approx}100 nm. The performance of the aD FPW sensors was evaluated for the detection of volatile organic compounds using ethyl cellulose as the sensor coating. For comparable membrane thicknesses, the aD sensors showed better performance than silicon nitride based sensors. Greater

Development of an SU-8 MEMS process with two metal electrodes using amorphous silicon as a sacrificial material

KAUST Repository

Ramadan, Khaled S.

2013-02-08

This work presents an SU-8 surface micromachining process using amorphous silicon as a sacrificial material, which also incorporates two metal layers for electrical excitation. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic applications due to its mechanical properties, biocompatibility and low cost. Amorphous silicon is used as a sacrificial layer in MEMS applications because it can be deposited in large thicknesses, and can be released in a dry method using XeF2, which alleviates release-based stiction problems related to MEMS applications. In this work, an SU-8 MEMS process was developed using ;-Si as a sacrificial layer. Two conductive metal electrodes were integrated in this process to allow out-of-plane electrostatic actuation for applications like MEMS switches and variable capacitors. In order to facilitate more flexibility for MEMS designers, the process can fabricate dimples that can be conductive or nonconductive. Additionally, this SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were optimized for two sets of thicknesses: thin (5-10 m) and thick (130 m). The process was tested fabricating MEMS switches, capacitors and thermal actuators. © 2013 IOP Publishing Ltd.

Minimizing stress in large-area surface micromachined perforated membranes with slits

International Nuclear Information System (INIS)

Ghaderi, M; Ayerden, N P; De Graaf, G; Wolffenbuttel, R F

2015-01-01

This paper presents the effectiveness of both design and fabrication techniques for avoiding the rupturing or excessive bending of perforated membranes after release in surface micromachining. Special lateral designs of arrays of slits in the membrane were investigated for a maximum yield at a given level of residual stress. Process parameters were investigated and optimized for minimum residual stress in multilayer thin-film membranes. A 2 µm thick sacrificial TEOS layer and a structural membrane that is composed of silicon nitride and polysilicon layers in the stack is the basis of this study. The effect of sharp corners on the local stress in membranes was investigated, and structures are proposed that reduce these effects, maximizing the yield at a given level of residual stress. The effects of perforation and slits were studied both theoretically and using finite element analysis. While the overall effect of perforation is negligible in typical MEMS structures, an optimum design for the slits reduces the von Mises stress considerably as compared to sharp corners. The fabrication process was also investigated and optimized for the minimum residual stress of both the layers within the stack and the complete layer stack. The main emphasis of this work is on placing a stress-compensating layer on the wafer backside and simultaneously removing it during the surface micromachining, as this has been found to be the most effective method to reduce the overall stress in a stack of layers after sacrificial etching. Implementation of a stress compensating layer reduced the total residual stress from 200 MPa compressive into almost 60 MPa, tensile. Even though a particular structure was studied here, the employed methods are expected to be applicable to similar MEMS design problems. (paper)

A Micromachined Infrared Senor for an Infrared Focal Plane Array

Directory of Open Access Journals (Sweden)

Seong M. Cho

2008-04-01

Full Text Available A micromachined infrared sensor for an infrared focal plane array has been designed and fabricated. Amorphous silicon was used as a sensing material, and silicon nitride was used as a membrane material. To get a good absorption in infrared range, the sensor structure was designed as a l/4 cavity structure. A Ni-Cr film was selected as an electrode material and mixed etching scheme was applied in the patterning process of the Ni-Cr electrode. All the processes were made in 0.5 μm iMEMS fabricated in the Electronics and Telecommunication Research Institute (ETRI. The processed MEMS sensor had a small membrane deflection less than 0.15 μm. This small deflection can be attributed to the rigorous balancing of the stresses of individual layers. The efficiency of infrared absorption was more than 75% in the wavelength range of 8 ~ 14 μm. The processed infrared sensor showed high responsivity of ~230 kV/W at 1.0V bias and 2 Hz operation condition. The time constant of the sensor was 8.6 msec, which means that the sensor is suitable to be operated in 30 Hz frame rate.

Micromachined fiber optic Fabry-Perot underwater acoustic probe

Science.gov (United States)

Wang, Fuyin; Shao, Zhengzheng; Hu, Zhengliang; Luo, Hong; Xie, Jiehui; Hu, Yongming

2014-08-01

One of the most important branches in the development trend of the traditional fiber optic physical sensor is the miniaturization of sensor structure. Miniature fiber optic sensor can realize point measurement, and then to develop sensor networks to achieve quasi-distributed or distributed sensing as well as line measurement to area monitoring, which will greatly extend the application area of fiber optic sensors. The development of MEMS technology brings a light path to address the problems brought by the procedure of sensor miniaturization. Sensors manufactured by MEMS technology possess the advantages of small volume, light weight, easy fabricated and low cost. In this paper, a fiber optic extrinsic Fabry-Perot interferometric underwater acoustic probe utilizing micromachined diaphragm collaborated with fiber optic technology and MEMS technology has been designed and implemented to actualize underwater acoustic sensing. Diaphragm with central embossment, where the embossment is used to anti-hydrostatic pressure which would largely deflect the diaphragm that induce interferometric fringe fading, has been made by double-sided etching of silicon on insulator. By bonding the acoustic-sensitive diaphragm as well as a cleaved fiber end in ferrule with an outer sleeve, an extrinsic Fabry-Perot interferometer has been constructed. The sensor has been interrogated by quadrature-point control method and tested in field-stable acoustic standing wave tube. Results have been shown that the recovered signal detected by the sensor coincided well with the corresponding transmitted signal and the sensitivity response was flat in frequency range from 10 Hz to 2kHz with the value about -154.6 dB re. 1/μPa. It has been manifest that the designed sensor could be used as an underwater acoustic probe.

FY 1998 report on the R and D of micromachine technology. R and D of micromachine technology; 1998 nendo micromachine gijutsu no kenkyu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

2000-03-01

In the comprehensive investigational study of micromachine technology, the paper aims at clarifying the improvement of functional devices and the future development of micromachine technology for establishment of the technology needed to realize a micromachine system composing of small-functional elements for conducting diagnosis/cure/repair, movement and independent work in small portions in living organism, disaster site, etc. and a medical-use micromachine system to analyze/react on a trace of liquid. In this fiscal year, the following were carried out: 1) study of micromachine systems, 2) study of a medical-use micromachine system to analyze/react on a trace liquid, and 3) comprehensive investigational study. In 1), studies were made toward the minuteness and improvement of micro laser catheter and micro tactile sensor catheter as functional devices which become the main components of micro catheter for cerebrovascular diagnosis/therapy use and toward the minuteness and improvement of disaster relief use micromachine system. In 2), study was made of element technology of a micro-machine system having functions of sampling/analysis/reaction of a trace of liquid. (NEDO)

Micromachining Lithium Niobate for Rapid Prototyping of Resonant Biosensors

International Nuclear Information System (INIS)

Al-Shibaany, Zeyad Yousif Abdoon; Hedley, John; Huo, Dehong; Hu, Zhongxu

2014-01-01

Lithium niobate material is widely used in MEMS application due to its piezoelectric properties. This paper presents the micromachining process of lithium niobate to rapid prototype a resonant biosensor design. A high precision CNC machine was used to machine a sample of lithium niobate material at 5 different spindle speeds to find out the best conditions to machine this brittle material. A qualitative visual check of the surface was performed by using scanning electron microscopy, surface roughness was quantitatively investigated using an optical surface profiler and Raman spectroscopy to check the strain of the surface. Results show that the surface quality of the lithium niobate was significantly affected by the spindle speed with optimum conditions at 70k rpm giving a strained surface with 500 nm rms roughness

Capacitive micromachined ultrasonic transducers for medical imaging and therapy.

Science.gov (United States)

Khuri-Yakub, Butrus T; Oralkan, Omer

2011-05-01

Capacitive micromachined ultrasonic transducers (CMUTs) have been subject to extensive research for the last two decades. Although they were initially developed for air-coupled applications, today their main application space is medical imaging and therapy. This paper first presents a brief description of CMUTs, their basic structure, and operating principles. Our progression of developing several generations of fabrication processes is discussed with an emphasis on the advantages and disadvantages of each process. Monolithic and hybrid approaches for integrating CMUTs with supporting integrated circuits are surveyed. Several prototype transducer arrays with integrated frontend electronic circuits we developed and their use for 2-D and 3-D, anatomical and functional imaging, and ablative therapies are described. The presented results prove the CMUT as a MEMS technology for many medical diagnostic and therapeutic applications.

MEMS Coupled Resonator for Filter Application in Air

KAUST Repository

Ilyas, Saad; Jaber, Nizar; Younis, Mohammad I.

2017-01-01

We present a mechanically coupled MEMS H resonator capable of performing simultaneous amplification and filter operation in air. The device comprises of two doubly clamped polyimide microbeams joined through the middle by a coupling beam of the same size. The resonator is fabricated via a multilayer surface micromachining process. A special fabrication process and device design is employed to enable the device's operation in air and to achieve mechanical amplification of the output response. Moreover, mixed-frequency excitation is used to demonstrate a tunable wide band filter. The device design combined with the mixed-frequency excitation is used to demonstrate simultaneous amplification and filtering in air.

MEMS Coupled Resonator for Filter Application in Air

KAUST Repository

Ilyas, Saad

2017-11-03

We present a mechanically coupled MEMS H resonator capable of performing simultaneous amplification and filter operation in air. The device comprises of two doubly clamped polyimide microbeams joined through the middle by a coupling beam of the same size. The resonator is fabricated via a multilayer surface micromachining process. A special fabrication process and device design is employed to enable the device\\'s operation in air and to achieve mechanical amplification of the output response. Moreover, mixed-frequency excitation is used to demonstrate a tunable wide band filter. The device design combined with the mixed-frequency excitation is used to demonstrate simultaneous amplification and filtering in air.

SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

KAUST Repository

Ramadan, Khaled S.

2012-04-01

Polymer based microelectromechanical systems (MEMS) micromachining is finding more interest in research and applications. This is due to its low cost and less time processing compared with silicon MEMS. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic devices. In addition to being processed with low cost, it is a biocompatible material with good mechanical properties. Also, amorphous silicon (α-Si) has found use as a sacrificial layer in silicon MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed using amorphous silicon (α-Si) as a sacrificial layer. Electrostatic actuation and sensing is used in many MEMS applications. SU-8 is a dielectric material which limits its direct use in electrostatic actuation. This thesis provides a MEMS process with two conductive metal electrodes that can be used for out-of-plane electrostatic applications like MEMS switches and variable capacitors. The process provides the fabrication of dimples that can be conductive or non-conductive to facilitate more flexibility for MEMS designers. This SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were tuned for two sets of thicknesses which are thin (5-10μm) and thick (130μm). Chevron bent-beam structures and different suspended beams (cantilevers and bridges) were fabricated to characterize the SU-8 process through extracting the density, Young’s Modulus and the Coefficient of Thermal Expansion (CTE) of SU-8. Also, the process was tested and used as an educational tool through which different MEMS structures were fabricated including MEMS switches, variable capacitors and thermal actuators.

Frequency-dependent electrostatic actuation in microfluidic MEMS.

Energy Technology Data Exchange (ETDEWEB)

Zavadil, Kevin Robert; Michalske, Terry A.; Sounart, Thomas L.

2003-09-01

Electrostatic actuators exhibit fast response times and are easily integrated into microsystems because they can be fabricated with standard IC micromachining processes and materials. Although electrostatic actuators have been used extensively in 'dry' MEMS, they have received less attention in microfluidic systems probably because of challenges such as electrolysis, anodization, and electrode polarization. Here we demonstrate that ac drive signals can be used to prevent electrode polarization, and thus enable electrostatic actuation in many liquids, at potentials low enough to avoid electrochemistry. We measure the frequency response of an interdigitated silicon comb-drive actuator in liquids spanning a decade of dielectric permittivities and four decades of conductivity, and present a simple theory that predicts the characteristic actuation frequency. The analysis demonstrates the importance of the native oxide on silicon actuator response, and suggests that the actuation frequency can be shifted by controlling the thickness of the oxide. For native silicon devices, actuation is predicted at frequencies less than 10 MHz, in electrolytes of ionic strength up to 100 mmol/L, and thus electrostatic actuation may be feasible in many bioMEMS and other microfluidic applications.

GPS/MEMS IMU/Microprocessor Board for Navigation

Science.gov (United States)

Gender, Thomas K.; Chow, James; Ott, William E.

2009-01-01

A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

Si Micro-turbine by Proton BeamWriting and Porous Silicon Micromachining

International Nuclear Information System (INIS)

Rajta, I.; Szilasi, S.Z.; Fekete, Z.

2008-01-01

Complete text of publication follows. A 3D Si micro-turbine characterized by high aspect ratio vertical walls was formed by the combination of proton beam writing (PBW) and subsequent selective porous Si (PS) etching. Crystal damages generated by the implanted protons result in increased resistivity, thereby limit or even prevent the current to flow through the implanted area during electrochemical etching. Characteristic feature of the proposed process is that the shape of the micro electromechanical (MEMS) components is defined by two implantation energies. A higher energy is applied for defining the housing of the device while the lower energy is used to write the moving components. The implantation energies were selected such as to result appropriate difference between the two projected ranges, thereby providing structures with different height after development. The thickness of the walls of the moving component and the isotropic etching profile of the electrochemical PS formation was also taken into consideration. The electrochemical etching is driven until the sacrificial PS layer completely under etches the moving components, but the etch-front does not reach the bottom of the housing. Therefore, the dissolution of PS results in a ready-to-operate device with a released moving component embedded in the cavity of the housing. The operation of the encapsulated device fabricated by the two-energy implantation is successfully demonstrated (Fig. 1). Rotation speed of the device is estimated in the range of thousands rpm, however, further analysis of the novel structure optimized for performance and MEMS compatible assembly will be done and precise characteristics will be determined by adequate optical read-out method. The feasibility of Proton Beam Writing combined with Porous Si Micromachining and conventional Si processing steps was successfully demonstrated by fabricating Si microturbine chip. The aligned, two-energy proton beam implantation can provide high

Complex three-dimensional structures in Si{1 0 0} using wet bulk micromachining

International Nuclear Information System (INIS)

Pal, Prem; Sato, Kazuo

2009-01-01

Complex three-dimensional structures for microelectromechanical systems (MEMS) are fabricated in Si{1 0 0} wafers using wet bulk micromachining. The structures are divided into two categories: fixed and freestanding. The fabrication processes for both types utilize single wafers with sequentially deposited nitride and oxide layers, local oxidation of silicon (LOCOS) and two steps of wet anisotropic etching. The fixed structures contain perfectly sharp edges. Thermally deposited oxide is used as the material for the freestanding structures. Wet etching is performed in tetramethyl ammonium hydroxide (TMAH) with and without Triton X-100 (C 14 H 22 O(C 2 H 4 O) n , n = 9–10). For the fixed structures, both etching steps are performed either in 25 wt% TMAH + Triton or pure TMAH or both, depending upon the type of the structures. In the case of freestanding systems, TMAH + Triton is utilized first, followed by pure TMAH. The fabrication methods enable densely arrayed structures, allowing the manufacture of corrugated diaphragms, compact size liquid (or gas) flow delivery systems, newly shaped mold for soft MEMS structures (e.g. PDMS (polydimethylsiloxane)) and other applications. The present research is an approach to fabricate advanced MEMS structures, extending the range of 3D structures fabricated by silicon anisotropic etching

Infrastructure for the design and fabrication of MEMS for RF/microwave and millimeter wave applications

Science.gov (United States)

Nerguizian, Vahe; Rafaf, Mustapha

2004-08-01

This article describes and provides valuable information for companies and universities with strategies to start fabricating MEMS for RF/Microwave and millimeter wave applications. The present work shows the infrastructure developed for RF/Microwave and millimeter wave MEMS platforms, which helps the identification, evaluation and selection of design tools and fabrication foundries taking into account packaging and testing. The selected and implemented simple infrastructure models, based on surface and bulk micromachining, yield inexpensive and innovative approaches for distributed choices of MEMS operating tools. With different educational or industrial institution needs, these models may be modified for specific resource changes using a careful analyzed iteration process. The inputs of the project are evaluation selection criteria and information sources such as financial, technical, availability, accessibility, simplicity, versatility and practical considerations. The outputs of the project are the selection of different MEMS design tools or software (solid modeling, electrostatic/electromagnetic and others, compatible with existing standard RF/Microwave design tools) and different MEMS manufacturing foundries. Typical RF/Microwave and millimeter wave MEMS solutions are introduced on the platform during the evaluation and development phases of the project for the validation of realistic results and operational decision making choices. The encountered challenges during the investigation and the development steps are identified and the dynamic behavior of the infrastructure is emphasized. The inputs (resources) and the outputs (demonstrated solutions) are presented in tables and flow chart mode diagrams.

Silicon micromachining using a high-density plasma source

International Nuclear Information System (INIS)

McAuley, S.A.; Ashraf, H.; Atabo, L.; Chambers, A.; Hall, S.; Hopkins, J.; Nicholls, G.

2001-01-01

Dry etching of Si is critical in satisfying the demands of the micromachining industry. The micro-electro-mechanical systems (MEMS) community requires etches capable of high aspect ratios, vertical profiles, good feature size control and etch uniformity along with high throughput to satisfy production requirements. Surface technology systems' (STS's) high-density inductively coupled plasma (ICP) etch tool enables a wide range of applications to be realized whilst optimizing the above parameters. Components manufactured from Si using an STS ICP include accelerometers and gyroscopes for military, automotive and domestic applications. STS's advanced silicon etch (ASE TM ) has also allowed the first generation of MEMS-based optical switches and attenuators to reach the marketplace. In addition, a specialized application for fabricating the next generation photolithography exposure masks has been optimized for 200 mm diameter wafers, to depths of ∼750 μm. Where the profile is not critical, etch rates of greater than 8 μm min -1 have been realized to replace previous methods such as wet etching. This is also the case for printer applications. Specialized applications that require etching down to pyrex or oxide often result in the loss of feature size control at the interface; this is an industry wide problem. STS have developed a technique to address this. The rapid progression of the industry has led to development of the STS ICP etch tool, as well as the process. (author)

Micro Elector Mechanical Systems

International Nuclear Information System (INIS)

Yun, Jun Bo; Jo, Il Ju; Choi, Yoon Seok

1996-09-01

This book consists of seven chapters, which are the flow of the age from macro world to micro world, what is MEMS, semiconductor, micro machining and MEMS, where do MEMS goes to?, How to make MEMS, MEMS in the future and knowing about MEMS more than. This book is written to explain in ease and fun. It deals with MEMS in IT, BT, NT, ST, micro robot technology, basic process for making MEMS such as Bulk micromachining, surface micromachining LGA technology, DARPA and organization in domestic and overseas and academy and journal related MEMS.

Design and optimization of stress centralized MEMS vector hydrophone with high sensitivity at low frequency

Science.gov (United States)

Zhang, Guojun; Ding, Junwen; Xu, Wei; Liu, Yuan; Wang, Renxin; Han, Janjun; Bai, Bing; Xue, Chenyang; Liu, Jun; Zhang, Wendong

2018-05-01

A micro hydrophone based on piezoresistive effect, "MEMS vector hydrophone" was developed for acoustic detection application. To improve the sensitivity of MEMS vector hydrophone at low frequency, we reported a stress centralized MEMS vector hydrophone (SCVH) mainly used in 20-500 Hz. Stress concentration area was actualized in sensitive unit of hydrophone by silicon micromachining technology. Then piezoresistors were placed in stress concentration area for better mechanical response, thereby obtaining higher sensitivity. Static analysis was done to compare the mechanical response of three different sensitive microstructure: SCVH, conventional micro-silicon four-beam vector hydrophone (CFVH) and Lollipop-shaped vector hydrophone (LVH) respectively. And fluid-structure interaction (FSI) was used to analyze the natural frequency of SCVH for ensuring the measurable bandwidth. Eventually, the calibration experiment in standing wave field was done to test the property of SCVH and verify the accuracy of simulation. The results show that the sensitivity of SCVH has nearly increased by 17.2 dB in contrast to CFVH and 7.6 dB in contrast to LVH during 20-500 Hz.

Wideband MEMS Resonator Using Multifrequency Excitation

KAUST Repository

Jaber, Nizar; Ramini, Abdallah; Al Hennawi, Qais M.; Younis, Mohammad I.

2016-01-01

We demonstrate the excitation of combination resonances of additive and subtractive types and their exploitations to realize a large bandwidth micro-machined resonator of large amplitude even at higher harmonic modes of vibrations. The investigation is conducted on a Microelectromechanical systems (MEMS) clamped-clamped microbeam fabricated using polyimide as a structural layer coated with nickel from top and chromium and gold layers from bottom. The microbeam is excited by a two-source harmonic excitation, where the first frequency source is swept around the targeted resonance (first or third mode of vibration) while the second source frequency is kept fixed. We report for the first time a large bandwidth and large amplitude response near the higher order modes of vibration. Also, we show that by properly tuning the frequency and amplitude of the excitation force, the frequency bandwidth of the resonator is controlled.

Wideband MEMS Resonator Using Multifrequency Excitation

KAUST Repository

Jaber, Nizar

2016-03-09

We demonstrate the excitation of combination resonances of additive and subtractive types and their exploitations to realize a large bandwidth micro-machined resonator of large amplitude even at higher harmonic modes of vibrations. The investigation is conducted on a Microelectromechanical systems (MEMS) clamped-clamped microbeam fabricated using polyimide as a structural layer coated with nickel from top and chromium and gold layers from bottom. The microbeam is excited by a two-source harmonic excitation, where the first frequency source is swept around the targeted resonance (first or third mode of vibration) while the second source frequency is kept fixed. We report for the first time a large bandwidth and large amplitude response near the higher order modes of vibration. Also, we show that by properly tuning the frequency and amplitude of the excitation force, the frequency bandwidth of the resonator is controlled.

Mechanical characterization of biocompatible thin film materials by scanning along micro-machined cantilevers for micro-/nano-system

International Nuclear Information System (INIS)

He, J.H.; Luo, J.K.; Le, H.R.; Moore, D.F.

2006-01-01

Mechanical characterization is vital for the design of micro-/nano-electro-mechanical system (MEMS/NEMS). This paper describes a new characterization method to extract the mechanical properties of the thin film materials, which is simple, inexpensive and applicable to a wide range of materials including biocompatible ones described in this paper. The beams of the material under tests, are patterned by laser micro-machining and released by alkaline etch. A surface profilometer is used to scan along micro-machined cantilevers and produce a bending profile, from which the Young's modulus can be extracted. Biocompatible SiN x , SiC and nanocrystal diamond cantilevers have been fabricated and their Young's modulus has been evaluated as 154 ± 12, 360 ± 50 and 504 ± 50 GPa, respectively, which is consistent with those measured by nano-indentation. Residual stress gradient has also been extracted by surface profilometer, which is comparable with the results inferred from ZYGO interferometer measurements. This method can be extended to atomic force microscopy stylus or nanometer-stylus profilometer for Bio-NEMS mechanical characterization

Comparison of residual stress measurement in thin films using surface micromachining method

International Nuclear Information System (INIS)

He, Q.; Luo, Z.X.; Chen, X.Y.

2008-01-01

Conductive, dielectric, semiconducting, piezoelectric and ferroelectric thin films are extensively used for MEMS/NEMS applications. One of the important parameters of thin films is residual stress. The residual stress can seriously affect the properties, performance and long-term stability of the films. Excessive compressive or tensile stress results in buckling, cracking, splintering and sticking problems. Stress measurement techniques are therefore essential for both process development and process monitoring. Many suggestions for stress measurement in thin films have been made over the past several decades. This paper is concentrated on the in situ stress measurement using surface micromachining techniques to determine the residual stress. The authors review and compare several types of stress measurement methods including buckling technique, rotating technique, micro strain gauge and long-short beam strain sensor

A MEMS coupled resonator for frequency filtering in air

KAUST Repository

Ilyas, Saad

2018-02-03

We present design, fabrication, and characterization of a mechanically coupled MEMS H resonator capable of performing simultaneous mechanical amplification and filtering in air. The device comprises of two doubly clamped polyimide microbeams joined through the middle by a coupling beam of the same size. The resonator is fabricated via a multi-layer surface micromachining process. A special fabrication process and device design is employed to enable operation in air and to achieve mechanical amplification of the output response. Moreover, mixed-frequency excitation is used to demonstrate a tunable wide band filter for low frequency applications. It is demonstrated that through the multi-source harmonic excitation and the operation in air, an improved band-pass filter with flat response and minimal ripples can be achieved.

Studying the mechanism of micromachining by short pulsed laser

Science.gov (United States)

Gadag, Shiva

The semiconductor materials like Si and the transparent dielectric materials like glass and quartz are extensively used in optoelectronics, microelectronics, and microelectromechanical systems (MEMS) industries. The combination of these materials often go hand in hand for applications in MEMS such as in chips for pressure sensors, charge coupled devices (CCD), and photovoltaic (PV) cells for solar energy generation. The transparent negative terminal of the solar cell is made of glass on one surface of the PV cell. The positive terminal (cathode) on the other surface of the solar cell is made of silicon with a glass negative terminal (anode). The digital watches and cell phones, LEDs, micro-lens, optical components, and laser optics are other examples for the application of silicon and or glass. The Si and quartz are materials extensively used in CCD and LED for digital cameras and CD players respectively. Hence, three materials: (1) a semiconductor silicon and transparent dielectrics,- (2) glass, and (3) quartz are chosen for laser micromachining as they have wide spread applications in microelectronics industry. The Q-switched, nanosecond pulsed lasers are most extensively used for micro-machining. The nanosecond type of short pulsed laser is less expensive for the end users than the second type, pico or femto, ultra-short pulsed lasers. The majority of the research work done on these materials (Si, SiO 2, and glass) is based on the ultra-short pulsed lasers. This is because of the cut quality, pin point precision of the drilled holes, formation of the nanometer size microstructures and fine features, and minimally invasive heat affected zone. However, there are many applications such as large surface area dicing, cutting, surface cleaning of Si wafers by ablation, and drilling of relatively large-sized holes where some associated heat affected zone due to melting can be tolerated. In such applications the nanosecond pulsed laser ablation of materials is very

A miniaturized reconfigurable broadband attenuator based on RF MEMS switches

International Nuclear Information System (INIS)

Guo, Xin; Gong, Zhuhao; Zhong, Qi; Liang, Xiaotong; Liu, Zewen

2016-01-01

Reconfigurable attenuators are widely used in microwave measurement instruments. Development of miniaturized attenuation devices with high precision and broadband performance is required for state-of-the-art applications. In this paper, a compact 3-bit microwave attenuator based on radio frequency micro-electro-mechanical system (RF MEMS) switches and polysilicon attenuation modules is presented. The device comprises 12 ohmic contact MEMS switches, π -type polysilicon resistive attenuation modules and microwave compensate structures. Special attention was paid to the design of the resistive network, compensate structures and system simulation. The device was fabricated using micromachining processes compatible with traditional integrated circuit fabrication processes. The reconfigurable attenuator integrated with RF MEMS switches and resistive attenuation modules was successfully fabricated with dimensions of 2.45  ×  4.34  ×  0.5 mm 3 , which is 1/1000th of the size of a conventional step attenuator. The measured RF performance revealed that the attenuator provides 10–70 dB attenuation at 10 dB intervals from 0.1–20 GHz with an accuracy better than  ±1.88 dB at 60 dB and an error of less than 2.22 dB at 10 dB. The return loss of each state of the 3-bit attenuator was better than 11.95 dB (VSWR  <  1.71) over the entire operating band. (paper)

In-plane deeply-etched optical MEMS notch filter with high-speed tunability

International Nuclear Information System (INIS)

Sabry, Yasser M; Eltagoury, Yomna M; Shebl, Ahmed; Khalil, Diaa; Soliman, Mostafa; Sadek, Mohamed

2015-01-01

Notch filters are used in spectroscopy, multi-photon microscopy, fluorescence instrumentation, optical sensors and other life science applications. One type of notch filter is based on a fiber-coupled Fabry–Pérot cavity, which is formed by a reflector (external mirror) facing a dielectric-coated end of an optical fiber. Tailoring this kind of optical filter for different applications is possible because the external mirror has fewer mechanical and optical constraints. In this paper we present optical modeling and implementation of a fiber-coupled Fabry–Pérot filter based on dielectric-coated optical fiber inserted into a micromachined fiber groove facing a metallized micromirror, which is driven by a high-speed MEMS actuator. The optical MEMS chip is fabricated using deep reactive ion etching (DRIE) technology on a silicon on insulator wafer, where the optical axis is parallel to the substrate (in-plane) and the optical/mechanical components are self-aligned by the photolithographic process. The DRIE etching depth is 150 μm, chosen to increase the micromirror optical throughput and improving the out-of-plane stiffness of the MEMS actuator. The MEMS actuator type is closing-gap, while its quality factor is almost doubled by slotting the fixed plate. A low-finesse Fabry–Pérot interferometer is formed by the metallized surface of the micromirror and a cleaved end of a standard single-mode fiber, for characterization of the MEMS actuator stroke and resonance frequency. The actuator achieves a travel distance of 800 nm at a resonance frequency of 89.9 kHz. The notch filter characteristics were measured using an optical spectrum analyzer, and the filter exhibits a free spectral range up to 100 nm and a notch rejection ratio up to 20 dB around a wavelength of 1300 nm. The presented device provides batch processing and low-cost production of the filter. (paper)

Advanced technology trend survey of micromachines in Europe; Oshu ni okeru micromachine sentan gijutsu doko chosa

Energy Technology Data Exchange (ETDEWEB)

NONE

1996-02-01

In this research survey, the development trend of micromachine technology in Europe was surveyed, development level of micromachine technology of European companies was grasped, and practical application fields of their target were investigated. Technology development level of private companies in Japan`s national projects and practical application fields of Japan`s target were arranged. Trends of micromachine technology development are compared between Japanese companies and European companies. Among micromachine technology development projects in Europe, ``8520 MUST`` is a part of the ESPRIT Project. About 40,000 companies among about 170,000 companies in whole Europe are relating to the MUST Project. The main fields include the manufacturing technology, process control of machines, technology of safety, sensor technology in environmental fields, and automotive technology. The marketing fields of application include the automobile, military technology, home automation, industrial process, medical technology, environmental technology, and games. The results can be compared with the direction of research and development in Japan. 22 figs., 8 tabs.

Handbook of compliant mechanisms

CERN Document Server

Howell, Larry L; Olsen, Brian M

2013-01-01

A fully illustrated reference book giving an easy-to-understand introduction to compliant mechanisms A broad compilation of compliant mechanisms to give inspiration and guidance to those interested in using compliant mechanisms in their designs, the Handbook of Compliant Mechanisms includes graphics and descriptions of many compliant mechanisms. It comprises an extensive categorization of devices that can be used to help readers identify compliant mechanisms related to their application. It also provides chapters on the basic background in compliant mechanisms, the categories o

Tailoring design and fabrication of capacitive RF MEMS switches for K-band applications

Science.gov (United States)

Quaranta, Fabio; Persano, Anna; Capoccia, Giovanni; Taurino, Antonietta; Cola, Adriano; Siciliano, Pietro; Lucibello, Andrea; Marcelli, Romolo; Proietti, Emanuela; Bagolini, Alvise; Margesin, Benno; Bellutti, Pierluigi; Iannacci, Jacopo

2015-05-01

Shunt capacitive radio-frequency microelectromechanical (RF MEMS) switches were modelled, fabricated and characterized in the K-band domain. Design allowed to predict the RF behaviour of the switches as a function of the bridge geometric parameters. The modelled switches were fabricated on silicon substrate, using a surface micromachining approach. In addition to the geometric parameters, the material structure in the bridge-actuator area was modified for switches fabricated on the same wafer, thanks to the removal/addition of two technological steps of crucial importance for RF MEMS switches performance, which are the use of the sacrificial layer and the deposition of a floating metal layer on the actuator. Surface profilometry analysis was used to check the material layer structure in the different regions of the bridge area as well as to investigate the mechanical behaviour of the moveable bridge under the application of a loaded force. The RF behaviour of all the fabricated switches was measured, observing the impact on the isolation of the manipulation of the bridge size and of the variations in the fabrication process.

Mid infrared MEMS FTIR spectrometer

Science.gov (United States)

Erfan, Mazen; Sabry, Yasser M.; Mortada, Bassem; Sharaf, Khaled; Khalil, Diaa

2016-03-01

In this work we report, for the first time to the best of our knowledge, a bulk-micromachined wideband MEMS-based spectrometer covering both the NIR and the MIR ranges and working from 1200 nm to 4800 nm. The core engine of the spectrometer is a scanning Michelson interferometer micro-fabricated using deep reactive ion etching (DRIE) technology. The spectrum is obtained using the Fourier Transform techniques that allows covering a very wide spectral range limited by the detector responsivity. The moving mirror of the interferometer is driven by a relatively large stroke electrostatic comb-drive actuator. Zirconium fluoride (ZrF4) multimode optical fibers are used to connect light between the white light source and the interferometer input, as well as the interferometer output to a PbSe photoconductive detector. The recorded signal-to-noise ratio is 25 dB at the wavelength of 3350 nm. The spectrometer is successfully used in measuring the absorption spectra of methylene chloride, quartz glass and polystyrene film. The presented solution provides a low cost method for producing miniaturized spectrometers in the near-/mid-infrared.

GaAs micromachining in the 1 H2SO4:1 H2O2:8 H2O system. From anisotropy to simulation

Science.gov (United States)

Tellier, C. R.

2011-02-01

The bulk micromachining on (010), (110) and (111)A GaAs substrates in the 1 H2SO4:1 H2O2:8 H2O system is investigated. Focus is placed on anisotropy of 3D etching shapes with a special emphasis on convex and concave undercuts which are of prime importance in the wet micromachining of mechanical structures. Etched structures exhibit curved contours and more and less rounded sidewalls showing that the anisotropy is of type 2. This anisotropy can be conveniently described by a kinematic and tensorial model. Hence, a database composed of dissolution constants is further determined from experiments. A self-elaborated simulator which works with the proposed database is used to derive theoretical 3D shapes. Simulated shapes agree well with observed shapes of microstructures. The successful simulations open up two important applications for MEMS: CAD of mask patterns and meshing of simulated shapes for FEM simulation tools.

Micromachined tunable metamaterials: a review

International Nuclear Information System (INIS)

Liu, A Q; Zhu, W M; Tsai, D P; Zheludev, N I

2012-01-01

This paper reviews micromachined tunable metamaterials, whereby the tuning capabilities are based on the mechanical reconfiguration of the lattice and/or the metamaterial element geometry. The primary focus of this review is the feasibility of the realization of micromachined tunable metamaterials via structure reconfiguration and the current state of the art in the fabrication technologies of structurally reconfigurable metamaterial elements. The micromachined reconfigurable microstructures not only offer a new tuning method for metamaterials without being limited by the nonlinearity of constituent materials, but also enable a new paradigm of reconfigurable metamaterial-based devices with mechanical actuations. With recent development in nanomachining technology, it is possible to develop structurally reconfigurable metamaterials with faster tuning speed, higher density of integration and more flexible choice of the working frequencies. (review article)

Hybrid membrane-microfluidic components using a novel ceramic MEMS technology

Science.gov (United States)

Lutz, Brent J.; Polyakov, Oleg; Rinaldo, Chris

2012-03-01

A novel hybrid nano/microfabrication technology has been employed to produce unique MEMS and microfluidic components that integrate nanoporous membranes. The components are made by micromachining a self-organized nanostructured ceramic material that is biocompatible and amenable to surface chemistry modification. Microfluidic structures, such as channels and wells, can be made with a precision of membranes can be integrated into the bottom of these structures, featuring a wide range of possible thicknesses, from 100 micron to membranes may be non-porous or porous (with controllable pore sizes from 200 nm to technology is highly scaleable, and thus can yield low-cost, reliable, disposable microcomponents and devices. Specific applications that can benefit from this technology includes cell culturing and assays, imaging by cryo-electron tomography, environmental sample processing, as well as many others.

Piezoelectric Zinc Oxide Based MEMS Acoustic Sensor

Directory of Open Access Journals (Sweden)

Aarti Arora

2008-04-01

Full Text Available An acoustic sensors exhibiting good sensitivity was fabricated using MEMS technology having piezoelectric zinc oxide as a dielectric between two plates of capacitor. Thin film zinc oxide has structural, piezoelectric and optical properties for surface acoustic wave (SAW and bulk acoustic wave (BAW devices. Oxygen effficient films are transparent and insulating having wide applications for sensors and transducers. A rf sputtered piezoelectric ZnO layer transforms the mechanical deflection of a thin etched silicon diaphragm into a piezoelectric charge. For 25-micron thin diaphragm Si was etched in tetramethylammonium hydroxide solution using bulk micromachining. This was followed by deposition of sandwiched structure composed of bottom aluminum electrode, sputtered 3 micron ZnO film and top aluminum electrode. A glass having 1 mm diameter hole was bonded on backside of device to compensate sound pressure in side the cavity. The measured value of central capacitance and dissipation factor of the fabricated MEMS acoustic sensor was found to be 82.4pF and 0.115 respectively, where as the value of ~176 pF was obtained for the rim capacitance with a dissipation factor of 0.138. The response of the acoustic sensors was reproducible for the devices prepared under similar processing conditions under different batches. The acoustic sensor was found to be working from 30Hz to 8KHz with a sensitivity of 139µV/Pa under varying acoustic pressure.

Physics-based signal processing algorithms for micromachined cantilever arrays

Science.gov (United States)

Candy, James V; Clague, David S; Lee, Christopher L; Rudd, Robert E; Burnham, Alan K; Tringe, Joseph W

2013-11-19

A method of using physics-based signal processing algorithms for micromachined cantilever arrays. The methods utilize deflection of a micromachined cantilever that represents the chemical, biological, or physical element being detected. One embodiment of the method comprises the steps of modeling the deflection of the micromachined cantilever producing a deflection model, sensing the deflection of the micromachined cantilever and producing a signal representing the deflection, and comparing the signal representing the deflection with the deflection model.

Silicon micromachined vibrating gyroscopes

Science.gov (United States)

Voss, Ralf

1997-09-01

This work gives an overview of silicon micromachined vibrating gyroscopes. Market perspectives and fields of application are pointed out. The advantage of using silicon micromachining is discussed and estimations of the desired performance, especially for automobiles are given. The general principle of vibrating gyroscopes is explained. Vibrating silicon gyroscopes can be divided into seven classes. for each class the characteristic principle is presented and examples are given. Finally a specific sensor, based on a tuning fork for automotive applications with a sensitivity of 250(mu) V/degrees is described in detail.

Three dimensional MEMS supercapacitors

Energy Technology Data Exchange (ETDEWEB)

Sun, Wei

2011-10-15

and the specific power of 0.58 mWcm-2 at 20mVs-1 scan rate. The 3D MEMS supercapacitor fabricated in this project has the specific capacitance and the specific power of 0.029 F cm-2 and 2.2 mWcm-2 respectively at a relative large discharge rate of 5 m Acm-2. It is also found vi that the supercapacitors have the performance of broad frequency range up to 300Hz. For DRIE based 3D MEMS supercapacitor, the innovative designs were developed based on silicon micromachining process flow which includes the key processes such as thermal oxidation, RF sputtering, wet etching, DRIE, electroless plating and P Py polymerization. The optimized P Py electrode doping with Tos- performed ideal super capacitor properties in NaCl electrolyte. The single PPy electrode of the 3D MEMS supercapacitors can provide 0.128 F cm-2 specific capacitance and 1.28 mWcm-2 specific power at 20 mvs-1 scan rate. The specific capacitance of the 3D MEMS supercapacitors equals 0.056 F cm-2, and the specific power at 20 mvs-1 scan rate equals 0.56 mWcm-2. In addition, novel supercapacitors based on wafer level process are designed for flexible integration in applications such as high temperature electronics and hybrid power system for electric vehicles. Experimental work on TiO2 anodic oxidation, which enables the fabrication of the one of these designs, has been carried out. Dense TiO2 nano holes with diameters ranged from about 90 to 270 nm were obtained in 0.05 wt% HF aqueous solutions with two-step anodic oxidation method. Comparing to the published specific capacitance (about 2 mFcm-2) for microsupercapacitors [33], I have achieved much larger specific capacitance (typically 0.029 to 0.056 F cm-2) for 3D MEMS supercapacitors. The above results have been presented in 3 international conferences. Total 4 journal articles have been published, and one has been submitted. The article in the Journal of Power Source (appendix 3) has been cited 9 times after published in April 2009, and the article in

Optical wireless communications for micromachines

Science.gov (United States)

O'Brien, Dominic C.; Yuan, Wei Wen; Liu, Jing Jing; Faulkner, Grahame E.; Elston, Steve J.; Collins, Steve; Parry-Jones, Lesley A.

2006-08-01

A key challenge for wireless sensor networks is minimizing the energy required for network nodes to communicate with each other, and this becomes acute for self-powered devices such as 'smart dust'. Optical communications is a potentially attractive solution for such devices. The University of Oxford is currently involved in a project to build optical wireless links to smart dust. Retro-reflectors combined with liquid crystal modulators can be integrated with the micro-machine to create a low power transceiver. When illuminated from a base station a modulated beam is returned, transmitting data. Data from the base station can be transmitted using modulation of the illuminating beam and a receiver at the micro-machine. In this paper we outline the energy consumption and link budget considerations in the design of such micro-machines, and report preliminary experimental results.

Development of thin film encapsulation process for piezoresistive MEMS gyroscope with wide gaps

Science.gov (United States)

Ayanoor-Vitikkate, Vipin

The gyroscope is an inertial sensor used to measure the angular rate of a rotating object. This helps to determine the pitch and yaw rate of any moving body. A number of applications have been developed for consumer and automotive markets, for e.g. vehicle stability control, navigation assist, roll over detection. These are primarily used in high-end cars, where cost is not a major factor. Other areas where a MEMS Gyro can be used are robotics, camcorder stabilization, virtual reality, and more. Primarily due to cost and the size most of these applications have not reached any significant volume. One reason for this is the relatively high cost of MEMS gyros compared to other MEMS sensors like accelerometers or pressure sensors. Generally the cost of packaging a MEMS sensor is about 85-90% of the total cost. Currently most MEMS based gyroscopes are made using bulk or surface micromachining, after which they are packaged using wafer bonding. This unfortunately leads to wastage of silicon and increase in the package size, thus reducing the yield. One way to reduce the cost of packaging is by wafer scale thin film encapsulation of MEMS gyroscopes. The goal of the present work is to fabricate a rate grade MEMS gyroscope and encapsulate it by modifying an existing thin-film encapsulation technique. Packaging is an important step towards commercialization of the device and we plan to use thin wafer scale encapsulation technique developed previously in our group to package these devices. The silicon micro machined gyroscope will be fabricated on SOI (Silicon-on-Insulator) wafers using Bosch DRIE etching techniques. The encapsulation of the device is carried out using epitaxial polysilicon in order to provide a high vacuum inside the device chamber. The advantages offered by this technique are the reduction in area of the die and thus less silicon surface is wasted. In addition to this the encapsulation technique helps in creating a vacuum inside the micro device, which

Study of surfactant-added TMAH for applications in DRIE and wet etching-based micromachining

Science.gov (United States)

Tang, B.; Shikida, M.; Sato, K.; Pal, P.; Amakawa, H.; Hida, H.; Fukuzawa, K.

2010-06-01

In this paper, etching anisotropy is evaluated for a number of different crystallographic orientations of silicon in a 0.1 vol% Triton-X-100 added 25 wt% tetramethylammonium hydroxide (TMAH) solution using a silicon hemisphere. The research is primarily aimed at developing advanced applications of wet etching in microelectromechanical systems (MEMS). The etching process is carried out at different temperatures in the range of 61-81 °C. The etching results of silicon hemisphere and different shapes of three-dimensional structures in {1 0 0}- and {1 1 0}-Si surfaces are analyzed. Significantly important anisotropy, different from a traditional etchant (e.g. pure KOH and TMAH), is investigated to extend the applications of the wet etching process in silicon bulk micromachining. The similar etching behavior of exact and vicinal {1 1 0} and {1 1 1} planes in TMAH + Triton is utilized selectively to remove the scalloping from deep reactive-ion etching (DRIE) etched profiles. The direct application of the present research is demonstrated by fabricating a cylindrical lens with highly smooth etched surface finish. The smoothness of a micro-lens at different locations is measured qualitatively by a scanning electron microscope and quantitatively by an atomic force microscope. The present paper provides a simple and effective fabrication method of the silicon micro-lens for optical MEMS applications.

MEMS-based non-rotatory circumferential scanning optical probe for endoscopic optical coherence tomography

Science.gov (United States)

Xu, Yingshun; Singh, Janak; Siang, Teo Hui; Ramakrishna, Kotlanka; Premchandran, C. S.; Sheng, Chen Wei; Kuan, Chuah Tong; Chen, Nanguang; Olivo, Malini C.; Sheppard, Colin J. R.

2007-07-01

In this paper, we present a non-rotatory circumferential scanning optical probe integrated with a MEMS scanner for in vivo endoscopic optical coherence tomography (OCT). OCT is an emerging optical imaging technique that allows high resolution cross-sectional imaging of tissue microstructure. To extend its usage to endoscopic applications, a miniaturized optical probe based on Microelectromechanical Systems (MEMS) fabrication techniques is currently desired. A 3D electrothermally actuated micromirror realized using micromachining single crystal silicon (SCS) process highlights its very large angular deflection, about 45 degree, with low driving voltage for safety consideration. The micromirror is integrated with a GRIN lens into a waterproof package which is compatible with requirements for minimally invasive endoscopic procedures. To implement circumferential scanning substantially for diagnosis on certain pathological conditions, such as Barret's esophagus, the micromirror is mounted on 90 degree to optical axis of GRIN lens. 4 Bimorph actuators that are connected to the mirror on one end via supporting beams and springs are selected in this micromirror design. When actuators of the micromirror are driven by 4 channels of sinusoidal waveforms with 90 degree phase differences, beam focused by a GRIN is redirected out of the endoscope by 45 degree tilting mirror plate and achieve circumferential scanning pattern. This novel driving method making full use of very large angular deflection capability of our micromirror is totally different from previously developed or developing micromotor-like rotatory MEMS device for circumferential scanning.

Method of drying passivated micromachines by dewetting from a liquid-based process

Science.gov (United States)

Houston, Michael R.; Howe, Roger T.; Maboudian, Roya; Srinivasan, Uthara

2000-01-01

A method of fabricating a micromachine includes the step of constructing a low surface energy film on the micromachine. The micromachine is then rinsed with a rinse liquid that has a high surface energy, relative to the low surface energy film, to produce a contact angle of greater than 90.degree. between the low surface energy film and the rinse liquid. This relatively large contact angle causes any rinse liquid on the micromachine to be displaced from the micromachine when the micromachine is removed from the rinse liquid. In other words, the micromachine is dried by dewetting from a liquid-based process. Thus, a separate evaporative drying step is not required, as the micromachine is removed from the liquid-based process in a dry state. The relatively large contact angle also operates to prevent attractive capillary forces between micromachine components, thereby preventing contact and adhesion between adjacent microstructure surfaces. The low surface energy film may be constructed with a fluorinated self-assembled monolayer film. The processing of the invention avoids the use of environmentally harmful, health-hazardous chemicals.

Excimer laser micromachining for 3D microstructure

NARCIS (Netherlands)

Choi, Kyung Hyun; Meijer, J.; Masuzawa, Takahisa; Kim, Dae-Hyun

2004-01-01

A new 3D micromachining method, called Hole Area Modulation (HAM), has been introduced to enhance the current micromachining technology. In this method, information on the machining depth is converted to the sizes of holes on the mask. The machining is carried out with a simple 2D movement of the

A MEMS torsion magnetic sensor with reflective blazed grating integration

International Nuclear Information System (INIS)

Long, Liang; Zhong, Shaolong

2016-01-01

A novel magnetic sensor based on a permanent magnet and blazed grating is presented in this paper. The magnetic field is detected by measuring the diffracted wavelength of the blazed grating which is changed by the torsion motion of a torsion sensitive micro-electromechanical system (MEMS) structure with a permanent magnet attached. A V-shape grating structure is obtained by wet etching on a (1 0 0) SOI substrate. When the magnet is magnetized in different directions, the in-plane or out-of-plane magnetic field is detected by a sensor. The MEMS magnetic sensor with a permanent magnet is fabricated after analytical design and bulk micromachining processes. The magnetic-sensing capability of the sensor is tested by fiber-optic detection system. The result shows the sensitivities of the in-plane and out-of-plane magnetic fields are 3.6 pm μ T −1 and 5.7 pm μ T −1 , respectively. Due to utilization of the permanent magnet and fiber-optic detection, the sensor shows excellent capability of covering the high-resolution detection of low-frequency signals. In addition, the sensitive direction of the magnetic sensor can be easily switched by varying the magnetized direction of the permanent magnet, which offers a simple way to achieve tri-axis magnetic sensor application. (paper)

Experimental investigations of the large deflection capabilities of a compliant parallel mechanism actuated by shape memory alloy wires

International Nuclear Information System (INIS)

Sreekumar, M; Nagarajan, T; Singaperumal, M

2008-01-01

This experimental study investigates the coupled effect of the force developed by the shape memory alloy (SMA) actuators and the force required for the large deflection of an elastica member in a compliant parallel mechanism. The compliant mechanism developed in house consists of a moving platform mounted on a superelastic pillar and three SMA wire actuators to manipulate the platform. A three-axis MEMS accelerometer has been mounted on the moving platform to measure its tilt angle. Three miniature force sensors have been designed and fabricated out of cantilever beams, each mounted with a pair of strain gauges, to measure the force developed by the respective actuators. The force sensors are highly sensitive and cost effective compared to commercially available miniature force sensors. Calibration of the force sensors has been accomplished with known weights, and for the three-axis MEMS accelerometer a rotary base has been considered which is usually used in optical applications. The calibration curves obtained, with R-squared values between 0.9997 and 1.0, show that both the tilt and force sensors considered are most appropriate for the respective applications. The mechanism fixed with the sensors and the drivers for the SMA actuators is integrated with a National Instrument's data acquisition system. The experimental results have been compared with the analytical results and it was found that the relative error is less than 2%. This is a preliminary study in the development of a mechanism for eye prosthesis and similar applications

X-ray microcalorimeter arrays fabricated by surface micromachining

International Nuclear Information System (INIS)

Hilton, G.C.; Beall, J.A.; Deiker, S.; Vale, L.R.; Doriese, W.B.; Beyer, Joern; Ullom, J.N.; Reintsema, C.D.; Xu, Y.; Irwin, K.D.

2004-01-01

We are developing arrays of Mo/Cu transition edge sensor-based detectors for use as X-ray microcalorimeters and sub-millimeter bolometers. We have fabricated 8x8 pixel X-ray microcalorimeter arrays using surface micromachining. Surface-micromachining techniques hold the promise of scalability to much larger arrays and may allow for the integration of in-plane multiplexer elements. In this paper we describe the surface micromachining process and recent improvements in the device geometry that provide for increased mechanical strength. We also present X-ray and heat pulse spectra collected using these detectors

MEMS based monolithic Phased array using 3-bit Switched-line Phase Shifter

Directory of Open Access Journals (Sweden)

A. Karmakr

2017-10-01

Full Text Available This article details the design of an electronically scanning phased array antenna with proposed fabrication process steps. Structure is based upon RF micro-electromechanical system (MEMS technology. Capacitive type shunt switches have been implemented here to cater high frequency operation. The architecture, which is deigned at 30 GHz, consists of 3-bit (11.25º, 22.5º and 45º integrated Switched-line phase shifter and a linearly polarized microstrip patch antenna. Detailed design tricks of the Ka-band phase shifter is outlined here. The whole design is targeted for future monolithic integration. So, the substrate of choice is High Resistive Silicon (ρ > 8kΩ-cm, tan δ =0.01 and ϵr =11.8. The overall circuit occupies an cross-sectional area of 20 × 5 mm2. The simulated results show that the phase shifter can provide nearly 11.25º/22.5º/45º phase shifts and their combinations at the expense of 1dB average insertion loss at 30 GHz for eight combinations. Practical fabrication process flow using surface micromachining is proposed here. Critical dimensions of the phased array structure is governed by the deign rules of the standard CMOS/MEMS foundry.

Novel in situ mechanical testers to enable integrated metal surface micro-machines.

Energy Technology Data Exchange (ETDEWEB)

Follstaedt, David Martin; de Boer, Maarten Pieter; Kotula, Paul Gabriel; Hearne, Sean Joseph; Foiles, Stephen Martin; Buchheit, Thomas Edward; Dyck, Christopher William

2005-10-01

The ability to integrate metal and semiconductor micro-systems to perform highly complex functions, such as RF-MEMS, will depend on developing freestanding metal structures that offer improved conductivity, reflectivity, and mechanical properties. Three issues have prevented the proliferation of these systems: (1) warpage of active components due to through-thickness stress gradients, (2) limited component lifetimes due to fatigue, and (3) low yield strength. To address these issues, we focus on developing and implementing techniques to enable the direct study of the stress and microstructural evolution during electrodeposition and mechanical loading. The study of stress during electrodeposition of metal thin films is being accomplished by integrating a multi-beam optical stress sensor into an electrodeposition chamber. By coupling the in-situ stress information with ex-situ microstructural analysis, a scientific understanding of the sources of stress during electrodeposition will be obtained. These results are providing a foundation upon which to develop a stress-gradient-free thin film directly applicable to the production of freestanding metal structures. The issues of fatigue and yield strength are being addressed by developing novel surface micromachined tensile and bend testers, by interferometry, and by TEM analysis. The MEMS tensile tester has a ''Bosch'' etched hole to allow for direct viewing of the microstructure in a TEM before, during, and after loading. This approach allows for the quantitative measurements of stress-strain relations while imaging dislocation motion, and determination of fracture nucleation in samples with well-known fatigue/strain histories. This technique facilitates the determination of the limits for classical deformation mechanisms and helps to formulate a new understanding of the mechanical response as the grain sizes are refined to a nanometer scale. Together, these studies will result in a science

Compliant Space Mechanisms

Data.gov (United States)

National Aeronautics and Space Administration — OBJECTIVES The proposed research will combine the areas of compliant mechanisms and space technology. Compliant mechanisms perform their function through the elastic...

Micromachined Precision Inertial Instruments

National Research Council Canada - National Science Library

Najafi, Khalil

2003-01-01

This program focuses on developing inertial-grade micromachined accelerometers and gyroscopes and their associated electronics and packaging for use in a variety of military and commercial applications...

Micromachined silicon seismic accelerometer development

Energy Technology Data Exchange (ETDEWEB)

Barron, C.C.; Fleming, J.G.; Montague, S. [and others

1996-08-01

Batch-fabricated silicon seismic transducers could revolutionize the discipline of seismic monitoring by providing inexpensive, easily deployable sensor arrays. Our ultimate goal is to fabricate seismic sensors with sensitivity and noise performance comparable to short-period seismometers in common use. We expect several phases of development will be required to accomplish that level of performance. Traditional silicon micromachining techniques are not ideally suited to the simultaneous fabrication of a large proof mass and soft suspension, such as one needs to achieve the extreme sensitivities required for seismic measurements. We have therefore developed a novel {open_quotes}mold{close_quotes} micromachining technology that promises to make larger proof masses (in the 1-10 mg range) possible. We have successfully integrated this micromolding capability with our surface-micromachining process, which enables the formation of soft suspension springs. Our calculations indicate that devices made in this new integrated technology will resolve down to at least sub-{mu}G signals, and may even approach the 10{sup -10} G/{radical}Hz acceleration levels found in the low-earth-noise model.

Nonlinear-Based MEMS Sensors and Active Switches for Gas Detection

KAUST Repository

Bouchaala, Adam M.; Jaber, Nizar; Yassine, Omar; Shekhah, Osama; Chernikova, Valeriya; Eddaoudi, Mohamed; Younis, Mohammad I.

2016-01-01

The objective of this paper is to demonstrate the integration of a MOF thin film on electrostatically actuated microstructures to realize a switch triggered by gas and a sensing algorithm based on amplitude tracking. The devices are based on the nonlinear response of micromachined clamped-clamped beams. The microbeams are coated with a metal-organic framework (MOF), namely HKUST-1, to achieve high sensitivity. The softening and hardening nonlinear behaviors of the microbeams are exploited to demonstrate the ideas. For gas sensing, an amplitude-based tracking algorithm is developed to quantify the captured quantity of gas. Then, a MEMS switch triggered by gas using the nonlinear response of the microbeam is demonstrated. Noise analysis is conducted, which shows that the switch has high stability against thermal noise. The proposed switch is promising for delivering binary sensing information, and also can be used directly to activate useful functionalities, such as alarming.

Nonlinear-Based MEMS Sensors and Active Switches for Gas Detection

KAUST Repository

Bouchaala, Adam M.

2016-05-25

The objective of this paper is to demonstrate the integration of a MOF thin film on electrostatically actuated microstructures to realize a switch triggered by gas and a sensing algorithm based on amplitude tracking. The devices are based on the nonlinear response of micromachined clamped-clamped beams. The microbeams are coated with a metal-organic framework (MOF), namely HKUST-1, to achieve high sensitivity. The softening and hardening nonlinear behaviors of the microbeams are exploited to demonstrate the ideas. For gas sensing, an amplitude-based tracking algorithm is developed to quantify the captured quantity of gas. Then, a MEMS switch triggered by gas using the nonlinear response of the microbeam is demonstrated. Noise analysis is conducted, which shows that the switch has high stability against thermal noise. The proposed switch is promising for delivering binary sensing information, and also can be used directly to activate useful functionalities, such as alarming.

Nonlinear-Based MEMS Sensors and Active Switches for Gas Detection.

Science.gov (United States)

Bouchaala, Adam; Jaber, Nizar; Yassine, Omar; Shekhah, Osama; Chernikova, Valeriya; Eddaoudi, Mohamed; Younis, Mohammad I

2016-05-25

The objective of this paper is to demonstrate the integration of a MOF thin film on electrostatically actuated microstructures to realize a switch triggered by gas and a sensing algorithm based on amplitude tracking. The devices are based on the nonlinear response of micromachined clamped-clamped beams. The microbeams are coated with a metal-organic framework (MOF), namely HKUST-1, to achieve high sensitivity. The softening and hardening nonlinear behaviors of the microbeams are exploited to demonstrate the ideas. For gas sensing, an amplitude-based tracking algorithm is developed to quantify the captured quantity of gas. Then, a MEMS switch triggered by gas using the nonlinear response of the microbeam is demonstrated. Noise analysis is conducted, which shows that the switch has high stability against thermal noise. The proposed switch is promising for delivering binary sensing information, and also can be used directly to activate useful functionalities, such as alarming.

MEMS packaging

CERN Document Server

Hsu , Tai-Ran

2004-01-01

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

Dividend policies of shariah-compliant and non-shariah-compliant firms

DEFF Research Database (Denmark)

Farooq, Omar; Tbeur, Oumkeltoum

2013-01-01

Do shariah-compliant firms pay higher dividends than other firms? Using data from the MENA (Morocco, Egypt, Saudi Arabia, United Arab Emirates, Jordan, Kuwait, and Bahrain) region, this paper shows that shariah-compliant firms not only have higher payout ratios but also have higher likelihood...

Modeling the Microstructure Curvature of Boron-Doped Silicon in Bulk Micromachined Accelerometer

Directory of Open Access Journals (Sweden)

Xiaoping He

2013-01-01

Full Text Available Microstructure curvature, or buckling, is observed in the micromachining of silicon sensors because of the doping of impurities for realizing certain electrical and mechanical processes. This behavior can be a key source of error in inertial sensors. Therefore, identifying the factors that influence the buckling value is important in designing MEMS devices. In this study, the curvature in the proof mass of an accelerometer is modeled as a multilayered solid model. Modeling is performed according to the characteristics of the solid diffusion mechanism in the bulk-dissolved wafer process (BDWP based on the self-stopped etch technique. Moreover, the proposed multilayered solid model is established as an equivalent composite structure formed by a group of thin layers that are glued together. Each layer has a different Young’s modulus value and each undergoes different volume shrinkage strain owing to boron doping in silicon. Observations of five groups of proof mass blocks of accelerometers suggest that the theoretical model is effective in determining the buckling value of a fabricated structure.

Non-traditional micromachining processes fundamentals and applications

CERN Document Server

Bhattacharyya, B; Davim, J

2017-01-01

This book presents a complete coverage of micromachining processes from their basic material removal phenomena to past and recent research carried by a number of researchers worldwide. Chapters on effective utilization of material resources, improved efficiency, reliability, durability, and cost effectiveness of the products are presented. This book provides the reader with new and recent developments in the field of micromachining and microfabrication of engineering materials.

Resist materials for proton micromachining

International Nuclear Information System (INIS)

Kan, J.A. van; Sanchez, J.L.; Xu, B.; Osipowicz, T.; Watt, F.

1999-01-01

The production of high aspect ratio microstructures is a potential growth area. The combination of deep X-ray lithography with electroforming and micromolding (i.e. LIGA) is one of the main techniques used to produce 3D microstructures. The new technique of proton micromachining employs focused MeV protons in a direct write process which is complementary to LIGA, e.g. micromachining with 2 MeV protons results in microstructures with a height of 63 μm and lateral sub-micrometer resolution in PMMA resist. The aim of this paper is to investigate the capabilities of proton micromachining as a lithographic technique. This involves the study of different types of resists. The dose distribution of high molecular weight PMMA is compared with three other types of resist: First the positive photo resist AZ P4620 will be discussed and then PMGI SF 23, which can be used as a deep UV, e-beam or X-ray resist. Finally SU-8, a new deep UV negative type of chemically amplified resist will be discussed. All these polymers are applied using the spin coating technique at thicknesses of between 1 and 36 μm

Biomaterials for MEMS

CERN Document Server

Chiao, Mu

2011-01-01

This book serves as a guide for practicing engineers, researchers, and students interested in MEMS devices that use biomaterials and biomedical applications. It is also suitable for engineers and researchers interested in MEMS and its applications but who do not have the necessary background in biomaterials.Biomaterials for MEMS highlights important features and issues of biomaterials that have been used in MEMS and biomedical areas. Hence this book is an essential guide for MEMS engineers or researchers who are trained in engineering institutes that do not provide the background or knowledge

Nonlinear-Based MEMS Sensors and Active Switches for Gas Detection

Directory of Open Access Journals (Sweden)

Adam Bouchaala

2016-05-01

Full Text Available The objective of this paper is to demonstrate the integration of a MOF thin film on electrostatically actuated microstructures to realize a switch triggered by gas and a sensing algorithm based on amplitude tracking. The devices are based on the nonlinear response of micromachined clamped-clamped beams. The microbeams are coated with a metal-organic framework (MOF, namely HKUST-1, to achieve high sensitivity. The softening and hardening nonlinear behaviors of the microbeams are exploited to demonstrate the ideas. For gas sensing, an amplitude-based tracking algorithm is developed to quantify the captured quantity of gas. Then, a MEMS switch triggered by gas using the nonlinear response of the microbeam is demonstrated. Noise analysis is conducted, which shows that the switch has high stability against thermal noise. The proposed switch is promising for delivering binary sensing information, and also can be used directly to activate useful functionalities, such as alarming.

Nonlinear-Based MEMS Sensors and Active Switches for Gas Detection

Science.gov (United States)

Bouchaala, Adam; Jaber, Nizar; Yassine, Omar; Shekhah, Osama; Chernikova, Valeriya; Eddaoudi, Mohamed; Younis, Mohammad I.

2016-01-01

The objective of this paper is to demonstrate the integration of a MOF thin film on electrostatically actuated microstructures to realize a switch triggered by gas and a sensing algorithm based on amplitude tracking. The devices are based on the nonlinear response of micromachined clamped-clamped beams. The microbeams are coated with a metal-organic framework (MOF), namely HKUST-1, to achieve high sensitivity. The softening and hardening nonlinear behaviors of the microbeams are exploited to demonstrate the ideas. For gas sensing, an amplitude-based tracking algorithm is developed to quantify the captured quantity of gas. Then, a MEMS switch triggered by gas using the nonlinear response of the microbeam is demonstrated. Noise analysis is conducted, which shows that the switch has high stability against thermal noise. The proposed switch is promising for delivering binary sensing information, and also can be used directly to activate useful functionalities, such as alarming. PMID:27231914

Superhydrophobic Surface Coatings for Microfluidics and MEMs.

Energy Technology Data Exchange (ETDEWEB)

Branson, Eric D.; Singh, Seema [Sandia National Laboratories, Livermore, CA; Houston, Jack E.; van Swol, Frank B.; Brinker, C. Jeffrey

2006-11-01

Low solid interfacial energy and fractally rough surface topography confer to Lotus plants superhydrophobic (SH) properties like high contact angles, rolling and bouncing of liquid droplets, and self-cleaning of particle contaminants. This project exploits the porous fractal structure of a novel, synthetic SH surface for aerosol collection, its self-cleaning properties for particle concentration, and its slippery nature 3 to enhance the performance of fluidic and MEMS devices. We propose to understand fundamentally the conditions needed to cause liquid droplets to roll rather than flow/slide on a surface and how this %22rolling transition%22 influences the boundary condition describing fluid flow in a pipe or micro-channel. Rolling of droplets is important for aerosol collection strategies because it allows trapped particles to be concentrated and transported in liquid droplets with no need for a pre-defined/micromachined fluidic architecture. The fluid/solid boundary condition is important because it governs flow resistance and rheology and establishes the fluid velocity profile. Although many research groups are exploring SH surfaces, our team is the first to unambiguously determine their effects on fluid flow and rheology. SH surfaces could impact all future SNL designs of collectors, fluidic devices, MEMS, and NEMS. Interfaced with inertial focusing aerosol collectors, SH surfaces would allow size-specific particle populations to be collected, concentrated, and transported to a fluidic interface without loss. In microfluidic systems, we expect to reduce the energy/power required to pump fluids and actuate MEMS. Plug-like (rather than parabolic) velocity profiles can greatly improve resolution of chip-based separations and enable unprecedented control of concentration profiles and residence times in fluidic-based micro-reactors. Patterned SH/hydrophilic channels could induce mixing in microchannels and enable development of microflow control elements

Omega-X micromachining system

International Nuclear Information System (INIS)

Miller, D.M.

1978-01-01

A micromachining tool system with X- and omega-axes is used to machine spherical, aspherical, and irregular surfaces with a maximum contour error of 100 nonometers (nm) and surface waviness of no more than 0.8 nm RMS. The omega axis, named for the angular measurement of the rotation of an eccentric mechanism supporting one end of a tool bar, enables the pulse increments of the tool toward the workpiece to be as little as 0 to 4.4 nm. A dedicated computer coordinates motion in the two axes to produce the workpiece contour. Inertia is reduced by reducing the mass pulsed toward the workpiece to about one-fifth of its former value. The tool system includes calibration instruments to calibrate the micromachining tool system. Backlash is reduced and flexing decreased by using a rotary table and servomotor to pulse the tool in the omega-axis instead of a ball screw mechanism. A thermally-stabilized spindle roates the workpiece and is driven by a motor not mounted on the micromachining tool base through a torque-smoothing pulley and vibrationless rotary coupling. Abbe offset errors are almost eliminated by tool setting and calibration at spindle center height. Tool contour and workpiece contour are gaged on the machine; this enables the source of machining errors to be determined more readily, because the workpiece is gaged before its shape can be changed by removal from the machine

Potential of Sharia-compliant investments

OpenAIRE

Ishuayed, Mohamed; Ruiz, Frédéric

2016-01-01

Islamic finance and Sharia-compliant investing has seen substantial growth over the years. As more investors are interested in becoming fully Sharia-compliant, the question of what may they be giving up in exchange arises. This has led us to analyze the potential of Sharia-compliant investments. It is well known that having a Sharia-compliant investment portfolio could be rather restrictive as some sectors and investment instruments are forbidden such as tobacco, alcohol, gambling, pork produ...

Stiction in surface micromachining

NARCIS (Netherlands)

Tas, Niels Roelof; Sonnenberg, A.H.; Jansen, Henricus V.; Legtenberg, R.; Legtenberg, Rob; Elwenspoek, Michael Curt

1996-01-01

Due to the smoothness of the surfaces in surface micromachining, large adhesion forces between fabricated structures and the substrate are encountered. Four major adhesion mechanisms have been analysed: capillary forces, hydrogen bridging, electrostatic forces and van der Waals forces. Once contact

Cryogenically assisted abrasive jet micromachining of polymers

International Nuclear Information System (INIS)

Getu, H; Papini, M; Spelt, J K

2008-01-01

The abrasive jet micromachining (AJM) of elastomers and polymers such as polydimethylsiloxane (PDMS), acrylonitrile butadiene styrene (ABS) and polytetrafluoroethylene (PTFE) for use in micro-fluidic devices was found to be very slow or impossible at room temperature. To enhance the material removal rate in such materials, a stream of liquid nitrogen (LN 2 ) was injected into the abrasive jet, cooling the target to cryogenic temperatures. Erosion rate measurements on the three polymeric materials (PDMS, ABS and PTFE) with and without the use of LN 2 were compared along with the profiles of micromachined channels and holes. It was found that the use of LN 2 cooling caused brittle erosion in PDMS, allowing it to be micromachined successfully. An erosion rate increase was also observed in PTFE and ABS at high and intermediate impact angles. The use of LN 2 also was found to reduce particle embedding

A Widely-Accessible Distributed MEMS Processing Environment. The MEMS Exchange Program

Science.gov (United States)

2012-10-29

all of these patterns in advance, we made a new cost model, called the Python Code cost model, which utilizes the power of a high level programming ...document entitled “The Beginners Guide to MEMS Processing” on the MEMSNet and MEMS Exchange The MEMS Exchange Program Final Technical Report October 29...from the Government is absolutely necessary. As said The MEMS Exchange Program Final Technical Report October 29, 2012 Page 57 of 58 before

Micromachining with copper lasers

Science.gov (United States)

Knowles, Martyn R. H.; Bell, Andy; Foster-Turner, Gideon; Rutterford, Graham; Chudzicki, J.; Kearsley, Andrew J.

1997-04-01

In recent years the copper laser has undergone extensive development and has emerged as a leading and unique laser for micromachining. The copper laser is a high average power (10 - 250 W), high pulse repetition rate (2 - 32 kHz), visible laser (511 nm and 578 nm) that produces high peak power (typically 200 kW), short pulses (30 ns) and very good beam quality (diffraction limited). This unique set of laser parameters results in exceptional micro-machining in a wide variety of materials. Typical examples of the capabilities of the copper laser include the drilling of small holes (10 - 200 micrometer diameter) in materials as diverse as steel, ceramic, diamond and polyimide with micron precision and low taper (less than 1 degree) cutting and profiling of diamond. Application of the copper laser covers the electronic, aerospace, automotive, nuclear, medical and precision engineering industries.

Micromachined microphone array on a chip for turbulent boundary layer measurements

Science.gov (United States)

Krause, Joshua Steven

A surface micromachined microphone array on a single chip has been successfully designed, fabricated, characterized, and tested for aeroacoustic purposes. The microphone was designed to have venting through the diaphragm, 64 elements (8x8) on the chip, and used a capacitive transduction scheme. The microphone was fabricated using the MEMSCAP PolyMUMPs process (a foundry polysilicon surface micromachining process) along with facilities at Tufts Micro and Nano Fabrication Facility (TMNF) where a Parylene-C passivation layer deposition and release of the microstructures were performed. The devices are packaged with low profile interconnects, presenting a maximum of 100 mum of surface topology. The design of an individual microphone was completed through the use of a lumped element model (LEM) to determine the theoretical performance of the microphone. Off-chip electronics were created to allow the microphone array outputs to be redirected to one of two channels, allowing dynamic reconfiguration of the effective transducer shape in software and provide 80 dB off isolation. The characterization was completed through the use of laser Doppler vibrometry (LDV), acoustic plane wave tube and free-field calibration, and electrical noise floor testing in a Faraday cage. Measured microphone sensitivity is 0.15 mV/Pa for an individual microphone and 8.7 mV/Pa for the entire array, in close agreement with model predictions. The microphones and electronics operate over the 200--40 000 Hz band. The dynamic range extends from 60 dB SPL in a 1 Hz band to greater than 150 dB SPL. Element variability was +/-0.05 mV/Pa in sensitivity with an array yield of 95%. Wind tunnel testing at flow rates of up to 205.8 m/s indicates that the devices continue to operate in flow without damage, and can be successfully reconfigured on the fly. Care has been taken to systematically remove contaminating signals (acoustic, vibration, and noise floor) from the wind tunnel data to determine actual

Fiscal 1996 report on technological results. R and D on micromachine technology; 1996 nendo micromachine gijutsu no kenkyu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

1998-03-01

Researches on basic element technology of micromachines are conducted that operate autonomously in a narrow small part in a complicated apparatus or in vivo. The areas of activity are (1) research on micromachine systems, (2) a subminiature liquid synthesizing system, and (3) comprehensive investigation and research. In (1), the researches were carried out on the miniaturization and functional combination of a micro laser catheter and a micro tactile sensor catheter, which are the primary components of a coeliac diagnostic and therapeutic system, a 'micro catheter for cerebral blood vessel/treatment', as a micromachine system in the medical field. In (2), R and D was conducted on a system element technology assuming it contributed to a subminiature liquid synthesizing system capable of preparing various liquids including pharmaceuticals accurately with a trace amount. In (3), examination was made on the application area of a micromachine system with priority given to a medical field and also on technological subjects to be tapped, as well as on the contents of (2), with a device installed for evaluating the operating characteristic of a distribution type fluid actuator as needed for the development. (NEDO)

Manufacturing tolerant topology optimization

DEFF Research Database (Denmark)

Sigmund, Ole

2009-01-01

In this paper we present an extension of the topology optimization method to include uncertainties during the fabrication of macro, micro and nano structures. More specifically, we consider devices that are manufactured using processes which may result in (uniformly) too thin (eroded) or too thick...... (dilated) structures compared to the intended topology. Examples are MEMS devices manufactured using etching processes, nano-devices manufactured using e-beam lithography or laser micro-machining and macro structures manufactured using milling processes. In the suggested robust topology optimization...... approach, under- and over-etching is modelled by image processing-based "erode" and "dilate" operators and the optimization problem is formulated as a worst case design problem. Applications of the method to the design of macro structures for minimum compliance and micro compliant mechanisms show...

Real-time control of ultrafast laser micromachining by laser-induced breakdown spectroscopy

International Nuclear Information System (INIS)

Tong Tao; Li Jinggao; Longtin, Jon P.

2004-01-01

Ultrafast laser micromachining provides many advantages for precision micromachining. One challenging problem, however, particularly for multilayer and heterogeneous materials, is how to prevent a given material from being ablated, as ultrafast laser micromachining is generally material insensitive. We present a real-time feedback control system for an ultrafast laser micromachining system based on laser-induced breakdown spectroscopy (LIBS). The characteristics of ultrafast LIBS are reviewed and discussed so as to demonstrate the feasibility of the technique. Comparison methods to identify the material emission patterns are developed, and several of the resulting algorithms were implemented into a real-time computer control system. LIBS-controlled micromachining is demonstrated for the fabrication of microheater structures on thermal sprayed materials. Compared with a strictly passive machining process without any such feedback control, the LIBS-based system provides several advantages including less damage to the substrate layer, reduced machining time, and more-uniform machining features

Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

Energy Technology Data Exchange (ETDEWEB)

Smith, J.H.

1996-11-01

An overview of the surface micromachining program at the Microelectronics Development Laboratory of Sandia National Laboratories is presented. Development efforts are underway for a variety of surface micromachined sensors and actuators for both defense and commercial applications. A technology that embeds micromechanical devices below the surface of the wafer prior to microelectronics fabrication has been developed for integrating microelectronics with surface-micromachined micromechanical devices. The application of chemical-mechanical polishing to increase the manufacturability of micromechanical devices is also presented.

Epitaxial growth of metallic buffer layer structure and c-axis oriented Pb(Mn1/3,Nb2/3)O3-Pb(Zr,Ti)O3 thin film on Si for high performance piezoelectric micromachined ultrasonic transducer

Science.gov (United States)

Thao, Pham Ngoc; Yoshida, Shinya; Tanaka, Shuji

2017-12-01

This paper reports on the development of a metallic buffer layer structure, (100) SrRuO3 (SRO)/(100) Pt/(100) Ir/(100) yttria-stabilized zirconia (YSZ) layers for the epitaxial growth of a c-axis oriented Pb(Mn1/3,Nb2/3)O3-Pb(Zr,Ti)O3 (PMnN-PZT) thin film on a (100) Si wafer for piezoelectric micro-electro mechanical systems (MEMS) application. The stacking layers were epitaxially grown on a Si substrate under the optimal deposition condition. A crack-free PMnN-PZT epitaxial thin films was obtained at a thickness up to at least 1.7 µm, which is enough for MEMS applications. The unimorph MEMS cantilevers based on the PMnN-PZT thin film were fabricated and characterized. As a result, the PMnN-PZT thin film exhibited -10 to -12 C/m2 as a piezoelectric coefficient e 31,f and ˜250 as a dielectric constants ɛr. The resultant FOM for piezoelectric micromachined ultrasonic transducer (pMUT) is higher than those of general PZT and AlN thin films. This structure has a potential to provide high-performance pMUTs.

A silicon micromachined resonant pressure sensor

International Nuclear Information System (INIS)

Tang Zhangyang; Fan Shangchun; Cai Chenguang

2009-01-01

This paper describes the design, fabrication and test of a silicon micromachined resonant pressure sensor. A square membrane and a doubly clamped resonant beam constitute a compound structure. The former senses the pressure directly, while the latter changes its resonant frequency according to deformation of the membrane. The final output relation between the resonant frequency and the applied pressure is deducted according to the structure mechanical properties. Sensors are fabricated by micromachining technology, and then sealed in vaccum. These sensors are tested by open-loop and close-loop system designed on purpose. The experiment results demonstrate that the sensor has a sensitivity of 49.8Hz/kPa and repeatability of 0.08%.

A capacitive CMOS-MEMS sensor designed by multi-physics simulation for integrated CMOS-MEMS technology

Science.gov (United States)

Konishi, Toshifumi; Yamane, Daisuke; Matsushima, Takaaki; Masu, Kazuya; Machida, Katsuyuki; Toshiyoshi, Hiroshi

2014-01-01

This paper reports the design and evaluation results of a capacitive CMOS-MEMS sensor that consists of the proposed sensor circuit and a capacitive MEMS device implemented on the circuit. To design a capacitive CMOS-MEMS sensor, a multi-physics simulation of the electromechanical behavior of both the MEMS structure and the sensing LSI was carried out simultaneously. In order to verify the validity of the design, we applied the capacitive CMOS-MEMS sensor to a MEMS accelerometer implemented by the post-CMOS process onto a 0.35-µm CMOS circuit. The experimental results of the CMOS-MEMS accelerometer exhibited good agreement with the simulation results within the input acceleration range between 0.5 and 6 G (1 G = 9.8 m/s2), corresponding to the output voltages between 908.6 and 915.4 mV, respectively. Therefore, we have confirmed that our capacitive CMOS-MEMS sensor and the multi-physics simulation will be beneficial method to realize integrated CMOS-MEMS technology.

EDITORIAL: International MEMS Conference 2006

Science.gov (United States)

Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian

2006-04-01

The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can

Macrodesign for microdevices: Polysilicon surface-micromachining technology, applications and issues

Energy Technology Data Exchange (ETDEWEB)

Sniegowski, J.J. [Sandia National Labs., Albuquerque, NM (United States). Intelligent Micromachine Dept.

1997-05-01

The intent of this tutorial is to overview the technology of multi-level polysilicon surface micromachining, to present examples of devices which fully utilize this level of complexity, and to discuss what they believe to be significant issues which are not fully resolved. Following this intent, the tutorial consists of four sections. The first is an introduction and description of multi-level polysilicon surface micromachining and its potential benefits. Specifically, the inclusion of a third deposited layer of mechanical polysilicon greatly extends the degree of complexity available for micromechanism design. The second section introduces wafer planarization by CMP as a process tool for surface micromachining. The third section presents examples of actuated geared micromechanisms which require the multi-level fabrication process. Demonstration of actuation mechanisms coupled to external devices are illustrated. Finally, polysilicon surface micromachining fabrication technology has reached a level where many device designs, for the most part, can be embodied in the technology to produce a mechanical construct which provides the desired function. When designed properly, the fabricated mechanical element, if free to operate, will produce the desired function. However, one set of issues which can hinder or prevent operation are related to the post-fabricated device surfaces. These surface issues; namely, stiction, friction, and wear, are emphasized in the final section as a major hindrance to realizing the full potential of surface micromachined devices.

Micro-machined resonator oscillator

Science.gov (United States)

Koehler, Dale R.; Sniegowski, Jeffry J.; Bivens, Hugh M.; Wessendorf, Kurt O.

1994-01-01

A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a "telemetered sensor beacon" that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20-100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning. A family of micro-miniature sensor beacons is also disclosed with widespread applications as bio-medical sensors, vehicle status monitors and high-volume animal identification and health sensors. The sensor family allows measurement of temperatures, chemicals, acceleration and pressure. A microphone and clock realization is also available.

Benzocyclobutene-based electric micromachines supported on microball bearings: Design, fabrication, and characterization

Science.gov (United States)

Modafe, Alireza

This dissertation summarizes the research activities that led to the development of the first microball-bearing-supported linear electrostatic micromotor with benzocyclobutene (BCB) low-k polymer insulating layers. The primary application of this device is long-range, high-speed linear micropositioning. The future generations of this device include rotary electrostatic micromotors and microgenerators. The development of the first generation of microball-bearing-supported micromachines, including device theory, design, and modeling, material characterization, process development, device fabrication, and device test and characterization is presented. The first generation of these devices is based on a 6-phase, bottom-drive, linear, variable-capacitance micromotor (B-LVCM). The design of the electrical and mechanical components of the micromotor, lumped-circuit modeling of the device and electromechanical characteristics, including variable capacitance, force, power, and speed are presented. Electrical characterization of BCB polymers, characterization of BCB chemical mechanical planarization (CMP), development of embedded BCB in silicon (EBiS) process, and integration of device components using microfabrication techniques are also presented. The micromotor consists of a silicon stator, a silicon slider, and four stainless-steel microballs. The aligning force profile of the micromotor was extracted from simulated and measured capacitances of all phases. An average total aligning force of 0.27 mN with a maximum of 0.41 mN, assuming a 100 V peak-to-peak square-wave voltage, was measured. The operation of the micromotor was verified by applying square-wave voltages and characterizing the slider motion. An average slider speed of 7.32 mm/s when excited by a 40 Hz, 120 V square-wave voltage was reached without losing the synchronization. This research has a pivotal impact in the field of power microelectromechanical systems (MEMS). It establishes the foundation for the

Fabrication and Characterization of a CMOS-MEMS Humidity Sensor

Science.gov (United States)

Dennis, John-Ojur; Ahmed, Abdelaziz-Yousif; Khir, Mohd-Haris

2015-01-01

This paper reports on the fabrication and characterization of a Complementary Metal Oxide Semiconductor-Microelectromechanical System (CMOS-MEMS) device with embedded microheater operated at relatively elevated temperatures (40 °C to 80 °C) for the purpose of relative humidity measurement. The sensing principle is based on the change in amplitude of the device due to adsorption or desorption of humidity on the active material layer of titanium dioxide (TiO2) nanoparticles deposited on the moving plate, which results in changes in the mass of the device. The sensor has been designed and fabricated through a standard 0.35 µm CMOS process technology and post-CMOS micromachining technique has been successfully implemented to release the MEMS structures. The sensor is operated in the dynamic mode using electrothermal actuation and the output signal measured using a piezoresistive (PZR) sensor connected in a Wheatstone bridge circuit. The output voltage of the humidity sensor increases from 0.585 mV to 30.580 mV as the humidity increases from 35% RH to 95% RH. The output voltage is found to be linear from 0.585 mV to 3.250 mV as the humidity increased from 35% RH to 60% RH, with sensitivity of 0.107 mV/% RH; and again linear from 3.250 mV to 30.580 mV as the humidity level increases from 60% RH to 95% RH, with higher sensitivity of 0.781 mV/% RH. On the other hand, the sensitivity of the humidity sensor increases linearly from 0.102 mV/% RH to 0.501 mV/% RH with increase in the temperature from 40 °C to 80 °C and a maximum hysteresis of 0.87% RH is found at a relative humidity of 80%. The sensitivity is also frequency dependent, increasing from 0.500 mV/% RH at 2 Hz to reach a maximum value of 1.634 mV/% RH at a frequency of 12 Hz, then decreasing to 1.110 mV/% RH at a frequency of 20 Hz. Finally, the CMOS-MEMS humidity sensor showed comparable response, recovery, and repeatability of measurements in three cycles as compared to a standard sensor that directly

Fabrication and Characterization of a CMOS-MEMS Humidity Sensor.

Science.gov (United States)

Dennis, John-Ojur; Ahmed, Abdelaziz-Yousif; Khir, Mohd-Haris

2015-07-10

This paper reports on the fabrication and characterization of a Complementary Metal Oxide Semiconductor-Microelectromechanical System (CMOS-MEMS) device with embedded microheater operated at relatively elevated temperatures (40 °C to 80 °C) for the purpose of relative humidity measurement. The sensing principle is based on the change in amplitude of the device due to adsorption or desorption of humidity on the active material layer of titanium dioxide (TiO2) nanoparticles deposited on the moving plate, which results in changes in the mass of the device. The sensor has been designed and fabricated through a standard 0.35 µm CMOS process technology and post-CMOS micromachining technique has been successfully implemented to release the MEMS structures. The sensor is operated in the dynamic mode using electrothermal actuation and the output signal measured using a piezoresistive (PZR) sensor connected in a Wheatstone bridge circuit. The output voltage of the humidity sensor increases from 0.585 mV to 30.580 mV as the humidity increases from 35% RH to 95% RH. The output voltage is found to be linear from 0.585 mV to 3.250 mV as the humidity increased from 35% RH to 60% RH, with sensitivity of 0.107 mV/% RH; and again linear from 3.250 mV to 30.580 mV as the humidity level increases from 60% RH to 95% RH, with higher sensitivity of 0.781 mV/% RH. On the other hand, the sensitivity of the humidity sensor increases linearly from 0.102 mV/% RH to 0.501 mV/% RH with increase in the temperature from 40 °C to 80 °C and a maximum hysteresis of 0.87% RH is found at a relative humidity of 80%. The sensitivity is also frequency dependent, increasing from 0.500 mV/% RH at 2 Hz to reach a maximum value of 1.634 mV/% RH at a frequency of 12 Hz, then decreasing to 1.110 mV/% RH at a frequency of 20 Hz. Finally, the CMOS-MEMS humidity sensor showed comparable response, recovery, and repeatability of measurements in three cycles as compared to a standard sensor that directly

Pick-and-place process for sensitivity improvement of the capacitive type CMOS MEMS 2-axis tilt sensor

Science.gov (United States)

Chang, Chun-I.; Tsai, Ming-Han; Liu, Yu-Chia; Sun, Chih-Ming; Fang, Weileun

2013-09-01

This study exploits the foundry available complimentary metal-oxide-semiconductor (CMOS) process and the packaging house available pick-and-place technology to implement a capacitive type micromachined 2-axis tilt sensor. The suspended micro mechanical structures such as the spring, stage and sensing electrodes are fabricated using the CMOS microelectromechanical systems (MEMS) processes. A bulk block is assembled onto the suspended stage by pick-and-place technology to increase the proof-mass of the tilt sensor. The low temperature UV-glue dispensing and curing processes are employed to bond the block onto the stage. Thus, the sensitivity of the CMOS MEMS capacitive type 2-axis tilt sensor is significantly improved. In application, this study successfully demonstrates the bonding of a bulk solder ball of 100 µm in diameter with a 2-axis tilt sensor fabricated using the standard TSMC 0.35 µm 2P4M CMOS process. Measurements show the sensitivities of the 2-axis tilt sensor are increased for 2.06-fold (x-axis) and 1.78-fold (y-axis) after adding the solder ball. Note that the sensitivity can be further improved by reducing the parasitic capacitance and the mismatch of sensing electrodes caused by the solder ball.

Ultrasonic actuation for MEMS dormancy-related stiction reduction

Science.gov (United States)

Kaajakari, Ville; Kan, Shyi-Herng; Lin, Li-Jen; Lal, Amit; Rodgers, M. Steven

2000-08-01

The use of ultrasonic pulses incident on surface micromachines has been shown to reduce dormancy-related failure. We applied ultrasonic pulses from the backside of a silicon substrate carrying SUMMiT processed surface micromachined rotors, used earlier as ultrasonic motors. The amplitude of the pulses was less than what is required to actuate the rotor (sub-threshold actuation). By controlling the ultrasonic pulse exposure time it was found that pulsed samples had smaller actuation voltages as compared to non-pulsed samples after twelve-hour dormancy. This result indicates that the micromachine stiction to surfaces during dormant period can be effectively eliminated, resulting in long-term stability of surface micromachines in critical applications.

Piezoelectric MEMS: Ferroelectric thin films for MEMS applications

Science.gov (United States)

Kanno, Isaku

2018-04-01

In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.

Multi-layer enhancement to polysilicon surface-micromachining technology

Energy Technology Data Exchange (ETDEWEB)

Sniegowski, J.J.; Rodgers, M.S. [Sandia National Labs., Albuquerque, NM (United States). Intelligent Micromachine Dept.

1997-10-01

A multi-level polysilicon surface-micromachining technology consisting of 5 layers of polysilicon is presented. Surface topography and film mechanical stress are the major impediments encountered in the development of a multilayer surface-micromachining process. However, excellent mechanical film characteristics have been obtained through the use of chemical-mechanical polishing for planarization of topography and by proper sequencing of film deposition with thermal anneals. Examples of operating microactuators, geared power-transfer mechanisms, and optical elements demonstrate the mechanical advantages of construction with 5 polysilicon layers.

Micromachined capacitive ultrasonic immersion transducer array

Science.gov (United States)

Jin, Xuecheng

Capacitive micromachined ultrasonic transducers (cMUTs) have emerged as an attractive alternative to conventional piezoelectric ultrasonic transducers. They offer performance advantages of wide bandwidth and sensitivity that have heretofore been attainable. In addition, micromachining technology, which has benefited from the fast-growing microelectronics industry, enables cMUT array fabrication and electronics integration. This thesis describes the design and fabrication of micromachined capacitive ultrasonic immersion transducer arrays. The basic transducer electrical equivalent circuit is derived from Mason's theory. The effects of Lamb waves and Stoneley waves on cross coupling and acoustic losses are discussed. Electrical parasitics such as series resistance and shunt capacitance are also included in the model of the transducer. Transducer fabrication technology is systematically studied. Device dimension control in both vertical and horizontal directions, process alternatives and variations in membrane formation, via etch and cavity sealing, and metalization as well as their impact on transducer performance are summarized. Both 64 and 128 element 1-D array transducers are fabricated. Transducers are characterized in terms of electrical input impedance, bandwidth, sensitivity, dynamic range, impulse response and angular response, and their performance is compared with theoretical simulation. Various schemes for cross coupling reduction is analyzed, implemented, and verified with both experiments and theory. Preliminary results of immersion imaging are presented using 64 elements 1-D array transducers for active source imaging.

Converting MEMS technology into profits

Science.gov (United States)

Bryzek, Janusz

1998-08-01

This paper discusses issues related to transitioning a company from the advanced technology development phase (with a particular focus on MEMS) to a profitable business, with emphasis on start-up companies. It includes several case studies from (primarily) NovaSensor MEMS development history. These case studies illustrate strategic problems with which advanced MEMS technology developers have to be concerned. Conclusions from these case studies could be used as checkpoints for future MEMS developers to increase probability of profitable operations. The objective for this paper is to share the author's experience from multiple MEMS start-ups to accelerate development of the MEMS market by focusing state- of-the-art technologists on marketing issues.

Spiral-Shaped Piezoelectric MEMS Cantilever Array for Fully Implantable Hearing Systems

Directory of Open Access Journals (Sweden)

Péter Udvardi

2017-10-01

Full Text Available Fully implantable, self-powered hearing aids with no external unit could significantly increase the life quality of patients suffering severe hearing loss. This highly demanding concept, however, requires a strongly miniaturized device which is fully implantable in the middle/inner ear and includes the following components: frequency selective microphone or accelerometer, energy harvesting device, speech processor, and cochlear multielectrode. Here we demonstrate a low volume, piezoelectric micro-electromechanical system (MEMS cantilever array which is sensitive, even in the lower part of the voice frequency range (300–700 Hz. The test array consisting of 16 cantilevers has been fabricated by standard bulk micromachining using a Si-on-Insulator (SOI wafer and aluminum nitride (AlN as a complementary metal-oxide-semiconductor (CMOS and biocompatible piezoelectric material. The low frequency and low device footprint are ensured by Archimedean spiral geometry and Si seismic mass. Experimentally detected resonance frequencies were validated by an analytical model. The generated open circuit voltage (3–10 mV is sufficient for the direct analog conversion of the signals for cochlear multielectrode implants.

Vascular tissue engineering by computer-aided laser micromachining.

Science.gov (United States)

Doraiswamy, Anand; Narayan, Roger J

2010-04-28

Many conventional technologies for fabricating tissue engineering scaffolds are not suitable for fabricating scaffolds with patient-specific attributes. For example, many conventional technologies for fabricating tissue engineering scaffolds do not provide control over overall scaffold geometry or over cell position within the scaffold. In this study, the use of computer-aided laser micromachining to create scaffolds for vascular tissue networks was investigated. Computer-aided laser micromachining was used to construct patterned surfaces in agarose or in silicon, which were used for differential adherence and growth of cells into vascular tissue networks. Concentric three-ring structures were fabricated on agarose hydrogel substrates, in which the inner ring contained human aortic endothelial cells, the middle ring contained HA587 human elastin and the outer ring contained human aortic vascular smooth muscle cells. Basement membrane matrix containing vascular endothelial growth factor and heparin was to promote proliferation of human aortic endothelial cells within the vascular tissue networks. Computer-aided laser micromachining provides a unique approach to fabricate small-diameter blood vessels for bypass surgery as well as other artificial tissues with complex geometries.

MEMS for automotive and aerospace applications

CERN Document Server

Kraft, Michael

2013-01-01

MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for

A batch process micromachined thermoelectric energy harvester: fabrication and characterization

International Nuclear Information System (INIS)

Su, J; Goedbloed, M; Van Andel, Y; De Nooijer, M C; Elfrink, R; Wang, Z; Vullers, R J M; Leonov, V

2010-01-01

Micromachined thermopiles are considered as a cost-effective solution for energy harvesters working at a small temperature difference and weak heat flows typical for, e.g., the human body. They can be used for powering autonomous wireless sensor nodes in a body area network. In this paper, a micromachined thermoelectric energy harvester with 6 µm high polycrystalline silicon germanium (poly-SiGe) thermocouples fabricated on a 6 inch wafer is presented. An open circuit voltage of 1.49 V and an output power of 0.4 µW can be generated with 3.5 K temperature difference in a model of a wearable micromachined energy harvester of the discussed design, which has a die size of 1.0 mm × 2.5 mm inside a watch-size generator

Micromachined Integrated Transducers for Ultrasound Imaging

DEFF Research Database (Denmark)

la Cour, Mette Funding

The purpose of this project is to develop capacitive micromachined ultrasonic transducers (CMUTs) for medical imaging. Medical ultrasound transducers used today are fabricated using piezoelectric materials and bulk processing. To fabricate transducers capable of delivering a higher imaging...

CMOS MEMS Fabrication Technologies and Devices

Directory of Open Access Journals (Sweden)

Hongwei Qu

2016-01-01

Full Text Available This paper reviews CMOS (complementary metal-oxide-semiconductor MEMS (micro-electro-mechanical systems fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator CMOS MEMS are introduced separately. Introduction of associated devices follows the description of the respective CMOS MEMS technologies. Due to the vast array of CMOS MEMS devices, this review focuses only on the most typical MEMS sensors and actuators including pressure sensors, inertial sensors, frequency reference devices and actuators utilizing different physics effects and the fabrication processes introduced. Moreover, the incorporation of MEMS and CMOS is limited to monolithic integration, meaning wafer-bonding-based stacking and other integration approaches, despite their advantages, are excluded from the discussion. Both competitive industrial products and state-of-the-art research results on CMOS MEMS are covered.

Electron beam micromachining of plastics

Czech Academy of Sciences Publication Activity Database

Dupák, Libor

2014-01-01

Roč. 49, 5-6 (2014), s. 310-314 ISSN 0861-4717 R&D Projects: GA MŠk(CZ) LO1212; GA MŠk ED0017/01/01; GA MŠk EE.2.3.20.0103 Institutional support: RVO:68081731 Keywords : micromachining of plastics * Electron beam Subject RIV: JA - Electronics ; Optoelectronics, Electrical Engineering

Compliant walker

Science.gov (United States)

Kerley, James J. (Inventor); Eklund, Wayne D. (Inventor); Crane, J. Allen (Inventor)

1992-01-01

A compliant walker is provided for humans having limited use of their legs and lower back. It includes an upright wheel frame which at least partially surrounds an upright user wearing a partial body harness. It is attached to the frame by means of cable compliant apparatus consisting of sets of cable segments and angle bracket members connected between opposite side members of the frame and adjacent side portions of the harness. Novelty is believed to exist in the combination of a wheeled frame including a side support structure, a body harness, and compliance means connecting the body harness to the side support structure for flexibility holding and supporting a person in a substantially upright position when the user sags in the frame when taking weight off the lower extremities.

Demonstration of Robust Micromachined Jet Technology and its Application to Realistic Flow Control Problems

National Research Council Canada - National Science Library

Allen, Mark

2000-01-01

.... Our approaches include: (1) the development of suitable micromachined synthetic jets (microjets) as actuators, which obviate the need to physically extend micromachined structures into an external flow...

Micro benchtop optics by bulk silicon micromachining

Science.gov (United States)

Lee, Abraham P.; Pocha, Michael D.; McConaghy, Charles F.; Deri, Robert J.

2000-01-01

Micromachining of bulk silicon utilizing the parallel etching characteristics of bulk silicon and integrating the parallel etch planes of silicon with silicon wafer bonding and impurity doping, enables the fabrication of on-chip optics with in situ aligned etched grooves for optical fibers, micro-lenses, photodiodes, and laser diodes. Other optical components that can be microfabricated and integrated include semi-transparent beam splitters, micro-optical scanners, pinholes, optical gratings, micro-optical filters, etc. Micromachining of bulk silicon utilizing the parallel etching characteristics thereof can be utilized to develop miniaturization of bio-instrumentation such as wavelength monitoring by fluorescence spectrometers, and other miniaturized optical systems such as Fabry-Perot interferometry for filtering of wavelengths, tunable cavity lasers, micro-holography modules, and wavelength splitters for optical communication systems.

Nonlinear Dynamics of Electrostatically Actuated MEMS Arches

KAUST Repository

Al Hennawi, Qais M.

2015-05-01

In this thesis, we present theoretical and experimental investigation into the nonlinear statics and dynamics of clamped-clamped in-plane MEMS arches when excited by an electrostatic force. Theoretically, we first solve the equation of motion using a multi- mode Galarkin Reduced Order Model (ROM). We investigate the static response of the arch experimentally where we show several jumps due to the snap-through instability. Experimentally, a case study of in-plane silicon micromachined arch is studied and its mechanical behavior is measured using optical techniques. We develop an algorithm to extract various parameters that are needed to model the arch, such as the induced axial force, the modulus of elasticity, and the initially induced initial rise. After that, we excite the arch by a DC electrostatic force superimposed to an AC harmonic load. A softening spring behavior is observed when the excitation is close to the first resonance frequency due to the quadratic nonlinearity coming from the arch geometry and the electrostatic force. Also, a hardening spring behavior is observed when the excitation is close to the third (second symmetric) resonance frequency due to the cubic nonlinearity coming from mid-plane stretching. Then, we excite the arch by an electric load of two AC frequency components, where we report a combination resonance of the summed type. Agreement is reported among the theoretical and experimental work.

Biomedical microsystems

CERN Document Server

Meng, Ellis

2010-01-01

IntroductionEvolution of MEMSApplications of MEMSBioMEMS ApplicationsMEMS ResourcesText Goals and OrganizationMiniaturization and ScalingBioMEMS MaterialsTraditional MEMS and Microelectronic MaterialsPolymeric Materials for MEMSBiomaterialsMicrofabrication Methods and Processes for BioMEMSIntroductionMicrolithographyDopingMicromachiningWafer Bonding, Assembly, and PackagingSurface TreatmentConversion Factors for Energy and Intensity UnitsLaboratory ExercisesMicrofluidicsIntroduction and Fluid PropertiesConcepts in MicrofluidicsFluid-Transport Phenomena and PumpingFlow ControlLaboratory Exercis

Design and development of a surface micro-machined push–pull-type true-time-delay phase shifter on an alumina substrate for Ka-band T/R module application

International Nuclear Information System (INIS)

Dey, Sukomal; Koul, Shiban K

2012-01-01

A radio frequency micro-electro-mechanical system (RF-MEMS) phase shifter based on the distributed MEMS transmission line (DMTL) concept towards maximum achievable phase shift with low actuation voltage with good figure of merit (FOM) is presented in this paper. This surface micro-machined analog DMTL phase shifter demonstrates low power consumption for implementation in a Ka-band transmit/receive (T/R) module. The push–pull-type switch has been designed and optimized with an analytical method and validated with simulation, which is the fundamental building block of the design of a true-time-delay phase shifter. Change in phase has been designed and optimized in push and pull states with reference to the up-state performance of the phase shifter. The working principle of this push–pull-type DMTL phase shifter has been comprehensively worked out. A thorough detail of the design and performance analysis of the phase shifter has been carried out with various structural parameters using commercially available simulation tools with reference to a change in phase shift and has been verified using a system level simulation. The phase shifter is fabricated on the alumina substrate, using a suspended gold bridge membrane with a surface micromachining process. Asymmetric behaviour of push–pull bridge configuration has been noted and a corresponding effect on mechanical, electrical and RF performances has been extensively investigated. It is demonstrated 114° dB −1 FOM over 0–40 GHz band, which is the highest achievable FOM from a unit cell on an alumina substrate reported so far. A complete phase shifter contributes to a continuous differential phase shift of 0°–360° over 0–40 GHz band with a minimum actuation voltage of 8.1 V which is the highest achievable phase shift with the lowest actuation voltage as per till date on the alumina substrate with good repeatability and return loss better than 11.5 dB over 0–40 GHz band. (paper)

Discretely tunable micromachined injection-locked lasers

International Nuclear Information System (INIS)

Cai, H; Yu, M B; Lo, G Q; Kwong, D L; Zhang, X M; Liu, A Q; Liu, B

2010-01-01

This paper reports a micromachined injection-locked laser (ILL) to provide tunable discrete wavelengths. It utilizes a non-continuously tunable laser as the master to lock a Fabry–Pérot semiconductor laser chip. Both lasers are integrated into a deep-etched silicon chip with dimensions of 3 mm × 3 mm × 0.8 mm. Based on the experimental results, significant improvements in the optical power and spectral purity have been achieved in the fully locked state, and optical hysteresis and bistability have also been observed in response to the changes of the output wavelength and optical power of the master laser. As a whole system, the micromachined ILL is able to provide single mode, discrete wavelength tuning, high power and direct modulation with small size and single-chip solution, making it promising for advanced optical communications such as wavelength division multiplexing optical access networks.

Hand forces exerted by long-term care staff when pushing wheelchairs on compliant and non-compliant flooring.

Science.gov (United States)

Lachance, Chantelle C; Korall, Alexandra M B; Russell, Colin M; Feldman, Fabio; Robinovitch, Stephen N; Mackey, Dawn C

2018-09-01

Purpose-designed compliant flooring and carpeting have been promoted as a means for reducing fall-related injuries in high-risk environments, such as long-term care. However, it is not known whether these surfaces influence the forces that long-term care staff exert when pushing residents in wheelchairs. We studied 14 direct-care staff who pushed a loaded wheelchair instrumented with a triaxial load cell to test the effects on hand force of flooring overlay (vinyl versus carpet) and flooring subfloor (concrete versus compliant rubber [brand: SmartCells]). During straight-line pushing, carpet overlay increased initial and sustained hand forces compared to vinyl overlay by 22-49% over a concrete subfloor and by 8-20% over a compliant subfloor. Compliant subflooring increased initial and sustained hand forces compared to concrete subflooring by 18-31% when under a vinyl overlay. In contrast, compliant flooring caused no change in initial or sustained hand forces compared to concrete subflooring when under a carpet overlay. Copyright © 2018 Elsevier Ltd. All rights reserved.

MEMS-based clamp with a passive hold function for precision position retaining of micro manipulators

International Nuclear Information System (INIS)

Brouwer, D M; Van Dijk, J; Soemers, H M J R; De Jong, B R; De Boer, M J; Jansen, H V; Krijnen, G J M

2009-01-01

In this paper the design, modeling and fabrication of a precision MEMS-based clamp with a relatively large clamping force are presented. The purpose of the clamp is to mechanically fix a six-degree-of-freedom (DOF) MEMS-based sample manipulator (Brouwer et al J. Int. Soc. Precis. Eng. Nanotechnol. submitted) once the sample has been positioned in all DOFs. The clamping force is generated by a rotational electrostatic comb-drive actuator and can be latched passively by a parallel plate type electrostatically driven locking device. The clamp design is based on the principles of exact constraint design, resulting in a high actuation compliance (flexibility) combined with a high suspension stiffness. Therefore, a relatively large blocking force of 1.4 mN in relation to the used area of 1.8 mm 2 is obtained. The fabrication is based on silicon bulk micromachining technology and combines a high-aspect-ratio deep reactive ion etching (DRIE), conformal deposition of low-pressure chemical vapor deposition (LPCVD) silicon nitride and an anisotropic potassium hydroxide (KOH) backside etching technology. Special attention is given to void reduction of Si x N y trench isolation and reduction of heating phenomena during front-side release etching. Guidelines are given for the applied process. Measurements showed that the clamp was able to fix, hold and release a test actuator. The dynamic behavior was in good agreement with the modal analysis

Trends in laser micromachining

Science.gov (United States)

Gaebler, Frank; van Nunen, Joris; Held, Andrew

2016-03-01

Laser Micromachining is well established in industry. Depending on the application lasers with pulse length from μseconds to femtoseconds and wavelengths from 1064nm and its harmonics up to 5μm or 10.6μm are used. Ultrafast laser machining using pulses with pico or femtosecond duration pulses is gaining traction, as it offers very precise processing of materials with low thermal impact. Large-scale industrial ultrafast laser applications show that the market can be divided into various sub segments. One set of applications demand low power around 10W, compact footprint and are extremely sensitive to the laser price whilst still demanding 10ps or shorter laser pulses. A second set of applications are very power hungry and only become economically feasible for large scale deployments at power levels in the 100+W class. There is also a growing demand for applications requiring fs-laser pulses. In our presentation we would like to describe these sub segments by using selected applications from the automotive and electronics industry e.g. drilling of gas/diesel injection nozzles, dicing of LED substrates. We close the presentation with an outlook to micromachining applications e.g. glass cutting and foil processing with unique new CO lasers emitting 5μm laser wavelength.

Optical temperature sensor and thermal expansion measurement using a femtosecond micromachined grating in 6H-SiC.

Science.gov (United States)

DesAutels, G Logan; Powers, Peter; Brewer, Chris; Walker, Mark; Burky, Mark; Anderson, Gregg

2008-07-20

An optical temperature sensor was created using a femtosecond micromachined diffraction grating inside transparent bulk 6H-SiC, and to the best of our knowledge, this is a novel technique of measuring temperature. Other methods of measuring temperature using fiber Bragg gratings have been devised by other groups such as Zhang and Kahrizi [in MEMS, NANO, and Smart Systems (IEEE, 2005)]. This temperature sensor was, to the best of our knowledge, also used for a novel method of measuring the linear and nonlinear coefficients of the thermal expansion of transparent and nontransparent materials by means of the grating first-order diffracted beam. Furthermore the coefficient of thermal expansion of 6H-SiC was measured using this new technique. A He-Ne laser beam was used with the SiC grating to produce a first-order diffracted beam where the change in deflection height was measured as a function of temperature. The grating was micromachined with a 20 microm spacing and has dimensions of approximately 500 microm x 500 microm (l x w) and is roughly 0.5 microm deep into the 6H-SiC bulk. A minimum temperature of 26.7 degrees C and a maximum temperature of 399 degrees C were measured, which gives a DeltaT of 372.3 degrees C. The sensitivity of the technique is DeltaT=5 degrees C. A maximum deflection angle of 1.81 degrees was measured in the first-order diffracted beam. The trend of the deflection with increasing temperature is a nonlinear polynomial of the second-order. This optical SiC thermal sensor has many high-temperature electronic applications such as aircraft turbine and gas tank monitoring for commercial and military applications.

Compliant Interfacial Layers in Thermoelectric Devices

Science.gov (United States)

Firdosy, Samad A. (Inventor); Li, Billy Chun-Yip (Inventor); Ravi, Vilupanur A. (Inventor); Fleurial, Jean-Pierre (Inventor); Caillat, Thierry (Inventor); Anjunyan, Harut (Inventor)

2017-01-01

A thermoelectric power generation device is disclosed using one or more mechanically compliant and thermally and electrically conductive layers at the thermoelectric material interfaces to accommodate high temperature differentials and stresses induced thereby. The compliant material may be metal foam or metal graphite composite (e.g. using nickel) and is particularly beneficial in high temperature thermoelectric generators employing Zintl thermoelectric materials. The compliant material may be disposed between the thermoelectric segments of the device or between a thermoelectric segment and the hot or cold side interconnect of the device.

Effect of fluorocarbon self-assembled monolayer films on sidewall adhesion and friction of surface micromachines with impacting and sliding contact interfaces

International Nuclear Information System (INIS)

Xiang, H.; Komvopoulos, K.

2013-01-01

A self-assembled monolayer film consisting of fluoro-octyltrichlorosilane (FOTS) was vapor-phase deposited on Si(100) substrates and polycrystalline silicon (polysilicon) surface micromachines. The hydrophobic behavior and structural composition of the FOTS film deposited on Si(100) were investigated by goniometry and X-ray photoelectron spectroscopy, respectively. The effects of contact pressure, relative humidity, temperature, and impact/sliding cycles on the adhesive and friction behavior of uncoated and FOTS-coated polysilicon micromachines (referred to as the Si and FOTS/Si micromachines, respectively) were investigated under controlled loading and environmental conditions. FOTS/Si micromachines demonstrated much lower and stable adhesion than Si micromachines due to the highly hydrophobic and conformal FOTS film. Contrary to Si micromachines, sidewall adhesion of FOTS/Si micromachines demonstrated a weak dependence on relative humidity, temperature, and impact cycles. In addition, FOTS/Si micromachines showed low and stable adhesion and low static friction for significantly more sliding cycles than Si micromachines. The adhesive and static friction characteristics of Si and FOTS/Si micromachines are interpreted in the context of physicochemical surface changes, resulting in the increase of the real area of contact and a hydrophobic-to-hydrophilic transition of the surface chemical characteristics caused by nanoscale surface smoothening and the removal of the organic residue (Si micromachines) or the FOTS film (FOTS/Si micromachines) during repetitive impact and oscillatory sliding of the sidewall surfaces.

MEMS Reliability Assurance Activities at JPL

Science.gov (United States)

Kayali, S.; Lawton, R.; Stark, B.

2000-01-01

An overview of Microelectromechanical Systems (MEMS) reliability assurance and qualification activities at JPL is presented along with the a discussion of characterization of MEMS structures implemented on single crystal silicon, polycrystalline silicon, CMOS, and LIGA processes. Additionally, common failure modes and mechanisms affecting MEMS structures, including radiation effects, are discussed. Common reliability and qualification practices contained in the MEMS Reliability Assurance Guideline are also presented.

Challenges in the Packaging of MEMS

Energy Technology Data Exchange (ETDEWEB)

Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

1999-03-26

The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

77 GHz MEMS antennas on high-resistivity silicon for linear and circular polarization

KAUST Repository

Sallam, M. O.

2011-07-01

Two new MEMS antennas operating at 77 GHz are presented in this paper. The first antenna is linearly polarized. It possesses a vertical silicon wall that carries a dipole on top of it. The wall is located on top of silicon substrate covered with a ground plane. The other side of the substrate carries a microstrip feeding network in the form of U-turn that causes 180 phase shift. This phase-shifter feeds the arms of the dipole antenna via two vertical Through-Silicon Vias (TSVs) that go through the entire wafer. The second antenna is circularly polarized and formed using two linearly polarized antennas spatially rotated with respect to each other by 90 and excited with 90 phase shift. Both antennas are fabricated using novel process flow on a single high-resistivity silicon wafer via bulk micromachining. Only three processing steps are required to fabricate these antennas. The proposed antennas have appealing characteristics, such as high polarization purity, high gain, and high radiation efficiency. © 2011 IEEE.

Drag reduction through self-texturing compliant bionic materials

OpenAIRE

Eryong Liu; Longyang Li; Gang Wang; Zhixiang Zeng; Wenjie Zhao; Qunji Xue

2017-01-01

Compliant fish skin is effectively in reducing drag, thus the design and application of compliant bionic materials may be a good choice for drag reduction. Here we consider the drag reduction of compliant bionic materials. First, ZnO and PDMS mesh modified with n-octadecane were prepared, the drag reduction of self-texturing compliant n-octadecane were studied. The results show that the mesh modified by ZnO and PDMS possess excellent lipophilic and hydrophobic, thus n-octadecane at solid, sem...

Nanomechanics of hard films on compliant substrates.

Energy Technology Data Exchange (ETDEWEB)

Reedy, Earl David, Jr. (Sandia National Laboratories, Albuquerque, NM); Emerson, John Allen (Sandia National Laboratories, Albuquerque, NM); Bahr, David F. (Washington State University, Pullman, WA); Moody, Neville Reid; Zhou, Xiao Wang; Hales, Lucas (University of Minnesota, Minneapolis, MN); Adams, David Price (Sandia National Laboratories, Albuquerque, NM); Yeager,John (Washington State University, Pullman, WA); Nyugen, Thao D. (Johns Hopkins University, Baltimore, MD); Corona, Edmundo (Sandia National Laboratories, Albuquerque, NM); Kennedy, Marian S. (Clemson University, Clemson, SC); Cordill, Megan J. (Erich Schmid Institute, Leoben, Austria)

2009-09-01

Development of flexible thin film systems for biomedical, homeland security and environmental sensing applications has increased dramatically in recent years [1,2,3,4]. These systems typically combine traditional semiconductor technology with new flexible substrates, allowing for both the high electron mobility of semiconductors and the flexibility of polymers. The devices have the ability to be easily integrated into components and show promise for advanced design concepts, ranging from innovative microelectronics to MEMS and NEMS devices. These devices often contain layers of thin polymer, ceramic and metallic films where differing properties can lead to large residual stresses [5]. As long as the films remain substrate-bonded, they may deform far beyond their freestanding counterpart. Once debonded, substrate constraint disappears leading to film failure where compressive stresses can lead to wrinkling, delamination, and buckling [6,7,8] while tensile stresses can lead to film fracture and decohesion [9,10,11]. In all cases, performance depends on film adhesion. Experimentally it is difficult to measure adhesion. It is often studied using tape [12], pull off [13,14,15], and peel tests [16,17]. More recent techniques for measuring adhesion include scratch testing [18,19,20,21], four point bending [22,23,24], indentation [25,26,27], spontaneous blisters [28,29] and stressed overlayers [7,26,30,31,32,33]. Nevertheless, sample design and test techniques must be tailored for each system. There is a large body of elastic thin film fracture and elastic contact mechanics solutions for elastic films on rigid substrates in the published literature [5,7,34,35,36]. More recent work has extended these solutions to films on compliant substrates and show that increasing compliance markedly changes fracture energies compared with rigid elastic solution results [37,38]. However, the introduction of inelastic substrate response significantly complicates the problem [10,39,40]. As

10–25 GHz frequency reconfigurable MEMS 5-bit phase shifter using push–pull actuator based toggle mechanism

International Nuclear Information System (INIS)

Dey, Sukomal; Koul, Shiban K

2015-01-01

This paper presents a frequency tunable 5-bit true-time-delay digital phase shifter using radio frequency microelectromechanical system (RF MEMS) technology. The phase shifter is based on the distributed MEMS transmission line (DMTL) concept utilizing a MEMS varactor. The main source of frequency tuning in this work is a bridge actuation mechanism followed by capacitance variation. Two stages of actuation mechanisms (push and pull) are used to achieve a 2:1 tuning ratio. Accurate control of the actuation voltage between the pull to push stages contributes differential phase shift over the band of interest. The functional behavior of the push–pull actuation over the phase shifter application is theoretically established, experimentally investigated and validated with simulation. The phase shifter is fabricated monolithically using a gold based surface micromachining process on an alumina substrate. The individual primary phase-bits (11.25°/22.5°/45°/90°/180°) that are the fundamental building blocks of the complete 5-bit phase shifter are designed, fabricated and experimentally characterized from 10–25 GHz for specific applications. Finally, the complete 5-bit phase shifter demonstrates an average phase error of 4.32°, 2.8°, 1° and 1.58°, an average insertion loss of 3.76, 4.1, 4.2 and 4.84 dB and an average return loss of 11.7, 12, 14 and 11.8 dB at 10, 12, 17.2 and 25 GHz, respectively. To the best of the authors’ knowledge, this is the first reported band tunable stand alone 5-bit phase shifter in the literature which can work over the large spectrum for different applications. The total area of the 5-bit phase shifter is 15.6 mm 2 . Furthermore, the cold-switched reliability of the unit cell and the complete 5-bit MEMS phase shifter are extensively investigated and presented. (paper)

High speed micromachining with high power UV laser

Science.gov (United States)

Patel, Rajesh S.; Bovatsek, James M.

2013-03-01

Increasing demand for creating fine features with high accuracy in manufacturing of electronic mobile devices has fueled growth for lasers in manufacturing. High power, high repetition rate ultraviolet (UV) lasers provide an opportunity to implement a cost effective high quality, high throughput micromachining process in a 24/7 manufacturing environment. The energy available per pulse and the pulse repetition frequency (PRF) of diode pumped solid state (DPSS) nanosecond UV lasers have increased steadily over the years. Efficient use of the available energy from a laser is important to generate accurate fine features at a high speed with high quality. To achieve maximum material removal and minimal thermal damage for any laser micromachining application, use of the optimal process parameters including energy density or fluence (J/cm2), pulse width, and repetition rate is important. In this study we present a new high power, high PRF QuasarR 355-40 laser from Spectra-Physics with TimeShiftTM technology for unique software adjustable pulse width, pulse splitting, and pulse shaping capabilities. The benefits of these features for micromachining include improved throughput and quality. Specific example and results of silicon scribing are described to demonstrate the processing benefits of the Quasar's available power, PRF, and TimeShift technology.

Optical inspection of hidden MEMS structures

Science.gov (United States)

Krauter, Johann; Gronle, Marc; Osten, Wolfgang

2017-06-01

Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

UV laser micromachining of ceramic materials: formation of columnar topographies

International Nuclear Information System (INIS)

Oliveira, V.; Vilar, R.; Conde, O.

2001-01-01

Laser machining is increasingly appearing as an alternative for micromachining of ceramics. Using ceramic materials using excimer lasers can result in smooth surfaces or in the formation of cone-like or columnar topography. Potential applications of cone-shaped or columnar surface topography include, for example, light trapping in anti-reflection coatings and improvement of adhesion bonding between ceramic materials. In this communication results of a comparative study of surface topography change during micromachining of several ceramic materials with different ablation behaviors are reported. (orig.)

MEMS cost analysis from laboratory to industry

CERN Document Server

Freng, Ron Lawes

2016-01-01

The World of MEMS; Chapter 2: Basic Fabrication Processes; Chapter 3: Surface Microengineering. High Aspect Ratio Microengineering; Chapter 5: MEMS Testing; Chapter 6: MEMS Packaging. Clean Rooms, Buildings and Plant; Chapter 8: The MEMSCOST Spreadsheet; Chapter 9: Product Costs - Accelerometers. Product Costs - Microphones. MEMS Foundries. Financial Reporting and Analysis. Conclusions.

Drag reduction through self-texturing compliant bionic materials

Science.gov (United States)

Liu, Eryong; Li, Longyang; Wang, Gang; Zeng, Zhixiang; Zhao, Wenjie; Xue, Qunji

2017-01-01

Compliant fish skin is effectively in reducing drag, thus the design and application of compliant bionic materials may be a good choice for drag reduction. Here we consider the drag reduction of compliant bionic materials. First, ZnO and PDMS mesh modified with n-octadecane were prepared, the drag reduction of self-texturing compliant n-octadecane were studied. The results show that the mesh modified by ZnO and PDMS possess excellent lipophilic and hydrophobic, thus n-octadecane at solid, semisolid and liquid state all have good adhesion with modified mesh. The states of n-octadecane changed with temperature, thus, the surface contact angle and adhesive force all varies obviously at different state. The contact angle decreases with temperature, the adhesive force shows a lower value at semisolid state. Furthermore, the drag testing results show that the compliant n-octadecane film is more effectively in drag reduction than superhydrophobic ZnO/PDMS film, indicating that the drag reduction mechanism of n-octadecane is significantly different with superhydrophobic film. Further research shows that the water flow leads to self-texturing of semisolid state n-octadecane, which is similar with compliant fish skin. Therefore, the compliant bionic materials of semisolid state n-octadecane with regular bulge plays a major role in the drag reduction.

Ku to V-band 4-bit MEMS phase shifter bank using high isolation SP4T switches and DMTL structures

Science.gov (United States)

Dey, Sukomal; Koul, Shiban K.; Poddar, Ajay K.; Rohde, Ulrich L.

2017-10-01

This work presents a micro-electro-mechanical system (MEMS) based on a wide-band 4-bit phase shifter using two back-to-back single-pole-four-throw (SP4T) switches and four different distributed MEMS transmission line (DMTL) structures that are implemented on 635 µm alumina substrate using surface micromachining process. An SP4T switch is designed with a series-shunt configuration and it demonstrates an average return loss of  >17 dB, an insertion loss of  28 dB up to 60 GHz. A maximum area of the SP4T switch is ~0.76 mm2. Single-pole-single-throw and SP4T switches are capable of handling 1 W of radio frequency (RF) power up to  >100 million cycles at 25° C; they can even sustained up to  >70 million cycles with 1 W at 85 °C. The proposed wide-band phase shifter works at 17 GHz (Ku-band), 25 GHz (K-band), 35 GHz (Ka-band) and 60 GHz (V-band) frequencies. Finally,a 4-bit phase shifter demonstrates an average insertion loss of  10 dB and maximum phase error of ~3.8° at 60 GHz frequency over 500 MHz bandwidth. Total area of the fabricated device is ~11 mm2. In addition, the proposed device works well up to  >107 cycles with 1 W of RF power. To the best of the author’s knowledge, this is the best reported wide-band MEMS 4-bit phase shifter in the literature that works with a constant resolution.

Generation of Compliant Mechanisms using Hybrid Genetic Algorithm

Science.gov (United States)

Sharma, D.; Deb, K.

2014-10-01

Compliant mechanism is a single piece elastic structure which can deform to perform the assigned task. In this work, compliant mechanisms are evolved using a constraint based bi-objective optimization formulation which requires one user defined parameter ( η). This user defined parameter limits a gap between a desired path and an actual path traced by the compliant mechanism. The non-linear and discrete optimization problems are solved using the hybrid Genetic Algorithm (GA) wherein domain specific initialization, two-dimensional crossover operator and repairing techniques are adopted. A bit-wise local search method is used with elitist non-dominated sorting genetic algorithm to further refine the compliant mechanisms. Parallel computations are performed on the master-slave architecture to reduce the computation time. A parametric study is carried out for η value which suggests a range to evolve topologically different compliant mechanisms. The applied and boundary conditions to the compliant mechanisms are considered the variables that are evolved by the hybrid GA. The post-analysis of results unveils that the complaint mechanisms are always supported at unique location that can evolve the non-dominated solutions.

Modeling nonlinearities in MEMS oscillators.

Science.gov (United States)

Agrawal, Deepak K; Woodhouse, Jim; Seshia, Ashwin A

2013-08-01

We present a mathematical model of a microelectromechanical system (MEMS) oscillator that integrates the nonlinearities of the MEMS resonator and the oscillator circuitry in a single numerical modeling environment. This is achieved by transforming the conventional nonlinear mechanical model into the electrical domain while simultaneously considering the prominent nonlinearities of the resonator. The proposed nonlinear electrical model is validated by comparing the simulated amplitude-frequency response with measurements on an open-loop electrically addressed flexural silicon MEMS resonator driven to large motional amplitudes. Next, the essential nonlinearities in the oscillator circuit are investigated and a mathematical model of a MEMS oscillator is proposed that integrates the nonlinearities of the resonator. The concept is illustrated for MEMS transimpedance-amplifier- based square-wave and sine-wave oscillators. Closed-form expressions of steady-state output power and output frequency are derived for both oscillator models and compared with experimental and simulation results, with a good match in the predicted trends in all three cases.

Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration

Science.gov (United States)

Laconte, Jean; Flandre, D.; Raskin, Jean-Pierre

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 μm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution.

A Teaching - Learning Framework for MEMS Education

International Nuclear Information System (INIS)

Sheeparamatti, B G; Angadi, S A; Sheeparamatti, R B; Kadadevaramath, J S

2006-01-01

Micro-Electro-Mechanical Systems (MEMS) technology has been identified as one of the most promising technologies in the 21st century. MEMS technology has opened up a wide array of unforeseen applications. Hence it is necessary to train the technocrats of tomorrow in this emerging field to meet the industrial/societal demands. The drive behind fostering of MEMS technology is the reduction in the cost, size, weight, and power consumption of the sensors, actuators, and associated electronics. MEMS is a multidisciplinary engineering and basic science area which includes electrical engineering, mechanical engineering, material science and biomedical engineering. Hence MEMS education needs a special approach to prepare the technocrats for a career in MEMS. The modern education methodology using computer based training systems (CBTS) with embedded modeling and simulation tools will help in this direction. The availability of computer based learning resources such as MATLAB, ANSYS/Multiphysics and rapid prototyping tools have contributed to proposition of an efficient teaching-learning framework for MEMS education presented in this paper. This paper proposes a conceptual framework for teaching/learning MEMS in the current technical education scenario

Micro electromechanical systems (MEMS) for mechanical engineers

Energy Technology Data Exchange (ETDEWEB)

Lee, A. P., LLNL

1996-11-18

The ongoing advances in Microelectromechanical Systems (MEMS) are providing man-kind the freedom to travel to dimensional spaces never before conceivable. Advances include new fabrication processes, new materials, tailored modeling tools, new fabrication machines, systems integration, and more detailed studies of physics and surface chemistry as applied to the micro scale. In the ten years since its inauguration, MEMS technology is penetrating industries of automobile, healthcare, biotechnology, sports/entertainment, measurement systems, data storage, photonics/optics, computer, aerospace, precision instruments/robotics, and environment monitoring. It is projected that by the turn of the century, MEMS will impact every individual in the industrial world, totaling sales up to $14 billion (source: System Planning Corp.). MEMS programs in major universities have spawned up all over the United States, preparing the brain-power and expertise for the next wave of MEMS breakthroughs. It should be pointed out that although MEMS has been initiated by electrical engineering researchers through the involvement of IC fabrication techniques, today it has evolved such that it requires a totally multi-disciplinary team to develop useful devices. Mechanical engineers are especially crucial to the success of MEMS development, since 90% of the physical realm involved is mechanical. Mechanical engineers are needed for the design of MEMS, the analysis of the mechanical system, the design of testing apparatus, the implementation of analytical tools, and the packaging process. Every single aspect of mechanical engineering is being utilized in the MEMS field today, however, the impact could be more substantial if more mechanical engineers are involved in the systems level designing. In this paper, an attempt is made to create the pathways for a mechanical engineer to enter in the MEMS field. Examples of application in optics and medical devices will be used to illustrate how mechanical

European MEMS foundries

Science.gov (United States)

Salomon, Patric R.

2003-01-01

According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.

MEMS-based Circuits and Systems for Wireless Communication

CERN Document Server

Kaiser, Andreas

2013-01-01

MEMS-based Circuits and Systems for Wireless Communication provides comprehensive coverage of RF-MEMS technology from device to system level. This edited volume places emphasis on how system performance for radio frequency applications can be leveraged by Micro-Electro-Mechanical Systems (MEMS). Coverage also extends to innovative MEMS-aware radio architectures that push the potential of MEMS technology further ahead.  This work presents a broad overview of the technology from MEMS devices (mainly BAW and Si MEMS resonators) to basic circuits, such as oscillators and filters, and finally complete systems such as ultra-low-power MEMS-based radios. Contributions from leading experts around the world are organized in three parts. Part I introduces RF-MEMS technology, devices and modeling and includes a prospective outlook on ongoing developments towards Nano-Electro-Mechanical Systems (NEMS) and phononic crystals. Device properties and models are presented in a circuit oriented perspective. Part II focusses on ...

Model Design of Piezoelectric Micromachined Modal Gyroscope

Directory of Open Access Journals (Sweden)

Xiaojun Hu

2011-01-01

Full Text Available This paper reports a novel kind of solid-state microgyroscope, which is called piezoelectric micromachined modal gyroscope (PMMG. PMMG has large stiffness and robust resistance to shake and strike because there is no evident mass-spring component in its structure. This work focused on quantitative optimization of the gyroscope, which is still blank for such gyroscope. The modal analysis by the finite element method (FEM was firstly conducted. A set of quantitative indicators were developed to optimize the operation mode. By FEM, the harmonic analysis was conducted to find the way to efficiently actuate the operational mode needed. The optimal configuration of driving electrodes was obtained. At last, the Coriolis analysis was conducted to show the relation between angular velocity and differential output voltage by the Coriolis force under working condition. The results obtained in this paper provide theoretical basis for realizing this novel kind of micromachined gyroscope.

Sadhana | Indian Academy of Sciences

Indian Academy of Sciences (India)

An X band RF MEMS switch based on silicon-on-glass architecture · M S Giridhar Ashwini Jambhalikar J John R Islam C L ... Design, fabrication, testing and packaging of a silicon micromachined radio frequency microelectromechanical series (RF MEMS) switch · M S Giridhar Ashwini Jambhalikar Jiju John R Islam Ananda ...

MEMS linear and nonlinear statics and dynamics

CERN Document Server

Younis, Mohammad I

2011-01-01

MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of nume

Compliant thermal microactuators

DEFF Research Database (Denmark)

Jonsmann, Jacques; Sigmund, Ole; Bouwstra, Siebe

1999-01-01

Two dimensional compliant metallic thermal microactuators are designed using topology optimisation, and microfabricated using rapid prototyping techniques. Structures are characterised using advanced image analysis, yielding a very high precision. Characterised structures behave in accordance...

Surface chemistry and tribology of MEMS.

Science.gov (United States)

Maboudian, Roya; Carraro, Carlo

2004-01-01

The microscopic length scale and high surface-to-volume ratio, characteristic of microelectro-mechanical systems (MEMS), dictate that surface properties are of paramount importance. This review deals with the effects of surface chemical treatments on tribological properties (adhesion, friction, and wear) of MEMS devices. After a brief review of materials and processes that are utilized in MEMS technology, the relevant tribological and chemical issues are discussed. Various MEMS microinstruments are discussed, which are commonly employed to perform adhesion, friction, and wear measurements. The effects of different surface treatments on the reported tribological properties are discussed.

MEMS earthworm: a thermally actuated peristaltic linear micromotor

Science.gov (United States)

Arthur, Craig; Ellerington, Neil; Hubbard, Ted; Kujath, Marek

2011-03-01

This paper examines the design, fabrication and testing of a bio-mimetic MEMS (micro-electro mechanical systems) earthworm motor with external actuators. The motor consists of a passive mobile shuttle with two flexible diamond-shaped segments; each segment is independently squeezed by a pair of stationary chevron-shaped thermal actuators. Applying a specific sequence of squeezes to the earthworm segments, the shuttle can be driven backward or forward. Unlike existing inchworm drives that use clamping and thrusting actuators, the earthworm actuators apply only clamping forces to the shuttle, and lateral thrust is produced by the shuttle's compliant geometry. The earthworm assembly is fabricated using the PolyMUMPs process with planar dimensions of 400 µm width by 800 µm length. The stationary actuators operate within the range of 4-9 V and provide a maximum shuttle range of motion of 350 µm (approximately half its size), a maximum shuttle speed of 17 mm s-1 at 10 kHz, and a maximum dc shuttle force of 80 µN. The shuttle speed was found to vary linearly with both input voltage and input frequency. The shuttle force was found to vary linearly with the actuator voltage.

MEMS earthworm: a thermally actuated peristaltic linear micromotor

International Nuclear Information System (INIS)

Arthur, Craig; Ellerington, Neil; Hubbard, Ted; Kujath, Marek

2011-01-01

This paper examines the design, fabrication and testing of a bio-mimetic MEMS (micro-electro mechanical systems) earthworm motor with external actuators. The motor consists of a passive mobile shuttle with two flexible diamond-shaped segments; each segment is independently squeezed by a pair of stationary chevron-shaped thermal actuators. Applying a specific sequence of squeezes to the earthworm segments, the shuttle can be driven backward or forward. Unlike existing inchworm drives that use clamping and thrusting actuators, the earthworm actuators apply only clamping forces to the shuttle, and lateral thrust is produced by the shuttle's compliant geometry. The earthworm assembly is fabricated using the PolyMUMPs process with planar dimensions of 400 µm width by 800 µm length. The stationary actuators operate within the range of 4–9 V and provide a maximum shuttle range of motion of 350 µm (approximately half its size), a maximum shuttle speed of 17 mm s −1 at 10 kHz, and a maximum dc shuttle force of 80 µN. The shuttle speed was found to vary linearly with both input voltage and input frequency. The shuttle force was found to vary linearly with the actuator voltage.

Analysis and prediction of dimensions and cost of laser micro-machining internal channel fabrication process

Directory of Open Access Journals (Sweden)

Brabazon D.

2010-06-01

Full Text Available This paper presents the utilisation of Response Surface Methodology (RSM as the prediction tool for the laser micro-machining process. Laser internal microchannels machined using pulsed Nd:YVO4 laser in polycarbonate were investigated. The experiments were carried out according to 33 factorial Design of Experiment (DoE. In this work the three input process set as control parameters were laser power, P; pulse repetition frequency, PRF; and sample translation speed, U. Measured responses were the channel width and the micro-machining operating cost per metre of produced microchannels. The responses were sufficiently predicted within the set micro-machining parameters limits. Two factorial interaction (2FI and quadratic polynomial regression equations for both responses were constructed. It is proposed that the developed prediction equations can be used to find locally optimal micro-machining process parameters under experimental and operational conditions.

Electrostatic MEMS devices with high reliability

Science.gov (United States)

Goldsmith, Charles L; Auciello, Orlando H; Sumant, Anirudha V; Mancini, Derrick C; Gudeman, Chris; Sampath, Suresh; Carlilse, John A; Carpick, Robert W; Hwang, James

2015-02-24

The present invention provides for an electrostatic microelectromechanical (MEMS) device comprising a dielectric layer separating a first conductor and a second conductor. The first conductor is moveable towards the second conductor, when a voltage is applied to the MEMS device. The dielectric layer recovers from dielectric charging failure almost immediately upon removal of the voltage from the MEMS device.

Micromachined Piezoelectric Actuators for Cryogenic Adaptive Optics, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — TRS Technologies proposes micromachined single crystal piezoelectric actuator arrays to enable ultra-large stroke, high precision shape control for large aperture,...

High lane density slab-gel electrophoresis using micromachined instrumentation.

Science.gov (United States)

Papautsky, I; Mohanty, S; Weiss, R; Frazier, A B

2001-10-01

In this paper, micromachined pipette arrays (MPAs) and microcombs were studied as a means of enabling high lane density gel electrophoresis. The MPA provide a miniaturized format to interface sub-microliter volumes of samples between macroscale sample preparation formats and microscale biochemical analysis systems. The microcombs provide a means of creating sample loading wells in the gel material on the same center-to-center spacing as the MPAs. Together, the two micromachined instruments provide an alternative to current combs and pipetting technologies used for creating sample loading wells and sample delivery in gel electrophoresis systems. Using three designs for the microcomb-MPA pair, center-to-center spacings of 1.0 mm, 500 microm, and 250 microm are studied. The results demonstrate an approximate 10-fold increase in lane density and a 10-fold reduction in sample size from 5 microL to 500 pL. As a result, the number of theoretical plates has increased 2.5-fold, while system resolution has increased 1.5-fold over the conventional agarose gel systems. An examination of changes in resolution across the width of individual separation lanes in both systems revealed dependence in the case of the conventional gels and no dependence for the gels loaded with the micromachined instrumentation.

Topology synthesis of large-displacement compliant mechanisms

DEFF Research Database (Denmark)

Pedersen, Claus B. Wittendorf; Buhl, Thomas; Sigmund, Ole

2001-01-01

This paper describes the use of topology optimization as a synthesis tool for the design of large-displacement compliant mechanisms. An objective function for the synthesis of large-displacement mechanisms is proposed together with a formulation for synthesis of path-generating compliant mechanisms...

Integrated design of MEMS

DEFF Research Database (Denmark)

De Grave, Arnaud; Brissaud, Daniel

2007-01-01

Emerging technologies of Micro-Electromechanical Systems (MEMS) are applications such as airbag accelerometers. Micro-products present many physical differences from macro-products. Moreover, there is a high level of integration in multiple fields of physics with strongly coupled effects...... industrial immersion to propose a socio-technological description of the design process and MEMS design tools....

Energy star compliant voice over internet protocol (VoIP) telecommunications network including energy star compliant VoIP devices

Science.gov (United States)

Kouchri, Farrokh Mohammadzadeh

2012-11-06

A Voice over Internet Protocol (VoIP) communications system, a method of managing a communications network in such a system and a program product therefore. The system/network includes an ENERGY STAR (E-star) aware softswitch and E-star compliant communications devices at system endpoints. The E-star aware softswitch allows E-star compliant communications devices to enter and remain in power saving mode. The E-star aware softswitch spools messages and forwards only selected messages (e.g., calls) to the devices in power saving mode. When the E-star compliant communications devices exit power saving mode, the E-star aware softswitch forwards spooled messages.

Piezoelectric MEMS resonators

CERN Document Server

Piazza, Gianluca

2017-01-01

This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associate...

Laser Micromachining and Information Discovery Using a Dual Beam Interferometry

Energy Technology Data Exchange (ETDEWEB)

Theppakuttaikomaraswamy, Senthil P. [Iowa State Univ., Ames, IA (United States)

2001-01-01

Lasers have proven to be among the most promising tools for micromachining because they can process features down to the size of the laser wavelength (smaller than 1 micrometer) and they provide a non-contact technology for machining. The demand for incorporating in-situ diagnostics technology into the micromachining environment is driven by the increasing need for producing micro-parts of high quality and accuracy. Laser interferometry can be used as an on-line monitoring tool and it is the aim of this work to enhance the understanding and application of Michelson interferometry principle for the in-situ diagnostics of the machining depth on the sub-micron and micron scales. micromachining is done on two different materials and a comprehensive investigation is done to control the width and depth of the machined feature. To control the width of the feature, laser micromachining is done on copper and a detailed analysis is performed. The objective of this experiment is to make a precision mask for sputtering with an array of holes on it using an Nd:YAG laser of 532 nm wavelength. The diameter of the hole is 50 μm and the spacing between holes (the distance between the centers) is 100 μm. Michelson interferometer is integrated with a laser machining system to control the depth of machining. An excimer laser of 308 nm wavelength is used for micromachining. A He-Ne laser of 632.8 nm wavelength is used as the light source for the interferometer. Interference patterns are created due to the change in the path length between the two interferometer arms. The machined depth information is obtained from the interference patterns on an oscilloscope detected by a photodiode. To compare the predicted depth by the interferometer with the true machining depth, a surface profilometer is used to measure the actual machining depth on the silicon. It is observed that the depths of machining obtained by the surface profile measurement are in accordance with the interferometer

New technique for fabrication of high frequency piezoelectric Micromachined Ultrasound Transducers

DEFF Research Database (Denmark)

Pedersen, T; Thomsen, Erik Vilain; Zawada, T

2008-01-01

A novel technique for fabrication of linear arrays of high frequency piezoelectric Micromachined Ultrasound Transducers (pMUT) on silicon substrates is presented. Piezoelectric elements are formed by deposition of PZT ((PbZrxTi1-x)O3) into etched features of the silicon substrate such that the de......A novel technique for fabrication of linear arrays of high frequency piezoelectric Micromachined Ultrasound Transducers (pMUT) on silicon substrates is presented. Piezoelectric elements are formed by deposition of PZT ((PbZrxTi1-x)O3) into etched features of the silicon substrate...

Compliant walking appears metabolically advantageous at extreme step lengths.

Science.gov (United States)

Kim, Jaehoon; Bertram, John E A

2018-05-19

Humans alter gait in response to unusual gait circumstances to accomplish the task of walking. For instance, subjects spontaneously increase leg compliance at a step length threshold as step length increases. Here we test the hypothesis that this transition occurs based on the level of energy expenditure, where compliant walking becomes less energetically demanding at long step lengths. To map and compare the metabolic cost of normal and compliant walking as step length increases. 10 healthy individuals walked on a treadmill using progressively increasing step lengths (100%, 120%, 140% and 160% of preferred step length), in both normal and compliant leg walking as energy expenditure was recorded via indirect calorimetry. Leg compliance was controlled by lowering the center-of-mass trajectory during stance, forcing the leg to flex and extend as the body moved over the foot contact. For normal step lengths, compliant leg walking was more costly than normal walking gait, but compliant leg walking energetic cost did not increase as rapidly for longer step lengths. This led to an intersection between normal and compliant walking cost curves at 114% relative step length (regression analysis; r 2  = 0.92 for normal walking; r 2  = 0.65 for compliant walking). Compliant leg walking is less energetically demanding at longer step lengths where a spontaneous shift to compliant walking has been observed, suggesting the human motor control system is sensitive to energetic requirements and will employ alternate movement patterns if advantageous strategies are available. The transition could be attributed to the interplay between (i) leg work controlling body travel during single stance and (ii) leg work to control energy loss in the step-to-step transition. Compliant leg walking requires more stance leg work at normal step lengths, but involves less energy loss at the step-to-step transition for very long steps. Copyright © 2018 Elsevier B.V. All rights reserved.

Adhesion aspects in MEMS/NEMS

CERN Document Server

Kim, Seong H; Mittal, Kash L

2012-01-01

Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface

Practical guide to RF-MEMS

CERN Document Server

Iannacci, Jacopo

2013-01-01

Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical

A six degrees of freedom mems manipulator

NARCIS (Netherlands)

de Jong, B.R.

2006-01-01

This thesis reports about a six degrees of freedom (DOF) precision manipulator in MEMS, concerning concept generation for the manipulator followed by design and fabrication (of parts) of the proposed manipulation concept in MEMS. Researching the abilities of 6 DOF precision manipulation in MEMS is

A micromachined surface stress sensor with electronic readout

NARCIS (Netherlands)

Carlen, Edwin; Weinberg, M.S.; Zapata, A.M.; Borenstein, J.T.

2008-01-01

A micromachined surface stress sensor has been fabricated and integrated off chip with a low-noise, differential capacitance, electronic readout circuit. The differential capacitance signal is modulated with a high frequency carrier signal, and the output signal is synchronously demodulated and

Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

KAUST Repository

Agrawal, Richa

2015-05-18

The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

KAUST Repository

Agrawal, Richa; Beidaghi, Majid; Chen, Wei; Wang, Chunlei

2015-01-01

The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

Integration of Capacitive Micromachined Ultrasound Transducers to Microfluidic Devices

KAUST Repository

Viržonis, Darius; Kodzius, Rimantas; Vanagas, Galius

2013-01-01

The design and manufacturing flexibility of capacitive micromachined ultrasound transducers (CMUT) makes them attractive option for integration with microfluidic devices both for sensing and fluid manipulation. CMUT concept is introduced here

Miniaturized GPS/MEMS IMU integrated board

Science.gov (United States)

Lin, Ching-Fang (Inventor)

2012-01-01

This invention documents the efforts on the research and development of a miniaturized GPS/MEMS IMU integrated navigation system. A miniaturized GPS/MEMS IMU integrated navigation system is presented; Laser Dynamic Range Imager (LDRI) based alignment algorithm for space applications is discussed. Two navigation cameras are also included to measure the range and range rate which can be integrated into the GPS/MEMS IMU system to enhance the navigation solution.

Silicon Micromachines for Science and Technology

International Nuclear Information System (INIS)

Bishop, David J.

2002-01-01

The era of silicon micromechanics is upon us. In areas as diverse as telecommunications, automotive, aerospace, chemistry, entertainment and basic science, the ability to build microscopic machines from silicon is having a revolutionary impact. In my talk, I will discuss what micromachines are, how they are built and show examples of how they will have a revolutionary impact in many areas of science as well as technology.

Going Fabless with MEMS

Directory of Open Access Journals (Sweden)

Bhaskar CHOUBEY

2011-04-01

Full Text Available The Microelectromechanical sensors are finding increasing applications in everyday life. However, each MEMS sensor is generally fabricated on its own individual process. This leads to high cost per sensor. It has been suggested the MEMS should and would follow the path of integrated circuits industry, wherein fabless firms could concentrate on design leading pure-foundries to perfect the manufacturing process. With several designs being manufactured on the same process, the installation cost of fabrication would be evenly shared. Simultaneously, multiple project wafer runs are being offered for MEMS processes to encourage design activity in universities as well as startups. This paper reviews the present state of this transition through an experience of designing and manufacturing microelectromechanical resonators on different processes.

Structured synthesis of MEMS using evolutionary approaches

DEFF Research Database (Denmark)

Fan, Zhun; Wang, Jiachuan; Achiche, Sofiane

2008-01-01

In this paper, we discuss the hierarchy that is involved in a typical MEMS design and how evolutionary approaches can be used to automate the hierarchical synthesis process for MEMS. The paper first introduces the flow of a structured MEMS design process and emphasizes that system-level lumped...

Micro-machined calorimetric biosensors

Science.gov (United States)

Doktycz, Mitchel J.; Britton, Jr., Charles L.; Smith, Stephen F.; Oden, Patrick I.; Bryan, William L.; Moore, James A.; Thundat, Thomas G.; Warmack, Robert J.

2002-01-01

A method and apparatus are provided for detecting and monitoring micro-volumetric enthalpic changes caused by molecular reactions. Micro-machining techniques are used to create very small thermally isolated masses incorporating temperature-sensitive circuitry. The thermally isolated masses are provided with a molecular layer or coating, and the temperature-sensitive circuitry provides an indication when the molecules of the coating are involved in an enthalpic reaction. The thermally isolated masses may be provided singly or in arrays and, in the latter case, the molecular coatings may differ to provide qualitative and/or quantitative assays of a substance.

Integration of Capacitive Micromachined Ultrasound Transducers to Microfluidic Devices

KAUST Repository

Viržonis, Darius

2013-10-22

The design and manufacturing flexibility of capacitive micromachined ultrasound transducers (CMUT) makes them attractive option for integration with microfluidic devices both for sensing and fluid manipulation. CMUT concept is introduced here by presentin

Quasimetallic silicon micromachined photonic crystals

International Nuclear Information System (INIS)

Temelkuran, B.; Bayindir, Mehmet; Ozbay, E.; Kavanaugh, J. P.; Sigalas, M. M.; Tuttle, G.

2001-01-01

We report on fabrication of a layer-by-layer photonic crystal using highly doped silicon wafers processed by semiconductor micromachining techniques. The crystals, built using (100) silicon wafers, resulted in an upper stop band edge at 100 GHz. The transmission and defect characteristics of these structures were found to be analogous to metallic photonic crystals. We also investigated the effect of doping concentration on the defect characteristics. The experimental results agree well with predictions of the transfer matrix method simulations

Micromachined Polycrystalline Si Thermopiles in a T-shirt

Directory of Open Access Journals (Sweden)

Vladimir Leonov

2011-04-01

Full Text Available The technology for in-plane poly-Si thermopiles has been developed. The bulk-micromachined thermopiles are located between two Si bars and connected thermally with those bars through thin-film thermal shunts. The patterned strips of thermocouple material together with thermal shunts form bridges between Si bars. Two versions of a thermoelectric generator (TEG with micromachined thermopiles have been assembled and tested on a person’s wrist, and when integrated in a T-shirt. The TEG still produces less than 1 μW in the office, but at ambient temperatures below 11-13 °C it produces more than 1 μW at a voltage of more than 2 V on the matched load. The new way of integration of wearable TEG in clothing is shown. The TEG is located under the textile, and the fabric is used as a flexible radiator.

Theoretical and Experimental Investigation of the Nonlinear Behavior of an Electrostatically Actuated In-Plane MEMS Arch

KAUST Repository

Ramini, Abdallah

2016-05-02

We present theoretical and experimental investigation of the nonlinear behavior of a clamped-clamped in-plane MEMS arch when excited by a DC electrostatic load superimposed to an AC harmonic load. Experimentally, a case study of in-plane silicon micromachined arch is examined and its mechanical behavior is measured using optical techniques. An algorithm is developed to extract the various parameters, such as the induced axial force and the initial rise, needed to model the behavior of the arch. A softening spring behavior is observed when the excitation is close to the first resonance frequency due to the quadratic nonlinearity coming from the arch geometry and the electrostatic force. Also, a hardening spring behavior is observed when the excitation is close to the third (second symmetric) resonance frequency due to the cubic nonlinearity coming from mid-plane stretching. Dynamic snap-through behavior is also reported for larger range of electric loads. Theoretically, a multi-mode Galerkin reduced order model is utilized to simulate the arch behavior. General agreement is reported among the theoretical and experimental data.

Predicting the Deflections of Micromachined Electrostatic Actuators Using Artificial Neural Network (ANN

Directory of Open Access Journals (Sweden)

Hing Wah LEE

2009-03-01

Full Text Available In this study, a general purpose Artificial Neural Network (ANN model based on the feed-forward back-propagation (FFBP algorithm has been used to predict the deflections of a micromachined structures actuated electrostatically under different loadings and geometrical parameters. A limited range of simulation results obtained via CoventorWare™ numerical software will be used initially to train the neural network via back-propagation algorithm. The micromachined structures considered in the analyses are diaphragm, fixed-fixed beams and cantilevers. ANN simulation results are compared with results obtained via CoventorWare™ simulations and existing analytical work for validation purpose. The proposed ANN model accurately predicts the deflections of the micromachined structures with great reduction of simulation efforts, establishing the method superiority. This method can be extended for applications in other sensors particularly for modeling sensors applying electrostatic actuation which are difficult in nature due to the inherent non-linearity of the electro-mechanical coupling response.

Topology optimized RF MEMS switches

DEFF Research Database (Denmark)

Philippine, M. A.; Zareie, H.; Sigmund, Ole

2013-01-01

Topology optimization is a rigorous and powerful method that should become a standard MEMS design tool - it can produce unique and non-intuitive designs that meet complex objectives and can dramatically improve the performance and reliability of MEMS devices. We present successful uses of topology...

Design of millimeter-wave MEMS-based reconfigurable front-end circuits using the standard CMOS technology

International Nuclear Information System (INIS)

Chang, Chia-Chan; Hsieh, Sheng-Chi; Chen, Chien-Hsun; Huang, Chin-Yen; Yao, Chun-Han; Lin, Chun-Chi

2011-01-01

This paper describes the designs of three reconfigurable CMOS-MEMS front-end components for V-/W-band applications. The suspended MEMS structure is released through post-CMOS micromachining. To achieve circuit reconfigurability, dual-state and multi-state fishbone-beam-drive actuators are proposed herein. The reconfigurable bandstop is fabricated in a 0.35 µm CMOS process with the chip size of 0.765 × 0.98 mm 2 , showing that the stop-band frequency can be switched from 60 to 50 GHz with 40 V actuation voltage. The measured isolation is better than 38 dB at 60 GHz and 34 dB at 50 GHz, respectively. The bandpass filter-integrated single-pole single-throw switch, using the 0.18 µm CMOS process, demonstrates that insertion loss and return loss are better than 6.2 and 15 dB from 88 to 100 GHz in the on-state, and isolation is better than 21 dB in the off-state with an actuation voltage of 51 V. The chip size is 0.7 × 1.04 mm 2 . The third component is a reconfigurable slot antenna fabricated in a 0.18 µm CMOS process with the chip size of 1.2 × 1.2 mm 2 . By utilizing the multi-state actuators, the frequencies of this antenna can be switched to 43, 47, 50.5, 54, 57.5 GHz with return loss better than 20 dB. Those circuits demonstrate good RF performance and are relatively compact by employing several size miniaturizing techniques, thereby enabling a great potential for the future single-chip transceiver.

MEMS reliability: coming of age

Science.gov (United States)

Douglass, Michael R.

2008-02-01

In today's high-volume semiconductor world, one could easily take reliability for granted. As the MOEMS/MEMS industry continues to establish itself as a viable alternative to conventional manufacturing in the macro world, reliability can be of high concern. Currently, there are several emerging market opportunities in which MOEMS/MEMS is gaining a foothold. Markets such as mobile media, consumer electronics, biomedical devices, and homeland security are all showing great interest in microfabricated products. At the same time, these markets are among the most demanding when it comes to reliability assurance. To be successful, each company developing a MOEMS/MEMS device must consider reliability on an equal footing with cost, performance and manufacturability. What can this maturing industry learn from the successful development of DLP technology, air bag accelerometers and inkjet printheads? This paper discusses some basic reliability principles which any MOEMS/MEMS device development must use. Examples from the commercially successful and highly reliable Digital Micromirror Device complement the discussion.

Lithographic stress control for the self-assembly of polymer MEMS structures

International Nuclear Information System (INIS)

Lee, S-W; Sameoto, D; Parameswaran, M; Mahanfar, A

2008-01-01

We present a novel self-assembly mechanism to produce an assortment of predetermined three-dimensional micromechanical structures in polymer MEMS technology using lithographically defined areas of stress and mechanical reinforcement within a single structural material. This self-assembly technology is based on the tensile stress that arises during the cross-linking of the negative tone, epoxy-based photoresist SU-8. Two different thicknesses of SU-8 are used in a single compliant structure. The first SU-8 layer forms the main structural element and the second SU-8 layer determines the aspects of self-assembly. The second SU-8 layer thickness acts to both to create a stress differential within the structure as well as define the direction in which the induced stress will cause the structure to deform. In this manner, both the magnitude and direction of self-assembled structures can be controlled using a single lithographic step. Although this technique uses a single structural material, the basic concept may be adapted for other processes, with different material choices, for a wide variety of applications

Design and fabrication of a micro parallel mechanism system using MEMS technologies

Science.gov (United States)

Chin, Chi-Te

A parallel mechanism is seen as an attractive method of fabricating a multi-degree of freedom micro-stage on a chip. The research team at Arizona State University has experience with several potential parallel mechanisms that would be scaled down to micron dimensions and fabricated by using the silicon process. The researcher developed a micro parallel mechanism that allows for planar motion having two translational motions and one rotational motion (e.g., x, y, theta). The mask design shown in Appendix B is an example of a planar parallel mechanism, however, this design would only have a few discrete positions given the nature of the fully extended or fully retracted electrostatic motor. The researcher proposes using a rotary motor (comb-drive actuator with gear chain system) coupled to a rack and pinion for finer increments of linear motion. The rotary motor can behave as a stepper motor by counting drive pulses, which is the basis for a simple open loop control system. This system was manufactured at the Central Regional MEMS Research Center (CMEMS), National Tsing-Hua University, and supported by the National Science Council, Taiwan. After the microstructures had been generated, the proceeding devices were released and an experiment study was performed to demonstrate the feasibility of the proposed micro-stage devices. In this dissertation, the micro electromechanical system (MEMS) fabrication technologies were introduced. The development of this parallel mechanism system will initially focus on development of a planar micro-stage. The design of the micro-stage will build on the parallel mechanism technology, which has been developed for manufacturing, assembly, and flight simulator applications. Parallel mechanism will give the maximum operating envelope with a minimum number of silicon levels. The ideally proposed mechanism should comprise of a user interface, a micro-stage and a non-silicon tool, which is difficult to accomplish by current MEMS technology

Electromagnetic actuation in MEMS switches

DEFF Research Database (Denmark)

Oliveira Hansen, Roana Melina de; Mátéfi-Tempfli, Mária; Chemnitz, Steffen

. Electromagnetic actuation is a very promising approach to operate such MEMS and Power MEMS devices, due to the long range, reproducible and strong forces generated by this method, among other advantages. However, the use of electromagnetic actuation in such devices requires the use of thick magnetic films, which...

A survey of bio-inspired compliant legged robot designs

International Nuclear Information System (INIS)

Zhou Xiaodong; Bi Shusheng

2012-01-01

The roles of biological springs in vertebrate animals and their implementations in compliant legged robots offer significant advantages over the rigid legged ones in certain types of scenarios. A large number of robotics institutes have been attempting to work in conjunction with biologists and incorporated these principles into the design of biologically inspired robots. The motivation of this review is to investigate the most published compliant legged robots and categorize them according to the types of compliant elements adopted in their mechanical structures. Based on the typical robots investigated, the trade-off between each category is summarized. In addition, the most significant performances of these robots are compared quantitatively, and multiple available solutions for the future compliant legged robot design are suggested. Finally, the design challenges for compliant legged robots are analysed. This review will provide useful guidance for robotic designers in creating new designs by inheriting the virtues of those successful robots according to the specific tasks. (topical review)

Design and optimization of a bend-and-sweep compliant mechanism

International Nuclear Information System (INIS)

Tummala, Y; Frecker, M I; Wissa, A A; Hubbard Jr, J E

2013-01-01

A novel contact aided compliant mechanism called bend-and-sweep compliant mechanism is presented in this paper. This mechanism has nonlinear stiffness properties in two orthogonal directions. An angled compliant joint (ACJ) is the fundamental element of this mechanism. Geometric parameters of ACJs determine the stiffness of the compliant mechanism. This paper presents the design and optimization of bend-and-sweep compliant mechanism. A multi-objective optimization problem was formulated for design optimization of the bend-and-sweep compliant mechanism. The objectives of the optimization problem were to maximize or minimize the bending and sweep displacements, depending on the situation, while minimizing the von Mises stress and mass of each mechanism. This optimization problem was solved using NSGA-II (a genetic algorithm). The results of this optimization for a single ACJ during upstroke and downstroke are presented in this paper. Results of two different loading conditions used during optimization of a single ACJ for upstroke are presented. Finally, optimization results comparing the performance of compliant mechanisms with one and two ACJs are also presented. It can be inferred from these results that the number of ACJs and the design of each ACJ determines the stiffness of the bend-and-sweep compliant mechanism. These mechanisms can be used in various applications. The goal of this research is to improve the performance of ornithopters by passively morphing their wings. In order to achieve a bio-inspired wing gait called continuous vortex gait, the wings of the ornithopter need to bend, and sweep simultaneously. This can be achieved by inserting the bend-and-sweep compliant mechanism into the leading edge wing spar of the ornithopters. (paper)

Optimization and simulation of MEMS rectilinear ion trap

Directory of Open Access Journals (Sweden)

Huang Gang

2015-04-01

Full Text Available In this paper, the design of a MEMS rectilinear ion trap was optimized under simulated conditions. The size range of the MEMS rectilinear ion trap’s electrodes studied in this paper is measured at micron scale. SIMION software was used to simulate the MEMS rectilinear ion trap with different sizes and different radio-frequency signals. The ion-trapping efficiencies of the ion trap under these different simulation conditions were obtained. The ion-trapping efficiencies were compared to determine the performance of the MEMS rectilinear ion trap in different conditions and to find the optimum conditions. The simulation results show that for the ion trap at micron scale or smaller, the optimized length–width ratio was 0.8, and a higher frequency of radio-frequency signal is necessary to obtain a higher ion-trapping efficiency. These results have a guiding role in the process of developing MEMS rectilinear ion traps, and great application prospects in the research fields of the MEMS rectilinear ion trap and the MEMS mass spectrometer.

Preliminary Assessment of a Compliant Gait Exoskeleton.

Science.gov (United States)

Cestari, Manuel; Sanz-Merodio, Daniel; Garcia, Elena

2017-06-01

Current commercial wearable gait exoskeletons contain joints with stiff actuators that cannot adapt to unpredictable environments. These actuators consume a significant amount of energy, and their stiffness may not be appropriate for safe human-machine interactions. Adjustable compliant actuators are being designed and implemented because of their ability to minimize large forces due to shocks, to safely interact with the user, and to store and release energy in passive elastic elements. Introduction of such compliant actuation in gait exoskeletons, however, has been limited by the larger power-to-weight and volume ratio requirement. This article presents a preliminary assessment of the first compliant exoskeleton for children. Compliant actuation systems developed by our research group were integrated into the ATLAS exoskeleton prototype. The resulting device is a compliant exoskeleton, the ATLAS-C prototype. The exoskeleton is coupled with a special standing frame to provide balance while allowing a semi-natural gait. Experiments show that when comparing the behavior of the joints under different stiffness conditions, the inherent compliance of the implemented actuators showed natural adaptability during the gait cycle and in regions of shock absorption. Torque tracking of the joint is achieved, identifying the areas of loading response. The implementation of a state machine in the control of knee motion allowed reutilization of the stored energy during deflection at the end of the support phase to partially propel the leg and achieve a more natural and free swing.

Turbine airfoil with a compliant outer wall

Science.gov (United States)

Campbell, Christian X [Oviedo, FL; Morrison, Jay A [Oviedo, FL

2012-04-03

A turbine airfoil usable in a turbine engine with a cooling system and a compliant dual wall configuration configured to enable thermal expansion between inner and outer layers while eliminating stress formation in the outer layer is disclosed. The compliant dual wall configuration may be formed a dual wall formed from inner and outer layers separated by a support structure. The outer layer may be a compliant layer configured such that the outer layer may thermally expand and thereby reduce the stress within the outer layer. The outer layer may be formed from a nonplanar surface configured to thermally expand. In another embodiment, the outer layer may be planar and include a plurality of slots enabling unrestricted thermal expansion in a direction aligned with the outer layer.

Using MEMS Capacitive Switches in Tunable RF Amplifiers

Directory of Open Access Journals (Sweden)

Danson John

2006-01-01

Full Text Available A MEMS capacitive switch suitable for use in tunable RF amplifiers is described. A MEMS switch is designed, fabricated, and characterized with physical and RF measurements for inclusion in simulations. Using the MEMS switch models, a dual-band low-noise amplifier (LNA operating at GHz and GHz, and a tunable power amplifier (PA at GHz are simulated in m CMOS. MEMS switches allow the LNA to operate with 11 dB of isolation between the two bands while maintaining dB of gain and sub- dB noise figure. MEMS switches are used to implement a variable matching network that allows the PA to realize up to 37% PAE improvement at low input powers.

MEMS/MOEMS foundry services at INO

Science.gov (United States)

García-Blanco, Sonia; Ilias, Samir; Williamson, Fraser; Généreux, Francis; Le Noc, Loïc; Poirier, Michel; Proulx, Christian; Tremblay, Bruno; Provençal, Francis; Desroches, Yan; Caron, Jean-Sol; Larouche, Carl; Beaupré, Patrick; Fortin, Benoit; Topart, Patrice; Picard, Francis; Alain, Christine; Pope, Timothy; Jerominek, Hubert

2010-06-01

In the MEMS manufacturing world, the "fabless" model is getting increasing importance in recent years as a way for MEMS manufactures and startups to minimize equipment costs and initial capital investment. In order for this model to be successful, the fabless company needs to work closely with a MEMS foundry service provider. Due to the lack of standardization in MEMS processes, as opposed to CMOS microfabrication, the experience in MEMS development processes and the flexibility of the MEMS foundry are of vital importance. A multidisciplinary team together with a complete microfabrication toolset allows INO to offer unique MEMS foundry services to fabless companies looking for low to mid-volume production. Companies that benefit from their own microfabrication facilities can also be interested in INO's assistance in conducting their research and development work during periods where production runs keep their whole staff busy. Services include design, prototyping, fabrication, packaging, and testing of various MEMS and MOEMS devices on wafers fully compatible with CMOS integration. Wafer diameters ranging typically from 1 inch to 6 inches can be accepted while 8-inch wafers can be processed in some instances. Standard microfabrication techniques such as metal, dielectric, and semiconductor film deposition and etching as well as photolithographic pattern transfer are available. A stepper permits reduction of the critical dimension to around 0.4 μm. Metals deposited by vacuum deposition methods include Au, Ag, Al, Al alloys, Ti, Cr, Cu, Mo, MoCr, Ni, Pt, and V with thickness varying from 5 nm to 2 μm. Electroplating of several materials including Ni, Au and In is also available. In addition, INO has developed and built a gold black deposition facility to answer customer's needs for broadband microbolometric detectors. The gold black deposited presents specular reflectance of less than 10% in the wavelength range from 0.2 μm to 100 μm with thickness ranging from

Design of compliant mechanisms with selective compliance

International Nuclear Information System (INIS)

Hasse, Alexander; Campanile, Lucio Flavio

2009-01-01

Conventional mechanisms provide a defined mobility, which expresses the number of degrees of freedom of the mechanism. This allows the system to be driven by a low number of control outputs. This property is virtually retained in the case of compliant mechanisms with lumped compliance, which are obtained by replacing the conventional hinges by solid-state ones. Compliant mechanisms with distributed compliance have, in general, an infinite number of degrees of freedom and therefore cannot guarantee defined kinematics. In this paper the concept of compliant mechanisms with selective compliance is introduced. This special class of compliant mechanisms combines the advantages of distributed compliance with the easy controllability of systems with defined kinematics. The task is accomplished by introducing a new design criterion based on a modal formulation. After this design criterion has been implemented in an optimization formulation for a formal optimization procedure, mechanisms are obtained in which a freely chosen deformation pattern is associated with a low deformation energy while other deformation patterns are considerably stiffer. Besides the description of the modal design criterion and the associated objective function, the sensitivity analysis of the objective function is presented and an application example is shown

Modeling and Experimental Study on Characterization of Micromachined Thermal Gas Inertial Sensors

Directory of Open Access Journals (Sweden)

Yan Su

2010-09-01

Full Text Available Micromachined thermal gas inertial sensors based on heat convection are novel devices that compared with conventional micromachined inertial sensors offer the advantages of simple structures, easy fabrication, high shock resistance and good reliability by virtue of using a gaseous medium instead of a mechanical proof mass as key moving and sensing elements. This paper presents an analytical modeling for a micromachined thermal gas gyroscope integrated with signal conditioning. A simplified spring-damping model is utilized to characterize the behavior of the sensor. The model relies on the use of the fluid mechanics and heat transfer fundamentals and is validated using experimental data obtained from a test-device and simulation. Furthermore, the nonideal issues of the sensor are addressed from both the theoretical and experimental points of view. The nonlinear behavior demonstrated in experimental measurements is analyzed based on the model. It is concluded that the sources of nonlinearity are mainly attributable to the variable stiffness of the sensor system and the structural asymmetry due to nonideal fabrication.

Design of a statically balanced fully compliant grasper

NARCIS (Netherlands)

Lamers, A.J.; Gallego Sanchez, J.A.; Herder, Justus Laurens

2015-01-01

Monolithic and thus fully compliant surgical graspers are promising when they provide equal or better force feedback than conventional graspers. In this work for the first time a fully compliant grasper is designed to exhibit zero stiffness and zero operation force. The design problem is addressed

Advanced mechatronics and MEMS devices II

CERN Document Server

Wei, Bin

2017-01-01

This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intel...

RF MEMS: status of the industry and roadmaps

Science.gov (United States)

Bouchaud, Jeremie; Wicht, Henning

2005-01-01

Microsystems for Radio Frequency applications, known as RF MEMS, have entered the commercialization phase in 2003. Bulk Acoustic Wave filters are already produced in series and first commercial samples of switches are available. On the other hand, reliability and packaging problems are still a major hurdle especially for switches and tunable capacitors. Will RF MEMS hold their promise to be one of the future major businesses for MEMS? The presentation will give an overview on RF MEMS applications and market players. WTC will highlight technical challenges that still have to be solved to open mass markets such as mobile telephony and WLAN. WTC will also present applications of RF MEMS and opportunities in niche markets with high added value like military and space applications. WTC will provide a regional analysis and compare R&D focus and public funding situation in North America, Europe and Asia. Finally, WTC will present an updated product roadmap market forecast for RF MEMS devices for the 2004-2008 time period.

Sub-band-gap laser micromachining of lithium niobate

DEFF Research Database (Denmark)

Christensen, F. K.; Müllenborn, Matthias

1995-01-01

method is reported which enables us to do laser processing of lithium niobate using sub-band-gap photons. Using high scan speeds, moderate power densities, and sub-band-gap photon energies results in volume removal rates in excess of 106µm3/s. This enables fast micromachining of small piezoelectric...

Proceedings of the International Conference on Integrated Micro/Nanotechnology for Space Applications

Science.gov (United States)

1995-01-01

The recent evolution of microelectronic technologies coupled with the growth of micro-electro-mechanical systems (MEMS) has had significant impact in the commercial sector. The focus of this conference was to anticipate and extend the incorporation of nano-electronics and MEMS into application specific integrated microinstruments (ASIM's) in space systems. Presentations ranged from mission application of nano-satellites to silicon micromachining for photonic applications.

The Micronium-A Musical MEMS instrument

NARCIS (Netherlands)

Engelen, Johannes Bernardus Charles; de Boer, Hans L.; de Boer, Hylco; Beekman, Jethro G.; Fortgens, Laurens C.; de Graaf, Derk B.; Vocke, Sander; Abelmann, Leon

The Micronium is a musical instrument fabricated from silicon using microelectromechanical system (MEMS) technology. It is—to the best of our knowledge—the first musical micro-instrument fabricated using MEMS technology, where the actual sound is generated by mechanical microstructures. The

Artificial Roughness Encoding with a Bio-inspired MEMS-based Tactile Sensor Array

Directory of Open Access Journals (Sweden)

Calogero Maria Oddo

2009-04-01

Full Text Available A compliant 2x2 tactile sensor array was developed and investigated for roughness encoding. State of the art cross shape 3D MEMS sensors were integrated with polymeric packaging providing in total 16 sensitive elements to external mechanical stimuli in an area of about 20 mm2, similarly to the SA1 innervation density in humans. Experimental analysis of the bio-inspired tactile sensor array was performed by using ridged surfaces, with spatial periods from 2.6 mm to 4.1 mm, which were indented with regulated 1N normal force and stroked at constant sliding velocity from 15 mm/s to 48 mm/s. A repeatable and expected frequency shift of the sensor outputs depending on the applied stimulus and on its scanning velocity was observed between 3.66 Hz and 18.46 Hz with an overall maximum error of 1.7%. The tactile sensor could also perform contact imaging during static stimulus indentation. The experiments demonstrated the suitability of this approach for the design of a roughness encoding tactile sensor for an artificial fingerpad.

Using MEMS Capacitive Switches in Tunable RF Amplifiers

OpenAIRE

Danson John; Plett Calvin; Tait Niall

2006-01-01

A MEMS capacitive switch suitable for use in tunable RF amplifiers is described. A MEMS switch is designed, fabricated, and characterized with physical and RF measurements for inclusion in simulations. Using the MEMS switch models, a dual-band low-noise amplifier (LNA) operating at GHz and GHz, and a tunable power amplifier (PA) at GHz are simulated in m CMOS. MEMS switches allow the LNA to operate with 11 dB of isolation between the two bands while maintaining dB of gain and sub- dB no...

Modelling of a biologically inspired robotic fish driven by compliant parts

International Nuclear Information System (INIS)

Daou, Hadi El; Salumäe, Taavi; Kruusmaa, Maarja; Chambers, Lily D; Megill, William M

2014-01-01

Inspired by biological swimmers such as fish, a robot composed of a rigid head, a compliant body and a rigid caudal fin was built. It has the geometrical properties of a subcarangiform swimmer of the same size. The head houses a servo-motor which actuates the compliant body and the caudal fin. It achieves this by applying a concentrated moment on a point near the compliant body base. In this paper, the dynamics of the compliant body driving the robotic fish is modelled and experimentally validated. Lighthill’s elongated body theory is used to define the hydrodynamic forces on the compliant part and Rayleigh proportional damping is used to model damping. Based on the assumed modes method, an energetic approach is used to write the equations of motion of the compliant body and to compute the relationship between the applied moment and the resulting lateral deflections. Experiments on the compliant body were carried out to validate the model predictions. The results showed that a good match was achieved between the measured and predicted deformations. A discussion of the swimming motions between the real fish and the robot is presented. (paper)

A MEMS-based, wireless, biometric-like security system

Science.gov (United States)

Cross, Joshua D.; Schneiter, John L.; Leiby, Grant A.; McCarter, Steven; Smith, Jeremiah; Budka, Thomas P.

2010-04-01

We present a system for secure identification applications that is based upon biometric-like MEMS chips. The MEMS chips have unique frequency signatures resulting from fabrication process variations. The MEMS chips possess something analogous to a "voiceprint". The chips are vacuum encapsulated, rugged, and suitable for low-cost, highvolume mass production. Furthermore, the fabrication process is fully integrated with standard CMOS fabrication methods. One is able to operate the MEMS-based identification system similarly to a conventional RFID system: the reader (essentially a custom network analyzer) detects the power reflected across a frequency spectrum from a MEMS chip in its vicinity. We demonstrate prototype "tags" - MEMS chips placed on a credit card-like substrate - to show how the system could be used in standard identification or authentication applications. We have integrated power scavenging to provide DC bias for the MEMS chips through the use of a 915 MHz source in the reader and a RF-DC conversion circuit on the tag. The system enables a high level of protection against typical RFID hacking attacks. There is no need for signal encryption, so back-end infrastructure is minimal. We believe this system would make a viable low-cost, high-security system for a variety of identification and authentication applications.

Micromachined Parts Advance Medicine, Astrophysics, and More

Science.gov (United States)

2015-01-01

In the mid-1990s, Marshall Space Flight Center awarded two SBIR contracts to Potomac Photonics, now based in Baltimore, for the development of computerized workstations capable of mass-producing tiny, intricate, diffractive optical elements. While the company has since discontinued the workstations, those contracts set the stage for Potomac Photonics to be a leader in the micromachining industry, where NASA remains one of its clients.

A review of vibration-based MEMS piezoelectric energy harvesters

Energy Technology Data Exchange (ETDEWEB)

Saadon, Salem; Sidek, Othman [Collaborative Microelectronic Design Excellence Center (CEDEC), School of Electrical and Electronic Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang (Malaysia)

2011-01-15

The simplicity associated with the piezoelectric micro-generators makes it very attractive for MEMS applications, especially for remote systems. In this paper we reviewed the work carried out by researchers during the last three years. The improvements in experimental results obtained in the vibration-based MEMS piezoelectric energy harvesters show very good scope for MEMS piezoelectric harvesters in the field of power MEMS in the near future. (author)

Identifying links between origami and compliant mechanisms

Directory of Open Access Journals (Sweden)

H. C. Greenberg

2011-12-01

Full Text Available Origami is the art of folding paper. In the context of engineering, orimimetics is the application of folding to solve problems. Kinetic origami behavior can be modeled with the pseudo-rigid-body model since the origami are compliant mechanisms. These compliant mechanisms, when having a flat initial state and motion emerging out of the fabrication plane, are classified as lamina emergent mechanisms (LEMs. To demonstrate the feasibility of identifying links between origami and compliant mechanism analysis and design methods, four flat folding paper mechanisms are presented with their corresponding kinematic and graph models. Principles from graph theory are used to abstract the mechanisms to show them as coupled, or inter-connected, mechanisms. It is anticipated that this work lays a foundation for exploring methods for LEM synthesis based on the analogy between flat-folding origami models and linkage assembly.

U.S. Department Of Energy's nuclear engineering education research: highlights of recent and current research-I. 6. Radioisotope Power Sources for MEMS Devices

International Nuclear Information System (INIS)

Blanchard, James P.

2001-01-01

Micro-electromechanical systems (MEMS) comprise a rapidly expanding research field with potential applications varying from sensors in airbags to more recent optical applications. Depending on the application, these devices often require an onboard power source for remote operation, especially in cases requiring operation for an extended period of time. Previously suggested power sources include fossil fuels and solar energy, but nuclear power sources may provide significant advantages for certain applications. Hence, the objective of this study is to establish the viability of using radioisotopes to power realistic MEMS devices. Four methods of incorporating radioactive material into the MEMS devices have been studied. These are (a) use of an external, solid source; (b) use of a liquid source; (c) plating of the source into a prefabricated device; and (d) incorporation of microspheres containing tritium. In approach (c), electro-less plating is used to deposit 63 Ni into an MEMS device. A standard recipe for electro-less plating of nickel is used. In approach (d), we obtained glass microspheres that contain 6 Li and irradiated them in the University of Wisconsin Nuclear Reactor to produce tritium. Using this procedure, we can produce activities of up to 12.8 mCi/g for each hour of irradiation. Our first battery incorporates a liquid 63 Ni source into a micro-machined pn-junction battery. The initial design has 13 micro-machined channels in a silicon substrate. The channels are employed to hold the liquid source and to increase the surface area, which is important because the current generated by the battery is proportional to the junction area. To measure the performance of our three-dimensional pn-junction in the presence of a radioactive source, we placed 8 μl (64 μCi) of liquid source inside the channels and then covered it with a black box to shield it from the light. Figure 1 displays the I-V curves for this battery measured at 30 min, 2 h, and 16 h after

System-Level Modelling and Simulation of MEMS-Based Sensors

DEFF Research Database (Denmark)

Virk, Kashif M.; Madsen, Jan; Shafique, Mohammad

2005-01-01

The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration with the......The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration...... with the existing embedded system design methodologies is possible. In this paper, we present a MEMS design methodology that uses VHDL-AMS based system-level model of a MEMS device as a starting point and combines the top-down and bottom-up design approaches for design, verification, and optimization...

DNA origami compliant nanostructures with tunable mechanical properties.

Science.gov (United States)

Zhou, Lifeng; Marras, Alexander E; Su, Hai-Jun; Castro, Carlos E

2014-01-28

DNA origami enables fabrication of precise nanostructures by programming the self-assembly of DNA. While this approach has been used to make a variety of complex 2D and 3D objects, the mechanical functionality of these structures is limited due to their rigid nature. We explore the fabrication of deformable, or compliant, objects to establish a framework for mechanically functional nanostructures. This compliant design approach is used in macroscopic engineering to make devices including sensors, actuators, and robots. We build compliant nanostructures by utilizing the entropic elasticity of single-stranded DNA (ssDNA) to locally bend bundles of double-stranded DNA into bent geometries whose curvature and mechanical properties can be tuned by controlling the length of ssDNA strands. We demonstrate an ability to achieve a wide range of geometries by adjusting a few strands in the nanostructure design. We further developed a mechanical model to predict both geometry and mechanical properties of our compliant nanostructures that agrees well with experiments. Our results provide a basis for the design of mechanically functional DNA origami devices and materials.

Development of a focused ion beam micromachining system

Energy Technology Data Exchange (ETDEWEB)

Pellerin, J.G.; Griffis, D.; Russell, P.E.

1988-12-01

Focused ion beams are currently being investigated for many submicron fabrication and analytical purposes. An FIB micromachining system consisting of a UHV vacuum system, a liquid metal ion gun, and a control and data acquisition computer has been constructed. This system is being used to develop nanofabrication and nanomachining techniques involving focused ion beams and scanning tunneling microscopes.

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

Science.gov (United States)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

Condensation of sodium on a micromachined surface for AMTEC

International Nuclear Information System (INIS)

Crowley, C.J.; Izenson, M.G.

1993-01-01

A novel condenser component is being developed to enable Alkali Metal Thermal to Electric Conversion (AMTEC) technology to achieve two critical goals: (1) optimization of conversion efficiency and (2) microgravity fluid management. The first goal is achieved by minimizing parasitic radiation heat transfer losses for condensers with a large view factor to the high-temperature β double-prime-alumina surface. The condenser geometry includes a specially designed, micromachined surface where large capillary forces are used to manage the fluid distribution to accomplish the second goal. We present and discuss the results of separate effects experiments investigating the wetting and condensation behavior of sodium on this capillary surface. Test results show that the micromachined surface maintains a smooth, high reflective film of liquid sodium on the surface, which implies reduced parasitic losses and increased conversion efficiencies in AMTEC cells. Accomplishing this in an adverse gravity gradient demonstrates the potential for management of the fluid even under spacecraft acceleration conditions

Compliant flooring for fall injury prevention in long-term care

OpenAIRE

Lachance, Chantelle

2017-01-01

A promising strategy for reducing the incidence and severity of fall-related injuries in long-term care (LTC) is to decrease the ground surface stiffness, and the subsequent forces applied to the body parts at impact, through installation of compliant flooring. Evidence about the feasibility of compliant flooring in LTC is extremely limited. My PhD research addresses this gap by conducting a comprehensive, multimethod evaluation of compliant flooring. Specifically, I investigate the feasibili...

Micromachined two dimensional resistor arrays for determination of gas parameters

NARCIS (Netherlands)

van Baar, J.J.J.; Verwey, Willem B.; Dijkstra, Mindert; Dijkstra, Marcel; Wiegerink, Remco J.; Lammerink, Theodorus S.J.; Krijnen, Gijsbertus J.M.; Elwenspoek, Michael Curt

A resistive sensor array is presented for two dimensional temperature distribution measurements in a micromachined flow channel. This allows simultaneous measurement of flow velocity and fluid parameters, like thermal conductivity, diffusion coefficient and viscosity. More general advantages of

MEMS-Based Waste Vibrational Energy Harvesters

Science.gov (United States)

2013-06-01

MEMS energy- harvesting device. Although PZT is used more prevalently due to its higher piezoelectric coefficient and dielectric constant, AlN has...7 1. Lead Zirconium Titanate ( PZT ) .........................................................7 2. Aluminum...Laboratory PiezoMUMPS Piezoelectric Multi-User MEMS Processes PZT Lead Zirconate Titanate SEM Scanning Electron Microscopy SiO2 Silicon

Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

Directory of Open Access Journals (Sweden)

Di Chen

2007-05-01

Full Text Available Electrostatic micro-electro-mechanical system (MEMS is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.

Modelling of micromachining of human tooth enamel by erbium laser radiation

Energy Technology Data Exchange (ETDEWEB)

Belikov, A V; Skrypnik, A V; Shatilova, K V [St. Petersburg National Research University of Information Technologies, Mechanics and Optics, St. Petersburg (Russian Federation)

2014-08-31

We consider a 3D cellular model of human tooth enamel and a photomechanical cellular model of enamel ablation by erbium laser radiation, taking into account the structural peculiarities of enamel, energy distribution in the laser beam cross section and attenuation of laser energy in biological tissue. The surface area of the texture in enamel is calculated after its micromachining by erbium laser radiation. The influence of the surface area on the bond strength of enamel with dental filling materials is discussed. A good correlation between the computer simulation of the total work of adhesion and experimentally measured bond strength between the dental filling material and the tooth enamel after its micromachining by means of YAG : Er laser radiation is attained. (laser biophotonics)

Modelling of micromachining of human tooth enamel by erbium laser radiation

International Nuclear Information System (INIS)

Belikov, A V; Skrypnik, A V; Shatilova, K V

2014-01-01

We consider a 3D cellular model of human tooth enamel and a photomechanical cellular model of enamel ablation by erbium laser radiation, taking into account the structural peculiarities of enamel, energy distribution in the laser beam cross section and attenuation of laser energy in biological tissue. The surface area of the texture in enamel is calculated after its micromachining by erbium laser radiation. The influence of the surface area on the bond strength of enamel with dental filling materials is discussed. A good correlation between the computer simulation of the total work of adhesion and experimentally measured bond strength between the dental filling material and the tooth enamel after its micromachining by means of YAG : Er laser radiation is attained. (laser biophotonics)

Surface-micromachined rotatable member having a low-contact-area hub

Science.gov (United States)

Rodgers, M. Steven; Sniegowski, Jeffry J.; Krygowski, Thomas W.

2003-11-18

A surface-micromachined rotatable member formed on a substrate and a method for manufacturing thereof are disclosed. The surface-micromachined rotatable member, which can be a gear or a rotary stage, has a central hub, and an annulus connected to the central hub by an overarching bridge. The hub includes a stationary axle support attached to the substrate and surrounding an axle. The axle is retained within the axle support with an air-gap spacing therebetween of generally 0.3 .mu.m or less. The rotatable member can be formed by alternately depositing and patterning layers of a semiconductor (e.g. polysilicon or a silicon-germanium alloy) and a sacrificial material and then removing the sacrificial material, at least in part. The present invention has applications for forming micromechanical or microelectromechanical devices requiring lower actuation forces, and providing improved reliability.

Surface--micromachined rotatable member having a low-contact-area hub

Science.gov (United States)

Rodgers, M. Steven; Sniegowski, Jeffry J.

2002-01-01

A surface-micromachined rotatable member formed on a substrate and a method for manufacturing thereof are disclosed. The surface-micromachined rotatable member, which can be a gear or a rotary stage, has a central hub, and an annulus connected to the central hub by an overarching bridge. The hub includes a stationary axle support attached to the substrate and surrounding an axle. The axle is retained within the axle support with an air-gap spacing therebetween of generally 0.3 .mu.m or less. The rotatable member can be formed by alternately depositing and patterning layers of a semiconductor (e.g. polysilicon or a silicon-germanium alloy) and a sacrificial material and then removing the sacrificial material, at least in part. The present invention has applications for forming micromechanical or microelectromechanical devices requiring lower actuation forces, and providing improved reliability.

Micromachined ultrasonic droplet generator based on a liquid horn structure

Science.gov (United States)

Meacham, J. M.; Ejimofor, C.; Kumar, S.; Degertekin, F. L.; Fedorov, A. G.

2004-05-01

A micromachined ultrasonic droplet generator is developed and demonstrated for drop-on-demand fluid atomization. The droplet generator comprises a bulk ceramic piezoelectric transducer for ultrasound generation, a reservoir for the ejection fluid, and a silicon micromachined liquid horn structure as the nozzle. The nozzles are formed using a simple batch microfabrication process that involves wet etching of (100) silicon in potassium hydroxide solution. Device operation is demonstrated by droplet ejection of water through 30 μm orifices at 1.49 and 2.30 MHz. The finite-element simulations of the acoustic fields in the cavity and electrical impedance of the device are in agreement with the measurements and indicate that the device utilizes cavity resonances in the 1-5 MHz range in conjunction with acoustic wave focusing by the pyramidally shaped nozzles to achieve low power operation.

Femtosecond laser micro-machined polyimide films for cell scaffold applications

DEFF Research Database (Denmark)

Antanavičiute, Ieva; Šimatonis, Linas; Ulčinas, Orestas

2018-01-01

of commercially available 12.7 and 25.4μm thickness polyimide (PI) film was applied. Mechanical properties of the fabricated scaffolds, i.e. arrays of differently spaced holes, were examined via custom-built uniaxial micro-tensile testing and finite element method simulations. We demonstrate that experimental...... micro-tensile testing results could be numerically simulated and explained by two-material model, assuming that 2-6μm width rings around the holes possessed up to five times higher Young's modulus and yield stress compared with the rest of the laser intacted PI film areas of 'dog-bone'-shaped specimens......Engineering of sophisticated synthetic 3D scaffolds that allow controlling behaviour and location of the cells requires advanced micro/nano-fabrication techniques. Ultrafast laser micro-machining employing a 1030-nm wavelength Yb:KGW femtosecond laser and a micro-fabrication workstation for micro-machining...

An in-pipe mobile micromachine using fluid power. A mechanism adaptable to pipe diameters

International Nuclear Information System (INIS)

Yoshida, Kazuhiro; Yokota, Shinichi; Takahashi, Ken

2000-01-01

To realize micro maintenance robots for small diameter pipes of nuclear reactors and so on, high power in-pipe mobile micromachines have been required. The authors have proposed the bellows microactuator using fluid power and have tried to apply the actuators to in-pipe mobile micromachines. In the previous papers, some inchworm mobile machine prototypes with 25 mm in diameter are fabricated and the traveling performances are experimentally investigated. In this paper, to miniaturize the in-pipe mobile machine and to make it adaptable to pipe diameters, firstly, a simple rubber-tube actuator constrained with a coil-spring is proposed and the static characteristics are investigated. Secondly, a supporting mechanism which utilizes a toggle mechanism and is adaptable to pipe diameters is proposed and the supporting forces are investigated. Finally, an in-pipe mobile micromachine for pipe with 4 - 5 mm in diameter is fabricated and the maximum traveling velocity of 7 mm/s in both ahead and astern movements is experimentally verified. (author)

Advantages of PZT thick film for MEMS sensors

DEFF Research Database (Denmark)

Hindrichsen, Christian Carstensen; Lou-Moller, R.; Hansen, K.

2010-01-01

For all MEMS devices a high coupling between the mechanical and electrical domain is desired. Figures of merit describing the coupling are important for comparing different piezoelectric materials. The existing figures of merit are discussed and a new figure of merit is introduced for a fair comp....... Improved figure of merit is reached in the piezoelectric PZT thick film, TF2100CIP, by using cold isostatic pressure in the PZT preparation process. The porosity of TF2100 is decreased 38%, hence, allowing an increase of charge sensitivity for MEMS sensors of 59%....... thin film and PZT thick film. It is shown that MEMS sensors with the PZT thick film TF2100 from InSensor A/S have potential for significant higher voltage sensitivities compared to PZT thin film base MEMS sensors when the total thickness of the MEMS cantilever, beam, bridge or membrane is high...

Standard semiconductor packaging for high-reliability low-cost MEMS applications

Science.gov (United States)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Investigating ESD sensitivity in electrostatic SiGe MEMS

International Nuclear Information System (INIS)

Sangameswaran, Sandeep; De Coster, Jeroen; Linten, Dimitri; Scholz, Mirko; Thijs, Steven; Groeseneken, Guido; De Wolf, Ingrid

2010-01-01

The sensitivity of electrostatically actuated SiGe microelectromechanical systems to electrostatic discharge events has been investigated in this paper. Torsional micromirrors and RF microelectromechanical systems (MEMS) actuators have been used as two case studies to perform this study. On-wafer electrostatic discharge (ESD) measurement methods, such as the human body model (HBM) and machine model (MM), are discussed. The impact of HBM ESD zap tests on the functionality and behavior of MEMS is explained and the ESD failure levels of MEMS have been verified by failure analysis. It is demonstrated that electrostatic MEMS devices have a high sensitivity to ESD and that it is essential to protect them.

Digital reflection holography based systems development for MEMS testing

Science.gov (United States)

Singh, Vijay Raj; Liansheng, Sui; Asundi, Anand

2010-05-01

MEMS are tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers and nanometers. Testing of MEMS device is an important part in carrying out their functional assessment and reliability analysis. Development of systems based on digital holography (DH) for MEMS inspection and characterization is presented in this paper. Two DH reflection systems, table-top and handheld types, are developed depending on the MEMS measurement requirements and their capabilities are presented. The methodologies for the systems are developed for 3D profile inspection and static & dynamic measurements, which is further integrated with in-house developed software that provides the measurement results in near real time. The applications of the developed systems are demonstrated for different MEMS devices for 3D profile inspection, static deformation/deflection measurements and vibration analysis. The developed systems are well suitable for the testing of MEMS and Microsystems samples, with full-field, static & dynamic inspection as well as to monitor micro-fabrication process.

A novel piezoresistive polymer nanocomposite MEMS accelerometer

International Nuclear Information System (INIS)

Seena, V; Hari, K; Prajakta, S; Ramgopal Rao, V; Pratap, Rudra

2017-01-01

A novel polymer MEMS (micro electro mechanical systems) accelerometer with photo-patternable polymer nanocomposite as a piezoresistor is presented in this work. Polymer MEMS Accelerometer with beam thicknesses of 3.3 µ m and embedded nanocomposite piezoresistive layer having a gauge factor of 90 were fabricated. The photosensitive nanocomposite samples were prepared and characterized for analyzing the mechanical and electrical properties and thereby ensuring proper process parameters for incorporating the piezoresistive layer into the polymer MEMS accelerometer. The microfabrication process flow and unit processes followed are extremely low cost with process temperatures below 100 °C. This also opens up a new possibility for easy integration of such polymer MEMS with CMOS (complementary metal oxide semiconductor) devices and circuits. The fabricated devices were characterized using laser Doppler vibrometer (LDV) and the devices exhibited a resonant frequency of 10.8 kHz and a response sensitivity of 280 nm g −1 at resonance. The main focus of this paper is on the SU-8/CB nanocomposite piezoresistive MEMS accelerometer technology development which covers the material and the fabrication aspects of these devices. CoventorWare FEA analysis performed using the extracted material properties from the experimental characterization which are in close agreement to performance parameters of the fabricated devices is also discussed. The simulated piezoresistive polymer MEMS devices showed an acceleration sensitivity of 126 nm g −1 and 82 ppm of Δ R / R per 1 g of acceleration. (paper)

Poly-SiGe for MEMS-above-CMOS sensors

CERN Document Server

Gonzalez Ruiz, Pilar; Witvrouw, Ann

2014-01-01

Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence o...

High Volume Manufacturing and Field Stability of MEMS Products

Science.gov (United States)

Martin, Jack

Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are

Topology optimization of compliant adaptive wing leading edge with composite materials

Directory of Open Access Journals (Sweden)

Tong Xinxing

2014-12-01

Full Text Available An approach for designing the compliant adaptive wing leading edge with composite material is proposed based on the topology optimization. Firstly, an equivalent constitutive relationship of laminated glass fiber reinforced epoxy composite plates has been built based on the symmetric laminated plate theory. Then, an optimization objective function of compliant adaptive wing leading edge was used to minimize the least square error (LSE between deformed curve and desired aerodynamics shape. After that, the topology structures of wing leading edge of different glass fiber ply-orientations were obtained by using the solid isotropic material with penalization (SIMP model and sensitivity filtering technique. The desired aerodynamics shape of compliant adaptive wing leading edge was obtained based on the proposed approach. The topology structures of wing leading edge depend on the glass fiber ply-orientation. Finally, the corresponding morphing experiment of compliant wing leading edge with composite materials was implemented, which verified the morphing capability of topology structure and illustrated the feasibility for designing compliant wing leading edge. The present paper lays the basis of ply-orientation optimization for compliant adaptive wing leading edge in unmanned aerial vehicle (UAV field.

Compliant Glass Seals for SOFC Stacks

Energy Technology Data Exchange (ETDEWEB)

Chou, Yeong -Shyung [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Choi, Jung-Pyung [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Xu, Wei [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Stephens, Elizabeth V. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Koeppel, Brian J. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Stevenson, Jeffry W. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Lara-Curzio, Edgar [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

2014-04-30

This report summarizes results from experimental and modeling studies performed by participants in the Solid-State Energy Conversion Alliance (SECA) Core Technology Program, which indicate that compliant glass-based seals offer a number of potential advantages over conventional seals based on de-vitrifying glasses, including reduced stresses during stack operation and thermal cycling, and the ability to heal micro-damage induced during thermal cycling. The properties and composition of glasses developed and/or investigated in these studies are reported, along with results from long-term (up to 5,800h) evaluations of seals based on a compliant glass containing ceramic particles or ceramic fibers.

Characterization and modeling of 2D-glass micro-machining by spark-assisted chemical engraving (SACE) with constant velocity

International Nuclear Information System (INIS)

Didar, Tohid Fatanat; Dolatabadi, Ali; Wüthrich, Rolf

2008-01-01

Spark-assisted chemical engraving (SACE) is an unconventional micro-machining technology based on electrochemical discharge used for micro-machining nonconductive materials. SACE 2D micro-machining with constant speed was used to machine micro-channels in glass. Parameters affecting the quality and geometry of the micro-channels machined by SACE technology with constant velocity were presented and the effect of each of the parameters was assessed. The effect of chemical etching on the geometry of micro-channels under different machining conditions has been studied, and a model is proposed for characterization of the micro-channels as a function of machining voltage and applied speed

High-frequency micro-machined power inductors

International Nuclear Information System (INIS)

Wang, N.; O'Donnell, T.; Roy, S.; Brunet, M.; McCloskey, P.; O'Mathuna, S.C.

2005-01-01

Power inductors have been fabricated on silicon substrates using low-temperature IC compatible processes. The electrical properties of these micro-inductors have been measured and discussed. A maximum quality factor of 6 at 4 MHz has been achieved with an inductance value of about 160 nH. The DC saturation currents of the non-gapped and gapped inductors are ∼500 and 700 mA, respectively. The relatively high Q factor and the load current characteristics allow these micro-machined inductors to be used in integrated power converters

Monitoring of yeast cell concentration using a micromachined impedance sensor

NARCIS (Netherlands)

Krommenhoek, E.E.; Gardeniers, Johannes G.E.; Bomer, Johan G.; van den Berg, Albert; Li, X.; Ottens, M.; van der Wielen, L.A.M.; van Dedem, G.W.K.; van Leeuwen, M.; van Gulik, W.M.; Heijnen, J.J.

2005-01-01

The paper describes the design, modelling and experimental characterization of a micromachined impedance sensor for on-line monitoring of the viable yeast cell concentration (biomass) in a miniaturized cell assay. Measurements in a Saccharomyces cerevisiae cell culture show that the permittivity of

On the design of compliant mechanisms using topology optimization

DEFF Research Database (Denmark)

Sigmund, Ole

1997-01-01

This paper presents a method for optimal design of compliant mechanism topologies. The method is based on continuum-type topology optimization techniques and finds the optimal compliant mechanism topology within a given design domain and a given position and direction of input and output forces....... By constraining the allowed displacement at the input port, it is possible to control the maximum stress level in the compliant mechanism. The ability of the design method to find a mechanism with complex output behavior is demonstrated by several examples. Some of the optimal mechanism topologies have been...... manufactured, both in macroscale (hand-size) made in Nylon, and in microscale (

Laser micromachining of biofactory-on-a-chip devices

Science.gov (United States)

Burt, Julian P.; Goater, Andrew D.; Hayden, Christopher J.; Tame, John A.

2002-06-01

Excimer laser micromachining provides a flexible means for the manufacture and rapid prototyping of miniaturized systems such as Biofactory-on-a-Chip devices. Biofactories are miniaturized diagnostic devices capable of characterizing, manipulating, separating and sorting suspension of particles such as biological cells. Such systems operate by exploiting the electrical properties of microparticles and controlling particle movement in AC non- uniform stationary and moving electric fields. Applications of Biofactory devices are diverse and include, among others, the healthcare, pharmaceutical, chemical processing, environmental monitoring and food diagnostic markets. To achieve such characterization and separation, Biofactory devices employ laboratory-on-a-chip type components such as complex multilayer microelectrode arrays, microfluidic channels, manifold systems and on-chip detection systems. Here we discuss the manufacturing requirements of Biofactory devices and describe the use of different excimer laser micromachined methods both in stand-alone processes and also in conjunction with conventional fabrication processes such as photolithography and thermal molding. Particular attention is given to the production of large area multilayer microelectrode arrays and the manufacture of complex cross-section microfluidic channel systems for use in simple distribution and device interfacing.

MEMS tunable grating micro-spectrometer

Science.gov (United States)

Tormen, Maurizio; Lockhart, R.; Niedermann, P.; Overstolz, T.; Hoogerwerf, A.; Mayor, J.-M.; Pierer, J.; Bosshard, C.; Ischer, R.; Voirin, G.; Stanley, R. P.

2017-11-01

The interest in MEMS based Micro-Spectrometers is increasing due to their potential in terms of flexibility as well as cost, low mass, small volume and power savings. This interest, especially in the Near-Infrared and Mid- Infrared, ranges from planetary exploration missions to astronomy, e.g. the search for extra solar planets, as well as to many other terrestrial fields of application such as, industrial quality and surface control, chemical analysis of soil and water, detection of chemical pollutants, exhausted gas analysis, food quality control, process control in pharmaceuticals, to name a few. A compact MEMS-based Spectrometer for Near- Infrared and Mid-InfraRed operation have been conceived, designed and demonstrated. The design based on tunable MEMS blazed grating, developed in the past at CSEM [1], achieves state of the art results in terms of spectral resolution, operational wavelength range, light throughput, overall dimensions, and power consumption.

Micro-Electromechanical-Systems (MEMS) technologies for aerospace applications in Canada

International Nuclear Information System (INIS)

Pimprikar, M.

2001-01-01

During the last decade, research and development of Micro-Electro-Mechanical Systems (MEMS) have shown significant promise for a variety of aerospace applications. The advantages of drastic size and weight reduction of MEMS enables consideration of developing low-cost, high-performance, ultra-portable, MEMS-based devices and systems for aircraft, space and defense requirements. 'Microelectromechanical Systems, or MEMS', are integrated microdevices or systems combining electrical and mechanical components, fabricated using integrated circuit compatible batch-processing techniques, and varying in size from micrometers to millimeters. In the 1990's, MEMS were used as laboratory curiosities with very low power, short lifetimes and few concrete applications. One decade later, MEMS have taken major roles in several industries, the total world market is expected to grow from $14 billion to over $40 billion by the year 2002. A typical device contains micromechanical structures that move by flexing (membranes, cantilevers, springs) and MEMS/MOEMS level where the integration of microelectronics, micromechanics and optics form a complete system (sensor, actuator, photonic device). (author)

Micromachined millimeter-wave photonic band-gap crystals

International Nuclear Information System (INIS)

Oezbay, E.; Michel, E.; Tuttle, G.; Biswas, R.; Sigalas, M.; Ho, K.

1994-01-01

We have developed a new technique for fabricating three-dimensional photonic band-gap crystals. Our method utilizes an orderly stacking of micromachined (110) silicon wafers to build the periodic structure. A structure with a full three-dimensional photonic band gap centered near 100 GHz was measured, with experimental results in good agreement with theoretical predictions. This basic approach described should be extendable to build structures with photonic band-gap frequencies ranging from 30 GHz to 3 THz

Topology optimum design of compliant mechanisms using modified ant colony optimization

Energy Technology Data Exchange (ETDEWEB)

Yoo, Kwang Seon; Han, Seog Young [Hanyang University, Seoul (Korea, Republic of)

2015-08-15

A Modified ant colony optimization (MACO) algorithm was suggested for topology optimal design of compliant mechanisms since standard ACO cannot provide an appropriate optimal topology. In order to improve computational efficiency and suitability of standard ACO algorithm in topology optimization for compliant mechanisms, a continuous variable, called the 'Element contribution significance (ECS),'is employed, which serves to replace the positions of ants in the standard ACO algorithm, and assess the importance of each element in the optimization process. MACO algorithm was applied to topology optimizations of both linear and geometrically nonlinear compliant mechanisms using three kinds of objective functions, and optimized topologies were compared each other. From the comparisons, it was concluded that MACO algorithm can effectively be applied to topology optimizations of linear and geometrically nonlinear compliant mechanisms, and the ratio of Mutual potential energy (MPE) to Strain energy (SE) type of objective function is the best for topology optimal design of compliant mechanisms.

Fiscal 1997 report on technological results. R and D on micromachine technology; 1997 nendo micromachine gijutsu no kenkyu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

1998-03-01

Researches on basic element technology of micromachines are conducted that operate autonomously in a narrow small part in a complicated apparatus or in vivo. The areas of activity are 1. research on micromachine systems and 2. comprehensive investigation and research. In 1, (1) a micro catheter and (2) a micro tactile sensor catheter were studied while, in 2, basic technology and technological problems, particularly those problems concerning sophistication in the medical field were examined and studied. Further, in (1), with the purpose of developing a micro laser catheter for diagnosis/treatment, researches were implemented on the technology of integrating micro laser and an optical fiber which were components of the catheter and on the fabrication of the fine diameter of a micro catheter as well as on the characteristical improvement of the base body on which minute elements were mounted. In (2), characteristical improvement and sophistication were carried out for a high sensitivity contact pressure sensor and a diagnostic tactile sensor, which are mounted on a catheter having a positive bulge control mechanism for insertion into body cavity, with a sensor probe manufactured experimentally. (NEDO)

Evolution of a MEMS Photoacoustic Chemical Sensor

National Research Council Canada - National Science Library

Pellegrino, Paul M; Polcawich, Ronald G

2003-01-01

.... Initial MEMS work is centered on fabrication of a lead zirconate titanate (PZT) microphone subsystem to be incorporated in the full photoacoustic device. Preliminary results were very positive for the macro-photoacoustic cell, PZT membrane microphones design / fabrication and elementary monolithic MEMS photoacoustic cavity.

Wavelength tunable MEMS VCSELs for OCT imaging

DEFF Research Database (Denmark)

Sahoo, Hitesh Kumar; Ansbæk, Thor; Ottaviano, Luisa

2018-01-01

MEMS VCSELs are one of the most promising swept source (SS) lasers for optical coherence tomography (OCT) and one of the best candidates for future integration with endoscopes, surgical probes and achieving an integrated OCT system. However, the current MEMS-based SS are processed on the III...

Construction and Initial Validation of the Multiracial Experiences Measure (MEM)

Science.gov (United States)

Yoo, Hyung Chol; Jackson, Kelly; Guevarra, Rudy P.; Miller, Matthew J.; Harrington, Blair

2015-01-01

This article describes the development and validation of the Multiracial Experiences Measure (MEM): a new measure that assesses uniquely racialized risks and resiliencies experienced by individuals of mixed racial heritage. Across two studies, there was evidence for the validation of the 25-item MEM with 5 subscales including Shifting Expressions, Perceived Racial Ambiguity, Creating Third Space, Multicultural Engagement, and Multiracial Discrimination. The 5-subscale structure of the MEM was supported by a combination of exploratory and confirmatory factor analyses. Evidence of criterion-related validity was partially supported with MEM subscales correlating with measures of racial diversity in one’s social network, color-blind racial attitude, psychological distress, and identity conflict. Evidence of discriminant validity was supported with MEM subscales not correlating with impression management. Implications for future research and suggestions for utilization of the MEM in clinical practice with multiracial adults are discussed. PMID:26460977

Advanced MEMS systems for optical communication and imaging

International Nuclear Information System (INIS)

Horenstein, M N; Sumner, R; Freedman, D S; Datta, M; Kani, N; Miller, P; Stewart, J B; Cornelissen, S

2011-01-01

Optical communication and adaptive optics have emerged as two important uses of micro-electromechanical (MEMS) devices based on electrostatic actuation. Each application uses a mirror whose surface is altered by applying voltages of up to 300 V. Previous generations of adaptive-optic mirrors were large (∼1 m) and required the use of piezoelectric transducers. Beginning in the mid-1990s, a new class of small MEMS mirrors (∼1 cm) were developed. These mirrors are now a commercially available, mature technology. This paper describes three advanced applications of MEMS mirrors. The first is a mirror used for corona-graphic imaging, whereby an interferometric telescope blocks the direct light from a distant star so that nearby objects such as planets can be seen. We have developed a key component of the system: a 144-channel, fully-scalable, high-voltage multiplexer that reduces power consumption to only a few hundred milliwatts. In a second application, a MEMS mirror comprises part of a two-way optical communication system in which only one node emits a laser beam. The other node is passive, incorporating a retro-reflective, electrostatic MEMS mirror that digitally encodes the reflected beam. In a third application, the short (∼100-ns) pulses of a commercially-available laser rangefinder are returned by the MEMS mirror as a digital data stream. Suitable low-power drive systems comprise part of the system design.

The micromachined logo of Atomki

International Nuclear Information System (INIS)

Rajta, I.; Szilasi, S.Z.

2006-01-01

Complete text of publication follows. Proton Beam Micromachining, also known as P-beam Writing, is a direct write 3- dimensional lithographic technique. Conventional resist types are PMMA (polymethylmethacrylate), and SU-8 (of MicroChem Corp.); they are positive and negative resists, respectively. In this work we used SU-8, the most common negative resist material. SU-8 was spun on a flat surface, typically Silicon or glass. A direct write proton beam was scanned over an arbitary structure (the Atomki logo can be replaced by any other structure), which produces chain scissioning in the polymer. Post exposure bake (PEB) is usually needed in case of conventional optical lithography, but using protons this bake is done in situ as the ions heat up the sample in vacuum. Subsequently chemical etching takes place, the solvent is available at MicroChem Corp. The schematic diagram of the above described micromachining process is shown on Fig. 1. The irradiation requires a scanning proton microbeam system equipped with suitable beam scanning and blanking facilities. This is available in the Institute, our setup has been upgraded from doublet to triplet focusing system (Oxford Microbeams Ltd.). For scanning we use a DIO card (PCI-6731 of National Instruments), and the IonScan software [1]. Sample preparation was carried out at our 'semi clean' room. This is also where chemical development of the samples and the optical microscopy have been done too. A Zeiss Axio Imager microscope is available (equipped with 5 objective lenses, 4 different contrast methods, transmitted or reflected light illumination). Fig. 2. shows a typical example of the Atomki logo. This is a bright field image, a number of different nice and colourful images can be produced with the other contrast techniques (for more images see the Institute website: http://www.atomki.hu/ ). (author)

Recent Progress in Silicon Mems Oscillators

Science.gov (United States)

2008-12-01

MEMS oscillator. As shown, a MEMS resonator is connected to an IC. The reference oscillator, which is basically a transimpedance amplifier ...small size), and (3) DC bias voltage required to operate the resonators. As a result, instead of Colpitts or Pierce architecture, a transimpedence ... amplifier is typically used for sustain the oscillation. The frequency of the resonators is determined by both material properties and geometry of

Nanometer range closed-loop control of a stepper micro-motor for data storage

NARCIS (Netherlands)

Patrascu, M.; Stramigioli, Stefano; de Boer, Meint J.; Krijnen, Gijsbertus J.M.

2007-01-01

We present a nanometer range, closed-loop control study for MEMS stepper actuators. Although generically applicable to other types of stepper motors, the control design presented here was particularly intended for one dimensional shuffle actuators fabricated by surface micromachining technology. The

MEMS mass-spring-damper systems using an out-of-plane suspension scheme

KAUST Repository

Abdel Aziz, Ahmed Kamal Said; Sharaf, Abdel Hameed; Serry, Mohamed Yousef; Sedky, Sherif Salah

2014-01-01

MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

MEMS mass-spring-damper systems using an out-of-plane suspension scheme

KAUST Repository

Abdel Aziz, Ahmed Kamal Said

2014-02-04

MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

Optofluidic Microlasers based on Femtosecond Micromachining Technology

Directory of Open Access Journals (Sweden)

Simoni F.

2017-08-01

Full Text Available We present the different optofluidic lasers which have been realized using the Femtosecond Micromachining technique to fabricate the monolithic optofluidic structures in glass chips. We show how the great flexibility of this 3D technique allows getting different kind of optical cavities. The most recent devices fabricated by this technique as ring shaped and Fabry-Perot resonators show excellent emission performances.We also point out how the addition of the inkjet printing technique provides further opportunities in realizing optofluidic chips.

New dynamic silicon photonic components enabled by MEMS technology

Science.gov (United States)

Errando-Herranz, Carlos; Edinger, Pierre; Colangelo, Marco; Björk, Joel; Ahmed, Samy; Stemme, Göran; Niklaus, Frank; Gylfason, Kristinn B.

2018-02-01

Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.

Power Management of MEMS-Based Storage Devices for Mobile Systems

NARCIS (Netherlands)

Khatib, M.G.; Hartel, Pieter H.

2008-01-01

Because of its small form factor, high capacity, and expected low cost, MEMS-based storage is a suitable storage technology for mobile systems. MEMS-based storage devices should also be energy efficient for deployment in mobile systems. The problem is that MEMS-based storage devices are mechanical,

RF MEMS

Indian Academy of Sciences (India)

At the bare die level the insertion loss, return loss and the isolation ... ing and packaging of a silicon on glass based RF MEMS switch fabricated using DRIE. ..... follows the power law based on the asperity deformation model given by Pattona & ... Surface mount style RF packages (SMX series 580465) from Startedge Corp.

Nano- and micro-electromechanical systems fundamentals of nano- and microengineering

CERN Document Server

Lyshevski, Sergey Edward

2005-01-01

NANOTECHNOLOGY AND MICROTECHNOLOGY (NANO- AND MICRO- SCIENCE, ENGINEERING AND TECHNOLOGY), AND BEYOND Introduction and Overview: From Micro- to Nano- and Beyond to Stringo-Scale Introductory Definitions to the Subjects Current Developments and Needs for Coherent Revolutionary Developments Societal Challenges and Implications NANO- AND MICROSCALE SYSTEMS, DEVICES, AND STRUCTURES Sizing Features: From Micro- to Nano-, and from Nano- to Stringo-Scale MEMS and NEMS Definitions Introduction to Taxonomy of Nano- and Microsystem Synthesis and Design Introduction to Design and Optimization of Nano- and Microsystems in the Behavioral Domain NANO- AND MICROSYSTEMS: CLASSIFICATION AND CONSIDERATION Biomimetics, Biological Analogies,and Design of NEMS and MEMS Micro- and Nanoelectromechanical Systems: Scaling Laws and Mathematical Modeling MEMS Examples and MEMS Architectures Introduction to Microfabrication and Micromachining FUNDAMENTALS OF MICROFABRICATION AND MEMS FABRICATION TECHNOLOGIES Introducti...

Micro-electro-mechanical systems (MEMS: Technology for the 21st century

Directory of Open Access Journals (Sweden)

Đakov Tatjana A.

2014-01-01

Full Text Available Micro-electro-mechanical systems (MEMS are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

A level set methodology for predicting the effect of mask wear on surface evolution of features in abrasive jet micro-machining

International Nuclear Information System (INIS)

Burzynski, T; Papini, M

2012-01-01

A previous implementation of narrow-band level set methodology developed by the authors was extended to allow for the modelling of mask erosive wear in abrasive jet micro-machining (AJM). The model permits the prediction of the surface evolution of both the mask and the target simultaneously, by representing them as a hybrid and continuous mask–target surface. The model also accounts for the change in abrasive mass flux incident to both the target surface and, for the first time, the eroding mask edge, that is brought about by the presence of the mask edge itself. The predictions of the channel surface and eroded mask profiles were compared with measurements on channels machined in both glass and poly-methyl-methacrylate (PMMA) targets at both normal and oblique incidence, using tempered steel and elastomeric masks. A much better agreement between the predicted and measured profiles was found when mask wear was taken into account. Mask wear generally resulted in wider and deeper glass target profiles and wider PMMA target profiles, respectively, when compared to cases where no mask wear was present. This work has important implications for the AJM of complex MEMS and microfluidic devices that require longer machining times. (paper)

RF-MEMS capacitive switches with high reliability

Science.gov (United States)

Goldsmith, Charles L.; Auciello, Orlando H.; Carlisle, John A.; Sampath, Suresh; Sumant, Anirudha V.; Carpick, Robert W.; Hwang, James; Mancini, Derrick C.; Gudeman, Chris

2013-09-03

A reliable long life RF-MEMS capacitive switch is provided with a dielectric layer comprising a "fast discharge diamond dielectric layer" and enabling rapid switch recovery, dielectric layer charging and discharging that is efficient and effective to enable RF-MEMS switch operation to greater than or equal to 100 billion cycles.

Micromachined piezoresistive inclinometer with oscillator-based integrated interface circuit and temperature readout

International Nuclear Information System (INIS)

Dalola, Simone; Ferrari, Vittorio; Marioli, Daniele

2012-01-01

In this paper a dual-chip system for inclination measurement is presented. It consists of a MEMS (microelectromechanical system) piezoresistive accelerometer manufactured in silicon bulk micromachining and a CMOS (complementary metal oxide semiconductor) ASIC (application specific integrated circuit) interface designed for resistive-bridge sensors. The sensor is composed of a seismic mass symmetrically suspended by means of four flexure beams that integrate two piezoresistors each to detect the applied static acceleration, which is related to inclination with respect to the gravity vector. The ASIC interface is based on a relaxation oscillator where the frequency and the duty cycle of a rectangular-wave output signal are related to the fractional bridge imbalance and the overall bridge resistance of the sensor, respectively. The latter is a function of temperature; therefore the sensing element itself can be advantageously used to derive information for its own thermal compensation. DC current excitation of the sensor makes the configuration unaffected by wire resistances and parasitic capacitances. Therefore, a modular system results where the sensor can be placed remotely from the electronics without suffering accuracy degradation. The inclination measurement system has been characterized as a function of the applied inclination angle at different temperatures. At room temperature, the experimental sensitivity of the system results in about 148 Hz/g, which corresponds to an angular sensitivity around zero inclination angle of about 2.58 Hz deg −1 . This is in agreement with finite element method simulations. The measured output fluctuations at constant temperature determine an equivalent resolution of about 0.1° at midrange. In the temperature range of 25–65 °C the system sensitivity decreases by about 10%, which is less than the variation due to the microsensor alone thanks to thermal compensation provided by the current excitation of the bridge and the

A manufacturing method for multi-layer polysilicon surface-micromachining technology

Energy Technology Data Exchange (ETDEWEB)

Sniegowski, J.J.; Rodgers, M.S.

1998-01-01

An advanced manufacturing technology which provides multi-layered polysilicon surface micromachining technology for advanced weapon systems is presented. Specifically, the addition of another design layer to a 4 levels process to create a 5 levels process allows consideration of fundamentally new architecture in designs for weapon advanced surety components.

Femtosecond laser micromachining of polylactic acid/graphene composites for designing interdigitated microelectrodes for sensor applications

Science.gov (United States)

Paula, Kelly T.; Gaál, Gabriel; Almeida, G. F. B.; Andrade, M. B.; Facure, Murilo H. M.; Correa, Daniel S.; Riul, Antonio; Rodrigues, Varlei; Mendonça, Cleber R.

2018-05-01

There is an increasing interest in the last years towards electronic applications of graphene-based materials and devices fabricated from patterning techniques, with the ultimate goal of high performance and temporal resolution. Laser micromachining using femtosecond pulses is an attractive methodology to integrate graphene-based materials into functional devices as it allows changes to the focal volume with a submicrometer spatial resolution due to the efficient nonlinear nature of the absorption, yielding rapid prototyping for innovative applications. We present here the patterning of PLA-graphene films spin-coated on a glass substrate using a fs-laser at moderate pulse energies to fabricate interdigitated electrodes having a minimum spatial resolution of 5 μm. Raman spectroscopy of the PLA-graphene films indicated the presence of multilayered graphene fibers. Subsequently, the PLA-graphene films were micromachined using a femtosecond laser oscillator delivering 50-fs pulses and 800 nm, where the pulse energy and scanning speed was varied in order to determine the optimum irradiation parameters (16 nJ and 100 μm/s) to the fabrication of microstructures. The micromachined patterns were characterized by optical microscopy and submitted to electrical measurements in liquid samples, clearly distinguishing all tastes tested. Our results confirm the femtosecond laser micromachining technique as an interesting approach to efficiently pattern PLA-graphene filaments with high precision and minimal mechanical defects, allowing the easy fabrication of interdigitated structures and an alternative method to those produced by conventional photolithography.

Femtosecond laser micromachining of compound parabolic concentrator fiber tipped glucose sensors

DEFF Research Database (Denmark)

Hassan, Hafeez Ul; Lacraz, Amédée; Kalli, Kyriacos

2017-01-01

We report on highly accurate femtosecond (fs) laser micromachining of a compound parabolic concentrator (CPC) fiber tip on a polymer optical fiber (POF). The accuracy is reflected in an unprecedented correspondence between the numerically predicted and experimentally found improvement in fluoresc...

Optical micro-metrology of structured surfaces micro-machined by jet-ECM

DEFF Research Database (Denmark)

Quagliotti, Danilo; Tosello, Guido; Islam, Aminul

2015-01-01

A procedure for statistical analysis and uncertainty evaluation is presented with regards to measurements of step height and surface texture. Measurements have been performed with a focus-variation microscope over jet electrochemical micro-machined surfaces. Traceability has been achieved using a...

Fabrication of integrated metallic MEMS devices

DEFF Research Database (Denmark)

Yalcinkaya, Arda Deniz; Ravnkilde, Jan Tue; Hansen, Ole

2002-01-01

A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators are characteri......A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators...

Enhancing structural integrity of adhesive bonds through pulsed laser surface micro-machining

KAUST Repository

Diaz, Edwin Hernandez

2015-06-01

Enhancing the effective peel resistance of plastically deforming adhesive joints through laser-based surface micro-machining Edwin Hernandez Diaz Inspired by adhesion examples commonly found in nature, we reached out to examine the effect of different kinds of heterogeneous surface properties that may replicate this behavior and the mechanisms at work. In order to do this, we used pulsed laser ablation on copper substrates (CuZn40) aiming to increase adhesion for bonding. A Yb-fiber laser was used for surface preparation of the substrates, which were probed with a Scanning Electron Microscope (SEM) and X-ray Photoelectron Spectroscopy (XPS). Heterogeneous surface properties were devised through the use of simplified laser micromachined patterns which may induce sequential events of crack arrest propagation, thereby having a leveraging effect on dissipation. The me- chanical performance of copper/epoxy joints with homogeneous and heterogeneous laser micromachined interfaces was then analyzed using the T-peel test. Fractured surfaces were analyzed using SEM to resolve the mechanism of failure and adhesive penetration within induced surface asperities from the treatment. Results confirm positive modifications of the surface morphology and chemistry from laser ablation that enable mechanical interlocking and cohesive failure within the adhesive layer. Remarkable improvements of apparent peel energy, bond toughness, and effective peel force were appreciated with respect to sanded substrates as control samples.

Nonlinear Adaptive Filter for MEMS Gyro Error Cancellation

Data.gov (United States)

National Aeronautics and Space Administration — Thermal biases are the dominate error in low-cost low-power small MEMS gyros. CubeSats often can't afford the power/mass to put a heater on their MEMS gyros and...

Waveguide-Integrated MEMS Concepts for Tunable Millimeter-Wave Systems

OpenAIRE

Baghchehsaraei, Zargham

2014-01-01

This thesis presents two families of novel waveguide-integrated components based on millimeter-wave microelectromechanical systems (MEMS) for reconfigurable systems. The first group comprises V-band (50–75 GHz) and W-band (75–110 GHz) waveguide switches and switchable irises, and their application as switchable cavity resonators, and tunable bandpass filters implemented by integration of novel MEMS-reconfigurable surfaces into a rectangular waveguide. The second category comprises MEMS-based ...

Direct writing of microtunnels using proton beam micromachining

International Nuclear Information System (INIS)

Marot, Laurent; Munnik, Frans; Mikhailov, Serguei

2006-01-01

The production of high aspect ratio microstructures is a potential growth area. The combination of deep X-ray lithography with electroforming and micromolding (i.e. LIGA) is one of the main techniques used to produce 3D microstructures. The new technique of proton micromachining employs focused MeV protons in a direct write process which is complementary to LIGA. During ion exposure of positive photoresist like PMMA, scission of molecular chains occurs. These degraded polymer chains are removed by the developer. The aim of this paper is to investigate the capabilities of proton micromachining as a lithographic technique. We show the realization of sub-surface channels, or microtunnels, which have been fabricated in only one exposure and without cutting or resurfacing the material. Using our Van-de-Graaff accelerator, the resist (PMMA) has been exposed with high-energy protons (2.5 MeV). The range of charged particles in matter is well-defined and depends on the energy. Therefore, it is possible to obtain a dose which is sufficient to develop the bottom part of the ion paths but not the top part. Thus, by selecting the energy and the exposure time, a big variety of microtunnels can be realized

A method for manufacturing a hollow mems structure

DEFF Research Database (Denmark)

2017-01-01

The present invention relates to a method for manufacturing an at least partly hollow MEMS structure. In a first step one or more through-going openings is/are provided in core material. The one or more through-going openings is/are then covered by an etch-stop layer. After this step, a bottom...... further comprises the step of creating bottom and top conductors in the respective bottom and top layers. Finally, excess core material is removed in order to create the at least partly hollow MEMS structure which may include a MEMS inductor....

EPA Administrative Order on Consent (AOC) with ERP Compliant Coke, LLC

Science.gov (United States)

This Administrative Order on Consent with ERP Compliant Coke was effective August 2016. The Walter Coke facility located in North Birmingham was purchased by ERP Compliant Coke, LLC in February 2016 out of bankruptcy proceedings.

Modularly Integrated MEMS Technology

National Research Council Canada - National Science Library

Eyoum, Marie-Angie N

2006-01-01

Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation...

MEMS for pico- to micro-satellites

OpenAIRE

Shea, Herbert

2009-01-01

MEMS sensors, actuators, and sub-systems can enable an important reduction in the size and mass of spacecrafts, first by replacing larger and heavier components, then by replacing entire subsystems, and finally by enabling the microfabrication of highly integrated picosats. Very small satellites (1 to 100 kg) stand to benefit the most from MEMS technologies. These small satellites are typically used for science or technology demonstration missions, with higher risk tolerance than multi-ton te...

Sub 100 nm proton beam micromachining: theoretical calculations on resolution limits

International Nuclear Information System (INIS)

Kan, J.A. van; Sum, T.C.; Osipowicz, T.; Watt, F.

2000-01-01

Proton beam micromachining is a novel direct-write process for the production of three-dimensional (3D) microstructures. A focused beam of MeV protons is scanned in a pre-determined pattern over a suitable resist material (e.g. PMMA or SU-8) and the latent image formed is subsequently developed chemically. In this paper calculations on theoretical resolution limits of proton beam micromachined three-dimensional microstructures are presented. Neglecting the finite beam size, a Monte Carlo ion transport code was used in combination with a theoretical model describing the delta-ray (δ-ray) energy deposition to determine the lateral energy deposition distribution in PMMA resist material. The energy deposition distribution of ion induced secondary electrons (δ-rays) has been parameterized using analytical models. It is assumed that the attainable resolution is limited by a convolution of the spread of the ion beam and energy deposition of the δ-rays

Nonlinear aeroelastic behavior of compliant airfoils

International Nuclear Information System (INIS)

Thwapiah, G; Campanile, L F

2010-01-01

Since the beginning of aviation and up to the present time, airfoils have always been built as rigid structures. They are designed to fly under their divergence speed in order to avoid static aeroelastic instabilities and the resulting large deformations, which are not compatible with the typically low compliance of such airfoils. In recent years, research on airfoil morphing has generated interest in innovative ideas like the use of compliant systems, i.e. systems built to allow for large deformations without failure, in airfoil construction. Such systems can operate in the neighborhood of divergence and take advantage of large aeroelastic servo-effects. This, in turn, allows compact, advanced actuators to control the airfoil's deformation and loads, and hence complement or even replace conventional flaps. In order to analyze and design such compliant, active aeroelastic structures a nonlinear approach to static aeroelasticity is needed, which takes into account the effect of large deformations on aerodynamics and structure. Such an analytical approach is presented in this paper and applied to a compliant passive airfoil as the preliminary step in the realization of a piezoelectrically driven, active aeroelastic airfoil. Wind tunnel test results are also presented and compared with the analytic prediction. The good agreement and the observed behavior in the wind tunnel give confidence in the potential of this innovative idea

Nonlinear aeroelastic behavior of compliant airfoils

Science.gov (United States)

Thwapiah, G.; Campanile, L. F.

2010-03-01

Since the beginning of aviation and up to the present time, airfoils have always been built as rigid structures. They are designed to fly under their divergence speed in order to avoid static aeroelastic instabilities and the resulting large deformations, which are not compatible with the typically low compliance of such airfoils. In recent years, research on airfoil morphing has generated interest in innovative ideas like the use of compliant systems, i.e. systems built to allow for large deformations without failure, in airfoil construction. Such systems can operate in the neighborhood of divergence and take advantage of large aeroelastic servo-effects. This, in turn, allows compact, advanced actuators to control the airfoil's deformation and loads, and hence complement or even replace conventional flaps. In order to analyze and design such compliant, active aeroelastic structures a nonlinear approach to static aeroelasticity is needed, which takes into account the effect of large deformations on aerodynamics and structure. Such an analytical approach is presented in this paper and applied to a compliant passive airfoil as the preliminary step in the realization of a piezoelectrically driven, active aeroelastic airfoil. Wind tunnel test results are also presented and compared with the analytic prediction. The good agreement and the observed behavior in the wind tunnel give confidence in the potential of this innovative idea.

Compliant actuation of rehabilitation robots

NARCIS (Netherlands)

Vallery, Heike; Veneman, J.F.; van Asseldonk, Edwin H.F.; Ekkelenkamp, R.; Buss, Martin; van der Kooij, Herman

2008-01-01

This article discusses the pros and cons of compliant actuation for rehabilitation robots on the example of LOPES, focusing on the cons. After illustrating the bandwidth limitations, a new result has been derived: if stability in terms of passivity of the haptic device is desired, the renderable

MEMS Solar Generators

OpenAIRE

Grbovic, Dragoslav; Osswald, Sebastian

2011-01-01

Approved for public release; distribution is unlimited Using MEMS bimaterial structures to build highly efficient solar energy generators. This is a novel approach that utilizes developments in the area of bimaterial sensors and applies them in the field of solar energy harvesting.

Stress-constrained topology optimization for compliant mechanism design

DEFF Research Database (Denmark)

de Leon, Daniel M.; Alexandersen, Joe; Jun, Jun S.

2015-01-01

This article presents an application of stress-constrained topology optimization to compliant mechanism design. An output displacement maximization formulation is used, together with the SIMP approach and a projection method to ensure convergence to nearly discrete designs. The maximum stress...... is approximated using a normalized version of the commonly-used p-norm of the effective von Mises stresses. The usual problems associated with topology optimization for compliant mechanism design: one-node and/or intermediate density hinges are alleviated by the stress constraint. However, it is also shown...

MEMS for Tunable Photonic Metamaterial Applications

Science.gov (United States)

Stark, Thomas

Photonic metamaterials are materials whose optical properties are derived from artificially-structured sub-wavelength unit cells, rather than from the bulk properties of the constituent materials. Examples of metamaterials include plasmonic materials, negative index materials, and electromagnetic cloaks. While advances in simulation tools and nanofabrication methods have allowed this field to grow over the past several decades, many challenges still exist. This thesis addresses two of these challenges: fabrication of photonic metamaterials with tunable responses and high-throughput nanofabrication methods for these materials. The design, fabrication, and optical characterization of a microelectromechanical systems (MEMS) tunable plasmonic spectrometer are presented. An array of holes in a gold film, with plasmon resonance in the mid-infrared, is suspended above a gold reflector, forming a Fabry-Perot interferometer of tunable length. The spectra exhibit the convolution of extraordinary optical transmission through the holes and Fabry-Perot resonances. Using MEMS, the interferometer length is modulated from 1.7 mum to 21.67 mum , thereby tuning the free spectral range from about 2900 wavenumbers to 230.7 wavenumbers and shifting the reflection minima and maxima across the infrared. Due to its broad spectral tunability in the fingerprint region of the mid-infrared, this device shows promise as a tunable biological sensing device. To address the issue of high-throughput, high-resolution fabrication of optical metamaterials, atomic calligraphy, a MEMS-based dynamic stencil lithography technique for resist-free fabrication of photonic metamaterials on unconventional substrates, has been developed. The MEMS consists of a moveable stencil, which can be actuated with nanometer precision using electrostatic comb drive actuators. A fabrication method and flip chip method have been developed, enabling evaporation of metals through the device handle for fabrication on an

Uncertainty quantification in capacitive RF MEMS switches

Science.gov (United States)

Pax, Benjamin J.

Development of radio frequency micro electrical-mechanical systems (RF MEMS) has led to novel approaches to implement electrical circuitry. The introduction of capacitive MEMS switches, in particular, has shown promise in low-loss, low-power devices. However, the promise of MEMS switches has not yet been completely realized. RF-MEMS switches are known to fail after only a few months of operation, and nominally similar designs show wide variability in lifetime. Modeling switch operation using nominal or as-designed parameters cannot predict the statistical spread in the number of cycles to failure, and probabilistic methods are necessary. A Bayesian framework for calibration, validation and prediction offers an integrated approach to quantifying the uncertainty in predictions of MEMS switch performance. The objective of this thesis is to use the Bayesian framework to predict the creep-related deflection of the PRISM RF-MEMS switch over several thousand hours of operation. The PRISM switch used in this thesis is the focus of research at Purdue's PRISM center, and is a capacitive contacting RF-MEMS switch. It employs a fixed-fixed nickel membrane which is electrostatically actuated by applying voltage between the membrane and a pull-down electrode. Creep plays a central role in the reliability of this switch. The focus of this thesis is on the creep model, which is calibrated against experimental data measured for a frog-leg varactor fabricated and characterized at Purdue University. Creep plasticity is modeled using plate element theory with electrostatic forces being generated using either parallel plate approximations where appropriate, or solving for the full 3D potential field. For the latter, structure-electrostatics interaction is determined through immersed boundary method. A probabilistic framework using generalized polynomial chaos (gPC) is used to create surrogate models to mitigate the costly full physics simulations, and Bayesian calibration and forward

Optical MEMS for earth observation payloads

Science.gov (United States)

Rodrigues, B.; Lobb, D. R.; Freire, M.

2017-11-01

An ESA study has been taken by Lusospace Ltd and Surrey Satellite Techonoly Ltd (SSTL) into the use of optical Micro Eletro-Mechanical Systems (MEMS) for earth Observation. A review and analysis was undertaken of the Micro-Optical Electro-Mechanical Systems (MOEMS) available in the market with potential application in systems for Earth Observation. A summary of this review will be presented. Following the review two space-instrument design concepts were selected for more detailed analysis. The first was the use of a MEMS device to remove cloud from Earth images. The concept is potentially of interest for any mission using imaging spectrometers. A spectrometer concept was selected and detailed design aspects and benefits evaluated. The second concept developed uses MEMS devices to control the width of entrance slits of spectrometers, to provide variable spectral resolution. This paper will present a summary of the results of the study.

MEMS applications in space exploration

Science.gov (United States)

Tang, William C.

1997-09-01

Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. MEMS is one of the key enabling technology to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

Silicon-micromachined microchannel plates

CERN Document Server

Beetz, C P; Steinbeck, J; Lemieux, B; Winn, D R

2000-01-01

Microchannel plates (MCP) fabricated from standard silicon wafer substrates using a novel silicon micromachining process, together with standard silicon photolithographic process steps, are described. The resulting SiMCP microchannels have dimensions of approx 0.5 to approx 25 mu m, with aspect ratios up to 300, and have the dimensional precision and absence of interstitial defects characteristic of photolithographic processing, compatible with positional matching to silicon electronics readouts. The open channel areal fraction and detection efficiency may exceed 90% on plates up to 300 mm in diameter. The resulting silicon substrates can be converted entirely to amorphous quartz (qMCP). The strip resistance and secondary emission are developed by controlled depositions of thin films, at temperatures up to 1200 deg. C, also compatible with high-temperature brazing, and can be essentially hydrogen, water and radionuclide-free. Novel secondary emitters and cesiated photocathodes can be high-temperature deposite...

Acceleration sensitivity of micromachined pressure sensors

Science.gov (United States)

August, Richard; Maudie, Theresa; Miller, Todd F.; Thompson, Erik

1999-08-01

Pressure sensors serve a variety of automotive applications, some which may experience high levels of acceleration such as tire pressure monitoring. To design pressure sensors for high acceleration environments it is important to understand their sensitivity to acceleration especially if thick encapsulation layers are used to isolate the device from the hostile environment in which they reside. This paper describes a modeling approach to determine their sensitivity to acceleration that is very general and is applicable to different device designs and configurations. It also describes the results of device testing of a capacitive surface micromachined pressure sensor at constant acceleration levels from 500 to 2000 g's.

PolyMEMS Actuator: A Polymer-Based Microelectromechanical (MEMS) Actuator with Macroscopic Action

Science.gov (United States)

2002-09-01

DIRECTOR: MICHAEL L. TALBERT, Maj., USAF Technical Advisor , Information Technology Division Information Directorate...technologies meet even two of the four requirements, whereas PolyMEMS meets all four. Robo -Lobster Courtesy of Dr. Joseph Ayers, Northeastern

Managerial Opportunism: Monitoring Financial Risk of Malaysian Shariah-compliant Companies

Directory of Open Access Journals (Sweden)

Aziatul Waznah Ghazali

2018-01-01

Full Text Available Managerial opportunism, such as earnings management, is a rampant, but often discreet, among certain managers. Agency theory and the notion of conflict of interest are used as bases to assume that managers would resolve to engage with inappropriate activities for their personal benefits. Distortion of earnings would erode investor confidence and is detrimental to the capital market. The Islamic capital market with Shariah-compliant firms is expected not to engage in activities that go against the religion code of conduct. The main purpose of this study is to investigate managerial opportunism among Shariah-compliant companies, specifically the relationship between real earnings management and the risk of financial distress, leverage, and free cash flow. This study employs 4,115 data from 694 sample companies for five years (2009–2013. Findings conclude that the risk of financial distress, leverage, and free cash flow have a significant relationship with earnings management among Shariah-compliant companies. This study provides evidence that further improvements on corporate governance are necessary to ensure that Shariah-compliant companies adhere with the Shariah requirement.

A novel micromachined shadow mask system with self-alignment and gap control capability

International Nuclear Information System (INIS)

Hong, Jung Moo; Zou Jun

2008-01-01

We present a novel micromachined shadow mask system, which is capable of accurate self-alignment and mask-substrate gap control. The shadow mask system consists of a silicon shadow mask and a silicon carrier wafer with pyramidal cavities fabricated with bulk micromachining. Self-alignment and gap control of the shadow mask and the fabrication substrate can readily be achieved by using matching pairs of pyramidal cavities and steel spheres placed between. The layer-to-layer alignment accuracy of the new shadow mask system has been experimentally characterized and verified using both optical and atomic force microscopic measurements. As an application of this new shadow mask system, an organic thin-film transistor (OTFT) using pentacene as the semiconductor layer has been successfully fabricated and tested

Numerical modelling of micro-machining of f.c.c. single crystal: Influence of strain gradients

KAUST Repository

Demiral, Murat

2014-11-01

A micro-machining process becomes increasingly important with the continuous miniaturization of components used in various fields from military to civilian applications. To characterise underlying micromechanics, a 3D finite-element model of orthogonal micro-machining of f.c.c. single crystal copper was developed. The model was implemented in a commercial software ABAQUS/Explicit employing a user-defined subroutine VUMAT. Strain-gradient crystal-plasticity and conventional crystal-plasticity theories were used to demonstrate the influence of pre-existing and evolved strain gradients on the cutting process for different combinations of crystal orientations and cutting directions. Crown Copyright © 2014.

Manufacture of Radio Frequency Micromachined Switches with Annealing

OpenAIRE

Lin, Cheng-Yang; Dai, Ching-Liang

2014-01-01

The fabrication and characterization of a radio frequency (RF) micromachined switch with annealing were presented. The structure of the RF switch consists of a membrane, coplanar waveguide (CPW) lines, and eight springs. The RF switch is manufactured using the complementary metal oxide semiconductor (CMOS) process. The switch requires a post-process to release the membrane and springs. The post-process uses a wet etching to remove the sacrificial silicon dioxide layer, and to obtain the suspe...

Ultrafast disk technology enables next generation micromachining laser sources

Science.gov (United States)

Heckl, Oliver H.; Weiler, Sascha; Luzius, Severin; Zawischa, Ivo; Sutter, Dirk

2013-02-01

Ultrashort pulsed lasers based on thin disk technology have entered the 100 W regime and deliver several tens of MW peak power without chirped pulse amplification. Highest uptime and insensitivity to back reflections make them ideal tools for efficient and cost effective industrial micromachining. Frequency converted versions allow the processing of a large variety of materials. On one hand, thin disk oscillators deliver more than 30 MW peak power directly out of the resonator in laboratory setups. These peak power levels are made possible by recent progress in the scaling of the pulse energy in excess of 40 μJ. At the corresponding high peak intensity, thin disk technology profits from the limited amount of material and hence the manageable nonlinearity within the resonator. Using new broadband host materials like for example the sesquioxides will eventually reduce the pulse duration during high power operation and further increase the peak power. On the other hand industry grade amplifier systems deliver even higher peak power levels. At closed-loop controlled 100W, the TruMicro Series 5000 currently offers the highest average ultrafast power in an industry proven product, and enables efficient micromachining of almost any material, in particular of glasses, ceramics or sapphire. Conventional laser cutting of these materials often requires UV laser sources with pulse durations of several nanoseconds and an average power in the 10 W range. Material processing based on high peak power laser sources makes use of multi-photon absorption processes. This highly nonlinear absorption enables micromachining driven by the fundamental (1030 nm) or frequency doubled (515 nm) wavelength of Yb:YAG. Operation in the IR or green spectral range reduces the complexity and running costs of industrial systems initially based on UV light sources. Where UV wavelength is required, the TruMicro 5360 with a specified UV crystal life-time of more than 10 thousand hours of continues

Ultraflat Tip-Tilt-Piston MEMS Deformable Mirror, Phase II

Data.gov (United States)

National Aeronautics and Space Administration — This proposal describes a Phase II SBIR project to develop high-resolution, ultraflat micromirror array devices using advanced silicon surface micromachining...

Nano-tribology and materials in MEMS

CERN Document Server

Satyanarayana, N; Lim, Seh

2013-01-01

This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.

Review of Automated Design and Optimization of MEMS

DEFF Research Database (Denmark)

Achiche, Sofiane; Fan, Zhun; Bolognini, Francesca

2007-01-01

carried out. This paper presents a review of these techniques. The design task of MEMS is usually divided into four main stages: System Level, Device Level, Physical Level and the Process Level. The state of the art o automated MEMS design in each of these levels is investigated....

Optical Characterization of Lorentz Force Based CMOS-MEMS Magnetic Field Sensor.

Science.gov (United States)

Dennis, John Ojur; Ahmad, Farooq; Khir, M Haris Bin Md; Bin Hamid, Nor Hisham

2015-07-27

Magnetic field sensors are becoming an essential part of everyday life due to the improvements in their sensitivities and resolutions, while at the same time they have become compact, smaller in size and economical. In the work presented herein a Lorentz force based CMOS-MEMS magnetic field sensor is designed, fabricated and optically characterized. The sensor is fabricated by using CMOS thin layers and dry post micromachining is used to release the device structure and finally the sensor chip is packaged in DIP. The sensor consists of a shuttle which is designed to resonate in the lateral direction (first mode of resonance). In the presence of an external magnetic field, the Lorentz force actuates the shuttle in the lateral direction and the amplitude of resonance is measured using an optical method. The differential change in the amplitude of the resonating shuttle shows the strength of the external magnetic field. The resonance frequency of the shuttle is determined to be 8164 Hz experimentally and from the resonance curve, the quality factor and damping ratio are obtained. In an open environment, the quality factor and damping ratio are found to be 51.34 and 0.00973 respectively. The sensitivity of the sensor is determined in static mode to be 0.034 µm/mT when a current of 10 mA passes through the shuttle, while it is found to be higher at resonance with a value of 1.35 µm/mT at 8 mA current. Finally, the resolution of the sensor is found to be 370.37 µT.

MEMS Micro-Valve for Space Applications

Science.gov (United States)

Chakraborty, I.; Tang, W. C.; Bame, D. P.; Tang, T. K.

1998-01-01

We report on the development of a Micro-ElectroMechanical Systems (MEMS) valve that is designed to meet the rigorous performance requirements for a variety of space applications, such as micropropulsion, in-situ chemical analysis of other planets, or micro-fluidics experiments in micro-gravity. These systems often require very small yet reliable silicon valves with extremely low leak rates and long shelf lives. Also, they must survive the perils of space travel, which include unstoppable radiation, monumental shock and vibration forces, as well as extreme variations in temperature. Currently, no commercial MEMS valve meets these requirements. We at JPL are developing a piezoelectric MEMS valve that attempts to address the unique problem of space. We begin with proven configurations that may seem familiar. However, we have implemented some major design innovations that should produce a superior valve. The JPL micro-valve is expected to have an extremely low leak rate, limited susceptibility to particulates, vibration or radiation, as well as a wide operational temperature range.

Radioisotope Power Sources for MEMS Devices,

International Nuclear Information System (INIS)

Blanchard, J.P.

2001-01-01

Microelectromechanical systems (MEMS) comprise a rapidly expanding research field with potential applications varying from sensors in airbags to more recent optical applications. Depending on the application, these devices often require an on-board power source for remote operation, especially in cases requiring operation for an extended period of time. Previously suggested power sources include fossil fuels and solar energy, but nuclear power sources may provide significant advantages for certain applications. Hence, the objective of this study is to establish the viability of using radioisotopes to power realistic MEMS devices. A junction-type battery was constructed using silicon and a 63 Ni liquid source. A source volume containing 64 microCi provided a power of ∼0.07 nW. A more novel application of nuclear sources for MEMS applications involves the creation of a resonator that is driven by charge collection in a cantilever beam. Preliminary results have established the feasibility of this concept, and future work will optimize the design for various applications

Financial Risk Ratios and Earnings Management: Reducing Uncertainties in Shariah-compliant Companies

Directory of Open Access Journals (Sweden)

Soheil Kazemian

2018-01-01

Full Text Available This study examines whether Shariah-compliant companies practice earnings management by investigating the relationship among the risk of financial distress, leverage, and free cash flow in discretionary accruals, which function as a substitute for earnings management. This empirical research is conducted on a sample of Malaysian Shariah-compliant companies from all industries in Bursa Malaysia from 2012 to 2014. Results show that Shariah-compliant companies are highly influenced by the risk of financial distress, leverage, and free cash flow. This study argues that working as either Shariah-compliant or non-Shariah-compliant does not affect the level of earnings management through financial distress, high leverage, and free cash flow by managers. Results should be of interest to stakeholders, shareholders, and regulatory bodies (i.e., the Shariah Advisory Council and the Securities Commission that oversee the accountability of corporate financial reporting to prevent earnings management in Shariah-compliant companies. Findings can also aid relevant authorities (i.e., the Shariah Advisory Council and the Security Commission in Malaysia in overcoming or reducing problems related to earnings management. This study is one of the most significant works in Malaysia in terms of sample size and methodology. It argues that the three elements of earnings management (i.e., financial distress, high leverage, and free cash flow influence better disclosure of reported earnings.

Nonlinear Dynamic Response of Compliant Journal Bearings

Directory of Open Access Journals (Sweden)

Glavatskih S.

2012-07-01

Full Text Available This paper investigates the dynamic response of the compliant tilting pad journal bearings subjected to synchronous excitation. Bearing compliance is affected by the properties of pad liner and pad support geometry. Different unbalance eccentricities are considered. It is shown that bearing dynamic response is non-linear. Journal orbit complexity increases with pad compliance though the orbit amplitudes are marginally affected at low loads. At high loads, the journal is forced to operate outside the bearing clearance. The polymer liner reduces the maximum oil film pressure by a factor of 2 when compared to the white metal liner. The nonlinear dynamic response of compliant tilting pad journal bearings is thoroughly discussed.

Mathematical analysis of partial differential equations modeling electrostatic MEMS

CERN Document Server

Esposito, Pierpaolo; Guo, Yujin

2010-01-01

Micro- and nanoelectromechanical systems (MEMS and NEMS), which combine electronics with miniature-size mechanical devices, are essential components of modern technology. It is the mathematical model describing "electrostatically actuated" MEMS that is addressed in this monograph. Even the simplified models that the authors deal with still lead to very interesting second- and fourth-order nonlinear elliptic equations (in the stationary case) and to nonlinear parabolic equations (in the dynamic case). While nonlinear eigenvalue problems-where the stationary MEMS models fit-are a well-developed

Additive direct-write microfabrication for MEMS: A review

Science.gov (United States)

Teh, Kwok Siong

2017-12-01

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer- generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into threedimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive

Optimization of design parameters for bulk micromachined silicon membranes for piezoresistive pressure sensing application

International Nuclear Information System (INIS)

Belwanshi, Vinod; Topkar, Anita

2016-01-01

Finite element analysis study has been carried out to optimize the design parameters for bulk micro-machined silicon membranes for piezoresistive pressure sensing applications. The design is targeted for measurement of pressure up to 200 bar for nuclear reactor applications. The mechanical behavior of bulk micro-machined silicon membranes in terms of deflection and stress generation has been simulated. Based on the simulation results, optimization of the membrane design parameters in terms of length, width and thickness has been carried out. Subsequent to optimization of membrane geometrical parameters, the dimensions and location of the high stress concentration region for implantation of piezoresistors have been obtained for sensing of pressure using piezoresistive sensing technique.

Optimization of design parameters for bulk micromachined silicon membranes for piezoresistive pressure sensing application

Science.gov (United States)

Belwanshi, Vinod; Topkar, Anita

2016-05-01

Finite element analysis study has been carried out to optimize the design parameters for bulk micro-machined silicon membranes for piezoresistive pressure sensing applications. The design is targeted for measurement of pressure up to 200 bar for nuclear reactor applications. The mechanical behavior of bulk micro-machined silicon membranes in terms of deflection and stress generation has been simulated. Based on the simulation results, optimization of the membrane design parameters in terms of length, width and thickness has been carried out. Subsequent to optimization of membrane geometrical parameters, the dimensions and location of the high stress concentration region for implantation of piezoresistors have been obtained for sensing of pressure using piezoresistive sensing technique.

Bending-induced electromechanical coupling and large piezoelectric response in a micromachined diaphragm

KAUST Repository

Wang, Zhihong; Yao, Yingbang; Wang, Xianbin; Yue, Weisheng; Chen, Longqing; Zhang, Xixiang

2013-01-01

We investigated the dependence of electromechanical coupling and the piezoelectric response of a micromachined Pb(Zr 0.52 Ti 0.48)O 3 (PZT) diaphragm on its curvature by observing the impedance spectrum and central deflection responses to a small AC

Sensitivity of Micromachined Joule-Thomson Cooler to Clogging Due to Moisture

NARCIS (Netherlands)

Cao, Haishan; Vanapalli, Srinivas; Holland, Herman J.; Vermeer, Cristian Hendrik; ter Brake, Hermanus J.M.

2015-01-01

A major issue in long-term operation of micromachined Joule-Thomson coolers is the clogging of the microchannels and/or the restriction due to the deposition of water molecules present in the working fluid. In this study, we present the performance of a microcooler operated with nitrogen gas with

Micromachined Microwave Cavity Resonator Filters for 5G: a Feasibility Study

NARCIS (Netherlands)

Kemenade, van R.; Smolders, A.B.; Hon, de B.P.

2015-01-01

Micromachined microwave cavity filters offer a light-weight, high-Q and highly integrated alternative in the frequency range of 20 GHz–100 GHz as compared to conventional filter types. The filter technology shows potential for use in 5G portable devices and as such, the design of a duplexer

Arrayed architectures for multi-stage Si-micromachined high-flow Knudsen pumps

International Nuclear Information System (INIS)

Qin, Yutao; An, Seungdo; Gianchandani, Yogesh B

2015-01-01

This paper reports an evaluation and a comparison of two architectures for implementing Si-micromachined high-flow Knudsen pumps. Knudsen pumps, which operate on the principle of thermal transpiration, have been shown to have great promise for micro-scale gas phase fluidic systems such as micro gas chromatographs. Simultaneously achieving both a high flow rate and adequate blocking pressure has been a persistent challenge, which is addressed in this work by combining multiple pumps in series and addressing the resulting challenges in thermal management. The basic building block is a Si-micromachined pump with  ≈100 000 parallel channels in a 4 mm  ×  6 mm footprint. In the primary approach, multiple pump stages are stacked vertically with interleaved Si-micromachined spacers. A stacked 4-stage Knudsen pump has a form factor of 10 mm  ×  8 mm  ×  6 mm. In an alternate approach, multiple stages are arranged in a planar array. The experimental results demonstrate multiplication of the output pressure head with the number of stages, while the flow rate is maintained. For example, a stacked 4-stage Knudsen pump with 8 W power operated at atmospheric pressure provided a blocking pressure of 0.255 kPa, which was 3.6  ×  of that provided by a single-stage pump with 2 W power; while both provided a  ≈  30 sccm maximum flow rate. The performance can be customized for practical applications such as micro gas chromatography. (paper)

Ball driven type MEMS SAD for artillery fuse

International Nuclear Information System (INIS)

Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo

2017-01-01

The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition. (paper)

Ball driven type MEMS SAD for artillery fuse

Science.gov (United States)

Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S.; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo

2017-01-01

The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition.

Survey on Recent Designs of Compliant Micro-/Nano-Positioning Stages

Directory of Open Access Journals (Sweden)

Zeyi Wu

2018-02-01

Full Text Available Micromanipulation is a hot topic due to its enabling role in various research fields. In order to perform a high precision operation at a small scale, compliant mechanisms have been proposed and applied for decades. In microscale manipulation, micro-/nano-positioning is the most fundamental operation because a precision positioning is the premise of subsequent operations. This paper is concentrated on reviewing the state-of-the-art research on complaint micro-/nano-positioning stage design in recent years. It involves the major processes and components for designing a compliant positioning stage, e.g., actuator selection, stroke amplifier design, connecting scheme of the multi-DOF stage and structure optimization. The review provides a reference to design a compliant micro-/nano-positioning stage for pertinent applications.

Microelectromechanical Systems (MEMS)

Indian Academy of Sciences (India)

As a field, Microelectromechanical Systems (MEMS) has matured over the last two decades to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of ...

Experimental and Modeling Study of Liquid-Assisted—Laser Beam Micromachining of Smart Ceramic Materials

Directory of Open Access Journals (Sweden)

Mayur Parmar

2018-05-01

Full Text Available Smart ceramic materials are next generation materials with the inherent intelligence to adapt to change in the external environment. These materials are destined to play an essential role in several critical engineering applications. Machining these materials using traditional machining processes is a challenge. The laser beam micromachining (LBMM process has the potential to machine such smart materials. However, laser machining when performed in air induces high thermal stress on the surface, often leading to crack formation, recast and re-deposition of ablated material, and large heat-affected zones (HAZ. Performing laser beam machining in the presence of a liquid medium could potentially resolve these issues. This research investigates the possibility of using a Liquid Assisted—Laser Beam Micromachining (LA-LBMM process for micromachining smart ceramic materials. Experimental studies are performed to compare the machining quality of laser beam machining process in air and in a liquid medium. The study reveals that the presence of liquid medium helps in controlling the heat-affected zone and the taper angle of the cavity drilled, thereby enhancing the machining quality. Analytical modeling is developed for the prediction of HAZ and cavity diameter both in air and underwater conditions, and the model is capable of predicting the experimental results to within 10% error.

RF MEMS theory, design, and technology

CERN Document Server

Rebeiz, Gabriel M

2003-01-01

Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

Enabling technology for MEMS and nanodevices

CERN Document Server

Baltes, Henry; Fedder, Gary K; Hierold, Christofer; Korvink, Jan G; Tabata, Osamu

2013-01-01

This softcover edition of the eponymous volume from the successful ""Advanced Micro & Nanosystems"" series covers all aspects of fabrication of MEMS under CMOS-compatible conditions from design to implementation.It examines the various routes and methods to combine electronics generated by the CMOS technology with novel micromechanical parts into one-chip solutions. Various approaches, fundamental and technological aspects as well as strategies leading to different types of functionalities and presented in detail.For the practicing engineer as well as MSc and PhD students on MEMS cours

From MEMS to nanomachine

International Nuclear Information System (INIS)

Esashi, Masayoshi; Ono, Takahito

2005-01-01

Practically applicable microelectromechanical systems (MEMS) and nanomachines have been developed by applying dry processes. Deep reactive ion etching (RIE) of silicon and its applications to an electrostatically levitated rotational gyroscope, a fibre optic blood pressure sensor and in micro-actuated probes are described. High density electrical feedthrough in glass is made using deep RIE of glass and electroplating of metal. Multi-probe data storage system has been developed using the high density electrical feedthrough in glass. Chemical vapour deposition (CVD) of different materials have been developed for MEMS applications; trench-refill using SiO 2 CVD, microstructures using Silicon carbide CVD for glass mold press and selective CVD of carbon nanotube for electron field emitter. Multi-column electron beam lithography system has been developed using the electron field emitter. (topical review)

Silicon-micromachined microchannel plates

International Nuclear Information System (INIS)

Beetz, Charles P.; Boerstler, Robert; Steinbeck, John; Lemieux, Bryan; Winn, David R.

2000-01-01

Microchannel plates (MCP) fabricated from standard silicon wafer substrates using a novel silicon micromachining process, together with standard silicon photolithographic process steps, are described. The resulting SiMCP microchannels have dimensions of ∼0.5 to ∼25 μm, with aspect ratios up to 300, and have the dimensional precision and absence of interstitial defects characteristic of photolithographic processing, compatible with positional matching to silicon electronics readouts. The open channel areal fraction and detection efficiency may exceed 90% on plates up to 300 mm in diameter. The resulting silicon substrates can be converted entirely to amorphous quartz (qMCP). The strip resistance and secondary emission are developed by controlled depositions of thin films, at temperatures up to 1200 deg. C, also compatible with high-temperature brazing, and can be essentially hydrogen, water and radionuclide-free. Novel secondary emitters and cesiated photocathodes can be high-temperature deposited or nucleated in the channels or the first strike surface. Results on resistivity, secondary emission and gain are presented

Development of Electromechanical Architectures for AC Voltage Metrology

Directory of Open Access Journals (Sweden)

Alexandre BOUNOUH

2010-12-01

Full Text Available This paper presents results of work undertaken for exploring MEMS capabilities to fabricate AC voltage references for electrical metrology and high precision instrumentation through the mechanical-electrical coupling in MEMS. From first MEMS test structures previously realized, a second set of devices with improved characteristics has been developed and fabricated with Silicon on Insulator (SOI Surface Micromachining process. These MEMS exhibit pull-in voltages of 5 V and 10 V to match with the best performance of the read-out electronics developed for driving the MEMS. Deep Level Transient Spectroscopy measurements carried out on the new design show resonance frequencies of about only some kHz, and the stability of the MEMS output voltage measured at 100 kHz has been found very promising for the best samples where the relative deviation from the mean value over almost 12 hours showed a standard deviation of about 6.3 ppm.

Biasing of Capacitive Micromachined Ultrasonic Transducers.

Science.gov (United States)

Caliano, Giosue; Matrone, Giulia; Savoia, Alessandro Stuart

2017-02-01

Capacitive micromachined ultrasonic transducers (CMUTs) represent an effective alternative to piezoelectric transducers for medical ultrasound imaging applications. They are microelectromechanical devices fabricated using silicon micromachining techniques, developed in the last two decades in many laboratories. The interest for this novel transducer technology relies on its full compatibility with standard integrated circuit technology that makes it possible to integrate on the same chip the transducers and the electronics, thus enabling the realization of extremely low-cost and high-performance devices, including both 1-D or 2-D arrays. Being capacitive transducers, CMUTs require a high bias voltage to be properly operated in pulse-echo imaging applications. The typical bias supply residual ripple of high-quality high-voltage (HV) generators is in the millivolt range, which is comparable with the amplitude of the received echo signals, and it is particularly difficult to minimize. The aim of this paper is to analyze the classical CMUT biasing circuits, highlighting the features of each one, and to propose two novel HV generator architectures optimized for CMUT biasing applications. The first circuit proposed is an ultralow-residual ripple (generator that uses an extremely stable sinusoidal power oscillator topology. The second circuit employs a commercially available integrated step-up converter characterized by a particularly efficient switching topology. The circuit is used to bias the CMUT by charging a buffer capacitor synchronously with the pulsing sequence, thus reducing the impact of the switching noise on the received echo signals. The small area of the circuit (about 1.5 cm 2 ) makes it possible to generate the bias voltage inside the probe, very close to the CMUT, making the proposed solution attractive for portable applications. Measurements and experiments are shown to demonstrate the effectiveness of the new approaches presented.

Design and Performance of a Focus-Detection System for Use in Laser Micromachining

Directory of Open Access Journals (Sweden)

Binh Xuan Cao

2016-01-01

Full Text Available We describe a new approach for locating the focal position in laser micromachining. This approach is based on a feedback system that uses a charge-coupled device (CCD camera, a beam splitter, and a mirror to focus a laser beam on the surface of a work piece. We tested the proposed method for locating the focal position by using Zemax simulations, as well as physically carrying out drilling processes. Compared with conventional methods, this approach is advantageous because: the implementation is simple, the specimen can easily be positioned at the focal position, and the dynamically adjustable scan amplitude and the CCD camera can be used to monitor the laser beam’s profile. The proposed technique will be particularly useful for locating the focal position on any surface in laser micromachining.

Development of the micro pixel chamber based on MEMS technology

Science.gov (United States)

Takemura, T.; Takada, A.; Kishimoto, T.; Komura, S.; Kubo, H.; Matsuoka, Y.; Miuchi, K.; Miyamoto, S.; Mizumoto, T.; Mizumura, Y.; Motomura, T.; Nakamasu, Y.; Nakamura, K.; Oda, M.; Ohta, K.; Parker, J. D.; Sawano, T.; Sonoda, S.; Tanimori, T.; Tomono, D.; Yoshikawa, K.

2018-02-01

Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB) technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS), however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS) technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

FY 1994 Report on the technical results. Research and development of micromachine technologies (Development of highly functional maintenance technologies for power plants); 1994 nendo micromachine gijutsu no kenkyu kaihatsu seika hokokusho. Hatsuden shisetsuyo kokino maintenance gijutsu kaihatsu

Energy Technology Data Exchange (ETDEWEB)

NONE

1995-09-01

This research and development project is aimed at development of the technologies for the micromachines provided with maintenance functions, e.g., for examination and maintenance of abnormal conditions in heat exchangers, piping systems or the like. The initial target is set at establishment of basic technologies for the micromachines, in consideration of the available technologies. The R and D activities are directed to (1) microcapsules for, e.g., micro power generators, (2) mother machines having controlling and instructing functions, (3) non-cabled examination modules, (4) cabled examination modules, and (5) total systems. The item (1) involves the micro power generators, and mechanisms of signal transmission, flaw finding and driving/suspension; the item (2) mechanisms of micro-optics and connection, group controlling, microbatteries, action type controlling, and artificial muscles; the item (3) expansion/contraction type transfer mechanisms, light energy supply, micro visual sensation, function connection, and concerted controlling; the item (4) tubular manipulators, and mechanisms of light-aided power generation and voltage elevation; and the item (5) maintenance and micromachine systems. (NEDO)

Microelectromechanical Systems (MEMS)

Indian Academy of Sciences (India)

to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of a MEMS device or structure using conven- tional CMOS processes or their variants was the ...

Integrated Electromechanical Transduction Schemes for Polymer MEMS Sensors

Directory of Open Access Journals (Sweden)

Damien Thuau

2018-04-01

Full Text Available Polymer Micro ElectroMechanical Systems (MEMS have the potential to constitute a powerful alternative to silicon-based MEMS devices for sensing applications. Although the use of commercial photoresists as structural material in polymer MEMS has been widely reported, the integration of functional polymer materials as electromechanical transducers has not yet received the same amount of interest. In this context, we report on the design and fabrication of different electromechanical schemes based on polymeric materials ensuring different transduction functions. Piezoresistive transduction made of carbon nanotube-based nanocomposites with a gauge factor of 200 was embedded within U-shaped polymeric cantilevers operating either in static or dynamic modes. Flexible resonators with integrated piezoelectric transduction were also realized and used as efficient viscosity sensors. Finally, piezoelectric-based organic field effect transistor (OFET electromechanical transduction exhibiting a record sensitivity of over 600 was integrated into polymer cantilevers and used as highly sensitive strain and humidity sensors. Such advances in integrated electromechanical transduction schemes should favor the development of novel all-polymer MEMS devices for flexible and wearable applications in the future.

Antenna Miniaturization with MEMS Tunable Capacitors

DEFF Research Database (Denmark)

Barrio, Samantha Caporal Del; Morris, Art; Pedersen, Gert Frølund

2014-01-01

In today’s mobile device market, there is a strong need for efficient antenna miniaturization. Tunable antennas are a very promising way to reduce antenna volume while enlarging its operating bandwidth. MEMS tunable capacitors are state-ofthe- art in terms of insertion loss and their characterist......In today’s mobile device market, there is a strong need for efficient antenna miniaturization. Tunable antennas are a very promising way to reduce antenna volume while enlarging its operating bandwidth. MEMS tunable capacitors are state-ofthe- art in terms of insertion loss...

Sputtered highly oriented PZT thin films for MEMS applications

Science.gov (United States)

Kalpat, Sriram S.

Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate

Control of compliant anthropomimetic robot joint

Directory of Open Access Journals (Sweden)

Svetozarević Bratislav

2011-01-01

Full Text Available In this paper we propose a control strategy for a robot joint which fully mimics the typical human joint structure. The joint drive is based on two actuators (dc motors, agonist and antagonist, acting through compliant tendons and forming a nonlinear multi-input multi-output (MIMO system. At any time, we consider one actuator, the puller, as being responsible for motion control, while the role of the other is to keep its tendon force at some appropriate low level. This human-like and energetically efficient approach requires the control of 'switching', or exchanging roles between actuators. Moreover, an algorithm based on adaptive force reference is used to solve a problem of slacken tendons during the switching and to increase the energy efficiency. This approach was developed and evaluated on increasingly complex robot joint configurations, starting with simple and noncompliant system, and finishing with nonlinear and compliant system.

Nondestructive surface profiling of hidden MEMS using an infrared low-coherence interferometric microscope

Science.gov (United States)

Krauter, Johann; Osten, Wolfgang

2018-03-01

There are a wide range of applications for micro-electro-mechanical systems (MEMS). The automotive and consumer market is the strongest driver for the growing MEMS industry. A 100 % test of MEMS is particularly necessary since these are often used for safety-related purposes such as the ESP (Electronic Stability Program) system. The production of MEMS is a fully automated process that generates 90 % of the costs during the packaging and dicing steps. Nowadays, an electrical test is carried out on each individual MEMS component before these steps. However, after encapsulation, MEMS are opaque to visible light and other defects cannot be detected. Therefore, we apply an infrared low-coherence interferometer for the topography measurement of those hidden structures. A lock-in algorithm-based method is shown to calculate the object height and to reduce ghost steps due to the 2π -unambiguity. Finally, measurements of different MEMS-based sensors are presented.

Ultra-compact MEMS FTIR spectrometer

Science.gov (United States)

Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa

2017-05-01

Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

Políticas Públicas de Memória O Programa Pontos de Memória no Contexto Sul-Rio-Grandense

Directory of Open Access Journals (Sweden)

Mariana Boujadi Mariano da Silva

2016-12-01

Full Text Available O presente estudo busca realizar uma análise do Programa Pontos de Memória, do Instituto Brasileiro de Museus. Analisando o Programa, observa-se a iniciativa de preservar a memória de determinados grupos sociais considerados excluídos da representação de museus ditos tradicionais, através da implementação de espaços de memória ou ações sociomuseológicas, que narrem suas histórias a partir do suporte de patrimônios locais. A análise parte de questionamentos iniciais: quais são as memórias e as identidades que o Programa seleciona para narrar, através de quais ferramentas ocorre a divulgação e sobretudo a apropriação deste patrimônio por parte da comunidade? Para analisar as causas e os efeitos desta política pública, o trabalho observará e discutirá o alcance e a influência que esses espaços exercem nas comunidades, as ações desenvolvidas e a longevidade desses espaços ou ações no contexto sul-rio-grandense.

The laser micro-machining system for diamond anvil cell experiments and general precision machining applications at the High Pressure Collaborative Access Team.

Science.gov (United States)

Hrubiak, Rostislav; Sinogeikin, Stanislav; Rod, Eric; Shen, Guoyin

2015-07-01

We have designed and constructed a new system for micro-machining parts and sample assemblies used for diamond anvil cells and general user operations at the High Pressure Collaborative Access Team, sector 16 of the Advanced Photon Source. The new micro-machining system uses a pulsed laser of 400 ps pulse duration, ablating various materials without thermal melting, thus leaving a clean edge. With optics designed for a tight focus, the system can machine holes any size larger than 3 μm in diameter. Unlike a standard electrical discharge machining drill, the new laser system allows micro-machining of non-conductive materials such as: amorphous boron and silicon carbide gaskets, diamond, oxides, and other materials including organic materials such as polyimide films (i.e., Kapton). An important feature of the new system is the use of gas-tight or gas-flow environmental chambers which allow the laser micro-machining to be done in a controlled (e.g., inert gas) atmosphere to prevent oxidation and other chemical reactions in air sensitive materials. The gas-tight workpiece enclosure is also useful for machining materials with known health risks (e.g., beryllium). Specialized control software with a graphical interface enables micro-machining of custom 2D and 3D shapes. The laser-machining system was designed in a Class 1 laser enclosure, i.e., it includes laser safety interlocks and computer controls and allows for routine operation. Though initially designed mainly for machining of the diamond anvil cell gaskets, the laser-machining system has since found many other micro-machining applications, several of which are presented here.

The laser micro-machining system for diamond anvil cell experiments and general precision machining applications at the High Pressure Collaborative Access Team

International Nuclear Information System (INIS)

Hrubiak, Rostislav; Sinogeikin, Stanislav; Rod, Eric; Shen, Guoyin

2015-01-01

We have designed and constructed a new system for micro-machining parts and sample assemblies used for diamond anvil cells and general user operations at the High Pressure Collaborative Access Team, sector 16 of the Advanced Photon Source. The new micro-machining system uses a pulsed laser of 400 ps pulse duration, ablating various materials without thermal melting, thus leaving a clean edge. With optics designed for a tight focus, the system can machine holes any size larger than 3 μm in diameter. Unlike a standard electrical discharge machining drill, the new laser system allows micro-machining of non-conductive materials such as: amorphous boron and silicon carbide gaskets, diamond, oxides, and other materials including organic materials such as polyimide films (i.e., Kapton). An important feature of the new system is the use of gas-tight or gas-flow environmental chambers which allow the laser micro-machining to be done in a controlled (e.g., inert gas) atmosphere to prevent oxidation and other chemical reactions in air sensitive materials. The gas-tight workpiece enclosure is also useful for machining materials with known health risks (e.g., beryllium). Specialized control software with a graphical interface enables micro-machining of custom 2D and 3D shapes. The laser-machining system was designed in a Class 1 laser enclosure, i.e., it includes laser safety interlocks and computer controls and allows for routine operation. Though initially designed mainly for machining of the diamond anvil cell gaskets, the laser-machining system has since found many other micro-machining applications, several of which are presented here

A Micromachined Capacitive Pressure Sensor Using a Cavity-Less Structure with Bulk-Metal/Elastomer Layers and Its Wireless Telemetry Application

Directory of Open Access Journals (Sweden)

Yogesh B. Gianchandani

2008-04-01

Full Text Available This paper reports a micromachined capacitive pressure sensor intended for applications that require mechanical robustness. The device is constructed with two micromachined metal plates and an intermediate polymer layer that is soft enough to deform in a target pressure range. The plates are formed of micromachined stainless steel fabricated by batch-compatible micro-electro-discharge machining. A polyurethane roomtemperature- vulcanizing liquid rubber of 38-μm thickness is used as the deformable material. This structure eliminates both the vacuum cavity and the associated lead transfer challenges common to micromachined capacitive pressure sensors. For frequency-based interrogation of the capacitance, passive inductor-capacitor tanks are fabricated by combining the capacitive sensor with an inductive coil. The coil has 40 turns of a 127-μmdiameter copper wire. Wireless sensing is demonstrated in liquid by monitoring the variation in the resonant frequency of the tank via an external coil that is magnetically coupled with the tank. The sensitivity at room temperature is measured to be 23-33 ppm/KPa over a dynamic range of 340 KPa, which is shown to match a theoretical estimation. Temperature dependence of the tank is experimentally evaluated.

A Review on Key Issues and Challenges in Devices Level MEMS Testing

Directory of Open Access Journals (Sweden)

Muhammad Shoaib

2016-01-01

Full Text Available The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

Hybrid micromachining using a nanosecond pulsed laser and micro EDM

International Nuclear Information System (INIS)

Kim, Sanha; Chung, Do Kwan; Shin, Hong Shik; Chu, Chong Nam; Kim, Bo Hyun

2010-01-01

Micro electrical discharge machining (micro EDM) is a well-known precise machining process that achieves micro structures of excellent quality for any conductive material. However, the slow machining speed and high tool wear are main drawbacks of this process. Though the use of deionized water instead of kerosene as a dielectric fluid can reduce the tool wear and increase the machine speed, the material removal rate (MRR) is still low. In contrast, laser ablation using a nanosecond pulsed laser is a fast and non-wear machining process but achieves micro figures of rather low quality. Therefore, the integration of these two processes can overcome the respective disadvantages. This paper reports a hybrid process of a nanosecond pulsed laser and micro EDM for micromachining. A novel hybrid micromachining system that combines the two discrete machining processes is introduced. Then, the feasibility and characteristics of the hybrid machining process are investigated compared to conventional EDM and laser ablation. It is verified experimentally that the machining time can be effectively reduced in both EDM drilling and milling by rapid laser pre-machining prior to micro EDM. Finally, some examples of complicated 3D micro structures fabricated by the hybrid process are shown

Influence of micromachined targets on laser accelerated proton beam profiles

Science.gov (United States)

Dalui, Malay; Permogorov, Alexander; Pahl, Hannes; Persson, Anders; Wahlström, Claes-Göran

2018-03-01

High intensity laser-driven proton acceleration from micromachined targets is studied experimentally in the target-normal-sheath-acceleration regime. Conical pits are created on the front surface of flat aluminium foils of initial thickness 12.5 and 3 μm using series of low energy pulses (0.5-2.5 μJ). Proton acceleration from such micromachined targets is compared with flat foils of equivalent thickness at a laser intensity of 7 × 1019 W cm-2. The maximum proton energy obtained from targets machined from 12.5 μm thick foils is found to be slightly lower than that of flat foils of equivalent remaining thickness, and the angular divergence of the proton beam is observed to increase as the depth of the pit approaches the foil thickness. Targets machined from 3 μm thick foils, on the other hand, show evidence of increasing the maximum proton energy when the depths of the structures are small. Furthermore, shallow pits on 3 μm thick foils are found to be efficient in reducing the proton beam divergence by a factor of up to three compared to that obtained from flat foils, while maintaining the maximum proton energy.

Achievement report on commissioned research of R and D in fiscal 1999 on micro-machine technologies. R and D of micro-machine technologies; 1999 nendo kenkyu seika hokokusho. Maikuro mashin gijutsu no kenkyu kaihatsu

Energy Technology Data Exchange (ETDEWEB)

NONE

2001-03-01

With an objective to perform diagnoses and medical treatment in space limited portions in living organisms, research on micro-machine systems, research on a scanning type photographing unit in the medical micro-machine, and comprehensive surveys and researches have been conducted. This paper summarizes the achievements in fiscal 1999. In the research of a micro laser catheter, a prototype laser head having an outer diameter of 1 mm was fabricated, whereas composition was realized with a micro catheter having an outer diameter of 1.5 mm. With regard to the micro pressure sensor for catheterization, good active curving action was realized by a catheter in which a pressure sensor is mounted in the SMA curved catheter head. Research on the scanning type photographing unit has been carried out, for reducing further the diameter and size of an endoscope, on a photographing unit using laser beam whose cross section area of the tip optical section is about half of the conventional units. As a result, a high resolution scanning type photographing unit was realized based on the fiber optic system using a scanning mirror. In the comprehensive surveys and researches, items of information were collected in relation with the basic technologies for micro-machines. (NEDO)

Performance of a non-tapered 3D morphing wing with integrated compliant ribs

International Nuclear Information System (INIS)

Previtali, F; Ermanni, P

2012-01-01

Morphing wings have a high potential for improving the performance and reducing the fuel consumption of modern aircraft. Thanks to its simplicity, the compliant belt-rib concept is regarded by the authors as a promising solution. Using the compliant rib designed by Hasse and Campanile as a starting point, a compliant morphing wing made of composite materials is designed. Innovative methods for optimal placing of the actuation and for the quantification of the morphing are used. The performance of the compliant morphing wing in terms of three-dimensional (3D) structural behaviour and aerodynamic properties, both two- and three-dimensional, is presented and discussed. The fundamental importance of considering 3D coupling effects in the determination of the performance of morphing aerofoils is shown. (paper)

Modeling and non-linear responses of MEMS capacitive accelerometer

Directory of Open Access Journals (Sweden)

Sri Harsha C.

2014-01-01

Full Text Available A theoretical investigation of an electrically actuated beam has been illustrated when the electrostatic-ally actuated micro-cantilever beam is separated from the electrode by a moderately large gap for two distinct types of geometric configurations of MEMS accelerometer. Higher order nonlinear terms have been taken into account for studying the pull in voltage analysis. A nonlinear model of gas film squeezing damping, another source of nonlinearity in MEMS devices is included in obtaining the dynamic responses. Moreover, in the present work, the possible source of nonlinearities while formulating the mathematical model of a MEMS accelerometer and their influences on the dynamic responses have been investigated. The theoretical results obtained by using MATLAB has been verified with the results obtained in FE software and has been found in good agreement. Criterion towards stable micro size accelerometer for each configuration has been investigated. This investigation clearly provides an understanding of nonlinear static and dynamics characteristics of electrostatically micro cantilever based device in MEMS.

Thin Film Transistor Control Circuitry for MEMS Acoustic Transducers

Science.gov (United States)

Daugherty, Robin

This work seeks to develop a practical solution for short range ultrasonic communications and produce an integrated array of acoustic transmitters on a flexible substrate. This is done using flexible thin film transistor (TFT) and micro electromechanical systems (MEMS). The goal is to develop a flexible system capable of communicating in the ultrasonic frequency range at a distance of 10-100 meters. This requires a great deal of innovation on the part of the FDC team developing the TFT driving circuitry and the MEMS team adapting the technology for fabrication on a flexible substrate. The technologies required for this research are independently developed. The TFT development is driven primarily by research into flexible displays. The MEMS development is driving by research in biosensors and micro actuators. This project involves the integration of TFT flexible circuit capabilities with MEMS micro actuators in the novel area of flexible acoustic transmitter arrays. This thesis focuses on the design, testing and analysis of the circuit components required for this project.

Thermal Desalination using MEMS and Salinity-Gradient Solar Pond Technology

Science.gov (United States)

Lu, H.; Walton, J. C.; Hein, H.

2002-08-01

MEMS (multi-effect, multi-stage) flash desalination (distillation) driven by thermal energy derived from a salinity-gradient solar pond is investigated in this study for the purpose of improving the thermodynamic efficiency and economics of this technology. Three major tasks are performed: (1) a MEMS unit is tested under various operating conditions at the El Paso Solar Pond site; (2) the operation and maintenance procedures of the salinity-gradient solar pond coupled with the MEMS operation is studied; and (3) previous test data on a 24-stage, falling-film flash distillation unit (known as the Spinflash) is analyzed and compared with the performance of the MEMS unit. The data and information obtained from this investigation is applicable to a variety of thermal desalination processes using other solar options and/or waste heat.

MEMS Actuators for Improved Performance and Durability

Science.gov (United States)

Yearsley, James M.

Micro-ElectroMechanical Systems (MEMS) devices take advantage of force-scaling at length scales smaller than a millimeter to sense and interact with directly with phenomena and targets at the microscale. MEMS sensors found in everyday devices like cell-phones and cars include accelerometers, gyros, pressure sensors, and magnetic sensors. MEMS actuators generally serve more application specific roles including micro- and nano-tweezers used for single cell manipulation, optical switching and alignment components, and micro combustion engines for high energy density power generation. MEMS rotary motors are actuators that translate an electric drive signal into rotational motion and can serve as rate calibration inputs for gyros, stages for optical components, mixing devices for micro-fluidics, etc. Existing rotary micromotors suffer from friction and wear issues that affect lifetime and performance. Attempts to alleviate friction effects include surface treatment, magnetic and electrostatic levitation, pressurized gas bearings, and micro-ball bearings. The present work demonstrates a droplet based liquid bearing supporting a rotary micromotor that improves the operating characteristics of MEMS rotary motors. The liquid bearing provides wear-free, low-friction, passive alignment between the rotor and stator. Droplets are positioned relative to the rotor and stator through patterned superhydrophobic and hydrophilic surface coatings. The liquid bearing consists of a central droplet that acts as the motor shaft, providing axial alignment between rotor and stator, and satellite droplets, analogous to ball-bearings, that provide tip and tilt stable operation. The liquid bearing friction performance is characterized through measurement of the rotational drag coefficient and minimum starting torque due to stiction and geometric effects. Bearing operational performance is further characterized by modeling and measuring stiffness, environmental survivability, and high

Electromagnetic Investigation of a CMOS MEMS Inductive Microphone

Directory of Open Access Journals (Sweden)

Farès TOUNSI

2009-09-01

Full Text Available This paper presents a detailed electromagnetic modeling for a new structure of a monolithic CMOS micromachined inductive microphone. We have shown, that the use of an alternative current (AC in the primary fixed inductor results in a substantially higher induced voltage in the secondary inductor comparing to the case when a direct current (DC is used. The expected increase of the induced voltage can be expressed by a voltage ratio of AC and DC solutions that is in the range of 3 to 6. A prototype fabrication of this microphone has been realized using a combination of standard CMOS 0.6 µm process with a CMOS-compatible post-process consisting in a bulk micromachining technology. The output voltage of the electrodynamic microphone that achieves the µV range can be increased by the use of the symmetric dual-layer spiral inductor structure.

Passively morphing ornithopter wings constructed using a novel compliant spine: design and testing

International Nuclear Information System (INIS)

Wissa, A A; Hubbard Jr, J E; Tummala, Y; Frecker, M I

2012-01-01

Ornithopters or flapping wing uncrewed aerial vehicles (UAVs) have potential applications in civil and military sectors. Amongst the UAVs, ornithopters have a unique ability to fly in low Reynolds number flight regimes and also have the agility and maneuverability of rotary wing aircraft. In nature, birds achieve such performance by exploiting various wing kinematics known as gaits. The objective of this work is to improve the steady level flight performance of an ornithopter by implementing a continuous vortex gait using a novel passive compliant spine inserted in the ornithopter’s wings. This paper presents an optimal compliant spine concept for ornithopter applications. A quasi-static design optimization procedure was formulated to design the compliant spine. Finite element analysis was performed on a first generation spine and the spine was fabricated. This prototype was then tested by inserting it into an ornithopter’s wing leading edge spar. The effect of inserting the compliant spine into the wings on the electric power required, the aerodynamic loads and the wing kinematics was studied. The ornithopter with the compliant spines inserted in its wings consumed 45% less power and produced an additional 16% of its weight in mean lift compared to the same ornithopter without the compliant spine. The results indicate that this passive morphing approach is promising for improved steady level flight performance. (paper)

Attitude and subjective wellbeing of non-compliant mothers to childhood oral polio vaccine supplemental immunization in Northern Nigeria.

Science.gov (United States)

Umeh, Gregory C; Nomhwange, Terna Ignatius; Shamang, Anthony F; Zakari, Furera; Musa, Audu I; Dogo, Paul M; Gugong, Victor; Iliyasu, Neyu

2018-02-08

Attitude and subjective well-being are important factors in mothers accepting or rejecting Oral Polio Vaccine (OPV) supplemental immunization. The purpose of the study was to determine the role of mothers' attitude and subjective wellbeing on non-compliance to OPV supplemental immunization in Northern Nigeria. The study utilized a cross-sectional design to assess attitude and subjective well-being of mothers using previously validated VACSATC (Vaccine Safety, Attitudes, Training and Communication-10 items) & SUBI (Subjective Well-being Inventory-40 items) measures. A total of 396 participants (equal number of non-compliant and compliant mothers) from 94 non-compliant settlements were interviewed, after informed consent. T-test was run to assess difference in mean scores between the non-compliant and compliant mothers on VACSATC and SUBI measures. The research showed a significant difference in mean scores between the non-compliant and compliant groups on VACSATC measure of mothers' attitude (M = 18.9 non-compliant, compared to 26.5 compliant; p  0.05). The research has shown that negative attitude is more commonly present in non-compliant mothers and may be a factor in vaccine refusal in Northern Nigeria.

Melancolia, memória e subjetividade

OpenAIRE

Giele Rocha Dorneles

2015-01-01

A proposta desta tese é estabelecer, através de uma perspectiva comparatista, relações entre três temas articuladores: a melancolia, a memória e a subjetividade, de modo a constituir entrelaçamentos possíveis, além de buscar indicar o modo como essas três temáticas são apresentadas e representadas em diferentes formas de expressão das artes, partindo de obras literárias - como “A maior flor do mundo” e “As pequenas memórias”, entre outras de José Saramago, e de autores como Charles Baudelaire...

Effect of Compliant Walls on Secondary Instabilities in Boundary-Layer Transition

Science.gov (United States)

Joslin, Ronald D.; Morris, Philip J.

1991-01-01

For aerodynamic and hydrodynamic vehicles, it is highly desirable to reduce drag and noise levels. A reduction in drag leads to fuel savings. In particular for submersible vehicles, a decrease in noise levels inhibits detection. A suggested means to obtain these reduction goals is by delaying the transition from laminar to turbulent flow in external boundary layers. For hydrodynamic applications, a passive device which shows promise for transition delays is the compliant coating. In previous studies with a simple mechanical model representing the compliant wall, coatings were found that provided transition delays as predicted from the semi-empirical e(sup n) method. Those studies were concerned with the linear stage of transition where the instability of concern is referred to as the primary instability. For the flat-plate boundary layer, the Tollmien-Schlichting (TS) wave is the primary instability. In one of those studies, it was shown that three-dimensional (3-D) primary instabilities, or oblique waves, could dominate transition over the coatings considered. From the primary instability, the stretching and tilting of vorticity in the shear flow leads to a secondary instability mechanism. This has been theoretical described by Herbert based on Floquet theory. In the present study, Herbert's theory is used to predict the development of secondary instabilities over isotropic and non-isotropic compliant walls. Since oblique waves may be dominant over compliant walls, a secondary theory extention is made to allow for these 3-D primary instabilities. The effect of variations in primary amplitude, spanwise wavenumber, and Reynolds number on the secondary instabilities are examined. As in the rigid wall case, over compliant walls the subharmonic mode of secondary instability dominates for low-amplitude primary disturbances. Both isotropic and non-isotropic compliant walls lead to reduced secondary growth rates compared to the rigid wall results. For high frequencies

Fabrication and performance analysis of MEMS-based Variable Emissivity Radiator for Space Applications

International Nuclear Information System (INIS)

Lee, Changwook; Oh, Hyung-Ung; Kim, Taegyu

2014-01-01

All Louver was typically representative as the thermal control device. The louver was not suitable to be applied to small satellite, because it has the disadvantage of increase in weight and volume. So MEMS-based variable radiator was developed to support the disadvantage of the louver MEMS-based variable emissivity radiator was designed for satellite thermal control. Because of its immediate response and low power consumption. Also MEMS- based variable emissivity radiator has been made smaller by using MEMS process, it could be solved the problem of the increase in weight and volume, and it has a high reliability and immediate response by using electrical control. In this study, operation validation of the MEMS radiator had been carried out, resulting that emissivity could be controlled. Numerical model was also designed to predict the thermal control performance of MEMS-based variable emissivity radiator

The Sandia MEMS passive shock sensor : FY07 maturation activities.

Energy Technology Data Exchange (ETDEWEB)

Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

2008-08-01

This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS

CERN Document Server

1998-01-01

Micro Electro Mechanical Systems (MEMS) is already about a billion dollars a year industry and is growing rapidly. So far major emphasis has been placed on the fabrication processes for various devices. There are serious issues related to tribology, mechanics, surfacechemistry and materials science in the operationand manufacturingof many MEMS devices and these issues are preventing an even faster commercialization. Very little is understood about tribology and mechanical properties on micro- to nanoscales of the materials used in the construction of MEMS devices. The MEMS community needs to be exposed to the state-of-the-artoftribology and vice versa. Fundamental understanding of friction/stiction, wear and the role of surface contamination and environmental debris in micro devices is required. There are significantadhesion, friction and wear issues in manufacturing and actual use, facing the MEMS industry. Very little is understood about the tribology of bulk silicon and polysilicon films used in the constr...

An Exploratory Study of the Rhetoric in CSR Reports: A Comparison of Shari’ah Compliant Company and Non –Shari’ah Compliant Company in Malaysia

OpenAIRE

Abdul Razak Rafizan

2017-01-01

This paper advances previous research in corporate social reporting (CSR) by using a taxonomy of five distinct rhetorical strategies to examine any differences in term of type of ethical categories and to identify moral attitudes towards different societal activities between Shari’ah compliant company Bank Islam Malaysia Berhad (BIMB) and Non-Shari’ah compliant company Malayan Banking Berhad (Maybank). The data is analyzed using content analysis. The findings revealed that there are different...

Digital holography for MEMS and microsystem metrology

CERN Document Server

Asundi, Anand

2011-01-01

Approaching the topic of digital holography from the practical perspective of industrial inspection, Digital Holography for MEMS and Microsystem Metrology describes the process of digital holography and its growing applications for MEMS characterization, residual stress measurement, design and evaluation, and device testing and inspection. Asundi also provides a thorough theoretical grounding that enables the reader to understand basic concepts and thus identify areas where this technique can be adopted. This combination of both practical and theoretical approach will ensure the

High definition surface micromachining of LiNbO 3 by ion implantation

Science.gov (United States)

Chiarini, M.; Bentini, G. G.; Bianconi, M.; De Nicola, P.

2010-10-01

High Energy Ion Implantation (HEII) of both medium and light mass ions has been successfully applied for the surface micromachining of single crystal LiNbO 3 (LN) substrates. It has been demonstrated that the ion implantation process generates high differential etch rates in the LN implanted areas, when suitable implantation parameters, such as ion species, fluence and energy, are chosen. In particular, when traditional LN etching solutions are applied to suitably ion implanted regions, etch rates values up to three orders of magnitude higher than the typical etching rates of the virgin material, are registered. Further, the enhancement in the etching rate has been observed on x, y and z-cut single crystalline material, and, due to the physical nature of the implantation process, it is expected that it can be equivalently applied also to substrates with different crystallographic orientations. This technique, associated with standard photolithographic technologies, allows to generate in a fast and accurate way very high aspect ratio relief micrometric structures on LN single crystal surface. In this work a description of the developed technology is reported together with some examples of produced micromachined structures: in particular very precisely defined self sustaining suspended structures, such as beams and membranes, generated on LN substrates, are presented. The developed technology opens the way to actual three dimensional micromachining of LN single crystals substrates and, due to the peculiar properties characterising this material, (pyroelectric, electro-optic, acousto-optic, etc.), it allows the design and the production of complex integrated elements, characterised by micrometric features and suitable for the generation of advanced Micro Electro Optical Systems (MEOS).

Oxidative stress detection by MEMS cantilever sensor array based electronic nose

Science.gov (United States)

Gupta, Anurag; Singh, T. Sonamani; Singh, Priyanka; Yadava, R. D. S.

2018-05-01

This paper is concerned with analyzing the role of polymer swelling induced surface stress in MEMS chemical sensors. The objective is to determine the impact of surface stress on the chemical discrimination ability of MEMS resonator sensors. We considered a case study of hypoxia detection by MEMS sensor array and performed several types of simulation experiments for detection of oxidative stress volatile organic markers in human breath. Both types of sensor response models that account for the surface stress effect and that did not were considered for the analyses in comparison. It is found that the surface stress (hence the polymer swelling) provides better chemical discrimination ability to polymer coated MEMS sensors.

MEMS-based Micro Coriolis mass flow sensor

NARCIS (Netherlands)

Haneveld, J.; Brouwer, Dannis Michel; Mehendale, A.; Zwikker, R.; Lammerink, Theodorus S.J.; de Boer, Meint J.; Wiegerink, Remco J.

2008-01-01

We have realized a micromachined micro Coriolis flow sensor consisting of a silicon nitride resonant tube of 40 μm diameter and 1.2 μm wall thickness. First measurements with both gas and liquid flows have demonstrated an unprecedented mass flow resolution in the order of 10 mg/hr at a full scale

IT Consumerization and Compliant Use

DEFF Research Database (Denmark)

Lüker, Nele; Winkler, Till J.; Kude, Thomas

2016-01-01

ground’) on the policy-related attitudes of employees and their level of policy-compliant device usage (voice, email, and data) at two higher education institutions. Based on hypotheses derived from two theories – i.e., procedural justice theory and transaction cost theory – and mixed methods interviews....... Extending the procedural justice view, we conclude that transaction cost theory serves as a complementary lens to explain policy compliance....

Design and Optimization of AlN based RF MEMS Switches

Science.gov (United States)

Hasan Ziko, Mehadi; Koel, Ants

2018-05-01

Radio frequency microelectromechanical system (RF MEMS) switch technology might have potential to replace the semiconductor technology in future communication systems as well as communication satellites, wireless and mobile phones. This study is to explore the possibilities of RF MEMS switch design and optimization with aluminium nitride (AlN) thin film as the piezoelectric actuation material. Achieving low actuation voltage and high contact force with optimal geometry using the principle of piezoelectric effect is the main motivation for this research. Analytical and numerical modelling of single beam type RF MEMS switch used to analyse the design parameters and optimize them for the minimum actuation voltage and high contact force. An analytical model using isotropic AlN material properties used to obtain the optimal parameters. The optimized geometry of the device length, width and thickness are 2000 µm, 500 µm and 0.6 µm respectively obtained for the single beam RF MEMS switch. Low actuation voltage and high contact force with optimal geometry are less than 2 Vand 100 µN obtained by analytical analysis. Additionally, the single beam RF MEMS switch are optimized and validated by comparing the analytical and finite element modelling (FEM) analysis.

Development of Testing Methodologies for the Mechanical Properties of MEMS

Science.gov (United States)

Ekwaro-Osire, Stephen

2003-01-01

This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.

Research and Analysis of MEMS Switches in Different Frequency Bands

Directory of Open Access Journals (Sweden)

Wenchao Tian

2018-04-01

Full Text Available Due to their high isolation, low insertion loss, high linearity, and low power consumption, microelectromechanical systems (MEMS switches have drawn much attention from researchers in recent years. In this paper, we introduce the research status of MEMS switches in different bands and several reliability issues, such as dielectric charging, contact failure, and temperature instability. In this paper, some of the following methods to improve the performance of MEMS switches in high frequency are summarized: (1 utilizing combinations of several switches in series; (2 covering a float metal layer on the dielectric layer; (3 using dielectric layer materials with high dielectric constants and conductor materials with low resistance; (4 developing MEMS switches using T-match and π-match; (5 designing MEMS switches based on bipolar complementary metal–oxide–semiconductor (BiCMOS technology and reconfigurable MEMS’ surfaces; (6 employing thermal compensation structures, circularly symmetric structures, thermal buckle-beam actuators, molybdenum membrane, and thin-film packaging; (7 selecting Ultra-NanoCrystalline diamond or aluminum nitride dielectric materials and applying a bipolar driving voltage, stoppers, and a double-dielectric-layer structure; and (8 adopting gold alloying with carbon nanotubes (CNTs, hermetic and reliable packaging, and mN-level contact.

Piezoelectric Lead Zirconate Titanate (PZT) Ring Shaped Contour-Mode MEMS Resonators

Science.gov (United States)

Kasambe, P. V.; Asgaonkar, V. V.; Bangera, A. D.; Lokre, A. S.; Rathod, S. S.; Bhoir, D. V.

2018-02-01

Flexibility in setting fundamental frequency of resonator independent of its motional resistance is one of the desired criteria in micro-electromechanical (MEMS) resonator design. It is observed that ring-shaped piezoelectric contour-mode MEMS resonators satisfy this design criterion than in case of rectangular plate MEMS resonators. Also ring-shaped contour-mode piezoelectric MEMS resonator has an advantage that its fundamental frequency is defined by in-plane dimensions, but they show variation of fundamental frequency with different Platinum (Pt) thickness referred as change in ratio of fNEW /fO . This paper presents the effects of variation in geometrical parameters and change in piezoelectric material on the resonant frequencies of Platinum piezoelectric-Aluminium ring-shaped contour-mode MEMS resonators and its electrical parameters. The proposed structure with Lead Zirconate Titanate (PZT) as the piezoelectric material was observed to be a piezoelectric material with minimal change in fundamental resonant frequency due to Platinum thickness variation. This structure was also found to exhibit extremely low motional resistance of 0.03 Ω as compared to the 31-35 Ω range obtained when using AlN as the piezoelectric material. CoventorWare 10 is used for the design, simulation and corresponding analysis of resonators which is Finite Element Method (FEM) analysis and design tool for MEMS devices.

MEMS and the microbe

NARCIS (Netherlands)

Ingham, C.J.; Vlieg, J.E.T.V.H.

2008-01-01

In recent years, relatively simple MEMS fabrications have helped accelerate our knowledge of the microbial cell. Current progress and challenges in the application of lab-on-a-chip devices to the viable microbe are reviewed. Furthermore, the degree to which microbiologists are becoming the engineers

Buffering Implications for the Design Space of Streaming MEMS Storage

NARCIS (Netherlands)

Khatib, M.G.; Abelmann, Leon; Preas, Kathy

2011-01-01

Emerging nanotechnology-based systems encounter new non-functional requirements. This work addresses MEMS storage, an emerging technology that promises ultrahigh density and energy-efficient storage devices. We study the buffering requirement of MEMS storage in streaming applications. We show that

Hermeticity testing of MEMS and microelectronic packages

CERN Document Server

Costello, Suzanne

2013-01-01

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

Single-crystal-silicon-based microinstrument to study friction and wear at MEMS sidewall interfaces

International Nuclear Information System (INIS)

Ansari, N; Ashurst, W R

2012-01-01

Since the advent of microelectromechanical systems (MEMS) technology, friction and wear are considered as key factors that determine the lifetime and reliability of MEMS devices that contain contacting interfaces. However, to date, our knowledge of the mechanisms that govern friction and wear in MEMS is insufficient. Therefore, systematically investigating friction and wear at MEMS scale is critical for the commercial success of many potential MEMS devices. Specifically, since many emerging MEMS devices contain more sidewall interfaces, which are topographically and chemically different from in-plane interfaces, studying the friction and wear characteristics of MEMS sidewall surfaces is important. The microinstruments that have been used to date to investigate the friction and wear characteristics of MEMS sidewall surfaces possess several limitations induced either by their design or the structural film used to fabricate them. Therefore, in this paper, we report on a single-crystal-silicon-based microinstrument to study the frictional and wear behavior of MEMS sidewalls, which not only addresses some of the limitations of other microinstruments but is also easy to fabricate. The design, modeling and fabrication of the microinstrument are described in this paper. Additionally, the coefficients of static and dynamic friction of octadecyltrichlorosilane-coated sidewall surfaces as well as sidewall surfaces with only native oxide on them are also reported in this paper. (paper)

Modeling of MEMS Mirrors Actuated by Phase-Change Mechanism

Directory of Open Access Journals (Sweden)

David Torres

2017-04-01

Full Text Available Given the multiple applications for micro-electro-mechanical system (MEMS mirror devices, most of the research efforts are focused on improving device performance in terms of tilting angles, speed, and their integration into larger arrays or systems. The modeling of these devices is crucial for enabling a platform, in particular, by allowing for the future control of such devices. In this paper, we present the modeling of a MEMS mirror structure with four actuators driven by the phase-change of a thin film. The complexity of the device structure and the nonlinear behavior of the actuation mechanism allow for a comprehensive study that encompasses simpler electrothermal designs, thus presenting a general approach that can be adapted to most MEMS mirror designs based on this operation principle. The MEMS mirrors presented in this work are actuated by Joule heating and tested using optical techniques. Mechanical and thermal models including both pitch and roll displacements are developed by combining theoretical analysis (using both numerical and analytical tools with experimental data and subsequently verifying with quasi-static and dynamic experiments.

Applications of MEMS for Space Exploration

Science.gov (United States)

Tang, William C.

1998-03-01

Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. Micro Electro Mechanical Systems (MEMS) is one of the key enabling technologies to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

MEMS capacitive force sensors for cellular and flight biomechanics

International Nuclear Information System (INIS)

Sun Yu; Nelson, Bradley J

2007-01-01

Microelectromechanical systems (MEMS) are playing increasingly important roles in facilitating biological studies. They are capable of providing not only qualitative but also quantitative information on the cellular, sub-cellular and organism levels, which is instrumental to understanding the fundamental elements of biological systems. MEMS force sensors with their high bandwidth and high sensitivity combined with their small size, in particular, have found a role in this domain, because of the importance of quantifying forces and their effect on the function and morphology of many biological structures. This paper describes our research in the development of MEMS capacitive force sensors that have already demonstrated their effectiveness in the areas of cell mechanics and Drosophila flight dynamics studies. (review article)

Fabrication of a dual-planar-coil dynamic microphone by MEMS techniques

International Nuclear Information System (INIS)

Horng, Ray-Hua; Chen, Kuo-Feng; Tsai, Yao-Cheng; Suen, Cheng-You; Chang, Chao-Chih

2010-01-01

A dual-planar-coil miniature dynamic microphone, one of the electro-acoustic transducers working with the principle of the electromagnetic induction, has been realized by semiconductor micro-processing and micro-electro-mechanical system (MEMS) techniques. This MEMS microphone mainly consists of a 1 µm thick diaphragm sandwiched by two spiral coils and vibrating in the region with the highest magnetic flux density generated by a double magnetic system. In comparison with the traditional dynamic microphone, besides the miniaturized dimension, the MEMS microphone also provides 325 times the vibration velocity of the diaphragm faster than the traditional microphone. Measured by an audio analyzer, the frequency response of the MEMS microphone is only 4.5 dBV Pa −1 lower than that of the traditional microphone in the range between 50 Hz and 20 kHz. The responsivity of −54.8 dB Pa −1 (at 1 kHz) of the MEMS device is competitive to that of a traditional commercial dynamic microphone which typically ranges from −50 to −60 dBV Pa −1 (at 1 kHz).

Olhar do cronista, registro da memória

Directory of Open Access Journals (Sweden)

Angela Maria Dutra da Silva Senra

2016-09-01

Full Text Available Propomos apresentar a pesquisa “Rastros da memória literária em crônicas dos jornais marianenses dos séculos XIX e XX” (PERPÉTUA, 2015, que tem como fonte um acervo de periódicos da cidade de Mariana (MG, hoje sob a guarda do Centro de Pesquisas Linguagem, Memória e Tradução do ICHS-UFOP. Dada a evidente relação desse acervo com a memória sociocultural da cidade, nossa pesquisa, em andamento, volta-se objetivamente para identificar e selecionar crônicas literárias publicadas nos periódicos, com a subsequente análise em sua correlação com a memória da região, sob as bases de um significativo material teórico sobre esse gênero. Assim, com vistas a adentrar no passado memorial da cidade de Mariana, apresentaremos o resultado parcial da nossa investigação, que tem proporcionado o conhecimento acerca da crônica; e do registro memorial dessa cidade em razão de sua importância no cenário histórico, social e cultural de Minas Gerais.

Performance enhancement of a silicon MEMS piezoresistive single axis accelerometer with electroplated gold on a proof mass

International Nuclear Information System (INIS)

Ravi Sankar, A; Lahiri, S K; Das, S

2009-01-01

Performance enhancement of a silicon MEMS piezoresistive single axis accelerometer with electroplated gold on a proof mass is presented in this paper. The fabricated accelerometer device consists of a heavy proof mass supported by four thin flexures. Boron-diffused piezoresistors located near the fixed ends of the flexures are used for sensing the developed stress and hence acceleration. Performance enhancement is achieved by electroplating a gold mass of 20 µm thickness on top of the proof mass. A commercially available sulfite-based solution TSG-250(TM) was used for the electroplating process. Aluminum metal lines were used to form a Wheatstone bridge for signal pick-up. To avoid galvanic corrosion between two dissimilar metals having contact in an electrolyte, a shadow mask technique was used to selectively deposit a Cr/Au seed layer on an insulator atop the proof mass for subsequent electrodeposition. Bulk micromachining was performed using a 5% dual-doped TMAH solution. Fabricated devices with different electroplated gold areas were tested up to ±13 g acceleration. For electroplated gold dimensions of 2500 µm × 2500 µm × 20 µm on a proof mass, sensitivity along the Z-axis is increased by 21.8% as compared to the structure without gold. Off-axis sensitivities along the X- and Y-axes are reduced by 7.6% and 6.9%, respectively

Freeform Compliant CMOS Electronic Systems for Internet of Everything Applications

KAUST Repository

Shaikh, Sohail F.

2017-01-17

The state-of-the-art electronics technology has been an integral part of modern advances. The prevalent rise of the mobile device and computational technology in the age of information technology offers exciting applications that are attributed to sophisticated, enormously reliable, and most mature CMOS-based electronics. We are accustomed to high performance, cost-effective, multifunctional, and energy-efficient scaled electronics. However, they are rigid, bulky, and brittle. The convolution of flexibility and stretchability in electronics for emerging Internet of Everything application can unleash smart application horizon in unexplored areas, such as robotics, healthcare, smart cities, transport, and entertainment systems. While flexible and stretchable device themes are being remarkably chased, the realization of the fully compliant electronic system is unaddressed. Integration of data processing, storage, communication, and energy management devices complements a compliant system. Here, a comprehensive review is presented on necessity and design criteria for freeform (physically flexible and stretchable) compliant high-performance CMOS electronic systems.

Optimizing MEMS-Based Storage Devices for Mobile Battery-Powered Systems

NARCIS (Netherlands)

Khatib, M.G.; Hartel, Pieter H.

An emerging storage technology, called MEMS-based storage, promises nonvolatile storage devices with ultrahigh density, high rigidity, a small form factor, and low cost. For these reasons, MEMS-based storage devices are suitable for battery-powered mobile systems such as PDAs. For deployment in such

Differential RF MEMS interwoven capacitor immune to residual stress warping

KAUST Repository

Elshurafa, Amro M.

2012-07-27

A RF MEMS capacitor with an interwoven structure is designed, fabricated in the PolyMUMPS process and tested in an effort to address fabrication challenges usually faced in MEMS processes. The interwoven structure was found to offer several advantages over the typical MEMS parallel-plate design including eliminating the warping caused by residual stress, eliminating the need for etching holes, suppressing stiction, reducing parasitics and providing differential capability. The quality factor of the proposed capacitor was higher than five throughout a 2–10 GHz range and the resonant frequency was in excess of 20 GHz.

Differential RF MEMS interwoven capacitor immune to residual stress warping

KAUST Repository

Elshurafa, Amro M.; Salama, Khaled N.

2012-01-01

A RF MEMS capacitor with an interwoven structure is designed, fabricated in the PolyMUMPS process and tested in an effort to address fabrication challenges usually faced in MEMS processes. The interwoven structure was found to offer several advantages over the typical MEMS parallel-plate design including eliminating the warping caused by residual stress, eliminating the need for etching holes, suppressing stiction, reducing parasitics and providing differential capability. The quality factor of the proposed capacitor was higher than five throughout a 2–10 GHz range and the resonant frequency was in excess of 20 GHz.

UAV-borne lidar with MEMS mirror-based scanning capability

Science.gov (United States)

Kasturi, Abhishek; Milanovic, Veljko; Atwood, Bryan H.; Yang, James

2016-05-01

Firstly, we demonstrated a wirelessly controlled MEMS scan module with imaging and laser tracking capability which can be mounted and flown on a small UAV quadcopter. The MEMS scan module was reduced down to a small volume of smartphone via Bluetooth while flying on a drone, and could project vector content, text, and perform laser based tracking. Also, a "point-and-range" LiDAR module was developed for UAV applications based on low SWaP (Size, Weight and Power) gimbal-less MEMS mirror beam-steering technology and off-the-shelf OEM LRF modules. For demonstration purposes of an integrated laser range finder module, we used a simple off-the-shelf OEM laser range finder (LRF) with a 100m range, +/-1.5mm accuracy, and 4Hz ranging capability. The LRFs receiver optics were modified to accept 20° of angle, matching the transmitter's FoR. A relatively large (5.0mm) diameter MEMS mirror with +/-10° optical scanning angle was utilized in the demonstration to maintain the small beam divergence of the module. The complete LiDAR prototype can fit into a small volume of battery. The MEMS mirror based LiDAR system allows for ondemand ranging of points or areas within the FoR without altering the UAV's position. Increasing the LRF ranging frequency and stabilizing the pointing of the laser beam by utilizing the onboard inertial sensors and the camera are additional goals of the next design.

Micromachined integrated quantum circuit containing a superconducting qubit

Science.gov (United States)

Brecht, Teresa; Chu, Yiwen; Axline, Christopher; Pfaff, Wolfgang; Blumoff, Jacob; Chou, Kevin; Krayzman, Lev; Frunzio, Luigi; Schoelkopf, Robert

We demonstrate a functional multilayer microwave integrated quantum circuit (MMIQC). This novel hardware architecture combines the high coherence and isolation of three-dimensional structures with the advantages of integrated circuits made with lithographic techniques. We present fabrication and measurement of a two-cavity/one-qubit prototype, including a transmon coupled to a three-dimensional microwave cavity micromachined in a silicon wafer. It comprises a simple MMIQC with competitive lifetimes and the ability to perform circuit QED operations in the strong dispersive regime. Furthermore, the design and fabrication techniques that we have developed are extensible to more complex quantum information processing devices.

A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection

Science.gov (United States)

2015-09-01

ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for...ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for Chemical...TITLE AND SUBTITLE A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection 5a. CONTRACT NUMBER 5b. GRANT NUMBER

Wafer-Level Membrane-Transfer Process for Fabricating MEMS

Science.gov (United States)

Yang, Eui-Hyeok; Wiberg, Dean

2003-01-01

A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectromechanical systems (MEMS) that have been fabricated on dissimilar substrates. Unlike in some older membrane-transfer processes, there is no use of wax or epoxy during transfer. In this process, the substrate of a wafer-level structure to be transferred serves as a carrier, and is etched away once the transfer has been completed. Another important feature of this process is that two electrodes constitutes an electrostatic actuator array. An SOI wafer and a silicon wafer (see Figure 1) are used as the carrier and electrode wafers, respectively. After oxidation, both wafers are patterned and etched to define a corrugation profile and electrode array, respectively. The polysilicon layer is deposited on the SOI wafer. The carrier wafer is bonded to the electrode wafer by using evaporated indium bumps. The piston pressure of 4 kPa is applied at 156 C in a vacuum chamber to provide hermetic sealing. The substrate of the SOI wafer is etched in a 25 weight percent TMAH bath at 80 C. The exposed buried oxide is then removed by using 49 percent HF droplets after an oxygen plasma ashing. The SOI top silicon layer is etched away by using an SF6 plasma to define the corrugation profile, followed by the HF droplet etching of the remaining oxide. The SF6 plasma with a shadow mask selectively etches the polysilicon membrane, if the transferred membrane structure needs to be patterned. Electrostatic actuators with various electrode gaps have been fabricated by this transfer technique. The gap between the transferred membrane and electrode substrate is very uniform ( 0.1 m across a wafer diameter of 100 mm, provided by optimizing the bonding control). Figure 2 depicts the finished product.

Design challenges for stepper motor actuated microvalve based on fine and micro-machining

NARCIS (Netherlands)

Fazal, I.; Elwenspoek, Michael Curt

2007-01-01

We present a normally open stepper motor actuated microvalve based on micro and fine-machining technique. In this paper, first we have described how the larger controllable flow range can be achieved with simple micromachining techniques and secondly we have presented the results which show how the

Surface micromachined fabrication of piezoelectric ain unimorph suspension devices for rf resonator applications

NARCIS (Netherlands)

Saravanan, S.; Saravanan, S.; Berenschot, Johan W.; Krijnen, Gijsbertus J.M.; Elwenspoek, Michael Curt

We report a surface micromachining process for aluminum nitride (AlN) thin films to fabricate piezoelectric unimorph suspension devices for actuator applications. Polysilicon is used as a structural layer. Highly c-axis oriented AlN thin films 1 /spl mu/m thick are deposited by rf reactive

Surface micromachined counter-meshing gears discrimination device

International Nuclear Information System (INIS)

Polosky, M.A.; Garcia, E.J.; Allen, J.J.

1998-01-01

This paper discusses the design, fabrication and testing of a surface micromachined Counter-Meshing Gears (CMG) discrimination device which functions as a mechanically coded lock, A 24 bit code is input to unlock the device. Once unlocked, the device provides a path for an energy or information signal to pass through the device. The device is designed to immediately lock up if any portion of the 24 bit code is incorrect. The motivation for the development of this device is based on occurrences referred to as High Consequence Events, A High Consequence Event is an event where an inadvertent operation of a system could result in the catastrophic loss of life, property, or damage to the environment

Feasibility of frequency-modulated wireless transmission for a multi-purpose MEMS-based accelerometer.

Science.gov (United States)

Sabato, Alessandro; Feng, Maria Q

2014-09-05

Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy--especially at very low frequencies--have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

MemBrain: An Easy-to-Use Online Webserver for Transmembrane Protein Structure Prediction

Science.gov (United States)

Yin, Xi; Yang, Jing; Xiao, Feng; Yang, Yang; Shen, Hong-Bin

2018-03-01

Membrane proteins are an important kind of proteins embedded in the membranes of cells and play crucial roles in living organisms, such as ion channels, transporters, receptors. Because it is difficult to determinate the membrane protein's structure by wet-lab experiments, accurate and fast amino acid sequence-based computational methods are highly desired. In this paper, we report an online prediction tool called MemBrain, whose input is the amino acid sequence. MemBrain consists of specialized modules for predicting transmembrane helices, residue-residue contacts and relative accessible surface area of α-helical membrane proteins. MemBrain achieves a prediction accuracy of 97.9% of A TMH, 87.1% of A P, 3.2 ± 3.0 of N-score, 3.1 ± 2.8 of C-score. MemBrain-Contact obtains 62%/64.1% prediction accuracy on training and independent dataset on top L/5 contact prediction, respectively. And MemBrain-Rasa achieves Pearson correlation coefficient of 0.733 and its mean absolute error of 13.593. These prediction results provide valuable hints for revealing the structure and function of membrane proteins. MemBrain web server is free for academic use and available at www.csbio.sjtu.edu.cn/bioinf/MemBrain/. [Figure not available: see fulltext.

A LabVIEWTM-based scanning and control system for proton beam micromachining

International Nuclear Information System (INIS)

Bettiol, Andrew A.; Kan, J.A. van; Sum, T.C.; Watt, F.

2001-01-01

LabVIEW TM is steadily gaining in popularity as the programming language of choice for scientific data acquisition and control. This is due to the vast array of measurement instruments and data acquisition cards supported by the LabVIEW TM environment, and the relative ease with which advanced software can be programmed. Furthermore, virtual instruments that are designed for a given system can be easily ported to other LabVIEW TM platforms and hardware. This paper describes the new LabVIEW TM based scanning and control system developed specifically for proton beam micromachining (PBM) applications. The new system is capable of scanning figures at 16-bit resolution with improved sub-microsecond scan rates. Support for electrostatic beam blanking and external dose normalization using a TTL signal have been implemented. The new software incorporates a semi-automated dose calibration system, and a number of novel dose normalization methods. Limitations of the current beam scanning hardware are discussed in light of new results obtained from micromachining experiments performed in SU-8 photoresist

Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

Directory of Open Access Journals (Sweden)

Sarah Zerbini

2007-09-01

Full Text Available The effect of accidental drops on MEMS sensors are examined within the frame-work of a multi-scale finite element approach. With specific reference to a polysilicon MEMSaccelerometer supported by a naked die, the analysis is decoupled into macro-scale (at dielength-scale and meso-scale (at MEMS length-scale simulations, accounting for the verysmall inertial contribution of the sensor to the overall dynamics of the device. Macro-scaleanalyses are adopted to get insights into the link between shock waves caused by the impactagainst a target surface and propagating inside the die, and the displacement/acceleration his-tories at the MEMS anchor points. Meso-scale analyses are adopted to detect the most stresseddetails of the sensor and to assess whether the impact can lead to possible localized failures.Numerical results show that the acceleration at sensor anchors cannot be considered an ob-jective indicator for drop severity. Instead, accurate analyses at sensor level are necessary toestablish how MEMS can fail because of drops.

Demonstration of superconducting micromachined cavities

Energy Technology Data Exchange (ETDEWEB)

Brecht, T., E-mail: teresa.brecht@yale.edu; Reagor, M.; Chu, Y.; Pfaff, W.; Wang, C.; Frunzio, L.; Devoret, M. H.; Schoelkopf, R. J. [Department of Applied Physics, Yale University, New Haven, Connecticut 06511 (United States)

2015-11-09

Superconducting enclosures will be key components of scalable quantum computing devices based on circuit quantum electrodynamics. Within a densely integrated device, they can protect qubits from noise and serve as quantum memory units. Whether constructed by machining bulk pieces of metal or microfabricating wafers, 3D enclosures are typically assembled from two or more parts. The resulting seams potentially dissipate crossing currents and limit performance. In this letter, we present measured quality factors of superconducting cavity resonators of several materials, dimensions, and seam locations. We observe that superconducting indium can be a low-loss RF conductor and form low-loss seams. Leveraging this, we create a superconducting micromachined resonator with indium that has a quality factor of two million, despite a greatly reduced mode volume. Inter-layer coupling to this type of resonator is achieved by an aperture located under a planar transmission line. The described techniques demonstrate a proof-of-principle for multilayer microwave integrated quantum circuits for scalable quantum computing.

The effect of compliant prisms on subduction zone earthquakes and tsunamis

Science.gov (United States)

Lotto, Gabriel C.; Dunham, Eric M.; Jeppson, Tamara N.; Tobin, Harold J.

2017-01-01

Earthquakes generate tsunamis by coseismically deforming the seafloor, and that deformation is largely controlled by the shallow rupture process. Therefore, in order to better understand how earthquakes generate tsunamis, one must consider the material structure and frictional properties of the shallowest part of the subduction zone, where ruptures often encounter compliant sedimentary prisms. Compliant prisms have been associated with enhanced shallow slip, seafloor deformation, and tsunami heights, particularly in the context of tsunami earthquakes. To rigorously quantify the role compliant prisms play in generating tsunamis, we perform a series of numerical simulations that directly couple dynamic rupture on a dipping thrust fault to the elastodynamic response of the Earth and the acoustic response of the ocean. Gravity is included in our simulations in the context of a linearized Eulerian description of the ocean, which allows us to model tsunami generation and propagation, including dispersion and related nonhydrostatic effects. Our simulations span a three-dimensional parameter space of prism size, prism compliance, and sub-prism friction - specifically, the rate-and-state parameter b - a that determines velocity-weakening or velocity-strengthening behavior. We find that compliant prisms generally slow rupture velocity and, for larger prisms, generate tsunamis more efficiently than subduction zones without prisms. In most but not all cases, larger, more compliant prisms cause greater amounts of shallow slip and larger tsunamis. Furthermore, shallow friction is also quite important in determining overall slip; increasing sub-prism b - a enhances slip everywhere along the fault. Counterintuitively, we find that in simulations with large prisms and velocity-strengthening friction at the base of the prism, increasing prism compliance reduces rather than enhances shallow slip and tsunami wave height.

SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

KAUST Repository

Ramadan, Khaled S.

2012-01-01

MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed

Memória, Identidade e Patrimônio Quilombola

Directory of Open Access Journals (Sweden)

Rodrigo da Costa Segovia

2015-12-01

Full Text Available Este artigo visa analisar a Comunidade Quilombola, sua memória e identidade, nesse contexto busca-se dialogar com a pesquisa que está sendo desenvolvida junto a Comunidade Quilombo Madeira, bem como com o projeto para conclusão do Mestrado em Memória Social e Patrimônio Cultural da Universidade Federal de Pelotas. Sendo assim não foi possível deixar de fazer colocações relacionadas a Comunidades Quilombolas, em primeiro momento abordam-se questões relativas ao termo quilombola, logo a pós uma breve apresentação da comunidade onde a pesquisa está sendo efetuada e por final acerca-se com maior ênfase as discussões sobre Memória e Identidade.

A nuclear micro battery for Mems devices

International Nuclear Information System (INIS)

Lal, A.; Bilbao Y Leon, R.M.; Guo, H.; Li, H.; Santanam, S.; Yao, R.; Blanchard, J.; Henderson, D.

2001-01-01

Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include alpha and low-energy beta emitters. The sources are in both solid and liquid form, and a technique for plating a solid source from a liquid source has been investigated. Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. Performance results are provided for each of these concepts. (authors)

Use of thermal cycling to reduce adhesion of OTS coated coated MEMS cantilevers

Science.gov (United States)

Ali, Shaikh M.; Phinney, Leslie M.

2003-01-01

°Microelectromechanical systems (MEMS) have enormous potential to contribute in diverse fields such as automotive, health care, aerospace, consumer products, and biotechnology, but successful commercial applications of MEMS are still small in number. Reliability of MEMS is a major impediment to the commercialization of laboratory prototypes. Due to the multitude of MEMS applications and the numerous processing and packaging steps, MEMS are exposed to a variety of environmental conditions, making the prediction of operational reliability difficult. In this paper, we investigate the effects of operating temperature on the in-use adhesive failure of electrostatically actuated MEMS microcantilevers coated with octadecyltrichlorosilane (OTS) films. The cantilevers are subjected to repeated temperature cycles and electrostatically actuated at temperatures between 25°C and 300°C in ambient air. The experimental results indicate that temperature cycling of the OTS coated cantilevers in air reduces the sticking probability of the microcantilevers. The sticking probability of OTS coated cantilevers was highest during heating, which decreased during cooling, and was lowest during reheating. Modifications to the OTS release method to increase its yield are also discussed.

MEMS-Electronic-Photonic Heterogeneous Integrated FMCW Ladar Source

Science.gov (United States)

2015-12-18

1   1.1.   E-­‐ PHI  PHASE  2  –  MEMS  LADAR  SOURCE...4   3.2.   PROPOSED  EO-­‐PLL   ARCHITECTURE  WITH  GATED  RAMP-­‐SWITCHING... PHI  Phase  2  –  MEMS  LADAR  Source   In  Phase  2,  we  continue  the  development  of  the  FMCW  LADAR

Nanogenerators for self-powering nanosystems and piezotronics for smart MEMS/NEMS

KAUST Repository

Wang, Zhong Lin

2011-01-01

Two new fields are introduced to MEMS/NEMS: a nanogenerator that harvests mechanical energy for powering nanosystems, and strained induced piezotronics for smart MEMS. Fundamentally, due to the polarization of ions in a crystal that has non

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

Science.gov (United States)

Jah, Muzar; Simon, Eric; Sharma, Ashok

2003-01-01

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Lembrar-esquecer: trabalhando com as memórias infantis

Directory of Open Access Journals (Sweden)

Renata Sieiro Fernandes

Full Text Available Baseando-se nas obras de autores que focalizam a velhice e a memória, valemo-nos da proposta de construção de conjuntos fotográficos e da metodologia de análise para elaborar um exercício/desafio semelhante para crianças da faixa etária de 9-10 anos. Em concordância com os autores, também nos propusemos a pensar sobre como a memória das crianças - assim como a dos velhos - pode se construir e se organizar por meio de suportes fotográficos representativos de fragmentos da vida cotidiana. Os dois grupos compostos por seres que se encontram nas margens do tempo, se distanciam e se aproximam nessa particularidade. Intuitiva e reflexivamente, as crianças elaboraram seus conceitos de memória, envolvendo as lembranças e os esquecimentos, representando-os de formas visuais variadas e criativas, indicando que os movimentos constitutivos da memória dão indícios de tentativas de ordenação de um tempo composto de vários tempos.

Miniaturization of components and systems for space using MEMS-technology

Science.gov (United States)

Grönland, Tor-Arne; Rangsten, Pelle; Nese, Martin; Lang, Martin

2007-06-01

Development of MEMS-based (micro electro mechanical system) components and subsystems for space applications has been pursued by various research groups and organizations around the world for at least two decades. The main driver for developing MEMS-based components for space is the miniaturization that can be achieved. Miniaturization can not only save orders of magnitude in mass and volume of individual components, but it can also allow increased redundancy, and enable novel spacecraft designs and mission scenarios. However, the commercial breakthrough of MEMS has not occurred within the space business as it has within other branches such as the IT/telecom or automotive industries, or as it has in biotech or life science applications. A main explanation to this is the highly conservative attitude to new technology within the space community. This conservatism is in many senses motivated by a very low risk acceptance in the few and costly space projects that actually ends with a space flight. To overcome this threshold there is a strong need for flight opportunities where reasonable risks can be accepted. Currently there are a few flight opportunities allowing extensive use of new technology in space, but one of the exceptions is the PRISMA program. PRISMA is an international (Sweden, Germany, France, Denmark, Norway, Greece) technology demonstration program with focus on rendezvous and formation flying. It is a two satellite LEO mission with a launch scheduled for the first half of 2009. On PRISMA, a number of novel technologies e.g. RF metrology sensor for Darwin, autonomous formation flying based on GPS and vision-based sensors, ADN-based "green propulsion" will be demonstrated in space for the first time. One of the satellites will also have a miniaturized propulsion system onboard based on MEMS-technology. This novel propulsion system includes two microthruster modules, each including four thrusters with micro- to milli-Newton thrust capability. The novelty

Distúrbios de memória em pacientes epilépticos

Directory of Open Access Journals (Sweden)

STELLA FLORINDO

1999-01-01

Full Text Available O autor estudou distúrbios de memória em pacientes epilépticos com crises parciais complexas (CPC, com os objetivos de: 1 identificar estes distúrbios; e 2 comparar os resultados dos pacientes com os dos controles. Foram estudados 50 pacientes adultos e 20 sujeitos sem enfermidades neuropsiquiátricas. Os métodos consistiram em: 1 investigação da atividade mnemônica através do Teste de Memória de Wechsler (subtestes: Armazenamento e Recuperação, Memória Recente e Memória Imediata; e 2 comparação entre os resultados de ambos os grupos. 3 associação entre SPECT Cerebral e atividade mnemônica. Nos três subtestes, os pacientes apresentaram desempenho cognitivo significativamente inferior ao dos controles (p <0,05. Constatou-se a associação entre hipofluxo em região temporal esquerda e distúrbio da memória nos três subtestes. Concluiu-se que há associação entre CPC e distúrbios da atividade mnemônica.

Project: Micromachined High-Frequency Circuits For Sub-mm-wave Sensors

Science.gov (United States)

Papapolymerou, Ioannis John

2004-01-01

A novel micromachined resonator at 45 GHz based on a defect in a periodic electromagnetic bandgap structure (EBG) and a two-pole Tchebysbev filter with 1.4% 0.15 dB equiripple bandwidth and 2.3 dB loss employing this resonator are presented in this letter. The periodic bandgap structure is realized on a 400 micron thick high-resistivity silicon wafer using deep reactive ion etching techniques. The resonator and filter can be accessed via coplanar waveguide feeds.

Evaluation of MEMS-Based Wireless Accelerometer Sensors in Detecting Gear Tooth Faults in Helicopter Transmissions

Science.gov (United States)

Lewicki, David George; Lambert, Nicholas A.; Wagoner, Robert S.

2015-01-01

The diagnostics capability of micro-electro-mechanical systems (MEMS) based rotating accelerometer sensors in detecting gear tooth crack failures in helicopter main-rotor transmissions was evaluated. MEMS sensors were installed on a pre-notched OH-58C spiral-bevel pinion gear. Endurance tests were performed and the gear was run to tooth fracture failure. Results from the MEMS sensor were compared to conventional accelerometers mounted on the transmission housing. Most of the four stationary accelerometers mounted on the gear box housing and most of the CI's used gave indications of failure at the end of the test. The MEMS system performed well and lasted the entire test. All MEMS accelerometers gave an indication of failure at the end of the test. The MEMS systems performed as well, if not better, than the stationary accelerometers mounted on the gear box housing with regards to gear tooth fault detection. For both the MEMS sensors and stationary sensors, the fault detection time was not much sooner than the actual tooth fracture time. The MEMS sensor spectrum data showed large first order shaft frequency sidebands due to the measurement rotating frame of reference. The method of constructing a pseudo tach signal from periodic characteristics of the vibration data was successful in deriving a TSA signal without an actual tach and proved as an effective way to improve fault detection for the MEMS.

Coefficient of restitution in fractional viscoelastic compliant impacts using fractional Chebyshev collocation

Science.gov (United States)

Dabiri, Arman; Butcher, Eric A.; Nazari, Morad

2017-02-01

Compliant impacts can be modeled using linear viscoelastic constitutive models. While such impact models for realistic viscoelastic materials using integer order derivatives of force and displacement usually require a large number of parameters, compliant impact models obtained using fractional calculus, however, can be advantageous since such models use fewer parameters and successfully capture the hereditary property. In this paper, we introduce the fractional Chebyshev collocation (FCC) method as an approximation tool for numerical simulation of several linear fractional viscoelastic compliant impact models in which the overall coefficient of restitution for the impact is studied as a function of the fractional model parameters for the first time. Other relevant impact characteristics such as hysteresis curves, impact force gradient, penetration and separation depths are also studied.

Micro-fabrication technology for piezoelectric film formation and its application to MEMS

OpenAIRE

一木, 正聡; 曹, 俊杰; 張, 麓〓; 王, 占杰; 前田, 龍太郎; Masaaki, ICHIKI; Jiunn Jye, TSAUR; Lulu, ZHANG; Zhang Jie, WANG; Ryutaro, MAEDA; 産業技術総合研究所; 産業技術総合研究所; 産業技術総合研究所; 東北大学; 産業技術総合研究所

2005-01-01

Technological problems for realization of Micro Electro-mechanical System (MEMS) are discussed and an introduction of smart materials (PZT) is encouraged. The film formation and micromaching technology are discussed in integration of PZT thin films into MEMS. Further developments are proposed on PZT micro sensors and actuators with special emphasis laid on exploration of new application fields of MEMS, such as scanning mirror. Internal stress is estimated and analyzed for the improvement of d...

High-power ultrashort fiber laser for solar cells micromachining

Science.gov (United States)

Lecourt, J.-B.; Duterte, C.; Liegeois, F.; Lekime, D.; Hernandez, Y.; Giannone, D.

2012-02-01

We report on a high-power ultra-short fiber laser for thin film solar cells micromachining. The laser is based on Chirped Pulse Amplification (CPA) scheme. The pulses are stretched to hundreds of picoseconds prior to amplification and can be compressed down to picosecond at high energy. The repetition rate is adjustable from 100 kHz to 1 MHz and the optical average output power is close to 13 W (before compression). The whole setup is fully fibred, except the compressor achieved with bulk gratings, resulting on a compact and reliable solution for cold ablation.

Numerical modelling of micro-machining of f.c.c. single crystal: Influence of strain gradients

KAUST Repository

Demiral, Murat; Roy, Anish; El Sayed, Tamer S.; Silberschmidt, Vadim V.

2014-01-01

of orthogonal micro-machining of f.c.c. single crystal copper was developed. The model was implemented in a commercial software ABAQUS/Explicit employing a user-defined subroutine VUMAT. Strain-gradient crystal-plasticity and conventional crystal

Feasibility of Frequency-Modulated Wireless Transmission for a Multi-Purpose MEMS-Based Accelerometer

Directory of Open Access Journals (Sweden)

Alessandro Sabato

2014-09-01

Full Text Available Recent advances in the Micro Electro-Mechanical System (MEMS technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM of civil engineering structures. To date, sensors’ low sensitivity and accuracy—especially at very low frequencies—have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor’s analog signals are converted to digital signals before radio-frequency (RF wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F instead of the conventional Analog to Digital Conversion (ADC. In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

U.S. Army Corrosion Office's storage and quality requirements for military MEMS program

Science.gov (United States)

Zunino, J. L., III; Skelton, D. R.

2007-04-01

As the Army transforms into a more lethal, lighter and agile force, the technologies that support these systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army and DOD will rely on heavily to accomplish these objectives. Conditions for utilization of MEMS by the military are unique. Operational and storage environments for the military are significantly different than those found in the commercial sector. Issues unique to the military include; high G-forces during gun launch, extreme temperature and humidity ranges, extended periods of inactivity (20 years plus) and interaction with explosives and propellants. The military operational environments in which MEMS will be stored or required to function are extreme and far surpass any commercial operating conditions. Security and encryption are a must for all MEMS communication, tracking, or data reporting devices employed by the military. Current and future military applications of MEMS devices include safety and arming devices, fuzing devices, various guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless Radio Frequency Identifications (RFIDs) and network systems, GPS's, radar systems, mobile base systems and information technology. MEMS embedded into these weapons systems will provide the military with new levels of speed, awareness, lethality, and information dissemination. The system capabilities enhanced by MEMS will translate directly into tactical and strategic military advantages.

Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplates

KAUST Repository

Lizardo, Ernesto B.

2013-01-01

Micro-electro-mechanical systems (MEMS) became possible thanks to the silicon based technology used to fabricate integrated circuits. Originally, MEMS fabrication was limited to silicon based techniques and materials, but the expansion of MEMS

MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

Science.gov (United States)

Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H; Peterson, Tracy C; Shul, Randy J; Ahlers, Catalina; Plut, Thomas A; Patrizi, Gary A

2013-12-03

In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

A Compliant Bistable Mechanism Design Incorporating Elastica Buckling Beam Theory and Pseudo-Rigid-Body Model

DEFF Research Database (Denmark)

Sönmez, Ümit; Tutum, Cem Celal

2008-01-01

In this work, a new compliant bistable mechanism design is introduced. The combined use of pseudo-rigid-body model (PRBM) and the Elastica buckling theory is presented for the first time to analyze the new design. This mechanism consists of the large deflecting straight beams, buckling beams...... and the buckling Elastica solution for an original compliant mechanism kinematic analysis. New compliant mechanism designs are presented to highlight where such combined kinematic analysis is required....

MEMS for Space Flight Applications

Science.gov (United States)

Lawton, R.

1998-01-01

Micro-Electrical Mechanical Systems (MEMS) are entering the stage of design and verification to demonstrate the utility of the technology for a wide range of applications including sensors and actuators for military, space, medical, industrial, consumer, automotive and instrumentation products.

Laser micromachining of sputtered DLC films

International Nuclear Information System (INIS)

Fu, Y.Q.; Luo, J.K.; Flewitt, A.J.; Ong, S.E.; Zhang, S.; Milne, W.I.

2006-01-01

DLC films with different thicknesses (from 100 nm to 1.9 μm) were deposited using sputtering of graphite target in pure argon atmosphere without substrate heating. Film microstructures (sp 2 /sp 3 ratio) and mechanical properties (modulus, hardness, stress) were characterized as a function of film thickness. A thin layer of aluminum about 60 nm was deposited on the DLC film surface. Laser micromachining of Al/DLC layer was performed to form microcantilever structures, which were released using a reactive ion etching system with SF 6 plasma. Due to the intrinsic stress in DLC films and bimorph Al/DLC structure, the microcantilevers bent up with different curvatures. For DLC film of 100 nm thick, the cantilever even formed microtubes. The relationship between the bimorph beam bending and DLC film properties (such as stress, modulus, etc.) were discussed in details

MEMS and mil/aero: technology push and market pull

Science.gov (United States)

Clifford, Thomas H.

2001-04-01

MEMS offers attractive solutions to high-density fluidics, inertial, optical, switching and other demanding military/aerospace (mil/aero) challenges. However, full acceptance must confront the realities of production-scale producibility, verifiability, testability, survivability, as well as long-term reliability. Data on these `..ilities' are crucial, and are central in funding and deployment decisions. Similarly, mil/aero users must highlight specific missions, environmental exposures, and procurement issues, as well as the quirks of its designers. These issues are particularly challenging in MEMS, because of the laws of physics and business economics, as well as the risks of deploying leading-edge technology into no-fail applications. This paper highlights mil/aero requirements, and suggests reliability/qualification protocols, to guide development effort and to reassure mil/aero users that MEMS labs are mindful of the necessary realities.

Amplitude saturation of MEMS resonators explained by autoparametric resonance

International Nuclear Information System (INIS)

Van der Avoort, C; Bontemps, J J M; Steeneken, P G; Le Phan, K; Van Beek, J T M; Van der Hout, R; Hulshof, J; Fey, R H B

2010-01-01

This paper describes a phenomenon that limits the power handling of MEMS resonators. It is observed that above a certain driving level, the resonance amplitude becomes independent of the driving level. In contrast to previous studies of power handling of MEMS resonators, it is found that this amplitude saturation cannot be explained by nonlinear terms in the spring constant or electrostatic force. Instead we show that the amplitude in our experiments is limited by nonlinear terms in the equation of motion which couple the in-plane length-extensional resonance mode to one or more out-of-plane (OOP) bending modes. We present experimental evidence for the autoparametric excitation of these OOP modes using a vibrometer. The measurements are compared to a model that can be used to predict a power-handling limit for MEMS resonators

Amplitude saturation of MEMS resonators explained by autoparametric resonance

Energy Technology Data Exchange (ETDEWEB)

Van der Avoort, C; Bontemps, J J M; Steeneken, P G; Le Phan, K; Van Beek, J T M [NXP Research, Eindhoven (Netherlands); Van der Hout, R; Hulshof, J [Department of Mathematics, VU University—Faculty of Sciences, De Boelelaan 1081a, 1081 HV Amsterdam (Netherlands); Fey, R H B, E-mail: cas.van.der.avoort@nxp.com [Department of Mechanical Engineering, Eindhoven University of Technology, PO Box 513, 5600 MB, Eindhoven (Netherlands)

2010-10-15

This paper describes a phenomenon that limits the power handling of MEMS resonators. It is observed that above a certain driving level, the resonance amplitude becomes independent of the driving level. In contrast to previous studies of power handling of MEMS resonators, it is found that this amplitude saturation cannot be explained by nonlinear terms in the spring constant or electrostatic force. Instead we show that the amplitude in our experiments is limited by nonlinear terms in the equation of motion which couple the in-plane length-extensional resonance mode to one or more out-of-plane (OOP) bending modes. We present experimental evidence for the autoparametric excitation of these OOP modes using a vibrometer. The measurements are compared to a model that can be used to predict a power-handling limit for MEMS resonators.

Avaliação da memória sob anestesia venosa total

Directory of Open Access Journals (Sweden)

Gulistan Aktas

2013-06-01

Full Text Available JUSTIFICATIVA E OBJETIVOS: Neste estudo, objetivamos avaliar a memória implícita e explícita em pacientes submetidos à cirurgia abdominal sob anestesia venosa total (AVT com propofol e remifentanil, na qual o nível de anestesia foi controlado pelo monitoramento do índice bispectral (BIS. MÉTODO: Anestesia venosa total foi administrada a 60 pacientes adultos para obter níveis de BIS de 40-60. Os pacientes foram randomicamente divididos em três grupos, de acordo com as gravações que ouviram. Os pacientes do grupo categoria (CT ouviram uma fita gravada contendo cinco nomes de animais. Os pacientes do grupo recordar palavras (RP ouviram uma fita gravada contendo cinco palavras de frequência média na língua turca, depois de adaptadas. Os pacientes do grupo controle (GC ouviram os sons do mar até o fim da cirurgia. Duas horas após a cirurgia, os testes foram administrados a cada paciente na sala de recuperação para avaliar a memória. RESULTADOS: Houve uma diferença entre os escores dos grupos CT e GC no Miniexame do Estado Mental (MMSE; todos os escores foram > 20. Os resultados dos testes de categoria e recordar palavras, aplicados para avaliar a memória implícita, não foram estatisticamente diferentes entre os grupos. Não houve evidência de memória implícita em nenhum dos pacientes. Um paciente lembrou-se de ouvir "o som de água" como uma prova de memória explícita. Onze pacientes declararam não ter sonhado. CONCLUSÕES: Apesar de não termos encontrado nenhuma evidência de memória implícita sob anestesia adequada com AVT, um paciente apresentou memória explícita. Embora a profundidade adequada da anestesia fornecida pelo monitoramento do BIS corrobore nossos resultados para a memória implícita, ela não explica os resultados para a memória explícita.

Integrated Magnetic MEMS Relays: Status of the Technology

Directory of Open Access Journals (Sweden)

Giuseppe Schiavone

2014-08-01

Full Text Available The development and application of magnetic technologies employing microfabricated magnetic structures for the production of switching components has generated enormous interest in the scientific and industrial communities over the last decade. Magnetic actuation offers many benefits when compared to other schemes for microelectromechanical systems (MEMS, including the generation of forces that have higher magnitude and longer range. Magnetic actuation can be achieved using different excitation sources, which create challenges related to the integration with other technologies, such as CMOS (Complementary Metal Oxide Semiconductor, and the requirement to reduce power consumption. Novel designs and technologies are therefore sought to enable the use of magnetic switching architectures in integrated MEMS devices, without incurring excessive energy consumption. This article reviews the status of magnetic MEMS technology and presents devices recently developed by various research groups, with key focuses on integrability and effective power management, in addition to the ability to integrate the technology with other microelectronic fabrication processes.

Micromachined Ultrasonic Transducers for 3-D Imaging

DEFF Research Database (Denmark)

Christiansen, Thomas Lehrmann

of state-of-the-art 3-D ultrasound systems. The focus is on row-column addressed transducer arrays. This previously sparsely investigated addressing scheme offers a highly reduced number of transducer elements, resulting in reduced transducer manufacturing costs and data processing. To produce...... such transducer arrays, capacitive micromachined ultrasonic transducer (CMUT) technology is chosen for this project. Properties such as high bandwidth and high design flexibility makes this an attractive transducer technology, which is under continuous development in the research community. A theoretical...... treatment of CMUTs is presented, including investigations of the anisotropic plate behaviour and modal radiation patterns of such devices. Several new CMUT fabrication approaches are developed and investigated in terms of oxide quality and surface protrusions, culminating in a simple four-mask process...

Sadhana | Indian Academy of Sciences

Indian Academy of Sciences (India)

Home; Journals; Sadhana. S Sam Baskar. Articles written in Sadhana. Volume 34 Issue 4 August 2009 pp 663-675. System integration design in MEMS – A case study of micromachined load cell · Shishir Kumar K P Venkatesh S Sam Baskar S P Madhavi · More Details Abstract Fulltext PDF. One of the critical issues in large ...

A surface-micromachining-based inertial micro-switch with compliant cantilever beam as movable electrode for enduring high shock and prolonging contact time

Energy Technology Data Exchange (ETDEWEB)

Xu, Qiu [National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronics Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 (China); Yang, Zhuoqing, E-mail: yzhuoqing@sjtu.edu.cn [National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronics Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 (China); Fu, Bo; Li, Jianhua; Wu, Hao [Huaihai Industrial Group Co., Ltd., Changzhi, Shanxi Province, 046012 (China); Zhang, Qihuan; Sun, Yunna; Ding, Guifu; Zhao, Xiaolin [National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronics Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240 (China)

2016-11-30

Highlights: • The designed cantilever beam attached to the proof mass can endure a larger shock acceleration (∼1000 g order of magnitude) compared to those traditional designs (∼100 g order of magnitude). • Effect of the pulse width on the threshold acceleration, the response time and the contact time is investigated. • A constraint sleeve structure is introduced to lower the off-axis sensitivity. - Abstract: A novel laterally-driven inertial micro-switch with two L-shaped elastic cantilever beams as the movable electrode, which is attached to the proof mass, is proposed in this paper. The advantage of this design is that the contact time of the inertial micro-switch can be prolonged. Meanwhile, the micro-switch can withstand a higher shock than the traditional designs whose cantilever beams are attached to the fixed electrode. The designed inertial micro-switch was simulated and optimized with ANSYS software and fabricated on a quartz substrate by surface micromachining technology. The simulated result demonstrates that the threshold acceleration (a{sub ths}) under stable switch-on state is about 288 g and the contact time is about 198 μs when the pulse width of acceleration loads is 1 ms. At the same time, it indicates that the threshold acceleration, the response time and the contact time of designed micro-switch all increase with the pulse width of acceleration loads. The simulation of impact process in non-sensitive direction shows that the introduced constraint sleeve structure in the novel inertial micro-switch can lower the off-axis sensitivity. The fabricated micro-switch prototype has been tested by a standard dropping hammer system under shock accelerations with various amplitudes and pulse widths. The experimental measurements show that the contact time is about 150 μs when the threshold acceleration is about 288 g. It also indicates that the response time and the contact time both increase with the pulse width, which is consistent with the

A Musical instrument in MEMS

NARCIS (Netherlands)

Engelen, Johannes Bernardus Charles; de Boer, Hans L.; de Boer, H.; Beekman, J.G.; Been, A.J.; Folkertsma, Gerrit Adriaan; Folkertsma, G.A.; Fortgens, L.; de Graaf, D.; Vocke, S.; Woldering, L.A.; Abelmann, Leon; Elwenspoek, Michael Curt

In this work we describe a MEMS instrument that resonates at audible frequencies, and with which music can be made. The sounds are generated by mechanical resonators and capacitive displacement sensors. Damping by air scales unfavourably for generating audible frequencies with small devices.

MEMS based digital transform spectrometers

Science.gov (United States)

Geller, Yariv; Ramani, Mouli

2005-09-01

Earlier this year, a new breed of Spectrometers based on Micro-Electro-Mechanical-System (MEMS) engines has been introduced to the commercial market. The use of these engines combined with transform mathematics, produces powerful spectrometers at unprecedented low cost in various spectral regions.

Aprendizado e memória Learning and memory

Directory of Open Access Journals (Sweden)

Paul Lombroso

2004-09-01

Full Text Available A memória é dividida de duas grandes formas: explícita e implícita. O hipocampo é necessário para a formação das memórias explícitas, ao passo que várias outras regiões do cérebro, incluindo o estriado, a amígdala e o nucleus accumbens, estão envolvidos na formação das memórias implícitas. A formação de todas as memórias requer alterações morfológicas nas sinapses: novas sinapses devem ser formadas ou antigas precisam ser fortalecidas. Considera-se que essas alterações reflitam a base celular subjacente das memórias persistentes. Consideráveis avanços têm ocorrido na última década em relação a nossa compreensão sobre as bases moleculares da formação dessas memórias. Um regulador-chave da plasticidade sináptica é uma via de sinalização que inclui a proteína-quinase ativada por mitógenos (MAP. Como essa via é necessária para a memória e o aprendizado normais, não é surpreendente que as mutações nos membros dessa via levem a prejuízos no aprendizado. A neurofibromatose, a síndrome de Coffin-Lowry e a de Rubinstein-Taybi são três exemplos de transtornos de desenvolvimento que apresentam mutações em componentes-chave na via de sinalização da proteína-quinase MAP.Memory is broadly divided into declarative and nondeclarative forms of memory. The hippocampus is required for the formation of declarative memories, while a number of other brain regions including the striatum, amygdala and nucleus accumbens are involved in the formation of nondeclarative memories. The formation of all memories require morphological changes of synapses: new ones must be formed or old ones strengthened. These changes are thought to reflect the underlying cellular basis for persistent memories. Considerable advances have occurred over the last decade in our understanding of the molecular bases of how these memories are formed. A key regulator of synaptic plasticity is a signaling pathway that includes the mitogen

Turbine airfoil with dual wall formed from inner and outer layers separated by a compliant structure

Science.gov (United States)

Campbell,; Christian X. , Morrison; Jay, A [Oviedo, FL

2011-12-20

A turbine airfoil usable in a turbine engine with a cooling system and a compliant dual wall configuration configured to enable thermal expansion between inner and outer layers while eliminating stress formation is disclosed. The compliant dual wall configuration may be formed a dual wall formed from inner and outer layers separated by a compliant structure. The compliant structure may be configured such that the outer layer may thermally expand without limitation by the inner layer. The compliant structure may be formed from a plurality of pedestals positioned generally parallel with each other. The pedestals may include a first foot attached to a first end of the pedestal and extending in a first direction aligned with the outer layer, and may include a second foot attached to a second end of the pedestal and extending in a second direction aligned with the inner layer.

Cryogenic MEMS Pressure Sensor, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — A directly immersible cryogenic MEMS pressure sensor will be developed. Each silicon die will contain a vacuum-reference and a tent-like membrane. Offsetting thermal...

Vortex-MEMS filters for wavelength-selective orbital-angular-momentum beam generation

DEFF Research Database (Denmark)

Paul, Sujoy; Lyubopytov, Vladimir; Schumann, Martin F.

2017-01-01

In this paper an on-chip device capable of wavelength-selective generation of vortex beams is demonstrated. The device is realized by integrating a spiral phase-plate onto a MEMS tunable Fabry-Perot filter. This vortex-MEMS filter, being capable of functioning simultaneously in wavelength...

Development of Dual-Axis MEMS Accelerometers for Machine Tools Vibration Monitoring

Directory of Open Access Journals (Sweden)

Chih-Yung Huang

2016-07-01

Full Text Available With the development of intelligent machine tools, monitoring the vibration by the accelerometer is an important issue. Accelerometers used for measuring vibration signals during milling processes require the characteristics of high sensitivity, high resolution, and high bandwidth. A commonly used accelerometer is the lead zirconate titanate (PZT type; however, integrating it into intelligent modules is excessively expensive and difficult. Therefore, the micro electro mechanical systems (MEMS accelerometer is an alternative with the advantages of lower price and superior integration. In the present study, we integrated two MEMS accelerometer chips into a low-pass filter and housing to develop a low-cost dual-axis accelerometer with a bandwidth of 5 kHz and a full scale range of ±50 g for measuring machine tool vibration. In addition, a platform for measuring the linearity, cross-axis sensitivity and frequency response of the MEMS accelerometer by using the back-to-back calibration method was also developed. Finally, cutting experiments with steady and chatter cutting were performed to verify the results of comparing the MEMS accelerometer with the PZT accelerometer in the time and frequency domains. The results demonstrated that the dual-axis MEMS accelerometer is suitable for monitoring the vibration of machine tools at low cost.

Laser-heating wire bonding on MEMS packaging

Directory of Open Access Journals (Sweden)

Yuetao Liu

2014-02-01

Full Text Available Making connections is critical in fabrication of MEMS (Micro-Electro-Mechanical Systems. It is also complicated, because the temperature during joining affects both the bond produced and the structure and mechanical properties of the moving parts of the device. Specifications for MEMS packaging require that the temperature not exceed 240 °C. However, usually, temperatures can reach up to 300 °C during conventional thermosonic wire bonding. Such a temperature will change the distribution of dopants in CMOS (Complementary Metal Oxide Semiconductor circuits. In this paper we propose a new heating process. A semiconductor laser (wavelength 808 nm is suggested as the thermal source for wire bonding. The thermal field of this setup was analyzed, and specific mathematical models of the field were built. Experimental results show that the heating can be focused on the bonding pad, and that much lower heat conduction occurs, compared with that during the normal heating method. The bond strength increases with increasing laser power. The bond strengths obtained with laser heating are slightly lower than those obtained with the normal heating method, but can still meet the strength requirements for MEMS.

Wireless MEMs BioSensor, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

MEMS Sensors and Actuators Laboratory (MSAL)

Data.gov (United States)

Federal Laboratory Consortium — The MEMS Sensors and Actuators Laboratory (MSAL) in the A.J. Clark School of Engineering at the University of Maryland (UMD) was established in January 2000. Our lab...

Fabrication of surface micromachined ain piezoelectric microstructures and its potential apllication to rf resonators

NARCIS (Netherlands)

Saravanan, S.; Saravanan, S.; Berenschot, Johan W.; Krijnen, Gijsbertus J.M.; Elwenspoek, Michael Curt

2005-01-01

We report on a novel microfabrication method to fabricate aluminum nitride (AlN) piezoelectric microstructures down to 2 microns size by a surface micromachining process. Highly c-axis oriented AlN thin films are deposited between thin Cr electrodes on polysilicon structural layers by rf reactive

A ABEn e a preservação da memória profissional: implantação do Centro de Memória da Enfermagem Brasileira

OpenAIRE

Santos, Tânia Cristina Franco

2013-01-01

Estudo histórico-social, que objetivou analisar e discutir a importância do Centro de Memória da Enfermagem Brasileira para preservação e divulgação da memória profissional. Utilizou-se como fontes de dados o documentário Associação Brasileira de Enfermagem: 1926-1976, além do Projeto de Implantação e do Relatório Técnico do Acervo Documental e Fônico do Centro de Memória, ambos arquivados no referido Centro. Os dados, coletados em junho de 2013, foram submetidos a crítica externa e interna, ...

Videometrics-based Detection of Vibration Linearity in MEMS Gyroscope

Directory of Open Access Journals (Sweden)

Yong Zhou

2011-05-01

Full Text Available MEMS gyroscope performs as a sort of sensor to detect angular velocity, with diverse applications in engineering including vehicle and intelligent traffic etc. A balanced vibration of driving module excited by electrostatic driving signal is the base MEMS gyroscope's performance. In order to analyze the linear property of vibration in MEMS Gyroscope, a method of computer vision measuring is applied with the help of high-speed vidicon to obtain video of linear vibration of driving module in gyroscope, under the driving voltage signal of inherent frequency and amplitude linearly increasing. By means of image processing, target identifying, and motion parameter extracting from the obtained video, vibration curve with time variation is acquired. And then, linearity of this vibration system can be analyzed by focusing on the amplitude value of vibration responding to the amplitude variation of driving voltage signal.

Modeling of biaxial gimbal-less MEMS scanning mirrors

Science.gov (United States)

von Wantoch, Thomas; Gu-Stoppel, Shanshan; Senger, Frank; Mallas, Christian; Hofmann, Ulrich; Meurer, Thomas; Benecke, Wolfgang

2016-03-01

One- and two-dimensional MEMS scanning mirrors for resonant or quasi-stationary beam deflection are primarily known as tiny micromirror devices with aperture sizes up to a few Millimeters and usually address low power applications in high volume markets, e.g. laser beam scanning pico-projectors or gesture recognition systems. In contrast, recently reported vacuum packaged MEMS scanners feature mirror diameters up to 20 mm and integrated high-reflectivity dielectric coatings. These mirrors enable MEMS based scanning for applications that require large apertures due to optical constraints like 3D sensing or microscopy as well as for high power laser applications like laser phosphor displays, automotive lighting and displays, 3D printing and general laser material processing. This work presents modelling, control design and experimental characterization of gimbal-less MEMS mirrors with large aperture size. As an example a resonant biaxial Quadpod scanner with 7 mm mirror diameter and four integrated PZT (lead zirconate titanate) actuators is analyzed. The finite element method (FEM) model developed and computed in COMSOL Multiphysics is used for calculating the eigenmodes of the mirror as well as for extracting a high order (n system inputs and scanner displacement as system output. By applying model order reduction techniques using MATLABR a compact state space system approximation of order n = 6 is computed. Based on this reduced order model feedforward control inputs for different, properly chosen scanner displacement trajectories are derived and tested using the original FEM model as well as the micromirror.

Polymer based flapping-wing robotic insect: Progress in design, fabrication, and characterization

Science.gov (United States)

Bontemps, A.; Vanneste, T.; Soyer, C.; Paquet, J. B.; Grondel, S.; Cattan, E.

2014-03-01

In the last decade, many researchers pursued the development of tiny flying robots inspired by natural flyers destined for the exploration of confined spaces, for example. Within this context, our main objective is to devise a flying robot bioinspired from insect in terms of size and wing kinematics using MEMS technologies. For this purpose, an original design has been developed around resonant thorax and wings by the way of an indirect actuation and a concise transmission whereas the all-polymer prototypes are obtained using a micromachining SU-8 photoresist process. This paper reports our recent progress on the design of a flapping-wing robotic insect as well as on the characterization of its performance. Prototypes with a wingspan of 3 cm and a mass of 22 mg are achieved. Due to the introduction of an innovative compliant link, large and symmetrical bending angles of 70° are obtained at a flapping frequency of 30 Hz along with passive wing torsion while minimizing its energy expenditure. Furthermore, it leads to a mean lift force representing up to 75 % of the prototype weight as measured by an in-house force sensor. Different improvements are currently underway to increase the power-to-weight ratio of the prototype and to obtain an airborne prototype.

A Novel Piezo-Actuator-Sensor Micromachine for Mechanical Characterization of Micro-Specimens

Directory of Open Access Journals (Sweden)

Leila Ladani

2010-12-01

Full Text Available Difficulties associated with testing and characterization of materials at microscale demands for new technologies and devices that are capable of measuring forces and strains at microscale. To address this issue, a novel electroactive-based micro-electro-mechanical machine is designed. The micromachine is comprised of two electroactive (piezoelectric micro-elements mounted on a rigid frame. Electrical activation of one of the elements causes it to expand and induce a stress in the intervening micro-specimen. The response of the microspecimen to the stress is measured by the deformation and thereby voltage/resistance induced in the second electro-active element. The concept is theoretically proven using analytical modeling in conjunction with non-linear, three dimensional finite element analyses for the micromachine. Correlation of the output voltage to the specimen stiffness is shown. It is also demonstrated through finite element and analytical analysis that this technique is capable of detecting non-linear behavior of materials. A characteristic curve for an isotropic specimen exhibiting linear elastic behavior is developed. Application of the proposed device in measuring coefficient of thermal expansion is explored and analytical analysis is conducted.

Compliant seal development

Science.gov (United States)

Hendricks, Robert C.

1993-10-01

The compliant metallic seal combines the noncontact feature of the labyrinth seal, the low leakage of a mechanical seal, and the compliant nature of the brush seal. It consists of several thin metallic elements or leaves mounted within a ring which is press fit into the housing, and in form, sort of resembles a lip seal sections wiping the shaft. A second set of overlapping cover leaves are placed on top of the shaft riding leaves which reduces leakage and provides stiffness. The leaves can be straight or angle cut. The shaft riding fingers are designed with mismatched curvature to provide lift off similar to the Rayleigh lift pads in mechanical seals with leading edge clearances nearly twice those of the trailing edge as as shown by Fleming to be optimal for gas flows in convergent seal passages. Leading edge clearances range from 300 to 500 microinches. Balance pockets beneath the leaves provide fluid film feed to the 'Rayleigh lift' surface and the proper balance ratio (mechanical seal) when combined with the static pressure and film pressure. The leaves flex in the radial direction and accommodate thermomechanical behavior as well as axial motion and angular misalignment. In the static mode, there is a net closing force on the leaves. The seals were tested to 70 psi at speeds to 16,000 rpm or surface speeds to 330 fps and temperatures from ambient to 440 F. A slow cycle through the rig critical at 10,000 rpm induced a radial vibration response of 0.004 to 0.005 inch were accommodated by the seal. Preliminary performance data are encouraging demonstrating hydrodynamic liftoff and noncontacting operation at pressure and speeds typical of gas turbine engines. The leakage performance data are significantly better than commercial labyrinth and brush seals which should be expected as this design incorporates the features of the low leakage face or mechanical seal along with the flexibility of the brush configuration.

Micromachining. CERN Courier, Jul-Aug 1995, v. 35(5)

International Nuclear Information System (INIS)

Wilson, Martin

1995-01-01

Full text: As well as making microcircuit components, X-ray lithography can also be used to make very small mechanical parts, either by using directly the exposed and developed photoresist, or as a mould to produce the component in another material such as ceramic or metal. In this revolutionary technology, metal components are made via the LIGA (Lithographic Galvanoformung und Abformung) technique in which the exposed and developed photoresist is coated with a conducting material and then electroplated, after which the resist is stripped away. In addition to fine size and precision resolution, X-rays offer the advantage of deep penetration and small scattering through the resist, so that patterns may be up to a millimetre deep, with very accurate straightness in directions parallel to the beam. Micromachining via LIGA was developed at KfK Karlsruhe; commercialization and further development is being vigorously pursued by the Institut fur Mikrotechnik in Mainz and by Microparts GmbH in Karlsruhe. Significant developments have been made at the Synchrotron Radiation Centre in Madison, Wisconsin, with new programmes start-ing at SRRC (Taiwan), CAMD (Baton Rouge, Louisiana), and LURE (Paris). There is now an active European Special Interest Group for LIGA. Commercially manufactured micromachines are starting to be used in sensors and connectors. The ability to integrate microdevices with microelectronics raises many interesting possibilities for the future, notably in medicine and for intelligent sensors. In all cases, however, widespread adoption will be governed by the ability to mass-produce cheaply, requiring high volume production. The high intensities of synchrotron radiation will assist in achieving these large throughputs

Synthesis and structure of large single crystalline silver hexagonal microplates suitable for micromachining

Energy Technology Data Exchange (ETDEWEB)

Lyutov, Dimitar L.; Genkov, Kaloyan V.; Zyapkov, Anton D.; Tsutsumanova, Gichka G.; Tzonev, Atanas N. [Department of Solid State Physics and Microelectronics, Faculty of Physics, University of Sofia, 5, J. Bouchier Blvd, Sofia (Bulgaria); Lyutov, Lyudmil G. [Department of General and Inorganic Chemistry, Faculty of Chemistry, University of Sofia, 1, J. Bouchier Blvd, Sofia (Bulgaria); Russev, Stoyan C., E-mail: scr@phys.uni-sofia.bg [Department of Solid State Physics and Microelectronics, Faculty of Physics, University of Sofia, 5, J. Bouchier Blvd, Sofia (Bulgaria)

2014-01-15

We report a simple one-step synthesis method of large single crystalline Ag (111) hexagonal microplates with sharp edges and a size of up to tens of microns. Single silver crystals were produced by reduction silver nitrate aqueous solution with 4-(methylamino)phenol sulfate. Scanning and transmission electron microscopy, energy-dispersive X-ray spectroscopy, selected area electron diffraction and optical microscopy techniques were combined to characterize the crystals. It is shown that the microplates can be easily dispersed and transferred as single objects onto different substrates and subsequently used as a high quality plasmonic starting material for micromachining of future nanocomponents, using modern top-down techniques like focused-ion beam milling and gas injection deposition. - Highlights: • Synthesis of large Ag hexagonal microplates with high crystallinity. • It is shown and discussed the role of twinning for the anisotropic 2D growth. • The Ag plates are stable in water and can be dispersed onto different substrates. • Their positioning and subsequent micromachining with FIB/GIS is demonstrated. • Suitable starting material for future plasmonic nanocomponents.

Movable MEMS Devices on Flexible Silicon

KAUST Repository

Ahmed, Sally

2013-05-05

Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS actuators and sensors can play critical role to extend the application areas of flexible electronics, fabricating movable MEMS devices on flexible substrates is highly challenging. Therefore, this thesis reports a process for fabricating free standing and movable MEMS devices on flexible silicon substrates; MEMS flexure thermal actuators have been fabricated to illustrate the viability of the process. Flexure thermal actuators consist of two arms: a thin hot arm and a wide cold arm separated by a small air gap; the arms are anchored to the substrate from one end and connected to each other from the other end. The actuator design has been modified by adding etch holes in the anchors to suit the process of releasing a thin layer of silicon from the bulk silicon substrate. Selecting materials that are compatible with the release process was challenging. Moreover, difficulties were faced in the fabrication process development; for example, the structural layer of the devices was partially etched during silicon release although it was protected by aluminum oxide which is not attacked by the releasing gas . Furthermore, the thin arm of the thermal actuator was thinned during the fabrication process but optimizing the patterning and etching steps of the structural layer successfully solved this problem. Simulation was carried out to compare the performance of the original and the modified designs for the thermal actuators and to study stress and temperature distribution across a device. A fabricated thermal actuator with a 250 μm long hot arm and a 225 μm long cold arm separated by a 3 μm gap produced a deflection of 3 μm before silicon release, however, the fabrication process must be optimized to obtain fully functioning

MEMS and Nano-Technology Clean Room

Data.gov (United States)

Federal Laboratory Consortium — The MEMS and Nano-Technology Clean Room is a state-of-the-art, 800 square foot, Class 1000-capable facility used for development of micro and sub-micro scale sensors...

Enabling MEMS technologies for communications systems

Science.gov (United States)

Lubecke, Victor M.; Barber, Bradley P.; Arney, Susanne

2001-11-01

Modern communications demands have been steadily growing not only in size, but sophistication. Phone calls over copper wires have evolved into high definition video conferencing over optical fibers, and wireless internet browsing. The technology used to meet these demands is under constant pressure to provide increased capacity, speed, and efficiency, all with reduced size and cost. Various MEMS technologies have shown great promise for meeting these challenges by extending the performance of conventional circuitry and introducing radical new systems approaches. A variety of strategic MEMS structures including various cost-effective free-space optics and high-Q RF components are described, along with related practical implementation issues. These components are rapidly becoming essential for enabling the development of progressive new communications systems technologies including all-optical networks, and low cost multi-system wireless terminals and basestations.

Integrated MEMS-based variable optical attenuator and 10Gb/s receiver

Science.gov (United States)

Aberson, James; Cusin, Pierre; Fettig, H.; Hickey, Ryan; Wylde, James

2005-03-01

MEMS devices can be successfully commercialized in favour of competing technologies only if they offer an advantage to the customer in terms of lower cost or increased functionality. There are limited markets where MEMS can be manufactured cheaper than similar technologies due to large volumes: automotive, printing technology, wireless communications, etc. However, success in the marketplace can also be realized by adding significant value to a system at minimal cost or leverging MEMS technology when other solutions simply will not work. This paper describes a thermally actuated, MEMS based, variable optical attenuator that is co-packaged with existing opto-electronic devices to develop an integrated 10Gb/s SONET/SDH receiver. The configuration of the receiver opto-electronics and relatively low voltage availability (12V max) in optical systems bar the use of LCD, EO, and electro-chromic style attenuators. The device was designed and fabricated using a silicon-on-insulator (SOI) starting material. The design and performance of the device (displacement, power consumption, reliability, physical geometry) was defined by the receiver parameters geometry. This paper will describe how these design parameters (hence final device geometry) were determined in light of both the MEMS device fabrication process and the receiver performance. Reference will be made to the design tools used and the design flow which was a joint effort between the MEMS vendor and the end customer. The SOI technology offered a robust, manufacturable solution that gave the required performance in a cost-effective process. However, the singulation of the devices required the development of a new singulation technique that allowed large volumes of silicon to be removed during fabrication yet still offer high singulation yields.

MEMS-based silicon cantilevers with integrated electrothermal heaters for airborne ultrafine particle sensing

Science.gov (United States)

Wasisto, Hutomo Suryo; Merzsch, Stephan; Waag, Andreas; Peiner, Erwin

2013-05-01

The development of low-cost and low-power MEMS-based cantilever sensors for possible application in hand-held airborne ultrafine particle monitors is described in this work. The proposed resonant sensors are realized by silicon bulk micromachining technology with electrothermal excitation, piezoresistive frequency readout, and electrostatic particle collection elements integrated and constructed in the same sensor fabrication process step of boron diffusion. Built-in heating resistor and full Wheatstone bridge are set close to the cantilever clamp end for effective excitation and sensing, respectively, of beam deflection. Meanwhile, the particle collection electrode is located at the cantilever free end. A 300 μm-thick, phosphorus-doped silicon bulk wafer is used instead of silicon-on-insulator (SOI) as the starting material for the sensors to reduce the fabrication costs. To etch and release the cantilevers from the substrate, inductively coupled plasma (ICP) cryogenic dry etching is utilized. By controlling the etching parameters (e.g., temperature, oxygen content, and duration), cantilever structures with thicknesses down to 10 - 20 μm are yielded. In the sensor characterization, the heating resistor is heated and generating thermal waves which induce thermal expansion and further cause mechanical bending strain in the out-of-plane direction. A resonant frequency of 114.08 +/- 0.04 kHz and a quality factor of 1302 +/- 267 are measured in air for a fabricated rectangular cantilever (500x100x13.5 μm3). Owing to its low power consumption of a few milliwatts, this electrothermal cantilever is suitable for replacing the current external piezoelectric stack actuator in the next generation of the miniaturized cantilever-based nanoparticle detector (CANTOR).

Handedness in shearing auxetics creates rigid and compliant structures

Science.gov (United States)

Lipton, Jeffrey Ian; MacCurdy, Robert; Manchester, Zachary; Chin, Lillian; Cellucci, Daniel; Rus, Daniela

2018-05-01

In nature, repeated base units produce handed structures that selectively bond to make rigid or compliant materials. Auxetic tilings are scale-independent frameworks made from repeated unit cells that expand under tension. We discovered how to produce handedness in auxetic unit cells that shear as they expand by changing the symmetries and alignments of auxetic tilings. Using the symmetry and alignment rules that we developed, we made handed shearing auxetics that tile planes, cylinders, and spheres. By compositing the handed shearing auxetics in a manner inspired by keratin and collagen, we produce both compliant structures that expand while twisting and deployable structures that can rigidly lock. This work opens up new possibilities in designing chemical frameworks, medical devices like stents, robotic systems, and deployable engineering structures.

Design and Fabrication of a Reconfigurable MEMS-Based Antenna

KAUST Repository

Martinez, Miguel Angel Galicia

2011-06-22

This thesis presents the design and fabrication of a customized in house Micro-Electro-Mechanical-Systems (MEMS) process based on-chip antenna that is both frequency and polarization reconfigurable. It is designed to work at both 60 GHz and 77 GHz through MEMS switches. This antenna can also work in both horizontal and vertical linear polarizations by utilizing a moveable plate. The design is intended for Wireless Personal Area Networks (WPAN) and automotive radar applications. Typical on-chip antennas are inefficient and difficult to reconfigure. Therefore, the focus of this work is to develop an efficient on-chip antenna solution, which is reconfigurable in frequency and in polarization. A fractal bowtie antenna is employed for this thesis, which achieves frequency reconfigurability through MEMS switches. The design is simulated in industry standard Electromagnetic (EM) simulator Ansoft HFSS. A novel concept for horizontal to vertical linear polarization agility is introduced which incorporates a moveable polymer plate. For this work, a microprobe is used to move the plate from the horizontal to vertical position. For testing purposes, a novel mechanism has been designed in order to feed the antenna with RF-probes in both horizontal and vertical positions. A simulated gain of approximately 0 dB is achieved at both target frequencies (60 and 77 GHz), in both horizontal and vertical positions. In all the cases mentioned above (both frequencies and positions), the antenna is well matched (< -10 dB) to the 50 Ω system impedance. Similarly, the radiation nulls are successfully shifted by changing the position of the antenna from horizontal to vertical. The complete design and fabrication of the reconfigurable MEMS antenna has been done at KAUST facilities. Some challenges have been encountered during its realization due to the immaturity of the customized MEMS fabrication process. Nonetheless, a first fabrication attempt has highlighted such shortcomings. According

Direct integration of MEMS, dielectric pumping and cell manipulation with reversibly bonded gecko adhesive microfluidics

International Nuclear Information System (INIS)

Warnat, S; King, H; Hubbard, T; Wasay, A; Sameoto, D

2016-01-01

We present an approach to form a microfluidic environment on top of MEMS dies using reversibly bonded microfluidics. The reversible polymeric microfluidics moulds bond to the MEMS die using a gecko-inspired gasket architecture. In this study the formed microchannels are demonstrated in conjunction with a MEMS mechanical single cell testing environment for BioMEMS applications. A reversible microfluidics placement technique with an x - y and rotational accuracy of  ±2 µ m and 1° respectively on a MEMS die was developed. No leaks were observed during pneumatic pumping of common cell media (PBS, sorbitol, water, seawater) through the fluidic channels. Thermal chevron actuators were successful operated inside this fluidic environment and a performance deviation of ∼15% was measured compared to an open MEMS configuration. Latex micro-spheres were pumped using traveling wave di-electrophoresis and compared to an open (no-microfluidics) configuration with velocities of 24 µ m s −1 and 20 µ m s −1 . (technical note)

Movable MEMS Devices on Flexible Silicon

KAUST Repository

Ahmed, Sally

2013-01-01

Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS

Modeling of a compliant joint in a Magnetic Levitation System for an endoscopic camera

NARCIS (Netherlands)

Simi, M.; Tolou, N.; Valdastri, P.; Herder, J.L.; Menciassi, A.; Dario, P.

2012-01-01

A novel compliant Magnetic Levitation System (MLS) for a wired miniature surgical camera robot was designed, modeled and fabricated. The robot is composed of two main parts, head and tail, linked by a compliant beam. The tail module embeds two magnets for anchoring and manual rough translation. The

FY1995 development of micromachine technology based on insects; 1995 nendo konchu wo kihan to suru micromachine gijutsu no kakuritsu to jitsuyoka

Energy Technology Data Exchange (ETDEWEB)

NONE

1997-03-01

If we develop micromachines by reducing simply the size of conventional mechanical systems, we cannot get sufficient performances of them because of scale-effect. Small natural creatures, insects, have very good structures and functions reasonable for their small size. In this research, basic characteristics of sensors, actuators, information processing functions, etc. of insects are studied and artificial systems similar to them are developed for industrial application. (1) Compound eyes: Insect compound eyes is the visual sensor which is composed of microlenses which are distributed three-dimensionally, receptors which vibrate with small amplitude around an optical axis and neural networks. In this research, the large scale model (several centimeters sized) of insect compound eyes has been developed. (2) Pheromone sensor: Pheromone gas sensor has been made of real male silkworm moth antenae. This sensor has been proved to work well as the female pheromone detector. This sensor was installed at the nose part of a wheeled mobile robot and this robot was observed to act like a real silkworm moth subjected to female pheromone stream. (3) Electrostatic microactuator: Generally speaking, high voltage(higher than 100V) electric power is necessary to actuate the electrostatic actuator. It was considered to be impossible to actuate them directly from CMOS. In this research, a new electrostatic actuator which can be actuated with less than 10V voltage can cause a fairly large displacement. (4) Hydraulic actuator: For micromachines, hydraulic pressure will be applicable for actuation. Structures may be simple and scale effect may give an advantageous characteristics for microsize. A butterfly-type flying robot was developed and it flied up along a vertical bar. (NEDO)

Resonant Magnetic Field Sensors Based On MEMS Technology

Directory of Open Access Journals (Sweden)

Elías Manjarrez

2009-09-01

Full Text Available Microelectromechanical systems (MEMS technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

Resonant Magnetic Field Sensors Based On MEMS Technology

Science.gov (United States)

Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías

2009-01-01

Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480

A Compact and Low-Cost MEMS Loudspeaker for Digital Hearing Aids.

Science.gov (United States)

Sang-Soo Je; Rivas, F; Diaz, R E; Jiuk Kwon; Jeonghwan Kim; Bakkaloglu, B; Kiaei, S; Junseok Chae

2009-10-01

A microelectromechanical-systems (MEMS)-based electromagnetically actuated loudspeaker to reduce form factor, cost, and power consumption, and increase energy efficiency in hearing-aid applications is presented. The MEMS loudspeaker has multilayer copper coils, an NiFe soft magnet on a thin polyimide diaphragm, and an NdFeB permanent magnet on the perimeter. The coil impedance is measured at 1.5 Omega, and the resonant frequency of the diaphragm is located far from the audio frequency range. The device is driven by a power-scalable, 0.25-mum complementary metal-oxide semiconductor class-D SigmaDelta amplifier stage. The class-D amplifier is formed by a differential H-bridge driven by a single bit, pulse-density-modulated SigmaDelta bitstream at a 1.2-MHz clock rate. The fabricated MEMS loudspeaker generates more than 0.8-mum displacement, equivalent to 106-dB sound pressure level (SPL), with 0.13-mW power consumption. Driven by the SigmaDelta class-D amplifier, the MEMS loudspeaker achieves measured 65-dB total harmonic distortion (THD) with a measurement uncertainty of less than 10%. Energy-efficient and cost-effective advanced hearing aids would benefit from further miniaturization via MEMS technology. The results from this study appear very promising for developing a compact, mass-producible, low-power loudspeaker with sufficient sound generation for hearing-aid applications.

The effects of initial rise and axial loads on MEMS arches

KAUST Repository

Tella, Sherif Adekunle; Hajjaj, Amal Z.; Younis, Mohammad I.

2017-01-01

. This paper aims to investigate in depth the influence of the competing effects of initial rise and axial loads on the mechanical behavior of micromachined arches; mainly their static deflection and resonant frequencies. Based on analytical solutions

Electroplating of low stress permalloy for MEMS

International Nuclear Information System (INIS)

Zhang Yonghua; Ding Guifu; Cai Yuli; Wang Hong; Cai Bingchu

2006-01-01

With the wafer-bending method and spectrophotometry, the internal stress in electroplated Ni-Fe alloy for MEMS has been investigated as a function of bath concentration. This investigation demonstrated that low concentration plating solution is useful for the decrease of the residual stress in the electrodeposits, and the stress could further decrease with an increase of saccharin additive content. And the change of stress from tensile to compressive was not observed with the increase of the additive content in plating path. The low stress permalloy (Ni 81 Fe 19 ) was reached in our experimental conditions. A bistable electromagnetic RF MEMS switch with deformation-free bilayer cantilever beam was fabricated successfully by electroplated permalloy

Using the Wiimote to Learn MEMS in a Physics Degree Program

Science.gov (United States)

Sánchez-Azqueta, Carlos; Gimeno, Cecilia; Celma, Santiago; Aldea, Concepción

2016-01-01

This paper describes a learning experience designed to introduce students in a Micro- and Nanosystems course in a Physics Bachelor's degree program to the use of professional tools for the design and characterization of micro-electromechanical systems (MEMS) through a specific commercial case: the MEMS used by the well-known gaming platform…

Stiffness characteristics of compliant three segment leg with the self-stable region in slow and fast running

Energy Technology Data Exchange (ETDEWEB)

Kwak, Oh Seok; Ha, Sung Mok; Lee, Dong Ha [Convergence Research Center for WellnessDaegu Gyeongbuk Institute of Science and TechnologyDaegu (Korea, Republic of)

2016-12-15

In this paper, we propose the stiffness characteristics of compliant three segment leg that can have a self-stable region in slow and fast running. This proposition can contribute to reducing the control effort and enhancing the locomotion energy efficiency for the compliant three segment legged robot in slow and fast running. Previous research indicated that the running self-stable region of the spring-mass system is located in a relatively fast running region and that of the two segment leg is located in a relatively slow running region. In this paper, we analyze the stiffness characteristics of the spring-mass system and the two segment leg to explain the previous research results. From this analysis, we propose the stiffness characteristics of the compliant three segment leg with a self-stable region in slow and fast running. We further design the compliant three segment leg based on this proposition and check its structural stability. We examine the running self-stable region of this compliant three segment leg to determine whether it has a self-stable region in slow and fast running. We also examine the walking self-stable region of this compliant three segment leg.

Recent advances in MEMS radiation detectors for improving radiation safety in nuclear reactors

International Nuclear Information System (INIS)

Bhisikar, Abhay

2016-01-01

MEMS (micro-electro-mechanical-system) is a core technology that leverages integrated circuit (IC) fabrication technology, builds ultra-miniaturized components and, enables radical new system applications. When considering MEMS radiation detectors; they are the specific micromechanical structures which are designed to sense doses of radiations. The present article reviews the most recent progress made in the domain of MEMS ionizing radiation sensors at international level for nuclear reactors which can be relevant to Indian context. (author)

Fractal Structures For Mems Variable Capacitors

KAUST Repository

Elshurafa, Amro M.; Radwan, Ahmed Gomaa Ahmed; Emira, Ahmed A.; Salama, Khaled N.

2014-01-01

In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure, wherein the capacitor body has an upper first metal plate with a fractal shape