WorldWideScience

Sample records for microelectronic device manufacturing

  1. Microelectronics to nanoelectronics materials, devices & manufacturability

    CERN Document Server

    Kaul, Anupama B

    2012-01-01

    Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena.Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology's Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and

  2. Free-world microelectronic manufacturing equipment

    Science.gov (United States)

    Kilby, J. S.; Arnold, W. H.; Booth, W. T.; Cunningham, J. A.; Hutcheson, J. D.; Owen, R. W.; Runyan, W. R.; McKenney, Barbara L.; McGrain, Moira; Taub, Renee G.

    1988-12-01

    Equipment is examined and evaluated for the manufacture of microelectronic integrated circuit devices and sources for that equipment within the Free World. Equipment suitable for the following are examined: single-crystal silicon slice manufacturing and processing; required lithographic processes; wafer processing; device packaging; and test of digital integrated circuits. Availability of the equipment is also discussed, now and in the near future. Very adequate equipment for most stages of the integrated circuit manufacturing process is available from several sources, in different countries, although the best and most widely used versions of most manufacturing equipment are made in the United States or Japan. There is also an active market in used equipment, suitable for manufacture of capable integrated circuits with performance somewhat short of the present state of the art.

  3. Photopolymerizable liquid encapsulants for microelectronic devices

    Science.gov (United States)

    Baikerikar, Kiran K.

    2000-10-01

    Plastic encapsulated microelectronic devices consist of a silicon chip that is physically attached to a leadframe, electrically interconnected to input-output leads, and molded in a plastic that is in direct contact with the chip, leadframe, and interconnects. The plastic is often referred to as the molding compound, and is used to protect the chip from adverse mechanical, thermal, chemical, and electrical environments. Encapsulation of microelectronic devices is typically accomplished using a transfer molding process in which the molding compound is cured by heat. Most transfer molding processes suffer from significant problems arising from the high operating temperatures and pressures required to fill the mold. These aspects of the current process can lead to thermal stresses, incomplete mold filling, and wire sweep. In this research, a new strategy for encapsulating microelectronic devices using photopolymerizable liquid encapsulants (PLEs) has been investigated. The PLEs consist of an epoxy novolac-based vinyl ester resin (˜25 wt.%), fused silica filler (70--74 wt.%), and a photoinitiator, thermal initiator, and silane coupling agent. For these encapsulants, the use of light, rather than heat, to initiate the polymerization allows precise control over when the reaction starts, and therefore completely decouples the mold filling and the cure. The low viscosity of the PLEs allows for low operating pressures and minimizes problems associated with wire sweep. In addition, the in-mold cure time for the PLEs is equivalent to the in-mold cure times of current transfer molding compounds. In this thesis, the thermal and mechanical properties, as well as the viscosity and adhesion of photopolymerizable liquid encapsulants, are reported in order to demonstrate that a UV-curable formulation can have the material properties necessary for microelectronic encapsulation. In addition, the effects of the illumination time, postcure time, fused silica loading, and the inclusion

  4. Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

    Energy Technology Data Exchange (ETDEWEB)

    Smith, J.H.

    1996-11-01

    An overview of the surface micromachining program at the Microelectronics Development Laboratory of Sandia National Laboratories is presented. Development efforts are underway for a variety of surface micromachined sensors and actuators for both defense and commercial applications. A technology that embeds micromechanical devices below the surface of the wafer prior to microelectronics fabrication has been developed for integrating microelectronics with surface-micromachined micromechanical devices. The application of chemical-mechanical polishing to increase the manufacturability of micromechanical devices is also presented.

  5. Laser processing of ceramics for microelectronics manufacturing

    Science.gov (United States)

    Sposili, Robert S.; Bovatsek, James; Patel, Rajesh

    2017-03-01

    Ceramic materials are used extensively in the microelectronics, semiconductor, and LED lighting industries because of their electrically insulating and thermally conductive properties, as well as for their high-temperature-service capabilities. However, their brittleness presents significant challenges for conventional machining processes. In this paper we report on a series of experiments that demonstrate and characterize the efficacy of pulsed nanosecond UV and green lasers in machining ceramics commonly used in microelectronics manufacturing, such as aluminum oxide (alumina) and aluminum nitride. With a series of laser pocket milling experiments, fundamental volume ablation rate and ablation efficiency data were generated. In addition, techniques for various industrial machining processes, such as shallow scribing and deep scribing, were developed and demonstrated. We demonstrate that lasers with higher average powers offer higher processing rates with the one exception of deep scribes in aluminum nitride, where a lower average power but higher pulse energy source outperformed a higher average power laser.

  6. Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

    Science.gov (United States)

    Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

    2018-02-01

    The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

  7. Improved method for detection of “hot spots” in microelectronic devices

    Directory of Open Access Journals (Sweden)

    Popov V. M.

    2008-06-01

    Full Text Available New method of liquid crystal thermography of “hot spots” in crystals of microelectronic products have been developed. The method is based on the use of local cholesteric phase image of “hot spot” in transparent smectic phase of cholesteric liquid crystal against a background of clearly visible topological elements on the surface of microelectronic device crystal. Examples of “hot spot” images in crystals of different types of integrated circuits are shown.

  8. Giant microelectronics

    International Nuclear Information System (INIS)

    Della Sala, D.; Privato, C.; Di Lazzaro, P.; Fortunato, G.

    1999-01-01

    Giant microelectronics, on which the technology of flat liquid-crystal screens is based, is an example of fruitful interaction among independently-developed technologies, in this case thin film micro devices and laser applications. It typifies the interdisciplinary approach needed to produce innovations in microelectronics [it

  9. Ion implantation for microelectronics

    International Nuclear Information System (INIS)

    Dearnaley, G.

    1977-01-01

    Ion implantation has proved to be a versatile and efficient means of producing microelectronic devices. This review summarizes the relevant physics and technology and assesses the advantages of the method. Examples are then given of widely different device structures which have been made by ion implantation. While most of the industrial application has been in silicon, good progress continues to be made in the more difficult field of compound semiconductors. Equipment designed for the industrial ion implantation of microelectronic devices is discussed briefly. (Auth.)

  10. Enabling laser applications in microelectronics manufacturing

    Science.gov (United States)

    Delmdahl, Ralph; Brune, Jan; Fechner, Burkhard; Senczuk, Rolf

    2016-02-01

    In this experimental study, we report on high-pulse-energy excimer laser drilling into high-performance build-up films which are pivotal in microelectronics manufacturing. Build-up materials ABF-GX13 from Ajinomoto as well as ZS-100 from Zeon Corporation are evaluated with respect to their viability for economic excimer laser-based micro-via formation. Excimer laser mask imaging projection at laser wavelengths of 193, 248 and 308 nm is employed to generate matrices of smaller micro-vias with different diameters and via pitches. High drilling quality is achievable for all excimer laser wavelengths with the fastest ablation rates measured in the case of 248 and 308 nm wavelengths. The presence of glass fillers in build-up films as in the ABF-GX13 material poses some limitations to the minimum achievable via diameter. However, surprisingly good drilling results are obtainable as long as the filler dimensions are well below the diameter of the micro-vias. Sidewall angles of vias are controllable by adjusting the laser energy density and pulse number. In this work, the structuring capabilities of excimer lasers in build-up films as to taper angle variations, attainable via diameters, edge-stop behavior and ablation rates will be elucidated.

  11. Adhesion-delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices

    International Nuclear Information System (INIS)

    Khanna, V K

    2011-01-01

    Physico-chemical mechanisms of adhesion and debonding at the various surfaces and interfaces of semiconductor devices, integrated circuits and microelectromechanical systems are systematically examined, starting from chip manufacturing and traversing the process stages to the ultimate finished product. Sources of intrinsic and thermal stresses in these devices are pointed out. Thin film ohmic contacts to the devices call for careful attention. The role of an adhesion layer in multilayer metallization schemes is highlighted. In packaged devices, sites facing potential risks of delamination are indicated. As MEMS devices incorporate moving parts, there are additional issues due to adhesion of suspended structures to surfaces in the vicinity, both during chip fabrication and their subsequent operation. Proper surface treatments for preventing adhesion together with design considerations for overcoming stiction pave the way to reliable functioning of these devices. Adhesion-delamination issues in microelectronics and MEMS continue to pose significant challenges to both design and process engineers. This paper is an attempt to survey the adhesion characteristics of materials, their compatibilities and limitations and look at future research trends. In addition, it addresses some of the techniques for improved or reduced adhesion, as demanded by the situation. The paper encompasses fundamental aspects to contemporary applications.

  12. Automatic differentiation for gradient-based optimization of radiatively heated microelectronics manufacturing equipment

    Energy Technology Data Exchange (ETDEWEB)

    Moen, C.D.; Spence, P.A.; Meza, J.C.; Plantenga, T.D.

    1996-12-31

    Automatic differentiation is applied to the optimal design of microelectronic manufacturing equipment. The performance of nonlinear, least-squares optimization methods is compared between numerical and analytical gradient approaches. The optimization calculations are performed by running large finite-element codes in an object-oriented optimization environment. The Adifor automatic differentiation tool is used to generate analytic derivatives for the finite-element codes. The performance results support previous observations that automatic differentiation becomes beneficial as the number of optimization parameters increases. The increase in speed, relative to numerical differences, has a limited value and results are reported for two different analysis codes.

  13. Investigation of “benign” ionic content in epoxy that induces microelectronic device failure

    Science.gov (United States)

    Gregory T. Schueneman; Jeffery Kingsbury; Edmund Klinkerch

    2011-01-01

    Microelectronics and the devices dependent upon them have the extremely challenging requirements of becoming more capable and less expensive every year. This drives the industry to pack more functions into an ever smaller footprint until the next technological revolution. Adding to this situation is the removal of lead from the bill of materials followed closely by...

  14. Nanoelectronics: The perspective in microelectronics

    International Nuclear Information System (INIS)

    Mutihac, R.; Mutihac, R.C.; Cicuttin, A.; Colavita, A.A.

    2001-10-01

    The present survey briefly presents the-state-of-the-art in microelectronics, invokes physical considerations in estimating the intrinsic limits of present microelectronic devices, and highlights the future trends in the perspectives of the incoming nanoscale technologies. In order to design artificial systems with molecular precision, molecular brand new engineering methods must be developed, that is, to hold, position, and assemble nanoscale parts in compliance with the laws of physics. In the framework of the nanoscale technologies, the thermodynamically reversible single electron switching systems are considered as ultimate evolutionary end point of electronic logic devices built up at molecular level. (author)

  15. Microelectronic systems 3 checkbook

    CERN Document Server

    Vears, R E

    1985-01-01

    Microelectronic Systems 3: Checkbook aims to extend the range of hardware, software, and interfacing techniques developed at level 2. This book concentrates on the highly popular 6502, Z80, and 6800 microprocessors and contains approximately 70 tested programs that may be used with little or no modification on most systems based on these microprocessors. This text also covers the main points concerned with computer hardware configuration, interfacing devices, subroutines and the stack, polling and interrupts, microelectronic stores, and address decoding and organization. Each chapter of the b

  16. Advanced Microelectronics Technologies for Future Small Satellite Systems

    Science.gov (United States)

    Alkalai, Leon

    1999-01-01

    Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

  17. III-V microelectronics

    CERN Document Server

    Nougier, JP

    1991-01-01

    As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in particular is well suited for Ultra Large Scale Integration processes. However, a number of III-V compound semiconductor devices and circuits have recently been built, and the contributions in this volume are devoted to those types of materials, which offer a number of interesting properties. Taking into account the great variety of problems encountered and of their mutual correlations when fabricating a circuit or even a device, most of the aspects of III-V microelectronics, from fundamental p

  18. Microelectronics and nanoelectronics trends, and applications to HEP instrumentation

    CERN Multimedia

    CERN. Geneva

    2004-01-01

    Lecture 1 : Microelectronics and HEP instrumentation CMOS technology has been the leading technology in microelectronics for more that 30 years thanks to its outstanding capability to miniaturization and low power consumption. A brief history of the microelectronics semiconductor industry is presented with applications for LEP and LHC experiments. Lecture 2: Future trends in microelectronics and nanoelectronics Trends in miniaturization point to the fabrication of ULSI nanoscale CMOS circuits by the end of the decade. Device issues and quantum effects in nanoscale MOS transistor will be discussed. Beyond CMOS technology, several technology avenues based on nanotechnology are under investigation. We will present some promising nanoelectronic devices and circuits based on Single Electron Tunneling (SET) transistor, nanowire, quantum dot and carbon nanotubes. Lecture 3: Monolithic pixel detectors Microvertex detectors for particle physics experiments currently uses hybrid silicon pixel detector. Novel emerging m...

  19. Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics

    Science.gov (United States)

    Fu, Haoran; Nan, Kewang; Bai, Wubin; Huang, Wen; Bai, Ke; Lu, Luyao; Zhou, Chaoqun; Liu, Yunpeng; Liu, Fei; Wang, Juntong; Han, Mengdi; Yan, Zheng; Luan, Haiwen; Zhang, Yijie; Zhang, Yutong; Zhao, Jianing; Cheng, Xu; Li, Moyang; Lee, Jung Woo; Liu, Yuan; Fang, Daining; Li, Xiuling; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

    2018-03-01

    Three-dimensional (3D) structures capable of reversible transformations in their geometrical layouts have important applications across a broad range of areas. Most morphable 3D systems rely on concepts inspired by origami/kirigami or techniques of 3D printing with responsive materials. The development of schemes that can simultaneously apply across a wide range of size scales and with classes of advanced materials found in state-of-the-art microsystem technologies remains challenging. Here, we introduce a set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres. The approaches rely on elastomer platforms deformed in different time sequences to elastically alter the 3D geometries of supported mesostructures via nonlinear mechanical buckling. Over 20 examples have been experimentally and theoretically investigated, including mesostructures that can be reshaped between different geometries as well as those that can morph into three or more distinct states. An adaptive radiofrequency circuit and a concealable electromagnetic device provide examples of functionally reconfigurable microelectronic devices.

  20. Wire bonding in microelectronics

    CERN Document Server

    Harman, George G

    2010-01-01

    Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

  1. Performance Evaluation of Management Environment in Microelectronics Enterprise

    OpenAIRE

    Hui-ying Gao

    2013-01-01

    For the microelectronics manufacturing industries that have uncertain demand, high volume cost and Oligarchs characteristics, we often discuss the possibility of competitors on the capacity of strategy. First of all we use the industry data to analysis the manufacturing cost, demand and the historical situation of the revenue and we also discuss the influence about the uncertain demand and high volume cost to the industrial structure. Secondly, it put the individual manufacturer not consideri...

  2. Future trends in microelectronics journey into the unknown

    CERN Document Server

    Xu, Jimmy; Zaslavsky, Alexander

    2016-01-01

    Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals. The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities.

  3. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  4. Modern Microelectronics as Hardware Face of Information Technologies

    NARCIS (Netherlands)

    Jozwiak, L.; Luba, T.; Zbierzchowski, B.

    2000-01-01

    Development trends of contemporary microelectronics, as well as its influence on development of widely grasped information systems are discussed. It was proved, that about this development decide not only quantitative, but also qualitative reasons, such as technology of manufacturing and technology

  5. Radiation effects on microelectronics in space

    International Nuclear Information System (INIS)

    Srour, J.R.; McGarrity, J.M.

    1988-01-01

    The basic mechanisms of space radiation effects on microelectronics are reviewed in this paper. Topics discussed include the effects of displacement damage and ionizing radiation on devices and circuits, single event phenomena, dose enhancement, radiation effects on optoelectronic devices and passive components, hardening approaches, and simulation of the space radiation environment. A summary is presented of damage mechanisms that can cause temporary or permanent failure of devices and circuits operating in space

  6. CRRES microelectronics test package (MEP)

    International Nuclear Information System (INIS)

    Mullen, E.G.; Ray, K.P.

    1993-01-01

    The Microelectronics Test Package (MEP) flown on board the Combined Release and Radiation Effects Satellite (CRRES) contained over 60 device types and approximately 400 total devices which were tested for both single event upset (SEU) and total dose (parametric degradation and annealing). A description of the experiment, the method of testing devices, and the structure of data acquisition are presented. Sample flight data are shown. These included SEUs from a GaAs 1 K RAM during the March 1991 solar flare, and a comparison between passive shielding and a specially designed spot shielding package

  7. Moore's law and the impact on trusted and radiation-hardened microelectronics.

    Energy Technology Data Exchange (ETDEWEB)

    Ma, Kwok Kee

    2011-12-01

    In 1965 Gordon Moore wrote an article claiming that integrated circuit density would scale exponentially. His prediction has remained valid for more than four decades. Integrated circuits have changed all aspects of everyday life. They are also the 'heart and soul' of modern systems for defense, national infrastructure, and intelligence applications. The United States government needs an assured and trusted microelectronics supply for military systems. However, migration of microelectronics design and manufacturing from the United States to other countries in recent years has placed the supply of trusted microelectronics in jeopardy. Prevailing wisdom dictates that it is necessary to use microelectronics fabricated in a state-of-the-art technology for highest performance and military system superiority. Close examination of silicon microelectronics technology evolution and Moore's Law reveals that this prevailing wisdom is not necessarily true. This presents the US government the possibility of a totally new approach to acquire trusted microelectronics.

  8. 3D Ceramic Microfluidic Device Manufacturing

    International Nuclear Information System (INIS)

    Natarajan, Govindarajan; Humenik, James N

    2006-01-01

    Today, semiconductor processing serves as the backbone for the bulk of micromachined devices. Precision lithography and etching technology used in the semiconductor industry are also leveraged by alternate techniques like electroforming and molding. The nature of such processing is complex, limited and expensive for any manufacturing foundry. This paper details the technology elements developed to manufacture cost effective and versatile microfluidic devices for applications ranging from medical diagnostics to characterization of bioassays. Two applications using multilayer ceramic technology to manufacture complex 3D microfluidic devices are discussed

  9. Microelectronics in energy technology

    Energy Technology Data Exchange (ETDEWEB)

    Oeding, D; Jesse, G

    1984-07-01

    This meeting, which will take place on the 16th and 17th of October 1984 at the Old Opera House at Frankfurt on Main, in the context of the VDE Congress, will consist of 14 lectures on the state of the application of microelectronics to energy technology, and give its participants information on and a chance for discussion of this subject. The meeting will cover the following subjects: Microelectronics in energy supply undertakings; Microelectronics in the automation of power stations; Microelectronics in switchgear and transmission networks; Microelectronics in measurement technology; Microelectronics in lighting technology; Microelectronics in drive technology; Microelectronics in railway technology. The following shortened versions of these lectures are intended to motivate people to visit this event and to prepare contributions to and questions for the discussions.

  10. High-speed high-efficiency 500-W cw CO2 laser hermetization of metal frames of microelectronics devices

    Science.gov (United States)

    Levin, Andrey V.

    1996-04-01

    High-speed, efficient method of laser surface treatment has been developed using (500 W) cw CO2 laser. The principal advantages of CO2 laser surface treatment in comparison with solid state lasers are the basis of the method. It has been affirmed that high efficiency of welding was a consequence of the fundamental properties of metal-IR-radiation (10,6 mkm) interaction. CO2 laser hermetization of metal frames of microelectronic devices is described as an example of the proposed method application.

  11. Enhancement of microelectronic device performances by photothermal annealing under SiCl4 ambient

    International Nuclear Information System (INIS)

    Hassen, M.; Ben Jaballah, A.; Hajji, M.; Ezzaouia, H.

    2006-01-01

    The use of low cost silicon wafers seems to be very attractive for photovoltaic and microelectronic devices. However, this material is widely contaminated by different impurities particularly transitions metals, which deteriorate the lifetimes and the bulk diffusion lengths of the minority charge carriers. One possible way to overcome this undesirable behavior is to include an efficient purification technique in the process of device fabrication. In this work, we present the effect of photothermal treatments of monocrystalline Czochralski silicon substrates under SiCl 4 /N 2 atmosphere using a thin sacrificial porous silicon layer. The main results show a decrease of the resistivity over 40 μm depth. The Hall mobility of the majority charge carriers is improved from 300 to 1417 cm 2 V -1 s -1 . The capacitance-voltage (C-V) characteristics of metal/SiO 2 /Si (MIS) structures indicate a decrease of carrier concentration which confirms the results obtained by Hall Effect and Van Der Pauw method. The reduction of boron concentration in Czochralski silicon may reduce boron- and oxygen related metastable defect centers

  12. Fundamentals of semiconductor manufacturing and process control

    CERN Document Server

    May, Gary S

    2006-01-01

    A practical guide to semiconductor manufacturing from process control to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Control covers all issues involved in manufacturing microelectronic devices and circuits, including fabrication sequences, process control, experimental design, process modeling, yield modeling, and CIM/CAM systems. Readers are introduced to both the theory and practice of all basic manufacturing concepts. Following an overview of manufacturing and technology, the text explores process monitoring methods, including those that focus on product wafers and those that focus on the equipment used to produce wafers. Next, the text sets forth some fundamentals of statistics and yield modeling, which set the foundation for a detailed discussion of how statistical process control is used to analyze quality and improve yields. The discussion of statistical experimental design offers readers a powerful approach for systematically varying controllable p...

  13. A manufacturable process integration approach for graphene devices

    Science.gov (United States)

    Vaziri, Sam; Lupina, Grzegorz; Paussa, Alan; Smith, Anderson D.; Henkel, Christoph; Lippert, Gunther; Dabrowski, Jarek; Mehr, Wolfgang; Östling, Mikael; Lemme, Max C.

    2013-06-01

    In this work, we propose an integration approach for double gate graphene field effect transistors. The approach includes a number of process steps that are key for future integration of graphene in microelectronics: bottom gates with ultra-thin (2 nm) high-quality thermally grown SiO2 dielectrics, shallow trench isolation between devices and atomic layer deposited Al2O3 top gate dielectrics. The complete process flow is demonstrated with fully functional GFET transistors and can be extended to wafer scale processing. We assess, through simulation, the effects of the quantum capacitance and band bending in the silicon substrate on the effective electric fields in the top and bottom gate oxide. The proposed process technology is suitable for other graphene-based devices such as graphene-based hot electron transistors and photodetectors.

  14. Microelectronic test structures for CMOS technology

    CERN Document Server

    Ketchen, Mark B

    2011-01-01

    Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance an

  15. Registered manufacturers of renewable energy devices

    International Nuclear Information System (INIS)

    Anon.

    1992-01-01

    Registered manufacturers of renewable energy devices in India are listed. The list is arranged under the headings : solar water heating system, solar cooker, solar still and water pumping wind mill. In all 38 manufacturers are listed. The list gives the postal address, name of the contact person and phone number of each manufacturer. (M.G.B.)

  16. Sputtering materials for VLSI and thin film devices

    CERN Document Server

    Sarkar, Jaydeep

    2010-01-01

    An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall p

  17. Antimicrobial Peptides in Biomedical Device Manufacturing

    Science.gov (United States)

    Riool, Martijn; de Breij, Anna; Drijfhout, Jan W.; Nibbering, Peter H.; Zaat, Sebastian A. J.

    2017-08-01

    Over the past decades the use of medical devices, such as catheters, artificial heart valves, prosthetic joints and other implants, has grown significantly. Despite continuous improvements in device design, surgical procedures and wound care, biomaterial-associated infections (BAI) are still a major problem in modern medicine. Conventional antibiotic treatment often fails due to the low levels of antibiotic at the site of infection. The presence of biofilms on the biomaterial and/or the multidrug-resistant phenotype of the bacteria further impair the efficacy of antibiotic treatment. Removal of the biomaterial is then the last option to control the infection. Clearly, there is a pressing need for alternative strategies to prevent and treat BAI. Synthetic antimicrobial peptides (AMPs) are considered promising candidates as they are active against a broad spectrum of (antibiotic-resistant) planktonic bacteria and biofilms. Moreover, bacteria are less likely to develop resistance to these rapidly-acting peptides. In this review we highlight the four main strategies, three of which applying AMPs, in biomedical device manufacturing to prevent BAI. The first involves modification of the physicochemical characteristics of the surface of implants. Immobilization of AMPs on surfaces of medical devices with a variety of chemical techniques is essential in the second strategy. The main disadvantage of these two strategies relates to the limited antibacterial effect in the tissue surrounding the implant. This limitation is addressed by the third strategy that releases AMPs from a coating in a controlled fashion. Lastly, AMPs can be integrated in the design and manufacturing of additively manufactured / 3D-printed implants, owing to the physicochemical characteristics of the implant material and the versatile manufacturing technologies compatible with antimicrobials incorporation. These novel technologies utilizing AMPs will contribute to development of novel and safe

  18. Antimicrobial Peptides in Biomedical Device Manufacturing

    Directory of Open Access Journals (Sweden)

    Martijn Riool

    2017-08-01

    Full Text Available Over the past decades the use of medical devices, such as catheters, artificial heart valves, prosthetic joints, and other implants, has grown significantly. Despite continuous improvements in device design, surgical procedures, and wound care, biomaterial-associated infections (BAI are still a major problem in modern medicine. Conventional antibiotic treatment often fails due to the low levels of antibiotic at the site of infection. The presence of biofilms on the biomaterial and/or the multidrug-resistant phenotype of the bacteria further impair the efficacy of antibiotic treatment. Removal of the biomaterial is then the last option to control the infection. Clearly, there is a pressing need for alternative strategies to prevent and treat BAI. Synthetic antimicrobial peptides (AMPs are considered promising candidates as they are active against a broad spectrum of (antibiotic-resistant planktonic bacteria and biofilms. Moreover, bacteria are less likely to develop resistance to these rapidly-acting peptides. In this review we highlight the four main strategies, three of which applying AMPs, in biomedical device manufacturing to prevent BAI. The first involves modification of the physicochemical characteristics of the surface of implants. Immobilization of AMPs on surfaces of medical devices with a variety of chemical techniques is essential in the second strategy. The main disadvantage of these two strategies relates to the limited antibacterial effect in the tissue surrounding the implant. This limitation is addressed by the third strategy that releases AMPs from a coating in a controlled fashion. Lastly, AMPs can be integrated in the design and manufacturing of additively manufactured/3D-printed implants, owing to the physicochemical characteristics of the implant material and the versatile manufacturing technologies compatible with antimicrobials incorporation. These novel technologies utilizing AMPs will contribute to development of novel

  19. Microelectronics to nanoelectronics: materials, devices & manufacturability

    National Research Council Canada - National Science Library

    Kaul, Anupama B

    2013-01-01

    .... They highlight new technologies that have successfully transitioned from the laboratory to the marketplace as well as technologies that have near-term market applications in electronics, materials, and optics...

  20. Microelectronics from fundamentals to applied design

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2016-01-01

    This book serves as a practical guide for practicing engineers who need to design analog circuits for microelectronics.  Readers will develop a comprehensive understanding of the basic techniques of analog modern electronic circuit design, discrete and integrated, application as sensors and control and data acquisition systems,and techniques of PCB design.  ·         Describes fundamentals of microelectronics design in an accessible manner; ·         Takes a problem-solving approach to the topic, offering a hands-on guide for practicing engineers; ·         Provides realistic examples to inspire a thorough understanding of system-level issues, before going into the detail of components and devices; ·         Uses a new approach and provides several skills that help engineers and designers retain key and advanced concepts.

  1. Microelectronic systems N2 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems N2 Checkbook provides coverage of the Business and Technician Education Council level NII unit in Microelectronic Systems. However, it can be regarded as a textbook in microelectronic systems for a much wider range of studies. The aim of this book is to provide a foundation in microelectronic systems hardware and software techniques. Each topic considered in the text is presented in a way that assumes in the reader only the knowledge attained in BTEC Information Technology Studies F, Engineering Fundamentals F, or equivalent. This book concentrates on the highly popular

  2. Space Radiation Environment Prediction for VLSI microelectronics devices onboard a LEO Satellite using OMERE-Trad Software

    Science.gov (United States)

    Sajid, Muhammad

    This tutorial/survey paper presents the assessment/determination of level of hazard/threat to emerging microelectronics devices in Low Earth Orbit (LEO) space radiation environment with perigee at 300 Km, apogee at 600Km altitude having different orbital inclinations to predict the reliability of onboard Bulk Built-In Current Sensor (BBICS) fabricated in 350nm technology node at OptMA Lab. UFMG Brazil. In this context, the various parameters for space radiation environment have been analyzed to characterize the ionizing radiation environment effects on proposed BBICS. The Space radiation environment has been modeled in the form of particles trapped in Van-Allen radiation belts(RBs), Energetic Solar Particles Events (ESPE) and Galactic Cosmic Rays (GCR) where as its potential effects on Device- Under-Test (DUT) has been predicted in terms of Total Ionizing Dose (TID), Single-Event Effects (SEE) and Displacement Damage Dose (DDD). Finally, the required mitigation techniques including necessary shielding requirements to avoid undesirable effects of radiation environment at device level has been estimated /determined with assumed standard thickness of Aluminum shielding. In order to evaluate space radiation environment and analyze energetic particles effects on BBICS, OMERE toolkit developed by TRAD was utilized.

  3. Using SDI-12 with ST microelectronics MCU's

    Energy Technology Data Exchange (ETDEWEB)

    Saari, Alexandra [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Hinzey, Shawn Adrian [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Frigo, Janette Rose [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Proicou, Michael Chris [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Borges, Louis [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2015-09-03

    ST Microelectronics microcontrollers and processors are readily available, capable and economical processors. Unfortunately they lack a broad user base like similar offerings from Texas Instrument, Atmel, or Microchip. All of these devices could be useful in economical devices for remote sensing applications used with environmental sensing. With the increased need for environmental studies, and limited budgets, flexibility in hardware is very important. To that end, and in an effort to increase open support of ST devices, I am sharing my teams' experience in interfacing a common environmental sensor communication protocol (SDI-12) with ST devices.

  4. 76 FR 10395 - BreconRidge Manufacturing Solutions, Now Known as Sanmina-SCI Corporation, Division...

    Science.gov (United States)

    2011-02-24

    ... Solutions, Now Known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic Design and Manufacturing, a Subsidiary of Sanmina-SCI Corporation, Including On- Site Leased Workers From Kelly Services... Manufacturing Solutions, now known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic...

  5. Microelectronic systems 1 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems 1 Checkbook provides coverage of the Business and Technician Education Council level 1 unit in Microelectronic Systems. However, it can be regarded as a basic textbook in microelectronic systems for a much wider range of studies. Each topic considered in the text is presented in a way that assumes the reader has little prior knowledge of electronics. The aim of the book is to provide an introduction to the concept of systems, to differentiate analogue and digital systems, and to describe the nature of microprocessor-controlled systems. An introduction to programming is

  6. Wireless device monitoring methods, wireless device monitoring systems, and articles of manufacture

    Science.gov (United States)

    McCown, Steven H [Rigby, ID; Derr, Kurt W [Idaho Falls, ID; Rohde, Kenneth W [Idaho Falls, ID

    2012-05-08

    Wireless device monitoring methods, wireless device monitoring systems, and articles of manufacture are described. According to one embodiment, a wireless device monitoring method includes accessing device configuration information of a wireless device present at a secure area, wherein the device configuration information comprises information regarding a configuration of the wireless device, accessing stored information corresponding to the wireless device, wherein the stored information comprises information regarding the configuration of the wireless device, comparing the device configuration information with the stored information, and indicating the wireless device as one of authorized and unauthorized for presence at the secure area using the comparing.

  7. Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications

    DEFF Research Database (Denmark)

    Katsia, E.; Huby, N.; Tallarida, G.

    2009-01-01

    Hybrid poly(3-hexylthiophene)/ZnO devices are investigated as rectifying heterojunctions for microelectronics applications. A low-temperature atomic layer deposition of ZnO on top of poly(3-hexylthiophene) allows the fabrication of diodes featuring a rectification ratio of nearly 105 at ±4 V...

  8. 21 CFR 801.122 - Medical devices for processing, repacking, or manufacturing.

    Science.gov (United States)

    2010-04-01

    ....122 Medical devices for processing, repacking, or manufacturing. A device intended for processing... act if its label bears the statement “Caution: For manufacturing, processing, or repacking”. ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Medical devices for processing, repacking, or...

  9. Microstructure devices for process intensification: Influence of manufacturing tolerances and design

    International Nuclear Information System (INIS)

    Brandner, Juergen J.

    2013-01-01

    Process intensification by miniaturization is a common task for several fields of technology. Starting from manufacturing of electronic devices, miniaturization with the accompanying opportunities and problems gained also interest in chemistry and chemical process engineering. While the integration of enhanced functions, e.g. integrated sensors and actuators, is still under consideration, miniaturization itself has been realized in all material classes, namely metals, ceramics and polymers. First devices have been manufactured by scaling down macro-scale devices. However, manufacturing tolerances, material properties and design show much larger influence to the process than in macro scale. Many of the devices generated alike the macro ones work properly, but possibly could be optimized to a certain extend by adjusting the design and manufacturing tolerances to the special demands of miniaturization. Thus, some considerations on the design and production of devices for micro process engineering should be made to provide devices which show reproducible and controllable process behavior. The aim of the following publication is to show the importance of considerations in manufacturing tolerances and dimensions as well as design of microstructures to avoid negative influences and optimize the process characteristics of miniaturized devices. Some examples will be shown to explain the considerations presented here

  10. Characterization by ion beams of surfaces and interfaces of alternative materials for future microelectronic devices

    International Nuclear Information System (INIS)

    Krug, C.; Stedile, F.C.; Radtke, C.; Rosa, E.B.O. da; Morais, J.; Freire, F.L.; Baumvol, I.J.R.

    2003-01-01

    We present the potential use of ion beam techniques such as nuclear reactions, channelling Rutherford backscattering spectrometry, and low energy ion scattering in the characterization of the surface and interface of materials thought to be possible substitutes to Si (like SiC, for example) and to SiO 2 films (like Al 2 O 3 films, for example) in microelectronic devices. With narrow nuclear reaction resonance profiling the depth distribution of light elements such as Al and O in the films can be obtained non-destructively and with subnanometric depth resolution, allowing one to follow the mobility of each species under thermal treatments, for instance. Thinning of an amorphous layer at the surface of single-crystalline samples can be determined using channelling of He + ions and detection of the scattered light particles. Finally, the use of He + ions in the 1 keV range allows elemental analysis of the first monolayer at the sample surface

  11. An analytic framework for developing inherently-manufacturable pop-up laminate devices

    International Nuclear Information System (INIS)

    Aukes, Daniel M; Goldberg, Benjamin; Wood, Robert J; Cutkosky, Mark R

    2014-01-01

    Spurred by advances in manufacturing technologies developed around layered manufacturing technologies such as PC-MEMS, SCM, and printable robotics, we propose a new analytic framework for capturing the geometry of folded composite laminate devices and the mechanical processes used to manufacture them. These processes can be represented by combining a small set of geometric operations which are general enough to encompass many different manufacturing paradigms. Furthermore, such a formulation permits one to construct a variety of geometric tools which can be used to analyze common manufacturability concepts, such as tool access, part removability, and device support. In order to increase the speed of development, reduce the occurrence of manufacturing problems inherent with current design methods, and reduce the level of expertise required to develop new devices, the framework has been implemented in a new design tool called popupCAD, which is suited for the design and development of complex folded laminate devices. We conclude with a demonstration of utility of the tools by creating a folded leg mechanism. (paper)

  12. Using federal technology policy to strength the US microelectronics industry

    Science.gov (United States)

    Gover, J. E.; Gwyn, C. W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan's government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  13. Using federal technology policy to strength the US microelectronics industry

    Energy Technology Data Exchange (ETDEWEB)

    Gover, J.E.; Gwyn, C.W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan`s government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  14. Molecular beam epitaxy grown Ge/Si pin layer sequence for photonic devices

    International Nuclear Information System (INIS)

    Schulze, J.; Oehme, M.; Werner, J.

    2012-01-01

    A key challenge to obtain a convergence of classical Si-based microelectronics and optoelectronics is the manufacturing of photonic integrated circuits integrable into classical Si-based integrated circuits. This integration would be greatly enhanced if similar facilities and technologies could be used. Therefore one approach is the development of optoelectronic components and devices made from group-IV-based materials such as SiGe, Ge or Ge:Sn. In this paper the optoelectronic performances of a pin diode made from a Ge/Si heterostructure pin layer sequence grown by molecular beam epitaxy are discussed. After a detailed description of the layer sequence growth and the device manufacturing process it will be shown that – depending on the chosen operating point and device design – the diode serves as a broadband high speed photo detector, Franz–Keldysh effect modulator or light emitting diode.

  15. Molecular beam epitaxy grown Ge/Si pin layer sequence for photonic devices

    Energy Technology Data Exchange (ETDEWEB)

    Schulze, J., E-mail: schulze@iht.uni-stuttgart.de; Oehme, M.; Werner, J.

    2012-02-01

    A key challenge to obtain a convergence of classical Si-based microelectronics and optoelectronics is the manufacturing of photonic integrated circuits integrable into classical Si-based integrated circuits. This integration would be greatly enhanced if similar facilities and technologies could be used. Therefore one approach is the development of optoelectronic components and devices made from group-IV-based materials such as SiGe, Ge or Ge:Sn. In this paper the optoelectronic performances of a pin diode made from a Ge/Si heterostructure pin layer sequence grown by molecular beam epitaxy are discussed. After a detailed description of the layer sequence growth and the device manufacturing process it will be shown that - depending on the chosen operating point and device design - the diode serves as a broadband high speed photo detector, Franz-Keldysh effect modulator or light emitting diode.

  16. Readability of "Dear Patient" device advisory notification letters created by a device manufacturer.

    Science.gov (United States)

    Mueller, Luke A; Sharma, Arjun; Ottenberg, Abigale L; Mueller, Paul S

    2013-04-01

    In 2006, the Heart Rhythm Society (HRS) recommended that cardiovascular implantable electronic device (CIED) manufacturers use advisory notification letters to communicate with affected patients. To evaluate the readability of the HRS sample "patient device advisory notification" letter and those created by 1 CIED manufacturer. The HRS sample letter and 25 Boston Scientific Corporation letters dated from 2005 through 2011 were evaluated by using 6 readability tests. Readability (Flesch-Kincaid score) of the HRS sample letter was grade level 12.5, and median readability of the device manufacturer letters was grade level 12.8 (range 10.8-18.9). Similar results were obtained by using other readability scales. No letters had readability scores at the National Work Group on Literacy and Health's recommended reading level-fifth grade; the letters' readability exceeded this recommended level by an average of 7.7 grades (95% confidence interval 6.9-8.5; Preadability scores at the average reading level of US adults-eighth grade; the letters' readability exceeded this level by an average of 4.7 grades (95% confidence interval 3.9-5.5; Preadability of the HRS sample letter and those created by a CIED manufacturer significantly exceeded the recommended and average US adults' reading skill levels. Such letters are unlikely to be informative to many patients. CIED manufacturers should ensure that advisory letters are comprehensible to most affected patients. Copyright © 2013 Heart Rhythm Society. Published by Elsevier Inc. All rights reserved.

  17. Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan

    Science.gov (United States)

    Washio, Kunihiko; Kouta, Hikaru

    2002-06-01

    This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

  18. Surface modification of biomaterials and biomedical devices using additive manufacturing.

    Science.gov (United States)

    Bose, Susmita; Robertson, Samuel Ford; Bandyopadhyay, Amit

    2018-01-15

    The demand for synthetic biomaterials in medical devices, pharmaceutical products and, tissue replacement applications are growing steadily due to aging population worldwide. The use for patient matched devices is also increasing due to availability and integration of new technologies. Applications of additive manufacturing (AM) or 3D printing (3DP) in biomaterials have also increased significantly over the past decade towards traditional as well as innovative next generation Class I, II and III devices. In this review, we have focused our attention towards the use of AM in surface modified biomaterials to enhance their in vitro and in vivo performances. Specifically, we have discussed the use of AM to deliberately modify the surfaces of different classes of biomaterials with spatial specificity in a single manufacturing process as well as commented on the future outlook towards surface modification using AM. It is widely understood that the success of implanted medical devices depends largely on favorable material-tissue interactions. Additive manufacturing has gained traction as a viable and unique approach to engineered biomaterials, for both bulk and surface properties that improve implant outcomes. This review explores how additive manufacturing techniques have been and can be used to augment the surfaces of biomedical devices for direct clinical applications. Copyright © 2017 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

  19. Heteromagnetic Microelectronics Microsystems of Active Type

    CERN Document Server

    Ignatiev, Alexander A

    2010-01-01

    Heteromagnetic Microelectronics: Microsystems of Active Type, by Alexander A. Ignatiev of Saratov State University and Alexander V. Lyashenko of JSC Research Institute Tantal in Russia, offers a very detailed and specialized account of the author's research and development of heteromagnetic materials and devices. The book is based on original material from the author's programs of designing heteromagnetic microsystems. Polyvalent, multiple parameter magneto-semiconductor microsystems are described and the book reports on extensive experimental and theoretical results of research in a range of frequencies up to 1000 GHz. For the first time the direction of satisfying criteria, and burst technologies, which can make a subject of discovery, are discussed in great detail. This book is intended for post-graduate students and researchers specializing in the design and application of heteromagnetic materials and devices. Alexander A. Ignatiev is author of Magnetoelectronics of Microwaves and Extremely High Frequenci...

  20. 78 FR 12068 - Device Good Manufacturing Practice Advisory Committee; Notice of Meeting

    Science.gov (United States)

    2013-02-21

    ... DEPARTMENT OF HEALTH AND HUMAN SERVICES Food and Drug Administration [Docket No. FDA-2013-N-0001] Device Good Manufacturing Practice Advisory Committee; Notice of Meeting AGENCY: Food and Drug... Committee: Device Good Manufacturing Practice Advisory Committee. General Function of the Committee: To...

  1. Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices.

    Science.gov (United States)

    Alapan, Yunus; Hasan, Muhammad Noman; Shen, Richang; Gurkan, Umut A

    2015-05-01

    Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing.

  2. Integration in design and manufacturing of polymer smart devices

    NARCIS (Netherlands)

    Bolt, P.J.; Zwart, R.M. de; Tacken, R.A.; Rendering, H.

    2009-01-01

    Integration of functions in single components is pursued in order to manufacture smaller and smarter polymer micro devices at less cost, through e.g. less assembly steps. It requires integration on both product and production side. This paper addresses the use of molded interconnect device (MID)

  3. Method of manufacturing semiconductor devices

    International Nuclear Information System (INIS)

    Sun, Y.S.E.

    1980-01-01

    A method of improving the electrical characteristics of semiconductor devices such as SCR's, rectifiers and triacs during their manufacture is described. The system consists of electron irradiation at an energy in excess of 250 KeV and most preferably between 1.5 and 12 MeV, producing an irradiation dose of between 5.10 12 and 5.10 15 electrons per sq. cm., and at a temperature in excess of 100 0 C preferably between 150 and 375 0 C. (U.K.)

  4. Method of manufacturing a semiconductor sensor device and semiconductor sensor device

    NARCIS (Netherlands)

    2009-01-01

    The invention relates to a method of manufacturing a semiconductor sensor device (10) for sensing a substance comprising a plurality of mutually parallel mesa-shaped semiconductor regions (1) which are formed on a surface of a semiconductor body (11) and which are connected at a first end to a first

  5. Radiation effects on microelectronics

    International Nuclear Information System (INIS)

    Gover, J.E.

    1987-01-01

    Applications of radiation-hardened microelectronics in nuclear power systems include (a) light water reactor (LWR) containment building, postaccident instrumentation that can operate through the beta and gamma radiation released in a design basis loss-of-coolant accident; (b) advanced LWR instrumentation and control systems employing distributed digital integrated circuit (IC) technology to achieve a high degree of artificial intelligence and thereby reduce the probability of operator error under accident conditions; (c) instrumentation, command, control and communication systems for space nuclear power applications that must operate during the neutron and gamma-ray core leakage environments as well as the background electron, proton, and heavy charged particle environments of space; and (d) robotics systems designed for the described functions. Advanced microelectronics offer advantages in cost and reliability over alternative approaches to instrumentation and control. No semiconductor technology is hard to all classes of radiation effects phenomena. As the effects have become better understood, however, significant progress has been made in hardening IC technology. Application of hardened microelectronics to nuclear power systems has lagged military applications because of the limited market potential of hardened instruments and numerous institutional impediments

  6. Reticle variation influence on manufacturing line and wafer device performance

    Science.gov (United States)

    Nistler, John L.; Spurlock, Kyle

    1994-01-01

    Cost effective manufacturing of devices at 0.5, 0.35 and 0.25μm geometries will be highly dependent on a companys' ability to obtain an economic return on investment. The high capital investment in equipment and facilities, not to mention the related chemical and wafer costs, for producing 200mm silicon wafers requires aspects of wafer processing to be tightly controlled. Reduction in errors and enhanced yield management requires early correction or avoidance of reticle problems. It is becoming increasingly important to recognize and track all pertinent factors impacting both the technical and financial viability of a wafer manufacturing fabrication area. Reticle related effects on wafer manufacturing can be costly and affect the total quality perceived by the device customer.

  7. Physics in microelectronics and microelectronics in physics

    International Nuclear Information System (INIS)

    Mooser, E.

    1983-01-01

    Modern semiconductor technology and its many different facets such as microelectronics, optoelectronics, integrated optics, solar energy conversion, etc... have their origin in solid state physics, However, because of their enormous economic impact, their development has been so rapid and has lead to such a high degree of complexity and sophistication, that to the newcomer in the field, the links between solid state electronics and solid state physics are no longer evident. (author) [pt

  8. Measuring the diffusion of Ti and Cu in low-k materials for microelectronic devices by EELS, EFTEM and EDX

    International Nuclear Information System (INIS)

    Barnes, J-P; Lafond, D; Guedj, C; Fayolle, M; Meininger, P; Maitrejean, S; David, T; Posseme, N; Bayle-Guillemaud, P; Chabli, Amal

    2006-01-01

    The need to reduce RC delay and cross talk in Cu interconnects means that ultra low-k dielectrics such as porous SiCOH are being integrated into microelectronic devices. Unfortunately porous materials lead to integration issues such as metal diffusion into the porosity of the dielectric, especially when chemical vapour deposition (CVD) methods are used for metal deposition. In our case, the copper anti-diffusion barrier used before Cu deposition is MOCVD TiN. Without an appropriate surface treatment (pore sealing) of the low-k the TiN may diffuse in the porosity. The presence of Ti or Cu in the low-k is deleterious as it can raise the dielectric constant and the leakage current. EFTEM EELS and EDX have been used to map Ti, Cu, O and C as a function of process conditions

  9. Handbook on advanced design and manufacturing technologies for biomedical devices

    CERN Document Server

    2013-01-01

    The last decades have seen remarkable advances in computer-aided design, engineering and manufacturing technologies, multi-variable simulation tools, medical imaging, biomimetic design, rapid prototyping, micro and nanomanufacturing methods and information management resources, all of which provide new horizons for the Biomedical Engineering fields and the Medical Device Industry. Handbook on Advanced Design and Manufacturing Technologies for Biomedical Devices covers such topics in depth, with an applied perspective and providing several case studies that help to analyze and understand the key factors of the different stages linked to the development of a novel biomedical device, from the conceptual and design steps, to the prototyping and industrialization phases. Main research challenges and future potentials are also discussed, taking into account relevant social demands and a growing market already exceeding billions of dollars. In time, advanced biomedical devices will decisively change methods and resu...

  10. Advanced single-wafer sequential multiprocessing techniques for semiconductor device fabrication

    International Nuclear Information System (INIS)

    Moslehi, M.M.; Davis, C.

    1989-01-01

    Single-wafer integrated in-situ multiprocessing (SWIM) is recognized as the future trend for advanced microelectronics production in flexible fast turn- around computer-integrated semiconductor manufacturing environments. The SWIM equipment technology and processing methodology offer enhanced equipment utilization, improved process reproducibility and yield, and reduced chip manufacturing cost. They also provide significant capabilities for fabrication of new and improved device structures. This paper describes the SWIM techniques and presents a novel single-wafer advanced vacuum multiprocessing technology developed based on the use of multiple process energy/activation sources (lamp heating and remote microwave plasma) for multilayer epitaxial and polycrystalline semiconductor as well as dielectric film processing. Based on this technology, multilayer in-situ-doped homoepitaxial silicon and heteroepitaxial strained layer Si/Ge x Si 1 - x /Si structures have been grown and characterized. The process control and the ultimate interfacial abruptness of the layer-to-layer transition widths in the device structures prepared by this technology will challenge the MBE techniques in multilayer epitaxial growth applications

  11. Patient views on financial relationships between surgeons and surgical device manufacturers.

    Science.gov (United States)

    Camp, Mark W; Gross, Allan E; McKneally, Martin F

    2015-10-01

    Over the past decade, revelations of inappropriate financial relationships between surgeons and surgical device manufacturers have challenged the presumption that surgeons can collaborate with surgical device manufacturers without damaging public trust in the surgical profession. We explored postoperative Canadian patients' knowledge and opinions about financial relationships between surgeons and surgical device manufacturers. This complex issue was explored using qualitative methods. We conducted semistructured face-to-face interviews with postoperative patients in follow-up arthroplasty clinics at an academic hospital in Toronto, Canada. Interviews were audiotaped, transcribed and analyzed. Patient-derived concepts and themes were uncovered. We interviewed 33 patients. Five major themes emerged: 1) many patients are unaware of the existence of financial relationships between surgeons and surgical device manufacturers; 2) patients approve of financial relationships that support innovation and research but are opposed to relationships that involve financial incentives that benefit only the surgeon and the manufacturer; 3) patients do not support disclosure of financial relationships during the consent process as it may shift focus away from the more important risks; 4) patients support oversight at the professional level but reject the idea of government involvement in oversight; and 5) patients entrust their surgeons to make appropriate patient-centred choices. This qualitative study deepens our understanding of financial relationships between surgeons and industry. Patients support relationships with industry that provide potential benefit to current or future patients. They trust our ability to self-regulate. Disclosure combined with appropriate oversight will strengthen public trust in professional collaboration with industry.

  12. Radiation-Induced Prompt Photocurrents in Microelectronics Physics

    CERN Document Server

    Dodd, P E; Buller, D L; Doyle, B L; Vizkelethy, G; Walsh, D S

    2003-01-01

    The effects of photocurrents in nuclear weapons induced by proximal nuclear detonations are well known and remain a serious hostile environment threat for the US stockpile. This report describes the final results of an LDRD study of the physical phenomena underlying prompt photocurrents in microelectronic devices and circuits. The goals of this project were to obtain an improved understanding of these phenomena, and to incorporate improved models of photocurrent effects into simulation codes to assist designers in meeting hostile radiation requirements with minimum build and test cycles. We have also developed a new capability on the ion microbeam accelerator in Sandia's Ion Beam Materials Research Laboratory (the Transient Radiation Microscope, or TRM) to supply ionizing radiation in selected micro-regions of a device. The dose rates achieved in this new facility approach those possible with conventional large-scale dose-rate sources at Sandia such as HERMES III and Saturn. It is now possible to test the phy...

  13. Post-market clinical research conducted by medical device manufacturers: a cross-sectional survey.

    Science.gov (United States)

    Ross, Joseph S; Blount, Katrina L; Ritchie, Jessica D; Hodshon, Beth; Krumholz, Harlan M

    2015-01-01

    In the US, once a medical device is made available for use, several requirements have been established by the US Food and Drug Administration (FDA) to ensure ongoing post-market surveillance of device safety and effectiveness. Our objective was to determine how commonly medical device manufacturers initiate post-market clinical studies or augment FDA post-market surveillance requirements for higher-risk devices that are most often approved via the FDA's pre-market approval (PMA) pathway. We conducted a cross-sectional survey of 47 manufacturers with operations in California, Minnesota, and Massachusetts who market devices approved via the PMA pathway. Among 22 respondents (response rate =47%), nearly all self-reported conducting post-market clinical research studies, commonly between 1 and 5; only 1 respondent reported never conducting post-market clinical research studies. While manufacturers most often engaged in these studies to satisfy FDA requirements, other reasons were reported, including performance monitoring and surveillance and market acceptance initiatives. Risks of conducting and not conducting post-market clinical research studies were described through open-ended response to questions. Medical device manufacturers commonly initiate post-market clinical studies at the request of the FDA. Clinical data from these studies should be integrated into national post-market surveillance initiatives.

  14. Development and Manufacture of Polymer-based Electrochromic Devices

    DEFF Research Database (Denmark)

    Jensen, Jacob; Hösel, Markus; Dyer, Aubrey L.

    2015-01-01

    -to-roll methods compatible with upscaling and manufacture. The successful approaches to operational devices are presented in detail, as well as areas where future research would have a high impact and accelerate the development such as highly conducting and transparent substrates, electrolytes adapted...

  15. Three-terminal devices of high-Tc superconductors: A status report and future challenges

    International Nuclear Information System (INIS)

    Kung, Pang-Jen; Carnegie-Mellon Univ., Pittsburgh, PA

    1992-01-01

    A study has been conducted on the recent progress of the three-terminal devices with transistor-like characteristics fabricated from the high-T c superconducting materials. This study explored the operating principles and characteristics of these devices in relation to the relevant materials and techniques. A comparison of a variety of techniques for superconducting thin film deposition will be given. This study indirates that the feasibility of fabricating hybrid devices composed of semiconductors and superconductors appear to be the key issue to push forward the applications of high-T c superconductors in microelectronics. The junction field-effect transistors with a semiconductor base controlled by the proximity effect are likely to be more manufacturable. The factors that influence the operating reliability of devices and the problems arising from integrating and packaging the devices will also be discussed

  16. Tailoring strain in microelectronic devices

    NARCIS (Netherlands)

    van Hemert, T.

    2013-01-01

    The central device of this thesis is the transistor. It acts like a faucet, but hen for electric charge. There is a connection that is called the source, just like the water company. And the charge flows into the drain. Finally there is a handle, here called the gate, to control the flow of charge.

  17. Additively manufactured custom load-bearing implantable devices: grounds for caution

    Directory of Open Access Journals (Sweden)

    Elisabetta M Zanetti

    2017-08-01

    Full Text Available Background Additive manufacturing technologies are being enthusiastically adopted by the orthopaedic community since they are providing new perspectives and new possibilities. First applications were finalised for educational purposes, pre-operative planning, and design of surgical guides; recent applications also encompass the production of implantable devices where 3D printing can bring substantial benefits such as customization, optimization, and manufacturing of very complex geometries. The conceptual smoothness of the whole process may lead to the idea that any medical practitioner can use a 3D printer and her/his imagination to design and produce novel products for personal or commercial use. Aims Outlining how the whole process presents more than one critical aspects, still demanding further research in order to allow a safe application of this technology for fully-custom design, in particular confining attention to orthopaedic/orthodontic prostheses defined as components responding mainly to a structural function. Methods Current knowledge of mechanical properties of additively manufactured components has been examined along with reasons why the behaviour of these components might differ from traditionally manufactured components. The structural information still missing for mechanical design is outlined. Results Mechanical properties of additively manufactured components are not completely known, and especially fatigue limit needs to be examined further. Conclusion At the present stage, with reference to load-bearing implants subjected to many loading cycles, the indication of custom-made additively manufactured medical devices should be restricted to the cases with no viable alternative.

  18. Post-market clinical research conducted by medical device manufacturers: a cross-sectional survey

    Directory of Open Access Journals (Sweden)

    Ross JS

    2015-05-01

    Full Text Available Joseph S Ross, Katrina L Blount, Jessica D Ritchie, Beth Hodshon, Harlan M Krumholz Center for Outcomes Research and Evaluation, Yale-New Haven Hospital, New Haven, CT, USA Background: In the US, once a medical device is made available for use, several requirements have been established by the US Food and Drug Administration (FDA to ensure ongoing post-market surveillance of device safety and effectiveness. Our objective was to determine how commonly medical device manufacturers initiate post-market clinical studies or augment FDA post-market surveillance requirements for higher-risk devices that are most often approved via the FDA's pre-market approval (PMA pathway. Methods and results: We conducted a cross-sectional survey of 47 manufacturers with operations in California, Minnesota, and Massachusetts who market devices approved via the PMA pathway. Among 22 respondents (response rate =47%, nearly all self-reported conducting post-market clinical research studies, commonly between 1 and 5; only 1 respondent reported never conducting post-market clinical research studies. While manufacturers most often engaged in these studies to satisfy FDA requirements, other reasons were reported, including performance monitoring and surveillance and market acceptance initiatives. Risks of conducting and not conducting post-market clinical research studies were described through open-ended response to questions. Conclusion: Medical device manufacturers commonly initiate post-market clinical studies at the request of the FDA. Clinical data from these studies should be integrated into national post-market surveillance initiatives. Keywords: FDA, PMA pathway, post-market surveillance

  19. Microelectronics Revolution And The Impact Of Automation In The New Industrialized Countries

    Science.gov (United States)

    Baranauskas, Vitor

    1984-08-01

    A brief review of some important historical points on the origin of the Factories and the Industrial Revolution is presented with emphasis in the social problems related to the automation of the human labor. Until the World War I, the social changes provoked by the Industrial Revolution caused one division of the World in developed and underdeveloped countries. After that period, the less developed nations began their industrialization mainly through the Multinationals Corporations (MC). These enterprises were very important to the production and exportation of utilities and manufactures in general, mainly in those products which required intensive and direct human labor. At present time, with the pervasiveness of microelectronics in the automation, this age seems to reaching an end because all continous processes in industry tend economicaly toward total automation. This fact will cause a retraction in long-term investments and, beyond massive unemployment, there is a tendency for these MC industries to return to their original countries. The most promising alternative to avoid these events, and perhaps the unique, is to incentive an autonomous development in areas of high technology, as for instance, the microelectronics itself.

  20. Japan's technology and manufacturing infrastructure

    Science.gov (United States)

    Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

    1995-02-01

    The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

  1. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

    Energy Technology Data Exchange (ETDEWEB)

    Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie; Tigges, Chris P.

    1999-04-01

    We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

  2. 10 CFR 32.74 - Manufacture and distribution of sources or devices containing byproduct material for medical use.

    Science.gov (United States)

    2010-01-01

    ... 10 Energy 1 2010-01-01 2010-01-01 false Manufacture and distribution of sources or devices... SPECIFIC DOMESTIC LICENSES TO MANUFACTURE OR TRANSFER CERTAIN ITEMS CONTAINING BYPRODUCT MATERIAL Generally Licensed Items § 32.74 Manufacture and distribution of sources or devices containing byproduct material for...

  3. Method of manufacturing a semiconductor device and semiconductor device obtained with such a method

    NARCIS (Netherlands)

    2008-01-01

    The invention relates to a method of manufacturing a semiconductor device (10) with a semiconductor body (1) which is provided with at least one semiconductor element, wherein on the surface of the semiconductor body (1) a mesa- shaped semiconductor region (2) is formed, a masking layer (3) is

  4. 3D microelectronic packaging from fundamentals to applications

    CERN Document Server

    Goyal, Deepak

    2017-01-01

    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

  5. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  6. Experimental investigation of single-phase microjet cooling of microelectronics

    Directory of Open Access Journals (Sweden)

    Rusowicz Artur

    2015-09-01

    Full Text Available Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second. While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

  7. Experimental investigation of single-phase microjet cooling of microelectronics

    Science.gov (United States)

    Rusowicz, Artur; Leszczyński, Maciej; Grzebielec, Andrzej; Laskowski, Rafał

    2015-09-01

    Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second). While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

  8. Innovating transformative medical devices and growing the local medical device manufacturing sector

    CSIR Research Space (South Africa)

    Bunn, Tony

    2017-01-01

    Full Text Available . The 4IR is marked by emerging technology breakthroughs in a number of fields, including robotics, genomics, biosensors and wearables, AI, the internet of things, quantum computing, big data predictive analytics, 3D printing/additive manufacturing... of personalized prosthetics and products • Personalized devices and technologies for precision medicine Secure Airway Clamp for safer Anaesthesia MANDIBULAR IMPLANTS PATIENT 2 PATIENT 1 PATIENT 3 PATIENT CT SCAN 3D PRINTED TITANIUM IMPLANT PROPOSED...

  9. Fabrication of Thermoelectric Devices Using Additive-Subtractive Manufacturing Techniques: Application to Waste-Heat Energy Harvesting

    Science.gov (United States)

    Tewolde, Mahder

    Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are well suited for waste-heat energy harvesting applications as opposed to primary energy generation. Commercially available thermoelectric modules are flat, inflexible and have limited sizes available. State-of-art manufacturing of TEG devices relies on assembling prefabricated parts with soldering, epoxy bonding, and mechanical clamping. Furthermore, efforts to incorporate them onto curved surfaces such as exhaust pipes, pump housings, steam lines, mixing containers, reaction chambers, etc. require custom-built heat exchangers. This is costly and labor-intensive, in addition to presenting challenges in terms of space, thermal coupling, added weight and long-term reliability. Additive manufacturing technologies are beginning to address many of these issues by reducing part count in complex designs and the elimination of sub-assembly requirements. This work investigates the feasibility of utilizing such novel manufacturing routes for improving the manufacturing process of thermoelectric devices. Much of the research in thermoelectricity is primarily focused on improving thermoelectric material properties by developing of novel materials or finding ways to improve existing ones. Secondary to material development is improving the manufacturing process of TEGs to provide significant cost benefits. To improve the device fabrication process, this work explores additive manufacturing technologies to provide an integrated and scalable approach for TE device manufacturing directly onto engineering component surfaces. Additive manufacturing techniques like thermal spray and ink-dispenser printing are developed with the aim of improving the manufacturing process of TEGs. Subtractive manufacturing techniques like laser micromachining are also studied in detail. This includes the laser processing parameters for cutting the thermal spray materials efficiently by

  10. Nuclear data relevant to single-event upsets (SEU) in microelectronics and their application to SEU simulation

    International Nuclear Information System (INIS)

    Watanabe, Yukinobu; Tukamoto, Yasuyuki; Kodama, Akihiro; Nakashima, Hideki

    2004-01-01

    A cross-section database for neutron-induced reactions on 28 Si was developed in the energy range between 2 MeV and 3 GeV in order to analyze single-event upsets (SEUs) phenomena induced by cosmic-ray neutrons in microelectronic devices. A simplified spherical device model was proposed for simulation of the initial process of SEUs. The model was applied to SEU cross-section calculations for semiconductor memory devices. The calculated results were compared with measured SEU cross-sections and the other simulation result. The dependence of SEU cross-sections on incident neutron energy and secondary ions having the most important effects on SEUs are discussed. (author)

  11. 21 CFR 801.1 - Medical devices; name and place of business of manufacturer, packer or distributor.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Medical devices; name and place of business of manufacturer, packer or distributor. 801.1 Section 801.1 Food and Drugs FOOD AND DRUG ADMINISTRATION... § 801.1 Medical devices; name and place of business of manufacturer, packer or distributor. (a) The...

  12. Radiation Effects and Hardening Techniques for Spacecraft Microelectronics

    Science.gov (United States)

    Gambles, J. W.; Maki, G. K.

    2002-01-01

    The natural radiation from the Van Allen belts, solar flares, and cosmic rays found outside of the protection of the earth's atmosphere can produce deleterious effects on microelectronics used in space systems. Historically civil space agencies and the commercial satellite industry have been able to utilize components produced in special radiation hardened fabrication process foundries that were developed during the 1970s and 1980s under sponsorship of the Departments of Defense (DoD) and Energy (DoE). In the post--cold war world the DoD and DoE push to advance the rad--hard processes has waned. Today the available rad--hard components lag two-plus technology node generations behind state- of-the-art commercial technologies. As a result space craft designers face a large performance gap when trying to utilize available rad--hard components. Compounding the performance gap problems, rad--hard components are becoming increasingly harder to get. Faced with the economic pitfalls associated with low demand versus the ever increasing investment required for integrated circuit manufacturing equipment most sources of rad--hard parts have simply exited this market in recent years, leaving only two domestic US suppliers of digital rad--hard components. This paper summarizes the radiation induced mechanisms that can cause digital microelectronics to fail in space, techniques that can be applied to mitigate these failure mechanisms, and ground based testing used to validate radiation hardness/tolerance. The radiation hardening techniques can be broken down into two classes, Hardness By Process (HBP) and Hardness By Design (HBD). Fortunately many HBD techniques can be applied to commercial fabrication processes providing space craft designer with radiation tolerant Application Specific Integrated Circuits (ASICs) that can bridge the performance gap between the special HBP foundries and the commercial state-of-the-art performance.

  13. Towards roll-to-roll manufacturing of polymer photonic devices

    Science.gov (United States)

    Subbaraman, Harish; Lin, Xiaohui; Ling, Tao; Guo, L. Jay; Chen, Ray T.

    2014-03-01

    Traditionally, polymer photonic devices are fabricated using clean-room processes such as photolithography, e-beam lithography, reactive ion etching (RIE) and lift-off methods etc, which leads to long fabrication time, low throughput and high cost. We have utilized a novel process for fabricating polymer photonic devices using a combination of imprinting and ink jet printing methods, which provides high throughput on a variety of rigid and flexible substrates with low cost. We discuss the manufacturing challenges that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible polymer photonic systems. Several metrology and instrumentation challenges involved such as availability of particulate-free high quality substrate, development and implementation of high-speed in-line and off-line inspection and diagnostic tools with adaptive control for patterned and unpatterned material films, development of reliable hardware, etc need to be addressed and overcome in order to realize a successful manufacturing process. Due to extreme resolution requirements compared to print media, the burden of software and hardware tools on the throughput also needs to be carefully determined. Moreover, the effect of web wander and variations in web speed need to accurately be determined in the design of the system hardware and software. In this paper, we show the realization of solutions for few challenges, and utilizing these solutions for developing a high-rate R2R dual stage ink-jet printer that can provide alignment accuracy of web speed of 5m/min. The development of a roll-to-roll manufacturing system for polymer photonic systems opens limitless possibilities for the deployment of high performance components in a variety of applications including communication, sensing, medicine, agriculture, energy, lighting etc.

  14. 21 CFR 610.42 - Restrictions on use for further manufacture of medical devices.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 7 2010-04-01 2010-04-01 false Restrictions on use for further manufacture of medical devices. 610.42 Section 610.42 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH... for Communicable Disease Agents § 610.42 Restrictions on use for further manufacture of medical...

  15. Encapsulation methods for organic electrical devices

    Science.gov (United States)

    Blum, Yigal D.; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijian

    2013-06-18

    The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

  16. Vacuum Mechatronics And Insvection For Self-Contained Manufacturing

    Science.gov (United States)

    Belinski, Steve E.; Shirazi, Majid; Seidel, Thomas E.; Hackwood, Susan

    1990-02-01

    The vacuum environment is increasingly being used in manufacturing operations, especially in the semiconductor industry. Shrinking linewidths and feature sizes dictate that cleanliness standards become continually more strict. Studies at the Center for Robotic Systems in Microelectronics (CRSM) indicate that a controlled vacuum enclosure can provide a superior clean environment. In addition, since many microelectronic fabrication steps are already carried out under vacuum, self-contained multichamber processing systems are being developed at a rapid pace. CRSM support of these systems includes the development of a research system, the Self-contained Automated Robotic Factory (SCARF), a vacuum-compatible robot, and investigations of particulate characterization in vacuum and inspection for multichamber systems. Successful development of complex and expensive multichamber systems is, to a great extent, dependent upon the discipline called vacuum mechatronics, which includes the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. Here the constituents of the vacuum mechatronics discipline are defined and reviewed in the context of the importance to self-contained in-vacuum manufacturing.

  17. A system approach for reducing the environmental impact of manufacturing and sustainability improvement of nano-scale manufacturing

    Science.gov (United States)

    Yuan, Yingchun

    This dissertation develops an effective and economical system approach to reduce the environmental impact of manufacturing. The system approach is developed by using a process-based holistic method for upstream analysis and source reduction of the environmental impact of manufacturing. The system approach developed consists of three components of a manufacturing system: technology, energy and material, and is useful for sustainable manufacturing as it establishes a clear link between manufacturing system components and its overall sustainability performance, and provides a framework for environmental impact reductions. In this dissertation, the system approach developed is applied for environmental impact reduction of a semiconductor nano-scale manufacturing system, with three case scenarios analyzed in depth on manufacturing process improvement, clean energy supply, and toxic chemical material selection. The analysis on manufacturing process improvement is conducted on Atomic Layer Deposition of Al2O3 dielectric gate on semiconductor microelectronics devices. Sustainability performance and scale-up impact of the ALD technology in terms of environmental emissions, energy consumption, nano-waste generation and manufacturing productivity are systematically investigated and the ways to improve the sustainability of the ALD technology are successfully developed. The clean energy supply is studied using solar photovoltaic, wind, and fuel cells systems for electricity generation. Environmental savings from each clean energy supply over grid power are quantitatively analyzed, and costs for greenhouse gas reductions on each clean energy supply are comparatively studied. For toxic chemical material selection, an innovative schematic method is developed as a visual decision tool for characterizing and benchmarking the human health impact of toxic chemicals, with a case study conducted on six chemicals commonly used as solvents in semiconductor manufacturing. Reliability of

  18. Microelectronic circuit design for energy harvesting systems

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2017-01-01

    This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design. Provides a single-source reference to energy harvesting and its applications; Serves as a practical guide to microelectronics design for energy harvesting, with application to mobile power supplies; Enables readers to develop energy harvesting systems for wearable/mobile electronics.

  19. Adhesion in microelectronics

    CERN Document Server

    Mittal, K L

    2014-01-01

    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesi

  20. Manufacturing device for vacuum vessel of thermonuclear reactor and manufacturing method therefor

    International Nuclear Information System (INIS)

    Yanagi, Hiroshi; Shibui, Masanao; Uchida, Takaho

    1998-01-01

    The present invention provides a method of manufacturing a vacuum vessel of a thermonuclear reactor with no welding deformation. Namely, there are disposed a manufacturing device comprises a welding machine equipped with a plurality of welding torches which can conduct synchronizing welding and a torch positioning mechanism for positioning the plurality of welding torches each at an optional distance. Then, both ends of a splice plate can be welded by the plurality of welding torches under synchronization. Accordingly, joining portions of sectors of a vacuum vessel can be welded in the site with no deviation of beveling at joining portions between an outer wall and an inner wall with the splice plate due to welding deformation. In addition, the welding machine is mounted on a travelling type clamping mechanism stand or a travelling type clamping mechanism. With such a constitution, since the peripheries of the joining portions on the inner wall are clamped with each other by the travelling type clamping mechanism, no angular distortion is caused in any welded portion of the outer wall. (I.S.)

  1. Robust design of microelectronics assemblies against mechanical shock, temperature and moisture effects of temperature, moisture and mechanical driving forces

    CERN Document Server

    Wong, E-H

    2015-01-01

    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progr

  2. Applications of focused ion beams in microelectronics

    International Nuclear Information System (INIS)

    Broughton, C.; Beale, M.I.J.; Deshmukh, V.G.I.

    1986-04-01

    We present the conclusions of the RSRE programme on the application of focused ion beams in microelectronics and review the literature published in this field. We discuss the design and performance of focused beam implanters and the viability of their application to semiconductor device fabrication. Applications in the areas of lithography, direct implantation and micromachining are discussed in detail. Comparisons are made between the use of focused ion beams and existing techniques for these fabrication processes with a strong emphasis placed on the relative throughputs. We present results on a novel spot size measurement technique and the effect of beam heating on resist. We also present the results of studies into implantation passivation of resist to oxygen plasma attack as basis for a dry development lithography scheme. A novel lithography system employing flood electron exposure from a photocathode which is patterned by a focused ion beam which can also be used to repair mask defects is considered. (author)

  3. Low level radiation testing of micro-electronic components. Pt. 1

    International Nuclear Information System (INIS)

    Farren, J.; Stephen, J.H.; Mapper, D.; Sanderson, T.K.; Hardman, M.

    1984-05-01

    A review of the existing literature has been carried out, dealing with the current technology relating to low level radiation testing of microelectronic devices, as used in space satellite systems. After consideration of the space radiation environment, the general effects of cosmic radiation on MOSFET structures and other MOS devices have been assessed. The important aspect of annealing phenomena in relation to gamma-ray induced damage has also been reviewed in detail. The experimental and theoretical aspects of radiation testing have been assessed, with particular reference to the Harwell LORAD low level irradiation test facility. In addition, a review of modern dosimetry methods has been carried out, with specific regard to the problems of accurately measuring low radiation fields (1 to 10 R/hour) over periods of many months. Finally, a detailed account of the proposed experimental programme to be carried out in the LORAD facility is presented, and aspects of the experimental set-up discussed. The particular types of test circuits to be studied are dealt with, and full consideration is given to the various CMOS memory devices of special interest in the ESA space satellite programme. (author)

  4. Applications of synchrotron X-rays in microelectronics industry research

    International Nuclear Information System (INIS)

    Jordan-Sweet, Jean L.; Detavernier, Christophe; Lavoie, Christian; Mooney, Patricia M.; Toney, Michael F.

    2005-01-01

    The high flux and density of X-rays produced at synchrotrons provide the microelectronics industry with a powerful probe of the structure and behavior of a wide array of solid materials that are being developed for use in devices of the future. They also are of great use in determining why currently-used materials and processes sometimes fail. This paper describes the X20 X-ray beamline facility operated by IBM at the National Synchrotron Light Source, and presents a series of three industry challenges and results that illustrate the variety of techniques used and problems addressed. The value of this research ranges from solving short-term, technically specific problems to increasing our academic understanding of materials in general. Techniques discussed include high-resolution diffraction, time-resolved diffraction, texture measurements, and grazing-incidence diffraction

  5. Space station automation study: Automation requriements derived from space manufacturing concepts,volume 2

    Science.gov (United States)

    1984-01-01

    Automation reuirements were developed for two manufacturing concepts: (1) Gallium Arsenide Electroepitaxial Crystal Production and Wafer Manufacturing Facility, and (2) Gallium Arsenide VLSI Microelectronics Chip Processing Facility. A functional overview of the ultimate design concept incoporating the two manufacturing facilities on the space station are provided. The concepts were selected to facilitate an in-depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, sensors, and artificial intelligence. While the cost-effectiveness of these facilities was not analyzed, both appear entirely feasible for the year 2000 timeframe.

  6. Earth analysis methods, subsurface feature detection methods, earth analysis devices, and articles of manufacture

    Science.gov (United States)

    West, Phillip B [Idaho Falls, ID; Novascone, Stephen R [Idaho Falls, ID; Wright, Jerry P [Idaho Falls, ID

    2011-09-27

    Earth analysis methods, subsurface feature detection methods, earth analysis devices, and articles of manufacture are described. According to one embodiment, an earth analysis method includes engaging a device with the earth, analyzing the earth in a single substantially lineal direction using the device during the engaging, and providing information regarding a subsurface feature of the earth using the analysis.

  7. Additive Manufacturing for Robust and Affordable Medical Devices

    OpenAIRE

    Wolozny Gomez Robelo, Daniel Andre

    2016-01-01

    Additive manufacturing in the form of 3D printing is a revolutionary technology that has developed within the last two decades. Its ability to print an object with accurate features down to the micro scale have made its use in medical devices and research feasible. A range of life-saving technologies can now go from the laboratory and into field with the application of 3D-printing. This technology can be applied to medical diagnosis of patients in at-risk populations. Living biosensors a...

  8. Sustainable Micro-Manufacturing of Micro-Components via Micro Electrical Discharge Machining

    Directory of Open Access Journals (Sweden)

    Valeria Marrocco

    2011-12-01

    Full Text Available Micro-manufacturing emerged in the last years as a new engineering area with the potential of increasing peoples’ quality of life through the production of innovative micro-devices to be used, for example, in the biomedical, micro-electronics or telecommunication sectors. The possibility to decrease the energy consumption makes the micro-manufacturing extremely appealing in terms of environmental protection. However, despite this common belief that the micro-scale implies a higher sustainability compared to traditional manufacturing processes, recent research shows that some factors can make micro-manufacturing processes not as sustainable as expected. In particular, the use of rare raw materials and the need of higher purity of processes, to preserve product quality and manufacturing equipment, can be a source for additional environmental burden and process costs. Consequently, research is needed to optimize micro-manufacturing processes in order to guarantee the minimum consumption of raw materials, consumables and energy. In this paper, the experimental results obtained by the micro-electrical discharge machining (micro-EDM of micro-channels made on Ni–Cr–Mo steel is reported. The aim of such investigation is to shed a light on the relation and dependence between the material removal process, identified in the evaluation of material removal rate (MRR and tool wear ratio (TWR, and some of the most important technological parameters (i.e., open voltage, discharge current, pulse width and frequency, in order to experimentally quantify the material waste produced and optimize the technological process in order to decrease it.

  9. Space station automation study. Automation requirements derived from space manufacturing concepts. Volume 1: Executive summary

    Science.gov (United States)

    1984-01-01

    The two manufacturing concepts developed represent innovative, technologically advanced manufacturing schemes. The concepts were selected to facilitate an in depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, and artificial intelligence. While the cost effectiveness of these facilities has not been analyzed as part of this study, both appear entirely feasible for the year 2000 timeframe. The growing demand for high quality gallium arsenide microelectronics may warrant the ventures.

  10. Radiation analysis devices, radiation analysis methods, and articles of manufacture

    Science.gov (United States)

    Roybal, Lyle Gene

    2010-06-08

    Radiation analysis devices include circuitry configured to determine respective radiation count data for a plurality of sections of an area of interest and combine the radiation count data of individual of sections to determine whether a selected radioactive material is present in the area of interest. An amount of the radiation count data for an individual section is insufficient to determine whether the selected radioactive material is present in the individual section. An article of manufacture includes media comprising programming configured to cause processing circuitry to perform processing comprising determining one or more correction factors based on a calibration of a radiation analysis device, measuring radiation received by the radiation analysis device using the one or more correction factors, and presenting information relating to an amount of radiation measured by the radiation analysis device having one of a plurality of specified radiation energy levels of a range of interest.

  11. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  12. Physical limitations of semiconductor devices defects, reliability and esd protection

    CERN Document Server

    Vashchenko, V A

    2008-01-01

    Provides an important link between the theoretical knowledge in the field of non-linier physics and practical application problems in microelectronics. This title focuses on power semiconductor devices and self-triggering pulsed power devices for ESD protection clamps.

  13. Design, manufacture and in-vitro evaluation of a new microvascular anastomotic device.

    Science.gov (United States)

    Huang, Shao-Fu; Wang, Tien-Hsiang; Wang, Hsuan-Wen; Huang, Shu-Wei; Lin, Chun-Li; Kuo, Hsien-Nan; Yu, Tsung-Chih

    2013-01-01

    Many microvascular anastomoses have been proposed for use with physical assisted methods, such as cuff, ring-pin, stapler, clip to the anastomose blood vessel. The ring-pin type anastomotic device (e.g., 3M Microvascular Anastomotic System) is the most commonly used worldwide because the anastomotic procedure can be conducted more rapidly and with fewer traumas than using sutures. However, problems including vessel leakage, ring slippage, high cost and high surgical skill demand need to be resolved. The aim of this study is to design and manufacture a new anastomotic device for microvascular anastomosis surgery and validate the device functions with in-vitro testing. The new device includes one pair of pinned rings and a set of semi-automatic flap apparatus designed and made using computer-aided design / computer-aided manufacture program. A pair of pinned rings was used to impale vessel walls and establish fluid communication with rings joined. The semi-automatic flap apparatus was used to assist the surgeon to invert the vessel walls and impale onto each ring pin, then turning the apparatus knob to bring the rings together. The device was revised until it became acceptable for clinical requires. An in-vitro test was performed using a custom-made seepage micro-fluid system to detect the leakage of the anastomotic rings. The variation between input and output flow for microvascular anastomoses was evaluated. The new microvascular anastomotic device was convenient and easy to use. It requires less time than sutures to invert and impale vessel walls onto the pinned rings using the semi-automatic flap apparatus. The in-vitro test data showed that there were no tears from the joined rings seam during the procedures. The new anastomotic devices are effective even with some limitations still remaining. This device can be helpful to simplify the anastomosis procedure and reduce the surgery time.

  14. Manufacturing and testing flexible microfluidic devices with optical and electrical detection mechanisms

    NARCIS (Netherlands)

    Ivan, M.G.; Vivet, F.; Meinders, E.R.

    2010-01-01

    Flexible microfluidic devices made of poly(dimethylsiloxane) (PDMS) were manufactured by soft lithography, and tested in detection of ionic species using optical absorption spectroscopy and electrical measurements. PDMS was chosen due to its flexibility and ease of surface modification by exposure

  15. Manufacturing method for parts opposed to plasmas and manufacturing device therefor

    International Nuclear Information System (INIS)

    Fuse, Toshiaki; Tachikawa, Nobuo.

    1995-01-01

    The present invention provides a method of and a device for manufacturing heat insulation parts which are opposed to plasmas, such as parts in the inside of a thermonuclear reactor, which less suffer from defects such as crackings and peelings in the vicinity of the joining portion of the parts. Namely, when an armour and a heat sink are cooled to a room temperature after joining them, the upper surface of the armour and the bottom of the heat sink are pressurized. Then after restricting the convex deformation at the upper surface of the armour and the concave deformation at the bottom of the heat sink, the heat sink bottom are extended at from 600degC to a room temperature or at a room temperature. When a heat resistant material with a small heat expansion coefficient is joined with a cooling material with a large heat expansion coefficient and then cooled, deformation and residual stresses are generated by the difference of the shrinking amount. But deformation and the residual stresses can be reduced by gradually cooling them while restricting them by using a joining device compared with a case of not restricting them. As a result, occurrence of crackings and peelings in the vicinity of the joining portion can be prevented. (I.S.)

  16. [Application of microelectronics CAD tools to synthetic biology].

    Science.gov (United States)

    Madec, Morgan; Haiech, Jacques; Rosati, Élise; Rezgui, Abir; Gendrault, Yves; Lallement, Christophe

    2017-02-01

    Synthetic biology is an emerging science that aims to create new biological functions that do not exist in nature, based on the knowledge acquired in life science over the last century. Since the beginning of this century, several projects in synthetic biology have emerged. The complexity of the developed artificial bio-functions is relatively low so that empirical design methods could be used for the design process. Nevertheless, with the increasing complexity of biological circuits, this is no longer the case and a large number of computer aided design softwares have been developed in the past few years. These tools include languages for the behavioral description and the mathematical modelling of biological systems, simulators at different levels of abstraction, libraries of biological devices and circuit design automation algorithms. All of these tools already exist in other fields of engineering sciences, particularly in microelectronics. This is the approach that is put forward in this paper. © 2017 médecine/sciences – Inserm.

  17. Study of thermo-fluidic behavior of micro-droplet in inkjet-based micro manufacturing processes

    Science.gov (United States)

    Das, Raju; Mahapatra, Abhijit; Ball, Amit Kumar; Roy, Shibendu Shekhar; Murmu, Naresh Chandra

    2017-06-01

    Inkjet printing technology, a maskless, non-contact patterning operation, which has been a revelation in the field of micro and nano manufacturing for its use in the selective deposition of desired materials. It is becoming an exciting alternative technology such as lithography to print functional material on to a substrate. Selective deposition of functional materials on desired substrates is a basic requirement in many of the printing based micro and nano manufacturing operations like the fabrication of microelectronic devices, solar cell, Light-emitting Diode (LED) research fields like pharmaceutical industries for drug discovery purposes and in biotechnology to make DNA microarrays. In this paper, an attempt has been made to design and develop an indigenous Electrohydrodynamic Inkjet printing system for micro fabrication and to study the interrelationships between various thermos-fluidic parameters of the ink material in the printing process. The effect of printing process parameters on printing performance characteristics has also been studied. And the applicability of the process has also been experimentally demonstrated. The experimentally found results were quite satisfactory and accordance to its applicability.

  18. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    International Nuclear Information System (INIS)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-01-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100 deg. C, 1300 deg. C and 1500 deg. C for about 20 hours using heating and cooling rates of 2 deg. C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  19. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    Science.gov (United States)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-03-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100° C, 1300° C and 1500° C for about 20 hours using heating and cooling rates of 2° C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  20. Modelling Technical and Economic Parameters in Selection of Manufacturing Devices

    Directory of Open Access Journals (Sweden)

    Naqib Daneshjo

    2017-11-01

    Full Text Available Sustainable science and technology development is also conditioned by continuous development of means of production which have a key role in structure of each production system. Mechanical nature of the means of production is complemented by controlling and electronic devices in context of intelligent industry. A selection of production machines for a technological process or technological project has so far been practically resolved, often only intuitively. With regard to increasing intelligence, the number of variable parameters that have to be considered when choosing a production device is also increasing. It is necessary to use computing techniques and decision making methods according to heuristic methods and more precise methodological procedures during the selection. The authors present an innovative model for optimization of technical and economic parameters in the selection of manufacturing devices for industry 4.0.

  1. 3D printing for health & wealth: Fabrication of custom-made medical devices through additive manufacturing

    Science.gov (United States)

    Colpani, Alessandro; Fiorentino, Antonio; Ceretti, Elisabetta

    2018-05-01

    Additive Manufacturing (AM) differs from traditional manufacturing technologies by its ability to handle complex shapes with great design flexibility. These features make the technique suitable to fabricate customized components, particularly answering specific custom needs. Although AM mainly referred to prototyping, nowadays the interest in direct manufacturing of actual parts is growing. This article shows the application of AM within the project 3DP-4H&W (3D Printing for Health & Wealth) which involves engineers and physicians for developing pediatric custom-made medical devices to enhance the fulfilling of the patients specific needs. In the project, two types of devices made of a two-component biocompatible silicone are considered. The first application (dental field) consists in a device for cleft lip and palate. The second one (audiological field) consists in an acoustic prosthesis. The geometries of the devices are based on the anatomy of the patient that is obtained through a 3D body scan process. For both devices, two different approaches were planned, namely direct AM and indirect Rapid Tooling (RT). In particular, direct AM consists in the FDM processing of silicone, while RT consists in molds FDM fabrication followed by silicone casting. This paper presents the results of the RT method that is articulated in different phases: the acquisition of the geometry to be realized, the design of the molds taking into account the casting feasibility (as casting channel, vents, part extraction), the realization of molds produced through AM, molds surface chemical finishing, pouring and curing of the silicone. The fabricated devices were evaluated by the physicians team that confirmed the effectiveness of the proposed procedure in fabricating the desired devices. Moreover, the procedure can be used as a general method to extend the range of applications to any custom-made device for anatomic districts, especially where complex shapes are present (as tracheal or

  2. Manufacturing and testing flexible microfluidic devices with optical and electrical detection mechanisms

    Science.gov (United States)

    Ivan, Marius G.; Vivet, Frédéric; Meinders, Erwin R.

    2010-06-01

    Flexible microfluidic devices made of poly(dimethylsiloxane) (PDMS) were manufactured by soft lithography, and tested in detection of ionic species using optical absorption spectroscopy and electrical measurements. PDMS was chosen due to its flexibility and ease of surface modification by exposure to plasma and UV treatment, its transparency in UV-Vis regions of the light spectrum, and biocompatibility. The dual-detection mechanism allows the user more freedom in choosing the detection tool, and a functional device was successfully tested. Optical lithography was employed for manufacturing templates, which were subsequently used for imprinting liquid PDMS by thermal curing. Gold electrodes having various widths and distances among them were patterned with optical lithography on the top part which sealed the microchannels, and the devices were employed for detection of ionic species in aqueous salt solutions as well as micro-electrolysis cells. Due to the transparency of PDMS in UV-Vis the microfluidics were also used as photoreactors, and the in-situ formed charged species were monitored by applying a voltage between electrodes. Upon addition of a colorimetric pH sensor, acid was detected with absorption spectroscopy.

  3. Integrated Microelectronics and Photonics Active Cooling Technology (IMPACT)

    National Research Council Canada - National Science Library

    Bowers, John

    2003-01-01

    ...) coolers and their integration with microelectronics and photonics. The majority of our research involves the development of this new technology through nanostructured materials design and growth...

  4. Design for Additive Bio-Manufacturing: From Patient-Specific Medical Devices to Rationally Designed Meta-Biomaterials.

    Science.gov (United States)

    Zadpoor, Amir A

    2017-07-25

    Recent advances in additive manufacturing (AM) techniques in terms of accuracy, reliability, the range of processable materials, and commercial availability have made them promising candidates for production of functional parts including those used in the biomedical industry. The complexity-for-free feature offered by AM means that very complex designs become feasible to manufacture, while batch-size-indifference enables fabrication of fully patient-specific medical devices. Design for AM (DfAM) approaches aim to fully utilize those features for development of medical devices with substantially enhanced performance and biomaterials with unprecedented combinations of favorable properties that originate from complex geometrical designs at the micro-scale. This paper reviews the most important approaches in DfAM particularly those applicable to additive bio-manufacturing including image-based design pipelines, parametric and non-parametric designs, metamaterials, rational and computationally enabled design, topology optimization, and bio-inspired design. Areas with limited research have been identified and suggestions have been made for future research. The paper concludes with a brief discussion on the practical aspects of DfAM and the potential of combining AM with subtractive and formative manufacturing processes in so-called hybrid manufacturing processes.

  5. Design for Additive Bio-Manufacturing: From Patient-Specific Medical Devices to Rationally Designed Meta-Biomaterials

    Directory of Open Access Journals (Sweden)

    Amir A. Zadpoor

    2017-07-01

    Full Text Available Recent advances in additive manufacturing (AM techniques in terms of accuracy, reliability, the range of processable materials, and commercial availability have made them promising candidates for production of functional parts including those used in the biomedical industry. The complexity-for-free feature offered by AM means that very complex designs become feasible to manufacture, while batch-size-indifference enables fabrication of fully patient-specific medical devices. Design for AM (DfAM approaches aim to fully utilize those features for development of medical devices with substantially enhanced performance and biomaterials with unprecedented combinations of favorable properties that originate from complex geometrical designs at the micro-scale. This paper reviews the most important approaches in DfAM particularly those applicable to additive bio-manufacturing including image-based design pipelines, parametric and non-parametric designs, metamaterials, rational and computationally enabled design, topology optimization, and bio-inspired design. Areas with limited research have been identified and suggestions have been made for future research. The paper concludes with a brief discussion on the practical aspects of DfAM and the potential of combining AM with subtractive and formative manufacturing processes in so-called hybrid manufacturing processes.

  6. Computer simulation of electromigration in microelectronics interconnect

    OpenAIRE

    Zhu, Xiaoxin

    2014-01-01

    Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly and packaging industry as electronics components and interconnects get smaller and smaller. According...

  7. Dictionary of microelectronics and microcomputer technology

    International Nuclear Information System (INIS)

    Attiyate, Y.H.; Shah, R.R.

    1984-01-01

    This bilingual dictionary (German-English and English-German) is to give the general public a clearer idea of the terminology of microelectronics, microcomputers, data processing, and computer science. Each part contains about 7500 terms frequently encountered in practice, about 2000 of which are supplemented by precise explanations. (orig./HP) [de

  8. Problems in CEMA microelectronic cooperation noted

    Science.gov (United States)

    Grzybowski, J.; Kusinski, J.

    1983-10-01

    The development and market trends of products, which use large scale integrated circuits are discussed. Products such as pocket calculators, electronic wrist watches, telephones, and automobiles are used to illustrate the economic results of market saturation with specialized integrated circuits. The status of microelectronics in socialist countries in Europe is addressed.

  9. Hypothesis analysis methods, hypothesis analysis devices, and articles of manufacture

    Science.gov (United States)

    Sanfilippo, Antonio P [Richland, WA; Cowell, Andrew J [Kennewick, WA; Gregory, Michelle L [Richland, WA; Baddeley, Robert L [Richland, WA; Paulson, Patrick R [Pasco, WA; Tratz, Stephen C [Richland, WA; Hohimer, Ryan E [West Richland, WA

    2012-03-20

    Hypothesis analysis methods, hypothesis analysis devices, and articles of manufacture are described according to some aspects. In one aspect, a hypothesis analysis method includes providing a hypothesis, providing an indicator which at least one of supports and refutes the hypothesis, using the indicator, associating evidence with the hypothesis, weighting the association of the evidence with the hypothesis, and using the weighting, providing information regarding the accuracy of the hypothesis.

  10. Methods of manufacturing a detector device

    International Nuclear Information System (INIS)

    Wotherspoon, J.T.M.

    1982-01-01

    In the manufacture of an infra-red radiation detector device, a body of rho-type cadmium mercury telluride is bombarded with ions to etch away a part of the body and to produce from the etched-away part of the body an excess concentration of mercury which acts as a dopant source converting an adjacent part of the body into n-type material. The energy of the bombarding ions is less than 30 keV, and by appropriately choosing the ion dose this conversion can be effected over a depth considerably greater than the penetration depth of the ions. A p-n junction can be fabricated in this way for a photovoltaic detector. The conductivity type conversion may even be effected through the body thickness. The etching and conversion can be localised by masking part of the body surface against the ion bombardment. (author)

  11. Application of ionizing radiation processing in biomedical engineering and microelectronics

    International Nuclear Information System (INIS)

    Hongfej, H.; Jilan, W.

    1988-01-01

    The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristics reaction means such as crosslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become a important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this technique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics

  12. Design, Manufacturing and Experimental Validation of Optical Fiber Sensors Based Devices for Structural Health Monitoring

    Directory of Open Access Journals (Sweden)

    Angela CORICCIATI

    2016-06-01

    Full Text Available The use of optical fiber sensors is a promising and rising technique used for Structural Health Monitoring (SHM, because permit to monitor continuously the strain and the temperature of the structure where they are applied. In the present paper three different types of smart devices, that are composite materials with an optical fiber sensor embedded inside them during the manufacturing process, are described: Smart Patch, Smart Rebar and Smart Textile, which are respectively a plate for local exterior intervention, a rod for shear and flexural interior reinforcement and a textile for an external whole application. In addition to the monitoring aim, the possible additional function of these devices could be the reinforcement of the structures where they are applied. In the present work, after technology manufacturing description, the experimental laboratory characterization of each device is discussed. At last, smart devices application on medium scale masonry walls and their validation by mechanical tests is described.

  13. Materials contamination control in the microelectronic industry

    International Nuclear Information System (INIS)

    Tardif, F.

    1993-01-01

    This paper deals with many aspects of the contamination of materials in the microelectronic industry. The contamination's control of chemicals, process gases, silicon and the survey of the ions free water's purity are treated. (TEC). 29 figs., 7 tabs

  14. Government Microelectronics Assessment for Trust (GOMAT)

    Science.gov (United States)

    Berg, Melanie D.; LaBel, Kenneth A.

    2018-01-01

    NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.

  15. Development of a Nuclear Reaction Database on Silicon for Simulation of Neutron-Induced Single-Event Upsets in Microelectronics and its Application

    International Nuclear Information System (INIS)

    Watanabe, Yukinobu; Kodama, Akihiro; Tukamoto, Yasuyuki; Nakashima, Hideki

    2005-01-01

    We have developed a cross-section database for neutron-induced reactions on 28Si in the energy range between 2 MeV and 3 GeV in order to analyze single-event upsets (SEUs) phenomena induced by cosmic-ray neutrons in microelectronic devices. A simplified spherical device model is proposed for simulation of the initial processes of SEUs. The model is applied to SEU cross-section calculations for semiconductor memory devices. The calculated results are compared with measured SEU cross sections and the other simulation result. The dependence of SEU cross sections on incident neutron energy and secondary ions having the most important effects on SEUs are discussed

  16. Single-event burnout of power MOSFET devices for satellite application

    International Nuclear Information System (INIS)

    Xue Yuxiong; Tian Kai; Cao Zhou; Yang Shiyu; Liu Gang; Cai Xiaowu; Lu Jiang

    2008-01-01

    Single-event burnout (SEB) sensitivity was tested for power MOSFET devices, JTMCS081 and JTMCS062, which were made in Institute of Microelectronics, Chinese Academy of Sciences, using californium-252 simulation source. SEB voltage threshold was found for devices under test (DUT). It is helpful for engineers to choose devices used in satellites. (authors)

  17. Applications of ionizing radiation processing in biomedical engineering and microelectronics

    International Nuclear Information System (INIS)

    Ha Hongfei; Wu Jilan

    1987-01-01

    The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristic reaction means such as corsslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become an important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this techique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics. (author)

  18. Encapsulation methods and dielectric layers for organic electrical devices

    Science.gov (United States)

    Blum, Yigal D; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijan

    2013-07-02

    The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

  19. DLTS study of annihilation of oxidation induced deep-level defects ...

    Indian Academy of Sciences (India)

    Administrator

    microelectronics device technologies. As technology is ... an important role in manufacturing high-speed electronic ... DLTS is a capacitance transient thermal scanning tech- ... again dipped in methanol and dried using nitrogen gun. A.

  20. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea

    Science.gov (United States)

    Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

    2015-01-01

    Objectives Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Methods Based on claim data from the National Health Insurance (2008–2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Results Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Conclusions Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results. PMID:25938673

  1. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

    Directory of Open Access Journals (Sweden)

    Inah Kim

    Full Text Available Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea.Based on claim data from the National Health Insurance (2008-2012, we estimated age-specific rates of spontaneous abortion (SAB and menstrual aberration (MA among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs were estimated.Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties.Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

  2. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

    Science.gov (United States)

    Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

    2015-01-01

    Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Based on claim data from the National Health Insurance (2008-2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

  3. Materials science in microelectronics II the effects of structure on properties in thin films

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    The subject matter of thin-films - which play a key role in microelectronics - divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: Electrical properties Magnetic properties Optical properties Mechanical properties Mass transport properties Interface and junction properties Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties.

  4. Handbook of compound semiconductors growth, processing, characterization, and devices

    CERN Document Server

    Holloway, Paul H

    1996-01-01

    This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.

  5. A self-regulating valve for single-phase liquid cooling of microelectronics

    International Nuclear Information System (INIS)

    Donose, Radu; De Volder, Michaël; Peirs, Jan; Reynaerts, Dominiek

    2011-01-01

    This paper reports on the design, optimization and testing of a self-regulating valve for single-phase liquid cooling of microelectronics. Its purpose is to maintain the integrated circuit (IC) at constant temperature and to reduce power consumption by diminishing flow generated by the pump as a function of the cooling requirements. It uses a thermopneumatic actuation principle that combines the advantages of zero power consumption and small size in combination with a high flow rate and low manufacturing costs. The valve actuation is provided by the thermal expansion of a liquid (actuation fluid) which, at the same time, actuates the valve and provides feed-back sensing. A maximum flow rate of 38 kg h −1 passes through the valve for a heat load up to 500 W. The valve is able to reduce the pumping power by up to 60% and it has the capability to maintain the IC at a more uniform temperature.

  6. Carbon-ionogel supercapacitors for integrated microelectronics

    Science.gov (United States)

    Leung, Greg; Smith, Leland; Lau, Jonathan; Dunn, Bruce; Chui, Chi On

    2016-01-01

    To exceed the performance limits of dielectric capacitors in microelectronic circuit applications, we design and demonstrate on-chip coplanar electric double-layer capacitors (EDLCs), or supercapacitors, employing carbon-coated gold electrodes with ionogel electrolyte. The formation of carbon-coated microelectrodes is accomplished by solution processing and results in a ten-fold increase in EDLC capacitance compared to bare gold electrodes without carbon. At frequencies up to 10 Hz, an areal capacitance of 2.1 pF μm-2 is achieved for coplanar carbon-ionogel EDLCs with 10 μm electrode gaps and 0.14 mm2 electrode area. Our smallest devices, comprised of 5 μm electrode gaps and 80 μm2 of active electrode area, reach areal capacitance values of ˜0.3 pF μm-2 at frequencies up to 1 kHz, even without carbon. To our knowledge, these are the highest reported values to date for on-chip EDLCs with sub-mm2 areas. A physical EDLC model is developed through the use of computer-aided simulations for design exploration and optimization of coplanar EDLCs. Through modeling and comparison with experimental data, we highlight the importance of reducing the electrode gap and electrolyte resistance to achieve maximum performance from on-chip EDLCs.

  7. Hydrophilic Polymer Embolism: Implications for Manufacturing, Regulation, and Postmarket Surveillance of Coated Intravascular Medical Devices.

    Science.gov (United States)

    Mehta, Rashi I; Mehta, Rupal I

    2018-03-19

    Hydrophilic polymers are ubiquitously applied as surface coatings on catheters and intravascular medical technologies. Recent clinical literature has heightened awareness on the complication of hydrophilic polymer embolism, the phenomenon wherein polymer coating layers separate from catheter and device surfaces, and may be affiliated with a range of unanticipated adverse reactions. Significant system barriers have limited and delayed reporting on this iatrogenic complication, the full effects of which remain underrecognized by healthcare providers and manufacturers of various branded devices. In 2015, the United States Food and Drug Administration acknowledged rising clinical concerns and stated that the agency would work with stakeholders to further evaluate gaps that exist in current national and international device standards for coated intravascular medical technologies. The present article reviews current knowledge on this complication as well as factors that played a role in delaying detection and dissemination of information and new knowledge once hazards and clinical risks were identified. Furthermore, organ-specific effects and adverse reaction patterns are summarized, along with implications for device manufacturing, safety assurance, and regulation. Qualitative and quantitative particulate testing are needed to optimize coated intravascular device technologies. Moreover, general enhanced processes for medical device surveillance are required for timely adverse event management and to ensure patient safety.

  8. Status and perspectives of nanoscale device modelling

    DEFF Research Database (Denmark)

    Macucci, M.; Lannaccone, G.; Greer, J.

    2001-01-01

    During the meetings of the theory and modelling working group, within the MEL-ARI (Microelectronics Advanced Research Initiative) and NID-FET (Nanotechnology information Devices-Future and Emerging Technologies) initiatives of the European Commission, we have been discussing the current status...

  9. Microelectronics used for Semiconductor Imaging Detectors

    CERN Document Server

    Heijne, Erik H M

    2010-01-01

    Semiconductor crystal technology, microelectronics developments and nuclear particle detection have been in a relation of symbiosis, all the way from the beginning. The increase of complexity in electronics chips can now be applied to obtain much more information on the incident nuclear radiation. Some basic technologies are described, in order to acquire insight in possibilities and limitations for the most recent detectors.

  10. Investigations on MGy ionizing dose effects in thin oxides of micro-electronic devices

    Energy Technology Data Exchange (ETDEWEB)

    Gaillardin, M.; Paillet, P.; Raine, M.; Martinez, M.; Marcandella, C.; Duhamel, O.; Richard, N.; Leray, J.L. [CEA, DAM, DIF, F-91297 Arpajon (France); Goiffon, V.; Corbiere, F.; Rolando, S.; Molina, R.; Magnan, P. [ISAE, Universite de Toulouse, 10 avenue Edouard Belin, BP 54032, 31055 Toulouse Cedex 4 (France); Girard, S.; Ouerdane, Y.; Boukenter, A. [Universite de Saint-Etienne, Laboratoire H. Curien, UMR-5516, 42000, Saint-Etienne (France)

    2015-07-01

    Total ionizing dose (TID) effects have been studied for a long time in micro-electronic components designed to operate in natural and artificial environments. In most cases, TID induces both charge trapping in the bulk of irradiated oxides and the buildup of interface traps located at semiconductor/dielectric interfaces. Such effects result from basic mechanisms driven by both the shape of the electric field which stands into the oxide and by fabrication process parameters inducing pre-existing traps in the oxide's bulk. From the pioneering studies based on 'thick' oxide technologies to the most recent ones dedicated to innovative technologies, most studies concluded that the impact of total ionizing dose effects reduces with the oxide thinning. This is specifically the case for the gate-oxide of Metal-Oxide-Semiconductor Field Effect Transistors (MOSFET) for which it is generally considered that TID is not a major issue anymore at kGy dose ranges. TID effects are now mainly due to charge trapping in the field oxides such as Shallow Trench Isolation. This creates either parasitic conduction paths or Radiation-Induced Narrow Channel Effects (RINCE). Static current-voltage (I-V) electrical characteristics are then modified through a significant increase of the off-current of NMOS transistors or by shifting the whole I-V curves (of both NMOS and PMOS transistors). Based on these assumptions, no significant shift of I-V curves should be observed in modern bulk CMOS technologies. However, such phenomenon may not be directly extrapolated to higher TID ranges, typically of several MGy for which only few data are available in the literature. This paper presents evidences of large threshold voltage shifts measured at MGy dose levels despite the fact that transistors are designed in a submicron bulk technology which features a 7-nm thin gate-oxide on GO2 transistors dedicated to mixed analog/digital integrated circuits. Such electrical shifts are encountered

  11. Investigations on MGy ionizing dose effects in thin oxides of micro-electronic devices

    International Nuclear Information System (INIS)

    Gaillardin, M.; Paillet, P.; Raine, M.; Martinez, M.; Marcandella, C.; Duhamel, O.; Richard, N.; Leray, J.L.; Goiffon, V.; Corbiere, F.; Rolando, S.; Molina, R.; Magnan, P.; Girard, S.; Ouerdane, Y.; Boukenter, A.

    2015-01-01

    Total ionizing dose (TID) effects have been studied for a long time in micro-electronic components designed to operate in natural and artificial environments. In most cases, TID induces both charge trapping in the bulk of irradiated oxides and the buildup of interface traps located at semiconductor/dielectric interfaces. Such effects result from basic mechanisms driven by both the shape of the electric field which stands into the oxide and by fabrication process parameters inducing pre-existing traps in the oxide's bulk. From the pioneering studies based on 'thick' oxide technologies to the most recent ones dedicated to innovative technologies, most studies concluded that the impact of total ionizing dose effects reduces with the oxide thinning. This is specifically the case for the gate-oxide of Metal-Oxide-Semiconductor Field Effect Transistors (MOSFET) for which it is generally considered that TID is not a major issue anymore at kGy dose ranges. TID effects are now mainly due to charge trapping in the field oxides such as Shallow Trench Isolation. This creates either parasitic conduction paths or Radiation-Induced Narrow Channel Effects (RINCE). Static current-voltage (I-V) electrical characteristics are then modified through a significant increase of the off-current of NMOS transistors or by shifting the whole I-V curves (of both NMOS and PMOS transistors). Based on these assumptions, no significant shift of I-V curves should be observed in modern bulk CMOS technologies. However, such phenomenon may not be directly extrapolated to higher TID ranges, typically of several MGy for which only few data are available in the literature. This paper presents evidences of large threshold voltage shifts measured at MGy dose levels despite the fact that transistors are designed in a submicron bulk technology which features a 7-nm thin gate-oxide on GO2 transistors dedicated to mixed analog/digital integrated circuits. Such electrical shifts are encountered

  12. Bridging the gap between services, devices and humans in ami environments

    NARCIS (Netherlands)

    Acampora, G.; Loia, V.

    2005-01-01

    By 2015, according to Mark Pinto of Bell Labs, the microelectronics industry will be manufacturing 10 million silicon transistors per human being per day and the applications will exist to consume them. The evolution of electronic design will lead entire products to be implemented on single silicon

  13. PREFACE: E-MRS 2012 Spring Meeting, Symposium M: More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

    Science.gov (United States)

    Wenger, Christian; Fompeyrine, Jean; Vallée, Christophe; Locquet, Jean-Pierre

    2012-12-01

    More than Moore explores a new area of Silicon based microelectronics, which reaches beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, More than Moore focuses on motivating new technological possibilities. In the past decades, the main stream of microelectronics progresses was mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While the microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there is increasing momentum for the development of 'More than Moore' technologies which are based on silicon technologies but do not simply scale with Moore's law. Typical examples are RF, Power/HV, Passives, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials. Important key challenges for the realization of the 'More than Moore' strategy are: perspective materials for future THz devices materials systems for embedded sensors and actuators perspective materials for epitaxial approaches material systems for embedded innovative memory technologies development of new materials with customized characteristics The Hot topics covered by the symposium M (More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics) at E-MRS 2012 Spring Meeting, 14-18 May 2012 have been: development of functional ceramics thin films New dielectric materials for advanced microelectronics bio- and CMOS compatible

  14. Communications device identification methods, communications methods, wireless communications readers, wireless communications systems, and articles of manufacture

    Science.gov (United States)

    Steele, Kerry D [Kennewick, WA; Anderson, Gordon A [Benton City, WA; Gilbert, Ronald W [Morgan Hill, CA

    2011-02-01

    Communications device identification methods, communications methods, wireless communications readers, wireless communications systems, and articles of manufacture are described. In one aspect, a communications device identification method includes providing identification information regarding a group of wireless identification devices within a wireless communications range of a reader, using the provided identification information, selecting one of a plurality of different search procedures for identifying unidentified ones of the wireless identification devices within the wireless communications range, and identifying at least some of the unidentified ones of the wireless identification devices using the selected one of the search procedures.

  15. Design and fabrication of a sleep apnea device using computer-aided design/additive manufacture technologies.

    Science.gov (United States)

    Al Mortadi, Noor; Eggbeer, Dominic; Lewis, Jeffrey; Williams, Robert J

    2013-04-01

    The aim of this study was to analyze the latest innovations in additive manufacture techniques and uniquely apply them to dentistry, to build a sleep apnea device requiring rotating hinges. Laser scanning was used to capture the three-dimensional topography of an upper and lower dental cast. The data sets were imported into an appropriate computer-aided design software environment, which was used to design a sleep apnea device. This design was then exported as a stereolithography file and transferred for three-dimensional printing by an additive manufacture machine. The results not only revealed that the novel computer-based technique presented provides new design opportunities but also highlighted limitations that must be addressed before the techniques can become clinically viable.

  16. Progress in nuclear measuring and experimental techniques by application of microelectronics. 1

    International Nuclear Information System (INIS)

    Meiling, W.

    1984-01-01

    In the past decade considerable progress has been made in nuclear measuring and experimental techniques by developing position-sensitive detector systems and widely using integrated circuits and microcomputers for data acquisition and processing as well as for automation of measuring processes. In this report which will be published in three parts those developments are reviewed and demonstrated on selected examples. After briefly characterizing microelectronics, the use of microelectronic elements for radiation detectors is reviewed. (author)

  17. Physics in microelectronics and microelectronics in physics

    International Nuclear Information System (INIS)

    Mooser, E.

    1983-01-01

    Modern semiconductor technology and its many different facets such as micro-electronics, optoelectronics, integrated optics, solar energy conversion, etc... have their origin in solid state physics. However, because of their enormous economic impact, their development has been so rapid and has lead to such a high degree of complexity and sophistication, that to the newcomer in the field, the links between solid state electronics and solid state physics are no longer evident. The processes involved in the production of integrated circuits and solid state lasers afford very instructive examples on which to demostrate the impact of physics on semiconductor technology. Processes discussed include: Purification of silicon; Crystal growth; Liquid and vapour phase epitaxy; Photo- and electronbeam lithography; Mask production; Wet and dry etching; Doping and metal deposition, etc... The inverse phenomenon, i.e. the impact of semiconductor technology on physics will be demonstrated on examples involving two-dimensional electron gases. Such gases can readily be obtained in 'synthetic' layer structures, produced by molecular beam epitaxy and in the depletion layers of field-effect transistors with MOS geometry. the examples discussed involve the multiple potential well laser and the 'von Klitzing experiment'. (Author) [pt

  18. Microelectronics in power electronics and electrical drives

    Energy Technology Data Exchange (ETDEWEB)

    1982-01-01

    From October, 1214, 1982 at Darmstadt (FRG) a meeting took place on ''Microelectronics in power electronics and Electrical Drives''. This volume contains the papers of the 65 lectures, held at the symposium. For each of the 10 papers dealing with problems on electric-powered vehicles a separate subject analysis has been carried out.

  19. Electric poling-assisted additive manufacturing process for PVDF polymer-based piezoelectric device applications

    International Nuclear Information System (INIS)

    Lee, ChaBum; Tarbutton, Joshua A

    2014-01-01

    This paper presents a new additive manufacturing (AM) process to directly and continuously print piezoelectric devices from polyvinylidene fluoride (PVDF) polymeric filament rods under a strong electric field. This process, called ‘electric poling-assisted additive manufacturing or EPAM, combines AM and electric poling processes and is able to fabricate free-form shape piezoelectric devices continuously. In this process, the PVDF polymer dipoles remain well-aligned and uniform over a large area in a single design, production and fabrication step. During EPAM process, molten PVDF polymer is simultaneously mechanically stresses in-situ by the leading nozzle and electrically poled by applying high electric field under high temperature. The EPAM system was constructed to directly print piezoelectric structures from PVDF polymeric filament while applying high electric field between nozzle tip and printing bed in AM machine. Piezoelectric devices were successfully fabricated using the EPAM process. The crystalline phase transitions that occurred from the process were identified by using the Fourier transform infrared spectroscope. The results indicate that devices printed under a strong electric field become piezoelectric during the EPAM process and that stronger electric fields result in greater piezoelectricity as marked by the electrical response and the formation of sharper peaks at the polar β crystalline wavenumber of the PVDF polymer. Performing this process in the absence of an electric field does not result in dipole alignment of PVDF polymer. The EPAM process is expected to lead to the widespread use of AM to fabricate a variety of piezoelectric PVDF polymer-based devices for sensing, actuation and energy harvesting applications with simple, low cost, single processing and fabrication step. (paper)

  20. Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach

    CERN Document Server

    Laurila, Tomi; Paulasto-Kröckel, Mervi; Turunen, Markus; Mattila, Toni T; Kivilahti, Jorma

    2012-01-01

    Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep un...

  1. Computer Simulation of Robotic Device Components in 3D Printer Manufacturing

    Directory of Open Access Journals (Sweden)

    M. A. Kiselev

    2016-01-01

    Full Text Available The paper considers a relevant problem "Computer simulation of robotic device components in manufacturing on a 3D printer" and highlights the problem of computer simulation based on the cognitive programming technology of robotic device components. The paper subject is urgent because computer simulation of force-torque and accuracy characteristics of robot components in terms of their manufacturing properties and conditions from polymeric and metallic materials is of paramount importance for programming and manufacturing on the 3D printers. Two types of additive manufacturing technologies were used:1. FDM (Fused deposition modeling - layered growth of products from molten plastic strands;2. SLM (Selective laser melting - selective laser sintering of metal powders, which, in turn, create:• conditions for reducing the use of expensive equipment;• reducing weight and increasing strength through optimization of  the lattice structures when using a bionic design;• a capability to implement mathematical modeling of individual components of robotic and other devices in terms of appropriate characteristics;• a 3D printing capability to create unique items, which cannot be made by other known methods.The paper aim was to confirm the possibility of ensuring the strength and accuracy characteristics of cases when printing from polymeric and metallic materials on a 3D printer. The investigation emphasis is on mathematical modeling based on the cognitive programming technology using the additive technologies in their studies since it is, generally, impossible to make the obtained optimized structures on the modern CNC machines.The latter allows us to create a program code to be clear to other developers without cost, additional time for development, adaptation and implementation.Year by year Russian companies increasingly use a 3D-print system in mechanical engineering, aerospace industry, and for scientific purposes. Machines for the additive

  2. Electromigration of intergranular voids in metal films for microelectronic interconnects

    CERN Document Server

    Averbuch, A; Ravve, I

    2003-01-01

    Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

  3. A quantum computer based on recombination processes in microelectronic devices

    International Nuclear Information System (INIS)

    Theodoropoulos, K; Ntalaperas, D; Petras, I; Konofaos, N

    2005-01-01

    In this paper a quantum computer based on the recombination processes happening in semiconductor devices is presented. A 'data element' and a 'computational element' are derived based on Schokley-Read-Hall statistics and they can later be used to manifest a simple and known quantum computing process. Such a paradigm is shown by the application of the proposed computer onto a well known physical system involving traps in semiconductor devices

  4. Integrated multiscale modeling of molecular computing devices

    International Nuclear Information System (INIS)

    Cummings, Peter T; Leng Yongsheng

    2005-01-01

    Molecular electronics, in which single organic molecules are designed to perform the functions of transistors, diodes, switches and other circuit elements used in current siliconbased microelecronics, is drawing wide interest as a potential replacement technology for conventional silicon-based lithographically etched microelectronic devices. In addition to their nanoscopic scale, the additional advantage of molecular electronics devices compared to silicon-based lithographically etched devices is the promise of being able to produce them cheaply on an industrial scale using wet chemistry methods (i.e., self-assembly from solution). The design of molecular electronics devices, and the processes to make them on an industrial scale, will require a thorough theoretical understanding of the molecular and higher level processes involved. Hence, the development of modeling techniques for molecular electronics devices is a high priority from both a basic science point of view (to understand the experimental studies in this field) and from an applied nanotechnology (manufacturing) point of view. Modeling molecular electronics devices requires computational methods at all length scales - electronic structure methods for calculating electron transport through organic molecules bonded to inorganic surfaces, molecular simulation methods for determining the structure of self-assembled films of organic molecules on inorganic surfaces, mesoscale methods to understand and predict the formation of mesoscale patterns on surfaces (including interconnect architecture), and macroscopic scale methods (including finite element methods) for simulating the behavior of molecular electronic circuit elements in a larger integrated device. Here we describe a large Department of Energy project involving six universities and one national laboratory aimed at developing integrated multiscale methods for modeling molecular electronics devices. The project is funded equally by the Office of Basic

  5. International Conference on Microelectronics, Electromagnetics and Telecommunications

    CERN Document Server

    Rao, N; Kumar, S; Raj, C; Rao, V; Sarma, G

    2016-01-01

    This volume contains 73 papers presented at ICMEET 2015: International Conference on Microelectronics, Electromagnetics and Telecommunications. The conference was held during 18 – 19 December, 2015 at Department of Electronics and Communication Engineering, GITAM Institute of Technology, GITAM University, Visakhapatnam, INDIA. This volume contains papers mainly focused on Antennas, Electromagnetics, Telecommunication Engineering and Low Power VLSI Design.

  6. Simulation of atomistic processes during silicon oxidation

    OpenAIRE

    Bongiorno, Angelo

    2003-01-01

    Silicon dioxide (SiO2) films grown on silicon monocrystal (Si) substrates form the gate oxides in current Si-based microelectronics devices. The understanding at the atomic scale of both the silicon oxidation process and the properties of the Si(100)-SiO2 interface is of significant importance in state-of-the-art silicon microelectronics manufacturing. These two topics are intimately coupled and are both addressed in this theoretical investigation mainly through first-principles calculations....

  7. Biofabrication to build the biology-device interface

    International Nuclear Information System (INIS)

    Liu Yi; Kim, Eunkyoung; Culver, James N; Bentley, William E; Payne, Gregory F; Ghodssi, Reza; Rubloff, Gary W

    2010-01-01

    The last century witnessed spectacular advances in both microelectronics and biotechnology yet there was little synergy between the two. A challenge to their integration is that biological and electronic systems are constructed using divergent fabrication paradigms. Biology fabricates bottom-up with labile components, while microelectronic devices are fabricated top-down using methods that are 'bio-incompatible'. Biofabrication-the use of biological materials and mechanisms for construction-offers the opportunity to span these fabrication paradigms by providing convergent approaches for building the bio-device interface. Integral to biofabrication are stimuli-responsive materials (e.g. film-forming polysaccharides) that allow directed assembly under near physiological conditions in response to device-imposed signals. Biomolecular engineering, through recombinant technology, allows biological components to be endowed with information for assembly (e.g. encoded in a protein's amino acid sequence). Finally, self-assembly and enzymatic assembly provide the mechanisms for construction over a hierarchy of length scales. Here, we review recent advances in the use of biofabrication to build the bio-device interface. We anticipate that the biofabrication toolbox will expand over the next decade as more researchers enlist the unique construction capabilities of biology. Further, we look forward to observing the application of this toolbox to create devices that can better diagnose disease, detect pathogens and discover drugs. Finally, we expect that biofabrication will enable the effective interfacing of biology with electronics to create implantable devices for personalized and regenerative medicine. (topical review)

  8. MEMS- and NEMS-based complex adaptive smart devices and systems

    Science.gov (United States)

    Varadan, Vijay K.

    2001-10-01

    The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with feature sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nanotubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems.

  9. Applicability of LET to single events in microelectronic structures

    Science.gov (United States)

    Xapsos, Michael A.

    1992-12-01

    LET is often used as a single parameter to determine the energy deposited in a microelectronic structure by a single event. The accuracy of this assumption is examined for ranges of ion energies and volumes of silicon appropriate for modern microelectronics. It is shown to be accurate only under very restricted conditions. Significant differences arise because (1) LET is related to energy lost by the ion, not energy deposited in the volume; and (2) LET is an average value and does not account for statistical variations in energy deposition. Criteria are suggested for determining when factors other than LET should be considered, and new analytical approaches are presented to account for them. One implication of these results is that improvements can be made in space upset rate predictions by incorporating the new methods into currently used codes such as CREME and CRUP.

  10. Possibilities for mixed mode chip manufacturing in EUROPRACTICE

    Science.gov (United States)

    Das, C.

    1997-02-01

    EUROPRACTICE is an EC initiative under the ESPRIT programme which aims to stimulate the wider exploitation of state-of-the-art microelectronics technologies by European industry and to enhance European industrial competitiveness in the global market-place. Through EUROPRACTICE, the EC has created a range of Basic Services that offer users a cost-effective and flexible means of accessing three main microelectronics-based technologies: Application Specific Integrated Circuit (ASICs), Multi-Chip Modules (MCMs) and Microsystems. EUROPRACTICE Basic Services reduce the cost and risk for companies wishing to begin using these technologies. EUROPRACTICE offers a fully supported, low cost route for companies to design and fabricate ASICs for their individual applications. Low cost is achieved by consolidating designs from many users onto a single semiconductor wafer (MPW: Multi Project Wafer). The EUROPRACTICE IC Manufacturing Service (ICMS) offers a broad range of fabrication technologies including CMOS, BiCMOS and GaAs. The Service extends from enabling users to produce prototype ASICs for testing and evaluation, through to low-volume production runs.

  11. Labour-Saving versus Work-Amplifying Effects of Micro-Electronics.

    Science.gov (United States)

    Watanabe, Susumu

    1986-01-01

    This article argues that the labor-displacement effect of microelectronic machinery, especially numerically controlled machine tools and robots, has been exaggerated and that people tend to confuse the impact of intensified international competition with that of the new technology. (Author/CT)

  12. Manufacturing and testing flexible microfluidic devices with optical and electrical detection mechanisms

    OpenAIRE

    Ivan, M.G.; Vivet, F.; Meinders, E.R.

    2010-01-01

    Flexible microfluidic devices made of poly(dimethylsiloxane) (PDMS) were manufactured by soft lithography, and tested in detection of ionic species using optical absorption spectroscopy and electrical measurements. PDMS was chosen due to its flexibility and ease of surface modification by exposure to plasma and UV treatment, its transparency in UV-Vis regions of the light spectrum, and biocompatibility. The dual-detection mechanism allows the user more freedom in choosing the detection tool, ...

  13. Manufacture of micro fluidic devices by laser welding using thermal transfer printing techniques

    Science.gov (United States)

    Klein, R.; Klein, K. F.; Tobisch, T.; Thoelken, D.; Belz, M.

    2016-03-01

    Micro-fluidic devices are widely used today in the areas of medical diagnostics and drug research, as well as for applications within the process, electronics and chemical industry. Microliters of fluids or single cell to cell interactions can be conveniently analyzed with such devices using fluorescence imaging, phase contrast microscopy or spectroscopic techniques. Typical micro-fluidic devices consist of a thermoplastic base component with chambers and channels covered by a hermetic fluid and gas tight sealed lid component. Both components are usually from the same or similar thermoplastic material. Different mechanical, adhesive or thermal joining processes can be used to assemble base component and lid. Today, laser beam welding shows the potential to become a novel manufacturing opportunity for midsize and large scale production of micro-fluidic devices resulting in excellent processing quality by localized heat input and low thermal stress to the device during processing. For laser welding, optical absorption of the resin and laser wavelength has to be matched for proper joining. This paper will focus on a new approach to prepare micro-fluidic channels in such devices using a thermal transfer printing process, where an optical absorbing layer absorbs the laser energy. Advantages of this process will be discussed in combination with laser welding of optical transparent micro-fluidic devices.

  14. Monolithic silicon photonics in a sub-100nm SOI CMOS microprocessor foundry: progress from devices to systems

    Science.gov (United States)

    Popović, Miloš A.; Wade, Mark T.; Orcutt, Jason S.; Shainline, Jeffrey M.; Sun, Chen; Georgas, Michael; Moss, Benjamin; Kumar, Rajesh; Alloatti, Luca; Pavanello, Fabio; Chen, Yu-Hsin; Nammari, Kareem; Notaros, Jelena; Atabaki, Amir; Leu, Jonathan; Stojanović, Vladimir; Ram, Rajeev J.

    2015-02-01

    We review recent progress of an effort led by the Stojanović (UC Berkeley), Ram (MIT) and Popović (CU Boulder) research groups to enable the design of photonic devices, and complete on-chip electro-optic systems and interfaces, directly in standard microelectronics CMOS processes in a microprocessor foundry, with no in-foundry process modifications. This approach allows tight and large-scale monolithic integration of silicon photonics with state-of-the-art (sub-100nm-node) microelectronics, here a 45nm SOI CMOS process. It enables natural scale-up to manufacturing, and rapid advances in device design due to process repeatability. The initial driver application was addressing the processor-to-memory communication energy bottleneck. Device results include 5Gbps modulators based on an interleaved junction that take advantage of the high resolution of the sub-100nm CMOS process. We demonstrate operation at 5fJ/bit with 1.5dB insertion loss and 8dB extinction ratio. We also demonstrate the first infrared detectors in a zero-change CMOS process, using absorption in transistor source/drain SiGe stressors. Subsystems described include the first monolithically integrated electronic-photonic transmitter on chip (modulator+driver) with 20-70fJ/bit wall plug energy/bit (2-3.5Gbps), to our knowledge the lowest transmitter energy demonstrated to date. We also demonstrate native-process infrared receivers at 220fJ/bit (5Gbps). These are encouraging signs for the prospects of monolithic electronics-photonics integration. Beyond processor-to-memory interconnects, our approach to photonics as a "More-than- Moore" technology inside advanced CMOS promises to enable VLSI electronic-photonic chip platforms tailored to a vast array of emerging applications, from optical and acoustic sensing, high-speed signal processing, RF and optical metrology and clocks, through to analog computation and quantum technology.

  15. Carbon nanotubes as heat dissipaters in microelectronics

    DEFF Research Database (Denmark)

    Pérez Paz, Alejandro; García-Lastra, Juan María; Markussen, Troels

    2013-01-01

    We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties...... of nanotubes in presence of an interface with various substances, including air and water. Comparison with previous works is established whenever is possible....

  16. Electrical characterization of small area devices for manufacturing

    International Nuclear Information System (INIS)

    Enzenroth, R.A.; Davies, A.; Reed, S.

    2011-01-01

    Uniformity of electrical performance is critical for thin film modules. The more uniformly that all areas of the module perform the better the overall efficiency will be. Total module performance tends towards the average of localized performance, skewed slightly lower by the width of localized performance distribution. Measurement of overall module efficiency does not give information about performance uniformity. Use of small area devices (SAD's) defined from the module allow standard electrical measurements including light and dark current-voltage (IV/JV) and quantum efficiency to be performed on a small scale. Data from these measurements allows mapping of electrical performance across the module. The structure of types of SAD's is discussed and some examples of efficiency data from JV measurements as used in the optimization of a thin film module manufacturing line are presented. Also a brief discussion of statistical analysis of the data is included.

  17. New facility boost CSIRO's micromanfacturing capability

    International Nuclear Information System (INIS)

    Grad, Paul.

    1997-01-01

    CSIRO is developing a leading edge microengineering capability, an electron beam lithography and device fabrication facility. Structures of submicron size can be manufactured and incorporated in microelectronic or micromechanical devices. Current and potential uses are outlined in this paper and include: chemical sensors, electronic surveillance and radar systems, microsensors, micromotors and microgages to be used in telecommunication, environment monitoring or medicine

  18. Manufacturing microsystems-on-a-chip with 5-level surface micromachining technology

    Energy Technology Data Exchange (ETDEWEB)

    Sniegowski, J.; Rodgers, M.S.

    1998-05-01

    An agile microsystem manufacturing technology has been developed that provides unprecedented 5 levels of independent polysilicon surface-micromachine films for the designer. Typical surface-micromachining processes offer a maximum of 3 levels, making this the most complex surface-micromachining process technology developed to date. Leveraged from the extensive infrastructure present in the microelectronics industry, the manufacturing method of polysilicon surface-micromachining offers similar advantages of high-volume, high-reliability, and batch-fabrication to microelectromechanical systems (MEMS) as has been accomplished with integrated circuits (ICs). These systems, comprised of microscopic-sized mechanical elements, are laying the foundation for a rapidly expanding, multi-billion dollar industry 2 which impacts the automotive, consumer product, and medical industries to name only a few.

  19. ICMCS-2014: 8. international conference on microelectronics and computer science and 5. conference of physicists of Moldova. Proceedings

    International Nuclear Information System (INIS)

    Canter, V.; Balmus, I.

    2014-10-01

    This book includes communications presented at the 8th International conference on microelectronics and computer science. The papers presented in the book cover certain issues of microelectronics, modern theoretical and experimental physics and advanced technology.

  20. Modeling biology with HDL languages: a first step toward a genetic design automation tool inspired from microelectronics.

    Science.gov (United States)

    Gendrault, Yves; Madec, Morgan; Lallement, Christophe; Haiech, Jacques

    2014-04-01

    Nowadays, synthetic biology is a hot research topic. Each day, progresses are made to improve the complexity of artificial biological functions in order to tend to complex biodevices and biosystems. Up to now, these systems are handmade by bioengineers, which require strong technical skills and leads to nonreusable development. Besides, scientific fields that share the same design approach, such as microelectronics, have already overcome several issues and designers succeed in building extremely complex systems with many evolved functions. On the other hand, in systems engineering and more specifically in microelectronics, the development of the domain has been promoted by both the improvement of technological processes and electronic design automation tools. The work presented in this paper paves the way for the adaptation of microelectronics design tools to synthetic biology. Considering the similarities and differences between the synthetic biology and microelectronics, the milestones of this adaptation are described. The first one concerns the modeling of biological mechanisms. To do so, a new formalism is proposed, based on an extension of the generalized Kirchhoff laws to biology. This way, a description of all biological mechanisms can be made with languages widely used in microelectronics. Our approach is therefore successfully validated on specific examples drawn from the literature.

  1. Materials science in microelectronics I the relationships between thin film processing and structure

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship - that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer - determines the ultimate structure of the thin film, and thus its properties. This

  2. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  3. Understanding microelectronics a top-down approach

    CERN Document Server

    Maloberti, Franco

    2011-01-01

    The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today's students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions,

  4. Lessons learned from early microelectronics production at Sandia National Laboratories

    Energy Technology Data Exchange (ETDEWEB)

    Weaver, H.T.

    1998-02-01

    During the 1980s Sandia designed, developed, fabricated, tested, and delivered hundreds of thousands of radiation hardened Integrated Circuits (IC) for use in weapons and satellites. Initially, Sandia carried out all phases, design through delivery, so that development of next generation ICs and production of current generation circuits were carried out simultaneously. All this changed in the mid-eighties when an outside contractor was brought in to produce ICs that Sandia developed, in effect creating a crisp separation between development and production. This partnership had a severe impact on operations, but its more damaging effect was the degradation of Sandia`s microelectronics capabilities. This report outlines microelectronics development and production in the early eighties and summarizes the impact of changing to a separate contractor for production. This record suggests that low volume production be best accomplished within the development organization.

  5. Simulating The Technological Movements Of The Equipment Used For Manufacturing Prosthetic Devices Using 3D Models

    Science.gov (United States)

    Chicea, Anca-Lucia

    2015-09-01

    The paper presents the process of building geometric and kinematic models of a technological equipment used in the process of manufacturing devices. First, the process of building the model for a six axes industrial robot is presented. In the second part of the paper, the process of building the model for a five-axis CNC milling machining center is also shown. Both models can be used for accurate cutting processes simulation of complex parts, such as prosthetic devices.

  6. Physical models of semiconductor quantum devices

    CERN Document Server

    Fu, Ying

    2013-01-01

    The science and technology relating to nanostructures continues to receive significant attention for its applications to various fields including microelectronics, nanophotonics, and biotechnology. This book describes the basic quantum mechanical principles underlining this fast developing field. From the fundamental principles of quantum mechanics to nanomaterial properties, from device physics to research and development of new systems, this title is aimed at undergraduates, graduates, postgraduates, and researchers.

  7. Safeguards of basic protection devices, high-protection devices, full-protection devices and school X-ray devices. Guideline for manufacturer and evaluating experts, rev. 1.0; Sicherheitsvorrichtungen von Basisschutzgeraeten, Hochschutzgeraeten, Vollschutzgeraeten und Schulroentgeneinrichtungen. Anforderungen fuer die Bauartpruefung nach der Roentgenverordnung. Leitfaden fuer Hersteller und Gutachter Rev. 1.0

    Energy Technology Data Exchange (ETDEWEB)

    Dombrowski, Harald; Grottker, Ulrich; Pullner, Bjoern; Roettger, Annette; Zwiener, Roland

    2017-07-15

    This report describes the PTB requirements for engineered safeguards of basic-protection devices, high-protection devices, full-protection devices and school X-ray devices within the framework of type tests according to the German X-ray Ordinance. It contains detailed requirements for the hard- and software to ensure the required safety level. Especially manufacturers and evaluators of such X-ray tube assemblies are addressed.

  8. Solar Variability and the Near-Earth Environment: Mining Enhanced Low Dose Rate Sensitivity Data From the Microelectronics and Photonics Test Bed Space Experiment

    Science.gov (United States)

    Turflinger, T.; Schmeichel, W.; Krieg, J.; Titus, J.; Campbell, A.; Reeves, M.; Marshall (P.); Hardage, Donna (Technical Monitor)

    2004-01-01

    This effort is a detailed analysis of existing microelectronics and photonics test bed satellite data from one experiment, the bipolar test board, looking to improve our understanding of the enhanced low dose rate sensitivity (ELDRS) phenomenon. Over the past several years, extensive total dose irradiations of bipolar devices have demonstrated that many of these devices exhibited ELDRS. In sensitive bipolar transistors, ELDRS produced enhanced degradation of base current, resulting in enhanced gain degradation at dose rates 1 rd(Si)/s. This Technical Publication provides updated information about the test devices, the in-flight experiment, and both flight-and ground-based observations. Flight data are presented for the past 5 yr of the mission. These data are compared to ground-based data taken on devices from the same date code lots. Information about temperature fluctuations, power shutdowns, and other variables encountered during the space flight are documented.

  9. More-than-Moore 2.5D and 3D SiP integration

    CERN Document Server

    Radojcic, Riko

    2017-01-01

    This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product. .

  10. 78 FR 41069 - Medical Device Reporting for Manufacturers; Draft Guidance for Industry and Food and Drug...

    Science.gov (United States)

    2013-07-09

    ... DEPARTMENT OF HEALTH AND HUMAN SERVICES Food and Drug Administration [Docket No. FDA-2013-D-0743] Medical Device Reporting for Manufacturers; Draft Guidance for Industry and Food and Drug Administration Staff; Availability AGENCY: Food and Drug Administration, HHS. ACTION: Notice. SUMMARY: The Food and...

  11. Manufacturing tolerant topology optimization

    DEFF Research Database (Denmark)

    Sigmund, Ole

    2009-01-01

    In this paper we present an extension of the topology optimization method to include uncertainties during the fabrication of macro, micro and nano structures. More specifically, we consider devices that are manufactured using processes which may result in (uniformly) too thin (eroded) or too thick...... (dilated) structures compared to the intended topology. Examples are MEMS devices manufactured using etching processes, nano-devices manufactured using e-beam lithography or laser micro-machining and macro structures manufactured using milling processes. In the suggested robust topology optimization...... approach, under- and over-etching is modelled by image processing-based "erode" and "dilate" operators and the optimization problem is formulated as a worst case design problem. Applications of the method to the design of macro structures for minimum compliance and micro compliant mechanisms show...

  12. Micro-electronics and employment in the Japanese automobile industry.

    OpenAIRE

    Watanabe, S

    1984-01-01

    ILO pub-WEP pub. Working paper on the employment effects of microelectronics technological change and industrial robots in the motor vehicle industry in Japan - examines industrial processes, labour productivity, job requirements of automobile workers, effects on the subcontracting system and small scale industry, diffusion patterns and prospects, etc. Bibliography, references and statistical tables.

  13. Semiconductor Manufacturing equipment introduction

    International Nuclear Information System (INIS)

    Im, Jong Sun

    2001-02-01

    This book deals with semiconductor manufacturing equipment. It is comprised of nine chapters, which are manufacturing process of semiconductor device, history of semiconductor manufacturing equipment, kinds and role of semiconductor manufacturing equipment, construction and method of semiconductor manufacturing equipment, introduction of various semiconductor manufacturing equipment, spots of semiconductor manufacturing, technical elements of semiconductor manufacturing equipment, road map of technology of semiconductor manufacturing equipment and semiconductor manufacturing equipment in the 21st century.

  14. Implementation of microelectronic components in nuclear application

    International Nuclear Information System (INIS)

    Ashour, M.A

    1997-01-01

    As the next logical step in the evolution of programmable devices, Field programmable interconnect components (FPIC) bring the benefits of programmability to the system-level by enabling totally p rogrammable hardware . Continuing what was started by programmable memories twenty years ago and then enhanced by programmable logic ten years later, programmable interconnect holds the key to complete system programmability. History has shown that flexibility is the key benefit realized by programmable technologies (see figure 1). Initially used in a lab environment for design verification purposes, programmable technologies enhance development and ease of experimentation. As experience by more users is accumulated, performances improves and component prices are reduced, applications rapidly expand to address highly flexible and quickly implemented final manufactured products. With similar attributes of it's programmable predecessors, FPIC technology provides an attractive solution to the design verification problems of today and the manufacturing challenges of tomorrow

  15. Microelectronics materials characterization studies at the Cornell TRIGA Reactor

    International Nuclear Information System (INIS)

    McGuire, Stephen C.

    1992-01-01

    The Cornell program of microelectronics materials characterization by neutron activation analysis (NAA) is described. Experimental details and results from the successful application of NAA to silicon germanium circuit structures and nickel silicide layers are presented. In doing so, the potential for using X rays from isotopes that decay by electron capture is demonstrated. (author)

  16. Process and a device for manufacturing a composite building panel for use in a building structure cladding system

    Energy Technology Data Exchange (ETDEWEB)

    Tetu, B

    1991-06-11

    A process and device are disclosed for manufacturing a composite panel used for cladding a building. The panel comprises a facing layer made from a plurality of facing elements, such as brick slices, retained in a spaced-apart relationship, and magnetically attractible particulate material disposed between the facing elements to imitate mortar. A rigid backing layer is provided, spaced from the spacing layer, and the space between the facing and the backing layers is filled with an insulation/bonding layer, made of urethane foam. The device for manufacturing the panel comprises a facing element holder in the form of a structure with a plurality of recesses for receiving facing elements, also including spacers between the recesses in order to retain the facing elements in a spaced-apart relationship. Ceramic magnets are provided on the spacers for temporarily retaining the particulate material against gravity until the insulation/bonding layer is built which retains all the panel elements together. The invention enables manufacture of non-planar panels, such as those used on corners of buildings, thereby eliminating the need for a corner joint. 9 figs.

  17. Technological dispute for manufacturing population

    Directory of Open Access Journals (Sweden)

    B.M. Hevko

    2017-12-01

    Full Text Available New designs of technological equipment are presented – a variegated unit for adjusting the machine for precise manufacturing of a cut or on a tool of a tester, or on a workpiece, and also a design of a control device for measuring average diameters of taps. An important element in the manufacture of cutting tools is the manufacture of appropriate technological equipment. So for the manufacture of taps, it is necessary to develop the design of technological equipment for the adjustment of the necessary design parameters, as well as the design of control devices for their parameters. To provide these operations to instruments are the requirements of accuracy, productivity, stability, cost of production and a number of others. The new design of the technological equipment for the adjustment of the machine for precise manufacturing of the cutting is presented. The design of the control device for measuring the average diameter of the taps is also given. The advantages of the device include improving the quality of processing and working out the design on the technological.

  18. FUNDAMENTALS OF STRUCTURAL TYPOLOGY DEVICE DESIGN WITH A GAS BEARING LAYER

    Directory of Open Access Journals (Sweden)

    I. A. Аvtsinоv

    2015-01-01

    Full Text Available We describe the typical stages of a structural typology of devices allowing them to design quality in the automatic mode on the known parameters of products (parts and the required processing operations with them. In the first stage classification it was organized as a piece of specific products and devices for the manipulation of the latter. Specifics items described their physical – mechanical properties, geometry and their application. The most frequently described specific products are used in pharmaceutical, perfume, food, microelectronics, electrical engineering, electronics. The main elements of the proposed device is a carrier working surface over which a thin layer of gas is created. Depending on the position (horizontal or vertical of the form of its movement (rotation, rotational – translational or is stationary, and the configuration of the carrier operating the surface implement various manufacturing operations (targeting, positioning, shaping, classification, transport, heat treatment, weight control, assembly, culling, and others. The second stage was to mathematically describe the relationship of the specificity of piece goods, with design features of devices supporting the work surface and sold them operations. For this purpose, the device has been used in discrete mathematics, with which you can produce a description of all types of devices, and then make a conclusion such as the work surface meets the specified requirements. The apparent advantage of using predicate logic to this problem is fairly simple implementation of the algorithm of structural typology, which can be expressed using a declarative programming language. In the third phase, work is underway to create the necessary algorithmic language program "Prolog" and presented the structure of the imperative and declarative implementation of the algorithm.

  19. Charge-coupled devices for particle detection with high spatial resolution

    International Nuclear Information System (INIS)

    Farley, F.J.; Damerell, C.J.S.; Gillman, A.R.; Wickens, F.J.

    1980-10-01

    The results of a study of the possible application of a thin microelectronic device (the charge-coupled device) to high energy physics as particle detectors with good spatial resolution which can distinguish between tracks emerging from the primary vertex and those from secondary vertices due to the decay of short lived particles with higher flavours, are reported. Performance characteristics indicating the spatial resolution, particle discrimination, time resolution, readout time and lifetime of such detectors have been obtained. (U.K.)

  20. Data graphing methods, articles of manufacture, and computing devices

    Energy Technology Data Exchange (ETDEWEB)

    Wong, Pak Chung; Mackey, Patrick S.; Cook, Kristin A.; Foote, Harlan P.; Whiting, Mark A.

    2016-12-13

    Data graphing methods, articles of manufacture, and computing devices are described. In one aspect, a method includes accessing a data set, displaying a graphical representation including data of the data set which is arranged according to a first of different hierarchical levels, wherein the first hierarchical level represents the data at a first of a plurality of different resolutions which respectively correspond to respective ones of the hierarchical levels, selecting a portion of the graphical representation wherein the data of the portion is arranged according to the first hierarchical level at the first resolution, modifying the graphical representation by arranging the data of the portion according to a second of the hierarchal levels at a second of the resolutions, and after the modifying, displaying the graphical representation wherein the data of the portion is arranged according to the second hierarchal level at the second resolution.

  1. Establishing a Quantitative Relationship Between Ion and Pulsed-Laser Induced Single Event Soft Errors in Advanced Semiconductor Devices

    Data.gov (United States)

    National Aeronautics and Space Administration — Radiation is a pervasive environmental challenge in space and the upper atmosphere. Ions can interact with microelectronic devices and create unwanted charge leading...

  2. GaN Nanowire Devices: Fabrication and Characterization

    Science.gov (United States)

    Scott, Reum

    The development of microelectronics in the last 25 years has been characterized by an exponential increase of the bit density in integrated circuits (ICs) with time. Scaling solid-state devices improves cost, performance, and power; as such, it is of particular interest for companies, who gain a market advantage with the latest technology. As a result, the microelectronics industry has driven transistor feature size scaling from 10 μm to ~30 nm during the past 40 years. This trend has persisted for 40 years due to optimization, new processing techniques, device structures, and materials. But when noting processor speeds from the 1970's to 2009 and then again in 2010, the implication would be that the trend has ceased. To address the challenge of shrinking the integrated circuit (IC), current research is centered on identifying new materials and devices that can supplement and/or potentially supplant it. Bottom-up methods tailor nanoscale building blocks---atoms, molecules, quantum dots, and nanowires (NWs)---to be used to overcome these limitations. The Group IIIA nitrides (InN, AlN, and GaN) possess appealing properties such as a direct band gap spanning the whole solar spectrum, high saturation velocity, and high breakdown electric field. As a result nanostructures and nanodevices made from GaN and related nitrides are suitable candidates for efficient nanoscale UV/ visible light emitters, detectors, and gas sensors. To produce devices with such small structures new fabrication methods must be implemented. Devices composed of GaN nanowires were fabricated using photolithography and electron beam lithography. The IV characteristics of these devices were noted under different illuminations and the current tripled from 4.8*10-7 A to 1.59*10 -6 A under UV light which persisted for at least 5hrs.

  3. Quality politics: an immaterial investment for companies in (micro)electronics

    Science.gov (United States)

    Bacivarov, I. C.; Lupan, R.; Robledo, C.; Bacivarov, Angelica

    2010-11-01

    With the globalization of the markets and the growth of competitiveness in the manufacturing sector, quality has become a key factor of success. Quality is particularly important for the companies which activate in the micro(electronics) field. The quality management system holds a vital place in the company's structure. Implementing such a system requires important operating costs. These costs are known as Quality Obtaining Costs (QOC) and may be considered as an investment. Planning an investment, means evaluating its return in order to see if it is profitable or not. Measuring the return of quality politics investment raise some delicate problems. We may calculate some aspects of the return of investment by measuring the shape of non-quality costs. An eventual decrease of these costs could be synonym with a profitable investment. But the advantages of good quality politics cannot be measured only by taking into consideration the non-quality costs (even if they include direct and indirect costs). There are also intangible advantages (like mark image, competences, polyvalence, client's satisfaction...) that derive from quality approaches. How to evaluate this type of consequences / advantages? The idea developed in this article is to considerate the quality politics like un immaterial/intelligent investment. Therefore could it be advantageous / possible to use the immaterial investment's measuring and evaluation techniques for studying the quality politics return of investment?

  4. How to observe the invisible

    International Nuclear Information System (INIS)

    Destefanis, G.; Peyret, O.; Darier, P.

    2000-01-01

    The observation of events and objects by images resulted from the detection of invisible radiation (infrared, X and gamma ray) emitted from these objects, is now more possible. This is mainly due to the progress in the microelectronics and semiconductors devices. With these advanced devices, it is possible to manufacture cameras with TV display size image and high resolution, which have many applications in military, medical and industrial sectors. (author)

  5. Fabrication of polyimide based microfluidic channels for biosensor devices

    DEFF Research Database (Denmark)

    Zulfiqar, Azeem; Pfreundt, Andrea; Svendsen, Winnie Edith

    2015-01-01

    The ever-increasing complexity of the fabrication process of Point-of-care (POC) devices, due to high demand of functional versatility, compact size and ease-of-use, emphasizes the need of multifunctional materials that can be used to simplify this process. Polymers, currently in use for the fabr...... in uniformity of PI is also compared to the most commonly used SU8 polymer, which is a near UV sensitive epoxy resin. The potential applications of PI processing are POC and biosensor devices integrated with microelectronics....

  6. Vacuum vessel of thermonuclear device and manufacturing method thereof

    International Nuclear Information System (INIS)

    Kurita, Genichi; Nagashima, Keisuke; Uchida, Takaho; Shibui, Masanao; Ebisawa, Katsuyuki; Nakagawa, Satoshi.

    1997-01-01

    The present invention provides a vacuum vessel of a thermonuclear device using, as a material of a plasma vacuum vessel, a material to be less activated and having excellent strength as well as a manufacturing method thereof. Namely, the vacuum vessel is made of titanium or a titanium alloy. In addition, a liner layer comprising a manganese alloy, nickel alloy, nickel-chromium alloy or aluminum or aluminum alloy is formed. With such a constitution, the wall substrate made of titanium or a titanium alloy can be isolated by the liner from hydrogen or plasmas. As a result, occlusion of hydrogen to titanium or the titanium alloy can be prevented thereby enabling to prevent degradation of the material of the wall substrate of the vacuum vessel. In addition, since the liner layer has relatively high electric resistance, a torus circumferential resistance value required for plasma ignition can be ensured by using it together with the vessel wall made of titanium alloy. (I.S.)

  7. Microelectronic Status Analysis and Secondary Part Procureability Assessment of the HAWK Weapon System

    National Research Council Canada - National Science Library

    Maddux, Gary

    2000-01-01

    The MT Division, Engineering Directorate (ED), RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the HAWK weapon system...

  8. Microelectronic Status Analysis and Secondary Part Procureability Assessment of the HAWK Weapon System

    National Research Council Canada - National Science Library

    Maddux, Gary

    1999-01-01

    The Industrial Operations Division (IOD), SEPD, RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the HAWK weapon system...

  9. Dictionary of microelectronics and microcomputer technology. Woerterbuch der Mikroelektronik und Mikrorechnertechnik

    Energy Technology Data Exchange (ETDEWEB)

    Attiyate, Y H; Shah, R R

    1984-01-01

    This bilingual dictionary (German-English and English-German) is to give the general public a clearer idea of the terminology of microelectronics, microcomputers, data processing, and computer science. Each part contains about 7500 terms frequently encountered in practice, about 2000 of which are supplemented by precise explanations.

  10. Lexicon generation methods, lexicon generation devices, and lexicon generation articles of manufacture

    Science.gov (United States)

    Carter, Richard J [Richland, WA; McCall, Jonathon D [West Richland, WA; Whitney, Paul D [Richland, WA; Gregory, Michelle L [Richland, WA; Turner, Alan E [Kennewick, WA; Hetzler, Elizabeth G [Kennewick, WA; White, Amanda M [Kennewick, WA; Posse, Christian [Seattle, WA; Nakamura, Grant C [Kennewick, WA

    2010-10-26

    Lexicon generation methods, computer implemented lexicon editing methods, lexicon generation devices, lexicon editors, and articles of manufacture are described according to some aspects. In one aspect, a lexicon generation method includes providing a seed vector indicative of occurrences of a plurality of seed terms within a plurality of text items, providing a plurality of content vectors indicative of occurrences of respective ones of a plurality of content terms within the text items, comparing individual ones of the content vectors with respect to the seed vector, and responsive to the comparing, selecting at least one of the content terms as a term of a lexicon usable in sentiment analysis of text.

  11. The Integration of Bacteriorhodopsin Proteins with Semiconductor Heterostructure Devices

    Science.gov (United States)

    Xu, Jian

    2008-03-01

    Bioelectronics has emerged as one of the most rapidly developing fields among the active frontiers of interdisciplinary research. A major thrust in this field is aimed at the coupling of the technologically-unmatched performance of biological systems, such as neural and sensing functions, with the well developed technology of microelectronics and optoelectronics. To this end we have studied the integration of a suitably engineered protein, bacteriorhodopsin (BR), with semiconductor optoelectronic devices and circuits. Successful integration will potentially lead to ultrasensitive sensors with polarization selectivity and built-in preprocessing capabilities that will be useful for high speed tracking, motion and edge detection, biological detection, and artificial vision systems. In this presentation we will summarize our progresses in this area, which include fundamental studies on the transient dynamics of photo-induced charge shift in BR and the coupling mechanism at protein-semiconductor interface for effective immobilizing and selectively integrating light sensitive proteins with microelectronic devices and circuits, and the device engineering of BR-transistor-integrated optical sensors as well as their applications in phototransceiver circuits. Work done in collaboration with Pallab Bhattacharya, Jonghyun Shin, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI; Robert R. Birge, Department of Chemistry, University of Connecticut, Storrs, CT 06269; and György V'ar'o, Institute of Biophysics, Biological Research Center of the Hungarian Academy of Science, H-6701 Szeged, Hungary.

  12. Spoked-ring microcavities: enabling seamless integration of nanophotonics in unmodified advanced CMOS microelectronics chips

    Science.gov (United States)

    Wade, Mark T.; Shainline, Jeffrey M.; Orcutt, Jason S.; Ram, Rajeev J.; Stojanovic, Vladimir; Popovic, Milos A.

    2014-03-01

    We present the spoked-ring microcavity, a nanophotonic building block enabling energy-efficient, active photonics in unmodified, advanced CMOS microelectronics processes. The cavity is realized in the IBM 45nm SOI CMOS process - the same process used to make many commercially available microprocessors including the IBM Power7 and Sony Playstation 3 processors. In advanced SOI CMOS processes, no partial etch steps and no vertical junctions are available, which limits the types of optical cavities that can be used for active nanophotonics. To enable efficient active devices with no process modifications, we designed a novel spoked-ring microcavity which is fully compatible with the constraints of the process. As a modulator, the device leverages the sub-100nm lithography resolution of the process to create radially extending p-n junctions, providing high optical fill factor depletion-mode modulation and thereby eliminating the need for a vertical junction. The device is made entirely in the transistor active layer, low-loss crystalline silicon, which eliminates the need for a partial etch commonly used to create ridge cavities. In this work, we present the full optical and electrical design of the cavity including rigorous mode solver and FDTD simulations to design the Qlimiting electrical contacts and the coupling/excitation. We address the layout of active photonics within the mask set of a standard advanced CMOS process and show that high-performance photonic devices can be seamlessly monolithically integrated alongside electronics on the same chip. The present designs enable monolithically integrated optoelectronic transceivers on a single advanced CMOS chip, without requiring any process changes, enabling the penetration of photonics into the microprocessor.

  13. A progress report on the LDRD project entitled {open_quotes}Microelectronic silicon-based chemical sensors: Ultradetection of high value molecules{close_quotes}

    Energy Technology Data Exchange (ETDEWEB)

    Hughes, R.C.

    1996-09-01

    This work addresses a new kind of silicon based chemical sensor that combines the reliability and stability of silicon microelectronic field effect devices with the highly selective and sensitive immunoassay. The sensor works on the principle that thin SiN layers on lightly doped Si can detect pH changes rapidly and reversibly. The pH changes affect the surface potential, and that can be quickly determined by pulsed photovoltage measurements. To detect other species, chemically sensitive films were deposited on the SiN where the presence of the chosen analyte results in pH changes through chemical reactions. A invention of a cell sorting device based on these principles is also described. A new method of immobilizing enzymes using Sandia`s sol-gel glasses is documented and biosensors based on the silicon wafer and an amperometric technique are detailed.

  14. An update on coating/manufacturing techniques of microneedles.

    Science.gov (United States)

    Tarbox, Tamara N; Watts, Alan B; Cui, Zhengrong; Williams, Robert O

    2017-12-29

    Recently, results have been published for the first successful phase I human clinical trial investigating the use of dissolving polymeric microneedles… Even so, further clinical development represents an important hurdle that remains in the translation of microneedle technology to approved products. Specifically, the potential for accumulation of polymer within the skin upon repeated application of dissolving and coated microneedles, combined with a lack of safety data in humans, predicates a need for further clinical investigation. Polymers are an important consideration for microneedle technology-from both manufacturing and drug delivery perspectives. The use of polymers enables a tunable delivery strategy, but the scalability of conventional manufacturing techniques could arguably benefit from further optimization. Micromolding has been suggested in the literature as a commercially viable means to mass production of both dissolving and swellable microneedles. However, the reliance on master molds, which are commonly manufactured using resource intensive microelectronics industry-derived processes, imparts notable material and design limitations. Further, the inherently multi-step filling and handling processes associated with micromolding are typically batch processes, which can be challenging to scale up. Similarly, conventional microneedle coating processes often follow step-wise batch processing. Recent developments in microneedle coating and manufacturing techniques are highlighted, including micromilling, atomized spraying, inkjet printing, drawing lithography, droplet-born air blowing, electro-drawing, continuous liquid interface production, 3D printing, and polyelectrolyte multilayer coating. This review provides an analysis of papers reporting on potentially scalable production techniques for the coating and manufacturing of microneedles.

  15. Flexible manufacturing for photonics device assembly

    International Nuclear Information System (INIS)

    Lu, Shin-yee; Young, K.D.

    1994-01-01

    The assembly of photonics devices such as laser diodes, optical modulators, and optoelectronics (OE) multi-chip modules usually requires the placement of micron-size devices, and sub-micron precision attachment between optical fibers and diodes or waveguide modulators (pigtailing). This is a labor-intensive process. Studies done by the OE industry have shown that 95% of the cost of a pigtailed photonic device is attributed to the current practice of manual alignment and bonding techniques. At Lawrence Livermore National Laboratory, the authors are working to reduce the cost of packaging OE devices, through the use of automation

  16. Photovoltaics in Canada

    Energy Technology Data Exchange (ETDEWEB)

    Bolcso, S L

    1983-06-01

    A literature review was carried out for the purpose of summarizing the current conditions existing and affecting photovoltaics (PV) technology in a Canadian context. Information is presented concerning: PV device materials and efficiencies; PV cell manufacturing techniques; other materials/device designs; photovoltaic costs, markets, and research and development; PV and microelectronics; and Canadian strengths and opportunities. It was concluded that PV's simplicity, amenability to mass production and environmentally benign nature will likely assure it a faster and eventually greater market penetration than any other renewable energy form (and possibly some conventional forms). It is recommended that the Ministry of State, Science and Technology coordinate a joint microelectronics-photovoltaic research effort, by: indentifying areas where joint efforts would be mutually beneficial; identifying the strategic value of PV; identifying a set of goals for Canadian programs; coordinating efforts between government, universities and industry; developing supporting strategies for the mining and smelting of indigenous semiconducting materials; determining the economic support required to develop a silicon processing plant for the production of microelectronic chips and PV cells; developing Canadian expertise in providing complete PV systems competitive in world markets; and developing a marketing strategy for a coordinated PV/microelectronics effort. 60 refs., 17 figs., 12 tabs.

  17. Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

    NARCIS (Netherlands)

    Wünscher, S.; Abbel, R.; Perelaer, J.; Schubert, U.S.

    2014-01-01

    Well-defined high resolution structures with excellent electrical conductivities are key components of almost every electronic device. Producing these by printing metal based conductive inks on polymer foils represents an important step forward towards the manufacturing of plastic electronic

  18. Good manufacturing practice - quality assurance programs

    International Nuclear Information System (INIS)

    Masefield, John; Thompson, Steven

    1986-01-01

    The concept of good manufacturing practice (GMP) in the medical device industry requires the use of controlled methods and equipment in performing each step in the device manufacturing process. Quality assurance programs are used to maintain compliance with GMP requirements by prescribing the operating and control procedures to be used. The specific elements of a quality assurance program for the radiation sterilization of medical devices are described. (author)

  19. Environmentally benign silicon solar cell manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Tsuo, Y.S. [National Renewable Energy Lab., Golden, CO (United States); Gee, J.M. [Sandia National Labs., Albuquerque, NM (United States); Menna, P. [National Agency for New Technologies Energy and Environment, Portici (Italy); Strebkov, D.S.; Pinov, A.; Zadde, V. [Intersolarcenter, Moscow (Russian Federation)

    1998-09-01

    The manufacturing of silicon devices--from polysilicon production, crystal growth, ingot slicing, wafer cleaning, device processing, to encapsulation--requires many steps that are energy intensive and use large amounts of water and toxic chemicals. In the past two years, the silicon integrated-circuit (IC) industry has initiated several programs to promote environmentally benign manufacturing, i.e., manufacturing practices that recover, recycle, and reuse materials resources with a minimal consumption of energy. Crystalline-silicon solar photovoltaic (PV) modules, which accounted for 87% of the worldwide module shipments in 1997, are large-area devices with many manufacturing steps similar to those used in the IC industry. Obviously, there are significant opportunities for the PV industry to implement more environmentally benign manufacturing approaches. Such approaches often have the potential for significant cost reduction by reducing energy use and/or the purchase volume of new chemicals and by cutting the amount of used chemicals that must be discarded. This paper will review recent accomplishments of the IC industry initiatives and discuss new processes for environmentally benign silicon solar-cell manufacturing.

  20. Numerical Analysis and Experimental Verification of Stresses Building up in Microelectronics Packaging

    NARCIS (Netherlands)

    Rezaie Adli, A.R.

    2017-01-01

    This thesis comprises a thorough study of the microelectronics packaging process by means of various experimental and numerical methods to estimate the process induced residual stresses. The main objective of the packaging is to encapsulate the die, interconnections and the other exposed internal

  1. Microelectronic Status Analysis and Secondary Part Procureability Assessment of the ATACMS-BAT Weapon System

    National Research Council Canada - National Science Library

    Maddux, Gary

    2000-01-01

    The MT Division, Engineering Directorate (ED), RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the ATACMS-BAT weapon system...

  2. The Electrical Engineering Curriculum at the Technical University of Denmark - Options in Microelectronics

    DEFF Research Database (Denmark)

    Bruun, Erik; Nielsen, Lars Drud

    1997-01-01

    This paper describes the modular structure of the engineering curriculum at the Technical University of Denmark. The basic requirements for an electrical engineering curriculum are presented and different possibilities for specialization in microelectronics and integrated circuit design...

  3. Thermo-mechanical properties and integrity of metallic interconnects in microelectronics

    Science.gov (United States)

    Ege, Efe Sinan

    In this dissertation, combined numerical (Finite Element Method) and experimental efforts were undertaken to study thermo-mechanical behavior in microelectronic devices. Interconnects, including chip-level metallization and package-level solder joints, are used to join many of the circuit parts in modern equipment. The dissertation is structured into six independent studies after the introductory chapter. The first two studies focus on thermo-mechanical fatigue of solder joints. Thermo-mechanical fatigue, in the form of damage along a microstructurally coarsened region in tin-lead solder, is analyzed along with the effects of intermetallic morphology. Also, lap-shear testing is modeled to characterize the joint and to investigate the validity of experimental data from different solder and substrate geometries. In the third study, the effects of pre-machined holes on strain localization and overall ductility in bulk eutectic tin-lead alloy is examined. Finite element analyses, taking into account the viscoplastic response, were carried out to provide a mechanistic rationale to corroborate the experimental findings. The fourth study concerns chip-level copper interconnects. Various combinations of oxide and polymer-based low-k dielectric schemes, with and without the thin barrier layers surrounding the Cu line, are considered. Attention is devoted to the thermal stress and strain fields and their dependency on material properties, geometry, and modeling details. This study is followed by a chapter on atomistics of interface-mediated plasticity in thin metallic films. The objective is to gain fundamental insight into the underlying mechanisms affecting the mechanical response of nanoscale thin films. The final study investigates the effect of microstructural heterogeneity on indentation response, for the purpose of raising awareness of the uncertainties involved in applying indentation techniques in probing mechanical properties of miniaturized devices.

  4. Feasibility of Observing and Characterizing Single Ion Strikes in Microelectronic Components

    International Nuclear Information System (INIS)

    Dingreville, Remi Philippe Michel; Hattar, Khalid Mikhiel; Bufford, Daniel Charles

    2015-01-01

    The transient degradation of semiconductor device performance under irradiation has long been an issue of concern. A single high-energy charged particle can degrade or permanently destroy the microelectronic component, potentially altering the course or function of the systems. Disruption of the the crystalline structure through the introduction of quasi-stable defect structures can change properties from semiconductor to conductor. Typically, the initial defect formation phase is followed by a recovery phase in which defect-defect or defect-dopant interactions modify the characteristics of the damaged structure. In this LDRD Express, in-situ ion irradiation transmission microscopy (TEM) in-situ TEM experiments combined with atomistic simulations have been conducted to determine the feasibility of imaging and characterizing the defect structure resulting from a single cascade in silicon. In-situ TEM experiments have been conducted to demonstrate that a single ion strike can be observed in Si thin films with nanometer resolution in real time using the in-situ ion irradiation transmission electron microscope (I 3 TEM). Parallel to this experimental effort, ion implantation has been numerically simulated using Molecular Dynamics (MD). This numerical framework provides detailed predictions of the damage and follow the evolution of the damage during the first nanoseconds. The experimental results demonstrate that single ion strike can be observed in prototypical semiconductors.

  5. Silicon based nanogap device for studying electrical transport phenomena in molecule-nanoparticle hybrids

    International Nuclear Information System (INIS)

    Strobel, Sebastian; Hernandez, Rocio Murcia; Hansen, Allan G; Tornow, Marc

    2008-01-01

    We report the fabrication and characterization of vertical nanogap electrode devices using silicon-on-insulator substrates. Using only standard silicon microelectronic process technology, nanogaps down to 26 nm electrode separation were prepared. Transmission electron microscopy cross-sectional analysis revealed the well defined material architecture of the nanogap, comprising two electrodes of dissimilar geometrical shape. This asymmetry is directly reflected in transport measurements on molecule-nanoparticle hybrid systems formed by self-assembling a monolayer of mercaptohexanol on the electrode surface and the subsequent dielectrophoretic trapping of 30 nm diameter Au nanoparticles. The observed Coulomb staircase I-V characteristic measured at T = 4.2 K is in excellent agreement with theoretical modelling, whereby junction capacitances of the order of a few 10 -18 farad and asymmetric resistances of 30 and 300 MΩ, respectively, are also supported well by our independent estimates for the formed double barrier tunnelling system. We propose our nanoelectrode system for integrating novel functional electronic devices such as molecular junctions or nanoparticle hybrids into existing silicon microelectronic process technology

  6. Silicon based nanogap device for studying electrical transport phenomena in molecule-nanoparticle hybrids

    Energy Technology Data Exchange (ETDEWEB)

    Strobel, Sebastian; Hernandez, Rocio Murcia [Walter Schottky Institut, Technische Universitaet Muenchen, Am Coulombwall 3, 85748 Garching (Germany); Hansen, Allan G; Tornow, Marc [Institut fuer Halbleitertechnik, Technische Universitaet Braunschweig, Hans-Sommer-Strasse 66, 38106 Braunschweig (Germany)], E-mail: m.tornow@tu-bs.de

    2008-09-17

    We report the fabrication and characterization of vertical nanogap electrode devices using silicon-on-insulator substrates. Using only standard silicon microelectronic process technology, nanogaps down to 26 nm electrode separation were prepared. Transmission electron microscopy cross-sectional analysis revealed the well defined material architecture of the nanogap, comprising two electrodes of dissimilar geometrical shape. This asymmetry is directly reflected in transport measurements on molecule-nanoparticle hybrid systems formed by self-assembling a monolayer of mercaptohexanol on the electrode surface and the subsequent dielectrophoretic trapping of 30 nm diameter Au nanoparticles. The observed Coulomb staircase I-V characteristic measured at T = 4.2 K is in excellent agreement with theoretical modelling, whereby junction capacitances of the order of a few 10{sup -18} farad and asymmetric resistances of 30 and 300 M{omega}, respectively, are also supported well by our independent estimates for the formed double barrier tunnelling system. We propose our nanoelectrode system for integrating novel functional electronic devices such as molecular junctions or nanoparticle hybrids into existing silicon microelectronic process technology.

  7. Silicon based nanogap device for studying electrical transport phenomena in molecule-nanoparticle hybrids.

    Science.gov (United States)

    Strobel, Sebastian; Hernández, Rocío Murcia; Hansen, Allan G; Tornow, Marc

    2008-09-17

    We report the fabrication and characterization of vertical nanogap electrode devices using silicon-on-insulator substrates. Using only standard silicon microelectronic process technology, nanogaps down to 26 nm electrode separation were prepared. Transmission electron microscopy cross-sectional analysis revealed the well defined material architecture of the nanogap, comprising two electrodes of dissimilar geometrical shape. This asymmetry is directly reflected in transport measurements on molecule-nanoparticle hybrid systems formed by self-assembling a monolayer of mercaptohexanol on the electrode surface and the subsequent dielectrophoretic trapping of 30 nm diameter Au nanoparticles. The observed Coulomb staircase I-V characteristic measured at T = 4.2 K is in excellent agreement with theoretical modelling, whereby junction capacitances of the order of a few 10(-18) farad and asymmetric resistances of 30 and 300 MΩ, respectively, are also supported well by our independent estimates for the formed double barrier tunnelling system. We propose our nanoelectrode system for integrating novel functional electronic devices such as molecular junctions or nanoparticle hybrids into existing silicon microelectronic process technology.

  8. MEMS- and NEMS-based smart devices and systems

    Science.gov (United States)

    Varadan, Vijay K.

    2001-11-01

    The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sized now don at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic an micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sensing and control of a variety functions in automobile, aerospace, marine and civil

  9. Manufacturer Usage Description Specification Implementation

    OpenAIRE

    Srinivasan, Kaushik

    2017-01-01

    Manufacturer Usage Description Specification (MUDS) is aframework under RFC development that aims to automate Internet access control rules for IoT devices . These access controls prevent malicious IoT devices from attacking other devices and also protect the IoT devices from being attacked by other devices.We are implementing this framework and trying to improve its security.

  10. Analysis of adverse events with Essure hysteroscopic sterilization reported to the Manufacturer and User Facility Device Experience database.

    Science.gov (United States)

    Al-Safi, Zain A; Shavell, Valerie I; Hobson, Deslyn T G; Berman, Jay M; Diamond, Michael P

    2013-01-01

    The Manufacturer and User Facility Device Experience database may be useful for clinicians using a Food and Drug Administration-approved medical device to identify the occurrence of adverse events and complications. We sought to analyze and investigate reports associated with the Essure hysteroscopic sterilization system (Conceptus Inc., Mountain View, CA) using this database. Retrospective review of the Manufacturer and User Facility Device Experience database for events related to Essure hysteroscopic sterilization from November 2002 to February 2012 (Canadian Task Force Classification III). Online retrospective review. Online reports of patients who underwent Essure tubal sterilization. Essure tubal sterilization. Four hundred fifty-seven adverse events were reported in the study period. Pain was the most frequently reported event (217 events [47.5%]) followed by delivery catheter malfunction (121 events [26.4%]). Poststerilization pregnancy was reported in 61 events (13.3%), of which 29 were ectopic pregnancies. Other reported events included perforation (90 events [19.7%]), abnormal bleeding (44 events [9.6%]), and microinsert malposition (33 events [7.2%]). The evaluation and management of these events resulted in an additional surgical procedure in 270 cases (59.1%), of which 44 were hysterectomies. Sixty-one unintended poststerilization pregnancies were reported in the study period, of which 29 (47.5%) were ectopic gestations. Thus, ectopic pregnancy must be considered if a woman becomes pregnant after Essure hysteroscopic sterilization. Additionally, 44 women underwent hysterectomy after an adverse event reported to be associated with the use of the device. Copyright © 2013 AAGL. Published by Elsevier Inc. All rights reserved.

  11. Synthesis of the System Modeling and Signal Detecting Circuit of a Novel Vacuum Microelectronic Accelerometer

    Directory of Open Access Journals (Sweden)

    Zhengguo Shang

    2009-05-01

    Full Text Available A novel high-precision vacuum microelectronic accelerometer has been successfully fabricated and tested in our laboratory. This accelerometer has unique advantages of high sensitivity, fast response, and anti-radiation stability. It is a prototype intended for navigation applications and is required to feature micro-g resolution. This paper briefly describes the structure and working principle of our vacuum microelectronic accelerometer, and the mathematical model is also established. The performances of the accelerometer system are discussed after Matlab modeling. The results show that, the dynamic response of the accelerometer system is significantly improved by choosing appropriate parameters of signal detecting circuit, and the signal detecting circuit is designed. In order to attain good linearity and performance, the closed-loop control mode is adopted. Weak current detection technology is studied, and integral T-style feedback network is used in I/V conversion, which will eliminate high-frequency noise at the front of the circuit. According to the modeling parameters, the low-pass filter is designed. This circuit is simple, reliable, and has high precision. Experiments are done and the results show that the vacuum microelectronic accelerometer exhibits good linearity over -1 g to +1 g, an output sensitivity of 543 mV/g, and a nonlinearity of 0.94 %.

  12. Trends in Microfabrication Capabilities & Device Architectures.

    Energy Technology Data Exchange (ETDEWEB)

    Bauer, Todd [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Jones, Adam [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Lentine, Tony [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Mudrick, John [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Okandan, Murat [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Rodrigues, Arun [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-06-01

    The last two decades have seen an explosion in worldwide R&D, enabling fundamentally new capabilities while at the same time changing the international technology landscape. The advent of technologies for continued miniaturization and electronics feature size reduction, and for architectural innovations, will have many technical, economic, and national security implications. It is important to anticipate possible microelectronics development directions and their implications on US national interests. This report forecasts and assesses trends and directions for several potentially disruptive microfabrication capabilities and device architectures that may emerge in the next 5-10 years.

  13. Radiation Testing, Characterization and Qualification Challenges for Modern Microelectronics and Photonics Devices and Technologies

    Science.gov (United States)

    LaBel, Kenneth A.; Cohn, Lewis M.

    2008-01-01

    At GOMAC 2007, we discussed a selection of the challenges for radiation testing of modern semiconductor devices focusing on state-of-the-art memory technologies. This included FLASH non-volatile memories (NVMs) and synchronous dynamic random access memories (SDRAMs). In this presentation, we extend this discussion in device packaging and complexity as well as single event upset (SEU) mechanisms using several technology areas as examples including: system-on-a-chip (SOC) devices and photonic or fiber optic systems. The underlying goal is intended to provoke thought for understanding the limitations and interpretation of radiation testing results.

  14. Flexible manufacturing for photonics device assembly

    Science.gov (United States)

    Lu, Shin-Yee; Pocha, Michael D.; Strand, Oliver T.; Young, K. David

    1994-01-01

    The assembly of photonics devices such as laser diodes, optical modulators, and opto-electronics multi-chip modules (OEMCM), usually requires the placement of micron size devices such as laser diodes, and sub-micron precision attachment between optical fibers and diodes or waveguide modulators (usually referred to as pigtailing). This is a very labor intensive process. Studies done by the opto-electronics (OE) industry have shown that 95 percent of the cost of a pigtailed photonic device is due to the use of manual alignment and bonding techniques, which is the current practice in industry. At Lawrence Livermore National Laboratory, we are working to reduce the cost of packaging OE devices through the use of automation. Our efforts are concentrated on several areas that are directly related to an automated process. This paper will focus on our progress in two of those areas, in particular, an automated fiber pigtailing machine and silicon micro-technology compatible with an automated process.

  15. The microelectronics and photonics test bed (MPTB) space, ground test and modeling experiments

    International Nuclear Information System (INIS)

    Campbell, A.

    1999-01-01

    This paper is an overview of the MPTB (microelectronics and photonics test bed) experiment, a combination of a space experiment, ground test and modeling programs looking at the response of advanced electronic and photonic technologies to the natural radiation environment of space. (author)

  16. Effects of atmospheric neutrons on advanced micro-electronic devices, standards and applications

    International Nuclear Information System (INIS)

    Leray, J.L.; Baggio, J.; Ferlet-Cavrois, V.; Flament, O.

    2005-01-01

    Since the 1980's, it is known that terrestrial cosmic rays, mainly reported as atmospheric neutrons, can penetrate the natural shielding of buildings, equipments and circuit package and induce soft errors in integrated circuits and breakdown of power devices. The high-energy neutron fluxes of interest, larger than 10 MeV, range between 10 particles/cm 2 /hour at sea level and 10 4 particles/cm 2 /hour at typical airplanes flight altitude of 30000 feet, with modulation due to solar flares. In the 1990's, the phenomenon has pervaded as a consequence of the road-map of electronic devices especially the down-scaling of transistor dimensions, the increase of signal bandwidth and the increase of the size of DRAM and SRAM memory, stand-alone or embedded on processors and system-on-chips. Failure-in-time and soft error rate became unacceptable. Test standards and design solutions have been proposed to maintain reliability of commercial products and improve those used in special high-reliability equipments such as avionic computers. The paper describes the atmospheric neutron flux, the effects in the main classes of devices and specific cases such as neutron induced single event upset observed in CMOS vs. CMOS/SOI and some mitigation issues. In this paper, a model called CCPM (critical cross-point model) is proposed to provide critical graphs of technology node sensitivity along the scaling trend of CMOS. (authors)

  17. Job stress models, depressive disorders and work performance of engineers in microelectronics industry.

    Science.gov (United States)

    Chen, Sung-Wei; Wang, Po-Chuan; Hsin, Ping-Lung; Oates, Anthony; Sun, I-Wen; Liu, Shen-Ing

    2011-01-01

    Microelectronic engineers are considered valuable human capital contributing significantly toward economic development, but they may encounter stressful work conditions in the context of a globalized industry. The study aims at identifying risk factors of depressive disorders primarily based on job stress models, the Demand-Control-Support and Effort-Reward Imbalance models, and at evaluating whether depressive disorders impair work performance in microelectronics engineers in Taiwan. The case-control study was conducted among 678 microelectronics engineers, 452 controls and 226 cases with depressive disorders which were defined by a score 17 or more on the Beck Depression Inventory and a psychiatrist's diagnosis. The self-administered questionnaires included the Job Content Questionnaire, Effort-Reward Imbalance Questionnaire, demography, psychosocial factors, health behaviors and work performance. Hierarchical logistic regression was applied to identify risk factors of depressive disorders. Multivariate linear regressions were used to determine factors affecting work performance. By hierarchical logistic regression, risk factors of depressive disorders are high demands, low work social support, high effort/reward ratio and low frequency of physical exercise. Combining the two job stress models may have better predictive power for depressive disorders than adopting either model alone. Three multivariate linear regressions provide similar results indicating that depressive disorders are associated with impaired work performance in terms of absence, role limitation and social functioning limitation. The results may provide insight into the applicability of job stress models in a globalized high-tech industry considerably focused in non-Western countries, and the design of workplace preventive strategies for depressive disorders in Asian electronics engineering population.

  18. Finite element modeling of micromachined MEMS photon devices

    Science.gov (United States)

    Evans, Boyd M., III; Schonberger, D. W.; Datskos, Panos G.

    1999-09-01

    The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.

  19. Finite Element Modeling of Micromachined MEMS Photon Devices

    International Nuclear Information System (INIS)

    Datskos, P.G.; Evans, B.M.; Schonberger, D.

    1999-01-01

    The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness

  20. The ''controbloc'', a programmable automatic device for the 1,300 MW generation of power stations

    International Nuclear Information System (INIS)

    Pralus, B.; Winzelle, J.C.

    1983-01-01

    Technological progress in the field of microelectronics has led to the development of an automatic control device, the ''controbloc'', for operating and controlling nuclear power plants. The ''controbloc'' will be used in automatic systems with a high degree of safety and versatility and is now being installed in the first of the new generation 1,300 MW power stations. The main characteristics of the device and the evaluation tests which have been carried out are described [fr

  1. Topology optimization for optical projection lithography with manufacturing uncertainties

    DEFF Research Database (Denmark)

    Zhou, Mingdong; Lazarov, Boyan Stefanov; Sigmund, Ole

    2014-01-01

    to manufacturing without additional optical proximity correction (OPC). The performance of the optimized device is robust toward the considered process variations. With the proposed unified approach, the design for photolithography is achieved by considering the optimal device performance and manufacturability......This article presents a topology optimization approach for micro-and nano-devices fabricated by optical projection lithography. Incorporating the photolithography process and the manufacturing uncertainties into the topology optimization process results in a binary mask that can be sent directly...

  2. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad; Karimi, Muhammad Akram; Salama, Khaled N.; Shamim, Atif

    2017-01-01

    disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept

  3. Electromagnetic Interference in Implantable Rhythm Devices - The Indian Scenario

    Directory of Open Access Journals (Sweden)

    Johnson Francis

    2002-07-01

    Full Text Available Implantable rhythm device (IRD is the generic name for the group of implantable devices used for diagnosis and treatment of cardiac arrhythmias. Devices in this category include cardiac pacemakers, implantable cardioverter defibrillators and implantable loop recorders. Since these devices have complex microelectronic circuitry and use electromagnetic waves for communication, they are susceptible to interference from extraneous sources of electromagnetic radiation and magnetic energy. Electromagnetic interference (EMI is generally not a major problem outside of the hospital environment. The most important interactions occur when a patient is subjected to medical procedures such as magnetic resonance imaging (MRI, electrocautery and radiation therapy. Two articles in this issue of the journal discusses various aspects of EMI on IRD1,2 . Together these articles provide a good review of the various sources of EMI and their interaction with IRD for the treating physician.

  4. Redox active polymer devices and methods of using and manufacturing the same

    Science.gov (United States)

    Johnson, Paul; Bautista-Martinez, Jose Antonio; Friesen, Cody; Switzer, Elise

    2018-06-05

    The disclosed technology relates generally to apparatus comprising conductive polymers and more particularly to tag and tag devices comprising a redox-active polymer film, and method of using and manufacturing the same. In one aspect, an apparatus includes a substrate and a conductive structure formed on the substrate which includes a layer of redox-active polymer film having mobile ions and electrons. The conductive structure further includes a first terminal and a second terminal configured to receive an electrical signal therebetween, where the layer of redox-active polymer is configured to conduct an electrical current generated by the mobile ions and the electrons in response to the electrical signal. The apparatus additionally includes a detection circuit operatively coupled to the conductive structure and configured to detect the electrical current flowing through the conductive structure.

  5. Assurance of Medical Device Quality with Quality Management System: An Analysis of Good Manufacturing Practice Implementation in Taiwan

    Directory of Open Access Journals (Sweden)

    Tzu-Wei Li

    2015-01-01

    Full Text Available The implementation of an effective quality management system has always been considered a principal method for a manufacturer to maintain and improve its product and service quality. Globally many regulatory authorities incorporate quality management system as one of the mandatory requirements for the regulatory control of high-risk medical devices. The present study aims to analyze the GMP enforcement experience in Taiwan between 1998 and 2013. It describes the regulatory implementation of medical device GMP requirement and initiatives taken to assist small and medium-sized enterprises in compliance with the regulatory requirement. Based on statistical data collected by the competent authority and industry research institutes, the present paper reports the growth of Taiwan local medical device industry after the enforcement of GMP regulation. Transition in the production, technologies, and number of employees of Taiwan medical device industry between 1998 and 2013 provides the competent authorities around the world with an empirical foundation for further policy development.

  6. Effects of microelectronics on industrial level measuring

    International Nuclear Information System (INIS)

    Schaudel, D.E.

    1979-01-01

    Microelectronic elements and production technologies have begun to change industrial level measurement, and this trend will continue. Spectacular breakthroughs cannot be expected, due to the major demand of reliability and to administrative constraints. The demand for transducers has increased with the advance of low-cost computer hardware. Electronics makes well-known method of measurements more universally applicable; it helps to realize new methods, and to design multifunctional transducers which always give the necessary signal for process guidance. The effects on society and environment are wholly positive: More and better measuring technologies permit a better utilisation of raw materials and energies, help to prevent environmental damage, and to raise the standard of living. Negative results are not to be expected on this sector. (orig./RW) [de

  7. High density microelectronics package using low temperature cofirable ceramics

    International Nuclear Information System (INIS)

    Fu, S.-L.; Hsi, C.-S.; Chen, L.-S.; Lin, W. K.

    1997-01-01

    Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for the resistors. Material with composition Pb(Fe 2/3 W 1/3 ) x (Fe l/2 Nb l/2 ) y Ti 2 O 3 was used as dielectric material of the capacitor in the substrate. The material can be sintered at temperatures between 850-930 degree centigrade, and has dielectric constant as high as 26000. After cofiring, good adhesion between dielectric and substrate layers was obtained. Combing the buried resistors and capacitors together with the lamination of LTCC layer, a 3-dimensional multilayered ceramic package was fabricated. (author)

  8. High density microelectronics package using low temperature cofirable ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Fu, S -L; Hsi, C -S; Chen, L -S; Lin, W K [Kaoshiung Polytechnic Institute Ta-Hsu, Kaoshiung (China)

    1998-12-31

    Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for the resistors. Material with composition Pb(Fe{sub 2/3}W{sub 1/3}){sub x}(Fe{sub l/2}Nb{sub l/2}){sub y}Ti{sub 2}O{sub 3} was used as dielectric material of the capacitor in the substrate. The material can be sintered at temperatures between 850-930 degree centigrade, and has dielectric constant as high as 26000. After cofiring, good adhesion between dielectric and substrate layers was obtained. Combing the buried resistors and capacitors together with the lamination of LTCC layer, a 3-dimensional multilayered ceramic package was fabricated. (author)

  9. Discrete microfluidics based on aluminum nitride surface acoustic wave devices

    OpenAIRE

    Zhou, J.; Pang, H.F.; Garcia-Gancedo, L.; Iborra, E.; Clement, M.; De Miguel-Ramos, M.; Jin, H.; Luo, J.K.; Smith, S.; Dong, S.R.; Wang, D.M.; Fu, Y.Q.

    2015-01-01

    To date, most surface acoustic wave (SAW) devices have been made from bulk piezoelectric materials, such as quartz, lithium niobate or lithium tantalite. These bulk materials are brittle, less easily integrated with electronics for control and signal processing, and difficult to realize multiple wave modes or apply complex electrode designs. Using thin film SAWs makes it convenient to integrate microelectronics and multiple sensing or microfluidics techniques into a lab-on-a-chip with low cos...

  10. Integrated circuit devices in control systems of coal mining complexes

    Energy Technology Data Exchange (ETDEWEB)

    1983-01-01

    Systems of automatic monitoring and control of coal mining complexes developed in the 1960's used electromagnetic relays, thyristors, and flip-flops on transistors of varying conductivity. The circuits' designers, devoted much attention to ensuring spark safety, lowering power consumption, and raising noise immunity and repairability of functional devices. The fast development of integrated circuitry led to the use of microelectronic components in most devices of mine automation. An analysis of specifications and experimental research into integrated circuits (IMS) shows that the series K 176 IMS components made by CMOS technology best meet mine conditions of operation. The use of IMS devices under mine conditions has demonstrated their high reliability. Further development of integrated circuitry involve using microprocessors and microcomputers. (SC)

  11. Fuel assembly manufacturing device

    International Nuclear Information System (INIS)

    Picard, P.; Villaeys, R.

    1995-01-01

    The device comprises a central support on which the frame is mounted, a magazine which supports the fuel rods in passages aligned with those in the frame and a traction assembly on the opposite side of the magazine and including an array of pull rods designed to be advanced through the passages in the frame, to grip respective fuel rods in magazine and to pull those rods into the passages on the return stroke. 13 figs

  12. Functional nanomaterials and devices for electronics, sensors and energy harvesting

    CERN Document Server

    Balestra, Francis; Kilchytska, Valeriya; Flandre, Denis

    2014-01-01

    This book contains reviews of recent experimental and theoretical results related to nanomaterials. It focuses on novel functional materials and nanostructures in combination with silicon on insulator (SOI) devices, as well as on the physics of new devices and sensors, nanostructured materials and nano scaled device characterization. Special attention is paid to fabrication and properties of modern low-power, high-performance, miniaturized, portable sensors in a wide range of applications such as telecommunications, radiation control, biomedical instrumentation and chemical analysis. In this book, new approaches exploiting nanotechnologies (such as UTBB FD SOI, Fin FETs, nanowires, graphene or carbon nanotubes on dielectric) to pave a way between “More Moore” and “More than Moore” are considered, in order to create different kinds of sensors and devices which will consume less electrical power, be more portable and totally compatible with modern microelectronics products.

  13. Co-Extrusion: Advanced Manufacturing for Energy Devices

    Energy Technology Data Exchange (ETDEWEB)

    Cobb, Corie Lynn [PARC, Palo Alto, CA (United States)

    2016-11-18

    The development of mass markets for large-format batteries, including electric vehicles (EVs) and grid support, depends on both cost reductions and performance enhancements to improve their economic viability. Palo Alto Research Center (PARC) has developed a multi-material, advanced manufacturing process called co-extrusion (CoEx) to remove multiple steps in a conventional battery coating process with the potential to simultaneously increase battery energy and power density. CoEx can revolutionize battery manufacturing across most chemistries, significantly lowering end-product cost and shifting the underlying economics to make EVs and other battery applications a reality. PARC’s scale-up of CoEx for electric vehicle (EV) batteries builds on a solid base of experience in applying CoEx to solar cell manufacturing, deposition of viscous ceramic pastes, and Li-ion battery chemistries. In the solar application, CoEx has been deployed commercially at production scale where multi-channel CoEx printheads are used to print viscous silver gridline pastes at full production speeds (>40 ft/min). This operational scale-up provided invaluable experience with the nuances of speed, yield, and maintenance inherent in taking a new technology to the factory floor. PARC has leveraged this experience, adapting the CoEx process for Lithium-ion (Li-ion) battery manufacturing. To date, PARC has worked with Li-ion battery materials and structured cathodes with high-density Li-ion regions and low-density conduction regions, documenting both energy and power performance. Modeling results for a CoEx cathode show a path towards a 10-20% improvement in capacity for an EV pouch cell. Experimentally, we have realized a co-extruded battery structure with a Lithium Nickel Manganese Cobalt (NMC) cathode at print speeds equivalent to conventional roll coating processes. The heterogeneous CoEx cathode enables improved capacity in thick electrodes at higher C-rates. The proof-of-principle coin cells

  14. Microelectronics Reliability

    Science.gov (United States)

    2017-01-17

    inverters  connected in a chain. ................................................. 5  Figure 3  Typical graph showing frequency versus square root of...developing an experimental  reliability estimating methodology that could both illuminate the  lifetime  reliability of advanced devices,  circuits and...or  FIT of the device. In other words an accurate estimate of the device  lifetime  was found and thus the  reliability  that  can  be  conveniently

  15. Additively manufactured porous tantalum implants

    NARCIS (Netherlands)

    Wauthle, Ruben; Van Der Stok, Johan; Yavari, Saber Amin; Van Humbeeck, Jan; Kruth, Jean Pierre; Zadpoor, Amir Abbas; Weinans, Harrie; Mulier, Michiel; Schrooten, Jan

    2015-01-01

    The medical device industry's interest in open porous, metallic biomaterials has increased in response to additive manufacturing techniques enabling the production of complex shapes that cannot be produced with conventional techniques. Tantalum is an important metal for medical devices because of

  16. An evaluation of the Manufacturer And User Facility Device Experience database that inspired the United States Food and Drug Administration's Reclassification of transvaginal mesh.

    Science.gov (United States)

    Sandberg, Jason M; Gray, Ian; Pearlman, Amy; Terlecki, Ryan P

    2018-03-01

    To assess the utility of the Manufacturer And User Facility Device Experience (MAUDE) database in objectively capturing adverse events for transvaginal mesh in the United States. We reviewed 1,103 individual medical device reports submitted to the MAUDE database that inspired the United States (US) Food and Drug Administration's 2008 Public Health Notification. Entries were compiled into a categorical database that reported manufacturer, brand, reporter type, report source, and type of adverse event. There were numerous examples of missing, duplicated, and non-standardized entries. Analysis revealed 64 reports with duplicated information, and six reports representing multiple patients. Forty-seven percent of medical device reports did not identify a reporter source. At least 28% of reported devices are no longer on the US market. There was wide variability in the quality and completeness of submitted reports and true adverse event rates could not be accurately calculated because the number of total cases was unknown. The MAUDE database was limited in its ability to collect, quantify, and standardize real-life adverse events related to transvaginal mesh. While it functions to collect information related to isolated adverse events, systematic limitations of the MAUDE database, that no doubt extend to other medical devices, necessitate the development of new reporting systems. Alternatives are under development, which may allow regulators to more accurately scrutinize the safety profiles of specific medical devices.

  17. Emerging epidemic in a growing industry: cigarette smoking among female micro-electronics workers in Taiwan.

    Science.gov (United States)

    Lin, Y-P; Yen, L-L; Pan, L-Y; Chang, P-J; Cheng, T-J

    2005-03-01

    To explore the emerging tobacco epidemic in female workers in the growing micro-electronics industry of Taiwan. Workers were surveyed regarding their smoking status, sociodemographics and work characteristics. In total, 1950 female employees in two large micro-electronics companies in Taiwan completed the survey. Approximately 9.3% of the female employees were occasional or daily smokers at the time of the survey. The prevalence of smoking was higher in those aged 16-19 years (20.9%), those not married (12.9%), those with a high school education or less (11.7%), those employed by Company A (11.7%), shift workers (14.3%), and those who had been in their present employment for 1 year or less (13.6%). Results of multivariate adjusted logistic regression indicated that younger age, lower level of education, shorter periods of employment with the company and shift working were the important factors in determining cigarette smoking among the study participants. The odds ratio of being a daily smoker was similar to that of being a current smoker. Marital status was the only significant variable when comparing former smokers with current smokers. Smoking prevalence in female workers in the two micro-electronics companies studied was much higher than previous reports have suggested about female smoking prevalence in Taiwan and China. We suggest that smoking is no longer a 'male problem' in Taiwan. Future smoking cessation and prevention programmes should target young working women as well as men.

  18. Implementation of Microelectronics Track in Electronics Engineering in a Philippines State University

    Directory of Open Access Journals (Sweden)

    Gil B. Barte

    2015-11-01

    Full Text Available The evolving trends in electronics continuous to attract students to take upElectronics Engineering.However, it also adds to discipline implementation complexities.Institutions of Higher Learning offering this program must adapt to this realities to avoid obsolescence. This paper looked at Batangas State University, in the Philippines,ongoingimplementation of the Microelectronics track under the Electronics Engineering (ECEProgram. It describes the restructuring done to the ECE curriculum to overcome the enormous complexity inherent in microelectronics design and the teaching pedagogy adopted to promote active learning. The ongoing program has produced encouraging outcomes:1students were able to design, and simulate complex gate CMOS circuits using EDA tools, in the four(4 course electives identified for the track; 2 the culture of independent learning among students improvement in students soft skills, communication skills, time-management and teamwork skill,; 3. useof free and web-based tools overcome the issue of high cost of license for EDA tools and seminar/training for continuous upgrading of faculty. Another encouraging outcome was the acceptance of the student-centered teaching approach used, Problem-Based Learning (PBL,in enhancing the students learning experience.

  19. Progress in Group III nitride semiconductor electronic devices

    International Nuclear Information System (INIS)

    Hao Yue; Zhang Jinfeng; Shen Bo; Liu Xinyu

    2012-01-01

    Recently there has been a rapid domestic development in group III nitride semiconductor electronic materials and devices. This paper reviews the important progress in GaN-based wide bandgap microelectronic materials and devices in the Key Program of the National Natural Science Foundation of China, which focuses on the research of the fundamental physical mechanisms of group III nitride semiconductor electronic materials and devices with the aim to enhance the crystal quality and electric performance of GaN-based electronic materials, develop new GaN heterostructures, and eventually achieve high performance GaN microwave power devices. Some remarkable progresses achieved in the program will be introduced, including those in GaN high electron mobility transistors (HEMTs) and metal—oxide—semiconductor high electron mobility transistors (MOSHEMTs) with novel high-k gate insulators, and material growth, defect analysis and material properties of InAlN/GaN heterostructures and HEMT fabrication, and quantum transport and spintronic properties of GaN-based heterostructures, and high-electric-field electron transport properties of GaN material and GaN Gunn devices used in terahertz sources. (invited papers)

  20. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-05-19

    Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

  1. Carbon nanotubes for thermal interface materials in microelectronic packaging

    Science.gov (United States)

    Lin, Wei

    As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment

  2. An evaluation of the Manufacturer And User Facility Device Experience database that inspired the United States Food and Drug Administration's Reclassification of transvaginal mesh

    Directory of Open Access Journals (Sweden)

    Jason M. Sandberg

    2018-03-01

    Full Text Available Purpose: To assess the utility of the Manufacturer And User Facility Device Experience (MAUDE database in objectively capturing adverse events for transvaginal mesh in the United States. Materials and Methods: We reviewed 1,103 individual medical device reports submitted to the MAUDE database that inspired the United States (US Food and Drug Administration's 2008 Public Health Notification. Entries were compiled into a categorical database that reported manufacturer, brand, reporter type, report source, and type of adverse event. Results: There were numerous examples of missing, duplicated, and non-standardized entries. Analysis revealed 64 reports with duplicated information, and six reports representing multiple patients. Forty-seven percent of medical device reports did not identify a reporter source. At least 28% of reported devices are no longer on the US market. There was wide variability in the quality and completeness of submitted reports and true adverse event rates could not be accurately calculated because the number of total cases was unknown. Conclusions: The MAUDE database was limited in its ability to collect, quantify, and standardize real-life adverse events related to transvaginal mesh. While it functions to collect information related to isolated adverse events, systematic limitations of the MAUDE database, that no doubt extend to other medical devices, necessitate the development of new reporting systems. Alternatives are under development, which may allow regulators to more accurately scrutinize the safety profiles of specific medical devices.

  3. A compact atomic force-scanning tunneling microscope for studying microelectronics and environmental aerosols

    International Nuclear Information System (INIS)

    Chen, G.

    1996-06-01

    This dissertation describes the characteristics and the construction of a compact atomic force/scanning tunneling microscope (AFM/STM). The basics and the method of preparing a tunneling junction between a chemically etched tunneling tip and a micro-manufactured cantilever is outlined by analyzing the forces between tunneling tip and cantilever as well as between force-sensing tip and sample surfaces. To our best knowledge this instrument is the first one using a commercial cantilever with only one piezoelectric tube carrying the whole tunneling sensor. The feedback control system has been optimized after a careful analysis of the electronic loop characteristics. The mode of operation has been determined by analyzing the dynamic characteristics of the scan heads and by investigating the time characteristics of the data acquisition system. The vibration isolation system has been calibrated by analyzing the characteristics of the damping setup and the stiffness of the scan head. The calculated results agree well with the measured ones. Also, a software package for data acquisition and real time display as well as for image processing and three-dimensional visualization has been developed. With this home-made software package, the images can be processed by means of a convolution filter, a Wiener filter and other 2-D FFT filters, and can be displayed in different ways. Atomic resolution images of highly oriented pyrolytic graphite (HOPG) and graphite surfaces have been obtained in AFM and STM mode. New theoretical explanations have been given for the observed anomalous STM and AFM images of graphite by calculating the asymmetric distribution of quantum conductance and tip-surface forces on a graphite surface. This not only resolved the theoretical puzzles of STM and AFM of graphite, but also revealed the relation between atomic force microscopy and scanning tunneling microscopy of graphite. Applications of STM and AFM to micro-electronic devices have been investigated

  4. Determining DfT Hardware by VHDL-AMS Fault Simulation for Biological Micro-Electronic Fluidic Arrays

    NARCIS (Netherlands)

    Kerkhoff, Hans G.; Zhang, X.; Liu, H.; Richardson, A.; Nouet, P.; Azais, F.

    2005-01-01

    The interest of microelectronic fluidic arrays for biomedical applications, like DNA determination, is rapidly increasing. In order to evaluate these systems in terms of required Design-for-Test structures, fault simulations in both fluidic and electronic domains are necessary. VHDL-AMS can be used

  5. Additive Manufacturing: Unlocking the Evolution of Energy Materials.

    Science.gov (United States)

    Zhakeyev, Adilet; Wang, Panfeng; Zhang, Li; Shu, Wenmiao; Wang, Huizhi; Xuan, Jin

    2017-10-01

    The global energy infrastructure is undergoing a drastic transformation towards renewable energy, posing huge challenges on the energy materials research, development and manufacturing. Additive manufacturing has shown its promise to change the way how future energy system can be designed and delivered. It offers capability in manufacturing complex 3D structures, with near-complete design freedom and high sustainability due to minimal use of materials and toxic chemicals. Recent literatures have reported that additive manufacturing could unlock the evolution of energy materials and chemistries with unprecedented performance in the way that could never be achieved by conventional manufacturing techniques. This comprehensive review will fill the gap in communicating on recent breakthroughs in additive manufacturing for energy material and device applications. It will underpin the discoveries on what 3D functional energy structures can be created without design constraints, which bespoke energy materials could be additively manufactured with customised solutions, and how the additively manufactured devices could be integrated into energy systems. This review will also highlight emerging and important applications in energy additive manufacturing, including fuel cells, batteries, hydrogen, solar cell as well as carbon capture and storage.

  6. Data visualization methods, data visualization devices, data visualization apparatuses, and articles of manufacture

    Science.gov (United States)

    Turner, Alan E.; Crow, Vernon L.; Payne, Deborah A.; Hetzler, Elizabeth G.; Cook, Kristin A.; Cowley, Wendy E.

    2015-06-30

    Data visualization methods, data visualization devices, data visualization apparatuses, and articles of manufacture are described according to some aspects. In one aspect, a data visualization method includes accessing a plurality of initial documents at a first moment in time, first processing the initial documents providing processed initial documents, first identifying a plurality of first associations of the initial documents using the processed initial documents, generating a first visualization depicting the first associations, accessing a plurality of additional documents at a second moment in time after the first moment in time, second processing the additional documents providing processed additional documents, second identifying a plurality of second associations of the additional documents and at least some of the initial documents, wherein the second identifying comprises identifying using the processed initial documents and the processed additional documents, and generating a second visualization depicting the second associations.

  7. Design, Fabrication, and Characterization of Carbon Nanotube Field Emission Devices for Advanced Applications

    Science.gov (United States)

    Radauscher, Erich Justin

    Carbon nanotubes (CNTs) have recently emerged as promising candidates for electron field emission (FE) cathodes in integrated FE devices. These nanostructured carbon materials possess exceptional properties and their synthesis can be thoroughly controlled. Their integration into advanced electronic devices, including not only FE cathodes, but sensors, energy storage devices, and circuit components, has seen rapid growth in recent years. The results of the studies presented here demonstrate that the CNT field emitter is an excellent candidate for next generation vacuum microelectronics and related electron emission devices in several advanced applications. The work presented in this study addresses determining factors that currently confine the performance and application of CNT-FE devices. Characterization studies and improvements to the FE properties of CNTs, along with Micro-Electro-Mechanical Systems (MEMS) design and fabrication, were utilized in achieving these goals. Important performance limiting parameters, including emitter lifetime and failure from poor substrate adhesion, are examined. The compatibility and integration of CNT emitters with the governing MEMS substrate (i.e., polycrystalline silicon), and its impact on these performance limiting parameters, are reported. CNT growth mechanisms and kinetics were investigated and compared to silicon (100) to improve the design of CNT emitter integrated MEMS based electronic devices, specifically in vacuum microelectronic device (VMD) applications. Improved growth allowed for design and development of novel cold-cathode FE devices utilizing CNT field emitters. A chemical ionization (CI) source based on a CNT-FE electron source was developed and evaluated in a commercial desktop mass spectrometer for explosives trace detection. This work demonstrated the first reported use of a CNT-based ion source capable of collecting CI mass spectra. The CNT-FE source demonstrated low power requirements, pulsing

  8. Three-Dimensional Printing of Multifunctional Nanocomposites: Manufacturing Techniques and Applications.

    Science.gov (United States)

    Farahani, Rouhollah D; Dubé, Martine; Therriault, Daniel

    2016-07-01

    The integration of nanotechnology into three-dimensional printing (3DP) offers huge potential and opportunities for the manufacturing of 3D engineered materials exhibiting optimized properties and multifunctionality. The literature relating to different 3DP techniques used to fabricate 3D structures at the macro- and microscale made of nanocomposite materials is reviewed here. The current state-of-the-art fabrication methods, their main characteristics (e.g., resolutions, advantages, limitations), the process parameters, and materials requirements are discussed. A comprehensive review is carried out on the use of metal- and carbon-based nanomaterials incorporated into polymers or hydrogels for the manufacturing of 3D structures, mostly at the microscale, using different 3D-printing techniques. Several methods, including but not limited to micro-stereolithography, extrusion-based direct-write technologies, inkjet-printing techniques, and popular powder-bed technology, are discussed. Various examples of 3D nanocomposite macro- and microstructures manufactured using different 3D-printing technologies for a wide range of domains such as microelectromechanical systems (MEMS), lab-on-a-chip, microfluidics, engineered materials and composites, microelectronics, tissue engineering, and biosystems are reviewed. Parallel advances on materials and techniques are still required in order to employ the full potential of 3D printing of multifunctional nanocomposites. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  9. Nanotechnology: MEMS and NEMS and their applications to smart systems and devices

    Science.gov (United States)

    Varadan, Vijay K.

    2003-10-01

    The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: (1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; (2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; (3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; (4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sending and control of a variety functions in automobile, aerospace, marine and

  10. 76 FR 41266 - Critical Path Manufacturing Sector Research Initiative (U01)

    Science.gov (United States)

    2011-07-13

    ... including nanotechnology are not fully developed in the public sector. This work will develop technology... manufacturing techniques for these products. Development of models for manufacturing and engineering of device products such as infusion pumps, prosthetic organs, defibrillators, tissue engineering devices, and...

  11. Design and manufacture of densitometer using in industrial radiography

    International Nuclear Information System (INIS)

    Nguyen Duc Huyen; Do Minh Duc; Vu Tien Ha; Dang Thanh Dung; Nguyen Do Kien

    2016-01-01

    Densitometer is a small device used to determine the darkness degree of radiography film. For improving the quality of the image on the film densitometer is indispensable equipment in sector related to the image, especially in the field of industrial imaging, radiographic. In Vietnam there are hundreds of densitometer devices, distributed to over 60 companies performing work on NDT sector and other companies. However, due to lack of maintenance, calibration and repair, many devices have been damaged, or unstable operation without any technical supports from the manufacturers. Up to now, Vietnam does not have any manufacturer (domestic and/or foreign) to research and development of the Densitometer. For these reasons, the scientists of Centre for Non-destructive Evaluation (NDE) with support from Vietnam Atomic Energy Institute (VINATOM) have successfully researched and manufactured the Densitometer using in industrial radiography in 2015.The equipment has been tested in practice and showed stable performance, measurement accuracy: ± 1% 0.02D; darkness range of film: 0.00 to 4.00D; repeated measurement values : ± 0.02D. The device meets ASTM 1079-00 standard for densitometer in industry. Especially, thanks to successful domestic manufacturing, the price of the device is only 60 % compared to the same imported products. (author)

  12. Utility of Big Area Additive Manufacturing (BAAM) For The Rapid Manufacture of Customized Electric Vehicles

    Energy Technology Data Exchange (ETDEWEB)

    Love, Lonnie J [ORNL

    2015-08-01

    This Oak Ridge National Laboratory (ORNL) Manufacturing Development Facility (MDF) technical collaboration project was conducted in two phases as a CRADA with Local Motors Inc. Phase 1 was previously reported as Advanced Manufacturing of Complex Cyber Mechanical Devices through Community Engagement and Micro-manufacturing and demonstrated the integration of components onto a prototype body part for a vehicle. Phase 2 was reported as Utility of Big Area Additive Manufacturing (BAAM) for the Rapid Manufacture of Customized Electric Vehicles and demonstrated the high profile live printing of an all-electric vehicle using ONRL s Big Area Additive Manufacturing (BAAM) technology. This demonstration generated considerable national attention and successfully demonstrated the capabilities of the BAAM system as developed by ORNL and Cincinnati, Inc. and the feasibility of additive manufacturing of a full scale electric vehicle as envisioned by the CRADA partner Local Motors, Inc.

  13. Method for manufacturing a single crystal nanowire

    NARCIS (Netherlands)

    van den Berg, Albert; Bomer, Johan G.; Carlen, Edwin; Chen, S.; Kraaijenhagen, Roderik Adriaan; Pinedo, Herbert Michael

    2013-01-01

    A method for manufacturing a single crystal nano-structure is provided comprising the steps of providing a device layer with a 100 structure on a substrate; providing a stress layer onto the device layer; patterning the stress layer along the 110 direction of the device layer; selectively removing

  14. Method for manufacturing a single crystal nanowire

    NARCIS (Netherlands)

    van den Berg, Albert; Bomer, Johan G.; Carlen, Edwin; Chen, S.; Kraaijenhagen, R.A.; Pinedo, Herbert Michael

    2010-01-01

    A method for manufacturing a single crystal nano-structure is provided comprising the steps of providing a device layer with a 100 structure on a substrate; providing a stress layer onto the device layer; patterning the stress layer along the 110 direction of the device layer; selectively removing

  15. Evaluation of manufactured device for radiation therapy in head and neck cancer

    International Nuclear Information System (INIS)

    Kim, Tae Jun; Jin, Sun Sik; Kim, Dong Wook; Chung, Weon Kuu; Kim, Kyoung Tae

    2014-01-01

    We compared the set-up accuracy and right-left shoulder position variation of the manufactured device and other commercial shoulder-retractors in the head and neck radiation treatment. Six patients consist of three groups which were used three different Shoulder retractors. We measured position corrections of left and right Shoulder and the couch after the image guidance by using on board imager (OBI) for six head and neck patients who has the extended target to the neck node lower region. The position variation correction of left (right) Shoulder after image guidance were 1.07±3.99 mm (-4.35±2.09 mm), -0.37±5.91 mm (1.26±5.28 mm), -0.63±2.44 mm (0.25±1.61 mm) for group A, B and C. The vertical, lateral, longitudinal position and angular corrections of the couch after image guidance were -2.06±2.68, -1.11±8.15, 0.34±3.78 mm, and 0.51 ±0.77 degree for group A, -1.18±1.82, 0.94±2.13, -0.67±1.98 mm, and 0.91±1.04 degree for group B and 0.12±2.18, - 0.79±2.64, 0.79±2.64 mm, and 0.00±0.49 degree for group C. In this preliminary study, we found the positioning accuracy of the manufactured Shoulder retractor is comparable to other commercial Shoulder retractors. We expect that the reproducibility and accuracy of the patient set-up could be improved by using the home made Shoulder retractor in the head and neck radiation treatment

  16. Evaluation of manufactured device for radiation therapy in head and neck cancer

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Tae Jun; Jin, Sun Sik; Kim, Dong Wook; Chung, Weon Kuu; Kim, Kyoung Tae [Dept. of Radiation Oncology, Kyung Hee University Hospital at Gangdong, Seoul (Korea, Republic of)

    2014-06-15

    We compared the set-up accuracy and right-left shoulder position variation of the manufactured device and other commercial shoulder-retractors in the head and neck radiation treatment. Six patients consist of three groups which were used three different Shoulder retractors. We measured position corrections of left and right Shoulder and the couch after the image guidance by using on board imager (OBI) for six head and neck patients who has the extended target to the neck node lower region. The position variation correction of left (right) Shoulder after image guidance were 1.07±3.99 mm (-4.35±2.09 mm), -0.37±5.91 mm (1.26±5.28 mm), -0.63±2.44 mm (0.25±1.61 mm) for group A, B and C. The vertical, lateral, longitudinal position and angular corrections of the couch after image guidance were -2.06±2.68, -1.11±8.15, 0.34±3.78 mm, and 0.51 ±0.77 degree for group A, -1.18±1.82, 0.94±2.13, -0.67±1.98 mm, and 0.91±1.04 degree for group B and 0.12±2.18, - 0.79±2.64, 0.79±2.64 mm, and 0.00±0.49 degree for group C. In this preliminary study, we found the positioning accuracy of the manufactured Shoulder retractor is comparable to other commercial Shoulder retractors. We expect that the reproducibility and accuracy of the patient set-up could be improved by using the home made Shoulder retractor in the head and neck radiation treatment.

  17. The manufacture of carbon armoured plasma-facing components for fusion devices

    International Nuclear Information System (INIS)

    Schedler, B.; Huber, T.; Zabernig, A.; Rainer, F.; Scheiber, K.H.; Schedle, D.

    2001-01-01

    Within the last decade Plansee has been active in the development and manufacture of different plasma-facing-components for nuclear fusion experiments consisting in a tungsten or CFC-armor joined onto metallic substrates like TZM, stainless steel or copper-alloys. The manufacture of these components requires unique joining technologies in order to obtain reliable thermo mechanical stable joints able to withstand highest heat fluxes without any deterioration of the joint. In an overview the different techniques will be presented by some examples of components already manufactured and successfully tested under high heat flux conditions. Furthermore an overview will be given on the manufacture of different high heat flux components for TORE SUPRA, Wendelstein 7-X and ITER. (author)

  18. Electronic device and method of manufacturing an electronic device

    NARCIS (Netherlands)

    2009-01-01

    An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units

  19. Process chains for the manufacturing of moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Mohammad Aminul; Hansen, Hans Nørgaard; Tang, Peter Torben

    2009-01-01

    process chains for the manufacturing of MIDs. This paper presents a comparison among the MID manufacturing process chains, and it presents experimental results based on two of the most industrially adapted processes. Experiments with two-component (2k) injection molding and subsequent selective......) process show that the success of the process is heavily dependant on the choice of material. It presents how the surface topographies are varied as a function of laser type and material choice. The amount of seed metal particles in the plastic material is a crucial factor that controls laser...

  20. Solid-state devices and applications

    CERN Document Server

    Lewis, Rhys

    1971-01-01

    Solid-State Devices and Applications is an introduction to the solid-state theory and its devices and applications. The book also presents a summary of all major solid-state devices available, their theory, manufacture, and main applications. The text is divided into three sections. The first part deals with the semiconductor theory and discusses the fundamentals of semiconductors; the kinds of diodes and techniques in their manufacture; the types and modes of operation of bipolar transistors; and the basic principles of unipolar transistors and their difference with bipolar transistors. The s

  1. Manufacture of Daily Check Device and Efficiency Evaluation for Daily Q.A

    International Nuclear Information System (INIS)

    Kim, Chan Yong; Jae, Young Wan; Park, Heung Deuk; Lee, Jae Hee

    2005-01-01

    Daily Q.A is the important step which must be preceded in a radiation treatment. Specially, radiation output measurement and laser alignment, SSD indicator related to a patient set-up recurrence must be confirmed for a reasonable radiation treatment. Daily Q.A proceeds correctness and a prompt way, and needs an objective measurement basis. Manufacture of the device which can facilitate confirmation of output measurement and appliances check at one time was requested. Produced the phantom formal daily check device which can confirm a lot of appliances check (output measurement and laser alignment. field size, SSD indicator) with one time of set up at a time, and measurement observed a linear accelerator (4 machine) for four months and evaluated efficiency. We were able to confirm an laser alignment, field size, SSD indicator check at the same time, and out put measurement was possible with the same set up, so daily Q.A time was reduced, and we were able to confirm an objective basis about each item measurement. As a result of having measured for four months, output measurement within ±2%, and measured laser alignment, field size, SSD indicator in range within ±1 mm. We can enforce output measurement and appliances check conveniently, and time was reduced and was able to raise efficiency of business. We were able to bring a cost reduction by substitution expensive commercialized equipment. Further It is necessary to makes a product as strong and slight materials, and improve convenience of use.

  2. A manufacturer's perspective: Hewlett Packard Y2K action plan.

    Science.gov (United States)

    Rapp, W N

    1999-01-01

    Medical device manufacturers must ensure that their devices are safe and effective including investigating issues involved with the century rollover. Manufacturers must begin early to evaluate their products in order to allow time to correct and distribute these product corrections and communicate to their customers so they can prepare for the Y2K event.

  3. The use of hearing protection devices with approach risk perception of noise induced hearing loss in several manufacturing industry

    Directory of Open Access Journals (Sweden)

    Behzad Fouladi Deahghi

    2015-06-01

    Full Text Available Background & Objective : Noise is a widespread physical agent and although is a most risk factors in workplaces that workers of health to exposed. Thus, different actions is done for reduce exposure to it in work places, which one of them is use of hearing protection devices. The use of hearing protection devices with approach risk perception of noise induced hearing loss in several manufacturing industry Method: This study was Cross-sectional study and done in five industrial unit with a sound pressure level more of 85 dB-A with the participation of 340 workers. To collect data , individual risk perception and self-investigator questionnaires were used. After collecting data, statistical analysis including Cronbach's alpha and regression were used to analyze the data. Results : Range use of hearing protection devices during shifts work by workers, respectively equal to: 50.4% sometimes, 31.58% never and 18.2% at all times. Also, results indicate significant differences between individual differences and hearing protection devices. Conclusion : Results of this study showed that individual risk perception as an important factor, can do a significant role in predicting the behavior of personals in the use of hearing protection devices, which should be considered in any design and implementation of hearing protection program.

  4. GPS User Devices Parameter Control Methods

    OpenAIRE

    Klūga, A; Kuļikovs, M; Beļinska, V; Zeļenkovs, A

    2007-01-01

    In our day’s wide assortment of GPS user devices is manufacture. How to verify that parameters of the real device corresponds to parameters that manufacture shows. How to verify that parameters have not been changed during the operation time. The last one is very important for aviation GPS systems, which must be verified before the flight, but the values of parameter in time of repair works. This work analyses GPS user devices parameters control methods.

  5. Using CORBA to integrate manufacturing cells to a virtual enterprise

    Science.gov (United States)

    Pancerella, Carmen M.; Whiteside, Robert A.

    1997-01-01

    It is critical in today's enterprises that manufacturing facilities are not isolated from design, planning, and other business activities and that information flows easily and bidirectionally between these activities. It is also important and cost-effective that COTS software, databases, and corporate legacy codes are well integrated in the information architecture. Further, much of the information generated during manufacturing must be dynamically accessible to engineering and business operations both in a restricted corporate intranet and on the internet. The software integration strategy in the Sandia Agile Manufacturing Testbed supports these enterprise requirements. We are developing a CORBA-based distributed object software system for manufacturing. Each physical machining device is a CORBA object and exports a common IDL interface to allow for rapid and dynamic insertion, deletion, and upgrading within the manufacturing cell. Cell management CORBA components access manufacturing devices without knowledge of any device-specific implementation. To support information flow from design to planning data is accessible to machinists on the shop floor. CORBA allows manufacturing components to be easily accessible to the enterprise. Dynamic clients can be created using web browsers and portable Java GUI's. A CORBA-OLE adapter allows integration to PC desktop applications. Other commercial software can access CORBA network objects in the information architecture through vendor API's.

  6. Additive technology of soluble mold tooling for embedded devices in composite structures: A study on manufactured tolerances

    Science.gov (United States)

    Roy, Madhuparna

    Composite textiles have found widespread use and advantages in various industries and applications. The constant demand for high quality products and services requires companies to minimize their manufacturing costs, and delivery time in order to compete in general and niche marketplaces. Advanced manufacturing methods aim to provide economical methods of mold production. Creation of molding and tooling options for advanced composites encompasses a large portion of the fabrication time, making it a costly process and restraining factor. This research discusses a preliminary investigation into the use of soluble polymer compounds and additive manufacturing to fabricate soluble molds. These molds suffer from dimensional errors due to several factors, which have also been characterized. The basic soluble mold of a composite is 3D printed to meet the desired dimensions and geometry of holistic structures or spliced components. The time taken to dissolve the mold depends on the rate of agitation of the solvent. This process is steered towards enabling the implantation of optoelectronic devices within the composite to provide sensing capability for structural health monitoring. The shape deviation of the 3D printed mold is also studied and compared to its original dimensions to optimize the dimensional quality to produce dimensionally accurate parts. Mechanical tests were performed on compact tension (CT) resin samples prepared from these 3D printed molds and revealed crack propagation towards an embedded intact optical fiber.

  7. Fabrication and Characterization of Device Pressure Regulation System Orifice of Manufacturing Process Gel Uranium Column Gelation External

    International Nuclear Information System (INIS)

    Triyono; Sutarni; Indra Suryawan

    2009-01-01

    The device pressure regulation orifice system of manufacturing process gel uranium on external column gelation has been made and characterized. The device consists : compressor 5.75-6.75 kg / cm 2 , air container tank, power supply 24 volts dc, solenoid valve 24 volts dc, pressure indicator 0-100 mbar, pressure indicator 0-250 mbar, mechanical valve and power electric 380 volts 50 Hz. The activity includes: installation device system and characterization with pressure variation orifice 5-75 mbar on the compressor 5.75-6.5 kg/cm 2 continuously for 1 minute. The method of installation i.e: wiring and piping to first component and support component (compressor and pressure air indicator, air container tank and pressure air indicator, solenoid valve, power supply 220 volts / 24 volts dc and orifice). After apparatus installed has been tested by the characterization without feed under air pressure varied to orifice of 5-75 mbar and device characterization with variation diameter orifice of 0.5-1 mm and orifice pressure of 5-75 mbar. The result in the characterization an every component good function, can be operation by input pressure range of 15-185 mbar orifice pressure range of 5-75 mbar. The characterization result device pressure regulation orifice system showed that: the system can be good operation of air pressure regulation orifice between 5-75 mbar with diameter orifice 0.5 mm to result gelation range of 10-25 piece / minute with variation air pressure input between 15-185 mbar of air pressure compressor 5.75-6.5 kg cm 2 . (author)

  8. Device for manufacturing methane or synthetic gas from materials containing carbon using a nuclear reactor

    International Nuclear Information System (INIS)

    Jaeger, W.

    1984-01-01

    This invention concerns a device for manufacturing methane or synthetic gas from materials containing carbon using a nuclear reactor, where part of the carbon is gasified with hydration and the remaining carbon is converted to synthetic gas by adding steam. This synthetic gas consists mainly of H 2 , CO, CO 2 and CH 4 and can be converted to methane in so-called methanising using a nickel catalyst. The hydrogen gasifier is situated in the first of two helium circuits of a high temperature reactor, and the splitting furnace is situated in the second helium circuit, where part of the methane produced is split into hydrogen at high temperature, which is used for the hydrating splitting of another part of the material containing carbon. (orig./RB) [de

  9. Investigation of Tribological Properties of Friction Pairs Duralumin – Fluoropolymer Used for Design and Manufacturing of Biomechatronic Devices

    Directory of Open Access Journals (Sweden)

    P. Kovalenko

    2017-06-01

    Full Text Available This paper deals with the processes occurring on the surfaces of materials during the interaction between metal and non-metal parts of various biomechatronic devices, such as prostheses, orthoses and exoskeletons. These mechatronic systems require careful selection of materials for design and manufacturing of their parts taking into consideration not only mechanical properties of the materials, but also their tribological characteristics. Friction pairs duralumin – fluoropolymer and stainless steel 100CrMn6 – fluoropolymer were chosen for the research as the samples. Experimental research was carried out with the use of the universal friction machine MTU-1. For this research, the scheme “plate-on-plate” was used without lubricants. Friction torque, friction coefficient and the temperature in the contact area versus the runtime were obtained as a result of the experiments. Furthermore, estimation of wear of contacting samples was performed. Analysis of the results allowed us to choose suitable materials for design and manufacturing of orthoses, prostheses and exoskeletons.

  10. Accuracy of mechanical torque-limiting devices for dental implants.

    Science.gov (United States)

    L'Homme-Langlois, Emilie; Yilmaz, Burak; Chien, Hua-Hong; McGlumphy, Edwin

    2015-10-01

    A common complication in implant dentistry is unintentional implant screw loosening. The critical factor in the prevention of screw loosening is the delivery of the appropriate target torque value. Mechanical torque-limiting devices (MTLDs) are the most frequently recommended devices by the implant manufacturers to deliver the target torque value to the screw. Two types of MTLDs are available: friction-style and spring-style. Limited information is available regarding the influence of device type on the accuracy of MTLDs. The purpose of this study was to determine and compare the accuracy of spring-style and friction-style MTLDs. Five MTLDs from 6 different dental implant manufacturers (Astra Tech/Dentsply, Zimmer Dental, Biohorizons, Biomet 3i, Straumann [ITI], and Nobel Biocare) (n=5 per manufacturer) were selected to determine their accuracy in delivering target torque values preset by their manufacturers. All torque-limiting devices were new and there were 3 manufacturers for the friction-style and 3 manufacturers for the spring-style. The procedure of target torque measurement was performed 10 times for each device and a digital torque gauge (Chatillon Model DFS2-R-ND; Ametek) was used to record the measurements. Statistical analysis used nonparametric tests to determine the accuracy of the MTLDs in delivering target torque values and Bonferroni post hoc tests were used to assess pairwise comparisons. Median absolute difference between delivered torque values and target torque values of friction-style and spring-style MTLDs were not significantly different (P>.05). Accuracy of Astra Tech and Zimmer Dental friction-style torque-limiting devices were significantly different than Biohorizons torque-limiting devices (Ptorque value. Astra Tech and Zimmer Dental friction-style torque-limiting devices were significantly more accurate than Biohorizons (C) torque-limiting devices (Ptorque-limiting devices fell within ±10% of the target torque value preset by the

  11. Performance analysis of Arithmetic Mean method in determining peak junction temperature of semiconductor device

    Directory of Open Access Journals (Sweden)

    Mohana Sundaram Muthuvalu

    2015-12-01

    Full Text Available High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The reliability of a semiconductor is determined by junction temperature. This paper gives a useful analysis on mathematical approach which can be implemented to predict temperature of a silicon die. The problem could be modeled as heat conduction equation. In this study, numerical approach based on implicit scheme and Arithmetic Mean (AM iterative method will be applied to solve the governing heat conduction equation. Numerical results are also included in order to assert the effectiveness of the proposed technique.

  12. Rapid manufacture of monolithic micro-actuated forceps inspired by echinoderm pedicellariae

    International Nuclear Information System (INIS)

    Leigh, S J; Purssell, C P; Covington, J A; Billson, D R; Hutchins, D A; Bowen, J

    2012-01-01

    The concept of biomimetics and bioinspiration has been used to enhance the function of materials and devices in fields ranging from healthcare to renewable energy. By developing advanced design and manufacturing processes, researchers are rapidly accelerating their ability to mimic natural systems. In this paper we show how micro-actuated forceps inspired by echinoderm pedicellarie have been produced using the rapid manufacturing technology of micro-stereolithography. The manufactured monolithic devices are composed of sets of jaws on the surface of thin polymer resin membranes, which serve as musculature for the jaws. The membranes are suspended above a pneumatic chamber with the jaws opened and closed through pneumatic pressure changes exerted by a simple syringe. The forceps can be used for tasks such as grasping of microparticles. Furthermore, when an object is placed in the centre of the membrane, the membrane flexes and the jaws of the device close and grasp the object in a responsive manner. When uncured liquid photopolymer is used to actuate the devices hydraulically instead of pneumatically, the devices exhibit self-healing behaviour, sealing the damaged regions and maintaining hydraulic integrity. The manufactured devices present exciting possibilities in fields such as micromanipulation and micro-robotics for healthcare. (communication)

  13. Computer-Aided Manufacturing of 3D Workpieces

    OpenAIRE

    Cornelia Victoria Anghel Drugarin; Mihaela Dorica Stroia

    2017-01-01

    Computer-Aided Manufacturing (CAM) assumes to use dedicated software for controlling machine tools and similar devices in the process of workpieces manufacturing. CAM is, in fact, an application technology that uses computer software and machinery to simplify and automate manufacturing processes. CAM is the inheritor of computer-aided engineering (CAE) and is often used conjunctively with computer-aided design (CAD). Advanced CAM solutions are forthcoming and have a large ...

  14. Biocompatibility of Advanced Manufactured Titanium Implants—A Review

    Science.gov (United States)

    Sidambe, Alfred T.

    2014-01-01

    Titanium (Ti) and its alloys may be processed via advanced powder manufacturing routes such as additive layer manufacturing (or 3D printing) or metal injection moulding. This field is receiving increased attention from various manufacturing sectors including the medical devices sector. It is possible that advanced manufacturing techniques could replace the machining or casting of metal alloys in the manufacture of devices because of associated advantages that include design flexibility, reduced processing costs, reduced waste, and the opportunity to more easily manufacture complex or custom-shaped implants. The emerging advanced manufacturing approaches of metal injection moulding and additive layer manufacturing are receiving particular attention from the implant fabrication industry because they could overcome some of the difficulties associated with traditional implant fabrication techniques such as titanium casting. Using advanced manufacturing, it is also possible to produce more complex porous structures with improved mechanical performance, potentially matching the modulus of elasticity of local bone. While the economic and engineering potential of advanced manufacturing for the manufacture of musculo-skeletal implants is therefore clear, the impact on the biocompatibility of the materials has been less investigated. In this review, the capabilities of advanced powder manufacturing routes in producing components that are suitable for biomedical implant applications are assessed with emphasis placed on surface finishes and porous structures. Given that biocompatibility and host bone response are critical determinants of clinical performance, published studies of in vitro and in vivo research have been considered carefully. The review concludes with a future outlook on advanced Ti production for biomedical implants using powder metallurgy. PMID:28788296

  15. Biocompatibility of Advanced Manufactured Titanium Implants—A Review

    Directory of Open Access Journals (Sweden)

    Alfred T. Sidambe

    2014-12-01

    Full Text Available Titanium (Ti and its alloys may be processed via advanced powder manufacturing routes such as additive layer manufacturing (or 3D printing or metal injection moulding. This field is receiving increased attention from various manufacturing sectors including the medical devices sector. It is possible that advanced manufacturing techniques could replace the machining or casting of metal alloys in the manufacture of devices because of associated advantages that include design flexibility, reduced processing costs, reduced waste, and the opportunity to more easily manufacture complex or custom-shaped implants. The emerging advanced manufacturing approaches of metal injection moulding and additive layer manufacturing are receiving particular attention from the implant fabrication industry because they could overcome some of the difficulties associated with traditional implant fabrication techniques such as titanium casting. Using advanced manufacturing, it is also possible to produce more complex porous structures with improved mechanical performance, potentially matching the modulus of elasticity of local bone. While the economic and engineering potential of advanced manufacturing for the manufacture of musculo-skeletal implants is therefore clear, the impact on the biocompatibility of the materials has been less investigated. In this review, the capabilities of advanced powder manufacturing routes in producing components that are suitable for biomedical implant applications are assessed with emphasis placed on surface finishes and porous structures. Given that biocompatibility and host bone response are critical determinants of clinical performance, published studies of in vitro and in vivo research have been considered carefully. The review concludes with a future outlook on advanced Ti production for biomedical implants using powder metallurgy.

  16. Biocompatibility of Advanced Manufactured Titanium Implants-A Review.

    Science.gov (United States)

    Sidambe, Alfred T

    2014-12-19

    Titanium (Ti) and its alloys may be processed via advanced powder manufacturing routes such as additive layer manufacturing (or 3D printing) or metal injection moulding. This field is receiving increased attention from various manufacturing sectors including the medical devices sector. It is possible that advanced manufacturing techniques could replace the machining or casting of metal alloys in the manufacture of devices because of associated advantages that include design flexibility, reduced processing costs, reduced waste, and the opportunity to more easily manufacture complex or custom-shaped implants. The emerging advanced manufacturing approaches of metal injection moulding and additive layer manufacturing are receiving particular attention from the implant fabrication industry because they could overcome some of the difficulties associated with traditional implant fabrication techniques such as titanium casting. Using advanced manufacturing, it is also possible to produce more complex porous structures with improved mechanical performance, potentially matching the modulus of elasticity of local bone. While the economic and engineering potential of advanced manufacturing for the manufacture of musculo-skeletal implants is therefore clear, the impact on the biocompatibility of the materials has been less investigated. In this review, the capabilities of advanced powder manufacturing routes in producing components that are suitable for biomedical implant applications are assessed with emphasis placed on surface finishes and porous structures. Given that biocompatibility and host bone response are critical determinants of clinical performance, published studies of in vitro and in vivo research have been considered carefully. The review concludes with a future outlook on advanced Ti production for biomedical implants using powder metallurgy.

  17. METHOD FOR MANUFACTURING A SINGLE CRYSTAL NANO-WIRE

    NARCIS (Netherlands)

    Van Den Berg, Albert; Bomer, Johan; Carlen Edwin, Thomas; Chen, Songyue; Kraaijenhagen Roderik, Adriaan; Pinedo Herbert, Michael

    2012-01-01

    A method for manufacturing a single crystal nano-structure includes providing a device layer with a 100 structure on a substrate; providing a stress layer onto the device layer; patterning the stress layer along the 110 direction of the device layer; selectively removing parts of the stress layer to

  18. METHOD FOR MANUFACTURING A SINGLE CRYSTAL NANO-WIRE.

    NARCIS (Netherlands)

    Van Den Berg, Albert; Bomer, Johan; Carlen Edwin, Thomas; Chen, Songyue; Kraaijenhagen Roderik, Adriaan; Pinedo Herbert, Michael

    2011-01-01

    A method for manufacturing a single crystal nano-structure is provided comprising the steps of providing a device layer with a 100 structure on a substrate; providing a stress layer onto the device layer; patterning the stress layer along the 110 direction of the device layer; selectively removing

  19. Mobile Technology Applications for Manufacturing, Reduction of Muda (Waste and the Effect on Manufacturing Economy and Efficiency

    Directory of Open Access Journals (Sweden)

    Angela M Huenerfauth

    2014-10-01

    Full Text Available Mobile devices in the manufacturing setting offer mobility and information whenever and wherever it is needed; these advantages allow for a more efficient workflow and allow the user to make more informed decisions. Due to these advantages, companies are reducing muda (waste by using mobile devices (implementing Lean Manufacturing and therefore saving money. Some of the mobile applications discussed in this paper are the following: Augmented Reality for assembly training, pruefcubing, remotely-monitored shop floors, statistical process control (SPC, and change requests for construction, and the two types of muda (waste reduced by these mobile applications are “unnecessary / excess motion and defects.”

  20. Solid-State Additive Manufacturing for Heat Exchangers

    Science.gov (United States)

    Norfolk, Mark; Johnson, Hilary

    2015-03-01

    Energy densities in devices are increasing across many industries including power generation, high power electronics, manufacturing, and automotive. Increasingly, there is a need for very high efficiency thermal management devices that can pull heat out of a small area at higher and higher rates. Metal additive manufacturing (AM) technologies have the promise of creating parts with complex internal geometries required for integral thermal management. However, this goal has not been met due to constraints in fusion-based metal 3D printers. This work presents a new strategy for metal AM of heat exchangers using an ultrasonic sheet lamination approach.

  1. Thin aligned organic polymer films for liquid crystal devices

    International Nuclear Information System (INIS)

    Foster, Kathryn Ellen

    1997-01-01

    This project was designed to investigate the possibility of producing alignment layers for liquid crystal devices by cross-linking thin films containing anisotropic polymer bound chromophores via irradiation with polarised ultraviolet light. Photocross-linkable polymers find use in microelectronics, liquid crystal displays, printing and UV curable lacquers and inks; so there is an increasing incentive for the development of new varieties of photopolymers in general. The synthesis and characterisation of two new photopolymers that are suitable as potential alignment layers for liquid crystal devices are reported in this thesis. The first polymer contains the anthracene chromophore attached via a spacer unit to a methacrylate backbone and the second used a similarly attached aryl azide group. Copolymers of the new monomers with methyl methacrylate were investigated to establish reactivity ratios in order to understand composition drift during polymerisation. (author)

  2. Firewood processing devices in Finland 2002

    International Nuclear Information System (INIS)

    Mutikainen, A.; Kaerhae, K.

    2002-01-01

    This Forestry Bulletin presents a review of the market situation for firewood processing devices in Finland during March 2002. The review is based on a questionnaire sent to device manufacturers. The firewood processing devices have traditionally been divided into three groups according to their functions: cross-cutting devices, splitting devices and cross-cutting and splitting devices. With a cross-cutting device the tree can be cross-cut only. Because it is easily possible to build the splitting function into a cross-cutting device, merely manufacturing a cross-cutting devices is rare. In all the splitting machines on the market, the splitting is carried out on a horizontally operated hydraulic cylinder pushing against a splitting blade. The types of cross-cutting blade mostly used in cross-cutting and splitting devices are circular i.e. circular saw blade, and chain saw. These devices are called firewood sawing machines. In firewood chopping machines that have a chopping blade, the wood is cross-cut using a spiral or guillotine blade. The splitting is done by a wedge blade or an axe blade. The firewood chopping machines can cross-cut and split stems up to a maximum of 20-22 cm in diameter. Circular blade firewood machines use either a cone screw or hydraulic cylinder and counter blade for splitting. They can handle wood of 20-30 cm thick in diameter. Machines using a chain saw can process stems of a maximum 30-45 cm thick in diameter. All firewood machines that work with a chain saw use a hydraulic cylinder and counter blade for splitting. According to the questionnaire responses, there were 14 (12 Finnish, one Norwegian and one Italian) manufacturers of firewood processing devices in the market. There were over 80 device models. There were only three cross-cutting devices, thirty splitting devices and forty cross-cutting splitting devices. The price range of the devices was 500-66,000 euros (including 22% VAT). According to the MTT Agrifood Research Finland

  3. The role of nanotechnology and nano and micro-electronics in monitoring and control of cardiovascular diseases and neurological disorders

    Science.gov (United States)

    Varadan, Vijay K.

    2007-04-01

    Nanotechnology has been broadly defined as the one for not only the creation of functional materials and devices as well as systems through control of matter at the scale of 1-100 nm, but also the exploitation of novel properties and phenomena at the same scale. Growing needs in the point-of-care (POC) that is an increasing market for improving patient's quality of life, are driving the development of nanotechnologies for diagnosis and treatment of various life threatening diseases. This paper addresses the recent development of nanodiagnostic sensors and nanotherapeutic devices with functionalized carbon nanotube and/or nanowire on a flexible organic thin film electronics to monitor and control of the three leading diseases namely 1) neurodegenerative diseases, 2) cardiovascular diseases, and 3) diabetes and metabolic diseases. The sensors developed include implantable and biocompatible devices, light weight wearable devices in wrist-watches, hats, shoes and clothes. The nanotherapeutics devices include nanobased drug delivery system. Many of these sensors are integrated with the wireless systems for the remote physiological monitoring. The author's research team has also developed a wireless neural probe using nanowires and nanotubes for monitoring and control of Parkinson's disease. Light weight and compact EEG, EOG and EMG monitoring system in a hat developed is capable of monitoring real time epileptic patients and patients with neurological and movement disorders using the Internet and cellular network. Physicians could be able to monitor these signals in realtime using portable computers or cell phones and will give early warning signal if these signals cross a pre-determined threshold level. In addition the potential impact of nanotechnology for applications in medicine is that, the devices can be designed to interact with cells and tissues at the molecular level, which allows high degree of functionality. Devices engineered at nanometer scale imply a

  4. Extended device profiles and testing procedures for the approval process of integrated medical devices using the IEEE 11073 communication standard.

    Science.gov (United States)

    Janß, Armin; Thorn, Johannes; Schmitz, Malte; Mildner, Alexander; Dell'Anna-Pudlik, Jasmin; Leucker, Martin; Radermacher, Klaus

    2018-02-23

    Nowadays, only closed and proprietary integrated operating room systems (IORS) from big manufacturers are available on the market. Hence, the interconnection of components from third-party vendors is only possible with increased time and costs. In the context of the German Federal Ministry of Education and Research (BMBF)-funded project OR.NET (2012-2016), the open integration of medical devices from different manufacturers was addressed. An integrated operating theater based on the open communication standard IEEE 11073 shall give clinical operators the opportunity to choose medical devices independently of the manufacturer. This approach would be advantageous especially for hospital operators and small- and medium-sized enterprises (SME) of medical devices. Actual standards and concepts regarding technical feasibility and the approval process do not cope with the requirements for a modular integration of medical devices in the operating room (OR), based on an open communication standard. Therefore, innovative approval strategies and corresponding certification and test procedures, which cover actual legal and normative standards, have to be developed in order to support the future risk management and the usability engineering process of open integrated medical devices in the OR. The use of standardized device and service profiles and a three-step testing procedure, including conformity, interoperability and integration tests are described in this paper and shall support the manufacturers to integrate their medical devices without disclosing the medical devices' risk analysis and related confidential expertise or proprietary information.

  5. A microfluidic device with pillars

    DEFF Research Database (Denmark)

    2014-01-01

    The invention provides a microfluidic device for mixing liquid reagents, the device comprises, a chip forming at least one reaction chamber between a bottom and a top and extending between an inlet and an outlet. To enable manufacturing from less rigid materials, the device comprises pillars...

  6. International Flipped Class for Chinese Honors Bachelor Students in the Frame of Multidisciplinary Fields: Reliability and Microelectronics

    Directory of Open Access Journals (Sweden)

    Olivier Bonnaud

    2018-07-01

    Full Text Available This paper reports an innovative pedagogic experience performed at South-East University (SEU with electrical engineering Bachelor honors students (computer science, mechanics, and electronics. The purpose was to develop their motivation and to make them aware of the strategic importance of two aspects of electronic engineering i.e. integrated technologies and reliability assessment of devices and systems. The pedagogical approach was based on a flipped class and learning by project that consisted to involve the students in the two topics. After several lectures on the fundamentals of microelectronics and reliability of electronics components performed by foreign professors, twelve groups of five students were built. Each group had to develop one topic, chosen for its strategic importance. Thus, from a given set of main literature references, the students prepared during three days a twelve pages report and an oral presentation, both in English language. Results were generally very good. Most of the students succeeded in addressing issues that were completely new for them. They clearly built by themselves the skills allowing understanding of all the important aspects of the topics they had to approach. This paper gives details on the organization, the content and the final evaluation.

  7. Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in [Phase 3 Memory,] 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices

    Energy Technology Data Exchange (ETDEWEB)

    Radchenko, I. [Singapore Univ. of Technology and Design (SUTD) (Singapore); Tippabhotla, S. K. [Singapore Univ. of Technology and Design (SUTD) (Singapore); Tamura, N. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Budiman, A. S. [Singapore Univ. of Technology and Design (SUTD) (Singapore)

    2016-10-21

    Synchrotron x-ray microdiffraction (μXRD) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, μXRD is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the μXRD technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of μXRD in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. Here, the approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.

  8. Ultralow-loss CMOS copper plasmonic waveguides

    DEFF Research Database (Denmark)

    Fedyanin, Dmitry Yu.; Yakubovsky, Dmitry I.; Kirtaev, Roman V.

    2016-01-01

    with microelectronics manufacturing technologies. This prevents plasmonic components from integration with both silicon photonics and silicon microelectronics. Here, we demonstrate ultralow-loss copper plasmonic waveguides fabricated in a simple complementary metal-oxide semiconductor (CMOS) compatible process, which...

  9. Pruning devices in 1995

    International Nuclear Information System (INIS)

    Mutikainen, A.

    1995-01-01

    This bulletin describes the market situation in April 1995 in Finland concerning devices suitable for silvicultural pruning in forestry. The review is based on the responses to a questionnaire sent to manufacturers and importers. Manually operated pruning devices, relying entirely on muscle power, were manufactured by six companies. There were four models each of branch saws and branch cutters and two models of branch blades. Motorised pruning devices, with the branch-severing power supplied by a combustion engine, battery or a power unit were manufactured by five companies. There were twelve models in all. The amount of pruning done in Finland has diminished year by year from the peak years of 1988-1989 when ca. 13000 hectares were pruned. In 1993 the corresponding figure was 5290 hectares of which 3930 hectares applied to private, non-industrial forestry. One contributing factor to this fall may be seen in the changes that have occurred in forest improvement regulations. The annual target set in the Forest 2000 program is for 20000 hectares to be pruned. (author)

  10. Spintronics

    International Nuclear Information System (INIS)

    Grundler, Dirk

    2003-01-01

    Devices that exploit the spin of the electron promise to revolutionize microelectronics once polarized electrons can be injected efficiently into semiconductors at room temperature. Later this year physicists will be celebrating the centenary of Paul Dirac's birth. One of the most influential scientists of the 20th century, Dirac combined quantum mechanics and special relativity to explain the strange magnetic or 'spin' properties of the electron. What Dirac could not have foreseen, however, is how the spin of the electron could change the field of microelectronics. Indeed, the spin of the electron has attracted renewed interest recently because it promises a wide variety of new devices that combine logic, storage and sensor applications. Moreover, these 'Spintronics' devices might lead to quantum computers and quantum communication based on electronic solid-state devices, thus changing the perspective of information technology in the 21st century. Since the 1970s conventional electronic microprocessors have operated by shuttling packets of electronic charge along ever-smaller semiconductor channels. Although this trend will continue for the next few years, experts predict that silicon technology is beginning to approach fundamental limits. By 2008, for example, the width of the 'gate electrodes' in a silicon microprocessor will be just 45 nano metres across, which will place severe demands on the materials and manufacturing techniques used in the semiconductor industry. Indeed, the cost of implementing a new production line for such devices is predicted to reach $33bn. Although successors to silicon technology have been discussed, most of them rely on a complete set of new materials, new handling and processing techniques, and altered circuit design, among other developments. These new technologies include single-electron transistors and molecular-electronic devices based on organic materials or carbon nanotubes (see Carbon nanotubes roll on Physics World June

  11. Designing and manufacturing of solar imaging and tracking system

    Directory of Open Access Journals (Sweden)

    Mehrdad Hosseini

    2017-11-01

    Full Text Available Abstract – in this study, designing and manufacturing of solar imaging and tracking system in order to research and spectroscopy applications are investigated. The device has the ability to be used as a Telescope, spectroscope, spectrophotometer and spectrohelioscope. The results obtained from this device are used in the various field of research such as absorption spectra of the surface of the sun, transit of planets in front of the sun, Doppler effects, evaluation of the Fraunhofer lines, plot of intensity versus wavelength and studying of Solar Flares. In this research, design and manufacture of the device, along with some of the results, are reported.

  12. Permitting product liability litigation for FDA-approved drugs and devices promotes patient safety.

    Science.gov (United States)

    Kesselheim, A S

    2010-06-01

    In 2008 and 2009, the Supreme Court reviewed the question of whether patients injured by dangerous prescription drugs or medical devices can bring tort lawsuits against pharmaceutical and device manufacturers. The Court ruled that claims against device manufacturers were preempted while claims against pharmaceutical manufacturers were not. The threat of product liability lawsuits promotes patient safety by encouraging manufacturers to take greater responsibility in providing clear warnings about known adverse effects of their products.

  13. French Sizing of Medical Devices is not Fit for Purpose

    International Nuclear Information System (INIS)

    Kibriya, Nabil; Hall, Rebecca; Powell, Steven; How, Thien; McWilliams, Richard G.

    2013-01-01

    PurposeThe purpose of the study is to quantify the variation in the metric equivalent of French size in a range of medical devices, from various manufacturers, used in interventional radiology.MethodsThe labelling of a range of catheters, introducers, drains, balloons, stents, and endografts was examined. Products were chosen to achieve a broad range of French sizes from several manufacturers. To assess manufacturing accuracy, eight devices were selected for measurement using a laser micrometer. The external diameters of three specimens of each device were measured at centimeter intervals along the length of the device to ensure uniformity.ResultsA total of 200 labels of interventional radiology equipment were scrutinized. The results demonstrate a wide variation in the metric equivalent of French sizing. Labelled products can vary in diameter across the product range by up to 0.79 mm.The devices selected for measurement with the non-contact laser micrometer demonstrate acceptable manufacturing consistency. The external diameter differed by 0.05 mm on average.ConclusionsOur results demonstrate wide variation in the interpretation of the French scale by different manufacturers of medical devices. This has the potential to lead to problems using coaxial systems especially when the products are from different manufacturers. It is recommended that standard labelling should be employed by all manufacturers conveying specific details of the equipment. Given the wide variation in the interpretation of the French scale, our opinion is that this scale either needs to be abandoned or be strictly defined and followed

  14. Polymer electronic devices and materials.

    Energy Technology Data Exchange (ETDEWEB)

    Schubert, William Kent; Baca, Paul Martin; Dirk, Shawn M.; Anderson, G. Ronald; Wheeler, David Roger

    2006-01-01

    Polymer electronic devices and materials have vast potential for future microsystems and could have many advantages over conventional inorganic semiconductor based systems, including ease of manufacturing, cost, weight, flexibility, and the ability to integrate a wide variety of functions on a single platform. Starting materials and substrates are relatively inexpensive and amenable to mass manufacturing methods. This project attempted to plant the seeds for a new core competency in polymer electronics at Sandia National Laboratories. As part of this effort a wide variety of polymer components and devices, ranging from simple resistors to infrared sensitive devices, were fabricated and characterized. Ink jet printing capabilities were established. In addition to promising results on prototype devices the project highlighted the directions where future investments must be made to establish a viable polymer electronics competency.

  15. Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

    Science.gov (United States)

    Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

    2014-01-01

    Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

  16. Bio-Manufacturing to market pilot project

    Energy Technology Data Exchange (ETDEWEB)

    Dressen, Tiffaney [Univ. of California, Berkeley, CA (United States)

    2017-09-25

    The Bio-Manufacturing to Market pilot project was a part of the AMJIAC, the Advanced Manufacturing Jobs and Innovation Accelerator Challenge grant. This internship program set out to further define and enhance the talent pipeline from the University and local Community Colleges to startup culture in East Bay Area, provide undergraduate STEM students with opportunities outside academia, and provide startup companies with much needed talent. Over the 4 year period of performance, the Bio-Manufacturing to Market internship program sponsored 75 undergraduate STEM students who were able to spend anywhere from one to six semesters working with local Bay Area startup companies and DOE sponsored facilities/programs in the biotech, bio-manufacturing, and biomedical device fields.

  17. Microstructural evolution of the LENS manufactured TiAl structure

    CSIR Research Space (South Africa)

    Lengopeng, T

    2016-11-01

    Full Text Available The advent of additive manufacturing presented the new-era where complex structures can be prototype and rapidly manufactured from a computer aided device file. Robust industries such as the aerospace and medicinal require 3D printed complex...

  18. Multilayer Integrated Film Bulk Acoustic Resonators

    CERN Document Server

    Zhang, Yafei

    2013-01-01

    Multilayer Integrated Film Bulk Acoustic Resonators mainly introduces the theory, design, fabrication technology and application of a recently developed new type of device, multilayer integrated film bulk acoustic resonators, at the micro and nano scale involving microelectronic devices, integrated circuits, optical devices, sensors and actuators, acoustic resonators, micro-nano manufacturing, multilayer integration, device theory and design principles, etc. These devices can work at very high frequencies by using the newly developed theory, design, and fabrication technology of nano and micro devices. Readers in fields of IC, electronic devices, sensors, materials, and films etc. will benefit from this book by learning the detailed fundamentals and potential applications of these advanced devices. Prof. Yafei Zhang is the director of the Ministry of Education’s Key Laboratory for Thin Films and Microfabrication Technology, PRC; Dr. Da Chen was a PhD student in Prof. Yafei Zhang’s research group.

  19. Solid state laser applications in photovoltaics manufacturing

    Science.gov (United States)

    Dunsky, Corey; Colville, Finlay

    2008-02-01

    Photovoltaic energy conversion devices are on a rapidly accelerating growth path driven by increasing government and societal pressure to use renewable energy as part of an overall strategy to address global warming attributed to greenhouse gas emissions. Initially supported in several countries by generous tax subsidies, solar cell manufacturers are relentlessly pushing the performance/cost ratio of these devices in a quest to reach true cost parity with grid electricity. Clearly this eventual goal will result in further acceleration in the overall market growth. Silicon wafer based solar cells are currently the mainstay of solar end-user installations with a cost up to three times grid electricity. But next-generation technology in the form of thin-film devices promises streamlined, high-volume manufacturing and greatly reduced silicon consumption, resulting in dramatically lower per unit fabrication costs. Notwithstanding the modest conversion efficiency of thin-film devices compared to wafered silicon products (around 6-10% versus 15-20%), this cost reduction is driving existing and start-up solar manufacturers to switch to thin-film production. A key aspect of these devices is patterning large panels to create a monolithic array of series-interconnected cells to form a low current, high voltage module. This patterning is accomplished in three critical scribing processes called P1, P2, and P3. Lasers are the technology of choice for these processes, delivering the desired combination of high throughput and narrow, clean scribes. This paper examines these processes and discusses the optimization of industrial lasers to meet their specific needs.

  20. Selected Advances in Nanoelectronic Devices Logic, Memory and RF

    CERN Document Server

    Joodaki, Mojtaba

    2013-01-01

    Nanoelectronics, as a true successor of microelectronics, is certainly a major technology boomer in the 21st century. This has been shown by its several applications and also by its enormous potential to influence all areas of electronics, computers, information technology, aerospace defense, and consumer goods. Although the current semiconductor technology is projected to reach its physical limit in about a decade, nanoscience and nanotechnology promise breakthroughs for the future. The present books provides an in-depth review of the latest advances in the technology of nanoelectronic devices and their developments over the past decades. Moreover, it introduces new concepts for the realization of future nanoelectronic devices. The main focus of the book is on three fundamental branches of semiconductor products or applications: logic, memory, and RF and communication. By pointing out to the key technical challenges, important aspects and characteristics of various designs are used to illustrate mechanisms t...

  1. EXPERIENCES IN THE AIR SPINNING TO MANUFACTURE MEDICAL DEVICES

    Directory of Open Access Journals (Sweden)

    MARSAL Feliu

    2015-05-01

    Full Text Available The work aims to determine, with scientific rigor, differences in key parameters of the yarns produced by conventional ring spinning systems, open-end and air spinning and its interrelation with the main parameters of those products that are intended for medical-sanitary sector. The experiences have been made in a Spanish company from short fibers sector that has three spinning systems, with tradition and prestige in world market, validating the results in Innotex Center laboratories of the Polytechnic University of Catalonia. Considering the results, it shows that the technology of manufacture of yarns by air is suitable for yarn, woven fabrics and knitting, structures to textile medical-sanitary application, by specific properties as well as enhanced competitiveness, due to the high production rate and shortened spinning process. The viscose yarns manufactured by air mass are more mass regular. The new DR parameter clearly indicates a better look of the finished fabric when we work with yarns produced by air technology.The significant reduction of the hairiness means less formation of loose fibres by friction, very important in the application of these yarns in the manufacture of textile structures for medical-sanitary use. Also no-table increase of about 15% in the absorption capacity of the fluids, especially water, from the yarns made by air. In the functionalization of fabrics obtained from spun yarn by air will need to apply a permanent smoothing.

  2. Biomedical applications of additive manufacturing: present and future

    NARCIS (Netherlands)

    Singh, Sunpreet; Ramakrishna, Seeram; Bouten, Carlijn V.C.; Narayan, Roger

    2017-01-01

    Three dimensional printing (3DP) or additive manufacturing (AM) of medical devices and scaffolds for tissue engineering, regenerative medicine, ex-vivo tissues and drug delivery is of intense interest in recent years. A few medical devices namely, ZipDose ® , Pharmacoprinting, powder bed fusion,

  3. Medical device risk management and its economic impact

    Directory of Open Access Journals (Sweden)

    Katerina Krsteva Jakimovska

    2013-10-01

    Full Text Available The importance of medical devices in everyday users/patients lives is imensse. This is the reason why emphasis must be put on safety during their use. Satisfactory safety level can be achived by implementation of quality and risk management standards. Medical device manufacturers must learn to deal with the potential risks by using theoretical and practical examples and measures in order to protect their users/patients and themselves from suffering huge losses arising from adverse events or recall of their products. The best moment for implementation of risk management methods and analysis begins from the device design and development through manufacturing, sales and distribution. These way medical device manufacturers will succseed in protecting their users/patients from serious adverse events and at the same time protect their brand and society status, while minimizing economic losses.

  4. Smart devices are different

    DEFF Research Database (Denmark)

    Stisen, Allan; Blunck, Henrik; Bhattacharya, Sourav

    2015-01-01

    research results. This is due to variations in training and test device hardware and their operating system characteristics among others. In this paper, we systematically investigate sensor-, device- and workload-specific heterogeneities using 36 smartphones and smartwatches, consisting of 13 different...... device models from four manufacturers. Furthermore, we conduct experiments with nine users and investigate popular feature representation and classification techniques in HAR research. Our results indicate that on-device sensor and sensor handling heterogeneities impair HAR performances significantly...

  5. The Diverse Ecology of Electronic Materials

    NARCIS (Netherlands)

    Mody, Cyrus C.M.; Teissier, Pierre; Mody, Cyrus C. M.; Tiggelen, Brigitte van

    2017-01-01

    Silicon has been the dominant material in microelectronics for a half century. Other materials, however, have subsidiary roles in microelectronics manufacturing. A few materials have even been promoted as replacements for silicon. Yet because of silicon’s dominance, none of these alternatives has

  6. Graphene Aerogel Templated Fabrication of Phase Change Microspheres as Thermal Buffers in Microelectronic Devices.

    Science.gov (United States)

    Wang, Xuchun; Li, Guangyong; Hong, Guo; Guo, Qiang; Zhang, Xuetong

    2017-11-29

    Phase change materials, changing from solid to liquid and vice versa, are capable of storing and releasing a large amount of thermal energy during the phase change, and thus hold promise for numerous applications including thermal protection of electronic devices. Shaping these materials into microspheres for additional fascinating properties is efficient but challenging. In this regard, a novel phase change microsphere with the design for electrical-regulation and thermal storage/release properties was fabricated via the combination of monodispersed graphene aerogel microsphere (GAM) and phase change paraffin. A programmable method, i.e., coupling ink jetting-liquid marbling-supercritical drying (ILS) techniques, was demonstrated to produce monodispersed graphene aerogel microspheres (GAMs) with precise size-control. The resulting GAMs showed ultralow density, low electrical resistance, and high specific surface area with only ca. 5% diameter variation coefficient, and exhibited promising performance in smart switches. The phase change microspheres were obtained by capillary filling of phase change paraffin inside the GAMs and exhibited excellent properties, such as low electrical resistance, high latent heat, well sphericity, and thermal buffering. Assembling the phase change microsphere into the microcircuit, we found that this tiny device was quite sensitive and could respond to heat as low as 0.027 J.

  7. Trial manufacture of inside ellipse mirror for laser amplifier

    International Nuclear Information System (INIS)

    Kodama, Kenzo; Numajiri, Fumio; Kikuta, Yozo; Takasawa, Minoru; Oohira, Susumu; Nagaoka, Isao

    1984-01-01

    Inside ellipse mirrors have been trially manufactured for high power glass laser amplifiers. Their cutting process, machining, surface roughness, usage of cutting tools, materials, and processing process are given. Trial manufacture of supplementary devices for adjusting the direction of laser beam axis is also given. (author)

  8. Advances in 3D printing & additive manufacturing technologies

    CERN Document Server

    Pandey, Pulak; Kumar, L

    2017-01-01

    This edited volume comprises select chapters on advanced technologies for 3D printing and additive manufacturing and how these technologies have changed the face of direct, digital technologies for rapid production of models, prototypes and patterns. Because of its wide applications, 3D printing and additive manufacturing technology has become a powerful new industrial revolution in the field of manufacturing. The evolution of 3D printing and additive manufacturing technologies has changed design, engineering and manufacturing processes across industries such as consumer products, aerospace, medical devices and automotives. The objective of this book is to help designers, R&D personnel, and practicing engineers understand the state-of-the-art developments in the field of 3D Printing and Additive Manufacturing. .

  9. Numerical flow simulation methods and additive manufacturing methods for the development of a flow optimised design of a novel point-of-care diagnostic device

    Directory of Open Access Journals (Sweden)

    Dethloff Manuel

    2017-09-01

    Full Text Available For the development of a novel, user-friendly and low cost point-of-care diagnostic device for the detection of disease specific biomarker a flow optimised design of the test system has to be investigated. The resulting test system is characterised by a reduced execution period, a reduction of execution steps and an integrated waste management. Based on previous results, the current study focused on the design implementation of the fluidic requirements, e. g. tightness, inside the test device. With the help of fluid flow simulations (CFD – computational fluid dynamics the flow behaviour inside the test device was analysed for different designs and arrangements. Prototypes generated from additive manufacturing technologies (PolyJet modeling are used for validating the simulation results and further experimental tests.

  10. Ferroelectric devices, interconnects, and methods of manufacture thereof

    KAUST Repository

    Alshareef, Husam N.; Unnat, Bhansali; Khan, Mohd Adnan; Saleh, Moussa M.; Odeh, Ihab N.

    2013-01-01

    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  11. Ferroelectric devices, interconnects, and methods of manufacture thereof

    KAUST Repository

    Alshareef, Husam N.

    2013-12-12

    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  12. 77 FR 69488 - Medical Devices; Custom Devices; Request for Comments

    Science.gov (United States)

    2012-11-19

    ... strategy and policy for the custom device exemption criteria in the FD&C Act amended by FDASIA. FDA is... States in finished form through labeling or advertising by the manufacturer, importer, or distributor for...

  13. A Manufacturing Cost and Supply Chain Analysis of SiC Power Electronics Applicable to Medium-Voltage Motor Drives

    Energy Technology Data Exchange (ETDEWEB)

    Horowitz, Kelsey [National Renewable Energy Lab. (NREL), Golden, CO (United States); Remo, Timothy [National Renewable Energy Lab. (NREL), Golden, CO (United States); Reese, Samantha [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2017-03-24

    Wide bandgap (WBG) semiconductor devices are increasingly being considered for use in certain power electronics applications, where they can improve efficiency, performance, footprint, and, potentially, total system cost compared to systems using traditional silicon (Si) devices. Silicon carbide (SiC) devices in particular -- which are currently more mature than other WBG devices -- are poised for growth in the coming years. Today, the manufacturing of SiC wafers is concentrated in the United States, and chip production is split roughly equally between the United States, Japan, and Europe. Established contract manufacturers located throughout Asia typically carry out manufacturing of WBG power modules. We seek to understand how global manufacturing of SiC components may evolve over time by illustrating the regional cost drivers along the supply chain and providing an overview of other factors that influence where manufacturing is sited. We conduct this analysis for a particular case study where SiC devices are used in a medium-voltage motor drive.

  14. Nanoparticles from the Gas Phase as Building Blocks for Electrical Devices

    International Nuclear Information System (INIS)

    Fissan, H.; Kennedy, M.K.; Krinke, T.J.; Kruis, F.E.

    2003-01-01

    Electrical device development is driven by miniaturization and possibilities to use new chemical and physical effects. Nanotechnology offers both aspects. The structural dimensions of materials and devices are small and because of that large exchange surfaces are provided but also effects like quantum effects may occur and be used to get new or at least improved properties of nanostructured materials and devices.Nanoparticles are of special interest because of their nanodimensions in all three directions, so that nanoeffects become most prominent. They can be synthesized in solid materials, in liquids and in gases. Gas synthesis has several advantages compared to the other phases, especially the high cleanliness which can be achieved. In case of electrical devices the particles have to be deposited onto substrates in a structured way.The substrate may consist out of microelectronic devices in which the deposited nanoparticles are introduced for the basic function. In case of a transistor this would be the gate function, in case of a sensor this would be the sensing layer, where the contact with the measurement object takes place. For two kinds of particles SnO 2 and PbS, synthesized in the gas phase, we demonstrate the way how to create devices with improved sensor properties

  15. Photonic devices based on black phosphorus and related hybrid materials

    International Nuclear Information System (INIS)

    Vitiello, M.S.; Viti, L.

    2016-01-01

    Artificial semiconductor heterostructures played a pivotal role in modern electronic and photonic technologies, providing a highly effective means for the manipulation and control of carriers, from the visible to the far-infrared, leading to the development of highly efficient devices like sources, detectors and modulators. The discovery of graphene and the related fascinating capabilities have triggered an unprecedented interest in devices based on inorganic two-dimensional (2D) materials. Amongst them, black phosphorus (BP) recently showed an extraordinary potential in a variety of applications across micro-electronics and photonics. With an energy gap between the gapless graphene and the larger gap transition metal dichalcogenides, BP can form the basis for a new generation of high-performance photonic devices that could be specifically engineered to comply with different applications, like transparent saturable absorbers, fast photocounductive switches and low noise photodetectors, exploiting its peculiar electrical, thermal and optical anisotropy. This paper will review the latest achievements in black-phosphorus–based THz photonics and discuss future perspectives of this rapidly developing research field.

  16. In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon

    Science.gov (United States)

    Tokel, Onur; Turnalı, Ahmet; Makey, Ghaith; Elahi, Parviz; ćolakoǧlu, Tahir; Ergeçen, Emre; Yavuz, Ã.-zgün; Hübner, René; Zolfaghari Borra, Mona; Pavlov, Ihor; Bek, Alpan; Turan, Raşit; Kesim, Denizhan Koray; Tozburun, Serhat; Ilday, Serim; Ilday, F. Ã.-mer

    2017-10-01

    Silicon is an excellent material for microelectronics and integrated photonics1-3, with untapped potential for mid-infrared optics4. Despite broad recognition of the importance of the third dimension5,6, current lithography methods do not allow the fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realized with techniques like reactive ion etching. Embedded optical elements7, electronic devices and better electronic-photonic integration are lacking8. Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1-µm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has an optical index different to that in unmodified parts, enabling the creation of numerous photonic devices. Optionally, these parts can be chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface—that is, `in-chip'—microstructures for microfluidic cooling of chips, vias, micro-electro-mechanical systems, photovoltaic applications and photonic devices that match or surpass corresponding state-of-the-art device performances.

  17. In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon.

    Science.gov (United States)

    Tokel, Onur; Turnali, Ahmet; Makey, Ghaith; Elahi, Parviz; Çolakoğlu, Tahir; Ergeçen, Emre; Yavuz, Özgün; Hübner, René; Borra, Mona Zolfaghari; Pavlov, Ihor; Bek, Alpan; Turan, Raşit; Kesim, Denizhan Koray; Tozburun, Serhat; Ilday, Serim; Ilday, F Ömer

    2017-10-01

    Silicon is an excellent material for microelectronics and integrated photonics1-3 with untapped potential for mid-IR optics4. Despite broad recognition of the importance of the third dimension5,6, current lithography methods do not allow fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realised with techniques like reactive ion etching. Embedded optical elements, like in glass7, electronic devices, and better electronic-photonic integration are lacking8. Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1 µm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has a different optical index than unmodified parts, which enables numerous photonic devices. Optionally, these parts are chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface, i.e. , " in-chip" microstructures for microfluidic cooling of chips, vias, MEMS, photovoltaic applications and photonic devices that match or surpass the corresponding state-of-the-art device performances.

  18. Laser micromachining of biofactory-on-a-chip devices

    Science.gov (United States)

    Burt, Julian P.; Goater, Andrew D.; Hayden, Christopher J.; Tame, John A.

    2002-06-01

    Excimer laser micromachining provides a flexible means for the manufacture and rapid prototyping of miniaturized systems such as Biofactory-on-a-Chip devices. Biofactories are miniaturized diagnostic devices capable of characterizing, manipulating, separating and sorting suspension of particles such as biological cells. Such systems operate by exploiting the electrical properties of microparticles and controlling particle movement in AC non- uniform stationary and moving electric fields. Applications of Biofactory devices are diverse and include, among others, the healthcare, pharmaceutical, chemical processing, environmental monitoring and food diagnostic markets. To achieve such characterization and separation, Biofactory devices employ laboratory-on-a-chip type components such as complex multilayer microelectrode arrays, microfluidic channels, manifold systems and on-chip detection systems. Here we discuss the manufacturing requirements of Biofactory devices and describe the use of different excimer laser micromachined methods both in stand-alone processes and also in conjunction with conventional fabrication processes such as photolithography and thermal molding. Particular attention is given to the production of large area multilayer microelectrode arrays and the manufacture of complex cross-section microfluidic channel systems for use in simple distribution and device interfacing.

  19. 21 CFR 820.130 - Device packaging.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect the...

  20. Nanoscale Copper and Copper Compounds for Advanced Device Applications

    Science.gov (United States)

    Chen, Lih-Juann

    2016-12-01

    Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

  1. Human-centered design (HCD) of a fault-finding application for mobile devices and its impact on the reduction of time in fault diagnosis in the manufacturing industry.

    Science.gov (United States)

    Kluge, Annette; Termer, Anatoli

    2017-03-01

    The present article describes the design process of a fault-finding application for mobile devices, which was built to support workers' performance by guiding them through a systematic strategy to stay focused during a fault-finding process. In collaboration with a project partner in the manufacturing industry, a fault diagnosis application was conceptualized based on a human-centered design approach (ISO 9241-210:2010). A field study with 42 maintenance workers was conducted for the purpose of evaluating the performance enhancement of fault finding in three different scenarios as well as for assessing the workers' acceptance of the technology. Workers using the mobile device application were twice as fast at fault finding as the control group without the application and perceived the application as very useful. The results indicate a vast potential of the mobile application for fault diagnosis in contemporary manufacturing systems. Copyright © 2016 Elsevier Ltd. All rights reserved.

  2. Classification and evaluation of medical devices

    Directory of Open Access Journals (Sweden)

    Edina Vranić

    2003-05-01

    Full Text Available Medical devices and medical disposables contribute significantly to the quality and effectiveness of the health care system. It is necessary to commit scientifically sound regulatory environment that will provide consumers with the best medical care. This includes continued services to small manufacturers, readily available guidance on FDA requirements, predictable and reasonable response times on applications for marketing, and equitable enforcement. But in the public interest, this commitment to the industry must be coupled with a reciprocal commitment: that medical device firms will meet high standards in the design, manufacture, and evaluation of their products. The protections afforded our consumer, and the benefits provided the medical device industry, cannot be underestimated.

  3. Guide to state-of-the-art electron devices

    CERN Document Server

    2013-01-01

    Concise, high quality and comparative overview of state-of-the-art electron device development, manufacturing technologies and applications Guide to State-of-the-Art Electron Devices marks the 60th anniversary of the IEEE Electron Devices Committee and the 35th anniversary of the IEEE Electron Devices Society, as such it defines the state-of-the-art of electron devices, as well as future directions across the entire field. Spans full range of electron device types such as photovoltaic devices, semiconductor manufacturing and VLSI technology and circuits, covered by IEEE Electron and Devices Society Contributed by internationally respected members of the electron devices community A timely desk reference with fully-integrated colour and a unique lay-out with sidebars to highlight the key terms Discusses the historical developments and speculates on future trends to give a more rounded picture of the topics covered A valuable resource R&D managers; engineers in the semiconductor industry; applied scientists...

  4. Materials contamination control in the microelectronic industry; Controle de la contamination des materiaux dans l`industrie de la micro-electronique

    Energy Technology Data Exchange (ETDEWEB)

    Tardif, F

    1994-12-31

    This paper deals with many aspects of the contamination of materials in the microelectronic industry. The contamination`s control of chemicals, process gases, silicon and the survey of the ions free water`s purity are treated. (TEC). 29 figs., 7 tabs.

  5. Establishment Registration & Device Listing

    Data.gov (United States)

    U.S. Department of Health & Human Services — This searchable database contains establishments (engaged in the manufacture, preparation, propagation, compounding, assembly, or processing of medical devices...

  6. Piezoelectric-nanowire-enabled power source for driving wireless microelectronics.

    Science.gov (United States)

    Xu, Sheng; Hansen, Benjamin J; Wang, Zhong Lin

    2010-10-19

    Harvesting energy from irregular/random mechanical actions in variable and uncontrollable environments is an effective approach for powering wireless mobile electronics to meet a wide range of applications in our daily life. Piezoelectric nanowires are robust and can be stimulated by tiny physical motions/disturbances over a range of frequencies. Here, we demonstrate the first chemical epitaxial growth of PbZr(x)Ti(1-x)O(3) (PZT) nanowire arrays at 230 °C and their application as high-output energy converters. The nanogenerators fabricated using a single array of PZT nanowires produce a peak output voltage of ~0.7 V, current density of 4 μA cm(-2) and an average power density of 2.8 mW cm(-3). The alternating current output of the nanogenerator is rectified, and the harvested energy is stored and later used to light up a commercial laser diode. This work demonstrates the feasibility of using nanogenerators for powering mobile and even personal microelectronics.

  7. How do medical device manufacturers' websites frame the value of health innovation? An empirical ethics analysis of five Canadian innovations.

    Science.gov (United States)

    Lehoux, P; Hivon, M; Williams-Jones, B; Miller, F A; Urbach, D R

    2012-02-01

    While every health care system stakeholder would seem to be concerned with obtaining the greatest value from a given technology, there is often a disconnect in the perception of value between a technology's promoters and those responsible for the ultimate decision as to whether or not to pay for it. Adopting an empirical ethics approach, this paper examines how five Canadian medical device manufacturers, via their websites, frame the corporate "value proposition" of their innovation and seek to respond to what they consider the key expectations of their customers. Our analysis shows that the manufacturers' framing strategies combine claims that relate to valuable socio-technical goals and features such as prevention, efficiency, sense of security, real-time feedback, ease of use and flexibility, all elements that likely resonate with a large spectrum of health care system stakeholders. The websites do not describe, however, how the innovations may impact health care delivery and tend to obfuscate the decisional trade-offs these innovations represent from a health care system perspective. Such framing strategies, we argue, tend to bolster physicians' and patients' expectations and provide a large set of stakeholders with powerful rhetorical tools that may influence the health policy arena. Because these strategies are difficult to counter given the paucity of evidence and its limited use in policymaking, establishing sound collective health care priorities will require solid critiques of how certain kinds of medical devices may provide a better (i.e., more valuable) response to health care needs when compared to others.

  8. More than a device: today's medical technology companies provide value through service.

    Science.gov (United States)

    McCoy, Fred

    2003-01-01

    When physicians implant cardiac rhythm management devices, they establish a long-term relationship with those devices and with the manufacturers of those devices. The therapeutic value that each device will provide to its patient is enhanced throughout the life of the device by the services that the manufacturer provides. Services are provided prior to, during and long after implantation. Services include physician and allied health professional training, quality assurance programs, therapy outreach initiatives, on site technical support during device implantation and follow-up, technical service expertise and customer service support. The costs of these services are substantial. When assessed on a per device basis, the service costs may actually exceed the costs of manufacture. Further, the costs of these services are rising. Over the past five years, the number of implanted cardiac rhythm management devices has doubled. Industry field forces have tripled in size. Clearly, industry is dedicated to providing service as a critical element in achieving excellent patient outcomes.

  9. The DARPA manufacturing initiative in high temperature superconductivity

    International Nuclear Information System (INIS)

    Adams, K.R.

    1989-01-01

    The Defense Advanced Research Projects Agency (DARPA) has a very aggressive Technology Base program in high temperature superconductivity. This program is expected to provide the basis for a specialized set of military products - passive microwave and millimeter wave devices - within the next three years. In order to get these high leverage products into military systems, a manufacturing base must be developed for HTSC components. A plan for DARPA in HTSC manufacturing is directly coupled with the ongoing DARPA materials and device oriented R and D program. In essence, this plan recommends a three phased effort: 1. Phase I (two years); Fund companies through R and D contracts for specialized HTSC components; prepare a detailed plan and develop an HTSC consortium. 2. Phase II (six years): Establish an HTSC Sematech initiative for electronic applications, including active devices. 3. Phase III (optional): Continue the HTSC Sematech with emphasis on high power applications

  10. Radiation effects in advanced microelectronics technologies

    Science.gov (United States)

    Johnston, A. H.

    1998-06-01

    The pace of device scaling has increased rapidly in recent years. Experimental CMOS devices have been produced with feature sizes below 0.1 /spl mu/m, demonstrating that devices with feature sizes between 0.1 and 0.25 /spl mu/m will likely be available in mainstream technologies after the year 2000. This paper discusses how the anticipated changes in device dimensions and design are likely to affect their radiation response in space environments. Traditional problems, such as total dose effects, SEU and latchup are discussed, along with new phenomena. The latter include hard errors from heavy ions (microdose and gate-rupture errors), and complex failure modes related to advanced circuit architecture. The main focus of the paper is on commercial devices, which are displacing hardened device technologies in many space applications. However, the impact of device scaling on hardened devices is also discussed.

  11. Novel Polymeric Dielectric Materials for the Additive Manufacturing of Microwave Devices

    Science.gov (United States)

    O'Keefe, Shamus E.

    The past decade has seen a rapid increase in the deployment of additive manufacturing (AM) due to the perceived benefits of lower cost, higher quality, and a smaller environmental footprint. And while the hardware behind most of AM processes is mature, the study and development of material feedstock(s) are in their infancy, particularly so for niche areas. In this dissertation, we look at novel polymeric materials to support AM for microwave devices. Chapter 1 provides an overview of the benefits of AM, followed by the specific motivation for this work, and finally a scope defining the core objectives. Chapter 2 delves into a higher-level background of dielectric theory and includes a brief overview of the two common dielectric spectroscopy techniques used in this work. The remaining chapters, summarized below, describe experiments in which novel polymeric materials were developed and their microwave dielectric properties measured. Chapter 3 describes the successful synthesis of polytetrafluroethylene (PTFE)/polyacrylate (PA) core-shell nanoparticles and their measured microwave dielectric properties. PTFE/PA core-shell nanoparticles with spherical morphology were successfully made by aerosol deposition followed by a brief annealing. The annealing temperature is closely controlled to exceed the glass transition (Tg) of the PA shell yet not exceed the Tg of the PTFE core. Furthermore, the annealing promotes coalescence amongst the PA shells of neighboring nanoparticles and results in the formation of a contiguous PA matrix that has excellent dispersion of PTFE cores. The measured dielectric properties agree well with theoretical predictions and suggest the potential of this material as a feedstock for AM microwave devices. Chapter 4 delves into the exploration of various polyimide systems with the aim of replacing the PA in the previously studied PTFE/PA core-shell nanoparticles. Fundamental relationships between polymer attributes (flexibility/rigidity and

  12. Medical Devices

    NARCIS (Netherlands)

    Verkerke, Gijsbertus Jacob; Mahieu, H.F.; Geertsema, A.A.; Hermann, I.F.; van Horn, J.R.; Hummel, J. Marjan; van Loon, J.P.; Mihaylov, D.; van der Plaats, A.; Schraffordt Koops, H.; Schutte, H.K.; Veth, R.P.H.; de Vries, M.P.; Rakhorst, G.; Shi, Donglu

    2004-01-01

    The development of new medical devices is a very time-consuming and costly process. Besides the time between the initial idea and the time that manufacturing and testing of prototypes takes place, the time needed for the development of production facilities, production of test series, marketing,

  13. 21 CFR 820.184 - Device history record.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device history record. 820.184 Section 820.184 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES QUALITY SYSTEM REGULATION Records § 820.184 Device history record. Each manufacturer shall...

  14. Firewood preparation devices in 1994

    International Nuclear Information System (INIS)

    Mutikainen, A.

    1994-01-01

    A review of the market situation regarding firewood preparation devices is presented. The information was collected from the answers to a mail questionnaire. The review is assumed to include all the leading manufacturers and importers. Firewood production devices were available from 26 manufacturers. The range of models amounted to over 70. These may be divided into three categories: 1. cutting devices: the most common solution being a cross-cutting circular saw. There were only a few of these on sale as it is quite easy to include a splitting device on the same frame. 2. Splitting devices: e.g. screw splitter and hydraulically powered splitter. About 20 models are available on the markets. Cross cutting and splitting devices: these are the most popular devices. A cross-cutting circular saw with screw or hydraulic splitter is the most common type. There are about 50 models available on the markets. Cross-cutting and splitting devices are often equipped with conveyor for transferring the split wood e.g. into a trailer. Chopping devices are delivered as tractor powered devices, as electric motor powered devices or as combustion engine powered devices. Some of them are equipped with a time saving feeding device enabling the next stem to be lifted into position while the previous one is being chopped. The Finnish Work Efficiency Institute's studies show that when cross-cutting and splitting of stems into pieces of 35-50 cm in length, productivity for one operator varies in between 0.8 - 3.2 m 3 /h, depending on the device and work method used. (6 refs., 1 fig., 2 tabs.)

  15. Humanitarian Use Devices/Humanitarian Device Exemptions in cardiovascular medicine.

    Science.gov (United States)

    Kaplan, Aaron V; Harvey, Elisa D; Kuntz, Richard E; Shiran, Hadas; Robb, John F; Fitzgerald, Peter

    2005-11-01

    The Second Dartmouth Device Development Symposium held in October 2004 brought together leaders from the medical device community, including clinical investigators, senior representatives from the US Food and Drug Administration, large and small device manufacturers, and representatives from the financial community to examine difficult issues confronting device development. The role of the Humanitarian Use Device/Humanitarian Device Exemption (HUD/HDE) pathway in the development of new cardiovascular devices was discussed in this forum. The HUD/HDE pathway was created by Congress to facilitate the availability of medical devices for "orphan" indications, ie, those affecting HDEs have been granted (23 devices, 6 diagnostic tests). As the costs to gain regulatory approval for commonly used devices increase, companies often seek alternative ways to gain market access, including the HUD/HDE pathway. For a given device, there may be multiple legitimate and distinct indications, including indications that meet the HUD criteria. Companies must choose how and when to pursue each of these indications. The consensus of symposium participants was for the HUD/HDE pathway to be reserved for true orphan indications and not be viewed strategically as part of the clinical development plan to access a large market.

  16. Modeling and investigations on TID-ASETs synergistic effect in LM124 operational amplifier from three different manufacturers

    International Nuclear Information System (INIS)

    Roig, F.; Dusseau, L.; Privat, A.; Vaille, J.R.; Boch, J.; Saigne, F.; Ribeiro, P.; Auriel, G.; Khachatrian, A.; Roche, N.J.H.; Warner, J.H.; Buchner, S.P.; Mc- Morrow, D.; Azais, B.; Marec, R.; Calvel, P.; Bezerra, F.; Ecoffet, R.

    2013-01-01

    The synergistic effect between Total Ionizing Dose (TID) and Analog Single Event Transient (ASET) in LM124 operational amplifiers (op-amps) from three different manufacturers is investigated. This effect is clearly identified on only two manufacturers by three, highlighting manufacturer dependent. In fact, significant variations were observed on both the TID sensitivity and the ASET response of LM124 devices from different manufacturers. Hypotheses are made on the cause of the differences observed. A previously developed ASET simulation tool is used to model the transient response. The effects of TID on devices are taken into account in the model by injecting the variations of key electrical parameters obtained during Co irradiation. An excellent agreement is observed between the experimental responses and the model outputs, independently of the TID level, the bias configuration and the manufacturer of the device. (authors)

  17. A cell-microelectronic sensing technique for profiling cytotoxicity of chemicals

    International Nuclear Information System (INIS)

    Boyd, Jessica M.; Huang, Li; Xie Li; Moe, Birget; Gabos, Stephan; Li Xingfang

    2008-01-01

    A cell-microelectronic sensing technique is developed for profiling chemical cytotoxicity and is used to study different cytotoxic effects of the same class chemicals using nitrosamines as examples. This technique uses three human cell lines (T24 bladder, HepG2 liver, and A549 lung carcinoma cells) and Chinese hamster ovary (CHO-K1) cells in parallel as the living components of the sensors of a real-time cell electronic sensing (RT-CES) method for dynamic monitoring of chemical toxicity. The RT-CES technique measures changes in the impedance of individual microelectronic wells that is correlated linearly with changes in cell numbers during t log phase of cell growth, thus allowing determination of cytotoxicity. Four nitrosamines, N-nitrosodimethylamine (NDMA), N-nitrosodiphenylamine (NDPhA), N-nitrosopiperidine (NPip), and N-nitrosopyrrolidine (NPyr), were examined and unique cytotoxicity profiles were detected for each nitrosamine. In vitro cytotoxicity values (IC 50 ) for NDPhA (ranging from 0.6 to 1.9 mM) were significantly lower than the IC 50 values for the well-known carcinogen NDMA (15-95 mM) in all four cell lines. T24 cells were the most sensitive to nitrosamine exposure among the four cell lines tested (T24 > CHO > A549 > HepG2), suggesting that T24 may serve as a new sensitive model for cytotoxicity screening. Cell staining results confirmed that administration of the IC 50 concentration from the RT-CES experiments inhibited cell growth by 50% compared to the controls, indicating that the RT-CES method provides reliable measures of IC 50 . Staining and cell-cycle analysis confirmed that NDPhA caused cell-cycle arrest at the G0/G1 phase, whereas NDMA did not disrupt the cell cycle but induced cell death, thus explaining the different cytotoxicity profiles detected by the RT-CES method. The parallel cytotoxicity profiling of nitrosamines on the four cell lines by the RT-CES method led to the discovery of the unique cytotoxicity of NDPhA causing cell

  18. A cell-microelectronic sensing technique for profiling cytotoxicity of chemicals

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, Jessica M [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Huang, Li [Environmental Health Sciences, Department of Public Health Sciences, School of Public Health, University of Alberta, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Li, Xie; Moe, Birget [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Gabos, Stephan [Public Health Surveillance and Environmental Health, Alberta Health and Wellness, 10025 Jasper Avenue, Box 1360, Edmonton, Alberta, T5J 2N3 (Canada); Xingfang, Li [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Environmental Health Sciences, Department of Public Health Sciences, School of Public Health, University of Alberta, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada)], E-mail: xingfang.li@ualberta.ca

    2008-05-12

    A cell-microelectronic sensing technique is developed for profiling chemical cytotoxicity and is used to study different cytotoxic effects of the same class chemicals using nitrosamines as examples. This technique uses three human cell lines (T24 bladder, HepG2 liver, and A549 lung carcinoma cells) and Chinese hamster ovary (CHO-K1) cells in parallel as the living components of the sensors of a real-time cell electronic sensing (RT-CES) method for dynamic monitoring of chemical toxicity. The RT-CES technique measures changes in the impedance of individual microelectronic wells that is correlated linearly with changes in cell numbers during t log phase of cell growth, thus allowing determination of cytotoxicity. Four nitrosamines, N-nitrosodimethylamine (NDMA), N-nitrosodiphenylamine (NDPhA), N-nitrosopiperidine (NPip), and N-nitrosopyrrolidine (NPyr), were examined and unique cytotoxicity profiles were detected for each nitrosamine. In vitro cytotoxicity values (IC{sub 50}) for NDPhA (ranging from 0.6 to 1.9 mM) were significantly lower than the IC{sub 50} values for the well-known carcinogen NDMA (15-95 mM) in all four cell lines. T24 cells were the most sensitive to nitrosamine exposure among the four cell lines tested (T24 > CHO > A549 > HepG2), suggesting that T24 may serve as a new sensitive model for cytotoxicity screening. Cell staining results confirmed that administration of the IC{sub 50} concentration from the RT-CES experiments inhibited cell growth by 50% compared to the controls, indicating that the RT-CES method provides reliable measures of IC{sub 50}. Staining and cell-cycle analysis confirmed that NDPhA caused cell-cycle arrest at the G0/G1 phase, whereas NDMA did not disrupt the cell cycle but induced cell death, thus explaining the different cytotoxicity profiles detected by the RT-CES method. The parallel cytotoxicity profiling of nitrosamines on the four cell lines by the RT-CES method led to the discovery of the unique cytotoxicity of NDPh

  19. Evidence of Filamentary Switching in Oxide-based Memory Devices via Weak Programming and Retention Failure Analysis

    Science.gov (United States)

    Younis, Adnan; Chu, Dewei; Li, Sean

    2015-09-01

    Further progress in high-performance microelectronic devices relies on the development of novel materials and device architectures. However, the components and designs that are currently in use have reached their physical limits. Intensive research efforts, ranging from device fabrication to performance evaluation, are required to surmount these limitations. In this paper, we demonstrate that the superior bipolar resistive switching characteristics of a CeO2:Gd-based memory device can be manipulated by means of UV radiation, serving as a new degree of freedom. Furthermore, the metal oxide-based (CeO2:Gd) memory device was found to possess electrical and neuromorphic multifunctionalities. To investigate the underlying switching mechanism of the device, its plasticity behaviour was studied by imposing weak programming conditions. In addition, a short-term to long-term memory transition analogous to the forgetting process in the human brain, which is regarded as a key biological synaptic function for information processing and data storage, was realized. Based on a careful examination of the device’s retention behaviour at elevated temperatures, the filamentary nature of switching in such devices can be understood from a new perspective.

  20. Manufacturing Demonstration Facility: Roll-to-Roll Processing

    Energy Technology Data Exchange (ETDEWEB)

    Datskos, Panos G [ORNL; Joshi, Pooran C [ORNL; List III, Frederick Alyious [ORNL; Duty, Chad E [ORNL; Armstrong, Beth L [ORNL; Ivanov, Ilia N [ORNL; Jacobs, Christopher B [ORNL; Graham, David E [ORNL; Moon, Ji Won [ORNL

    2015-08-01

    This Manufacturing Demonstration Facility (MDF)e roll-to-roll processing effort described in this report provided an excellent opportunity to investigate a number of advanced manufacturing approaches to achieve a path for low cost devices and sensors. Critical to this effort is the ability to deposit thin films at low temperatures using nanomaterials derived from nanofermentation. The overarching goal of this project was to develop roll-to-roll manufacturing processes of thin film deposition on low-cost flexible substrates for electronics and sensor applications. This project utilized ORNL s unique Pulse Thermal Processing (PTP) technologies coupled with non-vacuum low temperature deposition techniques, ORNL s clean room facility, slot dye coating, drop casting, spin coating, screen printing and several other equipment including a Dimatix ink jet printer and a large-scale Kyocera ink jet printer. The roll-to-roll processing project had three main tasks: 1) develop and demonstrate zinc-Zn based opto-electronic sensors using low cost nanoparticulate structures manufactured in a related MDF Project using nanofermentation techniques, 2) evaluate the use of silver based conductive inks developed by project partner NovaCentrix for electronic device fabrication, and 3) demonstrate a suite of low cost printed sensors developed using non-vacuum deposition techniques which involved the integration of metal and semiconductor layers to establish a diverse sensor platform technology.

  1. Design, Manufacturing and Characterization of Functionally Graded Flextensional Piezoelectric Actuators

    International Nuclear Information System (INIS)

    Amigo, R C R; Vatanabe, S L; Silva, E C N

    2013-01-01

    Previous works have been shown several advantages in using Functionally Graded Materials (FGMs) for the performance of flextensional devices, such as reduction of stress concentrations and gains in reliability. In this work, the FGM concept is explored in the design of graded devices by using the Topology Optimization Method (TOM), in order to determine optimal topologies and gradations of the coupled structures of piezoactuators. The graded pieces are manufactured by using the Spark Plasma Sintering (SPS) technique and are bonded to piezoelectric ceramics. The graded actuators are then tested by using a modular vibrometer system for measuring output displacements, in order to validate the numerical simulations. The technological path developed here represents the initial step toward the manufacturing of an integral piezoelectric device, constituted by piezoelectric and non-piezoelectric materials without bonding layers.

  2. 21 CFR 820.181 - Device master record.

    Science.gov (United States)

    2010-04-01

    ..., component specifications, and software specifications; (b) Production process specifications including the... DEVICES QUALITY SYSTEM REGULATION Records § 820.181 Device master record. Each manufacturer shall maintain... specifications; (c) Quality assurance procedures and specifications including acceptance criteria and the quality...

  3. Cooling high heat flux micro-electronic systems using refrigerants in high aspect ratio multi-microchannel evaporators

    International Nuclear Information System (INIS)

    Costa-Patry, E.

    2011-11-01

    Improving the energy efficiency of cooling systems can contribute to reduce the emission of greenhouse gases. Currently, most microelectronic applications are air-cooled. Switching to two-phase cooling systems would decrease power consumption and allow for the reuse of the extracted heat. For this type of application, multi-microchannel evaporators are thought to be well adapted. However, such devices have not been tested for a wide range of operating conditions, such that their thermal response to the high non-uniform power map typically generated by microelectronics has not been studied. This research project aims at clarifying these gray areas by investigating the behavior of the two-phase flow of different refrigerants in silicon and copper multi-microchannel evaporators under uniform, non-uniform and transient heat fluxes operating conditions. The test elements use as a heat source a pseudo-chip able to mimic the behavior of a CPU. It is formed by 35 independent sub-heaters, each having its own temperature sensor, such that 35 temperature and 35 heat flux measurements can be made simultaneously. Careful measurements of each pressure drop component (inlet, microchannels and outlet) found in the micro-evaporators showed the importance of the inlet and outlet restriction pressure losses. The overall pressure drop levels found in the copper test section were low enough to possibly be driven by a thermosyphon system. The heat transfer coefficients measured for uniform heat flux conditions were very high and typically followed a V-shape curve. The first branch was associated to the slug flow regime and the second to the annular flow regime. By tracking the minimum level of heat transfer, a transition criteria between the regimes was established, which included the effect of heat flux on the transition. Then for each branch, a different prediction method was used to form the first flow pattern-based prediction method for two-phase heat transfer in microchannels. A

  4. IP validation in remote microelectronics testing

    Science.gov (United States)

    Osseiran, Adam; Eshraghian, Kamran; Lachowicz, Stefan; Zhao, Xiaoli; Jeffery, Roger; Robins, Michael

    2004-03-01

    This paper presents the test and validation of FPGA based IP using the concept of remote testing. It demonstrates how a virtual tester environment based on a powerful, networked Integrated Circuit testing facility, aimed to complement the emerging Australian microelectronics based research and development, can be employed to perform the tasks beyond the standard IC test. IC testing in production consists in verifying the tested products and eliminating defective parts. Defects could have a number of different causes, including process defects, process migration and IP design and implementation errors. One of the challenges in semiconductor testing is that while current fault models are used to represent likely faults (stuck-at, delay, etc.) in a global context, they do not account for all possible defects. Research in this field keeps growing but the high cost of ATE is preventing a large community from accessing test and verification equipment to validate innovative IP designs. For these reasons a world class networked IC teletest facility has been established in Australia under the support of the Commonwealth government. The facility is based on a state-of-the-art semiconductor tester operating as a virtual centre spanning Australia and accessible internationally. Through a novel approach the teletest network provides virtual access to the tester on which the DUT has previously been placed. The tester software is then accessible as if the designer is sitting next to the tester. This paper presents the approach used to test and validate FPGA based IPs using this remote test approach.

  5. 10 CFR 32.61 - Ice detection devices containing strontium-90; requirements for license to manufacture or...

    Science.gov (United States)

    2010-01-01

    ...; requirements for license to manufacture or initially transfer. 32.61 Section 32.61 Energy NUCLEAR REGULATORY COMMISSION SPECIFIC DOMESTIC LICENSES TO MANUFACTURE OR TRANSFER CERTAIN ITEMS CONTAINING BYPRODUCT MATERIAL... manufacture or initially transfer. An application for a specific license to manufacture or initially transfer...

  6. Use of COTS microelectronics in radiation environments

    International Nuclear Information System (INIS)

    Winokur, P.S.; Lum, G.K.; Shaneyfelt, M.R.; Sexton, F.W.; Hash, G.L.; Scott, L.

    1999-01-01

    This paper addresses key issues for the cost-effective use of COTS (Commercially available Off The Shelf) microelectronics in radiation environments that enable circuit or system designers to manage risks and ensure mission success. They review several factors and tradeoffs affecting the successful application of COTS parts including (1) hardness assurance and qualification issues, (2) system hardening techniques, and (3) life-cycle costs. The paper also describes several experimental studies that address trends in total-dose, transient, and single-event radiation hardness as COTS technology scales to smaller feature sizes. As an example, the level at which dose-rate upset occurs in Samsung SRAMs increases from 1.4 x 10 8 rad(Si)/s for a 256K SRAM to 7.7 x 10 9 rad(Si)/s for a 4M SRAM, indicating unintentional hardening improvements in the design of process of a commercial technology. Additional experiments were performed to quantify variations in radiation hardness for COTS parts. In one study, only small (10--15%) variations were found in the dose-rate upset and latchup thresholds for Samsung 4M SRAMs from three different date codes. In another study, irradiations of 4M SRAMs from Samsung, Hitachi, and Toshiba indicate large differences in total-dose radiation hardness. The paper attempts to carefully define terms and clear up misunderstandings about the definitions of COTS and radiation-hardened (RH) technology

  7. A biosensor device and a method of manufacturing the same

    NARCIS (Netherlands)

    2017-01-01

    A biosensor device (100) for detecting biological particles, the biosensor device (100) comprising a substrate (102), a regular pattern of pores (104) formed in the substrate (102), and a plurality of sensor active structures (106) each of which being arranged on a surface of a corresponding one of

  8. A biosensor device and a method of manufacturing the same

    NARCIS (Netherlands)

    2009-01-01

    A biosensor device (100) for detecting biological particles, the biosensor device (100) comprising a substrate (102), a regular pattern of pores (104) formed in the substrate (102), and a plurality of sensor active structures (106) each of which being arranged on a surface of a corresponding one of

  9. Securing IoT Devices at CERN

    CERN Multimedia

    CERN. Geneva

    2018-01-01

    CERN has more than 1000 Internet of Things (IoT) devices, which are connected to the office network. We have been doing the research to find all vulnerable IoT devices in CERN and mitigated them. We are currently working on detecting IoT devices automatically and, moreover, identifying the manufacturer, model and the running firmware version. This will help the CERN Computer Security Team to spot vulnerable devices and to show the security risks associated with them.

  10. 21 CFR 820.120 - Device labeling.

    Science.gov (United States)

    2010-04-01

    ... designed to prevent mixups. (d) Labeling operations. Each manufacturer shall control labeling and packaging... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device labeling. 820.120 Section 820.120 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES...

  11. Radiation protection measurements in nuclear engineering. The use of microelectronics is only just beginning

    International Nuclear Information System (INIS)

    Maushart, R.

    1986-01-01

    The progress achieved by microelectronics is impressive already now, but it is only a beginning. The contribution deals with the modern methods of representing measured data and with the processing of measured data as the optimum area of use of microprocessors. It outlines the uses of personnel dosimeters and portable dose rate meters, portable units with data storage capacity, new possibilities in monitoring the room air in large building complexes, gamma spectroscopy with very high purity germanium detectors, equivalent dose measurement with multichannel data evaluation, 'talking' equipment, and it also presents a forecast of future radiation protection measuring equipment. (orig.) [de

  12. Microelectronics in Japan

    Science.gov (United States)

    Boulton, William R.

    1995-02-01

    The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

  13. PERFORMANCE EVALUATION OF TYPE I MARINE SANITATION DEVICES

    Science.gov (United States)

    This performance test was designed to evaluate the effectiveness of two Type I Marine Sanitation Devices (MSDs): the Electro Scan Model EST 12, manufactured by Raritan Engineering Company, Inc., and the Thermopure-2, manufactured by Gross Mechanical Laboratories, Inc. Performance...

  14. Laser Applications in Microelectronic and Optoelectronic Manufacturing IV

    Science.gov (United States)

    1999-07-15

    coordination. It might operate as a companion to a much larger satellite like the Space Shuttle or International Space Station. Such a unit would... Sistemas , E.U.I.T.Telecomunicacion, UPM, Ctra.de Valencia km7.5, 28031 Madrid, Spain ABSTRACT Nanocomposite thin films formed by metal or semiconductor

  15. Modelling energy consumption in a manufacturing plant using productivity KPIs

    Energy Technology Data Exchange (ETDEWEB)

    Gallachoir, Brian O.; Cahill, Caiman (Sustainable Energy Research Group, Dept. of Civil and Environmental Engineering, Univ. College Cork (Ireland))

    2009-07-01

    Energy efficiency initiatives in industrial plants are often focused on getting energy-consuming utilities and devices to operate more efficiently, or on conserving energy. While such device-oriented energy efficiency measures can achieve considerable savings, greater energy efficiency improvement may be achieved by improving the overall productivity and quality of manufacturing processes. The paper highlights the observed relationship between productivity and energy efficiency using aggregated data on unit consumption and production index data for Irish industry. Past studies have developed simple top-down models of final energy consumption in manufacturing plants using energy consumption and production output figures, but these models do not help identify opportunities for energy savings that could achieved through increased productivity. This paper proposes an improved and innovative method of modelling plant final energy demand that introduces standard productivity Key Performance Indicators (KPIs) into the model. The model demonstrates the relationship between energy consumption and productivity, and uses standard productivity metrics to identify the areas of manufacturing activity that offer the most potential for improved energy efficiency. The model provides a means of comparing the effect of device-oriented energy efficiency measures with the potential for improved energy efficiency through increased productivity.

  16. A glossary of electronics and microelectronics

    International Nuclear Information System (INIS)

    Sautter, D.; Weinerth, H.

    1990-01-01

    The glossary presents terms, definitions and full-text explanations of terminology used in the following subject fields: semiconductor technology, integrated analog and digital semiconductor devices and group of devices, discrete devices including power semiconductors, electronic tubes, electronic display or read-out systems (cathode-ray tubes, liquid crystals, luminescence diodes, plasma- and magneto-optical display devices), sensors, opto-electronics (lasers, integrated optical systems, glass fibre technology, opto-electronic switches), design and circuitry, electromechanical devices; and also terminology from the fields of: solid state physics, acoustics, technical reliability, measuring and testing, entertainment electronics, electrical and magnetic materials, electronic image recording and image processing. There are over 2000 terms and corresponding explanations in the glossary, supplemented by numerous functional diagrams, tables, and figures. (orig./HP) [de

  17. Japanese technology assessment: Computer science, opto- and microelectronics mechatronics, biotechnology

    Energy Technology Data Exchange (ETDEWEB)

    Brandin, D.; Wieder, H.; Spicer, W.; Nevins, J.; Oxender, D.

    1986-01-01

    The series studies Japanese research and development in four high-technology areas - computer science, opto and microelectronics, mechatronics (a term created by the Japanese to describe the union of mechanical and electronic engineering to produce the next generation of machines, robots, and the like), and biotechnology. The evaluations were conducted by panels of U.S. scientists - chosen from academia, government, and industry - actively involved in research in areas of expertise. The studies were prepared for the purpose of aiding the U.S. response to Japan's technological challenge. The main focus of the assessments is on the current status and long-term direction and emphasis of Japanese research and development. Other aspects covered include evolution of the state of the art; identification of Japanese researchers, R and D organizations, and resources; and comparative U.S. efforts. The general time frame of the studies corresponds to future industrial applications and potential commercial impacts spanning approximately the next two decades.

  18. Process Development for Nanostructured Photovoltaics

    Energy Technology Data Exchange (ETDEWEB)

    Elam, Jeffrey W.

    2015-01-01

    Photovoltaic manufacturing is an emerging industry that promises a carbon-free, nearly limitless source of energy for our nation. However, the high-temperature manufacturing processes used for conventional silicon-based photovoltaics are extremely energy-intensive and expensive. This high cost imposes a critical barrier to the widespread implementation of photovoltaic technology. Argonne National Laboratory and its partners recently invented new methods for manufacturing nanostructured photovoltaic devices that allow dramatic savings in materials, process energy, and cost. These methods are based on atomic layer deposition, a thin film synthesis technique that has been commercialized for the mass production of semiconductor microelectronics. The goal of this project was to develop these low-cost fabrication methods for the high efficiency production of nanostructured photovoltaics, and to demonstrate these methods in solar cell manufacturing. We achieved this goal in two ways: 1) we demonstrated the benefits of these coatings in the laboratory by scaling-up the fabrication of low-cost dye sensitized solar cells; 2) we used our coating technology to reduce the manufacturing cost of solar cells under development by our industrial partners.

  19. Preliminary Flight Results of the Microelectronics and Photonics Test Bed: NASA DR1773 Fiber Optic Data Bus Experiment

    Science.gov (United States)

    Jackson, George L.; LaBel, Kenneth A.; Marshall, Cheryl; Barth, Janet; Seidleck, Christina; Marshall, Paul

    1998-01-01

    NASA Goddard Spare Flight Center's (GSFC) Dual Rate 1773 (DR1773) Experiment on the Microelectronic and Photonic Test Bed (MPTB) has provided valuable information on the performance of the AS 1773 fiber optic data bus in the space radiation environment. Correlation of preliminary experiment data to ground based radiation test results show the AS 1773 bus is employable in future spacecraft applications requiring radiation tolerant communication links.

  20. Radiation effects on custom MOS devices

    International Nuclear Information System (INIS)

    Harris, R.

    1999-05-01

    This Thesis consists of four chapters: The first is primarily for background information on the effects of radiation on MOS devices and the theory of wafer bonding; the second gives a full discussion of all practical work carried out for manufacture of Field Effect test Capacitors, the third discusses manufacture of vacuum insulator Field Effect Transistors (FET's) and the fourth discusses the testing of these devices. Using a thermally bonded field effect capacitor structure, a vacuum dielectric was studied for use in high radiation environments with a view to manufacturing a CMOS compatible, micro machined transistor. Results are given in the form of high frequency C-V curves before and after a 120 kGy(Si), 12 MRad(Si), dose from a Co 60 source showing a 1 Volt shift. The work is then extended to the design and manufacture of a micro machined, under-etch technique, Field Effect Transistor for use in high radiation areas. Results are shown for Threshold, Subthreshold and Transfer characteristics before and after irradiation up to a total dose of 100kGy or 10MRad. The conclusion from this work is that it should be possible to commercially manufacture practical vacuum dielectric field effect transistors which are radiation hard to at least 120 kGy(Si). (author)

  1. Manufacturing of the ISO 25178-70 material measures with direct laser writing: a feasibility study

    Science.gov (United States)

    Eifler, M.; Hering, J.; von Freymann, G.; Seewig, J.

    2018-06-01

    The standard ISO 25178-70 defines material measures for the calibration of 2D- and 3D-topography measurement devices. Some of the suggested material measures are established within the industrial application for a long time while others have not yet been extensively researched regarding their practical abilities. This paper describes a holistic and systematic investigation of the ISO 25178-70 material measures. The manufacturing of the suggested geometries is executed with two-photon laser lithography, alias direct laser writing (DLW). Since this manufacturing process is not yet frequently used in a material measures context, it is examined regarding its suitability for the fabrication of the ISO 25178-70 material measures. With DLW, it is possible to manufacture multiple material measures on one sample in order to enable a comprehensive calibration of optical topography measurement devices. The manufactured ISO 25178-70 geometries are examined using different 3D-topography measuring devices. In doing so, their abilities regarding the calibration of the devices can be evaluated and the practical feasibility of their industrial application is assessed. For the review of this practical usefulness, varying calibration and evaluation strategies are taken into account.

  2. Survey on the virtual commissioning of manufacturing systems

    Directory of Open Access Journals (Sweden)

    Chi G. Lee

    2014-07-01

    Full Text Available This paper reviews and identifies issues in the application of virtual commissioning technology for automated manufacturing systems. While the real commissioning of a manufacturing system involves a real plant system and a real controller, the virtual commissioning deals with a virtual plant model and a real controller. The expected benefits of virtual commissioning are the reduction of debugging and correction efforts during the subsequent real commissioning stage. However, it requires a virtual plant model and hence still requires significant amount time and efforts. Two main issues are identified, the physical model construction of a virtual device, and the logical model construction of a virtual device. This paper reviews the current literature related to the two issues and proposes future research directions to achieve the full utilization of virtual commissioning technology.

  3. Lithography-based ceramic manufacture (LCM) of auxetic structures: present capabilities and challenges

    International Nuclear Information System (INIS)

    Lantada, Andrés Díaz; De Blas Romero, Adrián; Schwentenwein, Martin; Jellinek, Christopher; Homa, Johannes

    2016-01-01

    Auxetic metamaterials are known for having a negative Poisson’s ratio (NPR) and for displaying the unexpected properties of lateral expansion when stretched and densification when compressed. Even though a wide set of micro-manufacturing resources have been used for the development of auxetic metamaterials and related devices, additional precision and an extension to other families of materials is needed for their industrial expansion. In addition, their manufacture using ceramic materials is still challenging. In this study we present a very promising approach for the development of auxetic metamaterials and devices based on the use of lithography-based ceramic manufacturing. The process stands out for its precision and complex three-dimensional geometries attainable, without the need of supporting structures, and for enabling the manufacture of ceramic auxetics with their geometry controlled from the design stage with micrometric precision. To our knowledge it represents the first example of application of this technology to the manufacture of auxetic geometries using ceramic materials. We have used a special three-dimensional auxetic design whose remarkable NPR has been previously highlighted. (paper)

  4. Manufacture of the second core of Rapsodie - Type 2 A - Fortissimo version

    International Nuclear Information System (INIS)

    Mandicourt, Louis

    1977-11-01

    This report concerns the fuel manufacturing of the second core of RAPSODIE reactor 2 A type, FORTISSIMO version. This fuel is a mixed oxide of Plutonium and highly enriched Uranium. The manufacturing facility which is used, set starting from 1969, is essentially designed for the production of fuels with high percentage of fissile material. It includes devices having been used to produce the first RAPSODIE fuel and new machines resulting from technological improvements obtained during previous manufactures. The manufacturing process is described after a recall fuel physical characteristics. A final quantitative balance for the whole fabrication is presented. The results obtained on fuel pellets and pins are discussed with starting from the fabrication process and the changes which may have occured or arised from the use of different devices. A more theoretical approach of some particular problems is presented: the multiphasage, the amount of oxygen and the porosities. A general conclusion is given on the main theoretical and technical problems met up to now on the manufacture of nuclear fuel of this type. [fr

  5. Semiconductor device and method of manufacturing the same

    NARCIS (Netherlands)

    2009-01-01

    The invention relates to a semiconductor device (10) with a semiconductor body (12) comprising a bipolar transistor with an emitter region, a base region and a collector region (1, 2, 3) of, respectively, a first conductivity type, a second conductivity type opposite to the first conductivity type,

  6. Semiconductor sensor device, diagnostic instrument comprising such a device and method of manufacturing such a device

    NARCIS (Netherlands)

    2010-01-01

    The invention relates to a semiconductor sensor device (10) for sensing a substance comprising at least one mesa- shaped semiconductor region (11) which is formed on a surface of a semiconductor body (12) and which is connected at a first end to a first electrically conducting connection region (13)

  7. Tritium removal and retention device

    International Nuclear Information System (INIS)

    Boyle, R.F.; Durigon, D.D.

    1980-01-01

    A device is provided for removing and retaining tritium from a gaseous medium, and also a method of manufacturing the device. The device, consists of an inner core of zirconium alloy, preferably Zircaloy-4, and an outer adherent layer of nickel which acts as a selective and protective window for passage of tritium. The tritium then reacts with or is absorbed by the zirconium alloy, and is retained until such time as it is desirable to remove it during reprocessing. (auth)

  8. Fabrication of polyimide based microfluidic channels for biosensor devices

    Science.gov (United States)

    Zulfiqar, Azeem; Pfreundt, Andrea; Svendsen, Winnie Edith; Dimaki, Maria

    2015-03-01

    The ever-increasing complexity of the fabrication process of Point-of-care (POC) devices, due to high demand of functional versatility, compact size and ease-of-use, emphasizes the need of multifunctional materials that can be used to simplify this process. Polymers, currently in use for the fabrication of the often needed microfluidic channels, have limitations in terms of their physicochemical properties. Therefore, the use of a multipurpose biocompatible material with better resistance to the chemical, thermal and electrical environment, along with capability of forming closed channel microfluidics is inevitable. This paper demonstrates a novel technique of fabricating microfluidic devices using polyimide (PI) which fulfills the aforementioned properties criteria. A fabrication process to pattern microfluidic channels, using partially cured PI, has been developed by using a dry etching method. The etching parameters are optimized and compared to those used for fully cured PI. Moreover, the formation of closed microfluidic channel on wafer level by bonding two partially cured PI layers or a partially cured PI to glass with high bond strength has been demonstrated. The reproducibility in uniformity of PI is also compared to the most commonly used SU8 polymer, which is a near UV sensitive epoxy resin. The potential applications of PI processing are POC and biosensor devices integrated with microelectronics.

  9. BioInnovate Ireland--fostering entrepreneurial activity through medical device innovation training.

    Science.gov (United States)

    Bruzzi, M S; Linehan, J H

    2013-09-01

    In the midst of a rich environment for medical device development and manufacturing, universities can play a critical role by developing relevant training programs to produce entrepreneurs who can be efficient and successful in creating early stage companies by understanding deeply the issues involved in creating a useful device, how to raise money, designing early clinical studies and locating manufacturing partners.

  10. Humidification performance of 48 passive airway humidifiers: comparison with manufacturer data.

    Science.gov (United States)

    Lellouche, François; Taillé, Solenne; Lefrançois, Frédéric; Deye, Nicolas; Maggiore, Salvatore Maurizio; Jouvet, Philippe; Ricard, Jean-Damien; Fumagalli, Bruno; Brochard, Laurent

    2009-02-01

    Heat and moisture exchangers (HMEs) are increasingly used in the ICU for gas conditioning during mechanical ventilation. Independent assessments of the humidification performance of HMEs are scarce. The aim of the present study was thus to assess the humidification performance of a large number of adult HMEs. We assessed 48 devices using a bench test apparatus that simulated real-life physiologic ventilation conditions. Thirty-two devices were described by the manufacturers as HMEs, and 16 were described as antibacterial filters. The test apparatus provided expiratory gases with an absolute humidity (AH) of 35 mg H(2)O/L. The AH of inspired gases was measured after steady state using the psychrometric method. We performed three hygrometric measurements for each device, measured their resistance, and compared our results with the manufacturer data. Of the 32 HMEs tested, only 37.5% performed well (>or= 30 mg H(2)O/L), while 25% performed poorly ( 4 mg H(2)O/L. The mean difference for the antibacterial filters was 0.2 +/- 1.4 mg H(2)O/L. The mean resistance of all the tested devices was 2.17 +/- 0.70 cm H(2)O/L/s. Several HMEs performed poorly and should not be used as HMEs. The values determined by independent assessments may be lower than the manufacturer data. Describing a device as an HME does not guarantee that it provides adequate humidification. The performance of HMEs must be verified by independent assessment.

  11. Listening to Brain Microcircuits for Interfacing With External World-Progress in Wireless Implantable Microelectronic Neuroengineering Devices: Experimental systems are described for electrical recording in the brain using multiple microelectrodes and short range implantable or wearable broadcasting units.

    Science.gov (United States)

    Nurmikko, Arto V; Donoghue, John P; Hochberg, Leigh R; Patterson, William R; Song, Yoon-Kyu; Bull, Christopher W; Borton, David A; Laiwalla, Farah; Park, Sunmee; Ming, Yin; Aceros, Juan

    2010-01-01

    Acquiring neural signals at high spatial and temporal resolution directly from brain microcircuits and decoding their activity to interpret commands and/or prior planning activity, such as motion of an arm or a leg, is a prime goal of modern neurotechnology. Its practical aims include assistive devices for subjects whose normal neural information pathways are not functioning due to physical damage or disease. On the fundamental side, researchers are striving to decipher the code of multiple neural microcircuits which collectively make up nature's amazing computing machine, the brain. By implanting biocompatible neural sensor probes directly into the brain, in the form of microelectrode arrays, it is now possible to extract information from interacting populations of neural cells with spatial and temporal resolution at the single cell level. With parallel advances in application of statistical and mathematical techniques tools for deciphering the neural code, extracted populations or correlated neurons, significant understanding has been achieved of those brain commands that control, e.g., the motion of an arm in a primate (monkey or a human subject). These developments are accelerating the work on neural prosthetics where brain derived signals may be employed to bypass, e.g., an injured spinal cord. One key element in achieving the goals for practical and versatile neural prostheses is the development of fully implantable wireless microelectronic "brain-interfaces" within the body, a point of special emphasis of this paper.

  12. Non-logic devices in logic processes

    CERN Document Server

    Ma, Yanjun

    2017-01-01

    This book shows readers how to design semiconductor devices using the most common and lowest cost logic CMOS processes.  Readers will benefit from the author’s extensive, industrial experience and the practical approach he describes for designing efficiently semiconductor devices that typically have to be implemented using specialized processes that are expensive, time-consuming, and low-yield. The author presents an integrated picture of semiconductor device physics and manufacturing techniques, as well as numerous practical examples of device designs that are tried and true.

  13. Australian national networked tele-test facility for integrated systems

    Science.gov (United States)

    Eshraghian, Kamran; Lachowicz, Stefan W.; Eshraghian, Sholeh

    2001-11-01

    The Australian Commonwealth government recently announced a grant of 4.75 million as part of a 13.5 million program to establish a world class networked IC tele-test facility in Australia. The facility will be based on a state-of-the-art semiconductor tester located at Edith Cowan University in Perth that will operate as a virtual centre spanning Australia. Satellite nodes will be located at the University of Western Australia, Griffith University, Macquarie University, Victoria University and the University of Adelaide. The facility will provide vital equipment to take Australia to the frontier of critically important and expanding fields in microelectronics research and development. The tele-test network will provide state of the art environment for the electronics and microelectronics research and the industry community around Australia to test and prototype Very Large Scale Integrated (VLSI) circuits and other System On a Chip (SOC) devices, prior to moving to the manufacturing stage. Such testing is absolutely essential to ensure that the device performs to specification. This paper presents the current context in which the testing facility is being established, the methodologies behind the integration of design and test strategies and the target shape of the tele-testing Facility.

  14. Method and device for controlling radiation

    International Nuclear Information System (INIS)

    Wilhelm, G.M.

    1979-01-01

    A device which will control radiation emanating from colour television sets is described. It consists of two transparent plates the same size as a television screen, with a thin layer of transparent mineral oil sealed between them. The device may be installed by the manufacturer or bought separately and installed by the user. (LL)

  15. A guide for approval of nuclear gauging devices

    International Nuclear Information System (INIS)

    1990-01-01

    This guide has been written to assist manufacturers, distributors and users of nuclear gauging devices in the preparation of a submission to the Atomic Energy Control Board in support of a request for approval of a nuclear gauging device

  16. Displacement Damage Effects in Solar Cells: Mining Damage From the Microelectronics and Photonics Test Bed Space Experiment

    Science.gov (United States)

    Hardage, Donna (Technical Monitor); Walters, R. J.; Morton, T. L.; Messenger, S. R.

    2004-01-01

    The objective is to develop an improved space solar cell radiation response analysis capability and to produce a computer modeling tool which implements the analysis. This was accomplished through analysis of solar cell flight data taken on the Microelectronics and Photonics Test Bed experiment. This effort specifically addresses issues related to rapid technological change in the area of solar cells for space applications in order to enhance system performance, decrease risk, and reduce cost for future missions.

  17. Efficient thin-film stack characterization using parametric sensitivity analysis for spectroscopic ellipsometry in semiconductor device fabrication

    International Nuclear Information System (INIS)

    Likhachev, D.V.

    2015-01-01

    During semiconductor device fabrication, control of the layer thicknesses is an important task for in-line metrology since the correct thickness values are essential for proper device performance. At the present time, ellipsometry is widely used for routine process monitoring and process improvement as well as characterization of various materials in the modern nanoelectronic manufacturing. The wide recognition of this technique is based on its non-invasive, non-intrusive and non-destructive nature, high measurement precision, accuracy and speed, and versatility to characterize practically all types of materials used in modern semiconductor industry (dielectrics, semiconductors, metals, polymers, etc.). However, it requires the use of one of the multi-parameter non-linear optimization methods due to its indirect nature. This fact creates a big challenge for analysis of multilayered structures since the number of simultaneously determined model parameters, for instance, thin film thicknesses and model variables related to film optical properties, should be restricted due to parameter cross-correlations. In this paper, we use parametric sensitivity analysis to evaluate the importance of various model parameters and to suggest their optimal search ranges. In this work, the method is applied practically for analysis of a few structures with up to five-layered film stack. It demonstrates an evidence-based improvement in accuracy of multilayered thin-film thickness measurements which suggests that the proposed approach can be useful for industrial applications. - Highlights: • An improved method for multilayered thin-film stack characterization is proposed. • The screening-type technique based on so-called “elementary effects” was employed. • The model parameters were ranked according to relative importance for model output. • The method is tested using two examples of complex thin-film stack characterization. • The approach can be useful in many practical

  18. Efficient thin-film stack characterization using parametric sensitivity analysis for spectroscopic ellipsometry in semiconductor device fabrication

    Energy Technology Data Exchange (ETDEWEB)

    Likhachev, D.V., E-mail: dmitriy.likhachev@globalfoundries.com

    2015-08-31

    During semiconductor device fabrication, control of the layer thicknesses is an important task for in-line metrology since the correct thickness values are essential for proper device performance. At the present time, ellipsometry is widely used for routine process monitoring and process improvement as well as characterization of various materials in the modern nanoelectronic manufacturing. The wide recognition of this technique is based on its non-invasive, non-intrusive and non-destructive nature, high measurement precision, accuracy and speed, and versatility to characterize practically all types of materials used in modern semiconductor industry (dielectrics, semiconductors, metals, polymers, etc.). However, it requires the use of one of the multi-parameter non-linear optimization methods due to its indirect nature. This fact creates a big challenge for analysis of multilayered structures since the number of simultaneously determined model parameters, for instance, thin film thicknesses and model variables related to film optical properties, should be restricted due to parameter cross-correlations. In this paper, we use parametric sensitivity analysis to evaluate the importance of various model parameters and to suggest their optimal search ranges. In this work, the method is applied practically for analysis of a few structures with up to five-layered film stack. It demonstrates an evidence-based improvement in accuracy of multilayered thin-film thickness measurements which suggests that the proposed approach can be useful for industrial applications. - Highlights: • An improved method for multilayered thin-film stack characterization is proposed. • The screening-type technique based on so-called “elementary effects” was employed. • The model parameters were ranked according to relative importance for model output. • The method is tested using two examples of complex thin-film stack characterization. • The approach can be useful in many practical

  19. Additive manufacturing of lab-on-a-chip devices: promises and challenges

    Science.gov (United States)

    Zhu, Feng; Macdonald, Niall P.; Cooper, Jonathan M.; Wlodkowic, Donald

    2013-12-01

    This work describes a preliminary investigation of commercially available 3D printing technologies for rapid prototyping and low volume fabrication of Lab-on-a-Chip devices. The main motivation of the work was to use off-the-shelf 3D printing methods in order to rapidly and inexpensively build microfluidic devices with complex geometric features and reduce the need to use clear room environment and conventional microfabrication techniques. Both multi-jet modelling (MJM) and stereolithography (SLA) processes were explored. MJM printed devices were fabricated using a HD3500+ (3D Systems) high-definition printer using a thermo-polymer VisiJet Crystal (3D Systems) substratum that allows for a z-axis resolution of 16 μm and 25 μm x-y accuracy. SLA printed devices were produced using a Viper Pro (3D Systems) stereolithography system using Watershed 11122XC (DSM Somos) and Dreve Fototec 7150 Clear (Dreve Otoplastik GmbH) resins which allow for a z-axis resolution of 50 μm and 25 μm x-y accuracy. Fabrication results compared favourably with other forms of rapid prototyping such as laser cut PMMA devices and PDMS moulded microfluidic devices of the same design. Both processes allowed for fabrication of monolithic, optically transparent devices with features in the 100 μm range requiring minimal post-processing. Optical polymer qualities following different post-processing methods were also tested in both brightfield and fluorescence imaging of transgenic zebrafish embryos. Finally, we show that only ethanol-treated Dreve Fototec 7150 Clear resign proved to be non-toxic to human cell lines and fish embryos in fish toxicity assays (FET) requiring further investigation of 3D printing materials.

  20. Materials, Processes, and Facile Manufacturing for Bioresorbable Electronics: A Review.

    Science.gov (United States)

    Yu, Xiaowei; Shou, Wan; Mahajan, Bikram K; Huang, Xian; Pan, Heng

    2018-05-07

    Bioresorbable electronics refer to a new class of advanced electronics that can completely dissolve or disintegrate with environmentally and biologically benign byproducts in water and biofluids. They have provided a solution to the growing electronic waste problem with applications in temporary usage of electronics such as implantable devices and environmental sensors. Bioresorbable materials such as biodegradable polymers, dissolvable conductors, semiconductors, and dielectrics are extensively studied, enabling massive progress of bioresorbable electronic devices. Processing and patterning of these materials are predominantly relying on vacuum-based fabrication methods so far. However, for the purpose of commercialization, nonvacuum, low-cost, and facile manufacturing/printing approaches are the need of the hour. Bioresorbable electronic materials are generally more chemically reactive than conventional electronic materials, which require particular attention in developing the low-cost manufacturing processes in ambient environment. This review focuses on material reactivity, ink availability, printability, and process compatibility for facile manufacturing of bioresorbable electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  1. Fenestrated endovascular aortic aneurysm repair using physician-modified endovascular grafts versus company-manufactured devices.

    Science.gov (United States)

    Dossabhoy, Shernaz S; Simons, Jessica P; Flahive, Julie M; Aiello, Francesco A; Sheth, Parth; Arous, Edward J; Messina, Louis M; Schanzer, Andres

    2017-12-07

    Fenestrated endografts are customized, patient-specific endovascular devices with potential to reduce morbidity and mortality of complex aortic aneurysm repair. With approval from the U.S. Food and Drug Administration, our center began performing fenestrated endovascular aneurysm repair through a physician-sponsored investigational device exemption (IDE #G130210), using both physician-modified endografts (PMEGs) and company-manufactured devices (CMDs). Because these techniques are associated with specific advantages and disadvantages, we sought to investigate differences in outcomes between PMEG and CMD cases. A single-institution retrospective review of all fenestrated endovascular aneurysm repairs was performed. The cohort was analyzed by device type (PMEG or CMD) after matching of cases on the basis of (1) number of target vessels intended for treatment, (2) extent of aneurysm, (3) aneurysm diameter, (4) device configuration, and (5) date of operation. Outcomes of ruptures, common iliac artery aneurysms, and aortic arch aneurysms were excluded. Demographics, operative details, perioperative complications, length of stay, and reinterventions were compared. For patients with >1 year of follow-up time, survival, type I or type III endoleak rate, target artery patency, and reintervention rate were estimated using the Kaplan-Meier method. Between November 30, 2010, and July 30, 2016, 82 patients were identified and matched. The cohort included 41 PMEG and 41 CMD patients who underwent repair of 38 juxtarenal (PMEG, 17; CMD, 21; P = .38), 14 pararenal (PMEG, 6; CMD, 8; P = .56), and 30 thoracoabdominal type I to type IV (PMEG, 18; CMD, 12; P = .17) aneurysms. There were significant differences in presentation requiring urgent aneurysm repair (PMEG, 9; CMD, 0; P = .002), total fluoroscopy time (PMEG, 76 minutes; CMD, 61 minutes; P = .02), volume of contrast material used (PMEG, 88 mL; CMD, 70 mL; P = .02), in-operating room to out-of-operating room time

  2. Thermosonic wire bonding of IC devices using palladium wire

    International Nuclear Information System (INIS)

    Shze, J.H.; Poh, M.T.; Tan, R.M.

    1996-01-01

    The feasibility of replacing gold wire by palladium wire in thermosonic wire bonding of CMOS and bipolar devices are studied in terms of the manufacturability, physical, electrical and assembly performance. The results that palladium wire is a viable option for bonding the bipolar devices but not the CMOS devices

  3. 21 CFR 864.9205 - Blood and plasma warming device.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Blood and plasma warming device. 864.9205 Section 864.9205 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES HEMATOLOGY AND PATHOLOGY DEVICES Products Used In Establishments That Manufacture...

  4. Position measuring device

    International Nuclear Information System (INIS)

    Maeda, Kazuyuki; Takahashi, Shuichi; Maruyama, Mayumi

    1998-01-01

    The present invention provides a device capable of measuring accurate position and distance easily even at places where operator can not easily access, such as cell facilities for vitrifying radioactive wastes. Referring to a case of the vitrifying cell, an objective equipment settled in the cell is photographed by a photographing device. The image is stored in a position measuring device by way of an image input device. After several years, when the objective equipment is exchanged, a new objective equipment is photographed by a photographing device. The image is also stored in the position measuring device. The position measuring device compares the data of both of the images on the basis of pixel unit. Based on the image of the equipment before the exchange as a reference, extent of the displacement of the installation position of the equipment on the image after the exchange caused by installation error and manufacturing error is determined to decide the position of the equipment after exchange relative to the equipment before exchange. (I.S.)

  5. Methods for validating the performance of wearable motion-sensing devices under controlled conditions

    International Nuclear Information System (INIS)

    Bliley, Kara E; Kaufman, Kenton R; Gilbert, Barry K

    2009-01-01

    This paper presents validation methods for assessing the accuracy and precision of motion-sensing device (i.e. accelerometer) measurements. The main goals of this paper were to assess the accuracy and precision of these measurements against a gold standard, to determine if differences in manufacturing and assembly significantly affected device performance and to determine if measurement differences due to manufacturing and assembly could be corrected by applying certain post-processing techniques to the measurement data during analysis. In this paper, the validation of a posture and activity detector (PAD), a device containing a tri-axial accelerometer, is described. Validation of the PAD devices required the design of two test fixtures: a test fixture to position the device in a known orientation, and a test fixture to rotate the device at known velocities and accelerations. Device measurements were compared to these known orientations and accelerations. Several post-processing techniques were utilized in an attempt to reduce variability in the measurement error among the devices. In conclusion, some of the measurement errors due to the inevitable differences in manufacturing and assembly were significantly improved (p < 0.01) by these post-processing techniques

  6. Consumable core for manufacture of composite articles and related method

    Science.gov (United States)

    Taxacher, Glenn Curtis; de Diego, Peter; Gray, Paul Edward; Monaghan, Philip Harold

    2017-09-05

    Systems, methods and devices adapted to ease manufacture of composite articles (e.g., ceramic composite articles), particularly composite articles which include a hollow feature are disclosed. In one embodiment, a system includes: a consumable core formed to be disposed within an inner portion of a composite precursor, the consumable core adapted to convert into an infiltrant during a manufacturing process and infiltrate the composite precursor.

  7. Materialienbände zum Buch Mikroelektronik im Umweltschutz. Ergebnisse der Studie "Beitrag der Mikroelektronik zum Umweltschutz". In 6 Bänden

    OpenAIRE

    Angerer, G.; Hiessl, H.

    1991-01-01

    An effective and realizable environmental policy is dependent not only on the responsible behavior of each individual, but also on technological innovations. The study shows how the use of microelectronics supports this innovation process. The supplements show comprehensively the twenty-five areas of application for environmental microelectronics were analysed, including twelve manufacturing industries, combustion plants, industrial waste incineration, road traffic, household machines, agricu...

  8. Medical device software: defining key terms.

    Science.gov (United States)

    Pashkov, Vitalii; Gutorova, Nataliya; Harkusha, Andrii

    one of the areas of significant growth in medical devices has been the role of software - as an integral component of a medical device, as a standalone device and more recently as applications on mobile devices. The risk related to a malfunction of the standalone software used within healthcare is in itself not a criterion for its qualification or not as a medical device. It is therefore, necessary to clarify some criteria for the qualification of stand-alone software as medical devices Materials and methods: Ukrainian, European Union, United States of America legislation, Guidelines developed by European Commission and Food and Drug Administration's, recommendations represented by international voluntary group and scientific works. This article is based on dialectical, comparative, analytic, synthetic and comprehensive research methods. the legal regulation of software which is used for medical purpose in Ukraine limited to one definition. In European Union and United States of America were developed and applying special guidelines that help developers, manufactures and end users to difference software on types standing on medical purpose criteria. Software becomes more and more incorporated into medical devices. Developers and manufacturers may not have initially appreciated potential risks to patients and users such situation could have dangerous results for patients or users. It is necessary to develop and adopt the legislation that will intend to define the criteria for the qualification of medical device software and the application of the classification criteria to such software, provide some illustrative examples and step by step recommendations to qualify software as medical device.

  9. The Frontiers of Additive Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Grote, Christopher John [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-03-03

    Additive manufacturing, more commonly known as 3-D printing, has become a ubiquitous tool in science for its precise control over mechanical design. For additive manufacturing to work, a 3-D structure is split into thin 2D slices, and then different physical properties, such as photo-polymerization or melting, are used to grow the sequential layers. The level of control allows not only for devices to be made with a variety of materials: e.g. plastics, metals, and quantum dots, but to also have finely controlled structures leading to other novel properties. While 3-D printing is widely used by hobbyists for making models, it also has industrial applications in structural engineering, biological tissue scaffolding, customized electric circuitry, fuel cells, security, and more.

  10. Proceedings of the Goddard Space Flight Center Workshop on Robotics for Commercial Microelectronic Processes in Space

    Science.gov (United States)

    1987-01-01

    Potential applications of robots for cost effective commercial microelectronic processes in space were studied and the associated robotic requirements were defined. Potential space application areas include advanced materials processing, bulk crystal growth, and epitaxial thin film growth and related processes. All possible automation of these processes was considered, along with energy and environmental requirements. Aspects of robot capabilities considered include system intelligence, ROM requirements, kinematic and dynamic specifications, sensor design and configuration, flexibility and maintainability. Support elements discussed included facilities, logistics, ground support, launch and recovery, and management systems.

  11. Achievement report on developing inverse manufacturing system in fiscal 1998; 1998 nendo inverse manufacturing system no kaihatsu seika hokokusho

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    Research and development has been performed on a circulating type production system, or an inverse manufacturing system, to minimize the environmental load in the entire life cycle of industrial products from design to manufacturing, maintenance, recovery, and re-utilization. In developing the recycling information system, discussion and extraction were executed on the data to be exchanged between manufacturers and users in the inverse society. A new individual parts history control system was developed. In developing the recycling processing system, a prototype system was evaluated by using hypothetical data, wherein the possibility of improving the recycling processing efficiency and reducing the cost was verified. In addition, trial design was made on a recycling processing plant in consideration of the cost effect to get the future plant image. In fabricating the inverse manufacturing products, a prototype concept model was made for information terminal devices. Development was performed on such elementary technologies as the easy-to-disintegrate structure technology, self-integration connecting structure and environmental hysteresis detection system. (NEDO)

  12. Radiation effect test on ADC/DAC and high density memory devices with 60Co γ-rays

    International Nuclear Information System (INIS)

    Xing Kefei; Wang Yueke; Pan Huafeng

    2006-01-01

    A test platform was constructed for 60 Co γ-ray irradiation experiment of microelectronics, with the aid of computer and a FPGA module. The tested sample devices included analog-to-digital converter AD10465, digital-to-analog converter AD9857, high density Flash memory MEF64M16 and anti-fused PROM XQR17V16, which are used in signal processing module in spaceborne systems. Evaluations were made on their ability of resisting the total dose based on the proper function criterion of the devices. The results showed that AD10465 and AD9857 ran properly after 1.59 kGy(Si) irradiation, but errors were found when MEF64M16 and XQR17V16's total ionizing dose is 0.13 kGy(Si) and 0.99 kGy(Si), respectively. (authors)

  13. Microelectronics in LMFBR: Activities sponsored by the Commission 1979-1983

    International Nuclear Information System (INIS)

    Nordwall, H.J. de

    1986-01-01

    These studies were designed to draw attention to signal handling techniques which have become applicable to the automatic control of reactors as a result of advances in microelectronics. The underlying concepts being explored are the extent to which more information may be obtained from existing sensors, whether changes in the state of a system may be acted upon automatically and the acceptability of stochastic methods of state estimation. If a given state may arise in a number of different ways, automatic action necessarily involves diagnosis of causes if any but the simplest actions, e.g. scram, is required. Up to now this diagnosis has been made by an operator, though a number of schemes intended to identify the primary cause of an abnormal state or to guide an operator to the most easily accessible safe state are in advanced states of development, e.g. at Halden, Westinghouse and GRS-Garching. The activity decribed is continuing, current emphasis being upon diagnostics using approaches based upon artificial intelligence concepts, system optimisation and quantification of the benefits of networking

  14. International Catalogue of Sealed Radioactive Sources and Devices

    International Nuclear Information System (INIS)

    2010-01-01

    The international catalogue of sealed radioactive sources and devices have two major objectives. The first objective is to provide vital information for a wide range of individuals and organizations on industrially manufactured radioactive sources and devices. The second objective is to facilitate identification of design specifications based on limited information from orphan sources and devices to allow safe handling of these items.

  15. Design and Implementation of Electronic Batch Record Systems for Pharmaceutical Manufacturing Documentation

    International Nuclear Information System (INIS)

    Abdul Jalil Abd Hamid; Shafii Khamis; Rehir Dahalan

    2011-01-01

    Paper batch records have been used for decades to record procedures, the types and quantities of each material used, and the status of each step in the manufacturing process for both pharmaceuticals and medical devices. Although paper batch records are well established in its implementation, the system is laborious to maintain and prone to human error, particularly as manufacturing operations become increasingly complicated. Many pharmaceutical manufacturers are currently evaluating the feasibility of Electronic Batch Record (EBR) system. An integrated EBR system has been developed by Medical Technology Division of Nuclear Malaysia to monitor process and equipment used in the manufacture of pharmaceuticals and medical devices. The system architecture consists of an iPAN7 data processing system operating under Microsoft Windows Embedded CE 6.0 R2. The system serves as a common data bank and an input/output device for the iPAN7 processors. Full traceability from component material to finished product is maintained. Properly implemented, EBR eliminate paperwork, speed up information distribution, and provide useful tools for improving quality and efficiency. This paper discusses the general system requirements and specifications along with the hardware and software required to implement those requirements and specifications. Also discussed are problems which were encountered after initial development and plans for future development, and a plan for extending and commercializing this technology. (author)

  16. MEMS Device Being Developed for Active Cooling and Temperature Control

    Science.gov (United States)

    Moran, Matthew E.

    2001-01-01

    High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) is currently under development at the NASA Glenn Research Center to meet this need. It uses a thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface. The device can be used strictly in the cooling mode, or it can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly are accomplished by wet etching and wafer bonding techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces and limited failure modes, and minimal induced vibration.

  17. Fabrication of fillable microparticles and other complex 3D microstructures

    Science.gov (United States)

    McHugh, Kevin J.; Nguyen, Thanh D.; Linehan, Allison R.; Yang, David; Behrens, Adam M.; Rose, Sviatlana; Tochka, Zachary L.; Tzeng, Stephany Y.; Norman, James J.; Anselmo, Aaron C.; Xu, Xian; Tomasic, Stephanie; Taylor, Matthew A.; Lu, Jennifer; Guarecuco, Rohiverth; Langer, Robert; Jaklenec, Ana

    2017-09-01

    Three-dimensional (3D) microstructures created by microfabrication and additive manufacturing have demonstrated value across a number of fields, ranging from biomedicine to microelectronics. However, the techniques used to create these devices each have their own characteristic set of advantages and limitations with regards to resolution, material compatibility, and geometrical constraints that determine the types of microstructures that can be formed. We describe a microfabrication method, termed StampEd Assembly of polymer Layers (SEAL), and create injectable pulsatile drug-delivery microparticles, pH sensors, and 3D microfluidic devices that we could not produce using traditional 3D printing. SEAL allows us to generate microstructures with complex geometry at high resolution, produce fully enclosed internal cavities containing a solid or liquid, and use potentially any thermoplastic material without processing additives.

  18. Wireless link and microelectronics design for retinal prostheses

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Wentai [Univ. of California, Santa Cruz, CA (United States)

    2012-02-29

    This project focuses on delivering power and data to the artificial retinal implant inside the eye and the implant microstimulator electronics which delivers the current pulses to stimulate the retinal layer to elicit visual perception. Since the use of invasive means such as tethering wires to transmit power and data results in discomfort to the patients which could eventually cause infection due to the abrasion caused by the wire and contact of the internals of the eye to the external environment, a completely wireless approach is used to transfer both power and data. Power is required inside the eye for the microelectronic implant which uses a dual voltage supply scheme (positive and negative) to deliver biphasic (anodic and cathodic) current pulses. Data in the form of digital bits from the data transmitter external to the eye, carries information about the amplitude, phase width, interphase delay, stimulation sequence for each implant electrode. The data receiver unit decodes the digital stream and the microstimulator unit generates the appropriate current stimuli. Since the external unit consisting of the power transmitter can experience coupling a variation with the power receiver due to the patient’s movements, a closed loop approach is used which varies the transmitted power dynamically to automatically compensate for such movements. This report presents the salient features of this research activities and results.

  19. Ultra-thin flexible GaAs photovoltaics in vertical forms printed on metal surfaces without interlayer adhesives

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Juho; Song, Kwangsun; Kim, Namyun; Lee, Jongho, E-mail: jong@gist.ac.kr [School of Mechanical Engineering, Gwangju Institute of Science and Technology (GIST), Gwangju 61005 (Korea, Republic of); Research Institute for Solar and Sustainable Energies (RISE), Gwangju Institute of Science and Technology (GIST), Gwangju 61005 (Korea, Republic of); Hwang, Jeongwoo [Photonic Bio Research Center, Korea Photonics Technology Institute (KOPTI), 9 Cheomdanventure-ro 108beon-gil, Gwangju 61007 (Korea, Republic of); Shin, Jae Cheol [Department of Physics, Yeungnam University, Gyeongsan, Gyeongbuk 38541 (Korea, Republic of)

    2016-06-20

    Wearable flexible electronics often require sustainable power sources that are also mechanically flexible to survive the extreme bending that accompanies their general use. In general, thinner microelectronic devices are under less strain when bent. This paper describes strategies to realize ultra-thin GaAs photovoltaics through the interlayer adhesiveless transfer-printing of vertical-type devices onto metal surfaces. The vertical-type GaAs photovoltaic devices recycle reflected photons by means of bottom electrodes. Systematic studies with four different types of solar microcells indicate that the vertical-type solar microcells, at only a quarter of the thickness of similarly designed lateral-type cells, generate a level of electric power similar to that of thicker cells. The experimental results along with the theoretical analysis conducted here show that the ultra-thin vertical-type solar microcells are durable under extreme bending and thus suitable for use in the manufacturing of wearable flexible electronics.

  20. Smallest Nanoelectronic with Atomic Devices with Precise Structures

    Science.gov (United States)

    Yamada, Toshishige

    2000-01-01

    Since its invention in 1948, the transistor has revolutionized our everyday life - transistor radios and TV's appeared in the early 1960s, personal computers came into widespread use in the mid-1980s, and cellular phones, laptops, and palm-sized organizers dominated the 1990s. The electronics revolution is based upon transistor miniaturization; smaller transistors are faster, and denser circuitry has more functionality. Transistors in current generation chips are 0.25 micron or 250 nanometers in size, and the electronics industry has completed development of 0.18 micron transistors which will enter production within the next few years. Industry researchers are now working to reduce transistor size down to 0.13 micron - a thousandth of the width of a human hair. However, studies indicate that the miniaturization of silicon transistors will soon reach its limit. For further progress in microelectronics, scientists have turned to nanotechnology to advance the science. Rather than continuing to miniaturize transistors to a point where they become unreliable, nanotechnology offers the new approach of building devices on the atomic scale [see sidebar]. One vision for the next generation of miniature electronics is atomic chain electronics, where devices are composed of atoms aligned on top of a substrate surface in a regular pattern. The Atomic Chain Electronics Project (ACEP) - part of the Semiconductor Device Modeling and Nanotechnology group, Integrated Product Team at the NAS Facility has been developing the theory of understanding atomic chain devices, and the author's patent for atomic chain electronics is now pending.

  1. Double network bacterial cellulose hydrogel to build a biology-device interface

    Science.gov (United States)

    Shi, Zhijun; Li, Ying; Chen, Xiuli; Han, Hongwei; Yang, Guang

    2013-12-01

    Establishing a biology-device interface might enable the interaction between microelectronics and biotechnology. In this study, electroactive hydrogels have been produced using bacterial cellulose (BC) and conducting polymer (CP) deposited on the BC hydrogel surface to cover the BC fibers. The structures of these composites thus have double networks, one of which is a layer of electroactive hydrogels combined with BC and CP. The electroconductivity provides the composites with capabilities for voltage and current response, and the BC hydrogel layer provides good biocompatibility, biodegradability, bioadhesion and mass transport properties. Such a system might allow selective biological functions such as molecular recognition and specific catalysis and also for probing the detailed genetic and molecular mechanisms of life. A BC-CP composite hydrogel could then lead to a biology-device interface. Cyclic voltammetry and electrochemical impedance spectroscopy (EIS) are used here to study the composite hydrogels' electroactive property. BC-PAni and BC-PPy respond to voltage changes. This provides a mechanism to amplify electrochemical signals for analysis or detection. BC hydrogels were found to be able to support the growth, spreading and migration of human normal skin fibroblasts without causing any cytotoxic effect on the cells in the cell culture. These double network BC-CP hydrogels are biphasic Janus hydrogels which integrate electroactivity with biocompatibility, and might provide a biology-device interface to produce implantable devices for personalized and regenerative medicine.

  2. Interconnect mechanisms in microelectronic packaging

    Science.gov (United States)

    Roma, Maria Penafrancia C.

    Global economic, environmental and market developments caused major impact in the microelectronics industry. Astronomical rise of gold metal prices over the last decade shifted the use of copper and silver alloys as bonding wires. Environmental legislation on the restriction of the use of Pb launched worldwide search for lead-free solders and platings. Finally, electrical and digital uses demanded smaller, faster and cheaper devices. Ultra-fine pitch bonding, decreasing bond wire sizes and hard to bond substrates have put the once-robust stitch bond in the center of reliability issues due to stitch bond lift or open wires .Unlike the ball bond, stitch bonding does not lead to intermetallic compound formation but adhesion is dependent on mechanical deformation, interdiffusion, solid solution formation, void formation and mechanical interlocking depending on the wire material, bond configuration, substrate type , thickness and surface condition. Using Au standoff stitch bonds on NiPdAu plated substrates eliminated stitch bond lift even when the Au and Pd layers are reduced. Using the Matano-Boltzmann analysis on a STEM (Scanning Transmission Analysis) concentration profile the interdiffusion coefficient is measured to be 10-16 cm 2/s. Wire pull strength data showed that the wire pull strength is 0.062N and increases upon stress testing. Meanwhile, coating the Cu wire with Pd, not only increases oxidation resistance but also improved adhesion due to the formation of a unique interfacial adhesion layers. Adhesion strength as measured by pull showed the Cu wire bonded to Ag plated Cu substrate (0.132N) to be stronger than the Au wire bonded on the same substrate (0.124N). Ag stitch bonded to Au is predicted to be strong but surface modification made the adhesion stronger. However, on the Ag ball bonded to Al showed multiple IMC formation with unique morphology exposed by ion milling and backscattered scanning electron microscopy. Adding alloying elements in the Ag wire

  3. Additive manufacturing of three-dimensional (3D) microfluidic-based microelectromechanical systems (MEMS) for acoustofluidic applications.

    Science.gov (United States)

    Cesewski, Ellen; Haring, Alexander P; Tong, Yuxin; Singh, Manjot; Thakur, Rajan; Laheri, Sahil; Read, Kaitlin A; Powell, Michael D; Oestreich, Kenneth J; Johnson, Blake N

    2018-06-13

    Three-dimensional (3D) printing now enables the fabrication of 3D structural electronics and microfluidics. Further, conventional subtractive manufacturing processes for microelectromechanical systems (MEMS) relatively limit device structure to two dimensions and require post-processing steps for interface with microfluidics. Thus, the objective of this work is to create an additive manufacturing approach for fabrication of 3D microfluidic-based MEMS devices that enables 3D configurations of electromechanical systems and simultaneous integration of microfluidics. Here, we demonstrate the ability to fabricate microfluidic-based acoustofluidic devices that contain orthogonal out-of-plane piezoelectric sensors and actuators using additive manufacturing. The devices were fabricated using a microextrusion 3D printing system that contained integrated pick-and-place functionality. Additively assembled materials and components included 3D printed epoxy, polydimethylsiloxane (PDMS), silver nanoparticles, and eutectic gallium-indium as well as robotically embedded piezoelectric chips (lead zirconate titanate (PZT)). Electrical impedance spectroscopy and finite element modeling studies showed the embedded PZT chips exhibited multiple resonant modes of varying mode shape over the 0-20 MHz frequency range. Flow visualization studies using neutrally buoyant particles (diameter = 0.8-70 μm) confirmed the 3D printed devices generated bulk acoustic waves (BAWs) capable of size-selective manipulation, trapping, and separation of suspended particles in droplets and microchannels. Flow visualization studies in a continuous flow format showed suspended particles could be moved toward or away from the walls of microfluidic channels based on selective actuation of in-plane or out-of-plane PZT chips. This work suggests additive manufacturing potentially provides new opportunities for the design and fabrication of acoustofluidic and microfluidic devices.

  4. ANSTO and CSIRO: supporting the medical devices and sensors industry in Australia

    International Nuclear Information System (INIS)

    Triani, Gerry; Doe, Simon

    2005-01-01

    The Australian Nuclear Science and Technology Organisation (ANSTO) and the Commonwealth Scientific and Industrial Research Organisation (CSIRO) have provided support to the Medical Devices and Sensors Industry in Australia for many years. In particular the Institute of Materials and Engineering Science at ANSTO and CSIRO Manufacturing and Infrastructure Technology have worked independently and jointly on a number of projects to provide technical services and support to small to medium sized companies. A recent venture to capture their capabilities in the WTIA's Medical Devices and Sensors Industry Sectoral Project, part of the WTIA National Diffusion Networks Project, has produced substantial technical and financial gains for its participants. The aim of this article is to highlight the infrastructure and capabilities that ANSTO and CSIRO can provide to component manufacturers and industry clusters that offer a range of manufacturing processes needed for medical devices and sensors. Several case studies illustrate how ANSTO and CSIRO have provided support to the medical devices industry

  5. Simple and inexpensive microfluidic devices for the generation of monodisperse multiple emulsions

    KAUST Repository

    Li, Erqiang

    2013-12-16

    Droplet-based microfluidic devices have become a preferred versatile platform for various fields in physics, chemistry and biology. Polydimethylsiloxane soft lithography, the mainstay for fabricating microfluidic devices, usually requires the usage of expensive apparatus and a complex manufacturing procedure. Here, we report the design and fabrication of simple and inexpensive microfluidic devices based on microscope glass slides and pulled glass capillaries, for generating monodisperse multiple emulsions. The advantages of our method lie in a simple manufacturing procedure, inexpensive processing equipment and flexibility in the surface modification of the designed microfluidic devices. Different types of devices have been designed and tested and the experimental results demonstrated their robustness for preparing monodisperse single, double, triple and multi-component emulsions. © 2014 IOP Publishing Ltd.

  6. Chitosan to Connect Biology to Electronics: Fabricating the Bio-Device Interface and Communicating Across This Interface

    Directory of Open Access Journals (Sweden)

    Eunkyoung Kim

    2014-12-01

    Full Text Available Individually, advances in microelectronics and biology transformed the way we live our lives. However, there remain few examples in which biology and electronics have been interfaced to create synergistic capabilities. We believe there are two major challenges to the integration of biological components into microelectronic systems: (i assembly of the biological components at an electrode address, and (ii communication between the assembled biological components and the underlying electrode. Chitosan possesses a unique combination of properties to meet these challenges and serve as an effective bio-device interface material. For assembly, chitosan’s pH-responsive film-forming properties allow it to “recognize” electrode-imposed signals and respond by self-assembling as a stable hydrogel film through a cathodic electrodeposition mechanism. A separate anodic electrodeposition mechanism was recently reported and this also allows chitosan hydrogel films to be assembled at an electrode address. Protein-based biofunctionality can be conferred to electrodeposited films through a variety of physical, chemical and biological methods. For communication, we are investigating redox-active catechol-modified chitosan films as an interface to bridge redox-based communication between biology and an electrode. Despite significant progress over the last decade, many questions still remain which warrants even deeper study of chitosan’s structure, properties, and functions.

  7. Ubiquitous Robotic Technology for Smart Manufacturing System.

    Science.gov (United States)

    Wang, Wenshan; Zhu, Xiaoxiao; Wang, Liyu; Qiu, Qiang; Cao, Qixin

    2016-01-01

    As the manufacturing tasks become more individualized and more flexible, the machines in smart factory are required to do variable tasks collaboratively without reprogramming. This paper for the first time discusses the similarity between smart manufacturing systems and the ubiquitous robotic systems and makes an effort on deploying ubiquitous robotic technology to the smart factory. Specifically, a component based framework is proposed in order to enable the communication and cooperation of the heterogeneous robotic devices. Further, compared to the service robotic domain, the smart manufacturing systems are often in larger size. So a hierarchical planning method was implemented to improve the planning efficiency. A test bed of smart factory is developed. It demonstrates that the proposed framework is suitable for industrial domain, and the hierarchical planning method is able to solve large problems intractable with flat methods.

  8. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    Science.gov (United States)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  9. High energy devices versus low energy devices in orthopedics treatment modalities

    Science.gov (United States)

    Schultheiss, Reiner

    2003-10-01

    The orthopedic consensus group defined in 1997 the 42 most likely relevant parameters of orthopedic shock wave devices. The idea of this approach was to correlate the different clinical outcomes with the physical properties of the different devices with respect to their acoustical waves. Several changes in the hypothesis of the dose effect relationship have been noticed since the first orthopedic treatments. The relation started with the maximum pressure p+, followed by the total energy, the energy density; and finally the single treatment approach using high, and then the multiple treatment method using low energy. Motivated by the reimbursement situation in Germany some manufacturers began to redefine high and low energy devices independent of the treatment modality. The OssaTron as a high energy, single treatment electro hydraulic device gained FDA approval as the first orthopedic ESWT device for plantar fasciitis and, more recently, for lateral epicondylitis. Two low energy devices have now also gained FDA approval based upon a single treatment. Comparing the acoustic data, differences between the OssaTron and the other devices are obvious and will be elaborated upon. Cluster analysis of the outcomes and the acoustical data are presented and new concepts will be suggested.

  10. Custom structure models and prostheses manufacturing from CT data

    International Nuclear Information System (INIS)

    Rothman, S.L.G.; Glenn, W.V.; Rhodes, M.L.; Azzawi, Y.M.

    1984-01-01

    A system is described that delivers three-dimensional shape to create skeletal models, plan corrective surgery and directly manufacture prosthesis implants. Geometry of implants are manufactured to precise dimensions using CT image data and an algorithm to generate instructions for numerically controlled milling machines. The system is nationwide, interconnected via a public digital communications network. Three key components of this system are discussed, the CT image processing that determines edge information for skeletal structures, the computer aided manufacturing of anatomic structures and prosthesis, and the computer communications network that combine these technologies. This paper illustrates components forming this effort by a description of the clinical course of several patients in whom such devices have been implanted

  11. A comparison of the heat transfer capabilities of two manufacturing methods for high heat flux water-cooled devices

    International Nuclear Information System (INIS)

    McKoon, R.H.

    1986-10-01

    An experimental program was undertaken to compare the heat transfer characteristics of water-cooled copper devices manufactured via conventional drilled passage construction and via a technique whereby molten copper is cast over a network of preformed cooling tubes. Two similar test blocks were constructed; one using the drilled passage technique, the other via casting copper over Monel pipe. Each test block was mounted in a vacuum system and heated uniformly on the top surface using a swept electron beam. From the measured absorbed powers and resultant temperatures, an overall heat transfer coefficient was calculated. The maximum heat transfer coefficient calculated for the case of the drilled passage test block was 2534 Btu/hr/ft 2 / 0 F. This corresponded to an absorbed power density of 320 w/cm 2 and resulted in a maximum recorded copper temperature of 346 0 C. Corresponding figures for the cast test block were 363 Btu/hr/ft 2 / 0 F, 91 w/cm 2 , and 453 0 C

  12. Manufacturing considerations for AMLCD cockpit displays

    Science.gov (United States)

    Luo, Fang-Chen

    1995-06-01

    AMLCD cockpit displays need to meet more stringent requirements compared with AMLCD commercial displays in areas such as environmental conditions, optical performance and device reliability. Special considerations are required for the manufacturing of AMLCD cockpit displays in each process step to address these issues. Some examples are: UV stable polarizers, wide-temperature LC material, strong LC glue seal, ESS test system, gray scale voltage EEPROM, etc.

  13. Manufacturing at Nanoscale: Top-Down, Bottom-up and System Engineering

    International Nuclear Information System (INIS)

    Zhang Xiang; Sun Cheng; Fang, Nicholas

    2004-01-01

    The current nano-technology revolution is facing several major challenges: to manufacture nanodevices below 20 nm, to fabricate three-dimensional complex nano-structures, and to heterogeneously integrate multiple functionalities. To tackle these grand challenges, the Center for Scalable and Integrated NAno-Manufacturing (SINAM), a NSF Nanoscale Science and Engineering Center, set its goal to establish a new manufacturing paradigm that integrates an array of new nano-manufacturing technologies, including the plasmonic imaging lithography and ultramolding imprint lithography aiming toward critical resolution of 1-10 nm and the hybrid top-down and bottom-up technologies to achieve massively parallel integration of heterogeneous nanoscale components into higher-order structures and devices. Furthermore, SINAM will develop system engineering strategies to scale-up the nano-manufacturing technologies. SINAMs integrated research and education platform will shed light to a broad range of potential applications in computing, telecommunication, photonics, biotechnology, health care, and national security

  14. Drugs and devices: audit and accreditation the Malaysian Practice

    International Nuclear Information System (INIS)

    Eisha Abdul Rahman; Anis Ahmad

    1999-01-01

    The Malaysian Drugs Control Authority (DCA) implemented the licensing scheme in April 1992 under the Control of Drugs and Cosmetics Regulations 1984. Premises that need be licensed are those involved in any part of the process of production products or bringing the products to their final state, including storage, processing, assembling, sterilising, packaging, testing, labelling and releasing for sale. A total of 64 manufacturers producing prescription medicines, over-the-counter (OTC) drugs and cosmetics products, and another 61 for traditional medicines, have been licensed. Compliance to Good Manufacturing Practice (GMP) which focuses on product safety, purity, efficacy and identity, is a pre-requisite for licensing. The GMP guidelines for pharmaceuticals lay down several pertinent elements such as quality management, personnel, premises and equipment, documentation, production, quality control, contract manufacture, complaints and product recall, and self-inspection. Audits are regularly carried out for the purposes of licensing, certification, surveillance, investigations, and verification. Medical devices, encompassing an enormous range of technologies and application, are however not covered by the above mentioned Regulation. A separate new Bill for Medical Devices will be introduced, as targeted under 7th Malaysia Plan. Although currently not regulated, medical device manufacturers are committed towards quality system management in order to penetrate the international market. Hence, the need to establish quality system standards that comply with EN 46001/2, similar to that ISO 9001/2 requirements. Unlike GMP, which is a regulatory standard, ISO 9001/2 is merely a voluntary certification. The key elements dwell mainly on process management, process improvement, customer interfaces and system administration or control. There are significant similarities between GMP requirements for pharmaceutical and quality system for medical devices. However there are also

  15. 3D-printed components for quantum devices.

    Science.gov (United States)

    Saint, R; Evans, W; Zhou, Y; Barrett, T; Fromhold, T M; Saleh, E; Maskery, I; Tuck, C; Wildman, R; Oručević, F; Krüger, P

    2018-05-30

    Recent advances in the preparation, control and measurement of atomic gases have led to new insights into the quantum world and unprecedented metrological sensitivities, e.g. in measuring gravitational forces and magnetic fields. The full potential of applying such capabilities to areas as diverse as biomedical imaging, non-invasive underground mapping, and GPS-free navigation can only be realised with the scalable production of efficient, robust and portable devices. We introduce additive manufacturing as a production technique of quantum device components with unrivalled design freedom and rapid prototyping. This provides a step change in efficiency, compactness and facilitates systems integration. As a demonstrator we present an ultrahigh vacuum compatible ultracold atom source dissipating less than ten milliwatts of electrical power during field generation to produce large samples of cold rubidium gases. This disruptive technology opens the door to drastically improved integrated structures, which will further reduce size and assembly complexity in scalable series manufacture of bespoke portable quantum devices.

  16. Preliminary investigation of polystyrene/MoS{sub 2}-Oleylamine polymer composite for potential application as low-dielectric material in microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Landi, Giovanni, E-mail: glandi@unisa.it [Institute for Polymers, Composites and Biomaterials (IPCB-CNR), P. Enrico Fermi 1, 80055 Portici (Italy); Department of Industrial Engineering, University of Salerno, Via G. Paolo II 132, 84084 Fisciano (Italy); Altavilla, Claudia; Iannace, Salvatore; Sorrentino, Andrea, E-mail: andrea.sorrentino@cnr.it [Institute for Polymers, Composites and Biomaterials (IPCB-CNR), P. Enrico Fermi 1, 80055 Portici (Italy); Ciambelli, Paolo [Department of Industrial Engineering, University of Salerno, Via G. Paolo II 132, 84084 Fisciano (Italy); Centre NANO-MATES, University of Salerno, Fisciano, Via G. Paolo II 132, 84084 Fisciano (Italy); Neitzert, Heinrich C. [Department of Industrial Engineering, University of Salerno, Via G. Paolo II 132, 84084 Fisciano (Italy)

    2015-12-17

    Insulating materials play a vital role in the design and performance of electrical systems for both steady and transient state conditions. Among the other properties, also in this field, polymer nanocomposites promise to offer exciting improvements. Many studies in the last decade has witnessed significant developments in the area of nano-dielectric materials and significant effects of nano-scale fillers on electric, thermal and mechanical properties of polymeric materials have been observed. However, the developments of new and advanced materials to be used the miniaturization of electronic devices fabrication require extensive studies on electrical insulation characteristics of these materials before they can be used in commercial systems. In this work, Polystyrene (PS) composites were prepared by the blend solution method using MoS{sub 2}@Oleylamine nanosheets as filler. The dielectric properties of the resulting comoposite have been investigated at 300K and in the frequency range between 1000 Hz and 1 MHz. The addition of the MoS{sub 2}@Oleylamine nanosheets leads to a decreasing of the relative dielectric constant and of the electrical conductivity measured in the voltage range between ±500V. Thanks to a possibility to tune the electrical permittivity with the control of MoS{sub 2} concentration, these materials could be used as a low-dielectric material in the microelectronics applications.

  17. Rapid prototyping of multi-scale biomedical microdevices by combining additive manufacturing technologies.

    Science.gov (United States)

    Hengsbach, Stefan; Lantada, Andrés Díaz

    2014-08-01

    The possibility of designing and manufacturing biomedical microdevices with multiple length-scale geometries can help to promote special interactions both with their environment and with surrounding biological systems. These interactions aim to enhance biocompatibility and overall performance by using biomimetic approaches. In this paper, we present a design and manufacturing procedure for obtaining multi-scale biomedical microsystems based on the combination of two additive manufacturing processes: a conventional laser writer to manufacture the overall device structure, and a direct-laser writer based on two-photon polymerization to yield finer details. The process excels for its versatility, accuracy and manufacturing speed and allows for the manufacture of microsystems and implants with overall sizes up to several millimeters and with details down to sub-micrometric structures. As an application example we have focused on manufacturing a biomedical microsystem to analyze the impact of microtextured surfaces on cell motility. This process yielded a relevant increase in precision and manufacturing speed when compared with more conventional rapid prototyping procedures.

  18. Manufacturing Demonstration Facility: Low Temperature Materials Synthesis

    International Nuclear Information System (INIS)

    Graham, David E.; Moon, Ji-Won; Armstrong, Beth L.; Datskos, Panos G.; Duty, Chad E.; Gresback, Ryan; Ivanov, Ilia N.; Jacobs, Christopher B.; Jellison, Gerald Earle; Jang, Gyoung Gug; Joshi, Pooran C.; Jung, Hyunsung; Meyer, Harry M.; Phelps, Tommy

    2015-01-01

    The Manufacturing Demonstration Facility (MDF) low temperature materials synthesis project was established to demonstrate a scalable and sustainable process to produce nanoparticles (NPs) for advanced manufacturing. Previous methods to chemically synthesize NPs typically required expensive, high-purity inorganic chemical reagents, organic solvents and high temperatures. These processes were typically applied at small laboratory scales at yields sufficient for NP characterization, but insufficient to support roll-to-roll processing efforts or device fabrication. The new NanoFermentation processes described here operated at a low temperature (~60 C) in low-cost, aqueous media using bacteria that produce extracellular NPs with controlled size and elemental stoichiometry. Up-scaling activities successfully demonstrated high NP yields and quality in a 900-L pilot-scale reactor, establishing this NanoFermentation process as a competitive biomanufacturing strategy to produce NPs for advanced manufacturing of power electronics, solid-state lighting and sensors.

  19. Manufacturing Demonstration Facility: Low Temperature Materials Synthesis

    Energy Technology Data Exchange (ETDEWEB)

    Graham, David E. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Moon, Ji-Won [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Armstrong, Beth L. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Datskos, Panos G. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Duty, Chad E. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Gresback, Ryan [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Ivanov, Ilia N. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Jacobs, Christopher B. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Jellison, Gerald Earle [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Jang, Gyoung Gug [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Joshi, Pooran C. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Jung, Hyunsung [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Meyer, III, Harry M. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Phelps, Tommy [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2015-06-30

    The Manufacturing Demonstration Facility (MDF) low temperature materials synthesis project was established to demonstrate a scalable and sustainable process to produce nanoparticles (NPs) for advanced manufacturing. Previous methods to chemically synthesize NPs typically required expensive, high-purity inorganic chemical reagents, organic solvents and high temperatures. These processes were typically applied at small laboratory scales at yields sufficient for NP characterization, but insufficient to support roll-to-roll processing efforts or device fabrication. The new NanoFermentation processes described here operated at a low temperature (~60 C) in low-cost, aqueous media using bacteria that produce extracellular NPs with controlled size and elemental stoichiometry. Up-scaling activities successfully demonstrated high NP yields and quality in a 900-L pilot-scale reactor, establishing this NanoFermentation process as a competitive biomanufacturing strategy to produce NPs for advanced manufacturing of power electronics, solid-state lighting and sensors.

  20. Laser assisted hybrid additive manufacturing of thermoelectric modules

    Science.gov (United States)

    Zhang, Tao; Tewolde, Mahder; Longtin, Jon P.; Hwang, David J.

    2017-02-01

    Thermoelectric generators (TEGs) are an attractive means to produce electricity, particular from waste heat applications. However, TEGs are almost exclusively manufactured as flat, rigid modules of limited size and shape, and therefore an appropriate mounting for intimate contact of TEGs modules onto arbitrary surfaces represents a significant challenge. In this study, we introduce laser assisted additive manufacturing method to produce multi-layered thermoelectric generator device directly on flat and non-flat surfaces for waste heat recovery. The laser assisted processing spans from laser scribing of thermal sprayed thin films, curing of dispensed thermoelectric inks and selective laser sintering to functionalize thermoelectric materials.

  1. Design and high-volume manufacture of low-cost molded IR aspheres for personal thermal imaging devices

    Science.gov (United States)

    Zelazny, A. L.; Walsh, K. F.; Deegan, J. P.; Bundschuh, B.; Patton, E. K.

    2015-05-01

    The demand for infrared optical elements, particularly those made of chalcogenide materials, is rapidly increasing as thermal imaging becomes affordable to the consumer. The use of these materials in conjunction with established lens manufacturing techniques presents unique challenges relative to the cost sensitive nature of this new market. We explore the process from design to manufacture, and discuss the technical challenges involved. Additionally, facets of the development process including manufacturing logistics, packaging, supply chain management, and qualification are discussed.

  2. "Real life" longevity of implantable cardioverter-defibrillator devices.

    Science.gov (United States)

    Manolis, Antonis S; Maounis, Themistoklis; Koulouris, Spyridon; Vassilikos, Vassilios

    2017-09-01

    Manufacturers of implantable cardioverter-defibrillators (ICDs) promise a 5- to 9-year projected longevity; however, real-life data indicate otherwise. The aim of the present study was to assess ICD longevity among 685 consecutive patients over the last 20 years. Real-life longevity of ICDs may differ from that stated by the manufacturers. The study included 601 men and 84 women (mean age, 63.1 ± 13.3 years). The underlying disease was coronary (n = 396) or valvular (n = 15) disease, cardiomyopathy (n = 220), or electrical disease (n = 54). The mean ejection fraction was 35%. Devices were implanted for secondary (n = 562) or primary (n = 123) prevention. Single- (n = 292) or dual-chamber (n = 269) or cardiac resynchronization therapy (CRT) devices (n = 124) were implanted in the abdomen (n = 17) or chest (n = 668). Over 20 years, ICD pulse generator replacements were performed in 238 patients (209 men; age 63.7 ± 13.9 years; ejection fraction, 37.7% ± 14.0%) who had an ICD for secondary (n = 210) or primary (n = 28) prevention. The mean ICD longevity was 58.3 ± 18.7 months. In 20 (8.4%) patients, devices exhibited premature battery depletion within 36 months. Most (94%) patients had none, minor, or modest use of ICD therapy. Longevity was longest for single-chamber devices and shortest for CRT devices. Latest-generation devices replaced over the second decade lasted longer compared with devices replaced during the first decade. When analyzed by manufacturer, Medtronic devices appeared to have longer longevity by 13 to 18 months. ICDs continue to have limited longevity of 4.9 ± 1.6 years, and 8% demonstrate premature battery depletion by 3 years. CRT devices have the shortest longevity (mean, 3.8 years) by 13 to 17 months, compared with other ICD devices. These findings have important implications, particularly in view of the high expense involved with this type of electrical

  3. Silicon photonics fundamentals and devices

    CERN Document Server

    Deen, M Jamal

    2012-01-01

    The creation of affordable high speed optical communications using standard semiconductor manufacturing technology is a principal aim of silicon photonics research. This would involve replacing copper connections with optical fibres or waveguides, and electrons with photons. With applications such as telecommunications and information processing, light detection, spectroscopy, holography and robotics, silicon photonics has the potential to revolutionise electronic-only systems. Providing an overview of the physics, technology and device operation of photonic devices using exclusively silicon and related alloys, the book includes: * Basic Properties of Silicon * Quantum Wells, Wires, Dots and Superlattices * Absorption Processes in Semiconductors * Light Emitters in Silicon * Photodetectors , Photodiodes and Phototransistors * Raman Lasers including Raman Scattering * Guided Lightwaves * Planar Waveguide Devices * Fabrication Techniques and Material Systems Silicon Photonics: Fundamentals and Devices outlines ...

  4. Cubic boron nitride (cBN) - A new material for advanced optoelectronic devices. Properties and perspectives

    International Nuclear Information System (INIS)

    Nistor, S.V.; Nistor, L.C.; Dinca, G.

    2001-01-01

    Cubic boron nitride (cBN) exhibits, besides exceptional thermal and mechanical properties similar to diamond, an excellent ability to be n or p doped, which makes it a strong candidate for advanced, high - temperature optical and microelectronic devices. Despite its outstanding characteristics, there are quite a few reports concerning the physical properties of cBN. This is partly due to the absence of natural cBN gems and the extreme difficulties in producing enough large (mm 3 sized) single crystals, or single phase thin films, for physical characterization. The state of the art knowledge concerning the basic properties of crystalline cBN, as well as our recent results of microstructure and defect properties studies will be presented. (authors)

  5. Micro-manufacturing technologies and their applications a theoretical and practical guide

    CERN Document Server

    Shipley, David

    2017-01-01

    This book provides in-depth theoretical and practical information on recent advances in micro-manufacturing technologies and processes, covering such topics as micro-injection moulding, micro-cutting, micro-EDM, micro-assembly, micro-additive manufacturing, moulded interconnected devices, and microscale metrology. It is designed to provide complementary material for the related e-learning platform on micro-manufacturing developed within the framework of the Leonardo da Vinci project 2013-3748/542424: MIMAN-T: Micro-Manufacturing Training System for SMEs. The book is mainly addressed to technicians and prospective professionals in the sector and will serve as an easily usable tool to facilitate the translation of micro-manufacturing technologies into tangible industrial benefits. Numerous examples are included to assist readers in learning and implementing the described technologies. In addition, an individual chapter is devoted to technological foresight, addressing market analysis and business models for mic...

  6. CREME96: A revision of the Cosmic Ray Effects on Micro-Electronics code

    International Nuclear Information System (INIS)

    Tylka, A.J.; Adams, J.H. Jr.; Boberg, P.R.

    1997-01-01

    CREME96 is an update of the Cosmic Ray Effects on Micro-Electronics code, a widely-used suite of programs for creating numerical models of the ionizing-radiation environment in near-Earth orbits and for evaluating radiation effects in spacecraft. CREME96, which is now available over the World-Wide Web (WWW) at http://crsp3.nrl.navy.mil/creme96/, has many significant features, including (1) improved models of the galactic cosmic ray, anomalous cosmic ray, and solar energetic particle (flare) components of the near-Earth environment; (2) improved geomagnetic transmission calculations; (3) improved nuclear transport routines; (4) improved single-event upset (SEU) calculation techniques, for both proton-induced and direct-ionization-induced SEUs; and (5) an easy-to-use graphical interface, with extensive on-line tutorial information. In this paper the authors document some of these improvements

  7. A piezoelectric fibre composite based energy harvesting device for potential wearable applications

    International Nuclear Information System (INIS)

    Swallow, L M; Luo, J K; Siores, E; Patel, I; Dodds, D

    2008-01-01

    Rapid technological advances in nanotechnology, microelectronic sensors and systems are becoming increasingly miniaturized to the point where embedded wearable applications are beginning to emerge. A restriction to the widespread application of these microsystems is the power supply of relatively sizable dimensions, weight, and limited lifespan. Emerging micropower sources exploit self-powered generators utilizing the intrinsic energy conversion characteristics of smart materials. 'Energy harvesting' describes the process by which energy is extracted from the environment, converted and stored. Piezoelectric materials have been used to convert mechanical into electrical energy through their inherent piezoelectric effect. This paper focuses on the development of a micropower generator using microcomposite based piezoelectric materials for energy reclamation in glove structures. Devices consist of piezoelectric fibres, 90–250 µm in diameter, aligned in a unidirectional manner and incorporated into a composite structure. The fibres are laid within a single laminate structure with copper interdigitated electrodes assembled on both sides, forming a thin film device. Performances of devices with different fibre diameters and material thicknesses are investigated. Experiments are outlined that detail the performance characteristics of such piezoelectric fibre laminates. Results presented show voltage outputs up to 6 V which is considered enough for potential applications in powering wearable microsystems

  8. Lithographic manufacturing of adaptive optics components

    Science.gov (United States)

    Scott, R. Phillip; Jean, Madison; Johnson, Lee; Gatlin, Ridley; Bronson, Ryan; Milster, Tom; Hart, Michael

    2017-09-01

    Adaptive optics systems and their laboratory test environments call for a number of unusual optical components. Examples include lenslet arrays, pyramids, and Kolmogorov phase screens. Because of their specialized application, the availability of these parts is generally limited, with high cost and long lead time, which can also significantly drive optical system design. These concerns can be alleviated by a fast and inexpensive method of optical fabrication. To that end, we are exploring direct-write lithographic techniques to manufacture three different custom elements. We report results from a number of prototype devices including 1, 2, and 3 wave Multiple Order Diffractive (MOD) lenslet arrays with 0.75 mm pitch and phase screens with near Kolmogorov structure functions with a Fried length r0 around 1 mm. We also discuss plans to expand our research to include a diffractive pyramid that is smaller, lighter, and more easily manufactured than glass versions presently used in pyramid wavefront sensors. We describe how these components can be produced within the limited dynamic range of the lithographic process, and with a rapid prototyping and manufacturing cycle. We discuss exploratory manufacturing methods, including replication, and potential observing techniques enabled by the ready availability of custom components.

  9. Manufacturing Process Simulation of Large-Scale Cryotanks

    Science.gov (United States)

    Babai, Majid; Phillips, Steven; Griffin, Brian

    2003-01-01

    NASA's Space Launch Initiative (SLI) is an effort to research and develop the technologies needed to build a second-generation reusable launch vehicle. It is required that this new launch vehicle be 100 times safer and 10 times cheaper to operate than current launch vehicles. Part of the SLI includes the development of reusable composite and metallic cryotanks. The size of these reusable tanks is far greater than anything ever developed and exceeds the design limits of current manufacturing tools. Several design and manufacturing approaches have been formulated, but many factors must be weighed during the selection process. Among these factors are tooling reachability, cycle times, feasibility, and facility impacts. The manufacturing process simulation capabilities available at NASA.s Marshall Space Flight Center have played a key role in down selecting between the various manufacturing approaches. By creating 3-D manufacturing process simulations, the varying approaches can be analyzed in a virtual world before any hardware or infrastructure is built. This analysis can detect and eliminate costly flaws in the various manufacturing approaches. The simulations check for collisions between devices, verify that design limits on joints are not exceeded, and provide cycle times which aide in the development of an optimized process flow. In addition, new ideas and concerns are often raised after seeing the visual representation of a manufacturing process flow. The output of the manufacturing process simulations allows for cost and safety comparisons to be performed between the various manufacturing approaches. This output helps determine which manufacturing process options reach the safety and cost goals of the SLI. As part of the SLI, The Boeing Company was awarded a basic period contract to research and propose options for both a metallic and a composite cryotank. Boeing then entered into a task agreement with the Marshall Space Flight Center to provide manufacturing

  10. 21 CFR 821.25 - Device tracking system and content requirements: manufacturer requirements.

    Science.gov (United States)

    2010-04-01

    ... HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES MEDICAL DEVICE TRACKING REQUIREMENTS Tracking... procedure for the collection, maintenance, and auditing of the data specified in paragraphs (a) and (b) of... recording system, and the file maintenance procedures system; and (3) A quality assurance program that...

  11. FIXTURING DEVICE FOR DRILLING A STRAIGHT SHAFT

    Directory of Open Access Journals (Sweden)

    SUSAC, Florin

    2017-05-01

    Full Text Available The paper presents a fixturing device used for machining by drilling a straight shaft. The shaft was manufactured on EMCO CONCEPT TURN 55 CNC. The blank used was a bar with circular cross-section. The orientation and fixing scheme of the part and the orientation elements for fixturing device are presented as they were drawn in Autodesk Inventor and AutoCAD software.

  12. Manufacturing Process for OLED Integrated Substrate

    Energy Technology Data Exchange (ETDEWEB)

    Hung, Cheng-Hung [Vitro Flat Glass LLC, Cheswick, PA (United States). Glass Technology Center

    2017-03-31

    The main objective of this project was to develop a low-cost integrated substrate for rigid OLED solid-state lighting produced at a manufacturing scale. The integrated substrates could include combinations of soda lime glass substrate, light extraction layer, and an anode layer (i.e., Transparent Conductive Oxide, TCO). Over the 3+ year course of the project, the scope of work was revised to focus on the development of a glass substrates with an internal light extraction (IEL) layer. A manufacturing-scale float glass on-line particle embedding process capable of producing an IEL glass substrate having a thickness of less than 1.7mm and an area larger than 500mm x 400mm was demonstrated. Substrates measuring 470mm x 370mm were used in the OLED manufacturing process for fabricating OLED lighting panels in single pixel devices as large as 120.5mm x 120.5mm. The measured light extraction efficiency (calculated as external quantum efficiency, EQE) for on-line produced IEL samples (>50%) met the project’s initial goal.

  13. [2011 after-service customer satisfaction survey of monitoring devices in Shanghai area].

    Science.gov (United States)

    Wang, Lijun; Li, Bin; Qian, Jianguo; Cao, Shaoping; He, Dehua; Zheng, Yunxin

    2013-01-01

    In 2011, Shanghai Medical Equipment Management Quality Control Center launched the fifth after-sale service satisfaction survey for medical devices in Shanghai area. There are 8 classes medical devices involving in the survey. This paper demonstrates the investigation results of monitoring devices which are from different manufacturers.

  14. 3D Printing device adaptable to Computer Numerical Control (CNC)

    OpenAIRE

    GARDAN , Julien; Danesi , F.; Roucoules , Lionel; Schneider , A.

    2014-01-01

    This article presents the development of a 3D printing device for the additive manufacturing adapted to a CNC machining. The application involves the integration of a specific printing head. Additive manufacturing technology is most commonly used for modeling, prototyping, tooling through an exclusive machine or 3D printer. A global review and analysis of technologies show the additive manufacturing presents little independent solutions [6][9]. The problem studied especially the additive manu...

  15. Printed polymer photonic devices for optical interconnect systems

    Science.gov (United States)

    Subbaraman, Harish; Pan, Zeyu; Zhang, Cheng; Li, Qiaochu; Guo, L. J.; Chen, Ray T.

    2016-03-01

    Polymer photonic device fabrication usually relies on the utilization of clean-room processes, including photolithography, e-beam lithography, reactive ion etching (RIE) and lift-off methods etc, which are expensive and are limited to areas as large as a wafer. Utilizing a novel and a scalable printing process involving ink-jet printing and imprinting, we have fabricated polymer based photonic interconnect components, such as electro-optic polymer based modulators and ring resonator switches, and thermo-optic polymer switch based delay networks and demonstrated their operation. Specifically, a modulator operating at 15MHz and a 2-bit delay network providing up to 35.4ps are presented. In this paper, we also discuss the manufacturing challenges that need to be overcome in order to make roll-to-roll manufacturing practically viable. We discuss a few manufacturing challenges, such as inspection and quality control, registration, and web control, that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible polymer photonic systems. We have overcome these challenges, and currently utilizing our inhouse developed hardware and software tools, <10μm alignment accuracy at a 5m/min is demonstrated. Such a scalable roll-to-roll manufacturing scheme will enable the development of unique optoelectronic devices which can be used in a myriad of different applications, including communication, sensing, medicine, security, imaging, energy, lighting etc.

  16. Tritium target manufacturing for use in accelerators

    Science.gov (United States)

    Bach, P.; Monnin, C.; Van Rompay, M.; Ballanger, A.

    2001-07-01

    As a neutron tube manufacturer, SODERN is now in charge of manufacturing tritium targets for accelerators, in cooperation with CEA/DAM/DTMN in Valduc. Specific deuterium and tritium targets are manufactured on request, according to the requirements of the users, starting from titanium target on copper substrate, and going to more sophisticated devices. A wide range of possible uses is covered, including thin targets for neutron calibration, thick targets with controlled loading of deuterium and tritium, rotating targets for higher lifetimes, or large size rotating targets for accelerators used in boron neutron therapy. Activity of targets lies in the 1 to 1000 Curie, diameter of targets being up to 30 cm. Special targets are also considered, including surface layer targets for lowering tritium desorption under irradiation, or those made from different kinds of occluders such as titanium, zirconium, erbium, scandium, with different substrates. It is then possible to optimize either neutron output, or lifetime and stability, or thermal behavior.

  17. 21 CFR 1002.51 - Exemptions for manufacturers of products intended for the U.S. Government.

    Science.gov (United States)

    2010-04-01

    ... for the U.S. Government. 1002.51 Section 1002.51 Food and Drugs FOOD AND DRUG ADMINISTRATION.... Government. Upon application therefor by the manufacturer, the Director, Center for Devices and Radiological Health, may exempt from the provisions of this part a manufacturer of any electronic product intended for...

  18. Radiographic film digitizing devices

    International Nuclear Information System (INIS)

    McFee, W.H.

    1988-01-01

    Until recently, all film digitizing devices for use with teleradiology or picture archiving and communication systems used a video camera to capture an image of the radiograph for subsequent digitization. The development of film digitizers that use a laser beam to scan the film represents a significant advancement in digital technology, resulting in improved image quality compared with video scanners. This paper discusses differences in resolution, efficiency, reliability, and the cost between these two types of devices. The results of a modified receiver operating characteristic comparison study of a video scanner and a laser scanner manufactured by the same company are also discussed

  19. How clean is clean?---How clean is needed?

    International Nuclear Information System (INIS)

    Hays, A.K.

    1991-01-01

    This paper will provide an overview of cleaning qualifications used in a variety of industries: from small-scale manufacturer's of precision-machined products to large-scale manufacturer's of electronics (printed wiring boards and surface mount technology) and microelectronics. Cleanliness testing techniques used in the production of precision-machined products, will be described. The on-going DOD program to obtain high-reliability electronics, through the use of military specifications for cleaning and cleanliness levels, will be reviewed. In addition, the continually changing cleanroom/materials standards of the microelectronics industry will be discussed. Finally, we will speculate on the role that new and improved analytical techniques and sensor technologies will play in the factories of the future. 4 refs., 1 tab

  20. Applications of picosecond lasers and pulse-bursts in precision manufacturing

    Science.gov (United States)

    Knappe, Ralf

    2012-03-01

    Just as CW and quasi-CW lasers have revolutionized the materials processing world, picosecond lasers are poised to change the world of micromachining, where lasers outperform mechanical tools due to their flexibility, reliability, reproducibility, ease of programming, and lack of mechanical force or contamination to the part. Picosecond lasers are established as powerful tools for micromachining. Industrial processes like micro drilling, surface structuring and thin film ablation benefit from a process, which provides highest precision and minimal thermal impact for all materials. Applications such as microelectronics, semiconductor, and photovoltaic industries use picosecond lasers for maximum quality, flexibility, and cost efficiency. The range of parts, manufactured with ps lasers spans from microscopic diamond tools over large printing cylinders with square feet of structured surface. Cutting glass for display and PV is a large application, as well. With a smart distribution of energy into groups of ps-pulses at ns-scale separation (known as burst mode) ablation rates can be increased by one order of magnitude or more for some materials, also providing a better surface quality under certain conditions. The paper reports on the latest results of the laser technology, scaling of ablation rates, and various applications in ps-laser micromachining.

  1. Integrated circuit design using design automation

    International Nuclear Information System (INIS)

    Gwyn, C.W.

    1976-09-01

    Although the use of computer aids to develop integrated circuits is relatively new at Sandia, the program has been very successful. The results have verified the utility of the in-house CAD design capability. Custom IC's have been developed in much shorter times than available through semiconductor device manufacturers. In addition, security problems were minimized and a saving was realized in circuit cost. The custom CMOS IC's were designed at less than half the cost of designing with conventional techniques. In addition to the computer aided design, the prototype fabrication and testing capability provided by the semiconductor development laboratory and microelectronics computer network allows the circuits to be fabricated and evaluated before the designs are transferred to the commercial semiconductor manufacturers for production. The Sandia design and prototype fabrication facilities provide the capability of complete custom integrated circuit development entirely within the ERDA laboratories

  2. Additive manufacturing of polymer-derived ceramics

    Science.gov (United States)

    Eckel, Zak C.; Zhou, Chaoyin; Martin, John H.; Jacobsen, Alan J.; Carter, William B.; Schaedler, Tobias A.

    2016-01-01

    The extremely high melting point of many ceramics adds challenges to additive manufacturing as compared with metals and polymers. Because ceramics cannot be cast or machined easily, three-dimensional (3D) printing enables a big leap in geometrical flexibility. We report preceramic monomers that are cured with ultraviolet light in a stereolithography 3D printer or through a patterned mask, forming 3D polymer structures that can have complex shape and cellular architecture. These polymer structures can be pyrolyzed to a ceramic with uniform shrinkage and virtually no porosity. Silicon oxycarbide microlattice and honeycomb cellular materials fabricated with this approach exhibit higher strength than ceramic foams of similar density. Additive manufacturing of such materials is of interest for propulsion components, thermal protection systems, porous burners, microelectromechanical systems, and electronic device packaging.

  3. Additive manufacturing of magnetic shielding and ultra-high vacuum flange for cold atom sensors.

    Science.gov (United States)

    Vovrosh, Jamie; Voulazeris, Georgios; Petrov, Plamen G; Zou, Ji; Gaber, Youssef; Benn, Laura; Woolger, David; Attallah, Moataz M; Boyer, Vincent; Bongs, Kai; Holynski, Michael

    2018-01-31

    Recent advances in the understanding and control of quantum technologies, such as those based on cold atoms, have resulted in devices with extraordinary metrological performance. To realise this potential outside of a lab environment the size, weight and power consumption need to be reduced. Here we demonstrate the use of laser powder bed fusion, an additive manufacturing technique, as a production technique relevant to the manufacture of quantum sensors. As a demonstration we have constructed two key components using additive manufacturing, namely magnetic shielding and vacuum chambers. The initial prototypes for magnetic shields show shielding factors within a factor of 3 of conventional approaches. The vacuum demonstrator device shows that 3D-printed titanium structures are suitable for use as vacuum chambers, with the test system reaching base pressures of 5 ± 0.5 × 10 -10 mbar. These demonstrations show considerable promise for the use of additive manufacturing for cold atom based quantum technologies, in future enabling improved integrated structures, allowing for the reduction in size, weight and assembly complexity.

  4. Investigation of single event latchup

    International Nuclear Information System (INIS)

    Xue Yuxiong; Yang Shengsheng; Cao Zhou; Ba Dedong; An Heng; Chen Luojing; Guo Gang

    2012-01-01

    Radiation effects on avionics microelectronics are important reliability issues for many space applications. In particular, single-event latchup (SEL) phenomenon is a major threat to CMOS integrated circuits in space systems. To effectively circumvent the failure, it is important to know the behavior of such devices during latchup. In this paper, the mechanisms for SEL in CMOS devices are investigated. Several microelectronic devices used in avionics are tested using heavy ion beams, pulsed laser and 252 Cf source. Based on the SEL test results, SEL-hardening and monitoring methods for preventing SEL from the systems design level are proposed. (authors)

  5. Energy conversion device with support member having pore channels

    Science.gov (United States)

    Routkevitch, Dmitri [Longmont, CO; Wind, Rikard A [Johnstown, CO

    2014-01-07

    Energy devices such as energy conversion devices and energy storage devices and methods for the manufacture of such devices. The devices include a support member having an array of pore channels having a small average pore channel diameter and having a pore channel length. Material layers that may include energy conversion materials and conductive materials are coaxially disposed within the pore channels to form material rods having a relatively small cross-section and a relatively long length. By varying the structure of the materials in the pore channels, various energy devices can be fabricated, such as photovoltaic (PV) devices, radiation detectors, capacitors, batteries and the like.

  6. MECHANICAL PROPERTIES OF PARTS OF MEDICAL PRODUCTS PRODUCED USING ADDITIVE MANUFACTURING TECHNOLOGIES

    Directory of Open Access Journals (Sweden)

    Filip Górski

    2017-06-01

    Full Text Available The paper presents results of tests conducted on the elements of medical devices - slings used with medical lifts - manufactured using additive technologies. Project assumptions were: to produce 100 samples of clips with varying design, material and orientation parameter. Samples were manufactured using FDM and SLA processes and then tested for mechanical strength, load transmission and functionality, using certified equipment. Paper shows full methodology and obtained test results.

  7. Plan for advanced microelectronics processing technology application

    Energy Technology Data Exchange (ETDEWEB)

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  8. SPECIFICITY OF MANIFACTURING PROCESS VALIDATION FOR DIAGNOSTIC SEROLOGICAL DEVICES

    Directory of Open Access Journals (Sweden)

    O. Yu. Galkin

    2018-02-01

    Full Text Available The aim of this research was to analyze recent scientific literature, as well as national and international legislature on manifacturing process validation of biopharmaceutical production, in particular devices for serological diagnostics. Technology validation in the field of medical devices for serological diagnostics is most influenced by the Technical Regulation for Medical Devices for in vitro Diagnostics State Standards of Ukraine – SSU EN ISO 13485:2015 “Medical devices. Quality management system. Requirements for regulation”, SSU EN ISO 14971:2015 “Medical devices. Instructions for risk management”, Instruction ST-N of the Ministry of Healthcare of Ukraine 42-4.0:2014 “Medications. Suitable industrial practice”, State Pharmacopoeia of Ukraine and Instruction ICH Q9 on risk management. Current recommendations for validations of drugs manufacturing process, including biotechnological manufacturing, can not be directly applied to medical devices for in vitro diagnostics. It was shown that the specifics of application and raw materials require individual validation parameters and process validations for serological diagnostics devices. Critical parameters to consider in validation plans were provided for every typical stage of production of in vitro diagnostics devices on the example of immunoassay kits, such as obtaining protein antigens, including recombinant ones, preparations of mono- and polyclonal antibodies, immunoenzyme conjugates and immunosorbents, chemical reagents etc. The bottlenecks of technologies for in vitro diagnostics devices were analyzed from the bioethical and biosafety points of view.

  9. A multiscale quantum mechanics/electromagnetics method for device simulations.

    Science.gov (United States)

    Yam, ChiYung; Meng, Lingyi; Zhang, Yu; Chen, GuanHua

    2015-04-07

    Multiscale modeling has become a popular tool for research applying to different areas including materials science, microelectronics, biology, chemistry, etc. In this tutorial review, we describe a newly developed multiscale computational method, incorporating quantum mechanics into electronic device modeling with the electromagnetic environment included through classical electrodynamics. In the quantum mechanics/electromagnetics (QM/EM) method, the regions of the system where active electron scattering processes take place are treated quantum mechanically, while the surroundings are described by Maxwell's equations and a semiclassical drift-diffusion model. The QM model and the EM model are solved, respectively, in different regions of the system in a self-consistent manner. Potential distributions and current densities at the interface between QM and EM regions are employed as the boundary conditions for the quantum mechanical and electromagnetic simulations, respectively. The method is illustrated in the simulation of several realistic systems. In the case of junctionless field-effect transistors, transfer characteristics are obtained and a good agreement between experiments and simulations is achieved. Optical properties of a tandem photovoltaic cell are studied and the simulations demonstrate that multiple QM regions are coupled through the classical EM model. Finally, the study of a carbon nanotube-based molecular device shows the accuracy and efficiency of the QM/EM method.

  10. Electropulsing to assist conventional manufacturing processes

    OpenAIRE

    Sánchez Egea, Antonio José

    2016-01-01

    This thesis presents a study on the variation of the mechanical properties of some materials. These variations are registered for processes as bottom bending, wire drawing or round turning, which are performed under high density electropulses. This research implied the study of several issues related to the manufacturing processes and the electric pulses. For example, some isolated systems are developed for each process. This is required for protecting the monitoring devices and machinery fro...

  11. Hardness Assurance Techniques for New Generation COTS Devices

    Science.gov (United States)

    Lee, C. I.; Rax, B. G.; Johnston, A. H.

    1996-01-01

    Hardness Assurance (HA) techniques and total dose radiation characterization data for new generation linear and COTS devices from various manufacturers are presented. A bipolar op amp showed significant degradation at HDR, not at low dose rate environment. New generation low-power op amps showed more degradation at low voltage applications. HA test techniques for COTS devices are presented in this paper.

  12. Charge collection and SEU mechanisms

    Science.gov (United States)

    Musseau, O.

    1994-01-01

    In the interaction of cosmic ions with microelectronic devices a dense electron-hole plasma is created along the ion track. Carriers are separated and transported by the electric field and under the action of the concentration gradient. The subsequent collection of these carriers induces a transient current at some electrical node of the device. This "ionocurrent" (single ion induced current) acts as any electrical perturbation in the device, propagating in the circuit and inducing failures. In bistable systems (registers, memories) the stored data can be upset. In clocked devices (microprocessors) the parasitic perturbation may propagate through the device to the outputs. This type of failure only effects the information, and do not degrade the functionally of the device. The purpose of this paper is to review the mechanisms of single event upset in microelectronic devices. Experimental and theoretical results are presented, and actual questions and problems are discussed. A brief introduction recalls the creation of the dense plasma of electron-hole pairs. The basic processes for charge collection in a simple np junction (drift and diffusion) are presented. The funneling-field effect is discussed and experimental results are compared to numerical simulations and semi-empirical models. Charge collection in actual microelectronic structures is then presented. Due to the parasitic elements, coupling effects are observed. Geometrical effects, in densely packed structures, results in multiple errors. Electronic couplings are due to the carriers in excess, acting as minority carriers, that trigger parasitic bipolar transistors. Single event upset of memory cells is discussed, based on numerical and experimental data. The main parameters for device characterization are presented. From the physical interpretation of charge collection mechanisms, the intrinsic sensitivity of various microelectronic technologies is determined and compared to experimental data. Scaling laws

  13. PopupCAD: a tool for automated design, fabrication, and analysis of laminate devices

    Science.gov (United States)

    Aukes, Daniel M.; Wood, Robert J.

    2015-05-01

    Recent advances in laminate manufacturing techniques have driven the development of new classes of millimeter-scale sensorized medical devices, robots capable of terrestrial locomotion and sustained flight, and new techniques for sensing and actuation. Recently, the analysis of laminate micro-devices has focused more manufacturability concerns and not on mechanics. Considering the nature of such devices, we draw from existing research in composites, origami kinematics, and finite element methods in order to identify issues related to sequential assembly and self-folding prior to fabrication as well as the stiffness of composite folded systems during operation. These techniques can be useful for understanding how such devices will bend and flex under normal operating conditions, and when added to new design tools like popupCAD, will give designers another means to develop better devices throughout the design process.

  14. Photonomics: automation approaches yield economic aikido for photonics device manufacture

    Science.gov (United States)

    Jordan, Scott

    2002-09-01

    In the glory days of photonics, with exponentiating demand for photonics devices came exponentiating competition, with new ventures commencing deliveries seemingly weekly. Suddenly the industry was faced with a commodity marketplace well before a commodity cost structure was in place. Economic issues like cost, scalability, yield-call it all "Photonomics" -now drive the industry. Automation and throughput-optimization are obvious answers, but until now, suitable modular tools had not been introduced. Available solutions were barely compatible with typical transverse alignment tolerances and could not automate angular alignments of collimated devices and arrays. And settling physics served as the insoluble bottleneck to throughput and resolution advancement in packaging, characterization and fabrication processes. The industry has addressed these needs in several ways, ranging from special configurations of catalog motion devices to integrated microrobots based on a novel mini-hexapod configuration. This intriguing approach allows tip/tilt alignments to be automated about any point in space, such as a beam waist, a focal point, the cleaved face of a fiber, or the optical axis of a waveguide- ideal for MEMS packaging automation and array alignment. Meanwhile, patented new low-cost settling-enhancement technology has been applied in applications ranging from air-bearing long-travel stages to subnanometer-resolution piezo positioners to advance resolution and process cycle-times in sensitive applications such as optical coupling characterization and fiber Bragg grating generation. Background, examples and metrics are discussed, providing an up-to-date industry overview of available solutions.

  15. Counterpropagating wave acoustic particle manipulation device for the effective manufacture of composite materials.

    Science.gov (United States)

    Scholz, Marc-S; Drinkwater, Bruce W; Llewellyn-Jones, Thomas M; Trask, Richard S

    2015-10-01

    An ultrasonic assembly device exhibiting broadband behavior and a sacrificial plastic frame is described. This device is used to assemble a variety of microscopic particles differing in size, shape, and material into simple patterns within several host fluids. When the host fluid is epoxy, the assembled materials can be cured and the composite sample extracted from the sacrificial frame. The wideband performance means that within a single device, the wavelength can be varied, leading to control of the length scale of the acoustic radiation force field. We show that glass fibers of 50 μm length and 14 μm diameter can be assembled into a series of stripes separated by hundreds of microns in a time of 0.3 s. Finite element analysis is used to understand the attributes of the device which control its wideband characteristics. The bandwidth is shown to be governed by the damping produced by a combination of the plastic frame and the relatively large volume of the fluid particle mixture. The model also reveals that the acoustic radiation forces are a maximum near the substrate of the device, which is in agreement with experimental observations. The device is extended to 8-transducers and used to assemble more complex particle distributions.

  16. Magnetic-bubble devices

    International Nuclear Information System (INIS)

    Fairholme, R.J.

    1978-01-01

    Magnetic bubbles were first described only ten years ago when research workers were discussing orthoferrites containing μm diameter bubbles. However, problems of material fabrication limit crystals to a few mm across which severely curtailed device development. Since then materials have changed and rare-earth-iron garnet films can be grown up 3 inches in diameter with bubble diameters down to sizes below 1 μm. The first commercial products have device capacities in the range 64 000 to 100 000 bits with bubble diameters between 4 and 6 μm. Chip capacities of 1 Mbit are presently under development in the laboratory, as are new techniques to use submicrometre bubbles. The operation and fabrication of a bubble device is described using the serial loop devices currently being manufactured at Plessey as models. Chip organization is one important variable which directly affects the access time. A range of access times and capacities is available which offers a wide range of market opportunities, ranging from consumer products to fixed head disc replacements. some of the application areas are described. (author)

  17. Nanomanufacturing : nano-structured materials made layer-by-layer.

    Energy Technology Data Exchange (ETDEWEB)

    Cox, James V.; Cheng, Shengfeng; Grest, Gary Stephen; Tjiptowidjojo, Kristianto (University of New Mexico); Reedy, Earl David, Jr.; Fan, Hongyou; Schunk, Peter Randall; Chandross, Michael Evan; Roberts, Scott A.

    2011-10-01

    Large-scale, high-throughput production of nano-structured materials (i.e. nanomanufacturing) is a strategic area in manufacturing, with markets projected to exceed $1T by 2015. Nanomanufacturing is still in its infancy; process/product developments are costly and only touch on potential opportunities enabled by growing nanoscience discoveries. The greatest promise for high-volume manufacturing lies in age-old coating and imprinting operations. For materials with tailored nm-scale structure, imprinting/embossing must be achieved at high speeds (roll-to-roll) and/or over large areas (batch operation) with feature sizes less than 100 nm. Dispersion coatings with nanoparticles can also tailor structure through self- or directed-assembly. Layering films structured with these processes have tremendous potential for efficient manufacturing of microelectronics, photovoltaics and other topical nano-structured devices. This project is designed to perform the requisite R and D to bring Sandia's technology base in computational mechanics to bear on this scale-up problem. Project focus is enforced by addressing a promising imprinting process currently being commercialized.

  18. In vivo polymerization and manufacturing of wires and supercapacitors in plants

    Science.gov (United States)

    Stavrinidou, Eleni; Nilsson, K. Peter R.; Singh, Sandeep Kumar; Franco-Gonzalez, Juan Felipe; Volkov, Anton V.; Jonsson, Magnus P.; Grimoldi, Andrea; Elgland, Mathias; Zozoulenko, Igor V.; Berggren, Magnus

    2017-01-01

    Electronic plants, e-Plants, are an organic bioelectronic platform that allows electronic interfacing with plants. Recently we have demonstrated plants with augmented electronic functionality. Using the vascular system and organs of a plant, we manufactured organic electronic devices and circuits in vivo, leveraging the internal structure and physiology of the plant as the template, and an integral part of the devices. However, this electronic functionality was only achieved in localized regions, whereas new electronic materials that could be distributed to every part of the plant would provide versatility in device and circuit fabrication and create possibilities for new device concepts. Here we report the synthesis of such a conjugated oligomer that can be distributed and form longer oligomers and polymer in every part of the xylem vascular tissue of a Rosa floribunda cutting, forming long-range conducting wires. The plant’s structure acts as a physical template, whereas the plant’s biochemical response mechanism acts as the catalyst for polymerization. In addition, the oligomer can cross through the veins and enter the apoplastic space in the leaves. Finally, using the plant’s natural architecture we manufacture supercapacitors along the stem. Our results are preludes to autonomous energy systems integrated within plants and distribute interconnected sensor–actuator systems for plant control and optimization. PMID:28242683

  19. Analysis and simulation of semiconductor devices

    CERN Document Server

    Selberherr, Siegfried

    1984-01-01

    The invention of semiconductor devices is a fairly recent one, considering classical time scales in human life. The bipolar transistor was announced in 1947, and the MOS transistor, in a practically usable manner, was demonstrated in 1960. From these beginnings the semiconductor device field has grown rapidly. The first integrated circuits, which contained just a few devices, became commercially available in the early 1960s. Immediately thereafter an evolution has taken place so that today, less than 25 years later, the manufacture of integrated circuits with over 400.000 devices per single chip is possible. Coincident with the growth in semiconductor device development, the literature concerning semiconductor device and technology issues has literally exploded. In the last decade about 50.000 papers have been published on these subjects. The advent of so called Very-Large-Scale-Integration (VLSI) has certainly revealed the need for a better understanding of basic device behavior. The miniaturization of the s...

  20. 40 CFR 60.714 - Installation of monitoring devices and recordkeeping.

    Science.gov (United States)

    2010-07-01

    ... to the manufacturer's specifications, prior to the initial performance tests in locations such that... in § 60.713(b)(2), (3), (4), (5), or (6) (which include control device efficiency determinations... gas streams would be monitored if the percent control device efficiency is used as the basis for...

  1. Lithography-based addtive manufacture of ceramic biodevices with design-controlled surface topographies

    OpenAIRE

    Blas Romero, Adrián de; Pfaffinger, Markus; Mitteramskogler, Gerald; Schwentenwein, Martin; Jellinek, Christopher; Homa, Johannes; Díaz Lantada, Andrés; Stampfl, Jürgen

    2017-01-01

    The possibility of manufacturing textured materials and devices, with surface properties controlled from the design stage, instead of being the result of machining processes or chemical attacks, is a key factor for the incorporation of advanced functionalities to a wide set of micro- and nanosystems. High-precision additive manufacturing (AM) technologies based on photopolymerization, together with the use of fractal models linked to computer-aided design tools, allow for a precise definit...

  2. "Current Good Manufacturing Practices" and the Federal Food, Drug and Cosmetic Act

    OpenAIRE

    Goldstein, Beth F.

    1995-01-01

    The Food and Drug Administration (hereinafter, FDA) regulates food, drugs, and cosmetics in order to ensure that these products are safe and truthfully labelled. As part of its responsibilities under the Federal Food, Drug, and Cosmetic Act (hereinafter, Act), the FDA monitors the manufacturing practices of companies involved in the production of food, drugs, and medical devices. The manufacturing practices used by these companies must comply with certain standards, identified in the Act as "...

  3. Microfabricated fuel heating value monitoring device

    Science.gov (United States)

    Robinson, Alex L [Albuquerque, NM; Manginell, Ronald P [Albuquerque, NM; Moorman, Matthew W [Albuquerque, NM

    2010-05-04

    A microfabricated fuel heating value monitoring device comprises a microfabricated gas chromatography column in combination with a catalytic microcalorimeter. The microcalorimeter can comprise a reference thermal conductivity sensor to provide diagnostics and surety. Using microfabrication techniques, the device can be manufactured in production quantities at a low per-unit cost. The microfabricated fuel heating value monitoring device enables continuous calorimetric determination of the heating value of natural gas with a 1 minute analysis time and 1.5 minute cycle time using air as a carrier gas. This device has applications in remote natural gas mining stations, pipeline switching and metering stations, turbine generators, and other industrial user sites. For gas pipelines, the device can improve gas quality during transfer and blending, and provide accurate financial accounting. For industrial end users, the device can provide continuous feedback of physical gas properties to improve combustion efficiency during use.

  4. Advances in multiscale modeling of materials behavior: from nano to macro scales

    International Nuclear Information System (INIS)

    Zbib, Hussein M.

    2004-01-01

    Full text.The development of micromechanical devices, thin films, nano layered structures and nano composite coating materials, such as those used in microelectronics, transportation, medical diagnostics and implant industries, requires the utilization of materials that possess a high degree of material reliability, structural stability, mechanical strength, high ductility, toughness and resistance to fracture and fatigue. To achieve these properties many of these devices can be constructed from micro/nano structured materials, which often exhibit enhanced mechanical strength and ductility when compared to conventional materials. However, although the promise of such materials has been demonstrated in laboratories, it has not made inroads into commercial manufacturing in the area of structural materials. A primary impediment to bringing these technologies to the market is the inability to scale up from small scale laboratory experiments to manufacturing methods. Our work at WSU has been to develop theories and computational tools, verified by experiments, which are required to understand and design micro and nano structured materials for various structural applications. The results of this work have a major impact on this emerging industry and are being used in many national and international research institutes

  5. Flexible devices: from materials, architectures to applications

    Science.gov (United States)

    Zou, Mingzhi; Ma, Yue; Yuan, Xin; Hu, Yi; Liu, Jie; Jin, Zhong

    2018-01-01

    Flexible devices, such as flexible electronic devices and flexible energy storage devices, have attracted a significant amount of attention in recent years for their potential applications in modern human lives. The development of flexible devices is moving forward rapidly, as the innovation of methods and manufacturing processes has greatly encouraged the research of flexible devices. This review focuses on advanced materials, architecture designs and abundant applications of flexible devices, and discusses the problems and challenges in current situations of flexible devices. We summarize the discovery of novel materials and the design of new architectures for improving the performance of flexible devices. Finally, we introduce the applications of flexible devices as key components in real life. Project supported by the National Key R&D Program of China (Nos. 2017YFA0208200, 2016YFB0700600, 2015CB659300), the National Natural Science Foundation of China (Nos. 21403105, 21573108), and the Fundamental Research Funds for the Central Universities (No. 020514380107).

  6. Controlling and modelling the wetting properties of III-V semiconductor surfaces using re-entrant nanostructures.

    Science.gov (United States)

    Ng, Wing H; Lu, Yao; Liu, Huiyun; Carmalt, Claire J; Parkin, Ivan P; Kenyon, Anthony J

    2018-02-23

    Inorganic semiconductors such as III-V materials are very important in our everyday life as they are used for manufacturing optoelectronic and microelectronic components with important applications span from energy harvesting to telecommunications. In some applications, these components are required to operate in harsh environments. In these cases, having waterproofing capability is essential. Here we demonstrate design and control of the wettability of indium phosphide based multilayer material (InP/InGaAs/InP) using re-entrant structures fabricated by a fast electron beam lithography technique. This patterning technique enabled us to fabricate highly uniform nanostructure arrays with at least one order of magnitude shorter patterning times compared to conventional electron beam lithography methods. We reduced the surface contact fraction significantly such that the water droplets may be completely removed from our nanostructured surface. We predicted the wettability of our patterned surface by modelling the adhesion energies between the water droplet and both the patterned surface and the dispensing needle. This is very useful for the development of coating-free waterproof optoelectronic and microelectronic components where the coating may hinder the performance of such devices and cause problems with semiconductor fabrication compatibility.

  7. Additive Manufacturing of Biomaterials, Tissues, and Organs.

    Science.gov (United States)

    Zadpoor, Amir A; Malda, Jos

    2017-01-01

    The introduction of additive manufacturing (AM), often referred to as three-dimensional (3D) printing, has initiated what some believe to be a manufacturing revolution, and has expedited the development of the field of biofabrication. Moreover, recent advances in AM have facilitated further development of patient-specific healthcare solutions. Customization of many healthcare products and services, such as implants, drug delivery devices, medical instruments, prosthetics, and in vitro models, would have been extremely challenging-if not impossible-without AM technologies. The current special issue of the Annals of Biomedical Engineering presents the latest trends in application of AM techniques to healthcare-related areas of research. As a prelude to this special issue, we review here the most important areas of biomedical research and clinical practice that have benefited from recent developments in additive manufacturing techniques. This editorial, therefore, aims to sketch the research landscape within which the other contributions of the special issue can be better understood and positioned. In what follows, we briefly review the application of additive manufacturing techniques in studies addressing biomaterials, (re)generation of tissues and organs, disease models, drug delivery systems, implants, medical instruments, prosthetics, orthotics, and AM objects used for medical visualization and communication.

  8. Femtosecond laser pulses for fast 3-D surface profilometry of microelectronic step-structures.

    Science.gov (United States)

    Joo, Woo-Deok; Kim, Seungman; Park, Jiyong; Lee, Keunwoo; Lee, Joohyung; Kim, Seungchul; Kim, Young-Jin; Kim, Seung-Woo

    2013-07-01

    Fast, precise 3-D measurement of discontinuous step-structures fabricated on microelectronic products is essential for quality assurance of semiconductor chips, flat panel displays, and photovoltaic cells. Optical surface profilers of low-coherence interferometry have long been used for the purpose, but the vertical scanning range and speed are limited by the micro-actuators available today. Besides, the lateral field-of-view extendable for a single measurement is restricted by the low spatial coherence of broadband light sources. Here, we cope with the limitations of the conventional low-coherence interferometer by exploiting unique characteristics of femtosecond laser pulses, i.e., low temporal but high spatial coherence. By scanning the pulse repetition rate with direct reference to the Rb atomic clock, step heights of ~69.6 μm are determined with a repeatability of 10.3 nm. The spatial coherence of femtosecond pulses provides a large field-of-view with superior visibility, allowing for a high volume measurement rate of ~24,000 mm3/s.

  9. Data transfer of structural strain by wireless device

    International Nuclear Information System (INIS)

    Kim, Chi Yeop; Kwon, Il Bum; Choi, Man Yong

    2002-01-01

    The wireless measurement device was instrumented to measure the stress distribution of structures. This device was composed of the data recorder, transmitter and receiver with PC interface. The specification of this device was as follows: Analog inputs of 8 channels, 400 MHz transmitted frequency, and the transmitted power of 5 mW. This device was manufactured as the sending and receiving system of long-term strains to calculate the stress distribution. The 4 channel strains of 150 Hz were well transmitted by this device. Also, these strain data was able to show the stress distribution of the experimental specimen. Furthermore, the data quantity was equal to the data quantity during three months at 1 hour sampling time

  10. Nanoscale Device Properties of Tellurium-based Chalcogenide Compounds

    Science.gov (United States)

    Dahal, Bishnu R.

    The great progress achieved in miniaturization of microelectronic devices has now reached a distinct bottleneck, as devices are starting to approach the fundamental fabrication and performance limit. Even if a major breakthrough is made in the fabrication process, these scaled down electronic devices will not function properly since the quantum effects can no longer be neglected in the nanoscale regime. Advances in nanotechnology and new materials are driving novel technologies for future device applications. Current microelectronic devices have the smallest feature size, around 10 nm, and the industry is planning to switch away from silicon technology in the near future. The new technology will be fundamentally different. There are several leading technologies based on spintronics, tunneling transistors, and the newly discovered 2-dimensional material systems. All of these technologies are at the research level, and are far from ready for use in making devices in large volumes. This dissertation will focus on a very promising material system, Te-based chalcogenides, which have potential applications in spintronics, thermoelectricity and topological insulators that can lead to low-power-consumption electronics. Very recently it was predicted and experimentally observed that the spin-orbit interaction in certain materials can lead to a new electronic state called topological insulating phase. The topological insulator, like an ordinary insulator, has a bulk energy gap separating the highest occupied electronic band from the lowest empty band. However, the surface states in the case of a three-dimensional or edge states in a two-dimensional topological insulator allow electrons to conduct at the surface, due to the topological character of the bulk wavefunctions. These conducting states are protected by time-reversal symmetry, and cannot be eliminated by defects or chemical passivation. The edge/surface states satisfy Dirac dispersion relations, and hence the physics

  11. Neurovascular Modeling: Small-Batch Manufacturing of Silicone Vascular Replicas

    Science.gov (United States)

    Chueh, J.Y.; Wakhloo, A.K.; Gounis, M.J.

    2009-01-01

    BACKGROUND AND PURPOSE Realistic, population based cerebrovascular replicas are required for the development of neuroendovascular devices. The objective of this work was to develop an efficient methodology for manufacturing realistic cerebrovascular replicas. MATERIALS AND METHODS Brain MR angiography data from 20 patients were acquired. The centerline of the vasculature was calculated, and geometric parameters were measured to describe quantitatively the internal carotid artery (ICA) siphon. A representative model was created on the basis of the quantitative measurements. Using this virtual model, we designed a mold with core-shell structure and converted it into a physical object by fused-deposit manufacturing. Vascular replicas were created by injection molding of different silicones. Mechanical properties, including the stiffness and luminal coefficient of friction, were measured. RESULTS The average diameter, length, and curvature of the ICA siphon were 4.15 ± 0.09 mm, 22.60 ± 0.79 mm, and 0.34 ± 0.02 mm-1 (average ± standard error of the mean), respectively. From these image datasets, we created a median virtual model, which was transformed into a physical replica by an efficient batch-manufacturing process. The coefficient of friction of the luminal surface of the replica was reduced by up to 55% by using liquid silicone rubber coatings. The modulus ranged from 0.67 to 1.15 MPa compared with 0.42 MPa from human postmortem studies, depending on the material used to make the replica. CONCLUSIONS Population-representative, smooth, and true-to-scale silicone arterial replicas with uniform wall thickness were successfully built for in vitro neurointerventional device-testing by using a batch-manufacturing process. PMID:19321626

  12. Microcomponents manufacturing for precise devices by copper vapor laser

    Science.gov (United States)

    Gorny, Sergey; Nikonchuk, Michail O.; Polyakov, Igor V.

    2001-06-01

    This paper presents investigation results of drilling of metal microcomponents by copper vapor laser. The laser consists of master oscillator - spatial filter - amplifier system, electronics switching with digital control of laser pulse repetition rate and quantity of pulses, x-y stage with computer control system. Mass of metal, removed by one laser pulse, is measured and defined by means of diameter and depth of holes. Interaction of next pulses on drilled material is discussed. The difference between light absorption and metal evaporation processes is considered for drilling and cutting. Efficiency of drilling is estimated by ratio of evaporation heat and used laser energy. Maximum efficiency of steel cutting is calculated with experimental data of drilling. Applications of copper vapor laser for manufacturing is illustrated by such microcomponents as pin guide plate for printers, stents for cardio surgery, encoded disks for security systems and multiple slit masks for spectrophotometers.

  13. LEGO firm devices for atomic industry

    International Nuclear Information System (INIS)

    Makarov, P.V.; Egunova, E.M.

    2007-01-01

    Analytical problems of atomic industry enterprises are considered. Possibilities of LECO firm devices for following analysis kinds: 1) ore materials under ore processing; 2) chemical composition analysis and properties of metals and oxides under implementation of production manufacturing for nuclear industry; 3) spectral analysis; 4) structure analysis and properties of metallic materials - are shown. All above-listed analysis methods are applying at quality control operation. Examples of LECO device application at different nuclear energy enterprises of Russia, Kazakhstan, and other CIS and Baltic countries are cited

  14. Mirror, mirror on the wall--evaluating Fair Market Value for manufacturer-physician consulting arrangements.

    Science.gov (United States)

    Eaton, Fred; Reid, Jaimee

    2010-01-01

    Pharmaceutical and medical device manufacturers contract with thousands of physicians each year, and struggle to comply with the Fair Market Value requirements of the Anti-Kickback Statute's "personal services" safe harbor. Consultant arrangements between physicians and manufactures have come under increasing scrutiny by regulators. In 2007, the five leading Hip & Knee manufacturers entered into settlement agreements related to their contract practices with physician consultants. Government sources do not provide guidance for calculating Fair Market Value; however, this article recommends four principles to use when evaluating Fair Market Value methodologies.

  15. "In the same boat": considerations on the partnership between healthcare providers and manufacturers of health IT products and medical devices.

    Science.gov (United States)

    Bergh, B

    2009-01-01

    To assess the current culture of cooperation between healthcare providers (HCPs) and the healthcare industry (HCI) in the domain of Health-IT and Engineering (HITE) and identify possible strategies for improvement. Based on reports in the literature and personal experience, major challenges were identified, the current ways of cooperation defined and their relation to each other analyzed. Four main challenges were identified for both sides involving: products and functionality, integration of IT-Systems with each other and with medical devices, usability, visions and strategic management. None of the four defined cooperation categories cover all aspects of the challenges, but cooperation in small, dedicated groups appeared to provide the most advantages. An increased participation of HCPs in standardization activities is crucial either directly or indirectly via professional or scientific organizations. Cooperation between provider management (hospitals, clinics or systems) and manufacturers of health IT products will be the key factor for success of the HCI while providing substantial benefits for providers. Both sides should invest heavily in such efforts.

  16. Vacuum mechatronics

    Science.gov (United States)

    Hackwood, Susan; Belinski, Steven E.; Beni, Gerardo

    1989-01-01

    The discipline of vacuum mechatronics is defined as the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. The importance of vacuum mechatronics is growing with an increased application of vacuum in space studies and in manufacturing for material processing, medicine, microelectronics, emission studies, lyophylisation, freeze drying and packaging. The quickly developing field of vacuum mechatronics will also be the driving force for the realization of an advanced era of totally enclosed clean manufacturing cells. High technology manufacturing has increasingly demanding requirements for precision manipulation, in situ process monitoring and contamination-free environments. To remove the contamination problems associated with human workers, the tendency in many manufacturing processes is to move towards total automation. This will become a requirement in the near future for e.g., microelectronics manufacturing. Automation in ultra-clean manufacturing environments is evolving into the concept of self-contained and fully enclosed manufacturing. A Self Contained Automated Robotic Factory (SCARF) is being developed as a flexible research facility for totally enclosed manufacturing. The construction and successful operation of a SCARF will provide a novel, flexible, self-contained, clean, vacuum manufacturing environment. SCARF also requires very high reliability and intelligent control. The trends in vacuum mechatronics and some of the key research issues are reviewed.

  17. Devices for measuring the capacitance of micromechanical sensors of mobile robots navigation systems and its deviation from the nominal value

    Directory of Open Access Journals (Sweden)

    Rudyk A.V.

    2016-12-01

    Full Text Available The article describes methods of constructing devices for measuring the capacitance of micromechanical sensors (accelerometers and gyros mobile robots navigation systems and its deviation from the nominal value. A modified diagram of a sigma-delta modulator is offered. It realizes a direct connection capacitive sensor connection to the sigma-delta converter, as a result increased resolution, accuracy and linearity of the conversion. This interface is insensitive to the value of capacitance between the sensor leads and common wire or leakage current to a common wire. Variants of expansion as the nominal of the test capacity and the range of conversion of the relative deviation of the nominal capacity using two integrators are offered. The versions of circuit implementation devices for measuring the capacitance deviation of a micromechanical sensor from the nominal value are designed on the basis of the completed integrated circuit AD7745 / AD7746 and AD7747 of Analog Devices, CAV414 / 424 firm Analog Microelectronics and precision analog microcontroller ADuCM360 / CM361 company ARM Limited.

  18. Low-cost access to development and manufacturing of photonic integrated circuits

    NARCIS (Netherlands)

    Smit, M.K.

    2014-01-01

    Generic photonic integration technology is rapidly gaining popularity. It applies the methodology that is so successful in microelectronics (CMOS technology) to the domain of photonics: providing lowcost access to highly standardized high-performance processes that support integration in a single

  19. The impact of fit manufacturing on green manufacturing: A review

    Science.gov (United States)

    Qi, Ang Nian; Sin, Tan Chan; Fathullah, M.; Lee, C. C.

    2017-09-01

    Fit manufacturing and Green manufacturing are a new trend principle and concept. They are getting popular in industrial. This paper is identifying the impact between Fit manufacturing and Green manufacturing. Besides Fit manufacturing, Lean manufacturing, Agile manufacturing and Sustainable manufacturing gives big impacts to Green Manufacturing. On top of that, this paper also discuss the benefits of applying Fit manufacturing and Green manufacturing in industrial as well as environment. Hence, applications of Fit manufacturing and Green Manufacturing are increasing year by year.

  20. A small-scale, rolled-membrane microfluidic artificial lung designed towards future large area manufacturing.

    Science.gov (United States)

    Thompson, A J; Marks, L H; Goudie, M J; Rojas-Pena, A; Handa, H; Potkay, J A

    2017-03-01

    Artificial lungs have been used in the clinic for multiple decades to supplement patient pulmonary function. Recently, small-scale microfluidic artificial lungs (μAL) have been demonstrated with large surface area to blood volume ratios, biomimetic blood flow paths, and pressure drops compatible with pumpless operation. Initial small-scale microfluidic devices with blood flow rates in the μ l/min to ml/min range have exhibited excellent gas transfer efficiencies; however, current manufacturing techniques may not be suitable for scaling up to human applications. Here, we present a new manufacturing technology for a microfluidic artificial lung in which the structure is assembled via a continuous "rolling" and bonding procedure from a single, patterned layer of polydimethyl siloxane (PDMS). This method is demonstrated in a small-scale four-layer device, but is expected to easily scale to larger area devices. The presented devices have a biomimetic branching blood flow network, 10  μ m tall artificial capillaries, and a 66  μ m thick gas transfer membrane. Gas transfer efficiency in blood was evaluated over a range of blood flow rates (0.1-1.25 ml/min) for two different sweep gases (pure O 2 , atmospheric air). The achieved gas transfer data closely follow predicted theoretical values for oxygenation and CO 2 removal, while pressure drop is marginally higher than predicted. This work is the first step in developing a scalable method for creating large area microfluidic artificial lungs. Although designed for microfluidic artificial lungs, the presented technique is expected to result in the first manufacturing method capable of simply and easily creating large area microfluidic devices from PDMS.