WorldWideScience

Sample records for microelectronic device manufacturing

  1. Microelectronics to nanoelectronics materials, devices & manufacturability

    CERN Document Server

    Kaul, Anupama B

    2012-01-01

    Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena.Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology's Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and

  2. Optical plasma microelectronic devices

    CERN Document Server

    Forati, Ebrahim; Dill, Thyler; Sievenpiper, Dan

    2015-01-01

    The semiconductor channel in conventional microelectronic devices was successfully replaced with an optically triggered gas plasma channel. The combination of DC and laser-induced gas ionizations controls the conductivity of the channel, enabling us to realize different electronic devices such as transistors, switches, modulators, etc. A special micro-scale metasurface was used to enhance the laser-gas interaction, as well as combining it with DC ionization properly. Optical plasma devices benefit form the advantages of plasma/vacuum electronic devices while preserving most of the integrablity of semiconductor based devices.

  3. Photoemission-based microelectronic devices

    Science.gov (United States)

    Forati, Ebrahim; Dill, Tyler J.; Tao, Andrea R.; Sievenpiper, Dan

    2016-11-01

    The vast majority of modern microelectronic devices rely on carriers within semiconductors due to their integrability. Therefore, the performance of these devices is limited due to natural semiconductor properties such as band gap and electron velocity. Replacing the semiconductor channel in conventional microelectronic devices with a gas or vacuum channel may scale their speed, wavelength and power beyond what is available today. However, liberating electrons into gas/vacuum in a practical microelectronic device is quite challenging. It often requires heating, applying high voltages, or using lasers with short wavelengths or high powers. Here, we show that the interaction between an engineered resonant surface and a low-power infrared laser can cause enough photoemission via electron tunnelling to implement feasible microelectronic devices such as transistors, switches and modulators. The proposed photoemission-based devices benefit from the advantages of gas-plasma/vacuum electronic devices while preserving the integrability of semiconductor-based devices.

  4. Apparatus for assembly of microelectronic devices

    Energy Technology Data Exchange (ETDEWEB)

    Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis; Lavin, Judith Maria; Resnick, Paul J.

    2017-09-12

    An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

  5. Laser processing of ceramics for microelectronics manufacturing

    Science.gov (United States)

    Sposili, Robert S.; Bovatsek, James; Patel, Rajesh

    2017-03-01

    Ceramic materials are used extensively in the microelectronics, semiconductor, and LED lighting industries because of their electrically insulating and thermally conductive properties, as well as for their high-temperature-service capabilities. However, their brittleness presents significant challenges for conventional machining processes. In this paper we report on a series of experiments that demonstrate and characterize the efficacy of pulsed nanosecond UV and green lasers in machining ceramics commonly used in microelectronics manufacturing, such as aluminum oxide (alumina) and aluminum nitride. With a series of laser pocket milling experiments, fundamental volume ablation rate and ablation efficiency data were generated. In addition, techniques for various industrial machining processes, such as shallow scribing and deep scribing, were developed and demonstrated. We demonstrate that lasers with higher average powers offer higher processing rates with the one exception of deep scribes in aluminum nitride, where a lower average power but higher pulse energy source outperformed a higher average power laser.

  6. Toward atom probe tomography of microelectronic devices

    Science.gov (United States)

    Larson, D. J.; Lawrence, D.; Lefebvre, W.; Olson, D.; Prosa, T. J.; Reinhard, D. A.; Ulfig, R. M.; Clifton, P. H.; Bunton, J. H.; Lenz, D.; Olson, J. D.; Renaud, L.; Martin, I.; Kelly, T. F.

    2011-11-01

    Atom probe tomography and scanning transmission electron microscopy has been used to analyze a commercial microelectronics device prepared by depackaging and focused ion beam milling. Chemical and morphological data are presented from the source, drain and channel regions, and part of the gate oxide region of an Intel® i5-650 p-FET device demonstrating feasibility in using these techniques to investigate commercial chips.

  7. Advances in Microelectronics for Implantable Medical Devices

    Directory of Open Access Journals (Sweden)

    Andreas Demosthenous

    2014-01-01

    Full Text Available Implantable medical devices provide therapy to treat numerous health conditions as well as monitoring and diagnosis. Over the years, the development of these devices has seen remarkable progress thanks to tremendous advances in microelectronics, electrode technology, packaging and signal processing techniques. Many of today’s implantable devices use wireless technology to supply power and provide communication. There are many challenges when creating an implantable device. Issues such as reliable and fast bidirectional data communication, efficient power delivery to the implantable circuits, low noise and low power for the recording part of the system, and delivery of safe stimulation to avoid tissue and electrode damage are some of the challenges faced by the microelectronics circuit designer. This paper provides a review of advances in microelectronics over the last decade or so for implantable medical devices and systems. The focus is on neural recording and stimulation circuits suitable for fabrication in modern silicon process technologies and biotelemetry methods for power and data transfer, with particular emphasis on methods employing radio frequency inductive coupling. The paper concludes by highlighting some of the issues that will drive future research in the field.

  8. Multilayered Microelectronic Device Package With An Integral Window

    Science.gov (United States)

    Peterson, Kenneth A.; Watson, Robert D.

    2004-10-26

    A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

  9. Life cycle assessment applied to the sector of microelectronic devices

    Science.gov (United States)

    Matarazzo, Agata; Ingrao, Carlo; Clasadonte, Maria Teresa

    2016-07-01

    This work is about the application of LCA to the ends of the environmental assessment of pure-silicon wafers production. The input-data quantification is realized studying two microelectronic devices and presenting schematically tables and graphs, to be easily interpreted. This will allow help the reader to individuate, clearly and immediately, the materials flows and the relationships among the different steps of the production process. The material flows, in terms of raw materials use and energy consumption, were studied using the data provided by a firm involved in the microelectronic device production field. The two devices environmental analysis was developed considering potential effects such as Acidification, Eutrophication, Ozone reduction, Global warming, Ozone photochemical formation, Human Toxicity.

  10. Interfacial adhesion for microelectronics and MEMS devices

    Science.gov (United States)

    Kennedy, Marian Siobhan

    2007-12-01

    The reliability of thin film systems is important to the continued development of microelectronic and micro-electro-mechanical systems. Most often, reliability of these systems is tied to the ability of the films to remain adhered to its substrate. By measuring the amount of energy to separate the film, interfacial fracture energy, and prediciting trends researchers can predicts film lifetimes. Recent work to measure this energy has resulted in several different testing techniques including spontaneous buckling, indentation induced delamination and four point bending. Literature has shown good agreement between delamination test methods, but only when energy dissipation into the substrate is minimized. Using a W/Si system, the effect of energy dissipation was shown to decrease from 0.6 J/m2 to 0.2 J/m2 between different methods; one where the only fracture was along the interface and the other where cracking also occurred in the film and substrate. For systems where fracture only occurs along the interface, such as Au/Si, the calculated fracture energies are identical if the energy put into the system is kept near the needed strain energy to cause delamination. Overlayers of different stresses and thickness on Au/Si showed that the adhesion energies could change by a factor of three (Chapter 3). This dependence on applied energy is also shown when comparisons of four point bending and stressed overlayer test methods were completed on Pt/Si systems. The fracture energies of Pt/Ti/SiO2 were studied using four-point bending and compressive overlayers. Varying the thickness of the Ti film from 2 to 17 nm in a Pt/Ti/SiO2 system, both test methods showed an increase of adhesion energy until the nominal Ti thickness was 12nm. Then this adhesion energy began to decrease. This decrease was due to an increase in the Pt grain size after a nominal 12nm thickness (Chapter 4 and 5). While the trends in energy release rate are similar, the magnitude of the toughness between the

  11. Optimization of Microelectronic Devices for Sensor Applications

    Science.gov (United States)

    Cwik, Tom; Klimeck, Gerhard

    2000-01-01

    The NASA/JPL goal to reduce payload in future space missions while increasing mission capability demands miniaturization of active and passive sensors, analytical instruments and communication systems among others. Currently, typical system requirements include the detection of particular spectral lines, associated data processing, and communication of the acquired data to other systems. Advances in lithography and deposition methods result in more advanced devices for space application, while the sub-micron resolution currently available opens a vast design space. Though an experimental exploration of this widening design space-searching for optimized performance by repeated fabrication efforts-is unfeasible, it does motivate the development of reliable software design tools. These tools necessitate models based on fundamental physics and mathematics of the device to accurately model effects such as diffraction and scattering in opto-electronic devices, or bandstructure and scattering in heterostructure devices. The software tools must have convenient turn-around times and interfaces that allow effective usage. The first issue is addressed by the application of high-performance computers and the second by the development of graphical user interfaces driven by properly developed data structures. These tools can then be integrated into an optimization environment, and with the available memory capacity and computational speed of high performance parallel platforms, simulation of optimized components can proceed. In this paper, specific applications of the electromagnetic modeling of infrared filtering, as well as heterostructure device design will be presented using genetic algorithm global optimization methods.

  12. Thermal measurement. Nanoscale temperature mapping in operating microelectronic devices.

    Science.gov (United States)

    Mecklenburg, Matthew; Hubbard, William A; White, E R; Dhall, Rohan; Cronin, Stephen B; Aloni, Shaul; Regan, B C

    2015-02-06

    Modern microelectronic devices have nanoscale features that dissipate power nonuniformly, but fundamental physical limits frustrate efforts to detect the resulting temperature gradients. Contact thermometers disturb the temperature of a small system, while radiation thermometers struggle to beat the diffraction limit. Exploiting the same physics as Fahrenheit's glass-bulb thermometer, we mapped the thermal expansion of Joule-heated, 80-nanometer-thick aluminum wires by precisely measuring changes in density. With a scanning transmission electron microscope and electron energy loss spectroscopy, we quantified the local density via the energy of aluminum's bulk plasmon. Rescaling density to temperature yields maps with a statistical precision of 3 kelvin/hertz(-1/2), an accuracy of 10%, and nanometer-scale resolution. Many common metals and semiconductors have sufficiently sharp plasmon resonances to serve as their own thermometers. Copyright © 2015, American Association for the Advancement of Science.

  13. [Physiological and hygienic characteristic of high-precision manufacturing operations in microelectronics].

    Science.gov (United States)

    Kirillov, V F; Mironov, A I; Gadakchan, K A; Mekhova, M M; Spiridonova, V S

    2010-01-01

    It was shown that workers performing high-precision manufacturing operations in microelectronic industry undergo severe visual, nervous and emotional stress combined with significant locomotor load, air deionization and deozonation, bacterial contamination, and UV deficit at their workplaces. These working conditions promote development of negative changes in the visual analyzer, nervous and emotional disorders, disturbances of systemic and regional hemodynamics. Also impaired is the functional state of the upper limb neuromuscular apparatus, central nervous and cardiovascular systems. The proposed certified complex of organizational, sanitary, hygienic, physiological, ergonomic, therapeutic and preventive measures has positive influence on the working capacity of employees in microelectronic industry.

  14. Symmetric miniaturized heating system for active microelectronic devices

    Science.gov (United States)

    McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

    2010-07-01

    To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 °C when the oven operates at 200 °C. The minioven can heat packages from room temperature up to 200 °C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 °C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The device is also subjected to

  15. Symmetric miniaturized heating system for active microelectronic devices.

    Science.gov (United States)

    McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

    2010-07-01

    To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 degrees C when the oven operates at 200 degrees C. The minioven can heat packages from room temperature up to 200 degrees C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 degrees C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The

  16. Virtual thermo-mechanical prototyping of microelectronics devices

    NARCIS (Netherlands)

    Van Driel, W.D.

    2007-01-01

    Microelectronics have pervaded our lives for the past fifty years, with massive penetration into health, mobility, safety and security, communications, education, entertainment and virtually every aspect of human lives. The main technology drivers that enabled this expansion are miniaturization and

  17. Medical device regulation for manufacturers.

    Science.gov (United States)

    McAllister, P; Jeswiet, J

    2003-01-01

    Manufacturers of medical devices are held to a higher standard than manufacturers of many other products due to the potential severity of the consequences of introducing inferior or unsafe products to the market-place. In Canada, the medical device industry is regulated by Health Canada under the Medical Device Regulations of the Food and Drug Act. The Medical Device Regulations define requirements of medical device design, development and manufacture to ensure that products reaching the public are safe and effective. Health Canada also requires that medical device manufacturers maintain distribution records to ensure that devices can be traced to the source and consumers can be contacted successfully in the event that a device is recalled. Medical devices exported from Canada must be compliant with the regulations of the country of import. The Canadian Medical Device Regulations were based on the Medical Device Directives of the European Union thus facilitating approval of Canadian devices for the European market. The United States Food and Drug Administration has separate and distinct requirements for safety and quality of medical devices. While effort has been made to facilitate approval and trade of Canadian medical devices in the United States and the European Union, obtaining approval from multiple regulatory bodies can result in increased device development time and cost. The Global Harmonization Task Force is an organization composed of members from Japanese, Australian, European, Canadian and American medical device regulatory bodies. This organization was formed with the objective of harmonizing medical device regulations in an effort to facilitate international trade and standardize the quality of medical devices available to all countries. This paper discusses the requirements that must be met by manufacturers when designing and manufacturing medical devices.

  18. Radiation hardness improvement of analog front-end microelectronic devices for particle accelerator

    Science.gov (United States)

    Miroshnichenko, A. G.; Rodin, A. S.; Bakerenkov, A. S.; Felitsyn, V. A.

    2016-10-01

    Series of schematic techniques for increasing radiation hardness of the current mirrors is developed. These techniques can be used for the design of analog front-end microelectronic devices based on the operational amplifiers. The circuit simulation of radiation degradation of current transmission coefficients was performed for various circuit solutions in LTSpice software.

  19. A flexible and robust soft-error testing system for microelectronic devices and integrated circuits

    Institute of Scientific and Technical Information of China (English)

    王晓辉; 杨振雷; 童腾; 苏弘; 刘杰; 张战刚; 古松; 刘天奇; 孔洁; 赵兴文

    2015-01-01

    Single event effects (SEEs) induced by radiations become a significant reliability challenge for modern elec-tronic systems. To evaluate SEEs susceptibility for microelectronic devices and integrated circuits (ICs), an SEE testing system with flexibility and robustness was developed at Heavy Ion Research Facility in Lanzhou (HIRFL). The system is compatible with various types of microelectronic devices and ICs, and supports plenty of complex and high-speed test schemes and plans for the irradiated devices under test (DUTs). Thanks to the combination of meticulous circuit design and the hardened logic design, the system has additional performances to avoid an overheated situation and irradiations by stray radiations. The system has been tested and verified by experiments for irradiating devices at HIRFL.

  20. Advanced modeling and simulation to design and manufacture high performance and reliable advanced microelectronics and microsystems.

    Energy Technology Data Exchange (ETDEWEB)

    Nettleship, Ian (University of Pittsburgh, Pittsburgh, PA); Hinklin, Thomas; Holcomb, David Joseph; Tandon, Rajan; Arguello, Jose Guadalupe, Jr. (,; .); Dempsey, James Franklin; Ewsuk, Kevin Gregory; Neilsen, Michael K.; Lanagan, Michael (Pennsylvania State University, University Park, PA)

    2007-07-01

    An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.

  1. A quantum computer based on recombination processes in microelectronic devices

    Science.gov (United States)

    Theodoropoulos, K.; Ntalaperas, D.; Petras, I.; Konofaos, N.

    2005-01-01

    In this paper a quantum computer based on the recombination processes happening in semiconductor devices is presented. A "data element" and a "computational element" are derived based on Schokley-Read-Hall statistics and they can later be used to manifest a simple and known quantum computing process. Such a paradigm is shown by the application of the proposed computer onto a well known physical system involving traps in semiconductor devices.

  2. A quantum computer based on recombination processes in microelectronic devices

    Energy Technology Data Exchange (ETDEWEB)

    Theodoropoulos, K [Computer Engineering and Informatics Department, University of Patras, Patras (Greece); Ntalaperas, D [Computer Engineering and Informatics Department, University of Patras, Patras (Greece); Research Academic Computer Technology Institute, Riga Feraiou 61, 26110, Patras (Greece); Petras, I [Computer Engineering and Informatics Department, University of Patras, Patras (Greece); Konofaos, N [Computer Engineering and Informatics Department, University of Patras, Patras (Greece)

    2005-01-01

    In this paper a quantum computer based on the recombination processes happening in semiconductor devices is presented. A 'data element' and a 'computational element' are derived based on Schokley-Read-Hall statistics and they can later be used to manifest a simple and known quantum computing process. Such a paradigm is shown by the application of the proposed computer onto a well known physical system involving traps in semiconductor devices.

  3. CALIBRATION OF DEVICES FOR MEASURING ELEMENTS OF MICRO-ELECTRONIC STRUCTURES

    OpenAIRE

    G. Trapashko

    2012-01-01

    Development of microelectronics requires solution of the problem ensuring unity of linear measurements in a submicron range. The problem can be solved on the condition that calibration of measuring devices shall be made in accordance with reference samples that is a short length scale.While making calibration of measuring equipment with the help of a reference measure it is important to investigate components of the method accuracy and their influence on measuring results. The paper considers...

  4. Failure analysis concepts for microelectronics technologies and manufacturing of the future

    Science.gov (United States)

    Boit, Christian; Weiland, Rainer; Olbrich, A.; Muehle, U.; Simmnacher, B.

    2001-04-01

    The answer of Failure Analysis (F/A) to the technological innovations in microelectronics in the past was: with a slight evolution (i.e. optical microscope -- SEM -- TEM) we can do it. The innovations around the corner today enforce a paradigm shift in F/A to match the challenges by increasing wafer sizes, decreasing feature sizes and new package concepts. This presentation highlights various aspects of the small feature size time bomb (how TEM becomes mandatory and obsolete synchronously), the completely new inline F/A approach on productive wafers inevitable from 300 nm wafer size on, and the reinvention of electrical fail site localization techniques, now from the backside of the die due to new package concepts and innumerable metal layers. Even if F/A manages to overcome all these challenges from a technical point of view, the according revolution in terms of methods, skills and tools implies a cost explosion unless F/A becomes an active part in the business process and the projects of development and manufacturing. This holds even under the assumption that a rising number of today's F/A problems will be solved by modern testing techniques. Only this way F/A can deliver custom-tailored solutions that are optimized in productivity and time to result, and that fulfill the cost reduction requirements of semiconductor products.

  5. Characterization of the Effect of Au/Al Bondpad Corrosion on Microelectronic Device Reliability

    Energy Technology Data Exchange (ETDEWEB)

    BRAITHWAITE,JEFFREY W.; MICHAEL,JOSEPH R.; PETERSON,DAVID W.; ROBINSON,DAVID G.; SORENSEN,NEIL R.; STRIZICH,M.P.

    1999-10-07

    A methodology has been established to predict the effect of atmospheric corrosion on the reliability of plastic encapsulated microelectronic (PEM) devices. New experimental techniques were developed to directly characterize the Al/Au wirebond interface where corrosion primarily occurs. A deterministic empirical model describing wirebond degradation as a function of environmental conditions was generated. To demonstrate how this model can be used to determine corrosion effects on device reliability, a numerical simulation was performed on a three-lead voltage reference device. Surface reaction rate constants, environmental variables and the defect characteristics of the encapsulant were treated as distributed parameters. A Sandia-developed analytical framework (CRAX{trademark}) was used to include uncertainty in the analysis and directly calculate reliability.

  6. Simulation of ion beam induced current in radiation detectors and microelectronic devices.

    Energy Technology Data Exchange (ETDEWEB)

    Vizkelethy, Gyorgy

    2009-10-01

    Ionizing radiation is known to cause Single Event Effects (SEE) in a variety of electronic devices. The mechanism that leads to these SEEs is current induced by the radiation in these devices. While this phenomenon is detrimental in ICs, this is the basic mechanism behind the operation of semiconductor radiation detectors. To be able to predict SEEs in ICs and detector responses we need to be able to simulate the radiation induced current as the function of time. There are analytical models, which work for very simple detector configurations, but fail for anything more complex. On the other end, TCAD programs can simulate this process in microelectronic devices, but these TCAD codes costs hundreds of thousands of dollars and they require huge computing resources. In addition, in certain cases they fail to predict the correct behavior. A simulation model based on the Gunn theorem was developed and used with the COMSOL Multiphysics framework.

  7. Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

    Energy Technology Data Exchange (ETDEWEB)

    Smith, J.H.

    1996-11-01

    An overview of the surface micromachining program at the Microelectronics Development Laboratory of Sandia National Laboratories is presented. Development efforts are underway for a variety of surface micromachined sensors and actuators for both defense and commercial applications. A technology that embeds micromechanical devices below the surface of the wafer prior to microelectronics fabrication has been developed for integrating microelectronics with surface-micromachined micromechanical devices. The application of chemical-mechanical polishing to increase the manufacturability of micromechanical devices is also presented.

  8. New Polymer Materials for Microelectronics Packaging

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    @@ Researchers at the CAS Institute of Chemistry (ICCAS) have made breakthrough progress in developing the manufacturing technology of advanced polymer materials for microelectronics packaging applications. The advanced integrated circuit (IC) packaging polymer materials, including photoimageable polyimide resins and liquid epoxy underfills, are a key issue for FC-BGA/CSP(flip chip-ball grill array/chip scale packaging) which is the main stream for the next generation of microelectronics devices. With the down-sizing, thinning and high I/O (input/output) of IC chips, microelectronics packaging is now facing a big technology challenge.

  9. Deconstructing energy use in microelectronics manufacturing: an experimental case study of a MEMS fabrication facility.

    Science.gov (United States)

    Branham, Matthew S; Gutowski, Timothy G

    2010-06-01

    Semiconductors are quite energy intensive to manufacture on the basis of energy required per mass of material processed. This analysis draws on original data from a case study of the Analog Devices Micromachined Products Division MEMS fabrication facility to examine the consequence of process rate on the energy intensity of semiconductor manufacturing. We trace the impact of process rate on energy intensity at different length scales, first presenting top-down data, then results of a bottom-up study, and concluding with individual process analyses. Interestingly, while production increased by almost a factor of 2 over the course of the study, energy demand remained virtually constant. At its most efficient, 270 kWh of electricity were required per six inch wafer in the manufacture of the MEMS devices produced at the fabrication facility. In part, the large amount of energy required per unit output is a function of the preponderance of energy used by support equipment; our data show that the facility support equipment is responsible for 58% of total energy requirements.

  10. Microelectronic image sensors: A report from the Charge Transfer Device (CTD) team at FOA 3

    Science.gov (United States)

    Engstroem, O.; Persson, S. T.; Pettersson, H.; Ryden, K. H.

    1985-05-01

    Three concepts of microelectronic image sensors where the photo effects are based on the properties of interfaces between silicon and metal silicides or insulators were investigated. An infrared sensitive image sensor for the 3 to 5 micron wavelength range was prepared. The photosensitive elements, patterned as a 4 x 4 matrix, consist of palladium silicide Schottky-diodes. Addressing of the different picture elements is made from shift registers placed on the same silicon chip. A concept for the storage of optical information was created. The basic principle relies on the possibilities to store electrons in deep lying energy levels in an insulator layer grown on silicon. A metal-insulator-semiconductor device, where the possibility of interaction between two images at the insulator-semiconductor interface is utilized for image recognition, was derived.

  11. Comparison of in vivo biocompatibilities between parylene-C and polydimethylsiloxane for implantable microelectronic devices

    Indian Academy of Sciences (India)

    Dong Sup Lee; Su Jin Kim; Eun Bi Kwon; Cheol Whee Park; Su Min Jun; Bumkyoo Choi; Sae Woong Kim

    2013-11-01

    Implantable devices are often composed of or coated with different biologically compatible materials based on their requirements. Selecting a surface material for an implantable device is not an easy task, and it is necessary to compare the biocompatibilities of the available surface materials. In this study, we perform a comparison of the in vivo biocompatibilities of polydimethylsiloxane (PDMS) and para-xylyene polymer (parylene-C) as they are considered to be candidates for a coating material for implantable microelectronic devices. For in vivo biocompatibility testing, fifty four male Sprague-Dawley rats were used for testing, and they were divided into three groups (PDMS, parylene-C and a positive control). At one, four and twelve weeks after implantation of the test object, the density of inflammatory cells and the granulation layer thickness were recorded for each group and compared with other groups using visible light and fluorescence microscopy. The thickness of the granulation layer tended to decrease over time for all of the experimental groups, whereas the granulation layer thickness remained constant in the positive control group. The thinnest capsular layer was observed for the parylene-C group and fewest inflammatory cells were observed in this group during the entire experimental period. Macrophage infiltration was minimal, even at one week, and was not observed thereafter. The parylene-C group showed better biocompatibility than the PDMS groups, both for acute and chronic implantation. Thus, parylene-C is the best candidate of the tested materials for applications involving permanent implantable micro-devices.

  12. A microelectronic portal imaging device for image guided conformal microirradiation of murine cancer models.

    Science.gov (United States)

    Price, Samantha G; Silvius, Alexander A; Izaguirre, Enrique W

    2014-01-01

    Image guided conformal small animal orthovoltage microirradiators are currently under development to perform radiobiological experiments with preclinical cancer models. An important component of these instruments is the treatment delivery image guidance system, a microelectronic portal imaging device (μEPID). Here, we present the design and implementation of a μEPID, specifically designed and constructed for small animal orthovoltage microirradiators. The μEPID can acquire images in the range of 60 kVp to 320 kVp x-ray photon energies and can endure high doses from orthovoltage beams without radiation damage. The μEPID can acquire 200 μm resolution images at a rate of 17 frames per second for online in vivo co-registration between irradiation beams and small animal anatomy. An exposure with less than 1% of a 2 Gy treatment field is required for imaging, which is an adequate ratio between imaging dose and treatment dose to avoid undesired irradiation of healthy tissue or alteration of the preclinical cancer model. The μEPID was calibrated for microdosimetry with a precision of 4.1% with respect to an ion chamber, used as a gold standard. To validate the in vivo device performance, irradiations of lung, brain, and xenograft breast cancer preclinical models were performed and analyzed.

  13. A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

    Science.gov (United States)

    Liang, Cunman; Wang, Fujun; Tian, Yanling; Zhao, Xingyu; Zhang, Hongjie; Cui, Liangyu; Zhang, Dawei; Ferreira, Placid

    2015-04-01

    A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate, and robust microelectronic device packaging. The wire clamp has compact, flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and a parallelogram leverage mechanism was designed. Pseudo-rigid-body model and Lagrange approaches were employed to conduct the kinematic, static, and dynamic modeling of the wire clamp and optimization design was carried out. The displacement amplification ratio, maximum allowable stress, and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire electro discharge machining technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance and the experimental results match well with the theoretical calculation and FEA. The amplification ratio of the clamp is 20.96 and the working mode frequency is 895 Hz. Step response test shows that the wire clamp has fast response and high accuracy and the motion resolution is 0.2 μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

  14. CALIBRATION OF DEVICES FOR MEASURING ELEMENTS OF MICRO-ELECTRONIC STRUCTURES

    Directory of Open Access Journals (Sweden)

    G. Trapashko

    2012-01-01

    Full Text Available Development of microelectronics requires solution of the problem ensuring unity of linear measurements in a submicron range. The problem can be solved on the condition that calibration of measuring devices shall be made in accordance with reference samples that is a short length scale.While making calibration of measuring equipment with the help of a reference measure it is important to investigate components of the method accuracy and their influence on measuring results. The paper considers methodical errors which are specific for methods of optical and atomic force microscopy. Calibration results of an optical measuring microscope are given in the paper. The paper reveals that an additive error depends on parameters of a material and the form of measured elements for an optical measuring microscope. The methodical error of atomic force microscopes is predicated on the probe point shape. The paper considers a short length scale used for calibration of optical and atomic force microscopes. Recommendations for users of the measuring equipment are formulated in the paper.

  15. Layer manufacturing for in vivo devices.

    Science.gov (United States)

    Savalani, M M; Harris, R A

    2006-05-01

    Traditional in vivo devices fabricated to be used as implantation devices included sutures, plates, pins, screws, and joint replacement implants. Also, akin to developments in regenerative medicine and drug delivery, there has been the pursuit of less conventional in vivo devices that demand complex architecture and composition, such as tissue scaffolds. Commercial means of fabricating traditional devices include machining and moulding processes. Such manufacturing techniques impose considerable lead times and geometrical limitations, and restrict the economic production of customized products. Attempts at the production of non-conventional devices have included particulate leaching, solvent casting, and phase transition. These techniques cannot provide the desired total control over internal architecture and compositional variation, which subsequently restricts the application of these products. Consequently, several parties are investigating the use of freeform layer manufacturing techniques to overcome these difficulties and provide viable in vivo devices of greater functionality. This paper identifies the concepts of rapid manufacturing (RM) and the development of biomanufacturing based on layer manufacturing techniques. Particular emphasis is placed on the development and experimentation of new materials for bio-RM, production techniques based on the layer manufacturing concept, and computer modelling of in vivo devices for RM techniques.

  16. Electrochemical investigations of advanced materials for microelectronic and energy storage devices

    Science.gov (United States)

    Goonetilleke, Pubudu Chaminda

    A broad range of electrochemical techniques are employed in this work to study a selected set of advanced materials for applications in microelectronics and energy storage devices. The primary motivation of this study has been to explore the capabilities of certain modern electrochemical techniques in a number of emerging areas of material processing and characterization. The work includes both aqueous and non-aqueous systems, with applications in two rather general areas of technology, namely microelectronics and energy storage. The sub-systems selected for investigation are: (i) Electrochemical mechanical and chemical mechanical planarization (ECMP and CMP, respectively), (ii) Carbon nanotubes in combination with room temperature ionic liquids (ILs), and (iii) Cathode materials for high-performance Li ion batteries. The first group of systems represents an important building block in the fabrication of microelectronic devices. The second and third groups of systems are relevant for new energy storage technologies, and have generated immense interests in recent years. A common feature of these different systems is that they all are associated with complex surface reactions that dictate the performance of the devices based on them. Fundamental understanding of these reactions is crucial to further development and expansion of their associated technologies. It is the complex mechanistic details of these surface reactions that we address using a judicious combination of a number of state of the art electrochemical techniques. The main electrochemical techniques used in this work include: (i) Cyclic voltammetry (CV) and slow scan cyclic voltammetry (SSCV, a special case of CV); (ii) Galvanostatic (or current-controlled) measurements; (iii) Electrochemical impedance spectroscopy (EIS), based on two different methodologies, namely, Fourier transform EIS (FT-EIS, capable of studying fast reaction kinetics in a time-resolved mode), and EIS using frequency response

  17. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  18. Antimicrobial Peptides in Biomedical Device Manufacturing

    Directory of Open Access Journals (Sweden)

    Martijn Riool

    2017-08-01

    Full Text Available Over the past decades the use of medical devices, such as catheters, artificial heart valves, prosthetic joints, and other implants, has grown significantly. Despite continuous improvements in device design, surgical procedures, and wound care, biomaterial-associated infections (BAI are still a major problem in modern medicine. Conventional antibiotic treatment often fails due to the low levels of antibiotic at the site of infection. The presence of biofilms on the biomaterial and/or the multidrug-resistant phenotype of the bacteria further impair the efficacy of antibiotic treatment. Removal of the biomaterial is then the last option to control the infection. Clearly, there is a pressing need for alternative strategies to prevent and treat BAI. Synthetic antimicrobial peptides (AMPs are considered promising candidates as they are active against a broad spectrum of (antibiotic-resistant planktonic bacteria and biofilms. Moreover, bacteria are less likely to develop resistance to these rapidly-acting peptides. In this review we highlight the four main strategies, three of which applying AMPs, in biomedical device manufacturing to prevent BAI. The first involves modification of the physicochemical characteristics of the surface of implants. Immobilization of AMPs on surfaces of medical devices with a variety of chemical techniques is essential in the second strategy. The main disadvantage of these two strategies relates to the limited antibacterial effect in the tissue surrounding the implant. This limitation is addressed by the third strategy that releases AMPs from a coating in a controlled fashion. Lastly, AMPs can be integrated in the design and manufacturing of additively manufactured/3D-printed implants, owing to the physicochemical characteristics of the implant material and the versatile manufacturing technologies compatible with antimicrobials incorporation. These novel technologies utilizing AMPs will contribute to development of novel

  19. Antimicrobial Peptides in Biomedical Device Manufacturing.

    Science.gov (United States)

    Riool, Martijn; de Breij, Anna; Drijfhout, Jan W; Nibbering, Peter H; Zaat, Sebastian A J

    2017-01-01

    Over the past decades the use of medical devices, such as catheters, artificial heart valves, prosthetic joints, and other implants, has grown significantly. Despite continuous improvements in device design, surgical procedures, and wound care, biomaterial-associated infections (BAI) are still a major problem in modern medicine. Conventional antibiotic treatment often fails due to the low levels of antibiotic at the site of infection. The presence of biofilms on the biomaterial and/or the multidrug-resistant phenotype of the bacteria further impair the efficacy of antibiotic treatment. Removal of the biomaterial is then the last option to control the infection. Clearly, there is a pressing need for alternative strategies to prevent and treat BAI. Synthetic antimicrobial peptides (AMPs) are considered promising candidates as they are active against a broad spectrum of (antibiotic-resistant) planktonic bacteria and biofilms. Moreover, bacteria are less likely to develop resistance to these rapidly-acting peptides. In this review we highlight the four main strategies, three of which applying AMPs, in biomedical device manufacturing to prevent BAI. The first involves modification of the physicochemical characteristics of the surface of implants. Immobilization of AMPs on surfaces of medical devices with a variety of chemical techniques is essential in the second strategy. The main disadvantage of these two strategies relates to the limited antibacterial effect in the tissue surrounding the implant. This limitation is addressed by the third strategy that releases AMPs from a coating in a controlled fashion. Lastly, AMPs can be integrated in the design and manufacturing of additively manufactured/3D-printed implants, owing to the physicochemical characteristics of the implant material and the versatile manufacturing technologies compatible with antimicrobials incorporation. These novel technologies utilizing AMPs will contribute to development of novel and safe

  20. Device and materials characterization in manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Sites, J. [Colorado State University, Fort Collins, CO (United States). Dept. of Physics; Rand, J. [Astro Power Inc., Newark, DE (United States); Kazmerski, L.L. [National Renewable Energy Laboratory, Golden, CO (United States); Phillips, J.E. [University of Delaware, Newark, DE (United States). Inst. of Energy Conversion

    1997-10-01

    Diagnostic measurements of thin-film materials and complete devices and solar modules are necessary to optimize both the processes and the resulting modules. Measurements provide the connection between processing and performance. In this workshop, the panel and audience examined both in situ and post-processing diagnostic measurements and how they can be utilized in a manufacturing environment to monitor processes and performance. The need for future measurement technology is increasingly for on-site, manufacturing-compatible, non-contact techniques giving rapid feedback in the production environment. (author)

  1. Retrospective assessment of exposure to chemicals for a microelectronics and business machine manufacturing facility.

    Science.gov (United States)

    Fleming, Donald A; Woskie, Susan R; Jones, James H; Silver, Sharon R; Luo, Lian; Bertke, Stephen J

    2014-01-01

    A retrospective exposure assessment was performed for use in a health outcomes study of a facility manufacturing circuit boards, business machines, and other equipment during the years 1969-2002. A matrix was developed identifying chemical use by department-year based on company-provided information. Use of six chemical agents (fiberglass, lead, methylene chloride, methyl chloroform, perchloroethylene, and trichloroethylene) and six chemical classes (acid-base, aromatic hydrocarbons, chlorinated hydrocarbons, other hydrocarbons, chlorofluorocarbons, and metals), and general (including unspecified) chemicals was identified. The matrix also contained an assignment for each department-year categorizing the potential for use of chemicals as negligible, intermittent/incidental, or routine. These department-based exposure matrix data were combined with work history data to provide duration of potential chemical use for workers. Negligible, intermittent/incidental or routine extent-of-chemical-use categories comprised 42.6%, 39.4%, and 17.9%, respectively, of total person-years of employment. Cumulative exposure scores were also developed, representing a relative measure of the cumulative extent of potential exposure to the six chemical agents, six chemical classes, and general (including unspecified) chemicals. Additionally, the study period was divided into manufacturing eras showing trends in chemical use, and showing that process use of trichloroethylene and methylene chloride ended in the mid-1980s and the mid-1990s, respectively. This approach may be useful in other assessments addressing a variety of chemicals, and with data constraints common to retrospective chemical exposure studies.

  2. Device overlay method for high volume manufacturing

    Science.gov (United States)

    Lee, Honggoo; Han, Sangjun; Kim, Youngsik; Kim, Myoungsoo; Heo, Hoyoung; Jeon, Sanghuck; Choi, DongSub; Nabeth, Jeremy; Brinster, Irina; Pierson, Bill; Robinson, John C.

    2016-03-01

    Advancing technology nodes with smaller process margins require improved photolithography overlay control. Overlay control at develop inspection (DI) based on optical metrology targets is well established in semiconductor manufacturing. Advances in target design and metrology technology have enabled significant improvements in overlay precision and accuracy. One approach to represent in-die on-device as-etched overlay is to measure at final inspection (FI) with a scanning electron microscope (SEM). Disadvantages to this approach include inability to rework, limited layer coverage due to lack of transparency, and higher cost of ownership (CoO). A hybrid approach is investigated in this report whereby infrequent DI/FI bias is characterized and the results are used to compensate the frequent DI overlay results. The bias characterization is done on an infrequent basis, either based on time or triggered from change points. On a per-device and per-layer basis, the optical target overlay at DI is compared with SEM on-device overlay at FI. The bias characterization results are validated and tracked for use in compensating the DI APC controller. Results of the DI/FI bias characterization and sources of variation are presented, as well as the impact on the DI correctables feeding the APC system. Implementation details in a high volume manufacturing (HVM) wafer fab will be reviewed. Finally future directions of the investigation will be discussed.

  3. Manufacturing and Reliability of Nanoscale Devices

    Science.gov (United States)

    Loh, Owen Yin

    The International Technology Roadmap for Semiconductors (ITRS) identifies emerging technologies with the potential to sustain Moore's Law. A necessary progression from conventional CMOS, to non-planer/dual gate CMOS, and ultimately to novel device architectures such as nanoelectromechanical systems (NEMS) is envisioned. The ITRS also identifies critical roadblocks which currently preclude advances beyond CMOS as a means to guide research and development efforts. Roadblocks specific to NEMS include widespread manufacturing challenges associated with manipulating one-dimensional nanostructures, and poor reliability arising from a number of prevalent failure modes. The weight of these roadblocks is evident well beyond the goals of the ITRS, where nanoelectromechanical sensors and other devices face similar obstacles. This thesis focuses on two critical challenges facing the development of robust carbon nanotube-based NEMS: scalable manufacturing methods, and understanding and eliminating prevalent failure modes. Toward the first challenge, probe-based nanomanufacturing schemes are developed to construct well-ordered arrays of individual carbon nanotubes from which NEMS can be fabricated. This work extends beyond the goals of the semiconductor industry, and demonstrates the ability to create functional sub-100-nanometer protein and drug arrays, as well as novel in vitro injection methods for single cell studies. The second part of this thesis indentifies prevalent failure modes and their point of onset within the device design space. Again, these are addressed by the ITRS but have implications reaching well beyond the semiconductor industry. It then seeks to find the underlying mechanisms for the observed failure modes, and introduces easily-implemented solutions which exhibit the ability to eliminate or greatly-suppress the prevalent failure modes, enabling numerous device actuation cycles without failure and demonstrations of functionality not possible with failure

  4. Space Radiation Environment Prediction for VLSI microelectronics devices onboard a LEO Satellite using OMERE-Trad Software

    Science.gov (United States)

    Sajid, Muhammad

    This tutorial/survey paper presents the assessment/determination of level of hazard/threat to emerging microelectronics devices in Low Earth Orbit (LEO) space radiation environment with perigee at 300 Km, apogee at 600Km altitude having different orbital inclinations to predict the reliability of onboard Bulk Built-In Current Sensor (BBICS) fabricated in 350nm technology node at OptMA Lab. UFMG Brazil. In this context, the various parameters for space radiation environment have been analyzed to characterize the ionizing radiation environment effects on proposed BBICS. The Space radiation environment has been modeled in the form of particles trapped in Van-Allen radiation belts(RBs), Energetic Solar Particles Events (ESPE) and Galactic Cosmic Rays (GCR) where as its potential effects on Device- Under-Test (DUT) has been predicted in terms of Total Ionizing Dose (TID), Single-Event Effects (SEE) and Displacement Damage Dose (DDD). Finally, the required mitigation techniques including necessary shielding requirements to avoid undesirable effects of radiation environment at device level has been estimated /determined with assumed standard thickness of Aluminum shielding. In order to evaluate space radiation environment and analyze energetic particles effects on BBICS, OMERE toolkit developed by TRAD was utilized.

  5. Microelectronics Reliability

    Science.gov (United States)

    2017-01-17

    convey any rights or permission to manufacture, use, or sell any patented invention that may relate to them. This report was cleared for public release...testing for reliability prediction of devices exhibiting multiple failure mechanisms. Also presented was an integrated accelerating and measuring ...13  Table 2  T, V, F and matrix versus  measured  FIT

  6. Radiation Testing, Characterization and Qualification Challenges for Modern Microelectronics and Photonics Devices and Technologies

    Science.gov (United States)

    LaBel, Kenneth A.; Cohn, Lewis M.

    2008-01-01

    At GOMAC 2007, we discussed a selection of the challenges for radiation testing of modern semiconductor devices focusing on state-of-the-art memory technologies. This included FLASH non-volatile memories (NVMs) and synchronous dynamic random access memories (SDRAMs). In this presentation, we extend this discussion in device packaging and complexity as well as single event upset (SEU) mechanisms using several technology areas as examples including: system-on-a-chip (SOC) devices and photonic or fiber optic systems. The underlying goal is intended to provoke thought for understanding the limitations and interpretation of radiation testing results.

  7. Microelectronic systems 3 checkbook

    CERN Document Server

    Vears, R E

    1985-01-01

    Microelectronic Systems 3: Checkbook aims to extend the range of hardware, software, and interfacing techniques developed at level 2. This book concentrates on the highly popular 6502, Z80, and 6800 microprocessors and contains approximately 70 tested programs that may be used with little or no modification on most systems based on these microprocessors. This text also covers the main points concerned with computer hardware configuration, interfacing devices, subroutines and the stack, polling and interrupts, microelectronic stores, and address decoding and organization. Each chapter of the b

  8. Microelectronics at Sandia Laboratories

    Energy Technology Data Exchange (ETDEWEB)

    Spencer, W.J.; Gregory, B.L.; Franzak, E.G.; Hood, J.A.

    1975-12-31

    The microelectronics capability at Sandia Laboratories spans the complete range of component activity from initial design to final assembly into subsystems and systems. Highly reliable, radiation-tolerant devices and integrated circuits can be designed, fabricated, and incorporated into printed circuit assemblies or into thick- or thin-film hybrid microcircuits. Sandia has an experienced staff, exceptional facilities and aggressive on-going programs in all these areas. The authors can marshall a broad range of skills and capabilities to attack and solve problems in design, fabrication, assembly, or production. Key facilities, programs, and capabilities in the Sandia microelectronics effort are discussed in more detail in this booklet.

  9. Listening to Brain Microcircuits for Interfacing With External World—Progress in Wireless Implantable Microelectronic Neuroengineering Devices

    Science.gov (United States)

    Nurmikko, Arto V.; Donoghue, John P.; Hochberg, Leigh R.; Patterson, William R.; Song, Yoon-Kyu; Bull, Christopher W.; Borton, David A.; Laiwalla, Farah; Park, Sunmee; Ming, Yin; Aceros, Juan

    2011-01-01

    Acquiring neural signals at high spatial and temporal resolution directly from brain microcircuits and decoding their activity to interpret commands and/or prior planning activity, such as motion of an arm or a leg, is a prime goal of modern neurotechnology. Its practical aims include assistive devices for subjects whose normal neural information pathways are not functioning due to physical damage or disease. On the fundamental side, researchers are striving to decipher the code of multiple neural microcircuits which collectively make up nature’s amazing computing machine, the brain. By implanting biocompatible neural sensor probes directly into the brain, in the form of microelectrode arrays, it is now possible to extract information from interacting populations of neural cells with spatial and temporal resolution at the single cell level. With parallel advances in application of statistical and mathematical techniques tools for deciphering the neural code, extracted populations or correlated neurons, significant understanding has been achieved of those brain commands that control, e.g., the motion of an arm in a primate (monkey or a human subject). These developments are accelerating the work on neural prosthetics where brain derived signals may be employed to bypass, e.g., an injured spinal cord. One key element in achieving the goals for practical and versatile neural prostheses is the development of fully implantable wireless microelectronic “brain-interfaces” within the body, a point of special emphasis of this paper. PMID:21654935

  10. Superconducting Microelectronics.

    Science.gov (United States)

    Henry, Richard W.

    1984-01-01

    Discusses superconducting microelectronics based on the Josephson effect and its advantages over conventional integrated circuits in speed and sensitivity. Considers present uses in standards laboratories (voltage) and in measuring weak magnetic fields. Also considers future applications in superfast computer circuitry using Superconducting…

  11. Surface reactions in microelectronics process technology.

    Science.gov (United States)

    Levitin, Galit; Hess, Dennis W

    2011-01-01

    Current integrated circuit (IC) manufacturing consists of more than 800 process steps, nearly all of which involve reactions at surfaces that significantly impact device yield and performance. From initial surface preparation through film deposition, patterning, etching, residue removal, and metallization, an understanding of surface reactions and interactions is critical to the successful continuous scaling, yield, and reliability of electronic devices. In this review, some of the most important surface reactions that drive the development of microelectronic device fabrication are described. The reactions discussed do not constitute comprehensive coverage of this topic in IC manufacture but have been selected to demonstrate the importance of surface/interface reactions and interactions in the development of new materials, processing sequences, and process integration challenges. Specifically, the review focuses on surface reactions related to surface cleaning/preparation, semiconductor film growth, dielectric film growth, metallization, and etching (dry and wet).

  12. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    Science.gov (United States)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is technology today can package such die onto a flexible substrate at low cost and high rate. The laser-enabled advanced packaging (LEAP) technology has been developed at the Center for Nanoscale Science and Engineering, North Dakota State University in Fargo, North Dakota, to accomplish this objective. Presented are results using LEAP to assemble dice with various thicknesses, including 350 μm/side dice as thin as 20 μm and less. To the best of our knowledge, this is the first report of using a laser to package conventional silicon dice with such small size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  13. Design and fabrication of microfluidic/microelectronic devices from nano particle based composites

    Science.gov (United States)

    Liu, Liyu

    In this thesis, two kinds of nanoparticle functional composite Giant Electrorheological(GER) fluid and polydimethylsiloxane (PDMS) conductive composites and their applications in micro scales are studied. GER fluid is synthesized with ˜50 nm polarizable solid particles and non-polarizable oil, whose apparent viscosity is continuously variable through applications of an electric field. We have successfully applied ER fluid as actuations in microfluidic chips. With soft lithography techniques, we developed various micro functional chips based on PDMS, including micro flexible platform, micro active mixer and micro pump, all of which have desirable performances. The PDMS conducting composites are synthesized by mixing nano to sub micro-sized conductive particles (silver/carbon black) with PDMS gel. Such composite materials exhibit good electrical conductivity and mechanical reliability, as well as desirable thermal characteristics. By employing this type of composite, we have developed some realistic micro-structural devices and explored their potential applications, including flexible bio-electrodes, micro-heaters and flexible displays, micro temperature indicators, etc. With these two composites and corresponding results, we succeeded in realizing a highly integrated microfluidic chip with the function of DNA amplification. The system has the advantages of small size with a high degree of integration, high PCR efficiency, digital control and simple fabrication at low cost and shows promise for a broad range of applications in chemical synthesis and biological sensing/analysis.

  14. Wire bonding in microelectronics

    CERN Document Server

    Harman, George G

    2010-01-01

    Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

  15. 78 FR 12068 - Device Good Manufacturing Practice Advisory Committee; Notice of Meeting

    Science.gov (United States)

    2013-02-21

    ... HUMAN SERVICES Food and Drug Administration Device Good Manufacturing Practice Advisory Committee... meeting will be open to the public. Name of Committee: Device Good Manufacturing Practice Advisory... effects of extreme weather and natural disasters on medical device manufacturing chain processes...

  16. III-V microelectronics

    CERN Document Server

    Nougier, JP

    1991-01-01

    As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in particular is well suited for Ultra Large Scale Integration processes. However, a number of III-V compound semiconductor devices and circuits have recently been built, and the contributions in this volume are devoted to those types of materials, which offer a number of interesting properties. Taking into account the great variety of problems encountered and of their mutual correlations when fabricating a circuit or even a device, most of the aspects of III-V microelectronics, from fundamental p

  17. MAUDE (Manufacturer and User Facility Device Experience)

    Data.gov (United States)

    U.S. Department of Health & Human Services — MAUDE data represents reports of adverse events involving medical devices. The data consists of all voluntary reports since June, 1993, user facility reports since...

  18. Flexible manufacturing for photonics device assembly

    Science.gov (United States)

    Lu, Shin-Yee; Pocha, Michael D.; Strand, Oliver T.; Young, K. David

    1994-01-01

    The assembly of photonics devices such as laser diodes, optical modulators, and opto-electronics multi-chip modules (OEMCM), usually requires the placement of micron size devices such as laser diodes, and sub-micron precision attachment between optical fibers and diodes or waveguide modulators (usually referred to as pigtailing). This is a very labor intensive process. Studies done by the opto-electronics (OE) industry have shown that 95 percent of the cost of a pigtailed photonic device is due to the use of manual alignment and bonding techniques, which is the current practice in industry. At Lawrence Livermore National Laboratory, we are working to reduce the cost of packaging OE devices through the use of automation. Our efforts are concentrated on several areas that are directly related to an automated process. This paper will focus on our progress in two of those areas, in particular, an automated fiber pigtailing machine and silicon micro-technology compatible with an automated process.

  19. Silicon nanowire device and method for its manufacture

    Science.gov (United States)

    Okandan, Murat; Draper, Bruce L.; Resnick, Paul J.

    2017-01-03

    There is provided an electronic device and a method for its manufacture. The device comprises an elongate silicon nanowire less than 0.5 .mu.m in cross-sectional dimensions and having a hexagonal cross-sectional shape due to annealing-induced energy relaxation.

  20. Silicon nanowire device and method for its manufacture

    Energy Technology Data Exchange (ETDEWEB)

    Okandan, Murat; Draper, Bruce L.; Resnick, Paul J.

    2017-01-03

    There is provided an electronic device and a method for its manufacture. The device comprises an elongate silicon nanowire less than 0.5 .mu.m in cross-sectional dimensions and having a hexagonal cross-sectional shape due to annealing-induced energy relaxation.

  1. Ceramic materials of low-temperature synthesis for dielectric coating applied by 3D aerosol printing used in nano- and microelectronics, lighting engineering, and spacecraft control devices

    Science.gov (United States)

    Ivanov, A. A.; Tuev, V. I.; Nisan, A. V.; Potapov, G. N.

    2016-11-01

    A synthesis technique of low-temperature ceramic material based on aluminosilicates of dendrimer morphology capable to contain up to 80 wt % of nitrides and oxides of high-melting compounds as filler has been developed. The synthesis is based on a sol-gel method followed by mechanochemical treatment and ultrasonic dispersing. Dielectric ceramic layers with the layer thickness in the nanometer range and high thermal conductivity have been obtained for the first time by 3D aerosol printing of the synthesized material. The study of the obtained ceramic coating on the metal surface (Al) has proved its use prospects in microelectronics, light engineering, and devices for special purposes.

  2. Fighting blindness with microelectronics.

    Science.gov (United States)

    Zrenner, Eberhart

    2013-11-06

    There is no approved cure for blindness caused by degeneration of the photoreceptor cells of the retina. However, there has been encouraging progress with attempts to restore vision using microelectronic retinal implant devices. Yet many questions remain to be addressed. Where is the best location to implant multielectrode arrays? How can spatial and temporal resolution be improved? What are the best ways to ensure the safety and longevity of these devices? Will color vision be possible? This Perspective discusses the current state of the art of retinal implants and attempts to address some of the outstanding questions.

  3. Applications of laser direct-write for embedding microelectronics

    Science.gov (United States)

    Piqué, Alberto; Charipar, Nicholas A.; Kim, Heungsoo; Auyeung, Ray C. Y.; Mathews, Scott A.

    2007-03-01

    The use of direct-write techniques might revolutionize the way microelectronic devices such as interconnects, passives, IC's, antennas, sensors and power sources are designed and fabricated. The Naval Research Laboratory has developed a laser-based microfabrication process for direct-writing the materials and components required for the assembly and interconnection of the above devices. This laser direct-write (LDW) technique is capable of operating in subtractive, additive, and transfer mode. In subtractive mode, the system operates as a laser micromachining workstation capable of achieving precise depth and surface roughness control. In additive mode, the system utilizes a laser-forward transfer process for the deposition of metals, oxides, polymers and composites under ambient conditions onto virtually any type of surface, thus functioning as a laser printer for patterns of electronic materials. Furthermore, in transfer mode, the system is capable of transferring individual devices, such as semiconductor bare die or surface mount devices, inside a trench or recess in a substrate, thus performing the same function of the pick-and-place machines used in circuit board manufacture. The use of this technique is ideally suited for the rapid prototyping of embedded microelectronic components and systems while allowing the overall circuit design and layout to be easily modified or adapted to any specific application or form factor. This paper describes the laser direct-write process as applied to the forward transfer of microelectronic devices.

  4. Handbook on advanced design and manufacturing technologies for biomedical devices

    CERN Document Server

    2013-01-01

    The last decades have seen remarkable advances in computer-aided design, engineering and manufacturing technologies, multi-variable simulation tools, medical imaging, biomimetic design, rapid prototyping, micro and nanomanufacturing methods and information management resources, all of which provide new horizons for the Biomedical Engineering fields and the Medical Device Industry. Handbook on Advanced Design and Manufacturing Technologies for Biomedical Devices covers such topics in depth, with an applied perspective and providing several case studies that help to analyze and understand the key factors of the different stages linked to the development of a novel biomedical device, from the conceptual and design steps, to the prototyping and industrialization phases. Main research challenges and future potentials are also discussed, taking into account relevant social demands and a growing market already exceeding billions of dollars. In time, advanced biomedical devices will decisively change methods and resu...

  5. Biomimetic Microelectronics for Regenerative Neuronal Cuff Implants.

    Science.gov (United States)

    Karnaushenko, Daniil; Münzenrieder, Niko; Karnaushenko, Dmitriy D; Koch, Britta; Meyer, Anne K; Baunack, Stefan; Petti, Luisa; Tröster, Gerhard; Makarov, Denys; Schmidt, Oliver G

    2015-11-18

    Smart biomimetics, a unique class of devices combining the mechanical adaptivity of soft actuators with the imperceptibility of microelectronics, is introduced. Due to their inherent ability to self-assemble, biomimetic microelectronics can firmly yet gently attach to an inorganic or biological tissue enabling enclosure of, for example, nervous fibers, or guide the growth of neuronal cells during regeneration.

  6. Polymers for microelectronics

    Directory of Open Access Journals (Sweden)

    Gerhard Maier

    2001-09-01

    Full Text Available The continuous advancement of microelectronics in all fields of technology has become a basic fact of our daily life. Increasingly complex tasks are performed by computers, requiring more memory capacity and faster processing speeds. This constant need to develop more highly integrated microchips is expressed by Moore's law, which states that the capacity of the most highly developed random access memory (RAM chips increases by a factor of four every three years. This is achieved by decreasing the size of devices on chips in each new generation by a factor of two and simultaneously increasing the size of the silicon chip (‘die’ by the same factor.

  7. Medical devices manufactured from latex: European regulatory initiatives.

    Science.gov (United States)

    De Jong, W H; Geertsma, R E; Tinkler, J J B

    2002-05-01

    In Europe the marketing of medical devices manufactured from latex is regulated by directives describing the essential (safety) requirements that products have to fulfill to obtain marketing approval. This paper describes the general requirements for marketing medical devices in Europe and, more specifically, the requirements for products manufactured from natural rubber latex. The requirements for marketing medical devices can be fulfilled by using the relevant harmonized European standards. These standards are regularly under revision to incorporate the latest scientific developments. For certain devices, for example, latex medical (examination and surgical) gloves, specific standards have been published. Medical devices manufactured from latex pose a serious problem because of the risk of induction of allergy both against the latex proteins inherently present (type I or immediate type allergy) and against chemicals added during processing (type IV or delayed type hypersensitivity) present as residues in the latex products. So, besides requirements for product quality in terms of barrier properties, strength, and sterility, the main focus consists of the allergy-inducing properties of the latex products. Recent developments have reopened the discussion on the value of total protein versus allergen determination in latex medical gloves. However, as long as minimal levels needed for both sensitization and elicitation have not been established, a safe maximum level for leachable proteins/allergens in latex products cannot be determined. A European Commission guidance document on the latex allergy problem is currently being drafted by experts from Competent Authorities.

  8. Radiation analysis devices, radiation analysis methods, and articles of manufacture

    Science.gov (United States)

    Roybal, Lyle Gene

    2010-06-08

    Radiation analysis devices include circuitry configured to determine respective radiation count data for a plurality of sections of an area of interest and combine the radiation count data of individual of sections to determine whether a selected radioactive material is present in the area of interest. An amount of the radiation count data for an individual section is insufficient to determine whether the selected radioactive material is present in the individual section. An article of manufacture includes media comprising programming configured to cause processing circuitry to perform processing comprising determining one or more correction factors based on a calibration of a radiation analysis device, measuring radiation received by the radiation analysis device using the one or more correction factors, and presenting information relating to an amount of radiation measured by the radiation analysis device having one of a plurality of specified radiation energy levels of a range of interest.

  9. Development and Manufacture of Polymer-based Electrochromic Devices

    DEFF Research Database (Denmark)

    Jensen, Jacob; Hösel, Markus; Dyer, Aubrey L.

    2015-01-01

    The field of organic electrochromics is reviewed here, with particular focus on how the “electrochromic” as a functional material can be brought from the current level of accurate laboratory synthesis and characterization to the device and application level through a number of suited roll......-to-roll methods compatible with upscaling and manufacture. The successful approaches to operational devices are presented in detail, as well as areas where future research would have a high impact and accelerate the development such as highly conducting and transparent substrates, electrolytes adapted...

  10. Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices.

    Science.gov (United States)

    Alapan, Yunus; Hasan, Muhammad Noman; Shen, Richang; Gurkan, Umut A

    2015-05-01

    Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing.

  11. Diagnostics and Microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Balch, J.W.

    1993-03-01

    This report discusses activities of the Diagnostics and Microelectronics thrust area which conducts activities in semiconductor devices and semiconductor fabrication technology for programs at Lawrence Livermore National Laboratory. Our multidisciplinary engineering and scientific staff use modern computational tools and semi-conductor microfabrication equipment to develop high-performance devices. Our work concentrates on three broad technologies of semiconductor microdevices: (1) silicon on III-V semiconductor microeletronics, (2) lithium niobate-based and III-V semiconductor-based photonics, and (3) silicon-based micromaching for application to microstructures and microinstruments. In FY-92, we worked on projects in seven areas, described in this report: novel photonic detectors; a wideband phase modulator; an optoelectronic terahertz beam system; the fabrication of microelectrode electrochemical sensors; diamond heatsinks; advanced micromachining technologies; and electrophoresis using silicon microchannels.

  12. Direct digital manufacturing of autonomous centrifugal microfluidic device

    Science.gov (United States)

    Ukita, Yoshiaki; Takamura, Yuzuru; Utsumi, Yuichi

    2016-06-01

    This paper presents strategies that attempt to solve two key problems facing the commercialization of microfluidics: cost reduction in microfluidic chip manufacturing and microfluidic device driver development. To reduce the cost of microfluidic chip manufacturing, we propose to use of three-dimensional (3D) printers for direct digital manufacturing (DDM). An evaluation of 3D micro-scale structure printing using several 3D printers is reported, and some of the technical issues to be addressed in the future are suggested. To evaluate micro-scale printing, three types of 3D printers, with the ability to print structures on the scale of several hundred meters, were selected by first screening six 3D printers. Line and space patterns with line widths of 100-500 µm and an aspect ratio of one were printed and evaluated. The estimated critical dimension was around 200 µm. The manufacturing of a monolithic microfluidic chip with embedded channels was also demonstrated. Monolithic microfluidic chips with embedded microchannels having 500 × 500 and 250 × 250 µm2 cross sections and 2-20 mm lengths were printed, and the fidelity of the channel shape, residual supporting material, and flow of liquid water were evaluated. The liquid flow evaluation showed that liquid water could flow through all of the microchannels with the 500 × 500 µm2 cross section, whereas this was not possible through some of the channels with the 250 × 250 µm2 cross section because of the residual resin or supporting material. To reduce the device-driver cost, we propose to use of the centrifugal microfluidic concept. An autonomous microfluidic device that could implement sequential flow control under a steadily rotating condition was printed. Four-step flow injection under a steadily rotating condition at 1500 rpm was successfully demonstrated without any external triggering such as changing the rotational speed.

  13. Large-Area Laser-Lift-Off Processing in Microelectronics

    Science.gov (United States)

    Delmdahl, R.; Pätzel, R.; Brune, J.

    Laser lift-off is an enabling technology for microelectronics growth markets such as light emitting diodes, densely packaged semiconductor devices, and flexible displays. For example, thin film transistor structures fabricated on top of polymer layers spun on glass carriers must be delaminated from rigid substrates to create lightweight and rugged flexible displays on polymers. Low-thermal-budget processes are generically required to protect adjacent functional films. Excimer lasers provide short UV wavelength and short pulse duration required for highly-localized energy coupling. The high output power of excimer lasers enables a large processing footprint and the high-throughput rates needed in mass manufacturing.

  14. Manufacturability of 2x-nm devices with EUV tool

    Science.gov (United States)

    Tawarayama, Kazuo; Nakajima, Yumi; Kyoh, Suigen; Aoyama, Hajime; Matsunaga, Kentaro; Magoshi, Shunko; Tanaka, Satoshi; Hayashi, Yumi; Mori, Ichiro

    2011-04-01

    Due to the promising development status of EUVL as a practical lithography technology for the 2x-nm node, we are continuing to evaluate its process liability using the EUV1 at Selete, which has an Off-Axis illumination capability. The resolution limit of the EUV1 for L&S patterns is currently 18 nm for dipole illumination, and 16 nm for aggressive dipole illumination. This study examined the critical points of EUVL for device manufacturing through wafer processes. The yield obtained from electrical measurements indicates the maturity of the technology, including the resist process, the tool, and the mask. Optimization of the resist and RIE processes significantly improved the yield. The final yields obtained from electrical measurements were 100% for hp 30 nm, 70% for hp 28 nm, and 40% for hp 26 nm. These results demonstrate EUV lithography to be a practical technology that is now suitable for 2x nm semiconductor manufacture.

  15. Text analysis devices, articles of manufacture, and text analysis methods

    Science.gov (United States)

    Turner, Alan E; Hetzler, Elizabeth G; Nakamura, Grant C

    2013-05-28

    Text analysis devices, articles of manufacture, and text analysis methods are described according to some aspects. In one aspect, a text analysis device includes processing circuitry configured to analyze initial text to generate a measurement basis usable in analysis of subsequent text, wherein the measurement basis comprises a plurality of measurement features from the initial text, a plurality of dimension anchors from the initial text and a plurality of associations of the measurement features with the dimension anchors, and wherein the processing circuitry is configured to access a viewpoint indicative of a perspective of interest of a user with respect to the analysis of the subsequent text, and wherein the processing circuitry is configured to use the viewpoint to generate the measurement basis.

  16. 21 CFR 801.122 - Medical devices for processing, repacking, or manufacturing.

    Science.gov (United States)

    2010-04-01

    ... manufacturing. 801.122 Section 801.122 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND....122 Medical devices for processing, repacking, or manufacturing. A device intended for processing... act if its label bears the statement “Caution: For manufacturing, processing, or repacking”. ...

  17. A New Concept On A Quantum Computer Based On Schockley-Read-Hall Recombination Statistics In Microelectronic Devices

    Science.gov (United States)

    Theodoropoulos, K.; Ntalaperas, D.; Petras, I.; Tsakalidis, A.; Konofaos, N.

    2005-06-01

    In this paper a quantum computer based on the recombination processes happening in semiconductor devices is presented. A "data element" and a "computational element" are derived based on Schokley-Read-Hall statistics and they can later be used in order to manifest a simple and known quantum algorithm. Such a paradigm is shown by the application of the proposed technology onto the Shor's period-finding algorithm.

  18. Data graphing methods, articles of manufacture, and computing devices

    Science.gov (United States)

    Wong, Pak Chung; Mackey, Patrick S.; Cook, Kristin A.; Foote, Harlan P.; Whiting, Mark A.

    2016-12-13

    Data graphing methods, articles of manufacture, and computing devices are described. In one aspect, a method includes accessing a data set, displaying a graphical representation including data of the data set which is arranged according to a first of different hierarchical levels, wherein the first hierarchical level represents the data at a first of a plurality of different resolutions which respectively correspond to respective ones of the hierarchical levels, selecting a portion of the graphical representation wherein the data of the portion is arranged according to the first hierarchical level at the first resolution, modifying the graphical representation by arranging the data of the portion according to a second of the hierarchal levels at a second of the resolutions, and after the modifying, displaying the graphical representation wherein the data of the portion is arranged according to the second hierarchal level at the second resolution.

  19. Microelectronics in Education

    Science.gov (United States)

    Orton, Richard J. J.

    2011-01-01

    The history and meaning of the term "microelectronics" is reviewed, followed by a discussion of the key inventions of the Intel microprocessor in 1971 and the Texas Instruments electronic pocket calculator in 1975. The six characteristic features of microelectronic components are then defined. The UK prime minister Jim Callaghan's…

  20. Microelectronics and Music Education.

    Science.gov (United States)

    Hofstetter, Fred T.

    1979-01-01

    This look at the impact of microelectronics on computer-assisted instruction (CAI) in music notes trends toward new applications and lower costs. Included are: a rationale for CAI in music, a list of sample programs, comparison of five microelectronic music systems, PLATO cost projections, and sources of further information. (SJL)

  1. Microelectronics in Education

    Science.gov (United States)

    Orton, Richard J. J.

    2011-01-01

    The history and meaning of the term "microelectronics" is reviewed, followed by a discussion of the key inventions of the Intel microprocessor in 1971 and the Texas Instruments electronic pocket calculator in 1975. The six characteristic features of microelectronic components are then defined. The UK prime minister Jim Callaghan's address to the…

  2. Rapid Manufacturing of Reconfigurable Satellite Panels with Embedded Electronics, Embedded Thermal Devices, and Novel Structural Features

    OpenAIRE

    Young, Quinn; Stucker, Brent

    2006-01-01

    The Center for Advanced Satellite Manufacturing (CASM) at Utah State University has been investigating the use of new, advanced manufacturing technologies for the rapid manufacture of highly capable satellite panels. Using Ultrasonic Consolidation it is now possible to additively manufacture (a.k.a. rapid prototype) aluminum structures with embedded electronics, thermal devices, internal structural features, and fibers. CASM has built and tested embedded USB networks, electronic devices, ther...

  3. Space radiation environment prediction for VLSI microelectronics devices onboard a LEO satellite using OMERE-TRAD software

    Science.gov (United States)

    Sajid, Muhammad; Chechenin, N. G.; Torres, Frank Sill; Khan, E. U.; Agha, Shahrukh

    2015-07-01

    Space radiation environment at Low Earth Orbits (LEO) with perigee at 300 km, apogee at 600 km altitude having different orbital inclinations was modeled in the form of electrons and protons trapped in Van Allen Earth Radiation Belts (ERBs), heavy ions and protons in Galactic Cosmic Rays (GCRs), and Energetic Solar Particles (ESP) Events during solar maximum period. The co-relation between various shielding thicknesses and particles transport flux was analyzed for this specific orbit. We observed that there is an optimum shield thickness above which the attenuation of the transmitted flux of incident particles is negligible. To estimate the orbit average differential and integral fluxes to be encountered by onboard devices an appropriate radiation environment models were chosen in OMERE-TRAD toolkit and the impact of various shielding thickness for different orbital inclinations on integral Linear-Energy-Transfer (LET) spectra were determined.

  4. CEMA cooperation in microelectronics research, production

    Science.gov (United States)

    1984-03-01

    The assignments resulting from an agreement concerning multilateral specialization and cooperation among European socialist countries in the development and production of microelectronic components for computer technology are enumerated. Several areas which impact directly on the manufacture of large scale and very large scale integrated components are identified.

  5. Microelectronic systems 1 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems 1 Checkbook provides coverage of the Business and Technician Education Council level 1 unit in Microelectronic Systems. However, it can be regarded as a basic textbook in microelectronic systems for a much wider range of studies. Each topic considered in the text is presented in a way that assumes the reader has little prior knowledge of electronics. The aim of the book is to provide an introduction to the concept of systems, to differentiate analogue and digital systems, and to describe the nature of microprocessor-controlled systems. An introduction to programming is

  6. Biomedical implantable microelectronics.

    Science.gov (United States)

    Meindl, J D

    1980-10-17

    Innovative applications of microelectronics in new biomedical implantable instruments offer a singular opportunity for advances in medical research and practice because of two salient factors: (i) beyond all other types of biomedical instruments, implants exploit fully the inherent technical advantages--complex functional capability, high reliability, lower power drain, small size and weight-of microelectronics, and (ii) implants bring microelectronics into intimate association with biological systems. The combination of these two factors enables otherwise impossible new experiments to be conducted and new paostheses developed that will improve the quality of human life.

  7. Review of laser micromachining in contract manufacturing

    Science.gov (United States)

    Ogura, Glenn; Gu, Bo

    1998-06-01

    This paper explores the wide range of laser micromachining applications used in contract manufacturing. Contract manufacturing is used in several key industries such as microelectronics packaging, semiconductor, data storage, medical devices, communications, peripherals, automobiles and aerospace. Material types includes plastics, metals, ceramics, inorganics and composites. However laser micromachining is just one available technology for micromachining and other methods will be reviewed. Contract manufacturing offers two important glimpses of the future. Firstly prototype work for new applications often beings in contract manufacturing. Secondly, contract manufacturing can be an economic springboard to allow laser systems to be installed in a production environment.

  8. Surface analysis in microelectronics.

    Science.gov (United States)

    Pignataro, S

    1995-10-01

    The contribution given by surface analysis to solve some problems encountered in the production of electronic power devices have been discussed. Mainly two types of problems have been faced. One of these deal with interfacial chemistry. Three examples have been investigated. The first applies to the improvement of the quality and the reliability of plastic packages through the optimization of the resin/metal and resin/die adhesion. The second relies to the adhesion between polyimide and silicon nitride used in the multilevel technology. The third example refers to the so called die-attach process and related problems. Another area of interest in microelectronics is that of the erosion of various types of surfaces and the possibility of wrong etching. A few examples of the application of surface analytical techniques for these problems will be presented. XPS and SIMS working in imaging and multipoint analysis mode, scanning acoustic microscopy, contact angle measurements as well as peeling and tensile strength measurements are the main tools used to obtain useful data.

  9. Testing microelectronic biofluidic systems

    NARCIS (Netherlands)

    Kerkhoff, Hans G.

    2007-01-01

    According to the 2005 International Technology Roadmap for Semiconductors, the integration of emerging nondigital CMOS technologies will require radically different test methods, posing a major challenge for designers and test engineers. One such technology is microelectronic fluidic (MEF) arrays,

  10. Testing microelectronic biofluidic systems

    NARCIS (Netherlands)

    Kerkhoff, Hans G.

    2007-01-01

    According to the 2005 International Technology Roadmap for Semiconductors, the integration of emerging nondigital CMOS technologies will require radically different test methods, posing a major challenge for designers and test engineers. One such technology is microelectronic fluidic (MEF) arrays, w

  11. Leveraging Microelectronics Research to Enable A Smarter Planet

    Science.gov (United States)

    Dalton, Timothy J.

    2009-10-01

    Over the course of the last fifty years, the microelectronics industry has made tremendous strides in the development and manufacturing of ever more complex integrated circuits (IC). These circuits have typically been applied to the information technology (IT) industry and have driven improvements in the computational power per dollar of many orders of magnitude. Part of the ``toolbox'' of skills acquired to produce integrated circuits is the ability to form desired patterns at ever decreasing sizes. The minimum controllable feature size has been reduced by six orders of magnitude (from millimeters to nanometers) during the last fifty years. With feature sizes rapidly approaching 10nm, the conventional silicon IC industry is nearing a threshold with the end of conventional silicon scaling approaching. Research today focuses on new device structure to replace the CMOS FET as the engine of the IT industry. A very exciting research area today is the concept of taking the skill-set acquired from IC research, development, and manufacturing, and applying those skills into new domains where they can enable a ``smarter planet''. These new domains include areas such as energy, water, and health care / life sciences. All of these are outside of the traditional IT focus for microelectronics research, yet, the new ``smarter planet'' domains may form the basis for future industries. This presentation will look at the evolution of IBM's research model and focus, shifting from one solely focused on IT, to one that compliments IT research with Smarter Planet domains.

  12. Advanced Microelectronics Technologies for Future Small Satellite Systems

    Science.gov (United States)

    Alkalai, Leon

    1999-01-01

    Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

  13. Analogy among microfluidics, micromechanics, and microelectronics.

    Science.gov (United States)

    Li, Sheng-Shian; Cheng, Chao-Min

    2013-10-07

    We wish to illuminate the analogous link between microfluidic-based devices, and the already established pairing of micromechanics and microelectronics to create a triangular/three-way scientific relationship as a means of interlinking familial disciplines and accomplishing two primary goals: (1) to facilitate the modeling of multidisciplinary domains; and, (2) to enable us to co-simulate the entire system within a compact circuit simulator (e.g., Cadence or SPICE). A microfluidic channel-like structure embedded in a micro-electro-mechanical resonator via our proposed CMOS-MEMS technology is used to illustrate the connections among microfluidics, micromechanics, and microelectronics.

  14. Earth analysis methods, subsurface feature detection methods, earth analysis devices, and articles of manufacture

    Science.gov (United States)

    West, Phillip B [Idaho Falls, ID; Novascone, Stephen R [Idaho Falls, ID; Wright, Jerry P [Idaho Falls, ID

    2012-05-29

    Earth analysis methods, subsurface feature detection methods, earth analysis devices, and articles of manufacture are described. According to one embodiment, an earth analysis method includes engaging a device with the earth, analyzing the earth in a single substantially lineal direction using the device during the engaging, and providing information regarding a subsurface feature of the earth using the analysis.

  15. Earth analysis methods, subsurface feature detection methods, earth analysis devices, and articles of manufacture

    Science.gov (United States)

    West, Phillip B.; Novascone, Stephen R.; Wright, Jerry P.

    2011-09-27

    Earth analysis methods, subsurface feature detection methods, earth analysis devices, and articles of manufacture are described. According to one embodiment, an earth analysis method includes engaging a device with the earth, analyzing the earth in a single substantially lineal direction using the device during the engaging, and providing information regarding a subsurface feature of the earth using the analysis.

  16. The Unilab Blue Chip Range for Introducing Microelectronics.

    Science.gov (United States)

    Jarvis, W. H.

    1981-01-01

    Discusses various topics in microelectronics to aid those teaching modern electronics for the first time, including, among others, the slang name "micro," attitudes of examining boards, rapid obsolescence of electronic devices, costs, analog systems, and digital systems. (SK)

  17. Reliability and qualification of advanced microelectronics for space applications

    Science.gov (United States)

    Kayali, S.

    2003-01-01

    This paper provides a discussion of the subject and an approach to establish a reliability and qualification methodology to facilitate the utilization of state-of-the-art advanced microelectronic devices and structures in high reliability applications.

  18. Chemistry in microelectronics

    CERN Document Server

    Le Tiec, Yannick

    2013-01-01

    Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionalit

  19. Moore's law: the future of Si microelectronics

    Directory of Open Access Journals (Sweden)

    Scott E. Thompson

    2006-06-01

    Full Text Available Soon after Bardeen, Brattain, and Shockley invented a solid-state device in 19471 to replace electron vacuum tubes, the microelectronics industry and a revolution started. Since its birth, the industry has experienced four decades of unprecedented explosive growth driven by two factors: Noyce and Kilby inventing the planar integrated circuit2,3 and the advantageous characteristics that result from scaling (shrinking solid-state devices.

  20. Environmental health aspects of the microelectronics industry.

    Science.gov (United States)

    Himmelstein, J S; Levy, B S

    1986-01-01

    This article reviews examples of contamination to the surface or groundwater, the ambient air, and soil resulting from the microelectronics industry. The potential effects on human health arising from such environmental contamination are discussed, as well as aspects of their diagnosis, treatment, and related public health implications. Given the high costs of pollution control, the emphasis must be on prevention, which can be facilitated by a high level of suspicion and by the design of safety and pollution control into manufacturing processes.

  1. Process chains for the manufacturing of moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Mohammad Aminul; Hansen, Hans Nørgaard; Tang, Peter Torben

    2009-01-01

    Moulded interconnect device (MID) can be defined as an injection-molded plastic part that incorporates both electrical and mechanical functionalities in a single device. It is a relatively new area with enormous potential for industrial applications. At present, there are a number of available pr...

  2. Microelectronics in Scottish Education.

    Science.gov (United States)

    Morris, Ian

    1982-01-01

    Describes the Scottish Microelectronics Development Programme (SMDP), which was undertaken to advance the use of microcomputers in instruction at all educational levels in Scotland. The development of the microprocessor and its effect on educational technology are briefly considered, as well as initial problems and prospects for the future of…

  3. Carbon nanotubes for microelectronics?

    Science.gov (United States)

    Graham, Andrew P; Duesberg, Georg S; Seidel, Robert V; Liebau, Maik; Unger, Eugen; Pamler, Werner; Kreupl, Franz; Hoenlein, Wolfgang

    2005-04-01

    Despite all prophecies of its end, silicon-based microelectronics still follows Moore's Law and continues to develop rapidly. However, the inherent physical limits will eventually be reached. Carbon nanotubes offer the potential for further miniaturization as long as it is possible to selectively deposit them with defined properties.

  4. Electronic and Microelectronic Capabilities.

    Science.gov (United States)

    1982-07-01

    22 3.9 Aztec Products Custom Wet-Chemistry Line ........................................... 22 3.10 KotIrnorgen...Cofight Vertical Rotary Etcher............*....................................................... 22 11. Aztec Products Custom Wet-Chemistry Line...state of the art in thick film hybrid fabrication methods, microelectronic fabrication and assembly, PC board fabrication, and electronic board assembly

  5. EXPERIENCES IN THE AIR SPINNING TO MANUFACTURE MEDICAL DEVICES

    Directory of Open Access Journals (Sweden)

    MARSAL Feliu

    2015-05-01

    Full Text Available The work aims to determine, with scientific rigor, differences in key parameters of the yarns produced by conventional ring spinning systems, open-end and air spinning and its interrelation with the main parameters of those products that are intended for medical-sanitary sector. The experiences have been made in a Spanish company from short fibers sector that has three spinning systems, with tradition and prestige in world market, validating the results in Innotex Center laboratories of the Polytechnic University of Catalonia. Considering the results, it shows that the technology of manufacture of yarns by air is suitable for yarn, woven fabrics and knitting, structures to textile medical-sanitary application, by specific properties as well as enhanced competitiveness, due to the high production rate and shortened spinning process. The viscose yarns manufactured by air mass are more mass regular. The new DR parameter clearly indicates a better look of the finished fabric when we work with yarns produced by air technology.The significant reduction of the hairiness means less formation of loose fibres by friction, very important in the application of these yarns in the manufacture of textile structures for medical-sanitary use. Also no-table increase of about 15% in the absorption capacity of the fluids, especially water, from the yarns made by air. In the functionalization of fabrics obtained from spun yarn by air will need to apply a permanent smoothing.

  6. 27 CFR 478.153 - Semiautomatic assault weapons and large capacity ammunition feeding devices manufactured or...

    Science.gov (United States)

    2010-04-01

    ... weapons and large capacity ammunition feeding devices manufactured or imported for the purposes of testing... AMMUNITION Exemptions, Seizures, and Forfeitures § 478.153 Semiautomatic assault weapons and large capacity... weapon, and § 478.40a with respect to large capacity ammunition feeding devices, shall not apply to the...

  7. Future trends in microelectronics journey into the unknown

    CERN Document Server

    Xu, Jimmy; Zaslavsky, Alexander

    2016-01-01

    Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals. The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities.

  8. Ferroelectric devices, interconnects, and methods of manufacture thereof

    KAUST Repository

    Alshareef, Husam N.

    2013-12-12

    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  9. Additive manufacturing of polymer melts for implantable medical devices and scaffolds.

    Science.gov (United States)

    Youssef, Almoatazbellah; Hollister, Scott J; Dalton, Paul D

    2017-02-28

    Melt processing is routinely used to fabricate medical polymeric devices/implants for clinical reconstruction and can be incorporated into quality systems procedures for medical device manufacture. As additive manufacturing (AM) becomes increasingly used for biomaterials and biofabrication, the translation of new, customizable, medical devices to the clinic becomes paramount. Melt processing is therefore a distinguishable group within AM that provides an avenue to manufacture scaffolds/implants with a clinical end-point. Three key melt processing AM technologies are highlighted in this review: melt micro-extrusion, selective laser sintering and melt electrospinning writing. The in vivo (including clinical) outcomes of medical devices and scaffolds made with these processes are reviewed. Together, they encompass the melt AM of scaffold architectures with feature sizes and resolutions ranging from 800 nm up to 700 μm.

  10. Co-Extrusion: Advanced Manufacturing for Energy Devices

    Energy Technology Data Exchange (ETDEWEB)

    Cobb, Corie Lynn [PARC, Palo Alto, CA (United States)

    2016-11-18

    The development of mass markets for large-format batteries, including electric vehicles (EVs) and grid support, depends on both cost reductions and performance enhancements to improve their economic viability. Palo Alto Research Center (PARC) has developed a multi-material, advanced manufacturing process called co-extrusion (CoEx) to remove multiple steps in a conventional battery coating process with the potential to simultaneously increase battery energy and power density. CoEx can revolutionize battery manufacturing across most chemistries, significantly lowering end-product cost and shifting the underlying economics to make EVs and other battery applications a reality. PARC’s scale-up of CoEx for electric vehicle (EV) batteries builds on a solid base of experience in applying CoEx to solar cell manufacturing, deposition of viscous ceramic pastes, and Li-ion battery chemistries. In the solar application, CoEx has been deployed commercially at production scale where multi-channel CoEx printheads are used to print viscous silver gridline pastes at full production speeds (>40 ft/min). This operational scale-up provided invaluable experience with the nuances of speed, yield, and maintenance inherent in taking a new technology to the factory floor. PARC has leveraged this experience, adapting the CoEx process for Lithium-ion (Li-ion) battery manufacturing. To date, PARC has worked with Li-ion battery materials and structured cathodes with high-density Li-ion regions and low-density conduction regions, documenting both energy and power performance. Modeling results for a CoEx cathode show a path towards a 10-20% improvement in capacity for an EV pouch cell. Experimentally, we have realized a co-extruded battery structure with a Lithium Nickel Manganese Cobalt (NMC) cathode at print speeds equivalent to conventional roll coating processes. The heterogeneous CoEx cathode enables improved capacity in thick electrodes at higher C-rates. The proof-of-principle coin cells

  11. Potential occupational health hazards in the microelectronics industry.

    Science.gov (United States)

    LaDou, J

    1983-02-01

    The microelectronics industry is a major user of a wide variety of chemicals and other toxic materials. In the recent past semiconductor manufacturers have located in many countries and brought a new set of challenging clinical problems to occupational physicians. California, an area with a significant history in the statistical study of health and safety in the microelectronics industry, presents some evidence of potential health hazards in the semiconductor manufacturing process. The Semiconductor Industry Study done in California in 1981 explains the application of many toxic materials in the semiconductor manufacturing process, including a variety of solvents, acids, and metals such as arsenic. The Study documents the extensive use of dopant gases, primarily arsine, phosphine and diborane. Further study is necessary to assure the health and safety of microelectronics workers, particularly in the application of dopant gases.

  12. Microelectronics and nanoelectronics trends, and applications to HEP instrumentation

    CERN Document Server

    CERN. Geneva

    2004-01-01

    Lecture 1 : Microelectronics and HEP instrumentation CMOS technology has been the leading technology in microelectronics for more that 30 years thanks to its outstanding capability to miniaturization and low power consumption. A brief history of the microelectronics semiconductor industry is presented with applications for LEP and LHC experiments. Lecture 2: Future trends in microelectronics and nanoelectronics Trends in miniaturization point to the fabrication of ULSI nanoscale CMOS circuits by the end of the decade. Device issues and quantum effects in nanoscale MOS transistor will be discussed. Beyond CMOS technology, several technology avenues based on nanotechnology are under investigation. We will present some promising nanoelectronic devices and circuits based on Single Electron Tunneling (SET) transistor, nanowire, quantum dot and carbon nanotubes. Lecture 3: Monolithic pixel detectors Microvertex detectors for particle physics experiments currently uses hybrid silicon pixel detector. Novel emerging m...

  13. Post-market clinical research conducted by medical device manufacturers: a cross-sectional survey

    OpenAIRE

    Ross JS; Blount KL; Ritchie JD; Hodshon B; Krumholz HM

    2015-01-01

    Joseph S Ross, Katrina L Blount, Jessica D Ritchie, Beth Hodshon, Harlan M Krumholz Center for Outcomes Research and Evaluation, Yale-New Haven Hospital, New Haven, CT, USA Background: In the US, once a medical device is made available for use, several requirements have been established by the US Food and Drug Administration (FDA) to ensure ongoing post-market surveillance of device safety and effectiveness. Our objective was to determine how commonly medical device manufacturers initiate po...

  14. Communications device identification methods, communications methods, wireless communications readers, wireless communications systems, and articles of manufacture

    Science.gov (United States)

    Steele, Kerry D [Kennewick, WA; Anderson, Gordon A [Benton City, WA; Gilbert, Ronald W [Morgan Hill, CA

    2011-02-01

    Communications device identification methods, communications methods, wireless communications readers, wireless communications systems, and articles of manufacture are described. In one aspect, a communications device identification method includes providing identification information regarding a group of wireless identification devices within a wireless communications range of a reader, using the provided identification information, selecting one of a plurality of different search procedures for identifying unidentified ones of the wireless identification devices within the wireless communications range, and identifying at least some of the unidentified ones of the wireless identification devices using the selected one of the search procedures.

  15. Hybrid microelectronic technology

    Science.gov (United States)

    Moran, P.

    Various areas of hybrid microelectronic technology are discussed. The topics addressed include: basic thick film processing, thick film pastes and substrates, add-on components and attachment methods, thin film processing, and design of thick film hybrid circuits. Also considered are: packaging hybrid circuits, automating the production of hybrid circuits, application of hybrid techniques, customer's view of hybrid technology, and quality control and assurance in hybrid circuit production.

  16. Microelectronics plastic molded packaging

    Energy Technology Data Exchange (ETDEWEB)

    Johnson, D.R. [Ktech Corp., Albuquerque, NM (United States); Palmer, D.W.; Peterson, D.W. [Sandia National Lab., Albuquerque, NM (United States)] [and others

    1997-02-01

    The use of commercial off-the-shelf (COTS) microelectronics for nuclear weapon applications will soon be reality rather than hearsay. The use of COTS for new technologies for uniquely military applications is being driven by the so-called Perry Initiative that requires the U.S. Department of Defense (DoD) to accept and utilize commercial standards for procurement of military systems. Based on this philosophy, coupled with several practical considerations, new weapons systems as well as future upgrades will contain plastic encapsulated microelectronics. However, a conservative Department of Energy (DOE) approach requires lifetime predictive models. Thus, the focus of the current project is on accelerated testing to advance current aging models as well as on the development of the methodology to be used during WR qualification of plastic encapsulated microelectronics. An additional focal point involves achieving awareness of commercial capabilities, materials, and processes. One of the major outcomes of the project has been the definition of proper techniques for handling and evaluation of modern surface mount parts which might be used in future systems. This program is also raising the familiarity level of plastic within the weapons complex, allowing subsystem design rules accommodating COTS to evolve. A two year program plan is presented along with test results and commercial interactions during this first year.

  17. An analytic framework for developing inherently-manufacturable pop-up laminate devices

    Science.gov (United States)

    Aukes, Daniel M.; Goldberg, Benjamin; Cutkosky, Mark R.; Wood, Robert J.

    2014-09-01

    Spurred by advances in manufacturing technologies developed around layered manufacturing technologies such as PC-MEMS, SCM, and printable robotics, we propose a new analytic framework for capturing the geometry of folded composite laminate devices and the mechanical processes used to manufacture them. These processes can be represented by combining a small set of geometric operations which are general enough to encompass many different manufacturing paradigms. Furthermore, such a formulation permits one to construct a variety of geometric tools which can be used to analyze common manufacturability concepts, such as tool access, part removability, and device support. In order to increase the speed of development, reduce the occurrence of manufacturing problems inherent with current design methods, and reduce the level of expertise required to develop new devices, the framework has been implemented in a new design tool called popupCAD, which is suited for the design and development of complex folded laminate devices. We conclude with a demonstration of utility of the tools by creating a folded leg mechanism.

  18. CdTe devices and method of manufacturing same

    Energy Technology Data Exchange (ETDEWEB)

    Gessert, Timothy A.; Noufi, Rommel; Dhere, Ramesh G.; Albin, David S.; Barnes, Teresa; Burst, James; Duenow, Joel N.; Reese, Matthew

    2015-09-29

    A method of producing polycrystalline CdTe materials and devices that incorporate the polycrystalline CdTe materials are provided. In particular, a method of producing polycrystalline p-doped CdTe thin films for use in CdTe solar cells in which the CdTe thin films possess enhanced acceptor densities and minority carrier lifetimes, resulting in enhanced efficiency of the solar cells containing the CdTe material are provided.

  19. Photonomics: automation approaches yield economic aikido for photonics device manufacture

    Science.gov (United States)

    Jordan, Scott

    2002-09-01

    In the glory days of photonics, with exponentiating demand for photonics devices came exponentiating competition, with new ventures commencing deliveries seemingly weekly. Suddenly the industry was faced with a commodity marketplace well before a commodity cost structure was in place. Economic issues like cost, scalability, yield-call it all "Photonomics" -now drive the industry. Automation and throughput-optimization are obvious answers, but until now, suitable modular tools had not been introduced. Available solutions were barely compatible with typical transverse alignment tolerances and could not automate angular alignments of collimated devices and arrays. And settling physics served as the insoluble bottleneck to throughput and resolution advancement in packaging, characterization and fabrication processes. The industry has addressed these needs in several ways, ranging from special configurations of catalog motion devices to integrated microrobots based on a novel mini-hexapod configuration. This intriguing approach allows tip/tilt alignments to be automated about any point in space, such as a beam waist, a focal point, the cleaved face of a fiber, or the optical axis of a waveguide- ideal for MEMS packaging automation and array alignment. Meanwhile, patented new low-cost settling-enhancement technology has been applied in applications ranging from air-bearing long-travel stages to subnanometer-resolution piezo positioners to advance resolution and process cycle-times in sensitive applications such as optical coupling characterization and fiber Bragg grating generation. Background, examples and metrics are discussed, providing an up-to-date industry overview of available solutions.

  20. Microcomponents manufacturing for precise devices by copper vapor laser

    Science.gov (United States)

    Gorny, Sergey; Nikonchuk, Michail O.; Polyakov, Igor V.

    2001-06-01

    This paper presents investigation results of drilling of metal microcomponents by copper vapor laser. The laser consists of master oscillator - spatial filter - amplifier system, electronics switching with digital control of laser pulse repetition rate and quantity of pulses, x-y stage with computer control system. Mass of metal, removed by one laser pulse, is measured and defined by means of diameter and depth of holes. Interaction of next pulses on drilled material is discussed. The difference between light absorption and metal evaporation processes is considered for drilling and cutting. Efficiency of drilling is estimated by ratio of evaporation heat and used laser energy. Maximum efficiency of steel cutting is calculated with experimental data of drilling. Applications of copper vapor laser for manufacturing is illustrated by such microcomponents as pin guide plate for printers, stents for cardio surgery, encoded disks for security systems and multiple slit masks for spectrophotometers.

  1. SYNTHESIS AND APPLICATIONS OF NANOMATERIALS IN MICROELECTRONICS

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    IntroductionThe rapid development of microelectronics andtelecommunication industry in the last few years haspresented enormous opportllnities and challenges forchemical engineers and material scientists alike. Thefuture of all electronic devices is cheaped, lighted,smaller and more reliable. This development requiresfinely engineered materials.The field of engineering hi-tech materials is abroad and interdisciplinary area with extensiveworldwide research and development. Chemicalengineers, materials scient...

  2. Post-market clinical research conducted by medical device manufacturers: a cross-sectional survey.

    Science.gov (United States)

    Ross, Joseph S; Blount, Katrina L; Ritchie, Jessica D; Hodshon, Beth; Krumholz, Harlan M

    2015-01-01

    In the US, once a medical device is made available for use, several requirements have been established by the US Food and Drug Administration (FDA) to ensure ongoing post-market surveillance of device safety and effectiveness. Our objective was to determine how commonly medical device manufacturers initiate post-market clinical studies or augment FDA post-market surveillance requirements for higher-risk devices that are most often approved via the FDA's pre-market approval (PMA) pathway. We conducted a cross-sectional survey of 47 manufacturers with operations in California, Minnesota, and Massachusetts who market devices approved via the PMA pathway. Among 22 respondents (response rate =47%), nearly all self-reported conducting post-market clinical research studies, commonly between 1 and 5; only 1 respondent reported never conducting post-market clinical research studies. While manufacturers most often engaged in these studies to satisfy FDA requirements, other reasons were reported, including performance monitoring and surveillance and market acceptance initiatives. Risks of conducting and not conducting post-market clinical research studies were described through open-ended response to questions. Medical device manufacturers commonly initiate post-market clinical studies at the request of the FDA. Clinical data from these studies should be integrated into national post-market surveillance initiatives.

  3. Fast detection of manufacturing systematic design pattern failures causing device yield loss

    Science.gov (United States)

    Le Denmat, Jean-Christophe; Feldman, Nelly; Riewer, Olivia; Yesilada, Emek; Vallet, Michel; Suzor, Christophe; Talluto, Salvatore

    2015-03-01

    Starting from the 45nm technology node, systematic defectivity has a significant impact on device yield loss with each new technology node. The effort required to achieve patterning maturity with zero yield detractor is also significantly increasing with technology nodes. Within the manufacturing environment, new in-line wafer inspection methods have been developed to identify device systematic defects, including the process window qualification (PWQ) methodology used to characterize process robustness. Although patterning is characterized with PWQ methodology, some questions remain: How can we demonstrate that the measured process window is large enough to avoid design-based defects which will impact the device yield? Can we monitor the systematic yield loss on nominal wafers? From device test engineering point of view, systematic yield detractors are expected to be identified by Automated Test Pattern Generator (ATPG) test results diagnostics performed after electrical wafer sort (EWS). Test diagnostics can identify failed nets or cells causing systematic yield loss [1],[2]. Convergence from device failed nets and cells to failed manufacturing design pattern are usually based on assumptions that should be confirmed by an electrical failure analysis (EFA). However, many EFA investigations are required before the design pattern failures are found, and thus design pattern failure identification was costly in time and resources. With this situation, an opportunity to share knowledge exists between device test engineering and manufacturing environments to help with device yield improvement. This paper presents a new yield diagnostics flow dedicated to correlation of critical design patterns detected within manufacturing environment, with the observed device yield loss. The results obtained with this new flow on a 28nm technology device are described, with the defects of interest and the device yield impact for each design pattern. The EFA done to validate the design

  4. Additively Manufactured Combustion Devices Components for LOX/Methane Applications

    Science.gov (United States)

    Greene, Sandra Elam; Protz, Christopher; Garcia, Chance; Goodman, Dwight; Baker, Kevin

    2016-01-01

    Marshall Space Flight Center (MSFC) has designed, fabricated, and hot-fire tested a variety of successful injectors, chambers, and igniters for potential liquid oxygen (LOX) and methane (CH4) systems since 2005. The most recent efforts have focused on components with additive manufacturing (AM) to include unique design features, minimize joints, and reduce final machining efforts. Inconel and copper alloys have been used with AM processes to produce a swirl coaxial injector and multiple methane cooled thrust chambers. The initial chambers included unique thermocouple ports for measuring local coolant channel temperatures along the length of the chamber. Results from hot-fire testing were used to anchor thermal models and generate a regeneratively cooled thruster for a 4,000 lbf LOX/CH4 engine. The completed thruster will be hot-fire tested in the summer of 2016 at MSFC. The thruster design can also be easily scaled and used on a 25,000 lbf engine. To further support the larger engine design, an AM gas generator injector has been designed. Hot-fire testing on this injector is planned for the summer of 2016 at MSFC.

  5. Microelectronic systems N2 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems N2 Checkbook provides coverage of the Business and Technician Education Council level NII unit in Microelectronic Systems. However, it can be regarded as a textbook in microelectronic systems for a much wider range of studies. The aim of this book is to provide a foundation in microelectronic systems hardware and software techniques. Each topic considered in the text is presented in a way that assumes in the reader only the knowledge attained in BTEC Information Technology Studies F, Engineering Fundamentals F, or equivalent. This book concentrates on the highly popular

  6. The role of the user within the medical device design and development process: medical device manufacturers' perspectives

    Directory of Open Access Journals (Sweden)

    Craven Michael P

    2011-02-01

    Full Text Available Abstract Background Academic literature and international standards bodies suggest that user involvement, via the incorporation of human factors engineering methods within the medical device design and development (MDDD process, offer many benefits that enable the development of safer and more usable medical devices that are better suited to users' needs. However, little research has been carried out to explore medical device manufacturers' beliefs and attitudes towards user involvement within this process, or indeed what value they believe can be added by doing so. Methods In-depth interviews with representatives from 11 medical device manufacturers are carried out. We ask them to specify who they believe the intended users of the device to be, who they consult to inform the MDDD process, what role they believe the user plays within this process, and what value (if any they believe users add. Thematic analysis is used to analyse the fully transcribed interview data, to gain insight into medical device manufacturers' beliefs and attitudes towards user involvement within the MDDD process. Results A number of high-level themes emerged, relating who the user is perceived to be, the methods used, the perceived value and barriers to user involvement, and the nature of user contributions. The findings reveal that despite standards agencies and academic literature offering strong support for the employment formal methods, manufacturers are still hesitant due to a range of factors including: perceived barriers to obtaining ethical approval; the speed at which such activity may be carried out; the belief that there is no need given the 'all-knowing' nature of senior health care staff and clinical champions; a belief that effective results are achievable by consulting a minimal number of champions. Furthermore, less senior health care practitioners and patients were rarely seen as being able to provide valuable input into the process. Conclusions Medical

  7. Monitoring Composite Material Pressure Vessels with a Fiber-Optic/Microelectronic Sensor System

    Science.gov (United States)

    Klimcak, C.; Jaduszliwer, B.

    1995-01-01

    We discuss the concept of an integrated, fiber-optic/microelectronic distributed sensor system that can monitor composite material pressure vessels for Air Force space systems to provide assessments of the overall health and integrity of the vessel throughout its entire operating history from birth to end of life. The fiber optic component would include either a semiconductor light emitting diode or diode laser and a multiplexed fiber optic sensing network incorporating Bragg grating sensors capable of detecting internal temperature and strain. The microelectronic components include a power source, a pulsed laser driver, time domain data acquisition hardware, a microprocessor, a data storage device, and a communication interface. The sensing system would be incorporated within the composite during its manufacture. The microelectronic data acquisition and logging system would record the environmental conditions to which the vessel has been subjected to during its storage and transit, e.g., the history of thermal excursions, pressure loading data, the occurrence of mechanical impacts, the presence of changing internal strain due to aging, delamination, material decomposition, etc. Data would be maintained din non-volatile memory for subsequent readout through a microcomputer interface.

  8. Metallization of bacterial cellulose for electrical and electronic device manufacture

    Science.gov (United States)

    Evans, Barbara R.; O'Neill, Hugh M.; Jansen, Valerie Malyvanh; Woodward, Jonathan

    2011-06-07

    A method for the deposition of metals in bacterial cellulose and for the employment of the metallized bacterial cellulose in the construction of fuel cells and other electronic devices is disclosed. The method for impregnating bacterial cellulose with a metal comprises placing a bacterial cellulose matrix in a solution of a metal salt such that the metal salt is reduced to metallic form and the metal precipitates in or on the matrix. The method for the construction of a fuel cell comprises placing a hydrated bacterial cellulose support structure in a solution of a metal salt such that the metal precipitates in or on the support structure, inserting contact wires into two pieces of the metal impregnated support structure, placing the two pieces of metal impregnated support structure on opposite sides of a layer of hydrated bacterial cellulose, and dehydrating the three layer structure to create a fuel cell.

  9. A review of the scalable nano-manufacturing technology for flexible devices

    Science.gov (United States)

    Huang, Wenbin; Yu, Xingtao; Liu, Yanhua; Qiao, Wen; Chen, Linsen

    2017-01-01

    Recent advances in electronic and photonic devices, such as artificial skin, wearable systems, organic and inorganic light-emitting diodes, have gained considerable commercial and scientific interest in the academe and in industries. However, low-cost and high-throughput nano-manufacturing is difficult to realize with the use of traditional photolithographic processes. In this review, we summarize the status and the limitations of current nanopatterning techniques for scalable and flexible functional devices in terms of working principle, resolution, and processing speed. Finally, several remaining unsolved problems in nano-manufacturing are discussed, and future research directions are highlighted.

  10. A review of the scalable nano-manufacturing technology for flexible devices

    Science.gov (United States)

    Huang, Wenbin; Yu, Xingtao; Liu, Yanhua; Qiao, Wen; Chen, Linsen

    2017-03-01

    Recent advances in electronic and photonic devices, such as artificial skin, wearable systems, organic and inorganic light-emitting diodes, have gained considerable commercial and scientific interest in the academe and in industries. However, low-cost and high-throughput nano-manufacturing is difficult to realize with the use of traditional photolithographic processes. In this review, we summarize the status and the limitations of current nanopatterning techniques for scalable and flexible functional devices in terms of working principle, resolution, and processing speed. Finally, several remaining unsolved problems in nano-manufacturing are discussed, and future research directions are highlighted.

  11. Adhesion in microelectronics

    CERN Document Server

    Mittal, K L

    2014-01-01

    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesi

  12. Structure, properties, and MEMS and microelectronic applications of vanadium oxides

    Indian Academy of Sciences (India)

    Robert B Darling; Shiho Iwanaga

    2009-08-01

    Vanadium oxides have for many decades attracted much attention for their rich and unique physical properties which pose intriguing questions as to their fundamental origins as well as offering numerous potential applications for microelectronics, sensors, and microelectromechanical systems (MEMS). This paper reviews the unique structure and properties of the two most common vanadium oxides which have entered into microfabricated devices, VO2 and V25, and some of the past and future device applications which can be realized using these materials. Two emerging new materials, sodium vanadium bronzes and vanadium oxide nanotubes are also discussed for their potential use in new microelectronic devices.

  13. Moore's law and the impact on trusted and radiation-hardened microelectronics.

    Energy Technology Data Exchange (ETDEWEB)

    Ma, Kwok Kee

    2011-12-01

    In 1965 Gordon Moore wrote an article claiming that integrated circuit density would scale exponentially. His prediction has remained valid for more than four decades. Integrated circuits have changed all aspects of everyday life. They are also the 'heart and soul' of modern systems for defense, national infrastructure, and intelligence applications. The United States government needs an assured and trusted microelectronics supply for military systems. However, migration of microelectronics design and manufacturing from the United States to other countries in recent years has placed the supply of trusted microelectronics in jeopardy. Prevailing wisdom dictates that it is necessary to use microelectronics fabricated in a state-of-the-art technology for highest performance and military system superiority. Close examination of silicon microelectronics technology evolution and Moore's Law reveals that this prevailing wisdom is not necessarily true. This presents the US government the possibility of a totally new approach to acquire trusted microelectronics.

  14. Microelectronics from fundamentals to applied design

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2016-01-01

    This book serves as a practical guide for practicing engineers who need to design analog circuits for microelectronics.  Readers will develop a comprehensive understanding of the basic techniques of analog modern electronic circuit design, discrete and integrated, application as sensors and control and data acquisition systems,and techniques of PCB design.  ·         Describes fundamentals of microelectronics design in an accessible manner; ·         Takes a problem-solving approach to the topic, offering a hands-on guide for practicing engineers; ·         Provides realistic examples to inspire a thorough understanding of system-level issues, before going into the detail of components and devices; ·         Uses a new approach and provides several skills that help engineers and designers retain key and advanced concepts.

  15. An optical device capable of providing a structural color, and a corresponding method of manufacturing such a device

    DEFF Research Database (Denmark)

    2014-01-01

    The present invention relates to an optical device having a nano-structured surface capable of providing a structural color to a normal human viewer, the device made being manufactured in one single material. A plurality of nano- structured protrusions (5) is further arranged with a first......) with respect to the average surface positions. The position, size, and randomness of the protrusions are arranged so as to provide, at least up to a maximum angle of incidence (A_in) with respect to a normal to the surface, an angle-independent substantially homogeneous structural color perception for a normal...

  16. Additively manufactured custom load-bearing implantable devices: grounds for caution

    Directory of Open Access Journals (Sweden)

    Elisabetta M Zanetti

    2017-08-01

    Full Text Available Background Additive manufacturing technologies are being enthusiastically adopted by the orthopaedic community since they are providing new perspectives and new possibilities. First applications were finalised for educational purposes, pre-operative planning, and design of surgical guides; recent applications also encompass the production of implantable devices where 3D printing can bring substantial benefits such as customization, optimization, and manufacturing of very complex geometries. The conceptual smoothness of the whole process may lead to the idea that any medical practitioner can use a 3D printer and her/his imagination to design and produce novel products for personal or commercial use. Aims Outlining how the whole process presents more than one critical aspects, still demanding further research in order to allow a safe application of this technology for fully-custom design, in particular confining attention to orthopaedic/orthodontic prostheses defined as components responding mainly to a structural function. Methods Current knowledge of mechanical properties of additively manufactured components has been examined along with reasons why the behaviour of these components might differ from traditionally manufactured components. The structural information still missing for mechanical design is outlined. Results Mechanical properties of additively manufactured components are not completely known, and especially fatigue limit needs to be examined further. Conclusion At the present stage, with reference to load-bearing implants subjected to many loading cycles, the indication of custom-made additively manufactured medical devices should be restricted to the cases with no viable alternative.

  17. NDE applications in microelectronic industries

    Science.gov (United States)

    Meyendorf, N.; Oppermann, M.; Krueger, P.; Roellig, M.; Wolter, K. J.

    2016-04-01

    New concepts in assembly technology boost our daily life in an unknown way. High end semiconductor industry today deals with functional structures down to a few nanometers. ITRS roadmap predicts an ongoing decrease of the "DRAM half pitch" over the next decade. Packaging of course is not intended to realize pitches at the nanometer scale, but has to face the challenges of integrating such semiconductor devices with smallest pitch and high pin counts into systems. Advanced techniques of nondestructive evaluation (NDE) with resolutions in volume better than 1 micrometer vixen size are urgently needed for the safety and reliability of electronic systems, especially those that are used in long living applications. The development speed of integrated circuits is still very high and is not expected to decrease in the next future. The integration density of microelectronic devices is increasing, the dimensions become smaller and the number of I/O's is getting higher. The development of new types of packages must be done with respect to reliability issues. Potential damage sources must be identified and finally avoided in the new packages. In power electronics production the condition monitoring receives a lot of interest to avoid electrical shortcuts, dead solder joints and interface cracking. It is also desired to detect and characterize very small defects like transportation phenomenon or Kirkendall voids. For this purpose, imaging technologies with resolutions in the sub-micron range are required.

  18. Manufacturing and testing flexible microfluidic devices with optical and electrical detection mechanisms

    NARCIS (Netherlands)

    Ivan, M.G.; Vivet, F.; Meinders, E.R.

    2010-01-01

    Flexible microfluidic devices made of poly(dimethylsiloxane) (PDMS) were manufactured by soft lithography, and tested in detection of ionic species using optical absorption spectroscopy and electrical measurements. PDMS was chosen due to its flexibility and ease of surface modification by exposure

  19. 47 CFR 15.124 - DTV transition notices by manufacturers of televisions and related devices.

    Science.gov (United States)

    2010-10-01

    ... GENERAL RADIO FREQUENCY DEVICES Unintentional Radiators § 15.124 DTV transition notices by manufacturers... programming provided by multi-channel video programming distributors. (b) The notices required under paragraph...-only television sets that receive TV programming through an antenna will need a converter box...

  20. 78 FR 41069 - Medical Device Reporting for Manufacturers; Draft Guidance for Industry and Food and Drug...

    Science.gov (United States)

    2013-07-09

    ... HUMAN SERVICES Food and Drug Administration Medical Device Reporting for Manufacturers; Draft Guidance for Industry and Food and Drug Administration Staff; Availability AGENCY: Food and Drug Administration, HHS. ACTION: Notice. SUMMARY: The Food and Drug Administration (FDA) is announcing the availability...

  1. Manufacturing and testing flexible microfluidic devices with optical and electrical detection mechanisms

    NARCIS (Netherlands)

    Ivan, M.G.; Vivet, F.; Meinders, E.R.

    2010-01-01

    Flexible microfluidic devices made of poly(dimethylsiloxane) (PDMS) were manufactured by soft lithography, and tested in detection of ionic species using optical absorption spectroscopy and electrical measurements. PDMS was chosen due to its flexibility and ease of surface modification by exposure t

  2. Dopant materials used in the microelectronics industry.

    Science.gov (United States)

    Lewis, D R

    1986-01-01

    Advances in microelectronics have transformed the occupational environment of the electronics industry. Large quantities of potentially hazardous materials are now in routine use as integrated circuit manufacturing becomes more complex and specialized. While the acute hazards associated with these dopant materials are clear, the subacute and chronic effects are less evident. Many of these elements are trace elements in humans and may play roles in health and disease in minute concentrations. Early detection and prevention of adverse health effects requires both astute medical surveillance, industrial hygiene, and safety engineering efforts to eliminate the sources of exposure to workers.

  3. Microelectronic test structures for CMOS technology

    CERN Document Server

    Ketchen, Mark B

    2011-01-01

    Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance an

  4. Post-market clinical research conducted by medical device manufacturers: a cross-sectional survey

    Directory of Open Access Journals (Sweden)

    Ross JS

    2015-05-01

    Full Text Available Joseph S Ross, Katrina L Blount, Jessica D Ritchie, Beth Hodshon, Harlan M Krumholz Center for Outcomes Research and Evaluation, Yale-New Haven Hospital, New Haven, CT, USA Background: In the US, once a medical device is made available for use, several requirements have been established by the US Food and Drug Administration (FDA to ensure ongoing post-market surveillance of device safety and effectiveness. Our objective was to determine how commonly medical device manufacturers initiate post-market clinical studies or augment FDA post-market surveillance requirements for higher-risk devices that are most often approved via the FDA's pre-market approval (PMA pathway. Methods and results: We conducted a cross-sectional survey of 47 manufacturers with operations in California, Minnesota, and Massachusetts who market devices approved via the PMA pathway. Among 22 respondents (response rate =47%, nearly all self-reported conducting post-market clinical research studies, commonly between 1 and 5; only 1 respondent reported never conducting post-market clinical research studies. While manufacturers most often engaged in these studies to satisfy FDA requirements, other reasons were reported, including performance monitoring and surveillance and market acceptance initiatives. Risks of conducting and not conducting post-market clinical research studies were described through open-ended response to questions. Conclusion: Medical device manufacturers commonly initiate post-market clinical studies at the request of the FDA. Clinical data from these studies should be integrated into national post-market surveillance initiatives. Keywords: FDA, PMA pathway, post-market surveillance

  5. Microelectronics, radiation, and superconductivity.

    Science.gov (United States)

    Gochfeld, M

    1990-06-01

    Among the costs of technology are health hazards that face employees and consumers. New advances in the highly competitive field of microelectronics involve exposure to a variety of hazards such as gallium arsenide. Small high-technology industries appear unprepared to invest in health and safety. Although stray electromagnetic fields are not a new development, researchers are beginning to assemble data indicating that such fields pose a significant cancer risk under certain circumstances. Data have been obtained on fields associated with power lines on the one hand and consumer products on the other. Although not conclusive, the data are sufficient to warrant carefully designed research into the risks posed by electromagnetic fields. Because the scientific issues require research, there is a need to make basic social value decisions that will determine which technologies will be developed and which ones may be set aside because of their danger at the present time.

  6. Microelectronics improves power electronics

    Energy Technology Data Exchange (ETDEWEB)

    Diehl, R.

    1982-07-01

    The share of electric energy consumed by electric drives - called power current - can be used more efficiently by using power electronic regulating processes. Lower cost for power electronic components and progress in circuit technology are the decisive factors for the widespread use of regulating units. Microelectronics permit a cost-beneficial control of power regulating units, are made them more attractive for the user. Technical and economic attractivity of power electronic regulating processes have increased. These processes are mainly used for adjusting engine speed to the other process engineering parameters like pressure, output or speed. Optimization of power-current consuming processes are expected to achieve an energy saving potential of 15 TWh by the year 1995.

  7. An academic, clinical and industrial update on electrospun, additive manufactured and imprinted medical devices.

    Science.gov (United States)

    Ryan, Christina N M; Fuller, Kieran P; Larrañaga, Aitor; Biggs, Manus; Bayon, Yves; Sarasua, Jose R; Pandit, Abhay; Zeugolis, Dimitrios I

    2015-01-01

    Electrospinning, additive manufacturing and imprint lithography scaffold fabrication technologies have attracted great attention in biomedicine, as they allow production of two- and three- dimensional constructs with tuneable topographical and geometrical features. In vitro data demonstrate that electrospun and imprinted substrates offer control over permanently differentiated and stem cell function. Advancements in functionalisation strategies have further enhanced the bioactivity and reparative capacity of electrospun and additive manufactured devices, as has been evidenced in several preclinical models. Despite this overwhelming success in academic setting, only a few technologies have reached the clinic and only a fraction of them have become commercially available products.

  8. Sustainable Micro-Manufacturing of Micro-Components via Micro Electrical Discharge Machining

    OpenAIRE

    Valeria Marrocco; Giacomo Copani; Irene Fassi; Francesco Modica

    2011-01-01

    Micro-manufacturing emerged in the last years as a new engineering area with the potential of increasing peoples’ quality of life through the production of innovative micro-devices to be used, for example, in the biomedical, micro-electronics or telecommunication sectors. The possibility to decrease the energy consumption makes the micro-manufacturing extremely appealing in terms of environmental protection. However, despite this common belief that the micro-scale implies a higher sustainabil...

  9. Listening to Brain Microcircuits for Interfacing With External World-Progress in Wireless Implantable Microelectronic Neuroengineering Devices: Experimental systems are described for electrical recording in the brain using multiple microelectrodes and short range implantable or wearable broadcasting units.

    Science.gov (United States)

    Nurmikko, Arto V; Donoghue, John P; Hochberg, Leigh R; Patterson, William R; Song, Yoon-Kyu; Bull, Christopher W; Borton, David A; Laiwalla, Farah; Park, Sunmee; Ming, Yin; Aceros, Juan

    2010-01-01

    Acquiring neural signals at high spatial and temporal resolution directly from brain microcircuits and decoding their activity to interpret commands and/or prior planning activity, such as motion of an arm or a leg, is a prime goal of modern neurotechnology. Its practical aims include assistive devices for subjects whose normal neural information pathways are not functioning due to physical damage or disease. On the fundamental side, researchers are striving to decipher the code of multiple neural microcircuits which collectively make up nature's amazing computing machine, the brain. By implanting biocompatible neural sensor probes directly into the brain, in the form of microelectrode arrays, it is now possible to extract information from interacting populations of neural cells with spatial and temporal resolution at the single cell level. With parallel advances in application of statistical and mathematical techniques tools for deciphering the neural code, extracted populations or correlated neurons, significant understanding has been achieved of those brain commands that control, e.g., the motion of an arm in a primate (monkey or a human subject). These developments are accelerating the work on neural prosthetics where brain derived signals may be employed to bypass, e.g., an injured spinal cord. One key element in achieving the goals for practical and versatile neural prostheses is the development of fully implantable wireless microelectronic "brain-interfaces" within the body, a point of special emphasis of this paper.

  10. Affective and personality disturbances among female former microelectronics workers.

    Science.gov (United States)

    Bowler, R M; Mergler, D; Rauch, S S; Harrison, R; Cone, J

    1991-01-01

    The production and manufacture of microelectronic components, carried out primarily by women workers, require extensive use of organic solvents. Affective and personality disturbances frequently have been associated with organic solvent toxicity. A group of women, former microelectronics workers (N = 70), primarily of Hispanic origin (77.1%) but raised in the United States, were evaluated for affective and personality disturbance with the MMPI. Profiles were analyzed, and diagnostic classification was performed blind. Results showed that (1) 85.7% of the profiles indicated abnormally high clinical elevations; and (2) MMPI profile classification revealed four clinical diagnostic groups: somatoform (24.3%), depression (15.7%), anxiety (28.6%), and psychotic (14.3%). These findings indicate significant psychopathology among these women, who formerly had worked in a microelectronics plant. The patterns of impairment present similarities to previous reports of organic solvent toxicity.

  11. Evaluation of advanced microelectronics for inclusion in MIL-STD-975

    Science.gov (United States)

    Scott, W. Richard

    1991-03-01

    The approach taken by NASA and JPL (Jet Propulsion Laboratory) in the development of a MIL-STD-975 section which contains advanced technology such as Large Scale Integration and Very Large Scale Integration (LSI/VLSI) microelectronic devices is described. The parts listed in this section are recommended as satisfactory for NASA flight applications, in the absence of alternate qualified devices, based on satisfactory results of a vendor capability audit, the availability of sufficient characterization and reliability data from the manufacturers and users and negotiated detail procurement specifications. The criteria used in the selection and evaluation of the vendors and candidate parts, the preparation of procurement specifications, and the status of this activity are discussed.

  12. Adverse events associated with ultrasonic scalers: A manufacturer and user facility device experience database analysis

    OpenAIRE

    Rajagopal Athmarao Thennukonda; Bhavani Rekha Natarajan

    2015-01-01

    Background: The present study was conducted to determine the frequency and type of adverse events (AEs) associated with ultrasonic scaler reported to the Food and Drug Administration manufacturer and user facility device experience (MAUDE) database. Materials and Methods: The authors reviewed the ultrasonic scaler units (USU) related AEs reported to MAUDE from October 1, 1995, to September 31, 2015. Analyses of details collected are presented. Results: MAUDE received a total of 667 un...

  13. Porous low dielectric constant materials for microelectronics.

    Science.gov (United States)

    Baklanov, Mikhail R; Maex, Karen

    2006-01-15

    Materials with a low dielectric constant are required as interlayer dielectrics for the on-chip interconnection of ultra-large-scale integration devices to provide high speed, low dynamic power dissipation and low cross-talk noise. The selection of chemical compounds with low polarizability and the introduction of porosity result in a reduced dielectric constant. Integration of such materials into microelectronic circuits, however, poses a number of challenges, as the materials must meet strict requirements in terms of properties and reliability. These issues are the subject of the present paper.

  14. Porous Dielectrics in Microelectronic Wiring Applications

    Directory of Open Access Journals (Sweden)

    Vincent McGahay

    2010-01-01

    Full Text Available Porous insulators are utilized in the wiring structure of microelectronic devices as a means of reducing, through low dielectric permittivity, power consumption and signal delay in integrated circuits. They are typically based on low density modifications of amorphous SiO2 known as SiCOH or carbon-doped oxides, in which free volume is created through the removal of labile organic phases. Porous dielectrics pose a number of technological challenges related to chemical and mechanical stability, particularly in regard to semiconductor processing methods. This review discusses porous dielectric film preparation techniques, key issues encountered, and mitigation strategies.

  15. Fundamentals of semiconductor manufacturing and process control

    CERN Document Server

    May, Gary S

    2006-01-01

    A practical guide to semiconductor manufacturing from process control to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Control covers all issues involved in manufacturing microelectronic devices and circuits, including fabrication sequences, process control, experimental design, process modeling, yield modeling, and CIM/CAM systems. Readers are introduced to both the theory and practice of all basic manufacturing concepts. Following an overview of manufacturing and technology, the text explores process monitoring methods, including those that focus on product wafers and those that focus on the equipment used to produce wafers. Next, the text sets forth some fundamentals of statistics and yield modeling, which set the foundation for a detailed discussion of how statistical process control is used to analyze quality and improve yields. The discussion of statistical experimental design offers readers a powerful approach for systematically varying controllable p...

  16. New Computing Devices and the Drive toward Nanometer-scale Manufacturing

    Science.gov (United States)

    Theis, Thomas

    2013-03-01

    In recent decades, we have become used to the idea of exponentially compounding improvements in manufacturing precision. These improvements are driven in large part by the economic imperative to continuously shrink the devices of information technology, particularly the Complementary Metal Oxide Semiconductor (CMOS) field-effect transistor. However, CMOS technology is clearly approaching some important physical limits. Since roughly 2003, the inability to reduce supply voltages according to constant-field scaling rules, combined with economic constraints on areal power density and total power, has forced designers to limit clock frequencies even as devices have continued to shrink. New channel materials, new device structures, and novel circuits cannot fundamentally alter this new status quo. The device physics must change in a more fundamental way if we are to realize fast digital logic with very low power dissipation. The continued vitality of the information technology revolution and the continued push of manufacturing precision toward nanometer dimensions, will depend on it. Fortunately, there is no shortage of new digital switch concepts based on physical principles which avoid the fundamental voltage-scaling limit of the field-effect transistor. The Nanoelectronics Research Initiative (NRI) is a consortium of leading semiconductor companies established in 2005 to guide and fund fundamental research at U.S. universities with the goal of finding the ``next switch'' to replace the CMOS transistor for storing and manipulating digital information. The National Institute of Standards and Technology (NIST) and the National Science Foundation (NSF) have partnered with NRI to fund this research. To date, NRI has funded the exploration of many novel device concepts, and has guided research comparing the capabilities of these devices. Although no single device has yet emerged as a clear winner with the potential to eclipse the field-effect transistor, results are

  17. Effects of atmospheric neutrons on advanced micro-electronic devices, standards and applications; Effets des neutrons atmospheriques sur les dispositifs microelectroniques avances, normes et applications

    Energy Technology Data Exchange (ETDEWEB)

    Leray, J.L. [CEA, 75 - Paris (France); Baggio, J.; Ferlet-Cavrois, V.; Flament, O. [CEA Bruyeres-le-Chatel, 91 (France)

    2005-10-01

    Since the 1980's, it is known that terrestrial cosmic rays, mainly reported as atmospheric neutrons, can penetrate the natural shielding of buildings, equipments and circuit package and induce soft errors in integrated circuits and breakdown of power devices. The high-energy neutron fluxes of interest, larger than 10 MeV, range between 10 particles/cm{sup 2}/hour at sea level and 10{sup 4} particles/cm{sup 2}/hour at typical airplanes flight altitude of 30000 feet, with modulation due to solar flares. In the 1990's, the phenomenon has pervaded as a consequence of the road-map of electronic devices especially the down-scaling of transistor dimensions, the increase of signal bandwidth and the increase of the size of DRAM and SRAM memory, stand-alone or embedded on processors and system-on-chips. Failure-in-time and soft error rate became unacceptable. Test standards and design solutions have been proposed to maintain reliability of commercial products and improve those used in special high-reliability equipments such as avionic computers. The paper describes the atmospheric neutron flux, the effects in the main classes of devices and specific cases such as neutron induced single event upset observed in CMOS vs. CMOS/SOI and some mitigation issues. In this paper, a model called CCPM (critical cross-point model) is proposed to provide critical graphs of technology node sensitivity along the scaling trend of CMOS. (authors)

  18. Manufacturing process and material selection in concurrent collaborative design of MEMS devices

    Science.gov (United States)

    Zha, Xuan F.; Du, H.

    2003-09-01

    In this paper we present knowledge of an intensive approach and system for selecting suitable manufacturing processes and materials for microelectromechanical systems (MEMS) devices in concurrent collaborative design environment. In the paper, fundamental issues on MEMS manufacturing process and material selection such as concurrent design framework, manufacturing process and material hierarchies, and selection strategy are first addressed. Then, a fuzzy decision support scheme for a multi-criteria decision-making problem is proposed for estimating, ranking and selecting possible manufacturing processes, materials and their combinations. A Web-based prototype advisory system for the MEMS manufacturing process and material selection, WebMEMS-MASS, is developed based on the client-knowledge server architecture and framework to help the designer find good processes and materials for MEMS devices. The system, as one of the important parts of an advanced simulation and modeling tool for MEMS design, is a concept level process and material selection tool, which can be used as a standalone application or a Java applet via the Web. The running sessions of the system are inter-linked with webpages of tutorials and reference pages to explain the facets, fabrication processes and material choices, and calculations and reasoning in selection are performed using process capability and material property data from a remote Web-based database and interactive knowledge base that can be maintained and updated via the Internet. The use of the developed system including operation scenario, use support, and integration with an MEMS collaborative design system is presented. Finally, an illustration example is provided.

  19. Animal experiments with the microelectronics neural bridge IC.

    Science.gov (United States)

    Li, Wenyuan; Pei, Fei; Wang, Zhigong; Lü, Xiaoying

    2012-01-01

    The combination of the neural science and the microelectronics science offers a new way to restore the function of central nervous system. A neural regeneration module is used to be implanted into body to bridge the damaged nerve. A microelectronics neural bridge IC designed in CSMC 0.5□m CMOS process which can detect the neural signal and stimulate the nerve is presented. The neural regeneration module is composed of the microelectronics neural bridge IC and some discrete devices. An animal experiment has been done to check whether the neural signal can be transmitted with the chip normally or not. The animal experiment results suggest that the neural regeneration module can make the neural signal transmit normally.

  20. Electric poling-assisted additive manufacturing process for PVDF polymer-based piezoelectric device applications

    Science.gov (United States)

    Lee, ChaBum; Tarbutton, Joshua A.

    2014-09-01

    This paper presents a new additive manufacturing (AM) process to directly and continuously print piezoelectric devices from polyvinylidene fluoride (PVDF) polymeric filament rods under a strong electric field. This process, called ‘electric poling-assisted additive manufacturing or EPAM, combines AM and electric poling processes and is able to fabricate free-form shape piezoelectric devices continuously. In this process, the PVDF polymer dipoles remain well-aligned and uniform over a large area in a single design, production and fabrication step. During EPAM process, molten PVDF polymer is simultaneously mechanically stresses in-situ by the leading nozzle and electrically poled by applying high electric field under high temperature. The EPAM system was constructed to directly print piezoelectric structures from PVDF polymeric filament while applying high electric field between nozzle tip and printing bed in AM machine. Piezoelectric devices were successfully fabricated using the EPAM process. The crystalline phase transitions that occurred from the process were identified by using the Fourier transform infrared spectroscope. The results indicate that devices printed under a strong electric field become piezoelectric during the EPAM process and that stronger electric fields result in greater piezoelectricity as marked by the electrical response and the formation of sharper peaks at the polar β crystalline wavenumber of the PVDF polymer. Performing this process in the absence of an electric field does not result in dipole alignment of PVDF polymer. The EPAM process is expected to lead to the widespread use of AM to fabricate a variety of piezoelectric PVDF polymer-based devices for sensing, actuation and energy harvesting applications with simple, low cost, single processing and fabrication step.

  1. Developments in microelectronics: Past and future

    Science.gov (United States)

    Zhijian, L.

    1985-04-01

    The evolution of microelectronics in China is reviewed. Current developments and fracture trends seen as characteristic of the technology are discussed and some suggestions are offered as to the advancement of microelectronics in China.

  2. Microelectronics: Their Implications for Education and Training.

    Science.gov (United States)

    Audiovisual Instruction, 1979

    1979-01-01

    This two-part article indicates some probable characteristics of the microelectronics in the future and assesses implications of the microelectronics revolution for the methods and systems currently used in teaching and training. (CMV)

  3. Lexicon generation methods, lexicon generation devices, and lexicon generation articles of manufacture

    Science.gov (United States)

    Carter, Richard J [Richland, WA; McCall, Jonathon D [West Richland, WA; Whitney, Paul D [Richland, WA; Gregory, Michelle L [Richland, WA; Turner, Alan E [Kennewick, WA; Hetzler, Elizabeth G [Kennewick, WA; White, Amanda M [Kennewick, WA; Posse, Christian [Seattle, WA; Nakamura, Grant C [Kennewick, WA

    2010-10-26

    Lexicon generation methods, computer implemented lexicon editing methods, lexicon generation devices, lexicon editors, and articles of manufacture are described according to some aspects. In one aspect, a lexicon generation method includes providing a seed vector indicative of occurrences of a plurality of seed terms within a plurality of text items, providing a plurality of content vectors indicative of occurrences of respective ones of a plurality of content terms within the text items, comparing individual ones of the content vectors with respect to the seed vector, and responsive to the comparing, selecting at least one of the content terms as a term of a lexicon usable in sentiment analysis of text.

  4. Managerial Guidelines for Market Penetration and Expansion: A Case Study of a Medical Devices Manufacturer

    Directory of Open Access Journals (Sweden)

    Vlastimil Juppa

    2013-06-01

    Full Text Available This article brings managerial guidelines for new markets expansion and current market penetration on an example of a Czech medical devices manufacturer. We describe the strategy in evaluation of the opportunities in the territories, of setting up the benchmarks, the steps how to deal with the partners in current territories and how to approach the acquisition of new territories. We show how significant is the sales growth for financials, we mention the limit defined in the Theory of Sustainable Growth. We show how important the level is, how the products are advanced and how important is to have unique products.

  5. 微电子表面贴装关键技术与装备%The Key Technique and Equipment of Micro-electronic Device SMT

    Institute of Scientific and Technical Information of China (English)

    张雍蓉; 刘昊

    2013-01-01

      In this paper,authors put forw ard that optional drag soldering process and dip soldering process can be finished w ithout special m old. A uthors affirm that by using m old shielded w ave soldering technique the m anufacture double-sided packaging forPC B can be achieved.The production efficiency w ill be significantly im proved and the preparing tim e for stick-up solder glue w ill be shortened.B y reducing production costs itw illm ake com patibility w ith traditionalw ave soldering.It can also be conclude that thru-hole reflow soldering process is benefit for im proving w elding quality and low ering process.A uthor m ake research on the direction of SM T printequipm entw hich tow ards dualtransferboard.The SM T equipm entbecom es faster,high-precision,m ore functions,intelligent, m ore cantilevers,m ore placem entheads and flexible connection.A nd the reflow device is on the w ay to m ulti-channelflow controlling,localforced cooling and tem perature m onitoring forcom ponents%  提出了选择性拖焊工艺,浸焊工艺,在无需制作专门的模具即可完成。确认了采用屏蔽模具波峰焊接工艺,实现双面混装PC B 波峰焊生产,大幅度提高双面混装PC B 生产效率,减少粘贴阻焊胶的准备时间,降低生产成本,达到与传统波峰焊接兼容以及通孔回流焊接工艺,对提升焊接质量、减少工艺流程的优势。研究了SM T 印刷设备的双路输送板发展方向、贴片设备的高速、高精密、多功能、智能化、多悬臂、多贴装头、柔性连接模块化发展方向、以及再流焊设备的多喷嘴气流控制、局部强制冷却、可监测元器件温度的发展方向。

  6. Nanocharacterization Challenges in a Changing Microelectronics Landscape

    Science.gov (United States)

    Brilloüt, Michel

    2011-11-01

    As the microelectronics industry enters the "nano"-era new challenges emerge. Traditional scaling of the MOS transistor faces major obstacles in fulfilling "Moore's law". New features like strain and new materials (e.g. high k—metal gate stack) are introduced in order to sustain performance increases. For a better electrostatic control, devices will use the third dimension, e.g., in gate-all-around nanowire structures. Due to the escalating cost and complexity of sub-28 nm technologies fewer industrial players can afford the development and production of advanced CMOS processes and many companies acknowledge the fact that the value in products can also be obtained in using more diversified non-digital technologies (the so-called "More-than-Moore" domain). This evolving landscape brings new requirements—discussed in this paper—in terms of physical characterization of technologies and devices.

  7. Microvibration monitoring: some recent experiences in an operating microelectronics facility

    Science.gov (United States)

    Hassett, Kevin

    1992-02-01

    Major construction work is currently underway at Intel''s Aloha, Oregon, campus. Because of concerns about the effects that construction-generated vibration might have on adjacent ongoing microelectronics manufacturing activities, two important steps were taken. The first of these was to establish guidelines that would be followed by the construction contractor to limit vibration disturbance. The second was to install a computer-based monitoring system that would continuously measure the vibration on the floor of the microelectronics manufacturing facility. In this way, the vibration effects of the construction activities would be monitored and adjusted, by modifying procedures, if necessary. The monitoring program is discussed in this paper. The major characteristics of the monitoring system, the placement of the transducers, and the ways in which the data were managed are described. Some typical data are shown and discussed.

  8. Microelectronics in Education--A Changing Future.

    Science.gov (United States)

    Humphries, Chris

    1985-01-01

    Describes major program activities of Microelectronics Education Programme (MEP) for England, Wales, and Northern Ireland, which is designed to help schools prepare children for society with microelectronics. The core elements and potential consequences of the Microelectronics Support Unit, a follow-up to MEP which will conclude activities in…

  9. Liver enzymes among microelectronics equipment maintenance technicians.

    Science.gov (United States)

    Upfal, M

    1992-04-01

    Equipment maintenance workers within the microelectronics industry have opportunities for occupational exposure to a variety of toxic agents. This pilot investigation compares liver enzymes in this population with that of other coworkers. Participants (n = 135) were randomly selected from a medical surveillance program at the manufacturing facility. Nine job categories were examined, including equipment maintenance workers and electronic technicians. Although abnormal liver enzymes were detected among equipment maintenance workers (odds ratio 16.4; P less than .008) and electronic technicians (odds ratio 27; P less than .0005), the numbers of participants were small (n = 8, 10). The data suggest that independent and/or interactive etiologic roles of occupation and alcohol should be further investigated. Early detection of subclinical occupational or recreational hepatotoxicity with appropriate employment of industrial hygiene control technology and/or the reduction of alcohol consumption may provide a means of preventing liver disease.

  10. Microelectronics and Computers in Medicine.

    Science.gov (United States)

    Meindl, James D.

    1982-01-01

    The use of microelectronics and computers in medicine is reviewed, focusing on medical research; medical data collection, storage, retrieval, and manipulation; medical decision making; computed tomography; ultrasonic imaging; role in clinical laboratories; and use as adjuncts for diagnostic tests, monitors of critically-ill patients, and with the…

  11. Fundamentals of Microelectronics Processing (VLSI).

    Science.gov (United States)

    Takoudis, Christos G.

    1987-01-01

    Describes a 15-week course in the fundamentals of microelectronics processing in chemical engineering, which emphasizes the use of very large scale integration (VLSI). Provides a listing of the topics covered in the course outline, along with a sample of some of the final projects done by students. (TW)

  12. Launching a Programme on Microelectronics.

    Science.gov (United States)

    Fothergill, Richard

    1982-01-01

    Discusses the priorities and problems in the development by the United Kingdom Department of Education and Science of a program to introduce microelectronic technology to elementary and secondary level students. The basic needs for program implementation, information support required for the program, inservice teacher training, and curriculum…

  13. Microelectronics effects as seen on CRRES.

    Science.gov (United States)

    Mullen, E G; Ray, K P

    1994-10-01

    A MicroElectronics Test Package (MEP) measured total dose degradation and single event upsets (SEUs) on 60 device types on the Combined Release and Radiation Effects Satellite (CRRES) in an 18 degrees inclination orbit between 350 km and 36000 km from July 1990 to October 1991. Simultaneous measurements of the high energy particle environment were used to make a direct cause and effect comparison of the energetic particle backgrounds and microelectronic performance characteristics. The galactic cosmic ray background for the period of the CRRES mission was at a minimum. The SEUs experienced from the cosmic ray background were correspondingly few in number, but surprisingly produced an equal probability of upset over an L-shell range of 8.5 Earth radii (RE) down to less than 3.0 RE. Cosmic ray induced upset frequencies in proton sensitive chips were over 2 orders of magnitude lower than those produced by protons in the heart of the inner proton radiation belts. Multiple upsets, those produced when a single particle upsets more than one memory location, were just as common from protons as from cosmic rays.

  14. Microelectronic Stimulator Array

    Science.gov (United States)

    2000-08-09

    retinal prosthesis test device. Figure 3b shows an enlarged view of a nano-channel glass (NCG) electrode array. Figure 4 shows a conceptual layout (floor...against a visual cortex. 10 This involves invasive brain surgery through the cranium . From a surgical point of view, the intra ocular approach is

  15. Using SDI-12 with ST microelectronics MCU's

    Energy Technology Data Exchange (ETDEWEB)

    Saari, Alexandra [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Hinzey, Shawn Adrian [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Frigo, Janette Rose [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Proicou, Michael Chris [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Borges, Louis [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2015-09-03

    ST Microelectronics microcontrollers and processors are readily available, capable and economical processors. Unfortunately they lack a broad user base like similar offerings from Texas Instrument, Atmel, or Microchip. All of these devices could be useful in economical devices for remote sensing applications used with environmental sensing. With the increased need for environmental studies, and limited budgets, flexibility in hardware is very important. To that end, and in an effort to increase open support of ST devices, I am sharing my teams' experience in interfacing a common environmental sensor communication protocol (SDI-12) with ST devices.

  16. Electrospray as a suitable technique for manufacturing carbon-based devices

    Science.gov (United States)

    Varea, Aïda; Monereo, Oriol; Xuriguera, Elena; Prades, J. Daniel; Cirera, Albert

    2017-08-01

    We demonstrate here that electrospray is a technique suitable for deposition carbon-based materials. It is versatile enough to be used with graphene oxide (GO), reduced graphene oxide (rGO) and carbon nanofibers (CNF), obtained by chemical methods. A detailed analysis of the effects of the dispersion properties and the main process parameters (voltage and flow rate) on the deposits quality is presented. Rigid and flexible substrates have been coated with good geometry control under ambient conditions. Thickness of GO films onto silicon substrates, optical transmittance of rGO onto fluoride doped tin oxide (FTO) coated glass substrate and electrical resistance of both, rGO and CNF films onto flexible polyamide have been correlated with deposition time. As an example of application, the manufacture of carbon nanofibers gas sensing devices deposited onto a ceramic platform and flexible polyimide by means of electrospray technique are shown.

  17. Computer Simulation of Robotic Device Components in 3D Printer Manufacturing

    Directory of Open Access Journals (Sweden)

    M. A. Kiselev

    2016-01-01

    Full Text Available The paper considers a relevant problem "Computer simulation of robotic device components in manufacturing on a 3D printer" and highlights the problem of computer simulation based on the cognitive programming technology of robotic device components. The paper subject is urgent because computer simulation of force-torque and accuracy characteristics of robot components in terms of their manufacturing properties and conditions from polymeric and metallic materials is of paramount importance for programming and manufacturing on the 3D printers. Two types of additive manufacturing technologies were used:1. FDM (Fused deposition modeling - layered growth of products from molten plastic strands;2. SLM (Selective laser melting - selective laser sintering of metal powders, which, in turn, create:• conditions for reducing the use of expensive equipment;• reducing weight and increasing strength through optimization of  the lattice structures when using a bionic design;• a capability to implement mathematical modeling of individual components of robotic and other devices in terms of appropriate characteristics;• a 3D printing capability to create unique items, which cannot be made by other known methods.The paper aim was to confirm the possibility of ensuring the strength and accuracy characteristics of cases when printing from polymeric and metallic materials on a 3D printer. The investigation emphasis is on mathematical modeling based on the cognitive programming technology using the additive technologies in their studies since it is, generally, impossible to make the obtained optimized structures on the modern CNC machines.The latter allows us to create a program code to be clear to other developers without cost, additional time for development, adaptation and implementation.Year by year Russian companies increasingly use a 3D-print system in mechanical engineering, aerospace industry, and for scientific purposes. Machines for the additive

  18. PREFACE: The Second Conference on Microelectronics, Microsystems and Nanotechnology

    Science.gov (United States)

    Nassiopoulou, Androula G.; Papanikolaou, Nikos; Tsamis, Christos

    2005-01-01

    The Second Conference on Microelectronics, Microsystems and Nanotechnology took place at the National Centre for Scientific Research `Demokritos', in Athens, Greece, between 14 and 17 November 2004. The conference was organized by the Institute of Microelectronics (IMEL) with the aim to bring together scientists and engineers working in the above exciting fields in an interactive forum. The conference included 45 oral presentations with 9 invited papers and was attended by 146 participants from 16 countries. The topics covered were nanotechnologies, quantum devices, sensors, micro- and nano-systems, semiconductor devices, C-MOS fabrication and characterization techniques, new materials, and IC design. Quantum devices and nanostructured materials attracted considerable attention. Both theoretical and experimental studies of metallic and semiconducting quantum systems were presented, with emphasis on their applications in electronics, optoelectronics, and nanocrystal memory devices. Another exciting topic was the recent developments in biocompatible lithographic processes for applications in biosensors. In particular novel processes for bio-friendly lithography, together with innovations in Si sensors for applications in medicine and food industry were presented. Recent developments and perspectives in CMOS technology towards the ultimate limit were also discussed. The conference covered issues and concepts of IC design with two invited talks on RF design and cryptography.The conference included presentations from several companies active in the field of microelectronics and systems in Greece.

  19. Hearing Device Manufacturers Call for Interoperability and Standardization of Internet and Audiology.

    Science.gov (United States)

    Laplante-Lévesque, Ariane; Abrams, Harvey; Bülow, Maja; Lunner, Thomas; Nelson, John; Riis, Søren Kamaric; Vanpoucke, Filiep

    2016-10-01

    This article describes the perspectives of hearing device manufacturers regarding the exciting developments that the Internet makes possible. Specifically, it proposes to join forces toward interoperability and standardization of Internet and audiology. A summary of why such a collaborative effort is required is provided from historical and scientific perspectives. A roadmap toward interoperability and standardization is proposed. Information and communication technologies improve the flow of health care data and pave the way to better health care. However, hearing-related products, features, and services are notoriously heterogeneous and incompatible with other health care systems (no interoperability). Standardization is the process of developing and implementing technical standards (e.g., Noah hearing database). All parties involved in interoperability and standardization realize mutual gains by making mutually consistent decisions. De jure (officially endorsed) standards can be developed in collaboration with large national health care systems as well as spokespeople for hearing care professionals and hearing device users. The roadmap covers mutual collaboration; data privacy, security, and ownership; compliance with current regulations; scalability and modularity; and the scope of interoperability and standards. We propose to join forces to pave the way to the interoperable Internet and audiology products, features, and services that the world needs.

  20. Fabrication of Thermoelectric Devices Using Additive-Subtractive Manufacturing Techniques: Application to Waste-Heat Energy Harvesting

    Science.gov (United States)

    Tewolde, Mahder

    Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are well suited for waste-heat energy harvesting applications as opposed to primary energy generation. Commercially available thermoelectric modules are flat, inflexible and have limited sizes available. State-of-art manufacturing of TEG devices relies on assembling prefabricated parts with soldering, epoxy bonding, and mechanical clamping. Furthermore, efforts to incorporate them onto curved surfaces such as exhaust pipes, pump housings, steam lines, mixing containers, reaction chambers, etc. require custom-built heat exchangers. This is costly and labor-intensive, in addition to presenting challenges in terms of space, thermal coupling, added weight and long-term reliability. Additive manufacturing technologies are beginning to address many of these issues by reducing part count in complex designs and the elimination of sub-assembly requirements. This work investigates the feasibility of utilizing such novel manufacturing routes for improving the manufacturing process of thermoelectric devices. Much of the research in thermoelectricity is primarily focused on improving thermoelectric material properties by developing of novel materials or finding ways to improve existing ones. Secondary to material development is improving the manufacturing process of TEGs to provide significant cost benefits. To improve the device fabrication process, this work explores additive manufacturing technologies to provide an integrated and scalable approach for TE device manufacturing directly onto engineering component surfaces. Additive manufacturing techniques like thermal spray and ink-dispenser printing are developed with the aim of improving the manufacturing process of TEGs. Subtractive manufacturing techniques like laser micromachining are also studied in detail. This includes the laser processing parameters for cutting the thermal spray materials efficiently by

  1. Microelectronics packaging research directions for aerospace applications

    Science.gov (United States)

    Galbraith, L.

    2003-01-01

    The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.

  2. Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

    NARCIS (Netherlands)

    Wünscher, S.; Abbel, R.; Perelaer, J.; Schubert, U.S.

    2014-01-01

    Well-defined high resolution structures with excellent electrical conductivities are key components of almost every electronic device. Producing these by printing metal based conductive inks on polymer foils represents an important step forward towards the manufacturing of plastic electronic product

  3. Educational Implications of Microelectronics and Microprocessors.

    Science.gov (United States)

    Harris, N. D. C., Ed.

    This conference report explores microelectronic technology, its effect on educational methods and objectives, and its implications for educator responsibilities. Two main areas were considered: the significance of the likely impact of the large scale introduction of microprocessors and microelectronics on commercial and industrial processes, the…

  4. The Legacy of the Microelectronics Education Programme.

    Science.gov (United States)

    Thorne, Michael

    1987-01-01

    Describes the Microelectronics Education Programme (MEP), a plan developed to help British secondary school students learn about microcomputers and the role of technology in society, and its successor, the Microelectronics Support Unit (MESU). Highlights include curriculum development, teacher training, computer assisted instruction and the…

  5. Implications of Pb-free microelectronics assembly in aerospace applications

    Science.gov (United States)

    Shapiro, A. A.; Bonner, J. K.; Ogunseitan, D.; Saphores, J. D.; Schoenung, J.

    2003-01-01

    The commercial microelectronics industry is rapidly moving to completely Pb-free assembly strategies within the next decade. This trend is being driven by existing and proposed legislation in Europe and in Japan. The microelectronics industry has become truly global, as indicated by major U .S. firms who already adopted Pb-free implementation programs. Among these forward-looking firms are AT&T, IBM, Motorola, HP and Intel to name a few.Following Moore's law, advances in microelectronics are happening very rapidly. In many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry will, at some point, be forced to use Pb-free components and subsystems as part of their standard business practices. In this paper we attempt to provide a snapshot of the commercial industry trends and how they may impact electronics in the aerospace environment. In addition, we also look at different strategies for implementation. Finally we present data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The world is moving toward implementation of environmentally friendly manufacturing techniques. The aerospace industry will be forced to deal with issues related with Pb free assembly, either by availability or legislation. This paper provides some insight into some of the tradeoffs that should be considered.

  6. Design for Additive Bio-Manufacturing: From Patient-Specific Medical Devices to Rationally Designed Meta-Biomaterials

    Directory of Open Access Journals (Sweden)

    Amir A. Zadpoor

    2017-07-01

    Full Text Available Recent advances in additive manufacturing (AM techniques in terms of accuracy, reliability, the range of processable materials, and commercial availability have made them promising candidates for production of functional parts including those used in the biomedical industry. The complexity-for-free feature offered by AM means that very complex designs become feasible to manufacture, while batch-size-indifference enables fabrication of fully patient-specific medical devices. Design for AM (DfAM approaches aim to fully utilize those features for development of medical devices with substantially enhanced performance and biomaterials with unprecedented combinations of favorable properties that originate from complex geometrical designs at the micro-scale. This paper reviews the most important approaches in DfAM particularly those applicable to additive bio-manufacturing including image-based design pipelines, parametric and non-parametric designs, metamaterials, rational and computationally enabled design, topology optimization, and bio-inspired design. Areas with limited research have been identified and suggestions have been made for future research. The paper concludes with a brief discussion on the practical aspects of DfAM and the potential of combining AM with subtractive and formative manufacturing processes in so-called hybrid manufacturing processes.

  7. Design for Additive Bio-Manufacturing: From Patient-Specific Medical Devices to Rationally Designed Meta-Biomaterials.

    Science.gov (United States)

    Zadpoor, Amir A

    2017-07-25

    Recent advances in additive manufacturing (AM) techniques in terms of accuracy, reliability, the range of processable materials, and commercial availability have made them promising candidates for production of functional parts including those used in the biomedical industry. The complexity-for-free feature offered by AM means that very complex designs become feasible to manufacture, while batch-size-indifference enables fabrication of fully patient-specific medical devices. Design for AM (DfAM) approaches aim to fully utilize those features for development of medical devices with substantially enhanced performance and biomaterials with unprecedented combinations of favorable properties that originate from complex geometrical designs at the micro-scale. This paper reviews the most important approaches in DfAM particularly those applicable to additive bio-manufacturing including image-based design pipelines, parametric and non-parametric designs, metamaterials, rational and computationally enabled design, topology optimization, and bio-inspired design. Areas with limited research have been identified and suggestions have been made for future research. The paper concludes with a brief discussion on the practical aspects of DfAM and the potential of combining AM with subtractive and formative manufacturing processes in so-called hybrid manufacturing processes.

  8. Design for Additive Bio-Manufacturing: From Patient-Specific Medical Devices to Rationally Designed Meta-Biomaterials

    Science.gov (United States)

    Zadpoor, Amir A.

    2017-01-01

    Recent advances in additive manufacturing (AM) techniques in terms of accuracy, reliability, the range of processable materials, and commercial availability have made them promising candidates for production of functional parts including those used in the biomedical industry. The complexity-for-free feature offered by AM means that very complex designs become feasible to manufacture, while batch-size-indifference enables fabrication of fully patient-specific medical devices. Design for AM (DfAM) approaches aim to fully utilize those features for development of medical devices with substantially enhanced performance and biomaterials with unprecedented combinations of favorable properties that originate from complex geometrical designs at the micro-scale. This paper reviews the most important approaches in DfAM particularly those applicable to additive bio-manufacturing including image-based design pipelines, parametric and non-parametric designs, metamaterials, rational and computationally enabled design, topology optimization, and bio-inspired design. Areas with limited research have been identified and suggestions have been made for future research. The paper concludes with a brief discussion on the practical aspects of DfAM and the potential of combining AM with subtractive and formative manufacturing processes in so-called hybrid manufacturing processes. PMID:28757572

  9. Using federal technology policy to strength the US microelectronics industry

    Science.gov (United States)

    Gover, J. E.; Gwyn, C. W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan's government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  10. Using federal technology policy to strength the US microelectronics industry

    Energy Technology Data Exchange (ETDEWEB)

    Gover, J.E.; Gwyn, C.W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan`s government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  11. Quantum-correlated photon pairs generated in a commercial 45nm complementary metal-oxide semiconductor microelectronics chip

    CERN Document Server

    Gentry, Cale M; Wade, Mark W; Stevens, Martin J; Dyer, Shellee D; Zeng, Xiaoge; Pavanello, Fabio; Gerrits, Thomas; Nam, Sae Woo; Mirin, Richard P; Popović, Miloš A

    2015-01-01

    Correlated photon pairs are a fundamental building block of quantum photonic systems. While pair sources have previously been integrated on silicon chips built using customized photonics manufacturing processes, these often take advantage of only a small fraction of the established techniques for microelectronics fabrication and have yet to be integrated in a process which also supports electronics. Here we report the first demonstration of quantum-correlated photon pair generation in a device fabricated in an unmodified advanced (sub-100nm) complementary metal-oxide-semiconductor (CMOS) process, alongside millions of working transistors. The microring resonator photon pair source is formed in the transistor layer structure, with the resonator core formed by the silicon layer typically used for the transistor body. With ultra-low continuous-wave on-chip pump powers ranging from 5 $\\mu$W to 400 $\\mu$W, we demonstrate pair generation rates between 165 Hz and 332 kHz using >80% efficient WSi superconducting nano...

  12. Remote Microelectronics Fabrication Laboratory MEFLab

    Directory of Open Access Journals (Sweden)

    Jan Machotka

    2008-07-01

    Full Text Available Over the last decade, there has been a move towards using remote laboratories in engineering education. The majority of these laboratories are static, involving limited user-controlled mechanical movements. The University of South Australia has developed such a laboratory, called NetLab that has been successfully utilized for teaching both on-campus and transnational programs in electrical and electronics engineering. Following this success, we are now developing a remote laboratory for microelectronic fabrication, MEFLab. The first stage of the development is a remote laboratory for visual inspection and testing of electronic circuits directly on the silicon wafer under a microscope which is normally conducted in a cleanroom. The major challenge of this project is the accurate positioning of micro-probes remotely over the internet. This paper presents the details of the setup of this new remote laboratory, with a particular emphasis on the development of the hardware, software and graphical user interface.

  13. Assurance of Medical Device Quality with Quality Management System: An Analysis of Good Manufacturing Practice Implementation in Taiwan

    Science.gov (United States)

    Tu, Pei-Weng; Wu, Shiow-Ing

    2015-01-01

    The implementation of an effective quality management system has always been considered a principal method for a manufacturer to maintain and improve its product and service quality. Globally many regulatory authorities incorporate quality management system as one of the mandatory requirements for the regulatory control of high-risk medical devices. The present study aims to analyze the GMP enforcement experience in Taiwan between 1998 and 2013. It describes the regulatory implementation of medical device GMP requirement and initiatives taken to assist small and medium-sized enterprises in compliance with the regulatory requirement. Based on statistical data collected by the competent authority and industry research institutes, the present paper reports the growth of Taiwan local medical device industry after the enforcement of GMP regulation. Transition in the production, technologies, and number of employees of Taiwan medical device industry between 1998 and 2013 provides the competent authorities around the world with an empirical foundation for further policy development. PMID:26075255

  14. Assurance of Medical Device Quality with Quality Management System: An Analysis of Good Manufacturing Practice Implementation in Taiwan

    Directory of Open Access Journals (Sweden)

    Tzu-Wei Li

    2015-01-01

    Full Text Available The implementation of an effective quality management system has always been considered a principal method for a manufacturer to maintain and improve its product and service quality. Globally many regulatory authorities incorporate quality management system as one of the mandatory requirements for the regulatory control of high-risk medical devices. The present study aims to analyze the GMP enforcement experience in Taiwan between 1998 and 2013. It describes the regulatory implementation of medical device GMP requirement and initiatives taken to assist small and medium-sized enterprises in compliance with the regulatory requirement. Based on statistical data collected by the competent authority and industry research institutes, the present paper reports the growth of Taiwan local medical device industry after the enforcement of GMP regulation. Transition in the production, technologies, and number of employees of Taiwan medical device industry between 1998 and 2013 provides the competent authorities around the world with an empirical foundation for further policy development.

  15. Assurance of medical device quality with quality management system: an analysis of good manufacturing practice implementation in Taiwan.

    Science.gov (United States)

    Li, Tzu-Wei; Tu, Pei-Weng; Liu, Li-Ling; Wu, Shiow-Ing

    2015-01-01

    The implementation of an effective quality management system has always been considered a principal method for a manufacturer to maintain and improve its product and service quality. Globally many regulatory authorities incorporate quality management system as one of the mandatory requirements for the regulatory control of high-risk medical devices. The present study aims to analyze the GMP enforcement experience in Taiwan between 1998 and 2013. It describes the regulatory implementation of medical device GMP requirement and initiatives taken to assist small and medium-sized enterprises in compliance with the regulatory requirement. Based on statistical data collected by the competent authority and industry research institutes, the present paper reports the growth of Taiwan local medical device industry after the enforcement of GMP regulation. Transition in the production, technologies, and number of employees of Taiwan medical device industry between 1998 and 2013 provides the competent authorities around the world with an empirical foundation for further policy development.

  16. Carbon-ionogel supercapacitors for integrated microelectronics.

    Science.gov (United States)

    Leung, Greg; Smith, Leland; Lau, Jonathan; Dunn, Bruce; Chui, Chi On

    2016-01-22

    To exceed the performance limits of dielectric capacitors in microelectronic circuit applications, we design and demonstrate on-chip coplanar electric double-layer capacitors (EDLCs), or supercapacitors, employing carbon-coated gold electrodes with ionogel electrolyte. The formation of carbon-coated microelectrodes is accomplished by solution processing and results in a ten-fold increase in EDLC capacitance compared to bare gold electrodes without carbon. At frequencies up to 10 Hz, an areal capacitance of 2.1 pF μm(-2) is achieved for coplanar carbon-ionogel EDLCs with 10 μm electrode gaps and 0.14 mm(2) electrode area. Our smallest devices, comprised of 5 μm electrode gaps and 80 μm(2) of active electrode area, reach areal capacitance values of ∼0.3 pF μm(-2) at frequencies up to 1 kHz, even without carbon. To our knowledge, these are the highest reported values to date for on-chip EDLCs with sub-mm(2) areas. A physical EDLC model is developed through the use of computer-aided simulations for design exploration and optimization of coplanar EDLCs. Through modeling and comparison with experimental data, we highlight the importance of reducing the electrode gap and electrolyte resistance to achieve maximum performance from on-chip EDLCs.

  17. Chemical Mechanical Planarization (CMP) for Microelectronic Applications

    Institute of Scientific and Technical Information of China (English)

    Li Yuzhuo

    2004-01-01

    Surface planarity is of paramount importance in microelectronics. Chemical Mechanical Polishing (CMP) is the most viable approach to address the planarity issues during the fabrication of advanced semiconductor devices. With the integration of copper as interconnect and low k materials as dielectric, the CMP community is facing an ever increasing demand on reducing defectivity without scarifying production throughput. Key issues in CMP today include reduction of surface defectivity and enhancement of planarization efficiency. More specifically, the polished surface should be free of defects such as scratches, pits, corrosion spots, and residue particles. To accomplish these goals, we have investigated a wide range of pathways including reduction of oversized particles,use of unique abrasives such as functionalized nanoparticles, and development of polishing solution without abrasive particles.In this presentation, some fundamental aspects of the CMP process will be given first.Several academic and industrial examples will be used to illustrate the issues and challenges during the implementation of various slurry designs into the CMP processes.

  18. Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability

    Directory of Open Access Journals (Sweden)

    Xuejun Fan

    2015-09-01

    Full Text Available Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact of vapor pressure, a super-hydrophobic (SH coating can be applied on the exterior surface of devices in order to prevent moisture penetration. The underlying mechanism of SH coating for enhancing device reliability, however, is still not fully understood. In this paper, we present several existing theories for predicting vapor pressure within microelectronic materials. In addition, we discuss the mechanism and effectiveness of SH coating in preventing water vapor from entering a device, based on experimental results. Two theoretical models, a micro-mechanics-based whole-field vapor pressure model and a convection-diffusion model, are described for predicting vapor pressure. Both methods have been successfully used to explain experimental results on uncoated samples. However, when a device was coated with an SH nanocomposite, weight gain was still observed, likely due to vapor penetration through the SH surface. This phenomenon may cast doubt on the effectiveness of SH coatings in microelectronic devices. Based on current theories and the available experimental results, we conclude that it is necessary to develop a new theory to understand how water vapor penetrates through SH coatings and impacts the materials underneath. Such a theory could greatly improve microelectronics reliability.

  19. Sputtering materials for VLSI and thin film devices

    CERN Document Server

    Sarkar, Jaydeep

    2010-01-01

    An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall p

  20. Physical Limitations in Lithography for Microelectronics.

    Science.gov (United States)

    Flavin, P. G.

    1981-01-01

    Describes techniques being used in the production of microelectronics kits which have replaced traditional optical lithography, including contact and optical projection printing, and X-ray and electron beam lithography. Also includes limitations of each technique described. (SK)

  1. Optical packaging activities at Institute of Microelectronics (IME), Singapore

    Science.gov (United States)

    Teo, Keng-Hwa; Sudharsanam, Krishnamachari; Pamidighantam, Ramana V.; Yeo, Yongkee; Iyer, Mahadevan K.

    2002-08-01

    The development of optoelectronic components for gigabit Ethernet communications is converging towards access networks where the cost of device makes a significant impact on the market acceptance. Device fabrication and packaging cost have to be brought down with novel assembly and packaging methods. Singapore has established a reputation in semiconductor device development and fabrication with excellent process and packaging facilities. Institute of Microelectronics (IME) was founded in 1991 to add value to the Singapore electronics industry. IME is involved in the development of active and passive photonics components using Silicon and polymer materials. We present a brief report on the development activities taking place in the field of optical component packaging at IME in recent years. We present a review of our competence and some of the optical device packaging activities that are being undertaken.

  2. Health issues in the microelectronics industry.

    Science.gov (United States)

    LaDou, J

    1986-01-01

    Since 1948, when microelectronics entered the American industrial scene, the rapid growth and advancing technology of the industry has caused production facilities to be spread throughout most industrialized areas in the United States. It is now speculated that microelectronics production will be the fourth largest industry in the United States by the end of the century. This article addresses the questions raised about the safety of this industry both for its workers and for the communities in which production facilities are located.

  3. Pattern-integrated interference lithography: prospects for nano- and microelectronics.

    Science.gov (United States)

    Leibovici, Matthieu C R; Burrow, Guy M; Gaylord, Thomas K

    2012-10-08

    In recent years, limitations in optical lithography have challenged the cost-effective manufacture of nano- and microelectronic chips. Spatially regular designs have been introduced to improve manufacturability. However, regular designed layouts typically require an interference step followed by a trim step. These multiple steps increase cost and reduce yield. In the present work, Pattern-Integrated Interference Lithography (PIIL) is introduced to address this problem. PIIL is the integration of interference lithography and superposed pattern mask imaging, combining the interference and the trim into a single-exposure step. Example PIIL implementations and experimental demonstrations are presented. The degrees of freedom associated with the source, pattern mask, and Fourier filter designs are described.

  4. Neuropsychological impairment among former microelectronics workers.

    Science.gov (United States)

    Bowler, R M; Mergler, D; Huel, G; Harrison, R; Cone, J

    1991-01-01

    Although chemicals posing potential neurotoxic hazards are commonly used in the microelectronics industry, there has been no systematic study of possible chronic nervous system effects in microelectronics workers. The objective of the present study was to assess neuropsychological functions of a group of former microelectronics plant assembly workers and a group of referents, using a matched pair design. During employment, the former microelectronics workers had been exposed to multiple organic solvents, including trichloroethylene, xylene, chlorofluorocarbons and trichloroethane. Referents were recruited from the same geographic region. From a pool of 180 former workers and 157 referents, 67 pairs were matched on the basis of age, sex, ethnicity, educational level, sex and number of children. Comparison of results on the subtests of the California Neuropsychological Screening Battery-Revised (CNS-R) revealed significantly lower performance by the former microelectronics workers on tests of attention/concentration, verbal ability, memory functions, visuospatial functions, visuomotor speed, cognitive flexibility, psychomotor speed, and reaction time (t-test for pairs or Wilcoxon Signed Rank p less than 0.05). No significant differences were observed for performance on tests assessing mental status, visual recall, tactile function and learning. This overall pattern of impairment is consistent with organic solvent-related chronic toxic encephalopathy, and possible early stages of dementia. These findings underline the need for more studies among workers currently or previously employed in microelectronics industries.

  5. Integrated microelectronics for smart textiles.

    Science.gov (United States)

    Lauterbach, Christl; Glaser, Rupert; Savio, Domnic; Schnell, Markus; Weber, Werner

    2005-01-01

    The combination of textile fabrics with microelectronics will lead to completely new applications, thus achieving elements of ambient intelligence. The integration of sensor or actuator networks, using fabrics with conductive fibres as a textile motherboard enable the fabrication of large active areas. In this paper we describe an integration technology for the fabrication of a "smart textile" based on a wired peer-to-peer network of microcontrollers with integrated sensors or actuators. A self-organizing and fault-tolerant architecture is accomplished which detects the physical shape of the network. Routing paths are formed for data transmission, automatically circumventing defective or missing areas. The network architecture allows the smart textiles to be produced by reel-to-reel processes, cut into arbitrary shapes subsequently and implemented in systems at low installation costs. The possible applications are manifold, ranging from alarm systems to intelligent guidance systems, passenger recognition in car seats, air conditioning control in interior lining and smart wallpaper with software-defined light switches.

  6. The Microelectronics Education Programme--Dissemination and Diffusion of Microelectronics Technology in Education.

    Science.gov (United States)

    Milne, J. A.; Anderson, J. S. A.

    1984-01-01

    Describes the Microelectronics Education Programme, a development program which embodies the building of a springboard for the dissemination of microelectronic innovations that will benefit education. Springboard activities discussed in detail include information dissemination through regional information centers, inservice teacher training, and…

  7. 21 CFR 821.25 - Device tracking system and content requirements: manufacturer requirements.

    Science.gov (United States)

    2010-04-01

    ... HEALTH AND HUMAN SERVICES (CONTINUED) MEDICAL DEVICES MEDICAL DEVICE TRACKING REQUIREMENTS Tracking... procedure for the collection, maintenance, and auditing of the data specified in paragraphs (a) and (b) of... recording system, and the file maintenance procedures system; and (3) A quality assurance program...

  8. The use of hearing protection devices with approach risk perception of noise induced hearing loss in several manufacturing industry

    Directory of Open Access Journals (Sweden)

    Behzad Fouladi Deahghi

    2015-06-01

    Full Text Available Background & Objective : Noise is a widespread physical agent and although is a most risk factors in workplaces that workers of health to exposed. Thus, different actions is done for reduce exposure to it in work places, which one of them is use of hearing protection devices. The use of hearing protection devices with approach risk perception of noise induced hearing loss in several manufacturing industry Method: This study was Cross-sectional study and done in five industrial unit with a sound pressure level more of 85 dB-A with the participation of 340 workers. To collect data , individual risk perception and self-investigator questionnaires were used. After collecting data, statistical analysis including Cronbach's alpha and regression were used to analyze the data. Results : Range use of hearing protection devices during shifts work by workers, respectively equal to: 50.4% sometimes, 31.58% never and 18.2% at all times. Also, results indicate significant differences between individual differences and hearing protection devices. Conclusion : Results of this study showed that individual risk perception as an important factor, can do a significant role in predicting the behavior of personals in the use of hearing protection devices, which should be considered in any design and implementation of hearing protection program.

  9. Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications

    DEFF Research Database (Denmark)

    Katsia, E.; Huby, N.; Tallarida, G.

    2009-01-01

    Hybrid poly(3-hexylthiophene)/ZnO devices are investigated as rectifying heterojunctions for microelectronics applications. A low-temperature atomic layer deposition of ZnO on top of poly(3-hexylthiophene) allows the fabrication of diodes featuring a rectification ratio of nearly 105 at ±4 V...

  10. Design and manufacture of the dry pulverizing{center_dot}mixing device

    Energy Technology Data Exchange (ETDEWEB)

    Jung, Jae Hoo; Yoon, Ji Sup; Kim, Young Hwan; Jin, Jae Hyoun [KAERI, Taejon (Korea, Republic of)

    2002-07-01

    The dry pulverizing/mixing device is used to deal with the spent fuels for the safe disposal. The separated pellets from hulls by a slitting device are put and oxidized from UO{sub 2} solid pellet to U{sub 3}O{sub 8} powder in the device. The device have been developed based on a voloxidation method which is one of several dry de-cladding methods. We have benchmarked dry de-cladding methods, analyzed applicability to the advanced spent fuel management process, integrated and compared several configuration, and finally derived detailed specifications proper to requirements for the device. Also, thermal characteristics of the device such as thermal stress and strain have been analyzed by the commercial software, I-DEAS, and the reliability of the results have been verified by the KOLAS(KOrea Laboratory Accreditation Scheme). The UO{sub 2} solid pellets are put in the device which has a capacity of 20 kgHM per a batch, heated up about 600 .deg. C in the air environment. Then, the UO{sub 2} solid pellets are oxidized into the U{sub 3}O{sub 8} powder, and the powder is collected in a special vessel. The device has been designed and developed as follows: the multi-staged fine hole meshes are used to reduce the size of the powder gradually, heat and air(oxygen) are supplied continuously to reduce the reaction time, and slight vibration effect are applied to collect powder cling to the device.

  11. Development and fabrication of improved power transistor switches. [fabrication and manufacturing of semiconductor devices

    Science.gov (United States)

    Hower, P. L.; Chu, C. K.

    1976-01-01

    A new class of high-voltage power transistors has been achieved by adapting present interdigitated thyristor processing techniques to the fabrication of NPN Si transistors. Present devices are 2.3 cm in diameter. The electrical performance obtained is consistent with the predictions of an optimum design theory specifically developed for power switching transistors. The forward safe operating area of the experimental transistors shows a significant improvement over commercially available devices. The report describes device design, wafer processing, and various measurements which include dc characteristics, forward and reverse second breakdown limits, and switching times.

  12. Performance Evaluation of Management Environment in Microelectronics Enterprise

    Directory of Open Access Journals (Sweden)

    Hui-ying Gao

    2013-05-01

    Full Text Available For the microelectronics manufacturing industries that have uncertain demand, high volume cost and Oligarchs characteristics, we often discuss the possibility of competitors on the capacity of strategy. First of all we use the industry data to analysis the manufacturing cost, demand and the historical situation of the revenue and we also discuss the influence about the uncertain demand and high volume cost to the industrial structure. Secondly, it put the individual manufacturer not considering the capacity decision of the competitor as the premise and put revenue as the performance target for capacity expansion to construct the mathematical optimization model of the productivity level under the uncertain demand. And the productivity level is called the micro capacity. The manufacturer based on competition and the levels of microscopic production can consider using the radical strategy or still upholding the microscopic optimal capacity, and then put forward a game model to analysis the expected profits of the leaders and the followers who have take the two strategies. Besides, we can use the industrial data to calculate and then get the equilibrium. At last we can calculate the conclusion that for the manufacturers of monopoly industry when they faced with the different marginal profit, different demand variation and hyperbaric capacity amortization cost, the leading manufacturers can use radical production strategy. On the one hand, they can improve the profits, on the other hand they can also compress the profit that was gotten by following the manufacturers. Therefore, the capacity expansion decision can be used as the means of competition for the leading manufacturers.

  13. Manufacture of Simulator of Irradiation Device for China Experimental Fast Reactor

    Institute of Scientific and Technical Information of China (English)

    2011-01-01

    This research belongs to the development of nuclear energy project of CEFR irradiation device design and previous studies of cladding material 316 (Ti) SS irradiation performance. The main content of the research is the development of irradiation

  14. Large scale manufacture of magnetic polymer particles using membranes and microfluidic devices

    Institute of Scientific and Technical Information of China (English)

    Qingchun; Yuan; Richard; A.; Williams

    2007-01-01

    Magnetic polymer particles have found applications in diverse areas such as biomedical treatments, diagnosis and separation technology. These applications require the particles to have controlled sizes and narrow size distributions to gain better control and reproducibility in use. This paper reviews recent developments in the preparation of magnetic polymer particles at nano- and micro-scales by encapsulating magnetic components with dissolved or in situ formed polymers. Particle manufacture using emulsification and embedment methods produces magnetic polymer particles at micro-scale dimensions. However, the production of particles in this range using conventional emulsification methods affords very limited control over particle sizes and polydispersity. We report on alternative routes using membrane and microfluidics emulsification techniques, which have a capability to produce monodisperse emulsions and polymer microspheres (with coefficients of variation of less than 10%) in the range from submicrometer to a few 100 μm. The performance of these manufacturing methods is assessed with a view to future applications.

  15. Additive manufacturing of lab-on-a-chip devices: promises and challenges

    Science.gov (United States)

    Zhu, Feng; Macdonald, Niall P.; Cooper, Jonathan M.; Wlodkowic, Donald

    2013-12-01

    This work describes a preliminary investigation of commercially available 3D printing technologies for rapid prototyping and low volume fabrication of Lab-on-a-Chip devices. The main motivation of the work was to use off-the-shelf 3D printing methods in order to rapidly and inexpensively build microfluidic devices with complex geometric features and reduce the need to use clear room environment and conventional microfabrication techniques. Both multi-jet modelling (MJM) and stereolithography (SLA) processes were explored. MJM printed devices were fabricated using a HD3500+ (3D Systems) high-definition printer using a thermo-polymer VisiJet Crystal (3D Systems) substratum that allows for a z-axis resolution of 16 μm and 25 μm x-y accuracy. SLA printed devices were produced using a Viper Pro (3D Systems) stereolithography system using Watershed 11122XC (DSM Somos) and Dreve Fototec 7150 Clear (Dreve Otoplastik GmbH) resins which allow for a z-axis resolution of 50 μm and 25 μm x-y accuracy. Fabrication results compared favourably with other forms of rapid prototyping such as laser cut PMMA devices and PDMS moulded microfluidic devices of the same design. Both processes allowed for fabrication of monolithic, optically transparent devices with features in the 100 μm range requiring minimal post-processing. Optical polymer qualities following different post-processing methods were also tested in both brightfield and fluorescence imaging of transgenic zebrafish embryos. Finally, we show that only ethanol-treated Dreve Fototec 7150 Clear resign proved to be non-toxic to human cell lines and fish embryos in fish toxicity assays (FET) requiring further investigation of 3D printing materials.

  16. Additive technology of soluble mold tooling for embedded devices in composite structures: A study on manufactured tolerances

    Science.gov (United States)

    Roy, Madhuparna

    Composite textiles have found widespread use and advantages in various industries and applications. The constant demand for high quality products and services requires companies to minimize their manufacturing costs, and delivery time in order to compete in general and niche marketplaces. Advanced manufacturing methods aim to provide economical methods of mold production. Creation of molding and tooling options for advanced composites encompasses a large portion of the fabrication time, making it a costly process and restraining factor. This research discusses a preliminary investigation into the use of soluble polymer compounds and additive manufacturing to fabricate soluble molds. These molds suffer from dimensional errors due to several factors, which have also been characterized. The basic soluble mold of a composite is 3D printed to meet the desired dimensions and geometry of holistic structures or spliced components. The time taken to dissolve the mold depends on the rate of agitation of the solvent. This process is steered towards enabling the implantation of optoelectronic devices within the composite to provide sensing capability for structural health monitoring. The shape deviation of the 3D printed mold is also studied and compared to its original dimensions to optimize the dimensional quality to produce dimensionally accurate parts. Mechanical tests were performed on compact tension (CT) resin samples prepared from these 3D printed molds and revealed crack propagation towards an embedded intact optical fiber.

  17. How do medical device manufacturers' websites frame the value of health innovation? An empirical ethics analysis of five Canadian innovations.

    Science.gov (United States)

    Lehoux, P; Hivon, M; Williams-Jones, B; Miller, F A; Urbach, D R

    2012-02-01

    While every health care system stakeholder would seem to be concerned with obtaining the greatest value from a given technology, there is often a disconnect in the perception of value between a technology's promoters and those responsible for the ultimate decision as to whether or not to pay for it. Adopting an empirical ethics approach, this paper examines how five Canadian medical device manufacturers, via their websites, frame the corporate "value proposition" of their innovation and seek to respond to what they consider the key expectations of their customers. Our analysis shows that the manufacturers' framing strategies combine claims that relate to valuable socio-technical goals and features such as prevention, efficiency, sense of security, real-time feedback, ease of use and flexibility, all elements that likely resonate with a large spectrum of health care system stakeholders. The websites do not describe, however, how the innovations may impact health care delivery and tend to obfuscate the decisional trade-offs these innovations represent from a health care system perspective. Such framing strategies, we argue, tend to bolster physicians' and patients' expectations and provide a large set of stakeholders with powerful rhetorical tools that may influence the health policy arena. Because these strategies are difficult to counter given the paucity of evidence and its limited use in policymaking, establishing sound collective health care priorities will require solid critiques of how certain kinds of medical devices may provide a better (i.e., more valuable) response to health care needs when compared to others.

  18. Polyimide microfluidic devices with integrated nanoporous filtration areas manufactured by micromachining and ion track technology

    Science.gov (United States)

    Metz, S.; Trautmann, C.; Bertsch, A.; Renaud, Ph

    2004-03-01

    This paper reports on polyimide microfluidic devices fabricated by photolithography and a layer transfer lamination technology. The microchannels are sealed by laminating an uncured polyimide film on a partially cured layer and subsequent imidization. Selected areas of the microchannels were irradiated with heavy ions of several hundred MeV and the generated ion tracks are chemically etched to submicron pores of high aspect ratio. The ion beam parameters and the track etching conditions define density, length, diameter and shape of the pores. Membrane permeability and separation performance is demonstrated in cross-flow filtration experiments. The devices can be used for selective delivery or probing of fluids to biological tissue, e.g. drug delivery or microdialysis. For chip-based devices the filters can be used as a sample pre-treatment unit for filtration or concentration of particles or molecules.

  19. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  20. Microelectronic circuit design for energy harvesting systems

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2017-01-01

    This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design. Provides a single-source reference to energy harvesting and its applications; Serves as a practical guide to microelectronics design for energy harvesting, with application to mobile power supplies; Enables readers to develop energy harvesting systems for wearable/mobile electronics.

  1. Spectroscopic ellipsometry as a process control tool for manufacturing cadmium telluride thin film photovoltaic devices

    Science.gov (United States)

    Smith, Westcott P.

    In recent decades, there has been concern regarding the sustainability of fossil fuels. One of the more promising alternatives is Cadmium Telluride (CdTe) thin-film photovoltaic (PV) devices. Improved quality measurement techniques may aid in improving this existing technology. Spectroscopic ellipsometry (SE) is a common, non-destructive technique for measuring thin films in the silicon wafer industry. SE results have also been tied to properties believed to play a role in CdTe PV device efficiency. A study assessing the potential of SE for use as a quality measurement tool had not been previously reported. Samples of CdTe devices produced by both laboratory and industrial scale processes were measured by SE and Scanning Electron Microscopy (SEM). Mathematical models of the optical characteristics of the devices were developed and fit to SE data from multiple angles and locations on each sample. Basic statistical analysis was performed on results from the automated fits to provide an initial evaluation of SE as a quantitative quality measurement process. In all cases studied, automated SE models produced average stack thickness values within 10% of the values produced by SEM, and standard deviations for the top bulk layer thickness were less than 1% of the average values.

  2. Computational Modeling as a Design Tool in Microelectronics Manufacturing

    Science.gov (United States)

    Meyyappan, Meyya; Arnold, James O. (Technical Monitor)

    1997-01-01

    Plans to introduce pilot lines or fabs for 300 mm processing are in progress. The IC technology is simultaneously moving towards 0.25/0.18 micron. The convergence of these two trends places unprecedented stringent demands on processes and equipments. More than ever, computational modeling is called upon to play a complementary role in equipment and process design. The pace in hardware/process development needs a matching pace in software development: an aggressive move towards developing "virtual reactors" is desirable and essential to reduce design cycle and costs. This goal has three elements: reactor scale model, feature level model, and database of physical/chemical properties. With these elements coupled, the complete model should function as a design aid in a CAD environment. This talk would aim at the description of various elements. At the reactor level, continuum, DSMC(or particle) and hybrid models will be discussed and compared using examples of plasma and thermal process simulations. In microtopography evolution, approaches such as level set methods compete with conventional geometric models. Regardless of the approach, the reliance on empricism is to be eliminated through coupling to reactor model and computational surface science. This coupling poses challenging issues of orders of magnitude variation in length and time scales. Finally, database development has fallen behind; current situation is rapidly aggravated by the ever newer chemistries emerging to meet process metrics. The virtual reactor would be a useless concept without an accompanying reliable database that consists of: thermal reaction pathways and rate constants, electron-molecule cross sections, thermochemical properties, transport properties, and finally, surface data on the interaction of radicals, atoms and ions with various surfaces. Large scale computational chemistry efforts are critical as experiments alone cannot meet database needs due to the difficulties associated with such controlled experiments and costs.

  3. Radiation-Induced Prompt Photocurrents in Microelectronics Physics

    CERN Document Server

    Dodd, P E; Buller, D L; Doyle, B L; Vizkelethy, G; Walsh, D S

    2003-01-01

    The effects of photocurrents in nuclear weapons induced by proximal nuclear detonations are well known and remain a serious hostile environment threat for the US stockpile. This report describes the final results of an LDRD study of the physical phenomena underlying prompt photocurrents in microelectronic devices and circuits. The goals of this project were to obtain an improved understanding of these phenomena, and to incorporate improved models of photocurrent effects into simulation codes to assist designers in meeting hostile radiation requirements with minimum build and test cycles. We have also developed a new capability on the ion microbeam accelerator in Sandia's Ion Beam Materials Research Laboratory (the Transient Radiation Microscope, or TRM) to supply ionizing radiation in selected micro-regions of a device. The dose rates achieved in this new facility approach those possible with conventional large-scale dose-rate sources at Sandia such as HERMES III and Saturn. It is now possible to test the phy...

  4. Miniature environmental chambers for temperature humidity bias testing of microelectronics.

    Science.gov (United States)

    Hook, Michael David; Mayer, Michael

    2017-03-01

    Environmental chambers are commonly used for reliability testing of microelectronics and other products and materials. These chambers are large, expensive, and limit electrical connectivity to devices under test. In this paper, we present a collection of ten small, low-cost environmental chambers, with humidity control based on mixtures of water and glycerol placed inside the chambers. We demonstrate relative humidities from 44% to 90%, at temperatures from 30 to 85 °C, enabling industry-standard testing at 85% humidity and 85 °C. The division of samples between ten separate chambers allows different conditions to be applied to each sample, in order to quickly characterize the effects of the environment on device reliability, enabling extrapolation to estimate lifetimes in working conditions.

  5. National Center for Advanced Information Components Manufacturing. Program summary report, Volume 1

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1996-10-01

    The National Center for Advanced Information Components Manufacturing focused on manufacturing research and development for flat panel displays, advanced lithography, microelectronics, and optoelectronics. This report provides an overview of the program, summaries of the technical projects, and key program accomplishments.

  6. Trusted Defense Microelectronics: Future Access and Capabilities Are Uncertain

    Science.gov (United States)

    2015-10-28

    TRUSTED DEFENSE MICROELECTRONICS Future Access and Capabilities Are Uncertain Statement of Marie A. Mak...1. REPORT DATE OCT 2015 2. REPORT TYPE 3. DATES COVERED 00-00-2015 to 00-00-2015 4. TITLE AND SUBTITLE Trusted Defense Microelectronics ...House of Representatives October 2015 TRUSTED DEFENSE MICROELECTRONICS Future Access and Capabilities Are Uncertain Why GAO Did This Study DOD’s

  7. Nanotubes, nanorods and nanowires having piezoelectric and/or pyroelectric properties and devices manufactured therefrom

    Science.gov (United States)

    Russell, Thomas P [Amherst, MA; Lutkenhaus, Jodie [Wethersfield, CT

    2012-05-15

    Disclosed herein is a device comprising a pair of electrodes; and a nanotube, a nanorod and/or a nanowire; the nanotube, nanorod and/or nanowire comprising a piezoelectric and/or pyroelectric polymeric composition; the pair of electrodes being in electrical communication with opposing surfaces of the nanotube, nanorod and/or a nanowire; the pair of electrodes being perpendicular to a longitudinal axis of the nanotube, nanorod and/or a nanowire.

  8. Concentration-insensitive phosphorescent organic light emitting devices (PhOLEDs) for easy manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Dumur, Frédéric, E-mail: frederic.dumur@univ-amu.fr [Aix-Marseille Université, CNRS, ICR, UMR 7273, F-13397 Marseille (France); Lepeltier, Marc [Institut Lavoisier de Versailles, UMR 8180 CNRS, Université de Versailles Saint-Quentin en Yvelines, 45 avenue des Etats-Unis, 78035 Versailles Cedex (France); Zamani Siboni, Hossein, E-mail: hzamanis@uwaterloo.ca [Department of Electrical and Computer Engineering, University of Waterloo, 200 University Avenue West Waterloo, ON, Canada N2L 3G1 (Canada); Xiao, Pu; Graff, Bernadette; Lalevée, Jacques [Institut de Science des Matériaux de Mulhouse IS2M, UMR 7361 CNRS, Université de Haute Alsace, 15 rue Jean Starcky, 68057 Mulhouse Cedex (France); Gigmes, Didier [Aix-Marseille Université, CNRS, ICR, UMR 7273, F-13397 Marseille (France); Aziz, Hany [Department of Electrical and Computer Engineering, University of Waterloo, 200 University Avenue West Waterloo, ON, Canada N2L 3G1 (Canada)

    2014-07-01

    Two heteroleptic iridium(III) complexes Ir(piq){sub 2}(dbm) and Ir(btp){sub 2}(acac) have been tested as emitters for phosphorescent OLEDs (PhOLEDs). Interestingly, device performance exhibited a marked insensitivity to the dopant concentration. In this study, a dibenzoylmethane (dbm)-based complex has also been tested for the first time as dopant for OLEDs. To evaluate the emissive properties of this new emitter belonging to a family of complexes that has not been investigated yet, identical devices were prepared with the well-known red dopant Ir(btp){sub 2}(acac) for comparison. The new complex Ir(piq){sub 2}(dbm) exhibited comparable performance to that obtained with Ir(btp){sub 2}(acac). - Highlights: • A new neutral iridium complex has been tested as emitter. • TD-DFT calculations and electrochemical measurements were carried out to support the experimental results. • UV–visible absorption and photoluminescence spectroscopy of complexes were investigated. • Concentration-insensitive phosphorescent organic light emitting devices were obtained.

  9. A Nonlinear Growth Analysis of Integrated Device Manufacturers’ Evolution to the Nanotechnology Manufacturing Outsourcing

    Directory of Open Access Journals (Sweden)

    Hung-Chi Hsiao

    2012-04-01

    Full Text Available With the increasing cost of setting up a semiconductor fabrication facility, coupled with significant costs of developing a leading nanotechnology process, aggressive outsourcing (asset-light business models via working more closely with foundry companies is how semiconductor manufacturing firms are looking to strengthen their sustainable competitive advantages. This study aims to construct a market intelligence framework for developing a wafer demand forecasting model based on long-term trend detection to facilitate decision makers in capacity planning. The proposed framework modifies market variables by employing inventory factors and uses a top-down forecasting approach with nonlinear least square method to estimate the forecast parameters. The nonlinear mathematical approaches could not only be used to examine forecasting performance, but also to anticipate future growth of the semiconductor industry. The results demonstrated the practical viability of this long-term demand forecast framework.

  10. Introduction of a new pair of thermoplastic materials for precision manufacturing of moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Mohammad Aminul; Hansen, Hans Nørgaard; Tang, Peter Torben

    2008-01-01

    One of the main process chains for manufacturing of MIDs is two component injection moulding, in which the two different thermoplastic materials involved should meet the requirements for selective metallization along with the requirements imposed from process and service conditions. It is a real...... challenge to find a suitable pair of polymers that meet so many diversified requirements at a time. This paper presents a new pair of commercial polymer materials (ULTEM PEI1000-Noryl GTX810) that fulfils the criteria for selective metallization and interface quality. The polymer pair is suitable for micro...... injection moulding and has good mechanical, thermal and electrical properties. By using this pair of materials, a demonstrator MID has been fabricated by two component injection moulding and subsequent electrochemical metallization. The test performed on the demonstrator showed potential for the material...

  11. Problems in CEMA microelectronic cooperation noted

    Science.gov (United States)

    Grzybowski, J.; Kusinski, J.

    1983-10-01

    The development and market trends of products, which use large scale integrated circuits are discussed. Products such as pocket calculators, electronic wrist watches, telephones, and automobiles are used to illustrate the economic results of market saturation with specialized integrated circuits. The status of microelectronics in socialist countries in Europe is addressed.

  12. Visual dysfunction among former microelectronics assembly workers.

    Science.gov (United States)

    Mergler, D; Huel, G; Bowler, R; Frenette, B; Cone, J

    1991-01-01

    Although known neurotoxins with potential ophthalmotoxic properties are commonly used in microelectronics assembly, there has been no systematic study of visual disturbances among past or present workers in this industry. The objective of the present study was to compare visual functions, using a matched-pair design, between former workers from a microelectronics plant and a local reference population. From an initial population of 180 former workers and 157 potential referents, 54 pairs were matched for age (+/- 3 y), education (+/- 2 y), sex, ethnic origin, and number of children. Near and far visual acuity, chromatic discrimination, and near contrast sensitivity were assessed monocularly. Paired comparisons (Signed-rank Wilcoxon test) revealed that the former microelectronics workers had significantly lower contrast sensitivity, particularly in the intermediate frequencies, independently of near visual acuity loss. There were no differences for far visual acuity in both eyes. Even though near visual acuity and color vision were compromised among the former workers, the differences were only significant for one eye, as was the prevalence of acquired dyschromatopsia (chi-square for matched pairs, p less than .001). These findings suggest a pattern of contrast sensitivity deficits consistent with impairment to foveal and/or neuro-optic pathways among these former microelectronics workers. Exposure to ophthalmotoxic chemicals is proposed as the most probable risk factor.

  13. Carbon nanotubes as heat dissipaters in microelectronics

    DEFF Research Database (Denmark)

    Pérez Paz, Alejandro; García-Lastra, Juan María; Markussen, Troels

    2013-01-01

    We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties...

  14. International Conference on Microelectronics, Electromagnetics and Telecommunications

    CERN Document Server

    Rao, N; Kumar, S; Raj, C; Rao, V; Sarma, G

    2016-01-01

    This volume contains 73 papers presented at ICMEET 2015: International Conference on Microelectronics, Electromagnetics and Telecommunications. The conference was held during 18 – 19 December, 2015 at Department of Electronics and Communication Engineering, GITAM Institute of Technology, GITAM University, Visakhapatnam, INDIA. This volume contains papers mainly focused on Antennas, Electromagnetics, Telecommunication Engineering and Low Power VLSI Design.

  15. Failure and Delamination in Microelectronic Packages

    NARCIS (Netherlands)

    Sadeghinia, M.

    2013-01-01

    Thin layers of dissimilar materials are used in most microelectronic components in order to achieve special functional requirements. Generally, the interface between two adjacent materials forms a weak link, not only because of the relatively low delamination strength, but also because of the existi

  16. Fast Qualification Methods for Microelectronic Packages

    NARCIS (Netherlands)

    Ma, X.

    2011-01-01

    This research aims at developing a knowledge based fast qualification method for moisture or thermally induced failure in microelectronic packages. Driven by the market competition and the need for shorter time to market, fast qualification tests are becoming more and more important for the industry

  17. Micromachined chemical sensor with integrated microelectronics

    Science.gov (United States)

    Smith, J.; Sniegowski, J.; Koehler, D.; Ricco, T.; Martin, S.; McWhorter, P.

    With today's continued emphasis on environmental safety and health issues, a resurgence of interest has developed in the area of chemical sensors. These sensors would typically be used to monitor contamination hazards such as underground storage tanks or to assess previous contamination at waste disposal sites. Human exposure to chemical hazards can also be monitored. Additionally, these sensors can be used as part of a manufacturing process control loop. One type of sensor suitable for gas phase monitoring of chemicals is the quartz resonator or quartz crystal microbalance (QCM) sensor. In this type of sensor, a thickness shear mode (TSM) quartz resonator is coated with a film that interacts with the chemical species of interest. Changes in the mass and elasticity of this film are reflected as changes in the resonant properties of the device. Therefore, the presence of the species of interest can be detected by monitoring the frequency of an oscillator based on the resonance of the quartz. These QCM sensors compete with surface acoustic wave (SAW) devices as a means for monitoring gas phase species. SAW devices are typically more sensitive to small amounts of a species, but the instrumentation associated with a SAW device is an order of magnitude more expensive than the instrumentation associated with a TSM wave resonator since the SAW devices operate in the 100's of MHz frequency regime while quartz resonators operate in the 5-25 MHz regime. We are working to improve the sensitivity of the QCM sensor by increasing the frequency of the device to 25 MHz (compared to the typical 5 MHz crystal) and by increasing the frequency stability of the system to an ultimate goal of 0.1 Hz. The 25 MHz QCM has already been achieved, and once the stability goal is achieved, the QCM will have the same sensitivity as a SAW device.

  18. Adverse events associated with ultrasonic scalers: A manufacturer and user facility device experience database analysis

    Directory of Open Access Journals (Sweden)

    Rajagopal Athmarao Thennukonda

    2015-01-01

    Conclusions: Use of USU, a Class 2 device without exemption, carries a degree of risk to patient′s safety, if not properly used. As of today, MAUDE data is the only reliable source of AE until another database or such study is carried out. Certain AE that has been largely anecdotal, such as hearing loss has been reported in this study. The findings from study reiterate that more in-depth analysis of AE of USU is needed. Until then operator needs to take all precautions to avoid AE when using USU.

  19. Modelling of double air-bridged structured inductor implemented by a GaAs integrated passive device manufacturing process

    Science.gov (United States)

    Li, Yang; Yao, Zhao; Zhang, Chun-Wei; Fu, Xiao-Qian; Li, Zhi-Ming; Li, Nian-Qiang; Wang, Cong

    2017-05-01

    In order to provide excellent performance and show the development of a complicated structure in a module and system, this paper presents a double air-bridge-structured symmetrical differential inductor based on integrated passive device technology. Corresponding to the proposed complicated structure, a new manufacturing process fabricated on a high-resistivity GaAs substrate is described in detail. Frequency-independent physical models are presented with lump elements and the results of skin effect-based measurements. Finally, some key features of the inductor are compared; good agreement between the measurements and modeled circuit fully verifies the validity of the proposed modeling approach. Meanwhile, we also present a comparison of different coil turns for inductor performance. The proposed work can provide a good solution for the design, fabrication, modeling, and practical application of radio-frequency modules and systems.

  20. LASER Additive Manufacturing of Titanium-Tantalum Alloy Structured Interfaces for Modular Orthopedic Devices

    Science.gov (United States)

    Fuerst, Jacob; Medlin, Dana; Carter, Michael; Sears, James; Vander Voort, George

    2015-04-01

    Tantalum is recognized to have better biocompatibility and osseointegrative properties than other more commonly used orthopedic grade alloys. There are several novel methods that tantalum or tantalum-titanium could be used to augment orthopedic implants. A tantalum or tantalum-titanium alloy at the bone/implant or modular component interfaces would substantially increase the longevity and performance of modular devices. Bonding a functional tantalum coating to a titanium orthopedic device is inherently difficult because of the small difference between the melting temperature of tantalum, 3017°C, and the boiling point of titanium, 3287°C. LASER powder deposition (LPD) is a fusion operation using an Nd:YAG to melt a small volume of substrate into which metal powder is sprayed achieving high temperature with a high solidification rate. LPD of Ti-Ta onto a Ti-6Al-4V substrate produced both a solid surface and structured coating with a pore size in the optimal 350-500 μm range.

  1. Electrowetting-based microfluidic operations on rapid-manufactured devices for heat pipe applications

    Science.gov (United States)

    Hale, Renee S.; Bahadur, Vaibhav

    2017-07-01

    The heat transport capacity of traditional heat pipes is limited by the capillary pressure generated in the internal wick that pumps condensate to the evaporator. Recently, the authors conceptualized a novel heat pipe architecture, wherein wick-based pumping is replaced by electrowetting (EW)-based pumping of microliter droplets in the adiabatic section. An electrowetting heat pipe (EHP) can overcome the capillary limit to heat transport capacity and enable compact, planar, gravity-insensitive, and ultralow power consumption heat pipes that transport kiloWatt heat loads over extended distances. This work develops a novel technique for rapid, scalable fabrication of EW-based devices and studies critical microfluidic operations underlying the EHP, with the objective of predicting the key performance parameters of the EHP. Devices are fabricated on a printed circuit board (PCB) substrate with mechanically-milled electrodes, and a removable polyimide dielectric film. The first set of experiments uncovers the maximum channel gap (1 mm) for reliable EW-based pumping; this parameter determines the heat transport capacity of the EHP, which scales linearly with the channel gap. The second set of experiments uncovers the maximum channel gap (375 microns) at which EW voltages can successfully split droplets. This is an important consideration which ensures EHP operability in the event of unintentional droplet merging. The third set of experiments demonstrate and study EW-induced droplet generation from an open-to-air reservoir, which mimics the interface between the condenser and adiabatic sections of the EHP. The experimental findings predict that planar, water-based EHPs with a (10 cm by 4 mm) cross section can transport 1.6 kW over extended distances (>1 m), with a thermal resistance of 0.01 K W-1.

  2. All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis

    Science.gov (United States)

    Sowade, Enrico; Ramon, Eloi; Mitra, Kalyan Yoti; Martínez-Domingo, Carme; Pedró, Marta; Pallarès, Jofre; Loffredo, Fausta; Villani, Fulvia; Gomes, Henrique L.; Terés, Lluís; Baumann, Reinhard R.

    2016-01-01

    We report on the detailed electrical investigation of all-inkjet-printed thin-film transistor (TFT) arrays focusing on TFT failures and their origins. The TFT arrays were manufactured on flexible polymer substrates in ambient condition without the need for cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. Alternative manufacturing processes for electronic devices such as inkjet printing suffer from lower accuracy compared to traditional microelectronic manufacturing methods. Furthermore, usually printing methods do not allow the manufacturing of electronic devices with high yield (high number of functional devices). In general, the manufacturing yield is much lower compared to the established conventional manufacturing methods based on lithography. Thus, the focus of this contribution is set on a comprehensive analysis of defective TFTs printed by inkjet technology. Based on root cause analysis, we present the defects by developing failure categories and discuss the reasons for the defects. This procedure identifies failure origins and allows the optimization of the manufacturing resulting finally to a yield improvement. PMID:27649784

  3. All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis.

    Science.gov (United States)

    Sowade, Enrico; Ramon, Eloi; Mitra, Kalyan Yoti; Martínez-Domingo, Carme; Pedró, Marta; Pallarès, Jofre; Loffredo, Fausta; Villani, Fulvia; Gomes, Henrique L; Terés, Lluís; Baumann, Reinhard R

    2016-09-21

    We report on the detailed electrical investigation of all-inkjet-printed thin-film transistor (TFT) arrays focusing on TFT failures and their origins. The TFT arrays were manufactured on flexible polymer substrates in ambient condition without the need for cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. Alternative manufacturing processes for electronic devices such as inkjet printing suffer from lower accuracy compared to traditional microelectronic manufacturing methods. Furthermore, usually printing methods do not allow the manufacturing of electronic devices with high yield (high number of functional devices). In general, the manufacturing yield is much lower compared to the established conventional manufacturing methods based on lithography. Thus, the focus of this contribution is set on a comprehensive analysis of defective TFTs printed by inkjet technology. Based on root cause analysis, we present the defects by developing failure categories and discuss the reasons for the defects. This procedure identifies failure origins and allows the optimization of the manufacturing resulting finally to a yield improvement.

  4. Development and Manufacturing of Devices for the Experimental Samples Multi-element Analysis of the Composition of Matter in Real Time as Part of the Mass Spectrometer

    Directory of Open Access Journals (Sweden)

    A.V. Kosulya

    2016-11-01

    Full Text Available The paper discloses advantages of the LSI assembly on a flexible carrier. The paper develops the topology of the flexible carrier and manufacturing of a flexible carrier. LSI samples have been composed on flexible carrier represented by a crystal attached by a dielectric on a thin flexible board with aluminium tracks located on polyimide basis. There are determined manufacturing specifications and the assembly sequence for experimental device samples. The authors constructed the experimental samples of devices for real time multi-element analysis of substances as a component of the mass-spectrometer.

  5. Structural analysis and manufacture for the vacuum vessel of experimental advanced superconducting tokamak (EAST) device

    Energy Technology Data Exchange (ETDEWEB)

    Song Yuntao [Institute of Plasma Physics, Chinese Academy of Sciences, P.O. Box 1126, Anhui, Hefei 230031 (China)]. E-mail: songyt@ipp.ac.cn; Yao Damao [Institute of Plasma Physics, Chinese Academy of Sciences, P.O. Box 1126, Anhui, Hefei 230031 (China); Wu Songata [Institute of Plasma Physics, Chinese Academy of Sciences, P.O. Box 1126, Anhui, Hefei 230031 (China); Weng Peide [Institute of Plasma Physics, Chinese Academy of Sciences, P.O. Box 1126, Anhui, Hefei 230031 (China)

    2006-02-15

    The experimental advanced superconducting tokamak (EAST) is an advanced steady-state plasma physics experimental device, which has been approved by the Chinese government and is being constructed as the Chinese national nuclear fusion research project. The vacuum vessel, that is one of the key components, will have to withstand not only the electromagnetic force due to the plasma disruption and the Halo current, but also the pressure of boride water and the thermal stress due to the 250 deg. C baking out by the hot pressure nitrogen gas, or the 100 deg. C hot wall during plasma operation. This paper is a report of the mechanical analyses of the vacuum vessel. According to the allowable stress criteria of American Society of Mechanical Engineers, Boiler and Pressure Vessel Committee (ASME), the maximum integrated stress intensity on the vacuum vessel is 396 MPa, less than the allowable design stress intensity 3S {sub m} (441 MPa). At the same time, some key R and D issues are presented, which include supporting system, bellows and the assembly of the whole vacuum vessel.

  6. Experimental investigation of single-phase microjet cooling of microelectronics

    Directory of Open Access Journals (Sweden)

    Rusowicz Artur

    2015-09-01

    Full Text Available Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second. While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

  7. Self-healable electrically conducting wires for wearable microelectronics.

    Science.gov (United States)

    Sun, Hao; You, Xiao; Jiang, Yishu; Guan, Guozhen; Fang, Xin; Deng, Jue; Chen, Peining; Luo, Yongfeng; Peng, Huisheng

    2014-09-01

    Electrically conducting wires play a critical role in the advancement of modern electronics and in particular are an important key to the development of next-generation wearable microelectronics. However, the thin conducting wires can easily break during use, and the whole device fails to function as a result. Herein, a new family of high-performance conducting wires that can self-heal after breaking has been developed by wrapping sheets of aligned carbon nanotubes around polymer fibers. The aligned carbon nanotubes offer an effective strategy for the self-healing of the electric conductivity, whereas the polymer fiber recovers its mechanical strength. A self-healable wire-shaped supercapacitor fabricated from a wire electrode of this type maintained a high capacitance after breaking and self-healing.

  8. [Application of microelectronics CAD tools to synthetic biology].

    Science.gov (United States)

    Madec, Morgan; Haiech, Jacques; Rosati, Élise; Rezgui, Abir; Gendrault, Yves; Lallement, Christophe

    2017-02-01

    Synthetic biology is an emerging science that aims to create new biological functions that do not exist in nature, based on the knowledge acquired in life science over the last century. Since the beginning of this century, several projects in synthetic biology have emerged. The complexity of the developed artificial bio-functions is relatively low so that empirical design methods could be used for the design process. Nevertheless, with the increasing complexity of biological circuits, this is no longer the case and a large number of computer aided design softwares have been developed in the past few years. These tools include languages for the behavioral description and the mathematical modelling of biological systems, simulators at different levels of abstraction, libraries of biological devices and circuit design automation algorithms. All of these tools already exist in other fields of engineering sciences, particularly in microelectronics. This is the approach that is put forward in this paper.

  9. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    Science.gov (United States)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-03-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100° C, 1300° C and 1500° C for about 20 hours using heating and cooling rates of 2° C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  10. Micro-Electronic Nose System

    Science.gov (United States)

    Zee, Frank C.

    2011-12-01

    The ability to "smell" various gas vapors and complex odors is important for many applications such as environmental monitoring for detecting toxic gases as well as quality control in the processing of food, cosmetics, and other chemical products for commercial industries. Mimicking the architecture of the biological nose, a miniature electronic nose system was designed and developed consisting of an array of sensor devices, signal-processing circuits, and software pattern-recognition algorithms. The array of sensors used polymer/carbon-black composite thin-films, which would swell or expand reversibly and reproducibly and cause a resistance change upon exposure to a wide variety of gases. Two types of sensor devices were fabricated using silicon micromachining techniques to form "wells" that confined the polymer/carbon-black to a small and specific area. The first type of sensor device formed the "well" by etching into the silicon substrate using bulk micromachining. The second type built a high-aspect-ratio "well" on the surface of a silicon wafer using SU-8 photoresist. Two sizes of "wells" were fabricated: 500 x 600 mum² and 250 x 250 mum². Custom signal-processing circuits were implemented on a printed circuit board and as an application-specific integrated-circuit (ASIC) chip. The circuits were not only able to measure and amplify the small resistance changes, which corresponded to small ppm (parts-per-million) changes in gas concentrations, but were also adaptable to accommodate the various characteristics of the different thin-films. Since the thin-films were not specific to any one particular gas vapor, an array of sensors each containing a different thin-film was used to produce a distributed response pattern when exposed to a gas vapor. Pattern recognition, including a clustering algorithm and two artificial neural network algorithms, was used to classify the response pattern and identify the gas vapor or odor. Two gas experiments were performed, one

  11. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  12. Totally implantable artificial hearts and left ventricular assist devices: selecting impermeable polycarbonate urethane to manufacture ventricles.

    Science.gov (United States)

    Yang, M; Zhang, Z; Hahn, C; Laroche, G; King, M W; Guidoin, R

    1999-01-01

    In the development of a new generation of totally implantable artificial hearts and left ventricular assist devices (VADs) for long-term use, the selection of an acceptable material for the fabrication of the ventricles probably represents one of the greatest challenges. Segmented polyether urethanes used to be the material of choice due to their superior flexural performance, acceptable blood compatibility, and ease of processing. However, because they are known to degrade and to be readily permeable to water, they cannot meet the rigorous requirements needed for a new generation of implantable artificial hearts and VADs. Therefore, the objective of the present study was to identify alternative polymeric materials that would be satisfactory for fabricating the ventricles, and in particular, to determine the water permeability through membranes made from four commercial polycarbonate urethanes (Carbothane PC3570A, Chronoflex AR, Corethane 80A, and Corethane 55D) in comparison to those made from two traditional polyether urethanes (Tecoflex EG80A and Tecothane TT-1074A). In addition to determining the rate of water transmission through the six membranes by exposing them to deionized water, saline, and albumin-Krebs solution under pressure and measuring the displacement of liquid by means of a recently developed capillary method, the inherent surface and chemical properties of the six membranes were characterized by SEM, contact angle measurements, FTIR, DSC, and GPC techniques. The results of the study demonstrated that the rate of water transmission through the four polycarbonate urethane membranes was significantly lower than through the two polyether urethanes. In fact the lowest values were recorded with the two Corethane membranes, and the harder type 55D polymer had a lower value (2.7 x 10(-7) g/s cm2) than the softer 80A version (3.3 x 10(-7) g/s cm2). This level of water vapor permeability, which appears to be controlled primarily by a Fickian diffusion

  13. Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications

    Science.gov (United States)

    Katsia, E.; Huby, N.; Tallarida, G.; Kutrzeba-Kotowska, B.; Perego, M.; Ferrari, S.; Krebs, F. C.; Guziewicz, E.; Godlewski, M.; Osinniy, V.; Luka, G.

    2009-04-01

    Hybrid poly(3-hexylthiophene)/ZnO devices are investigated as rectifying heterojunctions for microelectronics applications. A low-temperature atomic layer deposition of ZnO on top of poly(3-hexylthiophene) allows the fabrication of diodes featuring a rectification ratio of nearly 105 at ±4 V and a current density of 104 A/cm2. Electrical characteristics are discussed taking into account the chemical structure of the stack and the energy band diagram.

  14. Design of Fall Detection Device for Elderly People based on Wearable Microelectron Mechanical System Sensor%基于 MEMS 传感器的可穿戴式老年人跌倒监测系统的设计

    Institute of Scientific and Technical Information of China (English)

    张云浦; 李玉榕; 陈建国

    2014-01-01

    To design a falling detection device, aiming to reduce the delay of helping the tumbling old men and to enhance their safety.This device combined MEMS (micro-electro-mechanical systems) sensor and digital signal processing with wireless trans-mission technology so as to be used on smart phones.To distinguish falling accidents from daily behaviors, it could be judged from body′s triaxial accelerometer and angular speed and proper threshold value selected from lots of experiments.The data could be sent to their phones, through Bluetooth and given out alarm through cellular voice, and besides, their location located by GPS and their condi-tions would be texted to the hospital and their guardians.Then after falling,the old people could be helped in the shortest time.Lots of experiments showed that the accuracy rate of the judgment from the combination of triaxial accelerometer and angular speed was 100%, compared to that of traditional judgment from triaxial accelerometer which was 84.29%.The result shows that the wearable falling de-tection device based on MEMS sensor has the characteristics of convenience, accuracy and low power dissipation and has the ability of detecting falling accurately and giving out alarm.It meets the requirements of falling monitoring.%为了缩短老年人跌倒后的救助时间和提高安全保障,我们设计了一种基于加速度和角速度传感器的跌倒监测装置。该装置结合机械微电子系统( microelectro mechanical system,MEMS)传感器、数字信号处理及无线传输技术应用于智能手机上。为区分人体跌倒事件和日常行为,结合人体三轴加速度和角速度联合对跌倒事件进行判断,通过大量实验选取合适阈值。针对老年人的生活特点,数据通过蓝牙装置发送至手机上进行处理,通过手机语音报警、手机GPS定位系统和短信通知医院和用户监护人,使得老年人跌倒后能够在第一时间获

  15. Method of forming crystalline silicon devices on glass

    Science.gov (United States)

    McCarthy, A.M.

    1995-03-21

    A method is disclosed for fabricating single-crystal silicon microelectronic components on a silicon substrate and transferring same to a glass substrate. This is achieved by utilizing conventional silicon processing techniques for fabricating components of electronic circuits and devices on bulk silicon, wherein a bulk silicon surface is prepared with epitaxial layers prior to the conventional processing. The silicon substrate is bonded to a glass substrate and the bulk silicon is removed leaving the components intact on the glass substrate surface. Subsequent standard processing completes the device and circuit manufacturing. This invention is useful in applications requiring a transparent or insulating substrate, particularly for display manufacturing. Other applications include sensors, actuators, optoelectronics, radiation hard electronics, and high temperature electronics. 7 figures.

  16. Sub-Shot Noise Power Source for Microelectronics

    Science.gov (United States)

    Strekalov, Dmitry V.; Yu, Nan; Mansour, Kamjou

    2011-01-01

    Low-current, high-impedance microelectronic devices can be affected by electric current shot noise more than they are affected by Nyquist noise, even at room temperature. An approach to implementing a sub-shot noise current source for powering such devices is based on direct conversion of amplitude-squeezed light to photocurrent. The phenomenon of optical squeezing allows for the optical measurements below the fundamental shot noise limit, which would be impossible in the domain of classical optics. This becomes possible by affecting the statistical properties of photons in an optical mode, which can be considered as a case of information encoding. Once encoded, the information describing the photon (or any other elementary excitations) statistics can be also transmitted. In fact, it is such information transduction from optics to an electronics circuit, via photoelectric effect, that has allowed the observation of the optical squeezing. It is very difficult, if not technically impossible, to directly measure the statistical distribution of optical photons except at extremely low light level. The photoelectric current, on the other hand, can be easily analyzed using RF spectrum analyzers. Once it was observed that the photocurrent noise generated by a tested light source in question is below the shot noise limit (e.g. produced by a coherent light beam), it was concluded that the light source in question possess the property of amplitude squeezing. The main novelty of this technology is to turn this well-known information transduction approach around. Instead of studying the statistical property of an optical mode by measuring the photoelectron statistics, an amplitude-squeezed light source and a high-efficiency linear photodiode are used to generate photocurrent with sub-Poissonian electron statistics. By powering microelectronic devices with this current source, their performance can be improved, especially their noise parameters. Therefore, a room-temperature sub

  17. Understanding microelectronics a top-down approach

    CERN Document Server

    Maloberti, Franco

    2011-01-01

    The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today's students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions,

  18. Design and high-volume manufacture of low-cost molded IR aspheres for personal thermal imaging devices

    Science.gov (United States)

    Zelazny, A. L.; Walsh, K. F.; Deegan, J. P.; Bundschuh, B.; Patton, E. K.

    2015-05-01

    The demand for infrared optical elements, particularly those made of chalcogenide materials, is rapidly increasing as thermal imaging becomes affordable to the consumer. The use of these materials in conjunction with established lens manufacturing techniques presents unique challenges relative to the cost sensitive nature of this new market. We explore the process from design to manufacture, and discuss the technical challenges involved. Additionally, facets of the development process including manufacturing logistics, packaging, supply chain management, and qualification are discussed.

  19. A Vacuum Microelectronic Pressure Sensor Array Integrated with Temperature Sensor

    Institute of Scientific and Technical Information of China (English)

    SU Jie; XIA Shanhong; CHEN Shaofeng

    2001-01-01

    This paper presents a microsystemthat integrates a Vacuum Microelectronic pressuresensor array with a temperature sensor. The Vac-uum Microelectronic pressure sensor array consists of4 × 4 sensing elements. The temperature sensor is aPt-thin-film resistor. Computer aided design is usedto optimize the structure.

  20. Microelectronics and Special Education. CET/MEP Information Sheet.

    Science.gov (United States)

    Council for Educational Technology, London (England).

    Used as an additional aid by the teacher, microelectronics can assist mentally and physically handicapped children to meet educational objectives that have been specifically agreed upon for the individual child. Microelectronics can help deaf children develop speech production, communication skills, and grammar and sentence construction;…

  1. Moving Education and Its Administration into the Microelectronic Age.

    Science.gov (United States)

    Culbertson, Jack A.

    Education is in transition between the ascendent microelectronic and descendent industrial revolutions, with purposes ambiguously linked to both. These purposes must be clarified before educational leaders can establish priorities for adapting education to the needs of a society transformed by microelectronic technology. Accordingly, the features…

  2. Microelectronics in the Curriculum--The Science Teacher's Contribution.

    Science.gov (United States)

    Association for Science Education, Cambridge (England).

    Rapid advances in microelectronics over the past few years have generally been beneficial, but they have also created some problems, and questions must be asked about the philosophy for including aspects of the new technology in the school curriculum. This statement, prepared by the Microelectronics and Science Education Subcommittee of the…

  3. Eye vision system using programmable micro-optics and micro-electronics

    Science.gov (United States)

    Riza, Nabeel A.; Amin, M. Junaid; Riza, Mehdi N.

    2014-02-01

    Proposed is a novel eye vision system that combines the use of advanced micro-optic and microelectronic technologies that includes programmable micro-optic devices, pico-projectors, Radio Frequency (RF) and optical wireless communication and control links, energy harvesting and storage devices and remote wireless energy transfer capabilities. This portable light weight system can measure eye refractive powers, optimize light conditions for the eye under test, conduct color-blindness tests, and implement eye strain relief and eye muscle exercises via time sequenced imaging. Described is the basic design of the proposed system and its first stage system experimental results for vision spherical lens refractive error correction.

  4. Application of non-cyanide gold for selective plating of microelectronic circuits

    Energy Technology Data Exchange (ETDEWEB)

    Worobey, W.; Rieger, D.

    1991-01-01

    With the current trends towards miniaturization, high performance, high quality and cost competiveness, the electrodeposition process has become an important manufacturing technology in many new microelectronic applications. Gold electrodeposition plays an increasing role in processes that require this noble metal. Added to these trends is the continuing and increasing emphasis on manufacturing processes which are less damaging to the environment and potentially less hazardous to the operator and personnel in the vicinity of the operation. The present standard gold plating solutions are based on cyanide salts and are considered acutely hazardous solutions. The trend away from their use is gaining momentum as new non-hazardous gold plating solutions and manufacturing processes making use of them are developed. 2 refs.

  5. Circuit design of VLSI for microelectronic coordinate-sensitive detector for material element analysis

    Directory of Open Access Journals (Sweden)

    Sidorenko V. P.

    2012-08-01

    Full Text Available There has been designed, manufactured and tested a VLSI providing as a part of the microelectronic coordinate-sensitive detector the simultaneous elemental analysis of all the principles of the substance. VLSI ensures the amplifier-converter response on receiving of 1,6.10–13 С negative charge to its input. Response speed of the microcircuit is at least 3 MHz in the counting mode and more than 4 MHz in the counter information read-out mode. The power consumption of the microcircuit is no more than 7 mA.

  6. Radiation Effects On Emerging Electronic Materials And Devices

    Science.gov (United States)

    2010-01-17

    and reliability,” Proc. 25th International Conf. Microelectron. ( MIEL 2006), vol. 1, Belgrade, Serbia and Montenegro, May 14-17, 2006, pp. 89-96...Pantelides, “Effects of device aging on microelectronics radiation response and reliability,” 25th International Conf. Microelectron. ( MIEL 2006... MIEL 2006), Belgrade, Serbia and Montenegro, May 2006. 170. S. T. Pantelides, R. D. Schrimpf, D. M. Fleetwood, et al. “Atomic-Scale Mechanisms

  7. Reliability of Small Geometry VLSI Devices for Microelectronics

    Science.gov (United States)

    1992-02-15

    Trap Pocie - Average Energy Field Frenkel Kinetic Barrier Energy Lowerng F g. 18 Formulaticn of the Energy Eaiance Equation for the Fc: E’ectron Cacture...equipped w/color monitors . and a SPARC Station SLC. V Fig. 2 SUN SPARC I Workstations Fig, 3, illustrates a CMOS test vehicle with micrometer...processing. Custom built pattern generator and threshold detect circuitry, seen in Fig. 16. is used to monitor developments in our non-volatile memory

  8. Properties and Adhesion of Polyimides in Microelectronic Devices

    Science.gov (United States)

    1990-08-15

    PMDA-ODA poly- imide films are spin coating (SC) and vapor deposition polymerisation (VDP) . They differ in the way the film pre- cursor (polyamic...where they react at room temperature to polyamic acid. Spin coating (SC) requires that the polymer precursor polyamic acid is applied in a polar...The polyimide substrates were prepared by spin coating polyamic acid onto a substrate followed by solvent extrac- tion, imidization and curing at

  9. Robust design of microelectronics assemblies against mechanical shock, temperature and moisture effects of temperature, moisture and mechanical driving forces

    CERN Document Server

    Wong, E-H

    2015-01-01

    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progr

  10. Physical limitations of semiconductor devices defects, reliability and esd protection

    CERN Document Server

    Vashchenko, V A

    2008-01-01

    Provides an important link between the theoretical knowledge in the field of non-linier physics and practical application problems in microelectronics. This title focuses on power semiconductor devices and self-triggering pulsed power devices for ESD protection clamps.

  11. Dimensionally Stable Poyimide Copolymers for Microelectronics Applications

    Science.gov (United States)

    Fay, Catherine C.; St.Clair, Anne K.

    1998-01-01

    Polyimides are finding increased applications in microelectronics due to their high thermal stability, good chemical resistance, good adhesion, low moisture absorption, good mechanical properties, and low coefficient of thermal expansion (CTE). Four series of random copolyimides were synthesized and characterized for potential application as encapsulants, stress-relief layers, and interlevel dielectrics. Several candidates exhibited good combinations of physical and mechanical properties with inherent viscosities from 1.21 to 1.42 dL/g, T(sub g)'s ranging from 251 to 277 C, 10% weight loss temperatures between 503 and 527 C, and CTEs ranging from 33 to 39 ppm/deg C. Mechanical properties at room temperature for the best candidates included tensile strengths of 17.8-21.3 ksi, moduli between 388 and 506 ksi, and elongations of 11-43%. Moisture absorption for these copolyimides ranged between 0.85 and 1.38 wt %.

  12. 一种无线充电装置的设计与制作%The Design and Manufacture of a Wireless Charging Device

    Institute of Scientific and Technical Information of China (English)

    孔德琛; 胡海宁; 王莹

    2015-01-01

    It designed and manufactured a set of wireless charging device of mobile phone by oneself. The de-vice can carry out wireless charging for mobile phone,and it can also be used to give mobile power,tablet PC and other mobile devices for wireless charging.%设计并制作了一套手机用的无线充电装置,通过该装置可以对手机进行无线充电,该装置也可以用来给移动电源、平板电脑等移动设备进行无线充电。

  13. Numerical flow simulation methods and additive manufacturing methods for the development of a flow optimised design of a novel point-of-care diagnostic device

    Directory of Open Access Journals (Sweden)

    Dethloff Manuel

    2017-09-01

    Full Text Available For the development of a novel, user-friendly and low cost point-of-care diagnostic device for the detection of disease specific biomarker a flow optimised design of the test system has to be investigated. The resulting test system is characterised by a reduced execution period, a reduction of execution steps and an integrated waste management. Based on previous results, the current study focused on the design implementation of the fluidic requirements, e. g. tightness, inside the test device. With the help of fluid flow simulations (CFD – computational fluid dynamics the flow behaviour inside the test device was analysed for different designs and arrangements. Prototypes generated from additive manufacturing technologies (PolyJet modeling are used for validating the simulation results and further experimental tests.

  14. Organic transistors in optical displays and microelectronic applications.

    Science.gov (United States)

    Gelinck, Gerwin; Heremans, Paul; Nomoto, Kazumasa; Anthopoulos, Thomas D

    2010-09-08

    Organic thin-film transistors (OTFTs) offer unprecedented opportunities for implementation in a broad range of technological applications spanning from large-volume microelectronics and optical displays to chemical and biological sensors. In this Progress Report, we review the application of organic transistors in the fields of flexible optical displays and microelectronics. The advantages associated with the use of OTFT technology are discussed with primary emphasis on the latest developments in the area of active-matrix electrophoretic and organic light-emitting diode displays based on OTFT backplanes and on the application of organic transistors in microelectronics including digital and analog circuits.

  15. Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems

    Science.gov (United States)

    Arik, Mehmet; Tamdogan, Enes

    Rapid progress in science and information technology, growing manufacturing activities and increase in globalization have boosted the demand for advanced electronics devices. Moreover, increase in microprocessor power dissipation coupled with the reduction in feature sizes due to manufacturing process improvements have resulted in continuously increasing heat fluxes. Thus, ever increasing heat fluxes have required the development of novel, reliable and affordable thermal management technologies. Although some of those proposed solutions for high flux cooling problems based on liquid cooling methods such as spray and evaporative cooling; air cooling is still commonly preferred due to its availability, reliability, easiness and low cost. Therefore, over the last decade microfluidics devices such as synthetic jets have been investigated as an alternative to conventional air moving devices, and have been shown as highly effective for cooling of electronics in compact thermal real estates...

  16. Cold-Cathodes for Sensors and Vacuum Microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Siegal, M.P.; Sullivan, J.P.; Tallant, D.R.; Simpson, R.L. [Sandia National Labs., Albuquerque, NM (United States); DiNardo, N.J.; Mercer, T.W. [Drexel Univ., Philadelphia, PA (United States). Dept. of Physics and Astronomy; Martinez-Miranda, L.J. [Univ. of Maryland, College Park, MD (United States). Dept. of Materials Science and Engineering

    1998-05-01

    The aim of this laboratory-directed research and development project was to study amorphous carbon (a-C) thin films for eventual cold-cathode electron emitter applications. The development of robust, cold-cathode emitters are likely to have significant implications for modern technology and possibly launch a new industry: vacuum micro-electronics (VME). The potential impact of VME on Sandia`s National Security missions, such as defense against military threats and economic challenges, is profound. VME enables new microsensors and intrinsically radiation-hard electronics compatible with MOSFET and IMEM technologies. Furthermore, VME is expected to result in a breakthrough technology for the development of high-visibility, low-power flat-panel displays. This work covers four important research areas. First, the authors studied the nature of the C-C bonding structures within these a-C thin films. Second, they determined the changes in the film structures resulting from thermal annealing to simulate the effects of device processing on a-C properties. Third, they performed detailed electrical transport measurements as a function of annealing temperature to correlate changes in transport properties with structural changes and to propose a model for transport in these a-C materials with implications on the nature of electron emission. Finally, they used scanning atom probes to determine important aspects on the nature of emission in a-C.

  17. Electromigration of intergranular voids in metal films for microelectronic interconnects

    CERN Document Server

    Averbuch, A; Ravve, I

    2003-01-01

    Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

  18. Longevity of implantable cardioverter-defibrillators for cardiac resynchronization therapy in current clinical practice: an analysis according to influencing factors, device generation, and manufacturer.

    Science.gov (United States)

    Landolina, Maurizio; Curnis, Antonio; Morani, Giovanni; Vado, Antonello; Ammendola, Ernesto; D'onofrio, Antonio; Stabile, Giuseppe; Crosato, Martino; Petracci, Barbara; Ceriotti, Carlo; Bontempi, Luca; Morosato, Martina; Ballari, Gian Paolo; Gasparini, Maurizio

    2015-08-01

    Device replacement at the time of battery depletion of implantable cardioverter-defibrillators (ICDs) may carry a considerable risk of complications and engenders costs for healthcare systems. Therefore, ICD device longevity is extremely important both from a clinical and economic standpoint. Cardiac resynchronization therapy defibrillators (CRT-D) battery longevity is shorter than ICDs. We determined the rate of replacements for battery depletion and we identified possible determinants of early depletion in a series of patients who had undergone implantation of CRT-D devices. We retrieved data on 1726 consecutive CRT-D systems implanted from January 2008 to March 2010 in nine centres. Five years after a successful CRT-D implantation procedure, 46% of devices were replaced due to battery depletion. The time to device replacement for battery depletion differed considerably among currently available CRT-D systems from different manufacturers, with rates of batteries still in service at 5 years ranging from 52 to 88% (log-rank test, P < 0.001). Left ventricular lead output and unipolar pacing configuration were independent determinants of early depletion [hazard ratio (HR): 1.96; 95% 95% confidence interval (CI): 1.57-2.46; P < 0.001 and HR: 1.58, 95% CI: 1.25-2.01; P < 0.001, respectively]. The implantation of a recent-generation device (HR: 0.57; 95% CI: 0.45-0.72; P < 0.001), the battery chemistry and the CRT-D manufacturer (HR: 0.64; 95% CI: 0.47-0.89; P = 0.008) were additional factors associated with replacement for battery depletion. The device longevity at 5 years was 54%. High left ventricular lead output and unipolar pacing configuration were associated with early battery depletion, while recent-generation CRT-Ds displayed better longevity. Significant differences emerged among currently available CRT-D systems from different manufacturers. © The Author 2015. Published by Oxford University Press on behalf of the European Society of Cardiology.

  19. The International Implications of the Development of Microelectronics.

    Science.gov (United States)

    Sieghart, Paul

    1981-01-01

    Synthesizes issues covered at a conference on microelectronics: production, productivity, and employment; social implications; market mechanisms v government intervention; the role of national governments; data protection laws; and cultural pollution. (SW)

  20. A microelectronics approach for the ROSETTA surface science package

    Science.gov (United States)

    Sandau, Rainer (Editor); Alkalaj, Leon

    1996-01-01

    In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

  1. Kickbacks, courtesies or cost-effectiveness?: Application of the Medicare antikickback Law to the marketing and promotional practices of drug and medical device manufacturers.

    Science.gov (United States)

    Bulleit, T N; Krause, J H

    1999-01-01

    This article summarizes the purposes and history of the antikickback law and describes its evolution into a potent weapon against the corruption of medical decision making in the procurement of prescription drugs and medical devices. The article also details a variety of strategies for reducing risks under the law in several key areas of importance to manufacturers. While the purposes of the law are laudable, its current broad interpretation may impede not only corruption, but also benign forms of customer relations and innovative approaches to cost-effective medical care.

  2. [Modern hearing-aids at the cutting edge of microelectronics. Increased possibilities for individual customization].

    Science.gov (United States)

    Arlinger, S

    1999-08-25

    The development of modern hearing aids has been so great that they now represent the cutting edge of micro-electronics. Flexibility has been enhanced by computer-aided programming of the devices, and particularly by digital signal processing, developments which enable improved customization. Increased knowledge of the pathophysiology of the auditory system, fundamental processes in central auditory pathways, and cognitive function enable technological developments to be exploited, thus enhancing our ability to cope with an increasingly broad spectrum of hearing impairment, ranging from mild high-frequency loss to severe loss across the entire frequency range.

  3. Implications of the new Food and Drug Administration draft guidance on human factors engineering for diabetes device manufacturers.

    Science.gov (United States)

    Wilcox, Stephen B; Drucker, Daniel

    2012-03-01

    This article discusses the implications of the new Food and Drug Administration's draft guidance on human factors and usability engineering for the development of diabetes-related devices. Important considerations include the challenge of identifying users, when the user population is so dramatically broad, and the challenge of identifying use environments when the same can be said for use environments. Another important consideration is that diabetes-related devices, unlike many other medical devices, are used constantly as part of the user's lifestyle--adding complexity to the focus on human factors and ease of use emphasized by the draft guidance.

  4. Health hazards in the microelectronics industry.

    Science.gov (United States)

    Geiser, K

    1986-01-01

    The microelectronics industry is explored as a source of occupational health hazards resulting from the extensive use of toxic chemicals in the production of semiconductor chips and the assembly of electronic components. Information is provided on the range of chemicals used in the industry and their particular health implications. Case materials are drawn from Massachusetts' "Route 128" region and California's "Silicon Valley." Problems with worker exposure in the plants are compared with the risks experienced by residents of local neighborhoods from the leakage of industrial chemicals from underground storage tanks into the local groundwater used for drinking water. The recent development of the industry, its highly innovative character, the absence of unions and organizations for worker protection, and the persistence of a public perception that the industry is relatively safe and clean, are all identified as determinants of the extent of health hazards posed by chemical exposure. The paper concludes with recommendations for further studies, worker organization, and increased attention to the reduction of the volume and toxicity of chemicals in industrial production.

  5. IP validation in remote microelectronics testing

    Science.gov (United States)

    Osseiran, Adam; Eshraghian, Kamran; Lachowicz, Stefan; Zhao, Xiaoli; Jeffery, Roger; Robins, Michael

    2004-03-01

    This paper presents the test and validation of FPGA based IP using the concept of remote testing. It demonstrates how a virtual tester environment based on a powerful, networked Integrated Circuit testing facility, aimed to complement the emerging Australian microelectronics based research and development, can be employed to perform the tasks beyond the standard IC test. IC testing in production consists in verifying the tested products and eliminating defective parts. Defects could have a number of different causes, including process defects, process migration and IP design and implementation errors. One of the challenges in semiconductor testing is that while current fault models are used to represent likely faults (stuck-at, delay, etc.) in a global context, they do not account for all possible defects. Research in this field keeps growing but the high cost of ATE is preventing a large community from accessing test and verification equipment to validate innovative IP designs. For these reasons a world class networked IC teletest facility has been established in Australia under the support of the Commonwealth government. The facility is based on a state-of-the-art semiconductor tester operating as a virtual centre spanning Australia and accessible internationally. Through a novel approach the teletest network provides virtual access to the tester on which the DUT has previously been placed. The tester software is then accessible as if the designer is sitting next to the tester. This paper presents the approach used to test and validate FPGA based IPs using this remote test approach.

  6. Scalability of carbon-nanotube-based thin film transistors for flexible electronic devices manufactured using an all roll-to-roll gravure printing system

    Science.gov (United States)

    Koo, Hyunmo; Lee, Wookyu; Choi, Younchang; Sun, Junfeng; Bak, Jina; Noh, Jinsoo; Subramanian, Vivek; Azuma, Yasuo; Majima, Yutaka; Cho, Gyoujin

    2015-09-01

    To demonstrate that roll-to-roll (R2R) gravure printing is a suitable advanced manufacturing method for flexible thin film transistor (TFT)-based electronic circuits, three different nanomaterial-based inks (silver nanoparticles, BaTiO3 nanoparticles and single-walled carbon nanotubes (SWNTs)) were selected and optimized to enable the realization of fully printed SWNT-based TFTs (SWNT-TFTs) on 150-m-long rolls of 0.25-m-wide poly(ethylene terephthalate) (PET). SWNT-TFTs with 5 different channel lengths, namely, 30, 80, 130, 180, and 230 μm, were fabricated using a printing speed of 8 m/min. These SWNT-TFTs were characterized, and the obtained electrical parameters were related to major mechanical factors such as web tension, registration accuracy, impression roll pressure and printing speed to determine whether these mechanical factors were the sources of the observed device-to-device variations. By utilizing the electrical parameters from the SWNT-TFTs, a Monte Carlo simulation for a 1-bit adder circuit, as a reference, was conducted to demonstrate that functional circuits with reasonable complexity can indeed be manufactured using R2R gravure printing. The simulation results suggest that circuits with complexity, similar to the full adder circuit, can be printed with a 76% circuit yield if threshold voltage (Vth) variations of less than 30% can be maintained.

  7. Plan for advanced microelectronics processing technology application

    Energy Technology Data Exchange (ETDEWEB)

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  8. Isotropic copper-invar alloys for microelectronics packaging

    Science.gov (United States)

    Cottle, Rand Duprez

    The recent trend in microelectronics packaging toward surface mounted devices (SMD) has created a need for new types of materials that possess low thermal expansion and high electrical and thermal conductivity. Laminates that combine the high thermal and electrical conductivity of copper with the low thermal expansion of Invar, know as CuInvarCu or CIC, are widely use as core constraining materials in printed wire boards where SMDs are to be employed. CIC is highly anisotropic, and there are potential problems resulting from its anisotropy. An isotropic CuInvar alloy would be of great interest for a variety of applications. In suitable Cu-Fe-Ni alloys, a copper-rich solid solution equilibrates with an Invar-rich solid solution; casting such alloys invariably produces Invar-rich dendrites in a copper-rich solid solution. Casting followed by suitable heat treatments can produce two-phase alloys that combine the properties of copper and Invar. The overall composition controls the relative fractions of Invar and copper and the resulting trade-off between low thermal expansivity and electrical conductivity. Measured thermal expansivities (CTE) of CuInvar alloys follow very closely a linear rule of mixing. Electrical conductivities of as-cast specimens are quite poor due to iron and nickel contamination. Theoretical phase diagrams indicate that nearly pure copper equilibrates with an Invar-rich phase at temperatures below, roughly, 500°C. However, equilibrium compositions have been shown to take extremely, long to form, due to the very sluggish kinetics in the system. Long-term annealing was shown to improve conductivity significantly, but much greater improvements are needed to make CuInvar viable as an electrical conductive material.

  9. Road vehicle-induced vibration control of microelectronics facilities

    Institute of Scientific and Technical Information of China (English)

    Guo Anxin; Xu Youlin; Li Hui

    2005-01-01

    A hybrid control platform is investigated in this paper to mitigate microvibrations to a group of vibrationsensitive equipment installed in a microelectronics facility subject to nearby road vehicle-induced horizontal and vertical ground motions. The hybrid control platform, on which microelectronics equipment is installed, is mounted on a building floor through a series of passive mounts and controlled by hydraulic actuators in both horizontal and vertical directions. The control platform is an elastic body with significant bending modes of vibration, and a sub-optimal control algorithm is used to manipulate the hydraulic actuators with actuator dynamics included. The finite element model and the equations of motion of the coupled platform-building system are then established in the absolute coordinate to facilitate the feedback control and performance evaluation of the platform. The horizontal and vertical ground vibrations at the base of the building induced by nearby moving road vehicles are assumed to be stationary random processes. A typical three-story microelectronics building is selected as a case study. The case study shows that the vertical vibration of the microelectronics building is higher than the horizontal. The use of a hybrid control platform can effectively reduce both horizontal and vertical microvibrations of the microelectronics equipment to the level which satisfies the stringent microscale velocity requirement specified in the Bolt Beranek & Newman (BBN) criteria.

  10. FOREWORD: Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference

    Science.gov (United States)

    Jasiński, Piotr; Górecki, Krzysztof; Bogdanowicz, Robert

    2016-01-01

    These proceedings are a collection of the selected articles presented at the 39th International Microelectronics and Packaging IMAPS Poland Conference, held in Gdansk, Poland on September 20-23, 2015 (IMAPS Poland 2015). The conference has been held under the scientific patronage of the International Microelectronics and Packaging Society Poland Chapter and the Committee of Electronics and Telecommunication, Polish Academy of Science and jointly hosted by the Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics (GUT) and the Gdynia Maritime University, Faculty of Electrical Engineering (GMU). The IMAPS Poland conference series aims to advance interdisciplinary scientific information exchange and the discussion of the science and technology of advanced electronics. The IMAPS Poland 2015 conference took place in the heart of Gdansk, two minutes walking distance from the beach. The surroundings and location of the venue guaranteed excellent working and leisure conditions. The three-day conference highlighted invited talks by outstanding scientists working in important areas of electronics and electronic material science. The eight sessions covered areas in the fields of electronics packaging, interconnects on PCB, Low Temperature Co-fired Ceramic (LTCC), MEMS devices, transducers, sensors and modelling of electronic devices. The conference was attended by 99 participants from 11 countries. The conference schedule included 18 invited presentations and 78 poster presentations.

  11. Microelectronics Revolution And The Impact Of Automation In The New Industrialized Countries

    Science.gov (United States)

    Baranauskas, Vitor

    1984-08-01

    A brief review of some important historical points on the origin of the Factories and the Industrial Revolution is presented with emphasis in the social problems related to the automation of the human labor. Until the World War I, the social changes provoked by the Industrial Revolution caused one division of the World in developed and underdeveloped countries. After that period, the less developed nations began their industrialization mainly through the Multinationals Corporations (MC). These enterprises were very important to the production and exportation of utilities and manufactures in general, mainly in those products which required intensive and direct human labor. At present time, with the pervasiveness of microelectronics in the automation, this age seems to reaching an end because all continous processes in industry tend economicaly toward total automation. This fact will cause a retraction in long-term investments and, beyond massive unemployment, there is a tendency for these MC industries to return to their original countries. The most promising alternative to avoid these events, and perhaps the unique, is to incentive an autonomous development in areas of high technology, as for instance, the microelectronics itself.

  12. Selective atomic-level etching using two heating procedures, infrared irradiation and ion bombardment, for next-generation semiconductor device manufacturing

    Science.gov (United States)

    Shinoda, K.; Miyoshi, N.; Kobayashi, H.; Miura, M.; Kurihara, M.; Maeda, K.; Negishi, N.; Sonoda, Y.; Tanaka, M.; Yasui, N.; Izawa, M.; Ishii, Y.; Okuma, K.; Saldana, T.; Manos, J.; Ishikawa, K.; Hori, M.

    2017-05-01

    The demand for precisely controlled etching is increasing as semiconductor device geometries continue to shrink. To fulfill this demand, cyclic atomic level/layer etching will become one of the key technologies in semiconductor device manufacturing at nanometer dimensions. This review describes recent trends in semiconductor devices and some of the latest results on cyclic atomic-level etching. In particular, it focuses on two types of cyclic etching that use different heating procedures: infrared irradiation for isotropic etching and Ar+ ion bombardment for anisotropic etching. It describes how an inductively-coupled-plasma down-flow etching apparatus with infrared lamps can be used for isotropic cyclic etching. The isotropic cyclic etching of SiN involves the formation and thermal desorption of ammonium hexafluorosilicate-based surface modified layers. This method features high selectivity with respect to SiO2, atomic-level control of the amount of SiN etching, and isotropic etched features. On the other hand, the anisotropic cyclic etching with Ar+ ion bombardment uses a microwave electron-cyclotron-resonance plasma etching apparatus. The anisotropic process for poly Si is composed of cyclic repetitions of chlorine adsorption and Ar+ ion bombardment. The anisotropic process for SiN is composed of cyclic repetitions involving an adsorption step using hydrofluorocarbon chemistry and a desorption step using Ar+ ion bombardment. Potential applications of these isotropic/anisotropic cyclic etching processes are described.

  13. Delidding and Resealing Hybrid Microelectronic Packages

    Science.gov (United States)

    1982-05-01

    package. Survey data showed that the I" x 1" welded metal butterfly package to be the prime candidate, at first glance. More thorough evaluation, however...5th Avenue Chelmsford, MA 01824 King of Prussia, PA 19460 George Erdos M. R. Stahler Garrett Manufacturing Corporation M-8639 255 Atwell Drive General

  14. On the Implementation of the IEC 61850 Standard: Will Different Manufacturer Devices Behave Similarly under Identical Conditions?

    Directory of Open Access Journals (Sweden)

    Mohamad El Hariri

    2016-12-01

    Full Text Available Standardization in smart grid communications is necessary to facilitate complex operations of modern power system functions. However, the strong coupling between the cyber and physical domains of the contemporary grid exposes the system to vulnerabilities and thus places more burden on standards’ developers. As such, standards need to be continuously assessed for reliability and are expected to be implemented properly on field devices. However, the actual implementation of common standards varies between vendors, which may lead to different behaviors of the devices even if present under similar conditions. The work in this paper tested the implementation of the International Electro-technical Commission’s Generic Object Oriented Substation Event GOOSE (IEC 61850 GOOSE messaging protocol on commercial Intelligent Electronic Devices (IEDs and the open source libiec61850 library—also used in commercial devices—which showed different behaviors in identical situations. Based on the test results and analysis of some features of the IEC 61850 GOOSE protocol itself, this paper proposes guidelines and recommendations for proper implementation of the standard functionalities.

  15. 3D microelectronic packaging from fundamentals to applications

    CERN Document Server

    Goyal, Deepak

    2017-01-01

    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

  16. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

    Energy Technology Data Exchange (ETDEWEB)

    Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie; Tigges, Chris P.

    1999-04-01

    We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

  17. Active microelectronic array system for DNA hybridization, genotyping and pharmacogenomic applications.

    Science.gov (United States)

    Sosnowski, Ron; Heller, Michael J; Tu, Eugene; Forster, Anita H; Radtkey, Ray

    2002-12-01

    Microelectronic arrays have been developed for DNA hybridization analysis of point mutations, single nucleotide polymorphisms, short tandem repeats and gene expression. In addition to a variety of molecular biology and genomic research applications, such devices will also be used for infectious disease detection, genetic and cancer diagnostics, and pharmacogenomic applications. These microelectronic array devices are able to produce defined electric fields on their surfaces that allow charged molecules and other entities to be transported to or from any test site or micro-location on the planar surface of the device. These molecules and entities include DNA, RNA, proteins, enzymes, antibodies and cells. Electronic-based molecule addressing and hybridization can then be carried out, where the electric field is now used to greatly accelerate the hybridization reactions that occur on the selected test sites. When reversed, the electric field can be used to provide an additional parameter for improved hybridization. Special low-conductance buffers have been developed that provide for the rapid transport of the DNA molecules and facilitate the electronic hybridization reactions under conditions that do not support hybridization. Important to the device function is the permeation layer that overcoats the underlying microelectrodes. Generally composed of a porous hydrogel material impregnated with attachment chemistry, this permeation layer prevents the destruction of analytes at the active microelectrode surface, ameliorates the adverse effects of electrolysis products on the sensitive hybridization and affinity reactions, and serves as a support structure for attaching DNA probes and other molecules to the array. The microelectronic chip or array device is incorporated into a cartridge package (NanoChip trade mark cartridge) that provides the electronic, optical, and fluidic interfacing. A complete instrument system (NanoChip trade mark Molecular Biology Workstation

  18. Application of ionizing radiation processing in biomedical engineering and microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Hongfej, H.; Jilan, W.

    1988-01-01

    The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristics reaction means such as crosslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become a important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this technique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics.

  19. Study on the evaluation of aerospace microelectronic industry

    Institute of Scientific and Technical Information of China (English)

    江帆; 陈荣秋

    2004-01-01

    Aerospace microelectronic technology has become the core competence of aerospace technology. For evaluating the aerospace microelectronic industry, it is necessary to change descriptive language of goal to quantitative index that can be measured. Knowing quantified goals or tree structure and array of general goal system, with certain algorithm and processing each corresponding list or array, we can bring out a quantified general goal value. The multi-objective (multi-attribute) evaluation method and the relevant weight sum algorithm have been adopted to quantitatively evaluate and forecast the developing state of the industry. A practical example illustrates that the applied decision technique and the algorithm are feasible and effective.

  20. Local tetrahedron modeling of microelectronics using the finite-volume hybrid-grid technique

    Energy Technology Data Exchange (ETDEWEB)

    Riley, D.J.; Turner, C.D.

    1995-12-01

    The finite-volume hybrid-grid (FVHG) technique uses both structured and unstructured grid regions in obtaining a solution to the time-domain Maxwell`s equations. The method is based on explicit time differencing and utilizes rectilinear finite-difference time-domain (FDTD) and nonorthogonal finite-volume time-domain (FVTD). The technique directly couples structured FDTD grids with unstructured FVTD grids without the need for spatial interpolation across grid interfaces. In this paper, the FVHG method is applied to simple planar microelectronic devices. Local tetrahedron grids are used to model portions of the device under study, with the remainder of the problem space being modeled with cubical hexahedral cells. The accuracy of propagating microstrip-guided waves from a low-density hexahedron region through a high-density tetrahedron grid is investigated.

  1. Military applications for heterostructure microelectronics technology

    Science.gov (United States)

    Greiling, Paul; Kirkpatrick, Conilee; Valentine, Gary

    1995-09-01

    Military systems, whether radar, communications, electronic warfare (EW) or smart munitions, require superior device and IC performance. The performance advantages of heterostructure devices over standard Si CMOS, Si bipolar transistors or GaAs MESFETs has motivated major aerospace firms in the United States to develop Si, GaAs and InP-based heterojunction bipolar (HBT) and high electron mobility transistor (HEMT) technologies. In response to advanced system performance requirements, technology efforts are being pushed toward devices which can yield {T}/{R} modules with octave bandwidths, noise figures under 3 dB, output power of 20 W and power greater than 30%. Device technology development for satellite communications is being driven in part by the need for ultra low noise high output power with high power added efficiency with high MMTF. For these systems as well as EW applications, designers want to digitize the signal as close to the front end as possible. This is driving the development of a 100 GHz IC technology for A/D converters, synthesizers, MUX/DEMUXs, DDSs. and PRNs. Requirements for A/D converters with 16 bits @ 100-200 MHz up to 8-10 bits @ 10 GHz are appearing for advanced radars and EW systems. The military system requirements continue to drive the development of the newer, better and higher performance heterostructure device technologies.

  2. Wireless Integrated Microelectronic Vacuum Sensor System

    Science.gov (United States)

    Krug, Eric; Philpot, Brian; Trott, Aaron; Lawrence, Shaun

    2013-01-01

    NASA Stennis Space Center's (SSC's) large rocket engine test facility requires the use of liquid propellants, including the use of cryogenic fluids like liquid hydrogen as fuel, and liquid oxygen as an oxidizer (gases which have been liquefied at very low temperatures). These fluids require special handling, storage, and transfer technology. The biggest problem associated with transferring cryogenic liquids is product loss due to heat transfer. Vacuum jacketed piping is specifically designed to maintain high thermal efficiency so that cryogenic liquids can be transferred with minimal heat transfer. A vacuum jacketed pipe is essentially two pipes in one. There is an inner carrier pipe, in which the cryogenic liquid is actually transferred, and an outer jacket pipe that supports and seals the vacuum insulation, forming the "vacuum jacket." The integrity of the vacuum jacketed transmission lines that transfer the cryogenic fluid from delivery barges to the test stand must be maintained prior to and during engine testing. To monitor the vacuum in these vacuum jacketed transmission lines, vacuum gauge readings are used. At SSC, vacuum gauge measurements are done on a manual rotation basis with two technicians, each using a handheld instrument. Manual collection of vacuum data is labor intensive and uses valuable personnel time. Additionally, there are times when personnel cannot collect the data in a timely fashion (i.e., when a leak is detected, measurements must be taken more often). Additionally, distribution of this data to all interested parties can be cumbersome. To simplify the vacuum-gauge data collection process, automate the data collection, and decrease the labor costs associated with acquiring these measurements, an automated system that monitors the existing gauges was developed by Invocon, Inc. For this project, Invocon developed a Wireless Integrated Microelectronic Vacuum Sensor System (WIMVSS) that provides the ability to gather vacuum

  3. Carbon nanotubes for thermal interface materials in microelectronic packaging

    Science.gov (United States)

    Lin, Wei

    As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment

  4. Design and Manufacture of Innovative Three-Dimensional Stereoscopic Projection Devices%创新三维立体投影装置的设计和制作

    Institute of Scientific and Technical Information of China (English)

    房若宇

    2016-01-01

    Based on the rectangular pyramid model of stereoscopic projection device,in the current work,the specific design and particular manufacture of cone-mode and front-and-back parallel plane-mode stereoscopic projections were explored;and successively by both systems,excellent three-dimensional stereoscopic projection imaging was achieved.These two kinds of devices present the ultimate limits of three-dimensional stereoscopic projections that fabricated on the basic of polygonal pyramids with maximum and minimum panels.The present work is an audacious innovation for the college physical experiments.%受四棱锥立体投影模型的启发,本文探索了圆锥式和前后平行板式立体投影装置的针对性设计和具体制作方法,在此基础上实现了良好的三维立体投影效果。这两种立体投影装置是最多和最少面多棱锥设计的极限,是大学物理实验大胆创新的一个尝试。

  5. The Wales Region: Microelectronics Education to the Mid Eighties.

    Science.gov (United States)

    Taylor, Lionel

    1982-01-01

    Discusses developments which should occur in the Wales region by the end of the Microelectronics Education Programme (1984). Indicates that a major curriculum project has been started to enable developments in information technology to be reflected in classrooms, focusing on the production of software and resource materials. (Author/JN)

  6. Speculations on the Social Effects of New Microelectronics Technology.

    Science.gov (United States)

    Cherns, A. B.

    1980-01-01

    Examines the implications of the reduced importance of employment for individuals, for enterprises (work conditions, management styles), trade unions (with a more political than industrial role), and the conservation of resources, concluding with a brief look at the possible benefits of microelectronics for the developing countries. (CT)

  7. Integrating Microcomputers and Microelectronics into the Physics Curriculum.

    Science.gov (United States)

    Gale, Douglas S.

    1980-01-01

    Describes an interdisciplinary microcomputer and microelectronics program offered jointly by the Physics and Computer Science Departments of East Texas State University. The program operates on both the graduate and undergraduate level. Content as well as structure of the program are discussed. (Author/DS)

  8. Organic transistors in optical displays and microelectronic applications

    NARCIS (Netherlands)

    Gelinck, G.H.; Heremans, P.; Nomoto, K.; Anthopoulos, T.D.

    2010-01-01

    Organic thin-film transistors (OTFTs) offer unprecedented opportunities for implementation in a broad range of technological applications spanning from large-volume microelectronics and optical displays to chemical and biological sensors. In this Progress Report, we review the application of organic

  9. Ergonomic risk exposure and upper-extremity cumulative trauma disorders in a maquiladora medical devices manufacturing plant.

    Science.gov (United States)

    Meservy, D; Suruda, A J; Bloswick, D; Lee, J; Dumas, M

    1997-08-01

    Workers at a Nogales, Mexico, maquiladora plant that assembles medical devices were studied to determine the prevalence of upper-extremity cumulative trauma disorders (CTD). Subjects included production workers employed 6 months or longer; of the 148 eligible workers, 145 (98%) participated. Subjects had a mean age of 24.6 years (SD = 5.2; range, 17 to 45) and the mean length of employment was 3.5 years (SD = 2.5; range, 0.5 to 14). Job tasks were videotaped and analyzed for ergonomic risk factors, using pre-defined criteria. All jobs performed by study subjects were found to involve one or more ergonomic risk factors associated with the development of CTD. A CTD questionnaire and screening physical examination format, similar to that used by the National Institute of Occupational Safety and Health (NIOSH) in a chicken processing plant study, were administered. Period prevalence of CTD within the previous year, as reported on the questionnaire, was 28%. Prevalence of CTD was 17%, using data from the screening physical examination. Point prevalence (current pain data from the questionnaire plus positive symptoms on the screening physical examination) was 15%. CTD was reported more frequently in women than men (46% and 25%, respectively; P < 0.05) and in subjects who had worked at the plant less than one year (50%; P < 0.05). Workforce turnover (3% monthly) may have resulted in those affected by CTD leaving employment, reducing the apparent CTD rate in experienced workers.

  10. Temperature-independent resistor for microelectronic circuits

    Science.gov (United States)

    Aegerter, S.; Libby, W. F.

    1970-01-01

    Heat treating insulating crystals in gaseous hydrogen atmosphere produce resistive device which is temperature-independent from 77 to 295 degrees K. Increasing the concentration of hydrogen within the crystal yields semiconductor, hybrid, and metallic conduction characteristics which are combined with a depletion layer at the surface.

  11. Encapsulation methods for organic electrical devices

    Science.gov (United States)

    Blum, Yigal D.; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijian

    2013-06-18

    The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

  12. National Center for Advanced Information Components Manufacturing. Program summary report, Volume II

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1996-10-01

    The National Center for Advanced Information Components Manufacturing focused on manufacturing research and development for flat panel displays, advanced lithography, microelectronics, and optoelectronics. This report provides an overview of the program, program history, summaries of the technical projects, and key program accomplishments.

  13. Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

    Science.gov (United States)

    Ramesham, Rajeshuni

    2000-01-01

    MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed

  14. 浅谈医疗器械生产质量管理规范中洁净区的检查%Interpretation of the Clean Area Inspection in the Good Manufacture Practice for Medical Devices

    Institute of Scientific and Technical Information of China (English)

    钱湧; 秦黎; 杜华月

    2016-01-01

    This paper introduces check points of the clean area inspection in the Good manufacture practice for medical devices.%本文介绍了医疗器械生产质量管理规范洁净区体系检查时检查要点以及注意点。

  15. Electrodeposition of Alloys and Compounds in the Era of Microelectronics and Energy Conversion Technology

    Directory of Open Access Journals (Sweden)

    Giovanni Zangari

    2015-06-01

    Full Text Available Electrochemical deposition methods are increasingly being applied to advanced technology applications, such as microelectronics and, most recently, to energy conversion. Due to the ever growing need for device miniaturization and enhanced performance, vastly improved control of the growth process is required, which in turn necessitates a better understanding of the fundamental phenomena involved. This overview describes the current status of and latest advances in electrodeposition science and technology. Electrochemical growth phenomena are discussed at the macroscopic and atomistic scale, while particular attention is devoted to alloy and compound formation, as well as surface-limited processes. Throughout, the contribution of Professor Foresti and her group to the understanding of electrochemical interfaces and electrodeposition, is highlighted.

  16. A four-channel microelectronic system for neural signal regeneration

    Energy Technology Data Exchange (ETDEWEB)

    Xie Shushan; Wang Zhigong; Li Wenyuan [Institute of RF- and OE-ICs, Southeast University, Nanjing 210096 (China); Lue Xiaoying; Pan Haixian, E-mail: zgwang@seu.edu.c [State Key Laboratory of Bio-Electronics, Southeast University, Nanjing 210096 (China)

    2009-12-15

    This paper presents a microelectronic system which is capable of making a signal record and functional electric stimulation of an injured spinal cord. As a requirement of implantable engineering for the regeneration microelectronic system, the system is of low noise, low power, small size and high performance. A front-end circuit and two high performance OPAs (operational amplifiers) have been designed for the system with different functions, and the two OPAs are a low-noise low-power two-stage OPA and a constant-g{sub m} RTR input and output OPA. The system has been realized in CSMC 0.5-{mu}m CMOS technology. The test results show that the system satisfies the demands of neuron signal regeneration. (semiconductor integrated circuits)

  17. Applicability of LET to single events in microelectronic structures

    Science.gov (United States)

    Xapsos, Michael A.

    1992-12-01

    LET is often used as a single parameter to determine the energy deposited in a microelectronic structure by a single event. The accuracy of this assumption is examined for ranges of ion energies and volumes of silicon appropriate for modern microelectronics. It is shown to be accurate only under very restricted conditions. Significant differences arise because (1) LET is related to energy lost by the ion, not energy deposited in the volume; and (2) LET is an average value and does not account for statistical variations in energy deposition. Criteria are suggested for determining when factors other than LET should be considered, and new analytical approaches are presented to account for them. One implication of these results is that improvements can be made in space upset rate predictions by incorporating the new methods into currently used codes such as CREME and CRUP.

  18. A four-channel microelectronic system for neural signal regeneration

    Institute of Scientific and Technical Information of China (English)

    Xie Shushan; Wang Zhigong; Lü Xiaoying; Li Wenyuan; Pan Haixian

    2009-01-01

    This paper presents a microelectronic system which is capable of making a signal record and functional electric stimulation of an injured spinal cord. As a requirement of implantable engineering for the regeneration microelectronic system, the system is of low noise, low power, small size and high performance. A front-end circuit and two high performance OPAs (operational amplifiers) have been designed for the system with different functions,and the two OPAs are a low-noise low-power two-stage OPA and a constant-g_m RTR input and output OPA. The system has been realized in CSMC 0.5-μm CMOS technology. The test results show that the system satisfies the demands of neuron signal regeneration.

  19. Radiofrequency and microwave radiation in the microelectronics industry.

    Science.gov (United States)

    Cohen, R

    1986-01-01

    The microscopic precision required to produce minute integrated circuits is dependent on several processes utilizing radiofrequency and microwave radiation. This article provides a review of radiofrequency and microwave exposures in microelectronics and of the physical and biologic properties of these types of radiation; summarizes the existing, relevant medical literature; and provides the clinician with guidelines for diagnosis and treatment of excessive exposures to microwave and radiofrequency radiation.

  20. Temperature- and voltage-dependent trap generation model in high-k metal gate MOS device with percolation simulation

    Science.gov (United States)

    Xu, Hao; Yang, Hong; Wang, Yan-Rong; Wang, Wen-Wu; Luo, Wei-Chun; Qi, Lu-Wei; Li, Jun-Feng; Zhao, Chao; Chen, Da-Peng; Ye, Tian-Chun

    2016-08-01

    High-k metal gate stacks are being used to suppress the gate leakage due to tunneling for sub-45 nm technology nodes. The reliability of thin dielectric films becomes a limitation to device manufacturing, especially to the breakdown characteristic. In this work, a breakdown simulator based on a percolation model and the kinetic Monte Carlo method is set up, and the intrinsic relation between time to breakdown and trap generation rate R is studied by TDDB simulation. It is found that all degradation factors, such as trap generation rate time exponent m, Weibull slope β and percolation factor s, each could be expressed as a function of trap density time exponent α. Based on the percolation relation and power law lifetime projection, a temperature related trap generation model is proposed. The validity of this model is confirmed by comparing with experiment results. For other device and material conditions, the percolation relation provides a new way to study the relationship between trap generation and lifetime projection. Project supported by the National High Technology Research and Development Program of China (Grant No. SS2015AA010601), the National Natural Science Foundation of China (Grant Nos. 61176091 and 61306129), and the Opening Project of Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of MicroElectronics of Chinese Academy of Sciences.

  1. Manufacturing tolerant topology optimization

    DEFF Research Database (Denmark)

    Sigmund, Ole

    2009-01-01

    In this paper we present an extension of the topology optimization method to include uncertainties during the fabrication of macro, micro and nano structures. More specifically, we consider devices that are manufactured using processes which may result in (uniformly) too thin (eroded) or too thick...... (dilated) structures compared to the intended topology. Examples are MEMS devices manufactured using etching processes, nano-devices manufactured using e-beam lithography or laser micro-machining and macro structures manufactured using milling processes. In the suggested robust topology optimization...... approach, under- and over-etching is modelled by image processing-based "erode" and "dilate" operators and the optimization problem is formulated as a worst case design problem. Applications of the method to the design of macro structures for minimum compliance and micro compliant mechanisms show...

  2. PREFACE: E-MRS 2012 Spring Meeting, Symposium M: More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

    Science.gov (United States)

    Wenger, Christian; Fompeyrine, Jean; Vallée, Christophe; Locquet, Jean-Pierre

    2012-12-01

    More than Moore explores a new area of Silicon based microelectronics, which reaches beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, More than Moore focuses on motivating new technological possibilities. In the past decades, the main stream of microelectronics progresses was mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While the microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there is increasing momentum for the development of 'More than Moore' technologies which are based on silicon technologies but do not simply scale with Moore's law. Typical examples are RF, Power/HV, Passives, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials. Important key challenges for the realization of the 'More than Moore' strategy are: perspective materials for future THz devices materials systems for embedded sensors and actuators perspective materials for epitaxial approaches material systems for embedded innovative memory technologies development of new materials with customized characteristics The Hot topics covered by the symposium M (More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics) at E-MRS 2012 Spring Meeting, 14-18 May 2012 have been: development of functional ceramics thin films New dielectric materials for advanced microelectronics bio- and CMOS compatible

  3. Sustainable Micro-Manufacturing of Micro-Components via Micro Electrical Discharge Machining

    Directory of Open Access Journals (Sweden)

    Valeria Marrocco

    2011-12-01

    Full Text Available Micro-manufacturing emerged in the last years as a new engineering area with the potential of increasing peoples’ quality of life through the production of innovative micro-devices to be used, for example, in the biomedical, micro-electronics or telecommunication sectors. The possibility to decrease the energy consumption makes the micro-manufacturing extremely appealing in terms of environmental protection. However, despite this common belief that the micro-scale implies a higher sustainability compared to traditional manufacturing processes, recent research shows that some factors can make micro-manufacturing processes not as sustainable as expected. In particular, the use of rare raw materials and the need of higher purity of processes, to preserve product quality and manufacturing equipment, can be a source for additional environmental burden and process costs. Consequently, research is needed to optimize micro-manufacturing processes in order to guarantee the minimum consumption of raw materials, consumables and energy. In this paper, the experimental results obtained by the micro-electrical discharge machining (micro-EDM of micro-channels made on Ni–Cr–Mo steel is reported. The aim of such investigation is to shed a light on the relation and dependence between the material removal process, identified in the evaluation of material removal rate (MRR and tool wear ratio (TWR, and some of the most important technological parameters (i.e., open voltage, discharge current, pulse width and frequency, in order to experimentally quantify the material waste produced and optimize the technological process in order to decrease it.

  4. Space station automation study. Automation requirements derived from space manufacturing concepts. Volume 1: Executive summary

    Science.gov (United States)

    1984-01-01

    The two manufacturing concepts developed represent innovative, technologically advanced manufacturing schemes. The concepts were selected to facilitate an in depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, and artificial intelligence. While the cost effectiveness of these facilities has not been analyzed as part of this study, both appear entirely feasible for the year 2000 timeframe. The growing demand for high quality gallium arsenide microelectronics may warrant the ventures.

  5. Human-centered design (HCD) of a fault-finding application for mobile devices and its impact on the reduction of time in fault diagnosis in the manufacturing industry.

    Science.gov (United States)

    Kluge, Annette; Termer, Anatoli

    2017-03-01

    The present article describes the design process of a fault-finding application for mobile devices, which was built to support workers' performance by guiding them through a systematic strategy to stay focused during a fault-finding process. In collaboration with a project partner in the manufacturing industry, a fault diagnosis application was conceptualized based on a human-centered design approach (ISO 9241-210:2010). A field study with 42 maintenance workers was conducted for the purpose of evaluating the performance enhancement of fault finding in three different scenarios as well as for assessing the workers' acceptance of the technology. Workers using the mobile device application were twice as fast at fault finding as the control group without the application and perceived the application as very useful. The results indicate a vast potential of the mobile application for fault diagnosis in contemporary manufacturing systems.

  6. Laser sintering of thick-film conductors for microelectronic applications

    Science.gov (United States)

    Kinzel, Edward C.; Sigmarsson, Hjalti H.; Xu, Xianfan; Chappell, William J.

    2007-03-01

    This paper investigates fabrication of functional thick metal films using simultaneous laser sintering and patterning along with the fundamental physical phenomena that govern the laser sintering process. The effects of the processing parameters on the quality of the fabricated components are investigated through a heat transfer analysis. We show that our process has potentials for metallization of microelectronics directly onto substrates whose melting temperatures are much lower than the temperature needed for sintering, which is only possible by properly controlling the temperature field during laser sintering. Optimum properties of the fabricated components are obtained when certain thermal conditions are produced during laser heating.

  7. Plasma-aided manufacturing

    Science.gov (United States)

    Shohet, J. L.

    1993-12-01

    Plasma-aided manufacturing is used for producing new materials with unusual and superior properties, for developing new chemical compounds and processes, for machining, and for altering and refining materials and surfaces. Plasma-aided manufacturing has direct applications to semiconductor fabrication, materials synthesis, welding, lighting, polymers, anti-corrosion coatings, machine tools, metallurgy, electrical and electronics devices, hazardous waste removal, high performance ceramics, and many other items in both the high-technology and the more traditional industries in the United States.

  8. Microelectronics at Work: Productivity and Jobs in the World Economy. Worldwatch Paper 39.

    Science.gov (United States)

    Norman, Colin

    A combination of revitalized employment policies, greater industrial democracy, and new ways of distributing both the hours of work and the fruits of technological change are essential if the benefits of the microelectronic revolution are to be equitably shared. Microelectronic technology promises an array of benefits, and the electronic age is…

  9. Design, development, manufacture, testing, and delivery of devices for connection of solar cell panel circuitry to flat conductor cable solar cell array harness

    Science.gov (United States)

    Dillard, P. A.; Waddington, D.

    1971-01-01

    The technology status and problem areas which exist for the application of flat conductor cabling to solar cell arrays are summarized. Details covering the design, connector manufacture, and prototype test results are also summarized.

  10. Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing

    CERN Document Server

    Liu, Sheng

    2011-01-01

    Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people

  11. Quality politics: an immaterial investment for companies in (micro)electronics

    Science.gov (United States)

    Bacivarov, I. C.; Lupan, R.; Robledo, C.; Bacivarov, Angelica

    2010-11-01

    With the globalization of the markets and the growth of competitiveness in the manufacturing sector, quality has become a key factor of success. Quality is particularly important for the companies which activate in the micro(electronics) field. The quality management system holds a vital place in the company's structure. Implementing such a system requires important operating costs. These costs are known as Quality Obtaining Costs (QOC) and may be considered as an investment. Planning an investment, means evaluating its return in order to see if it is profitable or not. Measuring the return of quality politics investment raise some delicate problems. We may calculate some aspects of the return of investment by measuring the shape of non-quality costs. An eventual decrease of these costs could be synonym with a profitable investment. But the advantages of good quality politics cannot be measured only by taking into consideration the non-quality costs (even if they include direct and indirect costs). There are also intangible advantages (like mark image, competences, polyvalence, client's satisfaction...) that derive from quality approaches. How to evaluate this type of consequences / advantages? The idea developed in this article is to considerate the quality politics like un immaterial/intelligent investment. Therefore could it be advantageous / possible to use the immaterial investment's measuring and evaluation techniques for studying the quality politics return of investment?

  12. Establishment Registration & Device Listing

    Data.gov (United States)

    U.S. Department of Health & Human Services — This searchable database contains establishments (engaged in the manufacture, preparation, propagation, compounding, assembly, or processing of medical devices...

  13. Establishment Registration & Device Listing

    Data.gov (United States)

    U.S. Department of Health & Human Services — This searchable database contains establishments (engaged in the manufacture, preparation, propagation, compounding, assembly, or processing of medical devices...

  14. Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

    Science.gov (United States)

    Ramesham, Rajeshuni

    2000-01-01

    Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS

  15. Handbook of compound semiconductors growth, processing, characterization, and devices

    CERN Document Server

    Holloway, Paul H

    1996-01-01

    This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.

  16. Fabrication and characterisation of carbon-based devices

    OpenAIRE

    2012-01-01

    Thin film material properties and measurement characterisation techniques are crucial for the development of micro-electromechanical systems (MEMS) devices. Furthermore, as the technology scales down from microtechnology towards nanotechnology, nanoscale materials such as carbon nanotubes (CNTs) are required in electronic devices to overcome the limitations encountered by conventional materials at the nanoscale. The integration of CNTs into micro-electronics and material app...

  17. Integrated Multiscale Modeling of Molecular Computing Devices

    Energy Technology Data Exchange (ETDEWEB)

    Jerzy Bernholc

    2011-02-03

    Nanoscience has been one of the major research focuses of the U.S. and much of the world for the past decade, in part because of its promise to revolutionize many fields, including materials, medicine, and electronics. At the heart of this promise is the fact that nanostructured materials can behave radically differently than their macroscopic counterparts (e.g., bulk gold is such an inert metal that it has found applications in such diverse fields as jewelry, biomedical implants and dentistry, whereas gold nanoparticles are highly reactive and are thus useful as nanocatalysts) and have properties that are tunable due to a strong dependence on the size and surface area of the nanostructure. Thus, nanoscience offers a remarkable opportunity to develop new functional systems built around nanostructured materials with unusual and tunable properties and functionality. The transition from nanoscience to nanotechnology becomes possible when nanostructured systems can be made reproducibly by processes that can be implemented on a large scale. The microelectronics industry is one example of an industry that has evolved into the realm of nanotechnology, since the exponential reduction in feature size in computer chips has resulted in feature sizes now under 50nm (45nm in production, 32nm demonstrated; feature size has been going down by a factor of approximately 1/{radical}2 every 18 months as chip density has doubled every 18 months according to Moore's law). Silicon-based microelectronics relies on etching features into a single-crystal silicon substrate by photolithography. As the feature size of silicon-based microelectronics continues to decrease, the continuation of Moore's law to below 20nm feature sizes is being questioned, due to limitations in both the physics of the transistors (leading to unacceptable power dissipation) and doubts about the scalability of top-down photolithography-based manufacturing to such small sizes. There is no doubt that

  18. Manufacturing tolerant topology optimization

    Institute of Scientific and Technical Information of China (English)

    Ole Sigmund

    2009-01-01

    In this paper we present an extension of the topology optimization method to include uncertainties during the fabrication of macro, micro and nano structures. More specifically, we consider devices that are manufactured using processes which may result in (uniformly) too thin (eroded)or too thick (dilated) structures compared to the intended topology. Examples are MEMS devices manufactured using etching processes, nano-devices manufactured using e-beam lithography or laser micro-machining and macro structures manufactured using milling processes. In the suggested robust topology optimization approach, under- and over-etching is modelled by image processing-based "erode" and "dilate" operators and the optimization problem is formulated as a worst case design problem. Applications of the method to the design of macro structures for minimum compliance and micro compliant mechanisms show that the method provides manufacturing tolerant designs with little decrease in performance. As a positive side effect the robust design formulation also eliminates the longstanding problem of one-node connected hinges in compliant mechanism design using topology optimization.

  19. REmote SUpervision to Decrease HospitaLization RaTe. Unified and integrated platform for data collected from devices manufactured by different companies: Design and rationale of the RESULT study.

    Science.gov (United States)

    Tajstra, Mateusz; Sokal, Adam; Gwóźdź, Arkadiusz; Wilczek, Marcin; Gacek, Adam; Wojciechowski, Konrad; Gadula-Gacek, Elżbieta; Adamowicz-Czoch, Elżbieta; Chłosta-Niepiekło, Katarzyna; Milewski, Krzysztof; Rozentryt, Piotr; Kalarus, Zbigniew; Gąsior, Mariusz; Poloński, Lech

    2017-07-01

    The number of patients with heart failure implantable cardiac electronic devices (CIEDs) is growing. Hospitalization rate in this group is very high and generates enormous costs. To avoid the need for hospital treatment, optimized monitoring and follow-up is crucial. Remote monitoring (RM) has been widely put into practice in the management of CIEDs but it may be difficult due to the presence of differences in systems provided by device manufacturers and loss of gathered data in case of device reimplantation. Additionally, conclusions derived from studies about usefulness of RM in clinical practice apply to devices coming only from a single company. An integrated monitoring platform allows for more comprehensive data analysis and interpretation. Therefore, the primary objective of Remote Supervision to Decrease Hospitalization Rate (RESULT) study is to evaluate the impact of RM on the clinical status of patients with ICDs or CRT-Ds using an integrated platform. Six hundred consecutive patients with ICDs or CRT-Ds implanted will be prospectively randomized to either a traditional or RM-based follow-up model. The primary clinical endpoint will be a composite of all-cause mortality or hospitalization for cardiovascular reasons within 12 months after randomization. The primary technical endpoint will be to construct and evaluate a unified and integrated platform for the data collected from RM devices manufactured by different companies. This manuscript describes the design and methodology of the prospective, randomized trial designed to determine whether remote monitoring using an integrated platform for different companies is safe, feasible, and efficacious (ClinicalTrials.gov Identifier: NCT02409225). © 2016 Wiley Periodicals, Inc.

  20. Using microelectronics technology to communicate with living cells.

    Science.gov (United States)

    Heer, F; Hafizovic, S; Ugniwenko, T; Frey, U; Roscic, B; Blau, A; Hierlemann, A

    2007-01-01

    A monolithic microsystem in CMOS (complementary metal oxide semiconductor) technology is presented that provides bidirectional communication (stimulation and recording) between standard microelectronics and cultured electrogenic cells. The 128-electrode chip can be directly used as a substrate for cell culturing. It features circuitry units for stimulation and immediate cell signal treatment near each electrode. In addition, it provides on-chip A/D conversion as well as a digital interface so that a fast interaction is possible at good signal quality. Spontaneous and stimulated electrical activity recordings with neuronal and cardiac cell cultures will be presented. The system can be used to, e.g., study the behavior and development of neural networks in vitro, to reveal the effects of neuronal plasticity and to study network activity in response to pharmacological treatments.

  1. Computational manufacturing

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    This paper presents a general framework for computational manufacturing. The methodology of computational manufacturing aims at integrating computational geometry, machining principle, sensor information fusion, optimization, computational intelligence and virtual prototyping to solve problems of the modeling, reasoning, control, planning and scheduling of manufacturing processes and systems. There are three typical problems in computational manufacturing, i.e., scheduling (time-domain), geometric reasoning (space-domain) and decision- making (interaction between time-domain and space-domain). Some theoretical fundamentals of computational manufacturing are also discussed.

  2. Precision manufacturing

    CERN Document Server

    Dornfeld, David

    2008-01-01

    Today there is a high demand for high-precision products. The manufacturing processes are now highly sophisticated and derive from a specialized genre called precision engineering. Precision Manufacturing provides an introduction to precision engineering and manufacturing with an emphasis on the design and performance of precision machines and machine tools, metrology, tooling elements, machine structures, sources of error, precision machining processes and precision process planning. As well as discussing the critical role precision machine design for manufacturing has had in technological developments over the last few hundred years. In addition, the influence of sustainable manufacturing requirements in precision processes is introduced. Drawing upon years of practical experience and using numerous examples and illustrative applications, David Dornfeld and Dae-Eun Lee cover precision manufacturing as it applies to: The importance of measurement and metrology in the context of Precision Manufacturing. Th...

  3. Materials science in microelectronics II the effects of structure on properties in thin films

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    The subject matter of thin-films - which play a key role in microelectronics - divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: Electrical properties Magnetic properties Optical properties Mechanical properties Mass transport properties Interface and junction properties Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties.

  4. Feasibility of Observing and Characterizing Single Ion Strikes in Microelectronic Components.

    Energy Technology Data Exchange (ETDEWEB)

    Dingreville, Remi Philippe Michel [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Hattar, Khalid Mikhiel [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Bufford, Daniel Charles [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

    2015-11-01

    The transient degradation of semiconductor device performance under irradiation has long been an issue of concern. A single high energy charged particle can degrade or permanently destroy the microelectronic component potentially altering the course or function of the systems. Disruption of the the crystalline structure through the introduction of quasi-stable defect structures can change properties from semiconductor to conductor. Typically, the initial defect formation phase is followed by a recovery phase in which defect-defect or defect-dopant interactions modify the characteristics of the damaged structure. In this LDRD Express, in-situ ion irradiation transmission microscopy (TEM) in-situ TEM experiments combined with atomistic simulations have been conducted to determine the feasibility of imaging and characterizing the defect structure resulting from a single cascade in silicon. In-situ TEM experiments have been conducted to demonstrate that a single ion strike can be observed in Si thin films with nanometer resolution in real time using the in-situ ion irradiation transmission electron microscope (I 3 TEM). Parallel to this experimental effort, ion implantation has been numerically simulated using Molecular Dynamics (MD). This numerical framework provides detailed predictions of the damage and follow the evolution of the damage during the first nanoseconds. The experimental results demonstrate that single ion strike can be observed in prototypical semiconductors.

  5. Organic-inorganic Hybrids Towards the Preparation of Nanoporous Composite Thin Films for Microelectronic Application

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    Silicon containing materials have traditionally been used in microelectronic fabrication. Semiconductor devices often have one or more arrays of patterned interconnect levels that serve to electrically couple the individual circuit elements forming an integrated circuit. These interconnect levels are typically separated by an insulating or dielectric film. Previously, a silicon oxide film was the most commonly used material for such dielectric films having dielectric constants(k) near 4. 0. However, as the feature size is continuously scaling down, the relatively high k of such silicon oxide films became inadequate to provide efficient electrical insulation. As such, there has been an increasing market demand for materials with even lower dielectric constant for Interlayer Dielectric (ILD) applications, yet retaining thermal and mechanical integrity. We wish to report here our investigations on the preparation of ultra-low k ILD materials using a sacrificial approach whereby organic groups are burnt out to generate low k porous ORMOSIL films. We have been able to prepare a variety of organically modified silicone resins leading to highly microporous thin films, exhibiting ultra-low k from 1.80 to 2.87, and good to high modulus, 1.5 to 5.5 Gpa. Structure property influences on porosity, dielectric constant and modulus will be discussed.

  6. Micropatterning proteins and synthetic peptides on solid supports: a novel application for microelectronics fabrication technology.

    Science.gov (United States)

    Britland, S; Perez-Arnaud, E; Clark, P; McGinn, B; Connolly, P; Moores, G

    1992-01-01

    In this paper, we describe a method for immobilizing proteins and synthesizing peptides in micrometer-dimension patterns on solid supports. Microelectronics fabrication technology was adapted and used to lithographically direct the location of immobilization of proteins on appropriately derivatized surfaces. As examples, we micropatterned the protein bovine serum albumin (BSA) and the enzyme horseradish peroxidase (HRP). The catalytic activity of HRP was shown to be retained after being cross-linked to the support. When coupled with solid-phase peptide synthesis, the technique allowed synthetic peptides to be constructed in patterns again having micrometer dimensions. Synthetic polypeptides, polylysine, were constructed in patterns with dimensions that approached the practical limit of resolution for optical lithography at 1-2 microns. The patterns of immobilized molecules and synthetic peptides were visualized using histochemical methods together with light and fluorescence microscopy. The protein and peptide patterning technique described here is an advance in the field of bioelectronics. In particular, it should now be possible to devise novel methods for interfacing with biological systems and constructing new devices for incorporation into miniaturized biosensors.

  7. Electrodeposition of platinum-iridium alloy nanowires for hermetic packaging of microelectronics.

    Science.gov (United States)

    Petrossians, Artin; Whalen, John J; Weiland, James D; Mansfeld, Florian

    2012-01-01

    An electrodeposition technique was applied for fabrication of dense platinum-iridium alloy nanowires as interconnect structures in hermetic microelectronic packaging to be used in implantable devices. Vertically aligned arrays of platinum-iridium alloy nanowires with controllable length and a diameter of about 200 nm were fabricated using a cyclic potential technique from a novel electrodeposition bath in nanoporous aluminum oxide templates. Ti/Au thin films were sputter deposited on one side of the alumina membranes to form a base material for electrodeposition. Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were used to characterize the morphology and the chemical composition of the nanowires, respectively. SEM micrographs revealed that the electrodeposited nanowires have dense and compact structures. EDS analysis showed a 60:40% platinum-iridium nanowire composition. Deposition rates were estimated by determining nanowire length as a function of deposition time. High Resolution Transmission Electron Microscopy (HRTEM) images revealed that the nanowires have a nanocrystalline structure with grain sizes ranging from 3 nm to 5 nm. Helium leak tests performed using a helium leak detector showed leak rates as low as 1 × 10(-11) mbar L s(-1) indicating that dense nanowires were electrodeposited inside the nanoporous membranes. Comparison of electrical measurements on platinum and platinum-iridium nanowires revealed that platinum-iridium nanowires have improved electrical conductivity.

  8. Selected area chemical vapor deposition of thin films for conductometric microelectronic chemical sensors

    Science.gov (United States)

    Majoo, Sanjeev

    Recent advances in microelectronics and silicon processing have been exploited to fabricate miniaturized chemical sensors. Although the capability of chemical sensing technology has grown steadily, it has been outpaced by the increasing demands for more reliable, inexpensive, and selective sensors. The diversity of applications requires the deployment of different sensing materials that have rich interfacial chemistry. However, several promising sensor materials are often incompatible with silicon micromachining and their deposition requires complicated masking steps. The new approach described here is to first micromachine a generic, instrumented, conductometric, microelectronic sensor platform that is fully functional except for the front-end sensing element. This generic platform contains a thin dielectric membrane, an integrated boron-doped silicon heater, and conductance electrodes. The membrane has low thermal mass and excellent thermal isolation. A proprietary selected-area chemical vapor deposition (SACVD) process in a cold-wall reactor at low pressures was then used to achieve maskless, self-lithographic deposition of thin films. The temperature-programmable integrated microheater initiates localized thermal decomposition/reaction of suitable CVD precursors confined to a small heated area (500 mum in diameter), and this creates the active sensing element. Platinum and titania (TiOsb2) films were deposited from pyrolysis of organometallic precursors, tetrakistrifluorophosphine platinum Pt(PFsb3)sb4 and titanium tetraisopropoxide Ti(OCH(CHsb3)sb2rbrack sb4, respectively. Deposition of gold metal films from chlorotriethylphosphine gold (Csb2Hsb5)sb3PAuCl precursor was also attempted but without success. The conductance electrodes permit in situ monitoring of film growth. The as-deposited films were characterized in situ by conductance measurements and optical microscopy and ex situ by electron microscopy and spectroscopy methods. Devices equipped with

  9. Microelectronics-embedded channel bridging and signal regeneration of injured spinal cords

    Institute of Scientific and Technical Information of China (English)

    Zhigong Wang; Xiaosong Gu; Xiaoying Lü; Zhenglin Jiang; Wenyuan Li; Guangming Lü; Yufeng Wang; Xiaoyan Shen; Xintai Zhao; Huiling Wang; Zhenyu Zhang; Hongmei Shen; Yang Wu; Weixing Shen; Jingyang Zhang; Dong Chen; Xiaoyi Mao; Huaxiang Shen

    2009-01-01

    Due to the difficulty in spinal cord regeneration with biological methods, the microelectronic neural bridge, a new concept based on microelectronic technology, is presented. The microelectronic system has been realized in the forms of hybrid and integrated circuits. The integrated circuits for neural signal detection, stimulation, and regeneration are realized in a CMOS process. In animal experiments with 100 toads, 48 rats, and 3 rabbits, nerve signals have been successfully detected from spinal cords and sciatic nerves, and functional electrical stimulation has been carried out for spinal cords and sciatic nerves. When the microelectronic system is bridged between the controlling and stimulated nerve, the relevant motion of legs and nerve signal waveforms, which are stimulated by the evoked or spontaneous nerve signal through such a system, have been observed. Therefore, the feasibility of the presented method was demonstrated.

  10. Solar Variability and the Near-Earth Environment: Mining Enhanced Low Dose Rate Sensitivity Data From the Microelectronics and Photonics Test Bed Space Experiment

    Science.gov (United States)

    Turflinger, T.; Schmeichel, W.; Krieg, J.; Titus, J.; Campbell, A.; Reeves, M.; Marshall (P.); Hardage, Donna (Technical Monitor)

    2004-01-01

    This effort is a detailed analysis of existing microelectronics and photonics test bed satellite data from one experiment, the bipolar test board, looking to improve our understanding of the enhanced low dose rate sensitivity (ELDRS) phenomenon. Over the past several years, extensive total dose irradiations of bipolar devices have demonstrated that many of these devices exhibited ELDRS. In sensitive bipolar transistors, ELDRS produced enhanced degradation of base current, resulting in enhanced gain degradation at dose rates 1 rd(Si)/s. This Technical Publication provides updated information about the test devices, the in-flight experiment, and both flight-and ground-based observations. Flight data are presented for the past 5 yr of the mission. These data are compared to ground-based data taken on devices from the same date code lots. Information about temperature fluctuations, power shutdowns, and other variables encountered during the space flight are documented.

  11. Space station automation study: Automation requriements derived from space manufacturing concepts,volume 2

    Science.gov (United States)

    1984-01-01

    Automation reuirements were developed for two manufacturing concepts: (1) Gallium Arsenide Electroepitaxial Crystal Production and Wafer Manufacturing Facility, and (2) Gallium Arsenide VLSI Microelectronics Chip Processing Facility. A functional overview of the ultimate design concept incoporating the two manufacturing facilities on the space station are provided. The concepts were selected to facilitate an in-depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, sensors, and artificial intelligence. While the cost-effectiveness of these facilities was not analyzed, both appear entirely feasible for the year 2000 timeframe.

  12. The Electrical Engineering Curriculum at the Technical University of Denmark - Options in Microelectronics

    DEFF Research Database (Denmark)

    Bruun, Erik; Nielsen, Lars Drud

    1997-01-01

    This paper describes the modular structure of the engineering curriculum at the Technical University of Denmark. The basic requirements for an electrical engineering curriculum are presented and different possibilities for specialization in microelectronics and integrated circuit design are outli......This paper describes the modular structure of the engineering curriculum at the Technical University of Denmark. The basic requirements for an electrical engineering curriculum are presented and different possibilities for specialization in microelectronics and integrated circuit design...

  13. MCM-C Multichip Module Manufacturing Guide

    Energy Technology Data Exchange (ETDEWEB)

    Blazek, R.J.; Kautz, D.R.; Galichia, J.V.

    2000-11-20

    Honeywell Federal Manufacturing & Technologies (FM&T) provides complete microcircuit capabilities from design layout through manufacturing and final electrical testing. Manufacturing and testing capabilities include design layout, electrical and mechanical computer simulation and modeling, circuit analysis, component analysis, network fabrication, microelectronic assembly, electrical tester design, electrical testing, materials analysis, and environmental evaluation. This document provides manufacturing guidelines for multichip module-ceramic (MCM-C) microcircuits. Figure 1 illustrates an example MCM-C configuration with the parts and processes that are available. The MCM-C technology is used to manufacture microcircuits for electronic systems that require increased performance, reduced volume, and higher density that cannot be achieved by the standard hybrid microcircuit or printed wiring board technologies. The guidelines focus on the manufacturability issues that must be considered for low-temperature cofired ceramic (LTCC) network fabrication and MCM assembly and the impact that process capabilities have on the overall MCM design layout and product yield. Prerequisites that are necessary to initiate the MCM design layout include electrical, mechanical, and environmental requirements. Customer design data can be accepted in many standard electronic file formats. Other requirements include schedule, quantity, cost, classification, and quality level. Design considerations include electrical, network, packaging, and producibility; and deliverables include finished product, drawings, documentation, and electronic files.

  14. MCM-C Multichip Module Manufacturing Guide

    Energy Technology Data Exchange (ETDEWEB)

    Blazek, R.J.; Kautz, D.R.; Galichia, J.V.

    2000-11-20

    Honeywell Federal Manufacturing & Technologies (FM&T) provides complete microcircuit capabilities from design layout through manufacturing and final electrical testing. Manufacturing and testing capabilities include design layout, electrical and mechanical computer simulation and modeling, circuit analysis, component analysis, network fabrication, microelectronic assembly, electrical tester design, electrical testing, materials analysis, and environmental evaluation. This document provides manufacturing guidelines for multichip module-ceramic (MCM-C) microcircuits. Figure 1 illustrates an example MCM-C configuration with the parts and processes that are available. The MCM-C technology is used to manufacture microcircuits for electronic systems that require increased performance, reduced volume, and higher density that cannot be achieved by the standard hybrid microcircuit or printed wiring board technologies. The guidelines focus on the manufacturability issues that must be considered for low-temperature cofired ceramic (LTCC) network fabrication and MCM assembly and the impact that process capabilities have on the overall MCM design layout and product yield. Prerequisites that are necessary to initiate the MCM design layout include electrical, mechanical, and environmental requirements. Customer design data can be accepted in many standard electronic file formats. Other requirements include schedule, quantity, cost, classification, and quality level. Design considerations include electrical, network, packaging, and producibility; and deliverables include finished product, drawings, documentation, and electronic files.

  15. Manufacturing technologies

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-09-01

    The Manufacturing Technologies Center is an integral part of Sandia National Laboratories, a multiprogram engineering and science laboratory, operated for the Department of Energy (DOE) with major facilities at Albuquerque, New Mexico, and Livermore, California. Our Center is at the core of Sandia`s Advanced Manufacturing effort which spans the entire product realization process.

  16. Manufacturing Interfaces

    NARCIS (Netherlands)

    Houten, van F.J.A.M.

    1992-01-01

    The paper identifies the changing needs and requirements with respect to the interfacing of manufacturing functions. It considers the manufacturing system, its components and their relationships from the technological and logistic point of view, against the background of concurrent engineering. Desi

  17. Laser in manufacturing

    CERN Document Server

    Davim, J Paulo

    2013-01-01

    Generally a laser (light amplification by stimulated emission of radiation) is defined as "a device which uses a quantum mechanical effect, stimulated emission, to generate a coherent beam of light from a lasing medium of controlled purity, size, and shape". Laser material processing represents a great number of methods, which are rapidly growing in current and different industrial applications as new alternatives to traditional manufacturing processes. Nowadays, the use of lasers in manufacturing is an emerging area with a wide variety of applications, for example, in electronics, molds an

  18. Piezoelectric-nanowire-enabled power source for driving wireless microelectronics.

    Science.gov (United States)

    Xu, Sheng; Hansen, Benjamin J; Wang, Zhong Lin

    2010-10-19

    Harvesting energy from irregular/random mechanical actions in variable and uncontrollable environments is an effective approach for powering wireless mobile electronics to meet a wide range of applications in our daily life. Piezoelectric nanowires are robust and can be stimulated by tiny physical motions/disturbances over a range of frequencies. Here, we demonstrate the first chemical epitaxial growth of PbZr(x)Ti(1-x)O(3) (PZT) nanowire arrays at 230 °C and their application as high-output energy converters. The nanogenerators fabricated using a single array of PZT nanowires produce a peak output voltage of ~0.7 V, current density of 4 μA cm(-2) and an average power density of 2.8 mW cm(-3). The alternating current output of the nanogenerator is rectified, and the harvested energy is stored and later used to light up a commercial laser diode. This work demonstrates the feasibility of using nanogenerators for powering mobile and even personal microelectronics.

  19. Japanese technology assessment: Computer science, opto- and microelectronics mechatronics, biotechnology

    Energy Technology Data Exchange (ETDEWEB)

    Brandin, D.; Wieder, H.; Spicer, W.; Nevins, J.; Oxender, D.

    1986-01-01

    The series studies Japanese research and development in four high-technology areas - computer science, opto and microelectronics, mechatronics (a term created by the Japanese to describe the union of mechanical and electronic engineering to produce the next generation of machines, robots, and the like), and biotechnology. The evaluations were conducted by panels of U.S. scientists - chosen from academia, government, and industry - actively involved in research in areas of expertise. The studies were prepared for the purpose of aiding the U.S. response to Japan's technological challenge. The main focus of the assessments is on the current status and long-term direction and emphasis of Japanese research and development. Other aspects covered include evolution of the state of the art; identification of Japanese researchers, R and D organizations, and resources; and comparative U.S. efforts. The general time frame of the studies corresponds to future industrial applications and potential commercial impacts spanning approximately the next two decades.

  20. A bistable microelectronic circuit for sensing extremely low electric field

    Science.gov (United States)

    In, Visarath; Longhini, Patrick; Liu, Norman; Kho, Andy; Neff, Joseph D.; Palacios, Antonio; Bulsara, Adi R.

    2010-01-01

    Bistable systems are prevalently found in many sensor systems. Recently, we have explored (unidirectionally) coupled overdamped bistable systems that admit self-sustained oscillations when the coupling parameter is swept through the critical points of bifurcations [V. In et al., Phys. Rev. E 68, 045102-R (2003); A. R. Bulsara et al., Phys. Rev. E 70, 036103 (2004); V. In et al., Phys. Rev. E 72, 045104-R (2005); Phys Rev. Lett. 91, 244101 (2003); A. Palacios et al., Phys. Rev. E 72, 026211 (2005); V. In et al., Phys. Rev. E 73, 066121 (2006)]. Complex behaviors emerge, in addition, from these (relatively simple) coupled systems when an external signal (ac or dc) is applied uniformly to all the elements in the array. In particular, we have demonstrated this emergent behavior for a coupled system comprised of mean-field hysteretic elements describing a "single-domain" ferromagnetic sample. The results are being used to develop extremely sensitive magnetic sensors capable of resolving field changes as low as 150 pT by observing the changes in the oscillation characteristics of the coupled sensors. In this paper, we explore the underlying dynamics of a coupled bistable system realized by coupling microelectronic circuits, which belong to the same class of dynamics as the aforementioned (ferromagnetic) system, with the nonlinear features and coupling terms modeled by hyperbolic tangent nonlinearities; these nonlinearities stem from the operational transconductance amplifiers used in constructing the microcircuits. The emergent behavior is being applied to develop an extremely sensitive electric-field sensor.

  1. Wireless link and microelectronics design for retinal prostheses

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Wentai [Univ. of California, Santa Cruz, CA (United States)

    2012-02-29

    This project focuses on delivering power and data to the artificial retinal implant inside the eye and the implant microstimulator electronics which delivers the current pulses to stimulate the retinal layer to elicit visual perception. Since the use of invasive means such as tethering wires to transmit power and data results in discomfort to the patients which could eventually cause infection due to the abrasion caused by the wire and contact of the internals of the eye to the external environment, a completely wireless approach is used to transfer both power and data. Power is required inside the eye for the microelectronic implant which uses a dual voltage supply scheme (positive and negative) to deliver biphasic (anodic and cathodic) current pulses. Data in the form of digital bits from the data transmitter external to the eye, carries information about the amplitude, phase width, interphase delay, stimulation sequence for each implant electrode. The data receiver unit decodes the digital stream and the microstimulator unit generates the appropriate current stimuli. Since the external unit consisting of the power transmitter can experience coupling a variation with the power receiver due to the patient’s movements, a closed loop approach is used which varies the transmitted power dynamically to automatically compensate for such movements. This report presents the salient features of this research activities and results.

  2. Additively manufactured porous tantalum implants

    NARCIS (Netherlands)

    Wauthle, Ruben; Van Der Stok, Johan; Yavari, Saber Amin; Van Humbeeck, Jan; Kruth, Jean Pierre; Zadpoor, Amir Abbas; Weinans, Harrie; Mulier, Michiel; Schrooten, Jan

    2015-01-01

    The medical device industry's interest in open porous, metallic biomaterials has increased in response to additive manufacturing techniques enabling the production of complex shapes that cannot be produced with conventional techniques. Tantalum is an important metal for medical devices because of it

  3. Micro Manufacturing

    DEFF Research Database (Denmark)

    Hansen, Hans Nørgaard

    2003-01-01

    . If a micro manufacturing system isn’t designed rationally and correctly, it will be high-cost, unreliable, and not robust. For micro products and systems it is a continuously increasing challenge to create the operational basis for an industrial production. As the products through product development...... processes are made applicable to a large number of customers, the pressure in regard to developing production technologies that make it possible to produce the products at a reasonable price and in large numbers is growing. The micro/nano manufacturing programme at the Department of Manufacturing...

  4. Micro Manufacturing

    DEFF Research Database (Denmark)

    Hansen, Hans Nørgaard

    2003-01-01

    Manufacturing deals with systems that include products, processes, materials and production systems. These systems have functional requirements, constraints, design parameters and process variables. They must be decomposed in a systematic manner to achieve the best possible system performance....... If a micro manufacturing system isn’t designed rationally and correctly, it will be high-cost, unreliable, and not robust. For micro products and systems it is a continuously increasing challenge to create the operational basis for an industrial production. As the products through product development...... processes are made applicable to a large number of customers, the pressure in regard to developing production technologies that make it possible to produce the products at a reasonable price and in large numbers is growing. The micro/nano manufacturing programme at the Department of Manufacturing...

  5. Smart Manufacturing.

    Science.gov (United States)

    Davis, Jim; Edgar, Thomas; Graybill, Robert; Korambath, Prakashan; Schott, Brian; Swink, Denise; Wang, Jianwu; Wetzel, Jim

    2015-01-01

    Historic manufacturing enterprises based on vertically optimized companies, practices, market share, and competitiveness are giving way to enterprises that are responsive across an entire value chain to demand dynamic markets and customized product value adds; increased expectations for environmental sustainability, reduced energy usage, and zero incidents; and faster technology and product adoption. Agile innovation and manufacturing combined with radically increased productivity become engines for competitiveness and reinvestment, not simply for decreased cost. A focus on agility, productivity, energy, and environmental sustainability produces opportunities that are far beyond reducing market volatility. Agility directly impacts innovation, time-to-market, and faster, broader exploration of the trade space. These changes, the forces driving them, and new network-based information technologies offering unprecedented insights and analysis are motivating the advent of smart manufacturing and new information technology infrastructure for manufacturing.

  6. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea

    Science.gov (United States)

    Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

    2015-01-01

    Objectives Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Methods Based on claim data from the National Health Insurance (2008–2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Results Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Conclusions Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results. PMID:25938673

  7. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

    Directory of Open Access Journals (Sweden)

    Inah Kim

    Full Text Available Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea.Based on claim data from the National Health Insurance (2008-2012, we estimated age-specific rates of spontaneous abortion (SAB and menstrual aberration (MA among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs were estimated.Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties.Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

  8. Study of thermo-fluidic behavior of micro-droplet in inkjet-based micro manufacturing processes

    Science.gov (United States)

    Das, Raju; Mahapatra, Abhijit; Ball, Amit Kumar; Roy, Shibendu Shekhar; Murmu, Naresh Chandra

    2017-06-01

    Inkjet printing technology, a maskless, non-contact patterning operation, which has been a revelation in the field of micro and nano manufacturing for its use in the selective deposition of desired materials. It is becoming an exciting alternative technology such as lithography to print functional material on to a substrate. Selective deposition of functional materials on desired substrates is a basic requirement in many of the printing based micro and nano manufacturing operations like the fabrication of microelectronic devices, solar cell, Light-emitting Diode (LED) research fields like pharmaceutical industries for drug discovery purposes and in biotechnology to make DNA microarrays. In this paper, an attempt has been made to design and develop an indigenous Electrohydrodynamic Inkjet printing system for micro fabrication and to study the interrelationships between various thermos-fluidic parameters of the ink material in the printing process. The effect of printing process parameters on printing performance characteristics has also been studied. And the applicability of the process has also been experimentally demonstrated. The experimentally found results were quite satisfactory and accordance to its applicability.

  9. Applications of AFM in semiconductor R&D and manufacturing at 45 nm technology node and beyond

    Science.gov (United States)

    Lee, Moon-Keun; Shin, Minjung; Bao, Tianming; Song, Chul-Gi; Dawson, Dean; Ihm, Dong-Chul; Ukraintsev, Vladimir

    2009-03-01

    Continuing demand for high performance microelectronic products propelled integrated circuit technology into 45 nm node and beyond. The shrinking device feature geometry created unprecedented challenges for dimension metrology in semiconductor manufacturing and research and development. Automated atomic force microscope (AFM) has been used to meet the challenge and characterize narrower lines, trenches and holes at 45nm technology node and beyond. AFM is indispensable metrology techniques capable of non-destructive full three-dimensional imaging, surface morphology characterization and accurate critical dimension (CD) measurements. While all available dimensional metrology techniques approach their limits, AFM continues to provide reliable information for development and control of processes in memory, logic, photomask, image sensor and data storage manufacturing. In this paper we review up-todate applications of automated AFM in every mentioned above semiconductor industry sector. To demonstrate benefits of AFM at 45 nm node and beyond we compare capability of automated AFM with established in-line and off-line metrologies like critical dimension scanning electron microscopy (CDSEM), optical scatterometry (OCD) and transmission electronic microscopy (TEM).

  10. Monolithic silicon photonics in a sub-100nm SOI CMOS microprocessor foundry: progress from devices to systems

    Science.gov (United States)

    Popović, Miloš A.; Wade, Mark T.; Orcutt, Jason S.; Shainline, Jeffrey M.; Sun, Chen; Georgas, Michael; Moss, Benjamin; Kumar, Rajesh; Alloatti, Luca; Pavanello, Fabio; Chen, Yu-Hsin; Nammari, Kareem; Notaros, Jelena; Atabaki, Amir; Leu, Jonathan; Stojanović, Vladimir; Ram, Rajeev J.

    2015-02-01

    We review recent progress of an effort led by the Stojanović (UC Berkeley), Ram (MIT) and Popović (CU Boulder) research groups to enable the design of photonic devices, and complete on-chip electro-optic systems and interfaces, directly in standard microelectronics CMOS processes in a microprocessor foundry, with no in-foundry process modifications. This approach allows tight and large-scale monolithic integration of silicon photonics with state-of-the-art (sub-100nm-node) microelectronics, here a 45nm SOI CMOS process. It enables natural scale-up to manufacturing, and rapid advances in device design due to process repeatability. The initial driver application was addressing the processor-to-memory communication energy bottleneck. Device results include 5Gbps modulators based on an interleaved junction that take advantage of the high resolution of the sub-100nm CMOS process. We demonstrate operation at 5fJ/bit with 1.5dB insertion loss and 8dB extinction ratio. We also demonstrate the first infrared detectors in a zero-change CMOS process, using absorption in transistor source/drain SiGe stressors. Subsystems described include the first monolithically integrated electronic-photonic transmitter on chip (modulator+driver) with 20-70fJ/bit wall plug energy/bit (2-3.5Gbps), to our knowledge the lowest transmitter energy demonstrated to date. We also demonstrate native-process infrared receivers at 220fJ/bit (5Gbps). These are encouraging signs for the prospects of monolithic electronics-photonics integration. Beyond processor-to-memory interconnects, our approach to photonics as a "More-than- Moore" technology inside advanced CMOS promises to enable VLSI electronic-photonic chip platforms tailored to a vast array of emerging applications, from optical and acoustic sensing, high-speed signal processing, RF and optical metrology and clocks, through to analog computation and quantum technology.

  11. Experiences with integral microelectronics on smart structures for space

    Science.gov (United States)

    Nye, Ted; Casteel, Scott; Navarro, Sergio A.; Kraml, Bob

    1995-05-01

    One feature of a smart structure implies that some computational and signal processing capability can be performed at a local level, perhaps integral to the controlled structure. This requires electronics with a minimal mechanical influence regarding structural stiffening, heat dissipation, weight, and electrical interface connectivity. The Advanced Controls Technology Experiment II (ACTEX II) space-flight experiments implemented such a local control electronics scheme by utilizing composite smart members with integral processing electronics. These microelectronics, tested to MIL-STD-883B levels, were fabricated with conventional thick film on ceramic multichip module techniques. Kovar housings and aluminum-kapton multilayer insulation was used to protect against harsh space radiation and thermal environments. Development and acceptance testing showed the electronics design was extremely robust, operating in vacuum and at temperature range with minimal gain variations occurring just above room temperatures. Four electronics modules, used for the flight hardware configuration, were connected by a RS-485 2 Mbit per second serial data bus. The data bus was controlled by Actel field programmable gate arrays arranged in a single master, four slave configuration. An Intel 80C196KD microprocessor was chosen as the digital compensator in each controller. It was used to apply a series of selectable biquad filters, implemented via Delta Transforms. Instability in any compensator was expected to appear as large amplitude oscillations in the deployed structure. Thus, over-vibration detection circuitry with automatic output isolation was incorporated into the design. This was not used however, since during experiment integration and test, intentionally induced compensator instabilities resulted in benign mechanical oscillation symptoms. Not too surprisingly, it was determined that instabilities were most detectable by large temperature increases in the electronics, typically

  12. Plan for advanced microelectronics processing technology application. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  13. Corti's organ physiology-based cochlear model: a microelectronic prosthetic implant

    Science.gov (United States)

    Rios, Francisco; Fernandez-Ramos, Raquel; Romero-Sanchez, Jorge; Martin, Jose Francisco

    2003-04-01

    Corti"s Organ is an Electro-Mechanical transducer that allows the energy coupling between acoustical stimuli and auditory nerve. Although the structure and funtionality of this organ are complex, state of the art models have been currently developed and tested. Cochlea model presented in this paper is based on the theories of Bekesy and others and concerns on the behaviour of auditory system on frequency-place domain and mechanisms of lateral inhibition. At the same time, present state of technology will permit us developing a microsystem that reproduce this phenomena applied to hearing aid prosthesis. Corti"s Organ is composed of more than 20.000 cilia excited by mean of travelling waves. These waves produce relative pressures distributed along the cochlea, exciting an specific number of cilia in a local way. Nonlinear mechanisms of local adaptation to the intensity (external cilia cells) and lateral inhibition (internal cilia cells) allow the selection of very few elements excited. These transmit a very precise intensity and frequency information. These signals are the only ones coupled to the auditory nerve. Distribution of pressure waves matches a quasilogaritmic law due to Cochlea morphology. Microsystem presented in this paper takes Bark"s law as an approximation to this behaviour consisting on grouped arbitrary elements composed of a set of selective coupled exciters (bank of filters according to Patterson"s model).These sets apply the intensity adaptation principles and lateral inhibition. Elements excited during the process generate a bioelectric signal in the same way than cilia cell. A microelectronic solution is presented for the development of an implantable prosthesis device.

  14. Electron beam evaporation induced discoloration of reflective film on InGaN/sapphire in III-V LED TFFC device manufacturing

    Science.gov (United States)

    Neelakandan, Sivanantham; Chai, Chun Hoo; Chaw, Kam Hoe; Sae Tae, Veera

    2015-07-01

    In this paper, the discoloration of indium-gallium-nitride (InGaN) on sapphire (Al2O3) substrate after processing in electron beam vacuum evaporation for mirror metal evaporation has been investigated. Discoloration can be detrimental to light output of a light emitting diode (LED) as the light extraction through discolored gallium nitride (GaN) epitaxy is impacted. The investigation shows that the discoloration caused by an interaction between few factors such as the level of organic contamination present at the edges of the substrate, contact area with holding dome of the evaporator, thickness of the film deposited and radiation intensity from the evaporation source. Reflection Spectroscopy was used to quantify reflectivity of discolored mirror metal while X-ray fluorescence spectrometry (XRF) was used to measure film thickness and time of flight - secondary ion mass spectrometry (TOF-SIMS) was employed to measure organic contamination amounts. A residual gas analyzing (RGA) technique was established to detect potential discoloration to eliminate disruptions to manufacturing.

  15. Microelectronics and nanotechnology, and the fractal-like structure of information, knowledge, and science

    Science.gov (United States)

    Nutu, Catalin Silviu; Axinte, Tiberiu

    2016-12-01

    The article is centralizing and is concentrating the information from a considerable amount of papers related to the field of microelectronics and nanotechnology and also provides an approach to science and to the future evolution of science, based on the theory of the fractals. The new science of microelectronics and nanotechnology is one of the best examples of how the science of future will look like, namely at the confluence of increasingly more other sciences, where increasingly more sciences are to be added in the structure of the new science and the role of the multidisciplinary and interdisciplinary is becoming more and more important. Although not giving explicit details (e.g. specific formulas) the theory of fractals is used in the paper to explain the way of generation of new science for the specific case of microelectronics and nanotechnology, but is also used in the paper to outline a different way to approach new science and eventually to approach new sciences to come. There are mainly two motivations for the present article, namely: on the one hand, the position of the microelectronics and nanotechnologies in the fractal-like structure of science, and, on the other hand, that much of the communication, information, knowledge and science transfer, dissemination and advancement in sciences are taking place using the new technologies related to microelectronics and nanotechnologies.

  16. The Influence of Temperature on Microelectronic Device Failure Mechanisms. Phase 2

    Science.gov (United States)

    1993-09-04

    Si w = 3 0.5-2.5 162-215"C 0.38 1.33 [Scism - 400 19851 w - 3 3.3 200-C - [ Maiz 19891 1- 1000 w = 3.7-4.1 0.8-3 277°C 1.67- 0.5 ISuehle I - 400 2.36...stress in the middle of the die; p is the peeling stress at the die-attachment interface; I is the shear stress at the die-attachment interface; 01...properties of the brittle attachment material; U 206 DERATING OUIDEUNES p is the cyclic peeling stress determined in Equation 5.113; F is the geometric

  17. Safe inductive power transmission to millimeter-sized implantable microelectronics devices.

    Science.gov (United States)

    Ibrahim, Ahmed; Kiani, Mehdi

    2015-08-01

    Power transfer efficiency (PTE) and power delivered to the load (PDL) are key inductive link design parameters for powering millimeter-sized implants. While several groups have suggested increasing the power carrier frequency (fp) of inductive links to 100s of MHz to maximize PTE, we have demonstrated that operating at 10s of MHz offers higher allowable PDL under the safety absorption rate (SAR) constraints. We have proposed a closed-form power function that relates maximum power levels that can safely be transferred at different frequencies under the SAR constraints. Three sets of inductive links at different frequencies of 50 MHz, 200 MHz, and 400 MHz have been optimized for powering a 1 mm(3)-sized implant. We have shown in simulations that reducing fp from 200 MHz to 50 MHz along with shrinking the size of the transmitter coil results in ~7.8 times higher PDL under SAR constraints, at the cost of only 52% drop in PTE.

  18. Surface-controlled contact printing for nanowire device fabrication on a large scale

    Science.gov (United States)

    Roßkopf, D.; Strehle, S.

    2016-05-01

    Assembly strategies for functional nanowire devices that merge bottom-up and top-down technologies have been debated for over a decade. Although several breakthroughs have been reported, nanowire device fabrication techniques remain generally incompatible with large-scale and high-yield top-down microelectronics manufacturing. Strategies enabling the controlled transfer of nanowires from the growth substrate to pre-defined locations on a target surface would help to address this challenge. Based on the promising concept of mechanical nanowire transfer, we developed the technique of surface-controlled contact printing, which is based purely on dry friction between a nanowire and a target surface. Surface features, so-called catchers, alter the local frictional force or deposition probability and allow the positioning of single nanowires. Surface-controlled contact printing extends the current scope of nanowire alignment strategies with the intention to facilitate efficient nanowire device fabrication. This is demonstrated by the simultaneous assembly of 36 nanowire resistors within a chip area of greater than 2 cm2 aided only by mask-assisted photolithography.

  19. Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach

    CERN Document Server

    Laurila, Tomi; Paulasto-Kröckel, Mervi; Turunen, Markus; Mattila, Toni T; Kivilahti, Jorma

    2012-01-01

    Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep un...

  20. Creep of Two-Phase Microstructures for Microelectronic Applications

    Energy Technology Data Exchange (ETDEWEB)

    Reynolds, Heidi Linch [Univ. of California, Berkeley, CA (United States)

    1998-12-01

    The mechanical properties of low-melting temperature alloys are highly influenced by their creep behavior. This study investigates the dominant mechanisms that control creep behavior of two-phase, low-melting temperature alloys as a function of microstructure. The alloy systems selected for study were In-Ag and Sn-Bi because their eutectic compositions represent distinctly different microstructure.” The In-Ag eutectic contains a discontinuous phase while the Sn-Bi eutectic consists of two continuous phases. In addition, this work generates useful engineering data on Pb-free alloys with a joint specimen geometry that simulates microstructure found in microelectronic applications. The use of joint test specimens allows for observations regarding the practical attainability of superplastic microstructure in real solder joints by varying the cooling rate. Steady-state creep properties of In-Ag eutectic, Sn-Bi eutectic, Sn-xBi solid-solution and pure Bi joints have been measured using constant load tests at temperatures ranging from O°C to 90°C. Constitutive equations are derived to describe the steady-state creep behavior for In-Ageutectic solder joints and Sn-xBi solid-solution joints. The data are well represented by an equation of the form proposed by Dom: a power-law equation applies to each independent creep mechanism. Rate-controlling creep mechanisms, as a function of applied shear stress, test temperature, and joint microstructure, are discussed. Literature data on the steady-state creep properties of Sn-Bi eutectic are reviewed and compared with the Sn-xBi solid-solution and pure Bi joint data measured in the current study. The role of constituent phases in controlling eutectic creep behavior is discussed for both alloy systems. In general, for continuous, two-phase microstructure, where each phase exhibits significantly different creep behavior, the harder or more creep resistant phase will dominate the creep behavior in a lamellar microstructure. If a

  1. Physical models of semiconductor quantum devices

    CERN Document Server

    Fu, Ying

    2013-01-01

    The science and technology relating to nanostructures continues to receive significant attention for its applications to various fields including microelectronics, nanophotonics, and biotechnology. This book describes the basic quantum mechanical principles underlining this fast developing field. From the fundamental principles of quantum mechanics to nanomaterial properties, from device physics to research and development of new systems, this title is aimed at undergraduates, graduates, postgraduates, and researchers.

  2. Ex-situ manufacturing of SiC-doped MgB2 used for superconducting wire in medical device applications

    Science.gov (United States)

    Herbirowo, Satrio; Imaduddin, Agung; Sofyan, Nofrijon; Yuwono, Akhmad Herman

    2017-02-01

    Magnesium diboride (MgB2) is a superconductor material with a relatively high critical temperature. Due to its relatively high critical temperature, this material is promising and has the potential to replace Nb3Sn for wire superconducting used in many medical devices. In this work, nanoparticle SiC-doped MgB2 superconducting material has been fabricated through an ex-situ method. The doping of nanoparticle SiC by 10 and 15 wt% was conducted to analyze its effect on specific resistivity of MgB2. The experiment was started by weighing a stoichiometric amount of MgB2 and nanoparticles SiC. Both materials were mixed and grounded for 30 minutes by using an agate mortar. The specimens were then pressed into a 6 mm diameter stainless steel tube, which was then reduced until 3 mm through a wire drawing method. X-ray diffraction analysis was conducted to confirm the phase, whereas the superconductivity of the specimens was analyzed by using resistivity measurement under cryogenic magnetic system. The results indicated that the commercial MgB2 showed a critical temperature of 37.5 K whereas the SiC doped MgB2 has critical temperature of 38.3 K.

  3. Materials science in microelectronics I the relationships between thin film processing and structure

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship - that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer - determines the ultimate structure of the thin film, and thus its properties. This

  4. A progress report on the LDRD project entitled {open_quotes}Microelectronic silicon-based chemical sensors: Ultradetection of high value molecules{close_quotes}

    Energy Technology Data Exchange (ETDEWEB)

    Hughes, R.C.

    1996-09-01

    This work addresses a new kind of silicon based chemical sensor that combines the reliability and stability of silicon microelectronic field effect devices with the highly selective and sensitive immunoassay. The sensor works on the principle that thin SiN layers on lightly doped Si can detect pH changes rapidly and reversibly. The pH changes affect the surface potential, and that can be quickly determined by pulsed photovoltage measurements. To detect other species, chemically sensitive films were deposited on the SiN where the presence of the chosen analyte results in pH changes through chemical reactions. A invention of a cell sorting device based on these principles is also described. A new method of immobilizing enzymes using Sandia`s sol-gel glasses is documented and biosensors based on the silicon wafer and an amperometric technique are detailed.

  5. Manufacturing technology

    Energy Technology Data Exchange (ETDEWEB)

    Leonard, J.A.; Floyd, H.L.; Goetsch, B.; Doran, L. [eds.

    1993-08-01

    This bulletin depicts current research on manufacturing technology at Sandia laboratories. An automated, adaptive process removes grit overspray from jet engine turbine blades. Advanced electronic ceramics are chemically prepared from solution for use in high- voltage varistors. Selective laser sintering automates wax casting pattern fabrication. Numerical modeling improves performance of photoresist stripper (simulation on Cray supercomputer reveals path to uniform plasma). And mathematical models help make dream of low- cost ceramic composites come true.

  6. Green Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Patten, John

    2013-12-31

    Green Manufacturing Initiative (GMI): The initiative provides a conduit between the university and industry to facilitate cooperative research programs of mutual interest to support green (sustainable) goals and efforts. In addition to the operational savings that greener practices can bring, emerging market demands and governmental regulations are making the move to sustainable manufacturing a necessity for success. The funding supports collaborative activities among universities such as the University of Michigan, Michigan State University and Purdue University and among 40 companies to enhance economic and workforce development and provide the potential of technology transfer. WMU participants in the GMI activities included 20 faculty, over 25 students and many staff from across the College of Engineering and Applied Sciences; the College of Arts and Sciences' departments of Chemistry, Physics, Biology and Geology; the College of Business; the Environmental Research Institute; and the Environmental Studies Program. Many outside organizations also contribute to the GMI's success, including Southwest Michigan First; The Right Place of Grand Rapids, MI; Michigan Department of Environmental Quality; the Michigan Department of Energy, Labor and Economic Growth; and the Michigan Manufacturers Technical Center.

  7. FUNDAMENTALS OF STRUCTURAL TYPOLOGY DEVICE DESIGN WITH A GAS BEARING LAYER

    Directory of Open Access Journals (Sweden)

    I. A. Аvtsinоv

    2015-01-01

    Full Text Available We describe the typical stages of a structural typology of devices allowing them to design quality in the automatic mode on the known parameters of products (parts and the required processing operations with them. In the first stage classification it was organized as a piece of specific products and devices for the manipulation of the latter. Specifics items described their physical – mechanical properties, geometry and their application. The most frequently described specific products are used in pharmaceutical, perfume, food, microelectronics, electrical engineering, electronics. The main elements of the proposed device is a carrier working surface over which a thin layer of gas is created. Depending on the position (horizontal or vertical of the form of its movement (rotation, rotational – translational or is stationary, and the configuration of the carrier operating the surface implement various manufacturing operations (targeting, positioning, shaping, classification, transport, heat treatment, weight control, assembly, culling, and others. The second stage was to mathematically describe the relationship of the specificity of piece goods, with design features of devices supporting the work surface and sold them operations. For this purpose, the device has been used in discrete mathematics, with which you can produce a description of all types of devices, and then make a conclusion such as the work surface meets the specified requirements. The apparent advantage of using predicate logic to this problem is fairly simple implementation of the algorithm of structural typology, which can be expressed using a declarative programming language. In the third phase, work is underway to create the necessary algorithmic language program "Prolog" and presented the structure of the imperative and declarative implementation of the algorithm.

  8. Microelectronic Information Processing Systems: Computing Systems. Summary of Awards Fiscal Year 1994.

    Science.gov (United States)

    National Science Foundation, Arlington, VA. Directorate for Computer and Information Science and Engineering.

    The purpose of this summary of awards is to provide the scientific and engineering communities with a summary of the grants awarded in 1994 by the National Science Foundation's Division of Microelectronic Information Processing Systems. Similar areas of research are grouped together. Grantee institutions and principal investigators are identified…

  9. Testable design and testing of high-speed superconductor microelectronics

    NARCIS (Netherlands)

    Kerkhoff, Hans G.; Joseph, Arun A.; Heuvelmans, Sander

    2004-01-01

    True software-defined radio cellular base stations require extremely fast data converters, which can not currently be implemented in semiconductor technology. Superconductor niobium-based delta ADCs have shown to be able to perform this task. The problem of testing these devices is a severe task, as

  10. Beam lead microelectronics. Citations from the NTIS data base

    Science.gov (United States)

    Reed, W. E.

    1980-04-01

    The technology and application of beam lead devices are treated in these Federally-sponsored research reports. Topics include design, fabrication, bonding, packaging, testing, and radiation hardening. This updated bibliography contains 85 abstracts, 4 of which are new entries to the previous edition.

  11. LEAN Manufacturing

    DEFF Research Database (Denmark)

    Bilberg, Arne

      As part of an employment as Technology Architect at the company Linak in combination with research at the University of Southern Denmark, this paper will present results from a strategy process where Lean has been pointed out as being a very strategic element in the Linak Production System....... The mission with the strategy is to obtain competitive production in Denmark and in Western Europe based on the right combination of manufacturing principles, motivated and trained employees, level of automation, and cooperation with suppliers and customers worldwide. The strategy has resulted in technical......, organizational and management improvements in the company to what is named the Linak Production System.  ...

  12. LEAN Manufacturing

    DEFF Research Database (Denmark)

    Bilberg, Arne

      As part of an employment as Technology Architect at the company Linak in combination with research at the University of Southern Denmark, this paper will present results from a strategy process where Lean has been pointed out as being a very strategic element in the Linak Production System....... The mission with the strategy is to obtain competitive production in Denmark and in Western Europe based on the right combination of manufacturing principles, motivated and trained employees, level of automation, and cooperation with suppliers and customers worldwide. The strategy has resulted in technical...

  13. The role of nanotechnology and nano and micro-electronics in monitoring and control of cardiovascular diseases and neurological disorders

    Science.gov (United States)

    Varadan, Vijay K.

    2007-04-01

    Nanotechnology has been broadly defined as the one for not only the creation of functional materials and devices as well as systems through control of matter at the scale of 1-100 nm, but also the exploitation of novel properties and phenomena at the same scale. Growing needs in the point-of-care (POC) that is an increasing market for improving patient's quality of life, are driving the development of nanotechnologies for diagnosis and treatment of various life threatening diseases. This paper addresses the recent development of nanodiagnostic sensors and nanotherapeutic devices with functionalized carbon nanotube and/or nanowire on a flexible organic thin film electronics to monitor and control of the three leading diseases namely 1) neurodegenerative diseases, 2) cardiovascular diseases, and 3) diabetes and metabolic diseases. The sensors developed include implantable and biocompatible devices, light weight wearable devices in wrist-watches, hats, shoes and clothes. The nanotherapeutics devices include nanobased drug delivery system. Many of these sensors are integrated with the wireless systems for the remote physiological monitoring. The author's research team has also developed a wireless neural probe using nanowires and nanotubes for monitoring and control of Parkinson's disease. Light weight and compact EEG, EOG and EMG monitoring system in a hat developed is capable of monitoring real time epileptic patients and patients with neurological and movement disorders using the Internet and cellular network. Physicians could be able to monitor these signals in realtime using portable computers or cell phones and will give early warning signal if these signals cross a pre-determined threshold level. In addition the potential impact of nanotechnology for applications in medicine is that, the devices can be designed to interact with cells and tissues at the molecular level, which allows high degree of functionality. Devices engineered at nanometer scale imply a

  14. 76 FR 36472 - Mandatory Reporting of Greenhouse Gases; Changes to Provisions for Electronics Manufacturing...

    Science.gov (United States)

    2011-06-22

    ... Electronics Manufacturing (Subpart I) To Provide Flexibility AGENCY: Environmental Protection Agency (EPA... the Electronics Manufacturing portion (Subpart I) of the Mandatory Greenhouse Gas Reporting Rule for the ``largest'' semiconductor manufacturing facilities (i.e., those that fabricate devices on...

  15. Design, processing and testing of LSI arrays: Hybrid microelectronics task

    Science.gov (United States)

    Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.

    1979-01-01

    Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

  16. Medical devices: US medical device regulation.

    Science.gov (United States)

    Jarow, Jonathan P; Baxley, John H

    2015-03-01

    Medical devices are regulated by the US Food and Drug Administration (FDA) within the Center for Devices and Radiological Health. Center for Devices and Radiological Health is responsible for protecting and promoting the public health by ensuring the safety, effectiveness, and quality of medical devices, ensuring the safety of radiation-emitting products, fostering innovation, and providing the public with accurate, science-based information about the products we oversee, throughout the total product life cycle. The FDA was granted the authority to regulate the manufacturing and marketing of medical devices in 1976. It does not regulate the practice of medicine. Devices are classified based on complexity and level of risk, and "pre-1976" devices were allowed to remain on the market after being classified without FDA review. Post-1976 devices of lower complexity and risk that are substantially equivalent to a marketed "predicate" device may be cleared through the 510(k) premarket notification process. Clinical data are typically not needed for 510(k) clearance. In contrast, higher-risk devices typically require premarket approval. Premarket approval applications must contain data demonstrating reasonable assurance of safety and efficacy, and this information typically includes clinical data. For novel devices that are not high risk, the de novo process allows FDA to simultaneously review and classify new devices. Devices that are not legally marketed are permitted to be used for clinical investigation purposes in the United States under the Investigational Device Exemptions regulation.

  17. III-Nitride advanced technologies and equipment for microelectronics

    Science.gov (United States)

    Petrov, S. I.; Alexeev, A. N.; Mamaev, V. V.; Krasovitsky, D. M.; Chaly, V. P.

    2016-12-01

    Using of complex equipment SemiTEq shown in example of a closed cycle of basic technological operations for production of high-power field microwave transistors based on gallium nitride in the "Svetlana-Rost" JSC. Basic technological operations are shown: MBE growth of heterostructures, metal deposition of contacts using electron-beam evaporation system, thermal annealing of ohmic contacts, meza-isolation plasma-chemical etching and dielectric plasma deposition. The main problems during the technological route as well as ways to solve are discussed. In particular, ways to reduce the dislocation density in the active region of the transistor heterostructures grown on the mismatched substrates are described in detail. Special attention given to the homogeneity and reproducibility both after some manufacturing operations and applied to the end product.

  18. Fabrication of nanocrystallites in the SiOx matrix applicable in microelectronics

    Science.gov (United States)

    Kolodziej, Tomasz

    2013-07-01

    The development of the technology of fabricating hydrogenated amorphous silicon (a-Si:H) or silicon oxide (SiOx) matrix with nanocrystalline inclusions (nc-Si:H) is the next step in improving the properties of electronic devices, such as solar cells, thin film transistors (TFT), floating gate transistors and others. Those films exhibit increased stability, absorption and carrier mobility. This paper is focused on the technology of manufacturing such films by means of Radio Frequency Plasma Enhanced Chemical Vapor Deposition (RF PECVD), which is use to fabricate electronic devices. The technology was developed in the Semiconductor Thin Films and Solar Cells Laboratory at the Department of Electronics at the AGH University of Science and Technology. The author describes the manufacturing process based on periodical variation of the process parameters, such as hydrogen to silane ratio (Rh), gas flows, RF power and pressure in the process chamber, during the deposition process. The author also presents the results of the measurements of typical samples with High Resolution Transmission Electron Microscopy (HRTEM), which confirms the existence of the nanocrystallites in the a-Si:H/SiOx matrix.

  19. Silicon photonics manufacturing.

    Science.gov (United States)

    Zortman, William A; Trotter, Douglas C; Watts, Michael R

    2010-11-08

    Most demonstrations in silicon photonics are done with single devices that are targeted for use in future systems. One of the costs of operating multiple devices concurrently on a chip in a system application is the power needed to properly space resonant device frequencies on a system's frequency grid. We asses this power requirement by quantifying the source and impact of process induced resonant frequency variation for microdisk resonators across individual die, entire wafers and wafer lots for separate process runs. Additionally we introduce a new technique, utilizing the Transverse Electric (TE) and Transverse Magnetic (TM) modes in microdisks, to extract thickness and width variations across wafers and dice. Through our analysis we find that a standard six inch Silicon on Insulator (SOI) 0.35 μm process controls microdisk resonant frequencies for the TE fundamental resonances to within 1 THz across a wafer and 105 GHz within a single die. Based on demonstrated thermal tuner technology, a stable manufacturing process exhibiting this level of variation can limit the resonance trimming power per resonant device to 231 μW. Taken in conjunction with the power to compensate for thermal environmental variations, the expected power requirement to compensate for fabrication-induced non-uniformities is 17% of that total. This leads to the prediction that thermal tuning efficiency is likely to have the most dominant impact on the overall power budget of silicon photonics resonator technology.

  20. Method of manufacturing a display device

    NARCIS (Netherlands)

    Lifka, H.; Roozeboom, F.; Elfrink, R.J.; Johnson, M.T.

    2004-01-01

    ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the

  1. Additive Manufacturing of Hybrid Circuits

    Science.gov (United States)

    Sarobol, Pylin; Cook, Adam; Clem, Paul G.; Keicher, David; Hirschfeld, Deidre; Hall, Aaron C.; Bell, Nelson S.

    2016-07-01

    There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

  2. Microelectronics technologies for new detectors in medical imaging

    CERN Document Server

    Heijne, Erik H M

    2007-01-01

    The use of silicon chips for instrumentation developments in elementary particle physics serves as an example for other applications and digital imaging detectors could find use in medical and molecular imaging. Attractive features are direct quantum conversion in a semiconductor matrix, innovative three-dimensional modular detector construction, multilayer devices, very fast signal processing, on-line data pre-processing and massive parallelism at the system level. Cost aspects of such semiconductor imager options have to be taken into account in the R&D phase. With the integrated electronics and high density interconnects in the Medipix development as an example, the ultimate aim of single photon imaging comes within reach.

  3. Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias.

    Science.gov (United States)

    He, Fei; Yu, Junjie; Tan, Yuanxin; Chu, Wei; Zhou, Changhe; Cheng, Ya; Sugioka, Koji

    2017-01-18

    Three-dimensional integrated circuits (3D ICs) are an attractive replacement for conventional 2D ICs as high-performance, low-power-consumption, and small-footprint microelectronic devices. However, one of the major remaining challenges is the manufacture of high-aspect-ratio through-silicon vias (TSVs), which is a crucial technology for the assembly of 3D Si ICs. Here, we present the fabrication of high-quality TSVs using a femtosecond (fs) 1.5-μm Bessel beam. To eliminate the severe ablation caused by the sidelobes of a conventional Bessel beam, a fs Bessel beam is tailored using a specially designed binary phase plate. We demonstrate that the tailored fs Bessel beam can be used to fabricate a 2D array of approximately ∅10-μm TSVs on a 100-μm-thick Si substrate without any sidelobe damage, suggesting potential application in the 3D assembly of 3D Si ICs.

  4. Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

    Science.gov (United States)

    He, Fei; Yu, Junjie; Tan, Yuanxin; Chu, Wei; Zhou, Changhe; Cheng, Ya; Sugioka, Koji

    2017-01-01

    Three-dimensional integrated circuits (3D ICs) are an attractive replacement for conventional 2D ICs as high-performance, low-power-consumption, and small-footprint microelectronic devices. However, one of the major remaining challenges is the manufacture of high-aspect-ratio through-silicon vias (TSVs), which is a crucial technology for the assembly of 3D Si ICs. Here, we present the fabrication of high-quality TSVs using a femtosecond (fs) 1.5-μm Bessel beam. To eliminate the severe ablation caused by the sidelobes of a conventional Bessel beam, a fs Bessel beam is tailored using a specially designed binary phase plate. We demonstrate that the tailored fs Bessel beam can be used to fabricate a 2D array of approximately ∅10-μm TSVs on a 100-μm-thick Si substrate without any sidelobe damage, suggesting potential application in the 3D assembly of 3D Si ICs. PMID:28098250

  5. Nanoscale Electronic Devices

    Science.gov (United States)

    Jing, Xiaoye

    Continuous downscaling in microelectronics has pushed conventional CMOS technology to its physical limits, while Moore's Law has correctly predicted the trend for decades, each step forward is accompanied with unprecedented technological difficulties and near-exponential increase in cost. At the same time, however, demands for low-power, low-cost and high-speed devices have never diminished, instead, even more stringent requirements have been imposed on device performances. It is therefore crucial to explore alternative materials and device architectures in order to alleviate the pressure caused by downscaling. To this end, we investigated two different approaches: (1) InSb nanowire based field effect transistors (NWFETs) and (2) single walled carbon nanotube (SWCNT) -- peptide nucleic acid (PNA) --SWCNT conjugate. Two types of InSb nanowires were synthesized by template-assisted electrochemistry and chemical vapor deposition (CVD) respectively. In both cases, NWFETs were fabricated by electron beam lithography (EBL) and crystallinity was confirmed by transmission electron microscopy (TEM) and selected area diffraction (SAD) patterns. For electrochemistry nanowire, ambipolar conduction was observed with strong p-type conduction, the effect of thermal annealing on the conductivity was analyzed, a NWFET model that took into consideration the underlapped region in top-gated NWFET was proposed. Hole mobility in the channel was calculated to be 292.84 cm2V-1s -1 with a density of 1.5x1017/cm3. For CVD nanowire, the diameter was below 40nm with an average of 20nm. Vapor-liquid-solid (VLS) process was speculated to be the mechanism responsible for nanowire growth. The efficient gate control was manifested by high ION/I OFF ratio which was on the order of 106 and a small inverse subthreshold slope (<200 mV/decade). Scale analysis was used to successfully account for disparities observed among a number of sample devices. N-type conduction was found in all NWFETs with

  6. Vacuum Mechatronics And Insvection For Self-Contained Manufacturing

    Science.gov (United States)

    Belinski, Steve E.; Shirazi, Majid; Seidel, Thomas E.; Hackwood, Susan

    1990-02-01

    The vacuum environment is increasingly being used in manufacturing operations, especially in the semiconductor industry. Shrinking linewidths and feature sizes dictate that cleanliness standards become continually more strict. Studies at the Center for Robotic Systems in Microelectronics (CRSM) indicate that a controlled vacuum enclosure can provide a superior clean environment. In addition, since many microelectronic fabrication steps are already carried out under vacuum, self-contained multichamber processing systems are being developed at a rapid pace. CRSM support of these systems includes the development of a research system, the Self-contained Automated Robotic Factory (SCARF), a vacuum-compatible robot, and investigations of particulate characterization in vacuum and inspection for multichamber systems. Successful development of complex and expensive multichamber systems is, to a great extent, dependent upon the discipline called vacuum mechatronics, which includes the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. Here the constituents of the vacuum mechatronics discipline are defined and reviewed in the context of the importance to self-contained in-vacuum manufacturing.

  7. SEMICONDUCTOR INTEGRATED CIRCUITS: A four-channel microelectronic system for neural signal regeneration

    Science.gov (United States)

    Shushan, Xie; Zhigong, Wang; Xiaoying, Lü; Wenyuan, Li; Haixian, Pan

    2009-12-01

    This paper presents a microelectronic system which is capable of making a signal record and functional electric stimulation of an injured spinal cord. As a requirement of implantable engineering for the regeneration microelectronic system, the system is of low noise, low power, small size and high performance. A front-end circuit and two high performance OPAs (operational amplifiers) have been designed for the system with different functions, and the two OPAs are a low-noise low-power two-stage OPA and a constant-gm RTR input and output OPA. The system has been realized in CSMC 0.5-μm CMOS technology. The test results show that the system satisfies the demands of neuron signal regeneration.

  8. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-05-19

    Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

  9. Model of control of glow discharge electron gun current for microelectronics production applications

    Science.gov (United States)

    Denbnovetsky, S. V.; Melnyk, V. I.; Melnyk, I. V.; Tugay, B. A.

    2003-04-01

    The problems of simulation of discharge current control and its gas-dynamic stabilization for technological glow discharge electron guns with a cold cathode are considered in a paper. Such guns are successfully operated in soft vacuum and can be used in modern microelectronic technologies for providing of thermal operations with using different technological gases including active ones. The results of theoretical and experimental investigation of automatic control system of current of electron gun which were used for deposition of coatings in reactive gas medium are presented in article. Time of regulation for considered system did not exceed 400 ms. Is proved, that the automatic control of a current of a glow discharge electron gun by pressure variation its volume is effective on all operation range of pressure, and the minimum time of a current regulation can be tens -- hundred of ms, and this fact is allow to use in the majority of technological operations for microelectronic production.

  10. Energy minimization-based analysis of electrowetting for microelectronics cooling applications

    OpenAIRE

    Bahadur, Vaibhav; Garimella, S V

    2008-01-01

    Electrowetting (EW)-induced droplet motion has been studied over the last decade in view of its promising applications in the field of microfluidics. The objective of the present work is to analyze the physics underlying two specific EW-based applications for microelectronics thermal management. The first of these involves heat absorption by liquid droplets moving on the surface of a chip under EW actuation. Droplet motion between two flat plates under the influence of an electrowetting volta...

  11. Synthesis of the System Modeling and Signal Detecting Circuit of a Novel Vacuum Microelectronic Accelerometer

    Directory of Open Access Journals (Sweden)

    Zhengguo Shang

    2009-05-01

    Full Text Available A novel high-precision vacuum microelectronic accelerometer has been successfully fabricated and tested in our laboratory. This accelerometer has unique advantages of high sensitivity, fast response, and anti-radiation stability. It is a prototype intended for navigation applications and is required to feature micro-g resolution. This paper briefly describes the structure and working principle of our vacuum microelectronic accelerometer, and the mathematical model is also established. The performances of the accelerometer system are discussed after Matlab modeling. The results show that, the dynamic response of the accelerometer system is significantly improved by choosing appropriate parameters of signal detecting circuit, and the signal detecting circuit is designed. In order to attain good linearity and performance, the closed-loop control mode is adopted. Weak current detection technology is studied, and integral T-style feedback network is used in I/V conversion, which will eliminate high-frequency noise at the front of the circuit. According to the modeling parameters, the low-pass filter is designed. This circuit is simple, reliable, and has high precision. Experiments are done and the results show that the vacuum microelectronic accelerometer exhibits good linearity over -1 g to +1 g, an output sensitivity of 543 mV/g, and a nonlinearity of 0.94 %.

  12. Additive manufacturing – a sustainable manufacturing route

    Directory of Open Access Journals (Sweden)

    Frăţilă Domniţa

    2017-01-01

    Full Text Available Additive Manufacturing (AM technologies allow developing and manufacturing very complex shaped parts and functional products with a high level of customization, being a great alternative to Traditional Manufacturing (TM methods like injection molding, die-casting or machining. Due to the importance of cleaner production in the field of manufacturing processes, sustainability of AM processes needs to be assessed in order to make easier its acceptance and implementation in the industry. Furthermore, the manufacturers can improve their competitiveness and profitability by considering the ecological aspects during the manufacturing step of a product. This paper gives a survey on sustainability issues related to AM.

  13. Medical devices and patient safety.

    Science.gov (United States)

    Mattox, Elizabeth

    2012-08-01

    Errors related to health care devices are not well understood. Nurses in intensive care and progressive care environments can benefit from understanding manufacturer-related error and device-use error, the principles of human factors engineering, and the steps that can be taken to reduce risk of errors related to health care devices.

  14. Probing a Device's Active Atoms.

    Science.gov (United States)

    Studniarek, Michał; Halisdemir, Ufuk; Schleicher, Filip; Taudul, Beata; Urbain, Etienne; Boukari, Samy; Hervé, Marie; Lambert, Charles-Henri; Hamadeh, Abbass; Petit-Watelot, Sebastien; Zill, Olivia; Lacour, Daniel; Joly, Loïc; Scheurer, Fabrice; Schmerber, Guy; Da Costa, Victor; Dixit, Anant; Guitard, Pierre André; Acosta, Manuel; Leduc, Florian; Choueikani, Fadi; Otero, Edwige; Wulfhekel, Wulf; Montaigne, François; Monteblanco, Elmer Nahuel; Arabski, Jacek; Ohresser, Philippe; Beaurepaire, Eric; Weber, Wolfgang; Alouani, Mébarek; Hehn, Michel; Bowen, Martin

    2017-05-01

    Materials science and device studies have, when implemented jointly as "operando" studies, better revealed the causal link between the properties of the device's materials and its operation, with applications ranging from gas sensing to information and energy technologies. Here, as a further step that maximizes this causal link, the paper focuses on the electronic properties of those atoms that drive a device's operation by using it to read out the materials property. It is demonstrated how this method can reveal insight into the operation of a macroscale, industrial-grade microelectronic device on the atomic level. A magnetic tunnel junction's (MTJ's) current, which involves charge transport across different atomic species and interfaces, is measured while these atoms absorb soft X-rays with synchrotron-grade brilliance. X-ray absorption is found to affect magnetotransport when the photon energy and linear polarization are tuned to excite FeO bonds parallel to the MTJ's interfaces. This explicit link between the device's spintronic performance and these FeO bonds, although predicted, challenges conventional wisdom on their detrimental spintronic impact. The technique opens interdisciplinary possibilities to directly probe the role of different atomic species on device operation, and shall considerably simplify the materials science iterations within device research. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  15. Multi-scale radiographic applications in microelectronic industry

    Science.gov (United States)

    Gluch, J.; Löffler, M.; Meyendorf, N.; Oppermann, M.; Röllig, M.; Sättler, P.; Wolter, K. J.; Zschech, E.

    2016-02-01

    New concepts in assembly technology boost our daily life in an unknown way. High end semiconductor industry today deals with functional structures down to a few nanometers. ITRS roadmap predicts an ongoing decrease of the "DRAM half pitch" over the next decade. Packaging of course is not intended to realize pitches at the nanometer scale, but has to face the challenges of integrating such semiconductor devices with smallest pitch and high pin counts into systems. System integration (SiP, SoP, Hetero System Integration etc.) into the third dimension is the only way to reduce the gap between semiconductor level and packaging level interconnection. The described development is mainly driven by communication technology but also other branches like power electronics benefit from the vast progress in integration and assembly technology. The challenge of advanced packaging requires new nondestructive evaluation (NDE) techniques for technology development and production control. In power electronics production the condition monitoring receives a lot of interest to avoid electrical shortcuts, dead solder joints and interface cracking. It is also desired to detect and characterize very small defects like transportation phenomenon or Kirkendall voids. For this purpose imaging technologies with resolutions in the sub-micron range are required. Our presentation discusses the potentials and the limits of X-ray NDE techniques, illustrated by crack observation in solder joints, evaluation of micro vias in PCBs and interposers and the investigation of solder material composition and other aftermaths of electro migration in solder joints. Applied radiographic methods are X-ray through transmission, multi-energy techniques, laminography, CT and nano-CT.

  16. Assessment of microelectronics packaging for high temperature, high reliability applications

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, F.

    1997-04-01

    This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.

  17. Additive manufacturing – a sustainable manufacturing route

    OpenAIRE

    Frăţilă Domniţa; Rotaru Horaţiu

    2017-01-01

    Additive Manufacturing (AM) technologies allow developing and manufacturing very complex shaped parts and functional products with a high level of customization, being a great alternative to Traditional Manufacturing (TM) methods like injection molding, die-casting or machining. Due to the importance of cleaner production in the field of manufacturing processes, sustainability of AM processes needs to be assessed in order to make easier its acceptance and implementation in the industry. Furth...

  18. Additive manufacturing – a sustainable manufacturing route

    OpenAIRE

    Frăţilă Domniţa; Rotaru Horaţiu

    2017-01-01

    Additive Manufacturing (AM) technologies allow developing and manufacturing very complex shaped parts and functional products with a high level of customization, being a great alternative to Traditional Manufacturing (TM) methods like injection molding, die-casting or machining. Due to the importance of cleaner production in the field of manufacturing processes, sustainability of AM processes needs to be assessed in order to make easier its acceptance and implementation in the industry. Furth...

  19. Desktop Manufacturing Technologies.

    Science.gov (United States)

    Snyder, Mark

    1991-01-01

    Desktop manufacturing is the use of data from a computer-assisted design system to construct actual models of an object. Emerging processes are stereolithography, laser sintering, ballistic particle manufacturing, laminated object manufacturing, and photochemical machining. (SK)

  20. Photovoltaic manufacturing technology, Phase 1

    Energy Technology Data Exchange (ETDEWEB)

    Izu, M. (Energy Conversion Devices, Inc., Troy, MI (United States))

    1992-03-01

    This report examines manufacturing multiple-band-gap, multiple- junction solar cells and photovoltaic modules. Amorphous silicon alloy material is deposited (using microwave plasma-assisted chemical vapor deposition) on a stainless-steel substrate using a roll-to-roll process that is continuous and automated. Rapid thermal equilibration of the metal substrate allows rapid throughput of large-area devices in smaller production machines. Potential improvements in the design, deposition, and module fabrication process are described. Problems are also discussed that could impede using these potential improvements. Energy Conversion Devices, Inc. (ECD) proposes cost and time estimates for investigating and solving these problems. Manufacturing modules for less than $1.00 per peak watt and stable module efficiencies of greater than 10% are near-term goals proposed by ECD. 18 refs.

  1. Tribology in Manufacturing Technology

    CERN Document Server

    2013-01-01

    The present book aims to provide research advances on tribology in manufacturing technology for modern industry. This book can be used as a research book for final undergraduate engineering course (for example, mechanical, manufacturing, materials, etc) or as a subject on manufacturing at the postgraduate level. Also, this book can serve as a useful reference for academics, manufacturing and tribology researchers, mechanical, mechanical, manufacturing and materials engineers, professionals in related industries with manufacturing and tribology.

  2. Utility of Big Area Additive Manufacturing (BAAM) For The Rapid Manufacture of Customized Electric Vehicles

    Energy Technology Data Exchange (ETDEWEB)

    Love, Lonnie J [ORNL

    2015-08-01

    This Oak Ridge National Laboratory (ORNL) Manufacturing Development Facility (MDF) technical collaboration project was conducted in two phases as a CRADA with Local Motors Inc. Phase 1 was previously reported as Advanced Manufacturing of Complex Cyber Mechanical Devices through Community Engagement and Micro-manufacturing and demonstrated the integration of components onto a prototype body part for a vehicle. Phase 2 was reported as Utility of Big Area Additive Manufacturing (BAAM) for the Rapid Manufacture of Customized Electric Vehicles and demonstrated the high profile live printing of an all-electric vehicle using ONRL s Big Area Additive Manufacturing (BAAM) technology. This demonstration generated considerable national attention and successfully demonstrated the capabilities of the BAAM system as developed by ORNL and Cincinnati, Inc. and the feasibility of additive manufacturing of a full scale electric vehicle as envisioned by the CRADA partner Local Motors, Inc.

  3. Manufacturing Communication: DCOM-MMS-based Approach for Flexible Manufacturing System

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    A design approach of manufacturing communication ispresented for flexible manufacturing system in this paper.The primary objective aims at making the flexible manufacturing control system provided with interoperability and rconfigurability.Based on describing manufacturing message specification (MMS) and distributed component object model (DCOM), a client/server manufacturing communication model is built with MMS standard and DCOM middleware, and thecommunication interfaces between MMS client and MMS server are designed with Microsoft interface definition language (MIDL) and abstract syntax notation one (ASN. 1) of MMS services. As a result, DCOM and MMS integration leads to such client/ server communication capabilities independent of different operating systems and manufacturing devices in flexible manufacturing automation environment. Finally, to verify the new design approach, a prototype system of robot control system has been implemented in MS 2000 Server/Professional Operating System and VC + + 6.0 Developer Environments.

  4. Modeling biology with HDL languages: a first step toward a genetic design automation tool inspired from microelectronics.

    Science.gov (United States)

    Gendrault, Yves; Madec, Morgan; Lallement, Christophe; Haiech, Jacques

    2014-04-01

    Nowadays, synthetic biology is a hot research topic. Each day, progresses are made to improve the complexity of artificial biological functions in order to tend to complex biodevices and biosystems. Up to now, these systems are handmade by bioengineers, which require strong technical skills and leads to nonreusable development. Besides, scientific fields that share the same design approach, such as microelectronics, have already overcome several issues and designers succeed in building extremely complex systems with many evolved functions. On the other hand, in systems engineering and more specifically in microelectronics, the development of the domain has been promoted by both the improvement of technological processes and electronic design automation tools. The work presented in this paper paves the way for the adaptation of microelectronics design tools to synthetic biology. Considering the similarities and differences between the synthetic biology and microelectronics, the milestones of this adaptation are described. The first one concerns the modeling of biological mechanisms. To do so, a new formalism is proposed, based on an extension of the generalized Kirchhoff laws to biology. This way, a description of all biological mechanisms can be made with languages widely used in microelectronics. Our approach is therefore successfully validated on specific examples drawn from the literature.

  5. Job stress models, depressive disorders and work performance of engineers in microelectronics industry.

    Science.gov (United States)

    Chen, Sung-Wei; Wang, Po-Chuan; Hsin, Ping-Lung; Oates, Anthony; Sun, I-Wen; Liu, Shen-Ing

    2011-01-01

    Microelectronic engineers are considered valuable human capital contributing significantly toward economic development, but they may encounter stressful work conditions in the context of a globalized industry. The study aims at identifying risk factors of depressive disorders primarily based on job stress models, the Demand-Control-Support and Effort-Reward Imbalance models, and at evaluating whether depressive disorders impair work performance in microelectronics engineers in Taiwan. The case-control study was conducted among 678 microelectronics engineers, 452 controls and 226 cases with depressive disorders which were defined by a score 17 or more on the Beck Depression Inventory and a psychiatrist's diagnosis. The self-administered questionnaires included the Job Content Questionnaire, Effort-Reward Imbalance Questionnaire, demography, psychosocial factors, health behaviors and work performance. Hierarchical logistic regression was applied to identify risk factors of depressive disorders. Multivariate linear regressions were used to determine factors affecting work performance. By hierarchical logistic regression, risk factors of depressive disorders are high demands, low work social support, high effort/reward ratio and low frequency of physical exercise. Combining the two job stress models may have better predictive power for depressive disorders than adopting either model alone. Three multivariate linear regressions provide similar results indicating that depressive disorders are associated with impaired work performance in terms of absence, role limitation and social functioning limitation. The results may provide insight into the applicability of job stress models in a globalized high-tech industry considerably focused in non-Western countries, and the design of workplace preventive strategies for depressive disorders in Asian electronics engineering population.

  6. Application of multivariate statistical analysis to STEM X-ray spectral images: interfacial analysis in microelectronics.

    Science.gov (United States)

    Kotula, Paul G; Keenan, Michael R

    2006-12-01

    Multivariate statistical analysis methods have been applied to scanning transmission electron microscopy (STEM) energy-dispersive X-ray spectral images. The particular application of the multivariate curve resolution (MCR) technique provides a high spectral contrast view of the raw spectral image. The power of this approach is demonstrated with a microelectronics failure analysis. Specifically, an unexpected component describing a chemical contaminant was found, as well as a component consistent with a foil thickness change associated with the focused ion beam specimen preparation process. The MCR solution is compared with a conventional analysis of the same spectral image data set.

  7. Configurations of high-frequency ultrasonics complex vibration systems for packaging in microelectronics.

    Science.gov (United States)

    Tsujino, Jiromaru; Harada, Yoshiki; Ihara, Shigeru; Kasahara, Kohei; Shimizu, Masanori; Ueoka, Tetsugi

    2004-04-01

    Ultrasonic high-frequency complex vibrations are effective for various ultrasonic high-power applications. Three types of ultrasonic complex vibration system with a welding tip vibrating elliptical to circular locus for packaging in microelectronics were studied. The complex vibration sources are using (1) a longitudinal-torsional vibration converter with diagonal slits that is driven only by a longitudinal vibration source, (2) a complex transverse vibration rod with several stepped parts that is driven by two longitudinal vibration source crossed at a right angle and (3) a longitudinal vibration circular disk and three longitudinal transducers that are installed at the circumference of the disk.

  8. Nano-interconnection for microelectronics and polymers with benzo-triazole

    Science.gov (United States)

    Park, Yeonjoon; Choi, Sang H.; Noh, Hyunpil; Kuk, Young

    2006-01-01

    Benzo-Triazole (BTA) is considered as an important bridging material that can connect an organic polymer to the metal electrode on silicon wafers as a part of the microelectronics fabrication technology. We report a detailed process of surface induced 3-D polymerization of BTA on the Cu electrode material which was measured with the Ultraviolet Photoemission Spectroscopy (UPS), X-ray Photoemission Spectroscopy (XPS), and Scanning Tunneling Microscope (STM). The electric utilization of shield and chain polymerization of BTA on Cu surface is contemplated in this study.

  9. Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials

    Science.gov (United States)

    1991-01-01

    Si I-xGex Strained Layers (D.B.Noble) ................................................ 55 I. Oral Presentations Resulting from AFOSR Grants No. 89-0185...120 8 7 0 100 6 4 60 80 , E 60 0 F. ac sorption D - 21 - A desorption ( Vih ) Q 1 I - I - - a- 1 -10 0 10 20 30 40 annealing time (min) Fig. 8 D...III. ORAL PRESENTATIONS RESULTING FROM AFOSR GRANTS NO. 86- 0051 AND 86-0051 1. W.DhjX, "Mechanical Properties of Microelectronic Thin Film Materials

  10. Trends in Microfabrication Capabilities & Device Architectures.

    Energy Technology Data Exchange (ETDEWEB)

    Bauer, Todd [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Jones, Adam [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Lentine, Tony [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Mudrick, John [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Okandan, Murat [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Rodrigues, Arun [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-06-01

    The last two decades have seen an explosion in worldwide R&D, enabling fundamentally new capabilities while at the same time changing the international technology landscape. The advent of technologies for continued miniaturization and electronics feature size reduction, and for architectural innovations, will have many technical, economic, and national security implications. It is important to anticipate possible microelectronics development directions and their implications on US national interests. This report forecasts and assesses trends and directions for several potentially disruptive microfabrication capabilities and device architectures that may emerge in the next 5-10 years.

  11. Trends in Microfabrication Capabilities & Device Architectures.

    Energy Technology Data Exchange (ETDEWEB)

    Bauer, Todd [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Jones, Adam [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Lentine, Anthony L. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Mudrick, John [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Okandan, Murat [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Rodrigues, Arun F. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-06-01

    The last two decades have seen an explosion in worldwide R&D, enabling fundamentally new capabilities while at the same time changing the international technology landscape. The advent of technologies for continued miniaturization and electronics feature size reduction, and for architectural innovations, will have many technical, economic, and national security implications. It is important to anticipate possible microelectronics development directions and their implications on US national interests. This report forecasts and assesses trends and directions for several potentially disruptive microfabrication capabilities and device architectures that may emerge in the next 5-10 years.

  12. Manufacturing network evolution

    DEFF Research Database (Denmark)

    Yang, Cheng; Farooq, Sami; Johansen, John

    2011-01-01

    Purpose – This paper examines the effect of changes at the manufacturing plant level on other plants in the manufacturing network and also investigates the role of manufacturing plants on the evolution of a manufacturing network. Design/methodology/approach –The research questions are developed......, the complex phenomenon of a manufacturing network evolution is observed by combining the analysis of a manufacturing plant and network level. The historical trajectories of manufacturing networks that are presented in the case studies are examined in order to understand and determine the future shape...

  13. Manufacturing network evolution

    DEFF Research Database (Denmark)

    Yang, Cheng; Farooq, Sami; Johansen, John

    2011-01-01

    Purpose – This paper examines the effect of changes at the manufacturing plant level on other plants in the manufacturing network and also investigates the role of manufacturing plants on the evolution of a manufacturing network. Design/methodology/approach –The research questions are developed...... by identifying the gaps in the reviewed literature. The paper is based on three case studies undertaken in Danish manufacturing companies to explore in detail their manufacturing plants and networks. The cases provide a sound basis for developing the research questions and explaining the interaction between...... different manufacturing plants in the network and their impact on network transformation. Findings – The paper highlights the dominant role of manufacturing plants in the continuously changing shape of a manufacturing network. The paper demonstrates that a product or process change at one manufacturing...

  14. The medical device industry developments in software risk management

    CERN Document Server

    Burton, John; McCaffery, Fergal; hAodha, Micheal O

    2009-01-01

    The Medical Device industry is one of the fastest growing industries in the world. Device manufacturers are producing increasingly sophisticated and complex medical device software to differentiate themselves in the battle for dominance in this sector.

  15. Possibilities for mixed mode chip manufacturing in EUROPRACTICE

    Science.gov (United States)

    Das, C.

    1997-02-01

    EUROPRACTICE is an EC initiative under the ESPRIT programme which aims to stimulate the wider exploitation of state-of-the-art microelectronics technologies by European industry and to enhance European industrial competitiveness in the global market-place. Through EUROPRACTICE, the EC has created a range of Basic Services that offer users a cost-effective and flexible means of accessing three main microelectronics-based technologies: Application Specific Integrated Circuit (ASICs), Multi-Chip Modules (MCMs) and Microsystems. EUROPRACTICE Basic Services reduce the cost and risk for companies wishing to begin using these technologies. EUROPRACTICE offers a fully supported, low cost route for companies to design and fabricate ASICs for their individual applications. Low cost is achieved by consolidating designs from many users onto a single semiconductor wafer (MPW: Multi Project Wafer). The EUROPRACTICE IC Manufacturing Service (ICMS) offers a broad range of fabrication technologies including CMOS, BiCMOS and GaAs. The Service extends from enabling users to produce prototype ASICs for testing and evaluation, through to low-volume production runs.

  16. Environmentally benign silicon solar cell manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Tsuo, Y.S. [National Renewable Energy Lab., Golden, CO (United States); Gee, J.M. [Sandia National Labs., Albuquerque, NM (United States); Menna, P. [National Agency for New Technologies Energy and Environment, Portici (Italy); Strebkov, D.S.; Pinov, A.; Zadde, V. [Intersolarcenter, Moscow (Russian Federation)

    1998-09-01

    The manufacturing of silicon devices--from polysilicon production, crystal growth, ingot slicing, wafer cleaning, device processing, to encapsulation--requires many steps that are energy intensive and use large amounts of water and toxic chemicals. In the past two years, the silicon integrated-circuit (IC) industry has initiated several programs to promote environmentally benign manufacturing, i.e., manufacturing practices that recover, recycle, and reuse materials resources with a minimal consumption of energy. Crystalline-silicon solar photovoltaic (PV) modules, which accounted for 87% of the worldwide module shipments in 1997, are large-area devices with many manufacturing steps similar to those used in the IC industry. Obviously, there are significant opportunities for the PV industry to implement more environmentally benign manufacturing approaches. Such approaches often have the potential for significant cost reduction by reducing energy use and/or the purchase volume of new chemicals and by cutting the amount of used chemicals that must be discarded. This paper will review recent accomplishments of the IC industry initiatives and discuss new processes for environmentally benign silicon solar-cell manufacturing.

  17. Nanotechnology: MEMS and NEMS and their applications to smart systems and devices

    Science.gov (United States)

    Varadan, Vijay K.

    2003-10-01

    The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: (1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; (2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; (3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; (4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sending and control of a variety functions in automobile, aerospace, marine and

  18. Microelectronics: The Nature of Work, Skills and Training. An Analysis of Case Studies from Developed and Developing Countries. Training Discussion Paper No. 51.

    Science.gov (United States)

    Acero, Liliana

    Microelectronic technologies have had an impact on the nature of work in industry for both white-collar and blue-collar workers. Evidence from sector- and enterprise-level studies shows changes in skills and job content for blue-collar workers involved with numerically controlled machine tools, robots, and other microelectronics applications.…

  19. Technological Change and Women Workers: The Development of Microelectronics. World Conference of the United Nations Decade for Women: Equality, Development, and Peace.

    Science.gov (United States)

    Hult, Marit

    This report reviews the current debate in industrialized market economy countries on the impact of microelectronics technology on employment. A special focus is on the impact on women's employment opportunities. Chapter 1 presents information on the technological background, including the development of microelectronics and their application in…

  20. Microelectronic neural bridge for signal regeneration and function rebuilding over two separate nerves

    Energy Technology Data Exchange (ETDEWEB)

    Shen Xiaoyan; Wang Zhigong; Xie Shushan; Huang Zonghao [Institute of RF- and OE-ICs, Southeast University, Nanjing 210096 (China); Lue Xiaoying, E-mail: zgwang@seu.edu.cn [Key Laboratory of Bioelectronics, Southeast University, Nanjing 210096 (China)

    2011-06-15

    According to the feature of neural signals, a micro-electronic neural bridge (MENB) has been designed. It consists of two electrode arrays for neural signal detection and functional electrical stimulation (FES), and a microelectronic circuit for signal amplifying, processing, and FES driving. The core of the system is realized in 0.5-{mu}m CMOS technology and used in animal experiments. A special experimental strategy has been designed to demonstrate the feasibility of the system. With the help of the MENB, the withdrawal reflex function of the left/right leg of one spinal toad has been rebuilt in the corresponding leg of another spinal toad. According to the coherence analysis between the source and regenerated neural signals, the controlled spinal toad's sciatic nerve signal is delayed by 0.72 ms in relation to the sciatic nerve signal of the source spinal toad and the cross-correlation function reaches a value of 0.73. This shows that the regenerated signal is correlated with the source sciatic signal significantly and the neural activities involved in reflex function have been regenerated. The experiment demonstrates that the MENB is useful in rebuilding the neural function between nerves of different bodies. (semiconductor integrated circuits)

  1. Implementation of Microelectronics Track in Electronics Engineering in a Philippines State University

    Directory of Open Access Journals (Sweden)

    Gil B. Barte

    2015-11-01

    Full Text Available The evolving trends in electronics continuous to attract students to take upElectronics Engineering.However, it also adds to discipline implementation complexities.Institutions of Higher Learning offering this program must adapt to this realities to avoid obsolescence. This paper looked at Batangas State University, in the Philippines,ongoingimplementation of the Microelectronics track under the Electronics Engineering (ECEProgram. It describes the restructuring done to the ECE curriculum to overcome the enormous complexity inherent in microelectronics design and the teaching pedagogy adopted to promote active learning. The ongoing program has produced encouraging outcomes:1students were able to design, and simulate complex gate CMOS circuits using EDA tools, in the four(4 course electives identified for the track; 2 the culture of independent learning among students improvement in students soft skills, communication skills, time-management and teamwork skill,; 3. useof free and web-based tools overcome the issue of high cost of license for EDA tools and seminar/training for continuous upgrading of faculty. Another encouraging outcome was the acceptance of the student-centered teaching approach used, Problem-Based Learning (PBL,in enhancing the students learning experience.

  2. Results of external review Sandia microelectronics and microsystems program (September 2004).

    Energy Technology Data Exchange (ETDEWEB)

    Peercy, Paul S. (University of Wisconsin-Madison, Madision, WI); Myers, David R.

    2005-08-01

    The US Department of Energy requires a periodic assessment of the Microsystems Program at Sandia National Laboratories. An external review of this program is held approximately every 18 months to 24 months. The report from the External Review Panel serves as the basis for Sandia's ''self assessment'' and is a specific deliverable of the governance contract between Lockheed Martin and the Department of Energy. The External Review of Microelectronics and Microsystems for Fiscal Year 2004 was held September 27-29, 2004 at Sandia National Laboratories, Albuquerque, NM. The external review panel consisted of experts in the fields of microelectronics, photonics and microsystems from universities, industry and other Government agencies. A complete list of the panel members is included as Appendix A of the attached report. The review assessed four areas: relevance to national needs and agency mission; quality of science, technology and engineering; performance in the operation of a major facility; and program performance management and planning. Relevance to national needs and agency mission was rated as ''outstanding''. The quality of science, technology, and engineering was rated as ''outstanding''. Operation of a major facility was rated as ''outstanding'', and the category of program performance, management, and planning was rated as ''outstanding''. Sandia's Microsystems Program thus received an overall rating of ''outstanding'' [the highest possible rating].

  3. Microelectronic neural bridge for signal regeneration and function rebuilding over two separate nerves*

    Institute of Scientific and Technical Information of China (English)

    Shen Xiaoyan; Wang Zhigong; Lü Xiaoying; Xie Shushan; Huang Zonghao

    2011-01-01

    According to the feature of neural signals, a micro-electronic neural bridge (MENB) has been designed.It consists of two electrode arrays for neural signal detection and functional electrical stimulation (FES), and a microelectronic circuit for signal amplifying, processing, and FES driving. The core of the system is realized in 0.5-μm CMOS technology and used in animal experiments. A special experimental strategy has been designed to demonstrate the feasibility of the system. With the help of the MENB, the withdrawal reflex function of the left/right leg of one spinal toad has been rebuilt in the corresponding leg of another spinal toad. According to the coherence analysis between the source and regenerated neural signals, the controlled spinal toad's sciatic nerve signal is delayed by 0.72 ms in relation to the sciatic nerve signal of the source spinal toad and the cross-correlation function reaches a value of 0.73. This shows that the regenerated signal is correlated with the source sciatic signal significantly and the neural activities involved in reflex function have been regenerated. The experiment demonstrates that the MENB is useful in rebuilding the neural function between nerves of different bodies.

  4. Strategic Roles of Manufacturing

    DEFF Research Database (Denmark)

    Yang, Cheng

    Addressing three development trends of manufacturing, this thesis aims to explore: (1) facing challenges on manufacturing (globalisation, knowledge-based manufacturing and servitisation of manufacturing), what kinds of roles does manufacturing play within industrial companies; (2) along...... with the trend of globalisation, how do industrial companies develop their global manufacturing networks? These two questions are actually interlinked. On the one hand, facing increasing offshoring and outsourcing of production activities, industrial companies have to understand how to develop their global...... manufacturing networks. On the other hand, ongoing globalisation also brings tremendous impacts to post-industrial economies (e.g. Denmark). A dilemma therefore arises, i.e. whether it is still necessary to keep manufacturing in these post-industrial economies; if yes, what kinds of roles manufacturing should...

  5. Framework for Grid Manufacturing

    Institute of Scientific and Technical Information of China (English)

    陈笠; 邓宏; 邓倩妮; 吴振宇

    2004-01-01

    With the development of networked manufacturing, it is more and more imminent to solve problems caused by inherent limitations of network technology, such as heterogeneity, collaboration collision, and decentralized control.This paper presents a framework for grid manufacturing, which neatly combines grid technology with the infrastructure of advanced manufacturing technology.The paper studies grid-oriented knowledge description and acquisition, and constructs a distributed knowledge grid model.The paper also deals with the protocol of node description in collaborative design, and describes a distributed collaborative design model.The protocol and node technology leads to a collaborative production model for grid manufacturing.The framework for grid manufacturing offers an effective and feasible solution for the problems of networked manufacturing.The grid manufacturing will become an advanced distributed manufacturing model and promote the development of advanced manufacturing technologies.

  6. ST Microelectronics

    CERN Multimedia

    Patrice Loïez

    2002-01-01

    Photo 01 : Prof. Roger Cashmore, Research Director for Collider Programmes, Dr Salvatore Castorina, Corporate Vice President, DSG, Prof. Gigi Rolandi, CMS Tracker Project Manager. Photo 02 : Dr Salvatore Castorina signing the Guest Book. Photo 03 : Prof. Roger Cashmore, Dr Salvatore Castorina.

  7. Microelectronic systems

    CERN Document Server

    Heuberger, Albert; Hanke, Randolf

    2011-01-01

    This book is dedicated to Prof. Dr. Heinz Gerhauser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universitat Erlangen-Nurnberg. Heinz Gerhauser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to beco

  8. Price transparency for medical devices.

    Science.gov (United States)

    Pauly, Mark V; Burns, Lawton R

    2008-01-01

    Hospital buyers of medical devices contract with manufacturers with market power that sell differentiated products. The medical staff strongly influences hospitals' choice of devices. Sellers have sought to limit disclosure of transaction prices. Policy-makers have proposed legislation mandating disclosure, in the interest of greater transparency. We discuss why a manufacturer might charge different prices to different hospitals, the role that secrecy plays, and the consequences of secrecy versus disclosure. We argue that hospital-physician relationships are key to understanding what manufacturers gain from price discrimination. Price disclosure can catalyze a restructuring of those relationships, which, in turn, can improve hospital bargaining.

  9. Progress of Si-based Optoelectronic Devices

    Institute of Scientific and Technical Information of China (English)

    PENG Ying-cai; FU Guang-sheng; WANG Ying-long; SHANG Yong

    2004-01-01

    Si-based optoelectronics is becoming a very active research area due to its potential applications to optical communications. One of the major goals of this study is to realize ali-Si optoelectronic integrated circuit. This is due to the fact that Si- based optoelectronic technology can be compatible with Si microelectronic technology. If Si-based optoelectronic devices and integrated circuits can be achieved,it will lead to a new informational technological revolution. In the article, the current developments of this exciting field are mainly reviewed in the recent years. The involved contents are the realization of various Si-based optoelectronic devices, such as light-emitting diodes,optical waveguides devices, Si photonic bandgap crystals,and Si laser,etc. Finally, the developed tendency of all-Si optoelectronic integrated technology are predicted in the near future.

  10. The Frontiers of Additive Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Grote, Christopher John [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-03-03

    Additive manufacturing, more commonly known as 3-D printing, has become a ubiquitous tool in science for its precise control over mechanical design. For additive manufacturing to work, a 3-D structure is split into thin 2D slices, and then different physical properties, such as photo-polymerization or melting, are used to grow the sequential layers. The level of control allows not only for devices to be made with a variety of materials: e.g. plastics, metals, and quantum dots, but to also have finely controlled structures leading to other novel properties. While 3-D printing is widely used by hobbyists for making models, it also has industrial applications in structural engineering, biological tissue scaffolding, customized electric circuitry, fuel cells, security, and more.

  11. Northwest Manufacturing Initiative

    Science.gov (United States)

    2014-07-31

    warehouse. If the batch of lenses is faulty, the manufacturer wants to know ASAP in order to send Visionary Lenses a new batch of lenses. The manufacturer ...increased. • A few years ago, Nike started using pre-consumer Nike Grind – (scrap material from their manufacturing facilities) – in new ...Northwest ( in particular with firms in the manufacturing eco-system of defense supply chains). Special emphasis was placed to increase the

  12. Manufacturing in Denmark

    DEFF Research Database (Denmark)

    Hansen, Johannes; Boer, Henrike Engele Elisabeth; Boer, Harry

    This report compares the manufacturing strategies, practices, performances and improvement activities of 39 companies that are representative for the Danish assembly industry with those of 804 companies from 19 other countries. The data supporting this report were collected in 2013 and concern......: • Manufacturing strategies pursued and implemented between 2010 and 2012. • Performance improvements achieved during that period. • Actual manufacturing practices and performances as well as competitive priorities in 2012. • Manufacturing strategies pursued for the years 2010-2012....

  13. Wire + Arc Additive Manufacturing

    OpenAIRE

    Williams, Stewart W.; Martina, Filomeno; Addison, Adrian C.; Ding, Jialuo; Pardal, Goncalo; Colegrove, Paul A.

    2016-01-01

    Depositing large components (>10 kg) in titanium, aluminium, steel and other metals is possible using Wire + Arc Additive Manufacturing. This technology adopts arc welding tools and wire as feedstock for additive manufacturing purposes. High deposition rates, low material and equipment costs, and good structural integrity make Wire+Arc Additive Manufacturing a suitable candidate for replacing the current method of manufacturing from solid billets or large forgings, especially with regards to ...

  14. Space Manufacturing: The Next Great Challenge

    Science.gov (United States)

    Whitaker, Ann F.; Curreri, Peter; Sharpe, Jonathan B.; Colberg, Wendell R.; Vickers, John H.

    1998-01-01

    Space manufacturing encompasses the research, development and manufacture necessary for the production of any product to be used in near zero gravity, and the production of spacecraft required for transporting research or production devices to space. Manufacturing for space, and manufacturing in space will require significant breakthroughs in materials and manufacturing technology, as well as in equipment designs. This report reviews some of the current initiatives in achieving space manufacturing. The first initiative deals with materials processing in space, e.g., processing non-terrestrial and terrestrial materials, especially metals. Some of the ramifications of the United States Microgravity Payloads fourth (USMP-4) mission are discussed. Some problems in non-terrestrial materials processing are mentioned. The second initiative is structures processing in space. In order to accomplish this, the International Space Welding Experiment was designed to demonstrate welding technology in near-zero gravity. The third initiative is advancements in earth-based manufacturing technologies necessary to achieve low cost access to space. The advancements discussed include development of lightweight material having high specific strength, and automated fabrication and manufacturing methods for these materials.

  15. Fabrication of polyimide based microfluidic channels for biosensor devices

    DEFF Research Database (Denmark)

    Zulfiqar, Azeem; Pfreundt, Andrea; Svendsen, Winnie Edith

    2015-01-01

    The ever-increasing complexity of the fabrication process of Point-of-care (POC) devices, due to high demand of functional versatility, compact size and ease-of-use, emphasizes the need of multifunctional materials that can be used to simplify this process. Polymers, currently in use for the fabr...... in uniformity of PI is also compared to the most commonly used SU8 polymer, which is a near UV sensitive epoxy resin. The potential applications of PI processing are POC and biosensor devices integrated with microelectronics....

  16. Designing using manufacturing features

    Science.gov (United States)

    Szecsi, T.; Hoque, A. S. M.

    2012-04-01

    This paper presents a design system that enables the composition of a part using manufacturing features. Features are selected from feature libraries. Upon insertion, the system ensures that the feature does not contradict the design-for-manufacture rules. This helps eliminating costly manufacturing problems. The system is developed as an extension to a commercial CAD/CAM system Pro/Engineer.

  17. Generalized Reactive Manufacturing System

    Institute of Scientific and Technical Information of China (English)

    李蓓智

    2001-01-01

    Generalized reactive manufacturing system named GRMS is introduced. GRMS is a human-centered system based on Multi-agent. Its management and control organization is made up of three types of agents named device agent,task agent and shop-floor agent. GRMS adopts a top down and bottom- up competition and cooperation strategy based on the dynamic sifter and funnel To constrain the behavior of agents, a reward and penaity policy is introduced into the system and the closed-loop adjustment of GRMS is realized through such policy.Agents for the same task should be cooperated with each other and agents for different tasks should compete for survival in the dynamic changing environment. A distributed-hierarchical architecture with three levels of master-slave relationships among agents are proposed.Self-propelled process planning is also discussed. In order to evaluate GRMS, a time-driven simulation system-GRMOSS is developed to check the physical consistency of GRMS.

  18. Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

    Science.gov (United States)

    Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

    2014-01-01

    Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

  19. Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

    Science.gov (United States)

    Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

    2014-01-01

    Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

  20. Determining DfT Hardware by VHDL-AMS Fault Simulation for Biological Micro-Electronic Fluidic Arrays

    NARCIS (Netherlands)

    Kerkhoff, H.G.; Zhang, X.; Liu, H.; Richardson, A.; Nouet, P.; Azais, F.

    2005-01-01

    The interest of microelectronic fluidic arrays for biomedical applications, like DNA determination, is rapidly increasing. In order to evaluate these systems in terms of required Design-for-Test structures, fault simulations in both fluidic and electronic domains are necessary. VHDL-AMS can be used

  1. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

    NARCIS (Netherlands)

    Yazdan Mehr, M.; Bahrami, A.; Fischer, H.; Gielen, S.; Corbeij, R.; van Driel, W.D.; Zhang, G.Q.

    2015-01-01

    In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as

  2. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

    NARCIS (Netherlands)

    Yazdan Mehr, M.; Bahrami, A.; Fischer, H.; Gielen, S.; Corbeij, R.; van Driel, W.D.; Zhang, G.Q.

    2015-01-01

    In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as

  3. Advanced Manufacturing Technologies (AMT): Manufacturing Initiative Project

    Data.gov (United States)

    National Aeronautics and Space Administration — NASA supports the Advanced Manufacturing National Program Office (AMNPO). Hosted by the National Institute of Standards and Technology (NIST) the AMNPO is...

  4. Manufacturing Planning Guide

    Science.gov (United States)

    Waid, Michael

    2011-01-01

    Manufacturing process, milestones and inputs are unknowns to first-time users of the manufacturing facilities. The Manufacturing Planning Guide aids in establishing expectations for both NASA and non-NASA facility customers. The potential audience for this guide includes both internal and commercial spaceflight hardware/software developers. It is intended to assist their project engineering personnel in manufacturing planning and execution. Material covered includes a roadmap of the manufacturing process, roles and responsibilities of facility and user, major milestones, facility capabilities, and inputs required by the facility. Samples of deliverables, products, and inputs necessary to define test scope, cost, and schedule are included as an appendix to the guide.

  5. Stabilizing Semiconductor Devices With Hydrogen

    Science.gov (United States)

    Overhauser, Albert W.; Maserjian, Joseph

    1989-01-01

    Damage by radiation healed rapidly. Feature provides continuous, rapid recovery of devices from degradation caused by hot electrons, photons, and ionizing radiation. Several candidate sites for palladium film catalysts, inserted during manufacture as integral parts of devices. Paladium films made by evaporation, sputtering, or chemical-vapor deposition. If additional storage required, thick layer of palladium plated on inside of package surrounding device. Hydrogen stored by exposing palladium to hydrogen gas just before package sealed hermetically.

  6. Two-dimensional Green`s function Poisson solution appropriate for feature-scale microelectronics simulations

    Energy Technology Data Exchange (ETDEWEB)

    Riley, M.E.

    1998-03-01

    This report describes the numerical procedure used to implement the Green`s function method for solving the Poisson equation in two-dimensional Cartesian coordinates. The procedure can determine the solution to a problem with any or all of applied voltage boundary conditions, dielectric media, floating (insulated) conducting media, dielectric surface charging, periodic (reflective) boundary conditions, and volumetric space charge. The numerical solution is reasonably fast, and the dimension of the linear problem to be solved is that of the number of elements needed to represent the surfaces, not the whole computational volume. The method of solution is useful in the simulation of plasma particle motion in the vicinity of complex surface structures as found in microelectronics plasma processing applications. A FORTRAN implementation of this procedure is available from the author.

  7. West Europe report: Science and technology. FRG: Concept paper on microelectronics, communications technology

    Science.gov (United States)

    1984-07-01

    Precisely because the Federal Republic of Germany is a nation with a strong export orientation the capability to develop and apply, with an eye to the market, modern information and communication technologies and microelectronics which provides the basis for them has a very important bearing on the nations competitive position. To attain a leadership position in information technology, the men and women of the FRG must take up the challenge of this technology in terms of training and continuing education as well as in the media and in public life. Industry must agressively seek out markets and engage in international competition and the state must remove existing obstacles and create the kind of conditions that will make its assistance programs most effective. Programs which reflect the government's resolve to meet the challenge of information technology and to help improve the FRG's competitive position in this field are outlined.

  8. Synthesis оf Optoelectronic System for Control оf Microelectronic Structures

    Directory of Open Access Journals (Sweden)

    G. A. Trapashko

    2014-01-01

    Full Text Available Development of optoelectronic systems for registration of structuring element images demands improvement of the equipment for control of sizes and a form of microelectronic structures in accordance with design data and absence of introduced defects and impurities. For synthesis of these systems it is necessary to use a special method which allows to substantiate the use of a radiation source in it and  determine main functional parameters of the optoelectronic system. The paper presents the results of the method that has been used for development of the optoelectronic system operating  with the resolution of 250 nanometers. It has been shown that LED lamps can be used instead of traditionally used halogen and mercury-xenon lamps in the control equipment.

  9. Study of a two-stage photobase generator for photolithography in microelectronics.

    Science.gov (United States)

    Turro, Nicholas J; Li, Yongjun; Jockusch, Steffen; Hagiwara, Yuji; Okazaki, Masahiro; Mesch, Ryan A; Schuster, David I; Willson, C Grant

    2013-03-01

    The investigation of the photochemistry of a two-stage photobase generator (PBG) is described. Absorption of a photon by a latent PBG (1) (first step) produces a PBG (2). Irradiation of 2 in the presence of water produces a base (second step). This two-photon sequence (1 + hν → 2 + hν → base) is an important component in the design of photoresists for pitch division technology, a method that doubles the resolution of projection photolithography for the production of microelectronic chips. In the present system, the excitation of 1 results in a Norrish type II intramolecular hydrogen abstraction to generate a 1,4-biradiacal that undergoes cleavage to form 2 and acetophenone (Φ ∼ 0.04). In the second step, excitation of 2 causes cleavage of the oxime ester (Φ = 0.56) followed by base generation after reaction with water.

  10. Effects of occupational stress on the physical and psychological health of women in a microelectronics plant.

    Science.gov (United States)

    Bromet, E J; Dew, M A; Parkinson, D K; Cohen, S; Schwartz, J E

    1992-06-01

    Physical and psychological effects of occupational stress were examined in a sample of 552 female blue collar employees of a microelectronics facility. After controlling for demographic and biological risk factors, non-work life events, and solvent exposure, job-related conflict was associated with depressive symptomatology, severe headaches, lightheadedness weakness/fatigue, rashes, and presence of multiple symptoms. Job demands were only associated with multiple symptoms. Solvent exposure did not interact with either of the job stress measures synergistically to increase symptom reports. Although the main effects of social support, when present, were in the direction of reducing symptomatology, the interactive effects of social support and stress on health were inconsistent and dependent on the source of support.

  11. Phase transformation in SiOx/SiO₂ multilayers for optoelectronics and microelectronics applications.

    Science.gov (United States)

    Roussel, M; Talbot, E; Pratibha Nalini, R; Gourbilleau, F; Pareige, P

    2013-09-01

    Due to the quantum confinement, silicon nanoclusters (Si-ncs) embedded in a dielectric matrix are of prime interest for new optoelectronics and microelectronics applications. In this context, SiO(x)/SiO₂ multilayers have been prepared by magnetron sputtering and subsequently annealed to induce phase separation and Si clusters growth. The aim of this paper is to study phase separation processes and formation of nanoclusters in SiO(x)/SiO₂ multilayers by atom probe tomography. Influences of the silicon supersaturation, annealing temperature and SiO(x) and SiO₂ layer thicknesses on the final microstructure have been investigated. It is shown that supersaturation directly determines phase separation regime between nucleation/classical growth and spinodal decomposition. Annealing temperature controls size of the particles and interface with the surrounding matrix. Layer thicknesses directly control Si-nc shapes from spherical to spinodal-like structures.

  12. Single event upsets of spacecraft microelectronics exposed to solar cosmic rays.

    Science.gov (United States)

    Kuznetsov, N V; Nymmik, R A

    1996-11-01

    The technique for evaluating the SEU rate induced by solar particle incidence on spacecraft microelectronics is described, including the contributions from the primary (heavy ion-induced) and secondary proton-induced) SEU mechanisms. The technique is based on original computational models for solar particle energy spectra and for SEU occurrence in electronics. The technique was used to analyze the data of the TDRS-1 Fairchild 93L422 IC exposed to protons and ions during the solar cosmic ray event of September-October 1989. The analysis included the distribution of the microcircuit shielding. A strong dependence of solar proton-to-ion ratio on the shielding thickness was indicated by the calculations.

  13. Microelectronic DNA assay for the detection of BRCA1 gene mutations

    Science.gov (United States)

    Chen, Hua; Han, Jie; Li, Jun; Meyyappan, Meyya

    2004-01-01

    Mutations in BRCA1 are characterized by predisposition to breast cancer, ovarian cancer and prostate cancer as well as colon cancer. Prognosis for this cancer survival depends upon the stage at which cancer is diagnosed. Reliable and rapid mutation detection is crucial for the early diagnosis and treatment. We developed an electronic assay for the detection of a representative single nucleotide polymorphism (SNP), deletion and insertion in BRCA1 gene by the microelectronics microarray instrumentation. The assay is rapid, and it takes 30 minutes for the immobilization of target DNA samples, hybridization, washing and readout. The assay is multiplexing since it is carried out at the same temperature and buffer conditions for each step. The assay is also highly specific, as the signal-to-noise ratio is much larger than recommended value (72.86 to 321.05 vs. 5) for homozygotes genotyping, and signal ratio close to the perfect value 1 for heterozygotes genotyping (1.04).

  14. Application of Aloe vera gel instead of silicon dioxide as organic dielectric material in microelectronics

    Directory of Open Access Journals (Sweden)

    Rana Sardar Masud

    2015-09-01

    Full Text Available Organic materials are now being used in a wide range of microelectronic applications in parallel with inorganic materials, because of their superior properties, environmental safety, and low cost. This paper describes the characterization of Aloe vera gel (AVG, a new organic dielectric material. The surface morphology, spatial distribution of elements, and structural characteristics of an AVG layer were examined using scanning electron microscopy, energy-dispersive X-ray spectroscopy (EDX, and X-ray diffraction (XRD, respectively. The resistance of the AVG layer, determined using a four-probe station, was 640 Ω EDX showed that the elements contained in the layer were carbon, oxygen, aluminum, silicon, calcium, potassium, and copper. The XRD results suggested that the sample primarily consisted of bornite (Cu5FeS4, geerite (Cu8S5, sal ammoniac (NH4Cl, and carobbite (KF.

  15. Trieste conference on digital microelectronics and microprocessors in particle physics: Summary and concluding remarks

    Energy Technology Data Exchange (ETDEWEB)

    Nash, T.

    1988-08-01

    This paper is a written version of the Concluding Remarks presented at the International Conference on the Impact of Digital Microelectronics and Microprocessors on Particle Physics. The Conference emphasized on-line data acquisition and triggering problems in high energy physics. Among the participants there was a clearly growing consensus that as these real time systems become larger they require more attention from the beginning to overall system coherence and manageability issues. We consider what this means for SSC/LHC era detectors. Given the interesting results on pixel silicon, neural networks, and parallel microprocessor based computers presented at Trieste, we speculate on some surprisingly simple, though still very radical, ideas on systems solutions for those huge detectors.

  16. SAVANT analysis of the microelectronics and photonics testbed solar cell data

    Energy Technology Data Exchange (ETDEWEB)

    Walters, Robert J.; Summers, G.P. [Naval Research Lab., Code 6818, Washington, DC (United States); Messenger, S.R. [SFA, Inc., Largo, MD (United States); Morton, T.L. [Ohio Aerospace Inst., Cleveland, OH (United States)

    2005-07-01

    An analysis of solar array data from the Microelectronic and Photonic Testbed (MPTB) space experiment is presented. The data are analyzed using the displacement damage dose (D{sub d}) methodology developed by the US Naval Research Laboratory (NRL) as implemented in the Solar Array Verification and Analysis Tool (SAVANT). SAVANT is a WindowsTM-based computer code that predicts the on-orbit performance of a solar cell in a specified Earth orbit. The predicted solar cell performance produced by the SAVANT code are compared with the measured on-orbit data. In addition, the calculated data are compared with onboard dosimeter measurements. The results allow both a validation of the SAVANT code and a comparison of the space environment models with measured on-orbit data. The results show the models to match the measured data within a factor of 2. (Author)

  17. Discussion on advanced manufacturing

    Institute of Scientific and Technical Information of China (English)

    WANG Xiankui

    2007-01-01

    Advanced manufacturing consists of continuity of manufacturing,its broad sense,and the core of the manufacturing process.The technology of continuous manufacturing is discussed according to both historical and modern perspectives.The relationship between human development and manufacturing technology is also discussed.Manufacturing is a continuously evolving topic.It is not only the foundation and means of imagination,conception,the science,and the technology of material change,but also the expression of national economy,national defense,and the support industries.The broad sense of manufacturing theory,which extends the concept of manufacturing,is an important development in the 20th century.The sense is analyzed in connection with design,material forming theory,synthesis of manufacturing technology,manufacturing modes,life cycle of product,hardware and sottware,and support environment,etc.At the same time,the core action and the development of the theory and technology of process is also discussed.At the end of this paper,the development directions of mechanical manufacturing science and technology are mentioned.

  18. PERFORMANCE EVALUATION OF TYPE I MARINE SANITATION DEVICES

    Science.gov (United States)

    This performance test was designed to evaluate the effectiveness of two Type I Marine Sanitation Devices (MSDs): the Electro Scan Model EST 12, manufactured by Raritan Engineering Company, Inc., and the Thermopure-2, manufactured by Gross Mechanical Laboratories, Inc. Performance...

  19. Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages.

    Science.gov (United States)

    Carlton, Holly D; Elmer, John W; Li, Yan; Pacheco, Mario; Goyal, Deepak; Parkinson, Dilworth Y; MacDowell, Alastair A

    2016-04-13

    Synchrotron radiation micro-tomography (SRµT) is a non-destructive three-dimensional (3D) imaging technique that offers high flux for fast data acquisition times with high spatial resolution. In the electronics industry there is serious interest in performing failure analysis on 3D microelectronic packages, many which contain multiple levels of high-density interconnections. Often in tomography there is a trade-off between image resolution and the volume of a sample that can be imaged. This inverse relationship limits the usefulness of conventional computed tomography (CT) systems since a microelectronic package is often large in cross sectional area 100-3,600 mm(2), but has important features on the micron scale. The micro-tomography beamline at the Advanced Light Source (ALS), in Berkeley, CA USA, has a setup which is adaptable and can be tailored to a sample's properties, i.e., density, thickness, etc., with a maximum allowable cross-section of 36 x 36 mm. This setup also has the option of being either monochromatic in the energy range ~7-43 keV or operating with maximum flux in white light mode using a polychromatic beam. Presented here are details of the experimental steps taken to image an entire 16 x 16 mm system within a package, in order to obtain 3D images of the system with a spatial resolution of 8.7 µm all within a scan time of less than 3 min. Also shown are results from packages scanned in different orientations and a sectioned package for higher resolution imaging. In contrast a conventional CT system would take hours to record data with potentially poorer resolution. Indeed, the ratio of field-of-view to throughput time is much higher when using the synchrotron radiation tomography setup. The description below of the experimental setup can be implemented and adapted for use with many other multi-materials.

  20. Assessment of technical documentation of Annex II medical devices

    NARCIS (Netherlands)

    Roszek B; Drongelen AW van; Geertsma RE; Tienhoven EAE van; BMT

    2005-01-01

    An investigation was carried out on the availability and quality of the technical documentation (file) of medical devices. Manufacturers of medical devices are obliged to prepare and maintain documentation complying with the provisions in the Medical Device Directive (MDD). Manufacturers are legall

  1. DEVELOPMENT OF A CANDLE FILTER FAILURE SAFEGUARD DEVICE

    Energy Technology Data Exchange (ETDEWEB)

    G.J. Bruck; E.E. Smeltzer; Z.N. Sanjana

    2002-06-06

    Development, testing and optimization of advanced metal and ceramic, barrier and fiber safeguard devices (SGDs) is described. Metal barrier devices are found prone to manufacturing defects and premature blinding. Fiber devices are found to be satisfactory if fine fibers are used. Durable alloys are identified for both oxidation and gasification conditions. Ceramic honeycomb SGDs were found to perform as excellent barrier devices. Optimization has shown such devices to be durable. Field testing of ceramic honeycomb SGDs from two different manufacturers is being pursued.

  2. Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices

    Energy Technology Data Exchange (ETDEWEB)

    Waechtler, Thomas

    2010-05-25

    Copper-based multi-level metallization systems in today's ultralarge-scale integrated electronic circuits require the fabrication of diffusion barriers and conductive seed layers for the electrochemical metal deposition. Such films of only several nanometers in thickness have to be deposited void-free and conformal in patterned dielectrics. The envisaged further reduction of the geometric dimensions of the interconnect system calls for coating techniques that circumvent the drawbacks of the well-established physical vapor deposition. The atomic layer deposition method (ALD) allows depositing films on the nanometer scale conformally both on three-dimensional objects as well as on large-area substrates. The present work therefore is concerned with the development of an ALD process to grow copper oxide films based on the metal-organic precursor bis(trin- butylphosphane)copper(I)acetylacetonate [({sup n}Bu{sub 3}P){sub 2}Cu(acac)]. This liquid, non-fluorinated {beta}-diketonate is brought to react with a mixture of water vapor and oxygen at temperatures from 100 to 160 C. Typical ALD-like growth behavior arises between 100 and 130 C, depending on the respective substrate used. On tantalum nitride and silicon dioxide substrates, smooth films and selfsaturating film growth, typical for ALD, are obtained. On ruthenium substrates, positive deposition results are obtained as well. However, a considerable intermixing of the ALD copper oxide with the underlying films takes place. Tantalum substrates lead to a fast self-decomposition of the copper precursor. As a consequence, isolated nuclei or larger particles are always obtained together with continuous films. The copper oxide films grown by ALD can be reduced to copper by vapor-phase processes. If formic acid is used as the reducing agent, these processes can already be carried out at similar temperatures as the ALD, so that agglomeration of the films is largely avoided. Also for an integration with subsequent electrochemical copper deposition, the combination of ALD copper and ruthenium proves advantageous, especially with respect to the quality of the electroplated films and their filling behavior in interconnect structures. Furthermore, the ALD process developed also bears potential for an integration with carbon nanotubes. (orig.)

  3. Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

    Science.gov (United States)

    2006-12-01

    Camacho and Ortiz, 1996; Carranza and Haber, 1998; Chaboche et al., 1997; Chandra et al., 2002; Geubelle and Baylor, 1998; Hattiangadi and Siegmund, 2004... Carranza , F.L., and Haber, R.B., 1998, "A Numerical Study of Integranular Fracture and Oxygen Embrittlement in an Elastic-Viscoplastic Solid," Journal

  4. Upgrading design of the 3B1A beamline for x-ray nanometre lithography of microelectronic devices at BSRF

    Institute of Scientific and Technical Information of China (English)

    Yi Fu-Ting; Ye Tian-Chun; Peng Liang-Qiang; Chen Da-Peng; Zhang Ju-Fang; Han Yong

    2004-01-01

    Beijing Synchrotron Radiation Facility is a partly dedicated synchrotron radiation source operated in either parasitic or dedicated mode. The 3B1A beamline, extracted from a bending magnet, was originally designed as a soft x-ray beamline for submicro x-ray lithography with critical lateral size just below 1μm in 1988 and no change has been made since it was built. But later the required resolution of x-ray lithography has changed from sub-micrometre to the nanometre in the critical lateral size. This beamline can longer more meet the requirement for x-ray nano lithography and has to be modified to fit the purpose. To upgrade the design of the 3B1A beamline for x-ray nano lithography, a mirror is used to reflect and scan the x-ray beam for the nano lithography station, but the mirror's grazing angle is changed to 27.9mrad in the vertical direction, and the convex curve needs to be modified to fit the change; the tiny change of mirror scanning angle is firstly considered to improve the uniformity of the x-ray spot on the wafer by controlling the convex curve.

  5. A well-conditioned integral-equation formulation for efficient transient analysis of electrically small microelectronic devices

    KAUST Repository

    Bagci, Hakan

    2010-05-01

    A hierarchically regularized coupled set of time-domain surface and volume electric field integral-equations (TD-S-EFIE and TD-V-EFIE) for analyzing electromagnetic wave interactions with electrically small and geometrically intricate composite structures comprising perfect electrically conducting surfaces and finite dielectric volumes is presented. A classically formulated coupled set of TD-S- and V-EFIEs is shown to be ill-conditioned at low frequencies owing to the hypersingular nature of the TD-S-EFIE. To eliminate low-frequency breakdown in marching-on-in-time solvers for these coupled equations, a hierarchical regularizer leveraging generalized RaoWiltonGlisson functions is applied to the TD-S-EFIE; no regularization is applied to the TD-V-EFIE as it is protected from low-frequency breakdown by an identity term. The resulting hierarchically regularized hybrid TD-S- and V-EFIE solver is applicable to the analysis of wave interactions with electrically small and densely meshed structures of arbitrary topology. The accuracy, efficiency, and applicability of the proposed solver are demonstrated by analyzing crosstalk in a six-port transmission line, radiation from a miniature radio-frequency identification antenna, and, plane-wave coupling onto a partially-shielded and fully loaded two-layer computer board. © 2006 IEEE.

  6. Bio-Manufacturing to market pilot project

    Energy Technology Data Exchange (ETDEWEB)

    Dressen, Tiffaney [Univ. of California, Berkeley, CA (United States)

    2017-09-25

    The Bio-Manufacturing to Market pilot project was a part of the AMJIAC, the Advanced Manufacturing Jobs and Innovation Accelerator Challenge grant. This internship program set out to further define and enhance the talent pipeline from the University and local Community Colleges to startup culture in East Bay Area, provide undergraduate STEM students with opportunities outside academia, and provide startup companies with much needed talent. Over the 4 year period of performance, the Bio-Manufacturing to Market internship program sponsored 75 undergraduate STEM students who were able to spend anywhere from one to six semesters working with local Bay Area startup companies and DOE sponsored facilities/programs in the biotech, bio-manufacturing, and biomedical device fields.

  7. Modeling SiO2 Ion Impurities Aging in Insulated Gate Power Devices Under Temperature and Voltage Stress

    Science.gov (United States)

    2010-10-01

    and Widom , 2000). For power devices that are fabricated with vertical technology, oxide contamination and field distortion are the predominant...down ultra-thin SiO2 layers in MOS devices”, Microelectronics Reliability, Vol. 44, pp. 1-23. 2004. Feinberg, A.A., Ersland, P., Kaper, V., and Widom ...A., “On aging of key transistor device parameters,” in Proc. Inst. Environmental Sciences &Technology, 2000, pp. 231–236. Feinberg, A.A., Widom

  8. Preliminary investigation of polystyrene/MoS{sub 2}-Oleylamine polymer composite for potential application as low-dielectric material in microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Landi, Giovanni, E-mail: glandi@unisa.it [Institute for Polymers, Composites and Biomaterials (IPCB-CNR), P. Enrico Fermi 1, 80055 Portici (Italy); Department of Industrial Engineering, University of Salerno, Via G. Paolo II 132, 84084 Fisciano (Italy); Altavilla, Claudia; Iannace, Salvatore; Sorrentino, Andrea, E-mail: andrea.sorrentino@cnr.it [Institute for Polymers, Composites and Biomaterials (IPCB-CNR), P. Enrico Fermi 1, 80055 Portici (Italy); Ciambelli, Paolo [Department of Industrial Engineering, University of Salerno, Via G. Paolo II 132, 84084 Fisciano (Italy); Centre NANO-MATES, University of Salerno, Fisciano, Via G. Paolo II 132, 84084 Fisciano (Italy); Neitzert, Heinrich C. [Department of Industrial Engineering, University of Salerno, Via G. Paolo II 132, 84084 Fisciano (Italy)

    2015-12-17

    Insulating materials play a vital role in the design and performance of electrical systems for both steady and transient state conditions. Among the other properties, also in this field, polymer nanocomposites promise to offer exciting improvements. Many studies in the last decade has witnessed significant developments in the area of nano-dielectric materials and significant effects of nano-scale fillers on electric, thermal and mechanical properties of polymeric materials have been observed. However, the developments of new and advanced materials to be used the miniaturization of electronic devices fabrication require extensive studies on electrical insulation characteristics of these materials before they can be used in commercial systems. In this work, Polystyrene (PS) composites were prepared by the blend solution method using MoS{sub 2}@Oleylamine nanosheets as filler. The dielectric properties of the resulting comoposite have been investigated at 300K and in the frequency range between 1000 Hz and 1 MHz. The addition of the MoS{sub 2}@Oleylamine nanosheets leads to a decreasing of the relative dielectric constant and of the electrical conductivity measured in the voltage range between ±500V. Thanks to a possibility to tune the electrical permittivity with the control of MoS{sub 2} concentration, these materials could be used as a low-dielectric material in the microelectronics applications.

  9. 21 CFR 820.130 - Device packaging.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect...

  10. MEASURING MANUFACTURING INNOVATIVENESS

    DEFF Research Database (Denmark)

    Blichfeldt, Henrik; Knudsen, Mette Præst

    2017-01-01

    Globalization and customization increases the pressure on manufacturing companies, and the ability to provide innovativeness is a potential source of competitive advantage. This paper positions the manufacturing entity in the innovation process, and investigates the relation between innovation vers...... technology and organizational concepts. Based on Danish survey data from the European Manufacturing Survey (EMS-2015) this paper finds that there is a relation between innovative companies, and their level of technology and use of organizational concepts. Technology and organizational concepts act...... as manufacturing levers to support the manufacturing and production system to provide innovativeness. The managerial implication lies in building manufacturing capabilities to support the innovative process, by standardization, optimization and creating stability in combination with automation and advanced...

  11. Manufacturing ontology through templates

    Directory of Open Access Journals (Sweden)

    Diciuc Vlad

    2017-01-01

    Full Text Available The manufacturing industry contains a high volume of knowhow and of high value, much of it being held by key persons in the company. The passing of this know-how is the basis of manufacturing ontology. Among other methods like advanced filtering and algorithm based decision making, one way of handling the manufacturing ontology is via templates. The current paper tackles this approach and highlights the advantages concluding with some recommendations.

  12. Advanced Manufacturing Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The Advanced Manufacturing Laboratory at the University of Maryland provides the state of the art facilities for realizing next generation products and educating the...

  13. Composite Structures Manufacturing Facility

    Data.gov (United States)

    Federal Laboratory Consortium — The Composite Structures Manufacturing Facility specializes in the design, analysis, fabrication and testing of advanced composite structures and materials for both...

  14. Manufacturing Demonstration Facility (MDF)

    Data.gov (United States)

    Federal Laboratory Consortium — The U.S. Department of Energy Manufacturing Demonstration Facility (MDF) at Oak Ridge National Laboratory (ORNL) provides a collaborative, shared infrastructure to...

  15. Water-walking devices

    Science.gov (United States)

    Hu, David L.; Prakash, Manu; Chan, Brian; Bush, John W. M.

    We report recent efforts in the design and construction of water-walking machines inspired by insects and spiders. The fundamental physical constraints on the size, proportion and dynamics of natural water-walkers are enumerated and used as design criteria for analogous mechanical devices. We report devices capable of rowing along the surface, leaping off the surface and climbing menisci by deforming the free surface. The most critical design constraint is that the devices be lightweight and non-wetting. Microscale manufacturing techniques and new man-made materials such as hydrophobic coatings and thermally actuated wires are implemented. Using highspeed cinematography and flow visualization, we compare the functionality and dynamics of our devices with those of their natural counterparts.

  16. CRADA final report: Technical assessment of roll-to-roll operation of lamination process, thermal treatment, and alternative carbon fiber precursors for low-cost, high-efficiency manufacturing of flow battery stacks and other energy devices

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, Claus [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Madden, Thomas [Lockheed Martin Corp., Oak Ridge, TN (United States); Wood, III, David L [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Muth, Thomas R. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Warrington, Curtis [Lockheed Martin Corp., Oak Ridge, TN (United States); Ozcan, Soydan [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Manson, Hunter [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Tekinalp, Halil L. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Smith, Mark A. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Lu, Yuan [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Loretz, Jeremy [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2015-09-23

    Among the various stationary-storage technologies under development, redox flow batteries (RFBs) offer the greatest potential to deliver inexpensive, scalable, and efficient grid-scale electrical-energy storage. Unlike traditional sealed batteries, in a flow battery power and energy are decoupled. Cell area and cell count in the stack determine the device power, and the chemical storage volume determines the total energy. Grid-scale energy-storage applications require megawatt-scale devices, which require the assembly of hundreds of large-area, bipolar cells per power plant. The cell-stack is the single system component with the largest impact on capital cost (due to the large number of highly engineered components) and operating costs (determined by overall round-trip efficiency).

  17. RADC/NBS (Rome Air Development Center/National Bureau of Standards) Workshop. Moisture Measurement and Control for Microelectronics (4)

    Science.gov (United States)

    Kane, Didier; Moore, Benjamin A.; Walters, E. Jane

    1987-06-01

    The fourth workshop on Moisture Measurement and Control for Microelectronics served as a forum on moisture and/or materials reliability problems and on ways to control them or measure their extent. Twenty-two presentations are included which contain detailed information on hermeticity measurement and definition; development of standard packages for mass spectrometric calibrations; moisture interaction with various materials; and techniques that can be used to measure moisture microelectronics. It was clear from several presentations in the workshop that a very systematic approach is needed when organic materials are involved; all the variables must be identified and studied one at a time. This is the key to lot-to-lot reproducibility, materials selection, and control; hence a better reliability at the design phase will decrease the need for testing; hence the cost, thus resulting in a greater satisfaction to the customer.

  18. Additive Manufactured Product Integrity

    Science.gov (United States)

    Waller, Jess; Wells, Doug; James, Steve; Nichols, Charles

    2017-01-01

    NASA is providing key leadership in an international effort linking NASA and non-NASA resources to speed adoption of additive manufacturing (AM) to meet NASA's mission goals. Participants include industry, NASA's space partners, other government agencies, standards organizations and academia. Nondestructive Evaluation (NDE) is identified as a universal need for all aspects of additive manufacturing.

  19. Modern manufacturing engineering

    CERN Document Server

    2015-01-01

    This book covers recent research and trends in Manufacturing Engineering. The chapters emphasize different aspects of the transformation from materials to products. It provides the reader with fundamental materials treatments and the integration of processes. Concepts such as green and lean manufacturing are also covered in this book.

  20. Strategic Roles of Manufacturing

    DEFF Research Database (Denmark)

    Yang, Cheng

    are accordingly elaborated to address the identified theoretical gaps: • Regarding manufacturing role, the first initial research question is still taken as the starting point, but specific attention is paid on: (1) exploring empirical evidence on the proactive role of manufacturing and investigate how...