Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

Science.gov (United States)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is

Astrophysics Laboratory-Based Lecture Material Development of Solarscope with Integration and Interconnection

Directory of Open Access Journals (Sweden)

Asih Melati

2015-12-01

Full Text Available The development of laboratory-based lecture materials with integrated and interconnected value is a requirement for study and practical materials and in line with the vision and mission of UIN Sunan Kalijaga. As a result, the optimization of laboratory’s equipment is urgently needed. Although UIN Sunan Kalijaga Laboratory have had Solarscope telescope – which have a guidebook in German language – for six years, it was not optimally used even it can be used to satisfy the desires to observe astronomical objects economically, accurately and easy to operate. Based on above, this research propose to create a lab-work module for Solarscope with integration and interconnection value. This research used 4D methodology (Define, Design, Develop and Disseminate and have passed the assessment and validation phase from material, media and integrated-interconnected value experts. The data analysis of the module which was mapped by Sukarja into 5 scale mark resulted in good grade in the module assessment by material experts with 80% from the ideal mark with most of the complaint is in the formula typing which is not clear in its derivative. The module assessment by media experts scored very good grade with 88.89% from the ideal mark regarding the content and the figures of the module. Lastly, from the integrated-interconnected value experts marked in good grade with 73.50% from the ideal mark and suggested the addition of supported Al-Qur’an verses and relevant exclamation of the Al-Qur’an’s passages. With all of these assessment results, this module can be used as the material of astrophysics lab-work and for supporting students’ researches with integration-interconnection value and enhance the university’s book collection which will support the vision and mission of UIN Sunan Kalijaga

Integrated optoelectronic materials and circuits for optical interconnects

International Nuclear Information System (INIS)

Hutcheson, L.D.

1988-01-01

Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

Experimental demonstration of titanium nitride plasmonic interconnects

DEFF Research Database (Denmark)

Kinsey, N.; Ferrera, M.; Naik, G. V.

2014-01-01

An insulator-metal-insulator plasmonic interconnect using TiN, a CMOS-compatible material, is proposed and investigated experimentally at the telecommunication wavelength of 1.55 mu m. The TiN waveguide was shown to obtain propagation losses less than 0.8 dB/mm with a mode size of 9.8 mu m...

Floating dielectric slab optical interconnection between metal-dielectric interface surface plasmon polariton waveguides.

Science.gov (United States)

Kang, Minsu; Park, Junghyun; Lee, Il-Min; Lee, Byoungho

2009-01-19

A simple and effective optical interconnection which connects two distanced single metal-dielectric interface surface plasmon waveguides by a floating dielectric slab waveguide (slab bridge) is proposed. Transmission characteristics of the suggested structure are numerically studied using rigorous coupled wave analysis, and design rules based on the study are given. In the wave-guiding part, if the slab bridge can support more than the fundamental mode, then the transmission efficiency of the interconnection shows strong periodic dependency on the length of the bridge, due to the multi-mode interference (MMI) effect. Otherwise, only small fluctuation occurs due to the Fabry-Pérot effect. In addition, light beating happens when the slab bridge is relatively short. In the wave-coupling part, on the other hand, gap-assisted transmission occurs at each overlapping region as a consequence of mode hybridization. Periodic dependency on the length of the overlap region also appears due to the MMI effect. According to these results, we propose design principles for achieving both high transmission efficiency and stability with respect to the variation of the interconnection distance, and we show how to obtain the transmission efficiency of 68.3% for the 1mm-long interconnection.

Laser printed interconnects for flexible electronics

Science.gov (United States)

Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

Tubular solid oxide fuel cells with porous metal supports and ceramic interconnections

Science.gov (United States)

Huang, Kevin [Export, PA; Ruka, Roswell J [Pittsburgh, PA

2012-05-08

An intermediate temperature solid oxide fuel cell structure capable of operating at from 600.degree. C. to 800.degree. C. having a very thin porous hollow elongated metallic support tube having a thickness from 0.10 mm to 1.0 mm, preferably 0.10 mm to 0.35 mm, a porosity of from 25 vol. % to 50 vol. % and a tensile strength from 700 GPa to 900 GPa, which metallic tube supports a reduced thickness air electrode having a thickness from 0.010 mm to 0.2 mm, a solid oxide electrolyte, a cermet fuel electrode, a ceramic interconnection and an electrically conductive cell to cell contact layer.

Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug 'n' play functionality

DEFF Research Database (Denmark)

Perozziello, Gerardo; Bundgaard, Frederik; Geschke, Oliver

2008-01-01

A crucial challenge in packaging of microsystems is microfluidic interconnections. These have to seal the ports of the system, and have to provide the appropriate interface to other devices or the external environment. Integrated fluidic interconnections appear to be a good solution for interconn...... external metal ferrules and the system. Theoretical calculations are made to dimension and model the integrated fluidic interconnection. Leakage tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits....

Alternative materials for solid oxide fuel cells: Factors affecting air-sintering of chromite interconnections

International Nuclear Information System (INIS)

Chick, L.A.; Bates, J.L.

1992-01-01

The purpose of this research is to develop alternative materials for solid oxide fuel cell (SOFC) interconnections and electrodes with improved electrical, thermal and electrochemical properties. Another objective is to develop synthesis and fabrication processes for these materials whereby they can be consolidated in air into SOFC's. The approach is to (1) develop modifications of the current, state-of-the-art materials used in SOFC's, (2) minimize the number of cations used in the SOFC materials to reduce potential deleterious interactions, (3) improve thermal, electrical, and electrochemical properties, (4) develop methods to synthesize both state-of-the-art and alternative materials for the simultaneous fabrication and consolidation in air of the interconnections and electrodes with the solid electrolyte, and (5) understand electrochemical reactions at materials interfaces and the effects of component compositions and processing on those reactions

Electrophoretic deposition of Mn1.5Co1.5O4 on metallic interconnect and interaction with glass-ceramic sealant for solid oxide fuel cells application

DEFF Research Database (Denmark)

Smeacetto, Federico; De Miranda, Auristela; Cabanas Polo, Sandra

2015-01-01

Cr-containing stainless steels are widely used as metallic interconnects for SOFCs. Volatile Cr-containing species, which originate from the oxide formed on steel, can poison the cathode material and subsequently cause degradation in the SOFC stack. Mn1.5Co1.5O4 spinel is one of the most promisin...... between Mn1.5Co1.5O4 coated Crofer22APU and a new glass-ceramic sealant, after 500 h of thermal tests in air, thus suggesting that the spinel protection layer can effectively act as a barrier to outward diffusion of Cr. [All rights reserved Elsevier].......Cr-containing stainless steels are widely used as metallic interconnects for SOFCs. Volatile Cr-containing species, which originate from the oxide formed on steel, can poison the cathode material and subsequently cause degradation in the SOFC stack. Mn1.5Co1.5O4 spinel is one of the most promising...... coating materials due to its high electrical conductivity, good CTE match with the stainless steel substrate and an excellent chromium retention capability. In this work Mn1.5Co1.5O4 spinel coatings are deposited on Crofer22APU substrates by cathodic electrophoretic deposition (EPD) followed by sintering...

Multilevel Dual Damascene copper interconnections

Science.gov (United States)

Lakshminarayanan, S.

C, 500oC and 600oC for Ti, TiN and Ta barriers respectively. Via resistivity on the order of 10-9/ /Omegacm2 was measured for Cu/Ta/Cu interfaces and no degradation in the via resistance was observed upto 600oC on the 2 μm and 3 μm wide contact windows. Characterization of diode leakage and subthreshold currents of CMOS transistors fabricated with Ta adhesion layers, showed the failure of the Ta barrier at 450oC. Despite the good barrier performance of the CVD TiN films, obtaining low contact resistivity may be a concern. The potential use of Cu-Mg alloy as the backend metallization has also been studied. Fully encapsulated wiring has been fabricated by causing the Mg to out- diffuse towards the Cu/SiO2 interfaces and the free copper surface. The inter-connects exhibited good stability and oxidation resistance, but via resistances were extremely high, probably due to the presence of insulating films like MgO or MgF2 at the interface between the two metal levels. It may be possible to decrease the via resistance to values comparable to Cu/Ta/Cu by altering the process flow and using a suitable via clean. When used at the contact level, undesirable interaction with the CoSi2 film was observed at temperatures as low as 350oC. Another problem was the high contact resistance at the Cu-Mg/CoSi2 interface. Hence the use of this alloy as a contact fill material is not feasible at this time. An additional barrier layer may be required between the Cu-Mg and CoSi2 films to protect the integrity of the silicide and provide low contact resistance.

Development of a Ni-based superalloy with cellular structure and interconnected micro porosity

International Nuclear Information System (INIS)

Bernabe, A.; Lopez, E.; Gil-Sevillano, J.

1998-01-01

A cellular metallic material with interconnected porosity of controlled size of an order of 10 μm has been developed by electrochemical dissolution of tungsten grains in a W-Ni-Fe heavy alloy. The nickel superalloy with sponge structure and high surface/volume ratio can also be processed recycling chips from heavy metal machining (Patent number p9700191, 1997). Applications for the new materials could be found as support for catalysts, high temperature filters for corrosive fluids, burners, etc. (Author) 10 refs

Pulsed laser planarization of metal films for multilevel interconnects

International Nuclear Information System (INIS)

Tuckerman, D.B.; Schmitt, R.L.

1985-05-01

Multilevel interconnect schemes for integrated circuits generally require one or more planarization steps, in order to maintain an acceptably flat topography for lithography and thin-film step coverage on the higher levels. Traditional approaches have involved planarization of the interlevel insulation (dielectric) layers, either by spin-on application (e.g., polyimide), or by reflow (e.g., phosphosilicate glass). We have pursued an alternative approach, in which each metal level is melted (hence planarized) using a pulsed laser prior to patterning. Short (approx.1 μs) pulses are used to preclude undesirable metallurgical reactions between the film, adhesion or barrier layer, and dielectric layer. Laser planarization of metals is particularly well suited to multilevel systems which include ground or power planes. Results are presented for planarization of gold films on SiO 2 dielectric layers using a flashlamp-pumped dye laser. The pulse duration is approx.1 μs, which allows the heat pulse to uniformly penetrate the gold while not penetrating substantially through the underlying SiO 2 (hence not perturbing the lower levels of metal). Excellent planarization of the gold films is achieved (less than 0.1 μm surface roughness, even starting with extreme topographic variations), as well as improved conductivity. To demonstrate the process, numerous planarized two-layer structures (transmission lines under a ground plane) were fabricated and characterized. 9 refs., 2 figs

Electro-optic techniques for VLSI interconnect

Science.gov (United States)

Neff, J. A.

1985-03-01

A major limitation to achieving significant speed increases in very large scale integration (VLSI) lies in the metallic interconnects. They are costly not only from the charge transport standpoint but also from capacitive loading effects. The Defense Advanced Research Projects Agency, in pursuit of the fifth generation supercomputer, is investigating alternatives to the VLSI metallic interconnects, especially the use of optical techniques to transport the information either inter or intrachip. As the on chip performance of VLSI continues to improve via the scale down of the logic elements, the problems associated with transferring data off and onto the chip become more severe. The use of optical carriers to transfer the information within the computer is very appealing from several viewpoints. Besides the potential for gigabit propagation rates, the conversion from electronics to optics conveniently provides a decoupling of the various circuits from one another. Significant gains will also be realized in reducing cross talk between the metallic routings, and the interconnects need no longer be constrained to the plane of a thin film on the VLSI chip. In addition, optics can offer an increased programming flexibility for restructuring the interconnect network.

Metal-interconnection-free integration of InGaN/GaN light emitting diodes with AlGaN/GaN high electron mobility transistors

Energy Technology Data Exchange (ETDEWEB)

Liu, Chao; Cai, Yuefei; Liu, Zhaojun; Ma, Jun; Lau, Kei May, E-mail: eekmlau@ust.hk [Photonics Technology Center, Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon (Hong Kong)

2015-05-04

We report a metal-interconnection-free integration scheme for InGaN/GaN light emitting diodes (LEDs) and AlGaN/GaN high electron mobility transistors (HEMTs) by combining selective epi removal (SER) and selective epitaxial growth (SEG) techniques. SER of HEMT epi was carried out first to expose the bottom unintentionally doped GaN buffer and the sidewall GaN channel. A LED structure was regrown in the SER region with the bottom n-type GaN layer (n-electrode of the LED) connected to the HEMTs laterally, enabling monolithic integration of the HEMTs and LEDs (HEMT-LED) without metal-interconnection. In addition to saving substrate real estate, minimal interface resistance between the regrown n-type GaN and the HEMT channel is a significant improvement over metal-interconnection. Furthermore, excellent off-state leakage characteristics of the driving transistor can also be guaranteed in such an integration scheme.

Metal-interconnection-free integration of InGaN/GaN light emitting diodes with AlGaN/GaN high electron mobility transistors

International Nuclear Information System (INIS)

Liu, Chao; Cai, Yuefei; Liu, Zhaojun; Ma, Jun; Lau, Kei May

2015-01-01

We report a metal-interconnection-free integration scheme for InGaN/GaN light emitting diodes (LEDs) and AlGaN/GaN high electron mobility transistors (HEMTs) by combining selective epi removal (SER) and selective epitaxial growth (SEG) techniques. SER of HEMT epi was carried out first to expose the bottom unintentionally doped GaN buffer and the sidewall GaN channel. A LED structure was regrown in the SER region with the bottom n-type GaN layer (n-electrode of the LED) connected to the HEMTs laterally, enabling monolithic integration of the HEMTs and LEDs (HEMT-LED) without metal-interconnection. In addition to saving substrate real estate, minimal interface resistance between the regrown n-type GaN and the HEMT channel is a significant improvement over metal-interconnection. Furthermore, excellent off-state leakage characteristics of the driving transistor can also be guaranteed in such an integration scheme

Processing and Prolonged 500 C Testing of 4H-SiC JFET Integrated Circuits with Two Levels of Metal Interconnect

Science.gov (United States)

Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

2015-01-01

Complex integrated circuit (IC) chips rely on more than one level of interconnect metallization for routing of electrical power and signals. This work reports the processing and testing of 4H-SiC junction field effect transistor (JFET) prototype IC's with two levels of metal interconnect capable of prolonged operation at 500 C. Packaged functional circuits including 3- and 11-stage ring oscillators, a 4-bit digital to analog converter, and a 4-bit address decoder and random access memory cell have been demonstrated at 500 C. A 3-stage oscillator functioned for over 3000 hours at 500 C in air ambient. Improved reproducibility remains to be accomplished.

Metallic composite materials

International Nuclear Information System (INIS)

Frommeyer, G.

1987-01-01

The structure and properties of metallic composite materials and composite materials with metallic matrix are considered. In agreement with the morphology of constituent phases the following types of composite materials are described: dispersion-strengthened composite materials; particle-reinforced composite materials; fibrous composite materials; laminar composite materials. Data on strength and electric properties of the above-mentioned materials, as well as effect of the amount, location and geometric shape of the second phase on them, are presented

Opto-Electronic and Interconnects Hierarchical Design Automation System (OE-IDEAS)

National Research Council Canada - National Science Library

Turowski, M

2004-01-01

As microelectronics technology continues to advance, the associated electrical interconnection technology is not likely to keep pace, due to many parasitic effects appearing in metallic interconnections...

Chip-Level Electromigration Reliability for Cu Interconnects

International Nuclear Information System (INIS)

Gall, M.; Oh, C.; Grinshpon, A.; Zolotov, V.; Panda, R.; Demircan, E.; Mueller, J.; Justison, P.; Ramakrishna, K.; Thrasher, S.; Hernandez, R.; Herrick, M.; Fox, R.; Boeck, B.; Kawasaki, H.; Haznedar, H.; Ku, P.

2004-01-01

Even after the successful introduction of Cu-based metallization, the electromigration (EM) failure risk has remained one of the most important reliability concerns for most advanced process technologies. Ever increasing operating current densities and the introduction of low-k materials in the backend process scheme are some of the issues that threaten reliable, long-term operation at elevated temperatures. The traditional method of verifying EM reliability only through current density limit checks is proving to be inadequate in general, or quite expensive at the best. A Statistical EM Budgeting (SEB) methodology has been proposed to assess more realistic chip-level EM reliability from the complex statistical distribution of currents in a chip. To be valuable, this approach requires accurate estimation of currents for all interconnect segments in a chip. However, no efficient technique to manage the complexity of such a task for very large chip designs is known. We present an efficient method to estimate currents exhaustively for all interconnects in a chip. The proposed method uses pre-characterization of cells and macros, and steps to identify and filter out symmetrically bi-directional interconnects. We illustrate the strength of the proposed approach using a high-performance microprocessor design for embedded applications as a case study

Metallic materials for medical use

OpenAIRE

Illarionov Anatoly; Belikov Sergey; Grib Stella; Yurovskikh Artem

2017-01-01

This article provides a brief overview of the metallic materials used as implants in orthopedics, the alloying system and a complex of the physical-mechanical properties for metallic materials certified for medical use, as well as the advantages and drawbacks of using metallic materials as implants. Approaches to improve the quality of an implant made of metallic materials are noted.

An Interconnected Network of Core-Forming Melts Produced by Shear Deformation

Science.gov (United States)

Bruhn, D.; Groebner, N.; Kohlstedt, D. L.

2000-01-01

The formation mechanism of terrestrial planetary is still poorly understood, and has been the subject of numerous experimental studies. Several mechanisms have been proposed by which metal-mainly iron with some nickel-could have been extracted from a silicate mantle to form the core. Most recent models involve gravitational sinking of molten metal or metal sulphide through a partially or fully molten mantle that is often referred to as a'magma ocean. Alternative models invoke percolation of molten metal along an interconnected network (that is, porous flow) through a solid silicate matrix. But experimental studies performed at high pressures have shown that, under hydrostatic conditions, these melts do not form an interconnected network, leading to the widespread assumption that formation of metallic cores requires a magma ocean. In contrast, here we present experiments which demonstrate that shear deformation to large strains can interconnect a significant fraction of initially isolated pockets of metal and metal sulphide melts in a solid matrix of polycrystalline olivine. Therefore, in a dynamic (nonhydrostatic) environment, percolation remains a viable mechanism for the segregation and migration of core-forming melts in a solid silicate mantle.

Three-dimensional interconnected cobalt oxide-carbon hollow spheres arrays as cathode materials for hybrid batteries

Directory of Open Access Journals (Sweden)

Jiye Zhan

2016-06-01

Full Text Available Hierarchical porous metal oxides arrays is critical for development of advanced energy storage devices. Herein, we report a facile template-assisted electro-deposition plus glucose decomposition method for synthesis of multilayer CoO/C hollow spheres arrays. The CoO/C arrays consist of multilayer interconnected hollow composite spheres with diameters of ∼350 nm as well as thin walls of ∼20 nm. Hierarchical hollow spheres architecture with 3D porous networks are achieved. As cathode of high-rate hybrid batteries, the multilayer CoO/C hollow sphere arrays exhibit impressive enhanced performances with a high capacity (73.5 mAh g−1 at 2 A g−1, and stable high-rate cycling life (70 mAh g−1 after 12,500 cycles at 2 A g−1. The improved electrochemical performance is owing to the composite hollow-sphere architecture with high contact area between the active materials and electrolyte as well as fast ion/electron transportation path.

Carbon nanotubes for interconnects process, design and applications

CERN Document Server

Dijon, Jean; Maffucci, Antonio

2017-01-01

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes c...

Lightweight Metal RubberTM Sensors and Interconnects, Phase II

Data.gov (United States)

National Aeronautics and Space Administration — The objective of this NASA Phase II program is to develop and increase the Technology Readiness Level of multifunctional Metal RubberTM (MRTM) materials that can be...

Viewing Integrated-Circuit Interconnections By SEM

Science.gov (United States)

Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

1990-01-01

Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

A one-semester course in modeling of VSLI interconnections

CERN Document Server

Goel, Ashok

2015-01-01

Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

Investigations on effects of the hole size to fix electrodes and interconnection lines in polydimethylsiloxane

Science.gov (United States)

Behkami, Saber; Frounchi, Javad; Ghaderi Pakdel, Firouz; Stieglitz, Thomas

2017-11-01

Translational research in bioelectronics medicine and neural implants often relies on established material assemblies made of silicone rubber (polydimethylsiloxane-PDMS) and precious metals. Longevity of the compound is of utmost importance for implantable devices in therapeutic and rehabilitation applications. Therefore, secure mechanical fixation can be used in addition to chemical bonding mechanisms to interlock PDMS substrate and insulation layers with metal sheets for interconnection lines and electrodes. One of the best ways to fix metal lines and electrodes in PDMS is to design holes in electrode rims to allow for direct interconnection between top to bottom layer silicone. Hence, the best layouts and sizes of holes (up to 6) which provide sufficient stability against lateral and vertical forces have been investigated with a variety of numbers of hole in line electrodes, which are simulated and fabricated with different layouts, sizes and materials. Best stability was obtained with radii of 100, 72 and 62 µm, respectively, and a single central hole in aluminum, platinum and MP35N foil line electrodes of 400  ×  500 µm2 size and of thickness 20 µm. The study showed that the best hole size which provides line electrode immobility (of thickness less than 30 µm) within a central hole is proportional to reverse value of Young’s Modulus of the material used. Thus, an array of line electrodes was designed and fabricated to study this effect. Experimental results were compared with simulation data. Subsequently, an approximation curve was generated as design rule to propose the best radius to fix line electrodes according to the material thickness between 10 and 200 µm using PDMS as substrate material.

Cellular structures with interconnected microchannels

Science.gov (United States)

Shaefer, Robert Shahram; Ghoniem, Nasr M.; Williams, Brian

2018-01-30

A method for fabricating a cellular tritium breeder component includes obtaining a reticulated carbon foam skeleton comprising a network of interconnected ligaments. The foam skeleton is then melt-infiltrated with a tritium breeder material, for example, lithium zirconate or lithium titanate. The foam skeleton is then removed to define a cellular breeder component having a network of interconnected tritium purge channels. In an embodiment the ligaments of the foam skeleton are enlarged by adding carbon using chemical vapor infiltration (CVI) prior to melt-infiltration. In an embodiment the foam skeleton is coated with a refractory material, for example, tungsten, prior to melt infiltration.

Precious-metal-base advanced materials

International Nuclear Information System (INIS)

Nowicki, T.; Carbonnaux, C.

1993-01-01

Precious metals constitute also the base of several advanced materials used in the industry in hundreds of metric tons. Platinum alloys have been used as structural materials for equipments in the glass industry. The essential reason for this is the excellent resistance of platinum alloys to oxidation and electrolytical corrosion in molten glasses at temperatures as high as 1200-1500 C. The major drawback is a weak creep resistance. The unique way for significant improvement of platinum base materials creep resistance is a strengthening by an oxide dispersion (ODS). In the case of CLAL's patented ''Plativer'' materials, 0.05 wt% of Y 2 O 3 is incorporated within the alloy matrix by the flame spraying process. Further improvement of platinum base materials is related, in the authors opinion, to the development of precious metals base intermetallics. Another interesting applications of precious metals are silver base electrical contacts. They are in fact silver matrix composites containing varying amounts of well-dispersed particles of constituents such as CdO, SnO 2 , Ni, WC or C. In the case of such materials, particular properties are required and tested : resistance to arc erosion, resistance to welding and contact resistance. Many other technically fascinating precious metals base materials exist: brazing alloys for assembling metals, superconductors and ceramics; dental materials including magnetic biocompatible alloys; silver composites for superconductor wire jackets. The observation of current evolution indicates very clearly that precious metals cannot be replaced by common metals because of their unique characteristics due to their atomic level properties

Interconnecting Carbon Fibers with the In-situ Electrochemically Exfoliated Graphene as Advanced Binder-free Electrode Materials for Flexible Supercapacitor.

Science.gov (United States)

Zou, Yuqin; Wang, Shuangyin

2015-07-07

Flexible energy storage devices are highly demanded for various applications. Carbon cloth (CC) woven by carbon fibers (CFs) is typically used as electrode or current collector for flexible devices. The low surface area of CC and the presence of big gaps (ca. micro-size) between individual CFs lead to poor performance. Herein, we interconnect individual CFs through the in-situ exfoliated graphene with high surface area by the electrochemical intercalation method. The interconnected CFs are used as both current collector and electrode materials for flexible supercapacitors, in which the in-situ exfoliated graphene act as active materials and conductive "binders". The in-situ electrochemical intercalation technique ensures the low contact resistance between electrode (graphene) and current collector (carbon cloth) with enhanced conductivity. The as-prepared electrode materials show significantly improved performance for flexible supercapacitors.

Knowledge-based metals & materials

OpenAIRE

Sasson, Amir

2011-01-01

This study presents the Norwegian metal and material industry (defined as all metal and material related firms located in Norway, regardless of ownership) and evaluates the industry according to the underlying dimensions of a global knowledge hub - cluster attractiveness, education attractiveness, talent attractiveness, R&D and innovation attractiveness, ownership attractiveness, environmental attractiveness and cluster dynamics.

Metal-silica sol-gel materials

Science.gov (United States)

Stiegman, Albert E. (Inventor)

2002-01-01

The present invention relates to a single phase metal-silica sol-gel glass formed by the co-condensation of a transition metal with silicon atoms where the metal atoms are uniformly distributed within the sol-gel glass as individual metal centers. Any transition metal may be used in the sol-gel glasses. The present invention also relates to sensor materials where the sensor material is formed using the single phase metal-silica sol-gel glasses. The sensor materials may be in the form of a thin film or may be attached to an optical fiber. The present invention also relates to a method of sensing chemicals using the chemical sensors by monitoring the chromatic change of the metal-silica sol-gel glass when the chemical binds to the sensor. The present invention also relates to oxidation catalysts where a metal-silica sol-gel glass catalyzes the reaction. The present invention also relates to a method of performing oxidation reactions using the metal-silica sol-gel glasses. The present invention also relates to organopolymer metal-silica sol-gel composites where the pores of the metal-silica sol-gel glasses are filled with an organic polymer polymerized by the sol-gel glass.

Carbon nanotube and graphene nanoribbon interconnects

CERN Document Server

Das, Debaprasad

2014-01-01

"The book, Caron Nanotube and Graphene Nanoribbon Interconnects, authored by Drs. Debapraad Das and Hafizur Rahaman serves as a good source of material on CNT and GNR interconnects for readers who wish to get into this area and also for practicing engineers who would like to be updated in advances of this field."-Prof. Ashok Srivastava, Louisiana State University, Baton Rouge, USA"Mathematical analysis included in each and every chapter is the main strength of the materials. ... The book is very precise and useful for those who are working in this area. ... highly focused, very compact, and easy to apply. ... This book depicts a detailed analysis and modelling of carbon nanotube and graphene nanoribbon interconnects. The book also covers the electrical circuit modelling of carbon nanotubes and graphene nanoribbons."-Prof. Chandan Kumar Sarkar, Jadavpur University, Kolkata, India.

Patterned electrodeposition of interconnects using microcontact printing

NARCIS (Netherlands)

Hovestad, A.; Rendering, H.; Maijenburg, A.W.

2012-01-01

Microcontact printing combined with electroless deposition is a potential low cost technique to make electrical interconnects for opto-electronic devices. Microcontact printed inhibitors locally prevent electroless deposition resulting in a pre-defined pattern of metal tracks. The inhibition of

Novel non-platinum metal catalyst material

DEFF Research Database (Denmark)

2014-01-01

The present invention relates to a novel non-platinum metal catalyst material for use in low temperature fuel cells and electrolysers and to fuel cells and electrolysers comprising the novel non-platinum metal catalyst material. The present invention also relates to a novel method for synthesizing...... the novel non-platinum metal catalyst material....

Electronic interconnects and devices with topological surface states and methods for fabricating same

Science.gov (United States)

Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

2016-05-03

An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

Electronic interconnects and devices with topological surface states and methods for fabricating same

Energy Technology Data Exchange (ETDEWEB)

Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

2017-04-04

An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

Radioactive materials in recycled metals.

Science.gov (United States)

Lubenau, J O; Yusko, J G

1995-04-01

In recent years, the metal recycling industry has become increasingly aware of an unwanted component in metal scrap--radioactive material. Worldwide, there have been 35 instances where radioactive sources were unintentionally smelted in the course of recycling metal scrap. In some cases contaminated metal consumer products were distributed internationally. In at least one case, serious radiation exposures of workers and the public occurred. Radioactive material appearing in metal scrap includes sources subject to licensing under the Atomic Energy Act and also naturally occurring radioactive material. U.S. mills that have smelted a radioactive source face costs resulting from decontamination, waste disposal, and lost profits that range from 7 to 23 million U.S. dollars for each event. To solve the problem, industry and the government have jointly undertaken initiatives to increase awareness of the problem within the metal recycling industry. Radiation monitoring of recycled metal scrap is being performed increasingly by mills and, to a lesser extent, by scrap processors. The monitoring does not, however, provide 100% protection. Improvements in regulatory oversight by the government could stimulate improved accounting and control of licensed sources. However, additional government effort in this area must be reconciled with competing priorities in radiation safety and budgetary constraints. The threat of radioactive material in recycled metal scrap will continue for the foreseeable future and, thus, poses regulatory policy challenges for both developed and developing nations.

Interconnect fatigue design for terrestrial photovoltaic modules

Science.gov (United States)

Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

1982-03-01

The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.

Characterization of minerals, metals and materials

CERN Document Server

Hwang, Jiann-Yang; Bai, Chengguang; Carpenter, John; Cai, Mingdong; Firrao, Donato; Kim, Byoung-Gon

2012-01-01

This state-of-the-art reference contains chapters on all aspects of the characterization of minerals, metals, and materials. The title presents papers from one of the largest yearly gatherings of materials scientists in the world and thoroughly discusses the characterization of minerals, metals, and materials The scope includes current industrial applications and research and developments in the following areas:  Characterization of Ferrous Metals Characterization of Non-Ferrous Materials Characterization of Minerals and Ceramics Character

Solar-cell interconnect design for terrestrial photovoltaic modules

Science.gov (United States)

Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

1984-01-01

Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

Interconnected α-Fe2O3 nanosheet arrays as high-performance anode materials for lithium-ion batteries

International Nuclear Information System (INIS)

Cai, Dandan; Li, Dongdong; Ding, Liang-Xin; Wang, Suqing; Wang, Haihui

2016-01-01

The electrode materials with structure stability and binder-free are urgently required for improving the electrochemical performance of lithium-ion batteries. In this work, interconnected α-Fe 2 O 3 nanosheet arrays directly grown on Ti foil were fabricated via a facile galvanostatic electrodeposition method followed by thermal treatment. The as-prepared α-Fe 2 O 3 has an open network structure constituted of interconnected nanosheets and can be directly used as integrated electrodes for lithium-ion batteries. The α-Fe 2 O 3 nanosheet arrays exhibit a high reversible capacity of 986.3 mAh g −1 at a current density of 100 mA g −1 . Moreover, a reversible capacity of ca. 425.9 mAh g −1 is achieved even at a superhigh current density of 10 A g −1 , which is higher than the theoretical capacity of commercially used graphite. The excellent performance could be attributed to the efficient electron transport, the large electrode/electrolyte interfaces and the good accommodations for volume expansion from the interconnected nanosheet arrays structure.

Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

International Nuclear Information System (INIS)

Majumder, M.K.; Pandya, N.D.; Kaushik, B.K.; Manhas, S.K.

2013-01-01

Carbon nanotube (CN T) can be considered as an emerging interconnect material in current nano scale regime. They are more promising than other interconnect materials such as Al or Cu because of their robustness to electromigration. This research paper aims to address the crosstalk-related issues (signal integrity) in interconnect lines. Different analytical models of single- (SWCNT), double- (DWCNT), and multiwalled CNTs (MWCNT) are studied to analyze the crosstalk delay at global interconnect lengths. A capacitively coupled three-line bus architecture employing CMOS driver is used for accurate estimation of crosstalk delay. Each line in bus architecture is represented with the equivalent RLC models of single and bundled SWCNT, DWCNT, and MWCNT interconnects. Crosstalk delay is observed at middle line (victim) when it switches in opposite direction with respect to the other two lines (aggressors). Using the data predicted by ITRS 2012, a comparative analysis on the basis of crosstalk delay is performed for bundled SWCNT/DWCNT and single MWCNT interconnects. It is observed that the overall crosstalk delay is improved by 40.92% and 21.37% for single MWCNT in comparison to bundled SWCNT and bundled DWCNT interconnects, respectively.

A Critical Review on Metallic Glasses as Structural Materials for Cardiovascular Stent Applications.

Science.gov (United States)

Jafary-Zadeh, Mehdi; Praveen Kumar, Gideon; Branicio, Paulo Sergio; Seifi, Mohsen; Lewandowski, John J; Cui, Fangsen

2018-02-27

Functional and mechanical properties of novel biomaterials must be carefully evaluated to guarantee long-term biocompatibility and structural integrity of implantable medical devices. Owing to the combination of metallic bonding and amorphous structure, metallic glasses (MGs) exhibit extraordinary properties superior to conventional crystalline metallic alloys, placing them at the frontier of biomaterials research. MGs have potential to improve corrosion resistance, biocompatibility, strength, and longevity of biomedical implants, and hence are promising materials for cardiovascular stent applications. Nevertheless, while functional properties and biocompatibility of MGs have been widely investigated and validated, a solid understanding of their mechanical performance during different stages in stent applications is still scarce. In this review, we provide a brief, yet comprehensive account on the general aspects of MGs regarding their formation, processing, structure, mechanical, and chemical properties. More specifically, we focus on the additive manufacturing (AM) of MGs, their outstanding high strength and resilience, and their fatigue properties. The interconnection between processing, structure and mechanical behaviour of MGs is highlighted. We further review the main categories of cardiovascular stents, the required mechanical properties of each category, and the conventional materials have been using to address these requirements. Then, we bridge between the mechanical requirements of stents, structural properties of MGs, and the corresponding stent design caveats. In particular, we discuss our recent findings on the feasibility of using MGs in self-expandable stents where our results show that a metallic glass based aortic stent can be crimped without mechanical failure. We further justify the safe deployment of this stent in human descending aorta. It is our intent with this review to inspire biodevice developers toward the realization of MG-based stents.

A Critical Review on Metallic Glasses as Structural Materials for Cardiovascular Stent Applications

Directory of Open Access Journals (Sweden)

Mehdi Jafary-Zadeh

2018-02-01

Full Text Available Functional and mechanical properties of novel biomaterials must be carefully evaluated to guarantee long-term biocompatibility and structural integrity of implantable medical devices. Owing to the combination of metallic bonding and amorphous structure, metallic glasses (MGs exhibit extraordinary properties superior to conventional crystalline metallic alloys, placing them at the frontier of biomaterials research. MGs have potential to improve corrosion resistance, biocompatibility, strength, and longevity of biomedical implants, and hence are promising materials for cardiovascular stent applications. Nevertheless, while functional properties and biocompatibility of MGs have been widely investigated and validated, a solid understanding of their mechanical performance during different stages in stent applications is still scarce. In this review, we provide a brief, yet comprehensive account on the general aspects of MGs regarding their formation, processing, structure, mechanical, and chemical properties. More specifically, we focus on the additive manufacturing (AM of MGs, their outstanding high strength and resilience, and their fatigue properties. The interconnection between processing, structure and mechanical behaviour of MGs is highlighted. We further review the main categories of cardiovascular stents, the required mechanical properties of each category, and the conventional materials have been using to address these requirements. Then, we bridge between the mechanical requirements of stents, structural properties of MGs, and the corresponding stent design caveats. In particular, we discuss our recent findings on the feasibility of using MGs in self-expandable stents where our results show that a metallic glass based aortic stent can be crimped without mechanical failure. We further justify the safe deployment of this stent in human descending aorta. It is our intent with this review to inspire biodevice developers toward the realization

A Critical Review on Metallic Glasses as Structural Materials for Cardiovascular Stent Applications

Science.gov (United States)

Jafary-Zadeh, Mehdi; Praveen Kumar, Gideon

2018-01-01

Functional and mechanical properties of novel biomaterials must be carefully evaluated to guarantee long-term biocompatibility and structural integrity of implantable medical devices. Owing to the combination of metallic bonding and amorphous structure, metallic glasses (MGs) exhibit extraordinary properties superior to conventional crystalline metallic alloys, placing them at the frontier of biomaterials research. MGs have potential to improve corrosion resistance, biocompatibility, strength, and longevity of biomedical implants, and hence are promising materials for cardiovascular stent applications. Nevertheless, while functional properties and biocompatibility of MGs have been widely investigated and validated, a solid understanding of their mechanical performance during different stages in stent applications is still scarce. In this review, we provide a brief, yet comprehensive account on the general aspects of MGs regarding their formation, processing, structure, mechanical, and chemical properties. More specifically, we focus on the additive manufacturing (AM) of MGs, their outstanding high strength and resilience, and their fatigue properties. The interconnection between processing, structure and mechanical behaviour of MGs is highlighted. We further review the main categories of cardiovascular stents, the required mechanical properties of each category, and the conventional materials have been using to address these requirements. Then, we bridge between the mechanical requirements of stents, structural properties of MGs, and the corresponding stent design caveats. In particular, we discuss our recent findings on the feasibility of using MGs in self-expandable stents where our results show that a metallic glass based aortic stent can be crimped without mechanical failure. We further justify the safe deployment of this stent in human descending aorta. It is our intent with this review to inspire biodevice developers toward the realization of MG-based stents

Interconnect Between a Waveguide and a Dielectric Waveguide Comprising an Impedance Matched Dielectric Lens

Science.gov (United States)

Decrossas, Emmanuel (Inventor); Chattopadhyay, Goutam (Inventor); Chahat, Nacer (Inventor); Tang, Adrian J. (Inventor)

2016-01-01

A lens for interconnecting a metallic waveguide with a dielectric waveguide is provided. The lens may be coupled a metallic waveguide and a dielectric waveguide, and minimize a signal loss between the metallic waveguide and the dielectric waveguide.

Roofing Materials Assessment: Investigation of Five Metals in Runoff from Roofing Materials.

Science.gov (United States)

Winters, Nancy; Granuke, Kyle; McCall, Melissa

2015-09-01

To assess the contribution of five toxic metals from new roofing materials to stormwater, runoff was collected from 14 types of roofing materials and controls during 20 rain events and analyzed for metals. Many of the new roofing materials evaluated did not show elevated metals concentrations in the runoff. Runoff from several other roofing materials was significantly higher than the controls for arsenic, copper, and zinc. Notably, treated wood shakes released arsenic and copper, copper roofing released copper, PVC roofing released arsenic, and Zincalume® and EPDM roofing released zinc. For the runoff from some of the roofing materials, metals concentrations decreased significantly over an approximately one-year period of aging. Metals concentrations in runoff were demonstrated to depend on a number of factors, such as roofing materials, age of the materials, and climatic conditions. Thus, application of runoff concentrations from roofing materials to estimate basin-wide releases should be undertaken cautiously.

Copper Nanowire Production for Interconnect Applications

Science.gov (United States)

Han, Jin-Woo (Inventor); Meyyappan, Meyya (Inventor)

2014-01-01

A method of fabricating metallic Cu nanowires with lengths up to about 25 micrometers and diameters in a range 20-100 nanometers, or greater if desired. Vertically oriented or laterally oriented copper oxide structures (CuO and/or Cu2O) are grown on a Cu substrate. The copper oxide structures are reduced with 99+ percent H or H2, and in this reduction process the lengths decrease (to no more than about 25 micrometers), the density of surviving nanostructures on a substrate decreases, and the diameters of the surviving nanostructures have a range, of about 20-100 nanometers. The resulting nanowires are substantially pure Cu and can be oriented laterally (for local or global interconnects) or can be oriented vertically (for standard vertical interconnects).

Brazing of special metallic materials and material combinations using a special material

International Nuclear Information System (INIS)

Lison, R.

1981-01-01

The special materials include metals of groups IVa, Va and VIa of the periodic tables and their alloys. Their particular properties have won them applications in many highly specialized industries. For these materials to be used, mastery of thermal joining methods appropriate to their characteristics is necessary. High-temperature brazing is one such method for joining special materials. This paper presents variants of this technique suitable for each individual special material. Compatibility tests between various brazing metals and various special materials have been carried out by simulating the temperature/time cycle involved in brazing procedures. Special materials are relatively expensive, and their special properties are not required at every point in a structure: elsewhere they can be replaced by a different special material or by other metals or alloys. This means that joints must be made between two special materials or between a special material and a conventional material. When certain conditions are fulfilled, such joins can be made by high-temperature brazing. This paper also shows the extent to which the geometry of the join determines the choice of process. Example of applications are also given. (orig.)

Nanocomposite of graphene and metal oxide materials

Science.gov (United States)

Liu, Jun; Aksay, Ilhan A.; Choi, Daiwon; Wang, Donghai; Yang, Zhenguo

2012-09-04

Nanocomposite materials comprising a metal oxide bonded to at least one graphene material. The nanocomposite materials exhibit a specific capacity of at least twice that of the metal oxide material without the graphene at a charge/discharge rate greater than about 10C.

Nanocomposite of graphene and metal oxide materials

Science.gov (United States)

Liu, Jun; Aksay, Ilhan A.; Choi, Daiwon; Wang, Donghai; Yang, Zhenguo

2013-10-15

Nanocomposite materials comprising a metal oxide bonded to at least one graphene material. The nanocomposite materials exhibit a specific capacity of at least twice that of the metal oxide material without the graphene at a charge/discharge rate greater than about 10 C.

Metallic materials for mechanical damping capacity applications

Science.gov (United States)

Crăciun, R. C.; Stanciu, S.; Cimpoeșu, R.; (Dragoș Ursanu, A. I.; Manole, V.; Paraschiv, P.; Chicet, D. L.

2016-08-01

Some metallic materials exhibit good damping capacity of mechanical energy into thermal energy. This property along with the others metallic characteristics make this materials interesting for a big number of applications. These materials can be used as bumpers in different applications including automotive field. Beside grey cast iron and shape memory alloys few new metallic materials are presented for the supposition of high damping capacity. We analyze the causes that increase the internal friction of some metallic materials and possibilities to enhance this property through different mechanical, physical or chemical methods. Shape memory alloys, especially those based on copper, present a different damping capacity on martensite, austenite or transition state. In the transformation range M ↔A, which in case of copper base shape memory alloys is quite large, the metallic intelligent materials present a high internal friction, almost comparable with natural rubber behavior that can transform mechanical energy into thermal energy till a certain value of the external solicitation. These materials can be used as noise or small vibrations bumpers or even as shock absorbers in automotive industry.

Nanostructured CuS networks composed of interconnected nanoparticles for asymmetric supercapacitors.

Science.gov (United States)

Fu, Wenbin; Han, Weihua; Zha, Heming; Mei, Junfeng; Li, Yunxia; Zhang, Zemin; Xie, Erqing

2016-09-21

Nanostructured metal sulfides with excellent electrochemical activity and electrical conductivity are particularly promising for applications in high-performance energy storage devices. Here, we report on the facile synthesis of nanostructured CuS networks composed of interconnected nanoparticles as novel battery-type materials for asymmetric supercapacitors. We find that the CuS networks exhibit a high specific capacity of 49.8 mA g(-1) at a current density of 1 A g(-1), good rate capability and cycle stability. The superior performance could be attributed to the interconnected nanoparticles of CuS networks, which can facilitate electrolyte diffusion and provide fast electron pathways. Furthermore, an aqueous asymmetric supercapacitor has been assembled by using the CuS networks as the positive electrode and activated carbon as the negative electrode. The assembled device can work at a high operating voltage of 1.6 V and show a maximum energy density of 17.7 W h kg(-1) at a power density of 504 W kg(-1). This study indicates that the CuS networks have great potential for supercapacitor applications.

Crosstalk in modern on-chip interconnects a FDTD approach

CERN Document Server

Kaushik, B K; Patnaik, Amalendu

2016-01-01

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

Metal-binding silica materials for wastewater cleanup

Energy Technology Data Exchange (ETDEWEB)

Kroh, F.O. [TPL, Inc., Albuquerque, NM (United States)

1997-10-01

In this Phase I Small Business Innovation Research program, TPL, Inc. is developing two series of high-efficiency covalently modified silica materials for removing heavy metal ions from wastewater. These materials have metal ion capacities greatly exceeding those of commercial ion exchange resins. One series, containing thiol groups, has high capacity for {open_quotes}soft{close_quotes} heavy metal ions such as Hg, Pb, Ag, and Cd; the other, containing quaternary ammonium groups, has high capacity for anionic metal ions such as pertechnetate, arsenate, selenite, and chromate. These materials have high selectivity for the contaminant metals and will function well in harsh systems that inactivate other systems.

Compatibility of copper-electroplated cells with Metal Wrap Through module materials

Energy Technology Data Exchange (ETDEWEB)

Bennett, I.J.; Geerligs, L.J.; Olson, C.L.; Goris, M.J.A.A. [ECN Solar Energy, Petten (Netherlands)

2013-10-16

As part of the European FP7 RandD project 'Cu-PV', the compatibility of copper-electroplated metal wrapthrough (MWT) cells with conductive adhesives has been investigated. The objectives of this project include to reduce, by the use of copper plating, the amount of silver utilized in cell manufacturing, and to demonstrate the compatibility of high-power n-type back-contact module technology with copper-plated cells. The overall goal is to reduce the impact on the environment of cell and module manufacture. MWT module technology as developed by ECN uses conductive adhesive to make the interconnection between cells and a conductive backsheet foil. These adhesives have been proved to result in very reliable modules in the case of cells with fired silver metallization. To determine the compatibility of conductive adhesive with copper-plated cells, component tests were performed, followed by the manufacture of modules with copperplated cells and conductive adhesive interconnections. Climate chamber testing of these modules showed that the adhesive is compatible with the copper-plated cells. The next steps include further optimization of the plating process and additional testing at the module level.

Analysis of a metal filling and liner formation mechanism of the blind via with nano-Ag particles for TSV (through silicon via) interconnection

International Nuclear Information System (INIS)

Ham, Y-H; Kim, D-P; Baek, K-H; Park, K-S; Do, L-M; Kwon, K-H

2012-01-01

We investigated a metal filling and liner formation mechanism with a nano-Ag particle for the blind Si via, which is used in the via first process of through silicon via (TSV) interconnection. Using the deep reactive ion etching process, we produced the blind Si via (which is called the blind via hole or via) with a nearly vertical profile. The diameter and depth of the blind Si via were about 10 and 71 µm, respectively. The blind via holes were filled with a nano-Ag particle solution to form a metal plug or a metal liner. At this time, the Ag filling properties were monitored as a function of the volatilization rate of the Ag particle solution in the evacuating chamber. In the fast volatilization of the nano-Ag particle solution, an Ag liner formed on the inner wall of via holes. Meanwhile, both an Ag liner at the sidewall and the Ag plug at the bottom were obtained by the slow volatilization process. Finally, blind via holes fully filled with nano-Ag particles were obtained using four repetitions of the slow volatilization filling process. The proposed TSV filling process can fill large-diameter via holes over 100 µm without a seed layer and chemical mechanical planarization for TSV interconnection at low temperature. This is a simple and cost-effective TSV filling process. (paper)

Three-dimensionally interconnected Si frameworks derived from natural halloysite clay: a high-capacity anode material for lithium-ion batteries.

Science.gov (United States)

Wan, Hao; Xiong, Hao; Liu, Xiaohe; Chen, Gen; Zhang, Ning; Wang, Haidong; Ma, Renzhi; Qiu, Guanzhou

2018-05-23

On account of its high theoretical capacity, silicon (Si) has been regarded as a promising anode material for Li-ion batteries. Extracting Si content from earth-abundant and low-cost aluminosilicate minerals, rather than from artificial silica (SiO2) precursors, is a more favorable and practical method for the large-scale application of Si anodes. In this work, three-dimensionally interconnected (3D-interconnected) Si frameworks with a branch diameter of ∼15 nm are prepared by the reduction of amorphous SiO2 nanotubes derived from natural halloysite clay. Benefiting from their nanostructure, the as-prepared 3D-interconnected Si frameworks yield high reversible capacities of 2.54 A h g-1 at 0.1 A g-1 after 50 cycles, 1.87 A h g-1 at 0.5 A g-1 after 200 cycles, and 0.97 A h g-1 at 2 A g-1 after a long-term charge-discharge process of 500 cycles, remarkably outperforming the commercial Si material. Further, when the as-prepared Si frameworks and commercial LiCoO2 cathodes are paired in full cells, a high anode capacity of 0.98 A h g-1 is achieved after 100 cycles of rapid charge/discharge at 2 A g-1. This work provides a new strategy for the synthesis of high-capacity Si anodes derived from natural aluminosilicate clay.

Electrode for disintegrating metallic material

International Nuclear Information System (INIS)

Persang, J.C.

1985-01-01

A graphite electrode is provided for disintegrating and removing metallic material from a workpiece, e.g., such as portions of a nuclear reactor to be repaired while in an underwater and/or radioactive environment. The electrode is provided with a plurality of openings extending outwardly, and a manifold for supplying a mixture of water and compressed gas to be discharged through the openings for sweeping away the disintegrated metallic material during use of the electrode

Space-Spurred Metallized Materials

Science.gov (United States)

1990-01-01

Spurred R&D toward improved vacuum metallizing techniques led to an extensive line of commercial products, from insulated outdoor garments to packaging for foods, from wall coverings to window shades, from life rafts to candy wrappings, reflective blankets to photographic reflectors. Metallized Products, Inc. (MPI) was one of the companies that worked with NASA in development of the original space materials. MPI markets its own metallized products and supplies materials to other manufacturers. One of the most widely used MPI products is TXG laminate. An example is a reflective kite, the S.O.S. Signal Kite that can be flown as high as 200 feet to enhance radar and visual detectability. It offers a boon to campers, hikers, mountain climbers and boaters. It is produced by Solar Reflections, Inc. The company also markets a solar reflective hat. Another example is by Pro-Tektion, Inc. to provide protection for expensive musical equipment that have sensitive electronic components subject to damage from the heat of stage lights, dust, or rain at outdoor concerts. MP supplied the material and acceptance of the covers by the sound industry has been excellent.

X-ray photoelectron spectroscopy, depth profiling, and elemental imaging of metal/polyimide interfaces of high density interconnect packages subjected to temperature and humidity

International Nuclear Information System (INIS)

Jung, David R.; Ibidunni, Bola; Ashraf, Muhammad

1998-01-01

X-ray photoelectron spectroscopy (XPS) was used to analyze surfaces and buried interfaces of a tape ball grid array (TBGA) interconnect package that was exposed to temperature and humidity testing (the pressure cooker test or PCT). Two metallization structures, employing 3.5 and 7.5 nm Cr adhesion layers, respectively, showed dramatically different results in the PCT. For the metallization with 3.5 nm Cr, spontaneous failure occurred on the polymer side of the metal/polyimide interface. Copper and other metals were detected by XPS on and below this polymer surface. For the metallization with 7.5 nm Cr, which did not delaminate in the PCT, the metallization was manually peeled away and also showed failure at the polymer side of the interface. Conventional XPS taken from a 1 mm diameter area showed the presence of metals on and below this polymer surface. Detailed spatially-resolved analysis using small area XPS (0.1 mm diameter area) and imaging XPS (7 μm resolution) showed that this metal did not migrate through and below the metal/polymer interface, but around and outside of the metallized area

Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

Directory of Open Access Journals (Sweden)

Salman Shafqat

2017-09-01

Full Text Available The exciting field of stretchable electronics (SE promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS-type process recipes using bulk integrated circuit (IC microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

Properties of structural materials in liquid metal environment

International Nuclear Information System (INIS)

Borgstedt, H.U.

1991-12-01

The proceedings contain 16 contributions to the following topics: 1. Creep-Rupture Behaviour of Structural Materials in Liquid Metal Environment; 2. Behaviour of Materials in Liquid Metal Environment under Off-Normal Conditions; 3. Fatigue and Creep-Fatigue of Structural Materials in Liquid Metal Environment; and 4. Crack Propagation in Liquid Sodium. (MM)

Electrical transport and electromigration studies on nickel encapsulated carbon nanotubes: possible future interconnects

International Nuclear Information System (INIS)

Kulshrestha, Neha; Misra, D S; Misra, Abhishek

2013-01-01

We nominate the nickel filled multiwalled carbon nanotubes (MWNTs) as potential candidates to cope with challenges in persistent scaling for future interconnect technology. The insights into electrical transport through nickel filled carbon nanotubes provide an effective solution for major performance and reliability issues such as the increasing resistivity of metals at reduced scales, electromigration at high current densities and the problem of diffusion and corrosion faced by the existing copper interconnect technology. Furthermore, the nickel filled MWNTs outperform their hollow counterparts, the unfilled MWNTs, carrying at least one order higher current density, with increased time to failure. The results suggest that metal filled carbon nanotubes can provide a twofold benefit: (1) the metal filling provides an increased density of states for the system leading to a higher current density compared to hollow MWNTs, (2) metal out-diffusion and corrosion is prevented by the surrounding graphitic walls. (paper)

Composite metal foil and ceramic fabric materials

Science.gov (United States)

Webb, Brent J.; Antoniak, Zen I.; Prater, John T.; DeSteese, John G.

1992-01-01

The invention comprises new materials useful in a wide variety of terrestrial and space applications. In one aspect, the invention comprises a flexible cloth-like material comprising a layer of flexible woven ceramic fabric bonded with a layer of metallic foil. In another aspect, the invention includes a flexible fluid impermeable barrier comprising a flexible woven ceramic fabric layer having metal wire woven therein. A metallic foil layer is incontinuously welded to the woven metal wire. In yet another aspect, the invention includes a material comprising a layer of flexible woven ceramic fabric bonded with a layer of an organic polymer. In still another aspect, the invention includes a rigid fabric structure comprising a flexible woven ceramic fabric and a resinous support material which has been hardened as the direct result of exposure to ultraviolet light. Inventive methods for producing such material are also disclosed.

Interconnected Ni_2P nanorods grown on nickel foam for binder free lithium ion batteries

International Nuclear Information System (INIS)

Li, Qin; Ma, Jingjing; Wang, Huijun; Yang, Xia; Yuan, Ruo; Chai, Yaqin

2016-01-01

Herein, we report a moderate and simple approach to synthesize nickel phosphide nanorods on nickel foam (Ni_2P/NF), which was employed as anode material for lithium ion batteries (LIBs). In this paper, interconnected Ni_2P nanorods were fabricated through hydrothermal treatment of NF and subsequently by high temperature phosphating. NF is not only regarded as nickel source and metal current collector, but also as a support to grow electro-active material (Ni_2P). Therefore, Ni_2P/NF could act as a self-supported working electrode for LIBs without any extra addition of cohesive binders. Moreover, benefiting from the conductive capacity of Ni_2P/NF, the active compound behaved superior lithium storage performance and cycling reversibility during electrochemical cycling process. The Ni_2P/NF delivered excellent reversibility of 507 mAh g"−"1 at the current density of 50 mA g"−"1 after 100 cycles. This work may provide a potential method for preparation of metal phosphides as promising materials for LIBs, hydrogen evolution reaction (HER) or other fields.

Electromigration of intergranular voids in metal films for microelectronic interconnects

CERN Document Server

Averbuch, A; Ravve, I

2003-01-01

Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

Ceramic superconductor/metal composite materials employing the superconducting proximity effect

Science.gov (United States)

Holcomb, Matthew J.

2002-01-01

Superconducting composite materials having particles of superconducting material disposed in a metal matrix material with a high electron-boson coupling coefficient (.lambda.). The superconducting particles can comprise any type of superconductor including Laves phase materials, Chevrel phase materials, A15 compounds, and perovskite cuprate ceramics. The particles preferably have dimensions of about 10-500 nanometers. The particles preferably have dimensions larger than the superconducting coherence length of the superconducting material. The metal matrix material has a .lambda. greater than 0.2, preferably the .lambda. is much higher than 0.2. The metal matrix material is a good proximity superconductor due to its high .lambda.. When cooled, the superconductor particles cause the metal matrix material to become superconducting due to the proximity effect. In cases where the particles and the metal matrix material are chemically incompatible (i.e., reactive in a way that destroys superconductivity), the particles are provided with a thin protective metal coating. The coating is chemically compatible with the particles and metal matrix material. High Temperature Superconducting (HTS) cuprate ceramic particles are reactive and therefore require a coating of a noble metal resistant to oxidation (e.g., silver, gold). The proximity effect extends through the metal coating. With certain superconductors, non-noble metals can be used for the coating.

Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections

Science.gov (United States)

Zhang, Bin; Yang, Xiaokuo; Liu, Jiahao; Li, Weiwei; Xu, Jie

2018-02-01

Nanomagnet logic (NML) devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects. Project supported by the National Natural Science Foundation of China (No. 61302022) and the Scientific Research Foundation for Postdoctor of Air Force Engineering University (Nos. 2015BSKYQD03, 2016KYMZ06).

Cast bulk metallic glass alloys: prospects as wear materials

Energy Technology Data Exchange (ETDEWEB)

Hawk, Jeffrey A.; Dogan, Omer N.; Shiflet, Gary J. (Dept. of Materials Science and Engineering, University of Virginia, Charlottesville, VA)

2005-01-01

Bulk metallic glasses are single phase materials with unusual physical and mechanical properties. One intriguing area of possible use is as a wear material. Usually, pure metals and single phase dilute alloys do not perform well in tribological conditions. When the metal or alloy is lightweight, it is usually soft leading to galling in sliding situations. For the harder metals and alloys, their density is usually high, so there is an energy penalty when using these materials in wear situations. However, bulk metallic glasses at the same density are usually harder than corresponding metals and dilute single phase alloys, and so could offer better wear resistance. This work will discuss preliminary wear results for metallic glasses with densities in the range of 4.5 to 7.9 g/cc. The wear behavior of these materials will be compared to similar metals and alloys.

Leading research on super metal. 3. Amorphous and nanostructured metallic materials; Super metal no sendo kenkyu. 3. Kogata buzai

Energy Technology Data Exchange (ETDEWEB)

NONE

1996-03-01

Very fine structure control technique for amorphous and nanostructured metallic materials was reviewed to exceed the marginal performance of small metallic member materials. In Japan, high strength alloys and anticorrosion alloys are currently developed as an amorphous structure control technique, and ultra fine powder production and nano-compaction molding are studied for nanostructured materials. Fabrication of amorphous alloy wire materials and metal glass in USA are also introduced. Fabrication of metallic nanocrystals deposited within gas phase in Germany are attracting attention. The strength and abrasion resistance are remarkably enhanced by making nanostructured crystals and dispersing them. It may be most suitable to utilize amorphous and nanostructured metallic materials for earth-friendly materials having anticorrosion, and catalyst and biomaterial affinities, and also for magnetic materials. It is important for controlling micro-structures to clarify the formation mechanism of structures. For their processing techniques, the diversity and possibility are suggested, as to the condensation and solidification of gaseous and liquid phase metals, the molding and processing of very fine solid phase alloys, and the manufacturing members by heat treatment. 324 refs., 109 figs., 21 tabs.

Process Developed for Generating Ceramic Interconnects With Low Sintering Temperatures for Solid Oxide Fuel Cells

Science.gov (United States)

Zhong, Zhi-Min; Goldsby, Jon C.

2005-01-01

Solid oxide fuel cells (SOFCs) have been considered as premium future power generation devices because they have demonstrated high energy-conversion efficiency, high power density, and extremely low pollution, and have the flexibility of using hydrocarbon fuel. The Solid-State Energy Conversion Alliance (SECA) initiative, supported by the U.S. Department of Energy and private industries, is leading the development and commercialization of SOFCs for low-cost stationary and automotive markets. The targeted power density for the initiative is rather low, so that the SECA SOFC can be operated at a relatively low temperature (approx. 700 C) and inexpensive metallic interconnects can be utilized in the SOFC stack. As only NASA can, the agency is investigating SOFCs for aerospace applications. Considerable high power density is required for the applications. As a result, the NASA SOFC will be operated at a high temperature (approx. 900 C) and ceramic interconnects will be employed. Lanthanum chromite-based materials have emerged as a leading candidate for the ceramic interconnects. The interconnects are expected to co-sinter with zirconia electrolyte to mitigate the interface electric resistance and to simplify the processing procedure. Lanthanum chromites made by the traditional method are sintered at 1500 C or above. They react with zirconia electrolytes (which typically sinter between 1300 and 1400 C) at the sintering temperature of lanthanum chromites. It has been envisioned that lanthanum chromites with lower sintering temperatures can be co-fired with zirconia electrolyte. Nonstoichiometric lanthanum chromites can be sintered at lower temperatures, but they are unstable and react with zirconia electrolyte during co-sintering. NASA Glenn Research Center s Ceramics Branch investigated a glycine nitrate process to generate fine powder of the lanthanum-chromite-based materials. By simultaneously doping calcium on the lanthanum site, and cobalt and aluminum on the

Method of electrolytic decontamination of contaminated metal materials for radioactivity

International Nuclear Information System (INIS)

Harada, Yoshio; Ishibashi, Masaru; Matsumoto, Hiroyo.

1985-01-01

Purpose: To electrolytically eliminate radioactive materials from metal materials contaminated with radioactive materials, as well as efficiently remove metal ions leached out in an electrolyte. Method: In the case of anodic dissolution of metal materials contaminated with radioactivity in an electrolyte to eliminate radioactive contaminating materials on the surface of the metal materials, a portion of an electrolytic cell is defined with partition membranes capable of permeating metal ions therethrough. A cathode connected to a different power source is disposed to the inside of the partition membranes and fine particle of metals are suspended and floated in the electrolyte. By supplying an electric current between an insoluble anode disposed outside of the partition membranes and the cathode, metal ions permeating from the outside of the partition membranes are deposited on the fine metal particles. Accordingly, since metal ions in the electrolyte are removed, the electrolyte can always be kept clean. (Yoshihara, H.)

All-zigzag graphene nanoribbons for planar interconnect application

Science.gov (United States)

Chen, Po-An; Chiang, Meng-Hsueh; Hsu, Wei-Chou

2017-07-01

A feasible "lightning-shaped" zigzag graphene nanoribbon (ZGNR) structure for planar interconnects is proposed. Based on the density functional theory and non-equilibrium Green's function, the electron transport properties are evaluated. The lightning-shaped structure increases significantly the conductance of the graphene interconnect with an odd number of zigzag chains. This proposed technique can effectively utilize the linear I-V characteristic of asymmetric ZGNRs for interconnect application. Variability study accounting for width/length variation and the edge effect is also included. The transmission spectra, transmission eigenstates, and transmission pathways are analyzed to gain the physical insights. This lightning-shaped ZGNR enables all 2D material-based devices and circuits on flexible and transparent substrates.

Fixation by ion exchange of toxic materials in a glass matrix

International Nuclear Information System (INIS)

Litovitz, T.A.; Simmons, C.J.; Simmons, J.H.; Macedo, P.B.

1981-01-01

A process for disposing of toxic materials such as radioactive waste comprises reacting a porous silicate glass or silica gel, having interconnected pores and alkali metal cations. Group 1b metal cations and/or ammonium cation bonded to silicon through divalent oxygen linkages on the internal surfaces of said pores, with a toxic material containing toxic cations as well as non-cationic portions. The toxic cations are capable of displacing the alkali metal cations, Group 1b metal cations and/or ammonium cations to provide a distribution of internal silicon-bonded toxic cation oxide groups within the pores of the glass or silica gel. (author)

Interconnection Guidelines

Science.gov (United States)

The Interconnection Guidelines provide general guidance on the steps involved with connecting biogas recovery systems to the utility electrical power grid. Interconnection best practices including time and cost estimates are discussed.

Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated with Two Levels of Metal Interconnect

Science.gov (United States)

Spry, David J.; Neudeck, Philip G.; Liangyu, Chen; Evans, Laura J.; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.

2015-01-01

The fabrication and prolonged 500 C electrical testing of 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) with two levels of metal interconnect is reported in another submission to this conference proceedings. While some circuits functioned more than 1000 hours at 500 C, the majority of packaged ICs from this wafer electrically failed after less than 200 hours of operation in the same test conditions. This work examines the root physical degradation and failure mechanisms believed responsible for observed large discrepancies in 500 C operating time. Evidence is presented for four distinct issues that significantly impacted 500 C IC operational yield and lifetime for this wafer.

One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

DEFF Research Database (Denmark)

Sabourin, David; Dufva, Martin; Jensen, Thomas Glasdam

2010-01-01

A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfac...

Recent Advancements in Self-Healing Metallic Materials and Self-Healing Metal Matrix Composites

Science.gov (United States)

Kilicli, Volkan; Yan, Xiaojun; Salowitz, Nathan; Rohatgi, Pradeep K.

2018-04-01

Engineered self-healing materials inspired by natural biological organisms that can repair damage are receiving increasing interest in recent years. Most studies have been focused on self-healing polymers, concretes, and ceramics. Self-healing metallic materials pose challenges due to the high temperatures used in manufacturing and the chemistries involved. This article summarizes and evaluates the self-healing mechanisms used in metallic materials and reviews recent studies into self-healing in aluminum, zinc, and Sn-Bi alloys. Generalizations about the various classifications are drawn from the review highlighting major hurdles in the widespread practical application of metallic self-healing materials, as well as the potential directions for future studies.

Transurban interconnectivities

DEFF Research Database (Denmark)

Jørgensen, Claus Møller

2012-01-01

This essay discusses the interpretation of the revolutionary situations of 1848 in light of recent debates on interconnectivity in history. The concept of transurban interconnectivities is proposed as the most precise concept to capture the nature of interconnectivity in 1848. It is argued....... It is argued that circulating political communication accounts for similarities with respect to political agenda, organisational form and political repertoire evident in urban settings across Europe. This argument is supported by a series of examples of local organisation and local appropriations of liberalism...

Investigation of performance degradation of SOFC using chromium-containing alloy interconnects

DEFF Research Database (Denmark)

Beeaff, D.R.; Dinesen, A.; Hendriksen, Peter Vang

2007-01-01

The long-term aging of a stack element (fuel cell, current collectors, and interconnect materials) was studied. A pair of tests were made in which one sample contained an interconnect, a high-temperature stainless steel (Crofer 22 APU), treated with an LSMC coating applied to the cathode-side int...

Toxic Heavy Metals: Materials Cycle Optimization

Science.gov (United States)

Ayres, Robert U.

1992-02-01

Long-term ecological sustainability is incompatible with an open materials cycle. The toxic heavy metals (arsenic, cadmium, chromium, copper, lead, mercury, silver, uranium/plutonium, zinc) exemplify the problem. These metals are being mobilized and dispersed into the environment by industrial activity at a rate far higher than by natural processes. Apart from losses to the environment resulting from mine wastes and primary processing, many of these metals are utilized in products that are inherently dissipative. Examples of such uses include fuels, lubricants, solvents, fire retardants, stabilizers, flocculants, pigments, biocides, and preservatives. To close the materials cycle, it will be necessary to accomplish two things. The first is to ban or otherwise discourage (e.g., by means of high severance taxes on virgin materials) dissipative uses of the above type. The second is to increase the efficiency of recycling of those materials that are not replaceable in principle. Here, also, economic instruments (such as returnable deposits) can be effective in some cases. A systems view of the problem is essential to assess the cost and effectiveness of alternative strategies.

Metal Matrix Composite Material by Direct Metal Deposition

Science.gov (United States)

Novichenko, D.; Marants, A.; Thivillon, L.; Bertrand, P. H.; Smurov, I.

Direct Metal Deposition (DMD) is a laser cladding process for producing a protective coating on the surface of a metallic part or manufacturing layer-by-layer parts in a single-step process. The objective of this work is to demonstrate the possibility to create carbide-reinforced metal matrix composite objects. Powders of steel 16NCD13 with different volume contents of titanium carbide are tested. On the base of statistical analysis, a laser cladding processing map is constructed. Relationships between the different content of titanium carbide in a powder mixture and the material microstructure are found. Mechanism of formation of various precipitated titanium carbides is investigated.

Properties of structural materials in liquid metal environment. Proceedings

Energy Technology Data Exchange (ETDEWEB)

Borgstedt, H U [ed.

1991-12-15

The International Working Group on Fast Reactors (IWGFR) Specialists Meeting on Properties of Structural Materials in Liquid Metal Environment was held during June 18 to June 20, 1991, at the Nuclear Research Centre (Kernforschungszentrum) in Karlsruhe, Germany. The Specialists Meeting was divided into five technical sessions which addressed topics as follows: Creep-Rupture Behaviour of Structural Materials in Liquid Metal Environment; Behaviour of Materials in Liquid Metal Environments under Off-Normal Conditions;Fatigue and Creep-Fatigue of Structural Materials in Liquid Metal Environment; Crack Propagation in Liquid Sodium; and Conclusions and recommendations. Individual papers have been cataloged separately.

Optical interconnects

CERN Document Server

Chen, Ray T

2006-01-01

This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical

Computer simulation of electromigration in microelectronics interconnect

OpenAIRE

Zhu, Xiaoxin

2014-01-01

Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly and packaging industry as electronics components and interconnects get smaller and smaller. According...

One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

International Nuclear Information System (INIS)

Sabourin, D; Dufva, M; Jensen, T; Kutter, J; Snakenborg, D

2010-01-01

A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfaces by direct micromilling. Upon UV-assisted bonding the tubing is trapped in the ports of the PMMA chip and forms an integrated, in-plane and adhesive-free interconnection. The interconnections support the average pressure of 6.1 bar and can be made with small dead volumes. A comparison is made to a similar interconnection approach which uses tubing to act as a gasket between a needle and port on the microfluidic chip. (technical note)

Selective ablation of photovoltaic materials with UV laser sources for monolithic interconnection of devices based on a-Si:H

Energy Technology Data Exchange (ETDEWEB)

Molpeceres, C. [Centro Laser UPM, Univ. Politecnica de Madrid, Crta. de Valencia Km 7.3, 28031 Madrid (Spain)], E-mail: carlos.molpeceres@upm.es; Lauzurica, S.; Garcia-Ballesteros, J.J.; Morales, M.; Guadano, G.; Ocana, J.L. [Centro Laser UPM, Univ. Politecnica de Madrid, Crta. de Valencia Km 7.3, 28031 Madrid (Spain); Fernandez, S.; Gandia, J.J. [Dept. de Energias Renovables, Energia Solar Fotovoltaica, CIEMAT, Avda, Complutense 22, 28040 Madrid (Spain); Villar, F.; Nos, O.; Bertomeu, J. [CeRMAE Dept. Fisica Aplicada i Optica, Universitat de Barcelona, Av. Diagonal 647, 08028 Barcelona (Spain)

2009-03-15

Lasers are essential tools for cell isolation and monolithic interconnection in thin-film-silicon photovoltaic technologies. Laser ablation of transparent conductive oxides (TCOs), amorphous silicon structures and back contact removal are standard processes in industry for monolithic device interconnection. However, material ablation with minimum debris and small heat affected zone is one of the main difficulty is to achieve, to reduce costs and to improve device efficiency. In this paper we present recent results in laser ablation of photovoltaic materials using excimer and UV wavelengths of diode-pumped solid-state (DPSS) laser sources. We discuss results concerning UV ablation of different TCO and thin-film silicon (a-Si:H and nc-Si:H), focussing our study on ablation threshold measurements and process-quality assessment using advanced optical microscopy techniques. In that way we show the advantages of using UV wavelengths for minimizing the characteristic material thermal affection of laser irradiation in the ns regime at higher wavelengths. Additionally we include preliminary results of selective ablation of film on film structures irradiating from the film side (direct writing configuration) including the problem of selective ablation of ZnO films on a-Si:H layers. In that way we demonstrate the potential use of UV wavelengths of fully commercial laser sources as an alternative to standard backscribing process in device fabrication.

Selective ablation of photovoltaic materials with UV laser sources for monolithic interconnection of devices based on a-Si:H

International Nuclear Information System (INIS)

Molpeceres, C.; Lauzurica, S.; Garcia-Ballesteros, J.J.; Morales, M.; Guadano, G.; Ocana, J.L.; Fernandez, S.; Gandia, J.J.; Villar, F.; Nos, O.; Bertomeu, J.

2009-01-01

Lasers are essential tools for cell isolation and monolithic interconnection in thin-film-silicon photovoltaic technologies. Laser ablation of transparent conductive oxides (TCOs), amorphous silicon structures and back contact removal are standard processes in industry for monolithic device interconnection. However, material ablation with minimum debris and small heat affected zone is one of the main difficulty is to achieve, to reduce costs and to improve device efficiency. In this paper we present recent results in laser ablation of photovoltaic materials using excimer and UV wavelengths of diode-pumped solid-state (DPSS) laser sources. We discuss results concerning UV ablation of different TCO and thin-film silicon (a-Si:H and nc-Si:H), focussing our study on ablation threshold measurements and process-quality assessment using advanced optical microscopy techniques. In that way we show the advantages of using UV wavelengths for minimizing the characteristic material thermal affection of laser irradiation in the ns regime at higher wavelengths. Additionally we include preliminary results of selective ablation of film on film structures irradiating from the film side (direct writing configuration) including the problem of selective ablation of ZnO films on a-Si:H layers. In that way we demonstrate the potential use of UV wavelengths of fully commercial laser sources as an alternative to standard backscribing process in device fabrication.

Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

International Nuclear Information System (INIS)

Sabourin, D; Snakenborg, D; Dufva, M

2009-01-01

In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications

Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

International Nuclear Information System (INIS)

Tamura, Nobumichi; Chen, Kai; Kunz, Martin

2009-01-01

Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

Energy Technology Data Exchange (ETDEWEB)

Tamura, Nobumichi; Chen, Kai; Kunz, Martin

2009-05-01

Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

Proposed industrial recovered materials utilization targets for the metals and metal products industry

Energy Technology Data Exchange (ETDEWEB)

None

1979-05-01

Set targets for increased utilization of energy-saving recovered materials in the metals and metal products industries (ferrous, aluminium, copper, zinc, and lead) are discussed. Data preparation and methodology development and analysis of the technological and economic factors in order to prepare draft targets for the use of recovered materials are covered. Chapter 2 provides an introductory discussion of the factors that affect the recovery and reuse of secondary materials and the competition between the primary and secondary metals industries. Chapter 3 presents general profiles for the major industrial segments comprising SIC 33, including industry structure, process technology, materials and recycling flow, and future trends for the 5 industries: ferrous, aluminium, copper, zinc, and lead. Chapter 4 presents the evaluation of recycling targets for those industries. (MCW)

Analysis of the trade-offs between conventional and superconducting interconnections

International Nuclear Information System (INIS)

Frye, R.

1989-01-01

Superconductivity can now be achieved at temperatures compatible with semiconductor device operation. This raises the interesting possibility of using the new, high-temperature superconducting ceramics for interconnections in electronic systems. This paper examines some of the consequences of a resistance-free interconnection medium. A problem with conventional conductors in electronic systems is that the resistance of wires increases quadratically as the wire dimensions are scaled down. Below some minimum cross-sectional area, determined by the metal resistivity and wire length, the resistance in these lines begins to severely limit their bandwidth. Superconductors, on the other hand, are not constrained by the same scaling rules. They provide a high bandwidth interconnection at all sizes and lengths. The limitations for superconductors are set by their critical current densities. If line dimensions become too small, a superconductor will no longer support an adequate flow of current. An analysis is presented examining the performance trade-offs for conventional and superconducting interconnections in applications ranging from printed wiring boards to chips. For most semiconductor device-based applications, the potential gains in wiring density offered by superconductors are probably more important than the bandwidth improvements. An important result of the analysis is that it determines the values of critical current density above which superconductors outperform conventional wires in systems of various physical sizes. This identifies particular interconnection technologies for which high-temperature superconductors show the most promise

Vertically aligned multiwalled carbon nanotubes as electronic interconnects

Science.gov (United States)

Gopee, Vimal Chandra

The drive for miniaturisation of electronic circuits provides new materials challenges for the electronics industry. Indeed, the continued downscaling of transistor dimensions, described by Moore’s Law, has led to a race to find suitable replacements for current interconnect materials to replace copper. Carbon nanotubes have been studied as a suitable replacement for copper due to its superior electrical, thermal and mechanical properties. One of the advantages of using carbon nanotubes is their high current carrying capacity which has been demonstrated to be three orders of magnitude greater than that of copper. Most approaches in the implementation of carbon nanotubes have so far focused on the growth in vias which limits their application. In this work, a process is described for the transfer of carbon nanotubes to substrates allowing their use for more varied applications. Arrays of vertically aligned multiwalled carbon nanotubes were synthesised by photo-thermal chemical vapour deposition with high growth rates. Raman spectroscopy was used to show that the synthesised carbon nanotubes were of high quality. The carbon nanotubes were exposed to an oxygen plasma and the nature of the functional groups present was determined using X-ray photoelectron spectroscopy. Functional groups, such as carboxyl, carbonyl and hydroxyl groups, were found to be present on the surface of the multiwalled carbon nanotubes after the functionalisation process. The multiwalled carbon nanotubes were metallised after the functionalisation process using magnetron sputtering. Two materials, solder and sintered silver, were chosen to bind carbon nanotubes to substrates so as to enable their transfer and also to make electrical contact. The wettability of solder to carbon nanotubes was investigated and it was demonstrated that both functionalisation and metallisation were required in order for solder to bond with the carbon nanotubes. Similarly, functionalisation followed by metallisation

Recycling of nonferrous metals from waste materials

Energy Technology Data Exchange (ETDEWEB)

Urban, A

1982-02-01

Recycling of metals was one of the 9 central subjects of the international symposium on 'Materials and Energy from Refuse', held in Antwerpen on October 20 to 22, 1981. Six of 65 poster sessions papers were on metal recycling; four of them discussed the recycling of nonferrous metals.

Ab Initio Studies of Metal Hexaboride Materials

Science.gov (United States)

Schmidt, Kevin M.

Metal hexaborides are refractory ceramics with several qualities relevant to materials design, such as low work functions, high hardness, low thermal expansion coefficients, and high melting points, among many other properties of interest for industrial applications. Thermal and mechanical stability is a common feature provided by the covalently-bonded network boron atoms, and electronic properties can vary significantly with the resident metal. While these materials are currently employed as electron emitters and abrasives, promising uses of these materials also include catalytic applications for chemical dissociation reactions of various molecules such as hydrogen, water and carbon monoxide, for example. However, these extensions require a thorough understanding of particular mechanical and electronic properties. This dissertation is a collection of studies focused on understanding the behavior of metal hexaboride materials using computational modeling methods to investigate materials properties of these from both classical and quantum mechanical points of view. Classical modeling is performed using molecular dynamics methods with interatomic potentials obtained from density functional theory (DFT) calculations. Atomic mean-square displacements from the quasi-harmonic approximation and lattice energetic data are produced with DFT for developing the potentials. A generalized method was also developed for the inversion of cohesive energy curves of crystalline materials; pairwise interatomic potentials are extracted using detailed geometrical descriptions of the atomic interactions and a list of atomic displacements and degeneracies. The surface structure of metal hexaborides is studied with DFT using several model geometries to describe the terminal cation layouts, and these provide a basis for further studies on metal hexaboride interactions with hydrogen. The surface electronic structure calculations show that segregated regions of metal and boron

Impact of Bundle Structure on Performance of on-Chip CNT Interconnects

International Nuclear Information System (INIS)

Kuruvilla, N.; Raina, J.P

2014-01-01

CNTs are proposed as a promising candidate against copper in deep submicron IC interconnects. Still this technology is in its infancy. Most available literatures on performance predictions of CNT interconnects, have focused only on interconnect geometries using segregated CNTs. Yet during the manufacturing phase, CNTs are obtained usually as a mixture of single-walled and multi-walled CNTs (SWCNTs and MWCNTs). Especially in case of SWCNTs; it is usually available as a mixture of both Semi conducting CNTs and metallic CNTs. This paper attempts to answer whether segregation is inevitable before using them to construct interconnects. This paper attempt to compare the performance variations of bundled CNT interconnects, where bundles are made of segregated CNTs versus mixed CNTs, for future technology nodes using electrical model based analysis. Also a proportionate mixing of different CNTs has been introduced so as to yield a set of criteria to aid the industry in selection of an appropriate bundle structure for use in a specific application with optimum performance. It was found that even the worst case performance of geometries using a mixture of SWCNTs and MWCNTs was better than copper. These results also reveal that, for extracting optimum performance vide cost matrix, the focus should be more on diameter controlled synthesis than on segregation.

Two-dimensional optoelectronic interconnect-processor and its operational bit error rate

Science.gov (United States)

Liu, J. Jiang; Gollsneider, Brian; Chang, Wayne H.; Carhart, Gary W.; Vorontsov, Mikhail A.; Simonis, George J.; Shoop, Barry L.

2004-10-01

Two-dimensional (2-D) multi-channel 8x8 optical interconnect and processor system were designed and developed using complementary metal-oxide-semiconductor (CMOS) driven 850-nm vertical-cavity surface-emitting laser (VCSEL) arrays and the photodetector (PD) arrays with corresponding wavelengths. We performed operation and bit-error-rate (BER) analysis on this free-space integrated 8x8 VCSEL optical interconnects driven by silicon-on-sapphire (SOS) circuits. Pseudo-random bit stream (PRBS) data sequence was used in operation of the interconnects. Eye diagrams were measured from individual channels and analyzed using a digital oscilloscope at data rates from 155 Mb/s to 1.5 Gb/s. Using a statistical model of Gaussian distribution for the random noise in the transmission, we developed a method to compute the BER instantaneously with the digital eye-diagrams. Direct measurements on this interconnects were also taken on a standard BER tester for verification. We found that the results of two methods were in the same order and within 50% accuracy. The integrated interconnects were investigated in an optoelectronic processing architecture of digital halftoning image processor. Error diffusion networks implemented by the inherently parallel nature of photonics promise to provide high quality digital halftoned images.

Charge transport in metal oxide nanocrystal-based materials

Science.gov (United States)

Runnerstrom, Evan Lars

There is probably no class of materials more varied, more widely used, or more ubiquitous than metal oxides. Depending on their composition, metal oxides can exhibit almost any number of properties. Of particular interest are the ways in which charge is transported in metal oxides: devices such as displays, touch screens, and smart windows rely on the ability of certain metal oxides to conduct electricity while maintaining visible transparency. Smart windows, fuel cells, and other electrochemical devices additionally rely on efficient transport of ionic charge in and around metal oxides. Colloidal synthesis has enabled metal oxide nanocrystals to emerge as a relatively new but highly tunable class of materials. Certain metal oxide nanocrystals, particularly highly doped metal oxides, have been enjoying rapid development in the last decade. As in myriad other materials systems, structure dictates the properties of metal oxide nanocrystals, but a full understanding of how nanocrystal synthesis, the processing of nanocrystal-based materials, and the structure of nanocrystals relate to the resulting properties of nanocrystal-based materials is still nascent. Gaining a fundamental understanding of and control over these structure-property relationships is crucial to developing a holistic understanding of metal oxide nanocrystals. The unique ability to tune metal oxide nanocrystals by changing composition through the introduction of dopants or by changing size and shape affords a way to study the interplay between structure, processing, and properties. This overall goal of this work is to chemically synthesize colloidal metal oxide nanocrystals, process them into useful materials, characterize charge transport in materials based on colloidal metal oxide nanocrystals, and develop ways to manipulate charge transport. In particular, this dissertation characterizes how the charge transport properties of metal oxide nanocrystal-based materials depend on their processing and

Ceria based protective coatings for steel interconnects prepared by spray pyrolysis

DEFF Research Database (Denmark)

Szymczewska, Dagmara; Molin, Sebastian; Chen, Ming

2014-01-01

Stainless steels can be used in solid oxide fuel/electrolysis stacks as interconnects. For successful long term operation they require protective coatings, that lower the corrosion rate and block chemical reactions between the interconnect and adjacent layers of the oxygen or the hydrogen electrode....... One of the promising coating materials for the hydrogen side is ceria. Using standard sintering techniques, ceria sinters at around 1400°C which even for a very short exposure would destroy the interconnect. Therefore in this paper a low temperature deposition method, i.e. spray pyrolysis, is used...

Metal-Organic Framework-Derived Materials for Sodium Energy Storage.

Science.gov (United States)

Zou, Guoqiang; Hou, Hongshuai; Ge, Peng; Huang, Zhaodong; Zhao, Ganggang; Yin, Dulin; Ji, Xiaobo

2018-01-01

Recently, sodium-ion batteries (SIBs) are extensively explored and are regarded as one of the most promising alternatives to lithium-ion batteries for electrochemical energy conversion and storage, owing to the abundant raw material resources, low cost, and similar electrochemical behavior of elemental sodium compared to lithium. Metal-organic frameworks (MOFs) have attracted enormous attention due to their high surface areas, tunable structures, and diverse applications in drug delivery, gas storage, and catalysis. Recently, there has been an escalating interest in exploiting MOF-derived materials as anodes for sodium energy storage due to their fast mass transport resulting from their highly porous structures and relatively simple preparation methods originating from in situ thermal treatment processes. In this Review, the recent progress of the sodium-ion storage performances of MOF-derived materials, including MOF-derived porous carbons, metal oxides, metal oxide/carbon nanocomposites, and other materials (e.g., metal phosphides, metal sulfides, and metal selenides), as SIB anodes is systematically and completely presented and discussed. Moreover, the current challenges and perspectives of MOF-derived materials in electrochemical energy storage are discussed. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

Energy Technology Data Exchange (ETDEWEB)

Tamura, Nobumichi; Chen, Kai; Kunz, Martin

2009-12-01

Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature.

Photovoltaic sub-cell interconnects

Energy Technology Data Exchange (ETDEWEB)

van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

2017-05-09

Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects

Energy Technology Data Exchange (ETDEWEB)

Meyer, M.A.

2007-07-12

This thesis provides a methodology for the investigation of electromigration (EM) in Cu-based interconnects. An experimental framework based on in-situ scanning electron microscopy (SEM) investigations was developed for that purpose. It is capable to visualize the EM-induced void formation and evolution in multi-level test structures in real time. Different types of interconnects were investigated. Furthermore, stressed and unstressed samples were studied applying advanced physical analysis techniques in order to obtain additional information about the microstructure of the interconnects as well as interfaces and grain boundaries. These data were correlated to the observed degradation phenomena. Correlations of the experimental results to recently established theoretical models were highlighted. Three types of Cu-based interconnects were studied. Pure Cu interconnects were compared to Al-alloyed (CuAl) and CoWP-coated interconnects. The latter two represent potential approaches that address EM-related reliability concerns. It was found that in such interconnects the dominant diffusion path is no longer the Cu/capping layer interface for interconnects as in pure Cu interconnects. Instead, void nucleation occurs at the bottom Cu/barrier interface with significant effects from grain boundaries. Moreover, the in-situ investigations revealed that the initial void nucleation does not occur at the cathode end of the lines but several micrometers away from it. The mean times-to-failure of CuAl and CoWP-coated interconnects were increased by at least one order of magnitude compared to Cu interconnects. The improvements were attributed to the presence of foreign metal atoms at the Cu/capping layer interface. Post-mortem EBSD investigations were used to reveal the microstructure of the tested samples. The data were correlated to the in-situ observations. (orig.)

Carbon nanotube based VLSI interconnects analysis and design

CERN Document Server

Kaushik, Brajesh Kumar

2015-01-01

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

Ceramic/metal and A15/metal superconducting composite materials exploiting the superconducting proximity effect and method of making the same

International Nuclear Information System (INIS)

Holcomb, M.J.

1999-01-01

A composite superconducting material made of coated particles of ceramic superconducting material and a metal matrix material is disclosed. The metal matrix material fills the regions between the coated particles. The coating material is a material that is chemically nonreactive with the ceramic. Preferably, it is silver. The coating serves to chemically insulate the ceramic from the metal matrix material. The metal matrix material is a metal that is susceptible to the superconducting proximity effect. Preferably, it is a NbTi alloy. The metal matrix material is induced to become superconducting by the superconducting proximity effect when the temperature of the material goes below the critical temperature of the ceramic. The material has the improved mechanical properties of the metal matrix material. Preferably, the material consists of approximately 10% NbTi, 90% coated ceramic particles (by volume). Certain aspects of the material and method will depend upon the particular ceramic superconductor employed. An alternative embodiment of the invention utilizes A15 compound superconducting particles in a metal matrix material which is preferably a NbTi alloy

Ceramic/metal and A15/metal superconducting composite materials exploiting the superconducting proximity effect and method of making the same

Science.gov (United States)

Holcomb, Matthew J.

1999-01-01

A composite superconducting material made of coated particles of ceramic superconducting material and a metal matrix material. The metal matrix material fills the regions between the coated particles. The coating material is a material that is chemically nonreactive with the ceramic. Preferably, it is silver. The coating serves to chemically insulate the ceramic from the metal matrix material. The metal matrix material is a metal that is susceptible to the superconducting proximity effect. Preferably, it is a NbTi alloy. The metal matrix material is induced to become superconducting by the superconducting proximity effect when the temperature of the material goes below the critical temperature of the ceramic. The material has the improved mechanical properties of the metal matrix material. Preferably, the material consists of approximately 10% NbTi, 90% coated ceramic particles (by volume). Certain aspects of the material and method will depend upon the particular ceramic superconductor employed. An alternative embodiment of the invention utilizes A15 compound superconducting particles in a metal matrix material which is preferably a NbTi alloy.

On the Distribution of Lightning Current among Interconnected Grounding Systems in Medium Voltage Grids

Directory of Open Access Journals (Sweden)

Guido Ala

2018-03-01

Full Text Available This paper presents the results of a first investigation on the effects of lightning stroke on medium voltage installations’ grounding systems, interconnected with the metal shields of the Medium Voltage (MV distribution grid cables or with bare buried copper ropes. The study enables us to evaluate the distribution of the lightning current among interconnected ground electrodes in order to estimate if the interconnection, usually created to reduce ground potential rise during a single-line-to-ground fault, can give place to dangerous situations far from the installation hit by the lightning stroke. Four different case studies of direct lightning stroke are presented and discussed: (1 two secondary substations interconnected by the cables’ shields; (2 two secondary substations interconnected by a bare buried conductor; (3 a high voltage/medium voltage station connected with a secondary substation by the medium voltage cables’ shields; (4 a high voltage/medium voltage station connected with a secondary substation by a bare buried conductor. The results of the simulations show that a higher peak-lowering action on the lighting-stroke current occurs due to the use of bare conductors as interconnection elements in comparison to the cables’ shields.

Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

DEFF Research Database (Denmark)

Sabourin, David; Snakenborg, Detlef; Dufva, Martin

2010-01-01

We have previously described 'Interconnection Blocks' which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin s...

Low resistivity Pt interconnects developed by electron beam assisted deposition using novel gas injector system

International Nuclear Information System (INIS)

Dias, R J; Romano-Rodriguez, A; O'Regan, C; Holmes, J D; Petkov, N; Thrompenaars, P; Mulder, J J L

2012-01-01

Electron beam-induced deposition (EBID) is a direct write process where an electron beam locally decomposes a precursor gas leaving behind non-volatile deposits. It is a fast and relatively in-expensive method designed to develop conductive (metal) or isolating (oxide) nanostructures. Unfortunately the EBID process results in deposition of metal nanostructures with relatively high resistivity because the gas precursors employed are hydrocarbon based. We have developed deposition protocols using novel gas-injector system (GIS) with a carbon free Pt precursor. Interconnect type structures were deposited on preformed metal architectures. The obtained structures were analysed by cross-sectional TEM and their electrical properties were analysed ex-situ using four point probe electrical tests. The results suggest that both the structural and electrical characteristics differ significantly from those of Pt interconnects deposited by conventional hydrocarbon based precursors, and show great promise for the development of low resistivity electrical contacts.

Reliability of spring interconnects for high channel-count polyimide electrode arrays

Science.gov (United States)

Khan, Sharif; Ordonez, Juan Sebastian; Stieglitz, Thomas

2018-05-01

Active neural implants with a high channel-count need robust and reliable operational assembly for the targeted environment in order to be classified as viable fully implantable systems. The discrete functionality of the electrode array and the implant electronics is vital for intact assembly. A critical interface exists at the interconnection sites between the electrode array and the implant electronics, especially in hybrid assemblies (e.g. retinal implants) where electrodes and electronics are not on the same substrate. Since the interconnects in such assemblies cannot be hermetically sealed, reliable protection against the physiological environment is essential for delivering high insulation resistance and low defusibility of salt ions, which are limited in complexity by current assembly techniques. This work reports on a combination of spring-type interconnects on a polyimide array with silicone rubber gasket insulation for chronically active implantable systems. The spring design of the interconnects on the backend of the electrode array compensates for the uniform thickness of the sandwiched gasket during bonding in assembly and relieves the propagation of extrinsic stresses to the bulk polyimide substrate. The contact resistance of the microflex-bonded spring interconnects with the underlying metallized ceramic test vehicles and insulation through the gasket between adjacent contacts was investigated against the MIL883 standard. The contact and insulation resistances remained stable in the exhausting environmental conditions.

Heat-processing method and facility for helium-containing metal material

International Nuclear Information System (INIS)

Kato, Takahiko; Kodama, Hideyo; Matsumoto, Toshimi; Aono, Yasuhisa; Nagata, Tetsuya; Hattori, Shigeo; Kaneda, Jun-ya; Ono, Shigeki.

1996-01-01

Electric current is supplied to an objective portion of a He-containing metal material to be applied with heat processing without causing melting, to decrease the He content of the portion. Subsequently, the defect portion of the tissues of the He-containing metal is modified by heating the portion with melting. Since electric current can be supplied to the metal material in a state where the metal material is heated and the temperature thereof is elevated, an effect of further reducing the He content can be obtained. Further, if the current supply and/or the heating relative to the metal material is performed in a vacuum or inert gas atmosphere, an effect of reducing the degradation of the surface of the objective portion to be supplied with electric current can be obtained. (T.M.)

Performance ratio hardness characteristics polystyrene-metal composite materials

International Nuclear Information System (INIS)

Klepikov, V.F.; Prokhorenko, E.M.; Lytvynenko, V.V.; Zakharchenko, A.A.; Hazhmuradov, M.A.

2015-01-01

The methods of measuring the hardness of layered polystyrene-metallic composite materials. It is proposed to use powder-like tungsten and powder-like steel as radiation-protective layer. A measurement of the hardness of composites of different composition, and given its dependence on the particle size and their form. The possibility of increasing the hardness of the composites reinforced with metallic additives. Radiation-protective characteristics were calculated for the studied species of composite materials. Influence of the quantitative composition of the metal components is studied on the change of the absorbed dose of gamma radiation

Corrosion of metal materials embedded in concrete

International Nuclear Information System (INIS)

Duffo, G.S.; Farina, S.B.; Schulz, F.M.

2010-01-01

Carbon steel is the material most frequently used to strengthen reinforced concrete structures; however, stainless steel and galvanized steel reinforcements are also used in construction concretes; and they are not often used in Latin America. Meanwhile, there are other metals that are embedded in the concrete forming part of the openings (aluminum) or in tubing systems (copper and lead). The use of concrete as a cementing material is also useful for immobilizing wastes, such as for example those generated by the nuclear industry. There is a great deal of research and development on the corrosion of steel reinforcements, but the same is not true for the behavior of other metals embedded in concrete and that also undergo corrosive processes. This work aims to study the corrosion of different metals: copper, lead, aluminum, zinc, stainless steel and carbon steel; embedded in concrete with and without the presence of aggressive species for the metal materials. Test pieces were made of mortar containing rods of different materials for testing, and with chlorides added in concentrations of 0; 0.3 % and 1% (mass of chloride per mass of cement). The test pieces were exposed to different conditions; laboratory environment with a relative humidity (RH) of 45%, a controlled atmosphere with 98% RH and submerged in a solution of 3.5% NaCl. The susceptibility to corrosion of the different metals was evaluated using techniques to monitor the corrosion potential, the resistivity of the mortar and the polarization resistance (PR). The rods were weighed before being placed inside the test pieces to later determine the loss of weight generated by the corrosion process. Polarization curves for the metals were also traced in a simulated pore solution (SPS) and in SPS with added chloride. The results obtained to date show that, of all the metals analyzed, aluminum is the most susceptible to corrosion, and that the test specimens with 0% and 1% of chloride exposed to the laboratory

Stretchable and Soft Electronics using Liquid Metals.

Science.gov (United States)

Dickey, Michael D

2017-07-01

The use of liquid metals based on gallium for soft and stretchable electronics is discussed. This emerging class of electronics is motivated, in part, by the new opportunities that arise from devices that have mechanical properties similar to those encountered in the human experience, such as skin, tissue, textiles, and clothing. These types of electronics (e.g., wearable or implantable electronics, sensors for soft robotics, e-skin) must operate during deformation. Liquid metals are compelling materials for these applications because, in principle, they are infinitely deformable while retaining metallic conductivity. Liquid metals have been used for stretchable wires and interconnects, reconfigurable antennas, soft sensors, self-healing circuits, and conformal electrodes. In contrast to Hg, liquid metals based on gallium have low toxicity and essentially no vapor pressure and are therefore considered safe to handle. Whereas most liquids bead up to minimize surface energy, the presence of a surface oxide on these metals makes it possible to pattern them into useful shapes using a variety of techniques, including fluidic injection and 3D printing. In addition to forming excellent conductors, these metals can be used actively to form memory devices, sensors, and diodes that are completely built from soft materials. The properties of these materials, their applications within soft and stretchable electronics, and future opportunities and challenges are considered. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Investigation of Friction Behaviors of Brake Shoe Materials using Metallic Filler

Directory of Open Access Journals (Sweden)

E. Surojo

2015-12-01

Full Text Available Some vehicles use brake shoe made from semi-metallic materials. Semi-metallic brake shoes are made from a combination of metallic and non-metallic materials. Metallic particles are added in the formulation of brake shoe material to improve composites characteristics. In this paper, friction behaviors of brake shoe material using metallic filler were investigated. Machining chips of cast iron and copper wire of electric motor used were incorporated in composite as metallic fillers with amount 0, 2, and 4 vol. %. Friction testing was performed to measure coefficient of friction by pressing surface specimen against the surface of rotating disc. The results show that cast iron chip and Cu short wire have effect on increasing coefficient of friction of brake shoe material. They form contact plateau at contact surface. At contact surface, the Cu short wires which have parallel orientation to the sliding contact were susceptible to detach from the matrix.

Molecule@MOF: A New Class of Opto-electronic Materials.

Energy Technology Data Exchange (ETDEWEB)

Talin, Albert Alec [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Jones, Reese E. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Spataru, Dan Catalin [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Leonard, Francois Leonard [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); He, Yuping [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Foster, Michael E. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Allendorf, Mark D. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Stavila, Vitalie [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Hopkins, Patrick E. [Univ. of Virginia, Charlottesville, VA (United States)

2017-09-01

Metal organic frameworks (MOFs) are extended, nanoporous crystalline compounds consisting of metal ions interconnected by organic ligands. Their synthetic versatility suggest a disruptive class of opto - electronic materials with a high degree of electrical tunability and without the property - degrading disorder of organic conductors. In this project we determined the factors controlling charge and energy transport in MOFs and evaluated their potential for thermoelectric energy conversion. Two strategies for a chieving electronic conductivity in MOFs were explored: 1) using redox active 'guest' molecules introduced into the pores to dope the framework via charge - transfer coupling (Guest@MOF), 2) metal organic graphene analogs (MOGs) with dispersive band structur es arising from strong electronic overlap between the MOG metal ions and its coordinating linker groups. Inkjet deposition methods were developed to facilitate integration of the guest@MOF and MOG materials into practical devices.

Hand Book of Metal Material Contrast

International Nuclear Information System (INIS)

Park, Yeong Hui

1989-06-01

This book first gives descriptions of using of this hand book and contents. It tells of steel such as bar steel, section steel, and steel sheet which are steel for general structure and steel for pressure vessel, a steel pipe, carbon steel for machine structure and alloy steel, steel for special things, stainless steel, heat resisting steel, tool steel, spring steel, forging, steel casting, nonferrous metal such as aluminium and aluminium alloy, casting, list of similar steel per metal, list of steel like ASTM, AISI per number, and list of collecting standard per metal material.

Interconnection policy: a theoretical survey

Directory of Open Access Journals (Sweden)

César Mattos

2003-01-01

Full Text Available This article surveys the theoretical foundations of interconnection policy. The requirement of an interconnection policy should not be taken for granted in all circumstances, even considering the issue of network externalities. On the other hand, when it is required, an encompassing interconnection policy is usually justified. We provide an overview of the theory on interconnection pricing that results in several different prescriptions depending on which problem the regulator aims to address. We also present a survey on the literature on two-way interconnection.

Compatibility of materials with liquid metal targets for SNS

International Nuclear Information System (INIS)

DiStefano, J.R.; Pawel, S.J.; DeVan, J.H.

1996-01-01

Several heavy liquid metals are candidates as the target in a spallation neutron source: Hg, Pb, Bi, and Pb-Bi eutectic. Systems with these liquid metals have been used in the past and a data-base on compatibility already exists. Two major compatibility issues have been identified when selecting a container material for these liquid metals: temperature gradient mass transfer and liquid metal embrittlement or LME. Temperature gradient mass transfer refers to dissolution of material from the high temperature portions of a system and its deposition in the lower temperature areas. Solution and deposition rate constants along with temperature, ΔT, and velocity are usually the most important parameters. For most candidate materials mass transfer corrosion has been found to be proportionately worse in Bi compared with Hg and Pb. For temperatures to ∼550 degrees C, ferritic/martensitic steels have been satisfactory in Pb or Hg systems and the maximum temperature can be extended to ∼650 degrees C with additions of inhibitors to the liquid metal, e.g. Mg, Ti, Zr. Above ∼600 degrees C, austenitic stainless steels have been reported to be unsatisfactory, largely because of the mass transfer of nickel. Blockage of flow from deposition of material is usually the life-limiting effect of this type of corrosion. However, mass transfer corrosion at lower temperatures has not been studied. At low temperatures (usually < 150 degrees C), LME has been reported for some liquid metal/container alloy combinations. Liquid metal embrittlement, like hydrogen embrittlement, results in brittle fracture of a normally ductile material

Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

DEFF Research Database (Denmark)

Sabourin, David; Snakenborg, Detlef; Dufva, Hans Martin

2009-01-01

In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observ...

Advances in Materials for Recent Low-Profile Implantable Bioelectronics

Directory of Open Access Journals (Sweden)

Yanfei Chen

2018-03-01

Full Text Available The rapid development of micro/nanofabrication technologies to engineer a variety of materials has enabled new types of bioelectronics for health monitoring and disease diagnostics. In this review, we summarize widely used electronic materials in recent low-profile implantable systems, including traditional metals and semiconductors, soft polymers, biodegradable metals, and organic materials. Silicon-based compounds have represented the traditional materials in medical devices, due to the fully established fabrication processes. Examples include miniaturized sensors for monitoring intraocular pressure and blood pressure, which are designed in an ultra-thin diaphragm to react with the applied pressure. These sensors are integrated into rigid circuits and multiple modules; this brings challenges regarding the fundamental material’s property mismatch with the targeted human tissues, which are intrinsically soft. Therefore, many polymeric materials have been investigated for hybrid integration with well-characterized functional materials such as silicon membranes and metal interconnects, which enable soft implantable bioelectronics. The most recent trend in implantable systems uses transient materials that naturally dissolve in body fluid after a programmed lifetime. Such biodegradable metallic materials are advantageous in the design of electronics due to their proven electrical properties. Collectively, this review delivers the development history of materials in implantable devices, while introducing new bioelectronics based on bioresorbable materials with multiple functionalities.

Advances in Materials for Recent Low-Profile Implantable Bioelectronics

Science.gov (United States)

Kim, Yun-Soung; Tillman, Bryan W.; Chun, Youngjae

2018-01-01

The rapid development of micro/nanofabrication technologies to engineer a variety of materials has enabled new types of bioelectronics for health monitoring and disease diagnostics. In this review, we summarize widely used electronic materials in recent low-profile implantable systems, including traditional metals and semiconductors, soft polymers, biodegradable metals, and organic materials. Silicon-based compounds have represented the traditional materials in medical devices, due to the fully established fabrication processes. Examples include miniaturized sensors for monitoring intraocular pressure and blood pressure, which are designed in an ultra-thin diaphragm to react with the applied pressure. These sensors are integrated into rigid circuits and multiple modules; this brings challenges regarding the fundamental material’s property mismatch with the targeted human tissues, which are intrinsically soft. Therefore, many polymeric materials have been investigated for hybrid integration with well-characterized functional materials such as silicon membranes and metal interconnects, which enable soft implantable bioelectronics. The most recent trend in implantable systems uses transient materials that naturally dissolve in body fluid after a programmed lifetime. Such biodegradable metallic materials are advantageous in the design of electronics due to their proven electrical properties. Collectively, this review delivers the development history of materials in implantable devices, while introducing new bioelectronics based on bioresorbable materials with multiple functionalities. PMID:29596359

High-density hybrid interconnect methodologies

International Nuclear Information System (INIS)

John, J.; Zimmermann, L.; Moor, P.De; Hoof, C.Van

2003-01-01

Full text: The presentation gives an overview of the state-of-the-art of hybrid integration and in particular the IMEC technological approaches that will be able to address future hybrid detector needs. The dense hybrid flip-chip integration of an array of detectors and its dedicated readout electronics can be achieved with a variety of solderbump techniques such as pure Indium or Indium alloys, Ph-In, Ni/PbSn, but also conducting polymers... Particularly for cooled applications or ultra-high density applications, Indium solderbump technology (electroplated or evaporated) is the method of choice. The state-of-the-art of solderbump technologies that are to a high degree independent of the underlying detector material will be presented and examples of interconnect densities between 5x1E4cm-2 and 1x1E6 cm-2 will be demonstrated. For several classes of detectors, flip-chip integration is not allowed since the detectors have to be illuminated from the top. This applies to image sensors for EUV applications such as GaN/AlGaN based detectors and to MEMS-based sensors. In such cases, the only viable interconnection method has to be through the (thinned) detector wafer followed by a solderbump-based integration. The approaches for dense and ultra-dense through-the-wafer interconnect 'vias' will be presented and wafer thinning approaches will be shown

Formability of porous tantalum sheet-metal

International Nuclear Information System (INIS)

Nebosky, Paul S; Schmid, Steven R; Pasang, Timotius

2009-01-01

Over the past ten years, a novel cellular solid, Trabecular Metal T M , has been developed for use in the orthopaedics industry as an ingrowth scaffold. Manufactured using chemical vapour deposition (CVD) on top of a graphite foam substrate, this material has a regular matrix of interconnecting pores, high strength, and high porosity. Manufacturing difficulties encourage the application of bending, stamping and forming technologies to increase CVD reactor throughput and reduce material wastes. In this study, the bending and forming behaviour of Trabecular Metal T M was evaluated using a novel camera-based system for measuring surface strains, since the conventional approach of printing or etching gridded patterns was not feasible. A forming limit diagram was obtained using specially fabricated 1.65 mm thick sheets. A springback coefficient was measured and modeled using effective hexagonal cell arrangements.

Synthesis and Characterization of Three Dimensional Nanostructures Based on Interconnected Carbon Nanomaterials

Science.gov (United States)

Koizumi, Ryota

This thesis addresses various types of synthetic methods for novel three dimensional nanomaterials and nanostructures based on interconnected carbon nanomaterials using solution chemistry and chemical vapor deposition (CVD) methods. Carbon nanotube (CNT) spheres with porous and scaffold structures consisting of interconnected CNTs were synthesized by solution chemistry followed by freeze-drying, which have high elasticity under nano-indentation tests. This allows the CNT spheres to be potentially applied to mechanical dampers. CNTs were also grown on two dimensional materials--such as reduced graphene oxide (rGO) and hexagonal boron nitride (h-BN)--by CVD methods, which are chemically interconnected. CNTs on rGO and h-BN interconnected structures performed well as electrodes for supercapacitors. Furthermore, unique interconnected flake structures of alpha-phase molybdenum carbide were developed by a CVD method. The molybdenum carbide can be used for a catalyst of hydrogen evolution reaction activity as well as an electrode for supercapacitors.

All-Metallic Vertical Transistors Based on Stacked Dirac Materials

OpenAIRE

Wang, Yangyang; Ni, Zeyuan; Liu, Qihang; Quhe, Ruge; Zheng, Jiaxin; Ye, Meng; Yu, Dapeng; Shi, Junjie; Yang, Jinbo; Lu, Jing

2014-01-01

It is an ongoing pursuit to use metal as a channel material in a field effect transistor. All metallic transistor can be fabricated from pristine semimetallic Dirac materials (such as graphene, silicene, and germanene), but the on/off current ratio is very low. In a vertical heterostructure composed by two Dirac materials, the Dirac cones of the two materials survive the weak interlayer van der Waals interaction based on density functional theory method, and electron transport from the Dirac ...

LHC beampipe interconnection

CERN Document Server

Particle beams circulate for around 10 hours in the Large Hadron Collider (LHC). During this time, the particles make four hundred million revolutions of the machine, travelling a distance equivalent to the diameter of the solar system. The beams must travel in a pipe which is emptied of air, to avoid collisions between the particles and air molecules (which are considerably bigger than protons). The beam pipes are pumped down to an air pressure similar to that on the surface of the moon. Much of the LHC runs at 1.9 degrees above absolute zero. When material is cooled, it contracts. The interconnections must absorb this contraction whilst maintaining electrical connectivity.

Inorganic and Metallic Nanotubular Materials Recent Technologies and Applications

CERN Document Server

Kijima, Tsuyoshi

2010-01-01

This book describes the synthesis, characterization and applications of inorganic and metallic nanotubular materials. It cover a wide variety of nanotubular materials excluding carbon nanotubes, ranging from metal oxides, sulfides and nitrides such as titanium oxide, tungsten sulfide, and boron nitride, as well as platinum and other noble-metals to unique nanotubes consisting of water, graphene or fullerene. Based on their structural and compositional characteristics, these nanotubular materials are of importance for their potential applications in electronic devices, photocatalysts, dye-sensitized solar cells, nanothermometers, electrodes for fuel cells and batteries, sensors, and reinforcing fillers for plastics, among others. Such materials are also having a great impact on future developments, including renewable-energy sources as well as highly efficient energy-conversion and energy-saving technologies. This book will be of particular interest to experts in the fields of nanotechnology, material science ...

Feasibility Study on 3-D Printing of Metallic Structural Materials with Robotized Laser-Based Metal Additive Manufacturing

Science.gov (United States)

Ding, Yaoyu; Kovacevic, Radovan

2016-07-01

Metallic structural materials continue to open new avenues in achieving exotic mechanical properties that are naturally unavailable. They hold great potential in developing novel products in diverse industries such as the automotive, aerospace, biomedical, oil and gas, and defense. Currently, the use of metallic structural materials in industry is still limited because of difficulties in their manufacturing. This article studied the feasibility of printing metallic structural materials with robotized laser-based metal additive manufacturing (RLMAM). In this study, two metallic structural materials characterized by an enlarged positive Poisson's ratio and a negative Poisson's ratio were designed and simulated, respectively. An RLMAM system developed at the Research Center for Advanced Manufacturing of Southern Methodist University was used to print them. The results of the tensile tests indicated that the printed samples successfully achieved the corresponding mechanical properties.

Influence of metal dental materials on MR imaging

Energy Technology Data Exchange (ETDEWEB)

Tsuchihashi, Toshio; Chiba, Michiko; Yoshizawa, Satoshi; Sasaki, Sadayuki; Maki, Toshio; Kitagawa, Matsuo; Suzuki, Takeshi [Nippon Medical School, Tokyo (Japan). Main Hospital; Nakata, Minoru; Fujita, Isao

1998-11-01

Differences in magnetic susceptibility produce artifacts and signal loss in magnetic resonance imaging (MRI). This study was undertaken to compare the degree of artifacts on MRI caused by metallic dental materials. The influence on MRI of six types of dental alloys, a dental implant, orthodontic appliance, and magnetic attachment was investigated. Among the dental metals, nickel-chromium alloy and cobalt-chromium alloy, which have ferromagnetism, caused significant metal artifacts. Gold-platinum alloy, gold-silver-palladium alloy, silver alloy, and amalgam alloy produced slight metal artifacts. The orthodontic appliance mainly consisted of iron, and the keeper for its magnetic attachment was made of stainless steel. For these reasons, marked metal artifacts and signal loss could be seen in both of them owing to their ferromagnetism. These results suggest that orthodontic appliances and magnetic attachments impair evaluation of the GRE and EPI techniques. It is therefore preferable to use predominantly diamagnetic or paramagnetic dental materials for MRI of the head and neck. Removable keepers should be used more widely to prevent metal artifacts and enhance safety on MRI. (author)

Influence of metal dental materials on MR imaging

International Nuclear Information System (INIS)

Tsuchihashi, Toshio; Chiba, Michiko; Yoshizawa, Satoshi; Sasaki, Sadayuki; Maki, Toshio; Kitagawa, Matsuo; Suzuki, Takeshi; Nakata, Minoru; Fujita, Isao

1998-01-01

Differences in magnetic susceptibility produce artifacts and signal loss in magnetic resonance imaging (MRI). This study was undertaken to compare the degree of artifacts on MRI caused by metallic dental materials. The influence on MRI of six types of dental alloys, a dental implant, orthodontic appliance, and magnetic attachment was investigated. Among the dental metals, nickel-chromium alloy and cobalt-chromium alloy, which have ferromagnetism, caused significant metal artifacts. Gold-platinum alloy, gold-silver-palladium alloy, silver alloy, and amalgam alloy produced slight metal artifacts. The orthodontic appliance mainly consisted of iron, and the keeper for its magnetic attachment was made of stainless steel. For these reasons, marked metal artifacts and signal loss could be seen in both of them owing to their ferromagnetism. These results suggest that orthodontic appliances and magnetic attachments impair evaluation of the GRE and EPI techniques. It is therefore preferable to use predominantly diamagnetic or paramagnetic dental materials for MRI of the head and neck. Removable keepers should be used more widely to prevent metal artifacts and enhance safety on MRI. (author)

Interconnected networks

CERN Document Server

2016-01-01

This volume provides an introduction to and overview of the emerging field of interconnected networks which include multi layer or multiplex networks, as well as networks of networks. Such networks present structural and dynamical features quite different from those observed in isolated networks. The presence of links between different networks or layers of a network typically alters the way such interconnected networks behave – understanding the role of interconnecting links is therefore a crucial step towards a more accurate description of real-world systems. While examples of such dissimilar properties are becoming more abundant – for example regarding diffusion, robustness and competition – the root of such differences remains to be elucidated. Each chapter in this topical collection is self-contained and can be read on its own, thus making it also suitable as reference for experienced researchers wishing to focus on a particular topic.

Interconnection of Distributed Energy Resources

Energy Technology Data Exchange (ETDEWEB)

Reiter, Emerson [National Renewable Energy Lab. (NREL), Golden, CO (United States)

2017-04-19

This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

Chemical compatibility of structural materials in alkali metals

International Nuclear Information System (INIS)

Natesan, K.; Rink, D.L.; Haglund, R.

1995-01-01

The objectives of this task are to (a) evaluate the chemical compatibility of structural alloys such as V-5 wt.%Cr-5 wt.%Ti alloy and Type 316 stainless steel for application in liquid alkali metals such as lithium and sodium-78 wt.% potassium (NaK) at temperatures in the range that are of interest for International Thermonuclear Experimental Reactor (ITER); (b) evaluate the transfer of nonmetallic elements such as oxygen, nitrogen, carbon, and hydrogen between structural materials and liquid metals; and (c) evaluate the effects of such transfers on the mechanical and microstructural characteristics of the materials for long-term service in liquid-metal-environments

Influence of hole transport material/metal contact interface on perovskite solar cells

Science.gov (United States)

Lei, Lei; Zhang, Shude; Yang, Songwang; Li, Xiaomin; Yu, Yu; Wei, Qingzhu; Ni, Zhichun; Li, Ming

2018-06-01

Interfaces have a significant impact on the performance of perovskite solar cells. This work investigated the influence of hole transport material/metal contact interface on photovoltaic behaviours of perovskite solar devices. Different hole material/metal contact interfaces were obtained by depositing the metal under different conditions. High incident kinetic energy metal particles were proved to penetrate and embed into the hole transport material. These isolated metal particles in hole transport materials capture holes and increase the apparent carrier transport resistance of the hole transport layer. Sample temperature was found to be of great significance in metal deposition. Since metal vapour has a high temperature, the deposition process accumulated a large amount of heat. The heat evaporated the additives in the hole transport layer and decreased the hole conductivity. On the other hand, high temperature may cause iodization of the metal contact.

Resource Efficient Metal and Material Recycling

Science.gov (United States)

Reuter, Markus A.; van Schaik, Antoinette

Metals enable sustainability through their use and their recyclability. However, various factors can affect the Resource Efficiency of Metal Processing and Recycling. Some typical factors that enable Resource Efficiency include and arranged under the drivers of sustainability: Environment (Maximize Resource Efficiency — Energy, Recyclates, Materials, Water, Sludges, Emissions, Land); Economic Feasibility (BAT & Recycling Systems Simulation / Digitalization, Product vis-à-vis Material Centric Recycling); and Social — Licence to Operate (Legislation, consumer, policy, theft, manual labour.). In order to realize this primary production has to be linked systemically with typical actors in the recycling chain such as Original Equipment Manufacturers (OEMs), Recyclers & Collection, Physical separation specialists as well as process metallurgical operations that produce high value metals, compounds and products that recycle back to products. This is best done with deep knowledge of multi-physics, technology, product & system design, process control, market, life cycle management, policy, to name a few. The combination of these will be discussed as Design for Sustainability (DfS) and Design for Recycling (DfR) applications.

Model of bidirectional reflectance distribution function for metallic materials

International Nuclear Information System (INIS)

Wang Kai; Zhu Jing-Ping; Liu Hong; Hou Xun

2016-01-01

Based on the three-component assumption that the reflection is divided into specular reflection, directional diffuse reflection, and ideal diffuse reflection, a bidirectional reflectance distribution function (BRDF) model of metallic materials is presented. Compared with the two-component assumption that the reflection is composed of specular reflection and diffuse reflection, the three-component assumption divides the diffuse reflection into directional diffuse and ideal diffuse reflection. This model effectively resolves the problem that constant diffuse reflection leads to considerable error for metallic materials. Simulation and measurement results validate that this three-component BRDF model can improve the modeling accuracy significantly and describe the reflection properties in the hemisphere space precisely for the metallic materials. (paper)

Model of bidirectional reflectance distribution function for metallic materials

Science.gov (United States)

Wang, Kai; Zhu, Jing-Ping; Liu, Hong; Hou, Xun

2016-09-01

Based on the three-component assumption that the reflection is divided into specular reflection, directional diffuse reflection, and ideal diffuse reflection, a bidirectional reflectance distribution function (BRDF) model of metallic materials is presented. Compared with the two-component assumption that the reflection is composed of specular reflection and diffuse reflection, the three-component assumption divides the diffuse reflection into directional diffuse and ideal diffuse reflection. This model effectively resolves the problem that constant diffuse reflection leads to considerable error for metallic materials. Simulation and measurement results validate that this three-component BRDF model can improve the modeling accuracy significantly and describe the reflection properties in the hemisphere space precisely for the metallic materials.

Failure of metals III: Fracture and fatigue of nanostructured metallic materials

International Nuclear Information System (INIS)

Pineau, André; Amine Benzerga, A.; Pardoen, Thomas

2016-01-01

Pushing the internal or external dimensions of metallic alloys down to the nanometer scale gives rise to strong materials, though most often at the expense of a low ductility and a low resistance to cracking, with negative impact on the transfer to engineering applications. These characteristics are observed, with some exceptions, in bulk ultra-fine grained and nanocrystalline metals, nano-twinned metals, thin metallic coatings on substrates and freestanding thin metallic films and nanowires. This overview encompasses all these systems to reveal commonalities in the origins of the lack of ductility and fracture resistance, in factors governing fatigue resistance, and in ways to improve properties. After surveying the various processing methods and key deformation mechanisms, we systematically address the current state of the art in terms of plastic localization, damage, static and fatigue cracking, for three classes of systems: (1) bulk ultra-fine grained and nanocrystalline metals, (2) thin metallic films on substrates, and (3) 1D and 2D freestanding micro and nanoscale systems. In doing so, we aim to favour cross-fertilization between progress made in the fields of mechanics of thin films, nanomechanics, fundamental researches in bulk nanocrystalline metals and metallurgy to impart enhanced resistance to fracture and fatigue in high-strength nanostructured systems. This involves exploiting intrinsic mechanisms, e.g. to enhance hardening and rate-sensitivity so as to delay necking, or improve grain-boundary cohesion to resist intergranular cracks or voids. Extrinsic methods can also be utilized such as by hybridizing the metal with another material to delocalize the deformation - as practiced in stretchable electronics. Fatigue crack initiation is in principle improved by a fine structure, but at the expense of larger fatigue crack growth rates. Extrinsic toughening through hybridization allows arresting or bridging cracks. The content and discussions are based on

Advanced materials for integrated optical waveguides

CERN Document Server

Tong Ph D, Xingcun Colin

2014-01-01

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, ...

Hierarchically interconnected porous scaffolds for phase change materials with improved thermal conductivity and efficient solar-to-electric energy conversion.

Science.gov (United States)

Yang, Jie; Yu, Peng; Tang, Li-Sheng; Bao, Rui-Ying; Liu, Zheng-Ying; Yang, Ming-Bo; Yang, Wei

2017-11-23

An ice-templating self-assembly strategy and a vacuum impregnation method were used to fabricate polyethylene glycol (PEG)/hierarchical porous scaffold composite phase change materials (PCMs). Hierarchically interconnected porous scaffolds of boron nitride (BN), with the aid of a small amount of graphene oxide (GO), endow the composite PCMs with high thermal conductivity, excellent shape-stability and efficient solar-to-electric energy conversion. The formation of a three-dimensional (3D) thermally conductive pathway in the composites contributes to improving the thermal conductivity up to 2.36 W m -1 K -1 at a relatively low content of BN (ca. 23 wt%). This work provides a route for thermally conductive and shape-stabilized composite PCMs used as energy storage materials.

Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects

International Nuclear Information System (INIS)

Chiodarelli, Nicolo'; Li, Yunlong; Arstila, Kai; Richard, Olivier; Cott, Daire J; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe M; Masahito, Sugiura; Kashiwagi, Yusaku

2011-01-01

Carbon nanotubes (CNT) are known to be materials with potential for manufacturing sub-20 nm high aspect ratio vertical interconnects in future microchips. In order to be successful with respect to contending against established tungsten or copper based interconnects, though, CNT must fulfil their promise of also providing low electrical resistance in integrated structures using scalable integration processes fully compatible with silicon technology. Hence, carefully engineered growth and integration solutions are required before we can fully exploit their potentialities. This work tackles the problem of optimizing a CNT integration process from the electrical perspective. The technique of measuring the CNT resistance as a function of the CNT length is here extended to CNT integrated in vertical contacts. This allows extracting the linear resistivity and the contact resistance of the CNT, two parameters to our knowledge never reported separately for vertical CNT contacts and which are of utmost importance, as they respectively measure the quality of the CNT and that of their metal contacts. The technique proposed allows electrically distinguishing the impact of each processing step individually on the CNT resistivity and the CNT contact resistance. Hence it constitutes a powerful technique for optimizing the process and developing CNT contacts of superior quality. This can be of relevant technological importance not only for interconnects but also for all those applications that rely on the electrical properties of CNT grown with a catalytic chemical vapor deposition method at low temperature.

Liquid metal reactor core material HT9

International Nuclear Information System (INIS)

Kim, S. H.; Kuk, I. H.; Ryu, W. S. and others

1998-03-01

A state-of-the art is surveyed on the liquid metal reactor core materials HT9. The purpose of this report is to give an insight for choosing and developing the materials to be applied to the KAERI prototype liquid metal reactor which is planned for the year of 2010. In-core stability of cladding materials is important to the extension of fuel burnup. Austenitic stainless steel (AISI 316) has been used as core material in the early LMR due to the good mechanical properties at high temperatures, but it has been found to show a poor swelling resistance. So many efforts have been made to solve this problem that HT9 have been developed. HT9 is 12Cr-1MoVW steel. The microstructure of HT9 consisted of tempered martensite with dispersed carbide. HT9 has superior irradiation swelling resistance as other BCC metals, and good sodium compatibility. HT9 has also a good irradiation creep properties below 500 dg C, but irradiation creep properties are degraded above 500 dg C. Researches are currently in progress to modify the HT9 in order to improve the irradiation creep properties above 500 dg C. New design studies for decreasing the core temperature below 500 dg C are needed to use HT9 as a core material. On the contrary, decrease of the thermal efficiency may occur due to lower-down of the operation temperature. (author). 51 refs., 6 tabs., 19 figs

Benefits of transmission interconnections

International Nuclear Information System (INIS)

Lyons, D.

2006-01-01

The benefits of new power transmission interconnections from Alberta were discussed with reference to the challenges and measures needed to move forward. Alberta's electricity system has had a long period of sustained growth in generation and demand and this trend is expected to continue. However, no new interconnections have been built since 1985 because the transmission network has not expanded in consequence with the growth in demand. As such, Alberta remains weakly interconnected with the rest of the western region. The benefits of stronger transmission interconnections include improved reliability, long-term generation capability, hydrothermal synergies, a more competitive market, system efficiencies and fuel diversity. It was noted that the more difficult challenges are not technical. Rather, the difficult challenges lie in finding an appropriate business model that recognizes different market structures. It was emphasized that additional interconnections are worthwhile and will require significant collaboration among market participants and governments. It was concluded that interties enable resource optimization between systems and their benefits far exceed their costs. tabs., figs

Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current

Science.gov (United States)

Luo, X. M.; Zhang, B.; Zhang, G. P.

2014-09-01

Thermal fatigue failure of metallization interconnect lines subjected to alternating currents (AC) is becoming a severe threat to the long-term reliability of micro/nanodevices with increasing electrical current density/power. Here, thermal fatigue failure behaviors and damage mechanisms of nanocrystalline Au interconnect lines on the silicon glass substrate have been investigated by applying general alternating currents (the pure alternating current coupled with a direct current (DC) component) with different frequencies ranging from 0.05 Hz to 5 kHz. We observed both thermal fatigue damages caused by Joule heating-induced cyclic strain/stress and electromigration (EM) damages caused by the DC component. Besides, the damage formation showed a strong electrically-thermally-mechanically coupled effect and frequency dependence. At lower frequencies, thermal fatigue damages were dominant and the main damage forms were grain coarsening with grain boundary (GB) cracking/voiding and grain thinning. At higher frequencies, EM damages took over and the main damage forms were GB cracking/voiding of smaller grains and hillocks. Furthermore, the healing effect of the reversing current was considered to elucidate damage mechanisms of the nanocrystalline Au lines generated by the general AC. Lastly, a modified model was proposed to predict the lifetime of the nanocrystalline metal interconnect lines, i.e., that was a competing drift velocity-based approach based on the threshold time required for reverse diffusion/healing to occur.

Fixed Orientation Interconnection Problems: Theory, Algorithms and Applications

DEFF Research Database (Denmark)

Zachariasen, Martin

Interconnection problems have natural applications in the design of integrated circuits (or chips). A modern chip consists of billions of transistors that are connected by metal wires on the surface of the chip. These metal wires are routed on a (fairly small) number of layers in such a way...... that electrically independent nets do not intersect each other. Traditional manufacturing technology limits the orientations of the wires to be either horizontal or vertical — and is known as Manhattan architecture. Over the last decade there has been a growing interest in general architectures, where more than two...... a significant step forward, both concerning theory and algorithms, for the fixed orientation Steiner tree problem. In addition, the work maintains a close link to applications and generalizations motivated by chip design....

Surface properties of ceramic/metal composite materials for thermionic converter applications

International Nuclear Information System (INIS)

Davis, P.R.; Bozack, M.J.; Swanson, L.W.

1983-01-01

Ceramic/metal composite electrode materials are of interest for thermionic energy conversion (TEC) applications for several reasons. These materials consist of submicron metal fibers or islands in an oxide matrix and therefore provide a basis for fabricating finely structured electrodes, with projecting or recessed metallic regions for more efficient electron emission or collection. Furthermore, evaporation and surface diffusion of matrix oxides may provide oxygen enhancement of cesium adsorption and work function lowering at both the collecting and emitting electrode surfaces of the TEC. Finally, the high work function oxide matrix or oxide-metal interfaces may provide efficient surface ionization of cesium for space-charge reduction in the device. The authors are investigating two types of ceramic/metal composite materials. One type is a directionally solidified eutectic consisting of a bulk oxide matrix such as UO 2 or stabilized ZrO 2 with parallel metal fibers (W) running through the oxide being exposed at the surface by cutting perpendicular to the fiber direction. The second type of material, called a surface eutectic, consists of a refractory substrate (Mo) with a thin layer of deposited and segregated material (Mo-Cr 2 O 3 -A1 2 O 3 ) on the surface. The final configuration of this layer is an oxide matrix with metallic islands scattered throughout

Examination of Critical Length Effect in Copper Interconnects With Oxide and Low-k Dielectrics

International Nuclear Information System (INIS)

Thrasher, Stacye; Gall, Martin; Justison, Patrick; Hernandez, Richard; Kawasaki, Hisao; Capasso, Cristiano; Nguyen, Timothy

2004-01-01

As technology moves toward faster microelectronic devices with smaller feature sizes, copper is replacing aluminum-copper alloy and low-k dielectric is replacing oxide as the materials of choice for advanced interconnect integrations. Copper not only brings to the table the advantage of lower resistivity, but also exhibits better electromigration performance when compared to Al(Cu). Low-k dielectric materials are advantageous because they reduce power consumption and improve signal delay. Due to these advantages, the industry trend is moving towards integrating copper and low-k dielectric for high performance interconnects. The purpose of this study is to evaluate the critical length effect in single-inlaid copper interconnects and determine the critical product (jl)c, for a variety of integrations, examining the effect of ILD (oxide vs. low-k), geometry, and stress temperature

In-memory interconnect protocol configuration registers

Energy Technology Data Exchange (ETDEWEB)

Cheng, Kevin Y.; Roberts, David A.

2017-09-19

Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

In-memory interconnect protocol configuration registers

Science.gov (United States)

Cheng, Kevin Y.; Roberts, David A.

2017-09-19

Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

Microporous Metal Organic Materials for Hydrogen Storage

Energy Technology Data Exchange (ETDEWEB)

S. G. Sankar; Jing Li; Karl Johnson

2008-11-30

We have examined a number of Metal Organic Framework Materials for their potential in hydrogen storage applications. Results obtained in this study may, in general, be summarized as follows: (1) We have identified a new family of porous metal organic framework materials with the compositions M (bdc) (ted){sub 0.5}, {l_brace}M = Zn or Co, bdc = biphenyl dicarboxylate and ted = triethylene diamine{r_brace} that adsorb large quantities of hydrogen ({approx}4.6 wt%) at 77 K and a hydrogen pressure of 50 atm. The modeling performed on these materials agree reasonably well with the experimental results. (2) In some instances, such as in Y{sub 2}(sdba){sub 3}, even though the modeling predicted the possibility of hydrogen adsorption (although only small quantities, {approx}1.2 wt%, 77 K, 50 atm. hydrogen), our experiments indicate that the sample does not adsorb any hydrogen. This may be related to the fact that the pores are extremely small or may be attributed to the lack of proper activation process. (3) Some samples such as Zn (tbip) (tbip = 5-tert butyl isophthalate) exhibit hysteresis characteristics in hydrogen sorption between adsorption and desorption runs. Modeling studies on this sample show good agreement with the desorption behavior. It is necessary to conduct additional studies to fully understand this behavior. (4) Molecular simulations have demonstrated the need to enhance the solid-fluid potential of interaction in order to achieve much higher adsorption amounts at room temperature. We speculate that this may be accomplished through incorporation of light transition metals, such as titanium and scandium, into the metal organic framework materials.

Laser assisted embedding of nanoparticles into metallic materials

International Nuclear Information System (INIS)

Lin Dong; Suslov, Sergey; Ye Chang; Liao Yiliang; Liu, C. Richard; Cheng, Gary J.

2012-01-01

This paper reports a methodology of half-embedding nanoparticles into metallic materials. Transparent and opaque nanoparticles are chosen to demonstrate the process of laser assisted nanoparticle embedding. Dip coating method is used to coat transparent or opaque nanoparticle on the surface of metallic material. Nanoparticles are embedded into substrate by laser irradiation. In this study, the mechanism and process of nanoparticle embedding are investigated. It is found both transparent and opaque nanoparticles embedding are with high densities and good uniformities.

Metal-ceramic materials. Study and prediction of effective mechanical properties

International Nuclear Information System (INIS)

Karakulov, Valerii V.; Smolin, Igor Yu.

2016-01-01

Mechanical behavior of stochastic metal-ceramic composite materials was numerically simulated on mesoscopic scale level. Deformation of mesoscopic volumes of composites, whose structure consists of a metal matrix and randomly distributed ceramic inclusions, was numerically simulated. The results of the numerical simulation were used for evaluation of the effective elastic and strength properties of metal-ceramic materials with different parameters of the structure. The values of the effective mechanical properties of investigated materials were obtained, and the character of the dependence of the effective elastic and strength properties on the structure parameters of composites was determined.

Individual pore and interconnection size analysis of macroporous ceramic scaffolds using high-resolution X-ray tomography

Energy Technology Data Exchange (ETDEWEB)

Jerban, Saeed, E-mail: saeed.jerban@usherbrooke.ca; Elkoun, Saïd, E-mail: Said.Elkoun@usherbrooke.ca

2016-08-15

The pore interconnection size of β-tricalcium phosphate scaffolds plays an essential role in the bone repair process. Although, the μCT technique is widely used in the biomaterial community, it is rarely used to measure the interconnection size because of the lack of algorithms. In addition, discrete nature of the μCT introduces large systematic errors due to the convex geometry of interconnections. We proposed, verified and validated a novel pore-level algorithm to accurately characterize the individual pores and interconnections. Specifically, pores and interconnections were isolated, labeled, and individually analyzed with high accuracy. The technique was verified thoroughly by visually inspecting and verifying over 3474 properties of randomly selected pores. This extensive verification process has passed a one-percent accuracy criterion. Scanning errors inherent in the discretization, which lead to both dummy and significantly overestimated interconnections, have been examined using computer-based simulations and additional high-resolution scanning. Then accurate correction charts were developed and used to reduce the scanning errors. Only after the corrections, both the μCT and SEM-based results converged, and the novel algorithm was validated. Material scientists with access to all geometrical properties of individual pores and interconnections, using the novel algorithm, will have a more-detailed and accurate description of the substitute architecture and a potentially deeper understanding of the link between the geometric and biological interaction. - Highlights: •An algorithm is developed to analyze individually all pores and interconnections. •After pore isolating, the discretization errors in interconnections were corrected. •Dummy interconnections and overestimated sizes were due to thin material walls. •The isolating algorithm was verified through visual inspection (99% accurate). •After correcting for the systematic errors, algorithm was

Metallic fuel development

International Nuclear Information System (INIS)

Walters, L.C.

1987-01-01

Metallic fuels are capable of achieving high burnup as a result of design modifications instituted in the late 1960's. The gap between the fuel slug and the cladding is fixed such that by the time the fuel swells to the cladding the fission gas bubbles interconnect and release the fission gas to an appropriately sized plenum volume. Interconnected porosity thus provides room for the fuel to deform from further swelling rather than stress the cladding. In addition, the interconnected porosity allows the fuel pin to be tolerant to transient events because as stresses are generated during a transient event the fuel flows rather than applying significant stress to the cladding. Until 1969 a number of metallic fuel alloys were under development in the US. At that time the metallic fuel development program in the US was discontinued in favor of ceramic fuels. However, development had proceeded to the point where it was clear that the zirconium addition to uranium-plutonium fuel would yield a ternary fuel with an adequately high solidus temperature and good compatibility with austenitic stainless steel cladding. Furthermore, several U-Pu-Zr fuel pins had achieved about 6 at.% bu by the late 1960's, without failure, and thus the prospect for high burnup was promising

Filter materials for metal removal from mine drainage--a review.

Science.gov (United States)

Westholm, Lena Johansson; Repo, Eveliina; Sillanpää, Mika

2014-01-01

A large number of filter materials, organic and inorganic, for removal of heavy metals in mine drainage have been reviewed. Bark, chitin, chitosan, commercial ion exchangers, dairy manure compost, lignite, peat, rice husks, vegetal compost, and yeast are examples of organic materials, while bio-carbons, calcareous shale, dolomite, fly ash, limestone, olivine, steel slag materials and zeolites are examples of inorganic materials. The majority of these filter materials have been investigated in laboratory studies, based on various experimental set-ups (batch and/or column tests) and different conditions. A few materials, for instance steel slag materials, have also been subjects to field investigations under real-life conditions. The results from these investigations show that steel slag materials have the potential to remove heavy metals under different conditions. Ion exchange has been suggested as the major metal removal mechanisms not only for steel slag but also for lignite. Other suggested removal mechanisms have also been identified. Adsorption has been suggested important for activated carbon, precipitation for chitosan and sulphate reduction for olivine. General findings indicate that the results with regard to metal removal vary due to experimental set ups, composition of mine drainage and properties of filter materials and the discrepancies between studies renders normalisation of data difficult. However, the literature reveals that Fe, Zn, Pb, Hg and Al are removed to a large extent. Further investigations, especially under real-life conditions, are however necessary in order to find suitable filter materials for treatment of mine drainage.

Polymer-assisted metal deposition (PAMD): a full-solution strategy for flexible, stretchable, compressible, and wearable metal conductors.

Science.gov (United States)

Yu, You; Yan, Casey; Zheng, Zijian

2014-08-20

Metal interconnects, contacts, and electrodes are indispensable elements for most applications of flexible, stretchable, and wearable electronics. Current fabrication methods for these metal conductors are mainly based on conventional microfabrication procedures that have been migrated from Si semiconductor industries, which face significant challenges for organic-based compliant substrates. This Research News highlights a recently developed full-solution processing strategy, polymer-assisted metal deposition (PAMD), which is particularly suitable for the roll-to-roll, low-cost fabrication of high-performance compliant metal conductors (Cu, Ni, Ag, and Au) on a wide variety of organic substrates including plastics, elastomers, papers, and textiles. This paper presents i) the principles of PAMD, and how to use it for making ii) flexible, stretchable, and wearable conductive metal electrodes, iii) patterned metal interconnects, and d) 3D stretchable and compressible metal sponges. A critical perspective on this emerging strategy is also provided. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

New multifunctional lightweight materials based on cellular metals - manufacturing, properties and applications

International Nuclear Information System (INIS)

Stephani, Guenter; Quadbeck, Peter; Andersen, Olaf

2009-01-01

Cellular metallic materials are a new class of materials which have been the focus of numerous scientific studies over the past few years. The increasing interest in cellular metals is due to the fact that the introduction of pores into the materials significantly lowers the density. These highly porous materials also possess combinations of properties which are not possible to achieve with other materials. Besides the drastic weight and material savings that arise from the cell structure, there are also other application-specific benefits such as noise and energy absorption, heat insulation, mechanical damping, filtration effects and also catalytic properties. Cellular metallic materials are hence multi-functional lightweight materials.

Microtexture of Strain in electroplated copper interconnects

International Nuclear Information System (INIS)

Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.; Patel, J.R.

2001-01-01

The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbeam x-ray diffraction (MBXRD) that have enabled measurement not only of the microstructure of totally encapsulated conductors but also of the local stresses in them on a micron and submicron scale. White x-rays from the Advanced Light Source were focused to a micron spot size by Kirkpatrick-Baez mirrors. The sample was stepped under the micro-beam and Laue images obtained at each sample location using a CCD area detector. Microstructure and local strain were deduced from these images. Cu lines with widths ranging from 0.8 mm to 5 mm and thickness of 1 mm were investigated. Comparisons are made between the capabilities of MBXRD and the well established techniques of broad beam XRD, electron back scatter diffraction (EBSD) and focused ion beam imagining (FIB)

Interconnect patterns for printed organic thermoelectric devices with large fill factors

Science.gov (United States)

Gordiz, Kiarash; Menon, Akanksha K.; Yee, Shannon K.

2017-09-01

Organic materials can be printed into thermoelectric (TE) devices for low temperature energy harvesting applications. The output voltage of printed devices is often limited by (i) small temperature differences across the active materials attributed to small leg lengths and (ii) the lower Seebeck coefficient of organic materials compared to their inorganic counterparts. To increase the voltage, a large number of p- and n-type leg pairs is required for organic TEs; this, however, results in an increased interconnect resistance, which then limits the device output power. In this work, we discuss practical concepts to address this problem by positioning TE legs in a hexagonal closed-packed layout. This helps achieve higher fill factors (˜91%) than conventional inorganic devices (˜25%), which ultimately results in higher voltages and power densities due to lower interconnect resistances. In addition, wiring the legs following a Hilbert spacing-filling pattern allows for facile load matching to each application. This is made possible by leveraging the fractal nature of the Hilbert interconnect pattern, which results in identical sub-modules. Using the Hilbert design, sub-modules can better accommodate non-uniform temperature distributions because they naturally self-localize. These device design concepts open new avenues for roll-to-roll printing and custom TE module shapes, thereby enabling organic TE modules for self-powered sensors and wearable electronic applications.

Design of multi materials combining crystalline and amorphous metallic alloys

International Nuclear Information System (INIS)

Volland, A.; Ragani, J.; Liu, Y.; Gravier, S.; Suéry, M.; Blandin, J.J.

2012-01-01

Highlights: ► Elaboration of multi materials associating metallic glasses and conventional crystalline alloys by co-deformation performed at temperatures close to the glass transition temperature of the metallic glasses. ► Elaboration of filamentary metal matrix composites with a core in metallic glass by co extrusion. ► Sandwich structures produced by co-pressing. ► Detection of atomic diffusion from the glass to the crystalline alloys during the processes. ► Good interfaces between the metallic glasses and the crystalline alloys, as confirmed by mechanical characterisation. - Abstract: Multi materials, associating zirconium based bulk metallic glasses and crystalline metallic alloys like magnesium alloys or copper are elaborated by co-deformation processing performed in the supercooled liquid regions (SLR) of the bulk metallic glasses. Two processes are investigated: co-extrusion and co-pressing. In the first case, filamentary composites with various designs can be produced whereas in the second case sandwich structures are obtained. The experimental window (temperature, time) in which processing can be carried out is directly related to the crystallisation resistance of the glass which requires getting information about the crystallisation conditions in the selected metallic glasses. Thermoforming windows are identified for the studied BMGs by thermal analysis and compression tests in their SLR. The mechanical properties of the produced multi materials are investigated thanks to specifically developed mechanical devices and the interfaces between the amorphous and the crystalline alloys are characterised.

Radioactive materials transporting container and vehicles

International Nuclear Information System (INIS)

Reese, S.L.

1980-01-01

A container and vehicle therefor for transporting radioactive materials is provided. The container utilizes a removable system of heat conducting fins made of a light weight highly heat conductive metal, such as aluminum or aluminum alloys. This permits a substantial reduction in the weight of the container during transport, increases the heat dissipation capability of the container and substantially reduces the scrubbing operation after loading and before unloading the radioactive material from the container. The vehicle utilizes only a pair of horizontal side beams interconnecting a pair of yoke members to support the container and provide the necessary strength and safety with a minimum of weight

Comparison of properties of silver-metal oxide electrical contact materials

Directory of Open Access Journals (Sweden)

Ćosović V.

2012-01-01

Full Text Available Changes in physical properties such as density, porosity, hardness and electrical conductivity of the Ag-SnO2 and Ag-SnO2In2O3 electrical contact materials induced by introduction of metal oxide nanoparticles were investigated. Properties of the obtained silver-metal oxide nanoparticle composites are discussed and presented in comparison to their counterparts with the micro metal oxide particles as well as comparable Ag-SnO2WO3 and Ag-ZnO contact materials. Studied silvermetal oxide composites were produced by powder metallurgy method from very fine pure silver and micro- and nanoparticle metal oxide powders. Very uniform microstructures were obtained for all investigated composites and they exhibited physical properties that are comparable with relevant properties of equivalent commercial silver based electrical contact materials. Both Ag-SnO2 and Ag- SnO2In2O3 composites with metal oxide nanoparticles were found to have lower porosity, higher density and hardness than their respective counterparts which can be attributed to better dispersion hardening i.e. higher degree of dispersion of metal oxide in silver matrix.

Recent Advances as Materials of Functional Metal-Organic Frameworks

Directory of Open Access Journals (Sweden)

Xiao-Lan Tong

2013-01-01

Full Text Available Metal-organic frameworks (MOFs, also known as hybrid inorganic-organic materials, represent an emerging class of materials that have attracted the imagination of solid-state chemists because MOFs combine unprecedented levels of porosity with a range of other functional properties that occur through the metal moiety and/or the organic ligand. The purpose of this critical review is to give a representative and comprehensive overview of the arising developments in the field of functional metal-organic frameworks, including luminescence, magnetism, and porosity through presenting examples. This review will be of interest to researchers and synthetic chemists attempting to design multifunctional MOFs.

A refractory metal gate approach for micronic CMOS technology

International Nuclear Information System (INIS)

Lubowiecki, V.; Ledys, J.L.; Plossu, C.; Balland, B.

1987-01-01

In the future, devices scaling down, integration density and performance improvements are going to bring a number of conventional circuit design and process techniques to their fundamental limits. To avoid any severe limitations in MOS ULSI (Ultra Large Scale Integration) technologies, interconnection materials and schemes are required to emerge, in order to face the Megabits memory field. Among those, the gate approach will obviously take a keyrole, when the operating speed of ULSI chips will reach the practical upper limits imposed by parasitic resistances and capacitances which stem from the circuit interconnect wiring. Even if fairly suitable for MOS process, doped polycrystalline silicon is being gradually replaced by refractory metal silicide or polycide structures, which match better with low resistivity requirements. However, as we approach the submicronic IC's, higher conductivity materials will be paid more and more attention. Recently, works have been devoted and published on refractory metal gate technologies. Molybdenum or tungsten, deposited either by CVD or PVD methods, are currently reported even if some drawbacks in their process integration still remain. This paper is willing to present such an approach based on tungsten (more reliable than Molybdenum deposited by LPCVD (giving more conductive and more stable films than PVD). Deposition process will be first described. Then CMOS process flow will allow us to focus on specific refractory metal gate issues. Finally, electrical and physical properties will be assessed, which will demonstrate the feasibility of such a technology as well as the compatibility of the tungsten with most of the usual techniques

Study on corrosion of metal materials in nitrate molten salts

Science.gov (United States)

Zhai, Wei; Yang, Bo; Li, Maodong; Li, Shiping; Xin, Mingliang; Zhang, Shuanghong; Huang, Guojia

2017-01-01

High temperature molten salts as a heat transfer heat storage medium has been more widely used in the field of concentrated solar thermal power generation. In the thermal heat storage system, metal material stability and performance at high temperatures are of one major limitation in increasing this operating temperature. In this paper, study on corrosion of 321H, 304, 316L, P91 metal materials in modified solar two molten salts. The corrosion kinetics of 304, 316L, 321H, P91 metal material in the modified solar two molten salts at 450°C, 500°C is also investigated. Under the same condition it was found that 304, 321H corroded at a rate of 40% less than P91. Spallation of corrosion products was observed on P91 steel, while no obvious observed on other kinds of stainless steel. Corrosion rates of 304, 321H, and 316L slowly increased with temperature. Oxidation mechanisms little varied with temperature. Corrosion products of metal materials observed at 450°C, 500°C were primarily Fe oxide and Fe, Cr oxide.

Single OR molecule and OR atomic circuit logic gates interconnected on a Si(100)H surface

International Nuclear Information System (INIS)

Ample, F; Joachim, C; Duchemin, I; Hliwa, M

2011-01-01

Electron transport calculations were carried out for three terminal OR logic gates constructed either with a single molecule or with a surface dangling bond circuit interconnected on a Si(100)H surface. The corresponding multi-electrode multi-channel scattering matrix (where the central three terminal junction OR gate is the scattering center) was calculated, taking into account the electronic structure of the supporting Si(100)H surface, the metallic interconnection nano-pads, the surface atomic wires and the molecule. Well interconnected, an optimized OR molecule can only run at a maximum of 10 nA output current intensity for a 0.5 V bias voltage. For the same voltage and with no molecule in the circuit, the output current of an OR surface atomic scale circuit can reach 4 μA.

Policy issues in interconnecting networks

Science.gov (United States)

Leiner, Barry M.

1989-01-01

To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

Multi-net optimization of VLSI interconnect

CERN Document Server

Moiseev, Konstantin; Wimer, Shmuel

2015-01-01

This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimal...

Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits.

Science.gov (United States)

Nam, SungWoo; Jiang, Xiaocheng; Xiong, Qihua; Ham, Donhee; Lieber, Charles M

2009-12-15

Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arsenide (n-InAs) and p-type germanium/silicon core/shell (p-Ge/Si) nanowire (NW) field-effect transistors (FETs). The DC voltage output (V(out)) versus input (V(in)) response of vertically interconnected CMOS inverters showed sharp switching at close to the ideal value of one-half the supply voltage and, moreover, exhibited substantial DC gain of approximately 45. The gain and the rail-to-rail output switching are consistent with the large noise margin and minimal static power consumption of CMOS. Vertically interconnected, three-stage CMOS ring oscillators were also fabricated by using layer-1 InAs NW n-FETs and layer-2 Ge/Si NW p-FETs. Significantly, measurements of these circuits demonstrated stable, self-sustained oscillations with a maximum frequency of 108 MHz, which represents the highest-frequency integrated circuit based on chemically synthesized nanoscale materials. These results highlight the flexibility of bottom-up assembly of distinct nanoscale materials and suggest substantial promise for 3D integrated circuits.

Cermet materials prepared by combustion synthesis and metal infiltration

Science.gov (United States)

Holt, Joseph B.; Dunmead, Stephen D.; Halverson, Danny C.; Landingham, Richard L.

1991-01-01

Ceramic-metal composites (cermets) are made by a combination of self-propagating high temperature combustion synthesis and molten metal infiltration. Solid-gas, solid-solid and solid-liquid reactions of a powder compact produce a porous ceramic body which is infiltrated by molten metal to produce a composite body of higher density. AlN-Al and many other materials can be produced.

International measures needed to protect metal recycling facilities from radioactive materials

International Nuclear Information System (INIS)

Mattia, M.; Wiener, R.

1999-01-01

In almost every major city and region of every country, there is a recycling facility that is designed to process or consume scrap metal. These same countries will probably have widespread applications of radioactive materials and radiation generating equipment. This material and equipment will have metal as a primary component of its housing or instrumentation. It is this metal that will cause these sources of radioactivity, when lost, stolen or mishandled, to be taken to a metal recycling facility to be sold for the value of the metal. This is the problem that has faced scrap recycling facilities for many years. The recycling industry has spent millions of dollars for installation of radiation monitors and training in identification of radioactive material. It has expended millions more for the disposal of radioactive material that has mistakenly entered these facilities. Action must be taken to prevent this material from entering the conventional recycling process. There are more than 2,300 known incidents of radioactive material found in recycled metal scrap. Worldwide, more than 50 smeltings of radioactive sources have been confirmed. Seven fatal accidents involving uncontrolled radioactive material have also been documented. Hazardous exposures to radioactive material have plagued not just the workers at metal recycling facilities. The families of these workers, including their children, have been exposed to potentially harmful levels of radioactivity. The threat from this material does not stop there. Radioactive material that is not caught at recycling facilities can be melted and the radioactivity has been found in construction materials used to build homes, as well as shovels, fencing material, and furniture offered for sale to the general public. The time has come for the international community to address the issue of the uncontrolled sources of radioactive material. The following are the key points that must be addressed. (i) Identification of sources

18 CFR 292.306 - Interconnection costs.

Science.gov (United States)

2010-04-01

... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any electric...

Interactions between heavy metals and photosynthetic materials studied by optical techniques.

Science.gov (United States)

Ventrella, Andrea; Catucci, Lucia; Piletska, Elena; Piletsky, Sergey; Agostiano, Angela

2009-11-01

In this work studies on rapid inhibitory interactions between heavy metals and photosynthetic materials at different organization levels were carried out by optical assay techniques, investigating the possibility of applications in the heavy metal detection field. Spinach chloroplasts, thylakoids and Photosystem II proteins were employed as biotools in combination with colorimetric assays based on dichlorophenol indophenole (DCIP) photoreduction and on fluorescence emission techniques. It was found that copper and mercury demonstrated a strong and rapid photosynthetic activity inhibition, that varied from proteins to membranes, while other metals like nickel, cobalt and manganese produced only slight inhibition effects on all tested photosynthetic materials. By emission measurements, only copper was found to rapidly influence the photosynthetic material signals. These findings give interesting information about the rapid effects of heavy metals on isolated photosynthetic samples, and are in addition to the literature data concerning the effects of growth in heavy metal enriched media.

Comparative study of material loss at the taper interface in retrieved metal-on-polyethylene and metal-on-metal femoral components from a single manufacturer.

Science.gov (United States)

Bills, Paul; Racasan, Radu; Bhattacharya, Saugatta; Blunt, Liam; Isaac, Graham

2017-08-01

There have been a number of reports on the occurrence of taper corrosion and/or fretting and some have speculated on a link to the occurrence of adverse local tissue reaction specifically in relation to total hip replacement which have a metal-on-metal bearing. As such a study was carried out to compare the magnitude of material loss at the taper in a series of retrieved femoral heads used in metal-on-polyethylene bearings with that in a series of retrieved heads used in metal-on-metal bearings. A total of 36 metal-on-polyethylene and 21 metal-on-metal femoral components were included in the study all of which were received from a customer complaint database. Furthermore, a total of nine as-manufactured femoral components were included to provide a baseline for characterisation. All taper surfaces were assessed using an established corrosion scoring method and measurements were taken of the female taper surface using a contact profilometry. In the case of metal-on-metal components, the bearing wear was also assessed using coordinate metrology to determine whether or not there was a relationship between bearing and taper material loss in these cases. The study found that in this cohort the median value of metal-on-polyethylene taper loss was 1.25 mm 3 with the consequent median value for metal-on-metal taper loss being 1.75 mm 3 . This study also suggests that manufacturing form can result in an apparent loss of material from the taper surface determined to have a median value of 0.59 mm 3 . Therefore, it is clear that form variability is a significant confounding factor in the measurement of material loss from the tapers of femoral heads retrieved following revision surgery.

Decentralised output feedback control of Markovian jump interconnected systems with unknown interconnections

Science.gov (United States)

Li, Li-Wei; Yang, Guang-Hong

2017-07-01

The problem of decentralised output feedback control is addressed for Markovian jump interconnected systems with unknown interconnections and general transition rates (TRs) allowed to be unknown or known with uncertainties. A class of decentralised dynamic output feedback controllers are constructed, and a cyclic-small-gain condition is exploited to dispose the unknown interconnections so that the resultant closed-loop system is stochastically stable and satisfies an H∞ performance. With slack matrices to cope with the nonlinearities incurred by unknown and uncertain TRs in control synthesis, a novel controller design condition is developed in linear matrix inequality formalism. Compared with the existing works, the proposed approach leads to less conservatism. Finally, two examples are used to illustrate the effectiveness of the new results.

Synthesis of three-dimensionally interconnected sulfur-rich polymers for cathode materials of high-rate lithium-sulfur batteries

Science.gov (United States)

Kim, Hoon; Lee, Joungphil; Ahn, Hyungmin; Kim, Onnuri; Park, Moon Jeong

2015-06-01

Elemental sulfur is one of the most attractive cathode active materials in lithium batteries because of its high theoretical specific capacity. Despite the positive aspect, lithium-sulfur batteries have suffered from severe capacity fading and limited rate capability. Here we report facile large-scale synthesis of a class of organosulfur compounds that could open a new chapter in designing cathode materials to advance lithium-sulfur battery technologies. Porous trithiocyanuric acid crystals are synthesized for use as a soft template, where the ring-opening polymerization of elemental sulfur takes place along the thiol surfaces to create three-dimensionally interconnected sulfur-rich phases. Our lithium-sulfur cells display discharge capacity of 945 mAh g-1 after 100 cycles at 0.2 C with high-capacity retention of 92%, as well as lifetimes of 450 cycles. Particularly, the organized amine groups in the crystals increase Li+-ion transfer rate, affording a rate performance of 1210, mAh g-1 at 0.1 C and 730 mAh g-1 at 5 C.

Synthesis of three-dimensionally interconnected sulfur-rich polymers for cathode materials of high-rate lithium–sulfur batteries

Science.gov (United States)

Kim, Hoon; Lee, Joungphil; Ahn, Hyungmin; Kim, Onnuri; Park, Moon Jeong

2015-01-01

Elemental sulfur is one of the most attractive cathode active materials in lithium batteries because of its high theoretical specific capacity. Despite the positive aspect, lithium–sulfur batteries have suffered from severe capacity fading and limited rate capability. Here we report facile large-scale synthesis of a class of organosulfur compounds that could open a new chapter in designing cathode materials to advance lithium–sulfur battery technologies. Porous trithiocyanuric acid crystals are synthesized for use as a soft template, where the ring-opening polymerization of elemental sulfur takes place along the thiol surfaces to create three-dimensionally interconnected sulfur-rich phases. Our lithium–sulfur cells display discharge capacity of 945 mAh g−1 after 100 cycles at 0.2 C with high-capacity retention of 92%, as well as lifetimes of 450 cycles. Particularly, the organized amine groups in the crystals increase Li+-ion transfer rate, affording a rate performance of 1210, mAh g−1 at 0.1 C and 730 mAh g−1 at 5 C. PMID:26065407

SnS{sub 2} nanoplates embedded in 3D interconnected graphene network as anode material with superior lithium storage performance

Energy Technology Data Exchange (ETDEWEB)

Tang, Hongli [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China); Qi, Xiang, E-mail: xqi@xtu.edu.cn [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China); Han, Weijia; Ren, Long; Liu, Yundan [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China); Wang, Xingyan, E-mail: xywangxtu@163.com [Department of Environmental Science and Engineering, College of Chemical Engineering, Xiangtan University, Xiangtan 411105 (China); Zhong, Jianxin [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China)

2015-11-15

Graphical abstract: Schematic formation process of 3D interconnected SnS{sub 2}/graphene composite, and its superior lithium storage performance. - Highlights: • 3D graphene network embedded with SnS{sub 2} is synthesized by a facile two-step method. • This structure produces a synergistic effect between graphene and SnS{sub 2} nanoplates. • High capacity, excellent cycle performance and good rate capability are achieved. - Abstract: Three-dimensional (3D) interconnected graphene network embedded with uniformly distributed tin disulfide (SnS{sub 2}) nanoplates was prepared by a facile two-step method. The microstructures and morphologies of the SnS{sub 2}/graphene nanocomposite (SSG) are experimentally confirmed by X-ray diffraction (XRD), Raman spectroscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Using the as-prepared SSG as an anode material for lithium batteries, its electrochemical performances were investigated by cyclic voltammograms (CV), charge/discharge tests, galvanostatic cycling performance and AC impedance spectroscopy. The results demonstrate that the as-prepared SSG exhibits excellent cycling performance with a capacity of 1060 mAh g{sup −1} retained after 200 charge/discharge cycles at a current density of 100 mA g{sup −1}, also a superior rate capability of 670 mAh g{sup −1} even at such a high current density of 2000 mA g{sup −1}. This favorable performance can be attributed to the unique 3D interconnected architecture with great electro-conductivity and its intimate contact with SnS{sub 2}. Our results indicate a potential application of this novel 3D SnS{sub 2}/graphene nanocomposite in lithium-ion battery.

Leading research on super metal. 2. Aluminium materials; Super metal no sendo kenkyu. 2. Ogata sozai (aluminium kei)

Energy Technology Data Exchange (ETDEWEB)

NONE

1996-03-01

Aluminum materials were surveyed to improve aluminum materials drastically so as to play an important role as prospective materials in response to the changing social environment. Aluminum materials have become the following metal materials to iron materials due to their light weight, durability, and profitability. Based on their merits and demerits, it was made clear how the aluminum materials contribute to the future resource saving, energy saving, and global environmental protection. Review was made on the two research and development themes which contribute to the creation of super metals. Hence, the themes proposed are focused on the creation of new aluminum mill products with ultra fine grain structure using very low temperature processing and on the creation of super-formability aluminum alloy sheets by advanced texture control using processing which can enhance the shearing stress. Results of the research and development are expected to provide wide applicability for other metals, ceramics, and polymers. 433 refs., 315 figs., 56 tabs.

Proposed industrial recovered materials utilization targets for the metals and metal-products industry

Energy Technology Data Exchange (ETDEWEB)

None

1979-05-01

The introductory chapter provides a discussion of the factors that affect the recovery and reuse of secondary materials and the competition between the primary and secondary metals industries. It discusses these industries in terms of resource characteristics, industry technology, pollution control requirements, market structure, the economics of recycling, and the issues involved in econometrically estimating scrap supply response behavior. It further presents the methodology established by DOE for the metals, textiles, rubber, and pulp and paper industries. The areas in which government policies might have a significant impact on the utilization of primary and secondary metals and on any recycling targets between now and 1987 are noted. Chapter 3 presents general profiles for the major industrial segments comprising SIC 33. The profiles include such topics as industry structure, process technology, materials and recycling flow, and future trends. Chapter 4 specifically covers the evaluation of recycling targets for the ferrous, aluminum, copper, zinc, and lead industries. (MCW)

Fuel cell system with interconnect

Science.gov (United States)

Goettler, Richard; Liu, Zhien

2017-12-12

The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

SEM evaluation of metallization on semiconductors. [Scanning Electron Microscope

Science.gov (United States)

Fresh, D. L.; Adolphsen, J. W.

1974-01-01

A test method for the evaluation of metallization on semiconductors is presented and discussed. The method has been prepared in MIL-STD format for submittal as a proposed addition to MIL-STD-883. It is applicable to discrete devices and to integrated circuits and specifically addresses batch-process oriented defects. Quantitative accept/reject criteria are given for contact windows, other oxide steps, and general interconnecting metallization. Figures are provided that illustrate typical types of defects. Apparatus specifications, sampling plans, and specimen preparation and examination requirements are described. Procedures for glassivated devices and for multi-metal interconnection systems are included.

Computational dynamics of laser alloyed metallic materials for improved corrosion performance: computational dynamics of laser alloyed metallic materials

CSIR Research Space (South Africa)

Fatoba, OS

2016-04-01

Full Text Available Laser alloying is a material processing method which utilizes the high power density available from defocused laser beam to melt both metal coatings and a part of the underlying substrate. Since melting occur solitary at the surface, large...

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

DEFF Research Database (Denmark)

Wen, Liang Gong; Roussel, Philippe; Pedreira, Olalla Varela

2016-01-01

. These extremely scaled ruthenium lines show excellent electromigration behavior. Time-dependent dielectric breakdown measurements reveal negligible ruthenium ion drift into low-kappa dielectrics up to 200 degrees C, demonstrating that ruthenium can be used as a barrierless metallization in interconnects...

FBR metallic materials test manual (English version)

International Nuclear Information System (INIS)

Odaka, Susumu; Kato, Shoichi; Yoshida, Eiichi

2003-06-01

For the development of the fast breeder reactor, this manual describes the method of in-air and in-sodium material tests and the method of organization the data. This previous manual has revised in accordance with the revision of Japanese Industrial Standard (JIS) and the conversion to the international unit. The test methods of domestic committees such as the VAMAS (Versailles Project on Advanced Materials and Standards) workshop were also refereed. The material test technologies accumulated in this group until now were also incorporated. This English version was prepared in order to provide more engineers with the FBR metallic materials test manual. (author)

Nano/CMOS architectures using a field-programmable nanowire interconnect

International Nuclear Information System (INIS)

Snider, Gregory S; Williams, R Stanley

2007-01-01

A field-programmable nanowire interconnect (FPNI) enables a family of hybrid nano/CMOS circuit architectures that generalizes the CMOL (CMOS/molecular hybrid) approach proposed by Strukov and Likharev, allowing for simpler fabrication, more conservative process parameters, and greater flexibility in the choice of nanoscale devices. The FPNI improves on a field-programmable gate array (FPGA) architecture by lifting the configuration bit and associated components out of the semiconductor plane and replacing them in the interconnect with nonvolatile switches, which decreases both the area and power consumption of the circuit. This is an example of a more comprehensive strategy for improving the efficiency of existing semiconductor technology: placing a level of intelligence and configurability in the interconnect can have a profound effect on integrated circuit performance, and can be used to significantly extend Moore's law without having to shrink the transistors. Compilation of standard benchmark circuits onto FPNI chip models shows reduced area (8 x to 25 x), reduced power, slightly lower clock speeds, and high defect tolerance-an FPNI chip with 20% defective junctions and 20% broken nanowires has an effective yield of 75% with no significant slowdown along the critical path, compared to a defect-free chip. Simulations show that the density and power improvements continue as both CMOS and nano fabrication parameters scale down, although the maximum clock rate decreases due to the high resistance of very small (<10 nm) metallic nanowires

An overview on the Bauschinger effect in metallic materials

International Nuclear Information System (INIS)

Wang Yanfeng; Li Cong; Ling Xuyu; Shen Baoluo; Gao Shengji

2002-01-01

The Bauschinger effect in metallic materials including f.c.c. (face-centered cubic) and b.c.c. (body-centered cubic) materials such as pure alloys, casting alloys, copper alloys, aluminium alloys and metal matrix composite materials, and h.c.p. (hexagonal close packed) materials such as zirconium alloys and titanium alloys have been summarized comprehensively. The mechanism of Bauschinger effect is reviewed from the point of dislocation theory and internal stress (or back stress) that is responsible for the effect. Based upon these theories, the methods for calculating internal stress and models for simulating the effect are described briefly, which could explain the effect quantitatively. Finally, the measures to reduce or eliminate the effect have been pointed out, along with the issues to be researched in the future

Design, Synthesis and Characterization of Functional Metal-Organic Framework Materials

KAUST Repository

Alamer, Badriah

2015-06-01

Over the past few decades, vast majority of industrial and academic research throughout the world has witnessed the emergence of materials that can serve as ideal candidates for potential utility in desired applications, and these materials are known as Metal Organic Framework (MOFs). This exceptional new family of porous materials is fabricated by linkage of metal ions or clusters and organic linkers via strong bonds. MOFs have been awarded with remarkable interest and widely studied due to their inherent structural methodology (e.g. use of various metals, expanded library of organic building blocks with different geometry and functionality particularly frameworks designed from carboxylate organic linkers) and unquestionably unique structural and chemical features for many practical applications. (i.e. gas storage/separation, catalysis, drug delivery etc). Simply, metal organic frameworks epitomize the beauty of porous chemical structures. From a design perspective, the introduction of the Molecular Building Block (MBB) approach is actively being pursued pathway by researchers toward the construction of MOFs by employing inorganic building blocks and organic linkers and taking advantage of not only their multiple coordination modes and geometries but also the way in which they are reticulated to generate final framework. In this thesis, research studies will be directed toward (i) the investigation of the relationship between experimental parameters and synthesis of well-known fcu –MOF, (ii) rational design and synthesis of new rare earth (RE) based MOFs, (ii) isoreticular materials based on particular MBB ([M3O(RCO2)6]), M= p-and d-block metals, and (iv) zeolite- like metal organic framework assembled from single-metal ion based MBB ([MN2(CO2)4]) via 2-, 3-,and 4-connected organic linkers. Consequently, the porosity, chemical and thermal stability, and gas sorption properties will be evaluated and detailed.

Computational Materials Science | Materials Science | NREL

Science.gov (United States)

Computational Materials Science Computational Materials Science An image of interconnecting, sphere science capabilities span many research fields and interests. Electronic, Optical, and Transport Properties of Photovoltaic Materials Material properties and defect physics of Si, CdTe, III-V, CIGS, CZTS

Two component micro injection moulding for moulded interconnect devices

DEFF Research Database (Denmark)

Islam, Aminul

2008-01-01

Moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their capability of reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...... component injection moulding is one of the most industrially adaptive processes. However, the use of two component injection moulding for MID fabrication, with circuit patterns in the sub-millimeter range, is still a big challenge at the present state of technology. The scope of the current Ph.D. project...... and a reasonable adhesion between them. • Selective metallization of the two component plastic part (coating one polymer with metal and leaving the other one uncoated) To overcome these two main issues in MID fabrication for micro applications, the current Ph.D. project explores the technical difficulties...

32 x 16 CMOS smart pixel array for optical interconnects

Science.gov (United States)

Kim, Jongwoo; Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Choquette, Kent D.; Kiamilev, Fouad E.

2000-05-01

Free space optical interconnects can increase throughput capacities and eliminate much of the energy consumption required for `all electronic' systems. High speed optical interconnects can be achieved by integrating optoelectronic devices with conventional electronics. Smart pixel arrays have been developed which use optical interconnects. An individual smart pixel cell is composed of a vertical cavity surface emitting laser (VCSEL), a photodetector, an optical receiver, a laser driver, and digital logic circuitry. Oxide-confined VCSELs are being developed to operate at 850 nm with a threshold current of approximately 1 mA. Multiple quantum well photodetectors are being fabricated from AlGaAs for use with the 850 nm VCSELs. The VCSELs and photodetectors are being integrated with complementary metal oxide semiconductor (CMOS) circuitry using flip-chip bonding. CMOS circuitry is being integrated with a 32 X 16 smart pixel array. The 512 smart pixels are serially linked. Thus, an entire data stream may be clocked through the chip and output electrically by the last pixel. Electrical testing is being performed on the CMOS smart pixel array. Using an on-chip pseudo random number generator, a digital data sequence was cycled through the chip verifying operation of the digital circuitry. Although, the prototype chip was fabricated in 1.2 micrometers technology, simulations have demonstrated that the array can operate at 1 Gb/s per pixel using 0.5 micrometers technology.

Variation Tolerant On-Chip Interconnects

CERN Document Server

Nigussie, Ethiopia Enideg

2012-01-01

This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

Universal Interconnection Technology Workshop Proceedings

Energy Technology Data Exchange (ETDEWEB)

Sheaffer, P.; Lemar, P.; Honton, E. J.; Kime, E.; Friedman, N. R.; Kroposki, B.; Galdo, J.

2002-10-01

The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology, approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.

Biodegradable Materials and Metallic Implants-A Review.

Science.gov (United States)

Prakasam, Mythili; Locs, Janis; Salma-Ancane, Kristine; Loca, Dagnija; Largeteau, Alain; Berzina-Cimdina, Liga

2017-09-26

Recent progress made in biomaterials and their clinical applications is well known. In the last five decades, great advances have been made in the field of biomaterials, including ceramics, glasses, polymers, composites, glass-ceramics and metal alloys. A variety of bioimplants are currently used in either one of the aforesaid forms. Some of these materials are designed to degrade or to be resorbed inside the body rather than removing the implant after its function is served. Many properties such as mechanical properties, non-toxicity, surface modification, degradation rate, biocompatibility, and corrosion rate and scaffold design are taken into consideration. The current review focuses on state-of-the-art biodegradable bioceramics, polymers, metal alloys and a few implants that employ bioresorbable/biodegradable materials. The essential functions, properties and their critical factors are discussed in detail, in addition to their challenges to be overcome.

Low power interconnect design

CERN Document Server

Saini, Sandeep

2015-01-01

This book provides practical solutions for delay and power reduction for on-chip interconnects and buses.  It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system.  Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.   ·         Provides practical solutions for delay and power reduction for on-chip interconnects and buses; ·         Focuses on Deep Sub micron technology devices and interconnects; ·         Offers in depth analysis of delay, including details regarding crosstalk and parasitics;  ·         Describes use of the Schmitt Trigger as a versatile alternative approach to buffer insertion for del...

Epidemics spreading in interconnected complex networks

International Nuclear Information System (INIS)

Wang, Y.; Xiao, G.

2012-01-01

We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

Epidemics spreading in interconnected complex networks

Energy Technology Data Exchange (ETDEWEB)

Wang, Y. [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Institute of High Performance Computing, Agency for Science, Technology and Research (A-STAR), Singapore 138632 (Singapore); Xiao, G., E-mail: egxxiao@ntu.edu.sg [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore)

2012-09-03

We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

Fabrication of metallic channel-containing UO2 fuels

International Nuclear Information System (INIS)

Yang, Jae Ho; Song, Kun Woo; Kim, Keon Sik; Jung, Youn Ho

2004-01-01

The uranium dioxide is widely used as a fuel material in the nuclear industry, owing to many advantages. But it has a disadvantage of having the lowest thermal conductivity of all kinds of nuclear fuels; metal, carbide, nitride. It is well known that the thermal conductivity of UO 2 fuel is enhanced by making, so called, the CERMET (ceramic-metal) composite which consists of both continuous body of highly thermal-conducting metal and UO 2 islands. The CERMET fuel fabrication technique needs metal phase of at least 30%, mostly more than 50%, of the volume of the pellet in order to keep the metal phase interconnected. This high volume fraction of metal requires such a high enrichment of U that the parasitic effect of metal should be compensated. Therefore, it is attractive to develop an innovative composite fuel that can form continuous metal phase with a small amount of metal. In this investigation, a feasibility study was made on how to make such an innovative fuel. Candidate metals (W, Mo, Cr) were selected, and fabrication process was conceptually designed from thermodynamic calculations. We have experimentally found that a metal phase envelops perfectly UO 2 grains, forming continuous channel throughout the pellet, and improving the thermal conductivity of pellet

Metals on graphene and carbon nanotube surfaces: From mobile atoms to atomtronics to bulk metals to clusters and catalysts

KAUST Repository

Sarkar, Santanu C.

2014-01-14

In this Perspective, we present an overview of recent fundamental studies on the nature of the interaction between individual metal atoms and metal clusters and the conjugated surfaces of graphene and carbon nanotube with a particular focus on the electronic structure and chemical bonding at the metal-graphene interface. We discuss the relevance of organometallic complexes of graphitic materials to the development of a fundamental understanding of these interactions and their application in atomtronics as atomic interconnects, high mobility organometallic transistor devices, high-frequency electronic devices, organometallic catalysis (hydrogen fuel generation by photocatalytic water splitting, fuel cells, hydrogenation), spintronics, memory devices, and the next generation energy devices. We touch on chemical vapor deposition (CVD) graphene grown on metals, the reactivity of its surface, and its use as a template for asymmetric graphene functionalization chemistry (ultrathin Janus discs). We highlight some of the latest advances in understanding the nature of interactions between metals and graphene surfaces from the standpoint of metal overlayers deposited on graphene and SWNT thin films. Finally, we comment on the major challenges facing the field and the opportunities for technological applications. © 2013 American Chemical Society.

Polymer-Silica Nanocomposites: A Versatile Platform for Multifunctional Materials

Science.gov (United States)

Chiu, Chi-Kai

Solution sol-gel synthesis is a versatile approach to create polymer-silica nanocomposite materials. The solution-to-solid transformation results in a solid consisting of interconnected nanoporous structure in 3D space, making it the ideal material for filtration, encapsulation, optics, electronics, drug release, and biomaterials, etc. Although the pore between nano and meso size may be tunable using different reaction conditions, the intrinsic properties such as limited diffusion within pore structure, complicated interfacial interactions at the pore surfaces, shrinkage and stress-induced cracking and brittleness have limited the applications of this material. To overcome these problems, diffusion, pore size, shrinkage and stress-induced defects need further investigation. Thus, the presented thesis will address these important questions such as whether these limitations can be utilized as the novel method to create new materials and lead to new applications. First, the behaviors of polymers such as poly(ethylene glycol) inside the silica pores are examined by studying the nucleation and growth of AgCl at the surface of the porous matrix. The pore structure and the pressure induced by the shrinkage affect have been found to induce the growth of AgCl nanocrystals. When the same process is carried out at 160 °C, silver metallization is possible. Due to the shrinkage-induced stresses, the polymer tends to move into open crack spaces and exterior surfaces, forming interconnected silver structure. This interconnected silver structure is very unique because its density is not related to the size scale of nanopore structures. These findings suggest that it is possible to utilize defect surface of silica material as the template to create interconnected silver structure. When the scale is small, polymer may no longer be needed if the diffusion length of Ag is more than the size of silica particles. To validate our assumption, monoliths of sol-gel sample containing AgNO3

Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell

Science.gov (United States)

Kuo, Lewis J. H.; Vora, Shailesh D.

1995-01-01

A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La.sub.1-x M.sub.x Cr.sub.1-y N.sub.y O.sub.3, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075-0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO).sub.12. (Al.sub.2 O.sub.3).sub.7 flux particles including Ca and Al dopant, and LaCrO.sub.3 interconnection particles, preferably undoped LaCrO.sub.3, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and, (C) heat treating the interconnection layer at from about 1200.degree. to 1350.degree. C. to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. The electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power.

41 CFR 109-45.1003 - Recovery of silver from precious metals bearing materials.

Science.gov (United States)

2010-07-01

... 41 Public Contracts and Property Management 3 2010-07-01 2010-07-01 false Recovery of silver from precious metals bearing materials. 109-45.1003 Section 109-45.1003 Public Contracts and Property Management... of Precious Metals § 109-45.1003 Recovery of silver from precious metals bearing materials. The...

Comprehensive evaluation of global energy interconnection development index

Science.gov (United States)

Liu, Lin; Zhang, Yi

2018-04-01

Under the background of building global energy interconnection and realizing green and low-carbon development, this article constructed the global energy interconnection development index system which based on the current situation of global energy interconnection development. Through using the entropy method for the weight analysis of global energy interconnection development index, and then using gray correlation method to analyze the selected countries, this article got the global energy interconnection development index ranking and level classification.

Corrosion of metallic materials. Dry corrosion, aqueous corrosion and corrosion by liquid metal, methods of protection

International Nuclear Information System (INIS)

Helie, Max

2015-01-01

This book is based on a course on materials given in an engineering school. The author first gives an overview of metallurgy issues: metallic materials (pure metals, metallic alloys), defects of crystal lattices (point defects, linear defects or dislocations), equilibrium diagrams, steels and cast, thermal processing of steels, stainless steels, aluminium and its alloys, copper and its alloys. The second part addresses the properties and characterization of surfaces and interfaces: singularity of a metal surface, surface energy of a metal, energy of grain boundaries, adsorption at a material surface, metal-electrolyte interface, surface oxide-electrolyte interface, techniques of surface analysis. The third chapter addresses the electrochemical aspects of corrosion: description of the corrosion phenomenon, free enthalpy of a compound and free enthalpy of a reaction, case of dry corrosion (thermodynamic aspect, Ellingham diagram, oxidation mechanisms, experimental study, macroscopic modelling), case of aqueous corrosion (electrochemical thermodynamics and kinetics, experimental determination of corrosion rate). The fourth part addresses the different forms of aqueous corrosion: generalized corrosion (atmospheric corrosion, mechanisms and tests), localized corrosion (galvanic, pitting, cracking, intergranular, erosion and cavitation), particular cases of stress cracking (stress corrosion, fatigue-corrosion, embrittlement by hydrogen), and bi-corrosion (of non alloyed steels, of stainless steels, and of aluminium and copper alloys). The sixth chapter addresses the struggle and the protection against aqueous corrosion: methods of prevention, scope of use of main alloys, geometry-based protection of pieces, use of corrosion inhibitors, use of organic or metallic coatings, electrochemical protection. The last chapter proposes an overview of corrosion types in industrial practices: in the automotive industry, in the oil industry, in the aircraft industry, and in the

Integrated Optical Interconnect Architectures for Embedded Systems

CERN Document Server

Nicolescu, Gabriela

2013-01-01

This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.   Provides state-of-the-art research on the use of optical interconnects in Embedded Systems; Begins with coverage of the basics for high-performance computing and optical interconnect; Includes a variety of on-chip optical communication topologies; Features coverage of system integration and opti...

Biodegradable Materials and Metallic Implants—A Review

Science.gov (United States)

Prakasam, Mythili; Locs, Janis; Salma-Ancane, Kristine; Loca, Dagnija; Largeteau, Alain; Berzina-Cimdina, Liga

2017-01-01

Recent progress made in biomaterials and their clinical applications is well known. In the last five decades, great advances have been made in the field of biomaterials, including ceramics, glasses, polymers, composites, glass-ceramics and metal alloys. A variety of bioimplants are currently used in either one of the aforesaid forms. Some of these materials are designed to degrade or to be resorbed inside the body rather than removing the implant after its function is served. Many properties such as mechanical properties, non-toxicity, surface modification, degradation rate, biocompatibility, and corrosion rate and scaffold design are taken into consideration. The current review focuses on state-of-the-art biodegradable bioceramics, polymers, metal alloys and a few implants that employ bioresorbable/biodegradable materials. The essential functions, properties and their critical factors are discussed in detail, in addition to their challenges to be overcome. PMID:28954399

Exploring the mechanical strength of additively manufactured metal structures with embedded electrical materials

Energy Technology Data Exchange (ETDEWEB)

Li, J., E-mail: J.Li5@lboro.ac.uk; Monaghan, T.; Masurtschak, S.; Bournias-Varotsis, A.; Friel, R.J.; Harris, R.A.

2015-07-15

Ultrasonic Additive Manufacturing (UAM) enables the integration of a wide variety of components into solid metal matrices due to the process induced high degree of metal matrix plastic flow at low bulk temperatures. Exploitation of this phenomenon allows the fabrication of previously unobtainable novel engineered metal matrix components. The feasibility of directly embedding electrical materials within UAM metal matrices was investigated in this work. Three different dielectric materials were embedded into UAM fabricated aluminium metal-matrices with, research derived, optimal processing parameters. The effect of the dielectric material hardness on the final metal matrix mechanical strength after UAM processing was investigated systematically via mechanical peel testing and microscopy. It was found that when the Knoop hardness of the dielectric film was increased from 12.1 HK/0.01 kg to 27.3 HK/0.01 kg, the mechanical peel testing and linear weld density of the bond interface were enhanced by 15% and 16%, respectively, at UAM parameters of 1600 N weld force, 25 µm sonotrode amplitude, and 20 mm/s welding speed. This work uniquely identified that the mechanical strength of dielectric containing UAM metal matrices improved with increasing dielectric material hardness. It was therefore concluded that any UAM metal matrix mechanical strength degradation due to dielectric embedding could be restricted by employing a dielectric material with a suitable hardness (larger than 20 HK/0.01 kg). This result is of great interest and a vital step for realising electronic containing multifunctional smart metal composites for future industrial applications.

Characterization of nano structured metallic materials

International Nuclear Information System (INIS)

Marin A, M.; Gutierrez W, C.; Cruz C, R.; Angeles C, C.

1997-01-01

Nowadays the search of new materials with specific optical properties has carried out to realize a series of experiments through the polymer synthesis [(C 3 N 3 ) 2 (NH) 3 ] n doped with gold metallic nanoparticles. The thermal stability of a polymer is due to the presence of tyazine rings contained in the structure. The samples were characterized by High Resolution Transmission Electron Microscopy, X-ray diffraction by the Powder method, Ft-infrared and its thermal properties by Differential Scanning Calorimetry (DSC) and Thermogravimetry (TGA). One of the purposes of this work is to obtain nano structured materials over a polymeric matrix. (Author)

Rocksalt nitride metal/semiconductor superlattices: A new class of artificially structured materials

Science.gov (United States)

Saha, Bivas; Shakouri, Ali; Sands, Timothy D.

2018-06-01

Artificially structured materials in the form of superlattice heterostructures enable the search for exotic new physics and novel device functionalities, and serve as tools to push the fundamentals of scientific and engineering knowledge. Semiconductor heterostructures are the most celebrated and widely studied artificially structured materials, having led to the development of quantum well lasers, quantum cascade lasers, measurements of the fractional quantum Hall effect, and numerous other scientific concepts and practical device technologies. However, combining metals with semiconductors at the atomic scale to develop metal/semiconductor superlattices and heterostructures has remained a profoundly difficult scientific and engineering challenge. Though the potential applications of metal/semiconductor heterostructures could range from energy conversion to photonic computing to high-temperature electronics, materials challenges primarily had severely limited progress in this pursuit until very recently. In this article, we detail the progress that has taken place over the last decade to overcome the materials engineering challenges to grow high quality epitaxial, nominally single crystalline metal/semiconductor superlattices based on transition metal nitrides (TMN). The epitaxial rocksalt TiN/(Al,Sc)N metamaterials are the first pseudomorphic metal/semiconductor superlattices to the best of our knowledge, and their physical properties promise a new era in superlattice physics and device engineering.

Misalignment corrections in optical interconnects

Science.gov (United States)

Song, Deqiang

Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or

Design, Synthesis and Characterization of Functional Metal-Organic Framework Materials

KAUST Repository

Alamer, Badriah

2015-01-01

are known as Metal Organic Framework (MOFs). This exceptional new family of porous materials is fabricated by linkage of metal ions or clusters and organic linkers via strong bonds. MOFs have been awarded with remarkable interest and widely studied due

Area array interconnection handbook

CERN Document Server

Totta, Paul A

2012-01-01

Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later famil...

System for Prevention, Detection and Response to Radioactive Materials in Scrap Metal in Ukraine

Energy Technology Data Exchange (ETDEWEB)

Makarovska, O., E-mail: makarovska@hq.snrc.gov.ua [State Nuclear Regulatory Committee of Ukraine, Kiev (Ukraine)

2011-07-15

The State control system to prevent, detect and respond to cases of radioactive material in scrap metal is functioning in Ukraine. The system includes regulations for the safe and secure management of metal scrap and administrative and technical measures to prevent, detect and respond to cases of radioactive material in scrap metal. The key elements of prevention are the system of licensing and supervision in the sphere of radioactive material use and the State system for inventory, registration and control of radiation sources. Metal scrap management is licensed by the Ministry of Industrial Policy and one of the licence conditions is radiation control of the scrap metal. State supervision of the operations with metal scrap is provided by Ministry of Health and Ministry of Environmental Protection according to the regulation 'State sanitary-ecological standard for metal scrap management'. Specific standards exist for the export of metal scrap. Export consignments are followed by a certificate that proves the radiological safety of the metal. Ukrainian metallurgical plants provide an input radiation control of metal scrap and an output control of the produced metal. Thus, there exists a five barrier system of metal scrap control: border control; exclusion zone perimeter control; metal scrap dealers control; metallurgical plants (input control and output control of produced metal); and export consignments radiological certification. To regain control over orphan sources (including occasional radioactive material in the scrap metal) the 'procedure for interaction of executive authorities and involved legal entities in case of revealing of radiation sources in no legal use' was approved by a Resolution of the Cabinet of Ministers of Ukraine. The investigation of each case with feedback, information of involved bodies, safe and secure storage of restored radioactive material are provided according to this procedure. (author)

Development and operation of interconnections in a restructuring context

International Nuclear Information System (INIS)

2003-01-01

In many countries the electrical network is not fully interconnected and the best technical solution to achieve interconnection has to be found. At the same time the electricity industry is being restructured and interconnecting independent energy markets presents technical challenges. It is therefore timely to consider interconnection development and operation options: examine the benefits of interconnecting electrical networks and the development strategies, review the interconnection design options and the technologies available, identify the operational issues, the security problems of large interconnected systems, the protection issues, consider the impact of the restructuring of the electrical supply industry, assess the political, environmental and social implications of interconnections. reorganized in slovenia from 5-7 april 2004. (author)

Compatibility tests between molten salts and metal materials (2)

International Nuclear Information System (INIS)

Shiina, Yasuaki

2003-08-01

Latent heat storage technology using molten salts can reduce temperature fluctuations of heat transfer fluid by latent heat for middle and high temperature regions. This enables us to operate several heat utilization systems in cascade connected to High Temperature Gas Cooled Reactors (HTGRs) from high to low temperature range by setting the latent heat storage system after a heat utilization system to reduce thermal load after the heat utilization systems. This latent heat technology is expected to be used for effective use of heat such as equalization of electric load between night and daytime. In the application of the latent heat technology, compatibility between molten salts and metal materials is very important because molten salts are corrosive, and heat transfer pipes and vessels will contact with the molten salts. It will be necessary to prevail the latent heat storage technique that normal metal materials can be used for the pipes and vessels. However, a few studies have been reported of compatibility between molten salts and metals in middle and high temperature ranges. In this study, four molten salts, range of the melting temperature from 490degC to 800degC, are selected and five metals, high temperature and corrosion resistance steels of Alloy600, HastelloyB2, HastelloyC276, SUS310S and pure Nickel are selected for the test with the consideration of metal composition. Test was performed in an electric furnace by setting the molten salts and the metals in melting pots in an atmosphere of nitrogen. Results revealed excellent corrosion resistance of pure Nickel and comparatively low corrosion resistance of nickel base alloys such as Alloy600 and Hastelloys against Li 2 CO 3 . Corrosion resistance of SUS310S was about same as nickel based alloys. Therefore, if some amount of corrosion is permitted, SUS310S would be one of the candidate alloys for structure materials. These results will be used as reference data to select metals in latent heat technology

Liquid metal current collector applications and material compatibility

International Nuclear Information System (INIS)

Carr, S.L.; Stevens, H.O.

1978-01-01

The objective of this paper has been to summarize briefly the material considerations involved in the development of liquid metal current collectors for homopolar machinery applications. A significant amount of data in this regard has been obtained over the last several years by individual researchers for NaK exposure conditions. However, NaK material compatibility data over the entire time and temperature range of interest is highly desirable. At DTNSRDC, a 300 kW superconducting homopolar motor and generator are under test, both utilizing free surface tongue-and-groove current collectors with NaK as the working fluid. In addition to demonstrating the feasibility of other aspects of machine design, the intention is to use these machines as vehicles for testing of the several liquid metal current collector concepts which are considered worthwhile candidates for incorporation in future full-scale machines. It is likely that the optimal collector approach for a large low speed motor may be quite different from that for a smaller high speed generator, possibly involving the use of different liquid metals

Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

Science.gov (United States)

Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)

1996-01-01

A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

Porous silicon based micro-opto-electro-mechanical-systems (MOEMS) components for free space optical interconnects

Science.gov (United States)

Song, Da

2008-02-01

One of the major challenges confronting the current integrated circuits (IC) industry is the metal "interconnect bottleneck". To overcome this obstacle, free space optical interconnects (FSOIs) can be used to address the demand for high speed data transmission, multi-functionality and multi-dimensional integration for the next generation IC. One of the crucial elements in FSOIs system is to develop a high performance and flexible optical network to transform the incoming optical signal into a distributed set of optical signals whose direction, alignment and power can be independently controlled. Among all the optical materials for the realization of FSOI components, porous silicon (PSi) is one of the most promising candidates because of its unique optical properties, flexible fabrication methods and integration with conventional IC material sets. PSi-based Distributed Bragg Reflector (DBR) and Fabry-Perot (F-P) structures with unique optical properties are realized by electrochemical etching of silicon. By incorporating PSi optical structures with Micro-Opto-Electro-Mechanical-Systems (MOEMS), several components required for FSOI have been developed. The first type of component is the out-of-plane freestanding optical switch. Implementing a PSi DBR structure as an optically active region, the device can realize channel selection by changing the tilting angle of the micromirror supported by the thermal bimorph actuator. All the fabricated optical switches have reached kHz working frequency and life time of millions of cycles. The second type of component is the in-plane tunable optical filter. By introducing PSi F-P structure into the in-plane PSi film, a thermally tunable optical filter with a sensitivity of 7.9nm/V has been realized for add/drop optical signal selection. Also, for the first time, a new type of PSi based reconfigurable diffractive optical element (DOE) has been developed. By using patterned photoresist as a protective mask for electrochemical

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

Science.gov (United States)

de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

2018-05-01

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

Secondary cell with orthorhombic alkali metal/manganese oxide phase active cathode material

Science.gov (United States)

Doeff, Marca M.; Peng, Marcus Y.; Ma, Yanping; Visco, Steven J.; DeJonghe, Lutgard C.

1996-01-01

An alkali metal manganese oxide secondary cell is disclosed which can provide a high rate of discharge, good cycling capabilities, good stability of the cathode material, high specific energy (energy per unit of weight) and high energy density (energy per unit volume). The active material in the anode is an alkali metal and the active material in the cathode comprises an orthorhombic alkali metal manganese oxide which undergoes intercalation and deintercalation without a change in phase, resulting in a substantially linear change in voltage with change in the state of charge of the cell. The active material in the cathode is an orthorhombic structure having the formula M.sub.x Z.sub.y Mn.sub.(1-y) O.sub.2, where M is an alkali metal; Z is a metal capable of substituting for manganese in the orthorhombic structure such as iron, cobalt or titanium; x ranges from about 0.2 in the fully charged state to about 0.75 in the fully discharged state, and y ranges from 0 to 60 atomic %. Preferably, the cell is constructed with a solid electrolyte, but a liquid or gelatinous electrolyte may also be used in the cell.

Investigation of Liquid Metal Embrittlement of Materials for use in Fusion Reactors

Science.gov (United States)

Kennedy, Daniel; Jaworski, Michael

2014-10-01

Liquid metals can provide a continually replenished material for the first wall and extraction blankets of fusion reactors. However, research has shown that solid metal surfaces will experience embrittlement when exposed to liquid metals under stress. Therefore, it is important to understand the changes in structural strength of the solid metal materials and test different surface treatments that can limit embrittlement. Research was conducted to design and build an apparatus for exposing solid metal samples to liquid metal under high stress and temperature. The apparatus design, results of tensile testing, and surface imaging of fractured samples will be presented. This work was supported in part by the U.S. Department of Energy, Office of Science, Office of Workforce Development for Teachers and Scientists (WDTS) under the Science Undergraduate Laboratory Internships Program (SULI).

Transition-metal chlorides as conversion cathode materials for Li-ion batteries

International Nuclear Information System (INIS)

Li Ting; Chen, Zhong X.; Cao, Yu L.; Ai, Xin P.; Yang, Han X.

2012-01-01

Insoluble AgCl and soluble CuCl 2 were selected and investigated as model compounds of transition-metal chlorides for electrochemical conversion cathode materials. The experimental results demonstrated that the AgCl nanocrystals can convert reversibly to metallic Ag with nearly full utilization of its one-electron redox capacity (187 mAh g −1 ). Similarly, the CuCl 2 -filled mesoporous carbon can realize a reversible two-electron transfer reaction, giving a very high reversible capacity of 466 mAh g −1 after 20 cycles. These data imply that the metal chlorides can undergo complete electrochemical conversion utilizing their full oxidation states for electrical energy storage as previously reported metal fluorides, possibly being used as high capacity cathode materials for Li-ion batteries.

Metals and Alloys Material Stabilization Process Plan

Energy Technology Data Exchange (ETDEWEB)

RISENMAY, H.R.; BURK, R.A.

2000-05-18

This Plan outlines the process for brushing metal and alloys in accordance with the path forward discussed in the Integrated Project Management Plan for the Plutonium Finishing Plant Stabilization and Deactivation Project, HNF-3617, and requirements set forth in the Project Management Plan for Materials Stabilization, HNF-3605. This plan provides the basis for selection of the location to process, the processes involved, equipment to be used, and the characterization of the contents of the can. The scope of the process is from retrieval of metals and alloys from storage to transfer back to storage in a repackaged configuration.

Metals and Alloys Material Stabilization Process Plan

International Nuclear Information System (INIS)

RISENMAY, H.R.; BURK, R.A.

2000-01-01

This Plan outlines the process for brushing metal and alloys in accordance with the path forward discussed in the Integrated Project Management Plan for the Plutonium Finishing Plant Stabilization and Deactivation Project, HNF-3617, and requirements set forth in the Project Management Plan for Materials Stabilization, HNF-3605. This plan provides the basis for selection of the location to process, the processes involved, equipment to be used, and the characterization of the contents of the can. The scope of the process is from retrieval of metals and alloys from storage to transfer back to storage in a repackaged configuration

Enhanced Lithium- and Sodium-Ion Storage in an Interconnected Carbon Network Comprising Electronegative Fluorine.

Science.gov (United States)

Hong, Seok-Min; Etacheri, Vinodkumar; Hong, Chulgi Nathan; Choi, Seung Wan; Lee, Ki Bong; Pol, Vilas G

2017-06-07

Fluorocarbon (C x F y ) anode materials were developed for lithium- and sodium-ion batteries through a facile one-step carbonization of a single precursor, polyvinylidene fluoride (PVDF). Interconnected carbon network structures were produced with doped fluorine in high-temperature carbonization at 500-800 °C. The fluorocarbon anodes derived from the PVDF precursor showed higher reversible discharge capacities of 735 mAh g -1 and 269 mAh g -1 in lithium- and sodium-ion batteries, respectively, compared to the commercial graphitic carbon. After 100 charge/discharge cycles, the fluorocarbon showed retentions of 91.3% and 97.5% in lithium (at 1C) and sodium (at 200 mA g -1 ) intercalation systems, respectively. The effects of carbonization temperature on the electrochemical properties of alkali metal ion storage were thoroughly investigated and documented. The specific capacities in lithium- and sodium-ion batteries were dependent on the fluorine content, indicating that the highly electronegative fluorine facilitates the insertion/extraction of lithium and sodium ions in rechargeable batteries.

Fabrication of large area homogeneous metallic nanostructures for optical sensing using colloidal lithography

DEFF Research Database (Denmark)

Eriksen, René Lynge; Pors, Anders; Dreier, Jes

2010-01-01

We propose a simple and reproducible method for fabricating large area metal films with inter-connected nanostructures using a combination of colloidal lithography, metal deposition and a template stripping technique. The method is generic in the sense that it is possible to produce a variety...... to fabricate metal films with inter-connected nanostructures consisting of either partial spherical shells or the inverted structures: spherical cavities. The substrates are characterized by optical reflectance and transmittance spectroscopy. We demonstrate, in the case of partial spherical shells...

47 CFR 90.477 - Interconnected systems.

Science.gov (United States)

2010-10-01

... part and medical emergency systems in the 450-470 MHz band, interconnection will be permitted only... operating on frequencies in the bands below 800 MHz are not subject to the interconnection provisions of...

Machinability studies of infrared window materials and metals

International Nuclear Information System (INIS)

Arnold, J.B.; Morris, T.O.; Sladky, R.E.; Steger, P.J.

1976-01-01

Diamond machining of materials for optical applications is becoming an important fabrication process. Development work in material-removal technology to better understand the mechanics of the diamond-turning process, its limitations, and applications is described. The technique is presently limited to a select group of metals, most of which are of a face-center-cubic crystal structure. Machinability studies were done which were designed to better understand diamond compatibility and thus expand the range of applicable materials. Nonconventional methods such as ultrasonic tool stimulation were investigated. Work done to determine the machinability of infrared window materials indicates that this is a viable fabrication technique for many materials, although additional effort is needed to optimize the process for particular materials

Metals and metalloids treatment in contaminated neutral effluents using modified materials.

Science.gov (United States)

Calugaru, Iuliana Laura; Neculita, Carmen Mihaela; Genty, Thomas; Zagury, Gérald J

2018-04-15

Circumneutral surface water and groundwater can contain hazardous concentrations of metals and metalloids that can threaten organisms in surrounding ecosystems. Extensive research has been conducted over the past two decades to prevent, limit, and treat water pollution. Among the currently available treatment options is the use of natural and residual materials, which is generally regarded as effective and inexpensive. The modification of such materials enhances the removal capacity of metals and metalloids, as well as the physical and chemical stability of the materials and resulting sludge (after treatment). This paper reviews several modified materials that have produced and evaluated in the past twenty years to treat various contaminants in water under specific conditions. Important factors on performance improvement following the modifications are emphasized. Sorption capacity and kinetics, and element removal mechanisms are also discussed. Element recovery, material regeneration, water reuse, evaluation of treatment efficiency for real effluents are also considered, as well as the applicability of these materials in both active and passive treatment systems. Modified natural and residual materials are a promising option for the treatment of metals and metalloids in circumneutral contaminated waters. However, further research is necessary to evaluate their field-scale performance and to properly assess treatment costs. Copyright © 2018 Elsevier Ltd. All rights reserved.

A Micro-Test Structure for the Thermal Expansion Coefficient of Metal Materials

Directory of Open Access Journals (Sweden)

Qingying Ren

2017-02-01

Full Text Available An innovative micro-test structure for detecting the thermal expansion coefficient (TEC of metal materials is presented in this work. Throughout this method, a whole temperature sensing moveable structures are supported by four groups of cascaded chevrons beams and packed together. Thermal expansion of the metal material causes the deflection of the cascaded chevrons, which leads to the capacitance variation. By detecting the capacitance value at different temperatures, the TEC value of the metal materials can be calculated. A finite element model has been established to verify the relationship between the TEC of the material and the displacement of the structure on horizontal and vertical directions, thus a function of temperature for different values of TEC can be deduced. In order to verify the analytical model, a suspended-capacitive micro-test structure has been fabricated by MetalMUMPs process and tested in a climate chamber. Test results show that in the temperature range from 30 °C to 80 °C, the TEC of the test material is 13.4 × 10−6 °C−1 with a maximum relative error of 0.8% compared with the given curve of relationship between displacement and temperature.

Metal-decored graphites as anode materials for use in lithium-ion accumulators

International Nuclear Information System (INIS)

Licht, Bjoern Karl

2015-01-01

Graphitic materials are currently the most frequently used anode materials for lithium ion batteries (LIB). This type of battery is considered to be the ideal application for energy storage in electromobility or in mobile devices that require a high power density. Although intercalated graphite has only about 8 % of the gravimetric energy density of lithium metal, these materials are preferred due to safety reasons. However, by chemical modification of the surface, the electrochemical performance of graphite can be enhanced. In the thesis presented at hand, a novel synthesis route for the preparation of homogenous metal depositions on graphite is shown. The reaction proceeds via a gas phase reaction by the thermal decomposition of metal carboxylates. The decomposition process was analyzed by thermogravimetry and gas phase analysis. In comparison to the unmodified graphite, copper-coated graphite shows in increased capacity and cycle stability when used as anode materials in LIBs. Special emphasis should be placed on an improved adhesion of the active material on the copper current collector. The proven catalytic activity of the metal depositions not only enables a use in battery devices but could also be innovating for catalytic processes such as chlorine-alkali electrolysis.

Metallization for Yb14MnSb11-Based Thermoelectric Materials

Science.gov (United States)

Firdosy, Samad; Li, Billy Chun-Yip; Ravi, Vilupanur; Sakamoto, Jeffrey; Caillat, Thierry; Ewell, Richard C.; Brandon, Erik J.

2011-01-01

Thermoelectric materials provide a means for converting heat into electrical power using a fully solid-state device. Power-generating devices (which include individual couples as well as multicouple modules) require the use of ntype and p-type thermoelectric materials, typically comprising highly doped narrow band-gap semiconductors which are connected to a heat collector and electrodes. To achieve greater device efficiency and greater specific power will require using new thermoelectric materials, in more complex combinations. One such material is the p-type compound semiconductor Yb14MnSb11 (YMS), which has been demonstrated to have one of the highest ZT values at 1,000 C, the desired operational temperature of many space-based radioisotope thermoelectric generators (RTGs). Despite the favorable attributes of the bulk YMS material, it must ultimately be incorporated into a power-generating device using a suitable joining technology. Typically, processes such as diffusion bonding and/or brazing are used to join thermoelectric materials to the heat collector and electrodes, with the goal of providing a stable, ohmic contact with high thermal conductivity at the required operating temperature. Since YMS is an inorganic compound featuring chemical bonds with a mixture of covalent and ionic character, simple metallurgical diffusion bonding is difficult to implement. Furthermore, the Sb within YMS readily reacts with most metals to form antimonide compounds with a wide range of stoichiometries. Although choosing metals that react to form high-melting-point antimonides could be employed to form a stable reaction bond, it is difficult to limit the reactivity of Sb in YMS such that the electrode is not completely consumed at an operating temperature of 1,000 C. Previous attempts to form suitable metallization layers resulted in poor bonding, complete consumption of the metallization layer or fracture within the YMS thermoelement (or leg).

Charge transfer and redistribution at interfaces between metals and 2D materials

NARCIS (Netherlands)

Bokdam, Menno

2013-01-01

Large potential steps are observed at the interfaces between metals and novel 2D materials. They can lower the work function by more than 1 eV, even when the two parts are only weakly interacting. In this thesis the transfer and redistribution of electrons in metal|2D material heterostructures are

Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

Science.gov (United States)

Peter, Geoffrey John M.

With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect

Non-Destructive Metallic Materials Testing—Recent Research and Future Perspectives

Directory of Open Access Journals (Sweden)

João Manuel R. S. Tavares

2017-10-01

Full Text Available Non-destructive testing (NDT has become extremely important formicrostructural characterization, mainly by allowing the assessment of metallic material properties in an effective and reasonable manner, in addition to maintaining the integrity of the evaluated metallic samples and applicability in service in many cases [...

Interconnecting heterogeneous database management systems

Science.gov (United States)

Gligor, V. D.; Luckenbaugh, G. L.

1984-01-01

It is pointed out that there is still a great need for the development of improved communication between remote, heterogeneous database management systems (DBMS). Problems regarding the effective communication between distributed DBMSs are primarily related to significant differences between local data managers, local data models and representations, and local transaction managers. A system of interconnected DBMSs which exhibit such differences is called a network of distributed, heterogeneous DBMSs. In order to achieve effective interconnection of remote, heterogeneous DBMSs, the users must have uniform, integrated access to the different DBMs. The present investigation is mainly concerned with an analysis of the existing approaches to interconnecting heterogeneous DBMSs, taking into account four experimental DBMS projects.

Functional materials derived from block copolymer self-assembly

DEFF Research Database (Denmark)

Li, Tao

deposition methods, namely nanocasting and atomic layer deposition (ALD) will be applied to fabricate compact, inter-connected, and continuous metal oxide films. In this way, the structure integrity will be preserved after template removal during the annealing procedure. Another objective of this project......-casting, the block copolymer self-organizes into monolayer packed sphere pattern, without any surface treatment of the substrate and annealing process. Arrays of nano-pillars and nanowells of various materials are fabricated in dry etch processes over wafer scale without defects. We also show an in situ Al2O3 hard...

Feasibility investigation of non-metallic and light weight metallic materials for light weight compressor pistons

NARCIS (Netherlands)

Wentzel, C.M.; Bergsma, O.K.; Eijk, A.

2014-01-01

Steel and aluminium have been the traditional materials of choice for pistons. In order to reduce moving mass-related vibrational problems, a feasibility assessment is made of the application of other materials in a project for the research group of the EFRC. In particular, polymer and metal matrix

An autonomously electrically self-healing liquid metal-elastomer composite for robust soft-matter robotics and electronics.

Science.gov (United States)

Markvicka, Eric J; Bartlett, Michael D; Huang, Xiaonan; Majidi, Carmel

2018-07-01

Large-area stretchable electronics are critical for progress in wearable computing, soft robotics and inflatable structures. Recent efforts have focused on engineering electronics from soft materials-elastomers, polyelectrolyte gels and liquid metal. While these materials enable elastic compliance and deformability, they are vulnerable to tearing, puncture and other mechanical damage modes that cause electrical failure. Here, we introduce a material architecture for soft and highly deformable circuit interconnects that are electromechanically stable under typical loading conditions, while exhibiting uncompromising resilience to mechanical damage. The material is composed of liquid metal droplets suspended in a soft elastomer; when damaged, the droplets rupture to form new connections with neighbours and re-route electrical signals without interruption. Since self-healing occurs spontaneously, these materials do not require manual repair or external heat. We demonstrate this unprecedented electronic robustness in a self-repairing digital counter and self-healing soft robotic quadruped that continue to function after significant damage.

High performance high-κ/metal gate complementary metal oxide semiconductor circuit element on flexible silicon

KAUST Repository

Sevilla, Galo T.

2016-02-29

Thinned silicon based complementary metal oxide semiconductor(CMOS)electronics can be physically flexible. To overcome challenges of limited thinning and damaging of devices originated from back grinding process, we show sequential reactive ion etching of silicon with the assistance from soft polymeric materials to efficiently achieve thinned (40 μm) and flexible (1.5 cm bending radius) silicon based functional CMOSinverters with high-κ/metal gate transistors. Notable advances through this study shows large area of silicon thinning with pre-fabricated high performance elements with ultra-large-scale-integration density (using 90 nm node technology) and then dicing of such large and thinned (seemingly fragile) pieces into smaller pieces using excimer laser. The impact of various mechanical bending and bending cycles show undeterred high performance of flexible siliconCMOSinverters. Future work will include transfer of diced silicon chips to destination site, interconnects, and packaging to obtain fully flexible electronic systems in CMOS compatible way.

Nonlinear optical properties of interconnected gold nanoparticles on silicon

Science.gov (United States)

Lesuffleur, Antoine; Gogol, Philippe; Beauvillain, Pierre; Guizal, B.; Van Labeke, D.; Georges, P.

2008-12-01

We report second harmonic generation (SHG) measurements in reflectivity from chains of gold nanoparticles interconnected with metallic bridges. We measured more than 30 times a SHG enhancement when a surface plasmon resonance was excited in the chains of nanoparticles, which was influenced by coupling due to the electrical connectivity of the bridges. This enhancement was confirmed by rigorous coupled wave method calculations and came from high localization of the electric field at the bridge. The introduction of 10% random defects into the chains of nanoparticles dropped the SHG by a factor of 2 and was shown to be very sensitive to the fundamental wavelength.

An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

International Nuclear Information System (INIS)

Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

2011-01-01

On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses. (interdisciplinary physics and related areas of science and technology)

Electromigration in integrated circuit interconnects studied by X-ray microscopy

Energy Technology Data Exchange (ETDEWEB)

Schneider, G. E-mail: gschnei1@gwdg.de; Denbeaux, G.; Anderson, E.; Bates, W.; Salmassi, F.; Nachimuthu, P.; Pearson, A.; Richardson, D.; Hambach, D.; Hoffmann, N.; Hasse, W.; Hoffmann, K

2003-01-01

To study mass transport phenomena in advanced microelectronic devices with X-rays requires penetration of dielectric and Si layers up to 30 {mu}m thick. X-ray imaging at 1.8 keV photon energy provides a high amplitude contrast between Cu or Al interconnects and dielectric layers and can penetrate through the required thickness. To perform X-ray microscopy at 1.8 keV, a new Ru/Si multilayer was designed for the transmission X-ray microscope XM-1 installed at the Advanced Light Source in Berkeley. The mass flow in a passivated Cu interconnect was studied at current densities up to 10{sup 7} A/cm{sup 2}. In addition, we demonstrated the high material contrast from different elements in integrated circuits with a resolution of about 40 nm.

Electromigration in integrated circuit interconnects studied by X-ray microscopy

CERN Document Server

Schneider, G; Anderson, E; Bates, W; Salmassi, F; Nachimuthu, P; Pearson, A; Richardson, D; Hambach, D; Hoffmann, N; Hasse, W; Hoffmann, K

2003-01-01

To study mass transport phenomena in advanced microelectronic devices with X-rays requires penetration of dielectric and Si layers up to 30 mu m thick. X-ray imaging at 1.8 keV photon energy provides a high amplitude contrast between Cu or Al interconnects and dielectric layers and can penetrate through the required thickness. To perform X-ray microscopy at 1.8 keV, a new Ru/Si multilayer was designed for the transmission X-ray microscope XM-1 installed at the Advanced Light Source in Berkeley. The mass flow in a passivated Cu interconnect was studied at current densities up to 10 sup 7 A/cm sup 2. In addition, we demonstrated the high material contrast from different elements in integrated circuits with a resolution of about 40 nm.

Statistical treatment of hazards result from radioactive material in metal scrap

International Nuclear Information System (INIS)

Salem, E.F.; Rashad, S.M.

2013-01-01

Radioactive sources have a wide range of uses in medicine and industry. Radioactive materials entering the public domain in an uncontrolled manner may creating a serious risk of radiation exposure for workers and the public as well as excessive costs for plant decontamination and waste of product to be borne by the metal industry. This paper describes the major accidents that had happened in the last decades due to radioactive material in metal scrap, provides assessment of associated hazards and lessons learned. This will help Regulatory Authority to introduce measures capable to avoid the recurrence of similar events. The study highlights the situation for metal scrap incidents in Egypt.

Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects

DEFF Research Database (Denmark)

Vernoux, Christian; Chen, Yiting; Markey, Laurent

2018-01-01

We present the design, fabrication and characterization of long-range surface plasmon polariton waveguide arrays with materials, mainly silicones, carefully selected with the aim to be used as mechanically flexible single-mode optical interconnections, the socalled "plasmonic arc" working at 1.55μm...

Experimental investigation of solidification in metal foam enhanced phase change material

Science.gov (United States)

Beyne, W.; Bağci, O.; Huisseune, H.; Canière, H.; Danneels, J.; Daenens, D.; De Paepe, M.

2017-10-01

A major challenge for the use of phase change materials (PCMs) in thermal energy storage (TES) is overcoming the low thermal conductivity of PCM’s. The low conductivity gives rise to limited power during charging and discharging TES. Impregnating metal foam with PCM, however, has been found to enhance the heat transfer. On the other hand, the effect of foam parameters such as porosity, pore size and material type has remained unclear. In this paper, the effect of these foam parameters on the solidification time is investigated. Different samples of PCM-impregnated metal foam were experimentally tested and compared to one without metal foam. The samples varied with respect to choice of material, porosity and pore size. They were placed in a rectangular cavity and cooled from one side using a coolant flowing through a cold plate. The other sides of the rectangular cavity were Polymethyl Methacrylate (PM) walls exposed to ambient. The temperature on the exterior walls of the cavity was monitored as well as the coolant flow rate and its temperature. The metal foam inserts reduced the solidification times by at least 25 %. However, the difference between the best performing and worst performing metal foam is about 28 %. This shows a large potential for future research.

Towards Flexible Transparent Electrodes Based on Carbon and Metallic Materials

Directory of Open Access Journals (Sweden)

Minghui Luo

2017-01-01

Full Text Available Flexible transparent electrodes (FTEs with high stability and scalability are in high demand for the extremely widespread applications in flexible optoelectronic devices. Traditionally, thin films of indium thin oxide (ITO served the role of FTEs, but film brittleness and scarcity of materials limit its further application. This review provides a summary of recent advances in emerging transparent electrodes and related flexible devices (e.g., touch panels, organic light-emitting diodes, sensors, supercapacitors, and solar cells. Mainly focusing on the FTEs based on carbon nanomaterials (e.g., carbon nanotubes and graphene and metal materials (e.g., metal grid and metal nanowires, we discuss the fabrication techniques, the performance improvement, and the representative applications of these highly transparent and flexible electrodes. Finally, the challenges and prospects of flexible transparent electrodes will be summarized.

Metal Oxide Nanostructured Materials for Optical and Energy Applications

OpenAIRE

Moore, Michael Christopher

2013-01-01

With a rapidly growing population, dwindling resources, and increasing environmental pressures, the need for sustainable technological solutions becomes more urgent. Metal oxides make up much of the earth's crust and are typically inexpensive materials, but poor electrical and optical properties prevent them from being useful for most semiconductor applications. Recent breakthroughs in chemistry and materials science allow for the growth of high-quality materials with nanometer-scale features...

Processing and properties of silver-metal oxide electrical contact materials

Directory of Open Access Journals (Sweden)

Nadežda M. Talijan

2012-12-01

Full Text Available The presented study gives a brief overview of the experimental results of investigations of different production technologies of silver-metal oxide electrical contact materials in relation: processing method - properties. The two most common routes of production, i.e. internal oxidation/ingot metallurgy and powder metallurgy are demonstrated on the example of Ag-CdO and Ag-ZnO materials. For illustration of alternative processing routes that provide higher dispersion of metal-oxide particles in silver matrix more environmentally friendly Ag-SnO2 contact materials are used. Processing of electrical contact materials by mechanical mixing of starting powders in high energy ball mill is presented. The obtained experimental results of application of different methods of introduction of SnO2 nanoparticles in the silver matrix such as conventional powder metallurgy mixing and template method are given and discussed in terms of their influence on microstructure and physical properties (density, hardness and electrical conductivity of the prepared Ag-SnO2 electrical contact materials.

Manufacturing of planar ceramic interconnects

Energy Technology Data Exchange (ETDEWEB)

Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R. [Pacific Northwest National Lab., Richland, WA (United States)

1996-12-31

The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

Optimal interconnection and renewable targets for north-west Europe

International Nuclear Information System (INIS)

Lynch, Muireann Á.; Tol, Richard S.J.; O'Malley, Mark J.

2012-01-01

We present a mixed-integer, linear programming model for determining optimal interconnection for a given level of renewable generation using a cost minimisation approach. Optimal interconnection and capacity investment decisions are determined under various targets for renewable penetration. The model is applied to a test system for eight regions in Northern Europe. It is found that considerations on the supply side dominate demand side considerations when determining optimal interconnection investment: interconnection is found to decrease generation capacity investment and total costs only when there is a target for renewable generation. Higher wind integration costs see a concentration of wind in high-wind regions with interconnection to other regions. - Highlights: ► We use mixed-integer linear programming to determine optimal interconnection locations for given renewable targets. ► The model is applied to a test system for eight regions in Northern Europe. ► Interconnection reduces costs only when there is a renewable target. ► Wind integration costs affect the interconnection portfolio.

Investigation of Lithium Metal Hydride Materials for Mitigation of Deep Space Radiation

Science.gov (United States)

Rojdev, Kristina; Atwell, William

2016-01-01

Radiation exposure to crew, electronics, and non-metallic materials is one of many concerns with long-term, deep space travel. Mitigating this exposure is approached via a multi-faceted methodology focusing on multi-functional materials, vehicle configuration, and operational or mission constraints. In this set of research, we are focusing on new multi-functional materials that may have advantages over traditional shielding materials, such as polyethylene. Metal hydride materials are of particular interest for deep space radiation shielding due to their ability to store hydrogen, a low-Z material known to be an excellent radiation mitigator and a potential fuel source. We have previously investigated 41 different metal hydrides for their radiation mitigation potential. Of these metal hydrides, we found a set of lithium hydrides to be of particular interest due to their excellent shielding of galactic cosmic radiation. Given these results, we will continue our investigation of lithium hydrides by expanding our data set to include dose equivalent and to further understand why these materials outperformed polyethylene in a heavy ion environment. For this study, we used HZETRN 2010, a one-dimensional transport code developed by NASA Langley Research Center, to simulate radiation transport through the lithium hydrides. We focused on the 1977 solar minimum Galactic Cosmic Radiation environment and thicknesses of 1, 5, 10, 20, 30, 50, and 100 g/cm2 to stay consistent with our previous studies. The details of this work and the subsequent results will be discussed in this paper.

Enhanced thermoelectric properties of metal film on bismuth telluride-based materials

International Nuclear Information System (INIS)

Chao, Wen Hsuan; Chen, Yi Ray; Tseng, Shih Chun; Yang, Ping Hsing; Wu, Ren Jye; Hwang, Jenn Yeu

2014-01-01

Diffusion barriers have a significant influence on the reliability and life time of thermoelectric modules. Although nickel is commonly used as a diffusion barrier in commercial thermoelectric modules, several studies have verified that Ni migrates to bismuth telluride-based material during high temperature cycles and causes a loss in efficacy. In this paper, the influence of metal layers coated to p-type and n-type Bi 2 Te 3 on the interface characterization and thermoelectric property is studied using a RF magnetron sputtering. The findings from this study demonstrate the structural and thermoelectric properties of p-type and n-type Bi 2 Te 3 coated with different metal layers. The crystalline phase and compositional change of the interface between the Bi 2 Te 3 materials and the metal layers were determined using an X-ray diffractometer and scanning electron microscopy with energy dispersive spectroscopy. Formation of NiTe was observed in the sample of Ni/p-type Bi 2 Te 3 based films post-annealed in an N 2 atmosphere at 200 °C. In contrast, no Co x Te y was formed in the sample of Co/p-type Bi 2 Te 3 based films post-annealed at 200 °C. For as-deposited Ni/p-type and n-type Bi 2 Te 3 based legs, the Ni slightly diffused into the Bi 2 Te 3 based legs. A similar phenomenon also occurred in the as-deposited Co/p-type and n-type Bi 2 Te 3 based legs. The Seebeck coefficients of the Co contacts on the Bi 2 Te 3 based material displayed better behavior than those of the Ni contacts on the Bi 2 Te 3 based legs. Thus Co could be a suitable diffusion barrier for bulk Bi 2 Te 3 based material. The observed effects on the thermoelectric and structural properties of metal/Bi 2 Te 3 based material are crucial for understanding the interface between the diffusion barrier and thermoelectric materials. - Highlights: • Interface characterization of metal coated to p-type and n-type Bi 2 Te 3 is studied. • We examined the phase transformation of metal/Bi 2 Te 3 based films

Three-dimensional interconnected porous graphitic carbon derived from rice straw for high performance supercapacitors

Science.gov (United States)

Jin, Hong; Hu, Jingpeng; Wu, Shichao; Wang, Xiaolan; Zhang, Hui; Xu, Hui; Lian, Kun

2018-04-01

Three-dimensional interconnected porous graphitic carbon materials are synthesized via a combination of graphitization and activation process with rice straw as the carbon source. The physicochemical properties of the three-dimensional interconnected porous graphitic carbon materials are characterized by Nitrogen adsorption/desorption, Fourier-transform infrared spectroscopy, X-ray diffraction, Raman spectroscopy, Scanning electron microscopy and Transmission electron microscopy. The results demonstrate that the as-prepared carbon is a high surface area carbon material (a specific surface area of 3333 m2 g-1 with abundant mesoporous and microporous structures). And it exhibits superb performance in symmetric double layer capacitors with a high specific capacitance of 400 F g-1 at a current density of 0.1 A g-1, good rate performance with 312 F g-1 under a current density of 5 A g-1 and favorable cycle stability with 6.4% loss after 10000 cycles at a current density of 5 A g-1 in the aqueous electrolyte of 6M KOH. Thus, rice straw is a promising carbon source for fabricating inexpensive, sustainable and high performance supercapacitors' electrode materials.

Metal nanoparticles in DBS card materials modification

Science.gov (United States)

Metelkin, A.; Frolov, G.; Kuznetsov, D.; Kolesnikov, E.; Chuprunov, K.; Kondakov, S.; Osipov, A.; Samsonova, J.

2015-11-01

In the recent years the method of collecting and storing Dried Blood Spots (DBS) on special cellulose membrane (paper) has gained wide popularity. But possible damage of biosamples caused by microorganisms in case of their incomplete drying is a disadvantage of the method. It can be overcome by treating sample-collection membranes with colloidal solutions of metal nanoparticles, having antibacterial effect. The team studied antibacterial properties of nonwoven material samples with various coatings (alcohol sols of copper, aluminium, iron, titanium, silver and vanadium nanoparticles). Colloidal solutions of nanoparticles were obtained by means of electroerosion method with further low-temperature plasma condensation. Antibacterial activity of fiberglass and cellulose membrane samples with nanoparticle coatings was studied using B. cereus and plaque bacteria cultures. It was revealed that nanostructured coatings can suppress bacterial activity; in addition they can diffuse from the membrane surface into medium which leads to widening the areas of inhibiting testing cultures’ growth. Thus, membrane materials treatment with alcohol-sols of metal nanoparticles can be seen as promising for conferring antibacterial properties to DBS carriers.

Metal nanoparticles in DBS card materials modification

International Nuclear Information System (INIS)

Metelkin, A; Frolov, G; Kuznetsov, D; Kolesnikov, E; Chuprunov, K; Kondakov, S; Osipov, A; Samsonova, J

2015-01-01

In the recent years the method of collecting and storing Dried Blood Spots (DBS) on special cellulose membrane (paper) has gained wide popularity. But possible damage of biosamples caused by microorganisms in case of their incomplete drying is a disadvantage of the method. It can be overcome by treating sample-collection membranes with colloidal solutions of metal nanoparticles, having antibacterial effect. The team studied antibacterial properties of nonwoven material samples with various coatings (alcohol sols of copper, aluminium, iron, titanium, silver and vanadium nanoparticles). Colloidal solutions of nanoparticles were obtained by means of electroerosion method with further low-temperature plasma condensation. Antibacterial activity of fiberglass and cellulose membrane samples with nanoparticle coatings was studied using B. cereus and plaque bacteria cultures. It was revealed that nanostructured coatings can suppress bacterial activity; in addition they can diffuse from the membrane surface into medium which leads to widening the areas of inhibiting testing cultures’ growth. Thus, membrane materials treatment with alcohol-sols of metal nanoparticles can be seen as promising for conferring antibacterial properties to DBS carriers. (paper)

The Interconnections of the LHC Cryomagnets

CERN Document Server

Jacquemod, A; Skoczen, Blazej; Tock, J P

2001-01-01

The main components of the LHC, the next world-class facility in high-energy physics, are the twin-aperture high-field superconducting cryomagnets to be installed in the existing 26.7-km long tunnel. After installation and alignment, the cryomagnets have to be interconnected. The interconnections must ensure the continuity of several functions: vacuum enclosures, beam pipe image currents (RF contacts), cryogenic circuits, electrical power supply, and thermal insulation. In the machine, about 1700 interconnections between cryomagnets are necessary. The interconnections constitute a unique system that is nearly entirely assembled in the tunnel. For each of them, various operations must be done: TIG welding of cryogenic channels (~ 50 000 welds), induction soldering of main superconducting cables (~ 10 000 joints), ultrasonic welding of auxiliary superconducting cables (~ 20 000 welds), mechanical assembly of various elements, and installation of the multi-layer insulation (~ 200 000 m2). Defective junctions cou...

Epidemics in interconnected small-world networks.

Science.gov (United States)

Liu, Meng; Li, Daqing; Qin, Pengju; Liu, Chaoran; Wang, Huijuan; Wang, Feilong

2015-01-01

Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS) model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

Epidemics in interconnected small-world networks.

Directory of Open Access Journals (Sweden)

Meng Liu

Full Text Available Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

Mesomorphic glass nanocomposites made of metal alkanoates and nanoparticles as emerging nonlinear-optical materials

Science.gov (United States)

Garbovskiy, Y.; Klimusheva, G.; Mirnaya, T.

2016-09-01

Mesomorphic metal alkanoates is very promising yet overlooked class of nonlinear-optical materials. Metal alkanoates can exhibit a broad variety of condensed states of matter including solid crystals, plastic crystals, lyotropic and thermotropic ionic liquid crystals, liquids, mesomorphic glasses, and Langmuir-Blodgett films. Glass-forming properties of metal alkanoates combined with their use as nano-reactors and anisotropic host open up simple and efficient way to design various photonic nanomaterials. Despite very interesting physics, the experimental data on optical and nonlinearoptical properties of such materials are scarce. The goal of the present paper is to fill the gap by discussing recent advances in the field of photonic materials made of metal alkanoates, organic dyes, and nanoparticles. Optical and nonlinear-optical properties of the following materials are reviewed: (i) mesomorphic glass doped with organic dyes; (ii) smectic glass composed of cobalt alkanoates; (iii) semiconductor nanoparticles embedded in a glassy host; (iv) metal nanoparticles - glass (the cobalt octanoate) nanocomposites.

A sewing-enabled stitch-and-transfer method for robust, ultra-stretchable, conductive interconnects

International Nuclear Information System (INIS)

Rahimi, Rahim; Ochoa, Manuel; Yu, Wuyang; Ziaie, Babak

2014-01-01

Fabricating highly stretchable and robust electrical interconnects at low-cost remains an unmet challenge in stretchable electronics. Previously reported stretchable interconnects require complicated fabrication processes with resulting devices exhibiting limited stretchability, poor reliability, and large gauge factors. Here, we demonstrate a novel sew-and-transfer method for rapid fabrication of low-cost, highly stretchable interconnects. Using a commercial sewing machine and double-thread stitch with one of the threads being water soluble polyvinyl alcohol (PVA), thin zigzag-pattern metallic wires are sewn into a polymeric film and are subsequently transferred onto a stretchable elastomeric substrate by dissolving PVA in warm water. The resulting structures exhibit extreme stretchability (exceeding 500% strain for a zigzag angle of 18 °) and robustness (capable of withstanding repeated stretch-and-release cycles of 15000 at 110% strain, 50000 at 55% strain, and  > 120000 at 30% strain without any noticeable change in resistance even at maximum strain levels). Using this technique, we demonstrate a stretchable inductive strain sensor for monitoring balloon expansion in a Foley urinary catheter capable of detecting the balloon diameter change from 9 mm to 38 mm with an average sensitivity of 4 nH/mm. (paper)

Self-Rerouting and Curative Interconnect Technology (SERCUIT)

Science.gov (United States)

2017-12-01

SPECIAL REPORT RDMR-CS-17-01 SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) Shiv Joshi Concepts to Systems, Inc...Final 4. TITLE AND SUBTITLE Self-Rerouting and Curative Interconnect Technology (SERCUIT) 5. FUNDING NUMBERS 6. AUTHOR(S) Shiv Joshi...concepts2systems.com (p) 434-207-5189 x (f) Click to view full size Title Contract Number SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) W911W6-17-C-0029

Measurement of fracture toughness of metallic materials produced by additive manufacturing

Science.gov (United States)

Quénard, O.; Dorival, O.; Guy, Ph.; Votié, A.; Brethome, K.

2018-04-01

This study focuses on the microstructure and mechanical properties of metallic materials produced by additive layer manufacturing (ALM), especially the laser beam melting process. The influence of the specimen orientation during the ALM process and that of two post-build thermal treatments were investigated. The identified metal powder is Ti-6Al-4V (titanium base). Metallographic analysis shows their effects on the microstructure of the metals. Mechanical experiments involving tensile tests as well as toughness tests were performed according to ASTM (American Society for Testing and Materials) norms. The results show that the main influence is that of the thermal treatments; however the manufacturing stacking direction may lead to some anisotropy in the mechanical properties.

Materials damaging and rupture - Volumes 1-2. General remarks, metallic materials. Non-metallic materials and biomaterials, assemblies and industrial problems

International Nuclear Information System (INIS)

Clavel, M.; Bompard, P.

2009-01-01

The rupture and damaging of materials and structures is almost always and unwanted events which may have catastrophic consequences. Even if the mechanical failure causes can often be analyzed using a thorough knowledge of materials behaviour, the forecasting and prevention of failures remain difficult. While the macroscopic mechanical behaviour is often the result of average effects at the structure or microstructure scale, the damage is very often the result of the combination of load peaks, of localization effects and of microstructure defects. This book, presented in two volumes, takes stock of the state-of-the-art of the knowledge gained in the understanding and modelling of rupture and damaging phenomena of materials and structure, mostly of metallic type. It gives an outline of the available knowledge for other classes of materials (ceramics, biomaterials, geo-materials..) and for different types of applications (aeronautics, nuclear industry). Finally, it examines the delicate problem, but very important in practice, of the behaviour of assemblies. Content: Vol.1 - physical mechanisms of materials damaging and rupture; rupture mechanics; cyclic plasticity and fatigue crack growth; fatigue crack propagation; environment-induced cracking; contacts and surfaces. Vol.2 - glasses and ceramics; natural environments: soils and rocks; mechanical behaviour of biological solid materials: the human bone; contribution of simulation to the understanding of rupture mechanisms; assemblies damaging and rupture; industrial cases (behaviour of PWR pressure vessel steels, and thermal and mechanical stresses in turbojet engines). (J.S.)

Network interconnections: an architectural reference model

NARCIS (Netherlands)

Butscher, B.; Lenzini, L.; Morling, R.; Vissers, C.A.; Popescu-Zeletin, R.; van Sinderen, Marten J.; Heger, D.; Krueger, G.; Spaniol, O.; Zorn, W.

1985-01-01

One of the major problems in understanding the different approaches in interconnecting networks of different technologies is the lack of reference to a general model. The paper develops the rationales for a reference model of network interconnection and focuses on the architectural implications for

A Difference in Using Atomic Layer Deposition or Physical Vapour Deposition TiN as Electrode Material in Metal-Insulator-Metal and Metal-Insulator-Silicon Capacitors

NARCIS (Netherlands)

Groenland, A.W.; Wolters, Robertus A.M.; Kovalgin, Alexeij Y.; Schmitz, Jurriaan

2011-01-01

In this work, metal-insulator-metal (MIM) and metal-insulator-silicon (MIS) capacitors are studied using titanium nitride (TiN) as the electrode material. The effect of structural defects on the electrical properties on MIS and MIM capacitors is studied for various electrode configurations. In the

Metal/graphite-composite materials for fusion device

International Nuclear Information System (INIS)

Kneringer, G.; Kny, E.; Fischer, W.; Reheis, N.; Staffler, R.; Samm, U.; Winter, J.

1995-01-01

The utilization of graphite as a structural material depends to an important extent on the availability of a joining technique suitable for the production of reliable large scale metal/graphite-composites. This study has been conducted to evaluate vacuum brazes and procedures for graphite and metals which can be used in fusion applications up to about 1500 degree C. The braze materials included: AgCuTi, CuTi, NiTi, Ti, ZrTi, Zr. Brazing temperatures ranged from 850 degree C to 1900 degree C. The influence of graphite quality on wettability and pore-penetration of the braze has been investigated. Screening tests of metal/graphite-assemblies with joint areas exceeding some square-centimeters have shown that they can only successfully be produced when graphite is brazed to a metal, such as tungsten or molybdenum with a coefficient of thermal expansion closely matching that of graphite. Therefore all experimental work on evaluation of joints has been concentrated on molybdenum/graphite brazings. The tensile strength of molybdenum/graphite-composites compares favorably with the tensile strength of bulk graphite from room temperature close to the melting temperature of the braze. In electron beam testing the threshold damage line for molybdenum/graphite-composites has been evaluated. Results show that even composites with the low melting AgCuTi-braze are expected to withstand 10 MW/m 2 power density for at least 10 3 cycles. Limiter testing in TEXTOR shows that molybdenum/graphite-segments with 3 mm graphite brazed on molybdenum-substrate withstand severe repeated TEXTOR plasma discharge conditions without serious damage. Results prove that actively cooled components on the basis of a molybdenum/graphite-composite can sustain a higher heat flux than bulk graphite alone. (author)

Processing and characterization of device solder interconnection and module attachment for power electronics modules

Science.gov (United States)

Haque, Shatil

This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

Interconnecting Carbon Fibers with the In-situ Electrochemically Exfoliated Graphene as Advanced Binder-free Electrode Materials for Flexible Supercapacitor

OpenAIRE

Yuqin Zou; Shuangyin Wang

2015-01-01

Flexible energy storage devices are highly demanded for various applications. Carbon cloth (CC) woven by carbon fibers (CFs) is typically used as electrode or current collector for flexible devices. The low surface area of CC and the presence of big gaps (ca. micro-size) between individual CFs lead to poor performance. Herein, we interconnect individual CFs through the in-situ exfoliated graphene with high surface area by the electrochemical intercalation method. The interconnected CFs are us...

Liquid metal batteries - materials selection and fluid dynamics

Science.gov (United States)

Weier, T.; Bund, A.; El-Mofid, W.; Horstmann, G. M.; Lalau, C.-C.; Landgraf, S.; Nimtz, M.; Starace, M.; Stefani, F.; Weber, N.

2017-07-01

Liquid metal batteries are possible candidates for massive and economically feasible large-scale stationary storage and as such could be key components of future energy systems based mainly or exclusively on intermittent renewable electricity sources. The completely liquid interior of liquid metal batteries and the high current densities give rise to a multitude of fluid flow phenomena that will primarily influence the operation of future large cells, but might be important for today’s smaller cells as well. The paper at hand starts with a discussion of the relative merits of using molten salts or ionic liquids as electrolytes for liquid metal cells and touches the choice of electrode materials. This excursus into electrochemistry is followed by an overview of investigations on magnetohydrodynamic instabilities in liquid metal batteries, namely the Tayler instability and electromagnetically excited gravity waves. A section on electro-vortex flows complements the discussion of flow phenomena. Focus of the flow related investigations lies on the integrity of the electrolyte layer and related critical parameters.

Future semiconductor material requirements and innovations as projected in the ITRS 2005 roadmap

International Nuclear Information System (INIS)

Arden, Wolfgang

2006-01-01

The international technology roadmap for semiconductors (ITRS) is a joint global effort of the semiconductor industry, the manufacturing equipment and material industry and the research community and consortia to define the future requirements and development of the semiconductor technology for the next 15 years. The ITRS started in 1992 as a US-national roadmap and became an international effort in 1998 with all major five industrial global regions (US, Japan, Taiwan, Korea and Europe) participating in its definition. The outlook in semiconductor manufacturing expects the continuous application of silicon technology for the next 15 years where complementary metal oxide semiconductor (CMOS) based devices will carry the development of the industry at least for one more decade. New device architectures and concepts based on silicon wafer material are being developed to support the development of the IC industry for another one or two decade. The major section of the ITRS contains technical information about frontend processing and interconnects, device structures and memory concepts, lithography and metrology as well as factory integration and environmental issues. This paper will review the material requirements and the expected material innovations for the industry as outlined in the ITRS Version 2005. Materials to be discussed are, for example, high permittivity gate dielectrics, insulating layers with low dielectric constants for interconnects, and capacitor dielectrics for dynamic memories. In addition, the paper will address, for example, new transistor gate materials, new solutions for interconnect systems beyond copper as well as new starting materials for wafer sizes beyond 300 mm. This publication was presented as an invited paper in the Symposium V of the 2006 spring meeting of the European Materials Research Society (E-MRS) in Nice, May 29th

Epidemics in interconnected small-world networks

NARCIS (Netherlands)

Liu, M.; Li, D.; Qin, P.; Liu, C.; Wang, H.; Wang, F.

2015-01-01

Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks

Interconnect rise time in superconducting integrating circuits

International Nuclear Information System (INIS)

Preis, D.; Shlager, K.

1988-01-01

The influence of resistive losses on the voltage rise time of an integrated-circuit interconnection is reported. A distribution-circuit model is used to present the interconnect. Numerous parametric curves are presented based on numerical evaluation of the exact analytical expression for the model's transient response. For the superconducting case in which the series resistance of the interconnect approaches zero, the step-response rise time is longer but signal strength increases significantly

Polyimide and Metals MEMS Multi-User Processes

KAUST Repository

Arevalo, Arpys

2016-11-01

The development of a polyimide and metals multi-user surface micro-machining process for Micro-electro-mechanical Systems (MEMS) is presented. The process was designed to be as general as possible, and designed to be capable to fabricate different designs on a single silicon wafer. The process was not optimized with the purpose of fabricating any one specific device but can be tweaked to satisfy individual needs depending on the application. The fabrication process uses Polyimide as the structural material and three separated metallization layers that can be interconnected depending on the desired application. The technology allows the development of out-of-plane compliant mechanisms, which can be combined with six variations of different physical principles for actuation and sensing on a single processed silicon wafer. These variations are: electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception.

76 FR 39870 - PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of Date...

Science.gov (United States)

2011-07-07

.... EL11-20-001] PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of... Sell Offers for Planned Generation Capacity Resources submitted into PJM's Reliability Pricing Model... presents an opportunity to exercise buyer market power; (2) whether the Fixed Resource Requirement (FRR...

Implantable liquid metal-based flexible neural microelectrode array and its application in recovering animal locomotion functions

Science.gov (United States)

Guo, Rui; Liu, Jing

2017-10-01

With significant advantages in rapidly restoring the nerve function, electrical stimulation of nervous tissue is a crucial treatment of peripheral nerve injuries leading to common movement disorder. However, the currently available stimulating electrodes generally based on rigid conductive materials would cause a potential mechanical mismatch with soft neural tissues which thus reduces long-term effects of electrical stimulation. Here, we proposed and fabricated a flexible neural microelectrode array system based on the liquid metal GaIn alloy (75.5% Ga and 24.5% In by weight) and via printing approach. Such an alloy with a unique low melting point (10.35 °C) owns excellent electrical conductivity and high compliance, which are beneficial to serve as implantable flexible neural electrodes. The flexible neural microelectrode array embeds four liquid metal electrodes and stretchable interconnects in a PDMS membrane (500 µm in thickness) that possess a lower elastic modulus (1.055 MPa), which is similar to neural tissues with elastic moduli in the 0.1-1.5 MPa range. The electrical experiments indicate that the liquid metal interconnects could sustain over 7000 mechanical stretch cycles with resistance approximately staying at 4 Ω. Over the conceptual experiments on animal sciatic nerve electrical stimulation, the dead bullfrog implanted with flexible neural microelectrode array could even rhythmically contract and move its lower limbs under the electrical stimulations from the implant. This demonstrates a highly efficient way for quickly recovering biological nerve functions. Further, the good biocompatibility of the liquid metal material was justified via a series of biological experiments. This liquid metal modality for neural stimulation is expected to play important roles as biologic electrodes to overcome the fundamental mismatch in mechanics between biological tissues and electronic devices in the coming time.

Implantable liquid metal-based flexible neural microelectrode array and its application in recovering animal locomotion functions

International Nuclear Information System (INIS)

Guo, Rui; Liu, Jing

2017-01-01

With significant advantages in rapidly restoring the nerve function, electrical stimulation of nervous tissue is a crucial treatment of peripheral nerve injuries leading to common movement disorder. However, the currently available stimulating electrodes generally based on rigid conductive materials would cause a potential mechanical mismatch with soft neural tissues which thus reduces long-term effects of electrical stimulation. Here, we proposed and fabricated a flexible neural microelectrode array system based on the liquid metal GaIn alloy (75.5% Ga and 24.5% In by weight) and via printing approach. Such an alloy with a unique low melting point (10.35 °C) owns excellent electrical conductivity and high compliance, which are beneficial to serve as implantable flexible neural electrodes. The flexible neural microelectrode array embeds four liquid metal electrodes and stretchable interconnects in a PDMS membrane (500 µ m in thickness) that possess a lower elastic modulus (1.055 MPa), which is similar to neural tissues with elastic moduli in the 0.1–1.5 MPa range. The electrical experiments indicate that the liquid metal interconnects could sustain over 7000 mechanical stretch cycles with resistance approximately staying at 4 Ω. Over the conceptual experiments on animal sciatic nerve electrical stimulation, the dead bullfrog implanted with flexible neural microelectrode array could even rhythmically contract and move its lower limbs under the electrical stimulations from the implant. This demonstrates a highly efficient way for quickly recovering biological nerve functions. Further, the good biocompatibility of the liquid metal material was justified via a series of biological experiments. This liquid metal modality for neural stimulation is expected to play important roles as biologic electrodes to overcome the fundamental mismatch in mechanics between biological tissues and electronic devices in the coming time. (paper)

Development of ultralight, super-elastic, hierarchical metallic meta-structures with i3DP technology

Science.gov (United States)

Zhang, Dongxing; Xiao, Junfeng; Moorlag, Carolyn; Guo, Qiuquan; Yang, Jun

2017-11-01

Lightweight and mechanically robust materials show promising applications in thermal insulation, energy absorption, and battery catalyst supports. This study demonstrates an effective method for creation of ultralight metallic structures based on initiator-integrated 3D printing technology (i3DP), which provides a possible platform to design the materials with the best geometric parameters and desired mechanical performance. In this study, ultralight Ni foams with 3D interconnected hollow tubes were fabricated, consisting of hierarchical features spanning three scale orders ranging from submicron to centimeter. The resultant materials can achieve an ultralight density of as low as 5.1 mg cm-3 and nearly recover after significant compression up to 50%. Due to a high compression ratio, the hierarchical structure exhibits superior properties in terms of energy absorption and mechanical efficiency. The relationship of structural parameters and mechanical response was established. The ability of achieving ultralight density printing approach provides metallic structures with substantial benefits from the hierarchical design and fabrication flexibility to ultralight applications.

Heavy metal oxide glasses as gamma rays shielding material

International Nuclear Information System (INIS)

Kaur, Preet; Singh, Devinder; Singh, Tejbir

2016-01-01

The gamma rays shielding parameters for heavy metal oxide glasses and concrete samples are comparable. However, the transparent nature of glasses provides additional feature to visualize inside the shielding material. Hence, different researchers had contributed in computing/measuring different shielding parameters for different configurations of heavy metal oxide glass systems. In the present work, a detailed study on different heavy metal (_5_6Ba, _6_4Gd, _8_2Pb, _8_3Bi) oxide glasses has been presented on the basis of different gamma rays shielding parameters as reported by different researchers in the recent years. It has been observed that among the selected heavy metal oxide glass systems, Bismuth based glasses provide better gamma rays shielding. Hence, Bismuth based glasses can be better substitute to concrete walls at nuclear reactor sites and nuclear labs.

Heavy metal oxide glasses as gamma rays shielding material

Energy Technology Data Exchange (ETDEWEB)

Kaur, Preet; Singh, Devinder; Singh, Tejbir, E-mail: dr.tejbir@gmail.com

2016-10-15

The gamma rays shielding parameters for heavy metal oxide glasses and concrete samples are comparable. However, the transparent nature of glasses provides additional feature to visualize inside the shielding material. Hence, different researchers had contributed in computing/measuring different shielding parameters for different configurations of heavy metal oxide glass systems. In the present work, a detailed study on different heavy metal ({sub 56}Ba, {sub 64}Gd, {sub 82}Pb, {sub 83}Bi) oxide glasses has been presented on the basis of different gamma rays shielding parameters as reported by different researchers in the recent years. It has been observed that among the selected heavy metal oxide glass systems, Bismuth based glasses provide better gamma rays shielding. Hence, Bismuth based glasses can be better substitute to concrete walls at nuclear reactor sites and nuclear labs.

Rational Design of Two-Dimensional Metallic and Semiconducting Spintronic Materials Based on Ordered Double-Transition-Metal MXenes

KAUST Repository

Dong, Liang

2016-12-30

Two-dimensional (2D) materials that display robust ferromagnetism have been pursued intensively for nanoscale spintronic applications, but suitable candidates have not been identified. Here we present theoretical predictions on the design of ordered double-transition-metal MXene structures to achieve such a goal. On the basis of the analysis of electron filling in transition-metal cations and first-principles simulations, we demonstrate robust ferromagnetism in Ti2MnC2Tx monolayers regardless of the surface terminations (T = O, OH, and F), as well as in Hf2MnC2O2 and Hf2VC2O2 monolayers. The high magnetic moments (3–4 μB/unit cell) and high Curie temperatures (495–1133 K) of these MXenes are superior to those of existing 2D ferromagnetic materials. Furthermore, semimetal-to-semiconductor and ferromagnetic-to-antiferromagnetic phase transitions are predicted to occur in these materials in the presence of small or moderate tensile in-plane strains (0–3%), which can be externally applied mechanically or internally induced by the choice of transition metals.

Optical Interconnects for Future Data Center Networks

CERN Document Server

Bergman, Keren; Tomkos, Ioannis

2013-01-01

Optical Interconnects for Future Data Center Networks covers optical networks and how they can provide high bandwidth, energy efficient interconnects with increased communication bandwidth. This volume, with contributions from leading researchers in the field, presents an integrated view of the expected future requirements of data centers and serves as a reference for some of the most advanced and promising solutions proposed by researchers from leading universities, research labs, and companies. The work also includes several novel architectures, each demonstrating different technologies such as optical circuits, optical switching, MIMO optical OFDM, and others. Additionally, Optical Interconnects for Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

On Subsurface Crack Growth in Fibre Metal Laminate Materials

National Research Council Canada - National Science Library

Randall, Christian

2003-01-01

Fatigue crack growth in fibre metal laminates (FMLs) is significantly more complex than in monolithic materials due to the interaction of various physical mechanisms that govern the growth of cracks in laminates...

Temperature-dependence of Threshold Current Density-Length Product in Metallization Lines: A Revisit

International Nuclear Information System (INIS)

Duryat, Rahmat Saptono; Kim, Choong-Un

2016-01-01

One of the important phenomena in Electromigration (EM) is Blech Effect. The existence of Threshold Current Density-Length Product or EM Threshold has such fundamental and technological consequences in the design, manufacture, and testing of electronics. Temperature-dependence of Blech Product had been thermodynamically established and the real behavior of such interconnect materials have been extensively studied. The present paper reviewed the temperature-dependence of EM threshold in metallization lines of different materials and structure as found in relevant published articles. It is expected that the reader can see a big picture from the compiled data, which might be overlooked when it was examined in pieces. (paper)

The effect of environmental conditions on the stability of heavy metal-filter material complex as assessed by the leaching of adsorbed metal ions

Energy Technology Data Exchange (ETDEWEB)

Khokhotva, Oleksandr, E-mail: khokhotva@bigmir.net [School of Sustainable Development of Society and Technology, Maelardalen University, Box 883, SE-721 23, Vaesteras (Sweden); Waara, Sylvia, E-mail: sylvia.waara@hh.se [School of Sustainable Development of Society and Technology, Maelardalen University, Box 883, SE-721 23, Vaesteras (Sweden)

2011-06-15

In this study the influence of environmental conditions, most likely prevailing in filter beds used for intermittently discharged pollutant streams such as landfill leachate and storm water, on the stability of the heavy metal-filter complex was investigated for 2 filter materials; non-treated and urea treated pine bark, using leaching experiments. The metal-filter complex stability was higher for urea treated than for non-treated pine bark and dependent on the metal adsorbed. The type of environmental condition applied was of less importance for the extent of leaching. - Highlights: > Metal-pine bark complex stability under changing environmental conditions is studied. > Metal leaching from non-treated bark is much higher than from urea-treated bark. > No significant influence of changing environmental conditions on the leaching extent. > Metal leaching from wet bark samples exposed to freezing is somewhat higher.> Zn leaching is the highest and Cu leaching is the lowest for both bark samples. - The study assess the metal-filter material complex stability when metal removal using filter material is used in locations with fluctuating environmental conditions.

The effect of environmental conditions on the stability of heavy metal-filter material complex as assessed by the leaching of adsorbed metal ions

International Nuclear Information System (INIS)

Khokhotva, Oleksandr; Waara, Sylvia

2011-01-01

In this study the influence of environmental conditions, most likely prevailing in filter beds used for intermittently discharged pollutant streams such as landfill leachate and storm water, on the stability of the heavy metal-filter complex was investigated for 2 filter materials; non-treated and urea treated pine bark, using leaching experiments. The metal-filter complex stability was higher for urea treated than for non-treated pine bark and dependent on the metal adsorbed. The type of environmental condition applied was of less importance for the extent of leaching. - Highlights: → Metal-pine bark complex stability under changing environmental conditions is studied. → Metal leaching from non-treated bark is much higher than from urea-treated bark. → No significant influence of changing environmental conditions on the leaching extent. → Metal leaching from wet bark samples exposed to freezing is somewhat higher.→ Zn leaching is the highest and Cu leaching is the lowest for both bark samples. - The study assess the metal-filter material complex stability when metal removal using filter material is used in locations with fluctuating environmental conditions.

Fabrication of interconnected microporous biomaterials with high hydroxyapatite nanoparticle loading

International Nuclear Information System (INIS)

Zhang Wei; Yao Donggang; Zhang Qingwei; Lelkes, Peter I; Zhou, Jack G

2010-01-01

Hydroxyapatite (HA) is known to promote osteogenicity and enhance the mechanical properties of biopolymers. However, incorporating a large amount of HA into a porous biopolymer still remains a challenge. In the present work, a new method was developed to produce interconnected microporous poly(glycolic-co-lactic acid) (PLGA) with high HA nanoparticle loading. First, a ternary blend comprising PLGA/PS (polystyrene)/HA (40/40/20 wt%) was prepared by melt blending under conditions for formation of a co-continuous phase structure. Next, a dynamic annealing stage under small-strain oscillation was applied to the blend to facilitate nanoparticle redistribution. Finally, the PS phase was sacrificially extracted, leaving a porous matrix. The results from different characterizations suggested that the applied small-strain oscillation substantially accelerated the migration of HA nanoparticles during annealing from the PS phase to the PLGA phase; nearly all HA particles were uniformly presented in the PLGA phase after a short period of annealing. After dissolution of the PS phase, a PLGA material with interconnected microporous structure was successfully produced, with a high HA loading above 30 wt%. The mechanisms beneath the experimental observations, particularly on the enhanced particle migration process, were discussed, and strategies for producing highly particle loaded biopolymers with interconnected microporous structures were proposed.

Liquid Metals as Plasma-facing Materials for Fusion Energy Systems: From Atoms to Tokamaks

Energy Technology Data Exchange (ETDEWEB)

Stone, Howard A. [Princeton Univ., NJ (United States); Koel, Bruce E. [Princeton Univ., NJ (United States); Bernasek, Steven L. [Princeton Univ., NJ (United States); Carter, Emily A. [Princeton Univ., NJ (United States); Debenedetti, Pablo G. [Princeton Univ., NJ (United States); Panagiotopoulos, Athanassios Z. [Princeton Univ., NJ (United States)

2017-06-23

The objective of our studies was to advance our fundamental understanding of liquid metals as plasma-facing materials for fusion energy systems, with a broad scope: from atoms to tokamaks. The flow of liquid metals offers solutions to significant problems of the plasma-facing materials for fusion energy systems. Candidate metals include lithium, tin, gallium, and their eutectic combinations. However, such liquid metal solutions can only be designed efficiently if a range of scientific and engineering issues are resolved that require advances in fundamental fluid dynamics, materials science and surface science. In our research we investigated a range of significant and timely problems relevant to current and proposed engineering designs for fusion reactors, including high-heat flux configurations that are being considered by leading fusion energy groups world-wide. Using experimental and theoretical tools spanning atomistic to continuum descriptions of liquid metals, and bridging surface chemistry, wetting/dewetting and flow, our research has advanced the science and engineering of fusion energy materials and systems. Specifically, we developed a combined experimental and theoretical program to investigate flows of liquid metals in fusion-relevant geometries, including equilibrium and stability of thin-film flows, e.g. wetting and dewetting, effects of electromagnetic and thermocapillary fields on liquid metal thin-film flows, and how chemical interactions and the properties of the surface are influenced by impurities and in turn affect the surface wetting characteristics, the surface tension, and its gradients. Because high-heat flux configurations produce evaporation and sputtering, which forces rearrangement of the liquid, and any dewetting exposes the substrate to damage from the plasma, our studies addressed such evaporatively driven liquid flows and measured and simulated properties of the different bulk phases and material interfaces. The range of our studies

Corrosion behaviour of metallic and non-metallic materials in various media in the Anhydrite and Gypsum Mine Felsenau/AG

International Nuclear Information System (INIS)

Laske, D.; Wiedemann, K.H.

1983-10-01

The final underground disposal of radioactive wastes necessitates container materials with a good long-term resistance against corrosion from both external agents and the solidification matrix inside. For low- and medium-level active waste, repositories in anhydrite sites, among others, are under consideration. Sheet and plate samples from 14 metallic and 8 non-metallic materials have been tested for 5 years in a tunnel in the Anhydrite and Gypsum Mine Felsenau/AG for their corrosion resistance in the tunnel atmosphere, anhydrite powder, gypsum powder, gypsum, and cement. From the metallic materials tested, only chromium-nickel steel is corrosion resistant to all the media present. Zinc plated and tin plated iron sheet as well as aluminium and aluminium alloys are corrosion resistant only in the atmosphere of the tunnel, and lead plated iron sheet is resistant also in cement. Aluminium is dissolved in cement. Uncovered iron sheet undergoes severe corrosion. The non-metallic coatings tested (lacquer, stove lacquer, or synthetic resins) partially flake off already after one year's testing and are therefore not appropriate for iron sheet corrosion protection. No influence of the different media has been observed after 5 years on the 8 plastic materials tested (6 without, and 2 with glass fiber reinforcement). (author)

Review of Interconnection Practices and Costs in the Western States

Energy Technology Data Exchange (ETDEWEB)

Bird, Lori A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Flores-Espino, Francisco [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Volpi, Christina M [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Ardani, Kristen B [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Manning, David [Western Interstate Energy Board (WIEB); McAllister, Richard [Western Interstate Energy Board (WIEB)

2018-04-27

The objective of this report is to evaluate the nature of barriers to interconnecting distributed PV, assess costs of interconnection, and compare interconnection practices across various states in the Western Interconnection. The report addresses practices for interconnecting both residential and commercial-scale PV systems to the distribution system. This study is part of a larger, joint project between the Western Interstate Energy Board (WIEB) and the National Renewable Energy Laboratory (NREL), funded by the U.S. Department of Energy, to examine barriers to distributed PV in the 11 states wholly within the Western Interconnection.

Fungal nanoscale metal carbonates and production of electrochemical materials.

Science.gov (United States)

Li, Qianwei; Gadd, Geoffrey Michael

2017-09-01

Fungal biomineralization of carbonates results in metal removal from solution or immobilization within a solid matrix. Such a system provides a promising method for removal of toxic or valuable metals from solution, such as Co, Ni, and La, with some carbonates being of nanoscale dimensions. A fungal Mn carbonate biomineralization process can be applied for the synthesis of novel electrochemical materials. © 2017 The Authors. Microbial Biotechnology published by John Wiley & Sons Ltd and Society for Applied Microbiology.

Laser-induced selective metallization of polypropylene doped with multiwall carbon nanotubes

Science.gov (United States)

Ratautas, Karolis; Gedvilas, Mindaugas; Stankevičiene, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Pira, Nello Li; Sinopoli, Stefano; Račiukaitis, Gediminas

2017-08-01

Moulded interconnect devices (MID) offer the material, weight and cost saving by integration electronic circuits directly into polymeric components used in automotive and other consumer products. Lasers are used to write circuits directly by modifying the surface of polymers followed by an electroless metal plating. A new composite material - the polypropylene doped with multiwall carbon nanotubes was developed for the laser-induced selective metallization. Mechanism of surface activation by laser irradiation was investigated in details utilising pico- and nanoseconds lasers. Deposition of copper was performed in the autocatalytic electroless plating bath. The laser-activated polymer surfaces have been studied using the Raman spectroscopy and scanning electron microscope (SEM). Microscopic images revealed that surface becomes active only after its melting by a laser. Alterations in the Raman spectra of the D and G bands indicated the clustering of carbon additives in the composite material. Optimal laser parameters for the surface activation were found by measuring a sheet resistance of the finally metal-plated samples. A spatially selective copper plating was achieved with the smallest conductor line width of 22 μm at the laser scanning speed of 3 m/s and the pulse repetition rate of 100 kHz. Finally, the technique was validated by making functional electronic circuits by this MID approach.

A technology development for the purification and utilization of rare metals

Energy Technology Data Exchange (ETDEWEB)

Rhee, Kang In; Yu, Hyo Shin; Youn, In Ju; Choi, Good Sun; Lee, Churl Kyoung; Seo, Chang Youl; Yang, Dong Hyo [Korea Inst. of Geology Mining and Materials, Taejon (Korea, Republic of)

1995-12-01

The demand for rare metal and their alloys has dramatically increased due to the rapid growth of electronics industries. The clean metals such as molybdenum, nickel and cobalt are used in manufacturing of gate electrodes, interconnects, and barrier metal because of their superior properties. Despite the strong demand, the production of these metals in our nation has not made. And all products related with these have to be imported from other developed countries with high cost. Furthermore, some deposits and by-product exist, and the development of production of metal becomes to be important for the viewpoint of the supply national electronics industries with these materials as well as the increase in the added value of raw materials. Electron beam melting technique is the advantages for the ingot-making of molybdenum. In this melting process, the energy of highly accelerated electrons can be transferred to thermal energy and easily controlled to make various sizes and types of molybdenum ingot. In addition, membrane technology plays an important role to separation and purification of rare metals. Therefore, the objective for this research is to make the molybdenum ingot using this electron beam melting process and develop the technology of the manufacture of the sputtering target which can be used for semiconductor industries and a multi-stage cascade process of the supported liquid membrane(SLM) for separation and purification of rare metals such as cobalt and nickel. (author). 30 refs., 48 figs., 9 tabs.

New half-metallic materials with an alkaline earth element

International Nuclear Information System (INIS)

Kusakabe, Koichi; Geshi, Masaaki; Tsukamoto, Hidekazu; Suzuki, Naoshi

2004-01-01

New candidates for half-metallic materials were theoretically designed recently by Geshi et al. The materials are calcium pnictides, i.e. CaP, CaAs and CaSb. When the zinc-blende structure was assumed, these compounds showed half-metallic electronic band-structure, in which a curious flat band was found. To explain this magnetism, we investigated characters of orbitals on this flat band of CaAs. The hybridization of p states of As with d states of Ca is shown to be essential for formation of a flat band made of localized orbitals. The appearance of complete spin polarization in the flat band suggests that the flat-band mechanism is relevant for the ferromagnetism. A connection from the first-principles result to a solvable Hubbard model with a flat band is discussed

Solvent properties of hydrazine in the preparation of metal chalcogenide bulk materials and films.

Science.gov (United States)

Yuan, Min; Mitzi, David B

2009-08-21

A combination of unique solvent properties of hydrazine enables the direct dissolution of a range of metal chalcogenides at ambient temperature, rendering this an extraordinarily simple and soft synthetic approach to prepare new metal chalcogenide-based materials. The extended metal chalcogenide parent framework is broken up during this process, and the resulting metal chalcogenide building units are re-organized into network structures (from 0D to 3D) based upon their interactions with the hydrazine/hydrazinium moieties. This Perspective will review recent crystal and materials chemistry developments within this family of compounds and will briefly discuss the utility of this approach in metal chalcogenide thin-film deposition.

A low-cost, manufacturable method for fabricating capillary and optical fiber interconnects for microfluidic devices.

Science.gov (United States)

Hartmann, Daniel M; Nevill, J Tanner; Pettigrew, Kenneth I; Votaw, Gregory; Kung, Pang-Jen; Crenshaw, Hugh C

2008-04-01

Microfluidic chips require connections to larger macroscopic components, such as light sources, light detectors, and reagent reservoirs. In this article, we present novel methods for integrating capillaries, optical fibers, and wires with the channels of microfluidic chips. The method consists of forming planar interconnect channels in microfluidic chips and inserting capillaries, optical fibers, or wires into these channels. UV light is manually directed onto the ends of the interconnects using a microscope. UV-curable glue is then allowed to wick to the end of the capillaries, fibers, or wires, where it is cured to form rigid, liquid-tight connections. In a variant of this technique, used with light-guiding capillaries and optical fibers, the UV light is directed into the capillaries or fibers, and the UV-glue is cured by the cone of light emerging from the end of each capillary or fiber. This technique is fully self-aligned, greatly improves both the quality and the manufacturability of the interconnects, and has the potential to enable the fabrication of interconnects in a fully automated fashion. Using these methods, including a semi-automated implementation of the second technique, over 10,000 interconnects have been formed in almost 2000 microfluidic chips made of a variety of rigid materials. The resulting interconnects withstand pressures up to at least 800psi, have unswept volumes estimated to be less than 10 femtoliters, and have dead volumes defined only by the length of the capillary.

Microstructure and mechanical properties of metallic high-temperature materials. Research report

International Nuclear Information System (INIS)

Mughrabi, H.; Gottstein, G.; Mecking, H.; Riedel, H.; Toboloski, J.

1999-01-01

This volume contains 38 lectures of research studies performed in the course of the Priority Programme 'Microstructure and Mechanical Properties of Metallic High-Temperature Materials' supported by the Deutsche Forschungsgemeinschaft (DFG) over a period of six years from 1991 to 1997. The four materials selected were: 1. light metal PM-aluminium and titanium base alloys; 2. ferritic chromium and austenitic alloy 800 steels; 3. (monocrystalline) nickel-base superalloys; and 4. nickel- and iron-base oxide-dispersion-strengthened superalloys. All papers have been abstracted separately for the ENERGY database

Efficient waveguide coupler based on metal materials

Science.gov (United States)

Wu, Wenjun; Yang, Junbo; Chang, Shengli; Zhang, Jingjing; Lu, Huanyu

2015-10-01

Because of the diffraction limit of light, the scale of optical element stays in the order of wavelength, which makes the interface optics and nano-electronic components cannot be directly matched, thus the development of photonics technology encounters a bottleneck. In order to solve the problem that coupling of light into the subwavelength waveguide, this paper proposes a model of coupler based on metal materials. By using Surface Plasmon Polaritons (SPPs) wave, incident light can be efficiently coupled into waveguide of diameter less than 100 nm. This paper mainly aims at near infrared wave band, and tests a variety of the combination of metal materials, and by changing the structural parameters to get the maximum coupling efficiency. This structure splits the plane incident light with wavelength of 864 nm, the width of 600 nm into two uniform beams, and separately coupled into the waveguide layer whose width is only about 80 nm, and the highest coupling efficiency can reach above 95%. Using SPPs structure will be an effective method to break through the diffraction limit and implement photonics device high-performance miniaturization. We can further compress the light into small scale fiber or waveguide by using the metal coupler, and to save the space to hold more fiber or waveguide layer, so that we can greatly improve the capacity of optical communication. In addition, high-performance miniaturization of the optical transmission medium can improve the integration of optical devices, also provide a feasible solution for the photon computer research and development in the future.

Method and apparatus for fabricating a composite structure consisting of a filamentary material in a metal matrix

Science.gov (United States)

Banker, J.G.; Anderson, R.C.

1975-10-21

A method and apparatus are provided for preparing a composite structure consisting of filamentary material within a metal matrix. The method is practiced by the steps of confining the metal for forming the matrix in a first chamber, heating the confined metal to a temperature adequate to effect melting thereof, introducing a stream of inert gas into the chamber for pressurizing the atmosphere in the chamber to a pressure greater than atmospheric pressure, confining the filamentary material in a second chamber, heating the confined filamentary material to a temperature less than the melting temperature of the metal, evacuating the second chamber to provide an atmosphere therein at a pressure, placing the second chamber in registry with the first chamber to provide for the forced flow of the molten metal into the second chamber to effect infiltration of the filamentary material with the molten metal, and thereafter cooling the metal infiltrated-filamentary material to form said composite structure.

Method and apparatus for fabricating a composite structure consisting of a filamentary material in a metal matrix

International Nuclear Information System (INIS)

Banker, J.G.; Anderson, R.C.

1975-01-01

A method and apparatus are provided for preparing a composite structure consisting of filamentary material within a metal matrix. The method is practiced by the steps of confining the metal for forming the matrix in a first chamber, heating the confined metal to a temperature adequate to effect melting thereof, introducing a stream of inert gas into the chamber for pressurizing the atmosphere in the chamber to a pressure greater than atmospheric pressure, confining the filamentary material in a second chamber, heating the confined filamentary material to a temperature less than the melting temperature of the metal, evacuating the second chamber to provide an atmosphere therein at a pressure, placing the second chamber in registry with the first chamber to provide for the forced flow of the molten metal into the second chamber to effect infiltration of the filamentary material with the molten metal, and thereafter cooling the metal infiltrated-filamentary material to form said composite structure

Technical Meeting on Liquid Metal Reactor Concepts: Core Design and Structural Materials. Working Material

International Nuclear Information System (INIS)

2013-01-01

The objective of the TM on “Liquid metal reactor concept: core design and structural materials” was to present and discuss innovative liquid metal fast reactor (LMFR) core designs with special focus on the choice, development, testing and qualification of advanced reactor core structural materials. Main results arising from national and international R&D programmes and projects in the field were reviewed, and new activities to be carried out under the IAEA aegis were identified on the basis of the analysis of current research and technology gaps

Porous honeycomb structures formed from interconnected MnO2 sheets on CNT-coated substrates for flexible all-solid-state supercapacitors

Science.gov (United States)

Ko, Wen-Yin; Chen, You-Feng; Lu, Ke-Ming; Lin, Kuan-Jiuh

2016-01-01

The use of lightweight and easily-fabricated MnO2/carbon nanotube (CNT)-based flexible networks as binder-free electrodes and a polyvinyl alcohol/H2SO4 electrolyte for the formation of stretchable solid-state supercapacitors was examined. The active electrodes were fabricated from 3D honeycomb porous MnO2 assembled from cross-walled and interconnected sheet-architectural MnO2 on CNT-based plastic substrates (denoted as honeycomb MnO2/CNT textiles).These substrates were fabricated through a simple two-step procedure involving the coating of multi-walled carbon nanotubes (MWCNTs) onto commercial textiles by a dipping-drying process and subsequent electrodeposition of the interconnected MnO2 sheets onto the MWCNT-coated textile. With such unique MnO2 architectures integrated onto CNT flexible films, good performance was achieved with a specific capacitance of 324 F/g at 0.5 A/g. A maximum energy density of 7.2 Wh/kg and a power density as high as 3.3 kW/kg were exhibited by the honeycomb MnO2/CNT network device, which is comparable to the performance of other carbon-based and metal oxide/carbon-based solid-state supercapacitor devices. Specifically, the long-term cycling stability of this material is excellent, with almost no loss of its initial capacitance and good Coulombic efficiency of 82% after 5000 cycles. These impressive results identify these materials as a promising candidate for use in environmentally friendly, low-cost, and high-performance flexible energy-storage devices. PMID:26726724

Analysis of the fractures of metallic materials using optical coherence tomography

Science.gov (United States)

Hutiu, Gh.; Duma, V.-F.; Demian, D.; Bradu, A.; Podoleanu, A. Gh.

2017-06-01

Forensic in situ investigations, for example for aviation, maritime, road, or rail accidents would benefit from a method that may allow to distinguish ductile from brittle fractures of metals - as material defects are one of the potential causes of such accidents. Currently, the gold standard in material studies is represented by scanning electron microscopy (SEM). However, SEM are large, lab-based systems, therefore in situ measurements are excluded. In addition, they are expensive and time-consuming. We have approached this problem and propose the use of Optical Coherence Tomography (OCT) in such investigations in order to overcome these disadvantages of SEM. In this respect, we demonstrate the capability to perform such fracture analysis by obtaining the topography of metallic surfaces using OCT. Different materials have been analyzed; in this presentation a sample of low soft carbon steel with the chemical composition of C 0.2%, Mn 1.15%, S 0.04%, P 0.05 % and Fe for the rest has been considered. An in-house developed Swept Source (SS) OCT system has been used, and height profiles have been generated for the sample surface. This profile allowed for concluding that the carbon steel sample was subjected to a ductile fracture. A validation of the OCT images obtained with a 10 microns resolution has been made with SEM images obtained with a 4 nm resolution. Although the OCT resolution is much lower than the one of SEM, we thus demonstrate that it is sufficient in order to obtain clear images of the grains of the metallic materials and thus to distinguish between ductile and brittle fractures. This study analysis opens avenues for a range of applications, including: (i) to determine the causes that have generated pipe ruptures, or structural failures of metallic bridges and buildings, as well as damages of machinery parts; (ii) to optimize the design of various machinery; (iii) to obtain data regarding the structure of metallic alloys); (iv) to improve the

Identifying influential spreaders in interconnected networks

International Nuclear Information System (INIS)

Zhao, Dawei; Li, Lixiang; Huo, Yujia; Yang, Yixian; Li, Shudong

2014-01-01

Identifying the most influential spreaders in spreading dynamics is of the utmost importance for various purposes for understanding or controlling these processes. The existing relevant works are limited to a single network. Most real networks are actually not isolated, but typically coupled and affected by others. The properties of epidemic spreading have recently been found to have some significant differences in interconnected networks from those in a single network. In this paper, we focus on identifying the influential spreaders in interconnected networks. We find that the well-known k-shell index loses effectiveness; some insignificant spreaders in a single network become the influential spreaders in the whole interconnected networks while some influential spreaders become no longer important. The simulation results show that the spreading capabilities of the nodes not only depend on their influence for the network topology, but also are dramatically influenced by the spreading rate. Based on this perception, a novel index is proposed for measuring the influential spreaders in interconnected networks. We then support the efficiency of this index with numerical simulations. (paper)

Alkali metal protective garment and composite material

Science.gov (United States)

Ballif, III, John L.; Yuan, Wei W.

1980-01-01

A protective garment and composite material providing satisfactory heat resistance and physical protection for articles and personnel exposed to hot molten alkali metals, such as sodium. Physical protection is provided by a continuous layer of nickel foil. Heat resistance is provided by an underlying backing layer of thermal insulation. Overlying outer layers of fireproof woven ceramic fibers are used to protect the foil during storage and handling.

Method of quantitative analysis of superconducting metal-conducting composite materials

International Nuclear Information System (INIS)

Bogomolov, V.N.; Zhuravlev, V.V.; Petranovskij, V.P.; Pimenov, V.A.

1990-01-01

Technique for quantitative analysis of superconducting metal-containing composite materials, SnO 2 -InSn, WO 3 -InW, Zn)-InZn in particular, has been developed. The method of determining metal content in a composite is based on the dependence of superconducting transition temperature on alloy composition. Sensitivity of temperature determination - 0.02K, error of analysis for InSn system - 0.5%

Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node

International Nuclear Information System (INIS)

Yin, Lan; Harburg, Daniel V.; Rogers, John A.; Bozler, Carl; Omenetto, Fiorenzo

2015-01-01

Tungsten interconnects in silicon integrated circuits built at the 90 nm node with releasable configurations on silicon on insulator wafers serve as the basis for advanced forms of water-soluble electronics. These physically transient systems have potential uses in applications that range from temporary biomedical implants to zero-waste environmental sensors. Systematic experimental studies and modeling efforts reveal essential aspects of electrical performance in field effect transistors and complementary ring oscillators with as many as 499 stages. Accelerated tests reveal timescales for dissolution of the various constituent materials, including tungsten, silicon, and silicon dioxide. The results demonstrate that silicon complementary metal-oxide-semiconductor circuits formed with tungsten interconnects in foundry-compatible fabrication processes can serve as a path to high performance, mass-produced transient electronic systems

Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node

Energy Technology Data Exchange (ETDEWEB)

Yin, Lan; Harburg, Daniel V.; Rogers, John A., E-mail: jrogers@illinois.edu [Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S Goodwin Ave., Urbana, Illinois 61801 (United States); Bozler, Carl [Lincoln Laboratory, Massachusetts Institute of Technology, 244 Wood Street, Lexington, Massachusetts 02420 (United States); Omenetto, Fiorenzo [Department of Biomedical Engineering, Department of Physics, Tufts University, 4 Colby St., Medford, Massachusetts 02155 (United States)

2015-01-05

Tungsten interconnects in silicon integrated circuits built at the 90 nm node with releasable configurations on silicon on insulator wafers serve as the basis for advanced forms of water-soluble electronics. These physically transient systems have potential uses in applications that range from temporary biomedical implants to zero-waste environmental sensors. Systematic experimental studies and modeling efforts reveal essential aspects of electrical performance in field effect transistors and complementary ring oscillators with as many as 499 stages. Accelerated tests reveal timescales for dissolution of the various constituent materials, including tungsten, silicon, and silicon dioxide. The results demonstrate that silicon complementary metal-oxide-semiconductor circuits formed with tungsten interconnects in foundry-compatible fabrication processes can serve as a path to high performance, mass-produced transient electronic systems.

Regulatory Issues Surrounding Merchant Interconnection

International Nuclear Information System (INIS)

Kuijlaars, Kees-Jan; Zwart, Gijsbert

2003-11-01

We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections

Regulatory Issues Surrounding Merchant Interconnection

Energy Technology Data Exchange (ETDEWEB)

Kuijlaars, Kees-Jan; Zwart, Gijsbert [Office for Energy Regulation (DTe), The Hague (Netherlands)

2003-11-01

We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections.

Effects of different drying processes on the concentrations of metals and metalloids in plant materials

International Nuclear Information System (INIS)

Anawar, H.M.; Canha, N.; Freitas, M.C; Santa Regina, I.; Garcia-Sanchez, A.

2011-01-01

The drying process of fresh plant materials may affect the porous structure, dehydration and a number of quality characteristics of these materials. Therefore, this study has investigated the effect of different drying processes on the variation of metal and metalloid concentrations in the dried plant materials. Seven varieties of native plant species collected from Sao Domingos mine were analyzed by instrumental neutron activation analysis (INAA) to investigate the effects of freeze-drying (FD), ambient air-drying (AAD) and oven-drying (OD) process on the concentrations of metals and metalloids in the plant biomass. Comparison of ambient air-dried, oven-dried and freeze-dried preparations allows a phenomenological description of the dehydration artefacts. In the quantitative analysis of metals and metalloids, FD and OD plant samples show the higher concentrations of metals and metalloids when compared to those in the AAD plant biomass. The freeze-drying process is comparatively reliable for determination of metals and metalloids concentrations in plant materials. (author)

Free-Space Optical Interconnect Employing VCSEL Diodes

Science.gov (United States)

Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

2009-01-01

Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

Heavy metals adsorption by novel EDTA-modified chitosan-silica hybrid materials.

Science.gov (United States)

Repo, Eveliina; Warchoł, Jolanta K; Bhatnagar, Amit; Sillanpää, Mika

2011-06-01

Novel adsorbents were synthesized by functionalizing chitosan-silica hybrid materials with (ethylenediaminetetraacetic acid) EDTA ligands. The synthesized adsorbents were found to combine the advantages of both silica gel (high surface area, porosity, rigid structure) and chitosan (surface functionality). The Adsorption potential of hybrid materials was investigated using Co(II), Ni(II), Cd(II), and Pb(II) as target metals by varying experimental conditions such as pH, contact time, and initial metal concentration. The kinetic results revealed that the pore diffusion process played a key role in adsorption kinetics, which might be attributed to the porous structure of synthesized adsorbents. The obtained maximum adsorption capacities of the hybrid materials for the metal ions ranged from 0.25 to 0.63 mmol/g under the studied experimental conditions. The adsorbent with the highest chitosan content showed the best adsorption efficiency. Bi-Langmuir and Sips isotherm model fitting to experimental data suggested the surface heterogeneity of the prepared adsorbents. In multimetal solutions, the hybrid adsorbents showed the highest affinity toward Pb(II). Copyright © 2011 Elsevier Inc. All rights reserved.

Brookhaven segment interconnect

International Nuclear Information System (INIS)

Morse, W.M.; Benenson, G.; Leipuner, L.B.

1983-01-01

We have performed a high energy physics experiment using a multisegment Brookhaven FASTBUS system. The system was composed of three crate segments and two cable segments. We discuss the segment interconnect module which permits communication between the various segments

Material accountancy for metallic fuel pin casting

International Nuclear Information System (INIS)

Bucher, R.G.; Orechwa, Y.; Beitel, J.C.

1995-01-01

The operation of the Fuel Conditioning Facility (FCF) is based on the electrometallurgical processing of spent metallic reactor fuel. The pin casting operation, although only one of several operations in FCF, was the first to be on-line. As such, it has served to demonstrate the material accountancy system in many of its facets. This paper details, for the operation of the pin casting process with depleted uranium, the interaction between the mass tracking system (MTG) and some of the ancillary computer codes which generate pertinent information for operations and material accountancy. It is necessary to distinguish between two types of material balance calculations -- closeout for operations and material accountancy for safeguards. The two have much in common, for example, the mass tracking system database and the calculation of an inventory difference, but, in general, are not congruent with regard to balance period and balance spatial domain. Moreover, the objective, assessment, and reporting requirements of the calculated inventory difference are very different in the two cases

Analysis of material flow in metal forming processes by using computer simulation and experiment with model material

International Nuclear Information System (INIS)

Kim, Heon Young; Kim, Dong Won

1993-01-01

The objective of the present study is to analyze material flow in the metal forming processes by using computer simulation and experiment with model material, plasticine. A UBET program is developed to analyze the bulk flow behaviour of various metal forming problems. The elemental strain-hardening effect is considered in an incremental manner and the element system is automatically regenerated at every deforming step in the program. The material flow behaviour in closed-die forging process with rib-web type cavity are analyzed by UBET and elastic-plastic finite element method, and verified by experiments with plasticine. There were good agreements between simulation and experiment. The effect of corner rounding on material flow behavior is investigated in the analysis of backward extrusion with square die. Flat punch indentation process is simulated by UBET, and the results are compared with that of elastic-plastic finite element method. (Author)

Strain Rate Dependant Material Model for Orthotropic Metals

International Nuclear Information System (INIS)

Vignjevic, Rade

2016-01-01

In manufacturing processes anisotropic metals are often exposed to the loading with high strain rates in the range from 10"2 s"-"1 to 10"6 s"-"1 (e.g. stamping, cold spraying and explosive forming). These types of loading often involve generation and propagation of shock waves within the material. The material behaviour under such a complex loading needs to be accurately modelled, in order to optimise the manufacturing process and achieve appropriate properties of the manufactured component. The presented research is related to development and validation of a thermodynamically consistent physically based constitutive model for metals under high rate loading. The model is capable of modelling damage, failure and formation and propagation of shock waves in anisotropic metals. The model has two main parts: the strength part which defines the material response to shear deformation and an equation of state (EOS) which defines the material response to isotropic volumetric deformation [1]. The constitutive model was implemented into the transient nonlinear finite element code DYNA3D [2] and our in house SPH code. Limited model validation was performed by simulating a number of high velocity material characterisation and validation impact tests. The new damage model was developed in the framework of configurational continuum mechanics and irreversible thermodynamics with internal state variables. The use of the multiplicative decomposition of deformation gradient makes the model applicable to arbitrary plastic and damage deformations. To account for the physical mechanisms of failure, the concept of thermally activated damage initially proposed by Tuller and Bucher [3], Klepaczko [4] was adopted as the basis for the new damage evolution model. This makes the proposed damage/failure model compatible with the Mechanical Threshold Strength (MTS) model Follansbee and Kocks [5], 1988; Chen and Gray [6] which was used to control evolution of flow stress during plastic

Optical backplane interconnect switch for data processors and computers

Science.gov (United States)

Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.

1989-01-01

An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

Modelling of the high temperature behaviour of metallic materials

International Nuclear Information System (INIS)

Mohr, R.

1999-01-01

The design of components of metallic high-temperature materials by the finite element method requires the application of phenomenological viscoplastic material models. The route from the choice of a convenient model, the numerical integration of the equations and the parameter identification to the design of components is described. The Chaboche-model is used whose evolution equations are explicitly integrated. The parameters are determined by graphical and numerical methods in order to use the material model for describing the deformation behaviour of a chromium steel and an intermetallic titanium aluminide alloy. (orig.)

76 FR 45248 - PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C...

Science.gov (United States)

2011-07-28

...-002; Docket No. EL11-20-001] PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical Conference On June 13, 2011, the Commission issued... Resources Services, Inc., Maryland Public Service Commission, Monitoring Analytics, L.L.C., National Rural...

Fundamentals of radiation materials science metals and alloys

CERN Document Server

Was, Gary S

2017-01-01

The revised second edition of this established text offers readers a significantly expanded introduction to the effects of radiation on metals and alloys. It describes the various processes that occur when energetic particles strike a solid, inducing changes to the physical and mechanical properties of the material. Specifically it covers particle interaction with the metals and alloys used in nuclear reactor cores and hence subject to intense radiation fields. It describes the basics of particle-atom interaction for a range of particle types, the amount and spatial extent of the resulting radiation damage, the physical effects of irradiation and the changes in mechanical behavior of irradiated metals and alloys. Updated throughout, some major enhancements for the new edition include improved treatment of low- and intermediate-energy elastic collisions and stopping power, expanded sections on molecular dynamics and kinetic Monte Carlo methodologies describing collision cascade evolution, new treatment of t...

On metallic gratings coated conformally with isotropic negative-phase-velocity materials

International Nuclear Information System (INIS)

Inchaussandague, Marina E.; Lakhtakia, Akhlesh; Depine, Ricardo A.

2008-01-01

Application of the differential method (also called the C method) to plane-wave diffraction by a perfectly conducting, sinusoidally corrugated metallic grating coated with a linear, homogeneous, isotropic, lossless dielectric-magnetic material shows that coating materials with negative index of refraction may deliver enhanced maximum nonspecular reflection efficiencies in comparison to coating materials with positive index of refraction

On metallic gratings coated conformally with isotropic negative-phase-velocity materials

Energy Technology Data Exchange (ETDEWEB)

Inchaussandague, Marina E. [GEA-Grupo de Electromagnetismo Aplicado, Departamento de Fisica, Facultad de Ciencias Exactas y Naturales, Universidad de Buenos Aires, Ciudad Universitaria, Pabellon I, 1428 Buenos Aires (Argentina); CONICET-Consejo Nacional de Investigaciones Cientificas y Tecnicas, Rivadavia 1917, Buenos Aires (Argentina)], E-mail: mei@df.uba.ar; Lakhtakia, Akhlesh [CATMAS-Computational and Theoretical Materials Sciences Group, Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802-6812 (United States)], E-mail: akhlesh@psu.edu; Depine, Ricardo A. [GEA-Grupo de Electromagnetismo Aplicado, Departamento de Fisica, Facultad de Ciencias Exactas y Naturales, Universidad de Buenos Aires, Ciudad Universitaria, Pabellon I, 1428 Buenos Aires (Argentina); CONICET-Consejo Nacional de Investigaciones Cientificas y Tecnicas, Rivadavia 1917, Buenos Aires (Argentina)], E-mail: rdep@df.uba.ar

2008-03-31

Application of the differential method (also called the C method) to plane-wave diffraction by a perfectly conducting, sinusoidally corrugated metallic grating coated with a linear, homogeneous, isotropic, lossless dielectric-magnetic material shows that coating materials with negative index of refraction may deliver enhanced maximum nonspecular reflection efficiencies in comparison to coating materials with positive index of refraction.

Spine-like Nanostructured Carbon Interconnected by Graphene for High-performance Supercapacitors

Science.gov (United States)

Park, Sang-Hoon; Yoon, Seung-Beom; Kim, Hyun-Kyung; Han, Joong Tark; Park, Hae-Woong; Han, Joah; Yun, Seok-Min; Jeong, Han Gi; Roh, Kwang Chul; Kim, Kwang-Bum

2014-08-01

Recent studies on supercapacitors have focused on the development of hierarchical nanostructured carbons by combining two-dimensional graphene and other conductive sp2 carbons, which differ in dimensionality, to improve their electrochemical performance. Herein, we report a strategy for synthesizing a hierarchical graphene-based carbon material, which we shall refer to as spine-like nanostructured carbon, from a one-dimensional graphitic carbon nanofiber by controlling the local graphene/graphitic structure via an expanding process and a co-solvent exfoliation method. Spine-like nanostructured carbon has a unique hierarchical structure of partially exfoliated graphitic blocks interconnected by thin graphene sheets in the same manner as in the case of ligaments. Owing to the exposed graphene layers and interconnected sp2 carbon structure, this hierarchical nanostructured carbon possesses a large, electrochemically accessible surface area with high electrical conductivity and exhibits high electrochemical performance.

Semiconductor Metal-Organic Frameworks: Future Low-Bandgap Materials.

Science.gov (United States)

Usman, Muhammad; Mendiratta, Shruti; Lu, Kuang-Lieh

2017-02-01

Metal-organic frameworks (MOFs) with low density, high porosity, and easy tunability of functionality and structural properties, represent potential candidates for use as semiconductor materials. The rapid development of the semiconductor industry and the continuous miniaturization of feature sizes of integrated circuits toward the nanometer (nm) scale require novel semiconductor materials instead of traditional materials like silicon, germanium, and gallium arsenide etc. MOFs with advantageous properties of both the inorganic and the organic components promise to serve as the next generation of semiconductor materials for the microelectronics industry with the potential to be extremely stable, cheap, and mechanically flexible. Here, a perspective of recent research is provided, regarding the semiconducting properties of MOFs, bandgap studies, and their potential in microelectronic devices. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

SSC [Superconducting Super Collider] magnet mechanical interconnections

International Nuclear Information System (INIS)

Bossert, R.C.; Niemann, R.C.; Carson, J.A.; Ramstein, W.L.; Reynolds, M.P.; Engler, N.H.

1989-03-01

Installation of superconducting accelerator dipole and quadrupole magnets and spool pieces in the SSC tunnel requires the interconnection of the cryostats. The connections are both of an electrical and mechanical nature. The details of the mechanical connections are presented. The connections include piping, thermal shields and insulation. There are seven piping systems to be connected. These systems must carry cryogenic fluids at various pressures or maintain vacuum and must be consistently leak tight. The interconnection region must be able to expand and contract as magnets change in length while cooling and warming. The heat leak characteristics of the interconnection region must be comparable to that of the body of the magnet. Rapid assembly and disassembly is required. The magnet cryostat development program is discussed. Results of quality control testing are reported. Results of making full scale interconnections under magnet test situations are reviewed. 11 figs., 4 tabs

Metal Contacts to Gallium Arsenide.

Science.gov (United States)

Ren, Fan

1991-07-01

While various high performance devices fabricated from the gallium arsenide (GaAs) and related materials have generated considerable interest, metallization are fundamental components to all semiconductor devices and integrated circuits. The essential roles of metallization systems are providing the desired electrical paths between the active region of the semiconductor and the external circuits through the metal interconnections and contacts. In this work, in-situ clean of native oxide, high temperature n-type, low temperature n-type and low temperature p-type ohmic metal systems have been studied. Argon ion mill was used to remove the native oxide prior to metal deposition. For high temperature process n-type GaAs ohmic contacts, Tungsten (W) and Tungsten Silicide (WSi) were used with an epitaxial grown graded Indium Gallium Arsenide (InGaAs) layer (0.2 eV) on GaAs. In addition, refractory metals, Molybdenum (Mo), was incorporated in the Gold-Germanium (AuGe) based on n-type GaAs ohmic contacts to replace conventional silver as barrier to prevent the reaction between ohmic metal and chlorine based plasma as well as the ohmic metallization intermixing which degrades the device performance. Finally, Indium/Gold-Beryllium (In/Au-Be) alloy has been developed as an ohmic contact for p-type GaAs to reduce the contact resistance. The Fermi-level pinning of GaAs has been dominated by the surface states. The Schottky barrier height of metal contacts are about 0.8 V regardless of the metal systems. By using p-n junction approach, barrier height of pulsed C-doped layers was achieved as high as 1.4 V. Arsenic implantation into GaAs method was also used to enhance the barrier height of 1.6 V.

Systems and Methods for Fabricating Structures Including Metallic Glass-Based Materials Using Low Pressure Casting

Science.gov (United States)

Hofmann, Douglas C. (Inventor); Kennett, Andrew (Inventor)

2018-01-01

Systems and methods to fabricate objects including metallic glass-based materials using low-pressure casting techniques are described. In one embodiment, a method of fabricating an object that includes a metallic glass-based material includes: introducing molten alloy into a mold cavity defined by a mold using a low enough pressure such that the molten alloy does not conform to features of the mold cavity that are smaller than 100 microns; and cooling the molten alloy such that it solidifies, the solid including a metallic glass-based material.

Fusion-bonded fluidic interconnects

International Nuclear Information System (INIS)

Fazal, I; Elwenspoek, M C

2008-01-01

A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are discussed in terms of the homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 µm thick silicon, with glass tubes having an outer diameter of 6 mm and with a wall thickness of 2 mm, is more than 60 bars after annealing at a temperature of 800 °C

Wüstite in the fusion crust of Almahata Sitta sulfide-metal assemblage MS-166: Evidence for oxygen in metallic melts

Science.gov (United States)

Horstmann, Marian; Humayun, Munir; Harries, Dennis; Langenhorst, Falko; Chabot, Nancy L.; Bischoff, Addi; Zolensky, Michael E.

2013-05-01

Meteorite fusion crusts form during the passage of a meteoroid through the Earth's atmosphere and are highly oxidized intergrowths as documented by the presence of e.g., oxides. The porous and irregular fusion crust surrounding the Almahata Sitta sulfide-metal assemblage MS-166 was found highly enriched in wüstite (Fe1-xO). Frictional heating of the outer portions of the assemblage caused partial melting of predominantly the Fe-sulfide and minor amounts of the outer Ni-rich portions of the originally zoned metal in MS-166. Along with melting significant amounts of oxygen were incorporated into the molten fusion crust and mainly FeS was oxidized and desulfurized to form wüstite. Considerable amounts of FeS were lost due to ablation, whereas the cores of the large metal grains appear largely unmelted leaving behind metal grains and surrounding wüstite-rich material (matte). Metal grains along with the surrounding matte typically form an often highly porous framework of globules interconnected with the matte. Although textures and chemical composition suggest that melting of Fe,Ni metal occurred only partially (Ni-rich rims), there is a trace elemental imprint of siderophile element partitioning influenced by oxygen in the metallic melt as indicated by the behavior of W and Ga, the two elements significantly affected by oxygen in a metallic melt. It is remarkable that MS-166 survived the atmospheric passage as troilite inclusions in iron meteorites are preferentially destroyed.

Colligation, Or the Logical Inference of Interconnection

DEFF Research Database (Denmark)

Falster, Peter

1998-01-01

laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in pure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

Colligation or, The Logical Inference of Interconnection

DEFF Research Database (Denmark)

Franksen, Ole Immanuel; Falster, Peter

2000-01-01

laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in oure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

Compositions of graphene materials with metal nanostructures and microstructures and methods of making and using including pressure sensors

KAUST Repository

Chen, Ye

2017-01-26

Composition comprising at least one graphene material and at least one metal. The metal can be in the form of nanoparticles as well as microflakes, including single crystal microflakes. The metal can be intercalated in the graphene sheets. The composition has high conductivity and flexibility. The composition can be made by a one-pot synthesis in which a graphene material precursor is converted to the graphene material, and the metal precursor is converted to the metal. A reducing solvent or dispersant such as NMP can be used. Devices made from the composition include a pressure sensor which has high sensitivity. Two two- dimension materials can be combined to form a hybrid material.

Development of materials resistant to metal dusting degradation.

Energy Technology Data Exchange (ETDEWEB)

Natesan, K.; Zeng, Z.

2006-04-24

Metal dusting corrosion has been a serious problem in the petroleum and petrochemical industries, such as reforming and syngas production systems. This form of deterioration has led to worldwide material loss for 50 years. For the past three years, we have studied the mechanism of metal dusting for Fe- and Ni-base alloys. In this report, we present a correlation between the weight loss and depth of pits that form in Ni-base alloys. Nickel-base alloys were also tested at 1 and 14.8 atm (210 psi), in a high carbon activity environment. Higher system pressure was found to accelerate corrosion in most Ni-base alloys. To reduce testing time, a pre-pitting method was developed. Mechanical scratches on the alloy surface led to fast metal dusting corrosion. We have also developed preliminary data on the performance of weldments of several Ni-base alloys in a metal dusting environment. Finally, Alloy 800 tubes and plates used in a reformer plant were examined by scanning electron microscopy, energy dispersive X-ray, and Raman spectroscopy. The oxide scale on the surface of the Alloy 800 primarily consists of Fe{sub 1+x}Cr{sub 2-X}O{sub 4} spinel phase with high Fe content. Carbon can diffuse through this oxide scale. It was discovered that the growth of metal dusting pits could be stopped by means of a slightly oxidized alloy surface. This leads to a new way to solve metal dusting problem.

Contribution of nuclear analysis methods to the certification of BCR reference materials for non-metals in non-ferrous metals

International Nuclear Information System (INIS)

Pauwels, J.

1979-01-01

A number of reference materials for oxygen in different non-ferrous metals have been certified by BCR in the frame of a multidisciplinary Community project. The contribution of nuclear analysis methods is illustrated by several examples concerning the optimization of sample preparation techniques, the analysis of low and high oxygen non-ferrous metals and the extension of the program to other non-metals, especially nitrogen and carbon. (author)

Structural characteristics of carbon nanofibers for on-chip interconnect applications

International Nuclear Information System (INIS)

Ominami, Yusuke; Ngo, Quoc; Austin, Alexander J.; Yoong, Hans; Yang, Cary Y.; Cassell, Alan M.; Cruden, Brett A.; Li Jun; Meyyappan, M.

2005-01-01

In this letter, we compare the structures of plasma-enhanced chemical vapor deposition of Ni-catalyzed and Pd-catalyzed carbon nanofibers (CNFs) synthesized for on-chip interconnect applications with scanning transmission electron microscopy (STEM). The Ni-catalyzed CNF has a conventional fiberlike structure and many graphitic layers that are almost parallel to the substrate at the CNF base. In contrast, the Pd-catalyzed CNF has a multiwall nanotubelike structure on the sidewall spanning the entire CNF. The microstructure observed in the Pd-catalyzed fibers at the CNF-metal interface has the potential to lower contact resistance significantly, as our electrical measurements using current-sensing atomic force microscopy indicate. A structural model is presented based on STEM image analysis

Status quo of ceramic material for metal halide discharge lamps

International Nuclear Information System (INIS)

Kappen, Theo G M M

2005-01-01

Polycrystalline alumina is an excellent ceramic material for use as the envelope for metal halide discharge lamps. Although this material was introduced in the mid-1960s, and is thus already known for several decades, recent years have seen considerable effort aimed at further development of these ceramic envelope materials. Developments are not only in the field of ceramic shaping technologies, but are also concentrated on the material properties of the ceramic material itself. Optical, mechanical as well as the chemical properties of the ceramic envelope are strongly controlled by the shape as well as the microstructure of the ceramics used

Synthesis of highly interconnected 3D scaffold from Arothron stellatus skin collagen for tissue engineering application.

Science.gov (United States)

Ramanathan, Giriprasath; Singaravelu, Sivakumar; Raja, M D; Sivagnanam, Uma Tiruchirapalli

2015-11-01

The substrate which is avidly used for tissue engineering applications should have good mechanical and biocompatible properties, and all these parameters are often considered as essential for dermal reformation. Highly interconnected three dimensional (3D) wound dressing material with enhanced structural integrity was synthesized from Arothron stellatus fish skin (AsFS) collagen for tissue engineering applications. The synthesized 3D collagen sponge (COL-SPG) was further characterized by different physicochemical methods. The scanning electron microscopy analysis of the material demonstrated that well interconnected pores with homogeneous microstructure on the surface aids higher swelling index and that the material also possessed good mechanical properties with a Young's modulus of 0.89±0.2 MPa. Biocompatibility of the 3D COL-SPG showed 92% growth for both NIH 3T3 fibroblasts and keratinocytes. Overall, the study revealed that synthesized 3D COL-SPG from fish skin will act as a promising wound dressing in skin tissue engineering. Copyright © 2015 Elsevier Ltd. All rights reserved.

The Spanish Protocol for Collaboration on the Radiological Surveillance of Metallic Materials

Energy Technology Data Exchange (ETDEWEB)

Redondo, J.M., E-mail: jmredondo@mityc.es [Ministry of Industry, Tourism and Trade (Spain)

2011-07-15

In recent years the presence of radioactive material in scrap metal has been detected relatively often. This can cause the contamination of people or of the environment, as well as of the industrial facilities and of the product. The Spanish iron and steel industry is one of the most important industrial sectors in the country, and depends to a large extent on the importation of a significant proportion of the scrap used as raw material. Experience has shown that countries that import large quantities of scrap for their industries are more exposed to the existence of orphan radioactive sources and therefore, they have to adopt measures to reduce the risks arising from their presence. In 1999, the Spanish authorities, along with the business associations involved in the metal recovery and smelting industry, and the radioactive waste management agency, established a national system for the radiological surveillance and control of scrap metal and the products resulting from its processing. Since then, the most relevant trade unions and others in the industrial sector have also joined the system. It is based on the existence of a legal framework and on a set of voluntary commitments taken on by the involved parties. It is known as the Protocol for Collaboration for the Radiological Surveillance of Metallic Materials and is implemented by the installation of specific radiological surveillance equipment, the development of radiological training and information plans for the staff involved in the metal recovery and smelting sectors, the definition of a fully operational system to safely manage the materials detected, and a general improvement of the national radiological emergency system. (author)

The Process of Nanostructuring of Metal (Iron Matrix in Composite Materials for Directional Control of the Mechanical Properties

Directory of Open Access Journals (Sweden)

Elena Zemtsova

2014-01-01

Full Text Available We justified theoretical and experimental bases of synthesis of new class of highly nanostructured composite nanomaterials based on metal matrix with titanium carbide nanowires as dispersed phase. A new combined method for obtaining of metal iron-based composite materials comprising the powder metallurgy processes and the surface design of the dispersed phase is considered. The following stages of material synthesis are investigated: (1 preparation of porous metal matrix; (2 surface structuring of the porous metal matrix by TiC nanowires; (3 pressing and sintering to give solid metal composite nanostructured materials based on iron with TiC nanostructures with size 1–50 nm. This material can be represented as the material type “frame in the frame” that represents iron metal frame reinforcing the frame of different chemical compositions based on TiC. Study of material functional properties showed that the mechanical properties of composite materials based on iron with TiC dispersed phase despite the presence of residual porosity are comparable to the properties of the best grades of steel containing expensive dopants and obtained by molding. This will solve the problem of developing a new generation of nanostructured metal (iron-based materials with improved mechanical properties for the different areas of technology.

Recycling of Metals and Materials: A Selected Bibliography.

Science.gov (United States)

Seidman, Ruth K., Comp.; Castrow, Lee, Comp.

Recycling of metals and materials has as its purpose the easing of two major environmental crises. First, we re-utilize scarce and non-renewable resources. Second, solid waste disposal problems can be alleviated. Industry has long been concerned with reclaiming its own waste products, and is now beginning to respond to the need for dealing with…

Adapting Memory Hierarchies for Emerging Datacenter Interconnects

Institute of Scientific and Technical Information of China (English)

江涛; 董建波; 侯锐; 柴琳; 张立新; 孙凝晖; 田斌

2015-01-01

Efficient resource utilization requires that emerging datacenter interconnects support both high performance communication and efficient remote resource sharing. These goals require that the network be more tightly coupled with the CPU chips. Designing a new interconnection technology thus requires considering not only the interconnection itself, but also the design of the processors that will rely on it. In this paper, we study memory hierarchy implications for the design of high-speed datacenter interconnects—particularly as they affect remote memory access—and we use PCIe as the vehicle for our investigations. To that end, we build three complementary platforms: a PCIe-interconnected prototype server with which we measure and analyze current bottlenecks; a software simulator that lets us model microarchitectural and cache hierarchy changes;and an FPGA prototype system with a streamlined switchless customized protocol Thunder with which we study hardware optimizations outside the processor. We highlight several architectural modifications to better support remote memory access and communication, and quantify their impact and limitations.

Isotopic evidence for primordial molecular cloud material in metal-rich carbonaceous chondrites

DEFF Research Database (Denmark)

van Kooten, Elishevah M. M. E.; Wielandt, Daniel Kim Peel; Schiller, Martin

2016-01-01

product of (26)Al. This correlation is interpreted as reflecting progressive thermal processing of in-falling (26)Al-rich molecular cloud material in the inner Solar System. The thermally unprocessed molecular cloud matter reflecting the nucleosynthetic makeup of the molecular cloud before the last......)Mg*-depleted and (54)Cr-enriched component. This composition is consistent with that expected for thermally unprocessed primordial molecular cloud material before its pollution by stellar-derived (26)Al. The (26)Mg* and (54)Cr compositions of bulk metal-rich chondrites require significant amounts (25......-50%) of primordial molecular cloud matter in their precursor material. Given that such high fractions of primordial molecular cloud material are expected to survive only in the outer Solar System, we infer that, similarly to cometary bodies, metal-rich carbonaceous chondrites are samples of planetesimals...

Laser-shocked energetic materials with metal additives: evaluation of detonation performance

Science.gov (United States)

Gottfried, Jennifer; Bukowski, Eric

A focused, nanosecond-pulsed laser with sufficient energy to exceed the breakdown threshold of a material generates a laser-induced plasma with high peak temperatures, pressures, and shock velocities. Depending on the laser parameters and material properties, nanograms to micrograms of material is ablated, atomized, ionized and excited in the laser-induced plasma. The subsequent shock wave expansion into the air above the sample has been monitored using high-speed schlieren imaging in a recently developed technique, laser-induced air shock from energetic materials (LASEM). The estimated detonation velocities using LASEM agree well with published experimental values. A comparison of the measured shock velocities for various energetic materials including RDX, DNTF, and LLM-172 doped with Al or B to the detonation velocities predicted by CHEETAH for inert or active metal participation demonstrates that LASEM has potential for predicting the early time participation of metal additives in detonation events. The LASEM results show that reducing the amount of hydrogen present in B formulations increases the resulting detonation velocities

ANDRA - Referential Materials. Volume 1: Context and scope; Volume 2: Argillaceous materials; Volume 3: Cementitious materials; Volume 4: The corrosion of metallic materials

International Nuclear Information System (INIS)

2001-01-01

This huge document gathers four volumes. The first volume presents some generalities about materials used in the storage of radioactive materials (definition, design principle, current choices and corresponding storage components, general properties of materials and functions of the corresponding storage components, physical and chemical solicitations experienced by materials in a storage), and the structure and content of the other documents. The second volume addresses argillaceous materials. It presents some generalities about these materials in the context of a deep geological storage, and about their design. It presents and comments the crystalline and chemical, and physical and chemical characteristics of swelling argillaceous materials and minerals, describes how these swelling argillaceous materials are shaped and set up, presents and comments physical properties (hydraulic, mechanical and thermal properties) of these materials, comments and discusses the modelling of the geo-chemical behaviour, and their behaviour in terms of containment and transport of radionuclides. The third volume addresses cementitious materials. It presents some generalities about these materials in the context of a deep geological storage, and about their definition and specifications. It presents some more detailed generalities (cement definition and composition, hydration, microstructure of hydrated cements, adjuvants), presents and comments their physical properties (fresh concrete structure and influence of composition, main aimed properties in the hardened status, transfer, mechanical, and thermal properties, shaping and setting up of these materials, technical solutions for hydraulic works). The fourth volume addresses the corrosion of metallic materials. It presents some generalities about these materials in the context of a deep geological storage of radioactive materials. It presents metallic materials and discusses their corrosion behaviour. It describes the peculiarities

Metal phosphonate hybrid mesostructures: environmentally friendly multifunctional materials for clean energy and other applications.

Science.gov (United States)

Ma, Tian-Yi; Yuan, Zhong-Yong

2011-10-17

The synthesis of porous hybrid materials has been extended to mesoporous non-silica-based organic-inorganic hybrid materials, in which mesoporous metal phosphonates represent an important family. By using organically bridged polyphosphonic acids as coupling molecules, the homogeneous incorporation of a considerable number of organic functional groups into the metal phosphonate hybrid framework has been realized. Small amounts of organic additives and the pH value of the reaction solution have a large impact on the morphology and textural properties of the resultant hybrid mesoporous metal phosphonate solids. Cationic and nonionic surfactants can be used as templates for the synthesis of ordered mesoporous metal phosphonates. The materials are used as efficient adsorbents for heavy metal ions, CO₂, and aldehydes, as well as in the separation of polycyclic aromatic hydrocarbons. They are also useful photocatalysts under UV and simulated solar light irradiation for organic dye degradation. Further functionalization of the synthesized mesoporous hybrids makes them oxidation and acid catalysts, both with impressive performances in the fields of sustainable energy and environment. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

STATISTICAL DISTRIBUTION PATTERNS IN MECHANICAL AND FATIGUE PROPERTIES OF METALLIC MATERIALS

OpenAIRE

Tatsuo, SAKAI; Masaki, NAKAJIMA; Keiro, TOKAJI; Norihiko, HASEGAWA; Department of Mechanical Engineering, Ritsumeikan University; Department of Mechanical Engineering, Toyota College of Technology; Department of Mechanical Engineering, Gifu University; Department of Mechanical Engineering, Gifu University

1997-01-01

Many papers on the statistical aspect of materials strength have been collected and reviewed by The Research Group for Statistical Aspects of Materials Strength.A book of "Statistical Aspects of Materials Strength" was written by this group, and published in 1992.Based on the experimental data compiled in this book, distribution patterns of mechanical properties are systematically surveyed paying an attention to metallic materials.Thus one can obtain the fundamental knowledge for a reliabilit...

A metallization and bonding approach for high performance carbon nanotube thermal interface materials

International Nuclear Information System (INIS)

Cross, Robert; Graham, Samuel; Cola, Baratunde A; Fisher, Timothy; Xu Xianfan; Gall, Ken

2010-01-01

A method has been developed to create vertically aligned carbon nanotube (VACNT) thermal interface materials that can be attached to a variety of metallized surfaces. VACNT films were grown on Si substrates using standard CVD processing followed by metallization using Ti/Au. The coated CNTs were then bonded to metallized substrates at 220 deg. C. By reducing the adhesion of the VACNTs to the growth substrate during synthesis, the CNTs can be completely transferred from the Si growth substrate and used as a die attachment material for electronic components. Thermal resistance measurements using a photoacoustic technique showed thermal resistances as low as 1.7 mm 2 K W -1 for bonded VACNT films 25-30 μm in length and 10 mm 2 K W -1 for CNTs up to 130 μm in length. Tensile testing demonstrated a die attachment strength of 40 N cm -2 at room temperature. Overall, these metallized and bonded VACNT films demonstrate properties which are promising for next-generation thermal interface material applications.

Comparison of filter media materials for heavy metal removal from urban stormwater runoff using biofiltration systems.

Science.gov (United States)

Lim, H S; Lim, W; Hu, J Y; Ziegler, A; Ong, S L

2015-01-01

The filter media in biofiltration systems play an important role in removing potentially harmful pollutants from urban stormwater runoff. This study compares the heavy metal removal potential (Cu, Zn, Cd, Pb) of five materials (potting soil, compost, coconut coir, sludge and a commercial mix) using laboratory columns. Total/dissolved organic carbon (TOC/DOC) was also analysed because some of the test materials had high carbon content which affects heavy metal uptake/release. Potting soil and the commercial mix offered the best metal uptake when dosed with low (Cu: 44.78 μg/L, Zn: 436.4 μg/L, Cd, 1.82 μg/L, Pb: 51.32 μg/L) and high concentrations of heavy metals (Cu: 241 μg/L, Zn: 1127 μg/L, Cd: 4.57 μg/L, Pb: 90.25 μg/L). Compost and sludge also had high removal efficiencies (>90%). Heavy metal leaching from these materials was negligible. A one-month dry period between dosing experiments did not affect metal removal efficiencies. TOC concentrations from all materials increased after the dry period. Heavy metal removal was not affected by filter media depth (600 mm vs. 300 mm). Heavy metals tended to accumulate at the upper 5 cm of the filter media although potting soil showed bottom-enriched concentrations. We recommend using potting soil as the principal media mixed with compost or sludge since these materials perform well and are readily available. The use of renewable materials commonly found in Singapore supports a sustainable approach to urban water management. Copyright © 2014 Elsevier Ltd. All rights reserved.

Control and Management of Radioactive Material Inadvertently Incorporated into Scrap Metal. Proceedings of an International Conference

International Nuclear Information System (INIS)

2011-01-01

Radioactive substances can become associated with scrap metal in various ways and if not discovered they can be incorporated into steel and non-ferrous metals through the melting process. This can cause health hazards as well as environmental concerns and there can be serious commercial implications. Numerous incidents have occurred in recent years involving the discovery of radioactive substances in scrap metal and, in some cases, in metal from the melting process. These incidents have proved to be very costly in relation to the recovery and cleanup operations required but also in terms of the potential loss of confidence of the industry in scrap metal as a resource. This has led the scrap metal industry to seek ways of managing the problem. In most countries, shipments of scrap metal are monitored but at different points in the distribution chain and to different extents and efficiencies. As yet, only limited efforts towards unifying and harmonizing monitoring strategies and methods in the context of scrap metal have been made at the international level. The Conference was organized into five sessions: the global perspective, national policies and strategies, compliance with radiological criteria, management of incidents with contaminated scrap metal, and improving confidence and protecting the interests of stakeholders. The aim of the first session was to present the views and perspectives of the different organizations concerned with radioactive material in scrap metal, scrap metal recycling, steel making, radiation source security and safety and international trade and economics. The second session covered some of the national policies and strategies being used to address the control of radioactive material that has been inadvertently incorporated into scrap metal were presented. In addition to the oral presentations, contributions describing the situation in many countries of the world in the form of posters were displayed. The many posters reporting national

Control and Management of Radioactive Material Inadvertently Incorporated into Scrap Metal. Proceedings of an International Conference

Energy Technology Data Exchange (ETDEWEB)

NONE

2011-07-15

Radioactive substances can become associated with scrap metal in various ways and if not discovered they can be incorporated into steel and non-ferrous metals through the melting process. This can cause health hazards as well as environmental concerns and there can be serious commercial implications. Numerous incidents have occurred in recent years involving the discovery of radioactive substances in scrap metal and, in some cases, in metal from the melting process. These incidents have proved to be very costly in relation to the recovery and cleanup operations required but also in terms of the potential loss of confidence of the industry in scrap metal as a resource. This has led the scrap metal industry to seek ways of managing the problem. In most countries, shipments of scrap metal are monitored but at different points in the distribution chain and to different extents and efficiencies. As yet, only limited efforts towards unifying and harmonizing monitoring strategies and methods in the context of scrap metal have been made at the international level. The Conference was organized into five sessions: the global perspective, national policies and strategies, compliance with radiological criteria, management of incidents with contaminated scrap metal, and improving confidence and protecting the interests of stakeholders. The aim of the first session was to present the views and perspectives of the different organizations concerned with radioactive material in scrap metal, scrap metal recycling, steel making, radiation source security and safety and international trade and economics. The second session covered some of the national policies and strategies being used to address the control of radioactive material that has been inadvertently incorporated into scrap metal were presented. In addition to the oral presentations, contributions describing the situation in many countries of the world in the form of posters were displayed. The many posters reporting national

Inkjet printing metals on flexible materials for plastic and paper electronics

DEFF Research Database (Denmark)

Al-Shamery, K.; Raut, N. C.

2018-01-01

Inorganic printed electronics is now recognized as an area of tremendous commercial, potential and technical progress. Many research groups are actively involved worldwide in developing metal nanoparticle inks and precursors for printing inorganic/organic materials using different printing....... Besides some examples demonstrating aspects on ink formulation via patterning solid surfaces such as glass and silicon oxide, special emphasis will be placed on compatibility for usage in plastic and paper electronics. Printing of nanoparticles of copper, silver, gold etc. will be discussed...... and will be compared to printing of a variety of metal-organic precursor inks. Finally, a brief account on exemplary applications using the printed inorganic nanoparticles/materials is provided....

Driving Interconnected Networks to Supercriticality

Directory of Open Access Journals (Sweden)

Filippo Radicchi

2014-04-01

Full Text Available Networks in the real world do not exist as isolated entities, but they are often part of more complicated structures composed of many interconnected network layers. Recent studies have shown that such mutual dependence makes real networked systems potentially exposed to atypical structural and dynamical behaviors, and thus there is an urgent necessity to better understand the mechanisms at the basis of these anomalies. Previous research has mainly focused on the emergence of atypical properties in relation to the moments of the intra- and interlayer degree distributions. In this paper, we show that an additional ingredient plays a fundamental role for the possible scenario that an interconnected network can face: the correlation between intra- and interlayer degrees. For sufficiently high amounts of correlation, an interconnected network can be tuned, by varying the moments of the intra- and interlayer degree distributions, in distinct topological and dynamical regimes. When instead the correlation between intra- and interlayer degrees is lower than a critical value, the system enters in a supercritical regime where dynamical and topological phases are no longer distinguishable.

Interconnected Silicon Hollow Nanospheres for Lithium-Ion Battery Anodes with Long Cycle Life

KAUST Repository

Yao, Yan

2011-07-13

Silicon is a promising candidate for the anode material in lithium-ion batteries due to its high theoretical specific capacity. However, volume changes during cycling cause pulverization and capacity fade, and improving cycle life is a major research challenge. Here, we report a novel interconnected Si hollow nanosphere electrode that is capable of accommodating large volume changes without pulverization during cycling. We achieved the high initial discharge capacity of 2725 mAh g-1 with less than 8% capacity degradation every hundred cycles for 700 total cycles. Si hollow sphere electrodes also show a Coulombic efficiency of 99.5% in later cycles. Superior rate capability is demonstrated and attributed to fast lithium diffusion in the interconnected Si hollow structure. © 2011 American Chemical Society.

Metallic materials corrosion problems in molten salt reactors

International Nuclear Information System (INIS)

Chauvin, G.; Dixmier, J.; Jarny, P.

1977-01-01

The USA forecastings concerning the molten salt reactors are reviewed (mixtures of fluorides containing the fuel, operating between 560 and 700 0 C). Corrosion problems are important in these reactors. The effects of certain characteristic factors on corrosion are analyzed: humidity and metallic impurities in the salts, temperature gradients, speed of circulation of salts, tellurium from fission products, coupling. In the molten fluorides and experimental conditions, the materials with high Ni content are particularly corrosion resistant alloys (hastelloy N). The corrosion of this material is about 2.6 mg.cm -2 at 700 0 C [fr

Financial viability of the Sonora-Baja California interconnection line

International Nuclear Information System (INIS)

Alonso, G.; Ortega, G.

2017-09-01

In the Development Program of the National Electricity Sector 2015-2029, an electric interconnection line between Sonora and Baja California (Mexico) is proposed, this study analyzes the financial viability of this interconnection line based on the maximum hourly and seasonal energy demand between both regions and proposes alternatives for the supply of electric power that supports the economic convenience of this interconnection line. The results show that additional capacity is required in Sonora to cover the maximum demands of both regions since in the current condition of the National Electric System the interconnection line is not justified. (Author)

Packaging and interconnection for superconductive circuitry

International Nuclear Information System (INIS)

Anacker, W.

1976-01-01

A three dimensional microelectronic module packaged for reduced signal propagation delay times including a plurality of circuit carrying means, which may comprise unbacked chips, with integrated superconductive circuitry thereon is described. The circuit carrying means are supported on their edges and have contact lands in the vicinity of, or at, the edges to provide for interconnecting circuitry. The circuit carrying means are supported by supporting means which include slots to provide a path for interconnection wiring to contact the lands of the circuit carrying means. Further interconnecting wiring may take the form of integrated circuit wiring on the reverse side of the supporting means. The low heat dissipation of the superconductive circuitry allows the circuit carrying means to be spaced approximately no less than 30 mils apart. The three dimensional arrangement provides lower random propagation delays than would a planar array of circuits

Multifunctional Metallic and Refractory Materials for Energy Efficient Handling of Molten Metals

Energy Technology Data Exchange (ETDEWEB)

Xingbo Liu; Ever Barbero; Bruce Kang; Bhaskaran Gopalakrishnan; James Headrick; Carl Irwin

2009-02-06

The goal of the project was to extend the lifetime of hardware submerged in molten metal by an order of magnitude and to improve energy efficiency of molten metal handling process. Assuming broad implementation of project results, energy savings in 2020 were projected to be 10 trillion BTU/year, with cost savings of approximately $100 million/year. The project team was comprised of materials research groups from West Virginia University and the Missouri University of Science and Technology formerly University of Missouri – Rolla, Oak Ridge National Laboratory, International Lead and Zinc Research Organization, Secat and Energy Industries of Ohio. Industry partners included six suppliers to the hot dip galvanizing industry, four end-user steel companies with hot-dip Galvanize and/or Galvalume lines, eight refractory suppliers, and seven refractory end-user companies. The results of the project included the development of: (1) New families of materials more resistant to degradation in hot-dip galvanizing bath conditions were developed; (2) Alloy 2020 weld overlay material and process were developed and applied to GI rolls; (3) New Alloys and dross-cleaning procedures were developed for Galvalume processes; (4) Two new refractory compositions, including new anti-wetting agents, were identified for use with liquid aluminum alloys; (5) A new thermal conductivity measurement technique was developed and validated at ORNL; (6) The Galvanizing Energy Profiler Decision Support System (GEPDSS)at WVU; Newly Developed CCW Laser Cladding Shows Better Resistance to Dross Buildup than 316L Stainless Steel; and (7) A novel method of measuring the corrosion behavior of bath hardware materials. Project in-line trials were conducted at Southwire Kentucky Rod and Cable Mill, Nucor-Crawfordsville, Nucor-Arkansas, Nucor-South Carolina, Wheeling Nisshin, California Steel, Energy Industries of Ohio, and Pennex Aluminum. Cost, energy, and environmental benefits resulting from the project

Economic and environmental benefits of interconnected systems. The Spanish example

International Nuclear Information System (INIS)

Chicharro, A.S.; Dios Alija, R. de

1996-01-01

The interconnected systems provide large technical and economic benefits which, evaluated and contrasted with the associated network investment cost, usually produce important net savings. There are continental electrical systems formed by many interconnected subsystems. The optimal size of an interconnection should be defined within an economic background. It is necessary to take into account the global environmental effects. The approach and results of studies carried out by Red Electrica is presented, in order to analyse both economic and environmental benefits resulting from an increase in the present Spanish interconnection capacities. From both economic and environmental points of view, the development of the interconnected systems is highly positive. (author)

Characterization of liquid metal reactor materials

International Nuclear Information System (INIS)

Kuk, I. H.; Ryu, W. S.; Kim, H. H. and others

1999-03-01

The objectives of this report were to assess the material requirements for LMR environment, to select the optimum candidates for KALIMER components, to characterize the performance for establishing a database of the structural materials for KALIMER, and to develop the basic material technologies for the localization of the advanced materials. Stainless steel ingots were melted by VIM and hot-rolled to plate with the thickness of 15mm. The plate was solution-treated for 1 hr at 1100 deg C and then water-quenched. Specimens were taken parallel to the rolling direction of the plate. The effects of nitrogen and phosphorus were analyzed on the high temperature mechanical properties of 316MRP (Liquid Metal Reactor, Primary candidate material) stainless steels with the different nitrogen content from 0.04 to 0.15% and with the different phosphorus content from 0.002 to 0.02%. Heat treatment was performed to investigate the changes in microstructure and mechanical properties of Cr-Mo steels for LMR heat transfer tube materials and core materials. The Cr-Mo steels were normalized at the temperatures between 900 deg C and 1200 deg C for 1hrs and tempered at the temperatures between 500 deg C and 800 deg C for 2hrs. Conventional optical and electron micrographic studies were carried out to investigate the martensite lath structure, carbide indentification and carbide shape. Vickers microhardness was measured at room temperature using 10g load. Tensile properties were tested at high temperature. Charpy V-notch impact tests were also carried out at temperature between -120 deg C and +180 deg C. (author). 72 refs., 28 tabs., 244 figs

Research on metallic material defect detection based on bionic sensing of human visual properties

Science.gov (United States)

Zhang, Pei Jiang; Cheng, Tao

2018-05-01

Due to the fact that human visual system can quickly lock the areas of interest in complex natural environment and focus on it, this paper proposes an eye-based visual attention mechanism by simulating human visual imaging features based on human visual attention mechanism Bionic Sensing Visual Inspection Model Method to Detect Defects of Metallic Materials in the Mechanical Field. First of all, according to the biologically visually significant low-level features, the mark of defect experience marking is used as the intermediate feature of simulated visual perception. Afterwards, SVM method was used to train the advanced features of visual defects of metal material. According to the weight of each party, the biometrics detection model of metal material defect, which simulates human visual characteristics, is obtained.

Interconnectivity: Benefits and Challenges

Energy Technology Data Exchange (ETDEWEB)

NONE

2010-09-15

Access to affordable and reliable electricity supplies is a basic prerequisite for economic and social development, prosperity, health, education and all other aspects of modern society. Electricity can be generated both near and far from the consumption areas as transmission lines, grid interconnections and distribution systems can transport it to the final consumer. In the vast majority of countries, the electricity sector used to be owned and run by the state. The wave of privatisation and market introduction in a number of countries and regions which started in the late 1980's has in many cases involved unbundling of generation from transmission and distribution (T and D). This has nearly everywhere exposed transmission bottlenecks limiting the development of well-functioning markets. Transmission on average accounts for about 10-15% of total final kWh cost paid by the end-user but it is becoming a key issue for effective operation of liberalised markets and for their further development. An integrated and adequate transmission infrastructure is of utmost importance for ensuring the delivery of the most competitively priced electricity, including externalities, to customers, both near and far from the power generating facilities. In this report, the role of interconnectivity in the development of energy systems is examined with the associated socio-economic, environmental, financial and regulatory aspects that must be taken into account for successful interconnection projects.

Multimode polymer waveguides for high-speed optical interconnects

Science.gov (United States)

Bamiedakis, N.; Ingham, J. D.; Penty, R. V.; White, I. H.; DeGroot, J. V.; Clapp, T. V.

2017-11-01

Polymeric multimode waveguides are of particular interest for optical interconnections in short-reach data links. In some applications, for example in space-borne systems, the use of advanced materials with outstanding performance in extreme environments is required (temperature and radiation). In this paper therefore, we present novel siloxane polymers suitable for these applications. The materials are used to form straight, 90° bent and spiral polymer waveguides by low-cost conventional photolithographic techniques on FR4 substrates. The samples have been tested to investigate their propagation characteristics and demonstrate their potential for high-speed data links. Overall, there is strong evidence that these multimode waveguides can be successfully employed as high-speed short-reach data links. Their excellent thermal properties, their low cost and the simple fabrication process indicate their suitability for a wide range of space applications.

Metal-nanotube composites as radiation resistant materials

Energy Technology Data Exchange (ETDEWEB)

González, Rafael I.; Valencia, Felipe; Mella, José; Kiwi, Miguel, E-mail: m.kiwi.t@gmail.com [Departamento de Física, Facultad de Ciencias, CEDENNA, Universidad de Chile, Casilla 653, Santiago 7800024 (Chile); Duin, Adri C. T. van [Department of Mechanical and Nuclear Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802 (United States); So, Kang Pyo; Li, Ju [Department of Nuclear Science and Engineering and Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139 (United States); Bringa, Eduardo M. [CONICET and Facultad de Ciencias Exactas y Naturales, Universidad Nacional de Cuyo, Mendoza 5500 (Argentina)

2016-07-18

The improvement of radiation resistance in nanocomposite materials is investigated by means of classical reactive molecular dynamics simulations. In particular, we study the influence of carbon nanotubes (CNTs) in an Ni matrix on the trapping and possible outgassing of He. When CNTs are defect-free, He atoms diffuse alongside CNT walls and, although there is He accumulation at the metal-CNT interface, no He trespassing of the CNT wall is observed, which is consistent with the lack of permeability of a perfect graphene sheet. However, when vacancies are introduced to mimic radiation-induced defects, He atoms penetrate CNTs, which play the role of nano-chimneys, allowing He atoms to escape the damaged zone and reduce bubble formation in the matrix. Consequently, composites made of CNTs inside metals are likely to display improved radiation resistance, particularly when radiation damage is related to swelling and He-induced embrittlement.

Metal-nanotube composites as radiation resistant materials

International Nuclear Information System (INIS)

González, Rafael I.; Valencia, Felipe; Mella, José; Kiwi, Miguel; Duin, Adri C. T. van; So, Kang Pyo; Li, Ju; Bringa, Eduardo M.

2016-01-01

The improvement of radiation resistance in nanocomposite materials is investigated by means of classical reactive molecular dynamics simulations. In particular, we study the influence of carbon nanotubes (CNTs) in an Ni matrix on the trapping and possible outgassing of He. When CNTs are defect-free, He atoms diffuse alongside CNT walls and, although there is He accumulation at the metal-CNT interface, no He trespassing of the CNT wall is observed, which is consistent with the lack of permeability of a perfect graphene sheet. However, when vacancies are introduced to mimic radiation-induced defects, He atoms penetrate CNTs, which play the role of nano-chimneys, allowing He atoms to escape the damaged zone and reduce bubble formation in the matrix. Consequently, composites made of CNTs inside metals are likely to display improved radiation resistance, particularly when radiation damage is related to swelling and He-induced embrittlement.

Electrochemical fabrication of interconnected tungsten bronze nanosheets for high performance supercapacitor

Science.gov (United States)

Yang, Gan; Liu, Xiao-Xia

2018-04-01

Interconnected H0.12WO3ṡH2O nanosheets with high electrochemical performances are fabricated on partial exfoliated graphite substrate (Ex-GF) by potential-limited pulse galvanostatic method (PLPG). The dead volume problem of bulk pesudocapacitive materials is addressed by the novel interconnected nanosheets structure, enabling a large specific capacitance of 5.95 F cm-2 (495.8 F g-1) at 2 mA cm-2. Merited from the fluent electrolyte penetration channels established by the plenty voids among nanosheets, as well as fast electron transportation in the electronic conductive tungsten bronze which is directly grown from graphite substrate, the obtained WO3/Ex-GF demonstrates excellent rate capability. The material can maintain 60.0% of its capacitance when the discharge current density increases from 2 to 100 mA cm-2. Moreover, WO3/Ex-GF doesn't show capacitance decay after 5000 galvanostatic charge-discharge cycles, displaying its super stability. Furthermore, a high performance asymmetric supercapacitor assembled by using WO3/Ex-GF and electrochemical fabricated MnO2/Ex-GF as negative and positive electrodes, respectively displays a high energy density of 2.88 mWh cm-3 at the power density of 11.1 mW cm-3, demonstrating its potential application for energy storage.

Aplicación de un material vitrocerámico a la biorremediación de metales pesados

Directory of Open Access Journals (Sweden)

García, A. M.

2004-02-01

Full Text Available In this study, a glassceramic material with hydroxyapatite phase was manufactured from industrial and urban wastes. On this material, biofilms from the microorganisms usually appearing in wastewater were developed. Batch assays were made using different heavy metals to analyze glassceramic material capacity to retain these elements from an aqueous medium in biofilm presence and absence. The results suggest that microorganisms are implicated in the removing of heavy metals from the aqueous medium and open the possibility to use the glassceramic material in a bioremediation process.

En este trabajo se elaboró un material vitrocerámico conteniendo la fase de hidroxiapatita, partiendo de residuos industriales y urbanos. Sobre la superficie del material se desarrollaron biopelículas de los microorganismos que aparecen habitualmente en las aguas residuales. Se hicieron ensayos de retención usando distintos metales pesados para evaluar la capacidad del material de eliminar tales elementos de un medio acuoso en presencia y ausencia de la biopelícula. Los resultados ponen de manifiesto la participación microbiana en los procesos de eliminación de los metales pesados del medio acuoso y ofrecen la posibilidad de utilizar el material vitrocerámico en un proceso de biorremediación de aguas contaminadas por metales pesados.

Cross-border versus cross-sector interconnectivity in renewable energy systems

International Nuclear Information System (INIS)

Thellufsen, Jakob Zinck; Lund, Henrik

2017-01-01

In the transition to renewable energy systems, fluctuating renewable energy, such as wind and solar power, plays a large and important role. This creates a challenge in terms of meeting demands, as the energy production fluctuates based on weather patterns. To utilise high amounts of fluctuating renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection, and the second is cross-sector interconnection, i.e., the integration between different parts of an energy system, for instance heat and electricity. This paper seeks to compare the types of interconnectivity and discuss to which extent they are mutually beneficial. To do this, the study investigates two energy systems that represent Northern and Southern Europe. Both systems go through three developmental steps that increase the cross-sector interconnectivity. At each developmental step an increasing level of transmission capacities is examined to identify the benefits of cross-border interconnectivity. The results show that while both measures increase the system utilisation of renewable energy and the system efficiency, the cross-sector interconnection gives the best system performance. To analyse the possible interaction between cross-sector and cross-border interconnectivity, two main aspects have to be clarified. The first part defines the approach and the second is the construction of the two archetypes. - Highlights: • A method to investigate system integration and system interconnection is suggested. • The implementation is investigated across a Northern and Southern energy system. • The study identifies benefits of system integration and system interconnection. • The performance of the energy system benefits most from system integration.

Electrode and interconnect for miniature fuel cells using direct methanol feed

Science.gov (United States)

Narayanan, Sekharipuram R. (Inventor); Valdez, Thomas I. (Inventor); Clara, Filiberto (Inventor)

2004-01-01

An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

Industrial recovered-materials-utilization targets for the metals and metal-products industry

Energy Technology Data Exchange (ETDEWEB)

None

1980-03-01

The National Energy Conservation Policy Act of 1978 directs DOE to set targets for increased utilization of energy-saving recovered materials for certain industries. These targets are to be established at levels representing the maximum feasible increase in utilization of recovered materials that can be achieved progressively by January 1, 1987 and is consistent with technical and economic factors. A benefit to be derived from the increased use of recoverable materials is in energy savings, as state in the Act. Therefore, emhasis on different industries in the metals sector has been related to their energy consumption. The ferrous industry (iron and steel, ferrour foundries and ferralloys), as defined here, accounts for approximately 3%, and all others for the remaining 3%. Energy consumed in the lead and zinc segments is less than 1% each. Emphasis is placed on the ferrous scrap users, followed by the aluminum and copper industries. A bibliography with 209 citations is included.

Current Solutions: Recent Experience in Interconnecting Distributed Energy Resources

Energy Technology Data Exchange (ETDEWEB)

Johnson, M.

2003-09-01

This report catalogues selected real-world technical experiences of utilities and customers that have interconnected distributed energy assets with the electric grid. This study was initiated to assess the actual technical practices for interconnecting distributed generation and had a particular focus on the technical issues covered under the Institute of Electrical and Electronics Engineers (IEEE) 1547(TM) Standard for Interconnecting Distributed Resources With Electric Power Systems.

Exploring the interconnections between gender, health and nature.

Science.gov (United States)

MacBride-Stewart, S; Gong, Y; Antell, J

2016-12-01

Public health has recognized that nature is good for health but there are calls for a review of its gendered aspects. This review attempts to develop and explore a broad analytical theme - the differing interconnections between gender, health and nature. The paper summarizes the interconnections that have been subject to extensive academic enquiry between gender and health, health and space, and gender and space. A combination of key terms including place; gender; health; outdoor space; green space; natural environment; national parks; femininity; masculinity; recreation; physical activity; sustainability; ecofeminism; feminism; environmental degradation; and environmental justice were used to search the electronic databases Sociological Abstracts, Web of Science and Scopus to identify relevant articles. We took two approaches for this review to provide an overview and analysis of the range of research in the field, and to present a framework of research that is an analysis of the intersection of gender, health and nature. Four dimensions are distinguished: (1) evaluations of health benefits and 'toxicities' of nature; (2) dimensions and qualities of nature/space; (3) environmental justice including accessibility, availability and usability; and (4) identification of boundaries (symbolic/material) that construct differential relationships between nature, gender and health. This paper offers an understanding of how environmental and social conditions may differentially shape the health of women and men. The dimensions direct analytical attention to the diverse linkages that constitute overlapping and inseparable domains of knowledge and practice, to identify complex interconnections between gender, health and nature. This review therefore analyses assumptions about the health benefits of nature, and its risks, for gender from an in-depth, analytical perspective that can be used to inform policy. Copyright © 2016 The Royal Society for Public Health. Published by

Lithium alloys and metal oxides as high-capacity anode materials for lithium-ion batteries

International Nuclear Information System (INIS)

Liang, Chu; Gao, Mingxia; Pan, Hongge; Liu, Yongfeng; Yan, Mi

2013-01-01

Highlights: •Progress in lithium alloys and metal oxides as anode materials for lithium-ion batteries is reviewed. •Electrochemical characteristics and lithium storage mechanisms of lithium alloys and metal oxides are summarized. •Strategies for improving electrochemical lithium storage properties of lithium alloys and metal oxides are discussed. •Challenges in developing lithium alloys and metal oxides as commercial anodes for lithium-ion batteries are pointed out. -- Abstract: Lithium alloys and metal oxides have been widely recognized as the next-generation anode materials for lithium-ion batteries with high energy density and high power density. A variety of lithium alloys and metal oxides have been explored as alternatives to the commercial carbonaceous anodes. The electrochemical characteristics of silicon, tin, tin oxide, iron oxides, cobalt oxides, copper oxides, and so on are systematically summarized. In this review, it is not the scope to retrace the overall studies, but rather to highlight the electrochemical performances, the lithium storage mechanism and the strategies in improving the electrochemical properties of lithium alloys and metal oxides. The challenges and new directions in developing lithium alloys and metal oxides as commercial anodes for the next-generation lithium-ion batteries are also discussed

The effect of long-distance interconnection on wind power variability

International Nuclear Information System (INIS)

Fertig, Emily; Apt, Jay; Jaramillo, Paulina; Katzenstein, Warren

2012-01-01

We use time- and frequency-domain techniques to quantify the extent to which long-distance interconnection of wind plants in the United States would reduce the variability of wind power output. Previous work has shown that interconnection of just a few wind plants across moderate distances could greatly reduce the ratio of fast- to slow-ramping generators in the balancing portfolio. We find that interconnection of aggregate regional wind plants would not reduce this ratio further but would reduce variability at all frequencies examined. Further, interconnection of just a few wind plants reduces the average hourly change in power output, but interconnection across regions provides little further reduction. Interconnection also reduces the magnitude of low-probability step changes and doubles firm power output (capacity available at least 92% of the time) compared with a single region. First-order analysis indicates that balancing wind and providing firm power with local natural gas turbines would be more cost-effective than with transmission interconnection. For net load, increased wind capacity would require more balancing resources but in the same proportions by frequency as currently, justifying the practice of treating wind as negative load. (letter)

High Cycling Performance Cathode Material: Interconnected LiFePO4/Carbon Nanoparticles Fabricated by Sol-Gel Method

Directory of Open Access Journals (Sweden)

Zhigao Yang

2014-01-01

Full Text Available Interconnected LiFePO4/carbon nanoparticles for Li-ion battery cathode have been fabricated by sol-gel method followed by a carbon coating process involving redox reactions. The carbon layers coated on the LiFePO4 nanoparticles not only served as a protection layer but also supplied fast electrons by building a 3D conductive network. As a cooperation, LiFePO4 nanoparticles encapsulated in interconnected conductive carbon layers provided the electrode reactions with fast lithium ions by offering the lithium ions shortening and unobstructed pathways. Field emission scanning electron microscopy (FESEM and X-ray diffraction (XRD tests showed optimized morphology. Electrochemical characterizations including galvanostatic charge/discharge, cyclic voltammetry (CV, and electrochemical impedance spectroscopy (EIS tests, together with impedance parameters calculated, all indicated better electrochemical performance and excellent cycling performance at high rate (with less than 9.5% discharge capacity loss over 2000 cycles, the coulombic efficiency maintained about 100%.

How thin barrier metal can be used to prevent Co diffusion in the modern integrated circuits?

International Nuclear Information System (INIS)

Dixit, Hemant; Konar, Aniruddha; Pandey, Rajan; Ethirajan, Tamilmani

2017-01-01

In modern integrated circuits (ICs), billions of transistors are connected to each other via thin metal layers (e.g. copper, cobalt, etc) known as interconnects. At elevated process temperatures, inter-diffusion of atomic species can occur among these metal layers, causing sub-optimal performance of interconnects, which may lead to the failure of an IC. Thus, typically a thin barrier metal layer is used to prevent the inter-diffusion of atomic species within interconnects. For ICs with sub-10 nm transistors (10 nm technology node), the design rule (thickness scaling) demands the thinnest possible barrier layer. Therefore, here we investigate the critical thickness of a titanium–nitride (TiN) barrier that can prevent the cobalt diffusion using multi-scale modeling and simulations. First, we compute the Co diffusion barrier in crystalline and amorphous TiN with the nudged elastic band method within first-principles density functional theory simulations. Later, using the calculated activation energy barriers, we quantify the Co diffusion length in the TiN metal layer with the help of kinetic Monte Carlo simulations. Such a multi-scale modelling approach yields an exact critical thickness of the metal layer sufficient to prevent the Co diffusion in IC interconnects. We obtain a diffusion length of a maximum of 2 nm for a typical process of thermal annealing at 400 °C for 30 min. Our study thus provides useful physical insights for the Co diffusion in the TiN layer and further quantifies the critical thickness (∼2 nm) to which the metal barrier layer can be thinned down for sub-10 nm ICs. (paper)

How thin barrier metal can be used to prevent Co diffusion in the modern integrated circuits?

Science.gov (United States)

Dixit, Hemant; Konar, Aniruddha; Pandey, Rajan; Ethirajan, Tamilmani

2017-11-01

In modern integrated circuits (ICs), billions of transistors are connected to each other via thin metal layers (e.g. copper, cobalt, etc) known as interconnects. At elevated process temperatures, inter-diffusion of atomic species can occur among these metal layers, causing sub-optimal performance of interconnects, which may lead to the failure of an IC. Thus, typically a thin barrier metal layer is used to prevent the inter-diffusion of atomic species within interconnects. For ICs with sub-10 nm transistors (10 nm technology node), the design rule (thickness scaling) demands the thinnest possible barrier layer. Therefore, here we investigate the critical thickness of a titanium-nitride (TiN) barrier that can prevent the cobalt diffusion using multi-scale modeling and simulations. First, we compute the Co diffusion barrier in crystalline and amorphous TiN with the nudged elastic band method within first-principles density functional theory simulations. Later, using the calculated activation energy barriers, we quantify the Co diffusion length in the TiN metal layer with the help of kinetic Monte Carlo simulations. Such a multi-scale modelling approach yields an exact critical thickness of the metal layer sufficient to prevent the Co diffusion in IC interconnects. We obtain a diffusion length of a maximum of 2 nm for a typical process of thermal annealing at 400 °C for 30 min. Our study thus provides useful physical insights for the Co diffusion in the TiN layer and further quantifies the critical thickness (~2 nm) to which the metal barrier layer can be thinned down for sub-10 nm ICs.

Nanofluid based on self-nanoencapsulated metal/metal alloys phase change materials with tuneable crystallisation temperature.

Science.gov (United States)

Navarrete, Nuria; Gimeno-Furio, Alexandra; Mondragon, Rosa; Hernandez, Leonor; Cabedo, Luis; Cordoncillo, Eloisa; Julia, J Enrique

2017-12-14

Nanofluids using nanoencapsulated Phase Change Materials (nePCM) allow increments in both the thermal conductivity and heat capacity of the base fluid. Incremented heat capacity is produced by the melting enthalpy of the nanoparticles core. In this work two important advances in this nanofluid type are proposed and experimentally tested. It is firstly shown that metal and metal alloy nanoparticles can be used as self-encapsulated nePCM using the metal oxide layer that forms naturally in most commercial synthesis processes as encapsulation. In line with this, Sn/SnOx nanoparticles morphology, size and thermal properties were studied by testing the suitability and performance of encapsulation at high temperatures and thermal cycling using a commercial thermal oil (Therminol 66) as the base fluid. Secondly, a mechanism to control the supercooling effect of this nePCM type based on non-eutectic alloys was developed.

A statistical method for predicting sound absorbing property of porous metal materials by using quartet structure generation set

International Nuclear Information System (INIS)

Guan, Dong; Wu, Jiu Hui; Jing, Li

2015-01-01

Highlights: • A random internal morphology and structure generation-growth method, termed as the quartet structure generation set (QSGS), has been utilized based on the stochastic cluster growth theory for numerical generating the various microstructures of porous metal materials. • Effects of different parameters such as thickness and porosity on sound absorption performance of the generated structures are studied by the present method, and the obtained results are validated by an empirical model as well. • This method could be utilized to guide the design and fabrication of the sound-absorption porous metal materials. - Abstract: In this paper, a statistical method for predicting sound absorption properties of porous metal materials is presented. To reflect the stochastic distribution characteristics of the porous metal materials, a random internal morphology and structure generation-growth method, termed as the quartet structure generation set (QSGS), has been utilized based on the stochastic cluster growth theory for numerical generating the various microstructures of porous metal materials. Then by using the transfer-function approach along with the QSGS tool, we investigate the sound absorbing performance of porous metal materials with complex stochastic geometries. The statistical method has been validated by the good agreement among the numerical results for metal rubber from this method and a previous empirical model and the corresponding experimental data. Furthermore, the effects of different parameters such as thickness and porosity on sound absorption performance of the generated structures are studied by the present method, and the obtained results are validated by an empirical model as well. Therefore, the present method is a reliable and robust method for predicting the sound absorption performance of porous metal materials, and could be utilized to guide the design and fabrication of the sound-absorption porous metal materials

Inorganic material candidates to replace a metallic or non-metallic concrete containment liner

Energy Technology Data Exchange (ETDEWEB)

Seni, C [Atomic Energy of Canada Ltd., Mississauga, ON (Canada); Mills, R H [Toronto Univ., ON (Canada)

1994-12-31

Internal liners for concrete containments are generally organic or metals. They have to be able to inhibit radioactive leakage into the environment, but both types have shortcomings. The results of research to develop a better liner are published in this paper. The best material found was fibre-reinforced mortar. Of the fibres considered, steel, kevlar and glass were the best, each showing advantages and disadvantages. 1 ref., 9 tabs., 12 figs.

Inorganic material candidates to replace a metallic or non-metallic concrete containment liner

International Nuclear Information System (INIS)

Seni, C.; Mills, R.H.

1994-01-01

Internal liners for concrete containments are generally organic or metals. They have to be able to inhibit radioactive leakage into the environment, but both types have shortcomings. The results of research to develop a better liner are published in this paper. The best material found was fibre-reinforced mortar. Of the fibres considered, steel, kevlar and glass were the best, each showing advantages and disadvantages. 1 ref., 9 tabs., 12 figs

Novel bioactive materials developed by simulated body fluid evaluation: Surface-modified Ti metal and its alloys.

Science.gov (United States)

Kokubo, Tadashi; Yamaguchi, Seiji

2016-10-15

Until the discovery of the bone-bonding activity of Bioglass by Hench et al. in the early 1970s, it had not been demonstrated that a synthetic material could bond to living bone without eliciting a foreign body reaction. Since then, various kinds of materials based on calcium phosphate, such as sintered hydroxyapatite and β-tricalcium phosphate have also been shown to bond to living bone. Until the discovery of the bone-bonding activity of Ti metal formed with a sodium titanate surface layer by the present authors in 1996, it had not been shown that a metallic material could bond to living bone. Since then, various kinds of surface-modified Ti metal and its alloys have been found to bond to living bone. Until the discovery of the osteoinduction of porous hydroxyapatite by Yamasaki in 1990, it was unknown whether a synthetic material could induce bone formation even in muscle tissue. Since then, various kinds of porous calcium phosphate ceramics have been shown to induce osteoinduction. Until the discovery of osteoinduction induced by a porous Ti metal formed with a titanium oxide surface layer by Fujibayashi et al. in 2004, it had been unclear whether porous metals would be able to induce osteoinduction. These novel bioactive materials have been developed by systematic research into the apatite formation that occurs on surface-modified Ti metal and its related materials in an acellular simulated body fluid (SBF) having ion concentrations almost equal to those of human blood plasma. Some of the novel bioactive materials based on Ti metal are already in clinical use or clinical trials, such as artificial hip joints and spinal fusion devices. In the present paper, we review how these novel bioactive materials based on Ti metal have been developed based on an evaluation of apatite formation in SBF. Without the SBF evaluation, these novel bioactive materials would most likely never have been developed. On the basis of systematic study of apatite formation on a material

Stability of solid oxide fuel cell materials

Energy Technology Data Exchange (ETDEWEB)

Armstrong, T.R.; Bates, J.L.; Chick, L.A. [Pacific Northwest Lab., Richland, WA (United States)

1996-04-01

Interconnection materials in a solid oxide fuel cell are exposed to both highly oxidizing conditions at the cathode and to highly reducing conditions at the anode. The thermal expansion characteristics of substituted lanthanum and yttrium chromite interconnect materials were evaluated by dilatometry as a function of oxygen partial pressures from 1 atm to 10{sup -18} atm, controlled using a carbon dioxide/hydrogen buffer.

All ceramic structure for molten carbonate fuel cell

Science.gov (United States)

Smith, James L.; Kucera, Eugenia H.

1992-01-01

An all-ceramic molten carbonate fuel cell having a composition formed of a multivalent metal oxide or oxygenate such as an alkali metal, transition metal oxygenate. The structure includes an anode and cathode separated by an electronically conductive interconnect. The electrodes and interconnect are compositions ceramic materials. Various combinations of ceramic compositions for the anode, cathode and interconnect are disclosed. The fuel cell exhibits stability in the fuel gas and oxidizing environments. It presents reduced sealing and expansion problems in fabrication and has improved long-term corrosion resistance.

Activation of human leukocytes on tantalum trabecular metal in comparison to commonly used orthopedic metal implant materials.

Science.gov (United States)

Schildhauer, T A; Peter, E; Muhr, G; Köller, M

2009-02-01

We analyzed leukocyte functions and cytokine response of human leukocytes toward porous tantalum foam biomaterial (Trabecular Metaltrade mark, TM) in comparison to equally sized solid orthopedic metal implant materials (pure titanium, titanium alloy, stainless steel, pure tantalum, and tantalum coated stainless steel). Isolated peripheral blood mononuclear cells (PBMC) and polymorphonuclear neutrophil leukocytes (PMN) were cocultured with equally sized metallic test discs for 24 h. Supernatants were analyzed for cytokine content by enzyme-linked immunosorbent assay. Compared to the other used test materials there was a significant increase in the release of IL (interleukin)-1ra and IL-8 from PMN, and of IL-1ra, IL-6, and TNF-alpha from PBMC in response to the TM material. The cytokine release correlated with surface roughness of the materials. In contrast, the release of IL-2 was not induced showing that mainly myeloid leukocytes were activated. In addition, supernatants of these leukocyte/material interaction (conditioned media, CM) were subjected to whole blood cell function assays (phagocytosis, chemotaxis, bacterial killing). There was a significant increase in the phagocytotic capacity of leukocytes in the presence of TM-conditioned media. The chemotactic response of leukocytes toward TM-conditioned media was significantly higher compared to CM obtained from other test materials. Furthermore, the bactericidal capacity of whole blood was enhanced in the presence of TM-conditioned media. These results indicate that leukocyte activation at the surface of TM material induces a microenvironment, which may enhance local host defense mechanisms.

Three-Dimensional (3D) Printing of Polymer-Metal Hybrid Materials by Fused Deposition Modeling.

Science.gov (United States)

Fafenrot, Susanna; Grimmelsmann, Nils; Wortmann, Martin; Ehrmann, Andrea

2017-10-19

Fused deposition modeling (FDM) is a three-dimensional (3D) printing technology that is usually performed with polymers that are molten in a printer nozzle and placed line by line on the printing bed or the previous layer, respectively. Nowadays, hybrid materials combining polymers with functional materials are also commercially available. Especially combinations of polymers with metal particles result in printed objects with interesting optical and mechanical properties. The mechanical properties of objects printed with two of these metal-polymer blends were compared to common poly (lactide acid) (PLA) printed objects. Tensile tests and bending tests show that hybrid materials mostly containing bronze have significantly reduced mechanical properties. Tensile strengths of the 3D-printed objects were unexpectedly nearly identical with those of the original filaments, indicating sufficient quality of the printing process. Our investigations show that while FDM printing allows for producing objects with mechanical properties similar to the original materials, metal-polymer blends cannot be used for the rapid manufacturing of objects necessitating mechanical strength.

Cost based interconnection charges as a way to induce competition

DEFF Research Database (Denmark)

Falch, Morten

The objective of this paper is to analyse the relationship between regulation of interconnection charges and the level of competition. One of the most important issues in the debate on interconnect regulation has been use of forward looking costs for setting of interconnection charges. This debat...... has been ongoing within the EU as well as in US. This paper discusses the European experiences and in particular the Danish experiences with use of cost based interconnection charges, and their impact on competition in the telecom market....

Cross-border versus cross-sector interconnectivity in renewable energy systems

DEFF Research Database (Denmark)

Thellufsen, Jakob Zinck; Lund, Henrik

2017-01-01

renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection...... systems that represent Northern and Southern Europe. Both systems go through three developmental steps that increase the cross-sector interconnectivity. At each developmental step an increasing level of transmission capacities is examined to identify the benefits of cross-border interconnectivity...

Digital optical interconnects for photonic computing

Science.gov (United States)

Guilfoyle, Peter S.; Stone, Richard V.; Zeise, Frederick F.

1994-05-01

A 32-bit digital optical computer (DOC II) has been implemented in hardware utilizing 8,192 free-space optical interconnects. The architecture exploits parallel interconnect technology by implementing microcode at the primitive level. A burst mode of 0.8192 X 1012 binary operations per sec has been reliably demonstrated. The prototype has been successful in demonstrating general purpose computation. In addition to emulating the RISC instruction set within the UNIX operating environment, relational database text search operations have been implemented on DOC II.

Analysis of interconnecting energy systems over a synchronized life cycle

International Nuclear Information System (INIS)

Nian, Victor

2016-01-01

Highlights: • A methodology is developed for evaluating a life cycle of interconnected systems. • A new concept of partial temporal boundary is introduced via quantitative formulation. • The interconnecting systems are synchronized through the partial temporal boundary. • A case study on the life cycle of the coal–uranium system is developed. - Abstract: Life cycle analysis (LCA) using the process chain analysis (PCA) approach has been widely applied to energy systems. When applied to an individual energy system, such as coal or nuclear electricity generation, an LCA–PCA methodology can yield relatively accurate results with its detailed process representation based on engineering data. However, there are fundamental issues when applying conventional LCA–PCA methodology to a more complex life cycle, namely, a synchronized life cycle of interconnected energy systems. A synchronized life cycle of interconnected energy systems is established through direct interconnections among the processes of different energy systems, and all interconnecting systems are bounded within the same timeframe. Under such a life cycle formation, there are some major complications when applying conventional LCA–PCA methodology to evaluate the interconnecting energy systems. Essentially, the conventional system and boundary formulations developed for a life cycle of individual energy system cannot be directly applied to a life cycle of interconnected energy systems. To address these inherent issues, a new LCA–PCA methodology is presented in this paper, in which a new concept of partial temporal boundary is introduced to synchronize the interconnecting energy systems. The importance and advantages of these new developments are demonstrated through a case study on the life cycle of the coal–uranium system.

Development of a technology for fabricating low-cost parallel optical interconnects

Science.gov (United States)

Van Steenberge, Geert; Hendrickx, Nina; Geerinck, Peter; Bosman, Erwin; Van Put, Steven; Van Daele, Peter

2006-04-01

We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard electrical printed circuit boards (PCBs). The most critical point that is being addressed is the low-cost manufacturing and the compatibility with current PCB production. The latter refers to the processes as well as material compatibility. In the fist part the waveguide fabrication technology is discussed, both photo lithography and laser ablation are proposed. It is shown that a frequency tripled Nd-YAG laser (355 nm) offers a lot of potential for defining single mode interconnections. Emphasis is on multimode waveguides, defined by KrF excimer laser (248 nm) ablation using acrylate polymers. The first conclusion out of loss spectrum measurements is a 'yellowing effect' of laser ablated waveguides, leading to an increased loss at shorter wavelengths. The second important conclusion is a potential low loss at a wavelength of 850 nm, 980 nm and 1310 nm. This is verified at 850 nm by cut-back measurements on 10-cm-long waveguides showing an average propagation loss of 0.13 dB/cm. Photo lithographically defined waveguides using inorganic-organic hybrid polymers show an attenuation loss of 0.15 dB/cm at 850 nm. The generation of debris and the presence of microstructures are two main concerns for KrF excimer laser ablation of hybrid polymers. In the second part a process for embedding metal coated 45° micromirrors in optical waveguiding layers is described. Mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Initial loss measurements indicate an excess mirror loss of 1.5 dB.

Formation of nanocrystalline surface layers in various metallic materials by near surface severe plastic deformation

Directory of Open Access Journals (Sweden)

Masahide Sato, Nobuhiro Tsuji, Yoritoshi Minamino and Yuichiro Koizumi

2004-01-01

Full Text Available The surface of the various kinds of metallic materials sheets were severely deformed by wire-brushing at ambient temperature to achieve nanocrystalline surface layer. The surface layers of the metallic materials developed by the near surface severe plastic deformation (NS-SPD were characterized by means of TEM. Nearly equiaxed nanocrystals with grain sizes ranging from 30 to 200 nm were observed in the near surface regions of all the severely scratched metallic materials, which are Ti-added ultra-low carbon interstitial free steel, austenitic stainless steel (SUS304, 99.99 wt.%Al, commercial purity aluminum (A1050 and A1100, Al–Mg alloy (A5083, Al-4 wt.%Cu alloy, OFHC-Cu (C1020, Cu–Zn alloy (C2600 and Pb-1.5%Sn alloy. In case of the 1050-H24 aluminum, the depth of the surface nanocrystalline layer was about 15 μm. It was clarified that wire-brushing is an effective way of NS-SPD, and surface nanocrystallization can be easily achieved in most of metallic materials.

Liquid metal MHD studies with non-magnetic and ferro-magnetic structural material

Energy Technology Data Exchange (ETDEWEB)

Patel, A., E-mail: anipatel2009@gmail.com [Institute of Plasma Research, Gandhinagar 382428, Gujarat (India); Bhattacharyay, R. [Institute of Plasma Research, Gandhinagar 382428, Gujarat (India); Swain, P.K.; Satyamurthy, P. [Bhabha Atomic Research Center, Mumbai 400085, Maharashtra (India); Sahu, S.; Rajendrakumar, E. [Institute of Plasma Research, Gandhinagar 382428, Gujarat (India); Ivanov, S.; Shishko, A.; Platacis, E.; Ziks, A. [Institute of Physics, University of Latvia, Salaspils 2169 (Latvia)

2014-10-15

Highlights: • Effect of structural material on liquid metal MHD phenomena is studied. • Two identical test sections, one made of SS316L (non-magnetic) and other made of SS430 (ferromagnetic) structural material, are considered. • Wall electric potential and liquid metal pressure drop are compared under various experimental conditions. • Experimental results suggest screening of external magnetic field for SS430 material below the saturation magnetic field. - Abstract: In most of the liquid metal MHD experiments reported in the literature to study liquid breeder blanket performance, SS316/SS304 grade steels are used as the structural material which is non-magnetic. On the other hand, the structural material for fusion blanket systems has been proposed to be ferritic martensitic grade steel (FMS) which is ferromagnetic in nature. In the recent experimental campaign, liquid metal MHD experiments have been carried out with two identical test sections: one made of SS316L (non-magnetic) and another with SS430 (ferromagnetic), to compare the effect of structural materials on MHD phenomena for various magnetic fields (up to 4 T). The maximum Hartmann number and interaction number are 1047 and 300, respectively. Each test section consists of square channel (25 mm × 25 mm) cross-section with two U bends, with inlet and outlet at the middle portion of two horizontal legs, respectively. Pb–Li enters into the test section through a square duct and distributed into two parallel paths through a partition plate. In each parallel path, it travels ∼0.28 m length in plane perpendicular to the magnetic field and faces two 90° bends before coming out of the test section through a single square duct. The wall electrical potential and MHD pressure drop across the test sections are compared under identical experimental conditions. Similar MHD behavior is observed with both the test section at higher value of the magnetic field (>2 T)

3rd Workshop on metal ceramic materials for functional applications

International Nuclear Information System (INIS)

Korb, G.

1997-01-01

This workshop contains contributions about materials and processing, characterization and modeling of properties and applications of metallic ceramics and composite structures. It was held on behalf of the Taiwan-Austrian scientific collaboration in Vienna, June 4 th - 6 th 1997. (Suda)