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Sample records for mems vertical probe

  1. Policies for Probe-Wear Leveling in MEMS-Based Storage Devices

    NARCIS (Netherlands)

    Khatib, M.G.; Hartel, Pieter H.

    2009-01-01

    Probes (or read/write heads) in MEMS-based storage devices are susceptible to wear. We study probe wear, and analyze the causes of probe uneven wear. We show that under real-world traces some probes can wear one order of magnitude faster than other probes leading to premature expiry of some probes.

  2. Gyroscope and Micromirror Design Using Vertical-Axis CMOS-MEMS Actuation and Sensing

    Science.gov (United States)

    2002-01-01

    Micromirrors have been demonstrated by using different micromachining processes. A successful example of a surface-micromachined micromirror is Texas ...Gyroscope and Micromirror Design Using Vertical-Axis CMOS-MEMS Actuation and Sensing by Huikai Xie A dissertation submitted in partial satisfaction...DATE 2002 2. REPORT TYPE 3. DATES COVERED 00-00-2002 to 00-00-2002 4. TITLE AND SUBTITLE Gyroscope and Micromirror Design Using Vertical-Axis

  3. Kelvin probe study of laterally inhomogeneous dielectric charging and charge diffusion in RF MEMS capacitive switches

    NARCIS (Netherlands)

    Herfst, R.W.; Steeneken, P.G.; Schmitz, J.; Mank, A.J.G.; van Gils, M.

    2008-01-01

    In this paper we use Scanning Kelvin Probe Microscopy (SKPM) to detect charge in the dielectric of RF MEMS capacitive switches. We observe a laterally inhomogeneous distribution. Laterally inhomogeneous dielectric charging leads to a narrowing of the C-V curve [1], and can lead to stiction of the

  4. Probing Quantum Turbulence in He II with a MEMS Oscillator

    Science.gov (United States)

    Levental, Aleksander; Bauer, Josh; Gonzalez, Miguel; Zheng, Pan; Lee, Yoonseok; Bun Chan, Ho

    2013-03-01

    Micrometer scale mechanical oscillators based on MEMS technology have been developed for the study of quantum fluids and have been tested successfully at ultra low temperatures. Our recent low temperature test in which the device was immersed in the superfluid phase of 4He revealed striking behavior below 400 mK: nonlinear and hysteretic resonance at high excitations. The observed phenomenon is thought to be related to vortices and quantum turbulence and warrants a systematic investigation for better understanding. We constructed an experimental set-up that allows us to cool a MEMS device in liquid 4He down to 50 mK at pressures up to 25 bar. We will discuss our new set-up and present our preliminary results performed at saturated vapor pressure. This work is supported by NSF through DMR-1205891 (YL).

  5. Linearization of a two-axis MEMS scanner driven by vertical comb-drive actuators

    International Nuclear Information System (INIS)

    Tsai, Jui-che; Lu, Li-Cheng; Hsu, Wei-Chi; Sun, Chia-Wei; Wu, Ming C

    2008-01-01

    A driving scheme using a pair of differential voltages (V x , V y ) over a bias voltage is proposed to linearize the dc characteristic (angle versus voltage) of a two-axis MEMS scanner. The micromirror has a gimbal-less structure and is driven by vertical comb-drive actuators in conjunction with a leverage mechanism. At an optimal bias voltage of 53 V, a linear optical scan range of ±3.2° is achieved experimentally in both the x and y directions with the differential voltages ranging from −10 V to + 10 V

  6. MEMS-based Ni-B probe with enhanced mechanical properties for fine pitch testing

    Science.gov (United States)

    Kim, Kyongtae; Kwon, Hong-Beom; Ahn, Hye-Rin; Kim, Yong-Jun

    2017-12-01

    We fabricated and characterized microelectromechanical systems (MEMS)-based Ni-B probes with enhanced mechanical properties for fine pitch testing. The Ni-B micro-probes were compared with conventional Ni-Co micro-probes in terms of the mechanical performance and thermal effect. The elastic modulus and hardness of Ni-B were found to be 240.4 and 10.9 GPa, respectively, which surpass those of Ni-Co. The Ni-B micro-probes had a higher contact force than the Ni-Co micro-probes by an average of 41.38% owing to the higher elastic modulus. The Ni-B micro-probes had a lower average permanent deformation than the Ni-Co micro-probes after the same overdrive was applied for 1 h by 56.58 µm. The temperature was found to have a negligible effect on the Ni-B micro-probes. These results show that Ni-B micro-probes are useful for fine pitch testing and a potential candidate for replacing conventional Ni-Co micro-probes owing to their advanced mechanical and thermal characteristics.

  7. Commercial-Off-The-Shelf Microelectromechanical Systems (MEMS) Flow-Measurement Probes Fabricated And Assembled

    Science.gov (United States)

    Redding, Chip

    2002-01-01

    As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at the NASA Glenn Research Center have been fabricating packaging components and assembling a set of unique probes using commercial-off-the-shelf microelectromechanical systems (MEMS) integrated circuits (computer chips). Using MEMS as an alternative has some compelling advantages over standard measurement devices. Sensor technologies have matured through high-production usage in industries such as automotive and aircraft manufacturers. Currently, MEMS are the choice in applications such as tire pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Conventional instrumentation uses tubing buried in the model aerodynamic surfaces or wind tunnel walls. The measurements are made when pressure is introduced at the tube opening. The pressure then must travel the tubing for lengths ranging from 20 to hundreds of feet before reaching an electronic signal conditioner. This condition causes a considerable amount of damping and requires measurements to be made only after the test rig has reached steady-state operation. The electronic MEMS pressure sensor is able to take readings continuously under dynamic states in nearly real time. The use of stainless steel tubing for pressure measurements requires many tubes to be cleaned, cut to length, carefully installed, and delicately deburred and spliced for use. A cluster of a few hundred 1/16-in.- (0.0625-in.-) diameter tubes (not uncommon in research testing facilities) can be several inches in diameter and may weigh enough to require two men to handle. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of the 1/16-in. tubing with room to spare. The P592 piezoresistive silicon pressure sensor (Lucas NovaSensor, Fremont, CA) was chosen for this project because of its cost, availability, and tolerance to extreme ambient

  8. Vertically Aligned Carbon Nanotube Array (VANTA Biosensor for MEMS Lab-on-a-Chip

    Directory of Open Access Journals (Sweden)

    Luke JOSEPH

    2009-10-01

    Full Text Available We describe the fabrication, functionalization and characterization of vertically aligned carbon nanotube arrays (VANTAs for biological sensor applications. This structure is created using a standard MEMS process and chemical vapor deposition (CVD multi-walled carbon nanotube (MWNT post-processing. The device is well suited for full integration into microfluidic lab-on-a-chip solutions. Included is a spectroscopic characterization of the galvanostatic impedance of the device, as well as scanning electron microscopy (SEM images of the pre- and post- functionalized device. Interferometric 3D profiling and X-ray spectroscopy were also used to check process assumptions. The work presented validates that this approach is an ideal candidate for low-cost, high-throughput manufacturing of biochemical sensors. Unlike previously published work [1, 2] using SWNT, the use of MWNT arrays allows functionalization over the entirety of the nanotubes. This approach maintains low baseline impedance and increases the surface area leveraging inherent benefits of the VANTA.

  9. Fully Integrated, Miniature, High-Frequency Flow Probe Utilizing MEMS Leadless SOI Technology

    Science.gov (United States)

    Ned, Alex; Kurtz, Anthony; Shang, Tonghuo; Goodman, Scott; Giemette. Gera (d)

    2013-01-01

    This work focused on developing, fabricating, and fully calibrating a flowangle probe for aeronautics research by utilizing the latest microelectromechanical systems (MEMS), leadless silicon on insulator (SOI) sensor technology. While the concept of angle probes is not new, traditional devices had been relatively large due to fabrication constraints; often too large to resolve flow structures necessary for modern aeropropulsion measurements such as inlet flow distortions and vortices, secondary flows, etc. Mea surements of this kind demanded a new approach to probe design to achieve sizes on the order of 0.1 in. (.3 mm) diameter or smaller, and capable of meeting demanding requirements for accuracy and ruggedness. This approach invoked the use of stateof- the-art processing techniques to install SOI sensor chips directly onto the probe body, thus eliminating redundancy in sensor packaging and probe installation that have historically forced larger probe size. This also facilitated a better thermal match between the chip and its mount, improving stability and accuracy. Further, the leadless sensor technology with which the SOI sensing element is fabricated allows direct mounting and electrical interconnecting of the sensor to the probe body. This leadless technology allowed a rugged wire-out approach that is performed at the sensor length scale, thus achieving substantial sensor size reductions. The technology is inherently capable of high-frequency and high-accuracy performance in high temperatures and harsh environments.

  10. Partially flexible MEMS neural probe composed of polyimide and sucrose gel for reducing brain damage during and after implantation

    International Nuclear Information System (INIS)

    Jeon, Myounggun; Yoon, Eui-Sung; Cho, Il-Joo; Cho, Jeiwon; Jung, Dahee; Kim, Yun Kyung; Shin, Sehyun

    2014-01-01

    This paper presents a flexible microelectromechanical systems (MEMS) neural probe that minimizes neuron damage and immune response, suitable for chronic recording applications. MEMS neural probes with various features such as high electrode densities have been actively investigated for neuron stimulation and recording to study brain functions. However, successful recording of neural signals in chronic application using rigid silicon probes still remains challenging because of cell death and macrophages accumulated around the electrodes over time from continuous brain movement. Thus, in this paper, we propose a new flexible MEMS neural probe that consists of two segments: a polyimide-based, flexible segment for connection and a rigid segment composed of thin silicon for insertion. While the flexible connection segment is designed to reduce the long-term chronic neuron damage, the thin insertion segment is designed to minimize the brain damage during the insertion process. The proposed flexible neural probe was successfully fabricated using the MEMS process on a silicon on insulator wafer. For a successful insertion, a biodegradable sucrose gel is coated on the flexible segment to temporarily increase the probe stiffness to prevent buckling. After the insertion, the sucrose gel dissolves inside the brain exposing the polyimide probe. By performing an insertion test, we confirm that the flexible probe has enough stiffness. In addition, by monitoring immune responses and brain histology, we successfully demonstrate that the proposed flexible neural probe incurs fivefold less neural damage than that incurred by a conventional silicon neural probe. Therefore, the presented flexible neural probe is a promising candidate for recording stable neural signals for long-time chronic applications. (paper)

  11. A Small Area In-Situ MEMS Test Structure to Accurately Measure Fracture Strength by Electrostatic Probing

    Energy Technology Data Exchange (ETDEWEB)

    Bitsie, Fernando; Jensen, Brian D.; de Boer, Maarten

    1999-07-15

    We have designed, fabricated, tested and modeled a first generation small area test structure for MEMS fracture studies by electrostatic rather than mechanical probing. Because of its small area, this device has potential applications as a lot monitor of strength or fatigue of the MEMS structural material. By matching deflection versus applied voltage data to a 3-D model of the test structure, we develop high confidence that the local stresses achieved in the gage section are greater than 1 GPa. Brittle failure of the polycrystalline silicon was observed.

  12. Fabrication of thin vertical mirrors through plasma etch and KOH:IPA polishing for integration into MEMS electrostatic actuators

    Science.gov (United States)

    Huda, M. Q.; Amin, T. M. F.; Ning, Y.; McKinnon, G.; Tulip, J.; Jäger, W.

    2013-03-01

    We developed a process for the fabrication of thin vertical mirrors as integrated structures of MEMS electrostatic actuators. The mirrors can be implemented as a vertical extension of the actuator sidewall, or can be positioned at any movable part of the actuator. The process involves the fabrication of a mesa structure on the handle layer of a silicon-oninsulator (SOI) wafer through deep reactive ion etching (DRIE). The etch/passivation cycles of the DRIE process were optimized to achieve vertical etch profiles with a depth of up to 200 μm with an aspect ratio of 10:1. The DRIE process introduced typical etch scallops with peak-to-valley and rms roughnesses on the order of 100 nm and 30 nm, respectively. A mask layer was used to pattern a 2.1 μm sacrificial oxide layer for the mesa structure. A second mask layer allowed us to define a large etch cavity for handle layer back-etch. The DRIE etched mesa structure was then etched with diluted potassium hydroxide (KOH) in isopropyl alcohol (IPA). Temperature and etch concentration were optimized for the removal of etch scallops without the formation of etch facets. The etch scallops were almost completely removed and mirror quality surfaces were achieved. The developed mesa structures are suitable for integration into actuators that are patterned in the device layer. A third masking layer, aligned through infrared camera, was used to position the thin vertical mirror at the actuator sidewall. The process provides design flexibility in integrating vertical mirrors of adjustable dimensions to movable elements of MEMS structures.

  13. Deeply-etched micromirror with vertical slit and metallic coating enabling transmission-type optical MEMS filters

    Science.gov (United States)

    Othman, Muhammad A.; Sabry, Yasser M.; Sadek, Mohamed; Nassar, Ismail M.; Khalil, Diaa A.

    2016-03-01

    In this work we report a novel optical MEMS deeply-etched mirror with metallic coating and vertical slot, where the later allows reflection and transmission by the micromirror. The micromirror as well as fiber grooves are fabricated using deep reactive ion etching technology, where the optical axis is in-plane and the components are self-aligned. The etching depth is 150 μm chosen to improve the micromirror optical throughput. The vertical optical structure is Al metal coated using the shadow mask technique. A fiber-coupled Fabry-Pérot filter is successfully realized using the fabricated structure. Experimental measurements were obtained based on a dielectric-coated optical fiber inserted into a fiber groove facing the slotted micromirror. A versatile performance in terms of the free spectral range and 3-dB bandwidth is achieved.

  14. Effect of iron catalyst thickness on vertically aligned carbon nanotube forest straightness for CNT-MEMS

    International Nuclear Information System (INIS)

    Moulton, Kellen; Jensen, Brian D; Morrill, Nicholas B; Konneker, Adam M; Vanfleet, Richard R; Allred, David D; Davis, Robert C

    2012-01-01

    This paper examines the effect of iron catalyst thickness on the straightness of growth of carbon nanotubes (CNTs) for microelectromechanical systems fabricated using the CNT-templated-microfabrication (CNT-M) process. SEM images of samples grown using various iron catalyst thicknesses show that both straight sidewalls and good edge definition are achieved using an iron thickness between 7 and 8 nm. Below this thickness, individual CNTs are well aligned, but the sidewalls of CNT forests formed into posts and long walls are not always straight. Above this thickness, the CNT forest sidewalls are relatively straight, but edge definition is poor, with significantly increased sidewall roughness. The proximity of a device or feature to other regions of iron catalyst also affects CNT growth. By using an iron catalyst thickness appropriate for straight growth, and by adding borders of iron around features or devices, a designer can greatly improve straightness of growth for CNT-MEMS. (paper)

  15. A novel multi-level IC-compatible surface microfabrication technology for MEMS with independently controlled lateral and vertical submicron transduction gaps

    Science.gov (United States)

    Cicek, Paul-Vahe; Elsayed, Mohannad; Nabki, Frederic; El-Gamal, Mourad

    2017-11-01

    An above-IC compatible multi-level MEMS surface microfabrication technology based on a silicon carbide structural layer is presented. The fabrication process flow provides optimal electrostatic transduction by allowing the creation of independently controlled submicron vertical and lateral gaps without the need for high resolution lithography. Adopting silicon carbide as the structural material, the technology ensures material, chemical and thermal compatibility with modern semiconductor nodes, reporting the lowest peak processing temperature (i.e. 200 °C) of all comparable works. This makes this process ideally suited for integrating capacitive-based MEMS directly above standard CMOS substrates. Process flow design and optimization are presented in the context of bulk-mode disk resonators, devices that are shown to exhibit improved performance with respect to previous generation flexural beam resonators, and that represent relatively complex MEMS structures. The impact of impending improvements to the fabrication technology is discussed.

  16. MEMS-based handheld scanning probe with pre-shaped input signals for distortion-free images in Gabor-domain optical coherence microscopy.

    Science.gov (United States)

    Cogliati, Andrea; Canavesi, Cristina; Hayes, Adam; Tankam, Patrice; Duma, Virgil-Florin; Santhanam, Anand; Thompson, Kevin P; Rolland, Jannick P

    2016-06-13

    High-speed scanning in optical coherence tomography (OCT) often comes with either compromises in image quality, the requirement for post-processing of the acquired images, or both. We report on distortion-free OCT volumetric imaging with a dual-axis micro-electro-mechanical system (MEMS)-based handheld imaging probe. In the context of an imaging probe with optics located between the 2D MEMS and the sample, we report in this paper on how pre-shaped open-loop input signals with tailored non-linear parts were implemented in a custom control board and, unlike the sinusoidal signals typically used for MEMS, achieved real-time distortion-free imaging without post-processing. The MEMS mirror was integrated into a compact, lightweight handheld probe. The MEMS scanner achieved a 12-fold reduction in volume and 17-fold reduction in weight over a previous dual-mirror galvanometer-based scanner. Distortion-free imaging with no post-processing with a Gabor-domain optical coherence microscope (GD-OCM) with 2 μm axial and lateral resolutions over a field of view of 1 × 1 mm2 is demonstrated experimentally through volumetric images of a regular microscopic structure, an excised human cornea, and in vivo human skin.

  17. Reconstruction of Vertical Profile of Permittivity of Layered Media which is Probed Using Vertical Differential Antenna

    Science.gov (United States)

    Pochanin, Gennadiy P.; Poyedinchuk, Anatoliy Y.; Varianytsia-Roshchupkina, Liudmyla A.; Pochanina, Iryna Ye.

    2016-04-01

    Results of this research are intended to use at GPR investigations of layered media (for example, at roads' inspection) for the processing of collected data and reconstruction of dependence of permittivity on the depth. Recently, an antenna system with a vertical differential configuration of receiving module (Patent UA81652) for GPR was suggested and developed The main advantage of the differential antennas in comparison with bistatic antennas is a high electromagnetic decoupling between the transmitting and receiving modules. The new vertical differential configuration has an additional advantage because it allows collecting GPR data reflected by layered media without any losses of information about these layers [1] and, potentially, it is a more accurate instrument for the layers thickness measurements [2]. The developed antenna system is tested in practice with the GPR at asphalt thickness measurements [3] and shown an accuracy which is better than 0.5 cm. Since this antenna system is good for sounding from above the surface (air coupled technique), the mobile laboratory was equipped with the developed GPR [3]. In order to process big set of GPR data that collected during probing at long routes of the roads, for the data processing it was tested new algorithm of the inverse problem solution. It uses a fast algorithm for calculation of electromagnetic wave diffraction by non-uniform anisotropic layers [4]. The algorithm is based on constructing a special case solution to the Riccati equation for the Cauchy problem and enables a qualitative description of the wave diffraction by the electromagnetic structure of the type within a unitary framework. At this stage as initial data we used synthetic GPR data that were obtained as results of the FDTD simulation of the problem of UWB electromagnetic impulse diffraction on layered media. Differential and bistatic antenna configurations were tested at several different profiles of permittivity. Meanings of permittivity of

  18. Field evaluation of a direct push deployed sensor probe for vertical soil water content profiling

    Science.gov (United States)

    Vienken, Thomas; Reboulet, Ed; Leven, Carsten; Kreck, Manuel; Zschornack, Ludwig; Dietrich, Peter

    2015-04-01

    Reliable high-resolution information about vertical variations in soil water content, i.e. total porosity in the saturated zone, is essential for flow and transport predictions within the subsurface. However, porosity measurements are often associated with high efforts and high uncertainties, e.g. caused by soil disturbance during sampling or sensor installation procedures. In hydrogeological practice, commonly applied tools for the investigation of vertical soil water content distribution include gravimetric laboratory analyses of soil samples and neutron probe measurements. A yet less well established technique is the use of direct push-deployed sensor probes. Each of these methods is associated with inherent advantages and limitations due to their underlying measurement principles and operation modes. The presented study describes results of a joint field evaluation of the individual methods under different depositional and hydrogeological conditions with special focus on the performance on the direct push-deployed water content profiler. Therefore, direct push-profiling results from three different test sites are compared with results obtained from gravimetric analysis of soil cores and neutron probe measurements. In direct comparison, the applied direct push-based sensor probe proved to be a suitable alternative for vertical soil water content profiling to neutron probe technology, and, in addition, proved to be advantageous over gravimetric analysis in terms vertical resolution and time efficiency. Results of this study identify application-specific limitations of the methods and thereby highlight the need for careful data evaluation, even though neutron probe measurements and gravimetric analyses of soil samples are well established techniques (see Vienken et al. 2013). Reference: Vienken, T., Reboulet, E., Leven, C., Kreck, M., Zschornack, L., Dietrich, P., 2013. Field comparison of selected methods for vertical soil water content profiling. Journal of

  19. Development of a stimuli-responsive polymer nanocomposite toward biologically optimized, MEMS-based neural probes

    International Nuclear Information System (INIS)

    Hess, A E; Zorman, C A; Capadona, J R; Tyler, D J; Shanmuganathan, K; Hsu, L; Rowan, S J; Weder, C

    2011-01-01

    This paper reports the development of micromachining processes and mechanical evaluation of a stimuli-responsive, mechanically dynamic polymer nanocomposite for biomedical microsystems. This nanocomposite consists of a cellulose nanofiber network encased in a polyvinyl acetate matrix. Micromachined tensile testing structures fabricated from the nanocomposite displayed a reversible and switchable stiffness comparable to bulk samples, with a Young's modulus of 3420 MPa when dry, reducing to ∼20 MPa when wet, and a stiff-to-flexible transition time of ∼300 s. This mechanically dynamic behavior is particularly attractive for the development of adaptive intracortical probes that are sufficiently stiff to insert into the brain without buckling, but become highly compliant upon insertion. Along these lines, a micromachined neural probe incorporating parylene insulating/moisture barrier layers and Ti/Au electrodes was fabricated from the nanocomposite using a fabrication process designed specifically for this chemical- and temperature-sensitive material. It was found that the parylene layers only slightly increased the stiffness of the probe in the wet state in spite of its much higher Young's modulus. Furthermore, the Ti/Au electrodes exhibited impedance comparable to Au electrodes on conventional substrates. Swelling of the nanocomposite was highly anisotropic favoring the thickness dimension by a factor of 8 to 12, leading to excellent adhesion between the nanocomposite and parylene layers and no discernable deformation of the probes when deployed in deionized water

  20. Development of a Micro-SPM (Scanning Probe Microscope by Post-Assembly of a MEMS-Stage and an Independent Cantilever

    Directory of Open Access Journals (Sweden)

    Zhi Li

    2007-08-01

    Full Text Available The development of miniature scanning probe microscopes (SPM on the basis of the MEMS technique has gained more and more interest. Here a novel approach is presented to realize a micro-SPM, in which by means of post-assembly a conventional cantilever is mounted onto a MEMS positioning stage and used to detect the topography variation of the surface under test. Compared with other integrated micro-SPMs, the proposed micro-SPM can maintain the lateral resolution by simply renewing its cantilever in use, and therefore features low cost, practicability and longer lifetime. Preliminary experimental results are reported, which demonstrate that the proposed microSPM can be realized.

  1. Fabrication and characterization of boron-doped nanocrystalline diamond-coated MEMS probes

    Science.gov (United States)

    Bogdanowicz, Robert; Sobaszek, Michał; Ficek, Mateusz; Kopiec, Daniel; Moczała, Magdalena; Orłowska, Karolina; Sawczak, Mirosław; Gotszalk, Teodor

    2016-04-01

    Fabrication processes of thin boron-doped nanocrystalline diamond (B-NCD) films on silicon-based micro- and nano-electromechanical structures have been investigated. B-NCD films were deposited using microwave plasma assisted chemical vapour deposition method. The variation in B-NCD morphology, structure and optical parameters was particularly investigated. The use of truncated cone-shaped substrate holder enabled to grow thin fully encapsulated nanocrystalline diamond film with a thickness of approx. 60 nm and RMS roughness of 17 nm. Raman spectra present the typical boron-doped nanocrystalline diamond line recorded at 1148 cm-1. Moreover, the change in mechanical parameters of silicon cantilevers over-coated with boron-doped diamond films was investigated with laser vibrometer. The increase of resonance to frequency of over-coated cantilever is attributed to the change in spring constant caused by B-NCD coating. Topography and electrical parameters of boron-doped diamond films were investigated by tapping mode AFM and electrical mode of AFM-Kelvin probe force microscopy (KPFM). The crystallite-grain size was recorded at 153 and 238 nm for boron-doped film and undoped, respectively. Based on the contact potential difference data from the KPFM measurements, the work function of diamond layers was estimated. For the undoped diamond films, average CPD of 650 mV and for boron-doped layer 155 mV were achieved. Based on CPD values, the values of work functions were calculated as 4.65 and 5.15 eV for doped and undoped diamond film, respectively. Boron doping increases the carrier density and the conductivity of the material and, consequently, the Fermi level.

  2. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  3. Shear-wave reflection imaging using a MEMS-based 3C landstreamer and a vertical impact source - an esker study in SW Finland

    Science.gov (United States)

    Brodic, Bojan; Malehmir, Alireza; Maries, Georgiana; Ahokangas, Elina; Mäkinen, Joni; Pasanen, Antti

    2017-04-01

    Higher resolution of S-wave seismic data compared to the P-wave ones are attractive for the researches working with the seismic methods. This is particularly true for near-surface applications due to significantly lower shear-wave velocities of unconsolidated sediments. Shear-wave imaging, however, poses certain restrictions on both source and receiver selections and also processing strategies. With three component (3C) seismic receivers becoming more affordable and used, shear-wave imaging from vertical sources is attracting more attention for near-surface applications. Theoretically, a vertical impact source will always excite both P- and S-waves although the excited S-waves are radially polarized (SV). There is an exchange of seismic energy between the vertical and radial component of the seismic wavefield. Additionally, it is theoretically accepted that there is no energy conversion or exchange from vertical into the transverse (or SH) component of the seismic wavefield, and the SH-waves can only be generated using SH sources. With the objectives of imaging esker structure (glacial sediments), water table and depth to bedrock, we conducted a seismic survey in Virttaankangas, in southwestern Finland. A bobcat-mounted vertical drop hammer (500 kg) was used as the seismic source. To obtain better source coupling, a 75×75×1.5 cm steel plate was mounted at the bottom of the hammer casing and all the hits made on this plate after placing it firmly on the ground at every shot point. For the data recording, we used a state-of-the-art comprising of 100 units, 240 m-long, 3C MEMS (micro electro-mechanical system) based seismic landstreamer developed at Uppsala University. Although the focus of the study was on the vertical component data, careful inspection of the transverse (SH) component of the raw data revealed clear shear wave reflections (normal moveout velocities ranging from 280-350 m/s at 50 m depth) on several shot gathers. This indicated potential for their

  4. Systematic characterization of a 1550 nm microelectromechanical (MEMS)-tunable vertical-cavity surface-emitting laser (VCSEL) with 7.92 THz tuning range for terahertz photomixing systems

    Science.gov (United States)

    Haidar, M. T.; Preu, S.; Cesar, J.; Paul, S.; Hajo, A. S.; Neumeyr, C.; Maune, H.; Küppers, F.

    2018-01-01

    Continuous-wave (CW) terahertz (THz) photomixing requires compact, widely tunable, mode-hop-free driving lasers. We present a single-mode microelectromechanical system (MEMS)-tunable vertical-cavity surface-emitting laser (VCSEL) featuring an electrothermal tuning range of 64 nm (7.92 THz) that exceeds the tuning range of commercially available distributed-feedback laser (DFB) diodes (˜4.8 nm) by a factor of about 13. We first review the underlying theory and perform a systematic characterization of the MEMS-VCSEL, with particular focus on the parameters relevant for THz photomixing. These parameters include mode-hop-free CW tuning with a side-mode-suppression-ratio >50 dB, a linewidth as narrow as 46.1 MHz, and wavelength and polarization stability. We conclude with a demonstration of a CW THz photomixing setup by subjecting the MEMS-VCSEL to optical beating with a DFB diode driving commercial photomixers. The achievable THz bandwidth is limited only by the employed photomixers. Once improved photomixers become available, electrothermally actuated MEMS-VCSELs should allow for a tuning range covering almost the whole THz domain with a single system.

  5. Electrical Capacitance Probe Characterization in Vertical Annular Two-Phase Flow

    Directory of Open Access Journals (Sweden)

    Grazia Monni

    2013-01-01

    Full Text Available The paper presents the experimental analysis and the characterization of an electrical capacitance probe (ECP that has been developed at the SIET Italian Company, for the measurement of two-phase flow parameters during the experimental simulation of nuclear accidents, as LOCA. The ECP is used to investigate a vertical air/water flow, characterized by void fraction higher than 95%, with mass flow rates ranging from 0.094 to 0.15 kg/s for air and from 0.002 to 0.021 kg/s for water, corresponding to an annular flow pattern. From the ECP signals, the electrode shape functions (i.e., the signals as a function of electrode distances in single- and two-phase flows are obtained. The dependence of the signal on the void fraction is derived and the liquid film thickness and the phase’s velocity are evaluated by means of rather simple models. The experimental analysis allows one to characterize the ECP, showing the advantages and the drawbacks of this technique for the two-phase flow characterization at high void fraction.

  6. Process and device for extracting a probe carrier from the lower chamber of a vertical tubular heat exchanger

    International Nuclear Information System (INIS)

    Adamoski, Andrev.

    1980-01-01

    It is necessary to check the water tubes of vertical heat exchangers used in nuclear power stations, for it is essential that the water making up the primary fluid and contaminated by nuclear reactors should not enter the secondary fluid used for actuating a turbo-generator. This checking is performed by passing a Foucault current probe through each tube. A crack or hole in the tube or even just a reduction in the thickness of the tube produces a change in the output current of the probe [fr

  7. Design and Fabrication of a Reconfigurable MEMS-Based Antenna

    KAUST Repository

    Martinez, Miguel Angel Galicia

    2011-06-22

    This thesis presents the design and fabrication of a customized in house Micro-Electro-Mechanical-Systems (MEMS) process based on-chip antenna that is both frequency and polarization reconfigurable. It is designed to work at both 60 GHz and 77 GHz through MEMS switches. This antenna can also work in both horizontal and vertical linear polarizations by utilizing a moveable plate. The design is intended for Wireless Personal Area Networks (WPAN) and automotive radar applications. Typical on-chip antennas are inefficient and difficult to reconfigure. Therefore, the focus of this work is to develop an efficient on-chip antenna solution, which is reconfigurable in frequency and in polarization. A fractal bowtie antenna is employed for this thesis, which achieves frequency reconfigurability through MEMS switches. The design is simulated in industry standard Electromagnetic (EM) simulator Ansoft HFSS. A novel concept for horizontal to vertical linear polarization agility is introduced which incorporates a moveable polymer plate. For this work, a microprobe is used to move the plate from the horizontal to vertical position. For testing purposes, a novel mechanism has been designed in order to feed the antenna with RF-probes in both horizontal and vertical positions. A simulated gain of approximately 0 dB is achieved at both target frequencies (60 and 77 GHz), in both horizontal and vertical positions. In all the cases mentioned above (both frequencies and positions), the antenna is well matched (< -10 dB) to the 50 Ω system impedance. Similarly, the radiation nulls are successfully shifted by changing the position of the antenna from horizontal to vertical. The complete design and fabrication of the reconfigurable MEMS antenna has been done at KAUST facilities. Some challenges have been encountered during its realization due to the immaturity of the customized MEMS fabrication process. Nonetheless, a first fabrication attempt has highlighted such shortcomings. According

  8. Comparison of electric dipole moments and the Large Hadron Collider for probing CP violation in triple boson vertices

    International Nuclear Information System (INIS)

    Jung, Sunghoon; Wells, James D.

    2009-01-01

    CP violation from physics beyond the standard model may reside in triple boson vertices of the electroweak theory. We review the effective theory description and discuss how CP-violating contributions to these vertices might be discerned by electric dipole moments (EDM) or diboson production at the LHC. Despite triple boson CP-violating interactions entering EDMs only at the two-loop level, we find that EDM experiments are generally more powerful than the diboson processes. To give an example to these general considerations we perform the comparison between EDMs and collider observables within supersymmetric theories that have heavy sfermions, such that substantive EDMs at the one-loop level are disallowed. EDMs generally remain more powerful probes, and next-generation EDM experiments may surpass even the most optimistic assumptions for LHC sensitivities.

  9. Study of vertical Si/SiO2 interface using laser-assisted atom probe tomography and transmission electron microscopy.

    Science.gov (United States)

    Lee, J H; Lee, B H; Kim, Y T; Kim, J J; Lee, S Y; Lee, K P; Park, C G

    2014-03-01

    Laser-assisted atom probe tomography has opened the way to three-dimensional visualization of nanostructures. However, many questions related to the laser-matter interaction remain unresolved. We demonstrate that the interface reaction can be activated by laser-assisted field evaporation and affects the quantification of the interfacial composition. At a vertical interface between Si and SiO2, a SiO2 molecule tends to combine with a Si atom and evaporate as a SiO molecule, reducing the evaporation field. The features of the reaction depend on the direction of the laser illumination and the inner structure of tip. A high concentration of SiO is observed at a vertical interface between Si and SiO2 when the Si column is positioned at the center of the tip, whereas no significant SiO is detected when the SiO2 layer is at the center. The difference in the interfacial compositions of two samples was due to preferential evaporation of the Si layer. This was explained using transmission electron microscopy observations before and after atom probe experiments. Copyright © 2013 Elsevier Ltd. All rights reserved.

  10. Horizontal and vertical structure of reactive bromine events probed by bromine monoxide MAX-DOAS

    Directory of Open Access Journals (Sweden)

    W. R. Simpson

    2017-08-01

    Full Text Available Heterogeneous photochemistry converts bromide (Br− to reactive bromine species (Br atoms and bromine monoxide, BrO that dominate Arctic springtime chemistry. This phenomenon has many impacts such as boundary-layer ozone depletion, mercury oxidation and deposition, and modification of the fate of hydrocarbon species. To study environmental controls on reactive bromine events, the BRomine, Ozone, and Mercury EXperiment (BROMEX was carried out from early March to mid-April 2012 near Barrow (Utqiaġvik, Alaska. We measured horizontal and vertical gradients in BrO with multiple-axis differential optical absorption spectroscopy (MAX-DOAS instrumentation at three sites, two mobile and one fixed. During the campaign, a large crack in the sea ice (an open lead formed pushing one instrument package ∼ 250 km downwind from Barrow (Utqiaġvik. Convection associated with the open lead converted the BrO vertical structure from a surface-based event to a lofted event downwind of the lead influence. The column abundance of BrO downwind of the re-freezing lead was comparable to upwind amounts, indicating direct reactions on frost flowers or open seawater was not a major reactive bromine source. When these three sites were separated by ∼ 30 km length scales of unbroken sea ice, the BrO amount and vertical distributions were highly correlated for most of the time, indicating the horizontal length scales of BrO events were typically larger than ∼ 30 km in the absence of sea ice features. Although BrO amount and vertical distribution were similar between sites most of the time, rapid changes in BrO with edges significantly smaller than this ∼ 30 km length scale episodically transported between the sites, indicating BrO events were large but with sharp edge contrasts. BrO was often found in shallow layers that recycled reactive bromine via heterogeneous reactions on snowpack. Episodically, these surface-based events propagated aloft when

  11. MEMS Calculator

    Science.gov (United States)

    SRD 166 MEMS Calculator (Web, free access)   This MEMS Calculator determines the following thin film properties from data taken with an optical interferometer or comparable instrument: a) residual strain from fixed-fixed beams, b) strain gradient from cantilevers, c) step heights or thicknesses from step-height test structures, and d) in-plane lengths or deflections. Then, residual stress and stress gradient calculations can be made after an optical vibrometer or comparable instrument is used to obtain Young's modulus from resonating cantilevers or fixed-fixed beams. In addition, wafer bond strength is determined from micro-chevron test structures using a material test machine.

  12. Current transport in graphene/AlGaN/GaN vertical heterostructures probed at nanoscale.

    Science.gov (United States)

    Fisichella, Gabriele; Greco, Giuseppe; Roccaforte, Fabrizio; Giannazzo, Filippo

    2014-08-07

    Vertical heterostructures combining two or more graphene (Gr) layers separated by ultra-thin insulating or semiconductor barriers represent very promising systems for next generation electronics devices, due to the combination of high speed operation with wide-range current modulation by a gate bias. They are based on the specific mechanisms of current transport between two-dimensional-electron-gases (2DEGs) in close proximity. In this context, vertical devices formed by Gr and semiconductor heterostructures hosting an "ordinary" 2DEG can be also very interesting. In this work, we investigated the vertical current transport in Gr/Al(0.25)Ga(0.75)N/GaN heterostructures, where Gr is separated from a high density 2DEG by a ∼ 24 nm thick AlGaN barrier layer. The current transport from Gr to the buried 2DEG was characterized at nanoscale using conductive atomic force microscopy (CAFM) and scanning capacitance microscopy (SCM). From these analyses, performed both on Gr/AlGaN/GaN and on AlGaN/GaN reference samples using AFM tips with different metal coatings, the Gr/AlGaN Schottky barrier height ΦB and its lateral uniformity were evaluated, as well as the variation of the carrier densities of graphene (ngr) and AlGaN/GaN 2DEG (ns) as a function of the applied bias. A low Schottky barrier (∼ 0.40 eV) with excellent spatial uniformity was found at the Gr/AlGaN interface, i.e., lower compared to the measured values for metal/AlGaN contacts, which range from ∼ 0.6 to ∼ 1.1 eV depending on the metal workfunction. The electrical behavior of the Gr/AlGaN contact has been explained by Gr interaction with AlGaN donor-like surface states located in close proximity, which are also responsible of high n-type Gr doping (∼ 1.3 × 10(13) cm(-2)). An effective modulation of ns by the Gr Schottky contact was demonstrated by capacitance analysis under reverse bias. From this basic understanding of transport properties in Gr/AlGaN/GaN heterostructures, novel vertical field effect

  13. MEMS mass-spring-damper systems using an out-of-plane suspension scheme

    KAUST Repository

    Abdel Aziz, Ahmed Kamal Said

    2014-02-04

    MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

  14. Probing the Type I Seesaw mechanism with displaced vertices at the LHC

    Energy Technology Data Exchange (ETDEWEB)

    Gago, Alberto M. [Pontificia Universidad Catolica del Peru, Seccion Fisica, Departamento de Ciencias, Lima (Peru); Hernandez, Pilar [CSIC-Universitat de Valencia, Instituto de Fisica Corpuscular (IFIC), Valencia (Spain); Jones-Perez, Joel [Pontificia Universidad Catolica del Peru, Seccion Fisica, Departamento de Ciencias, Lima (Peru); CSIC-Universitat de Valencia, Instituto de Fisica Corpuscular (IFIC), Valencia (Spain); Losada, Marta; Moreno Briceno, Alexander [Universidad Antonio Narino, Centro de Investigaciones en Ciencias Basicas y Aplicadas, Bogota, D. C. (Colombia)

    2015-10-15

    The observation of Higgs decays into heavy neutrinos would be strong evidence for new physics associated to neutrino masses. In this work we propose a search for such decays within the Type I Seesaw model in the few-GeV mass range via displaced vertices. Using 300 fb{sup -1} of integrated luminosity, at 13 TeV, we explore the region of parameter space where such decays are measurable. We show that, after imposing pseudorapidity cuts, there still exists a region where the number of events is larger than O(10). We also find that conventional triggers can greatly limit the sensitivity of our signal, so we display several relevant kinematical distributions which might aid in the optimization of a dedicated trigger selection. (orig.)

  15. Multiphysics & Parallel Kinematics Modeling of a 3DOF MEMS Mirror

    Directory of Open Access Journals (Sweden)

    Mamat N.

    2015-01-01

    Full Text Available This paper presents a modeling for a 3DoF electrothermal actuated micro-electro-mechanical (MEMS mirror used to achieve scanning for optical coherence tomography (OCT imaging. The device is integrated into an OCT endoscopic probe, it is desired that the optical scanner have small footprint for minimum invasiveness, large and flat optical aperture for large scanning range, low driving voltage and low power consumption for safety reason. With a footprint of 2mm×2mm, the MEMS scanner which is also called as Tip-Tilt-Piston micro-mirror, can perform two rotations around x and y-axis and a vertical translation along z-axis. This work develops a complete model and experimental characterization. The modeling is divided into two parts: multiphysics characterization of the actuators and parallel kinematics studies of the overall system. With proper experimental procedures, we are able to validate the model via Visual Servoing Platform (ViSP. The results give a detailed overview on the performance of the mirror platform while varying the applied voltage at a stable working frequency. The paper also presents a discussion on the MEMS control system based on several scanning trajectories.

  16. Fractal Structures For Mems Variable Capacitors

    KAUST Repository

    Elshurafa, Amro M.

    2014-08-28

    In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure, wherein the capacitor body has an upper first metal plate with a fractal shape separated by a vertical distance from a lower first metal plate with a complementary fractal shape; and a substrate above which the capacitor body is suspended.

  17. Biomaterials for MEMS

    CERN Document Server

    Chiao, Mu

    2011-01-01

    This book serves as a guide for practicing engineers, researchers, and students interested in MEMS devices that use biomaterials and biomedical applications. It is also suitable for engineers and researchers interested in MEMS and its applications but who do not have the necessary background in biomaterials.Biomaterials for MEMS highlights important features and issues of biomaterials that have been used in MEMS and biomedical areas. Hence this book is an essential guide for MEMS engineers or researchers who are trained in engineering institutes that do not provide the background or knowledge

  18. Model-Based Angular Scan Error Correction of an Electrothermally-Actuated MEMS Mirror.

    Science.gov (United States)

    Zhang, Hao; Xu, Dacheng; Zhang, Xiaoyang; Chen, Qiao; Xie, Huikai; Li, Suiqiong

    2015-12-10

    In this paper, the actuation behavior of a two-axis electrothermal MEMS (Microelectromechanical Systems) mirror typically used in miniature optical scanning probes and optical switches is investigated. The MEMS mirror consists of four thermal bimorph actuators symmetrically located at the four sides of a central mirror plate. Experiments show that an actuation characteristics difference of as much as 4.0% exists among the four actuators due to process variations, which leads to an average angular scan error of 0.03°. A mathematical model between the actuator input voltage and the mirror-plate position has been developed to predict the actuation behavior of the mirror. It is a four-input, four-output model that takes into account the thermal-mechanical coupling and the differences among the four actuators; the vertical positions of the ends of the four actuators are also monitored. Based on this model, an open-loop control method is established to achieve accurate angular scanning. This model-based open loop control has been experimentally verified and is useful for the accurate control of the mirror. With this control method, the precise actuation of the mirror solely depends on the model prediction and does not need the real-time mirror position monitoring and feedback, greatly simplifying the MEMS control system.

  19. Modularly Integrated MEMS Technology

    National Research Council Canada - National Science Library

    Eyoum, Marie-Angie N

    2006-01-01

    Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation...

  20. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    conference included a theme symposium on MEMS that spanned three days with paper presentations covering various aspects of MEMS technology. Out of all the papers presented in the symposium, we selected fifteen papers based on their reviews and other feedback and asked the authors to write the papers for ...

  1. Striping Policy as a Design Parameter for MEMS-based Storage Systems

    NARCIS (Netherlands)

    Khatib, M.G.; van der Zwaag, B.J.; van Viegen, F.C.; Smit, Gerardus Johannes Maria

    2006-01-01

    Storage devices based on MEMS (Micro-Electro-Mechanical Systems) are suitable as secondary storage for future (mobile) computer systems. They are non-volatile and execute a high level of parallelism. In a MEMS-based storage system, many (i.e., 100s or 1000s) read/write heads or probes operate

  2. Investigation of Electron Transport Across Vertically Grown CNTs Using Combination of Proximity Field Emission Microscopy and Scanning Probe Image Processing Techniques

    Science.gov (United States)

    Kolekar, Sadhu; Patole, Shashikant P.; Yoo, Ji-Beom; Dharmadhikari, Chandrakant V.

    2018-02-01

    Field emission from nanostructured films is known to be dominated by only small number of localized spots which varies with the voltage, electric field and heat treatment. It is important to develop processing methods which will produce stable and uniform emitting sites. In this paper we report a novel approach which involves analysis of Proximity Field Emission Microscopic (PFEM) images using Scanning Probe Image Processing technique. Vertically aligned carbon nanotube emitters have been deposited on tungsten foil by water assisted chemical vapor deposition. Prior to the field electron emission studies, these films were characterized by scanning electron microscopy, transmission electron microscopy, and Atomic Force Microscopy (AFM). AFM images of the samples show bristle like structure, the size of bristle varying from 80 to 300 nm. The topography images were found to exhibit strong correlation with current images. Current-Voltage (I-V) measurements both from Scanning Tunneling Microscopy and Conducting-AFM mode suggest that electron transport mechanism in imaging vertically grown CNTs is ballistic rather than usual tunneling or field emission with a junction resistance of 10 kΩ. It was found that I-V curves for field emission mode in PFEM geometry vary initially with number of I-V cycles until reproducible I-V curves are obtained. Even for reasonably stable I-V behavior the number of spots was found to increase with the voltage leading to a modified Fowler-Nordheim (F-N) behavior. A plot of ln(I/V3) versus 1/V was found to be linear. Current versus time data exhibit large fluctuation with the power spectral density obeying 1/f2 law. It is suggested that an analogue of F-N equation of the form ln(I/Vα) versus 1/V may be used for the analysis of field emission data, where α may depend on nanostructure configuration and can be determined from the dependence of emitting spots on the voltage.

  3. Investigation of Electron Transport Across Vertically Grown CNTs Using Combination of Proximity Field Emission Microscopy and Scanning Probe Image Processing Techniques

    Science.gov (United States)

    Kolekar, Sadhu; Patole, Shashikant P.; Yoo, Ji-Beom; Dharmadhikari, Chandrakant V.

    2018-03-01

    Field emission from nanostructured films is known to be dominated by only small number of localized spots which varies with the voltage, electric field and heat treatment. It is important to develop processing methods which will produce stable and uniform emitting sites. In this paper we report a novel approach which involves analysis of Proximity Field Emission Microscopic (PFEM) images using Scanning Probe Image Processing technique. Vertically aligned carbon nanotube emitters have been deposited on tungsten foil by water assisted chemical vapor deposition. Prior to the field electron emission studies, these films were characterized by scanning electron microscopy, transmission electron microscopy, and Atomic Force Microscopy (AFM). AFM images of the samples show bristle like structure, the size of bristle varying from 80 to 300 nm. The topography images were found to exhibit strong correlation with current images. Current-Voltage (I-V) measurements both from Scanning Tunneling Microscopy and Conducting-AFM mode suggest that electron transport mechanism in imaging vertically grown CNTs is ballistic rather than usual tunneling or field emission with a junction resistance of 10 kΩ. It was found that I-V curves for field emission mode in PFEM geometry vary initially with number of I-V cycles until reproducible I-V curves are obtained. Even for reasonably stable I-V behavior the number of spots was found to increase with the voltage leading to a modified Fowler-Nordheim (F-N) behavior. A plot of ln(I/V3) versus 1/V was found to be linear. Current versus time data exhibit large fluctuation with the power spectral density obeying 1/f2 law. It is suggested that an analogue of F-N equation of the form ln(I/Vα) versus 1/V may be used for the analysis of field emission data, where α may depend on nanostructure configuration and can be determined from the dependence of emitting spots on the voltage.

  4. Investigation of Electron Transport Across Vertically Grown CNTs Using Combination of Proximity Field Emission Microscopy and Scanning Probe Image Processing Techniques

    KAUST Repository

    Kolekar, Sadhu

    2018-02-26

    Field emission from nanostructured films is known to be dominated by only small number of localized spots which varies with the voltage, electric field and heat treatment. It is important to develop processing methods which will produce stable and uniform emitting sites. In this paper we report a novel approach which involves analysis of Proximity Field Emission Microscopic (PFEM) images using Scanning Probe Image Processing technique. Vertically aligned carbon nanotube emitters have been deposited on tungsten foil by water assisted chemical vapor deposition. Prior to the field electron emission studies, these films were characterized by scanning electron microscopy, transmission electron microscopy, and Atomic Force Microscopy (AFM). AFM images of the samples show bristle like structure, the size of bristle varying from 80 to 300 nm. The topography images were found to exhibit strong correlation with current images. Current–Voltage (I–V) measurements both from Scanning Tunneling Microscopy and Conducting-AFM mode suggest that electron transport mechanism in imaging vertically grown CNTs is ballistic rather than usual tunneling or field emission with a junction resistance of ~10 kΩ. It was found that I–V curves for field emission mode in PFEM geometry vary initially with number of I–V cycles until reproducible I–V curves are obtained. Even for reasonably stable I–V behavior the number of spots was found to increase with the voltage leading to a modified Fowler–Nordheim (F–N) behavior. A plot of ln(I/V3) versus 1/V was found to be linear. Current versus time data exhibit large fluctuation with the power spectral density obeying 1/f2 law. It is suggested that an analogue of F–N equation of the form ln(I/Vα) versus 1/V may be used for the analysis of field emission data, where α may depend on nanostructure configuration and can be determined from the dependence of emitting spots on the voltage.Graphical Abstract

  5. Advanced Mechatronics and MEMS Devices

    CERN Document Server

    2013-01-01

    Advanced Mechatronics and MEMS Devicesdescribes state-of-the-art MEMS devices and introduces the latest technology in electrical and mechanical microsystems. The evolution of design in microfabrication, as well as emerging issues in nanomaterials, micromachining, micromanufacturing and microassembly are all discussed at length in this volume. Advanced Mechatronics also provides a reader with knowledge of MEMS sensors array, MEMS multidimensional accelerometer, artificial skin with imbedded tactile components, as well as other topics in MEMS sensors and transducers. The book also presents a number of topics in advanced robotics and an abundance of applications of MEMS in robotics, like reconfigurable modular snake robots, magnetic MEMS robots for drug delivery and flying robots with adjustable wings, to name a few. This book also: Covers the fundamentals of advanced mechatronics and MEMS devices while also presenting new state-of-the-art methodology and technology used in the application of these devices Prese...

  6. Piezoelectric MEMS resonators

    CERN Document Server

    Piazza, Gianluca

    2017-01-01

    This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associate...

  7. EDITORIAL: International MEMS Conference 2006

    Science.gov (United States)

    Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian

    2006-04-01

    The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can

  8. MEMS direction finding acoustic sensor

    Science.gov (United States)

    Karunasiri, Gamani; Alves, Fabio; Swan, William

    2017-06-01

    Conventional directional sound sensing systems employ an array of spatially separated microphones to achieve directivity. However, there are insects such as the Ormia ochracea fly that can determine the direction of sound using a miniature hearing organ much smaller than the wavelength of sound it detects. The fly's eardrums are coupled mechanically with a separation of only 0.5 mm and yet have a remarkable sensitivity to the direction of sound. The MEMS based sensor mimicking the fly's hearing system was fabricated using an SOI substrate with a 25 μm device layer. The sensor consists of two 1.5 mm x1.6 mm wings connected in the middle by a 2.7 mm x 30 μm bridge. The entire structure is connected to the substrate by two torsional legs at the center. The frequency response of the sensor showed two resonance frequencies at approximately 1.1 kHz (rocking) and 1.5 kHz (bending). The resonance at 1.1 kHz is due to rocking of the wings by twisting the legs and the other at 1.5 kHz is due to bending of the bridge. The response of the sensor was probed electronically using comb finger capacitors integrated to the edges of the wings and with the help of an MS3110 chip. A peak output voltage of about 9V/Pa was measured for sound incident normal to the device at the resonance frequency of the bending mode. The bearing of the incident sound under these conditions could be determined to within a few degrees. These findings indicate the potential use of the MEMS sensor to locate sound sources with high accuracy.

  9. Integrated design of MEMS

    DEFF Research Database (Denmark)

    De Grave, Arnaud; Brissaud, Daniel

    2007-01-01

    . Manufacturing is mainly coming from the silicon industry. Our interest is to highlight the differences between designing MEMS and designing classical ICs or mechanical devices, to propose new methods and aided-tools supporting the design process. Our methodology is based on an ethnographic approach through...

  10. Photonic MEMS switch applications

    Science.gov (United States)

    Husain, Anis

    2001-07-01

    As carriers and service providers continue their quest for profitable network solutions, they have shifted their focus from raw bandwidth to rapid provisioning, delivery and management of revenue generating services. Inherently transparent to data rate the transmission wavelength and data format, MEMS add scalability, reliability, low power and compact size providing flexible solutions to the management and/or fiber channels in long haul, metro, and access networks. MEMS based photonic switches have gone from the lab to commercial availability and are now currently in carrier trials and volume production. 2D MEMS switches offer low up-front deployment costs while remaining scalable to large arrays. They allow for transparent, native protocol transmission. 2D switches enable rapid service turn-up and management for many existing and emerging revenue rich services such as storage connectivity, optical Ethernet, wavelength leasing and optical VPN. As the network services evolve, the larger 3D MEMS switches, which provide greater scalability and flexibility, will become economically viable to serve the ever-increasing needs.

  11. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    As a field, Microelectromechanical Systems (MEMS) has matured over the last two decades to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of ...

  12. MEMS Solar Generators

    OpenAIRE

    Grbovic, Dragoslav; Osswald, Sebastian

    2011-01-01

    Approved for public release; distribution is unlimited Using MEMS bimaterial structures to build highly efficient solar energy generators. This is a novel approach that utilizes developments in the area of bimaterial sensors and applies them in the field of solar energy harvesting.

  13. Characterization of assembled MEMS

    Science.gov (United States)

    Jandric, Zoran; Randall, John N.; Saini, Rahul; Nolan, Michael; Skidmore, George

    2005-01-01

    Zyvex is developing a low-cost high-precision method for manufacturing MEMS-based three-dimensional structures/assemblies. The assembly process relies on compliant properties of the interconnecting components. The sockets and connectors are designed to benefit from their compliant nature by allowing the mechanical component to self-align, i.e. reposition themselves to their designed, stable position, independent of the initial placement of the part by the external robot. Thus, the self-aligning property guarantees the precision of the assembled structure to be very close to, or the same, as the precision of the lithography process itself. A three-dimensional (3D) structure is achieved by inserting the connectors into the sockets through the use of a passive end-effector. We have developed the automated, high-yield, assembly procedure which permits connectors to be picked up from any location within the same die, or a separate die. This general procedure allows for the possibility to assemble parts of dissimilar materials. We have built many 3D MEMS structures, including several 3D MEMS devices such as a scanning electron microscope (SEM) micro column, mass-spectrometer column, variable optical attenuator. For these 3D MEMS structures we characterize their mechanical strength through finite element simulation, dynamic properties by finite-element analysis and experimentally with UMECH"s MEMS motion analyzer (MMA), alignment accuracy by using an in-house developed dihedral angle measurement laser autocollimator, and impact properties by performing drop tests. The details of the experimental set-ups, the measurement procedures, and the experimental data are presented in this paper.

  14. European MEMS foundries

    Science.gov (United States)

    Salomon, Patric R.

    2003-01-01

    According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.

  15. Lead salt resonant cavity enhanced detector with MEMS mirror

    Science.gov (United States)

    Felder, F.; Fill, M.; Rahim, M.; Zogg, H.; Quack, N.; Blunier, S.; Dual, J.

    2010-01-01

    We describe a tunable resonant cavity enhanced detector (RCED) for the mid-infrared employing narrow gap lead-chalcogenide (IV-VI) layers on a Si substrate. The device consists of an epitaxial Bragg reflector layer, a thin p-n+ heterojunction with PbSrTe as detecting layer and a micro-electro-mechanical system (MEMS) micromirror as second mirror. Despite the thin absorber layer the sensitivity is even higher than for a conventional detector. Tunability is achieved by changing the cavity length with a vertically movable MEMS mirror. The device may be used as miniature infrared spectrometer to cover the spectral range from 30 μm.

  16. Memória

    OpenAIRE

    Carlos Alberto Mourão Júnior; Nicole Costa Faria

    2015-01-01

    ResumoEste artigo tem como objetivo central apresentar os processos de memória de maneira didática, proporcionando aos alunos e futuros pesquisadores um primeiro contato satisfatório com o tema. Já há algum tempo, tem sido observada a ocorrência de confusões conceituais e metodológicas no campo da neurociência cognitiva, tanto em relação à memória quanto em relação às outras funções psicológicas básicas. Neste ensaio, alguns conceitos principais são esclarecidos. É apresentada uma classificaç...

  17. Introduction - MEMS Aerospace Applications

    Science.gov (United States)

    2004-02-01

    Advanced Materials and Fabrication Methods Commercial MEMS-based Products I-15 Digital Micromirrors for Sub-portable Projectors PLUS U3-880 • 2.9 lbs • 1.9...x 9” x 7” •SVGA (800 x 600) 10 um I-16 Digital Mirror Display (DMD) Texas Instruments, Inc. I-17 Micro flow-diffusion analysis system flow-diffusion

  18. Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging

    OpenAIRE

    Hamzah, A.A.; Husaini, Y.; Majlis, B.Y.; Ahmad, I.

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing); International audience; Deflection behavior of several encapsulant materials under uniform pressure was studied to determine the best encapsulant for MEMS device. Encapsulation is needed to protect movable parts of MEMS devices during high pressure transfer molded packaging process. The selected encapsulant material has to have surface deflection of less than 5 ?m under 100 atm vertical loading. Deflec...

  19. Electromagnetic actuation in MEMS switches

    DEFF Research Database (Denmark)

    Oliveira Hansen, Roana Melina de; Mátéfi-Tempfli, Mária; Chemnitz, Steffen

    . Electromagnetic actuation is a very promising approach to operate such MEMS and Power MEMS devices, due to the long range, reproducible and strong forces generated by this method, among other advantages. However, the use of electromagnetic actuation in such devices requires the use of thick magnetic films, which...

  20. Topology optimized RF MEMS switches

    DEFF Research Database (Denmark)

    Philippine, M. A.; Zareie, H.; Sigmund, Ole

    2013-01-01

    Topology optimization is a rigorous and powerful method that should become a standard MEMS design tool - it can produce unique and non-intuitive designs that meet complex objectives and can dramatically improve the performance and reliability of MEMS devices. We present successful uses of topolog...

  1. Mems cost analysis from laboratory to industry

    CERN Document Server

    Freng, Ron Lawes

    2016-01-01

    The World of MEMS; Chapter 2: Basic Fabrication Processes; Chapter 3: Surface Microengineering. High Aspect Ratio Microengineering; Chapter 5: MEMS Testing; Chapter 6: MEMS Packaging. Clean Rooms, Buildings and Plant; Chapter 8: The MEMSCOST Spreadsheet; Chapter 9: Product Costs - Accelerometers. Product Costs - Microphones. MEMS Foundries. Financial Reporting and Analysis. Conclusions.

  2. MEMS cost analysis from laboratory to industry

    CERN Document Server

    Freng, Ron Lawes

    2016-01-01

    The World of MEMS; Chapter 2: Basic Fabrication Processes; Chapter 3: Surface Microengineering. High Aspect Ratio Microengineering; Chapter 5: MEMS Testing; Chapter 6: MEMS Packaging. Clean Rooms, Buildings and Plant; Chapter 8: The MEMSCOST Spreadsheet; Chapter 9: Product Costs - Accelerometers. Product Costs - Microphones. MEMS Foundries. Financial Reporting and Analysis. Conclusions.

  3. Holographic 3D display using MEMS spatial light modulator

    Science.gov (United States)

    Takaki, Yasuhiro

    2012-06-01

    This paper presents a new holographic three-dimensional display technique that increases both viewing zone angle and screen size. In this study, a spatial light modulator (SLM) employing microelectromechanical systems (MEMS) technology is used for high-speed image generation. The images generated by the MEMS SLM are demagnified horizontally and magnified vertically using an anamorphic imaging system. The vertically enlarged images, which are elementary holograms, are aligned horizontally by a galvano scanner. Reconstructed images with a screen size of 4.3 in and a horizontal viewing zone angle of 15° are generated at a frame rate of 60 fps. The reconstructed images are improved by two methods: one reduces blur caused by scan and focus errors, and the other improves grayscale representation. In addition, accommodation responses of eyes to the reconstructed images are explained.

  4. Photoacoustic endomicroscopy based on a MEMS scanning mirror.

    Science.gov (United States)

    Guo, Heng; Song, Chaolong; Xie, Huikai; Xi, Lei

    2017-11-15

    In this Letter, we present a high-resolution photoacoustic endomicroscopy probe based on a microelectromechanical systems (MEMS) scanning mirror. The built-in optical assembly consists of a 0.7 mm graded-index (GRIN) lens for light focusing and a ϕ1  mm MEMS mirror to reflect and scan the beam. A miniaturized unfocused ultrasound transducer with a center frequency of 10 MHz is used for photoacoustic detection. Sharp blades, carbon fibers, and black tapes were utilized to evaluate the performance of the system. In vivo mouse ears and resected rectums were imaged to further demonstrate the feasibility of this probe for potential biological and clinical applications.

  5. Parylene for MEMS applications

    Science.gov (United States)

    Yao, Tze-Jung

    The goal of this thesis is to utilize Parylene, a room-temperature chemical-vapor-deposited (CVD) polymer, for MicroElectroMechanical Systems (MEMS) applications. The identified unique properties of Parylene are used to fabricate various micromachining devices such as thermopneumatic microvalve, in-channel microflow restrictor, and electret microphones. First, the properties of Parylene as a MEMS material are reviewed. The electrical, thermal, surface, and mechanical properties are first compared with that of other materials and further studied specifically for MEMS applications. The high dielectric strength (determined as 250V/mum) of Parylene makes it suitable for use as an electrical insulation material. However, its high resistivity causes un-desired charging effects first described in polymer-based electrostatic devices. The undesired high pull-in voltage, "bounce-back," and "snap-down" effects caused by dielectric charging are studied. Second, to make Parylene as a surface-micromachined material, a process that overcomes the stiction problem has to be developed. Thus, a new technique that combines wet-acetone dissolution and dry BrF3 dry etching has developed to overcome the stiction problem, which prevents Parylene microstructures from freestanding. The devices of mm*mm size with high yield are demonstrated using this technology. A thermopneumatic microvalve with a corrugated silicone/Parylene composite membrane is designed, fabricated, and tested for gas flows of several slpm and inlet pressures of tens of psi. The lowest power consumption to turn off the gas flow is determined to be 73mW. A silicone-based microfluidic coupler, initially designed for microvalve packaging, is also demonstrated for its ability to connect the external macrofluidic world to microfluidic devices. The demonstrated "quick-connect" microfluidic coupler has low leakage, is reusable, and can maintain good seal up to 60 psi. An in-channel microflow restrictor is also demonstrated with

  6. Ovenized microelectromechanical system (MEMS) resonator

    Science.gov (United States)

    Olsson, Roy H; Wojciechowski, Kenneth; Kim, Bongsang

    2014-03-11

    An ovenized micro-electro-mechanical system (MEMS) resonator including: a substantially thermally isolated mechanical resonator cavity; a mechanical oscillator coupled to the mechanical resonator cavity; and a heating element formed on the mechanical resonator cavity.

  7. Optically transduced MEMS magnetometer

    Science.gov (United States)

    Nielson, Gregory N; Langlois, Eric

    2014-03-18

    MEMS magnetometers with optically transduced resonator displacement are described herein. Improved sensitivity, crosstalk reduction, and extended dynamic range may be achieved with devices including a deflectable resonator suspended from the support, a first grating extending from the support and disposed over the resonator, a pair of drive electrodes to drive an alternating current through the resonator, and a second grating in the resonator overlapping the first grating to form a multi-layer grating having apertures that vary dimensionally in response to deflection occurring as the resonator mechanically resonates in a plane parallel to the first grating in the presence of a magnetic field as a function of the Lorentz force resulting from the alternating current. A plurality of such multi-layer gratings may be disposed across a length of the resonator to provide greater dynamic range and/or accommodate fabrication tolerances.

  8. MEMS digital parametric loudspeaker

    KAUST Repository

    Carreno, Armando Arpys Arevalo

    2016-03-23

    This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

  9. Effects of Radiation on MEMS

    OpenAIRE

    Shea, Herbert

    2011-01-01

    The sensitivity of MEMS devices to radiation is reviewed, with an emphasis on radiation levels representative of space missions. While silicon and metals generally do not show mechanical degradation at the radiation levels encountered in most missions, MEMS devices have been reported to fail at doses of as few krad, corresponding to less than one year in most orbits. Radiation sensitivity is linked primarily to the impact on device operation of radiation-induced trapped charge in dielectrics...

  10. Characterization of MEMS FTIR spectrometer

    Science.gov (United States)

    Khalil, Diaa; Sabry, Yasser; Omran, Haitham; Medhat, Mostafa; Hafez, Amr; Saadany, Bassam

    2011-03-01

    In this work we present the full characterization of an optical MEMS Fourier Transform Infra Red FTIR spectrometer fabricated by Deep Reactive Ion Etching DRIE Technology on Silicon substrate. Both electrical and optical properties of the spectrometer are measured. The presented techniques allows to build an engineering model for the spectrometer and to predict its main specifications taking into account the specificity of the MEMS technology used in the spectrometer fabrication.

  11. MEMS for automotive and aerospace applications

    CERN Document Server

    Kraft, Michael

    2013-01-01

    MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for

  12. Piezoelectric MEMS: Ferroelectric thin films for MEMS applications

    Science.gov (United States)

    Kanno, Isaku

    2018-04-01

    In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.

  13. CMOS MEMS Fabrication Technologies and Devices

    Directory of Open Access Journals (Sweden)

    Hongwei Qu

    2016-01-01

    Full Text Available This paper reviews CMOS (complementary metal-oxide-semiconductor MEMS (micro-electro-mechanical systems fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator CMOS MEMS are introduced separately. Introduction of associated devices follows the description of the respective CMOS MEMS technologies. Due to the vast array of CMOS MEMS devices, this review focuses only on the most typical MEMS sensors and actuators including pressure sensors, inertial sensors, frequency reference devices and actuators utilizing different physics effects and the fabrication processes introduced. Moreover, the incorporation of MEMS and CMOS is limited to monolithic integration, meaning wafer-bonding-based stacking and other integration approaches, despite their advantages, are excluded from the discussion. Both competitive industrial products and state-of-the-art research results on CMOS MEMS are covered.

  14. Conceptual MEMS Devices for a Redeployable Antenna

    National Research Council Canada - National Science Library

    Miller, Virginia

    2007-01-01

    Micro-Electro-Mechanical Systems (MEMS) are becoming an integral part of our lives through a wide range of applications, including MEMS accelerators for air bag deployment in vehicles, micromirrors in projection devices, and various...

  15. Triaxial MEMS accelerometer with screen printed PZT thick film

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Almind, Ninia Sejersen; Brodersen, Simon Hedegaard

    2010-01-01

    Piezoelectric thick films have increasing interest due to the potential high sensitivity and actuation force for MEMS sensors and actuators. The screen printing technique is a promising deposition technique for realizing piezoelectric thick films in the thickness range from 10-100 mu m....... In this work integration of a screen printed piezoelectric PZT thick film with silicon MEMS technology is shown. A high bandwidth triaxial accelerometer has been designed, fabricated and characterized. The voltage sensitivity is 0.31 mV/g in the vertical direction, 0.062 mV/g in the horizontal direction...... and the first mode resonance frequency is 11 kHz. A Finite Element Method (FEM) model is used to validate the measured sensitivity and resonance frequency. Good agreement between the model and the measurements is seen....

  16. Recent development of micropore optics using MEMS technologies

    Science.gov (United States)

    Ezoe, Yuichiro; Koshiishi, Masaki; Mita, Makoto; Mitsuda, Kazuhisa; Ishisaki, Yoshitaka; Hoshino, Akio; Yang, Zhen; Takano, Takayuki; Mekaru, Harutaka; Maeda, Ryutaro

    2006-06-01

    Recent development of the extremely light-weight micro pore optics based on the semiconductor MEMS (Micro Electro Mechanical System) technologies is reported. Anisotropic chemical wet etching of silicon (110) wafers were utilized, in order to obtain a row of smooth (111) side walls vertical to the wafer face and to use them as X-ray mirrors. To obtain high performance mirrors with smooth surfaces and a high aspect ratio, several modifications were made to our previous manufacturing process shown in Ezoe et al. (2005). After these improvements, smooth surfaces with rms roughness of the order of angstroms and also a high aspect ratio of 20 were achieved. Furthermore, a single-stage optic was designed as a first step to multi-stage optics. A mounting device and a slit device for the sample optic were fabricated fully using the MEMS technologies and evaluated.

  17. Microelectromechanical (MEM) thermal actuator

    Science.gov (United States)

    Garcia, Ernest J [Albuquerque, NM; Fulcher, Clay W. G. [Sandia Park, NM

    2012-07-31

    Microelectromechanical (MEM) buckling beam thermal actuators are disclosed wherein the buckling direction of a beam is constrained to a desired direction of actuation, which can be in-plane or out-of-plane with respect to a support substrate. The actuators comprise as-fabricated, linear beams of uniform cross section supported above the substrate by supports which rigidly attach a beam to the substrate. The beams can be heated by methods including the passage of an electrical current through them. The buckling direction of an initially straight beam upon heating and expansion is controlled by incorporating one or more directional constraints attached to the substrate and proximal to the mid-point of the beam. In the event that the beam initially buckles in an undesired direction, deformation of the beam induced by contact with a directional constraint generates an opposing force to re-direct the buckling beam into the desired direction. The displacement and force generated by the movement of the buckling beam can be harnessed to perform useful work, such as closing contacts in an electrical switch.

  18. Modeling nonlinearities in MEMS oscillators.

    Science.gov (United States)

    Agrawal, Deepak K; Woodhouse, Jim; Seshia, Ashwin A

    2013-08-01

    We present a mathematical model of a microelectromechanical system (MEMS) oscillator that integrates the nonlinearities of the MEMS resonator and the oscillator circuitry in a single numerical modeling environment. This is achieved by transforming the conventional nonlinear mechanical model into the electrical domain while simultaneously considering the prominent nonlinearities of the resonator. The proposed nonlinear electrical model is validated by comparing the simulated amplitude-frequency response with measurements on an open-loop electrically addressed flexural silicon MEMS resonator driven to large motional amplitudes. Next, the essential nonlinearities in the oscillator circuit are investigated and a mathematical model of a MEMS oscillator is proposed that integrates the nonlinearities of the resonator. The concept is illustrated for MEMS transimpedance-amplifier- based square-wave and sine-wave oscillators. Closed-form expressions of steady-state output power and output frequency are derived for both oscillator models and compared with experimental and simulation results, with a good match in the predicted trends in all three cases.

  19. Structured synthesis of MEMS using evolutionary approaches

    DEFF Research Database (Denmark)

    Fan, Zhun; Wang, Jiachuan; Achiche, Sofiane

    2008-01-01

    In this paper, we discuss the hierarchy that is involved in a typical MEMS design and how evolutionary approaches can be used to automate the hierarchical synthesis process for MEMS. The paper first introduces the flow of a structured MEMS design process and emphasizes that system-level lumped...... the integrated design automation idea using these evolutionary approaches....

  20. Electrostatic MEMS devices with high reliability

    Science.gov (United States)

    Goldsmith, Charles L; Auciello, Orlando H; Sumant, Anirudha V; Mancini, Derrick C; Gudeman, Chris; Sampath, Suresh; Carlilse, John A; Carpick, Robert W; Hwang, James

    2015-02-24

    The present invention provides for an electrostatic microelectromechanical (MEMS) device comprising a dielectric layer separating a first conductor and a second conductor. The first conductor is moveable towards the second conductor, when a voltage is applied to the MEMS device. The dielectric layer recovers from dielectric charging failure almost immediately upon removal of the voltage from the MEMS device.

  1. A six degrees of freedom mems manipulator

    NARCIS (Netherlands)

    de Jong, B.R.

    2006-01-01

    This thesis reports about a six degrees of freedom (DOF) precision manipulator in MEMS, concerning concept generation for the manipulator followed by design and fabrication (of parts) of the proposed manipulation concept in MEMS. Researching the abilities of 6 DOF precision manipulation in MEMS is

  2. Resonant MEMS tunable VCSEL

    DEFF Research Database (Denmark)

    Ansbæk, Thor; Chung, Il-Sug; Semenova, Elizaveta

    2013-01-01

    We demonstrate how resonant excitation of a microelectro-mechanical system can be used to increase the tuning range of a vertical-cavity surface-emitting laser two-fold by enabling both blue- and red-shifting of the wavelength. In this way a short-cavity design enabling wide tuning range can be r...

  3. Vertical Bisimulation

    NARCIS (Netherlands)

    Rensink, Arend; Gorrieri, Roberto

    We investigate criteria to relate specifications and implementations belonging to conceptually different abstraction levels, and propose vertical bisimulation as a candidate relation for this purpose. Vertical bisimulation is indexed by a function mapping abstract actions onto concrete processes,

  4. MEMS linear and nonlinear statics and dynamics

    CERN Document Server

    Younis, Mohammad I

    2011-01-01

    MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of nume

  5. Of light, of MEMS: Optical MEMS in telecommunications and beyond

    Indian Academy of Sciences (India)

    Abstract. The burst of the Internet bubble in 2000 has severely quenched the pace of development in the optical MEMS field. However, it is now clear that this field is again set to move forward as not only telecommunication but many other industries are benefiting from its application. We describe in this paper some of.

  6. Modeling of rf MEMS switches

    Science.gov (United States)

    Robertson, Barbara; Ho, Fat D.; Hudson, Tracy D.

    2001-10-01

    The microelectromechanical system (MEMS) switch offers many benefits in radio frequency (RF) applications. These benefits include low insertion loss, high quality factor (Q), low power, RF isolation, and low cost. The ability to manufacture mechanical switches on a chip with electronics can lead to higher functionality, such as single-chip arrays, and smart switches. The MEMS switch is also used as a building block in devices such as phase shifters, filters, and switchable antenna elements. The MEMS designer needs models of these basic elements in order to incorporate them into their applications. The objective of this effort is to develop lumped element models for MEMS RF switches, which are incorporated into a CAD software. Tanner Research Inc.'s Electronic Design Automation (EDA) software is being used to develop a suite of mixed-signal RF switch models. The suite will include switches made from cantilever beams and fixed-fixed beams. The switches may be actuated by electrostatic, piezoelectric or electromagnetic forces. The effort presented in this paper concentrates on switches actuated by electrostatic forces. The lumped element models use a current-force electrical-mechanical analogy. Finite element modeling and device testing will be used to verify the Tanner models. The effects of materials, geometries, temperature, fringing fields, and mounting geometries are considered.

  7. MEMS AO for Planet Finding

    Science.gov (United States)

    Rao, Shanti; Wallace, J. Kent; Shao, Mike; Schmidtlin, Edouard; Levine, B. Martin; Samuele, Rocco; Lane, Benjamin; Chakrabarti, Supriya; Cook, Timothy; Hicks, Brian; hide

    2008-01-01

    This slide presentation reviews a method for planet finding using microelectromechanical systems (MEMS) Adaptive Optics (AO). The use of a deformable mirror (DM) is described as a part of the instrument that was designed with a nulling interferometer. The strategy that is used is described in detail.

  8. Resonant biaxial 7-mm MEMS mirror for omnidirectional scanning

    Science.gov (United States)

    Hofmann, U.; Aikio, M.; Janes, J.; Senger, F.; Stenchly, V.; Weiss, M.; Quenzer, H.-J.; Wagner, B.; Benecke, W.

    2013-03-01

    Low-cost automotive laser scanners for environment perception are needed to enable the integration of advanced driver assistant systems (ADAS) into all automotive vehicle segments, a key to reducing the number of traffic accidents on roads. An omnidirectional 360 degree laser scanning concept has been developed based on combination of an omnidirectional lens and a biaxial large aperture MEMS mirror. This omnidirectional scanning concept is the core of a small sized low-cost time-of-flight based range sensor development. This paper describes concept, design, fabrication and first measurement results of a resonant biaxial 7mm gimbal-less MEMS mirror that is electrostatically actuated by stacked vertical comb drives. Identical frequencies of the two resonant axes are necessary to enable the required circle scanning capability. A tripod suspension was chosen since it allows minimizing the frequency splitting of the two resonant axes. Low mirror curvature is achieved by a thickness of the mirror of more than 500 μm. Hermetic wafer level vacuum packaging of such large mirrors based on multiple wafer bonding has been developed to enable to achieve a large mechanical tilt angle of +/- 6.5 degrees in each axis. The 7mm-MEMS mirror demonstrates large angle circular scanning at 1.5kHz.

  9. Computer-Aided Design (CAD) for Integrated Microelectromechanical (MEMS) Devices

    National Research Council Canada - National Science Library

    Judy, Michael

    2002-01-01

    The objective of this "CAD for Integrated MEMS Devices" research project was to develop MEMS CAD design and development tools that would facilitate the creation of behavioral models for complex MEMS devices...

  10. Integration of a MEMS Inertial Measuring Unit with a MEMS Magnetometer for 3D Orientation Estimation

    DEFF Research Database (Denmark)

    Cai, Junping; Malureanu, Christian; Andersen, Niels Lervad

    2011-01-01

    This paper presents an algorithm for combining the measurements of a MEMS Inertial Measurement Unit (IMU) and a MEMS magnetometer. The measurements are done using a special designed and customized miniature detecting system for 3D orientation estimation, and position tracking......This paper presents an algorithm for combining the measurements of a MEMS Inertial Measurement Unit (IMU) and a MEMS magnetometer. The measurements are done using a special designed and customized miniature detecting system for 3D orientation estimation, and position tracking...

  11. Miniaturized GPS/MEMS IMU integrated board

    Science.gov (United States)

    Lin, Ching-Fang (Inventor)

    2012-01-01

    This invention documents the efforts on the research and development of a miniaturized GPS/MEMS IMU integrated navigation system. A miniaturized GPS/MEMS IMU integrated navigation system is presented; Laser Dynamic Range Imager (LDRI) based alignment algorithm for space applications is discussed. Two navigation cameras are also included to measure the range and range rate which can be integrated into the GPS/MEMS IMU system to enhance the navigation solution.

  12. Wafer level packaging of MEMS

    International Nuclear Information System (INIS)

    Esashi, Masayoshi

    2008-01-01

    Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

  13. Cryogenic MEMS Technology for Sensing Applications Project

    Data.gov (United States)

    National Aeronautics and Space Administration — The development of cryogenic microwave components, such as focal plane polarization modulators, first requires an RF MEMS switching technology that operates...

  14. MEMS Bragg grating force sensor

    DEFF Research Database (Denmark)

    Reck, Kasper; Thomsen, Erik Vilain; Hansen, Ole

    2011-01-01

    We present modeling, design, fabrication and characterization of a new type of all-optical frequency modulated MEMS force sensor based on a mechanically amplified double clamped waveguide beam structure with integrated Bragg grating. The sensor is ideally suited for force measurements in harsh...... environments and for remote and distributed sensing and has a measured sensitivity of -14 nm/N, which is several times higher than what is obtained in conventional fiber Bragg grating force sensors. © 2011 Optical Society of America....

  15. Large area MEMS based ultrasound device for cancer detection

    International Nuclear Information System (INIS)

    Wodnicki, Robert; Thomenius, Kai; Ming Hooi, Fong; Sinha, Sumedha P.; Carson, Paul L.; Lin Dersong; Zhuang Xuefeng; Khuri-Yakub, Pierre; Woychik, Charles

    2011-01-01

    We present image results obtained using a prototype ultrasound array that demonstrates the fundamental architecture for a large area MEMS based ultrasound device for detection of breast cancer. The prototype array consists of a tiling of capacitive Micromachined Ultrasound Transducers (cMUTs) that have been flip-chip attached to a rigid organic substrate. The pitch on the cMUT elements is 185 μm and the operating frequency is nominally 9 MHz. The spatial resolution of the new probe is comparable to those of production PZT probes; however the sensitivity is reduced by conditions that should be correctable. Simulated opposed-view image registration and Speed of Sound volume reconstruction results for ultrasound in the mammographic geometry are also presented.

  16. Large area MEMS based ultrasound device for cancer detection

    Science.gov (United States)

    Wodnicki, Robert; Thomenius, Kai; Ming Hooi, Fong; Sinha, Sumedha P.; Carson, Paul L.; Lin, Der-Song; Zhuang, Xuefeng; Khuri-Yakub, Pierre; Woychik, Charles

    2011-08-01

    We present image results obtained using a prototype ultrasound array that demonstrates the fundamental architecture for a large area MEMS based ultrasound device for detection of breast cancer. The prototype array consists of a tiling of capacitive Micromachined Ultrasound Transducers (cMUTs) that have been flip-chip attached to a rigid organic substrate. The pitch on the cMUT elements is 185 μm and the operating frequency is nominally 9 MHz. The spatial resolution of the new probe is comparable to those of production PZT probes; however the sensitivity is reduced by conditions that should be correctable. Simulated opposed-view image registration and Speed of Sound volume reconstruction results for ultrasound in the mammographic geometry are also presented.

  17. Large area MEMS based ultrasound device for cancer detection

    Energy Technology Data Exchange (ETDEWEB)

    Wodnicki, Robert, E-mail: wodnicki@research.ge.com [GE Global Research, 1 Research Circle, Niskayuna, NY 12309 (United States); Thomenius, Kai [GE Global Research, 1 Research Circle, Niskayuna, NY 12309 (United States); Ming Hooi, Fong; Sinha, Sumedha P.; Carson, Paul L. [Radiology and Biomedical Engineering, University of Michigan, Ann Arbor, MI 48109 (United States); Lin Dersong; Zhuang Xuefeng; Khuri-Yakub, Pierre [Department of Electrical Engineering, Stanford University, Stanford, CA 94309 (United States); Woychik, Charles [GE Global Research, 1 Research Circle, Niskayuna, NY 12309 (United States)

    2011-08-21

    We present image results obtained using a prototype ultrasound array that demonstrates the fundamental architecture for a large area MEMS based ultrasound device for detection of breast cancer. The prototype array consists of a tiling of capacitive Micromachined Ultrasound Transducers (cMUTs) that have been flip-chip attached to a rigid organic substrate. The pitch on the cMUT elements is 185 {mu}m and the operating frequency is nominally 9 MHz. The spatial resolution of the new probe is comparable to those of production PZT probes; however the sensitivity is reduced by conditions that should be correctable. Simulated opposed-view image registration and Speed of Sound volume reconstruction results for ultrasound in the mammographic geometry are also presented.

  18. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  19. Mobile Probing and Probes

    DEFF Research Database (Denmark)

    Duvaa, Uffe; Ørngreen, Rikke; Weinkouff, Anne-Gitte

    2012-01-01

    Mobile probing is a method, which has been developed for learning about digital work situations, as an approach to discover new grounds. The method can be used when there is a need to know more about users and their work with certain tasks, but where users at the same time are distributed (in time...... and space). Mobile probing was inspired by the cultural probe method, and was influenced by qualitative interview and inquiry approaches. The method has been used in two subsequent projects, involving school children (young adults at 15-17 years old) and employees (adults) in a consultancy company. Findings...... point to mobile probing being a flexible method for uncovering the unknowns, as a way of getting rich data to the analysis and design phases. On the other hand it is difficult to engage users to give in depth explanations, which seem easier in synchronous dialogs (whether online or face2face...

  20. Mobile Probing and Probes

    DEFF Research Database (Denmark)

    Duvaa, Uffe; Ørngreen, Rikke; Weinkouff Mathiasen, Anne-Gitte

    2013-01-01

    Mobile probing is a method, developed for learning about digital work situations, as an approach to discover new grounds. The method can be used when there is a need to know more about users and their work with certain tasks, but where users at the same time are distributed (in time and space......). Mobile probing was inspired by the cultural probe method, and was influenced by qualitative interview and inquiry approaches. The method has been used in two subsequent projects, involving school children (young adults at 15-17 years old) and employees (adults) in a consultancy company. Findings point...... to mobile probing being a flexible method for uncovering the unknowns, as a way of getting rich data to the analysis and design phases. On the other hand it is difficult to engage users to give in depth explanations, which seem easier in synchronous dialogs (whether online or face2face). The development...

  1. Miniaturized probe based on a microelectromechanical system mirror for multiphoton microscopy.

    Science.gov (United States)

    Jung, Woonggyu; Tang, Suo; McCormic, Daniel T; Xie, Tiquiang; Ahn, Yeh-Chan; Su, Jianping; Tomov, Ivan V; Krasieva, Tatiana B; Tromberg, Bruce J; Chen, Zhongping

    2008-06-15

    A factor that limits the use of multiphoton microscopy (MPM) in clinical and preclinical studies is the lack of a compact and flexible probe. We report on a miniaturized MPM probe employing a microelectromechanical system (MEMS) scanning mirror and a double-clad photonic crystal fiber (DCPCF). The use of a MEMS mirror and a DCPCF provides many advantages, such as size reduction, rapid and precise scanning, efficient delivery of short pulses, and high collection efficiency of fluorescent signals. The completed probe was 1 cm in outer diameter and 14 cm in length. The developed probe was integrated into an MPM system and used to image fluorescent beads, paper, and biological specimens.

  2. Advanced ultrasound probes for medical imaging

    Science.gov (United States)

    Wildes, Douglas G.; Smith, L. Scott

    2012-05-01

    New medical ultrasound probe architectures and materials build upon established 1D phased array technology and provide improved imaging performance and clinical value. Technologies reviewed include 1.25D and 1.5D arrays for elevation slice thickness control; electro-mechanical and 2D array probes for real-time 3D imaging; catheter probes for imaging during minimally-invasive procedures; single-crystal piezoelectric materials for greater frequency bandwidth; and cMUT arrays using silicon MEMS in place of piezo materials.

  3. Direction Finding Using Multiple MEMS Acoustic Sensors

    Science.gov (United States)

    2015-09-01

    MEMS ACOUSTIC SENSORS by Daniel Wilmott September 2015 Thesis Advisor: Gamani Karunasiri Co-Advisor: Fabio Alves THIS PAGE INTENTIONALLY LEFT......resonance over an angular range of 120° with a maximum uncertainty of 3.4°. 14. SUBJECT TERMS MEMS , direction finding, Ormia ochracea, acoustic sensor

  4. Listening to MEMS : An acoustic vibrometer

    NARCIS (Netherlands)

    Yntema, Doekle Reinder; Haneveld, J.; Engelen, Johannes Bernardus Charles; Brookhuis, Robert Anton; Sanders, Remco G.P.; Wiegerink, Remco J.; Elwenspoek, Michael Curt

    2010-01-01

    new way to characterize vibrating MEMS devices is presented. Using an acoustic particle velocity sensor the coupled sound field is measured, which is a measure for the movement of the MEMS device. We present several possible applications of this measurement method. It can be used as a read-out

  5. A Teaching - Learning Framework for MEMS Education

    International Nuclear Information System (INIS)

    Sheeparamatti, B G; Angadi, S A; Sheeparamatti, R B; Kadadevaramath, J S

    2006-01-01

    Micro-Electro-Mechanical Systems (MEMS) technology has been identified as one of the most promising technologies in the 21st century. MEMS technology has opened up a wide array of unforeseen applications. Hence it is necessary to train the technocrats of tomorrow in this emerging field to meet the industrial/societal demands. The drive behind fostering of MEMS technology is the reduction in the cost, size, weight, and power consumption of the sensors, actuators, and associated electronics. MEMS is a multidisciplinary engineering and basic science area which includes electrical engineering, mechanical engineering, material science and biomedical engineering. Hence MEMS education needs a special approach to prepare the technocrats for a career in MEMS. The modern education methodology using computer based training systems (CBTS) with embedded modeling and simulation tools will help in this direction. The availability of computer based learning resources such as MATLAB, ANSYS/Multiphysics and rapid prototyping tools have contributed to proposition of an efficient teaching-learning framework for MEMS education presented in this paper. This paper proposes a conceptual framework for teaching/learning MEMS in the current technical education scenario

  6. Optical MEMS for Earth observation

    Science.gov (United States)

    Liotard, Arnaud; Viard, Thierry; Noell, Wilfried; Zamkotsian, Frédéric; Freire, Marco; Guldimann, Benedikt; Kraft, Stefan

    2017-11-01

    Due to the relatively large number of optical Earth Observation missions at ESA, this area is interesting for new space technology developments. In addition to their compactness, scalability and specific task customization, optical MEMS could generate new functions not available with current technologies and are thus candidates for the design of future space instruments. Most mature components for space applications are the digital mirror arrays, the micro-deformable mirrors, the programmable micro diffraction gratings and tiltable micromirrors. A first selection of market-pull and techno-push concepts is done. In addition, some concepts are coming from outside Earth Observation. Finally two concepts are more deeply analyzed. The first concept is a programmable slit for straylight control for space spectro-imagers. This instrument is a push-broom spectroimager for which some images cannot be exploited because of bright sources in the field-of-view. The proposed concept consists in replacing the current entrance spectrometer slit by an active row of micro-mirrors. The MEMS will permit to dynamically remove the bright sources and then to obtain a field-of-view with an optically enhanced signal-to-noise ratio. The second concept is a push-broom imager for which the acquired spectrum can be tuned by optical MEMS. This system is composed of two diffractive elements and a digital mirror array. The first diffractive element spreads the spectrum. A micromirror array is set at the location of the spectral focal plane. By putting the micro-mirrors ON or OFF, we can select parts of field-of-view or spectrum. The second diffractive element then recombines the light on a push-broom detector. Dichroics filters, strip filter, band-pass filter could be replaced by a unique instrument.

  7. Programmable Aperture with MEMS Microshutter Arrays

    Science.gov (United States)

    Moseley, Samuel; Li, Mary; Kutyrev, Alexander; Kletetschka, Gunther; Fettig, Rainer

    2011-01-01

    A microshutter array (MSA) has been developed for use as an aperture array for multi-object selections in James Webb Space Telescope (JWST) technology. Light shields, molybdenum nitride (MoN) coating on shutters, and aluminum/aluminum oxide coatings on interior walls are put on each shutter for light leak prevention, and to enhance optical contrast. Individual shutters are patterned with a torsion flexure that permits shutters to open 90 deg. with a minimized mechanical stress concentration. The shutters are actuated magnetically, latched, and addressed electrostatically. Also, micromechanical features are tailored onto individual shutters to prevent stiction. An individual shutter consists of a torsion hinge, a shutter blade, a front electrode that is coated on the shutter blade, a backside electrode that is coated on the interior walls, and a magnetic cobalt-iron coating. The magnetic coating is patterned into stripes on microshutters so that shutters can respond to an external magnetic field for the magnetic actuation. A set of column electrodes is placed on top of shutters, and a set of row electrodes on sidewalls is underneath the shutters so that they can be electrostatically latched open. A linear permanent magnet is aligned with the shutter rows and is positioned above a flipped upside-down array, and sweeps across the array in a direction parallel to shutter columns. As the magnet sweeps across the array, sequential rows of shutters are rotated from their natural horizontal orientation to a vertical open position, where they approach vertical electrodes on the sidewalls. When the electrodes are biased with a sufficient electrostatic force to overcome the mechanical restoring force of torsion bars, shutters remain latched to vertical electrodes in their open state. When the bias is removed, or is insufficient, the shutters return to their horizontal, closed positions. To release a shutter, both the electrode on the shutter and the one on the back wall where

  8. Development of MEMS photoacoustic spectroscopy

    Energy Technology Data Exchange (ETDEWEB)

    Robinson, Alex Lockwood; Eichenfield, Matthew S.; Griffin, Benjamin; Harvey, Heidi Alyssa; Nielson, Gregory N.; Okandan, Murat; Langlois, Eric; Resnick, Paul James; Shaw, Michael J.; Young, Ian; Givler, Richard C.; Reinke, Charles M.

    2014-01-01

    After years in the field, many materials suffer degradation, off-gassing, and chemical changes causing build-up of measurable chemical atmospheres. Stand-alone embedded chemical sensors are typically limited in specificity, require electrical lines, and/or calibration drift makes data reliability questionable. Along with size, these "Achilles' heels" have prevented incorporation of gas sensing into sealed, hazardous locations which would highly benefit from in-situ analysis. We report on development of an all-optical, mid-IR, fiber-optic based MEMS Photoacoustic Spectroscopy solution to address these limitations. Concurrent modeling and computational simulation are used to guide hardware design and implementation.

  9. Micro electromechanical systems (MEMS) for mechanical engineers

    Energy Technology Data Exchange (ETDEWEB)

    Lee, A. P., LLNL

    1996-11-18

    The ongoing advances in Microelectromechanical Systems (MEMS) are providing man-kind the freedom to travel to dimensional spaces never before conceivable. Advances include new fabrication processes, new materials, tailored modeling tools, new fabrication machines, systems integration, and more detailed studies of physics and surface chemistry as applied to the micro scale. In the ten years since its inauguration, MEMS technology is penetrating industries of automobile, healthcare, biotechnology, sports/entertainment, measurement systems, data storage, photonics/optics, computer, aerospace, precision instruments/robotics, and environment monitoring. It is projected that by the turn of the century, MEMS will impact every individual in the industrial world, totaling sales up to $14 billion (source: System Planning Corp.). MEMS programs in major universities have spawned up all over the United States, preparing the brain-power and expertise for the next wave of MEMS breakthroughs. It should be pointed out that although MEMS has been initiated by electrical engineering researchers through the involvement of IC fabrication techniques, today it has evolved such that it requires a totally multi-disciplinary team to develop useful devices. Mechanical engineers are especially crucial to the success of MEMS development, since 90% of the physical realm involved is mechanical. Mechanical engineers are needed for the design of MEMS, the analysis of the mechanical system, the design of testing apparatus, the implementation of analytical tools, and the packaging process. Every single aspect of mechanical engineering is being utilized in the MEMS field today, however, the impact could be more substantial if more mechanical engineers are involved in the systems level designing. In this paper, an attempt is made to create the pathways for a mechanical engineer to enter in the MEMS field. Examples of application in optics and medical devices will be used to illustrate how mechanical

  10. Vertical Implementation

    NARCIS (Netherlands)

    Rensink, Arend; Gorrieri, Roberto

    2001-01-01

    We investigate criteria to relate specifications and implementations belonging to conceptually different levels of abstraction. For this purpose, we introduce the generic concept of a vertical implementation relation, which is a family of binary relations indexed by a refinement function that maps

  11. Optical-fiber-interconnected MEMS sensors and actuators

    Science.gov (United States)

    Miller, Michael B.; Meller, Scott A.; Wavering, Thomas A.; Greene, Jonathan A.; Murphy, Kent A.

    1998-07-01

    Microelectromechanical systems or MEMS are miniature devices that have several advantages over conventional sensing and actuating technology. MEMS devices benefit form well developed integrated circuit production methods which ensure high volume, high yield processes that create low-cost sensors and actuators. OPtical fiber interconnected MEMS will provide new functionality in MEMS devices such as multiplexed operation for distributed sensing applications. This paper presents approaches in optical fiber to MEMS interfacing and some preliminary results.

  12. Design of Surface Micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2002-12-31

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMs, most have used comb-drive actuation methods and bulk micromachining processes. This research focused on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  13. Design of Surface micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2001-01-01

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMS, most have used comb-drive actuation methods and bulk micromachining processes. This research focuses on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  14. Optical inspection of hidden MEMS structures

    Science.gov (United States)

    Krauter, Johann; Gronle, Marc; Osten, Wolfgang

    2017-06-01

    Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

  15. Sleep estimates using microelectromechanical systems (MEMS).

    Science.gov (United States)

    te Lindert, Bart H W; Van Someren, Eus J W

    2013-05-01

    Although currently more affordable than polysomnography, actigraphic sleep estimates have disadvantages. Brand-specific differences in data reduction impede pooling of data in large-scale cohorts and may not fully exploit movement information. Sleep estimate reliability might improve by advanced analyses of three-axial, linear accelerometry data sampled at a high rate, which is now feasible using microelectromechanical systems (MEMS). However, it might take some time before these analyses become available. To provide ongoing studies with backward compatibility while already switching from actigraphy to MEMS accelerometry, we designed and validated a method to transform accelerometry data into the traditional actigraphic movement counts, thus allowing for the use of validated algorithms to estimate sleep parameters. Simultaneous actigraphy and MEMS-accelerometry recording. Home, unrestrained. Fifteen healthy adults (23-36 y, 10 males, 5 females). None. Actigraphic movement counts/15-sec and 50-Hz digitized MEMS-accelerometry. Passing-Bablok regression optimized transformation of MEMS-accelerometry signals to movement counts. Kappa statistics calculated agreement between individual epochs scored as wake or sleep. Bland-Altman plots evaluated reliability of common sleep variables both between and within actigraphs and MEMS-accelerometers. Agreement between epochs was almost perfect at the low, medium, and high threshold (kappa = 0.87 ± 0.05, 0.85 ± 0.06, and 0.83 ± 0.07). Sleep parameter agreement was better between two MEMS-accelerometers or a MEMS-accelerometer and an actigraph than between two actigraphs. The algorithm allows for continuity of outcome parameters in ongoing actigraphy studies that consider switching to MEMS-accelerometers. Its implementation makes backward compatibility feasible, while collecting raw data that, in time, could provide better sleep estimates and promote cross-study data pooling.

  16. Adhesion aspects in MEMS/NEMS

    CERN Document Server

    Kim, Seong H; Mittal, Kash L

    2012-01-01

    Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface

  17. Pressure reciprocity calibration of a MEMS microphone.

    Science.gov (United States)

    Wagner, Randall P; Fick, Steven E

    2017-09-01

    This article reports the first use of the pressure reciprocity technique to calibrate a micro-electromechanical system (MEMS) microphone. This standardized primary calibration method is conventionally used to calibrate laboratory standard microphones. Results for the pressure reciprocity calibration of a MEMS microphone and two laboratory standard microphones are presented for the frequency range 100-10 000 Hz. Because the amplifier in the MEMS microphone package prevents reciprocal operation, this microphone was used only as a receiver of sound. A description of the procedure is presented along with checks of the measurement results and data regarding the uncertainties of these results.

  18. Practical guide to RF-MEMS

    CERN Document Server

    Iannacci, Jacopo

    2013-01-01

    Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical

  19. Scanning laser beam displays based on a 2D MEMS

    Science.gov (United States)

    Niesten, Maarten; Masood, Taha; Miller, Josh; Tauscher, Jason

    2010-05-01

    The combination of laser light sources and MEMS technology enables a range of display systems such as ultra small projectors for mobile devices, head-up displays for vehicles, wearable near-eye displays and projection systems for 3D imaging. Images are created by scanning red, green and blue lasers horizontally and vertically with a single two-dimensional MEMS. Due to the excellent beam quality of laser beams, the optical designs are efficient and compact. In addition, the laser illumination enables saturated display colors that are desirable for augmented reality applications where a virtual image is used. With this technology, the smallest projector engine for high volume manufacturing to date has been developed. This projector module has a height of 7 mm and a volume of 5 cc. The resolution of this projector is WVGA. No additional projection optics is required, resulting in an infinite focus depth. Unlike with micro-display projection displays, an increase in resolution will not lead to an increase in size or a decrease in efficiency. Therefore future projectors can be developed that combine a higher resolution in an even smaller and thinner form factor with increased efficiencies that will lead to lower power consumption.

  20. MEMS-based Circuits and Systems for Wireless Communication

    CERN Document Server

    Kaiser, Andreas

    2013-01-01

    MEMS-based Circuits and Systems for Wireless Communication provides comprehensive coverage of RF-MEMS technology from device to system level. This edited volume places emphasis on how system performance for radio frequency applications can be leveraged by Micro-Electro-Mechanical Systems (MEMS). Coverage also extends to innovative MEMS-aware radio architectures that push the potential of MEMS technology further ahead.  This work presents a broad overview of the technology from MEMS devices (mainly BAW and Si MEMS resonators) to basic circuits, such as oscillators and filters, and finally complete systems such as ultra-low-power MEMS-based radios. Contributions from leading experts around the world are organized in three parts. Part I introduces RF-MEMS technology, devices and modeling and includes a prospective outlook on ongoing developments towards Nano-Electro-Mechanical Systems (NEMS) and phononic crystals. Device properties and models are presented in a circuit oriented perspective. Part II focusses on ...

  1. Optical MEMS for chemical analysis and biomedicine

    CERN Document Server

    Jiang, Hongrui

    2016-01-01

    This book describes the current state of optical MEMS in chemical and biomedical analysis and brings together current trends and highlights topics representing the most exciting progress in recent years in the field.

  2. Advanced mechatronics and MEMS devices II

    CERN Document Server

    Wei, Bin

    2017-01-01

    This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intel...

  3. MEMS and Nano-Technology Clean Room

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS and Nano-Technology Clean Room is a state-of-the-art, 800 square foot, Class 1000-capable facility used for development of micro and sub-micro scale sensors...

  4. Wireless MEMs BioSensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

  5. MEMS Gyroscope with Interferometric Detection, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This SBIR Phase I project will develop a MEMS gyroscope that uses an ultra high resolution sensing technique for measuring proof mass motion. The goal is to...

  6. Cryogenic MEMS Pressure Sensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — A directly immersible cryogenic MEMS pressure sensor will be developed. Each silicon die will contain a vacuum-reference and a tent-like membrane. Offsetting thermal...

  7. MEMS Gyroscope with Interferometric Detection, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The proposed innovation is a novel MEMS gyroscope that uses micro-interferometric detection to measure the motion of the proof mass. Using an interferometric...

  8. Wireless MEMs BioSensor Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

  9. MEMS Shutter for Spectrometer Calibration Project

    Data.gov (United States)

    National Aeronautics and Space Administration —   We shall develop a MEMS shutter that is expected to have 2-3 g mass and consumeThis research will demonstrate fabrication of a low mass (~2-3 grams), low...

  10. SiC MEMS For Harsh Environments

    National Research Council Canada - National Science Library

    Bradley, Kenneth

    2003-01-01

    ... (specifically high temperature) material for both structural and electronic devices. Although shock testing of SiC MEMS devices under this program was not accomplished, subsequent work allowed for this testing to occur, with positive results...

  11. MEMS Sensors and Actuators Laboratory (MSAL)

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS Sensors and Actuators Laboratory (MSAL) in the A.J. Clark School of Engineering at the University of Maryland (UMD) was established in January 2000. Our lab...

  12. Fabrication of integrated metallic MEMS devices

    DEFF Research Database (Denmark)

    Yalcinkaya, Arda Deniz; Ravnkilde, Jan Tue; Hansen, Ole

    2002-01-01

    A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators...

  13. Picometer-Resolution MEMS Segmented DM Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  14. Variable Emissivity Through MEMS Technology

    Science.gov (United States)

    Darrin, Ann Garrison; Osiander, Robert; Champion, John; Swanson, Ted; Douglas, Donya; Grob, Lisa M.; Powers, Edward I. (Technical Monitor)

    2000-01-01

    This paper discusses a new technology for variable emissivity (vari-e) radiator surfaces, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems. All spacecraft rely on radiative surfaces to dissipate waste heat. These radiators have special coatings, typically with a low solar absorptivity and a high infrared-red emissivity, that are intended to optimize performance under the expected heat load and thermal sink environment. The dynamics of the heat loads and thermal environment make it a challenge to properly size the radiator and often require some means of regulating the heat rejection rate of the radiators in order to achieve proper thermal balance. Specialized thermal control coatings, which can passively or actively adjust their emissivity offer an attractive solution to these design challenges. Such systems would allow intelligent control of the rate of heat loss from a radiator in response to heat load and thermal environmental variations. Intelligent thermal control through variable emissivity systems is well suited for nano and pico spacecraft applications where large thermal fluctuations are expected due to the small thermal mass and limited electric resources. Presently there are three different types of vari-e technologies under development: Micro ElectroMechanical Systems (MEMS) louvers, Electrochromic devices, and Electrophoretic devices. This paper will describe several prototypes of micromachined (MEMS) louvers and experimental results for the emissivity variations measured on theses prototypes. It will further discuss possible actuation mechanisms and space reliability aspects for different designs. Finally, for comparison parametric evaluations of the thermal performances of the new vari-e technology and standard thermal control systems are presented in this paper.

  15. Electrochemical studies of redox probes in self-organized lyotropic ...

    Indian Academy of Sciences (India)

    Administrator

    quinone|hydroquinone, methyl viologen and ferrocenemethanol probes in a lyotropic hexagonal columnar phase (H1 phase) using cyclic ..... hydrogen bond of hydroquinone during oxidation is lesser in the H1 phase compared to the ..... aspects of transport phenomenon in biological mem- branes. 27. Further work using ac ...

  16. Digital holography for MEMS and microsystem metrology

    CERN Document Server

    Asundi, Anand

    2011-01-01

    Approaching the topic of digital holography from the practical perspective of industrial inspection, Digital Holography for MEMS and Microsystem Metrology describes the process of digital holography and its growing applications for MEMS characterization, residual stress measurement, design and evaluation, and device testing and inspection. Asundi also provides a thorough theoretical grounding that enables the reader to understand basic concepts and thus identify areas where this technique can be adopted. This combination of both practical and theoretical approach will ensure the

  17. Fabrication of integrated metallic MEMS devices

    DEFF Research Database (Denmark)

    Yalcinkaya, Arda Deniz; Ravnkilde, Jan Tue; Hansen, Ole

    2002-01-01

    A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators are characteri......A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators...

  18. Nano-tribology and materials in MEMS

    CERN Document Server

    Satyanarayana, N; Lim, Seh

    2013-01-01

    This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.

  19. Optical performance requirements for MEMS-scanner-based microdisplays

    Science.gov (United States)

    Urey, Hakan; Wine, David W.; Osborn, Thor D.

    2000-08-01

    High-resolution and high frame rate dynamic microdisplays can be implemented by scanning a photon beam in a raster format across the viewer's retina. Microvision is developing biaxial MEMS scanners for such video display applications. This paper discusses the optical performance requirements for scanning display systems. The display resolution directly translates into a scan-angle-mirror-size product and the frame rate translates into vertical and horizontal scanner frequencies. (theta) -product and fh are both very important figures of merit for scanner performance comparison. In addition, the static and dynamic flatness of the scanners, off-axis motion and scan repeatability, scanner position sensor accuracy all have a direct impact on display image quality.

  20. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O' NEAL, CHAD; SINGH, SUSHILA B.

    1999-09-24

    Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.

  1. Dynamic metasurface lens based on MEMS technology

    Directory of Open Access Journals (Sweden)

    Tapashree Roy

    2018-02-01

    Full Text Available In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along two orthogonal axes by ±9°, thus enabling dynamic beam steering. The device could be used to compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems.

  2. A novel piezoresistive polymer nanocomposite MEMS accelerometer

    International Nuclear Information System (INIS)

    Seena, V; Hari, K; Prajakta, S; Ramgopal Rao, V; Pratap, Rudra

    2017-01-01

    A novel polymer MEMS (micro electro mechanical systems) accelerometer with photo-patternable polymer nanocomposite as a piezoresistor is presented in this work. Polymer MEMS Accelerometer with beam thicknesses of 3.3 µ m and embedded nanocomposite piezoresistive layer having a gauge factor of 90 were fabricated. The photosensitive nanocomposite samples were prepared and characterized for analyzing the mechanical and electrical properties and thereby ensuring proper process parameters for incorporating the piezoresistive layer into the polymer MEMS accelerometer. The microfabrication process flow and unit processes followed are extremely low cost with process temperatures below 100 °C. This also opens up a new possibility for easy integration of such polymer MEMS with CMOS (complementary metal oxide semiconductor) devices and circuits. The fabricated devices were characterized using laser Doppler vibrometer (LDV) and the devices exhibited a resonant frequency of 10.8 kHz and a response sensitivity of 280 nm g −1 at resonance. The main focus of this paper is on the SU-8/CB nanocomposite piezoresistive MEMS accelerometer technology development which covers the material and the fabrication aspects of these devices. CoventorWare FEA analysis performed using the extracted material properties from the experimental characterization which are in close agreement to performance parameters of the fabricated devices is also discussed. The simulated piezoresistive polymer MEMS devices showed an acceleration sensitivity of 126 nm g −1 and 82 ppm of Δ R / R per 1 g of acceleration. (paper)

  3. Dynamic metasurface lens based on MEMS technology

    Science.gov (United States)

    Roy, Tapashree; Zhang, Shuyan; Jung, Il Woong; Troccoli, Mariano; Capasso, Federico; Lopez, Daniel

    2018-02-01

    In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS) integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along two orthogonal axes by ±9°, thus enabling dynamic beam steering. The device could be used to compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems.

  4. Probe-based recording technology

    International Nuclear Information System (INIS)

    Naberhuis, Steve

    2002-01-01

    The invention of the scanning tunneling microscope (STM) prompted researchers to contemplate whether such technology could be used as the basis for the storage and retrieval of information. With magnetic data storage technology facing limits in storage density due to the thermal instability of magnetic bits, the super-paramagnetic limit, the heir-apparent for information storage at higher densities appeared to be variants of the STM or similar probe-based storage techniques such as atomic force microscopy (AFM). Among these other techniques that could provide replacement technology for magnetic storage, near-field optical scanning optical microscopy (NSOM or SNOM) has also been investigated. Another alternative probe-based storage technology called atomic resolution storage (ARS) is also currently under development. An overview of these various technologies is herein presented, with an analysis of the advantages and disadvantages inherent in each particularly with respect to reduced device dimensions. The role of micro electro mechanical systems (MEMS) is emphasized

  5. MEMS-BASED OSCILLATORS: A REVIEW

    Directory of Open Access Journals (Sweden)

    Jamilah Karim

    2014-05-01

    Full Text Available ABSTRACT: This paper presents an overview of microelectromechanical (MEMS based oscillators. The accuracy and stability of the reference frequency will normally limit the performance of most wireless communication systems. MEMS technology is the technology of choice due to its compatibility to silicon, leading to integration with circuits and lowering power consumption. MEMS based oscillators also provide the potential of a fully integrated transceiver. The most commonly used topology for MEMS based oscillators are pierce oscillator circuit topology and TIA circuit topology. Both topologies result in very competitive output in terms of phase noise and power consumption.  They can be used for either higher or lower Rx. The major difference between both topologies is the number of transistors used. TIA circuit used more number of transistor compare to pierce circuit. Thus design complexity of the TIA is higher. Pierce circuit is simpler, provide straightforward biasing and easier to design. The highly integratable of MEMS-based oscillators have made them much needed in future multiband wireless system. So that future wireless systems are able to function globally without any problem. ABSTRAK: Kertas kerja ini membentangkan gambaran keseluruhan mikroelektromekanikal (MEMS berdasarkan pengayun.  Ketepatan dan kestabilan frekuensi rujukan sering membataskan perlaksanaan kebanyakan sistem komunikasi tanpa wayar. Teknologi MEMS merupakan teknologi pilihan memandangkan ia serasi dengan silikon; membolehkan integrasi dengan litar dan penggunaan tenaga yang rendah.  Pengayun berdasarkan MEMS juga  berpotensi sebagai integrasi penuh penghantar-terima. Topologi yang sering digunakan untuk pengayun berdasarkan MEMS adalah topologi litar pengayun pencantas dan topologi litar TIA.  Keputusan bagi kedua-dua topologi adalah amat kompetitif dari segi fasa bunyi dan penggunaan tenaga. Ia boleh digunakan untuk meninggikan atau merendahkan Rx. Perbezaan utama

  6. Status of the MEMS Industry: Evolution or MEMS Markets and of the Industrial Infrastructure

    Directory of Open Access Journals (Sweden)

    J. C. ELOY

    2007-12-01

    Full Text Available The MEMS markets in 2006 reached US$ 5.8 B and we can estimate that the 2011 MEMS markets will reach more than US $ 10.7 B, with very diverse growth rate depending on the devices and the applications: silicon microphone and RF MEMS are the fastest growing applications but the existing applications like ink jet head and pressure sensors are still growing at a rate of 4 % per year at least. The industrial infrastructure is changing, with more and more companies going to 8’’ manufacturing facilities and the strong growth of the MEMS foundry business. MEMS business is changing for more structured industry and high volume production.

  7. A Fast, Large-Stroke Electrothermal MEMS Mirror Based on Cu/W Bimorph

    Directory of Open Access Journals (Sweden)

    Xiaoyang Zhang

    2015-12-01

    Full Text Available This paper reports a large-range electrothermal bimorph microelectromechanical systems (MEMS mirror with fast thermal response. The actuator of the MEMS mirror is made of three segments of Cu/W bimorphs for lateral shift cancelation and two segments of multimorph beams for obtaining large vertical displacement from the angular motion of the bimorphs. The W layer is also used as the embedded heater. The silicon underneath the entire actuator is completely removed using a unique backside deep-reactive-ion-etching DRIE release process, leading to improved thermal response speed and front-side mirror surface protection. This MEMS mirror can perform both piston and tip-tilt motion. The mirror generates large pure vertical displacement up to 320 μm at only 3 V with a power consumption of 56 mW for each actuator. The maximum optical scan angle achieved is ±18° at 3 V. The measured thermal response time is 15.4 ms and the mechanical resonances of piston and tip-tilt modes are 550 Hz and 832 Hz, respectively.

  8. Mid infrared MEMS FTIR spectrometer

    Science.gov (United States)

    Erfan, Mazen; Sabry, Yasser M.; Mortada, Bassem; Sharaf, Khaled; Khalil, Diaa

    2016-03-01

    In this work we report, for the first time to the best of our knowledge, a bulk-micromachined wideband MEMS-based spectrometer covering both the NIR and the MIR ranges and working from 1200 nm to 4800 nm. The core engine of the spectrometer is a scanning Michelson interferometer micro-fabricated using deep reactive ion etching (DRIE) technology. The spectrum is obtained using the Fourier Transform techniques that allows covering a very wide spectral range limited by the detector responsivity. The moving mirror of the interferometer is driven by a relatively large stroke electrostatic comb-drive actuator. Zirconium fluoride (ZrF4) multimode optical fibers are used to connect light between the white light source and the interferometer input, as well as the interferometer output to a PbSe photoconductive detector. The recorded signal-to-noise ratio is 25 dB at the wavelength of 3350 nm. The spectrometer is successfully used in measuring the absorption spectra of methylene chloride, quartz glass and polystyrene film. The presented solution provides a low cost method for producing miniaturized spectrometers in the near-/mid-infrared.

  9. Highly elastic conductive polymeric MEMS

    Science.gov (United States)

    Ruhhammer, J.; Zens, M.; Goldschmidtboeing, F.; Seifert, A.; Woias, P.

    2015-02-01

    Polymeric structures with integrated, functional microelectrical mechanical systems (MEMS) elements are increasingly important in various applications such as biomedical systems or wearable smart devices. These applications require highly flexible and elastic polymers with good conductivity, which can be embedded into a matrix that undergoes large deformations. Conductive polydimethylsiloxane (PDMS) is a suitable candidate but is still challenging to fabricate. Conductivity is achieved by filling a nonconductive PDMS matrix with conductive particles. In this work, we present an approach that uses new mixing techniques to fabricate conductive PDMS with different fillers such as carbon black, silver particles, and multiwalled carbon nanotubes. Additionally, the electrical properties of all three composites are examined under continuous mechanical stress. Furthermore, we present a novel, low-cost, simple three-step molding process that transfers a micro patterned silicon master into a polystyrene (PS) polytetrafluoroethylene (PTFE) replica with improved release features. This PS/PTFE mold is used for subsequent structuring of conductive PDMS with high accuracy. The non sticking characteristics enable the fabrication of delicate structures using a very soft PDMS, which is usually hard to release from conventional molds. Moreover, the process can also be applied to polyurethanes and various other material combinations.

  10. Automotive Sensors and MEMS Technology

    Science.gov (United States)

    Nonomura, Yutaka

    - Automotive sensors are used for emission gas purification, energy conservation, car kinematic performance, safety and ITS (intelligent transportation system). The comparison of the sensor characteristics was made for their application area. Many kinds of the principles are applied for the sensors. There are two types of sensors, such as physical and chemical one. Many of the automotive sensors are physical type such as mechanical sensors. And a gas sensor is a chemical type. The sensors have been remarkably developed with the advancement of the MEMS (Micro Electro Mechanical Systems) technology. In this paper, gas, pressure, combustion pressure, acceleration, magnetic, and angular rate sensors for automotive use are explained with their features. The sensors are key devices to control cars in the engine, power train, chassis and safety systems. The environment resistance, long term reliability, and low cost are required for the automotive sensors. They are very hard to be resolved. However, the sensor technology contributes greatly to improving global environment, energy conservation, and safety. The applications of automotive sensors will be expanded with the automobile developments.

  11. A Nuclear Microbattery for MEMS Devices

    International Nuclear Information System (INIS)

    Blanchard, James; Henderson, Douglass; Lal, Amit

    2002-01-01

    This project was designed to demonstrate the feasibility of producing on-board power for MEMS devices using radioisotopes. MEMS is a fast growing field, with hopes for producing a wide variety of revolutionary applications, including ''labs on a chip,'' micromachined scanning tunneling microscopes, microscopic detectors for biological agents, microsystems for DNA identification, etc. Currently, these applications are limited by the lack of an on-board power source. Research is ongoing to study approaches such as fuel cells, fossil fuels, and chemical batteries, but all these concepts have limitations. For long-lived, high energy density applications, on-board radioisotope power offers the best choice. We have succeeded in producing such devices using a variety of isotopes, incorporation methods, and device geometries. These experiments have demonstrated the feasibility of using radioisotope power and that there are a variety of options available for MEMS designers. As an example of an integrated, self-powered application, we have created an oscillating cantilever beam that is capable of consistent, periodic oscillations over very long time periods without the need for refueling. Ongoing work will demonstrate that this cantilever is capable of radio frequency transmission, allowing MEMS devices to communicate with one another wirelessly. Thus, this will be the first self-powered wireless transmitter available for use in MEMS devices, permitting such applications as sensors embedded in buildings for continuous monitoring of the building performance and integrity

  12. IC-Compatible Technologies for Optical MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Krygowski, T.W.; Sniegowski, J.J.

    1999-04-30

    Optical Micro Electro Mechanical Systems (Optical MEMS) Technology holds the promise of one-day producing highly integrated optical systems on a common, monolithic substrate. The choice of fabrication technology used to manufacture Optical MEMS will play a pivotal role in the size, functionality and ultimately the cost of optical Microsystems. By leveraging the technology base developed for silicon integrated circuits, large batches of routers, emitters, detectors and amplifiers will soon be fabricated for literally pennies per part. In this article we review the current status of technologies used for Optical MEMS, as well as fabrication technologies of the future, emphasizing manufacturable surface micromachining approaches to producing reliable, low-cost devices for optical communications applications.

  13. MEMS tunable grating micro-spectrometer

    Science.gov (United States)

    Tormen, Maurizio; Lockhart, R.; Niedermann, P.; Overstolz, T.; Hoogerwerf, A.; Mayor, J.-M.; Pierer, J.; Bosshard, C.; Ischer, R.; Voirin, G.; Stanley, R. P.

    2017-11-01

    The interest in MEMS based Micro-Spectrometers is increasing due to their potential in terms of flexibility as well as cost, low mass, small volume and power savings. This interest, especially in the Near-Infrared and Mid- Infrared, ranges from planetary exploration missions to astronomy, e.g. the search for extra solar planets, as well as to many other terrestrial fields of application such as, industrial quality and surface control, chemical analysis of soil and water, detection of chemical pollutants, exhausted gas analysis, food quality control, process control in pharmaceuticals, to name a few. A compact MEMS-based Spectrometer for Near- Infrared and Mid-InfraRed operation have been conceived, designed and demonstrated. The design based on tunable MEMS blazed grating, developed in the past at CSEM [1], achieves state of the art results in terms of spectral resolution, operational wavelength range, light throughput, overall dimensions, and power consumption.

  14. Vortex Anemometer Using MEMS Cantilever Sensor

    CERN Document Server

    Zylka, P; Zylka, Pawel; Modrzynski, Pawel

    2010-01-01

    This paper presents construction and performance of a novel hybrid microelectromechanical system (MEMS) vortex flowmeter. A miniature cantilever MEMS displacement sensor was used to detect frequency of vortices development. 3-mm-long silicon cantilever, protruding directly out of a trailing edge of a trapezoidal glass-epoxy composite bluff body was put into oscillatory motion by vortices shed alternately from side surfaces of the obstacle. Verified linearmeasurement range of the device extended from 5 to 22 m/s; however, it could be broadened in absence of external 50-Hz mains electrical interfering signal which required bandpass frequency-domain digital sensor signal processing. The MEMS vortex sensor proved its effectiveness in detection of semilaminar airflow velocity distribution in a 40-mm-diameter tubular pipe.

  15. MEMS- and NEMS-based smart devices and systems

    Science.gov (United States)

    Varadan, Vijay K.

    2001-11-01

    structures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5-40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended conventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross- linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.

  16. MEMS reliability: The challenge and the promise

    Energy Technology Data Exchange (ETDEWEB)

    Miller, W.M.; Tanner, D.M.; Miller, S.L.; Peterson, K.A.

    1998-05-01

    MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost effective solutions only if they prove to be sufficiently reliable. A valid reliability assessment of MEMS has three prerequisites: (1) statistical significance; (2) a technique for accelerating fundamental failure mechanisms, and (3) valid physical models to allow prediction of failures during actual use. These already exist for the microelectronics portion of such integrated systems. The challenge lies in the less well understood micromachine portions and its synergistic effects with microelectronics. This paper presents a methodology addressing these prerequisites and a description of the underlying physics of reliability for micromachines.

  17. Enabling technology for MEMS and nanodevices

    CERN Document Server

    Baltes, Henry; Fedder, Gary K; Hierold, Christofer; Korvink, Jan G; Tabata, Osamu

    2013-01-01

    This softcover edition of the eponymous volume from the successful ""Advanced Micro & Nanosystems"" series covers all aspects of fabrication of MEMS under CMOS-compatible conditions from design to implementation.It examines the various routes and methods to combine electronics generated by the CMOS technology with novel micromechanical parts into one-chip solutions. Various approaches, fundamental and technological aspects as well as strategies leading to different types of functionalities and presented in detail.For the practicing engineer as well as MSc and PhD students on MEMS cours

  18. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  19. Liquid Tunable Microlenses based on MEMS techniques

    Science.gov (United States)

    Zeng, Xuefeng; Jiang, Hongrui

    2013-01-01

    The recent rapid development in microlens technology has provided many opportunities for miniaturized optical systems, and has found a wide range of applications. Of these microlenses, tunable-focus microlenses are of special interest as their focal lengths can be tuned using micro-scale actuators integrated with the lens structure. Realization of such tunable microlens generally relies on the microelectromechanical system (MEMS) technologies. Here, we review the recent progress in tunable liquid microlenses. The underlying physics relevant to these microlenses are first discussed, followed by description of three main categories of tunable microlenses involving MEMS techniques, mechanically driven, electrically driven, and those integrated within microfluidic systems. PMID:24163480

  20. RF MEMS theory, design, and technology

    CERN Document Server

    Rebeiz, Gabriel M

    2003-01-01

    Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

  1. Review of Automated Design and Optimization of MEMS

    DEFF Research Database (Denmark)

    Achiche, Sofiane; Fan, Zhun; Bolognini, Francesca

    2007-01-01

    carried out. This paper presents a review of these techniques. The design task of MEMS is usually divided into four main stages: System Level, Device Level, Physical Level and the Process Level. The state of the art o automated MEMS design in each of these levels is investigated.......In recent years MEMS saw a very rapid development. Although many advances have been reached, due to the multiphysics nature of MEMS, their design is still a difficult task carried on mainly by hand calculation. In order to help to overtake such difficulties, attempts to automate MEMS design were...

  2. Optically pumped 1550nm wavelength tunable MEMS VCSEL

    DEFF Research Database (Denmark)

    Sahoo, Hitesh Kumar; Ansbæk, Thor; Ottaviano, Luisa

    2016-01-01

    The paper presents the design and fabrication of an optically pumped 1550nm tunable MEMS VCSEL with anenclosed MEMS. The MEMS is defined in SOI and the active material, an InP wafer with quantum wells arebonded to the SOI and the last mirror is made from the deposition of dielectric materials. Th....... The design bringsin flexibility to fabricate MEMS VCSELs over a wider range of wavelengths. The paper discusses results fromthe simulations and bonding results from fabrication. The device will push the boundaries for wavelength sweepspeed and bandwidth.......The paper presents the design and fabrication of an optically pumped 1550nm tunable MEMS VCSEL with anenclosed MEMS. The MEMS is defined in SOI and the active material, an InP wafer with quantum wells arebonded to the SOI and the last mirror is made from the deposition of dielectric materials...

  3. A Widely-Accessible Distributed MEMS Processing Environment. The MEMS Exchange Program

    Science.gov (United States)

    2012-10-29

    steadily rising for several years, our revenue began to drop in 2009, we think mostly due to the bad economy. In years past we would normally see a...the MEMS Materials and Processing Handbook, editors R. Ghodssi and P. Lin, Springer Press, New York, 2011. [3] BioMEMS and Biomaterials for...Medical Applications Biomaterials Science: An Integrated Clinical and Engineering Approach, edited by Yitzhak Rosen and Noel Elman, CRC Press, Boca

  4. Characterization of dielectric charging in RF MEMS

    NARCIS (Netherlands)

    Herfst, R.W.; Huizing, H.G.A.; Steeneken, P.G.; Schmitz, Jurriaan

    2005-01-01

    Capacitive RF MEMS switches show great promise for use in wireless communication devices such as mobile phones, but the successful application of these switches is hindered by the reliability of the devices: charge injection in the dielectric layer (SiN) can cause irreversible stiction of the moving

  5. Characterization of piezoelectric polymer composites for MEMS ...

    Indian Academy of Sciences (India)

    Abstract. Composite piezoelectric ceramics are important materials for transducer applications in medical diag- nostic devices and MEMS devices. In micrometer scale the material properties of piezopolymers or piezoceramics do not coincide with that of bulk materials. The present work is aimed at simulating the material ...

  6. From MEMS to NEMS : Scaling Cantilever Sensors

    NARCIS (Netherlands)

    Yang, C.K.

    2012-01-01

    This thesis studies the effects of scaling on the characterisation and readout of micro-electro mechanical systems (MEMS) to nano-electro mechanical systems (NEMS). In particular it focuses on cantilever, which is a basic device building block and an important transducer in many sensing

  7. Bullet Design of MEMS Cantilever - Hand Calculation

    Directory of Open Access Journals (Sweden)

    Abhijeet V. KSHIRSAGAR

    2008-04-01

    Full Text Available The present article describes the basic hand calculations for design of MEMS cantilever for beginners. The MATLAB software code was written to analysis the all formulae. Further the article gives insight of important parameters, its dependence and consideration for a good design.

  8. Novel RF-MEMS capacitive switching structures

    NARCIS (Netherlands)

    Rottenberg, X.; Jansen, Henricus V.; Fiorini, P.; De Raedt, W.; Tilmans, H.A.C.

    2002-01-01

    This paper reports on novel RF-MEMS capacitive switching devices implementing an electrically floating metal layer covering the dielectric to ensure intimate contact with the bridge in the down state. This results in an optimal switch down capacitance and allows optimisation of the down/up

  9. Review on the Modeling of Electrostatic MEMS

    Science.gov (United States)

    Chuang, Wan-Chun; Lee, Hsin-Li; Chang, Pei-Zen; Hu, Yuh-Chung

    2010-01-01

    Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analysis complex and complicated. This article introduces the physical model of pull-in voltage, dynamic characteristic analysis, air damping effect, reliability, numerical modeling method, and application of electrostatic-driven MEMS devices. PMID:22219707

  10. MEMS Piezoresistive Pressure Sensor: A Survey

    OpenAIRE

    Shwetha Meti; Kirankumar B. Balavald; B. G. Sheeparmatti

    2016-01-01

    Piezoresistive pressure sensors are one of the very first products of MEMS technology, and are used in various fields like automotive industries, aerospace, biomedical applications, and household appliances. Amongst various transduction principles of pressure sensor piezoresistive transduction mechanism is widely used. Over a decade therehas been tremendous improvement in the development of the design of piezoresistive pressure sensor starting with the invention of piezoresistance...

  11. SiC MEMS For Harsh Environments

    National Research Council Canada - National Science Library

    Bradley, Kenneth

    2003-01-01

    This document is the final technical report for the SiC MEMS for Harsh Environments in-house research program jointly coordinated between AFRL/MNMF and AFRL/MLPS, and addresses the benefits of silicon carbide (SiC...

  12. MEMS deformable mirror CubeSat testbed

    Science.gov (United States)

    Cahoy, Kerri L.; Marinan, Anne D.; Novak, Benjamin; Kerr, Caitlin; Nguyen, Tam; Webber, Matthew; Falkenburg, Grant; Barg, Andrew; Berry, Kristen; Carlton, Ashley; Belikov, Ruslan; Bendek, Eduardo A.

    2013-09-01

    To meet the high contrast requirement of 1 × 10-10to image an Earth-like planet around a Sun-like star, space telescopes equipped with coronagraphs require wavefront control systems. Deformable mirrors are a key element of these systems that correct for optical imperfections, thermal distortions, and diffraction that would otherwise corrupt the wavefront and ruin the contrast. However, high-actuator-count MEMS deformable mirrors have yet to fly in space long enough to characterize their on-orbit performance and reduce risk by developing and operating their supporting systems. The goal of the MEMS Deformable Mirror CubeSat Testbed is to develop a CubeSat-scale demonstration of MEMS deformable mirror and wavefront sensing technology. In this paper, we consider two approaches for a MEMS deformable mirror technology demonstration payload that will fit within the mass, power, and volume constraints of a CubeSat: 1) a Michelson interferometer and 2) a Shack-Hartmann wavefront sensor. We clarify the constraints on the payload based on the resources required for supporting CubeSat subsystems drawn from subsystems that we have developed for a different CubeSat flight project. We discuss results from payload lab prototypes and their utility in defining mission requirements.

  13. Cultural probes

    DEFF Research Database (Denmark)

    Madsen, Jacob Østergaard

    The aim of this study was thus to explore cultural probes (Gaver, Boucher et al. 2004), as a possible methodical approach, supporting knowledge production on situated and contextual aspects of occupation.......The aim of this study was thus to explore cultural probes (Gaver, Boucher et al. 2004), as a possible methodical approach, supporting knowledge production on situated and contextual aspects of occupation....

  14. Digital Microfluidic System with Vertical Functionality

    Directory of Open Access Journals (Sweden)

    Brian F. Bender

    2015-11-01

    Full Text Available Digital (droplet microfluidics (DµF is a powerful platform for automated lab-on-a-chip procedures, ranging from quantitative bioassays such as RT-qPCR to complete mammalian cell culturing. The simple MEMS processing protocols typically employed to fabricate DµF devices limit their functionality to two dimensions, and hence constrain the applications for which these devices can be used. This paper describes the integration of vertical functionality into a DµF platform by stacking two planar digital microfluidic devices, altering the electrode fabrication process, and incorporating channels for reversibly translating droplets between layers. Vertical droplet movement was modeled to advance the device design, and three applications that were previously unachievable using a conventional format are demonstrated: (1 solutions of calcium dichloride and sodium alginate were vertically mixed to produce a hydrogel with a radially symmetric gradient in crosslink density; (2 a calcium alginate hydrogel was formed within the through-well to create a particle sieve for filtering suspensions passed from one layer to the next; and (3 a cell spheroid formed using an on-chip hanging-drop was retrieved for use in downstream processing. The general capability of vertically delivering droplets between multiple stacked levels represents a processing innovation that increases DµF functionality and has many potential applications.

  15. MEMS Actuators for Improved Performance and Durability

    Science.gov (United States)

    Yearsley, James M.

    Micro-ElectroMechanical Systems (MEMS) devices take advantage of force-scaling at length scales smaller than a millimeter to sense and interact with directly with phenomena and targets at the microscale. MEMS sensors found in everyday devices like cell-phones and cars include accelerometers, gyros, pressure sensors, and magnetic sensors. MEMS actuators generally serve more application specific roles including micro- and nano-tweezers used for single cell manipulation, optical switching and alignment components, and micro combustion engines for high energy density power generation. MEMS rotary motors are actuators that translate an electric drive signal into rotational motion and can serve as rate calibration inputs for gyros, stages for optical components, mixing devices for micro-fluidics, etc. Existing rotary micromotors suffer from friction and wear issues that affect lifetime and performance. Attempts to alleviate friction effects include surface treatment, magnetic and electrostatic levitation, pressurized gas bearings, and micro-ball bearings. The present work demonstrates a droplet based liquid bearing supporting a rotary micromotor that improves the operating characteristics of MEMS rotary motors. The liquid bearing provides wear-free, low-friction, passive alignment between the rotor and stator. Droplets are positioned relative to the rotor and stator through patterned superhydrophobic and hydrophilic surface coatings. The liquid bearing consists of a central droplet that acts as the motor shaft, providing axial alignment between rotor and stator, and satellite droplets, analogous to ball-bearings, that provide tip and tilt stable operation. The liquid bearing friction performance is characterized through measurement of the rotational drag coefficient and minimum starting torque due to stiction and geometric effects. Bearing operational performance is further characterized by modeling and measuring stiffness, environmental survivability, and high

  16. Impact of environmental conditions on the reliability of MEMS components from optical applications

    Directory of Open Access Journals (Sweden)

    Pustan Marius

    2017-01-01

    Full Text Available The reliability design and the lifetime of MEMS from optical applications is strongly dependent on the operating conditions. In optical devices an additional stress is introduced by the temperature gradient appearing during operation. The thermal stress introduced in the structure modifies the component response and its lifetime. The investigated sample is a micromirror fabricated from gold using the MEMS technologies and tested by an atomic force microscope. The scope is to analyse the temperature and relative humidity influence on the mechanical and tribological behaviours. Using a mechanical force given by the bending deflection and stiffness of the AFM probe, the dependence between the applied force and the micromirror deformation is monitored as a function of temperature. By increasing the temperature of structures the stiffness decreases based on the thermal relaxation of the material. If the relative humidity increases the adhesion between the micromirror and substrate is improved based on the capillarity effect. The results obtained are useful to MEMS designers who can predict the micromirror response as a function of the operating conditions with influence on the actuation energy, the accuracy in response and the system lifetime.

  17. Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program

    Energy Technology Data Exchange (ETDEWEB)

    Schriner, H.; Davies, B.; Sniegowski, J.; Rodgers, M.S.; Allen, J.; Shepard, C.

    1998-05-01

    Research and development in the design and manufacture of Microelectromechanical Systems (MEMS) is growing at an enormous rate. Advances in MEMS design tools and fabrication processes at Sandia National Laboratories` Microelectronics Development Laboratory (MDL) have broadened the scope of MEMS applications that can be designed and manufactured for both military and commercial use. As improvements in micromachining fabrication technologies continue to be made, MEMS designs can become more complex, thus opening the door to an even broader set of MEMS applications. In an effort to further research and development in MEMS design, fabrication, and application, Sandia National Laboratories has launched the Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program or SAMPLES program. The SAMPLES program offers potential partners interested in MEMS the opportunity to prototype an idea and produce hardware that can be used to sell a concept. The SAMPLES program provides education and training on Sandia`s design tools, analysis tools and fabrication process. New designers can participate in the SAMPLES program and design MEMS devices using Sandia`s design and analysis tools. As part of the SAMPLES program, participants` designs are fabricated using Sandia`s 4 level polycrystalline silicon surface micromachine technology fabrication process known as SUMMiT (Sandia Ultra-planar, Multi-level MEMS Technology). Furthermore, SAMPLES participants can also opt to obtain state of the art, post-fabrication services provided at Sandia such as release, packaging, reliability characterization, and failure analysis. This paper discusses the components of the SAMPLES program.

  18. MEMS for Tunable Photonic Metamaterial Applications

    Science.gov (United States)

    Stark, Thomas

    Photonic metamaterials are materials whose optical properties are derived from artificially-structured sub-wavelength unit cells, rather than from the bulk properties of the constituent materials. Examples of metamaterials include plasmonic materials, negative index materials, and electromagnetic cloaks. While advances in simulation tools and nanofabrication methods have allowed this field to grow over the past several decades, many challenges still exist. This thesis addresses two of these challenges: fabrication of photonic metamaterials with tunable responses and high-throughput nanofabrication methods for these materials. The design, fabrication, and optical characterization of a microelectromechanical systems (MEMS) tunable plasmonic spectrometer are presented. An array of holes in a gold film, with plasmon resonance in the mid-infrared, is suspended above a gold reflector, forming a Fabry-Perot interferometer of tunable length. The spectra exhibit the convolution of extraordinary optical transmission through the holes and Fabry-Perot resonances. Using MEMS, the interferometer length is modulated from 1.7 mum to 21.67 mum , thereby tuning the free spectral range from about 2900 wavenumbers to 230.7 wavenumbers and shifting the reflection minima and maxima across the infrared. Due to its broad spectral tunability in the fingerprint region of the mid-infrared, this device shows promise as a tunable biological sensing device. To address the issue of high-throughput, high-resolution fabrication of optical metamaterials, atomic calligraphy, a MEMS-based dynamic stencil lithography technique for resist-free fabrication of photonic metamaterials on unconventional substrates, has been developed. The MEMS consists of a moveable stencil, which can be actuated with nanometer precision using electrostatic comb drive actuators. A fabrication method and flip chip method have been developed, enabling evaporation of metals through the device handle for fabrication on an

  19. Mobile probes

    DEFF Research Database (Denmark)

    Ørngreen, Rikke; Jørgensen, Anna Neustrup; Noesgaard, Signe Schack

    2016-01-01

    to in an interview. This method provided valuable insight into the contextual use, i.e. how did the online resource transfer to the work practice. However, the research team also found that mobile probes may provide the scaffolding necessary for individual and peer learning at a very local (intra-school) community...... level. This paper is an initial investigation of how the mobile probes process proved to engage teachers in their efforts to improve teaching. It also highlights some of the barriers emerging when applying mobile probes as a scaffold for learning.......A project investigating the effectiveness of a collection of online resources for teachers' professional development used mobile probes as a data collection method. Teachers received questions and tasks on their mobile in a dialogic manner while in their everyday context as opposed...

  20. Counting probe

    International Nuclear Information System (INIS)

    Matsumoto, Haruya; Kaya, Nobuyuki; Yuasa, Kazuhiro; Hayashi, Tomoaki

    1976-01-01

    Electron counting method has been devised and experimented for the purpose of measuring electron temperature and density, the most fundamental quantities to represent plasma conditions. Electron counting is a method to count the electrons in plasma directly by equipping a probe with the secondary electron multiplier. It has three advantages of adjustable sensitivity, high sensitivity of the secondary electron multiplier, and directional property. Sensitivity adjustment is performed by changing the size of collecting hole (pin hole) on the incident front of the multiplier. The probe is usable as a direct reading thermometer of electron temperature because it requires to collect very small amount of electrons, thus it doesn't disturb the surrounding plasma, and the narrow sweep width of the probe voltage is enough. Therefore it can measure anisotropy more sensitively than a Langmuir probe, and it can be used for very low density plasma. Though many problems remain on anisotropy, computer simulation has been carried out. Also it is planned to provide a Helmholtz coil in the vacuum chamber to eliminate the effect of earth magnetic field. In practical experiments, the measurement with a Langmuir probe and an emission probe mounted to the movable structure, the comparison with the results obtained in reverse magnetic field by using a Helmholtz coil, and the measurement of ionic sound wave are scheduled. (Wakatsuki, Y.)

  1. Electroplating of low stress permalloy for MEMS

    International Nuclear Information System (INIS)

    Zhang Yonghua; Ding Guifu; Cai Yuli; Wang Hong; Cai Bingchu

    2006-01-01

    With the wafer-bending method and spectrophotometry, the internal stress in electroplated Ni-Fe alloy for MEMS has been investigated as a function of bath concentration. This investigation demonstrated that low concentration plating solution is useful for the decrease of the residual stress in the electrodeposits, and the stress could further decrease with an increase of saccharin additive content. And the change of stress from tensile to compressive was not observed with the increase of the additive content in plating path. The low stress permalloy (Ni 81 Fe 19 ) was reached in our experimental conditions. A bistable electromagnetic RF MEMS switch with deformation-free bilayer cantilever beam was fabricated successfully by electroplated permalloy

  2. MEMS wireless temperature sensor for combustion studies

    Science.gov (United States)

    Lee, Minhyeok; Kawahara, Yoshihiro; Morimoto, Kenichi; Suzuki, Yuji

    2014-11-01

    A MEMS wireless wall temperature sensor for combustion studies is proposed. Electrical resistance change in a LCR circuit is used to measure the temperature through inductive coupling the sensor coil and the read-out coil. Equivalent circuit model and 3-D electromagnetic simulation are employed to design sensor configuration. The resonant frequency is increased with increasing the resistance due to the temperature increase. The prototype sensor was successfully fabricated with MEMS technologies. The impedance phase angle shows a sharp dip at the resonant frequency, which is in good accordance with the equivalent circuit model. The measured temperature sensitivity is found to be as high as 6 kHz/K, when the distance between the read-out and the sensor coils is 0.71 mm.

  3. MEMS Packaging - Current Issues and Approaches

    Energy Technology Data Exchange (ETDEWEB)

    DRESSENDORFER,PAUL V.; PETERSON,DAVID W.; REBER,CATHLEEN ANN

    2000-01-19

    The assembly and packaging of MEMS (Microelectromechanical Systems) devices raise a number of issues over and above those normally associated with the assembly of standard microelectronic circuits. MEMS components include a variety of sensors, microengines, optical components, and other devices. They often have exposed mechanical structures which during assembly require particulate control, space in the package, non-contact handling procedures, low-stress die attach, precision die placement, unique process schedules, hermetic sealing in controlled environments (including vacuum), and other special constraints. These constraints force changes in the techniques used to separate die on a wafer, in the types of packages which can be used in the assembly processes and materials, and in the sealing environment and process. This paper discusses a number of these issues and provides information on approaches being taken or proposed to address them.

  4. SOI silicon on glass for optical MEMS

    DEFF Research Database (Denmark)

    Larsen, Kristian Pontoppidan; Ravnkilde, Jan Tue; Hansen, Ole

    2003-01-01

    A newly developed fabrication method for fabrication of single crystalline Si (SCS) components on glass, utilizing Deep Reactive Ion Etching (DRIE) of a Silicon On Insulator (SOI) wafer is presented. The devices are packaged at wafer level in a glass-silicon-glass (GSG) stack by anodic bonding...... and a final sealing at the interconnects can be performed using a suitable polymer. Packaged MEMS on glass are advantageous within Optical MEMS and for sensitive capacitive devices. We report on experiences with bonding SOI to Pyrex. Uniform DRIE shallow and deep etching was achieved by a combination...... of an optimized device layout and an optimized process recipe. The behavior of the buried oxide membrane when used as an etch stop for the through-hole etch is described. No harmful buckling or fracture of the membrane is observed for an oxide thickness below 1 μm, but larger and more fragile released structures...

  5. Giant Piezoelectricity on Si for Hyperactive MEMS

    Science.gov (United States)

    Baek, S. H.; Park, J.; Kim, D. M.; Aksyuk, V. A.; Das, R. R.; Bu, S. D.; Felker, D. A.; Lettieri, J.; Vaithyanathan, V.; Bharadwaja, S. S. N.; Bassiri-Gharb, N.; Chen, Y. B.; Sun, H. P.; Folkman, C. M.; Jang, H. W.; Kreft, D. J.; Streiffer, S. K.; Ramesh, R.; Pan, X. Q.; Trolier-McKinstry, S.; Schlom, D. G.; Rzchowski, M. S.; Blick, R. H.; Eom, C. B.

    2011-11-01

    Microelectromechanical systems (MEMS) incorporating active piezoelectric layers offer integrated actuation, sensing, and transduction. The broad implementation of such active MEMS has long been constrained by the inability to integrate materials with giant piezoelectric response, such as Pb(Mg1/3Nb2/3)O3-PbTiO3 (PMN-PT). We synthesized high-quality PMN-PT epitaxial thin films on vicinal (001) Si wafers with the use of an epitaxial (001) SrTiO3 template layer with superior piezoelectric coefficients (e31,f = -27 ± 3 coulombs per square meter) and figures of merit for piezoelectric energy-harvesting systems. We have incorporated these heterostructures into microcantilevers that are actuated with extremely low drive voltage due to thin-film piezoelectric properties that rival bulk PMN-PT single crystals. These epitaxial heterostructures exhibit very large electromechanical coupling for ultrasound medical imaging, microfluidic control, mechanical sensing, and energy harvesting.

  6. Image Registration for Stability Testing of MEMS

    Science.gov (United States)

    Memarsadeghi, Nargess; LeMoigne, Jacqueline; Blake, Peter N.; Morey, Peter A.; Landsman, Wayne B.; Chambers, Victor J.; Moseley, Samuel H.

    2011-01-01

    Image registration, or alignment of two or more images covering the same scenes or objects, is of great interest in many disciplines such as remote sensing, medical imaging. astronomy, and computer vision. In this paper, we introduce a new application of image registration algorithms. We demonstrate how through a wavelet based image registration algorithm, engineers can evaluate stability of Micro-Electro-Mechanical Systems (MEMS). In particular, we applied image registration algorithms to assess alignment stability of the MicroShutters Subsystem (MSS) of the Near Infrared Spectrograph (NIRSpec) instrument of the James Webb Space Telescope (JWST). This work introduces a new methodology for evaluating stability of MEMS devices to engineers as well as a new application of image registration algorithms to computer scientists.

  7. MEMS Gyroscopes Based on Acoustic Sagnac Effect

    Directory of Open Access Journals (Sweden)

    Yuanyuan Yu

    2016-12-01

    Full Text Available This paper reports on the design, fabrication and preliminary test results of a novel microelectromechanical systems (MEMS device—the acoustic gyroscope. The unique operating mechanism is based on the “acoustic version” of the Sagnac effect in fiber-optic gyros. The device measures the phase difference between two sound waves traveling in opposite directions, and correlates the signal to the angular velocity of the hosting frame. As sound travels significantly slower than light and develops a larger phase change within the same path length, the acoustic gyro can potentially outperform fiber-optic gyros in sensitivity and form factor. It also promises superior stability compared to vibratory MEMS gyros as the design contains no moving parts and is largely insensitive to mechanical stress or temperature. We have carried out systematic simulations and experiments, and developed a series of processes and design rules to implement the device.

  8. Giant piezoelectricity on Si for hyperactive MEMS.

    Science.gov (United States)

    Baek, S H; Park, J; Kim, D M; Aksyuk, V A; Das, R R; Bu, S D; Felker, D A; Lettieri, J; Vaithyanathan, V; Bharadwaja, S S N; Bassiri-Gharb, N; Chen, Y B; Sun, H P; Folkman, C M; Jang, H W; Kreft, D J; Streiffer, S K; Ramesh, R; Pan, X Q; Trolier-McKinstry, S; Schlom, D G; Rzchowski, M S; Blick, R H; Eom, C B

    2011-11-18

    Microelectromechanical systems (MEMS) incorporating active piezoelectric layers offer integrated actuation, sensing, and transduction. The broad implementation of such active MEMS has long been constrained by the inability to integrate materials with giant piezoelectric response, such as Pb(Mg(1/3)Nb(2/3))O(3)-PbTiO(3) (PMN-PT). We synthesized high-quality PMN-PT epitaxial thin films on vicinal (001) Si wafers with the use of an epitaxial (001) SrTiO(3) template layer with superior piezoelectric coefficients (e(31,f) = -27 ± 3 coulombs per square meter) and figures of merit for piezoelectric energy-harvesting systems. We have incorporated these heterostructures into microcantilevers that are actuated with extremely low drive voltage due to thin-film piezoelectric properties that rival bulk PMN-PT single crystals. These epitaxial heterostructures exhibit very large electromechanical coupling for ultrasound medical imaging, microfluidic control, mechanical sensing, and energy harvesting.

  9. Cell Culture on MEMS Platforms: A Review

    Science.gov (United States)

    Ni, Ming; Tong, Wen Hao; Choudhury, Deepak; Rahim, Nur Aida Abdul; Iliescu, Ciprian; Yu, Hanry

    2009-01-01

    Microfabricated systems provide an excellent platform for the culture of cells, and are an extremely useful tool for the investigation of cellular responses to various stimuli. Advantages offered over traditional methods include cost-effectiveness, controllability, low volume, high resolution, and sensitivity. Both biocompatible and bio-incompatible materials have been developed for use in these applications. Biocompatible materials such as PMMA or PLGA can be used directly for cell culture. However, for bio-incompatible materials such as silicon or PDMS, additional steps need to be taken to render these materials more suitable for cell adhesion and maintenance. This review describes multiple surface modification strategies to improve the biocompatibility of MEMS materials. Basic concepts of cell-biomaterial interactions, such as protein adsorption and cell adhesion are covered. Finally, the applications of these MEMS materials in Tissue Engineering are presented. PMID:20054478

  10. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.

    2017-10-05

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams. In that context, embodiments of gas-triggered MEMS microbeam sensors and switches are described. The microbeam devices can be coated with a Metal-Organic Framework to achieve high sensitivity. For gas sensing, an amplitude-based tracking algorithm can be used to quantify an amount of gas captured by the devices according to frequency shift. Noise analysis is also conducted according to the embodiments, which shows that the microbeam devices have high stability against thermal noise. The microbeam devices are also suitable for the generation of binary sensing information for alarming, for example.

  11. Monitoring probe for groundwater flow

    Science.gov (United States)

    Looney, B.B.; Ballard, S.

    1994-08-23

    A monitoring probe for detecting groundwater migration is disclosed. The monitor features a cylinder made of a permeable membrane carrying an array of electrical conductivity sensors on its outer surface. The cylinder is filled with a fluid that has a conductivity different than the groundwater. The probe is placed in the ground at an area of interest to be monitored. The fluid, typically saltwater, diffuses through the permeable membrane into the groundwater. The flow of groundwater passing around the permeable membrane walls of the cylinder carries the conductive fluid in the same general direction and distorts the conductivity field measured by the sensors. The degree of distortion from top to bottom and around the probe is precisely related to the vertical and horizontal flow rates, respectively. The electrical conductivities measured by the sensors about the outer surface of the probe are analyzed to determine the rate and direction of the groundwater flow. 4 figs.

  12. Investigating ESD sensitivity in electrostatic SiGe MEMS

    International Nuclear Information System (INIS)

    Sangameswaran, Sandeep; De Coster, Jeroen; Linten, Dimitri; Scholz, Mirko; Thijs, Steven; Groeseneken, Guido; De Wolf, Ingrid

    2010-01-01

    The sensitivity of electrostatically actuated SiGe microelectromechanical systems to electrostatic discharge events has been investigated in this paper. Torsional micromirrors and RF microelectromechanical systems (MEMS) actuators have been used as two case studies to perform this study. On-wafer electrostatic discharge (ESD) measurement methods, such as the human body model (HBM) and machine model (MM), are discussed. The impact of HBM ESD zap tests on the functionality and behavior of MEMS is explained and the ESD failure levels of MEMS have been verified by failure analysis. It is demonstrated that electrostatic MEMS devices have a high sensitivity to ESD and that it is essential to protect them.

  13. Review on the Modeling of Electrostatic MEMS

    Directory of Open Access Journals (Sweden)

    Wan-Chun Chuang

    2010-06-01

    Full Text Available Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analysis complex and complicated. This article introduces the physical model of pull-in voltage, dynamic characteristic analysis, air damping effect, reliability, numerical modeling method, and application of electrostatic-driven MEMS devices.

  14. Different grades MEMS accelerometers error characteristics

    Science.gov (United States)

    Pachwicewicz, M.; Weremczuk, J.

    2017-08-01

    The paper presents calibration effects of two different MEMS accelerometers of different price and quality grades and discusses different accelerometers errors types. The calibration for error determining is provided by reference centrifugal measurements. The design and measurement errors of the centrifuge are discussed as well. It is shown that error characteristics of the sensors are very different and it is not possible to use simple calibration methods presented in the literature in both cases.

  15. Ultra-compact MEMS FTIR spectrometer

    Science.gov (United States)

    Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa

    2017-05-01

    Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

  16. Thermoelectrical Generator for a MEMS-Fuze

    OpenAIRE

    A. K. Efremov; K. V. Vlasov

    2015-01-01

    The structure of modern fuzes includes micro-electromechanical systems (MEMS), which have such advanced devices as micro-accelerometers and micro-switches, being triggered at a specified level of setback. Independent power source (PS), as an inherent part of the MEMSfuze, charges an energy storage unit during the shot and triggers the fuze firing circuit when the shell encounters the target. Operating level of the control signal should be achieved within the time of remote arming, determined ...

  17. Movable MEMS Devices on Flexible Silicon

    KAUST Repository

    Ahmed, Sally

    2013-05-05

    Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS actuators and sensors can play critical role to extend the application areas of flexible electronics, fabricating movable MEMS devices on flexible substrates is highly challenging. Therefore, this thesis reports a process for fabricating free standing and movable MEMS devices on flexible silicon substrates; MEMS flexure thermal actuators have been fabricated to illustrate the viability of the process. Flexure thermal actuators consist of two arms: a thin hot arm and a wide cold arm separated by a small air gap; the arms are anchored to the substrate from one end and connected to each other from the other end. The actuator design has been modified by adding etch holes in the anchors to suit the process of releasing a thin layer of silicon from the bulk silicon substrate. Selecting materials that are compatible with the release process was challenging. Moreover, difficulties were faced in the fabrication process development; for example, the structural layer of the devices was partially etched during silicon release although it was protected by aluminum oxide which is not attacked by the releasing gas . Furthermore, the thin arm of the thermal actuator was thinned during the fabrication process but optimizing the patterning and etching steps of the structural layer successfully solved this problem. Simulation was carried out to compare the performance of the original and the modified designs for the thermal actuators and to study stress and temperature distribution across a device. A fabricated thermal actuator with a 250 μm long hot arm and a 225 μm long cold arm separated by a 3 μm gap produced a deflection of 3 μm before silicon release, however, the fabrication process must be optimized to obtain fully functioning

  18. Fractal Structures For Fixed Mems Capacitors

    KAUST Repository

    Elshurafa, Amro M.

    2014-08-28

    An embodiment of a fractal fixed capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure. The capacitor body has a first plate with a fractal shape separated by a horizontal distance from a second plate with a fractal shape. The first plate and the second plate are within the same plane. Such a fractal fixed capacitor further comprises a substrate above which the capacitor body is positioned.

  19. On the Stiction of MEMS Materials

    DEFF Research Database (Denmark)

    Zhuang, Yanxin; Menon, Aric Kumaran

    2005-01-01

    energies and stiction of commonly used MEMS materials by contact angle measurements and atomic force microscopy (AFM). Dispersive and polar components of surface energies are calculated by Owens-Wendt-Rabel-Kaelble method. Silicon and silicon-related materials have higher polar surface energies than SU-8...... been shown that the materials with higher surface energy have higher sticton/adhesion forces. The topography of surface influences the contact angle and stiction, and is also discussed in the paper....

  20. Solid polymer MEMS-based fuel cells

    Science.gov (United States)

    Jankowski, Alan F [Livermore, CA; Morse, Jeffrey D [Pleasant Hill, CA

    2008-04-22

    A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

  1. The challenge of reliability in MEMS commercialization

    Energy Technology Data Exchange (ETDEWEB)

    Miller, W.M.; Tanner, D.M.; Miller, S.L.

    1998-09-01

    MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost-effective solutions only if MEMS is demonstrated to be sufficiently reliable. This could prove to be a major challenge if it is not addressed concurrently with technology development. There are three requirements for a valid assessment of reliability: statistical significance, identification of fundamental failure mechanisms and development of techniques for accelerating them, and valid physical models to allow prediction of failures during actual use. While these already exist for the microelectronics portion of such integrated systems, the real challenge lies in the less well-understood micromachine portions and its synergistic effects with microelectronics. This requires the elicitation of a methodology focused on MEMS reliability, which the authors discuss. A new testing and analysis infrastructure must also be developed to meet the needs of this methodology. They describe their implementation of this infrastructure and its success in addressing the three requirements for a valid reliability assessment.

  2. An Opto-MEMS Multiobject Spectrograph

    Science.gov (United States)

    Kearney, K.; Ninkov, Z.; Zwarg, D.

    2000-05-01

    Optical MEMS (Micro-Electro-Mechanical-Structures) are an enabling technology for a new class of optical instrumentation designs. An opto-MEMS device consists of an array of microfabricated structures, each of which modulates the phase and/or amplitude of an incident light beam. Typically the devices consist of an array of moveable micromirrors - each of which reflects an incident beam in a unique direction (tilt), or with a unique phase shift (piston). One widely available opto-MEMS device is the Texas Instruments' Digital Micromirror Device (DMD). The DMD is an array of 16 micron x 16 micron square mirrors postioned on a 17 micron pitch. Each mirror can tilt +/- 10 degrees from the normal - reflecting a normally incident light beam +/- 20 degrees. By positioning the DMD in an intermediate image plane in an optical system, portions of the image can be directed into- or out-of the input pupil of the follow-on imaging optics. RIT is utilizing the DMD to construct a prototype multiobject spectrograph (RIT-MOS) for visible observations with terrestrial telescopes. The DMD array replaces the input slit of an imaging spectrograph, forming a 'virtual', programmable slit assembly. By acquiring a pre-image of the astronomical field, it is possible to select a multidude of objects, and to program the DMD to pass only those objects into the input optics of the imaging spectrograph. We will report on the design and characterizatotion of the RIT-MOS, as well as preliminary imaging results.

  3. Heterogeneous MEMS device assembly and integration

    Science.gov (United States)

    Topart, Patrice; Picard, Francis; Ilias, Samir; Alain, Christine; Chevalier, Claude; Fisette, Bruno; Paultre, Jacques E.; Généreux, Francis; Legros, Mathieu; Lepage, Jean-François; Laverdière, Christian; Ngo Phong, Linh; Caron, Jean-Sol; Desroches, Yan

    2014-03-01

    In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of different functionalities or multi-technology (i.e. wafer) approaches to fabricate and assemble devices respectively. This paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous assembly at chip and package-level. First, the performance of a giant (e.g. about 3 mm in diameter), electrostatically actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within an angular cone of up to 60° in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To achieve such angular performance relative to mirror size, the microassembly was performed from sub-components fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was flip-chipped onto a 256×1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the microassembly technology, performance results of packaged devices are presented. Finally, to simulate a 3072×3 pixel uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512×3 pixel FPAs with a less than 50 micron pixel co-registration is reported.

  4. A nuclear micro battery for Mems devices

    International Nuclear Information System (INIS)

    Lal, A.; Bilbao Y Leon, R.M.; Guo, H.; Li, H.; Santanam, S.; Yao, R.; Blanchard, J.; Henderson, D.

    2001-01-01

    Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include alpha and low-energy beta emitters. The sources are in both solid and liquid form, and a technique for plating a solid source from a liquid source has been investigated. Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. Performance results are provided for each of these concepts. (authors)

  5. MEMS and the direct detection of exoplanets

    Science.gov (United States)

    Thomas, Sandrine J.; Macintosh, Bruce; Belikov, Ruslan

    2014-03-01

    Deformable mirrors, and particularly MEMS, are crucial components for the direct imaging of exoplanets for both ground-based and space-based instruments. Without deformable mirrors, coronagraphs are incapable of reaching contrasts required to image Jupiter-like planets. The system performance is limited by image quality degradation resulting from wavefront error introduced from multiple effects including: atmospheric turbulence, static aberrations in the system, non-common-path aberrations, all of which vary with time. Correcting for these effects requires a deformable mirror with fast response and numerous actuators having moderate stroke. Not only do MEMS devices fulfill this requirement but their compactness permits their application in numerous space- and ground-based instruments, which are often volume- and mass-limited. In this paper, I will briefly explain how coronagraphs work and their requirements. I then will discuss the Extreme Adaptive Optics needed to compensate for the introduced wavefront error and how MEMS devices are a good choice to achieve the performance needed to produce the contrasts necessary to detect exoplanets. As examples, I will discuss a facility instrument for the Gemini Observatory, called the Gemini Planet Imager, that will detect Jupiter-like planets and present recent results from the NASA Ames Coronagraph Experiment laboratory, in the context of a proposed space- based mission called EXCEDE. EXCEDE is planned to focus on protoplanetary disks.

  6. MEMS Micro-Valve for Space Applications

    Science.gov (United States)

    Chakraborty, I.; Tang, W. C.; Bame, D. P.; Tang, T. K.

    1998-01-01

    We report on the development of a Micro-ElectroMechanical Systems (MEMS) valve that is designed to meet the rigorous performance requirements for a variety of space applications, such as micropropulsion, in-situ chemical analysis of other planets, or micro-fluidics experiments in micro-gravity. These systems often require very small yet reliable silicon valves with extremely low leak rates and long shelf lives. Also, they must survive the perils of space travel, which include unstoppable radiation, monumental shock and vibration forces, as well as extreme variations in temperature. Currently, no commercial MEMS valve meets these requirements. We at JPL are developing a piezoelectric MEMS valve that attempts to address the unique problem of space. We begin with proven configurations that may seem familiar. However, we have implemented some major design innovations that should produce a superior valve. The JPL micro-valve is expected to have an extremely low leak rate, limited susceptibility to particulates, vibration or radiation, as well as a wide operational temperature range.

  7. Low voltage RF MEMS variable capacitor with linear C-V response

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-23

    An RF MEMS variable capacitor, fabricated in the PolyMUMPS process and tuned electrostatically, possessing a linear capacitance-voltage response is reported. The measured quality factor of the device was 17 at 1GHz, while the tuning range was 1.2:1 and was achieved at an actuation DC voltage of 8V only. Further, the linear regression coefficient was 0.98. The variable capacitor was created such that it has both vertical and horizontal capacitances present. As the top suspended plate moves towards the bottom fixed plate, the vertical capacitance increases whereas the horizontal capacitance decreases simultaneously such that the sum of the two capacitances yields a linear capacitance-voltage relation. © 2012 The Institution of Engineering and Technology.

  8. Design and simulation of MEMS microvalves for silicon photonic biosensor chip

    Science.gov (United States)

    Amemiya, Yoshiteru; Nakashima, Yuuto; Maeda, Jun; Yokoyama, Shin

    2018-04-01

    For the early and easy diagnosis of diseases, we have proposed a silicon photonic biosensor chip with two kinds of MEMS microvalves for a multiple-item detection system. The driving voltage of the vertical type with the circular-plate capacitor structure and that of the lateral type with the comb-shaped electrode are investigated. From mechanical calculations, the driving voltage of the vertical type is estimated to be 30 V and that of the lateral type to be 15 V. The propagation loss at the intersecting waveguides of arrayed ring-resonator biosensors is also estimated. In the case of optimized intersecting waveguides, more than 67% transmittance of TE-mode light is simulated for the series connection of 20 intersecting waveguides. It is confirmed that it is possible to fabricate an 8 × 12 arrayed biosensor chip in an area of 1 × 1.5 mm2 taking the device size of the microvalves into consideration. We have, for the first time, designed a whole system, including sensors and a fluid channel with MEMS microvalves.

  9. Diamond MEMS: wafer scale processing, devices, and technology insertion

    Science.gov (United States)

    Carlisle, J. A.

    2009-05-01

    Diamond has long held the promise of revolutionary new devices: impervious chemical barriers, smooth and reliable microscopic machines, and tough mechanical tools. Yet it's been an outsider. Laboratories have been effectively growing diamond crystals for at least 25 years, but the jump to market viability has always been blocked by the expense of diamond production and inability to integrate with other materials. Advances in chemical vapor deposition (CVD) processes have given rise to a hierarchy of carbon films ranging from diamond-like carbon (DLC) to vapor-deposited diamond coatings, however. All have pros and cons based on structure and cost, but they all share some of diamond's heralded attributes. The best performer, in theory, is the purest form of diamond film possible, one absent of graphitic phases. Such a material would capture the extreme hardness, high Young's modulus and chemical inertness of natural diamond. Advanced Diamond Technologies Inc., Romeoville, Ill., is the first company to develop a distinct chemical process to create a marketable phase-pure diamond film. The material, called UNCD® (for ultrananocrystalline diamond), features grain sizes from 3 to 300 nm in size, and layers just 1 to 2 microns thick. With significant advantages over other thin films, UNCD is designed to be inexpensive enough for use in atomic force microscopy (AFM) probes, microelectromechanical machines (MEMS), cell phone circuitry, radio frequency devices, and even biosensors.

  10. DNA probes

    International Nuclear Information System (INIS)

    Castelino, J.

    1992-01-01

    The creation of DNA probes for detection of specific nucleotide segments differs from ligand detection in that it is a chemical rather than an immunological reaction. Complementary DNA or RNA is used in place of the antibody and is labelled with 32 P. So far, DNA probes have been successfully employed in the diagnosis of inherited disorders, infectious diseases, and for identification of human oncogenes. The latest approach to the diagnosis of communicable and parasitic infections is based on the use of deoxyribonucleic acid (DNA) probes. The genetic information of all cells is encoded by DNA and DNA probe approach to identification of pathogens is unique because the focus of the method is the nucleic acid content of the organism rather than the products that the nucleic acid encodes. Since every properly classified species has some unique nucleotide sequences that distinguish it from every other species, each organism's genetic composition is in essence a finger print that can be used for its identification. In addition to this specificity, DNA probes offer other advantages in that pathogens may be identified directly in clinical specimens

  11. Surface tension and buoyancy in vertical soap films

    OpenAIRE

    Adami, Nicolas

    2013-01-01

    This manuscrit presents our experimental works about maintained vertical soap films. The purpose of this thesis was to realize experiments on vertical soap films. We designed a setup which allows to maintain vertical soap films on large timescales. The thickness profiles of those films were characterized using an infrared absorption method. We then designed an elastic sensor in order to probe the surface tension profiles in our films. Simple mechanical considerations allowed us to draw a s...

  12. Eye-safe diode laser Doppler lidar with a MEMS beam-scanner

    DEFF Research Database (Denmark)

    Hu, Qi; Pedersen, Christian; Rodrigo, Peter John

    2016-01-01

    at the probing distance (R = 60 m) of each lineof-sight – relevant for meeting eye-safety requirements. The switching time of the MEMS-SM is measured to be in the order of a few milliseconds. Time-shared (0.25 s per line-of-sight) radial wind speed measurements at 50 Hz data rate are experimentally demonstrated......We present a novel Doppler lidar that employs a cw diode laser operating at 1.5 μm and a micro-electro-mechanical-system scanning mirror (MEMS-SM). In this work, two functionalities of the lidar system are demonstrated. Firstly, we describe the capability to effectively steer the lidar probe beam...... to multiple optical transceivers along separate lines-ofsight. The beam steering functionality is demonstrated using four lines-ofsight – each at an angle of 18° with respect to their symmetry axis. Secondly, we demonstrate the ability to spatially dither the beam focus to reduce the mean irradiance...

  13. Conductivity Probe

    Science.gov (United States)

    2008-01-01

    The Thermal and Electrical Conductivity Probe (TECP) for NASA's Phoenix Mars Lander took measurements in Martian soil and in the air. The needles on the end of the instrument were inserted into the Martian soil, allowing TECP to measure the propagation of both thermal and electrical energy. TECP also measured the humidity in the surrounding air. The needles on the probe are 15 millimeters (0.6 inch) long. The Phoenix Mission is led by the University of Arizona, Tucson, on behalf of NASA. Project management of the mission is by NASA's Jet Propulsion Laboratory, Pasadena, Calif. Spacecraft development is by Lockheed Martin Space Systems, Denver.

  14. RF sputtering: A viable tool for MEMS fabrication

    Indian Academy of Sciences (India)

    In the present work, we report preparation of silicon dioxide, silicon nitride and piezoelec- tric ZnO films by RF sputtering process. The properties of these films relevant for MEMS applications have been evaluated. The application of these films in fabricating basic MEMS structures such as diaphragm, micro-cantilever beams ...

  15. Buffering Implications for the Design Space of Streaming MEMS Storage

    NARCIS (Netherlands)

    Khatib, M.G.; Abelmann, Leon; Preas, Kathy

    2011-01-01

    Emerging nanotechnology-based systems encounter new non-functional requirements. This work addresses MEMS storage, an emerging technology that promises ultrahigh density and energy-efficient storage devices. We study the buffering requirement of MEMS storage in streaming applications. We show that

  16. Shutdown Policies for MEMS-Based Storage Devices -- Analytical Models

    NARCIS (Netherlands)

    Khatib, M.G.; Engelen, Johannes Bernardus Charles; Hartel, Pieter H.

    MEMS-based storage devices should be energy ecient for deployment in mobile systems. Since MEMS-based storage devices have a moving me- dia sled, they should be shut down during periods of inactivity. However, shutdown costs energy, limiting the applicability of aggressive shutdown decisions. The

  17. Development and application of high-end aerospace MEMS

    Science.gov (United States)

    Yuan, Weizheng

    2017-12-01

    This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.

  18. Lubricated MEMS: effect of boundary slippage and texturing

    NARCIS (Netherlands)

    Tauviqirrahman, Mohammad

    2013-01-01

    Many types of micro-electro-mechanical-system (MEMS) based products are currently employed in a variety of applications. Recently, there has been an increase in the demand for higher reliability of MEMS which incorporate moving parts for each intended application. This is because the reliability of

  19. LTCC phase shifter modules for RF-MEMS-switch integration

    NARCIS (Netherlands)

    Bartnitzek, T.; Muller, E.; Dijk, R. van

    2005-01-01

    The European 1ST project ARHMS is covering a wide field of R&D activities with the final goal: a satellite based car communication system with a fiat electronically steerable roof antenna based on RF-MEMS. The required phase shift for beam steering will be done with MEMS switches and RF networks. An

  20. Nonlinear Adaptive Filter for MEMS Gyro Error Cancellation

    Data.gov (United States)

    National Aeronautics and Space Administration — Thermal biases are the dominate error in low-cost low-power small MEMS gyros. CubeSats often can't afford the power/mass to put a heater on their MEMS gyros and...

  1. Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

    Directory of Open Access Journals (Sweden)

    Di Chen

    2007-05-01

    Full Text Available Electrostatic micro-electro-mechanical system (MEMS is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.

  2. RF-MEMS capacitive switches with high reliability

    Science.gov (United States)

    Goldsmith, Charles L.; Auciello, Orlando H.; Carlisle, John A.; Sampath, Suresh; Sumant, Anirudha V.; Carpick, Robert W.; Hwang, James; Mancini, Derrick C.; Gudeman, Chris

    2013-09-03

    A reliable long life RF-MEMS capacitive switch is provided with a dielectric layer comprising a "fast discharge diamond dielectric layer" and enabling rapid switch recovery, dielectric layer charging and discharging that is efficient and effective to enable RF-MEMS switch operation to greater than or equal to 100 billion cycles.

  3. Pollution Probe.

    Science.gov (United States)

    Chant, Donald A.

    This book is written as a statement of concern about pollution by members of Pollution Probe, a citizens' anti-pollution group in Canada. Its purpose is to create public awareness and pressure for the eventual solution to pollution problems. The need for effective government policies to control the population explosion, conserve natural resources,…

  4. Probe specificity

    International Nuclear Information System (INIS)

    Laget, J.M.

    1986-11-01

    Specificity and complementarity of hadron and electron probes must be systematically developed to answer three questions currently asked in intermediate energy nuclear physics: what is nucleus structure at short distances, what is nature of short range correlations, what is three body force nature [fr

  5. Global Vertical Reference Frame

    Czech Academy of Sciences Publication Activity Database

    Burša, Milan; Kenyon, S.; Kouba, J.; Šíma, Zdislav; Vatrt, V.; Vojtíšková, M.

    2004-01-01

    Roč. 33, - (2004), s. 404-407 ISSN 1436-3445 Institutional research plan: CEZ:AV0Z1003909 Keywords : geopotential WO * vertical systems * global vertical frame Subject RIV: BN - Astronomy, Celestial Mechanics, Astrophysics

  6. Real-time analysis for Stochastic errors of MEMS gyro

    Science.gov (United States)

    Miao, Zhiyong; Shi, Hongyang; Zhang, Yi

    2017-10-01

    Since a good knowledge of MEMS gyro stochastic errors is important and critical to MEMS INS/GPS integration system. Therefore, the stochastic errors of MEMS gyro should be accurately modeled and identified. The Allan variance method is IEEE standard method in the filed of analysis stochastic errors of gyro. This kind of method can fully characterize the random character of stochastic errors. However, it requires a large amount of data to be stored, resulting in large offline computational burden. Moreover, it has a painful procedure of drawing slope lines for estimation. To overcome the barriers, a simple linear state-space model was established for MEMS gyro. Then, a recursive EM algorithm was implemented to estimate the stochastic errors of MEMS gyro in real time. The experimental results of ADIS16405 IMU show that the real-time estimations of proposed approach are well within the error limits of Allan variance method. Moreover, the proposed method effectively avoids the storage of data.

  7. Using MEMS Capacitive Switches in Tunable RF Amplifiers

    Directory of Open Access Journals (Sweden)

    Danson John

    2006-01-01

    Full Text Available A MEMS capacitive switch suitable for use in tunable RF amplifiers is described. A MEMS switch is designed, fabricated, and characterized with physical and RF measurements for inclusion in simulations. Using the MEMS switch models, a dual-band low-noise amplifier (LNA operating at GHz and GHz, and a tunable power amplifier (PA at GHz are simulated in m CMOS. MEMS switches allow the LNA to operate with 11 dB of isolation between the two bands while maintaining dB of gain and sub- dB noise figure. MEMS switches are used to implement a variable matching network that allows the PA to realize up to 37% PAE improvement at low input powers.

  8. A nuclear micro battery for Mems devices

    International Nuclear Information System (INIS)

    Blanchard, J.; Lal, A.; Henderson, D.; Bilbao Y Leon, R.; Guo, H.; Li, H.; Santanam, S.; Yao, R.

    2001-01-01

    Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include low-energy beta emitters (solid and liquid) and alpha emitters (solid). Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. In this case, the charged particles emitted from the decay of the radioisotopes are absorbed by a semiconductor and dissipate most of their energy as ionization of the atoms in the solid. The carriers generated in this fashion are in excess of the number permitted by thermodynamic equilibrium and, if they diffuse to the vicinity of a rectifying junction, induce a voltage across the junction. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. As the charge is collected, the deflection of a cantilever beam increases until it contacts a grounded element, thus discharging the beam and causing it to return to its original position. This process will repeat as long as the source is active. One final concept relies on temperature gradients produced by the sources, along with appropriate insulation, to create power using a Peltier device. The source is isolated in order to allow it to reach sufficient temperatures, and the temperature difference between the source and the rest of the device is exploited using the Peltier effect. Performance results will be provided for each of these concepts. (author)

  9. Using MEMS mirrors to pattern electrical forces

    Science.gov (United States)

    Neale, Steven L.; Hsu, Hsan-Yin; Valley, Justin K.; Jamshidi, Arash; Wu, Ming C.

    2009-02-01

    By switching between two tilt angles MEMS mirrors can be used to produce spatial light patterns. This enables the Digital Micromirror Display (DMD, Texas Instruments) chip to produce the images found in some data projectors. In this paper we will show how these images can be converted into electrical patterns. We use the electrical gradients in these patterns to control the movement of particles through dielectrophoresis. We show how this can be used to move cells within PBS solution and characterize our device. We also discuss possible ways to improve our optical setup through Adaptive Optics (AO).

  10. MEMS-Reconfigurable Metamaterials and Antenna Applications

    Directory of Open Access Journals (Sweden)

    Tomislav Debogovic

    2014-01-01

    Full Text Available This paper reviews some of our contributions to reconfigurable metamaterials, where dynamic control is enabled by microelectromechanical systems (MEMS technology. First, we show reconfigurable composite right-/left-handed transmission lines (CRLH-TLs having state of the art phase velocity variation and loss, thereby enabling efficient reconfigurable phase shifters and leaky-wave antennas (LWA. Second, we present very low loss metasurface designs with reconfigurable reflection properties, applicable in reflectarrays and partially reflective surface (PRS antennas. All the presented devices have been fabricated and experimentally validated. They operate in X- and Ku-bands.

  11. Prospects for MEMS in the Automotive Industry

    Directory of Open Access Journals (Sweden)

    Richard DIXON

    2007-12-01

    Full Text Available An automotive sector as a growth market for MEMS sensors is analyzed in the article. The automotive sector accounted for $1.6 billion, making this the second biggest opportunity after IT peripherals and inkjet print heads. By 2011 the market will top $2.2 billion, a CAGR of around 7%. The main applications in revenues terms are, in order, pressure sensors, gyroscopes, accelerometers and flow sensors and this will remain so for the foreseeable future. Automotive companies are forced to innovate as a result of competition and price pressures.

  12. Vertical axis wind turbines

    Science.gov (United States)

    Krivcov, Vladimir [Miass, RU; Krivospitski, Vladimir [Miass, RU; Maksimov, Vasili [Miass, RU; Halstead, Richard [Rohnert Park, CA; Grahov, Jurij [Miass, RU

    2011-03-08

    A vertical axis wind turbine is described. The wind turbine can include a top ring, a middle ring and a lower ring, wherein a plurality of vertical airfoils are disposed between the rings. For example, three vertical airfoils can be attached between the upper ring and the middle ring. In addition, three more vertical airfoils can be attached between the lower ring and the middle ring. When wind contacts the vertically arranged airfoils the rings begin to spin. By connecting the rings to a center pole which spins an alternator, electricity can be generated from wind.

  13. MEMS-BASED 3D CONFOCAL SCANNING MICROENDOSCOPE USING MEMS SCANNERS FOR BOTH LATERAL AND AXIAL SCAN.

    Science.gov (United States)

    Liu, Lin; Wang, Erkang; Zhang, Xiaoyang; Liang, Wenxuan; Li, Xingde; Xie, Huikai

    2014-08-15

    A fiber-optic 3D confocal scanning microendoscope employing MEMS scanners for both lateral and axial scan was designed and constructed. The MEMS 3D scan engine achieved a lateral scan range of over ± 26° with a 2D MEMS scanning micromirror and a depth scan of over 400 μm with a 1D MEMS tunable microlens. The lateral resolution and axial resolution of this system were experimentally measured as 1.0 μm and 7.0 μm, respectively. 2D and 3D confocal reflectance images of micro-patterns, micro-particles, onion skins and acute rat brain tissue were obtained by this MEMS-based 3D confocal scanning microendoscope.

  14. Modulated microwave microscopy and probes used therewith

    Science.gov (United States)

    Lai, Keji; Kelly, Michael; Shen, Zhi-Xun

    2012-09-11

    A microwave microscope including a probe tip electrode vertically positionable over a sample and projecting downwardly from the end of a cantilever. A transmission line connecting the tip electrode to the electronic control system extends along the cantilever and is separated from a ground plane at the bottom of the cantilever by a dielectric layer. The probe tip may be vertically tapped near or at the sample surface at a low frequency and the microwave signal reflected from the tip/sample interaction is demodulated at the low frequency. Alternatively, a low-frequency electrical signal is also a non-linear electrical element associated with the probe tip to non-linearly interact with the applied microwave signal and the reflected non-linear microwave signal is detected at the low frequency. The non-linear element may be semiconductor junction formed near the apex of the probe tip or be an FET formed at the base of a semiconducting tip.

  15. MEMS Integrated Submount Alignment for Optoelectronics

    Science.gov (United States)

    Shakespeare, W. Jeffrey; Pearson, Raymond A.; Grenestedt, Joachim L.; Hutapea, Parsaoran; Gupta, Vikas

    2005-02-01

    One of the most expensive and time-consuming production processes for single-mode fiber-optic components is the alignment of the photonic chip or waveguide to the fiber. The alignment equipment is capital intensive and usually requires trained technicians to achieve desired results. Current technology requires active alignment since tolerances are only ~0.2 μ m or less for a typical laser diode. This is accomplished using piezoelectric actuated stages and active optical feedback. Joining technologies such as soldering, epoxy bonding, or laser welding may contribute significant postbond shift, and final coupling efficiencies are often less than 80%. This paper presents a method of adaptive optical alignment to freeze in place directly on an optical submount using a microelectromechanical system (MEMS) shape memory alloy (SMA) actuation technology. Postbond shift is eliminated since the phase change is the alignment actuation. This technology is not limited to optical alignment but can be applied to a variety of MEMS actuations, including nano-actuation and nano-alignment for biomedical applications. Experimental proof-of-concept results are discussed, and a simple analytical model is proposed to predict the stress strain behavior of the optical submount. Optical coupling efficiencies and alignment times are compared with traditional processes. The feasibility of this technique in high-volume production is discussed.

  16. Frequency adjustable MEMS vibration energy harvester

    Science.gov (United States)

    Podder, P.; Constantinou, P.; Amann, A.; Roy, S.

    2016-10-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators.

  17. Frequency adjustable MEMS vibration energy harvester

    International Nuclear Information System (INIS)

    Podder, P; Constantinou, P; Roy, S; Amann, A

    2016-01-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators. (paper)

  18. Piezoelectric Zinc Oxide Based MEMS Acoustic Sensor

    Directory of Open Access Journals (Sweden)

    Aarti Arora

    2008-04-01

    Full Text Available An acoustic sensors exhibiting good sensitivity was fabricated using MEMS technology having piezoelectric zinc oxide as a dielectric between two plates of capacitor. Thin film zinc oxide has structural, piezoelectric and optical properties for surface acoustic wave (SAW and bulk acoustic wave (BAW devices. Oxygen effficient films are transparent and insulating having wide applications for sensors and transducers. A rf sputtered piezoelectric ZnO layer transforms the mechanical deflection of a thin etched silicon diaphragm into a piezoelectric charge. For 25-micron thin diaphragm Si was etched in tetramethylammonium hydroxide solution using bulk micromachining. This was followed by deposition of sandwiched structure composed of bottom aluminum electrode, sputtered 3 micron ZnO film and top aluminum electrode. A glass having 1 mm diameter hole was bonded on backside of device to compensate sound pressure in side the cavity. The measured value of central capacitance and dissipation factor of the fabricated MEMS acoustic sensor was found to be 82.4pF and 0.115 respectively, where as the value of ~176 pF was obtained for the rim capacitance with a dissipation factor of 0.138. The response of the acoustic sensors was reproducible for the devices prepared under similar processing conditions under different batches. The acoustic sensor was found to be working from 30Hz to 8KHz with a sensitivity of 139µV/Pa under varying acoustic pressure.

  19. The Development of the Differential MEMS Vector Hydrophone.

    Science.gov (United States)

    Zhang, Guojun; Liu, Mengran; Shen, Nixin; Wang, Xubo; Zhang, Wendong

    2017-06-08

    To solve the problem that MEMS vector hydrophones are greatly interfered with by the vibration of the platform and flow noise in applications, this paper describes a differential MEMS vector hydrophone that could simultaneously receive acoustic signals and reject acceleration signals. Theoretical and simulation analyses have been carried out. Lastly, a prototype of the differential MEMS vector hydrophone has been created and tested using a standing wave tube and a vibration platform. The results of the test show that this hydrophone has a high sensitivity, M v = -185 dB (@ 500 Hz, 0 dB reference 1 V/μPa), which is almost the same as the previous MEMS vector hydrophones, and has a low acceleration sensitivity, M v = -58 dB (0 dB reference 1 V/g), which has decreased by 17 dB compared with the previous MEMS vector hydrophone. The differential MEMS vector hydrophone basically meets the requirements of acoustic vector detection when it is rigidly fixed to a working platform, which lays the foundation for engineering applications of MEMS vector hydrophones.

  20. Shifting the Intertial Navigation Paradigm with the MEMS Technology

    Science.gov (United States)

    Crain, Timothy P., II; Bishop, Robert H.; Brady, Tye

    2010-01-01

    "Why don't you use MEMS?" is of the most common questions posed to navigation systems engineers designing inertial navigation solutions in the modern era. The question stems from a general understanding that great strides have been made in terrestrial MEMS accelerometers and attitude rate sensors in terms of accuracy, mass, and power. Yet, when compared on a unit-to-unit basis, MEMS devices do not provide comparable performance (accuracy) to navigation grade sensors in several key metrics. This paper will propose a paradigm shift where the comparison in performance is between multiple MEMS devices and a single navigation grade sensor. The concept is that systematically, a sufficient number of MEMS sensors may mathematically provide comparable performance to a single navigation grade device and be competitive in terms power and mass allocations when viewed on a systems level. The implication is that both inertial navigation system design and fault detection, identification, and recovery could benefit from a system of MEMS devices in the same way that swarm sensing has benefited Earth observation and astronomy. A survey of the state of the art in inertial sensor accuracy scaled by mass and power will be provided to show the scaled error in MEMS and navigation graded devices, a mathematical comparison of multi-unit to single-unit sensor errors will be developed, and preliminary application to an Orion lunar skip atmospheric entry trajectory will be explored.

  1. Shifting the Inertial Navigation Paradigm with MEMS Technology

    Science.gov (United States)

    Crain, Timothy; Brady, Tye; Bishop, Robert H.

    2010-01-01

    Why don t you use MEMS? is one of the most common questions posed to navigation systems engineers designing inertial navigation solutions in the modern era. The question stems from a general understanding that great strides have been made in terrestrial MEMS accelerometers and attitude rate sensors in terms of accuracy, mass, and power. Yet, when compared on a unit-to-unit basis, MEMS devices do not provide comparable performance (accuracy) to navigation grade sensors. This paper will propose a paradigm shift where the comparison in performance is between multiple MEMS devices and a single navigation grade sensor. The concept is that systematically, a sufficient number of MEMS sensors may mathematically provide comparable performance to a single navigation grade device and be competitive in terms power and mass allocations when viewed on a systems level. The implication is that both inertial navigation system design and fault detection, identification, and recovery could benefit from a system of MEMS devices in the same way that swarm sensing has benefited Earth observation and astronomy. A survey of the state of the art in inertial sensor accuracy scaled by mass and power will be provided to show the specific error in MEMS and navigation graded devices, a mathematical comparison of multi-unit to single-unit sensor errors will be developed, and preliminary applications to Constellation vehicles will be explored.

  2. Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

    KAUST Repository

    Agrawal, Richa

    2015-05-18

    The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

  3. Progress of MEMS Scanning Micromirrors for Optical Bio-Imaging

    Directory of Open Access Journals (Sweden)

    Lih Y. Lin

    2015-11-01

    Full Text Available Microelectromechanical systems (MEMS have an unmatched ability to incorporate numerous functionalities into ultra-compact devices, and due to their versatility and miniaturization, MEMS have become an important cornerstone in biomedical and endoscopic imaging research. To incorporate MEMS into such applications, it is critical to understand underlying architectures involving choices in actuation mechanism, including the more common electrothermal, electrostatic, electromagnetic, and piezoelectric approaches, reviewed in this paper. Each has benefits and tradeoffs and is better suited for particular applications or imaging schemes due to achievable scan ranges, power requirements, speed, and size. Many of these characteristics are fabrication-process dependent, and this paper discusses various fabrication flows developed to integrate additional optical functionality beyond simple lateral scanning, enabling dynamic control of the focus or mirror surface. Out of this provided MEMS flexibility arises some challenges when obtaining high resolution images: due to scanning non-linearities, calibration of MEMS scanners may become critical, and inherent image artifacts or distortions during scanning can degrade image quality. Several reviewed methods and algorithms have been proposed to address these complications from MEMS scanning. Given their impact and promise, great effort and progress have been made toward integrating MEMS and biomedical imaging.

  4. The Development of the Differential MEMS Vector Hydrophone

    Directory of Open Access Journals (Sweden)

    Guojun Zhang

    2017-06-01

    Full Text Available To solve the problem that MEMS vector hydrophones are greatly interfered with by the vibration of the platform and flow noise in applications, this paper describes a differential MEMS vector hydrophone that could simultaneously receive acoustic signals and reject acceleration signals. Theoretical and simulation analyses have been carried out. Lastly, a prototype of the differential MEMS vector hydrophone has been created and tested using a standing wave tube and a vibration platform. The results of the test show that this hydrophone has a high sensitivity, Mv = −185 dB (@ 500 Hz, 0 dB reference 1 V/μPa, which is almost the same as the previous MEMS vector hydrophones, and has a low acceleration sensitivity, Mv = −58 dB (0 dB reference 1 V/g, which has decreased by 17 dB compared with the previous MEMS vector hydrophone. The differential MEMS vector hydrophone basically meets the requirements of acoustic vector detection when it is rigidly fixed to a working platform, which lays the foundation for engineering applications of MEMS vector hydrophones.

  5. Vertical transmission of channel catfish virus.

    Science.gov (United States)

    Wise, J A; Harrell, S F; Busch, R L; Boyle, J A

    1988-09-01

    Channel catfish broodfish were examined nondestructively for the presence of channel catfish virus (CCV), using a nucleic acid-probing technique. A dot blot assay was tested and shown to be accurate and rapid in the diagnosis of CCV. Two CCV-positive fish were successfully mated, and fertilized eggs were collected. Offspring that hatched were tested and were shown to have CCV. This result indicated vertical transmission of CCV, a herpesvirus.

  6. A method for manufacturing a hollow mems structure

    DEFF Research Database (Denmark)

    2017-01-01

    The present invention relates to a method for manufacturing an at least partly hollow MEMS structure. In a first step one or more through-going openings is/are provided in core material. The one or more through-going openings is/are then covered by an etch-stop layer. After this step, a bottom...... further comprises the step of creating bottom and top conductors in the respective bottom and top layers. Finally, excess core material is removed in order to create the at least partly hollow MEMS structure which may include a MEMS inductor....

  7. Mathematical analysis of partial differential equations modeling electrostatic MEMS

    CERN Document Server

    Esposito, Pierpaolo; Guo, Yujin

    2010-01-01

    Micro- and nanoelectromechanical systems (MEMS and NEMS), which combine electronics with miniature-size mechanical devices, are essential components of modern technology. It is the mathematical model describing "electrostatically actuated" MEMS that is addressed in this monograph. Even the simplified models that the authors deal with still lead to very interesting second- and fourth-order nonlinear elliptic equations (in the stationary case) and to nonlinear parabolic equations (in the dynamic case). While nonlinear eigenvalue problems-where the stationary MEMS models fit-are a well-developed

  8. Differential RF MEMS interwoven capacitor immune to residual stress warping

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-27

    A RF MEMS capacitor with an interwoven structure is designed, fabricated in the PolyMUMPS process and tested in an effort to address fabrication challenges usually faced in MEMS processes. The interwoven structure was found to offer several advantages over the typical MEMS parallel-plate design including eliminating the warping caused by residual stress, eliminating the need for etching holes, suppressing stiction, reducing parasitics and providing differential capability. The quality factor of the proposed capacitor was higher than five throughout a 2–10 GHz range and the resonant frequency was in excess of 20 GHz.

  9. High Volume Manufacturing and Field Stability of MEMS Products

    Science.gov (United States)

    Martin, Jack

    Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are

  10. The Sandia MEMS passive shock sensor : FY07 maturation activities.

    Energy Technology Data Exchange (ETDEWEB)

    Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

    2008-08-01

    This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

  11. Millorar la memòria amb adrenalina

    OpenAIRE

    Portell Cortés, Isabel

    2010-01-01

    Aquesta recerca ha estudiat la influència positiva de l'adrenalina sobre la memòria de reconeixement, en concret per a la identitat i la localització d'un objecte determinat. Aquesta hormona afecta la manera en què el cervell guarda els records. Usant models animals de laboratori, s'ha pogut observar que l'administració d'adrenalina, després de l'entrenament de memòria, allarga la durada del record, en tasques de memòria de reconeixement, fins a deu vegades més que en els animals control....

  12. 3D heterostructures and systems for novel MEMS/NEMS

    Directory of Open Access Journals (Sweden)

    Victor Yakovlevich Prinz, Vladimir Alexandrovich Seleznev, Alexander Victorovich Prinz and Alexander Vladimirovich Kopylov

    2009-01-01

    Full Text Available In this review, we consider the application of solid micro- and nanostructures of various shapes as building blocks for micro-electro-mechanical or nano-electro-mechanical systems (MEMS/NEMS. We provide examples of practical applications of structures created by MEMS/NEMS fabrication. Novel devices are briefly described, such as a high-power electrostatic nanoactuator, a fast-response tubular anemometer for measuring gas and liquid flows, a nanoprinter, a nanosyringe and optical MEMS/NEMS. The prospects are described for achieving NEMS with tunable quantum properties.

  13. Offset vertical radar profiling

    Science.gov (United States)

    Witten, A.; Lane, J.

    2003-01-01

    Diffraction tomography imaging was applied to VRP data acquired by vertically moving a receiving antenna in a number of wells. This procedure simulated a vertical downhole receiver array. Similarly, a transmitting antenna was sequentially moved along a series of radial lines extending outward from the receiver wells. This provided a sequence of multistatic data sets and, from each data set, a two-dimensional vertical cross-sectional image of spatial variations in wave speed was reconstructed.

  14. A Micro-Force Sensor with Beam-Membrane Structure for Measurement of Friction Torque in Rotating MEMS Machines

    Directory of Open Access Journals (Sweden)

    Huan Liu

    2017-10-01

    Full Text Available In this paper, a beam-membrane (BM sensor for measuring friction torque in micro-electro-mechanical system (MEMS gas bearings is presented. The proposed sensor measures the force-arm-transformed force using a detecting probe and the piezoresistive effect. This solution incorporates a membrane into a conventional four-beam structure to meet the range requirements for the measurement of both the maximum static friction torque and the kinetic friction torque in rotating MEMS machines, as well as eliminate the problem of low sensitivity with neat membrane structure. A glass wafer is bonded onto the bottom of the sensor chip with a certain gap to protect the sensor when overloaded. The comparisons between the performances of beam-based sensor, membrane-based sensor and BM sensor are conducted by finite element method (FEM, and the final sensor dimensions are also determined. Calibration of the fabricated and packaged device is experimentally performed. The practical verification is also reported in the paper for estimating the friction torque in micro gas bearings by assembling the proposed sensor into a rotary table-based measurement system. The results demonstrate that the proposed force sensor has a potential application in measuring micro friction or force in MEMS machines.

  15. Superhydrophobic Surface Coatings for Microfluidics and MEMs.

    Energy Technology Data Exchange (ETDEWEB)

    Branson, Eric D.; Singh, Seema [Sandia National Laboratories, Livermore, CA; Houston, Jack E.; van Swol, Frank B.; Brinker, C. Jeffrey

    2006-11-01

    Low solid interfacial energy and fractally rough surface topography confer to Lotus plants superhydrophobic (SH) properties like high contact angles, rolling and bouncing of liquid droplets, and self-cleaning of particle contaminants. This project exploits the porous fractal structure of a novel, synthetic SH surface for aerosol collection, its self-cleaning properties for particle concentration, and its slippery nature 3 to enhance the performance of fluidic and MEMS devices. We propose to understand fundamentally the conditions needed to cause liquid droplets to roll rather than flow/slide on a surface and how this %22rolling transition%22 influences the boundary condition describing fluid flow in a pipe or micro-channel. Rolling of droplets is important for aerosol collection strategies because it allows trapped particles to be concentrated and transported in liquid droplets with no need for a pre-defined/micromachined fluidic architecture. The fluid/solid boundary condition is important because it governs flow resistance and rheology and establishes the fluid velocity profile. Although many research groups are exploring SH surfaces, our team is the first to unambiguously determine their effects on fluid flow and rheology. SH surfaces could impact all future SNL designs of collectors, fluidic devices, MEMS, and NEMS. Interfaced with inertial focusing aerosol collectors, SH surfaces would allow size-specific particle populations to be collected, concentrated, and transported to a fluidic interface without loss. In microfluidic systems, we expect to reduce the energy/power required to pump fluids and actuate MEMS. Plug-like (rather than parabolic) velocity profiles can greatly improve resolution of chip-based separations and enable unprecedented control of concentration profiles and residence times in fluidic-based micro-reactors. Patterned SH/hydrophilic channels could induce mixing in microchannels and enable development of microflow control elements

  16. Advantages of PZT thick film for MEMS sensors

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Lou-Moller, R.; Hansen, K.

    2010-01-01

    For all MEMS devices a high coupling between the mechanical and electrical domain is desired. Figures of merit describing the coupling are important for comparing different piezoelectric materials. The existing figures of merit are discussed and a new figure of merit is introduced for a fair...... comparison of piezoelectric thin and thick films based MEMS devices, as cantilevers, beams, bridges and membranes. Simple analytical modeling is used to define the new figure of merit. The relevant figure of merits is compared for the piezoelectric material of interest for MEMS applications: ZnO, AIN, PZT....... Improved figure of merit is reached in the piezoelectric PZT thick film, TF2100CIP, by using cold isostatic pressure in the PZT preparation process. The porosity of TF2100 is decreased 38%, hence, allowing an increase of charge sensitivity for MEMS sensors of 59%....

  17. Planetary-Whigs: Optical MEMS-Based Seismometer, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — During this Phase I, Michigan Aerospace Corporation will adapt the design of an optical MEMS seismometer for lunar and other planetary science instrumentation. The...

  18. Ultra-Low-Power MEMS Selective Gas Sensors, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — KWJ offers this proposal for a very low power but very practical "nano-watt" MEMS sensor platform for NASA requirements. The proposed nano-sensor platform is ultra...

  19. High Speed Magnetostrictive MEMS Actuated Mirror Deflectors, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The main goal of this proposal is to develop high speed magnetostrictive and MEMS actuators for rapidly deflecting or deforming mirrors. High speed, light-weight,...

  20. Nanotwinned metal MEMS films with unprecedented strength and stability.

    Science.gov (United States)

    Sim, Gi-Dong; Krogstad, Jessica A; Reddy, K Madhav; Xie, Kelvin Y; Valentino, Gianna M; Weihs, Timothy P; Hemker, Kevin J

    2017-06-01

    Silicon-based microelectromechanical systems (MEMS) sensors have become ubiquitous in consumer-based products, but realization of an interconnected network of MEMS devices that allows components to be remotely monitored and controlled, a concept often described as the "Internet of Things," will require a suite of MEMS materials and properties that are not currently available. We report on the synthesis of metallic nickel-molybdenum-tungsten films with direct current sputter deposition, which results in fully dense crystallographically textured films that are filled with nanotwins. These films exhibit linear elastic mechanical behavior and tensile strengths exceeding 3 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultrahigh strength is attributed to a combination of solid solution strengthening and the presence of dense nanotwins. These films also have excellent thermal and mechanical stability, high density, and electrical properties that are attractive for next-generation metal MEMS applications.

  1. An analytical formulation for phase noise in MEMS oscillators.

    Science.gov (United States)

    Agrawal, Deepak; Seshia, Ashwin

    2014-12-01

    In recent years, there has been much interest in the design of low-noise MEMS oscillators. This paper presents a new analytical formulation for noise in a MEMS oscillator encompassing essential resonator and amplifier nonlinearities. The analytical expression for oscillator noise is derived by solving a second-order nonlinear stochastic differential equation. This approach is applied to noise modeling of an electrostatically addressed MEMS resonator-based square-wave oscillator in which the resonator and oscillator circuit nonlinearities are integrated into a single modeling framework. By considering the resulting amplitude and phase relations, we derive additional noise terms resulting from resonator nonlinearities. The phase diffusion of an oscillator is studied and the phase diffusion coefficient is proposed as a metric for noise optimization. The proposed nonlinear phase noise model provides analytical insight into the underlying physics and a pathway toward the design optimization for low-noise MEMS oscillators.

  2. Tactical Grade MEMS IMUs for Spin-Stabilized Rockets Project

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose a tactical grade MEMS IMU for spin-stabilized rockets for metric tracking and autonomous systems. The enabling instrument is a gyroscope designed for very...

  3. MEMS Sensor Arrays for Cryogenic Propellant Applications, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — KWJ offers this proposal for a low-power, practical and versatile MEMS sensor platform for NASA applications. The proposed nano-sensor platform is ultra-low power...

  4. Reaction Wheel with Embedded MEMS IMU, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The innovation is to embed a MEMS IMU Sensor Chip into a reaction wheel to measure its spin rate as well as wheel attitude rate. We propose to use a reaction wheel...

  5. Picometer-Resolution MEMS Segmented DM, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  6. MEMS/Electronic Device Design and Characterization Facility

    Data.gov (United States)

    Federal Laboratory Consortium — This facility allows DoD to design and characterize state-of-the-art microelectromechanical systems (MEMS) and electronic devices. Device designers develop their own...

  7. 1015 PTT Segment MEMS DM Development, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with more than 10^4 actuators with size, weight, and power...

  8. Picometer-Resolution MEMS Segmented DM, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  9. Extreme-Precision MEMS Segmented Deformable Mirror, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — In Phase I research, Iris AO developed enhanced electromechanical models and calibration techniques for MEMS-based segmented deformable mirrors (DMs) applicable to a...

  10. MEMS-based transmission lines for microwave applications

    Science.gov (United States)

    Wu, Qun; Fu, Jiahui; Gu, Xuemai; Shi, Huajuan; Lee, Jongchul

    2003-04-01

    This paper mainly presents a briefly review for recent progress in MEMS-based transmission lines for use in microwave and millimeterwave range. MEMS-based transmission lines including different transmission line structure such as membrane-supported microstrip line microstrip line, coplanar microshield transmission line, LIGA micromachined planar transmission line, micromachined waveguides and coplanar waveguide are discussed. MEMS-based transmission lines are characterized by low propagation loss, wide operation frequency band, low dispersion and high quality factor, in addition, the fabrication is compatible with traditional processing of integrated circuits (IC"s). The emergence of MEMS-based transmission lines provided a solution for miniaturizing microwave system and monolithic microwave integrated circuits.

  11. High Speed Magnetostrictive MEMS Actuated Mirror Deflectors, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose to develop high speed magnetostrictive and MEMS actuators for rapidly deflecting or deforming mirrors. High speed, light-weight, low voltage beam...

  12. Laboratory for Development, Calibration and Utilization of MEMS Devices

    National Research Council Canada - National Science Library

    Reshotko, Eli

    1997-01-01

    ... (notification letter dated 28 May 1997) to 31 May 1997. This DURIP equipment grant has provided us with the means to proceed in our development of MEMS devices for fluid dynamic and aerodynamic applications...

  13. Highly Tunable Narrow Bandpass MEMS Filter

    KAUST Repository

    Hafiz, Md Abdullah Al

    2017-07-07

    We demonstrate a proof-of-concept highly tunable narrow bandpass filter based on electrothermally and electrostatically actuated microelectromechanical-system (MEMS) resonators. The device consists of two mechanically uncoupled clamped-clamped arch resonators, designed such that their resonance frequencies are independently tuned to obtain the desired narrow passband. Through the electrothermal and electrostatic actuation, the stiffness of the structures is highly tunable. We experimentally demonstrate significant percentage tuning (~125%) of the filter center frequency by varying the applied electrothermal voltages to the resonating structures, while maintaining a narrow passband of 550 ± 50 Hz, a stopband rejection of >17 dB, and a passband ripple ≤ 2.5 dB. An analytical model based on the Euler-Bernoulli beam theory is used to confirm the behavior of the filter, and the origin of the high tunability using electrothermal actuation is discussed.

  14. Strong Motion Seismograph Based On MEMS Accelerometer

    Science.gov (United States)

    Teng, Y.; Hu, X.

    2013-12-01

    The MEMS strong motion seismograph we developed used the modularization method to design its software and hardware.It can fit various needs in different application situation.The hardware of the instrument is composed of a MEMS accelerometer,a control processor system,a data-storage system,a wired real-time data transmission system by IP network,a wireless data transmission module by 3G broadband,a GPS calibration module and power supply system with a large-volumn lithium battery in it. Among it,the seismograph's sensor adopted a three-axis with 14-bit high resolution and digital output MEMS accelerometer.Its noise level just reach about 99μg/√Hz and ×2g to ×8g dynamically selectable full-scale.Its output data rates from 1.56Hz to 800Hz. Its maximum current consumption is merely 165μA,and the device is so small that it is available in a 3mm×3mm×1mm QFN package. Furthermore,there is access to both low pass filtered data as well as high pass filtered data,which minimizes the data analysis required for earthquake signal detection. So,the data post-processing can be simplified. Controlling process system adopts a 32-bit low power consumption embedded ARM9 processor-S3C2440 and is based on the Linux operation system.The processor's operating clock at 400MHz.The controlling system's main memory is a 64MB SDRAM with a 256MB flash-memory.Besides,an external high-capacity SD card data memory can be easily added.So the system can meet the requirements for data acquisition,data processing,data transmission,data storage,and so on. Both wired and wireless network can satisfy remote real-time monitoring, data transmission,system maintenance,status monitoring or updating software.Linux was embedded and multi-layer designed conception was used.The code, including sensor hardware driver,the data acquisition,earthquake setting out and so on,was written on medium layer.The hardware driver consist of IIC-Bus interface driver, IO driver and asynchronous notification driver. The

  15. Torsion based universal MEMS logic device

    KAUST Repository

    Ilyas, Saad

    2015-10-28

    In this work we demonstrate torsion based complementary MEMS logic device, which is capable, of performing INVERTER, AND, NAND, NOR, and OR gates using one physical structure within an operating range of 0-10 volts. It can also perform XOR and XNOR with one access inverter using the same structure with different electrical interconnects. The paper presents modeling, fabrication and experimental calculations of various performance features of the device including lifetime, power consumption and resonance frequency. The fabricated device is 535 μm by 150 μm with a gap of 1.92 μm and a resonant frequency of 6.51 kHz. The device is capable of performing the switching operation with a frequency of 1 kHz.

  16. MEMS inertial sensors with integral rotation means.

    Energy Technology Data Exchange (ETDEWEB)

    Kohler, Stewart M.

    2003-09-01

    The state-of-the-art of inertial micro-sensors (gyroscopes and accelerometers) has advanced to the point where they are displacing the more traditional sensors in many size, power, and/or cost-sensitive applications. A factor limiting the range of application of inertial micro-sensors has been their relatively poor bias stability. The incorporation of an integral sensitive axis rotation capability would enable bias mitigation through proven techniques such as indexing, and foster the use of inertial micro-sensors in more accuracy-sensitive applications. Fabricating the integral rotation mechanism in MEMS technology would minimize the penalties associated with incorporation of this capability, and preserve the inherent advantages of inertial micro-sensors.

  17. MEMS switches having non-metallic crossbeams

    Science.gov (United States)

    Scardelletti, Maximillian C (Inventor)

    2009-01-01

    A RF MEMS switch comprising a crossbeam of SiC, supported by at least one leg above a substrate and above a plurality of transmission lines forming a CPW. Bias is provided by at least one layer of metal disposed on a top surface of the SiC crossbeam, such as a layer of chromium followed by a layer of gold, and extending beyond the switch to a biasing pad on the substrate. The switch utilizes stress and conductivity-controlled non-metallic thin cantilevers or bridges, thereby improving the RF characteristics and operational reliability of the switch. The switch can be fabricated with conventional silicon integrated circuit (IC) processing techniques. The design of the switch is very versatile and can be implemented in many transmission line mediums.

  18. Wideband MEMS Resonator Using Multifrequency Excitation

    KAUST Repository

    Jaber, Nizar

    2016-03-09

    We demonstrate the excitation of combination resonances of additive and subtractive types and their exploitations to realize a large bandwidth micro-machined resonator of large amplitude even at higher harmonic modes of vibrations. The investigation is conducted on a Microelectromechanical systems (MEMS) clamped-clamped microbeam fabricated using polyimide as a structural layer coated with nickel from top and chromium and gold layers from bottom. The microbeam is excited by a two-source harmonic excitation, where the first frequency source is swept around the targeted resonance (first or third mode of vibration) while the second source frequency is kept fixed. We report for the first time a large bandwidth and large amplitude response near the higher order modes of vibration. Also, we show that by properly tuning the frequency and amplitude of the excitation force, the frequency bandwidth of the resonator is controlled.

  19. Feedback Control of MEMS to Atoms

    CERN Document Server

    Shapiro, Benjamin

    2012-01-01

    Feedback Control of MEMS to Atoms illustrates the use of control and control systems as an essential part of functioning integrated miniaturized systems. The book is organized according to the dimensional scale of the problem, starting with microscale systems and ending with atomic-scale systems. Similar to macroscale machines and processes, control systems can play a major role in improving the performance of micro- and nanoscale systems and in enabling new capabilities that would otherwise not be possible. The majority of problems at these scales present many new challenges that go beyond the current state-of-the-art in control theory and engineering. This is a result of the multidisciplinary nature of micro/nanotechnology, which requires the merging of control engineering with physics, biology and chemistry. This book: Shows how the utilization of feedback control in nanotechnology instrumentation can yield results far better than passive systems can Discusses the application of control systems to problems...

  20. Quantitative Boundary Support Characterization for Cantilever MEMS

    Directory of Open Access Journals (Sweden)

    Ion Stiharu

    2007-10-01

    Full Text Available Microfabrication limitations are of concern especially for suspended Micro-Electro-Mechanical-Systems (MEMS microstructures such as cantilevers. The static anddynamic qualities of such microscale devices are directly related to the invariant and variantproperties of the microsystem. Among the invariant properties, microfabrication limitationscan be quantified only after the fabrication of the device through testing. However, MEMSare batch fabricated in large numbers where individual testing is neither possible nor costeffective. Hence, a suitable test algorithm needs to be developed where the test resultsobtained for a few devices can be applied to the whole fabrication batch, and also to thefoundry process in general. In this regard, this paper proposes a method to test MEMScantilevers under variant electro-thermal influences in order to quantify the effectiveboundary support condition obtained for a foundry process. A non-contact optical sensingapproach is employed for the dynamic testing. The Rayleigh-Ritz energy method usingboundary characteristic orthogonal polynomials is employed for the modeling andtheoretical analysis.

  1. Vertical pump assembly

    International Nuclear Information System (INIS)

    Dohnal, M.; Rosel, J.; Skarka, V.

    1988-01-01

    The mounting is described of the drive assembly of a vertical pump for nuclear power plants in areas with seismic risk. The assembly is attached to the building floor using flexible and damping elements. The design allows producing seismically resistant pumps without major design changes in the existing types of vertical pumps. (E.S.). 1 fig

  2. Ultra-Low-Power MEMS Selective Gas Sensors

    Science.gov (United States)

    Stetter, Joseph

    2012-01-01

    This innovation is a system for gas sensing that includes an ultra-low-power MEMS (microelectromechanical system) gas sensor, combined with unique electronic circuitry and a proprietary algorithm for operating the sensor. The electronics were created from scratch, and represent a novel design capable of low-power operation of the proprietary MEMS gas sensor platform. The algorithm is used to identify a specific target gas in a gas mixture, making the sensor selective to that target gas.

  3. MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

    Energy Technology Data Exchange (ETDEWEB)

    TANNER,DANELLE M.; SMITH,NORMAN F.; IRWIN,LLOYD W.; EATON,WILLIAM P.; HELGESEN,KAREN SUE; CLEMENT,J. JOSEPH; MILLER,WILLIAM M.; MILLER,SAMUEL L.; DUGGER,MICHAEL T.; WALRAVEN,JEREMY A.; PETERSON,KENNETH A.

    2000-01-01

    The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

  4. Development of the micro pixel chamber based on MEMS technology

    Directory of Open Access Journals (Sweden)

    Takemura T.

    2018-01-01

    Full Text Available Micro pixel chambers (μ-PIC are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS, however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

  5. Development of the micro pixel chamber based on MEMS technology

    Science.gov (United States)

    Takemura, T.; Takada, A.; Kishimoto, T.; Komura, S.; Kubo, H.; Matsuoka, Y.; Miuchi, K.; Miyamoto, S.; Mizumoto, T.; Mizumura, Y.; Motomura, T.; Nakamasu, Y.; Nakamura, K.; Oda, M.; Ohta, K.; Parker, J. D.; Sawano, T.; Sonoda, S.; Tanimori, T.; Tomono, D.; Yoshikawa, K.

    2018-02-01

    Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB) technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS), however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS) technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

  6. Digital reflection holography based systems development for MEMS testing

    Science.gov (United States)

    Singh, Vijay Raj; Liansheng, Sui; Asundi, Anand

    2010-05-01

    MEMS are tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers and nanometers. Testing of MEMS device is an important part in carrying out their functional assessment and reliability analysis. Development of systems based on digital holography (DH) for MEMS inspection and characterization is presented in this paper. Two DH reflection systems, table-top and handheld types, are developed depending on the MEMS measurement requirements and their capabilities are presented. The methodologies for the systems are developed for 3D profile inspection and static & dynamic measurements, which is further integrated with in-house developed software that provides the measurement results in near real time. The applications of the developed systems are demonstrated for different MEMS devices for 3D profile inspection, static deformation/deflection measurements and vibration analysis. The developed systems are well suitable for the testing of MEMS and Microsystems samples, with full-field, static & dynamic inspection as well as to monitor micro-fabrication process.

  7. Performance Analysis of Alignment Process of MEMS IMU

    Directory of Open Access Journals (Sweden)

    Vadim Bistrov

    2012-01-01

    Full Text Available The procedure of determining the initial values of the attitude angles (pitch, roll, and heading is known as the alignment. Also, it is essential to align an inertial system before the start of navigation. Unless the inertial system is not aligned with the vehicle, the information provided by MEMS (microelectromechanical system sensors is not useful for navigating the vehicle. At the moment MEMS gyroscopes have poor characteristics and it’s necessary to develop specific algorithms in order to obtain the attitude information of the object. Most of the standard algorithms for the attitude estimation are not suitable when using MEMS inertial sensors. The wavelet technique, the Kalman filter, and the quaternion are not new in navigation data processing. But the joint use of those techniques for MEMS sensor data processing can give some new results. In this paper the performance of a developed algorithm for the attitude estimation using MEMS IMU (inertial measurement unit is tested. The obtained results are compared with the attitude output of another commercial GPS/IMU device by Xsens. The impact of MEMS sensor measurement noises on an alignment process is analysed. Some recommendations for the Kalman filter algorithm tuning to decrease standard deviation of the attitude estimation are given.

  8. MEMS IMU Error Mitigation Using Rotation Modulation Technique.

    Science.gov (United States)

    Du, Shuang; Sun, Wei; Gao, Yang

    2016-11-29

    Micro-electro-mechanical-systems (MEMS) inertial measurement unit (IMU) outputs are corrupted by significant sensor errors. The navigation errors of a MEMS-based inertial navigation system will therefore accumulate very quickly over time. This requires aiding from other sensors such as Global Navigation Satellite Systems (GNSS). However, it will still remain a significant challenge in the presence of GNSS outages, which are typically in urban canopies. This paper proposed a rotary inertial navigation system (INS) to mitigate navigation errors caused by MEMS inertial sensor errors when external aiding information is not available. A rotary INS is an inertial navigator in which the IMU is installed on a rotation platform. Application of proper rotation schemes can effectively cancel and reduce sensor errors. A rotary INS has the potential to significantly increase the time period that INS can bridge GNSS outages and make MEMS IMU possible to maintain longer autonomous navigation performance when there is no external aiding. In this research, several IMU rotation schemes (rotation about X-, Y- and Z-axes) are analyzed to mitigate the navigation errors caused by MEMS IMU sensor errors. As the IMU rotation induces additional sensor errors, a calibration process is proposed to remove the induced errors. Tests are further conducted with two MEMS IMUs installed on a tri-axial rotation table to verify the error mitigation by IMU rotations.

  9. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

    Science.gov (United States)

    Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H; Peterson, Tracy C; Shul, Randy J; Ahlers, Catalina; Plut, Thomas A; Patrizi, Gary A

    2013-12-03

    In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

  10. Vertical comb drive actuator for the measurement of piezoelectric coefficients in small-scale systems

    International Nuclear Information System (INIS)

    Wooldridge, J; Muniz-Piniella, A; Stewart, M; Shean, T A V; Weaver, P M; Cain, M G

    2013-01-01

    A micro-electro-mechanical systems (MEMS) vertical levitation comb drive actuator has been created for the measurement of piezoelectric coefficients in thin/thick films or piezoelectrically active micro-scale components of other MEMS devices. The device exerts a dynamic force of 33 μN at an applied voltage of 100 V. The charge developed on the piezoelectric test device is measured using a charge sensitive pre-amplifier and lock-in technique, enabling measurements down to 1×10 −5 pC. The system was tested with ten different piezoelectric samples with coefficients in the range 70–1375 pC N −1 and showed a good correlation (r = 0.9997) to measurements performed with macroscopic applied stresses, and piezoelectric impedance resonance techniques. The measurement of the direct piezoelectric effect in micro- and nano-scale piezo-materials has been made possible using MEMS processing technology. This new application of a MEMS metrology device has been developed and fully characterized in order to accurately evaluate the functional properties of piezoelectric materials at the scale required in micro- to nano-scale applications. (paper)

  11. Integrated microphotonic-MEMS inertial sensors

    Science.gov (United States)

    Zandi, Kazem

    The objective of this thesis is to design, simulate, fabricate and characterize high sensitive low cost in-plane photonic-band-gap (PBG)-micro electromechanical systems (MEMS)-based miniature accelerometers and rotational rate sensors (gyroscopes) on a silicon-on-insulator (SOI) substrate in order to enable the integration of an array of two-axis of these sensors on a single SOI platform. Use of guided-wave optical devices integrated with MEMS on SOI for multichannel/multifunction sensor systems allows the use of multiple sensors to extend the measurement range and accuracy. This provides essential redundancy which makes long-term reliability in the space environment possible therefore reducing the possibility of system failure. The navigator microchip also represents the ability of accommodating diverse attitude and inertial sensors on the same microchip to eliminate the need of many separate sensors. The end product exhibits orders of magnitude reduction in system mass and size. Furthermore, redundancy improves the net performance and precision of the navigation measurement systems. Two classes of optical accelerometers/gyroscopes are considered in this thesis for application in smallsats navigation, one based on tunable Fabry-Perot (FP) filter, where the sensor is actuated by the applied acceleration providing a shift in the operating wavelength that varies linearly with the applied acceleration and the other one based on variable optical attenuator (VOA), where the sensor is actuated by the applied acceleration providing a linear change for small displacements around the waveguide propagation axis in the relative signal intensity with the applied acceleration. In the case of FP-based sensors, the FP microcavity consists of two distributed Bragg reflectors (DBR) in which one DBR mirror is attached to the proof mass of the system. As a consequence of acceleration/rotation, the relative displacement of the movable mirror with respect to the fixed mirror changes

  12. Vertical sleeve gastrectomy

    Science.gov (United States)

    ... clots , infection Risks for vertical sleeve gastrectomy are: Gastritis (inflamed stomach lining), heartburn, or stomach ulcers Injury ... of the work. To lose weight and avoid complications from the procedure, you will need to follow ...

  13. Coordination in vertical jumping

    NARCIS (Netherlands)

    Bobbert, Maarten F.; van Ingen Schenau, Gerrit Jan

    1988-01-01

    The present study was designed to investigate for vertical jumping the relationships between muscle actions, movement pattern and jumping achievement. Ten skilled jumpers performed jumps with preparatory countermovement. Ground reaction forces and cinematographic data were recorded. In addition,

  14. Analysis and wafer-level design of a high-order silicon vibration isolator for resonating MEMS devices

    International Nuclear Information System (INIS)

    Yoon, Sang Won; Lee, Sangwoo; Najafi, Khalil; Perkins, Noel C

    2011-01-01

    This paper presents the analysis and preliminary design, fabrication, and measurement for mechanical vibration-isolation platforms especially designed for resonating MEMS devices including gyroscopes. Important parameters for designing isolation platforms are specified and the first platform (in designs with cascaded multiple platforms) is crucial for improving vibration-isolation performance and minimizing side-effects on integrated gyroscopes. This isolation platform, made from a thick silicon wafer substrate for an environment-resistant MEMS package, incorporates the functionalities of a previous design including vacuum packaging and thermal resistance with no additional resources. This platform consists of platform mass, isolation beams, vertical feedthroughs, and bonding pads. Two isolation platform designs follow from two isolation beam designs: lateral clamped–clamped beams and vertical torsion beams. The beams function simultaneously as mechanical springs and electrical interconnects. The vibration-isolation platform can yield a multi-dimensional, high-order mechanical low pass filter. The isolation platform possesses eight interconnects within a 12.2 × 12.2 mm 2 footprint. The contact resistance ranges from 4–11 Ω depending on the beam design. Vibration measurements using a laser-Doppler vibrometer demonstrate that the lateral vibration-isolation platform suppresses external vibration having frequencies exceeding 2.1 kHz.

  15. Hybrid vertical cavity laser

    DEFF Research Database (Denmark)

    Chung, Il-Sug; Mørk, Jesper

    2010-01-01

    A new hybrid vertical cavity laser structure for silicon photonics is suggested and numerically investigated. It incorporates a silicon subwavelength grating as a mirror and a lateral output coupler to a silicon ridge waveguide.......A new hybrid vertical cavity laser structure for silicon photonics is suggested and numerically investigated. It incorporates a silicon subwavelength grating as a mirror and a lateral output coupler to a silicon ridge waveguide....

  16. Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices

    National Research Council Canada - National Science Library

    Zhang, Xin

    2007-01-01

    ...) in MEMS devices and structures. In this project, PECVD SiOx is chosen as an example for the systematic study of mechanical behavior and underlying casual mechanisms of amorphous thin films for MEMS applications, which are generally...

  17. Proximal Probes Facility

    Data.gov (United States)

    Federal Laboratory Consortium — The Proximal Probes Facility consists of laboratories for microscopy, spectroscopy, and probing of nanostructured materials and their functional properties. At the...

  18. Field Tests of a Portable MEMS Gravimeter

    Directory of Open Access Journals (Sweden)

    Richard P. Middlemiss

    2017-11-01

    Full Text Available Gravimeters are used to measure density anomalies under the ground. They are applied in many different fields from volcanology to oil and gas exploration, but present commercial systems are costly and massive. A new type of gravity sensor has been developed that utilises the same fabrication methods as those used to make mobile phone accelerometers. In this study, we describe the first results of a field-portable microelectromechanical system (MEMS gravimeter. The stability of the gravimeter is demonstrated through undertaking a multi-day measurement with a standard deviation of 5.58 × 10 − 6 ms − 2 . It is then demonstrated that a change in gravitational acceleration of 4.5 × 10 − 5 ms − 2 can be measured as the device is moved between the top and the bottom of a 20.7 m lift shaft with a signal-to-noise ratio (SNR of 14.25. Finally, the device is demonstrated to be stable in a more harsh environment: a 4.5 × 10 − 4 ms − 2 gravity variation is measured between the top and bottom of a 275-m hill with an SNR of 15.88. These initial field-tests are an important step towards a chip-sized gravity sensor.

  19. Nonlinear Dynamics of Electrostatically Actuated MEMS Arches

    KAUST Repository

    Al Hennawi, Qais M.

    2015-05-01

    In this thesis, we present theoretical and experimental investigation into the nonlinear statics and dynamics of clamped-clamped in-plane MEMS arches when excited by an electrostatic force. Theoretically, we first solve the equation of motion using a multi- mode Galarkin Reduced Order Model (ROM). We investigate the static response of the arch experimentally where we show several jumps due to the snap-through instability. Experimentally, a case study of in-plane silicon micromachined arch is studied and its mechanical behavior is measured using optical techniques. We develop an algorithm to extract various parameters that are needed to model the arch, such as the induced axial force, the modulus of elasticity, and the initially induced initial rise. After that, we excite the arch by a DC electrostatic force superimposed to an AC harmonic load. A softening spring behavior is observed when the excitation is close to the first resonance frequency due to the quadratic nonlinearity coming from the arch geometry and the electrostatic force. Also, a hardening spring behavior is observed when the excitation is close to the third (second symmetric) resonance frequency due to the cubic nonlinearity coming from mid-plane stretching. Then, we excite the arch by an electric load of two AC frequency components, where we report a combination resonance of the summed type. Agreement is reported among the theoretical and experimental work.

  20. DMD reliability: a MEMS success story

    Science.gov (United States)

    Douglass, Michael

    2003-01-01

    The Digital Micromirror Device (DMD) developed by Texas Instruments (TI) has made tremendous progress in both performance and reliability since it was first invented in 1987. From the first working concept of a bistable mirror, the DMD is now providing high-brightness, high-contrast, and high-reliability in over 1,500,000 projectors using Digital Light Processing technology. In early 2000, TI introduced the first DMD chip with a smaller mirror (14-micron pitch versus 17-micron pitch). This allowed a greater number of high-resolution DMD chips per wafer, thus providing an increased output capacity as well as the flexibility to use existing package designs. By using existing package designs, subsequent DMDs cost less as well as met our customers' demand for faster time to market. In recent years, the DMD achieved the status of being a commercially successful MEMS device. It reached this status by the efforts of hundreds of individuals working toward a common goal over many years. Neither textbooks nor design guidelines existed at the time. There was little infrastructure in place to support such a large endeavor. The knowledge we gained through our characterization and testing was all we had available to us through the first few years of development. Reliability was only a goal in 1992 when production development activity started; a goal that many throughout the industry and even within Texas Instruments doubted the DMD could achieve. The results presented in this paper demonstrate that we succeeded by exceeding the reliability goals.

  1. Modular packaging concept for MEMS and MOEMS

    Science.gov (United States)

    Stenchly, Vanessa; Reinert, Wolfgang; Quenzer, Hans-Joachim

    2017-11-01

    Wherever technical systems detect objects in their environment or interact with people, optical devices may play an important role. Light can be relatively easily produced and spatially and temporally modulated. Laser can project sharp images over long distances or cut materials in short distances. Depending on the wavelength an invisible scanning in near infrared for gesture recognition is possible as well as a projection of brilliant colour images. For several years, the Fraunhofer ISIT develops Opto-Packaging processes based on the viscous reshaping of glass wafers: First, hermetically sealed laser micro-mirror scanners WLP with inclined windows deflect in the central light reflex of the window out of the image area. Second, housing with lateral light exit permits hermetic sealing of edge-emitting lasers for highest reliability and durability. Such systems are currently experiencing an extremely high interest of the industry in all segments, from consumer to automotive through to materials processing. Our modular Opto-Packaging platform enables fast product developments. Housing for opto mechanical MEMS devices are equipped with inclined windows to minimize distortion, stray light and reflection losses. The hot viscous glass forming technology is also applied to functionalized substrate wafers which possess areas with high heat dissipation in addition to thermally insulating areas. Electrical contacts may be realized with metal filled vias or TGV (Through Glass Vias). The modular system reduces the development times for new, miniaturized optical systems so that manufacturers can focus on the essentials in their development, namely their product functionalities.

  2. Smartphone MEMS accelerometers and earthquake early warning

    Science.gov (United States)

    Kong, Q.; Allen, R. M.; Schreier, L.; Kwon, Y. W.

    2015-12-01

    The low cost MEMS accelerometers in the smartphones are attracting more and more attentions from the science community due to the vast number and potential applications in various areas. We are using the accelerometers inside the smartphones to detect the earthquakes. We did shake table tests to show these accelerometers are also suitable to record large shakings caused by earthquakes. We developed an android app - MyShake, which can even distinguish earthquake movements from daily human activities from the recordings recorded by the accelerometers in personal smartphones and upload trigger information/waveform to our server for further analysis. The data from these smartphones forms a unique datasets for seismological applications, such as earthquake early warning. In this talk I will layout the method we used to recognize earthquake-like movement from single smartphone, and the overview of the whole system that harness the information from a network of smartphones for rapid earthquake detection. This type of system can be easily deployed and scaled up around the global and provides additional insights of the earthquake hazards.

  3. MEMS DM development at Iris AO, Inc.

    Science.gov (United States)

    Helmbrecht, Michael A.; He, Min; Kempf, Carl J.; Besse, Marc

    2011-03-01

    Iris AO is actively developing piston-tip-tilt (PTT) segmented MEMS deformable mirrors (DM) and adaptive optics (AO) controllers for these DMs. This paper discusses ongoing research at Iris AO that has advanced the state-of-the-art of these devices and systems over the past year. Improvements made to open-loop operation and mirror fabrication enables mirrors to open-loop flatten to 4 nm rms. Additional testing of an anti snap-in technology was conducted and demonstrates that the technology can withstand 100 million snap-in events without failure. Deformable mirrors with dielectric coatings are shown that are capable of handling 630 W/cm2 of incident laser power. Over a localized region on the segment, the dielectric coatings can withstand 100kW/cm2 incident laser power for 30 minutes. Results from the first-ever batch of PTT489 DMs that were shipped to pilot customers are reported. Optimizations made to the open-loop PTT controller are shown to have latencies of 157.5 μs and synchronous array update rates of nearly 6.5 kHz. Finally, plans for the design and fabrication of the next-generation PTT939 DM are presented.

  4. Field Tests of a Portable MEMS Gravimeter.

    Science.gov (United States)

    Middlemiss, Richard P; Bramsiepe, Steven G; Douglas, Rebecca; Hough, James; Paul, Douglas J; Rowan, Sheila; Hammond, Giles D

    2017-11-08

    Gravimeters are used to measure density anomalies under the ground. They are applied in many different fields from volcanology to oil and gas exploration, but present commercial systems are costly and massive. A new type of gravity sensor has been developed that utilises the same fabrication methods as those used to make mobile phone accelerometers. In this study, we describe the first results of a field-portable microelectromechanical system (MEMS) gravimeter. The stability of the gravimeter is demonstrated through undertaking a multi-day measurement with a standard deviation of 5.58 × 10 - 6 ms - 2 . It is then demonstrated that a change in gravitational acceleration of 4.5 × 10 - 6 ms - 2 can be measured as the device is moved between the top and the bottom of a 20.7 m lift shaft with a signal-to-noise ratio (SNR) of 14.25. Finally, the device is demonstrated to be stable in a more harsh environment: a 4.5 × 10 - 4 ms - 2 gravity variation is measured between the top and bottom of a 275-m hill with an SNR of 15.88. These initial field-tests are an important step towards a chip-sized gravity sensor.

  5. MEMS tandem ion-sorption micropump

    Science.gov (United States)

    Grzebyk, T.

    2017-12-01

    This paper presents a two-stage MEMS ion-sorption micropump, which works in a wide range of pressures—it allows efficient evacuation of gases from the internal volume of any microsystem starting from atmospheric pressure down to 10‑6 hPa. The miniature pre-vacuum pump is realized as a two-electrode silicon–glass structure with a very close inter-electrode distance. The use of the silicon substrate as a getter material instead of a metallic layer significantly increases the pumping capacity and as a result, the initial pressure can be reduced to a level of 1 hPa. From this point the pumping is continued with the second glow-discharge high vacuum micropump. This pump is a multilayer structure, in which ions are trapped in crossed electric and magnetic fields. It allows further reduction of pressure down to 10‑6 hPa. Both pumps are technologically compatible and together they enable the on-chip generation of avacuum at the desired level in a variety of miniaturized devices.

  6. MEMS Logic Using Mixed-Frequency Excitation

    KAUST Repository

    Ilyas, Saad

    2017-06-22

    We present multi-function microelectromechanical systems (MEMS) logic device that can perform the fundamental logic gate AND, OR, universal logic gates NAND, NOR, and a tristate logic gate using mixed-frequency excitation. The concept is based on exciting combination resonances due to the mixing of two or more input signals. The device vibrates at two steady states: a high state when the combination resonance is activated and a low state when no resonance is activated. These vibration states are assigned to logical value 1 or 0 to realize the logic gates. Using ac signals to drive the resonator and to execute the logic inputs unifies the input and output wave forms of the logic device, thereby opening the possibility for cascading among logic devices. We found that the energy consumption per cycle of the proposed logic resonator is higher than those of existing technologies. Hence, integration of such logic devices to build complex computational system needs to take into consideration lowering the total energy consumption. [2017-0041

  7. Differentially-driven MEMS spatial light modulator

    Science.gov (United States)

    Stappaerts, Eddy A.

    2004-09-14

    A MEMS SLM and an electrostatic actuator associated with a pixel in an SLM. The actuator has three electrodes: a lower electrode; an upper electrode fixed with respect to the lower electrode; and a center electrode suspended and actuable between the upper and lower electrodes. The center electrode is capable of resiliently-biasing to restore the center electrode to a non-actuated first equilibrium position, and a mirror is operably connected to the center electrode. A first voltage source provides a first bias voltage across the lower and center electrodes and a second voltage source provides a second bias voltage across the upper and center electrodes, with the first and second bias voltages determining the non-actuated first equilibrium position of the center electrode. A third voltage source provides a variable driver voltage across one of the lower/center and upper/center electrode pairs in series with the corresponding first or second bias voltage, to actuate the center electrode to a dynamic second equilibrium position.

  8. MEMS based impedimetric sensing of phthalates

    KAUST Repository

    Zia, Asif I.

    2013-05-01

    Phthalate esters are known ubiquitous teratogenic and carcinogenic environmental and food pollutants. Their detection and quantification is strictly laboratory based, time consuming, expensive and professionally handled procedure. Presented research work describes a real time non-invasive detection technique for phthalates detection in ethanol, water and drinks. The new type of inter-digital sensor design incorporating multiple sensing gold electrodes were fabricated on silicon substrate based on thin film micro-electromechanical system (MEMS) using semiconductor device fabrication technology. A passivation layer of Silicon Nitride (Si3N4) was used to functionalize the sensor. Various concentrations (0.1 to 20ppm) of DINP (di-isononyl phthalates) in ethanol and di (2-ethylhexyl) phthalate (DEHP) in deionized MilliQ water were subjected to the testing system by dip testing method. Electrochemical impedance spectroscopy (EIS) technique was used to obtain impedance spectra in order to determine sample conductance for evaluation of its dielectric properties. The impedance spectra so obtained showed that the sensor was able to detect the presence of phthalates in the samples distinctively. Electrochemical Spectrum Analyser was used to model the experimentally obtained impedance spectra by curve fitting technique to figure out Constant Phase Element (CPE) equivalent circuit. Locally available energy drink and juice was added with phthalates in concentrations of 2, 6 and 10ppm to observe the performance of the sensor in such products. Experimental results showed that the new sensor was able to detect different concentrations of phthalates in energy drinks. © 2013 IEEE.

  9. Poly-SiGe for MEMS-above-CMOS sensors

    CERN Document Server

    Gonzalez Ruiz, Pilar; Witvrouw, Ann

    2014-01-01

    Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence o...

  10. Gamma-ray irradiation of ohmic MEMS switches

    Science.gov (United States)

    Maciel, John J.; Lampen, James L.; Taylor, Edward W.

    2012-10-01

    Radio Frequency (RF) Microelectromechanical System (MEMS) switches are becoming important building blocks for a variety of military and commercial applications including switch matrices, phase shifters, electronically scanned antennas, switched filters, Automatic Test Equipment, instrumentation, cell phones and smart antennas. Low power consumption, large ratio of off-impedance to on-impedance, extreme linearity, low mass, small volume and the ability to be integrated with other electronics makes MEMS switches an attractive alternative to other mechanical and solid-state switches for a variety of space applications. Radant MEMS, Inc. has developed an electrostatically actuated broadband ohmic microswitch that has applications from DC through the microwave region. Despite the extensive earth based testing, little is known about the performance and reliability of these devices in space environments. To help fill this void, we have irradiated our commercial-off-the-shelf SPST, DC to 40 GHz MEMS switches with gamma-rays as an initial step to assessing static impact on RF performance. Results of Co-60 gamma-ray irradiation of the MEMS switches at photon energies ≥ 1.0 MeV to a total dose of ~ 118 krad(Si) did not show a statistically significant post-irradiation change in measured broadband, RF insertion loss, insertion phase, return loss and isolation.

  11. Memória de longo prazo modulada pela memória de curto prazo

    Directory of Open Access Journals (Sweden)

    Viviane Moreira-Aguiar

    2008-01-01

    Full Text Available Quando um estímulo ocorre aleatoriamente à esquerda ou à direita, a resposta é mais rápida quando estímulo e resposta estão no mesmo lado (condição compatível do que em lados opostos (condição incompatível. Na tarefa de Simon, embora a resposta seja selecionada pela forma (ou cor do estímulo, a posição deste influencia o Tempo de Reação Manual (TRM. O efeito Simon corresponde à diferença entre as médias dos TRMs nas duas condições (incompatível e compatível. Neste trabalho, estudamos como uma tarefa prévia de compatibilidade realizada com um dedo indicador modula o efeito Simon. Vinte e oito voluntários realizaram uma tarefa de compatibilidade seguida pela tarefa de Simon. No grupo compatível (14 voluntários, encontramos um efeito Simon de 24 ms. No incompatível (14 voluntários, ocorreu um efeito Simon inverso de -16 ms. Estes resultados mostram uma modulação da memória de longo prazo por uma tarefa envolvendo a memória de curto prazo.

  12. Power Management of MEMS-Based Storage Devices for Mobile Systems

    NARCIS (Netherlands)

    Khatib, M.G.; Hartel, Pieter H.

    2008-01-01

    Because of its small form factor, high capacity, and expected low cost, MEMS-based storage is a suitable storage technology for mobile systems. MEMS-based storage devices should also be energy efficient for deployment in mobile systems. The problem is that MEMS-based storage devices are mechanical,

  13. Workload-Based Configuration of MEMS-Based Storage Devices for Mobile Systems

    NARCIS (Netherlands)

    Khatib, M.G.; Miller, E.L.; Hartel, Pieter H.

    2008-01-01

    Because of its small form factor, high capacity, and expected low cost, MEMS-based storage is a suitable storage technology for mobile systems. However, flash memory may outperform MEMS-based storage in terms of performance, and energy-efficiency. The problem is that MEMS-based storage devices have

  14. Vertical and horizontal subsidiarity

    Directory of Open Access Journals (Sweden)

    Ivan V. Daniluk

    2016-02-01

    Full Text Available This article makes an attempt to analyze the principle of subsidiarity in its two main manifestations, namely vertical and horizontal, to outline the principles of relations between the state and regions within the vertical subsidiarity, and features a collaboration of the government and civil society within the horizontal subsidiarity. Scientists identify two types, or two levels of the subsidiarity principle: vertical subsidiarity and horizontal subsidiarity. First, vertical subsidiarity (or territorial concerning relations between the state and other levels of subnational government, such as regions and local authorities; second, horizontal subsidiarity (or functional concerns the relationship between state and citizen (and civil society. Vertical subsidiarity expressed in the context of the distribution of administrative responsibilities to the appropriate higher level lower levels relative to the state structure, ie giving more powers to local government. However, state intervention has subsidiary-lower action against local authorities in cases of insolvency last cope on their own, ie higher organisms intervene only if the duties are less authority is insufficient to achieve the goals. Horizontal subsidiarity is within the relationship between power and freedom, and is based on the assumption that the concern for the common good and the needs of common interest community, able to solve community members (as individuals and citizens’ associations and role of government, in accordance horizontal subsidiarity comes to attracting features subsidiarity assistance, programming, coordination and possibly control.

  15. Predicting fracture in micron-scale polycrystalline silicon MEMS structures.

    Energy Technology Data Exchange (ETDEWEB)

    Hazra, Siddharth S. (Carnegie Mellon University, Pittsburgh, PA); de Boer, Maarten Pieter (Carnegie Mellon University, Pittsburgh, PA); Boyce, Brad Lee; Ohlhausen, James Anthony; Foulk, James W., III; Reedy, Earl David, Jr.

    2010-09-01

    Designing reliable MEMS structures presents numerous challenges. Polycrystalline silicon fractures in a brittle manner with considerable variability in measured strength. Furthermore, it is not clear how to use a measured tensile strength distribution to predict the strength of a complex MEMS structure. To address such issues, two recently developed high throughput MEMS tensile test techniques have been used to measure strength distribution tails. The measured tensile strength distributions enable the definition of a threshold strength as well as an inferred maximum flaw size. The nature of strength-controlling flaws has been identified and sources of the observed variation in strength investigated. A double edge-notched specimen geometry was also tested to study the effect of a severe, micron-scale stress concentration on the measured strength distribution. Strength-based, Weibull-based, and fracture mechanics-based failure analyses were performed and compared with the experimental results.

  16. Optical measurement methods to study dynamic behavior in MEMS

    Science.gov (United States)

    Rembe, Christian; Kant, Rishi; Muller, Richard S.

    2001-10-01

    The maturing designs of moving microelectromechanical systems (MEMS) make it more-and-more important to have precise measurements and visual means to characterize dynamic microstructures. The Berkeley Sensor&Actuator Center (BSAC) has a forefront project aimed at developing these capabilities and at providing high-speed Internet (Supernet) access for remote use of its facilities. Already in operation are three optical-characterization tools: a stroboscopic-interferometer system, a computer-microvision system, and a laser-Doppler vibrometer. This paper describes precision and limitations of these systems and discusses their further development. In addition, we describe the results of experimental studies on the different MEMS devices, and give an overview about high-speed visualization of rapidly moving MEMS structures.

  17. MEMS capacitive force sensors for cellular and flight biomechanics

    International Nuclear Information System (INIS)

    Sun Yu; Nelson, Bradley J

    2007-01-01

    Microelectromechanical systems (MEMS) are playing increasingly important roles in facilitating biological studies. They are capable of providing not only qualitative but also quantitative information on the cellular, sub-cellular and organism levels, which is instrumental to understanding the fundamental elements of biological systems. MEMS force sensors with their high bandwidth and high sensitivity combined with their small size, in particular, have found a role in this domain, because of the importance of quantifying forces and their effect on the function and morphology of many biological structures. This paper describes our research in the development of MEMS capacitive force sensors that have already demonstrated their effectiveness in the areas of cell mechanics and Drosophila flight dynamics studies. (review article)

  18. MEMS and mil/aero: technology push and market pull

    Science.gov (United States)

    Clifford, Thomas H.

    2001-04-01

    MEMS offers attractive solutions to high-density fluidics, inertial, optical, switching and other demanding military/aerospace (mil/aero) challenges. However, full acceptance must confront the realities of production-scale producibility, verifiability, testability, survivability, as well as long-term reliability. Data on these `..ilities' are crucial, and are central in funding and deployment decisions. Similarly, mil/aero users must highlight specific missions, environmental exposures, and procurement issues, as well as the quirks of its designers. These issues are particularly challenging in MEMS, because of the laws of physics and business economics, as well as the risks of deploying leading-edge technology into no-fail applications. This paper highlights mil/aero requirements, and suggests reliability/qualification protocols, to guide development effort and to reassure mil/aero users that MEMS labs are mindful of the necessary realities.

  19. MEMS: A new approach to micro-optics

    Energy Technology Data Exchange (ETDEWEB)

    Sniegowski, J.J.

    1997-12-31

    MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlights polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.

  20. Integrated Magnetic MEMS Relays: Status of the Technology

    Directory of Open Access Journals (Sweden)

    Giuseppe Schiavone

    2014-08-01

    Full Text Available The development and application of magnetic technologies employing microfabricated magnetic structures for the production of switching components has generated enormous interest in the scientific and industrial communities over the last decade. Magnetic actuation offers many benefits when compared to other schemes for microelectromechanical systems (MEMS, including the generation of forces that have higher magnitude and longer range. Magnetic actuation can be achieved using different excitation sources, which create challenges related to the integration with other technologies, such as CMOS (Complementary Metal Oxide Semiconductor, and the requirement to reduce power consumption. Novel designs and technologies are therefore sought to enable the use of magnetic switching architectures in integrated MEMS devices, without incurring excessive energy consumption. This article reviews the status of magnetic MEMS technology and presents devices recently developed by various research groups, with key focuses on integrability and effective power management, in addition to the ability to integrate the technology with other microelectronic fabrication processes.

  1. Amplitude saturation of MEMS resonators explained by autoparametric resonance

    International Nuclear Information System (INIS)

    Van der Avoort, C; Bontemps, J J M; Steeneken, P G; Le Phan, K; Van Beek, J T M; Van der Hout, R; Hulshof, J; Fey, R H B

    2010-01-01

    This paper describes a phenomenon that limits the power handling of MEMS resonators. It is observed that above a certain driving level, the resonance amplitude becomes independent of the driving level. In contrast to previous studies of power handling of MEMS resonators, it is found that this amplitude saturation cannot be explained by nonlinear terms in the spring constant or electrostatic force. Instead we show that the amplitude in our experiments is limited by nonlinear terms in the equation of motion which couple the in-plane length-extensional resonance mode to one or more out-of-plane (OOP) bending modes. We present experimental evidence for the autoparametric excitation of these OOP modes using a vibrometer. The measurements are compared to a model that can be used to predict a power-handling limit for MEMS resonators

  2. Modelling of damping forces occuring in simple MEMS systems

    Directory of Open Access Journals (Sweden)

    Kamil Urbanowicz

    2015-12-01

    Full Text Available A certain damping force occurs in the micro-mechanical systems referred as MEMS. At the design stage of such systems, these forces must be accurately estimated. As shown in this work, in all systems operating at low frequencies, most important force is the one associated with the flotation of air film from the volume between two parallel operating movable MEMS plates. This force can be accurately estimated by analytical methods known from the literature. The paper presents analytical solutions that are frequently used in practice for simple plates. Also some simple simulations, using all described analytical solutions compared with the results of specialized program called Comsol Multyphysics, are shown. Presented research demonstrate the effectiveness of numerical software.[b]Keywords[/b]: MEMS, damping forces, Reynolds equation, modelling, simulation

  3. Component-based assistants for MEMS design tools

    Science.gov (United States)

    Hahn, Kai; Brueck, Rainer; Schneider, Christian; Schumer, Christian; Popp, Jens

    2001-04-01

    With this paper a new approach for MEMS design tools will be introduced. An analysis of the design tool market leads to the result that most of the designers work with large and inflexible frameworks. Purchasing and maintaining these frameworks is expensive, and gives no optimum support for MEMS design process. The concept of design assistants, carried out with the concept of interacting software components, denotes a new generation of flexible, small, semi-autonomous software systems that are used to solve specific MEMS design tasks in close interaction with the designer. The degree of interaction depends on the complexity of the design task to be performed and the possibility to formalize the respective knowledge. In this context the Internet as one of today's most important communication media provides support for new tool concepts on the basis of the Java programming language. These modern technologies can be used to set up distributed and platform-independent applications. Thus the idea emerged to implement design assistants using Java. According to the MEMS design model new process sequences have to be defined new for every specific design object. As a consequence, assistants have to be built dynamically depending on the requirements of the design process, what can be achieved with component based software development. Componentware offers the possibility to realize design assistants, in areas like design rule checks, process consistency checks, technology definitions, graphical editors, etc. that may reside distributed over the Internet, communicating via Internet protocols. At the University of Siegen a directory for reusable MEMS components has been created, containing a process specification assistant and a layout verification assistant for lithography based MEMS technologies.

  4. Nanotechnology: MEMS and NEMS and their applications to smart systems and devices

    Science.gov (United States)

    Varadan, Vijay K.

    2003-10-01

    civil strutures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the Engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5 - 40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended coventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.

  5. Sputtered highly oriented PZT thin films for MEMS applications

    Science.gov (United States)

    Kalpat, Sriram S.

    Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate

  6. RF MEMS Fractal Capacitors With High Self-Resonant Frequencies

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-23

    This letter demonstrates RF microelectromechanical systems (MEMS) fractal capacitors possessing the highest reported self-resonant frequencies (SRFs) in PolyMUMPS to date. Explicitly, measurement results show SRFs beyond 20 GHz. Furthermore, quality factors higher than 4 throughout a band of 1-15 GHz and reaching as high as 28 were achieved. Additional benefits that are readily attainable from implementing fractal capacitors in MEMS are discussed, including suppressing residual stress warping, eliminating the need for etching holes, and reducing parasitics. The latter benefits were acquired without any fabrication intervention. © 2011 IEEE.

  7. A structural health monitoring system with ultrasonic MEMS transducers

    Science.gov (United States)

    Guldiken, Rasim O.; Onen, Onursal; Gul, Mustafa; Catbas, F. Necati

    2011-04-01

    In this paper, we will summarize our efforts on exploring guided acoustic waves generated by MEMS ultrasonic transducers enabling a non-destructive, ultra-low powered, wireless SHM system. State-of-the-art SHM systems employ bulk piezoelectric transducers. However, they are not environmentally benign (contain lead), not cost feasible for monitoring every bridge in the U.S., require significant power for operation, lack integration capability for wireless interrogation, need precise matching layers, and have only 25-50 percent fractional bandwidth, limiting the detection resolution. To alleviate most of these shortcomings, a low impedance MEMS transducer, called a capacitive micromachined ultrasonic transducer (CMUT), is explored.

  8. An Evolutionary Approach for Robust Layout Synthesis of MEMS

    DEFF Research Database (Denmark)

    Fan, Zhun; Wang, Jiachuan; Goodman, Erik

    2005-01-01

    The paper introduces a robust design method for layout synthesis of MEM resonators subject to inherent geometric uncertainties such as the fabrication error on the sidewall of the structure. The robust design problem is formulated as a multi-objective constrained optimisation problem after certain...... assumptions and treated with multiobjective genetic algorithm (MOGA), a special type of evolutionary computing approaches. Case study based on layout synthesis of a comb-driven MEM resonator shows that the approach proposed in this paper can lead to design results that meet the target performance and are less...

  9. MEMS-based thermoelectric infrared sensors: A review

    Science.gov (United States)

    Xu, Dehui; Wang, Yuelin; Xiong, Bin; Li, Tie

    2017-12-01

    In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

  10. Pulse Reversal Plating of Nickel and Nickel Alloys for MEMS

    DEFF Research Database (Denmark)

    Tang, Peter Torben

    2001-01-01

    Pulse plating has previously been reported to improve the properties of nickel and nickel alloy deposits. Typically, focus has been on properties such as grain size, hardness and smoothness. When pulse plating is to be utilized for micro electromechanical systems (MEMS), internal stress and mater......Pulse plating has previously been reported to improve the properties of nickel and nickel alloy deposits. Typically, focus has been on properties such as grain size, hardness and smoothness. When pulse plating is to be utilized for micro electromechanical systems (MEMS), internal stress...

  11. APPLICATION OF MEMS TECHNOLOGY TO MICRO DIRECT METHANOL FUEL CELL

    OpenAIRE

    Liu, Xiaowei; Suo, Chunguang; Zhang, Yufeng; Zhang, Haifeng; Dhum, Ch.; Chen, Weiping; Lu, Xuebin

    2006-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; In view of micro fuel cells, the silicon processes are employed for microfabrication of the micro direct methanol fuel cell (µDMFC). Using the MEMS technology we have successfully made single µDMFC as small as 10mm×8mm×3mm. The main reason for the use of MEMS processes is the prospective potential for miniaturization and economical mass production of small fuel cells. The doub...

  12. Memória e Pastiche em Leite Derramado

    Directory of Open Access Journals (Sweden)

    Mírian Sumica Carneiro Reis

    2016-07-01

    Full Text Available Neste artigo, propomos uma análise do romance Leite Derramado, de Chico Buarque, considerando que, em sua tessitura, a memória é tema e trabalho de citação, a partir dos quais ecoam as vozes de outros autores, textos, teorias, mas também da ruptura com a historiografia tradicional e da derrocada de valores e ideologias para as quais nem o aspecto de criação da memória pode representar redenção.

  13. Design, modeling, and simulation of MEMS pressure sensors

    Science.gov (United States)

    Geca, Mateusz; Kociubiński, Andrzej

    2013-10-01

    This paper focuses on the design and analysis of a MEMS piezoresistive pressure sensor. The absolute pressure sensor with a 150μm wide and 3μm thick silicon membrane is modeled and simulated using CoventorWare™ softwareprofiting from a finite element method (FEM) implemented to determine specific electro-mechanical parameter values characterizing MEMS structure being designed. Optimization of piezoresistor parameters has been also performed to determine optimum dimensions of piezoresistors and their location referred to the center on the pressure sensor diaphragm. The output voltage measured on a piezoresistive Wheatstone bridge has been obtained and compared for two different resistor materials along with and linearity error analysis.

  14. Additive direct-write microfabrication for MEMS: A review

    Science.gov (United States)

    Teh, Kwok Siong

    2017-12-01

    Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer- generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into threedimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive

  15. Endovascular retrieval of a CardioMEMS heart failure system

    Directory of Open Access Journals (Sweden)

    Arun Reghunathan, MD

    2018-04-01

    Full Text Available As the creation and utilization of new implantable devices increases, so does the need for interventionalists to devise unique retrieval mechanisms. This report describes the first endovascular retrieval of a CardioMEMS heart failure monitoring device. A 20-mm gooseneck snare was utilized in conjunction with a 9-French sheath and Envoy catheter for retrieval. The patient suffered no immediate postprocedural complications but died 5 days after the procedure from multiorgan failure secondary to sepsis. Keywords: CardioMEMS heart failure system, Endovascular retrieval

  16. Thermal energy harvesting for application at MEMS scale

    CERN Document Server

    Percy, Steven; McGarry, Scott; Post, Alex; Moore, Tim; Cavanagh, Kate

    2014-01-01

    This book discusses the history of thermal heat generators and focuses on the potential for these processes using micro-electrical mechanical systems (MEMS) technology for this application. The main focus is on the capture of waste thermal energy for example from industrial processes, transport systems or the human body to generate useable electrical power.  A wide range of technologies is discussed, including external combustion heat cycles at MEMS ( Brayton, Stirling and Rankine), Thermoacoustic, Shape Memory Alloys (SMAs), Multiferroics, Thermionics, Pyroelectric, Seebeck, Alkali Metal Thermal, Hydride Heat Engine, Johnson Thermo Electrochemical Converters, and the Johnson Electric Heat Pipe.

  17. Optical MEMS: past, present and future

    Science.gov (United States)

    Ramani, Chandra Mouli

    2005-09-01

    Spurred by the growth of the internet, Optical Telecommunications bandwidth, experienced unprecedented growth during late 1990's. During this time of great economic expansion, the creation of new enterprises was vast and the expansion of established component, system and services companies was breathtaking. Unfortunately, this positive economic state was short-lived. This period was followed in 2001-2004 by one of the most significant market crashes in history. During those 10 years of economic growth, about $20B in venture capital was invested in the optical telecom industry, most of this investment was lost in recent years. Many start-up industries which experienced unprecedented growth at the end of the 20th century were lost at the start of the 21st. (1) During this time many, innovative technologies were born and buried. However, many new capabilities emerged from this period of unrest; one such example is the advent of Optical MEMS (MOEMS). Many academics and corporate laboratories pursued the development of MOEMS during the economic boom and, in the author's view; MOEMS surfaced as a powerful and versatile tool set that has proved invaluable and in the last few years during economic downturn, stood the test of time. In the Telecommunications industry, for optical switching and wavelength management applications MOEMS has proven to be the technology of choice. (2) Variable Optical Attenuators (VOA), Wavelength Blockers (WB), Dynamic Gain Equalizers (DGE), and most recently Wavelength Selective Switches (WSS) are being used in the numerous recent network deployments. Moreover, agile networks of the future will have MOEMS at every node. This presentation will provide an overview of the history of MOEMS in Telecommunications, discuss its byproducts and offer a window into the future of the technology.

  18. Optical MEMS: boom, bust and beyond

    Science.gov (United States)

    Ramani, Chandra Mouli

    2005-10-01

    Optical Telecommunications bandwidth, spurred by the growth of the internet, experienced unprecedented growth in the late 1990's. The creation of new enterprises was vast and the expansion of established component, system and services companies was also breathtaking. This period of speculative growth was followed in 2001-2004 by one of the most significant market crashes in history. While $20B of venture capital was invested in optical telecom in the last 10 years, the vast majority of that has been written off in the last four. Countless start-ups inaugurated with great fanfare at the end of the 20th century were unceremoniously shut down at the start of the 21st. (1) As in all speculative bubbles, innovative technologies were born and buried. Nonetheless, new capabilities emerge from the chaos and disruption; one such example is the advent of Optical MEMS (MOEMS). Its development was vigorously pursued in both academic and corporate laboratories during the boom and, in the author's view; MOEMS constitutes a powerful and versatile tool set that is an invaluable residual of the last few years. In Telecommunications, MOEMS has proven to be the technology of choice for many optical switching and wavelength management applications. (2) Variable Optical Attenuators (VOA), Wavelength Blockers (WB), Dynamic Gain Equalizers (DGE), and most recently Wavelength Selective Switches (WSS) are being used in the numerous recent network deployments. Moreover, agile networks of the future will have MOEMS at every node. This presentation will provide an overview of the history of MOEMS in Telecommunications, discuss its byproducts and project the future of the technology.

  19. Thermoelectrical Generator for a MEMS-Fuze

    Directory of Open Access Journals (Sweden)

    A. K. Efremov

    2015-01-01

    Full Text Available The structure of modern fuzes includes micro-electromechanical systems (MEMS, which have such advanced devices as micro-accelerometers and micro-switches, being triggered at a specified level of setback. Independent power source (PS, as an inherent part of the MEMSfuze, charges an energy storage unit during the shot and triggers the fuze firing circuit when the shell encounters the target. Operating level of the control signal should be achieved within the time of remote arming, determined by the type of ammunition. The paper considers a possibility to develop PS as a thermoelectric generator (TEG with aerodynamic heating of hot junctions due to friction of the projectile body on the incoming airflow. The initial temperature is determined by the driving band cutting into the rifling and friction during the movement of projectile through the tube bore. The paper presents a technique for calculating the temperature field along the body of the projectile from the critical point, located at the top of the shell head. The solution of the equation of heat balance reveals the temporal development of the projectile body temperature. The proposed mathematical model of the TEG describes the process of converting heat into electrical output signal (thermo-EMF. An example of calculation for a specific artillery system – 57-mm anti-aircraft gun S-60 is given. Calculation of the TEG output signal was limited by the time, which is necessary to reach the top of the projectile trajectory. It is shown that at high altitude the temperature difference may drop to zero, thus cutting off the TEG output signal. Selection of capacitive storage parameters can be based on the reliability test conditions of the fuze firing circuit actuators, taking into account the partial storage discharge on the trajectory before the projectile encounters the target.

  20. MEMS and MOEMS for national security applications

    Science.gov (United States)

    Scott, Marion W.

    2003-01-01

    Major opportunities for microsystem insertion into commercial applications, such as telecommunications and medical prosthesis, are well known. Less well known are applications that ensure the security of our nation, the protection of its armed forces, and the safety of its citizens. Microsystems enable entirely new possibilities to meet National Security needs, which can be classed along three lines: anticipating security needs and threats, deterring the efficacy of identified threats, and defending against the application of these threats. In each of these areas, specific products that are enabled by MEMS and MOEMS are discussed. In the area of anticipating needs and threats, sensored microsystems designed for chem/bio/nuclear threats, and sensors for border and asset protection can significantly secure our borders, ports, and transportation systems. Key features for these applications include adaptive optics and spectroscopic capabilities. Microsystems to monitor soil and water quality can be used to secure critical infrastructure, food safety can be improved by in-situ identification of pathogens, and sensored buildings can ensure the architectural safety of our homes and workplaces. A challenge to commercializing these opportunities, and thus making them available for National Security needs, is developing predictable markets and predictable technology roadmaps. The integrated circuit manufacturing industry provides an example of predictable technology maturation and market insertion, primarily due to the existence of a "unit cell" that allows volume manufacturing. It is not clear that microsystems can follow an analogous path. The possible paths to affordable low-volume production, as well as the prospects of a microsystems unit cell, are discussed.

  1. 77 GHz MEMS antennas on high-resistivity silicon for linear and circular polarization

    KAUST Repository

    Sallam, M. O.

    2011-07-01

    Two new MEMS antennas operating at 77 GHz are presented in this paper. The first antenna is linearly polarized. It possesses a vertical silicon wall that carries a dipole on top of it. The wall is located on top of silicon substrate covered with a ground plane. The other side of the substrate carries a microstrip feeding network in the form of U-turn that causes 180 phase shift. This phase-shifter feeds the arms of the dipole antenna via two vertical Through-Silicon Vias (TSVs) that go through the entire wafer. The second antenna is circularly polarized and formed using two linearly polarized antennas spatially rotated with respect to each other by 90 and excited with 90 phase shift. Both antennas are fabricated using novel process flow on a single high-resistivity silicon wafer via bulk micromachining. Only three processing steps are required to fabricate these antennas. The proposed antennas have appealing characteristics, such as high polarization purity, high gain, and high radiation efficiency. © 2011 IEEE.

  2. Transplantation tool integrated with MEMS manipulator for retinal pigment epithelium cell sheet.

    Science.gov (United States)

    Wada, H; Konishi, S

    2013-01-01

    This paper reports a transplantation tool for the retinal pigment epithelium in an eye. We have developed MEMS manipulator as an end-effector for transplantation of retinal pigment epithelium cell sheet. Typical size of MEMS manipulator is 3mm×3mm. MEMS manipulator was made of polydimethylsiloxane and driven by pneumatic balloon actuators. MEMS manipulator have been improved and integrated with several functions by sensors and actuators. MEMS manipulator is integrated into a transplantation tool. A whole tool also requires improvements based on our experimental results. We have improved our tool in terms of assembling, sealing, and operation.

  3. Aiding Vertical Guidance Understanding

    Science.gov (United States)

    Feary, Michael; McCrobie, Daniel; Alkin, Martin; Sherry, Lance; Polson, Peter; Palmer, Everett; McQuinn, Noreen

    1998-01-01

    A two-part study was conducted to evaluate modern flight deck automation and interfaces. In the first part, a survey was performed to validate the existence of automation surprises with current pilots. Results indicated that pilots were often surprised by the behavior of the automation. There were several surprises that were reported more frequently than others. An experimental study was then performed to evaluate (1) the reduction of automation surprises through training specifically for the vertical guidance logic, and (2) a new display that describes the flight guidance in terms of aircraft behaviors instead of control modes. The study was performed in a simulator that was used to run a complete flight with actual airline pilots. Three groups were used to evaluate the guidance display and training. In the training, condition, participants went through a training program for vertical guidance before flying the simulation. In the display condition, participants ran through the same training program and then flew the experimental scenario with the new Guidance-Flight Mode Annunciator (G-FMA). Results showed improved pilot performance when given training specifically for the vertical guidance logic and greater improvements when given the training and the new G-FMA. Using actual behavior of the avionics to design pilot training and FMA is feasible, and when the automated vertical guidance mode of the Flight Management System is engaged, the display of the guidance mode and targets yields improved pilot performance.

  4. Vertical market participation

    DEFF Research Database (Denmark)

    Schrader, Alexander; Martin, Stephen

    1998-01-01

    Firms that operate at both levels of vertically related Cournot oligopolies will purchase some input supplies from independent rivals, even though they can produce the good at a lower cost, driving up input price for nonintegrated firms at the final good level. Foreclosure, which avoids this stra...... this strategic behavior, yields better market performance than Cournot beliefs...

  5. Diel vertical migrat..

    African Journals Online (AJOL)

    2002-01-24

    Jan 24, 2002 ... Ringelberg 11964 The positively photo tactic reaction of Daphnia magna. Straus: A contribution to the understanding of diurnal vertical migration. Netherlands Journal of. Sea Research 2: 319—406. Ringelberg J 1980 Introductory remarks: causal and teleological aspects of diurnal migration. ~ In: Kerfoot,.

  6. Global Vertical Reference Frame

    Czech Academy of Sciences Publication Activity Database

    Burša, Milan; Kenyon, S.; Kouba, J.; Šíma, Zdislav; Vatrt, V.; Vojtíšková, M.

    -, č. 5 (2009), s. 53-63 ISSN 1801-8483 R&D Projects: GA ČR GA205/08/0328 Institutional research plan: CEZ:AV0Z10030501 Keywords : sea surface topography * satellite altimetry * vertical frames Subject RIV: BN - Astronomy, Celestial Mechanics, Astrophysics

  7. Nondestructive surface profiling of hidden MEMS using an infrared low-coherence interferometric microscope

    Science.gov (United States)

    Krauter, Johann; Osten, Wolfgang

    2018-03-01

    There are a wide range of applications for micro-electro-mechanical systems (MEMS). The automotive and consumer market is the strongest driver for the growing MEMS industry. A 100 % test of MEMS is particularly necessary since these are often used for safety-related purposes such as the ESP (Electronic Stability Program) system. The production of MEMS is a fully automated process that generates 90 % of the costs during the packaging and dicing steps. Nowadays, an electrical test is carried out on each individual MEMS component before these steps. However, after encapsulation, MEMS are opaque to visible light and other defects cannot be detected. Therefore, we apply an infrared low-coherence interferometer for the topography measurement of those hidden structures. A lock-in algorithm-based method is shown to calculate the object height and to reduce ghost steps due to the 2π -unambiguity. Finally, measurements of different MEMS-based sensors are presented.

  8. Optimal design of a touch trigger probe

    Science.gov (United States)

    Li, Rui-Jun; Xiang, Meng; Fan, Kuang-Chao; Zhou, Hao; Feng, Jian

    2015-02-01

    A tungsten stylus with a ruby ball tip was screwed into a floating plate, which was supported by four leaf springs. The displacement of the tip caused by the contact force in 3D could be transferred into the tilt or vertical displacement of a plane mirror mounted on the floating plate. A quadrant photo detector (QPD) based two dimensional angle sensor was used to detect the tilt or the vertical displacement of the plane mirror. The structural parameters of the probe are optimized for equal sensitivity and equal stiffness in a displacement range of +/-5 μm, and a restricted horizontal size of less than 40 mm. Simulation results indicated that the stiffness was less than 0.6 mN/μm and equal in 3D. Experimental results indicated that the probe could be used to achieve a resolution of 1 nm.

  9. MEMS fabricated energy harvesting device with 2D resonant structure

    DEFF Research Database (Denmark)

    Crovetto, Andrea; Wang, Fei; Triches, Marco

    This paper reports on a MEMS energy harvester able to generate power from two perpendicular ambient vibration directions. CYTOP polymer is used both as the electret material for electrostatic transduction and as a bonding interface for low-temperature wafer bonding. With final chip size of ~1 cm2...

  10. A MEMS Energy Harvesting Device for Vibration with Low Acceleration

    DEFF Research Database (Denmark)

    Triches, Marco; Wang, Fei; Crovetto, Andrea

    2012-01-01

    We propose a polymer electret based energy harvesting device in order to extract energy from vibration sources with low acceleration. With MEMS technology, a silicon structure is fabricated which can resonate in 2D directions. Thanks to the excellent mechanical properties of the silicon material...

  11. Tailoring the nonlinear response of MEMS resonators using shape optimization

    DEFF Research Database (Denmark)

    Li, Lily L.; Polunin, Pavel M.; Dou, Suguang

    2017-01-01

    We demonstrate systematic control of mechanical nonlinearities in micro-electromechanical (MEMS) resonators using shape optimization methods. This approach generates beams with non-uniform profiles, which have nonlinearities and frequencies that differ from uniform beams. A set of bridge-type mic...

  12. Characterization of dielectric charging in RF MEMS capacitive switches

    NARCIS (Netherlands)

    Herfst, R.W.; Huizing, H.G.A.; Steeneken, P.G.; Schmitz, Jurriaan

    2006-01-01

    RF MEMS capacitive switches show great promise for use in wireless communication devices such as mobile phones, but the successful application of these switches is hindered by reliability concerns: charge injection in the dielectric layer (SiN) can cause irreversible stiction of the moving part of

  13. The conical conformal MEMS quasi-end-fire array antenna

    Science.gov (United States)

    Cong, Lin; Xu, Lixin; Li, Jianhua; Wang, Ting; Han, Qi

    2017-03-01

    The microelectromechanical system (MEMS) quasi-end-fire array antenna based on a liquid crystal polymer (LCP) substrate is designed and fabricated in this paper. The maximum radiation direction of the antenna tends to the cone axis forming an angle less than 90∘, which satisfies the proximity detection system applied at the forward target detection. Furthermore, the proposed antenna is fed at the ended side in order to save internal space. Moreover, the proposed antenna takes small covering area of the proximity detection system. The proposed antenna is fabricated by using the flexible MEMS process, and the measurement results agree well with the simulation results. This is the first time that a conical conformal array antenna is fabricated by the flexible MEMS process to realize the quasi-end-fire radiation. A pair of conformal MEMS array antennas resonates at 14.2 GHz with its mainlobes tending to the cone axis forming a 30∘ angle and a 31∘ angle separately, and the gains achieved are 1.82 dB in two directions, respectively. The proposed antenna meets the performance requirements for the proximity detection system which has vast application prospects.

  14. Design of the MEMS Piezoresistive Electronic Heart Sound Sensor

    Directory of Open Access Journals (Sweden)

    Guojun Zhang

    2016-11-01

    Full Text Available This paper proposes the electronic heart sound sensor, based on the piezoresistive principle and MEMS (Micro-Electro-Mechanical System technology. Firstly, according to the characteristics of heart sound detection, the double-beam-block microstructure has been proposed, and the theoretical analysis and finite element method (FEM simulation have been carried out. Combined with the natural frequency response of the heart sound (20~600 Hz, its structure sizes have been determined. Secondly, the processing technology of the microstructure with the stress concentration grooves has been developed. The material and sizes of the package have been determined by the three-layer medium transmission principle. Lastly, the MEMS piezoresistive electronic heart sound sensor has been tested compared with the 3200-type electronic stethoscope from 3M (São Paulo, MN, USA. The test results show that the heart sound waveform tested by the MEMS electronic heart sound sensor are almost the same as that tested by the 3200-type electronic stethoscope. Moreover, its signal-to-noise ratio is significantly higher. Compared with the traditional stethoscope, the MEMS heart sound sensor can provide the first and second heart sounds containing more abundant information about the lesion. Compared with the 3200-type electronic stethoscope from 3M, it has better performance and lower cost.

  15. Design of the MEMS Piezoresistive Electronic Heart Sound Sensor.

    Science.gov (United States)

    Zhang, Guojun; Liu, Mengran; Guo, Nan; Zhang, Wendong

    2016-11-07

    This paper proposes the electronic heart sound sensor, based on the piezoresistive principle and MEMS (Micro-Electro-Mechanical System) technology. Firstly, according to the characteristics of heart sound detection, the double-beam-block microstructure has been proposed, and the theoretical analysis and finite element method (FEM) simulation have been carried out. Combined with the natural frequency response of the heart sound (20~600 Hz), its structure sizes have been determined. Secondly, the processing technology of the microstructure with the stress concentration grooves has been developed. The material and sizes of the package have been determined by the three-layer medium transmission principle. Lastly, the MEMS piezoresistive electronic heart sound sensor has been tested compared with the 3200-type electronic stethoscope from 3M (São Paulo, MN, USA). The test results show that the heart sound waveform tested by the MEMS electronic heart sound sensor are almost the same as that tested by the 3200-type electronic stethoscope. Moreover, its signal-to-noise ratio is significantly higher. Compared with the traditional stethoscope, the MEMS heart sound sensor can provide the first and second heart sounds containing more abundant information about the lesion. Compared with the 3200-type electronic stethoscope from 3M, it has better performance and lower cost.

  16. Fast tunable blazed MEMS grating for external cavity lasers

    Science.gov (United States)

    Tormen, Maurizio; Niedermann, Philippe; Hoogerwerf, Arno; Shea, Herbert; Stanley, Ross

    2017-11-01

    Diffractive MEMS are interesting for a wide range of applications, including displays, scanners or switching elements. Their advantages are compactness, potentially high actuation speed and in the ability to deflect light at large angles. We have designed and fabricated deformable diffractive MEMS grating to be used as tuning elements for external cavity lasers. The resulting device is compact, has wide tunability and a high operating speed. The initial design is a planar grating where the beams are free-standing and attached to each other using leaf springs. Actuation is achieved through two electrostatic comb drives at either end of the grating. To prevent deformation of the free-standing grating, the device is 10 μm thick made from a Silicon on Insulator (SOI) wafer in a single mask process. At 100V a periodicity tuning of 3% has been measured. The first resonant mode of the grating is measured at 13.8 kHz, allowing high speed actuation. This combination of wide tunability and high operating speed represents state of the art in the domain of tunable MEMS filters. In order to improve diffraction efficiency and to expand the usable wavelength range, a blazed version of the deformable MEMS grating has been designed. A key issue is maintaining the mechanical properties of the original device while providing optically smooth blazed beams. Using a process based on anisotropic KOH etching, blazed gratings have been obtained and preliminary characterization is promising.

  17. Realization of a hybrid-integrated MEMS scanning grating spectrometer

    Science.gov (United States)

    Pügner, Tino; Knobbe, Jens; Grüger, Heinrich; Schenk, Harald

    2012-06-01

    Spectrometers and Spectrographs based on scanning grating monochromators are well-established tools for various applications. As new applications came into focus in the last few years, there is a demand for more sophisticated and miniaturized systems. The next generation spectroscopic devices should exhibit very small dimensions and low power consumption, respectively. We have developed a spectroscopic system with a volume of only (15 × 10 × 14) mm3 and a few milliwatts of power consumption that has the potential to fulfill the demands of the upcoming applications. Our approach is based on two dierent strategies. First, we apply resonantly driven MEMS (micro electro mechanical systems). The latest generation of our MEMS scanning grating device has two integrated optical slits and piezoresistive position detection in addition to the already existing miniaturized 1-d scanning grating plate and the electrostatic driving mechanism. Our second strategy is to take advantage of the hybrid integration of optical components by highly sophisticated manufacturing technologies. One objective is the combination of MEMS technology and a planar mounting approach, which potentially facilitate the mass production of spectroscopic systems and a signicant reduction of cost per unit. We present the optical system design as well as the realization of a miniaturized scanning grating spectrometer for the near infrared (NIR) range between 950 nm and 1900 nm with a spectral resolution of 10 nm. The MEMS devices as well as the optical components have been manufactured and rst samples of the spectroscopic measurement device have been mounted by an automated die bonder.

  18. MEMS Accelerometer with Screen Printed Piezoelectric Thick Film

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Lau-Moeller, R.; Bove, T.

    2006-01-01

    A bulk-micromachined piezoelectric MEMS accelerometer with screen printed piezoelectric Pb(ZrxTil )O3(PZT) thick film (TF) as the sensing material has been fabricated and characterized. The accelerometer has a four beam structure with a central seismic mass (3600x3600x500 pm3) and a total chip size...

  19. Adaptive Sliding Mode Control of MEMS AC Voltage Reference Source

    Directory of Open Access Journals (Sweden)

    Ehsan Ranjbar

    2017-01-01

    Full Text Available The accuracy of physical parameters of a tunable MEMS capacitor, as the major part of MEMS AC voltage reference, is of great importance to achieve an accurate output voltage free of the malfunctioning noise and disturbance. Even though strenuous endeavors are made to fabricate MEMS tunable capacitors with desiderated accurate physical characteristics and ameliorate exactness of physical parameters’ values, parametric uncertainties ineluctably emerge in fabrication process attributable to imperfections in micromachining process. First off, this paper considers applying an adaptive sliding mode controller design in the MEMS AC voltage reference source so that it is capable of giving off a well-regulated output voltage in defiance of jumbling parametric uncertainties in the plant dynamics and also aggravating external disturbance imposed on the system. Secondly, it puts an investigatory comparison with the designed model reference adaptive controller and the pole-placement state feedback one into one’s prospective. Not only does the tuned adaptive sliding mode controller show remarkable robustness against slow parameter variation and external disturbance being compared to the pole-placement state feedback one, but also it immensely gets robust against the external disturbance in comparison with the conventional adaptive controller. The simulation results are promising.

  20. Modeling of MEMS Mirrors Actuated by Phase-Change Mechanism

    Directory of Open Access Journals (Sweden)

    David Torres

    2017-04-01

    Full Text Available Given the multiple applications for micro-electro-mechanical system (MEMS mirror devices, most of the research efforts are focused on improving device performance in terms of tilting angles, speed, and their integration into larger arrays or systems. The modeling of these devices is crucial for enabling a platform, in particular, by allowing for the future control of such devices. In this paper, we present the modeling of a MEMS mirror structure with four actuators driven by the phase-change of a thin film. The complexity of the device structure and the nonlinear behavior of the actuation mechanism allow for a comprehensive study that encompasses simpler electrothermal designs, thus presenting a general approach that can be adapted to most MEMS mirror designs based on this operation principle. The MEMS mirrors presented in this work are actuated by Joule heating and tested using optical techniques. Mechanical and thermal models including both pitch and roll displacements are developed by combining theoretical analysis (using both numerical and analytical tools with experimental data and subsequently verifying with quasi-static and dynamic experiments.

  1. A single-mask thermal displacement sensor in MEMS

    NARCIS (Netherlands)

    Hogervorst, R.P.; Krijnen, B.; Krijnen, B.; Brouwer, Dannis Michel; Engelen, Johannes Bernardus Charles; Staufer, U.

    Position sensing in MEMS is often based on the principle of varying capacitance [1]. Alternative position sensing principles include using integrated optical waveguides [2] or varying thermal conductance [3]. Lantz et al demonstrated a thermal displacement sensor achieving nanometre resolution on a

  2. A single-mask thermal displacement sensor in MEMS

    NARCIS (Netherlands)

    Krijnen, B.; Krijnen, B.; Hogervorst, R.P.; van Dijk, J.W.; Engelen, Johannes Bernardus Charles; Woldering, L.A.; Brouwer, Dannis Michel; Abelmann, Leon; Soemers, Herman

    2011-01-01

    This work presents a MEMS displacement sensor based on the conductive heat transfer of a resistively heated silicon structure towards an actuated stage parallel to the structure. This differential sensor can be easily incorporated into a silicon-on-insulator-based process, and fabricated within the

  3. A MEMS Condenser Microphone-Based Intracochlear Acoustic Receiver.

    Science.gov (United States)

    Pfiffner, Flurin; Prochazka, Lukas; Peus, Dominik; Dobrev, Ivo; Dalbert, Adrian; Sim, Jae Hoon; Kesterke, Rahel; Walraevens, Joris; Harris, Francesca; Roosli, Christof; Obrist, Dominik; Huber, Alexander

    2017-10-01

    Intracochlear sound pressure (ICSP) measurements are limited by the small dimensions of the human inner ear and the requirements imposed by the liquid medium. A robust intracochlear acoustic receiver (ICAR) for repeated use with a simple data acquisition system that provides the required high sensitivity and small dimensions does not yet exist. The work described in this report aims to fill this gap and presents a new microelectromechanical systems (MEMS) condenser microphone (CMIC)-based ICAR concept suitable for ICSP measurements in human temporal bones. The ICAR head consisted of a passive protective diaphragm (PD) sealing the MEMS CMIC against the liquid medium, enabling insertion into the inner ear. The components of the MEMS CMIC-based ICAR were expressed by a lumped element model (LEM) and compared to the performance of successfully fabricated ICARs. Good agreement was achieved between the LEM and the measurements with different sizes of the PD. The ICSP measurements in a human cadaver temporal bone yielded data in agreement with the literature. Our results confirm that the presented MEMS CMIC-based ICAR is a promising technology for measuring ICSP in human temporal bones in the audible frequency range. A sensor for evaluation of the biomechanical hearing process by quantification of ICSP is presented. The concept has potential as an acoustic receiver in totally implantable cochlear implants.

  4. Materials analysis of fluorocarbon films for MEMS applications

    NARCIS (Netherlands)

    Elders, J.; Jansen, Henricus V.; Elwenspoek, Michael Curt

    1994-01-01

    In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS

  5. Modeling of a bimetallic MEMS-based infrared detector

    Science.gov (United States)

    Pevtsov, E. Ph; Breev, S. V.; Demenkova, T. A.

    2018-01-01

    In work techniques of calculations of the key parameters of the bimetal capacitive IR detectors matrix are presented. Sensitivity characteristics of the bimetal detector were calculated and prototype model of detector in the form of bimetallic console was produced. The possibility of use of capacitive MEMS-receivers on basis of bimetallic effect as an alternative to pyroelectric and microbolometer IR detectors is shown.

  6. Pulse Reversal PermAlloy Plating Process for MEMS Applications

    DEFF Research Database (Denmark)

    Smistrup, Kristian; Tang, Peter Torben; Møller, Per

    2007-01-01

    -stress deposits.We demonstrate selected MEMS applications of the electrolyte.The use of the strong complexing agent 5-sulfosalicylic acidallows for a photometric determination of the Fe3+-level in thebath and eliminate precipitates. This makes the electrolytesuitable as a Permalloy plating process used...

  7. Noise Reduction for a MEMS-Gyroscope-Based Head Mouse.

    Science.gov (United States)

    Du, Jiaying; Gerdtman, Christer; Lindén, Maria

    2015-01-01

    In this paper, four different signal processing algorithms which can be applied to reduce the noise from a MEMS-gyroscope-based computer head mouse are presented. MEMS-gyroscopes are small, light, cheap and widely used in many electrical products. MultiPos, a MEMS-gyroscope-based computer head mouse system was designed for persons with movement disorders. Noise such as physiological tremor and electrical noise is a common problem for the MultiPos system. In this study four different signal processing algorithms were applied and evaluated by simulation in MATLAB and implementation in a dsPIC, with aim to minimize the noise in MultiPos. The algorithms were low-pass filter, Least Mean Square (LMS) algorithm, Kalman filter and Weighted Fourier Linear Combiner (WFLC) algorithm. Comparisons and system tests show that these signal processing algorithms can be used to improve the MultiPos system. The WFLC algorithm was found the best method for noise reduction in the application of a MEMS-gyroscope-based head mouse.

  8. PECVD silicon carbide surface micromachining technology and selected MEMS applications

    NARCIS (Netherlands)

    Rajaraman, V.; Pakula, L.S.; Yang, H.; French, P.J.; Sarro, P.M.

    2011-01-01

    Attractive material properties of plasma enhanced chemical vapour deposited (PECVD) silicon carbide (SiC) when combined with CMOS-compatible low thermal budget processing provides an ideal technology platform for developing various microelectromechanical systems (MEMS) devices and merging them with

  9. Integrated Electromechanical Transduction Schemes for Polymer MEMS Sensors

    Directory of Open Access Journals (Sweden)

    Damien Thuau

    2018-04-01

    Full Text Available Polymer Micro ElectroMechanical Systems (MEMS have the potential to constitute a powerful alternative to silicon-based MEMS devices for sensing applications. Although the use of commercial photoresists as structural material in polymer MEMS has been widely reported, the integration of functional polymer materials as electromechanical transducers has not yet received the same amount of interest. In this context, we report on the design and fabrication of different electromechanical schemes based on polymeric materials ensuring different transduction functions. Piezoresistive transduction made of carbon nanotube-based nanocomposites with a gauge factor of 200 was embedded within U-shaped polymeric cantilevers operating either in static or dynamic modes. Flexible resonators with integrated piezoelectric transduction were also realized and used as efficient viscosity sensors. Finally, piezoelectric-based organic field effect transistor (OFET electromechanical transduction exhibiting a record sensitivity of over 600 was integrated into polymer cantilevers and used as highly sensitive strain and humidity sensors. Such advances in integrated electromechanical transduction schemes should favor the development of novel all-polymer MEMS devices for flexible and wearable applications in the future.

  10. Structure, properties, and MEMS and microelectronic applications of ...

    Indian Academy of Sciences (India)

    Abstract. Vanadium oxides have for many decades attracted much attention for their rich and unique physical properties which pose intriguing questions as to their fundamental origins as well as offering numerous potential applications for microelectronics, sensors, and microelectromechanical systems (MEMS). This.

  11. Mems-Based Waste Vibration and Acoustic Energy Harvesters

    Science.gov (United States)

    2014-12-01

    behind the semiconductor-based integrated circuit industry, the MEMS field has capitalized upon the significant advances made in photolithography and...Surface and Coatings Technology, vol. 198, pp. 68–73, 2005. [20] M. Morita, T. Ohmi, E. Hasegawa, M. Kawakami and K. Suma . Control factor of native

  12. Stress Analysis of SiC MEMS Using Raman Spectroscopy

    Science.gov (United States)

    Ness, Stanley J.; Marciniak, M. A.; Lott, J. A.; Starman, L. A.; Busbee, J. D.; Melzak, J. M.

    2003-03-01

    During the fabrication of Micro-Electro-Mechanical Systems (MEMS), residual stress is often induced in the thin films that are deposited to create these systems. These stresses can cause the device to fail due to buckling, curling, or fracture. Industry is looking for ways to characterize the stress during the deposition of thin films in order to reduce or eliminate device failure. Micro-Raman spectroscopy has been successfully used to characterize poly-Si MEMS devices made with the MUMPS® process. Raman spectroscopy was selected because it is nondestructive, fast and has the potential for in situ stress monitoring. This research attempts to use Raman spectroscopy to analyze the stress in SiC MEMS made with the MUSiC® process. Raman spectroscopy is performed on 1-2-micron-thick SiC thin films deposited on silicon, silicon nitride, and silicon oxide substrates. The most common poly-type of SiC found in thin film MEMS made with the MUSiC® process is 3C-SiC. Research also includes baseline spectra of 6H, 4H, and 15R poly-types of bulk SiC.

  13. RF sputtering: A viable tool for MEMS fabrication

    Indian Academy of Sciences (India)

    RF sputtering: A viable tool for MEMS fabrication. 545 obtain highly c-axis oriented films, which is a requirement for these films to be piezoelectric in nature. In addition to the dielectric films, thin films of Cr, Au, Ti and Pt on silicon or glass substrates, (used for ZnO deposition) were also deposited by RF sputtering process.

  14. MemBrain: improving the accuracy of predicting transmembrane helices.

    Directory of Open Access Journals (Sweden)

    Hongbin Shen

    Full Text Available Prediction of transmembrane helices (TMH in alpha helical membrane proteins provides valuable information about the protein topology when the high resolution structures are not available. Many predictors have been developed based on either amino acid hydrophobicity scale or pure statistical approaches. While these predictors perform reasonably well in identifying the number of TMHs in a protein, they are generally inaccurate in predicting the ends of TMHs, or TMHs of unusual length. To improve the accuracy of TMH detection, we developed a machine-learning based predictor, MemBrain, which integrates a number of modern bioinformatics approaches including sequence representation by multiple sequence alignment matrix, the optimized evidence-theoretic K-nearest neighbor prediction algorithm, fusion of multiple prediction window sizes, and classification by dynamic threshold. MemBrain demonstrates an overall improvement of about 20% in prediction accuracy, particularly, in predicting the ends of TMHs and TMHs that are shorter than 15 residues. It also has the capability to detect N-terminal signal peptides. The MemBrain predictor is a useful sequence-based analysis tool for functional and structural characterization of helical membrane proteins; it is freely available at http://chou.med.harvard.edu/bioinf/MemBrain/.

  15. Modeling and non-linear responses of MEMS capacitive accelerometer

    Directory of Open Access Journals (Sweden)

    Sri Harsha C.

    2014-01-01

    Full Text Available A theoretical investigation of an electrically actuated beam has been illustrated when the electrostatic-ally actuated micro-cantilever beam is separated from the electrode by a moderately large gap for two distinct types of geometric configurations of MEMS accelerometer. Higher order nonlinear terms have been taken into account for studying the pull in voltage analysis. A nonlinear model of gas film squeezing damping, another source of nonlinearity in MEMS devices is included in obtaining the dynamic responses. Moreover, in the present work, the possible source of nonlinearities while formulating the mathematical model of a MEMS accelerometer and their influences on the dynamic responses have been investigated. The theoretical results obtained by using MATLAB has been verified with the results obtained in FE software and has been found in good agreement. Criterion towards stable micro size accelerometer for each configuration has been investigated. This investigation clearly provides an understanding of nonlinear static and dynamics characteristics of electrostatically micro cantilever based device in MEMS.

  16. MEMS-based tunable gratings and their applications

    Science.gov (United States)

    Yu, Yiting; Yuan, Weizheng; Qiao, Dayong

    2015-03-01

    The marriage of optics and MEMS has resulted in a new category of optical devices and systems that have unprecedented advantages compared with their traditional counterparts. As an important spatial light modulating technology, diffractive optical MEMS obtains a wide variety of successful commercial applications, e.g. projection displays, optical communication and spectral analysis, due to its features of highly compact, low-cost, IC-compatible, excellent performance, and providing possibilities for developing totally new, yet smart devices and systems. Three most successful MEMS diffraction gratings (GLVs, Polychromator and DMDs) are briefly introduced and their potential applications are analyzed. Then, three different MEMS tunable gratings developed by our group, named as micro programmable blazed gratings (μPBGs) and micro pitch-tunable gratings (μPTGs) working in either digital or analog mode, are demonstrated. The strategies to largely enhance the maximum blazed angle and grating period are described. Some preliminary application explorations based on the developed grating devices are also shown. For our ongoing research focus, we will further improve the device performance to meet the engineering application requirements.

  17. TCMO(TM): A Versatile MEMS Oscillator Timing Platform

    Science.gov (United States)

    2009-11-01

    Honolulu, Hawaii, USA (IEEE CFP08FRE), pp. 396-401. [7] B. Neubig, 2008, “MEMS-Oscillators–Opportunities and Limitations” (in German), Markt & Technik, No. 37, 28-29. (http://www.axtal.com/info/MuT_37_08.pdf)

  18. 3D Printing and Bioprinting in MEMS Technology

    Directory of Open Access Journals (Sweden)

    Chee Kai Chua

    2017-07-01

    Full Text Available 3D printing and bioprinting have advanced significantly in printing resolution in recent years, which presents a great potential for fabricating small and complex features suitable for microelectromechanical systems (MEMS with new functionalities. This special issue aims to give a glimpse into the future of this research field.

  19. Mechanical Robustness and Hermeticity Monitoring for MEMS Thin Film Encapsulation

    NARCIS (Netherlands)

    Santagata, F.

    2011-01-01

    Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor structures being exposed to external perturbations such as dust, humidity, touching, and gas pressure. An upcoming and cost-effective way of encapsulation is zero-level packaging or thin-film

  20. THE ORNL ATOM PROBE

    OpenAIRE

    Miller, M.

    1986-01-01

    The ORNL Atom Probe is a microanalytical tool for studies in materials science. The instrument is a combination of a customized version of the vacuum system of the VG FIM-100 atom probe, an ORNL-designed microcomputer-controlled digital timing system, and a double curved CEMA Imaging Atom Probe detector. The atom probe combines four instruments into one - namely a field ion microscope, an energy compensated time-of-flight mass spectrometer, an imaging atom probe, and a pulsed laser atom probe.

  1. Mobile Game Probes

    DEFF Research Database (Denmark)

    Borup Lynggaard, Aviaja

    2006-01-01

    This paper will examine how probes can be useful for game designers in the preliminary phases of a design process. The work is based upon a case study concerning pervasive mobile phone games where Mobile Game Probes have emerged from the project. The new probes are aimed towards a specific target...... group and the goal is to specify the probes so they will cover the most relevant areas for our project. The Mobile Game Probes generated many interesting results and new issues occurred, since the probes came to be dynamic and favorable for the process in new ways....

  2. Memórias de uma vida passada?

    Directory of Open Access Journals (Sweden)

    Erlendur Haraldsson

    2014-04-01

    Full Text Available Contexto : Há crianças que alegam ter memórias de uma vida passada. Se essas supostas memórias puderem ser verificadas, elas poderão ser bastante relevantes para a questão da relação mente-cérebro. Elas poderão indicar que a memória não está apenas armazenada no cérebro e que a mente pode existir sem um cérebro e ainda assim reter algumas de suas memórias. Essas possibilidades são contrárias ao que atualmente se sabe sobre memória e sua dependência do funcionamento cerebral. Objetivos : Testar se um pesquisador independente obteria achados comparáveis aos de Stevenson (Universidade da Virgínia que publicou um grande números desses casos. Métodos : Entrevistar as crianças que faziam afirmações consistentes sobre uma vida passada e as pessoas que haviam testemunhado as crianças fazerem essas declarações. Três estudos psicológicos compararam crianças com e sem alegadas memórias de uma vida passada. Resultados : Em dois dos três casos apresentados, foi encontrada uma pessoa falecida cujas características eram compatíveis com as afirmações das crianças sobre uma vida anterior. Psicologicamente, essas crianças diferem das outras crianças, mostrando sinais de Transtorno de Estresse Pós-Traumático, provavelmente por causa das alegadas lembranças de como elas morreram em acidentes ou foram assassinadas. Conclusões : As características dos casos de “memória de vida passada” fazem com que estas sejam relevantes para a questão da relação mente-cérebro.

  3. Memória: entre o oral e o escrito

    Directory of Open Access Journals (Sweden)

    Maria Aparecida Bergamaschi

    2012-07-01

    Full Text Available  O trabalho discute a relação entre o oral e o escrito sob a perspectiva da memória como experiência humana. Retoma as significações de memória que prevaleceram na história do ocidente, relacionando-as com a oralidade, a escrita e as práticas escolares, evidenciando que, na medida em que a presença da escrita vai se tomando cada vez mais intensa na sociedade e na escola, a memória vai perdendo o prestígio e aparece de forma mais contundente a dicotomia entre memória oral e escrita. O conceito de apropriação, desenvolvido por Chartier, é utilizado para reatar a relação entre memória oral e escrita tendo como palco de análise as práticas escolares e as práticas de escrita entre alguns grupos indígenas brasileiros que têm, historicamente, a tradição oral como traço fundante de suas culturas e que, ao fazerem uso da escrita, reelaboram essa linguagem através de novas relações com a memória.Palavras-chave: oralidade e escrita, memória, práticas escolares.   Abstract The paper discusses the relation between the oral and the written under the perspective of memory as a human experience. It retakes the meanings of memory that prevailed in western history, relating it with the orality, the writing and the school practices, proving that, as the presence of writing becomes more intense in society and in school, memory looses prestige and the dichotomy appears in a stronger way between written and oral memory. The concept of appropriation developed by Chartier, is used in order to tie again the relation between oral and written memory by analyzing school practices and writing practices among some Brazilian indian groups. These groups have, historically, the oral tradition as foundation of their culture and, when writing, they reelaborate this language through new relations with memory. Keywords: oral and written, memory, school practices. 

  4. Vertical organic transistors

    Science.gov (United States)

    Lüssem, Björn; Günther, Alrun; Fischer, Axel; Kasemann, Daniel; Leo, Karl

    2015-11-01

    Organic switching devices such as field effect transistors (OFETs) are a key element of future flexible electronic devices. So far, however, a commercial breakthrough has not been achieved because these devices usually lack in switching speed (e.g. for logic applications) and current density (e.g. for display pixel driving). The limited performance is caused by a combination of comparatively low charge carrier mobilities and the large channel length caused by the need for low-cost structuring. Vertical Organic Transistors are a novel technology that has the potential to overcome these limitations of OFETs. Vertical Organic Transistors allow to scale the channel length of organic transistors into the 100 nm regime without cost intensive structuring techniques. Several different approaches have been proposed in literature, which show high output currents, low operation voltages, and comparatively high speed even without sub-μm structuring technologies. In this review, these different approaches are compared and recent progress is highlighted.

  5. A New MEMS Gyroscope Used for Single-Channel Damping.

    Science.gov (United States)

    Zhang, Zengping; Zhang, Wei; Zhang, Fuxue; Wang, Biao

    2015-04-30

    The silicon micromechanical gyroscope, which will be introduced in this paper, represents a novel MEMS gyroscope concept. It is used for the damping of a single-channel control system of rotating aircraft. It differs from common MEMS gyroscopes in that does not have a drive structure, itself, and only has a sense structure. It is installed on a rotating aircraft, and utilizes the aircraft spin to make its sensing element obtain angular momentum. When the aircraft is subjected to an angular rotation, a periodic Coriolis force is induced in the direction orthogonal to both the angular momentum and the angular velocity input axis. This novel MEMS gyroscope can thus sense angular velocity inputs. The output sensing signal is exactly an amplitude-modulation signal. Its envelope is proportional to the input angular velocity, and the carrier frequency corresponds to the spin frequency of the rotating aircraft, so the MEMS gyroscope can not only sense the transverse angular rotation of an aircraft, but also automatically change the carrier frequency over the change of spin frequency, making it very suitable for the damping of a single-channel control system of a rotating aircraft. In this paper, the motion equation of the MEMS gyroscope has been derived. Then, an analysis has been carried to solve the motion equation and dynamic parameters. Finally, an experimental validation has been done based on a precision three axis rate table. The correlation coefficients between the tested data and the theoretical values are 0.9969, 0.9872 and 0.9842, respectively. These results demonstrate that both the design and sensing mechanism are correct.

  6. "SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

    NARCIS (Netherlands)

    Kim, B.J.; Kim, G.M.; Liebau, M.; Huskens, Jurriaan; Reinhoudt, David; Brugger, J.P.

    2001-01-01

    In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called 'dry-demolding'. The SAMs functionality

  7. Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

    Science.gov (United States)

    Rao, A. V. Narasimha; Swarnalatha, V.; Pal, P.

    2017-12-01

    Anisotropic wet etching is a most widely employed for the fabrication of MEMS/NEMS structures using silicon bulk micromachining. The use of Si{110} in MEMS is inevitable when a microstructure with vertical sidewall is to be fabricated using wet anisotropic etching. In most commonly employed etchants (i.e. TMAH and KOH), potassium hydroxide (KOH) exhibits higher etch rate and provides improved anisotropy between Si{111} and Si{110} planes. In the manufacturing company, high etch rate is demanded to increase the productivity that eventually reduces the cost of end product. In order to modify the etching characteristics of KOH for the micromachining of Si{110}, we have investigated the effect of hydroxylamine (NH2OH) in 20 wt% KOH solution. The concentration of NH2OH is varied from 0 to 20% and the etching is carried out at 75 °C. The etching characteristics which are studied in this work includes the etch rates of Si{110} and silicon dioxide, etched surface morphology, and undercutting at convex corners. The etch rate of Si{110} in 20 wt% KOH + 15% NH2OH solution is measured to be four times more than that of pure 20 wt% KOH. Moreover, the addition of NH2OH increases the undercutting at convex corners and enhances the etch selectivity between Si and SiO2.

  8. A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators

    Science.gov (United States)

    Zhao, Jicong; Yuan, Quan; Kan, Xiao; Yang, Jinling; Yang, Fuhua

    2017-01-01

    This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au-Sn solder bonding is employed to provide a vacuum encapsulation as well as electrical conductions. Vertical silicon vias are micro-fabricated by glass reflow process. The optimized grounding, via pitch, and all-round shielding effectively reduce feed-through capacitance. Thus the signal-to-background ratios (SBRs) of the transmission signals increase from 17 dB to 20 dB, and the quality factor (Q) values of the packaged resonators go from around 8000 up to more than 9500. The measured average leak rate and shear strength are (2.55  ±  0.9)  ×  10-8 atm-cc s-1 and 42.53  ±  4.19 MPa, respectively. Furthermore, thermal cycling test between  -40 °C and 100 °C and high temperature storage test at 150 °C show that the resonant-frequency drifts are less than  ±7 ppm. In addition, the SBRs and the Q values have no obvious change after the tests. The experimental results demonstrated that the proposed encapsulation technique is well suited for the applications of RF MEMS devices.

  9. Metadados e arquiteturas de memória em ambientes programáveis

    Directory of Open Access Journals (Sweden)

    Carlos Henrique Rezende Falci

    2012-12-01

    O propósito desse artigo é discutir como a criação de memórias coletivas, em ambientes programáveis e com uso de metadados, provoca o intercruzamento das memórias comunicativas com as memórias culturais e permite o surgimento de arquiteturas de memória, aqui denominadas memórias culturais em permanente estado de construção. Os projetos analisados aqui parecem indicar que as memórias mediadas tecnologicamente, com uso de metadados, não são simplesmente formas de registro amplificadas, mas sim se apresentam como uma criação de memórias culturais a partir de uma poética baseada em metadados. Para compreender melhor a relação entre memórias culturais e comunicativas, o artigo apresenta e discute questões relativas ao caráter coletivo de registro desses tipos de memórias. A pesquisa aqui apresentada faz parte de um projeto de pesquisa mais amplo, financiado pela FAPEMIG, e cujo objetivo final é produzir experimentos que testem a hipótese que ora se discute, sobre novas arquiteturas para memórias culturais em ambientes programáveis.

  10. Dynamic characterization of MEMS using Raman spectroscopy

    International Nuclear Information System (INIS)

    Hu, Z X; Hedley, J; Gallacher, B J; Arce-Garcia, I

    2008-01-01

    This paper reports on utilizing Raman spectroscopy to characterize the motion and measure strain levels in dynamic micromechanical structures. The main advantages of such a technique is that surface features are not required to characterize the 3D motion as the crystal lattice is used as the reference frame and that it is suited to high frequency measurements. Two methodologies are presented. The first utilizes a strobed diode laser probe beam with the centre position of the Raman peak giving a measure of strain as a function of phase. A measurement resolution of 210 µstrain is obtained at frequencies up to 100 kHz. The second method uses a HeNe laser probe beam with the broadening of the Raman peak, indicating strain levels. Although no phase data are available in the latter technique, the technique is rapid and may be utilized on a Raman system without any modification. A measurement resolution of 30 µstrain is achieved and strain mapping of a region may be performed within minutes. As strobing is not used here, the technique is not frequency limited. Comparisons with alternative optical characterization techniques are made

  11. Needle-type environmental microsensors: design, construction and uses of microelectrodes and multi-analyte MEMS sensor arrays

    International Nuclear Information System (INIS)

    Lee, Woo Hyoung; Bishop, Paul L; Lee, Jin-Hwan; Choi, Woo-Hyuck; Papautsky, Ian; Hosni, Ahmed A

    2011-01-01

    The development of environmental microsensor techniques is a revolutionary advance in the measurement of both absolute levels and changes in chemical species in the field of environmental engineered and natural systems. The tiny tip (5–15 µm diameter) of microsensors makes them very attractive experimental tools for direct measurements of the chemical species of interest inside biological samples (e.g., biofilm, flocs). Microelectrodes fabricated from pulled micropipettes (e.g., dissolved oxygen, oxidation–reduction potential, ion-selective microelectrode) have contributed to greater understanding of biological mechanisms for decades using microscopic monitoring, and currently microelectromechanical system (MEMS) microfabrication technologies are being successfully applied to fabricate multi-analyte sensor systems for in situ monitoring. This review focuses on needle-type environmental microsensor technology, including microelectrodes and multi-analyte MEMS sensor arrays. Design, construction and applications to biofilm research of these sensors are described. Practical methods for biofilm microprofile measurements are presented and several in situ applications for a biofilm study are highlighted. Ultimately, the developed needle-type microsensors combined with molecular biotechnology (such as microscopic observation with fluorescent probes) show the tremendous promise of micro-environmental sensor technology. (topical review)

  12. Occlusal vertical dimension. Review article

    OpenAIRE

    Alvítez Temoche, Daniel Augusto; Facultad de Odontología de la Universidad Nacional Mayor de San Marcos.

    2016-01-01

    Modication of occlusal vertical dimension is a procedure that is often necessary for complex oral reha-bilitation treatments to get a functional occlusal for patients. is literature review was made on databases: Medline (PubMed), Scopus, Scielo, BSV (Bireme), ISI (Web of science) and Lilacs using the keywords “occlusal vertical dimension”,”altered vertical dimension”, “temporomandibular joint”, and “masticatory muscles”. It can be said that the management of occlusal vertical dimension is a s...

  13. The Next Generation of Planetary Atmospheric Probes

    Science.gov (United States)

    Houben, Howard

    2005-01-01

    Entry probes provide useful insights into the structures of planetary atmospheres, but give only one-dimensional pictures of complex four-dimensional systems that vary on all temporal and spatial scales. This makes the interpretation of the results quite challenging, especially as regards atmospheric dynamics. Here is a planetary meteorologist's vision of what the next generation of atmospheric entry probe missions should be: Dedicated sounding instruments get most of the required data from orbit. Relatively simple and inexpensive entry probes are released from the orbiter, with low entry velocities, to establish ground truth, to clarify the vertical structure, and for adaptive observations to enhance the dataset in preparation for sensitive operations. The data are assimilated onboard in real time. The products, being immediately available, are of immense benefit for scientific and operational purposes (aerobraking, aerocapture, accurate payload delivery via glider, ballooning missions, weather forecasts, etc.).

  14. Vertical Electromagnetic Pulse (VEMP) Testing

    Science.gov (United States)

    2009-09-11

    several hours depending on weapon yield and HOB . Radio communications depend on propagation of transmitted waves through the atmosphere. Depending...structure: electrical induction , the basic mechanism for linear conductors; magnetic induction , TOP 1-2-622 11 September 2009 A-2 the principal...c. Inductive current probes: EATON® 91550-2. d. Environment reference probe: MGL-2 D-dot free field probe. e. Environment monitoring probe

  15. Vertical axis wind turbine

    International Nuclear Information System (INIS)

    Obretenov, V.; Tsalov, T.; Chakarov, T.

    2012-01-01

    In recent years, the interest in wind turbines with vertical axis noticeably increased. They have some important advantages: low cost, relatively simple structure, reliable packaging system of wind aggregate long period during which require no maintenance, low noise, independence of wind direction, etc.. The relatively low efficiency, however, makes them applicable mainly for small facilities. The work presents a methodology and software for approximately aerodynamic design of wind turbines of this type, and also analyzed the possibility of improving the efficiency of their workflow

  16. Electrical resistivity probes

    Science.gov (United States)

    Lee, Ki Ha; Becker, Alex; Faybishenko, Boris A.; Solbau, Ray D.

    2003-10-21

    A miniaturized electrical resistivity (ER) probe based on a known current-voltage (I-V) electrode structure, the Wenner array, is designed for local (point) measurement. A pair of voltage measuring electrodes are positioned between a pair of current carrying electrodes. The electrodes are typically about 1 cm long, separated by 1 cm, so the probe is only about 1 inch long. The electrodes are mounted to a rigid tube with electrical wires in the tube and a sand bag may be placed around the electrodes to protect the electrodes. The probes can be positioned in a borehole or on the surface. The electrodes make contact with the surrounding medium. In a dual mode system, individual probes of a plurality of spaced probes can be used to measure local resistance, i.e. point measurements, but the system can select different probes to make interval measurements between probes and between boreholes.

  17. Wide-angle structured light with a scanning MEMS mirror in liquid.

    Science.gov (United States)

    Zhang, Xiaoyang; Koppal, Sanjeev J; Zhang, Rui; Zhou, Liang; Butler, Elizabeth; Xie, Huikai

    2016-02-22

    Microelectromechanical (MEMS) mirrors have extended vision capabilities onto small, low-power platforms. However, the field-of-view (FOV) of these MEMS mirrors is usually less than 90° and any increase in the MEMS mirror scanning angle has design and fabrication trade-offs in terms of power, size, speed and stability. Therefore, we need techniques to increase the scanning range while still maintaining a small form factor. In this paper we exploit our recent breakthrough that has enabled the immersion of MEMS mirrors in liquid. While allowing the MEMS to move, the liquid additionally provides a "Snell's window" effect and enables an enlarged FOV (≈ 150°). We present an optimized MEMS mirror design and use it to demonstrate applications in extreme wide-angle structured light.

  18. Fabrication and performance analysis of MEMS-based Variable Emissivity Radiator for Space Applications

    International Nuclear Information System (INIS)

    Lee, Changwook; Oh, Hyung-Ung; Kim, Taegyu

    2014-01-01

    All Louver was typically representative as the thermal control device. The louver was not suitable to be applied to small satellite, because it has the disadvantage of increase in weight and volume. So MEMS-based variable radiator was developed to support the disadvantage of the louver MEMS-based variable emissivity radiator was designed for satellite thermal control. Because of its immediate response and low power consumption. Also MEMS- based variable emissivity radiator has been made smaller by using MEMS process, it could be solved the problem of the increase in weight and volume, and it has a high reliability and immediate response by using electrical control. In this study, operation validation of the MEMS radiator had been carried out, resulting that emissivity could be controlled. Numerical model was also designed to predict the thermal control performance of MEMS-based variable emissivity radiator

  19. Self-organized nanostructures in silicon and glass for MEMS, MOEMS and BioMEMS

    International Nuclear Information System (INIS)

    Lilienthal, K.; Fischer, M.; Stubenrauch, M.; Schober, A.

    2010-01-01

    The utilization of self-organization in the process workflows for Micro-Electro-Mechanical-Systems (MEMS) and their derivatives is a smart way to get large areas of nanostructured surfaces for various applications. The generation of nano-masking spots by self-organizing residues in the plasma can lead to needle- or tube-like structures on the surface after (deep-) reactive ion etching. With lengths of 3 up to 25 μm and 150 up to 500 nm in diameter for silicon broad applications in the fields of micro fluidics with catalysts, micro-optical or mechanical mountings or carrier wafer bonding in microelectronics are possible. Now, we also developed dry etching processes for fused silica which shows analogue properties to 'Black Silicon' and investigated these glass nanostructures by a first parameter study to identify new usable structures and hybrids. This innovative starting point allows the transfer of 'Black Silicon' technologies and its applications to another important material class in micro- and nanotechnologies, fused silica.

  20. Application of RF-MEMS-Based Split Ring Resonators (SRRs to the Implementation of Reconfigurable Stopband Filters: A Review

    Directory of Open Access Journals (Sweden)

    Ferran Martín

    2014-12-01

    Full Text Available In this review paper, several strategies for the implementation of reconfigurable split ring resonators (SRRs based on RF-MEMS switches are presented. Essentially three types of RF-MEMS combined with split rings are considered: (i bridge-type RF-MEMS on top of complementary split ring resonators CSRRs; (ii cantilever-type RF-MEMS on top of SRRs; and (iii cantilever-type RF-MEMS integrated with SRRs (or RF-MEMS SRRs. Advantages and limitations of these different configurations from the point of view of their potential applications for reconfigurable stopband filter design are discussed, and several prototype devices are presented.

  1. Application of RF-MEMS-based split ring resonators (SRRs) to the implementation of reconfigurable stopband filters: a review.

    Science.gov (United States)

    Martín, Ferran; Bonache, Jordi

    2014-12-02

    In this review paper, several strategies for the implementation of reconfigurable split ring resonators (SRRs) based on RF-MEMS switches are presented. Essentially three types of RF-MEMS combined with split rings are considered: (i) bridge-type RF-MEMS on top of complementary split ring resonators CSRRs; (ii) cantilever-type RF-MEMS on top of SRRs; and (iii) cantilever-type RF-MEMS integrated with SRRs (or RF-MEMS SRRs). Advantages and limitations of these different configurations from the point of view of their potential applications for reconfigurable stopband filter design are discussed, and several prototype devices are presented.

  2. Vertical vector face lift.

    Science.gov (United States)

    Somoano, Brian; Chan, Joanna; Morganroth, Greg

    2011-01-01

    Facial rejuvenation using local anesthesia has evolved in the past decade as a safer option for patients seeking fewer complications and minimal downtime. Mini- and short-scar face lifts using more conservative incision lengths and extent of undermining can be effective in the younger patient with lower face laxity and minimal loose, elastotic neck skin. By incorporating both an anterior and posterior approach and using an incision length between the mini and more traditional face lift, the Vertical Vector Face Lift can achieve longer-lasting and natural results with lesser cost and risk. Submentoplasty and liposuction of the neck and jawline, fundamental components of the vertical vector face lift, act synergistically with superficial musculoaponeurotic system plication to reestablish a more youthful, sculpted cervicomental angle, even in patients with prominent jowls. Dramatic results can be achieved in the right patient by combining with other procedures such as injectable fillers, chin implants, laser resurfacing, or upper and lower blepharoplasties. © 2011 Wiley Periodicals, Inc.

  3. Internet, memória e aprendizagem: tecnologias digitais e implicações na memória

    Directory of Open Access Journals (Sweden)

    Melanie Retz Godoy dos Santos Zwicker

    2018-03-01

    Full Text Available O desenvolvimento humano está em grande parte ligado às tecnologias e ao conhecimento acumulado de cada época. O ser humano faz instrumentos, fabrica utensílios, convive com uma determinada técnica que torna a sua circunstância peculiar. Tecnologia e sociedade estão intrinsecamente ligadas e a internet, também chamada web 2.0, é a expressão mais evidente do nosso momento sócio-cultural-tecnológico. Essa tecnologia comunicacional, que foi revolucionária, está hoje fortemente arraigada ao cotidiano, invadindo praticamente todos os setores da vida. O objetivo do trabalho é demonstrar, por meio de um estudo de caso com entrevistas em profundidade com usuários da rede, que as transformações fomentadas por ela – novas relações espacio-temporais, formas de sociabilidade, o acesso a grandes quantidades de informações e interatividade – modificaram de forma radical hábitos e comportamentos, formas de comunicar, interagir e aprende, além de criarem uma relação de extrema dependência com esse meio. Em decorrência, vale ressaltar que a internet está cada vez mais presente na memória de seus usuários, nas suas recordações e vivências individuais e também tem grande influência na formação da memória social. Ao alterar a vida cotidiana e seus processos comunicacionais, ela altera também formas de pensar, visões de mundo e tem importante papel na criação, manutenção e desenvolvimento do simbólico, o que contribui com a formação da memória coletiva. A Internet vive em uma espécie de retroalimentação com a memória coletiva: influencia as memórias de seus usuários e, ao mesmo tempo, alimenta-se repetidamente do imaginário e da memória social.

  4. An investigation of fatigue in LIGA Ni MEMS thin films

    International Nuclear Information System (INIS)

    Allameh, S.M.; Lou, J.; Kavishe, F.; Buchheit, T.; Soboyejo, W.O.

    2004-01-01

    This paper presents results of an experimental study of fatigue in LIGA Ni micro-electro-mechanical systems (MEMS)/thin films produced by electroplating from a sulfamate bath at a current density of 50 mA/cm 2 . Following a brief description of microstructure and micro-tensile properties, the results of stress-life (S-N) experiments are presented for specimens with thicknesses of 70 and 270 μm. Specimens with the thicker cross-sections (270 μm thick) are shown to have comparable fatigue resistance to annealed bulk Ni in the as-plated condition. The thinner specimens (70 μm thick) have comparable fatigue resistance to hardened Ni, and better fatigue resistance than the thicker samples. The underlying fatigue fracture modes are elucidated via scanning electron microscopy. The implications of the results are then discussed for the failure analysis of LIGA Ni MEMS structures

  5. Micro-motion analyzer used for dynamic MEMS characterization

    Science.gov (United States)

    Guo, Tong; Chang, Hong; Chen, Jinping; Fu, Xing; Hu, Xiaotang

    2009-03-01

    A computer-controlled micro-motion analyzer (MMA) to study the dynamic behavior of movable structures of MEMS is described in this paper. It employs two optical nondestructive methods—computer microvision for in-plane motion measurement and phase-shifting interferometry for out-of-plane motion measurement. This fully integrated system includes a high-performance imaging system, drive electronics, data acquisition and data analysis software. This system can freeze the fast motions of MEMS devices using strobed illumination and measure motions in three dimensions with nanometer accuracy. The static measurement accuracy and repeatability of the system is calibrated by a step height standard which is certified by National Institute of Standards and Technology (NIST). The capabilities of this system are illustrated with a study of the dynamic behaviors of a surface micromachined polysilicon micro-resonator.

  6. A Novel Control System Design for Vibrational MEMS Gyroscopes

    Directory of Open Access Journals (Sweden)

    Qing Zheng

    2007-04-01

    Full Text Available There are two major control problems associated with vibrational MEMS gyroscopes: to control two vibrating axes (or modes of the gyroscope, and to estimate a time-varying rotation rate. This paper demonstrates how a novel active disturbance rejection control addresses these problems in the presence of the mismatch of natural frequencies between two axes, mechanical-thermal noises, Quadrature errors, and parameter variations. A demodulation approach based on the estimated dynamics of the system by an extended state observer is used to estimate the rotation rate. The simulation results on a Z-axis MEMS gyroscope show that the controller is very effective by driving the output of the drive axis to a desired trajectory, forcing the vibration of the sense axis to zero for a force-to-rebalance operation and precisely estimating the rotation rate.

  7. Sliding mode control of a simulated MEMS gyroscope.

    Science.gov (United States)

    Batur, C; Sreeramreddy, T; Khasawneh, Q

    2006-01-01

    The microelectromechanical systems (MEMS) are penetrating more and more into measurement and control problems because of their small size, low cost, and low power consumption. The vibrating gyroscope is one of those MEMS devices that will have a significant impact on the stability control systems in transportation industry. This paper studies the design and control of a vibrating gyroscope. The device has been constructed in a Pro-E environment and its model has been simulated in the finite-element domain in order to approximate its dynamic characteristics with a lumped model. A model reference adaptive feedback controller and the sliding mode controller have been considered to guarantee the stability of the device. It is shown that the sliding mode controller of the vibrating proof mass results in a better estimate of the unknown angular velocity than that of the model reference adaptive feedback controller.

  8. USB-based controller for generic MEM device deformable mirrors

    Science.gov (United States)

    Andrews, Jonathan; Teare, Scott; Wilcox, Christopher; Restaino, Sergio; Martinez, Ty; Payne, Don

    2006-01-01

    The use of Micro-Electro-Machined (MEM) devices as deformable mirrors (DM) for active and adaptive optics is increasing dramatically. Such increases are due to both the cost and simplicity of use of these devices. Our experience with MEM DMs has been positive, however the controlling protocols of these devices presents some issues. Based on our experience and needs we decided to design a generic controller based on a fast communication protocol. These requirements have pushed us to design a system around a USB 2.0 protocol. In this paper we present our architectural design for such controller. We present also experimental data and analysis on the performance of the controller. We describe the pros and cons of such approach versus other techniques. We will address how general such architecture is and how portable is to other systems.

  9. Microcutting and forming of thin aluminium foils for MEMS

    DEFF Research Database (Denmark)

    Damsgaard, Christian Danvad; Mortensen, Dennis; Rombach, Pirmin

    2011-01-01

    This paper presents a simple procedure for simultaneous cutting and forming of thin Al foils for use in MEMS components. The procedure makes use of scaled down macroscopic sheet forming and cutting techniques by using a hydraulic press, a soft counterpart, and a microfabricated stamp tool....... The relation between applied pressure and forming and cutting features has been characterized for a specific set of stamp geometries and boundary conditions. The results show that 10 μm forming features can be transferred to 4 m thick Al foils, which simultaneously can be cut into products by 25 μm wide cut...... lines. Using the procedure presented in this paper scaled to full 4-8 in. silicon wafer stamp tools, a fast and adequate method for high volume production of MEMS components is obtained. © 2011 American Society of Mechanical Engineers....

  10. New Trends on MEMS Sensor Technology for Harsh Environment Applications

    Directory of Open Access Journals (Sweden)

    Patricia M. NIEVA

    2007-10-01

    Full Text Available MEMS and NEMS sensor systems that can operate in the presence of high temperatures, corrosive media, and/or high radiation hold great promise for harsh environment applications. They would reduce weight, improve machine reliability and reduce cost in strategic market sectors such as automotive, avionics, oil well logging, and nuclear power. This paper presents a review of the recent advances in harsh-environment MEMS and NEMS sensors focusing on materials and devices. Special emphasis is put on high-temperature operation. Wide-bandgap semiconductor materials for high temperature applications are discussed from the device point of view. Micro-opto mechanical systems (MOEMS are presented as a new trend for high temperature applications. As an example of a harsh environment MOEMS sensor, a vibration sensor is presented.

  11. MEMS Device Being Developed for Active Cooling and Temperature Control

    Science.gov (United States)

    Moran, Matthew E.

    2001-01-01

    High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) is currently under development at the NASA Glenn Research Center to meet this need. It uses a thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface. The device can be used strictly in the cooling mode, or it can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly are accomplished by wet etching and wafer bonding techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces and limited failure modes, and minimal induced vibration.

  12. Optimization of PbTiO3 Seed Layers for PZT MEMS Actuators

    National Research Council Canada - National Science Library

    Sanchez, Luz; Polcawich, Ronald G

    2008-01-01

    ...). Characterization included x-ray diffraction and ferroelectric, dielectric, and piezoelectric properties of the PZT thin films and PZT actuators fabricated using the ARL piezomicroelectromechanical systems (MEMS...

  13. Improved High-Rejection Filters and MEMS-Enabled Smart Reconfigurable Antennas Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Proposed work envisions development of high-rejection filters and smart reconfigurable antennas using MEMS switches. Adaptive feature of the proposed antenna...

  14. Single-crystal-silicon-based microinstrument to study friction and wear at MEMS sidewall interfaces

    International Nuclear Information System (INIS)

    Ansari, N; Ashurst, W R

    2012-01-01

    Since the advent of microelectromechanical systems (MEMS) technology, friction and wear are considered as key factors that determine the lifetime and reliability of MEMS devices that contain contacting interfaces. However, to date, our knowledge of the mechanisms that govern friction and wear in MEMS is insufficient. Therefore, systematically investigating friction and wear at MEMS scale is critical for the commercial success of many potential MEMS devices. Specifically, since many emerging MEMS devices contain more sidewall interfaces, which are topographically and chemically different from in-plane interfaces, studying the friction and wear characteristics of MEMS sidewall surfaces is important. The microinstruments that have been used to date to investigate the friction and wear characteristics of MEMS sidewall surfaces possess several limitations induced either by their design or the structural film used to fabricate them. Therefore, in this paper, we report on a single-crystal-silicon-based microinstrument to study the frictional and wear behavior of MEMS sidewalls, which not only addresses some of the limitations of other microinstruments but is also easy to fabricate. The design, modeling and fabrication of the microinstrument are described in this paper. Additionally, the coefficients of static and dynamic friction of octadecyltrichlorosilane-coated sidewall surfaces as well as sidewall surfaces with only native oxide on them are also reported in this paper. (paper)

  15. System-Level Modelling and Simulation of MEMS-Based Sensors

    DEFF Research Database (Denmark)

    Virk, Kashif M.; Madsen, Jan; Shafique, Mohammad

    2005-01-01

    The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration...... with the existing embedded system design methodologies is possible. In this paper, we present a MEMS design methodology that uses VHDL-AMS based system-level model of a MEMS device as a starting point and combines the top-down and bottom-up design approaches for design, verification, and optimization...

  16. Analysis and Measurement of Residual Stress in Bridge Membrane MEMS Relays

    Science.gov (United States)

    Ruan, Yong; Wang, Weizhong; Zhu, Yong; You, Zheng

    2017-04-01

    Microelectromechanical system (MEMS) relays are gradually replacing traditional relays because they are smaller and lighter and consume less power. However, performance parameters of MEMS relays, such as the pull-down voltage, response time, and resonant frequency, often deviate from those originally designed, due to residual stress generated during the fabrication process. We present herein a method to measure this residual stress, based on a metal bridge membrane MEMS relay, with the help of a nanoindenter and the finite-element method (FEM). The testing result lies in a reasonable range, indicating that this simple method is reliable and helpful for MEMS relay optimization.

  17. Evaluation of MEMS-Based Wireless Accelerometer Sensors in Detecting Gear Tooth Faults in Helicopter Transmissions

    Science.gov (United States)

    Lewicki, David George; Lambert, Nicholas A.; Wagoner, Robert S.

    2015-01-01

    The diagnostics capability of micro-electro-mechanical systems (MEMS) based rotating accelerometer sensors in detecting gear tooth crack failures in helicopter main-rotor transmissions was evaluated. MEMS sensors were installed on a pre-notched OH-58C spiral-bevel pinion gear. Endurance tests were performed and the gear was run to tooth fracture failure. Results from the MEMS sensor were compared to conventional accelerometers mounted on the transmission housing. Most of the four stationary accelerometers mounted on the gear box housing and most of the CI's used gave indications of failure at the end of the test. The MEMS system performed well and lasted the entire test. All MEMS accelerometers gave an indication of failure at the end of the test. The MEMS systems performed as well, if not better, than the stationary accelerometers mounted on the gear box housing with regards to gear tooth fault detection. For both the MEMS sensors and stationary sensors, the fault detection time was not much sooner than the actual tooth fracture time. The MEMS sensor spectrum data showed large first order shaft frequency sidebands due to the measurement rotating frame of reference. The method of constructing a pseudo tach signal from periodic characteristics of the vibration data was successful in deriving a TSA signal without an actual tach and proved as an effective way to improve fault detection for the MEMS.

  18. Power Conditioning for MEMS-Based Waste Vibrational Energy Harvester

    Science.gov (United States)

    2015-06-01

    ABBREVIATIONS AC Alternative Current AlN Aluminum Nitride DC Direct Current LIA Lock-In Amplifier MEMS Microelectromechanical Systems MOSFET...with MEMSPro software packages, the device in Figure 1 was tested and its characteristics were determined by [1]. Aluminum nitride (AlN) was chosen...the aluminum layer on the device was oxidized, which made the wire bonding process more difficult. For future work, it is recommended to put the

  19. A MEMS capacitor with improved RF power handling capability

    OpenAIRE

    Girbau, D.; Otegi, N.; Pradell, L.; Lázaro, A.

    2005-01-01

    This paper presents a structure of MEMS capacitor providing independence of its nominal capacity and tuning range from the applied RF signal power. The capacitor includes a third parallel plate acting as an electrode to which an extra DC voltage is applied to compensate for the self-actuation effect. This means that the device can be used in many applications working under different RF power conditions, without changing its performance – nominal capacity and tuning range –. Capacitor design c...

  20. Robust MEMS gyroscope for oil and gas exploration

    Science.gov (United States)

    Lin, David; Miller, Todd

    2014-06-01

    To satisfy the performance and reliability requirement of a MEMS based harsh environment sensor, the sensor development needs to depart from the classic method of single-discipline technology improvement. In this paper, the authors will describe a Microsystem-based design methodology which considers simultaneous multiple technology domain interaction and achieves performance optimization at the system level to address the harsh environment sensing challenge. This is demonstrated through specific examples of investigating a robust MEMS gyroscope suitable for high temperature and high vibration environments such as down-hole drilling for Oil and Gas applications. In particular, the different mechanisms of temperature-induced errors in MEMS gyroscope are discussed. The error sources include both the direct impact of the gyroscope dynamics by temperature and the indirect perturbation by temperature-induced package stress. For vibration and shock induced failure, the error contributions from the low frequency and high frequency contents are discussed. Different transducer designs with equivalent rate sensitivity can vary with several orders of magnitude in terms of the susceptibility to mechanical vibration. Also shown are the complex interactions among the gyroscopic transducer, packaging and the control electronics, resulting from these temperature and vibration error sources. The microsystem-based design methodology is able to capture such complex interactions and improve the gyroscope temperature and vibration performance. In contrast to other efforts in harsh environment sensing which focus on specific technology domains, the authors strive to demonstrate the need and advantage of addressing MEMS performance and reliability in harsh environment from a microsystem perspective.

  1. Stylus type MEMS texture sensor covered with corrugated diaphragm

    Science.gov (United States)

    Tsukamoto, Takashiro; Asao, Hideaki; Tanaka, Shuji

    2017-09-01

    In this paper, a stylus type MEMS texture sensor covered with a corrugated palylene diaphragm, which prevent debris from jamming into the sensor without significant degradation of sensitivity and bandwidth, was reported. A new fabrication process using a lost-foil method to make the corrugated diaphragm on a 3-axis piezoresistive force sensor at wafer level has been developed. The texture sensor could detect the surface microstructure as small as about 10 \

  2. Simulated SAM A-scans on multilayer MEMS components

    DEFF Research Database (Denmark)

    Janting, Jakob; Petersen, Dirch Hjorth; Greisen, Christoffer

    2002-01-01

    A spreadsheet program for simulation of Scanning Acoustic Microscopy (SAM) A-scans on multilayer structures has been developed. Using this program, structure variations in samples can be analysed better. Further samples can be prepared to get optimal signal for enhanced failure and materials anal....... The calculation of N, the program interface, and simulated A-scans on MEMS test structures for a pressure sensor are presented. (C) 2002 Elsevier Science Ltd. All rights reserved....

  3. System-level modeling of MEMS v.10

    CERN Document Server

    Schrag, Gabriele; Hierold, Christofer; Korvink , Jan G

    2012-01-01

    System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations. Thereby, system-level modeling overcomes the limitations inherent to methods that focus only on one of these aspects and do not incorporate their mutual dependencies. The book addresses the two most important approaches of system-level modeling, namely physics

  4. Surface chemical modification for exceptional wear life of MEMS materials

    Directory of Open Access Journals (Sweden)

    R. Arvind Singh

    2011-12-01

    Full Text Available Micro-Electro-Mechanical-Systems (MEMS are built at micro/nano-scales. At these scales, the interfacial forces are extremely strong. These forces adversely affect the smooth operation and cause wear resulting in the drastic reduction in wear life (useful operating lifetime of actuator-based devices. In this paper, we present a surface chemical modification method that reduces friction and significantly extends the wear life of the two most popular MEMS structural materials namely, silicon and SU-8 polymer. The method includes surface chemical treatment using ethanolamine-sodium phosphate buffer, followed by coating of perfluoropolyether (PFPE nanolubricant on (i silicon coated with SU-8 thin films (500 nm and (ii MEMS process treated SU-8 thick films (50 μm. After the surface chemical modification, it was observed that the steady-state coefficient of friction of the materials reduced by 4 to 5 times and simultaneously their wear durability increased by more than three orders of magnitude (> 1000 times. The significant reduction in the friction coefficients is due to the lubrication effect of PFPE nanolubricant, while the exceptional increase in their wear life is attributed to the bonding between the -OH functional group of ethanolamine treated SU-8 thin/thick films and the -OH functional group of PFPE. The surface chemical modification method acts as a common route to enhance the performance of both silicon and SU-8 polymer. It is time-effective (process time ≤ 11 min, cost-effective and can be readily integrated into MEMS fabrication/assembly processes. It can also work for any kind of structural material from which the miniaturized devices are/can be made.

  5. Mechanical stop mechanism for overcoming MEMS fabrication tolerances

    International Nuclear Information System (INIS)

    Hussein, Hussein; Bourbon, Gilles; Le Moal, Patrice; Lutz, Philippe; Haddab, Yassine

    2017-01-01

    A mechanical stop mechanism is developed in order to compensate MEMS fabrication tolerances in discrete positioning. The mechanical stop mechanism is designed to be implemented on SOI wafers using a common DRIE etching process. The various fabrication tolerances obtained due to the etching process are presented and discussed in the paper. The principle and design of the mechanism are then presented. Finally, experiments on microfabricated positioning prototypes show accurate steps unaffected by the fabrication tolerances. (technical note)

  6. Measurement of the Earth tides with a MEMS gravimeter.

    Science.gov (United States)

    Middlemiss, R P; Samarelli, A; Paul, D J; Hough, J; Rowan, S; Hammond, G D

    2016-03-31

    The ability to measure tiny variations in the local gravitational acceleration allows, besides other applications, the detection of hidden hydrocarbon reserves, magma build-up before volcanic eruptions, and subterranean tunnels. Several technologies are available that achieve the sensitivities required for such applications (tens of microgal per hertz(1/2)): free-fall gravimeters, spring-based gravimeters, superconducting gravimeters, and atom interferometers. All of these devices can observe the Earth tides: the elastic deformation of the Earth's crust as a result of tidal forces. This is a universally predictable gravitational signal that requires both high sensitivity and high stability over timescales of several days to measure. All present gravimeters, however, have limitations of high cost (more than 100,000 US dollars) and high mass (more than 8 kilograms). Here we present a microelectromechanical system (MEMS) device with a sensitivity of 40 microgal per hertz(1/2) only a few cubic centimetres in size. We use it to measure the Earth tides, revealing the long-term stability of our instrument compared to any other MEMS device. MEMS accelerometers--found in most smart phones--can be mass-produced remarkably cheaply, but none are stable enough to be called a gravimeter. Our device has thus made the transition from accelerometer to gravimeter. The small size and low cost of this MEMS gravimeter suggests many applications in gravity mapping. For example, it could be mounted on a drone instead of low-flying aircraft for distributed land surveying and exploration, deployed to monitor volcanoes, or built into multi-pixel density-contrast imaging arrays.

  7. A Fully Symmetric and Completely Decoupled MEMS-SOI Gyroscope

    OpenAIRE

    Abdelhameed SHARAF; Sherif SEDKY; Mohamed SERRY; Amro ELSHURAFA; Mahmoud ASHOUR; S. E.-D. HABIB

    2011-01-01

    This paper introduces a novel MEMS gyroscope that is capable of exciting the drive mode differentially. The structure also decouples the drive and sense modes via an intermediate mass and decoupling beams. Both drive and sense modes are fully differential enabling control over the zero-rate-output for the former and maximizing output sensitivity using a bridge circuit for the latter. Further, the structure is fully symmetric about the x- and y- axes which results in minimizing the temperature...

  8. Hewlett Packard's inkjet MEMS technology: past, present, and future

    Science.gov (United States)

    Stasiak, J.; Richards, S.; Angelos, S.

    2009-05-01

    In 1985, HP introduced the ThinkJet - the first low-cost, mass-produced thermal inkjet printer. Providing a reasonable alternative to noisy dot matrix printers, ThinkJet set the stage for subsequent generations of HP thermal inkjet technology (TIJ). With each new generation, HP TIJ products provided new standards for print quality, color, and an unprecedented cost/performance ratio. Regarded as the first and most successful commercial MEMS technology, the development of HP's TIJ printheads required multidisciplinary innovation in fluid dynamics, bulk and surface micromachining, large-scale integration of electronics, packaging, and high volume MEMS manufacturing. HP's current TIJ printhead products combine Pentium-class addressing circuitry, high voltage mixed-signal driver electronics, dense electrical interconnects, and up to 3900 high-precision microfluidic devices - all on a single silicon chip. In this paper, we will provide a brief history of HP's TIJ technology and discuss how the unique capabilities that were required to advance the state-of-the-art of TIJ printheads are now providing a platform for the development of new MEMS devices and systems.

  9. Laser-heating wire bonding on MEMS packaging

    Directory of Open Access Journals (Sweden)

    Yuetao Liu

    2014-02-01

    Full Text Available Making connections is critical in fabrication of MEMS (Micro-Electro-Mechanical Systems. It is also complicated, because the temperature during joining affects both the bond produced and the structure and mechanical properties of the moving parts of the device. Specifications for MEMS packaging require that the temperature not exceed 240 °C. However, usually, temperatures can reach up to 300 °C during conventional thermosonic wire bonding. Such a temperature will change the distribution of dopants in CMOS (Complementary Metal Oxide Semiconductor circuits. In this paper we propose a new heating process. A semiconductor laser (wavelength 808 nm is suggested as the thermal source for wire bonding. The thermal field of this setup was analyzed, and specific mathematical models of the field were built. Experimental results show that the heating can be focused on the bonding pad, and that much lower heat conduction occurs, compared with that during the normal heating method. The bond strength increases with increasing laser power. The bond strengths obtained with laser heating are slightly lower than those obtained with the normal heating method, but can still meet the strength requirements for MEMS.

  10. Bias Drift Estimation for MEMS Gyroscope Used in Inertial Navigation

    Directory of Open Access Journals (Sweden)

    Cechowicz Radosław

    2017-06-01

    Full Text Available MEMS gyroscopes can provide useful information for dead-reckoning navigation systems if suitable error compensation algorithm is applied. If there is information from other sources available, usually the Kalman filter is used for this task. This work focuses on improving the performance of the sensor if no other information is available and the integration error should be kept low during periods of still (no movement operation. A filtering algorithm is proposed to follow bias change during sensor operation to reduce integration error and extend time between successive sensor calibrations. The advantage of the proposed solution is its low computational complexity which allows implementing it directly in the micro-controller of controlling the MEMS gyroscope. An intelligent sensor can be build this way, suitable for use in control systems for mobile platforms. Presented results of a simple experiment show the improvement of the angle estimation. During the 12 hours experiment with a common MEMS sensor and no thermal compensation, the maximum orientation angle error was below 8 degrees.

  11. Low Actuating Voltage Spring-Free RF MEMS SPDT Switch

    Directory of Open Access Journals (Sweden)

    Deepak Bansal

    2016-01-01

    Full Text Available RF MEMS devices are known to be superior to their solid state counterparts in terms of power consumption and electromagnetic response. Major limitations of MEMS devices are their low switching speed, high actuation voltage, larger size, and reliability. In the present paper, a see-saw single pole double throw (SPDT RF MEMS switch based on anchor-free mechanism is proposed which eliminates the above-mentioned disadvantages. The proposed switch has a switching time of 394 nsec with actuation voltage of 5 V. Size of the SPDT switch is reduced by utilizing a single series capacitive switch compared to conventional switches with capacitive and series combinations. Reliability of the switch is improved by adding floating metal and reducing stiction between the actuating bridge and transmission line. Insertion loss and isolation are better than −0.6 dB and −20 dB, respectively, for 1 GHz to 20 GHz applications.

  12. A High Isolation Series-Shunt RF MEMS Switch

    Science.gov (United States)

    Yu, Yuan-Wei; Zhu, Jian; Jia, Shi-Xing; Shi, Yi

    2009-01-01

    This paper presents a wide band compact high isolation microelectromechanical systems (MEMS) switch implemented on a coplanar waveguide (CPW) with three ohmic switch cells, which is based on the series-shunt switch design. The ohmic switch shows a low intrinsic loss of 0.1 dB and an isolation of 24.8 dB at 6 GHz. The measured average pull-in voltage is 28 V and switching time is 47 μs. In order to shorten design period of the high isolation switch, a structure-based small-signal model for the 3-port ohmic MEMS switch is developed and parameters are extracted from the measured results. Then a high isolation switch has been developed where each 3-port ohmic MEMS switch is closely located. The agreement of the measured and modeled radio frequency (RF) performance demonstrates the validity of the electrical equivalent model. Measurements of the series-shunt switch indicate an outstanding isolation of more than 40 dB and a low insertion loss of 0.35 dB from DC to 12 GHz with total chip size of 1 mm × 1.2 mm. PMID:22408535

  13. Design, modeling and simulation of MEMS-based silicon Microneedles

    Science.gov (United States)

    Amin, F.; Ahmed, S.

    2013-06-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  14. Design, modeling and simulation of MEMS-based silicon Microneedles

    International Nuclear Information System (INIS)

    Amin, F; Ahmed, S

    2013-01-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  15. Friction of different monolayer lubricants in MEMs interfaces.

    Energy Technology Data Exchange (ETDEWEB)

    Carpick, Robert W. (University of Wisconsin, Madison, WI); Street, Mark D. (University of Wisconsin, Madison, WI); Ashurst, William Robert (Auburn University, Auburn, AL); Corwin, Alex David

    2006-01-01

    This report details results from our last year of work (FY2005) on friction in MEMS as funded by the Campaign 6 program for the Microscale Friction project. We have applied different monolayers to a sensitive MEMS friction tester called the nanotractor. The nanotractor is also a useful actuator that can travel {+-}100 {micro}m in 40 nm steps, and is being considered for several MEMS applications. With this tester, we can find static and dynamic coefficients of friction. We can also quantify deviations from Amontons' and Coulomb's friction laws. Because of the huge surface-to-volume ratio at the microscale, surface properties such as adhesion and friction can dominate device performance, and therefore such deviations are important to quantify and understand. We find that static and dynamic friction depend on the monolayer lubricant applied. The friction data can be modeled with a non-zero adhesion force, which represents a deviation from Amontons' Law. Further, we show preliminary data indicating that the adhesion force depends not only on the monolayer, but also on the normal load applied. Finally, we also observe slip deflections before the transition from static to dynamic friction, and find that they depend on the monolayer.

  16. Resonant Magnetic Field Sensors Based On MEMS Technology

    Directory of Open Access Journals (Sweden)

    Elías Manjarrez

    2009-09-01

    Full Text Available Microelectromechanical systems (MEMS technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

  17. Design of a hybrid-integrated MEMS scanning grating spectrometer

    Science.gov (United States)

    Pügner, Tino; Knobbe, Jens; Grüger, Heinrich; Schenk, Harald

    2011-10-01

    Optical MEMS (micro electro mechanical systems) have been used to reduce size, weight and costs of any kind of optical systems very successfully starting in the last decades. Scientists at Fraunhofer IPMS invented a resonant drive for 1-d and 2-d MEMS scanning mirror devices. Besides mirrors also scanning gratings have been realized. Now, rapidly growing new applications demand for enhanced functions and further miniaturization. This task cannot be solved by simply putting more functionality into the MEMS chip, for example grating and slit structures, but by three dimensional hybrid integration of the complete optical system into a stack of several functional substrates. Here we present the optical system design and realization strategy for a scanning grating spectrometer for the near infrared (NIR) range. First samples will be mounted from single components by a bonder tool (Finetech Fineplacer Femto) but the option of wafer assembly will be kept open for future developments. Extremely miniaturized NIR spectrometer could serve a wide variety of applications for handheld devices from food quality analysis to medical services or materials identification.

  18. Investigation of a delayed feedback controller of MEMS resonators

    KAUST Repository

    Masri, Karim M.

    2013-08-04

    Controlling mechanical systems is an important branch of mechanical engineering. Several techniques have been used to control Microelectromechanical systems (MEMS) resonators. In this paper, we study the effect of a delayed feedback controller on stabilizing MEMS resonators. A delayed feedback velocity controller is implemented through modifying the parallel plate electrostatic force used to excite the resonator into motion. A nonlinear single degree of freedom model is used to simulate the resonator response. Long time integration is used first. Then, a finite deference technique to capture periodic motion combined with the Floquet theory is used to capture the stable and unstable periodic responses. We show that applying a suitable positive gain can stabilize the MEMS resonator near or inside the instability dynamic pull in band. We also study the stability of the resonator by tracking its basins of attraction while sweeping the controller gain and the frequency of excitations. For positive delayed gains, we notice significant enhancement in the safe area of the basins of attraction. Copyright © 2013 by ASME.

  19. Development of micro-electromechanical system (MEMS) cochlear biomodel

    Energy Technology Data Exchange (ETDEWEB)

    Ngelayang, Thailis Bounya Anak; Latif, Rhonira [Faculty of Electronic and Computer Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia)

    2015-05-15

    Human cochlear is undeniably one of the most amazing organs in human body. The functional mechanism is very unique in terms of its ability to convert the sound waves in the form of mechanical vibrations into the electrical nerve impulses. It is known that the normal human auditory system can perceive the audible frequency range between 20 Hz to 20 kHz. Scientists have conducted several researches trying to build the artificial basilar membrane in the human cochlea (cochlear biomodel). Micro-electromechanical system (MEMS) is one of the potential inventions that have the ability to mimic the active behavior of the basilar membrane. In this paper, an array of MEMS bridge beams that are mechanically sensitive to the perceived audible frequency has been proposed. An array of bridge bridge beams with 0.5 µm thickness and length varying from 200 µm to 2000 µm have been designed operate within the audible frequency range. In the bridge beams design, aluminium (Al), copper (Cu), tantalum (Ta) and platinum (Pt) have considered as the material for the bridge beam structure. From the finite element (FE) and lumped element (LE) models of the MEMS bridge beams, platinum has been found to be the best material for the cochlear biomodel design, closely mimicking the basilar membrane.

  20. Resonant Magnetic Field Sensors Based On MEMS Technology

    Science.gov (United States)

    Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías

    2009-01-01

    Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480

  1. Resonant Magnetic Field Sensors Based On MEMS Technology.

    Science.gov (United States)

    Herrera-May, Agustín L; Aguilera-Cortés, Luz A; García-Ramírez, Pedro J; Manjarrez, Elías

    2009-01-01

    Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

  2. A review: aluminum nitride MEMS contour-mode resonator

    Science.gov (United States)

    Yunhong, Hou; Meng, Zhang; Guowei, Han; Chaowei, Si; Yongmei, Zhao; Jin, Ning

    2016-10-01

    Over the past several decades, the technology of micro-electromechanical system (MEMS) has advanced. A clear need of miniaturization and integration of electronics components has had new solutions for the next generation of wireless communications. The aluminum nitride (AlN) MEMS contour-mode resonator (CMR) has emerged and become promising and competitive due to the advantages of the small size, high quality factor and frequency, low resistance, compatibility with integrated circuit (IC) technology, and the ability of integrating multi-frequency devices on a single chip. In this article, a comprehensive review of AlN MEMS CMR technology will be presented, including its basic working principle, main structures, fabrication processes, and methods of performance optimization. Among these, the deposition and etching process of the AlN film will be specially emphasized and recent advances in various performance optimization methods of the CMR will be given through specific examples which are mainly focused on temperature compensation and reducing anchor losses. This review will conclude with an assessment of the challenges and future trends of the CMR. Project supported by National Natural Science Foundation (Nos. 61274001, 61234007, 61504130), the Nurturing and Development Special Projects of Beijing Science and Technology Innovation Base's Financial Support (No. Z131103002813070), and the National Defense Science and Technology Innovation Fund of CAS (No. CXJJ-14-M32).

  3. Testing of MEMS/MOEMS/MNT devices and systems

    Science.gov (United States)

    van Heeren, Henne; El-Fatatry, Ayman; Paschalidou, Lia; Salomon, Patric R.

    2005-01-01

    Unlike electronic devices, where for analysis only electrical parameters need to be tested, Micro and Nano Technology (MNT) devices require precise measurement of multi domain parameters for characterization. Furthermore, the sensitivities require other or improved technologies. For instance, for testing a MEMS device, a stable supply of physical energy is required and must be transferred to the product in a reproducible way. Also a sensitive measuring technology is necessary to detect the electrical signal produced as a response to the physical energy on the device. Sometimes interactions between input and output make measuring difficult. A third point is that handling of the devices is difficult due to their non-standard sizes and small dimension. Also MST including MEMS and MOEMS devices require new types of reliability testing addressing stiction, and other specific failure modes. Thus, the testing of MNT devices is much more complex than standard electronic components. Currently standardized tests are often not available, neither is there sufficient background information available about MNT testing, as most of the companies regard testing experience, and especially product testing, as company confidential information. However, the MNT industry can utilise existing testing equipment. This article addresses the available equipment for MNT testing in relation to the industry needs. Examples of the instruments discussed include optical profilers for dynamic measurement of MOEMS/MEMS devices, such as gyros and accelerometers, and wafer testers for optical products.

  4. Deep SiO2 etching with Al and AlN masks for MEMS devices

    Science.gov (United States)

    Bliznetsov, Vladimir; Mao Lin, Hua; Zhang, Yue Jia; Johnson, David

    2015-08-01

    Silicon oxide-based materials such as quartz and silica are widely used in microelectromechanical systems (MEMS). One way to enhance the capability of their deep plasma etching is to increase selectivity by the use of hard masks. Although this approach was studied previously, information on the use of hard masks for the etching of silicon-oxide based materials on 200 mm substrates is scarce. We present the results of etching process development for amorphous silicon oxide using Al and AlN masks with a view of the application of the results for the etching of silica and quartz. Three gas chemistries (C4F8/O2, CF4 and SF6) and their mixtures were compared in an industrial reactive ion etch (RIE) chamber with two plasma sources. It was established that pure SF6 is the best etchant and AlN is a better mask than Al for providing higher selectivity and a sidewall angle close to vertical. A range of etching parameters for micromasking-free etching was established and etched structures of up to a 4 : 1 aspect ratio were created in 21 μm-thick oxide using the process with an etch rate of 0.32-0.36 μm min-1 and a selectivity to AlN mask of (38-49) : 1.

  5. A memória do acontecido e a memória-acontecimento: um estudo semiótico dos gêneros autobiográficos

    Directory of Open Access Journals (Sweden)

    Mariana Luz Pessoa de BARROS

    Full Text Available RESUMO Com base nas noções de campo de presença e de acontecimento, desenvolvidas pela gramática tensiva, são propostas duas formas de memória como categoria analítica dos discursos autobiográficos: a memória do acontecido e a memória-acontecimento. Essas organizações discursivas da memória determinam modos diferentes de adesão do enunciatário aos discursos, uma vez que a primeira coloca em cena estratégias que privilegiam a legibilidade do texto e a segunda explora sua dimensão sensorial e afetiva. Tendo isso em vista, o objetivo central deste artigo é investigar, no quadro teórico da semiótica discursiva, a interação entre enunciador e enunciatário em diferentes gêneros autobiográficos, como a autobiografia literária em prosa, os poemas de caráter autobiográfico e os memoriais acadêmicos. Em cada gênero, a memória do acontecido e a memória-acontecimento se articulam de forma singular. É justamente a tensão que se estabelece entre essas duas memórias, entre essas duas formas de conhecer e produzir o mundo, que parece ser fundadora dos discursos autobiográficos.

  6. High temperature probe

    Science.gov (United States)

    Swan, Raymond A.

    1994-01-01

    A high temperature probe for sampling, for example, smokestack fumes, and is able to withstand temperatures of 3000.degree. F. The probe is constructed so as to prevent leakage via the seal by placing the seal inside the water jacket whereby the seal is not exposed to high temperature, which destroys the seal. The sample inlet of the probe is also provided with cooling fins about the area of the seal to provide additional cooling to prevent the seal from being destroyed. Also, a heated jacket is provided for maintaining the temperature of the gas being tested as it passes through the probe. The probe includes pressure sensing means for determining the flow velocity of an efficient being sampled. In addition, thermocouples are located in various places on the probe to monitor the temperature of the gas passing there through.

  7. Microneurosurgical water probe.

    Science.gov (United States)

    Pogády, P; Wurm, G

    2005-04-01

    When constructing the micro-neurosurgical water ball probe, the authors have simply combined the properties of a ball probe with an irrigational function and the supportive role of water current to form a new irrigating ball dissector. The micro-instrument has an outlet mechanism with which the surgeon can regulate the flow of physiological solution into the operational field. Its point has the properties of a ball probe, and the overall bayonet shape facilitates surgical interventions in deep tissues under microscopic control. The water probe therefore enables the surgeon to perform precise mechanical preparation supported by a regulated current of water and a targeted irrigation in the operational field. The physiological solution in the pressure infusion cuff is under minimal pressure and directly connected to the probe. Due to the fact that one device can be used for various purposes the water ball probe represents an advantageous alternative to conventional micro-neurosurgical preparation.

  8. MEMS and EFF technology based micro connector for future miniature devices

    International Nuclear Information System (INIS)

    Bhuiyan, M M I; Alamgir, T; Bhuiyan, M; Kajihara, M

    2013-01-01

    The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector's maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique

  9. A MEMS device capable of measuring near-field thermal radiation between membranes.

    Science.gov (United States)

    Feng, Chong; Tang, Zhenan; Yu, Jun; Sun, Changyu

    2013-02-04

    For sensors constructed by freestanding membranes, when the gap between a freestanding membrane and the substrate or between membranes is at micron scale, the effects of near-field radiative heat transfer on the sensors' thermal performance should be considered during sensor design. The radiative heat flux is transferred from a membrane to a plane or from a membrane to a membrane. In the current study of the near-field thermal radiation, the scanning probe technology has difficulty in making a membrane separated at micron scale parallel to a plane or another membrane. A novel MEMS (micro electromechanical system) device was developed by sacrificial layer technique in this work to realize a double parallel freestanding membrane structure. Each freestanding membrane has a platinum thin-film resistor and the distance between the two membranes is 1 m. After evaluating the electrical and thermal characteristics of the lower freestanding membrane, experimental measurements of near-field radiative heat transfer between the lower membrane and the upper membrane were carried out by setting the lower membrane as a heat emitter and the upper membrane as a heat receiver. The near-field radiative heat transfer between the two membranes was validated by finding a larger-than-blackbody radiative heat transfer based on the experimental data.

  10. A MEMS Device Capable of Measuring Near-Field Thermal Radiation between Membranes

    Directory of Open Access Journals (Sweden)

    Changyu Sun

    2013-02-01

    Full Text Available For sensors constructed by freestanding membranes, when the gap between a freestanding membrane and the substrate or between membranes is at micron scale, the effects of near-field radiative heat transfer on the sensors’ thermal performance should be considered during sensor design. The radiative heat flux is transferred from a membrane to a plane or from a membrane to a membrane. In the current study of the near-field thermal radiation, the scanning probe technology has difficulty in making a membrane separated at micron scale parallel to a plane or another membrane. A novel MEMS (micro electromechanical system device was developed by sacrificial layer technique in this work to realize a double parallel freestanding membrane structure. Each freestanding membrane has a platinum thin-film resistor and the distance between the two membranes is 1 m. After evaluating the electrical and thermal characteristics of the lower freestanding membrane, experimental measurements of near-field radiative heat transfer between the lower membrane and the upper membrane were carried out by setting the lower membrane as a heat emitter and the upper membrane as a heat receiver. The near-field radiative heat transfer between the two membranes was validated by finding a larger-than-blackbody radiative heat transfer based on the experimental data.

  11. A Novel Dog-Bone Oscillating AFM Probe with Thermal Actuation and Piezoresistive Detection

    Directory of Open Access Journals (Sweden)

    Zhuang Xiong

    2014-10-01

    Full Text Available In order to effectively increase the resonance frequency and the quality factor of atomic force microscope (AFM probes, a novel oscillating probe based on a dog-bone shaped MEMS resonator was conceived, designed, fabricated and evaluated. The novel probe with 400 μm in length, 100 μm in width and 5 μm in thickness was enabled to feature MHz resonance frequencies with integrated thermal actuation and piezoresistive detection. Standard silicon micromachining was employed. Both electrical and optical measurements were carried out in air. The resonance frequency and the quality factor of the novel probe were measured to be 5.4 MHz and 4000 respectively, which are much higher than those (about several hundreds of kHz of commonly used cantilever probes. The probe was mounted onto a commercial AFM set-up through a dedicated probe-holder and circuit board. Topographic images of patterned resist samples were obtained. It is expected that the resonance frequency and the measurement bandwidth of such probes will be further increased by a proper downscaling, thus leading to a significant increase in the scanning speed capability of AFM instruments.

  12. A novel dog-bone oscillating AFM probe with thermal actuation and piezoresistive detection.

    Science.gov (United States)

    Xiong, Zhuang; Mairiaux, Estelle; Walter, Benjamin; Faucher, Marc; Buchaillot, Lionel; Legrand, Bernard

    2014-10-31

    In order to effectively increase the resonance frequency and the quality factor of atomic force microscope (AFM) probes, a novel oscillating probe based on a dog-bone shaped MEMS resonator was conceived, designed, fabricated and evaluated. The novel probe with 400 μm in length, 100 μm in width and 5 μm in thickness was enabled to feature MHz resonance frequencies with integrated thermal actuation and piezoresistive detection. Standard silicon micromachining was employed. Both electrical and optical measurements were carried out in air. The resonance frequency and the quality factor of the novel probe were measured to be 5.4 MHz and 4000 respectively, which are much higher than those (about several hundreds of kHz) of commonly used cantilever probes. The probe was mounted onto a commercial AFM set-up through a dedicated probe-holder and circuit board. Topographic images of patterned resist samples were obtained. It is expected that the resonance frequency and the measurement bandwidth of such probes will be further increased by a proper downscaling, thus leading to a significant increase in the scanning speed capability of AFM instruments.

  13. A Novel Dog-Bone Oscillating AFM Probe with Thermal Actuation and Piezoresistive Detection †

    Science.gov (United States)

    Xiong, Zhuang; Mairiaux, Estelle; Walter, Benjamin; Faucher, Marc; Buchaillot, Lionel; Legrand, Bernard

    2014-01-01

    In order to effectively increase the resonance frequency and the quality factor of atomic force microscope (AFM) probes, a novel oscillating probe based on a dog-bone shaped MEMS resonator was conceived, designed, fabricated and evaluated. The novel probe with 400 μm in length, 100 μm in width and 5 μm in thickness was enabled to feature MHz resonance frequencies with integrated thermal actuation and piezoresistive detection. Standard silicon micromachining was employed. Both electrical and optical measurements were carried out in air. The resonance frequency and the quality factor of the novel probe were measured to be 5.4 MHz and 4000 respectively, which are much higher than those (about several hundreds of kHz) of commonly used cantilever probes. The probe was mounted onto a commercial AFM set-up through a dedicated probe-holder and circuit board. Topographic images of patterned resist samples were obtained. It is expected that the resonance frequency and the measurement bandwidth of such probes will be further increased by a proper downscaling, thus leading to a significant increase in the scanning speed capability of AFM instruments. PMID:25365463

  14. Radiation Test Results for a MEMS Microshutter Operating at 60 K

    Science.gov (United States)

    Rapchun, David A.; Buchner, Stephen; Moseley, Harvey; Meyer, Stephen E.; Ray, Knute; Tuttle, Jim; Quinn, Ed; Buchanan, Ernie; Bloom, Dave; Hait, Tom; hide

    2007-01-01

    MEMS. Knowledge of the above principle has raised the concern at NASA that the MSA might also exhibit degraded performance because, i) each shutter flap is a multilayer structure consisting of metallic and insulating layers and ii) the movement of the shutter flaps is partially controlled by the application of an electric field between the shutter flap and the substrate (vertical support grid). The whole mission would be compromised if radiation exposure were to prevent the shutters from opening and closing properly. energetic ionizing particles. Because it is located A unique feature of the MSA is that, as outside the spacecraft and has very little shielding, previously mentioned, it will have to operate at temperatures near 30 K. To date, there are no published reports on how very low temperatures (- 30K) affect the response of MEMS devices to total ionizing dose. Experiments on SiO2 structures at low temperatures (80 K) indicate that the electrons generated by the ionizing radiation are mobile and will move rapidly under the application of an external electric field. Holes, on the other hand, that would normally move in the opposite direction through the SiO2 via a "thermal hopping" process, are effectively immobile at low electric fields as they are trapped close to their generation sites. However, for sufficiently large electric fields (greater than 3 MV/cm) holes are able to move through the SiO2. The larger the field, the more rapidly the holes move. The separation of the electrons and holes leads to a reduced electric field within the insulating layer. To overcome this reduction in electric field, a greater external voltage will have to be applied that alters the normal operation of the device. This report presents the results of radiation testing of the MSA at 60 K. The temperature was higher than the targeted temperature because of a faulty electrical interconnect on the test board. Specifically, our goal was to determine whether the MSA would function propey

  15. Development of a wireless MEMS multifunction sensor system and field demonstration of embedded sensors for monitoring concrete pavements, volume II

    Science.gov (United States)

    2016-08-01

    This two-pronged study evaluated the performance of commercial off-the-shelf (COTS) micro-electromechanical sensors and systems (MEMS) embedded in concrete pavement (Final Report Volume I) and developed a wireless MEMS multifunctional sensor system f...

  16. 76 FR 13433 - In the Matter of Certain Mems Devices and Products Containing Same; Notice of Commission Decision...

    Science.gov (United States)

    2011-03-11

    ... From the Federal Register Online via the Government Publishing Office INTERNATIONAL TRADE COMMISSION In the Matter of Certain Mems Devices and Products Containing Same; Notice of Commission Decision... United States after importation of certain microelectromechanical systems (``MEMS'') devices and products...

  17. Aprendizado e memória Learning and memory

    Directory of Open Access Journals (Sweden)

    Paul Lombroso

    2004-09-01

    Full Text Available A memória é dividida de duas grandes formas: explícita e implícita. O hipocampo é necessário para a formação das memórias explícitas, ao passo que várias outras regiões do cérebro, incluindo o estriado, a amígdala e o nucleus accumbens, estão envolvidos na formação das memórias implícitas. A formação de todas as memórias requer alterações morfológicas nas sinapses: novas sinapses devem ser formadas ou antigas precisam ser fortalecidas. Considera-se que essas alterações reflitam a base celular subjacente das memórias persistentes. Consideráveis avanços têm ocorrido na última década em relação a nossa compreensão sobre as bases moleculares da formação dessas memórias. Um regulador-chave da plasticidade sináptica é uma via de sinalização que inclui a proteína-quinase ativada por mitógenos (MAP. Como essa via é necessária para a memória e o aprendizado normais, não é surpreendente que as mutações nos membros dessa via levem a prejuízos no aprendizado. A neurofibromatose, a síndrome de Coffin-Lowry e a de Rubinstein-Taybi são três exemplos de transtornos de desenvolvimento que apresentam mutações em componentes-chave na via de sinalização da proteína-quinase MAP.Memory is broadly divided into declarative and nondeclarative forms of memory. The hippocampus is required for the formation of declarative memories, while a number of other brain regions including the striatum, amygdala and nucleus accumbens are involved in the formation of nondeclarative memories. The formation of all memories require morphological changes of synapses: new ones must be formed or old ones strengthened. These changes are thought to reflect the underlying cellular basis for persistent memories. Considerable advances have occurred over the last decade in our understanding of the molecular bases of how these memories are formed. A key regulator of synaptic plasticity is a signaling pathway that includes the mitogen

  18. Vertical allometry: fact or fiction?

    Science.gov (United States)

    Mahmood, Iftekhar; Boxenbaum, Harold

    2014-04-01

    In pharmacokinetics, vertical allometry is referred to the clearance of a drug when the predicted human clearance is substantially higher than the observed human clearance. Vertical allometry was initially reported for diazepam based on a 33-fold higher human predicted clearance than the observed human clearance. In recent years, it has been found that many other drugs besides diazepam, can be classified as drugs which exhibit vertical allometry. Over the years, many questions regarding vertical allometry have been raised. For example, (1) How to define and identify the vertical allometry? (2) How much difference should be between predicted and observed human clearance values before a drug could be declared 'a drug which follows vertical allometry'? (3) If somehow one can identify vertical allometry from animal data, how this information can be used for reasonably accurate prediction of clearance in humans? This report attempts to answer the aforementioned questions. The concept of vertical allometry at this time remains complex and obscure but with more extensive works one can have better understanding of 'vertical allometry'. Published by Elsevier Inc.

  19. 76 FR 28809 - In the Matter of Certain Mems Devices and Products Containing Same; Notice of Commission Decision...

    Science.gov (United States)

    2011-05-18

    ... COMMISSION In the Matter of Certain Mems Devices and Products Containing Same; Notice of Commission Decision... certain microelectromechanical systems (``MEMS'') devices and products containing the same by reason of... relief is a limited exclusion order prohibiting the unlicensed entry of MEMS devices and products...

  20. 75 FR 449 - In the Matter of Certain MEMS Devices and Products Containing Same; Notice of Investigation

    Science.gov (United States)

    2010-01-05

    ... Doc No: E9-31360] INTERNATIONAL TRADE COMMISSION [Inv. No. 337-TA-700] In the Matter of Certain MEMS... importation of certain MEMS devices and products containing same by reason of infringement of certain claims... States, the sale for importation, or the sale within the United States after importation of certain MEMS...

  1. Novel processes for modular integration of silicon-germanium MEMS with CMOS electronics

    Science.gov (United States)

    Low, Carrie Wing-Zin

    Equipment control, process development and materials characterization for LPCVD poly-SiGe for MEMS applications are investigated in this work. In order to develop a repeatable process in an academic laboratory, equipment monitoring methods are implemented and new process gases are explored. With the dopant gas BCl3, the design-of-experiments technique is used to study the dependencies of deposition rate, resistivity, average residual stress, strain gradient and wet etch rate in hydrogen-peroxide. Structural layer requirements for general MEMS applications are met within the process temperature constraint imposed by CMOS electronics. However, the strain gradient required for inertial sensor applications is difficult to achieve with as-deposited films. Approaches to reduce the strain gradient of LPCVD poly-SiGe are investigated. Correlation between the strain gradient and film microstructure is found using stress-depth profiling and cross-sectional TEM analysis. The effects of film deposition conditions on film microstructure are also determined. Boron-doped poly-SiGe films generally have vertically oriented grains---either conical or columnar in shape. Films with conical grain structure have large strain gradient due to highly compressive stress in the lower (initially deposited) region of the film. Films with small strain gradient usually have columnar grain structure with low defect density. It is also found that the uniformity of films deposited in a batch LPCVD reactor can be improved by increasing the deposited film thickness, using a proper seeding layer, and/or depositing the film in multiple layers. The best strain gradient achieved in our academic research laboratory is 1.1x10-6 mum-1 for a ˜3.5 mum thick film deposited at 410°C in 8 hours, with a worst-case variation across a 150 mm-diameter wafer of 1.6x10 -5 mum-1 and a worse-case variation across a load of twenty-five wafers of 7x10-5 mum-1. The effects of post-deposition annealing and argon

  2. Probe tests microweld strength

    Science.gov (United States)

    1965-01-01

    Probe is developed to test strength of soldered, brazed or microwelded joints. It consists of a spring which may be adjusted to the desired test pressure by means of a threaded probe head, and an indicator lamp. Device may be used for electronic equipment testing.

  3. Optimizing MEMS-Based Storage Devices for Mobile Battery-Powered Systems

    NARCIS (Netherlands)

    Khatib, M.G.; Hartel, Pieter H.

    An emerging storage technology, called MEMS-based storage, promises nonvolatile storage devices with ultrahigh density, high rigidity, a small form factor, and low cost. For these reasons, MEMS-based storage devices are suitable for battery-powered mobile systems such as PDAs. For deployment in such

  4. On the mechanics and stability of micro-plates in electrically loaded MEMS devices

    NARCIS (Netherlands)

    Sajadi, B.

    2017-01-01

    In the last decades, Micro-Electro-Mechanical Systems (MEMS) have drawn immense attention due to their potential use in a wide variety of modern applications, including micro-mechanical sensors and actuators. MEMS are devices combining mechanical and electrical components between 1 and 100

  5. Performance Evaluation of Three Architectural Variants for Multi-sled MEMS Storage

    NARCIS (Netherlands)

    Khatib, M.G.

    2011-01-01

    MEMS storage technology promises appealing features, such as ultrahigh density and low cost. To stay competitive, however, its performance must improve to fulfil the increasing I/O requirements in first-tier applications. Further, it must be energy-efficient. The maturity of MEMS techniques invites

  6. Fast Configuration of MEMS-Based Storage Devices for Streaming Applications

    NARCIS (Netherlands)

    Khatib, M.G.; van Dijk, H.W.

    2009-01-01

    An exciting class of storage devices is emerging: the class of Micro-Electro-Mechanical storage Systems (MEMS). Properties of MEMS-based storage devices include high density, small form factor, and low power. The use of this type of devices in mobile infotainment systems, such as video cameras is

  7. Some studies on the deformation of the membrane in an RF MEMS switch

    NARCIS (Netherlands)

    Ambati, Vijaya Raghav; Asheim, Andreas; van den Berg, Jan Bouwe; van Gennip, Yves; Gerasimov, Tymofiy; Hlod, Andriy; Planqué, Bob; van der Schans, Martin; van der Stelt, Sjors; Vargas Rivera, Michelangelo; Vondenhoff, Erwin; Bokhove, Onno; Hurink, Johann; Meinsma, Gjerrit; Stolk, Chris; Vellekoop, Michel

    2008-01-01

    Radio Frequency (RF) switches of Micro Electro Mechanical Systems (MEMS) are appealing to the mobile industry because of their energy efficiency and ability to accommodate more frequency bands. However, the electromechanical coupling of the electrical circuit to the mechanical components in RF MEMS

  8. Method for spatially modulating X-ray pulses using MEMS-based X-ray optics

    Science.gov (United States)

    Lopez, Daniel; Shenoy, Gopal; Wang, Jin; Walko, Donald A.; Jung, Il-Woong; Mukhopadhyay, Deepkishore

    2015-03-10

    A method and apparatus are provided for spatially modulating X-rays or X-ray pulses using microelectromechanical systems (MEMS) based X-ray optics. A torsionally-oscillating MEMS micromirror and a method of leveraging the grazing-angle reflection property are provided to modulate X-ray pulses with a high-degree of controllability.

  9. Load support Improvement on Superhydropobic Surface in Lubracated -MEMS using Numerical Investigation

    NARCIS (Netherlands)

    Muchammad, Muchammad; Tauviqirrahman, Mohammad; Jamari, Jamari; Schipper, Dirk J.

    2015-01-01

    The development of micro-electro-mechanical systems (MEMS) faces a great challenge in commercial application with respect to lubrication issue recently. Short life time of lubricated MEMS is primarily caused by the failure of the lubrication. In this study, the use of superhydrophobic material

  10. Design and characterization of in-plane MEMS yaw rate sensor

    Indian Academy of Sciences (India)

    CranesSci MEMS Laboratory, Department of Mechanical Engineering,. Indian Institute of ... In this paper, we discuss the design and characterization of a vibratory yaw rate MEMS sensor that uses ..... Patil N 2006 Design and analysis of angular rate sensors, Master's thesis, Indian Institute of Science. Polytec reference ...

  11. A Construção da Memória em José Saramago

    Directory of Open Access Journals (Sweden)

    Gisele Ambrósio Gomes

    2010-07-01

    Full Text Available O presente artigo tem por objetivo analisar a elaboração das memórias de infância e de adolescência do escritor José Saramago através da escrita autobiográfica encontrada em seu livro intitulado As Pequenas Memórias.

  12. Micro-electro-mechanical systems (MEMS: Technology for the 21st century

    Directory of Open Access Journals (Sweden)

    Đakov Tatjana A.

    2014-01-01

    Full Text Available Micro-electro-mechanical systems (MEMS are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

  13. A large-stroke planar MEMS-based stage with integrated feedback

    NARCIS (Netherlands)

    Krijnen, B.

    2014-01-01

    Micro-electromechanical systems (MEMS) are all around us nowadays, especially in sensor technology. MEMS-based positioning stages can become favorable in applications where the available volume is small, the response needs to be fast, and the fabrication costs low. This thesis describes the

  14. An X band RF MEMS switch based on silicon-on-glass architecture

    Indian Academy of Sciences (India)

    heavy and power hungry. In satellite systems with tight weight and power budgets these features are undesirable. An elegant solution to this problem is offered by Micro Electrome- chanical Systems (MEMS) technology. RF switches based on MEMS processes combine the advantages of small size of solid state switches ...

  15. Dynamics and Nonlinearities of the Electro-Mechanical Coupling in Inertial MEMS

    NARCIS (Netherlands)

    Machado da Rocha, L.A.

    2005-01-01

    The study of the nonlinear dynamics of electrostatically actuated MEMS devices is essential for proper device operation and for the actual exploitation of the dynamic aspects of MEMS. Accurate static and dynamic models and nonlinear analysis provide the tools to achieve a better understanding of the

  16. Design and analysis of MEMS MWCNT/epoxy strain sensor using ...

    Indian Academy of Sciences (India)

    2017-06-20

    Jun 20, 2017 ... Home; Journals; Pramana – Journal of Physics; Volume 89; Issue 1. Design and analysis of MEMS MWCNT/epoxy strain sensor using COMSOL. GAURAV ... The design and performance of piezoresistive MEMS-based MWCNT/epoxy composite strain sensor using COMSOL Multiphysics Toolbox has been ...

  17. Characterization of low temperature deposited atomic layer deposition TiO2 for MEMS applications

    NARCIS (Netherlands)

    Huang, Y.; Pandraud, G.; Sarro, P.M.

    2012-01-01

    TiO2 is an interesting and promising material for micro-/nanoelectromechanical systems (MEMS/NEMS). For high performance and reliable MEMS/NEMS, optimization of the optical characteristics, mechanical stress, and especially surface smoothness of TiO2 is required. To overcome the roughness issue of

  18. Using the Wiimote to Learn MEMS in a Physics Degree Program

    Science.gov (United States)

    Sánchez-Azqueta, Carlos; Gimeno, Cecilia; Celma, Santiago; Aldea, Concepción

    2016-01-01

    This paper describes a learning experience designed to introduce students in a Micro- and Nanosystems course in a Physics Bachelor's degree program to the use of professional tools for the design and characterization of micro-electromechanical systems (MEMS) through a specific commercial case: the MEMS used by the well-known gaming platform…

  19. Protected Vertices in Motzkin trees

    OpenAIRE

    Van Duzer, Anthony

    2017-01-01

    In this paper we find recurrence relations for the asymptotic probability a vertex is $k$ protected in all Motzkin trees. We use a similar technique to calculate the probabilities for balanced vertices of rank $k$. From this we calculate upper and lower bounds for the probability a vertex is balanced and upper and lower bounds for the expected rank of balanced vertices.

  20. The School Library Vertical File.

    Science.gov (United States)

    Smallwood, Carol

    1990-01-01

    Discusses the maintenance of vertical files in the school library. Topics covered include circulation, weeding, using materials for special displays, acquiring materials, policies on advertising and controversial issues, cross-references, subject headings, introducing students to vertical files, beginning a collection, and preservation. (MES)

  1. Design and optimization of a miniaturized imaging probe for simultaneous endomicroscopy and optical coherence tomography

    Science.gov (United States)

    Kretschmer, Simon; Vilches, Sergio; Blattmann, Marc; Ataman, Caglar; Zappe, Hans

    2017-02-01

    A highly-integrated MEMS-based bimodal probe design with integrated piezoelectric fiber scanner for simul- taneous endomicroscopy and optical coherence tomography (OCT) is presented. The two modalities rely on spectrally-separated optical paths that run partially in parallel through a micro-optical bench system, which has dimensions of only 13 x 2 x 3mm3 (l x w x h). An integrated tubular piezoelectric fiber scanner is used to perform en face scanning required for three dimensional OCT measurements. This scanning engine has an outer diameter of 0.9mm and a length of 9mm, and features custom fabricated 10 μm thick polyimide flexible interconnect lines to address the four piezoelectric electrodes. As a platform combining a full-field and a scanning imaging modality, the developed probe design constitutes a blue print for a wide range of multi-modal endoscopic imaging probes.

  2. On Orbit Immuno-Based, Label-Free, White Blood Cell Counting System with MicroElectroMechanical Sensor (MEMS) Technology (OILWBCS-MEMS) Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Aurora Flight Sciences Corporation and partner, Draper Laboratory, propose to develop an on-orbit immuno-based label-free white blood cell counting system using MEMS...

  3. On Orbit Immuno-Based, Label-Free, White Blood Cell Counting System with MicroElectroMechanical Sensor (MEMS) Technology (OILWBCS-MEMS), Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Aurora Flight Sciences Corporation and partner, Draper Laboratory, propose to develop an on-orbit immuno-based label-free white blood cell counting system using MEMS...

  4. NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS

    CERN Document Server

    1998-01-01

    Micro Electro Mechanical Systems (MEMS) is already about a billion dollars a year industry and is growing rapidly. So far major emphasis has been placed on the fabrication processes for various devices. There are serious issues related to tribology, mechanics, surfacechemistry and materials science in the operationand manufacturingof many MEMS devices and these issues are preventing an even faster commercialization. Very little is understood about tribology and mechanical properties on micro- to nanoscales of the materials used in the construction of MEMS devices. The MEMS community needs to be exposed to the state-of-the-artoftribology and vice versa. Fundamental understanding of friction/stiction, wear and the role of surface contamination and environmental debris in micro devices is required. There are significantadhesion, friction and wear issues in manufacturing and actual use, facing the MEMS industry. Very little is understood about the tribology of bulk silicon and polysilicon films used in the constr...

  5. Os mecanismos da memória na construção do pensamento musical

    OpenAIRE

    Flávia Garcia Rizzon

    2009-01-01

    O presente trabalho pesquisa sobre a construção da memória musical com embasamento na Epistemologia Genética de Jean Piaget. A fundamentação teórica está estruturada sobre a explicação dos diversos fatores intervenientes na construção da memória. A partir deles, destacam-se as relações existentes entre a memória, a representação e as imagens mentais, especificamente as imagens aurais. Aborda-se o funcionamento da memória mostrando seus aspectos fisiológicos, os tipos de memória e o conceito d...

  6. Trade Liberalisation and Vertical Integration

    DEFF Research Database (Denmark)

    Bache, Peter Arendorf; Laugesen, Anders

    We build a three-country model of international trade in final goods and intermediate inputs and study the relation between different types of trade liberalisation and vertical integration. Firms are heterogeneous with respect to both productivity and factor intensity as observed in data. Final......-good producers face decisions on exporting, vertical integration of intermediate-input production, and whether the intermediate-input production should be offshored to a low-wage country. We find that the fractions of final-good producers that pursue either vertical integration, offshoring, or exporting are all...... increasing when intermediate-input or final-goods trade is liberalised and when the fixed cost of vertical integration is reduced. At the same time, one observes firms that shift away from either vertical integration, offshoring, or exporting. Further, we provide guidance for testing the open...

  7. MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics

    Science.gov (United States)

    Marek, Jiri; Gómez, Udo-Martin

    MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving

  8. Low concentrations of MEM vitamins during in vitro maturation of porcine oocytes improves subsequent parthenogenetic development.

    Science.gov (United States)

    Naruse, Kenji; Kim, Hong Rye; Shin, Young Min; Chang, Suk Min; Lee, Hye Ran; Park, Chang Sik; Jin, Dong Il

    2007-01-15

    To investigate the effects of water-soluble vitamin supplementation for IVM/IVC of porcine oocytes and evaluate maturation and developmental capacity in vitro, porcine cumulus oocyte complexes (COCs) was matured in NCSU-23-based medium with water-soluble vitamins for 44 h and then cultured in PZM-3 for 7 days following activation. The COCs were allocated into five treatment groups and matured in various concentrations of MEM vitamins (control, 0.05, 0.1, 0.2, 0.4, and 1x). Metaphase II plates of the cumulus-free oocytes were observed following Hoechest 33258 staining. The COCs were allocated into four treatment groups, matured in various concentrations of MEM vitamins (control, 0.05, 0.1, 0.2, and 0.4x) and cultured in PZM-3 following activation. Also, COCS were matured without MEM vitamins and cultured in PZM-3 with various concentrations (control, 0.1, 0.4, 1.0, and 2.0 x) of MEM vitamins. Furthermore, 2 x 2 factorial (IVM/IVC) experiments were performed in IVM medium with or without 0.05 x MEM vitamins and IVC medium with or without 0.4x MEM vitamins to examine the in vitro development of parthenogenetic embryos. Maturation rates of COCs treated with MEM vitamins did not differ significantly among groups. However, compared to the control group, oocytes matured with the addition of 0.05 x MEM vitamins developed to blastocysts at a higher percentage (Pvitamins. Total cell number of blastocysts was significantly higher in the 0.05 x group. Addition of 0.4x MEM vitamins decreased (Pvitamins-treated group. In contrast, addition of vitamins to PZM-3 medium for in vitro culture of activated porcine oocytes did not affect development. In conclusion, addition of a low concentration of MEM vitamins to IVM medium for porcine oocytes enhanced subsequent development and improved embryo quality.

  9. Vertical quantum dot with a vertically coupled charge detector

    International Nuclear Information System (INIS)

    Zaitsu, Koichiro; Kitamura, Yosuke; Ono, Keiji; Tarucha, Seigo

    2008-01-01

    We fabricated a vertical quantum dot equipped with a charge detector. The dot current flows vertically between the top and bottom contacts. The charge detector is formed at the bottom contact layer with a current channel constricted to the region just under the dot. This channel current is reduced by addition of an extra electron onto the dot due to the electrostatic coupling to the dot. The charge state of the vertical dot was detected, starting from zero electrons. The sensitivity of the charge detector was comparable to that previously reported for lateral dots with nearby quantum point contacts

  10. Projection displays and MEMS: timely convergence for a bright future

    Science.gov (United States)

    Hornbeck, Larry J.

    1995-09-01

    Projection displays and microelectromechanical systems (MEMS) have evolved independently, occasionally crossing paths as early as the 1950s. But the commercially viable use of MEMS for projection displays has been illusive until the recent invention of Texas Instruments Digital Light Processing TM (DLP) technology. DLP technology is based on the Digital Micromirror DeviceTM (DMD) microchip, a MEMS technology that is a semiconductor digital light switch that precisely controls a light source for projection display and hardcopy applications. DLP technology provides a unique business opportunity because of the timely convergence of market needs and technology advances. The world is rapidly moving to an all- digital communications and entertainment infrastructure. In the near future, most of the technologies necessary for this infrastrucutre will be available at the right performance and price levels. This will make commercially viable an all-digital chain (capture, compression, transmission, reception decompression, hearing, and viewing). Unfortunately, the digital images received today must be translated into analog signals for viewing on today's televisions. Digital video is the final link in the all-digital infrastructure and DLP technoogy provides that link. DLP technology is an enabler for digital, high-resolution, color projection displays that have high contrast, are bright, seamless, and have the accuracy of color and grayscale that can be achieved only by digital control. This paper contains an introduction to DMD and DLP technology, including the historical context from which to view their developemnt. The architecture, projection operation, and fabrication are presented. Finally, the paper includes an update about current DMD business opportunities in projection displays and hardcopy.

  11. Development of scanning holographic display using MEMS SLM

    Science.gov (United States)

    Takaki, Yasuhiro

    2016-10-01

    Holography is an ideal three-dimensional (3D) display technique, because it produces 3D images that naturally satisfy human 3D perception including physiological and psychological factors. However, its electronic implementation is quite challenging because ultra-high resolution is required for display devices to provide sufficient screen size and viewing zone. We have developed holographic display techniques to enlarge the screen size and the viewing zone by use of microelectromechanical systems spatial light modulators (MEMS-SLMs). Because MEMS-SLMs can generate hologram patterns at a high frame rate, the time-multiplexing technique is utilized to virtually increase the resolution. Three kinds of scanning systems have been combined with MEMS-SLMs; the screen scanning system, the viewing-zone scanning system, and the 360-degree scanning system. The screen scanning system reduces the hologram size to enlarge the viewing zone and the reduced hologram patterns are scanned on the screen to increase the screen size: the color display system with a screen size of 6.2 in. and a viewing zone angle of 11° was demonstrated. The viewing-zone scanning system increases the screen size and the reduced viewing zone is scanned to enlarge the viewing zone: a screen size of 2.0 in. and a viewing zone angle of 40° were achieved. The two-channel system increased the screen size to 7.4 in. The 360-degree scanning increases the screen size and the reduced viewing zone is scanned circularly: the display system having a flat screen with a diameter of 100 mm was demonstrated, which generates 3D images viewed from any direction around the flat screen.

  12. Fabrication of 3D Carbon Microelectromechanical Systems (C-MEMS).

    Science.gov (United States)

    Pramanick, Bidhan; Martinez-Chapa, Sergio O; Madou, Marc; Hwang, Hyundoo

    2017-06-17

    A wide range of carbon sources are available in nature, with a variety of micro-/nanostructure configurations. Here, a novel technique to fabricate long and hollow glassy carbon microfibers derived from human hairs is introduced. The long and hollow carbon structures were made by the pyrolysis of human hair at 900 °C in a N2 atmosphere. The morphology and chemical composition of natural and pyrolyzed human hairs were investigated using scanning electron microscopy (SEM) and electron-dispersive X-ray spectroscopy (EDX), respectively, to estimate the physical and chemical changes due to pyrolysis. Raman spectroscopy was used to confirm the glassy nature of the carbon microstructures. Pyrolyzed hair carbon was introduced to modify screen-printed carbon electrodes ; the modified electrodes were then applied to the electrochemical sensing of dopamine and ascorbic acid. Sensing performance of the modified sensors was improved as compared to the unmodified sensors. To obtain the desired carbon structure design, carbon micro-/nanoelectromechanical system (C-MEMS/C-NEMS) technology was developed. The most common C-MEMS/C-NEMS fabrication process consists of two steps: (i) the patterning of a carbon-rich base material, such as a photosensitive polymer, using photolithography; and (ii) carbonization through the pyrolysis of the patterned polymer in an oxygen-free environment. The C-MEMS/NEMS process has been widely used to develop microelectronic devices for various applications, including in micro-batteries, supercapacitors, glucose sensors, gas sensors, fuel cells, and triboelectric nanogenerators. Here, recent developments of a high-aspect ratio solid and hollow carbon microstructures with SU8 photoresists are discussed. The structural shrinkage during pyrolysis was investigated using confocal microscopy and SEM. Raman spectroscopy was used to confirm the crystallinity of the structure, and the atomic percentage of the elements present in the material before and after

  13. Validation of thermal models for a prototypical MEMS thermal actuator.

    Energy Technology Data Exchange (ETDEWEB)

    Gallis, Michail A.; Torczynski, John Robert; Piekos, Edward Stanley; Serrano, Justin Raymond; Gorby, Allen D.; Phinney, Leslie Mary

    2008-09-01

    This report documents technical work performed to complete the ASC Level 2 Milestone 2841: validation of thermal models for a prototypical MEMS thermal actuator. This effort requires completion of the following task: the comparison between calculated and measured temperature profiles of a heated stationary microbeam in air. Such heated microbeams are prototypical structures in virtually all electrically driven microscale thermal actuators. This task is divided into four major subtasks. (1) Perform validation experiments on prototypical heated stationary microbeams in which material properties such as thermal conductivity and electrical resistivity are measured if not known and temperature profiles along the beams are measured as a function of electrical power and gas pressure. (2) Develop a noncontinuum gas-phase heat-transfer model for typical MEMS situations including effects such as temperature discontinuities at gas-solid interfaces across which heat is flowing, and incorporate this model into the ASC FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (3) Develop a noncontinuum solid-phase heat transfer model for typical MEMS situations including an effective thermal conductivity that depends on device geometry and grain size, and incorporate this model into the FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (4) Perform combined gas-solid heat-transfer simulations using Calore with these models for the experimentally investigated devices, and compare simulation and experimental temperature profiles to assess model accuracy. These subtasks have been completed successfully, thereby completing the milestone task. Model and experimental temperature profiles are found to be in reasonable agreement for all cases examined. Modest systematic differences appear to be related to uncertainties in the geometric dimensions of the test structures and in the thermal conductivity of the

  14. Detection of the position and cross-section of a tokamak plasma with magnetic probes

    International Nuclear Information System (INIS)

    Aikawa, Hiroshi; Ogata, Atsushi; Suzuki, Yasuo

    1977-02-01

    The position and cross-sectional shape of a Tokamak plasma are obtained analytically from magnetic probe signals, taking into consideration the toroidal effect. Multipole moment analysis of the plasma current density, introducing the vertical asymmetry, shows the horizontal and vertical displacements and the elliptical deviation. The error in the measurement is estimated by means of the least square method. The observed error is proportional to the error of setting the probes, and inversely proportional to the square root of the number of probes. (auth.)

  15. MEMS-based thick film PZT vibrational energy harvester

    DEFF Research Database (Denmark)

    Lei, Anders; Xu, Ruichao; Thyssen, Anders

    2011-01-01

    We present a MEMS-based unimorph silicon/PZT thick film vibrational energy harvester with an integrated proof mass. We have developed a process that allows fabrication of high performance silicon based energy harvesters with a yield higher than 90%. The process comprises a KOH etch using...... a mechanical front side protection of an SOI wafer with screen printed PZT thick film. The fabricated harvester device produces 14.0 μW with an optimal resistive load of 100 kΩ from 1g (g=9.81 m s-2) input acceleration at its resonant frequency of 235 Hz....

  16. Control of Bouncing in MEMS Switches Using Double Electrodes

    KAUST Repository

    Abdul Rahim, Farhan

    2016-08-09

    This paper presents a novel way of controlling the bouncing phenomenon commonly present in the Radio Frequency Microelectromechanical Systems (RF MEMS) switches using a double-electrode configuration. The paper discusses modeling bouncing using both lumped parameter and beam models. The simulations of bouncing and its control are discussed. Comparison between the new proposed method and other available control techniques is also made. The Galerkin method is applied on the beam model accounting for the nonlinear electrostatic force, squeeze film damping, and surface contact effect. The results indicate that it is possible to reduce bouncing and hence beam degradation, by the use of double electrodes.

  17. Update on MEMS-based scanned beam imager

    Science.gov (United States)

    James, Richard; Gibson, Greg; Metting, Frank; Davis, Wyatt; Drabe, Christian

    2007-01-01

    In 2004, Microvision presented "Scanned Beam Medical Imager" as an introduction to our MEMS-based, full color scanned beam imaging system. This presentation will provide an update of the technological advancements since this initial work from 2004. This recent work includes the development of functional prototypes that are much smaller than previous prototypes using a design architecture that is easily scalable. Performance has been significantly improved by increasing the optical field of views and video refresh rate. Real-time image processing capabilities have been developed to enhance the image quality and functionality over a wide range of operating conditions. Actual images of various objects will be presented.

  18. Investigation of the physics of diamond MEMS : diamond allotrope lithography

    International Nuclear Information System (INIS)

    Zalizniak, I.; Olivero, P.; Jamieson, D.N.; Prawer, S.; Reichart, P.; Rubanov, S.; Petriconi, S.

    2005-01-01

    We propose a novel lithography process in which ion induced phase transfomations of diamond form sacrificial layers allowing the fabrication of small structures including micro-electromechanical systems (MEMS). We have applied this novel lithography to the fabrication of diamond microcavities, cantilevers and optical waveguides. In this paper we present preliminary experiments directed at the fabrication of suspended diamond disks that have the potential for operation as optical resonators. Such structures would be very durable and resistant to chemical attack with potential applications as novel sensors for extreme environments or high temperature radiation detectors. (author). 3 refs., 3 figs

  19. Nonlinear Parameter Identification of a Resonant Electrostatic MEMS Actuator.

    Science.gov (United States)

    Al-Ghamdi, Majed S; Alneamy, Ayman M; Park, Sangtak; Li, Beichen; Khater, Mahmoud E; Abdel-Rahman, Eihab M; Heppler, Glenn R; Yavuz, Mustafa

    2017-05-13

    We experimentally investigate the primary superharmonic of order two and subharmonic of order one-half resonances of an electrostatic MEMS actuator under direct excitation. We identify the parameters of a one degree of freedom (1-DOF) generalized Duffing oscillator model representing it. The experiments were conducted in soft vacuum to reduce squeeze-film damping, and the actuator response was measured optically using a laser vibrometer. The predictions of the identified model were found to be in close agreement with the experimental results. We also identified the noise spectral density of process (actuation voltage) and measurement noise.

  20. Intelligent MEMS spectral sensor for NIR applications (Conference Presentation)

    Science.gov (United States)

    Kantojärvi, Uula; Antila, Jarkko E.; Mäkynen, Jussi; Suhonen, Janne

    2017-05-01

    Near Infrared (NIR) spectrometers have been widely used in many material inspection applications, but mainly in central laboratories. The role of miniaturization, robustness of spectrometer and portability are really crucial when field inspection tools should be developed. We present an advanced spectral sensor based on a tunable Microelectromechanical (MEMS) Fabry-Perot Interferometer which will meet these requirements. We describe the wireless device design, operation principle and easy-to-use algorithms to adapt the sensor to number of applications. Multiple devices can be operated simultaneously and seamlessly through cloud connectivity. We also present some practical NIR applications carried out with truly portable NIR device.