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Sample records for mems pressure sensor

  1. Micro packaged MEMS pressure sensor for intracranial pressure measurement

    International Nuclear Information System (INIS)

    Liu Xiong; Yao Yan; Ma Jiahao; Zhang Zhaohua; Zhang Yanhang; Wang Qian; Ren Tianling

    2015-01-01

    This paper presents a micro packaged MEMS pressure sensor for intracranial pressure measurement which belongs to BioMEMS. It can be used in lumbar puncture surgery to measure intracranial pressure. Miniaturization is key for lumbar puncture surgery because the sensor must be small enough to allow it be placed in the reagent chamber of the lumbar puncture needle. The size of the sensor is decided by the size of the sensor chip and package. Our sensor chip is based on silicon piezoresistive effect and the size is 400 × 400 μm 2 . It is much smaller than the reported polymer intracranial pressure sensors such as liquid crystal polymer sensors. In terms of package, the traditional dual in-line package obviously could not match the size need, the minimal size of recently reported MEMS-based intracranial pressure sensors after packaging is 10 × 10 mm 2 . In this work, we are the first to introduce a quad flat no-lead package as the package form of piezoresistive intracranial pressure sensors, the whole size of the sensor is minimized to only 3 × 3 mm 2 . Considering the liquid measurement environment, the sensor is gummed and waterproof performance is tested; the sensitivity of the sensor is 0.9 × 10 −2 mV/kPa. (paper)

  2. Cryogenic MEMS Pressure Sensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — A directly immersible cryogenic MEMS pressure sensor will be developed. Each silicon die will contain a vacuum-reference and a tent-like membrane. Offsetting thermal...

  3. MEMS capacitive pressure sensor monolithically integrated with CMOS readout circuit by using post CMOS processes

    Science.gov (United States)

    Jang, Munseon; Yun, Kwang-Seok

    2017-12-01

    In this paper, we presents a MEMS pressure sensor integrated with a readout circuit on a chip for an on-chip signal processing. The capacitive pressure sensor is formed on a CMOS chip by using a post-CMOS MEMS processes. The proposed device consists of a sensing capacitor that is square in shape, a reference capacitor and a readout circuitry based on a switched-capacitor scheme to detect capacitance change at various environmental pressures. The readout circuit was implemented by using a commercial 0.35 μm CMOS process with 2 polysilicon and 4 metal layers. Then, the pressure sensor was formed by wet etching of metal 2 layer through via hole structures. Experimental results show that the MEMS pressure sensor has a sensitivity of 11 mV/100 kPa at the pressure range of 100-400 kPa.

  4. Optical detection system for MEMS-type pressure sensor

    International Nuclear Information System (INIS)

    Sareło, K; Górecka-Drzazga, A; Dziuban, J A

    2015-01-01

    In this paper a special optical detection system designed for a MEMS-type (micro-electro-mechanical system) silicon pressure sensor is presented. The main part of the optical system—a detection unit with a perforated membrane—is bonded to the silicon sensor, and placed in a measuring system. An external light source illuminates the membrane of the pressure sensor. Owing to the light reflected from the deflected membrane sensor, the optical pattern consisting of light points is visible, and pressure can be estimated. The optical detection unit (20   ×   20   ×   20.4 mm 3 ) is fabricated using microengineering techniques. Its dimensions are adjusted to the dimensions of the pressure sensor (5   ×   5 mm 2 silicon membrane). Preliminary tests of the optical detection unit integrated with the silicon pressure sensor are carried out. For the membrane sensor from 15 to 60 µm thick, a repeatable detection of the differential pressure in the range of 0 to 280 kPa is achieved. The presented optical microsystem is especially suitable for the pressure measurements in a high radiation environment. (paper)

  5. Micro Electro-Mechanical System (MEMS) Pressure Sensor for Footwear

    Science.gov (United States)

    Kholwadwala, Deepesh K.; Rohrer, Brandon R.; Spletzer, Barry L.; Galambos, Paul C.; Wheeler, Jason W.; Hobart, Clinton G.; Givler, Richard C.

    2008-09-23

    Footwear comprises a sole and a plurality of sealed cavities contained within the sole. The sealed cavities can be incorporated as deformable containers within an elastic medium, comprising the sole. A plurality of micro electro-mechanical system (MEMS) pressure sensors are respectively contained within the sealed cavity plurality, and can be adapted to measure static and dynamic pressure within each of the sealed cavities. The pressure measurements can provide information relating to the contact pressure distribution between the sole of the footwear and the wearer's environment.

  6. FEM Simulation of Influence of Protective Encapsulation on MEMS Pressure Sensor

    DEFF Research Database (Denmark)

    Yao, Qingshan; Janting, Jakob; Branebjerg, Jens

    2003-01-01

    The objective of the work is to evaluate the feasibility of packaging a MEMS silicon pressure sensor by using either a polymer encapsulation or a combination of a polymer encapsulation and a metallic protection Membrane (fig. 1). The potential application of the protected sensor is for harsh...... environments. Several steps of simulation are carried out:1) Comparisons of the sensitivities are made among the non-encapsulated silicon sensor, the polymer encapsulated and polymer with metal encapsulated sensor. This is for evaluating whether the encapsulating materials reduce the pressure sensitivity...... whether the metallic membrane / coating will peel off when applying the maximum pressure, which is 4000 bar leading to high shear stress between the metallic membrane and the polymer encapsulation material.3) Thermal calculations are made to evaluate the influence of the environment on the packaged sensor...

  7. Shock tunnel measurements of surface pressures in shock induced separated flow field using MEMS sensor array

    International Nuclear Information System (INIS)

    Sriram, R; Jagadeesh, G; Ram, S N; Hegde, G M; Nayak, M M

    2015-01-01

    Characterized not just by high Mach numbers, but also high flow total enthalpies—often accompanied by dissociation and ionization of flowing gas itself—the experimental simulation of hypersonic flows requires impulse facilities like shock tunnels. However, shock tunnel simulation imposes challenges and restrictions on the flow diagnostics, not just because of the possible extreme flow conditions, but also the short run times—typically around 1 ms. The development, calibration and application of fast response MEMS sensors for surface pressure measurements in IISc hypersonic shock tunnel HST-2, with a typical test time of 600 μs, for the complex flow field of strong (impinging) shock boundary layer interaction with separation close to the leading edge, is delineated in this paper. For Mach numbers 5.96 (total enthalpy 1.3 MJ kg −1 ) and 8.67 (total enthalpy 1.6 MJ kg −1 ), surface pressures ranging from around 200 Pa to 50 000 Pa, in various regions of the flow field, are measured using the MEMS sensors. The measurements are found to compare well with the measurements using commercial sensors. It was possible to resolve important regions of the flow field involving significant spatial gradients of pressure, with a resolution of 5 data points within 12 mm in each MEMS array, which cannot be achieved with the other commercial sensors. In particular, MEMS sensors enabled the measurement of separation pressure (at Mach 8.67) near the leading edge and the sharply varying pressure in the reattachment zone. (paper)

  8. A method enabling simultaneous pressure and temperature measurement using a single piezoresistive MEMS pressure sensor

    International Nuclear Information System (INIS)

    Frantlović, Miloš; Stanković, Srđan; Jokić, Ivana; Lazić, Žarko; Smiljanić, Milče; Obradov, Marko; Vukelić, Branko; Jakšić, Zoran

    2016-01-01

    In this paper we present a high-performance, simple and low-cost method for simultaneous measurement of pressure and temperature using a single piezoresistive MEMS pressure sensor. The proposed measurement method utilizes the parasitic temperature sensitivity of the sensing element for both pressure measurement correction and temperature measurement. A parametric mathematical model of the sensor was established and its parameters were calculated using the obtained characterization data. Based on the model, a real-time sensor correction for both pressure and temperature measurements was implemented in a target measurement system. The proposed method was verified experimentally on a group of typical industrial-grade piezoresistive sensors. The obtained results indicate that the method enables the pressure measurement performance to exceed that of typical digital industrial pressure transmitters, achieving at the same time the temperature measurement performance comparable to industrial-grade platinum resistance temperature sensors. The presented work is directly applicable in industrial instrumentation, where it can add temperature measurement capability to the existing pressure measurement instruments, requiring little or no additional hardware, and without adverse effects on pressure measurement performance. (paper)

  9. MEMS Fabry-Perot sensor interrogated by optical system-on-a-chip for simultaneous pressure and temperature sensing.

    Science.gov (United States)

    Pang, Cheng; Bae, Hyungdae; Gupta, Ashwani; Bryden, Kenneth; Yu, Miao

    2013-09-23

    We present a micro-electro-mechanical systems (MEMS) based Fabry-Perot (FP) sensor along with an optical system-on-a-chip (SOC) interrogator for simultaneous pressure and temperature sensing. The sensor employs a simple structure with an air-backed silicon membrane cross-axially bonded to a 45° polished optical fiber. This structure renders two cascaded FP cavities, enabling simultaneous pressure and temperature sensing in close proximity along the optical axis. The optical SOC consists of a broadband source, a MEMS FP tunable filter, a photodetector, and the supporting circuitry, serving as a miniature spectrometer for retrieving the two FP cavity lengths. Within the measured pressure and temperature ranges, experimental results demonstrate that the sensor exhibits a good linear response to external pressure and temperature changes.

  10. Design of Diaphragm Based MEMS Pressure Sensor with Sensitivity Analysis for Environmental Applications

    Directory of Open Access Journals (Sweden)

    A. Nallathambi

    2015-05-01

    Full Text Available In this paper Micro-electromechanical System (MEMS diaphragm based pressure sensor for environmental applications is discussed. The main focus of this paper is to design, simulate and analyze the sensitivity of MEMS based diaphragm using different structures to measure the low and high pressure values. The simulation is done through the finite element tool and specifications related the maximum convinced stress; deflection and sensitivity of the diaphragms have been analyzed using the software INTELLISUITE 8.7v. The change in pressure is to bending of the diaphragm that modifies the measured displacement between the substrate and the diaphragm. This change in displacement gives the measure of the pressure in that environment. The design of these studies can be used to improve the sensitivity of these devices. Here the diaphragm based pressure sensor produced better displacement, sensitivity and stress output responses are obtained from the square diaphragm. The pressure range from 0.6 MPa to 25 MPa and its maximum displacement is accordingly 59 mm over a pressure range of 0 to 2 MPa. Its sensitivity is therefore 2.35 [10E-12/Pa].

  11. MEMS Technology Sensors as a More Advantageous Technique for Measuring Foot Plantar Pressure and Balance in Humans

    Directory of Open Access Journals (Sweden)

    Clara Sanz Morère

    2016-01-01

    Full Text Available Locomotor activities are part and parcel of daily human life. During walking or running, feet are subjected to high plantar pressure, leading sometimes to limb problems, pain, or foot ulceration. A current objective in foot plantar pressure measurements is developing sensors that are small in size, lightweight, and energy efficient, while enabling high mobility, particularly for wearable applications. Moreover, improvements in spatial resolution, accuracy, and sensitivity are of interest. Sensors with improved sensing techniques can be applied to a variety of research problems: diagnosing limb problems, footwear design, or injury prevention. This paper reviews commercially available sensors used in foot plantar pressure measurements and proposes the utilization of pressure sensors based on the MEMS (microelectromechanical systems technique. Pressure sensors based on this technique have the capacity to measure pressure with high accuracy and linearity up to high pressure levels. Moreover, being small in size, they are highly suitable for this type of measurement. We present two MEMS sensor models and study their suitability for the intended purpose by performing several experiments. Preliminary results indicate that the sensors are indeed suitable for measuring foot plantar pressure. Importantly, by measuring pressure continuously, they can also be utilized for body balance measurements.

  12. Attachment of MEM piezoresistive silicon pressure sensor dies using different adhesives

    Directory of Open Access Journals (Sweden)

    Jović Vesna B.

    2011-01-01

    Full Text Available This paper gives comparison and discussion of adhesives used for attachment of silicon piezoresistive pressure sensor dies. Special attention is paid on low pressure sensor dies because of their extreme sensitivity on stresses, which can arise from packaging procedure and applied materials. Commercially available adhesives “Scotch Weld 2214 Hi-Temp” from “3M Co.” and “DM2700P/H848” from “DIEMAT”, USA, were compared. First of them is aluminum filled epoxy adhesive and second is low melting temperature (LMT glass paste. Comparing test results for low pressure sensor chips we found that LMT glass (glass frit is better adhesive for this application. Applying LMT glass paste minimizes internal stresses caused by disagreement of coefficients of thermal expansions between sensor die and housing material. Also, it minimizes stresses introduced during applying external loads in the process of pressure measuring. Regarding the measurements, for the sensors installed with filled epoxy paste, resistor for compensation of temperature offset change had negative values in all cases, which means that linear temperature compensation, of sensors installed this way, would be impossible. In the sensors installed with LMT glass paste, all results, without exception, were in their common limits (values, which give the possibility of passive temperature compensation. Furthermore, LMT glass attachment can broaden temperature operating range of MEM silicon pressure sensors towards higher values, up to 120 ºC.

  13. MEMS fiber-optic Fabry-Perot pressure sensor for high temperature application

    Science.gov (United States)

    Fang, G. C.; Jia, P. G.; Cao, Q.; Xiong, J. J.

    2016-10-01

    We design and demonstrate a fiber-optic Fabry-Perot pressure sensor (FOFPPS) for high-temperature sensing by employing micro-electro-mechanical system (MEMS) technology. The FOFPPS is fabricated by anodically bonding the silicon wafer and the Pyrex glass together and fixing the facet of the optical fiber in parallel with the silicon surface by glass frit and organic adhesive. The silicon wafer can be reduced through dry etching technology to construct the sensitive diaphragm. The length of the cavity changes with the deformation of the diaphragm due to the loaded pressure, which leads to a wavelength shift of the interference spectrum. The pressure can be gauged by measuring the wavelength shift. The pressure experimental results show that the sensor has linear pressure sensitivities ranging from 0 kPa to 600 kPa at temperature range between 20°C to 300°C. The pressure sensitivity at 300°C is approximately 27.63 pm/kPa. The pressure sensitivities gradually decrease with increasing the temperature. The sensor also has a linear thermal drift when temperature changes from 20°C - 300°C.

  14. Design, simulation and analysis of piezoresistive MEMS pressure sensor for fast reactor applications

    International Nuclear Information System (INIS)

    Patankar, Mahesh Kumar; Murali, N.; Satya Murty, S.A.V.; Kalyana Rao, K.; Sridhar, S.

    2013-01-01

    To exploit the extraordinary benefits of MEMS technology in fast reactor domain, a piezoresistive MEMS pressure sensor was designed, simulated and analyzed using Intellisuite Software to measure the RCB air pressure in 0 - 1.25 bar (a) range. For sensing the pressure, a thin square silicon diaphragm of size of 800 x 800 μm 2 with thickness of 20 μm was optimized using FEM analysis and to transfer the mechanical stress, induce in the diaphragm due to pressure, into electrical output voltage signal, a set of piezoresistors were arranged on top side of the diaphragm in full active wheatstone bridge configuration for obtaining the higher sensitivity. The simulation results were compared with the analytical results which were found in line of expectations and electrical sensitivity was obtained at 15 mV/V.bar. (author)

  15. Advantages of PZT thick film for MEMS sensors

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Lou-Moller, R.; Hansen, K.

    2010-01-01

    For all MEMS devices a high coupling between the mechanical and electrical domain is desired. Figures of merit describing the coupling are important for comparing different piezoelectric materials. The existing figures of merit are discussed and a new figure of merit is introduced for a fair comp....... Improved figure of merit is reached in the piezoelectric PZT thick film, TF2100CIP, by using cold isostatic pressure in the PZT preparation process. The porosity of TF2100 is decreased 38%, hence, allowing an increase of charge sensitivity for MEMS sensors of 59%....... thin film and PZT thick film. It is shown that MEMS sensors with the PZT thick film TF2100 from InSensor A/S have potential for significant higher voltage sensitivities compared to PZT thin film base MEMS sensors when the total thickness of the MEMS cantilever, beam, bridge or membrane is high...

  16. A Simple Model for Complex Fabrication of MEMS based Pressure Sensor: A Challenging Approach

    Directory of Open Access Journals (Sweden)

    Himani SHARMA

    2010-08-01

    Full Text Available In this paper we have presented the simple model for complex fabrication of MEMS based absolute micro pressure sensor. This kind of modeling is extremely useful for determining its complexity in fabrication steps and provides complete information about process sequence to be followed during manufacturing. Therefore, the need for test iteration decreases and cost, time can be reduced significantly. By using DevEdit tool (part of SILVACO tool, a behavioral model of pressure sensor have been presented and implemented.

  17. DOUBLE BOSS SCULPTURED DIAPHRAGM EMPLOYED PIEZORESISTIVE MEMS PRESSURE SENSOR WITH SILICON-ON-INSULATOR (SOI

    Directory of Open Access Journals (Sweden)

    D. SINDHANAISELVI

    2017-07-01

    Full Text Available This paper presents the detailed study on the measurement of low pressure sensor using double boss sculptured diaphragm of piezoresistive type with MEMS technology in flash flood level measurement. The MEMS based very thin diaphragms to sense the low pressure is analyzed by introducing supports to achieve linearity. The simulation results obtained from Intellisuite MEMS CAD design tool show that very thin diaphragms with rigid centre or boss give acceptable linearity. Further investigations on very thin diaphragms embedded with piezoresistor for low pressure measurement show that it is essential to analyse the piezoresistor placement and size of piezoresistor to achieve good sensitivity. A modified analytical modelling developed in this study for double boss sculptured diaphragm results were compared with simulated results. Further the enhancement of sensitivity is analyzed using non uniform thickness diaphragm and Silicon-On-Insulator (SOI technique. The simulation results indicate that the double boss square sculptured diaphragm with SOI layer using 0.85μm thickness yields the higher voltage sensitivity, acceptable linearity with Small Scale Deflection.

  18. Design, Fabrication, and Implementation of an Array-Type MEMS Piezoresistive Intelligent Pressure Sensor System

    Directory of Open Access Journals (Sweden)

    Jiahong Zhang

    2018-02-01

    Full Text Available To meet the radiosonde requirement of high sensitivity and linearity, this study designs and implements a monolithically integrated array-type piezoresistive intelligent pressure sensor system which is made up of two groups of four pressure sensors with the pressure range of 0–50 kPa and 0–100 kPa respectively. First, theoretical models and ANSYS (version 14.5, Canonsburg, PA, USA finite element method (FEM are adopted to optimize the parameters of array sensor structure. Combing with FEM stress distribution results, the size and material characteristics of the array-type sensor are determined according to the analysis of the sensitivity and the ratio of signal to noise (SNR. Based on the optimized parameters, the manufacture and packaging of array-type sensor chips are then realized by using the standard complementary metal-oxide-semiconductor (CMOS and microelectromechanical system (MEMS process. Furthermore, an intelligent acquisition and processing system for pressure and temperature signals is achieved. The S3C2440A microprocessor (Samsung, Seoul, Korea is regarded as the core part which can be applied to collect and process data. In particular, digital signal storage, display and transmission are realized by the application of a graphical user interface (GUI written in QT/E. Besides, for the sake of compensating the temperature drift and nonlinear error, the data fusion technique is proposed based on a wavelet neural network improved by genetic algorithm (GA-WNN for average measuring signal. The GA-WNN model is implemented in hardware by using a S3C2440A microprocessor. Finally, the results of calibration and test experiments achieved with the temperature ranges from −20 to 20 °C show that: (1 the nonlinear error and the sensitivity of the array-type pressure sensor are 8330 × 10−4 and 0.052 mV/V/kPa in the range of 0–50 kPa, respectively; (2 the nonlinear error and the sensitivity are 8129 × 10−4 and 0.020 mV/V/kPa in the

  19. Novel threshold pressure sensors based on nonlinear dynamics of MEMS resonators

    Science.gov (United States)

    Hasan, Mohammad H.; Alsaleem, Fadi M.; Ouakad, Hassen M.

    2018-06-01

    Triggering an alarm in a car for low air-pressure in the tire or tripping an HVAC compressor if the refrigerant pressure is lower than a threshold value are examples for applications where measuring the amount of pressure is not as important as determining if the pressure has exceeded a threshold value for an action to occur. Unfortunately, current technology still relies on analog pressure sensors to perform this functionality by adding a complex interface (extra circuitry, controllers, and/or decision units). In this paper, we demonstrate two new smart tunable-threshold pressure switch concepts that can reduce the complexity of a threshold pressure sensor. The first concept is based on the nonlinear subharmonic resonance of a straight double cantilever microbeam with a proof mass and the other concept is based on the snap-through bi-stability of a clamped-clamped MEMS shallow arch. In both designs, the sensor operation concept is simple. Any actuation performed at a certain pressure lower than a threshold value will activate a nonlinear dynamic behavior (subharmonic resonance or snap-through bi-stability) yielding a large output that would be interpreted as a logic value of ONE, or ON. Once the pressure exceeds the threshold value, the nonlinear response ceases to exist, yielding a small output that would be interpreted as a logic value of ZERO, or OFF. A lumped, single degree of freedom model for the double cantilever beam, that is validated using experimental data, and a continuous beam model for the arch beam, are used to simulate the operation range of the proposed sensors by identifying the relationship between the excitation signal and the critical cut-off pressure.

  20. FISH & CHIPS: Single Chip Silicon MEMS CTDL Salinity, Temperature, Pressure and Light sensor for use in fisheries research

    DEFF Research Database (Denmark)

    Hyldgård, Anders; Hansen, Ole; Thomsen, Erik Vilain

    2005-01-01

    A single-chip silicon MEMS CTDL multi sensor for use in aqueous environments is presented. The new sensor chip consists of a conductivity sensor based on platinum electrodes (C), an ion-implanted thermistor temperature sensor (T), a piezoresistive pressure sensor (D for depth/pressure) and an ion......-implanted p-n junction light sensor (L). The design and fabrication process is described. A temperature sensitivity of 0.8 × 10-3K-1 has been measured and detailed analysis of conductivity measurement data shows a cell constant of 81 cm-1....

  1. Comparison of Engine/Inlet Distortion Measurements with MEMS and ESP Pressure Sensors

    Science.gov (United States)

    Soto, Hector L.; Hernandez, Corey D.

    2004-01-01

    A study of active-flow control in a small-scale boundary layer ingestion inlet was conducted at the NASA Langley Basic Aerodynamic Research Tunnel (BART). Forty MEMS pressure sensors, in a rake style configuration, were used to examine both the mean (DC) and high frequency (AC) components of the total pressure across the inlet/engine interface plane. The mean component was acquired and used to calculate pressure distortion. The AC component was acquired separately, at a high sampling rate, and is used to study the unsteady effects of the active-flow control. An identical total pressure rake, utilizing an Electronically Scanned Pressure (ESP) system, was also used to calculate distortion; a comparison of the results obtained using the two rakes is presented.

  2. Model-based design of MEMS resonant pressure sensors

    NARCIS (Netherlands)

    Suijlen, M.A.G.

    2011-01-01

    The massive integration of micromechanical structures on ICs to allow microsystems to sense and control the environment is expected to be one of the most important technological breakthroughs of the future. At present, cheap and small MEMS sensors are emerging in countless applications. Automotive

  3. Resonant Magnetic Field Sensors Based On MEMS Technology

    Directory of Open Access Journals (Sweden)

    Elías Manjarrez

    2009-09-01

    Full Text Available Microelectromechanical systems (MEMS technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

  4. Resonant Magnetic Field Sensors Based On MEMS Technology

    Science.gov (United States)

    Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías

    2009-01-01

    Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480

  5. Poly-SiGe for MEMS-above-CMOS sensors

    CERN Document Server

    Gonzalez Ruiz, Pilar; Witvrouw, Ann

    2014-01-01

    Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence o...

  6. On Packaging of MEMS. Simulation of Transfer Moulding and Packaging Stress and their Effect on a Family of piezo-resistive Pressure Sensors

    OpenAIRE

    Krondorfer, Rudolf H.

    2004-01-01

    Micro Electro Mechanical Systems (MEMS) produced to date include IR detectors, accelerometers, pressure sensors, micro lenses, actuators, chemical sensors, gear drives, RF devices, optical processor chips, micro robots and devices for biomedical analysis. The track for tomorrow has already been set and products like 3D TV, physician on a chip, lab on a chip, micro aircraft and food safety sensors will be developed when the technology matures and the market is ready. Todays MEMS fabricatio...

  7. Pressure sensor based on MEMS nano-cantilever beam structure as a heterodielectric gate electrode of dopingless TFET

    Science.gov (United States)

    Kumar, Gagan; Raman, Ashish

    2016-12-01

    Micro-electromechanical systems (MEMS) technology has enticed numerous scientists since recent decades particularly in the field of miniaturized-sensors and actuators. Pressure sensor is pivotal component in both of the forerunning fields. The pursuance of a pressure sensor is exigently relying upon its different physical properties i.e. Piezo-resistive, Piezoelectric, Capacitive, Magnetic and Electrostatic. This article presents an outline and scrutiny of the Doping-less Cantilever Based Pressure Sensor using tunnel field effect transistor technology. The propounded pressure sensor based on the principle of capacitive gate coupling, due to which the tunneling current is modified. Additionally, to enhance the affectability of pressure sensor, the work function of metal gate electrode is amended using gas molecule diffusion. Simulation uncovers a phenomenal relationship amongst hypothetical and practical accepts of configuration. The pressure sensor is composed at Silvaco Atlas tool utilizing 40 nm technologies. The performance results exhibit that the proposed model consumes ≤1 mW power and 250 μA tunneling current per nm bending of cantilever beam structure. The inclusive length of the proposed device is 100 nm.

  8. MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias

    Science.gov (United States)

    Mukhopadhyay, B.; Fritz, M.; Mackowiak, P.; Vu, T. C.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.

    2013-05-01

    Design, simulation, fabrication, and characterization of novel MEMS pressure sensors with new back-side-direct-exposure packaging concept are presented. The sensor design is optimized for harsh environments e.g. space, military, offshore and medical applications. Unbreakable connection between the active side of the Si-sensor and the protecting glass capping was realized by anodic bonding using a thin layer of metal. To avoid signal corruption of the measured pressure caused by an encapsulation system, the media has direct contact to the backside of the Si membrane and can deflect it.

  9. Differential pressure measurement using a free-flying insect-like ornithopter with an MEMS sensor

    International Nuclear Information System (INIS)

    Takahashi, Hidetoshi; Aoyama, Yuichiro; Ohsawa, Kazuharu; Iwase, Eiji; Matsumoto, Kiyoshi; Shimoyama, Isao; Tanaka, Hiroto

    2010-01-01

    This paper presents direct measurements of the aerodynamic forces on the wing of a free-flying, insect-like ornithopter that was modeled on a hawk moth (Manduca sexta). A micro differential pressure sensor was fabricated with micro electro mechanical systems (MEMS) technology and attached to the wing of the ornithopter. The sensor chip was less than 0.1% of the wing area. The mass of the sensor chip was 2.0 mg, which was less than 1% of the wing mass. Thus, the sensor was both small and light in comparison with the wing, resulting in a measurement system that had a minimal impact on the aerodynamics of the wing. With this sensor, the 'pressure coefficient' of the ornithopter wing was measured during both steady airflow and actual free flight. The maximum pressure coefficient observed for steady airflow conditions was 1.4 at an angle of attack of 30 0 . In flapping flight, the coefficient was around 2.0 for angles of attack that ranged from 25 0 to 40 0 . Therefore, a larger aerodynamic force was generated during the downstroke in free flight compared to steady airflow conditions.

  10. A flexible liquid crystal polymer MEMS pressure sensor array for fish-like underwater sensing

    International Nuclear Information System (INIS)

    Kottapalli, A G P; Asadnia, M; Miao, J M; Barbastathis, G; Triantafyllou, M S

    2012-01-01

    In order to perform underwater surveillance, autonomous underwater vehicles (AUVs) require flexible, light-weight, reliable and robust sensing systems that are capable of flow sensing and detecting underwater objects. Underwater animals like fish perform a similar task using an efficient and ubiquitous sensory system called a lateral-line constituting of an array of pressure-gradient sensors. We demonstrate here the development of arrays of polymer microelectromechanical systems (MEMS) pressure sensors which are flexible and can be readily mounted on curved surfaces of AUV bodies. An array of ten sensors with a footprint of 60 (L) mm × 25 (W) mm × 0.4 (H) mm is fabricated using liquid crystal polymer (LCP) as the sensing membrane material. The flow sensing and object detection capabilities of the array are illustrated with proof-of-concept experiments conducted in a water tunnel. The sensors demonstrate a pressure sensitivity of 14.3 μV Pa −1 . A high resolution of 25 mm s −1 is achieved in water flow sensing. The sensors can passively sense underwater objects by transducing the pressure variations generated underwater by the movement of objects. The experimental results demonstrate the array’s ability to detect the velocity of underwater objects towed past by with high accuracy, and an average error of only 2.5%. (paper)

  11. Differential pressure distribution measurement with an MEMS sensor on a free-flying butterfly wing

    International Nuclear Information System (INIS)

    Takahashi, Hidetoshi; Matsumoto, Kiyoshi; Shimoyama, Isao; Tanaka, Hiroto

    2012-01-01

    An insect can perform various flight maneuvers. However, the aerodynamic force generated by real insect wings during free flight has never been measured directly. In this study, we present the direct measurement of the four points of the differential pressures acting on the wing surface of a flying insect. A small-scale differential pressure sensor of 1.0 mm × 1.0 mm × 0.3 mm in size was developed using microelectromechanical systems (MEMS) and was attached to a butterfly wing. Total weight of the sensor chip and the flexible electrode on the wing was 4.5 mg, which was less than 10% of the wing weight. Four points on the wing were chosen as measurement points, and one sensor chip was attached in each flight experiment. During takeoff, the wing's flapping motion induced a periodic and symmetric differential pressure between upstroke and downstroke. The average absolute value of the local differential pressure differed significantly with the location: 7.4 Pa at the forewing tip, 5.5 Pa at the forewing center, 2.1 Pa at the forewing root and 2.1 Pa at the hindwing center. The instantaneous pressure at the forewing tip reached 10 Pa, which was ten times larger than wing loading of the butterfly. (paper)

  12. Research on MEMS sensor in hydraulic system flow detection

    Science.gov (United States)

    Zhang, Hongpeng; Zhang, Yindong; Liu, Dong; Ji, Yulong; Jiang, Jihai; Sun, Yuqing

    2011-05-01

    With the development of mechatronics technology and fault diagnosis theory, people regard flow information much more than before. Cheap, fast and accurate flow sensors are urgently needed by hydraulic industry. So MEMS sensor, which is small, low cost, well performed and easy to integrate, will surely play an important role in this field. Based on the new method of flow measurement which was put forward by our research group, this paper completed the measurement of flow rate in hydraulic system by setting up the mathematical model, using numerical simulation method and doing physical experiment. Based on viscous fluid flow equations we deduced differential pressure-velocity model of this new sensor and did optimization on parameters. Then, we designed and manufactured the throttle and studied the velocity and pressure field inside the sensor by FLUENT. Also in simulation we get the differential pressure-velocity curve .The model machine was simulated too to direct experiment. In the static experiments we calibrated the MEMS sensing element and built some sample sensors. Then in a hydraulic testing system we compared the sensor signal with a turbine meter. It presented good linearity and could meet general hydraulic system use. Based on the CFD curves, we analyzed the error reasons and made some suggestion to improve. In the dynamic test, we confirmed this sensor can realize high frequency flow detection by a 7 piston-pump.

  13. A capacitive CMOS-MEMS sensor designed by multi-physics simulation for integrated CMOS-MEMS technology

    Science.gov (United States)

    Konishi, Toshifumi; Yamane, Daisuke; Matsushima, Takaaki; Masu, Kazuya; Machida, Katsuyuki; Toshiyoshi, Hiroshi

    2014-01-01

    This paper reports the design and evaluation results of a capacitive CMOS-MEMS sensor that consists of the proposed sensor circuit and a capacitive MEMS device implemented on the circuit. To design a capacitive CMOS-MEMS sensor, a multi-physics simulation of the electromechanical behavior of both the MEMS structure and the sensing LSI was carried out simultaneously. In order to verify the validity of the design, we applied the capacitive CMOS-MEMS sensor to a MEMS accelerometer implemented by the post-CMOS process onto a 0.35-µm CMOS circuit. The experimental results of the CMOS-MEMS accelerometer exhibited good agreement with the simulation results within the input acceleration range between 0.5 and 6 G (1 G = 9.8 m/s2), corresponding to the output voltages between 908.6 and 915.4 mV, respectively. Therefore, we have confirmed that our capacitive CMOS-MEMS sensor and the multi-physics simulation will be beneficial method to realize integrated CMOS-MEMS technology.

  14. CMOS MEMS capacitive absolute pressure sensor

    International Nuclear Information System (INIS)

    Narducci, M; Tsai, J; Yu-Chia, L; Fang, W

    2013-01-01

    This paper presents the design, fabrication and characterization of a capacitive pressure sensor using a commercial 0.18 µm CMOS (complementary metal–oxide–semiconductor) process and postprocess. The pressure sensor is capacitive and the structure is formed by an Al top electrode enclosed in a suspended SiO 2 membrane, which acts as a movable electrode against a bottom or stationary Al electrode fixed on the SiO 2 substrate. Both the movable and fixed electrodes form a variable parallel plate capacitor, whose capacitance varies with the applied pressure on the surface. In order to release the membranes the CMOS layers need to be applied postprocess and this mainly consists of four steps: (1) deposition and patterning of PECVD (plasma-enhanced chemical vapor deposition) oxide to protect CMOS pads and to open the pressure sensor top surface, (2) etching of the sacrificial layer to release the suspended membrane, (3) deposition of PECVD oxide to seal the etching holes and creating vacuum inside the gap, and finally (4) etching of the passivation oxide to open the pads and allow electrical connections. This sensor design and fabrication is suitable to obey the design rules of a CMOS foundry and since it only uses low-temperature processes, it allows monolithic integration with other types of CMOS compatible sensors and IC (integrated circuit) interface on a single chip. Experimental results showed that the pressure sensor has a highly linear sensitivity of 0.14 fF kPa −1 in the pressure range of 0–300 kPa. (paper)

  15. Piezoelectric Zinc Oxide Based MEMS Acoustic Sensor

    Directory of Open Access Journals (Sweden)

    Aarti Arora

    2008-04-01

    Full Text Available An acoustic sensors exhibiting good sensitivity was fabricated using MEMS technology having piezoelectric zinc oxide as a dielectric between two plates of capacitor. Thin film zinc oxide has structural, piezoelectric and optical properties for surface acoustic wave (SAW and bulk acoustic wave (BAW devices. Oxygen effficient films are transparent and insulating having wide applications for sensors and transducers. A rf sputtered piezoelectric ZnO layer transforms the mechanical deflection of a thin etched silicon diaphragm into a piezoelectric charge. For 25-micron thin diaphragm Si was etched in tetramethylammonium hydroxide solution using bulk micromachining. This was followed by deposition of sandwiched structure composed of bottom aluminum electrode, sputtered 3 micron ZnO film and top aluminum electrode. A glass having 1 mm diameter hole was bonded on backside of device to compensate sound pressure in side the cavity. The measured value of central capacitance and dissipation factor of the fabricated MEMS acoustic sensor was found to be 82.4pF and 0.115 respectively, where as the value of ~176 pF was obtained for the rim capacitance with a dissipation factor of 0.138. The response of the acoustic sensors was reproducible for the devices prepared under similar processing conditions under different batches. The acoustic sensor was found to be working from 30Hz to 8KHz with a sensitivity of 139µV/Pa under varying acoustic pressure.

  16. Modeling of a Piezoelectric MEMS Micropump Dedicated to Insulin Delivery and Experimental Validation Using Integrated Pressure Sensors: Application to Partial Occlusion Management

    Directory of Open Access Journals (Sweden)

    S. Fournier

    2017-01-01

    Full Text Available A numerical model based on equivalent electrical networks has been built to simulate the dynamic behavior of a positive-displacement MEMS micropump dedicated to insulin delivery. This device comprises a reservoir in direct communication with the inlet check valve, a pumping membrane actuated by a piezo actuator, two integrated piezoresistive pressure sensors, an anti-free-flow check valve at the outlet, and finally a fluidic pathway up to the patient cannula. The pressure profiles delivered by the sensors are continuously analyzed during the therapy in order to detect failures like occlusion. The numerical modeling is a reliable way to better understand the behavior of the micropump in case of failure. The experimental pressure profiles measured during the actuation phase have been used to validate the numerical modeling. The effect of partial occlusion on the pressure profiles has been also simulated. Based on this analysis, a new management of partial occlusion for MEMS micropump is finally proposed.

  17. MEMS for automotive and aerospace applications

    CERN Document Server

    Kraft, Michael

    2013-01-01

    MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for

  18. Novel designs for application specific MEMS pressure sensors.

    Science.gov (United States)

    Fragiacomo, Giulio; Reck, Kasper; Lorenzen, Lasse; Thomsen, Erik V

    2010-01-01

    In the framework of developing innovative microfabricated pressure sensors, we present here three designs based on different readout principles, each one tailored for a specific application. A touch mode capacitive pressure sensor with high sensitivity (14 pF/bar), low temperature dependence and high capacitive output signal (more than 100 pF) is depicted. An optical pressure sensor intrinsically immune to electromagnetic interference, with large pressure range (0-350 bar) and a sensitivity of 1 pm/bar is presented. Finally, a resonating wireless pressure sensor power source free with a sensitivity of 650 KHz/mmHg is described. These sensors will be related with their applications in harsh environment, distributed systems and medical environment, respectively. For many aspects, commercially available sensors, which in vast majority are piezoresistive, are not suited for the applications proposed.

  19. Novel Designs for Application Specific MEMS Pressure Sensors

    Directory of Open Access Journals (Sweden)

    Erik V. Thomsen

    2010-10-01

    Full Text Available In the framework of developing innovative microfabricated pressure sensors, we present here three designs based on different readout principles, each one tailored for a specific application. A touch mode capacitive pressure sensor with high sensitivity (14 pF/bar, low temperature dependence and high capacitive output signal (more than 100 pF is depicted. An optical pressure sensor intrinsically immune to electromagnetic interference, with large pressure range (0–350 bar and a sensitivity of 1 pm/bar is presented. Finally, a resonating wireless pressure sensor power source free with a sensitivity of 650 KHz/mmHg is described. These sensors will be related with their applications in  harsh environment, distributed systems and medical environment, respectively. For many aspects, commercially available sensors, which in vast majority are piezoresistive, are not suited for the applications proposed.

  20. A Capacitance-To-Digital Converter for MEMS Sensors for Smart Applications.

    Science.gov (United States)

    Pérez Sanjurjo, Javier; Prefasi, Enrique; Buffa, Cesare; Gaggl, Richard

    2017-06-07

    The use of MEMS sensors has been increasing in recent years. To cover all the applications, many different readout circuits are needed. To reduce the cost and time to market, a generic capacitance-to-digital converter (CDC) seems to be the logical next step. This work presents a configurable CDC designed for capacitive MEMS sensors. The sensor is built with a bridge of MEMS, where some of them function with pressure. Then, the capacitive to digital conversion is realized using two steps. First, a switched-capacitor (SC) preamplifier is used to make the capacitive to voltage (C-V) conversion. Second, a self-oscillated noise-shaping integrating dual-slope (DS) converter is used to digitize this magnitude. The proposed converter uses time instead of amplitude resolution to generate a multibit digital output stream. In addition it performs noise shaping of the quantization error to reduce measurement time. This article shows the effectiveness of this method by measurements performed on a prototype, designed and fabricated using standard 0.13 µm CMOS technology. Experimental measurements show that the CDC achieves a resolution of 17 bits, with an effective area of 0.317 mm², which means a pressure resolution of 1 Pa, while consuming 146 µA from a 1.5 V power supply.

  1. Amorphous Diamond MEMS and Sensors

    Energy Technology Data Exchange (ETDEWEB)

    SULLIVAN, JOHN P.; FRIEDMANN, THOMAS A.; ASHBY, CAROL I.; DE BOER, MAARTEN P.; SCHUBERT, W. KENT; SHUL, RANDY J.; HOHLFELDER, ROBERT J.; LAVAN, D.A.

    2002-06-01

    This report describes a new microsystems technology for the creation of microsensors and microelectromechanical systems (MEMS) using stress-free amorphous diamond (aD) films. Stress-free aD is a new material that has mechanical properties close to that of crystalline diamond, and the material is particularly promising for the development of high sensitivity microsensors and rugged and reliable MEMS. Some of the unique properties of aD include the ability to easily tailor film stress from compressive to slightly tensile, hardness and stiffness 80-90% that of crystalline diamond, very high wear resistance, a hydrophobic surface, extreme chemical inertness, chemical compatibility with silicon, controllable electrical conductivity from insulating to conducting, and biocompatibility. A variety of MEMS structures were fabricated from this material and evaluated. These structures included electrostatically-actuated comb drives, micro-tensile test structures, singly- and doubly-clamped beams, and friction and wear test structures. It was found that surface micromachined MEMS could be fabricated in this material easily and that the hydrophobic surface of the film enabled the release of structures without the need for special drying procedures or the use of applied hydrophobic coatings. Measurements using these structures revealed that aD has a Young's modulus of {approx}650 GPa, a tensile fracture strength of 8 GPa, and a fracture toughness of 8 MPa{center_dot}m {sup 1/2}. These results suggest that this material may be suitable in applications where stiction or wear is an issue. Flexural plate wave (FPW) microsensors were also fabricated from aD. These devices use membranes of aD as thin as {approx}100 nm. The performance of the aD FPW sensors was evaluated for the detection of volatile organic compounds using ethyl cellulose as the sensor coating. For comparable membrane thicknesses, the aD sensors showed better performance than silicon nitride based sensors. Greater

  2. Research on High-Precision, Low Cost Piezoresistive MEMS-Array Pressure Transmitters Based on Genetic Wavelet Neural Networks for Meteorological Measurements

    Directory of Open Access Journals (Sweden)

    Jiahong Zhang

    2015-05-01

    Full Text Available This paper provides a novel and effective compensation method by improving the hardware design and software algorithm to achieve optimization of piezoresistive pressure sensors and corresponding measurement systems in order to measure pressure more accurately and stably, as well as to meet the application requirements of the meteorological industry. Specifically, GE NovaSensor MEMS piezoresistive pressure sensors within a thousandth of accuracy are selected to constitute an array. In the versatile compensation method, the hardware utilizes the array of MEMS pressure sensors to reduce random error caused by sensor creep, and the software adopts the data fusion technique based on the wavelet neural network (WNN which is improved by genetic algorithm (GA to analyze the data of sensors for the sake of obtaining accurate and complete information over the wide temperature and pressure ranges. The GA-WNN model is implemented in hardware by using the 32-bit STMicroelectronics (STM32 microcontroller combined with an embedded real-time operating system µC/OS-II to make the output of the array of MEMS sensors be a direct digital readout. The results of calibration and test experiments clearly show that the GA-WNN technique can be effectively applied to minimize the sensor errors due to the temperature drift, the hysteresis effect and the long-term drift because of aging and environmental changes. The maximum error of the low cost piezoresistive MEMS-array pressure transmitter proposed by us is within 0.04% of its full-scale value, and it can satisfy the meteorological pressure measurement.

  3. Novel Designs for Application Specific MEMS Pressure Sensors

    DEFF Research Database (Denmark)

    Fragiacomo, Giulio; Reck, Kasper; Lorenzen, Lasse Vestergaard

    2010-01-01

    and high capacitive output signal (more than 100 pF) is depicted. An optical pressure sensor intrinsically immune to electromagnetic interference, with large pressure range (0-350 bar) and a sensitivity of 1 pm/bar is presented. Finally, a resonating wireless pressure sensor power source free...

  4. Graphene Squeeze-Film Pressure Sensors.

    Science.gov (United States)

    Dolleman, Robin J; Davidovikj, Dejan; Cartamil-Bueno, Santiago J; van der Zant, Herre S J; Steeneken, Peter G

    2016-01-13

    The operating principle of squeeze-film pressure sensors is based on the pressure dependence of a membrane's resonance frequency, caused by the compression of the surrounding gas which changes the resonator stiffness. To realize such sensors, not only strong and flexible membranes are required, but also minimization of the membrane's mass is essential to maximize responsivity. Here, we demonstrate the use of a few-layer graphene membrane as a squeeze-film pressure sensor. A clear pressure dependence of the membrane's resonant frequency is observed, with a frequency shift of 4 MHz between 8 and 1000 mbar. The sensor shows a reproducible response and no hysteresis. The measured responsivity of the device is 9000 Hz/mbar, which is a factor 45 higher than state-of-the-art MEMS-based squeeze-film pressure sensors while using a 25 times smaller membrane area.

  5. Non-destructive residual pressure self-measurement method for the sensing chip of optical Fabry-Perot pressure sensor.

    Science.gov (United States)

    Wang, Xue; Wang, Shuang; Jiang, Junfeng; Liu, Kun; Zhang, Xuezhi; Xiao, Mengnan; Xiao, Hai; Liu, Tiegen

    2017-12-11

    We introduce a simple residual pressure self-measurement method for the Fabry-Perot (F-P) cavity of optical MEMS pressure sensor. No extra installation is required and the structure of the sensor is unchanged. In the method, the relationship between residual pressure and external pressure under the same diaphragm deflection condition at different temperatures is analyzed by using the deflection formula of the circular plate with clamped edges and the ideal gas law. Based on this, the residual pressure under the flat condition can be obtained by pressure scanning process and calculation process. We carried out the experiment to compare the residual pressures of two batches MEMS sensors fabricated by two kinds of bonding process. The measurement result indicates that our approach is reliable enough for the measurement.

  6. Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research

    DEFF Research Database (Denmark)

    Birkelund, Karen; Nørgaard, Lars; Thomsen, Erik Vilain

    2011-01-01

    light intensity, temperature, pressure and conductivity. For precise and fast measurements a direct exposure of the sensor to the water is desirable. A potted tube encapsulation concept has shown to be promising for accurate and fast measurements in harsh environment, provided a tight sealing......This paper presents the challenges of a packaged MEMS-based multi sensor system that allow for direct exposure of the sensing part to sea water. The system is part of a data storage tag used on fish to provide the researcher with information on fish behaviour and migration. The sensor measures...... compared to low pressure chemical vapor deposited (LPCVD) silicon nitride and untreated silicon dioxide....

  7. Implantable blood pressure sensor for analyzing elasticity in arteries

    Science.gov (United States)

    Franco-Ayala, Marco; Martínez-Piñón, Fernando; Reyes-Barranca, Alfredo; Sánchez de la Peña, Salvador; Álvarez-Chavez, José A.

    2009-03-01

    MEMS technology could be an option for the development of a pressure sensor which allows the monitoring of several electronic signals in humans. In this work, a comparison is made between the typical elasticity curves of several arteries in the human body and the elasticity obtained for MEMS silicon microstructures such as membranes and cantilevers employing Finite Element analysis tools. The purpose is to identify which types of microstructures are mechanically compatible with human arteries. The goal is to integrate a blood pressure sensor which can be implanted in proximity with an artery. The expected benefits for this type of sensor are mainly to reduce the problems associated with the use of bulk devices through the day and during several days. Such a sensor could give precise blood pressure readings in a continuous or periodic form, i.e. information that is especially important for some critical cases of hypertension patients.

  8. Packaged Capacitive Pressure Sensor System for Aircraft Engine Health Monitoring

    Science.gov (United States)

    Scardelletti, Maximilian C.; Zorman, Christian A.

    2016-01-01

    This paper describes the development of a packaged silicon carbide (SiC) based MEMS pressure sensor system designed specifically for a conventional turbofan engine. The electronic circuit is based on a Clapp-type oscillator that incorporates a 6H-SiC MESFET, a SiCN MEMS capacitive pressure sensor, titanate MIM capacitors, wirewound inductors, and thick film resistors. The pressure sensor serves as the capacitor in the LC tank circuit, thereby linking pressure to the resonant frequency of the oscillator. The oscillator and DC bias circuitry were fabricated on an alumina substrate and secured inside a metal housing. The packaged sensing system reliably operates at 0 to 350 psi and 25 to 540C. The system has a pressure sensitivity of 6.8 x 10E-2 MHzpsi. The packaged system shows negligible difference in frequency response between 25 and 400C. The fully packaged sensor passed standard benchtop acceptance tests and was evaluated on a flight-worthy engine.

  9. CARES/Life Used for Probabilistic Characterization of MEMS Pressure Sensor Membranes

    Science.gov (United States)

    Nemeth, Noel N.

    2002-01-01

    Microelectromechanical systems (MEMS) devices are typically made from brittle materials such as silicon using traditional semiconductor manufacturing techniques. They can be etched (or micromachined) from larger structures or can be built up with material deposition processes. Maintaining dimensional control and consistent mechanical properties is considerably more difficult for MEMS because feature size is on the micrometer scale. Therefore, the application of probabilistic design methodology becomes necessary for MEMS. This was demonstrated at the NASA Glenn Research Center and Case Western Reserve University in an investigation that used the NASA-developed CARES/Life brittle material design program to study the probabilistic fracture strength behavior of single-crystal SiC, polycrystalline SiC, and amorphous Si3N4 pressurized 1-mm-square thin-film diaphragms. These materials are of interest because of their superior high-temperature characteristics, which are desirable for harsh environment applications such as turbine engine and rocket propulsion system hot sections.

  10. Oxidative stress detection by MEMS cantilever sensor array based electronic nose

    Science.gov (United States)

    Gupta, Anurag; Singh, T. Sonamani; Singh, Priyanka; Yadava, R. D. S.

    2018-05-01

    This paper is concerned with analyzing the role of polymer swelling induced surface stress in MEMS chemical sensors. The objective is to determine the impact of surface stress on the chemical discrimination ability of MEMS resonator sensors. We considered a case study of hypoxia detection by MEMS sensor array and performed several types of simulation experiments for detection of oxidative stress volatile organic markers in human breath. Both types of sensor response models that account for the surface stress effect and that did not were considered for the analyses in comparison. It is found that the surface stress (hence the polymer swelling) provides better chemical discrimination ability to polymer coated MEMS sensors.

  11. Touch mode micromachined capacitive pressure sensor with signal conditioning electronics

    DEFF Research Database (Denmark)

    Fragiacomo, Giulio; Eriksen, Gert F.; Christensen, Carsten

    2010-01-01

    In the last decades, pressure sensors have been one of the greatest successes of the MEMS industry. Many companies are using them in a variety of applications from the automotive to the environmental field. Currently piezoresistive pressure sensors are the most developed, and a well established t...

  12. System-Level Modelling and Simulation of MEMS-Based Sensors

    DEFF Research Database (Denmark)

    Virk, Kashif M.; Madsen, Jan; Shafique, Mohammad

    2005-01-01

    The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration with the......The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration...... with the existing embedded system design methodologies is possible. In this paper, we present a MEMS design methodology that uses VHDL-AMS based system-level model of a MEMS device as a starting point and combines the top-down and bottom-up design approaches for design, verification, and optimization...

  13. A Manganin Thin Film Ultra-High Pressure Sensor for Microscale Detonation Pressure Measurement

    Directory of Open Access Journals (Sweden)

    Guodong Zhang

    2018-03-01

    Full Text Available With the development of energetic materials (EMs and microelectromechanical systems (MEMS initiating explosive devices, the measurement of detonation pressure generated by EMs in the microscale has become a pressing need. This paper develops a manganin thin film ultra-high pressure sensor based on MEMS technology for measuring the output pressure from micro-detonator. A reliable coefficient is proposed for designing the sensor’s sensitive element better. The sensor employs sandwich structure: the substrate uses a 0.5 mm thick alumina ceramic, the manganin sensitive element with a size of 0.2 mm × 0.1 mm × 2 μm and copper electrodes of 2 μm thick are sputtered sequentially on the substrate, and a 25 μm thick insulating layer of polyimide is wrapped on the sensitive element. The static test shows that the piezoresistive coefficient of manganin thin film is 0.0125 GPa−1. The dynamic experiment indicates that the detonation pressure of micro-detonator is 12.66 GPa, and the response time of the sensor is 37 ns. In a word, the sensor developed in this study is suitable for measuring ultra-high pressure in microscale and has a shorter response time than that of foil-like manganin gauges. Simultaneously, this study could be beneficial to research on ultra-high-pressure sensors with smaller size.

  14. The Sandia MEMS passive shock sensor : FY07 maturation activities.

    Energy Technology Data Exchange (ETDEWEB)

    Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

    2008-08-01

    This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

  15. Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

    Directory of Open Access Journals (Sweden)

    Sarah Zerbini

    2007-09-01

    Full Text Available The effect of accidental drops on MEMS sensors are examined within the frame-work of a multi-scale finite element approach. With specific reference to a polysilicon MEMSaccelerometer supported by a naked die, the analysis is decoupled into macro-scale (at dielength-scale and meso-scale (at MEMS length-scale simulations, accounting for the verysmall inertial contribution of the sensor to the overall dynamics of the device. Macro-scaleanalyses are adopted to get insights into the link between shock waves caused by the impactagainst a target surface and propagating inside the die, and the displacement/acceleration his-tories at the MEMS anchor points. Meso-scale analyses are adopted to detect the most stresseddetails of the sensor and to assess whether the impact can lead to possible localized failures.Numerical results show that the acceleration at sensor anchors cannot be considered an ob-jective indicator for drop severity. Instead, accurate analyses at sensor level are necessary toestablish how MEMS can fail because of drops.

  16. CMOS MEMS Fabrication Technologies and Devices

    Directory of Open Access Journals (Sweden)

    Hongwei Qu

    2016-01-01

    Full Text Available This paper reviews CMOS (complementary metal-oxide-semiconductor MEMS (micro-electro-mechanical systems fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator CMOS MEMS are introduced separately. Introduction of associated devices follows the description of the respective CMOS MEMS technologies. Due to the vast array of CMOS MEMS devices, this review focuses only on the most typical MEMS sensors and actuators including pressure sensors, inertial sensors, frequency reference devices and actuators utilizing different physics effects and the fabrication processes introduced. Moreover, the incorporation of MEMS and CMOS is limited to monolithic integration, meaning wafer-bonding-based stacking and other integration approaches, despite their advantages, are excluded from the discussion. Both competitive industrial products and state-of-the-art research results on CMOS MEMS are covered.

  17. A MEMS sensor for microscale force measurements

    International Nuclear Information System (INIS)

    Majcherek, S; Aman, A; Fochtmann, J

    2016-01-01

    This paper describes the development and testing of a new MEMS-based sensor device for microscale contact force measurements. A special MEMS cell was developed to reach higher lateral resolution than common steel-based load cells with foil-type strain gauges as mechanical-electrical converters. The design provided more than one normal force measurement point with spatial resolution in submillimeter range. Specific geometric adaption of the MEMS-device allowed adjustability of its measurement range between 0.5 and 5 N. The thin film nickel-chromium piezo resistors were used to achieve a mechanical-electrical conversion. The production process was realized by established silicon processing technologies such as deep reactive ion etching and vapor deposition (sputtering). The sensor was tested in two steps. Firstly, the sensor characteristics were carried out by application of defined loads at the measurement points by a push-pull tester. As a result, the sensor showed linear behavior. A measurement system analysis (MSA1) was performed to define the reliability of the measurement system. The measured force values had the maximal relative deviation of 1% to average value of 1.97 N. Secondly, the sensor was tested under near-industrial conditions. In this context, the thermal induced relaxation behavior of the electrical connector contact springs was investigated. The handling of emerging problems during the characterization process of the sensor is also described. (paper)

  18. MEMS Bragg grating force sensor

    DEFF Research Database (Denmark)

    Reck, Kasper; Thomsen, Erik Vilain; Hansen, Ole

    2011-01-01

    We present modeling, design, fabrication and characterization of a new type of all-optical frequency modulated MEMS force sensor based on a mechanically amplified double clamped waveguide beam structure with integrated Bragg grating. The sensor is ideally suited for force measurements in harsh...... environments and for remote and distributed sensing and has a measured sensitivity of -14 nm/N, which is several times higher than what is obtained in conventional fiber Bragg grating force sensors. © 2011 Optical Society of America....

  19. A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection

    Science.gov (United States)

    2015-09-01

    ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for...ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for Chemical...TITLE AND SUBTITLE A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection 5a. CONTRACT NUMBER 5b. GRANT NUMBER

  20. Flexible MEMS: A novel technology to fabricate flexible sensors and electronics

    Science.gov (United States)

    Tu, Hongen

    This dissertation presents the design and fabrication techniques used to fabricate flexible MEMS (Micro Electro Mechanical Systems) devices. MEMS devices and CMOS(Complementary Metal-Oxide-Semiconductor) circuits are traditionally fabricated on rigid substrates with inorganic semiconductor materials such as Silicon. However, it is highly desirable that functional elements like sensors, actuators or micro fluidic components to be fabricated on flexible substrates for a wide variety of applications. Due to the fact that flexible substrate is temperature sensitive, typically only low temperature materials, such as polymers, metals, and organic semiconductor materials, can be directly fabricated on flexible substrates. A novel technology based on XeF2(xenon difluoride) isotropic silicon etching and parylene conformal coating, which is able to monolithically incorporate high temperature materials and fluidic channels, was developed at Wayne State University. The technology was first implemented in the development of out-of-plane parylene microneedle arrays that can be individually addressed by integrated flexible micro-channels. These devices enable the delivery of chemicals with controlled temporal and spatial patterns and allow us to study neurotransmitter-based retinal prosthesis. The technology was further explored by adopting the conventional SOI-CMOS processes. High performance and high density CMOS circuits can be first fabricated on SOI wafers, and then be integrated into flexible substrates. Flexible p-channel MOSFETs (Metal-Oxide-Semiconductor Field-Effect-Transistors) were successfully integrated and tested. Integration of pressure sensors and flow sensors based on single crystal silicon has also been demonstrated. A novel smart yarn technology that enables the invisible integration of sensors and electronics into fabrics has been developed. The most significant advantage of this technology is its post-MEMS and post-CMOS compatibility. Various high

  1. Improving Planetary Rover Attitude Estimation via MEMS Sensor Characterization

    Science.gov (United States)

    Hidalgo, Javier; Poulakis, Pantelis; Köhler, Johan; Del-Cerro, Jaime; Barrientos, Antonio

    2012-01-01

    Micro Electro-Mechanical Systems (MEMS) are currently being considered in the space sector due to its suitable level of performance for spacecrafts in terms of mechanical robustness with low power consumption, small mass and size, and significant advantage in system design and accommodation. However, there is still a lack of understanding regarding the performance and testing of these new sensors, especially in planetary robotics. This paper presents what is missing in the field: a complete methodology regarding the characterization and modeling of MEMS sensors with direct application. A reproducible and complete approach including all the intermediate steps, tools and laboratory equipment is described. The process of sensor error characterization and modeling through to the final integration in the sensor fusion scheme is explained with detail. Although the concept of fusion is relatively easy to comprehend, carefully characterizing and filtering sensor information is not an easy task and is essential for good performance. The strength of the approach has been verified with representative tests of novel high-grade MEMS inertia sensors and exemplary planetary rover platforms with promising results. PMID:22438761

  2. High Temperature Dynamic Pressure Measurements Using Silicon Carbide Pressure Sensors

    Science.gov (United States)

    Okojie, Robert S.; Meredith, Roger D.; Chang, Clarence T.; Savrun, Ender

    2014-01-01

    Un-cooled, MEMS-based silicon carbide (SiC) static pressure sensors were used for the first time to measure pressure perturbations at temperatures as high as 600 C during laboratory characterization, and subsequently evaluated in a combustor rig operated under various engine conditions to extract the frequencies that are associated with thermoacoustic instabilities. One SiC sensor was placed directly in the flow stream of the combustor rig while a benchmark commercial water-cooled piezoceramic dynamic pressure transducer was co-located axially but kept some distance away from the hot flow stream. In the combustor rig test, the SiC sensor detected thermoacoustic instabilities across a range of engine operating conditions, amplitude magnitude as low as 0.5 psi at 585 C, in good agreement with the benchmark piezoceramic sensor. The SiC sensor experienced low signal to noise ratio at higher temperature, primarily due to the fact that it was a static sensor with low sensitivity.

  3. Development of clinically relevant implantable pressure sensors: perspectives and challenges.

    Science.gov (United States)

    Clausen, Ingelin; Glott, Thomas

    2014-09-22

    This review describes different aspects to consider when developing implantable pressure sensor systems. Measurement of pressure is in general highly important in clinical practice and medical research. Due to the small size, light weight and low energy consumption Micro Electro Mechanical Systems (MEMS) technology represents new possibilities for monitoring of physiological parameters inside the human body. Development of clinical relevant sensors requires close collaboration between technological experts and medical clinicians.  Site of operation, size restrictions, patient safety, and required measurement range and resolution, are only some conditions that must be taken into account. An implantable device has to operate under very hostile conditions. Long-term in vivo pressure measurements are particularly demanding because the pressure sensitive part of the sensor must be in direct or indirect physical contact with the medium for which we want to detect the pressure. New sensor packaging concepts are demanded and must be developed through combined effort between scientists in MEMS technology, material science, and biology. Before launching a new medical device on the market, clinical studies must be performed. Regulatory documents and international standards set the premises for how such studies shall be conducted and reported.

  4. An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.

    Science.gov (United States)

    Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin

    2016-11-04

    An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA-0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C-1.79 mV/°C in the range 20-300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(V excit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min) -0.1 in the tested range of 0-4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries.

  5. High Accuracy, Miniature Pressure Sensor for Very High Temperatures, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — SiWave proposes to develop a compact, low-cost MEMS-based pressure sensor for very high temperatures and low pressures in hypersonic wind tunnels. Most currently...

  6. Reliable before-fabrication forecasting of normal and touch mode MEMS capacitive pressure sensor: modeling and simulation

    Science.gov (United States)

    Jindal, Sumit Kumar; Mahajan, Ankush; Raghuwanshi, Sanjeev Kumar

    2017-10-01

    An analytical model and numerical simulation for the performance of MEMS capacitive pressure sensors in both normal and touch modes is required for expected behavior of the sensor prior to their fabrication. Obtaining such information should be based on a complete analysis of performance parameters such as deflection of diaphragm, change of capacitance when the diaphragm deflects, and sensitivity of the sensor. In the literature, limited work has been carried out on the above-stated issue; moreover, due to approximation factors of polynomials, a tolerance error cannot be overseen. Reliable before-fabrication forecasting requires exact mathematical calculation of the parameters involved. A second-order polynomial equation is calculated mathematically for key performance parameters of both modes. This eliminates the approximation factor, and an exact result can be studied, maintaining high accuracy. The elimination of approximation factors and an approach of exact results are based on a new design parameter (δ) that we propose. The design parameter gives an initial hint to the designers on how the sensor will behave once it is fabricated. The complete work is aided by extensive mathematical detailing of all the parameters involved. Next, we verified our claims using MATLAB® simulation. Since MATLAB® effectively provides the simulation theory for the design approach, more complicated finite element method is not used.

  7. Wireless MEMs BioSensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

  8. MEMS Sensors and Actuators Laboratory (MSAL)

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS Sensors and Actuators Laboratory (MSAL) in the A.J. Clark School of Engineering at the University of Maryland (UMD) was established in January 2000. Our lab...

  9. Pressure-Sensor Assembly Technique

    Science.gov (United States)

    Pruzan, Daniel A.

    2003-01-01

    Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this

  10. Laser Power Measurement Using Commercial MEMS Pressure Sensor along with PSoC Embedded Read-out

    Directory of Open Access Journals (Sweden)

    J. Jayapandian

    2011-06-01

    Full Text Available Solid-state, gas, semiconductor and other types of lasers are extensively employed in industry for producing laser beams used in such wide ranging fields as machining, medicine and communications. In such applications, it is necessary to be able to accurately measure the power of the laser beam that is emitted by the laser. This paper describes a novel design technique which uses the diaphragm of a commercial MEMS pressure sensor as a target surface on which laser beam impinge, transfer heat and causes change in piezo resistance. The measured change in resistance was proportional to the intensity of laser beam in the range of 0 to 300 mW. The ratio metric embedded read-out design using a single chip programmable system on chip (PSoC has been used to acquire the resistance.

  11. Development of A MEMS Based Manometric Catheter for Diagnosis of Functional Swallowing Disorders

    International Nuclear Information System (INIS)

    Hsu, H Y; Hariz, A J; Omari, T; Teng, M F; Sii, D; Chan, S; Lau, L; Tan, S; Lin, G; Haskard, M; Mulcahy, D; Bakewell, M

    2006-01-01

    Silicon pressure sensors based on micro-electro-mechanical-systems (MEMS) technologies are gaining popularity for applications in bio-medical devices. In this study, a silicon piezo-resistive pressure sensor die is used in a feasibility study of developing a manometric catheter for functional swallowing disorders diagnosis. The function of a manometric catheter is to measure the peak and intrabolus pressures along the esophageal segment during the swallowing action. Previous manometric catheters used the water perfusion technique to measure the pressure changes. This type of catheter is reusable, large in size and the pressure reading is recorded by an external transducer. Current manometric catheters use a solid state pressure sensor on the catheter itself to measure the pressure changes. This type of catheter reduces the discomfort to the patient but it is reusable and is very expensive. We carried out several studies and experiments on the MEMS-based pressure sensor die, and the results show the MEMS-based pressure sensors have a good stability and a good linearity output response, together with the advantage of low excitation biasing voltage and extremely small size. The MEMS-based sensor is the best device to use in the new generation of manometric catheters. The concept of the new MEMS-based manometric catheter consists of a pressure sensing sensor, supporting ring, the catheter tube and a data connector. Laboratory testing shows that the new calibrated catheter is capable of measuring pressure in the range from 0 to 100mmHg and maintaining stable condition on the zero baseline setting when no pressure is applied. In-vivo tests are carried out to compare the new MEMS based catheter with the current version of catheters used in the hospital

  12. MEMS capacitive force sensors for cellular and flight biomechanics

    International Nuclear Information System (INIS)

    Sun Yu; Nelson, Bradley J

    2007-01-01

    Microelectromechanical systems (MEMS) are playing increasingly important roles in facilitating biological studies. They are capable of providing not only qualitative but also quantitative information on the cellular, sub-cellular and organism levels, which is instrumental to understanding the fundamental elements of biological systems. MEMS force sensors with their high bandwidth and high sensitivity combined with their small size, in particular, have found a role in this domain, because of the importance of quantifying forces and their effect on the function and morphology of many biological structures. This paper describes our research in the development of MEMS capacitive force sensors that have already demonstrated their effectiveness in the areas of cell mechanics and Drosophila flight dynamics studies. (review article)

  13. Integrated Electromechanical Transduction Schemes for Polymer MEMS Sensors

    Directory of Open Access Journals (Sweden)

    Damien Thuau

    2018-04-01

    Full Text Available Polymer Micro ElectroMechanical Systems (MEMS have the potential to constitute a powerful alternative to silicon-based MEMS devices for sensing applications. Although the use of commercial photoresists as structural material in polymer MEMS has been widely reported, the integration of functional polymer materials as electromechanical transducers has not yet received the same amount of interest. In this context, we report on the design and fabrication of different electromechanical schemes based on polymeric materials ensuring different transduction functions. Piezoresistive transduction made of carbon nanotube-based nanocomposites with a gauge factor of 200 was embedded within U-shaped polymeric cantilevers operating either in static or dynamic modes. Flexible resonators with integrated piezoelectric transduction were also realized and used as efficient viscosity sensors. Finally, piezoelectric-based organic field effect transistor (OFET electromechanical transduction exhibiting a record sensitivity of over 600 was integrated into polymer cantilevers and used as highly sensitive strain and humidity sensors. Such advances in integrated electromechanical transduction schemes should favor the development of novel all-polymer MEMS devices for flexible and wearable applications in the future.

  14. Miniaturised Prandtl tube with integrated pressure sensors for micro-thruster plume characterisation

    NARCIS (Netherlands)

    Dijkstra, Marcel; Ma, Kechun; de Boer, Meint J.; Groenesteijn, Jarno; Lötters, Joost Conrad; Wiegerink, Remco J.

    2014-01-01

    A miniaturised Prandtl-tube sensor incorporating a 6 mm long 40 μm diameter microchannel with integrated pressure sensors has been realised. The sensor has been designed for the characterisation of rarefied plume flow from a MEMS-based monopropellant propulsion system for high-accuracy attitude

  15. Design of a Bionic Cilia MEMS three-dimensional vibration sensor

    International Nuclear Information System (INIS)

    Li Zhen; Zhang Guojun; Xue Chenyang; Wu Shujuan

    2013-01-01

    A biomimetic three-dimensional piezoresistive vibration sensor based on MEMS technology is reported. The mechanical properties of the sensor are analyzed and the static and dynamic characteristics of the sensor are simulated by ANSYS Workbench 12.0. The structure was made by MEMS processes including lithography, ion implantation, PECVD, etching, etc. Finally, the sensor is tested by using a TV5220 sensor auto calibration system. The results show that the lowest sensitivity of the sensor is 394.7 μV/g and can reach up to 460.2 μV/g, and the dimension coupling is less than 0.6152%, and the working frequency range is 0–1000 Hz. (semiconductor devices)

  16. An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications †

    Science.gov (United States)

    Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin

    2016-01-01

    An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA–0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C–1.79 mV/°C in the range 20–300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)−0.1 in the tested range of 0–4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries. PMID:27827904

  17. Evaluation of MEMS-Based Wireless Accelerometer Sensors in Detecting Gear Tooth Faults in Helicopter Transmissions

    Science.gov (United States)

    Lewicki, David George; Lambert, Nicholas A.; Wagoner, Robert S.

    2015-01-01

    The diagnostics capability of micro-electro-mechanical systems (MEMS) based rotating accelerometer sensors in detecting gear tooth crack failures in helicopter main-rotor transmissions was evaluated. MEMS sensors were installed on a pre-notched OH-58C spiral-bevel pinion gear. Endurance tests were performed and the gear was run to tooth fracture failure. Results from the MEMS sensor were compared to conventional accelerometers mounted on the transmission housing. Most of the four stationary accelerometers mounted on the gear box housing and most of the CI's used gave indications of failure at the end of the test. The MEMS system performed well and lasted the entire test. All MEMS accelerometers gave an indication of failure at the end of the test. The MEMS systems performed as well, if not better, than the stationary accelerometers mounted on the gear box housing with regards to gear tooth fault detection. For both the MEMS sensors and stationary sensors, the fault detection time was not much sooner than the actual tooth fracture time. The MEMS sensor spectrum data showed large first order shaft frequency sidebands due to the measurement rotating frame of reference. The method of constructing a pseudo tach signal from periodic characteristics of the vibration data was successful in deriving a TSA signal without an actual tach and proved as an effective way to improve fault detection for the MEMS.

  18. A MEMS AC current sensor for residential and commercial electricity end-use monitoring

    International Nuclear Information System (INIS)

    Leland, E S; Wright, P K; White, R M

    2009-01-01

    This paper presents a novel prototype MEMS sensor for alternating current designed for monitoring electricity end-use in residential and commercial environments. This new current sensor design is comprised of a piezoelectric MEMS cantilever with a permanent magnet mounted on the cantilever's free end. When placed near a wire carrying AC current, the magnet is driven sinusoidally, producing a voltage in the cantilever proportional to the current being measured. Analytical models were developed to predict the applicable magnetic forces and piezoelectric voltage output in order to guide the design of a sensor prototype. This paper also details the fabrication process for this sensor design. Released piezoelectric MEMS cantilevers have been fabricated using a four-mask process and aluminum nitride as the active piezoelectric material. Dispenser-printed microscale composite permanent magnets have been integrated, resulting in the first MEMS-scale prototypes of this current sensor design

  19. MEMS Sensor Arrays for Cryogenic Propellant Applications, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — KWJ offers this proposal for a low-power, practical and versatile MEMS sensor platform for NASA applications. The proposed nano-sensor platform is ultra-low power...

  20. Safety and feasibility of pulmonary artery pressure-guided heart failure therapy: rationale and design of the prospective CardioMEMS Monitoring Study for Heart Failure (MEMS-HF).

    Science.gov (United States)

    Angermann, Christiane E; Assmus, Birgit; Anker, Stefan D; Brachmann, Johannes; Ertl, Georg; Köhler, Friedrich; Rosenkranz, Stephan; Tschöpe, Carsten; Adamson, Philip B; Böhm, Michael

    2018-05-19

    Wireless monitoring of pulmonary artery (PA) pressures with the CardioMEMS HF™ system is indicated in patients with New York Heart Association (NYHA) class III heart failure (HF). Randomized and observational trials have shown a reduction in HF-related hospitalizations and improved quality of life in patients using this device in the United States. MEMS-HF is a prospective, non-randomized, open-label, multicenter study to characterize safety and feasibility of using remote PA pressure monitoring in a real-world setting in Germany, The Netherlands and Ireland. After informed consent, adult patients with NYHA class III HF and a recent HF-related hospitalization are evaluated for suitability for permanent implantation of a CardioMEMS™ sensor. Participation in MEMS-HF is open to qualifying subjects regardless of left ventricular ejection fraction (LVEF). Patients with reduced ejection fraction must be on stable guideline-directed pharmacotherapy as tolerated. The study will enroll 230 patients in approximately 35 centers. Expected duration is 36 months (24-month enrolment plus ≥ 12-month follow-up). Primary endpoints are freedom from device/system-related complications and freedom from pressure sensor failure at 12-month post-implant. Secondary endpoints include the annualized rate of HF-related hospitalization at 12 months versus the rate over the 12 months preceding implant, and health-related quality of life. Endpoints will be evaluated using data obtained after each subject's 12-month visit. The MEMS-HF study will provide robust evidence on the clinical safety and feasibility of implementing haemodynamic monitoring as a novel disease management tool in routine out-patient care in selected European healthcare systems. ClinicalTrials.gov; NCT02693691.

  1. A Study on the Performance of Low Cost MEMS Sensors in Strong Motion Studies

    Science.gov (United States)

    Tanırcan, Gulum; Alçık, Hakan; Kaya, Yavuz; Beyen, Kemal

    2017-04-01

    Recent advances in sensors have helped the growth of local networks. In recent years, many Micro Electro Mechanical System (MEMS)-based accelerometers have been successfully used in seismology and earthquake engineering projects. This is basically due to the increased precision obtained in these downsized instruments. Moreover, they are cheaper alternatives to force-balance type accelerometers. In Turkey, though MEMS-based accelerometers have been used in various individual applications such as magnitude and location determination of earthquakes, structural health monitoring, earthquake early warning systems, MEMS-based strong motion networks are not currently available in other populated areas of the country. Motivation of this study comes from the fact that, if MEMS sensors are qualified to record strong motion parameters of large earthquakes, a dense network can be formed in an affordable price at highly populated areas. The goals of this study are 1) to test the performance of MEMS sensors, which are available in the inventory of the Institute through shake table tests, and 2) to setup a small scale network for observing online data transfer speed to a trusted in-house routine. In order to evaluate the suitability of sensors in strong motion related studies, MEMS sensors and a reference sensor are tested under excitations of sweeping waves as well as scaled earthquake recordings. Amplitude response and correlation coefficients versus frequencies are compared. As for earthquake recordings, comparisons are carried out in terms of strong motion(SM) parameters (PGA, PGV, AI, CAV) and elastic response of structures (Sa). Furthermore, this paper also focuses on sensitivity and selectivity for sensor performances in time-frequency domain to compare different sensing characteristics and analyzes the basic strong motion parameters that influence the design majors. Results show that the cheapest MEMS sensors under investigation are able to record the mid

  2. Optical fibre angle sensor used in MEMS

    International Nuclear Information System (INIS)

    Golebiowski, J; Milcarz, Sz; Rybak, M

    2014-01-01

    There is a need for displacement and angle measurements in many movable MEMS structures. The use of fibre optical sensors helps to measure micrometre displacements and small rotation angles. Advantages of this type of transducers are their simple design, high precision of processing, low costs and ability of a non-contact measurement. The study shows an analysis of a fibre-optic intensity sensor used for MEMS movable structure rotation angle measurement. An intensity of the light in the photodetector is basically dependent on a distance between a reflecting surface and a head surface of the fibre transmitting arm, and the deflection angle. Experimental tests were made for PMMA 980/1000 plastic fibres, Θ NA =33°. The study shows both analytical and practical results. It proves that calculated and experimental characteristics for the analysed transducers are similar.

  3. Development of a wireless MEMS multifunction sensor system and field demonstration of embedded sensors for monitoring concrete pavements, volume II

    Science.gov (United States)

    2016-08-01

    This two-pronged study evaluated the performance of commercial off-the-shelf (COTS) micro-electromechanical sensors and systems (MEMS) embedded in concrete pavement (Final Report Volume I) and developed a wireless MEMS multifunctional sensor system f...

  4. A low-noise MEMS accelerometer for unattended ground sensor applications

    Science.gov (United States)

    Speller, Kevin E.; Yu, Duli

    2004-09-01

    A low-noise micro-machined servo accelerometer has been developed for use in Unattended Ground Sensors (UGS). Compared to conventional coil-and-magnet based velocity transducers, this Micro-Electro-Mechanical System (MEMS) accelerometer offers several key benefits for battlefield monitoring. Many UGS require a compass to determine deployment orientation with respect to magnetic North. This orientation information is critical for determining the bearing of incoming signals. Conventional sensors with sensing technology based on a permanent magnet can cause interference with a compass when used in close proximity. This problem is solved with a MEMS accelerometer which does not require any magnetic materials. Frequency information below 10 Hz is valuable for identification of signal sources. Conventional seismometers used in UGS are typically limited in frequency response from 20 to 200 Hz. The MEMS accelerometer has a flat frequency response from DC to 5 kHz. The wider spectrum of signals received improves detection, classification and monitoring on the battlefield. The DC-coupled output of the MEMS accelerometer also has the added benefit of providing tilt orientation data for the deployed UGS. Other performance parameters of the MEMS accelerometer that are important to UGS such as size, weight, shock survivability, phase response, distortion, and cross-axis rejection will be discussed. Additionally, field test data from human footsteps recorded with the MEMS accelerometer will be presented.

  5. Scalable Pressure Sensor Based on Electrothermally Operated Resonator

    KAUST Repository

    Hajjaj, Amal Z.; Hafiz, Md Abdullah Al; Alcheikh, Nouha; Younis, Mohammad I.

    2017-01-01

    We experimentally demonstrate a new pressure sensor that offers the flexibility of being scalable to small sizes up to the nano regime. Unlike conventional pressure sensors that rely on large diaphragms and big-surface structures, the principle of operation here relies on convective cooling of the air surrounding an electrothermally heated resonant structure, which can be a beam or a bridge. This concept is demonstrated using an electrothermally tuned and electrostatically driven MEMS resonator, which is designed to be deliberately curved. We show that the variation of pressure can be tracked accurately by monitoring the change in the resonance frequency of the resonator at a constant electrothermal voltage. We show that the range of the sensed pressure and the sensitivity of detection are controllable by the amount of the applied electrothermal voltage. Theoretically, we verify the device concept using a multi-physics nonlinear finite element model. The proposed pressure sensor is simple in principle and design and offers the possibility of further miniaturization to the nanoscale.

  6. Scalable Pressure Sensor Based on Electrothermally Operated Resonator

    KAUST Repository

    Hajjaj, Amal Z.

    2017-11-03

    We experimentally demonstrate a new pressure sensor that offers the flexibility of being scalable to small sizes up to the nano regime. Unlike conventional pressure sensors that rely on large diaphragms and big-surface structures, the principle of operation here relies on convective cooling of the air surrounding an electrothermally heated resonant structure, which can be a beam or a bridge. This concept is demonstrated using an electrothermally tuned and electrostatically driven MEMS resonator, which is designed to be deliberately curved. We show that the variation of pressure can be tracked accurately by monitoring the change in the resonance frequency of the resonator at a constant electrothermal voltage. We show that the range of the sensed pressure and the sensitivity of detection are controllable by the amount of the applied electrothermal voltage. Theoretically, we verify the device concept using a multi-physics nonlinear finite element model. The proposed pressure sensor is simple in principle and design and offers the possibility of further miniaturization to the nanoscale.

  7. New Trends on MEMS Sensor Technology for Harsh Environment Applications

    Directory of Open Access Journals (Sweden)

    Patricia M. NIEVA

    2007-10-01

    Full Text Available MEMS and NEMS sensor systems that can operate in the presence of high temperatures, corrosive media, and/or high radiation hold great promise for harsh environment applications. They would reduce weight, improve machine reliability and reduce cost in strategic market sectors such as automotive, avionics, oil well logging, and nuclear power. This paper presents a review of the recent advances in harsh-environment MEMS and NEMS sensors focusing on materials and devices. Special emphasis is put on high-temperature operation. Wide-bandgap semiconductor materials for high temperature applications are discussed from the device point of view. Micro-opto mechanical systems (MOEMS are presented as a new trend for high temperature applications. As an example of a harsh environment MOEMS sensor, a vibration sensor is presented.

  8. Design and Optimization of Dual Optical Fiber MEMS Pressure Sensor For Biomedical Applications

    International Nuclear Information System (INIS)

    Dagang, Guo; Po, Samuel Ng Choon; Hock, Francis Tay Eng; Rongming, Lin

    2006-01-01

    A novel Single Deeply Corrugated Diaphragm (SDCD) based dual optical fiber Fabry-Perot pressure sensor for blood pressure measurement is proposed. Both mechanical and optical simulations are performed to demonstrate the feasibility and superior performance of the proposed sensor. Result shows that less than 2% nonlinearity can be achieved for the proposed sensor using optimal Fabry-Perot microcavity. Also, the fabrication process of the proposed sensor is given, instead of complicated fusion bonding process, only bulk and surface micromachining techniques are required which facilitate the mass production of such biocompatible and disposable pressure sensors

  9. Sensors and Micromachined Devices for the Automotive and New Markets: The Delphi Delco Electronics MEMS Story.

    Science.gov (United States)

    Logsdon, James

    2002-03-01

    This presentation will provide a brief history of the development of MEMS products and technology, beginning with the manifold absolute pressure sensor in the late seventies through the current variety of Delphi Delco Electronics sensors available today. The technology development of micromachining from uncompensated P plus etch stops to deep reactive ion etching and the technology development of wafer level packaging from electrostatic bonding to glass frit sealing and silicon to silicon direct bonding will be reviewed.

  10. Wireless Capacitive Pressure Sensor With Directional RF Chip Antenna for High Temperature Environments

    Science.gov (United States)

    Scardelletti, M. C.; Jordan, J. L.; Ponchak, G. E.; Zorman, C. A.

    2015-01-01

    This paper presents the design, fabrication and characterization of a wireless capacitive pressure sensor with directional RF chip antenna that is envisioned for the health monitoring of aircraft engines operating in harsh environments. The sensing system is characterized from room temperature (25 C) to 300 C for a pressure range from 0 to 100 psi. The wireless pressure system consists of a Clapp-type oscillator design with a capacitive MEMS pressure sensor located in the LC-tank circuit of the oscillator. Therefore, as the pressure of the aircraft engine changes, so does the output resonant frequency of the sensing system. A chip antenna is integrated to transmit the system output to a receive antenna 10 m away.The design frequency of the wireless pressure sensor is 127 MHz and a 2 increase in resonant frequency over the temperature range of 25 to 300 C from 0 to 100 psi is observed. The phase noise is less than minus 30 dBcHz at the 1 kHz offset and decreases to less than minus 80 dBcHz at 10 kHz over the entire temperature range. The RF radiation patterns for two cuts of the wireless system have been measured and show that the system is highly directional and the MEMS pressure sensor is extremely linear from 0 to 100 psi.

  11. Simple fall criteria for MEMS sensors: Data analysis and sensor concept

    KAUST Repository

    Ibrahim, Alwathiqbellah; Younis, Mohammad I.

    2014-01-01

    This paper presents a new and simple fall detection concept based on detailed experimental data of human falling and the activities of daily living (ADLs). Establishing appropriate fall algorithms compatible with MEMS sensors requires detailed data on falls and ADLs that indicate clearly the variations of the kinematics at the possible sensor node location on the human body, such as hip, head, and chest. Currently, there is a lack of data on the exact direction and magnitude of each acceleration component associated with these node locations. This is crucial for MEMS structures, which have inertia elements very close to the substrate and are capacitively biased, and hence, are very sensitive to the direction of motion whether it is toward or away from the substrate. This work presents detailed data of the acceleration components on various locations on the human body during various kinds of falls and ADLs. A two-degree-of-freedom model is used to help interpret the experimental data. An algorithm for fall detection based on MEMS switches is then established. A new sensing concept based on the algorithm is proposed. The concept is based on employing several inertia sensors, which are triggered simultaneously, as electrical switches connected in series, upon receiving a true fall signal. In the case of everyday life activities, some or no switches will be triggered resulting in an open circuit configuration, thereby preventing false positive. Lumped-parameter model is presented for the device and preliminary simulation results are presented illustrating the new device concept. © 2014 by the authors; licensee MDPI, Basel, Switzerland.

  12. Simple fall criteria for MEMS sensors: Data analysis and sensor concept

    KAUST Repository

    Ibrahim, Alwathiqbellah

    2014-07-08

    This paper presents a new and simple fall detection concept based on detailed experimental data of human falling and the activities of daily living (ADLs). Establishing appropriate fall algorithms compatible with MEMS sensors requires detailed data on falls and ADLs that indicate clearly the variations of the kinematics at the possible sensor node location on the human body, such as hip, head, and chest. Currently, there is a lack of data on the exact direction and magnitude of each acceleration component associated with these node locations. This is crucial for MEMS structures, which have inertia elements very close to the substrate and are capacitively biased, and hence, are very sensitive to the direction of motion whether it is toward or away from the substrate. This work presents detailed data of the acceleration components on various locations on the human body during various kinds of falls and ADLs. A two-degree-of-freedom model is used to help interpret the experimental data. An algorithm for fall detection based on MEMS switches is then established. A new sensing concept based on the algorithm is proposed. The concept is based on employing several inertia sensors, which are triggered simultaneously, as electrical switches connected in series, upon receiving a true fall signal. In the case of everyday life activities, some or no switches will be triggered resulting in an open circuit configuration, thereby preventing false positive. Lumped-parameter model is presented for the device and preliminary simulation results are presented illustrating the new device concept. © 2014 by the authors; licensee MDPI, Basel, Switzerland.

  13. Stylus type MEMS texture sensor covered with corrugated diaphragm

    Science.gov (United States)

    Tsukamoto, Takashiro; Asao, Hideaki; Tanaka, Shuji

    2017-09-01

    In this paper, a stylus type MEMS texture sensor covered with a corrugated palylene diaphragm, which prevent debris from jamming into the sensor without significant degradation of sensitivity and bandwidth, was reported. A new fabrication process using a lost-foil method to make the corrugated diaphragm on a 3-axis piezoresistive force sensor at wafer level has been developed. The texture sensor could detect the surface microstructure as small as about 10 \

  14. All-Optical Frequency Modulated High Pressure MEMS Sensor for Remote and Distributed Sensing

    DEFF Research Database (Denmark)

    Reck, Kasper; Thomsen, Erik Vilain; Hansen, Ole

    2011-01-01

    We present the design, fabrication and characterization of a new all-optical frequency modulated pressure sensor. Using the tangential strain in a circular membrane, a waveguide with an integrated nanoscale Bragg grating is strained longitudinally proportional to the applied pressure causing...... a shift in the Bragg wavelength. The simple and robust design combined with the small chip area of 1 × 1.8 mm2 makes the sensor ideally suited for remote and distributed sensing in harsh environments and where miniaturized sensors are required. The sensor is designed for high pressure applications up...

  15. A Quad-Cantilevered Plate micro-sensor for intracranial pressure measurement.

    Science.gov (United States)

    Lalkov, Vasko; Qasaimeh, Mohammad A

    2017-07-01

    This paper proposes a new design for pressure-sensing micro-plate platform to bring higher sensitivity to a pressure sensor based on piezoresistive MEMS sensing mechanism. The proposed design is composed of a suspended plate having four stepped cantilever beams connected to its corners, and thus defined as Quad-Cantilevered Plate (QCP). Finite element analysis was performed to determine the optimal design for sensitivity and structural stability under a range of applied forces. Furthermore, a piezoresistive analysis was performed to calculate sensor sensitivity. Both the maximum stress and the change in resistance of the piezoresistor associated with the QCP were found to be higher compared to previously published designs, and linearly related to the applied pressure as desired. Therefore, the QCP demonstrates greater sensitivity, and could be potentially used as an efficient pressure sensor for intracranial pressure measurement.

  16. Minimizing 1/f Noise in Magnetic Sensors with a MEMS Flux Concentrator

    National Research Council Canada - National Science Library

    Edelstein, A. S; Fischer, Greg; Pulskamp, Jeff; Pedersen, Michael; Bernard, William; Cheng, Shu F

    2004-01-01

    .... This shift is accomplished by modulating the magnetic field before it reaches the sensor. In our device, the magnetic sensor, a GMR sensor, is placed between flux concentrators that have been deposited on MEMS flaps...

  17. Design and characterization of in-plane MEMS yaw rate sensor

    Indian Academy of Sciences (India)

    In this paper, we present the design and characterization of a vibratory yaw rate MEMS sensor that uses in-plane motion for both actuation and sensing. The design criterion for the rate sensor is based on a high sensitivity and low bandwidth. The required sensitivity of the yaw rate sensor is attained by using the inplane ...

  18. Monitoring System for Slope Stability under Rainfall by using MEMS Acceleration Sensor IC tags

    International Nuclear Information System (INIS)

    Murakami, S; Dairaku, A; Komine, H; Saito, O; Sakai, N; Isizawa, T; Maruyama, I

    2013-01-01

    Real-time warning system for slope failure under rainfall is available to disaster prevention and mitigation. Monitoring of multi-point and wireless measurements is effective because it is difficult to conclude the most dangerous part in a slope. The purpose of this study is to propose a method of monitoring system with multi-point and wireless measurements for a slope stability using MEMS acceleration sensor IC tags. MEMS acceleration sensor IC tag is an acceleration sensor microminiaturized by a technology of Micro Electro Mechanical Systems on board IC tag. Especially, low cost of the sensor will yield to the realization of the system. In order to investigate the applicability of the proposed system, a large-scale model test of artificial slope subjected to rainfall has been performed. MEMS acceleration sensor IC tags has been located on the slope and ground acceleration caused by forced vibration has been measured until the model slope collapses. The experimental results show that the MEMS acceleration sensor IC tag is comfortably available under rainfall, the characteristics of ground accelerations varies with changing the condition of the slope subjected to rainfall, and the proposed method can be applied to a real-time monitoring system for slope failure under rainfall.

  19. Development of a CMOS MEMS pressure sensor with a mechanical force-displacement transduction structure

    International Nuclear Information System (INIS)

    Cheng, Chao-Lin; Chang, Heng-Chung; Fang, Weileun; Chang, Chun-I

    2015-01-01

    This study presents a capacitive pressure sensor with a mechanical force-displacement transduction structure based on the commercially available standard CMOS process (the TSMC 0.18 μm 1P6M CMOS process). The pressure sensor has a deformable diaphragm to support a movable plate with an embedded sensing electrode. As the diaphragm is deformed by the ambient pressure, the movable plate and its embedded sensing electrode are displaced. Thus, the pressure is detected from the capacitance change between the movable and fixed electrodes. The undeformed movable electrode will increase the effective sensing area between the sensing electrodes, thereby improving the sensitivity. Experimental results show that the proposed pressure sensor with a force-displacement transducer will increase the sensitivity by 126% within the 20 kPa–300 kPa absolute pressure range. Moreover, this study extends the design to add pillars inside the pressure sensor to further increase its sensing area as well as sensitivity. A sensitivity improvement of 117% is also demonstrated for a pressure sensor with an enlarged sensing electrode (the overlap area is increased two fold). (paper)

  20. Fabrication of an Implantable Micro-pressure Sensor to Measure Deviation Within the Cochlea

    Directory of Open Access Journals (Sweden)

    Leonardo Perez

    2013-06-01

    Full Text Available The Cochlear Implant is broadly worn by people with deep hearing damage. This device makes up an electrode array to electrically stimulate the auditory nerves. When the electrode is implanted into the inner ear by surgery, the scala tympani is ill-treated due to the strong pressure applied on the internal ear structures. To minimize this intra-cochlear trauma, it is proposed to fabricate a micro pressure-sensor and built it in the electrode array, in such a way that the pressure applied by the electrode is measured. This work selected the MEMS SU-8 Fabry-Perot interferometer-based pressure sensor. This paper describes the sensor fabrication process carried out, and explains how to integrate this sensor with the electrode array.

  1. Embedding of MEMS pressure and temperature sensors in carbon fiber composites: a manufacturing approach

    Science.gov (United States)

    Javidinejad, Amir; Joshi, Shiv P.

    2000-06-01

    In this paper embedding of surface mount pressure and temperature sensors in the Carbon fiber composites are described. A commercially available surface mount pressure and temperature sensor are used for embedding in a composite lay- up of IM6/HST-7, IM6/3501 and AS4/E7T1-2 prepregs. The fabrication techniques developed here are the focus of this paper and provide for a successful embedding procedure of pressure sensors in fibrous composites. The techniques for positioning and insulating, the sensor and the lead wires, from the conductive carbon prepregs are described and illustrated. Procedural techniques are developed and discussed for isolating the sensor's flow-opening, from the exposure to the prepreg epoxy flow and exposure to the fibrous particles, during the autoclave curing of the composite laminate. The effects of the autoclave cycle (if any) on the operation of the embedded pressure sensor are discussed.

  2. MEMS device for mass market gas and chemical sensors

    Science.gov (United States)

    Kinkade, Brian R.; Daly, James T.; Johnson, Edward A.

    2000-08-01

    in the house. Internet grocery delivery services could check for spoiled foods in their clients' refrigerators. City emissions regulators could monitor the various emissions sources throughout the area from their desk to predict how many pollution vouchers they will need to trade in the next week. We describe a new component architecture for mass-market sensors based on silicon microelectromechanical systems (MEMS) technology. MEMS are micrometer-scale devices that can be fabricated as discrete devices or large arrays, using the technology of integrated circuit manufacturing. These new photonic bandgap and MEMS fabricataion technologies will simplify the component technology to provide high-quality gas and chemical sensors at consumer prices.

  3. MEMS actuators and sensors: observations on their performance and selection for purpose

    Science.gov (United States)

    Bell, D. J.; Lu, T. J.; Fleck, N. A.; Spearing, S. M.

    2005-07-01

    This paper presents an exercise in comparing the performance of microelectromechanical systems (MEMS) actuators and sensors as a function of operating principle. Data have been obtained from the literature for the mechanical performance characteristics of actuators, force sensors and displacement sensors. On-chip and off-chip actuators and sensors are each sub-grouped into families, classes and members according to their principle of operation. The performance of MEMS sharing common operating principles is compared with each other and with equivalent macroscopic devices. The data are used to construct performance maps showing the capability of existing actuators and sensors in terms of maximum force and displacement capability, resolution and frequency. These can also be used as a preliminary design tool, as shown in a case study on the design of an on-chip tensile test machine for materials in thin-film form.

  4. Design and analysis of MEMS MWCNT / epoxy strain sensor using ...

    Indian Academy of Sciences (India)

    Gaurav Sapra

    2017-06-20

    Jun 20, 2017 ... In this paper, highly sensitive MEMS-based multi- walled (MWCNT)/epoxy strain sensor has been designed using ... This paper also discusses the process flow for fabricating MWCNT/epoxy thin film ... stone bridge, i.e., connected to the gold metal pad of the sensor. The change in resistance with respect to.

  5. Evaluation of the MEMS based portable respiratory training system with a tactile sensor for respiratory-gated radiotherapy

    Science.gov (United States)

    Moon, Sun Young; Yoon, Myonggeun; Chung, Mijoo; Chung, Weon Kuu; Kim, Dong Wook

    2017-10-01

    In respiratory-gated radiotherapy, it is important to maintain the regular respiratory cycles of patients. If patients undergo respiration training, their regular breathing pattern is affected. Therefore, we developed a respiratory training system based on a micro electromechanical system (MEMS) and evaluated the feasibility of the MEMS in radiotherapy. By comparing the measured signal before and after radiation exposure, we confirmed the effects of radiation. By evaluating the period of the electric signal emitted by a tactile sensor and its constancy, the performance of the tactile sensor was confirmed. Moreover, by comparing the delay between the motion of the MEMS and the electric signal from the tactile sensor, we confirmed the reaction time of the tactile sensor. The results showed that a baseline shift occurred for an accumulated dose of 400 Gy in the sensor, and both the amplitude and period changed. The period of the signal released by the tactile sensor was 5.39 and its standard deviation was 0.06. Considering the errors from the motion phantom, a standard deviation of 0.06 was desirable. The delay time was within 0.5 s and not distinguishable by a patient. We confirmed the performance of the MEMS and concluded that MEMS could be applied to patients for respiratory-gated radiotherapy.

  6. One-chip Integrated Module of MEMS Shock Sensor and Sensing Amplifier LSI using Pseudo-SOC Technology

    Science.gov (United States)

    Iida, Atsuko; Onozuka, Yutaka; Nishigaki, Michihiko; Yamada, Hiroshi; Funaki, Hideyuki; Itaya, Kazuhiko

    We have been developing the pseudo-SOC technology for one-chip module integration of heterogeneous devices that realizes high electrical performance and high density of devices embodying the advantages of both SOC technology and SIP technology. Especially, this technology is available for MEMS-LSI integration. We developed a 0.2mm-thickness one-chip module integrating a MEMS shock sensor and a sensing amplifier LSI by applying this technology. The MEMS shock sensor and the sensing amplifier LSI were connected by high-rigidity epoxy resin optimized the material constants to reduce the stress and the warpage resulting from resin shrinkage due to curing. Then the planar insulating layer and the redistributed conducting layer were formed on it for the global layer. The MEMS shock sensor was preformed to be modularized with a glass cap. Electrical contacts were achieved by bonding of Au bumps on the MEMS fixed electrodes and via holes filled with Ag paste of the glass cap. Functional performance was confirmed by obtaining signal corresponding to the reference signal of the pick-up sensor. Furthermore, stress analysis was performed using the FEM model simulation considering the resin shrinkage.

  7. A liquid crystal polymer membrane MEMS sensor for flow rate and flow direction sensing applications

    International Nuclear Information System (INIS)

    Kottapalli, A G P; Tan, C W; Olfatnia, M; Miao, J M; Barbastathis, G; Triantafyllou, M

    2011-01-01

    The paper reports the design, fabrication and experimental results of a liquid crystal polymer (LCP) membrane-based pressure sensor for flow rate and flow direction sensing applications. Elaborate experimental testing results demonstrating the sensors' performance as an airflow sensor have been illustrated and validated with theory. MEMS sensors using LCP as a membrane structural material show higher sensitivity and reliability over silicon counterparts. The developed device is highly robust for harsh environment applications such as atmospheric wind flow monitoring and underwater flow sensing. A simple, low-cost and repeatable fabrication scheme has been developed employing low temperatures. The main features of the sensor developed in this work are a LCP membrane with integrated thin film gold piezoresistors deposited on it. The sensor developed demonstrates a good sensitivity of 3.695 mV (ms −1 ) −1 , large operating range (0.1 to >10 ms −1 ) and good accuracy in measuring airflow with an average error of only 3.6% full-scale in comparison with theory. Various feasible applications of the developed sensor have been demonstrated with experimental results. The sensor was tested for two other applications—in clinical diagnosis for breath rate, breath velocity monitoring, and in underwater applications for object detection by sensing near-field spatial flow pressure

  8. Laboratory Testing of a MEMS Sensor System for In-Situ Monitoring of the Engineered Barrier in a Geological Disposal Facility

    Directory of Open Access Journals (Sweden)

    Wenbin Yang

    2017-05-01

    Full Text Available Geological disposal facilities for radioactive waste pose significant challenges for robust monitoring of environmental conditions within the engineered barriers that surround the waste canister. Temperatures are elevated, due to the presence of heat generating waste, relative humidity varies from 20% to 100%, and swelling pressures within the bentonite barrier can typically be 2–10 MPa. Here, we test the robustness of a bespoke design MEMS sensor-based monitoring system, which we encapsulate in polyurethane resin. We place the sensor within an oedometer cell and show that despite a rise in swelling pressure to 2 MPa, our relative humidity (RH measurements are unaffected. We then test the sensing system against a traditional RH sensor, using saturated bentonite with a range of RH values between 50% and 100%. Measurements differ, on average, by 2.87% RH, and are particularly far apart for values of RH greater than 98%. However, bespoke calibration of the MEMS sensing system using saturated solutions of known RH, reduces the measurement difference to an average of 1.97% RH, greatly increasing the accuracy for RH values close to 100%.

  9. A multi-axis MEMS sensor with integrated carbon nanotube-based piezoresistors for nanonewton level force metrology

    International Nuclear Information System (INIS)

    Cullinan, Michael A; Panas, Robert M; Culpepper, Martin L

    2012-01-01

    This paper presents the design and fabrication of a multi-axis microelectromechanical system (MEMS) force sensor with integrated carbon nanotube (CNT)-based piezoresistive sensors. Through the use of proper CNT selection and sensor fabrication techniques, the performance of the CNT-based MEMS force sensor was increased by approximately two orders of magnitude as compared to current CNT-based sensor systems. The range and resolution of the force sensor were determined as 84 μN and 5.6 nN, respectively. The accuracy of the force sensor was measured to be better than 1% over the device’s full range. (paper)

  10. Fabrication and Characterization of a CMOS-MEMS Humidity Sensor

    Science.gov (United States)

    Dennis, John-Ojur; Ahmed, Abdelaziz-Yousif; Khir, Mohd-Haris

    2015-01-01

    This paper reports on the fabrication and characterization of a Complementary Metal Oxide Semiconductor-Microelectromechanical System (CMOS-MEMS) device with embedded microheater operated at relatively elevated temperatures (40 °C to 80 °C) for the purpose of relative humidity measurement. The sensing principle is based on the change in amplitude of the device due to adsorption or desorption of humidity on the active material layer of titanium dioxide (TiO2) nanoparticles deposited on the moving plate, which results in changes in the mass of the device. The sensor has been designed and fabricated through a standard 0.35 µm CMOS process technology and post-CMOS micromachining technique has been successfully implemented to release the MEMS structures. The sensor is operated in the dynamic mode using electrothermal actuation and the output signal measured using a piezoresistive (PZR) sensor connected in a Wheatstone bridge circuit. The output voltage of the humidity sensor increases from 0.585 mV to 30.580 mV as the humidity increases from 35% RH to 95% RH. The output voltage is found to be linear from 0.585 mV to 3.250 mV as the humidity increased from 35% RH to 60% RH, with sensitivity of 0.107 mV/% RH; and again linear from 3.250 mV to 30.580 mV as the humidity level increases from 60% RH to 95% RH, with higher sensitivity of 0.781 mV/% RH. On the other hand, the sensitivity of the humidity sensor increases linearly from 0.102 mV/% RH to 0.501 mV/% RH with increase in the temperature from 40 °C to 80 °C and a maximum hysteresis of 0.87% RH is found at a relative humidity of 80%. The sensitivity is also frequency dependent, increasing from 0.500 mV/% RH at 2 Hz to reach a maximum value of 1.634 mV/% RH at a frequency of 12 Hz, then decreasing to 1.110 mV/% RH at a frequency of 20 Hz. Finally, the CMOS-MEMS humidity sensor showed comparable response, recovery, and repeatability of measurements in three cycles as compared to a standard sensor that directly

  11. Fabrication and Characterization of a CMOS-MEMS Humidity Sensor.

    Science.gov (United States)

    Dennis, John-Ojur; Ahmed, Abdelaziz-Yousif; Khir, Mohd-Haris

    2015-07-10

    This paper reports on the fabrication and characterization of a Complementary Metal Oxide Semiconductor-Microelectromechanical System (CMOS-MEMS) device with embedded microheater operated at relatively elevated temperatures (40 °C to 80 °C) for the purpose of relative humidity measurement. The sensing principle is based on the change in amplitude of the device due to adsorption or desorption of humidity on the active material layer of titanium dioxide (TiO2) nanoparticles deposited on the moving plate, which results in changes in the mass of the device. The sensor has been designed and fabricated through a standard 0.35 µm CMOS process technology and post-CMOS micromachining technique has been successfully implemented to release the MEMS structures. The sensor is operated in the dynamic mode using electrothermal actuation and the output signal measured using a piezoresistive (PZR) sensor connected in a Wheatstone bridge circuit. The output voltage of the humidity sensor increases from 0.585 mV to 30.580 mV as the humidity increases from 35% RH to 95% RH. The output voltage is found to be linear from 0.585 mV to 3.250 mV as the humidity increased from 35% RH to 60% RH, with sensitivity of 0.107 mV/% RH; and again linear from 3.250 mV to 30.580 mV as the humidity level increases from 60% RH to 95% RH, with higher sensitivity of 0.781 mV/% RH. On the other hand, the sensitivity of the humidity sensor increases linearly from 0.102 mV/% RH to 0.501 mV/% RH with increase in the temperature from 40 °C to 80 °C and a maximum hysteresis of 0.87% RH is found at a relative humidity of 80%. The sensitivity is also frequency dependent, increasing from 0.500 mV/% RH at 2 Hz to reach a maximum value of 1.634 mV/% RH at a frequency of 12 Hz, then decreasing to 1.110 mV/% RH at a frequency of 20 Hz. Finally, the CMOS-MEMS humidity sensor showed comparable response, recovery, and repeatability of measurements in three cycles as compared to a standard sensor that directly

  12. A MEMS torsion magnetic sensor with reflective blazed grating integration

    International Nuclear Information System (INIS)

    Long, Liang; Zhong, Shaolong

    2016-01-01

    A novel magnetic sensor based on a permanent magnet and blazed grating is presented in this paper. The magnetic field is detected by measuring the diffracted wavelength of the blazed grating which is changed by the torsion motion of a torsion sensitive micro-electromechanical system (MEMS) structure with a permanent magnet attached. A V-shape grating structure is obtained by wet etching on a (1 0 0) SOI substrate. When the magnet is magnetized in different directions, the in-plane or out-of-plane magnetic field is detected by a sensor. The MEMS magnetic sensor with a permanent magnet is fabricated after analytical design and bulk micromachining processes. The magnetic-sensing capability of the sensor is tested by fiber-optic detection system. The result shows the sensitivities of the in-plane and out-of-plane magnetic fields are 3.6 pm μ T −1 and 5.7 pm μ T −1 , respectively. Due to utilization of the permanent magnet and fiber-optic detection, the sensor shows excellent capability of covering the high-resolution detection of low-frequency signals. In addition, the sensitive direction of the magnetic sensor can be easily switched by varying the magnetized direction of the permanent magnet, which offers a simple way to achieve tri-axis magnetic sensor application. (paper)

  13. Design and measurement of a piezoresistive ultrasonic sensor based on MEMS

    International Nuclear Information System (INIS)

    Yu Jiaqi; He Changde; Yuan Kejing; Xue Chenyang; Zhang Wendong; Lian Deqin

    2013-01-01

    A kind of piezoresistive ultrasonic sensor based on MEMS is proposed, which is composed of a membrane and two side beams. A simplified mathematical model has been established to analyze the mechanical properties of the sensor. On the basis of the theoretical analysis, the structural size and layout location of the piezoresistors are determined by simulation analysis. The boron-implanted piezoresistors located on membrane and side beams form a Wheatstone bridge to detect acoustic signal. The membrane-beam microstructure is fabricated integrally by MEMS manufacturing technology. Finally, this paper presents the experimental characterization of the ultrasonic sensor, validating the theoretical model used and the simulated model. The sensitivity reaches −116.2 dB (0 dB reference = 1 V/μbar, 31 kHz), resonant frequency is 39.6 kHz, direction angle is 55°. (semiconductor devices)

  14. Characteristics research of pressure sensor based on nanopolysilicon thin films resistors

    Science.gov (United States)

    Zhao, Xiaofeng; Li, Dandan; Wen, Dianzhong

    2017-10-01

    To further improve the sensitivity temperature characteristics of pressure sensor, a kind of pressure sensor taking nanopolysilicon thin films as piezoresistors is proposed in this paper. On the basis of the microstructure analysis by X-ray diffraction (XRD) and scanning electron microscope (SEM) tests, the preparing process of nanopolysilicon thin films is optimized. The effects of film thickness and annealing temperature on the micro-structure of nanopolysilicon thin films were studied, respectively. In order to realize the measurement of external pressure, four nanopolysilicon thin films resistors were arranged at the edges of square silicon diaphragm connected to a Wheatstone bridge, and the chip of the sensor was designed and fabricated on a 〈100〉 orientation silicon wafer by microelectromechanical system (MEMS) technology. Experimental result shows that when I = 6.80 mA, the sensitivity of the sensor PS-1 is 0.308 mV/kPa, and the temperature coefficient of sensitivity (TCS) is about -1742 ppm/∘C in the range of -40-140∘C. It is possible to obviously improve the sensitivity temperature characteristics of pressure sensor by the proposed sensors.

  15. Recent Advances of MEMS Resonators for Lorentz Force Based Magnetic Field Sensors: Design, Applications and Challenges

    Directory of Open Access Journals (Sweden)

    Agustín Leobardo Herrera-May

    2016-08-01

    Full Text Available Microelectromechanical systems (MEMS resonators have allowed the development of magnetic field sensors with potential applications such as biomedicine, automotive industry, navigation systems, space satellites, telecommunications and non-destructive testing. We present a review of recent magnetic field sensors based on MEMS resonators, which operate with Lorentz force. These sensors have a compact structure, wide measurement range, low energy consumption, high sensitivity and suitable performance. The design methodology, simulation tools, damping sources, sensing techniques and future applications of magnetic field sensors are discussed. The design process is fundamental in achieving correct selection of the operation principle, sensing technique, materials, fabrication process and readout systems of the sensors. In addition, the description of the main sensing systems and challenges of the MEMS sensors are discussed. To develop the best devices, researches of their mechanical reliability, vacuum packaging, design optimization and temperature compensation circuits are needed. Future applications will require multifunctional sensors for monitoring several physical parameters (e.g., magnetic field, acceleration, angular ratio, humidity, temperature and gases.

  16. The Capacitance and Temperature Effects of the SiC- and Si-Based MEMS Pressure Sensor

    International Nuclear Information System (INIS)

    Marsi, N; Majlis, B Y; Hamzah, A A; Mohd, F

    2013-01-01

    This project develops the pressure sensor for monitoring the extreme conditions inside the gas turbine engine. The capacitive-based instead of piezoresistive-based pressure sensor is employed to avoid temperature drift. The deflecting (top) plate and the fixed (bottom) plate generate the capacitance, which is proportional to the applied input pressure and temperature. Two thin film materials of four different sizes are employed for the top plate, namely cubic silicon carbide (3C-SiC) and silicon (Si). Their performances in term of the sensitivity and linearity of the capacitance versus pressure are simulated at the temperature of 27°C, 500°C, 700°C and 1000°C. The results show that both materials display linear characteristics for temperature up to 500°C, although SiC-based sensor shows higher sensitivity. However, when the temperatures are increased to 700°C and 1000°C, the Si- based pressure sensor starts to malfunction at 50 MPa. However, the SiC-based pressure sensor continues to demonstrate high sensitivity and linearity at such high temperature and pressure. This paper validates the need of employing silicon carbide instead of silicon for sensing of extreme environments.

  17. Demonstration of SiC Pressure Sensors at 750 C

    Science.gov (United States)

    Okojie, Robert S.; Lukco, Dorothy; Nguyen, Vu; Savrun, Ender

    2014-01-01

    We report the first demonstration of MEMS-based 4H-SiC piezoresistive pressure sensors tested at 750 C and in the process confirmed the existence of strain sensitivity recovery with increasing temperature above 400 C, eventually achieving near or up to 100% of the room temperature values at 750 C. This strain sensitivity recovery phenomenon in 4H-SiC is uncharacteristic of the well-known monotonic decrease in strain sensitivity with increasing temperature in silicon piezoresistors. For the three sensors tested, the room temperature full-scale output (FSO) at 200 psig ranged between 29 and 36 mV. Although the FSO at 400 C dropped by about 60%, full recovery was achieved at 750 C. This result will allow the operation of SiC pressure sensors at higher temperatures, thereby permitting deeper insertion into the engine combustion chamber to improve the accurate quantification of combustor dynamics.

  18. Prospects for MEMS in the Automotive Industry

    Directory of Open Access Journals (Sweden)

    Richard DIXON

    2007-12-01

    Full Text Available An automotive sector as a growth market for MEMS sensors is analyzed in the article. The automotive sector accounted for $1.6 billion, making this the second biggest opportunity after IT peripherals and inkjet print heads. By 2011 the market will top $2.2 billion, a CAGR of around 7%. The main applications in revenues terms are, in order, pressure sensors, gyroscopes, accelerometers and flow sensors and this will remain so for the foreseeable future. Automotive companies are forced to innovate as a result of competition and price pressures.

  19. 800 C Silicon Carbide (SiC) Pressure Sensors for Engine Ground Testing

    Science.gov (United States)

    Okojie, Robert S.

    2016-01-01

    MEMS-based 4H-SiC piezoresistive pressure sensors have been demonstrated at 800 C, leading to the discovery of strain sensitivity recovery with increasing temperatures above 400 C, eventually achieving up to, or near, 100 recovery of the room temperature values at 800 C. This result will allow the insertion of highly sensitive pressure sensors closer to jet, rocket, and hypersonic engine combustion chambers to improve the quantification accuracy of combustor dynamics, performance, and increase safety margin. Also, by operating at higher temperature and locating closer to the combustion chamber, reduction of the length (weight) of pressure tubes that are currently used will be achieved. This will result in reduced costlb to access space.

  20. Improved response time of flexible microelectromechanical sensors employing eco-friendly nanomaterials.

    Science.gov (United States)

    Fan, Shicheng; Dan, Li; Meng, Lingju; Zheng, Wei; Elias, Anastasia; Wang, Xihua

    2017-11-09

    Flexible force/pressure sensors are of interest for academia and industry and have applications in wearable technologies. Most of such sensors on the market or reported in journal publications are based on the operation mechanism of probing capacitance or resistance changes of the materials under pressure. Recently, we reported the microelectromechanical (MEM) sensors based on a different mechanism: mechanical switches. Multiples of such MEM sensors can be integrated to achieve the same function of regular force/pressure sensors while having the advantages of ease of fabrication and long-term stability in operation. Herein, we report the dramatically improved response time (more than one order of magnitude) of these MEM sensors by employing eco-friendly nanomaterials-cellulose nanocrystals. For instance, the incorporation of polydimethysiloxane filled with cellulose nanocrystals shortened the response time of MEM sensors from sub-seconds to several milliseconds, leading to the detection of both diastolic and systolic pressures in the radial arterial blood pressure measurement. Comprehensive mechanical and electrical characterization of the materials and the devices reveal that greatly enhanced storage modulus and loss modulus play key roles in this improved response time. The demonstrated fast-response flexible sensors enabled continuous monitoring of heart rate and complex cardiovascular signals using pressure sensors for future wearable sensing platforms.

  1. Mass Tracking with a MEMS-based Gravity Sensor

    Science.gov (United States)

    Pike, W. T.; Mukherjee, A.; Warren, T.; Charalambous, C.; Calcutt, S. B.; Standley, I.

    2017-12-01

    We achieve the first demonstration of the dynamic location of a moving mass using a MEMS sensor to detect gravity. The sensor is based on a microseismometer developed for planetary geophysics. In an updated version of the original Cavendish experiment the noise floor of the sensor, at 0.25 µgal/rtHz, allows the determination of the dynamic gravitational field from the motion of the mass of an oscillating pendulum. Using the determined noise floor we show that this performance should be sufficient for practical subsurface gravity surveying, in particular detection of 50-cm diameter pipes up to 10 m below the surface. Beyond this specific application, this sensor with a mass of less than 250 g per axis represents a new technology that opens up the possibility of drone deloyments for gravity mapping.

  2. A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit

    Directory of Open Access Journals (Sweden)

    Zong Yao

    2016-06-01

    Full Text Available This paper focuses on the design and fabrication of a high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit, which consists of an encapsulated pressure-sensitive chip, a temperature compensation circuit and a signal-conditioning circuit. A silicon on insulation (SOI material and a standard MEMS process are used in the pressure-sensitive chip fabrication, and high-temperature electronic components are adopted in the temperature-compensation and signal-conditioning circuits. The entire pressure sensor achieves a hermetic seal and can be operated long-term in the range of −50 °C to 220 °C. Unlike traditional pressure sensor output voltage ranges (in the dozens to hundreds of millivolts, the output voltage of this sensor is from 0 V to 5 V, which can significantly improve the signal-to-noise ratio and measurement accuracy in practical applications of long-term transmission based on experimental verification. Furthermore, because this flexible sensor’s output voltage is adjustable, general follow-up pressure transmitter devices for voltage converters need not be used, which greatly reduces the cost of the test system. Thus, the proposed high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit is expected to be highly applicable to pressure measurements in harsh environments.

  3. Parylene MEMS patency sensor for assessment of hydrocephalus shunt obstruction.

    Science.gov (United States)

    Kim, Brian J; Jin, Willa; Baldwin, Alexander; Yu, Lawrence; Christian, Eisha; Krieger, Mark D; McComb, J Gordon; Meng, Ellis

    2016-10-01

    Neurosurgical ventricular shunts inserted to treat hydrocephalus experience a cumulative failure rate of 80 % over 12 years; obstruction is responsible for most failures with a majority occurring at the proximal catheter. Current diagnosis of shunt malfunction is imprecise and involves neuroimaging studies and shunt tapping, an invasive measurement of intracranial pressure and shunt patency. These patients often present emergently and a delay in care has dire consequences. A microelectromechanical systems (MEMS) patency sensor was developed to enable direct and quantitative tracking of shunt patency in order to detect proximal shunt occlusion prior to the development of clinical symptoms thereby avoiding delays in treatment. The sensor was fabricated on a flexible polymer substrate to eventually allow integration into a shunt. In this study, the sensor was packaged for use with external ventricular drainage systems for clinical validation. Insights into the transduction mechanism of the sensor were obtained. The impact of electrode size, clinically relevant temperatures and flows, and hydrogen peroxide (H2O2) plasma sterilization on sensor function were evaluated. Sensor performance in the presence of static and dynamic obstruction was demonstrated using 3 different models of obstruction. Electrode size was found to have a minimal effect on sensor performance and increased temperature and flow resulted in a slight decrease in the baseline impedance due to an increase in ionic mobility. However, sensor response did not vary within clinically relevant temperature and flow ranges. H2O2 plasma sterilization also had no effect on sensor performance. This low power and simple format sensor was developed with the intention of future integration into shunts for wireless monitoring of shunt state and more importantly, a more accurate and timely diagnosis of shunt failure.

  4. Hollow MEMS

    DEFF Research Database (Denmark)

    Larsen, Peter Emil

    Miniaturization of electro mechanical sensor systems to the micro range and beyond has shown impressive sensitivities measuring sample properties like mass, viscosity, acceleration, pressure and force just to name a few applications. In order to enable these kinds of measurements on liquid samples...... a hollow MEMS sensor has been designed, fabricated and tested. Combined density, viscosity, buoyant mass spectrometry and IR absorption spectroscopy are possible on liquid samples and micron sized suspended particles (e.g. single cells). Measurements are based on changes in the resonant behavior...... of these sensors. Optimization of the microfabrication process has led to a process yield of almost 100% .This is achieved despite the fact, that the process still offers a high degree of flexibility. By simple modifications the Sensor shape can be optimized for different size ranges and sensitivities...

  5. MEMS Actuators for Improved Performance and Durability

    Science.gov (United States)

    Yearsley, James M.

    Micro-ElectroMechanical Systems (MEMS) devices take advantage of force-scaling at length scales smaller than a millimeter to sense and interact with directly with phenomena and targets at the microscale. MEMS sensors found in everyday devices like cell-phones and cars include accelerometers, gyros, pressure sensors, and magnetic sensors. MEMS actuators generally serve more application specific roles including micro- and nano-tweezers used for single cell manipulation, optical switching and alignment components, and micro combustion engines for high energy density power generation. MEMS rotary motors are actuators that translate an electric drive signal into rotational motion and can serve as rate calibration inputs for gyros, stages for optical components, mixing devices for micro-fluidics, etc. Existing rotary micromotors suffer from friction and wear issues that affect lifetime and performance. Attempts to alleviate friction effects include surface treatment, magnetic and electrostatic levitation, pressurized gas bearings, and micro-ball bearings. The present work demonstrates a droplet based liquid bearing supporting a rotary micromotor that improves the operating characteristics of MEMS rotary motors. The liquid bearing provides wear-free, low-friction, passive alignment between the rotor and stator. Droplets are positioned relative to the rotor and stator through patterned superhydrophobic and hydrophilic surface coatings. The liquid bearing consists of a central droplet that acts as the motor shaft, providing axial alignment between rotor and stator, and satellite droplets, analogous to ball-bearings, that provide tip and tilt stable operation. The liquid bearing friction performance is characterized through measurement of the rotational drag coefficient and minimum starting torque due to stiction and geometric effects. Bearing operational performance is further characterized by modeling and measuring stiffness, environmental survivability, and high

  6. Silicon–glass-based single piezoresistive pressure sensors for harsh environment applications

    International Nuclear Information System (INIS)

    San, Haisheng; Zhang, Hong; Zhang, Qiang; Yu, Yuxi; Chen, Xuyuan

    2013-01-01

    Silicon–glass (Si–glass)-based single piezoresistive pressure sensors were designed and fabricated by standard MEMS technology. The single piezoresistive sensing element was designed to be on the lower surface of the silicon diaphragm and be vacuum-sealed in a Si–glass cavity, which form a self-packaging protection structure helpful to the applications of sensors in harsh media. The pressure sensors were fabricated using a Si–glass anodic bonding technique, and the embedded Al feedthrough lines at the Si–glass interface are used to realize the electrical connections between the piezo-sensing element and the electrode-pads, and two larger-size electrode-pads are fabricated for realizing the soldered electrical connection between the sensor and the external circuit. The performance of the pressure sensors was characterized by a pressure test system at different temperature conditions. The temperature compensation was performed by the difference between the output voltage at zero-pressure and the output at operation pressure. The measurement results show that the sensitivity is 24 mV V –1 MPa −1 , the coefficient of sensitivity is 0.14% FS °C –1 , and both the zero-point offset and the temperature coefficient of offset are equal to zero, which are able to meet the commercial application requirements. However, a nonlinearity of 5.2% FS caused by the balloon effect would considerably worsen the accuracy of the pressure sensor. It is suggested to reduce the balloon effect by using a bossed-diaphragm structure in the pressure sensor. (paper)

  7. Contact stress sensor

    Science.gov (United States)

    Kotovsky, Jack [Oakland, CA

    2012-02-07

    A contact stress sensor includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a thermal compensator and a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element.

  8. Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

    Directory of Open Access Journals (Sweden)

    Simon J. Bleiker

    2016-10-01

    Full Text Available Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based on low-temperature adhesive wafer bonding, which ensures full complementary metal-oxide-semiconductor (CMOS compatibility. All necessary fabrication steps for the wafer bonding, such as cavity formation and deposition of the adhesive, are performed on the capping substrate. The polymer adhesive is deposited by spray-coating on the capping wafer containing the cavities. Thus, no lithographic patterning of the polymer adhesive is needed, and material waste is minimized. Furthermore, this process does not require any additional fabrication steps on the device wafer, which lowers the process complexity and fabrication costs. We demonstrate the proposed capping method by packaging two different MEMS devices. The two MEMS devices include a vibration sensor and an acceleration switch, which employ two different electrical interconnection schemes. The experimental results show wafer-level capping with excellent bond quality due to the re-flow behavior of the polymer adhesive. No impediment to the functionality of the MEMS devices was observed, which indicates that the encapsulation does not introduce significant tensile nor compressive stresses. Thus, we present a highly versatile, robust, and cost-efficient capping method for components such as MEMS and imaging sensors.

  9. A Micro-Force Sensor with Beam-Membrane Structure for Measurement of Friction Torque in Rotating MEMS Machines

    Directory of Open Access Journals (Sweden)

    Huan Liu

    2017-10-01

    Full Text Available In this paper, a beam-membrane (BM sensor for measuring friction torque in micro-electro-mechanical system (MEMS gas bearings is presented. The proposed sensor measures the force-arm-transformed force using a detecting probe and the piezoresistive effect. This solution incorporates a membrane into a conventional four-beam structure to meet the range requirements for the measurement of both the maximum static friction torque and the kinetic friction torque in rotating MEMS machines, as well as eliminate the problem of low sensitivity with neat membrane structure. A glass wafer is bonded onto the bottom of the sensor chip with a certain gap to protect the sensor when overloaded. The comparisons between the performances of beam-based sensor, membrane-based sensor and BM sensor are conducted by finite element method (FEM, and the final sensor dimensions are also determined. Calibration of the fabricated and packaged device is experimentally performed. The practical verification is also reported in the paper for estimating the friction torque in micro gas bearings by assembling the proposed sensor into a rotary table-based measurement system. The results demonstrate that the proposed force sensor has a potential application in measuring micro friction or force in MEMS machines.

  10. A novel high pressure, high temperature vessel used to conduct long-term stability measurements of silicon MEMS pressure transducers

    Science.gov (United States)

    Wisniewiski, David

    2014-03-01

    The need to quantify and to improve long-term stability of pressure transducers is a persistent requirement from the aerospace sector. Specifically, the incorporation of real-time pressure monitoring in aircraft landing gear, as exemplified in Tire Pressure Monitoring Systems (TPMS), has placed greater demand on the pressure transducer for improved performance and increased reliability which is manifested in low lifecycle cost and minimal maintenance downtime through fuel savings and increased life of the tire. Piezoresistive (PR) silicon MEMS pressure transducers are the primary choice as a transduction method for this measurement owing to their ability to be designed for the harsh environment seen in aircraft landing gear. However, these pressure transducers are only as valuable as the long-term stability they possess to ensure reliable, real-time monitoring over tens of years. The "heart" of the pressure transducer is the silicon MEMS element, and it is at this basic level where the long-term stability is established and needs to be quantified. A novel High Pressure, High Temperature (HPHT) vessel has been designed and constructed to facilitate this critical measurement of the silicon MEMS element directly through a process of mechanically "floating" the silicon MEMS element while being subjected to the extreme environments of pressure and temperature, simultaneously. Furthermore, the HPHT vessel is scalable to permit up to fifty specimens to be tested at one time to provide a statistically significant data population on which to draw reasonable conclusions on long-term stability. With the knowledge gained on the silicon MEMS element, higher level assembly to the pressure transducer envelope package can also be quantified as to the build-effects contribution to long-term stability in the same HPHT vessel due to its accommodating size. Accordingly, a HPHT vessel offering multiple levels of configurability and robustness in data measurement is presented, along

  11. A capacitive membrane MEMS microwave power sensor in the X-band based on GaAs MMIC technology

    International Nuclear Information System (INIS)

    Su Shi; Liao Xiaoping

    2009-01-01

    This paper presents the modeling, fabrication, and measurement of a capacitive membrane MEMS microwave power sensor. The sensor measures microwave power coupled from coplanar waveguide (CPW) transmission lines by a MEMS membrane and then converts it into a DC voltage output by using thermopiles. Since the fabrication process is fully compatible with the GaAs monolithic microwave integrated circuit (MMIC) process, this sensor could be conveniently embedded into MMIC. From the measured DC voltage output and S-parameters, the average sensitivity in the X-band is 225.43 μV/mW, while the reflection loss is below -14 dB. The MEMS microwave power sensor has good linearity with a voltage standing wave ration of less than 1.513 in the whole X-band. In addition, the measurements using amplitude modulation signals prove that the modulation index directly influences the output DC voltage.

  12. System-in Package of Integrated Humidity Sensor Using CMOS-MEMS Technology.

    Science.gov (United States)

    Lee, Sung Pil

    2015-10-01

    Temperature/humidity microchips with micropump were fabricated using a CMOS-MEMS process and combined with ZigBee modules to implement a sensor system in package (SIP) for a ubiquitous sensor network (USN) and/or a wireless communication system. The current of a diode temperature sensor to temperature and a normalized current of FET humidity sensor to relative humidity showed linear characteristics, respectively, and the use of the micropump has enabled a faster response. A wireless reception module using the same protocol as that in transmission systems processed the received data within 10 m and showed temperature and humidity values in the display.

  13. Adaptive UAV Attitude Estimation Employing Unscented Kalman Filter, FOAM and Low-Cost MEMS Sensors

    NARCIS (Netherlands)

    Garcia de Marina Peinado, Hector; Espinosa, Felipe; Santos, Carlos

    2012-01-01

    Navigation employing low cost MicroElectroMechanical Systems (MEMS) sensors in Unmanned Aerial Vehicles (UAVs) is an uprising challenge. One important part of this navigation is the right estimation of the attitude angles. Most of the existent algorithms handle the sensor readings in a fixed way,

  14. Error and Performance Analysis of MEMS-based Inertial Sensors with a Low-cost GPS Receiver

    Directory of Open Access Journals (Sweden)

    Yang Gao

    2008-03-01

    Full Text Available Global Navigation Satellite Systems (GNSS, such as the Global Positioning System (GPS, have been widely utilized and their applications are becoming popular, not only in military or commercial applications, but also for everyday life. Although GPS measurements are the essential information for currently developed land vehicle navigation systems (LVNS, GPS signals are often unavailable or unreliable due to signal blockages under certain environments such as urban canyons. This situation must be compensated in order to provide continuous navigation solutions. To overcome the problems of unavailability and unreliability using GPS and to be cost and size effective as well, Micro Electro Mechanical Systems (MEMS based inertial sensor technology has been pushing for the development of low-cost integrated navigation systems for land vehicle navigation and guidance applications. This paper will analyze the characterization of MEMS based inertial sensors and the performance of an integrated system prototype of MEMS based inertial sensors, a low-cost GPS receiver and a digital compass. The influence of the stochastic variation of sensors will be assessed and modeled by two different methods, namely Gauss-Markov (GM and AutoRegressive (AR models, with GPS signal blockage of different lengths. Numerical results from kinematic testing have been used to assess the performance of different modeling schemes.

  15. An Implantable Intravascular Pressure Sensor for a Ventricular Assist Device

    Directory of Open Access Journals (Sweden)

    Luigi Brancato

    2016-08-01

    Full Text Available The aim of this study is to investigate the intravascular application of a micro-electro-mechanical system (MEMS pressure sensor to directly measure the hemodynamic characteristics of a ventricular assist device (VAD. A bio- and hemo-compatible packaging strategy is implemented, based on a ceramic thick film process. A commercial sub-millimeter piezoresistive sensor is attached to an alumina substrate, and a double coating of polydimethylsiloxane (PDMS and parylene-C is applied. The final size of the packaged device is 2.6 mm by 3.6 mm by 1.8 mm. A prototype electronic circuit for conditioning and read-out of the pressure signal is developed, satisfying the VAD-specific requirements of low power consumption (less than 14.5 mW in continuous mode and small form factor. The packaged sensor has been submitted to extensive in vitro tests. The device displayed a temperature-independent sensitivity (12 μ V/V/mmHg and good in vitro stability when exposed to the continuous flow of saline solution (less than 0.05 mmHg/day drift after 50 h. During in vivo validation, the transducer has been successfully used to record the arterial pressure waveform of a female sheep. A small, intravascular sensor to continuously register the blood pressure at the inflow and the outflow of a VAD is developed and successfully validated in vivo.

  16. Optimization of geometric characteristics to improve sensing performance of MEMS piezoresistive strain sensors

    International Nuclear Information System (INIS)

    Mohammed, Ahmed A S; Moussa, Walied A; Lou, Edmond

    2010-01-01

    In this paper, the design of MEMS piezoresistive strain sensor is described. ANSYS®, finite element analysis (FEA) software, was used as a tool to model the performance of the silicon-based sensor. The incorporation of stress concentration regions (SCRs), to localize stresses, was explored in detail. This methodology employs the structural design of the sensor silicon carrier. Therefore, the induced strain in the sensing chip yielded stress concentration in the vicinity of the SCRs. Hence, this concept was proved to enhance the sensor sensitivity. Another advantage of the SCRs is to reduce the sensor transverse gauge factor, which offered a great opportunity to develop a MEMS sensor with minimal cross sensitivity. Two basic SCR designs were studied. The depth of the SCRs was also investigated. Moreover, FEA simulation is utilized to investigate the effect of the sensing element depth on the sensor sensitivity. Simulation results showed that the sensor sensitivity is independent of the piezoresistors' depth. The microfabrication process flow was introduced to prototype the different sensor designs. The experiments covered operating temperature range from −50 °C to +50 °C. Finally, packaging scheme and bonding adhesive selection were discussed. The experimental results showed good agreement with the FEA simulation results. The findings of this study confirmed the feasibility of introducing SCRs in the sensor silicon carrier to improve the sensor sensitivity while using relatively high doping levels (5 × 10 19 atoms cm −3 ). The fabricated sensors have a gauge factor about three to four times higher compared to conventional thin-foil strain gauges

  17. ProTEK PSB as Biotechnology Photosensitive Protection Mask on 3C-SiC-on-Si in MEMS Sensor

    Science.gov (United States)

    Marsi, N.; Majlis, B. Y.; Mohd-Yasin, F.; Hamzah, A. A.; Mohd Rus, A. Z.

    2016-11-01

    This project presents the fabrication of MEMS employing a cubic silicon carbide (3C- SiC) on silicon wafer using newly developed ProTEK PSB as biotechnology photosensitive protection mask. This new biotechnology can reduce the number of processes and simplify the process flow with minimal impact on overall undercut performance. The 680 pm thick wafer is back-etched, leaving the 3C-SiC thin film with a thickness of 1.0 μm as the flexible diaphragm to detect pressure. The effect of the new coating of ProTEK PSB on different KOH solvents were investigated depending on various factors such as development time, final cure temperature and the thickness of the ProTEK PSB deposited layer. It is found that 6.174 μm thickness of ProTEK PSB offers some possibility of reducing the processing time compared to silicon nitride etch masks in KOH (55%wt, 80°C). The new ProTEK PSB biotechnology photosensitive protection mask indicates good stability and sustains its performance in different treatments under KOH and IPA for 8 hours. This work also revealed that the fabrication of MEMS sensors using the new biotechnology photosensitive protection mask provides a simple assembly approach and reduces manufacturing costs. The MEMS sensor can operate up to 500 °C as indicated under the sensitivity of 0.826 pF/MPa with nonlinearity and hysteresis of 0.61% and 3.13%, respectively.

  18. A Rigorous Temperature-Dependent Stochastic Modelling and Testing for MEMS-Based Inertial Sensor Errors

    Directory of Open Access Journals (Sweden)

    Spiros Pagiatakis

    2009-10-01

    Full Text Available In this paper, we examine the effect of changing the temperature points on MEMS-based inertial sensor random error. We collect static data under different temperature points using a MEMS-based inertial sensor mounted inside a thermal chamber. Rigorous stochastic models, namely Autoregressive-based Gauss-Markov (AR-based GM models are developed to describe the random error behaviour. The proposed AR-based GM model is initially applied to short stationary inertial data to develop the stochastic model parameters (correlation times. It is shown that the stochastic model parameters of a MEMS-based inertial unit, namely the ADIS16364, are temperature dependent. In addition, field kinematic test data collected at about 17 °C are used to test the performance of the stochastic models at different temperature points in the filtering stage using Unscented Kalman Filter (UKF. It is shown that the stochastic model developed at 20 °C provides a more accurate inertial navigation solution than the ones obtained from the stochastic models developed at −40 °C, −20 °C, 0 °C, +40 °C, and +60 °C. The temperature dependence of the stochastic model is significant and should be considered at all times to obtain optimal navigation solution for MEMS-based INS/GPS integration.

  19. A Rigorous Temperature-Dependent Stochastic Modelling and Testing for MEMS-Based Inertial Sensor Errors.

    Science.gov (United States)

    El-Diasty, Mohammed; Pagiatakis, Spiros

    2009-01-01

    In this paper, we examine the effect of changing the temperature points on MEMS-based inertial sensor random error. We collect static data under different temperature points using a MEMS-based inertial sensor mounted inside a thermal chamber. Rigorous stochastic models, namely Autoregressive-based Gauss-Markov (AR-based GM) models are developed to describe the random error behaviour. The proposed AR-based GM model is initially applied to short stationary inertial data to develop the stochastic model parameters (correlation times). It is shown that the stochastic model parameters of a MEMS-based inertial unit, namely the ADIS16364, are temperature dependent. In addition, field kinematic test data collected at about 17 °C are used to test the performance of the stochastic models at different temperature points in the filtering stage using Unscented Kalman Filter (UKF). It is shown that the stochastic model developed at 20 °C provides a more accurate inertial navigation solution than the ones obtained from the stochastic models developed at -40 °C, -20 °C, 0 °C, +40 °C, and +60 °C. The temperature dependence of the stochastic model is significant and should be considered at all times to obtain optimal navigation solution for MEMS-based INS/GPS integration.

  20. Advanced Mechatronics and MEMS Devices

    CERN Document Server

    2013-01-01

    Advanced Mechatronics and MEMS Devicesdescribes state-of-the-art MEMS devices and introduces the latest technology in electrical and mechanical microsystems. The evolution of design in microfabrication, as well as emerging issues in nanomaterials, micromachining, micromanufacturing and microassembly are all discussed at length in this volume. Advanced Mechatronics also provides a reader with knowledge of MEMS sensors array, MEMS multidimensional accelerometer, artificial skin with imbedded tactile components, as well as other topics in MEMS sensors and transducers. The book also presents a number of topics in advanced robotics and an abundance of applications of MEMS in robotics, like reconfigurable modular snake robots, magnetic MEMS robots for drug delivery and flying robots with adjustable wings, to name a few. This book also: Covers the fundamentals of advanced mechatronics and MEMS devices while also presenting new state-of-the-art methodology and technology used in the application of these devices Prese...

  1. Sensor Development for Active Flow Control

    Science.gov (United States)

    Kahng, Seun K.; Gorton, Susan A.; Mau, Johnney C.; Soto, Hector L.; Hernandez, Corey D.

    2001-01-01

    Presented are the developmental efforts for MEMS sensors for a closed-loop active flow control in a low-speed wind tunnel evaluation. The MEMS sensors are designed in-house and fabricated out of house, and the shear sensors are a thermal type that are collocated with temperature and pressure sensors on a flexible polyimide sheet, which conforms to surfaces of a simple curvature. A total of 6 sensors are located within a 1.5 by 3 mm area as a cluster with each sensor being 300 pm square. The thickness of this sensor cluster is 75 pm. Outputs from the shear sensors have been compared with respect to those of the Preston tube for evaluation of the sensors on a flat plate. Pressure sensors are the absolute type and have recorded pressure measurements within 0.05 percent of the tunnel ESP pressure sensor readings. The sensors and signal conditioning electronics have been tested on both a flat plate and a ramp in Langley s 15-Inch Low-Turbulence Tunnel. The system configuration and control PC is configured with LabView, where calibration constants are stored for desired compensation and correction. The preliminary test results are presented within.

  2. Piezoelectric MEMS sensors: state-of-the-art and perspectives

    International Nuclear Information System (INIS)

    Tadigadapa, S; Mateti, K

    2009-01-01

    Over the past two decades, several advances have been made in micromachined sensors and actuators. As the field of microelectromechanical systems (MEMS) has advanced, a clear need for the integration of materials other than silicon and its compounds into micromachined transducers has emerged. Piezoelectric materials are high energy density materials that scale very favorably upon miniaturization and that has led to an ever-growing interest in piezoelectric films for MEMS applications. At this time, piezoelectric aluminum-nitride-based film bulk acoustic resonators (FBAR) have already been successfully commercialized. Future innovations and improvements in inertial sensors for navigation, high-frequency crystal oscillators and filters for wireless applications, microactuators for RF applications, chip-scale chemical analysis systems and countless other applications hinge upon the successful miniaturization of components and integration of piezoelectrics and metals into these systems. In this article, a comprehensive review of micromachined piezoelectric transducer technology will be presented. Piezoelectric materials in bulk and thin film forms will be reviewed and fabrication techniques for the integration of these materials for microsensor applications will be presented. Recent advances in various piezoelectric microsensors will be presented through specific examples. This review will conclude with a critical assessment of the future trends and promise of this technology. (topical review)

  3. Monitoring of slope-instabilities and deformations with Micro-Electro-Mechanical-Systems (MEMS) in wireless ad-hoc Sensor Networks

    Science.gov (United States)

    Arnhardt, C.; Fernández-Steeger, T. M.; Azzam, R.

    2009-04-01

    In most mountainous regions, landslides represent a major threat to human life, properties and infrastructures. Nowadays existing landslide monitoring systems are often characterized by high efforts in terms of purchase, installation, maintenance, manpower and material. In addition (or because of this) only small areas or selective points of the endangered zone can be observed by the system. Therefore the improvement of existing and the development of new monitoring and warning systems are of high relevance. The joint project "Sensor based Landslide Early Warning Systems" (SLEWS) deals with the development of a prototypic Alarm- and Early Warning system (EWS) for different types of landslides using low-cost micro-sensors (MEMS) integrated in a wireless sensor network (WSN). Modern so called Ad-Hoc, Multi-Hop wireless sensor networks (WSN) are characterized by a self organizing and self-healing capacity of the system (autonomous systems). The network consists of numerous individual and own energy-supply operating sensor nodes, that can send data packages from their measuring devices (here: MEMS) over other nodes (Multi-Hop) to a collection point (gateway). The gateway provides the interface to central processing and data retrieval units (PC, Laptop or server) outside the network. In order to detect and monitor the different landslide processes (like fall, topple, spreading or sliding) 3D MEMS capacitive sensors made from single silicon crystals and glass were chosen to measure acceleration, tilting and altitude changes. Based on the so called MEMS (Micro-Electro-Mechanical Systems) technology, the sensors combine very small mechanical and electronic units, sensing elements and transducers on a small microchip. The mass production of such type of sensors allows low cost applications in different areas (like automobile industries, medicine, and automation technology). Apart from the small and so space saving size and the low costs another advantage is the energy

  4. MEMS-based sensors for post-earthquake damage assessment

    Energy Technology Data Exchange (ETDEWEB)

    Pozzi, M; Zonta, D; Trapani, D [DIMS, University of Trento, Via Mesiano 77, 38123, Trento (Italy); Athanasopoulos, N; Garetsos, A; Stratakos, Y E [Advanced Microwave Systems Ltd, 2, 25th Martiou Street, 17778 Athens (Greece); Amditis, A J; Bimpas, M [ICCS, National Technical University of Athens, 9 Iroon Polytechniou Street, 15773 Zografou (Greece); Ulieru, D, E-mail: daniele.zonta@unitn.it [SITEX 45 SRL, 114 Ghica Tei Blvd, 72235 Bucharest (Romania)

    2011-07-19

    The evaluation of seismic damage is today almost exclusively based on visual inspection, as building owners are generally reluctant to install permanent sensing systems, due to their high installation, management and maintenance costs. To overcome this limitation, the EU-funded MEMSCON project aims to produce small size sensing nodes for measurement of strain and acceleration, integrating Micro-Electro-Mechanical Systems (MEMS) based sensors and Radio Frequency Identification (RFID) tags in a single package that will be attached to reinforced concrete buildings and will transmit data using a wireless interface. During the first phase of the project completed so far, sensor prototypes were produced by assembling preexisting components. This paper outlines the device operating principles, production scheme and operation at both unit and network levels. It also reports on validation campaigns conducted in the laboratory to assess system performance. Accelerometer sensors were tested on a reduced scale metal frame mounted on a shaking table, while strain sensors were embedded in both reduced and full-scale reinforced concrete specimens undergoing increasing deformation cycles up to extensive damage and collapse. The performance of the sensors developed for the project and their applicability to long-term seismic monitoring are discussed.

  5. Design and fabrication of a terminating type MEMS microwave power sensor

    International Nuclear Information System (INIS)

    Xu Yinglin; Liao Xiaoping

    2009-01-01

    A terminating type MEMS microwave power sensor based on the Seebeck effect and compatible with the GaAs MMIC process is presented. An electrothermal model is introduced to simulate the heat transfer behavior and temperature distribution. The sensor measured the microwave power from -20 to 20 dBm up to 20 GHz. The sensitivity of the sensor is 0.27 mV/mW at 20 GHz, and the input return loss is less than -26 dB over the entire experiment frequency range. In order to improve the sensitivity, four different types of coplanar waveguide (CPW) were designed and the sensitivity was significantly increased by about a factor of 2.

  6. Mechanical Robustness and Hermeticity Monitoring for MEMS Thin Film Encapsulation

    NARCIS (Netherlands)

    Santagata, F.

    2011-01-01

    Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor structures being exposed to external perturbations such as dust, humidity, touching, and gas pressure. An upcoming and cost-effective way of encapsulation is zero-level packaging or thin-film

  7. Implementation and Performance of a GPS/INS Tightly Coupled Assisted PLL Architecture Using MEMS Inertial Sensors

    Directory of Open Access Journals (Sweden)

    Youssef Tawk

    2014-02-01

    Full Text Available The use of global navigation satellite system receivers for navigation still presents many challenges in urban canyon and indoor environments, where satellite availability is typically reduced and received signals are attenuated. To improve the navigation performance in such environments, several enhancement methods can be implemented. For instance, external aid provided through coupling with other sensors has proven to contribute substantially to enhancing navigation performance and robustness. Within this context, coupling a very simple GPS receiver with an Inertial Navigation System (INS based on low-cost micro-electro-mechanical systems (MEMS inertial sensors is considered in this paper. In particular, we propose a GPS/INS Tightly Coupled Assisted PLL (TCAPLL architecture, and present most of the associated challenges that need to be addressed when dealing with very-low-performance MEMS inertial sensors. In addition, we propose a data monitoring system in charge of checking the quality of the measurement flow in the architecture. The implementation of the TCAPLL is discussed in detail, and its performance under different scenarios is assessed. Finally, the architecture is evaluated through a test campaign using a vehicle that is driven in urban environments, with the purpose of highlighting the pros and cons of combining MEMS inertial sensors with GPS over GPS alone.

  8. Implementation and Performance of a GPS/INS Tightly Coupled Assisted PLL Architecture Using MEMS Inertial Sensors

    Science.gov (United States)

    Tawk, Youssef; Tomé, Phillip; Botteron, Cyril; Stebler, Yannick; Farine, Pierre-André

    2014-01-01

    The use of global navigation satellite system receivers for navigation still presents many challenges in urban canyon and indoor environments, where satellite availability is typically reduced and received signals are attenuated. To improve the navigation performance in such environments, several enhancement methods can be implemented. For instance, external aid provided through coupling with other sensors has proven to contribute substantially to enhancing navigation performance and robustness. Within this context, coupling a very simple GPS receiver with an Inertial Navigation System (INS) based on low-cost micro-electro-mechanical systems (MEMS) inertial sensors is considered in this paper. In particular, we propose a GPS/INS Tightly Coupled Assisted PLL (TCAPLL) architecture, and present most of the associated challenges that need to be addressed when dealing with very-low-performance MEMS inertial sensors. In addition, we propose a data monitoring system in charge of checking the quality of the measurement flow in the architecture. The implementation of the TCAPLL is discussed in detail, and its performance under different scenarios is assessed. Finally, the architecture is evaluated through a test campaign using a vehicle that is driven in urban environments, with the purpose of highlighting the pros and cons of combining MEMS inertial sensors with GPS over GPS alone. PMID:24569773

  9. Semiautonomous Avionics-and-Sensors System for a UAV

    Science.gov (United States)

    Shams, Qamar

    2006-01-01

    Unmanned Aerial Vehicles (UAVs) autonomous or remotely controlled pilotless aircraft have been recently thrust into the spotlight for military applications, for homeland security, and as test beds for research. In addition to these functions, there are many space applications in which lightweight, inexpensive, small UAVS can be used e.g., to determine the chemical composition and other qualities of the atmospheres of remote planets. Moreover, on Earth, such UAVs can be used to obtain information about weather in various regions; in particular, they can be used to analyze wide-band acoustic signals to aid in determining the complex dynamics of movement of hurricanes. The Advanced Sensors and Electronics group at Langley Research Center has developed an inexpensive, small, integrated avionics-and-sensors system to be installed in a UAV that serves two purposes. The first purpose is to provide flight data to an AI (Artificial Intelligence) controller as part of an autonomous flight-control system. The second purpose is to store data from a subsystem of distributed MEMS (microelectromechanical systems) sensors. Examples of these MEMS sensors include humidity, temperature, and acoustic sensors, plus chemical sensors for detecting various vapors and other gases in the environment. The critical sensors used for flight control are a differential- pressure sensor that is part of an apparatus for determining airspeed, an absolute-pressure sensor for determining altitude, three orthogonal accelerometers for determining tilt and acceleration, and three orthogonal angular-rate detectors (gyroscopes). By using these eight sensors, it is possible to determine the orientation, height, speed, and rates of roll, pitch, and yaw of the UAV. This avionics-and-sensors system is shown in the figure. During the last few years, there has been rapid growth and advancement in the technological disciplines of MEMS, of onboard artificial-intelligence systems, and of smaller, faster, and

  10. A novel dual-functional MEMS sensor integrating both pressure and temperature units

    Energy Technology Data Exchange (ETDEWEB)

    Chen Tao; Zhang Zhaohua; Ren Tianling; Miao Gujin; Zhou Changjian; Lin Huiwang; Liu Litian, E-mail: RenTL@tsinghua.edu.c [National Laboratory for Information Science and Technology, Institute of Microelectronics, Tsinghua University, Beijing 100084 (China)

    2010-07-15

    This paper proposes a novel miniature dual-functional sensor integrating both pressure and temperature sensitive units on a single chip. The device wafer of SOI is used as a pizeoresistive diaphragm which features excellent consistency in thickness. The conventional anisotropic wet etching has been abandoned, while ICP etching has been employed to etch out the reference cave to minimize the area of individual device in the way that the 57.4{sup 0} slope has been eliminated. As a result, the average cost of the single chip is reduced. Two PN junctions with constant ratio of the areas of depletion regions have also been integrated on the same chip to serve as a temperature sensor, and each PN junction shows high linearity over -40 to 100 {sup 0}C and low power consumption. The iron implanting process for PN junction is exactly compatible with the piezoresistor, with no additional expenditure. The pressure sensitivity is 86 mV/MPa, while temperature sensitivity is 1.43 mV/{sup 0}C, both complying with the design objective.

  11. A novel dual-functional MEMS sensor integrating both pressure and temperature units

    International Nuclear Information System (INIS)

    Chen Tao; Zhang Zhaohua; Ren Tianling; Miao Gujin; Zhou Changjian; Lin Huiwang; Liu Litian

    2010-01-01

    This paper proposes a novel miniature dual-functional sensor integrating both pressure and temperature sensitive units on a single chip. The device wafer of SOI is used as a pizeoresistive diaphragm which features excellent consistency in thickness. The conventional anisotropic wet etching has been abandoned, while ICP etching has been employed to etch out the reference cave to minimize the area of individual device in the way that the 57.4 0 slope has been eliminated. As a result, the average cost of the single chip is reduced. Two PN junctions with constant ratio of the areas of depletion regions have also been integrated on the same chip to serve as a temperature sensor, and each PN junction shows high linearity over -40 to 100 0 C and low power consumption. The iron implanting process for PN junction is exactly compatible with the piezoresistor, with no additional expenditure. The pressure sensitivity is 86 mV/MPa, while temperature sensitivity is 1.43 mV/ 0 C, both complying with the design objective.

  12. From MEMS to nanomachine

    International Nuclear Information System (INIS)

    Esashi, Masayoshi; Ono, Takahito

    2005-01-01

    Practically applicable microelectromechanical systems (MEMS) and nanomachines have been developed by applying dry processes. Deep reactive ion etching (RIE) of silicon and its applications to an electrostatically levitated rotational gyroscope, a fibre optic blood pressure sensor and in micro-actuated probes are described. High density electrical feedthrough in glass is made using deep RIE of glass and electroplating of metal. Multi-probe data storage system has been developed using the high density electrical feedthrough in glass. Chemical vapour deposition (CVD) of different materials have been developed for MEMS applications; trench-refill using SiO 2 CVD, microstructures using Silicon carbide CVD for glass mold press and selective CVD of carbon nanotube for electron field emitter. Multi-column electron beam lithography system has been developed using the electron field emitter. (topical review)

  13. Designing a robust high-speed CMOS-MEMS capacitive humidity sensor

    International Nuclear Information System (INIS)

    Lazarus, N; Fedder, G K

    2012-01-01

    In our previous work (Lazarus and Fedder 2011 J. Micromech. Microeng. 21 0650281), we demonstrated a CMOS-MEMS capacitive humidity sensor with a 72% improvement in sensitivity over the highest previously integrated on a CMOS die. This paper explores a series of methods for creating a faster and more manufacturable high-sensitivity capacitive humidity sensor. These techniques include adding oxide pillars to hold the plates apart, spin coating polymer to allow sensors to be fabricated more cheaply, adding a polysilicon heater and etching away excess polymer in the release holes. In most cases a tradeoff was found between sensitivity and other factors such as response time or robustness. A robust high-speed sensor was designed with a sensitivity of 0.21% change in capacitance per per cent relative humidity, while dropping the response time constant from 70 to 4s. Although less sensitive than our design, the sensor remains 17% more sensitive than the most sensitive interdigitated designs successfully integrated with CMOS. (paper)

  14. Going Fabless with MEMS

    Directory of Open Access Journals (Sweden)

    Bhaskar CHOUBEY

    2011-04-01

    Full Text Available The Microelectromechanical sensors are finding increasing applications in everyday life. However, each MEMS sensor is generally fabricated on its own individual process. This leads to high cost per sensor. It has been suggested the MEMS should and would follow the path of integrated circuits industry, wherein fabless firms could concentrate on design leading pure-foundries to perfect the manufacturing process. With several designs being manufactured on the same process, the installation cost of fabrication would be evenly shared. Simultaneously, multiple project wafer runs are being offered for MEMS processes to encourage design activity in universities as well as startups. This paper reviews the present state of this transition through an experience of designing and manufacturing microelectromechanical resonators on different processes.

  15. Attitude Determination Method by Fusing Single Antenna GPS and Low Cost MEMS Sensors Using Intelligent Kalman Filter Algorithm

    Directory of Open Access Journals (Sweden)

    Lei Wang

    2017-01-01

    Full Text Available For meeting the demands of cost and size for micronavigation system, a combined attitude determination approach with sensor fusion algorithm and intelligent Kalman filter (IKF on low cost Micro-Electro-Mechanical System (MEMS gyroscope, accelerometer, and magnetometer and single antenna Global Positioning System (GPS is proposed. The effective calibration method is performed to compensate the effect of errors in low cost MEMS Inertial Measurement Unit (IMU. The different control strategies fusing the MEMS multisensors are designed. The yaw angle fusing gyroscope, accelerometer, and magnetometer algorithm is estimated accurately under GPS failure and unavailable sideslip situations. For resolving robust control and characters of the uncertain noise statistics influence, the high gain scale of IKF is adjusted by fuzzy controller in the transition process and steady state to achieve faster convergence and accurate estimation. The experiments comparing different MEMS sensors and fusion algorithms are implemented to verify the validity of the proposed approach.

  16. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  17. Outlook and challenges of nano devices, sensors, and MEMS

    CERN Document Server

    Liu, Ziv

    2017-01-01

    This book provides readers with an overview of the design, fabrication, simulation, and reliability of nanoscale semiconductor devices, MEMS, and sensors, as they serve for realizing the next-generation internet of things. The authors focus on how the nanoscale structures interact with the electrical and/or optical performance, how to find optimal solutions to achieve the best outcome, how these apparatus can be designed via models and simulations, how to improve reliability, and what are the possible challenges and roadblocks moving forward.

  18. Design of a multi-axis implantable MEMS sensor for intraosseous bone stress monitoring

    International Nuclear Information System (INIS)

    Alfaro, Fernando; Weiss, Lee; Campbell, Phil; Fedder, Gary K; Miller, Mark

    2009-01-01

    The capability to assess the biomechanical properties of living bone is important for basic research as well as the clinical management of skeletal trauma and disease. Even though radiodensitometric imaging is commonly used to infer bone quality, bone strength does not necessarily correlate well with these non-invasive measurements. This paper reports on the design, fabrication and initial testing of an implantable ultra-miniature multi-axis sensor for directly measuring bone stresses at a micro-scale. The device, which is fabricated with CMOS-MEMS processes, is intended to be permanently implanted within open fractures, or embedded in bone grafts, or placed on implants at the interfaces between bone and prosthetics. The stress sensor comprises an array of piezoresistive pixels to detect a stress tensor at the interfacial area between the MEMS chip and bone, with a resolution to 100 Pa, in 1 s averaging. The sensor system design and manufacture is also compatible with the integration of wireless RF telemetry, for power and data retrieval, all within a 3 mm × 3 mm × 0.3 mm footprint. The piezoresistive elements are integrated within a textured surface to enhance sensor integration with bone. Finite element analysis led to a sensor design for normal and shear stress detection. A wired sensor was fabricated in the Jazz 0.35 µm BiCMOS process and then embedded in mock bone material to characterize its response to tensile and bending loads up to 250 kPa

  19. Remote Driven and Read MEMS Sensors for Harsh Environments

    Directory of Open Access Journals (Sweden)

    David W. Vernooy

    2013-10-01

    Full Text Available The utilization of high accuracy sensors in harsh environments has been limited by the temperature constraints of the control electronics that must be co-located with the sensor. Several methods of remote interrogation for resonant sensors are presented in this paper which would allow these sensors to be extended to harsh environments. This work in particular demonstrates for the first time the ability to acoustically drive a silicon comb drive resonator into resonance and electromagnetically couple to the resonator to read its frequency. The performance of this system was studied as a function of standoff distance demonstrating the ability to excite and read the device from 22 cm when limited to drive powers of 30 mW. A feedback architecture was implemented that allowed the resonator to be driven into resonance from broadband noise and a standoff distance of 15 cm was demonstrated. It is emphasized that no junction-based electronic device was required to be co-located with the resonator, opening the door for the use of silicon-based, high accuracy MEMS devices in high temperature wireless applications.

  20. Temperature characteristics research of SOI pressure sensor based on asymmetric base region transistor

    Science.gov (United States)

    Zhao, Xiaofeng; Li, Dandan; Yu, Yang; Wen, Dianzhong

    2017-07-01

    Based on the asymmetric base region transistor, a pressure sensor with temperature compensation circuit is proposed in this paper. The pressure sensitive structure of the proposed sensor is constructed by a C-type silicon cup and a Wheatstone bridge with four piezoresistors ({R}1, {R}2, {R}3 and {R}4) locating on the edge of a square silicon membrane. The chip was designed and fabricated on a silicon on insulator (SOI) wafer by micro electromechanical system (MEMS) technology and bipolar transistor process. When the supply voltage is 5.0 V, the corresponding temperature coefficient of the sensitivity (TCS) for the sensor before and after temperature compensation are -1862 and -1067 ppm/°C, respectively. Through varying the ratio of the base region resistances {r}1 and {r}2, the TCS for the sensor with the compensation circuit is -127 ppm/°C. It is possible to use this compensation circuit to improve the temperature characteristics of the pressure sensor. Project supported by the National Natural Science Foundation of China (No. 61471159), the Natural Science Foundation of Heilongjiang Province (No. F201433), the University Nursing Program for Young Scholars with Creative Talents in Heilongjiang Province (No. 2015018), and the Special Funds for Science and Technology Innovation Talents of Harbin in China (No. 2016RAXXJ016).

  1. Hidden Markov Model-based Pedestrian Navigation System using MEMS Inertial Sensors

    Directory of Open Access Journals (Sweden)

    Zhang Yingjun

    2015-02-01

    Full Text Available In this paper, a foot-mounted pedestrian navigation system using MEMS inertial sensors is implemented, where the zero-velocity detection is abstracted into a hidden Markov model with 4 states and 15 observations. Moreover, an observations extraction algorithm has been developed to extract observations from sensor outputs; sample sets are used to train and optimize the model parameters by the Baum-Welch algorithm. Finally, a navigation system is developed, and the performance of the pedestrian navigation system is evaluated using indoor and outdoor field tests, and the results show that position error is less than 3% of total distance travelled.

  2. MEMS fluidic actuator

    Science.gov (United States)

    Kholwadwala, Deepesh K [Albuquerque, NM; Johnston, Gabriel A [Trophy Club, TX; Rohrer, Brandon R [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Okandan, Murat [Albuquerque, NM

    2007-07-24

    The present invention comprises a novel, lightweight, massively parallel device comprising microelectromechanical (MEMS) fluidic actuators, to reconfigure the profile, of a surface. Each microfluidic actuator comprises an independent bladder that can act as both a sensor and an actuator. A MEMS sensor, and a MEMS valve within each microfluidic actuator, operate cooperatively to monitor the fluid within each bladder, and regulate the flow of the fluid entering and exiting each bladder. When adjacently spaced in a array, microfluidic actuators can create arbitrary surface profiles in response to a change in the operating environment of the surface. In an embodiment of the invention, the profile of an airfoil is controlled by independent extension and contraction of a plurality of actuators, that operate to displace a compliant cover.

  3. A Nonlinear Attitude Estimator for Attitude and Heading Reference Systems Based on MEMS Sensors

    DEFF Research Database (Denmark)

    Wang, Yunlong; Soltani, Mohsen; Hussain, Dil muhammed Akbar

    2016-01-01

    In this paper, a nonlinear attitude estimator is designed for an Attitude Heading and Reference System (AHRS) based on Micro Electro-Mechanical Systems (MEMS) sensors. The design process of the attitude estimator is stated with detail, and the equilibrium point of the estimator error model...... the problems in previous research works. Moreover, the estimation of MEMS gyroscope bias is also inclueded in this estimator. The designed nonlinear attitude estimator is firstly tested in simulation environment and then implemented in an AHRS hardware for further experiments. Finally, the attitude estimation...

  4. Development of an Emergency Locking Unit for a Belt-In-Seat (BIS System Using a MEMS Acceleration Sensor

    Directory of Open Access Journals (Sweden)

    Chang Hyun Baek

    2010-04-01

    Full Text Available This paper proposes an emergency locking unit (ELU for a seat belt retractor which is mounted on the back frame of a vehicle seat. The proposed unit uses a recliner sensor based on a MEMS acceleration sensor and solenoid mechanism. The seat has an upper frame supported to tilt on a lower frame. The retractor in belt in seat (BIS system is supported by the upper frame. The proposed recliner sensor based on a MEMS acceleration sensor comprises orientation means for maintaining a predetermined orientation of emergency relative to the lower frame independently of the force of gravity when the upper frame tilts on the lower frame. Experimental results show that the developed recliner sensor unit operates effectively with respect to rollover angles. Thus, the developed unit will have a considerable potential to offer a new design concept in BIS system.

  5. Development of a wireless MEMS multifunction sensor system and field demonstration of embedded sensors for monitoring concrete pavements : tech transfer summary.

    Science.gov (United States)

    2016-08-01

    Micro-electromechanical sensors and systems- (MEMS)-based and : wireless-based smart-sensing technologies have, until now, rarely : been used for monitoring pavement response in the field, and the : requirements for using such smart sensing technolog...

  6. Sensor Fusion of Position- and Micro-Sensors (MEMS) integrated in a Wireless Sensor Network for movement detection in landslide areas

    Science.gov (United States)

    Arnhardt, Christian; Fernández-Steeger, Tomas; Azzam, Rafig

    2010-05-01

    technologies were chosen. The MEMS-Sensors are acceleration-, tilt- and barometric pressure sensors. The positionsensors are draw wire and linear displacement transducers. In first laboratory tests the accuracy and resolution were investigated. The tests showed good results for all sensors. For example tilt-movements can be monitored with an accuracy of +/- 0,06° and a resolution of 0,1°. With the displacement transducer change in length of >0,1mm is possible. Apart from laboratory tests, field tests in South France and Germany were done to prove data stability and movement detection under real conditions. The results obtained were very satisfying, too. In the next step the combination of numerous sensors (sensor fusion) of the same type (redundancy) or different types (complementary) was researched. Different experiments showed that there is a high concordance between identical sensor-types. According to different sensor parameters (sensitivity, accuracy, resolution) some sensor-types can identify changes earlier. Taking this into consideration, good correlations between different kinds of sensors were achieved, too. Thus the experiments showed that combination of sensors is possible and this could improve the detection of movement and movement rate but also outliers. Based on this results various algorithms were setup that include different statistical methods (outlier tests, testing of hypotheses) and procedures from decision theories (Hurwicz-criteria). These calculation formulas will be implemented in the spatial data infrastructure (SDI) for the further data processing and validation. In comparison with today existing mainly punctually working monitoring systems, the application of wireless sensor networks in combination with low-cost, but precise micro-sensors provides an inexpensive and easy to set up monitoring system also in large areas. The correlation of same but also different sensor-types permits a good data control. Thus the sensor fusion is a promising tool

  7. Overcoming urban GPS navigation challenges through the use of MEMS inertial sensors and proper verification of navigation system performance

    Science.gov (United States)

    Vinande, Eric T.

    This research proposes several means to overcome challenges in the urban environment to ground vehicle global positioning system (GPS) receiver navigation performance through the integration of external sensor information. The effects of narrowband radio frequency interference and signal attenuation, both common in the urban environment, are examined with respect to receiver signal tracking processes. Low-cost microelectromechanical systems (MEMS) inertial sensors, suitable for the consumer market, are the focus of receiver augmentation as they provide an independent measure of motion and are independent of vehicle systems. A method for estimating the mounting angles of an inertial sensor cluster utilizing typical urban driving maneuvers is developed and is able to provide angular measurements within two degrees of truth. The integration of GPS and MEMS inertial sensors is developed utilizing a full state navigation filter. Appropriate statistical methods are developed to evaluate the urban environment navigation improvement due to the addition of MEMS inertial sensors. A receiver evaluation metric that combines accuracy, availability, and maximum error measurements is presented and evaluated over several drive tests. Following a description of proper drive test techniques, record and playback systems are evaluated as the optimal way of testing multiple receivers and/or integrated navigation systems in the urban environment as they simplify vehicle testing requirements.

  8. Optimization of biogas production using MEMS based near infrared inline-sensor

    Science.gov (United States)

    Saupe, Ray; Seider, Thomas; Stock, Volker; Kujawski, Olaf; Otto, Thomas; Gessner, Thomas

    2013-03-01

    Due to climate protection and increasing oil prices, renewable energy is becoming extremely important. Anaerobic digestion is a particular environmental and resource-saving way of heat and power production in biogas plants. These plants can be operated decentralized and independent of weather conditions and allow peak load operation. To maximize energy production, plants should be operated at a high efficiency. That means the entire installed power production capacity (e.g. CHP) and biogas production have to be used. However, current plant utilization in many areas is significantly lower, which is economically and environmentally inefficient, since the biochemical process responds to fluctuations in boundary conditions, e.g. mixing in the conditions and substrate composition. At present only a few easily accessible parameters such as fill level, flow rates and temperature are determined on-line. Monitoring of substrate composition occurs only sporadically with the help of laboratory methods. Direct acquisition of substrate composition combined with a smart control and regulation concept enables significant improvement in plant efficiency. This requires a compact, reliable and cost-efficient sensor. It is for this reason that a MEMS sensor system based on NIR spectroscopy has been developed. Requirements are high accuracy, which is the basic condition for exact chemometric evaluation of the sample as well as optimized MEMS design and packaging in order to work in poor environmental conditions. Another issue is sample presentation, which needs an exact adopted optical-mechanical system. In this paper, the development and application of a MEMS-based analyzer for biogas plants will be explained. The above mentioned problems and challenges will be discussed. Measurement results will be shown to demonstrate its performance.

  9. Vacuum behavior and control of a MEMS stage with integrated thermal displacement sensor

    NARCIS (Netherlands)

    Krijnen, B.; Brouwer, Dannis Michel; Abelmann, Leon; Herder, Justus Laurens

    2015-01-01

    We investigate the applicability of a MEMS stage in a vacuum environment. The stage is suspended by a flexure mechanism and is actuated by electrostatic comb-drives. The position of the stage is measured by an integrated sensor based on the conductance of heat through air. The vacuum behavior of the

  10. Design of a base station for MEMS CCR localization in an optical sensor network.

    Science.gov (United States)

    Park, Chan Gook; Jeon, Hyun Cheol; Kim, Hyoun Jin; Kim, Jae Yoon

    2014-05-08

    This paper introduces a design and implementation of a base station, capable of positioning sensor nodes using an optical scheme. The base station consists of a pulse laser module, optical detectors and beam splitter, which are mounted on a rotation-stage, and a Time to Digital Converter (TDC). The optical pulse signal transmitted to the sensor node with a Corner Cube Retro-reflector (CCR) is reflected to the base station, and the Time of Flight (ToF) data can be obtained from the two detectors. With the angle and flight time data, the position of the sensor node can be calculated. The performance of the system is evaluated by using a commercial CCR. The sensor nodes are placed at different angles from the base station and scanned using the laser. We analyze the node position error caused by the rotation and propose error compensation methods, namely the outlier sample exception and decreasing the confidence factor steadily using the recursive least square (RLS) methods. Based on the commercial CCR results, the MEMS CCR is also tested to demonstrate the compatibility between the base station and the proposed methods. The result shows that the localization performance of the system can be enhanced with the proposed compensation method using the MEMS CCR.

  11. Design of a Base Station for MEMS CCR Localization in an Optical Sensor Network

    Directory of Open Access Journals (Sweden)

    Chan Gook Park

    2014-05-01

    Full Text Available This paper introduces a design and implementation of a base station, capable of positioning sensor nodes using an optical scheme. The base station consists of a pulse laser module, optical detectors and beam splitter, which are mounted on a rotation-stage, and a Time to Digital Converter (TDC. The optical pulse signal transmitted to the sensor node with a Corner Cube Retro-reflector (CCR is reflected to the base station, and the Time of Flight (ToF data can be obtained from the two detectors. With the angle and flight time data, the position of the sensor node can be calculated. The performance of the system is evaluated by using a commercial CCR. The sensor nodes are placed at different angles from the base station and scanned using the laser. We analyze the node position error caused by the rotation and propose error compensation methods, namely the outlier sample exception and decreasing the confidence factor steadily using the recursive least square (RLS methods. Based on the commercial CCR results, the MEMS CCR is also tested to demonstrate the compatibility between the base station and the proposed methods. The result shows that the localization performance of the system can be enhanced with the proposed compensation method using the MEMS CCR.

  12. 3D Integration of MEMS and IC: Design, technology and simulations

    OpenAIRE

    Schjølberg-Henriksen, Kari

    2009-01-01

    * 3D integration: Opportunities and trends* e-CUBES: Tire pressure monitoring system (TPMS)* Package design including thermo-mechanical modeling* Technology development* Sensor packaging concept* Gold stud bump bonding* Device characterization and testing* Summary and outlook 3D Integration of MEMS and IC: Design, technology and simulations

  13. Enhancement of Frequency Stability Using Synchronization of a Cantilever Array for MEMS-Based Sensors

    Directory of Open Access Journals (Sweden)

    Francesc Torres

    2016-10-01

    Full Text Available Micro and nano electromechanical resonators have been widely used as single or multiple-mass detection sensors. Smaller devices with higher resonance frequencies and lower masses offer higher mass responsivities but suffer from lower frequency stability. Synchronization phenomena in multiple MEMS resonators have become an important issue because they allow frequency stability improvement, thereby preserving mass responsivity. The authors present an array of five cantilevers (CMOS-MEMS system that are forced to vibrate synchronously to enhance their frequency stability. The frequency stability has been determined in closed-loop configuration for long periods of time by calculating the Allan deviation. An Allan deviation of 0.013 ppm (@ 1 s averaging time for a 1 MHz cantilever array MEMS system was obtained at the synchronized mode, which represents a 23-fold improvement in comparison with the non-synchronized operation mode (0.3 ppm.

  14. MEMS capacitive accelerometer-based middle ear microphone.

    Science.gov (United States)

    Young, Darrin J; Zurcher, Mark A; Semaan, Maroun; Megerian, Cliff A; Ko, Wen H

    2012-12-01

    The design, implementation, and characterization of a microelectromechanical systems (MEMS) capacitive accelerometer-based middle ear microphone are presented in this paper. The microphone is intended for middle ear hearing aids as well as future fully implantable cochlear prosthesis. Human temporal bones acoustic response characterization results are used to derive the accelerometer design requirements. The prototype accelerometer is fabricated in a commercial silicon-on-insulator (SOI) MEMS process. The sensor occupies a sensing area of 1 mm × 1 mm with a chip area of 2 mm × 2.4 mm and is interfaced with a custom-designed low-noise electronic IC chip over a flexible substrate. The packaged sensor unit occupies an area of 2.5 mm × 6.2 mm with a weight of 25 mg. The sensor unit attached to umbo can detect a sound pressure level (SPL) of 60 dB at 500 Hz, 35 dB at 2 kHz, and 57 dB at 8 kHz. An improved sound detection limit of 34-dB SPL at 150 Hz and 24-dB SPL at 500 Hz can be expected by employing start-of-the-art MEMS fabrication technology, which results in an articulation index of approximately 0.76. Further micro/nanofabrication technology advancement is needed to enhance the microphone sensitivity for improved understanding of normal conversational speech.

  15. MEMS based Low Cost Piezoresistive Microcantilever Force Sensor and Sensor Module.

    Science.gov (United States)

    Pandya, H J; Kim, Hyun Tae; Roy, Rajarshi; Desai, Jaydev P

    2014-03-01

    In the present work, we report fabrication and characterization of a low-cost MEMS based piezoresistive micro-force sensor with SU-8 tip using laboratory made silicon-on-insulator (SOI) substrate. To prepare SOI wafer, silicon film (0.8 µm thick) was deposited on an oxidized silicon wafer using RF magnetron sputtering technique. The films were deposited in Argon (Ar) ambient without external substrate heating. The material characteristics of the sputtered deposited silicon film and silicon film annealed at different temperatures (400-1050°C) were studied using atomic force microscopy (AFM) and X-ray diffraction (XRD) techniques. The residual stress of the films was measured as a function of annealing temperature. The stress of the as-deposited films was observed to be compressive and annealing the film above 1050°C resulted in a tensile stress. The stress of the film decreased gradually with increase in annealing temperature. The fabricated cantilevers were 130 µm in length, 40 µm wide and 1.0 µm thick. A series of force-displacement curves were obtained using fabricated microcantilever with commercial AFM setup and the data were analyzed to get the spring constant and the sensitivity of the fabricated microcantilever. The measured spring constant and sensitivity of the sensor was 0.1488N/m and 2.7mV/N. The microcantilever force sensor was integrated with an electronic module that detects the change in resistance of the sensor with respect to the applied force and displays it on the computer screen.

  16. MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics

    Science.gov (United States)

    Marek, Jiri; Gómez, Udo-Martin

    MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving

  17. MEMS CHIP CO2 SENSOR FOR BUILDING SYSTEMS INTEGRATION

    Energy Technology Data Exchange (ETDEWEB)

    Anton Carl Greenwald

    2005-09-14

    The objective of this research was to develop an affordable, reliable sensor to enable demand controlled ventilation (DCV). A significant portion of total energy consumption in the United States is used for heating or air conditioning (HVAC) buildings. To assure occupant safety and fresh air levels in large buildings, and especially those with sealed windows, HVAC systems are frequently run in excess of true requirements as automated systems cannot now tell the occupancy level of interior spaces. If such a sensor (e.g. thermostat sized device) were available, it would reduce energy use between 10 and 20% in such buildings. A quantitative measure of ''fresh air'' is the concentration of carbon dioxide (CO{sub 2}) present. An inert gas, CO{sub 2} is not easily detected by chemical sensors and is usually measured by infrared spectroscopy. Ion Optics research developed a complete infrared sensor package on a single MEMS chip. It contains the infrared (IR) source, IR detector and IR filter. The device resulting from this DOE sponsored research has sufficient sensitivity, lifetime, and drift rate to meet the specifications of commercial instrument manufacturers who are now testing the device for use in their building systems.

  18. Converting MEMS technology into profits

    Science.gov (United States)

    Bryzek, Janusz

    1998-08-01

    This paper discusses issues related to transitioning a company from the advanced technology development phase (with a particular focus on MEMS) to a profitable business, with emphasis on start-up companies. It includes several case studies from (primarily) NovaSensor MEMS development history. These case studies illustrate strategic problems with which advanced MEMS technology developers have to be concerned. Conclusions from these case studies could be used as checkpoints for future MEMS developers to increase probability of profitable operations. The objective for this paper is to share the author's experience from multiple MEMS start-ups to accelerate development of the MEMS market by focusing state- of-the-art technologists on marketing issues.

  19. Design and Fabrication of a Piezoresistive Pressure Sensor for Ultra High Temperature Environment

    International Nuclear Information System (INIS)

    Zhao, L B; Zhao, Y L; Jiang, Z D

    2006-01-01

    In order to solve the pressure measurement problem in the harsh environment, a piezoresistive pressure sensor has been developed, which can be used under high temperature above 200 deg. C and is able to endure instantaneous ultra high temperature (2000deg. C, duration≤2s) impact. Based on the MEMS (Micro Electro-Mechanical System) and integrated circuit technology, the piezoresistive pressure sensor's sensitive element was fabricated and constituted by silicon substrate, a thin buried silicon dioxide layer, four p-type resistors in the measuring circuit layer by boron ion implantation and photolithography, the top SiO2 layer by oxidation, stress matching Si3N4 layer, and a Ti-Pt-Au beam lead layer for connecting p-type resistors by sputtering. In order to decrease the leak-current influence to sensor in high temperature above 200deg. C, the buried SiO2 layer with the thickness 367 nm was fabricated by the SIMOX (Separation by Implantation of Oxygen) technology, which was instead of p-n junction to isolate the upper measuring circuit layer from Si substrate. In order to endure instantaneous ultra high temperature impact, the mechanical structure with cantilever and diaphragm and transmitting beam was designed. By laser welding and high temperature packaging technology, the high temperature piezoresistive pressure sensor was fabricated with range of 120MPa. After the thermal compensation, the sensor's thermal zero drift k 0 and thermal sensitivity drift k s were easy to be less than 3x10 -4 FS/deg. C. The experimental results show that the developed piezoresistive pressure sensor has good performances under high temperature and is able to endure instantaneous ultra high temperature impact, which meets the requirements of modern industry, such as aviation, oil, engine, etc

  20. Wireless, Ultra-Low-Power Implantable Sensor for Chronic Bladder Pressure Monitoring.

    Science.gov (United States)

    Majerus, Steve J A; Garverick, Steven L; Suster, Michael A; Fletter, Paul C; Damaser, Margot S

    2012-06-01

    The wireless implantable/intracavity micromanometer (WIMM) system was designed to fulfill the unmet need for a chronic bladder pressure sensing device in urological fields such as urodynamics for diagnosis and neuromodulation for bladder control. Neuromodulation in particular would benefit from a wireless bladder pressure sensor which could provide real-time pressure feedback to an implanted stimulator, resulting in greater bladder capacity while using less power. The WIMM uses custom integrated circuitry, a MEMS transducer, and a wireless antenna to transmit pressure telemetry at a rate of 10 Hz. Aggressive power management techniques yield an average current draw of 9 μ A from a 3.6-Volt micro-battery, which minimizes the implant size. Automatic pressure offset cancellation circuits maximize the sensing dynamic range to account for drifting pressure offset due to environmental factors, and a custom telemetry protocol allows transmission with minimum overhead. Wireless operation of the WIMM has demonstrated that the external receiver can receive the telemetry packets, and the low power consumption allows for at least 24 hours of operation with a 4-hour wireless recharge session.

  1. Cryogenic, Absolute, High Pressure Sensor

    Science.gov (United States)

    Chapman, John J. (Inventor); Shams. Qamar A. (Inventor); Powers, William T. (Inventor)

    2001-01-01

    A pressure sensor is provided for cryogenic, high pressure applications. A highly doped silicon piezoresistive pressure sensor is bonded to a silicon substrate in an absolute pressure sensing configuration. The absolute pressure sensor is bonded to an aluminum nitride substrate. Aluminum nitride has appropriate coefficient of thermal expansion for use with highly doped silicon at cryogenic temperatures. A group of sensors, either two sensors on two substrates or four sensors on a single substrate are packaged in a pressure vessel.

  2. Cryogenic High Pressure Sensor Module

    Science.gov (United States)

    Chapman, John J. (Inventor); Shams, Qamar A. (Inventor); Powers, William T. (Inventor)

    1999-01-01

    A pressure sensor is provided for cryogenic, high pressure applications. A highly doped silicon piezoresistive pressure sensor is bonded to a silicon substrate in an absolute pressure sensing configuration. The absolute pressure sensor is bonded to an aluminum nitride substrate. Aluminum nitride has appropriate coefficient of thermal expansion for use with highly doped silicon at cryogenic temperatures. A group of sensors, either two sensors on two substrates or four sensors on a single substrate are packaged in a pressure vessel.

  3. Artificial Roughness Encoding with a Bio-inspired MEMS-based Tactile Sensor Array

    Directory of Open Access Journals (Sweden)

    Calogero Maria Oddo

    2009-04-01

    Full Text Available A compliant 2x2 tactile sensor array was developed and investigated for roughness encoding. State of the art cross shape 3D MEMS sensors were integrated with polymeric packaging providing in total 16 sensitive elements to external mechanical stimuli in an area of about 20 mm2, similarly to the SA1 innervation density in humans. Experimental analysis of the bio-inspired tactile sensor array was performed by using ridged surfaces, with spatial periods from 2.6 mm to 4.1 mm, which were indented with regulated 1N normal force and stroked at constant sliding velocity from 15 mm/s to 48 mm/s. A repeatable and expected frequency shift of the sensor outputs depending on the applied stimulus and on its scanning velocity was observed between 3.66 Hz and 18.46 Hz with an overall maximum error of 1.7%. The tactile sensor could also perform contact imaging during static stimulus indentation. The experiments demonstrated the suitability of this approach for the design of a roughness encoding tactile sensor for an artificial fingerpad.

  4. Spring constant measurement using a MEMS force and displacement sensor utilizing paralleled piezoresistive cantilevers

    Science.gov (United States)

    Kohyama, Sumihiro; Takahashi, Hidetoshi; Yoshida, Satoru; Onoe, Hiroaki; Hirayama-Shoji, Kayoko; Tsukagoshi, Takuya; Takahata, Tomoyuki; Shimoyama, Isao

    2018-04-01

    This paper reports on a method to measure a spring constant on site using a micro electro mechanical systems (MEMS) force and displacement sensor. The proposed sensor consists of a force-sensing cantilever and a displacement-sensing cantilever. Each cantilever is composed of two beams with a piezoresistor on the sidewall for measuring the in-plane lateral directional force and displacement. The force resolution and displacement resolution of the fabricated sensor were less than 0.8 µN and 0.1 µm, respectively. We measured the spring constants of two types of hydrogel microparticles to demonstrate the effectiveness of the proposed sensor, with values of approximately 4.3 N m-1 and 15.1 N m-1 obtained. The results indicated that the proposed sensor is effective for on-site spring constant measurement.

  5. Evolution of a MEMS Photoacoustic Chemical Sensor

    National Research Council Canada - National Science Library

    Pellegrino, Paul M; Polcawich, Ronald G

    2003-01-01

    .... Initial MEMS work is centered on fabrication of a lead zirconate titanate (PZT) microphone subsystem to be incorporated in the full photoacoustic device. Preliminary results were very positive for the macro-photoacoustic cell, PZT membrane microphones design / fabrication and elementary monolithic MEMS photoacoustic cavity.

  6. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  7. Micromachined sensor for stress measurement and micromechanical study of free-standing thin films for MEMS applications

    Science.gov (United States)

    Zhang, Ping

    Microelectromechanical systems (MEMS) have a wide range of applications. In the field of wireless and microwave technology, considerable attention has been given to the development and integration of MEMS-based RF (radio frequency) components. An RF MEMS switch requires low insertion loss, high isolation, and low actuation voltage - electrical aspects that have been extensively studied. The mechanical requirements of the switch, such as low sensitivity to built-in stress and high reliability, greatly depend on the micromechanical properties of the switch materials, and have not been thoroughly explored. RF MEMS switches are typically in the form of a free-standing thin film structure. Large stress gradients and across-wafer stress variations developed during fabrication severely degrade their electrical performance. A micromachined stress measurement sensor has been developed that can potentially be employed for in-situ monitoring of stress evolution and stress variation. The sensors were micromachined using five masks on two wafer levels, each measuring 5x3x1 mm. They function by means of an electron tunneling mechanism, where a 2x2 mm silicon nitride membrane elastically deflects under an applied deflection voltage via an external feedback circuitry. For the current design, the sensors are capable of measuring tensile stresses up to the GPa range under deflection voltages of 50--100 V. Sensor functionality was studied by finite element modeling and a theoretical analysis of square membrane deflection. While the mechanical properties of thin films on substrates have been extensively studied, studies of free-standing thin films have been limited due to the practical difficulties in sample handling and testing. Free-standing Al and Al-Ti thin films specimens have been successfully fabricated and microtensile and stress relaxation tests have been performed using a custom-designed micromechanical testing apparatus. A dedicated TEM (transmission electron microscopy

  8. Micromachined pressure/flow-sensor

    NARCIS (Netherlands)

    Oosterbroek, R.E.; Lammerink, Theodorus S.J.; Berenschot, Johan W.; Krijnen, Gijsbertus J.M.; Elwenspoek, Michael Curt; van den Berg, Albert

    1999-01-01

    The micromechanical equivalent of a differential pressure flow-sensor, well known in macro mechanics, is discussed. Two separate pressure sensors are used for the device, enabling to measure both, pressure as well as volume flow-rate. An integrated sensor with capacitive read-out as well as a

  9. MEMS sensors and wireless telemetry for distributed systems

    Energy Technology Data Exchange (ETDEWEB)

    Britton, C.L. Jr.; Warmack, R.J.; Smith, S.F. [and others

    1998-02-01

    Selectively coated cantilevers are being developed at ORNL for chemical and biological sensing. The sensitivity can exceed that of other electro-mechanical devices as parts-per-trillion detection can be demonstrated for certain species. The authors are now proceeding to develop systems that employ electrically readable microcantilevers in a standard MEMS process and standard CMOS processes. One of their primary areas of interest is chemical sensing for environmental applications. Towards this end, they are presently developing electronic readout of a mercury-sensitive coated cantilever. In order to field arrays of distributed sensors, a wireless network for data reporting is needed. For this, the authors are developing on-chip spread-spectrum encoding and modulation circuitry to improve the robustness and security of sensor data in typical interference- and multipath-impaired environments. They have also provided for a selection of distinct spreading codes to serve groups of sensors in a common environment by the application of code-division multiple-access techniques. Most of the RF circuitry they have designed and fabricated in 0.5 {micro}m CMOS has been tested and verified operational to above 1 GHz. The initial intended operation is for use in the 915 MHz Industrial, Scientific, and Medical (ISM) band. This paper presents measured data on the microcantilever-based mercury detector. They also present design data and measurements of the RF telemetry chip.

  10. An electrokinetic pressure sensor

    International Nuclear Information System (INIS)

    Kim, Dong-Kwon; Kim, Sung Jin; Kim, Duckjong

    2008-01-01

    A new concept for a micro pressure sensor is demonstrated. The pressure difference between the inlet and the outlet of glass nanochannels is obtained by measuring the electrokinetically generated electric potential. To demonstrate the proposed concept, experimental investigations are performed for 100 nm wide nanochannels with sodium chloride solutions having various concentrations. The proposed pressure sensor is able to measure the pressure difference within a 10% deviation from linearity. The sensitivity of the electrokinetic pressure sensor with 10 −5 M sodium chloride solution is 18.5 µV Pa −1 , which is one order of magnitude higher than that of typical diaphragm-based pressure sensors. A numerical model is presented for investigating the effects of the concentration and the channel width on the sensitivity of the electrokinetic pressure sensor. Numerical results show that the sensitivity increases as the concentration decreases and the channel width increases

  11. Pick-and-place process for sensitivity improvement of the capacitive type CMOS MEMS 2-axis tilt sensor

    Science.gov (United States)

    Chang, Chun-I.; Tsai, Ming-Han; Liu, Yu-Chia; Sun, Chih-Ming; Fang, Weileun

    2013-09-01

    This study exploits the foundry available complimentary metal-oxide-semiconductor (CMOS) process and the packaging house available pick-and-place technology to implement a capacitive type micromachined 2-axis tilt sensor. The suspended micro mechanical structures such as the spring, stage and sensing electrodes are fabricated using the CMOS microelectromechanical systems (MEMS) processes. A bulk block is assembled onto the suspended stage by pick-and-place technology to increase the proof-mass of the tilt sensor. The low temperature UV-glue dispensing and curing processes are employed to bond the block onto the stage. Thus, the sensitivity of the CMOS MEMS capacitive type 2-axis tilt sensor is significantly improved. In application, this study successfully demonstrates the bonding of a bulk solder ball of 100 µm in diameter with a 2-axis tilt sensor fabricated using the standard TSMC 0.35 µm 2P4M CMOS process. Measurements show the sensitivities of the 2-axis tilt sensor are increased for 2.06-fold (x-axis) and 1.78-fold (y-axis) after adding the solder ball. Note that the sensitivity can be further improved by reducing the parasitic capacitance and the mismatch of sensing electrodes caused by the solder ball.

  12. Advanced mechatronics and MEMS devices II

    CERN Document Server

    Wei, Bin

    2017-01-01

    This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intel...

  13. Design and Fabrication of a Miniaturized GMI Magnetic Sensor Based on Amorphous Wire by MEMS Technology

    Directory of Open Access Journals (Sweden)

    Jiawen Chen

    2018-03-01

    Full Text Available A miniaturized Co-based amorphous wire GMI (Giant magneto-impedance magnetic sensor was designed and fabricated in this paper. The Co-based amorphous wire was used as the sense element due to its high sensitivity to the magnetic field. A three-dimensional micro coil surrounding the Co-based amorphous wire was fabricated by MEMS (Micro-Electro-Mechanical System technology, which was used to extract the electrical signal. The three-dimensional micro pick-up coil was designed and simulated with HFSS (High Frequency Structure Simulator software to determine the key parameters. Surface micro machining MEMS (Micro-Electro-Mechanical System technology was employed to fabricate the three-dimensional coil. The size of the developed amorphous wire magnetic sensor is 5.6 × 1.5 × 1.1 mm3. Helmholtz coil was used to characterize the performance of the device. The test results of the sensor sample show that the voltage change is 130 mV/Oe and the linearity error is 4.83% in the range of 0~45,000 nT. The results indicate that the developed miniaturized magnetic sensor has high sensitivity. By testing the electrical resistance of the samples, the results also showed high uniformity of each device.

  14. Fabrication and Characterization of a Micro Methanol Sensor Using the CMOS-MEMS Technique

    Directory of Open Access Journals (Sweden)

    Chien-Fu Fong

    2015-10-01

    Full Text Available A methanol microsensor integrated with a micro heater manufactured using the complementary metal oxide semiconductor (CMOS-microelectromechanical system (MEMS technique was presented. The sensor has a capability of detecting low concentration methanol gas. Structure of the sensor is composed of interdigitated electrodes, a sensitive film and a heater. The heater located under the interdigitated electrodes is utilized to provide a working temperature to the sensitive film. The sensitive film prepared by the sol-gel method is tin dioxide doped cadmium sulfide, which is deposited on the interdigitated electrodes. To obtain the suspended structure and deposit the sensitive film, the sensor needs a post-CMOS process to etch the sacrificial silicon dioxide layer and silicon substrate. The methanol senor is a resistive type. A readout circuit converts the resistance variation of the sensor into the output voltage. The experimental results show that the methanol sensor has a sensitivity of 0.18 V/ppm.

  15. Fabrication and Characterization of a Micro Methanol Sensor Using the CMOS-MEMS Technique.

    Science.gov (United States)

    Fong, Chien-Fu; Dai, Ching-Liang; Wu, Chyan-Chyi

    2015-10-23

    A methanol microsensor integrated with a micro heater manufactured using the complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technique was presented. The sensor has a capability of detecting low concentration methanol gas. Structure of the sensor is composed of interdigitated electrodes, a sensitive film and a heater. The heater located under the interdigitated electrodes is utilized to provide a working temperature to the sensitive film. The sensitive film prepared by the sol-gel method is tin dioxide doped cadmium sulfide, which is deposited on the interdigitated electrodes. To obtain the suspended structure and deposit the sensitive film, the sensor needs a post-CMOS process to etch the sacrificial silicon dioxide layer and silicon substrate. The methanol senor is a resistive type. A readout circuit converts the resistance variation of the sensor into the output voltage. The experimental results show that the methanol sensor has a sensitivity of 0.18 V/ppm.

  16. An alternative sensor fusion method for object orientation using low-cost MEMS inertial sensors

    Science.gov (United States)

    Bouffard, Joshua L.

    This thesis develops an alternative sensor fusion approach for object orientation using low-cost MEMS inertial sensors. The alternative approach focuses on the unique challenges of small UAVs. Such challenges include the vibrational induced noise onto the accelerometer and bias offset errors of the rate gyroscope. To overcome these challenges, a sensor fusion algorithm combines the measured data from the accelerometer and rate gyroscope to achieve a single output free from vibrational noise and bias offset errors. One of the most prevalent sensor fusion algorithms used for orientation estimation is the Extended Kalman filter (EKF). The EKF filter performs the fusion process by first creating the process model using the nonlinear equations of motion and then establishing a measurement model. With the process and measurement models established, the filter operates by propagating the mean and covariance of the states through time. The success of EKF relies on the ability to establish a representative process and measurement model of the system. In most applications, the EKF measurement model utilizes the accelerometer and GPS-derived accelerations to determine an estimate of the orientation. However, if the GPS-derived accelerations are not available then the measurement model becomes less reliable when subjected to harsh vibrational environments. This situation led to the alternative approach, which focuses on the correlation between the rate gyroscope and accelerometer-derived angle. The correlation between the two sensors then determines how much the algorithm will use one sensor over the other. The result is a measurement that does not suffer from the vibrational noise or from bias offset errors.

  17. Miniaturization of components and systems for space using MEMS-technology

    Science.gov (United States)

    Grönland, Tor-Arne; Rangsten, Pelle; Nese, Martin; Lang, Martin

    2007-06-01

    of this micropropulsion system is that all critical components such as thrust chamber/nozzle assembly including internal heaters, valves and filters are manufactured using MEMS technology. Moreover, miniaturized pressure sensors, relying on MEMS technology, is also part of the system as a self-standing component. The flight opportunity on PRISMA represents one of the few and thus important opportunities to demonstrate MEMS technology in space. The present paper aims at describing this development effort and highlights the benefits of miniaturized components and systems for space using MEMS technology.

  18. Design of pressure-sensing diaphragm for MEMS capacitance diaphragm gauge considering size effect

    Science.gov (United States)

    Li, Gang; Li, Detian; Cheng, Yongjun; Sun, Wenjun; Han, Xiaodong; Wang, Chengxiang

    2018-03-01

    MEMS capacitance diaphragm gauge with a full range of (1˜1000) Pa is considered for its wide application prospect. The design of pressure-sensing diaphragm is the key to achieve balanced performance for this kind of gauges. The optimization process of the pressure-sensing diaphragm with island design of a capacitance diaphragm gauge based on MEMS technique has been reported in this work. For micro-components in micro scale range, mechanical properties are very different from that in the macro scale range, so the size effect should not be ignored. The modified strain gradient elasticity theory considering size effect has been applied to determine the bending rigidity of the pressure-sensing diaphragm, which is then used in the numerical model to calculate the deflection-pressure relation of the diaphragm. According to the deflection curves, capacitance variation can be determined by integrating over the radius of the diaphragm. At last, the design of the diaphragm has been optimized based on three parameters: sensitivity, linearity and ground capacitance. With this design, a full range of (1˜1000) Pa can be achieved, meanwhile, balanced sensitivity, resolution and linearity can be kept.

  19. The Sandia MEMS Passive Shock Sensor : FY08 testing for functionality, model validation, and technology readiness.

    Energy Technology Data Exchange (ETDEWEB)

    Walraven, Jeremy Allen; Blecke, Jill; Baker, Michael Sean; Clemens, Rebecca C.; Mitchell, John Anthony; Brake, Matthew Robert; Epp, David S.; Wittwer, Jonathan W.

    2008-10-01

    This report summarizes the functional, model validation, and technology readiness testing of the Sandia MEMS Passive Shock Sensor in FY08. Functional testing of a large number of revision 4 parts showed robust and consistent performance. Model validation testing helped tune the models to match data well and identified several areas for future investigation related to high frequency sensitivity and thermal effects. Finally, technology readiness testing demonstrated the integrated elements of the sensor under realistic environments.

  20. Highly Integrated MEMS-ASIC Sensing System for Intracorporeal Physiological Condition Monitoring.

    Science.gov (United States)

    Xue, Ning; Wang, Chao; Liu, Cunxiu; Sun, Jianhai

    2018-01-02

    In this paper, a highly monolithic-integrated multi-modality sensor is proposed for intracorporeal monitoring. The single-chip sensor consists of a solid-state based temperature sensor, a capacitive based pressure sensor, and an electrochemical oxygen sensor with their respective interface application-specific integrated circuits (ASICs). The solid-state-based temperature sensor and the interface ASICs were first designed and fabricated based on a 0.18-μm 1.8-V CMOS (complementary metal-oxide-semiconductor) process. The oxygen sensor and pressure sensor were fabricated by the standard CMOS process and subsequent CMOS-compatible MEMS (micro-electromechanical systems) post-processing. The multi-sensor single chip was completely sealed by the nafion, parylene, and PDMS (polydimethylsiloxane) layers for biocompatibility study. The size of the compact sensor chip is only 3.65 mm × 1.65 mm × 0.72 mm. The functionality, stability, and sensitivity of the multi-functional sensor was tested ex vivo. Cytotoxicity assessment was performed to verify that the bio-compatibility of the device is conforming to the ISO 10993-5:2009 standards. The measured sensitivities of the sensors for the temperature, pressure, and oxygen concentration are 10.2 mV/°C, 5.58 mV/kPa, and 20 mV·L/mg, respectively. The measurement results show that the proposed multi-sensor single chip is suitable to sense the temperature, pressure, and oxygen concentration of human tissues for intracorporeal physiological condition monitoring.

  1. Development of thin film encapsulation process for piezoresistive MEMS gyroscope with wide gaps

    Science.gov (United States)

    Ayanoor-Vitikkate, Vipin

    The gyroscope is an inertial sensor used to measure the angular rate of a rotating object. This helps to determine the pitch and yaw rate of any moving body. A number of applications have been developed for consumer and automotive markets, for e.g. vehicle stability control, navigation assist, roll over detection. These are primarily used in high-end cars, where cost is not a major factor. Other areas where a MEMS Gyro can be used are robotics, camcorder stabilization, virtual reality, and more. Primarily due to cost and the size most of these applications have not reached any significant volume. One reason for this is the relatively high cost of MEMS gyros compared to other MEMS sensors like accelerometers or pressure sensors. Generally the cost of packaging a MEMS sensor is about 85-90% of the total cost. Currently most MEMS based gyroscopes are made using bulk or surface micromachining, after which they are packaged using wafer bonding. This unfortunately leads to wastage of silicon and increase in the package size, thus reducing the yield. One way to reduce the cost of packaging is by wafer scale thin film encapsulation of MEMS gyroscopes. The goal of the present work is to fabricate a rate grade MEMS gyroscope and encapsulate it by modifying an existing thin-film encapsulation technique. Packaging is an important step towards commercialization of the device and we plan to use thin wafer scale encapsulation technique developed previously in our group to package these devices. The silicon micro machined gyroscope will be fabricated on SOI (Silicon-on-Insulator) wafers using Bosch DRIE etching techniques. The encapsulation of the device is carried out using epitaxial polysilicon in order to provide a high vacuum inside the device chamber. The advantages offered by this technique are the reduction in area of the die and thus less silicon surface is wasted. In addition to this the encapsulation technique helps in creating a vacuum inside the micro device, which

  2. Micro Coriolis mass flow sensor with integrated resistive pressure sensors

    NARCIS (Netherlands)

    Groenesteijn, Jarno; Alveringh, Dennis; Schut, Thomas; Wiegerink, Remco J.; Sparreboom, Wouter; Lötters, Joost Conrad

    2017-01-01

    We report on novel resistive pressure sensors, integrated on-chip at the inlet- and outlet-channels of a micro Coriolis mass flow sensor. The pressure sensors can be used to measure the pressure drop over the Coriolis sensor which can be used to compensate pressure-dependent behaviour that might

  3. Integration of nanostructured materials with MEMS microhotplate platforms to enhance chemical sensor performance

    International Nuclear Information System (INIS)

    Benkstein, Kurt D.; Martinez, Carlos J.; Li, Guofeng; Meier, Douglas C.; Montgomery, Christopher B.; Semancik, Steve

    2006-01-01

    The development of miniaturized chemical sensors is an increasingly active area of research. Such devices, particularly when they feature low mass and low power budgets, can impact a broad range of applications including industrial process monitoring, building security and extraterrestrial exploration. Nanostructured materials, because of their high surface area, can provide critical enhancements in the performance of chemical microsensors. We have worked to integrate nanomaterial films with MEMS (microelectromechanical systems) microhotplate platforms developed at the National Institute of Standards and Technology in order to gain the benefits of both the materials and the platforms in high-performance chemical sensor arrays. Here, we describe our success in overcoming the challenges of integration and the benefits that we have achieved with regard to the critical sensor performance characteristics of sensor response, speed, stability and selectivity. Nanostructured metal oxide sensing films were locally deposited onto microhotplates via chemical vapor deposition and microcapillary pipetting, and conductive polymer nanoparticle films were deposited via electrophoretic patterning. All films were characterized by scanning electron microscopy and evaluated as conductometric gas sensors

  4. Micro-fabricated all optical pressure sensors

    DEFF Research Database (Denmark)

    Havreland, Andreas Spandet; Petersen, Søren Dahl; Østergaard, Christian

    2017-01-01

    Optical pressure sensors can operate in certain harsh application areas where the electrical pressure sensors cannot. However, the sensitivity is often not as good for the optical sensors. This work presents an all optical pressure sensor, which is fabricated by micro fabrication techniques, where...... the sensitivity can be tuned in the fabrication process. The developed sensor design, simplifies the fabrication process leading to a lower fabrication cost, which can make the all optical pressure sensors more competitive towards their electrical counterpart. The sensor has shown promising results and a linear...... pressure response has been measured with a sensitivity of 0.6nm/bar....

  5. Experimental Study of the Information Signal of Combined Shock, Tilt, and Motion Sensor Based on the 3-Axis MEMS-Accelerometer

    Directory of Open Access Journals (Sweden)

    S. A. Vasyukov

    2014-01-01

    Full Text Available Modern car alarm systems are equipped with smart sensors implemented using various physical principles. These sensors have to ensure high reliability and validity of monitored parameters with a lack of false operations. First of all, shock sensor, which is a part of, essentially, entire alarm systems, as well as tilt and motion sensors are referred to the smart sensors.Shock sensors with the sensitive elements (SE of piezoelectric, microphone, and electromagnetic types possess a number of the essential shortcomings caused by the type of SE. It is, first of all, a narrow band of the sensitive elements, which does not allow true differentiation of shocks to the autobody from false actions, as well as a various sensitivity of sensors depending on the SE axis orientation.Tilt sensors of electromagnetic type implemented as separate devices were seldom used because of their high cost and imperfect characteristics. Though there is still a need for such sensors. The specified shortcomings can be hardly overcome through improvement of sensitive element hangers of considered sensors. The use of the three-axial accelerometers made by MEMS technology seems to be the most perspective here.The article presents results of pilot studies of the accelerations reached when auto-body is under shock and a car is inclined and runs. When measuring, the test board STM32F3DISCOVERY with the MEMS accelerometer LSM303DLHS is used. A level of noise and vibrations has been analysed when mounting a board on the plastic panel of the car and when operating the engine in the range from 700 to 4000 rpm. The article presents accelerations implemented under the following conditions: light shocks in different parts of the auto-body (wing, trunk, hood; strong shock (closing a door; slow and fast acceleration to the speed of 20 km/h with the subsequent braking and passage of obstacles such as "sleeping policemen".Research results enabled us to make justification for selecting the

  6. The Sandia MEMS passive shock sensor : FY08 design summary.

    Energy Technology Data Exchange (ETDEWEB)

    Walraven, Jeremy Allen; Baker, Michael Sean; Clemens, Rebecca C.; Mitchell, John Anthony; Brake, Matthew Robert; Epp, David S.; Wittwer, Jonathan W.

    2008-11-01

    This report summarizes design and modeling activities for the MEMS passive shock sensor. It provides a description of past design revisions, including the purposes and major differences between design revisions but with a focus on Revisions 4 through 7 and the work performed in fiscal year 2008 (FY08). This report is a reference for comparing different designs; it summarizes design parameters and analysis results, and identifies test structures. It also highlights some of the changes and or additions to models previously documented [Mitchell et al. 2006, Mitchell et al. 2008] such as the way uncertainty thresholds are analyzed and reported. It also includes dynamic simulation results used to investigate how positioning of hard stops may reduce vibration sensitivity.

  7. MEMS technology sensors as a more advantageous technique for measuring foot plantar pressure and balance in humans

    OpenAIRE

    Sanz Morère, C. (Clara); Surażyński, Ł. (Łukasz); Rodrigo Pérez-Tabernero, A. (Ana); Vihriälä, E. (Erkki); Myllylä, T. (Teemu)

    2016-01-01

    Abstract Locomotor activities are part and parcel of daily human life. During walking or running, feet are subjected to high plantar pressure, leading sometimes to limb problems, pain, or foot ulceration. A current objective in foot plantar pressure measurements is developing sensors that are small in size, lightweight, and energy efficient, while enabling high mobility, particularly for wearable applications. Moreover, improvements in spatial resolution, accuracy, and sensitivity are of i...

  8. Optical Characterization of Lorentz Force Based CMOS-MEMS Magnetic Field Sensor.

    Science.gov (United States)

    Dennis, John Ojur; Ahmad, Farooq; Khir, M Haris Bin Md; Bin Hamid, Nor Hisham

    2015-07-27

    Magnetic field sensors are becoming an essential part of everyday life due to the improvements in their sensitivities and resolutions, while at the same time they have become compact, smaller in size and economical. In the work presented herein a Lorentz force based CMOS-MEMS magnetic field sensor is designed, fabricated and optically characterized. The sensor is fabricated by using CMOS thin layers and dry post micromachining is used to release the device structure and finally the sensor chip is packaged in DIP. The sensor consists of a shuttle which is designed to resonate in the lateral direction (first mode of resonance). In the presence of an external magnetic field, the Lorentz force actuates the shuttle in the lateral direction and the amplitude of resonance is measured using an optical method. The differential change in the amplitude of the resonating shuttle shows the strength of the external magnetic field. The resonance frequency of the shuttle is determined to be 8164 Hz experimentally and from the resonance curve, the quality factor and damping ratio are obtained. In an open environment, the quality factor and damping ratio are found to be 51.34 and 0.00973 respectively. The sensitivity of the sensor is determined in static mode to be 0.034 µm/mT when a current of 10 mA passes through the shuttle, while it is found to be higher at resonance with a value of 1.35 µm/mT at 8 mA current. Finally, the resolution of the sensor is found to be 370.37 µT.

  9. Organic Electroluminescent Sensor for Pressure Measurement

    Directory of Open Access Journals (Sweden)

    Tomohide Niimi

    2012-10-01

    Full Text Available We have proposed a novel concept of a pressure sensor called electroluminescent pressure sensor (ELPS based on oxygen quenching of electroluminescence. The sensor was fabricated as an organic light-emitting device (OLED with phosphorescent dyes whose phosphorescence can be quenched by oxygenmolecules, and with a polymer electrode which permeates oxygen molecules. The sensor was a single-layer OLED with Platinum (II octaethylporphine (PtOEP doped into poly(vinylcarbazole (PVK as an oxygen sensitive emissive layer and poly(3,4-ethylenedioxythiophene mixed with poly(styrenesulfonate (PEDOT:PSS as an oxygen permeating polymer anode. The pressure sensitivity of the fabricated ELPS sample was equivalent to that of the sensor excited by an illumination light source. Moreover, the pressure sensitivity of the sensor is equivalent to that of conventional pressure-sensitive paint (PSP, which is an optical pressure sensor based on photoluminescence.

  10. Assessment of fiber optic pressure sensors

    International Nuclear Information System (INIS)

    Hashemian, H.M.; Black, C.L.; Farmer, J.P.

    1995-04-01

    This report presents the results of a six-month Phase 1 study to establish the state-of-the-art in fiber optic pressure sensing and describes the design and principle of operation of various fiber optic pressure sensors. This study involved a literature review, contact with experts in the field, an industrial survey, a site visit to a fiber optic sensor manufacturer, and laboratory testing of a fiber optic pressure sensor. The laboratory work involved both static and dynamic performance tests. In addition, current requirements for environmental and seismic qualification of sensors for nuclear power plants were reviewed to determine the extent of the qualification tests that fiber optic pressure sensors may have to meet before they can be used in nuclear power plants. This project has concluded that fiber optic pressure sensors are still in the research and development stage and only a few manufacturers exist in the US and abroad which supply suitable fiber optic pressure sensors for industrial applications. Presently, fiber optic pressure sensors are mostly used in special applications for which conventional sensors are not able to meet the requirements

  11. High pressure fiber optic sensor system

    Science.gov (United States)

    Guida, Renato; Xia, Hua; Lee, Boon K; Dekate, Sachin N

    2013-11-26

    The present application provides a fiber optic sensor system. The fiber optic sensor system may include a small diameter bellows, a large diameter bellows, and a fiber optic pressure sensor attached to the small diameter bellows. Contraction of the large diameter bellows under an applied pressure may cause the small diameter bellows to expand such that the fiber optic pressure sensor may measure the applied pressure.

  12. Cupula-Inspired Hyaluronic Acid-Based Hydrogel Encapsulation to Form Biomimetic MEMS Flow Sensors.

    Science.gov (United States)

    Kottapalli, Ajay Giri Prakash; Bora, Meghali; Kanhere, Elgar; Asadnia, Mohsen; Miao, Jianmin; Triantafyllou, Michael S

    2017-07-28

    Blind cavefishes are known to detect objects through hydrodynamic vision enabled by arrays of biological flow sensors called neuromasts. This work demonstrates the development of a MEMS artificial neuromast sensor that features a 3D polymer hair cell that extends into the ambient flow. The hair cell is monolithically fabricated at the center of a 2 μm thick silicon membrane that is photo-patterned with a full-bridge bias circuit. Ambient flow variations exert a drag force on the hair cell, which causes a displacement of the sensing membrane. This in turn leads to the resistance imbalance in the bridge circuit generating a voltage output. Inspired by the biological neuromast, a biomimetic synthetic hydrogel cupula is incorporated on the hair cell. The morphology, swelling behavior, porosity and mechanical properties of the hyaluronic acid hydrogel are characterized through rheology and nanoindentation techniques. The sensitivity enhancement in the sensor output due to the material and mechanical contributions of the micro-porous hydrogel cupula is investigated through experiments.

  13. MEMS Solar Generators

    OpenAIRE

    Grbovic, Dragoslav; Osswald, Sebastian

    2011-01-01

    Approved for public release; distribution is unlimited Using MEMS bimaterial structures to build highly efficient solar energy generators. This is a novel approach that utilizes developments in the area of bimaterial sensors and applies them in the field of solar energy harvesting.

  14. A MEMS SOI-based piezoresistive fluid flow sensor

    Science.gov (United States)

    Tian, B.; Li, H. F.; Yang, H.; Song, D. L.; Bai, X. W.; Zhao, Y. L.

    2018-02-01

    In this paper, a SOI (silicon-on-insulator)-based piezoresistive fluid flow sensor is presented; the presented flow sensor mainly consists of a nylon sensing head, stainless steel cantilever beam, SOI sensor chip, printed circuit board, half-cylinder gasket, and stainless steel shell. The working principle of the sensor and some detailed contrastive analysis about the sensor structure were introduced since the nylon sensing head and stainless steel cantilever beam have distinct influence on the sensor performance; the structure of nylon sensing head and stainless steel cantilever beam is also discussed. The SOI sensor chip was fabricated using micro-electromechanical systems technologies, such as reactive ion etching and low pressure chemical vapor deposition. The designed fluid sensor was packaged and tested; a calibration installation system was purposely designed for the sensor experiment. The testing results indicated that the output voltage of the sensor is proportional to the square of the fluid flow velocity, which is coincident with the theoretical derivation. The tested sensitivity of the sensor is 3.91 × 10-4 V ms2/kg.

  15. Multifuctional integrated sensors (MFISES).

    Energy Technology Data Exchange (ETDEWEB)

    Homeijer, Brian D. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Roozeboom, Clifton [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-10-01

    Many emerging IoT applications require sensing of multiple physical and environmental parameters for: completeness of information, measurement validation, unexpected demands, improved performance. For example, a typical outdoor weather station measures temperature, humidity, barometric pressure, light intensity, rainfall, wind speed and direction. Existing sensor technologies do not directly address the demand for cost, size, and power reduction in multi-paramater sensing applications. Industry sensor manufacturers have developed integrated sensor systems for inertial measurements that combine accelerometers, gyroscopes, and magnetometers, but do not address environmental sensing functionality. In existing research literature, a technology gap exists between the functionality of MEMS sensors and the real world applications of the sensors systems.

  16. A MEMS-based Air Flow Sensor with a Free-standing Micro-cantilever Structure.

    Science.gov (United States)

    Wang, Yu-Hsiang; Lee, Chia-Yen; Chiang, Che-Ming

    2007-10-17

    This paper presents a micro-scale air flow sensor based on a free-standingcantilever structure. In the fabrication process, MEMS techniques are used to deposit asilicon nitride layer on a silicon wafer. A platinum layer is deposited on the silicon nitridelayer to form a piezoresistor, and the resulting structure is then etched to create afreestanding micro-cantilever. When an air flow passes over the surface of the cantileverbeam, the beam deflects in the downward direction, resulting in a small variation in theresistance of the piezoelectric layer. The air flow velocity is determined by measuring thechange in resistance using an external LCR meter. The experimental results indicate that theflow sensor has a high sensitivity (0.0284 ω/ms -1 ), a high velocity measurement limit (45ms -1 ) and a rapid response time (0.53 s).

  17. Mechanical and electromechanical properties of graphene and their potential application in MEMS

    International Nuclear Information System (INIS)

    Khan, Zulfiqar H; Kermany, Atieh R; Iacopi, Francesca; Öchsner, Andreas

    2017-01-01

    Graphene-based micro-electromechanical systems (MEMS) are very promising candidates for next generation miniaturized, lightweight, and ultra-sensitive devices. In this review, we review the progress to date of the assessment of the mechanical, electromechanical, and thermomechanical properties of graphene for application in graphene-based MEMS. Graphene possesses a plethora of outstanding properties—such as a 1 TPa Young’s modulus, exceptionally high 2D failure strength that stems from its sp 2 hybridization, and strong sigma bonding between carbon atoms. Such exceptional mechanical properties can enable, for example, graphene-based sound sources capable of generating sound beyond the audible range. The recently engineered piezoelectric properties of atomic force microscope tip-pressed graphene membranes or supported graphene on SiO 2 substrates, have paved the way in fabricating graphene-based nano-generators and actuators. On the other hand, graphene’s piezoresistive properties have enabled miniaturized pressure and strain sensors. 2D graphene nano-mechanical resonators can potentially measure ultralow forces, charges and potentially detect single atomic masses. The exceptional tribology of graphene can play a significant role in achieving superlubricity. In addition, the highest reported thermal conductivity of graphene is amenable for use in chips and providing better performing MEMS, as heat is efficiently dissipated. On top of that, graphene membranes could be nano-perforated to realize specialized applications like DNA translocation and desalination. Finally, to ensure stability and reliability of the graphene-based MEMS, adhesion is an important mechanical property that should be considered. In general, graphene could be used as a structural material in resonators, sensors, actuators and nano-generators with better performance and sensitivity than conventional MEMS. (topical review)

  18. Optical inspection of hidden MEMS structures

    Science.gov (United States)

    Krauter, Johann; Gronle, Marc; Osten, Wolfgang

    2017-06-01

    Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

  19. All-plastic fiber-based pressure sensor

    DEFF Research Database (Denmark)

    Bundalo, Ivan-Lazar; Lwin, Richard; Leon-Saval, Sergio

    2016-01-01

    We present a feasibility study and a prototype of an all-plastic fiber-based pressure sensor. The sensor is based on long period gratings inscribed for the first time to the best of our knowledge by a CO2 laser in polymethyl methacrylate (PMMA) microstructured fibers and coupled to a pod......-like transducer that converts pressure to strain. The sensor prototype was characterized for pressures up to 150 mbars, and various parameters related to its construction were also characterized in order to enhance sensitivity. We consider this sensor in the context of future applications in endoscopic pressure...... sensors....

  20. Laboratory validation of MEMS-based sensors for post-earthquake damage assessment image

    Science.gov (United States)

    Pozzi, Matteo; Zonta, Daniele; Santana, Juan; Colin, Mikael; Saillen, Nicolas; Torfs, Tom; Amditis, Angelos; Bimpas, Matthaios; Stratakos, Yorgos; Ulieru, Dumitru; Bairaktaris, Dimitirs; Frondistou-Yannas, Stamatia; Kalidromitis, Vasilis

    2011-04-01

    The evaluation of seismic damage is today almost exclusively based on visual inspection, as building owners are generally reluctant to install permanent sensing systems, due to their high installation, management and maintenance costs. To overcome this limitation, the EU-funded MEMSCON project aims to produce small size sensing nodes for measurement of strain and acceleration, integrating Micro-Electro-Mechanical Systems (MEMS) based sensors and Radio Frequency Identification (RFID) tags in a single package that will be attached to reinforced concrete buildings. To reduce the impact of installation and management, data will be transmitted to a remote base station using a wireless interface. During the project, sensor prototypes were produced by assembling pre-existing components and by developing ex-novo miniature devices with ultra-low power consumption and sensing performance beyond that offered by sensors available on the market. The paper outlines the device operating principles, production scheme and working at both unit and network levels. It also reports on validation campaigns conducted in the laboratory to assess system performance. Accelerometer sensors were tested on a reduced scale metal frame mounted on a shaking table, back to back with reference devices, while strain sensors were embedded in both reduced and full-scale reinforced concrete specimens undergoing increasing deformation cycles up to extensive damage and collapse. The paper assesses the economical sustainability and performance of the sensors developed for the project and discusses their applicability to long-term seismic monitoring.

  1. Electronically-Scanned Pressure Sensors

    Science.gov (United States)

    Coe, C. F.; Parra, G. T.; Kauffman, R. C.

    1984-01-01

    Sensors not pneumatically switched. Electronic pressure-transducer scanning system constructed in modular form. Pressure transducer modules and analog to digital converter module small enough to fit within cavities of average-sized wind-tunnel models. All switching done electronically. Temperature controlled environment maintained within sensor modules so accuracy maintained while ambient temperature varies.

  2. Resistive pressure sensors integrated with a Coriolis mass flow sensor

    NARCIS (Netherlands)

    Alveringh, Dennis; Schut, Thomas; Wiegerink, Remco J.; Sparreboom, Wouter; Lötters, Joost Conrad

    2017-01-01

    We report on a novel resistive pressure sensor that is completely integrated with a Coriolis mass flow sensor on one chip, without the need for extra fabrication steps or different materials. Two pressure sensors are placed in-line with the Coriolis sensor without requiring any changes to the fluid

  3. MEMS optical sensor

    DEFF Research Database (Denmark)

    2013-01-01

    The present invention relates to an all-optical sensor utilizing effective index modulation of a waveguide and detection of a wavelength shift of reflected light and a force sensing system accommodating said optical sensor. One embodiment of the invention relates to a sensor system comprising...... at least one multimode light source, one or more optical sensors comprising a multimode sensor optical waveguide accommodating a distributed Bragg reflector, at least one transmitting optical waveguide for guiding light from said at least one light source to said one or more multimode sensor optical...... waveguides, a detector for measuring light reflected from said Bragg reflector in said one or more multimode sensor optical waveguides, and a data processor adapted for analyzing variations in the Bragg wavelength of at least one higher order mode of the reflected light....

  4. HOPG/ZnO/HOPG pressure sensor

    Science.gov (United States)

    Jahangiri, Mojtaba; Yousefiazari, Ehsan; Ghalamboran, Milad

    2017-12-01

    Pressure sensor is one of the most commonly used sensors in the research laboratories and industries. These are generally categorized in three different classes of absolute pressure sensors, gauge pressure sensors, and differential pressure sensors. In this paper, we fabricate and assess the pressure sensitivity of the current vs. voltage diagrams in a graphite/ZnO/graphite structure. Zinc oxide layers are deposited on highly oriented pyrolytic graphite (HOPG) substrates by sputtering a zinc target under oxygen plasma. The top electrode is also a slice of HOPG which is placed on the ZnO layer and connected to the outside electronic circuits. By recording the I-V characteristics of the device under different forces applied to the top HOPG electrode, the pressure sensitivity is demonstrated; at the optimum biasing voltage, the device current changes 10 times upon changing the pressure level on the top electrode by 20 times. Repeatability and reproducibility of the observed effect is studied on the same and different samples. All the materials used for the fabrication of this pressure sensor are biocompatible, the fabricated device is anticipated to find potential applications in biomedical engineering.

  5. A Teaching - Learning Framework for MEMS Education

    International Nuclear Information System (INIS)

    Sheeparamatti, B G; Angadi, S A; Sheeparamatti, R B; Kadadevaramath, J S

    2006-01-01

    Micro-Electro-Mechanical Systems (MEMS) technology has been identified as one of the most promising technologies in the 21st century. MEMS technology has opened up a wide array of unforeseen applications. Hence it is necessary to train the technocrats of tomorrow in this emerging field to meet the industrial/societal demands. The drive behind fostering of MEMS technology is the reduction in the cost, size, weight, and power consumption of the sensors, actuators, and associated electronics. MEMS is a multidisciplinary engineering and basic science area which includes electrical engineering, mechanical engineering, material science and biomedical engineering. Hence MEMS education needs a special approach to prepare the technocrats for a career in MEMS. The modern education methodology using computer based training systems (CBTS) with embedded modeling and simulation tools will help in this direction. The availability of computer based learning resources such as MATLAB, ANSYS/Multiphysics and rapid prototyping tools have contributed to proposition of an efficient teaching-learning framework for MEMS education presented in this paper. This paper proposes a conceptual framework for teaching/learning MEMS in the current technical education scenario

  6. MEMS based shock pulse detection sensor for improved rotary Stirling cooler end of life prediction

    Science.gov (United States)

    Hübner, M.; Münzberg, M.

    2018-05-01

    The widespread use of rotary Stirling coolers in high performance thermal imagers used for critical 24/7 surveillance tasks justifies any effort to significantly enhance the reliability and predictable uptime of those coolers. Typically the lifetime of the whole imaging device is limited due to continuous wear and finally failure of the rotary compressor of the Stirling cooler, especially due to failure of the comprised bearings. MTTF based lifetime predictions, even based on refined MTTF models taking operational scenario dependent scaling factors into account, still lack in precision to forecast accurately the end of life (EOL) of individual coolers. Consequently preventive maintenance of individual coolers to avoid failures of the main sensor in critical operational scenarios are very costly or even useless. We have developed an integrated test method based on `Micro Electromechanical Systems', so called MEMS sensors, which significantly improves the cooler EOL prediction. The recently commercially available MEMS acceleration sensors have mechanical resonance frequencies up to 50 kHz. They are able to detect solid borne shock pulses in the cooler structure, originating from e.g. metal on metal impacts driven by periodical forces acting on moving inner parts of the rotary compressor within wear dependent slack and play. The impact driven transient shock pulse analyses uses only the high frequency signal <10kHz and differs therefore from the commonly used broadband low frequencies vibrational analysis of reciprocating machines. It offers a direct indicator of the individual state of wear. The predictive cooler lifetime model based on the shock pulse analysis is presented and results are discussed.

  7. Kalman Filters in Geotechnical Monitoring of Ground Subsidence Using Data from MEMS Sensors

    Science.gov (United States)

    Li, Cheng; Azzam, Rafig; Fernández-Steeger, Tomás M.

    2016-01-01

    The fast development of wireless sensor networks and MEMS make it possible to set up today real-time wireless geotechnical monitoring. To handle interferences and noises from the output data, Kalman filter can be selected as a method to achieve a more realistic estimate of the observations. In this paper, a one-day wireless measurement using accelerometers and inclinometers was deployed on top of a tunnel section under construction in order to monitor ground subsidence. The normal vectors of the sensors were firstly obtained with the help of rotation matrices, and then be projected to the plane of longitudinal section, by which the dip angles over time would be obtained via a trigonometric function. Finally, a centralized Kalman filter was applied to estimate the tilt angles of the sensor nodes based on the data from the embedded accelerometer and the inclinometer. Comparing the results from two sensor nodes deployed away and on the track respectively, the passing of the tunnel boring machine can be identified from unusual performances. Using this method, the ground settlement due to excavation can be measured and a real-time monitoring of ground subsidence can be realized. PMID:27447630

  8. Kalman Filters in Geotechnical Monitoring of Ground Subsidence Using Data from MEMS Sensors

    Directory of Open Access Journals (Sweden)

    Cheng Li

    2016-07-01

    Full Text Available The fast development of wireless sensor networks and MEMS make it possible to set up today real-time wireless geotechnical monitoring. To handle interferences and noises from the output data, Kalman filter can be selected as a method to achieve a more realistic estimate of the observations. In this paper, a one-day wireless measurement using accelerometers and inclinometers was deployed on top of a tunnel section under construction in order to monitor ground subsidence. The normal vectors of the sensors were firstly obtained with the help of rotation matrices, and then be projected to the plane of longitudinal section, by which the dip angles over time would be obtained via a trigonometric function. Finally, a centralized Kalman filter was applied to estimate the tilt angles of the sensor nodes based on the data from the embedded accelerometer and the inclinometer. Comparing the results from two sensor nodes deployed away and on the track respectively, the passing of the tunnel boring machine can be identified from unusual performances. Using this method, the ground settlement due to excavation can be measured and a real-time monitoring of ground subsidence can be realized.

  9. Kalman Filters in Geotechnical Monitoring of Ground Subsidence Using Data from MEMS Sensors.

    Science.gov (United States)

    Li, Cheng; Azzam, Rafig; Fernández-Steeger, Tomás M

    2016-07-19

    The fast development of wireless sensor networks and MEMS make it possible to set up today real-time wireless geotechnical monitoring. To handle interferences and noises from the output data, Kalman filter can be selected as a method to achieve a more realistic estimate of the observations. In this paper, a one-day wireless measurement using accelerometers and inclinometers was deployed on top of a tunnel section under construction in order to monitor ground subsidence. The normal vectors of the sensors were firstly obtained with the help of rotation matrices, and then be projected to the plane of longitudinal section, by which the dip angles over time would be obtained via a trigonometric function. Finally, a centralized Kalman filter was applied to estimate the tilt angles of the sensor nodes based on the data from the embedded accelerometer and the inclinometer. Comparing the results from two sensor nodes deployed away and on the track respectively, the passing of the tunnel boring machine can be identified from unusual performances. Using this method, the ground settlement due to excavation can be measured and a real-time monitoring of ground subsidence can be realized.

  10. Performance of commercial off-the-shelf microelectromechanical systems sensors in a pulsed reactor environment

    Energy Technology Data Exchange (ETDEWEB)

    Hobert, Keith Edwin [Los Alamos National Laboratory; Heger, Arlen S [Los Alamos National Laboratory; Mccready, Steven S [Los Alamos National Laboratory

    2010-07-15

    Prompted by the unexpected failure of piezoresistive sensors in both an elevated gamma-ray environment and reactor core pulse tests, we initiated radiation testing of several MEMS piezoresistive accelerometers and pressure transducers to ascertain their radiation hardness. Some commercial off-the-shelf sensors are found to be viable options for use in a high-energy pulsed reactor, but others suffer severe degradation and even catastrophic failure. Although researchers are promoting the use of MEMS devices in radiation-harsh environment, we nevertheless find assurance testing necessary.

  11. A MEMS-based Air Flow Sensor with a Free-standing Micro-cantilever Structure

    Directory of Open Access Journals (Sweden)

    Che-Ming Chiang

    2007-10-01

    Full Text Available This paper presents a micro-scale air flow sensor based on a free-standingcantilever structure. In the fabrication process, MEMS techniques are used to deposit asilicon nitride layer on a silicon wafer. A platinum layer is deposited on the silicon nitridelayer to form a piezoresistor, and the resulting structure is then etched to create afreestanding micro-cantilever. When an air flow passes over the surface of the cantileverbeam, the beam deflects in the downward direction, resulting in a small variation in theresistance of the piezoelectric layer. The air flow velocity is determined by measuring thechange in resistance using an external LCR meter. The experimental results indicate that theflow sensor has a high sensitivity (0.0284 ω/ms-1, a high velocity measurement limit (45ms-1 and a rapid response time (0.53 s.

  12. Fixture For Mounting A Pressure Sensor

    Science.gov (United States)

    Cagle, Christopher M.

    1995-01-01

    Fixture for mounting pressure sensor in aerodynamic model simplifies task of removal and replacement of sensor in event sensor becomes damaged. Makes it unnecessary to dismantle model. Also minimizes any change in aerodynamic characteristics of model in event of replacement. Removable pressure sensor installed in fixture in wall of model. Wires from sensor pass through channel under surface.

  13. Evaluation of high temperature pressure sensors

    International Nuclear Information System (INIS)

    Choi, In-Mook; Woo, Sam-Yong; Kim, Yong-Kyu

    2011-01-01

    It is becoming more important to measure the pressure in high temperature environments in many industrial fields. However, there is no appropriate evaluation system and compensation method for high temperature pressure sensors since most pressure standards have been established at room temperature. In order to evaluate the high temperature pressure sensors used in harsh environments, such as high temperatures above 250 deg. C, a specialized system has been constructed and evaluated in this study. The pressure standard established at room temperature is connected to a high temperature pressure sensor through a chiller. The sensor can be evaluated in conditions of changing standard pressures at constant temperatures and of changing temperatures at constant pressures. According to the evaluation conditions, two compensation methods are proposed to eliminate deviation due to sensitivity changes and nonlinear behaviors except thermal hysteresis.

  14. Feasibility of frequency-modulated wireless transmission for a multi-purpose MEMS-based accelerometer.

    Science.gov (United States)

    Sabato, Alessandro; Feng, Maria Q

    2014-09-05

    Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy--especially at very low frequencies--have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

  15. A 5.2GHz, 0.5mW RF powered wireless sensor with dual on-chip antennas for implantable intraocular pressure monitoring

    KAUST Repository

    Arsalan, Muhammad; Ouda, Mahmoud H.; Marnat, Loic; Ahmad, Talha Jamal; Shamim, Atif; Salama, Khaled N.

    2013-01-01

    For the first time a single chip implantable wireless sensor system for Intraocular Pressure Monitoring (IOPM) is presented. This system-on-chip (SoC) is battery-free and harvests energy from incoming RF signals. The chip is self-contained and does not require external components or bond wires to function. This 1.4mm3 SoC has separate 2.4GHz-transmit and 5.2GHz-receive antennas, an energy harvesting module, a temperature sensor, a 7-bit TIQ Flash ADC, a 4-bit RFID, a power management and control unit, and a VCO transmitter. The chip is fabricated in a standard 6-metal 0.18μm CMOS process and is designed to work with a post-processed MEMS pressure sensor. It consumes 513μW of peak power and when implanted inside the eye, it is designed to communicate with an external reader using on-off keying (OOK). © 2013 IEEE.

  16. A 5.2GHz, 0.5mW RF powered wireless sensor with dual on-chip antennas for implantable intraocular pressure monitoring

    KAUST Repository

    Arsalan, Muhammad

    2013-06-01

    For the first time a single chip implantable wireless sensor system for Intraocular Pressure Monitoring (IOPM) is presented. This system-on-chip (SoC) is battery-free and harvests energy from incoming RF signals. The chip is self-contained and does not require external components or bond wires to function. This 1.4mm3 SoC has separate 2.4GHz-transmit and 5.2GHz-receive antennas, an energy harvesting module, a temperature sensor, a 7-bit TIQ Flash ADC, a 4-bit RFID, a power management and control unit, and a VCO transmitter. The chip is fabricated in a standard 6-metal 0.18μm CMOS process and is designed to work with a post-processed MEMS pressure sensor. It consumes 513μW of peak power and when implanted inside the eye, it is designed to communicate with an external reader using on-off keying (OOK). © 2013 IEEE.

  17. All-optical pressure sensor

    DEFF Research Database (Denmark)

    2014-01-01

    The present invention relates to an all-optical pressure sensor comprising a waveguide accommodating a distributed Bragg reflector. Pressure sensing can then be provided by utilizing effective index modulation of the waveguide and detection of a wavelength shift of light reflected from the Bragg...... reflector. Sound sensing may also be provided thereby having an all-optical microphone. One embodiment of the invention relates to an optical pressure sensor comprising at least one outer membrane and a waveguide, the waveguide comprising at least one core for confining and guiding light,at least one...... distributed Bragg reflector located in said at least one core, and at least one inner deflecting element forming at least a part of the core,wherein the pressure sensor is configured such that the geometry and/or dimension of the at least one core is changed when the at least one outer membrane is submitted...

  18. High Volume Manufacturing and Field Stability of MEMS Products

    Science.gov (United States)

    Martin, Jack

    Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are

  19. MEMS for pico- to micro-satellites

    OpenAIRE

    Shea, Herbert

    2009-01-01

    MEMS sensors, actuators, and sub-systems can enable an important reduction in the size and mass of spacecrafts, first by replacing larger and heavier components, then by replacing entire subsystems, and finally by enabling the microfabrication of highly integrated picosats. Very small satellites (1 to 100 kg) stand to benefit the most from MEMS technologies. These small satellites are typically used for science or technology demonstration missions, with higher risk tolerance than multi-ton te...

  20. n+ GaAs/AuGeNi-Au Thermocouple-Type RF MEMS Power Sensors Based on Dual Thermal Flow Paths in GaAs MMIC

    Directory of Open Access Journals (Sweden)

    Zhiqiang Zhang

    2017-06-01

    Full Text Available To achieve radio frequency (RF power detection, gain control, and circuit protection, this paper presents n+ GaAs/AuGeNi-Au thermocouple-type RF microelectromechanical system (MEMS power sensors based on dual thermal flow paths. The sensors utilize a conversion principle of RF power-heat-voltage, where a thermovoltage is obtained as the RF power changes. To improve the heat transfer efficiency and the sensitivity, structures of two heat conduction paths are designed: one in which a thermal slug of Au is placed between two load resistors and hot junctions of the thermocouples, and one in which a back cavity is fabricated by the MEMS technology to form a substrate membrane underneath the resistors and the hot junctions. The improved sensors were fabricated by a GaAs monolithic microwave integrated circuit (MMIC process. Experiments show that these sensors have reflection losses of less than −17 dB up to 12 GHz. At 1, 5, and 10 GHz, measured sensitivities are about 63.45, 53.97, and 44.14 µV/mW for the sensor with the thermal slug, and about 111.03, 94.79, and 79.04 µV/mW for the sensor with the thermal slug and the back cavity, respectively.

  1. Alpha-Particle Gas-Pressure Sensor

    Science.gov (United States)

    Buehler, M. C.; Bell, L. D.; Hecht, M. H.

    1996-01-01

    An approximate model was developed to establish design curves for the saturation region and a more complete model developed to characterize the current-voltage curves for an alpha-particle pressure sensor. A simple two-parameter current-voltage expression was developed to describe the dependence of the ion current on pressure. The parameters are the saturation-current pressure coefficient and mu/D, the ion mobility/diffusion coefficient. The sensor is useful in the pressure range between 0.1 and 1000 mb using a 1 - mu Ci(241) Am source. Experimental results, taken between 1 and up to 200 mb, show the sensor operates with an anode voltage of 5 V and a sensitivity of 20 fA/mb in nitrogen.

  2. Carbon nanotube temperature and pressure sensors

    Energy Technology Data Exchange (ETDEWEB)

    Ivanov, Ilia N.; Geohegan, David B.

    2017-09-12

    The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.

  3. Carbon nanotube temperature and pressure sensors

    Science.gov (United States)

    Ivanov, Ilia N; Geohegan, David Bruce

    2013-10-29

    The present invention, in one embodiment, provides a method of measuring pressure or temperature using a sensor including a sensor element composed of a plurality of carbon nanotubes. In one example, the resistance of the plurality of carbon nanotubes is measured in response to the application of temperature or pressure. The changes in resistance are then recorded and correlated to temperature or pressure. In one embodiment, the present invention provides for independent measurement of pressure or temperature using the sensors disclosed herein.

  4. A temperature and pressure controlled calibration system for pressure sensors

    Science.gov (United States)

    Chapman, John J.; Kahng, Seun K.

    1989-01-01

    A data acquisition and experiment control system capable of simulating temperatures from -184 to +220 C and pressures either absolute or differential from 0 to 344.74 kPa is developed to characterize silicon pressure sensor response to temperature and pressure. System software is described that includes sensor data acquisition, algorithms for numerically derived thermal offset and sensitivity correction, and operation of the environmental chamber and pressure standard. This system is shown to be capable of computer interfaced cryogenic testing to within 1 C and 34.47 Pa of single channel or multiplexed arrays of silicon pressure sensors.

  5. Design and application of a metal wet-etching post-process for the improvement of CMOS-MEMS capacitive sensors

    International Nuclear Information System (INIS)

    Tsai, Ming-Han; Sun, Chih-Ming; Liu, Yu-Chia; Fang, Weileun; Wang, Chuanwei

    2009-01-01

    This study presents a process design methodology to improve the performance of a CMOS-MEMS gap-closing capacitive sensor. In addition to the standard CMOS process, the metal wet-etching approach is employed as the post-CMOS process to realize the present design. The dielectric layers of the CMOS process are exploited to form the main micro mechanical structures of the sensor. The metal layers of the CMOS process are used as the sensing electrodes and sacrificial layers. The advantages of the sensor design are as follows: (1) the parasitic capacitance is significantly reduced by the dielectric structure, (2) in-plane and out-of-plane sensing gaps can be reduced to increase the sensitivity, and (3) plate-type instead of comb-type out-of-plane sensing electrodes are available to increase the sensing electrode area. To demonstrate the feasibility of the present design, a three-axis capacitive CMOS-MEMS accelerometers chip is implemented and characterized. Measurements show that the sensitivities of accelerometers reach 11.5 mV G −1 (in the X-, Y-axes) and 7.8 mV G −1 (in the Z-axis), respectively, which are nearly one order larger than existing designs. Moreover, the detection of 10 mG excitation using the three-axis accelerometer is demonstrated for both in-plane and out-of-plane directions

  6. Distributed pressure sensors for a urethral catheter.

    Science.gov (United States)

    Ahmadi, Mahdi; Rajamani, Rajesh; Timm, Gerald; Sezen, A S

    2015-01-01

    A flexible strip that incorporates multiple pressure sensors and is capable of being fixed to a urethral catheter is developed. The urethral catheter thus instrumented will be useful for measurement of pressure in a human urethra during urodynamic testing in a clinic. This would help diagnose the causes of urinary incontinence in patients. Capacitive pressure sensors are fabricated on a flexible polyimide-copper substrate using surface micromachining processes and alignment/assembly of the top and bottom portions of the sensor strip. The developed sensor strip is experimentally evaluated in an in vitro test rig using a pressure chamber. The sensor strip is shown to have adequate sensitivity and repeatability. While the calibration factors for the sensors on the strip vary from one sensor to another, even the least sensitive sensor has a resolution better than 0.1 psi.

  7. Applications of pressure-sensitive dielectric elastomer sensors

    Science.gov (United States)

    Böse, Holger; Ocak, Deniz; Ehrlich, Johannes

    2016-04-01

    Dielectric elastomer sensors for the measurement of compression loads with high sensitivity are described. The basic design of the sensors exhibits two profiled surfaces between which an elastomer film is confined. All components of the sensor were prepared with silicone whose stiffness can be varied in a wide range. Depending on details of the sensor design, various effects contribute to the enhancement of the capacitance. The intermediate elastomer film is stretched upon compression and electrode layers on the elastomer profiles and in the elastomer film approach each other. Different designs of the pressure sensor give rise to very different sensor characteristics in terms of the dependence of electric capacitance on compression force. Due to their inherent flexibility, the pressure sensors can be used on compliant substrates such as seats or beds or on the human body. This gives rise to numerous possible applications. The contribution describes also some examples of possible sensor applications. A glove was equipped with various sensors positioned at the finger tips. When grabbing an object with the glove, the sensors can detect the gripping forces of the individual fingers with high sensitivity. In a demonstrator of the glove equipped with seven sensors, the capacitances representing the gripping forces are recorded on a display. In another application example, a lower limb prosthesis was equipped with a pressure sensor to detect the load on the remaining part of the leg and the load is displayed in terms of the measured capacitance. The benefit of such sensors is to detect an eventual overload in order to prevent possible pressure sores. A third example introduces a seat load sensor system based on four extended pressure sensor mats. The sensor system detects the load distribution of a person on the seat. The examples emphasize the high performance of the new pressure sensor technology.

  8. Intelligent pressure measurement in multiple sensor arrays

    International Nuclear Information System (INIS)

    Matthews, C.A.

    1995-01-01

    Pressure data acquisition has typically consisted of a group of sensors scanned by an electronic or mechanical multiplexer. The data accuracy was dependent upon the temperature stability of the sensors. This paper describes a new method of pressure measurement that combines individual temperature compensated pressure sensors, a microprocessor, and an A/D converter in one module. Each sensor has its own temperature characteristics stored in a look-up table to minimize sensor thermal errors. The result is an intelligent pressure module that can output temperature compensated engineering units over an Ethernet interface. Calibration intervals can be dramatically extended depending upon system accuracy requirements and calibration techniques used

  9. n⁺ GaAs/AuGeNi-Au Thermocouple-Type RF MEMS Power Sensors Based on Dual Thermal Flow Paths in GaAs MMIC.

    Science.gov (United States)

    Zhang, Zhiqiang; Liao, Xiaoping

    2017-06-17

    To achieve radio frequency (RF) power detection, gain control, and circuit protection, this paper presents n⁺ GaAs/AuGeNi-Au thermocouple-type RF microelectromechanical system (MEMS) power sensors based on dual thermal flow paths. The sensors utilize a conversion principle of RF power-heat-voltage, where a thermovoltage is obtained as the RF power changes. To improve the heat transfer efficiency and the sensitivity, structures of two heat conduction paths are designed: one in which a thermal slug of Au is placed between two load resistors and hot junctions of the thermocouples, and one in which a back cavity is fabricated by the MEMS technology to form a substrate membrane underneath the resistors and the hot junctions. The improved sensors were fabricated by a GaAs monolithic microwave integrated circuit (MMIC) process. Experiments show that these sensors have reflection losses of less than -17 dB up to 12 GHz. At 1, 5, and 10 GHz, measured sensitivities are about 63.45, 53.97, and 44.14 µ V/mW for the sensor with the thermal slug, and about 111.03, 94.79, and 79.04 µ V/mW for the sensor with the thermal slug and the back cavity, respectively.

  10. A micro-force sensor with slotted-quad-beam structure for measuring the friction in MEMS bearings.

    Science.gov (United States)

    Liu, Huan; Yang, Shuming; Zhao, Yulong; Jiang, Zhuangde; Liu, Yan; Tian, Bian

    2013-09-30

    Presented here is a slotted-quad-beam structure sensor for the measurement of friction in micro bearings. Stress concentration slots are incorporated into a conventional quad-beam structure to improve the sensitivity of force measurements. The performance comparison between the quad-beam structure sensor and the slotted-quad-beam structure sensor are performed by theoretical modeling and finite element (FE) analysis. A hollow stainless steel probe is attached to the mesa of the sensor chip by a tailor-made organic glass fixture. Concerning the overload protection of the fragile beams, a glass wafer is bonded onto the bottom of sensor chip to limit the displacement of the mesa. The calibration of the packaged device is experimentally performed by a tri-dimensional positioning stage, a precision piezoelectric ceramic and an electronic analytical balance, which indicates its favorable sensitivity and overload protection. To verify the potential of the proposed sensor being applied in micro friction measurement, a measurement platform is established. The output of the sensor reflects the friction of bearing resulting from dry friction and solid lubrication. The results accord with the theoretical modeling and demonstrate that the sensor has the potential application in measuring the micro friction force under stable stage in MEMS machines.

  11. A Micro-Force Sensor with Slotted-Quad-Beam Structure for Measuring the Friction in MEMS Bearings

    Directory of Open Access Journals (Sweden)

    Yan Liu

    2013-09-01

    Full Text Available Presented here is a slotted-quad-beam structure sensor for the measurement of friction in micro bearings. Stress concentration slots are incorporated into a conventional quad-beam structure to improve the sensitivity of force measurements. The performance comparison between the quad-beam structure sensor and the slotted-quad-beam structure sensor are performed by theoretical modeling and finite element (FE analysis. A hollow stainless steel probe is attached to the mesa of the sensor chip by a tailor-made organic glass fixture. Concerning the overload protection of the fragile beams, a glass wafer is bonded onto the bottom of sensor chip to limit the displacement of the mesa. The calibration of the packaged device is experimentally performed by a tri-dimensional positioning stage, a precision piezoelectric ceramic and an electronic analytical balance, which indicates its favorable sensitivity and overload protection. To verify the potential of the proposed sensor being applied in micro friction measurement, a measurement platform is established. The output of the sensor reflects the friction of bearing resulting from dry friction and solid lubrication. The results accord with the theoretical modeling and demonstrate that the sensor has the potential application in measuring the micro friction force under stable stage in MEMS machines.

  12. A transparent bending-insensitive pressure sensor

    Science.gov (United States)

    Lee, Sungwon; Reuveny, Amir; Reeder, Jonathan; Lee, Sunghoon; Jin, Hanbit; Liu, Qihan; Yokota, Tomoyuki; Sekitani, Tsuyoshi; Isoyama, Takashi; Abe, Yusuke; Suo, Zhigang; Someya, Takao

    2016-05-01

    Measuring small normal pressures is essential to accurately evaluate external stimuli in curvilinear and dynamic surfaces such as natural tissues. Usually, sensitive and spatially accurate pressure sensors are achieved through conformal contact with the surface; however, this also makes them sensitive to mechanical deformation (bending). Indeed, when a soft object is pressed by another soft object, the normal pressure cannot be measured independently from the mechanical stress. Here, we show a pressure sensor that measures only the normal pressure, even under extreme bending conditions. To reduce the bending sensitivity, we use composite nanofibres of carbon nanotubes and graphene. Our simulations show that these fibres change their relative alignment to accommodate bending deformation, thus reducing the strain in individual fibres. Pressure sensitivity is maintained down to a bending radius of 80 μm. To test the suitability of our sensor for soft robotics and medical applications, we fabricated an integrated sensor matrix that is only 2 μm thick. We show real-time (response time of ∼20 ms), large-area, normal pressure monitoring under different, complex bending conditions.

  13. MEMS for Space Flight Applications

    Science.gov (United States)

    Lawton, R.

    1998-01-01

    Micro-Electrical Mechanical Systems (MEMS) are entering the stage of design and verification to demonstrate the utility of the technology for a wide range of applications including sensors and actuators for military, space, medical, industrial, consumer, automotive and instrumentation products.

  14. LPG based all plastic pressure sensor

    DEFF Research Database (Denmark)

    Bundalo, Ivan-Lazar; Lwin, R.; Leon-Saval, S.

    2015-01-01

    A prototype all-plastic pressure sensor is presented and characterized for potential use as an endoscope. The sensor is based on Long Period Gratings (LPG) inscribed with a CO2 laser in 6-ring microstructured PMMA fiber. Through a latex coated, plastic 3D-printed transducer pod, external pressure...... is converted to longitudinal elongation of the pod and therefore of the fiber containing the LPG. The sensor has been characterised for pressures of up to 160 mBar in an in-house built pressure chamber. Furthermore, the influence of the fiber prestrain, fiber thickness and the effect of different glues...

  15. A carbon nanotube-based pressure sensor

    International Nuclear Information System (INIS)

    Karimov, Kh S; Saleem, M; Khan, Adam; Qasuria, T A; Mateen, A; Karieva, Z M

    2011-01-01

    In this study, a carbon nanotube (CNT)-based Al/CNT/Al pressure sensor was designed, fabricated and investigated. The sensor was fabricated by depositing CNTs on an adhesive elastic polymer tape and placing this in an elastic casing. The diameter of multiwalled nanotubes varied between 10 and 30 nm. The nominal thickness of the CNT layers in the sensors was in the range ∼300-430 μm. The inter-electrode distance (length) and the width of the surface-type sensors were in the ranges 4-6 and 3-4 mm, respectively. The dc resistance of the sensors decreased 3-4 times as the pressure was increased up to 17 kN m -2 . The resistance-pressure relationships were simulated.

  16. High-Performance Pressure Sensor for Monitoring Mechanical Vibration and Air Pressure

    Directory of Open Access Journals (Sweden)

    Yancheng Meng

    2018-05-01

    Full Text Available To realize the practical applications of flexible pressure sensors, the high performance (sensitivity and response time as well as more functionalities are highly desired. In this work, we fabricated a piezoresistive pressure sensor based on the micro-structured composites films of multi-walled carbon nanotubes (MWCNTs and poly (dimethylsiloxane (PDMS. In addition, we establish efficient strategies to improve key performance of our pressure sensor. Its sensitivity is improved up to 474.13 kPa−1 by minimizing pressure independent resistance of sensor, and response time is shorten as small as 2 μs by enhancing the elastic modulus of polymer elastomer. Benefiting from the high performance, the functionalities of sensors are successfully extended to the accurate detection of high frequency mechanical vibration (~300 Hz and large range of air pressure (6–101 kPa, both of which are not achieved before.

  17. Piezoelectric Films for Innovations in the Field of MEMS and Biosensors

    Science.gov (United States)

    Muralt, P.

    Microelectromechanical systems (MEMS) were born as a new technological discipline during the 1980s (for an introductory textbook, see, for instance [1]). The idea of the pioneers was to enlarge capabilities of integrated circuits based on silicon beyond pure electronics by adding mechanical elements, which were made of silicon and further materials of semiconductor technology. The addition of mechanics extended the application range of silicon technology to motion sensors, pressure and force sensors, small actuators, and a number of acoustic and ultrasonic devices, most importantly resonators for signal treatment. In order to profit from the symbiosis with electronics, those mechanical elements should, of course, be controlled by electronic signals. Evidently, this new silicon technology makes sense only for small, miniaturized devices. The technical advantage comes from the fact that powerful thin-film deposition and patterning techniques as used for semiconductor fabrication allow unprecedented precision of mechanics in the nano- to micrometer range. As a large number of devices are produced in parallel on the same wafer (batch processing), the cost level is acceptable in spite of expensive fabrication tools, at least at high production volumes. Concerning processing, the chemistry of silicon turned out to be very helpful: high etching rates of anisotropic wet etching in a base solution (as, e.g., KOH) and anisotropic deep silicon etching in a plasma reactor are crucial issues in efficiently tailoring silicon. Over the last 20 years, MEMS technology has became a proven and mature technology with many applications. While "MEMS" is still taken as a standing brand name for the field, the actual MEMS field has become much wider than stipulated by the notion of electromechanics, including thermal, optical, magnetic, chemical, biochemical, and further functional properties. Also, the main material of the device is not necessarily silicon, but may be glass or plastics

  18. MEMS and Nano-Technology Clean Room

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS and Nano-Technology Clean Room is a state-of-the-art, 800 square foot, Class 1000-capable facility used for development of micro and sub-micro scale sensors...

  19. Concept for a MEMS-type vacuum sensor based on electrical conductivity measurements

    Directory of Open Access Journals (Sweden)

    F. J. Giebel

    2017-11-01

    Full Text Available The concept of the micro-structured vacuum sensor presented in this article is the measurement of the electrical conductivity of thinned gases in order to develop a small, economical and quite a simple type of vacuum sensor. There are already some approaches for small vacuum sensors. Most of them are based on conservative measurement principles similar to those used in macroscopic vacuum gauges. Ionization gauges use additional sources of energy, like hot cathodes, ultraviolet radiation or high voltage for example, for ionizing gas molecules and thereby increasing the number of charge carriers for measuring low pressures. In contrast, the concept discussed here cannot be found in macroscopic sensor systems because it depends on the microscopic dimension of a gas volume defined by two electrodes. Here we present the concept and the production of a micro-structured vacuum sensor chip, followed by the electrical characterization. Reference measurements with electrodes at a distance of about 1 mm showed currents in the size of picoampere and a conductivity depending on ambient pressure. In comparison with these preliminary measurements, fundamental differences regarding pressure dependence of the conductivity are monitored in the electrical characterization of the micro-structured sensor chip. Finally the future perspectives of this sensor concept are discussed.

  20. A Musical instrument in MEMS

    NARCIS (Netherlands)

    Engelen, Johannes Bernardus Charles; de Boer, Hans L.; de Boer, H.; Beekman, J.G.; Been, A.J.; Folkertsma, Gerrit Adriaan; Folkertsma, G.A.; Fortgens, L.; de Graaf, D.; Vocke, S.; Woldering, L.A.; Abelmann, Leon; Elwenspoek, Michael Curt

    In this work we describe a MEMS instrument that resonates at audible frequencies, and with which music can be made. The sounds are generated by mechanical resonators and capacitive displacement sensors. Damping by air scales unfavourably for generating audible frequencies with small devices.

  1. Acceleration sensitivity of micromachined pressure sensors

    Science.gov (United States)

    August, Richard; Maudie, Theresa; Miller, Todd F.; Thompson, Erik

    1999-08-01

    Pressure sensors serve a variety of automotive applications, some which may experience high levels of acceleration such as tire pressure monitoring. To design pressure sensors for high acceleration environments it is important to understand their sensitivity to acceleration especially if thick encapsulation layers are used to isolate the device from the hostile environment in which they reside. This paper describes a modeling approach to determine their sensitivity to acceleration that is very general and is applicable to different device designs and configurations. It also describes the results of device testing of a capacitive surface micromachined pressure sensor at constant acceleration levels from 500 to 2000 g's.

  2. Pressure sensor based on distributed temperature sensing

    NARCIS (Netherlands)

    van Baar, J.J.J.; Wiegerink, Remco J.; Berenschot, Johan W.; Lammerink, Theodorus S.J.; Krijnen, Gijsbertus J.M.; Elwenspoek, Michael Curt

    2002-01-01

    A differential pressure sensor has been realized with thermal readout. The thermal readout allows simultaneous measurement of the membrane deflection due to a pressure difference and measurement of the absolute pressure by operating the structure as a Pirani pressure sensor. The measuring of the

  3. A silicon micromachined resonant pressure sensor

    International Nuclear Information System (INIS)

    Tang Zhangyang; Fan Shangchun; Cai Chenguang

    2009-01-01

    This paper describes the design, fabrication and test of a silicon micromachined resonant pressure sensor. A square membrane and a doubly clamped resonant beam constitute a compound structure. The former senses the pressure directly, while the latter changes its resonant frequency according to deformation of the membrane. The final output relation between the resonant frequency and the applied pressure is deducted according to the structure mechanical properties. Sensors are fabricated by micromachining technology, and then sealed in vaccum. These sensors are tested by open-loop and close-loop system designed on purpose. The experiment results demonstrate that the sensor has a sensitivity of 49.8Hz/kPa and repeatability of 0.08%.

  4. Flight testing of a luminescent surface pressure sensor

    Science.gov (United States)

    Mclachlan, B. G.; Bell, J. H.; Espina, J.; Gallery, J.; Gouterman, M.; Demandante, C. G. N.; Bjarke, L.

    1992-01-01

    NASA ARC has conducted flight tests of a new type of aerodynamic pressure sensor based on a luminescent surface coating. Flights were conducted at the NASA ARC-Dryden Flight Research Facility. The luminescent pressure sensor is based on a surface coating which, when illuminated with ultraviolet light, emits visible light with an intensity dependent on the local air pressure on the surface. This technique makes it possible to obtain pressure data over the entire surface of an aircraft, as opposed to conventional instrumentation, which can only make measurements at pre-selected points. The objective of the flight tests was to evaluate the effectiveness and practicality of a luminescent pressure sensor in the actual flight environment. A luminescent pressure sensor was installed on a fin, the Flight Test Fixture (FTF), that is attached to the underside of an F-104 aircraft. The response of one particular surface coating was evaluated at low supersonic Mach numbers (M = 1.0-1.6) in order to provide an initial estimate of the sensor's capabilities. This memo describes the test approach, the techniques used, and the pressure sensor's behavior under flight conditions. A direct comparison between data provided by the luminescent pressure sensor and that produced by conventional pressure instrumentation shows that the luminescent sensor can provide quantitative data under flight conditions. However, the test results also show that the sensor has a number of limitations which must be addressed if this technique is to prove useful in the flight environment.

  5. Pressure Measurement Sensor

    Science.gov (United States)

    1997-01-01

    FFPI Industries Inc. is the manufacturer of fiber-optic sensors that furnish accurate pressure measurements in internal combustion chambers. Such an assessment can help reduce pollution emitted by these engines. A chief component in the sensor owes its seven year- long development to Lewis Research Center funding to embed optical fibers and sensors in metal parts. NASA support to Texas A&M University played a critical role in developing this fiber optic technology and led to the formation of FFPI Industries and the production of fiber sensor products. The simple, rugged design of the sensor offers the potential for mass production at low cost. Widespread application of the new technology is forseen, from natural gas transmission, oil refining and electrical power generation to rail transport and the petrochemical paper product industry.

  6. Self-correcting electronically scanned pressure sensor

    Science.gov (United States)

    Gross, C. (Inventor)

    1983-01-01

    A multiple channel high data rate pressure sensing device is disclosed for use in wind tunnels, spacecraft, airborne, process control, automotive, etc., pressure measurements. Data rates in excess of 100,000 measurements per second are offered with inaccuracies from temperature shifts less than 0.25% (nominal) of full scale over a temperature span of 55 C. The device consists of thirty-two solid state sensors, signal multiplexing electronics to electronically address each sensor, and digital electronic circuitry to automatically correct the inherent thermal shift errors of the pressure sensors and their associated electronics.

  7. High-temperature fiber optic pressure sensor

    Science.gov (United States)

    Berthold, J. W.

    1984-01-01

    Attention is given to a program to develop fiber optic methods to measure diaphragm deflection. The end application is intended for pressure transducers capable of operating to 540 C. In this paper are reported the results of a laboratory study to characterize the performance of the fiber-optic microbend sensor. The data presented include sensitivity and spring constant. The advantages and limitations of the microbend sensor for static pressure measurement applications are described. A proposed design is presented for a 540 C pressure transducer using the fiber optic microbend sensor.

  8. Moving Towards the Use of New Micro Technology (MEMS) in Greenhouse Climate Related Sensing

    DEFF Research Database (Denmark)

    Andreassen, A.U.; Hyldgaard, Anders; Petersen, Søren D.

    2006-01-01

    Climatic control of plant growth based on almost static set points in the greenhouse industry is slowly but surely about to be replaced by more advanced control based on models describing biological processes in the plants. The use of various sensors in relation to the climate control system...... is also developing towards new techniques and technologies. A prototype Micro-Electro-Mechanical System (MEMS) dual temperature and light sensor has been compared in experiments with conventional sensors to analyse the reliability, repeatability and usability of both the MEMS dual sensor and the resulting...

  9. Pressure sensor to determine spatial pressure distributions on boundary layer flows

    Science.gov (United States)

    Sciammarella, Cesar A.; Piroozan, Parham; Corke, Thomas C.

    1997-03-01

    The determination of pressures along the surface of a wind tunnel proves difficult with methods that must introduce devices into the flow stream. This paper presents a sensor that is part of the wall. A special interferometric reflection moire technique is developed and used to produce signals that measures pressure both in static and dynamic settings. The sensor developed is an intelligent sensor that combines optics and electronics to analyze the pressure patterns. The sensor provides the input to a control system that is capable of modifying the shape of the wall and preserve the stability of the flow.

  10. Method and Apparatus for Characterizing Pressure Sensors using Modulated Light Beam Pressure

    Science.gov (United States)

    Youngquist, Robert C. (Inventor)

    2003-01-01

    Embodiments of apparatuses and methods are provided that use light sources instead of sound sources for characterizing and calibrating sensors for measuring small pressures to mitigate many of the problems with using sound sources. In one embodiment an apparatus has a light source for directing a beam of light on a sensing surface of a pressure sensor for exerting a force on the sensing surface. The pressure sensor generates an electrical signal indicative of the force exerted on the sensing surface. A modulator modulates the beam of light. A signal processor is electrically coupled to the pressure sensor for receiving the electrical signal.

  11. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.

    2017-10-05

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams. In that context, embodiments of gas-triggered MEMS microbeam sensors and switches are described. The microbeam devices can be coated with a Metal-Organic Framework to achieve high sensitivity. For gas sensing, an amplitude-based tracking algorithm can be used to quantify an amount of gas captured by the devices according to frequency shift. Noise analysis is also conducted according to the embodiments, which shows that the microbeam devices have high stability against thermal noise. The microbeam devices are also suitable for the generation of binary sensing information for alarming, for example.

  12. Microfabricated pressure and shear stress sensors

    Science.gov (United States)

    Liu, Chang (Inventor); Chen, Jack (Inventor); Engel, Jonathan (Inventor)

    2009-01-01

    A microfabricated pressure sensor. The pressure sensor comprises a raised diaphragm disposed on a substrate. The diaphragm is configured to bend in response to an applied pressure difference. A strain gauge of a conductive material is coupled to a surface of the raised diaphragm and to at least one of the substrate and a piece rigidly connected to the substrate.

  13. Urodynamic pressure sensor

    Science.gov (United States)

    Moore, Thomas

    1991-01-01

    A transducer system was developed for measuring the closing pressure profile along the female urethra, which provides up to five sensors within the functional length of the urethra. This new development is an improvement over an earlier measurement method that has a smaller sensor area and was unable to respond to transient events. Three sensors were constructed; one of them was subjected to approximately eight hours of use in a clinical setting during which 576 data points were obtained. The complete instrument system, including the signal conditioning electronics, data acquisition unit, and the computer with its display and printer is described and illustrated.

  14. Flexible Sensors for Pressure Therapy: Effect of Substrate Curvature and Stiffness on Sensor Performance.

    Science.gov (United States)

    Khodasevych, Iryna; Parmar, Suresh; Troynikov, Olga

    2017-10-20

    Flexible pressure sensors are increasingly being used in medical and non-medical applications, and particularly in innovative health monitoring. Their efficacy in medical applications such as compression therapy depends on the accuracy and repeatability of their output, which in turn depend on factors such as sensor type, shape, pressure range, and conformability of the sensor to the body surface. Numerous researchers have examined the effects of sensor type and shape, but little information is available on the effect of human body parameters such as support surfaces' curvature and the stiffness of soft tissues on pressure sensing performance. We investigated the effects of body parameters on the performance of pressure sensors using a custom-made human-leg-like test setup. Pressure sensing parameters such as accuracy, drift and repeatability were determined in both static (eight hours continuous pressure) and dynamic (10 cycles of pressure application of 30 s duration) testing conditions. The testing was performed with a focus on compression therapy application for venous leg ulcer treatments, and was conducted in a low-pressure range of 20-70 mmHg. Commercially available sensors manufactured by Peratech and Sensitronics were used under various loading conditions to determine the influence of stiffness and curvature. Flat rigid, flat soft silicone and three cylindrical silicone surfaces of radii of curvature of 3.5 cm, 5.5 cm and 6.5 cm were used as substrates under the sensors. The Peratech sensor averaged 94% accuracy for both static and dynamic measurements on all substrates; the Sensitronics sensor averaged 88% accuracy. The Peratech sensor displayed moderate variations and the Sensitronics sensor large variations in output pressure readings depending on the underlying test surface, both of which were reduced markedly by individual pressure calibration for surface type. Sensor choice and need for calibration to surface type are important considerations for

  15. A novel Gravity-FREAK feature extraction and Gravity-KLT tracking registration algorithm based on iPhone MEMS mobile sensor in mobile environment.

    Science.gov (United States)

    Hong, Zhiling; Lin, Fan; Xiao, Bin

    2017-01-01

    Based on the traditional Fast Retina Keypoint (FREAK) feature description algorithm, this paper proposed a Gravity-FREAK feature description algorithm based on Micro-electromechanical Systems (MEMS) sensor to overcome the limited computing performance and memory resources of mobile devices and further improve the reality interaction experience of clients through digital information added to the real world by augmented reality technology. The algorithm takes the gravity projection vector corresponding to the feature point as its feature orientation, which saved the time of calculating the neighborhood gray gradient of each feature point, reduced the cost of calculation and improved the accuracy of feature extraction. In the case of registration method of matching and tracking natural features, the adaptive and generic corner detection based on the Gravity-FREAK matching purification algorithm was used to eliminate abnormal matches, and Gravity Kaneda-Lucas Tracking (KLT) algorithm based on MEMS sensor can be used for the tracking registration of the targets and robustness improvement of tracking registration algorithm under mobile environment.

  16. Direction Finding Using Multiple MEMS Acoustic Sensors

    Science.gov (United States)

    2015-09-01

    Technologies Boomerang Warrior-X. A shoulder-mounted device detects incoming fire and provides visual and/or audio announcement via speaker , earpiece or...panel, which is located inside the vehicle, alerts soldiers through an LED 12-hour clock image display panel and speaker mounted inside the vehicle...sensor was operated at the bending frequency due to its large amplitude of vibration . Because the bending mode is excited by the pressure gradient of

  17. Microoptomechanical sensor for intracranial pressure monitoring

    International Nuclear Information System (INIS)

    Andreeva, A V; Luchinin, V V; Lutetskiy, N A; Sergushichev, A N

    2014-01-01

    The main idea of this research is the development of microoptomechanical sensor for intracranial pressure monitoring. Currently, the authors studied the scientific and technical knowledge in this field, as well as develop and test a prototype of microoptomechanical sensor for intracranial pressure (ICP) monitoring

  18. Novel fabric pressure sensors: design, fabrication, and characterization

    International Nuclear Information System (INIS)

    Wang, Yangyong; Hua, Tao; Zhu, Bo; Li, Qiao; Yi, Weijing; Tao, Xiaoming

    2011-01-01

    Soft and pliable pressure sensors are essential elements in wearable electronics which have wide applications in modern daily lives. This paper presents a family of fabric pressure sensors made by sandwiching a piece of resistive fabric strain sensing element between two tooth-structured layers of soft elastomers. The pressure sensors are capable of measuring pressure from 0 to 2000 kPa, covering the whole range of human–machine interactions. A pressure sensitivity of up to 2.98 × 10 −3 kPa −1 was obtained. Theoretical modeling was conducted based on an energy method to predict the load–displacement relationship for various sensor configurations. By adjusting the Young's modulus of the two conversion layers, as well as the geometrical dimensions, the measurement ranges, and sensitivities of the sensors can be quantitatively determined. The sensors are being used for pressure measurements between the human body and garments, shoes, beds, and chairs

  19. Nanocomposite-Based Microstructured Piezoresistive Pressure Sensors for Low-Pressure Measurement Range

    Directory of Open Access Journals (Sweden)

    Vasileios Mitrakos

    2018-01-01

    Full Text Available Piezoresistive pressure sensors capable of detecting ranges of low compressive stresses have been successfully fabricated and characterised. The 5.5 × 5 × 1.6 mm3 sensors consist of a planar aluminium top electrode and a microstructured bottom electrode containing a two-by-two array of truncated pyramids with a piezoresistive composite layer sandwiched in-between. The responses of two different piezocomposite materials, a Multiwalled Carbon Nanotube (MWCNT-elastomer composite and a Quantum Tunneling Composite (QTC, have been characterised as a function of applied pressure and effective contact area. The MWCNT piezoresistive composite-based sensor was able to detect pressures as low as 200 kPa. The QTC-based sensor was capable of detecting pressures as low as 50 kPa depending on the contact area of the bottom electrode. Such sensors could find useful applications requiring the detection of small compressive loads such as those encountered in haptic sensing or robotics.

  20. The baseline pressure of intracranial pressure (ICP) sensors can be altered by electrostatic discharges.

    Science.gov (United States)

    Eide, Per K; Bakken, André

    2011-08-22

    The monitoring of intracranial pressure (ICP) has a crucial role in the surveillance of patients with brain injury. During long-term monitoring of ICP, we have seen spontaneous shifts in baseline pressure (ICP sensor zero point), which are of technical and not physiological origin. The aim of the present study was to explore whether or not baseline pressures of ICP sensors can be affected by electrostatics discharges (ESD's), when ESD's are delivered at clinically relevant magnitudes. We performed bench-testing of a set of commercial ICP sensors. In our experimental setup, the ICP sensor was placed in a container with 0.9% NaCl solution. A test person was charged 0.5-10 kV, and then delivered ESD's to the sensor by touching a metal rod that was located in the container. The continuous pressure signals were recorded continuously before/after the ESD's, and the pressure readings were stored digitally using a computerized system A total of 57 sensors were tested, including 25 Codman ICP sensors and 32 Raumedic sensors. When charging the test person in the range 0.5-10 kV, typically ESD's in the range 0.5-5 kV peak pulse were delivered to the ICP sensor. Alterations in baseline pressure ≥ 2 mmHg was seen in 24 of 25 (96%) Codman sensors and in 17 of 32 (53%) Raumedic sensors. Lasting changes in baseline pressure > 10 mmHg that in the clinical setting would affect patient management, were seen frequently for both sensor types. The changes in baseline pressure were either characterized by sudden shifts or gradual drifts in baseline pressure. The baseline pressures of commercial solid ICP sensors can be altered by ESD's at discharge magnitudes that are clinically relevant. Shifts in baseline pressure change the ICP levels visualised to the physician on the monitor screen, and thereby reveal wrong ICP values, which likely represent a severe risk to the patient.

  1. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.; Jaber, Nizar; Younis, Mohammad I.

    2017-01-01

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams

  2. Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors

    Science.gov (United States)

    Shao, Chenzhong; Tanaka, Shuji; Nakayama, Takahiro; Hata, Yoshiyuki

    2018-01-01

    For installing many sensors in a limited space with a limited computing resource, the digitization of the sensor output at the site of sensation has advantages such as a small amount of wiring, low signal interference and high scalability. For this purpose, we have developed a dedicated Complementary Metal-Oxide-Semiconductor (CMOS) Large-Scale Integration (LSI) (referred to as “sensor platform LSI”) for bus-networked Micro-Electro-Mechanical-Systems (MEMS)-LSI integrated sensors. In this LSI, collision avoidance, adaptation and event-driven functions are simply implemented to relieve data collision and congestion in asynchronous serial bus communication. In this study, we developed a network system with 48 sensor platform LSIs based on Printed Circuit Board (PCB) in a backbone bus topology with the bus length being 2.4 m. We evaluated the serial communication performance when 48 LSIs operated simultaneously with the adaptation function. The number of data packets received from each LSI was almost identical, and the average sampling frequency of 384 capacitance channels (eight for each LSI) was 73.66 Hz. PMID:29342923

  3. Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors

    Directory of Open Access Journals (Sweden)

    Chenzhong Shao

    2018-01-01

    Full Text Available For installing many sensors in a limited space with a limited computing resource, the digitization of the sensor output at the site of sensation has advantages such as a small amount of wiring, low signal interference and high scalability. For this purpose, we have developed a dedicated Complementary Metal-Oxide-Semiconductor (CMOS Large-Scale Integration (LSI (referred to as “sensor platform LSI” for bus-networked Micro-Electro-Mechanical-Systems (MEMS-LSI integrated sensors. In this LSI, collision avoidance, adaptation and event-driven functions are simply implemented to relieve data collision and congestion in asynchronous serial bus communication. In this study, we developed a network system with 48 sensor platform LSIs based on Printed Circuit Board (PCB in a backbone bus topology with the bus length being 2.4 m. We evaluated the serial communication performance when 48 LSIs operated simultaneously with the adaptation function. The number of data packets received from each LSI was almost identical, and the average sampling frequency of 384 capacitance channels (eight for each LSI was 73.66 Hz.

  4. Fully wireless pressure sensor based on endoscopy images

    Science.gov (United States)

    Maeda, Yusaku; Mori, Hirohito; Nakagawa, Tomoaki; Takao, Hidekuni

    2018-04-01

    In this paper, the result of developing a fully wireless pressure sensor based on endoscopy images for an endoscopic surgery is reported for the first time. The sensor device has structural color with a nm-scale narrow gap, and the gap is changed by air pressure. The structural color of the sensor is acquired from camera images. Pressure detection can be realized with existing endoscope configurations only. The inner air pressure of the human body should be measured under flexible-endoscope operation using the sensor. Air pressure monitoring, has two important purposes. The first is to quantitatively measure tumor size under a constant air pressure for treatment selection. The second purpose is to prevent the endangerment of a patient due to over transmission of air. The developed sensor was evaluated, and the detection principle based on only endoscopy images has been successfully demonstrated.

  5. Experience gained with capacitive pressure sensor noise analysis

    International Nuclear Information System (INIS)

    Ballestrin, J.; Blazquez, J.

    1996-01-01

    Due to safety requirements, pressure sensors in a nuclear power plant must be kept under surveillance. The dynamics of the capacitive type Rosemount sensors is known. Sensor response time to a pressure ramp is the usual quantity required and it can be calculated. The noise signals contain the sensor dynamics, but in this case other irrelevant information from the plant is held, which disturbs the results. So, the signals must be conditioned previously. Also, it is necessary to do a process in order to separate the pressure sensor dynamics and to get a stationary signal. This can be done by using the autocorrelation function and filtering. Deterministic steps have been made and a relationship between the sensor response time, and the static pressure has been found. (author)

  6. Inertia compensated force and pressure sensors

    Energy Technology Data Exchange (ETDEWEB)

    Bill, B.; Engeler, P.; Gossweiler, C. [Kistler Instrumente AG, Winterthur (Switzerland)

    2001-07-01

    Any moving structure is affected by inertial effects. In case of force and pressure sensors, inertial effects cause measurement errors. The paper deals with novel signal conditioning methods and mechanical design features to minimize inertial effects. A novel solution for passive compensation of pressure sensors is presented. (orig.)

  7. Characterization of bio-inspired hair flow sensors for oscillatory airflows: techniques to measure the response for both flow and pressure

    NARCIS (Netherlands)

    Droogendijk, H.; Dagamseh, A.M.K.; Sanders, Remco G.P.; Yntema, Doekle Reinder; Krijnen, Gijsbertus J.M.

    2014-01-01

    Hair sensors for oscillatory airflow, operating in the regime of bulk flow, particle velocity or both, can be characterized by several methods. In this work, we discuss harmonic measurements on MEMS hair flow sensors. To characterize this type of flow sensor the use of three different types of

  8. A Hybrid Pressure and Vector Sensor Towed Array

    National Research Council Canada - National Science Library

    Huang, Dehua

    2008-01-01

    The invention as disclosed is of a combined acoustic pressure and acoustic vector sensor array, where multiple acoustic pressure sensors are integrated with an acoustic vector sensor in a towed array...

  9. Crickets as bio-inspiration for MEMS-based flow-sensing

    NARCIS (Netherlands)

    Krijnen, Gijsbertus J.M.; Droogendijk, H.; Dagamseh, A.M.K.; Jaganatharaja, R.K.; Casas, Jerome

    2014-01-01

    MEMS offers exciting possibilities for the fabrication of bio-inspired mechanosensors. Over the last few years, we have been working on cricket- inspired hair-sensor arrays for spatio-temporal flow-field observations (i.e. flow camera) and source localisation. Whereas making flow-sensors as energy

  10. Ultrahigh Temperature Capacitive Pressure Sensor

    Science.gov (United States)

    Harsh, Kevin

    2014-01-01

    Robust, miniaturized sensing systems are needed to improve performance, increase efficiency, and track system health status and failure modes of advanced propulsion systems. Because microsensors must operate in extremely harsh environments, there are many technical challenges involved in developing reliable systems. In addition to high temperatures and pressures, sensing systems are exposed to oxidation, corrosion, thermal shock, fatigue, fouling, and abrasive wear. In these harsh conditions, sensors must be able to withstand high flow rates, vibration, jet fuel, and exhaust. In order for existing and future aeropropulsion turbine engines to improve safety and reduce cost and emissions while controlling engine instabilities, more accurate and complete sensor information is necessary. High-temperature (300 to 1,350 C) capacitive pressure sensors are of particular interest due to their high measurement bandwidth and inherent suitability for wireless readout schemes. The objective of this project is to develop a capacitive pressure sensor based on silicon carbon nitride (SiCN), a new class of high-temperature ceramic materials, which possesses excellent mechanical and electric properties at temperatures up to 1,600 C.

  11. Design, fabrication and metrological evaluation of wearable pressure sensors.

    Science.gov (United States)

    Goy, C B; Menichetti, V; Yanicelli, L M; Lucero, J B; López, M A Gómez; Parodi, N F; Herrera, M C

    2015-04-01

    Pressure sensors are valuable transducers that are necessary in a huge number of medical application. However, the state of the art of compact and lightweight pressure sensors with the capability of measuring the contact pressure between two surfaces (contact pressure sensors) is very poor. In this work, several types of wearable contact pressure sensors are fabricated using different conductive textile materials and piezo-resistive films. The fabricated sensors differ in size, the textile conductor used and/or the number of layers of the sandwiched piezo-resistive film. The intention is to study, through the obtaining of their calibration curves, their metrological properties (repeatability, sensitivity and range) and determine which physical characteristics improve their ability for measuring contact pressures. It has been found that it is possible to obtain wearable contact pressure sensors through the proposed fabrication process with satisfactory repeatability, range and sensitivity; and that some of these properties can be improved by the physical characteristics of the sensors.

  12. A Radiosonde Using a Humidity Sensor Array with a Platinum Resistance Heater and Multi-Sensor Data Fusion

    Science.gov (United States)

    Shi, Yunbo; Luo, Yi; Zhao, Wenjie; Shang, Chunxue; Wang, Yadong; Chen, Yinsheng

    2013-01-01

    This paper describes the design and implementation of a radiosonde which can measure the meteorological temperature, humidity, pressure, and other atmospheric data. The system is composed of a CPU, microwave module, temperature sensor, pressure sensor and humidity sensor array. In order to effectively solve the humidity sensor condensation problem due to the low temperatures in the high altitude environment, a capacitive humidity sensor including four humidity sensors to collect meteorological humidity and a platinum resistance heater was developed using micro-electro-mechanical-system (MEMS) technology. A platinum resistance wire with 99.999% purity and 0.023 mm in diameter was used to obtain the meteorological temperature. A multi-sensor data fusion technique was applied to process the atmospheric data. Static and dynamic experimental results show that the designed humidity sensor with platinum resistance heater can effectively tackle the sensor condensation problem, shorten response times and enhance sensitivity. The humidity sensor array can improve measurement accuracy and obtain a reliable initial meteorological humidity data, while the multi-sensor data fusion technique eliminates the uncertainty in the measurement. The radiosonde can accurately reflect the meteorological changes. PMID:23857263

  13. A MEMS Resonant Sensor to Measure Fluid Density and Viscosity under Flexural and Torsional Vibrating Modes

    Directory of Open Access Journals (Sweden)

    Libo Zhao

    2016-06-01

    Full Text Available Methods to calculate fluid density and viscosity using a micro-cantilever and based on the resonance principle were put forward. Their measuring mechanisms were analyzed and the theoretical equations to calculate the density and viscosity were deduced. The fluid-solid coupling simulations were completed for the micro-cantilevers with different shapes. The sensing chips with micro-cantilevers were designed based on the simulation results and fabricated using the micro electromechanical systems (MEMS technology. Finally, the MEMS resonant sensor was packaged with the sensing chip to measure the densities and viscosities of eight different fluids under the flexural and torsional vibrating modes separately. The relative errors of the measured densities from 600 kg/m3 to 900 kg/m3 and viscosities from 200 μPa·s to 1000 μPa·s were calculated and analyzed with different microcantilevers under various vibrating modes. The experimental results showed that the effects of the shape and vibrating mode of micro-cantilever on the measurement accuracies of fluid density and viscosity were analyzed in detail.

  14. Elastomeric polymer resonant waveguide grating based pressure sensor

    International Nuclear Information System (INIS)

    Song, Fuchuan; Xie, Antonio Jou; Seo, Sang-Woo

    2014-01-01

    In this paper, we demonstrate an elastomeric polymer resonant waveguide grating structure to be used as a pressure sensor. The applied pressure is measured by optical resonance spectrum peak shift. The sensitivity—as high as 86.74 pm psi −1 or 12.58 pm kPa −1 —has been experimentally obtained from a fabricated sensor. Potentially, the sensitivity of the demonstrated sensor can be tuned to different pressure ranges by the choices of elastic properties and layer thicknesses of the waveguide and cladding layers. The simulation results agree well with experimental results and indicate that the dominant effect on the sensor is the change of grating period when external pressure is applied. Based on the two-dimensional planar structure, the demonstrated sensor can be used to measure applied surface pressure optically, which has potential applications for optical ultrasound imaging and pressure wave detection/mapping

  15. Fiber Optic Pressure Sensor Array, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — VIP Sensors proposes to develop a Fiber Optic Pressure Sensor Array System for measuring air flow pressure at multiple points on the skin of aircrafts for Flight...

  16. Fiber optic pressure sensors for nuclear power plants

    Energy Technology Data Exchange (ETDEWEB)

    Hashemian, H.M.; Black, C.L. [Analysis and Measurement Services Corp., Knoxville, TN (United States)

    1995-04-01

    In the last few years, the nuclear industry has experienced some problems with the performance of pressure transmitters and has been interested in new sensors based on new technologies. Fiber optic pressure sensors offer the potential to improve on or overcome some of the limitations of existing pressure sensors. Up to now, research has been motivated towards development and refinement of fiber optic sensing technology. In most applications, reliability studies and failure mode analyses remain to be exhaustively conducted. Fiber optic sensors have currently penetrated certain cutting edge markets where they possess necessary inherent advantages over other existing technologies. In these markets (e.g. biomedical, aerospace, automotive, and petrochemical), fiber optic sensors are able to perform measurements for which no alternate sensor previously existed. Fiber optic sensing technology has not yet been fully adopted into the mainstream sensing market. This may be due to not only the current premium price of fiber optic sensors, but also the lack of characterization of their possible performance disadvantages. In other words, in conservative industries, the known disadvantages of conventional sensors are sometimes preferable to unknown or not fully characterized (but potentially fewer and less critical) disadvantages of fiber optic sensors. A six-month feasibility study has been initiated under the auspices of the US Nuclear Regulatory Commission (NRC) to assess the performance and reliability of existing fiber optic pressure sensors for use in nuclear power plants. This assessment will include establishment of the state of the art in fiber optic pressure sensing, characterization of the reliability of fiber optic pressure sensors, and determination of the strengths and limitations of these sensors for nuclear safety-related services.

  17. Fiber optic pressure sensors for nuclear power plants

    International Nuclear Information System (INIS)

    Hashemian, H.M.; Black, C.L.

    1995-01-01

    In the last few years, the nuclear industry has experienced some problems with the performance of pressure transmitters and has been interested in new sensors based on new technologies. Fiber optic pressure sensors offer the potential to improve on or overcome some of the limitations of existing pressure sensors. Up to now, research has been motivated towards development and refinement of fiber optic sensing technology. In most applications, reliability studies and failure mode analyses remain to be exhaustively conducted. Fiber optic sensors have currently penetrated certain cutting edge markets where they possess necessary inherent advantages over other existing technologies. In these markets (e.g. biomedical, aerospace, automotive, and petrochemical), fiber optic sensors are able to perform measurements for which no alternate sensor previously existed. Fiber optic sensing technology has not yet been fully adopted into the mainstream sensing market. This may be due to not only the current premium price of fiber optic sensors, but also the lack of characterization of their possible performance disadvantages. In other words, in conservative industries, the known disadvantages of conventional sensors are sometimes preferable to unknown or not fully characterized (but potentially fewer and less critical) disadvantages of fiber optic sensors. A six-month feasibility study has been initiated under the auspices of the US Nuclear Regulatory Commission (NRC) to assess the performance and reliability of existing fiber optic pressure sensors for use in nuclear power plants. This assessment will include establishment of the state of the art in fiber optic pressure sensing, characterization of the reliability of fiber optic pressure sensors, and determination of the strengths and limitations of these sensors for nuclear safety-related services

  18. A simple sensing mechanism for wireless, passive pressure sensors.

    Science.gov (United States)

    Drazan, John F; Wassick, Michael T; Dahle, Reena; Beardslee, Luke A; Cady, Nathaniel C; Ledet, Eric H

    2016-08-01

    We have developed a simple wireless pressure sensor that consists of only three electrically isolated components. Two conductive spirals are separated by a closed cell foam that deforms when exposed to changing pressures. This deformation changes the capacitance and thus the resonant frequency of the sensors. Prototype sensors were submerged and wirelessly interrogated while being exposed to physiologically relevant pressures from 10 to 130 mmHg. Sensors consistently exhibited a sensitivity of 4.35 kHz/mmHg which is sufficient for resolving physiologically relevant pressure changes in vivo. These simple sensors have the potential for in vivo pressure sensing.

  19. A novel design and analysis of a MEMS ceramic hot-wire anemometer for high temperature applications

    International Nuclear Information System (INIS)

    Nagaiah, N R; Sleiti, A K; Rodriguez, S; Kapat, J S; An, L; Chow, L

    2006-01-01

    This paper attempts to prove the feasibility of high temperature MEMS hot-wire anemometer for gas turbine environment. No such sensor exists at present. Based on the latest improvement in a new type of Polymer-Derived Ceramic (PDC) material, the authors present a Novel design, structural and thermal analysis of MEMS hot-wire anemometer (HWA) based on PDC material, and show that such a sensor is indeed feasible. This MEMS Sensor is microfabricated by using three types of PDC materials such as SiAlCN, SiCN (lightly doped) and SiCN (heavily doped) for sensing element (hot-wire), support prongs and connecting leads respectively. This novel hot wire anemometer can perform better than a conventional HWA in which the hot wire is made of tungsten or platinum-iridium. This type of PDC-HWA can be used in harsh environment due to its high temperature resistance, tensile strength and resistance to oxidation. This HWA is fabricated using microstereolithography as a novel microfabrication technique to manufacture the proposed MEMS Sensor

  20. Miniature piezoresistive solid state integrated pressure sensors

    Science.gov (United States)

    Kahng, S. K.

    1980-01-01

    The characteristics of silicon pressure sensors with an ultra-small diaphragm are described. The pressure sensors utilize rectangular diaphragm as small as 0.0127 x 0.0254 cm and a p-type Wheatstone bridge consisting of diffused piezoresistive elements, 0.000254 cm by 0.00254 cm. These sensors exhibit as high as 0.5 MHz natural frequency and 1 mV/V/psi pressure sensitivity. Fabrication techniques and high frequency results from shock tube testing and low frequency comparison with microphones are presented.

  1. Calculation Of Pneumatic Attenuation In Pressure Sensors

    Science.gov (United States)

    Whitmore, Stephen A.

    1991-01-01

    Errors caused by attenuation of air-pressure waves in narrow tubes calculated by method based on fundamental equations of flow. Changes in ambient pressure transmitted along narrow tube to sensor. Attenuation of high-frequency components of pressure wave calculated from wave equation derived from Navier-Stokes equations of viscous flow in tube. Developed to understand and compensate for frictional attenuation in narrow tubes used to connect aircraft pressure sensors with pressure taps on affected surfaces.

  2. New dynamic silicon photonic components enabled by MEMS technology

    Science.gov (United States)

    Errando-Herranz, Carlos; Edinger, Pierre; Colangelo, Marco; Björk, Joel; Ahmed, Samy; Stemme, Göran; Niklaus, Frank; Gylfason, Kristinn B.

    2018-02-01

    Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.

  3. Micro-fabrication technology for piezoelectric film formation and its application to MEMS

    OpenAIRE

    一木, 正聡; 曹, 俊杰; 張, 麓〓; 王, 占杰; 前田, 龍太郎; Masaaki, ICHIKI; Jiunn Jye, TSAUR; Lulu, ZHANG; Zhang Jie, WANG; Ryutaro, MAEDA; 産業技術総合研究所; 産業技術総合研究所; 産業技術総合研究所; 東北大学; 産業技術総合研究所

    2005-01-01

    Technological problems for realization of Micro Electro-mechanical System (MEMS) are discussed and an introduction of smart materials (PZT) is encouraged. The film formation and micromaching technology are discussed in integration of PZT thin films into MEMS. Further developments are proposed on PZT micro sensors and actuators with special emphasis laid on exploration of new application fields of MEMS, such as scanning mirror. Internal stress is estimated and analyzed for the improvement of d...

  4. Nanogenerators for self-powering nanosystems and piezotronics for smart MEMS/NEMS

    KAUST Repository

    Wang, Zhong Lin

    2011-01-01

    Two new fields are introduced to MEMS/NEMS: a nanogenerator that harvests mechanical energy for powering nanosystems, and strained induced piezotronics for smart MEMS. Fundamentally, due to the polarization of ions in a crystal that has non-central symmetry, such as ZnO, GaN and InN, a piezoelectric potential (piezopotential) is created in the crystal by applying a stress. The principle of harvesting irregular mechanical energy by the nanogenerator relies on the piezopotenital driven transient flow of electrons in external load, which can be resulted from body motion, muscle stretching, breathing, tiny mechanical vibration/disturbance, sonic wave etc. As of today, a gentle straining can output 1-3 V at an instant output power of ∼2 μW from an integrated nanogenerator of a very thin sheet of 1 cm2 in size. This technology has the potential applications for power MEMS/NEMS that requires a power in the μW to mW range. Furthermore, we have replaced the externally applied gate voltage to a CMOS field effect transistor by the strain induced piezopotential as a "gate" voltage to tune/control the charge transport from source to drain. The devices fabricated by this principle are called piezotronics, with applications in strain/force/pressure triggered/controlled electronic devices, sensors and logic units.

  5. 40 CFR 1065.215 - Pressure transducers, temperature sensors, and dewpoint sensors.

    Science.gov (United States)

    2010-07-01

    ... sensors, and dewpoint sensors. 1065.215 Section 1065.215 Protection of Environment ENVIRONMENTAL... Measurement of Engine Parameters and Ambient Conditions § 1065.215 Pressure transducers, temperature sensors, and dewpoint sensors. (a) Application. Use instruments as specified in this section to measure...

  6. Pressure sensor apparatus for indicating pressure in the body

    International Nuclear Information System (INIS)

    Hittman, F.; Fleischmann, L.W.

    1981-01-01

    A novel pressure sensor for indicating pressure in the body cavities of humans or animals is described in detail. The pressure sensor apparatus is relatively small and is easily implantable. It consists of a radioactive source (e.g. Pr-145, C-14, Ni-63, Sr-90 and Am-241) and associated radiation shielding and a bellows. The pressure acting upon the sensing tambour causes the bellows to expand and contract. This is turn causes the radiation shielding to move and changes in pressure can then be monitored external to the body using a conventional nuclear detector. The bellows is made of resilient material (e.g. gold plated nickel) and has a wall thickness of approximately 0.0003 inches. The apparatus is essentially insensitive to temperature variations. (U.K.)

  7. Ultrahigh Sensitivity Piezoresistive Pressure Sensors for Detection of Tiny Pressure.

    Science.gov (United States)

    Li, Hongwei; Wu, Kunjie; Xu, Zeyang; Wang, Zhongwu; Meng, Yancheng; Li, Liqiang

    2018-05-31

    High sensitivity pressure sensors are crucial for the ultra-sensitive touch technology and E-skin, especially at the tiny pressure range below 100 Pa. However, it is highly challenging to substantially promote sensitivity beyond the current level at several to two hundred kPa -1 , and to improve the detection limit lower than 0.1 Pa, which is significant for the development of pressure sensors toward ultrasensitive and highly precise detection. Here, we develop an efficient strategy to greatly improve the sensitivity near to 2000 kPa -1 by using short channel coplanar device structure and sharp microstructure, which is systematically proposed for the first time and rationalized by the mathematic calculation and analysis. Significantly, benefiting from the ultrahigh sensitivity, the detection limit is improved to be as small as 0.075 Pa. The sensitivity and detection limit are both superior to the current levels, and far surpass the function of human skin. Furthermore, the sensor shows fast response time (50 μs), excellent reproducibility and stability, and low power consumption. Remarkably, the sensor shows excellent detection capacity in the tiny pressure range including LED switching with a pressure of 7 Pa, ringtone (2-20 Pa) recognition, and ultrasensitive (0.1 Pa) electronic glove. This work represents a performance and strategic progress in the field of pressure sensing.

  8. Thermoelectric Control Of Temperatures Of Pressure Sensors

    Science.gov (United States)

    Burkett, Cecil G., Jr.; West, James W.; Hutchinson, Mark A.; Lawrence, Robert M.; Crum, James R.

    1995-01-01

    Prototype controlled-temperature enclosure containing thermoelectric devices developed to house electronically scanned array of pressure sensors. Enclosure needed because (1) temperatures of transducers in sensors must be maintained at specified set point to ensure proper operation and calibration and (2) sensors sometimes used to measure pressure in hostile environments (wind tunnels in original application) that are hotter or colder than set point. Thus, depending on temperature of pressure-measurement environment, thermoelectric devices in enclosure used to heat or cool transducers to keep them at set point.

  9. Performance assessment of bio-inspired systems: flow sensing MEMS hairs

    International Nuclear Information System (INIS)

    Droogendijk, H; Krijnen, G J M; Casas, J; Steinmann, T

    2015-01-01

    Despite vigorous growth in biomimetic design, the performance of man-made devices relative to their natural templates is still seldom quantified, a procedure which would however significantly increase the rigour of the biomimetic approach. We applied the ubiquitous engineering concept of a figure of merit (FoM) to MEMS flow sensors inspired by cricket filiform hairs. A well known mechanical model of a hair is refined and tailored to this task. Five criteria of varying importance in the biological and engineering fields are computed: responsivity, power transfer, power efficiency, response time and detection threshold. We selected the metrics response time and detection threshold for building the FoM to capture the performance in a single number. Crickets outperform actual MEMS on all criteria for a large range of flow frequencies. Our approach enables us to propose several improvements for MEMS hair-sensor design. (paper)

  10. CMOS based capacitance to digital converter circuit for MEMS sensor

    Science.gov (United States)

    Rotake, D. R.; Darji, A. D.

    2018-02-01

    Most of the MEMS cantilever based system required costly instruments for characterization, processing and also has large experimental setups which led to non-portable device. So there is a need of low cost, highly sensitive, high speed and portable digital system. The proposed Capacitance to Digital Converter (CDC) interfacing circuit converts capacitance to digital domain which can be easily processed. Recent demand microcantilever deflection is part per trillion ranges which change the capacitance in 1-10 femto farad (fF) range. The entire CDC circuit is designed using CMOS 250nm technology. Design of CDC circuit consists of a D-latch and two oscillators, namely Sensor controlled oscillator (SCO) and digitally controlled oscillator (DCO). The D-latch is designed using transmission gate based MUX for power optimization. A CDC design of 7-stage, 9-stage and 11-stage tested for 1-18 fF and simulated using mentor graphics Eldo tool with parasitic. Since the proposed design does not use resistance component, the total power dissipation is reduced to 2.3621 mW for CDC designed using 9-stage SCO and DCO.

  11. Downhole pressure sensor

    Science.gov (United States)

    Berdahl, C. M.

    1980-01-01

    Sensor remains accurate in spite of varying temperatures. Very accurate, sensitive, and stable downhole pressure measurements are needed for vaiety of reservoir engineering applications, such as deep petroleum reservoirs, especially gas reservoirs, and in areas of high geothermal gradient.

  12. Embedding piezoresistive pressure sensors to obtain online pressure profiles inside fiber composite laminates.

    Science.gov (United States)

    Moghaddam, Maryam Kahali; Breede, Arne; Brauner, Christian; Lang, Walter

    2015-03-27

    The production of large and complex parts using fiber composite materials is costly due to the frequent formation of voids, porosity and waste products. By embedding different types of sensors and monitoring the process in real time, the amount of wastage can be significantly reduced. This work focuses on developing a knowledge-based method to improve and ensure complete impregnation of the fibers before initiation of the resin cure. Piezoresistive and capacitive pressure sensors were embedded in fiber composite laminates to measure the real-time the pressure values inside the laminate. A change of pressure indicates resin infusion. The sensors were placed in the laminate and the resin was infused by vacuum. The embedded piezoresistive pressure sensors were able to track the vacuum pressure in the fiber composite laminate setup, as well as the arrival of the resin at the sensor. The pressure increase due to closing the resin inlet was also measured. In contrast, the capacitive type of sensor was found to be inappropriate for measuring these quantities. The following study demonstrates real-time monitoring of pressure changes inside the fiber composite laminate, which validate the use of Darcy's law in porous media to control the resin flow during infusion.

  13. On the feasibility to integrate low-cost MEMS accelerometers and GNSS receivers

    Science.gov (United States)

    Benedetti, Elisa; Dermanis, Athanasios; Crespi, Mattia

    2017-06-01

    The aim of this research was to investigate the feasibility of merging the benefits offered by low-cost GNSS and MEMS accelerometers technology, in order to promote the diffusion of low-cost monitoring solutions. A merging approach was set up at the level of the combination of kinematic results (velocities and displacements) coming from the two kinds of sensors, whose observations were separately processed, following to the so called loose integration, which sounds much more simple and flexible thinking about the possibility of an easy change of the combined sensors. At first, the issues related to the difference in reference systems, time systems and measurement rate and epochs for the two sensors were faced with. An approach was designed and tested to transform into unique reference and time systems the outcomes from GPS and MEMS and to interpolate the usually (much) more dense MEMS observation to common (GPS) epochs. The proposed approach was limited to time-independent (constant) orientation of the MEMS reference system with respect to the GPS one. Then, a data fusion approach based on the use of Discrete Fourier Transform and cubic splines interpolation was proposed both for velocities and displacements: MEMS and GPS derived solutions are firstly separated by a rectangular filter in spectral domain, and secondly back-transformed and combined through a cubic spline interpolation. Accuracies around 5 mm for slow and fast displacements and better than 2 mm/s for velocities were assessed. The obtained solution paves the way to a powerful and appealing use of low-cost single frequency GNSS receivers and MEMS accelerometers for structural and ground monitoring applications. Some additional remarks and prospects for future investigations complete the paper.

  14. Micro-Electromechanical-Systems (MEMS) technologies for aerospace applications in Canada

    International Nuclear Information System (INIS)

    Pimprikar, M.

    2001-01-01

    During the last decade, research and development of Micro-Electro-Mechanical Systems (MEMS) have shown significant promise for a variety of aerospace applications. The advantages of drastic size and weight reduction of MEMS enables consideration of developing low-cost, high-performance, ultra-portable, MEMS-based devices and systems for aircraft, space and defense requirements. 'Microelectromechanical Systems, or MEMS', are integrated microdevices or systems combining electrical and mechanical components, fabricated using integrated circuit compatible batch-processing techniques, and varying in size from micrometers to millimeters. In the 1990's, MEMS were used as laboratory curiosities with very low power, short lifetimes and few concrete applications. One decade later, MEMS have taken major roles in several industries, the total world market is expected to grow from $14 billion to over $40 billion by the year 2002. A typical device contains micromechanical structures that move by flexing (membranes, cantilevers, springs) and MEMS/MOEMS level where the integration of microelectronics, micromechanics and optics form a complete system (sensor, actuator, photonic device). (author)

  15. Ultra-compact MEMS FTIR spectrometer

    Science.gov (United States)

    Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa

    2017-05-01

    Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

  16. Payload characterization for CubeSat demonstration of MEMS deformable mirrors

    Science.gov (United States)

    Marinan, Anne; Cahoy, Kerri; Webber, Matthew; Belikov, Ruslan; Bendek, Eduardo

    2014-08-01

    Coronagraphic space telescopes require wavefront control systems for high-contrast imaging applications such as exoplanet direct imaging. High-actuator-count MEMS deformable mirrors (DM) are a key element of these wavefront control systems yet have not been flown in space long enough to characterize their on-orbit performance. The MEMS Deformable Mirror CubeSat Testbed is a conceptual nanosatellite demonstration of MEMS DM and wavefront sensing technology. The testbed platform is a 3U CubeSat bus. Of the 10 x 10 x 34.05 cm (3U) available volume, a 10 x 10 x 15 cm space is reserved for the optical payload. The main purpose of the payload is to characterize and calibrate the onorbit performance of a MEMS deformable mirror over an extended period of time (months). Its design incorporates both a Shack Hartmann wavefront sensor (internal laser illumination), and a focal plane sensor (used with an external aperture to image bright stars). We baseline a 32-actuator Boston Micromachines Mini deformable mirror for this mission, though the design is flexible and can be applied to mirrors from other vendors. We present the mission design and payload architecture and discuss experiment design, requirements, and performance simulations.

  17. A novel Gravity-FREAK feature extraction and Gravity-KLT tracking registration algorithm based on iPhone MEMS mobile sensor in mobile environment.

    Directory of Open Access Journals (Sweden)

    Zhiling Hong

    Full Text Available Based on the traditional Fast Retina Keypoint (FREAK feature description algorithm, this paper proposed a Gravity-FREAK feature description algorithm based on Micro-electromechanical Systems (MEMS sensor to overcome the limited computing performance and memory resources of mobile devices and further improve the reality interaction experience of clients through digital information added to the real world by augmented reality technology. The algorithm takes the gravity projection vector corresponding to the feature point as its feature orientation, which saved the time of calculating the neighborhood gray gradient of each feature point, reduced the cost of calculation and improved the accuracy of feature extraction. In the case of registration method of matching and tracking natural features, the adaptive and generic corner detection based on the Gravity-FREAK matching purification algorithm was used to eliminate abnormal matches, and Gravity Kaneda-Lucas Tracking (KLT algorithm based on MEMS sensor can be used for the tracking registration of the targets and robustness improvement of tracking registration algorithm under mobile environment.

  18. A novel SOI pressure sensor for high temperature application

    International Nuclear Information System (INIS)

    Li Sainan; Liang Ting; Wang Wei; Hong Yingping; Zheng Tingli; Xiong Jijun

    2015-01-01

    The silicon on insulator (SOI) high temperature pressure sensor is a novel pressure sensor with high-performance and high-quality. A structure of a SOI high-temperature pressure sensor is presented in this paper. The key factors including doping concentration and power are analyzed. The process of the sensor is designed with the critical process parameters set appropriately. The test result at room temperature and high temperature shows that nonlinear error below is 0.1%, and hysteresis is less than 0.5%. High temperature measuring results show that the sensor can be used for from room temperature to 350 °C in harsh environments. It offers a reference for the development of high temperature piezoresistive pressure sensors. (semiconductor devices)

  19. Electric Power Self-Supply Module for WSN Sensor Node Based on MEMS Vibration Energy Harvester

    Directory of Open Access Journals (Sweden)

    Wenyang Zhang

    2018-04-01

    Full Text Available This paper proposes an electric power self-supply module for the wireless sensor network (WSN sensor node. The module includes an electromagnetic vibration energy harvester based on micro-electro-mechanical system (MEMS technology and a processing circuit. The vibration energy harvester presented in this paper is fabricated by an integrated microfabrication process and consists of four similar and relatively independent beam vibration elements. The main functions of the processing circuit are to convert the output of the harvester from unstable alternating current (AC to stable direct current (DC, charge the super capacitor, and ensure the stable output of the super capacitor. The preliminary test results of the harvester chip show that the chip can output discontinuous pulse voltage, and the range of the voltage value is from tens to hundreds of millivolts in the vibration frequency range of 10–90 Hz. The maximum value that can be reached is 563 mV (at the vibration frequency of 18 Hz. The results of the test show that the harvester can output a relatively high voltage, which can meet the general electric power demand of a WSN sensor node.

  20. Tests Of Array Of Flush Pressure Sensors

    Science.gov (United States)

    Larson, Larry J.; Moes, Timothy R.; Siemers, Paul M., III

    1992-01-01

    Report describes tests of array of pressure sensors connected to small orifices flush with surface of 1/7-scale model of F-14 airplane in wind tunnel. Part of effort to determine whether pressure parameters consisting of various sums, differences, and ratios of measured pressures used to compute accurately free-stream values of stagnation pressure, static pressure, angle of attack, angle of sideslip, and mach number. Such arrays of sensors and associated processing circuitry integrated into advanced aircraft as parts of flight-monitoring and -controlling systems.

  1. Organic electronics based pressure sensor towards intracranial pressure monitoring

    Science.gov (United States)

    Rai, Pratyush; Varadan, Vijay K.

    2010-04-01

    The intra-cranial space, which houses the brain, contains cerebrospinal fluid (CSF) that acts as a fluid suspension medium for the brain. The CSF is always in circulation, is secreted in the cranium and is drained out through ducts called epidural veins. The venous drainage system has inherent resistance to the flow. Pressure is developed inside the cranium, which is similar to a rigid compartment. Normally a pressure of 5-15 mm Hg, in excess of atmospheric pressure, is observed at different locations inside the cranium. Increase in Intra-Cranial Pressure (ICP) can be caused by change in CSF volume caused by cerebral tumors, meningitis, by edema of a head injury or diseases related to cerebral atrophy. Hence, efficient ways of monitoring ICP need to be developed. A sensor system and monitoring scheme has been discussed here. The system architecture consists of a membrane less piezoelectric pressure sensitive element, organic thin film transistor (OTFT) based signal transduction, and signal telemetry. The components were fabricated on flexible substrate and have been assembled using flip-chip packaging technology. Material science and fabrication processes, subjective to the device performance, have been discussed. Capability of the device in detecting pressure variation, within the ICP pressure range, is investigated and applicability of measurement scheme to medical conditions has been argued for. Also, applications of such a sensor-OTFT assembly for logic sensor switching and patient specific-secure monitoring system have been discussed.

  2. A 3D Model of the Thermoelectric Microwave Power Sensor by MEMS Technology

    Directory of Open Access Journals (Sweden)

    Zhenxiang Yi

    2016-06-01

    Full Text Available In this paper, a novel 3D model is proposed to describe the temperature distribution of the thermoelectric microwave power sensor. In this 3D model, the heat flux density decreases from the upper surface to the lower surface of the GaAs substrate while it was supposed to be a constant in the 2D model. The power sensor is fabricated by a GaAs monolithic microwave integrated circuit (MMIC process and micro-electro-mechanical system (MEMS technology. The microwave performance experiment shows that the S11 is less than −26 dB over the frequency band of 1–10 GHz. The power response experiment demonstrates that the output voltage increases from 0 mV to 27 mV, while the incident power varies from 1 mW to 100 mW. The measured sensitivity is about 0.27 mV/mW, and the calculated result from the 3D model is 0.28 mV/mW. The relative error has been reduced from 7.5% of the 2D model to 3.7% of the 3D model.

  3. Pressure Sensor: State of the Art, Design, and Application for Robotic Hand

    Directory of Open Access Journals (Sweden)

    Ahmed M. Almassri

    2015-01-01

    Full Text Available We survey the state of the art in a variety of force sensors for designing and application of robotic hand. Most of the force sensors are examined based on tactile sensing. For a decade, many papers have widely discussed various sensor technologies and transducer methods which are based on microelectromechanical system (MEMS and silicon used for improving the accuracy and performance measurement of tactile sensing capabilities especially for robotic hand applications. We found that transducers and materials such as piezoresistive and polymer, respectively, are used in order to improve the sensing sensitivity for grasping mechanisms in future. This predicted growth in such applications will explode into high risk tasks which requires very precise purposes. It shows considerable potential and significant levels of research attention.

  4. Low Power and High Sensitivity MOSFET-Based Pressure Sensor

    International Nuclear Information System (INIS)

    Zhang Zhao-Hua; Ren Tian-Ling; Zhang Yan-Hong; Han Rui-Rui; Liu Li-Tian

    2012-01-01

    Based on the metal-oxide-semiconductor field effect transistor (MOSFET) stress sensitive phenomenon, a low power MOSFET pressure sensor is proposed. Compared with the traditional piezoresistive pressure sensor, the present pressure sensor displays high performances on sensitivity and power consumption. The sensitivity of the MOSFET sensor is raised by 87%, meanwhile the power consumption is decreased by 20%. (cross-disciplinary physics and related areas of science and technology)

  5. Research experiments on pressure-difference sensors with ferrofluid

    Energy Technology Data Exchange (ETDEWEB)

    Ruican, Hao, E-mail: haoruican@163.com [School of Mechanical Engineering, Beijing Polytechnic, Beijing 100176 (China); Huagang, Liu; Wen, Gong; Na, Zhang [School of Mechanical Engineering, Beijing Polytechnic, Beijing 100176 (China); Ruixiao, Hao [Civil and Architectural Engineering Institute of CCCC-FHEB Co., Ltd., Beijing 101102 (China)

    2016-10-15

    Ferrofluid has distinctive properties and can be applied in many industrial uses, especially in sensors. The principles of pressure-difference sensors with ferrofluid were illustrated and experiments were demonstrated. Four types of ferrofluids with different concentrations were selected for the experiments performed. Then, the parameters of ferrofluid, such as density and magnetization, were measured. The magnetization curves of the ferrofluid were sketched. Four U tubes with different diameters were designed and built. Experiments were conducted to analyze the impacts of tube diameter and ferrofluid concentration on the output voltage/pressure difference performance. According to the experiment results, the tube diameter has little effect on the sensor output voltage. With the concentration of ferrofluid increasing, the output voltage and sensitivity of the pressure-difference sensor increases. The measurable range of the sensor also increases with the increasing concentration of ferrofluid. The workable range and the sensitivity of the designed sensor were (−2000~+2000)Pa and 1.26 mV/Pa, respectively. - Highlights: • The principle of pressure difference sensor with ferrofluid was illustrated. • The parameters of ferrofluid, such as density and magnetization, were measured. The magnetization curves of the ferrofluid were sketched. • Four series of U tubes with different diameter were designed and manufactured. • The experiments were made to analyze the factors of the tube diameter and the concentration of ferrofluid on the output-input pressure difference. • The sensitivity of the pressure difference sensor with ferrofluid was studied and the corresponding conclusions were obtained.

  6. Research experiments on pressure-difference sensors with ferrofluid

    International Nuclear Information System (INIS)

    Ruican, Hao; Huagang, Liu; Wen, Gong; Na, Zhang; Ruixiao, Hao

    2016-01-01

    Ferrofluid has distinctive properties and can be applied in many industrial uses, especially in sensors. The principles of pressure-difference sensors with ferrofluid were illustrated and experiments were demonstrated. Four types of ferrofluids with different concentrations were selected for the experiments performed. Then, the parameters of ferrofluid, such as density and magnetization, were measured. The magnetization curves of the ferrofluid were sketched. Four U tubes with different diameters were designed and built. Experiments were conducted to analyze the impacts of tube diameter and ferrofluid concentration on the output voltage/pressure difference performance. According to the experiment results, the tube diameter has little effect on the sensor output voltage. With the concentration of ferrofluid increasing, the output voltage and sensitivity of the pressure-difference sensor increases. The measurable range of the sensor also increases with the increasing concentration of ferrofluid. The workable range and the sensitivity of the designed sensor were (−2000~+2000)Pa and 1.26 mV/Pa, respectively. - Highlights: • The principle of pressure difference sensor with ferrofluid was illustrated. • The parameters of ferrofluid, such as density and magnetization, were measured. The magnetization curves of the ferrofluid were sketched. • Four series of U tubes with different diameter were designed and manufactured. • The experiments were made to analyze the factors of the tube diameter and the concentration of ferrofluid on the output-input pressure difference. • The sensitivity of the pressure difference sensor with ferrofluid was studied and the corresponding conclusions were obtained.

  7. Flexible pressure sensors for smart protective clothing against impact loading

    International Nuclear Information System (INIS)

    Wang, Fei; Zhu, Bo; Shu, Lin; Tao, Xiaoming

    2014-01-01

    The development of smart protective clothing will facilitate the quick detection of injuries from contact sports, traffic collisions and other accidents. To obtain real-time information like spatial and temporal pressure distributions on the clothing, flexible pressure sensor arrays are required. Based on a resistive fabric strain sensor we demonstrate all flexible, resistive pressure sensors with a large workable pressure range (0–8 MPa), a high sensitivity (1 MPa −1 ) and an excellent repeatability (lowest non-repeatability ±2.4% from 0.8 to 8 MPa) that can be inexpensively fabricated using fabric strain sensors and biocompatible polydimethylsiloxane (PDMS). The pressure sensitivity is tunable by using elastomers with different elasticities or by the pre-strain control of fabric strain sensors. Finite element simulation further confirms the sensor design. The simple structure, large workable pressure range, high sensitivity, high flexibility, facile fabrication and low cost of these pressure sensors make them promising candidates for smart protective clothing against impact loading. (paper)

  8. A Nuclear Microbattery for MEMS Devices

    International Nuclear Information System (INIS)

    Blanchard, James; Henderson, Douglass; Lal, Amit

    2002-01-01

    This project was designed to demonstrate the feasibility of producing on-board power for MEMS devices using radioisotopes. MEMS is a fast growing field, with hopes for producing a wide variety of revolutionary applications, including ''labs on a chip,'' micromachined scanning tunneling microscopes, microscopic detectors for biological agents, microsystems for DNA identification, etc. Currently, these applications are limited by the lack of an on-board power source. Research is ongoing to study approaches such as fuel cells, fossil fuels, and chemical batteries, but all these concepts have limitations. For long-lived, high energy density applications, on-board radioisotope power offers the best choice. We have succeeded in producing such devices using a variety of isotopes, incorporation methods, and device geometries. These experiments have demonstrated the feasibility of using radioisotope power and that there are a variety of options available for MEMS designers. As an example of an integrated, self-powered application, we have created an oscillating cantilever beam that is capable of consistent, periodic oscillations over very long time periods without the need for refueling. Ongoing work will demonstrate that this cantilever is capable of radio frequency transmission, allowing MEMS devices to communicate with one another wirelessly. Thus, this will be the first self-powered wireless transmitter available for use in MEMS devices, permitting such applications as sensors embedded in buildings for continuous monitoring of the building performance and integrity

  9. A Harsh Environment Wireless Pressure Sensing Solution Utilizing High Temperature Electronics

    Science.gov (United States)

    Yang, Jie

    2013-01-01

    Pressure measurement under harsh environments, especially at high temperatures, is of great interest to many industries. The applicability of current pressure sensing technologies in extreme environments is limited by the embedded electronics which cannot survive beyond 300 °C ambient temperature as of today. In this paper, a pressure signal processing and wireless transmission module based on the cutting-edge Silicon Carbide (SiC) devices is designed and developed, for a commercial piezoresistive MEMS pressure sensor from Kulite Semiconductor Products, Inc. Equipped with this advanced high-temperature SiC electronics, not only the sensor head, but the entire pressure sensor suite is capable of operating at 450 °C. The addition of wireless functionality also makes the pressure sensor more flexible in harsh environments by eliminating the costly and fragile cable connections. The proposed approach was verified through prototype fabrication and high temperature bench testing from room temperature up to 450 °C. This novel high-temperature pressure sensing technology can be applied in real-time health monitoring of many systems involving harsh environments, such as military and commercial turbine engines. PMID:23447006

  10. Method for making a dynamic pressure sensor and a pressure sensor made according to the method

    Science.gov (United States)

    Zuckerwar, Allan J. (Inventor); Robbins, William E. (Inventor); Robins, Glenn M. (Inventor)

    1994-01-01

    A method for providing a perfectly flat top with a sharp edge on a dynamic pressure sensor using a cup-shaped stretched membrane as a sensing element is described. First, metal is deposited on the membrane and surrounding areas. Next, the side wall of the pressure sensor with the deposited metal is machined to a predetermined size. Finally, deposited metal is removed from the top of the membrane in small steps, by machining or lapping while the pressure sensor is mounted in a jig or the wall of a test object, until the true top surface of the membrane appears. A thin indicator layer having a color contrasting with the color of the membrane may be applied to the top of the membrane before metal is deposited to facilitate the determination of when to stop metal removal from the top surface of the membrane.

  11. High precision silicon piezo resistive SMART pressure sensor

    International Nuclear Information System (INIS)

    Brown, Rod

    2005-01-01

    Instruments for test and calibration require a pressure sensor that is precise and stable. Market forces also dictate a move away from single measurand test equipment and, certainly in the case of pressure, away from single range equipment. A pressure 'module' is required which excels in pressure measurement but is interchangble with sensors for other measurands. A communications interface for such a sensor has been specified. Instrument Digital Output Sensor (IDOS) that permits this interchanagability and allows the sensor to be inside or outside the measuring instrument. This paper covers the design and specification of a silicon diaphragm piezo resistive SMART sensor using this interface. A brief history of instrument sensors will be given to establish the background to this development. Design choices of the silicon doping, bridge energisation method, temperature sensing, signal conversion, data processing, compensation method, communications interface will be discussed. The physical format of the 'in-instrument' version will be shown and then extended to the packaging design for the external version. Test results will show the accuracy achieved exceeds the target of 0.01%FS over a range of temperatures

  12. High precision silicon piezo resistive SMART pressure sensor

    Science.gov (United States)

    Brown, Rod

    2005-01-01

    Instruments for test and calibration require a pressure sensor that is precise and stable. Market forces also dictate a move away from single measurand test equipment and, certainly in the case of pressure, away from single range equipment. A pressure `module' is required which excels in pressure measurement but is interchangble with sensors for other measurands. A communications interface for such a sensor has been specified. Instrument Digital Output Sensor (IDOS) that permits this interchanagability and allows the sensor to be inside or outside the measuring instrument. This paper covers the design and specification of a silicon diaphragm piezo resistive SMART sensor using this interface. A brief history of instrument sensors will be given to establish the background to this development. Design choices of the silicon doping, bridge energisation method, temperature sensing, signal conversion, data processing, compensation method, communications interface will be discussed. The physical format of the `in-instrument' version will be shown and then extended to the packaging design for the external version. Test results will show the accuracy achieved exceeds the target of 0.01%FS over a range of temperatures.

  13. Recent advances in MEMS radiation detectors for improving radiation safety in nuclear reactors

    International Nuclear Information System (INIS)

    Bhisikar, Abhay

    2016-01-01

    MEMS (micro-electro-mechanical-system) is a core technology that leverages integrated circuit (IC) fabrication technology, builds ultra-miniaturized components and, enables radical new system applications. When considering MEMS radiation detectors; they are the specific micromechanical structures which are designed to sense doses of radiations. The present article reviews the most recent progress made in the domain of MEMS ionizing radiation sensors at international level for nuclear reactors which can be relevant to Indian context. (author)

  14. Cryogenic Multichannel Pressure Sensor With Electronic Scanning

    Science.gov (United States)

    Hopson, Purnell, Jr.; Chapman, John J.; Kruse, Nancy M. H.

    1994-01-01

    Array of pressure sensors operates reliably and repeatably over wide temperature range, extending from normal boiling point of water down to boiling point of nitrogen. Sensors accurate and repeat to within 0.1 percent. Operate for 12 months without need for recalibration. Array scanned electronically, sensor readings multiplexed and sent to desktop computer for processing and storage. Used to measure distributions of pressure in research on boundary layers at high Reynolds numbers, achieved by low temperatures.

  15. Micro-electro-mechanical systems (MEMS: Technology for the 21st century

    Directory of Open Access Journals (Sweden)

    Đakov Tatjana A.

    2014-01-01

    Full Text Available Micro-electro-mechanical systems (MEMS are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

  16. Radioisotope Power Sources for MEMS Devices,

    International Nuclear Information System (INIS)

    Blanchard, J.P.

    2001-01-01

    Microelectromechanical systems (MEMS) comprise a rapidly expanding research field with potential applications varying from sensors in airbags to more recent optical applications. Depending on the application, these devices often require an on-board power source for remote operation, especially in cases requiring operation for an extended period of time. Previously suggested power sources include fossil fuels and solar energy, but nuclear power sources may provide significant advantages for certain applications. Hence, the objective of this study is to establish the viability of using radioisotopes to power realistic MEMS devices. A junction-type battery was constructed using silicon and a 63 Ni liquid source. A source volume containing 64 microCi provided a power of ∼0.07 nW. A more novel application of nuclear sources for MEMS applications involves the creation of a resonator that is driven by charge collection in a cantilever beam. Preliminary results have established the feasibility of this concept, and future work will optimize the design for various applications

  17. Fiber Optic Pressure Sensor using Multimode Interference

    International Nuclear Information System (INIS)

    Ruiz-Perez, V I; Sanchez-Mondragon, J J; Basurto-Pensado, M A; LiKamWa, P; May-Arrioja, D A

    2011-01-01

    Based on the theory of multimode interference (MMI) and self-image formation, we developed a novel intrinsic optical fiber pressure sensor. The sensing element consists of a section of multimode fiber (MMF) without cladding spliced between two single mode fibers (SMF). The MMI pressure sensor is based on the intensity changes that occur in the transmitted light when the effective refractive index of the MMF is changed. Basically, a thick layer of Polydimethylsiloxane (PDMS) is placed in direct contact with the MMF section, such that the contact area between the PDMS and the fiber will change proportionally with the applied pressure, which results in a variation of the transmitted light intensity. Using this configuration, a good correlation between the measured intensity variations and the applied pressure is obtained. The sensitivity of the sensor is 3 μV/psi, for a range of 0-60 psi, and the maximum resolution of our system is 0.25 psi. Good repeatability is also observed with a standard deviation of 0.0019. The key feature of the proposed pressure sensor is its low fabrication cost, since the cost of the MMF is minimal.

  18. Fiber Optic Pressure Sensor using Multimode Interference

    Energy Technology Data Exchange (ETDEWEB)

    Ruiz-Perez, V I; Sanchez-Mondragon, J J [INAOE, Apartado Postal 51 y 216, Puebla 72000 (Mexico); Basurto-Pensado, M A [CIICAp, Universidad Autonoma del Estado de Morelos (Mexico); LiKamWa, P [CREOL, University of Central Florida, Orlando, FL 32816 (United States); May-Arrioja, D A, E-mail: iruiz@inaoep.mx, E-mail: mbasurto@uaem.mx, E-mail: delta_dirac@hotmail.com, E-mail: daniel_may_arrioja@hotmail.com [UAT Reynosa Rodhe, Universidad Autonoma de Tamaulipas (Mexico)

    2011-01-01

    Based on the theory of multimode interference (MMI) and self-image formation, we developed a novel intrinsic optical fiber pressure sensor. The sensing element consists of a section of multimode fiber (MMF) without cladding spliced between two single mode fibers (SMF). The MMI pressure sensor is based on the intensity changes that occur in the transmitted light when the effective refractive index of the MMF is changed. Basically, a thick layer of Polydimethylsiloxane (PDMS) is placed in direct contact with the MMF section, such that the contact area between the PDMS and the fiber will change proportionally with the applied pressure, which results in a variation of the transmitted light intensity. Using this configuration, a good correlation between the measured intensity variations and the applied pressure is obtained. The sensitivity of the sensor is 3 {mu}V/psi, for a range of 0-60 psi, and the maximum resolution of our system is 0.25 psi. Good repeatability is also observed with a standard deviation of 0.0019. The key feature of the proposed pressure sensor is its low fabrication cost, since the cost of the MMF is minimal.

  19. Miniaturized multi-sensor for aquatic studies

    International Nuclear Information System (INIS)

    Birkelund, Karen; Hyldgård, Anders; Mortensen, Dennis; Thomsen, Erik V

    2011-01-01

    We have developed and fabricated a multi-sensor chip for fisheries' research and demonstrated the functionality under controlled conditions. The outer dimensions of the sensor chip are 3.0 × 7.4 × 0.8 mm 3 and both sides of the chip are utilized for sensors. Hereby a more compact chip is achieved that allows for direct exposure to the seawater and thereby more accurate measurements. The chip contains a piezo-resistive pressure sensor, a pn-junction photodiode sensitive to visible light, a four-terminal platinum resistor for temperature measurement and four conductivity electrodes for the determination of the salinity of saltwater. Pressure, light intensity, temperature and salinity are all essential parameters when mapping the migration route of fish. The pressure sensor has a sensitivity of S = 1.44 × 10 −7 Pa −1 and is optimized to 20 bar pressure; the light sensor has a quantum efficiency between 52% and 74% in the range of visible light. The temperature sensor responds linearly with temperature and has a temperature coefficient of resistance of 2.9 × 10 −3 K −1 . The conductivity sensor can measure the salinity with an accuracy of ±0.1 psu. This is all together the smallest and best functioning fully integrated MEMS-based multi-sensor made to date for this specific application. However, each single-sensor performance can be optimized by introducing a considerably more complicated process sequence. In this paper, a new simpler process for integrating the four sensors on one single chip is presented in details for the first time. Further, an optimized performance of the individual sensors is presented

  20. Using pressure square-like wave to measure the dynamic characteristics of piezoelectric pressure sensor

    International Nuclear Information System (INIS)

    Han, L-L; Tsung, T-T; Chen, L-C; Chang Ho; Jwo, C-S

    2005-01-01

    Piezoelectric pressure sensors are commonly used to measuring the dynamic characteristics in a hydraulic system. The dynamic measurements require a pressure sensor which has a high response rate. In this paper, we proposed use of a pressure square wave to excite the piezoelectric pressure sensor. Experimental frequencies are 0.5, 1.0, 1.5, and 2.0 kHz at 10, 15, 20 bar, respectively. Results show that the waveform of time-domain and frequencydomain response are quite different under above testing conditions. The higher the frequencies tested, the faster the pressure-rise speeds obtained. Similarly, the higher the testing pressure, the shorter the rise time attained

  1. Highly Sensitive Electromechanical Piezoresistive Pressure Sensors Based on Large-Area Layered PtSe2 Films.

    Science.gov (United States)

    Wagner, Stefan; Yim, Chanyoung; McEvoy, Niall; Kataria, Satender; Yokaribas, Volkan; Kuc, Agnieszka; Pindl, Stephan; Fritzen, Claus-Peter; Heine, Thomas; Duesberg, Georg S; Lemme, Max C

    2018-05-23

    Two-dimensional (2D) layered materials are ideal for micro- and nanoelectromechanical systems (MEMS/NEMS) due to their ultimate thinness. Platinum diselenide (PtSe 2 ), an exciting and unexplored 2D transition metal dichalcogenide material, is particularly interesting because its low temperature growth process is scalable and compatible with silicon technology. Here, we report the potential of thin PtSe 2 films as electromechanical piezoresistive sensors. All experiments have been conducted with semimetallic PtSe 2 films grown by thermally assisted conversion of platinum at a complementary metal-oxide-semiconductor (CMOS)-compatible temperature of 400 °C. We report high negative gauge factors of up to -85 obtained experimentally from PtSe 2 strain gauges in a bending cantilever beam setup. Integrated NEMS piezoresistive pressure sensors with freestanding PMMA/PtSe 2 membranes confirm the negative gauge factor and exhibit very high sensitivity, outperforming previously reported values by orders of magnitude. We employ density functional theory calculations to understand the origin of the measured negative gauge factor. Our results suggest PtSe 2 as a very promising candidate for future NEMS applications, including integration into CMOS production lines.

  2. A new principle for low-cost hydrogen sensors for fuel cell technology safety

    Energy Technology Data Exchange (ETDEWEB)

    Liess, Martin [Rhein Main University of Applied Sciences, Rüsselsheim, Wiesbaden (Germany)

    2014-03-24

    Hydrogen sensors are of paramount importance for the safety of hydrogen fuel cell technology as result of the high pressure necessary in fuel tanks and its low explosion limit. I present a novel sensor principle based on thermal conduction that is very sensitive to hydrogen, highly specific and can operate on low temperatures. As opposed to other thermal sensors it can be operated with low cost and low power driving electronics. On top of this, as sensor element a modified standard of-the shelf MEMS thermopile IR-sensor can be used. The sensor principle presented is thus suited for the future mass markets of hydrogen fuel cell technology.S.

  3. Optical Pressure-Temperature Sensor for a Combustion Chamber

    Science.gov (United States)

    Wiley, John; Korman, Valentin; Gregory, Don

    2008-01-01

    A compact sensor for measuring temperature and pressure in a combusti on chamber has been proposed. The proposed sensor would include two optically birefringent, transmissive crystalline wedges: one of sapph ire (Al2O3) and one of magnesium oxide (MgO), the optical properties of both of which vary with temperature and pressure. The wedges wou ld be separated by a vapor-deposited thin-film transducer, which wou ld be primarily temperaturesensitive (in contradistinction to pressur e- sensitive) when attached to a crystalline substrate. The sensor w ould be housed in a rugged probe to survive the extreme temperatures and pressures in a combustion chamber.

  4. Optical Fibre Pressure Sensors in Medical Applications

    Directory of Open Access Journals (Sweden)

    Sven Poeggel

    2015-07-01

    Full Text Available This article is focused on reviewing the current state-of-the-art of optical fibre pressure sensors for medical applications. Optical fibres have inherent advantages due to their small size, immunity to electromagnetic interferences and their suitability for remote monitoring and multiplexing. The small dimensions of optical fibre-based pressure sensors, together with being lightweight and flexible, mean that they are minimally invasive for many medical applications and, thus, particularly suited to in vivo measurement. This means that the sensor can be placed directly inside a patient, e.g., for urodynamic and cardiovascular assessment. This paper presents an overview of the recent developments in optical fibre-based pressure measurements with particular reference to these application areas.

  5. Optical Fibre Pressure Sensors in Medical Applications.

    Science.gov (United States)

    Poeggel, Sven; Tosi, Daniele; Duraibabu, DineshBabu; Leen, Gabriel; McGrath, Deirdre; Lewis, Elfed

    2015-07-15

    This article is focused on reviewing the current state-of-the-art of optical fibre pressure sensors for medical applications. Optical fibres have inherent advantages due to their small size, immunity to electromagnetic interferences and their suitability for remote monitoring and multiplexing. The small dimensions of optical fibre-based pressure sensors, together with being lightweight and flexible, mean that they are minimally invasive for many medical applications and, thus, particularly suited to in vivo measurement. This means that the sensor can be placed directly inside a patient, e.g., for urodynamic and cardiovascular assessment. This paper presents an overview of the recent developments in optical fibre-based pressure measurements with particular reference to these application areas.

  6. Optical Fibre Pressure Sensors in Medical Applications

    Science.gov (United States)

    Poeggel, Sven; Tosi, Daniele; Duraibabu, DineshBabu; Leen, Gabriel; McGrath, Deirdre; Lewis, Elfed

    2015-01-01

    This article is focused on reviewing the current state-of-the-art of optical fibre pressure sensors for medical applications. Optical fibres have inherent advantages due to their small size, immunity to electromagnetic interferences and their suitability for remote monitoring and multiplexing. The small dimensions of optical fibre-based pressure sensors, together with being lightweight and flexible, mean that they are minimally invasive for many medical applications and, thus, particularly suited to in vivo measurement. This means that the sensor can be placed directly inside a patient, e.g., for urodynamic and cardiovascular assessment. This paper presents an overview of the recent developments in optical fibre-based pressure measurements with particular reference to these application areas. PMID:26184228

  7. A vacuum pressure sensor based on ZnO nanobelt film

    International Nuclear Information System (INIS)

    Zheng, X J; Cao, X C; Sun, J; Yuan, B; Zhu, Z; Zhang, Y; Li, Q H

    2011-01-01

    A vacuum pressure sensor was fabricated by assembling ZnO nanobelt film on the interdigital electrodes, and the current-voltage characteristics were measured with an Agilent semiconductor parameter tester. Under different pressures of 1.0 x 10 3 , 6.7 x 10 -3 , 8.2 x 10 -4 and 9.5 x 10 -5 mbar, the currents are 8.71, 28.1, 46.1 and 89.6 nA, and the pressure sensitive resistances are 1150, 356, 217 and 112 MΩ, respectively. In the range of 10 -5 -10 3 mbar the smaller the pressure is, the higher the current is. The pressure sensitive resistance of the vacuum pressure sensor increases linearly with the logarithmic pressure, and the measurement range is at least one order of magnitude wider than that of the previous sensors. Under the final pressure, the vacuum pressure sensor has maximum sensitivity (9.29) and power consumption of 0.9 μW. The sensitivity is larger than that of the previous sensor based on a ZnO single nanowire at that pressure, and the power consumption is much lower than that for the sensor based on a ZnO nanowire array. The pressure sensitive mechanism is reasonably explained by using oxygen chemisorption and energy band theory.

  8. A piezoelectric micro control valve with integrated capacitive sensing for ambulant blood pressure waveform monitoring

    Science.gov (United States)

    Groen, Maarten S.; Wu, Kai; Brookhuis, Robert A.; van Houwelingen, Marc J.; Brouwer, Dannis M.; Lötters, Joost C.; Wiegerink, Remco J.

    2014-12-01

    We have designed and characterized a MEMS microvalve with built-in capacitive displacement sensing and fitted it with a miniature piezoelectric actuator to achieve active valve control. The integrated displacement sensor enables high bandwidth proportional control of the gas flow through the valve. This is an essential requirement for non-invasive blood pressure waveform monitoring based on following the arterial pressure with a counter pressure. Using the capacitive sensor, we demonstrate negligible hysteresis in the valve control characteristics. Fabrication of the valve requires only two mask steps for deep reactive ion etching (DRIE) and one release etch.

  9. A piezoelectric micro control valve with integrated capacitive sensing for ambulant blood pressure waveform monitoring

    International Nuclear Information System (INIS)

    Groen, Maarten S; Wu, Kai; Brookhuis, Robert A; Lötters, Joost C; Wiegerink, Remco J; Van Houwelingen, Marc J; Brouwer, Dannis M

    2014-01-01

    We have designed and characterized a MEMS microvalve with built-in capacitive displacement sensing and fitted it with a miniature piezoelectric actuator to achieve active valve control. The integrated displacement sensor enables high bandwidth proportional control of the gas flow through the valve. This is an essential requirement for non-invasive blood pressure waveform monitoring based on following the arterial pressure with a counter pressure. Using the capacitive sensor, we demonstrate negligible hysteresis in the valve control characteristics. Fabrication of the valve requires only two mask steps for deep reactive ion etching (DRIE) and one release etch. (paper)

  10. Nondestructive surface profiling of hidden MEMS using an infrared low-coherence interferometric microscope

    Science.gov (United States)

    Krauter, Johann; Osten, Wolfgang

    2018-03-01

    There are a wide range of applications for micro-electro-mechanical systems (MEMS). The automotive and consumer market is the strongest driver for the growing MEMS industry. A 100 % test of MEMS is particularly necessary since these are often used for safety-related purposes such as the ESP (Electronic Stability Program) system. The production of MEMS is a fully automated process that generates 90 % of the costs during the packaging and dicing steps. Nowadays, an electrical test is carried out on each individual MEMS component before these steps. However, after encapsulation, MEMS are opaque to visible light and other defects cannot be detected. Therefore, we apply an infrared low-coherence interferometer for the topography measurement of those hidden structures. A lock-in algorithm-based method is shown to calculate the object height and to reduce ghost steps due to the 2π -unambiguity. Finally, measurements of different MEMS-based sensors are presented.

  11. Optical fiber pressure sensor based on fiber Bragg grating

    Science.gov (United States)

    Song, Dongcao

    In oil field, it is important to measure the high pressure and temperature for down-hole oil exploration and well-logging, the available traditional electronic sensor is challenged due to the harsh, flammable environment. Recently, applications based on fiber Bragg grating (FBG) sensor in the oil industry have become a popular research because of its distinguishing advantages such as electrically passive operation, immunity to electromagnetic interference, high resolution, insensitivity to optical power fluctuation etc. This thesis is divided into two main sections. In the first section, the design of high pressure sensor based on FBG is described. Several sensing elements based on FBG for high pressure measurements have been proposed, for example bulk-modulus or free elastic modulus. But the structure of bulk-modulus and free elastic modulus is relatively complex and not easy to fabricate. In addition, the pressure sensitivity is not high and the repeatability of the structure has not been investigated. In this thesis, a novel host material of carbon fiber laminated composite (CFLC) for high pressure sensing is proposed. The mechanical characteristics including principal moduli in three directions and the shape repeatability are investigated. Because of it's Young's modulus in one direction and anisotropic characteristics, the pressure sensor made by CFLC has excellent sensitivity. This said structure can be used in very high pressure measurement due to carbon fiber composite's excellent shape repetition even under high pressure. The experimental results show high pressure sensitivity of 0.101nm/MPa and high pressure measurement up to 70MPa. A pressure sensor based on CFLC and FBG with temperature compensation has been designed. In the second section, the design of low pressure sensor based on FBG is demonstrated. Due to the trade off between measurement range and sensitivity, a sensor for lower pressure range needs more sensitivity. A novel material of carbon

  12. Optical fiber powered pressure sensor

    International Nuclear Information System (INIS)

    Schweizer, P.; Neveux, L.; Ostrowsky, D.B.

    1987-01-01

    In the system described, a pressure sensor and its associated electronics are optically powered by a 20 mw laser and a photovoltaic cell via an optical fiber. The sensor is periodically interrogated and sends the measures obtained back to the central unit using an LED and a second fiber. The results obtained as well as the expected evolution will be described

  13. Acoustic Detection Of Loose Particles In Pressure Sensors

    Science.gov (United States)

    Kwok, Lloyd C.

    1995-01-01

    Particle-impact-noise-detector (PIND) apparatus used in conjunction with computer program analyzing output of apparatus to detect extraneous particles trapped in pressure sensors. PIND tester essentially shaker equipped with microphone measuring noise in pressure sensor or other object being shaken. Shaker applies controlled vibration. Output of microphone recorded and expressed in terms of voltage, yielding history of noise subsequently processed by computer program. Data taken at sampling rate sufficiently high to enable identification of all impacts of particles on sensor diaphragm and on inner surfaces of sensor cavities.

  14. Electrochemical impedance spectroscopy based MEMS sensors for phthalates detection in water and juices

    KAUST Repository

    Zia, Asif I

    2013-06-10

    Phthalate esters are ubiquitous environmental and food pollutants well known as endocrine disrupting compounds (EDCs). These developmental and reproductive toxicants pose a grave risk to the human health due to their unlimited use in consumer plastic industry. Detection of phthalates is strictly laboratory based time consuming and expensive process and requires expertise of highly qualified and skilled professionals. We present a real time, non-invasive, label free rapid detection technique to quantify phthalates\\' presence in deionized water and fruit juices. Electrochemical impedance spectroscopy (EIS) technique applied to a novel planar inter-digital (ID) capacitive sensor plays a vital role to explore the presence of phthalate esters in bulk fluid media. The ID sensor with multiple sensing gold electrodes was fabricated on silicon substrate using micro-electromechanical system (MEMS) device fabrication technology. A thin film of parylene C polymer was coated as a passivation layer to enhance the capacitive sensing capabilities of the sensor and to reduce the magnitude of Faradic current flowing through the sensor. Various concentrations, 0.002ppm through to 2ppm of di (2-ethylhexyl) phthalate (DEHP) in deionized water, were exposed to the sensing system by dip testing method. Impedance spectra obtained was analysed to determine sample conductance which led to consequent evaluation of its dielectric properties. Electro-chemical impedance spectrum analyser algorithm was employed to model the experimentally obtained impedance spectra. Curve fitting technique was applied to deduce constant phase element (CPE) equivalent circuit based on Randle\\'s equivalent circuit model. The sensing system was tested to detect different concentrations of DEHP in orange juice as a real world application. The result analysis indicated that our rapid testing technique is able to detect the presence of DEHP in all test samples distinctively.

  15. Electrochemical impedance spectroscopy based MEMS sensors for phthalates detection in water and juices

    International Nuclear Information System (INIS)

    Zia, Asif I; Syaifudin, A R Mohd; Mukhopadhyay, S C; Yu, P L; Al-Bahadly, I H; Gooneratne, Chinthaka P; Kosel, Juergen; Liao, Tai-Shan

    2013-01-01

    Phthalate esters are ubiquitous environmental and food pollutants well known as endocrine disrupting compounds (EDCs). These developmental and reproductive toxicants pose a grave risk to the human health due to their unlimited use in consumer plastic industry. Detection of phthalates is strictly laboratory based time consuming and expensive process and requires expertise of highly qualified and skilled professionals. We present a real time, non-invasive, label free rapid detection technique to quantify phthalates' presence in deionized water and fruit juices. Electrochemical impedance spectroscopy (EIS) technique applied to a novel planar inter-digital (ID) capacitive sensor plays a vital role to explore the presence of phthalate esters in bulk fluid media. The ID sensor with multiple sensing gold electrodes was fabricated on silicon substrate using micro-electromechanical system (MEMS) device fabrication technology. A thin film of parylene C polymer was coated as a passivation layer to enhance the capacitive sensing capabilities of the sensor and to reduce the magnitude of Faradic current flowing through the sensor. Various concentrations, 0.002ppm through to 2ppm of di (2-ethylhexyl) phthalate (DEHP) in deionized water, were exposed to the sensing system by dip testing method. Impedance spectra obtained was analysed to determine sample conductance which led to consequent evaluation of its dielectric properties. Electro-chemical impedance spectrum analyser algorithm was employed to model the experimentally obtained impedance spectra. Curve fitting technique was applied to deduce constant phase element (CPE) equivalent circuit based on Randle's equivalent circuit model. The sensing system was tested to detect different concentrations of DEHP in orange juice as a real world application. The result analysis indicated that our rapid testing technique is able to detect the presence of DEHP in all test samples distinctively.

  16. An Universal packaging technique for low-drift implantable pressure sensors.

    Science.gov (United States)

    Kim, Albert; Powell, Charles R; Ziaie, Babak

    2016-04-01

    Monitoring bodily pressures provide valuable diagnostic and prognostic information. In particular, long-term measurement through implantable sensors is highly desirable in situations where percutaneous access can be complicated or dangerous (e.g., intracranial pressure in hydrocephalic patients). In spite of decades of progress in the fabrication of miniature solid-state pressure sensors, sensor drift has so far severely limited their application in implantable systems. In this paper, we report on a universal packaging technique for reducing the sensor drift. The described method isolates the pressure sensor from a major source of drift, i.e., contact with the aqueous surrounding environment, by encasing the sensor in a silicone-filled medical-grade polyurethane balloon. In-vitro soak tests for 100 days using commercial micromachined piezoresistive pressure sensors demonstrate a stable operation with the output remaining within 1.8 cmH2O (1.3 mmHg) of a reference pressure transducer. Under similar test conditions, a non-isolated sensor fluctuates between 10 and 20 cmH2O (7.4-14.7 mmHg) of the reference, without ever settling to a stable operation regime. Implantation in Ossabow pigs demonstrate the robustness of the package and its in-vivo efficacy in reducing the baseline drift.

  17. CMOS-compatible ruggedized high-temperature Lamb wave pressure sensor

    International Nuclear Information System (INIS)

    Kropelnicki, P; Mu, X J; Randles, A B; Cai, H; Ang, W C; Tsai, J M; Muckensturm, K-M; Vogt, H

    2013-01-01

    This paper describes the development of a novel ruggedized high-temperature pressure sensor operating in lateral field exited (LFE) Lamb wave mode. The comb-like structure electrodes on top of aluminum nitride (AlN) were used to generate the wave. A membrane was fabricated on SOI wafer with a 10 µm thick device layer. The sensor chip was mounted on a pressure test package and pressure was applied to the backside of the membrane, with a range of 20–100 psi. The temperature coefficient of frequency (TCF) was experimentally measured in the temperature range of −50 °C to 300 °C. By using the modified Butterworth–van Dyke model, coupling coefficients and quality factor were extracted. Temperature-dependent Young's modulus of composite structure was determined using resonance frequency and sensor interdigital transducer (IDT) wavelength which is mainly dominated by an AlN layer. Absolute sensor phase noise was measured at resonance to estimate the sensor pressure and temperature sensitivity. This paper demonstrates an AlN-based pressure sensor which can operate in harsh environment such as oil and gas exploration, automobile and aeronautic applications. (paper)

  18. Fiber-linked interferometric pressure sensor

    Science.gov (United States)

    Beheim, G.; Fritsch, K.; Poorman, R. N.

    1987-01-01

    A fiber-optic pressure sensor is described which uses a diaphragm to modulate the mirror separation of a Fabry-Perot cavity (the sensing cavity). A multimode optical fiber delivers broadband light to the sensing cavity and returns the spectrally modulated light which the cavity reflects. The sensor's output spectrum is analyzed using a tunable Fabry-Perot cavity (the reference cavity) to determine the mismatch in the mirror separations of the two cavities. An electronic servo control uses this result to cause the mirror separation of the reference cavity to equal that of the sensing cavity. The displacement of the pressure-sensing diaphragm is then obtained by measuring the capacitance of the reference cavity's metal-coated mirrors. Relative to other fiber-optic sensors, an important advantage of this instrument is its high immunity to the effects of variations in both the transmissivity of the fiber link and the wavelength of the optical source.

  19. Fiber-Optic Pressure Sensor With Dynamic Demodulation Developed

    Science.gov (United States)

    Lekki, John D.

    2002-01-01

    Researchers at the NASA Glenn Research Center developed in-house a method to detect pressure fluctuations using a fiber-optic sensor and dynamic signal processing. This work was in support of the Intelligent Systems Controls and Operations project under NASA's Information Technology Base Research Program. We constructed an optical pressure sensor by attaching a fiber-optic Bragg grating to a flexible membrane and then adhering the membrane to one end of a small cylinder. The other end of the cylinder was left open and exposed to pressure variations from a pulsed air jet. These pressure variations flexed the membrane, inducing a strain in the fiber-optic grating. This strain was read out optically with a dynamic spectrometer to record changes in the wavelength of light reflected from the grating. The dynamic spectrometer was built in-house to detect very small wavelength shifts induced by the pressure fluctuations. The spectrometer is an unbalanced interferometer specifically designed for maximum sensitivity to wavelength shifts. An optimum pathlength difference, which was determined empirically, resulted in a 14-percent sensitivity improvement over theoretically predicted path-length differences. This difference is suspected to be from uncertainty about the spectral power difference of the signal reflected from the Bragg grating. The figure shows the output of the dynamic spectrometer as the sensor was exposed to a nominally 2-kPa peak-to-peak square-wave pressure fluctuation. Good tracking, sensitivity, and signal-to-noise ratios are evident even though the sensor was constructed as a proof-of-concept and was not optimized in any way. Therefore the fiber-optic Bragg grating, which is normally considered a good candidate as a strain or temperature sensor, also has been shown to be a good candidate for a dynamic pressure sensor.

  20. A MEMS-based super fast dew point hygrometer—construction and medical applications

    International Nuclear Information System (INIS)

    Jachowicz, Ryszard S; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz

    2009-01-01

    The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between −10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too

  1. A MEMS-based super fast dew point hygrometer—construction and medical applications

    Science.gov (United States)

    Jachowicz, Ryszard S.; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz

    2009-12-01

    The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between -10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too.

  2. Integrated arrays of air-dielectric graphene transistors as transparent active-matrix pressure sensors for wide pressure ranges.

    Science.gov (United States)

    Shin, Sung-Ho; Ji, Sangyoon; Choi, Seiho; Pyo, Kyoung-Hee; Wan An, Byeong; Park, Jihun; Kim, Joohee; Kim, Ju-Young; Lee, Ki-Suk; Kwon, Soon-Yong; Heo, Jaeyeong; Park, Byong-Guk; Park, Jang-Ung

    2017-03-31

    Integrated electronic circuitries with pressure sensors have been extensively researched as a key component for emerging electronics applications such as electronic skins and health-monitoring devices. Although existing pressure sensors display high sensitivities, they can only be used for specific purposes due to the narrow range of detectable pressure (under tens of kPa) and the difficulty of forming highly integrated arrays. However, it is essential to develop tactile pressure sensors with a wide pressure range in order to use them for diverse application areas including medical diagnosis, robotics or automotive electronics. Here we report an unconventional approach for fabricating fully integrated active-matrix arrays of pressure-sensitive graphene transistors with air-dielectric layers simply formed by folding two opposing panels. Furthermore, this realizes a wide tactile pressure sensing range from 250 Pa to ∼3 MPa. Additionally, fabrication of pressure sensor arrays and transparent pressure sensors are demonstrated, suggesting their substantial promise as next-generation electronics.

  3. Large-area multiplexed sensing using MEMS and fiber optics

    Science.gov (United States)

    Miller, Michael B.; Clark, Richard L., Jr.; Bell, Clifton R.; Russler, Patrick M.

    2000-06-01

    Micro-electro-mechanical (MEMS) technology offers the ability to implement local and independent sensing and actuation functions through the coordinated response of discrete micro-electro-mechanical 'basis function' elements. The small size of micromechanical components coupled with the ability to reduce costs using volume manufacturing techniques opens up significant potential not only in military applications such as flight and engine monitoring and control, but in autonomous vehicle control, smart munitions, airborne reconnaissance, LADAR, missile guidance, and even in intelligent transportation systems and automotive guidance applications. In this program, Luna Innovations is developing a flexible, programmable interface which can be integrated direction with different types of MEMS sensors, and then used to multiplex many sensors ona single optical fiber to provide a unique combination of functions that will allow larger quantities of sensory input with better resolution than ever before possible.

  4. Test Structures for Rapid Prototyping of Gas and Pressure Sensors

    Science.gov (United States)

    Buehler, M.; Cheng, L. J.; Martin, D.

    1996-01-01

    A multi-project ceramic substrate was used in developing a gas sensor and pressure sensor. The ceramic substrate cantained 36 chips with six variants including sensors, process control monitors, and an interconnect ship. Tha gas sensor is being developed as an air quality monitor and the pressure gauge as a barometer.

  5. Fiber optic pressure sensors in skin-friction measurements

    Science.gov (United States)

    Kidwell, R.

    1985-01-01

    Fiber optic lever pressure sensors intended for use in a low speed wind tunnel environment were designed, constructed and tested for the measurement of normal and shear displacements associated with the pressures acting on a flat aluminum plate. On-site tests performed along with several static and dynamic measurements made have established that, with proper modifications and improvements, the design concepts are acceptable and can be utilized for their intended use. Several elastomers were investigated for use in sensors and for their incorporation into these sensors. Design and assembly techniques for probes and complete sensors were developed.

  6. Temperature-independent fiber-Bragg-grating-based atmospheric pressure sensor

    Science.gov (United States)

    Zhang, Zhiguo; Shen, Chunyan; Li, Luming

    2018-03-01

    Atmospheric pressure is an important way to achieve a high degree of measurement for modern aircrafts, moreover, it is also an indispensable parameter in the meteorological telemetry system. With the development of society, people are increasingly concerned about the weather. Accurate and convenient atmospheric pressure parameters can provide strong support for meteorological analysis. However, electronic atmospheric pressure sensors currently in application suffer from several shortcomings. After an analysis and discussion, we propose an innovative structural design, in which a vacuum membrane box and a temperature-independent strain sensor based on an equal strength cantilever beam structure and fiber Bragg grating (FBG) sensors are used. We provide experimental verification of that the atmospheric pressure sensor device has the characteristics of a simple structure, lack of an external power supply, automatic temperature compensation, and high sensitivity. The sensor system has good sensitivity, which can be up to 100 nm/MPa, and repeatability. In addition, the device exhibits desired hysteresis.

  7. Carbon nanotube based pressure sensor for flexible electronics

    International Nuclear Information System (INIS)

    So, Hye-Mi; Sim, Jin Woo; Kwon, Jinhyeong; Yun, Jongju; Baik, Seunghyun; Chang, Won Seok

    2013-01-01

    Highlights: • The electromechanical change of vertically aligned carbon nanotubes. • Fabrication of CNT field-effect transistor on flexible substrate. • CNT based FET integrated active pressure sensor. • The integrated device yields an increase in the source-drain current under pressure. - Abstract: A pressure sensor was developed based on an arrangement of vertically aligned carbon nanotubes (VACNTs) supported by a polydimethylsiloxane (PDMS) matrix. The VACNTs embedded in the PDMS matrix were structurally flexible and provided repeated sensing operation due to the high elasticities of both the polymer and the carbon nanotubes (CNTs). The conductance increased in the presence of a loading pressure, which compressed the material and induced contact between neighboring CNTs, thereby producing a dense current path and better CNT/metal contacts. To achieve flexible functional electronics, VACNTs based pressure sensor was integrated with field-effect transistor, which is fabricated using sprayed semiconducting carbon nanotubes on plastic substrate

  8. Carbon nanotube based pressure sensor for flexible electronics

    Energy Technology Data Exchange (ETDEWEB)

    So, Hye-Mi [Department of Nano Mechanics, Nanomechanical Systems Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343 (Korea, Republic of); Sim, Jin Woo [Advanced Nano Technology Ltd., Seoul 132-710 (Korea, Republic of); Kwon, Jinhyeong [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701 (Korea, Republic of); Yun, Jongju; Baik, Seunghyun [SKKU Advanced Institute of Nanotechnology (SAINT), Department of Energy Science and School of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746 (Korea, Republic of); Chang, Won Seok, E-mail: paul@kimm.re.kr [Department of Nano Mechanics, Nanomechanical Systems Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343 (Korea, Republic of)

    2013-12-15

    Highlights: • The electromechanical change of vertically aligned carbon nanotubes. • Fabrication of CNT field-effect transistor on flexible substrate. • CNT based FET integrated active pressure sensor. • The integrated device yields an increase in the source-drain current under pressure. - Abstract: A pressure sensor was developed based on an arrangement of vertically aligned carbon nanotubes (VACNTs) supported by a polydimethylsiloxane (PDMS) matrix. The VACNTs embedded in the PDMS matrix were structurally flexible and provided repeated sensing operation due to the high elasticities of both the polymer and the carbon nanotubes (CNTs). The conductance increased in the presence of a loading pressure, which compressed the material and induced contact between neighboring CNTs, thereby producing a dense current path and better CNT/metal contacts. To achieve flexible functional electronics, VACNTs based pressure sensor was integrated with field-effect transistor, which is fabricated using sprayed semiconducting carbon nanotubes on plastic substrate.

  9. Discrete sensors distribution for accurate plantar pressure analyses.

    Science.gov (United States)

    Claverie, Laetitia; Ille, Anne; Moretto, Pierre

    2016-12-01

    The aim of this study was to determine the distribution of discrete sensors under the footprint for accurate plantar pressure analyses. For this purpose, two different sensor layouts have been tested and compared, to determine which was the most accurate to monitor plantar pressure with wireless devices in research and/or clinical practice. Ten healthy volunteers participated in the study (age range: 23-58 years). The barycenter of pressures (BoP) determined from the plantar pressure system (W-inshoe®) was compared to the center of pressures (CoP) determined from a force platform (AMTI) in the medial-lateral (ML) and anterior-posterior (AP) directions. Then, the vertical ground reaction force (vGRF) obtained from both W-inshoe® and force platform was compared for both layouts for each subject. The BoP and vGRF determined from the plantar pressure system data showed good correlation (SCC) with those determined from the force platform data, notably for the second sensor organization (ML SCC= 0.95; AP SCC=0.99; vGRF SCC=0.91). The study demonstrates that an adjusted placement of removable sensors is key to accurate plantar pressure analyses. These results are promising for a plantar pressure recording outside clinical or laboratory settings, for long time monitoring, real time feedback or for whatever activity requiring a low-cost system. Copyright © 2016 IPEM. Published by Elsevier Ltd. All rights reserved.

  10. Flexible Ferroelectric Sensors with Ultrahigh Pressure Sensitivity and Linear Response over Exceptionally Broad Pressure Range.

    Science.gov (United States)

    Lee, Youngoh; Park, Jonghwa; Cho, Soowon; Shin, Young-Eun; Lee, Hochan; Kim, Jinyoung; Myoung, Jinyoung; Cho, Seungse; Kang, Saewon; Baig, Chunggi; Ko, Hyunhyub

    2018-04-24

    Flexible pressure sensors with a high sensitivity over a broad linear range can simplify wearable sensing systems without additional signal processing for the linear output, enabling device miniaturization and low power consumption. Here, we demonstrate a flexible ferroelectric sensor with ultrahigh pressure sensitivity and linear response over an exceptionally broad pressure range based on the material and structural design of ferroelectric composites with a multilayer interlocked microdome geometry. Due to the stress concentration between interlocked microdome arrays and increased contact area in the multilayer design, the flexible ferroelectric sensors could perceive static/dynamic pressure with high sensitivity (47.7 kPa -1 , 1.3 Pa minimum detection). In addition, efficient stress distribution between stacked multilayers enables linear sensing over exceptionally broad pressure range (0.0013-353 kPa) with fast response time (20 ms) and high reliability over 5000 repetitive cycles even at an extremely high pressure of 272 kPa. Our sensor can be used to monitor diverse stimuli from a low to a high pressure range including weak gas flow, acoustic sound, wrist pulse pressure, respiration, and foot pressure with a single device.

  11. Performance Enhancement MEMS Based INS/GPS Integrated System Implemented on a FPGA for Terrestrial Applications

    OpenAIRE

    Garcia Quinchia, Alex

    2014-01-01

    Hoy en día con el desarrollo de sensores inerciales basados en Sistemas Micro\\-electromecánicos (MEMS), podemos encontrar acelerómetros y giróscopos embebidos en diferentes dispositivos y plataformas, teniéndolos en relojes, teléfonos inteligentes, consolas de video juego hasta sistemas de navegación terrestre y vehículos aéreos no tripulados (UAVs), {\\em etc}. A pesar del amplio rango de aplicaciones donde están siendo utilizados, los sensores inerciales de bajo costo (grado MEMs) son afecta...

  12. Plantar pressure cartography reconstruction from 3 sensors.

    Science.gov (United States)

    Abou Ghaida, Hussein; Mottet, Serge; Goujon, Jean-Marc

    2014-01-01

    Foot problem diagnosis is often made by using pressure mapping systems, unfortunately located and used in the laboratories. In the context of e-health and telemedicine for home monitoring of patients having foot problems, our focus is to present an acceptable system for daily use. We developed an ambulatory instrumented insole using 3 pressures sensors to visualize plantar pressure cartographies. We show that a standard insole with fixed sensor position could be used for different foot sizes. The results show an average error measured at each pixel of 0.01 daN, with a standard deviation of 0.005 daN.

  13. A family of fiber-optic based pressure sensors for intracochlear measurements

    Science.gov (United States)

    Olson, Elizabeth S.; Nakajima, Hideko H.

    2015-02-01

    Fiber-optic pressure sensors have been developed for measurements of intracochlear pressure. The present family of transducers includes an 81 μm diameter sensor employing a SLED light source and single-mode optic fiber, and LED/multi-mode sensors with 126 and 202 μm diameter. The 126 μm diameter pressure sensor also has been constructed with an electrode adhered to its side, for coincident pressure and voltage measurements. These sensors have been used for quantifying cochlear mechanical impedances, informing our understanding of conductive hearing loss and its remediation, and probing the operation of the cochlear amplifier.

  14. Ring-shaped inductive sensor design and application to pressure sensing

    Energy Technology Data Exchange (ETDEWEB)

    Noh, Myoung Gyu; Baek, Seong Ki; Park, Young Woo [Dept. of Mechatronics Engineering, Chungnam National University, Daejeon (Korea, Republic of); Kim, Sun Young [Samsung Electro-Mechanics, Busan (Korea, Republic of)

    2015-10-15

    Inductive sensors are versatile and economical devices that are widely used to measure a wide variety of physical variables, such as displacement, force, and pressure. In this paper, we propose a simple inductive sensor consisting of a thin partial ring and a coil set. The self-inductance of the sensor was estimated using magnetic circuit analysis and validated through finite element analysis (FEA). The natural frequency of the ring was estimated using Castigliano's theorem and the method of equivalent mass. The estimation was validated through experiments and FEA. A prototype sensor with a signal processing circuit is built and applied to noninvasively sense the pressure inside a flexible tube. The obtained sensor outputs show quadratic behavior with respect to the pressure. When fitted to a quadratic equation, the least-square measurement error was less than 2%. The results confirm the feasibility of pressure sensing using the proposed inductive sensor.

  15. Ring-shaped inductive sensor design and application to pressure sensing

    International Nuclear Information System (INIS)

    Noh, Myoung Gyu; Baek, Seong Ki; Park, Young Woo; Kim, Sun Young

    2015-01-01

    Inductive sensors are versatile and economical devices that are widely used to measure a wide variety of physical variables, such as displacement, force, and pressure. In this paper, we propose a simple inductive sensor consisting of a thin partial ring and a coil set. The self-inductance of the sensor was estimated using magnetic circuit analysis and validated through finite element analysis (FEA). The natural frequency of the ring was estimated using Castigliano's theorem and the method of equivalent mass. The estimation was validated through experiments and FEA. A prototype sensor with a signal processing circuit is built and applied to noninvasively sense the pressure inside a flexible tube. The obtained sensor outputs show quadratic behavior with respect to the pressure. When fitted to a quadratic equation, the least-square measurement error was less than 2%. The results confirm the feasibility of pressure sensing using the proposed inductive sensor

  16. Low-Cost Fiber Optic Pressure Sensor

    Science.gov (United States)

    Sheem, Sang K.

    2003-07-22

    The size and cost of fabricating fiber optic pressure sensors is reduced by fabricating the membrane of the sensor in a non-planar shape. The design of the sensors may be made in such a way that the non-planar membrane becomes a part of an air-tight cavity, so as to make the membrane resilient due to the air-cushion effect of the air-tight cavity. Such non-planar membranes are easier to make and attach.

  17. Touch at a distance sensing: lateral-line inspired MEMS flow sensors

    International Nuclear Information System (INIS)

    Prakash Kottapalli, Ajay Giri; Asadnia, Mohsen; Miao, Jianmin; Triantafyllou, Michael

    2014-01-01

    Evolution bestowed the blind cavefish with a resourcefully designed lateral-line of sensors that play an essential role in many important tasks including object detection and avoidance, energy-efficient maneuvering, rheotaxis etc. Biologists identified the two types of vital sensors on the fish bodies called the superficial neuromasts and the canal neuromasts that are responsible for flow sensing and pressure-gradient sensing, respectively. In this work, we present the design, fabrication and experimental characterization of biomimetic polymer artificial superficial neuromast micro-sensor arrays. These biomimetic micro-sensors demonstrated a high sensitivity of 0.9 mV/(m s −1 ) and 0.022 V/(m s −1 ) and threshold velocity detection limits of 0.1 m s −1 and 0.015 m s −1 in determining air and water flows respectively. Experimental results demonstrate that the biological canal inspired polymer encapsulation on the array of artificial superficial neuromast sensors is capable of filtering steady-state flows that could otherwise significantly mask the relevant oscillatory flow signals of high importance. (paper)

  18. System integration design in MEMS – A case study of ...

    Indian Academy of Sciences (India)

    solutions in MEMS technology is very much felt that combine single chip integration .... chip are being used for temperature compensation and to balance the bridge configuration. ..... to the offset voltage, which reduces the span of the sensor.

  19. Fabrication of 3D Carbon Microelectromechanical Systems (C-MEMS).

    Science.gov (United States)

    Pramanick, Bidhan; Martinez-Chapa, Sergio O; Madou, Marc; Hwang, Hyundoo

    2017-06-17

    A wide range of carbon sources are available in nature, with a variety of micro-/nanostructure configurations. Here, a novel technique to fabricate long and hollow glassy carbon microfibers derived from human hairs is introduced. The long and hollow carbon structures were made by the pyrolysis of human hair at 900 °C in a N2 atmosphere. The morphology and chemical composition of natural and pyrolyzed human hairs were investigated using scanning electron microscopy (SEM) and electron-dispersive X-ray spectroscopy (EDX), respectively, to estimate the physical and chemical changes due to pyrolysis. Raman spectroscopy was used to confirm the glassy nature of the carbon microstructures. Pyrolyzed hair carbon was introduced to modify screen-printed carbon electrodes ; the modified electrodes were then applied to the electrochemical sensing of dopamine and ascorbic acid. Sensing performance of the modified sensors was improved as compared to the unmodified sensors. To obtain the desired carbon structure design, carbon micro-/nanoelectromechanical system (C-MEMS/C-NEMS) technology was developed. The most common C-MEMS/C-NEMS fabrication process consists of two steps: (i) the patterning of a carbon-rich base material, such as a photosensitive polymer, using photolithography; and (ii) carbonization through the pyrolysis of the patterned polymer in an oxygen-free environment. The C-MEMS/NEMS process has been widely used to develop microelectronic devices for various applications, including in micro-batteries, supercapacitors, glucose sensors, gas sensors, fuel cells, and triboelectric nanogenerators. Here, recent developments of a high-aspect ratio solid and hollow carbon microstructures with SU8 photoresists are discussed. The structural shrinkage during pyrolysis was investigated using confocal microscopy and SEM. Raman spectroscopy was used to confirm the crystallinity of the structure, and the atomic percentage of the elements present in the material before and after

  20. Recent Improvement of Medical Optical Fibre Pressure and Temperature Sensors.

    Science.gov (United States)

    Poeggel, Sven; Duraibabu, Dineshbabu; Kalli, Kyriacos; Leen, Gabriel; Dooly, Gerard; Lewis, Elfed; Kelly, Jimmy; Munroe, Maria

    2015-07-13

    This investigation describes a detailed analysis of the fabrication and testing of optical fibre pressure and temperature sensors (OFPTS). The optical sensor of this research is based on an extrinsic Fabry-Perot interferometer (EFPI) with integrated fibre Bragg grating (FBG) for simultaneous pressure and temperature measurements. The sensor is fabricated exclusively in glass and with a small diameter of 0.2 mm, making it suitable for volume-restricted bio-medical applications. Diaphragm shrinking techniques based on polishing, hydrofluoric (HF) acid and femtosecond (FS) laser micro-machining are described and analysed. The presented sensors were examined carefully and demonstrated a pressure sensitivity in the range of sp = 2-10 nm/kPa and a resolution of better than ΔP = 10 Pa protect (0.1 cm H2O). A static pressure test in 38 cm H2O shows no drift of the sensor in a six-day period. Additionally, a dynamic pressure analysis demonstrated that the OFPTS never exceeded a drift of more than 130 Pa (1.3 cm H2O) in a 12-h measurement, carried out in a cardiovascular simulator. The temperature sensitivity is given by k = 10.7 pm/K, which results in a temperature resolution of better than ΔT = 0.1 K. Since the temperature sensing element is placed close to the pressure sensing element, the pressure sensor is insensitive to temperature changes.

  1. Videometrics-based Detection of Vibration Linearity in MEMS Gyroscope

    Directory of Open Access Journals (Sweden)

    Yong Zhou

    2011-05-01

    Full Text Available MEMS gyroscope performs as a sort of sensor to detect angular velocity, with diverse applications in engineering including vehicle and intelligent traffic etc. A balanced vibration of driving module excited by electrostatic driving signal is the base MEMS gyroscope's performance. In order to analyze the linear property of vibration in MEMS Gyroscope, a method of computer vision measuring is applied with the help of high-speed vidicon to obtain video of linear vibration of driving module in gyroscope, under the driving voltage signal of inherent frequency and amplitude linearly increasing. By means of image processing, target identifying, and motion parameter extracting from the obtained video, vibration curve with time variation is acquired. And then, linearity of this vibration system can be analyzed by focusing on the amplitude value of vibration responding to the amplitude variation of driving voltage signal.

  2. Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach.

    Science.gov (United States)

    Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah

    2009-01-01

    Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.

  3. Self-Correcting Electronically-Scanned Pressure Sensor

    Science.gov (United States)

    Gross, C.; Basta, T.

    1982-01-01

    High-data-rate sensor automatically corrects for temperature variations. Multichannel, self-correcting pressure sensor can be used in wind tunnels, aircraft, process controllers and automobiles. Offers data rates approaching 100,000 measurements per second with inaccuracies due to temperature shifts held below 0.25 percent (nominal) of full scale over a temperature span of 55 degrees C.

  4. A scalable pressure sensor based on an electrothermally and electrostatically operated resonator

    KAUST Repository

    Hajjaj, Amal Z.; Alcheikh, Nouha; Hafiz, Md Abdullah Al; Ilyas, Saad; Younis, Mohammad I.

    2017-01-01

    We present a pressure sensor based on the convective cooling of the air surrounding an electrothermally heated resonant bridge. Unlike conventional pressure sensors that rely on diaphragm deformation in response to pressure, the sensor does

  5. Invariant Observer-Based State Estimation for Micro-Aerial Vehicles in GPS-Denied Indoor Environments Using an RGB-D Camera and MEMS Inertial Sensors

    Directory of Open Access Journals (Sweden)

    Dachuan Li

    2015-04-01

    Full Text Available This paper presents a non-linear state observer-based integrated navigation scheme for estimating the attitude, position and velocity of micro aerial vehicles (MAV operating in GPS-denied indoor environments, using the measurements from low-cost MEMS (micro electro-mechanical systems inertial sensors and an RGB-D camera. A robust RGB-D visual odometry (VO approach was developed to estimate the MAV’s relative motion by extracting and matching features captured by the RGB-D camera from the environment. The state observer of the RGB-D visual-aided inertial navigation was then designed based on the invariant observer theory for systems possessing symmetries. The motion estimates from the RGB-D VO were fused with inertial and magnetic measurements from the onboard MEMS sensors via the state observer, providing the MAV with accurate estimates of its full six degree-of-freedom states. Implementations on a quadrotor MAV and indoor flight test results demonstrate that the resulting state observer is effective in estimating the MAV’s states without relying on external navigation aids such as GPS. The properties of computational efficiency and simplicity in gain tuning make the proposed invariant observer-based navigation scheme appealing for actual MAV applications in indoor environments.

  6. Calibration of Helmholtz Coils for the characterization of MEMS magnetic sensor using fluxgate magnetometer with DAS1 magnetic range data acquisition system

    Science.gov (United States)

    Ahmad, Farooq; Dennis, John Ojur; Md Khir, Mohd Haris; Hamid, Nor Hisham

    2012-09-01

    This paper presents the calibration of Helmholtz coils for the characterization of MEMS Magnetic sensor using Fluxgate magnetometer with DAS1 Magnetic Range Data Acquisition System. The Helmholtz coils arrangement is often used to generate a uniform magnetic field in space. In the past, standard magnets were used to calibrate the Helmholtz coils. A method is presented here for calibrating these coils using a Fluxgate magnetometer and known current source, which is easier and results in greater accuracy.

  7. Film bulk acoustic resonator pressure sensor with self temperature reference

    International Nuclear Information System (INIS)

    He, X L; Jin, P C; Zhou, J; Wang, W B; Dong, S R; Luo, J K; Garcia-Gancedo, L; Flewitt, A J; Milne, W I

    2012-01-01

    A novel film bulk acoustic resonator (FBAR) with two resonant frequencies which have opposite reactions to temperature changes has been designed. The two resonant modes respond differently to changes in temperature and pressure, with the frequency shift being linearly correlated with temperature and pressure changes. By utilizing the FBAR's sealed back trench as a cavity, an on-chip single FBAR sensor suitable for measuring pressure and temperature simultaneously is proposed and demonstrated. The experimental results show that the pressure coefficient of frequency for the lower frequency peak of the FBAR sensors is approximately −17.4 ppm kPa −1 , while that for the second peak is approximately −6.1 ppm kPa −1 , both of them being much more sensitive than other existing pressure sensors. This dual mode on-chip pressure sensor is simple in structure and operation, can be fabricated at very low cost, and yet requires no specific package, therefore has great potential for applications. (paper)

  8. A capacitive power sensor based on the MEMS cantilever beam fabricated by GaAs MMIC technology

    Science.gov (United States)

    Yi, Zhenxiang; Liao, Xiaoping

    2013-03-01

    In this paper, a novel capacitive power sensor based on the microelectromechanical systems (MEMS) cantilever beam at 8-12 GHz is proposed, fabricated and tested. The presented design can not only realize a cantilever beam instead of the conventional fixed-fixed beam, but also provide fine compatibility with the GaAs monolithic microwave integrated circuit (MMIC) process. When the displacement of the cantilever beam is very small compared with the initial height of the air gap, the capacitance change between the measuring electrode and the cantilever beam has an approximately linear dependence on the incident radio frequency (RF) power. Impedance compensating technology, by modifying the slot width of the coplanar waveguide transmission line, is adopted to minimize the effect of the cantilever beam on the power sensor; its validity is verified by the simulation of high frequency structure simulator software. The power sensor has been fabricated successfully by Au surface micromachining using polyimide as the sacrificial layer on the GaAs substrate. Optimization of the design with impedance compensating technology has resulted in a measured return loss of less than -25 dB and an insertion loss of around 0.1 dB at 8-12 GHz, which shows the slight effect of the cantilever beam on the microwave performance of this power sensor. The measured capacitance change starts from 0.7 fF to 1.3 fF when the incident RF power increases from 100 to 200 mW and an approximate linear dependence has been obtained. The measured sensitivities of the sensor are about 6.16, 6.27 and 6.03 aF mW-1 at 8, 10 and 12 GHz, respectively.

  9. Ultrafast Dynamic Pressure Sensors Based on Graphene Hybrid Structure.

    Science.gov (United States)

    Liu, Shanbiao; Wu, Xing; Zhang, Dongdong; Guo, Congwei; Wang, Peng; Hu, Weida; Li, Xinming; Zhou, Xiaofeng; Xu, Hejun; Luo, Chen; Zhang, Jian; Chu, Junhao

    2017-07-19

    Mechanical flexible electronic skin has been focused on sensing various physical parameters, such as pressure and temperature. The studies of material design and array-accessible devices are the building blocks of strain sensors for subtle pressure sensing. Here, we report a new and facile preparation of a graphene hybrid structure with an ultrafast dynamic pressure response. Graphene oxide nanosheets are used as a surfactant to prevent graphene restacking in aqueous solution. This graphene hybrid structure exhibits a frequency-independent pressure resistive sensing property. Exceeding natural skin, such pressure sensors, can provide transient responses from static up to 10 000 Hz dynamic frequencies. Integrated by the controlling system, the array-accessible sensors can manipulate a robot arm and self-rectify the temperature of a heating blanket. This may pave a path toward the future application of graphene-based wearable electronics.

  10. Ultrasonic level sensors for liquids under high pressure

    Science.gov (United States)

    Zuckerwar, A. J.; Mazel, D. S.; Hodges, D. Y.

    1986-01-01

    An ultrasonic level sensor of novel design continuously measures the level of a liquid subjected to a high pressure (up to about 40 MPa), as is sometimes required for the effective transfer of the liquid. The sensor operates as a composite resonator fabricated from a standard high-pressure plug. A flat-bottom hole is machined into the plug along its center line. An ultrasonic transducer is bonded rigidly to the interior surface of the bottom wall, while the exterior surface is in contact with the liquid. Although the bottom wall is designed to satisfy the pressure code, it is still sufficiently thin to permit ready excitation of the axisymmetric plate modes of vibration. The liquid level is measured by a conventional pulse-echo technique. A prototype sensor was tested successfully in a 2300-l water vessel at pressures up to about 37 MPa. A spectral analysis of the transmitted pulse reveals that the flexural, extensional, thickness-shear, and radial plate modes are excited into vibration, but none of these appears to be significantly affected by the pressurization of the liquid.

  11. Recent Improvement of Medical Optical Fibre Pressure and Temperature Sensors

    Directory of Open Access Journals (Sweden)

    Sven Poeggel

    2015-07-01

    Full Text Available This investigation describes a detailed analysis of the fabrication and testing of optical fibre pressure and temperature sensors (OFPTS. The optical sensor of this research is based on an extrinsic Fabry–Perot interferometer (EFPI with integrated fibre Bragg grating (FBG for simultaneous pressure and temperature measurements. The sensor is fabricated exclusively in glass and with a small diameter of 0.2 mm, making it suitable for volume-restricted bio-medical applications. Diaphragm shrinking techniques based on polishing, hydrofluoric (HF acid and femtosecond (FS laser micro-machining are described and analysed. The presented sensors were examined carefully and demonstrated a pressure sensitivity in the range of \\(s_p\\ = 2–10 \\(\\frac{\\text{nm}}{\\text{kPa}}\\ and a resolution of better than \\(\\Delta P\\ = 10 Pa protect (0.1 cm H\\(_2\\O. A static pressure test in 38 cmH\\(_2\\O shows no drift of the sensor in a six-day period. Additionally, a dynamic pressure analysis demonstrated that the OFPTS never exceeded a drift of more than 130 Pa (1.3 cm H\\(_2\\O in a 12-h measurement, carried out in a cardiovascular simulator. The temperature sensitivity is given by \\(k=10.7\\ \\(\\frac{\\text{pm}}{\\text{K}}\\, which results in a temperature resolution of better than \\(\\Delta T\\ = 0.1 K. Since the temperature sensing element is placed close to the pressure sensing element, the pressure sensor is insensitive to temperature changes.

  12. Capacitive Micro Pressure Sensor Integrated with a Ring Oscillator Circuit on Chip

    Directory of Open Access Journals (Sweden)

    Cheng-Yang Liu

    2009-12-01

    Full Text Available The study investigates a capacitive micro pressure sensor integrated with a ring oscillator circuit on a chip. The integrated capacitive pressure sensor is fabricated using the commercial CMOS (complementary metal oxide semiconductor process and a post-process. The ring oscillator is employed to convert the capacitance of the pressure sensor into the frequency output. The pressure sensor consists of 16 sensing cells in parallel. Each sensing cell contains a top electrode and a lower electrode, and the top electrode is a sandwich membrane. The pressure sensor needs a post-CMOS process to release the membranes after completion of the CMOS process. The post-process uses etchants to etch the sacrificial layers, and to release the membranes. The advantages of the post-process include easy execution and low cost. Experimental results reveal that the pressure sensor has a high sensitivity of 7 Hz/Pa in the pressure range of 0–300 kPa.

  13. Adaptive Sliding Mode Control of MEMS Gyroscope Based on Neural Network Approximation

    Directory of Open Access Journals (Sweden)

    Yuzheng Yang

    2014-01-01

    Full Text Available An adaptive sliding controller using radial basis function (RBF network to approximate the unknown system dynamics microelectromechanical systems (MEMS gyroscope sensor is proposed. Neural controller is proposed to approximate the unknown system model and sliding controller is employed to eliminate the approximation error and attenuate the model uncertainties and external disturbances. Online neural network (NN weight tuning algorithms, including correction terms, are designed based on Lyapunov stability theory, which can guarantee bounded tracking errors as well as bounded NN weights. The tracking error bound can be made arbitrarily small by increasing a certain feedback gain. Numerical simulation for a MEMS angular velocity sensor is investigated to verify the effectiveness of the proposed adaptive neural control scheme and demonstrate the satisfactory tracking performance and robustness.

  14. Capacitive MEMS-based sensors : thermo-mechanical stability and charge trapping

    NARCIS (Netherlands)

    van Essen, M.C.

    2009-01-01

    Micro-Electro Mechanical Systems (MEMS) are generally characterized as miniaturized systems with electrostatically driven moving parts. In many cases, the electrodes are capacitively coupled. This basic scheme allows for a plethora of specifications and functionality. This technology has presently

  15. An ultra-fast fiber optic pressure sensor for blast event measurements

    International Nuclear Information System (INIS)

    Wu, Nan; Tian, Ye; Wang, Xingwei; Zou, Xiaotian; Fitek, John; Maffeo, Michael; Niezrecki, Christopher; Chen, Julie

    2012-01-01

    Soldiers who are exposed to explosions are at risk of suffering traumatic brain injury (TBI). Since the causal relationship between a blast and TBI is poorly understood, it is critical to have sensors that can accurately quantify the blast dynamics and resulting wave propagation through a helmet and skull that are imparted onto and inside the brain. To help quantify the cause of TBI, it is important to record transient pressure data during a blast event. However, very few sensors feature the capabilities of tracking the dynamic pressure transients due to the rapid change of the pressure during blast events, while not interfering with the physical material layers or wave propagation. In order to measure the pressure transients efficiently, a pressure sensor should have a high resonant frequency and a high spatial resolution. This paper describes an ultra-fast fiber optic pressure sensor based on the Fabry–Perot principle for the application of measuring the rapid pressure changes in a blast event. A shock tube experiment performed in US Army Natick Soldier Research, Development and Engineering Center has demonstrated that the resonant frequency of the sensor is 4.12 MHz, which is relatively close to the designed theoretical value of 4.113 MHz. Moreover, the experiment illustrated that the sensor has a rise time of 120 ns, which demonstrates that the sensor is capable of observing the dynamics of the pressure transient during a blast event. (paper)

  16. Bladder pressure sensors in an animal model

    NARCIS (Netherlands)

    Koldewijn, E. L.; van Kerrebroeck, P. E.; Schaafsma, E.; Wijkstra, H.; Debruyne, F. M.; Brindley, G. S.

    1994-01-01

    Urinary incontinence due to detrusor hyperreflexia might be inhibited on demand if changes in bladder pressure could be detected by sensors and transferred into pudendal nerve electrostimulation. The aim of this study is to investigate how the bladder wall reacts on different sensor implants.

  17. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  18. Piezoelectric microelectromechanical resonant sensors for chemical and biological detection.

    Science.gov (United States)

    Pang, Wei; Zhao, Hongyuan; Kim, Eun Sok; Zhang, Hao; Yu, Hongyu; Hu, Xiaotang

    2012-01-07

    Piezoelectric microelectromechanical systems (MEMS) resonant sensors, known for their excellent mass resolution, have been studied for many applications, including DNA hybridization, protein-ligand interactions, and immunosensor development. They have also been explored for detecting antigens, organic gas, toxic ions, and explosives. Most piezoelectric MEMS resonant sensors are acoustic sensors (with specific coating layers) that enable selective and label-free detection of biological events in real time. These label-free technologies have recently garnered significant attention for their sensitive and quantitative multi-parameter analysis of biological systems. Since piezoelectric MEMS resonant sensors do more than transform analyte mass or thickness into an electrical signal (e.g., frequency and impedance), special attention must be paid to their potential beyond microweighing, such as measuring elastic and viscous properties, and several types of sensors currently under development operate at different resonant modes (i.e., thickness extensional mode, thickness shear mode, lateral extensional mode, flexural mode, etc.). In this review, we provide an overview of recent developments in micromachined resonant sensors and activities relating to biochemical interfaces for acoustic sensors.

  19. A CMOS pressure sensor tag chip for passive wireless applications.

    Science.gov (United States)

    Deng, Fangming; He, Yigang; Li, Bing; Zuo, Lei; Wu, Xiang; Fu, Zhihui

    2015-03-23

    This paper presents a novel monolithic pressure sensor tag for passive wireless applications. The proposed pressure sensor tag is based on an ultra-high frequency RFID system. The pressure sensor element is implemented in the 0.18 µm CMOS process and the membrane gap is formed by sacrificial layer release, resulting in a sensitivity of 1.2 fF/kPa within the range from 0 to 600 kPa. A three-stage rectifier adopts a chain of auxiliary floating rectifier cells to boost the gate voltage of the switching transistors, resulting in a power conversion efficiency of 53% at the low input power of -20 dBm. The capacitive sensor interface, using phase-locked loop archietcture, employs fully-digital blocks, which results in a 7.4 bits resolution and 0.8 µW power dissipation at 0.8 V supply voltage. The proposed passive wireless pressure sensor tag costs a total 3.2 µW power dissipation.

  20. Temperature Compensation Fiber Bragg Grating Pressure Sensor Based on Plane Diaphragm

    Science.gov (United States)

    Liang, Minfu; Fang, Xinqiu; Ning, Yaosheng

    2018-03-01

    Pressure sensors are the essential equipments in the field of pressure measurement. In this work, we propose a temperature compensation fiber Bragg grating (FBG) pressure sensor based on the plane diaphragm. The plane diaphragm and pressure sensitivity FBG (PS FBG) are used as the pressure sensitive components, and the temperature compensation FBG (TC FBG) is used to improve the temperature cross-sensitivity. Mechanical deformation model and deformation characteristics simulation analysis of the diaphragm are presented. The measurement principle and theoretical analysis of the mathematical relationship between the FBG central wavelength shift and pressure of the sensor are introduced. The sensitivity and measure range can be adjusted by utilizing the different materials and sizes of the diaphragm to accommodate different measure environments. The performance experiments are carried out, and the results indicate that the pressure sensitivity of the sensor is 35.7 pm/MPa in a range from 0 MPa to 50 MPa and has good linearity with a linear fitting correlation coefficient of 99.95%. In addition, the sensor has the advantages of low frequency chirp and high stability, which can be used to measure pressure in mining engineering, civil engineering, or other complex environment.

  1. Temperature Compensation Fiber Bragg Grating Pressure Sensor Based on Plane Diaphragm

    Science.gov (United States)

    Liang, Minfu; Fang, Xinqiu; Ning, Yaosheng

    2018-06-01

    Pressure sensors are the essential equipments in the field of pressure measurement. In this work, we propose a temperature compensation fiber Bragg grating (FBG) pressure sensor based on the plane diaphragm. The plane diaphragm and pressure sensitivity FBG (PS FBG) are used as the pressure sensitive components, and the temperature compensation FBG (TC FBG) is used to improve the temperature cross-sensitivity. Mechanical deformation model and deformation characteristics simulation analysis of the diaphragm are presented. The measurement principle and theoretical analysis of the mathematical relationship between the FBG central wavelength shift and pressure of the sensor are introduced. The sensitivity and measure range can be adjusted by utilizing the different materials and sizes of the diaphragm to accommodate different measure environments. The performance experiments are carried out, and the results indicate that the pressure sensitivity of the sensor is 35.7 pm/MPa in a range from 0 MPa to 50 MPa and has good linearity with a linear fitting correlation coefficient of 99.95%. In addition, the sensor has the advantages of low frequency chirp and high stability, which can be used to measure pressure in mining engineering, civil engineering, or other complex environment.

  2. Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

    Science.gov (United States)

    Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.

    1995-01-01

    In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

  3. Transparent, Flexible, Conformal Capacitive Pressure Sensors with Nanoparticles.

    Science.gov (United States)

    Kim, Hyeohn; Kim, Gwangmook; Kim, Taehoon; Lee, Sangwoo; Kang, Donyoung; Hwang, Min-Soo; Chae, Youngcheol; Kang, Shinill; Lee, Hyungsuk; Park, Hong-Gyu; Shim, Wooyoung

    2018-02-01

    The fundamental challenge in designing transparent pressure sensors is the ideal combination of high optical transparency and high pressure sensitivity. Satisfying these competing demands is commonly achieved by a compromise between the transparency and usage of a patterned dielectric surface, which increases pressure sensitivity, but decreases transparency. Herein, a design strategy for fabricating high-transparency and high-sensitivity capacitive pressure sensors is proposed, which relies on the multiple states of nanoparticle dispersity resulting in enhanced surface roughness and light transmittance. We utilize two nanoparticle dispersion states on a surface: (i) homogeneous dispersion, where each nanoparticle (≈500 nm) with a size comparable to the visible light wavelength has low light scattering; and (ii) heterogeneous dispersion, where aggregated nanoparticles form a micrometer-sized feature, increasing pressure sensitivity. This approach is experimentally verified using a nanoparticle-dispersed polymer composite, which has high pressure sensitivity (1.0 kPa -1 ), and demonstrates excellent transparency (>95%). We demonstrate that the integration of nanoparticle-dispersed capacitor elements into an array readily yields a real-time pressure monitoring application and a fully functional touch device capable of acting as a pressure sensor-based input device, thereby opening up new avenues to establish processing techniques that are effective on the nanoscale yet applicable to macroscopic processing. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  4. Piezoelectric power generation for sensor applications: design of a battery-less wireless tire pressure sensor

    Science.gov (United States)

    Makki, Noaman; Pop-Iliev, Remon

    2011-06-01

    An in-wheel wireless and battery-less piezo-powered tire pressure sensor is developed. Where conventional battery powered Tire Pressure Monitoring Systems (TPMS) are marred by the limited battery life, TPMS based on power harvesting modules provide virtually unlimited sensor life. Furthermore, the elimination of a permanent energy reservoir simplifies the overall sensor design through the exclusion of extra circuitry required to sense vehicle motion and conserve precious battery capacity during vehicle idling periods. In this paper, two design solutions are presented, 1) with very low cost highly flexible piezoceramic (PZT) bender elements bonded directly to the tire to generate power required to run the sensor and, 2) a novel rim mounted PZT harvesting unit that can be used to power pressure sensors incorporated into the valve stem requiring minimal change to the presently used sensors. While both the designs eliminate the use of environmentally unfriendly battery from the TPMS design, they offer advantages of being very low cost, service free and easily replaceable during tire repair and replacement.

  5. Static and cyclic performance evaluation of sensors for human interface pressure measurement.

    Science.gov (United States)

    Dabling, Jeffrey G; Filatov, Anton; Wheeler, Jason W

    2012-01-01

    Researchers and clinicians often desire to monitor pressure distributions on soft tissues at interfaces to mechanical devices such as prosthetics, orthotics or shoes. The most common type of sensor used for this type of applications is a Force Sensitive Resistor (FSR) as these are convenient to use and inexpensive. Several other types of sensors exist that may have superior sensing performance but are less ubiquitous or more expensive, such as optical or capacitive sensors. We tested five sensors (two FSRs, one optical, one capacitive and one fluid pressure) in a static drift and cyclic loading configuration. The results show that relative to the important performance characteristics for soft tissue pressure monitoring (i.e. hysteresis, drift), many of the sensors tested have significant limitations. The FSRs exhibited hysteresis, drift and loss of sensitivity under cyclic loading. The capacitive sensor had substantial drift. The optical sensor had some hysteresis and temperature-related drift. The fluid pressure sensor performed well in these tests but is not as flat as the other sensors and is not commercially available. Researchers and clinicians should carefully consider the convenience and performance trade-offs when choosing a sensor for soft-tissue pressure monitoring.

  6. A Dual-Linear Kalman Filter for Real-Time Orientation Determination System Using Low-Cost MEMS Sensors.

    Science.gov (United States)

    Zhang, Shengzhi; Yu, Shuai; Liu, Chaojun; Yuan, Xuebing; Liu, Sheng

    2016-02-20

    To provide a long-time reliable orientation, sensor fusion technologies are widely used to integrate available inertial sensors for the low-cost orientation estimation. In this paper, a novel dual-linear Kalman filter was designed for a multi-sensor system integrating MEMS gyros, an accelerometer, and a magnetometer. The proposed filter precludes the impacts of magnetic disturbances on the pitch and roll which the heading is subjected to. The filter can achieve robust orientation estimation for different statistical models of the sensors. The root mean square errors (RMSE) of the estimated attitude angles are reduced by 30.6% under magnetic disturbances. Owing to the reduction of system complexity achieved by smaller matrix operations, the mean total time consumption is reduced by 23.8%. Meanwhile, the separated filter offers greater flexibility for the system configuration, as it is possible to switch on or off the second stage filter to include or exclude the magnetometer compensation for the heading. Online experiments were performed on the homemade miniature orientation determination system (MODS) with the turntable. The average RMSE of estimated orientation are less than 0.4° and 1° during the static and low-dynamic tests, respectively. More realistic tests on two-wheel self-balancing vehicle driving and indoor pedestrian walking were carried out to evaluate the performance of the designed MODS when high accelerations and angular rates were introduced. Test results demonstrate that the MODS is applicable for the orientation estimation under various dynamic conditions. This paper provides a feasible alternative for low-cost orientation determination.

  7. Fabrication and Analysis of Tapered Tip Silicon Microneedles for MEMS based Drug Delivery System

    Directory of Open Access Journals (Sweden)

    Muhammad Waseem Ashraf

    2010-11-01

    Full Text Available In this paper, a novel design of transdermal drug delivery (TDD system is presented. The proposed system consists of controlled electronic circuit and microelectromechanical system (MEMS based devices like microneedles, micropump, flow sensor, and blood pressure sensor. The aim of this project is to develop a system that can eliminate the limitations associated with oral therapy. In this phase tapered tip silicon microneedles have been fabricated using inductively coupled plasma (ICP etching technology. Using ANSYS, simulation of microneedles has been conducted before the fabrication process to test the design suitability for TDD. More over multifield analysis of reservoir integrated with microneedle array using piezoelectric actuator has also been performed. The effects of frequency and voltage on actuator and fluid flow rate through 6×6 microneedle array have been investigated. This work provides envisage data to design suitable devices for TDD.

  8. MEMS-based thermally-actuated image stabilizer for cellular phone camera

    International Nuclear Information System (INIS)

    Lin, Chun-Ying; Chiou, Jin-Chern

    2012-01-01

    This work develops an image stabilizer (IS) that is fabricated using micro-electro-mechanical system (MEMS) technology and is designed to counteract the vibrations when human using cellular phone cameras. The proposed IS has dimensions of 8.8 × 8.8 × 0.3 mm 3 and is strong enough to suspend an image sensor. The processes that is utilized to fabricate the IS includes inductive coupled plasma (ICP) processes, reactive ion etching (RIE) processes and the flip-chip bonding method. The IS is designed to enable the electrical signals from the suspended image sensor to be successfully emitted out using signal output beams, and the maximum actuating distance of the stage exceeds 24.835 µm when the driving current is 155 mA. Depending on integration of MEMS device and designed controller, the proposed IS can decrease the hand tremor by 72.5%. (paper)

  9. Structural integrated sensor and actuator systems for active flow control

    Science.gov (United States)

    Behr, Christian; Schwerter, Martin; Leester-Schädel, Monika; Wierach, Peter; Dietzel, Andreas; Sinapius, Michael

    2016-04-01

    An adaptive flow separation control system is designed and implemented as an essential part of a novel high-lift device for future aircraft. The system consists of MEMS pressure sensors to determine the flow conditions and adaptive lips to regulate the mass flow and the velocity of a wall near stream over the internally blown Coanda flap. By the oscillating lip the mass flow in the blowing slot changes dynamically, consequently the momentum exchange of the boundary layer over a high lift flap required mass flow can be reduced. These new compact and highly integrated systems provide a real-time monitoring and manipulation of the flow conditions. In this context the integration of pressure sensors into flow sensing airfoils of composite material is investigated. Mechanical and electrical properties of the integrated sensors are investigated under mechanical loads during tensile tests. The sensors contain a reference pressure chamber isolated to the ambient by a deformable membrane with integrated piezoresistors connected as a Wheatstone bridge, which outputs voltage signals depending on the ambient pressure. The composite material in which the sensors are embedded consists of 22 individual layers of unidirectional glass fiber reinforced plastic (GFRP) prepreg. The results of the experiments are used for adapting the design of the sensors and the layout of the laminate to ensure an optimized flux of force in highly loaded structures primarily for future aeronautical applications. It can be shown that the pressure sensor withstands the embedding process into fiber composites with full functional capability and predictable behavior under stress.

  10. Integrated electronics and fluidic MEMS for bioengineering

    Science.gov (United States)

    Fok, Ho Him Raymond

    Microelectromechanical systems (MEMS) and microelectronics have become enabling technologies for many research areas. This dissertation presents the use of fluidic MEMS and microelectronics for bioengineering applications. In particular, the versatility of MEMS and microelectronics is highlighted by the presentation of two different applications, one for in-vitro study of nano-scale dynamics during cell division and one for in-vivo monitoring of biological activities at the cellular level. The first application of an integrated system discussed in this dissertation is to utilize fluidic MEMS for studying dynamics in the mitotic spindle, which could lead to better chemotherapeutic treatments for cancer patients. Previous work has developed the use of electrokinetic phenomena on the surface of a glass-based platform to assemble microtubules, the building blocks of mitotic spindles. Nevertheless, there are two important limitations of this type of platform. First, an unconventional microfabrication process is necessary for the glass-based platform, which limits the utility of this platform. In order to overcome this limitation, in this dissertation a convenient microfluidic system is fabricated using a negative photoresist called SU-8. The fabrication process for the SU-8-based system is compatible with other fabrication techniques used in developing microelectronics, and this compatibility is essential for integrating electronics for studying dynamics in the mitotic spindle. The second limitation of the previously-developed glass-based platform is its lack of bio-compatibility. For example, microtubules strongly interact with the surface of the glass-based platform, thereby hindering the study of dynamics in the mitotic spindle. This dissertation presents a novel approach for assembling microtubules away from the surface of the platform, and a fabrication process is developed to assemble microtubules between two self-aligned thin film electrodes on thick SU-8

  11. Integration of piezo-capacitive and piezo-electric nanoweb based pressure sensors for imaging of static and dynamic pressure distribution.

    Science.gov (United States)

    Jeong, Y J; Oh, T I; Woo, E J; Kim, K J

    2017-07-01

    Recently, highly flexible and soft pressure distribution imaging sensor is in great demand for tactile sensing, gait analysis, ubiquitous life-care based on activity recognition, and therapeutics. In this study, we integrate the piezo-capacitive and piezo-electric nanowebs with the conductive fabric sheets for detecting static and dynamic pressure distributions on a large sensing area. Electrical impedance tomography (EIT) and electric source imaging are applied for reconstructing pressure distribution images from measured current-voltage data on the boundary of the hybrid fabric sensor. We evaluated the piezo-capacitive nanoweb sensor, piezo-electric nanoweb sensor, and hybrid fabric sensor. The results show the feasibility of static and dynamic pressure distribution imaging from the boundary measurements of the fabric sensors.

  12. Response time verification of in situ hydraulic pressure sensors in a nuclear reactor

    International Nuclear Information System (INIS)

    Foster, C.G.

    1978-01-01

    A method and apparatus for verifying response time in situ of hydraulic pressure and pressure differential sensing instrumentation in a nuclear circuit is disclosed. Hydraulic pressure at a reference sensor and at an in situ process sensor under test is varied according to a linear ramp. Sensor response time is then determined by comparison of the sensor electrical analog output signals. The process sensor is subjected to a relatively slowly changing and a relatively rapidly changing hydraulic pressure ramp signal to determine an upper bound for process sensor response time over the range of all pressure transients to which the sensor is required to respond. Signal linearity is independent of the volumetric displacement of the process sensor. The hydraulic signal generator includes a first pressurizable gas reservoir, a second pressurizable liquid and gas reservoir, a gate for rapidly opening a gas communication path between the two reservoirs, a throttle valve for regulating rate of gas pressure equalization between the two reservoirs, and hydraulic conduit means for simultaneously communicating a ramp of hydraulic pressure change between the liquid/gas reservoir and both a reference and a process sensor. By maintaining a sufficient pressure differential between the reservoirs and by maintaining a sufficient ratio of gas to liquid in the liquid/gas reservoir, excellent linearity and minimal transient effects can be achieved for all pressure ranges, magnitudes, and rates of change of interest

  13. Intrinsic Low Hysteresis Touch Mode Capacitive Pressure Sensor

    DEFF Research Database (Denmark)

    Fragiacomo, Giulio; Pedersen, Thomas; Hansen, Ole

    2011-01-01

    Hysteresis has always been one of the main concerns when fabricating touch mode capacitive pressure sensors (TMCPS). This phenomenon can be fought at two different levels: during fabrication or after fabrication with the aid of a dedicated signal conditioning circuit. We will describe...... a microfabrication step that can be introduced in order to reduce drastically the hysteresis of this type of sensors without compromising their sensitivity. Medium-high range (0 to 10 bar absolute pressure) TMCPS with a capacitive signal span of over 100pF and less than 1 % hysteresis in the entire pressure range...

  14. An improved fiber optic pressure and temperature sensor for downhole application

    International Nuclear Information System (INIS)

    Aref, S H; Zibaii, M I; Latifi, H

    2009-01-01

    We report on the fabrication of a high pressure extrinsic Fabry–Perot interferometric (EFPI) fiber optic sensor for downhole applications by using a mechanical transducer. The mechanical transducer has been used for increasing the pressure sensitivity and the possibility of installation of the sensor downhole. The pressure–temperature cross-sensitivity (PTCS) problem has been solved by replacing the reflecting fiber with a metal microwire in the EFPI sensor. In this way the PTCS coefficient of the sensor was decreased from 47.25 psi °C −1 to 7 psi °C −1 . By using a new EFPI design, a temperature sensor was fabricated. Further improvement in the pressure and temperature sensor has been done by developing fabrication technique and signal processing

  15. A minimally invasive in-fiber Bragg grating sensor for intervertebral disc pressure measurements

    International Nuclear Information System (INIS)

    Dennison, Christopher R; Wild, Peter M; Wilson, David R; Cripton, Peter A

    2008-01-01

    We present an in-fiber Bragg grating (FBG) based intervertebral disc (IVD) pressure sensor that has pressure sensitivity seven times greater than that of a bare fiber, and a major diameter and sensing area of only 400 µm and 0.03 mm 2 , respectively. This is the only optical, the smallest and the most mechanically compliant disc pressure sensor reported in the literature. This is also an improvement over other FBG pressure sensors that achieve increased sensitivity through mechanical amplification schemes, usually resulting in major diameters and sensing lengths of many millimeters. Sensor sensitivity is predicted using numerical models, and the predicted sensitivity is verified through experimental calibrations. The sensor is validated by conducting IVD pressure measurements in porcine discs and comparing the FBG measurements to those obtained using the current standard sensor for IVD pressure. The predicted sensitivity of the FBG sensor matched with that measured experimentally. IVD pressure measurements showed excellent repeatability and agreement with those obtained from the standard sensor. Unlike the current larger sensors, the FBG sensor could be used in discs with small disc height (i.e. cervical or degenerated discs). Therefore, there is potential to conduct new measurements that could lead to new understanding of the biomechanics

  16. Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program

    Science.gov (United States)

    Zunino, James L., III; Skelton, Donald

    2005-01-01

    As the United States (U.S.) Army transforms into a lighter, more lethal, and more agile force, the technologies that support both legacy and emerging weapon systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army as well as entire DOD will heavily rely on in achieving these objectives. Current and future military applications of MEMS devices include safety and arming devices, guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless radio frequency identification (RFID), etc. Even though the reliance on MEMS devices has been increasing, there have been no studies performed to determine their reliability and failure mechanisms. Furthermore, no standardized test protocols exist for assessing reliability. Accordingly, the U.S. Army Corrosion Office at Picatinny, NJ has initiated the MEMS Reliability Assessment Program to address this issue.

  17. Direct Printing of Stretchable Elastomers for Highly Sensitive Capillary Pressure Sensors.

    Science.gov (United States)

    Liu, Wenguang; Yan, Chaoyi

    2018-03-28

    We demonstrate the successful fabrication of highly sensitive capillary pressure sensors using an innovative 3D printing method. Unlike conventional capacitive pressure sensors where the capacitance changes were due to the pressure-induced interspace variations between the parallel plate electrodes, in our capillary sensors the capacitance was determined by the extrusion and extraction of liquid medium and consequent changes of dielectric constants. Significant pressure sensitivity advances up to 547.9 KPa -1 were achieved. Moreover, we suggest that our innovative capillary pressure sensors can adopt a wide range of liquid mediums, such as ethanol, deionized water, and their mixtures. The devices also showed stable performances upon repeated pressing cycles. The direct and versatile printing method combined with the significant performance advances are expected to find important applications in future stretchable and wearable electronics.

  18. Cantilever arrayed blood pressure sensor for arterial applanation tonometry.

    Science.gov (United States)

    Lee, Byeungleul; Jeong, Jinwoo; Kim, Jinseok; Kim, Bonghwan; Chun, Kukjin

    2014-03-01

    The authors developed a cantilever-arrayed blood pressure sensor array fabricated by (111) silicon bulk-micromachining for the non-invasive and continuous measurement of blood pressure. The blood pressure sensor measures the blood pressure based on the change in the resistance of the piezoresistor on a 5-microm-thick-arrayed perforated membrane and 20-microm-thick metal pads. The length and the width of the unit membrane are 210 and 310 microm, respectively. The width of the insensible zone between the adjacent units is only 10 microm. The resistance change over contact force was measured to verify the performance. The good linearity of the result confirmed that the polydimethylsiloxane package transfers the forces appropriately. The measured sensitivity was about 4.5%/N. The maximum measurement range and the resolution of the fabricated blood pressure sensor were greater than 900 mmHg (= 120 kPa) and less than 1 mmHg (= 133.3 Pa), respectively.

  19. A CMOS pressure sensor with integrated interface for passive RFID applications

    International Nuclear Information System (INIS)

    Deng, Fangming; He, Yigang; Wu, Xiang; Fu, Zhihui

    2014-01-01

    This paper presents a CMOS pressure sensor with integrated interface for passive RFID sensing applications. The pressure sensor consists of three parts: top electrode, dielectric layer and bottom electrode. The dielectric layer consists of silicon oxide and an air gap. The bottom electrode is made of polysilicon. The gap is formed by sacrificial layer release and the Al vapor process is used to seal the gap and form the top electrode. The sensor interface is based on phase-locked architecture, which allows the use of fully digital blocks. The proposed pressure sensor and interface is fabricated in a 0.18 μm CMOS process. The measurement results show the pressure sensor achieves excellent linearity with a sensitivity of 1.2 fF kPa −1 . The sensor interface consumes only 1.1 µW of power at 0.5 V voltage supply, which is at least an order of magnitude better than state-of-the-art designs. (paper)

  20. Different grades MEMS accelerometers error characteristics

    Science.gov (United States)

    Pachwicewicz, M.; Weremczuk, J.

    2017-08-01

    The paper presents calibration effects of two different MEMS accelerometers of different price and quality grades and discusses different accelerometers errors types. The calibration for error determining is provided by reference centrifugal measurements. The design and measurement errors of the centrifuge are discussed as well. It is shown that error characteristics of the sensors are very different and it is not possible to use simple calibration methods presented in the literature in both cases.

  1. Chronically implanted pressure sensors: challenges and state of the field.

    Science.gov (United States)

    Yu, Lawrence; Kim, Brian J; Meng, Ellis

    2014-10-31

    Several conditions and diseases are linked to the elevation or depression of internal pressures from a healthy, normal range, motivating the need for chronic implantable pressure sensors. A simple implantable pressure transduction system consists of a pressure-sensing element with a method to transmit the data to an external unit. The biological environment presents a host of engineering issues that must be considered for long term monitoring. Therefore, the design of such systems must carefully consider interactions between the implanted system and the body, including biocompatibility, surgical placement, and patient comfort. Here we review research developments on implantable sensors for chronic pressure monitoring within the body, focusing on general design requirements for implantable pressure sensors as well as specifications for different medical applications. We also discuss recent efforts to address biocompatibility, efficient telemetry, and drift management, and explore emerging trends.

  2. Simulations of piezoelectric pressure sensor for radial artery pulse measurement

    Energy Technology Data Exchange (ETDEWEB)

    Joshi, Abhay B. [Department of Electronic Science, University of Pune, Pune 411 007 (India); Kalange, Ashok E. [Department of Electronic Science, University of Pune, Pune 411 007 (India); Tuljaram Chaturchand College, Baramati 413 102 (India); Bodas, Dhananjay, E-mail: dhananjay.bodas@gmail.co [Center for Nanobio Sciences, Agharkar Research Institute, Pune 411 004 (India); Gangal, S.A. [Department of Electronic Science, University of Pune, Pune 411 007 (India)

    2010-04-15

    A radial artery pulse is used to diagnose human body constitution (Prakruti) in Ayurveda. A system consisting of piezoelectric sensor (22 mm x 12 mm), data acquisition card and LabView software was used to record the pulse data. The pulse obtained from the sensor was noisy, even though signal processing was done. Moreover due to large sized senor accurate measurements were not possible. Hence, a need was felt to develop a sensor of the size of the order of finger tip with a resonant frequency of the order of 1 Hz. A micromachined pressure sensor based on piezoelectric sensing mechanism was designed and simulated using CoventorWare. Simulations were carried out by varying dimensions of the sensor to optimize the resonant frequency, stresses and voltage generated as a function of applied pressure. All simulations were done with pressure ranging of 1-30 kPa, which is the range used by Ayurvedic practitioners for diagnosis. Preliminary work on fabrication of such a sensor was carried out successfully.

  3. Simulations of piezoelectric pressure sensor for radial artery pulse measurement

    International Nuclear Information System (INIS)

    Joshi, Abhay B.; Kalange, Ashok E.; Bodas, Dhananjay; Gangal, S.A.

    2010-01-01

    A radial artery pulse is used to diagnose human body constitution (Prakruti) in Ayurveda. A system consisting of piezoelectric sensor (22 mm x 12 mm), data acquisition card and LabView software was used to record the pulse data. The pulse obtained from the sensor was noisy, even though signal processing was done. Moreover due to large sized senor accurate measurements were not possible. Hence, a need was felt to develop a sensor of the size of the order of finger tip with a resonant frequency of the order of 1 Hz. A micromachined pressure sensor based on piezoelectric sensing mechanism was designed and simulated using CoventorWare. Simulations were carried out by varying dimensions of the sensor to optimize the resonant frequency, stresses and voltage generated as a function of applied pressure. All simulations were done with pressure ranging of 1-30 kPa, which is the range used by Ayurvedic practitioners for diagnosis. Preliminary work on fabrication of such a sensor was carried out successfully.

  4. The annealing effects on irradiated SiC piezo resistive pressure sensor

    International Nuclear Information System (INIS)

    Almaz, E.; Blue, T. E.; Zhang, P.

    2009-01-01

    The effects of temperature on annealing of Silicon Carbide (SiC) piezo resistive pressure sensor which was broken after high fluence neutron irradiation, were investigated. Previously, SiC piezo resistive sensor irradiated with gamma ray and fast neutron in the Co-60 gamma-ray irradiator and Beam Port 1 (BP1) and Auxiliary Irradiation Facility (AIF) at the Ohio State University Nuclear Reactor Laboratory (OSUNRL) respectively. The Annealing temperatures were tested up to 400 C. The Pressure-Output voltage results showed recovery after annealing process on SiC piezo resistive pressure sensor. The bridge resistances of the SiC pressure sensor stayed at the same level up to 300 C. After 400 C annealing, the resistance values changed dramatically.

  5. A capacitive power sensor based on the MEMS cantilever beam fabricated by GaAs MMIC technology

    International Nuclear Information System (INIS)

    Yi, Zhenxiang; Liao, Xiaoping

    2013-01-01

    In this paper, a novel capacitive power sensor based on the microelectromechanical systems (MEMS) cantilever beam at 8–12 GHz is proposed, fabricated and tested. The presented design can not only realize a cantilever beam instead of the conventional fixed–fixed beam, but also provide fine compatibility with the GaAs monolithic microwave integrated circuit (MMIC) process. When the displacement of the cantilever beam is very small compared with the initial height of the air gap, the capacitance change between the measuring electrode and the cantilever beam has an approximately linear dependence on the incident radio frequency (RF) power. Impedance compensating technology, by modifying the slot width of the coplanar waveguide transmission line, is adopted to minimize the effect of the cantilever beam on the power sensor; its validity is verified by the simulation of high frequency structure simulator software. The power sensor has been fabricated successfully by Au surface micromachining using polyimide as the sacrificial layer on the GaAs substrate. Optimization of the design with impedance compensating technology has resulted in a measured return loss of less than −25 dB and an insertion loss of around 0.1 dB at 8–12 GHz, which shows the slight effect of the cantilever beam on the microwave performance of this power sensor. The measured capacitance change starts from 0.7 fF to 1.3 fF when the incident RF power increases from 100 to 200 mW and an approximate linear dependence has been obtained. The measured sensitivities of the sensor are about 6.16, 6.27 and 6.03 aF mW −1 at 8, 10 and 12 GHz, respectively. (paper)

  6. A Wireless Pressure Sensor Integrated with a Biodegradable Polymer Stent for Biomedical Applications.

    Science.gov (United States)

    Park, Jongsung; Kim, Ji-Kwan; Patil, Swati J; Park, Jun-Kyu; Park, SuA; Lee, Dong-Weon

    2016-06-02

    This paper describes the fabrication and characterization of a wireless pressure sensor for smart stent applications. The micromachined pressure sensor has an area of 3.13 × 3.16 mm² and is fabricated with a photosensitive SU-8 polymer. The wireless pressure sensor comprises a resonant circuit and can be used without the use of an internal power source. The capacitance variations caused by changes in the intravascular pressure shift the resonance frequency of the sensor. This change can be detected using an external antenna, thus enabling the measurement of the pressure changes inside a tube with a simple external circuit. The wireless pressure sensor is capable of measuring pressure from 0 mmHg to 230 mmHg, with a sensitivity of 0.043 MHz/mmHg. The biocompatibility of the pressure sensor was evaluated using cardiac cells isolated from neonatal rat ventricular myocytes. After inserting a metal stent integrated with the pressure sensor into a cardiovascular vessel of an animal, medical systems such as X-ray were employed to consistently monitor the condition of the blood vessel. No abnormality was found in the animal blood vessel for approximately one month. Furthermore, a biodegradable polymer (polycaprolactone) stent was fabricated with a 3D printer. The polymer stent exhibits better sensitivity degradation of the pressure sensor compared to the metal stent.

  7. A Wireless Pressure Sensor Integrated with a Biodegradable Polymer Stent for Biomedical Applications

    Directory of Open Access Journals (Sweden)

    Jongsung Park

    2016-06-01

    Full Text Available This paper describes the fabrication and characterization of a wireless pressure sensor for smart stent applications. The micromachined pressure sensor has an area of 3.13 × 3.16 mm2 and is fabricated with a photosensitive SU-8 polymer. The wireless pressure sensor comprises a resonant circuit and can be used without the use of an internal power source. The capacitance variations caused by changes in the intravascular pressure shift the resonance frequency of the sensor. This change can be detected using an external antenna, thus enabling the measurement of the pressure changes inside a tube with a simple external circuit. The wireless pressure sensor is capable of measuring pressure from 0 mmHg to 230 mmHg, with a sensitivity of 0.043 MHz/mmHg. The biocompatibility of the pressure sensor was evaluated using cardiac cells isolated from neonatal rat ventricular myocytes. After inserting a metal stent integrated with the pressure sensor into a cardiovascular vessel of an animal, medical systems such as X-ray were employed to consistently monitor the condition of the blood vessel. No abnormality was found in the animal blood vessel for approximately one month. Furthermore, a biodegradable polymer (polycaprolactone stent was fabricated with a 3D printer. The polymer stent exhibits better sensitivity degradation of the pressure sensor compared to the metal stent.

  8. High Resolution and Large Dynamic Range Resonant Pressure Sensor Based on Q-Factor Measurement

    Science.gov (United States)

    Gutierrez, Roman C. (Inventor); Stell, Christopher B. (Inventor); Tang, Tony K. (Inventor); Vorperian, Vatche (Inventor); Wilcox, Jaroslava (Inventor); Shcheglov, Kirill (Inventor); Kaiser, William J. (Inventor)

    2000-01-01

    A pressure sensor has a high degree of accuracy over a wide range of pressures. Using a pressure sensor relying upon resonant oscillations to determine pressure, a driving circuit drives such a pressure sensor at resonance and tracks resonant frequency and amplitude shifts with changes in pressure. Pressure changes affect the Q-factor of the resonating portion of the pressure sensor. Such Q-factor changes are detected by the driving/sensing circuit which in turn tracks the changes in resonant frequency to maintain the pressure sensor at resonance. Changes in the Q-factor are reflected in changes of amplitude of the resonating pressure sensor. In response, upon sensing the changes in the amplitude, the driving circuit changes the force or strength of the electrostatic driving signal to maintain the resonator at constant amplitude. The amplitude of the driving signals become a direct measure of the changes in pressure as the operating characteristics of the resonator give rise to a linear response curve for the amplitude of the driving signal. Pressure change resolution is on the order of 10(exp -6) torr over a range spanning from 7,600 torr to 10(exp -6) torr. No temperature compensation for the pressure sensor of the present invention is foreseen. Power requirements for the pressure sensor are generally minimal due to the low-loss mechanical design of the resonating pressure sensor and the simple control electronics.

  9. High Productivity DRIE solutions for 3D-SiP and MEMS Volume Manufacturing

    International Nuclear Information System (INIS)

    Puech, M; Thevenoud, J M; Launay, N; Arnal, N; Godinat, P; Andrieu, B; Gruffat, J M

    2006-01-01

    Emerging 3D-SiP technologies and high volume MEMS applications require high productivity mass production DRIE systems. The Alcatel DRIE product range has recently been optimised to reach the highest process and hardware production performances. A study based on sub-micron high aspect ratio structures encountered in the most stringent 3D-SiP has been carried out. The optimization of the Bosch process parameters has resulted in ultra high silicon etch rates, with unrivalled uniformity and repeatability leading to excellent process. In parallel, most recent hardware and proprietary design optimization including vacuum pumping lines, process chamber, wafer chucks, pressure control system, gas delivery are discussed. These improvements have been monitored in a mass production environment for a mobile phone application. Field data analysis shows a significant reduction of cost of ownership thanks to increased throughput and much lower running costs. These benefits are now available for all 3D-SiP and high volume MEMS applications. The typical etched patterns include tapered trenches for CMOS imagers, through silicon via holes for die stacking, well controlled profile angle for 3D high precision inertial sensors, and large exposed area features for inkjet printer heads and Silicon microphones

  10. Spatially digitized tactile pressure sensors with tunable sensitivity and sensing range.

    Science.gov (United States)

    Choi, Eunsuk; Sul, Onejae; Hwang, Soonhyung; Cho, Joonhyung; Chun, Hyunsuk; Kim, Hongjun; Lee, Seung-Beck

    2014-10-24

    When developing an electronic skin with touch sensation, an array of tactile pressure sensors with various ranges of pressure detection need to be integrated. This requires low noise, highly reliable sensors with tunable sensing characteristics. We demonstrate the operation of tactile pressure sensors that utilize the spatial distribution of contact electrodes to detect various ranges of tactile pressures. The device consists of a suspended elastomer diaphragm, with a carbon nanotube thin-film on the bottom, which makes contact with the electrodes on the substrate with applied pressure. The electrodes separated by set distances become connected in sequence with tactile pressure, enabling consecutive electrodes to produce a signal. Thus, the pressure is detected not by how much of a signal is produced but by which of the electrodes is registering an output. By modulating the diaphragm diameter, and suspension height, it was possible to tune the pressure sensitivity and sensing range. Also, adding a fingerprint ridge structure enabled the sensor to detect the periodicity of sub-millimeter grating patterns on a silicon wafer.

  11. Piezoresistive silicon pressure sensors in cryogenic environment

    Science.gov (United States)

    Kahng, Seun K.; Chapman, John J.

    1989-01-01

    This paper presents data on low-temperature measurements of silicon pressure sensors. It was found that both the piezoresistance coefficients and the charge-carrier mobility increase with decreasing temperature. For lightly doped semiconductor materials, the density of free charge carriers decreases with temperature and can freeze out eventually. However, the effect of carrier freeze-out can be minimized by increasing the impurity content to higher levels, at which the temperature dependency of piezoresistance coefficients is reduced. An impurity density of 1 x 10 to the 19th/cu cm was found to be optimal for cryogenic applications of pressure sensor dies.

  12. Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

    Science.gov (United States)

    Beheim, Glenn M.

    2003-01-01

    The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were

  13. Touch-mode capacitive pressure sensor with graphene-polymer heterostructure membrane

    Science.gov (United States)

    Berger, Christian; Phillips, Rory; Pasternak, Iwona; Sobieski, Jan; Strupinski, Wlodek; Vijayaraghavan, Aravind

    2018-01-01

    We describe the fabrication and characterisation of a touch-mode capacitive pressure sensor (TMCPS) with a robust design that comprises a graphene-polymer heterostructure film, laminated onto the silicon dioxide surface of a silicon wafer, incorporating a SU-8 spacer grid structure. The spacer grid structure allows the flexible graphene-polymer film to be partially suspended above the substrate, such that a pressure on the membrane results in a reproducible deflection, even after exposing the membrane to pressures over 10 times the operating range. Sensors show reproducible pressure transduction in water submersion at varying depths under static and dynamic loading. The measured capacitance change in response to pressure is in good agreement with an analytical model of clamped plates in touch mode. The device shows a pressure sensitivity of 27.1 +/- 0.5 fF Pa-1 over a pressure range of 0.5 kPa-8.5 kPa. In addition, we demonstrate the operation of this device as a force-touch sensor in air.

  14. Biomaterials for MEMS

    CERN Document Server

    Chiao, Mu

    2011-01-01

    This book serves as a guide for practicing engineers, researchers, and students interested in MEMS devices that use biomaterials and biomedical applications. It is also suitable for engineers and researchers interested in MEMS and its applications but who do not have the necessary background in biomaterials.Biomaterials for MEMS highlights important features and issues of biomaterials that have been used in MEMS and biomedical areas. Hence this book is an essential guide for MEMS engineers or researchers who are trained in engineering institutes that do not provide the background or knowledge

  15. High temperature piezoresistive {beta}-SiC-on-SOI pressure sensor for combustion engines

    Energy Technology Data Exchange (ETDEWEB)

    Berg, J. von; Ziermann, R.; Reichert, W.; Obermeier, E. [Tech. Univ. Berlin (Germany). Microsensor and Actuator Technol. Center; Eickhoff, M.; Kroetz, G. [Daimler Benz AG, Munich (Germany); Thoma, U.; Boltshauser, T.; Cavalloni, C. [Kistler Instrumente AG, Winterthur (Switzerland); Nendza, J.P. [TRW Deutschland GmbH, Barsinghausen (Germany)

    1998-08-01

    For measuring the cylinder pressure in combustion engines of automobiles a high temperature pressure sensor has been developed. The sensor is made of a membrane based piezoresistive {beta}-SiC-on-SOI (SiCOI) sensor chip and a specially designed housing. The SiCOI sensor was characterized under static pressures of up to 200 bar in the temperature range between room temperature and 300 C. The sensitivity of the sensor at room temperature is approximately 0.19 mV/bar and decreases to about 0.12 mV/bar at 300 C. For monitoring the dynamic cylinder pressure the sensor was placed into the combustion chamber of a gasoline engine. The measurements were performed at 1500 rpm under different loads, and for comparison a quartz pressure transducer from Kistler AG was used as a reference. The maximum pressure at partial load operation amounts to about 15 bar. The difference between the calibrated SiCOI sensor and the reference sensor is significantly less than 1 bar during the whole operation. (orig.) 8 refs.

  16. Flexible Piezoelectric-Induced Pressure Sensors for Static Measurements Based on Nanowires/Graphene Heterostructures.

    Science.gov (United States)

    Chen, Zefeng; Wang, Zhao; Li, Xinming; Lin, Yuxuan; Luo, Ningqi; Long, Mingzhu; Zhao, Ni; Xu, Jian-Bin

    2017-05-23

    The piezoelectric effect is widely applied in pressure sensors for the detection of dynamic signals. However, these piezoelectric-induced pressure sensors have challenges in measuring static signals that are based on the transient flow of electrons in an external load as driven by the piezopotential arisen from dynamic stress. Here, we present a pressure sensor with nanowires/graphene heterostructures for static measurements based on the synergistic mechanisms between strain-induced polarization charges in piezoelectric nanowires and the caused change of carrier scattering in graphene. Compared to the conventional piezoelectric nanowire or graphene pressure sensors, this sensor is capable of measuring static pressures with a sensitivity of up to 9.4 × 10 -3 kPa -1 and a fast response time down to 5-7 ms. This demonstration of pressure sensors shows great potential in the applications of electronic skin and wearable devices.

  17. Micro-Pressure Sensors for Future Mars Missions

    Science.gov (United States)

    Catling, David C.

    1996-01-01

    The joint research interchange effort was directed at the following principal areas: u further development of NASA-Ames' Mars Micro-meteorology mission concept as a viable NASA space mission especially with regard to the science and instrument specifications u interaction with the flight team from NASA's New Millennium 'Deep-Space 2' (DS-2) mission with regard to selection and design of micro-pressure sensors for Mars u further development of micro-pressure sensors suitable for Mars The research work undertaken in the course of the Joint Research Interchange should be placed in the context of an ongoing planetary exploration objective to characterize the climate system on Mars. In particular, a network of small probes globally-distributed on the surface of the planet has often been cited as the only way to address this particular science goal. A team from NASA Ames has proposed such a mission called the Micrometeorology mission, or 'Micro-met' for short. Surface pressure data are all that are required, in principle, to calculate the Martian atmospheric circulation, provided that simultaneous orbital measurements of the atmosphere are also obtained. Consequently, in the proposed Micro-met mission a large number of landers would measure barometric pressure at various locations around Mars, each equipped with a micro-pressure sensor. Much of the time on the JRI was therefore spent working with the engineers and scientists concerned with Micro-met to develop this particular mission concept into a more realistic proposition.

  18. Wireless contactless pressure measurement of an LC passive pressure sensor with a novel antenna for high-temperature applications

    International Nuclear Information System (INIS)

    Li Chen; Tan Qiu-Lin; Xue Chen-Yang; Zhang Wen-Dong; Li Yun-Zhi; Xiong Ji-Jun

    2015-01-01

    In this paper, a novel antenna is proposed for high-temperature testing, which can make the high-temperature pressure characteristics of a wireless passive ceramic pressure sensor demonstrated at up to a temperature of 600 °C. The design parameters of the antenna are similar to those of the sensor, which will increase the coupling strength between the sensor and testing antenna. The antenna is fabricated in thick film integrated technology, and the properties of the alumina ceramic and silver ensure the feasibility of the antenna in high-temperature environments. The sensor, coupled with the ceramic antenna, is investigated using a high-temperature pressure testing platform. The experimental measurement results show that the pressure signal in a harsh environment can be detected by the frequency diversity of the sensor. (paper)

  19. Validation of a new micro-manometer pressure sensor for cardiovascular measurements in mice.

    Science.gov (United States)

    Trevino, Rodolfo J; Jones, Douglas L; Escobedo, Daniel; Porterfield, John; Larson, Erik; Chisholm, Gary B; Barton, Amanda; Feldman, Marc D

    2010-01-01

    Abstract The Scisense (London, ON, Canada) micro-manometer pressure sensor is currently being used by investigators to evaluate cardiovascular physiology in mice, but has not been validated to date. The purpose of the current study is to compare the 1.2 F Scisense pressure sensor to the current gold standard produced by Millar Instruments (Houston, TX) (1.4 F). In vitro comparisons were preformed including temperature drift, frequency response analysis up to 250 Hz, and damping coefficient and natural frequency determined via a pop test. The authors also performed in vivo comparisons including pressure drift, dose-response studies to IV isoproterenol, maximum adrenergic stimulation with IV dobutamine, and simultaneous placement of both micro-manometer pressure sensors in the same intact murine hearts. The authors conclude that both sensors are equivalent, and that the Scisense pressure sensor represents an alternative to the current gold standard, the Millar micro-manometer pressure sensor for in vivo pressure measurements in the mouse.

  20. Simulation and fabrication of carbon nanotubes field emission pressure sensors

    International Nuclear Information System (INIS)

    Qian Kaiyou; Chen Ting; Yan Bingyong; Lin Yangkui; Xu Dong; Sun Zhuo; Cai Bingchu

    2006-01-01

    A novel field emission pressure sensor has been achieved utilizing carbon nanotubes (CNTs) as the electron source. The sensor consists of the anode sensing film fabricated by wet etching process and multi-wall carbon nanotubes (MWNTs) cathode in the micro-vacuum chamber. MWNTs on the silicon substrate were grown by thermal CVD. The prototype pressure sensor has a measured sensitivity of about 0.17-0.77 nA/Pa (101-550 KPa). The work shows the potential use of CNTs-based field-emitter in microsensors, such as accelerometers and tactile sensors

  1. Direct media exposure of MEMS multi-sensor systems using a potted-tube packaging concept

    DEFF Research Database (Denmark)

    Hyldgård, Anders; Birkelund, Karen; Janting, Jakob

    2008-01-01

    in the filling material is measured. The packaging concept is used to encapsulate a microfabricated multi-sensor (measuring temperature, water conductivity, pressure and light intensity). The direct exposure of the sensors results in high sensitivity and fast response time. The design of an elongated multi-sensor......A packaging concept for Data Storage Tags is presented. A potted-tube packaging concept, using a polystyrene tube and different epoxies as filling material that allows for direct sensor exposure is investigated. The curing temperature, water uptake and the diffusion coefficient for water...... is described and effectiveness of the packaging is demonstrated with the precise measurement of water conductivity using the packaged multi-sensor. The packaging concept is very promising for high accuracy measurements in harsh environments....

  2. Methods and Systems for Configuring Sensor Acquisition Based on Pressure Steps

    Science.gov (United States)

    DeDonato, Mathew (Inventor)

    2015-01-01

    Technologies are provided for underwater measurements. A system includes an underwater vessels including: a plurality of sensors disposed thereon for measuring underwater properties; and a programmable controller configured to selectively activate the plurality of sensors based at least in part on underwater pressure. A user may program at what pressure ranges certain sensors are activated to measure selected properties, and may also program the ascent/descent rate of the underwater vessel, which is correlated with the underwater pressure.

  3. Microfabricated electrochemical sensors for combustion applications

    Science.gov (United States)

    Vulcano Rossi, Vitor A.; Mullen, Max R.; Karker, Nicholas A.; Zhao, Zhouying; Kowarz, Marek W.; Dutta, Prabir K.; Carpenter, Michael A.

    2015-05-01

    A new design for the miniaturization of an existing oxygen sensor is proposed based on the application of silicon microfabrication technologies to a cm sized O2 sensor demonstrated by Argonne National Laboratory and The Ohio State University which seals a metal/metal oxide within the structure to provide an integrated oxygen reference. The structural and processing changes suggested will result in a novel MEMS-based device meeting the semiconductor industry standards for cost efficiency and mass production. The MEMS design requires thin film depositions to create a YSZ membrane, palladium oxide reference and platinum electrodes. Pt electrodes are studied under operational conditions ensuring film conductivity over prolonged usage. SEM imaging confirms void formation after extended tests, consistent with the literature. Furthermore, hydrophilic bonding of pairs of silicon die samples containing the YSZ membrane and palladium oxide is discussed in order to create hermetic sealed cavities for oxygen reference. The introduction of tensile Si3N4 films to the backside of the silicon die generates bowing of the chips, compromising bond quality. This effect is controlled through the application of pressure during the initial bonding stages. In addition, KOH etching of the bonded die samples is discussed, and a YSZ membrane that survives the etching step is characterized by Raman spectroscopy.

  4. Novel High Temperature Capacitive Pressure Sensor Utilizing SiC Integrated Circuit Twin Ring Oscillators

    Science.gov (United States)

    Scardelletti, M.; Neudeck, P.; Spry, D.; Meredith, R.; Jordan, J.; Prokop, N.; Krasowski, M.; Beheim, G.; Hunter, G.

    2017-01-01

    This paper describes initial development and testing of a novel high temperature capacitive pressure sensor system. The pressure sensor system consists of two 4H-SiC 11-stage ring oscillators and a SiCN capacitive pressure sensor. One oscillator has the capacitive pressure sensor fixed at one node in its feedback loop and varies as a function of pressure and temperature while the other provides a pressure-independent reference frequency which can be used to temperature compensate the output of the first oscillator. A two-day repeatability test was performed up to 500C on the oscillators and the oscillator fundamental frequency changed by only 1. The SiCN capacitive pressure sensor was characterized at room temperature from 0 to 300 psi. The sensor had an initial capacitance of 3.76 pF at 0 psi and 1.75 pF at 300 psi corresponding to a 54 change in capacitance. The integrated pressure sensor system was characterized from 0 to 300 psi in steps of 50 psi over a temperature range of 25 to 500C. The pressure sensor system sensitivity was 0.113 kHzpsi at 25C and 0.026 kHzpsi at 500C.

  5. MEMS climate sensor for crops in greenhouses

    DEFF Research Database (Denmark)

    Birkelund, Karen; Jensen, Kim Degn; Højlund-Nielsen, Emil

    2010-01-01

    We have developed and fabricated a multi-sensor chip for greenhouse applications and demonstrated the functionality under controlled conditions. The sensor consists of a humidity sensor, temperature sensor and three photodiodes sensitive to blue, red and white light, respectively. The humidity...... sensor responds linearly with humidity with a full scale change of 5.6 pF. The best performing design measures a relative change of 48%. The temperature sensor responds linearly with temperature with a temperature coefficient of resistance of 3.95 x 10(-3) K-1 and a sensitivity of 26.5 Omega degrees C-1...... and humidity sensors have further been tested on plants in a greenhouse, demonstrating that individual plant behavior can be monitored....

  6. Continuous Process for the Etching, Rinsing and Drying of MEMS Using Supercritical Carbon Dioxide

    Energy Technology Data Exchange (ETDEWEB)

    Min, Seon Ki; Han, Gap Su; You, Seong-sik [Korea University of Technology and Education, Cheonan (Korea, Republic of)

    2015-10-15

    The previous etching, rinsing and drying processes of wafers for MEMS (microelectromechanical system) using SC-CO{sub 2} (supercritical-CO{sub 2}) consists of two steps. Firstly, MEMS-wafers are etched by organic solvent in a separate etching equipment from the high pressure dryer and then moved to the high pressure dryer to rinse and dry them using SC-CO{sub 2}. We found that the previous two step process could be applied to etch and dry wafers for MEMS but could not confirm the reproducibility through several experiments. We thought the cause of that was the stiction of structures occurring due to vaporization of the etching solvent during moving MEMS wafer to high pressure dryer after etching it outside. In order to improve the structure stiction problem, we designed a continuous process for etching, rinsing and drying MEMS-wafers using SC-CO{sub 2} without moving them. And we also wanted to know relations of states of carbon dioxide (gas, liquid, supercritical fluid) to the structure stiction problem. In the case of using gas carbon dioxide (3 MPa, 25 .deg. C) as an etching solvent, we could obtain well-treated MEMS-wafers without stiction and confirm the reproducibility of experimental results. The quantity of rinsing solvent used could be also reduced compared with the previous technology. In the case of using liquid carbon dioxide (3 MPa, 5 .deg. C), we could not obtain well-treated MEMS-wafers without stiction due to the phase separation of between liquid carbon dioxide and etching co-solvent(acetone). In the case of using SC-CO{sub 2} (7.5 Mpa, 40 .deg. C), we had as good results as those of the case using gas-CO{sub 2}. Besides the processing time was shortened compared with that of the case of using gas-CO{sub 2}.

  7. A Comparative Study of Sound Speed in Air at Room Temperature between a Pressure Sensor and a Sound Sensor

    Science.gov (United States)

    Amrani, D.

    2013-01-01

    This paper deals with the comparison of sound speed measurements in air using two types of sensor that are widely employed in physics and engineering education, namely a pressure sensor and a sound sensor. A computer-based laboratory with pressure and sound sensors was used to carry out measurements of air through a 60 ml syringe. The fast Fourier…

  8. Multipoint Pressure and Temperature Sensing Fiber Optic Cable for Monitoring CO2 Sequestration

    Energy Technology Data Exchange (ETDEWEB)

    Challener, William [General Electric Company, Niskayuna, NY (United States)

    2015-02-10

    This report describes the work completed on contract DE-FE0010116. The goal of this two year project was to develop and demonstrate in the laboratory a highly accurate multi-point pressure measurement fiber optic cable based on MEMS pressure sensors suitable for downhole deployment in a CO2 sequestration well. The sensor interrogator was also to be demonstrated in a remote monitoring system and environmental testing was to be completed to indicate its downhole survivability over a lengthy period of time (e.g., 20 years). An interrogator system based on a pulsed laser excitation was shown to be capable of multiple (potentially 100+) simultaneous sensor measurements. Two sensors packages were completed and spliced in a cable onto the same fiber and measured. One sensor package was subsequently measured at high temperatures and pressures in supercritical CO2, while the other package was measured prior and after being subjected to high torque stresses to mimic downhole deployment. The environmental and stress tests indicated areas in which the package design should be further improved.

  9. Parylene-on-oil packaging for long-term implantable pressure sensors.

    Science.gov (United States)

    Shapero, Aubrey M; Liu, Yang; Tai, Yu-Chong

    2016-08-01

    This paper reports and analyzes the feasibility study of a parylene-on-oil encapsulation packaging method of pressure sensors targeted for long-term implantation. Commercial barometric digital-output pressure sensors are enclosed in silicone oil and then encapsulated in situ with parylene-C or -D (PA-C, PA-D) chemical vapor deposition. Experimentally, sensors encapsulated with 30,000 cSt silicone oil and 27 μm PA-D show good performance for 6 weeks in 77 °C saline with >99 % of original sensitivity, corresponding to an extrapolated lifetime of around 21 months in 37 °C saline. This work shows that, with proper designs, such a packaging method can preserve the original pressure sensor sensitivity without offset, validated throughout accelerated lifetime tests. In experiments, wires on the prototypes are used for external electronics but it is found that they contributed to early failures, which would be absent in real wireless versions, indicating a potential for even longer lifetimes. Finally, a verified model is presented to predict the pressure sensor sensitivity of parylene-on-oil packaging with and without the presence of a bubble in the oil.

  10. Wave effects on a pressure sensor

    Digital Repository Service at National Institute of Oceanography (India)

    Joseph, A.; DeSa, E; Desa, E; McKeown, J.; Peshwe, V.B.

    Wave flume experiments indicated that for waves propagating on quiescent waters the sensor's performance improved (i.e. the difference Delta P between the average hydrostatic and measured pressures was small and positive) when the inlet...

  11. Embedded Data Acquisition Tools for Rotorcraft Diagnostic Sensors

    Science.gov (United States)

    Wagoner, Robert

    2014-01-01

    Rotorcraft drive trains must withstand enormous pressure while operating continuously in extreme temperature and vibration environments. Captive components, such as planetary and spiral bevel gears, see enormous strain but are not accessible to fixed instrumentation, such as a piezoelectric transducer. Thus, it is difficult to directly monitor components that are most susceptible to damage. This innovation is a self-contained data processing unit within a specialized fixture that installs directly inside the rotating pinion gear in the gearbox. From this location, it detects and transmits high-resolution prognostic data to a fixed transceiver. The sensor is based on microelectromechanical systems (MEMS) technology and uses innovative circuit designs to capture high-bandwidth data and transmit it wirelessly from inside an operational helicopter transmission. With Ridgetop's advanced MEMS-based sensor, researchers have, for the first time, been able to extract high-resolution acoustic signatures wirelessly from sensors within the transmission that would otherwise be muffled by background gear noises. Ridgetop's innovative instrument will help researchers perform dynamic analysis of gear interaction and develop improved designs for gear components. In addition, data from this instrument can be used to validate new algorithms that detect and predict faults based on external acoustic signatures, for prognostic purposes. The result of this work will be an improvement in safety, performance, and cost for future generations of rotating components.

  12. UAV-borne lidar with MEMS mirror-based scanning capability

    Science.gov (United States)

    Kasturi, Abhishek; Milanovic, Veljko; Atwood, Bryan H.; Yang, James

    2016-05-01

    Firstly, we demonstrated a wirelessly controlled MEMS scan module with imaging and laser tracking capability which can be mounted and flown on a small UAV quadcopter. The MEMS scan module was reduced down to a small volume of smartphone via Bluetooth while flying on a drone, and could project vector content, text, and perform laser based tracking. Also, a "point-and-range" LiDAR module was developed for UAV applications based on low SWaP (Size, Weight and Power) gimbal-less MEMS mirror beam-steering technology and off-the-shelf OEM LRF modules. For demonstration purposes of an integrated laser range finder module, we used a simple off-the-shelf OEM laser range finder (LRF) with a 100m range, +/-1.5mm accuracy, and 4Hz ranging capability. The LRFs receiver optics were modified to accept 20° of angle, matching the transmitter's FoR. A relatively large (5.0mm) diameter MEMS mirror with +/-10° optical scanning angle was utilized in the demonstration to maintain the small beam divergence of the module. The complete LiDAR prototype can fit into a small volume of battery. The MEMS mirror based LiDAR system allows for ondemand ranging of points or areas within the FoR without altering the UAV's position. Increasing the LRF ranging frequency and stabilizing the pointing of the laser beam by utilizing the onboard inertial sensors and the camera are additional goals of the next design.

  13. Combined Differential and Static Pressure Sensor based on a Double-Bridged Structure

    DEFF Research Database (Denmark)

    Pedersen, Casper; Jespersen, S.T.; Krog, J.P.

    2005-01-01

    A combined differential and static silicon microelectromechanical system pressure sensor based on a double piezoresistive Wheatstone bridge structure is presented. The developed sensor has a conventional (inner) bridge on a micromachined diaphragm and a secondary (outer) bridge on the chip...... substrate. A novel approach is demonstrated with a combined measurement of outputs from the two bridges, which results in a combined deduction of both differential and static media pressure. Also following this new approach, a significant improvement in differential pressure sensor accuracy is achieved....... Output from the two bridges depends linearly on both differential and absolute (relative to atmospheric pressure) media pressure. Furthermore, the sensor stress distributions involved are studied by three-dimensional finite-element (FE) stress analysis. Furthermore, the FE analysis evaluates current...

  14. A Flexible Capacitive Sensor with Encapsulated Liquids as Dielectrics

    Directory of Open Access Journals (Sweden)

    Yasunari Hotta

    2012-03-01

    Full Text Available Flexible and high-sensitive capacitive sensors are demanded to detect pressure distribution and/or tactile information on a curved surface, hence, wide varieties of polymer-based flexible MEMS sensors have been developed. High-sensitivity may be achieved by increasing the capacitance of the sensor using solid dielectric material while it deteriorates the flexibility. Using air as the dielectric, to maintain the flexibility, sacrifices the sensor sensitivity. In this paper, we demonstrate flexible and highly sensitive capacitive sensor arrays that encapsulate highly dielectric liquids as the dielectric. Deionized water and glycerin, which have relative dielectric constants of approximately 80 and 47, respectively, could increase the capacitance of the sensor when used as the dielectric while maintaining flexibility of the sensor with electrodes patterned on flexible polymer substrates. A reservoir of liquids between the electrodes was designed to have a leak path, which allows the sensor to deform despite of the incompressibility of the encapsulated liquids. The proposed sensor was microfabricated and demonstrated successfully to have a five times greater sensitivity than sensors that use air as the dielectric.

  15. Micromachined capacitive pressure sensor with signal conditioning electronics

    DEFF Research Database (Denmark)

    Fragiacomo, Giulio

    signal) of the device. Fusion bonding of two wafers has been used in order to obtain the cavities, this is also the only non-standard cleanroom process involved in the fabrication of the transducers. The device developed can measure absolute pressures from 0 to 10 bar with sensitivity up to 80 p...... characterized and presented at Grundfos Direct Sensors A/S and constitute the preliminary work for a new product which is intended target the low power or wireless pressure sensor for harsh environment market....

  16. A Micromachined Piezoresistive Pressure Sensor with a Shield Layer

    Science.gov (United States)

    Cao, Gang; Wang, Xiaoping; Xu, Yong; Liu, Sheng

    2016-01-01

    This paper presents a piezoresistive pressure sensor with a shield layer for improved stability. Compared with the conventional piezoresistive pressure sensors, the new one reported in this paper has an n-type shield layer that covers p-type piezoresistors. This shield layer aims to minimize the impact of electrical field and reduce the temperature sensitivity of piezoresistors. The proposed sensors have been successfully fabricated by bulk-micromachining techniques. A sensitivity of 0.022 mV/V/kPa and a maximum non-linearity of 0.085% FS are obtained in a pressure range of 1 MPa. After numerical simulation, the role of the shield layer has been experimentally investigated. It is demonstrated that the shield layer is able to reduce the drift caused by electrical field and ambient temperature variation. PMID:27529254

  17. An Optical Fibre Depth (Pressure) Sensor for Remote Operated Vehicles in Underwater Applications

    Science.gov (United States)

    Duraibabu, Dinesh Babu; Poeggel, Sven; Omerdic, Edin; Capocci, Romano; Lewis, Elfed; Newe, Thomas; Leen, Gabriel; Toal, Daniel; Dooly, Gerard

    2017-01-01

    A miniature sensor for accurate measurement of pressure (depth) with temperature compensation in the ocean environment is described. The sensor is based on an optical fibre Extrinsic Fabry-Perot interferometer (EFPI) combined with a Fibre Bragg Grating (FBG). The EFPI provides pressure measurements while the Fibre Bragg Grating (FBG) provides temperature measurements. The sensor is mechanically robust, corrosion-resistant and suitable for use in underwater applications. The combined pressure and temperature sensor system was mounted on-board a mini remotely operated underwater vehicle (ROV) in order to monitor the pressure changes at various depths. The reflected optical spectrum from the sensor was monitored online and a pressure or temperature change caused a corresponding observable shift in the received optical spectrum. The sensor exhibited excellent stability when measured over a 2 h period underwater and its performance is compared with a commercially available reference sensor also mounted on the ROV. The measurements illustrates that the EFPI/FBG sensor is more accurate for depth measurements (depth of ~0.020 m). PMID:28218727

  18. A Pedestrian Dead Reckoning System Integrating Low-Cost MEMS Inertial Sensors and GPS Receiver

    Directory of Open Access Journals (Sweden)

    Jin-feng Li

    2014-04-01

    Full Text Available The body-mounted inertial systems for pedestrian navigation do not require any preinstalled facilities and can run autonomously. The advantages over other technologies make it especially attractive for the applications such as first responders, military and consumer markets. The hardware platform integrating the low-cost, low-power and small-size MEMS (micro-electro-mechanical systems inertial sensors and GPS (global positioning system receiver is proposed. When the satellite signals are available, the location of the pedestrian is directly obtained from the GPS receiver. The inertial sensors are the complement of the GPS receiver in places where the GPS signals are not available, such as indoors, urban canyons and places under dense foliages. The height tracking is achieved by the barometer. The proposed PDR (pedestrian dead reckoning algorithm is real-timely implemented in the platform. The simple but effective step detection and step length estimation method are realized to reduce the computation and memory requirements on the microprocessor. A complementary filter is proposed to fuse the data from the accelerometer, gyroscope and digital compass for decreasing the heading error, which is the main error source in positioning. The reliability and accuracy of the proposed system is verified by field pedestrian walking tests in outdoors and indoors. The positioning error is less than 4% of the total traveled distance. The results indicate that the pedestrian dead reckoning system is able to provide satisfactory tracking performance.

  19. Review on pressure sensors for structural health monitoring

    Science.gov (United States)

    Sikarwar, Samiksha; Satyendra; Singh, Shakti; Yadav, Bal Chandra

    2017-12-01

    This paper reports the state of art in a variety of pressure and the detailed study of various matrix based pressure sensors. The performances of the bridges, buildings, etc. are threatened by earthquakes, material degradations, and other environmental effects. Structural health monitoring (SHM) is crucial to protect the people and also for assets planning. This study is a contribution in developing the knowledge about self-sensing smart materials and structures for the construction industry. It deals with the study of self-sensing as well as mechanical and electrical properties of different matrices based on pressure sensors. The relationships among the compression, tensile strain, and crack length with electrical resistance change are also reviewed.

  20. Feasibility of Frequency-Modulated Wireless Transmission for a Multi-Purpose MEMS-Based Accelerometer

    Directory of Open Access Journals (Sweden)

    Alessandro Sabato

    2014-09-01

    Full Text Available Recent advances in the Micro Electro-Mechanical System (MEMS technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM of civil engineering structures. To date, sensors’ low sensitivity and accuracy—especially at very low frequencies—have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor’s analog signals are converted to digital signals before radio-frequency (RF wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F instead of the conventional Analog to Digital Conversion (ADC. In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

  1. U.S. Army Corrosion Office's storage and quality requirements for military MEMS program

    Science.gov (United States)

    Zunino, J. L., III; Skelton, D. R.

    2007-04-01

    As the Army transforms into a more lethal, lighter and agile force, the technologies that support these systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army and DOD will rely on heavily to accomplish these objectives. Conditions for utilization of MEMS by the military are unique. Operational and storage environments for the military are significantly different than those found in the commercial sector. Issues unique to the military include; high G-forces during gun launch, extreme temperature and humidity ranges, extended periods of inactivity (20 years plus) and interaction with explosives and propellants. The military operational environments in which MEMS will be stored or required to function are extreme and far surpass any commercial operating conditions. Security and encryption are a must for all MEMS communication, tracking, or data reporting devices employed by the military. Current and future military applications of MEMS devices include safety and arming devices, fuzing devices, various guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless Radio Frequency Identifications (RFIDs) and network systems, GPS's, radar systems, mobile base systems and information technology. MEMS embedded into these weapons systems will provide the military with new levels of speed, awareness, lethality, and information dissemination. The system capabilities enhanced by MEMS will translate directly into tactical and strategic military advantages.

  2. Calibration Of Partial-Pressure-Of-Oxygen Sensors

    Science.gov (United States)

    Yount, David W.; Heronimus, Kevin

    1995-01-01

    Report and analysis of, and discussion of improvements in, procedure for calibrating partial-pressure-of-oxygen sensors to satisfy Spacelab calibration requirements released. Sensors exhibit fast drift, which results in short calibration period not suitable for Spacelab. By assessing complete process of determining total drift range available, calibration procedure modified to eliminate errors and still satisfy requirements without compromising integrity of system.

  3. Correlation between intrasac pressure measurements of a pressure sensor and an angiographic catheter during endovascular repair of abdominal aortic aneurysm

    Directory of Open Access Journals (Sweden)

    Pierre Galvagni Silveira

    2008-01-01

    Full Text Available PURPOSE: To establish a correlation between intrasac pressure measurements of a pressure sensor and an angiographic catheter placed in the same aneurysm sac before and after its exclusion by an endoprosthesis. METHODS: Patients who underwent endovascular abdominal aortic aneurysm repair and received an EndoSureTM wireless pressure sensor implant between March 19 and December 11, 2004 were enrolled in the study. Simultaneous readings of systolic, diastolic, mean, and pulse pressure within the aneurysm sac were obtained from the catheter and the sensor, both before and after sac exclusion by the endoprosthesis (Readings 1 and 2, respectively. Intrasac pressure measurements were compared using Pearson's correlation and Student's t test. Statistical significance was set at p0.05, mean (p>0.05, and pulse (p0.05 by the sensor. CONCLUSION: The excellent agreement between intrasac pressure readings recorded by the catheter and the sensor justifies use of the latter for detection of post-exclusion abdominal aortic aneurysm pressurization.

  4. Fiber Bragg grating sensors for real-time monitoring of evacuation process

    Science.gov (United States)

    Guru Prasad, A. S.; Hegde, Gopalkrishna M.; Asokan, S.

    2010-03-01

    Fiber bragg grating (FBG) sensors have been widely used for number of sensing applications like temperature, pressure, acousto-ultrasonic, static and dynamic strain, refractive index change measurements and so on. Present work demonstrates the use of FBG sensors in in-situ measurement of vacuum process with simultaneous leak detection capability. Experiments were conducted in a bell jar vacuum chamber facilitated with conventional Pirani gauge for vacuum measurement. Three different experiments have been conducted to validate the performance of FBG sensor in monitoring vacuum creating process and air bleeding. The preliminary results of FBG sensors in vacuum monitoring have been compared with that of commercial Pirani gauge sensor. This novel technique offers a simple alternative to conventional method for real time monitoring of evacuation process. Proposed FBG based vacuum sensor has potential applications in vacuum systems involving hazardous environment such as chemical and gas plants, automobile industries, aeronautical establishments and leak monitoring in process industries, where the electrical or MEMS based sensors are prone to explosion and corrosion.

  5. A comparative study of misalignment detection using a novel Wireless Sensor with conventional Wired Sensors

    International Nuclear Information System (INIS)

    Arebi, L; Gu, F; Ball, A

    2012-01-01

    The advancement in low cost and low power MEMS sensors makes it possible to develop a cost-effective wireless accelerometer for condition monitoring. Especially, the MEMS accelerometer can be mounted directly on a rotating shaft, which has the potential to capture the dynamics of the shaft more accurately and hence to achieve high monitoring performance. In this paper a systematic comparison of shaft misalignment detection is conducted, based on a bearing test rig, between the wireless sensor measurement scheme and other three common sensors: a laser vibrometer, an accelerometer and a shaft encoder. These four sensors are used to measure simultaneously the dynamic responses: Instantaneous Angular Speed (IAS) from the encoder, bearing house acceleration from the accelerometer, shaft displacements from the laser vibrometer and angular acceleration from the wireless sensor. These responses are then compared in both the time and frequency domains in detecting and diagnosing different levels of shaft misalignment. Results show the effectiveness of wireless accelerometer in detecting the faults.

  6. A scalable pressure sensor based on an electrothermally and electrostatically operated resonator

    KAUST Repository

    Hajjaj, Amal Z.

    2017-11-29

    We present a pressure sensor based on the convective cooling of the air surrounding an electrothermally heated resonant bridge. Unlike conventional pressure sensors that rely on diaphragm deformation in response to pressure, the sensor does not require diaphragms of the large surface area, and hence is scalable and can be realized even at the nanoscale. The concept is demonstrated using both straight and arch microbeam resonators driven and sensed electrostatically. The change in the surrounding pressure is shown to be accurately tracked by monitoring the change in the resonance frequency of the structure. The sensitivity of the sensor, which is controllable by the applied electrothermal load, is shown near 57 811 ppm/mbar for a pressure range from 1 to 10 Torr. We show that a straight beam operated near the buckling threshold leads to the maximum sensitivity of the device. The experimental data and simulation results, based on a multi-physics finite element model, demonstrate the feasibility and simplicity of the pressure sensor. Published by AIP Publishing.

  7. Design and evaluation of a pressure sensor for high temperature nuclear application

    International Nuclear Information System (INIS)

    Yancey, M.E.

    1981-11-01

    The goal of this technical development task was the development of a small eddy-current pressure sensor for use within a high temperature nuclear environment. The sensor is designed for use at pressures and temperatures of up to 17.23 MPa and 650 0 F. The design of the sensor incorporated features to minimize possible errors due to temperature transients present in nuclear applications. This report describes a prototype pressure sensor that was designed, the associated 100 kHz signal conditioning electronics, and the evaluation tests which were conducted

  8. Particle-based optical pressure sensors for 3D pressure mapping.

    Science.gov (United States)

    Banerjee, Niladri; Xie, Yan; Chalaseni, Sandeep; Mastrangelo, Carlos H

    2015-10-01

    This paper presents particle-based optical pressure sensors for in-flow pressure sensing, especially for microfluidic environments. Three generations of pressure sensitive particles have been developed- flat planar particles, particles with integrated retroreflectors and spherical microballoon particles. The first two versions suffer from pressure measurement dependence on particles orientation in 3D space and angle of interrogation. The third generation of microspherical particles with spherical symmetry solves these problems making particle-based manometry in microfluidic environment a viable and efficient methodology. Static and dynamic pressure measurements have been performed in liquid medium for long periods of time in a pressure range of atmospheric to 40 psi. Spherical particles with radius of 12 μm and balloon-wall thickness of 0.5 μm are effective for more than 5 h in this pressure range with an error of less than 5%.

  9. Low-power-consumption and high-sensitivity NO2 micro gas sensors based on a co-planar micro-heater fabricated by using a CMOS-MEMS process

    International Nuclear Information System (INIS)

    Moon, S. E.; Lee, J. W.; Park, S. J.; Park, J.; Park, K. H.; Kim, J.

    2010-01-01

    Small-scale, low-power-consumption, and high-sensitivity NO 2 gas sensors based on ZnO nanorods are reported in this work. To activate the chemical absorption and desorption for NO 2 gas, we embedded co-planar micro-heater in a micro gas sensor, that was made by using a Complementary Metal-oxide-semiconductor compatible Microelectromechanical Systems(CMOS-MEMS) process. To acquire simple fabrication and low fabrication cost, we located the micro-heater and the sensing electrode in the same plane. High-quality single-crystalline ZnO nanorods were selectively grown by using photolithography and a hydrothermal method. Their structural properties were confirmed by using X-ray diffractometry (XRD), energy dispersive X-ray spectroscopy microanalysis (EDAX), Scanning Electron Microscopy (SEM), and Transmission Electron Microscopy (TEM). The temperature-dependent current-voltage characteristics were measured to optimize the operating temperature of the fabricated devices as a chemical gas sensor. To test the possibility for use as chemical sensor, we measured the NO 2 gas response.

  10. A Widely-Accessible Distributed MEMS Processing Environment. The MEMS Exchange Program

    Science.gov (United States)

    2012-10-29

    all of these patterns in advance, we made a new cost model, called the Python Code cost model, which utilizes the power of a high level programming ...document entitled “The Beginners Guide to MEMS Processing” on the MEMSNet and MEMS Exchange The MEMS Exchange Program Final Technical Report October 29...from the Government is absolutely necessary. As said The MEMS Exchange Program Final Technical Report October 29, 2012 Page 57 of 58 before

  11. Highly Sensitive and Patchable Pressure Sensors Mimicking Ion-Channel-Engaged Sensory Organs.

    Science.gov (United States)

    Chun, Kyoung-Yong; Son, Young Jun; Han, Chang-Soo

    2016-04-26

    Biological ion channels have led to much inspiration because of their unique and exquisite operational functions in living cells. Specifically, their extreme and dynamic sensing abilities can be realized by the combination of receptors and nanopores coupled together to construct an ion channel system. In the current study, we demonstrated that artificial ion channel pressure sensors inspired by nature for detecting pressure are highly sensitive and patchable. Our ion channel pressure sensors basically consisted of receptors and nanopore membranes, enabling dynamic current responses to external forces for multiple applications. The ion channel pressure sensors had a sensitivity of ∼5.6 kPa(-1) and a response time of ∼12 ms at a frequency of 1 Hz. The power consumption was recorded as less than a few μW. Moreover, a reliability test showed stability over 10 000 loading-unloading cycles. Additionally, linear regression was performed in terms of temperature, which showed no significant variations, and there were no significant current variations with humidity. The patchable ion channel pressure sensors were then used to detect blood pressure/pulse in humans, and different signals were clearly observed for each person. Additionally, modified ion channel pressure sensors detected complex motions including pressing and folding in a high-pressure range (10-20 kPa).

  12. High Temperature Capacitive Pressure Sensor Employing a SiC Based Ring Oscillator

    Science.gov (United States)

    Meredith, Roger D.; Neudeck, Philip G.; Ponchak, George E.; Beheim, Glenn M.; Scardelletti, Maximilian; Jordan, Jennifer L.; Chen, Liang-Yu; Spry, David J.; Krawowski, Michael J.; Hunter, Gary W.

    2011-01-01

    In an effort to develop harsh environment electronic and sensor technologies for aircraft engine safety and monitoring, we have used capacitive-based pressure sensors to shift the frequency of a SiC-electronics-based oscillator to produce a pressure-indicating signal that can be readily transmitted, e.g. wirelessly, to a receiver located in a more benign environment. Our efforts target 500 C, a temperature well above normal operating conditions of commercial circuits but within areas of interest in aerospace engines, deep mining applications and for future missions to the Venus atmosphere. This paper reports for the first time a ring oscillator circuit integrated with a capacitive pressure sensor, both operating at 500 C. This demonstration represents a significant step towards a wireless pressure sensor that can operate at 500 C and confirms the viability of 500 C electronic sensor systems.

  13. Flexible Pressure Sensor with Ag Wrinkled Electrodes Based on PDMS Substrate

    Directory of Open Access Journals (Sweden)

    Jianli Cui

    2016-12-01

    Full Text Available Flexible pressure sensors are essential components of electronic skins for future attractive applications ranging from human healthcare monitoring to biomedical diagnostics, robotic skins, and prosthetic limbs. Here we report a new kind of flexible pressure sensor. The sensors are capacitive, and composed of two Ag wrinkled electrodes separated by a carbon nanotubes (CNTs/polydimethylsiloxane (PDMS composite deformable dielectric layer. Ag wrinkled electrodes were formed by vacuum deposition on top of pre-strained and relaxed PDMS substrates which were treated using an O2 plasma, a surface functionalization process, and a magnetron sputtering process. Ultimately, the developed sensor exhibits a maximum sensitivity of 19.80% kPa−1 to capacitance, great durability over 500 cycles, and rapid mechanical responses (<200 ms. We also demonstrate that our sensor can be used to effectively detect the location and distribution of finger pressure.

  14. Pressure sensor for high-temperature liquids

    International Nuclear Information System (INIS)

    Forster, G.A.

    1978-01-01

    A pressure sensor for use in measuring pressures in liquid at high temperatures, especially such as liquid sodium or liquid potassium, comprises a soft diaphragm in contact with the liquid. The soft diaphragm is coupled mechanically to a stiff diaphragm. Pressure is measured by measuring the displacement of both diaphragms, typically by measuring the capacitance between the stiff diaphragm and a fixed plate when the stiff diaphragm is deflected in response to the measured pressure through mechanical coupling from the soft diaphragm. Absolute calibration is achieved by admitting gas under pressure to the region between diaphragms and to the region between the stiff diaphragm and the fixed plate, breaking the coupling between the soft and stiff diaphragms. The apparatus can be calibrated rapidly and absolutely

  15. Total dose radiation effects of pressure sensors fabricated on uni-bond-SOI materials

    International Nuclear Information System (INIS)

    Zhu Shiyang; Huang Yiping; Wang Jin; Li Anzhen; Shen Shaoqun; Bao Minhang

    2001-01-01

    Piezoresistive pressure sensors with a twin-island structure were successfully fabricated using high quality Uni-bond-SOI (On Insulator) materials. Since the piezoresistors were structured by the single crystalline silicon overlayer of the SOI wafer and were totally isolated by the buried SiO 2 , the sensors are radiation-hard. The sensitivity and the linearity of the pressure sensors keep their original values after being irradiated by 60 Co γ-rays up to 2.3 x 10 4 Gy(H 2 O). However, the offset voltage of the sensor has a slight drift, increasing with the radiation dose. The absolute value of the offset voltage deviation depends on the pressure sensor itself. For comparison, corresponding polysilicon pressure sensors were fabricated using the similar process and irradiated at the same condition

  16. MEMS acceleration sensor with remote optical readout for continuous power generator monitoring

    Directory of Open Access Journals (Sweden)

    Tormen Maurizio

    2015-01-01

    Full Text Available Miniaturized accelerometers with remote optical readout are required devices for the continuous monitoring of vibrations inside power generators. In turbo and hydro generators, end-winding vibrations are present during operation causing in the long term undesirable out-of-service repairs. Continuous monitoring of these vibrations is therefore mandatory. The high electromagnetic fields in the generators impose the use of devices immune to electromagnetic interferences. In this paper a MEMS based accelerometer with remote optical readout is presented. Advantages of the proposed device are the use of a differential optical signal to reject the common mode signal and noise, the reduced number of steps for the MEMS chip fabrication and for the system assembly, and the reduced package volume.

  17. In-situ calibration of RTDs and pressure sensors in nuclear power plants

    International Nuclear Information System (INIS)

    Hashemian, H.M.

    1994-01-01

    New techniques have been developed and validated for in-situ calibration of pressure transmitters as installed in nuclear power plants. These new techniques originate from a desire within the nuclear industry to monitor the calibration of pressure sensors during normal power operation by monitoring the DC output of the sensors for any significant draft and other anomalies. Currently, the calibration of pressure sensors is performed once every fuel cycle (18-24 months). The work involves significant manpower, radiation exposure to plant personnel, and potential damage to the plant equipment. In-situ calibration offers the potential to identify the sensors that need to be replaced or require calibration during normal plant operation, and reduce the calibration effort during outages to those sensors that need to be calibrated, as opposed to calibrating all the sensors

  18. Biotelemetric Wireless Intracranial Pressure Monitoring: An In Vitro Study

    Directory of Open Access Journals (Sweden)

    Mohammad H. Behfar

    2015-01-01

    Full Text Available Assessment of intracranial pressure (ICP is of great importance in management of traumatic brain injuries (TBIs. The existing clinically established ICP measurement methods require catheter insertion in the cranial cavity. This increases the risk of infection and hemorrhage. Thus, noninvasive but accurate techniques are attractive. In this paper, we present two wireless, batteryless, and minimally invasive implantable sensors for continuous ICP monitoring. The implants comprise ultrathin (50 μm flexible spiral coils connected in parallel to a capacitive microelectromechanical systems (MEMS pressure sensor. The implantable sensors are inductively coupled to an external on-body reader antenna. The ICP variation can be detected wirelessly through measuring the reader antenna’s input impedance. This paper also proposes novel implant placement to improve the efficiency of the inductive link. In this study, the performance of the proposed telemetry system was evaluated in a hydrostatic pressure measurement setup. The impact of the human tissues on the inductive link was simulated using a 5 mm layer of pig skin. The results from the in vitro measurement proved the capability of our developed sensors to detect ICP variations ranging from 0 to 70 mmHg at 2.5 mmHg intervals.

  19. The analytical calibration model of temperature effects on a silicon piezoresistive pressure sensor

    Directory of Open Access Journals (Sweden)

    Meng Nie

    2017-03-01

    Full Text Available Presently, piezoresistive pressure sensors are highly demanded for using in various microelectronic devices. The electrical behavior of these pressure sensor is mainly dependent on the temperature gradient. In this paper, various factors,which includes effect of temperature, doping concentration on the pressure sensitive resistance, package stress, and temperature on the Young’s modulus etc., are responsible for the temperature drift of the pressure sensor are analyzed. Based on the above analysis, an analytical calibration model of the output voltage of the sensor is proposed and the experimental data is validated through a suitable model.

  20. MEMS climate sensor for crops in greenhouses

    International Nuclear Information System (INIS)

    Birkelund, K; Jensen, Kim Degn; Højlund-Nielsen, Emil; Nagstrup, Johan; Lei, Anders; Petersen, Søren Dahl; Thomsen, Erik V; Andreassen, Andrea U

    2010-01-01

    We have developed and fabricated a multi-sensor chip for greenhouse applications and demonstrated the functionality under controlled conditions. The sensor consists of a humidity sensor, temperature sensor and three photodiodes sensitive to blue, red and white light, respectively. The humidity sensor responds linearly with humidity with a full scale change of 5.6 pF. The best performing design measures a relative change of 48%. The temperature sensor responds linearly with temperature with a temperature coefficient of resistance of 3.95 × 10 −3 K −1 and a sensitivity of 26.5 Ω °C −1 . The three photodiodes have been characterized and show an almost ideal diode behavior with an ideality factor of 1.27 and a series resistance of 14.9 Ω. The diodes are sensitive to blue, red and white light with the measured quantum efficiencies of 69%, 81% and 68%, respectively. The temperature and humidity sensors have further been tested on plants in a greenhouse, demonstrating that individual plant behavior can be monitored.

  1. MEMS microphone innovations towards high signal to noise ratios (Conference Presentation) (Plenary Presentation)

    Science.gov (United States)

    Dehé, Alfons

    2017-06-01

    After decades of research and more than ten years of successful production in very high volumes Silicon MEMS microphones are mature and unbeatable in form factor and robustness. Audio applications such as video, noise cancellation and speech recognition are key differentiators in smart phones. Microphones with low self-noise enable those functions. Backplate-free microphones enter the signal to noise ratios above 70dB(A). This talk will describe state of the art MEMS technology of Infineon Technologies. An outlook on future technologies such as the comb sensor microphone will be given.

  2. Calibration of High Frequency MEMS Microphones

    Science.gov (United States)

    Shams, Qamar A.; Humphreys, William M.; Bartram, Scott M.; Zuckewar, Allan J.

    2007-01-01

    Understanding and controlling aircraft noise is one of the major research topics of the NASA Fundamental Aeronautics Program. One of the measurement technologies used to acquire noise data is the microphone directional array (DA). Traditional direction array hardware, consisting of commercially available condenser microphones and preamplifiers can be too expensive and their installation in hard-walled wind tunnel test sections too complicated. An emerging micro-machining technology coupled with the latest cutting edge technologies for smaller and faster systems have opened the way for development of MEMS microphones. The MEMS microphone devices are available in the market but suffer from certain important shortcomings. Based on early experiments with array prototypes, it has been found that both the bandwidth and the sound pressure level dynamic range of the microphones should be increased significantly to improve the performance and flexibility of the overall array. Thus, in collaboration with an outside MEMS design vendor, NASA Langley modified commercially available MEMS microphone as shown in Figure 1 to meet the new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Over the years, several methods have been used for microphone calibration. Some of the common methods of microphone calibration are Coupler (Reciprocity, Substitution, and Simultaneous), Pistonphone, Electrostatic actuator, and Free-field calibration (Reciprocity, Substitution, and Simultaneous). Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones for wideband frequency ranges; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size. Hence a substitution-based, free-field method was developed to

  3. Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplates

    KAUST Repository

    Lizardo, Ernesto B.

    2013-05-08

    Micro-electro-mechanical systems (MEMS) became possible thanks to the silicon based technology used to fabricate integrated circuits. Originally, MEMS fabrication was limited to silicon based techniques and materials, but the expansion of MEMS applications brought the need of a wider catalog of materials, including polymers, now being used to fabricate MEMS. Polyimide is a very attractive polymer for MEMS fabrication due to its high temperature stability compared to other polymers, low coefficient of thermal expansion, low film stress and low cost. The goal of this thesis is to expand the Polyimide usage as structural material for MEMS by the development of a multi-user fabrication process for the integration of this polymer along with multiple metal layers on a silicon substrate. The process also integrates amorphous silicon as sacrificial layer to create free-standing structures. Dry etching is used to release the devices and avoid stiction phenomena. The developed process is used to fabricate platforms for micro-hotplate gas sensors. The fabrication steps for the platforms are described in detail, explaining the process specifics and capabilities. An initial testing of the micro-hotplate is presented. As the process was also used as educational tool, some designs made by students and fabricated with the Polyimide-MEMS process are also presented.

  4. One-Dimensional Contact Mode Interdigitated Center of Pressure Sensor (CMIPS)

    Science.gov (United States)

    Xu, Tian-Bing; Kang, Jinho; Park, Cheol; Harrison, Joycelyn S.; Guerreiro, Nelson M.; Hubbard, James E.

    2009-01-01

    A one dimensional contact mode interdigitated center of pressure sensor (CMIPS) has been developed. The experimental study demonstrated that the CMIPS has the capability to measure the overall pressure as well as the center of pressure in one dimension, simultaneously. A theoretical model for the CMIPS is established here based on the equivalent circuit of the configuration of the CMIPS as well as the material properties of the sensor. The experimental results match well with theoretical modeling predictions. A system mapped with two or more pieces of the CMIPS can be used to obtain information from the pressure distribution in multi-dimensions.

  5. Passive Resistor Temperature Compensation for a High-Temperature Piezoresistive Pressure Sensor.

    Science.gov (United States)

    Yao, Zong; Liang, Ting; Jia, Pinggang; Hong, Yingping; Qi, Lei; Lei, Cheng; Zhang, Bin; Li, Wangwang; Zhang, Diya; Xiong, Jijun

    2016-07-22

    The main limitation of high-temperature piezoresistive pressure sensors is the variation of output voltage with operating temperature, which seriously reduces their measurement accuracy. This paper presents a passive resistor temperature compensation technique whose parameters are calculated using differential equations. Unlike traditional experiential arithmetic, the differential equations are independent of the parameter deviation among the piezoresistors of the microelectromechanical pressure sensor and the residual stress caused by the fabrication process or a mismatch in the thermal expansion coefficients. The differential equations are solved using calibration data from uncompensated high-temperature piezoresistive pressure sensors. Tests conducted on the calibrated equipment at various temperatures and pressures show that the passive resistor temperature compensation produces a remarkable effect. Additionally, a high-temperature signal-conditioning circuit is used to improve the output sensitivity of the sensor, which can be reduced by the temperature compensation. Compared to traditional experiential arithmetic, the proposed passive resistor temperature compensation technique exhibits less temperature drift and is expected to be highly applicable for pressure measurements in harsh environments with large temperature variations.

  6. Research on Water Velocity Measurement of Reservoir Based on Pressure Sensor

    Directory of Open Access Journals (Sweden)

    Xiaoqiang Zhao

    2014-11-01

    Full Text Available To address the problem that pressure sensor can only measure the liquid level in reservoir, we designed a current velocity measurement system of reservoir based on pressure sensor, analyzed the error of current velocity measurement system, and proposed the error processing method and corresponding program. Several tests and experimental results show that in this measurement system, the liquid level measurement standard deviation is no more than 0.01 cm, and the current velocity measurement standard deviation is no more than 0.35 mL/s, which proves that the pressure sensor can measure both liquid level and current velocity synchronously.

  7. High Temperature Characterization of Ceramic Pressure Sensors

    National Research Council Canada - National Science Library

    Fonseca, Michael A; English, Jennifer M; Von Arx, Martin; Allen, Mark G

    2001-01-01

    This work reports functional wireless ceramic micromachined pressure sensors operating at 450 C, with demonstrated materials and readout capability indicating potential extension to temperatures in excess of 600 C...

  8. Fabrication and Characterization of a Pressure Sensor using a Pitch-based Carbon Fiber

    International Nuclear Information System (INIS)

    Park, Chang Sin; Kang, Bo Seon; Lee, Dong Weon

    2007-01-01

    This paper reports fabrication and characterization of a pressure sensor using a pitch-based carbon fiber. Pitch-based carbon fibers have been shown to exhibit the piezoresistive effect, in which the electric resistance of the carbon fiber changes under mechanical deformation. The main structure of pressure sensors was built by performing backside etching on a SOI wafer and creating a suspended square membrane on the front side. An AC electric field which causes dielectrophoresis was used for the alignment and deposition of a carbon fiber across the microscale gap between two electrodes on the membrane. The fabricated pressure sensors were tested by applying static pressure to the membrane and measuring the resistance change of the carbon fiber. The resistance change of carbon fibers clearly shows linear response to the applied pressure and the calculated sensitivities of pressure sensors are 0.25∼0.35 and 61.8 Ω/kΩ·bar for thicker and thinner membrane, respectively. All these observations demonstrated the possibilities of carbon fiber-based pressure sensors

  9. Fabrications and Performance of Wireless LC Pressure Sensors through LTCC Technology.

    Science.gov (United States)

    Lin, Lin; Ma, Mingsheng; Zhang, Faqiang; Liu, Feng; Liu, Zhifu; Li, Yongxiang

    2018-01-25

    This paper presents a kind of passive wireless pressure sensor comprised of a planar spiral inductor and a cavity parallel plate capacitor fabricated through low-temperature co-fired ceramic (LTCC) technology. The LTCC material with a low Young's modulus of ~65 GPa prepared by our laboratory was used to obtain high sensitivity. A three-step lamination process was applied to construct a high quality cavity structure without using any sacrificial materials. The effects of the thickness of the sensing membranes on the sensitivity and detection range of the pressure sensors were investigated. The sensor with a 148 μm sensing membrane showed the highest sensitivity of 3.76 kHz/kPa, and the sensor with a 432 μm sensing membrane presented a high detection limit of 2660 kPa. The tunable sensitivity and detection limit of the wireless pressure sensors can meet the requirements of different scenes.

  10. Development of Testing Methodologies for the Mechanical Properties of MEMS

    Science.gov (United States)

    Ekwaro-Osire, Stephen

    2003-01-01

    This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.

  11. A microfluidic circulatory system integrated with capillary-assisted pressure sensors.

    Science.gov (United States)

    Chen, Yangfan; Chan, Ho Nam; Michael, Sean A; Shen, Yusheng; Chen, Yin; Tian, Qian; Huang, Lu; Wu, Hongkai

    2017-02-14

    The human circulatory system comprises a complex network of blood vessels interconnecting biologically relevant organs and a heart driving blood recirculation throughout this system. Recreating this system in vitro would act as a bridge between organ-on-a-chip and "body-on-a-chip" and advance the development of in vitro models. Here, we present a microfluidic circulatory system integrated with an on-chip pressure sensor to closely mimic human systemic circulation in vitro. A cardiac-like on-chip pumping system is incorporated in the device. It consists of four pumping units and passive check valves, which mimic the four heart chambers and heart valves, respectively. Each pumping unit is independently controlled with adjustable pressure and pump rate, enabling users to control the mimicked blood pressure and heartbeat rate within the device. A check valve is located downstream of each pumping unit to prevent backward leakage. Pulsatile and unidirectional flow can be generated to recirculate within the device by programming the four pumping units. We also report an on-chip capillary-assisted pressure sensor to monitor the pressure inside the device. One end of the capillary was placed in the measurement region, while the other end was sealed. Time-dependent pressure changes were measured by recording the movement of the liquid-gas interface in the capillary and calculating the pressure using the ideal gas law. The sensor covered the physiologically relevant blood pressure range found in humans (0-142.5 mmHg) and could respond to 0.2 s actuation time. With the aid of the sensor, the pressure inside the device could be adjusted to the desired range. As a proof of concept, human normal left ventricular and arterial pressure profiles were mimicked inside this device. Human umbilical vein endothelial cells (HUVECs) were cultured on chip and cells can respond to mechanical forces generated by arterial-like flow patterns.

  12. Thin film devices used as oxygen partial pressure sensors

    Science.gov (United States)

    Canady, K. S.; Wortman, J. J.

    1970-01-01

    Electrical conductivity of zinc oxide films to be used in an oxygen partial pressure sensor is measured as a function of temperature, oxygen partial pressure, and other atmospheric constituents. Time response following partial pressure changes is studied as a function of temperature and environmental changes.

  13. Rough-Surface-Enabled Capacitive Pressure Sensors with 3D Touch Capability.

    Science.gov (United States)

    Lee, Kilsoo; Lee, Jaehong; Kim, Gwangmook; Kim, Youngjae; Kang, Subin; Cho, Sungjun; Kim, SeulGee; Kim, Jae-Kang; Lee, Wooyoung; Kim, Dae-Eun; Kang, Shinill; Kim, DaeEun; Lee, Taeyoon; Shim, Wooyoung

    2017-11-01

    Fabrication strategies that pursue "simplicity" for the production process and "functionality" for a device, in general, are mutually exclusive. Therefore, strategies that are less expensive, less equipment-intensive, and consequently, more accessible to researchers for the realization of omnipresent electronics are required. Here, this study presents a conceptually different approach that utilizes the inartificial design of the surface roughness of paper to realize a capacitive pressure sensor with high performance compared with sensors produced using costly microfabrication processes. This study utilizes a writing activity with a pencil and paper, which enables the construction of a fundamental capacitor that can be used as a flexible capacitive pressure sensor with high pressure sensitivity and short response time and that it can be inexpensively fabricated over large areas. Furthermore, the paper-based pressure sensors are integrated into a fully functional 3D touch-pad device, which is a step toward the realization of omnipresent electronics. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  14. Fabrication of All-SiC Fiber-Optic Pressure Sensors for High-Temperature Applications.

    Science.gov (United States)

    Jiang, Yonggang; Li, Jian; Zhou, Zhiwen; Jiang, Xinggang; Zhang, Deyuan

    2016-10-17

    Single-crystal silicon carbide (SiC)-based pressure sensors can be used in harsh environments, as they exhibit stable mechanical and electrical properties at elevated temperatures. A fiber-optic pressure sensor with an all-SiC sensor head was fabricated and is herein proposed. SiC sensor diaphragms were fabricated via an ultrasonic vibration mill-grinding (UVMG) method, which resulted in a small grinding force and low surface roughness. The sensor head was formed by hermetically bonding two layers of SiC using a nickel diffusion bonding method. The pressure sensor illustrated a good linearity in the range of 0.1-0.9 MPa, with a resolution of 0.27% F.S. (full scale) at room temperature.

  15. Improvement of a sensor unit for wrist blood pressure monitoring system

    Science.gov (United States)

    Koo, Sangjun; Kwon, Jongwon; Park, Yongman; Ayuzenara, Odgerel; Kim, Hiesik

    2007-12-01

    A blood pressure sensor unit for ubiquitous healthcare monitoring was newly developed. The digital wrist band-type blood pressure devices for home are popular already in the market. It is useful for checking blood pressure level at home and control of hypertension. Especially, it is very essential home device to check the health condition of blood circulation disease. Nowadays many product types are available. But the measurement of blood pressure is not accurate enough compared with the mechanical type. It needs to be upgraded to assure the precise health data enough to use in the hospital. The structure, feature and output signal of capacitor type pressure sensors are analyzed. An improved design of capacitor sensor is suggested. It shows more precise health data after use on a wrist band type health unit. They can be applied for remote u-health medical service.

  16. Multi-channel electronically scanned cryogenic pressure sensor

    Science.gov (United States)

    Chapman, John J. (Inventor); Hopson, Purnell, Jr. (Inventor); Kruse, Nancy M. H. (Inventor)

    1995-01-01

    A miniature, multi-channel, electronically scanned pressure measuring device uses electrostatically bonded silicon dies in a multielement array. These dies are bonded at specific sites on a glass, prepatterned substrate. Thermal data is multiplexed and recorded on each individual pressure measuring diaphragm. The device functions in a cryogenic environment without the need of heaters to keep the sensor at constant temperatures.

  17. A Miniaturized Carbon Dioxide Gas Sensor Based on Sensing of pH-Sensitive Hydrogel Swelling with a Pressure Sensor

    NARCIS (Netherlands)

    Herber, S.; Bomer, Johan G.; Olthuis, Wouter; Bergveld, Piet; van den Berg, Albert

    2005-01-01

    A measurement concept has been realized for the detection of carbon dioxide, where the CO2 induced pressure generation by an enclosed pH-sensitive hydrogel is measured with a micro pressure sensor. The application of the sensor is the quantification of the partial pressure of CO2 (Pco2) in the

  18. Sputtered highly oriented PZT thin films for MEMS applications

    Science.gov (United States)

    Kalpat, Sriram S.

    Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate

  19. Enabling MEMS technologies for communications systems

    Science.gov (United States)

    Lubecke, Victor M.; Barber, Bradley P.; Arney, Susanne

    2001-11-01

    Modern communications demands have been steadily growing not only in size, but sophistication. Phone calls over copper wires have evolved into high definition video conferencing over optical fibers, and wireless internet browsing. The technology used to meet these demands is under constant pressure to provide increased capacity, speed, and efficiency, all with reduced size and cost. Various MEMS technologies have shown great promise for meeting these challenges by extending the performance of conventional circuitry and introducing radical new systems approaches. A variety of strategic MEMS structures including various cost-effective free-space optics and high-Q RF components are described, along with related practical implementation issues. These components are rapidly becoming essential for enabling the development of progressive new communications systems technologies including all-optical networks, and low cost multi-system wireless terminals and basestations.

  20. Carbon nanotube—cuprous oxide composite based pressure sensors

    International Nuclear Information System (INIS)

    Karimov, Kh. S.; Chani, Muhammad Tariq Saeed; Khalid, Fazal Ahmad; Khan, Adam; Khan, Rahim

    2012-01-01

    In this paper, we present the design, the fabrication, and the experimental results of carbon nanotube (CNT) and Cu 2 O composite based pressure sensors. The pressed tablets of the CNT—Cu 2 O composite are fabricated at a pressure of 353 MPa. The diameters of the multiwalled nanotubes (MWNTs) are between 10 nm and 30 nm. The sizes of the Cu 2 O micro particles are in the range of 3–4 μm. The average diameter and the average thickness of the pressed tablets are 10 mm and 4.0 mm, respectively. In order to make low resistance electric contacts, the two sides of the pressed tablet are covered by silver pastes. The direct current resistance of the pressure sensor decreases by 3.3 times as the pressure increases up to 37 kN/m 2 . The simulation result of the resistance—pressure relationship is in good agreement with the experimental result within a variation of ±2%. (condensed matter: structural, mechanical, and thermal properties)