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Sample records for mems microshutter array

  1. Next-Generation Microshutter Arrays for Large-Format Imaging and Spectroscopy

    Science.gov (United States)

    Moseley, Samuel; Kutyrev, Alexander; Brown, Ari; Li, Mary

    2012-01-01

    A next-generation microshutter array, LArge Microshutter Array (LAMA), was developed as a multi-object field selector. LAMA consists of small-scaled microshutter arrays that can be combined to form large-scale microshutter array mosaics. Microshutter actuation is accomplished via electrostatic attraction between the shutter and a counter electrode, and 2D addressing can be accomplished by applying an electrostatic potential between a row of shutters and a column, orthogonal to the row, of counter electrodes. Microelectromechanical system (MEMS) technology is used to fabricate the microshutter arrays. The main feature of the microshutter device is to use a set of standard surface micromachining processes for device fabrication. Electrostatic actuation is used to eliminate the need for macromechanical magnet actuating components. A simplified electrostatic actuation with no macro components (e.g. moving magnets) required for actuation and latching of the shutters will make the microshutter arrays robust and less prone to mechanical failure. Smaller-size individual arrays will help to increase the yield and thus reduce the cost and improve robustness of the fabrication process. Reducing the size of the individual shutter array to about one square inch and building the large-scale mosaics by tiling these smaller-size arrays would further help to reduce the cost of the device due to the higher yield of smaller devices. The LAMA development is based on prior experience acquired while developing microshutter arrays for the James Webb Space Telescope (JWST), but it will have different features. The LAMA modular design permits large-format mosaicking to cover a field of view at least 50 times larger than JWST MSA. The LAMA electrostatic, instead of magnetic, actuation enables operation cycles at least 100 times faster and a mass significantly smaller compared to JWST MSA. Also, standard surface micromachining technology will simplify the fabrication process, increasing

  2. 2D Electrostatic Actuation of Microshutter Arrays

    Science.gov (United States)

    Burns, Devin E.; Oh, Lance H.; Li, Mary J.; Jones, Justin S.; Kelly, Daniel P.; Zheng, Yun; Kutyrev, Alexander S.; Moseley, Samuel H.

    2015-01-01

    An electrostatically actuated microshutter array consisting of rotational microshutters (shutters that rotate about a torsion bar) were designed and fabricated through the use of models and experiments. Design iterations focused on minimizing the torsional stiffness of the microshutters, while maintaining their structural integrity. Mechanical and electromechanical test systems were constructed to measure the static and dynamic behavior of the microshutters. The torsional stiffness was reduced by a factor of four over initial designs without sacrificing durability. Analysis of the resonant behavior of the microshutter arrays demonstrates that the first resonant mode is a torsional mode occurring around 3000 Hz. At low vacuum pressures, this resonant mode can be used to significantly reduce the drive voltage necessary for actuation requiring as little as 25V. 2D electrostatic latching and addressing was demonstrated using both a resonant and pulsed addressing scheme.

  3. Next Generation Microshutter Arrays Project

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose to develop the next generation MicroShutter Array (MSA) as a multi-object field selector for missions anticipated in the next two decades. For many...

  4. Graphene Transparent Conductive Electrodes for Next- Generation Microshutter Arrays

    Science.gov (United States)

    Li, Mary; Sultana, Mahmooda; Hess, Larry

    2012-01-01

    Graphene is a single atomic layer of graphite. It is optically transparent and has high electron mobility, and thus has great potential to make transparent conductive electrodes. This invention contributes towards the development of graphene transparent conductive electrodes for next-generation microshutter arrays. The original design for the electrodes of the next generation of microshutters uses indium-tin-oxide (ITO) as the electrode material. ITO is widely used in NASA flight missions. The optical transparency of ITO is limited, and the material is brittle. Also, ITO has been getting more expensive in recent years. The objective of the invention is to develop a graphene transparent conductive electrode that will replace ITO. An exfoliation procedure was developed to make graphene out of graphite crystals. In addition, large areas of single-layer graphene were produced using low-pressure chemical vapor deposition (LPCVD) with high optical transparency. A special graphene transport procedure was developed for transferring graphene from copper substrates to arbitrary substrates. The concept is to grow large-size graphene sheets using the LPCVD system through chemical reaction, transfer the graphene film to a substrate, dope graphene to reduce the sheet resistance, and pattern the film to the dimension of the electrodes in the microshutter array. Graphene transparent conductive electrodes are expected to have a transparency of 97.7%. This covers the electromagnetic spectrum from UV to IR. In comparison, ITO electrodes currently used in microshutter arrays have 85% transparency in mid-IR, and suffer from dramatic transparency drop at a wavelength of near-IR or shorter. Thus, graphene also has potential application as transparent conductive electrodes for Schottky photodiodes in the UV region.

  5. Mechanical Behavior of Microelectromechanical Microshutters

    Science.gov (United States)

    Burns, Devin Edward; Jones, Justin Scott; Li, Mary J.

    2014-01-01

    A custom micro-mechanical test system was constructed using off-the-shelf components to characterize the mechanical properties of microshutters. Microshutters are rectangular microelectromechanical apertures which open and close about a narrow torsion bar hinge. Displacement measurements were verified using both capacitive and digital image correlation techniques. Repeatable experiments on Si3N4 cantilever beams verified that the test system operates consistently. Using beam theory, the modulus of elasticity of the low stress Si3N4 was approximately 150 GPa, though significant uncertainty exists for this measurement due primarily to imprecise knowledge of the cantilever thickness. Tests conducted on microshutter arrays concluded that reducing the Si3N4 thickness from 250 nm to 500 nm reduces the torsional stiffness by a factor of approximately four. This is in good agreement with analytical and finite element models of the microshutters.

  6. Microshutter Array Development for the Multi-Object Spectrograph for the New Generation Space Telescope, and Its Ground-based Demonstrator

    Science.gov (United States)

    Woodgate, Bruce E.; Moseley, Harvey; Fettig, Rainer; Kutyrev, Alexander; Ge, Jian; Fisher, Richard R. (Technical Monitor)

    2001-01-01

    The 6.5-m NASA/ESA/Canada New Generation Space Telescope to be operated at the L2 Lagrangian point will require a multi-object spectrograph (MOS) operating from 1 to 5 microns. Up to 3000 targets will be selected for simultaneous spectroscopy using a programmable cryogenic (approx. 35K) aperture array, consisting of a mosaic of arrays of micromirrors or microshutters. We describe the current status of the GSFC microshutter array development. The 100 micron square shutters are opened magnetically and latched open or closed electrostatically. Selection will be by two crossed one-dimensional addressing circuits. We will demonstrate the use of a 512 x 512 unit array on a ground-based IR MOS which will cover 0.6 to 5 microns, and operate rapidly to include spectroscopy of gamma ray burst afterglows.

  7. Design and Analysis of MEMS Linear Phased Array

    Directory of Open Access Journals (Sweden)

    Guoxiang Fan

    2016-01-01

    Full Text Available A structure of micro-electro-mechanical system (MEMS linear phased array based on “multi-cell” element is designed to increase radiation sound pressure of transducer working in bending vibration mode at high frequency. In order to more accurately predict the resonant frequency of an element, the theoretical analysis of the dynamic equation of a fixed rectangular composite plate and finite element method simulation are adopted. The effects of the parameters both in the lateral and elevation direction on the three-dimensional beam directivity characteristics are comprehensively analyzed. The key parameters in the analysis include the “cell” number of element, “cell” size, “inter-cell” spacing and the number of elements, element width. The simulation results show that optimizing the linear array parameters both in the lateral and elevation direction can greatly improve the three-dimensional beam focusing for MEMS linear phased array, which is obviously different from the traditional linear array.

  8. Oxidative stress detection by MEMS cantilever sensor array based electronic nose

    Science.gov (United States)

    Gupta, Anurag; Singh, T. Sonamani; Singh, Priyanka; Yadava, R. D. S.

    2018-05-01

    This paper is concerned with analyzing the role of polymer swelling induced surface stress in MEMS chemical sensors. The objective is to determine the impact of surface stress on the chemical discrimination ability of MEMS resonator sensors. We considered a case study of hypoxia detection by MEMS sensor array and performed several types of simulation experiments for detection of oxidative stress volatile organic markers in human breath. Both types of sensor response models that account for the surface stress effect and that did not were considered for the analyses in comparison. It is found that the surface stress (hence the polymer swelling) provides better chemical discrimination ability to polymer coated MEMS sensors.

  9. Enhancement of Frequency Stability Using Synchronization of a Cantilever Array for MEMS-Based Sensors

    Directory of Open Access Journals (Sweden)

    Francesc Torres

    2016-10-01

    Full Text Available Micro and nano electromechanical resonators have been widely used as single or multiple-mass detection sensors. Smaller devices with higher resonance frequencies and lower masses offer higher mass responsivities but suffer from lower frequency stability. Synchronization phenomena in multiple MEMS resonators have become an important issue because they allow frequency stability improvement, thereby preserving mass responsivity. The authors present an array of five cantilevers (CMOS-MEMS system that are forced to vibrate synchronously to enhance their frequency stability. The frequency stability has been determined in closed-loop configuration for long periods of time by calculating the Allan deviation. An Allan deviation of 0.013 ppm (@ 1 s averaging time for a 1 MHz cantilever array MEMS system was obtained at the synchronized mode, which represents a 23-fold improvement in comparison with the non-synchronized operation mode (0.3 ppm.

  10. Acoustic Source Localization via Subspace Based Method Using Small Aperture MEMS Arrays

    Directory of Open Access Journals (Sweden)

    Xin Zhang

    2014-01-01

    Full Text Available Small aperture microphone arrays provide many advantages for portable devices and hearing aid equipment. In this paper, a subspace based localization method is proposed for acoustic source using small aperture arrays. The effects of array aperture on localization are analyzed by using array response (array manifold. Besides array aperture, the frequency of acoustic source and the variance of signal power are simulated to demonstrate how to optimize localization performance, which is carried out by introducing frequency error with the proposed method. The proposed method for 5 mm array aperture is validated by simulations and experiments with MEMS microphone arrays. Different types of acoustic sources can be localized with the highest precision of 6 degrees even in the presence of wind noise and other noises. Furthermore, the proposed method reduces the computational complexity compared with other methods.

  11. Cryogenic Photogrammetry and Radiometry for the James Webb Space Telescope Microshutters

    Science.gov (United States)

    Chambers, Victor J.; Morey, Peter A.; Zukowski, Barbara J.; Kutyrev, Alexander S.; Collins, Nicholas R.

    2012-01-01

    The James Webb Space Telescope (JWST) relies on several innovations to complete its five year mission. One vital technology is microshutters, the programmable field selectors that enable the Near Infrared Spectrometer (NIRSpec) to perform multi-object spectroscopy. Mission success depends on acquiring spectra from large numbers of galaxies by positioning shutter slits over faint targets. Precise selection of faint targets requires field selectors that are both high in contrast and stable in position. We have developed test facilities to evaluate microshutter contrast and alignment stability at their 35K operating temperature. These facilities used a novel application of image registration algorithms to obtain non-contact, sub-micron measurements in cryogenic conditions. The cryogenic motion of the shutters was successfully characterized. Optical results also demonstrated that shutter contrast far exceeds the NIRSpec requirements. Our test program has concluded with the delivery of a flight-qualified field selection subsystem to the NIRSpec bench.

  12. MEMS based monolithic Phased array using 3-bit Switched-line Phase Shifter

    Directory of Open Access Journals (Sweden)

    A. Karmakr

    2017-10-01

    Full Text Available This article details the design of an electronically scanning phased array antenna with proposed fabrication process steps. Structure is based upon RF micro-electromechanical system (MEMS technology. Capacitive type shunt switches have been implemented here to cater high frequency operation. The architecture, which is deigned at 30 GHz, consists of 3-bit (11.25º, 22.5º and 45º integrated Switched-line phase shifter and a linearly polarized microstrip patch antenna. Detailed design tricks of the Ka-band phase shifter is outlined here. The whole design is targeted for future monolithic integration. So, the substrate of choice is High Resistive Silicon (ρ > 8kΩ-cm, tan δ =0.01 and ϵr =11.8. The overall circuit occupies an cross-sectional area of 20 × 5 mm2. The simulated results show that the phase shifter can provide nearly 11.25º/22.5º/45º phase shifts and their combinations at the expense of 1dB average insertion loss at 30 GHz for eight combinations. Practical fabrication process flow using surface micromachining is proposed here. Critical dimensions of the phased array structure is governed by the deign rules of the standard CMOS/MEMS foundry.

  13. Research on High-Precision, Low Cost Piezoresistive MEMS-Array Pressure Transmitters Based on Genetic Wavelet Neural Networks for Meteorological Measurements

    Directory of Open Access Journals (Sweden)

    Jiahong Zhang

    2015-05-01

    Full Text Available This paper provides a novel and effective compensation method by improving the hardware design and software algorithm to achieve optimization of piezoresistive pressure sensors and corresponding measurement systems in order to measure pressure more accurately and stably, as well as to meet the application requirements of the meteorological industry. Specifically, GE NovaSensor MEMS piezoresistive pressure sensors within a thousandth of accuracy are selected to constitute an array. In the versatile compensation method, the hardware utilizes the array of MEMS pressure sensors to reduce random error caused by sensor creep, and the software adopts the data fusion technique based on the wavelet neural network (WNN which is improved by genetic algorithm (GA to analyze the data of sensors for the sake of obtaining accurate and complete information over the wide temperature and pressure ranges. The GA-WNN model is implemented in hardware by using the 32-bit STMicroelectronics (STM32 microcontroller combined with an embedded real-time operating system µC/OS-II to make the output of the array of MEMS sensors be a direct digital readout. The results of calibration and test experiments clearly show that the GA-WNN technique can be effectively applied to minimize the sensor errors due to the temperature drift, the hysteresis effect and the long-term drift because of aging and environmental changes. The maximum error of the low cost piezoresistive MEMS-array pressure transmitter proposed by us is within 0.04% of its full-scale value, and it can satisfy the meteorological pressure measurement.

  14. Laser radar range and detection performance for MEMS corner cube retroreflector arrays

    Science.gov (United States)

    Grasso, Robert J.; Odhner, Jefferson E.; Stewart, Hamilton; McDaniel, Robert V.

    2004-12-01

    BAE SYSTEMS reports on a program to characterize the performance of MEMS corner cube retroreflector arrays under laser illumination. These arrays have significant military and commercial application in the areas of: 1) target identification; 2) target tracking; 3) target location; 4) identification friend-or-foe (IFF); 5) parcel tracking, and; 6) search and rescue assistance. BAE SYSTEMS has theoretically determined the feasibility of these devices to learn if sufficient signal-to-noise performance exists to permit a cooperative laser radar sensor to be considered for device location and interrogation. Results indicate that modest power-apertures are required to achieve SNR performance consistent with high probability of detection and low false alarm rates.

  15. Film-Evaporation MEMS Tunable Array for Picosat Propulsion and Thermal Control

    Science.gov (United States)

    Alexeenko, Alina; Cardiff, Eric; Martinez, Andres; Petro, Andrew

    2015-01-01

    The Film-Evaporation MEMS Tunable Array (FEMTA) concept for propulsion and thermal control of picosats exploits microscale surface tension effect in conjunction with temperature- dependent vapor pressure to realize compact, tunable and low-power thermal valving system. The FEMTA is intended to be a self-contained propulsion unit requiring only a low-voltage DC power source to operate. The microfabricated thermal valving and very-high-integration level enables fast high-capacity cooling and high-resolution, low-power micropropulsion for picosats that is superior to existing smallsat micropropulsion and thermal management alternatives.

  16. Advanced Mechatronics and MEMS Devices

    CERN Document Server

    2013-01-01

    Advanced Mechatronics and MEMS Devicesdescribes state-of-the-art MEMS devices and introduces the latest technology in electrical and mechanical microsystems. The evolution of design in microfabrication, as well as emerging issues in nanomaterials, micromachining, micromanufacturing and microassembly are all discussed at length in this volume. Advanced Mechatronics also provides a reader with knowledge of MEMS sensors array, MEMS multidimensional accelerometer, artificial skin with imbedded tactile components, as well as other topics in MEMS sensors and transducers. The book also presents a number of topics in advanced robotics and an abundance of applications of MEMS in robotics, like reconfigurable modular snake robots, magnetic MEMS robots for drug delivery and flying robots with adjustable wings, to name a few. This book also: Covers the fundamentals of advanced mechatronics and MEMS devices while also presenting new state-of-the-art methodology and technology used in the application of these devices Prese...

  17. Ultra-high-aspect-orthogonal and tunable three dimensional polymeric nanochannel stack array for BioMEMS applications

    Science.gov (United States)

    Heo, Joonseong; Kwon, Hyukjin J.; Jeon, Hyungkook; Kim, Bumjoo; Kim, Sung Jae; Lim, Geunbae

    2014-07-01

    Nanofabrication technologies have been a strong advocator for new scientific fundamentals that have never been described by traditional theory, and have played a seed role in ground-breaking nano-engineering applications. In this study, we fabricated ultra-high-aspect (~106 with O(100) nm nanochannel opening and O(100) mm length) orthogonal nanochannel array using only polymeric materials. Vertically aligned nanochannel arrays in parallel can be stacked to form a dense nano-structure. Due to the flexibility and stretchability of the material, one can tune the size and shape of the nanochannel using elongation and even roll the stack array to form a radial-uniformly distributed nanochannel array. The roll can be cut at discretionary lengths for incorporation with a micro/nanofluidic device. As examples, we demonstrated ion concentration polarization with the device for Ohmic-limiting/overlimiting current-voltage characteristics and preconcentrated charged species. The density of the nanochannel array was lower than conventional nanoporous membranes, such as anodic aluminum oxide membranes (AAO). However, accurate controllability over the nanochannel array dimensions enabled multiplexed one microstructure-on-one nanostructure interfacing for valuable biological/biomedical microelectromechanical system (BioMEMS) platforms, such as nano-electroporation.Nanofabrication technologies have been a strong advocator for new scientific fundamentals that have never been described by traditional theory, and have played a seed role in ground-breaking nano-engineering applications. In this study, we fabricated ultra-high-aspect (~106 with O(100) nm nanochannel opening and O(100) mm length) orthogonal nanochannel array using only polymeric materials. Vertically aligned nanochannel arrays in parallel can be stacked to form a dense nano-structure. Due to the flexibility and stretchability of the material, one can tune the size and shape of the nanochannel using elongation and even

  18. Analysis of Correlation in MEMS Gyroscope Array and its Influence on Accuracy Improvement for the Combined Angular Rate Signal

    Directory of Open Access Journals (Sweden)

    Liang Xue

    2018-01-01

    Full Text Available Obtaining a correlation factor is a prerequisite for fusing multiple outputs of a mircoelectromechanical system (MEMS gyroscope array and evaluating accuracy improvement. In this paper, a mathematical statistics method is established to analyze and obtain the practical correlation factor of a MEMS gyroscope array, which solves the problem of determining the Kalman filter (KF covariance matrix Q and fusing the multiple gyroscope signals. The working principle and mathematical model of the sensor array fusion is briefly described, and then an optimal estimate of input rate signal is achieved by using of a steady-state KF gain in an off-line estimation approach. Both theoretical analysis and simulation show that the negative correlation factor has a favorable influence on accuracy improvement. Additionally, a four-gyro array system composed of four discrete individual gyroscopes was developed to test the correlation factor and its influence on KF accuracy improvement. The result showed that correlation factors have both positive and negative values; in particular, there exist differences for correlation factor between the different units in the array. The test results also indicated that the Angular Random Walk (ARW of 1.57°/h0.5 and bias drift of 224.2°/h for a single gyroscope were reduced to 0.33°/h0.5 and 47.8°/h with some negative correlation factors existing in the gyroscope array, making a noise reduction factor of about 4.7, which is higher than that of a uncorrelated four-gyro array. The overall accuracy of the combined angular rate signal can be further improved if the negative correlation factors in the gyroscope array become larger.

  19. Spiral-Shaped Piezoelectric MEMS Cantilever Array for Fully Implantable Hearing Systems

    Directory of Open Access Journals (Sweden)

    Péter Udvardi

    2017-10-01

    Full Text Available Fully implantable, self-powered hearing aids with no external unit could significantly increase the life quality of patients suffering severe hearing loss. This highly demanding concept, however, requires a strongly miniaturized device which is fully implantable in the middle/inner ear and includes the following components: frequency selective microphone or accelerometer, energy harvesting device, speech processor, and cochlear multielectrode. Here we demonstrate a low volume, piezoelectric micro-electromechanical system (MEMS cantilever array which is sensitive, even in the lower part of the voice frequency range (300–700 Hz. The test array consisting of 16 cantilevers has been fabricated by standard bulk micromachining using a Si-on-Insulator (SOI wafer and aluminum nitride (AlN as a complementary metal-oxide-semiconductor (CMOS and biocompatible piezoelectric material. The low frequency and low device footprint are ensured by Archimedean spiral geometry and Si seismic mass. Experimentally detected resonance frequencies were validated by an analytical model. The generated open circuit voltage (3–10 mV is sufficient for the direct analog conversion of the signals for cochlear multielectrode implants.

  20. Calibration of High Frequency MEMS Microphones

    Science.gov (United States)

    Shams, Qamar A.; Humphreys, William M.; Bartram, Scott M.; Zuckewar, Allan J.

    2007-01-01

    Understanding and controlling aircraft noise is one of the major research topics of the NASA Fundamental Aeronautics Program. One of the measurement technologies used to acquire noise data is the microphone directional array (DA). Traditional direction array hardware, consisting of commercially available condenser microphones and preamplifiers can be too expensive and their installation in hard-walled wind tunnel test sections too complicated. An emerging micro-machining technology coupled with the latest cutting edge technologies for smaller and faster systems have opened the way for development of MEMS microphones. The MEMS microphone devices are available in the market but suffer from certain important shortcomings. Based on early experiments with array prototypes, it has been found that both the bandwidth and the sound pressure level dynamic range of the microphones should be increased significantly to improve the performance and flexibility of the overall array. Thus, in collaboration with an outside MEMS design vendor, NASA Langley modified commercially available MEMS microphone as shown in Figure 1 to meet the new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Over the years, several methods have been used for microphone calibration. Some of the common methods of microphone calibration are Coupler (Reciprocity, Substitution, and Simultaneous), Pistonphone, Electrostatic actuator, and Free-field calibration (Reciprocity, Substitution, and Simultaneous). Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones for wideband frequency ranges; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size. Hence a substitution-based, free-field method was developed to

  1. CMOS MEMS Fabrication Technologies and Devices

    Directory of Open Access Journals (Sweden)

    Hongwei Qu

    2016-01-01

    Full Text Available This paper reviews CMOS (complementary metal-oxide-semiconductor MEMS (micro-electro-mechanical systems fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator CMOS MEMS are introduced separately. Introduction of associated devices follows the description of the respective CMOS MEMS technologies. Due to the vast array of CMOS MEMS devices, this review focuses only on the most typical MEMS sensors and actuators including pressure sensors, inertial sensors, frequency reference devices and actuators utilizing different physics effects and the fabrication processes introduced. Moreover, the incorporation of MEMS and CMOS is limited to monolithic integration, meaning wafer-bonding-based stacking and other integration approaches, despite their advantages, are excluded from the discussion. Both competitive industrial products and state-of-the-art research results on CMOS MEMS are covered.

  2. MEMS fluidic actuator

    Science.gov (United States)

    Kholwadwala, Deepesh K [Albuquerque, NM; Johnston, Gabriel A [Trophy Club, TX; Rohrer, Brandon R [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Okandan, Murat [Albuquerque, NM

    2007-07-24

    The present invention comprises a novel, lightweight, massively parallel device comprising microelectromechanical (MEMS) fluidic actuators, to reconfigure the profile, of a surface. Each microfluidic actuator comprises an independent bladder that can act as both a sensor and an actuator. A MEMS sensor, and a MEMS valve within each microfluidic actuator, operate cooperatively to monitor the fluid within each bladder, and regulate the flow of the fluid entering and exiting each bladder. When adjacently spaced in a array, microfluidic actuators can create arbitrary surface profiles in response to a change in the operating environment of the surface. In an embodiment of the invention, the profile of an airfoil is controlled by independent extension and contraction of a plurality of actuators, that operate to displace a compliant cover.

  3. Design, Fabrication, and Implementation of an Array-Type MEMS Piezoresistive Intelligent Pressure Sensor System

    Directory of Open Access Journals (Sweden)

    Jiahong Zhang

    2018-02-01

    Full Text Available To meet the radiosonde requirement of high sensitivity and linearity, this study designs and implements a monolithically integrated array-type piezoresistive intelligent pressure sensor system which is made up of two groups of four pressure sensors with the pressure range of 0–50 kPa and 0–100 kPa respectively. First, theoretical models and ANSYS (version 14.5, Canonsburg, PA, USA finite element method (FEM are adopted to optimize the parameters of array sensor structure. Combing with FEM stress distribution results, the size and material characteristics of the array-type sensor are determined according to the analysis of the sensitivity and the ratio of signal to noise (SNR. Based on the optimized parameters, the manufacture and packaging of array-type sensor chips are then realized by using the standard complementary metal-oxide-semiconductor (CMOS and microelectromechanical system (MEMS process. Furthermore, an intelligent acquisition and processing system for pressure and temperature signals is achieved. The S3C2440A microprocessor (Samsung, Seoul, Korea is regarded as the core part which can be applied to collect and process data. In particular, digital signal storage, display and transmission are realized by the application of a graphical user interface (GUI written in QT/E. Besides, for the sake of compensating the temperature drift and nonlinear error, the data fusion technique is proposed based on a wavelet neural network improved by genetic algorithm (GA-WNN for average measuring signal. The GA-WNN model is implemented in hardware by using a S3C2440A microprocessor. Finally, the results of calibration and test experiments achieved with the temperature ranges from −20 to 20 °C show that: (1 the nonlinear error and the sensitivity of the array-type pressure sensor are 8330 × 10−4 and 0.052 mV/V/kPa in the range of 0–50 kPa, respectively; (2 the nonlinear error and the sensitivity are 8129 × 10−4 and 0.020 mV/V/kPa in the

  4. Design and preliminary testing of a MEMS microphone phased array for aeroacoustic testing of a small-scale wind turbine airfoil

    Energy Technology Data Exchange (ETDEWEB)

    Bale, A.; Orlando, S.; Johnson, D. [Waterloo Univ., ON (Canada). Wind Energy Group

    2010-07-01

    One of the barriers preventing the widespread utilization of wind turbines is the audible sound that they produce. Developing quieter wind turbines will increase the amount of available land onto which wind farms can be built. Noise emissions from wind turbines can be attributed to the aerodynamic effects between the turbine blades and the air surrounding them. A dominant source of these aeroacoustic emissions from wind turbines is known to originate at the trailing edges of the airfoils. This study investigated the flow physics of noise generation in an effort to reduce noise from small-scale wind turbine airfoils. The trailing edge noise was studied on scale-models in wind tunnels and applied to full scale conditions. Microphone phased arrays are popular research tools in wind tunnel aeroacoustic studies because they can measure and locate noise sources. However, large arrays of microphones can be prohibitively expensive. This paper presented preliminary testing of micro-electrical mechanical system (MEMS) microphones in phased arrays for aeroacoustic testing on a small wind turbine airfoil. Preliminary results showed that MEMS microphones are an acceptable low-cost alternative to costly condenser microphones. 19 refs., 1 tab., 11 figs.

  5. Artificial Roughness Encoding with a Bio-inspired MEMS-based Tactile Sensor Array

    Directory of Open Access Journals (Sweden)

    Calogero Maria Oddo

    2009-04-01

    Full Text Available A compliant 2x2 tactile sensor array was developed and investigated for roughness encoding. State of the art cross shape 3D MEMS sensors were integrated with polymeric packaging providing in total 16 sensitive elements to external mechanical stimuli in an area of about 20 mm2, similarly to the SA1 innervation density in humans. Experimental analysis of the bio-inspired tactile sensor array was performed by using ridged surfaces, with spatial periods from 2.6 mm to 4.1 mm, which were indented with regulated 1N normal force and stroked at constant sliding velocity from 15 mm/s to 48 mm/s. A repeatable and expected frequency shift of the sensor outputs depending on the applied stimulus and on its scanning velocity was observed between 3.66 Hz and 18.46 Hz with an overall maximum error of 1.7%. The tactile sensor could also perform contact imaging during static stimulus indentation. The experiments demonstrated the suitability of this approach for the design of a roughness encoding tactile sensor for an artificial fingerpad.

  6. Vertically Aligned Carbon Nanotube Array (VANTA Biosensor for MEMS Lab-on-a-Chip

    Directory of Open Access Journals (Sweden)

    Luke JOSEPH

    2009-10-01

    Full Text Available We describe the fabrication, functionalization and characterization of vertically aligned carbon nanotube arrays (VANTAs for biological sensor applications. This structure is created using a standard MEMS process and chemical vapor deposition (CVD multi-walled carbon nanotube (MWNT post-processing. The device is well suited for full integration into microfluidic lab-on-a-chip solutions. Included is a spectroscopic characterization of the galvanostatic impedance of the device, as well as scanning electron microscopy (SEM images of the pre- and post- functionalized device. Interferometric 3D profiling and X-ray spectroscopy were also used to check process assumptions. The work presented validates that this approach is an ideal candidate for low-cost, high-throughput manufacturing of biochemical sensors. Unlike previously published work [1, 2] using SWNT, the use of MWNT arrays allows functionalization over the entirety of the nanotubes. This approach maintains low baseline impedance and increases the surface area leveraging inherent benefits of the VANTA.

  7. Shock tunnel measurements of surface pressures in shock induced separated flow field using MEMS sensor array

    International Nuclear Information System (INIS)

    Sriram, R; Jagadeesh, G; Ram, S N; Hegde, G M; Nayak, M M

    2015-01-01

    Characterized not just by high Mach numbers, but also high flow total enthalpies—often accompanied by dissociation and ionization of flowing gas itself—the experimental simulation of hypersonic flows requires impulse facilities like shock tunnels. However, shock tunnel simulation imposes challenges and restrictions on the flow diagnostics, not just because of the possible extreme flow conditions, but also the short run times—typically around 1 ms. The development, calibration and application of fast response MEMS sensors for surface pressure measurements in IISc hypersonic shock tunnel HST-2, with a typical test time of 600 μs, for the complex flow field of strong (impinging) shock boundary layer interaction with separation close to the leading edge, is delineated in this paper. For Mach numbers 5.96 (total enthalpy 1.3 MJ kg −1 ) and 8.67 (total enthalpy 1.6 MJ kg −1 ), surface pressures ranging from around 200 Pa to 50 000 Pa, in various regions of the flow field, are measured using the MEMS sensors. The measurements are found to compare well with the measurements using commercial sensors. It was possible to resolve important regions of the flow field involving significant spatial gradients of pressure, with a resolution of 5 data points within 12 mm in each MEMS array, which cannot be achieved with the other commercial sensors. In particular, MEMS sensors enabled the measurement of separation pressure (at Mach 8.67) near the leading edge and the sharply varying pressure in the reattachment zone. (paper)

  8. Optical True Time Delay for Phased Array Antennas Composed of 2×2 Optical MEMS Switches and Fiber Delay Lines

    Institute of Scientific and Technical Information of China (English)

    Back-Song; Lee; Jong-Dug; Shin; Boo-Gyoun; Kim

    2003-01-01

    We proposed an optical true time delay (TTD) for phased array antennas (PAAs) composed of 2×2 optical MEMS switches, single-mode fiber delay lines, and a fixed wavelength laser diode. A 3-bit TTD for 10 GHz PAAs was implemented with a time delay error less than ± 0.2 ps.

  9. A Teaching - Learning Framework for MEMS Education

    International Nuclear Information System (INIS)

    Sheeparamatti, B G; Angadi, S A; Sheeparamatti, R B; Kadadevaramath, J S

    2006-01-01

    Micro-Electro-Mechanical Systems (MEMS) technology has been identified as one of the most promising technologies in the 21st century. MEMS technology has opened up a wide array of unforeseen applications. Hence it is necessary to train the technocrats of tomorrow in this emerging field to meet the industrial/societal demands. The drive behind fostering of MEMS technology is the reduction in the cost, size, weight, and power consumption of the sensors, actuators, and associated electronics. MEMS is a multidisciplinary engineering and basic science area which includes electrical engineering, mechanical engineering, material science and biomedical engineering. Hence MEMS education needs a special approach to prepare the technocrats for a career in MEMS. The modern education methodology using computer based training systems (CBTS) with embedded modeling and simulation tools will help in this direction. The availability of computer based learning resources such as MATLAB, ANSYS/Multiphysics and rapid prototyping tools have contributed to proposition of an efficient teaching-learning framework for MEMS education presented in this paper. This paper proposes a conceptual framework for teaching/learning MEMS in the current technical education scenario

  10. Thin Film Transistor Control Circuitry for MEMS Acoustic Transducers

    Science.gov (United States)

    Daugherty, Robin

    This work seeks to develop a practical solution for short range ultrasonic communications and produce an integrated array of acoustic transmitters on a flexible substrate. This is done using flexible thin film transistor (TFT) and micro electromechanical systems (MEMS). The goal is to develop a flexible system capable of communicating in the ultrasonic frequency range at a distance of 10-100 meters. This requires a great deal of innovation on the part of the FDC team developing the TFT driving circuitry and the MEMS team adapting the technology for fabrication on a flexible substrate. The technologies required for this research are independently developed. The TFT development is driven primarily by research into flexible displays. The MEMS development is driving by research in biosensors and micro actuators. This project involves the integration of TFT flexible circuit capabilities with MEMS micro actuators in the novel area of flexible acoustic transmitter arrays. This thesis focuses on the design, testing and analysis of the circuit components required for this project.

  11. A flexible liquid crystal polymer MEMS pressure sensor array for fish-like underwater sensing

    International Nuclear Information System (INIS)

    Kottapalli, A G P; Asadnia, M; Miao, J M; Barbastathis, G; Triantafyllou, M S

    2012-01-01

    In order to perform underwater surveillance, autonomous underwater vehicles (AUVs) require flexible, light-weight, reliable and robust sensing systems that are capable of flow sensing and detecting underwater objects. Underwater animals like fish perform a similar task using an efficient and ubiquitous sensory system called a lateral-line constituting of an array of pressure-gradient sensors. We demonstrate here the development of arrays of polymer microelectromechanical systems (MEMS) pressure sensors which are flexible and can be readily mounted on curved surfaces of AUV bodies. An array of ten sensors with a footprint of 60 (L) mm × 25 (W) mm × 0.4 (H) mm is fabricated using liquid crystal polymer (LCP) as the sensing membrane material. The flow sensing and object detection capabilities of the array are illustrated with proof-of-concept experiments conducted in a water tunnel. The sensors demonstrate a pressure sensitivity of 14.3 μV Pa −1 . A high resolution of 25 mm s −1 is achieved in water flow sensing. The sensors can passively sense underwater objects by transducing the pressure variations generated underwater by the movement of objects. The experimental results demonstrate the array’s ability to detect the velocity of underwater objects towed past by with high accuracy, and an average error of only 2.5%. (paper)

  12. TREMOR: A wireless MEMS accelerograph for dense arrays

    Science.gov (United States)

    Evans, J.R.; Hamstra, R.H.; Kundig, C.; Camina, P.; Rogers, J.A.

    2005-01-01

    The ability of a strong-motion network to resolve wavefields can be described on three axes: frequency, amplitude, and space. While the need for spatial resolution is apparent, for practical reasons that axis is often neglected. TREMOR is a MEMS-based accelerograph using wireless Internet to minimize lifecycle cost. TREMOR instruments can economically augment traditional ones, residing between them to improve spatial resolution. The TREMOR instrument described here has dynamic range of 96 dB between ??2 g, or 102 dB between ??4 g. It is linear to ???1% of full scale (FS), with a response function effectively shaped electronically. We developed an economical, very low noise, accurate (???1%FS) temperature compensation method. Displacement is easily recovered to 10-cm accuracy at full bandwidth, and better with care. We deployed prototype instruments in Oakland, California, beginning in 1998, with 13 now at mean spacing of ???3 km - one of the most densely instrumented urban centers in the United States. This array is among the quickest in returning (PGA, PGV, Sa) vectors to ShakeMap, ???75 to 100 s. Some 13 events have been recorded. A ShakeMap and an example of spatial variability are shown. Extensive tests of the prototypes for a commercial instrument are described here and in a companion paper. ?? 2005, Earthquake Engineering Research Institute.

  13. Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

    KAUST Repository

    Agrawal, Richa

    2015-05-18

    The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

  14. Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

    KAUST Repository

    Agrawal, Richa; Beidaghi, Majid; Chen, Wei; Wang, Chunlei

    2015-01-01

    The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

  15. MEMS digital parametric loudspeaker

    KAUST Repository

    Carreno, Armando Arpys Arevalo

    2016-03-23

    This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

  16. MEMS digital parametric loudspeaker

    KAUST Repository

    Carreno, Armando Arpys Arevalo; Castro, David; Conchouso Gonzalez, David; Kosel, Jü rgen; Foulds, Ian G.

    2016-01-01

    This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

  17. MEMS Sensor Arrays for Cryogenic Propellant Applications, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — KWJ offers this proposal for a low-power, practical and versatile MEMS sensor platform for NASA applications. The proposed nano-sensor platform is ultra-low power...

  18. Characterisation and Modelling of MEMS Ultrasonic Transducers

    International Nuclear Information System (INIS)

    Teng, M F; Hariz, A J

    2006-01-01

    Silicon ultrasonic transducer micro arrays based on micro-electro-mechanicalsystem (MEMS) technologies are gaining popularity for applications in sonar sensing and excitation. A current challenge for many researchers is modelling the dynamic performance of these and other micro-mechanical devices to ascertain their performance and explain experimental observations reported. In this work, the performance simulation of a MEMS ultrasonic transducer array made from silicon nitride has been successfully carried out using CoventorWare package. The dynamic response of the entire transducer array was characterised, and the results were compared with theoretical predictions. Individual elements were found to vibrate with Bessel-like displacement patterns, and they were resonant at approximately 3 MHz, depending on thickness and lateral dimensions. The frequency shows a linear dependence around the common thickness of 2 μm. Peak displacement levels were examined as a function of frequency, DC bias voltage, and AC drive voltage. Accounting for fabrication variations, and uniformity variations across the wafer, the full array showed minimal variations in peak out-of-plane displacement levels across the device, and isolated elements that were over-responsive and under-responsive. Presently, the effect of observed variations across the array on the performance of the transducers and their radiated fields are being examined

  19. Design, simulation and characterization of a MEMS inertia switch with flexible CNTs/Cu composite array layer between electrodes for prolonging contact time

    International Nuclear Information System (INIS)

    Wang, Yang; Yang, Zhuoqing; Xu, Qiu; Chen, Wenguo; Ding, Guifu; Zhao, Xiaolin

    2015-01-01

    This paper reports an inertia switch with a flexible carbon nanotubes/copper (CNTs/Cu) composite array layer between movable and fixed electrodes, which achieves a longer contact time compared to the traditional design using rigid-to-rigid impact between electrodes. The CNTs/Cu layer is fabricated using the composite electroplating method, and the whole device is completed by multi-layer metal electroplating based on the micro-electro-mechanical systems (MEMS) process. The dynamic responses of the designed inertia switch and the contact impact between a single CNT and a fixed electrode/another CNT have both been simulated by the ANSYS finite-element-method (FEM). It is shown that the contact time of the designed inertia switch is about 100 µs under the applied 80 g half-sine-shaped acceleration in the sensing direction. Finally, the fabricated MEMS inertia switch with the flexible CNTs/Cu composite array layer between electrodes has been evaluated by a dropping hammer system. The test contact time is about112 µs, which has a good agreement with the simulation and is much longer than that of the traditional design. (paper)

  20. Design, modeling and simulation of MEMS-based silicon Microneedles

    International Nuclear Information System (INIS)

    Amin, F; Ahmed, S

    2013-01-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  1. Design, modeling and simulation of MEMS-based silicon Microneedles

    Science.gov (United States)

    Amin, F.; Ahmed, S.

    2013-06-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  2. Optical MEMS for Earth observation

    Science.gov (United States)

    Liotard, Arnaud; Viard, Thierry; Noell, Wilfried; Zamkotsian, Frédéric; Freire, Marco; Guldimann, Benedikt; Kraft, Stefan

    2017-11-01

    Due to the relatively large number of optical Earth Observation missions at ESA, this area is interesting for new space technology developments. In addition to their compactness, scalability and specific task customization, optical MEMS could generate new functions not available with current technologies and are thus candidates for the design of future space instruments. Most mature components for space applications are the digital mirror arrays, the micro-deformable mirrors, the programmable micro diffraction gratings and tiltable micromirrors. A first selection of market-pull and techno-push concepts is done. In addition, some concepts are coming from outside Earth Observation. Finally two concepts are more deeply analyzed. The first concept is a programmable slit for straylight control for space spectro-imagers. This instrument is a push-broom spectroimager for which some images cannot be exploited because of bright sources in the field-of-view. The proposed concept consists in replacing the current entrance spectrometer slit by an active row of micro-mirrors. The MEMS will permit to dynamically remove the bright sources and then to obtain a field-of-view with an optically enhanced signal-to-noise ratio. The second concept is a push-broom imager for which the acquired spectrum can be tuned by optical MEMS. This system is composed of two diffractive elements and a digital mirror array. The first diffractive element spreads the spectrum. A micromirror array is set at the location of the spectral focal plane. By putting the micro-mirrors ON or OFF, we can select parts of field-of-view or spectrum. The second diffractive element then recombines the light on a push-broom detector. Dichroics filters, strip filter, band-pass filter could be replaced by a unique instrument.

  3. Numerical Analysis of CNC Milling Chatter Using Embedded Miniature MEMS Microphone Array System

    Directory of Open Access Journals (Sweden)

    Pang-Li Wang

    2018-01-01

    Full Text Available With the increasingly common use of industrial automation for mass production, there are many computer numerical control (CNC machine tools that require the collection of data from intelligent sensors in order to analyze their processing quality. In general, for high speed rotating machines, an accelerometer can be attached on the spindle to collect the data from the detected vibration of the CNC. However, due to their cost, accelerometers have not been widely adopted for use with typical CNC machine tools. This study sought to develop an embedded miniature MEMS microphone array system (Radius 5.25 cm, 8 channels to discover the vibration source of the CNC from spatial phase array processing. The proposed method utilizes voice activity detection (VAD to distinguish between the presence and absence of abnormal noise in the pre-stage, and utilizes the traditional direction of arrival method (DOA via multiple signal classification (MUSIC to isolate the spatial orientation of the noise source in post-processing. In the numerical simulation, the non-interfering noise source location is calibrated in the anechoic chamber, and is tested with real milling processing in the milling machine. As this results in a high background noise level, the vibration sound source is more accurate in the presented energy gradation graphs as compared to the traditional MUSIC method.

  4. 10^3 Segment MEMS Deformable-Mirror Process Development, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Iris AO will extend its proven segmented MEMS deformable mirror architecture to large array sizes required for high-contrast astrophysical imagers. Current...

  5. Micro-electro-mechanical systems (MEMS: Technology for the 21st century

    Directory of Open Access Journals (Sweden)

    Đakov Tatjana A.

    2014-01-01

    Full Text Available Micro-electro-mechanical systems (MEMS are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

  6. Integrated optical MEMS using through-wafer vias and bump-bonding.

    Energy Technology Data Exchange (ETDEWEB)

    McCormick, Frederick Bossert; Frederick, Scott K.

    2008-01-01

    This LDRD began as a three year program to integrate through-wafer vias, micro-mirrors and control electronics with high-voltage capability to yield a 64 by 64 array of individually controllable micro-mirrors on 125 or 250 micron pitch with piston, tip and tilt movement. The effort was a mix of R&D and application. Care was taken to create SUMMiT{trademark} (Sandia's ultraplanar, multilevel MEMS technology) compatible via and mirror processes, and the ultimate goal was to mate this MEMS fabrication product to a complementary metal-oxide semiconductor (CMOS) electronics substrate. Significant progress was made on the via and mirror fabrication and design, the attach process development as well as the electronics high voltage (30 volt) and control designs. After approximately 22 months, the program was ready to proceed with fabrication and integration of the electronics, final mirror array, and through wafer vias to create a high resolution OMEMS array with individual mirror electronic control. At this point, however, mission alignment and budget constraints reduced the last year program funding and redirected the program to help support the through-silicon via work in the Hyper-Temporal Sensors (HTS) Grand Challenge (GC) LDRD. Several months of investigation and discussion with the HTS team resulted in a revised plan for the remaining 10 months of the program. We planned to build a capability in finer-pitched via fabrication on thinned substrates along with metallization schemes and bonding techniques for very large arrays of high density interconnects (up to 2000 x 2000 vias). Through this program, Sandia was able to build capability in several different conductive through wafer via processes using internal and external resources, MEMS mirror design and fabrication, various bonding techniques for arrayed substrates, and arrayed electronics control design with high voltage capability.

  7. Development of micro-electromechanical system (MEMS) cochlear biomodel

    Energy Technology Data Exchange (ETDEWEB)

    Ngelayang, Thailis Bounya Anak; Latif, Rhonira [Faculty of Electronic and Computer Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia)

    2015-05-15

    Human cochlear is undeniably one of the most amazing organs in human body. The functional mechanism is very unique in terms of its ability to convert the sound waves in the form of mechanical vibrations into the electrical nerve impulses. It is known that the normal human auditory system can perceive the audible frequency range between 20 Hz to 20 kHz. Scientists have conducted several researches trying to build the artificial basilar membrane in the human cochlea (cochlear biomodel). Micro-electromechanical system (MEMS) is one of the potential inventions that have the ability to mimic the active behavior of the basilar membrane. In this paper, an array of MEMS bridge beams that are mechanically sensitive to the perceived audible frequency has been proposed. An array of bridge bridge beams with 0.5 µm thickness and length varying from 200 µm to 2000 µm have been designed operate within the audible frequency range. In the bridge beams design, aluminium (Al), copper (Cu), tantalum (Ta) and platinum (Pt) have considered as the material for the bridge beam structure. From the finite element (FE) and lumped element (LE) models of the MEMS bridge beams, platinum has been found to be the best material for the cochlear biomodel design, closely mimicking the basilar membrane.

  8. Development of micro-electromechanical system (MEMS) cochlear biomodel

    International Nuclear Information System (INIS)

    Ngelayang, Thailis Bounya Anak; Latif, Rhonira

    2015-01-01

    Human cochlear is undeniably one of the most amazing organs in human body. The functional mechanism is very unique in terms of its ability to convert the sound waves in the form of mechanical vibrations into the electrical nerve impulses. It is known that the normal human auditory system can perceive the audible frequency range between 20 Hz to 20 kHz. Scientists have conducted several researches trying to build the artificial basilar membrane in the human cochlea (cochlear biomodel). Micro-electromechanical system (MEMS) is one of the potential inventions that have the ability to mimic the active behavior of the basilar membrane. In this paper, an array of MEMS bridge beams that are mechanically sensitive to the perceived audible frequency has been proposed. An array of bridge bridge beams with 0.5 µm thickness and length varying from 200 µm to 2000 µm have been designed operate within the audible frequency range. In the bridge beams design, aluminium (Al), copper (Cu), tantalum (Ta) and platinum (Pt) have considered as the material for the bridge beam structure. From the finite element (FE) and lumped element (LE) models of the MEMS bridge beams, platinum has been found to be the best material for the cochlear biomodel design, closely mimicking the basilar membrane

  9. Crickets as bio-inspiration for MEMS-based flow-sensing

    NARCIS (Netherlands)

    Krijnen, Gijsbertus J.M.; Droogendijk, H.; Dagamseh, A.M.K.; Jaganatharaja, R.K.; Casas, Jerome

    2014-01-01

    MEMS offers exciting possibilities for the fabrication of bio-inspired mechanosensors. Over the last few years, we have been working on cricket- inspired hair-sensor arrays for spatio-temporal flow-field observations (i.e. flow camera) and source localisation. Whereas making flow-sensors as energy

  10. Modeling of MEMS Mirrors Actuated by Phase-Change Mechanism

    Directory of Open Access Journals (Sweden)

    David Torres

    2017-04-01

    Full Text Available Given the multiple applications for micro-electro-mechanical system (MEMS mirror devices, most of the research efforts are focused on improving device performance in terms of tilting angles, speed, and their integration into larger arrays or systems. The modeling of these devices is crucial for enabling a platform, in particular, by allowing for the future control of such devices. In this paper, we present the modeling of a MEMS mirror structure with four actuators driven by the phase-change of a thin film. The complexity of the device structure and the nonlinear behavior of the actuation mechanism allow for a comprehensive study that encompasses simpler electrothermal designs, thus presenting a general approach that can be adapted to most MEMS mirror designs based on this operation principle. The MEMS mirrors presented in this work are actuated by Joule heating and tested using optical techniques. Mechanical and thermal models including both pitch and roll displacements are developed by combining theoretical analysis (using both numerical and analytical tools with experimental data and subsequently verifying with quasi-static and dynamic experiments.

  11. A digital output accelerometer using MEMS-based piezoelectric accelerometers and arrayed CMOS inverters with satellite capacitors

    International Nuclear Information System (INIS)

    Kobayashi, T; Okada, H; Maeda, R; Itoh, T; Masuda, T

    2011-01-01

    The present paper describes the development of a digital output accelerometer composed of microelectromechanical systems (MEMS)-based piezoelectric accelerometers and arrayed complementary metal–oxide–semiconductor (CMOS) inverters accompanied by capacitors. The piezoelectric accelerometers were fabricated from multilayers of Pt/Ti/PZT/Pt/Ti/SiO 2 deposited on silicon-on-insulator (SOI) wafers. The fabricated piezoelectric accelerometers were connected to arrayed CMOS inverters. Each of the CMOS inverters was accompanied by a capacitor with a different capacitance called a 'satellite capacitor'. We have confirmed that the output voltage generated from the piezoelectric accelerometers can vary the output of the CMOS inverters from a high to a low level; the state of the CMOS inverters has turned from the 'off-state' into the 'on-state' when the output voltage of the piezoelectric accelerometers is larger than the threshold voltage of the CMOS inverters. We have also confirmed that the CMOS inverters accompanied by the larger satellite capacitor have become 'on-state' at a lower acceleration. On increasing the acceleration, the number of on-state CMOS inverters has increased. Assuming that the on-state and off-state of CMOS inverters correspond to logic '0' and '1', the present digital output accelerometers have expressed the accelerations of 2.0, 3.0, 5.0, and 5.5 m s −2 as digital outputs of 111, 110, 100, and 000, respectively

  12. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  13. Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

    Science.gov (United States)

    Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.

    1995-01-01

    In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

  14. Biomaterials for MEMS

    CERN Document Server

    Chiao, Mu

    2011-01-01

    This book serves as a guide for practicing engineers, researchers, and students interested in MEMS devices that use biomaterials and biomedical applications. It is also suitable for engineers and researchers interested in MEMS and its applications but who do not have the necessary background in biomaterials.Biomaterials for MEMS highlights important features and issues of biomaterials that have been used in MEMS and biomedical areas. Hence this book is an essential guide for MEMS engineers or researchers who are trained in engineering institutes that do not provide the background or knowledge

  15. MEMS for Tunable Photonic Metamaterial Applications

    Science.gov (United States)

    Stark, Thomas

    Photonic metamaterials are materials whose optical properties are derived from artificially-structured sub-wavelength unit cells, rather than from the bulk properties of the constituent materials. Examples of metamaterials include plasmonic materials, negative index materials, and electromagnetic cloaks. While advances in simulation tools and nanofabrication methods have allowed this field to grow over the past several decades, many challenges still exist. This thesis addresses two of these challenges: fabrication of photonic metamaterials with tunable responses and high-throughput nanofabrication methods for these materials. The design, fabrication, and optical characterization of a microelectromechanical systems (MEMS) tunable plasmonic spectrometer are presented. An array of holes in a gold film, with plasmon resonance in the mid-infrared, is suspended above a gold reflector, forming a Fabry-Perot interferometer of tunable length. The spectra exhibit the convolution of extraordinary optical transmission through the holes and Fabry-Perot resonances. Using MEMS, the interferometer length is modulated from 1.7 mum to 21.67 mum , thereby tuning the free spectral range from about 2900 wavenumbers to 230.7 wavenumbers and shifting the reflection minima and maxima across the infrared. Due to its broad spectral tunability in the fingerprint region of the mid-infrared, this device shows promise as a tunable biological sensing device. To address the issue of high-throughput, high-resolution fabrication of optical metamaterials, atomic calligraphy, a MEMS-based dynamic stencil lithography technique for resist-free fabrication of photonic metamaterials on unconventional substrates, has been developed. The MEMS consists of a moveable stencil, which can be actuated with nanometer precision using electrostatic comb drive actuators. A fabrication method and flip chip method have been developed, enabling evaporation of metals through the device handle for fabrication on an

  16. A Widely-Accessible Distributed MEMS Processing Environment. The MEMS Exchange Program

    Science.gov (United States)

    2012-10-29

    all of these patterns in advance, we made a new cost model, called the Python Code cost model, which utilizes the power of a high level programming ...document entitled “The Beginners Guide to MEMS Processing” on the MEMSNet and MEMS Exchange The MEMS Exchange Program Final Technical Report October 29...from the Government is absolutely necessary. As said The MEMS Exchange Program Final Technical Report October 29, 2012 Page 57 of 58 before

  17. Miniature Bioprocess Array: A Platform for Quantitative Physiology and Bioprocess Optimization

    National Research Council Canada - National Science Library

    Keasling, Jay

    2002-01-01

    .... The miniature bioprocess array is based on an array of 150-microliters wells, each one of which incorporates MEMS for the closed-loop control of cell culture parameters such as temperature, pH, and dissolved oxygen...

  18. MEMS-Based Solid Propellant Rocket Array Thruster

    Science.gov (United States)

    Tanaka, Shuji; Hosokawa, Ryuichiro; Tokudome, Shin-Ichiro; Hori, Keiichi; Saito, Hirobumi; Watanabe, Masashi; Esashi, Masayoshi

    The prototype of a solid propellant rocket array thruster for simple attitude control of a 10 kg class micro-spacecraft was completed and tested. The prototype has 10×10 φ0.8 mm solid propellant micro-rockets arrayed at a pitch of 1.2 mm on a 20×22 mm substrate. To realize such a dense array of micro-rockets, each ignition heater is powered from the backside of the thruster through an electrical feedthrough which passes along a propellant cylinder wall. Boron/potassium nitrate propellant (NAB) is used with/without lead rhodanide/potassium chlorate/nitrocellulose ignition aid (RK). Impulse thrust was measured by a pendulum method in air. Ignition required electric power of at least 3 4 W with RK and 4 6 W without RK. Measured impulse thrusts were from 2×10-5 Ns to 3×10-4 Ns after the calculation of compensation for air dumping.

  19. Design and simulation of MEMS microvalves for silicon photonic biosensor chip

    Science.gov (United States)

    Amemiya, Yoshiteru; Nakashima, Yuuto; Maeda, Jun; Yokoyama, Shin

    2018-04-01

    For the early and easy diagnosis of diseases, we have proposed a silicon photonic biosensor chip with two kinds of MEMS microvalves for a multiple-item detection system. The driving voltage of the vertical type with the circular-plate capacitor structure and that of the lateral type with the comb-shaped electrode are investigated. From mechanical calculations, the driving voltage of the vertical type is estimated to be 30 V and that of the lateral type to be 15 V. The propagation loss at the intersecting waveguides of arrayed ring-resonator biosensors is also estimated. In the case of optimized intersecting waveguides, more than 67% transmittance of TE-mode light is simulated for the series connection of 20 intersecting waveguides. It is confirmed that it is possible to fabricate an 8 × 12 arrayed biosensor chip in an area of 1 × 1.5 mm2 taking the device size of the microvalves into consideration. We have, for the first time, designed a whole system, including sensors and a fluid channel with MEMS microvalves.

  20. FEM correlation and shock analysis of a VNC MEMS mirror segment

    Science.gov (United States)

    Aguayo, Eduardo J.; Lyon, Richard; Helmbrecht, Michael; Khomusi, Sausan

    2014-08-01

    Microelectromechanical systems (MEMS) are becoming more prevalent in today's advanced space technologies. The Visible Nulling Coronagraph (VNC) instrument, being developed at the NASA Goddard Space Flight Center, uses a MEMS Mirror to correct wavefront errors. This MEMS Mirror, the Multiple Mirror Array (MMA), is a key component that will enable the VNC instrument to detect Jupiter and ultimately Earth size exoplanets. Like other MEMS devices, the MMA faces several challenges associated with spaceflight. Therefore, Finite Element Analysis (FEA) is being used to predict the behavior of a single MMA segment under different spaceflight-related environments. Finite Element Analysis results are used to guide the MMA design and ensure its survival during launch and mission operations. A Finite Element Model (FEM) has been developed of the MMA using COMSOL. This model has been correlated to static loading on test specimens. The correlation was performed in several steps—simple beam models were correlated initially, followed by increasingly complex and higher fidelity models of the MMA mirror segment. Subsequently, the model has been used to predict the dynamic behavior and stresses of the MMA segment in a representative spaceflight mechanical shock environment. The results of the correlation and the stresses associated with a shock event are presented herein.

  1. A capacitive CMOS-MEMS sensor designed by multi-physics simulation for integrated CMOS-MEMS technology

    Science.gov (United States)

    Konishi, Toshifumi; Yamane, Daisuke; Matsushima, Takaaki; Masu, Kazuya; Machida, Katsuyuki; Toshiyoshi, Hiroshi

    2014-01-01

    This paper reports the design and evaluation results of a capacitive CMOS-MEMS sensor that consists of the proposed sensor circuit and a capacitive MEMS device implemented on the circuit. To design a capacitive CMOS-MEMS sensor, a multi-physics simulation of the electromechanical behavior of both the MEMS structure and the sensing LSI was carried out simultaneously. In order to verify the validity of the design, we applied the capacitive CMOS-MEMS sensor to a MEMS accelerometer implemented by the post-CMOS process onto a 0.35-µm CMOS circuit. The experimental results of the CMOS-MEMS accelerometer exhibited good agreement with the simulation results within the input acceleration range between 0.5 and 6 G (1 G = 9.8 m/s2), corresponding to the output voltages between 908.6 and 915.4 mV, respectively. Therefore, we have confirmed that our capacitive CMOS-MEMS sensor and the multi-physics simulation will be beneficial method to realize integrated CMOS-MEMS technology.

  2. EDITORIAL: International MEMS Conference 2006

    Science.gov (United States)

    Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian

    2006-04-01

    The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can

  3. Piezoelectric MEMS: Ferroelectric thin films for MEMS applications

    Science.gov (United States)

    Kanno, Isaku

    2018-04-01

    In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.

  4. Converting MEMS technology into profits

    Science.gov (United States)

    Bryzek, Janusz

    1998-08-01

    This paper discusses issues related to transitioning a company from the advanced technology development phase (with a particular focus on MEMS) to a profitable business, with emphasis on start-up companies. It includes several case studies from (primarily) NovaSensor MEMS development history. These case studies illustrate strategic problems with which advanced MEMS technology developers have to be concerned. Conclusions from these case studies could be used as checkpoints for future MEMS developers to increase probability of profitable operations. The objective for this paper is to share the author's experience from multiple MEMS start-ups to accelerate development of the MEMS market by focusing state- of-the-art technologists on marketing issues.

  5. Measurement of the Earth tides with a MEMS gravimeter.

    Science.gov (United States)

    Middlemiss, R P; Samarelli, A; Paul, D J; Hough, J; Rowan, S; Hammond, G D

    2016-03-31

    The ability to measure tiny variations in the local gravitational acceleration allows, besides other applications, the detection of hidden hydrocarbon reserves, magma build-up before volcanic eruptions, and subterranean tunnels. Several technologies are available that achieve the sensitivities required for such applications (tens of microgal per hertz(1/2)): free-fall gravimeters, spring-based gravimeters, superconducting gravimeters, and atom interferometers. All of these devices can observe the Earth tides: the elastic deformation of the Earth's crust as a result of tidal forces. This is a universally predictable gravitational signal that requires both high sensitivity and high stability over timescales of several days to measure. All present gravimeters, however, have limitations of high cost (more than 100,000 US dollars) and high mass (more than 8 kilograms). Here we present a microelectromechanical system (MEMS) device with a sensitivity of 40 microgal per hertz(1/2) only a few cubic centimetres in size. We use it to measure the Earth tides, revealing the long-term stability of our instrument compared to any other MEMS device. MEMS accelerometers--found in most smart phones--can be mass-produced remarkably cheaply, but none are stable enough to be called a gravimeter. Our device has thus made the transition from accelerometer to gravimeter. The small size and low cost of this MEMS gravimeter suggests many applications in gravity mapping. For example, it could be mounted on a drone instead of low-flying aircraft for distributed land surveying and exploration, deployed to monitor volcanoes, or built into multi-pixel density-contrast imaging arrays.

  6. Glassy carbon MEMS for novel origami-styled 3D integrated intracortical and epicortical neural probes

    Science.gov (United States)

    Goshi, Noah; Castagnola, Elisa; Vomero, Maria; Gueli, Calogero; Cea, Claudia; Zucchini, Elena; Bjanes, David; Maggiolini, Emma; Moritz, Chet; Kassegne, Sam; Ricci, Davide; Fadiga, Luciano

    2018-06-01

    We report on a novel technology for microfabricating 3D origami-styled micro electro-mechanical systems (MEMS) structures with glassy carbon (GC) features and a supporting polymer substrate. GC MEMS devices that open to form 3D microstructures are microfabricated from GC patterns that are made through pyrolysis of polymer precursors on high-temperature resisting substrates like silicon or quartz and then transferring the patterned devices to a flexible substrate like polyimide followed by deposition of an insulation layer. The devices on flexible substrate are then folded into 3D form in an origami-fashion. These 3D MEMS devices have tunable mechanical properties that are achieved by selectively varying the thickness of the polymeric substrate and insulation layers at any desired location. This technology opens new possibilities by enabling microfabrication of a variety of 3D GC MEMS structures suited to applications ranging from biochemical sensing to implantable microelectrode arrays. As a demonstration of the technology, a neural signal recording microelectrode array platform that integrates both surface (cortical) and depth (intracortical) GC microelectrodes onto a single flexible thin-film device is introduced. When the device is unfurled, a pre-shaped shank of polyimide automatically comes off the substrate and forms the penetrating part of the device in a 3D fashion. With the advantage of being highly reproducible and batch-fabricated, the device introduced here allows for simultaneous recording of electrophysiological signals from both the brain surface (electrocorticography—ECoG) and depth (single neuron). Our device, therefore, has the potential to elucidate the roles of underlying neurons on the different components of µECoG signals. For in vivo validation of the design capabilities, the recording sites are coated with a poly(3,4-ethylenedioxythiophene)—polystyrene sulfonate—carbon nanotube composite, to improve the electrical conductivity of the

  7. Encapsulated thermopile detector array for IR microspectrometer

    NARCIS (Netherlands)

    Wu, H.; Emadi, A.; De Graaf, G.; Wolffenbuttel, R.F.

    2010-01-01

    The miniaturized IR spectrometer discussed in this paper is comprised of: slit, planar imaging diffraction grating and Thermo-Electric (TE) detector array, which is fabricated using CMOS compatible MEMS technology. The resolving power is maximized by spacing the TE elements at an as narrow as

  8. MEMS for automotive and aerospace applications

    CERN Document Server

    Kraft, Michael

    2013-01-01

    MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for

  9. Staging of RF-accelerating Units in a MEMS-based Ion Accelerator

    Science.gov (United States)

    Persaud, A.; Seidl, P. A.; Ji, Q.; Feinberg, E.; Waldron, W. L.; Schenkel, T.; Ardanuc, S.; Vinayakumar, K. B.; Lal, A.

    Multiple Electrostatic Quadrupole Array Linear Accelerators (MEQALACs) provide an opportunity to realize compact radio- frequency (RF) accelerator structures that can deliver very high beam currents. MEQALACs have been previously realized with acceleration gap distances and beam aperture sizes of the order of centimeters. Through advances in Micro-Electro-Mechanical Systems (MEMS) fabrication, MEQALACs can now be scaled down to the sub-millimeter regime and batch processed on wafer substrates. In this paper we show first results from using three RF stages in a compact MEMS-based ion accelerator. The results presented show proof-of-concept with accelerator structures formed from printed circuit boards using a 3 × 3 beamlet arrangement and noble gas ions at 10 keV. We present a simple model to describe the measured results. We also discuss some of the scaling behaviour of a compact MEQALAC. The MEMS-based approach enables a low-cost, highly versatile accelerator covering a wide range of currents (10 μA to 100 mA) and beam energies (100 keV to several MeV). Applications include ion-beam analysis, mass spectrometry, materials processing, and at very high beam powers, plasma heating.

  10. Resonant frequency of the silicon micro-structure of MEMS vector hydrophone in fluid-structure interaction

    Directory of Open Access Journals (Sweden)

    Guojun Zhang

    2015-04-01

    Full Text Available The MEMS vector hydrophone developed by the North University of China has advantages of high Signal to Noise Ratio, ease of array integration, etc. However, the resonance frequency of the MEMS device in the liquid is different from that in the air due to the fluid-structure interaction (FSI. Based on the theory of Fluid-Solid Coupling, a generalized distributed mass attached on the micro-structure has been found, which results in the resonance frequency of the microstructure in the liquid being lower than that in the air. Then, an FSI simulation was conducted by ANSYS software. Finally, the hydrophone was measured by using a shaking table and a vector hydrophone calibration system respectively. Results show that, due to the FSI, the resonance frequency of the MEMS devices of the bionic vector hydrophone in the liquid declines approximately 30% compared to the case in the air.

  11. Microelectromechanical Switches for Phased Array Antennas

    Science.gov (United States)

    Ponchak, George E.; Simons, Rainee N.; Scardelletti, Maximillian; Varaljay, Nicholas C.

    2000-01-01

    Preliminary results are presented on the fabrication and testing of a MicroElectro-Mechanical (MEM) microstrip series switch. This switch is being developed for use in a K-band phased array antenna that NASA will use for communication links in its Earth orbiting satellites. Preliminary insertion loss and isolation measurements are presented.

  12. Design of micro, flexible light-emitting diode arrays and fabrication of flexible electrodes

    International Nuclear Information System (INIS)

    Gao, Dan; Wang, Weibiao; Liang, Zhongzhu; Liang, Jingqiu; Qin, Yuxin; Lv, Jinguang

    2016-01-01

    In this study, we design micro, flexible light-emitting diode (LED) array devices. Using theoretical calculations and finite element simulations, we analyze the deformation of the conventional single electrode bar. Through structure optimization, we obtain a three-dimensional (3D), chain-shaped electrode structure, which has a greater bending degree. The optimized electrodes not only have a bigger bend but can also be made to spin. When the supporting body is made of polydimethylsiloxane (PDMS), the maximum bending degree of the micro, flexible LED arrays (4  ×  1 arrays) was approximately 230 µ m; this was obtained using the finite element method. The device (4  ×  1 arrays) can stretch to 15%. This paper describes the fabrication of micro, flexible LED arrays using microelectromechancial (MEMS) technology combined with electroplating technology. Specifically, the isolated grooves are made by dry etching which can isolate and protect the light-emitting units. A combination of MEMS technology and wet etching is used to fabricate the large size spacing. (paper)

  13. Measurement of Deformations by MEMS Arrays, Verified at Sub-millimetre Level Using Robotic Total Stations

    Directory of Open Access Journals (Sweden)

    Tomas Beran

    2014-06-01

    Full Text Available Measurement of sub-millimetre-level deformations of structures in the presence of ambienttemperature changes can be challenging. This paper describes the measurement of astructure moving due to temperature changes, using two ShapeAccelArray (SAAinstruments, and verified by a geodetic monitoring system. SAA is a geotechnicalinstrument often used for monitoring of displacements in soil. SAA uses micro-electro-mechanical system (MEMS sensors to measure tilt in the gravity field. The geodeticmonitoring system, which uses ALERT software, senses the displacements of targetsrelative to control points, using a robotic total station (RTS. The test setup consists of acentral four-metre free-standing steel tube with other steel tubes welded to most of itslength. The central tube is anchored in a concrete foundation. This composite “pole” isequipped with two SAAs as well as three geodetic prisms mounted on the top, in the middle,and in the foundation. The geodetic system uses multiple control targets mounted inconcrete foundations of nearby buildings, and at the base of the pole. Long-termobservations using two SAAs indicate that the pole is subject to deformations due to cyclicalambient temperature variations causing the pole to move by a few millimetres each day. Ina multiple-day experiment, it was possible to track this movement using SAA as well as theRTS system. This paper presents data comparing the measurements of the two instrumentsand provides a good example of the detection of two-dimensional movements of seeminglyrigid objects due to temperature changes.

  14. MEMS Reliability Assurance Activities at JPL

    Science.gov (United States)

    Kayali, S.; Lawton, R.; Stark, B.

    2000-01-01

    An overview of Microelectromechanical Systems (MEMS) reliability assurance and qualification activities at JPL is presented along with the a discussion of characterization of MEMS structures implemented on single crystal silicon, polycrystalline silicon, CMOS, and LIGA processes. Additionally, common failure modes and mechanisms affecting MEMS structures, including radiation effects, are discussed. Common reliability and qualification practices contained in the MEMS Reliability Assurance Guideline are also presented.

  15. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  16. Optical inspection of hidden MEMS structures

    Science.gov (United States)

    Krauter, Johann; Gronle, Marc; Osten, Wolfgang

    2017-06-01

    Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

  17. MEMS cost analysis from laboratory to industry

    CERN Document Server

    Freng, Ron Lawes

    2016-01-01

    The World of MEMS; Chapter 2: Basic Fabrication Processes; Chapter 3: Surface Microengineering. High Aspect Ratio Microengineering; Chapter 5: MEMS Testing; Chapter 6: MEMS Packaging. Clean Rooms, Buildings and Plant; Chapter 8: The MEMSCOST Spreadsheet; Chapter 9: Product Costs - Accelerometers. Product Costs - Microphones. MEMS Foundries. Financial Reporting and Analysis. Conclusions.

  18. Modeling nonlinearities in MEMS oscillators.

    Science.gov (United States)

    Agrawal, Deepak K; Woodhouse, Jim; Seshia, Ashwin A

    2013-08-01

    We present a mathematical model of a microelectromechanical system (MEMS) oscillator that integrates the nonlinearities of the MEMS resonator and the oscillator circuitry in a single numerical modeling environment. This is achieved by transforming the conventional nonlinear mechanical model into the electrical domain while simultaneously considering the prominent nonlinearities of the resonator. The proposed nonlinear electrical model is validated by comparing the simulated amplitude-frequency response with measurements on an open-loop electrically addressed flexural silicon MEMS resonator driven to large motional amplitudes. Next, the essential nonlinearities in the oscillator circuit are investigated and a mathematical model of a MEMS oscillator is proposed that integrates the nonlinearities of the resonator. The concept is illustrated for MEMS transimpedance-amplifier- based square-wave and sine-wave oscillators. Closed-form expressions of steady-state output power and output frequency are derived for both oscillator models and compared with experimental and simulation results, with a good match in the predicted trends in all three cases.

  19. Micro electromechanical systems (MEMS) for mechanical engineers

    Energy Technology Data Exchange (ETDEWEB)

    Lee, A. P., LLNL

    1996-11-18

    The ongoing advances in Microelectromechanical Systems (MEMS) are providing man-kind the freedom to travel to dimensional spaces never before conceivable. Advances include new fabrication processes, new materials, tailored modeling tools, new fabrication machines, systems integration, and more detailed studies of physics and surface chemistry as applied to the micro scale. In the ten years since its inauguration, MEMS technology is penetrating industries of automobile, healthcare, biotechnology, sports/entertainment, measurement systems, data storage, photonics/optics, computer, aerospace, precision instruments/robotics, and environment monitoring. It is projected that by the turn of the century, MEMS will impact every individual in the industrial world, totaling sales up to $14 billion (source: System Planning Corp.). MEMS programs in major universities have spawned up all over the United States, preparing the brain-power and expertise for the next wave of MEMS breakthroughs. It should be pointed out that although MEMS has been initiated by electrical engineering researchers through the involvement of IC fabrication techniques, today it has evolved such that it requires a totally multi-disciplinary team to develop useful devices. Mechanical engineers are especially crucial to the success of MEMS development, since 90% of the physical realm involved is mechanical. Mechanical engineers are needed for the design of MEMS, the analysis of the mechanical system, the design of testing apparatus, the implementation of analytical tools, and the packaging process. Every single aspect of mechanical engineering is being utilized in the MEMS field today, however, the impact could be more substantial if more mechanical engineers are involved in the systems level designing. In this paper, an attempt is made to create the pathways for a mechanical engineer to enter in the MEMS field. Examples of application in optics and medical devices will be used to illustrate how mechanical

  20. European MEMS foundries

    Science.gov (United States)

    Salomon, Patric R.

    2003-01-01

    According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.

  1. MEMS-based Circuits and Systems for Wireless Communication

    CERN Document Server

    Kaiser, Andreas

    2013-01-01

    MEMS-based Circuits and Systems for Wireless Communication provides comprehensive coverage of RF-MEMS technology from device to system level. This edited volume places emphasis on how system performance for radio frequency applications can be leveraged by Micro-Electro-Mechanical Systems (MEMS). Coverage also extends to innovative MEMS-aware radio architectures that push the potential of MEMS technology further ahead.  This work presents a broad overview of the technology from MEMS devices (mainly BAW and Si MEMS resonators) to basic circuits, such as oscillators and filters, and finally complete systems such as ultra-low-power MEMS-based radios. Contributions from leading experts around the world are organized in three parts. Part I introduces RF-MEMS technology, devices and modeling and includes a prospective outlook on ongoing developments towards Nano-Electro-Mechanical Systems (NEMS) and phononic crystals. Device properties and models are presented in a circuit oriented perspective. Part II focusses on ...

  2. MEMS linear and nonlinear statics and dynamics

    CERN Document Server

    Younis, Mohammad I

    2011-01-01

    MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of nume

  3. Surface chemistry and tribology of MEMS.

    Science.gov (United States)

    Maboudian, Roya; Carraro, Carlo

    2004-01-01

    The microscopic length scale and high surface-to-volume ratio, characteristic of microelectro-mechanical systems (MEMS), dictate that surface properties are of paramount importance. This review deals with the effects of surface chemical treatments on tribological properties (adhesion, friction, and wear) of MEMS devices. After a brief review of materials and processes that are utilized in MEMS technology, the relevant tribological and chemical issues are discussed. Various MEMS microinstruments are discussed, which are commonly employed to perform adhesion, friction, and wear measurements. The effects of different surface treatments on the reported tribological properties are discussed.

  4. Design of Surface micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2001-01-01

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMS, most have used comb-drive actuation methods and bulk micromachining processes. This research focuses on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  5. Design of Surface Micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2002-12-31

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMs, most have used comb-drive actuation methods and bulk micromachining processes. This research focused on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  6. The Electrostatic Actuated Next Generation Microshutter Arrays

    Data.gov (United States)

    National Aeronautics and Space Administration — The field of view required for future missions is much larger than James Webb Space Telescope (JWST). We need to use electrostatic actuation to replace magnetic...

  7. Development, characterization and application of compact spectrometers based on MEMS with in-plane capacitive drives

    Science.gov (United States)

    Kenda, A.; Kraft, M.; Tortschanoff, A.; Scherf, Werner; Sandner, T.; Schenk, Harald; Luettjohann, Stephan; Simon, A.

    2014-05-01

    With a trend towards the use of spectroscopic systems in various fields of science and industry, there is an increasing demand for compact spectrometers. For UV/VIS to the shortwave near-infrared spectral range, compact hand-held polychromator type devices are widely used and have replaced larger conventional instruments in many applications. Still, for longer wavelengths this type of compact spectrometers is lacking suitable and affordable detector arrays. In perennial development Carinthian Tech Research AG together with the Fraunhofer Institute for Photonic Microsystems endeavor to close this gap by developing spectrometer systems based on photonic MEMS. Here, we review on two different spectrometer developments, a scanning grating spectrometer working in the NIR and a FT-spectrometer accessing the mid-IR range up to 14 μm. Both systems are using photonic MEMS devices actuated by in-plane comb drive structures. This principle allows for high mechanical amplitudes at low driving voltages but results in gratings respectively mirrors oscillating harmonically. Both systems feature special MEMS structures as well as aspects in terms of system integration which shall tease out the best possible overall performance on the basis of this technology. However, the advantages of MEMS as enabling technology for high scanning speed, miniaturization, energy efficiency, etc. are pointed out. Whereas the scanning grating spectrometer has already evolved to a product for the point of sale analysis of traditional Chinese medicine products, the purpose of the FT-spectrometer as presented is to demonstrate what is achievable in terms of performance. Current developments topics address MEMS packaging issues towards long term stability, further miniaturization and usability.

  8. Electrostatic MEMS devices with high reliability

    Science.gov (United States)

    Goldsmith, Charles L; Auciello, Orlando H; Sumant, Anirudha V; Mancini, Derrick C; Gudeman, Chris; Sampath, Suresh; Carlilse, John A; Carpick, Robert W; Hwang, James

    2015-02-24

    The present invention provides for an electrostatic microelectromechanical (MEMS) device comprising a dielectric layer separating a first conductor and a second conductor. The first conductor is moveable towards the second conductor, when a voltage is applied to the MEMS device. The dielectric layer recovers from dielectric charging failure almost immediately upon removal of the voltage from the MEMS device.

  9. Integrated design of MEMS

    DEFF Research Database (Denmark)

    De Grave, Arnaud; Brissaud, Daniel

    2007-01-01

    Emerging technologies of Micro-Electromechanical Systems (MEMS) are applications such as airbag accelerometers. Micro-products present many physical differences from macro-products. Moreover, there is a high level of integration in multiple fields of physics with strongly coupled effects...... industrial immersion to propose a socio-technological description of the design process and MEMS design tools....

  10. Piezoelectric MEMS resonators

    CERN Document Server

    Piazza, Gianluca

    2017-01-01

    This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associate...

  11. Adhesion aspects in MEMS/NEMS

    CERN Document Server

    Kim, Seong H; Mittal, Kash L

    2012-01-01

    Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface

  12. Practical guide to RF-MEMS

    CERN Document Server

    Iannacci, Jacopo

    2013-01-01

    Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical

  13. A six degrees of freedom mems manipulator

    NARCIS (Netherlands)

    de Jong, B.R.

    2006-01-01

    This thesis reports about a six degrees of freedom (DOF) precision manipulator in MEMS, concerning concept generation for the manipulator followed by design and fabrication (of parts) of the proposed manipulation concept in MEMS. Researching the abilities of 6 DOF precision manipulation in MEMS is

  14. Flexible MEMS: A novel technology to fabricate flexible sensors and electronics

    Science.gov (United States)

    Tu, Hongen

    This dissertation presents the design and fabrication techniques used to fabricate flexible MEMS (Micro Electro Mechanical Systems) devices. MEMS devices and CMOS(Complementary Metal-Oxide-Semiconductor) circuits are traditionally fabricated on rigid substrates with inorganic semiconductor materials such as Silicon. However, it is highly desirable that functional elements like sensors, actuators or micro fluidic components to be fabricated on flexible substrates for a wide variety of applications. Due to the fact that flexible substrate is temperature sensitive, typically only low temperature materials, such as polymers, metals, and organic semiconductor materials, can be directly fabricated on flexible substrates. A novel technology based on XeF2(xenon difluoride) isotropic silicon etching and parylene conformal coating, which is able to monolithically incorporate high temperature materials and fluidic channels, was developed at Wayne State University. The technology was first implemented in the development of out-of-plane parylene microneedle arrays that can be individually addressed by integrated flexible micro-channels. These devices enable the delivery of chemicals with controlled temporal and spatial patterns and allow us to study neurotransmitter-based retinal prosthesis. The technology was further explored by adopting the conventional SOI-CMOS processes. High performance and high density CMOS circuits can be first fabricated on SOI wafers, and then be integrated into flexible substrates. Flexible p-channel MOSFETs (Metal-Oxide-Semiconductor Field-Effect-Transistors) were successfully integrated and tested. Integration of pressure sensors and flow sensors based on single crystal silicon has also been demonstrated. A novel smart yarn technology that enables the invisible integration of sensors and electronics into fabrics has been developed. The most significant advantage of this technology is its post-MEMS and post-CMOS compatibility. Various high

  15. Miniaturized GPS/MEMS IMU integrated board

    Science.gov (United States)

    Lin, Ching-Fang (Inventor)

    2012-01-01

    This invention documents the efforts on the research and development of a miniaturized GPS/MEMS IMU integrated navigation system. A miniaturized GPS/MEMS IMU integrated navigation system is presented; Laser Dynamic Range Imager (LDRI) based alignment algorithm for space applications is discussed. Two navigation cameras are also included to measure the range and range rate which can be integrated into the GPS/MEMS IMU system to enhance the navigation solution.

  16. Going Fabless with MEMS

    Directory of Open Access Journals (Sweden)

    Bhaskar CHOUBEY

    2011-04-01

    Full Text Available The Microelectromechanical sensors are finding increasing applications in everyday life. However, each MEMS sensor is generally fabricated on its own individual process. This leads to high cost per sensor. It has been suggested the MEMS should and would follow the path of integrated circuits industry, wherein fabless firms could concentrate on design leading pure-foundries to perfect the manufacturing process. With several designs being manufactured on the same process, the installation cost of fabrication would be evenly shared. Simultaneously, multiple project wafer runs are being offered for MEMS processes to encourage design activity in universities as well as startups. This paper reviews the present state of this transition through an experience of designing and manufacturing microelectromechanical resonators on different processes.

  17. Structured synthesis of MEMS using evolutionary approaches

    DEFF Research Database (Denmark)

    Fan, Zhun; Wang, Jiachuan; Achiche, Sofiane

    2008-01-01

    In this paper, we discuss the hierarchy that is involved in a typical MEMS design and how evolutionary approaches can be used to automate the hierarchical synthesis process for MEMS. The paper first introduces the flow of a structured MEMS design process and emphasizes that system-level lumped...

  18. Topology optimized RF MEMS switches

    DEFF Research Database (Denmark)

    Philippine, M. A.; Zareie, H.; Sigmund, Ole

    2013-01-01

    Topology optimization is a rigorous and powerful method that should become a standard MEMS design tool - it can produce unique and non-intuitive designs that meet complex objectives and can dramatically improve the performance and reliability of MEMS devices. We present successful uses of topology...

  19. MEMS reliability: coming of age

    Science.gov (United States)

    Douglass, Michael R.

    2008-02-01

    In today's high-volume semiconductor world, one could easily take reliability for granted. As the MOEMS/MEMS industry continues to establish itself as a viable alternative to conventional manufacturing in the macro world, reliability can be of high concern. Currently, there are several emerging market opportunities in which MOEMS/MEMS is gaining a foothold. Markets such as mobile media, consumer electronics, biomedical devices, and homeland security are all showing great interest in microfabricated products. At the same time, these markets are among the most demanding when it comes to reliability assurance. To be successful, each company developing a MOEMS/MEMS device must consider reliability on an equal footing with cost, performance and manufacturability. What can this maturing industry learn from the successful development of DLP technology, air bag accelerometers and inkjet printheads? This paper discusses some basic reliability principles which any MOEMS/MEMS device development must use. Examples from the commercially successful and highly reliable Digital Micromirror Device complement the discussion.

  20. Electromagnetic actuation in MEMS switches

    DEFF Research Database (Denmark)

    Oliveira Hansen, Roana Melina de; Mátéfi-Tempfli, Mária; Chemnitz, Steffen

    . Electromagnetic actuation is a very promising approach to operate such MEMS and Power MEMS devices, due to the long range, reproducible and strong forces generated by this method, among other advantages. However, the use of electromagnetic actuation in such devices requires the use of thick magnetic films, which...

  1. Optimization and simulation of MEMS rectilinear ion trap

    Directory of Open Access Journals (Sweden)

    Huang Gang

    2015-04-01

    Full Text Available In this paper, the design of a MEMS rectilinear ion trap was optimized under simulated conditions. The size range of the MEMS rectilinear ion trap’s electrodes studied in this paper is measured at micron scale. SIMION software was used to simulate the MEMS rectilinear ion trap with different sizes and different radio-frequency signals. The ion-trapping efficiencies of the ion trap under these different simulation conditions were obtained. The ion-trapping efficiencies were compared to determine the performance of the MEMS rectilinear ion trap in different conditions and to find the optimum conditions. The simulation results show that for the ion trap at micron scale or smaller, the optimized length–width ratio was 0.8, and a higher frequency of radio-frequency signal is necessary to obtain a higher ion-trapping efficiency. These results have a guiding role in the process of developing MEMS rectilinear ion traps, and great application prospects in the research fields of the MEMS rectilinear ion trap and the MEMS mass spectrometer.

  2. A Vibration-Based MEMS Piezoelectric Energy Harvester and Power Conditioning Circuit

    Directory of Open Access Journals (Sweden)

    Hua Yu

    2014-02-01

    Full Text Available This paper presents a micro-electro-mechanical system (MEMS piezoelectric power generator array for vibration energy harvesting. A complete design flow of the vibration-based energy harvester using the finite element method (FEM is proposed. The modal analysis is selected to calculate the resonant frequency of the harvester, and harmonic analysis is performed to investigate the influence of the geometric parameters on the output voltage. Based on simulation results, a MEMS Pb(Zr,TiO3 (PZT cantilever array with an integrated large Si proof mass is designed and fabricated to improve output voltage and power. Test results show that the fabricated generator, with five cantilever beams (with unit dimensions of about 3 × 2.4 × 0.05 mm3 and an individual integrated Si mass dimension of about 8 × 12.4 × 0.5 mm3, produces a output power of 66.75 μW, or a power density of 5.19 μW∙mm−3∙g−2 with an optimal resistive load of 220 kΩ from 5 m/s2 vibration acceleration at its resonant frequency of 234.5 Hz. In view of high internal impedance characteristic of the PZT generator, an efficient autonomous power conditioning circuit, with the function of impedance matching, energy storage and voltage regulation, is then presented, finding that the efficiency of the energy storage is greatly improved and up to 64.95%. The proposed self-supplied energy generator with power conditioning circuit could provide a very promising complete power supply solution for wireless sensor node loads.

  3. A vibration-based MEMS piezoelectric energy harvester and power conditioning circuit.

    Science.gov (United States)

    Yu, Hua; Zhou, Jielin; Deng, Licheng; Wen, Zhiyu

    2014-02-19

    This paper presents a micro-electro-mechanical system (MEMS) piezoelectric power generator array for vibration energy harvesting. A complete design flow of the vibration-based energy harvester using the finite element method (FEM) is proposed. The modal analysis is selected to calculate the resonant frequency of the harvester, and harmonic analysis is performed to investigate the influence of the geometric parameters on the output voltage. Based on simulation results, a MEMS Pb(Zr,Ti)O3 (PZT) cantilever array with an integrated large Si proof mass is designed and fabricated to improve output voltage and power. Test results show that the fabricated generator, with five cantilever beams (with unit dimensions of about 3 × 2.4 × 0.05 mm3) and an individual integrated Si mass dimension of about 8 × 12.4 × 0.5 mm3, produces a output power of 66.75 μW, or a power density of 5.19 μW∙mm-3∙g-2 with an optimal resistive load of 220 kΩ from 5 m/s2 vibration acceleration at its resonant frequency of 234.5 Hz. In view of high internal impedance characteristic of the PZT generator, an efficient autonomous power conditioning circuit, with the function of impedance matching, energy storage and voltage regulation, is then presented, finding that the efficiency of the energy storage is greatly improved and up to 64.95%. The proposed self-supplied energy generator with power conditioning circuit could provide a very promising complete power supply solution for wireless sensor node loads.

  4. MEMS device for mass market gas and chemical sensors

    Science.gov (United States)

    Kinkade, Brian R.; Daly, James T.; Johnson, Edward A.

    2000-08-01

    in the house. Internet grocery delivery services could check for spoiled foods in their clients' refrigerators. City emissions regulators could monitor the various emissions sources throughout the area from their desk to predict how many pollution vouchers they will need to trade in the next week. We describe a new component architecture for mass-market sensors based on silicon microelectromechanical systems (MEMS) technology. MEMS are micrometer-scale devices that can be fabricated as discrete devices or large arrays, using the technology of integrated circuit manufacturing. These new photonic bandgap and MEMS fabricataion technologies will simplify the component technology to provide high-quality gas and chemical sensors at consumer prices.

  5. Using MEMS Capacitive Switches in Tunable RF Amplifiers

    Directory of Open Access Journals (Sweden)

    Danson John

    2006-01-01

    Full Text Available A MEMS capacitive switch suitable for use in tunable RF amplifiers is described. A MEMS switch is designed, fabricated, and characterized with physical and RF measurements for inclusion in simulations. Using the MEMS switch models, a dual-band low-noise amplifier (LNA operating at GHz and GHz, and a tunable power amplifier (PA at GHz are simulated in m CMOS. MEMS switches allow the LNA to operate with 11 dB of isolation between the two bands while maintaining dB of gain and sub- dB noise figure. MEMS switches are used to implement a variable matching network that allows the PA to realize up to 37% PAE improvement at low input powers.

  6. MEMS-based transmission lines for microwave applications

    Science.gov (United States)

    Wu, Qun; Fu, Jiahui; Gu, Xuemai; Shi, Huajuan; Lee, Jongchul

    2003-04-01

    This paper mainly presents a briefly review for recent progress in MEMS-based transmission lines for use in microwave and millimeterwave range. MEMS-based transmission lines including different transmission line structure such as membrane-supported microstrip line microstrip line, coplanar microshield transmission line, LIGA micromachined planar transmission line, micromachined waveguides and coplanar waveguide are discussed. MEMS-based transmission lines are characterized by low propagation loss, wide operation frequency band, low dispersion and high quality factor, in addition, the fabrication is compatible with traditional processing of integrated circuits (IC"s). The emergence of MEMS-based transmission lines provided a solution for miniaturizing microwave system and monolithic microwave integrated circuits.

  7. MEMS/MOEMS foundry services at INO

    Science.gov (United States)

    García-Blanco, Sonia; Ilias, Samir; Williamson, Fraser; Généreux, Francis; Le Noc, Loïc; Poirier, Michel; Proulx, Christian; Tremblay, Bruno; Provençal, Francis; Desroches, Yan; Caron, Jean-Sol; Larouche, Carl; Beaupré, Patrick; Fortin, Benoit; Topart, Patrice; Picard, Francis; Alain, Christine; Pope, Timothy; Jerominek, Hubert

    2010-06-01

    In the MEMS manufacturing world, the "fabless" model is getting increasing importance in recent years as a way for MEMS manufactures and startups to minimize equipment costs and initial capital investment. In order for this model to be successful, the fabless company needs to work closely with a MEMS foundry service provider. Due to the lack of standardization in MEMS processes, as opposed to CMOS microfabrication, the experience in MEMS development processes and the flexibility of the MEMS foundry are of vital importance. A multidisciplinary team together with a complete microfabrication toolset allows INO to offer unique MEMS foundry services to fabless companies looking for low to mid-volume production. Companies that benefit from their own microfabrication facilities can also be interested in INO's assistance in conducting their research and development work during periods where production runs keep their whole staff busy. Services include design, prototyping, fabrication, packaging, and testing of various MEMS and MOEMS devices on wafers fully compatible with CMOS integration. Wafer diameters ranging typically from 1 inch to 6 inches can be accepted while 8-inch wafers can be processed in some instances. Standard microfabrication techniques such as metal, dielectric, and semiconductor film deposition and etching as well as photolithographic pattern transfer are available. A stepper permits reduction of the critical dimension to around 0.4 μm. Metals deposited by vacuum deposition methods include Au, Ag, Al, Al alloys, Ti, Cr, Cu, Mo, MoCr, Ni, Pt, and V with thickness varying from 5 nm to 2 μm. Electroplating of several materials including Ni, Au and In is also available. In addition, INO has developed and built a gold black deposition facility to answer customer's needs for broadband microbolometric detectors. The gold black deposited presents specular reflectance of less than 10% in the wavelength range from 0.2 μm to 100 μm with thickness ranging from

  8. Liquid Metal Droplet and Micro Corrugated Diaphragm RF-MEMS for reconfigurable RF filters

    Science.gov (United States)

    Irshad, Wasim

    Widely Tunable RF Filters that are small, cost-effective and offer ultra low power consumption are extremely desirable. Indeed, such filters would allow drastic simplification of RF front-ends in countless applications from cell phones to satellites in space by replacing switched-array of static acoustic filters and YIG filters respectively. Switched array of acoustic filters are de facto means of channel selection in mobile applications such as cell phones. SAW and BAW filters satisfy most criteria needed by mobile applications such as low cost, size and power consumption. However, the trade-off is a significant loss of 3-4 dB in modern cell phone RF front-end. This leads to need for power-hungry amplifiers and short battery life. It is a necessary trade-off since there are no better alternatives. These devices are in mm scale and consume mW. YIG filters dominate applications where size or power is not a constraint but demand excellent RF performance like low loss and high tuning ratio. These devices are measured in inches and require several watts to operate. Clearly, a tunable RF filter technology that would combine the cost, size and power consumption benefits of acoustic filters with excellent RF performance of YIG filters would be extremely desirable and imminently useful. The objective of this dissertation is to develop such a technology based upon RF-MEMS Evanescent-mode cavity filter. Two highly novel RF-MEMS devices have been developed over the course of this PhD to address the unique MEMS needs of this technology. The first part of the dissertation is dedicated to introducing the fundamental concepts of tunable cavity resonators and filters. This includes the physics behind it, key performance metrics and what they depend on and requirements of the MEMS tuners. Initial gap control and MEMS attachment method are identified as potential hurdles towards achieving very high RF performance. Simple and elegant solutions to both these issues are discussed in

  9. Advanced mechatronics and MEMS devices II

    CERN Document Server

    Wei, Bin

    2017-01-01

    This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intel...

  10. RF MEMS: status of the industry and roadmaps

    Science.gov (United States)

    Bouchaud, Jeremie; Wicht, Henning

    2005-01-01

    Microsystems for Radio Frequency applications, known as RF MEMS, have entered the commercialization phase in 2003. Bulk Acoustic Wave filters are already produced in series and first commercial samples of switches are available. On the other hand, reliability and packaging problems are still a major hurdle especially for switches and tunable capacitors. Will RF MEMS hold their promise to be one of the future major businesses for MEMS? The presentation will give an overview on RF MEMS applications and market players. WTC will highlight technical challenges that still have to be solved to open mass markets such as mobile telephony and WLAN. WTC will also present applications of RF MEMS and opportunities in niche markets with high added value like military and space applications. WTC will provide a regional analysis and compare R&D focus and public funding situation in North America, Europe and Asia. Finally, WTC will present an updated product roadmap market forecast for RF MEMS devices for the 2004-2008 time period.

  11. The Micronium-A Musical MEMS instrument

    NARCIS (Netherlands)

    Engelen, Johannes Bernardus Charles; de Boer, Hans L.; de Boer, Hylco; Beekman, Jethro G.; Fortgens, Laurens C.; de Graaf, Derk B.; Vocke, Sander; Abelmann, Leon

    The Micronium is a musical instrument fabricated from silicon using microelectromechanical system (MEMS) technology. It is—to the best of our knowledge—the first musical micro-instrument fabricated using MEMS technology, where the actual sound is generated by mechanical microstructures. The

  12. Fabrication of polymeric nano-batteries array using anodic aluminum oxide templates.

    Science.gov (United States)

    Zhao, Qiang; Cui, Xiaoli; Chen, Ling; Liu, Ling; Sun, Zhenkun; Jiang, Zhiyu

    2009-02-01

    Rechargeable nano-batteries were fabricated in the array pores of anodic aluminum oxide (AAO) template, combining template method and electrochemical method. The battery consisted of electropolymerized PPy electrode, porous TiO2 separator, and chemically polymerized PAn electrode was fabricated in the array pores of two-step anodizing aluminum oxide (AAO) membrane, based on three-step assembling method. It performs typical electrochemical battery behavior with good charge-discharge ability, and presents a capacity of 25 nAs. AFM results show the hexagonal array of nano-batteries' top side. The nano-battery may be a promising device for the development of Micro-Electro-Mechanical Systems (MEMS), and Nano-Electro-Mechanical Systems (NEMS).

  13. Using MEMS Capacitive Switches in Tunable RF Amplifiers

    OpenAIRE

    Danson John; Plett Calvin; Tait Niall

    2006-01-01

    A MEMS capacitive switch suitable for use in tunable RF amplifiers is described. A MEMS switch is designed, fabricated, and characterized with physical and RF measurements for inclusion in simulations. Using the MEMS switch models, a dual-band low-noise amplifier (LNA) operating at GHz and GHz, and a tunable power amplifier (PA) at GHz are simulated in m CMOS. MEMS switches allow the LNA to operate with 11 dB of isolation between the two bands while maintaining dB of gain and sub- dB no...

  14. A MEMS-based, wireless, biometric-like security system

    Science.gov (United States)

    Cross, Joshua D.; Schneiter, John L.; Leiby, Grant A.; McCarter, Steven; Smith, Jeremiah; Budka, Thomas P.

    2010-04-01

    We present a system for secure identification applications that is based upon biometric-like MEMS chips. The MEMS chips have unique frequency signatures resulting from fabrication process variations. The MEMS chips possess something analogous to a "voiceprint". The chips are vacuum encapsulated, rugged, and suitable for low-cost, highvolume mass production. Furthermore, the fabrication process is fully integrated with standard CMOS fabrication methods. One is able to operate the MEMS-based identification system similarly to a conventional RFID system: the reader (essentially a custom network analyzer) detects the power reflected across a frequency spectrum from a MEMS chip in its vicinity. We demonstrate prototype "tags" - MEMS chips placed on a credit card-like substrate - to show how the system could be used in standard identification or authentication applications. We have integrated power scavenging to provide DC bias for the MEMS chips through the use of a 915 MHz source in the reader and a RF-DC conversion circuit on the tag. The system enables a high level of protection against typical RFID hacking attacks. There is no need for signal encryption, so back-end infrastructure is minimal. We believe this system would make a viable low-cost, high-security system for a variety of identification and authentication applications.

  15. A MEMS platform for in situ, real-time monitoring of electrochemically induced mechanical changes in lithium-ion battery electrodes

    International Nuclear Information System (INIS)

    Pomerantseva, Ekaterina; Jung, Hyun; Gnerlich, Markus; Baron, Sergio; Gerasopoulos, Konstantinos; Ghodssi, Reza

    2013-01-01

    We report the first successful demonstration of an optical microelectromechanical systems (MEMS) sensing platform for the in situ characterization of electrochemically induced reversible mechanical changes in lithium-ion battery (LIB) electrodes. The platform consists of an array of flexible membranes with a reflective surface on one side and a thin-film LIB electrode on the other side. The membranes deflect due to the active battery material volume change caused by lithium intercalation (expansion) and extraction (contraction). This deflection is monitored using the Fabry–Perot optical interferometry principle. The active material volume change causes high internal stresses and mechanical degradation of the electrodes. The stress evolution observed in a silicon thin-film electrode incorporated into this MEMS platform follows a ‘first elastic, then plastic’ deformation scheme. Understanding of the internal stresses in battery electrodes during discharge/charge is important for improving the reliability and cycle lifetime of LIBs. The developed MEMS platform presents a new method for in situ diagnostics of thin-film LIB electrodes to aid the development of new materials, optimization of electrode performance, and prevention of battery failure. (paper)

  16. A review of vibration-based MEMS piezoelectric energy harvesters

    Energy Technology Data Exchange (ETDEWEB)

    Saadon, Salem; Sidek, Othman [Collaborative Microelectronic Design Excellence Center (CEDEC), School of Electrical and Electronic Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang (Malaysia)

    2011-01-15

    The simplicity associated with the piezoelectric micro-generators makes it very attractive for MEMS applications, especially for remote systems. In this paper we reviewed the work carried out by researchers during the last three years. The improvements in experimental results obtained in the vibration-based MEMS piezoelectric energy harvesters show very good scope for MEMS piezoelectric harvesters in the field of power MEMS in the near future. (author)

  17. System-Level Modelling and Simulation of MEMS-Based Sensors

    DEFF Research Database (Denmark)

    Virk, Kashif M.; Madsen, Jan; Shafique, Mohammad

    2005-01-01

    The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration with the......The growing complexity of MEMS devices and their increased used in embedded systems (e.g., wireless integrated sensor networks) demands a disciplined aproach for MEMS design as well as the development of techniques for system-level modeling of these devices so that a seamless integration...... with the existing embedded system design methodologies is possible. In this paper, we present a MEMS design methodology that uses VHDL-AMS based system-level model of a MEMS device as a starting point and combines the top-down and bottom-up design approaches for design, verification, and optimization...

  18. ESPRIT And Uniform Linear Arrays

    Science.gov (United States)

    Roy, R. H.; Goldburg, M.; Ottersten, B. E.; Swindlehurst, A. L.; Viberg, M.; Kailath, T.

    1989-11-01

    Abstract ¬â€?ESPRIT is a recently developed and patented technique for high-resolution estimation of signal parameters. It exploits an invariance structure designed into the sensor array to achieve a reduction in computational requirements of many orders of magnitude over previous techniques such as MUSIC, Burg's MEM, and Capon's ML, and in addition achieves performance improvement as measured by parameter estimate error variance. It is also manifestly more robust with respect to sensor errors (e.g. gain, phase, and location errors) than other methods as well. Whereas ESPRIT only requires that the sensor array possess a single invariance best visualized by considering two identical but other-wise arbitrary arrays of sensors displaced (but not rotated) with respect to each other, many arrays currently in use in various applications are uniform linear arrays of identical sensor elements. Phased array radars are commonplace in high-resolution direction finding systems, and uniform tapped delay lines (i.e., constant rate A/D converters) are the rule rather than the exception in digital signal processing systems. Such arrays possess many invariances, and are amenable to other types of analysis, which is one of the main reasons such structures are so prevalent. Recent developments in high-resolution algorithms of the signal/noise subspace genre including total least squares (TLS) ESPRIT applied to uniform linear arrays are summarized. ESPRIT is also shown to be a generalization of the root-MUSIC algorithm (applicable only to the case of uniform linear arrays of omni-directional sensors and unimodular cisoids). Comparisons with various estimator bounds, including CramerRao bounds, are presented.

  19. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  20. MEMS-Based Waste Vibrational Energy Harvesters

    Science.gov (United States)

    2013-06-01

    MEMS energy- harvesting device. Although PZT is used more prevalently due to its higher piezoelectric coefficient and dielectric constant, AlN has...7 1. Lead Zirconium Titanate ( PZT ) .........................................................7 2. Aluminum...Laboratory PiezoMUMPS Piezoelectric Multi-User MEMS Processes PZT Lead Zirconate Titanate SEM Scanning Electron Microscopy SiO2 Silicon

  1. Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

    Directory of Open Access Journals (Sweden)

    Di Chen

    2007-05-01

    Full Text Available Electrostatic micro-electro-mechanical system (MEMS is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.

  2. Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program

    Energy Technology Data Exchange (ETDEWEB)

    Schriner, H.; Davies, B.; Sniegowski, J.; Rodgers, M.S.; Allen, J.; Shepard, C.

    1998-05-01

    Research and development in the design and manufacture of Microelectromechanical Systems (MEMS) is growing at an enormous rate. Advances in MEMS design tools and fabrication processes at Sandia National Laboratories` Microelectronics Development Laboratory (MDL) have broadened the scope of MEMS applications that can be designed and manufactured for both military and commercial use. As improvements in micromachining fabrication technologies continue to be made, MEMS designs can become more complex, thus opening the door to an even broader set of MEMS applications. In an effort to further research and development in MEMS design, fabrication, and application, Sandia National Laboratories has launched the Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program or SAMPLES program. The SAMPLES program offers potential partners interested in MEMS the opportunity to prototype an idea and produce hardware that can be used to sell a concept. The SAMPLES program provides education and training on Sandia`s design tools, analysis tools and fabrication process. New designers can participate in the SAMPLES program and design MEMS devices using Sandia`s design and analysis tools. As part of the SAMPLES program, participants` designs are fabricated using Sandia`s 4 level polycrystalline silicon surface micromachine technology fabrication process known as SUMMiT (Sandia Ultra-planar, Multi-level MEMS Technology). Furthermore, SAMPLES participants can also opt to obtain state of the art, post-fabrication services provided at Sandia such as release, packaging, reliability characterization, and failure analysis. This paper discusses the components of the SAMPLES program.

  3. A Nuclear Microbattery for MEMS Devices

    International Nuclear Information System (INIS)

    Blanchard, James; Henderson, Douglass; Lal, Amit

    2002-01-01

    This project was designed to demonstrate the feasibility of producing on-board power for MEMS devices using radioisotopes. MEMS is a fast growing field, with hopes for producing a wide variety of revolutionary applications, including ''labs on a chip,'' micromachined scanning tunneling microscopes, microscopic detectors for biological agents, microsystems for DNA identification, etc. Currently, these applications are limited by the lack of an on-board power source. Research is ongoing to study approaches such as fuel cells, fossil fuels, and chemical batteries, but all these concepts have limitations. For long-lived, high energy density applications, on-board radioisotope power offers the best choice. We have succeeded in producing such devices using a variety of isotopes, incorporation methods, and device geometries. These experiments have demonstrated the feasibility of using radioisotope power and that there are a variety of options available for MEMS designers. As an example of an integrated, self-powered application, we have created an oscillating cantilever beam that is capable of consistent, periodic oscillations over very long time periods without the need for refueling. Ongoing work will demonstrate that this cantilever is capable of radio frequency transmission, allowing MEMS devices to communicate with one another wirelessly. Thus, this will be the first self-powered wireless transmitter available for use in MEMS devices, permitting such applications as sensors embedded in buildings for continuous monitoring of the building performance and integrity

  4. Advantages of PZT thick film for MEMS sensors

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Lou-Moller, R.; Hansen, K.

    2010-01-01

    For all MEMS devices a high coupling between the mechanical and electrical domain is desired. Figures of merit describing the coupling are important for comparing different piezoelectric materials. The existing figures of merit are discussed and a new figure of merit is introduced for a fair comp....... Improved figure of merit is reached in the piezoelectric PZT thick film, TF2100CIP, by using cold isostatic pressure in the PZT preparation process. The porosity of TF2100 is decreased 38%, hence, allowing an increase of charge sensitivity for MEMS sensors of 59%....... thin film and PZT thick film. It is shown that MEMS sensors with the PZT thick film TF2100 from InSensor A/S have potential for significant higher voltage sensitivities compared to PZT thin film base MEMS sensors when the total thickness of the MEMS cantilever, beam, bridge or membrane is high...

  5. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    Science.gov (United States)

    Harney, Kieran P.

    2005-01-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  6. Investigating ESD sensitivity in electrostatic SiGe MEMS

    International Nuclear Information System (INIS)

    Sangameswaran, Sandeep; De Coster, Jeroen; Linten, Dimitri; Scholz, Mirko; Thijs, Steven; Groeseneken, Guido; De Wolf, Ingrid

    2010-01-01

    The sensitivity of electrostatically actuated SiGe microelectromechanical systems to electrostatic discharge events has been investigated in this paper. Torsional micromirrors and RF microelectromechanical systems (MEMS) actuators have been used as two case studies to perform this study. On-wafer electrostatic discharge (ESD) measurement methods, such as the human body model (HBM) and machine model (MM), are discussed. The impact of HBM ESD zap tests on the functionality and behavior of MEMS is explained and the ESD failure levels of MEMS have been verified by failure analysis. It is demonstrated that electrostatic MEMS devices have a high sensitivity to ESD and that it is essential to protect them.

  7. Digital reflection holography based systems development for MEMS testing

    Science.gov (United States)

    Singh, Vijay Raj; Liansheng, Sui; Asundi, Anand

    2010-05-01

    MEMS are tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers and nanometers. Testing of MEMS device is an important part in carrying out their functional assessment and reliability analysis. Development of systems based on digital holography (DH) for MEMS inspection and characterization is presented in this paper. Two DH reflection systems, table-top and handheld types, are developed depending on the MEMS measurement requirements and their capabilities are presented. The methodologies for the systems are developed for 3D profile inspection and static & dynamic measurements, which is further integrated with in-house developed software that provides the measurement results in near real time. The applications of the developed systems are demonstrated for different MEMS devices for 3D profile inspection, static deformation/deflection measurements and vibration analysis. The developed systems are well suitable for the testing of MEMS and Microsystems samples, with full-field, static & dynamic inspection as well as to monitor micro-fabrication process.

  8. MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

    Energy Technology Data Exchange (ETDEWEB)

    TANNER,DANELLE M.; SMITH,NORMAN F.; IRWIN,LLOYD W.; EATON,WILLIAM P.; HELGESEN,KAREN SUE; CLEMENT,J. JOSEPH; MILLER,WILLIAM M.; MILLER,SAMUEL L.; DUGGER,MICHAEL T.; WALRAVEN,JEREMY A.; PETERSON,KENNETH A.

    2000-01-01

    The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

  9. A novel piezoresistive polymer nanocomposite MEMS accelerometer

    International Nuclear Information System (INIS)

    Seena, V; Hari, K; Prajakta, S; Ramgopal Rao, V; Pratap, Rudra

    2017-01-01

    A novel polymer MEMS (micro electro mechanical systems) accelerometer with photo-patternable polymer nanocomposite as a piezoresistor is presented in this work. Polymer MEMS Accelerometer with beam thicknesses of 3.3 µ m and embedded nanocomposite piezoresistive layer having a gauge factor of 90 were fabricated. The photosensitive nanocomposite samples were prepared and characterized for analyzing the mechanical and electrical properties and thereby ensuring proper process parameters for incorporating the piezoresistive layer into the polymer MEMS accelerometer. The microfabrication process flow and unit processes followed are extremely low cost with process temperatures below 100 °C. This also opens up a new possibility for easy integration of such polymer MEMS with CMOS (complementary metal oxide semiconductor) devices and circuits. The fabricated devices were characterized using laser Doppler vibrometer (LDV) and the devices exhibited a resonant frequency of 10.8 kHz and a response sensitivity of 280 nm g −1 at resonance. The main focus of this paper is on the SU-8/CB nanocomposite piezoresistive MEMS accelerometer technology development which covers the material and the fabrication aspects of these devices. CoventorWare FEA analysis performed using the extracted material properties from the experimental characterization which are in close agreement to performance parameters of the fabricated devices is also discussed. The simulated piezoresistive polymer MEMS devices showed an acceleration sensitivity of 126 nm g −1 and 82 ppm of Δ R / R per 1 g of acceleration. (paper)

  10. Poly-SiGe for MEMS-above-CMOS sensors

    CERN Document Server

    Gonzalez Ruiz, Pilar; Witvrouw, Ann

    2014-01-01

    Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence o...

  11. High Volume Manufacturing and Field Stability of MEMS Products

    Science.gov (United States)

    Martin, Jack

    Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are

  12. Amorphous Diamond MEMS and Sensors

    Energy Technology Data Exchange (ETDEWEB)

    SULLIVAN, JOHN P.; FRIEDMANN, THOMAS A.; ASHBY, CAROL I.; DE BOER, MAARTEN P.; SCHUBERT, W. KENT; SHUL, RANDY J.; HOHLFELDER, ROBERT J.; LAVAN, D.A.

    2002-06-01

    This report describes a new microsystems technology for the creation of microsensors and microelectromechanical systems (MEMS) using stress-free amorphous diamond (aD) films. Stress-free aD is a new material that has mechanical properties close to that of crystalline diamond, and the material is particularly promising for the development of high sensitivity microsensors and rugged and reliable MEMS. Some of the unique properties of aD include the ability to easily tailor film stress from compressive to slightly tensile, hardness and stiffness 80-90% that of crystalline diamond, very high wear resistance, a hydrophobic surface, extreme chemical inertness, chemical compatibility with silicon, controllable electrical conductivity from insulating to conducting, and biocompatibility. A variety of MEMS structures were fabricated from this material and evaluated. These structures included electrostatically-actuated comb drives, micro-tensile test structures, singly- and doubly-clamped beams, and friction and wear test structures. It was found that surface micromachined MEMS could be fabricated in this material easily and that the hydrophobic surface of the film enabled the release of structures without the need for special drying procedures or the use of applied hydrophobic coatings. Measurements using these structures revealed that aD has a Young's modulus of {approx}650 GPa, a tensile fracture strength of 8 GPa, and a fracture toughness of 8 MPa{center_dot}m {sup 1/2}. These results suggest that this material may be suitable in applications where stiction or wear is an issue. Flexural plate wave (FPW) microsensors were also fabricated from aD. These devices use membranes of aD as thin as {approx}100 nm. The performance of the aD FPW sensors was evaluated for the detection of volatile organic compounds using ethyl cellulose as the sensor coating. For comparable membrane thicknesses, the aD sensors showed better performance than silicon nitride based sensors. Greater

  13. MEMS tunable grating micro-spectrometer

    Science.gov (United States)

    Tormen, Maurizio; Lockhart, R.; Niedermann, P.; Overstolz, T.; Hoogerwerf, A.; Mayor, J.-M.; Pierer, J.; Bosshard, C.; Ischer, R.; Voirin, G.; Stanley, R. P.

    2017-11-01

    The interest in MEMS based Micro-Spectrometers is increasing due to their potential in terms of flexibility as well as cost, low mass, small volume and power savings. This interest, especially in the Near-Infrared and Mid- Infrared, ranges from planetary exploration missions to astronomy, e.g. the search for extra solar planets, as well as to many other terrestrial fields of application such as, industrial quality and surface control, chemical analysis of soil and water, detection of chemical pollutants, exhausted gas analysis, food quality control, process control in pharmaceuticals, to name a few. A compact MEMS-based Spectrometer for Near- Infrared and Mid-InfraRed operation have been conceived, designed and demonstrated. The design based on tunable MEMS blazed grating, developed in the past at CSEM [1], achieves state of the art results in terms of spectral resolution, operational wavelength range, light throughput, overall dimensions, and power consumption.

  14. Design of a Class of Antennas Utilizing MEMS, EBG and Septum Polarizers including Near-field Coupling Analysis

    Science.gov (United States)

    Kim, Ilkyu

    Recent developments in mobile communications have led to an increased appearance of short-range communications and high data-rate signal transmission. New technologies provides the need for an accurate near-field coupling analysis and novel antenna designs. An ability to effectively estimate the coupling within the near-field region is required to realize short-range communications. Currently, two common techniques that are applicable to the near-field coupling problem are 1) integral form of coupling formula and 2) generalized Friis formula. These formulas are investigated with an emphasis on straightforward calculation and accuracy for various distances between the two antennas. The coupling formulas are computed for a variety of antennas, and several antenna configurations are evaluated through full-wave simulation and indoor measurement in order to validate these techniques. In addition, this research aims to design multi-functional and high performance antennas based on MEMS (Microelectromechanical Systems) switches, EBG (Electromagnetic Bandgap) structures, and septum polarizers. A MEMS switch is incorporated into a slot loaded patch antenna to attain frequency reconfigurability. The resonant frequency of the patch antenna can be shifted using the MEM switch, which is actuated by the integrated bias networks. Furthermore, a high gain base-station antenna utilizing beam-tilting is designed to maximize gain for tilted beam applications. To realize this base-station antenna, an array of four dipole-EBG elements is constructed to implement a fixed down-tilt main beam with application in base station arrays. An improvement of the operating range with the EBG-dipole array is evaluated using a simple linkbudget analysis. The septum polarizer has been widely used in circularly polarized antenna systems due to its simple and compact design and high quality of circularity. In this research, the sigmoid function is used to smoothen the edge in the septum design, which

  15. Fabrication of Quench Condensed Thin Films Using an Integrated MEMS Fab on a Chip

    Science.gov (United States)

    Lally, Richard; Reeves, Jeremy; Stark, Thomas; Barrett, Lawrence; Bishop, David

    Atomic calligraphy is a microelectromechanical systems (MEMS)-based dynamic stencil nanolithography technique. Integrating MEMS devices into a bonded stacked array of three die provides a unique platform for conducting quench condensed thin film mesoscopic experiments. The atomic calligraphy Fab on a Chip process incorporates metal film sources, electrostatic comb driven stencil plate, mass sensor, temperature sensor, and target surface into one multi-die assembly. Three separate die are created using the PolyMUMPs process and are flip-chip bonded together. A die containing joule heated sources must be prepared with metal for evaporation prior to assembly. A backside etch of the middle/central die exposes the moveable stencil plate allowing the flux to pass through the stencil from the source die to the target die. The chip assembly is mounted in a cryogenic system at ultra-high vacuum for depositing extremely thin films down to single layers of atoms across targeted electrodes. Experiments such as the effect of thin film alloys or added impurities on their superconductivity can be measured in situ with this process.

  16. Micro-Electromechanical-Systems (MEMS) technologies for aerospace applications in Canada

    International Nuclear Information System (INIS)

    Pimprikar, M.

    2001-01-01

    During the last decade, research and development of Micro-Electro-Mechanical Systems (MEMS) have shown significant promise for a variety of aerospace applications. The advantages of drastic size and weight reduction of MEMS enables consideration of developing low-cost, high-performance, ultra-portable, MEMS-based devices and systems for aircraft, space and defense requirements. 'Microelectromechanical Systems, or MEMS', are integrated microdevices or systems combining electrical and mechanical components, fabricated using integrated circuit compatible batch-processing techniques, and varying in size from micrometers to millimeters. In the 1990's, MEMS were used as laboratory curiosities with very low power, short lifetimes and few concrete applications. One decade later, MEMS have taken major roles in several industries, the total world market is expected to grow from $14 billion to over $40 billion by the year 2002. A typical device contains micromechanical structures that move by flexing (membranes, cantilevers, springs) and MEMS/MOEMS level where the integration of microelectronics, micromechanics and optics form a complete system (sensor, actuator, photonic device). (author)

  17. Evolution of a MEMS Photoacoustic Chemical Sensor

    National Research Council Canada - National Science Library

    Pellegrino, Paul M; Polcawich, Ronald G

    2003-01-01

    .... Initial MEMS work is centered on fabrication of a lead zirconate titanate (PZT) microphone subsystem to be incorporated in the full photoacoustic device. Preliminary results were very positive for the macro-photoacoustic cell, PZT membrane microphones design / fabrication and elementary monolithic MEMS photoacoustic cavity.

  18. Three dimensional MEMS supercapacitors

    Energy Technology Data Exchange (ETDEWEB)

    Sun, Wei

    2011-10-15

    The overall objective of this research is to achieve compact supercapacitors with high capacitance, large power density, and long cycle life for using as micro power sources to drive low power devices and sensors. The main shortcoming of supercapacitors as a power source is that its energy density typically is about 1/10 of that of batteries. To achieve compact supercapacitors of large energy density, supercapacitors must be developed with high capacitance and power density which are mainly depended on the effective surface area of the electrodes of the supercapacitors. Many studies have been done to increase the effective surface area by modifying the electrode materials, however, much less investigations are focus on machining the electrodes. In my thesis work, micro- and nano-technologies are applied as technology approaches for machining the electrodes with three dimensional (3D) microstructures. More specific, Micro-electro-mechanical system (MEMS) fabrication process flow, which integrates the key process such as LIGA-like (German acronym for Lithographie, Galvanoformung, Abformung, which mean Lithography, Electroplating and Molding) technology or DRIE (deep reactive ion etching), has been developed to enable innovative designs of 3D MEMS supercapacitors which own the electrodes of significantly increased geometric area. Two types of 3D MEMS supercapcitors, based on LIGA-like and DRIE technology respectively, were designed and successfully created. The LIGA-like based 3D MEMS supercapacitor is with an interdigital 3D structure, and consists of silicon substrate, two electroplated nickel current collectors, two PPy (poly pyrrole) electrodes, and solid state electrolyte. The fabrication process flow developed includes the flowing key processes, SU-8 lithography, nickel electroplating, PPy polymerization and solid state electrolyte coating. Electrochemical tests showed that the single electrode of the supercapacitor has the specific capacitance of 0.058 F cm-2

  19. Wavelength tunable MEMS VCSELs for OCT imaging

    DEFF Research Database (Denmark)

    Sahoo, Hitesh Kumar; Ansbæk, Thor; Ottaviano, Luisa

    2018-01-01

    MEMS VCSELs are one of the most promising swept source (SS) lasers for optical coherence tomography (OCT) and one of the best candidates for future integration with endoscopes, surgical probes and achieving an integrated OCT system. However, the current MEMS-based SS are processed on the III...

  20. Construction and Initial Validation of the Multiracial Experiences Measure (MEM)

    Science.gov (United States)

    Yoo, Hyung Chol; Jackson, Kelly; Guevarra, Rudy P.; Miller, Matthew J.; Harrington, Blair

    2015-01-01

    This article describes the development and validation of the Multiracial Experiences Measure (MEM): a new measure that assesses uniquely racialized risks and resiliencies experienced by individuals of mixed racial heritage. Across two studies, there was evidence for the validation of the 25-item MEM with 5 subscales including Shifting Expressions, Perceived Racial Ambiguity, Creating Third Space, Multicultural Engagement, and Multiracial Discrimination. The 5-subscale structure of the MEM was supported by a combination of exploratory and confirmatory factor analyses. Evidence of criterion-related validity was partially supported with MEM subscales correlating with measures of racial diversity in one’s social network, color-blind racial attitude, psychological distress, and identity conflict. Evidence of discriminant validity was supported with MEM subscales not correlating with impression management. Implications for future research and suggestions for utilization of the MEM in clinical practice with multiracial adults are discussed. PMID:26460977

  1. Advanced MEMS systems for optical communication and imaging

    International Nuclear Information System (INIS)

    Horenstein, M N; Sumner, R; Freedman, D S; Datta, M; Kani, N; Miller, P; Stewart, J B; Cornelissen, S

    2011-01-01

    Optical communication and adaptive optics have emerged as two important uses of micro-electromechanical (MEMS) devices based on electrostatic actuation. Each application uses a mirror whose surface is altered by applying voltages of up to 300 V. Previous generations of adaptive-optic mirrors were large (∼1 m) and required the use of piezoelectric transducers. Beginning in the mid-1990s, a new class of small MEMS mirrors (∼1 cm) were developed. These mirrors are now a commercially available, mature technology. This paper describes three advanced applications of MEMS mirrors. The first is a mirror used for corona-graphic imaging, whereby an interferometric telescope blocks the direct light from a distant star so that nearby objects such as planets can be seen. We have developed a key component of the system: a 144-channel, fully-scalable, high-voltage multiplexer that reduces power consumption to only a few hundred milliwatts. In a second application, a MEMS mirror comprises part of a two-way optical communication system in which only one node emits a laser beam. The other node is passive, incorporating a retro-reflective, electrostatic MEMS mirror that digitally encodes the reflected beam. In a third application, the short (∼100-ns) pulses of a commercially-available laser rangefinder are returned by the MEMS mirror as a digital data stream. Suitable low-power drive systems comprise part of the system design.

  2. Uncooled infrared focal plane array imaging in China

    Science.gov (United States)

    Lei, Shuyu

    2015-06-01

    This article reviews the development of uncooled infrared focal plane array (UIFPA) imaging in China in the past decade. Sensors based on optical or electrical read-out mechanism were developed but the latter dominates the market. In resistive bolometers, VOx and amorphous silicon are still the two major thermal-sensing materials. The specifications of the IRFPA made by different manufactures were collected and compared. Currently more than five Chinese companies and institutions design and fabricate uncooled infrared focal plane array. Some devices have sensitivity as high as 30 mK; the largest array for commercial products is 640×512 and the smallest pixel size is 17 μm. Emphasis is given on the pixel MEMS design, ROIC design, fabrication, and packaging of the IRFPA manufactured by GWIC, especially on design for high sensitivities, low noise, better uniformity and linearity, better stabilization for whole working temperature range, full-digital design, etc.

  3. Recent Progress in Silicon Mems Oscillators

    Science.gov (United States)

    2008-12-01

    MEMS oscillator. As shown, a MEMS resonator is connected to an IC. The reference oscillator, which is basically a transimpedance amplifier ...small size), and (3) DC bias voltage required to operate the resonators. As a result, instead of Colpitts or Pierce architecture, a transimpedence ... amplifier is typically used for sustain the oscillation. The frequency of the resonators is determined by both material properties and geometry of

  4. MEMS mass-spring-damper systems using an out-of-plane suspension scheme

    KAUST Repository

    Abdel Aziz, Ahmed Kamal Said; Sharaf, Abdel Hameed; Serry, Mohamed Yousef; Sedky, Sherif Salah

    2014-01-01

    MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

  5. MEMS mass-spring-damper systems using an out-of-plane suspension scheme

    KAUST Repository

    Abdel Aziz, Ahmed Kamal Said

    2014-02-04

    MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

  6. New dynamic silicon photonic components enabled by MEMS technology

    Science.gov (United States)

    Errando-Herranz, Carlos; Edinger, Pierre; Colangelo, Marco; Björk, Joel; Ahmed, Samy; Stemme, Göran; Niklaus, Frank; Gylfason, Kristinn B.

    2018-02-01

    Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.

  7. Power Management of MEMS-Based Storage Devices for Mobile Systems

    NARCIS (Netherlands)

    Khatib, M.G.; Hartel, Pieter H.

    2008-01-01

    Because of its small form factor, high capacity, and expected low cost, MEMS-based storage is a suitable storage technology for mobile systems. MEMS-based storage devices should also be energy efficient for deployment in mobile systems. The problem is that MEMS-based storage devices are mechanical,

  8. RF MEMS

    Indian Academy of Sciences (India)

    At the bare die level the insertion loss, return loss and the isolation ... ing and packaging of a silicon on glass based RF MEMS switch fabricated using DRIE. ..... follows the power law based on the asperity deformation model given by Pattona & ... Surface mount style RF packages (SMX series 580465) from Startedge Corp.

  9. RF-MEMS capacitive switches with high reliability

    Science.gov (United States)

    Goldsmith, Charles L.; Auciello, Orlando H.; Carlisle, John A.; Sampath, Suresh; Sumant, Anirudha V.; Carpick, Robert W.; Hwang, James; Mancini, Derrick C.; Gudeman, Chris

    2013-09-03

    A reliable long life RF-MEMS capacitive switch is provided with a dielectric layer comprising a "fast discharge diamond dielectric layer" and enabling rapid switch recovery, dielectric layer charging and discharging that is efficient and effective to enable RF-MEMS switch operation to greater than or equal to 100 billion cycles.

  10. Nanofabrication of Arrays of Silicon Field Emitters with Vertical Silicon Nanowire Current Limiters and Self-Aligned Gates

    Science.gov (United States)

    2016-08-19

    limiters, MEMS, NEMS, field emission, cold cathodes (Some figures may appear in colour only in the online journal) 1. Introduction Dense arrays of silicon... attention has been given to densely packed, highly ordered, top-down fabricated, single crystal vertical silicon nanowire devices that are embedded

  11. Fabrication of integrated metallic MEMS devices

    DEFF Research Database (Denmark)

    Yalcinkaya, Arda Deniz; Ravnkilde, Jan Tue; Hansen, Ole

    2002-01-01

    A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators are characteri......A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators...

  12. Nonlinear Adaptive Filter for MEMS Gyro Error Cancellation

    Data.gov (United States)

    National Aeronautics and Space Administration — Thermal biases are the dominate error in low-cost low-power small MEMS gyros. CubeSats often can't afford the power/mass to put a heater on their MEMS gyros and...

  13. Waveguide-Integrated MEMS Concepts for Tunable Millimeter-Wave Systems

    OpenAIRE

    Baghchehsaraei, Zargham

    2014-01-01

    This thesis presents two families of novel waveguide-integrated components based on millimeter-wave microelectromechanical systems (MEMS) for reconfigurable systems. The first group comprises V-band (50–75 GHz) and W-band (75–110 GHz) waveguide switches and switchable irises, and their application as switchable cavity resonators, and tunable bandpass filters implemented by integration of novel MEMS-reconfigurable surfaces into a rectangular waveguide. The second category comprises MEMS-based ...

  14. A method for manufacturing a hollow mems structure

    DEFF Research Database (Denmark)

    2017-01-01

    The present invention relates to a method for manufacturing an at least partly hollow MEMS structure. In a first step one or more through-going openings is/are provided in core material. The one or more through-going openings is/are then covered by an etch-stop layer. After this step, a bottom...... further comprises the step of creating bottom and top conductors in the respective bottom and top layers. Finally, excess core material is removed in order to create the at least partly hollow MEMS structure which may include a MEMS inductor....

  15. MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics

    Science.gov (United States)

    Marek, Jiri; Gómez, Udo-Martin

    MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving

  16. Fabrication and Analysis of Tapered Tip Silicon Microneedles for MEMS based Drug Delivery System

    Directory of Open Access Journals (Sweden)

    Muhammad Waseem Ashraf

    2010-11-01

    Full Text Available In this paper, a novel design of transdermal drug delivery (TDD system is presented. The proposed system consists of controlled electronic circuit and microelectromechanical system (MEMS based devices like microneedles, micropump, flow sensor, and blood pressure sensor. The aim of this project is to develop a system that can eliminate the limitations associated with oral therapy. In this phase tapered tip silicon microneedles have been fabricated using inductively coupled plasma (ICP etching technology. Using ANSYS, simulation of microneedles has been conducted before the fabrication process to test the design suitability for TDD. More over multifield analysis of reservoir integrated with microneedle array using piezoelectric actuator has also been performed. The effects of frequency and voltage on actuator and fluid flow rate through 6×6 microneedle array have been investigated. This work provides envisage data to design suitable devices for TDD.

  17. Modularly Integrated MEMS Technology

    National Research Council Canada - National Science Library

    Eyoum, Marie-Angie N

    2006-01-01

    Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation...

  18. MEMS for pico- to micro-satellites

    OpenAIRE

    Shea, Herbert

    2009-01-01

    MEMS sensors, actuators, and sub-systems can enable an important reduction in the size and mass of spacecrafts, first by replacing larger and heavier components, then by replacing entire subsystems, and finally by enabling the microfabrication of highly integrated picosats. Very small satellites (1 to 100 kg) stand to benefit the most from MEMS technologies. These small satellites are typically used for science or technology demonstration missions, with higher risk tolerance than multi-ton te...

  19. Sound Source Localization through 8 MEMS Microphones Array Using a Sand-Scorpion-Inspired Spiking Neural Network.

    Science.gov (United States)

    Beck, Christoph; Garreau, Guillaume; Georgiou, Julius

    2016-01-01

    Sand-scorpions and many other arachnids perceive their environment by using their feet to sense ground waves. They are able to determine amplitudes the size of an atom and locate the acoustic stimuli with an accuracy of within 13° based on their neuronal anatomy. We present here a prototype sound source localization system, inspired from this impressive performance. The system presented utilizes custom-built hardware with eight MEMS microphones, one for each foot, to acquire the acoustic scene, and a spiking neural model to localize the sound source. The current implementation shows smaller localization error than those observed in nature.

  20. MEMS Solar Generators

    OpenAIRE

    Grbovic, Dragoslav; Osswald, Sebastian

    2011-01-01

    Approved for public release; distribution is unlimited Using MEMS bimaterial structures to build highly efficient solar energy generators. This is a novel approach that utilizes developments in the area of bimaterial sensors and applies them in the field of solar energy harvesting.

  1. Comparison between low-cost and traditional MEMS accelerometers: a case study from the M7.1 Darfield, New Zealand, aftershock deployment

    Directory of Open Access Journals (Sweden)

    Angela Chung

    2011-06-01

    Full Text Available Recent advances in micro-electro-mechanical systems (MEMS sensing and distributed computing techniques have enabled the development of low-cost, rapidly deployed dense seismic networks. The Quake-Catcher Network (QCN uses triaxial MEMS accelerometers installed in homes and businesses to record moderate to large earthquakes. Real-time accelerations are monitored and information is transferred to a central server using open-source, distributed computing software installed on participating computers. Following the September 3, 2010, Mw 7.1 Darfield, New Zealand, earthquake, 192 QCN stations were installed in a dense array in the city of Christchurch and the surrounding region to record the on-going aftershock sequence. Here, we compare the ground motions recorded by QCN accelerometers with GeoNet strong-motion instruments to verify whether low-cost MEMS accelerometers can provide reliable ground-motion information in network-scale deployments. We find that observed PGA and PGV amplitudes and RMS scatter are comparable between the GeoNet and QCN observations. Closely spaced stations provide similar acceleration, velocity, and displacement time series and computed response spectra are also highly correlated, with correlation coefficients above 0.94.

  2. Uncertainty quantification in capacitive RF MEMS switches

    Science.gov (United States)

    Pax, Benjamin J.

    Development of radio frequency micro electrical-mechanical systems (RF MEMS) has led to novel approaches to implement electrical circuitry. The introduction of capacitive MEMS switches, in particular, has shown promise in low-loss, low-power devices. However, the promise of MEMS switches has not yet been completely realized. RF-MEMS switches are known to fail after only a few months of operation, and nominally similar designs show wide variability in lifetime. Modeling switch operation using nominal or as-designed parameters cannot predict the statistical spread in the number of cycles to failure, and probabilistic methods are necessary. A Bayesian framework for calibration, validation and prediction offers an integrated approach to quantifying the uncertainty in predictions of MEMS switch performance. The objective of this thesis is to use the Bayesian framework to predict the creep-related deflection of the PRISM RF-MEMS switch over several thousand hours of operation. The PRISM switch used in this thesis is the focus of research at Purdue's PRISM center, and is a capacitive contacting RF-MEMS switch. It employs a fixed-fixed nickel membrane which is electrostatically actuated by applying voltage between the membrane and a pull-down electrode. Creep plays a central role in the reliability of this switch. The focus of this thesis is on the creep model, which is calibrated against experimental data measured for a frog-leg varactor fabricated and characterized at Purdue University. Creep plasticity is modeled using plate element theory with electrostatic forces being generated using either parallel plate approximations where appropriate, or solving for the full 3D potential field. For the latter, structure-electrostatics interaction is determined through immersed boundary method. A probabilistic framework using generalized polynomial chaos (gPC) is used to create surrogate models to mitigate the costly full physics simulations, and Bayesian calibration and forward

  3. Cost-effective method of manufacturing a 3D MEMS optical switch

    Science.gov (United States)

    Carr, Emily; Zhang, Ping; Keebaugh, Doug; Chau, Kelvin

    2009-02-01

    growth of data and video transport networks. All-optical switching eliminates the need for optical-electrical conversion offering the ability to switch optical signals transparently: independent of data rates, formats and wavelength. It also provides network operators much needed automation capabilities to create, monitor and protect optical light paths. To further accelerate the market penetration, it is necessary to identify a path to reduce the manufacturing cost significantly as well as enhance the overall system performance, uniformity and reliability. Currently, most MEMS optical switches are assembled through die level flip-chip bonding with either epoxies or solder bumps. This is due to the alignment accuracy requirements of the switch assembly, defect matching of individual die, and cost of the individual components. In this paper, a wafer level assembly approach is reported based on silicon fusion bonding which aims to reduce the packaging time, defect count and cost through volume production. This approach is successfully demonstrated by the integration of two 6-inch wafers: a mirror array wafer and a "snap-guard" wafer, which provides a mechanical structure on top of the micromirror to prevent electrostatic snap-down. The direct silicon-to-silicon bond eliminates the CTEmismatch and stress issues caused by non-silicon bonding agents. Results from a completed integrated switch assembly will be presented, which demonstrates the reliability and uniformity of some key parameters of this MEMS optical switch.

  4. Optical MEMS for earth observation payloads

    Science.gov (United States)

    Rodrigues, B.; Lobb, D. R.; Freire, M.

    2017-11-01

    An ESA study has been taken by Lusospace Ltd and Surrey Satellite Techonoly Ltd (SSTL) into the use of optical Micro Eletro-Mechanical Systems (MEMS) for earth Observation. A review and analysis was undertaken of the Micro-Optical Electro-Mechanical Systems (MOEMS) available in the market with potential application in systems for Earth Observation. A summary of this review will be presented. Following the review two space-instrument design concepts were selected for more detailed analysis. The first was the use of a MEMS device to remove cloud from Earth images. The concept is potentially of interest for any mission using imaging spectrometers. A spectrometer concept was selected and detailed design aspects and benefits evaluated. The second concept developed uses MEMS devices to control the width of entrance slits of spectrometers, to provide variable spectral resolution. This paper will present a summary of the results of the study.

  5. MEMS applications in space exploration

    Science.gov (United States)

    Tang, William C.

    1997-09-01

    Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. MEMS is one of the key enabling technology to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

  6. PolyMEMS Actuator: A Polymer-Based Microelectromechanical (MEMS) Actuator with Macroscopic Action

    Science.gov (United States)

    2002-09-01

    DIRECTOR: MICHAEL L. TALBERT, Maj., USAF Technical Advisor , Information Technology Division Information Directorate...technologies meet even two of the four requirements, whereas PolyMEMS meets all four. Robo -Lobster Courtesy of Dr. Joseph Ayers, Northeastern

  7. MEMS: A new approach to micro-optics

    Energy Technology Data Exchange (ETDEWEB)

    Sniegowski, J.J.

    1997-12-31

    MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlights polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.

  8. [Development of a portable mid-infrared rapid analyzer for oil concentration in water based on MEMS linear sensor array].

    Science.gov (United States)

    Gao, Zhi-fan; Zeng, Li-bo; Shi, Lei; Li, Kai; Yang, Yuan-zhou; Wu, Qiong-shui

    2014-06-01

    Aiming at the existing problems such as weak environmental adaptability, low analytic efficiency and poor measuring repeatability in the traditional spectral oil analyzers, the present paper designed a portable mid-infrared rapid analyzer for oil concentration in water. To reduce the volume of the instrument, the non-symmetrical folding M-type Czerny-Turner optical structure was adopted in the core optical path. With a periodically rotating chopper, controlled by digital PID algorithm, applied for infrared light modulation, the modulating accuracy reached ±0.5%. Different from traditional grating-scanning spectrophotometers, this instrument used a fixed grating for light dispersion and avoided rotating error in the course of the measuring procedures. A new-type MEMS infrared linear sensor array was applied for modulated spectral signals detection, which improved the measuring efficiency remarkably. Optical simulation and experimental results indicate that the spectral range is 2 800 - 3 200 cm(-1), the spectral resolution is 6 cm(-1) (@3 130 cm(-1)), and the signal to noise ratio is up to 5 200 : 1. The acquisition time is 13 milliseconds per spectrogram, and the standard deviation of absorbance is less than 3 x 10(-3). These performances meet the standards of oil concentration measurements perfectly. Compared with traditional infrared spectral analyzers for oil concentration, the instrument demonstrated in this paper has many advantages such as smaller size, more efficiency, higher precision, and stronger vibration & moisture isolation. In addition, the proposed instrument is especially suitable for the environmental monitoring departments to implement real-time measurements in the field for oil concentration in water, hence it has broad prospects of application in the field of water quality monitoring.

  9. An absorptive single-pole four-throw switch using multiple-contact MEMS switches and its application to a monolithic millimeter-wave beam-forming network

    International Nuclear Information System (INIS)

    Lee, Sanghyo; Kim, Jong-Man; Kim, Yong-Kweon; Kwon, Youngwoo

    2009-01-01

    In this paper, a new absorptive single-pole four-throw (SP4T) switch based on multiple-contact switching is proposed and integrated with a Butler matrix to demonstrate a monolithic beam-forming network at millimeter waves (mm waves). In order to simplify the switching driving circuit and reduce the number of unit switches in an absorptive SP4T switch, the individual switches were replaced with long-span multiple-contact switches using stress-free single-crystalline-silicon MEMS technology. This approach improves the mechanical stability as well as the manufacturing yield, thereby allowing successful integration into a monolithic beam former. The fabricated absorptive SP4T MEMS switch shows insertion loss less than 1.3 dB, return losses better than 11 dB at 30 GHz and wideband isolation performance higher than 39 dB from 20 to 40 GHz. The absorptive SP4T MEMS switch is integrated with a 4 × 4 Butler matrix on a single chip to implement a monolithic beam-forming network, directing beam into four distinct angles. Array factors from the measured data show that the proposed absorptive SPnT MEMS switch can be effectively used for high-performance mm-wave beam-switching systems. This work corresponds to the first demonstration of a monolithic beam-forming network using switched beams

  10. Nano-tribology and materials in MEMS

    CERN Document Server

    Satyanarayana, N; Lim, Seh

    2013-01-01

    This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.

  11. Review of Automated Design and Optimization of MEMS

    DEFF Research Database (Denmark)

    Achiche, Sofiane; Fan, Zhun; Bolognini, Francesca

    2007-01-01

    carried out. This paper presents a review of these techniques. The design task of MEMS is usually divided into four main stages: System Level, Device Level, Physical Level and the Process Level. The state of the art o automated MEMS design in each of these levels is investigated....

  12. MEMS Micro-Valve for Space Applications

    Science.gov (United States)

    Chakraborty, I.; Tang, W. C.; Bame, D. P.; Tang, T. K.

    1998-01-01

    We report on the development of a Micro-ElectroMechanical Systems (MEMS) valve that is designed to meet the rigorous performance requirements for a variety of space applications, such as micropropulsion, in-situ chemical analysis of other planets, or micro-fluidics experiments in micro-gravity. These systems often require very small yet reliable silicon valves with extremely low leak rates and long shelf lives. Also, they must survive the perils of space travel, which include unstoppable radiation, monumental shock and vibration forces, as well as extreme variations in temperature. Currently, no commercial MEMS valve meets these requirements. We at JPL are developing a piezoelectric MEMS valve that attempts to address the unique problem of space. We begin with proven configurations that may seem familiar. However, we have implemented some major design innovations that should produce a superior valve. The JPL micro-valve is expected to have an extremely low leak rate, limited susceptibility to particulates, vibration or radiation, as well as a wide operational temperature range.

  13. Radioisotope Power Sources for MEMS Devices,

    International Nuclear Information System (INIS)

    Blanchard, J.P.

    2001-01-01

    Microelectromechanical systems (MEMS) comprise a rapidly expanding research field with potential applications varying from sensors in airbags to more recent optical applications. Depending on the application, these devices often require an on-board power source for remote operation, especially in cases requiring operation for an extended period of time. Previously suggested power sources include fossil fuels and solar energy, but nuclear power sources may provide significant advantages for certain applications. Hence, the objective of this study is to establish the viability of using radioisotopes to power realistic MEMS devices. A junction-type battery was constructed using silicon and a 63 Ni liquid source. A source volume containing 64 microCi provided a power of ∼0.07 nW. A more novel application of nuclear sources for MEMS applications involves the creation of a resonator that is driven by charge collection in a cantilever beam. Preliminary results have established the feasibility of this concept, and future work will optimize the design for various applications

  14. Sound Source Localization Through 8 MEMS Microphones Array Using a Sand-Scorpion-Inspired Spiking Neural Network

    Directory of Open Access Journals (Sweden)

    Christoph Beck

    2016-10-01

    Full Text Available Sand-scorpions and many other arachnids perceive their environment by using their feet to sense ground waves. They are able to determine amplitudes the size of an atom and locate the acoustic stimuli with an accuracy of within 13° based on their neuronal anatomy. We present here a prototype sound source localization system, inspired from this impressive performance. The system presented utilizes custom-built hardware with eight MEMS microphones, one for each foot, to acquire the acoustic scene, and a spiking neural model to localize the sound source. The current implementation shows smaller localization error than those observed in nature.

  15. Mathematical analysis of partial differential equations modeling electrostatic MEMS

    CERN Document Server

    Esposito, Pierpaolo; Guo, Yujin

    2010-01-01

    Micro- and nanoelectromechanical systems (MEMS and NEMS), which combine electronics with miniature-size mechanical devices, are essential components of modern technology. It is the mathematical model describing "electrostatically actuated" MEMS that is addressed in this monograph. Even the simplified models that the authors deal with still lead to very interesting second- and fourth-order nonlinear elliptic equations (in the stationary case) and to nonlinear parabolic equations (in the dynamic case). While nonlinear eigenvalue problems-where the stationary MEMS models fit-are a well-developed

  16. Additive direct-write microfabrication for MEMS: A review

    Science.gov (United States)

    Teh, Kwok Siong

    2017-12-01

    Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer- generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into threedimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive

  17. Ball driven type MEMS SAD for artillery fuse

    International Nuclear Information System (INIS)

    Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo

    2017-01-01

    The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition. (paper)

  18. Ball driven type MEMS SAD for artillery fuse

    Science.gov (United States)

    Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S.; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo

    2017-01-01

    The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition.

  19. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    As a field, Microelectromechanical Systems (MEMS) has matured over the last two decades to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of ...

  20. RF MEMS theory, design, and technology

    CERN Document Server

    Rebeiz, Gabriel M

    2003-01-01

    Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

  1. Enabling technology for MEMS and nanodevices

    CERN Document Server

    Baltes, Henry; Fedder, Gary K; Hierold, Christofer; Korvink, Jan G; Tabata, Osamu

    2013-01-01

    This softcover edition of the eponymous volume from the successful ""Advanced Micro & Nanosystems"" series covers all aspects of fabrication of MEMS under CMOS-compatible conditions from design to implementation.It examines the various routes and methods to combine electronics generated by the CMOS technology with novel micromechanical parts into one-chip solutions. Various approaches, fundamental and technological aspects as well as strategies leading to different types of functionalities and presented in detail.For the practicing engineer as well as MSc and PhD students on MEMS cours

  2. Urban MEMS based seismic network for post-earthquakes rapid disaster assessment

    Science.gov (United States)

    D'Alessandro, Antonino; Luzio, Dario; D'Anna, Giuseppe

    2014-05-01

    worship. The waveforms recorded could be promptly used to determine ground-shaking parameters, like peak ground acceleration/velocity/displacement, Arias and Housner intensity, that could be all used to create, few seconds after a strong earthquakes, shaking maps at urban scale. These shaking maps could allow to quickly identify areas of the town center that have had the greatest earthquake resentment. When a strong seismic event occur, the beginning of the ground motion observed at the site could be used to predict the ensuing ground motion at the same site and so to realize a short term earthquake early warning system. The data acquired after a moderate magnitude earthquake, would provide valuable information for the detail seismic microzonation of the area based on direct earthquake shaking observations rather than from a model-based or indirect methods. In this work, we evaluate the feasibility and effectiveness of such seismic network taking in to account both technological, scientific and economic issues. For this purpose, we have simulated the creation of a MEMS based urban seismic network in a medium size city. For the selected town, taking into account the instrumental specifics, the array geometry and the environmental noise, we investigated the ability of the planned network to detect and measure earthquakes of different magnitude generated from realistic near seismogentic sources.

  3. From MEMS to nanomachine

    International Nuclear Information System (INIS)

    Esashi, Masayoshi; Ono, Takahito

    2005-01-01

    Practically applicable microelectromechanical systems (MEMS) and nanomachines have been developed by applying dry processes. Deep reactive ion etching (RIE) of silicon and its applications to an electrostatically levitated rotational gyroscope, a fibre optic blood pressure sensor and in micro-actuated probes are described. High density electrical feedthrough in glass is made using deep RIE of glass and electroplating of metal. Multi-probe data storage system has been developed using the high density electrical feedthrough in glass. Chemical vapour deposition (CVD) of different materials have been developed for MEMS applications; trench-refill using SiO 2 CVD, microstructures using Silicon carbide CVD for glass mold press and selective CVD of carbon nanotube for electron field emitter. Multi-column electron beam lithography system has been developed using the electron field emitter. (topical review)

  4. A flexible capacitive tactile sensing array with floating electrodes

    International Nuclear Information System (INIS)

    Cheng, M-Y; Huang, X-H; Ma, C-W; Yang, Y-J

    2009-01-01

    In this work, we present the development of a capacitive tactile sensing array realized by using MEMS fabrication techniques and flexible printed circuit board (FPCB) technologies. The sensing array, which consists of two micromachined polydimethlysiloxane (PDMS) structures and a FPCB, will be used as the artificial skin for robot applications. Each capacitive sensing element comprises two sensing electrodes and a common floating electrode. The sensing electrodes and the metal interconnect for signal scanning are implemented on the FPCB, while the floating electrode is patterned on one of the PDMS structures. This special design can effectively reduce the complexity of the device structure and thus makes the device highly manufacturable. The characteristics of the devices with different dimensions are measured and discussed. The corresponding scanning circuits are also designed and implemented. The tactile images induced by the PMMA stamps of different shapes are also successfully captured by a fabricated 8 × 8 array

  5. Development of the micro pixel chamber based on MEMS technology

    Science.gov (United States)

    Takemura, T.; Takada, A.; Kishimoto, T.; Komura, S.; Kubo, H.; Matsuoka, Y.; Miuchi, K.; Miyamoto, S.; Mizumoto, T.; Mizumura, Y.; Motomura, T.; Nakamasu, Y.; Nakamura, K.; Oda, M.; Ohta, K.; Parker, J. D.; Sawano, T.; Sonoda, S.; Tanimori, T.; Tomono, D.; Yoshikawa, K.

    2018-02-01

    Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB) technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS), however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS) technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

  6. [A micro-silicon multi-slit spectrophotometer based on MEMS technology].

    Science.gov (United States)

    Hao, Peng; Wu, Yi-Hui; Zhang, Ping; Liu, Yong-Shun; Zhang, Ke; Li, Hai-Wen

    2009-06-01

    A new mini-spectrophotometer was developed by adopting micro-silicon slit and pixel segmentation technology, and this spectrophotometer used photoelectron diode array as the detector by the back-dividing-light way. At first, the effect of the spectral bandwidth on the tested absorbance linear correlation was analyzed. A theory for the design of spectrophotometer's slit was brought forward after discussing the relationships between spectrophotometer spectrum band width and pre-and post-slits width. Then, the integrative micro-silicon-slit, which features small volume, high precision, and thin thickness, was manufactured based on the MEMS technology. Finally, a test was carried on linear absorbance solution by this spectrophotometer. The final result showed that the correlation coefficients were larger than 0.999, which means that the new mini-spectrophotometer with micro-silicon slit pixel segmentation has an obvious linear correlation.

  7. Development of a Two-Dimensional Array of Individually Addressable Micro-Mirrors for NGST Application

    Science.gov (United States)

    Dutta, S. B.; Mott, D. B.; Allen, C. A.; Ewin, A. J.; Jhabvala, M. D.; Kotecki, C. A.; Kuhn, J. L.; MacKenty, J. W.

    2000-05-01

    NASA's missions of the 21st century will use small, low cost, efficient instruments for Earth and Space Science studies. Development of technologies that accommodate these requirements is essential for space applications. Micro Electro Mechanical Systems (MEMS) technology development for sensors and actuators plays a major role in this effort. We are developing a two dimensional array of individually addressable, cryogenic micro-mirrors, a MEMS based component, specifically for application in the Multi Object Spectrometer (MOS) in NGST. Two-dimensional, individually addressable and tiltable aluminum micro-mirror-arrays (MMA) have been developed and prototype arrays of different sizes have been fabricated in the Detector Development Laboratory of NASA, GSFC. Each micro-mirror of the array has 100micronx100micron pixel size and is capable of tilting +/- 10 degrees by electrostatic actuation. We have completed extensive analytical studies and performed laboratory tests to compare model predictions with actual performance of a 3x3 array. The mirrors have been tested to operate at cryogenic temperature. Recently we have completed the integration of a CMOS based address and driver circuit for the MMA with its mechanical structure. Our goal is to extend the development to a 1024x1024 array, primarily for NGST and also for other imaging and spectroscopy applications. For NGST MOS, MMAs will be used as a reflective slit-mask at a focal plane of the spectrometer providing a large field of view together with diffraction limited angular resolution for a grating spectrometer. Selected areas of the mirror-array will be tilted to select portions of the scene so that observation of up to 1000 simultaneous spectra of sparse targets will be possible. This provides a factor of 100 improvement in observing speed over conventional spectrometers. Details of the technology development along with its application to NGST will be discussed. This work is supported by the GSFC Director

  8. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of a MEMS device or structure using conven- tional CMOS processes or their variants was the ...

  9. Integrated Electromechanical Transduction Schemes for Polymer MEMS Sensors

    Directory of Open Access Journals (Sweden)

    Damien Thuau

    2018-04-01

    Full Text Available Polymer Micro ElectroMechanical Systems (MEMS have the potential to constitute a powerful alternative to silicon-based MEMS devices for sensing applications. Although the use of commercial photoresists as structural material in polymer MEMS has been widely reported, the integration of functional polymer materials as electromechanical transducers has not yet received the same amount of interest. In this context, we report on the design and fabrication of different electromechanical schemes based on polymeric materials ensuring different transduction functions. Piezoresistive transduction made of carbon nanotube-based nanocomposites with a gauge factor of 200 was embedded within U-shaped polymeric cantilevers operating either in static or dynamic modes. Flexible resonators with integrated piezoelectric transduction were also realized and used as efficient viscosity sensors. Finally, piezoelectric-based organic field effect transistor (OFET electromechanical transduction exhibiting a record sensitivity of over 600 was integrated into polymer cantilevers and used as highly sensitive strain and humidity sensors. Such advances in integrated electromechanical transduction schemes should favor the development of novel all-polymer MEMS devices for flexible and wearable applications in the future.

  10. Antenna Miniaturization with MEMS Tunable Capacitors

    DEFF Research Database (Denmark)

    Barrio, Samantha Caporal Del; Morris, Art; Pedersen, Gert Frølund

    2014-01-01

    In today’s mobile device market, there is a strong need for efficient antenna miniaturization. Tunable antennas are a very promising way to reduce antenna volume while enlarging its operating bandwidth. MEMS tunable capacitors are state-ofthe- art in terms of insertion loss and their characterist......In today’s mobile device market, there is a strong need for efficient antenna miniaturization. Tunable antennas are a very promising way to reduce antenna volume while enlarging its operating bandwidth. MEMS tunable capacitors are state-ofthe- art in terms of insertion loss...

  11. Heat And Mass Transfer Analysis of a Film Evaporative MEMS Tunable Array

    Science.gov (United States)

    O'Neill, William J.

    This thesis details the heat and mass transfer analysis of a MEMs microthruster designed to provide propulsive, attitude control and thermal control capabilities to a cubesat. This thruster is designed to function by retaining water as a propellant and applying resistive heating in order to increase the temperature of the liquid-vapor interface to either increase evaporation or induce boiling to regulate mass flow. The resulting vapor is then expanded out of a diverging nozzle to produce thrust. Because of the low operating pressure and small length scale of this thruster, unique forms of mass transfer analysis such as non-continuum gas flow were modeled using the Direct Simulation Monte Carlo method. Continuum fluid/thermal simulations using COMSOL Multiphysics have been applied to model heat and mass transfer in the solid and liquid portions of the thruster. The two methods were coupled through variables at the liquid-vapor interface and solved iteratively by the bisection method. The simulations presented in this thesis confirm the thermal valving concept. It is shown that when power is applied to the thruster there is a nearly linear increase in mass flow and thrust. Thus, mass flow can be regulated by regulating the applied power. This concept can also be used as a thermal control device for spacecraft.

  12. Sputtered highly oriented PZT thin films for MEMS applications

    Science.gov (United States)

    Kalpat, Sriram S.

    Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate

  13. Fabrication and calibration of FORTIS

    Science.gov (United States)

    Fleming, Brian T.; McCandliss, Stephan R.; Kaiser, Mary Elizabeth; Kruk, Jeffery; Feldman, Paul D.; Kutyrev, Alexander S.; Li, Mary J.; Rapchun, David A.; Lyness, Eric; Moseley, S. H.; Siegmund, Oswald; Vallerga, John; Martin, Adrian

    2011-09-01

    The Johns Hopkins University sounding rocket group is entering the final fabrication phase of the Far-ultraviolet Off Rowland-circle Telescope for Imaging and Spectroscopy (FORTIS); a sounding rocket borne multi-object spectro-telescope designed to provide spectral coverage of 43 separate targets in the 900 - 1800 Angstrom bandpass over a 30' x 30' field-of- view. Using "on-the-fly" target acquisition and spectral multiplexing enabled by a GSFC microshutter array, FORTIS will be capable of observing the brightest regions in the far-UV of nearby low redshift (z ~ 0.002 - 0.02) star forming galaxies to search for Lyman alpha escape, and to measure the local gas-to-dust ratio. A large area (~ 45 mm x 170 mm) microchannel plate detector built by Sensor Sciences provides an imaging channel for targeting flanked by two redundant spectral outrigger channels. The grating is ruled directly onto the secondary mirror to increase efficiency. In this paper, we discuss the recent progress made in the development and fabrication of FORTIS, as well as the results of early calibration and characterization of our hardware, including mirror/grating measurements, detector performance, and early operational tests of the microshutter arrays.

  14. Nondestructive surface profiling of hidden MEMS using an infrared low-coherence interferometric microscope

    Science.gov (United States)

    Krauter, Johann; Osten, Wolfgang

    2018-03-01

    There are a wide range of applications for micro-electro-mechanical systems (MEMS). The automotive and consumer market is the strongest driver for the growing MEMS industry. A 100 % test of MEMS is particularly necessary since these are often used for safety-related purposes such as the ESP (Electronic Stability Program) system. The production of MEMS is a fully automated process that generates 90 % of the costs during the packaging and dicing steps. Nowadays, an electrical test is carried out on each individual MEMS component before these steps. However, after encapsulation, MEMS are opaque to visible light and other defects cannot be detected. Therefore, we apply an infrared low-coherence interferometer for the topography measurement of those hidden structures. A lock-in algorithm-based method is shown to calculate the object height and to reduce ghost steps due to the 2π -unambiguity. Finally, measurements of different MEMS-based sensors are presented.

  15. Ultra-compact MEMS FTIR spectrometer

    Science.gov (United States)

    Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa

    2017-05-01

    Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

  16. Políticas Públicas de Memória O Programa Pontos de Memória no Contexto Sul-Rio-Grandense

    Directory of Open Access Journals (Sweden)

    Mariana Boujadi Mariano da Silva

    2016-12-01

    Full Text Available O presente estudo busca realizar uma análise do Programa Pontos de Memória, do Instituto Brasileiro de Museus. Analisando o Programa, observa-se a iniciativa de preservar a memória de determinados grupos sociais considerados excluídos da representação de museus ditos tradicionais, através da implementação de espaços de memória ou ações sociomuseológicas, que narrem suas histórias a partir do suporte de patrimônios locais. A análise parte de questionamentos iniciais: quais são as memórias e as identidades que o Programa seleciona para narrar, através de quais ferramentas ocorre a divulgação e sobretudo a apropriação deste patrimônio por parte da comunidade? Para analisar as causas e os efeitos desta política pública, o trabalho observará e discutirá o alcance e a influência que esses espaços exercem nas comunidades, as ações desenvolvidas e a longevidade desses espaços ou ações no contexto sul-rio-grandense.

  17. A Review on Key Issues and Challenges in Devices Level MEMS Testing

    Directory of Open Access Journals (Sweden)

    Muhammad Shoaib

    2016-01-01

    Full Text Available The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

  18. A low-noise MEMS accelerometer for unattended ground sensor applications

    Science.gov (United States)

    Speller, Kevin E.; Yu, Duli

    2004-09-01

    A low-noise micro-machined servo accelerometer has been developed for use in Unattended Ground Sensors (UGS). Compared to conventional coil-and-magnet based velocity transducers, this Micro-Electro-Mechanical System (MEMS) accelerometer offers several key benefits for battlefield monitoring. Many UGS require a compass to determine deployment orientation with respect to magnetic North. This orientation information is critical for determining the bearing of incoming signals. Conventional sensors with sensing technology based on a permanent magnet can cause interference with a compass when used in close proximity. This problem is solved with a MEMS accelerometer which does not require any magnetic materials. Frequency information below 10 Hz is valuable for identification of signal sources. Conventional seismometers used in UGS are typically limited in frequency response from 20 to 200 Hz. The MEMS accelerometer has a flat frequency response from DC to 5 kHz. The wider spectrum of signals received improves detection, classification and monitoring on the battlefield. The DC-coupled output of the MEMS accelerometer also has the added benefit of providing tilt orientation data for the deployed UGS. Other performance parameters of the MEMS accelerometer that are important to UGS such as size, weight, shock survivability, phase response, distortion, and cross-axis rejection will be discussed. Additionally, field test data from human footsteps recorded with the MEMS accelerometer will be presented.

  19. Modeling and non-linear responses of MEMS capacitive accelerometer

    Directory of Open Access Journals (Sweden)

    Sri Harsha C.

    2014-01-01

    Full Text Available A theoretical investigation of an electrically actuated beam has been illustrated when the electrostatic-ally actuated micro-cantilever beam is separated from the electrode by a moderately large gap for two distinct types of geometric configurations of MEMS accelerometer. Higher order nonlinear terms have been taken into account for studying the pull in voltage analysis. A nonlinear model of gas film squeezing damping, another source of nonlinearity in MEMS devices is included in obtaining the dynamic responses. Moreover, in the present work, the possible source of nonlinearities while formulating the mathematical model of a MEMS accelerometer and their influences on the dynamic responses have been investigated. The theoretical results obtained by using MATLAB has been verified with the results obtained in FE software and has been found in good agreement. Criterion towards stable micro size accelerometer for each configuration has been investigated. This investigation clearly provides an understanding of nonlinear static and dynamics characteristics of electrostatically micro cantilever based device in MEMS.

  20. Thermal Desalination using MEMS and Salinity-Gradient Solar Pond Technology

    Science.gov (United States)

    Lu, H.; Walton, J. C.; Hein, H.

    2002-08-01

    MEMS (multi-effect, multi-stage) flash desalination (distillation) driven by thermal energy derived from a salinity-gradient solar pond is investigated in this study for the purpose of improving the thermodynamic efficiency and economics of this technology. Three major tasks are performed: (1) a MEMS unit is tested under various operating conditions at the El Paso Solar Pond site; (2) the operation and maintenance procedures of the salinity-gradient solar pond coupled with the MEMS operation is studied; and (3) previous test data on a 24-stage, falling-film flash distillation unit (known as the Spinflash) is analyzed and compared with the performance of the MEMS unit. The data and information obtained from this investigation is applicable to a variety of thermal desalination processes using other solar options and/or waste heat.

  1. MEMS Actuators for Improved Performance and Durability

    Science.gov (United States)

    Yearsley, James M.

    Micro-ElectroMechanical Systems (MEMS) devices take advantage of force-scaling at length scales smaller than a millimeter to sense and interact with directly with phenomena and targets at the microscale. MEMS sensors found in everyday devices like cell-phones and cars include accelerometers, gyros, pressure sensors, and magnetic sensors. MEMS actuators generally serve more application specific roles including micro- and nano-tweezers used for single cell manipulation, optical switching and alignment components, and micro combustion engines for high energy density power generation. MEMS rotary motors are actuators that translate an electric drive signal into rotational motion and can serve as rate calibration inputs for gyros, stages for optical components, mixing devices for micro-fluidics, etc. Existing rotary micromotors suffer from friction and wear issues that affect lifetime and performance. Attempts to alleviate friction effects include surface treatment, magnetic and electrostatic levitation, pressurized gas bearings, and micro-ball bearings. The present work demonstrates a droplet based liquid bearing supporting a rotary micromotor that improves the operating characteristics of MEMS rotary motors. The liquid bearing provides wear-free, low-friction, passive alignment between the rotor and stator. Droplets are positioned relative to the rotor and stator through patterned superhydrophobic and hydrophilic surface coatings. The liquid bearing consists of a central droplet that acts as the motor shaft, providing axial alignment between rotor and stator, and satellite droplets, analogous to ball-bearings, that provide tip and tilt stable operation. The liquid bearing friction performance is characterized through measurement of the rotational drag coefficient and minimum starting torque due to stiction and geometric effects. Bearing operational performance is further characterized by modeling and measuring stiffness, environmental survivability, and high

  2. Melancolia, memória e subjetividade

    OpenAIRE

    Giele Rocha Dorneles

    2015-01-01

    A proposta desta tese é estabelecer, através de uma perspectiva comparatista, relações entre três temas articuladores: a melancolia, a memória e a subjetividade, de modo a constituir entrelaçamentos possíveis, além de buscar indicar o modo como essas três temáticas são apresentadas e representadas em diferentes formas de expressão das artes, partindo de obras literárias - como “A maior flor do mundo” e “As pequenas memórias”, entre outras de José Saramago, e de autores como Charles Baudelaire...

  3. Fabrication and performance analysis of MEMS-based Variable Emissivity Radiator for Space Applications

    International Nuclear Information System (INIS)

    Lee, Changwook; Oh, Hyung-Ung; Kim, Taegyu

    2014-01-01

    All Louver was typically representative as the thermal control device. The louver was not suitable to be applied to small satellite, because it has the disadvantage of increase in weight and volume. So MEMS-based variable radiator was developed to support the disadvantage of the louver MEMS-based variable emissivity radiator was designed for satellite thermal control. Because of its immediate response and low power consumption. Also MEMS- based variable emissivity radiator has been made smaller by using MEMS process, it could be solved the problem of the increase in weight and volume, and it has a high reliability and immediate response by using electrical control. In this study, operation validation of the MEMS radiator had been carried out, resulting that emissivity could be controlled. Numerical model was also designed to predict the thermal control performance of MEMS-based variable emissivity radiator

  4. A novel prototyping method for die-level monolithic integration of MEMS above-IC

    International Nuclear Information System (INIS)

    Cicek, Paul-Vahe; Zhang, Qing; Saha, Tanmoy; Mahdavi, Sareh; Allidina, Karim; Gamal, Mourad El; Nabki, Frederic

    2013-01-01

    This work presents a convenient and versatile prototyping method for integrating surface-micromachined microelectromechanical systems (MEMS) directly above IC electronics, at the die level. Such localized implementation helps reduce development costs associated with the acquisition of full-sized semiconductor wafers. To demonstrate the validity of this method, variants of an IC-compatible surface-micromachining MEMS process are used to build different MEMS devices above a commercial transimpedance amplifier chip. Subsequent functional assessments for both the electronics and the MEMS indicate that the integration is successful, validating the prototyping methodology presented in this work, as well as the suitability of the selected MEMS technology for above-IC integration. (paper)

  5. The Sandia MEMS passive shock sensor : FY07 maturation activities.

    Energy Technology Data Exchange (ETDEWEB)

    Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

    2008-08-01

    This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

  6. NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS

    CERN Document Server

    1998-01-01

    Micro Electro Mechanical Systems (MEMS) is already about a billion dollars a year industry and is growing rapidly. So far major emphasis has been placed on the fabrication processes for various devices. There are serious issues related to tribology, mechanics, surfacechemistry and materials science in the operationand manufacturingof many MEMS devices and these issues are preventing an even faster commercialization. Very little is understood about tribology and mechanical properties on micro- to nanoscales of the materials used in the construction of MEMS devices. The MEMS community needs to be exposed to the state-of-the-artoftribology and vice versa. Fundamental understanding of friction/stiction, wear and the role of surface contamination and environmental debris in micro devices is required. There are significantadhesion, friction and wear issues in manufacturing and actual use, facing the MEMS industry. Very little is understood about the tribology of bulk silicon and polysilicon films used in the constr...

  7. Digital holography for MEMS and microsystem metrology

    CERN Document Server

    Asundi, Anand

    2011-01-01

    Approaching the topic of digital holography from the practical perspective of industrial inspection, Digital Holography for MEMS and Microsystem Metrology describes the process of digital holography and its growing applications for MEMS characterization, residual stress measurement, design and evaluation, and device testing and inspection. Asundi also provides a thorough theoretical grounding that enables the reader to understand basic concepts and thus identify areas where this technique can be adopted. This combination of both practical and theoretical approach will ensure the

  8. Polycrystalline-Diamond MEMS Biosensors Including Neural Microelectrode-Arrays

    Directory of Open Access Journals (Sweden)

    Donna H. Wang

    2011-08-01

    Full Text Available Diamond is a material of interest due to its unique combination of properties, including its chemical inertness and biocompatibility. Polycrystalline diamond (poly-C has been used in experimental biosensors that utilize electrochemical methods and antigen-antibody binding for the detection of biological molecules. Boron-doped poly-C electrodes have been found to be very advantageous for electrochemical applications due to their large potential window, low background current and noise, and low detection limits (as low as 500 fM. The biocompatibility of poly-C is found to be comparable, or superior to, other materials commonly used for implants, such as titanium and 316 stainless steel. We have developed a diamond-based, neural microelectrode-array (MEA, due to the desirability of poly-C as a biosensor. These diamond probes have been used for in vivo electrical recording and in vitro electrochemical detection. Poly-C electrodes have been used for electrical recording of neural activity. In vitro studies indicate that the diamond probe can detect norepinephrine at a 5 nM level. We propose a combination of diamond micro-machining and surface functionalization for manufacturing diamond pathogen-microsensors.

  9. Design and Optimization of AlN based RF MEMS Switches

    Science.gov (United States)

    Hasan Ziko, Mehadi; Koel, Ants

    2018-05-01

    Radio frequency microelectromechanical system (RF MEMS) switch technology might have potential to replace the semiconductor technology in future communication systems as well as communication satellites, wireless and mobile phones. This study is to explore the possibilities of RF MEMS switch design and optimization with aluminium nitride (AlN) thin film as the piezoelectric actuation material. Achieving low actuation voltage and high contact force with optimal geometry using the principle of piezoelectric effect is the main motivation for this research. Analytical and numerical modelling of single beam type RF MEMS switch used to analyse the design parameters and optimize them for the minimum actuation voltage and high contact force. An analytical model using isotropic AlN material properties used to obtain the optimal parameters. The optimized geometry of the device length, width and thickness are 2000 µm, 500 µm and 0.6 µm respectively obtained for the single beam RF MEMS switch. Low actuation voltage and high contact force with optimal geometry are less than 2 Vand 100 µN obtained by analytical analysis. Additionally, the single beam RF MEMS switch are optimized and validated by comparing the analytical and finite element modelling (FEM) analysis.

  10. Development of Testing Methodologies for the Mechanical Properties of MEMS

    Science.gov (United States)

    Ekwaro-Osire, Stephen

    2003-01-01

    This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.

  11. Research and Analysis of MEMS Switches in Different Frequency Bands

    Directory of Open Access Journals (Sweden)

    Wenchao Tian

    2018-04-01

    Full Text Available Due to their high isolation, low insertion loss, high linearity, and low power consumption, microelectromechanical systems (MEMS switches have drawn much attention from researchers in recent years. In this paper, we introduce the research status of MEMS switches in different bands and several reliability issues, such as dielectric charging, contact failure, and temperature instability. In this paper, some of the following methods to improve the performance of MEMS switches in high frequency are summarized: (1 utilizing combinations of several switches in series; (2 covering a float metal layer on the dielectric layer; (3 using dielectric layer materials with high dielectric constants and conductor materials with low resistance; (4 developing MEMS switches using T-match and π-match; (5 designing MEMS switches based on bipolar complementary metal–oxide–semiconductor (BiCMOS technology and reconfigurable MEMS’ surfaces; (6 employing thermal compensation structures, circularly symmetric structures, thermal buckle-beam actuators, molybdenum membrane, and thin-film packaging; (7 selecting Ultra-NanoCrystalline diamond or aluminum nitride dielectric materials and applying a bipolar driving voltage, stoppers, and a double-dielectric-layer structure; and (8 adopting gold alloying with carbon nanotubes (CNTs, hermetic and reliable packaging, and mN-level contact.

  12. Piezoelectric Lead Zirconate Titanate (PZT) Ring Shaped Contour-Mode MEMS Resonators

    Science.gov (United States)

    Kasambe, P. V.; Asgaonkar, V. V.; Bangera, A. D.; Lokre, A. S.; Rathod, S. S.; Bhoir, D. V.

    2018-02-01

    Flexibility in setting fundamental frequency of resonator independent of its motional resistance is one of the desired criteria in micro-electromechanical (MEMS) resonator design. It is observed that ring-shaped piezoelectric contour-mode MEMS resonators satisfy this design criterion than in case of rectangular plate MEMS resonators. Also ring-shaped contour-mode piezoelectric MEMS resonator has an advantage that its fundamental frequency is defined by in-plane dimensions, but they show variation of fundamental frequency with different Platinum (Pt) thickness referred as change in ratio of fNEW /fO . This paper presents the effects of variation in geometrical parameters and change in piezoelectric material on the resonant frequencies of Platinum piezoelectric-Aluminium ring-shaped contour-mode MEMS resonators and its electrical parameters. The proposed structure with Lead Zirconate Titanate (PZT) as the piezoelectric material was observed to be a piezoelectric material with minimal change in fundamental resonant frequency due to Platinum thickness variation. This structure was also found to exhibit extremely low motional resistance of 0.03 Ω as compared to the 31-35 Ω range obtained when using AlN as the piezoelectric material. CoventorWare 10 is used for the design, simulation and corresponding analysis of resonators which is Finite Element Method (FEM) analysis and design tool for MEMS devices.

  13. MEMS and the microbe

    NARCIS (Netherlands)

    Ingham, C.J.; Vlieg, J.E.T.V.H.

    2008-01-01

    In recent years, relatively simple MEMS fabrications have helped accelerate our knowledge of the microbial cell. Current progress and challenges in the application of lab-on-a-chip devices to the viable microbe are reviewed. Furthermore, the degree to which microbiologists are becoming the engineers

  14. Buffering Implications for the Design Space of Streaming MEMS Storage

    NARCIS (Netherlands)

    Khatib, M.G.; Abelmann, Leon; Preas, Kathy

    2011-01-01

    Emerging nanotechnology-based systems encounter new non-functional requirements. This work addresses MEMS storage, an emerging technology that promises ultrahigh density and energy-efficient storage devices. We study the buffering requirement of MEMS storage in streaming applications. We show that

  15. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  16. Single-crystal-silicon-based microinstrument to study friction and wear at MEMS sidewall interfaces

    International Nuclear Information System (INIS)

    Ansari, N; Ashurst, W R

    2012-01-01

    Since the advent of microelectromechanical systems (MEMS) technology, friction and wear are considered as key factors that determine the lifetime and reliability of MEMS devices that contain contacting interfaces. However, to date, our knowledge of the mechanisms that govern friction and wear in MEMS is insufficient. Therefore, systematically investigating friction and wear at MEMS scale is critical for the commercial success of many potential MEMS devices. Specifically, since many emerging MEMS devices contain more sidewall interfaces, which are topographically and chemically different from in-plane interfaces, studying the friction and wear characteristics of MEMS sidewall surfaces is important. The microinstruments that have been used to date to investigate the friction and wear characteristics of MEMS sidewall surfaces possess several limitations induced either by their design or the structural film used to fabricate them. Therefore, in this paper, we report on a single-crystal-silicon-based microinstrument to study the frictional and wear behavior of MEMS sidewalls, which not only addresses some of the limitations of other microinstruments but is also easy to fabricate. The design, modeling and fabrication of the microinstrument are described in this paper. Additionally, the coefficients of static and dynamic friction of octadecyltrichlorosilane-coated sidewall surfaces as well as sidewall surfaces with only native oxide on them are also reported in this paper. (paper)

  17. Applications of MEMS for Space Exploration

    Science.gov (United States)

    Tang, William C.

    1998-03-01

    Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. Micro Electro Mechanical Systems (MEMS) is one of the key enabling technologies to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

  18. MEMS capacitive force sensors for cellular and flight biomechanics

    International Nuclear Information System (INIS)

    Sun Yu; Nelson, Bradley J

    2007-01-01

    Microelectromechanical systems (MEMS) are playing increasingly important roles in facilitating biological studies. They are capable of providing not only qualitative but also quantitative information on the cellular, sub-cellular and organism levels, which is instrumental to understanding the fundamental elements of biological systems. MEMS force sensors with their high bandwidth and high sensitivity combined with their small size, in particular, have found a role in this domain, because of the importance of quantifying forces and their effect on the function and morphology of many biological structures. This paper describes our research in the development of MEMS capacitive force sensors that have already demonstrated their effectiveness in the areas of cell mechanics and Drosophila flight dynamics studies. (review article)

  19. Fabrication of a dual-planar-coil dynamic microphone by MEMS techniques

    International Nuclear Information System (INIS)

    Horng, Ray-Hua; Chen, Kuo-Feng; Tsai, Yao-Cheng; Suen, Cheng-You; Chang, Chao-Chih

    2010-01-01

    A dual-planar-coil miniature dynamic microphone, one of the electro-acoustic transducers working with the principle of the electromagnetic induction, has been realized by semiconductor micro-processing and micro-electro-mechanical system (MEMS) techniques. This MEMS microphone mainly consists of a 1 µm thick diaphragm sandwiched by two spiral coils and vibrating in the region with the highest magnetic flux density generated by a double magnetic system. In comparison with the traditional dynamic microphone, besides the miniaturized dimension, the MEMS microphone also provides 325 times the vibration velocity of the diaphragm faster than the traditional microphone. Measured by an audio analyzer, the frequency response of the MEMS microphone is only 4.5 dBV Pa −1 lower than that of the traditional microphone in the range between 50 Hz and 20 kHz. The responsivity of −54.8 dB Pa −1 (at 1 kHz) of the MEMS device is competitive to that of a traditional commercial dynamic microphone which typically ranges from −50 to −60 dBV Pa −1 (at 1 kHz).

  20. Olhar do cronista, registro da memória

    Directory of Open Access Journals (Sweden)

    Angela Maria Dutra da Silva Senra

    2016-09-01

    Full Text Available Propomos apresentar a pesquisa “Rastros da memória literária em crônicas dos jornais marianenses dos séculos XIX e XX” (PERPÉTUA, 2015, que tem como fonte um acervo de periódicos da cidade de Mariana (MG, hoje sob a guarda do Centro de Pesquisas Linguagem, Memória e Tradução do ICHS-UFOP. Dada a evidente relação desse acervo com a memória sociocultural da cidade, nossa pesquisa, em andamento, volta-se objetivamente para identificar e selecionar crônicas literárias publicadas nos periódicos, com a subsequente análise em sua correlação com a memória da região, sob as bases de um significativo material teórico sobre esse gênero. Assim, com vistas a adentrar no passado memorial da cidade de Mariana, apresentaremos o resultado parcial da nossa investigação, que tem proporcionado o conhecimento acerca da crônica; e do registro memorial dessa cidade em razão de sua importância no cenário histórico, social e cultural de Minas Gerais.

  1. SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

    KAUST Repository

    Ramadan, Khaled S.

    2012-04-01

    Polymer based microelectromechanical systems (MEMS) micromachining is finding more interest in research and applications. This is due to its low cost and less time processing compared with silicon MEMS. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic devices. In addition to being processed with low cost, it is a biocompatible material with good mechanical properties. Also, amorphous silicon (α-Si) has found use as a sacrificial layer in silicon MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed using amorphous silicon (α-Si) as a sacrificial layer. Electrostatic actuation and sensing is used in many MEMS applications. SU-8 is a dielectric material which limits its direct use in electrostatic actuation. This thesis provides a MEMS process with two conductive metal electrodes that can be used for out-of-plane electrostatic applications like MEMS switches and variable capacitors. The process provides the fabrication of dimples that can be conductive or non-conductive to facilitate more flexibility for MEMS designers. This SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were tuned for two sets of thicknesses which are thin (5-10μm) and thick (130μm). Chevron bent-beam structures and different suspended beams (cantilevers and bridges) were fabricated to characterize the SU-8 process through extracting the density, Young’s Modulus and the Coefficient of Thermal Expansion (CTE) of SU-8. Also, the process was tested and used as an educational tool through which different MEMS structures were fabricated including MEMS switches, variable capacitors and thermal actuators.

  2. Optimizing MEMS-Based Storage Devices for Mobile Battery-Powered Systems

    NARCIS (Netherlands)

    Khatib, M.G.; Hartel, Pieter H.

    An emerging storage technology, called MEMS-based storage, promises nonvolatile storage devices with ultrahigh density, high rigidity, a small form factor, and low cost. For these reasons, MEMS-based storage devices are suitable for battery-powered mobile systems such as PDAs. For deployment in such

  3. Differential RF MEMS interwoven capacitor immune to residual stress warping

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-27

    A RF MEMS capacitor with an interwoven structure is designed, fabricated in the PolyMUMPS process and tested in an effort to address fabrication challenges usually faced in MEMS processes. The interwoven structure was found to offer several advantages over the typical MEMS parallel-plate design including eliminating the warping caused by residual stress, eliminating the need for etching holes, suppressing stiction, reducing parasitics and providing differential capability. The quality factor of the proposed capacitor was higher than five throughout a 2–10 GHz range and the resonant frequency was in excess of 20 GHz.

  4. Differential RF MEMS interwoven capacitor immune to residual stress warping

    KAUST Repository

    Elshurafa, Amro M.; Salama, Khaled N.

    2012-01-01

    A RF MEMS capacitor with an interwoven structure is designed, fabricated in the PolyMUMPS process and tested in an effort to address fabrication challenges usually faced in MEMS processes. The interwoven structure was found to offer several advantages over the typical MEMS parallel-plate design including eliminating the warping caused by residual stress, eliminating the need for etching holes, suppressing stiction, reducing parasitics and providing differential capability. The quality factor of the proposed capacitor was higher than five throughout a 2–10 GHz range and the resonant frequency was in excess of 20 GHz.

  5. UAV-borne lidar with MEMS mirror-based scanning capability

    Science.gov (United States)

    Kasturi, Abhishek; Milanovic, Veljko; Atwood, Bryan H.; Yang, James

    2016-05-01

    Firstly, we demonstrated a wirelessly controlled MEMS scan module with imaging and laser tracking capability which can be mounted and flown on a small UAV quadcopter. The MEMS scan module was reduced down to a small volume of smartphone via Bluetooth while flying on a drone, and could project vector content, text, and perform laser based tracking. Also, a "point-and-range" LiDAR module was developed for UAV applications based on low SWaP (Size, Weight and Power) gimbal-less MEMS mirror beam-steering technology and off-the-shelf OEM LRF modules. For demonstration purposes of an integrated laser range finder module, we used a simple off-the-shelf OEM laser range finder (LRF) with a 100m range, +/-1.5mm accuracy, and 4Hz ranging capability. The LRFs receiver optics were modified to accept 20° of angle, matching the transmitter's FoR. A relatively large (5.0mm) diameter MEMS mirror with +/-10° optical scanning angle was utilized in the demonstration to maintain the small beam divergence of the module. The complete LiDAR prototype can fit into a small volume of battery. The MEMS mirror based LiDAR system allows for ondemand ranging of points or areas within the FoR without altering the UAV's position. Increasing the LRF ranging frequency and stabilizing the pointing of the laser beam by utilizing the onboard inertial sensors and the camera are additional goals of the next design.

  6. A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection

    Science.gov (United States)

    2015-09-01

    ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for...ARL-RP-0536 ● SEP 2015 US Army Research Laboratory A Molecularly Imprinted Polymer (MIP)- Coated Microbeam MEMS Sensor for Chemical...TITLE AND SUBTITLE A Molecularly Imprinted Polymer (MIP)-Coated Microbeam MEMS Sensor for Chemical Detection 5a. CONTRACT NUMBER 5b. GRANT NUMBER

  7. Feasibility of frequency-modulated wireless transmission for a multi-purpose MEMS-based accelerometer.

    Science.gov (United States)

    Sabato, Alessandro; Feng, Maria Q

    2014-09-05

    Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy--especially at very low frequencies--have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

  8. MemBrain: An Easy-to-Use Online Webserver for Transmembrane Protein Structure Prediction

    Science.gov (United States)

    Yin, Xi; Yang, Jing; Xiao, Feng; Yang, Yang; Shen, Hong-Bin

    2018-03-01

    Membrane proteins are an important kind of proteins embedded in the membranes of cells and play crucial roles in living organisms, such as ion channels, transporters, receptors. Because it is difficult to determinate the membrane protein's structure by wet-lab experiments, accurate and fast amino acid sequence-based computational methods are highly desired. In this paper, we report an online prediction tool called MemBrain, whose input is the amino acid sequence. MemBrain consists of specialized modules for predicting transmembrane helices, residue-residue contacts and relative accessible surface area of α-helical membrane proteins. MemBrain achieves a prediction accuracy of 97.9% of A TMH, 87.1% of A P, 3.2 ± 3.0 of N-score, 3.1 ± 2.8 of C-score. MemBrain-Contact obtains 62%/64.1% prediction accuracy on training and independent dataset on top L/5 contact prediction, respectively. And MemBrain-Rasa achieves Pearson correlation coefficient of 0.733 and its mean absolute error of 13.593. These prediction results provide valuable hints for revealing the structure and function of membrane proteins. MemBrain web server is free for academic use and available at www.csbio.sjtu.edu.cn/bioinf/MemBrain/. [Figure not available: see fulltext.

  9. Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

    Directory of Open Access Journals (Sweden)

    Sarah Zerbini

    2007-09-01

    Full Text Available The effect of accidental drops on MEMS sensors are examined within the frame-work of a multi-scale finite element approach. With specific reference to a polysilicon MEMSaccelerometer supported by a naked die, the analysis is decoupled into macro-scale (at dielength-scale and meso-scale (at MEMS length-scale simulations, accounting for the verysmall inertial contribution of the sensor to the overall dynamics of the device. Macro-scaleanalyses are adopted to get insights into the link between shock waves caused by the impactagainst a target surface and propagating inside the die, and the displacement/acceleration his-tories at the MEMS anchor points. Meso-scale analyses are adopted to detect the most stresseddetails of the sensor and to assess whether the impact can lead to possible localized failures.Numerical results show that the acceleration at sensor anchors cannot be considered an ob-jective indicator for drop severity. Instead, accurate analyses at sensor level are necessary toestablish how MEMS can fail because of drops.

  10. Enhanced lifetime for thin-dielectric microdischarge-arrays operating in DC

    Science.gov (United States)

    Dussart, Remi; Felix, Valentin; Overzet, Lawrence; Aubry, Olivier; Stolz, Arnaud; Lefaucheux, Philippe; Gremi-Univ Orleans-Cnrs Collaboration; University Of Texas At Dallas Collaboration

    2016-09-01

    Micro-hollow cathode discharge arrays using silicon as the cathode have a very limited lifetime because the silicon bubbles and initiates micro-arcing. To avoid this destructive behavior, the same configuration was kept but, another material was selected for the cathode. Using micro and nanotechnologies ordinarily used in microelectronic and MEMS device fabrication, we made arrays of cathode boundary layer (CBL)-type microreactors consisting of nickel electrodes separated by a 6 µm thick SiO2 layer. Microdischarges were ignited in arrays of 100 µm diameter holes at different pressures (200750 Torr) in different gases. Electrical and optical measurements were made to characterize the arrays. Unlike the microdischarges produced using silicon cathodes, the Ni cathode discharges remain very stable with essentially no micro-arcing. DC currents between 50 and 900 µA flowed through each microreactor with a discharge voltage of typically 200 V. Stable V-I characteristics showing both the normal and abnormal regimes were observed and are consistent with the spread of the plasma over the cathode area. Due to their stability and lifetime, new applications of these DC, CBL-type microreactors can now be envisaged.

  11. SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

    KAUST Repository

    Ramadan, Khaled S.

    2012-01-01

    MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed

  12. Memória, Identidade e Patrimônio Quilombola

    Directory of Open Access Journals (Sweden)

    Rodrigo da Costa Segovia

    2015-12-01

    Full Text Available Este artigo visa analisar a Comunidade Quilombola, sua memória e identidade, nesse contexto busca-se dialogar com a pesquisa que está sendo desenvolvida junto a Comunidade Quilombo Madeira, bem como com o projeto para conclusão do Mestrado em Memória Social e Patrimônio Cultural da Universidade Federal de Pelotas. Sendo assim não foi possível deixar de fazer colocações relacionadas a Comunidades Quilombolas, em primeiro momento abordam-se questões relativas ao termo quilombola, logo a pós uma breve apresentação da comunidade onde a pesquisa está sendo efetuada e por final acerca-se com maior ênfase as discussões sobre Memória e Identidade.

  13. A self-adaptive thermal switch array for rapid temperature stabilization under various thermal power inputs

    International Nuclear Information System (INIS)

    Geng, Xiaobao; Patel, Pragnesh; Narain, Amitabh; Meng, Dennis Desheng

    2011-01-01

    A self-adaptive thermal switch array (TSA) based on actuation by low-melting-point alloy droplets is reported to stabilize the temperature of a heat-generating microelectromechanical system (MEMS) device at a predetermined range (i.e. the optimal working temperature of the device) with neither a control circuit nor electrical power consumption. When the temperature is below this range, the TSA stays off and works as a thermal insulator. Therefore, the MEMS device can quickly heat itself up to its optimal working temperature during startup. Once this temperature is reached, TSA is automatically turned on to increase the thermal conductance, working as an effective thermal spreader. As a result, the MEMS device tends to stay at its optimal working temperature without complex thermal management components and the associated parasitic power loss. A prototype TSA was fabricated and characterized to prove the concept. The stabilization temperatures under various power inputs have been studied both experimentally and theoretically. Under the increment of power input from 3.8 to 5.8 W, the temperature of the device increased only by 2.5 °C due to the stabilization effect of TSA

  14. A nuclear micro battery for Mems devices

    International Nuclear Information System (INIS)

    Lal, A.; Bilbao Y Leon, R.M.; Guo, H.; Li, H.; Santanam, S.; Yao, R.; Blanchard, J.; Henderson, D.

    2001-01-01

    Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include alpha and low-energy beta emitters. The sources are in both solid and liquid form, and a technique for plating a solid source from a liquid source has been investigated. Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. Performance results are provided for each of these concepts. (authors)

  15. Use of thermal cycling to reduce adhesion of OTS coated coated MEMS cantilevers

    Science.gov (United States)

    Ali, Shaikh M.; Phinney, Leslie M.

    2003-01-01

    °Microelectromechanical systems (MEMS) have enormous potential to contribute in diverse fields such as automotive, health care, aerospace, consumer products, and biotechnology, but successful commercial applications of MEMS are still small in number. Reliability of MEMS is a major impediment to the commercialization of laboratory prototypes. Due to the multitude of MEMS applications and the numerous processing and packaging steps, MEMS are exposed to a variety of environmental conditions, making the prediction of operational reliability difficult. In this paper, we investigate the effects of operating temperature on the in-use adhesive failure of electrostatically actuated MEMS microcantilevers coated with octadecyltrichlorosilane (OTS) films. The cantilevers are subjected to repeated temperature cycles and electrostatically actuated at temperatures between 25°C and 300°C in ambient air. The experimental results indicate that temperature cycling of the OTS coated cantilevers in air reduces the sticking probability of the microcantilevers. The sticking probability of OTS coated cantilevers was highest during heating, which decreased during cooling, and was lowest during reheating. Modifications to the OTS release method to increase its yield are also discussed.

  16. MEMS-Electronic-Photonic Heterogeneous Integrated FMCW Ladar Source

    Science.gov (United States)

    2015-12-18

    1   1.1.   E-­‐ PHI  PHASE  2  –  MEMS  LADAR  SOURCE...4   3.2.   PROPOSED  EO-­‐PLL   ARCHITECTURE  WITH  GATED  RAMP-­‐SWITCHING... PHI  Phase  2  –  MEMS  LADAR  Source   In  Phase  2,  we  continue  the  development  of  the  FMCW  LADAR

  17. Nanogenerators for self-powering nanosystems and piezotronics for smart MEMS/NEMS

    KAUST Repository

    Wang, Zhong Lin

    2011-01-01

    Two new fields are introduced to MEMS/NEMS: a nanogenerator that harvests mechanical energy for powering nanosystems, and strained induced piezotronics for smart MEMS. Fundamentally, due to the polarization of ions in a crystal that has non

  18. Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

    Science.gov (United States)

    Jah, Muzar; Simon, Eric; Sharma, Ashok

    2003-01-01

    Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

  19. Lembrar-esquecer: trabalhando com as memórias infantis

    Directory of Open Access Journals (Sweden)

    Renata Sieiro Fernandes

    Full Text Available Baseando-se nas obras de autores que focalizam a velhice e a memória, valemo-nos da proposta de construção de conjuntos fotográficos e da metodologia de análise para elaborar um exercício/desafio semelhante para crianças da faixa etária de 9-10 anos. Em concordância com os autores, também nos propusemos a pensar sobre como a memória das crianças - assim como a dos velhos - pode se construir e se organizar por meio de suportes fotográficos representativos de fragmentos da vida cotidiana. Os dois grupos compostos por seres que se encontram nas margens do tempo, se distanciam e se aproximam nessa particularidade. Intuitiva e reflexivamente, as crianças elaboraram seus conceitos de memória, envolvendo as lembranças e os esquecimentos, representando-os de formas visuais variadas e criativas, indicando que os movimentos constitutivos da memória dão indícios de tentativas de ordenação de um tempo composto de vários tempos.

  20. Wafer level packaging of MEMS

    International Nuclear Information System (INIS)

    Esashi, Masayoshi

    2008-01-01

    Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

  1. Miniaturization of components and systems for space using MEMS-technology

    Science.gov (United States)

    Grönland, Tor-Arne; Rangsten, Pelle; Nese, Martin; Lang, Martin

    2007-06-01

    Development of MEMS-based (micro electro mechanical system) components and subsystems for space applications has been pursued by various research groups and organizations around the world for at least two decades. The main driver for developing MEMS-based components for space is the miniaturization that can be achieved. Miniaturization can not only save orders of magnitude in mass and volume of individual components, but it can also allow increased redundancy, and enable novel spacecraft designs and mission scenarios. However, the commercial breakthrough of MEMS has not occurred within the space business as it has within other branches such as the IT/telecom or automotive industries, or as it has in biotech or life science applications. A main explanation to this is the highly conservative attitude to new technology within the space community. This conservatism is in many senses motivated by a very low risk acceptance in the few and costly space projects that actually ends with a space flight. To overcome this threshold there is a strong need for flight opportunities where reasonable risks can be accepted. Currently there are a few flight opportunities allowing extensive use of new technology in space, but one of the exceptions is the PRISMA program. PRISMA is an international (Sweden, Germany, France, Denmark, Norway, Greece) technology demonstration program with focus on rendezvous and formation flying. It is a two satellite LEO mission with a launch scheduled for the first half of 2009. On PRISMA, a number of novel technologies e.g. RF metrology sensor for Darwin, autonomous formation flying based on GPS and vision-based sensors, ADN-based "green propulsion" will be demonstrated in space for the first time. One of the satellites will also have a miniaturized propulsion system onboard based on MEMS-technology. This novel propulsion system includes two microthruster modules, each including four thrusters with micro- to milli-Newton thrust capability. The novelty

  2. Distúrbios de memória em pacientes epilépticos

    Directory of Open Access Journals (Sweden)

    STELLA FLORINDO

    1999-01-01

    Full Text Available O autor estudou distúrbios de memória em pacientes epilépticos com crises parciais complexas (CPC, com os objetivos de: 1 identificar estes distúrbios; e 2 comparar os resultados dos pacientes com os dos controles. Foram estudados 50 pacientes adultos e 20 sujeitos sem enfermidades neuropsiquiátricas. Os métodos consistiram em: 1 investigação da atividade mnemônica através do Teste de Memória de Wechsler (subtestes: Armazenamento e Recuperação, Memória Recente e Memória Imediata; e 2 comparação entre os resultados de ambos os grupos. 3 associação entre SPECT Cerebral e atividade mnemônica. Nos três subtestes, os pacientes apresentaram desempenho cognitivo significativamente inferior ao dos controles (p <0,05. Constatou-se a associação entre hipofluxo em região temporal esquerda e distúrbio da memória nos três subtestes. Concluiu-se que há associação entre CPC e distúrbios da atividade mnemônica.

  3. A Palladium-Tin Modified Microband Electrode Array for Nitrate Determination

    Directory of Open Access Journals (Sweden)

    Yexiang Fu

    2015-09-01

    Full Text Available A microband electrode array modified with palladium-tin bimetallic composite has been developed for nitrate determination. The microband electrode array was fabricated by Micro Electro-Mechanical System (MEMS technique. Palladium and tin were electrodeposited successively on the electrode, forming a double-layer structure. The effect of the Pd-Sn composite was investigated and its enhancement of catalytic activity and lifetime was revealed. The Pd-Sn modified electrode showed good linearity (R2 = 0.998 from 1 mg/L to 20 mg/L for nitrate determination with a sensitivity of 398 μA/(mg∙L−1∙cm2. The electrode exhibited a satisfying analytical performance after 60 days of storage, indicating a long lifetime. Good repeatability was also displayed by the Pd-Sn modified electrodes. The results provided an option for nitrate determination in water.

  4. Evaluation of MEMS-Based Wireless Accelerometer Sensors in Detecting Gear Tooth Faults in Helicopter Transmissions

    Science.gov (United States)

    Lewicki, David George; Lambert, Nicholas A.; Wagoner, Robert S.

    2015-01-01

    The diagnostics capability of micro-electro-mechanical systems (MEMS) based rotating accelerometer sensors in detecting gear tooth crack failures in helicopter main-rotor transmissions was evaluated. MEMS sensors were installed on a pre-notched OH-58C spiral-bevel pinion gear. Endurance tests were performed and the gear was run to tooth fracture failure. Results from the MEMS sensor were compared to conventional accelerometers mounted on the transmission housing. Most of the four stationary accelerometers mounted on the gear box housing and most of the CI's used gave indications of failure at the end of the test. The MEMS system performed well and lasted the entire test. All MEMS accelerometers gave an indication of failure at the end of the test. The MEMS systems performed as well, if not better, than the stationary accelerometers mounted on the gear box housing with regards to gear tooth fault detection. For both the MEMS sensors and stationary sensors, the fault detection time was not much sooner than the actual tooth fracture time. The MEMS sensor spectrum data showed large first order shaft frequency sidebands due to the measurement rotating frame of reference. The method of constructing a pseudo tach signal from periodic characteristics of the vibration data was successful in deriving a TSA signal without an actual tach and proved as an effective way to improve fault detection for the MEMS.

  5. Micro-fabrication technology for piezoelectric film formation and its application to MEMS

    OpenAIRE

    一木, 正聡; 曹, 俊杰; 張, 麓〓; 王, 占杰; 前田, 龍太郎; Masaaki, ICHIKI; Jiunn Jye, TSAUR; Lulu, ZHANG; Zhang Jie, WANG; Ryutaro, MAEDA; 産業技術総合研究所; 産業技術総合研究所; 産業技術総合研究所; 東北大学; 産業技術総合研究所

    2005-01-01

    Technological problems for realization of Micro Electro-mechanical System (MEMS) are discussed and an introduction of smart materials (PZT) is encouraged. The film formation and micromaching technology are discussed in integration of PZT thin films into MEMS. Further developments are proposed on PZT micro sensors and actuators with special emphasis laid on exploration of new application fields of MEMS, such as scanning mirror. Internal stress is estimated and analyzed for the improvement of d...

  6. Feasibility of Frequency-Modulated Wireless Transmission for a Multi-Purpose MEMS-Based Accelerometer

    Directory of Open Access Journals (Sweden)

    Alessandro Sabato

    2014-09-01

    Full Text Available Recent advances in the Micro Electro-Mechanical System (MEMS technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM of civil engineering structures. To date, sensors’ low sensitivity and accuracy—especially at very low frequencies—have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor’s analog signals are converted to digital signals before radio-frequency (RF wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F instead of the conventional Analog to Digital Conversion (ADC. In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

  7. U.S. Army Corrosion Office's storage and quality requirements for military MEMS program

    Science.gov (United States)

    Zunino, J. L., III; Skelton, D. R.

    2007-04-01

    As the Army transforms into a more lethal, lighter and agile force, the technologies that support these systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army and DOD will rely on heavily to accomplish these objectives. Conditions for utilization of MEMS by the military are unique. Operational and storage environments for the military are significantly different than those found in the commercial sector. Issues unique to the military include; high G-forces during gun launch, extreme temperature and humidity ranges, extended periods of inactivity (20 years plus) and interaction with explosives and propellants. The military operational environments in which MEMS will be stored or required to function are extreme and far surpass any commercial operating conditions. Security and encryption are a must for all MEMS communication, tracking, or data reporting devices employed by the military. Current and future military applications of MEMS devices include safety and arming devices, fuzing devices, various guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless Radio Frequency Identifications (RFIDs) and network systems, GPS's, radar systems, mobile base systems and information technology. MEMS embedded into these weapons systems will provide the military with new levels of speed, awareness, lethality, and information dissemination. The system capabilities enhanced by MEMS will translate directly into tactical and strategic military advantages.

  8. Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplates

    KAUST Repository

    Lizardo, Ernesto B.

    2013-01-01

    Micro-electro-mechanical systems (MEMS) became possible thanks to the silicon based technology used to fabricate integrated circuits. Originally, MEMS fabrication was limited to silicon based techniques and materials, but the expansion of MEMS

  9. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

    Science.gov (United States)

    Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H; Peterson, Tracy C; Shul, Randy J; Ahlers, Catalina; Plut, Thomas A; Patrizi, Gary A

    2013-12-03

    In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

  10. MEMS for Space Flight Applications

    Science.gov (United States)

    Lawton, R.

    1998-01-01

    Micro-Electrical Mechanical Systems (MEMS) are entering the stage of design and verification to demonstrate the utility of the technology for a wide range of applications including sensors and actuators for military, space, medical, industrial, consumer, automotive and instrumentation products.

  11. MEMS and mil/aero: technology push and market pull

    Science.gov (United States)

    Clifford, Thomas H.

    2001-04-01

    MEMS offers attractive solutions to high-density fluidics, inertial, optical, switching and other demanding military/aerospace (mil/aero) challenges. However, full acceptance must confront the realities of production-scale producibility, verifiability, testability, survivability, as well as long-term reliability. Data on these `..ilities' are crucial, and are central in funding and deployment decisions. Similarly, mil/aero users must highlight specific missions, environmental exposures, and procurement issues, as well as the quirks of its designers. These issues are particularly challenging in MEMS, because of the laws of physics and business economics, as well as the risks of deploying leading-edge technology into no-fail applications. This paper highlights mil/aero requirements, and suggests reliability/qualification protocols, to guide development effort and to reassure mil/aero users that MEMS labs are mindful of the necessary realities.

  12. Amplitude saturation of MEMS resonators explained by autoparametric resonance

    International Nuclear Information System (INIS)

    Van der Avoort, C; Bontemps, J J M; Steeneken, P G; Le Phan, K; Van Beek, J T M; Van der Hout, R; Hulshof, J; Fey, R H B

    2010-01-01

    This paper describes a phenomenon that limits the power handling of MEMS resonators. It is observed that above a certain driving level, the resonance amplitude becomes independent of the driving level. In contrast to previous studies of power handling of MEMS resonators, it is found that this amplitude saturation cannot be explained by nonlinear terms in the spring constant or electrostatic force. Instead we show that the amplitude in our experiments is limited by nonlinear terms in the equation of motion which couple the in-plane length-extensional resonance mode to one or more out-of-plane (OOP) bending modes. We present experimental evidence for the autoparametric excitation of these OOP modes using a vibrometer. The measurements are compared to a model that can be used to predict a power-handling limit for MEMS resonators

  13. Amplitude saturation of MEMS resonators explained by autoparametric resonance

    Energy Technology Data Exchange (ETDEWEB)

    Van der Avoort, C; Bontemps, J J M; Steeneken, P G; Le Phan, K; Van Beek, J T M [NXP Research, Eindhoven (Netherlands); Van der Hout, R; Hulshof, J [Department of Mathematics, VU University—Faculty of Sciences, De Boelelaan 1081a, 1081 HV Amsterdam (Netherlands); Fey, R H B, E-mail: cas.van.der.avoort@nxp.com [Department of Mechanical Engineering, Eindhoven University of Technology, PO Box 513, 5600 MB, Eindhoven (Netherlands)

    2010-10-15

    This paper describes a phenomenon that limits the power handling of MEMS resonators. It is observed that above a certain driving level, the resonance amplitude becomes independent of the driving level. In contrast to previous studies of power handling of MEMS resonators, it is found that this amplitude saturation cannot be explained by nonlinear terms in the spring constant or electrostatic force. Instead we show that the amplitude in our experiments is limited by nonlinear terms in the equation of motion which couple the in-plane length-extensional resonance mode to one or more out-of-plane (OOP) bending modes. We present experimental evidence for the autoparametric excitation of these OOP modes using a vibrometer. The measurements are compared to a model that can be used to predict a power-handling limit for MEMS resonators.

  14. Avaliação da memória sob anestesia venosa total

    Directory of Open Access Journals (Sweden)

    Gulistan Aktas

    2013-06-01

    Full Text Available JUSTIFICATIVA E OBJETIVOS: Neste estudo, objetivamos avaliar a memória implícita e explícita em pacientes submetidos à cirurgia abdominal sob anestesia venosa total (AVT com propofol e remifentanil, na qual o nível de anestesia foi controlado pelo monitoramento do índice bispectral (BIS. MÉTODO: Anestesia venosa total foi administrada a 60 pacientes adultos para obter níveis de BIS de 40-60. Os pacientes foram randomicamente divididos em três grupos, de acordo com as gravações que ouviram. Os pacientes do grupo categoria (CT ouviram uma fita gravada contendo cinco nomes de animais. Os pacientes do grupo recordar palavras (RP ouviram uma fita gravada contendo cinco palavras de frequência média na língua turca, depois de adaptadas. Os pacientes do grupo controle (GC ouviram os sons do mar até o fim da cirurgia. Duas horas após a cirurgia, os testes foram administrados a cada paciente na sala de recuperação para avaliar a memória. RESULTADOS: Houve uma diferença entre os escores dos grupos CT e GC no Miniexame do Estado Mental (MMSE; todos os escores foram > 20. Os resultados dos testes de categoria e recordar palavras, aplicados para avaliar a memória implícita, não foram estatisticamente diferentes entre os grupos. Não houve evidência de memória implícita em nenhum dos pacientes. Um paciente lembrou-se de ouvir "o som de água" como uma prova de memória explícita. Onze pacientes declararam não ter sonhado. CONCLUSÕES: Apesar de não termos encontrado nenhuma evidência de memória implícita sob anestesia adequada com AVT, um paciente apresentou memória explícita. Embora a profundidade adequada da anestesia fornecida pelo monitoramento do BIS corrobore nossos resultados para a memória implícita, ela não explica os resultados para a memória explícita.

  15. Integrated Magnetic MEMS Relays: Status of the Technology

    Directory of Open Access Journals (Sweden)

    Giuseppe Schiavone

    2014-08-01

    Full Text Available The development and application of magnetic technologies employing microfabricated magnetic structures for the production of switching components has generated enormous interest in the scientific and industrial communities over the last decade. Magnetic actuation offers many benefits when compared to other schemes for microelectromechanical systems (MEMS, including the generation of forces that have higher magnitude and longer range. Magnetic actuation can be achieved using different excitation sources, which create challenges related to the integration with other technologies, such as CMOS (Complementary Metal Oxide Semiconductor, and the requirement to reduce power consumption. Novel designs and technologies are therefore sought to enable the use of magnetic switching architectures in integrated MEMS devices, without incurring excessive energy consumption. This article reviews the status of magnetic MEMS technology and presents devices recently developed by various research groups, with key focuses on integrability and effective power management, in addition to the ability to integrate the technology with other microelectronic fabrication processes.

  16. Finite element modeling of micromachined MEMS photon devices

    Science.gov (United States)

    Evans, Boyd M., III; Schonberger, D. W.; Datskos, Panos G.

    1999-09-01

    The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.

  17. Finite Element Modeling of Micromachined MEMS Photon Devices

    International Nuclear Information System (INIS)

    Datskos, P.G.; Evans, B.M.; Schonberger, D.

    1999-01-01

    The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness

  18. Design of a multi-axis implantable MEMS sensor for intraosseous bone stress monitoring

    International Nuclear Information System (INIS)

    Alfaro, Fernando; Weiss, Lee; Campbell, Phil; Fedder, Gary K; Miller, Mark

    2009-01-01

    The capability to assess the biomechanical properties of living bone is important for basic research as well as the clinical management of skeletal trauma and disease. Even though radiodensitometric imaging is commonly used to infer bone quality, bone strength does not necessarily correlate well with these non-invasive measurements. This paper reports on the design, fabrication and initial testing of an implantable ultra-miniature multi-axis sensor for directly measuring bone stresses at a micro-scale. The device, which is fabricated with CMOS-MEMS processes, is intended to be permanently implanted within open fractures, or embedded in bone grafts, or placed on implants at the interfaces between bone and prosthetics. The stress sensor comprises an array of piezoresistive pixels to detect a stress tensor at the interfacial area between the MEMS chip and bone, with a resolution to 100 Pa, in 1 s averaging. The sensor system design and manufacture is also compatible with the integration of wireless RF telemetry, for power and data retrieval, all within a 3 mm × 3 mm × 0.3 mm footprint. The piezoresistive elements are integrated within a textured surface to enhance sensor integration with bone. Finite element analysis led to a sensor design for normal and shear stress detection. A wired sensor was fabricated in the Jazz 0.35 µm BiCMOS process and then embedded in mock bone material to characterize its response to tensile and bending loads up to 250 kPa

  19. A Musical instrument in MEMS

    NARCIS (Netherlands)

    Engelen, Johannes Bernardus Charles; de Boer, Hans L.; de Boer, H.; Beekman, J.G.; Been, A.J.; Folkertsma, Gerrit Adriaan; Folkertsma, G.A.; Fortgens, L.; de Graaf, D.; Vocke, S.; Woldering, L.A.; Abelmann, Leon; Elwenspoek, Michael Curt

    In this work we describe a MEMS instrument that resonates at audible frequencies, and with which music can be made. The sounds are generated by mechanical resonators and capacitive displacement sensors. Damping by air scales unfavourably for generating audible frequencies with small devices.

  20. MEMS based digital transform spectrometers

    Science.gov (United States)

    Geller, Yariv; Ramani, Mouli

    2005-09-01

    Earlier this year, a new breed of Spectrometers based on Micro-Electro-Mechanical-System (MEMS) engines has been introduced to the commercial market. The use of these engines combined with transform mathematics, produces powerful spectrometers at unprecedented low cost in various spectral regions.

  1. Aprendizado e memória Learning and memory

    Directory of Open Access Journals (Sweden)

    Paul Lombroso

    2004-09-01

    Full Text Available A memória é dividida de duas grandes formas: explícita e implícita. O hipocampo é necessário para a formação das memórias explícitas, ao passo que várias outras regiões do cérebro, incluindo o estriado, a amígdala e o nucleus accumbens, estão envolvidos na formação das memórias implícitas. A formação de todas as memórias requer alterações morfológicas nas sinapses: novas sinapses devem ser formadas ou antigas precisam ser fortalecidas. Considera-se que essas alterações reflitam a base celular subjacente das memórias persistentes. Consideráveis avanços têm ocorrido na última década em relação a nossa compreensão sobre as bases moleculares da formação dessas memórias. Um regulador-chave da plasticidade sináptica é uma via de sinalização que inclui a proteína-quinase ativada por mitógenos (MAP. Como essa via é necessária para a memória e o aprendizado normais, não é surpreendente que as mutações nos membros dessa via levem a prejuízos no aprendizado. A neurofibromatose, a síndrome de Coffin-Lowry e a de Rubinstein-Taybi são três exemplos de transtornos de desenvolvimento que apresentam mutações em componentes-chave na via de sinalização da proteína-quinase MAP.Memory is broadly divided into declarative and nondeclarative forms of memory. The hippocampus is required for the formation of declarative memories, while a number of other brain regions including the striatum, amygdala and nucleus accumbens are involved in the formation of nondeclarative memories. The formation of all memories require morphological changes of synapses: new ones must be formed or old ones strengthened. These changes are thought to reflect the underlying cellular basis for persistent memories. Considerable advances have occurred over the last decade in our understanding of the molecular bases of how these memories are formed. A key regulator of synaptic plasticity is a signaling pathway that includes the mitogen

  2. Cryogenic MEMS Pressure Sensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — A directly immersible cryogenic MEMS pressure sensor will be developed. Each silicon die will contain a vacuum-reference and a tent-like membrane. Offsetting thermal...

  3. Array Phase Shifters: Theory and Technology

    Science.gov (United States)

    Romanofsky, Robert R.

    2007-01-01

    While there are a myriad of applications for microwave phase shifters in instrumentation and metrology, power combining, amplifier linearization, and so on, the most prevalent use is in scanning phased-array antennas. And while this market continues to be dominated by military radar and tracking platforms, many commercial applications have emerged in the past decade or so. These new and potential applications span low-Earth-orbit (LEO) communications satellite constellations and collision warning radar, an aspect of the Intelligent Vehicle Highway System or Automated Highway System. In any case, the phase shifters represent a considerable portion of the overall antenna cost, with some estimates approaching 40 percent for receive arrays. Ferrite phase shifters continue to be the workhorse in military-phased arrays, and while there have been advances in thin film ferrite devices, the review of this device technology in the previous edition of this book is still highly relevant. This chapter will focus on three types of phase shifters that have matured in the past decade: GaAs MESFET monolithic microwave integrated circuit (MMIC), micro-electromechanical systems (MEMS), and thin film ferroelectric-based devices. A brief review of some novel devices including thin film ferrite phase shifters and superconducting switches for phase shifter applications will be provided. Finally, the effects of modulo 2 phase shift limitations, phase errors, and transient response on bit error rate degradation will be considered.

  4. Vortex-MEMS filters for wavelength-selective orbital-angular-momentum beam generation

    DEFF Research Database (Denmark)

    Paul, Sujoy; Lyubopytov, Vladimir; Schumann, Martin F.

    2017-01-01

    In this paper an on-chip device capable of wavelength-selective generation of vortex beams is demonstrated. The device is realized by integrating a spiral phase-plate onto a MEMS tunable Fabry-Perot filter. This vortex-MEMS filter, being capable of functioning simultaneously in wavelength...

  5. Development of Dual-Axis MEMS Accelerometers for Machine Tools Vibration Monitoring

    Directory of Open Access Journals (Sweden)

    Chih-Yung Huang

    2016-07-01

    Full Text Available With the development of intelligent machine tools, monitoring the vibration by the accelerometer is an important issue. Accelerometers used for measuring vibration signals during milling processes require the characteristics of high sensitivity, high resolution, and high bandwidth. A commonly used accelerometer is the lead zirconate titanate (PZT type; however, integrating it into intelligent modules is excessively expensive and difficult. Therefore, the micro electro mechanical systems (MEMS accelerometer is an alternative with the advantages of lower price and superior integration. In the present study, we integrated two MEMS accelerometer chips into a low-pass filter and housing to develop a low-cost dual-axis accelerometer with a bandwidth of 5 kHz and a full scale range of ±50 g for measuring machine tool vibration. In addition, a platform for measuring the linearity, cross-axis sensitivity and frequency response of the MEMS accelerometer by using the back-to-back calibration method was also developed. Finally, cutting experiments with steady and chatter cutting were performed to verify the results of comparing the MEMS accelerometer with the PZT accelerometer in the time and frequency domains. The results demonstrated that the dual-axis MEMS accelerometer is suitable for monitoring the vibration of machine tools at low cost.

  6. Laser-heating wire bonding on MEMS packaging

    Directory of Open Access Journals (Sweden)

    Yuetao Liu

    2014-02-01

    Full Text Available Making connections is critical in fabrication of MEMS (Micro-Electro-Mechanical Systems. It is also complicated, because the temperature during joining affects both the bond produced and the structure and mechanical properties of the moving parts of the device. Specifications for MEMS packaging require that the temperature not exceed 240 °C. However, usually, temperatures can reach up to 300 °C during conventional thermosonic wire bonding. Such a temperature will change the distribution of dopants in CMOS (Complementary Metal Oxide Semiconductor circuits. In this paper we propose a new heating process. A semiconductor laser (wavelength 808 nm is suggested as the thermal source for wire bonding. The thermal field of this setup was analyzed, and specific mathematical models of the field were built. Experimental results show that the heating can be focused on the bonding pad, and that much lower heat conduction occurs, compared with that during the normal heating method. The bond strength increases with increasing laser power. The bond strengths obtained with laser heating are slightly lower than those obtained with the normal heating method, but can still meet the strength requirements for MEMS.

  7. MEMS-based microspectrometer technologies for NIR and MIR wavelengths

    International Nuclear Information System (INIS)

    Schuler, Leo P; Milne, Jason S; Dell, John M; Faraone, Lorenzo

    2009-01-01

    Commercially manufactured near-infrared (NIR) instruments became available about 50 years ago. While they have been designed for laboratory use in a controlled environment and boast high performance, they are generally bulky, fragile and maintenance intensive, and therefore expensive to purchase and maintain. Micromachining is a powerful technique to fabricate micromechanical parts such as integrated circuits. It was perfected in the 1980s and led to the invention of micro electro mechanical systems (MEMSs). The three characteristic features of MEMS fabrication technologies are miniaturization, multiplicity and microelectronics. Combined, these features allow the batch production of compact and rugged devices with integrated intelligence. In order to build more compact, more rugged and less expensive NIR instruments, MEMS technology has been successfully integrated into a range of new devices. In the first part of this paper we discuss the UWA MEMS-based Fabry-Perot spectrometer, its design and issues to be solved. MEMS-based Fabry-Perot filters primarily isolate certain wavelengths by sweeping across an incident spectrum and the resulting monochromatic signal is detected by a broadband detector. In the second part, we discuss other microspectrometers including other Fabry-Perot spectrometer designs, time multiplexing devices and mixed time/space multiplexing devices. (topical review)

  8. Wireless MEMs BioSensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

  9. MEMS Sensors and Actuators Laboratory (MSAL)

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS Sensors and Actuators Laboratory (MSAL) in the A.J. Clark School of Engineering at the University of Maryland (UMD) was established in January 2000. Our lab...

  10. A ABEn e a preservação da memória profissional: implantação do Centro de Memória da Enfermagem Brasileira

    OpenAIRE

    Santos, Tânia Cristina Franco

    2013-01-01

    Estudo histórico-social, que objetivou analisar e discutir a importância do Centro de Memória da Enfermagem Brasileira para preservação e divulgação da memória profissional. Utilizou-se como fontes de dados o documentário Associação Brasileira de Enfermagem: 1926-1976, além do Projeto de Implantação e do Relatório Técnico do Acervo Documental e Fônico do Centro de Memória, ambos arquivados no referido Centro. Os dados, coletados em junho de 2013, foram submetidos a crítica externa e interna, ...

  11. Videometrics-based Detection of Vibration Linearity in MEMS Gyroscope

    Directory of Open Access Journals (Sweden)

    Yong Zhou

    2011-05-01

    Full Text Available MEMS gyroscope performs as a sort of sensor to detect angular velocity, with diverse applications in engineering including vehicle and intelligent traffic etc. A balanced vibration of driving module excited by electrostatic driving signal is the base MEMS gyroscope's performance. In order to analyze the linear property of vibration in MEMS Gyroscope, a method of computer vision measuring is applied with the help of high-speed vidicon to obtain video of linear vibration of driving module in gyroscope, under the driving voltage signal of inherent frequency and amplitude linearly increasing. By means of image processing, target identifying, and motion parameter extracting from the obtained video, vibration curve with time variation is acquired. And then, linearity of this vibration system can be analyzed by focusing on the amplitude value of vibration responding to the amplitude variation of driving voltage signal.

  12. Modeling of biaxial gimbal-less MEMS scanning mirrors

    Science.gov (United States)

    von Wantoch, Thomas; Gu-Stoppel, Shanshan; Senger, Frank; Mallas, Christian; Hofmann, Ulrich; Meurer, Thomas; Benecke, Wolfgang

    2016-03-01

    One- and two-dimensional MEMS scanning mirrors for resonant or quasi-stationary beam deflection are primarily known as tiny micromirror devices with aperture sizes up to a few Millimeters and usually address low power applications in high volume markets, e.g. laser beam scanning pico-projectors or gesture recognition systems. In contrast, recently reported vacuum packaged MEMS scanners feature mirror diameters up to 20 mm and integrated high-reflectivity dielectric coatings. These mirrors enable MEMS based scanning for applications that require large apertures due to optical constraints like 3D sensing or microscopy as well as for high power laser applications like laser phosphor displays, automotive lighting and displays, 3D printing and general laser material processing. This work presents modelling, control design and experimental characterization of gimbal-less MEMS mirrors with large aperture size. As an example a resonant biaxial Quadpod scanner with 7 mm mirror diameter and four integrated PZT (lead zirconate titanate) actuators is analyzed. The finite element method (FEM) model developed and computed in COMSOL Multiphysics is used for calculating the eigenmodes of the mirror as well as for extracting a high order (n system inputs and scanner displacement as system output. By applying model order reduction techniques using MATLABR a compact state space system approximation of order n = 6 is computed. Based on this reduced order model feedforward control inputs for different, properly chosen scanner displacement trajectories are derived and tested using the original FEM model as well as the micromirror.

  13. MEMS-based, RF-driven, compact accelerators

    Science.gov (United States)

    Persaud, A.; Seidl, P. A.; Ji, Q.; Breinyn, I.; Waldron, W. L.; Schenkel, T.; Vinayakumar, K. B.; Ni, D.; Lal, A.

    2017-10-01

    Shrinking existing accelerators in size can reduce their cost by orders of magnitude. Furthermore, by using radio frequency (RF) technology and accelerating ions in several stages, the applied voltages can be kept low paving the way to new ion beam applications. We make use of the concept of a Multiple Electrostatic Quadrupole Array Linear Accelerator (MEQALAC) and have previously shown the implementation of its basic components using printed circuit boards, thereby reducing the size of earlier MEQALACs by an order of magnitude. We now demonstrate the combined integration of these components to form a basic accelerator structure, including an initial beam-matching section. In this presentation, we will discuss the results from the integrated multi-beam ion accelerator and also ion acceleration using RF voltages generated on-board. Furthermore, we will show results from Micro-Electro-Mechanical Systems (MEMS) fabricated focusing wafers, which can shrink the dimension of the system to the sub-mm regime and lead to cheaper fabrication. Based on these proof-of-concept results we outline a scaling path to high beam power for applications in plasma heating in magnetized target fusion and in neutral beam injectors for future Tokamaks. This work was supported by the Office of Science of the US Department of Energy through the ARPA-e ALPHA program under contracts DE-AC02-05CH11231.

  14. Movable MEMS Devices on Flexible Silicon

    KAUST Repository

    Ahmed, Sally

    2013-05-05

    Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS actuators and sensors can play critical role to extend the application areas of flexible electronics, fabricating movable MEMS devices on flexible substrates is highly challenging. Therefore, this thesis reports a process for fabricating free standing and movable MEMS devices on flexible silicon substrates; MEMS flexure thermal actuators have been fabricated to illustrate the viability of the process. Flexure thermal actuators consist of two arms: a thin hot arm and a wide cold arm separated by a small air gap; the arms are anchored to the substrate from one end and connected to each other from the other end. The actuator design has been modified by adding etch holes in the anchors to suit the process of releasing a thin layer of silicon from the bulk silicon substrate. Selecting materials that are compatible with the release process was challenging. Moreover, difficulties were faced in the fabrication process development; for example, the structural layer of the devices was partially etched during silicon release although it was protected by aluminum oxide which is not attacked by the releasing gas . Furthermore, the thin arm of the thermal actuator was thinned during the fabrication process but optimizing the patterning and etching steps of the structural layer successfully solved this problem. Simulation was carried out to compare the performance of the original and the modified designs for the thermal actuators and to study stress and temperature distribution across a device. A fabricated thermal actuator with a 250 μm long hot arm and a 225 μm long cold arm separated by a 3 μm gap produced a deflection of 3 μm before silicon release, however, the fabrication process must be optimized to obtain fully functioning

  15. MEMS and Nano-Technology Clean Room

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS and Nano-Technology Clean Room is a state-of-the-art, 800 square foot, Class 1000-capable facility used for development of micro and sub-micro scale sensors...

  16. Enabling MEMS technologies for communications systems

    Science.gov (United States)

    Lubecke, Victor M.; Barber, Bradley P.; Arney, Susanne

    2001-11-01

    Modern communications demands have been steadily growing not only in size, but sophistication. Phone calls over copper wires have evolved into high definition video conferencing over optical fibers, and wireless internet browsing. The technology used to meet these demands is under constant pressure to provide increased capacity, speed, and efficiency, all with reduced size and cost. Various MEMS technologies have shown great promise for meeting these challenges by extending the performance of conventional circuitry and introducing radical new systems approaches. A variety of strategic MEMS structures including various cost-effective free-space optics and high-Q RF components are described, along with related practical implementation issues. These components are rapidly becoming essential for enabling the development of progressive new communications systems technologies including all-optical networks, and low cost multi-system wireless terminals and basestations.

  17. Integrated MEMS-based variable optical attenuator and 10Gb/s receiver

    Science.gov (United States)

    Aberson, James; Cusin, Pierre; Fettig, H.; Hickey, Ryan; Wylde, James

    2005-03-01

    MEMS devices can be successfully commercialized in favour of competing technologies only if they offer an advantage to the customer in terms of lower cost or increased functionality. There are limited markets where MEMS can be manufactured cheaper than similar technologies due to large volumes: automotive, printing technology, wireless communications, etc. However, success in the marketplace can also be realized by adding significant value to a system at minimal cost or leverging MEMS technology when other solutions simply will not work. This paper describes a thermally actuated, MEMS based, variable optical attenuator that is co-packaged with existing opto-electronic devices to develop an integrated 10Gb/s SONET/SDH receiver. The configuration of the receiver opto-electronics and relatively low voltage availability (12V max) in optical systems bar the use of LCD, EO, and electro-chromic style attenuators. The device was designed and fabricated using a silicon-on-insulator (SOI) starting material. The design and performance of the device (displacement, power consumption, reliability, physical geometry) was defined by the receiver parameters geometry. This paper will describe how these design parameters (hence final device geometry) were determined in light of both the MEMS device fabrication process and the receiver performance. Reference will be made to the design tools used and the design flow which was a joint effort between the MEMS vendor and the end customer. The SOI technology offered a robust, manufacturable solution that gave the required performance in a cost-effective process. However, the singulation of the devices required the development of a new singulation technique that allowed large volumes of silicon to be removed during fabrication yet still offer high singulation yields.

  18. Ultra-thin alumina and silicon nitride MEMS fabricated membranes for the electron multiplication

    Science.gov (United States)

    Prodanović, V.; Chan, H. W.; Graaf, H. V. D.; Sarro, P. M.

    2018-04-01

    In this paper we demonstrate the fabrication of large arrays of ultrathin freestanding membranes (tynodes) for application in a timed photon counter (TiPC), a novel photomultiplier for single electron detection. Low pressure chemical vapour deposited silicon nitride (Si x N y ) and atomic layer deposited alumina (Al2O3) with thicknesses down to only 5 nm are employed for the membrane fabrication. Detailed characterization of structural, mechanical and chemical properties of the utilized films is carried out for different process conditions and thicknesses. Furthermore, the performance of the tynodes is investigated in terms of secondary electron emission, a fundamental attribute that determines their applicability in TiPC. Studied features and presented fabrication methods may be of interest for other MEMS application of alumina and silicon nitride as well, in particular where strong ultra-thin membranes are required.

  19. Design and Fabrication of a Reconfigurable MEMS-Based Antenna

    KAUST Repository

    Martinez, Miguel Angel Galicia

    2011-06-22

    This thesis presents the design and fabrication of a customized in house Micro-Electro-Mechanical-Systems (MEMS) process based on-chip antenna that is both frequency and polarization reconfigurable. It is designed to work at both 60 GHz and 77 GHz through MEMS switches. This antenna can also work in both horizontal and vertical linear polarizations by utilizing a moveable plate. The design is intended for Wireless Personal Area Networks (WPAN) and automotive radar applications. Typical on-chip antennas are inefficient and difficult to reconfigure. Therefore, the focus of this work is to develop an efficient on-chip antenna solution, which is reconfigurable in frequency and in polarization. A fractal bowtie antenna is employed for this thesis, which achieves frequency reconfigurability through MEMS switches. The design is simulated in industry standard Electromagnetic (EM) simulator Ansoft HFSS. A novel concept for horizontal to vertical linear polarization agility is introduced which incorporates a moveable polymer plate. For this work, a microprobe is used to move the plate from the horizontal to vertical position. For testing purposes, a novel mechanism has been designed in order to feed the antenna with RF-probes in both horizontal and vertical positions. A simulated gain of approximately 0 dB is achieved at both target frequencies (60 and 77 GHz), in both horizontal and vertical positions. In all the cases mentioned above (both frequencies and positions), the antenna is well matched (< -10 dB) to the 50 Ω system impedance. Similarly, the radiation nulls are successfully shifted by changing the position of the antenna from horizontal to vertical. The complete design and fabrication of the reconfigurable MEMS antenna has been done at KAUST facilities. Some challenges have been encountered during its realization due to the immaturity of the customized MEMS fabrication process. Nonetheless, a first fabrication attempt has highlighted such shortcomings. According

  20. Direct integration of MEMS, dielectric pumping and cell manipulation with reversibly bonded gecko adhesive microfluidics

    International Nuclear Information System (INIS)

    Warnat, S; King, H; Hubbard, T; Wasay, A; Sameoto, D

    2016-01-01

    We present an approach to form a microfluidic environment on top of MEMS dies using reversibly bonded microfluidics. The reversible polymeric microfluidics moulds bond to the MEMS die using a gecko-inspired gasket architecture. In this study the formed microchannels are demonstrated in conjunction with a MEMS mechanical single cell testing environment for BioMEMS applications. A reversible microfluidics placement technique with an x - y and rotational accuracy of  ±2 µ m and 1° respectively on a MEMS die was developed. No leaks were observed during pneumatic pumping of common cell media (PBS, sorbitol, water, seawater) through the fluidic channels. Thermal chevron actuators were successful operated inside this fluidic environment and a performance deviation of ∼15% was measured compared to an open MEMS configuration. Latex micro-spheres were pumped using traveling wave di-electrophoresis and compared to an open (no-microfluidics) configuration with velocities of 24 µ m s −1 and 20 µ m s −1 . (technical note)

  1. Movable MEMS Devices on Flexible Silicon

    KAUST Repository

    Ahmed, Sally

    2013-01-01

    Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS

  2. Payload characterization for CubeSat demonstration of MEMS deformable mirrors

    Science.gov (United States)

    Marinan, Anne; Cahoy, Kerri; Webber, Matthew; Belikov, Ruslan; Bendek, Eduardo

    2014-08-01

    Coronagraphic space telescopes require wavefront control systems for high-contrast imaging applications such as exoplanet direct imaging. High-actuator-count MEMS deformable mirrors (DM) are a key element of these wavefront control systems yet have not been flown in space long enough to characterize their on-orbit performance. The MEMS Deformable Mirror CubeSat Testbed is a conceptual nanosatellite demonstration of MEMS DM and wavefront sensing technology. The testbed platform is a 3U CubeSat bus. Of the 10 x 10 x 34.05 cm (3U) available volume, a 10 x 10 x 15 cm space is reserved for the optical payload. The main purpose of the payload is to characterize and calibrate the onorbit performance of a MEMS deformable mirror over an extended period of time (months). Its design incorporates both a Shack Hartmann wavefront sensor (internal laser illumination), and a focal plane sensor (used with an external aperture to image bright stars). We baseline a 32-actuator Boston Micromachines Mini deformable mirror for this mission, though the design is flexible and can be applied to mirrors from other vendors. We present the mission design and payload architecture and discuss experiment design, requirements, and performance simulations.

  3. Resonant Magnetic Field Sensors Based On MEMS Technology

    Directory of Open Access Journals (Sweden)

    Elías Manjarrez

    2009-09-01

    Full Text Available Microelectromechanical systems (MEMS technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

  4. Resonant Magnetic Field Sensors Based On MEMS Technology

    Science.gov (United States)

    Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías

    2009-01-01

    Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480

  5. Electrical latching of microelectromechanical devices

    Science.gov (United States)

    Garcia, Ernest J.; Sleefe, Gerard E.

    2004-11-02

    Methods are disclosed for row and column addressing of an array of microelectromechanical (MEM) devices. The methods of the present invention are applicable to MEM micromirrors or memory elements and allow the MEM array to be programmed and maintained latched in a programmed state with a voltage that is generally lower than the voltage required for electrostatically switching the MEM devices.

  6. A Compact and Low-Cost MEMS Loudspeaker for Digital Hearing Aids.

    Science.gov (United States)

    Sang-Soo Je; Rivas, F; Diaz, R E; Jiuk Kwon; Jeonghwan Kim; Bakkaloglu, B; Kiaei, S; Junseok Chae

    2009-10-01

    A microelectromechanical-systems (MEMS)-based electromagnetically actuated loudspeaker to reduce form factor, cost, and power consumption, and increase energy efficiency in hearing-aid applications is presented. The MEMS loudspeaker has multilayer copper coils, an NiFe soft magnet on a thin polyimide diaphragm, and an NdFeB permanent magnet on the perimeter. The coil impedance is measured at 1.5 Omega, and the resonant frequency of the diaphragm is located far from the audio frequency range. The device is driven by a power-scalable, 0.25-mum complementary metal-oxide semiconductor class-D SigmaDelta amplifier stage. The class-D amplifier is formed by a differential H-bridge driven by a single bit, pulse-density-modulated SigmaDelta bitstream at a 1.2-MHz clock rate. The fabricated MEMS loudspeaker generates more than 0.8-mum displacement, equivalent to 106-dB sound pressure level (SPL), with 0.13-mW power consumption. Driven by the SigmaDelta class-D amplifier, the MEMS loudspeaker achieves measured 65-dB total harmonic distortion (THD) with a measurement uncertainty of less than 10%. Energy-efficient and cost-effective advanced hearing aids would benefit from further miniaturization via MEMS technology. The results from this study appear very promising for developing a compact, mass-producible, low-power loudspeaker with sufficient sound generation for hearing-aid applications.

  7. Electroplating of low stress permalloy for MEMS

    International Nuclear Information System (INIS)

    Zhang Yonghua; Ding Guifu; Cai Yuli; Wang Hong; Cai Bingchu

    2006-01-01

    With the wafer-bending method and spectrophotometry, the internal stress in electroplated Ni-Fe alloy for MEMS has been investigated as a function of bath concentration. This investigation demonstrated that low concentration plating solution is useful for the decrease of the residual stress in the electrodeposits, and the stress could further decrease with an increase of saccharin additive content. And the change of stress from tensile to compressive was not observed with the increase of the additive content in plating path. The low stress permalloy (Ni 81 Fe 19 ) was reached in our experimental conditions. A bistable electromagnetic RF MEMS switch with deformation-free bilayer cantilever beam was fabricated successfully by electroplated permalloy

  8. Using the Wiimote to Learn MEMS in a Physics Degree Program

    Science.gov (United States)

    Sánchez-Azqueta, Carlos; Gimeno, Cecilia; Celma, Santiago; Aldea, Concepción

    2016-01-01

    This paper describes a learning experience designed to introduce students in a Micro- and Nanosystems course in a Physics Bachelor's degree program to the use of professional tools for the design and characterization of micro-electromechanical systems (MEMS) through a specific commercial case: the MEMS used by the well-known gaming platform…

  9. Recent advances in MEMS radiation detectors for improving radiation safety in nuclear reactors

    International Nuclear Information System (INIS)

    Bhisikar, Abhay

    2016-01-01

    MEMS (micro-electro-mechanical-system) is a core technology that leverages integrated circuit (IC) fabrication technology, builds ultra-miniaturized components and, enables radical new system applications. When considering MEMS radiation detectors; they are the specific micromechanical structures which are designed to sense doses of radiations. The present article reviews the most recent progress made in the domain of MEMS ionizing radiation sensors at international level for nuclear reactors which can be relevant to Indian context. (author)

  10. Fractal Structures For Mems Variable Capacitors

    KAUST Repository

    Elshurafa, Amro M.; Radwan, Ahmed Gomaa Ahmed; Emira, Ahmed A.; Salama, Khaled N.

    2014-01-01

    In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure, wherein the capacitor body has an upper first metal plate with a fractal shape

  11. A Micromachined Infrared Senor for an Infrared Focal Plane Array

    Directory of Open Access Journals (Sweden)

    Seong M. Cho

    2008-04-01

    Full Text Available A micromachined infrared sensor for an infrared focal plane array has been designed and fabricated. Amorphous silicon was used as a sensing material, and silicon nitride was used as a membrane material. To get a good absorption in infrared range, the sensor structure was designed as a l/4 cavity structure. A Ni-Cr film was selected as an electrode material and mixed etching scheme was applied in the patterning process of the Ni-Cr electrode. All the processes were made in 0.5 μm iMEMS fabricated in the Electronics and Telecommunication Research Institute (ETRI. The processed MEMS sensor had a small membrane deflection less than 0.15 μm. This small deflection can be attributed to the rigorous balancing of the stresses of individual layers. The efficiency of infrared absorption was more than 75% in the wavelength range of 8 ~ 14 μm. The processed infrared sensor showed high responsivity of ~230 kV/W at 1.0V bias and 2 Hz operation condition. The time constant of the sensor was 8.6 msec, which means that the sensor is suitable to be operated in 30 Hz frame rate.

  12. Power gating of VLSI circuits using MEMS switches in low power applications

    KAUST Repository

    Shobak, Hosam; Ghoneim, Mohamed T.; El Boghdady, Nawal; Halawa, Sarah; Iskander, Sophinese M.; Anis, Mohab H.

    2011-01-01

    -designed MEMS switch to power gate VLSI circuits, such that leakage power is efficiently reduced while accounting for performance and reliability. The designed MEMS switch is characterized by an 0.1876 ? ON resistance and requires 4.5 V to switch. As a result

  13. Tecnologia, experiência e memória

    Directory of Open Access Journals (Sweden)

    Aécio Amaral Jr

    2006-10-01

    Full Text Available O artigo investiga a estruturação de uma nova cultura de memória, a qual inverte a lógica metafísica com que se pensou a relação entre tecnologia e experiência nas ciências sociais. Com as recentes tecnologias da vida e da informação, a concepção do corpo humano como algo que se constitui à margem de um aparato tecnológico declina em credibilidade. Com isso, um dos principais projetos da metafísica ocidental, a saber, a estruturação de um campo de experiência e conhecimento livre de suportes técnicos, malogra em seu humanismo tecnofóbico. A partir de uma apreciação do conto Memento Mori, de Jonathan Nolan, e do filme Amnésia, de Christopher Nolan, analiso a relação entre memória e escritura, corpo e arquivo na contemporaneidade. O objetivo é perceber as tensões e oscilações implícitas na tentativa de instauração de uma mnemotécnica pretensamente pós-humana ou pós-orgânica. Palavras-chave: tecnologia; experiência; memória; humanismo; pós-humanismo.

  14. Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplates

    KAUST Repository

    Lizardo, Ernesto B.

    2013-05-08

    Micro-electro-mechanical systems (MEMS) became possible thanks to the silicon based technology used to fabricate integrated circuits. Originally, MEMS fabrication was limited to silicon based techniques and materials, but the expansion of MEMS applications brought the need of a wider catalog of materials, including polymers, now being used to fabricate MEMS. Polyimide is a very attractive polymer for MEMS fabrication due to its high temperature stability compared to other polymers, low coefficient of thermal expansion, low film stress and low cost. The goal of this thesis is to expand the Polyimide usage as structural material for MEMS by the development of a multi-user fabrication process for the integration of this polymer along with multiple metal layers on a silicon substrate. The process also integrates amorphous silicon as sacrificial layer to create free-standing structures. Dry etching is used to release the devices and avoid stiction phenomena. The developed process is used to fabricate platforms for micro-hotplate gas sensors. The fabrication steps for the platforms are described in detail, explaining the process specifics and capabilities. An initial testing of the micro-hotplate is presented. As the process was also used as educational tool, some designs made by students and fabricated with the Polyimide-MEMS process are also presented.

  15. Thermal energy harvesting for application at MEMS scale

    CERN Document Server

    Percy, Steven; McGarry, Scott; Post, Alex; Moore, Tim; Cavanagh, Kate

    2014-01-01

    This book discusses the history of thermal heat generators and focuses on the potential for these processes using micro-electrical mechanical systems (MEMS) technology for this application. The main focus is on the capture of waste thermal energy for example from industrial processes, transport systems or the human body to generate useable electrical power.  A wide range of technologies is discussed, including external combustion heat cycles at MEMS ( Brayton, Stirling and Rankine), Thermoacoustic, Shape Memory Alloys (SMAs), Multiferroics, Thermionics, Pyroelectric, Seebeck, Alkali Metal Thermal, Hydride Heat Engine, Johnson Thermo Electrochemical Converters, and the Johnson Electric Heat Pipe.

  16. Heterogeneous MEMS device assembly and integration

    Science.gov (United States)

    Topart, Patrice; Picard, Francis; Ilias, Samir; Alain, Christine; Chevalier, Claude; Fisette, Bruno; Paultre, Jacques E.; Généreux, Francis; Legros, Mathieu; Lepage, Jean-François; Laverdière, Christian; Ngo Phong, Linh; Caron, Jean-Sol; Desroches, Yan

    2014-03-01

    In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of different functionalities or multi-technology (i.e. wafer) approaches to fabricate and assemble devices respectively. This paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous assembly at chip and package-level. First, the performance of a giant (e.g. about 3 mm in diameter), electrostatically actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within an angular cone of up to 60° in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To achieve such angular performance relative to mirror size, the microassembly was performed from sub-components fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was flip-chipped onto a 256×1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the microassembly technology, performance results of packaged devices are presented. Finally, to simulate a 3072×3 pixel uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512×3 pixel FPAs with a less than 50 micron pixel co-registration is reported.

  17. High Efficiency Optical MEMS by the Integration of Photonic Lattices with Surface MEMS

    Energy Technology Data Exchange (ETDEWEB)

    FLEMING, JAMES G.; LIN, SHAWN-YU; MANI, SEETHAMBAL S.; RODGERS, M. STEVEN; DAGEL, DARYL J.

    2002-11-01

    This report outlines our work on the integration of high efficiency photonic lattice structures with MEMS (MicroElectroMechanical Systems). The simplest of these structures were based on 1-D mirror structures. These were integrated into a variety of devices, movable mirrors, switchable cavities and finally into Bragg fiber structures which enable the control of light in at least 2 dimensions. Of these devices, the most complex were the Bragg fibers. Bragg fibers consist of hollow tubes in which light is guided in a low index media (air) and confined by surrounding Bragg mirror stacks. In this work, structures with internal diameters from 5 to 30 microns have been fabricated and much larger structures should also be possible. We have demonstrated the fabrication of these structures with short wavelength band edges ranging from 400 to 1600nm. There may be potential applications for such structures in the fields of integrated optics and BioMEMS. We have also looked at the possibility of waveguiding in 3 dimensions by integrating defects into 3-dimensional photonic lattice structures. Eventually it may be possible to tune such structures by mechanically modulating the defects.

  18. Grande Sertão: Veredas – literatura e memória

    Directory of Open Access Journals (Sweden)

    Márcio Henrique Muraca

    2012-04-01

    Full Text Available Muito já se escreveu sobre Grande Sertão: Veredas, sobretudo a respeito do conceito de sertão como microcosmo, bem como, em termos de linguagem, da técnica narrativa do monólogo-diálogo. Neste artigo, pretende-se investigar os elementos de memória presentes na obra. O produto da tentativa do narrador-protagonista Riobaldo de entender o sentido de sua vida ao rememorar eventos tem como resultado um tipo de relato memorialístico. Ainda que tais eventos sejam ficção, Guimarães Rosa os situa em um plano temporal e espacial concretos, o que permite revelar um enquadramento social a partir dessa “memória individual” de Riobaldo enlaçada à memória coletiva do sertão. O diálogo teórico abarca dois textos básicos, o de Eduardo F. Coutinho, sobre Grande Sertão: Veredas, e os estudos de Marina Maluf sobre memória.

  19. Picometer-Resolution MEMS Segmented DM, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  20. MEMS/Electronic Device Design and Characterization Facility

    Data.gov (United States)

    Federal Laboratory Consortium — This facility allows DoD to design and characterize state-of-the-art microelectromechanical systems (MEMS) and electronic devices. Device designers develop their own...

  1. Picometer-Resolution MEMS Segmented DM, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  2. BurstMem: A High-Performance Burst Buffer System for Scientific Applications

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Teng [Auburn University, Auburn, Alabama; Oral, H Sarp [ORNL; Wang, Yandong [Auburn University, Auburn, Alabama; Settlemyer, Bradley W [ORNL; Atchley, Scott [ORNL; Yu, Weikuan [Auburn University, Auburn, Alabama

    2014-01-01

    The growth of computing power on large-scale sys- tems requires commensurate high-bandwidth I/O system. Many parallel file systems are designed to provide fast sustainable I/O in response to applications soaring requirements. To meet this need, a novel system is imperative to temporarily buffer the bursty I/O and gradually flush datasets to long-term parallel file systems. In this paper, we introduce the design of BurstMem, a high- performance burst buffer system. BurstMem provides a storage framework with efficient storage and communication manage- ment strategies. Our experiments demonstrate that BurstMem is able to speed up the I/O performance of scientific applications by up to 8.5 on leadership computer systems.

  3. Low Actuating Voltage Spring-Free RF MEMS SPDT Switch

    Directory of Open Access Journals (Sweden)

    Deepak Bansal

    2016-01-01

    Full Text Available RF MEMS devices are known to be superior to their solid state counterparts in terms of power consumption and electromagnetic response. Major limitations of MEMS devices are their low switching speed, high actuation voltage, larger size, and reliability. In the present paper, a see-saw single pole double throw (SPDT RF MEMS switch based on anchor-free mechanism is proposed which eliminates the above-mentioned disadvantages. The proposed switch has a switching time of 394 nsec with actuation voltage of 5 V. Size of the SPDT switch is reduced by utilizing a single series capacitive switch compared to conventional switches with capacitive and series combinations. Reliability of the switch is improved by adding floating metal and reducing stiction between the actuating bridge and transmission line. Insertion loss and isolation are better than −0.6 dB and −20 dB, respectively, for 1 GHz to 20 GHz applications.

  4. Enhanced density of optical data storage using near-field concept: fabrication and test of nanometric aperture array

    International Nuclear Information System (INIS)

    Cha, J.; Park, J. H.; Kim, Myong R.; Jhe, W.

    1999-01-01

    We have tried to enhance the density of the near-field optical memory and to improve the recording/readout speed. The current optical memory has the limitation in both density and speed. This barrier due to the far-field nature can be overcome by the use of near-field. The optical data storage density can be increased by reducing the size of the nanometric aperture where the near-field is obtained. To fabricate the aperture in precise dimension, we applied the orientation-dependent / anisotropic etching property of crystal Si often employed in the field of MEMS. And so we fabricated the 10 x 10 aperture array. This array will be also the indispensable part for speeding up. One will see the possibility of the multi-tracking pickup in the phase changing type memory through this array. This aperture array will be expected to write the bit-mark whose size is about 100 nm. We will show the recent result obtained. (author)

  5. High-throughput anisotropic plasma etching of polyimide for MEMS

    International Nuclear Information System (INIS)

    Bliznetsov, Vladimir; Manickam, Anbumalar; Ranganathan, Nagarajan; Chen, Junwei

    2011-01-01

    This note describes a new high-throughput process of polyimide etching for the fabrication of MEMS devices with an organic sacrificial layer approach. Using dual frequency superimposed capacitively coupled plasma we achieved a vertical profile of polyimide with an etching rate as high as 3.5 µm min −1 . After the fabrication of vertical structures in a polyimide material, additional steps were performed to fabricate structural elements of MEMS by deposition of a SiO 2 layer and performing release etching of polyimide. (technical note)

  6. Endovascular retrieval of a CardioMEMS heart failure system

    Directory of Open Access Journals (Sweden)

    Arun Reghunathan, MD

    2018-04-01

    Full Text Available As the creation and utilization of new implantable devices increases, so does the need for interventionalists to devise unique retrieval mechanisms. This report describes the first endovascular retrieval of a CardioMEMS heart failure monitoring device. A 20-mm gooseneck snare was utilized in conjunction with a 9-French sheath and Envoy catheter for retrieval. The patient suffered no immediate postprocedural complications but died 5 days after the procedure from multiorgan failure secondary to sepsis. Keywords: CardioMEMS heart failure system, Endovascular retrieval

  7. In vivo cellular imaging with microscopes enabled by MEMS scanners

    Science.gov (United States)

    Ra, Hyejun

    High-resolution optical imaging plays an important role in medical diagnosis and biomedical research. Confocal microscopy is a widely used imaging method for obtaining cellular and sub-cellular images of biological tissue in reflectance and fluorescence modes. Its characteristic optical sectioning capability also enables three-dimensional (3-D) image reconstruction. However, its use has mostly been limited to excised tissues due to the requirement of high numerical aperture (NA) lenses for cellular resolution. Microscope miniaturization can enable in vivo imaging to make possible early cancer diagnosis and biological studies in the innate environment. In this dissertation, microscope miniaturization for in vivo cellular imaging is presented. The dual-axes confocal (DAC) architecture overcomes limitations of the conventional single-axis confocal (SAC) architecture to allow for miniaturization with high resolution. A microelectromechanical systems (MEMS) scanner is the central imaging component that is key in miniaturization of the DAC architecture. The design, fabrication, and characterization of the two-dimensional (2-D) MEMS scanner are presented. The gimbaled MEMS scanner is fabricated on a double silicon-on-insulator (SOI) wafer and is actuated by self-aligned vertical electrostatic combdrives. The imaging performance of the MEMS scanner in a DAC configuration is shown in a breadboard microscope setup, where reflectance and fluorescence imaging is demonstrated. Then, the MEMS scanner is integrated into a miniature DAC microscope. The whole imaging system is integrated into a portable unit for research in small animal models of human biology and disease. In vivo 3-D imaging is demonstrated on mouse skin models showing gene transfer and siRNA silencing. The siRNA silencing process is sequentially imaged in one mouse over time.

  8. Accounting for Uncertainties in Strengths of SiC MEMS Parts

    Science.gov (United States)

    Nemeth, Noel; Evans, Laura; Beheim, Glen; Trapp, Mark; Jadaan, Osama; Sharpe, William N., Jr.

    2007-01-01

    A methodology has been devised for accounting for uncertainties in the strengths of silicon carbide structural components of microelectromechanical systems (MEMS). The methodology enables prediction of the probabilistic strengths of complexly shaped MEMS parts using data from tests of simple specimens. This methodology is intended to serve as a part of a rational basis for designing SiC MEMS, supplementing methodologies that have been borrowed from the art of designing macroscopic brittle material structures. The need for this or a similar methodology arises as a consequence of the fundamental nature of MEMS and the brittle silicon-based materials of which they are typically fabricated. When tested to fracture, MEMS and structural components thereof show wide part-to-part scatter in strength. The methodology involves the use of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) software in conjunction with the ANSYS Probabilistic Design System (PDS) software to simulate or predict the strength responses of brittle material components while simultaneously accounting for the effects of variability of geometrical features on the strength responses. As such, the methodology involves the use of an extended version of the ANSYS/CARES/PDS software system described in Probabilistic Prediction of Lifetimes of Ceramic Parts (LEW-17682-1/4-1), Software Tech Briefs supplement to NASA Tech Briefs, Vol. 30, No. 9 (September 2006), page 10. The ANSYS PDS software enables the ANSYS finite-element-analysis program to account for uncertainty in the design-and analysis process. The ANSYS PDS software accounts for uncertainty in material properties, dimensions, and loading by assigning probabilistic distributions to user-specified model parameters and performing simulations using various sampling techniques.

  9. Adaptive Sliding Mode Control of MEMS AC Voltage Reference Source

    Directory of Open Access Journals (Sweden)

    Ehsan Ranjbar

    2017-01-01

    Full Text Available The accuracy of physical parameters of a tunable MEMS capacitor, as the major part of MEMS AC voltage reference, is of great importance to achieve an accurate output voltage free of the malfunctioning noise and disturbance. Even though strenuous endeavors are made to fabricate MEMS tunable capacitors with desiderated accurate physical characteristics and ameliorate exactness of physical parameters’ values, parametric uncertainties ineluctably emerge in fabrication process attributable to imperfections in micromachining process. First off, this paper considers applying an adaptive sliding mode controller design in the MEMS AC voltage reference source so that it is capable of giving off a well-regulated output voltage in defiance of jumbling parametric uncertainties in the plant dynamics and also aggravating external disturbance imposed on the system. Secondly, it puts an investigatory comparison with the designed model reference adaptive controller and the pole-placement state feedback one into one’s prospective. Not only does the tuned adaptive sliding mode controller show remarkable robustness against slow parameter variation and external disturbance being compared to the pole-placement state feedback one, but also it immensely gets robust against the external disturbance in comparison with the conventional adaptive controller. The simulation results are promising.

  10. MEMS Gyroscope with Interferometric Detection, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The proposed innovation is a novel MEMS gyroscope that uses micro-interferometric detection to measure the motion of the proof mass. Using an interferometric...

  11. 3D MEMS in Standard Processes: Fabrication, Quality Assurance, and Novel Measurement Microstructures

    Science.gov (United States)

    Lin, Gisela; Lawton, Russell A.

    2000-01-01

    Three-dimensional MEMS microsystems that are commercially fabricated require minimal post-processing and are easily integrated with CMOS signal processing electronics. Measurements to evaluate the fabrication process (such as cross-sectional imaging and device performance characterization) provide much needed feedback in terms of reliability and quality assurance. MEMS technology is bringing a new class of microscale measurements to fruition. The relatively small size of MEMS microsystems offers the potential for higher fidelity recordings compared to macrosize counterparts, as illustrated in the measurement of muscle cell forces.

  12. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.

    2017-10-05

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams. In that context, embodiments of gas-triggered MEMS microbeam sensors and switches are described. The microbeam devices can be coated with a Metal-Organic Framework to achieve high sensitivity. For gas sensing, an amplitude-based tracking algorithm can be used to quantify an amount of gas captured by the devices according to frequency shift. Noise analysis is also conducted according to the embodiments, which shows that the microbeam devices have high stability against thermal noise. The microbeam devices are also suitable for the generation of binary sensing information for alarming, for example.

  13. Memória Afetiva e Memória Histórica nas Crônicas de Rubem Braga

    Directory of Open Access Journals (Sweden)

    Priscila Rosa Martins

    2016-02-01

    Full Text Available Consagrado pela escrita da crônica, pela qual se tornou referência do gênero no Brasil, Rubem Braga ocupou grande parte de sua vida registrando o cotidiano. Este trabalho apresenta uma leitura de sete crônicas do escritor que retratam cenas da cidade. Com respaldo nos textos “Culturas híbridas, poderes oblíquos”, de Néstor García Canclini (2008, e “Tempo e Espaço”, de Zygmunt Bauman (2001, trazemos alguns questionamentos provindos dos estudos acerca da pós-modernidade, no que diz respeito à abordagem do espaço público, para propor uma diferenciação entre memória histórica e memória afetiva na obra de Braga.

  14. Fast tunable blazed MEMS grating for external cavity lasers

    Science.gov (United States)

    Tormen, Maurizio; Niedermann, Philippe; Hoogerwerf, Arno; Shea, Herbert; Stanley, Ross

    2017-11-01

    Diffractive MEMS are interesting for a wide range of applications, including displays, scanners or switching elements. Their advantages are compactness, potentially high actuation speed and in the ability to deflect light at large angles. We have designed and fabricated deformable diffractive MEMS grating to be used as tuning elements for external cavity lasers. The resulting device is compact, has wide tunability and a high operating speed. The initial design is a planar grating where the beams are free-standing and attached to each other using leaf springs. Actuation is achieved through two electrostatic comb drives at either end of the grating. To prevent deformation of the free-standing grating, the device is 10 μm thick made from a Silicon on Insulator (SOI) wafer in a single mask process. At 100V a periodicity tuning of 3% has been measured. The first resonant mode of the grating is measured at 13.8 kHz, allowing high speed actuation. This combination of wide tunability and high operating speed represents state of the art in the domain of tunable MEMS filters. In order to improve diffraction efficiency and to expand the usable wavelength range, a blazed version of the deformable MEMS grating has been designed. A key issue is maintaining the mechanical properties of the original device while providing optically smooth blazed beams. Using a process based on anisotropic KOH etching, blazed gratings have been obtained and preliminary characterization is promising.

  15. On the feasibility to integrate low-cost MEMS accelerometers and GNSS receivers

    Science.gov (United States)

    Benedetti, Elisa; Dermanis, Athanasios; Crespi, Mattia

    2017-06-01

    The aim of this research was to investigate the feasibility of merging the benefits offered by low-cost GNSS and MEMS accelerometers technology, in order to promote the diffusion of low-cost monitoring solutions. A merging approach was set up at the level of the combination of kinematic results (velocities and displacements) coming from the two kinds of sensors, whose observations were separately processed, following to the so called loose integration, which sounds much more simple and flexible thinking about the possibility of an easy change of the combined sensors. At first, the issues related to the difference in reference systems, time systems and measurement rate and epochs for the two sensors were faced with. An approach was designed and tested to transform into unique reference and time systems the outcomes from GPS and MEMS and to interpolate the usually (much) more dense MEMS observation to common (GPS) epochs. The proposed approach was limited to time-independent (constant) orientation of the MEMS reference system with respect to the GPS one. Then, a data fusion approach based on the use of Discrete Fourier Transform and cubic splines interpolation was proposed both for velocities and displacements: MEMS and GPS derived solutions are firstly separated by a rectangular filter in spectral domain, and secondly back-transformed and combined through a cubic spline interpolation. Accuracies around 5 mm for slow and fast displacements and better than 2 mm/s for velocities were assessed. The obtained solution paves the way to a powerful and appealing use of low-cost single frequency GNSS receivers and MEMS accelerometers for structural and ground monitoring applications. Some additional remarks and prospects for future investigations complete the paper.

  16. Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program

    Science.gov (United States)

    Zunino, James L., III; Skelton, Donald

    2005-01-01

    As the United States (U.S.) Army transforms into a lighter, more lethal, and more agile force, the technologies that support both legacy and emerging weapon systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army as well as entire DOD will heavily rely on in achieving these objectives. Current and future military applications of MEMS devices include safety and arming devices, guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless radio frequency identification (RFID), etc. Even though the reliance on MEMS devices has been increasing, there have been no studies performed to determine their reliability and failure mechanisms. Furthermore, no standardized test protocols exist for assessing reliability. Accordingly, the U.S. Army Corrosion Office at Picatinny, NJ has initiated the MEMS Reliability Assessment Program to address this issue.

  17. A rota como memória

    Directory of Open Access Journals (Sweden)

    Patrick Fraysse

    Full Text Available No contexto de estudo do patrimônio por um ponto de vista comunicacional, este artigo permitiu-nos visualisar um objeto de comunicação por excelência « a estrada » como portador de informação a decifrar e a interpretar um documento, mas também como um repositário da memória coletiva, quer dizer um monumento. Paralelamente, a patrimonialização dos monumentos, dos conjuntos arquiteturais e sobretudo dos itinerários que os religam, dito de outra maneira, da estrada, assim como a sua documentarização (relatos de viagens, guias, bancos de dados participam de uma nova institucionalização da memória integrante também das estradas míticas como o caminho de São Tiago na França ou a famosa estrada 66 nos Estados-Unidos.

  18. An Evolutionary Approach for Robust Layout Synthesis of MEMS

    DEFF Research Database (Denmark)

    Fan, Zhun; Wang, Jiachuan; Goodman, Erik

    2005-01-01

    The paper introduces a robust design method for layout synthesis of MEM resonators subject to inherent geometric uncertainties such as the fabrication error on the sidewall of the structure. The robust design problem is formulated as a multi-objective constrained optimisation problem after certain...... assumptions and treated with multiobjective genetic algorithm (MOGA), a special type of evolutionary computing approaches. Case study based on layout synthesis of a comb-driven MEM resonator shows that the approach proposed in this paper can lead to design results that meet the target performance and are less...

  19. RF MEMS Fractal Capacitors With High Self-Resonant Frequencies

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-23

    This letter demonstrates RF microelectromechanical systems (MEMS) fractal capacitors possessing the highest reported self-resonant frequencies (SRFs) in PolyMUMPS to date. Explicitly, measurement results show SRFs beyond 20 GHz. Furthermore, quality factors higher than 4 throughout a band of 1-15 GHz and reaching as high as 28 were achieved. Additional benefits that are readily attainable from implementing fractal capacitors in MEMS are discussed, including suppressing residual stress warping, eliminating the need for etching holes, and reducing parasitics. The latter benefits were acquired without any fabrication intervention. © 2011 IEEE.

  20. Designing Computer Systems with MEMS-Based Storage

    National Research Council Canada - National Science Library

    Schlosser, Steven

    2000-01-01

    .... An exciting new storage technology based on microelectromechanical systems (MEMS) is poised to fill a large portion of this performance gap, significantly reduce power consumption, and enable many new classes of applications...

  1. A MEMS sensor for microscale force measurements

    International Nuclear Information System (INIS)

    Majcherek, S; Aman, A; Fochtmann, J

    2016-01-01

    This paper describes the development and testing of a new MEMS-based sensor device for microscale contact force measurements. A special MEMS cell was developed to reach higher lateral resolution than common steel-based load cells with foil-type strain gauges as mechanical-electrical converters. The design provided more than one normal force measurement point with spatial resolution in submillimeter range. Specific geometric adaption of the MEMS-device allowed adjustability of its measurement range between 0.5 and 5 N. The thin film nickel-chromium piezo resistors were used to achieve a mechanical-electrical conversion. The production process was realized by established silicon processing technologies such as deep reactive ion etching and vapor deposition (sputtering). The sensor was tested in two steps. Firstly, the sensor characteristics were carried out by application of defined loads at the measurement points by a push-pull tester. As a result, the sensor showed linear behavior. A measurement system analysis (MSA1) was performed to define the reliability of the measurement system. The measured force values had the maximal relative deviation of 1% to average value of 1.97 N. Secondly, the sensor was tested under near-industrial conditions. In this context, the thermal induced relaxation behavior of the electrical connector contact springs was investigated. The handling of emerging problems during the characterization process of the sensor is also described. (paper)

  2. Controlled delivery of antiangiogenic drug to human eye tissue using a MEMS device

    KAUST Repository

    Pirmoradi, Fatemeh Nazly; Ou, Kevin; Jackson, John K.; Letchford, Kevin; Cui, Jing; Wolf, Ki Tae; Graber, Florian; Zhao, Tom; Matsubara, Joanne A.; Burt, Helen; Chiao, Mu; Lin, Liwei

    2013-01-01

    We demonstrate an implantable MEMS drug delivery device to conduct controlled and on-demand, ex vivo drug transport to human eye tissue. Remotely operated drug delivery to human post-mortem eyes was performed via a MEMS device. The developed curved

  3. MemFlash device: floating gate transistors as memristive devices for neuromorphic computing

    Science.gov (United States)

    Riggert, C.; Ziegler, M.; Schroeder, D.; Krautschneider, W. H.; Kohlstedt, H.

    2014-10-01

    Memristive devices are promising candidates for future non-volatile memory applications and mixed-signal circuits. In the field of neuromorphic engineering these devices are especially interesting to emulate neuronal functionality. Therefore, new materials and material combinations are currently investigated, which are often not compatible with Si-technology processes. The underlying mechanisms of the device often remain unclear and are paired with low device endurance and yield. These facts define the current most challenging development tasks towards a reliable memristive device technology. In this respect, the MemFlash concept is of particular interest. A MemFlash device results from a diode configuration wiring scheme of a floating gate transistor, which enables the persistent device resistance to be varied according to the history of the charge flow through the device. In this study, we investigate the scaling conditions of the floating gate oxide thickness with respect to possible applications in the field of neuromorphic engineering. We show that MemFlash cells exhibit essential features with respect to neuromorphic applications. In particular, cells with thin floating gate oxides show a limited synaptic weight growth together with low energy dissipation. MemFlash cells present an attractive alternative for state-of-art memresitive devices. The emulation of associative learning is discussed by implementing a single MemFlash cell in an analogue circuit.

  4. MemFlash device: floating gate transistors as memristive devices for neuromorphic computing

    International Nuclear Information System (INIS)

    Riggert, C; Ziegler, M; Kohlstedt, H; Schroeder, D; Krautschneider, W H

    2014-01-01

    Memristive devices are promising candidates for future non-volatile memory applications and mixed-signal circuits. In the field of neuromorphic engineering these devices are especially interesting to emulate neuronal functionality. Therefore, new materials and material combinations are currently investigated, which are often not compatible with Si-technology processes. The underlying mechanisms of the device often remain unclear and are paired with low device endurance and yield. These facts define the current most challenging development tasks towards a reliable memristive device technology. In this respect, the MemFlash concept is of particular interest. A MemFlash device results from a diode configuration wiring scheme of a floating gate transistor, which enables the persistent device resistance to be varied according to the history of the charge flow through the device. In this study, we investigate the scaling conditions of the floating gate oxide thickness with respect to possible applications in the field of neuromorphic engineering. We show that MemFlash cells exhibit essential features with respect to neuromorphic applications. In particular, cells with thin floating gate oxides show a limited synaptic weight growth together with low energy dissipation. MemFlash cells present an attractive alternative for state-of-art memresitive devices. The emulation of associative learning is discussed by implementing a single MemFlash cell in an analogue circuit. (paper)

  5. Optical MEMS for chemical analysis and biomedicine

    CERN Document Server

    Jiang, Hongrui

    2016-01-01

    This book describes the current state of optical MEMS in chemical and biomedical analysis and brings together current trends and highlights topics representing the most exciting progress in recent years in the field.

  6. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.; Jaber, Nizar; Younis, Mohammad I.

    2017-01-01

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams

  7. Novel RF-MEMS capacitive switching structures

    NARCIS (Netherlands)

    Rottenberg, X.; Jansen, Henricus V.; Fiorini, P.; De Raedt, W.; Tilmans, H.A.C.

    2002-01-01

    This paper reports on novel RF-MEMS capacitive switching devices implementing an electrically floating metal layer covering the dielectric to ensure intimate contact with the bridge in the down state. This results in an optimal switch down capacitance and allows optimisation of the down/up

  8. Transimpedance Amplifier for MEMS SAW Oscillator in 1.4GHz

    Science.gov (United States)

    Kamarudin, N.; Karim, J.; Hussin, H.

    2018-03-01

    This work is to design a transimpedance amplifier for MEMS SAW resonator to achieve low power consumption at desired frequency. A transimpedance amplifier is designed and characterized for MEMS SAW resonator in 0.18μm CMOS process. The transimpedance amplifier achieves gain is 31 dBΩ at 176°. The power consume by oscillator is 0.6mW at VDD 1.8V while phase noise at -133.97dBc/Hz at 10kHz.

  9. Performance assessment of bio-inspired systems: flow sensing MEMS hairs

    International Nuclear Information System (INIS)

    Droogendijk, H; Krijnen, G J M; Casas, J; Steinmann, T

    2015-01-01

    Despite vigorous growth in biomimetic design, the performance of man-made devices relative to their natural templates is still seldom quantified, a procedure which would however significantly increase the rigour of the biomimetic approach. We applied the ubiquitous engineering concept of a figure of merit (FoM) to MEMS flow sensors inspired by cricket filiform hairs. A well known mechanical model of a hair is refined and tailored to this task. Five criteria of varying importance in the biological and engineering fields are computed: responsivity, power transfer, power efficiency, response time and detection threshold. We selected the metrics response time and detection threshold for building the FoM to capture the performance in a single number. Crickets outperform actual MEMS on all criteria for a large range of flow frequencies. Our approach enables us to propose several improvements for MEMS hair-sensor design. (paper)

  10. An archeology of social memory Uma arqueologia da memória social

    Directory of Open Access Journals (Sweden)

    Gilvando Sá Leitão Rios

    2011-07-01

    Full Text Available MARTINS, José de Souza. Uma arqueologia da memória social: autobiografia de um moleque de fábrica. Cotia: Ateliê, 2011.Resenha de:MARTINS, José de Souza. Uma arqueologia da memória social: autobiografia de um moleque de fábrica. Cotia: Ateliê, 2011.

  11. Friction and dynamically dissipated energy dependence on temperature in polycrystalline silicon MEMS devices

    NARCIS (Netherlands)

    Gkouzou, A.; Kokorian, J.; Janssen, G.C.A.M.; van Spengen, W.M.

    2017-01-01

    In this paper, we report on the influence of capillary condensation on the sliding friction of sidewall surfaces in polycrystalline silicon micro-electromechanical
    systems (MEMS). We developed a polycrystalline silicon MEMS tribometer, which is a microscale test device with two components

  12. Some studies on the deformation of the membrane in an RF MEMS switch

    NARCIS (Netherlands)

    Ambati, Vijaya Raghav; Asheim, Andreas; van den Berg, Jan Bouwe; van Gennip, Yves; Gerasimov, Tymofiy; Hlod, Andriy; Planqué, Bob; van der Schans, Martin; van der Stelt, Sjors; Vargas Rivera, Michelangelo; Vondenhoff, Erwin; Bokhove, Onno; Hurink, Johann; Meinsma, Gjerrit; Stolk, Chris; Vellekoop, Michel

    2008-01-01

    Radio Frequency (RF) switches of Micro Electro Mechanical Systems (MEMS) are appealing to the mobile industry because of their energy efficiency and ability to accommodate more frequency bands. However, the electromechanical coupling of the electrical circuit to the mechanical components in RF MEMS

  13. Effect of Tension and Curvature of Skin on Insertion Characteristics of Microneedle Array

    Science.gov (United States)

    Tachikawa, Hiroto; Takano, Naoki; Nishiyabu, Kazuaki; Miki, Norihisa; Ami, Yoshimichi

    Recent MEMS (micro electro mechanical system) fabrication techniques have made it possible to produce painless microneedles precisely enough to be inserted into epidermis layer penetrating the stratum corneum of human skin. This paper presents a testing procedure to evaluate the insertion characteristics of microneedle array using cultured human skin considering the tension and the curvature. First, the biaxial strain applied to the cultured human skin was measured by optical technique with image processing. It was found that almost constant strain could be successfully given within a certain area and that error factors in the experiment except the thickness variation of the cultured skin were negligible. Next, using a microneedle square array for brain machine interface (BMI) application, the effects of biaxial tension and the curvature on insertion characteristics were discussed. Within the above mentioned area with high strain, the needles were successfully inserted.

  14. A MEMS AC current sensor for residential and commercial electricity end-use monitoring

    International Nuclear Information System (INIS)

    Leland, E S; Wright, P K; White, R M

    2009-01-01

    This paper presents a novel prototype MEMS sensor for alternating current designed for monitoring electricity end-use in residential and commercial environments. This new current sensor design is comprised of a piezoelectric MEMS cantilever with a permanent magnet mounted on the cantilever's free end. When placed near a wire carrying AC current, the magnet is driven sinusoidally, producing a voltage in the cantilever proportional to the current being measured. Analytical models were developed to predict the applicable magnetic forces and piezoelectric voltage output in order to guide the design of a sensor prototype. This paper also details the fabrication process for this sensor design. Released piezoelectric MEMS cantilevers have been fabricated using a four-mask process and aluminum nitride as the active piezoelectric material. Dispenser-printed microscale composite permanent magnets have been integrated, resulting in the first MEMS-scale prototypes of this current sensor design

  15. Investigation of a delayed feedback controller of MEMS resonators

    KAUST Repository

    Masri, Karim M.

    2013-08-04

    Controlling mechanical systems is an important branch of mechanical engineering. Several techniques have been used to control Microelectromechanical systems (MEMS) resonators. In this paper, we study the effect of a delayed feedback controller on stabilizing MEMS resonators. A delayed feedback velocity controller is implemented through modifying the parallel plate electrostatic force used to excite the resonator into motion. A nonlinear single degree of freedom model is used to simulate the resonator response. Long time integration is used first. Then, a finite deference technique to capture periodic motion combined with the Floquet theory is used to capture the stable and unstable periodic responses. We show that applying a suitable positive gain can stabilize the MEMS resonator near or inside the instability dynamic pull in band. We also study the stability of the resonator by tracking its basins of attraction while sweeping the controller gain and the frequency of excitations. For positive delayed gains, we notice significant enhancement in the safe area of the basins of attraction. Copyright © 2013 by ASME.

  16. Improving Planetary Rover Attitude Estimation via MEMS Sensor Characterization

    Science.gov (United States)

    Hidalgo, Javier; Poulakis, Pantelis; Köhler, Johan; Del-Cerro, Jaime; Barrientos, Antonio

    2012-01-01

    Micro Electro-Mechanical Systems (MEMS) are currently being considered in the space sector due to its suitable level of performance for spacecrafts in terms of mechanical robustness with low power consumption, small mass and size, and significant advantage in system design and accommodation. However, there is still a lack of understanding regarding the performance and testing of these new sensors, especially in planetary robotics. This paper presents what is missing in the field: a complete methodology regarding the characterization and modeling of MEMS sensors with direct application. A reproducible and complete approach including all the intermediate steps, tools and laboratory equipment is described. The process of sensor error characterization and modeling through to the final integration in the sensor fusion scheme is explained with detail. Although the concept of fusion is relatively easy to comprehend, carefully characterizing and filtering sensor information is not an easy task and is essential for good performance. The strength of the approach has been verified with representative tests of novel high-grade MEMS inertia sensors and exemplary planetary rover platforms with promising results. PMID:22438761

  17. MEMS-LSI Integrated Microchip using Pseudo-SoC Technology

    Science.gov (United States)

    Funaki, Hideyuki; Itaya, Kazuhiko; Yamada, Hiroshi; Onozuka, Yutaka; Iida, Atsuko

    The authors have developed pseudo-SoC technology to realize MEMS-LSI integrated micro-chip. The pseudo-SoC technology consists of three technologies which are wafer reconfiguration technology, inter-chip redistribution layer technology, and pseudo-SoC thinning technology. In the wafer reconfiguration technology, the filling of resin and surface step between heterogeneous chips were improved through the optimization of vacuum printing process and resin material. These improvements reduced the warpage of reconfiguration wafer, leading to achievement of the reconfiguration wafer with 5 inch in diameter. In the inter-chip redistribution layer technology, the interface adherence between planar layer and inter-chip redistribution layer was improved, leading to the inter-chip redistribution layer with 1μm/1μm in line/space on reconfiguration wafer. In the pseudo-SoC thinning technology, thin pseudo-SoC device with 100μm in thickness was achieved through developing mechanical backside grinding process technology. Furthermore, ultra-thin pseudo-SoC which integrated electrostatic MEMS light valve and PWM driver IC was prototyped through developing the ultra-thin MEMS encapsulation technology.

  18. Quantitative Accelerated Life Testing of MEMS Accelerometers.

    Science.gov (United States)

    Bâzu, Marius; Gălăţeanu, Lucian; Ilian, Virgil Emil; Loicq, Jerome; Habraken, Serge; Collette, Jean-Paul

    2007-11-20

    Quantitative Accelerated Life Testing (QALT) is a solution for assessing thereliability of Micro Electro Mechanical Systems (MEMS). A procedure for QALT is shownin this paper and an attempt to assess the reliability level for a batch of MEMSaccelerometers is reported. The testing plan is application-driven and contains combinedtests: thermal (high temperature) and mechanical stress. Two variants of mechanical stressare used: vibration (at a fixed frequency) and tilting. Original equipment for testing at tiltingand high temperature is used. Tilting is appropriate as application-driven stress, because thetilt movement is a natural environment for devices used for automotive and aerospaceapplications. Also, tilting is used by MEMS accelerometers for anti-theft systems. The testresults demonstrated the excellent reliability of the studied devices, the failure rate in the"worst case" being smaller than 10 -7 h -1 .

  19. A Fourier Transform Spectrometer Based on an Electrothermal MEMS Mirror with Improved Linear Scan Range

    Directory of Open Access Journals (Sweden)

    Wei Wang

    2016-09-01

    Full Text Available A Fourier transform spectrometer (FTS that incorporates a closed-loop controlled, electrothermally actuated microelectromechanical systems (MEMS micromirror is proposed and experimentally verified. The scan range and the tilting angle of the mirror plate are the two critical parameters for MEMS-based FTS. In this work, the MEMS mirror with a footprint of 4.3 mm × 3.1 mm is based on a modified lateral-shift-free (LSF bimorph actuator design with large piston and reduced tilting. Combined with a position-sensitive device (PSD for tilt angle sensing, the feedback controlled MEMS mirror generates a 430 µm stable linear piston scan with the mirror plate tilting angle less than ±0.002°. The usable piston scan range is increased to 78% of the MEMS mirror’s full scan capability, and a spectral resolution of 0.55 nm at 531.9 nm wavelength, has been achieved. It is a significant improvement compared to the prior work.

  20. Development of an SU-8 MEMS process with two metal electrodes using amorphous silicon as a sacrificial material

    KAUST Repository

    Ramadan, Khaled S.

    2013-02-08

    This work presents an SU-8 surface micromachining process using amorphous silicon as a sacrificial material, which also incorporates two metal layers for electrical excitation. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic applications due to its mechanical properties, biocompatibility and low cost. Amorphous silicon is used as a sacrificial layer in MEMS applications because it can be deposited in large thicknesses, and can be released in a dry method using XeF2, which alleviates release-based stiction problems related to MEMS applications. In this work, an SU-8 MEMS process was developed using ;-Si as a sacrificial layer. Two conductive metal electrodes were integrated in this process to allow out-of-plane electrostatic actuation for applications like MEMS switches and variable capacitors. In order to facilitate more flexibility for MEMS designers, the process can fabricate dimples that can be conductive or nonconductive. Additionally, this SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were optimized for two sets of thicknesses: thin (5-10 m) and thick (130 m). The process was tested fabricating MEMS switches, capacitors and thermal actuators. © 2013 IOP Publishing Ltd.

  1. Nonlinear Dynamics of Electrostatically Actuated MEMS Arches

    KAUST Repository

    Al Hennawi, Qais M.

    2015-01-01

    In this thesis, we present theoretical and experimental investigation into the nonlinear statics and dynamics of clamped-clamped in-plane MEMS arches when excited by an electrostatic force. Theoretically, we first solve the equation of motion using

  2. O conceito de memória na obra freudiana: Breves explanações

    Directory of Open Access Journals (Sweden)

    Pamela Pitagoras Freitas Lima Ferrarini

    2014-08-01

    Full Text Available O presente artigo tem como objetivo descrever o conceito de memória na obra de Sigmund Freud, precursor da Psicanálise. O tema da memória e suas diferentes manifestações no psiquismo faziam parte das inquietações teóricas de Freud, levando a indagar a respeito do funcionamento desta em seus diversos escritos. Através da análise da obra freudiana e de demais teóricos que debateram a respeito do tema, este estudo teórico visa demonstrar que a memória, na Psicanálise, sempre esteve presente na formulação freudiana da subjetividade humana. A constante evolução da sua teoria permitiu que a memória ganhasse um status cada vez maior, passando de uma análise puramente individual e funcional, para uma dimensão social e cultural, transformando-se num dos alicerces de sua teoria.

  3. A Study on the Performance of Low Cost MEMS Sensors in Strong Motion Studies

    Science.gov (United States)

    Tanırcan, Gulum; Alçık, Hakan; Kaya, Yavuz; Beyen, Kemal

    2017-04-01

    Recent advances in sensors have helped the growth of local networks. In recent years, many Micro Electro Mechanical System (MEMS)-based accelerometers have been successfully used in seismology and earthquake engineering projects. This is basically due to the increased precision obtained in these downsized instruments. Moreover, they are cheaper alternatives to force-balance type accelerometers. In Turkey, though MEMS-based accelerometers have been used in various individual applications such as magnitude and location determination of earthquakes, structural health monitoring, earthquake early warning systems, MEMS-based strong motion networks are not currently available in other populated areas of the country. Motivation of this study comes from the fact that, if MEMS sensors are qualified to record strong motion parameters of large earthquakes, a dense network can be formed in an affordable price at highly populated areas. The goals of this study are 1) to test the performance of MEMS sensors, which are available in the inventory of the Institute through shake table tests, and 2) to setup a small scale network for observing online data transfer speed to a trusted in-house routine. In order to evaluate the suitability of sensors in strong motion related studies, MEMS sensors and a reference sensor are tested under excitations of sweeping waves as well as scaled earthquake recordings. Amplitude response and correlation coefficients versus frequencies are compared. As for earthquake recordings, comparisons are carried out in terms of strong motion(SM) parameters (PGA, PGV, AI, CAV) and elastic response of structures (Sa). Furthermore, this paper also focuses on sensitivity and selectivity for sensor performances in time-frequency domain to compare different sensing characteristics and analyzes the basic strong motion parameters that influence the design majors. Results show that the cheapest MEMS sensors under investigation are able to record the mid

  4. Continuous Process for the Etching, Rinsing and Drying of MEMS Using Supercritical Carbon Dioxide

    Energy Technology Data Exchange (ETDEWEB)

    Min, Seon Ki; Han, Gap Su; You, Seong-sik [Korea University of Technology and Education, Cheonan (Korea, Republic of)

    2015-10-15

    The previous etching, rinsing and drying processes of wafers for MEMS (microelectromechanical system) using SC-CO{sub 2} (supercritical-CO{sub 2}) consists of two steps. Firstly, MEMS-wafers are etched by organic solvent in a separate etching equipment from the high pressure dryer and then moved to the high pressure dryer to rinse and dry them using SC-CO{sub 2}. We found that the previous two step process could be applied to etch and dry wafers for MEMS but could not confirm the reproducibility through several experiments. We thought the cause of that was the stiction of structures occurring due to vaporization of the etching solvent during moving MEMS wafer to high pressure dryer after etching it outside. In order to improve the structure stiction problem, we designed a continuous process for etching, rinsing and drying MEMS-wafers using SC-CO{sub 2} without moving them. And we also wanted to know relations of states of carbon dioxide (gas, liquid, supercritical fluid) to the structure stiction problem. In the case of using gas carbon dioxide (3 MPa, 25 .deg. C) as an etching solvent, we could obtain well-treated MEMS-wafers without stiction and confirm the reproducibility of experimental results. The quantity of rinsing solvent used could be also reduced compared with the previous technology. In the case of using liquid carbon dioxide (3 MPa, 5 .deg. C), we could not obtain well-treated MEMS-wafers without stiction due to the phase separation of between liquid carbon dioxide and etching co-solvent(acetone). In the case of using SC-CO{sub 2} (7.5 Mpa, 40 .deg. C), we had as good results as those of the case using gas-CO{sub 2}. Besides the processing time was shortened compared with that of the case of using gas-CO{sub 2}.

  5. Objetos de memória como referência da diversidade cultural

    Directory of Open Access Journals (Sweden)

    Rita de Castro Engler

    2017-12-01

    Full Text Available Os objetos, de um modo geral, são capazes de despertar lembranças e aguçar a memória. São importantes elementos de estudo para a identificação de laços culturais entre diferentes povos e culturas. Os objetos são carregados de simbolismos culturais, atravessam fronteiras e moldam-se aos costumes, materiais e modos de viver de um povo. Atravessam também o tempo, submetidos a constantes ressignificações passando do artesanal às incorporações do mundo tecnológico, industrial. Novas maneiras de brincar. Neste trabalho os brinquedos que atravessam fronteiras e se fazem presentes em diferentes culturas serão tomados como objeto de estudo.  A narrativa procurou tratar o brinquedo como objetos de memória e fonte de estudos, na medida em que refletem aspectos socioculturais e econômicos. A pesquisa bibliográfica, de caráter exploratório, buscou um aprofundamento no tema e aprimoramento de ideias a respeito da potencialidade lúdica e educativa do brinquedo.  Como resultado, buscou-se consolidar conhecimentos acerca do brinquedo, como objeto de memória, como subsídio para propostas educacionais no estudo da diversidade cultural da América Latina. Os dados registrados podem contribuir com novos métodos educacionais, em formação de redes que fortaleçam o conhecimento de origens e uso dos objetos de memória como recurso didático e de qualidade de vida. Palavras-chave: Brinquedos infantis; diversidade cultural; objetos de memória; povos nativos; educação.

  6. Effect of various concentrations of Minimal Essential Medium vitamins (MEM vitamins on development of

    Directory of Open Access Journals (Sweden)

    Hamed Karami Shabankareh

    2012-01-01

    Full Text Available Background: Improvements in culture media formulations have led to an increasein the ability of sheep embryo in culture throughout the preimplantation period.Objective: This study was carried out to evaluate the effects of variousconcentrations of MEM vitamins during in vitro maturation of sheep oocytes andsubsequent embryo development.Materials and Methods: Sheep ovaries were collected from a slaughterhouse andtransported to the laboratory. Oocytes were matured in SOF medium supplementedwith, eCG, hCG and EGF in various concentrations of MEM vitamins (control, 0.5,1 and 1.5 for 24h. The cumulus oocyte compelex (COCs were co-incubated withepididymal spermatozoa of post mortem rams in synthetic oviduct fluid fertilization(SOFF medium with 10% heat inactivated estrous sheep serum for 18h. Embryoswere cultured in synthetic oviduct fluid culture 1 (SOFC1 medium for 48h followedby cultured in synthetic oviduct fluid culture 2 (SOFC2 medium for six days.Results: Addition of 0.5 and 1  MEM vitamins significantly increased (P< 0.05overall blastocyst development (21.62% and 22.33%; respectively compared with1.5MEM vitamins (15.59%, but there was no difference between control, 0.5 and1MEM vitamins in the percentage of embryos successfully developing to theblastocyst stage (19.50%, 21.62% and 22.33% respectively.Conclusion: It seems that addition of 1.5  of MEM vitamins has detrimental effecton blastocyst rate.

  7. MEMS capacitive accelerometer-based middle ear microphone.

    Science.gov (United States)

    Young, Darrin J; Zurcher, Mark A; Semaan, Maroun; Megerian, Cliff A; Ko, Wen H

    2012-12-01

    The design, implementation, and characterization of a microelectromechanical systems (MEMS) capacitive accelerometer-based middle ear microphone are presented in this paper. The microphone is intended for middle ear hearing aids as well as future fully implantable cochlear prosthesis. Human temporal bones acoustic response characterization results are used to derive the accelerometer design requirements. The prototype accelerometer is fabricated in a commercial silicon-on-insulator (SOI) MEMS process. The sensor occupies a sensing area of 1 mm × 1 mm with a chip area of 2 mm × 2.4 mm and is interfaced with a custom-designed low-noise electronic IC chip over a flexible substrate. The packaged sensor unit occupies an area of 2.5 mm × 6.2 mm with a weight of 25 mg. The sensor unit attached to umbo can detect a sound pressure level (SPL) of 60 dB at 500 Hz, 35 dB at 2 kHz, and 57 dB at 8 kHz. An improved sound detection limit of 34-dB SPL at 150 Hz and 24-dB SPL at 500 Hz can be expected by employing start-of-the-art MEMS fabrication technology, which results in an articulation index of approximately 0.76. Further micro/nanofabrication technology advancement is needed to enhance the microphone sensitivity for improved understanding of normal conversational speech.

  8. Cupula-Inspired Hyaluronic Acid-Based Hydrogel Encapsulation to Form Biomimetic MEMS Flow Sensors.

    Science.gov (United States)

    Kottapalli, Ajay Giri Prakash; Bora, Meghali; Kanhere, Elgar; Asadnia, Mohsen; Miao, Jianmin; Triantafyllou, Michael S

    2017-07-28

    Blind cavefishes are known to detect objects through hydrodynamic vision enabled by arrays of biological flow sensors called neuromasts. This work demonstrates the development of a MEMS artificial neuromast sensor that features a 3D polymer hair cell that extends into the ambient flow. The hair cell is monolithically fabricated at the center of a 2 μm thick silicon membrane that is photo-patterned with a full-bridge bias circuit. Ambient flow variations exert a drag force on the hair cell, which causes a displacement of the sensing membrane. This in turn leads to the resistance imbalance in the bridge circuit generating a voltage output. Inspired by the biological neuromast, a biomimetic synthetic hydrogel cupula is incorporated on the hair cell. The morphology, swelling behavior, porosity and mechanical properties of the hyaluronic acid hydrogel are characterized through rheology and nanoindentation techniques. The sensitivity enhancement in the sensor output due to the material and mechanical contributions of the micro-porous hydrogel cupula is investigated through experiments.

  9. Elas merecem ser lembradas: feminismo, emoções e memória em rede

    Directory of Open Access Journals (Sweden)

    Tatiane Leal

    Full Text Available Resumo Neste artigo, discuto as interseções entre feminismo, memória e emoções no ambiente virtual da Internet. A metodologia consiste na análise das páginas dos projetos Aurélia e Let’s Celebrate Women, que se dedicam a construir uma memória coletiva feminina online, reunindo histórias de mulheres inspiradoras, do passado e do presente. O objetivo é problematizar os usos da memória pelos movimentos sociais, em suas constituições identitárias e em suas lutas por reconhecimento, identificando os imbricamentos presentes entre os feminismos contemporâneos e a Internet. A partir de uma discussão do conceito de memória, investigo, ainda, as relações entre essas iniciativas e o crescimento de uma cultura do lembrar na contemporaneidade. Na relação entre as práticas de rememoração e as emoções, o direito à memória se estabelece como uma reivindicação primordial das mulheres em suas novas formas de militância.

  10. NASA Tech Briefs, September 2009

    Science.gov (United States)

    2009-01-01

    opics covered include: Filtering Water by Use of Ultrasonically Vibrated Nanotubes; Computer Code for Nanostructure Simulation; Functionalizing CNTs for Making Epoxy/CNT Composites; Improvements in Production of Single-Walled Carbon Nanotubes; Progress Toward Sequestering Carbon Nanotubes in PmPV; Two-Stage Variable Sample-Rate Conversion System; Estimating Transmitted-Signal Phase Variations for Uplink Array Antennas; Board Saver for Use with Developmental FPGAs; Circuit for Driving Piezoelectric Transducers; Digital Synchronizer without Metastability; Compact, Low-Overhead, MIL-STD-1553B Controller; Parallel-Processing CMOS Circuitry for M-QAM and 8PSK TCM; Differential InP HEMT MMIC Amplifiers Embedded in Waveguides; Improved Aerogel Vacuum Thermal Insulation; Fluoroester Co-Solvents for Low-Temperature Li+ Cells; Using Volcanic Ash to Remove Dissolved Uranium and Lead; High-Efficiency Artificial Photosynthesis Using a Novel Alkaline Membrane Cell; Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays; Micro-Horn Arrays for Ultrasonic Impedance Matching; Improved Controller for a Three-Axis Piezoelectric Stage; Nano-Pervaporation Membrane with Heat Exchanger Generates Medical-Grade Water; Micro-Organ Devices; Nonlinear Thermal Compensators for WGM Resonators; Dynamic Self-Locking of an OEO Containing a VCSEL; Internal Water Vapor Photoacoustic Calibration; Mid-Infrared Reflectance Imaging of Thermal-Barrier Coatings; Improving the Visible and Infrared Contrast Ratio of Microshutter Arrays; Improved Scanners for Microscopic Hyperspectral Imaging; Rate-Compatible LDPC Codes with Linear Minimum Distance; PrimeSupplier Cross-Program Impact Analysis and Supplier Stability Indicator Simulation Model; Integrated Planning for Telepresence With Time Delays; Minimizing Input-to-Output Latency in Virtual Environment; Battery Cell Voltage Sensing and Balancing Using Addressable Transformers; Gaussian and Lognormal Models of Hurricane Gust Factors; Simulation

  11. Optical fibre angle sensor used in MEMS

    International Nuclear Information System (INIS)

    Golebiowski, J; Milcarz, Sz; Rybak, M

    2014-01-01

    There is a need for displacement and angle measurements in many movable MEMS structures. The use of fibre optical sensors helps to measure micrometre displacements and small rotation angles. Advantages of this type of transducers are their simple design, high precision of processing, low costs and ability of a non-contact measurement. The study shows an analysis of a fibre-optic intensity sensor used for MEMS movable structure rotation angle measurement. An intensity of the light in the photodetector is basically dependent on a distance between a reflecting surface and a head surface of the fibre transmitting arm, and the deflection angle. Experimental tests were made for PMMA 980/1000 plastic fibres, Θ NA =33°. The study shows both analytical and practical results. It proves that calculated and experimental characteristics for the analysed transducers are similar.

  12. 1015 PTT Segment MEMS DM Development, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with more than 10^4 actuators with size, weight, and power...

  13. Development of thin film encapsulation process for piezoresistive MEMS gyroscope with wide gaps

    Science.gov (United States)

    Ayanoor-Vitikkate, Vipin

    The gyroscope is an inertial sensor used to measure the angular rate of a rotating object. This helps to determine the pitch and yaw rate of any moving body. A number of applications have been developed for consumer and automotive markets, for e.g. vehicle stability control, navigation assist, roll over detection. These are primarily used in high-end cars, where cost is not a major factor. Other areas where a MEMS Gyro can be used are robotics, camcorder stabilization, virtual reality, and more. Primarily due to cost and the size most of these applications have not reached any significant volume. One reason for this is the relatively high cost of MEMS gyros compared to other MEMS sensors like accelerometers or pressure sensors. Generally the cost of packaging a MEMS sensor is about 85-90% of the total cost. Currently most MEMS based gyroscopes are made using bulk or surface micromachining, after which they are packaged using wafer bonding. This unfortunately leads to wastage of silicon and increase in the package size, thus reducing the yield. One way to reduce the cost of packaging is by wafer scale thin film encapsulation of MEMS gyroscopes. The goal of the present work is to fabricate a rate grade MEMS gyroscope and encapsulate it by modifying an existing thin-film encapsulation technique. Packaging is an important step towards commercialization of the device and we plan to use thin wafer scale encapsulation technique developed previously in our group to package these devices. The silicon micro machined gyroscope will be fabricated on SOI (Silicon-on-Insulator) wafers using Bosch DRIE etching techniques. The encapsulation of the device is carried out using epitaxial polysilicon in order to provide a high vacuum inside the device chamber. The advantages offered by this technique are the reduction in area of the die and thus less silicon surface is wasted. In addition to this the encapsulation technique helps in creating a vacuum inside the micro device, which

  14. MEMS Stirling Cooler Development Update

    Science.gov (United States)

    Moran, Matthew E.; Wesolek, Danielle

    2003-01-01

    This presentation provides an update on the effort to build and test a prototype unit of the patented MEMS Stirling cooler concept. A micro-scale regenerator has been fabricated by Polar Thermal Technologies and is currently being integrated into a Stirling cycle simulator at Johns Hopkins University Applied Physics Laboratory. A discussion of the analysis, design, assembly, and test plans for the prototype will be presented.

  15. Photography as object and resource of memory A fotografia como objeto e recurso de memória

    Directory of Open Access Journals (Sweden)

    Etienne Samain

    2007-01-01

    Full Text Available With the rise of digital photography, its ease, potentials and weaknesses, we have become more and more liable to the iconographic forgetting of our own memory, our photographic memory. This essay intends to discuss the value and the use of photography as one of the great memory-bearing instruments, own memory, memory to be clarified, interpreted, remembered. Com o advento da fotografia digital, suas facilidades, potencialidades e fragilidades, ficamos suscetíveis ao esquecimento iconográfico de nossa própria memória, nossa memória fotográfica. Este ensaio pretende discutir o valor e o uso da fotografia como um dos grandes instrumentos portadores de memória, memória própria, memória a ser elucidada, interpretada, rememorada.

  16. Method for spatially modulating X-ray pulses using MEMS-based X-ray optics

    Science.gov (United States)

    Lopez, Daniel; Shenoy, Gopal; Wang, Jin; Walko, Donald A.; Jung, Il-Woong; Mukhopadhyay, Deepkishore

    2015-03-10

    A method and apparatus are provided for spatially modulating X-rays or X-ray pulses using microelectromechanical systems (MEMS) based X-ray optics. A torsionally-oscillating MEMS micromirror and a method of leveraging the grazing-angle reflection property are provided to modulate X-ray pulses with a high-degree of controllability.

  17. Planetary-Whigs: Optical MEMS-Based Seismometer, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — During this Phase I, Michigan Aerospace Corporation will adapt the design of an optical MEMS seismometer for lunar and other planetary science instrumentation. The...

  18. Characterization of piezoelectric polymer composites for MEMS ...

    Indian Academy of Sciences (India)

    are obtained so that higher energy densities can be achieved along with ... The quality and reliability of MEMS ... beam are coupled and the bottom face is grounded. The top .... The electrical and mechanical responses of the material near the ...

  19. Memória de longo prazo modulada pela memória de curto prazo

    Directory of Open Access Journals (Sweden)

    Viviane Moreira-Aguiar

    2008-01-01

    Full Text Available Quando um estímulo ocorre aleatoriamente à esquerda ou à direita, a resposta é mais rápida quando estímulo e resposta estão no mesmo lado (condição compatível do que em lados opostos (condição incompatível. Na tarefa de Simon, embora a resposta seja selecionada pela forma (ou cor do estímulo, a posição deste influencia o Tempo de Reação Manual (TRM. O efeito Simon corresponde à diferença entre as médias dos TRMs nas duas condições (incompatível e compatível. Neste trabalho, estudamos como uma tarefa prévia de compatibilidade realizada com um dedo indicador modula o efeito Simon. Vinte e oito voluntários realizaram uma tarefa de compatibilidade seguida pela tarefa de Simon. No grupo compatível (14 voluntários, encontramos um efeito Simon de 24 ms. No incompatível (14 voluntários, ocorreu um efeito Simon inverso de -16 ms. Estes resultados mostram uma modulação da memória de longo prazo por uma tarefa envolvendo a memória de curto prazo.

  20. FPGA platform for MEMS Disc Resonance Gyroscope (DRG) control

    Science.gov (United States)

    Keymeulen, Didier; Peay, Chris; Foor, David; Trung, Tran; Bakhshi, Alireza; Withington, Phil; Yee, Karl; Terrile, Rich

    2008-04-01

    Inertial navigation systems based upon optical gyroscopes tend to be expensive, large, power consumptive, and are not long lived. Micro-Electromechanical Systems (MEMS) based gyros do not have these shortcomings; however, until recently, the performance of MEMS based gyros had been below navigation grade. Boeing and JPL have been cooperating since 1997 to develop high performance MEMS gyroscopes for miniature, low power space Inertial Reference Unit applications. The efforts resulted in demonstration of a Post Resonator Gyroscope (PRG). This experience led to the more compact Disc Resonator Gyroscope (DRG) for further reduced size and power with potentially increased performance. Currently, the mass, volume and power of the DRG are dominated by the size of the electronics. This paper will detail the FPGA based digital electronics architecture and its implementation for the DRG which will allow reduction of size and power and will increase performance through a reduction in electronics noise. Using the digital control based on FPGA, we can program and modify in real-time the control loop to adapt to the specificity of each particular gyro and the change of the mechanical characteristic of the gyro during its life time.

  1. Design and Simulation of MEMS Devices using Interval Analysis

    International Nuclear Information System (INIS)

    Shanmugavalli, M; Uma, G; Vasuki, B; Umapathy, M

    2006-01-01

    Modeling and simulation of MEMS devices are used to optimize the design, to improve the performance of the device, to reduce time to market, to minimize development time and cost by avoiding unnecessary design cycles and foundry runs. The major design objectives in any device design, is to meet the required functional parameters and the reliability of the device. The functional parameters depend on the geometry of the structure, material properties and process parameters. All model parameters act as input to optimize the functional parameters. The major difficulty the designer faces is the dimensions and properties used in the simulation of the MEMS devices can not be exactly followed during fabrication. In order to overcome this problem, the designer must test the device in simulation for bound of parameters involved in it. The paper demonstrates the use of interval methods to assess the electromechanical behaviour of micro electromechanical systems (MEMS) under the presence of manufacturing and process uncertainties. Interval method guides the design of pullin voltage analysis of fixed-fixed beam to achieve a robust and reliable design in a most efficient way. The methods are implemented numerically using Coventorware and analytically using Intlab

  2. Fabrication of a gas sensor array with micro-wells for VOCs gas sensing based on polymer/carbon nanotube thin films

    Science.gov (United States)

    Xie, Guangzhong; Xie, Tao; Zhu, Tao; Jiang, Yadong; Tai, Huiling

    2014-08-01

    In this paper, gas sensor array with micro-well was designed and prepared by Micro Electro-Mechanical Systems (MEMS) technology. The micro-well and interdigital electrodes of sensor array were prepared using photolithography process, reactive ion etching (RIE) process, wet etching and conventional vacuum evaporation. In the manufacture process of the gas sensor array, KOH wet etching process was mainly discussed. The optimum etching processing parameters were as follows: 30 wt% KOH solution at 80 °C, a cooling back-flow device and a magnetic stirrer. The multi-walled carbon nanotubes (MWCNTs)-polyethyleneoxide (PEO) and MWNTs-Polyvinylpyrrolidone (PVP) composite films were utilized as sensitive layers to test gas-sensing properties. Response performances of MWCNTs- PEO and MWNTs-PVP composite films to toluene vapor and methanol vapor at room temperature were investigated. The results revealed that the sensor array showed a larger sensitivity to toluene vapor than to methanol vapor. In addition, the sensing mechanisms were studied as well.

  3. Automatic synthesis of MEMS devices using self-adaptive hybrid metaheuristics

    DEFF Research Database (Denmark)

    Tutum, Cem Celal; Fan, Zhun

    2011-01-01

    - multaneous minimization of size and power input of a MEMS device, while investigating optimum geometrical conguration as the main concern. The major contribution of this paper is the application of self-adaptive memetic computing in MEMS design. An evolutionary multi-objective optimization (EMO) technique......, in particular non-dominated sorting genetic algorithm (NSGA-II), has been applied to- gether with a pattern recognition statistical tool, i.e. Principal Component Analysis (PCA), to nd multiple trade-o solutions in an ecient manner. Following this, a gradient- based local search, i.e. sequential quadratic...

  4. Dificuldade de aprendizagem em escrita, memória e contradições

    Directory of Open Access Journals (Sweden)

    Adriana Regina Marques de Souza

    Full Text Available Neste estudo, investigou-se as possíveis relações entre memória e contradições, comparando-se crianças de 2a. e 3a. séries do ensino fundamental com e sem dificuldade de aprendizagem em escrita. De 200 crianças 80 foram selecionadas pelo Adape (Avaliação de dificuldades na aprendizagem da escrita, sendo 40 crianças de segunda séries e 40 crianças de terceira séries. O nível de memória dos sujeitos foi obtido através da técnica II da prova de memória de configuração serial simples e para as contradições utilizou-se a prova do cheio e do vazio. Os resultados apresentaram significância entre nível de memória e desempenho na escrita, indicando que a instabilidade do nível intermediário produziu uma maior quantidade de erros. Quanto à contradição, a possibilidade de sua resolução, na terceira série, sugeriu uma diminuição significativa de erros.

  5. Creep characterization of Al alloy thin films for use in RF-MEMS switches

    NARCIS (Netherlands)

    Modlinski, R.; Witvrouw, A.; Ratchev, P.; Puers, R.; Toonder, den J.M.J.; Wolf, I.C.D.Y.M.

    2004-01-01

    Creep is expected to be a major reliability problem in some MEMS, as for example RF-MEMS switches, especially at high RF powers. For this reason it should be avoided to use creep sensitive materials in these devices. In this paper we report on creep studies on Al-alloys, materials that are often

  6. Lead salt resonant cavity enhanced detector with MEMS mirror

    Science.gov (United States)

    Felder, F.; Fill, M.; Rahim, M.; Zogg, H.; Quack, N.; Blunier, S.; Dual, J.

    2010-01-01

    We describe a tunable resonant cavity enhanced detector (RCED) for the mid-infrared employing narrow gap lead-chalcogenide (IV-VI) layers on a Si substrate. The device consists of an epitaxial Bragg reflector layer, a thin p-n+ heterojunction with PbSrTe as detecting layer and a micro-electro-mechanical system (MEMS) micromirror as second mirror. Despite the thin absorber layer the sensitivity is even higher than for a conventional detector. Tunability is achieved by changing the cavity length with a vertically movable MEMS mirror. The device may be used as miniature infrared spectrometer to cover the spectral range from 30 μm.

  7. 5 V Compatible Two-Axis PZT Driven MEMS Scanning Mirror with Mechanical Leverage Structure for Miniature LiDAR Application.

    Science.gov (United States)

    Ye, Liangchen; Zhang, Gaofei; You, Zheng

    2017-03-05

    The MEMS (Micro-Electronical Mechanical System) scanning mirror is an optical MEMS device that can scan laser beams across one or two dimensions. MEMS scanning mirrors can be applied in a variety of applications, such as laser display, bio-medical imaging and Light Detection and Ranging (LiDAR). These commercial applications have recently created a great demand for low-driving-voltage and low-power MEMS mirrors. However, no reported two-axis MEMS scanning mirror is available for usage in a universal supplying voltage such as 5 V. In this paper, we present an ultra-low voltage driven two-axis MEMS scanning mirror which is 5 V compatible. In order to realize low voltage and low power, a two-axis MEMS scanning mirror with mechanical leverage driven by PZT (Lead zirconate titanate) ceramic is designed, modeled, fabricated and characterized. To further decrease the power of the MEMS scanning mirror, a new method of impedance matching for PZT ceramic driven by a two-frequency mixed signal is established. As experimental results show, this MEMS scanning mirror reaches a two-axis scanning angle of 41.9° × 40.3° at a total driving voltage of 4.2 Vpp and total power of 16 mW. The effective diameter of reflection of the mirror is 2 mm and the operating frequencies of two-axis scanning are 947.51 Hz and 1464.66 Hz, respectively.

  8. Measuring time-dependent deformations in metallic MEMS

    NARCIS (Netherlands)

    Bergers, L.I.J.C.; Hoefnagels, J.P.M.; Delhey, N.K.R.; Geers, M.G.D.

    2011-01-01

    The reliability of metallic microelectromechanical systems (MEMS) depends on time-dependent deformation such as creep. Key to this process is the interaction between microstructural length scales and dimensional length scales, so-called size-effects. As a first critical step towards studying these

  9. An implantable integrated low-power amplifier-microelectrode array for Brain-Machine Interfaces.

    Science.gov (United States)

    Patrick, Erin; Sankar, Viswanath; Rowe, William; Sanchez, Justin C; Nishida, Toshikazu

    2010-01-01

    One of the important challenges in designing Brain-Machine Interfaces (BMI) is to build implantable systems that have the ability to reliably process the activity of large ensembles of cortical neurons. In this paper, we report the design, fabrication, and testing of a polyimide-based microelectrode array integrated with a low-power amplifier as part of the Florida Wireless Integrated Recording Electrode (FWIRE) project at the University of Florida developing a fully implantable neural recording system for BMI applications. The electrode array was fabricated using planar micromachining MEMS processes and hybrid packaged with the amplifier die using a flip-chip bonding technique. The system was tested both on bench and in-vivo. Acute and chronic neural recordings were obtained from a rodent for a period of 42 days. The electrode-amplifier performance was analyzed over the chronic recording period with the observation of a noise floor of 4.5 microVrms, and an average signal-to-noise ratio of 3.8.

  10. Development of A MEMS Based Manometric Catheter for Diagnosis of Functional Swallowing Disorders

    International Nuclear Information System (INIS)

    Hsu, H Y; Hariz, A J; Omari, T; Teng, M F; Sii, D; Chan, S; Lau, L; Tan, S; Lin, G; Haskard, M; Mulcahy, D; Bakewell, M

    2006-01-01

    Silicon pressure sensors based on micro-electro-mechanical-systems (MEMS) technologies are gaining popularity for applications in bio-medical devices. In this study, a silicon piezo-resistive pressure sensor die is used in a feasibility study of developing a manometric catheter for functional swallowing disorders diagnosis. The function of a manometric catheter is to measure the peak and intrabolus pressures along the esophageal segment during the swallowing action. Previous manometric catheters used the water perfusion technique to measure the pressure changes. This type of catheter is reusable, large in size and the pressure reading is recorded by an external transducer. Current manometric catheters use a solid state pressure sensor on the catheter itself to measure the pressure changes. This type of catheter reduces the discomfort to the patient but it is reusable and is very expensive. We carried out several studies and experiments on the MEMS-based pressure sensor die, and the results show the MEMS-based pressure sensors have a good stability and a good linearity output response, together with the advantage of low excitation biasing voltage and extremely small size. The MEMS-based sensor is the best device to use in the new generation of manometric catheters. The concept of the new MEMS-based manometric catheter consists of a pressure sensing sensor, supporting ring, the catheter tube and a data connector. Laboratory testing shows that the new calibrated catheter is capable of measuring pressure in the range from 0 to 100mmHg and maintaining stable condition on the zero baseline setting when no pressure is applied. In-vivo tests are carried out to compare the new MEMS based catheter with the current version of catheters used in the hospital

  11. Characterization of low temperature deposited atomic layer deposition TiO2 for MEMS applications

    NARCIS (Netherlands)

    Huang, Y.; Pandraud, G.; Sarro, P.M.

    2012-01-01

    TiO2 is an interesting and promising material for micro-/nanoelectromechanical systems (MEMS/NEMS). For high performance and reliable MEMS/NEMS, optimization of the optical characteristics, mechanical stress, and especially surface smoothness of TiO2 is required. To overcome the roughness issue of

  12. MEMS Gyroscopes Based on Acoustic Sagnac Effect

    Directory of Open Access Journals (Sweden)

    Yuanyuan Yu

    2016-12-01

    Full Text Available This paper reports on the design, fabrication and preliminary test results of a novel microelectromechanical systems (MEMS device—the acoustic gyroscope. The unique operating mechanism is based on the “acoustic version” of the Sagnac effect in fiber-optic gyros. The device measures the phase difference between two sound waves traveling in opposite directions, and correlates the signal to the angular velocity of the hosting frame. As sound travels significantly slower than light and develops a larger phase change within the same path length, the acoustic gyro can potentially outperform fiber-optic gyros in sensitivity and form factor. It also promises superior stability compared to vibratory MEMS gyros as the design contains no moving parts and is largely insensitive to mechanical stress or temperature. We have carried out systematic simulations and experiments, and developed a series of processes and design rules to implement the device.

  13. Giant piezoelectricity on Si for hyperactive MEMS.

    Science.gov (United States)

    Baek, S H; Park, J; Kim, D M; Aksyuk, V A; Das, R R; Bu, S D; Felker, D A; Lettieri, J; Vaithyanathan, V; Bharadwaja, S S N; Bassiri-Gharb, N; Chen, Y B; Sun, H P; Folkman, C M; Jang, H W; Kreft, D J; Streiffer, S K; Ramesh, R; Pan, X Q; Trolier-McKinstry, S; Schlom, D G; Rzchowski, M S; Blick, R H; Eom, C B

    2011-11-18

    Microelectromechanical systems (MEMS) incorporating active piezoelectric layers offer integrated actuation, sensing, and transduction. The broad implementation of such active MEMS has long been constrained by the inability to integrate materials with giant piezoelectric response, such as Pb(Mg(1/3)Nb(2/3))O(3)-PbTiO(3) (PMN-PT). We synthesized high-quality PMN-PT epitaxial thin films on vicinal (001) Si wafers with the use of an epitaxial (001) SrTiO(3) template layer with superior piezoelectric coefficients (e(31,f) = -27 ± 3 coulombs per square meter) and figures of merit for piezoelectric energy-harvesting systems. We have incorporated these heterostructures into microcantilevers that are actuated with extremely low drive voltage due to thin-film piezoelectric properties that rival bulk PMN-PT single crystals. These epitaxial heterostructures exhibit very large electromechanical coupling for ultrasound medical imaging, microfluidic control, mechanical sensing, and energy harvesting.

  14. SOI silicon on glass for optical MEMS

    DEFF Research Database (Denmark)

    Larsen, Kristian Pontoppidan; Ravnkilde, Jan Tue; Hansen, Ole

    2003-01-01

    and a final sealing at the interconnects can be performed using a suitable polymer. Packaged MEMS on glass are advantageous within Optical MEMS and for sensitive capacitive devices. We report on experiences with bonding SOI to Pyrex. Uniform DRIE shallow and deep etching was achieved by a combination......A newly developed fabrication method for fabrication of single crystalline Si (SCS) components on glass, utilizing Deep Reactive Ion Etching (DRIE) of a Silicon On Insulator (SOI) wafer is presented. The devices are packaged at wafer level in a glass-silicon-glass (GSG) stack by anodic bonding...... of an optimized device layout and an optimized process recipe. The behavior of the buried oxide membrane when used as an etch stop for the through-hole etch is described. No harmful buckling or fracture of the membrane is observed for an oxide thickness below 1 μm, but larger and more fragile released structures...

  15. Perfis Diferenciais de Perda de Memória entre a Demência Frontotemporal e a do Tipo Alzheimer

    Directory of Open Access Journals (Sweden)

    Allegri Ricardo F.

    2001-01-01

    Full Text Available Os estados iniciais da demência tipo Alzheimer (DTA caracterizam-se classicamente por deterioração da memória enquanto que as mudanças de conduta e de personalidade aparecem nas etapas iniciais da demência frontotemporal (DFT. Entretanto, na prática clínica, o diagnóstico diferencial é difícil. O objetivo do presente trabalho foi estudar o rendimento da memória de pacientes com DTA (n= 20 e com DFT (n= 20 comparando-o com um grupo de controles (n = 20. Os pacientes, emparelhados por idade e escolaridade, foram avaliados com uma bateria neuropsicológica exaustiva. Para a avaliação da memória, examinou-se a "queixa subjetiva" de perda de memória (memória subjetiva, a aprendizagem de uma lista de palavras (memória episódica e o desempenho no teste de denominação de Boston (memória semântica. As pontuações de ambos os grupos de pacientes, na grande maioria das provas, foram significativamente inferiores às dos controles. Os pacientes com DTA mostraram uma deterioração global da memória episódica (tipo amnésia e semântica com um alto nível de queixa subjetiva. Os sujeitos com DFT, por outro lado, apresentaram um déficit de memória importante na recuperação da informação, mas com melhores capacidades de registro da informação, apesar das dificuldades de reconhecimento do seu distúrbio.

  16. Wafer-level vacuum/hermetic packaging technologies for MEMS

    Science.gov (United States)

    Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

    2010-02-01

    An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

  17. A review: aluminum nitride MEMS contour-mode resonator

    Science.gov (United States)

    Yunhong, Hou; Meng, Zhang; Guowei, Han; Chaowei, Si; Yongmei, Zhao; Jin, Ning

    2016-10-01

    Over the past several decades, the technology of micro-electromechanical system (MEMS) has advanced. A clear need of miniaturization and integration of electronics components has had new solutions for the next generation of wireless communications. The aluminum nitride (AlN) MEMS contour-mode resonator (CMR) has emerged and become promising and competitive due to the advantages of the small size, high quality factor and frequency, low resistance, compatibility with integrated circuit (IC) technology, and the ability of integrating multi-frequency devices on a single chip. In this article, a comprehensive review of AlN MEMS CMR technology will be presented, including its basic working principle, main structures, fabrication processes, and methods of performance optimization. Among these, the deposition and etching process of the AlN film will be specially emphasized and recent advances in various performance optimization methods of the CMR will be given through specific examples which are mainly focused on temperature compensation and reducing anchor losses. This review will conclude with an assessment of the challenges and future trends of the CMR. Project supported by National Natural Science Foundation (Nos. 61274001, 61234007, 61504130), the Nurturing and Development Special Projects of Beijing Science and Technology Innovation Base's Financial Support (No. Z131103002813070), and the National Defense Science and Technology Innovation Fund of CAS (No. CXJJ-14-M32).

  18. Calibration of an interfacial force microscope for MEMS metrology : FY08-09 activities.

    Energy Technology Data Exchange (ETDEWEB)

    Houston, Jack E.; Baker, Michael Sean; Crowson, Douglas A.; Mitchell, John Anthony; Moore, Nathan W.

    2009-10-01

    Progress in MEMS fabrication has enabled a wide variety of force and displacement sensing devices to be constructed. One device under intense development at Sandia is a passive shock switch, described elsewhere (Mitchell 2008). A goal of all MEMS devices, including the shock switch, is to achieve a high degree of reliability. This, in turn, requires systematic methods for validating device performance during each iteration of design. Once a design is finalized, suitable tools are needed to provide quality assurance for manufactured devices. To ensure device performance, measurements on these devices must be traceable to NIST standards. In addition, accurate metrology of MEMS components is needed to validate mechanical models that are used to design devices to accelerate development and meet emerging needs. Progress towards a NIST-traceable calibration method is described for a next-generation, 2D Interfacial Force Microscope (IFM) for applications in MEMS metrology and qualification. Discussed are the results of screening several suitable calibration methods and the known sources of uncertainty in each method.

  19. Frequency adjustable MEMS vibration energy harvester

    Science.gov (United States)

    Podder, P.; Constantinou, P.; Amann, A.; Roy, S.

    2016-10-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators.

  20. Frequency adjustable MEMS vibration energy harvester

    International Nuclear Information System (INIS)

    Podder, P; Constantinou, P; Roy, S; Amann, A

    2016-01-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators. (paper)

  1. Hollow MEMS

    DEFF Research Database (Denmark)

    Larsen, Peter Emil

    Miniaturization of electro mechanical sensor systems to the micro range and beyond has shown impressive sensitivities measuring sample properties like mass, viscosity, acceleration, pressure and force just to name a few applications. In order to enable these kinds of measurements on liquid samples...... a hollow MEMS sensor has been designed, fabricated and tested. Combined density, viscosity, buoyant mass spectrometry and IR absorption spectroscopy are possible on liquid samples and micron sized suspended particles (e.g. single cells). Measurements are based on changes in the resonant behavior...... of these sensors. Optimization of the microfabrication process has led to a process yield of almost 100% .This is achieved despite the fact, that the process still offers a high degree of flexibility. By simple modifications the Sensor shape can be optimized for different size ranges and sensitivities...

  2. MEMS sensors and wireless telemetry for distributed systems

    Energy Technology Data Exchange (ETDEWEB)

    Britton, C.L. Jr.; Warmack, R.J.; Smith, S.F. [and others

    1998-02-01

    Selectively coated cantilevers are being developed at ORNL for chemical and biological sensing. The sensitivity can exceed that of other electro-mechanical devices as parts-per-trillion detection can be demonstrated for certain species. The authors are now proceeding to develop systems that employ electrically readable microcantilevers in a standard MEMS process and standard CMOS processes. One of their primary areas of interest is chemical sensing for environmental applications. Towards this end, they are presently developing electronic readout of a mercury-sensitive coated cantilever. In order to field arrays of distributed sensors, a wireless network for data reporting is needed. For this, the authors are developing on-chip spread-spectrum encoding and modulation circuitry to improve the robustness and security of sensor data in typical interference- and multipath-impaired environments. They have also provided for a selection of distinct spreading codes to serve groups of sensors in a common environment by the application of code-division multiple-access techniques. Most of the RF circuitry they have designed and fabricated in 0.5 {micro}m CMOS has been tested and verified operational to above 1 GHz. The initial intended operation is for use in the 915 MHz Industrial, Scientific, and Medical (ISM) band. This paper presents measured data on the microcantilever-based mercury detector. They also present design data and measurements of the RF telemetry chip.

  3. Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach.

    Science.gov (United States)

    Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah

    2009-01-01

    Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.

  4. Infrastructure for the design and fabrication of MEMS for RF/microwave and millimeter wave applications

    Science.gov (United States)

    Nerguizian, Vahe; Rafaf, Mustapha

    2004-08-01

    This article describes and provides valuable information for companies and universities with strategies to start fabricating MEMS for RF/Microwave and millimeter wave applications. The present work shows the infrastructure developed for RF/Microwave and millimeter wave MEMS platforms, which helps the identification, evaluation and selection of design tools and fabrication foundries taking into account packaging and testing. The selected and implemented simple infrastructure models, based on surface and bulk micromachining, yield inexpensive and innovative approaches for distributed choices of MEMS operating tools. With different educational or industrial institution needs, these models may be modified for specific resource changes using a careful analyzed iteration process. The inputs of the project are evaluation selection criteria and information sources such as financial, technical, availability, accessibility, simplicity, versatility and practical considerations. The outputs of the project are the selection of different MEMS design tools or software (solid modeling, electrostatic/electromagnetic and others, compatible with existing standard RF/Microwave design tools) and different MEMS manufacturing foundries. Typical RF/Microwave and millimeter wave MEMS solutions are introduced on the platform during the evaluation and development phases of the project for the validation of realistic results and operational decision making choices. The encountered challenges during the investigation and the development steps are identified and the dynamic behavior of the infrastructure is emphasized. The inputs (resources) and the outputs (demonstrated solutions) are presented in tables and flow chart mode diagrams.

  5. Axial asymmetry for improved sensitivity in MEMS piezoresistors

    International Nuclear Information System (INIS)

    Shuvra, Pranoy Deb; McNamara, Shamus; Lin, Ji-Tzuoh; Alphenaar, Bruce; Walsh, Kevin; Davidson, Jim

    2016-01-01

    The strain induced resistance change is compared for asymmetric, symmetric and diffused piezoresistive elements. Finite element analysis is used to simulate the performance of a T-shaped piezoresistive MEMS cantilever, including a lumped parameter model to show the effect of geometric asymmetry on the piezoresistor sensitivity. Asymmetric piezoresistors are found to be much more sensitive to applied load than the typical symmetric design producing about two orders of magnitude higher resistance change. This is shown to be due to the difference in the stress distribution in the symmetric and asymmetric geometries resulting in less resistance change cancellation in the asymmetric design. Although still less sensitive than diffused piezoresistors, asymmetric piezoresistors are sensitive enough for many applications, and are much easier to fabricate and integrate into MEMS devices. (paper)

  6. CARES/Life Used for Probabilistic Characterization of MEMS Pressure Sensor Membranes

    Science.gov (United States)

    Nemeth, Noel N.

    2002-01-01

    Microelectromechanical systems (MEMS) devices are typically made from brittle materials such as silicon using traditional semiconductor manufacturing techniques. They can be etched (or micromachined) from larger structures or can be built up with material deposition processes. Maintaining dimensional control and consistent mechanical properties is considerably more difficult for MEMS because feature size is on the micrometer scale. Therefore, the application of probabilistic design methodology becomes necessary for MEMS. This was demonstrated at the NASA Glenn Research Center and Case Western Reserve University in an investigation that used the NASA-developed CARES/Life brittle material design program to study the probabilistic fracture strength behavior of single-crystal SiC, polycrystalline SiC, and amorphous Si3N4 pressurized 1-mm-square thin-film diaphragms. These materials are of interest because of their superior high-temperature characteristics, which are desirable for harsh environment applications such as turbine engine and rocket propulsion system hot sections.

  7. Violència i memòria en Milan Kundera

    OpenAIRE

    Tafalla, Marta

    2007-01-01

    Partint de la filosofia de la memòria de TW Adorno, aquest article defensa la tesi deque la literatura té una major capacitat que la història o la filosofia per explicar Enquin consisteixen els règims totalitaris i per salvaguardar la memòria de les seves víctimes. Amb aquest propòsit, pren com a exemple la literatura de l'escriptor txec Milan Kundera yanaliza algunes de les seves obres, especialment El llibre del riure i l'oblit, La insoportablelevedad l'ésser i el seu assaig L'art de...

  8. Lessons learned from nanoscale specimens tested by MEMS-based apparatus

    Science.gov (United States)

    Elhebeary, Mohamed; Saif, M. Taher A.

    2017-06-01

    The last two decades were marked by the innovative synthesis of nanomaterials and devices. The success of these devices hinges on the mechanical properties of nanomaterials and an understanding of their deformation and failure mechanisms. Many novel testing techniques have been developed to test materials at small scale. This paper reviews the state-of-the-art microelectromechanical systems (MEMS) apparatus developed to characterize materials at nanoscale, and the key insights gained on structure-property relations of materials through these characterizations. Finally, new applications of MEMS in testing living materials, such as tissues and cells, for disease diagnosis and prognosis are discussed.

  9. Lessons learned from nanoscale specimens tested by MEMS-based apparatus

    International Nuclear Information System (INIS)

    Elhebeary, Mohamed; Saif, M Taher A

    2017-01-01

    The last two decades were marked by the innovative synthesis of nanomaterials and devices. The success of these devices hinges on the mechanical properties of nanomaterials and an understanding of their deformation and failure mechanisms. Many novel testing techniques have been developed to test materials at small scale. This paper reviews the state-of-the-art microelectromechanical systems (MEMS) apparatus developed to characterize materials at nanoscale, and the key insights gained on structure-property relations of materials through these characterizations. Finally, new applications of MEMS in testing living materials, such as tissues and cells, for disease diagnosis and prognosis are discussed. (topical review)

  10. Design and Simulation of an RF-MEMS Switch and analysis of its Electromagnetic aspect in realtion to stress

    Directory of Open Access Journals (Sweden)

    Amna Riaz

    2018-01-01

    Full Text Available Microelectromechanical Systems (MEMS are devices made up of several electrical and mechanical components. They consist of mechanical functions (sensing, thermal, inertial and electrical functions (switching, decision making on a single chip made by microfabrication methods. These chips exhibit combined properties of the two functions. The size of system has characteristic dimensions less than 1mm but more than 1μm. The configuration of these components determine the final deliverables of the switch. MEMS can be designed to meet user requirements on any level from microbiological application such as biomedical transducers or tissue engineering, to mechanical systems such as microfluidic diagnoses or chemical fuel cells. The low cost, small mass and minimal power consumption of the MEMS makes it possible to readily integrate to any kind of system in any environment. MEMS are faster, better and cheaper. They offer excellent electrical performances. MEMS working at Radio frequencies are RF MEMS. RF-MEMS switches find huge market in the modern telecommunication networks, biological, automobiles, satellites and defense systems because of their lower power consumptions at relatively higher frequencies and better electrical performances. But the reliability is the major hurdle in the fate of RF MEMS switches. Reliability mainly arises due to the presence of residual stresses, charging current, fatigue and creep and contact degradation. The presence of residual stresses in switches the S-Parameters of the switches are affected badly and the residual stress affects the final planarity of the fabricated structure. Design and simulation of an RF-MEMS switch is proposed considering the residual stresses in both on and off state. The operating frequency band is being optimized and the best possible feasible fabrication technique for the proposed switch design is being analyzed. S-Parameters are calculated and a comparison for the switches with stress and

  11. Mechanical and electromechanical properties of graphene and their potential application in MEMS

    International Nuclear Information System (INIS)

    Khan, Zulfiqar H; Kermany, Atieh R; Iacopi, Francesca; Öchsner, Andreas

    2017-01-01

    Graphene-based micro-electromechanical systems (MEMS) are very promising candidates for next generation miniaturized, lightweight, and ultra-sensitive devices. In this review, we review the progress to date of the assessment of the mechanical, electromechanical, and thermomechanical properties of graphene for application in graphene-based MEMS. Graphene possesses a plethora of outstanding properties—such as a 1 TPa Young’s modulus, exceptionally high 2D failure strength that stems from its sp 2 hybridization, and strong sigma bonding between carbon atoms. Such exceptional mechanical properties can enable, for example, graphene-based sound sources capable of generating sound beyond the audible range. The recently engineered piezoelectric properties of atomic force microscope tip-pressed graphene membranes or supported graphene on SiO 2 substrates, have paved the way in fabricating graphene-based nano-generators and actuators. On the other hand, graphene’s piezoresistive properties have enabled miniaturized pressure and strain sensors. 2D graphene nano-mechanical resonators can potentially measure ultralow forces, charges and potentially detect single atomic masses. The exceptional tribology of graphene can play a significant role in achieving superlubricity. In addition, the highest reported thermal conductivity of graphene is amenable for use in chips and providing better performing MEMS, as heat is efficiently dissipated. On top of that, graphene membranes could be nano-perforated to realize specialized applications like DNA translocation and desalination. Finally, to ensure stability and reliability of the graphene-based MEMS, adhesion is an important mechanical property that should be considered. In general, graphene could be used as a structural material in resonators, sensors, actuators and nano-generators with better performance and sensitivity than conventional MEMS. (topical review)

  12. Miniaturized Rotary Actuators Using Shape Memory Alloy for Insect-Type MEMS Microrobot

    Directory of Open Access Journals (Sweden)

    Ken Saito

    2016-03-01

    Full Text Available Although several types of locomotive microrobots have been developed, most of them have difficulty locomoting on uneven surfaces. Thus, we have been focused on microrobots that can locomote using step patterns. We are studying insect-type microrobot systems. The locomotion of the microrobot is generated by rotational movements of the shape memory alloy-type rotary actuator. In addition, we have constructed artificial neural networks by using analog integrated circuit (IC technology. The artificial neural networks can output the driving waveform without using software programs. The shape memory alloy-type rotary actuator and the artificial neural networks are constructed with silicon wafers; they can be integrated by using micro-electromechanical system (MEMS technology. As a result, the MEMS microrobot system can locomote using step patterns. The insect-type MEMS microrobot system is 0.079 g in weight and less than 5.0 mm in size, and its locomotion speed is 2 mm/min. The locomotion speed is slow because the heat of the shape memory alloy conducts to the mechanical parts of the MEMS microrobot. In this paper, we discuss a new rotary actuator compared with the previous model and show the continuous rotation of the proposed rotary actuator.

  13. Characterization of dielectric charging in RF MEMS

    NARCIS (Netherlands)

    Herfst, R.W.; Huizing, H.G.A.; Steeneken, P.G.; Schmitz, Jurriaan

    2005-01-01

    Capacitive RF MEMS switches show great promise for use in wireless communication devices such as mobile phones, but the successful application of these switches is hindered by the reliability of the devices: charge injection in the dielectric layer (SiN) can cause irreversible stiction of the moving

  14. Aula de história: subjetividade e memória na aprendizagem de alunos

    OpenAIRE

    Scoz, Beatriz Judith Lima; Rodrigues, Vilma Nardes Silva

    2015-01-01

    Este artigo apresenta o relato de uma pesquisa sobre as relações entre memória individual e memória coletiva nas aulas de História para compreender suas interferências na produção de sentidos subjetivos dos alunos na aprendizagem de História. A coleta de dados foi feita a partir do filme "Narradores de Javé" e da "conversação livre" com alunos da 8a série de uma escola pública de São Paulo. A pesquisa fundamenta-se nas concepções teóricas de Halbwachs e Placco, & Souza acerca da memória. No q...

  15. HARM processing techniques for MEMS and MOEMS devices using bonded SOI substrates and DRIE

    Science.gov (United States)

    Gormley, Colin; Boyle, Anne; Srigengan, Viji; Blackstone, Scott C.

    2000-08-01

    Silicon-on-Insulator (SOI) MEMS devices (1) are rapidly gaining popularity in realizing numerous solutions for MEMS, especially in the optical and inertia application fields. BCO recently developed a DRIE trench etch, utilizing the Bosch process, and refill process for high voltage dielectric isolation integrated circuits on thick SOI substrates. In this paper we present our most recently developed DRIE processes for MEMS and MOEMS devices. These advanced etch techniques are initially described and their integration with silicon bonding demonstrated. This has enabled process flows that are currently being utilized to develop optical router and filter products for fiber optics telecommunications and high precision accelerometers.

  16. MEM spectral analysis for predicting influenza epidemics in Japan.

    Science.gov (United States)

    Sumi, Ayako; Kamo, Ken-ichi

    2012-03-01

    The prediction of influenza epidemics has long been the focus of attention in epidemiology and mathematical biology. In this study, we tested whether time series analysis was useful for predicting the incidence of influenza in Japan. The method of time series analysis we used consists of spectral analysis based on the maximum entropy method (MEM) in the frequency domain and the nonlinear least squares method in the time domain. Using this time series analysis, we analyzed the incidence data of influenza in Japan from January 1948 to December 1998; these data are unique in that they covered the periods of pandemics in Japan in 1957, 1968, and 1977. On the basis of the MEM spectral analysis, we identified the periodic modes explaining the underlying variations of the incidence data. The optimum least squares fitting (LSF) curve calculated with the periodic modes reproduced the underlying variation of the incidence data. An extension of the LSF curve could be used to predict the incidence of influenza quantitatively. Our study suggested that MEM spectral analysis would allow us to model temporal variations of influenza epidemics with multiple periodic modes much more effectively than by using the method of conventional time series analysis, which has been used previously to investigate the behavior of temporal variations in influenza data.

  17. Mechanisms of fatigue in LIGA Ni MEMS thin films

    International Nuclear Information System (INIS)

    Yang, Y.; Imasogie, B.I.; Allameh, S.M.; Boyce, B.; Lian, K.; Lou, J.; Soboyejo, W.O.

    2007-01-01

    This paper presents the results of an experimental study of the mechanisms of fatigue in LIGA Ni micro-electro-mechanical systems (MEMS) thin films with micro-scale columnar and nano-scale equiaxed grains. Stress-life behavior is reported for films with thicknesses of 70 and 270 μm. The stress-life data are compared with previously reported data for Ni MEMS films and bulk Ni. The films with the nano-scale grains (15 nm average grain size) are shown to have higher strength and fatigue resistance (stress-life data) than those with columnar grain structures. The thicker films (with a columnar microstructure) are also shown to have comparable fatigue life to annealed Ni, while the thinner films (with a columnar microstructure) have comparable fatigue life to wrought Ni. The underlying mechanisms of crack nucleation and growth are elucidated via scanning and transmission electron microscopy. These reveal the formation of slip bands and surface oxides and crystallographic surface/sub-surface crack nucleation and growth in the films with the columnar structures. Surface and corner crack nucleations (from pre-existing defects) are observed in the nanostructured films. The implications of the results are discussed for the analyses of fatigue in nickel MEMS structures

  18. On Orbit Immuno-Based, Label-Free, White Blood Cell Counting System with MicroElectroMechanical Sensor (MEMS) Technology (OILWBCS-MEMS), Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Aurora Flight Sciences Corporation and partner, Draper Laboratory, propose to develop an on-orbit immuno-based label-free white blood cell counting system using MEMS...

  19. Wafer-Level Membrane-Transfer Process for Fabricating MEMS

    Science.gov (United States)

    Yang, Eui-Hyeok; Wiberg, Dean

    2003-01-01

    A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectromechanical systems (MEMS) that have been fabricated on dissimilar substrates. Unlike in some older membrane-transfer processes, there is no use of wax or epoxy during transfer. In this process, the substrate of a wafer-level structure to be transferred serves as a carrier, and is etched away once the transfer has been completed. Another important feature of this process is that two electrodes constitutes an electrostatic actuator array. An SOI wafer and a silicon wafer (see Figure 1) are used as the carrier and electrode wafers, respectively. After oxidation, both wafers are patterned and etched to define a corrugation profile and electrode array, respectively. The polysilicon layer is deposited on the SOI wafer. The carrier wafer is bonded to the electrode wafer by using evaporated indium bumps. The piston pressure of 4 kPa is applied at 156 C in a vacuum chamber to provide hermetic sealing. The substrate of the SOI wafer is etched in a 25 weight percent TMAH bath at 80 C. The exposed buried oxide is then removed by using 49 percent HF droplets after an oxygen plasma ashing. The SOI top silicon layer is etched away by using an SF6 plasma to define the corrugation profile, followed by the HF droplet etching of the remaining oxide. The SF6 plasma with a shadow mask selectively etches the polysilicon membrane, if the transferred membrane structure needs to be patterned. Electrostatic actuators with various electrode gaps have been fabricated by this transfer technique. The gap between the transferred membrane and electrode substrate is very uniform ( 0.1 m across a wafer diameter of 100 mm, provided by optimizing the bonding control). Figure 2 depicts the finished product.

  20. Fractal Structures For Mems Variable Capacitors

    KAUST Repository

    Elshurafa, Amro M.

    2014-08-28

    In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure, wherein the capacitor body has an upper first metal plate with a fractal shape separated by a vertical distance from a lower first metal plate with a complementary fractal shape; and a substrate above which the capacitor body is suspended.

  1. Chemically Functionalized Arrays Comprising Micro and Nano-Etro-Mechanizal Systems for Reliable and Selective Characterization of Tank Waste

    International Nuclear Information System (INIS)

    Sepaniak, Michael J.

    2008-01-01

    Innovative technology of sensory and selective chemical monitoring of hazardous wastes present in storage tanks are of continued importance to the environment. This multifaceted research program exploits the unique characteristics of micro and nano-fabricated cantilever-based, micro-electro-mechanical systems (MEMES) and nano-electro-mechanical systems (NEMS) in chemical sensing. Significant progress was made in tasks that were listed in the work plan for DOE EMSP project 'Hybrid Micro-Electro-Mechanical Systems for Highly Reliable and Selective Characterization of Tank Waste'. These tasks are listed below in modified form followed by the report on progress. (1) Deposit chemically selective phases on model MEMS devices with nanostructured surface layers to identify optimal technological approaches. (2) Monitor mechanical (deflection) and optical (SERS) responses of the created MEMS to organic and inorganic species in aqueous environments. (3) Explore and compare different approaches to immobilization of selective phases on the thermal detectors. (4) Demonstrate improvements in selectivity and sensitivity to model pollutants due to implemented technologies of nanostructuring and multi-mode read-out. (5) Demonstrate detection of different analytes on a single hybrid MEMS (6) Implement the use of differential pairs of cantilever sensors (coated and reference) with the associated detector electronics which is expected to have an enhanced sensitivity with a low-noise low-drift response. (7) Development of methods to create differential arrays and test effectiveness at creating distinctive differential responses.

  2. Consolidação da memória e estresse pós-traumático

    Directory of Open Access Journals (Sweden)

    Quevedo João

    2003-01-01

    Full Text Available Vários estudos em humanos e animais têm demonstrado que a formação da memória é facilitada por um sistema modulatório endógeno, mediado pela liberação de hormônios de estresse e pela ativação da amígdala cerebral. Esse sistema é adaptativo em termos evolutivos, permitindo o reforço de memórias importantes para a sobrevivência. Em condições de estresse emocional, esse mesmo sistema pode levar à formação de memórias vívidas e duradouras, características do TEPT. O entendimento dos mecanismos da consolidação da memória pode contribuir para o tratamento do TEPT.

  3. Anharmonic thermal vibrations of be metal found in the MEM nuclear density map

    International Nuclear Information System (INIS)

    Takata, Masaki; Sakata, Makoto; Larsen, F.K.; Kumazawa, Shintaro; Iversen, B.B.

    1993-01-01

    A direct observation of the thermal vibrations of Be metal was performed by the Maximum Entropy Method (MEM) using neutron single crystal data. In the previous study, the existence of the small but significant cubic anharmonicity of Be has been found by the conventional least squares refinement of the observed structure factors [Larsen, Lehmann and Merisalo (1980) Acta Cryst. A36, 159-163]. In the present study, the same data were used for the MEM analysis which are comprised of 48 reflections up to sinθ/λ = 1.41A -1 in order to obtain the high resolution nuclear density of Be without using any thermal vibrational model. It was directly visible in the MEM map that not only the cubic terms but also quartic anharmonicities exist in the thermal vibrations of Be nuclei. In order to evaluate thermal parameters of Be including anharmonic terms quantitatively, the least squares refinement of the effective one-particle potential (OPP) parameters up to quartic term was carried out by using the MEM nuclear densities around atomic sites as the data set to be fitted. It was found that the present treatment has a great advantage to decide the most appropriate model of OPP by visually comparing the model with MEM density map. As a result of the least squares refinement, the anharmonic thermal parameters are obtained as α 33 = -0.340(5)[eV/A 3 ], α 40 = 0, β 20 = 9.89(1)[eV/A 4 ] and γ 00 = 0. No other anharmonic term was significant. (author)

  4. Research on the attitude of small UAV based on MEMS devices

    Science.gov (United States)

    Shi, Xiaojie; Lu, Libin; Jin, Guodong; Tan, Lining

    2017-05-01

    This paper mainly introduces the research principle and implementation method of the small UAV navigation attitude system based on MEMS devices. The Gauss - Newton method based on least squares is used to calibrate the MEMS accelerometer and gyroscope for calibration. Improve the accuracy of the attitude by using the modified complementary filtering to correct the attitude angle error. The experimental data show that the design of the attitude and attitude system in this paper to meet the requirements of small UAV attitude accuracy to achieve a small, low cost.

  5. Novel SU-8 based vacuum wafer-level packaging for MEMS devices

    DEFF Research Database (Denmark)

    Murillo, Gonzalo; Davis, Zachary James; Keller, Stephan Urs

    2010-01-01

    This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versa......This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability...

  6. MEMS - Munich Energy Management System. FIA Project: Exchange of research information; MEMS - Muenchner Energiemanagement-System. FIA-Projekt - Forschungs-Informations-Austausch

    Energy Technology Data Exchange (ETDEWEB)

    Funk, H.; Fries, W.

    2001-10-01

    The City of Munich developed the project 'Munich Energy-Management-Systems (MEMS)' with financial support from the Federal Ministry of Economy and Technology. The project is based on a system of building automation using as many standard elements of hardware and software as possible. This will guarantee a high degree of independence from suppliers and subcontractors. The project has led to a reliable working base for the evaluation, measuring and control for ca. 150 municipal buildings. (orig.) [German] Mit dem Projekt 'Muenchner Energie-Management-System (MEMS)' erstellte die Landeshauptstadt Muenchen mit finanzieller Unterstuetzung des Bundesministeriums fuer Wirtschaft und Technologie ein auf der Leitzentrale Haustechnik (LZH) basierendes zentrales Energiemanagementsystem. Die Verwendung moeglichst vieler Standards in Hard- und Software ist dabei ein wesentlicher Gesichtspunkt. Dadurch wurde eine weitgehende Unabhaengigkeit von einem einzelnen Hersteller erreicht. Damit wurde ein Erfassungs-, Auswerte- und Steuerungssystem fuer derzeit rund 150 staedtische Gebaeude geschaffen. (orig.)

  7. Centimeter-scale MEMS scanning mirrors for high power laser application

    Science.gov (United States)

    Senger, F.; Hofmann, U.; v. Wantoch, T.; Mallas, C.; Janes, J.; Benecke, W.; Herwig, Patrick; Gawlitza, P.; Ortega-Delgado, M.; Grune, C.; Hannweber, J.; Wetzig, A.

    2015-02-01

    A higher achievable scan speed and the capability to integrate two scan axes in a very compact device are fundamental advantages of MEMS scanning mirrors over conventional galvanometric scanners. There is a growing demand for biaxial high speed scanning systems complementing the rapid progress of high power lasers for enabling the development of new high throughput manufacturing processes. This paper presents concept, design, fabrication and test of biaxial large aperture MEMS scanning mirrors (LAMM) with aperture sizes up to 20 mm for use in high-power laser applications. To keep static and dynamic deformation of the mirror acceptably low all MEMS mirrors exhibit full substrate thickness of 725 μm. The LAMM-scanners are being vacuum packaged on wafer-level based on a stack of 4 wafers. Scanners with aperture sizes up to 12 mm are designed as a 4-DOF-oscillator with amplitude magnification applying electrostatic actuation for driving a motor-frame. As an example a 7-mm-scanner is presented that achieves an optical scan angle of 32 degrees at 3.2 kHz. LAMM-scanners with apertures sizes of 20 mm are designed as passive high-Q-resonators to be externally excited by low-cost electromagnetic or piezoelectric drives. Multi-layer dielectric coatings with a reflectivity higher than 99.9 % have enabled to apply cw-laser power loads of more than 600 W without damaging the MEMS mirror. Finally, a new excitation concept for resonant scanners is presented providing advantageous shaping of intensity profiles of projected laser patterns without modulating the laser. This is of interest in lighting applications such as automotive laser headlights.

  8. Modeling methods of MEMS micro-speaker with electrostatic working principle

    Science.gov (United States)

    Tumpold, D.; Kaltenbacher, M.; Glacer, C.; Nawaz, M.; Dehé, A.

    2013-05-01

    The market for mobile devices like tablets, laptops or mobile phones is increasing rapidly. Device housings get thinner and energy efficiency is more and more important. Micro-Electro-Mechanical-System (MEMS) loudspeakers, fabricated in complementary metal oxide semiconductor (CMOS) compatible technology merge energy efficient driving technology with cost economical fabrication processes. In most cases, the fabrication of such devices within the design process is a lengthy and costly task. Therefore, the need for computer modeling tools capable of precisely simulating the multi-field interactions is increasing. The accurate modeling of such MEMS devices results in a system of coupled partial differential equations (PDEs) describing the interaction between the electric, mechanical and acoustic field. For the efficient and accurate solution we apply the Finite Element (FE) method. Thereby, we fully take the nonlinear effects into account: electrostatic force, charged moving body (loaded membrane) in an electric field, geometric nonlinearities and mechanical contact during the snap-in case between loaded membrane and stator. To efficiently handle the coupling between the mechanical and acoustic fields, we apply Mortar FE techniques, which allow different grid sizes along the coupling interface. Furthermore, we present a recently developed PML (Perfectly Matched Layer) technique, which allows limiting the acoustic computational domain even in the near field without getting spurious reflections. For computations towards the acoustic far field we us a Kirchhoff Helmholtz integral (e.g, to compute the directivity pattern). We will present simulations of a MEMS speaker system based on a single sided driving mechanism as well as an outlook on MEMS speakers using double stator systems (pull-pull-system), and discuss their efficiency (SPL) and quality (THD) towards the generated acoustic sound.

  9. Surface chemical modification for exceptional wear life of MEMS materials

    Directory of Open Access Journals (Sweden)

    R. Arvind Singh

    2011-12-01

    Full Text Available Micro-Electro-Mechanical-Systems (MEMS are built at micro/nano-scales. At these scales, the interfacial forces are extremely strong. These forces adversely affect the smooth operation and cause wear resulting in the drastic reduction in wear life (useful operating lifetime of actuator-based devices. In this paper, we present a surface chemical modification method that reduces friction and significantly extends the wear life of the two most popular MEMS structural materials namely, silicon and SU-8 polymer. The method includes surface chemical treatment using ethanolamine-sodium phosphate buffer, followed by coating of perfluoropolyether (PFPE nanolubricant on (i silicon coated with SU-8 thin films (500 nm and (ii MEMS process treated SU-8 thick films (50 μm. After the surface chemical modification, it was observed that the steady-state coefficient of friction of the materials reduced by 4 to 5 times and simultaneously their wear durability increased by more than three orders of magnitude (> 1000 times. The significant reduction in the friction coefficients is due to the lubrication effect of PFPE nanolubricant, while the exceptional increase in their wear life is attributed to the bonding between the -OH functional group of ethanolamine treated SU-8 thin/thick films and the -OH functional group of PFPE. The surface chemical modification method acts as a common route to enhance the performance of both silicon and SU-8 polymer. It is time-effective (process time ≤ 11 min, cost-effective and can be readily integrated into MEMS fabrication/assembly processes. It can also work for any kind of structural material from which the miniaturized devices are/can be made.

  10. EDITORIAL: Selected papers from the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2010) Selected papers from the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2010)

    Science.gov (United States)

    Reynaerts, Dominiek; Vullers, Ruud

    2011-10-01

    collaboration with the staff of IOP Publishing. PowerMEMS 2010 contents Harvesting energy from airflow with a michromachined piezoelectric harvester inside a Helmholtz resonator S P Matova, R Elfrink, R J M Vullers and R van Schaijk Analysis and characterization of triangular electrode structures for electrostatic energy harvestingDaniel Hoffmann, Bernd Folkmer and Yiannos Manoli A smart and self-sufficient frequency tunable vibration energy harvesterC Eichhorn, R Tchagsim, N Wilhelm and P Woias Power output enhancement of a vibration-driven electret generator for wireless sensor applicationsTatsuakira Masaki, Kenji Sakurai, Toru Yokoyama, Masayo Ikuta, Hiroshi Sameshima, Masashi Doi, Tomonori Seki and Masatoshi Oba Harvesting traffic-induced vibrations for structural health monitoring of bridgesT V Galchev, J McCullagh, R L Peterson and K Najafi Dispenser-printed planar thick-film thermoelectric energy generatorsA Chen, D Madan, P K Wright and J W Evans Silicon nanowire arrays as thermoelectric material for a power microgeneratorD Dávila, A Tarancón, M Fernández-Regúlez, C Calaza, M Salleras, A San Paulo and L Fonseca A micro thermal switch with a stiffness-enhanced thermal isolation structureTakashiro Tsukamoto, Masayoshi Esashi and Shuji Tanaka A dielectric liquid contact thermal switch with electrowetting actuationA R McLanahan, C D Richards and R F Richards A self-regulating valve for single-phase liquid cooling of microelectronicsRadu Donose, Michaël De Volder, Jan Peirs and Dominiek Reynaerts A MEMS-enabled 3D zinc-air microbattery with improved discharge characteristics based on a multilayer metallic substructureA Armutlulu, Y Fang, S H Kim, C H Ji, S A Bidstrup Allen and M G Allen Design, fabrication and testing of an air-breathing micro direct methanol fuel cell with compound anode flow fieldLuwen Wang, Yufeng Zhang, Youran Zhao, Zijiang An, Zhiping Zhou and Xiaowei Liu A shadow-mask evaporated pyroMEMS igniterD A de Koninck, D Briand and N F de Rooij Aerodynamic

  11. RF sputtering: A viable tool for MEMS fabrication

    Indian Academy of Sciences (India)

    being prepared by RF sputtering and their application in MEMS being explored. ... crystallographic properties were evaluated using XRD analysis (CuKα radiation ..... Bhatt V, Pal P, Chandra S 2005 Feasibility study of RF sputtered ZnO film for ...

  12. In-plane deeply-etched optical MEMS notch filter with high-speed tunability

    International Nuclear Information System (INIS)

    Sabry, Yasser M; Eltagoury, Yomna M; Shebl, Ahmed; Khalil, Diaa; Soliman, Mostafa; Sadek, Mohamed

    2015-01-01

    Notch filters are used in spectroscopy, multi-photon microscopy, fluorescence instrumentation, optical sensors and other life science applications. One type of notch filter is based on a fiber-coupled Fabry–Pérot cavity, which is formed by a reflector (external mirror) facing a dielectric-coated end of an optical fiber. Tailoring this kind of optical filter for different applications is possible because the external mirror has fewer mechanical and optical constraints. In this paper we present optical modeling and implementation of a fiber-coupled Fabry–Pérot filter based on dielectric-coated optical fiber inserted into a micromachined fiber groove facing a metallized micromirror, which is driven by a high-speed MEMS actuator. The optical MEMS chip is fabricated using deep reactive ion etching (DRIE) technology on a silicon on insulator wafer, where the optical axis is parallel to the substrate (in-plane) and the optical/mechanical components are self-aligned by the photolithographic process. The DRIE etching depth is 150 μm, chosen to increase the micromirror optical throughput and improving the out-of-plane stiffness of the MEMS actuator. The MEMS actuator type is closing-gap, while its quality factor is almost doubled by slotting the fixed plate. A low-finesse Fabry–Pérot interferometer is formed by the metallized surface of the micromirror and a cleaved end of a standard single-mode fiber, for characterization of the MEMS actuator stroke and resonance frequency. The actuator achieves a travel distance of 800 nm at a resonance frequency of 89.9 kHz. The notch filter characteristics were measured using an optical spectrum analyzer, and the filter exhibits a free spectral range up to 100 nm and a notch rejection ratio up to 20 dB around a wavelength of 1300 nm. The presented device provides batch processing and low-cost production of the filter. (paper)

  13. Some Design Considerations on the Electrostatically Actuated Fixed-Fixed End Type MEMS Switches

    International Nuclear Information System (INIS)

    Sadeghian, Hamed; Rezazadeh, Ghader; Sani, Ebrahim Abbaspour

    2006-01-01

    The nonlinear electrostatic pull-in behaviour of MEMS Switches in micro-electromechanical systems (MEMS) is investigated in this article. We used the distributed model when the electrostatic pressure didn't apply at the whole of the beam and applied only in the mid-part of the beam. In this part the electrostatic area is different from two other parts. The model uses Euler-Bernoulli beam theory for fixed-fixed end type beams. The finite difference method was used to solve the nonlinear equation. The proposed model includes the fringing effects of the electrical field, residual stress and varying electrostatic area effects. The numerical results reveal that the profile deflection of the MEMS Switch may not only influence the distribution of the electrostatic force but also considerably change the nonlinear pull-in voltage

  14. High Speed Magnetostrictive MEMS Actuated Mirror Deflectors, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The main goal of this proposal is to develop high speed magnetostrictive and MEMS actuators for rapidly deflecting or deforming mirrors. High speed, light-weight,...

  15. Integrated three-dimensional optical MEMS for chip-based fluorescence detection

    Science.gov (United States)

    Hung, Kuo-Yung; Tseng, Fan-Gang; Khoo, Hwa-Seng

    2009-04-01

    This paper presents a novel fluorescence sensing chip for parallel protein microarray detection in the context of a 3-in-1 protein chip system. This portable microchip consists of a monolithic integration of CMOS-based avalanche photo diodes (APDs) combined with a polymer micro-lens, a set of three-dimensional (3D) inclined mirrors for separating adjacent light signals and a low-noise transformer-free dc-dc boost mini-circuit to power the APDs (ripple below 1.28 mV, 0-5 V input, 142 V and 12 mA output). We fabricated our APDs using the planar CMOS process so as to facilitate the post-CMOS integration of optical MEMS components such as the lenses. The APD arrays were arranged in unique circular patterns appropriate for detecting the specific fluorescently labelled protein spots in our study. The array-type APDs were designed so as to compensate for any alignment error as detected by a positional error signal algorithm. The condenser lens was used as a structure for light collection to enhance the fluorescent signals by about 25%. This element also helped to reduce the light loss due to surface absorption. We fabricated an inclined mirror to separate two adjacent fluorescent signals from different specimens. Excitation using evanescent waves helped reduce the interference of the excitation light source. This approach also reduced the number of required optical lenses and minimized the complexity of the structural design. We achieved detection floors for anti-rabbit IgG and Cy5 fluorescent dye as low as 0.5 ng/µl (~3.268 nM). We argue that the intrinsic nature of point-to-point and batch-detection methods as showcased in our chip offers advantages over the serial-scanning approach used in traditional scanner systems. In addition, our system is low cost and lightweight.

  16. RF-MEMS Technology for High-Performance Passives; The challenge of 5G mobile applications

    Science.gov (United States)

    Iannacci, Jacopo

    2017-11-01

    Commencing with a review of the characteristics of RF-MEMS in relation to 5G, the book proceeds to develop practical insight concerning the design and development of RF-MEMS including case studies of design concepts. Including multiphysics simulation and animated figures, the book will be essential reading for both academic and industrial researchers and engineers.

  17. One-chip Integrated Module of MEMS Shock Sensor and Sensing Amplifier LSI using Pseudo-SOC Technology

    Science.gov (United States)

    Iida, Atsuko; Onozuka, Yutaka; Nishigaki, Michihiko; Yamada, Hiroshi; Funaki, Hideyuki; Itaya, Kazuhiko

    We have been developing the pseudo-SOC technology for one-chip module integration of heterogeneous devices that realizes high electrical performance and high density of devices embodying the advantages of both SOC technology and SIP technology. Especially, this technology is available for MEMS-LSI integration. We developed a 0.2mm-thickness one-chip module integrating a MEMS shock sensor and a sensing amplifier LSI by applying this technology. The MEMS shock sensor and the sensing amplifier LSI were connected by high-rigidity epoxy resin optimized the material constants to reduce the stress and the warpage resulting from resin shrinkage due to curing. Then the planar insulating layer and the redistributed conducting layer were formed on it for the global layer. The MEMS shock sensor was preformed to be modularized with a glass cap. Electrical contacts were achieved by bonding of Au bumps on the MEMS fixed electrodes and via holes filled with Ag paste of the glass cap. Functional performance was confirmed by obtaining signal corresponding to the reference signal of the pick-up sensor. Furthermore, stress analysis was performed using the FEM model simulation considering the resin shrinkage.

  18. Characterization of a piezoelectric MEMS actuator surface toward motion-enabled reconfigurable RF circuits

    Science.gov (United States)

    Tellers, M. C.; Pulskamp, J. S.; Bedair, S. S.; Rudy, R. Q.; Kierzewski, I. M.; Polcawich, R. G.; Bergbreiter, S. E.

    2018-03-01

    As an alternative to highly constrained hard-wired reconfigurable RF circuits, a motion-enabled reconfigurable circuit (MERC) offers freedom from transmission line losses and homogeneous materials selection. The creation of a successful MERC requires a precise mechanical mechanism for relocating components. In this work, a piezoelectric MEMS actuator array is modeled and experimentally characterized to assess its viability as a solution to the MERC concept. Actuation and design parameters are evaluated, and the repeatability of high quality on-axis motion at greater than 1 mm s-1 is demonstrated with little positional error. Finally, an initial proof-of-concept circuit reconfiguration has been demonstrated using off-the-shelf RF filter components. Although initial feasibility tests show filter performance degradation with an additional insertion loss of 0.3 dB per contact, out-of-band rejection degradation as high as 10 dB, and ripple performance reduction from 0.25 dB to 1.5 dB, MERC is proven here as an alternative to traditional approaches used in reconfigurable RF circuit applications.

  19. Integration of nanostructured materials with MEMS microhotplate platforms to enhance chemical sensor performance

    International Nuclear Information System (INIS)

    Benkstein, Kurt D.; Martinez, Carlos J.; Li, Guofeng; Meier, Douglas C.; Montgomery, Christopher B.; Semancik, Steve

    2006-01-01

    The development of miniaturized chemical sensors is an increasingly active area of research. Such devices, particularly when they feature low mass and low power budgets, can impact a broad range of applications including industrial process monitoring, building security and extraterrestrial exploration. Nanostructured materials, because of their high surface area, can provide critical enhancements in the performance of chemical microsensors. We have worked to integrate nanomaterial films with MEMS (microelectromechanical systems) microhotplate platforms developed at the National Institute of Standards and Technology in order to gain the benefits of both the materials and the platforms in high-performance chemical sensor arrays. Here, we describe our success in overcoming the challenges of integration and the benefits that we have achieved with regard to the critical sensor performance characteristics of sensor response, speed, stability and selectivity. Nanostructured metal oxide sensing films were locally deposited onto microhotplates via chemical vapor deposition and microcapillary pipetting, and conductive polymer nanoparticle films were deposited via electrophoretic patterning. All films were characterized by scanning electron microscopy and evaluated as conductometric gas sensors

  20. Engineering stress in thin films for the field of bistable MEMS

    International Nuclear Information System (INIS)

    Ratnayake, Dilan; Gowrishetty, Usha R; McNamara, Shamus P; Walsh, Kevin M; Martin, Michael D; Porter, Daniel A; Berfield, Thomas A

    2015-01-01

    While stress-free and tensile films are well-suited for released in-plane MEMS designs, compressive films are needed for released out-of-plane MEMS structures such as buckled beams and diaphragms. This study presents a characterization of stress on a variety of sputtered and plasma-enhanced chemical vapour deposition (PECVD)-deposited films, including titanium tungsten, invar, silicon nitride and amorphous silicon, appropriate for the field of bistable MEMS. Techniques and strategies are presented (including varying substrate bias, pressure, temperature, and frequency multiplexing) for tuning internal stress across the spectrum from highly compressive (−2300 MPa) to highly tensile (1500 MPa). Conditions for obtaining stress-free films are also presented in this work. Under certain conditions during the PECVD deposition of amorphous silicon, interesting ‘micro-bubbles’ formed within the deposited films. Strategies to mitigate their formation are presented, resulting in a dramatic improvement in surface roughness quality from 667 nm root mean square (RMS) to 16 nm RMS. All final deposited films successfully passed the traditional ‘tape test’ for adhesion. (paper)

  1. RF MEMS Fractal Capacitors With High Self-Resonant Frequencies

    KAUST Repository

    Elshurafa, Amro M.; Emira, Ahmed; Radwan, Ahmed Gomaa; Salama, Khaled N.

    2012-01-01

    This letter demonstrates RF microelectromechanical systems (MEMS) fractal capacitors possessing the highest reported self-resonant frequencies (SRFs) in PolyMUMPS to date. Explicitly, measurement results show SRFs beyond 20 GHz. Furthermore, quality

  2. A 32 x 32 capacitive micromachined ultrasonic transducer array manufactured in standard CMOS.

    Science.gov (United States)

    Lemmerhirt, David F; Cheng, Xiaoyang; White, Robert; Rich, Collin A; Zhang, Man; Fowlkes, J Brian; Kripfgans, Oliver D

    2012-07-01

    As ultrasound imagers become increasingly portable and lower cost, breakthroughs in transducer technology will be needed to provide high-resolution, real-time 3-D imaging while maintaining the affordability needed for portable systems. This paper presents a 32 x 32 ultrasound array prototype, manufactured using a CMUT-in-CMOS approach whereby ultrasonic transducer elements and readout circuits are integrated on a single chip using a standard integrated circuit manufacturing process in a commercial CMOS foundry. Only blanket wet-etch and sealing steps are added to complete the MEMS devices after the CMOS process. This process typically yields better than 99% working elements per array, with less than ±1.5 dB variation in receive sensitivity among the 1024 individually addressable elements. The CMUT pulseecho frequency response is typically centered at 2.1 MHz with a -6 dB fractional bandwidth of 60%, and elements are arranged on a 250 μm hexagonal grid (less than half-wavelength pitch). Multiplexers and CMOS buffers within the array are used to make on-chip routing manageable, reduce the number of physical output leads, and drive the transducer cable. The array has been interfaced to a commercial imager as well as a set of custom transmit and receive electronics, and volumetric images of nylon fishing line targets have been produced.

  3. Micro packaged MEMS pressure sensor for intracranial pressure measurement

    International Nuclear Information System (INIS)

    Liu Xiong; Yao Yan; Ma Jiahao; Zhang Zhaohua; Zhang Yanhang; Wang Qian; Ren Tianling

    2015-01-01

    This paper presents a micro packaged MEMS pressure sensor for intracranial pressure measurement which belongs to BioMEMS. It can be used in lumbar puncture surgery to measure intracranial pressure. Miniaturization is key for lumbar puncture surgery because the sensor must be small enough to allow it be placed in the reagent chamber of the lumbar puncture needle. The size of the sensor is decided by the size of the sensor chip and package. Our sensor chip is based on silicon piezoresistive effect and the size is 400 × 400 μm 2 . It is much smaller than the reported polymer intracranial pressure sensors such as liquid crystal polymer sensors. In terms of package, the traditional dual in-line package obviously could not match the size need, the minimal size of recently reported MEMS-based intracranial pressure sensors after packaging is 10 × 10 mm 2 . In this work, we are the first to introduce a quad flat no-lead package as the package form of piezoresistive intracranial pressure sensors, the whole size of the sensor is minimized to only 3 × 3 mm 2 . Considering the liquid measurement environment, the sensor is gummed and waterproof performance is tested; the sensitivity of the sensor is 0.9 × 10 −2 mV/kPa. (paper)

  4. Novel 3D modeling methods for virtual fabrication and EDA compatible design of MEMS via parametric libraries

    International Nuclear Information System (INIS)

    Schröpfer, Gerold; Lorenz, Gunar; Rouvillois, Stéphane; Breit, Stephen

    2010-01-01

    This paper provides a brief summary of the state-of-the-art of MEMS-specific modeling techniques and describes the validation of new models for a parametric component library. Two recently developed 3D modeling tools are described in more detail. The first one captures a methodology for designing MEMS devices and simulating them together with integrated electronics within a standard electronic design automation (EDA) environment. The MEMS designer can construct the MEMS model directly in a 3D view. The resulting 3D model differs from a typical feature-based 3D CAD modeling tool in that there is an underlying behavioral model and parametric layout associated with each MEMS component. The model of the complete MEMS device that is shared with the standard EDA environment can be fully parameterized with respect to manufacturing- and design-dependent variables. Another recent innovation is a process modeling tool that allows accurate and highly realistic visualization of the step-by-step creation of 3D micro-fabricated devices. The novelty of the tool lies in its use of voxels (3D pixels) rather than conventional 3D CAD techniques to represent the 3D geometry. Case studies for experimental devices are presented showing how the examination of these virtual prototypes can reveal design errors before mask tape out, support process development before actual fabrication and also enable failure analysis after manufacturing.

  5. MEMS Bragg grating force sensor

    DEFF Research Database (Denmark)

    Reck, Kasper; Thomsen, Erik Vilain; Hansen, Ole

    2011-01-01

    We present modeling, design, fabrication and characterization of a new type of all-optical frequency modulated MEMS force sensor based on a mechanically amplified double clamped waveguide beam structure with integrated Bragg grating. The sensor is ideally suited for force measurements in harsh...... environments and for remote and distributed sensing and has a measured sensitivity of -14 nm/N, which is several times higher than what is obtained in conventional fiber Bragg grating force sensors. © 2011 Optical Society of America....

  6. Investigation of a delayed feedback controller of MEMS resonators

    KAUST Repository

    Masri, Karim M.; Younis, Mohammad I.; Shao, Shuai

    2013-01-01

    Controlling mechanical systems is an important branch of mechanical engineering. Several techniques have been used to control Microelectromechanical systems (MEMS) resonators. In this paper, we study the effect of a delayed feedback controller

  7. A MEMS coupled resonator for frequency filtering in air

    KAUST Repository

    Ilyas, Saad; Jaber, Nizar; Younis, Mohammad I.

    2018-01-01

    We present design, fabrication, and characterization of a mechanically coupled MEMS H resonator capable of performing simultaneous mechanical amplification and filtering in air. The device comprises of two doubly clamped polyimide microbeams joined

  8. MEMS-based thick film PZT vibrational energy harvester

    DEFF Research Database (Denmark)

    Lei, Anders; Xu, Ruichao; Thyssen, Anders

    2011-01-01

    We present a MEMS-based unimorph silicon/PZT thick film vibrational energy harvester with an integrated proof mass. We have developed a process that allows fabrication of high performance silicon based energy harvesters with a yield higher than 90%. The process comprises a KOH etch using a mechan......We present a MEMS-based unimorph silicon/PZT thick film vibrational energy harvester with an integrated proof mass. We have developed a process that allows fabrication of high performance silicon based energy harvesters with a yield higher than 90%. The process comprises a KOH etch using...... a mechanical front side protection of an SOI wafer with screen printed PZT thick film. The fabricated harvester device produces 14.0 μW with an optimal resistive load of 100 kΩ from 1g (g=9.81 m s-2) input acceleration at its resonant frequency of 235 Hz....

  9. Design of a MEMS-Based Oscillator Using 180nm CMOS Technology.

    Science.gov (United States)

    Roy, Sukanta; Ramiah, Harikrishnan; Reza, Ahmed Wasif; Lim, Chee Cheow; Ferrer, Eloi Marigo

    2016-01-01

    Micro-electro mechanical system (MEMS) based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator's high motion losses due to the possibility of their 'system-on-chip' integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C) beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM). A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design's applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications.

  10. Design of a MEMS-Based Oscillator Using 180nm CMOS Technology.

    Directory of Open Access Journals (Sweden)

    Sukanta Roy

    Full Text Available Micro-electro mechanical system (MEMS based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator's high motion losses due to the possibility of their 'system-on-chip' integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM. A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design's applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications.

  11. A MEMS-based super fast dew point hygrometer—construction and medical applications

    International Nuclear Information System (INIS)

    Jachowicz, Ryszard S; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz

    2009-01-01

    The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between −10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too

  12. A MEMS-based super fast dew point hygrometer—construction and medical applications

    Science.gov (United States)

    Jachowicz, Ryszard S.; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz

    2009-12-01

    The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between -10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too.

  13. Adaptive Global Sliding Mode Control for MEMS Gyroscope Using RBF Neural Network

    Directory of Open Access Journals (Sweden)

    Yundi Chu

    2015-01-01

    Full Text Available An adaptive global sliding mode control (AGSMC using RBF neural network (RBFNN is proposed for the system identification and tracking control of micro-electro-mechanical system (MEMS gyroscope. Firstly, a new kind of adaptive identification method based on the global sliding mode controller is designed to update and estimate angular velocity and other system parameters of MEMS gyroscope online. Moreover, the output of adaptive neural network control is used to adjust the switch gain of sliding mode control dynamically to approach the upper bound of unknown disturbances. In this way, the switch item of sliding mode control can be converted to the output of continuous neural network which can weaken the chattering in the sliding mode control in contrast to the conventional fixed gain sliding mode control. Simulation results show that the designed control system can get satisfactory tracking performance and effective estimation of unknown parameters of MEMS gyroscope.

  14. Post-CMOS selective electroplating technique for the improvement of CMOS-MEMS accelerometers

    International Nuclear Information System (INIS)

    Liu, Yu-Chia; Tsai, Ming-Han; Fang, Weileun; Tang, Tsung-Lin

    2011-01-01

    This study presents a simple approach to improve the performance of the CMOS-MEMS capacitive accelerometer by means of the post-CMOS metal electroplating process. The metal layer can be selectively electroplated on the MEMS structures at low temperature and the thickness of the metal layer can be easily adjusted by this process. Thus the performance of the capacitive accelerometer (i.e. sensitivity, noise floor and the minimum detectable signal) can be improved. In application, the proposed accelerometers have been implemented using (1) the standard CMOS 0.35 µm 2P4M process by CMOS foundry, (2) Ti/Au seed layers deposition/patterning by MEMS foundry and (3) in-house post-CMOS electroplating and releasing processes. Measurements indicate that the sensitivity is improved 2.85-fold, noise is decreased near 1.7-fold and the minimum detectable signal is improved from 1 to 0.2 G after nickel electroplating. Moreover, unwanted structure deformation due to the temperature variation is significantly suppressed by electroplated nickel.

  15. BioMEMS and Lab-on-a-Chip Course Education at West Virginia University

    Directory of Open Access Journals (Sweden)

    Yuxin Liu

    2011-01-01

    Full Text Available With the rapid growth of Biological/Biomedical MicroElectroMechanical Systems (BioMEMS and microfluidic-based lab-on-a-chip (LOC technology to biological and biomedical research and applications, demands for educated and trained researchers and technicians in these fields are rapidly expanding. Universities are expected to develop educational plans to address these specialized needs in BioMEMS, microfluidic and LOC science and technology. A course entitled BioMEMS and Lab-on-a-Chip was taught recently at the senior undergraduate and graduate levels in the Department of Computer Science and Electrical Engineering at West Virginia University (WVU. The course focused on the basic principles and applications of BioMEMS and LOC technology to the areas of biomedicine, biology, and biotechnology. The course was well received and the enrolled students had diverse backgrounds in electrical engineering, material science, biology, mechanical engineering, and chemistry. Student feedback and a review of the course evaluations indicated that the course was effective in achieving its objectives. Student presentations at the end of the course were a highlight and a valuable experience for all involved. The course proved successful and will continue to be offered regularly. This paper provides an overview of the course as well as some development and future improvements.

  16. Nano-scale measurement of sub-micrometer MEMS in-plane dynamics using synchronized illumination

    International Nuclear Information System (INIS)

    Warnat, S; Forbrigger, C; Kujath, M; Hubbard, T

    2015-01-01

    A method for measuring the sub-micrometer in-plane dynamics of MEMS devices with nano-scale precision using a CCD camera and synchronized pulsating illumination is presented. Typical MEMS actuators have fast responses (generally in the 1–200 kHz range), much faster than typical cameras which record a time averaged motion. Under constant illumination the average displacement is steady state and independent of dynamic amplitude or phase. Methods such as strobe illumination use short light pulses to freeze the motion. This paper develops the use of longer pulses of illumination that do not freeze the image, but make the average displacement depend on dynamic amplitude and phase; thus allowing both properties to be extracted. The expected signal is derived as a function of light pulse width and delay, and short versus longer pulses are compared. Measurements using a conventional microscope with replacement of the lamp with LEDs confirmed the derived equations. The system was used to measure sub-micrometer motion of MEMS actuators with ∼5 nm precision. The time constant of a thermal actuator was measured and found to be 48 µs. A resonant peak of a MEMS device was measured at 123.30 kHz with an amplitude of 238 nm. (paper)

  17. Microfibrous metallic cloth for acoustic isolation of a MEMS gyroscope

    Science.gov (United States)

    Dean, Robert; Burch, Nesha; Black, Meagan; Beal, Aubrey; Flowers, George

    2011-04-01

    The response of a MEMS device that is exposed to a harsh environment may range from an increased noise floor to a completely erroneous output to temporary or even permanent device failure. One such harsh environment is high power acoustic energy possessing high frequency components. This type of environment sometimes occurs in small aerospace vehicles. In this type of operating environment, high frequency acoustic energy can be transferred to a MEMS gyroscope die through the device packaging. If the acoustic noise possesses a sufficiently strong component at the resonant frequency of the gyroscope, it will overexcite the motion of the proof mass, resulting in the deleterious effect of corrupted angular rate measurement. Therefore if the device or system packaging can be improved to sufficiently isolate the gyroscope die from environmental acoustic energy, the sensor may find new applications in this type of harsh environment. This research effort explored the use of microfibrous metallic cloth for isolating the gyroscope die from environmental acoustic excitation. Microfibrous cloth is a composite of fused, intermingled metal fibers and has a variety of typical uses involving chemical processing applications and filtering. Specifically, this research consisted of experimental evaluations of multiple layers of packed microfibrous cloth composed of sintered nickel material. The packed cloth was used to provide acoustic isolation for a test MEMS gyroscope, the Analog Devices ADXRS300. The results of this investigation revealed that the intermingling of the various fibers of the metallic cloth provided a significant contact area between the fiber strands and voids, which enhanced the acoustic damping of the material. As a result, the nickel cloth was discovered to be an effective acoustic isolation material for this particular MEMS gyroscope.

  18. Control of Bouncing in MEMS Switches Using Double Electrodes

    KAUST Repository

    Abdul Rahim, Farhan; Younis, Mohammad I.

    2016-01-01

    This paper presents a novel way of controlling the bouncing phenomenon commonly present in the Radio Frequency Microelectromechanical Systems (RF MEMS) switches using a double-electrode configuration. The paper discusses modeling bouncing using both

  19. Alzheimer's disease and implicit memory Doença de Alzheimer e memória implícita

    Directory of Open Access Journals (Sweden)

    Sergio Machado

    2009-06-01

    Full Text Available Specific neuropsychiatric disorders, such as Alzheimer's disease (AD affect some forms of memory while leaving others relatively intact. In this review, we investigate particularities of the relationship between explicit and implicit memories in AD. It was found that implicit memory is preserved in AD, irrespective of the task used; in other words, there was not interference from explicit memory. In addition, it was verified that is possible through implicit memory compensatory strategies such as, activities of daily living (ADL to compensate for the explicit memory deficits. In this sense, cognitive rehabilitation (CR demonstrates reasonable results in the process of compensation of explicit memory deficits. Concluding, the decline in explicit memory suggests that both systems are functionally independent even if the other is compromised. We expect that when explicit memory system is not involved in competition with the implicit system, the final effect of learning is better, because all of the implicit memory capacity is engaged in learning and not in competition with the explicit system.Distúrbios neuropsiquiátricos específicos, tais como a doença de Alzheimer (DA, podem afetar algumas formas de memória enquanto deixam outros relativamente intactos. Nesta revisão, nós investigamos particularidades da relação entre as memórias explicita e implícita na DA. Foi verificado que a memória é preservada na DA, independente da tarefa usada; ou seja, não ocorre interferência da memória explícita. Além disso, foi verificado que é possível através de estratégias compensatórias de memória implícita, tais como, atividades da vida diária (AVD compensar os déficits da memória explícita. Neste sentido, a reabilitação cognitiva (RC demonstra resultados razoáveis no processo de compensação dos déficits da memória explicita. Concluindo, a queda na memória explícita sugere que ambos os sistemas são funcionalmente

  20. BioMEMS –Advancing the Frontiers of Medicine

    Directory of Open Access Journals (Sweden)

    Dentcho V. Ivanov

    2008-09-01

    Full Text Available Biological and medical application of micro-electro-mechanical-systems (MEMS is currently seen as an area of high potential impact. Integration of biology and microtechnology has resulted in the development of a number of platforms for improving biomedical and pharmaceutical technologies. This review provides a general overview of the applications and the opportunities presented by MEMS in medicine by classifying these platforms according to their applications in the medical field.

  1. Model-based design of MEMS resonant pressure sensors

    NARCIS (Netherlands)

    Suijlen, M.A.G.

    2011-01-01

    The massive integration of micromechanical structures on ICs to allow microsystems to sense and control the environment is expected to be one of the most important technological breakthroughs of the future. At present, cheap and small MEMS sensors are emerging in countless applications. Automotive

  2. Safety and feasibility of pulmonary artery pressure-guided heart failure therapy: rationale and design of the prospective CardioMEMS Monitoring Study for Heart Failure (MEMS-HF).

    Science.gov (United States)

    Angermann, Christiane E; Assmus, Birgit; Anker, Stefan D; Brachmann, Johannes; Ertl, Georg; Köhler, Friedrich; Rosenkranz, Stephan; Tschöpe, Carsten; Adamson, Philip B; Böhm, Michael

    2018-05-19

    Wireless monitoring of pulmonary artery (PA) pressures with the CardioMEMS HF™ system is indicated in patients with New York Heart Association (NYHA) class III heart failure (HF). Randomized and observational trials have shown a reduction in HF-related hospitalizations and improved quality of life in patients using this device in the United States. MEMS-HF is a prospective, non-randomized, open-label, multicenter study to characterize safety and feasibility of using remote PA pressure monitoring in a real-world setting in Germany, The Netherlands and Ireland. After informed consent, adult patients with NYHA class III HF and a recent HF-related hospitalization are evaluated for suitability for permanent implantation of a CardioMEMS™ sensor. Participation in MEMS-HF is open to qualifying subjects regardless of left ventricular ejection fraction (LVEF). Patients with reduced ejection fraction must be on stable guideline-directed pharmacotherapy as tolerated. The study will enroll 230 patients in approximately 35 centers. Expected duration is 36 months (24-month enrolment plus ≥ 12-month follow-up). Primary endpoints are freedom from device/system-related complications and freedom from pressure sensor failure at 12-month post-implant. Secondary endpoints include the annualized rate of HF-related hospitalization at 12 months versus the rate over the 12 months preceding implant, and health-related quality of life. Endpoints will be evaluated using data obtained after each subject's 12-month visit. The MEMS-HF study will provide robust evidence on the clinical safety and feasibility of implementing haemodynamic monitoring as a novel disease management tool in routine out-patient care in selected European healthcare systems. ClinicalTrials.gov; NCT02693691.

  3. Os fios da memória tecem a resistência

    Directory of Open Access Journals (Sweden)

    Andréa Monteiro da Costa

    2011-12-01

    Full Text Available O presente artigo aponta como a memória individual é a base para a resistência e a constituição de uma identidade social positiva. A análise tem como referência mulheres negras de uma comunidade quilombola, localizada no município de Parnamirim (RN. Essas mulheres criaram uma pequena empresa familiar com o objetivo de executar a sua tradicional atividade de lavagem de roupas. O texto articula tradições teóricas e metodológicas distintas para indicar o processo de constituição de sujeitos dessas mulheres. São mobilizadas, em especial, as categorias de espaço, tempo e memória.

  4. Design of a Bionic Cilia MEMS three-dimensional vibration sensor

    International Nuclear Information System (INIS)

    Li Zhen; Zhang Guojun; Xue Chenyang; Wu Shujuan

    2013-01-01

    A biomimetic three-dimensional piezoresistive vibration sensor based on MEMS technology is reported. The mechanical properties of the sensor are analyzed and the static and dynamic characteristics of the sensor are simulated by ANSYS Workbench 12.0. The structure was made by MEMS processes including lithography, ion implantation, PECVD, etching, etc. Finally, the sensor is tested by using a TV5220 sensor auto calibration system. The results show that the lowest sensitivity of the sensor is 394.7 μV/g and can reach up to 460.2 μV/g, and the dimension coupling is less than 0.6152%, and the working frequency range is 0–1000 Hz. (semiconductor devices)

  5. Fractal Structures For Fixed Mems Capacitors

    KAUST Repository

    Elshurafa, Amro M.

    2014-08-28

    An embodiment of a fractal fixed capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure. The capacitor body has a first plate with a fractal shape separated by a horizontal distance from a second plate with a fractal shape. The first plate and the second plate are within the same plane. Such a fractal fixed capacitor further comprises a substrate above which the capacitor body is positioned.

  6. Characterization of Piezoelectric Energy Harvesting MEMS

    Science.gov (United States)

    2015-12-01

    of previously fabricated MEMS piezoelectric energy harvesters and use the results to optimize an advanced finite element model to be used in...possibilities of using solar power and the piezoelectric effect to harvest energy [12]. The design goal was to develop an energy harvester with a resonant... The piezoelectric properties of AlN are also relatively constant over a wide range of temperatures [7]. AlN was further characterized

  7. Fractal Structures For Fixed Mems Capacitors

    KAUST Repository

    Elshurafa, Amro M.; Radwan, Ahmed Gomaa Ahmed; Emira, Ahmed A.; Salama, Khaled N.

    2014-01-01

    An embodiment of a fractal fixed capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure. The capacitor body has a first plate with a fractal shape separated by a horizontal distance from a second plate with a fractal shape. The first plate and the second plate are within the same plane. Such a fractal fixed capacitor further comprises a substrate above which the capacitor body is positioned.

  8. Mechanically latchable tiltable platform for forming micromirrors and micromirror arrays

    Science.gov (United States)

    Garcia, Ernest J [Albuquerque, NM; Polosky, Marc A [Tijeras, NM; Sleefe, Gerard E [Cedar Crest, NM

    2006-12-12

    A microelectromechanical (MEM) apparatus is disclosed which includes a platform that can be electrostatically tilted from being parallel to a substrate on which the platform to being tilted at an angle of 1 20 degrees with respect to the substrate. Once the platform has been tilted to a maximum angle of tilt, the platform can be locked in position using an electrostatically-operable latching mechanism which engages a tab protruding below the platform. The platform has a light-reflective upper surface which can be optionally coated to provide an enhanced reflectivity and form a micromirror. An array of such micromirrors can be formed on a common substrate for applications including optical switching (e.g. for fiber optic communications), optical information processing, image projection displays or non-volatile optical memories.

  9. Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

    Directory of Open Access Journals (Sweden)

    Simon J. Bleiker

    2016-10-01

    Full Text Available Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based on low-temperature adhesive wafer bonding, which ensures full complementary metal-oxide-semiconductor (CMOS compatibility. All necessary fabrication steps for the wafer bonding, such as cavity formation and deposition of the adhesive, are performed on the capping substrate. The polymer adhesive is deposited by spray-coating on the capping wafer containing the cavities. Thus, no lithographic patterning of the polymer adhesive is needed, and material waste is minimized. Furthermore, this process does not require any additional fabrication steps on the device wafer, which lowers the process complexity and fabrication costs. We demonstrate the proposed capping method by packaging two different MEMS devices. The two MEMS devices include a vibration sensor and an acceleration switch, which employ two different electrical interconnection schemes. The experimental results show wafer-level capping with excellent bond quality due to the re-flow behavior of the polymer adhesive. No impediment to the functionality of the MEMS devices was observed, which indicates that the encapsulation does not introduce significant tensile nor compressive stresses. Thus, we present a highly versatile, robust, and cost-efficient capping method for components such as MEMS and imaging sensors.

  10. Stroke saturation on a MEMS deformable mirror for woofer-tweeter adaptive optics.

    Science.gov (United States)

    Morzinski, Katie; Macintosh, Bruce; Gavel, Donald; Dillon, Daren

    2009-03-30

    High-contrast imaging of extrasolar planet candidates around a main-sequence star has recently been realized from the ground using current adaptive optics (AO) systems. Advancing such observations will be a task for the Gemini Planet Imager, an upcoming "extreme" AO instrument. High-order "tweeter" and low-order "woofer" deformable mirrors (DMs) will supply a >90%-Strehl correction, a specialized coronagraph will suppress the stellar flux, and any planets can then be imaged in the "dark hole" region. Residual wavefront error scatters light into the DM-controlled dark hole, making planets difficult to image above the noise. It is crucial in this regard that the high-density tweeter, a micro-electrical mechanical systems (MEMS) DM, have sufficient stroke to deform to the shapes required by atmospheric turbulence. Laboratory experiments were conducted to determine the rate and circumstance of saturation, i.e. stroke insufficiency. A 1024-actuator 1.5-microm-stroke MEMS device was empirically tested with software Kolmogorov-turbulence screens of r(0) =10-15 cm. The MEMS when solitary suffered saturation approximately 4% of the time. Simulating a woofer DM with approximately 5-10 actuators across a 5-m primary mitigated MEMS saturation occurrence to a fraction of a percent. While no adjacent actuators were saturated at opposing positions, mid-to-high-spatial-frequency stroke did saturate more frequently than expected, implying that correlations through the influence functions are important. Analytical models underpredict the stroke requirements, so empirical studies are important.

  11. EDITORIAL: The Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004)

    Science.gov (United States)

    Tanaka, Shuji; Toriyama, Toshiyuki

    2005-09-01

    This special issue of the Journal of Micromechanics and Microengineering features papers selected from the Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004). The workshop was held in Kyoto, Japan, on 28-30 November 2004, by The Ritsumeikan Research Institute of Micro System Technology in cooperation with The Global Emerging Technology Institute, The Institute of Electrical Engineers of Japan, The Sensors and Micromachines Society, The Micromachine Center and The Kyoto Nanotech Cluster. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of power MEMS was proposed in the late 1990s by Epstein's group at the Massachusetts Institute of Technology, where they continue to study MEMS-based gas turbine generators. Since then, the research and development of power MEMS have been promoted by the need for compact power sources with high energy and power density. Since its inception, power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. At the last workshop, various devices and systems, such as portable fuel cells and their peripherals, micro and small turbo machinery, energy harvesting microdevices, and microthrusters, were presented. Their power levels vary from ten nanowatts to hundreds of watts, spanning ten orders of magnitude. The first PowerMEMS workshop was held in 2000 in Sendai, Japan, and consisted of only seven invited presentations. The workshop has grown since then, and in 2004 there were 5 invited, 20 oral and 29 poster presentations. From the 54 papers in the proceedings, 12 papers have been selected for this special issue. I would like to express my appreciation to the members of the Organizing Committee and Technical Program Committee. This special issue was

  12. Design, Analysis, and Verification of Ka-Band Pattern Reconfigurable Patch Antenna Using RF MEMS Switches

    Directory of Open Access Journals (Sweden)

    Zhongliang Deng

    2016-08-01

    Full Text Available This paper proposes a radiating pattern reconfigurable antenna by employing RF Micro-electromechanical Systems (RF MEMS switches. The antenna has a low profile and small size of 4 mm × 5 mm × 0.4 mm, and mainly consists of one main patch, two assistant patches, and two RF MEMS switches. By changing the RF MEMS switches operating modes, the proposed antenna can switch among three radiating patterns (with main lobe directions of approximately −17.0°, 0° and +17.0° at 35 GHz. The far-field vector addition model is applied to analyse the pattern. Comparing the measured results with analytical and simulated results, good agreements are obtained.

  13. MEMS Integrated Submount Alignment for Optoelectronics

    Science.gov (United States)

    Shakespeare, W. Jeffrey; Pearson, Raymond A.; Grenestedt, Joachim L.; Hutapea, Parsaoran; Gupta, Vikas

    2005-02-01

    One of the most expensive and time-consuming production processes for single-mode fiber-optic components is the alignment of the photonic chip or waveguide to the fiber. The alignment equipment is capital intensive and usually requires trained technicians to achieve desired results. Current technology requires active alignment since tolerances are only ~0.2 μ m or less for a typical laser diode. This is accomplished using piezoelectric actuated stages and active optical feedback. Joining technologies such as soldering, epoxy bonding, or laser welding may contribute significant postbond shift, and final coupling efficiencies are often less than 80%. This paper presents a method of adaptive optical alignment to freeze in place directly on an optical submount using a microelectromechanical system (MEMS) shape memory alloy (SMA) actuation technology. Postbond shift is eliminated since the phase change is the alignment actuation. This technology is not limited to optical alignment but can be applied to a variety of MEMS actuations, including nano-actuation and nano-alignment for biomedical applications. Experimental proof-of-concept results are discussed, and a simple analytical model is proposed to predict the stress strain behavior of the optical submount. Optical coupling efficiencies and alignment times are compared with traditional processes. The feasibility of this technique in high-volume production is discussed.

  14. Development of Ultra-Low Power Metal Oxide Sensors and Arrays for Embedded Applications

    Science.gov (United States)

    Lutz, Brent; Wind, Rikard; Kostelecky, Clayton; Routkevitch, Dmitri; Deininger, Debra

    2011-09-01

    Metal oxide semiconductor sensors are widely used as individual sensors and in arrays, and a variety of designs for low power microhotplates have been demonstrated.1 Synkera Technologies has developed an embeddable chemical microsensor platform, based on a unique ceramic MEMS technology, for practical implementation in cell phones and other mobile electronic devices. Key features of this microsensor platform are (1) small size, (2) ultra-low power consumption, (3) high chemical sensitivity, (4) accurate response to a wide-range of threats, and (5) low cost. The sensor platform is enabled by a combination of advances in ceramic micromachining, and precision deposition of sensing films inside the high aspect ratio pores of anodic aluminum oxide (AAO).

  15. As análises da memória militar sobre a ditadura: balanço e possibilidades

    Directory of Open Access Journals (Sweden)

    Cláudio Beserra de Vasconcelos

    2009-06-01

    Full Text Available Estudos baseados em fontes orais têm possibilitado boas reflexões sobre a ditadura implantada no Brasil em 1964. Entre elas, tem recebido especial atenção a memória dos militares partícipes do regime. De maneira inversa, a memória dos militares cassados tem recebido pouca atenção. Este artigo faz um balanço das principais análises da memória militar sobre a ditadura, tentando apresentar seus limites e levantar questões para o enriquecimento dos estudos sobre o tema.

  16. Bimetallic nanoparticles for surface modification and lubrication of MEMS switch contacts

    International Nuclear Information System (INIS)

    Patton, Steven T; Hu Jianjun; Slocik, Joseph M; Campbell, Angela; Naik, Rajesh R; Voevodin, Andrey A

    2008-01-01

    Reliability continues to be a critical issue in microelectromechanical systems (MEMS) switches. Failure mechanisms include high contact resistance (R), high adhesion, melting/shorting, and contact erosion. Little previous work has addressed the lubrication of MEMS switches. In this study, bimetallic nanoparticles (NPs) are synthesized using a biotemplated approach and deposited on Au MEMS switch contacts as a nanoparticle-based lubricant. Bimetallic nanoparticles are comprised of a metallic core (∼10 nm diameter gold nanoparticle) with smaller metallic nanoparticles (∼2-3 nm diameter Pd nanoparticles) populating the core surface. Adhesion and resistance (R) were measured during hot switching experiments at low (10 μA) and high (1 mA) current. The Au/Pd NP coated contacts led to reduced adhesion as compared to pure Au contacts with a compromise of slightly higher R. For switches held in the closed position at low current, R gradually decreased over tens of seconds due to increased van der Waals force and growth of the real area of contact with temporal effects being dominant over load effects. Contact behavior transitioned from 'Pd-like' to 'Au-like' during low current cycling experiments. Melting at high current resulted in rapid formation of large real contact area, low and stable R, and minimal effect of load on R. Durability at high current was excellent with no failure through 10 6 hot switching cycles. Improvement at high current is due to controlled nanoscale surface roughness that spreads current through multiple nanocontacts, which restricts the size of melting regions and causes termination of nanowire growth (prevents shorting) during contact opening. Based on these results, bimetallic NPs show excellent potential as surface modifiers/lubricants for MEMS switch contacts

  17. A dynamic system matching technique for improving the accuracy of MEMS gyroscopes

    Energy Technology Data Exchange (ETDEWEB)

    Stubberud, Peter A., E-mail: stubber@ee.unlv.edu [Department of Electrical and Computer Engineering, University of Nevada, Las Vegas, Las Vegas, NV 89154 (United States); Stubberud, Stephen C., E-mail: scstubberud@ieee.org [Oakridge Technology, San Diego, CA 92121 (United States); Stubberud, Allen R., E-mail: stubberud@att.net [Department of Electrical Engineering and Computer Science, University of California, Irvine, Irvine, CA 92697 (United States)

    2014-12-10

    A classical MEMS gyro transforms angular rates into electrical values through Euler's equations of angular rotation. Production models of a MEMS gyroscope will have manufacturing errors in the coefficients of the differential equations. The output signal of a production gyroscope will be corrupted by noise, with a major component of the noise due to the manufacturing errors. As is the case of the components in an analog electronic circuit, one way of controlling the variability of a subsystem is to impose extremely tight control on the manufacturing process so that the coefficient values are within some specified bounds. This can be expensive and may even be impossible as is the case in certain applications of micro-electromechanical (MEMS) sensors. In a recent paper [2], the authors introduced a method for combining the measurements from several nominally equal MEMS gyroscopes using a technique based on a concept from electronic circuit design called dynamic element matching [1]. Because the method in this paper deals with systems rather than elements, it is called a dynamic system matching technique (DSMT). The DSMT generates a single output by randomly switching the outputs of several, nominally identical, MEMS gyros in and out of the switch output. This has the effect of 'spreading the spectrum' of the noise caused by the coefficient errors generated in the manufacture of the individual gyros. A filter can then be used to eliminate that part of the spread spectrum that is outside the pass band of the gyro. A heuristic analysis in that paper argues that the DSMT can be used to control the effects of the random coefficient variations. In a follow-on paper [4], a simulation of a DSMT indicated that the heuristics were consistent. In this paper, analytic expressions of the DSMT noise are developed which confirm that the earlier conclusions are valid. These expressions include the various DSMT design parameters and, therefore, can be used as design

  18. A dynamic system matching technique for improving the accuracy of MEMS gyroscopes

    International Nuclear Information System (INIS)

    Stubberud, Peter A.; Stubberud, Stephen C.; Stubberud, Allen R.

    2014-01-01

    A classical MEMS gyro transforms angular rates into electrical values through Euler's equations of angular rotation. Production models of a MEMS gyroscope will have manufacturing errors in the coefficients of the differential equations. The output signal of a production gyroscope will be corrupted by noise, with a major component of the noise due to the manufacturing errors. As is the case of the components in an analog electronic circuit, one way of controlling the variability of a subsystem is to impose extremely tight control on the manufacturing process so that the coefficient values are within some specified bounds. This can be expensive and may even be impossible as is the case in certain applications of micro-electromechanical (MEMS) sensors. In a recent paper [2], the authors introduced a method for combining the measurements from several nominally equal MEMS gyroscopes using a technique based on a concept from electronic circuit design called dynamic element matching [1]. Because the method in this paper deals with systems rather than elements, it is called a dynamic system matching technique (DSMT). The DSMT generates a single output by randomly switching the outputs of several, nominally identical, MEMS gyros in and out of the switch output. This has the effect of 'spreading the spectrum' of the noise caused by the coefficient errors generated in the manufacture of the individual gyros. A filter can then be used to eliminate that part of the spread spectrum that is outside the pass band of the gyro. A heuristic analysis in that paper argues that the DSMT can be used to control the effects of the random coefficient variations. In a follow-on paper [4], a simulation of a DSMT indicated that the heuristics were consistent. In this paper, analytic expressions of the DSMT noise are developed which confirm that the earlier conclusions are valid. These expressions include the various DSMT design parameters and, therefore, can be used as design

  19. A dynamic system matching technique for improving the accuracy of MEMS gyroscopes

    Science.gov (United States)

    Stubberud, Peter A.; Stubberud, Stephen C.; Stubberud, Allen R.

    2014-12-01

    A classical MEMS gyro transforms angular rates into electrical values through Euler's equations of angular rotation. Production models of a MEMS gyroscope will have manufacturing errors in the coefficients of the differential equations. The output signal of a production gyroscope will be corrupted by noise, with a major component of the noise due to the manufacturing errors. As is the case of the components in an analog electronic circuit, one way of controlling the variability of a subsystem is to impose extremely tight control on the manufacturing process so that the coefficient values are within some specified bounds. This can be expensive and may even be impossible as is the case in certain applications of micro-electromechanical (MEMS) sensors. In a recent paper [2], the authors introduced a method for combining the measurements from several nominally equal MEMS gyroscopes using a technique based on a concept from electronic circuit design called dynamic element matching [1]. Because the method in this paper deals with systems rather than elements, it is called a dynamic system matching technique (DSMT). The DSMT generates a single output by randomly switching the outputs of several, nominally identical, MEMS gyros in and out of the switch output. This has the effect of 'spreading the spectrum' of the noise caused by the coefficient errors generated in the manufacture of the individual gyros. A filter can then be used to eliminate that part of the spread spectrum that is outside the pass band of the gyro. A heuristic analysis in that paper argues that the DSMT can be used to control the effects of the random coefficient variations. In a follow-on paper [4], a simulation of a DSMT indicated that the heuristics were consistent. In this paper, analytic expressions of the DSMT noise are developed which confirm that the earlier conclusions are valid. These expressions include the various DSMT design parameters and, therefore, can be used as design tools for DSMT

  20. MEMS-Based Power Generation Techniques for Implantable Biosensing Applications

    Directory of Open Access Journals (Sweden)

    Jonathan Lueke

    2011-01-01

    Full Text Available Implantable biosensing is attractive for both medical monitoring and diagnostic applications. It is possible to monitor phenomena such as physical loads on joints or implants, vital signs, or osseointegration in vivo and in real time. Microelectromechanical (MEMS-based generation techniques can allow for the autonomous operation of implantable biosensors by generating electrical power to replace or supplement existing battery-based power systems. By supplementing existing battery-based power systems for implantable biosensors, the operational lifetime of the sensor is increased. In addition, the potential for a greater amount of available power allows additional components to be added to the biosensing module, such as computational and wireless and components, improving functionality and performance of the biosensor. Photovoltaic, thermovoltaic, micro fuel cell, electrostatic, electromagnetic, and piezoelectric based generation schemes are evaluated in this paper for applicability for implantable biosensing. MEMS-based generation techniques that harvest ambient energy, such as vibration, are much better suited for implantable biosensing applications than fuel-based approaches, producing up to milliwatts of electrical power. High power density MEMS-based approaches, such as piezoelectric and electromagnetic schemes, allow for supplemental and replacement power schemes for biosensing applications to improve device capabilities and performance. In addition, this may allow for the biosensor to be further miniaturized, reducing the need for relatively large batteries with respect to device size. This would cause the implanted biosensor to be less invasive, increasing the quality of care received by the patient.

  1. MEMS-based power generation techniques for implantable biosensing applications.

    Science.gov (United States)

    Lueke, Jonathan; Moussa, Walied A

    2011-01-01

    Implantable biosensing is attractive for both medical monitoring and diagnostic applications. It is possible to monitor phenomena such as physical loads on joints or implants, vital signs, or osseointegration in vivo and in real time. Microelectromechanical (MEMS)-based generation techniques can allow for the autonomous operation of implantable biosensors by generating electrical power to replace or supplement existing battery-based power systems. By supplementing existing battery-based power systems for implantable biosensors, the operational lifetime of the sensor is increased. In addition, the potential for a greater amount of available power allows additional components to be added to the biosensing module, such as computational and wireless and components, improving functionality and performance of the biosensor. Photovoltaic, thermovoltaic, micro fuel cell, electrostatic, electromagnetic, and piezoelectric based generation schemes are evaluated in this paper for applicability for implantable biosensing. MEMS-based generation techniques that harvest ambient energy, such as vibration, are much better suited for implantable biosensing applications than fuel-based approaches, producing up to milliwatts of electrical power. High power density MEMS-based approaches, such as piezoelectric and electromagnetic schemes, allow for supplemental and replacement power schemes for biosensing applications to improve device capabilities and performance. In addition, this may allow for the biosensor to be further miniaturized, reducing the need for relatively large batteries with respect to device size. This would cause the implanted biosensor to be less invasive, increasing the quality of care received by the patient.

  2. Memória e esquecimento: narrativa sobre imperador romano e senado

    Directory of Open Access Journals (Sweden)

    Luciane Munhoz de Omena

    2012-06-01

    Full Text Available O presente artigo teve por objetivo fazer algumas considerações críticas sobre a relação entre a escrita do presente e a escrita do passado, tendo como ponto de partida dois eixos conceituais: memória e esquecimento em Paul Ricoeur. Compreendemos a memória como um suporte da lembrança, um suporte do passado, que, em outras palavras, designa a construção de imagens de um passado sob a insígnia de uma "memória manipulada", que são narrativas de esquecimento. A partir deste suporte analítico, traçaremos algumas reflexões sobre a divisão de poderes entre o imperador e o senado, a partir do século I d. C., para analisar as variedades discursivas nos testemunhos de Sêneca e de Tácito e, nessa mesma linha, compreender a construção do discurso historiográfico contemporâneo e suas projeções do presente nos traços e nos gestos do passado, em especial, na narrativa de Tácito.

  3. Different grades MEMS accelerometers error characteristics

    Science.gov (United States)

    Pachwicewicz, M.; Weremczuk, J.

    2017-08-01

    The paper presents calibration effects of two different MEMS accelerometers of different price and quality grades and discusses different accelerometers errors types. The calibration for error determining is provided by reference centrifugal measurements. The design and measurement errors of the centrifuge are discussed as well. It is shown that error characteristics of the sensors are very different and it is not possible to use simple calibration methods presented in the literature in both cases.

  4. Large-area multiplexed sensing using MEMS and fiber optics

    Science.gov (United States)

    Miller, Michael B.; Clark, Richard L., Jr.; Bell, Clifton R.; Russler, Patrick M.

    2000-06-01

    Micro-electro-mechanical (MEMS) technology offers the ability to implement local and independent sensing and actuation functions through the coordinated response of discrete micro-electro-mechanical 'basis function' elements. The small size of micromechanical components coupled with the ability to reduce costs using volume manufacturing techniques opens up significant potential not only in military applications such as flight and engine monitoring and control, but in autonomous vehicle control, smart munitions, airborne reconnaissance, LADAR, missile guidance, and even in intelligent transportation systems and automotive guidance applications. In this program, Luna Innovations is developing a flexible, programmable interface which can be integrated direction with different types of MEMS sensors, and then used to multiplex many sensors ona single optical fiber to provide a unique combination of functions that will allow larger quantities of sensory input with better resolution than ever before possible.

  5. Optimization of Contact Force and Pull-in Voltage for Series based MEMS Switch

    Directory of Open Access Journals (Sweden)

    Abhijeet KSHIRSAGAR

    2010-04-01

    Full Text Available Cantilever based metal-to-metal contact type MEMS series switch has many applications namely in RF MEMS, Power MEMS etc. A typical MEMS switch consists of a cantilever as actuating element to make the contact between the two metal terminals of the switch. The cantilever is pulled down by applying a pull-in voltage to the control electrode that is located below the middle portion of the cantilever while only the tip portion of the cantilever makes contact between the two terminals. Detailed analysis of bending of the cantilever for different pull-in voltages reveals some interesting facts. At low pull-in voltage the cantilever tip barely touches the two terminals, thus resulting in very less contact area. To increase contact area a very high pull-in voltage is applied, but it lifts the tip from the free end due to concave curving of the cantilever in the middle region of the cantilever where the electrode is located. Again it results in less contact area. Furthermore, the high pull-in voltage produces large stress at the base of the cantilever close to the anchor. Therefore, an optimum, pull-in voltage must exist at which the concave curving is eliminated and contact area is maximum. In this paper authors report the finding of optimum contact force and pull-in voltage.

  6. Ka-Band, MEMS Switched Line Phase Shifters Implemented in Finite Ground Coplanar Waveguide

    Science.gov (United States)

    Scardelletti, Maximilian C.; Ponchak, George E.; Varaljay, Nicholas C.

    2005-01-01

    Ka-band MEMS switched line phase shifters implemented in finite ground coplanar waveguide are described in this paper. The phase shifters are constructed of single-pole double-throw (SPDT) switches with additional reference and phase offset transmission line lengths. The one- and two-bit phase shifters are fabricated on high resistivity (HR) silicon with a dielectric constant, Epsilon(sub T) = 11.7 and a substrate thickness, t = 500microns. The switching architectures integrated within the phase shifters consist of MEMS switches that are doubly anchored cantilever beam capacitive switches with additional high inductive sections (MEMS LC device). The SPDT switch is composed of a T-junction with a MEMS LC device at each output port. The one-bit phase shifter described in this paper has an insertion loss (IL) and return loss (RL) of 0.9 dB and 30 dB while the two-bit described has an IL and RL of 1.8 dB and 30 dB respectively. The one-bit phase shifter's designed offset phase is 22.5deg and actual measured phase shift is 21.8deg. The two-bit phase shifter's designed offset phase is 22.5deg, 45deg, and 67.5deg and the actual measured phase shifts are 21.4deg, 44.2deg, and 65.8deg, respectively.

  7. A versatile multi-user polyimide surface micromachinning process for MEMS applications

    KAUST Repository

    Carreno, Armando Arpys Arevalo

    2015-04-01

    This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the \\'Polyimide MEMS Multi-User Process\\' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. © 2015 IEEE.

  8. Size-dependent pull-in instability of electrostatically actuated microbeam-based MEMS

    International Nuclear Information System (INIS)

    Wang, Binglei; Zhou, Shenjie; Zhao, Junfeng; Chen, Xi

    2011-01-01

    We present a size-dependent model for electrostatically actuated microbeam-based MEMS using strain gradient elasticity theory. The normalized pull-in voltage is shown to increase nonlinearly with the decrease of the beam height, and the size effect becomes prominent if the beam thickness is on the order of microns or smaller (i.e. when the beam dimension is comparable to the material length scale parameter). Very good agreement is found between the present model and available experimental data. The study may be helpful to characterize the mechanical properties of small size MEMS, or guide the design of microbeam-based devices for a wide range of potential applications. (technical note)

  9. Development of scanning holographic display using MEMS SLM

    Science.gov (United States)

    Takaki, Yasuhiro

    2016-10-01

    Holography is an ideal three-dimensional (3D) display technique, because it produces 3D images that naturally satisfy human 3D perception including physiological and psychological factors. However, its electronic implementation is quite challenging because ultra-high resolution is required for display devices to provide sufficient screen size and viewing zone. We have developed holographic display techniques to enlarge the screen size and the viewing zone by use of microelectromechanical systems spatial light modulators (MEMS-SLMs). Because MEMS-SLMs can generate hologram patterns at a high frame rate, the time-multiplexing technique is utilized to virtually increase the resolution. Three kinds of scanning systems have been combined with MEMS-SLMs; the screen scanning system, the viewing-zone scanning system, and the 360-degree scanning system. The screen scanning system reduces the hologram size to enlarge the viewing zone and the reduced hologram patterns are scanned on the screen to increase the screen size: the color display system with a screen size of 6.2 in. and a viewing zone angle of 11° was demonstrated. The viewing-zone scanning system increases the screen size and the reduced viewing zone is scanned to enlarge the viewing zone: a screen size of 2.0 in. and a viewing zone angle of 40° were achieved. The two-channel system increased the screen size to 7.4 in. The 360-degree scanning increases the screen size and the reduced viewing zone is scanned circularly: the display system having a flat screen with a diameter of 100 mm was demonstrated, which generates 3D images viewed from any direction around the flat screen.

  10. MEMS fundamental technology and applications

    CERN Document Server

    Choudhary, Vikas

    2013-01-01

    "The book editors have managed to assemble a group of extraordinary authors to provide their expertise to this book. While giving an excellent overview of the history and the state of the art of MEMS technology, this book also focuses on current trends and topics such as gyroscopes that currently experience significant and increasing popularity in research and in industry. It is well written and the material is presented in a well-structured way making it easily accessible to any reader with a technical background."-Boris Stoeber, The University of British Columbia, Vancouver, Canada.

  11. Antimonumentos: trabalho de memória e de resistência

    Directory of Open Access Journals (Sweden)

    Márcio Seligmann-Silva

    2016-04-01

    Full Text Available Resumo Este ensaio apresenta uma reflexão sobre o fenômeno dos "antimonumentos" que surgiram no final do século XX como uma forma de lidar, pelo viés das artes, com a violência de Estado, como nos casos do nazismo e das ditaduras latino-americanas. Este texto faz inicialmente uma retomada da mnemotécnica, ou seja, da antiga "arte da memória", que tem como seu pai mítico Simônides de Ceos, para em seguida apresentar a cena moderna da "arte da memória" sob a rubrica dos antimonumentos. O trabalho apresenta e discute obras de, entre outros artistas, Jochen Gerz, Horst Hoheisel, Andreas Knitz, Marcelo Brodsky e Fulvia Molina.

  12. Aplikace pro nositelnou elektroniku se systémem Android Wear

    OpenAIRE

    Šmejkal, Petr

    2017-01-01

    Semestrální práce „Aplikace pro nositelnou elektroniku se systémem" Android Wear popisuje základní principy komunikačních sítí - M2M (machine to machine), H2H (human to human) a D2D (device to device). Práce se dále zabývá nositelnými zařízeními, zejména chytrými hodinkami, dostupnými operačními systémy pro chytré hodinky a systémem Android, Android Wear. V praktické části je popsaná funkcionalita, vzhled a struktura vyvinuté aplikace pro Android Wear. The semestral project "Application fo...

  13. Review on the Modeling of Electrostatic MEMS

    Directory of Open Access Journals (Sweden)

    Wan-Chun Chuang

    2010-06-01

    Full Text Available Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analysis complex and complicated. This article introduces the physical model of pull-in voltage, dynamic characteristic analysis, air damping effect, reliability, numerical modeling method, and application of electrostatic-driven MEMS devices.

  14. A Fast, Large-Stroke Electrothermal MEMS Mirror Based on Cu/W Bimorph

    Directory of Open Access Journals (Sweden)

    Xiaoyang Zhang

    2015-12-01

    Full Text Available This paper reports a large-range electrothermal bimorph microelectromechanical systems (MEMS mirror with fast thermal response. The actuator of the MEMS mirror is made of three segments of Cu/W bimorphs for lateral shift cancelation and two segments of multimorph beams for obtaining large vertical displacement from the angular motion of the bimorphs. The W layer is also used as the embedded heater. The silicon underneath the entire actuator is completely removed using a unique backside deep-reactive-ion-etching DRIE release process, leading to improved thermal response speed and front-side mirror surface protection. This MEMS mirror can perform both piston and tip-tilt motion. The mirror generates large pure vertical displacement up to 320 μm at only 3 V with a power consumption of 56 mW for each actuator. The maximum optical scan angle achieved is ±18° at 3 V. The measured thermal response time is 15.4 ms and the mechanical resonances of piston and tip-tilt modes are 550 Hz and 832 Hz, respectively.

  15. SMA Foils for MEMS: From Material Properties to the Engineering of Microdevices

    Science.gov (United States)

    Kohl, Manfred; Ossmer, Hinnerk; Gueltig, Marcel; Megnin, Christof

    2018-03-01

    In the early nineties, microelectromechanical systems (MEMS) technology has been still in its infancy. As silicon (Si) is not a transducer material, it was clear at the very beginning that mechanically active materials had to be introduced to MEMS in order to enable functional microdevices with actuation capability beyond electrostatics. At that time, shape memory alloys (SMAs) have been available in bulk form, mainly as SMA wires and SMA plates. On the macro scale, these materials show highest work densities compared to other actuation principles in the order of 107 J/m3, which stimulated research on the integration of SMA to MEMS. Subsequently, two approaches for producing planar materials have been initiated (1) magnetron sputtering of SMA thin films and (2) the integration of rolled SMA foils, which both turned out to be very successful creating a paradigm change in microactuation technology. The following review covers important milestones of the research and development of SMA foil-based microactuators including materials characterization, design engineering, technology, and demonstrator development as well as first commercial products.

  16. SMA Foils for MEMS: From Material Properties to the Engineering of Microdevices

    Science.gov (United States)

    Kohl, Manfred; Ossmer, Hinnerk; Gueltig, Marcel; Megnin, Christof

    2017-12-01

    In the early nineties, microelectromechanical systems (MEMS) technology has been still in its infancy. As silicon (Si) is not a transducer material, it was clear at the very beginning that mechanically active materials had to be introduced to MEMS in order to enable functional microdevices with actuation capability beyond electrostatics. At that time, shape memory alloys (SMAs) have been available in bulk form, mainly as SMA wires and SMA plates. On the macro scale, these materials show highest work densities compared to other actuation principles in the order of 107 J/m3, which stimulated research on the integration of SMA to MEMS. Subsequently, two approaches for producing planar materials have been initiated (1) magnetron sputtering of SMA thin films and (2) the integration of rolled SMA foils, which both turned out to be very successful creating a paradigm change in microactuation technology. The following review covers important milestones of the research and development of SMA foil-based microactuators including materials characterization, design engineering, technology, and demonstrator development as well as first commercial products.

  17. Design and fabrication of non silicon substrate based MEMS energy harvester for arbitrary surface applications

    Science.gov (United States)

    Balpande, Suresh S.; Pande, Rajesh S.

    2016-04-01

    Internet of Things (IoT) uses MEMS sensor nodes and actuators to sense and control objects through Internet. IOT deploys millions of chemical battery driven sensors at different locations which are not reliable many times because of frequent requirement of charging & battery replacement in case of underground laying, placement at harsh environmental conditions, huge count and difference between demand (24 % per year) and availability (energy density growing rate 8% per year). Energy harvester fabricated on silicon wafers have been widely used in manufacturing MEMS structures. These devices require complex fabrication processes, costly chemicals & clean room. In addition to this silicon wafer based devices are not suitable for curved surfaces like pipes, human bodies, organisms, or other arbitrary surface like clothes, structure surfaces which does not have flat and smooth surface always. Therefore, devices based on rigid silicon wafers are not suitable for these applications. Flexible structures are the key solution for this problems. Energy transduction mechanism generates power from free surrounding vibrations or impact. Sensor nodes application has been purposefully selected due to discrete power requirement at low duty cycle. Such nodes require an average power budget in the range of about 0.1 microwatt to 1 mW over a period of 3-5 seconds. Energy harvester is the best alternate source in contrast with battery for sensor node application. Novel design of Energy Harvester based on cheapest flexible non silicon substrate i.e. cellulose acetate substrate have been modeled, simulated and analyzed on COMSOL multiphysics and fabricated using sol-gel spin coating setup. Single cantilever based harvester generates 60-75 mV peak electric potential at 22Hz frequency and approximately 22 µW power at 1K-Ohm load. Cantilever array can be employed for generating higher voltage by replicating this structure. This work covers design, optimization, fabrication of harvester and

  18. Modeling of electro-statically actuated two-axis (tip-tilt) MEMS torsion micro-mirrors for laser beamsteering

    Science.gov (United States)

    Edwards, C. L.; Boone, B. G.; Levine, W. S.; Davis, C. C.

    2007-04-01

    The availability of recently developed MEMS micro-mirror technology provides an opportunity to replace macro-scale actuators for free-space laser beamsteering in lidar and communication systems. Such an approach is under investigation at the Johns Hopkins University Applied Physics Laboratory for use on space-based platforms. Precision modeling of mirror pointing and its dynamics are critical to optimal design and control of MEMS beamsteerers. Beginning with Hornbeck's torque approach, this paper presents a first-principle, analytically closed-form torque model for an electro-statically actuated two-axis (tip-tilt) MEMS structure. An Euler dynamic equation formulation describes the gimbaled motion as a coupled pair of damped harmonic oscillators with a common forcing function. Static physical parameters such as MEMS mirror dimensions, facet mass, and height are inputs to the model as well as dynamic harmonic oscillator parameters such as damping and restoring constants fitted from measurements. A Taylor series expansion of the torque function provides valuable insights into basic one dimensional as well as two dimensional MEMS behavior, including operational sensitivities near "pull-in." The model also permits the natural inclusion and analysis of pointing noise sources such as electrical drive noise, platform vibration, and molecular Brownian motion. MATLAB and SIMULINK simulations illustrate performance sensitivities, controllability, and physical limitations, important considerations in the design of optimal pointing systems.

  19. MEMS Lens Scanners for Free-Space Optical Interconnects

    Science.gov (United States)

    2011-12-15

    electrothermal linear micromotors ,” Journal of Micromechanics and Microengineering, vol. 14, no. 2, pp. 226– 234, 2004. [59] Hyuck Choo and R. S. Muller...84] Mei Lin Chan et al., “Low friction liquid bearing mems micromotor ,” in 2011 IEEE 24th International Conference on Micro Electro Mechanical

  20. 3D Printing and Bioprinting in MEMS Technology

    Directory of Open Access Journals (Sweden)

    Chee Kai Chua

    2017-07-01

    Full Text Available 3D printing and bioprinting have advanced significantly in printing resolution in recent years, which presents a great potential for fabricating small and complex features suitable for microelectromechanical systems (MEMS with new functionalities. This special issue aims to give a glimpse into the future of this research field.

  1. Compact multichannel MEMS based spectrometer for FBG sensing

    DEFF Research Database (Denmark)

    Ganziy, Denis; Rose, Bjarke; Bang, Ole

    2017-01-01

    We propose a novel type of compact multichannel MEMS based spectrometer, where we replace the linear detector with a Digital Micromirror Device (DMD). The DMD is typically cheaper and has better pixel sampling than an InGaAs detector used in the 1550 nm range, which leads to cost reduction...

  2. Benefits of Combined GPS/GLONASS with Low-Cost MEMS IMUs for Vehicular Urban Navigation

    Directory of Open Access Journals (Sweden)

    Giovanni Pugliano

    2012-04-01

    Full Text Available The integration of Global Navigation Satellite Systems (GNSS with Inertial Navigation Systems (INS has been very actively researched for many years due to the complementary nature of the two systems. In particular, during the last few years the integration with micro-electromechanical system (MEMS inertial measurement units (IMUs has been investigated. In fact, recent advances in MEMS technology have made possible the development of a new generation of low cost inertial sensors characterized by small size and light weight, which represents an attractive option for mass-market applications such as vehicular and pedestrian navigation. However, whereas there has been much interest in the integration of GPS with a MEMS-based INS, few research studies have been conducted on expanding this application to the revitalized GLONASS system. This paper looks at the benefits of adding GLONASS to existing GPS/INS(MEMS systems using loose and tight integration strategies. The relative benefits of various constraints are also assessed. Results show that when satellite visibility is poor (approximately 50% solution availability the benefits of GLONASS are only seen with tight integration algorithms. For more benign environments, a loosely coupled GPS/GLONASS/INS system offers performance comparable to that of a tightly coupled GPS/INS system, but with reduced complexity and development time.

  3. Monitoring System for Slope Stability under Rainfall by using MEMS Acceleration Sensor IC tags

    International Nuclear Information System (INIS)

    Murakami, S; Dairaku, A; Komine, H; Saito, O; Sakai, N; Isizawa, T; Maruyama, I

    2013-01-01

    Real-time warning system for slope failure under rainfall is available to disaster prevention and mitigation. Monitoring of multi-point and wireless measurements is effective because it is difficult to conclude the most dangerous part in a slope. The purpose of this study is to propose a method of monitoring system with multi-point and wireless measurements for a slope stability using MEMS acceleration sensor IC tags. MEMS acceleration sensor IC tag is an acceleration sensor microminiaturized by a technology of Micro Electro Mechanical Systems on board IC tag. Especially, low cost of the sensor will yield to the realization of the system. In order to investigate the applicability of the proposed system, a large-scale model test of artificial slope subjected to rainfall has been performed. MEMS acceleration sensor IC tags has been located on the slope and ground acceleration caused by forced vibration has been measured until the model slope collapses. The experimental results show that the MEMS acceleration sensor IC tag is comfortably available under rainfall, the characteristics of ground accelerations varies with changing the condition of the slope subjected to rainfall, and the proposed method can be applied to a real-time monitoring system for slope failure under rainfall.

  4. Benefits of combined GPS/GLONASS with low-cost MEMS IMUs for vehicular urban navigation.

    Science.gov (United States)

    Angrisano, Antonio; Petovello, Mark; Pugliano, Giovanni

    2012-01-01

    The integration of Global Navigation Satellite Systems (GNSS) with Inertial Navigation Systems (INS) has been very actively researched for many years due to the complementary nature of the two systems. In particular, during the last few years the integration with micro-electromechanical system (MEMS) inertial measurement units (IMUs) has been investigated. In fact, recent advances in MEMS technology have made possible the development of a new generation of low cost inertial sensors characterized by small size and light weight, which represents an attractive option for mass-market applications such as vehicular and pedestrian navigation. However, whereas there has been much interest in the integration of GPS with a MEMS-based INS, few research studies have been conducted on expanding this application to the revitalized GLONASS system. This paper looks at the benefits of adding GLONASS to existing GPS/INS(MEMS) systems using loose and tight integration strategies. The relative benefits of various constraints are also assessed. Results show that when satellite visibility is poor (approximately 50% solution availability) the benefits of GLONASS are only seen with tight integration algorithms. For more benign environments, a loosely coupled GPS/GLONASS/INS system offers performance comparable to that of a tightly coupled GPS/INS system, but with reduced complexity and development time.

  5. A Rigorous Temperature-Dependent Stochastic Modelling and Testing for MEMS-Based Inertial Sensor Errors

    Directory of Open Access Journals (Sweden)

    Spiros Pagiatakis

    2009-10-01

    Full Text Available In this paper, we examine the effect of changing the temperature points on MEMS-based inertial sensor random error. We collect static data under different temperature points using a MEMS-based inertial sensor mounted inside a thermal chamber. Rigorous stochastic models, namely Autoregressive-based Gauss-Markov (AR-based GM models are developed to describe the random error behaviour. The proposed AR-based GM model is initially applied to short stationary inertial data to develop the stochastic model parameters (correlation times. It is shown that the stochastic model parameters of a MEMS-based inertial unit, namely the ADIS16364, are temperature dependent. In addition, field kinematic test data collected at about 17 °C are used to test the performance of the stochastic models at different temperature points in the filtering stage using Unscented Kalman Filter (UKF. It is shown that the stochastic model developed at 20 °C provides a more accurate inertial navigation solution than the ones obtained from the stochastic models developed at −40 °C, −20 °C, 0 °C, +40 °C, and +60 °C. The temperature dependence of the stochastic model is significant and should be considered at all times to obtain optimal navigation solution for MEMS-based INS/GPS integration.

  6. A Rigorous Temperature-Dependent Stochastic Modelling and Testing for MEMS-Based Inertial Sensor Errors.

    Science.gov (United States)

    El-Diasty, Mohammed; Pagiatakis, Spiros

    2009-01-01

    In this paper, we examine the effect of changing the temperature points on MEMS-based inertial sensor random error. We collect static data under different temperature points using a MEMS-based inertial sensor mounted inside a thermal chamber. Rigorous stochastic models, namely Autoregressive-based Gauss-Markov (AR-based GM) models are developed to describe the random error behaviour. The proposed AR-based GM model is initially applied to short stationary inertial data to develop the stochastic model parameters (correlation times). It is shown that the stochastic model parameters of a MEMS-based inertial unit, namely the ADIS16364, are temperature dependent. In addition, field kinematic test data collected at about 17 °C are used to test the performance of the stochastic models at different temperature points in the filtering stage using Unscented Kalman Filter (UKF). It is shown that the stochastic model developed at 20 °C provides a more accurate inertial navigation solution than the ones obtained from the stochastic models developed at -40 °C, -20 °C, 0 °C, +40 °C, and +60 °C. The temperature dependence of the stochastic model is significant and should be considered at all times to obtain optimal navigation solution for MEMS-based INS/GPS integration.

  7. In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

    International Nuclear Information System (INIS)

    Wang Yuelin; Li Tie; Zhang Xiao; Zeng Hongjiang; Jin Qinhua

    2014-01-01

    Our investigation of in situ observations on electronic and mechanical properties of nano materials using a scanning electron microscope (SEM) and a transmission electron microscope (TEM) with the help of traditional micro-electro-mechanical system (MEMS) technology has been reviewed. Thanks to the stability, continuity and controllability of the loading force from the electrostatic actuator and the sensitivity of the sensor beam, a MEMS tensile testing chip for accurate tensile testing in the nano scale is obtained. Based on the MEMS chips, the scale effect of Young's modulus in silicon has been studied and confirmed directly in a tensile experiment using a transmission electron microscope. Employing the nanomanipulation technology and FIB technology, Cu and SiC nanowires have been integrated into the tensile testing device and their mechanical, electronic properties under different stress have been achieved, simultaneously. All these will aid in better understanding the nano effects and contribute to the designation and application in nano devices. (invited papers)

  8. The digital geometric phase technique applied to the deformation evaluation of MEMS devices

    International Nuclear Information System (INIS)

    Liu, Z W; Xie, H M; Gu, C Z; Meng, Y G

    2009-01-01

    Quantitative evaluation of the structure deformation of microfabricated electromechanical systems is of importance for the design and functional control of microsystems. In this investigation, a novel digital geometric phase technique was developed to meet the deformation evaluation requirement of microelectromechanical systems (MEMS). The technique is performed on the basis of regular artificial lattices, instead of a natural atom lattice. The regular artificial lattices with a pitch ranging from micrometer to nanometer will be directly fabricated on the measured surface of MEMS devices by using a focused ion beam (FIB). Phase information can be obtained from the Bragg filtered images after fast Fourier transform (FFT) and inverse fast Fourier transform (IFFT) of the scanning electronic microscope (SEM) images. Then the in-plane displacement field and the local strain field related to the phase information will be evaluated. The obtained results show that the technique can be well applied to deformation measurement with nanometer sensitivity and stiction force estimation of a MEMS device

  9. Research on ion implantation in MEMS device fabrication by theory, simulation and experiments

    Science.gov (United States)

    Bai, Minyu; Zhao, Yulong; Jiao, Binbin; Zhu, Lingjian; Zhang, Guodong; Wang, Lei

    2018-06-01

    Ion implantation is widely utilized in microelectromechanical systems (MEMS), applied for embedded lead, resistors, conductivity modifications and so forth. In order to achieve an expected device, the principle of ion implantation must be carefully examined. The elementary theory of ion implantation including implantation mechanism, projectile range and implantation-caused damage in the target were studied, which can be regarded as the guidance of ion implantation in MEMS device design and fabrication. Critical factors including implantations dose, energy and annealing conditions are examined by simulations and experiments. The implantation dose mainly determines the dopant concentration in the target substrate. The implantation energy is the key factor of the depth of the dopant elements. The annealing time mainly affects the repair degree of lattice damage and thus the activated elements’ ratio. These factors all together contribute to ions’ behavior in the substrates and characters of the devices. The results can be referred to in the MEMS design, especially piezoresistive devices.

  10. Two-layer radio frequency MEMS fractal capacitors in PolyMUMPS for S-band applications

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-23

    In this Letter, the authors fabricate for the first time MEMS fractal capacitors possessing two layers and compare their performance characteristics with the conventional parallel-plate capacitor and previously reported state-of-the-art single-layer MEMS fractal capacitors. Explicitly, a capacitor with a woven structure and another with an interleaved configuration were fabricated in the standard PolyMUMPS surface micromachining process and tested at S-band frequencies. The self-resonant frequencies of the fabricated capacitors were close to 10GHz, which is better than that of the parallel-plate capacitor, which measured only 5.5GHz. Further, the presented capacitors provided a higher capacitance when compared with the state-of-the-art-reported MEMS fractal capacitors created using a single layer at the expense of a lower quality factor. © 2012 The Institution of Engineering and Technology.

  11. Frequency-dependent electrostatic actuation in microfluidic MEMS.

    Energy Technology Data Exchange (ETDEWEB)

    Zavadil, Kevin Robert; Michalske, Terry A.; Sounart, Thomas L.

    2003-09-01

    Electrostatic actuators exhibit fast response times and are easily integrated into microsystems because they can be fabricated with standard IC micromachining processes and materials. Although electrostatic actuators have been used extensively in 'dry' MEMS, they have received less attention in microfluidic systems probably because of challenges such as electrolysis, anodization, and electrode polarization. Here we demonstrate that ac drive signals can be used to prevent electrode polarization, and thus enable electrostatic actuation in many liquids, at potentials low enough to avoid electrochemistry. We measure the frequency response of an interdigitated silicon comb-drive actuator in liquids spanning a decade of dielectric permittivities and four decades of conductivity, and present a simple theory that predicts the characteristic actuation frequency. The analysis demonstrates the importance of the native oxide on silicon actuator response, and suggests that the actuation frequency can be shifted by controlling the thickness of the oxide. For native silicon devices, actuation is predicted at frequencies less than 10 MHz, in electrolytes of ionic strength up to 100 mmol/L, and thus electrostatic actuation may be feasible in many bioMEMS and other microfluidic applications.

  12. GPS/MEMS IMU/Microprocessor Board for Navigation

    Science.gov (United States)

    Gender, Thomas K.; Chow, James; Ott, William E.

    2009-01-01

    A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

  13. Evaluation of the MEMS based portable respiratory training system with a tactile sensor for respiratory-gated radiotherapy

    Science.gov (United States)

    Moon, Sun Young; Yoon, Myonggeun; Chung, Mijoo; Chung, Weon Kuu; Kim, Dong Wook

    2017-10-01

    In respiratory-gated radiotherapy, it is important to maintain the regular respiratory cycles of patients. If patients undergo respiration training, their regular breathing pattern is affected. Therefore, we developed a respiratory training system based on a micro electromechanical system (MEMS) and evaluated the feasibility of the MEMS in radiotherapy. By comparing the measured signal before and after radiation exposure, we confirmed the effects of radiation. By evaluating the period of the electric signal emitted by a tactile sensor and its constancy, the performance of the tactile sensor was confirmed. Moreover, by comparing the delay between the motion of the MEMS and the electric signal from the tactile sensor, we confirmed the reaction time of the tactile sensor. The results showed that a baseline shift occurred for an accumulated dose of 400 Gy in the sensor, and both the amplitude and period changed. The period of the signal released by the tactile sensor was 5.39 and its standard deviation was 0.06. Considering the errors from the motion phantom, a standard deviation of 0.06 was desirable. The delay time was within 0.5 s and not distinguishable by a patient. We confirmed the performance of the MEMS and concluded that MEMS could be applied to patients for respiratory-gated radiotherapy.

  14. On the Stiction of MEMS Materials

    DEFF Research Database (Denmark)

    Zhuang, Yanxin; Menon, Aric Kumaran

    2005-01-01

    energies and stiction of commonly used MEMS materials by contact angle measurements and atomic force microscopy (AFM). Dispersive and polar components of surface energies are calculated by Owens-Wendt-Rabel-Kaelble method. Silicon and silicon-related materials have higher polar surface energies than SU-8...... been shown that the materials with higher surface energy have higher sticton/adhesion forces. The topography of surface influences the contact angle and stiction, and is also discussed in the paper....

  15. H∞ Robust Control of a Large-Piston MEMS Micromirror for Compact Fourier Transform Spectrometer Systems

    Directory of Open Access Journals (Sweden)

    Huipeng Chen

    2018-02-01

    Full Text Available Incorporating linear-scanning micro-electro-mechanical systems (MEMS micromirrors into Fourier transform spectral acquisition systems can greatly reduce the size of the spectrometer equipment, making portable Fourier transform spectrometers (FTS possible. How to minimize the tilting of the MEMS mirror plate during its large linear scan is a major problem in this application. In this work, an FTS system has been constructed based on a biaxial MEMS micromirror with a large-piston displacement of 180 μm, and a biaxial H∞ robust controller is designed. Compared with open-loop control and proportional-integral-derivative (PID closed-loop control, H∞ robust control has good stability and robustness. The experimental results show that the stable scanning displacement reaches 110.9 μm under the H∞ robust control, and the tilting angle of the MEMS mirror plate in that full scanning range falls within ±0.0014°. Without control, the FTS system cannot generate meaningful spectra. In contrast, the FTS yields a clean spectrum with a full width at half maximum (FWHM spectral linewidth of 96 cm−1 under the H∞ robust control. Moreover, the FTS system can maintain good stability and robustness under various driving conditions.

  16. Mathematical Model for Collision-Coalescence Among Inclusions in the Bloom Continuous Caster with M-EMS

    Science.gov (United States)

    Lei, Hong; Jiang, Jimin; Yang, Bin; Zhao, Yan; Zhang, Hongwei; Wang, Weixian; Dong, Guiwen

    2018-04-01

    Mathematical simulation is an effective tool to analyze the fluid flow and the inclusion behavior in the bloom continuous caster with mold electromagnetic stirring (M-EMS). The mathematical model is applied to the modeling of magnetic field, flow field, and inclusion field. Due to the introduction of Archimedes force, the collision mechanism and inclusion's slipping velocity should be modified in the inclusion mass and population conservation model. Numerically predicted magnetic field, flow field, and the inclusion spatial distribution conform to the experimental results in the existing literature. Lorentz force plays an important role in the fluid flow, and Archimedes force plays an important role in the inclusion distribution in the continuous caster. Due to Brownian collision, Stokes collision, Archimedes collision, and turbulent collision, the coalescence among inclusions occurs in the bloom continuous caster with M-EMS. Among the four types of collisions, turbulent collision occurs most frequently, followed by Archimedes collision and Stokes collision. The frequency of Brownian collision is several orders of magnitudes smaller and is therefore negligible. The inclusion volume concentration, number density, and characteristic radius exhibit a U-shape in the continuous caster without M-EMS. However, with M-EMS, they exhibit an inverted U-shape.

  17. H∞ Robust Control of a Large-Piston MEMS Micromirror for Compact Fourier Transform Spectrometer Systems.

    Science.gov (United States)

    Chen, Huipeng; Li, Mengyuan; Zhang, Yi; Xie, Huikai; Chen, Chang; Peng, Zhangming; Su, Shaohui

    2018-02-08

    Incorporating linear-scanning micro-electro-mechanical systems (MEMS) micromirrors into Fourier transform spectral acquisition systems can greatly reduce the size of the spectrometer equipment, making portable Fourier transform spectrometers (FTS) possible. How to minimize the tilting of the MEMS mirror plate during its large linear scan is a major problem in this application. In this work, an FTS system has been constructed based on a biaxial MEMS micromirror with a large-piston displacement of 180 μm, and a biaxial H∞ robust controller is designed. Compared with open-loop control and proportional-integral-derivative (PID) closed-loop control, H∞ robust control has good stability and robustness. The experimental results show that the stable scanning displacement reaches 110.9 μm under the H∞ robust control, and the tilting angle of the MEMS mirror plate in that full scanning range falls within ±0.0014°. Without control, the FTS system cannot generate meaningful spectra. In contrast, the FTS yields a clean spectrum with a full width at half maximum (FWHM) spectral linewidth of 96 cm -1 under the H∞ robust control. Moreover, the FTS system can maintain good stability and robustness under various driving conditions.

  18. Marcas de memória : implicações no estilo de ensinar

    OpenAIRE

    Vasconcellos, Débora Kern

    2016-01-01

    Esta dissertação de Mestrado em Educação insere-se no campo da subjetividade, conforme o aporte psicanalítico e sustenta-se na concepção analítica que institui a compreensão de sujeito do inconsciente e, por conseguinte, do desejo. A pesquisa foi realizada a partir das Memórias Educativas de professores que atuam no sexto ano do Ensino Fundamental da Secretaria de Educação do Distrito Federal, de cunho qualitativo, trazendo como estratégias de investigação, o dispositivo da Memória Educativa ...

  19. MEMS Accelerometer with Screen Printed Piezoelectric Thick Film

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Lau-Moeller, R.; Bove, T.

    2006-01-01

    A bulk-micromachined piezoelectric MEMS accelerometer with screen printed piezoelectric Pb(ZrxTil )O3(PZT) thick film (TF) as the sensing material has been fabricated and characterized. The accelerometer has a four beam structure with a central seismic mass (3600x3600x500 pm3) and a total chip size...

  20. Piezoelectric Films for Innovations in the Field of MEMS and Biosensors

    Science.gov (United States)

    Muralt, P.

    Microelectromechanical systems (MEMS) were born as a new technological discipline during the 1980s (for an introductory textbook, see, for instance [1]). The idea of the pioneers was to enlarge capabilities of integrated circuits based on silicon beyond pure electronics by adding mechanical elements, which were made of silicon and further materials of semiconductor technology. The addition of mechanics extended the application range of silicon technology to motion sensors, pressure and force sensors, small actuators, and a number of acoustic and ultrasonic devices, most importantly resonators for signal treatment. In order to profit from the symbiosis with electronics, those mechanical elements should, of course, be controlled by electronic signals. Evidently, this new silicon technology makes sense only for small, miniaturized devices. The technical advantage comes from the fact that powerful thin-film deposition and patterning techniques as used for semiconductor fabrication allow unprecedented precision of mechanics in the nano- to micrometer range. As a large number of devices are produced in parallel on the same wafer (batch processing), the cost level is acceptable in spite of expensive fabrication tools, at least at high production volumes. Concerning processing, the chemistry of silicon turned out to be very helpful: high etching rates of anisotropic wet etching in a base solution (as, e.g., KOH) and anisotropic deep silicon etching in a plasma reactor are crucial issues in efficiently tailoring silicon. Over the last 20 years, MEMS technology has became a proven and mature technology with many applications. While "MEMS" is still taken as a standing brand name for the field, the actual MEMS field has become much wider than stipulated by the notion of electromechanics, including thermal, optical, magnetic, chemical, biochemical, and further functional properties. Also, the main material of the device is not necessarily silicon, but may be glass or plastics