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Sample records for mems applications crack

  1. MEMS for automotive and aerospace applications

    CERN Document Server

    Kraft, Michael

    2013-01-01

    MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for

  2. MEMS for Space Flight Applications

    Science.gov (United States)

    Lawton, R.

    1998-01-01

    Micro-Electrical Mechanical Systems (MEMS) are entering the stage of design and verification to demonstrate the utility of the technology for a wide range of applications including sensors and actuators for military, space, medical, industrial, consumer, automotive and instrumentation products.

  3. Piezoelectric MEMS: Ferroelectric thin films for MEMS applications

    Science.gov (United States)

    Kanno, Isaku

    2018-04-01

    In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.

  4. MEMS applications in space exploration

    Science.gov (United States)

    Tang, William C.

    1997-09-01

    Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. MEMS is one of the key enabling technology to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

  5. MEMS fundamental technology and applications

    CERN Document Server

    Choudhary, Vikas

    2013-01-01

    "The book editors have managed to assemble a group of extraordinary authors to provide their expertise to this book. While giving an excellent overview of the history and the state of the art of MEMS technology, this book also focuses on current trends and topics such as gyroscopes that currently experience significant and increasing popularity in research and in industry. It is well written and the material is presented in a well-structured way making it easily accessible to any reader with a technical background."-Boris Stoeber, The University of British Columbia, Vancouver, Canada.

  6. MEMS Micro-Valve for Space Applications

    Science.gov (United States)

    Chakraborty, I.; Tang, W. C.; Bame, D. P.; Tang, T. K.

    1998-01-01

    We report on the development of a Micro-ElectroMechanical Systems (MEMS) valve that is designed to meet the rigorous performance requirements for a variety of space applications, such as micropropulsion, in-situ chemical analysis of other planets, or micro-fluidics experiments in micro-gravity. These systems often require very small yet reliable silicon valves with extremely low leak rates and long shelf lives. Also, they must survive the perils of space travel, which include unstoppable radiation, monumental shock and vibration forces, as well as extreme variations in temperature. Currently, no commercial MEMS valve meets these requirements. We at JPL are developing a piezoelectric MEMS valve that attempts to address the unique problem of space. We begin with proven configurations that may seem familiar. However, we have implemented some major design innovations that should produce a superior valve. The JPL micro-valve is expected to have an extremely low leak rate, limited susceptibility to particulates, vibration or radiation, as well as a wide operational temperature range.

  7. MEMS-Reconfigurable Metamaterials and Antenna Applications

    Directory of Open Access Journals (Sweden)

    Tomislav Debogovic

    2014-01-01

    Full Text Available This paper reviews some of our contributions to reconfigurable metamaterials, where dynamic control is enabled by microelectromechanical systems (MEMS technology. First, we show reconfigurable composite right-/left-handed transmission lines (CRLH-TLs having state of the art phase velocity variation and loss, thereby enabling efficient reconfigurable phase shifters and leaky-wave antennas (LWA. Second, we present very low loss metasurface designs with reconfigurable reflection properties, applicable in reflectarrays and partially reflective surface (PRS antennas. All the presented devices have been fabricated and experimentally validated. They operate in X- and Ku-bands.

  8. MEMS Sensor Arrays for Cryogenic Propellant Applications, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — KWJ offers this proposal for a low-power, practical and versatile MEMS sensor platform for NASA applications. The proposed nano-sensor platform is ultra-low power...

  9. MEMS and MOEMS for national security applications

    Science.gov (United States)

    Scott, Marion W.

    2003-01-01

    Major opportunities for microsystem insertion into commercial applications, such as telecommunications and medical prosthesis, are well known. Less well known are applications that ensure the security of our nation, the protection of its armed forces, and the safety of its citizens. Microsystems enable entirely new possibilities to meet National Security needs, which can be classed along three lines: anticipating security needs and threats, deterring the efficacy of identified threats, and defending against the application of these threats. In each of these areas, specific products that are enabled by MEMS and MOEMS are discussed. In the area of anticipating needs and threats, sensored microsystems designed for chem/bio/nuclear threats, and sensors for border and asset protection can significantly secure our borders, ports, and transportation systems. Key features for these applications include adaptive optics and spectroscopic capabilities. Microsystems to monitor soil and water quality can be used to secure critical infrastructure, food safety can be improved by in-situ identification of pathogens, and sensored buildings can ensure the architectural safety of our homes and workplaces. A challenge to commercializing these opportunities, and thus making them available for National Security needs, is developing predictable markets and predictable technology roadmaps. The integrated circuit manufacturing industry provides an example of predictable technology maturation and market insertion, primarily due to the existence of a "unit cell" that allows volume manufacturing. It is not clear that microsystems can follow an analogous path. The possible paths to affordable low-volume production, as well as the prospects of a microsystems unit cell, are discussed.

  10. Applications of MEMS for Space Exploration

    Science.gov (United States)

    Tang, William C.

    1998-03-01

    Space exploration in the coming century will emphasize cost effectiveness and highly focused mission objectives, which will result in frequent multiple missions that broaden the scope of space science and to validate new technologies on a timely basis. Micro Electro Mechanical Systems (MEMS) is one of the key enabling technologies to create cost-effective, ultra-miniaturized, robust, and functionally focused spacecraft for both robotic and human exploration programs. Examples of MEMS devices at various stages of development include microgyroscope, microseismometer, microhygrometer, quadrupole mass spectrometer, and micropropulsion engine. These devices, when proven successful, will serve as models for developing components and systems for new-millennium spacecraft.

  11. MEMS for Tunable Photonic Metamaterial Applications

    Science.gov (United States)

    Stark, Thomas

    Photonic metamaterials are materials whose optical properties are derived from artificially-structured sub-wavelength unit cells, rather than from the bulk properties of the constituent materials. Examples of metamaterials include plasmonic materials, negative index materials, and electromagnetic cloaks. While advances in simulation tools and nanofabrication methods have allowed this field to grow over the past several decades, many challenges still exist. This thesis addresses two of these challenges: fabrication of photonic metamaterials with tunable responses and high-throughput nanofabrication methods for these materials. The design, fabrication, and optical characterization of a microelectromechanical systems (MEMS) tunable plasmonic spectrometer are presented. An array of holes in a gold film, with plasmon resonance in the mid-infrared, is suspended above a gold reflector, forming a Fabry-Perot interferometer of tunable length. The spectra exhibit the convolution of extraordinary optical transmission through the holes and Fabry-Perot resonances. Using MEMS, the interferometer length is modulated from 1.7 mum to 21.67 mum , thereby tuning the free spectral range from about 2900 wavenumbers to 230.7 wavenumbers and shifting the reflection minima and maxima across the infrared. Due to its broad spectral tunability in the fingerprint region of the mid-infrared, this device shows promise as a tunable biological sensing device. To address the issue of high-throughput, high-resolution fabrication of optical metamaterials, atomic calligraphy, a MEMS-based dynamic stencil lithography technique for resist-free fabrication of photonic metamaterials on unconventional substrates, has been developed. The MEMS consists of a moveable stencil, which can be actuated with nanometer precision using electrostatic comb drive actuators. A fabrication method and flip chip method have been developed, enabling evaporation of metals through the device handle for fabrication on an

  12. Thermal energy harvesting for application at MEMS scale

    CERN Document Server

    Percy, Steven; McGarry, Scott; Post, Alex; Moore, Tim; Cavanagh, Kate

    2014-01-01

    This book discusses the history of thermal heat generators and focuses on the potential for these processes using micro-electrical mechanical systems (MEMS) technology for this application. The main focus is on the capture of waste thermal energy for example from industrial processes, transport systems or the human body to generate useable electrical power.  A wide range of technologies is discussed, including external combustion heat cycles at MEMS ( Brayton, Stirling and Rankine), Thermoacoustic, Shape Memory Alloys (SMAs), Multiferroics, Thermionics, Pyroelectric, Seebeck, Alkali Metal Thermal, Hydride Heat Engine, Johnson Thermo Electrochemical Converters, and the Johnson Electric Heat Pipe.

  13. Sputtered highly oriented PZT thin films for MEMS applications

    Science.gov (United States)

    Kalpat, Sriram S.

    Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate

  14. New Trends on MEMS Sensor Technology for Harsh Environment Applications

    Directory of Open Access Journals (Sweden)

    Patricia M. NIEVA

    2007-10-01

    Full Text Available MEMS and NEMS sensor systems that can operate in the presence of high temperatures, corrosive media, and/or high radiation hold great promise for harsh environment applications. They would reduce weight, improve machine reliability and reduce cost in strategic market sectors such as automotive, avionics, oil well logging, and nuclear power. This paper presents a review of the recent advances in harsh-environment MEMS and NEMS sensors focusing on materials and devices. Special emphasis is put on high-temperature operation. Wide-bandgap semiconductor materials for high temperature applications are discussed from the device point of view. Micro-opto mechanical systems (MOEMS are presented as a new trend for high temperature applications. As an example of a harsh environment MOEMS sensor, a vibration sensor is presented.

  15. MEMS-Based Power Generation Techniques for Implantable Biosensing Applications

    Directory of Open Access Journals (Sweden)

    Jonathan Lueke

    2011-01-01

    Full Text Available Implantable biosensing is attractive for both medical monitoring and diagnostic applications. It is possible to monitor phenomena such as physical loads on joints or implants, vital signs, or osseointegration in vivo and in real time. Microelectromechanical (MEMS-based generation techniques can allow for the autonomous operation of implantable biosensors by generating electrical power to replace or supplement existing battery-based power systems. By supplementing existing battery-based power systems for implantable biosensors, the operational lifetime of the sensor is increased. In addition, the potential for a greater amount of available power allows additional components to be added to the biosensing module, such as computational and wireless and components, improving functionality and performance of the biosensor. Photovoltaic, thermovoltaic, micro fuel cell, electrostatic, electromagnetic, and piezoelectric based generation schemes are evaluated in this paper for applicability for implantable biosensing. MEMS-based generation techniques that harvest ambient energy, such as vibration, are much better suited for implantable biosensing applications than fuel-based approaches, producing up to milliwatts of electrical power. High power density MEMS-based approaches, such as piezoelectric and electromagnetic schemes, allow for supplemental and replacement power schemes for biosensing applications to improve device capabilities and performance. In addition, this may allow for the biosensor to be further miniaturized, reducing the need for relatively large batteries with respect to device size. This would cause the implanted biosensor to be less invasive, increasing the quality of care received by the patient.

  16. MEMS-based power generation techniques for implantable biosensing applications.

    Science.gov (United States)

    Lueke, Jonathan; Moussa, Walied A

    2011-01-01

    Implantable biosensing is attractive for both medical monitoring and diagnostic applications. It is possible to monitor phenomena such as physical loads on joints or implants, vital signs, or osseointegration in vivo and in real time. Microelectromechanical (MEMS)-based generation techniques can allow for the autonomous operation of implantable biosensors by generating electrical power to replace or supplement existing battery-based power systems. By supplementing existing battery-based power systems for implantable biosensors, the operational lifetime of the sensor is increased. In addition, the potential for a greater amount of available power allows additional components to be added to the biosensing module, such as computational and wireless and components, improving functionality and performance of the biosensor. Photovoltaic, thermovoltaic, micro fuel cell, electrostatic, electromagnetic, and piezoelectric based generation schemes are evaluated in this paper for applicability for implantable biosensing. MEMS-based generation techniques that harvest ambient energy, such as vibration, are much better suited for implantable biosensing applications than fuel-based approaches, producing up to milliwatts of electrical power. High power density MEMS-based approaches, such as piezoelectric and electromagnetic schemes, allow for supplemental and replacement power schemes for biosensing applications to improve device capabilities and performance. In addition, this may allow for the biosensor to be further miniaturized, reducing the need for relatively large batteries with respect to device size. This would cause the implanted biosensor to be less invasive, increasing the quality of care received by the patient.

  17. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  18. MEMS temperature scanner: principles, advances, and applications

    Science.gov (United States)

    Otto, Thomas; Saupe, Ray; Stock, Volker; Gessner, Thomas

    2010-02-01

    Contactless measurement of temperatures has gained enormous significance in many application fields, ranging from climate protection over quality control to object recognition in public places or military objects. Thereby measurement of linear or spatially temperature distribution is often necessary. For this purposes mostly thermographic cameras or motor driven temperature scanners are used today. Both are relatively expensive and the motor drive devices are limited regarding to the scanning rate additionally. An economic alternative are temperature scanner devices based on micro mirrors. The micro mirror, attached in a simple optical setup, reflects the emitted radiation from the observed heat onto an adapted detector. A line scan of the target object is obtained by periodic deflection of the micro scanner. Planar temperature distribution will be achieved by perpendicularly moving the target object or the scanner device. Using Planck radiation law the temperature of the object is calculated. The device can be adapted to different temperature ranges and resolution by using different detectors - cooled or uncooled - and parameterized scanner parameters. With the basic configuration 40 spatially distributed measuring points can be determined with temperatures in a range from 350°C - 1000°C. The achieved miniaturization of such scanners permits the employment in complex plants with high building density or in direct proximity to the measuring point. The price advantage enables a lot of applications, especially new application in the low-price market segment This paper shows principle, setup and application of a temperature measurement system based on micro scanners working in the near infrared range. Packaging issues and measurement results will be discussed as well.

  19. Cyber integrated MEMS microhand for biological applications

    Science.gov (United States)

    Weissman, Adam; Frazier, Athena; Pepen, Michael; Lu, Yen-Wen; Yang, Shanchieh Jay

    2009-05-01

    Anthropomorphous robotic hands at microscales have been developed to receive information and perform tasks for biological applications. To emulate a human hand's dexterity, the microhand requires a master-slave interface with a wearable controller, force sensors, and perception displays for tele-manipulation. Recognizing the constraints and complexity imposed in developing feedback interface during miniaturization, this project address the need by creating an integrated cyber environment incorporating sensors with a microhand, haptic/visual display, and object model, to emulates human hands' psychophysical perception at microscale.

  20. Scanning Micromirror Platform Based on MEMS Technology for Medical Application

    Directory of Open Access Journals (Sweden)

    Eakkachai Pengwang

    2016-02-01

    Full Text Available This topical review discusses recent development and trends on scanning micromirrors for biomedical applications. This also includes a biomedical micro robot for precise manipulations in a limited volume. The characteristics of medical scanning micromirror are explained in general with the fundamental of microelectromechanical systems (MEMS for fabrication processes. Along with the explanations of mechanism and design, the principle of actuation are provided for general readers. In this review, several testing methodology and examples are described based on many types of actuators, such as, electrothermal actuators, electrostatic actuators, electromagnetic actuators, pneumatic actuators, and shape memory alloy. Moreover, this review provides description of the key fabrication processes and common materials in order to be a basic guideline for selecting micro-actuators. With recent developments on scanning micromirrors, performances of biomedical application are enhanced for higher resolution, high accuracy, and high dexterity. With further developments on integrations and control schemes, MEMS-based scanning micromirrors would be able to achieve a better performance for medical applications due to small size, ease in microfabrication, mass production, high scanning speed, low power consumption, mechanical stable, and integration compatibility.

  1. Micro-fabrication technology for piezoelectric film formation and its application to MEMS

    OpenAIRE

    一木, 正聡; 曹, 俊杰; 張, 麓〓; 王, 占杰; 前田, 龍太郎; Masaaki, ICHIKI; Jiunn Jye, TSAUR; Lulu, ZHANG; Zhang Jie, WANG; Ryutaro, MAEDA; 産業技術総合研究所; 産業技術総合研究所; 産業技術総合研究所; 東北大学; 産業技術総合研究所

    2005-01-01

    Technological problems for realization of Micro Electro-mechanical System (MEMS) are discussed and an introduction of smart materials (PZT) is encouraged. The film formation and micromaching technology are discussed in integration of PZT thin films into MEMS. Further developments are proposed on PZT micro sensors and actuators with special emphasis laid on exploration of new application fields of MEMS, such as scanning mirror. Internal stress is estimated and analyzed for the improvement of d...

  2. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    Science.gov (United States)

    Harney, Kieran P.

    2005-01-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  3. Vibrations of Elastic Systems With Applications to MEMS and NEMS

    CERN Document Server

    Magrab, Edward B

    2012-01-01

    This work presents a unified approach to the vibrations of elastic systems as applied to MEMS devices, mechanical components, and civil structures. Applications include atomic force microscopes, energy harvesters, and carbon nanotubes and consider such complicating effects as squeeze film damping, viscous fluid loading, in-plane forces, and proof mass interactions with their elastic supports. These effects are analyzed as single degree-of-freedom models and as more realistic elastic structures. The governing equations and boundary conditions for beams, plates, and shells with interior and boundary attachments are derived by applying variational calculus to an expression describing the energy of the system. The advantages of this approach regarding the generation of orthogonal functions and the Rayleigh-Ritz method are demonstrated. A large number of graphs and tables are given to show the impact of various factors on the systems’ natural frequencies, mode shapes, and responses.

  4. Micro-Electromechanical-Systems (MEMS) technologies for aerospace applications in Canada

    International Nuclear Information System (INIS)

    Pimprikar, M.

    2001-01-01

    During the last decade, research and development of Micro-Electro-Mechanical Systems (MEMS) have shown significant promise for a variety of aerospace applications. The advantages of drastic size and weight reduction of MEMS enables consideration of developing low-cost, high-performance, ultra-portable, MEMS-based devices and systems for aircraft, space and defense requirements. 'Microelectromechanical Systems, or MEMS', are integrated microdevices or systems combining electrical and mechanical components, fabricated using integrated circuit compatible batch-processing techniques, and varying in size from micrometers to millimeters. In the 1990's, MEMS were used as laboratory curiosities with very low power, short lifetimes and few concrete applications. One decade later, MEMS have taken major roles in several industries, the total world market is expected to grow from $14 billion to over $40 billion by the year 2002. A typical device contains micromechanical structures that move by flexing (membranes, cantilevers, springs) and MEMS/MOEMS level where the integration of microelectronics, micromechanics and optics form a complete system (sensor, actuator, photonic device). (author)

  5. MEMS-based transmission lines for microwave applications

    Science.gov (United States)

    Wu, Qun; Fu, Jiahui; Gu, Xuemai; Shi, Huajuan; Lee, Jongchul

    2003-04-01

    This paper mainly presents a briefly review for recent progress in MEMS-based transmission lines for use in microwave and millimeterwave range. MEMS-based transmission lines including different transmission line structure such as membrane-supported microstrip line microstrip line, coplanar microshield transmission line, LIGA micromachined planar transmission line, micromachined waveguides and coplanar waveguide are discussed. MEMS-based transmission lines are characterized by low propagation loss, wide operation frequency band, low dispersion and high quality factor, in addition, the fabrication is compatible with traditional processing of integrated circuits (IC"s). The emergence of MEMS-based transmission lines provided a solution for miniaturizing microwave system and monolithic microwave integrated circuits.

  6. Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

    Science.gov (United States)

    Jah, Muzar; Simon, Eric; Sharma, Ashok

    2003-01-01

    Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

  7. MEMS Accelerometers Sensors: an Application in Virtual Reality

    Directory of Open Access Journals (Sweden)

    Daniel CORRÊA

    2010-09-01

    Full Text Available The measurement of a particular human body member position is extremely important in many applications. The human behavior understanding typically involves the body posture analysis or estimation, as well as the generated corresponding gestures. This behavior characterization allows analyzing, interpreting, and animating human actions and therefore enables us the use of experimental methodologies. Using the virtual reality devices to facilitate people’s lives, they can help to train and improve the actions of an Olympic athlete, for example and imitation of human actions by robotic systems. The systems development to monitor human body members’ movements is a growing interesting area, both in entertainment and in systems to help physically disabled people, as that developing assistive technology. To contribute to this area, this paper presents the experimental development of an instrumented glove prototype of low cost for the recognition of hand inclination movements, using a Micro-Electro-Mechanical Systems (MEMS accelerometer, by virtual reality concepts for demonstration in real time. We present the hardware that was developed, the calibration procedures, the achieved results with their statistical corresponding validation. The results allowed to state that the system is suitable for the inclination measurement in a 2D plan, thus allowing its use in entertainment systems and as an auxiliary device for assistive technology system.

  8. A MEMS Electrochemical Bellows Actuator for Fluid Metering Applications

    Science.gov (United States)

    Sheybani, Roya; Gensler, Heidi; Meng, Ellis

    2013-01-01

    We present a high efficiency wireless MEMS electrochemical bellows actuator capable of rapid and repeatable delivery of boluses for fluid metering and drug delivery applications. Nafion®-coated Pt electrodes were combined with Parylene bellows filled with DI water to form the electrolysis-based actuator. The performance of actuators with several bellows configurations was compared for a range of applied currents (1-10 mA). Up to 75 boluses were delivered with an average pumping flow rate of 114.40 ± 1.63 μL/min. Recombination of gases into water, an important factor in repeatable and reliable actuation, was studied for uncoated and Nafion®-coated actuators. Real-time pressure measurements were conducted and the effects of temperature, physiological back pressure, and drug viscosity on delivery performance were investigated. Lastly, we present wireless powering of the actuator using a class D inductive powering system that allowed for repeatable delivery with less than 2% variation in flow rate values. PMID:22833156

  9. Application of Zeolitic Additives in the Fluid Catalytic Cracking (FCC

    Directory of Open Access Journals (Sweden)

    A. Nemati Kharat

    2013-06-01

    Full Text Available Current article describes application of zeolites in fluid catalytic cracking (FCC. The use of several zeolitic additives for the production light olefins and reduction of pollutants is described. Application of zeolites as fluid catalytic cracking (FCC catalysts and additives due to the presence of active acid sites in the zeolite framework  increase the formation of desired cracking products (i.e., olefin and branched products  in the FCC unit.

  10. Infrastructure for the design and fabrication of MEMS for RF/microwave and millimeter wave applications

    Science.gov (United States)

    Nerguizian, Vahe; Rafaf, Mustapha

    2004-08-01

    This article describes and provides valuable information for companies and universities with strategies to start fabricating MEMS for RF/Microwave and millimeter wave applications. The present work shows the infrastructure developed for RF/Microwave and millimeter wave MEMS platforms, which helps the identification, evaluation and selection of design tools and fabrication foundries taking into account packaging and testing. The selected and implemented simple infrastructure models, based on surface and bulk micromachining, yield inexpensive and innovative approaches for distributed choices of MEMS operating tools. With different educational or industrial institution needs, these models may be modified for specific resource changes using a careful analyzed iteration process. The inputs of the project are evaluation selection criteria and information sources such as financial, technical, availability, accessibility, simplicity, versatility and practical considerations. The outputs of the project are the selection of different MEMS design tools or software (solid modeling, electrostatic/electromagnetic and others, compatible with existing standard RF/Microwave design tools) and different MEMS manufacturing foundries. Typical RF/Microwave and millimeter wave MEMS solutions are introduced on the platform during the evaluation and development phases of the project for the validation of realistic results and operational decision making choices. The encountered challenges during the investigation and the development steps are identified and the dynamic behavior of the infrastructure is emphasized. The inputs (resources) and the outputs (demonstrated solutions) are presented in tables and flow chart mode diagrams.

  11. Application of acoustic emission to hydride cracking

    International Nuclear Information System (INIS)

    Sagat, S.; Ambler, J.F.R.; Coleman, C.E.

    1986-07-01

    Acoustic emission has been used for over a decade to study delayed hydride cracking (DHC) in zirconium alloys. At first acoustic emission was used primarily to detect the onset of DHC. This was possible because DHC was accompanied by very little plastic deformation of the material and furthermore the amplitudes of the acoustic pulses produced during cracking of the brittle hydride phase were much larger than those from dislocation motion and twinning. Acoustic emission was also used for measuring crack growth when it was found that for a suitable amplitude threshold, the total number of acoustic emission counts was linearly related to the cracked area. Once the proportionality constant was established, the acoustic counts could be converted to the crack length. Now the proportionality between the count rate and the crack growth rate is used to provide feedback between the crack length and the applied load, using computer technology. In such a system, the stress at the crack tip can be maintained constant during the test by adjusting the applied load as the crack progresses, or it can be changed in a predetermined manner, for example, to measure the threshold stress for cracking

  12. PECVD silicon carbide surface micromachining technology and selected MEMS applications

    NARCIS (Netherlands)

    Rajaraman, V.; Pakula, L.S.; Yang, H.; French, P.J.; Sarro, P.M.

    2011-01-01

    Attractive material properties of plasma enhanced chemical vapour deposited (PECVD) silicon carbide (SiC) when combined with CMOS-compatible low thermal budget processing provides an ideal technology platform for developing various microelectromechanical systems (MEMS) devices and merging them with

  13. Crack

    Science.gov (United States)

    ... spending time in a rehab facility or getting cognitive-behavioral therapy or other treatments. Right now, there are no medicines to treat a crack addiction. If you smoke crack, talking with a counselor ...

  14. Fatigue crack growth resistance and crack closure behavior in two aluminum alloys for aeronautical applications

    Directory of Open Access Journals (Sweden)

    Elenice Maria Rodrigues

    2005-09-01

    Full Text Available Aluminum-lithium alloys are candidate materials for many aerospace applications because of their high specific strength and elastic modulus. These alloys have several unique characteristics such as excellent fatigue crack growth resistance when compared with that of the conventional 2000 and 7000 series alloys. In this study, fatigue crack propagation behavior has been examined in a commercial thin plate of Al-Li-Cu-Mg alloy (8090, with specific emphasis at the fatigue threshold. The results are compared with those of the traditional Al-Cu-Mg alloy (2024. Fatigue crack closure is used to explain the different behavior of the compared alloys.

  15. BurstMem: A High-Performance Burst Buffer System for Scientific Applications

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Teng [Auburn University, Auburn, Alabama; Oral, H Sarp [ORNL; Wang, Yandong [Auburn University, Auburn, Alabama; Settlemyer, Bradley W [ORNL; Atchley, Scott [ORNL; Yu, Weikuan [Auburn University, Auburn, Alabama

    2014-01-01

    The growth of computing power on large-scale sys- tems requires commensurate high-bandwidth I/O system. Many parallel file systems are designed to provide fast sustainable I/O in response to applications soaring requirements. To meet this need, a novel system is imperative to temporarily buffer the bursty I/O and gradually flush datasets to long-term parallel file systems. In this paper, we introduce the design of BurstMem, a high- performance burst buffer system. BurstMem provides a storage framework with efficient storage and communication manage- ment strategies. Our experiments demonstrate that BurstMem is able to speed up the I/O performance of scientific applications by up to 8.5 on leadership computer systems.

  16. Radioisotope applications on fluidized catalytic cracking units

    International Nuclear Information System (INIS)

    Charlton, J.S.

    1997-01-01

    Radioisotopes are used to trace the flow of all the phases of Fluidized Catalytic Cracking process in oil refineries. The gaseous phases, steam, hydrocarbon vapour and air, are generally traced using a noble-gas isotope, 41 Ar, 79 Kr or 85 Kr. An appropriate tracer for the catalyst is produced by irradiating a catalyst sample in a nuclear reactor. The activation products, 140 La and 24 Na provide appropriate radioactive 'labels' for the catalyst, which is reinjected into the FCC. An advantage of this approach is that it facilitates the study of the behaviour of different particle size fractions. Radioisotopes as sealed sources of gamma radiation are used to measure catalyst density variations and density distributions in critical parts of the unit. An important trend in radioisotope applications is the increasing use of the information they produce as inputs to or as validation of, mathematical process models. In line with the increasing sophistication of the models, the technology is undergoing continuous refinement. Developments include the investigation of more efficient, more convenient tracers, the introduction of systems to facilitate more rapid and comprehensive data acquisition and software refinements for enhanced data analysis

  17. A versatile multi-user polyimide surface micromachinning process for MEMS applications

    KAUST Repository

    Carreno, Armando Arpys Arevalo

    2015-04-01

    This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the \\'Polyimide MEMS Multi-User Process\\' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. © 2015 IEEE.

  18. A MEMS-based super fast dew point hygrometer—construction and medical applications

    International Nuclear Information System (INIS)

    Jachowicz, Ryszard S; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz

    2009-01-01

    The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between −10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too

  19. A MEMS-based super fast dew point hygrometer—construction and medical applications

    Science.gov (United States)

    Jachowicz, Ryszard S.; Weremczuk, Jerzy; Paczesny, Daniel; Tarapata, Grzegorz

    2009-12-01

    The paper shows how MEMS (micro-electro-mechanical system) technology and a modified principle of fast temperature control (by heat injection instead of careful control of cooling) can considerably improve the dynamic parameters of dew point hygrometers. Some aspects of MEMS-type integrated sensor construction and technology, whole measurement system design, the control algorithm to run the system as well as empirical dynamic parameters from the tests are discussed too. The hygrometer can easily obtain five to six measurements per second with an uncertainty of less than 0.3 K. The meter range is between -10 °C and 40 °C dew point. In the second part of the paper (section 2), two different successful applications in medicine based on fast humidity measurements have been discussed. Some specific constructions of these super fast dew point hygrometers based on a MEMS sensor as well as limited empirical results from clinical tests have been reported too.

  20. MEMS Coupled Resonator for Filter Application in Air

    KAUST Repository

    Ilyas, Saad; Jaber, Nizar; Younis, Mohammad I.

    2017-01-01

    We present a mechanically coupled MEMS H resonator capable of performing simultaneous amplification and filter operation in air. The device comprises of two doubly clamped polyimide microbeams joined through the middle by a coupling beam of the same size. The resonator is fabricated via a multilayer surface micromachining process. A special fabrication process and device design is employed to enable the device's operation in air and to achieve mechanical amplification of the output response. Moreover, mixed-frequency excitation is used to demonstrate a tunable wide band filter. The device design combined with the mixed-frequency excitation is used to demonstrate simultaneous amplification and filtering in air.

  1. MEMS Coupled Resonator for Filter Application in Air

    KAUST Repository

    Ilyas, Saad

    2017-11-03

    We present a mechanically coupled MEMS H resonator capable of performing simultaneous amplification and filter operation in air. The device comprises of two doubly clamped polyimide microbeams joined through the middle by a coupling beam of the same size. The resonator is fabricated via a multilayer surface micromachining process. A special fabrication process and device design is employed to enable the device\\'s operation in air and to achieve mechanical amplification of the output response. Moreover, mixed-frequency excitation is used to demonstrate a tunable wide band filter. The device design combined with the mixed-frequency excitation is used to demonstrate simultaneous amplification and filtering in air.

  2. Biomaterials for MEMS

    CERN Document Server

    Chiao, Mu

    2011-01-01

    This book serves as a guide for practicing engineers, researchers, and students interested in MEMS devices that use biomaterials and biomedical applications. It is also suitable for engineers and researchers interested in MEMS and its applications but who do not have the necessary background in biomaterials.Biomaterials for MEMS highlights important features and issues of biomaterials that have been used in MEMS and biomedical areas. Hence this book is an essential guide for MEMS engineers or researchers who are trained in engineering institutes that do not provide the background or knowledge

  3. Application of the cracked pipe element to creep crack growth prediction

    Energy Technology Data Exchange (ETDEWEB)

    Brochard, J.; Charras, T. [C.E.A.-C.E.-Saclay DRN/DMT, Gif Sur Yvette (France); Ghoudi, M. [C.E.A.-C.E.-Saclay, Gif Sur Yvette (France)

    1997-04-01

    Modifications to a computer code for ductile fracture assessment of piping systems with postulated circumferential through-wall cracks under static or dynamic loading are very briefly described. The modifications extend the capabilities of the CASTEM2000 code to the determination of fracture parameters under creep conditions. The main advantage of the approach is that thermal loads can be evaluated as secondary stresses. The code is applicable to piping systems for which crack propagation predictions differ significantly depending on whether thermal stresses are considered as primary or secondary stresses.

  4. Mechanical and electromechanical properties of graphene and their potential application in MEMS

    International Nuclear Information System (INIS)

    Khan, Zulfiqar H; Kermany, Atieh R; Iacopi, Francesca; Öchsner, Andreas

    2017-01-01

    Graphene-based micro-electromechanical systems (MEMS) are very promising candidates for next generation miniaturized, lightweight, and ultra-sensitive devices. In this review, we review the progress to date of the assessment of the mechanical, electromechanical, and thermomechanical properties of graphene for application in graphene-based MEMS. Graphene possesses a plethora of outstanding properties—such as a 1 TPa Young’s modulus, exceptionally high 2D failure strength that stems from its sp 2 hybridization, and strong sigma bonding between carbon atoms. Such exceptional mechanical properties can enable, for example, graphene-based sound sources capable of generating sound beyond the audible range. The recently engineered piezoelectric properties of atomic force microscope tip-pressed graphene membranes or supported graphene on SiO 2 substrates, have paved the way in fabricating graphene-based nano-generators and actuators. On the other hand, graphene’s piezoresistive properties have enabled miniaturized pressure and strain sensors. 2D graphene nano-mechanical resonators can potentially measure ultralow forces, charges and potentially detect single atomic masses. The exceptional tribology of graphene can play a significant role in achieving superlubricity. In addition, the highest reported thermal conductivity of graphene is amenable for use in chips and providing better performing MEMS, as heat is efficiently dissipated. On top of that, graphene membranes could be nano-perforated to realize specialized applications like DNA translocation and desalination. Finally, to ensure stability and reliability of the graphene-based MEMS, adhesion is an important mechanical property that should be considered. In general, graphene could be used as a structural material in resonators, sensors, actuators and nano-generators with better performance and sensitivity than conventional MEMS. (topical review)

  5. Development, characterization and application of compact spectrometers based on MEMS with in-plane capacitive drives

    Science.gov (United States)

    Kenda, A.; Kraft, M.; Tortschanoff, A.; Scherf, Werner; Sandner, T.; Schenk, Harald; Luettjohann, Stephan; Simon, A.

    2014-05-01

    With a trend towards the use of spectroscopic systems in various fields of science and industry, there is an increasing demand for compact spectrometers. For UV/VIS to the shortwave near-infrared spectral range, compact hand-held polychromator type devices are widely used and have replaced larger conventional instruments in many applications. Still, for longer wavelengths this type of compact spectrometers is lacking suitable and affordable detector arrays. In perennial development Carinthian Tech Research AG together with the Fraunhofer Institute for Photonic Microsystems endeavor to close this gap by developing spectrometer systems based on photonic MEMS. Here, we review on two different spectrometer developments, a scanning grating spectrometer working in the NIR and a FT-spectrometer accessing the mid-IR range up to 14 μm. Both systems are using photonic MEMS devices actuated by in-plane comb drive structures. This principle allows for high mechanical amplitudes at low driving voltages but results in gratings respectively mirrors oscillating harmonically. Both systems feature special MEMS structures as well as aspects in terms of system integration which shall tease out the best possible overall performance on the basis of this technology. However, the advantages of MEMS as enabling technology for high scanning speed, miniaturization, energy efficiency, etc. are pointed out. Whereas the scanning grating spectrometer has already evolved to a product for the point of sale analysis of traditional Chinese medicine products, the purpose of the FT-spectrometer as presented is to demonstrate what is achievable in terms of performance. Current developments topics address MEMS packaging issues towards long term stability, further miniaturization and usability.

  6. Recent Advances of MEMS Resonators for Lorentz Force Based Magnetic Field Sensors: Design, Applications and Challenges

    Directory of Open Access Journals (Sweden)

    Agustín Leobardo Herrera-May

    2016-08-01

    Full Text Available Microelectromechanical systems (MEMS resonators have allowed the development of magnetic field sensors with potential applications such as biomedicine, automotive industry, navigation systems, space satellites, telecommunications and non-destructive testing. We present a review of recent magnetic field sensors based on MEMS resonators, which operate with Lorentz force. These sensors have a compact structure, wide measurement range, low energy consumption, high sensitivity and suitable performance. The design methodology, simulation tools, damping sources, sensing techniques and future applications of magnetic field sensors are discussed. The design process is fundamental in achieving correct selection of the operation principle, sensing technique, materials, fabrication process and readout systems of the sensors. In addition, the description of the main sensing systems and challenges of the MEMS sensors are discussed. To develop the best devices, researches of their mechanical reliability, vacuum packaging, design optimization and temperature compensation circuits are needed. Future applications will require multifunctional sensors for monitoring several physical parameters (e.g., magnetic field, acceleration, angular ratio, humidity, temperature and gases.

  7. Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplates

    KAUST Repository

    Lizardo, Ernesto B.

    2013-05-08

    Micro-electro-mechanical systems (MEMS) became possible thanks to the silicon based technology used to fabricate integrated circuits. Originally, MEMS fabrication was limited to silicon based techniques and materials, but the expansion of MEMS applications brought the need of a wider catalog of materials, including polymers, now being used to fabricate MEMS. Polyimide is a very attractive polymer for MEMS fabrication due to its high temperature stability compared to other polymers, low coefficient of thermal expansion, low film stress and low cost. The goal of this thesis is to expand the Polyimide usage as structural material for MEMS by the development of a multi-user fabrication process for the integration of this polymer along with multiple metal layers on a silicon substrate. The process also integrates amorphous silicon as sacrificial layer to create free-standing structures. Dry etching is used to release the devices and avoid stiction phenomena. The developed process is used to fabricate platforms for micro-hotplate gas sensors. The fabrication steps for the platforms are described in detail, explaining the process specifics and capabilities. An initial testing of the micro-hotplate is presented. As the process was also used as educational tool, some designs made by students and fabricated with the Polyimide-MEMS process are also presented.

  8. Improved mechanical reliability of MEMS electret based vibration energy harvesters for automotive applications

    International Nuclear Information System (INIS)

    Renaud, M; Goedbloed, M; De Nooijer, C; Van Schaijk, R; Fujita, T

    2014-01-01

    Current commercial wireless tire pressure monitoring systems (TPMS) require a battery as electrical power source. The battery limits the lifetime of the TPMS. This limit can be circumvented by replacing the battery by a vibration energy harvester. Autonomous wireless TPMS powered by MEMS electret based vibration energy harvester have been demonstrated. A remaining technical challenge to attain the grade of commercial product with these autonomous TPMS is the mechanical reliability of the MEMS harvester. It should survive the harsh conditions imposed by the tire environment, particularly in terms of mechanical shocks. As shown in this article, our first generation of harvesters has a shock resilience of 400 g, which is far from being sufficient for the targeted application. In order to improve this aspect, several types of shock absorbing structures are investigated. With the best proposed solution, the shock resilience of the harvesters is brought above 2500 g

  9. Epitaxial Pb(Zr,Ti)O3 thin films for a MEMS application

    International Nuclear Information System (INIS)

    Nguyen, Minh D; Vu, Hung N; Blank, Dave H A; Rijnders, Guus

    2011-01-01

    This research presents the deposition and device fabrication of epitaxial Pb(Zr,Ti)O 3 (PZT) thin films for applications in microelectromechanical systems (MEMS). A piezoelectric micro-membrane is described as an example. Using the pulsed laser deposition (PLD) technique and the MEMS microfabrication process, the piezo-membranes with diameters ranging from 200 to 500 μm were obtained. The displacement of piezo-membranes increased from 5.1 to 17.5 nm V −1 with a piezoelectric-membrane diameter in the range of 200–500 μm. Furthermore, the effect of PZT film-thickness on the mechanical properties has been investigated. By using the conductive-oxide SrRuO 3 (SRO) layers as the electrodes, the degradation of both ferroelectric and piezoelectric properties is prevented up to 10 10 switching cycles

  10. Centimeter-scale MEMS scanning mirrors for high power laser application

    Science.gov (United States)

    Senger, F.; Hofmann, U.; v. Wantoch, T.; Mallas, C.; Janes, J.; Benecke, W.; Herwig, Patrick; Gawlitza, P.; Ortega-Delgado, M.; Grune, C.; Hannweber, J.; Wetzig, A.

    2015-02-01

    A higher achievable scan speed and the capability to integrate two scan axes in a very compact device are fundamental advantages of MEMS scanning mirrors over conventional galvanometric scanners. There is a growing demand for biaxial high speed scanning systems complementing the rapid progress of high power lasers for enabling the development of new high throughput manufacturing processes. This paper presents concept, design, fabrication and test of biaxial large aperture MEMS scanning mirrors (LAMM) with aperture sizes up to 20 mm for use in high-power laser applications. To keep static and dynamic deformation of the mirror acceptably low all MEMS mirrors exhibit full substrate thickness of 725 μm. The LAMM-scanners are being vacuum packaged on wafer-level based on a stack of 4 wafers. Scanners with aperture sizes up to 12 mm are designed as a 4-DOF-oscillator with amplitude magnification applying electrostatic actuation for driving a motor-frame. As an example a 7-mm-scanner is presented that achieves an optical scan angle of 32 degrees at 3.2 kHz. LAMM-scanners with apertures sizes of 20 mm are designed as passive high-Q-resonators to be externally excited by low-cost electromagnetic or piezoelectric drives. Multi-layer dielectric coatings with a reflectivity higher than 99.9 % have enabled to apply cw-laser power loads of more than 600 W without damaging the MEMS mirror. Finally, a new excitation concept for resonant scanners is presented providing advantageous shaping of intensity profiles of projected laser patterns without modulating the laser. This is of interest in lighting applications such as automotive laser headlights.

  11. Effect of tungsten (W) on structural and magnetic properties of electroplated NiFe thin films for MEMS applications

    Science.gov (United States)

    Kannan, R.; Devaki, P.; Premkumar, P. S.; Selvambikai, M.

    2018-04-01

    Electrodeposition of nanocrystalline NiFe and NiFeW thin films were carried out from ammonium citrate bath at a constant current density and controlled pH of 8 by varying the bath temperature from 40 °C to 70 °C. The surface morphology and chemical composition of the electrodeposited NiFe and NiFeW soft magnetic thin films were studied by using SEM and EDAX. The SEM micrographs of the films coated at higher electrodeposited bath temperature have no micro cracks and also the films have more uniform surface morphology. The existence of crystalline nature of the coated films were analysed by XRD. The presence of predominant peaks in x-ray diffraction pattern (compared with JCPDS data) reveal that the average crystalline size was in the order of few tens of nano meters. The magnetic properties such as coercivity, saturation magnetization and magnetic flux density have been calculated from vibrating sample magnetometer analysis. The VSM result shows that the NiFeW thin film synthesised at 70 °C exhibit the lower coercivity with higher saturation magnetization. The hardness and adhesion of the electroplated films have been investigated. Reasons for variation in magnetic properties and structural characteristics are also discussed. The electroplated NiFe and NiFeW thin films can be used for Micro Electro Mechanical System (MEMS) applications due to their excellent soft magnetic behaviour.

  12. A Capacitance-To-Digital Converter for MEMS Sensors for Smart Applications.

    Science.gov (United States)

    Pérez Sanjurjo, Javier; Prefasi, Enrique; Buffa, Cesare; Gaggl, Richard

    2017-06-07

    The use of MEMS sensors has been increasing in recent years. To cover all the applications, many different readout circuits are needed. To reduce the cost and time to market, a generic capacitance-to-digital converter (CDC) seems to be the logical next step. This work presents a configurable CDC designed for capacitive MEMS sensors. The sensor is built with a bridge of MEMS, where some of them function with pressure. Then, the capacitive to digital conversion is realized using two steps. First, a switched-capacitor (SC) preamplifier is used to make the capacitive to voltage (C-V) conversion. Second, a self-oscillated noise-shaping integrating dual-slope (DS) converter is used to digitize this magnitude. The proposed converter uses time instead of amplitude resolution to generate a multibit digital output stream. In addition it performs noise shaping of the quantization error to reduce measurement time. This article shows the effectiveness of this method by measurements performed on a prototype, designed and fabricated using standard 0.13 µm CMOS technology. Experimental measurements show that the CDC achieves a resolution of 17 bits, with an effective area of 0.317 mm², which means a pressure resolution of 1 Pa, while consuming 146 µA from a 1.5 V power supply.

  13. An investigation into graphene exfoliation and potential graphene application in MEMS devices

    Science.gov (United States)

    Fercana, George; Kletetschka, Gunther; Mikula, Vilem; Li, Mary

    2011-02-01

    The design of microelectromecanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) are often materials-limited with respect to the efficiency and capability of the material. Graphene, a one atom thick honeycomb lattice of carbon, is a highly desired material for MEMS applications. Relevant properties of graphene include the material's optical transparency, mechanical strength, energy efficiency, and electrical and thermal conductivity due to its electron mobility. Aforementioned properties make graphene a strong candidate to supplant existing transparent electrode technology and replace the conventionally used material, indium-tin oxide. In this paper we present preliminary results on work toward integration of graphene with MEMS structures. We are studying mechanical exfoliation of highly ordered pyrolytic graphite (HOPG) crystals by repeatedly applying and separating adhesive materials from the HOPG surface. The resulting graphene sheets are then transferred to silicon oxide substrate using the previously applied adhesive material. We explored different adhesive options, particularly the use of Kapton tape, to improve the yield of graphene isolation along with chemical cross-linking agents which operate on a mechanism of photoinsertion of disassociated nitrene groups. These perfluorophenyl nitrenes participate in C=C addition reactions with graphene monolayers creating a covalent binding between the substrate and graphene. We are focusing on maximizing the size of isolated graphene sheets and comparing to conventional exfoliation. Preliminary results allow isolation of few layer graphene (FLG) sheets (ntechnology to be used in future deep space telescopes.

  14. CMOS compatible fabrication process of MEMS resonator for timing reference and sensing application

    Science.gov (United States)

    Huynh, Duc H.; Nguyen, Phuong D.; Nguyen, Thanh C.; Skafidas, Stan; Evans, Robin

    2015-12-01

    Frequency reference and timing control devices are ubiquitous in electronic applications. There is at least one resonator required for each of this device. Currently electromechanical resonators such as crystal resonator, ceramic resonator are the ultimate choices. This tendency will probably keep going for many more years. However, current market demands for small size, low power consumption, cheap and reliable products, has divulged many limitations of this type of resonators. They cannot be integrated into standard CMOS (Complement metaloxide- semiconductor) IC (Integrated Circuit) due to material and fabrication process incompatibility. Currently, these devices are off-chip and they require external circuitries to interface with the ICs. This configuration significantly increases the overall size and cost of the entire electronic system. In addition, extra external connection, especially at high frequency, will potentially create negative impacts on the performance of the entire system due to signal degradation and parasitic effects. Furthermore, due to off-chip packaging nature, these devices are quite expensive, particularly for high frequency and high quality factor devices. To address these issues, researchers have been intensively studying on an alternative for type of resonator by utilizing the new emerging MEMS (Micro-electro-mechanical systems) technology. Recent progress in this field has demonstrated a MEMS resonator with resonant frequency of 2.97 GHz and quality factor (measured in vacuum) of 42900. Despite this great achievement, this prototype is still far from being fully integrated into CMOS system due to incompatibility in fabrication process and its high series motional impedance. On the other hand, fully integrated MEMS resonator had been demonstrated but at lower frequency and quality factor. We propose a design and fabrication process for a low cost, high frequency and a high quality MEMS resonator, which can be integrated into a standard

  15. Novel designs for application specific MEMS pressure sensors.

    Science.gov (United States)

    Fragiacomo, Giulio; Reck, Kasper; Lorenzen, Lasse; Thomsen, Erik V

    2010-01-01

    In the framework of developing innovative microfabricated pressure sensors, we present here three designs based on different readout principles, each one tailored for a specific application. A touch mode capacitive pressure sensor with high sensitivity (14 pF/bar), low temperature dependence and high capacitive output signal (more than 100 pF) is depicted. An optical pressure sensor intrinsically immune to electromagnetic interference, with large pressure range (0-350 bar) and a sensitivity of 1 pm/bar is presented. Finally, a resonating wireless pressure sensor power source free with a sensitivity of 650 KHz/mmHg is described. These sensors will be related with their applications in harsh environment, distributed systems and medical environment, respectively. For many aspects, commercially available sensors, which in vast majority are piezoresistive, are not suited for the applications proposed.

  16. Novel Designs for Application Specific MEMS Pressure Sensors

    Directory of Open Access Journals (Sweden)

    Erik V. Thomsen

    2010-10-01

    Full Text Available In the framework of developing innovative microfabricated pressure sensors, we present here three designs based on different readout principles, each one tailored for a specific application. A touch mode capacitive pressure sensor with high sensitivity (14 pF/bar, low temperature dependence and high capacitive output signal (more than 100 pF is depicted. An optical pressure sensor intrinsically immune to electromagnetic interference, with large pressure range (0–350 bar and a sensitivity of 1 pm/bar is presented. Finally, a resonating wireless pressure sensor power source free with a sensitivity of 650 KHz/mmHg is described. These sensors will be related with their applications in  harsh environment, distributed systems and medical environment, respectively. For many aspects, commercially available sensors, which in vast majority are piezoresistive, are not suited for the applications proposed.

  17. MICROSTRUCTURING OF SU-8 RESIST FOR MEMS AND BIO-APPLICATIONS

    OpenAIRE

    Dey, P.K.; Pramanick, B.; RaviShankar, A.; Ganguly, P.; Das, S.

    2017-01-01

    Some studies on the fabrication of micro-needles, micro-pillers, and micro-channels using SU-8 negative photoresist for MEMS and bio-applications are reported. The SU-8 processing technology was standardized for the purpose. Micro-pillars were fabricated on SU-8 polymer by soft lithographic technique. Micro-needles were realized on SU-8 film utilizing lensing effect of the etched groove structure of the glass substrate. Micro-channel was fabricated by molding of PDMS polymer on patterned SU-8...

  18. Advanced Mechatronics and MEMS Devices

    CERN Document Server

    2013-01-01

    Advanced Mechatronics and MEMS Devicesdescribes state-of-the-art MEMS devices and introduces the latest technology in electrical and mechanical microsystems. The evolution of design in microfabrication, as well as emerging issues in nanomaterials, micromachining, micromanufacturing and microassembly are all discussed at length in this volume. Advanced Mechatronics also provides a reader with knowledge of MEMS sensors array, MEMS multidimensional accelerometer, artificial skin with imbedded tactile components, as well as other topics in MEMS sensors and transducers. The book also presents a number of topics in advanced robotics and an abundance of applications of MEMS in robotics, like reconfigurable modular snake robots, magnetic MEMS robots for drug delivery and flying robots with adjustable wings, to name a few. This book also: Covers the fundamentals of advanced mechatronics and MEMS devices while also presenting new state-of-the-art methodology and technology used in the application of these devices Prese...

  19. Integrated design of MEMS

    DEFF Research Database (Denmark)

    De Grave, Arnaud; Brissaud, Daniel

    2007-01-01

    Emerging technologies of Micro-Electromechanical Systems (MEMS) are applications such as airbag accelerometers. Micro-products present many physical differences from macro-products. Moreover, there is a high level of integration in multiple fields of physics with strongly coupled effects...... industrial immersion to propose a socio-technological description of the design process and MEMS design tools....

  20. On applicability of crack shape characterization rules for multiple in-plane surface cracks

    International Nuclear Information System (INIS)

    Kim, Jong Min; Choi, Suhn; Park, Keun Bae; Choi, Jae Boong; Huh, Nam Su

    2009-01-01

    The fracture mechanics assessment parameters, such as the elastic stress intensity factor and the elastic-plastic J-integral, for a surface crack can be significantly affected by adjacent cracks. Regarding such an interaction effect, the relative distance between adjacent cracks, crack aspect ratio and loading condition were known to be important factors for multiple cracks, which affects the fracture mechanics assessment parameters. Although several guidance (ASME Sec. XI, BS7910, British Energy R6 and API RP579) on a crack interaction effect (crack combination rule) have been proposed and used for assessing the interaction effect, each guidance provides different rules for combining multiple surface cracks into a single surface crack. Based on the systematic elastic and elastic-plastic finite element analyses, the present study investigated the acceptability of the crack combination rules provided in the existing guidance, and the relevant recommendations on a crack interaction for in-plane surface cracks in a plate were discussed. To quantify the interaction effect, the elastic stress intensity factor and elastic-plastic J-integral along the crack front were used. As for the loading condition, only axial tension was considered. As a result, BS7910 seems to provide the most relevant crack combination rule for in-plane dual surface cracks, whereas API RP579 provides the most conservative results. In particular, ASME Sec. XI still seems to have some room for a revision to shorten the critical distance between two adjacent cracks for a crack combination. The overall tendency of the elastic-plastic analyses results is identical to that of the elastic analyses results.

  1. Spray-coatable negative photoresist for high topography MEMS applications

    International Nuclear Information System (INIS)

    Arnold, Markus; Haas, Sven; Schwenzer, Falk; Schwenzer, Gunther; Reuter, Danny; Geßner, Thomas; Voigt, Anja; Gruetzner, Gabi

    2017-01-01

    In microsystem technology, the lithographical processing of substrates with a topography is very important. Interconnecting lines, which are routed over sloped topography sidewalls from the top of the protecting wafer to the contact pads of the device wafer, are one example of patterning over a topography. For structuring such circuit paths, a photolithography process, and therefore a process for homogeneous photoresist coating, is required. The most flexible and advantageous way of depositing a homogeneous photoresist film over structures with high topography steps is spray-coating. As a pattern transfer process for circuit paths in cavities, the lift-off process is widely used. A negative resist, like ma-N (MRT) or AZnLOF (AZ) is favoured for lift-off processes due to the existing negative angle of the sidewalls. Only a few sprayable negative photoresists are commercially available. In this paper, the development of a novel negative resist spray-coating based on a commercially available single-layer lift-off resist for spin-coating, especially for the patterning of structures inside the cavity and on the cavity wall, is presented. A variety of parameters influences the spray-coating process, and therefore the patterning results. Besides the spray-coating tool and the parameters, the composition of the resist solution itself also influences the coating results. For homogeneous resist coverage over the topography of the substrate, different solvent combinations for diluting the resist solution, different chuck temperatures during the coating process, and also the softbake conditions, are all investigated. The solvent formulations and the process conditions are optimized with respect to the homogeneity of the resist coverage on the top edge of the cavities. Finally, the developed spray-coating process, the resist material and the process stability are demonstrated by the following applications: (i) lift-off, (ii) electroplating, (iii) the wet and (iv) the dry

  2. Thick and low-stress PECVD amorphous silicon for MEMS applications

    International Nuclear Information System (INIS)

    Iliescu, Ciprian; Chen Bangtao

    2008-01-01

    This paper presents a solution for the deposition of thick amorphous silicon (α-Si:H) in PECVD reactors for MEMS applications, such as sacrificial layer or mask layer for dry or wet etching of glass. This achievement was possible by tuning the deposition parameters to a 'zero' value of the residual stress in the α-Si:H layer. The influence of the process parameters, such as power, frequency mode, temperature, pressure and SiH 4 /Ar flow rates for tuning the residual stress and for a good deposition rate is analyzed. The deposition of low-stress and thick (more than 12 µm in our case) α-Si:H layers was possible without generation of hillock defects (previously reported in literature for layers thicker then 2 µm). Finally, the paper presents some MEMS applications of such a deposited α-Si:H layer: masking layer for deep wet etching as well as dry etching of glass, and sacrificial layer for dry or wet release

  3. 5 V Compatible Two-Axis PZT Driven MEMS Scanning Mirror with Mechanical Leverage Structure for Miniature LiDAR Application.

    Science.gov (United States)

    Ye, Liangchen; Zhang, Gaofei; You, Zheng

    2017-03-05

    The MEMS (Micro-Electronical Mechanical System) scanning mirror is an optical MEMS device that can scan laser beams across one or two dimensions. MEMS scanning mirrors can be applied in a variety of applications, such as laser display, bio-medical imaging and Light Detection and Ranging (LiDAR). These commercial applications have recently created a great demand for low-driving-voltage and low-power MEMS mirrors. However, no reported two-axis MEMS scanning mirror is available for usage in a universal supplying voltage such as 5 V. In this paper, we present an ultra-low voltage driven two-axis MEMS scanning mirror which is 5 V compatible. In order to realize low voltage and low power, a two-axis MEMS scanning mirror with mechanical leverage driven by PZT (Lead zirconate titanate) ceramic is designed, modeled, fabricated and characterized. To further decrease the power of the MEMS scanning mirror, a new method of impedance matching for PZT ceramic driven by a two-frequency mixed signal is established. As experimental results show, this MEMS scanning mirror reaches a two-axis scanning angle of 41.9° × 40.3° at a total driving voltage of 4.2 Vpp and total power of 16 mW. The effective diameter of reflection of the mirror is 2 mm and the operating frequencies of two-axis scanning are 947.51 Hz and 1464.66 Hz, respectively.

  4. Design of Diaphragm Based MEMS Pressure Sensor with Sensitivity Analysis for Environmental Applications

    Directory of Open Access Journals (Sweden)

    A. Nallathambi

    2015-05-01

    Full Text Available In this paper Micro-electromechanical System (MEMS diaphragm based pressure sensor for environmental applications is discussed. The main focus of this paper is to design, simulate and analyze the sensitivity of MEMS based diaphragm using different structures to measure the low and high pressure values. The simulation is done through the finite element tool and specifications related the maximum convinced stress; deflection and sensitivity of the diaphragms have been analyzed using the software INTELLISUITE 8.7v. The change in pressure is to bending of the diaphragm that modifies the measured displacement between the substrate and the diaphragm. This change in displacement gives the measure of the pressure in that environment. The design of these studies can be used to improve the sensitivity of these devices. Here the diaphragm based pressure sensor produced better displacement, sensitivity and stress output responses are obtained from the square diaphragm. The pressure range from 0.6 MPa to 25 MPa and its maximum displacement is accordingly 59 mm over a pressure range of 0 to 2 MPa. Its sensitivity is therefore 2.35 [10E-12/Pa].

  5. Flexible-CMOS and biocompatible piezoelectric AlN material for MEMS applications

    International Nuclear Information System (INIS)

    Jackson, Nathan; Keeney, Lynette; Mathewson, Alan

    2013-01-01

    The development of a CMOS compatible flexible piezoelectric material is desired for numerous applications and in particular for biomedical MEMS devices. Aluminum nitride (AlN) is the most commonly used CMOS compatible piezoelectric material, which is typically deposited on Si in order to enhance the c-axis (002) crystal orientation which gives AlN its high piezoelectric properties. This paper reports on the successful deposition of AlN on polyimide (PI-2611) material. The AlN deposited has a FWHM (002) value of 5.1° and a piezoelectric d 33 value of 1.12 pm V −1 , and SEM images show high quality columnar grains. The highly crystalline AlN material is due to the semi-crystalline properties of the polyimide film used. Cytotoxicity testing showed the AlN/polyimide material to be non-toxic to 3T3 cells and primary neurons. Surface properties of the AlN/polyimide film were evaluated as they have a significant effect on the adhesion of cells to the film. The results show neurons adhering to the AlN surface. The results of this paper show the characterization of a new flexible-CMOS and biocompatible AlN/polyimide material for MEMS devices with improved crystallinity and piezoelectric properties. (paper)

  6. Tailoring design and fabrication of capacitive RF MEMS switches for K-band applications

    Science.gov (United States)

    Quaranta, Fabio; Persano, Anna; Capoccia, Giovanni; Taurino, Antonietta; Cola, Adriano; Siciliano, Pietro; Lucibello, Andrea; Marcelli, Romolo; Proietti, Emanuela; Bagolini, Alvise; Margesin, Benno; Bellutti, Pierluigi; Iannacci, Jacopo

    2015-05-01

    Shunt capacitive radio-frequency microelectromechanical (RF MEMS) switches were modelled, fabricated and characterized in the K-band domain. Design allowed to predict the RF behaviour of the switches as a function of the bridge geometric parameters. The modelled switches were fabricated on silicon substrate, using a surface micromachining approach. In addition to the geometric parameters, the material structure in the bridge-actuator area was modified for switches fabricated on the same wafer, thanks to the removal/addition of two technological steps of crucial importance for RF MEMS switches performance, which are the use of the sacrificial layer and the deposition of a floating metal layer on the actuator. Surface profilometry analysis was used to check the material layer structure in the different regions of the bridge area as well as to investigate the mechanical behaviour of the moveable bridge under the application of a loaded force. The RF behaviour of all the fabricated switches was measured, observing the impact on the isolation of the manipulation of the bridge size and of the variations in the fabrication process.

  7. Nanotechnology: MEMS and NEMS and their applications to smart systems and devices

    Science.gov (United States)

    Varadan, Vijay K.

    2003-10-01

    civil strutures and food and medical industries. This unique combination of technologies also results in novel conformal sensors that can be remotely sensed by an antenna system with the advantage of no power requirements at the sensor site. This paper provides a brief review of MEMS and NEMS based smart systems for various applications mentioned above. Carbon Nano Tubes (CNT) with their unique structure, have already proven to be valuable in their application as tips for scanning probe microscopy, field emission devices, nanoelectronics, H2-storage, electromagnetic absorbers, ESD, EMI films and coatings and structural composites. For many of these applications, highly purified and functionalized CNT which are compatible with many host polymers are needed. A novel microwave CVD processing technique to meet these requirements has been developed at Penn State Center for the Engineering of Electronic and Acoustic Materials and Devices (CEEAMD). This method enables the production of highly purified carbon nano tubes with variable size (from 5 - 40 nm) at low cost (per gram) and high yield. Whereas, carbon nano tubes synthesized using the laser ablation or arc discharge evaporation method always include impurity due to catalyst or catalyst support. The Penn State research is based on the use of zeolites over other metal/metal oxides in the microwave field for a high production and uniformity of the product. An extended coventional purification method has been employed to purify our products in order to remove left over impurity. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composites will be presented.

  8. EDITORIAL: International MEMS Conference 2006

    Science.gov (United States)

    Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian

    2006-04-01

    The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can

  9. EDITORIAL: The Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004)

    Science.gov (United States)

    Tanaka, Shuji; Toriyama, Toshiyuki

    2005-09-01

    This special issue of the Journal of Micromechanics and Microengineering features papers selected from the Fourth International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2004). The workshop was held in Kyoto, Japan, on 28-30 November 2004, by The Ritsumeikan Research Institute of Micro System Technology in cooperation with The Global Emerging Technology Institute, The Institute of Electrical Engineers of Japan, The Sensors and Micromachines Society, The Micromachine Center and The Kyoto Nanotech Cluster. Power MEMS is one of the newest categories of MEMS, which encompasses microdevices and microsystems for power generation, energy conversion and propulsion. The first concept of power MEMS was proposed in the late 1990s by Epstein's group at the Massachusetts Institute of Technology, where they continue to study MEMS-based gas turbine generators. Since then, the research and development of power MEMS have been promoted by the need for compact power sources with high energy and power density. Since its inception, power MEMS has expanded to include not only various MEMS-based power generators but also small energy machines and microdevices for macro power generators. At the last workshop, various devices and systems, such as portable fuel cells and their peripherals, micro and small turbo machinery, energy harvesting microdevices, and microthrusters, were presented. Their power levels vary from ten nanowatts to hundreds of watts, spanning ten orders of magnitude. The first PowerMEMS workshop was held in 2000 in Sendai, Japan, and consisted of only seven invited presentations. The workshop has grown since then, and in 2004 there were 5 invited, 20 oral and 29 poster presentations. From the 54 papers in the proceedings, 12 papers have been selected for this special issue. I would like to express my appreciation to the members of the Organizing Committee and Technical Program Committee. This special issue was

  10. On the application of cohesive crack modeling in cementitious materials

    DEFF Research Database (Denmark)

    Stang, Henrik; Olesen, John Forbes; Poulsen, Peter Noe

    2007-01-01

    typically for multi scale problems such as crack propagation in fiber reinforced composites. Mortar and concrete, however, are multi-scale materials and the question naturally arises, if bridged crack models in fact are more suitable for concrete and mortar as well? In trying to answer this question a model......Cohesive crack models-in particular the Fictitious Crack Model - are applied routinely in the analysis of crack propagation in concrete and mortar. Bridged crack models-where cohesive stresses are assumed to exist together with a stress singularity at the crack tip-on the other hand, are used...

  11. Fabrication and performance analysis of MEMS-based Variable Emissivity Radiator for Space Applications

    International Nuclear Information System (INIS)

    Lee, Changwook; Oh, Hyung-Ung; Kim, Taegyu

    2014-01-01

    All Louver was typically representative as the thermal control device. The louver was not suitable to be applied to small satellite, because it has the disadvantage of increase in weight and volume. So MEMS-based variable radiator was developed to support the disadvantage of the louver MEMS-based variable emissivity radiator was designed for satellite thermal control. Because of its immediate response and low power consumption. Also MEMS- based variable emissivity radiator has been made smaller by using MEMS process, it could be solved the problem of the increase in weight and volume, and it has a high reliability and immediate response by using electrical control. In this study, operation validation of the MEMS radiator had been carried out, resulting that emissivity could be controlled. Numerical model was also designed to predict the thermal control performance of MEMS-based variable emissivity radiator

  12. Design and fabrication of non silicon substrate based MEMS energy harvester for arbitrary surface applications

    Energy Technology Data Exchange (ETDEWEB)

    Balpande, Suresh S., E-mail: balpandes@rknec.edu [Ph.D.. Scholar, Department of Electronics Engineering Shri Ramdeobaba College of Engineering & Management, Nagpur-13, (M.S.) (India); Pande, Rajesh S. [Professor, Department of Electronics Engineering Shri Ramdeobaba College of Engineering & Management, Nagpur-13, (M.S.) (India)

    2016-04-13

    Internet of Things (IoT) uses MEMS sensor nodes and actuators to sense and control objects through Internet. IOT deploys millions of chemical battery driven sensors at different locations which are not reliable many times because of frequent requirement of charging & battery replacement in case of underground laying, placement at harsh environmental conditions, huge count and difference between demand (24 % per year) and availability (energy density growing rate 8% per year). Energy harvester fabricated on silicon wafers have been widely used in manufacturing MEMS structures. These devices require complex fabrication processes, costly chemicals & clean room. In addition to this silicon wafer based devices are not suitable for curved surfaces like pipes, human bodies, organisms, or other arbitrary surface like clothes, structure surfaces which does not have flat and smooth surface always. Therefore, devices based on rigid silicon wafers are not suitable for these applications. Flexible structures are the key solution for this problems. Energy transduction mechanism generates power from free surrounding vibrations or impact. Sensor nodes application has been purposefully selected due to discrete power requirement at low duty cycle. Such nodes require an average power budget in the range of about 0.1 microwatt to 1 mW over a period of 3-5 seconds. Energy harvester is the best alternate source in contrast with battery for sensor node application. Novel design of Energy Harvester based on cheapest flexible non silicon substrate i.e. cellulose acetate substrate have been modeled, simulated and analyzed on COMSOL multiphysics and fabricated using sol-gel spin coating setup. Single cantilever based harvester generates 60-75 mV peak electric potential at 22Hz frequency and approximately 22 µW power at 1K-Ohm load. Cantilever array can be employed for generating higher voltage by replicating this structure. This work covers design, optimization, fabrication of

  13. Design and fabrication of non silicon substrate based MEMS energy harvester for arbitrary surface applications

    Science.gov (United States)

    Balpande, Suresh S.; Pande, Rajesh S.

    2016-04-01

    Internet of Things (IoT) uses MEMS sensor nodes and actuators to sense and control objects through Internet. IOT deploys millions of chemical battery driven sensors at different locations which are not reliable many times because of frequent requirement of charging & battery replacement in case of underground laying, placement at harsh environmental conditions, huge count and difference between demand (24 % per year) and availability (energy density growing rate 8% per year). Energy harvester fabricated on silicon wafers have been widely used in manufacturing MEMS structures. These devices require complex fabrication processes, costly chemicals & clean room. In addition to this silicon wafer based devices are not suitable for curved surfaces like pipes, human bodies, organisms, or other arbitrary surface like clothes, structure surfaces which does not have flat and smooth surface always. Therefore, devices based on rigid silicon wafers are not suitable for these applications. Flexible structures are the key solution for this problems. Energy transduction mechanism generates power from free surrounding vibrations or impact. Sensor nodes application has been purposefully selected due to discrete power requirement at low duty cycle. Such nodes require an average power budget in the range of about 0.1 microwatt to 1 mW over a period of 3-5 seconds. Energy harvester is the best alternate source in contrast with battery for sensor node application. Novel design of Energy Harvester based on cheapest flexible non silicon substrate i.e. cellulose acetate substrate have been modeled, simulated and analyzed on COMSOL multiphysics and fabricated using sol-gel spin coating setup. Single cantilever based harvester generates 60-75 mV peak electric potential at 22Hz frequency and approximately 22 µW power at 1K-Ohm load. Cantilever array can be employed for generating higher voltage by replicating this structure. This work covers design, optimization, fabrication of harvester and

  14. Design and fabrication of non silicon substrate based MEMS energy harvester for arbitrary surface applications

    International Nuclear Information System (INIS)

    Balpande, Suresh S.; Pande, Rajesh S.

    2016-01-01

    Internet of Things (IoT) uses MEMS sensor nodes and actuators to sense and control objects through Internet. IOT deploys millions of chemical battery driven sensors at different locations which are not reliable many times because of frequent requirement of charging & battery replacement in case of underground laying, placement at harsh environmental conditions, huge count and difference between demand (24 % per year) and availability (energy density growing rate 8% per year). Energy harvester fabricated on silicon wafers have been widely used in manufacturing MEMS structures. These devices require complex fabrication processes, costly chemicals & clean room. In addition to this silicon wafer based devices are not suitable for curved surfaces like pipes, human bodies, organisms, or other arbitrary surface like clothes, structure surfaces which does not have flat and smooth surface always. Therefore, devices based on rigid silicon wafers are not suitable for these applications. Flexible structures are the key solution for this problems. Energy transduction mechanism generates power from free surrounding vibrations or impact. Sensor nodes application has been purposefully selected due to discrete power requirement at low duty cycle. Such nodes require an average power budget in the range of about 0.1 microwatt to 1 mW over a period of 3-5 seconds. Energy harvester is the best alternate source in contrast with battery for sensor node application. Novel design of Energy Harvester based on cheapest flexible non silicon substrate i.e. cellulose acetate substrate have been modeled, simulated and analyzed on COMSOL multiphysics and fabricated using sol-gel spin coating setup. Single cantilever based harvester generates 60-75 mV peak electric potential at 22Hz frequency and approximately 22 µW power at 1K-Ohm load. Cantilever array can be employed for generating higher voltage by replicating this structure. This work covers design, optimization, fabrication of

  15. N-type doped nano-diamond in a first MEMS application

    Energy Technology Data Exchange (ETDEWEB)

    Dipalo, M.; Kusterer, J.; Janischowsky, K.; Kohn, E. [Dept. of Electron Devices and Circuits, University of Ulm, Albert Einstein Allee 45, 89081 Ulm (Germany)

    2006-09-15

    Nanocrystalline diamond is an interesting material for MEMS applications especially due to its outstanding mechanical, electrical and electrochemical properties. The current choice for doping is boron, resulting in p-type conduction. It has two difficulties: firstly, at high concentration (as needed for full activation) the lattice becomes highly stressed and may degrade the material's quality. Secondly, it contaminates the growth chamber, resulting in a memory effect. A recent alternative is n-type nitrogen doping, avoiding these disadvantages. However, nitrogen is mainly incorporated in the grain boundaries and thus inhomogeneously distributed. In turn this may limit the material's stability. Here we present a first trial to use nitrogen-doped nanocrystalline diamond (NCD), grown by hot filament CVD, in a water microjet as heater element. No stability problems were encountered even at high overdrive power. (copyright 2006 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  16. RF-MEMS Technology for High-Performance Passives; The challenge of 5G mobile applications

    Science.gov (United States)

    Iannacci, Jacopo

    2017-11-01

    Commencing with a review of the characteristics of RF-MEMS in relation to 5G, the book proceeds to develop practical insight concerning the design and development of RF-MEMS including case studies of design concepts. Including multiphysics simulation and animated figures, the book will be essential reading for both academic and industrial researchers and engineers.

  17. Power gating of VLSI circuits using MEMS switches in low power applications

    KAUST Repository

    Shobak, Hosam; Ghoneim, Mohamed T.; El Boghdady, Nawal; Halawa, Sarah; Iskander, Sophinese M.; Anis, Mohab H.

    2011-01-01

    -designed MEMS switch to power gate VLSI circuits, such that leakage power is efficiently reduced while accounting for performance and reliability. The designed MEMS switch is characterized by an 0.1876 ? ON resistance and requires 4.5 V to switch. As a result

  18. Characterization of low temperature deposited atomic layer deposition TiO2 for MEMS applications

    NARCIS (Netherlands)

    Huang, Y.; Pandraud, G.; Sarro, P.M.

    2012-01-01

    TiO2 is an interesting and promising material for micro-/nanoelectromechanical systems (MEMS/NEMS). For high performance and reliable MEMS/NEMS, optimization of the optical characteristics, mechanical stress, and especially surface smoothness of TiO2 is required. To overcome the roughness issue of

  19. DLC nano-dot surfaces for tribological applications in MEMS devices

    International Nuclear Information System (INIS)

    Singh, R. Arvind; Na, Kyounghwan; Yi, Jin Woo; Lee, Kwang-Ryeol; Yoon, Eui-Sung

    2011-01-01

    With the invention of miniaturized devices like micro-electro-mechanical systems (MEMS), tribological studies at micro/nano-scale have gained importance. These studies are directed towards understanding the interactions between surfaces at micro/nano-scales, under relative motion. In MEMS devices, the critical forces, namely adhesion and friction restrict the smooth operation of the elements that are in relative motion. These miniaturized devices are traditionally made from silicon (Si), whose tribological properties are not good. In this paper, we present a short investigation of nano- and micro-tribological properties of diamond-like carbon (DLC) nano-dot surfaces. The investigation was undertaken to evaluate the potential of these surfaces for their possible application to the miniaturized devices. The tribological evaluation of the DLC nano-dot surfaces was done in comparison with bare Si (1 0 0) surfaces and DLC coated silicon surfaces. A commercial atomic force microscope (AFM) was used to measure adhesion and friction properties of the test materials at the nano-scale, whereas a custom-built micro-tribotester was used to measure their micro-friction property. Results showed that the DLC nano-dot surfaces exhibited superior tribological properties with the lowest values of adhesion force, and friction force both at the nano- and micro-scales, when compared to the bare Si (1 0 0) surfaces and DLC coated silicon surfaces. In addition, the DLC nano-dot surfaces showed no observable wear at the micro-scale, unlike the other two test materials. The superior tribological performance of the DLC nano-dot surfaces is attributed to their hydrophobic nature and the reduced area of contact projected by them.

  20. DLC nano-dot surfaces for tribological applications in MEMS devices

    Energy Technology Data Exchange (ETDEWEB)

    Singh, R. Arvind; Na, Kyounghwan [Nano-Bio Research Center, Korea Institute of Science and Technology, 39-1, Hawolgok-dong, Seongbuk-gu, Seoul 136-791 (Korea, Republic of); Yi, Jin Woo; Lee, Kwang-Ryeol [Computational Science Center, Korea Institute of Science and Technology, 39-1, Hawolgok-dong, Seongbuk-gu, Seoul 136-791 (Korea, Republic of); Yoon, Eui-Sung, E-mail: esyoon@kist.re.kr [Nano-Bio Research Center, Korea Institute of Science and Technology, 39-1, Hawolgok-dong, Seongbuk-gu, Seoul 136-791 (Korea, Republic of)

    2011-02-01

    With the invention of miniaturized devices like micro-electro-mechanical systems (MEMS), tribological studies at micro/nano-scale have gained importance. These studies are directed towards understanding the interactions between surfaces at micro/nano-scales, under relative motion. In MEMS devices, the critical forces, namely adhesion and friction restrict the smooth operation of the elements that are in relative motion. These miniaturized devices are traditionally made from silicon (Si), whose tribological properties are not good. In this paper, we present a short investigation of nano- and micro-tribological properties of diamond-like carbon (DLC) nano-dot surfaces. The investigation was undertaken to evaluate the potential of these surfaces for their possible application to the miniaturized devices. The tribological evaluation of the DLC nano-dot surfaces was done in comparison with bare Si (1 0 0) surfaces and DLC coated silicon surfaces. A commercial atomic force microscope (AFM) was used to measure adhesion and friction properties of the test materials at the nano-scale, whereas a custom-built micro-tribotester was used to measure their micro-friction property. Results showed that the DLC nano-dot surfaces exhibited superior tribological properties with the lowest values of adhesion force, and friction force both at the nano- and micro-scales, when compared to the bare Si (1 0 0) surfaces and DLC coated silicon surfaces. In addition, the DLC nano-dot surfaces showed no observable wear at the micro-scale, unlike the other two test materials. The superior tribological performance of the DLC nano-dot surfaces is attributed to their hydrophobic nature and the reduced area of contact projected by them.

  1. Probability of crack-initiation and application to NDE

    Energy Technology Data Exchange (ETDEWEB)

    Prantl, G [Nuclear Safety Inspectorate HSK, (Switzerland)

    1988-12-31

    Fracture toughness is a property with a certain variability. When a statistical distribution is assumed, the probability of crack initiation may be calculated for a given problem defined by its geometry and the applied stress. Experiments have shown, that cracks which experience a certain small amount of ductile growth can reliably be detected by acoustic emission measurements. The probability of crack detection by AE-techniques may be estimated using this experimental finding and the calculated probability of crack initiation. (author).

  2. A liquid crystal polymer membrane MEMS sensor for flow rate and flow direction sensing applications

    International Nuclear Information System (INIS)

    Kottapalli, A G P; Tan, C W; Olfatnia, M; Miao, J M; Barbastathis, G; Triantafyllou, M

    2011-01-01

    The paper reports the design, fabrication and experimental results of a liquid crystal polymer (LCP) membrane-based pressure sensor for flow rate and flow direction sensing applications. Elaborate experimental testing results demonstrating the sensors' performance as an airflow sensor have been illustrated and validated with theory. MEMS sensors using LCP as a membrane structural material show higher sensitivity and reliability over silicon counterparts. The developed device is highly robust for harsh environment applications such as atmospheric wind flow monitoring and underwater flow sensing. A simple, low-cost and repeatable fabrication scheme has been developed employing low temperatures. The main features of the sensor developed in this work are a LCP membrane with integrated thin film gold piezoresistors deposited on it. The sensor developed demonstrates a good sensitivity of 3.695 mV (ms −1 ) −1 , large operating range (0.1 to >10 ms −1 ) and good accuracy in measuring airflow with an average error of only 3.6% full-scale in comparison with theory. Various feasible applications of the developed sensor have been demonstrated with experimental results. The sensor was tested for two other applications—in clinical diagnosis for breath rate, breath velocity monitoring, and in underwater applications for object detection by sensing near-field spatial flow pressure

  3. PREFACE: 14th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2014)

    Science.gov (United States)

    2014-11-01

    It is our great pleasure to welcome you to the 14th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications, or PowerMEMS 2014, in Awaji Island, Japan. The aim of PowerMEM is to present the latest research results in the field of miniature, micro- and nano-scale technologies for power generation and energy conversion. The conference will also- give us the opportunity to exchange informations and new ideas in the field of Power MEMS/NEMS. The current status of the field of PowerMEMS spans the full spectrum from basic research to practical applications. We will enjoy valuable discussions not only from the viewpoint of academia but from commercial and industrial perspectives. In the conference, three invited speakers lead the technical program. We received 172 abstracts and after a careful reviewing process by the Technical Program Committee a total of 133 papers were selected for presentation. These have been organized into 16 Oral sessions in two parallel streams and two poster sessions including some late-news papers. The oral and regular poster papers are published by the Institute of Physics (IOP). We have also organized a PowerMEMS School in Kobe-Sannomiya contiguous to the main conference. This two-day school will cover various topics of energy harvesting. World leading experts will give invited lectures on their main topics. This is a new experiment to broaden the technology remit of our conference by organizing mini symposiums that aim to gather the latest research on the following topics by the organizers: Microscale Combustion, Wideband Vibration Energy Harvesting, RF Energy Transfer and Industrial Application. We hope this, and other activities will make PowerMEMS2014 a memorable success. One of the important programs in an international conference is the social program, and we prepare the PowerMEMS2014 banquet in the banquet room at the Westin Awaji Island Hotel. This will provide an opportunity to

  4. Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplates

    KAUST Repository

    Lizardo, Ernesto B.

    2013-01-01

    Micro-electro-mechanical systems (MEMS) became possible thanks to the silicon based technology used to fabricate integrated circuits. Originally, MEMS fabrication was limited to silicon based techniques and materials, but the expansion of MEMS

  5. Application of the cracked pipe element to creep crack growth prediction

    Energy Technology Data Exchange (ETDEWEB)

    Brochard, J.; Charras, T.

    1997-04-01

    The modification of a computer code for leak before break analysis is very briefly described. The CASTEM2000 code was developed for ductile fracture assessment of piping systems with postulated circumferential through-wall cracks under static or dynamic loading. The modification extends the capabilities of the cracked pipe element to the determination of fracture parameters under creep conditions (C*, {phi}c and {Delta}c). The model has the advantage of evaluating significant secondary effects, such as those from thermal loading.

  6. Hollow MEMS

    DEFF Research Database (Denmark)

    Larsen, Peter Emil

    Miniaturization of electro mechanical sensor systems to the micro range and beyond has shown impressive sensitivities measuring sample properties like mass, viscosity, acceleration, pressure and force just to name a few applications. In order to enable these kinds of measurements on liquid samples...... a hollow MEMS sensor has been designed, fabricated and tested. Combined density, viscosity, buoyant mass spectrometry and IR absorption spectroscopy are possible on liquid samples and micron sized suspended particles (e.g. single cells). Measurements are based on changes in the resonant behavior...... of these sensors. Optimization of the microfabrication process has led to a process yield of almost 100% .This is achieved despite the fact, that the process still offers a high degree of flexibility. By simple modifications the Sensor shape can be optimized for different size ranges and sensitivities...

  7. Some metal oxides and their applications for creation of Microsystems (MEMS) and Energy Harvesting Devices (EHD)

    International Nuclear Information System (INIS)

    Denishev, K

    2016-01-01

    This is a review of a part of the work of the Technological Design Group at Technical University of Sofia, Faculty of Electronic Engineering and Technologies, Department of Microelectronics. It is dealing with piezoelectric polymer materials and their application in different microsystems (MEMS) and Energy Harvesting Devices (EHD), some organic materials and their applications in organic (OLED) displays, some transparent conductive materials etc. The metal oxides Lead Zirconium Titanate (PZT) and Zinc Oxide (ZnO) are used as piezoelectric layers - driving part of different sensors, actuators and EHD. These materials are studied in term of their performance in dependence on the deposition conditions and parameters. They were deposited as thin films by using RF Sputtering System. As technological substrates, glass plates and Polyethylenetherephtalate (PET) foils were used. For characterization of the materials, a test structure, based on Surface Acoustic Waves (SAW), was designed and prepared. The layers were characterized by Fourier Transform Infrared spectroscopy (FTIR). The piezoelectric response was tested at variety of mechanical loads (tensile strain, stress) in static and dynamic (multiple bending) mode. The single-layered and double-layered structures were prepared for piezoelectric efficiency increase. A structure of piezoelectric energy transformer is proposed and investigated. (paper)

  8. A MEMS electret generator with electrostatic levitation for vibration-driven energy-harvesting applications

    International Nuclear Information System (INIS)

    Suzuki, Yuji; Miki, Daigo; Edamoto, Masato; Honzumi, Makoto

    2010-01-01

    In this paper, we propose a passive gap-spacing control method in order to avoid stiction between top and bottom structures in in-plane sensor/actuator/generator applications. A patterned electret using a high-performance perfluoro polymer material is employed to induce a repulsive electrostatic force. An out-of-plane repulsive force is successfully demonstrated with our early prototype, in both air and liquid. By using the present electret-based levitation method to keep the air gap, a MEMS electret generator has been developed for energy-harvesting applications. A dual-phase electrode arrangement is adopted in order to reduce the horizontal electrostatic damping force. With the present prototype, about 0.5 µW is obtained for both phases of the generator, resulting in a total power output of 1.0 µW at an acceleration of 2 g with 63 Hz. With our electromechanical model of the generator, we have confirmed that the model can mimic the response of the generator prototype

  9. A low-noise MEMS accelerometer for unattended ground sensor applications

    Science.gov (United States)

    Speller, Kevin E.; Yu, Duli

    2004-09-01

    A low-noise micro-machined servo accelerometer has been developed for use in Unattended Ground Sensors (UGS). Compared to conventional coil-and-magnet based velocity transducers, this Micro-Electro-Mechanical System (MEMS) accelerometer offers several key benefits for battlefield monitoring. Many UGS require a compass to determine deployment orientation with respect to magnetic North. This orientation information is critical for determining the bearing of incoming signals. Conventional sensors with sensing technology based on a permanent magnet can cause interference with a compass when used in close proximity. This problem is solved with a MEMS accelerometer which does not require any magnetic materials. Frequency information below 10 Hz is valuable for identification of signal sources. Conventional seismometers used in UGS are typically limited in frequency response from 20 to 200 Hz. The MEMS accelerometer has a flat frequency response from DC to 5 kHz. The wider spectrum of signals received improves detection, classification and monitoring on the battlefield. The DC-coupled output of the MEMS accelerometer also has the added benefit of providing tilt orientation data for the deployed UGS. Other performance parameters of the MEMS accelerometer that are important to UGS such as size, weight, shock survivability, phase response, distortion, and cross-axis rejection will be discussed. Additionally, field test data from human footsteps recorded with the MEMS accelerometer will be presented.

  10. Numerical Simulation of a Novel Electroosmotic Micropump for Bio-MEMS Applications

    Directory of Open Access Journals (Sweden)

    Alireza Alishahi

    2014-12-01

    Full Text Available High lamination in microchannel is one of the main challenges in Lab-On-a-Chip’s components like micro total analyzer systems and any miniaturization of fluid channels intensify the viscose effects. In chip-scale, the electroosmotic flow is more efficient. Therefore, this study presents a MEMS-based low-voltage micropump for low-conductive biological samples and solutions, where twelve narrow miniaturized microchannels designed in one unit to efficiently using the electroosmotic effects which generated near the walls. Four microelectrodes are mounted in lateral sides of the microchannel and excited by low-voltage potential to generate pumping process inside the channel. We sweep the voltage amplitude and a linear variation of fluid velocity achieved by Finite-Element-Method (FEM simulation. We obtain a net average velocity of 0.1 mm/s; by applying 2 V and -2 V to the electrodes. Therefore, the proposed low-voltage design is able to pumping the low-conductive biofluids for conventional lab-on-a-chip applications.

  11. MEMS-based micro-fuel processor for application in a cell phone

    Energy Technology Data Exchange (ETDEWEB)

    Kundu, Arunabha; Jang, Jae Hyuk; Lee, Hong Ryul; Kim, Sung-Han; Gil, Jae Hyoung; Jung, Chang Ryul; Oh, Yong Soo [Micro-Fuel Cell Team, Electro-Material and Device (eMD) Laboratory, Corporate R and D Center, Samsung Electro-Mechanics, 314 Maetan-Dong, Yeongtong-Gu, Suwon, Gyunngi-Do 443-743 (Korea, Republic of)

    2006-11-08

    The operation of a micro-electro-mechanical system (MEMS)-based micro-reformer was investigated for application in a cell phone. Different aspects like the time required to attain the desired temperature of the system, the time required to get the required hydrogen flow, catalyst durability, flow uniformity of the mixture of methanol and water and volume of the total system were considered. A loading procedure for the catalyst in the micro-reformer was developed. Catalyst deactivation was observed after operating continuously for 8h, but it regained its original activity after the reformer was shut down for at least 2h. The deactivation of the catalyst was analyzed by catalyst characterization. The comparison of the performance between a parallel channeled and serpentine channeled micro-reformer was carried out. The performance with the serpentine channeled micro-reformer was always higher than with parallel channeled micro-reformer. The shorter residence time in the parallel-channeled micro-reformer may be one of the reasons behind its low activity. (author)

  12. Humidity influence on the adhesion of SU-8 polymer from MEMS applications

    Directory of Open Access Journals (Sweden)

    Birleanu Corina

    2017-01-01

    Full Text Available In this paper, the adhesion behaviors of SU-8 polymer thin film from MEMS application were investigated as a function of relative humidity. The adhesion test between the AFM tip and SU-8 polymer have been extensively studied using the atomic force microscope (AFM, for a relative humidity (RH varying between 20 and 90%. The samples for tests are SU-8 polymers hard baked at different temperatures. The hard bake temperature changes the tribo-mechanical properties of polymers. The paper reports the measurements and the modeling of adhesion forces versus humidity in controlled ranges between 20 to 90%RH. To investigate the effect of relative humidity on adhesion for SU-8 polymer hard baked we used an analytical method which encompasses the effect of capillarity as well as the solid-to-solid interaction. While the capillary force expression is considered to be the sum of the superficial tension and the Laplace force for the solid-solid interaction is expressed by the Derjagin, Muller and Toropov (DMT model of solids adhesion. The analytical results obtained are in accordance with those obtained experimentally.

  13. Aluminum Nitride Micro-Channels Grown via Metal Organic Vapor Phase Epitaxy for MEMs Applications

    Energy Technology Data Exchange (ETDEWEB)

    Rodak, L.E.; Kuchibhatla, S.; Famouri, P.; Ting, L.; Korakakis, D.

    2008-01-01

    Aluminum nitride (AlN) is a promising material for a number of applications due to its temperature and chemical stability. Furthermore, AlN maintains its piezoelectric properties at higher temperatures than more commonly used materials, such as Lead Zirconate Titanate (PZT) [1, 2], making AlN attractive for high temperature micro and nanoelectromechanical (MEMs and NEMs) applications including, but not limited to, high temperature sensors and actuators, micro-channels for fuel cell applications, and micromechanical resonators. This work presents a novel AlN micro-channel fabrication technique using Metal Organic Vapor Phase Epitaxy (MOVPE). AlN easily nucleates on dielectric surfaces due to the large sticking coefficient and short diffusion length of the aluminum species resulting in a high quality polycrystalline growth on typical mask materials, such as silicon dioxide and silicon nitride [3,4]. The fabrication process introduced involves partially masking a substrate with a silicon dioxide striped pattern and then growing AlN via MOVPE simultaneously on the dielectric mask and exposed substrate. A buffered oxide etch is then used to remove the underlying silicon dioxide and leave a free standing AlN micro-channel. The width of the channel has been varied from 5 ìm to 110 ìm and the height of the air gap from 130 nm to 800 nm indicating the stability of the structure. Furthermore, this versatile process has been performed on (111) silicon, c-plane sapphire, and gallium nitride epilayers on sapphire substrates. Reflection High Energy Electron Diffraction (RHEED), Atomic Force Microscopy (AFM), and Raman measurements have been taken on channels grown on each substrate and indicate that the substrate is influencing the growth of the AlN micro-channels on the SiO2 sacrificial layer.

  14. Brutal crack propagation in dynamic fracture: industrial application to the length of the crack arrest

    International Nuclear Information System (INIS)

    Dumouchel, P.E.

    2008-03-01

    This research thesis aims at understanding and analysing some mechanisms involved in the dynamic failure under various loadings which are notably present in industrial environment, and more particularly in some parts of EDF's plants where networks of micro-cracks may steadily grow: heterogeneous zones, defects under coating. The author presents a simplified model based on the de-bonding of a film to understand the mechanisms of a sudden failure under a quasi-static loading. He develops a similar model to explore the influence of a defect on crack propagation under a quasi-static loading, and then under a sudden loading. This model is then generalized to the case of several defects, and more particularly very small defects. Finally, the author gives a numerical interpretation of a sudden propagation under quasi-static loading

  15. New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications

    International Nuclear Information System (INIS)

    Kettner, P; Pelzer, R L; Glinsner, T; Farrens, S; Lee, D

    2006-01-01

    Nanoimprint Lithography is a well-acknowledged low cost, high resolution, large area 3D patterning process for polymers. It includes the most promising methods: high pressure hot embossing (HE) and UV-Nanoimprint Lithography (UV-NIL). Curing of the imprinted structures is either done by cooling down below the glass transition temperature of the thermoplastic polymer in case of HE or by subsequent UV-light exposure and cross-linking in case of UV-NIL. Both techniques allow rapid prototyping for high volume production of fully patterned substrates for a wide range of materials. The advantages of using polymer substrates over common Micro-Electro-Mechanical Systems (MEMS) processing materials like glass, silicon or quartz are: bio-compatible surfaces, easy manufacturability, low cost for high volume production, suitable for use in micro- and nano-fabrication, low conductivity, wide range of optical properties just to name a few. We will present experimental results on HE processes with PMMA as well as UV-NIL imprints in selected UV-curable resists. In the second part of the work we will describe the bonding techniques for packaging of the micro or nano structures. Packaging of the imprinted features is a key technology for a wide variety of field of applications: μ-TAS, biochemistry, micro-mixers, micro-reactors, electrophoresis cells, life science, micro-optical and nano-optical applications (switches) nanofluidics, data storage, etc. for features down to sub-100 nm range. Most bonding techniques for polymer use adhesives as intermediate layers. We will demonstrate a promising technique for dense and very strong bonds using plasma activation of polymers and glass. This bonding technology allows for bonding at low temperatures well below the glass transition temperature of the polymers, which will ensure that the structures are not deformed

  16. The 13th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2013)

    Science.gov (United States)

    Mitcheson, Paul; Beeby, Steve

    2013-12-01

    It is a pleasure to welcome you to The Royal Society in London and the 13th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications, or PowerMEMS 2013. The objective of PowerMEMS 2013 is to catalyse innovation in miniature, micro- and nano-scale technologies for power generation and energy conversion. The conference aims to stimulate the exchange of insights and information, and the development of new ideas in the Power MEMS/NEMS field as well as at the meso-scale. It will allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering. The technical program is led by four invited speakers covering inductive power transfer, chip scale power sources, thermal energy harvesting and implantable biofuel cells. We received 177 abstracts and following a careful reviewing process by the Technical Program Committee a total of 137 papers were selected for presentation. These have been organised into 16 oral sessions in two parallel streams and two poster sessions that have been augmented by 10 late news papers. The oral and regular poster papers are, for the first time, being published by the Institute of Physics. We have made every effort to make PowerMEMS 2013 the busiest yet and have included for the first time the PowerMEMS School. This two-day school held at Imperial College London covered a wide range of power-MEMS topics including technologies for power generation, power transmission, energy storage, power electronics interfaces and metrology. Registrations for the School exceeded our expectations and it was full by early November. We hope this, and other activities such as the Discussion Panel and the inclusion of late news papers, will make PowerMEMS 2013 a memorable success. We have also reached out to new communities, such as those working in wireless power transfer and RF harvesting to broaden the technology remit of

  17. Performance Enhancement MEMS Based INS/GPS Integrated System Implemented on a FPGA for Terrestrial Applications

    OpenAIRE

    Garcia Quinchia, Alex

    2014-01-01

    Hoy en día con el desarrollo de sensores inerciales basados en Sistemas Micro\\-electromecánicos (MEMS), podemos encontrar acelerómetros y giróscopos embebidos en diferentes dispositivos y plataformas, teniéndolos en relojes, teléfonos inteligentes, consolas de video juego hasta sistemas de navegación terrestre y vehículos aéreos no tripulados (UAVs), {\\em etc}. A pesar del amplio rango de aplicaciones donde están siendo utilizados, los sensores inerciales de bajo costo (grado MEMs) son afecta...

  18. 16th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2016)

    International Nuclear Information System (INIS)

    2016-01-01

    It is our great pleasure to welcome you to PowerMEMS’16 - the 16th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications - in Paris at the UIC Espace Congrès, a few meters away from the Eiffel Tower. The objective of the PowerMEMS conference is to catalyse innovation in micro- and nano- scale technologies for the energy domain. The scope of the meeting ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of Power MEMS concern the harvesting, storage, conversion and conditioning of energy, to integrated systems that manage these processes, to actuation, pumping, and propulsion. Our Conference aims to stimulate the exchange of insights and information, as well as the development of new ideas, in the Power MEMS field. Our goal is to allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering, as well as energy, policy, and entrepreneurial specialists interested in the commercialization of Power MEMS technologies. This year's technical program is highlighted by four plenary talks from prominent experts on M/NEMS for ultra-low power in electronics, advanced nanomaterial for solar cells and thermal transistor. The contributed program received 159 abstract submissions this year. After careful review by the 33-members of the Technical Program Committee, a total of 123 papers will be presented. The 40 contributed oral presentations are arranged in two parallel sessions. The 83 posters are arranged in a ''two-in-one'' poster session in which the poster session time is divided in two; half the posters will be presented during each half-session, allowing the poster presenters to also browse the posters during the poster session. Posters will remain up during the meeting, so please feel free to peruse them at your leisure. The

  19. MEMS-based wavelength and orbital angular momentum demultiplexer for on-chip applications

    DEFF Research Database (Denmark)

    Lyubopytov, Vladimir; Porfirev, Alexey P.; Gurbatov, Stanislav O.

    2017-01-01

    Summary form only given. We demonstrate a new tunable MEMS-based WDM&OAM Fabry-Pérot filter for simultaneous wavelength (WDM) and Orbital Angular Momentum (OAM) (de)multiplexing. The WDM&OAM filter is suitable for dense on-chip integration and dedicated for the next generation of optical...

  20. Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

    Science.gov (United States)

    Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.

    1995-01-01

    In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

  1. Creep crack growth investigations for elevated temperature material application

    International Nuclear Information System (INIS)

    Krompholz, K.; Pierick, J.B.; Grosser, E.D.

    1981-01-01

    Creep crack growth data for the cast alloys IN-519 at 1123 K, Manaurite 36 X at 1123 K and 1173 K, and for the wrought alloys Incoloy 800 H and Inconel 617 at 1123 K, 1173 K, 1223 K, and 1273 K are reported. Up to 1273 K the crack lengths were measured by means of the potential drop technique. The data are plotted da/dt vs. net section stress. These results are compared with data on Inconel 617 analyzed according to stress intensity. (orig.)

  2. Applicability assessment of plug weld to ITER vacuum vessel by crack propagation analysis

    International Nuclear Information System (INIS)

    Ohmori, Junji; Nakahira, Masataka; Takeda, Nobukazu; Shibanuma, Kiyoshi; Sago, Hiromi; Onozuka, Masanori

    2006-03-01

    In order to improve the fabricability of the vacuum vessel (VV) of International Thermonuclear Experimental Reactor (ITER), applicability of plug weld between VV outer shell and stiffening ribs/blanket support housings has been assessed using crack propagation analysis for the plug weld. The ITER VV is a double-wall structure of inner and outer shells with ribs and housings between the shells. For the fabrication of VV, ribs and housings are welded to outer shell after welding to inner shell. A lot of weld grooves should be adjusted for welding outer shell. The plug weld is that outer shells with slit at the weld region are set on ribs/housings then outer shells are welded to them by filling the slits with weld metal. The plug weld can allow larger tolerance of weld groove gap than ordinary butt weld. However, un-welded lengths parallel to outer sell surface remain in the plug weld region. It is necessary to evaluate the allowable un-welded length to apply the plug weld to ITER VV fabrication. For the assessment, the allowable un-welded lengths have been calculated by crack propagation analyses for load conditions, conservatively assuming the un-welded region is a crack. In the analyses, firstly allowable crack lengths are calculated from the stresses of the weld region. Then assuming initial crack length, crack propagation is calculated during operation period. Allowable initial crack lengths are determined on the condition that the propagated cracks should not exceed the allowable crack lengths. The analyses have been carried out for typical inboard straight region and inboard upper curved region with the maximum housing stress. The allowable initial cracks of ribs are estimated to be 8.8mm and 38mm for the rib and the housing, respectively, considering inspection error of 4.4mm. Plug weld between outer shell and ribs/housings could be applicable. (author)

  3. Going Fabless with MEMS

    Directory of Open Access Journals (Sweden)

    Bhaskar CHOUBEY

    2011-04-01

    Full Text Available The Microelectromechanical sensors are finding increasing applications in everyday life. However, each MEMS sensor is generally fabricated on its own individual process. This leads to high cost per sensor. It has been suggested the MEMS should and would follow the path of integrated circuits industry, wherein fabless firms could concentrate on design leading pure-foundries to perfect the manufacturing process. With several designs being manufactured on the same process, the installation cost of fabrication would be evenly shared. Simultaneously, multiple project wafer runs are being offered for MEMS processes to encourage design activity in universities as well as startups. This paper reviews the present state of this transition through an experience of designing and manufacturing microelectromechanical resonators on different processes.

  4. MEMS and the microbe

    NARCIS (Netherlands)

    Ingham, C.J.; Vlieg, J.E.T.V.H.

    2008-01-01

    In recent years, relatively simple MEMS fabrications have helped accelerate our knowledge of the microbial cell. Current progress and challenges in the application of lab-on-a-chip devices to the viable microbe are reviewed. Furthermore, the degree to which microbiologists are becoming the engineers

  5. Application of digital image correlation method for analysing crack ...

    Indian Academy of Sciences (India)

    centrated strain by imitating the treatment of micro-cracks using the finite element ... water and moisture to penetrate the concrete leading to serious rust of the ... The correlations among various grey values of digital images are analysed for ...

  6. Power gating of VLSI circuits using MEMS switches in low power applications

    KAUST Repository

    Shobak, Hosam

    2011-12-01

    Power dissipation poses a great challenge for VLSI designers. With the intense down-scaling of technology, the total power consumption of the chip is made up primarily of leakage power dissipation. This paper proposes combining a custom-designed MEMS switch to power gate VLSI circuits, such that leakage power is efficiently reduced while accounting for performance and reliability. The designed MEMS switch is characterized by an 0.1876 ? ON resistance and requires 4.5 V to switch. As a result of implementing this novel power gating technique, a standby leakage power reduction of 99% and energy savings of 33.3% are achieved. Finally the possible effects of surge currents and ground bounce noise are studied. These findings allow longer operation times for battery-operated systems characterized by long standby periods. © 2011 IEEE.

  7. Design, simulation and analysis of piezoresistive MEMS pressure sensor for fast reactor applications

    International Nuclear Information System (INIS)

    Patankar, Mahesh Kumar; Murali, N.; Satya Murty, S.A.V.; Kalyana Rao, K.; Sridhar, S.

    2013-01-01

    To exploit the extraordinary benefits of MEMS technology in fast reactor domain, a piezoresistive MEMS pressure sensor was designed, simulated and analyzed using Intellisuite Software to measure the RCB air pressure in 0 - 1.25 bar (a) range. For sensing the pressure, a thin square silicon diaphragm of size of 800 x 800 μm 2 with thickness of 20 μm was optimized using FEM analysis and to transfer the mechanical stress, induce in the diaphragm due to pressure, into electrical output voltage signal, a set of piezoresistors were arranged on top side of the diaphragm in full active wheatstone bridge configuration for obtaining the higher sensitivity. The simulation results were compared with the analytical results which were found in line of expectations and electrical sensitivity was obtained at 15 mV/V.bar. (author)

  8. A Survey on Modeling and Simulation of MEMS Switches and Its Application in Power Gating Techniques

    OpenAIRE

    Pramod Kumar M.P; A.S. Augustine Fletcher

    2014-01-01

    Large numbers of techniques have been developed to reduce the leakage power, including supply voltage scaling, varying threshold voltages, smaller logic banks, etc. Power gating is a technique which is used to reduce the static power when the sleep transistor is in off condition. Micro Electro mechanical System (MEMS) switches have properties that are very close to an ideal switch, with infinite off-resistance due to an air gap and low on-resistance due to the ohmic metal to m...

  9. Protein patterning on polycrystalline silicon-germanium via standard UV lithography for bioMEMS applications

    Energy Technology Data Exchange (ETDEWEB)

    Lenci, S., E-mail: silvia.lenci@gmail.com [Dipartimento di Ingegneria dell' Informazione, University of Pisa, Via G. Caruso 16, I-56122 Pisa (Italy); imec, Kapeldreef 75, Leuven B-3001 (Belgium); Tedeschi, L.; Domenici, C.; Lande, C. [Istituto di Fisiologia Clinica, CNR, via G. Moruzzi 1, Pisa I-56124 (Italy); Nannini, A.; Pennelli, G.; Pieri, F. [Dipartimento di Ingegneria dell' Informazione, University of Pisa, Via G. Caruso 16, I-56122 Pisa (Italy); Severi, S. [imec, Kapeldreef 75, Leuven B-3001 (Belgium)

    2010-10-12

    Polycrystalline silicon-germanium (poly-SiGe) is a promising structural material for the post-processing of micro electro-mechanical systems (MEMS) on top of complementary metal-oxide-semiconductor (CMOS) substrates. Combining MEMS and CMOS allows for the development of high-performance devices. We present for the first time selective protein immobilization on top of poly-SiGe surfaces, an enabling technique for the development of novel poly-SiGe based MEMS biosensors. Active regions made of 3-aminopropyl-triethoxysilane (APTES) were defined using silane deposition onto photoresist patterns followed by lift-off in organic solvents. Subsequently, proteins were covalently bound on the created APTES patterns. Fluorescein-labeled human serum albumin (HSA) was used to verify the immobilization procedure while the binding capability of the protein layer was tested by an antigen-labeled antibody pair. Inspection by fluorescence microscopy showed protein immobilization inside the desired bioactive areas and low non-specific adsorption outside the APTES pattern. Furthermore, the quality of the silane patches was investigated by treatment with 30 nm-diameter gold nanoparticles and scanning electron microscope observation. The developed technique is therefore a promising first step towards the realization of poly-SiGe based biosensors.

  10. Application of MEMS Accelerometers and Gyroscopes in Fast Steering Mirror Control Systems

    Directory of Open Access Journals (Sweden)

    Jing Tian

    2016-03-01

    Full Text Available In a charge-coupled device (CCD-based fast steering mirror (FSM tracking control system, high control bandwidth is the most effective way to enhance the closed-loop performance. However, the control system usually suffers a great deal from mechanical resonances and time delays induced by the low sampling rate of CCDs. To meet the requirements of high precision and load restriction, fiber-optic gyroscopes (FOGs are usually used in traditional FSM tracking control systems. In recent years, the MEMS accelerometer and gyroscope are becoming smaller and lighter and their performance have improved gradually, so that they can be used in a fast steering mirror (FSM to realize the stabilization of the line-of-sight (LOS of the control system. Therefore, a tentative approach to implement a CCD-based FSM tracking control system, which uses MEMS accelerometers and gyroscopes as feedback components and contains an acceleration loop, a velocity loop and a position loop, is proposed. The disturbance suppression of the proposed method is the product of the error attenuation of the acceleration loop, the velocity loop and the position loop. Extensive experimental results show that the MEMS accelerometers and gyroscopes can act the similar role as the FOG with lower cost for stabilizing the LOS of the FSM tracking control system.

  11. Micromachined sensor for stress measurement and micromechanical study of free-standing thin films for MEMS applications

    Science.gov (United States)

    Zhang, Ping

    Microelectromechanical systems (MEMS) have a wide range of applications. In the field of wireless and microwave technology, considerable attention has been given to the development and integration of MEMS-based RF (radio frequency) components. An RF MEMS switch requires low insertion loss, high isolation, and low actuation voltage - electrical aspects that have been extensively studied. The mechanical requirements of the switch, such as low sensitivity to built-in stress and high reliability, greatly depend on the micromechanical properties of the switch materials, and have not been thoroughly explored. RF MEMS switches are typically in the form of a free-standing thin film structure. Large stress gradients and across-wafer stress variations developed during fabrication severely degrade their electrical performance. A micromachined stress measurement sensor has been developed that can potentially be employed for in-situ monitoring of stress evolution and stress variation. The sensors were micromachined using five masks on two wafer levels, each measuring 5x3x1 mm. They function by means of an electron tunneling mechanism, where a 2x2 mm silicon nitride membrane elastically deflects under an applied deflection voltage via an external feedback circuitry. For the current design, the sensors are capable of measuring tensile stresses up to the GPa range under deflection voltages of 50--100 V. Sensor functionality was studied by finite element modeling and a theoretical analysis of square membrane deflection. While the mechanical properties of thin films on substrates have been extensively studied, studies of free-standing thin films have been limited due to the practical difficulties in sample handling and testing. Free-standing Al and Al-Ti thin films specimens have been successfully fabricated and microtensile and stress relaxation tests have been performed using a custom-designed micromechanical testing apparatus. A dedicated TEM (transmission electron microscopy

  12. Applications of energy-release-rate techniques to part-through cracks in experimental pressure vessels

    International Nuclear Information System (INIS)

    Bass, B.R.; Bryan, R.H.; Bryson, J.W.; Merkle, J.G.

    1982-01-01

    In nonlinear applications of computational fracture mechanics, energy release rate techniques are used increasingly for computing stress intensity parameters of crack configurations. Recently, deLorenzi used the virtual-crack-extension method to derive an analytical expression for the energy release rate that is better suited for three-dimensional calculations than the well-known J-integral. Certain studies of fracture phenomena, such as pressurized-thermal-shock of cracked structures, require that crack tip parameters be determined for combined thermal and mechanical loads. A method is proposed here that modifies the isothermal formulation of deLorenzi to account for thermal strains in cracked bodies. This combined thermo-mechanical formulation of the energy release rate is valid for general fracture, including nonplanar fracture, and applies to thermo-elastic as well as deformation plasticity material models. Two applications of the technique are described here. In the first, semi-elliptical surface cracks in an experimental test vessel are analyzed under elastic-plastic conditions using the finite element method. The second application is a thick-walled test vessel subjected to combined pressure and thermal shock loadings

  13. Numerical investigations on applicability of permanent magnet method to crack detection in HTS film

    Energy Technology Data Exchange (ETDEWEB)

    Kamitani, A., E-mail: kamitani@yz.yamagata-u.ac.jp [Yamagata University, 4-3-16, Johnan, Yonezawa, Yamagata 992-8510 (Japan); Takayama, T. [Yamagata University, 4-3-16, Johnan, Yonezawa, Yamagata 992-8510 (Japan); Saitoh, A. [University of Hyogo, 2167, Shosha, Himeji, Hyogo 671-2280 (Japan)

    2014-09-15

    Highlights: • The defect parameter is defined for characterizing a crack position. • The defect parameter shows a remarkable change only near a crack. • A crack detection method is proposed on the basis of the permanent-magnet method. • The high-speed rough detection can be achieved by means of the proposed method. - Abstract: The scanning permanent-magnet (PM) method was originally developed for determining the spatial distribution of the critical current density in a high-temperature superconducting (HTS) film. In the present study, its applicability to the crack detection in an HTS film is investigated numerically. To this end, a defect parameter is defined for characterizing a crack position and it is calculated along various scanning lines. The results of computations show that, only when the scanning position is near a crack, the defect parameter shows a violent change. On the basis of the behavior of the defect parameter, the method for roughly identifying a crack is also proposed.

  14. Numerical investigations on applicability of permanent magnet method to crack detection in HTS film

    International Nuclear Information System (INIS)

    Kamitani, A.; Takayama, T.; Saitoh, A.

    2014-01-01

    Highlights: • The defect parameter is defined for characterizing a crack position. • The defect parameter shows a remarkable change only near a crack. • A crack detection method is proposed on the basis of the permanent-magnet method. • The high-speed rough detection can be achieved by means of the proposed method. - Abstract: The scanning permanent-magnet (PM) method was originally developed for determining the spatial distribution of the critical current density in a high-temperature superconducting (HTS) film. In the present study, its applicability to the crack detection in an HTS film is investigated numerically. To this end, a defect parameter is defined for characterizing a crack position and it is calculated along various scanning lines. The results of computations show that, only when the scanning position is near a crack, the defect parameter shows a violent change. On the basis of the behavior of the defect parameter, the method for roughly identifying a crack is also proposed

  15. RF MEMS

    Indian Academy of Sciences (India)

    At the bare die level the insertion loss, return loss and the isolation ... ing and packaging of a silicon on glass based RF MEMS switch fabricated using DRIE. ..... follows the power law based on the asperity deformation model given by Pattona & ... Surface mount style RF packages (SMX series 580465) from Startedge Corp.

  16. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

    Directory of Open Access Journals (Sweden)

    Zhuhao Gong

    2018-02-01

    Full Text Available A radio-frequency micro-electro-mechanical system (RF MEMS wafer-level packaging (WLP method using pre-patterned benzo-cyclo-butene (BCB polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to generate the housing cavity, the BCB sealing ring was protected by a sputtered Cr/Au (chromium/gold layer. The average measured thickness of the BCB layer was 5.9 μm. In contrast to the conventional methods of spin-coating BCB after fabricating cavities, the pre-patterned BCB method presented BCB bonding layers with better quality on severe topography surfaces in terms of increased uniformity of thickness and better surface flatness. The observation of the bonded layer showed that no void or gap formed on the protruding coplanar waveguide (CPW lines. A shear strength test was experimentally implemented as a function of the BCB widths in the range of 100–400 μm. The average shear strength of the packaged device was higher than 21.58 MPa. A RF MEMS switch was successfully packaged using this process with a negligible impact on the microwave characteristics and a significant improvement in the lifetime from below 10 million to over 1 billion. The measured insertion loss of the packaged RF MEMS switch was 0.779 dB and the insertion loss deterioration caused by the package structure was less than 0.2 dB at 30 GHz.

  17. Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications

    International Nuclear Information System (INIS)

    Ngo, H-D; Hiess, Andre; Seidemann, Volker; Studzinski, Daniel; Lange, Martin; Leib, Juergen; Shariff, Dzafir; Ashraf, Huma; Steel, Mike; Atabo, Lilian; Reast, Jon

    2006-01-01

    This paper is a brief report of plasma etching as applied to pattern transfer in silicon. It will focus more on concept overview and strategies for etching of tapered features of interest for MEMS and Wafer Level Packaging (WLP). The basis of plasma etching, the dry etching technique, is explained and plasma configurations are described elsewhere. An important feature of plasma etching is the possibility to achieve etch anisotropy. The plasma etch process is extremely sensitive to many variables such as mask material, mask openings and more important the plasma parameters

  18. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

    OpenAIRE

    Zhuhao Gong; Yulong Zhang; Xin Guo; Zewen Liu

    2018-01-01

    A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to gener...

  19. From MEMS to nanomachine

    International Nuclear Information System (INIS)

    Esashi, Masayoshi; Ono, Takahito

    2005-01-01

    Practically applicable microelectromechanical systems (MEMS) and nanomachines have been developed by applying dry processes. Deep reactive ion etching (RIE) of silicon and its applications to an electrostatically levitated rotational gyroscope, a fibre optic blood pressure sensor and in micro-actuated probes are described. High density electrical feedthrough in glass is made using deep RIE of glass and electroplating of metal. Multi-probe data storage system has been developed using the high density electrical feedthrough in glass. Chemical vapour deposition (CVD) of different materials have been developed for MEMS applications; trench-refill using SiO 2 CVD, microstructures using Silicon carbide CVD for glass mold press and selective CVD of carbon nanotube for electron field emitter. Multi-column electron beam lithography system has been developed using the electron field emitter. (topical review)

  20. On using the dynamic snap-through motion of MEMS initially curved microbeams for filtering applications

    KAUST Repository

    Ouakad, Hassen M.; Younis, Mohammad I.

    2014-01-01

    Numerical and experimental investigations of the dynamics of micromachined shallow arches (initially curved microbeams) and the possibility of using their dynamic snap-through motion for filtering purposes are presented. The considered MEMS arches are actuated by a DC electrostatic load along with an AC harmonic load. Their dynamics is examined numerically using a Galerkin-based reduced-order model when excited near both their first and third natural frequencies. Several simulation results are presented demonstrating interesting jumps and dynamic snap-through behavior of the MEMS arches and their attractive features for uses as band-pass filters, such as their sharp roll-off from pass-bands to stop-bands and their flat response. Experimental work is conducted to test arches realized of curved polysilicon microbeams when excited by DC and AC loads. Experimental data of the micromachined curved beams are shown for the softening and hardening behavior near the first and third natural frequencies, respectively, as well as dynamic snap-through motion. © 2013 Elsevier Ltd.

  1. Mechanical characterization of poly-SiGe layers for CMOS–MEMS integrated application

    International Nuclear Information System (INIS)

    Modlinski, Robert; Witvrouw, Ann; Verbist, Agnes; De Wolf, Ingrid; Puers, Robert

    2010-01-01

    Measuring mechanical properties at the microscale is essential to understand and to fabricate reliable MEMS. In this paper a tensile testing system and matching microscale test samples are presented. The test samples have a dog-bone-like structure. They are designed to mimic standard macro-tensile test samples. The micro-tensile tests are used to characterize 0.9 µm thick polycrystalline silicon germanium (poly-SiGe) films. The poly-SiGe film, that can be considered as a close equivalent to polycrystalline silicon (poly-Si), is studied as a very promising material for use in CMOS/MEMS integration in a single chip due to its low-temperature LPCVD deposition (T < 450 °C). The fabrication process of the poly-SiGe micro-tensile test structure is explained in detail: the design, the processing and post-processing, the testing and finally the results' discussion. The poly-SiGe micro-tensile results are also compared with nanoindentation data obtained on the same poly-SiGe films as well as with results obtained by other research groups

  2. The application of structural nonlinearity in the development of linearly tunable MEMS capacitors

    International Nuclear Information System (INIS)

    Shavezipur, M; Khajepour, A; Hashemi, S M

    2008-01-01

    Electrostatically actuated parallel-plate tunable capacitors are the most desired MEMS capacitors because of their smaller sizes and higher Q-factors. However, these capacitors suffer from low tunability and exhibit high sensitivity near the pull-in voltage which counters the concept of tunability. In this paper, a novel design for parallel-plate tunable capacitors with high tunability and linear capacitance–voltage (C–V) response is developed. The design uses nonlinear structural rigidities to relieve intrinsic electrostatic nonlinearity in MEMS capacitors. Based on the force–displacement characteristic of an ideally linear capacitor, a real beam-like nonlinear spring model is developed. The variable stiffness coefficients of such springs improve the linearity of the C–V curve. Moreover, because the structural stiffness increases with deformations, the pull-in is delayed and higher tunability is achieved. Finite element simulations reveal that capacitors with air gaps larger than 4 µm and supporting beams thinner than 1 µm can generate highly linear C–V responses and tunabilities over 120%. Experimental results for capacitors fabricated by PolyMUMPs verify the effect of weak nonlinear geometric stiffness on improving the tunability for designs with a small air gap and relatively thick structural layers

  3. Multi frequency excited MEMS cantilever beam resonator for Mixer-Filter applications

    KAUST Repository

    Chandran, Akhil A.; Younis, Mohammad I.

    2016-01-01

    Wireless communication uses Radio Frequency waves to transfer information from one point to another. The modern RF front end devices are implementing MEMS in their designs so as to exploit the inherent properties of MEMS devices, such as its low mass, low power consumption, and small size. Among the components in the RF transceivers, band pass filters and mixers play a vital role in achieving the optimum RF performance. And this paper aims at utilizing an electrostatically actuated micro cantilever beam resonator's nonlinear frequency mixing property to realize a Mixer-Filter configuration through multi-frequency excitation. The paper studies about the statics and dynamics of the device. Simulations are carried out to study the added benefits of multi frequency excitation. The modelling of the cantilever beam has been done using a Reduced Order Model of the Euler-Bernoulli's beam equation by implementing the Galerkin discretization. The device is shown to be able to down-convert signals from 960 MHz of frequency to an intermediate frequency around 50 MHz and 70 MHz in Phase 1 and 2, respectively. The simulation showed promising results to take the project to the next level. © 2016 IEEE.

  4. Key Processes of Silicon-On-Glass MEMS Fabrication Technology for Gyroscope Application.

    Science.gov (United States)

    Ma, Zhibo; Wang, Yinan; Shen, Qiang; Zhang, Han; Guo, Xuetao

    2018-04-17

    MEMS fabrication that is based on the silicon-on-glass (SOG) process requires many steps, including patterning, anodic bonding, deep reactive ion etching (DRIE), and chemical mechanical polishing (CMP). The effects of the process parameters of CMP and DRIE are investigated in this study. The process parameters of CMP, such as abrasive size, load pressure, and pH value of SF1 solution are examined to optimize the total thickness variation in the structure and the surface quality. The ratio of etching and passivation cycle time and the process pressure are also adjusted to achieve satisfactory performance during DRIE. The process is optimized to avoid neither the notching nor lag effects on the fabricated silicon structures. For demonstrating the capability of the modified CMP and DRIE processes, a z-axis micro gyroscope is fabricated that is based on the SOG process. Initial test results show that the average surface roughness of silicon is below 1.13 nm and the thickness of the silicon is measured to be 50 μm. All of the structures are well defined without the footing effect by the use of the modified DRIE process. The initial performance test results of the resonant frequency for the drive and sense modes are 4.048 and 4.076 kHz, respectively. The demands for this kind of SOG MEMS device can be fulfilled using the optimized process.

  5. Multi frequency excited MEMS cantilever beam resonator for Mixer-Filter applications

    KAUST Repository

    Chandran, Akhil A.

    2016-09-15

    Wireless communication uses Radio Frequency waves to transfer information from one point to another. The modern RF front end devices are implementing MEMS in their designs so as to exploit the inherent properties of MEMS devices, such as its low mass, low power consumption, and small size. Among the components in the RF transceivers, band pass filters and mixers play a vital role in achieving the optimum RF performance. And this paper aims at utilizing an electrostatically actuated micro cantilever beam resonator\\'s nonlinear frequency mixing property to realize a Mixer-Filter configuration through multi-frequency excitation. The paper studies about the statics and dynamics of the device. Simulations are carried out to study the added benefits of multi frequency excitation. The modelling of the cantilever beam has been done using a Reduced Order Model of the Euler-Bernoulli\\'s beam equation by implementing the Galerkin discretization. The device is shown to be able to down-convert signals from 960 MHz of frequency to an intermediate frequency around 50 MHz and 70 MHz in Phase 1 and 2, respectively. The simulation showed promising results to take the project to the next level. © 2016 IEEE.

  6. Mechanical characterization of poly-SiGe layers for CMOS-MEMS integrated application

    Science.gov (United States)

    Modlinski, Robert; Witvrouw, Ann; Verbist, Agnes; Puers, Robert; De Wolf, Ingrid

    2010-01-01

    Measuring mechanical properties at the microscale is essential to understand and to fabricate reliable MEMS. In this paper a tensile testing system and matching microscale test samples are presented. The test samples have a dog-bone-like structure. They are designed to mimic standard macro-tensile test samples. The micro-tensile tests are used to characterize 0.9 µm thick polycrystalline silicon germanium (poly-SiGe) films. The poly-SiGe film, that can be considered as a close equivalent to polycrystalline silicon (poly-Si), is studied as a very promising material for use in CMOS/MEMS integration in a single chip due to its low-temperature LPCVD deposition (T < 450 °C). The fabrication process of the poly-SiGe micro-tensile test structure is explained in detail: the design, the processing and post-processing, the testing and finally the results' discussion. The poly-SiGe micro-tensile results are also compared with nanoindentation data obtained on the same poly-SiGe films as well as with results obtained by other research groups.

  7. A phononic crystal strip based on silicon for support tether applications in silicon-based MEMS resonators and effects of temperature and dopant on its band gap characteristics

    Directory of Open Access Journals (Sweden)

    Thi Dep Ha

    2016-04-01

    Full Text Available Phononic crystals (PnCs and n-type doped silicon technique have been widely employed in silicon-based MEMS resonators to obtain high quality factor (Q as well as temperature-induced frequency stability. For the PnCs, their band gaps play an important role in the acoustic wave propagation. Also, the temperature and dopant doped into silicon can cause the change in its material properties such as elastic constants, Young’s modulus. Therefore, in order to design the simultaneous high Q and frequency stability silicon-based MEMS resonators by two these techniques, a careful design should study effects of temperature and dopant on the band gap characteristics to examine the acoustic wave propagation in the PnC. Based on these, this paper presents (1 a proposed silicon-based PnC strip structure for support tether applications in low frequency silicon-based MEMS resonators, (2 influences of temperature and dopant on band gap characteristics of the PnC strips. The simulation results show that the largest band gap can achieve up to 33.56 at 57.59 MHz and increase 1280.13 % (also increase 131.89 % for ratio of the widest gaps compared with the counterpart without hole. The band gap properties of the PnC strips is insignificantly effected by temperature and electron doping concentration. Also, the quality factor of two designed length extensional mode MEMS resonators with proposed PnC strip based support tethers is up to 1084.59% and 43846.36% over the same resonators with PnC strip without hole and circled corners, respectively. This theoretical study uses the finite element analysis in COMSOL Multiphysics and MATLAB softwares as simulation tools. This findings provides a background in combination of PnC and dopant techniques for high performance silicon-based MEMS resonators as well as PnC-based MEMS devices.

  8. A phononic crystal strip based on silicon for support tether applications in silicon-based MEMS resonators and effects of temperature and dopant on its band gap characteristics

    Energy Technology Data Exchange (ETDEWEB)

    Ha, Thi Dep, E-mail: hathidep@yahoo.com [School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu 611731 (China); Faculty of Electronic Technology, Industrial University of Ho Chi Minh City, Hochiminh City (Viet Nam); Bao, JingFu, E-mail: baojingfu@uestc.edu.cn [School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu 611731 (China)

    2016-04-15

    Phononic crystals (PnCs) and n-type doped silicon technique have been widely employed in silicon-based MEMS resonators to obtain high quality factor (Q) as well as temperature-induced frequency stability. For the PnCs, their band gaps play an important role in the acoustic wave propagation. Also, the temperature and dopant doped into silicon can cause the change in its material properties such as elastic constants, Young’s modulus. Therefore, in order to design the simultaneous high Q and frequency stability silicon-based MEMS resonators by two these techniques, a careful design should study effects of temperature and dopant on the band gap characteristics to examine the acoustic wave propagation in the PnC. Based on these, this paper presents (1) a proposed silicon-based PnC strip structure for support tether applications in low frequency silicon-based MEMS resonators, (2) influences of temperature and dopant on band gap characteristics of the PnC strips. The simulation results show that the largest band gap can achieve up to 33.56 at 57.59 MHz and increase 1280.13 % (also increase 131.89 % for ratio of the widest gaps) compared with the counterpart without hole. The band gap properties of the PnC strips is insignificantly effected by temperature and electron doping concentration. Also, the quality factor of two designed length extensional mode MEMS resonators with proposed PnC strip based support tethers is up to 1084.59% and 43846.36% over the same resonators with PnC strip without hole and circled corners, respectively. This theoretical study uses the finite element analysis in COMSOL Multiphysics and MATLAB softwares as simulation tools. This findings provides a background in combination of PnC and dopant techniques for high performance silicon-based MEMS resonators as well as PnC-based MEMS devices.

  9. Tribo-functionalizing Si and SU8 materials by surface modification for application in MEMS/NEMS actuator-based devices

    International Nuclear Information System (INIS)

    Singh, R A; Satyanarayana, N; Sinha, S K; Kustandi, T S

    2011-01-01

    Micro/nano-electro-mechanical-systems (MEMS/NEMS) are miniaturized devices built at micro/nanoscales. At these scales, the surface/interfacial forces are extremely strong and they adversely affect the smooth operation and the useful operating lifetimes of such devices. When these forces manifest in severe forms, they lead to material removal and thereby reduce the wear durability of the devices. In this paper, we present a simple, yet robust, two-step surface modification method to significantly enhance the tribological performance of MEMS/NEMS materials. The two-step method involves oxygen plasma treatment of polymeric films and the application of a nanolubricant, namely perfluoropolyether. We apply the two-step method to the two most important MEMS/NEMS structural materials, namely silicon and SU8 polymer. On applying surface modification to these materials, their initial coefficient of friction reduces by ∼4-7 times and the steady-state coefficient of friction reduces by ∼2.5-3.5 times. Simultaneously, the wear durability of both the materials increases by >1000 times. The two-step method is time effective as each of the steps takes the time duration of approximately 1 min. It is also cost effective as the oxygen plasma treatment is a part of the MEMS/NEMS fabrication process. The two-step method can be readily and easily integrated into MEMS/NEMS fabrication processes. It is anticipated that this method will work for any kind of structural material from which MEMS/NEMS are or can be made.

  10. Tribo-functionalizing Si and SU8 materials by surface modification for application in MEMS/NEMS actuator-based devices

    Science.gov (United States)

    Singh, R. A.; Satyanarayana, N.; Kustandi, T. S.; Sinha, S. K.

    2011-01-01

    Micro/nano-electro-mechanical-systems (MEMS/NEMS) are miniaturized devices built at micro/nanoscales. At these scales, the surface/interfacial forces are extremely strong and they adversely affect the smooth operation and the useful operating lifetimes of such devices. When these forces manifest in severe forms, they lead to material removal and thereby reduce the wear durability of the devices. In this paper, we present a simple, yet robust, two-step surface modification method to significantly enhance the tribological performance of MEMS/NEMS materials. The two-step method involves oxygen plasma treatment of polymeric films and the application of a nanolubricant, namely perfluoropolyether. We apply the two-step method to the two most important MEMS/NEMS structural materials, namely silicon and SU8 polymer. On applying surface modification to these materials, their initial coefficient of friction reduces by ~4-7 times and the steady-state coefficient of friction reduces by ~2.5-3.5 times. Simultaneously, the wear durability of both the materials increases by >1000 times. The two-step method is time effective as each of the steps takes the time duration of approximately 1 min. It is also cost effective as the oxygen plasma treatment is a part of the MEMS/NEMS fabrication process. The two-step method can be readily and easily integrated into MEMS/NEMS fabrication processes. It is anticipated that this method will work for any kind of structural material from which MEMS/NEMS are or can be made.

  11. Investigation of surface roughness in micro-electro discharge machining of nonconductive ZrO2 for MEMS application

    International Nuclear Information System (INIS)

    Sabur, A; Moudood, A; Ali, M Y; Maleque, M A

    2013-01-01

    Micro-electro discharge machining technique, a noncontact machining process, is applied for drilling blind hole on nonconductive ZrO 2 ceramic for MEMS application. A conductive layer of adhesive copper is applied on the workpiece surface to initiate the sparks. Kerosene is used as dielectric for creation of continuous conductive pyrolytic carbon layer on the machined surface. Experiments are conducted by varying the voltage (V), capacitance (C) and rotational speed (N). Correlating these variables a mathematical model for surface roughness (SR) is developed using Taguchi method. The results showed that the V and C are the significant parameters of SR in micro-EDM for nonconductive ZrO 2 ceramic. The model also showed that SR increases with the increase of V and C

  12. Miniaturized GPS/MEMS IMU integrated board

    Science.gov (United States)

    Lin, Ching-Fang (Inventor)

    2012-01-01

    This invention documents the efforts on the research and development of a miniaturized GPS/MEMS IMU integrated navigation system. A miniaturized GPS/MEMS IMU integrated navigation system is presented; Laser Dynamic Range Imager (LDRI) based alignment algorithm for space applications is discussed. Two navigation cameras are also included to measure the range and range rate which can be integrated into the GPS/MEMS IMU system to enhance the navigation solution.

  13. MEMS-based Circuits and Systems for Wireless Communication

    CERN Document Server

    Kaiser, Andreas

    2013-01-01

    MEMS-based Circuits and Systems for Wireless Communication provides comprehensive coverage of RF-MEMS technology from device to system level. This edited volume places emphasis on how system performance for radio frequency applications can be leveraged by Micro-Electro-Mechanical Systems (MEMS). Coverage also extends to innovative MEMS-aware radio architectures that push the potential of MEMS technology further ahead.  This work presents a broad overview of the technology from MEMS devices (mainly BAW and Si MEMS resonators) to basic circuits, such as oscillators and filters, and finally complete systems such as ultra-low-power MEMS-based radios. Contributions from leading experts around the world are organized in three parts. Part I introduces RF-MEMS technology, devices and modeling and includes a prospective outlook on ongoing developments towards Nano-Electro-Mechanical Systems (NEMS) and phononic crystals. Device properties and models are presented in a circuit oriented perspective. Part II focusses on ...

  14. Modified stress intensity factor as a crack growth parameter applicable under large scale yielding conditions

    International Nuclear Information System (INIS)

    Yasuoka, Tetsuo; Mizutani, Yoshihiro; Todoroki, Akira

    2014-01-01

    High-temperature water stress corrosion cracking has high tensile stress sensitivity, and its growth rate has been evaluated using the stress intensity factor, which is a linear fracture mechanics parameter. Stress corrosion cracking mainly occurs and propagates around welded metals or heat-affected zones. These regions have complex residual stress distributions and yield strength distributions because of input heat effects. The authors previously reported that the stress intensity factor becomes inapplicable when steep residual stress distributions or yield strength distributions occur along the crack propagation path, because small-scale yielding conditions deviate around those distributions. Here, when the stress intensity factor is modified by considering these distributions, the modified stress intensity factor may be used for crack growth evaluation for large-scale yielding. The authors previously proposed a modified stress intensity factor incorporating the stress distribution or yield strength distribution in front of the crack using the rate of change of stress intensity factor and yield strength. However, the applicable range of modified stress intensity factor for large-scale yielding was not clarified. In this study, the range was analytically investigated by comparison with the J-integral solution. A three-point bending specimen with parallel surface crack was adopted as the analytical model and the stress intensity factor, modified stress intensity factor and equivalent stress intensity factor derived from the J-integral were calculated and compared under large-scale yielding conditions. The modified stress intensity was closer to the equivalent stress intensity factor when compared with the stress intensity factor. If deviation from the J-integral solution is acceptable up to 2%, the modified stress intensity factor is applicable up to 30% of the J-integral limit, while the stress intensity factor is applicable up to 10%. These results showed that

  15. Finite-Element Analysis of Crack Arrest Properties of Fiber Reinforced Composites Application in Semi-Elliptical Cracked Pipelines

    Science.gov (United States)

    Wang, Linyuan; Song, Shulei; Deng, Hongbo; Zhong, Kai

    2018-04-01

    In nowadays, repair method using fiber reinforced composites as the mainstream pipe repair technology, it can provide security for X100 high-grade steel energy long-distance pipelines in engineering. In this paper, analysis of cracked X100 high-grade steel pipe was conducted, simulation analysis was made on structure of pipes and crack arresters (CAs) to obtain the J-integral value in virtue of ANSYS Workbench finite element software and evaluation on crack arrest effects was done through measured elastic-plastic fracture mechanics parameter J-integral and the crack arrest coefficient K, in a bid to summarize effect laws of composite CAs and size of pipes and cracks for repairing CAs. The results indicate that the K value is correlated with laying angle λ, laying length L2/D1, laying thickness T1/T2of CAs, crack depth c/T1 and crack length a/c, and calculate recommended parameters for repairing fiber reinforced composite CAs in terms of two different crack forms.

  16. Synthesis of cracked Calophyllum inophyllum oil using fly ash catalyst for diesel engine application

    KAUST Repository

    Muthukumaran, N.

    2015-04-16

    In this study, production of hydrocarbon fuel from Calophyllum inophyllum oil has been characterized for diesel engine application, by appraising essential fuel processing parameters. As opposed to traditional trans-esterification process, the reported oil was cracked using a catalyst, as the latter improves the fuel properties better than the former. In a bid to make the production process economically viable, a waste and cheap catalyst, RFA (raw fly ash), has been capitalized for the cracking process as against the conventional zeolite catalyst. The fuel production process, which is performed in a fixed bed catalytic reactor, was done methodologically after comprehensively studying the characteristics of fly ash catalyst. Significantly, fly ash characterization was realized using SEM and EDS, which demarcated the surface and internal structures of fly ash particles before and after cracking. After the production of hydrocarbon fuel from C. inophyllum oil, the performed compositional analysis in GC-MS revealed the presence of esters, parfins and olefins. Followed by the characterization of catalytically cracked C. inophyllum oil, suitable blends of it with diesel were tested in a single cylinder diesel engine. From the engine experimental results, BTE (brake thermal efficiency) of the engine for B25 (25% cracked C. inophyllum oil and 75% diesel) was observed to be closer to diesel, while it decreased for higher blends. On the other hand, emissions such as HC (hydrocarbon), CO (carbon monoxide) and smoke were found to be comparable for B25 with diesel. © 2015 Elsevier Ltd. All rights reserved.

  17. Design, fabrication and actuation of a MEMS-based image stabilizer for photographic cell phone applications

    International Nuclear Information System (INIS)

    Chiou, Jin-Chern; Hung, Chen-Chun; Lin, Chun-Ying

    2010-01-01

    This work presents a MEMS-based image stabilizer applied for anti-shaking function in photographic cell phones. The proposed stabilizer is designed as a two-axis decoupling XY stage 1.4 × 1.4 × 0.1 mm 3 in size, and adequately strong to suspend an image sensor for anti-shaking photographic function. This stabilizer is fabricated by complex fabrication processes, including inductively coupled plasma (ICP) processes and flip-chip bonding technique. Based on the special designs of a hollow handle layer and a corresponding wire-bonding assisted holder, electrical signals of the suspended image sensor can be successfully sent out with 32 signal springs without incurring damage during wire-bonding packaging. The longest calculated traveling distance of the stabilizer is 25 µm which is sufficient to resolve the anti-shaking problem in a three-megapixel image sensor. Accordingly, the applied voltage for the 25 µm moving distance is 38 V. Moreover, the resonant frequency of the actuating device with the image sensor is 1.123 kHz.

  18. A CMOS-MEMS clamped–clamped beam displacement amplifier for resonant switch applications

    Science.gov (United States)

    Liu, Jia-Ren; Lu, Shih-Chuan; Tsai, Chun-Pu; Li, Wei-Chang

    2018-06-01

    This paper presents a micromechanical clamped–clamped beam (CC-beam) displacement amplifier based on a CMOS-MEMS fabrication process platform. In particular, a 2.0 MHz resonant displacement amplifier composed of two identical CC-beams coupled by a mechanical beam at locations where the two beams have mismatched velocities exhibits a larger displacement, up to 9.96×, on one beam than that of the other. The displacement amplification prevents unwanted input impacting—the structure switches only to the output but not the input—required by resonant switch-based mechanical circuits (Kim et al 2009 22nd IEEE Int. Conf. on Micro Electro Mechanical Systems; Lin et al 2009 15th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’09) Li et al 2013 17th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’13)). Compared to a single CC-beam displacement amplifier, theory predicts that the displacement amplifying CC-beam array yields a larger overall output displacement for displacement gain beyond 1.13 thanks to the preserved input driving force. A complete analytical model predicts the resultant stiffness and displacement gain of the coupled CC-beam displacement amplifier that match well with finite element analysis (FEA) prediction and measured results.

  19. MEMS fiber-optic Fabry-Perot pressure sensor for high temperature application

    Science.gov (United States)

    Fang, G. C.; Jia, P. G.; Cao, Q.; Xiong, J. J.

    2016-10-01

    We design and demonstrate a fiber-optic Fabry-Perot pressure sensor (FOFPPS) for high-temperature sensing by employing micro-electro-mechanical system (MEMS) technology. The FOFPPS is fabricated by anodically bonding the silicon wafer and the Pyrex glass together and fixing the facet of the optical fiber in parallel with the silicon surface by glass frit and organic adhesive. The silicon wafer can be reduced through dry etching technology to construct the sensitive diaphragm. The length of the cavity changes with the deformation of the diaphragm due to the loaded pressure, which leads to a wavelength shift of the interference spectrum. The pressure can be gauged by measuring the wavelength shift. The pressure experimental results show that the sensor has linear pressure sensitivities ranging from 0 kPa to 600 kPa at temperature range between 20°C to 300°C. The pressure sensitivity at 300°C is approximately 27.63 pm/kPa. The pressure sensitivities gradually decrease with increasing the temperature. The sensor also has a linear thermal drift when temperature changes from 20°C - 300°C.

  20. In-flight performance analysis of MEMS GPS receiver and its application to precise orbit determination of APOD-A satellite

    Science.gov (United States)

    Gu, Defeng; Liu, Ye; Yi, Bin; Cao, Jianfeng; Li, Xie

    2017-12-01

    An experimental satellite mission termed atmospheric density detection and precise orbit determination (APOD) was developed by China and launched on 20 September 2015. The micro-electro-mechanical system (MEMS) GPS receiver provides the basis for precise orbit determination (POD) within the range of a few decimetres. The in-flight performance of the MEMS GPS receiver was assessed. The average number of tracked GPS satellites is 10.7. However, only 5.1 GPS satellites are available for dual-frequency navigation because of the loss of many L2 observations at low elevations. The variations in the multipath error for C1 and P2 were estimated, and the maximum multipath error could reach up to 0.8 m. The average code noises are 0.28 m (C1) and 0.69 m (P2). Using the MEMS GPS receiver, the orbit of the APOD nanosatellite (APOD-A) was precisely determined. Two types of orbit solutions are proposed: a dual-frequency solution and a single-frequency solution. The antenna phase center variations (PCVs) and code residual variations (CRVs) were estimated, and the maximum value of the PCVs is 4.0 cm. After correcting the antenna PCVs and CRVs, the final orbit precision for the dual-frequency and single-frequency solutions were 7.71 cm and 12.91 cm, respectively, validated using the satellite laser ranging (SLR) data, which were significantly improved by 3.35 cm and 25.25 cm. The average RMS of the 6-h overlap differences in the dual-frequency solution between two consecutive days in three dimensions (3D) is 4.59 cm. The MEMS GPS receiver is the Chinese indigenous onboard receiver, which was successfully used in the POD of a nanosatellite. This study has important reference value for improving the MEMS GPS receiver and its application in other low Earth orbit (LEO) nanosatellites.

  1. A review of vibration-based MEMS piezoelectric energy harvesters

    Energy Technology Data Exchange (ETDEWEB)

    Saadon, Salem; Sidek, Othman [Collaborative Microelectronic Design Excellence Center (CEDEC), School of Electrical and Electronic Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang (Malaysia)

    2011-01-15

    The simplicity associated with the piezoelectric micro-generators makes it very attractive for MEMS applications, especially for remote systems. In this paper we reviewed the work carried out by researchers during the last three years. The improvements in experimental results obtained in the vibration-based MEMS piezoelectric energy harvesters show very good scope for MEMS piezoelectric harvesters in the field of power MEMS in the near future. (author)

  2. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  3. Multi-parameter approximation of stress field in a cracked specimen using purpose-built Java applications

    Czech Academy of Sciences Publication Activity Database

    Veselý, V.; Sopek, J.; Tesař, D.; Frantík, P.; Pail, T.; Seitl, Stanislav

    2015-01-01

    Roč. 9, č. 33 (2015), s. 120-133 ISSN 1971-8993 Institutional support: RVO:68081723 Keywords : Cracked specimen * Near-crack-tip fields * Williams expansion * Higher order terms * Stress field reconstruction * Finite element analysis * Java application Subject RIV: JL - Materials Fatigue, Friction Mechanics

  4. Ultra-high-aspect-orthogonal and tunable three dimensional polymeric nanochannel stack array for BioMEMS applications

    Science.gov (United States)

    Heo, Joonseong; Kwon, Hyukjin J.; Jeon, Hyungkook; Kim, Bumjoo; Kim, Sung Jae; Lim, Geunbae

    2014-07-01

    Nanofabrication technologies have been a strong advocator for new scientific fundamentals that have never been described by traditional theory, and have played a seed role in ground-breaking nano-engineering applications. In this study, we fabricated ultra-high-aspect (~106 with O(100) nm nanochannel opening and O(100) mm length) orthogonal nanochannel array using only polymeric materials. Vertically aligned nanochannel arrays in parallel can be stacked to form a dense nano-structure. Due to the flexibility and stretchability of the material, one can tune the size and shape of the nanochannel using elongation and even roll the stack array to form a radial-uniformly distributed nanochannel array. The roll can be cut at discretionary lengths for incorporation with a micro/nanofluidic device. As examples, we demonstrated ion concentration polarization with the device for Ohmic-limiting/overlimiting current-voltage characteristics and preconcentrated charged species. The density of the nanochannel array was lower than conventional nanoporous membranes, such as anodic aluminum oxide membranes (AAO). However, accurate controllability over the nanochannel array dimensions enabled multiplexed one microstructure-on-one nanostructure interfacing for valuable biological/biomedical microelectromechanical system (BioMEMS) platforms, such as nano-electroporation.Nanofabrication technologies have been a strong advocator for new scientific fundamentals that have never been described by traditional theory, and have played a seed role in ground-breaking nano-engineering applications. In this study, we fabricated ultra-high-aspect (~106 with O(100) nm nanochannel opening and O(100) mm length) orthogonal nanochannel array using only polymeric materials. Vertically aligned nanochannel arrays in parallel can be stacked to form a dense nano-structure. Due to the flexibility and stretchability of the material, one can tune the size and shape of the nanochannel using elongation and even

  5. Two-layer radio frequency MEMS fractal capacitors in PolyMUMPS for S-band applications

    KAUST Repository

    Elshurafa, Amro M.; Salama, Khaled N.

    2012-01-01

    In this Letter, the authors fabricate for the first time MEMS fractal capacitors possessing two layers and compare their performance characteristics with the conventional parallel-plate capacitor and previously reported state-of-the-art single

  6. An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications.

    Science.gov (United States)

    Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin

    2016-11-04

    An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA-0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C-1.79 mV/°C in the range 20-300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(V excit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min) -0.1 in the tested range of 0-4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries.

  7. An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications

    Science.gov (United States)

    Mansoor, Mohtashim; Haneef, Ibraheem; Akhtar, Suhail; Rafiq, Muhammad Aftab; De Luca, Andrea; Ali, Syed Zeeshan; Udrea, Florin

    2016-01-01

    An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA–0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C–1.79 mV/°C in the range 20–300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)−0.1 in the tested range of 0–4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries. PMID:27827904

  8. Ductile crack growth resistance of PWR components. Application for structural integrity assessment

    International Nuclear Information System (INIS)

    Bethmont, M.; Eripret, C.; Le Delliou, P.; Frund, J.M.

    1995-01-01

    Structural integrity assessment of PWR components, as pressure vessel and piping, needs to evaluate the ductile crack growth resistance which is generally characterized by J resistance curves (or J-R curves) based on the path-independent J Integral. These curves are more often obtained from laboratory tests with small specimens as CT-specimens and their application to large component safety analysis could be questionable Indeed, it is well known that J-R curves could depend on the specimen size and on the loading mode (i.e. bending stress versus tensile stress) but this dependency could be different from one material to another. This means that it would depend not only on the stress-strain state but also on the actual local fracture mechanisms (i. e. the damage) occurring before the crack initiation or during the crack propagation. The purpose of this paper is to gather some results of crack growth resistance measurement studied at EDF with different materials in order to show how the effect of the parameters, as specimen geometry and mode of loading, is directly related to the local fracture mechanisms or the microstructure of the materials. For that a number of results are analysed by means of the local approach of fracture which is a very useful tool to predict quantitatively the J-R curve dependency, related to fracture mechanisms (authors). 12 refs., 9 figs

  9. Applications of energy-release-rate techniques to part-through cracks in plates and cylinders. Volume 2. ORVIRT: a finite element program for energy release rate calculations for 2-dimensional and 3-dimensional crack models

    International Nuclear Information System (INIS)

    Bass, B.R.; Bryson, J.W.

    1983-02-01

    Certain studies of fracture phenomena, such as pressurized-thermal-shock of cracked structures, require that crack tip parameters be determined for combined thermal and mechanical loads. A method is proposed here that modifies the isothermal formulation of deLorenzi to account for thermal strains in cracked bodies. The formulation has been implemented in the virtual-crack-extension program ORVIRT (Oak Ridge VIRTual-Crack-Extension). Program ORVIRT performs energy release rate calculations for both 2- and 3-dimensional nonlinear models of crack configurations in engineering structures. Two applications of the ORVIRT program are described. In the first, semielliptical surface cracks in an experimental test vessel are analyzed under elastic-plastic conditions using the finite element method. The second application is a thick-walled test vessel subjected to combined pressure and thermal shock loading

  10. Selected papers from the 12th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2012) (Atlanta, GA, USA, 2-5 December 2012)

    Science.gov (United States)

    Allen, Mark G.; Lang, Jeffrey

    2013-11-01

    Welcome to this special section of the Journal of Micromechanics and Microengineering (JMM). This section, co-edited by myself and by Professor Jeffrey Lang of the Massachusetts Institute of Technology, contains expanded versions of selected papers presented at the Power MEMS meeting held in Atlanta, GA, USA, in December of 2012. Professor Lang and I had the privilege of co-chairing Power MEMS 2012, the 12th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications. The scope of the PowerMEMS series of workshops ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of power MEMS (microelectromehcanical systems) range from MEMS-enabled energy harvesting, storage, conversion and conditioning, to integrated systems that manage these processes. Why is the power MEMS field growing in importance? Smaller-scale power and power supplies (microwatts to tens of watts) are gaining in prominence due to many factors, including the ubiquity of low power portable electronic equipment and the proliferation of wireless sensor nodes that require extraction of energy from their embedding environment in order to function. MEMS manufacturing methods can be utilized to improve the performance of traditional power supply elements, such as allowing batteries to charge faster or shrinking the physical size of passive elements in small-scale power supplies. MEMS technologies can be used to fabricate energy harvesters that extract energy from an embedding environment to power wireless sensor nodes, in-body medical implants and other devices, in which the harvesters are on the small scales that are appropriately matched to the overall size of these microsystems. MEMS can enable the manufacturing of energy storage elements from nontraditional materials by bringing appropriate structure and surface morphology to these materials as well as fabricating the electrical interfaces

  11. Application of the virtual crack closure technique to calculate stress intensity factors for through cracks with an oblique elliptical crack front

    NARCIS (Netherlands)

    Fawaz, S.

    1998-01-01

    Fractographic observations on fatigue tested 2024 T3 clad aluminium riveted lap-splice joints indicate oblique fronts after the initial surface or corner crack at a rivet hole has penetrated through the sheet thichness. No stress intensity factor solutions are available for this geometry subjected

  12. SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

    KAUST Repository

    Ramadan, Khaled S.

    2012-01-01

    MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed

  13. PREFACE: The 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2015)

    Science.gov (United States)

    Livermore, C.; Velásquez-García, L. F.

    2015-12-01

    Greetings, and welcome to Boston, MA and PowerMEMS 2015 - the 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications! The objective of PowerMEMS 2015 is to catalyze innovation in micro- and nano-scale technologies for the energy domain. The scope of the meeting ranges from basic principles, to materials and fabrication, to devices and systems, to applications. The many applications of Power MEMS range from the harvesting, storage, conversion and conditioning of energy, to integrated systems that manage these processes, to actuation, pumping, and propulsion. Our Conference aims to stimulate the exchange of insights and information, as well as the development of new ideas, in the Power MEMS field. Our goal is to allow the attendees to interact and network within our multidisciplinary community that includes professionals from many branches of science and engineering, as well as energy, policy, and entrepreneurial specialists interested in the commercialization of Power MEMS technologies. Since the first PowerMEMS in Sendai, Japan in 2000, the Conference has grown in size, reputation, impact, and technical breadth. This continuing growth is evident in this year's technical program, which includes an increasing number of papers on nanomaterials, additive manufacturing for energy systems, actuators, energy storage, harvesting strategies and integrated energy harvesting systems, for example. This year's technical program is highlighted by six plenary talks from prominent experts on piezoelectrics, robotic insects, thermoelectrics, photovoltaics, nanocomposite cathodes, and thermal energy conversion systems. The contributed program received a large number of abstract submissions this year, 169 in total. After careful review by the 34-member Technical Program Committee, a total of 135 papers were selected for presentation. The 60 contributed oral presentations are arranged in two parallel sessions. The 75 posters

  14. EDITORIAL: The 6th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion Applications (PowerMEMS 2006)

    Science.gov (United States)

    Fréchette, Luc G.

    2007-09-01

    Energy is a sector of paramount importance over the coming decades if we are to ensure sustainable development that respects our environment. The research and development of novel approaches to convert available energy into usable forms using micro and nanotechnologies can contribute towards this goal and meet the growing need for power in small scale portable applications. The dominant power sources for handheld and other portable electronics are currently primary and rechargeable batteries. Their limited energy density and adverse effects on the environment upon disposal suggest that alternative approaches need to be explored. This special issue will showcase some of the leading work in this area, initially presented at PowerMEMS 2006, the 6th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion Applications. Power MEMS are defined as microsystems for electrical power generation and other energy conversion applications, including propulsion and cooling. The range of power MEMS technologies includes micro thermodynamic machines, such as microturbines, miniature internal combustion engines and micro-coolers; solid-state direct energy conversion, such as thermoelectric and photovoltaic microstructures; micro electrochemical devices, such as micro fuel cells and nanostructure batteries; vibration energy harvesting devices, such as piezoelectric, magnetic or electrostatic micro generators, as well as micro thrusters and rocket engines for propulsion. These can either be driven by scavenging thermal, mechanical or solar energy from the environment, or from a stored energy source, such as chemical fuel or radioactive material. The unique scope leads to unique challenges in the development of power MEMS, ranging from the integration of novel materials to the efficient small scale implementation of energy conversion principles. In this special issue, Mitcheson et al provide a comparative assessment of three inertial vibration

  15. A Teaching - Learning Framework for MEMS Education

    International Nuclear Information System (INIS)

    Sheeparamatti, B G; Angadi, S A; Sheeparamatti, R B; Kadadevaramath, J S

    2006-01-01

    Micro-Electro-Mechanical Systems (MEMS) technology has been identified as one of the most promising technologies in the 21st century. MEMS technology has opened up a wide array of unforeseen applications. Hence it is necessary to train the technocrats of tomorrow in this emerging field to meet the industrial/societal demands. The drive behind fostering of MEMS technology is the reduction in the cost, size, weight, and power consumption of the sensors, actuators, and associated electronics. MEMS is a multidisciplinary engineering and basic science area which includes electrical engineering, mechanical engineering, material science and biomedical engineering. Hence MEMS education needs a special approach to prepare the technocrats for a career in MEMS. The modern education methodology using computer based training systems (CBTS) with embedded modeling and simulation tools will help in this direction. The availability of computer based learning resources such as MATLAB, ANSYS/Multiphysics and rapid prototyping tools have contributed to proposition of an efficient teaching-learning framework for MEMS education presented in this paper. This paper proposes a conceptual framework for teaching/learning MEMS in the current technical education scenario

  16. Application of Interfacial Propagation and Kinking Crack Concept to ECC/Concrete Overlay Repair System

    Directory of Open Access Journals (Sweden)

    Yaw ChiaHwan

    2014-01-01

    Full Text Available Research on the application of ultraductile engineered cementitious composite (ECC as overlay in the repair of deteriorated concrete structures is performed in this paper. Also, interfacial crack kinking and trapping mechanism experimentally observed in ECC/concrete overlay repair system are described by comparison of toughness and energy release rate. The mechanism involves cycles of extension, kinking, and arrest of interfacial crack into the overlay. Experimental testing of overlay repair system reveals significant improvements in load carrying capacity and ductility over conventional concrete overlay. The commonly observed overlay system failure mode of delamination or spalling is eliminated when ECC is applied. These failure modes are suppressed when ECC is used as an ideal and durable candidate overlay repair material.

  17. Application of Streaming Effect and Joule Heating Effect of Pulse Current in Crack Healing of Metal Materials

    Directory of Open Access Journals (Sweden)

    Jian Chu

    2017-06-01

    Full Text Available Remanufacture engineering is an emerging industry that saves resources as well as protects the environment. However, cracks on remanufactured components can result in serious trouble. Therefore, in order to avoid unnecessary waste of resources and energy, these cracks should be repaired radically in order to ensure the smooth progressing of the remanufacturing process. Consequently, the crack healing technique of metal materials is very important in the field of remanufacturing. In this study, the U-shape vane stainless steel of a centrifugal compressor which had cracks was processed by pulse current using a high pulse current discharge device, and the influence of the streaming effect and Joule heating effect of pulse current on the crack healing of metal materials was studied, aiming to provide references for the better application of this technology in the remanufacturing field in the future.

  18. Two-layer radio frequency MEMS fractal capacitors in PolyMUMPS for S-band applications

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-23

    In this Letter, the authors fabricate for the first time MEMS fractal capacitors possessing two layers and compare their performance characteristics with the conventional parallel-plate capacitor and previously reported state-of-the-art single-layer MEMS fractal capacitors. Explicitly, a capacitor with a woven structure and another with an interleaved configuration were fabricated in the standard PolyMUMPS surface micromachining process and tested at S-band frequencies. The self-resonant frequencies of the fabricated capacitors were close to 10GHz, which is better than that of the parallel-plate capacitor, which measured only 5.5GHz. Further, the presented capacitors provided a higher capacitance when compared with the state-of-the-art-reported MEMS fractal capacitors created using a single layer at the expense of a lower quality factor. © 2012 The Institution of Engineering and Technology.

  19. Approaches and Challenges of Engineering Implantable Microelectromechanical Systems (MEMS Drug Delivery Systems for in Vitro and in Vivo Applications

    Directory of Open Access Journals (Sweden)

    Ken-Tye Yong

    2012-11-01

    Full Text Available Despite the advancements made in drug delivery systems over the years, many challenges remain in drug delivery systems for treating chronic diseases at the personalized medicine level. The current urgent need is to develop novel strategies for targeted therapy of chronic diseases. Due to their unique properties, microelectromechanical systems (MEMS technology has been recently engineered as implantable drug delivery systems for disease therapy. This review examines the challenges faced in implementing implantable MEMS drug delivery systems in vivo and the solutions available to overcome these challenges.

  20. Movable MEMS Devices on Flexible Silicon

    KAUST Repository

    Ahmed, Sally

    2013-01-01

    Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS

  1. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.; Jaber, Nizar; Younis, Mohammad I.

    2017-01-01

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams

  2. Accurate and wide field of view MEMS-based sun sensor for industrial applications

    OpenAIRE

    Delgado, Francisco; Quero, J.M.; Garcia Ortega, Juan; López Tarrida, Cristina; Ortega Villasclaras, Pablo Rafael; Bermejo Broto, Sandra

    2012-01-01

    This paper describes the design, fabrication, sim- ulation, and experimental results of an improved miniaturized two-axis sun sensor for industrial applications, created by adapt- ing a technology used previously in satellite applications. The sensor for each axis is composed of six photodiodes integrated in a crystalline-silicon substrate and a layer of cover glass, which is used to protect the silicon and to hold the windows. The high preci...

  3. Magnetron sputtered Cu{sub 3}N/NiTiCu shape memory thin film heterostructures for MEMS applications

    Energy Technology Data Exchange (ETDEWEB)

    Kaur, Navjot; Choudhary, Nitin [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India); Goyal, Rajendra N. [Indian Institute of Technology, Roorkee, Department of Chemistry (India); Viladkar, S. [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India); Matai, I.; Gopinath, P. [Indian Institute of Technology, Roorkee, Centre for Nanotechnology (India); Chockalingam, S. [Indian Institute of Technology, Guwahati, Department of Biotechnology (India); Kaur, Davinder, E-mail: dkaurfph@iitr.ernet.in [Indian Institute of Technology Roorkee, Roorkee, Functional Nanomaterials Research Lab, Department of Physics and Centre of Nanotechnology (India)

    2013-03-15

    In the present study, for the first time, Cu{sub 3}N/NiTiCu/Si heterostructures were successfully grown using magnetron sputtering technique. Nanocrystalline copper nitride (Cu{sub 3}N with thickness {approx}200 nm) thin films and copper nanodots were subsequently deposited on the surface of 2-{mu}m-thick NiTiCu shape memory thin films in order to improve the surface corrosion and nickel release properties of NiTiCu thin films. Interestingly, the phase transformation from martensite phase to austenite phase has been observed in Cu{sub 3}N/NiTiCu heterostructures with corresponding change in texture and surface morphology of top Cu{sub 3}N films. Field emission scanning electron microscopy and atomic force microscope images of the heterostructures reveals the formation of 20-nm-sized copper nanodots on NiTiCu surface at higher deposition temperature (450 Degree-Sign C) of Cu{sub 3}N. Cu{sub 3}N passivated NiTiCu films possess low corrosion current density with higher corrosion potential and, therefore, better corrosion resistance as compared to pure NiTiCu films. The concentration of Ni released from the Cu{sub 3}N/NiTiCu samples was observed to be much less than that of pure NiTiCu film. It can be reduced to the factor of about one-ninth after the surface passivation resulting in smooth, homogeneous and highly corrosion resistant surface. The antibacterial and cytotoxicity of pure and Cu{sub 3}N coated NiTiCu thin films were investigated through green fluorescent protein expressing E. coli bacteria and human embryonic kidney cells. The results show the strong antibacterial property and non cytotoxicity of Cu{sub 3}N/NiTiCu heterostructure. This work is of immense technological importance due to variety of BioMEMS applications.

  4. An application of the J-integral to an incremental analysis of blunting crack behavior

    International Nuclear Information System (INIS)

    Merkle, J.G.

    1989-01-01

    This paper describes an analytical approach to estimating the elastic-plastic stresses and strains near the tip of a blunting crack with a finite root radius. Rice's original derivation of the path independent J-integral considered the possibility of a finite crack tip root radius. For this problem Creager's elastic analysis gives the relation between the stress intensity factor K I and the near tip stresses. It can be shown that the relation K I 2 = E'J holds when the root radius is finite. Recognizing that elastic-plastic behavior is incrementally linear then allows a derivation to be performed for a bielastic specimen having a crack tip region of reduced modulus, and the result differentiated to estimate elastic-plastic behavior. The result is the incremental form of Neuber's equation. This result does not require the assumption of any particular stress-strain relation. However by assuming a pure power law stress-strain relation and using Ilyushin's principle, the ordinary deformation theory form of Neuber's equation, K σ K var epsilon = K t 2 , is obtained. Applications of the incremental form of Neuber's equation have already been made to fatigue and fracture analysis. This paper helps to provide a theoretical basis for these methods previously considered semiempirical. 26 refs., 4 figs

  5. Application of advanced surface and volumetric NDE methods to the detection of cracks in critical regions of turbine blades

    International Nuclear Information System (INIS)

    Porter, J.P.

    1990-01-01

    Advanced NDE inspection techniques capable of detecting small, yet potentially dangerous cracks in turbine blade tenons, blade tie-wire through-holes, trailing edges, and blade root attachment ends have been devised and developed and are now being applied successfully in the field replacing conventional, less-sensitive methods commonly used for crack detection in these blade elements. Under-shroud lateral cracks in tenons are detected ultrasonically by highangle refracted pulse-echo shear wave and 0-degree pitch-catch longitudinal wave methods. Trailing-edge blade cracks and surface-connected cracks in root attachment ends are detected by high frequency eddy current techniques, typically applied remotely using ports in the turbine housing to gain access to the parts under inspection. Cracks emanating from tie-wire holes in blade upper ends are detected by eddy current inspection, which has been found to be a far more effective methods than either magnetic particle or ultrasonic testing for this application. Root attachment ends of side entry blades are inspected volumetrically by ultrasonics, using proprietary coupling techniques that allow examination of heretofore uninspectable regions of blade attachment hooks, known regions of crack initiation. Techniques developed for this collection of applications are described, and the results of actual field inspections are presented and discussed

  6. RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz

    International Nuclear Information System (INIS)

    Iannacci, J; Tschoban, C

    2017-01-01

    RF-MEMS technology is proposed as a key enabling solution for realising the high-performance and highly reconfigurable passive components that future communication standards will demand. In this work, we present, test and discuss a novel design concept for an 8-bit reconfigurable power attenuator, manufactured using the RF-MEMS technology available at the CMM-FBK, in Italy. The device features electrostatically controlled MEMS ohmic switches in order to select/deselect the resistive loads (both in series and shunt configuration) that attenuate the RF signal, and comprises eight cascaded stages (i.e. 8-bit), thus implementing 256 different network configurations. The fabricated samples are measured (S-parameters) from 10 MHz to 110 GHz in a wide range of different configurations, and modelled/simulated with Ansys HFSS. The device exhibits attenuation levels (S21) in the range from  −10 dB to  −60 dB, up to 110 GHz. In particular, S21 shows flatness from 15 dB down to 3–5 dB and from 10 MHz to 50 GHz, as well as fewer linear traces up to 110 GHz. A comprehensive discussion is developed regarding the voltage standing wave ratio, which is employed as a quality indicator for the attenuation levels. The margins of improvement at design level which are needed to overcome the limitations of the presented RF-MEMS device are also discussed. (paper)

  7. A novel design and analysis of a MEMS ceramic hot-wire anemometer for high temperature applications

    International Nuclear Information System (INIS)

    Nagaiah, N R; Sleiti, A K; Rodriguez, S; Kapat, J S; An, L; Chow, L

    2006-01-01

    This paper attempts to prove the feasibility of high temperature MEMS hot-wire anemometer for gas turbine environment. No such sensor exists at present. Based on the latest improvement in a new type of Polymer-Derived Ceramic (PDC) material, the authors present a Novel design, structural and thermal analysis of MEMS hot-wire anemometer (HWA) based on PDC material, and show that such a sensor is indeed feasible. This MEMS Sensor is microfabricated by using three types of PDC materials such as SiAlCN, SiCN (lightly doped) and SiCN (heavily doped) for sensing element (hot-wire), support prongs and connecting leads respectively. This novel hot wire anemometer can perform better than a conventional HWA in which the hot wire is made of tungsten or platinum-iridium. This type of PDC-HWA can be used in harsh environment due to its high temperature resistance, tensile strength and resistance to oxidation. This HWA is fabricated using microstereolithography as a novel microfabrication technique to manufacture the proposed MEMS Sensor

  8. MEMS monocrystalline-silicon based thermal devices for chemical and microfluidic applications

    NARCIS (Netherlands)

    Mihailovic, M.

    2011-01-01

    This thesis explores the employment of monocrystalline silicon in microsystems as an active material for different thermal functions, such as heat generation and heat transfer by conduction. In chapter 1 applications that need thermal micro devices, micro heaters and micro heat exchangers, are

  9. Low Voltage, High-Q SOI MEMS Varactors for RF Applications

    DEFF Research Database (Denmark)

    Yalcinkaya, Arda Deniz; Jensen, Søren; Hansen, Ole

    2003-01-01

    A micro electromechanical tunable capacitor with a low control voltage, a wide tuning range and high electrical quality factor is presented with detailed characterizations. A 50μm thick single-crystalline silicon layer was etched using deep reactive ion etching (DRIE) for obtaining high-aspect ra...... is a suitable passive component to be used in band-pass filtering, voltage controlled oscillator or impedance matching applications on the very high frequency(VHF) and ultra high frequency (UHF) bands....

  10. Failure and fracture of thin film materials for MEMS

    Science.gov (United States)

    Jonnalagadda, Krishna Nagasai

    Design and reliable operation of Microelectromechanical systems (MEMS) depend on the material parameters that influence the failure and fracture properties of brittle and metallic thin films. Failure in brittle materials is quantified by the onset of catastrophic fracture, while in metals, the onset of inelastic deformation is considered as failure as it increases the material compliance. This dissertation research developed new experimental methods to address three aspects on the failure response of these two categories of materials: (a) the role of microstructure and intrinsic stress gradients in the opening mode fracture of mathematically sharp pre-cracks in amorphous and polycrystalline brittle thin films, (b) the critical conditions for mixed mode I/II pre-cracks and their comparison with linear elastic fracture mechanics (LEFM) criteria for crack initiation in homogeneous materials, and (c) the strain rate sensitivity of textured nanocrystalline Au and Pt films with grain sizes of 38 nm and 25 nm respectively. One of the technical objectives of this research was to develop experimental methods and tools that could become standards in MEMS and thin film experimental mechanics. In this regard, a new method was introduced to conduct mode I and mixed mode I/II fracture studies with microscale thin film specimens containing sharp edge pre-cracks. The mode I experiments permitted the direct application of LEFM handbook solutions. On the other hand, the newly introduced mixed mode I/II experiments in thin films were conducted by establishing a new protocol that employs non-standard oblique edge pre-cracks and a numerical analysis based on the J-integral to calculate the stress intensity factors. Similarly, a new experimental protocol has been implemented to carry out experiments with metallic thin films at strain rates that vary by more than six orders of magnitude. The results of mode I fracture experiments concluded that grain inhomogeneity in polycrystalline

  11. Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program

    Energy Technology Data Exchange (ETDEWEB)

    Schriner, H.; Davies, B.; Sniegowski, J.; Rodgers, M.S.; Allen, J.; Shepard, C.

    1998-05-01

    Research and development in the design and manufacture of Microelectromechanical Systems (MEMS) is growing at an enormous rate. Advances in MEMS design tools and fabrication processes at Sandia National Laboratories` Microelectronics Development Laboratory (MDL) have broadened the scope of MEMS applications that can be designed and manufactured for both military and commercial use. As improvements in micromachining fabrication technologies continue to be made, MEMS designs can become more complex, thus opening the door to an even broader set of MEMS applications. In an effort to further research and development in MEMS design, fabrication, and application, Sandia National Laboratories has launched the Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program or SAMPLES program. The SAMPLES program offers potential partners interested in MEMS the opportunity to prototype an idea and produce hardware that can be used to sell a concept. The SAMPLES program provides education and training on Sandia`s design tools, analysis tools and fabrication process. New designers can participate in the SAMPLES program and design MEMS devices using Sandia`s design and analysis tools. As part of the SAMPLES program, participants` designs are fabricated using Sandia`s 4 level polycrystalline silicon surface micromachine technology fabrication process known as SUMMiT (Sandia Ultra-planar, Multi-level MEMS Technology). Furthermore, SAMPLES participants can also opt to obtain state of the art, post-fabrication services provided at Sandia such as release, packaging, reliability characterization, and failure analysis. This paper discusses the components of the SAMPLES program.

  12. EDITORIAL: Selected papers from the 11th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2011) Selected papers from the 11th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2011)

    Science.gov (United States)

    Cho, Young-Ho

    2012-09-01

    This special section of Journal of Micromechanics and Microengineering features papers selected from the 11th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2011), held at Sejong Hotel in Seoul, Korea during 15-18 November 2011. Since the first PowerMEMS workshop held in Sendai, Japan in 2000, the workshop has developed as the premier forum for reporting research results in micro and nanotechnology for power generation, energy conversion, harvesting and processing applications, including in-depth technical issues on nanostructures and materials for small-scale high-density energy and thermal management. Potential PowerMEMS applications cover not only portable power devices for consumer electronics and remote sensors, but also micro engines, impulsive thrusters and fuel cells for systems ranging from the nanometer to the millimeter scale. The 2011 technical program consists of 1 plenary talk, 4 invited talks and 118 contributed presentations. The 48 oral and 70 poster presentations, selected by 27 Technical Program Committee Members from 131 submitted abstracts, have stimulated lively discussion maximizing the interaction between participants. Among them, this special section includes 9 papers covering micro-scale power generators, energy converters, harvesters, thrusters and thermal coolers. Finally, we are grateful to the members of the International Steering Committee, the Technical Program Committee, and the Local Organizing Committee for their efforts and contributions to PowerMEMS 2011. We also thank the two companies Samsung Electro-Mechanics and LG Elite for technical tour arrangements. Special thanks go to Dr Ian Forbes, the editorial staff of the Journal of Micromechanics and Microengineering, as well as to the staff of IOP Publishing for making this special section possible.

  13. Three dimensional MEMS supercapacitors

    Energy Technology Data Exchange (ETDEWEB)

    Sun, Wei

    2011-10-15

    and the specific power of 0.58 mWcm-2 at 20mVs-1 scan rate. The 3D MEMS supercapacitor fabricated in this project has the specific capacitance and the specific power of 0.029 F cm-2 and 2.2 mWcm-2 respectively at a relative large discharge rate of 5 m Acm-2. It is also found vi that the supercapacitors have the performance of broad frequency range up to 300Hz. For DRIE based 3D MEMS supercapacitor, the innovative designs were developed based on silicon micromachining process flow which includes the key processes such as thermal oxidation, RF sputtering, wet etching, DRIE, electroless plating and P Py polymerization. The optimized P Py electrode doping with Tos- performed ideal super capacitor properties in NaCl electrolyte. The single PPy electrode of the 3D MEMS supercapacitors can provide 0.128 F cm-2 specific capacitance and 1.28 mWcm-2 specific power at 20 mvs-1 scan rate. The specific capacitance of the 3D MEMS supercapacitors equals 0.056 F cm-2, and the specific power at 20 mvs-1 scan rate equals 0.56 mWcm-2. In addition, novel supercapacitors based on wafer level process are designed for flexible integration in applications such as high temperature electronics and hybrid power system for electric vehicles. Experimental work on TiO2 anodic oxidation, which enables the fabrication of the one of these designs, has been carried out. Dense TiO2 nano holes with diameters ranged from about 90 to 270 nm were obtained in 0.05 wt% HF aqueous solutions with two-step anodic oxidation method. Comparing to the published specific capacitance (about 2 mFcm-2) for microsupercapacitors [33], I have achieved much larger specific capacitance (typically 0.029 to 0.056 F cm-2) for 3D MEMS supercapacitors. The above results have been presented in 3 international conferences. Total 4 journal articles have been published, and one has been submitted. The article in the Journal of Power Source (appendix 3) has been cited 9 times after published in April 2009, and the article in

  14. Micro electromechanical systems (MEMS) for mechanical engineers

    Energy Technology Data Exchange (ETDEWEB)

    Lee, A. P., LLNL

    1996-11-18

    The ongoing advances in Microelectromechanical Systems (MEMS) are providing man-kind the freedom to travel to dimensional spaces never before conceivable. Advances include new fabrication processes, new materials, tailored modeling tools, new fabrication machines, systems integration, and more detailed studies of physics and surface chemistry as applied to the micro scale. In the ten years since its inauguration, MEMS technology is penetrating industries of automobile, healthcare, biotechnology, sports/entertainment, measurement systems, data storage, photonics/optics, computer, aerospace, precision instruments/robotics, and environment monitoring. It is projected that by the turn of the century, MEMS will impact every individual in the industrial world, totaling sales up to $14 billion (source: System Planning Corp.). MEMS programs in major universities have spawned up all over the United States, preparing the brain-power and expertise for the next wave of MEMS breakthroughs. It should be pointed out that although MEMS has been initiated by electrical engineering researchers through the involvement of IC fabrication techniques, today it has evolved such that it requires a totally multi-disciplinary team to develop useful devices. Mechanical engineers are especially crucial to the success of MEMS development, since 90% of the physical realm involved is mechanical. Mechanical engineers are needed for the design of MEMS, the analysis of the mechanical system, the design of testing apparatus, the implementation of analytical tools, and the packaging process. Every single aspect of mechanical engineering is being utilized in the MEMS field today, however, the impact could be more substantial if more mechanical engineers are involved in the systems level designing. In this paper, an attempt is made to create the pathways for a mechanical engineer to enter in the MEMS field. Examples of application in optics and medical devices will be used to illustrate how mechanical

  15. Modelling and Simulation of Novel Three Arm MEMS Actuators and Its Application

    International Nuclear Information System (INIS)

    Pandiyan, Jagadeesh; Umapathy, M; Balachandar, S; Arumugam, M; Ramasamy, S; Gajjar, Nilesh C

    2006-01-01

    This paper presents the design and Finite Element Model (FEM) simulation of a novel electrothermal microactuators and arrays. It is a single material microactuator which deflects at its tips by differential thermal expansion of its constituent parts. The electrothermal actuator consists of three thin arms, three thin blades and two electrical connection pads. The goal of this coupled electrothermal actuator design was to multiply the force by adding the individual contributions of all the three actuators. The difference in magnitude of blade deflections depends on the geometrical characteristics of the actuators. The thermal deformation and thermal stability are easily controllable. The simulation employing ANSYS/Multiphysics software results include force, deflection, thermal stress, ideal electrothermal actuator and array geometries. The main advantage of this electrothermal actuator is large deflection of blades with very low actuation voltage in comparison with electrostatic actuators. A typical application in a micromirror is shown to illustrate the utility of these actuators and arrays

  16. Optical inspection of hidden MEMS structures

    Science.gov (United States)

    Krauter, Johann; Gronle, Marc; Osten, Wolfgang

    2017-06-01

    Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

  17. Advanced mechatronics and MEMS devices II

    CERN Document Server

    Wei, Bin

    2017-01-01

    This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intel...

  18. Progress and profit through microtechnologies: commercial applications of MEMS/MOEMS

    Science.gov (United States)

    Ehrfeld, Wolfgang; Ehrfeld, Ursula

    2001-09-01

    Micro technology deals with miniaturization and integration in all areas of technology outside of microelectronics like micro mechanics, micro optics, micro acoustics, micro fluid technology, micro reaction technology and further disciplines which are focused on technical components and systems with characteristic dimensions in the micrometer range. Within a period of about ten years a multi-billion dollar market has been set up with many products for daily life. The growth rate of the market of micro technology will remain on a high level for the years to come. Mega trends resulting from fundamental human wishes for health, information, mobility and sustainable development are creating a further growing basis for micro technical products. A broad spectrum of production processes and materials has been developed to meet the requirements of a strongly diversified range of applications. For the development of new components and systems the importance of software tools for simulation of functional properties, production processes and comprehensive optimization is growing rapidly. Micro devices are meanwhile used extensively in information, automotive, and medical technologies. In addition, micro technology is generating a completely novel basis for chemical engineering, life sciences, industrial automation and optical communication, to mention only a few disciplines where future innovation will be dominated by miniaturization.

  19. Nano-tribology and materials in MEMS

    CERN Document Server

    Satyanarayana, N; Lim, Seh

    2013-01-01

    This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.

  20. Digital holography for MEMS and microsystem metrology

    CERN Document Server

    Asundi, Anand

    2011-01-01

    Approaching the topic of digital holography from the practical perspective of industrial inspection, Digital Holography for MEMS and Microsystem Metrology describes the process of digital holography and its growing applications for MEMS characterization, residual stress measurement, design and evaluation, and device testing and inspection. Asundi also provides a thorough theoretical grounding that enables the reader to understand basic concepts and thus identify areas where this technique can be adopted. This combination of both practical and theoretical approach will ensure the

  1. The effect of gibberellic acid applications on the cracking rate and ...

    African Journals Online (AJOL)

    Yomi

    coloured fruits were obtained. Key words: Sweet cherry, gibberellic acid, cracking index, fruit quality. ... the losses in the marketable fruit quantity resulting from cracking can ..... Dergisi, 3(1): 43-50. Usenik V, Kastelec D, Stampar F (2005).

  2. Modularly Integrated MEMS Technology

    National Research Council Canada - National Science Library

    Eyoum, Marie-Angie N

    2006-01-01

    Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation...

  3. Application of stable crack growth in fracture assessment of defects in ductile materials

    International Nuclear Information System (INIS)

    Dillstroem, Peter

    2009-06-01

    This report goes through the use of methods/standards, which consider stable (J-controlled) crack growth. We have demonstrated the following: - ASME XI, App. C, App. H, which deals with analysis of stainless steel and ferritic piping, take account of stable growth. In App. C, this corresponds to the inclusion of stable growth up to Δa ∼ 10 mm. - R6-method, BS 7910:1999 and ASME XI, Code Case N-494, contains an established formalism to take account of stable growth. A prerequisite is that you have access to relevant and authentic material data in the form of fracture resistance K k /J k and J r curves. - All of the above methods/standards are applicable in the nuclear context. We reported also that required to produce relevant and valid data (fracture resistance K k /J k and J r curves) to be used for the analysis of stable growth. This report does not specify how much stable crack that can be counted at a Safety Assessment

  4. Applications of EPRI database on environmentally assisted cracking in the nuclear industry

    International Nuclear Information System (INIS)

    Rungta, R.; Mindlin, H.; Gilman, J.D.

    1986-01-01

    A computerized database, EPRI Database on Environmentally Assisted Cracking (EDEAC), has been established to assemble stress-corrosion cracking and corrosion fatigue crack growth data on materials of interest to nuclear power generation. The database is being used to review the basis for the existing ASME reference fatigue crack growth curves for low alloy ferritic steels used for reactor pressure vessels. Correlations between fatigue crack growth rate and stress intensity factor range with corrections for frequency, stress ratio, and temperature for austenitic stainless steels in air are also being developed

  5. Applications of EPRI database on environmentally assisted cracking in the nuclear industry

    International Nuclear Information System (INIS)

    Rungta, R.; Mindlin, H.; Gilman, J.D.

    1986-01-01

    A computerized database, EPRI Database on Environmentally Assisted Cracking (EDEAC), has been established to assemble stress corrosion cracking (SCC) and corrosion fatigue crack growth data on nuclear power generation industry materials. The database is currently used to review the basis for the existing ASME reference fatigue crack growth curves for low alloy ferritic steels used for reactor pressure vessels. Also, correlations between fatigue crack growth rate and stress intensity factor range with corrections for frequency, stress ratio, and temperature for austenitic stainless steels in air are being developed using the EDEAC

  6. Crack deflection in brittle media with heterogeneous interfaces and its application in shale fracking

    Science.gov (United States)

    Zeng, Xiaguang; Wei, Yujie

    Driven by the rapid progress in exploiting unconventional energy resources such as shale gas, there is growing interest in hydraulic fracture of brittle yet heterogeneous shales. In particular, how hydraulic cracks interact with natural weak zones in sedimentary rocks to form permeable cracking networks is of significance in engineering practice. Such a process is typically influenced by crack deflection, material anisotropy, crack-surface friction, crustal stresses, and so on. In this work, we extend the He-Hutchinson theory (He and Hutchinson, 1989) to give the closed-form formulae of the strain energy release rate of a hydraulic crack with arbitrary angles with respect to the crustal stress. The critical conditions in which the hydraulic crack deflects into weak interfaces and exhibits a dependence on crack-surface friction and crustal stress anisotropy are given in explicit formulae. We reveal analytically that, with increasing pressure, hydraulic fracture in shales may sequentially undergo friction locking, mode II fracture, and mixed mode fracture. Mode II fracture dominates the hydraulic fracturing process and the impinging angle between the hydraulic crack and the weak interface is the determining factor that accounts for crack deflection; the lower friction coefficient between cracked planes and the greater crustal stress difference favor hydraulic fracturing. In addition to shale fracking, the analytical solution of crack deflection could be used in failure analysis of other brittle media.

  7. A Nuclear Microbattery for MEMS Devices

    International Nuclear Information System (INIS)

    Blanchard, James; Henderson, Douglass; Lal, Amit

    2002-01-01

    This project was designed to demonstrate the feasibility of producing on-board power for MEMS devices using radioisotopes. MEMS is a fast growing field, with hopes for producing a wide variety of revolutionary applications, including ''labs on a chip,'' micromachined scanning tunneling microscopes, microscopic detectors for biological agents, microsystems for DNA identification, etc. Currently, these applications are limited by the lack of an on-board power source. Research is ongoing to study approaches such as fuel cells, fossil fuels, and chemical batteries, but all these concepts have limitations. For long-lived, high energy density applications, on-board radioisotope power offers the best choice. We have succeeded in producing such devices using a variety of isotopes, incorporation methods, and device geometries. These experiments have demonstrated the feasibility of using radioisotope power and that there are a variety of options available for MEMS designers. As an example of an integrated, self-powered application, we have created an oscillating cantilever beam that is capable of consistent, periodic oscillations over very long time periods without the need for refueling. Ongoing work will demonstrate that this cantilever is capable of radio frequency transmission, allowing MEMS devices to communicate with one another wirelessly. Thus, this will be the first self-powered wireless transmitter available for use in MEMS devices, permitting such applications as sensors embedded in buildings for continuous monitoring of the building performance and integrity

  8. Application possibility of the direct current conduction method for nondestructive crack measurement

    International Nuclear Information System (INIS)

    Riedl, R.

    1982-01-01

    An important value to determine the danger of cracks is the determination of crack depths. The crack depth can be determined quite accurate by means of the direct current conduction method, if one holds onto certain rules. Often complicated experimental set-ups are applied. However, portable commercial devices can be obtained that can be used for partial fluxation, that yield good results. By means of two examples: crack conduction samples in which the built-up of a constant-cracking is persued up to a certain depth, as well as the persuasion of an continuing crack in a bearing cylinder, shall be demonstrated that is very well possible to record accurate profiles with commercial devices and to avoid expensive measurement devices. (orig.) [de

  9. Application of a nonlinear spring element to analysis of circumferentially cracked pipe under dynamic loading

    International Nuclear Information System (INIS)

    Olson, R.; Scott, P.; Wilkowski, G.M.

    1992-01-01

    As part of the US NRC's Degraded Piping Program, the concept of using a nonlinear spring element to simulate the response of cracked pipe in dynamic finite element pipe evaluations was initially proposed. The nonlinear spring element is used to represent the moment versus rotation response of the cracked pipe section. The moment-rotation relationship for the crack size and material of interest is determined from either J-estimation scheme analyses or experimental data. In this paper, a number of possible approaches for modeling the nonlinear stiffness of the cracked pipe section are introduced. One approach, modeling the cracked section moment rotation response with a series of spring-slider elements, is discussed in detail. As part of this discussion, results from a series of finite element predictions using the spring-slider nonlinear spring element are compared with the results from a series of dynamic cracked pipe system experiments from the International Piping Integrity Research Group (IPIRG) program

  10. Application of tearing instability analysis for complex crack geometries in nuclear piping

    International Nuclear Information System (INIS)

    Pan, J.; Wilkowski, G.

    1984-01-01

    The analysis of the experimental data of 304 stainless steel pipes using Zahoor and Kanninen's estimation scheme has shown that the J resistance curve of a circumferentially cracked pipe with a simulated internal surface crack around the remaining net section is much lower than the J resistance curve of pipes with a idealized through-wall crack (without a simulated internal surface crack). The implications of the low J at initiation and tearing modulus on the stability analysis of typical BWR piping systems are discussed on the condition that an internal circumferential surface crack is assumed to occur along with a circumferential through-wall crack due to stress corrosion. The results presented here show that the margin of safety is reduced and in some cases instability is predicted due to the low J resistance curve and tearing modulus

  11. Amorphous Diamond MEMS and Sensors

    Energy Technology Data Exchange (ETDEWEB)

    SULLIVAN, JOHN P.; FRIEDMANN, THOMAS A.; ASHBY, CAROL I.; DE BOER, MAARTEN P.; SCHUBERT, W. KENT; SHUL, RANDY J.; HOHLFELDER, ROBERT J.; LAVAN, D.A.

    2002-06-01

    This report describes a new microsystems technology for the creation of microsensors and microelectromechanical systems (MEMS) using stress-free amorphous diamond (aD) films. Stress-free aD is a new material that has mechanical properties close to that of crystalline diamond, and the material is particularly promising for the development of high sensitivity microsensors and rugged and reliable MEMS. Some of the unique properties of aD include the ability to easily tailor film stress from compressive to slightly tensile, hardness and stiffness 80-90% that of crystalline diamond, very high wear resistance, a hydrophobic surface, extreme chemical inertness, chemical compatibility with silicon, controllable electrical conductivity from insulating to conducting, and biocompatibility. A variety of MEMS structures were fabricated from this material and evaluated. These structures included electrostatically-actuated comb drives, micro-tensile test structures, singly- and doubly-clamped beams, and friction and wear test structures. It was found that surface micromachined MEMS could be fabricated in this material easily and that the hydrophobic surface of the film enabled the release of structures without the need for special drying procedures or the use of applied hydrophobic coatings. Measurements using these structures revealed that aD has a Young's modulus of {approx}650 GPa, a tensile fracture strength of 8 GPa, and a fracture toughness of 8 MPa{center_dot}m {sup 1/2}. These results suggest that this material may be suitable in applications where stiction or wear is an issue. Flexural plate wave (FPW) microsensors were also fabricated from aD. These devices use membranes of aD as thin as {approx}100 nm. The performance of the aD FPW sensors was evaluated for the detection of volatile organic compounds using ethyl cellulose as the sensor coating. For comparable membrane thicknesses, the aD sensors showed better performance than silicon nitride based sensors. Greater

  12. Effects of weld residual stresses on crack-opening area analysis of pipes for LBB applications

    Energy Technology Data Exchange (ETDEWEB)

    Dong, P.; Rahman, S.; Wilkowski, G. [and others

    1997-04-01

    This paper summarizes four different studies undertaken to evaluate the effects of weld residual stresses on the crack-opening behavior of a circumferential through-wall crack in the center of a girth weld. The effect of weld residual stress on the crack-opening-area and leak-rate analyses of a pipe is not well understood. There are no simple analyses to account for these effects, and, therefore, they are frequently neglected. The four studies involved the following efforts: (1) Full-field thermoplastic finite element residual stress analyses of a crack in the center of a girth weld, (2) A comparison of the crack-opening displacements from a full-field thermoplastic residual stress analysis with a crack-face pressure elastic stress analysis to determine the residual stress effects on the crack-opening displacement, (3) The effects of hydrostatic testing on the residual stresses and the resulting crack-opening displacement, and (4) The effect of residual stresses on crack-opening displacement with different normal operating stresses.

  13. Effects of weld residual stresses on crack-opening area analysis of pipes for LBB applications

    International Nuclear Information System (INIS)

    Dong, P.; Rahman, S.; Wilkowski, G.

    1997-01-01

    This paper summarizes four different studies undertaken to evaluate the effects of weld residual stresses on the crack-opening behavior of a circumferential through-wall crack in the center of a girth weld. The effect of weld residual stress on the crack-opening-area and leak-rate analyses of a pipe is not well understood. There are no simple analyses to account for these effects, and, therefore, they are frequently neglected. The four studies involved the following efforts: (1) Full-field thermoplastic finite element residual stress analyses of a crack in the center of a girth weld, (2) A comparison of the crack-opening displacements from a full-field thermoplastic residual stress analysis with a crack-face pressure elastic stress analysis to determine the residual stress effects on the crack-opening displacement, (3) The effects of hydrostatic testing on the residual stresses and the resulting crack-opening displacement, and (4) The effect of residual stresses on crack-opening displacement with different normal operating stresses

  14. A Crack Closure Model and Its Application to Vibrothermography Nondestructive Evaluation

    Science.gov (United States)

    Schiefelbein, Bryan Edward

    Vibrothermography nondestructive evaluation (NDE) is in the early stages of research and development, and there exists uncertainty in the fundamental mechanisms and processes by which heat generation occurs. Holland et al. have developed a set of tools which simulate and predict the outcome of a vibrothermography inspection by breaking the inspection into three distinct processes: vibrational excitation, heat generation, and thermal imaging. The stage of vibrothermography which is not well understood is the process by which vibrations are converted to heat at the crack surface. It has been shown that crack closure and closure state impact the resulting heat generation. Despite this, research into the link between partial crack closure and vibrothermography is limited. This work seeks to rectify this gap in knowledge by modeling the behavior of a partially closed crack in response to static external loading and a dynamic vibration. The residual strains left by the plastic wake during fatigue crack growth manifest themselves as contact stresses acting at the crack surface interface. In response to an applied load below the crack opening stress, the crack closure state will evolve, but the crack will remain partially closed. The crack closure model developed in this work is based in linear elastic fracture mechanics (LEFM) and describes the behavior of a partially closed crack in response to a tensile external load and non-uniform closure stress distribution. The model builds on work by Fleck to describe the effective length, crack opening displacement, and crack tip stress field for a partially closed crack. These quantities are solved for by first establishing an equilibrium condition which governs the effective or apparent length of the partially closed crack. The equilibrium condition states that, under any external or crack surface loading, the effective crack tip will be located where the effective stress intensity factor is zero. In LEFM, this is equivalent to

  15. Buffering Implications for the Design Space of Streaming MEMS Storage

    NARCIS (Netherlands)

    Khatib, M.G.; Abelmann, Leon; Preas, Kathy

    2011-01-01

    Emerging nanotechnology-based systems encounter new non-functional requirements. This work addresses MEMS storage, an emerging technology that promises ultrahigh density and energy-efficient storage devices. We study the buffering requirement of MEMS storage in streaming applications. We show that

  16. The COD concept and its application to fracture mechanical evaluation of cracked components

    International Nuclear Information System (INIS)

    Kockelmann, H.

    1984-01-01

    Based on a comprehensive literature study, this report critically evaluates the current state of experiences with the COD concept in fracture mechanics. First the concept is explained and the procedure of materials testing with a view to fracture mechanics is discussed in detail with emphasis on: The definition of crack shape modification; the procedure to detect crack modification, with subsequent comparison; the determination of material characteristics; the impact on the characteristics of the crack tip opening and the dispersion of results. The correlation between crack tip opening characteristics and notch impact strength is explained, and the methods applied for analysis of the streses affecting the structural components are shown. The design-based and failure threshold curves and the treatment of real crack geometries are also discussed. Problems still to be solved are shown. (orig./HP) [de

  17. Nano-cracks in a synthetic graphite composite for nuclear applications

    Science.gov (United States)

    Liu, Dong; Cherns, David

    2018-05-01

    Mrozowski nano-cracks in nuclear graphite were studied by transmission electron microscopy and selected area diffraction. The material consisted of single crystal platelets typically 1-2 nm thick and stacked with large relative rotations around the c-axis; individual platelets had both hexagonal and cubic stacking order. The lattice spacing of the (0002) planes was about 3% larger at the platelet boundaries which were the source of a high fraction of the nano-cracks. Tilting experiments demonstrated that these cracks were empty, and not, as often suggested, filled by amorphous material. In addition to conventional Mrozowski cracks, a new type of nano-crack is reported, which originates from the termination of a graphite platelet due to crystallographic requirements. Both types are crucial to understanding the evolution of macro-scale graphite properties with neutron irradiation.

  18. Application of ultrasonic inspection technique for crack depth sizing on nickel based alloy weld. Part 3. Establishment of UT procedure for crack depth sizing by phased array UT

    International Nuclear Information System (INIS)

    Hirasawa, Taiji; Okada, Hisao; Fukutomi, Hiroyuki

    2012-01-01

    Recently, it is reported that the primary water stress corrosion cracking (PWSCC) was occurred at the nickel based alloy weld components such as steam generator safe end weld, reactor vessel safe end weld, and so on, in PWR. Defect detection and sizing is important in order to ensure the reliable operation and life extension of nuclear power plants. In the reactor vessel safe end weld, it was impossible to measure crack depth of PWSCC. The crack was detected in the axial direction of the safe end weld. Furthermore, the crack had some features such as shallow, large aspect ratio (ratio of crack depth and length), sharp geometry of crack tip, and so on. Therefore, development and improvement of defect detection and sizing capabilities for ultrasonic testing (UT) is required. Phased array technique was applied to nickel based alloy weld specimen with SCC cracks. From the experimental results, good accuracy of crack depth sizing by phased array UT for the inside inspection was shown. From these results, UT procedure for crack depth sizing was verified. Therefore, effectiveness of phased array UT for crack depth sizing in the nickel based alloy welds was shown. (author)

  19. Additive manufacturing of three-dimensional (3D) microfluidic-based microelectromechanical systems (MEMS) for acoustofluidic applications.

    Science.gov (United States)

    Cesewski, Ellen; Haring, Alexander P; Tong, Yuxin; Singh, Manjot; Thakur, Rajan; Laheri, Sahil; Read, Kaitlin A; Powell, Michael D; Oestreich, Kenneth J; Johnson, Blake N

    2018-06-13

    Three-dimensional (3D) printing now enables the fabrication of 3D structural electronics and microfluidics. Further, conventional subtractive manufacturing processes for microelectromechanical systems (MEMS) relatively limit device structure to two dimensions and require post-processing steps for interface with microfluidics. Thus, the objective of this work is to create an additive manufacturing approach for fabrication of 3D microfluidic-based MEMS devices that enables 3D configurations of electromechanical systems and simultaneous integration of microfluidics. Here, we demonstrate the ability to fabricate microfluidic-based acoustofluidic devices that contain orthogonal out-of-plane piezoelectric sensors and actuators using additive manufacturing. The devices were fabricated using a microextrusion 3D printing system that contained integrated pick-and-place functionality. Additively assembled materials and components included 3D printed epoxy, polydimethylsiloxane (PDMS), silver nanoparticles, and eutectic gallium-indium as well as robotically embedded piezoelectric chips (lead zirconate titanate (PZT)). Electrical impedance spectroscopy and finite element modeling studies showed the embedded PZT chips exhibited multiple resonant modes of varying mode shape over the 0-20 MHz frequency range. Flow visualization studies using neutrally buoyant particles (diameter = 0.8-70 μm) confirmed the 3D printed devices generated bulk acoustic waves (BAWs) capable of size-selective manipulation, trapping, and separation of suspended particles in droplets and microchannels. Flow visualization studies in a continuous flow format showed suspended particles could be moved toward or away from the walls of microfluidic channels based on selective actuation of in-plane or out-of-plane PZT chips. This work suggests additive manufacturing potentially provides new opportunities for the design and fabrication of acoustofluidic and microfluidic devices.

  20. The mechanics and physics of fracturing: application to thermal aspects of crack propagation and to fracking.

    Science.gov (United States)

    Cherepanov, Genady P

    2015-03-28

    By way of introduction, the general invariant integral (GI) based on the energy conservation law is presented, with mention of cosmic, gravitational, mass, elastic, thermal and electromagnetic energy of matter application to demonstrate the approach, including Coulomb's Law generalized for moving electric charges, Newton's Law generalized for coupled gravitational/cosmic field, the new Archimedes' Law accounting for gravitational and surface energy, and others. Then using this approach the temperature track behind a moving crack is found, and the coupling of elastic and thermal energies is set up in fracturing. For porous materials saturated with a fluid or gas, the notion of binary continuum is used to introduce the corresponding GIs. As applied to the horizontal drilling and fracturing of boreholes, the field of pressure and flow rate as well as the fluid output from both a horizontal borehole and a fracture are derived in the fluid extraction regime. The theory of fracking in shale gas reservoirs is suggested for three basic regimes of the drill mud permeation, with calculating the shape and volume of the local region of the multiply fractured rock in terms of the pressures of rock, drill mud and shale gas. © 2015 The Author(s) Published by the Royal Society. All rights reserved.

  1. EDITORIAL: Selected papers from the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2010) Selected papers from the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2010)

    Science.gov (United States)

    Reynaerts, Dominiek; Vullers, Ruud

    2011-10-01

    This special section of Journal of Micromechanics and Microengineering features papers selected from the 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2010). The workshop was organized in Leuven, Belgium from 30 November to 3 December 2010 by Katholieke Universiteit Leuven and the imec/Holst Centre. This was a special PowerMEMS Workshop, for several reasons. First of all, we celebrated the 10th anniversary of the workshop: the first PowerMEMS meeting was organized in Sendai, Japan in 2000. None of the organizers or participants of this first meeting could have predicted the impact of the workshop over the next decade. The second reason was that, for the first time, the conference organization spanned two countries: Belgium and the Netherlands. Thanks to the advances in information technology, teams from Katholieke Universiteit Leuven (Belgium) and the imec/Holst Centre in Eindhoven (the Netherlands) have been able to work together seamlessly as one team. The objective of the PowerMEMS Workshop is to stimulate innovation in micro and nanotechnology for power generation and energy conversion applications. Its scope ranges from integrated microelectromechanical systems (MEMS) for power generation, dissipation, harvesting, and management, to novel nanostructures and materials for energy-related applications. True to the objective of the PowerMEMSWorkshop, the 2010 technical program covered a broad range of energy related research, ranging from the nanometer to the millimeter scale, discussed in 5 invited and 52 oral presentations, and 112 posters. This special section includes 14 papers covering vibration energy harvesters, thermal applications and micro power systems. Finally, we wish to express sincere appreciation to the members of the International Steering Committee, the Technical Program Committee and last but not least the Local Organizing Committee. This special issue was edited in

  2. On the dynamic fracture toughness and crack tip strain behavior of nuclear pressure vessel steel: Application of electromagnetic force

    International Nuclear Information System (INIS)

    Yagawa, G.; Yoshimura, S.

    1986-01-01

    This paper is concerned with the application of the electromagnetic force to the determination of the dynamic fracture toughness of materials. Taken is an edge-cracked specimen which carries a transient electric current and is simply supported in a steady magnetic field. As a result of their interaction, the dynamic electromagnetic force occurs in the whole body of the specimen, which is then deformed to fracture in the opening mode of cracking. Using the electric potential and the J-R curve methods to determine the dynamic crack initiation point in the experiment, together with the finite element method to calculate the extended J-integral with the effects of the electromagnetic force and inertia, the dynamic fracture toughness values of nuclear pressure vessel steel A508 class 3 are evaluated over a wide temperature range from lower to upper shelves. The strain distribution near the crack tip in the dynamic process of fracture is also obtained by applying a computer picture processing. (orig.)

  3. The application of an atomistic J-integral to a ductile crack.

    Science.gov (United States)

    Zimmerman, Jonathan A; Jones, Reese E

    2013-04-17

    In this work we apply a Lagrangian kernel-based estimator of continuum fields to atomic data to estimate the J-integral for the emission dislocations from a crack tip. Face-centered cubic (fcc) gold and body-centered cubic (bcc) iron modeled with embedded atom method (EAM) potentials are used as example systems. The results of a single crack with a K-loading compare well to an analytical solution from anisotropic linear elastic fracture mechanics. We also discovered that in the post-emission of dislocations from the crack tip there is a loop size-dependent contribution to the J-integral. For a system with a finite width crack loaded in simple tension, the finite size effects for the systems that were feasible to compute prevented precise agreement with theory. However, our results indicate that there is a trend towards convergence.

  4. AHTD cracking protocol application with automated distress survey for design and management.

    Science.gov (United States)

    2011-03-09

    Manual surveys of pavement cracking have problems associated with variability, repeatability, processing : speed, and cost. If conducted in the field, safety and related liability of manual survey present challenges : to highway agencies. Therefore a...

  5. Development of fatigue crack propagation models for engineering applications at elevated temperatures

    Energy Technology Data Exchange (ETDEWEB)

    Tomkins, B.

    1975-05-01

    The value of modelling the fatigue crack propagation process is discussed and current models are examined in the light of increasing knowledge of crack tip deformation. Elevated temperature fatigue is examined in detail as an area in which models could contribute significantly to engineering design. A model is developed which examines the role of time-dependent creep cavitation on the failure process in an interactive creep-fatigue situation. (auth)

  6. Application of a Cycle Jump Technique for Acceleration of Fatigue Crack Growth Simulation

    DEFF Research Database (Denmark)

    Moslemian, Ramin; Berggreen, Christian; Karlsson, A.M.

    2010-01-01

    A method for accelerated simulation of fatigue crack growth in a bimaterial interface is proposed. To simulate fatigue crack growth in a bimaterial interface a routine is developed in the commercial finite element code ANSYS and a method to accelerate the simulation is implemented. The proposed m...... of the simulation show that with fair accuracy, using the cycle jump method, more than 70% reduction in computation time can be achieved....

  7. A demonstration of mitigation of environmentally-assisted cracking by the application of a tensile overload

    International Nuclear Information System (INIS)

    James, L.A.

    1997-01-01

    Environmentally-assisted cracking (EAC) of low-alloy steels in high-temperature aqueous environments typical of those employed in light-water reactor (LWR) systems has been a subject of considerable interest since the pioneering work of Kondo et al demonstrated significantly higher fatigue crack propagation (FCP) rates in water than would be expected in an air environment under similar conditions. Here, environmentally-assisted cracking (EAC) of low-alloy steels in elevated temperature aqueous environments is readily observed in many laboratory experiments conducted in autoclaves, yet the observation of EAC in actual components operating in the same environments is quite rare. Mass transport of sulfides from the crack enclave by diffusion and convection occurring in operating components provides one plausible explanation to this apparent paradox. Another contribution to EAC mitigation may also arise from the non-constant stress amplitudes typical for many operating components. This paper provides a demonstration of how a single tensile overload to 40% above a steady-state maximum fatigue stress can retard subsequent crack growth at the steady-state level for a sufficient period of time that diffusion mass transport can reduce the crack-tip sulfide concentration to a level below that necessary to sustain EAC

  8. A demonstration of mitigation of environmentally-assisted cracking by the application of a tensile overload

    Energy Technology Data Exchange (ETDEWEB)

    James, L.A.

    1997-02-01

    Environmentally-assisted cracking (EAC) of low-alloy steels in high-temperature aqueous environments typical of those employed in light-water reactor (LWR) systems has been a subject of considerable interest since the pioneering work of Kondo et al demonstrated significantly higher fatigue crack propagation (FCP) rates in water than would be expected in an air environment under similar conditions. Here, environmentally-assisted cracking (EAC) of low-alloy steels in elevated temperature aqueous environments is readily observed in many laboratory experiments conducted in autoclaves, yet the observation of EAC in actual components operating in the same environments is quite rare. Mass transport of sulfides from the crack enclave by diffusion and convection occurring in operating components provides one plausible explanation to this apparent paradox. Another contribution to EAC mitigation may also arise from the non-constant stress amplitudes typical for many operating components. This paper provides a demonstration of how a single tensile overload to 40% above a steady-state maximum fatigue stress can retard subsequent crack growth at the steady-state level for a sufficient period of time that diffusion mass transport can reduce the crack-tip sulfide concentration to a level below that necessary to sustain EAC.

  9. Corrosion cracking

    International Nuclear Information System (INIS)

    Goel, V.S.

    1985-01-01

    This book presents the papers given at a conference on alloy corrosion cracking. Topics considered at the conference included the effect of niobium addition on intergranular stress corrosion cracking, corrosion-fatigue cracking in fossil-fueled-boilers, fracture toughness, fracture modes, hydrogen-induced thresholds, electrochemical and hydrogen permeation studies, the effect of seawater on fatigue crack propagation of wells for offshore structures, the corrosion fatigue of carbon steels in seawater, and stress corrosion cracking and the mechanical strength of alloy 600

  10. RF MEMS theory, design, and technology

    CERN Document Server

    Rebeiz, Gabriel M

    2003-01-01

    Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

  11. New dynamic silicon photonic components enabled by MEMS technology

    Science.gov (United States)

    Errando-Herranz, Carlos; Edinger, Pierre; Colangelo, Marco; Björk, Joel; Ahmed, Samy; Stemme, Göran; Niklaus, Frank; Gylfason, Kristinn B.

    2018-02-01

    Silicon photonics is the study and application of integrated optical systems which use silicon as an optical medium, usually by confining light in optical waveguides etched into the surface of silicon-on-insulator (SOI) wafers. The term microelectromechanical systems (MEMS) refers to the technology of mechanics on the microscale actuated by electrostatic actuators. Due to the low power requirements of electrostatic actuation, MEMS components are very power efficient, making them well suited for dense integration and mobile operation. MEMS components are conventionally also implemented in silicon, and MEMS sensors such as accelerometers, gyros, and microphones are now standard in every smartphone. By combining these two successful technologies, new active photonic components with extremely low power consumption can be made. We discuss our recent experimental work on tunable filters, tunable fiber-to-chip couplers, and dynamic waveguide dispersion tuning, enabled by the marriage of silicon MEMS and silicon photonics.

  12. Optical MEMS for earth observation payloads

    Science.gov (United States)

    Rodrigues, B.; Lobb, D. R.; Freire, M.

    2017-11-01

    An ESA study has been taken by Lusospace Ltd and Surrey Satellite Techonoly Ltd (SSTL) into the use of optical Micro Eletro-Mechanical Systems (MEMS) for earth Observation. A review and analysis was undertaken of the Micro-Optical Electro-Mechanical Systems (MOEMS) available in the market with potential application in systems for Earth Observation. A summary of this review will be presented. Following the review two space-instrument design concepts were selected for more detailed analysis. The first was the use of a MEMS device to remove cloud from Earth images. The concept is potentially of interest for any mission using imaging spectrometers. A spectrometer concept was selected and detailed design aspects and benefits evaluated. The second concept developed uses MEMS devices to control the width of entrance slits of spectrometers, to provide variable spectral resolution. This paper will present a summary of the results of the study.

  13. MEMS tunable grating micro-spectrometer

    Science.gov (United States)

    Tormen, Maurizio; Lockhart, R.; Niedermann, P.; Overstolz, T.; Hoogerwerf, A.; Mayor, J.-M.; Pierer, J.; Bosshard, C.; Ischer, R.; Voirin, G.; Stanley, R. P.

    2017-11-01

    The interest in MEMS based Micro-Spectrometers is increasing due to their potential in terms of flexibility as well as cost, low mass, small volume and power savings. This interest, especially in the Near-Infrared and Mid- Infrared, ranges from planetary exploration missions to astronomy, e.g. the search for extra solar planets, as well as to many other terrestrial fields of application such as, industrial quality and surface control, chemical analysis of soil and water, detection of chemical pollutants, exhausted gas analysis, food quality control, process control in pharmaceuticals, to name a few. A compact MEMS-based Spectrometer for Near- Infrared and Mid-InfraRed operation have been conceived, designed and demonstrated. The design based on tunable MEMS blazed grating, developed in the past at CSEM [1], achieves state of the art results in terms of spectral resolution, operational wavelength range, light throughput, overall dimensions, and power consumption.

  14. Evaluation of MEMS-Based Wireless Accelerometer Sensors in Detecting Gear Tooth Faults in Helicopter Transmissions

    Science.gov (United States)

    Lewicki, David George; Lambert, Nicholas A.; Wagoner, Robert S.

    2015-01-01

    The diagnostics capability of micro-electro-mechanical systems (MEMS) based rotating accelerometer sensors in detecting gear tooth crack failures in helicopter main-rotor transmissions was evaluated. MEMS sensors were installed on a pre-notched OH-58C spiral-bevel pinion gear. Endurance tests were performed and the gear was run to tooth fracture failure. Results from the MEMS sensor were compared to conventional accelerometers mounted on the transmission housing. Most of the four stationary accelerometers mounted on the gear box housing and most of the CI's used gave indications of failure at the end of the test. The MEMS system performed well and lasted the entire test. All MEMS accelerometers gave an indication of failure at the end of the test. The MEMS systems performed as well, if not better, than the stationary accelerometers mounted on the gear box housing with regards to gear tooth fault detection. For both the MEMS sensors and stationary sensors, the fault detection time was not much sooner than the actual tooth fracture time. The MEMS sensor spectrum data showed large first order shaft frequency sidebands due to the measurement rotating frame of reference. The method of constructing a pseudo tach signal from periodic characteristics of the vibration data was successful in deriving a TSA signal without an actual tach and proved as an effective way to improve fault detection for the MEMS.

  15. Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

    Directory of Open Access Journals (Sweden)

    Di Chen

    2007-05-01

    Full Text Available Electrostatic micro-electro-mechanical system (MEMS is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.

  16. Characterization of dielectric charging in RF MEMS

    NARCIS (Netherlands)

    Herfst, R.W.; Huizing, H.G.A.; Steeneken, P.G.; Schmitz, Jurriaan

    2005-01-01

    Capacitive RF MEMS switches show great promise for use in wireless communication devices such as mobile phones, but the successful application of these switches is hindered by the reliability of the devices: charge injection in the dielectric layer (SiN) can cause irreversible stiction of the moving

  17. A MEMS-based, wireless, biometric-like security system

    Science.gov (United States)

    Cross, Joshua D.; Schneiter, John L.; Leiby, Grant A.; McCarter, Steven; Smith, Jeremiah; Budka, Thomas P.

    2010-04-01

    We present a system for secure identification applications that is based upon biometric-like MEMS chips. The MEMS chips have unique frequency signatures resulting from fabrication process variations. The MEMS chips possess something analogous to a "voiceprint". The chips are vacuum encapsulated, rugged, and suitable for low-cost, highvolume mass production. Furthermore, the fabrication process is fully integrated with standard CMOS fabrication methods. One is able to operate the MEMS-based identification system similarly to a conventional RFID system: the reader (essentially a custom network analyzer) detects the power reflected across a frequency spectrum from a MEMS chip in its vicinity. We demonstrate prototype "tags" - MEMS chips placed on a credit card-like substrate - to show how the system could be used in standard identification or authentication applications. We have integrated power scavenging to provide DC bias for the MEMS chips through the use of a 915 MHz source in the reader and a RF-DC conversion circuit on the tag. The system enables a high level of protection against typical RFID hacking attacks. There is no need for signal encryption, so back-end infrastructure is minimal. We believe this system would make a viable low-cost, high-security system for a variety of identification and authentication applications.

  18. Piezoelectric MEMS resonators

    CERN Document Server

    Piazza, Gianluca

    2017-01-01

    This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associate...

  19. MEMS fluidic actuator

    Science.gov (United States)

    Kholwadwala, Deepesh K [Albuquerque, NM; Johnston, Gabriel A [Trophy Club, TX; Rohrer, Brandon R [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Okandan, Murat [Albuquerque, NM

    2007-07-24

    The present invention comprises a novel, lightweight, massively parallel device comprising microelectromechanical (MEMS) fluidic actuators, to reconfigure the profile, of a surface. Each microfluidic actuator comprises an independent bladder that can act as both a sensor and an actuator. A MEMS sensor, and a MEMS valve within each microfluidic actuator, operate cooperatively to monitor the fluid within each bladder, and regulate the flow of the fluid entering and exiting each bladder. When adjacently spaced in a array, microfluidic actuators can create arbitrary surface profiles in response to a change in the operating environment of the surface. In an embodiment of the invention, the profile of an airfoil is controlled by independent extension and contraction of a plurality of actuators, that operate to displace a compliant cover.

  20. Designing Computer Systems with MEMS-Based Storage

    National Research Council Canada - National Science Library

    Schlosser, Steven

    2000-01-01

    .... An exciting new storage technology based on microelectromechanical systems (MEMS) is poised to fill a large portion of this performance gap, significantly reduce power consumption, and enable many new classes of applications...

  1. Investigation on the Crack Behaviour in Kevlar 49 Based Composite Materials using Extended Finite Element Method for Aerospace Applications

    Science.gov (United States)

    Handa, Danish; Sekhar Dondapati, Raja; Kumar, Abhinav

    2017-08-01

    Ductile to brittle transition (DTBT) is extensively observed in materials under cryogenic temperatures, thereby observing brittle failure due to the non-resistance of crack propagation. Owing to its outstanding mechanical and thermal properties, Kevlar 49 composites are widely used in aerospace applications under cryogenic temperatures. Therefore, in this paper, involving the assumption of linear elastic fracture mechanics (LEFM), mechanical characterization of Kevlar 49 composite is done using Extended Finite Element Method (X-FEM) technique in Abaqus/CAE software. Further, the failure of Kevlar 49 composites due to the propagation of crack at room temperature and the cryogenic temperature is investigated. Stress, strain and strain energy density as a function of the width of the Kevlar specimen is predicted, indicates that Kevlar 49 composites are suitable for use under cryogenic temperatures.

  2. Application of the potential-drop method to measurements of hydrogen-induced sub-critical crack growth in zirconium-2.5 wt% niobium

    International Nuclear Information System (INIS)

    Simpson, L.A.; Clarke, C.F.

    1977-10-01

    Adaptation of the potential-drop method of crack-following to the problem of hydrogen-induced sub-critical crack growth in Zr-2.5% Nb is described. Reasons for non-linearity in the calibration of crack extension against potential drop in compact tension specimens are discussed. It is shown that despite non-linearities, careful comparison of fractographic features with the potential-drop record can lead to a continuous plot of crack velocity against time or stress intensity factor. Procedures for correcting data through temperature and load changes are also described. The application of the technique to studies of the mechanism of hydrogen crack growth is illustrated with several examples. (author)

  3. Development of three-dimensional ENRICHED FREE MESH METHOD and its application to crack analysis

    International Nuclear Information System (INIS)

    Suzuki, Hayato; Matsubara, Hitoshi; Ezawa, Yoshitaka; Yagawa, Genki

    2010-01-01

    In this paper, we describe a method for three-dimensional high accurate analysis of a crack included in a large-scale structure. The Enriched Free Mesh Method (EFMM) is a method for improving the accuracy of the Free Mesh Method (FMM), which is a kind of meshless method. First, we developed an algorithm of the three-dimensional EFMM. The elastic problem was analyzed using the EFMM and we find that its accuracy compares advantageously with the FMM, and the number of CG iterations is smaller. Next, we developed a method for calculating the stress intensity factor by employing the EFMM. The structure with a crack was analyzed using the EFMM, and the stress intensity factor was calculated by the developed method. The analysis results were very well in agreement with reference solution. It was shown that the proposed method is very effective in the analysis of the crack included in a large-scale structure. (author)

  4. Ultrasonic signal processing and B-SCAN imaging for nondestructive testing. Application to under - cladding - cracks

    International Nuclear Information System (INIS)

    Theron, G.

    1988-02-01

    Crack propagation under the stainless steel cladding of nuclear reactor vessels is monitored by ultrasonic testing. This work study signal processing to improve detection and sizing of defects. Two possibilities are examined: processing of each individual signal and simultaneous processing of all the signals giving a B-SCAN image. The bibliographic study of time-frequency methods shows that they are not suitable for pulses. Then decomposition in instantaneous frequency and envelope is used. Effect of interference of 2 close echoes on instantaneous frequency is studies. The deconvolution of B-SCAN images is obtained by the transducer field. A point-by-point deconvolution method, less noise sensitive, is developed. B-SCAN images are processed in 2 phases: interface signal processing and deconvolution. These calculations improve image accuracy and dynamics. Water-stell interface and ferritic-austenitic interface are separated. Echoes of crack top are visualized and crack-hole differentiation is improved [fr

  5. Fatigue crack growth and endurance data on 9% Cr 1% Mo steels for AGR applications

    International Nuclear Information System (INIS)

    Priddle, E.K.

    1987-01-01

    Experimental investigations have been carried out on 9%Cr 1%Mo steels to examine: (1) The significance of carburisation on the fatigue endurance of plain and welded boiler tubes, and tube spacer strip; (2) the high cycle fatigue endurance of spacer strip and spacer weld metal; (3) fatigue crack growth rates in spacer strip and spacer weld metal. This report summarises the results of these investigations and where necessary compares the data to that in current data sheets. The effects of carburisation are variable depending on the structure and type of carburisation. The fatigue endurance properties of spacer strip and spacer weld metal are also similar and need not be considered separately for assessment or design purposes. Fatigue crack growth rates in spacer strip and space weld metal are similar and are influenced by both stress ratio and temperature. A design curve from a fast reactor data sheet may be used as an upper bound to these fatigue crack growth results. (author)

  6. The application of RBI-concept to ultrasonic measurement of fatigue cracks

    Energy Technology Data Exchange (ETDEWEB)

    Pitkaenen, J.; Saerkiniemi, P.; Kauppinen, P. [VTT Manufacturing Technology, Espoo (Finland)

    1998-12-31

    In many power plants there are problem areas, which are not included in the official inspection programs. Flaws can be induced during service due to the service conditions in components and welded joints. These can lead to failures, which cause unforeseen shutdowns during operation and unscheduled repairs have to be earned out. The basic idea of Risk Based Inspection (RBI) methodology is to include this kind of objects in the inspection program. In this presentation two possible objects for RBI are described - thermal fatigue cracking in process piping and fatigue cracking in spinning fly wheel. (orig.) 4 refs.

  7. The application of RBI-concept to ultrasonic measurement of fatigue cracks

    Energy Technology Data Exchange (ETDEWEB)

    Pitkaenen, J; Saerkiniemi, P; Kauppinen, P [VTT Manufacturing Technology, Espoo (Finland)

    1999-12-31

    In many power plants there are problem areas, which are not included in the official inspection programs. Flaws can be induced during service due to the service conditions in components and welded joints. These can lead to failures, which cause unforeseen shutdowns during operation and unscheduled repairs have to be earned out. The basic idea of Risk Based Inspection (RBI) methodology is to include this kind of objects in the inspection program. In this presentation two possible objects for RBI are described - thermal fatigue cracking in process piping and fatigue cracking in spinning fly wheel. (orig.) 4 refs.

  8. Development and field application of a nonlinear ultrasonic modulation technique for fatigue crack detection without reference data from an intact condition

    Science.gov (United States)

    Lim, Hyung Jin; Kim, Yongtak; Koo, Gunhee; Yang, Suyoung; Sohn, Hoon; Bae, In-hwan; Jang, Jeong-Hwan

    2016-09-01

    In this study, a fatigue crack detection technique, which detects a fatigue crack without relying on any reference data obtained from the intact condition of a target structure, is developed using nonlinear ultrasonic modulation and applied to a real bridge structure. Using two wafer-type lead zirconate titanate (PZT) transducers, ultrasonic excitations at two distinctive frequencies are applied to a target inspection spot and the corresponding ultrasonic response is measured by another PZT transducer. Then, the nonlinear modulation components produced by a breathing-crack are extracted from the measured ultrasonic response, and a statistical classifier, which can determine if the nonlinear modulation components are statistically significant in comparison with the background noise level, is proposed. The effectiveness of the proposed fatigue crack detection technique is experimentally validated using the data obtained from aluminum plates and aircraft fitting-lug specimens under varying temperature and loading conditions, and through a field testing of Yeongjong Grand Bridge in South Korea. The uniqueness of this study lies in that (1) detection of a micro fatigue crack with less than 1 μm width and fatigue cracks in the range of 10-20 μm in width using nonlinear ultrasonic modulation, (2) automated detection of fatigue crack formation without using reference data obtained from an intact condition, (3) reliable and robust diagnosis under varying temperature and loading conditions, (4) application of a local fatigue crack detection technique to online monitoring of a real bridge.

  9. Optical MEMS for Earth observation

    Science.gov (United States)

    Liotard, Arnaud; Viard, Thierry; Noell, Wilfried; Zamkotsian, Frédéric; Freire, Marco; Guldimann, Benedikt; Kraft, Stefan

    2017-11-01

    Due to the relatively large number of optical Earth Observation missions at ESA, this area is interesting for new space technology developments. In addition to their compactness, scalability and specific task customization, optical MEMS could generate new functions not available with current technologies and are thus candidates for the design of future space instruments. Most mature components for space applications are the digital mirror arrays, the micro-deformable mirrors, the programmable micro diffraction gratings and tiltable micromirrors. A first selection of market-pull and techno-push concepts is done. In addition, some concepts are coming from outside Earth Observation. Finally two concepts are more deeply analyzed. The first concept is a programmable slit for straylight control for space spectro-imagers. This instrument is a push-broom spectroimager for which some images cannot be exploited because of bright sources in the field-of-view. The proposed concept consists in replacing the current entrance spectrometer slit by an active row of micro-mirrors. The MEMS will permit to dynamically remove the bright sources and then to obtain a field-of-view with an optically enhanced signal-to-noise ratio. The second concept is a push-broom imager for which the acquired spectrum can be tuned by optical MEMS. This system is composed of two diffractive elements and a digital mirror array. The first diffractive element spreads the spectrum. A micromirror array is set at the location of the spectral focal plane. By putting the micro-mirrors ON or OFF, we can select parts of field-of-view or spectrum. The second diffractive element then recombines the light on a push-broom detector. Dichroics filters, strip filter, band-pass filter could be replaced by a unique instrument.

  10. Nondestructive surface profiling of hidden MEMS using an infrared low-coherence interferometric microscope

    Science.gov (United States)

    Krauter, Johann; Osten, Wolfgang

    2018-03-01

    There are a wide range of applications for micro-electro-mechanical systems (MEMS). The automotive and consumer market is the strongest driver for the growing MEMS industry. A 100 % test of MEMS is particularly necessary since these are often used for safety-related purposes such as the ESP (Electronic Stability Program) system. The production of MEMS is a fully automated process that generates 90 % of the costs during the packaging and dicing steps. Nowadays, an electrical test is carried out on each individual MEMS component before these steps. However, after encapsulation, MEMS are opaque to visible light and other defects cannot be detected. Therefore, we apply an infrared low-coherence interferometer for the topography measurement of those hidden structures. A lock-in algorithm-based method is shown to calculate the object height and to reduce ghost steps due to the 2π -unambiguity. Finally, measurements of different MEMS-based sensors are presented.

  11. MEMS sensor technologies for human centred applications in healthcare, physical activities, safety and environmental sensing: a review on research activities in Italy.

    Science.gov (United States)

    Ciuti, Gastone; Ricotti, Leonardo; Menciassi, Arianna; Dario, Paolo

    2015-03-17

    Over the past few decades the increased level of public awareness concerning healthcare, physical activities, safety and environmental sensing has created an emerging need for smart sensor technologies and monitoring devices able to sense, classify, and provide feedbacks to users' health status and physical activities, as well as to evaluate environmental and safety conditions in a pervasive, accurate and reliable fashion. Monitoring and precisely quantifying users' physical activity with inertial measurement unit-based devices, for instance, has also proven to be important in health management of patients affected by chronic diseases, e.g., Parkinson's disease, many of which are becoming highly prevalent in Italy and in the Western world. This review paper will focus on MEMS sensor technologies developed in Italy in the last three years describing research achievements for healthcare and physical activity, safety and environmental sensing, in addition to smart systems integration. Innovative and smart integrated solutions for sensing devices, pursued and implemented in Italian research centres, will be highlighted, together with specific applications of such technologies. Finally, the paper will depict the future perspective of sensor technologies and corresponding exploitation opportunities, again with a specific focus on Italy.

  12. MEMS Sensor Technologies for Human Centred Applications in Healthcare, Physical Activities, Safety and Environmental Sensing: A Review on Research Activities in Italy

    Directory of Open Access Journals (Sweden)

    Gastone Ciuti

    2015-03-01

    Full Text Available Over the past few decades the increased level of public awareness concerning healthcare, physical activities, safety and environmental sensing has created an emerging need for smart sensor technologies and monitoring devices able to sense, classify, and provide feedbacks to users’ health status and physical activities, as well as to evaluate environmental and safety conditions in a pervasive, accurate and reliable fashion. Monitoring and precisely quantifying users’ physical activity with inertial measurement unit-based devices, for instance, has also proven to be important in health management of patients affected by chronic diseases, e.g., Parkinson’s disease, many of which are becoming highly prevalent in Italy and in the Western world. This review paper will focus on MEMS sensor technologies developed in Italy in the last three years describing research achievements for healthcare and physical activity, safety and environmental sensing, in addition to smart systems integration. Innovative and smart integrated solutions for sensing devices, pursued and implemented in Italian research centres, will be highlighted, together with specific applications of such technologies. Finally, the paper will depict the future perspective of sensor technologies and corresponding exploitation opportunities, again with a specific focus on Italy.

  13. Review and synthesis of stress intensity factor solutions applicable to cracks in bolts

    International Nuclear Information System (INIS)

    James, L.A.; Mills, W.J.

    1988-01-01

    The available literature for stress intensity factor solutions for cracks in round bars, both threaded and unthreaded, subjected to either tension or bending, is reviewed. The results are synthesized into a form that is appropriate for the analysis of bolts and studs. (author)

  14. Stress corrosion cracking susceptibility of selected materials for steam plant bolting applications

    Energy Technology Data Exchange (ETDEWEB)

    Mayer, P.; Noga, J.O.; Ogundele, G.

    1996-12-01

    The incidence of alloy steel bolting failure in nuclear and fossil fired generating plants was discussed. The problem manifests itself in the form of intergranular stress corrosion cracking. A study was conducted to rank the susceptibility of three materials (Alloy AISI, type 4140, Alloy ASTM A564-92AXM 13 and Inconel 718) to stress corrosion cracking and to determine threshold stress intensity factors of currently used and alternate alloys in service environments typically encountered in steam generating utility plants. Although most alloy steel bolting failures have involved Cr-Mo, failures have also been reported for all the above mentioned materials. Attempts to minimize the occurrence of stress corrosion cracking have involved a ban on molybdenum disulphide, limiting bolt tightening torque and placing an upper limit on bolt hardness, and by correlation on tensile strength. Slow strain rate and wedge opening-loading specimen tests were used to evaluate commonly used and superior alternative bolting materials. Electrochemical polarization tests were also conducted. Threshold stresses in a H{sub 2}S environment were determined according to NACE standard TM-01-77. Results showed that, to a certain degree, all tested materials were susceptible to stress corrosion cracking. They ranked as follows from best to worst performance: (1) the Inconel 718, (2) alloy SM 13, and (3) alloy 4140. 9 refs., 20 tabs., 34 figs.

  15. Application of a robust vibration-based non-destructive method for detection of fatigue cracks in structures

    International Nuclear Information System (INIS)

    Razi, Pejman; Esmaeel, Ramadan A; Taheri, Farid

    2011-01-01

    This paper presents the application of a novel vibration-based technique for detecting fatigue cracks in structures. The method utilizes the empirical mode decomposition method (EMD) to establish an effective energy-based damage index. To investigate the feasibility of the method, fatigue cracks of different sizes were introduced in an aluminum beam subjected to a cyclic load under a three-point bending configuration. The vibration signals corresponding to the healthy and the damaged states of the beam were acquired via piezoceramic sensors. The signals were then processed by the proposed methodology to obtain the damage indices. In addition, for the sake of comparison, the frequency and damping analysis were performed on the test specimen. The results of this study concluded with two major observations. Firstly, the method was highly successful in not only predicting the presence of the fatigue crack, but also in quantifying its progression. Secondly, the proposed energy-based damage index was proved to be superior to the frequency-based methods in terms of sensitivity to the damage detection and quantification. As a result, this technique could be regarded as an efficient non-destructive tool, since it is simple, cost-effective and does not rely on analytical modeling of structures. In addition, the capability of the finite element method (FEM) in mimicking the experiments, and hence for consideration as an effective tool for conducting future parametric studies, was also investigated

  16. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    As a field, Microelectromechanical Systems (MEMS) has matured over the last two decades to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of ...

  17. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of a MEMS device or structure using conven- tional CMOS processes or their variants was the ...

  18. MEMS Solar Generators

    OpenAIRE

    Grbovic, Dragoslav; Osswald, Sebastian

    2011-01-01

    Approved for public release; distribution is unlimited Using MEMS bimaterial structures to build highly efficient solar energy generators. This is a novel approach that utilizes developments in the area of bimaterial sensors and applies them in the field of solar energy harvesting.

  19. European MEMS foundries

    Science.gov (United States)

    Salomon, Patric R.

    2003-01-01

    According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.

  20. Mechanisms of fatigue in LIGA Ni MEMS thin films

    International Nuclear Information System (INIS)

    Yang, Y.; Imasogie, B.I.; Allameh, S.M.; Boyce, B.; Lian, K.; Lou, J.; Soboyejo, W.O.

    2007-01-01

    This paper presents the results of an experimental study of the mechanisms of fatigue in LIGA Ni micro-electro-mechanical systems (MEMS) thin films with micro-scale columnar and nano-scale equiaxed grains. Stress-life behavior is reported for films with thicknesses of 70 and 270 μm. The stress-life data are compared with previously reported data for Ni MEMS films and bulk Ni. The films with the nano-scale grains (15 nm average grain size) are shown to have higher strength and fatigue resistance (stress-life data) than those with columnar grain structures. The thicker films (with a columnar microstructure) are also shown to have comparable fatigue life to annealed Ni, while the thinner films (with a columnar microstructure) have comparable fatigue life to wrought Ni. The underlying mechanisms of crack nucleation and growth are elucidated via scanning and transmission electron microscopy. These reveal the formation of slip bands and surface oxides and crystallographic surface/sub-surface crack nucleation and growth in the films with the columnar structures. Surface and corner crack nucleations (from pre-existing defects) are observed in the nanostructured films. The implications of the results are discussed for the analyses of fatigue in nickel MEMS structures

  1. Radioisotope Power Sources for MEMS Devices,

    International Nuclear Information System (INIS)

    Blanchard, J.P.

    2001-01-01

    Microelectromechanical systems (MEMS) comprise a rapidly expanding research field with potential applications varying from sensors in airbags to more recent optical applications. Depending on the application, these devices often require an on-board power source for remote operation, especially in cases requiring operation for an extended period of time. Previously suggested power sources include fossil fuels and solar energy, but nuclear power sources may provide significant advantages for certain applications. Hence, the objective of this study is to establish the viability of using radioisotopes to power realistic MEMS devices. A junction-type battery was constructed using silicon and a 63 Ni liquid source. A source volume containing 64 microCi provided a power of ∼0.07 nW. A more novel application of nuclear sources for MEMS applications involves the creation of a resonator that is driven by charge collection in a cantilever beam. Preliminary results have established the feasibility of this concept, and future work will optimize the design for various applications

  2. Applicability of a 'marker-technique' to support the examination of crack growth behaviour in brittle and ductile Ni-alloys at 500 and 750 C

    International Nuclear Information System (INIS)

    Schwarze, D.; Schubert, F.

    1999-12-01

    The crack growth behaviour of materials for application in turbines at temperatures of 500- 750 C has been investigated. The creep and fatigue service loadings of a real turbine disc were simulated by introducing hold-times. The materials tested were the superalloy PM N18, Inconel 617 and the intermetallic phase β-NiAl of nominally stoichiometric composition. The crack growth tests were conducted in air and in vacuum (10 -5 mbar) to assess the influence of the test atmosphere. One of the main objectives was to develop a marker method and its application, as support for the crack growth tests carried out. The width of the marker required for the marker bands could be chosen through the number of stress cycles or the crack growth increment in the marker-cycle. At 500 C, the crack surfaces of the CT specimens of Inconel 617 and PM N18 exhibited mixed fractures with trans- and intercrystalline regions. The fracture development could be divided into three, classical parts. At his temperature for both alloys the K I concept for the evaluation of the crack growth may be used. The RCT specimens of the intermetallic phase β-NiAl fractured in a completely brittle manner with no measurable time to failure. At 500 C, Inconel 617 and especially PM N18 were well suited to the use of the marker method. Measurements of the distances between the marker bands gave a good estimate of the crack growth rates. At the higher test temperature of 750 C, the crack growth rates and the proportion of intercrystalline fracture increased for Inconel 617 and PM N18. In all three materials, the formation of pores and dimpled fracture was observed, especially at high ΔK I values, and the coarse-grained β-NiAl exhibited higher crack growth rates than the fine-grained material. For this temperature the evaluation of the crack growth experiments should be by the K I concept for PM N18 and for Inconel 617 the C * concept is recommended. At the higher test temperature, the increased plasticity of

  3. Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

    KAUST Repository

    Agrawal, Richa

    2015-05-18

    The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

  4. Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

    KAUST Repository

    Agrawal, Richa; Beidaghi, Majid; Chen, Wei; Wang, Chunlei

    2015-01-01

    The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

  5. Optimization and simulation of MEMS rectilinear ion trap

    Directory of Open Access Journals (Sweden)

    Huang Gang

    2015-04-01

    Full Text Available In this paper, the design of a MEMS rectilinear ion trap was optimized under simulated conditions. The size range of the MEMS rectilinear ion trap’s electrodes studied in this paper is measured at micron scale. SIMION software was used to simulate the MEMS rectilinear ion trap with different sizes and different radio-frequency signals. The ion-trapping efficiencies of the ion trap under these different simulation conditions were obtained. The ion-trapping efficiencies were compared to determine the performance of the MEMS rectilinear ion trap in different conditions and to find the optimum conditions. The simulation results show that for the ion trap at micron scale or smaller, the optimized length–width ratio was 0.8, and a higher frequency of radio-frequency signal is necessary to obtain a higher ion-trapping efficiency. These results have a guiding role in the process of developing MEMS rectilinear ion traps, and great application prospects in the research fields of the MEMS rectilinear ion trap and the MEMS mass spectrometer.

  6. Advanced MEMS systems for optical communication and imaging

    International Nuclear Information System (INIS)

    Horenstein, M N; Sumner, R; Freedman, D S; Datta, M; Kani, N; Miller, P; Stewart, J B; Cornelissen, S

    2011-01-01

    Optical communication and adaptive optics have emerged as two important uses of micro-electromechanical (MEMS) devices based on electrostatic actuation. Each application uses a mirror whose surface is altered by applying voltages of up to 300 V. Previous generations of adaptive-optic mirrors were large (∼1 m) and required the use of piezoelectric transducers. Beginning in the mid-1990s, a new class of small MEMS mirrors (∼1 cm) were developed. These mirrors are now a commercially available, mature technology. This paper describes three advanced applications of MEMS mirrors. The first is a mirror used for corona-graphic imaging, whereby an interferometric telescope blocks the direct light from a distant star so that nearby objects such as planets can be seen. We have developed a key component of the system: a 144-channel, fully-scalable, high-voltage multiplexer that reduces power consumption to only a few hundred milliwatts. In a second application, a MEMS mirror comprises part of a two-way optical communication system in which only one node emits a laser beam. The other node is passive, incorporating a retro-reflective, electrostatic MEMS mirror that digitally encodes the reflected beam. In a third application, the short (∼100-ns) pulses of a commercially-available laser rangefinder are returned by the MEMS mirror as a digital data stream. Suitable low-power drive systems comprise part of the system design.

  7. RF MEMS: status of the industry and roadmaps

    Science.gov (United States)

    Bouchaud, Jeremie; Wicht, Henning

    2005-01-01

    Microsystems for Radio Frequency applications, known as RF MEMS, have entered the commercialization phase in 2003. Bulk Acoustic Wave filters are already produced in series and first commercial samples of switches are available. On the other hand, reliability and packaging problems are still a major hurdle especially for switches and tunable capacitors. Will RF MEMS hold their promise to be one of the future major businesses for MEMS? The presentation will give an overview on RF MEMS applications and market players. WTC will highlight technical challenges that still have to be solved to open mass markets such as mobile telephony and WLAN. WTC will also present applications of RF MEMS and opportunities in niche markets with high added value like military and space applications. WTC will provide a regional analysis and compare R&D focus and public funding situation in North America, Europe and Asia. Finally, WTC will present an updated product roadmap market forecast for RF MEMS devices for the 2004-2008 time period.

  8. Application of failure assessment diagram methods to cracked straight pipes and elbows

    International Nuclear Information System (INIS)

    Ainsworth, R.A.; Gintalas, M.; Sahu, M.K.; Chattopadhyay, J.; Dutta, B.K.

    2016-01-01

    This paper reports fracture assessments of large-scale straight pipes and elbows of various pipe diameters and crack sizes. The assessments estimate the load for ductile fracture initiation using the failure assessment diagram method. Recent solutions in the literature for stress intensity factor and limit load provide the analysis inputs. An assessment of constraint effects is also performed using recent solutions for elastic T-stress. It is found that predictions of initiation load are close to the experimental values for straight pipes under pure bending. For elbows, there is generally increased conservatism in the sense that the experimental loads are greater than those predicted. The effects of constraint are found not to be a major contributor to the initiation fracture assessments but may have some influence on the ductile crack extension. - Highlights: • This paper presents assessments of the loads for ductile fracture initiation in 21 large-scale piping tests. • Modern stress intensity factor and limit load solutions were used for standard failure assessment diagram methods. • This leads to generally accurate assessments of the loads for ductile crack initiation. • The effects of constraint are found not to be a major contributor to the initiation fracture assessments.

  9. Application of computer assisted moire to the study of a crack tip

    Science.gov (United States)

    Sciammarella, C. A.; Albertazzi, A., Jr.; Mourikes, J.

    The basic principles of computer assisted moire are discussed. The influence of the image sensor and its finite dimensions on the sampling theorem requirements is discussed. Criteria for the selection of grating pitch on the basis of the spatial bandwidth of the pattern to be observed and the requirements arising from sensitivity considerations are given. The method is used to analyze the strain field in the neighborhood of the crack tip of a standard ASTM compact tension specimen. From the displacements the strains are computed, and from the strains the stresses are obtained using the generalized Ramberg-Osgood stress strain relationship. The stresses are used to compute the values for the J-integral in several circuits surrounding the crack. Good agreement is obtained between the values of the stress intensity factors obtained by different methods. The plastic region surrounding the crack does not show a HRR field and thus the usual rationale to justify the J-integral methods must be re-evaluated.

  10. The relative stress-corrosion-cracking susceptibility of candidate aluminum-lithium alloys for aerospace applications

    Science.gov (United States)

    Pizzo, P. P.

    1982-01-01

    Stress corrosion tests of Al-Li-Cu powder metallurgy alloys are described. Alloys investigated were Al-2.6% Li-1.4% and Al-2.6% Li-1.4% Cu-1.6% Mg. The base properties of the alloys were characterized. Process, heat treatment, and size/orientational effects on the tensile and fracture behavior were investigated. Metallurgical and electrochemical conditions are identified which provide reproducible and controlled parameters for stress corrosion evaluation. Preliminary stress corrosion test results are reported. Both Al-Li-Cu alloys appear more susceptible to stress corrosion crack initiation than 7075-T6 aluminum, with the magnesium bearing alloy being the most susceptible. Tests to determine the threshold stress intensity for the base and magnesium bearing alloys are underway. Twelve each, bolt loaded DCB type specimens are under test (120 days) and limited crack growth in these precracked specimens has been observed. General corrosion in the aqueous sodium chloride environment is thought to be obscuring results through crack tip blunting.

  11. Mechanics of curved surfaces, with application to surface-parallel cracks

    Science.gov (United States)

    Martel, Stephen J.

    2011-10-01

    The surfaces of many bodies are weakened by shallow enigmatic cracks that parallel the surface. A re-formulation of the static equilibrium equations in a curvilinear reference frame shows that a tension perpendicular to a traction-free surface can arise at shallow depths even under the influence of gravity. This condition occurs if σ11k1 + σ22k2 > ρg cosβ, where k1 and k2 are the principal curvatures (negative if convex) at the surface, σ11 and σ22 are tensile (positive) or compressive (negative) stresses parallel to the respective principal curvature arcs, ρ is material density, g is gravitational acceleration, and β is the surface slope. The curvature terms do not appear in equilibrium equations in a Cartesian reference frame. Compression parallel to a convex surface thus can cause subsurface cracks to open. A quantitative test of the relationship above accounts for where sheeting joints (prominent shallow surface-parallel fractures in rock) are abundant and for where they are scarce or absent in the varied topography of Yosemite National Park, resolving key aspects of a classic problem in geology: the formation of sheeting joints. Moreover, since the equilibrium equations are independent of rheology, the relationship above can be applied to delamination or spalling caused by surface-parallel cracks in many materials.

  12. Determination of Paris' law constants and crack length evolution via Extended and Unscented Kalman filter: An application to aircraft fuselage panels

    Science.gov (United States)

    Wang, Yiwei; Binaud, Nicolas; Gogu, Christian; Bes, Christian; Fu, Jian

    2016-12-01

    Prediction of fatigue crack length in aircraft fuselage panels is one of the key issues for aircraft structural safety since it helps prevent catastrophic failures. Accurate estimation of crack length propagation is also meaningful for helping develop aircraft maintenance strategies. Paris' law is often used to capture the dynamics of fatigue crack propagation in metallic material. However, uncertainties are often present in the crack growth model, measured crack size and pressure differential in each flight and need to be accounted for accurate prediction. The aim of this paper is to estimate the two unknown Paris' law constants m and C as well as the crack length evolution by taking into account these uncertainties. Due to the nonlinear nature of the Paris' law, we propose here an on-line estimation algorithm based on two widespread nonlinear filtering techniques, Extended Kalman filter (EKF) and Unscented Kalman filter (UKF). The numerical experiments indicate that both EKF and UKF estimated the crack length well and accurately identified the unknown parameters. Although UKF is theoretical superior to EKF, in this Paris' law application EKF is comparable in accuracy to UKF and requires less computational expense.

  13. Converting MEMS technology into profits

    Science.gov (United States)

    Bryzek, Janusz

    1998-08-01

    This paper discusses issues related to transitioning a company from the advanced technology development phase (with a particular focus on MEMS) to a profitable business, with emphasis on start-up companies. It includes several case studies from (primarily) NovaSensor MEMS development history. These case studies illustrate strategic problems with which advanced MEMS technology developers have to be concerned. Conclusions from these case studies could be used as checkpoints for future MEMS developers to increase probability of profitable operations. The objective for this paper is to share the author's experience from multiple MEMS start-ups to accelerate development of the MEMS market by focusing state- of-the-art technologists on marketing issues.

  14. Structural Engineering of Metal-Mesh Structure Applicable for Transparent Electrodes Fabricated by Self-Formable Cracked Template

    Directory of Open Access Journals (Sweden)

    Yeong-gyu Kim

    2017-08-01

    Full Text Available Flexible and transparent conducting electrodes are essential for future electronic devices. In this study, we successfully fabricated a highly-interconnected metal-mesh structure (MMS using a self-formable cracked template. The template—fabricated from colloidal silica—can be easily formed and removed, presenting a simple and cost-effective way to construct a randomly and uniformly networked MMS. The structure of the MMS can be controlled by varying the spin-coating speed during the coating of the template solution or by stacking of metal-mesh layers. Through these techniques, the optical transparency and sheet resistance of the MMS can be designed for a specific purpose. A double-layered Al MMS showed high optical transparency (~80% in the visible region, low sheet resistance (~20 Ω/sq, and good flexibility under bending test compared with a single-layered MMS, because of its highly-interconnected wire structure. Additionally, we identified the applicability of the MMS in the case of practical devices by applying it to electrodes of thin-film transistors (TFTs. The TFTs with MMS electrodes showed comparable electrical characteristics to those with conventional film-type electrodes. The cracked template can be used for the fabrication of a mesh structure consisting of any material, so it can be used for not only transparent electrodes, but also various applications such as solar cells, sensors, etc.

  15. MEMS Actuators for Improved Performance and Durability

    Science.gov (United States)

    Yearsley, James M.

    Micro-ElectroMechanical Systems (MEMS) devices take advantage of force-scaling at length scales smaller than a millimeter to sense and interact with directly with phenomena and targets at the microscale. MEMS sensors found in everyday devices like cell-phones and cars include accelerometers, gyros, pressure sensors, and magnetic sensors. MEMS actuators generally serve more application specific roles including micro- and nano-tweezers used for single cell manipulation, optical switching and alignment components, and micro combustion engines for high energy density power generation. MEMS rotary motors are actuators that translate an electric drive signal into rotational motion and can serve as rate calibration inputs for gyros, stages for optical components, mixing devices for micro-fluidics, etc. Existing rotary micromotors suffer from friction and wear issues that affect lifetime and performance. Attempts to alleviate friction effects include surface treatment, magnetic and electrostatic levitation, pressurized gas bearings, and micro-ball bearings. The present work demonstrates a droplet based liquid bearing supporting a rotary micromotor that improves the operating characteristics of MEMS rotary motors. The liquid bearing provides wear-free, low-friction, passive alignment between the rotor and stator. Droplets are positioned relative to the rotor and stator through patterned superhydrophobic and hydrophilic surface coatings. The liquid bearing consists of a central droplet that acts as the motor shaft, providing axial alignment between rotor and stator, and satellite droplets, analogous to ball-bearings, that provide tip and tilt stable operation. The liquid bearing friction performance is characterized through measurement of the rotational drag coefficient and minimum starting torque due to stiction and geometric effects. Bearing operational performance is further characterized by modeling and measuring stiffness, environmental survivability, and high

  16. Slow strain rate stress corrosion cracking under multiaxial deformation conditions: technique and application to admiralty brass

    International Nuclear Information System (INIS)

    Blanchard, W.K.; Heldt, L.A.; Koss, D.

    1984-01-01

    A set of straightforward experimental techniques are described for the examination of slow strain rate stress corrosion cracking (SCC) of sheet deforming under nearly all multiaxial deformation conditions which result in sheet thinning. Based on local fracture strain as a failure criterion, the results contrast stress corrosion susceptibility in uniaxial tension with those in both plane strain and balanced biaxial tension. These results indicate that the loss of ductility of the brass increases as the stress state changes from uniaxial toward balanced biaxial tension

  17. High Volume Manufacturing and Field Stability of MEMS Products

    Science.gov (United States)

    Martin, Jack

    Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are

  18. THE DISTRIBUTION OF CHLORPYRIFOS FOLLOWING A CRACK AND CREVICE TYPE APPLICATION IN THE U.S. EPA INDOOR AIR QUALITY RESEARCH HOUSE

    Science.gov (United States)

    A study was conducted in the U.S. EPA Indoor Air Quality Research House to determine the spatial and temporal distribution of chlorpyrifos following a professional crack and crevice application in the kitchen. Following the application, measurements were made in the kitchen, de...

  19. CHLORPYRIFOS ACCUMULATION PATTERNS FOR CHILD ACCESSIBLE SURFACES AND OBJECTIVES AND URINARY METABOLITE EXCRETION BY CHILDREN FOR TWO-WEEKS AFTER CRACK-AND-CREVICE APPLICATION

    Science.gov (United States)

    The Children's-Post-Pesticide-Application-Exposure-Study (CPPAES) was conducted to look at the distribution of chlorpyrifos within a home environment for a 2-week period following a routine professional crack-and-crevice application, and to determine the amount of the chlorpyrifo...

  20. THE DISTRIBUTION OF CHLORPYRIFOS FOLLOWING A CRACK AND CREVICE TYPE APPLICATION IN THE U.S. EPA INDOOR AIR QUALITY TEST HOUSE

    Science.gov (United States)

    A study was conducted in the U.S. EPA Indoor Air Quality Test House to determine the spatial and temporal distribution of chlorpyrifos following a professional crack and crevice application in the kitchen. Following the application, measurements were made in the kitchen, den a...

  1. SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

    KAUST Repository

    Ramadan, Khaled S.

    2012-04-01

    Polymer based microelectromechanical systems (MEMS) micromachining is finding more interest in research and applications. This is due to its low cost and less time processing compared with silicon MEMS. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic devices. In addition to being processed with low cost, it is a biocompatible material with good mechanical properties. Also, amorphous silicon (α-Si) has found use as a sacrificial layer in silicon MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed using amorphous silicon (α-Si) as a sacrificial layer. Electrostatic actuation and sensing is used in many MEMS applications. SU-8 is a dielectric material which limits its direct use in electrostatic actuation. This thesis provides a MEMS process with two conductive metal electrodes that can be used for out-of-plane electrostatic applications like MEMS switches and variable capacitors. The process provides the fabrication of dimples that can be conductive or non-conductive to facilitate more flexibility for MEMS designers. This SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were tuned for two sets of thicknesses which are thin (5-10μm) and thick (130μm). Chevron bent-beam structures and different suspended beams (cantilevers and bridges) were fabricated to characterize the SU-8 process through extracting the density, Young’s Modulus and the Coefficient of Thermal Expansion (CTE) of SU-8. Also, the process was tested and used as an educational tool through which different MEMS structures were fabricated including MEMS switches, variable capacitors and thermal actuators.

  2. Waveguide-Integrated MEMS Concepts for Tunable Millimeter-Wave Systems

    OpenAIRE

    Baghchehsaraei, Zargham

    2014-01-01

    This thesis presents two families of novel waveguide-integrated components based on millimeter-wave microelectromechanical systems (MEMS) for reconfigurable systems. The first group comprises V-band (50–75 GHz) and W-band (75–110 GHz) waveguide switches and switchable irises, and their application as switchable cavity resonators, and tunable bandpass filters implemented by integration of novel MEMS-reconfigurable surfaces into a rectangular waveguide. The second category comprises MEMS-based ...

  3. Recent advances in MEMS radiation detectors for improving radiation safety in nuclear reactors

    International Nuclear Information System (INIS)

    Bhisikar, Abhay

    2016-01-01

    MEMS (micro-electro-mechanical-system) is a core technology that leverages integrated circuit (IC) fabrication technology, builds ultra-miniaturized components and, enables radical new system applications. When considering MEMS radiation detectors; they are the specific micromechanical structures which are designed to sense doses of radiations. The present article reviews the most recent progress made in the domain of MEMS ionizing radiation sensors at international level for nuclear reactors which can be relevant to Indian context. (author)

  4. An absorptive single-pole four-throw switch using multiple-contact MEMS switches and its application to a monolithic millimeter-wave beam-forming network

    International Nuclear Information System (INIS)

    Lee, Sanghyo; Kim, Jong-Man; Kim, Yong-Kweon; Kwon, Youngwoo

    2009-01-01

    In this paper, a new absorptive single-pole four-throw (SP4T) switch based on multiple-contact switching is proposed and integrated with a Butler matrix to demonstrate a monolithic beam-forming network at millimeter waves (mm waves). In order to simplify the switching driving circuit and reduce the number of unit switches in an absorptive SP4T switch, the individual switches were replaced with long-span multiple-contact switches using stress-free single-crystalline-silicon MEMS technology. This approach improves the mechanical stability as well as the manufacturing yield, thereby allowing successful integration into a monolithic beam former. The fabricated absorptive SP4T MEMS switch shows insertion loss less than 1.3 dB, return losses better than 11 dB at 30 GHz and wideband isolation performance higher than 39 dB from 20 to 40 GHz. The absorptive SP4T MEMS switch is integrated with a 4 × 4 Butler matrix on a single chip to implement a monolithic beam-forming network, directing beam into four distinct angles. Array factors from the measured data show that the proposed absorptive SPnT MEMS switch can be effectively used for high-performance mm-wave beam-switching systems. This work corresponds to the first demonstration of a monolithic beam-forming network using switched beams

  5. Quantitative Accelerated Life Testing of MEMS Accelerometers.

    Science.gov (United States)

    Bâzu, Marius; Gălăţeanu, Lucian; Ilian, Virgil Emil; Loicq, Jerome; Habraken, Serge; Collette, Jean-Paul

    2007-11-20

    Quantitative Accelerated Life Testing (QALT) is a solution for assessing thereliability of Micro Electro Mechanical Systems (MEMS). A procedure for QALT is shownin this paper and an attempt to assess the reliability level for a batch of MEMSaccelerometers is reported. The testing plan is application-driven and contains combinedtests: thermal (high temperature) and mechanical stress. Two variants of mechanical stressare used: vibration (at a fixed frequency) and tilting. Original equipment for testing at tiltingand high temperature is used. Tilting is appropriate as application-driven stress, because thetilt movement is a natural environment for devices used for automotive and aerospaceapplications. Also, tilting is used by MEMS accelerometers for anti-theft systems. The testresults demonstrated the excellent reliability of the studied devices, the failure rate in the"worst case" being smaller than 10 -7 h -1 .

  6. Application of Acid Cracking and Fenton Processes inTreating Olive Mill Wastewater

    Directory of Open Access Journals (Sweden)

    Majid Aliabadi

    2006-03-01

    Full Text Available In recent years, the growth in the industries of olive oil extraction has brought about a number of environmental problems. The waste water resulting from olive oil extraction can not be naturally degraded due to the presence of phenol, volatile fatty acids, catchin, and other recalcitrants.In recent years advanced oxidation processes based on hydroxyl radical are paid special attention by scientific, research and industrial centers to degrade the pollutants. In this study, a combination of acid cracking and advanced oxidation process in terms of Fenton process have been studied. Results showed that acid cracking can remove 97, 47, 30, 63 and 57 percent of Turbidity, COD, Total Phenols, Color and Aromaticity, respectively. Fenton process in pH=3 at optimal conditions can remove 57, 97, 18 and 32 percent of COD, Total Phenols, Color and Aromaticity, respectively. Necessary time of reaction was 4 hrs and optimum concentration of H2O2 and Fe2+ ions was determined 0. 5 M and 0.02 M, respectively. Increasing temperature in the range of 25-35°C and type of iron used(ferric or ferrous has no considerable effect in  the efficiency of the process.

  7. Application of X-ray fractography for estimation of crack resistance of structural materials

    International Nuclear Information System (INIS)

    Vikulin, A.V.; Veselov, V.A.; Georgiev, M.N.; Strok, L.P.

    1984-01-01

    An attempt is made to correlate the depth of plasticity zone h with characteristics of fracture toughness Ksub(Ic) and Ksub(c) at different temperatures, using roentgenography. The steel 38KhMA(0.38 mass.% C; 0.28Si; 0.54Mn; 0.015S; 0.011P; 1.12Cr; 0.26Ni; 0.08Cu; 0.25Mo; 0.02V; 0.02Ti) has been investigated. It is shown, that the decrease in fracture energy consumption with the test temperature decrease is conditioned by two effects: decrease in plastic zone dimensions near crack top and weakening of intensity of deformation processes in it. It is possible to use the method of roentgenography to predict crack resistance, accepting the measured value for plastic zone dimension and using formulas of fracture mechanics. Fracture toughness characteristics thus calculated agree satisfactorily with the experimental ones. Fractographic characteristics, established in the process of X-ray structural study of fractures, and strength characteristics, obtained in the process of tests for fracture toughness, are closely bound linear dependence in a wide temperature range

  8. Low Frequency Phased Array Application for Crack Detection in Cast Austenitic Piping

    International Nuclear Information System (INIS)

    Anderson, Michael T.; Cumblidge, Stephen E.; Doctor, Steven R.

    2006-01-01

    As part of a multi-year program funded by the United States Nuclear Regulatory Commission (US NRC) to address nondestructive examination (NDE) reliability of inservice inspection (ISI) programs, studies conducted at the Pacific Northwest National Laboratory (PNNL) in Richland, Washington, have focused on assessing novel NDE approaches for the inspection of coarse-grained, cast stainless steel reactor components. The primary objective of this work is to provide information to the US NRC on the utility, effectiveness and reliability of ultrasonic testing (UT) as related to the ISI of primary piping components in US commercial nuclear power plants. This paper describes progress, recent developments and results from an assessment of a portion of the work relating to the ultrasonic low frequency phased array inspection technique. Westinghouse Owner's Group (WOG) cast stainless steel pipe segments with thermal and mechanical fatigue cracks, PNNL samples containing thermal fatigue cracks and several blank vintage specimens having very coarse grains that are representative of early centrifugally cast piping installed in PWRs, were used for assessing the inspection method. The phased array approach was implemented using an R/D Tech Tomoscan III system operating at 1.0 MHz and 500 kHz, providing composite volumetric images of the samples. Several dual, transmit-receive, custom designed low-frequency arrays were employed in laboratory trials. Results from laboratory studies for assessing detection, localization and length sizing effectiveness are discussed.

  9. Electron beam application for regeneration of catalysts used in refinery cracking units

    International Nuclear Information System (INIS)

    Kondo, Fernando Mantovani; Duarte, Celina Lopes; Sato, Ivone Mulako; Salvador, Vera Lucia Ribeiro; Calvo, Wilson Aparecido Parejo

    2013-01-01

    A catalyst is a substance that alters the rate of a reaction. The process of catalysis is essential to the modern day manufacturing industry, mainly in Fluid Catalytic Cracking Process (FCC) units. However, long-term exploitation of oil and gas processing catalysts leads to formation of carbon-and sulfur-containing structures of coke and dense products on the catalyst surface. They block reactive catalyst sites and reduce the catalytic activity. The main advantage of radiation processing by electron beam (EB) and gamma rays is chain cracking reaction in crude oil. Otherwise, under exposure to ionic radiation, considerable structure modification of equilibrium silica-alumina catalyst from FCC process may occur, in addition to the removal of impurities. The conditions applied in the irradiation range (20-150 kGy) of gamma rays and electron beam were not sufficient to alter the structure of the catalyst, whether for removal of the contaminant nickel, a major contaminant of the FCC catalyst, either to rupture of the crystalline structure either for the future reutilization of chemical elements. Attenuated Total Reflectance - Fourier Transform Infrared Spectroscopy (ATR-FTIR) and Energy Dispersive X-Ray Fluorescence Spectrometry (EDXRFS) analysis were used to characterize and evaluate effects of radiation processing on equilibrium catalysts purification. To evaluate and comprehend the reactive catalyst sites, Scanning Electron Microscopy (SEM) and particle size distribution analyses were carried out. (author)

  10. Review on the Modeling of Electrostatic MEMS

    Directory of Open Access Journals (Sweden)

    Wan-Chun Chuang

    2010-06-01

    Full Text Available Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analysis complex and complicated. This article introduces the physical model of pull-in voltage, dynamic characteristic analysis, air damping effect, reliability, numerical modeling method, and application of electrostatic-driven MEMS devices.

  11. Cracking of reinforced concrete short walls submitted to seismic solicitations - estimation of cracks openings: contribution to the improvement of knowledge, of experimental data to engineering applications

    International Nuclear Information System (INIS)

    Gallitre, E.

    2008-01-01

    Until now, the codified methods of crack opening estimation of reinforced concrete structures are based on formulations taking into account stresses of steels supposed to take again the whole stresses which have led to crack: these methods are not valid in the case of shear solicitations in short walls. With the detailed exploitation of the SAFE campaign, it has been possible to establish a global deformation formulated law. The problem being thus reported on the determination of the distortion, different methods have been tested, the more realistic being those in which non linear calculations involve. This work has ended by a return on the codified methods for nuclear power plants design revealing thus the points able to be improved or adapted. (O.M.)

  12. Cracked gas generator

    Energy Technology Data Exchange (ETDEWEB)

    Abthoff, J; Schuster, H D; Gabler, R

    1976-11-17

    A small cracked-gas generator in a vehicle driven, in particular, by an air combustion engine has been proposed for the economic production of the gases necessary for low toxicity combustion from diesel fuel. This proceeds via catalytic crack-gasification and exploitation of residual heat from exhaust gases. This patent application foresees the insertion of one of the catalysts supporting the cracked-gas reaction in a container through which the reacting mixture for cracked-gas production flows in longitudinal direction. Further, air ducts are embedded in the catalyst through which exhaust gases and fresh air flow in counter direction to the cracked gas flow in the catalyst. The air vents are connected through heat conduction to the catalyst. A cracked gas constituting H/sub 2//CO/CO/sub 2//CH/sub 4/ and H/sub 2/O can be produced from the air-fuel mixture using appropriate catalysts. By the addition of 5 to 25% of cracked gas to the volume of air drawn in by the combustion engine, a more favourable combustion can be achieved compared to that obtained under normal combustion conditions.

  13. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  14. Topology optimized RF MEMS switches

    DEFF Research Database (Denmark)

    Philippine, M. A.; Zareie, H.; Sigmund, Ole

    2013-01-01

    Topology optimization is a rigorous and powerful method that should become a standard MEMS design tool - it can produce unique and non-intuitive designs that meet complex objectives and can dramatically improve the performance and reliability of MEMS devices. We present successful uses of topology...

  15. Electromagnetic actuation in MEMS switches

    DEFF Research Database (Denmark)

    Oliveira Hansen, Roana Melina de; Mátéfi-Tempfli, Mária; Chemnitz, Steffen

    . Electromagnetic actuation is a very promising approach to operate such MEMS and Power MEMS devices, due to the long range, reproducible and strong forces generated by this method, among other advantages. However, the use of electromagnetic actuation in such devices requires the use of thick magnetic films, which...

  16. EDITORIAL: The 7th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion Applications (PowerMEMS 2007)

    Science.gov (United States)

    Hebling, C.; Woias, P.

    2008-10-01

    This special issue of Journal of Micromechanics and Microengineering (JMM) contains a selection of papers from the 7th International Workshop on Micro and Nanotechnologies for Power Generation and Energy Conversion (PowerMEMS 2007). The workshop was held in Freiburg, Germany on 27-29 November 2007 under the joint organization of the Fraunhofer Institute for Solar Energy Systems (FhG-ISE), Freiburg and the Department of Microsystems Engineering (IMTEK) of the Albert-Ludwig-University of Freiburg. PowerMEMS 2007 continues a series of workshops initiated in 2000 in Japan to create an annual discussion forum in the emerging field of micro energy technology. With a single exception in 2001, the workshop has continued as an annual meeting ever since, with a continuous increase in the number of presentations and participants. The program of PowerMEMS 2007 was composed of 2 invited talks, 25 oral talks and 61 poster presentations. From these 88 presentations 16 have been selected for this special issue. It was at the end of 1959 when the Caltech physicist Richard Feynman gave his famous lecture entitled 'There Is Plenty of Room at the Bottom' in which he discussed the possibilities of miniaturization for both storage capacity ('Encyclopaedia Britannica on the head of a pin') as well as micro machining ('rearranging the atoms'), although there were absolutely no technological possibilities in sight for an adequate realization of such ideas. Now, nearly 50 years later, we not only have incredible knowledge about the nanoworld, but even more we are now able to generate microelectromechanical devices which, next to their electronic properties, can integrate physical and analytical functions. Today, Feynman might easily have added a second lecture entitled 'There is Plenty of Energy at the Bottom'. Micro energy technology has seen a tremendous rise in MEMS and material sciences and is regarded today as one of their hot topics. Also, there are more and more companies in this

  17. Critical study of test methods in stress corrosion cracking. Application to stainless steels in chloride environment

    International Nuclear Information System (INIS)

    Ajana, Lotfi

    1985-01-01

    The transposition of results obtained in laboratory to the prediction of in-service material resistance is a crucial problem in the case of stress corrosion cracking (SCC). The search for a SCC test which allows a reliable and realistic classification of stainless steels in chloride environments requires a choice of adequate electrolytes and of mechanical solicitation mode. In this research, the author first justifies the choice of an environment which could be representative of actual service conditions in the case of 5 grades of austenitic steels and 1 grade of austeno-ferric steel. Using a computerized data acquisition and processing system, the author compares the information obtained with two types of test: under constant load and under slow strain rate [fr

  18. MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

    Energy Technology Data Exchange (ETDEWEB)

    TANNER,DANELLE M.; SMITH,NORMAN F.; IRWIN,LLOYD W.; EATON,WILLIAM P.; HELGESEN,KAREN SUE; CLEMENT,J. JOSEPH; MILLER,WILLIAM M.; MILLER,SAMUEL L.; DUGGER,MICHAEL T.; WALRAVEN,JEREMY A.; PETERSON,KENNETH A.

    2000-01-01

    The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

  19. Development of the micro pixel chamber based on MEMS technology

    Science.gov (United States)

    Takemura, T.; Takada, A.; Kishimoto, T.; Komura, S.; Kubo, H.; Matsuoka, Y.; Miuchi, K.; Miyamoto, S.; Mizumoto, T.; Mizumura, Y.; Motomura, T.; Nakamasu, Y.; Nakamura, K.; Oda, M.; Ohta, K.; Parker, J. D.; Sawano, T.; Sonoda, S.; Tanimori, T.; Tomono, D.; Yoshikawa, K.

    2018-02-01

    Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB) technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS), however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS) technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

  20. Digital reflection holography based systems development for MEMS testing

    Science.gov (United States)

    Singh, Vijay Raj; Liansheng, Sui; Asundi, Anand

    2010-05-01

    MEMS are tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers and nanometers. Testing of MEMS device is an important part in carrying out their functional assessment and reliability analysis. Development of systems based on digital holography (DH) for MEMS inspection and characterization is presented in this paper. Two DH reflection systems, table-top and handheld types, are developed depending on the MEMS measurement requirements and their capabilities are presented. The methodologies for the systems are developed for 3D profile inspection and static & dynamic measurements, which is further integrated with in-house developed software that provides the measurement results in near real time. The applications of the developed systems are demonstrated for different MEMS devices for 3D profile inspection, static deformation/deflection measurements and vibration analysis. The developed systems are well suitable for the testing of MEMS and Microsystems samples, with full-field, static & dynamic inspection as well as to monitor micro-fabrication process.

  1. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.

    2017-10-05

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams. In that context, embodiments of gas-triggered MEMS microbeam sensors and switches are described. The microbeam devices can be coated with a Metal-Organic Framework to achieve high sensitivity. For gas sensing, an amplitude-based tracking algorithm can be used to quantify an amount of gas captured by the devices according to frequency shift. Noise analysis is also conducted according to the embodiments, which shows that the microbeam devices have high stability against thermal noise. The microbeam devices are also suitable for the generation of binary sensing information for alarming, for example.

  2. MEMS cost analysis from laboratory to industry

    CERN Document Server

    Freng, Ron Lawes

    2016-01-01

    The World of MEMS; Chapter 2: Basic Fabrication Processes; Chapter 3: Surface Microengineering. High Aspect Ratio Microengineering; Chapter 5: MEMS Testing; Chapter 6: MEMS Packaging. Clean Rooms, Buildings and Plant; Chapter 8: The MEMSCOST Spreadsheet; Chapter 9: Product Costs - Accelerometers. Product Costs - Microphones. MEMS Foundries. Financial Reporting and Analysis. Conclusions.

  3. Modeling of a Piezoelectric MEMS Micropump Dedicated to Insulin Delivery and Experimental Validation Using Integrated Pressure Sensors: Application to Partial Occlusion Management

    Directory of Open Access Journals (Sweden)

    S. Fournier

    2017-01-01

    Full Text Available A numerical model based on equivalent electrical networks has been built to simulate the dynamic behavior of a positive-displacement MEMS micropump dedicated to insulin delivery. This device comprises a reservoir in direct communication with the inlet check valve, a pumping membrane actuated by a piezo actuator, two integrated piezoresistive pressure sensors, an anti-free-flow check valve at the outlet, and finally a fluidic pathway up to the patient cannula. The pressure profiles delivered by the sensors are continuously analyzed during the therapy in order to detect failures like occlusion. The numerical modeling is a reliable way to better understand the behavior of the micropump in case of failure. The experimental pressure profiles measured during the actuation phase have been used to validate the numerical modeling. The effect of partial occlusion on the pressure profiles has been also simulated. Based on this analysis, a new management of partial occlusion for MEMS micropump is finally proposed.

  4. Movable MEMS Devices on Flexible Silicon

    KAUST Repository

    Ahmed, Sally

    2013-05-05

    Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS actuators and sensors can play critical role to extend the application areas of flexible electronics, fabricating movable MEMS devices on flexible substrates is highly challenging. Therefore, this thesis reports a process for fabricating free standing and movable MEMS devices on flexible silicon substrates; MEMS flexure thermal actuators have been fabricated to illustrate the viability of the process. Flexure thermal actuators consist of two arms: a thin hot arm and a wide cold arm separated by a small air gap; the arms are anchored to the substrate from one end and connected to each other from the other end. The actuator design has been modified by adding etch holes in the anchors to suit the process of releasing a thin layer of silicon from the bulk silicon substrate. Selecting materials that are compatible with the release process was challenging. Moreover, difficulties were faced in the fabrication process development; for example, the structural layer of the devices was partially etched during silicon release although it was protected by aluminum oxide which is not attacked by the releasing gas . Furthermore, the thin arm of the thermal actuator was thinned during the fabrication process but optimizing the patterning and etching steps of the structural layer successfully solved this problem. Simulation was carried out to compare the performance of the original and the modified designs for the thermal actuators and to study stress and temperature distribution across a device. A fabricated thermal actuator with a 250 μm long hot arm and a 225 μm long cold arm separated by a 3 μm gap produced a deflection of 3 μm before silicon release, however, the fabrication process must be optimized to obtain fully functioning

  5. Delayed hydride cracking: alternative pre-cracking method

    International Nuclear Information System (INIS)

    Mieza, Juan I.; Ponzoni, Lucio M.E.; Vigna, Gustavo L.; Domizzi, Gladys

    2009-01-01

    The internal components of nuclear reactors built-in Zr alloys are prone to a failure mechanism known as Delayed Hydride Cracking (DHC). This situation has triggered numerous scientific studies in order to measure the crack propagation velocity and the threshold stress intensity factor associated to DHC. Tests are carried out on fatigued pre-crack samples to ensure similar test conditions and comparable results. Due to difficulties in implementing the fatigue pre-crack method it would be desirable to replace it with a pre-crack produced by the same process of DHC, for which is necessary to demonstrate equivalence of this two methods. In this work tests on samples extracted from two Zr-2.5 Nb tubes were conducted. Some of the samples were heat treated to obtain a range in their metallurgical properties as well as different DHC velocities. A comparison between velocities measured in test samples pre-cracked by fatigue and RDIH is done, demonstrating that the pre-cracking method does not affect the measured velocity value. In addition, the incubation (t inc ), which is the time between the application of the load and the first signal of crack propagation, in samples pre-cracked by RDIH, was measured. It was found that these times are sufficiently short, even in the worst cases (lower speed) and similar to the ones of fatigued pre-cracked samples. (author)

  6. Simulation of Shear and Bending Cracking in RC Beam: Material Model and its Application to Impact

    Science.gov (United States)

    Mokhatar, S. N.; Sonoda, Y.; Zuki, S. S. M.; Kamarudin, A. F.; Noh, M. S. Md

    2018-04-01

    This paper presents a simple and reliable non-linear numerical analysis incorporated with fully Lagrangian method namely Smoothed Particle Hydrodynamics (SPH) to predict the impact response of the reinforced concrete (RC) beam under impact loading. The analysis includes the simulation of the effects of high mass low-velocity impact load falling on beam structures. Three basic ideas to present the localized failure of structural elements are: (1) the accurate strength of concrete and steel reinforcement during the short period (dynamic), Dynamic Increase Factor (DIF) has been employed for the effect of strain rate on the compression and tensile strength (2) linear pressure-sensitive yield criteria (Drucker-Prager type) with a new volume dependent Plane-Cap (PC) hardening in the pre-peak regime is assumed for the concrete, meanwhile, shear-strain energy criterion (Von-Mises) is applied to steel reinforcement (3) two kinds of constitutive equation are introduced to simulate the crushing and bending cracking of the beam elements. Then, these numerical analysis results were compared with the experimental test results.

  7. Damage assessment of low-cycle fatigue by crack growth prediction. Development of growth prediction model and its application

    International Nuclear Information System (INIS)

    Kamaya, Masayuki; Kawakubo, Masahiro

    2012-01-01

    In this study, the fatigue damage was assumed to be equivalent to the crack initiation and its growth, and fatigue life was assessed by predicting the crack growth. First, a low-cycle fatigue test was conducted in air at room temperature under constant cyclic strain range of 1.2%. The crack initiation and change in crack size during the test were examined by replica investigation. It was found that a crack of 41.2 μm length was initiated almost at the beginning of the test. The identified crack growth rate was shown to correlate well with the strain intensity factor, whose physical meaning was discussed in this study. The fatigue life prediction model (equation) under constant strain range was derived by integrating the crack growth equation defined using the strain intensity factor, and the predicted fatigue lives were almost identical to those obtained by low-cycle fatigue tests. The change in crack depth predicted by the equation also agreed well with the experimental results. Based on the crack growth prediction model, it was shown that the crack size would be less than 0.1 mm even when the estimated fatigue damage exceeded the critical value of the design fatigue curve, in which a twenty-fold safety margin was used for the assessment. It was revealed that the effect of component size and surface roughness, which have been investigated empirically by fatigue tests, could be reasonably explained by considering the crack initiation and growth. Furthermore, the environmental effect on the fatigue life was shown to be brought about by the acceleration of crack growth. (author)

  8. Application of the cohesive zone model for the evaluation of stiffness losses in a rotor with a transverse breathing crack

    Science.gov (United States)

    Toni Liong, Rugerri; Proppe, Carsten

    2013-04-01

    The breathing mechanism of a transversely cracked rotor and its influence on a rotor system that appears due to shaft weight and inertia forces is studied. A method is proposed for the evaluation of the stiffness losses in the cross-section that contains the crack. This method is based on a cohesive zone model (CZM) instead of linear elastic fracture mechanics (LEFM). The CZM is developed for mode-I plane strain conditions and accounts explicitly for triaxiality of the stress state by using constitutive relations. The breathing crack is modelled by a parabolic shape. As long as the relative crack depth is small, a crack closure straight line model may be used, while the crack closure parabolic line should be used in the case of a deep crack. The CZM is also implemented in a one-dimensional continuum rotor model by means of finite element (FE) discretisation in order to predict and to analyse the dynamic behavior of a cracked rotor. The proposed method provides a useful tool for the analysis of rotor systems containing cracks.

  9. An application of the recrystallization method for the observation of plastic strain distribution around SCC cracks in sensitized SUS 304 stainless steels

    International Nuclear Information System (INIS)

    Tokiwai, Moriyasu

    1981-01-01

    Various types of stress corrosion cracking (SCC) testing methods have been developed since the SCC was discovered in type 304 stainless steel of BWR cooling pipes. With regard to the countermeasures for SCC, it is essential to evaluate the SCC susceptibility under the simulated or accelerated testing conditions. Among various acceleration SCC tests, the slow strain rate technique (SSRT) test has been used most widely. The SCC susceptibility, in almost cases, has been evaluated not on the base of the crack behavior but of the reduction of stress or strain under the corrosive environment. It is well known that the intensively deformed zone (plastic zone) is formed at the crack tip in fatigue and creep phenomena, but such plastic zone related with the resistance of crack extention has not been studied in SCC phenomenon. The objective of this study is to confirm the existence of the plastic zone at tips of SCC cracks by the application of the recrystallization method. The shape and the distribution of the plastic zone was measured by use of optical and scanning electron microscope in sensitized specimens SSRT tested in high temperature water containing various concentrations of dissolved oxygen. Results obtained are discussed in relation to the susceptibility of SCC. (author)

  10. A nuclear micro battery for Mems devices

    International Nuclear Information System (INIS)

    Lal, A.; Bilbao Y Leon, R.M.; Guo, H.; Li, H.; Santanam, S.; Yao, R.; Blanchard, J.; Henderson, D.

    2001-01-01

    Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include alpha and low-energy beta emitters. The sources are in both solid and liquid form, and a technique for plating a solid source from a liquid source has been investigated. Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. Performance results are provided for each of these concepts. (authors)

  11. Heterogeneous MEMS device assembly and integration

    Science.gov (United States)

    Topart, Patrice; Picard, Francis; Ilias, Samir; Alain, Christine; Chevalier, Claude; Fisette, Bruno; Paultre, Jacques E.; Généreux, Francis; Legros, Mathieu; Lepage, Jean-François; Laverdière, Christian; Ngo Phong, Linh; Caron, Jean-Sol; Desroches, Yan

    2014-03-01

    In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of different functionalities or multi-technology (i.e. wafer) approaches to fabricate and assemble devices respectively. This paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous assembly at chip and package-level. First, the performance of a giant (e.g. about 3 mm in diameter), electrostatically actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within an angular cone of up to 60° in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To achieve such angular performance relative to mirror size, the microassembly was performed from sub-components fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was flip-chipped onto a 256×1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the microassembly technology, performance results of packaged devices are presented. Finally, to simulate a 3072×3 pixel uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512×3 pixel FPAs with a less than 50 micron pixel co-registration is reported.

  12. A MEMS sensor for microscale force measurements

    International Nuclear Information System (INIS)

    Majcherek, S; Aman, A; Fochtmann, J

    2016-01-01

    This paper describes the development and testing of a new MEMS-based sensor device for microscale contact force measurements. A special MEMS cell was developed to reach higher lateral resolution than common steel-based load cells with foil-type strain gauges as mechanical-electrical converters. The design provided more than one normal force measurement point with spatial resolution in submillimeter range. Specific geometric adaption of the MEMS-device allowed adjustability of its measurement range between 0.5 and 5 N. The thin film nickel-chromium piezo resistors were used to achieve a mechanical-electrical conversion. The production process was realized by established silicon processing technologies such as deep reactive ion etching and vapor deposition (sputtering). The sensor was tested in two steps. Firstly, the sensor characteristics were carried out by application of defined loads at the measurement points by a push-pull tester. As a result, the sensor showed linear behavior. A measurement system analysis (MSA1) was performed to define the reliability of the measurement system. The measured force values had the maximal relative deviation of 1% to average value of 1.97 N. Secondly, the sensor was tested under near-industrial conditions. In this context, the thermal induced relaxation behavior of the electrical connector contact springs was investigated. The handling of emerging problems during the characterization process of the sensor is also described. (paper)

  13. Ultra-compact MEMS FTIR spectrometer

    Science.gov (United States)

    Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa

    2017-05-01

    Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

  14. Non-linear vibrations of cracked structures: application to turbine rotors; Vibrations non-lineaires des structures fissurees: application aux rotors de turbines

    Energy Technology Data Exchange (ETDEWEB)

    El Arem, S.

    2006-01-15

    The aim of this work is to study the dynamic response of a cracked rotor to establish some possibilities for early on line crack detection. First, a review on experimental, numerical and analytical works on the dynamics of cracked rotors is given. Then, an original method of calculating the behavior of a cracked beam section in bending with shearing effects is presented. The nonlinear behavior relations are derived from a three-dimensional model taking into account the unilateral contact conditions on the crack's lips. Based on an energy formulation, this method could be applied to any geometry of crack. The exploration by different numerical integration methods of the vibratory response of some models of cracked rotors is presented in the third chapter of this thesis. The un-cracked parts of a rotor are represented by elements of bar or beam type, and the cracked section by a nonlinear spring taking into account the breathing mechanism of the cracks. At the end of this part, an original method of construction of a finite element of a cracked beam is presented. The final chapter is devoted to the analytical study of the system with 2 degrees of freedom. The breathing mechanism of the crack is taken into account by considering specific periodic variation of the global stiffness of the system. The differential equations system is solved using the harmonic balance method. The linear stability of the periodic solutions is studied by the Floquet theory. Some vibratory parameters are proposed as crack indicators. (author)

  15. MEMS digital parametric loudspeaker

    KAUST Repository

    Carreno, Armando Arpys Arevalo

    2016-03-23

    This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

  16. Tribology and MEMS

    International Nuclear Information System (INIS)

    Williams, J A; Le, H R

    2006-01-01

    Micro-electro-mechanical system, MEMS, is a rapidly growing interdisciplinary technology dealing with the design and manufacture of miniaturized machines with the major dimensions at the scale of tens, to perhaps hundreds, of micrometres. Because they depend on the cube of a representative dimension, component masses and inertias rapidly become small as size decreases whereas surface and tribological effects, which often depend on area, become increasingly important. Although our explanations of macroscopic tribological phenomena often involve individual events occurring at the micro-scale, when the overall component size is itself miniaturized it may be necessary to re-evaluate some conventional tribological solutions. While the absolute loads are small in such micro-devices, the tribological requirements, especially in terms of longevity-which may be limited by wear rather than friction-are particularly demanding and will require imaginative and novel solutions. (topical review)

  17. MEMS digital parametric loudspeaker

    KAUST Repository

    Carreno, Armando Arpys Arevalo; Castro, David; Conchouso Gonzalez, David; Kosel, Jü rgen; Foulds, Ian G.

    2016-01-01

    This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

  18. MEMS: A new approach to micro-optics

    Energy Technology Data Exchange (ETDEWEB)

    Sniegowski, J.J.

    1997-12-31

    MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlights polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.

  19. Finite element modeling of micromachined MEMS photon devices

    Science.gov (United States)

    Evans, Boyd M., III; Schonberger, D. W.; Datskos, Panos G.

    1999-09-01

    The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.

  20. Finite Element Modeling of Micromachined MEMS Photon Devices

    International Nuclear Information System (INIS)

    Datskos, P.G.; Evans, B.M.; Schonberger, D.

    1999-01-01

    The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness

  1. An elastic-plastic fracture mechanics based methodology to characterize cracking behavior and its application to environmental assisted processes

    International Nuclear Information System (INIS)

    Alvarez, J.A.; Gutierrez-Solana, F.

    1999-01-01

    Cracking processes suffered by new structural and piping steels when used in petroleum or other energy installations have demonstrated the need for a cracking resistance characterization methodology. This methodology, valid for both elastic and elastoplastic regimes, should be able to define crack propagation kinetics as a function of their controlling local parameters. This work summarizes an experimental and analytical methodology that has been shown to be suitable for characterizing cracking processes using compact tensile specimens, especially subcritical environmentally assisted ones, such as those induced by hydrogen in microalloyed steels. The applied and validated methodology has been shown to offer quantitative results of cracking behavior and to correlate these with the existing fracture micromechanisms. (orig.)

  2. In-vitro characterization of stress corrosion cracking of aluminium-free magnesium alloys for temporary bio-implant applications.

    Science.gov (United States)

    Choudhary, Lokesh; Singh Raman, R K; Hofstetter, Joelle; Uggowitzer, Peter J

    2014-09-01

    The complex interaction between physiological stresses and corrosive human body fluid may cause premature failure of metallic biomaterials due to the phenomenon of stress corrosion cracking. In this study, the susceptibility to stress corrosion cracking of biodegradable and aluminium-free magnesium alloys ZX50, WZ21 and WE43 was investigated by slow strain rate tensile testing in a simulated human body fluid. Slow strain rate tensile testing results indicated that each alloy was susceptible to stress corrosion cracking, and this was confirmed by fractographic features of transgranular and/or intergranular cracking. However, the variation in alloy susceptibility to stress corrosion cracking is explained on the basis of their electrochemical and microstructural characteristics. Copyright © 2014 Elsevier B.V. All rights reserved.

  3. Synthesis of cracked Calophyllum inophyllum oil using fly ash catalyst for diesel engine application

    KAUST Repository

    Muthukumaran, N.; Saravanan, Chinnusamy G.; Prasanna Raj Yadav, S.; Vallinayagam, R.; Vedharaj, S.; Roberts, William L.

    2015-01-01

    In this study, production of hydrocarbon fuel from Calophyllum inophyllum oil has been characterized for diesel engine application, by appraising essential fuel processing parameters. As opposed to traditional trans-esterification process

  4. Fast and compact optical-resolution photoacoustic microscopy using a water-proofing two-axis MEMS scanner, and a step forward to clinical applications

    Science.gov (United States)

    Kim, Jin Young; Lee, Changho; Lim, Geunbae; Kim, Chulhong

    2016-03-01

    Optical-resolution photoacoustic microscopy (OR-PAM) is a novel microscopic tool to provide in vivo optically sensitive images in biomedical research. Conventional OR-PAM systems are typically slow and bulky because of the linear scanning stages with stepping motors. For practical purposes, however, fast imaging speed and small footprint are crucial. To address these issues, we have developed a real-time compact OR-PAM system equipped with a waterproof two-axis MEMS scanner. The OR-PAM system consists of key components such as an ultrasonic transducer with a bandwidth of 50 MHz, an opto-acoustic beam combiner (BC), and an MEMS scanner. These are all installed inside a small water tank, with dimensions of 30 mm × 90 mm × 30 mm along the x-, y-, and z-axes, respectively. A pulsed laser with a repetition rate of 50 kHz is confocally aligned with the photoacoustic (PA) waves in the BC to maximize the SNRs. The fast scanning ability of the MEMS scanner fully utilizes the A-scan speed of 50 kHz. For instance, the B- and C-scan imaging speeds are 125 Hz and 0.625 Hz, respectively, when the acquired PA maximum amplitude projection image has 200 × 200 pixels along the x- and y-axes, respectively. The measured lateral resolution of 3.6 μm and axial resolution of 27 μm are sufficient to resolve the small capillaries. Finally, we have successfully obtained in vivo PA images of iris microvasculatures in mice. This real-time and compact OR-PAM system is optimized to examine small animals in clinical studies.

  5. Ductile crack growth simulation from near crack tip dissipated energy

    International Nuclear Information System (INIS)

    Marie, S.; Chapuliot, S.

    2000-01-01

    A method to calculate ductile tearing in both small scale fracture mechanics specimens and cracked components is presented. This method is based on an estimation of the dissipated energy calculated near the crack tip. Firstly, the method is presented. It is shown that a characteristic parameter G fr can be obtained, relevant to the dissipated energy in the fracture process. The application of the method to the calculation of side grooved crack tip (CT) specimens of different sizes is examined. The value of G fr is identified by comparing the calculated and experimental load line displacement versus crack extension curve for the smallest CT specimen. With this identified value, it is possible to calculate the global behaviour of the largest specimen. The method is then applied to the calculation of a pipe containing a through-wall thickness crack subjected to a bending moment. This pipe is made of the same material as the CT specimens. It is shown that it is possible to simulate the global behaviour of the structure including the prediction of up to 90-mm crack extension. Local terms such as the equivalent stress or the crack tip opening angle are found to be constant during the crack extension process. This supports the view that G fr controls the fields in the vicinity near the crack tip. (orig.)

  6. Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach.

    Science.gov (United States)

    Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah

    2009-01-01

    Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.

  7. MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics

    Science.gov (United States)

    Marek, Jiri; Gómez, Udo-Martin

    MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving

  8. Micro-electro-mechanical systems (MEMS: Technology for the 21st century

    Directory of Open Access Journals (Sweden)

    Đakov Tatjana A.

    2014-01-01

    Full Text Available Micro-electro-mechanical systems (MEMS are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

  9. Application of cyclic J-integral to low cycle fatigue crack growth of Japanese carbon steel pipe

    Energy Technology Data Exchange (ETDEWEB)

    Miura, N.; Fujioka, T.; Kashima, K. [and others

    1997-04-01

    Piping for LWR power plants is required to satisfy the LBB concept for postulated (not actual) defects. With this in mind, research has so far been conducted on the fatigue crack growth under cyclic loading, and on the ductile crack growth under excessive loading. It is important, however, for the evaluation of the piping structural integrity under seismic loading condition, to understand the fracture behavior under dynamic and cyclic loading conditions, that accompanies large-scale yielding. CRIEPI together with Hitachi have started a collaborative research program on dynamic and/or cyclic fracture of Japanese carbon steel (STS410) pipes in 1991. Fundamental tensile property tests were conducted to examine the effect of strain rate on tensile properties. Cracked pipe fracture tests under some loading conditions were also performed to investigate the effect of dynamic and/or cyclic loading on fracture behavior. Based on the analytical considerations for the above tests, the method to evaluate the failure life for a cracked pipe under cyclic loading was developed and verified. Cyclic J-integral was introduced to predict cyclic crack growth up to failure. This report presents the results of tensile property tests, cracked pipe fracture tests, and failure life analysis. The proposed method was applied to the cracked pipe fracture tests. The effect of dynamic and/or cyclic loading on pipe fracture was also investigated.

  10. Nonlinear crack mechanics

    International Nuclear Information System (INIS)

    Khoroshun, L.P.

    1995-01-01

    The characteristic features of the deformation and failure of actual materials in the vicinity of a crack tip are due to their physical nonlinearity in the stress-concentration zone, which is a result of plasticity, microfailure, or a nonlinear dependence of the interatomic forces on the distance. Therefore, adequate models of the failure mechanics must be nonlinear, in principle, although linear failure mechanics is applicable if the zone of nonlinear deformation is small in comparison with the crack length. Models of crack mechanics are based on analytical solutions of the problem of the stress-strain state in the vicinity of the crack. On account of the complexity of the problem, nonlinear models are bason on approximate schematic solutions. In the Leonov-Panasyuk-Dugdale nonlinear model, one of the best known, the actual two-dimensional plastic zone (the nonlinearity zone) is replaced by a narrow one-dimensional zone, which is then modeled by extending the crack with a specified normal load equal to the yield point. The condition of finite stress is applied here, and hence the length of the plastic zone is determined. As a result of this approximation, the displacement in the plastic zone at the abscissa is nonzero

  11. An effective approach for restraining electrochemical corrosion of polycrystalline silicon caused by an HF-based solution and its application for mass production of MEMS devices

    International Nuclear Information System (INIS)

    Liu, Yunfei; Xie, Jing; Zhao, Hui; Luo, Wei; Yang, Jinling; An, Ji; Yang, Fuhua

    2012-01-01

    This paper presents a novel method to effectively protect the structural material polycrystalline silicon (polysilicon) from electrochemical corrosion, which often occurs when the MEMS device is released in HF-based solutions, especially when the device contains a noble metal. This corrosion seriously degrades the electrical and mechanical performance as well as the reliability of MEMS devices. In this method, a photoresist (PR) is employed to cover the noble metal, which is electrically coupled with the underlying polysilicon layer. This PR cover can effectually prevent an HF-based solution from diffusing through and arriving at the surface of the noble metal, thus cutting off the electrical current of the electrochemical corrosion reaction. The polysilicon is well protected for longer than 80 min in 49% concentrated HF solutions by a 3 µm-thick AZ 6130 PR film. This fabrication process is simple, reliable and suitable for mass production of high-end micromechanical disk resonators. Benefiting from the technology breakthrough mentioned above, a novel low-cost microfabrication method for disk resonators with high performance has been developed, and the VHF polysilicon disk resonators with resonance frequencies around 282 MHz and Q values larger than 2000 at atmosphere have been produced at wafer level. (paper)

  12. Design and application of a metal wet-etching post-process for the improvement of CMOS-MEMS capacitive sensors

    International Nuclear Information System (INIS)

    Tsai, Ming-Han; Sun, Chih-Ming; Liu, Yu-Chia; Fang, Weileun; Wang, Chuanwei

    2009-01-01

    This study presents a process design methodology to improve the performance of a CMOS-MEMS gap-closing capacitive sensor. In addition to the standard CMOS process, the metal wet-etching approach is employed as the post-CMOS process to realize the present design. The dielectric layers of the CMOS process are exploited to form the main micro mechanical structures of the sensor. The metal layers of the CMOS process are used as the sensing electrodes and sacrificial layers. The advantages of the sensor design are as follows: (1) the parasitic capacitance is significantly reduced by the dielectric structure, (2) in-plane and out-of-plane sensing gaps can be reduced to increase the sensitivity, and (3) plate-type instead of comb-type out-of-plane sensing electrodes are available to increase the sensing electrode area. To demonstrate the feasibility of the present design, a three-axis capacitive CMOS-MEMS accelerometers chip is implemented and characterized. Measurements show that the sensitivities of accelerometers reach 11.5 mV G −1 (in the X-, Y-axes) and 7.8 mV G −1 (in the Z-axis), respectively, which are nearly one order larger than existing designs. Moreover, the detection of 10 mG excitation using the three-axis accelerometer is demonstrated for both in-plane and out-of-plane directions

  13. Ball driven type MEMS SAD for artillery fuse

    International Nuclear Information System (INIS)

    Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo

    2017-01-01

    The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition. (paper)

  14. Ball driven type MEMS SAD for artillery fuse

    Science.gov (United States)

    Seok, Jin Oh; Jeong, Ji-hun; Eom, Junseong; Lee, Seung S.; Lee, Chun Jae; Ryu, Sung Moon; Oh, Jong Soo

    2017-01-01

    The SAD (safety and arming device) is an indispensable fuse component that ensures safe and reliable performance during the use of ammunition. Because the application of electronic devices for smart munitions is increasing, miniaturization of the SAD has become one of the key issues for next-generation artillery fuses. Based on MEMS technology, various types of miniaturized SADs have been proposed and fabricated. However, none of them have been reported to have been used in actual munitions due to their lack of high impact endurance and complicated explosive train arrangements. In this research, a new MEMS SAD using a ball driven mechanism, is successfully demonstrated based on a UV LIGA (lithography, electroplating and molding) process. Unlike other MEMS SADs, both high impact endurance and simple structure were achieved by using a ball driven mechanism. The simple structural design also simplified the fabrication process and increased the processing yield. The ball driven type MEMS SAD performed successfully under the desired safe and arming conditions of a spin test and showed fine agreement with the FEM simulation result, conducted prior to its fabrication. A field test was also performed with a grenade launcher to evaluate the SAD performance in the firing environment. All 30 of the grenade samples equipped with the proposed MEMS SAD operated successfully under the high-G setback condition.

  15. Cracking the Code of Human Diseases Using Next-Generation Sequencing: Applications, Challenges, and Perspectives

    Directory of Open Access Journals (Sweden)

    Vincenza Precone

    2015-01-01

    Full Text Available Next-generation sequencing (NGS technologies have greatly impacted on every field of molecular research mainly because they reduce costs and increase throughput of DNA sequencing. These features, together with the technology’s flexibility, have opened the way to a variety of applications including the study of the molecular basis of human diseases. Several analytical approaches have been developed to selectively enrich regions of interest from the whole genome in order to identify germinal and/or somatic sequence variants and to study DNA methylation. These approaches are now widely used in research, and they are already being used in routine molecular diagnostics. However, some issues are still controversial, namely, standardization of methods, data analysis and storage, and ethical aspects. Besides providing an overview of the NGS-based approaches most frequently used to study the molecular basis of human diseases at DNA level, we discuss the principal challenges and applications of NGS in the field of human genomics.

  16. Environmental and economic assessment of a cracked ammonia fuelled alkaline fuel cell for off-grid power applications

    Science.gov (United States)

    Cox, Brian; Treyer, Karin

    2015-02-01

    Global mobile telecommunication is possible due to millions of Base Transceiver Stations (BTS). Nearly 1 million of these are operating off-grid, typically powered by diesel generators and therefore leading to significant CO2 emissions and other environmental burdens. A novel type of Alkaline Fuel Cell (AFC) powered by cracked ammonia is being developed for replacement of these generators. This study compares the environmental and economic performance of the two systems by means of Life Cycle Assessment (LCA) and Levelised Cost of Electricity (LCOE), respectively. Results show that the production of ammonia dominates the LCA results, and that renewable ammonia production pathways greatly improve environmental performance. Sensitivity analyses reveal that the fuel cell parameters that most affect system cost and environmental burdens are cell power density and lifetime and system efficiency. Recycling of anode catalyst and electrode substrate materials is found to have large impacts on environmental performance, though without large cost incentives. For a set of target parameter values and fossil sourced ammonia, the AFC is calculated to produce electricity with life cycle CO2 eq emissions of 1.08 kg kWh-1, which is 23% lower than a diesel generator with electricity costs that are 14% higher in the same application.

  17. BioMEMS –Advancing the Frontiers of Medicine

    Directory of Open Access Journals (Sweden)

    Dentcho V. Ivanov

    2008-09-01

    Full Text Available Biological and medical application of micro-electro-mechanical-systems (MEMS is currently seen as an area of high potential impact. Integration of biology and microtechnology has resulted in the development of a number of platforms for improving biomedical and pharmaceutical technologies. This review provides a general overview of the applications and the opportunities presented by MEMS in medicine by classifying these platforms according to their applications in the medical field.

  18. Prospects for MEMS in the Automotive Industry

    Directory of Open Access Journals (Sweden)

    Richard DIXON

    2007-12-01

    Full Text Available An automotive sector as a growth market for MEMS sensors is analyzed in the article. The automotive sector accounted for $1.6 billion, making this the second biggest opportunity after IT peripherals and inkjet print heads. By 2011 the market will top $2.2 billion, a CAGR of around 7%. The main applications in revenues terms are, in order, pressure sensors, gyroscopes, accelerometers and flow sensors and this will remain so for the foreseeable future. Automotive companies are forced to innovate as a result of competition and price pressures.

  19. MEMS and mil/aero: technology push and market pull

    Science.gov (United States)

    Clifford, Thomas H.

    2001-04-01

    MEMS offers attractive solutions to high-density fluidics, inertial, optical, switching and other demanding military/aerospace (mil/aero) challenges. However, full acceptance must confront the realities of production-scale producibility, verifiability, testability, survivability, as well as long-term reliability. Data on these `..ilities' are crucial, and are central in funding and deployment decisions. Similarly, mil/aero users must highlight specific missions, environmental exposures, and procurement issues, as well as the quirks of its designers. These issues are particularly challenging in MEMS, because of the laws of physics and business economics, as well as the risks of deploying leading-edge technology into no-fail applications. This paper highlights mil/aero requirements, and suggests reliability/qualification protocols, to guide development effort and to reassure mil/aero users that MEMS labs are mindful of the necessary realities.

  20. Videometrics-based Detection of Vibration Linearity in MEMS Gyroscope

    Directory of Open Access Journals (Sweden)

    Yong Zhou

    2011-05-01

    Full Text Available MEMS gyroscope performs as a sort of sensor to detect angular velocity, with diverse applications in engineering including vehicle and intelligent traffic etc. A balanced vibration of driving module excited by electrostatic driving signal is the base MEMS gyroscope's performance. In order to analyze the linear property of vibration in MEMS Gyroscope, a method of computer vision measuring is applied with the help of high-speed vidicon to obtain video of linear vibration of driving module in gyroscope, under the driving voltage signal of inherent frequency and amplitude linearly increasing. By means of image processing, target identifying, and motion parameter extracting from the obtained video, vibration curve with time variation is acquired. And then, linearity of this vibration system can be analyzed by focusing on the amplitude value of vibration responding to the amplitude variation of driving voltage signal.

  1. Integrated Magnetic MEMS Relays: Status of the Technology

    Directory of Open Access Journals (Sweden)

    Giuseppe Schiavone

    2014-08-01

    Full Text Available The development and application of magnetic technologies employing microfabricated magnetic structures for the production of switching components has generated enormous interest in the scientific and industrial communities over the last decade. Magnetic actuation offers many benefits when compared to other schemes for microelectromechanical systems (MEMS, including the generation of forces that have higher magnitude and longer range. Magnetic actuation can be achieved using different excitation sources, which create challenges related to the integration with other technologies, such as CMOS (Complementary Metal Oxide Semiconductor, and the requirement to reduce power consumption. Novel designs and technologies are therefore sought to enable the use of magnetic switching architectures in integrated MEMS devices, without incurring excessive energy consumption. This article reviews the status of magnetic MEMS technology and presents devices recently developed by various research groups, with key focuses on integrability and effective power management, in addition to the ability to integrate the technology with other microelectronic fabrication processes.

  2. CMOS MEMS Fabrication Technologies and Devices

    Directory of Open Access Journals (Sweden)

    Hongwei Qu

    2016-01-01

    Full Text Available This paper reviews CMOS (complementary metal-oxide-semiconductor MEMS (micro-electro-mechanical systems fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator CMOS MEMS are introduced separately. Introduction of associated devices follows the description of the respective CMOS MEMS technologies. Due to the vast array of CMOS MEMS devices, this review focuses only on the most typical MEMS sensors and actuators including pressure sensors, inertial sensors, frequency reference devices and actuators utilizing different physics effects and the fabrication processes introduced. Moreover, the incorporation of MEMS and CMOS is limited to monolithic integration, meaning wafer-bonding-based stacking and other integration approaches, despite their advantages, are excluded from the discussion. Both competitive industrial products and state-of-the-art research results on CMOS MEMS are covered.

  3. Polarimetric borehole radar measurement near Nojima fault and its application to subsurface crack characterization; Polarimetric borehole radar ni yoru Nojima danso shuhen no chika kiretsu keisoku jikken

    Energy Technology Data Exchange (ETDEWEB)

    Sato, M.; Taniguchi, Y.; Miwa, T.; Niitsuma, H. [Tohoku University, Sendai (Japan); Ikeda, R. [National Research Institute for Disaster Prevention, Tsukuba (Japan); Makino, K. [Geophysical Surveying and Consulting Co. Ltd., Tokyo (Japan)

    1997-05-27

    Practical application of subsurface crack characterization by the borehole radar measurement to which the radar polarimetric method was introduced was attempted to measuring objects for which the borehole radar has not been much used, for example, the inside of low loss rock mass or fracture zone where cracks tightly exist. A system was trially manufactured which makes the radar polarimetric measurement possible in the borehole at a 1000m depth and with a about 10cm diameter, and a field experiment was conducted for realizing the subsurface crack characterization near the Nojima fault. For the measuring experiment by the polarimetric borehole radar, used were Iwaya borehole and Hirabayashi borehole drilled in the north of Awaji-shima, Hyogo-ken. In a comparison of both polarization systems of Hirabayashi borehole, reflected waves at depths of 1038m and 1047m are relatively stronger in both polarization systems than those with the same polarization form and at different depths, whereas reflected waves around a 1017m depth are strong only as to the parallel polarization system. Characteristics of the polarization in this experiment indirectly reflect crack structures. 6 refs., 6 figs., 1 tab.

  4. On the Theory and Numerical Simulation of Cohesive Crack Propagation with Application to Fiber-Reinforced Composites

    Science.gov (United States)

    Rudraraju, Siva Shankar; Garikipati, Krishna; Waas, Anthony M.; Bednarcyk, Brett A.

    2013-01-01

    The phenomenon of crack propagation is among the predominant modes of failure in many natural and engineering structures, often leading to severe loss of structural integrity and catastrophic failure. Thus, the ability to understand and a priori simulate the evolution of this failure mode has been one of the cornerstones of applied mechanics and structural engineering and is broadly referred to as "fracture mechanics." The work reported herein focuses on extending this understanding, in the context of through-thickness crack propagation in cohesive materials, through the development of a continuum-level multiscale numerical framework, which represents cracks as displacement discontinuities across a surface of zero measure. This report presents the relevant theory, mathematical framework, numerical modeling, and experimental investigations of through-thickness crack propagation in fiber-reinforced composites using the Variational Multiscale Cohesive Method (VMCM) developed by the authors.

  5. Microelectromechanical (MEM) thermal actuator

    Science.gov (United States)

    Garcia, Ernest J [Albuquerque, NM; Fulcher, Clay W. G. [Sandia Park, NM

    2012-07-31

    Microelectromechanical (MEM) buckling beam thermal actuators are disclosed wherein the buckling direction of a beam is constrained to a desired direction of actuation, which can be in-plane or out-of-plane with respect to a support substrate. The actuators comprise as-fabricated, linear beams of uniform cross section supported above the substrate by supports which rigidly attach a beam to the substrate. The beams can be heated by methods including the passage of an electrical current through them. The buckling direction of an initially straight beam upon heating and expansion is controlled by incorporating one or more directional constraints attached to the substrate and proximal to the mid-point of the beam. In the event that the beam initially buckles in an undesired direction, deformation of the beam induced by contact with a directional constraint generates an opposing force to re-direct the buckling beam into the desired direction. The displacement and force generated by the movement of the buckling beam can be harnessed to perform useful work, such as closing contacts in an electrical switch.

  6. MEMS Reliability Assurance Activities at JPL

    Science.gov (United States)

    Kayali, S.; Lawton, R.; Stark, B.

    2000-01-01

    An overview of Microelectromechanical Systems (MEMS) reliability assurance and qualification activities at JPL is presented along with the a discussion of characterization of MEMS structures implemented on single crystal silicon, polycrystalline silicon, CMOS, and LIGA processes. Additionally, common failure modes and mechanisms affecting MEMS structures, including radiation effects, are discussed. Common reliability and qualification practices contained in the MEMS Reliability Assurance Guideline are also presented.

  7. anisotropic crack modelling of reinforced concrete structures with an enhanced kinematics: application to bidimensional elements under cyclic loading

    International Nuclear Information System (INIS)

    Kishta, Ejona

    2016-01-01

    Civil engineering buildings, massive and unique, are mostly made of reinforced or prestressed concrete. Sustainability, tightness and safety are the major pillars of a building's performance. Cracking is a major phenomenon which impacts the buildings' behaviour under different loadings in terms of sustainability and structural capacity. Development of numerical models which describe accurately the response of quasi-brittle materials under complex loading remains an important research topic for the scientific community. The objective of this work is the development of a numerical model which represents explicitly cracking of reinforced concrete structures. Concrete and reinforced concrete degradation process, characterised by the appearance of several anisotropic crack families, is described by means of an anisotropic damage model accounting for oriented crack families. The kinematics of this model is enriched with a displacement jump in order to reproduce the development of cracks in the material during loading. This displacement jump is identified as the crack opening. The developed model is validated on simulations of plain concrete structures exhibiting model as well as mixed-mode failure. The performances of the enriched model are shown by the simulation of reinforced concrete structures such as a shear wall submitted to cyclic loading. (author) [fr

  8. Modeling nonlinearities in MEMS oscillators.

    Science.gov (United States)

    Agrawal, Deepak K; Woodhouse, Jim; Seshia, Ashwin A

    2013-08-01

    We present a mathematical model of a microelectromechanical system (MEMS) oscillator that integrates the nonlinearities of the MEMS resonator and the oscillator circuitry in a single numerical modeling environment. This is achieved by transforming the conventional nonlinear mechanical model into the electrical domain while simultaneously considering the prominent nonlinearities of the resonator. The proposed nonlinear electrical model is validated by comparing the simulated amplitude-frequency response with measurements on an open-loop electrically addressed flexural silicon MEMS resonator driven to large motional amplitudes. Next, the essential nonlinearities in the oscillator circuit are investigated and a mathematical model of a MEMS oscillator is proposed that integrates the nonlinearities of the resonator. The concept is illustrated for MEMS transimpedance-amplifier- based square-wave and sine-wave oscillators. Closed-form expressions of steady-state output power and output frequency are derived for both oscillator models and compared with experimental and simulation results, with a good match in the predicted trends in all three cases.

  9. Model-based design of MEMS resonant pressure sensors

    NARCIS (Netherlands)

    Suijlen, M.A.G.

    2011-01-01

    The massive integration of micromechanical structures on ICs to allow microsystems to sense and control the environment is expected to be one of the most important technological breakthroughs of the future. At present, cheap and small MEMS sensors are emerging in countless applications. Automotive

  10. Biogeography-inspired multiobjective optimization for helping MEMS synthesis

    Directory of Open Access Journals (Sweden)

    Di Barba Paolo

    2017-09-01

    Full Text Available The aim of the paper is to assess the applicability of a multi-objective biogeography-based optimisation algorithm in MEMS synthesis. In order to test the performances of the proposed method in this research field, the optimal shape design of an electrostatic micromotor, and two different electro-thermo-elastic microactuators are considered as the case studies.

  11. RF sputtering: A viable tool for MEMS fabrication

    Indian Academy of Sciences (India)

    being prepared by RF sputtering and their application in MEMS being explored. ... crystallographic properties were evaluated using XRD analysis (CuKα radiation ..... Bhatt V, Pal P, Chandra S 2005 Feasibility study of RF sputtered ZnO film for ...

  12. Structured synthesis of MEMS using evolutionary approaches

    DEFF Research Database (Denmark)

    Fan, Zhun; Wang, Jiachuan; Achiche, Sofiane

    2008-01-01

    In this paper, we discuss the hierarchy that is involved in a typical MEMS design and how evolutionary approaches can be used to automate the hierarchical synthesis process for MEMS. The paper first introduces the flow of a structured MEMS design process and emphasizes that system-level lumped...

  13. A six degrees of freedom mems manipulator

    NARCIS (Netherlands)

    de Jong, B.R.

    2006-01-01

    This thesis reports about a six degrees of freedom (DOF) precision manipulator in MEMS, concerning concept generation for the manipulator followed by design and fabrication (of parts) of the proposed manipulation concept in MEMS. Researching the abilities of 6 DOF precision manipulation in MEMS is

  14. Electrostatic MEMS devices with high reliability

    Science.gov (United States)

    Goldsmith, Charles L; Auciello, Orlando H; Sumant, Anirudha V; Mancini, Derrick C; Gudeman, Chris; Sampath, Suresh; Carlilse, John A; Carpick, Robert W; Hwang, James

    2015-02-24

    The present invention provides for an electrostatic microelectromechanical (MEMS) device comprising a dielectric layer separating a first conductor and a second conductor. The first conductor is moveable towards the second conductor, when a voltage is applied to the MEMS device. The dielectric layer recovers from dielectric charging failure almost immediately upon removal of the voltage from the MEMS device.

  15. Password cracking

    OpenAIRE

    Χριστοφάκης, Μιχαήλ Κ.

    2014-01-01

    Information security is the next big thing in computers society because of the rapidly growing security incidents and the outcomes of those. Hacking and cracking existed even from the start of the eighties decade when there was the first step of the interconnection through the internet between humans. From then and ever after there was a big explosion of such incidents mostly because of the worldwide web which was introduced in the early nineties. Following the huge steps forward of computers...

  16. Fracture mechanical modeling of brittle crack propagation and arrest of steel. 3. Application to duplex-type test; Kozai no zeisei kiretsu denpa teisi no rikigaku model. 3. Konseigata shiken eno tekiyo

    Energy Technology Data Exchange (ETDEWEB)

    Aihara, S.; Tsuchida, Y. [Nippon Steel Corp., Tokyo (Japan); Machida, S.; Yoshinari, H. [The University of Tokyo, Tokyo (Japan). Faculty of Engineering

    1996-12-31

    A proposal was made previously on a model of brittle crack propagation and arrest that considers the effect of crack opening suppression by using unbroken ligaments generated on steel plate surface and the effect that cracks precede in the central part of the plate thickness, based on a local limit stress theory for brittleness fracture. This paper discusses applicability of this model to a mixed type test, and elucidates causes for difference in the arrest tenacity of both types in a double tensile test of the standard size. The brittle crack propagation and arrest model based on the local limit stress theory was found applicable to a simulation of the mixed type test. Experimental crack propagation speed history and behavior of the arrest were reproduced nearly completely by using this model. When load stress is increased, the arrests in the mixed type test may be classified into arrests of both inside the steel plate and near the surface, cracks in the former position or arrest in the latter position, and rush of cracks into both positions. Furthermore, at higher stresses, the propagation speed drops once after cracks rushed into the test plate, but turns to a rise, leading to propagation and piercing. 8 refs., 15 figs., 3 tabs.

  17. Fracture mechanical modeling of brittle crack propagation and arrest of steel. 3. Application to duplex-type test; Kozai no zeisei kiretsu denpa teisi no rikigaku model. 3. Konseigata shiken eno tekiyo

    Energy Technology Data Exchange (ETDEWEB)

    Aihara, S; Tsuchida, Y [Nippon Steel Corp., Tokyo (Japan); Machida, S; Yoshinari, H [The University of Tokyo, Tokyo (Japan). Faculty of Engineering

    1997-12-31

    A proposal was made previously on a model of brittle crack propagation and arrest that considers the effect of crack opening suppression by using unbroken ligaments generated on steel plate surface and the effect that cracks precede in the central part of the plate thickness, based on a local limit stress theory for brittleness fracture. This paper discusses applicability of this model to a mixed type test, and elucidates causes for difference in the arrest tenacity of both types in a double tensile test of the standard size. The brittle crack propagation and arrest model based on the local limit stress theory was found applicable to a simulation of the mixed type test. Experimental crack propagation speed history and behavior of the arrest were reproduced nearly completely by using this model. When load stress is increased, the arrests in the mixed type test may be classified into arrests of both inside the steel plate and near the surface, cracks in the former position or arrest in the latter position, and rush of cracks into both positions. Furthermore, at higher stresses, the propagation speed drops once after cracks rushed into the test plate, but turns to a rise, leading to propagation and piercing. 8 refs., 15 figs., 3 tabs.

  18. A bio-inspired asynchronous skin system for crack detection applications

    International Nuclear Information System (INIS)

    Sharp, Nathan; Kuntz, Alan; Brubaker, Cole; Amos, Stephanie; Gao, Wei; Gupta, Gautum; Mohite, Aditya; Farrar, Charles; Mascareñas, David

    2014-01-01

    In many applications of structural health monitoring (SHM) it is imperative or advantageous to have large sensor arrays in order to properly sense the state of health of the structure. Typically these sensor networks are implemented by placing a large number of sensors over a structure and running individual cables from each sensor back to a central measurement station. Data is then collected from each sensor on the network at a constant sampling rate regardless of the current timescales at which events are acting on the structure. These conventional SHM sensor networks have a number of shortfalls. They tend to have a large number of cables that can represent a single point of failure for each sensor as well as add significant weight and installation costs. The constant sampling rate associated with each sensor very quickly leads to large amounts of data that must be analyzed, stored, and possibly transmitted to a remote user. This leads to increased demands on power consumption, bandwidth, and size. It also taxes our current techniques for managing large amounts of data. For the last decade the goal of the SHM community has been to endow structures with the functionality of a biological nervous system. Despite this goal the community has predominantly ignored the biological nervous system as inspiration for building structural nervous systems, choosing instead to focus on experimental mechanics and simulation techniques. In this work we explore the use of a novel, bio-inspired, SHM skin. This skin makes use of distributed computing and asynchronous communication techniques to alleviate the scale of the data management challenge as well as reduce power. The system also periodically sends a ‘heat beat’ signal to provide state-of-health updates. This conductive skin was implemented using conductive ink resistors as well as with graphene-oxide capacitors. (paper)

  19. RF-MEMS for high-performance and widely reconfigurable passive components – A review with focus on future telecommunications, Internet of Things (IoT and 5G applications

    Directory of Open Access Journals (Sweden)

    Jacopo Iannacci

    2017-10-01

    This work frames the current state of RF-MEMS market exploitation, analysing the main reasons impairing in past years the proper employment of Microsystem technology based RF passive components. Moreover, highlights on further expansion of RF-MEMS solutions in mobile and telecommunication systems will be briefly provided and discussed.

  20. Modeling of biaxial gimbal-less MEMS scanning mirrors

    Science.gov (United States)

    von Wantoch, Thomas; Gu-Stoppel, Shanshan; Senger, Frank; Mallas, Christian; Hofmann, Ulrich; Meurer, Thomas; Benecke, Wolfgang

    2016-03-01

    One- and two-dimensional MEMS scanning mirrors for resonant or quasi-stationary beam deflection are primarily known as tiny micromirror devices with aperture sizes up to a few Millimeters and usually address low power applications in high volume markets, e.g. laser beam scanning pico-projectors or gesture recognition systems. In contrast, recently reported vacuum packaged MEMS scanners feature mirror diameters up to 20 mm and integrated high-reflectivity dielectric coatings. These mirrors enable MEMS based scanning for applications that require large apertures due to optical constraints like 3D sensing or microscopy as well as for high power laser applications like laser phosphor displays, automotive lighting and displays, 3D printing and general laser material processing. This work presents modelling, control design and experimental characterization of gimbal-less MEMS mirrors with large aperture size. As an example a resonant biaxial Quadpod scanner with 7 mm mirror diameter and four integrated PZT (lead zirconate titanate) actuators is analyzed. The finite element method (FEM) model developed and computed in COMSOL Multiphysics is used for calculating the eigenmodes of the mirror as well as for extracting a high order (n system inputs and scanner displacement as system output. By applying model order reduction techniques using MATLABR a compact state space system approximation of order n = 6 is computed. Based on this reduced order model feedforward control inputs for different, properly chosen scanner displacement trajectories are derived and tested using the original FEM model as well as the micromirror.

  1. Geometrically Nonlinear Field Fracture Mechanics and Crack Nucleation, Application to Strain Localization Fields in Al-Cu-Li Aerospace Alloys

    Directory of Open Access Journals (Sweden)

    Satyapriya Gupta

    2018-03-01

    Full Text Available The displacement discontinuity arising between crack surfaces is assigned to smooth densities of crystal defects referred to as disconnections, through the incompatibility of the distortion tensor. In a dual way, the disconnections are defined as line defects terminating surfaces where the displacement encounters a discontinuity. A conservation statement for the crack opening displacement provides a framework for disconnection dynamics in the form of transport laws. A similar methodology applied to the discontinuity of the plastic displacement due to dislocations results in the concurrent involvement of dislocation densities in the analysis. Non-linearity of the geometrical setting is assumed for defining the elastic distortion incompatibility in the presence of both dislocations and disconnections, as well as for their transport. Crack nucleation in the presence of thermally-activated fluctuations of the atomic order is shown to derive from this nonlinearity in elastic brittle materials, without any algorithmic rule or ad hoc material parameter. Digital image correlation techniques applied to the analysis of tensile tests on ductile Al-Cu-Li samples further demonstrate the ability of the disconnection density concept to capture crack nucleation and relate strain localization bands to consistent disconnection fields and to the eventual occurrence of complex and combined crack modes in these alloys.

  2. A nuclear micro battery for Mems devices

    International Nuclear Information System (INIS)

    Blanchard, J.; Lal, A.; Henderson, D.; Bilbao Y Leon, R.; Guo, H.; Li, H.; Santanam, S.; Yao, R.

    2001-01-01

    Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include low-energy beta emitters (solid and liquid) and alpha emitters (solid). Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. In this case, the charged particles emitted from the decay of the radioisotopes are absorbed by a semiconductor and dissipate most of their energy as ionization of the atoms in the solid. The carriers generated in this fashion are in excess of the number permitted by thermodynamic equilibrium and, if they diffuse to the vicinity of a rectifying junction, induce a voltage across the junction. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. As the charge is collected, the deflection of a cantilever beam increases until it contacts a grounded element, thus discharging the beam and causing it to return to its original position. This process will repeat as long as the source is active. One final concept relies on temperature gradients produced by the sources, along with appropriate insulation, to create power using a Peltier device. The source is isolated in order to allow it to reach sufficient temperatures, and the temperature difference between the source and the rest of the device is exploited using the Peltier effect. Performance results will be provided for each of these concepts. (author)

  3. MEMS linear and nonlinear statics and dynamics

    CERN Document Server

    Younis, Mohammad I

    2011-01-01

    MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of nume

  4. Monitoring crack growth using thermography

    International Nuclear Information System (INIS)

    Djedjiga, Ait Aouita; Abdeldjalil, Ouahabi

    2008-01-01

    The purpose of this work is to present a novel strategy for real-time monitoring crack growth of materials. The process is based on the use of thermal data extracted along the horizontal axis of symmetry of single edge notch tension (SENT) specimens, during fatigue tests. These data are exploited using an implemented program to detect in situ the growth of fatigue crack, with the critical size and propagation speed of the crack. This technique has the advantage to be applicable to a wide range of materials regardless of their electrical conductivity and their surface texture. (authors)

  5. Password Cracking Using Sony Playstations

    Science.gov (United States)

    Kleinhans, Hugo; Butts, Jonathan; Shenoi, Sujeet

    Law enforcement agencies frequently encounter encrypted digital evidence for which the cryptographic keys are unknown or unavailable. Password cracking - whether it employs brute force or sophisticated cryptanalytic techniques - requires massive computational resources. This paper evaluates the benefits of using the Sony PlayStation 3 (PS3) to crack passwords. The PS3 offers massive computational power at relatively low cost. Moreover, multiple PS3 systems can be introduced easily to expand parallel processing when additional power is needed. This paper also describes a distributed framework designed to enable law enforcement agents to crack encrypted archives and applications in an efficient and cost-effective manner.

  6. Formulation of a new model of dynamic cracking in PLEXUS. First applications to a laboratory test specimen

    International Nuclear Information System (INIS)

    Jamet, P.

    1986-07-01

    The problem of dynamic rupture is important for nuclear power plant safety analysis, more particularly in case of cold shock in a PWR vessel. Preliminary studies showed that PLEXUS is a numerical frame well adapted to the analysis of the problem. The aim of this report is to present a new model implemented in PLEXUS, for a better simulation of splitting. A first trial taking into account the variation of the dynamic toughness versus crack propagation rate has been done (samples of steel AISI 4340). The model has been applied to the dynamic cracking of a test specimen. The influence of wave reflections at the structure limits has been clearly pointed out [fr

  7. Application of eddy currents for identification of dimensional variations in PWR steam generator tubes and detection of stress corrosion cracks

    International Nuclear Information System (INIS)

    Comby, R.; Gourmelon, A.

    1985-01-01

    To avoid the risk of cracking on the secondary side of the roll expansion transition zone in steam generator (SG) tubes, tube profile at the upper face of the tube sheet must comply with specifications laid down by the manufacturer and EDF. EDF has developed an eddy current (EC) signal identification method, used for pre-service testing to detect any deviation in tube profile. Nevertheless, circumferential or longitudinal stress corrosion cracks (SCC), initiated on the primary side, have appeared on some SGs. A special rotating probe was used on these generators. The results of these checks have been correlated with metallurgical examination of the extracted tubes

  8. Crack-opening area calculations for circumferential through-wall pipe cracks

    Energy Technology Data Exchange (ETDEWEB)

    Kishida, K.; Zahoor, A.

    1988-08-01

    This report describes the estimation schemes for crack opening displacement (COD) of a circumferential through-wall crack, then compares the COD predictions with pipe experimental data. Accurate predictions for COD are required to reliably predict the leak rate through a crack in leak-before-break applications.

  9. Crack-opening area calculations for circumferential through-wall pipe cracks

    International Nuclear Information System (INIS)

    Kishida, K.; Zahoor, A.

    1988-08-01

    This report describes the estimation schemes for crack opening displacement (COD) of a circumferential through-wall crack, then compares the COD predictions with pipe experimental data. Accurate predictions for COD are required to reliably predict the leak rate through a crack in leak-before-break applications

  10. Integrated Electromechanical Transduction Schemes for Polymer MEMS Sensors

    Directory of Open Access Journals (Sweden)

    Damien Thuau

    2018-04-01

    Full Text Available Polymer Micro ElectroMechanical Systems (MEMS have the potential to constitute a powerful alternative to silicon-based MEMS devices for sensing applications. Although the use of commercial photoresists as structural material in polymer MEMS has been widely reported, the integration of functional polymer materials as electromechanical transducers has not yet received the same amount of interest. In this context, we report on the design and fabrication of different electromechanical schemes based on polymeric materials ensuring different transduction functions. Piezoresistive transduction made of carbon nanotube-based nanocomposites with a gauge factor of 200 was embedded within U-shaped polymeric cantilevers operating either in static or dynamic modes. Flexible resonators with integrated piezoelectric transduction were also realized and used as efficient viscosity sensors. Finally, piezoelectric-based organic field effect transistor (OFET electromechanical transduction exhibiting a record sensitivity of over 600 was integrated into polymer cantilevers and used as highly sensitive strain and humidity sensors. Such advances in integrated electromechanical transduction schemes should favor the development of novel all-polymer MEMS devices for flexible and wearable applications in the future.

  11. Cracking hydrocarbons

    Energy Technology Data Exchange (ETDEWEB)

    Forwood, G F; Lane, M; Taplay, J G

    1921-10-07

    In cracking and hydrogenating hydrocarbon oils by passing their vapors together with steam over heated carbon derived from shale, wood, peat or other vegetable or animal matter, the gases from the condenser are freed from sulfuretted hydrogen, and preferably also from carbon dioxide, and passed together with oil vapors and steam through the retort. Carbon dioxide may be removed by passage through slaked lime, and sulfuretted hydrogen by means of hydrated oxide of iron. Vapors from high-boiling oils and those from low-boiling oils are passed alternately through the retort, so that carbon deposited from the high-boiling oils is used up during treatment of low-boiling oils.

  12. Additive direct-write microfabrication for MEMS: A review

    Science.gov (United States)

    Teh, Kwok Siong

    2017-12-01

    manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

  13. Development of an SU-8 MEMS process with two metal electrodes using amorphous silicon as a sacrificial material

    KAUST Repository

    Ramadan, Khaled S.

    2013-02-08

    This work presents an SU-8 surface micromachining process using amorphous silicon as a sacrificial material, which also incorporates two metal layers for electrical excitation. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic applications due to its mechanical properties, biocompatibility and low cost. Amorphous silicon is used as a sacrificial layer in MEMS applications because it can be deposited in large thicknesses, and can be released in a dry method using XeF2, which alleviates release-based stiction problems related to MEMS applications. In this work, an SU-8 MEMS process was developed using ;-Si as a sacrificial layer. Two conductive metal electrodes were integrated in this process to allow out-of-plane electrostatic actuation for applications like MEMS switches and variable capacitors. In order to facilitate more flexibility for MEMS designers, the process can fabricate dimples that can be conductive or nonconductive. Additionally, this SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were optimized for two sets of thicknesses: thin (5-10 m) and thick (130 m). The process was tested fabricating MEMS switches, capacitors and thermal actuators. © 2013 IOP Publishing Ltd.

  14. Development of an SU-8 MEMS process with two metal electrodes using amorphous silicon as a sacrificial material

    KAUST Repository

    Ramadan, Khaled S.; Nasr, Tarek Adel Hosny; Foulds, Ian G.

    2013-01-01

    method using XeF2, which alleviates release-based stiction problems related to MEMS applications. In this work, an SU-8 MEMS process was developed using ;-Si as a sacrificial layer. Two conductive metal electrodes were integrated in this process to allow

  15. MEMS based digital transform spectrometers

    Science.gov (United States)

    Geller, Yariv; Ramani, Mouli

    2005-09-01

    Earlier this year, a new breed of Spectrometers based on Micro-Electro-Mechanical-System (MEMS) engines has been introduced to the commercial market. The use of these engines combined with transform mathematics, produces powerful spectrometers at unprecedented low cost in various spectral regions.

  16. MEMS reliability: coming of age

    Science.gov (United States)

    Douglass, Michael R.

    2008-02-01

    In today's high-volume semiconductor world, one could easily take reliability for granted. As the MOEMS/MEMS industry continues to establish itself as a viable alternative to conventional manufacturing in the macro world, reliability can be of high concern. Currently, there are several emerging market opportunities in which MOEMS/MEMS is gaining a foothold. Markets such as mobile media, consumer electronics, biomedical devices, and homeland security are all showing great interest in microfabricated products. At the same time, these markets are among the most demanding when it comes to reliability assurance. To be successful, each company developing a MOEMS/MEMS device must consider reliability on an equal footing with cost, performance and manufacturability. What can this maturing industry learn from the successful development of DLP technology, air bag accelerometers and inkjet printheads? This paper discusses some basic reliability principles which any MOEMS/MEMS device development must use. Examples from the commercially successful and highly reliable Digital Micromirror Device complement the discussion.

  17. A Musical instrument in MEMS

    NARCIS (Netherlands)

    Engelen, Johannes Bernardus Charles; de Boer, Hans L.; de Boer, H.; Beekman, J.G.; Been, A.J.; Folkertsma, Gerrit Adriaan; Folkertsma, G.A.; Fortgens, L.; de Graaf, D.; Vocke, S.; Woldering, L.A.; Abelmann, Leon; Elwenspoek, Michael Curt

    In this work we describe a MEMS instrument that resonates at audible frequencies, and with which music can be made. The sounds are generated by mechanical resonators and capacitive displacement sensors. Damping by air scales unfavourably for generating audible frequencies with small devices.

  18. HARM processing techniques for MEMS and MOEMS devices using bonded SOI substrates and DRIE

    Science.gov (United States)

    Gormley, Colin; Boyle, Anne; Srigengan, Viji; Blackstone, Scott C.

    2000-08-01

    Silicon-on-Insulator (SOI) MEMS devices (1) are rapidly gaining popularity in realizing numerous solutions for MEMS, especially in the optical and inertia application fields. BCO recently developed a DRIE trench etch, utilizing the Bosch process, and refill process for high voltage dielectric isolation integrated circuits on thick SOI substrates. In this paper we present our most recently developed DRIE processes for MEMS and MOEMS devices. These advanced etch techniques are initially described and their integration with silicon bonding demonstrated. This has enabled process flows that are currently being utilized to develop optical router and filter products for fiber optics telecommunications and high precision accelerometers.

  19. MEMS Integrated Submount Alignment for Optoelectronics

    Science.gov (United States)

    Shakespeare, W. Jeffrey; Pearson, Raymond A.; Grenestedt, Joachim L.; Hutapea, Parsaoran; Gupta, Vikas

    2005-02-01

    One of the most expensive and time-consuming production processes for single-mode fiber-optic components is the alignment of the photonic chip or waveguide to the fiber. The alignment equipment is capital intensive and usually requires trained technicians to achieve desired results. Current technology requires active alignment since tolerances are only ~0.2 μ m or less for a typical laser diode. This is accomplished using piezoelectric actuated stages and active optical feedback. Joining technologies such as soldering, epoxy bonding, or laser welding may contribute significant postbond shift, and final coupling efficiencies are often less than 80%. This paper presents a method of adaptive optical alignment to freeze in place directly on an optical submount using a microelectromechanical system (MEMS) shape memory alloy (SMA) actuation technology. Postbond shift is eliminated since the phase change is the alignment actuation. This technology is not limited to optical alignment but can be applied to a variety of MEMS actuations, including nano-actuation and nano-alignment for biomedical applications. Experimental proof-of-concept results are discussed, and a simple analytical model is proposed to predict the stress strain behavior of the optical submount. Optical coupling efficiencies and alignment times are compared with traditional processes. The feasibility of this technique in high-volume production is discussed.

  20. Frequency adjustable MEMS vibration energy harvester

    Science.gov (United States)

    Podder, P.; Constantinou, P.; Amann, A.; Roy, S.

    2016-10-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators.

  1. Piezoelectric Zinc Oxide Based MEMS Acoustic Sensor

    Directory of Open Access Journals (Sweden)

    Aarti Arora

    2008-04-01

    Full Text Available An acoustic sensors exhibiting good sensitivity was fabricated using MEMS technology having piezoelectric zinc oxide as a dielectric between two plates of capacitor. Thin film zinc oxide has structural, piezoelectric and optical properties for surface acoustic wave (SAW and bulk acoustic wave (BAW devices. Oxygen effficient films are transparent and insulating having wide applications for sensors and transducers. A rf sputtered piezoelectric ZnO layer transforms the mechanical deflection of a thin etched silicon diaphragm into a piezoelectric charge. For 25-micron thin diaphragm Si was etched in tetramethylammonium hydroxide solution using bulk micromachining. This was followed by deposition of sandwiched structure composed of bottom aluminum electrode, sputtered 3 micron ZnO film and top aluminum electrode. A glass having 1 mm diameter hole was bonded on backside of device to compensate sound pressure in side the cavity. The measured value of central capacitance and dissipation factor of the fabricated MEMS acoustic sensor was found to be 82.4pF and 0.115 respectively, where as the value of ~176 pF was obtained for the rim capacitance with a dissipation factor of 0.138. The response of the acoustic sensors was reproducible for the devices prepared under similar processing conditions under different batches. The acoustic sensor was found to be working from 30Hz to 8KHz with a sensitivity of 139µV/Pa under varying acoustic pressure.

  2. Characterisation and Modelling of MEMS Ultrasonic Transducers

    International Nuclear Information System (INIS)

    Teng, M F; Hariz, A J

    2006-01-01

    Silicon ultrasonic transducer micro arrays based on micro-electro-mechanicalsystem (MEMS) technologies are gaining popularity for applications in sonar sensing and excitation. A current challenge for many researchers is modelling the dynamic performance of these and other micro-mechanical devices to ascertain their performance and explain experimental observations reported. In this work, the performance simulation of a MEMS ultrasonic transducer array made from silicon nitride has been successfully carried out using CoventorWare package. The dynamic response of the entire transducer array was characterised, and the results were compared with theoretical predictions. Individual elements were found to vibrate with Bessel-like displacement patterns, and they were resonant at approximately 3 MHz, depending on thickness and lateral dimensions. The frequency shows a linear dependence around the common thickness of 2 μm. Peak displacement levels were examined as a function of frequency, DC bias voltage, and AC drive voltage. Accounting for fabrication variations, and uniformity variations across the wafer, the full array showed minimal variations in peak out-of-plane displacement levels across the device, and isolated elements that were over-responsive and under-responsive. Presently, the effect of observed variations across the array on the performance of the transducers and their radiated fields are being examined

  3. Frequency adjustable MEMS vibration energy harvester

    International Nuclear Information System (INIS)

    Podder, P; Constantinou, P; Roy, S; Amann, A

    2016-01-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators. (paper)

  4. U.S. Army Corrosion Office's storage and quality requirements for military MEMS program

    Science.gov (United States)

    Zunino, J. L., III; Skelton, D. R.

    2007-04-01

    As the Army transforms into a more lethal, lighter and agile force, the technologies that support these systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army and DOD will rely on heavily to accomplish these objectives. Conditions for utilization of MEMS by the military are unique. Operational and storage environments for the military are significantly different than those found in the commercial sector. Issues unique to the military include; high G-forces during gun launch, extreme temperature and humidity ranges, extended periods of inactivity (20 years plus) and interaction with explosives and propellants. The military operational environments in which MEMS will be stored or required to function are extreme and far surpass any commercial operating conditions. Security and encryption are a must for all MEMS communication, tracking, or data reporting devices employed by the military. Current and future military applications of MEMS devices include safety and arming devices, fuzing devices, various guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless Radio Frequency Identifications (RFIDs) and network systems, GPS's, radar systems, mobile base systems and information technology. MEMS embedded into these weapons systems will provide the military with new levels of speed, awareness, lethality, and information dissemination. The system capabilities enhanced by MEMS will translate directly into tactical and strategic military advantages.

  5. Feasibility of Frequency-Modulated Wireless Transmission for a Multi-Purpose MEMS-Based Accelerometer

    Directory of Open Access Journals (Sweden)

    Alessandro Sabato

    2014-09-01

    Full Text Available Recent advances in the Micro Electro-Mechanical System (MEMS technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM of civil engineering structures. To date, sensors’ low sensitivity and accuracy—especially at very low frequencies—have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor’s analog signals are converted to digital signals before radio-frequency (RF wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F instead of the conventional Analog to Digital Conversion (ADC. In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

  6. Feasibility of frequency-modulated wireless transmission for a multi-purpose MEMS-based accelerometer.

    Science.gov (United States)

    Sabato, Alessandro; Feng, Maria Q

    2014-09-05

    Recent advances in the Micro Electro-Mechanical System (MEMS) technology have made wireless MEMS accelerometers an attractive tool for Structural Health Monitoring (SHM) of civil engineering structures. To date, sensors' low sensitivity and accuracy--especially at very low frequencies--have imposed serious limitations for their application in monitoring large-sized structures. Conventionally, the MEMS sensor's analog signals are converted to digital signals before radio-frequency (RF) wireless transmission. The conversion can cause a low sensitivity to the important low-frequency and low-amplitude signals. To overcome this difficulty, the authors have developed a MEMS accelerometer system, which converts the sensor output voltage to a frequency-modulated signal before RF transmission. This is achieved by using a Voltage to Frequency Conversion (V/F) instead of the conventional Analog to Digital Conversion (ADC). In this paper, a prototype MEMS accelerometer system is presented, which consists of a transmitter and receiver circuit boards. The former is equipped with a MEMS accelerometer, a V/F converter and a wireless RF transmitter, while the latter contains an RF receiver and a F/V converter for demodulating the signal. The efficacy of the MEMS accelerometer system in measuring low-frequency and low-amplitude dynamic responses is demonstrated through extensive laboratory tests and experiments on a flow-loop pipeline.

  7. Capillary-induced crack healing between surfaces of nanoscale roughness.

    Science.gov (United States)

    Soylemez, Emrecan; de Boer, Maarten P

    2014-10-07

    Capillary forces are important in nature (granular materials, insect locomotion) and in technology (disk drives, adhesion). Although well studied in equilibrium state, the dynamics of capillary formation merit further investigation. Here, we show that microcantilever crack healing experiments are a viable experimental technique for investigating the influence of capillary nucleation on crack healing between rough surfaces. The average crack healing velocity, v̅, between clean hydrophilic polycrystalline silicon surfaces of nanoscale roughness is measured. A plot of v̅ versus energy release rate, G, reveals log-linear behavior, while the slope |d[log(v̅)]/dG| decreases with increasing relative humidity. A simplified interface model that accounts for the nucleation time of water bridges by an activated process is developed to gain insight into the crack healing trends. This methodology enables us to gain insight into capillary bridge dynamics, with a goal of attaining a predictive capability for this important microelectromechanical systems (MEMS) reliability failure mechanism.

  8. Fast tunable blazed MEMS grating for external cavity lasers

    Science.gov (United States)

    Tormen, Maurizio; Niedermann, Philippe; Hoogerwerf, Arno; Shea, Herbert; Stanley, Ross

    2017-11-01

    Diffractive MEMS are interesting for a wide range of applications, including displays, scanners or switching elements. Their advantages are compactness, potentially high actuation speed and in the ability to deflect light at large angles. We have designed and fabricated deformable diffractive MEMS grating to be used as tuning elements for external cavity lasers. The resulting device is compact, has wide tunability and a high operating speed. The initial design is a planar grating where the beams are free-standing and attached to each other using leaf springs. Actuation is achieved through two electrostatic comb drives at either end of the grating. To prevent deformation of the free-standing grating, the device is 10 μm thick made from a Silicon on Insulator (SOI) wafer in a single mask process. At 100V a periodicity tuning of 3% has been measured. The first resonant mode of the grating is measured at 13.8 kHz, allowing high speed actuation. This combination of wide tunability and high operating speed represents state of the art in the domain of tunable MEMS filters. In order to improve diffraction efficiency and to expand the usable wavelength range, a blazed version of the deformable MEMS grating has been designed. A key issue is maintaining the mechanical properties of the original device while providing optically smooth blazed beams. Using a process based on anisotropic KOH etching, blazed gratings have been obtained and preliminary characterization is promising.

  9. Modeling of MEMS Mirrors Actuated by Phase-Change Mechanism

    Directory of Open Access Journals (Sweden)

    David Torres

    2017-04-01

    Full Text Available Given the multiple applications for micro-electro-mechanical system (MEMS mirror devices, most of the research efforts are focused on improving device performance in terms of tilting angles, speed, and their integration into larger arrays or systems. The modeling of these devices is crucial for enabling a platform, in particular, by allowing for the future control of such devices. In this paper, we present the modeling of a MEMS mirror structure with four actuators driven by the phase-change of a thin film. The complexity of the device structure and the nonlinear behavior of the actuation mechanism allow for a comprehensive study that encompasses simpler electrothermal designs, thus presenting a general approach that can be adapted to most MEMS mirror designs based on this operation principle. The MEMS mirrors presented in this work are actuated by Joule heating and tested using optical techniques. Mechanical and thermal models including both pitch and roll displacements are developed by combining theoretical analysis (using both numerical and analytical tools with experimental data and subsequently verifying with quasi-static and dynamic experiments.

  10. A Widely-Accessible Distributed MEMS Processing Environment. The MEMS Exchange Program

    Science.gov (United States)

    2012-10-29

    all of these patterns in advance, we made a new cost model, called the Python Code cost model, which utilizes the power of a high level programming ...document entitled “The Beginners Guide to MEMS Processing” on the MEMSNet and MEMS Exchange The MEMS Exchange Program Final Technical Report October 29...from the Government is absolutely necessary. As said The MEMS Exchange Program Final Technical Report October 29, 2012 Page 57 of 58 before

  11. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2011-01-01

    Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is nec......Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components...... to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development...

  12. Microbial network of the carbonate precipitation process induced by microbial consortia and the potential application to crack healing in concrete.

    Science.gov (United States)

    Zhang, Jiaguang; Zhou, Aijuan; Liu, Yuanzhen; Zhao, Bowei; Luan, Yunbo; Wang, Sufang; Yue, Xiuping; Li, Zhu

    2017-11-06

    Current studies have employed various pure-cultures for improving concrete durability based on microbially induced carbonate precipitation (MICP). However, there have been very few reports concerned with microbial consortia, which could perform more complex tasks and be more robust in their resistance to environmental fluctuations. In this study, we constructed three microbial consortia that are capable of MICP under aerobic (AE), anaerobic (AN) and facultative anaerobic (FA) conditions. The results showed that AE consortia showed more positive effects on inorganic carbon conversion than AN and FA consortia. Pyrosequencing analysis showed that clear distinctions appeared in the community structure between different microbial consortia systems. Further investigation on microbial community networks revealed that the species in the three microbial consortia built thorough energetic and metabolic interaction networks regarding MICP, nitrate-reduction, bacterial endospores and fermentation communities. Crack-healing experiments showed that the selected cracks of the three consortia-based concrete specimens were almost completely healed in 28 days, which was consistent with the studies using pure cultures. Although the economic advantage might not be clear yet, this study highlights the potential implementation of microbial consortia on crack healing in concrete.

  13. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  14. Wafer level packaging of MEMS

    International Nuclear Information System (INIS)

    Esashi, Masayoshi

    2008-01-01

    Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

  15. Integrated electronics and fluidic MEMS for bioengineering

    Science.gov (United States)

    Fok, Ho Him Raymond

    Microelectromechanical systems (MEMS) and microelectronics have become enabling technologies for many research areas. This dissertation presents the use of fluidic MEMS and microelectronics for bioengineering applications. In particular, the versatility of MEMS and microelectronics is highlighted by the presentation of two different applications, one for in-vitro study of nano-scale dynamics during cell division and one for in-vivo monitoring of biological activities at the cellular level. The first application of an integrated system discussed in this dissertation is to utilize fluidic MEMS for studying dynamics in the mitotic spindle, which could lead to better chemotherapeutic treatments for cancer patients. Previous work has developed the use of electrokinetic phenomena on the surface of a glass-based platform to assemble microtubules, the building blocks of mitotic spindles. Nevertheless, there are two important limitations of this type of platform. First, an unconventional microfabrication process is necessary for the glass-based platform, which limits the utility of this platform. In order to overcome this limitation, in this dissertation a convenient microfluidic system is fabricated using a negative photoresist called SU-8. The fabrication process for the SU-8-based system is compatible with other fabrication techniques used in developing microelectronics, and this compatibility is essential for integrating electronics for studying dynamics in the mitotic spindle. The second limitation of the previously-developed glass-based platform is its lack of bio-compatibility. For example, microtubules strongly interact with the surface of the glass-based platform, thereby hindering the study of dynamics in the mitotic spindle. This dissertation presents a novel approach for assembling microtubules away from the surface of the platform, and a fabrication process is developed to assemble microtubules between two self-aligned thin film electrodes on thick SU-8

  16. MEMS Bragg grating force sensor

    DEFF Research Database (Denmark)

    Reck, Kasper; Thomsen, Erik Vilain; Hansen, Ole

    2011-01-01

    We present modeling, design, fabrication and characterization of a new type of all-optical frequency modulated MEMS force sensor based on a mechanically amplified double clamped waveguide beam structure with integrated Bragg grating. The sensor is ideally suited for force measurements in harsh...... environments and for remote and distributed sensing and has a measured sensitivity of -14 nm/N, which is several times higher than what is obtained in conventional fiber Bragg grating force sensors. © 2011 Optical Society of America....

  17. MEMS Stirling Cooler Development Update

    Science.gov (United States)

    Moran, Matthew E.; Wesolek, Danielle

    2003-01-01

    This presentation provides an update on the effort to build and test a prototype unit of the patented MEMS Stirling cooler concept. A micro-scale regenerator has been fabricated by Polar Thermal Technologies and is currently being integrated into a Stirling cycle simulator at Johns Hopkins University Applied Physics Laboratory. A discussion of the analysis, design, assembly, and test plans for the prototype will be presented.

  18. Surface chemistry and tribology of MEMS.

    Science.gov (United States)

    Maboudian, Roya; Carraro, Carlo

    2004-01-01

    The microscopic length scale and high surface-to-volume ratio, characteristic of microelectro-mechanical systems (MEMS), dictate that surface properties are of paramount importance. This review deals with the effects of surface chemical treatments on tribological properties (adhesion, friction, and wear) of MEMS devices. After a brief review of materials and processes that are utilized in MEMS technology, the relevant tribological and chemical issues are discussed. Various MEMS microinstruments are discussed, which are commonly employed to perform adhesion, friction, and wear measurements. The effects of different surface treatments on the reported tribological properties are discussed.

  19. Feedback Control of MEMS to Atoms

    CERN Document Server

    Shapiro, Benjamin

    2012-01-01

    Feedback Control of MEMS to Atoms illustrates the use of control and control systems as an essential part of functioning integrated miniaturized systems. The book is organized according to the dimensional scale of the problem, starting with microscale systems and ending with atomic-scale systems. Similar to macroscale machines and processes, control systems can play a major role in improving the performance of micro- and nanoscale systems and in enabling new capabilities that would otherwise not be possible. The majority of problems at these scales present many new challenges that go beyond the current state-of-the-art in control theory and engineering. This is a result of the multidisciplinary nature of micro/nanotechnology, which requires the merging of control engineering with physics, biology and chemistry. This book: Shows how the utilization of feedback control in nanotechnology instrumentation can yield results far better than passive systems can Discusses the application of control systems to problems...

  20. A numerical study of non-linear crack tip parameters

    Directory of Open Access Journals (Sweden)

    F.V. Antunes

    2015-07-01

    Full Text Available Crack closure concept has been widely used to explain different issues of fatigue crack propagation. However, different authors have questioned the relevance of crack closure and have proposed alternative concepts. The main objective here is to check the effectiveness of crack closure concept by linking the contact of crack flanks with non-linear crack tip parameters. Accordingly, 3D-FE numerical models with and without contact were developed for a wide range of loading scenarios and the crack tip parameters usually linked to fatigue crack growth, namely range of cyclic plastic strain, crack tip opening displacement, size of reversed plastic zone and total plastic dissipation per cycle, were investigated. It was demonstrated that: i LEFM concepts are applicable to the problem under study; ii the crack closure phenomenon has a great influence on crack tip parameters decreasing their values; iii the Keff concept is able to explain the variations of crack tip parameters produced by the contact of crack flanks; iv the analysis of remote compliance is the best numerical parameter to quantify the crack opening level; v without contact there is no effect of stress ratio on crack tip parameters. Therefore it is proved that the crack closure concept is valid.

  1. A MEMS AC current sensor for residential and commercial electricity end-use monitoring

    International Nuclear Information System (INIS)

    Leland, E S; Wright, P K; White, R M

    2009-01-01

    This paper presents a novel prototype MEMS sensor for alternating current designed for monitoring electricity end-use in residential and commercial environments. This new current sensor design is comprised of a piezoelectric MEMS cantilever with a permanent magnet mounted on the cantilever's free end. When placed near a wire carrying AC current, the magnet is driven sinusoidally, producing a voltage in the cantilever proportional to the current being measured. Analytical models were developed to predict the applicable magnetic forces and piezoelectric voltage output in order to guide the design of a sensor prototype. This paper also details the fabrication process for this sensor design. Released piezoelectric MEMS cantilevers have been fabricated using a four-mask process and aluminum nitride as the active piezoelectric material. Dispenser-printed microscale composite permanent magnets have been integrated, resulting in the first MEMS-scale prototypes of this current sensor design

  2. Thermal Desalination using MEMS and Salinity-Gradient Solar Pond Technology

    Science.gov (United States)

    Lu, H.; Walton, J. C.; Hein, H.

    2002-08-01

    MEMS (multi-effect, multi-stage) flash desalination (distillation) driven by thermal energy derived from a salinity-gradient solar pond is investigated in this study for the purpose of improving the thermodynamic efficiency and economics of this technology. Three major tasks are performed: (1) a MEMS unit is tested under various operating conditions at the El Paso Solar Pond site; (2) the operation and maintenance procedures of the salinity-gradient solar pond coupled with the MEMS operation is studied; and (3) previous test data on a 24-stage, falling-film flash distillation unit (known as the Spinflash) is analyzed and compared with the performance of the MEMS unit. The data and information obtained from this investigation is applicable to a variety of thermal desalination processes using other solar options and/or waste heat.

  3. Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program

    Science.gov (United States)

    Zunino, James L., III; Skelton, Donald

    2005-01-01

    As the United States (U.S.) Army transforms into a lighter, more lethal, and more agile force, the technologies that support both legacy and emerging weapon systems must decrease in size while increasing in intelligence. Micro-electromechanical systems (MEMS) are one such technology that the Army as well as entire DOD will heavily rely on in achieving these objectives. Current and future military applications of MEMS devices include safety and arming devices, guidance systems, sensors/detectors, inertial measurement units, tracking devices, radio frequency devices, wireless radio frequency identification (RFID), etc. Even though the reliance on MEMS devices has been increasing, there have been no studies performed to determine their reliability and failure mechanisms. Furthermore, no standardized test protocols exist for assessing reliability. Accordingly, the U.S. Army Corrosion Office at Picatinny, NJ has initiated the MEMS Reliability Assessment Program to address this issue.

  4. Large-area multiplexed sensing using MEMS and fiber optics

    Science.gov (United States)

    Miller, Michael B.; Clark, Richard L., Jr.; Bell, Clifton R.; Russler, Patrick M.

    2000-06-01

    Micro-electro-mechanical (MEMS) technology offers the ability to implement local and independent sensing and actuation functions through the coordinated response of discrete micro-electro-mechanical 'basis function' elements. The small size of micromechanical components coupled with the ability to reduce costs using volume manufacturing techniques opens up significant potential not only in military applications such as flight and engine monitoring and control, but in autonomous vehicle control, smart munitions, airborne reconnaissance, LADAR, missile guidance, and even in intelligent transportation systems and automotive guidance applications. In this program, Luna Innovations is developing a flexible, programmable interface which can be integrated direction with different types of MEMS sensors, and then used to multiplex many sensors ona single optical fiber to provide a unique combination of functions that will allow larger quantities of sensory input with better resolution than ever before possible.

  5. Use of thermal cycling to reduce adhesion of OTS coated coated MEMS cantilevers

    Science.gov (United States)

    Ali, Shaikh M.; Phinney, Leslie M.

    2003-01-01

    °Microelectromechanical systems (MEMS) have enormous potential to contribute in diverse fields such as automotive, health care, aerospace, consumer products, and biotechnology, but successful commercial applications of MEMS are still small in number. Reliability of MEMS is a major impediment to the commercialization of laboratory prototypes. Due to the multitude of MEMS applications and the numerous processing and packaging steps, MEMS are exposed to a variety of environmental conditions, making the prediction of operational reliability difficult. In this paper, we investigate the effects of operating temperature on the in-use adhesive failure of electrostatically actuated MEMS microcantilevers coated with octadecyltrichlorosilane (OTS) films. The cantilevers are subjected to repeated temperature cycles and electrostatically actuated at temperatures between 25°C and 300°C in ambient air. The experimental results indicate that temperature cycling of the OTS coated cantilevers in air reduces the sticking probability of the microcantilevers. The sticking probability of OTS coated cantilevers was highest during heating, which decreased during cooling, and was lowest during reheating. Modifications to the OTS release method to increase its yield are also discussed.

  6. Strong Motion Seismograph Based On MEMS Accelerometer

    Science.gov (United States)

    Teng, Y.; Hu, X.

    2013-12-01

    The MEMS strong motion seismograph we developed used the modularization method to design its software and hardware.It can fit various needs in different application situation.The hardware of the instrument is composed of a MEMS accelerometer,a control processor system,a data-storage system,a wired real-time data transmission system by IP network,a wireless data transmission module by 3G broadband,a GPS calibration module and power supply system with a large-volumn lithium battery in it. Among it,the seismograph's sensor adopted a three-axis with 14-bit high resolution and digital output MEMS accelerometer.Its noise level just reach about 99μg/√Hz and ×2g to ×8g dynamically selectable full-scale.Its output data rates from 1.56Hz to 800Hz. Its maximum current consumption is merely 165μA,and the device is so small that it is available in a 3mm×3mm×1mm QFN package. Furthermore,there is access to both low pass filtered data as well as high pass filtered data,which minimizes the data analysis required for earthquake signal detection. So,the data post-processing can be simplified. Controlling process system adopts a 32-bit low power consumption embedded ARM9 processor-S3C2440 and is based on the Linux operation system.The processor's operating clock at 400MHz.The controlling system's main memory is a 64MB SDRAM with a 256MB flash-memory.Besides,an external high-capacity SD card data memory can be easily added.So the system can meet the requirements for data acquisition,data processing,data transmission,data storage,and so on. Both wired and wireless network can satisfy remote real-time monitoring, data transmission,system maintenance,status monitoring or updating software.Linux was embedded and multi-layer designed conception was used.The code, including sensor hardware driver,the data acquisition,earthquake setting out and so on,was written on medium layer.The hardware driver consist of IIC-Bus interface driver, IO driver and asynchronous notification driver. The

  7. Programmable differential capacitance-to-voltage converter for MEMS accelerometers

    Science.gov (United States)

    Royo, G.; Sánchez-Azqueta, C.; Gimeno, C.; Aldea, C.; Celma, S.

    2017-05-01

    Capacitive MEMS sensors exhibit an excellent noise performance, high sensitivity and low power consumption. They offer a huge range of applications, being the accelerometer one of its main uses. In this work, we present the design of a capacitance-to-voltage converter in CMOS technology to measure the acceleration from the capacitance variations. It is based on a low-power, fully-differential transimpedance amplifier with low input impedance and a very low input noise.

  8. MEMS-Based Micro Gas Chromatography: Design, Fabrication and Characterization

    OpenAIRE

    Zareian-Jahromi, Mohammad Amin

    2009-01-01

    This work is focused on the design, fabrication and characterization of high performance MEMS-based micro gas chromatography columns having wide range of applications in the pharmaceutical industry, environmental monitoring, petroleum distillation, clinical chemistry, and food processing. The first part of this work describes different approaches to achieve high-performance microfabricated silicon-glass separation columns for micro gas chromatographic (µGC) systems. The capillary width effec...

  9. Opening of through-wall cracks in BWR coolant lines due to the application of severe overloads II: a simple approach

    International Nuclear Information System (INIS)

    Smith, E.

    1984-01-01

    A simple theoretical analysis gives an estimate of the opening area associated with a through-wall crack in a pipe when this is subject to an imposed rotation at its ends. The crack-opening area is expressed in terms of the crack size, and the plastic rotation at the cracked cross-section, where plastic deformation is assumed to be confined. The results are relevant to the integrity of boiling water reactor coolant systems during accident conditions

  10. T-stresses for internally cracked components

    International Nuclear Information System (INIS)

    Fett, T.

    1997-12-01

    The failure of cracked components is governed by the stresses in the vicinity of the crack tip. The singular stress contribution is characterised by the stress intensity factor K, the first regular stress term is represented by the so-called T-stress. T-stress solutions for components containing an internal crack were computed by application of the Bundary Collocation Method (BCM). The results are compiled in form of tables or approximative relations. In addition a Green's function of T-stresses is proposed for internal cracks which enables to compute T-stress terms for any given stress distribution in the uncracked body. (orig.) [de

  11. Wavelength tunable MEMS VCSELs for OCT imaging

    DEFF Research Database (Denmark)

    Sahoo, Hitesh Kumar; Ansbæk, Thor; Ottaviano, Luisa

    2018-01-01

    MEMS VCSELs are one of the most promising swept source (SS) lasers for optical coherence tomography (OCT) and one of the best candidates for future integration with endoscopes, surgical probes and achieving an integrated OCT system. However, the current MEMS-based SS are processed on the III...

  12. Evolution of a MEMS Photoacoustic Chemical Sensor

    National Research Council Canada - National Science Library

    Pellegrino, Paul M; Polcawich, Ronald G

    2003-01-01

    .... Initial MEMS work is centered on fabrication of a lead zirconate titanate (PZT) microphone subsystem to be incorporated in the full photoacoustic device. Preliminary results were very positive for the macro-photoacoustic cell, PZT membrane microphones design / fabrication and elementary monolithic MEMS photoacoustic cavity.

  13. MEMS-Based Waste Vibrational Energy Harvesters

    Science.gov (United States)

    2013-06-01

    MEMS energy- harvesting device. Although PZT is used more prevalently due to its higher piezoelectric coefficient and dielectric constant, AlN has...7 1. Lead Zirconium Titanate ( PZT ) .........................................................7 2. Aluminum...Laboratory PiezoMUMPS Piezoelectric Multi-User MEMS Processes PZT Lead Zirconate Titanate SEM Scanning Electron Microscopy SiO2 Silicon

  14. The Micronium-A Musical MEMS instrument

    NARCIS (Netherlands)

    Engelen, Johannes Bernardus Charles; de Boer, Hans L.; de Boer, Hylco; Beekman, Jethro G.; Fortgens, Laurens C.; de Graaf, Derk B.; Vocke, Sander; Abelmann, Leon

    The Micronium is a musical instrument fabricated from silicon using microelectromechanical system (MEMS) technology. It is—to the best of our knowledge—the first musical micro-instrument fabricated using MEMS technology, where the actual sound is generated by mechanical microstructures. The

  15. Application of the standard options of the FITNET procedure to the structural integrity assessment of welded specimens containing cracks

    International Nuclear Information System (INIS)

    Dzioba, Ihor; Neimitz, Andrzej

    2007-01-01

    In this paper, the structural integrity of welded specimens is assessed. The specimens were welded using a conventional technique, MAG, and an unconventional one, laser technology. Welded specimens were of the central crack under tension (CCT) type. The elements were loaded, the maximum load was recorded, and the second and the third options of the FITNET procedure were utilized to estimate the critical loading. Estimated and recorded loads were compared to verify the conservatism of the estimated results. For comparison, the results obtained using Option 1 of the FITNET procedure (not recommended in the case analysed) are also presented. Results of the mechanical properties, hardness, fracture toughness for the base and the weld material and residual stress distributions are reported for both MAG and laser welding techniques. The results obtained confirm that the FITNET procedures were properly deigned. The higher the level of analysis, the smaller the conservatism of predictions observed. The overconservative conclusions, following from the lower level of analysis, suggest that the structural element is endangered, do not have to exclude it from exploitation. The higher level of analysis can, in some cases, confirm that the structural element containing a crack can still be exploited

  16. Effects of the Crack Tip Constraint on the Fracture Assessment of an Al 5083-O Weldment for Low Temperature Applications

    Directory of Open Access Journals (Sweden)

    Dong Hyun Moon

    2017-07-01

    Full Text Available The constraint effect is the key issue in structural integrity assessments based on two parameter fracture mechanics (TPFM to make a precise prediction of the load-bearing capacity of cracked structural components. In this study, a constraint-based failure assessment diagram (FAD was used to assess the fracture behavior of an Al 5083-O weldment with various flaws at cryogenic temperature. The results were compared with those of BS 7910 Option 1 FAD, in terms of the maximum allowable stress. A series of fracture toughness tests were conducted with compact tension (CT specimens at room and cryogenic temperatures. The Q parameter for the Al 5083-O weldment was evaluated to quantify the constraint level, which is the difference between the actual stress, and the Hutchinson-Rice-Rosengren (HRR stress field near the crack tip. Nonlinear 3D finite element analysis was carried out to calculate the Q parameter at cryogenic temperature. Based on the experimental and numerical results, the influence of the constraint level correction on the allowable applied stress was investigated using a FAD methodology. The results showed that the constraint-based FAD procedure is essential to avoid an overly conservative allowable stress prediction in an Al 5083-O weldment with flaws.

  17. Crack formation and prevention in colloidal drops

    Science.gov (United States)

    Kim, Jin Young; Cho, Kun; Ryu, Seul-A.; Kim, So Youn; Weon, Byung Mook

    2015-08-01

    Crack formation is a frequent result of residual stress release from colloidal films made by the evaporation of colloidal droplets containing nanoparticles. Crack prevention is a significant task in industrial applications such as painting and inkjet printing with colloidal nanoparticles. Here, we illustrate how colloidal drops evaporate and how crack generation is dependent on the particle size and initial volume fraction, through direct visualization of the individual colloids with confocal laser microscopy. To prevent crack formation, we suggest use of a versatile method to control the colloid-polymer interactions by mixing a nonadsorbing polymer with the colloidal suspension, which is known to drive gelation of the particles with short-range attraction. Gelation-driven crack prevention is a feasible and simple method to obtain crack-free, uniform coatings through drying-mediated assembly of colloidal nanoparticles.

  18. Measurement of the Earth tides with a MEMS gravimeter.

    Science.gov (United States)

    Middlemiss, R P; Samarelli, A; Paul, D J; Hough, J; Rowan, S; Hammond, G D

    2016-03-31

    The ability to measure tiny variations in the local gravitational acceleration allows, besides other applications, the detection of hidden hydrocarbon reserves, magma build-up before volcanic eruptions, and subterranean tunnels. Several technologies are available that achieve the sensitivities required for such applications (tens of microgal per hertz(1/2)): free-fall gravimeters, spring-based gravimeters, superconducting gravimeters, and atom interferometers. All of these devices can observe the Earth tides: the elastic deformation of the Earth's crust as a result of tidal forces. This is a universally predictable gravitational signal that requires both high sensitivity and high stability over timescales of several days to measure. All present gravimeters, however, have limitations of high cost (more than 100,000 US dollars) and high mass (more than 8 kilograms). Here we present a microelectromechanical system (MEMS) device with a sensitivity of 40 microgal per hertz(1/2) only a few cubic centimetres in size. We use it to measure the Earth tides, revealing the long-term stability of our instrument compared to any other MEMS device. MEMS accelerometers--found in most smart phones--can be mass-produced remarkably cheaply, but none are stable enough to be called a gravimeter. Our device has thus made the transition from accelerometer to gravimeter. The small size and low cost of this MEMS gravimeter suggests many applications in gravity mapping. For example, it could be mounted on a drone instead of low-flying aircraft for distributed land surveying and exploration, deployed to monitor volcanoes, or built into multi-pixel density-contrast imaging arrays.

  19. High Efficiency Optical MEMS by the Integration of Photonic Lattices with Surface MEMS

    Energy Technology Data Exchange (ETDEWEB)

    FLEMING, JAMES G.; LIN, SHAWN-YU; MANI, SEETHAMBAL S.; RODGERS, M. STEVEN; DAGEL, DARYL J.

    2002-11-01

    This report outlines our work on the integration of high efficiency photonic lattice structures with MEMS (MicroElectroMechanical Systems). The simplest of these structures were based on 1-D mirror structures. These were integrated into a variety of devices, movable mirrors, switchable cavities and finally into Bragg fiber structures which enable the control of light in at least 2 dimensions. Of these devices, the most complex were the Bragg fibers. Bragg fibers consist of hollow tubes in which light is guided in a low index media (air) and confined by surrounding Bragg mirror stacks. In this work, structures with internal diameters from 5 to 30 microns have been fabricated and much larger structures should also be possible. We have demonstrated the fabrication of these structures with short wavelength band edges ranging from 400 to 1600nm. There may be potential applications for such structures in the fields of integrated optics and BioMEMS. We have also looked at the possibility of waveguiding in 3 dimensions by integrating defects into 3-dimensional photonic lattice structures. Eventually it may be possible to tune such structures by mechanically modulating the defects.

  20. Mixed-mode stress intensity factors for kink cracks with finite kink length loaded in tension and bending: application to dentin and enamel.

    Science.gov (United States)

    Bechtle, Sabine; Fett, Theo; Rizzi, Gabriele; Habelitz, Stefan; Schneider, Gerold A

    2010-05-01

    Fracture toughness resistance curves describe a material's resistance against crack propagation. These curves are often used to characterize biomaterials like bone, nacre or dentin as these materials commonly exhibit a pronounced increase in fracture toughness with crack extension due to co-acting mechanisms such as crack bridging, crack deflection and microcracking. The knowledge of appropriate stress intensity factors which depend on the sample and crack geometry is essential for determining these curves. For the dental biomaterials enamel and dentin it was observed that, under bending and tensile loading, crack propagation occurs under certain constant angles to the initial notch direction during testing procedures used for fracture resistance curve determination. For this special crack geometry (a kink crack of finite length in a finite body) appropriate geometric function solutions are missing. Hence, we present in this study new mixed-mode stress intensity factors for kink cracks with finite kink length within samples of finite dimensions for two loading cases (tension and bending) which were derived from a combination of mixed-mode stress intensity factors of kink cracks with infinitely small kinks and of slant cracks. These results were further applied to determine the fracture resistance curves of enamel and dentin by testing single edge notched bending (SENB) specimens. It was found that kink cracks with finite kink length exhibit identical stress fields to slant cracks as soon as the kink length exceeds 0.15 times the initial straight crack or notch length. The use of stress intensity factor solutions for infinitely small kink cracks for the determination of dentin fracture resistance curves (as was done by other researchers) leads to an overestimation of dentin's fracture resistance of up to 30%. Copyright 2010 Elsevier Ltd. All rights reserved.

  1. A Review on Key Issues and Challenges in Devices Level MEMS Testing

    Directory of Open Access Journals (Sweden)

    Muhammad Shoaib

    2016-01-01

    Full Text Available The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

  2. Direct integration of MEMS, dielectric pumping and cell manipulation with reversibly bonded gecko adhesive microfluidics

    International Nuclear Information System (INIS)

    Warnat, S; King, H; Hubbard, T; Wasay, A; Sameoto, D

    2016-01-01

    We present an approach to form a microfluidic environment on top of MEMS dies using reversibly bonded microfluidics. The reversible polymeric microfluidics moulds bond to the MEMS die using a gecko-inspired gasket architecture. In this study the formed microchannels are demonstrated in conjunction with a MEMS mechanical single cell testing environment for BioMEMS applications. A reversible microfluidics placement technique with an x - y and rotational accuracy of  ±2 µ m and 1° respectively on a MEMS die was developed. No leaks were observed during pneumatic pumping of common cell media (PBS, sorbitol, water, seawater) through the fluidic channels. Thermal chevron actuators were successful operated inside this fluidic environment and a performance deviation of ∼15% was measured compared to an open MEMS configuration. Latex micro-spheres were pumped using traveling wave di-electrophoresis and compared to an open (no-microfluidics) configuration with velocities of 24 µ m s −1 and 20 µ m s −1 . (technical note)

  3. Modified Dugdale cracks and Fictitious cracks

    DEFF Research Database (Denmark)

    Nielsen, Lauge Fuglsang

    1998-01-01

    A number of theories are presented in the literature on crack mechanics by which the strength of damaged materials can be predicted. Among these are theories based on the well-known Dugdale model of a crack prevented from spreading by self-created constant cohesive flow stressed acting in local...... areas, so-called fictitious cracks, in front of the crack.The Modified Dugdale theory presented in this paper is also based on the concept of Dugdale cracks. Any cohesive stress distribution, however, can be considered in front of the crack. Formally the strength of a material weakened by a modified...... Dugdale crack is the same as if it has been weakened by the well-known Griffith crack, namely sigma_CR = (EG_CR/phi)^1/2 where E and 1 are Young's modulus and crack half-length respectively, and G_CR is the so-called critical energy release rate. The physical significance of G_CR, however, is different...

  4. Development of MEMS photoacoustic spectroscopy

    Energy Technology Data Exchange (ETDEWEB)

    Robinson, Alex Lockwood; Eichenfield, Matthew S.; Griffin, Benjamin; Harvey, Heidi Alyssa; Nielson, Gregory N.; Okandan, Murat; Langlois, Eric; Resnick, Paul James; Shaw, Michael J.; Young, Ian; Givler, Richard C.; Reinke, Charles M.

    2014-01-01

    After years in the field, many materials suffer degradation, off-gassing, and chemical changes causing build-up of measurable chemical atmospheres. Stand-alone embedded chemical sensors are typically limited in specificity, require electrical lines, and/or calibration drift makes data reliability questionable. Along with size, these "Achilles' heels" have prevented incorporation of gas sensing into sealed, hazardous locations which would highly benefit from in-situ analysis. We report on development of an all-optical, mid-IR, fiber-optic based MEMS Photoacoustic Spectroscopy solution to address these limitations. Concurrent modeling and computational simulation are used to guide hardware design and implementation.

  5. Axial asymmetry for improved sensitivity in MEMS piezoresistors

    International Nuclear Information System (INIS)

    Shuvra, Pranoy Deb; McNamara, Shamus; Lin, Ji-Tzuoh; Alphenaar, Bruce; Walsh, Kevin; Davidson, Jim

    2016-01-01

    The strain induced resistance change is compared for asymmetric, symmetric and diffused piezoresistive elements. Finite element analysis is used to simulate the performance of a T-shaped piezoresistive MEMS cantilever, including a lumped parameter model to show the effect of geometric asymmetry on the piezoresistor sensitivity. Asymmetric piezoresistors are found to be much more sensitive to applied load than the typical symmetric design producing about two orders of magnitude higher resistance change. This is shown to be due to the difference in the stress distribution in the symmetric and asymmetric geometries resulting in less resistance change cancellation in the asymmetric design. Although still less sensitive than diffused piezoresistors, asymmetric piezoresistors are sensitive enough for many applications, and are much easier to fabricate and integrate into MEMS devices. (paper)

  6. MEMS Device Being Developed for Active Cooling and Temperature Control

    Science.gov (United States)

    Moran, Matthew E.

    2001-01-01

    High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) is currently under development at the NASA Glenn Research Center to meet this need. It uses a thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface. The device can be used strictly in the cooling mode, or it can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly are accomplished by wet etching and wafer bonding techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces and limited failure modes, and minimal induced vibration.

  7. Design, modeling and simulation of MEMS-based silicon Microneedles

    International Nuclear Information System (INIS)

    Amin, F; Ahmed, S

    2013-01-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  8. Design, modeling and simulation of MEMS-based silicon Microneedles

    Science.gov (United States)

    Amin, F.; Ahmed, S.

    2013-06-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  9. Full C-band Tunable MEMS-VCSEL for Next Generation G.metro Mobile Front- and Backhauling

    DEFF Research Database (Denmark)

    Wagner, Christoph; Zou, Shihuan Jim; Ortsiefer, Markus

    2017-01-01

    We report full C-band tunable, 10 Gbit/s capability, directly modulated MEMS-VCSEL for next generation converged mobile fronthaul and backhaul applications. Bit error rates below 10(-9) were achieved over up to 40 km SSMF.......We report full C-band tunable, 10 Gbit/s capability, directly modulated MEMS-VCSEL for next generation converged mobile fronthaul and backhaul applications. Bit error rates below 10(-9) were achieved over up to 40 km SSMF....

  10. Simulation of delamination crack growth in composite laminates: application of local and non-local interface damage models

    International Nuclear Information System (INIS)

    Ijaz, H.; Asad, M.

    2015-01-01

    The use of composite laminates is increasing in these days due to higher strength and low density values in comparison of metals. Delamination is a major source of failure in composite laminates. Damage mechanics based theories are employed to simulate the delamination phenomena between composite laminates. These damage models are inherently local and can cause the concentration of stresses around the crack tip. In the present study integral type non-local damage formulation is proposed to avoid the localization problem associated to damage formulation. A comprehensive study is carried out for the models and classical local damage model are performed and results are compared with available experimental data for un IMS/924 Carbon/fiber epoxy composite laminate. (author)

  11. Microfibrous metallic cloth for acoustic isolation of a MEMS gyroscope

    Science.gov (United States)

    Dean, Robert; Burch, Nesha; Black, Meagan; Beal, Aubrey; Flowers, George

    2011-04-01

    The response of a MEMS device that is exposed to a harsh environment may range from an increased noise floor to a completely erroneous output to temporary or even permanent device failure. One such harsh environment is high power acoustic energy possessing high frequency components. This type of environment sometimes occurs in small aerospace vehicles. In this type of operating environment, high frequency acoustic energy can be transferred to a MEMS gyroscope die through the device packaging. If the acoustic noise possesses a sufficiently strong component at the resonant frequency of the gyroscope, it will overexcite the motion of the proof mass, resulting in the deleterious effect of corrupted angular rate measurement. Therefore if the device or system packaging can be improved to sufficiently isolate the gyroscope die from environmental acoustic energy, the sensor may find new applications in this type of harsh environment. This research effort explored the use of microfibrous metallic cloth for isolating the gyroscope die from environmental acoustic excitation. Microfibrous cloth is a composite of fused, intermingled metal fibers and has a variety of typical uses involving chemical processing applications and filtering. Specifically, this research consisted of experimental evaluations of multiple layers of packed microfibrous cloth composed of sintered nickel material. The packed cloth was used to provide acoustic isolation for a test MEMS gyroscope, the Analog Devices ADXRS300. The results of this investigation revealed that the intermingling of the various fibers of the metallic cloth provided a significant contact area between the fiber strands and voids, which enhanced the acoustic damping of the material. As a result, the nickel cloth was discovered to be an effective acoustic isolation material for this particular MEMS gyroscope.

  12. Design and Fabrication of a Reconfigurable MEMS-Based Antenna

    KAUST Repository

    Martinez, Miguel Angel Galicia

    2011-06-22

    This thesis presents the design and fabrication of a customized in house Micro-Electro-Mechanical-Systems (MEMS) process based on-chip antenna that is both frequency and polarization reconfigurable. It is designed to work at both 60 GHz and 77 GHz through MEMS switches. This antenna can also work in both horizontal and vertical linear polarizations by utilizing a moveable plate. The design is intended for Wireless Personal Area Networks (WPAN) and automotive radar applications. Typical on-chip antennas are inefficient and difficult to reconfigure. Therefore, the focus of this work is to develop an efficient on-chip antenna solution, which is reconfigurable in frequency and in polarization. A fractal bowtie antenna is employed for this thesis, which achieves frequency reconfigurability through MEMS switches. The design is simulated in industry standard Electromagnetic (EM) simulator Ansoft HFSS. A novel concept for horizontal to vertical linear polarization agility is introduced which incorporates a moveable polymer plate. For this work, a microprobe is used to move the plate from the horizontal to vertical position. For testing purposes, a novel mechanism has been designed in order to feed the antenna with RF-probes in both horizontal and vertical positions. A simulated gain of approximately 0 dB is achieved at both target frequencies (60 and 77 GHz), in both horizontal and vertical positions. In all the cases mentioned above (both frequencies and positions), the antenna is well matched (< -10 dB) to the 50 Ω system impedance. Similarly, the radiation nulls are successfully shifted by changing the position of the antenna from horizontal to vertical. The complete design and fabrication of the reconfigurable MEMS antenna has been done at KAUST facilities. Some challenges have been encountered during its realization due to the immaturity of the customized MEMS fabrication process. Nonetheless, a first fabrication attempt has highlighted such shortcomings. According

  13. Design of Surface micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2001-01-01

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMS, most have used comb-drive actuation methods and bulk micromachining processes. This research focuses on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  14. Design of Surface Micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2002-12-31

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMs, most have used comb-drive actuation methods and bulk micromachining processes. This research focused on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  15. Tunneling cracks in full scale wind turbine blade joints

    DEFF Research Database (Denmark)

    Jørgensen, Jeppe Bjørn; Sørensen, Bent F.; Kildegaard, C.

    2017-01-01

    A novel approach is presented and used in a generic tunneling crack tool for the prediction of crack growth rates for tunneling cracks propagating across a bond-line in a wind turbine blade under high cyclic loadings. In order to test and demonstrate the applicability of the tool, model predictions...

  16. Cocaine (Coke, Crack) Facts

    Science.gov (United States)

    ... That People Abuse » Cocaine (Coke, Crack) Facts Cocaine (Coke, Crack) Facts Listen Cocaine is a white ... 69 KB) "My life was built around getting cocaine and getting high." ©istock.com/ Marjot Stacey is ...

  17. MemFlash device: floating gate transistors as memristive devices for neuromorphic computing

    Science.gov (United States)

    Riggert, C.; Ziegler, M.; Schroeder, D.; Krautschneider, W. H.; Kohlstedt, H.

    2014-10-01

    Memristive devices are promising candidates for future non-volatile memory applications and mixed-signal circuits. In the field of neuromorphic engineering these devices are especially interesting to emulate neuronal functionality. Therefore, new materials and material combinations are currently investigated, which are often not compatible with Si-technology processes. The underlying mechanisms of the device often remain unclear and are paired with low device endurance and yield. These facts define the current most challenging development tasks towards a reliable memristive device technology. In this respect, the MemFlash concept is of particular interest. A MemFlash device results from a diode configuration wiring scheme of a floating gate transistor, which enables the persistent device resistance to be varied according to the history of the charge flow through the device. In this study, we investigate the scaling conditions of the floating gate oxide thickness with respect to possible applications in the field of neuromorphic engineering. We show that MemFlash cells exhibit essential features with respect to neuromorphic applications. In particular, cells with thin floating gate oxides show a limited synaptic weight growth together with low energy dissipation. MemFlash cells present an attractive alternative for state-of-art memresitive devices. The emulation of associative learning is discussed by implementing a single MemFlash cell in an analogue circuit.

  18. MemFlash device: floating gate transistors as memristive devices for neuromorphic computing

    International Nuclear Information System (INIS)

    Riggert, C; Ziegler, M; Kohlstedt, H; Schroeder, D; Krautschneider, W H

    2014-01-01

    Memristive devices are promising candidates for future non-volatile memory applications and mixed-signal circuits. In the field of neuromorphic engineering these devices are especially interesting to emulate neuronal functionality. Therefore, new materials and material combinations are currently investigated, which are often not compatible with Si-technology processes. The underlying mechanisms of the device often remain unclear and are paired with low device endurance and yield. These facts define the current most challenging development tasks towards a reliable memristive device technology. In this respect, the MemFlash concept is of particular interest. A MemFlash device results from a diode configuration wiring scheme of a floating gate transistor, which enables the persistent device resistance to be varied according to the history of the charge flow through the device. In this study, we investigate the scaling conditions of the floating gate oxide thickness with respect to possible applications in the field of neuromorphic engineering. We show that MemFlash cells exhibit essential features with respect to neuromorphic applications. In particular, cells with thin floating gate oxides show a limited synaptic weight growth together with low energy dissipation. MemFlash cells present an attractive alternative for state-of-art memresitive devices. The emulation of associative learning is discussed by implementing a single MemFlash cell in an analogue circuit. (paper)

  19. Adhesion aspects in MEMS/NEMS

    CERN Document Server

    Kim, Seong H; Mittal, Kash L

    2012-01-01

    Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface

  20. Practical guide to RF-MEMS

    CERN Document Server

    Iannacci, Jacopo

    2013-01-01

    Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical

  1. Resonant Magnetic Field Sensors Based On MEMS Technology

    Directory of Open Access Journals (Sweden)

    Elías Manjarrez

    2009-09-01

    Full Text Available Microelectromechanical systems (MEMS technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

  2. Improving Planetary Rover Attitude Estimation via MEMS Sensor Characterization

    Science.gov (United States)

    Hidalgo, Javier; Poulakis, Pantelis; Köhler, Johan; Del-Cerro, Jaime; Barrientos, Antonio

    2012-01-01

    Micro Electro-Mechanical Systems (MEMS) are currently being considered in the space sector due to its suitable level of performance for spacecrafts in terms of mechanical robustness with low power consumption, small mass and size, and significant advantage in system design and accommodation. However, there is still a lack of understanding regarding the performance and testing of these new sensors, especially in planetary robotics. This paper presents what is missing in the field: a complete methodology regarding the characterization and modeling of MEMS sensors with direct application. A reproducible and complete approach including all the intermediate steps, tools and laboratory equipment is described. The process of sensor error characterization and modeling through to the final integration in the sensor fusion scheme is explained with detail. Although the concept of fusion is relatively easy to comprehend, carefully characterizing and filtering sensor information is not an easy task and is essential for good performance. The strength of the approach has been verified with representative tests of novel high-grade MEMS inertia sensors and exemplary planetary rover platforms with promising results. PMID:22438761

  3. Low Actuating Voltage Spring-Free RF MEMS SPDT Switch

    Directory of Open Access Journals (Sweden)

    Deepak Bansal

    2016-01-01

    Full Text Available RF MEMS devices are known to be superior to their solid state counterparts in terms of power consumption and electromagnetic response. Major limitations of MEMS devices are their low switching speed, high actuation voltage, larger size, and reliability. In the present paper, a see-saw single pole double throw (SPDT RF MEMS switch based on anchor-free mechanism is proposed which eliminates the above-mentioned disadvantages. The proposed switch has a switching time of 394 nsec with actuation voltage of 5 V. Size of the SPDT switch is reduced by utilizing a single series capacitive switch compared to conventional switches with capacitive and series combinations. Reliability of the switch is improved by adding floating metal and reducing stiction between the actuating bridge and transmission line. Insertion loss and isolation are better than −0.6 dB and −20 dB, respectively, for 1 GHz to 20 GHz applications.

  4. Resonant Magnetic Field Sensors Based On MEMS Technology

    Science.gov (United States)

    Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías

    2009-01-01

    Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480

  5. FPGA platform for MEMS Disc Resonance Gyroscope (DRG) control

    Science.gov (United States)

    Keymeulen, Didier; Peay, Chris; Foor, David; Trung, Tran; Bakhshi, Alireza; Withington, Phil; Yee, Karl; Terrile, Rich

    2008-04-01

    Inertial navigation systems based upon optical gyroscopes tend to be expensive, large, power consumptive, and are not long lived. Micro-Electromechanical Systems (MEMS) based gyros do not have these shortcomings; however, until recently, the performance of MEMS based gyros had been below navigation grade. Boeing and JPL have been cooperating since 1997 to develop high performance MEMS gyroscopes for miniature, low power space Inertial Reference Unit applications. The efforts resulted in demonstration of a Post Resonator Gyroscope (PRG). This experience led to the more compact Disc Resonator Gyroscope (DRG) for further reduced size and power with potentially increased performance. Currently, the mass, volume and power of the DRG are dominated by the size of the electronics. This paper will detail the FPGA based digital electronics architecture and its implementation for the DRG which will allow reduction of size and power and will increase performance through a reduction in electronics noise. Using the digital control based on FPGA, we can program and modify in real-time the control loop to adapt to the specificity of each particular gyro and the change of the mechanical characteristic of the gyro during its life time.

  6. On the hot cracking susceptibility of a semisolid aluminium 6061 weld: Application of a coupled solidification- thermomechanical model

    International Nuclear Information System (INIS)

    Rajani, H R Zareie; Phillion, A B

    2015-01-01

    A coupled solidification-thermomechanical model is presented that investigates the hot tearing susceptibility of an aluminium 6061 semisolid weld. Two key phenomena are considered: excessive deformation of the semisolid weld, initiating a hot tear, and the ability of the semisolid weld to heal the hot tear by circulation of the molten metal. The model consists of two major modules: weld solidification and thermomechanical analysis. 1) By means of a multi-scale model of solidification, the microstructural evolution of the semisolid weld is simulated in 3D. The semisolid structure, which varies as a function of welding parameters, is composed of solidifying grains and a network of micro liquid channels. The weld solidification module is utilized to obtain the solidification shrinkage. The size of the micro liquid channels is used as an indicator to assess the healing ability of the semisolid weld. 2) Using the finite element method, the mechanical interaction between the weld pool and the base metal is simulated to capture the transient force field deforming the semisolid weld. Thermomechanical stresses and shrinkage stresses are both considered in the analysis; the solidification contractions are extracted from the weld solidification module and applied to the deformation simulation as boundary conditions. Such an analysis enables characterization of the potential for excessive deformation of the weld. The outputs of the model are used to study the effect of welding parameters including welding current and speed, and also welding constraint on the hot cracking susceptibility of an aluminium alloy 6061 semisolid weld. (paper)

  7. Smartphone MEMS accelerometers and earthquake early warning

    Science.gov (United States)

    Kong, Q.; Allen, R. M.; Schreier, L.; Kwon, Y. W.

    2015-12-01

    The low cost MEMS accelerometers in the smartphones are attracting more and more attentions from the science community due to the vast number and potential applications in various areas. We are using the accelerometers inside the smartphones to detect the earthquakes. We did shake table tests to show these accelerometers are also suitable to record large shakings caused by earthquakes. We developed an android app - MyShake, which can even distinguish earthquake movements from daily human activities from the recordings recorded by the accelerometers in personal smartphones and upload trigger information/waveform to our server for further analysis. The data from these smartphones forms a unique datasets for seismological applications, such as earthquake early warning. In this talk I will layout the method we used to recognize earthquake-like movement from single smartphone, and the overview of the whole system that harness the information from a network of smartphones for rapid earthquake detection. This type of system can be easily deployed and scaled up around the global and provides additional insights of the earthquake hazards.

  8. Identification of cracks in thick beams with a cracked beam element model

    Science.gov (United States)

    Hou, Chuanchuan; Lu, Yong

    2016-12-01

    The effect of a crack on the vibration of a beam is a classical problem, and various models have been proposed, ranging from the basic stiffness reduction method to the more sophisticated model involving formulation based on the additional flexibility due to a crack. However, in the damage identification or finite element model updating applications, it is still common practice to employ a simple stiffness reduction factor to represent a crack in the identification process, whereas the use of a more realistic crack model is rather limited. In this paper, the issues with the simple stiffness reduction method, particularly concerning thick beams, are highlighted along with a review of several other crack models. A robust finite element model updating procedure is then presented for the detection of cracks in beams. The description of the crack parameters is based on the cracked beam flexibility formulated by means of the fracture mechanics, and it takes into consideration of shear deformation and coupling between translational and longitudinal vibrations, and thus is particularly suitable for thick beams. The identification procedure employs a global searching technique using Genetic Algorithms, and there is no restriction on the location, severity and the number of cracks to be identified. The procedure is verified to yield satisfactory identification for practically any configurations of cracks in a beam.

  9. MEMS Gyroscope with Interferometric Detection, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The proposed innovation is a novel MEMS gyroscope that uses micro-interferometric detection to measure the motion of the proof mass. Using an interferometric...

  10. Wireless MEMs BioSensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

  11. MEMS and Nano-Technology Clean Room

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS and Nano-Technology Clean Room is a state-of-the-art, 800 square foot, Class 1000-capable facility used for development of micro and sub-micro scale sensors...

  12. Fractal Structures For Mems Variable Capacitors

    KAUST Repository

    Elshurafa, Amro M.; Radwan, Ahmed Gomaa Ahmed; Emira, Ahmed A.; Salama, Khaled N.

    2014-01-01

    In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure, wherein the capacitor body has an upper first metal plate with a fractal shape

  13. Nonlinear Dynamics of Electrostatically Actuated MEMS Arches

    KAUST Repository

    Al Hennawi, Qais M.

    2015-01-01

    In this thesis, we present theoretical and experimental investigation into the nonlinear statics and dynamics of clamped-clamped in-plane MEMS arches when excited by an electrostatic force. Theoretically, we first solve the equation of motion using

  14. Cryogenic MEMS Pressure Sensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — A directly immersible cryogenic MEMS pressure sensor will be developed. Each silicon die will contain a vacuum-reference and a tent-like membrane. Offsetting thermal...

  15. MEMS Sensors and Actuators Laboratory (MSAL)

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS Sensors and Actuators Laboratory (MSAL) in the A.J. Clark School of Engineering at the University of Maryland (UMD) was established in January 2000. Our lab...

  16. Optical MEMS for chemical analysis and biomedicine

    CERN Document Server

    Jiang, Hongrui

    2016-01-01

    This book describes the current state of optical MEMS in chemical and biomedical analysis and brings together current trends and highlights topics representing the most exciting progress in recent years in the field.

  17. Chloride Ingress in Concrete Cracks under Cyclic Loading

    DEFF Research Database (Denmark)

    Küter, André; Geiker, Mette Rica; Olesen, John Forbes

    2005-01-01

    was similar for both sets and the maximum crack width was kept constant throughout the exposure period by means of precracking and an external prestressed reinforcement. Chloride profiles after 40 days revealed a considerable increase in ingress towards the crack tip in contrast to data from the literature....... Preliminary investigations have been undertaken to quantify the effect of dynamic load application on the chloride ingress into concrete cracks. Specimens were designed allowing ingress of a chloride solution into a single crack of a saturated unreinforced mortar beam. One set of specimens was subjected...... to a load frequency of ten applications per minute and a second set to one application per hour simulating static cracks, however limiting the ingress hampering effects of autogenous healing and a possible dense precipitation on the crack faces. The averaged chloride exposure interval of the crack faces...

  18. A Compact and Low-Cost MEMS Loudspeaker for Digital Hearing Aids.

    Science.gov (United States)

    Sang-Soo Je; Rivas, F; Diaz, R E; Jiuk Kwon; Jeonghwan Kim; Bakkaloglu, B; Kiaei, S; Junseok Chae

    2009-10-01

    A microelectromechanical-systems (MEMS)-based electromagnetically actuated loudspeaker to reduce form factor, cost, and power consumption, and increase energy efficiency in hearing-aid applications is presented. The MEMS loudspeaker has multilayer copper coils, an NiFe soft magnet on a thin polyimide diaphragm, and an NdFeB permanent magnet on the perimeter. The coil impedance is measured at 1.5 Omega, and the resonant frequency of the diaphragm is located far from the audio frequency range. The device is driven by a power-scalable, 0.25-mum complementary metal-oxide semiconductor class-D SigmaDelta amplifier stage. The class-D amplifier is formed by a differential H-bridge driven by a single bit, pulse-density-modulated SigmaDelta bitstream at a 1.2-MHz clock rate. The fabricated MEMS loudspeaker generates more than 0.8-mum displacement, equivalent to 106-dB sound pressure level (SPL), with 0.13-mW power consumption. Driven by the SigmaDelta class-D amplifier, the MEMS loudspeaker achieves measured 65-dB total harmonic distortion (THD) with a measurement uncertainty of less than 10%. Energy-efficient and cost-effective advanced hearing aids would benefit from further miniaturization via MEMS technology. The results from this study appear very promising for developing a compact, mass-producible, low-power loudspeaker with sufficient sound generation for hearing-aid applications.

  19. Stress-intensity factor equations for cracks in three-dimensional finite bodies

    Science.gov (United States)

    Newman, J. C., Jr.; Raju, I. S.

    1981-01-01

    Empirical stress intensity factor equations are presented for embedded elliptical cracks, semi-elliptical surface cracks, quarter-elliptical corner cracks, semi-elliptical surface cracks at a hole, and quarter-elliptical corner cracks at a hole in finite plates. The plates were subjected to remote tensile loading. Equations give stress intensity factors as a function of parametric angle, crack depth, crack length, plate thickness, and where applicable, hole radius. The stress intensity factors used to develop the equations were obtained from three dimensional finite element analyses of these crack configurations.

  20. The initiation of environmentally-assisted cracking in semi-elliptical surface cracks

    International Nuclear Information System (INIS)

    James, L.A.

    1997-01-01

    A criterion to predict under what conditions EAC would Initiate In cracks In a high-sulfur steel in contact with low-oxygen water was recently proposed by Wire and U. This EAC Initiation Criterion was developed using transient analyses for the diffusion of sulfides plus experimental test results. The experiments were conducted mainly on compact tension-type specimens with initial crack depths of about 2.54 mm. The present paper expands upon the work of Wire and U by presenting results for significantly deeper initial semi-elliptical surface cracks. In addition, in one specimen, the surface crack penetrated weld-deposited cladding into the high-sulfur steel. The results for the semi-elliptical surface cracks agreed quite well with the EAC Initiation Criterion, and provide confirmation of the applicability of the criterion to crack configurations with more restricted access to water

  1. Influence of localized plasticity on Stress Corrosion Cracking of austenitic stainless steel. Application to IASCC of internals reactor core vessels

    International Nuclear Information System (INIS)

    Cisse, Sarata

    2012-01-01

    The surface conditions of the 316L screw connecting vessel internals of the primary circuit of PWR (pressurized water reactor) corresponds to a grinding condition. These screws are affected by the IASCC (Irradiation Assisted Stress Corrosion Cracking). Initiation of cracking depends on the surface condition but also on the external oxidation and interactions of oxide layer with the deformation bands. The first objective of this study is to point the influence of surface condition on the growth kinetic of oxide layer, and the surface reactivity of 304, 316 stainless steel grade exposed to PWR primary water at 340 C. The second objective is to determine influence of strain localization on the SCC of austenitic stainless steels in PWR primary water. Indeed, the microstructure of irradiated 304, 316 grades correspond to a localized deformation in deformation bands free of radiation defects. In order to reproduce that microstructure without conducting irradiations, low cycle fatigue tests at controlled stain amplitude are implemented for the model material of the study (A286 austenitic stainless steel hardened by the precipitation of phase γ'Ni3(Ti, Al)). During the mechanical cycling (after the first hardening cycles), the precipitates are dissolved in slip bands leading to the localization of the deformation. Once the right experimental conditions in low cycle fatigue obtained (for localized microstructure), interactions oxidation / deformation bands are studied by oxidizing pre deformed samples containing deformation bands and non deformed samples. The tensile tests at a slow strain rate of 8 x 10 -8 /s are also carried out on pre deformed samples and undeformed samples. The results showed that surface treatment induces microstructural modifications of the metal just under the oxide layer, leading to slower growth kinetics of the oxide layer. However, surface treatment accelerates development of oxides penetrations in metal under the oxide layer. As example, for

  2. CARES/Life Used for Probabilistic Characterization of MEMS Pressure Sensor Membranes

    Science.gov (United States)

    Nemeth, Noel N.

    2002-01-01

    Microelectromechanical systems (MEMS) devices are typically made from brittle materials such as silicon using traditional semiconductor manufacturing techniques. They can be etched (or micromachined) from larger structures or can be built up with material deposition processes. Maintaining dimensional control and consistent mechanical properties is considerably more difficult for MEMS because feature size is on the micrometer scale. Therefore, the application of probabilistic design methodology becomes necessary for MEMS. This was demonstrated at the NASA Glenn Research Center and Case Western Reserve University in an investigation that used the NASA-developed CARES/Life brittle material design program to study the probabilistic fracture strength behavior of single-crystal SiC, polycrystalline SiC, and amorphous Si3N4 pressurized 1-mm-square thin-film diaphragms. These materials are of interest because of their superior high-temperature characteristics, which are desirable for harsh environment applications such as turbine engine and rocket propulsion system hot sections.

  3. MEMS for pico- to micro-satellites

    OpenAIRE

    Shea, Herbert

    2009-01-01

    MEMS sensors, actuators, and sub-systems can enable an important reduction in the size and mass of spacecrafts, first by replacing larger and heavier components, then by replacing entire subsystems, and finally by enabling the microfabrication of highly integrated picosats. Very small satellites (1 to 100 kg) stand to benefit the most from MEMS technologies. These small satellites are typically used for science or technology demonstration missions, with higher risk tolerance than multi-ton te...

  4. Recent Progress in Silicon Mems Oscillators

    Science.gov (United States)

    2008-12-01

    MEMS oscillator. As shown, a MEMS resonator is connected to an IC. The reference oscillator, which is basically a transimpedance amplifier ...small size), and (3) DC bias voltage required to operate the resonators. As a result, instead of Colpitts or Pierce architecture, a transimpedence ... amplifier is typically used for sustain the oscillation. The frequency of the resonators is determined by both material properties and geometry of

  5. Fabrication of integrated metallic MEMS devices

    DEFF Research Database (Denmark)

    Yalcinkaya, Arda Deniz; Ravnkilde, Jan Tue; Hansen, Ole

    2002-01-01

    A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators are characteri......A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators...

  6. A novel piezoresistive polymer nanocomposite MEMS accelerometer

    International Nuclear Information System (INIS)

    Seena, V; Hari, K; Prajakta, S; Ramgopal Rao, V; Pratap, Rudra

    2017-01-01

    A novel polymer MEMS (micro electro mechanical systems) accelerometer with photo-patternable polymer nanocomposite as a piezoresistor is presented in this work. Polymer MEMS Accelerometer with beam thicknesses of 3.3 µ m and embedded nanocomposite piezoresistive layer having a gauge factor of 90 were fabricated. The photosensitive nanocomposite samples were prepared and characterized for analyzing the mechanical and electrical properties and thereby ensuring proper process parameters for incorporating the piezoresistive layer into the polymer MEMS accelerometer. The microfabrication process flow and unit processes followed are extremely low cost with process temperatures below 100 °C. This also opens up a new possibility for easy integration of such polymer MEMS with CMOS (complementary metal oxide semiconductor) devices and circuits. The fabricated devices were characterized using laser Doppler vibrometer (LDV) and the devices exhibited a resonant frequency of 10.8 kHz and a response sensitivity of 280 nm g −1 at resonance. The main focus of this paper is on the SU-8/CB nanocomposite piezoresistive MEMS accelerometer technology development which covers the material and the fabrication aspects of these devices. CoventorWare FEA analysis performed using the extracted material properties from the experimental characterization which are in close agreement to performance parameters of the fabricated devices is also discussed. The simulated piezoresistive polymer MEMS devices showed an acceleration sensitivity of 126 nm g −1 and 82 ppm of Δ R / R per 1 g of acceleration. (paper)

  7. Design and Simulation of an RF-MEMS Switch and analysis of its Electromagnetic aspect in realtion to stress

    Directory of Open Access Journals (Sweden)

    Amna Riaz

    2018-01-01

    Full Text Available Microelectromechanical Systems (MEMS are devices made up of several electrical and mechanical components. They consist of mechanical functions (sensing, thermal, inertial and electrical functions (switching, decision making on a single chip made by microfabrication methods. These chips exhibit combined properties of the two functions. The size of system has characteristic dimensions less than 1mm but more than 1μm. The configuration of these components determine the final deliverables of the switch. MEMS can be designed to meet user requirements on any level from microbiological application such as biomedical transducers or tissue engineering, to mechanical systems such as microfluidic diagnoses or chemical fuel cells. The low cost, small mass and minimal power consumption of the MEMS makes it possible to readily integrate to any kind of system in any environment. MEMS are faster, better and cheaper. They offer excellent electrical performances. MEMS working at Radio frequencies are RF MEMS. RF-MEMS switches find huge market in the modern telecommunication networks, biological, automobiles, satellites and defense systems because of their lower power consumptions at relatively higher frequencies and better electrical performances. But the reliability is the major hurdle in the fate of RF MEMS switches. Reliability mainly arises due to the presence of residual stresses, charging current, fatigue and creep and contact degradation. The presence of residual stresses in switches the S-Parameters of the switches are affected badly and the residual stress affects the final planarity of the fabricated structure. Design and simulation of an RF-MEMS switch is proposed considering the residual stresses in both on and off state. The operating frequency band is being optimized and the best possible feasible fabrication technique for the proposed switch design is being analyzed. S-Parameters are calculated and a comparison for the switches with stress and

  8. Piezoelectric MEMS sensors: state-of-the-art and perspectives

    International Nuclear Information System (INIS)

    Tadigadapa, S; Mateti, K

    2009-01-01

    Over the past two decades, several advances have been made in micromachined sensors and actuators. As the field of microelectromechanical systems (MEMS) has advanced, a clear need for the integration of materials other than silicon and its compounds into micromachined transducers has emerged. Piezoelectric materials are high energy density materials that scale very favorably upon miniaturization and that has led to an ever-growing interest in piezoelectric films for MEMS applications. At this time, piezoelectric aluminum-nitride-based film bulk acoustic resonators (FBAR) have already been successfully commercialized. Future innovations and improvements in inertial sensors for navigation, high-frequency crystal oscillators and filters for wireless applications, microactuators for RF applications, chip-scale chemical analysis systems and countless other applications hinge upon the successful miniaturization of components and integration of piezoelectrics and metals into these systems. In this article, a comprehensive review of micromachined piezoelectric transducer technology will be presented. Piezoelectric materials in bulk and thin film forms will be reviewed and fabrication techniques for the integration of these materials for microsensor applications will be presented. Recent advances in various piezoelectric microsensors will be presented through specific examples. This review will conclude with a critical assessment of the future trends and promise of this technology. (topical review)

  9. Monte Carlo simulation taking account of surface crack effect for stress corrosion cracking in a stainless steel SUS 304

    International Nuclear Information System (INIS)

    Tohgo, Keiichiro; Suzuki, Hiromitsu; Shimamura, Yoshinobu; Nakayama, Guen; Hirano, Takashi

    2008-01-01

    Stress corrosion cracking (SCC) in structural metal materials occurs by initiation and coalescence of micro cracks, subcritical crack propagation and multiple large crack formation or final failure under the combination of materials, stress and corrosive environment. In this paper, a Monte Carlo simulation for the process of SCC has been proposed based on the stochastic properties of micro crack initiation and fracture mechanics concept for crack coalescence and propagation. The emphasis in the model is put on the influence of semi-elliptical surface cracks. Numerical simulations are carried out based on CBB (creviced bent beam) test results of a sensitized stainless steel SUS 304 and the influence of micro crack initiation rate and coalescence condition on the simulation results is discussed. The numerical examples indicate the applicability of the present model to a prediction of the SCC behavior in real structures. (author)

  10. Investigation of Helicopter Longeron Cracks

    Science.gov (United States)

    Newman, John A.; Baughman, James; Wallace, Terryl A.

    2009-01-01

    Four cracked longerons, containing a total of eight cracks, were provided for study. Cracked regions were cut from the longerons. Load was applied to open the cracks, enabling crack surface examination. Examination revealed that crack propagation was driven by fatigue loading in all eight cases. Fatigue crack initiation appears to have occurred on the top edge of the longerons near geometric changes that affect component bending stiffness. Additionally, metallurgical analysis has revealed a local depletion in alloying elements in the crack initiation regions that may be a contributing factor. Fatigue crack propagation appeared to be initially driven by opening-mode loading, but at a crack length of approximately 0.5 inches (12.7 mm), there is evidence of mixed-mode crack loading. For the longest cracks studied, shear-mode displacements destroyed crack-surface features of interest over significant portions of the crack surfaces.

  11. Crack detecting method

    International Nuclear Information System (INIS)

    Narita, Michiko; Aida, Shigekazu

    1998-01-01

    A penetration liquid or a slow drying penetration liquid prepared by mixing a penetration liquid and a slow drying liquid is filled to the inside of an artificial crack formed to a member to be detected such as of boiler power generation facilities and nuclear power facilities. A developing liquid is applied to the periphery of the artificial crack on the surface of a member to be detected. As the slow-drying liquid, an oil having a viscosity of 56 is preferably used. Loads are applied repeatedly to the member to be detected, and when a crack is caused to the artificial crack, the permeation liquid penetrates into the crack. The penetration liquid penetrated into the crack is developed by the developing liquid previously coated to the periphery of the artificial crack of the surface of the member to be detected. When a crack is caused, since the crack is developed clearly even if it is a small opening, the crack can be recognized visually reliably. (I.N.)

  12. Analysis of crack initiation in the vicinity of an interface in brittle materials. Applications to ceramic matrix composites and nuclear fuels

    International Nuclear Information System (INIS)

    Poitou, B.

    2007-11-01

    In this study, criterions are proposed to describe crack initiation in the vicinity of an interface in brittle bi-materials. The purpose is to provide a guide for the elaboration of ceramic multi-layer structures being able to develop damage tolerance by promoting crack deflection along interfaces. Several cracking mechanisms are analyzed, like the competition between the deflection of a primary crack along the interface or its penetration in the second layer. This work is first completed in a general case and is then used to describe the crack deviation at the interface in ceramic matrix composites and nuclear fuels. In this last part, experimental tests are carried out to determine the material fracture properties needed to the deflection criteria. An optimization of the fuel coating can be proposed in order to increase its toughness. (author)

  13. Corrosion Effects on the Fatigue Crack Propagation of Giga-Grade Steel and its Heat Affected Zone in pH Buffer Solutions for Automotive Application

    Science.gov (United States)

    Lee, H. S.

    2018-03-01

    Corrosion fatigue crack propagation test was conducted of giga-grade steel and its heat affected zone in pH buffer solutions, and the results were compared with model predictions. Pure corrosion effect on fatigue crack propagation, particularly, in corrosive environment was evaluated by means of the modified Forman equation. As shown in results, the average corrosion rate determined from the ratio of pure corrosion induced crack length to entire crack length under a cycle load were 0.11 and 0.37 for base metal and heat affected zone, respectively, with load ratio of 0.5, frequency of 0.5 and pH 10.0 environment. These results demonstrate new interpretation methodology for corrosion fatigue crack propagation enabling the pure corrosion effects on the behavior to be determined.

  14. UAV-borne lidar with MEMS mirror-based scanning capability

    Science.gov (United States)

    Kasturi, Abhishek; Milanovic, Veljko; Atwood, Bryan H.; Yang, James

    2016-05-01

    Firstly, we demonstrated a wirelessly controlled MEMS scan module with imaging and laser tracking capability which can be mounted and flown on a small UAV quadcopter. The MEMS scan module was reduced down to a small volume of smartphone via Bluetooth while flying on a drone, and could project vector content, text, and perform laser based tracking. Also, a "point-and-range" LiDAR module was developed for UAV applications based on low SWaP (Size, Weight and Power) gimbal-less MEMS mirror beam-steering technology and off-the-shelf OEM LRF modules. For demonstration purposes of an integrated laser range finder module, we used a simple off-the-shelf OEM laser range finder (LRF) with a 100m range, +/-1.5mm accuracy, and 4Hz ranging capability. The LRFs receiver optics were modified to accept 20° of angle, matching the transmitter's FoR. A relatively large (5.0mm) diameter MEMS mirror with +/-10° optical scanning angle was utilized in the demonstration to maintain the small beam divergence of the module. The complete LiDAR prototype can fit into a small volume of battery. The MEMS mirror based LiDAR system allows for ondemand ranging of points or areas within the FoR without altering the UAV's position. Increasing the LRF ranging frequency and stabilizing the pointing of the laser beam by utilizing the onboard inertial sensors and the camera are additional goals of the next design.

  15. Crack detection using image processing

    International Nuclear Information System (INIS)

    Moustafa, M.A.A

    2010-01-01

    This thesis contains five main subjects in eight chapters and two appendices. The first subject discus Wiener filter for filtering images. In the second subject, we examine using different methods, as Steepest Descent Algorithm (SDA) and the Wavelet Transformation, to detect and filling the cracks, and it's applications in different areas as Nano technology and Bio-technology. In third subject, we attempt to find 3-D images from 1-D or 2-D images using texture mapping with Open Gl under Visual C ++ language programming. The fourth subject consists of the process of using the image warping methods for finding the depth of 2-D images using affine transformation, bilinear transformation, projective mapping, Mosaic warping and similarity transformation. More details about this subject will be discussed below. The fifth subject, the Bezier curves and surface, will be discussed in details. The methods for creating Bezier curves and surface with unknown distribution, using only control points. At the end of our discussion we will obtain the solid form, using the so called NURBS (Non-Uniform Rational B-Spline); which depends on: the degree of freedom, control points, knots, and an evaluation rule; and is defined as a mathematical representation of 3-D geometry that can accurately describe any shape from a simple 2-D line, circle, arc, or curve to the most complex 3-D organic free-form surface or (solid) which depends on finding the Bezier curve and creating family of curves (surface), then filling in between to obtain the solid form. Another representation for this subject is concerned with building 3D geometric models from physical objects using image-based techniques. The advantage of image techniques is that they require no expensive equipment; we use NURBS, subdivision surface and mesh for finding the depth of any image with one still view or 2D image. The quality of filtering depends on the way the data is incorporated into the model. The data should be treated with

  16. Curvilinear crack layer propagation

    Science.gov (United States)

    Chudnovsky, Alexander; Chaoui, Kamel; Moet, Abdelsamie

    1987-01-01

    An account is given of an experiment designed to allow observation of the effect of damage orientation on the direction of crack growth in the case of crack layer propagation, using polystyrene as the model material. The direction of crack advance under a given loading condition is noted to be determined by a competition between the tendency of the crack to maintain its current direction and the tendency to follow the orientation of the crazes at its tip. The orientation of the crazes is, on the other hand, determined by the stress field due to the interaction of the crack, the crazes, and the hole. The changes in craze rotation relative to the crack define the active zone rotation.

  17. Graphitization in Carbon MEMS and Carbon NEMS

    Science.gov (United States)

    Sharma, Swati

    Carbon MEMS (CMEMS) and Carbon NEMS (CNEMS) are an emerging class of miniaturized devices. Due to the numerous advantages such as scalable manufacturing processes, inexpensive and readily available precursor polymer materials, tunable surface properties and biocompatibility, carbon has become a preferred material for a wide variety of future sensing applications. Single suspended carbon nanowires (CNWs) integrated on CMEMS structures fabricated by electrospinning of SU8 photoresist on photolithographially patterned SU8 followed by pyrolysis are utilized for understanding the graphitization process in micro and nano carbon materials. These monolithic CNW-CMEMS structures enable the fabrication of very high aspect ratio CNWs of predefined length. The CNWs thus fabricated display core---shell structures having a graphitic shell with a glassy carbon core. The electrical conductivity of these CNWs is increased by about 100% compared to glassy carbon as a result of enhanced graphitization. We explore various tunable fabrication and pyrolysis parameters to improve graphitization in the resulting CNWs. We also suggest gas-sensing application of the thus fabricated single suspended CNW-CMEMS devices by using the CNW as a nano-hotplate for local chemical vapor deposition. In this thesis we also report on results from an optimization study of SU8 photoresist derived carbon electrodes. These electrodes were applied to the simultaneous detection of traces of Cd(II) and Pb(II) through anodic stripping voltammetry and detection limits as low as 0.7 and 0.8 microgL-1 were achieved. To further improve upon the electrochemical behavior of the carbon electrodes we elucidate a modified pyrolysis technique featuring an ultra-fast temperature ramp for obtaining bubbled porous carbon from lithographically patterned SU8. We conclude this dissertation by suggesting the possible future works on enhancing graphitization as well as on electrochemical applications

  18. Terahertz non-destructive imaging of cracks and cracking in structures of cement-based materials

    Directory of Open Access Journals (Sweden)

    Shujie Fan

    2017-11-01

    Full Text Available Cracks and crack propagation in cement-based materials are key factors leading to failure of structures, affecting safety in construction engineering. This work investigated the application of terahertz (THz non-destructive imaging to inspections on structures of cement-based materials, so as to explore the potential of THz imaging in crack detection. Two kinds of disk specimens made of plain cement mortar and UHMWPE fiber concrete were prepared respectively. A mechanical expansion load device was deployed to generate cracks and control the whole process of cracking. Experimental tests were carried out on cracked specimens by using a commercial THz time domain spectroscopy (THz-TDS during loading. The results show that crack opening and propagation could be examined by THz clearly and the material factors influence the ability of crack resistance significantly. It was found that the THz imaging of crack initiation and propagation agrees with the practical phenomenon and supplies more information about damage of samples. It is demonstrated that the damage behavior of structures of cement-based materials can be successfully detected by THz imaging.

  19. Terahertz non-destructive imaging of cracks and cracking in structures of cement-based materials

    Science.gov (United States)

    Fan, Shujie; Li, Tongchun; Zhou, Jun; Liu, Xiaoqing; Liu, Xiaoming; Qi, Huijun; Mu, Zhiyong

    2017-11-01

    Cracks and crack propagation in cement-based materials are key factors leading to failure of structures, affecting safety in construction engineering. This work investigated the application of terahertz (THz) non-destructive imaging to inspections on structures of cement-based materials, so as to explore the potential of THz imaging in crack detection. Two kinds of disk specimens made of plain cement mortar and UHMWPE fiber concrete were prepared respectively. A mechanical expansion load device was deployed to generate cracks and control the whole process of cracking. Experimental tests were carried out on cracked specimens by using a commercial THz time domain spectroscopy (THz-TDS) during loading. The results show that crack opening and propagation could be examined by THz clearly and the material factors influence the ability of crack resistance significantly. It was found that the THz imaging of crack initiation and propagation agrees with the practical phenomenon and supplies more information about damage of samples. It is demonstrated that the damage behavior of structures of cement-based materials can be successfully detected by THz imaging.

  20. Investigation of the physics of diamond MEMS : diamond allotrope lithography

    International Nuclear Information System (INIS)

    Zalizniak, I.; Olivero, P.; Jamieson, D.N.; Prawer, S.; Reichart, P.; Rubanov, S.; Petriconi, S.

    2005-01-01

    We propose a novel lithography process in which ion induced phase transfomations of diamond form sacrificial layers allowing the fabrication of small structures including micro-electromechanical systems (MEMS). We have applied this novel lithography to the fabrication of diamond microcavities, cantilevers and optical waveguides. In this paper we present preliminary experiments directed at the fabrication of suspended diamond disks that have the potential for operation as optical resonators. Such structures would be very durable and resistant to chemical attack with potential applications as novel sensors for extreme environments or high temperature radiation detectors. (author). 3 refs., 3 figs

  1. Damage assessment in multilayered MEMS structures under thermal fatigue

    Science.gov (United States)

    Maligno, A. R.; Whalley, D. C.; Silberschmidt, V. V.

    2011-07-01

    This paper reports on the application of a Physics of Failure (PoF) methodology to assessing the reliability of a micro electro mechanical system (MEMS). Numerical simulations, based on the finite element method (FEM) using a sub-domain approach was used to examine the damage onset due to temperature variations (e.g. yielding of metals which may lead to thermal fatigue). In this work remeshing techniques were employed in order to develop a damage tolerance approach based on the assumption that initial flaws exist in the multi-layered.

  2. Automatic synthesis of MEMS devices using self-adaptive hybrid metaheuristics

    DEFF Research Database (Denmark)

    Tutum, Cem Celal; Fan, Zhun

    2011-01-01

    - multaneous minimization of size and power input of a MEMS device, while investigating optimum geometrical conguration as the main concern. The major contribution of this paper is the application of self-adaptive memetic computing in MEMS design. An evolutionary multi-objective optimization (EMO) technique......, in particular non-dominated sorting genetic algorithm (NSGA-II), has been applied to- gether with a pattern recognition statistical tool, i.e. Principal Component Analysis (PCA), to nd multiple trade-o solutions in an ecient manner. Following this, a gradient- based local search, i.e. sequential quadratic...

  3. Lessons learned from nanoscale specimens tested by MEMS-based apparatus

    Science.gov (United States)

    Elhebeary, Mohamed; Saif, M. Taher A.

    2017-06-01

    The last two decades were marked by the innovative synthesis of nanomaterials and devices. The success of these devices hinges on the mechanical properties of nanomaterials and an understanding of their deformation and failure mechanisms. Many novel testing techniques have been developed to test materials at small scale. This paper reviews the state-of-the-art microelectromechanical systems (MEMS) apparatus developed to characterize materials at nanoscale, and the key insights gained on structure-property relations of materials through these characterizations. Finally, new applications of MEMS in testing living materials, such as tissues and cells, for disease diagnosis and prognosis are discussed.

  4. Lessons learned from nanoscale specimens tested by MEMS-based apparatus

    International Nuclear Information System (INIS)

    Elhebeary, Mohamed; Saif, M Taher A

    2017-01-01

    The last two decades were marked by the innovative synthesis of nanomaterials and devices. The success of these devices hinges on the mechanical properties of nanomaterials and an understanding of their deformation and failure mechanisms. Many novel testing techniques have been developed to test materials at small scale. This paper reviews the state-of-the-art microelectromechanical systems (MEMS) apparatus developed to characterize materials at nanoscale, and the key insights gained on structure-property relations of materials through these characterizations. Finally, new applications of MEMS in testing living materials, such as tissues and cells, for disease diagnosis and prognosis are discussed. (topical review)

  5. MEMS microphone innovations towards high signal to noise ratios (Conference Presentation) (Plenary Presentation)

    Science.gov (United States)

    Dehé, Alfons

    2017-06-01

    After decades of research and more than ten years of successful production in very high volumes Silicon MEMS microphones are mature and unbeatable in form factor and robustness. Audio applications such as video, noise cancellation and speech recognition are key differentiators in smart phones. Microphones with low self-noise enable those functions. Backplate-free microphones enter the signal to noise ratios above 70dB(A). This talk will describe state of the art MEMS technology of Infineon Technologies. An outlook on future technologies such as the comb sensor microphone will be given.

  6. Purifying oils, cracking oils, catalysts. [British Patent

    Energy Technology Data Exchange (ETDEWEB)

    1936-02-05

    Hydrocarbon oils are refined by treating while substantially in the liquid phase between 200/sup 0/ and 400/sup 0/C with a phosphoric acid catalyst deposited on metallurgical coke, a suitable blast furnace slag, silica gel or other carrier with similar properties, until the objectionable components are converted into innocuous substances by polymerization cracking, isomerization and/or alkylation. By this treatment the bromine number is reduced, the end-point of the A.S.T.M. distillation is increased, the octane number is raised, mercaptans are converted to hydrogen sulphide and olefines, thioethers and thiophenes are converted to mereaptans, and the initial boiling point is lowered. The process is applicable to gasoline, cracked distillate, kerosine and lubricating oil, obtained by distilling or cracking petroleum, shale and hydrogenated oils; and is particularly applicable for stabilizing cracked distillates.

  7. A Study on the Performance of Low Cost MEMS Sensors in Strong Motion Studies

    Science.gov (United States)

    Tanırcan, Gulum; Alçık, Hakan; Kaya, Yavuz; Beyen, Kemal

    2017-04-01

    Recent advances in sensors have helped the growth of local networks. In recent years, many Micro Electro Mechanical System (MEMS)-based accelerometers have been successfully used in seismology and earthquake engineering projects. This is basically due to the increased precision obtained in these downsized instruments. Moreover, they are cheaper alternatives to force-balance type accelerometers. In Turkey, though MEMS-based accelerometers have been used in various individual applications such as magnitude and location determination of earthquakes, structural health monitoring, earthquake early warning systems, MEMS-based strong motion networks are not currently available in other populated areas of the country. Motivation of this study comes from the fact that, if MEMS sensors are qualified to record strong motion parameters of large earthquakes, a dense network can be formed in an affordable price at highly populated areas. The goals of this study are 1) to test the performance of MEMS sensors, which are available in the inventory of the Institute through shake table tests, and 2) to setup a small scale network for observing online data transfer speed to a trusted in-house routine. In order to evaluate the suitability of sensors in strong motion related studies, MEMS sensors and a reference sensor are tested under excitations of sweeping waves as well as scaled earthquake recordings. Amplitude response and correlation coefficients versus frequencies are compared. As for earthquake recordings, comparisons are carried out in terms of strong motion(SM) parameters (PGA, PGV, AI, CAV) and elastic response of structures (Sa). Furthermore, this paper also focuses on sensitivity and selectivity for sensor performances in time-frequency domain to compare different sensing characteristics and analyzes the basic strong motion parameters that influence the design majors. Results show that the cheapest MEMS sensors under investigation are able to record the mid

  8. MEMS Rotary Engine Power System

    Science.gov (United States)

    Fernandez-Pello, A. Carlos; Pisano, Albert P.; Fu, Kelvin; Walther, David C.; Knobloch, Aaron; Martinez, Fabian; Senesky, Matt; Stoldt, Conrad; Maboudian, Roya; Sanders, Seth; Liepmann, Dorian

    This work presents a project overview and recent research results for the MEMS Rotary Engine Power System project at the Berkeley Sensor & Actuator Center of the University of California at Berkeley. The research motivation for the project is the high specific energy density of hydrocarbon fuels. When compared with the energy density of batteries, hydrocarbon fuels may have as much as 20x more energy. However, the technical challenge is the conversion of hydrocarbon fuel to electricity in an efficient and clean micro engine. A 12.9 mm diameter Wankel engine will be shown that has already generated 4 Watts of power at 9300rpm. In addition, the 1mm and 2.4 mm Wankel engines that BSAC is developing for power generation at the microscale will be discussed. The project goal is to develop electrical power output of 90milliwatts from the 2.4 mm engine. Prototype engine components have already been fabricated and these will be described. The integrated generator design concept utilizes a nickel-iron alloy electroplated in the engine rotor poles, so that the engine rotor also serves as the generator rotor.

  9. Mid infrared MEMS FTIR spectrometer

    Science.gov (United States)

    Erfan, Mazen; Sabry, Yasser M.; Mortada, Bassem; Sharaf, Khaled; Khalil, Diaa

    2016-03-01

    In this work we report, for the first time to the best of our knowledge, a bulk-micromachined wideband MEMS-based spectrometer covering both the NIR and the MIR ranges and working from 1200 nm to 4800 nm. The core engine of the spectrometer is a scanning Michelson interferometer micro-fabricated using deep reactive ion etching (DRIE) technology. The spectrum is obtained using the Fourier Transform techniques that allows covering a very wide spectral range limited by the detector responsivity. The moving mirror of the interferometer is driven by a relatively large stroke electrostatic comb-drive actuator. Zirconium fluoride (ZrF4) multimode optical fibers are used to connect light between the white light source and the interferometer input, as well as the interferometer output to a PbSe photoconductive detector. The recorded signal-to-noise ratio is 25 dB at the wavelength of 3350 nm. The spectrometer is successfully used in measuring the absorption spectra of methylene chloride, quartz glass and polystyrene film. The presented solution provides a low cost method for producing miniaturized spectrometers in the near-/mid-infrared.

  10. Crack arrest concepts for failure prevention and life extension. Proceedings

    International Nuclear Information System (INIS)

    Wiesner, C.S.

    1996-01-01

    These proceedings contain the thirteen papers presented at a seminar on crack arrest concepts for failure prevention and life extension. They provide a picture of the current position of crack arrest testing, models and applications, discussion of the relevance of recent research to industrial problems, and an assessment of whether the application of crack arrest models provides additional safety. Separate abstracts have been prepared for seven papers of relevance to the nuclear industry and, in particular, reactor pressure vessels. (UK)

  11. MEMS/MOEMS foundry services at INO

    Science.gov (United States)

    García-Blanco, Sonia; Ilias, Samir; Williamson, Fraser; Généreux, Francis; Le Noc, Loïc; Poirier, Michel; Proulx, Christian; Tremblay, Bruno; Provençal, Francis; Desroches, Yan; Caron, Jean-Sol; Larouche, Carl; Beaupré, Patrick; Fortin, Benoit; Topart, Patrice; Picard, Francis; Alain, Christine; Pope, Timothy; Jerominek, Hubert

    2010-06-01

    In the MEMS manufacturing world, the "fabless" model is getting increasing importance in recent years as a way for MEMS manufactures and startups to minimize equipment costs and initial capital investment. In order for this model to be successful, the fabless company needs to work closely with a MEMS foundry service provider. Due to the lack of standardization in MEMS processes, as opposed to CMOS microfabrication, the experience in MEMS development processes and the flexibility of the MEMS foundry are of vital importance. A multidisciplinary team together with a complete microfabrication toolset allows INO to offer unique MEMS foundry services to fabless companies looking for low to mid-volume production. Companies that benefit from their own microfabrication facilities can also be interested in INO's assistance in conducting their research and development work during periods where production runs keep their whole staff busy. Services include design, prototyping, fabrication, packaging, and testing of various MEMS and MOEMS devices on wafers fully compatible with CMOS integration. Wafer diameters ranging typically from 1 inch to 6 inches can be accepted while 8-inch wafers can be processed in some instances. Standard microfabrication techniques such as metal, dielectric, and semiconductor film deposition and etching as well as photolithographic pattern transfer are available. A stepper permits reduction of the critical dimension to around 0.4 μm. Metals deposited by vacuum deposition methods include Au, Ag, Al, Al alloys, Ti, Cr, Cu, Mo, MoCr, Ni, Pt, and V with thickness varying from 5 nm to 2 μm. Electroplating of several materials including Ni, Au and In is also available. In addition, INO has developed and built a gold black deposition facility to answer customer's needs for broadband microbolometric detectors. The gold black deposited presents specular reflectance of less than 10% in the wavelength range from 0.2 μm to 100 μm with thickness ranging from

  12. Small fatigue cracks; Proceedings of the Second International Conference/Workshop, Santa Barbara, CA, Jan. 5-10, 1986

    Energy Technology Data Exchange (ETDEWEB)

    Ritchie, R.O.; Lankford, J.

    1986-01-01

    Topics discussed in this volume include crack initiation and stage I growth, microstructure effects, crack closure, environment effects, the role of notches, analytical modeling, fracture mechanics characterization, experimental techniques, and engineering applications. Papers are presented on fatigue crack initiation along slip bands, the effect of microplastic surface deformation on the growth of small cracks, short fatigue crack behavior in relation to three-dimensional aspects and the crack closure effect, the influence of crack depth on crack electrochemistry and fatigue crack growth, and nondamaging notches in fatigue. Consideration is also given to models of small fatigue cracks, short crack theory, assessment of the growth of small flaws from residual strength data, the relevance of short crack behavior to the integrity of major rotating aero engine components, and the relevance of short fatigue crack growth data to the durability and damage tolerance analyses of aircraft.

  13. Vacuum behavior and control of a MEMS stage with integrated thermal displacement sensor

    NARCIS (Netherlands)

    Krijnen, B.; Brouwer, Dannis Michel; Abelmann, Leon; Herder, Justus Laurens

    2015-01-01

    We investigate the applicability of a MEMS stage in a vacuum environment. The stage is suspended by a flexure mechanism and is actuated by electrostatic comb-drives. The position of the stage is measured by an integrated sensor based on the conductance of heat through air. The vacuum behavior of the

  14. Optimization of the fluid catalytic cracking unit performance by application of a high motor Octane catalyst and reduction of gasoline vapour pressure

    International Nuclear Information System (INIS)

    Chavdarov, I.; Stratiev, D.; Shishkova, I.; Dinkov, R.; Petkov, P.

    2013-01-01

    Full text: The fluid catalytic cracking (FCC) gasoline is the main contributor to the refinery gasoline pool in the LUKOIL Neftohim Burgas (LNB) refinery. Next in quantity contributor in the refinery gasoline pool is the reformate. The FCC gasoline sensitivity (MON-RON) is about 12 points. The reformer gasoline sensitivity is 11 points. The high sensitivity of the main contributors to the LNB refinery gasoline pool leads to a shortage in the motor octane number. For that reason a selection of an FCC catalyst that is capable of increasing the motor octane number of the FCC gasoline was performed. The application of this catalyst in the LNB FCC unit has led to an increase of the motor octane number of the FCC gasoline by 0.5 points, which enabled the refinery to increase the production of automotive gasolines by 1.3 % and to increase the share of premium automotive gasoline by 5 %. This had an effect of improvement of the refinery economics by a six figure number of US $ per year. The optimization of the FCC gasoline Reid Vapor Pressure (RVP) during the winter season, consisting in a reduction of the RVP from 60 to 50 kPa and an increase of the FCC C 4 olefins yield, has led to an augmentation of high motor octane number alkylate production. As a result the refinery economics was improved by a five figure number of US $ per year. key words: FCC gasoline motor octane number, gasoline RVP, FCC operation profitability

  15. Self-organized nanostructures in silicon and glass for MEMS, MOEMS and BioMEMS

    International Nuclear Information System (INIS)

    Lilienthal, K.; Fischer, M.; Stubenrauch, M.; Schober, A.

    2010-01-01

    The utilization of self-organization in the process workflows for Micro-Electro-Mechanical-Systems (MEMS) and their derivatives is a smart way to get large areas of nanostructured surfaces for various applications. The generation of nano-masking spots by self-organizing residues in the plasma can lead to needle- or tube-like structures on the surface after (deep-) reactive ion etching. With lengths of 3 up to 25 μm and 150 up to 500 nm in diameter for silicon broad applications in the fields of micro fluidics with catalysts, micro-optical or mechanical mountings or carrier wafer bonding in microelectronics are possible. Now, we also developed dry etching processes for fused silica which shows analogue properties to 'Black Silicon' and investigated these glass nanostructures by a first parameter study to identify new usable structures and hybrids. This innovative starting point allows the transfer of 'Black Silicon' technologies and its applications to another important material class in micro- and nanotechnologies, fused silica.

  16. Self-organized nanostructures in silicon and glass for MEMS, MOEMS and BioMEMS

    Energy Technology Data Exchange (ETDEWEB)

    Lilienthal, K., E-mail: katharina.lilienthal@tu-ilmenau.de [Research Group ' Micro fluidics and Biosensors' , Ilmenau University of Technology, Institute of Micro- and Nanotechnologies, D-98693 Ilmenau (Germany); Fischer, M. [Research Group ' Micro fluidics and Biosensors' , Ilmenau University of Technology, Institute of Micro- and Nanotechnologies, D-98693 Ilmenau (Germany); Stubenrauch, M. [Department of Micromechanical Systems, Ilmenau University of Technology, Institute of Micro- and Nanotechnologies, D-98693 Ilmenau (Germany); Schober, A. [Research Group ' Micro fluidics and Biosensors' , Ilmenau University of Technology, Institute of Micro- and Nanotechnologies, D-98693 Ilmenau (Germany)

    2010-05-25

    The utilization of self-organization in the process workflows for Micro-Electro-Mechanical-Systems (MEMS) and their derivatives is a smart way to get large areas of nanostructured surfaces for various applications. The generation of nano-masking spots by self-organizing residues in the plasma can lead to needle- or tube-like structures on the surface after (deep-) reactive ion etching. With lengths of 3 up to 25 {mu}m and 150 up to 500 nm in diameter for silicon broad applications in the fields of micro fluidics with catalysts, micro-optical or mechanical mountings or carrier wafer bonding in microelectronics are possible. Now, we also developed dry etching processes for fused silica which shows analogue properties to 'Black Silicon' and investigated these glass nanostructures by a first parameter study to identify new usable structures and hybrids. This innovative starting point allows the transfer of 'Black Silicon' technologies and its applications to another important material class in micro- and nanotechnologies, fused silica.

  17. On the transition of short cracks into long fatigue cracks in reactor pressure vessel steels

    Directory of Open Access Journals (Sweden)

    Singh Rajwinder

    2018-01-01

    Full Text Available Short fatigue cracks, having dimension less than 1 mm, propagate at much faster rates (da/dN even at lower stress intensity factor range (da/dN as compared to the threshold stress intensity factor range obtained from long fatigue crack growth studies. These short cracks originate at the sub-grain level and some of them ultimately transit into critical long cracks over time. Therefore, designing the components subjected to fatigue loading merely on the long crack growth data and neglecting the short crack growth behavior can overestimate the component’s life. This aspect of short fatigue cracks become even more critical for materials used for safety critical applications such as reactor pressure vessel (RPV steel in nuclear plants. In this work, the transition behaviour of short fatigue crack gowth into long fatigue crack is studied in SA508 Grade 3 Class I low alloy steel used in RPVs. In-situ characterization of initiation, propagation and transition of short fatigue cracks is performed using fatigue stage for Scanning Electron Microscope (SEM in addition to digital microscopes fitted over a servo-hydraulic fatigue machine and correlated with the microtructural information obtained using electron backscatter diffraction (EBSD. SA508 steel having an upper bainitic microstructure have several microstructural interfaces such as phase and grain boundaries that play a significant role in controlling the short fatigue crack propagation. Specially designed and prepared short fatigue specimens (eletro-polished with varying initial crack lengths of the order of tens of microns are used in this study. The transition of such short initial cracks into long cracks is then tracked to give detailed insight into the role of each phase and phase/grain boundary with an objective of establishing Kitagawa-Takahashi diagram for the given RPV steel. The behavior of the transited long cracks is then compared with the crack propagation behavior obtained using

  18. Mems based valveless micropump for biomedical applications

    CSIR Research Space (South Africa)

    Van der Merwe, SW

    2010-01-01

    Full Text Available as the piezoelectric disc oscillation frequency, are selected for numerical investigation. The influences of the determined parameters on the flow rate of the micropump are then studied using three dimensional transient CFD analyses. The data from the CFD analyses...

  19. Principles and Application of Magnetic Rubber Testing for Crack Detection in High-Strength Steel Components: I. Active-Field Inspection

    Science.gov (United States)

    2014-12-01

    containing a dispersion of ferromagnetic particles to the surface of a magnetised steel component. Following curing of the rubber, any surface-breaking...concentration of black particles along the crack is clearly visible against the lighter pigments of the silicone rubber base. magnetic leakage flux due...other side of the black crack indication appear white because they contain a very low density of magnetic particles so that the underlying white pigment

  20. FEM Modeling of Crack Propagation in a Model Multiphase Alloy

    Institute of Scientific and Technical Information of China (English)

    Lihe QIAN; Seishi NISHIDO; Hiroyuki TODA; Tosliro KOBAYASHI

    2006-01-01

    In this paper, several widely applied fracture criteria were first numerically examined and the crack-tip-region Jintegral criterion was confirmed to be more applicable to predict fracture angle in an elastic-plastic multiphase material. Then, the crack propagation in an idealized dendritic two-phase Al-7%Si alloy was modeled using an elastic-plastic finite element method. The variation of crack growth driving force with crack extension was also demonstrated. It is found that the crack path is significantly influenced by the presence of α-phase near the crack tip, and the crack growth driving force varies drastically from place to place. Lastly, the simulated fracture path in the two-phase model alloy was compared with the experimentally observed fracture path.

  1. Application of a Cohesive Zone Model for Simulating Fatigue Crack Growth from Moderate to High ΔK Levels of Inconel 718

    Directory of Open Access Journals (Sweden)

    Huan Li

    2018-01-01

    Full Text Available A cyclic cohesive zone model is applied to characterize the fatigue crack growth behavior of a IN718 superalloy which is frequently used in aerospace components. In order to improve the limitation of fracture mechanics-based models, besides the predictions of the moderate fatigue crack growth rates at the Paris’ regime and the high fatigue crack growth rates at the high stress intensity factor ΔK levels, the present work is also aimed at simulating the material damage uniformly and examining the influence of the cohesive model parameters on fatigue crack growth systematically. The gradual loss of the stress-bearing ability of the material is considered through the degradation of a novel cohesive envelope. The experimental data of cracked specimens are used to validate the simulation result. Based on the reasonable estimation for the model parameters, the fatigue crack growth from moderate to high ΔK levels can be reproduced under the small-scale yielding condition, which is in fair agreement with the experimental results.

  2. Crack layer theory

    Science.gov (United States)

    Chudnovsky, A.

    1987-01-01

    A damage parameter is introduced in addition to conventional parameters of continuum mechanics and consider a crack surrounded by an array of microdefects within the continuum mechanics framework. A system consisting of the main crack and surrounding damage is called crack layer (CL). Crack layer propagation is an irreversible process. The general framework of the thermodynamics of irreversible processes are employed to identify the driving forces (causes) and to derive the constitutive equation of CL propagation, that is, the relationship between the rates of the crack growth and damage dissemination from one side and the conjugated thermodynamic forces from another. The proposed law of CL propagation is in good agreement with the experimental data on fatigue CL propagation in various materials. The theory also elaborates material toughness characterization.

  3. Atomistics of crack propagation

    International Nuclear Information System (INIS)

    Sieradzki, K.; Dienes, G.J.; Paskin, A.; Massoumzadeh, B.

    1988-01-01

    The molecular dynamic technique is used to investigate static and dynamic aspects of crack extension. The material chosen for this study was the 2D triangular solid with atoms interacting via the Johnson potential. The 2D Johnson solid was chosen for this study since a sharp crack in this material remains stable against dislocation emission up to the critical Griffith load. This behavior allows for a meaningful comparison between the simulation results and continuum energy theorems for crack extension by appropriately defining an effective modulus which accounts for sample size effects and the non-linear elastic behavior of the Johnson solid. Simulation results are presented for the stress fields of moving cracks and these dynamic results are discussed in terms of the dynamic crack propagation theories, of Mott, Eshelby, and Freund

  4. Crack-tip chemistry modeling of stage I stress corrosion cracking

    International Nuclear Information System (INIS)

    Jones, R.H.; Simonen, E.P.

    1991-10-01

    Stage I stress corrosion cracking usually exhibits a very strong K dependence with Paris law exponents of up to 30. 2 Model calculations indicate that the crack velocity in this regime is controlled by transport through a salt film and that the K dependence results from crack opening controlled salt film dissolution. An ionic transport model that accounts for both electromigration through the resistive salt film and Fickian diffusion through the aqueous solution was used for these predictions. Predicted crack growth rates are in excellent agreement with measured values for Ni with P segregated to the grain boundaries and tested in IN H 2 SO 4 at +900 mV. This salt film dissolution may be applicable to stage I cracking of other materials

  5. Development of thin film encapsulation process for piezoresistive MEMS gyroscope with wide gaps

    Science.gov (United States)

    Ayanoor-Vitikkate, Vipin

    The gyroscope is an inertial sensor used to measure the angular rate of a rotating object. This helps to determine the pitch and yaw rate of any moving body. A number of applications have been developed for consumer and automotive markets, for e.g. vehicle stability control, navigation assist, roll over detection. These are primarily used in high-end cars, where cost is not a major factor. Other areas where a MEMS Gyro can be used are robotics, camcorder stabilization, virtual reality, and more. Primarily due to cost and the size most of these applications have not reached any significant volume. One reason for this is the relatively high cost of MEMS gyros compared to other MEMS sensors like accelerometers or pressure sensors. Generally the cost of packaging a MEMS sensor is about 85-90% of the total cost. Currently most MEMS based gyroscopes are made using bulk or surface micromachining, after which they are packaged using wafer bonding. This unfortunately leads to wastage of silicon and increase in the package size, thus reducing the yield. One way to reduce the cost of packaging is by wafer scale thin film encapsulation of MEMS gyroscopes. The goal of the present work is to fabricate a rate grade MEMS gyroscope and encapsulate it by modifying an existing thin-film encapsulation technique. Packaging is an important step towards commercialization of the device and we plan to use thin wafer scale encapsulation technique developed previously in our group to package these devices. The silicon micro machined gyroscope will be fabricated on SOI (Silicon-on-Insulator) wafers using Bosch DRIE etching techniques. The encapsulation of the device is carried out using epitaxial polysilicon in order to provide a high vacuum inside the device chamber. The advantages offered by this technique are the reduction in area of the die and thus less silicon surface is wasted. In addition to this the encapsulation technique helps in creating a vacuum inside the micro device, which

  6. Miniaturization of components and systems for space using MEMS-technology

    Science.gov (United States)

    Grönland, Tor-Arne; Rangsten, Pelle; Nese, Martin; Lang, Martin

    2007-06-01

    Development of MEMS-based (micro electro mechanical system) components and subsystems for space applications has been pursued by various research groups and organizations around the world for at least two decades. The main driver for developing MEMS-based components for space is the miniaturization that can be achieved. Miniaturization can not only save orders of magnitude in mass and volume of individual components, but it can also allow increased redundancy, and enable novel spacecraft designs and mission scenarios. However, the commercial breakthrough of MEMS has not occurred within the space business as it has within other branches such as the IT/telecom or automotive industries, or as it has in biotech or life science applications. A main explanation to this is the highly conservative attitude to new technology within the space community. This conservatism is in many senses motivated by a very low risk acceptance in the few and costly space projects that actually ends with a space flight. To overcome this threshold there is a strong need for flight opportunities where reasonable risks can be accepted. Currently there are a few flight opportunities allowing extensive use of new technology in space, but one of the exceptions is the PRISMA program. PRISMA is an international (Sweden, Germany, France, Denmark, Norway, Greece) technology demonstration program with focus on rendezvous and formation flying. It is a two satellite LEO mission with a launch scheduled for the first half of 2009. On PRISMA, a number of novel technologies e.g. RF metrology sensor for Darwin, autonomous formation flying based on GPS and vision-based sensors, ADN-based "green propulsion" will be demonstrated in space for the first time. One of the satellites will also have a miniaturized propulsion system onboard based on MEMS-technology. This novel propulsion system includes two microthruster modules, each including four thrusters with micro- to milli-Newton thrust capability. The novelty

  7. Enabling technology for MEMS and nanodevices

    CERN Document Server

    Baltes, Henry; Fedder, Gary K; Hierold, Christofer; Korvink, Jan G; Tabata, Osamu

    2013-01-01

    This softcover edition of the eponymous volume from the successful ""Advanced Micro & Nanosystems"" series covers all aspects of fabrication of MEMS under CMOS-compatible conditions from design to implementation.It examines the various routes and methods to combine electronics generated by the CMOS technology with novel micromechanical parts into one-chip solutions. Various approaches, fundamental and technological aspects as well as strategies leading to different types of functionalities and presented in detail.For the practicing engineer as well as MSc and PhD students on MEMS cours

  8. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  9. Antenna Miniaturization with MEMS Tunable Capacitors

    DEFF Research Database (Denmark)

    Barrio, Samantha Caporal Del; Morris, Art; Pedersen, Gert Frølund

    2014-01-01

    In today’s mobile device market, there is a strong need for efficient antenna miniaturization. Tunable antennas are a very promising way to reduce antenna volume while enlarging its operating bandwidth. MEMS tunable capacitors are state-ofthe- art in terms of insertion loss and their characterist......In today’s mobile device market, there is a strong need for efficient antenna miniaturization. Tunable antennas are a very promising way to reduce antenna volume while enlarging its operating bandwidth. MEMS tunable capacitors are state-ofthe- art in terms of insertion loss...

  10. Projection displays and MEMS: timely convergence for a bright future

    Science.gov (United States)

    Hornbeck, Larry J.

    1995-09-01

    Projection displays and microelectromechanical systems (MEMS) have evolved independently, occasionally crossing paths as early as the 1950s. But the commercially viable use of MEMS for projection displays has been illusive until the recent invention of Texas Instruments Digital Light Processing TM (DLP) technology. DLP technology is based on the Digital Micromirror DeviceTM (DMD) microchip, a MEMS technology that is a semiconductor digital light switch that precisely controls a light source for projection display and hardcopy applications. DLP technology provides a unique business opportunity because of the timely convergence of market needs and technology advances. The world is rapidly moving to an all- digital communications and entertainment infrastructure. In the near future, most of the technologies necessary for this infrastrucutre will be available at the right performance and price levels. This will make commercially viable an all-digital chain (capture, compression, transmission, reception decompression, hearing, and viewing). Unfortunately, the digital images received today must be translated into analog signals for viewing on today's televisions. Digital video is the final link in the all-digital infrastructure and DLP technoogy provides that link. DLP technology is an enabler for digital, high-resolution, color projection displays that have high contrast, are bright, seamless, and have the accuracy of color and grayscale that can be achieved only by digital control. This paper contains an introduction to DMD and DLP technology, including the historical context from which to view their developemnt. The architecture, projection operation, and fabrication are presented. Finally, the paper includes an update about current DMD business opportunities in projection displays and hardcopy.

  11. A miniaturized reconfigurable broadband attenuator based on RF MEMS switches

    International Nuclear Information System (INIS)

    Guo, Xin; Gong, Zhuhao; Zhong, Qi; Liang, Xiaotong; Liu, Zewen

    2016-01-01

    Reconfigurable attenuators are widely used in microwave measurement instruments. Development of miniaturized attenuation devices with high precision and broadband performance is required for state-of-the-art applications. In this paper, a compact 3-bit microwave attenuator based on radio frequency micro-electro-mechanical system (RF MEMS) switches and polysilicon attenuation modules is presented. The device comprises 12 ohmic contact MEMS switches, π -type polysilicon resistive attenuation modules and microwave compensate structures. Special attention was paid to the design of the resistive network, compensate structures and system simulation. The device was fabricated using micromachining processes compatible with traditional integrated circuit fabrication processes. The reconfigurable attenuator integrated with RF MEMS switches and resistive attenuation modules was successfully fabricated with dimensions of 2.45  ×  4.34  ×  0.5 mm 3 , which is 1/1000th of the size of a conventional step attenuator. The measured RF performance revealed that the attenuator provides 10–70 dB attenuation at 10 dB intervals from 0.1–20 GHz with an accuracy better than  ±1.88 dB at 60 dB and an error of less than 2.22 dB at 10 dB. The return loss of each state of the 3-bit attenuator was better than 11.95 dB (VSWR  <  1.71) over the entire operating band. (paper)

  12. Fabrication of 3D Carbon Microelectromechanical Systems (C-MEMS).

    Science.gov (United States)

    Pramanick, Bidhan; Martinez-Chapa, Sergio O; Madou, Marc; Hwang, Hyundoo

    2017-06-17

    A wide range of carbon sources are available in nature, with a variety of micro-/nanostructure configurations. Here, a novel technique to fabricate long and hollow glassy carbon microfibers derived from human hairs is introduced. The long and hollow carbon structures were made by the pyrolysis of human hair at 900 °C in a N2 atmosphere. The morphology and chemical composition of natural and pyrolyzed human hairs were investigated using scanning electron microscopy (SEM) and electron-dispersive X-ray spectroscopy (EDX), respectively, to estimate the physical and chemical changes due to pyrolysis. Raman spectroscopy was used to confirm the glassy nature of the carbon microstructures. Pyrolyzed hair carbon was introduced to modify screen-printed carbon electrodes ; the modified electrodes were then applied to the electrochemical sensing of dopamine and ascorbic acid. Sensing performance of the modified sensors was improved as compared to the unmodified sensors. To obtain the desired carbon structure design, carbon micro-/nanoelectromechanical system (C-MEMS/C-NEMS) technology was developed. The most common C-MEMS/C-NEMS fabrication process consists of two steps: (i) the patterning of a carbon-rich base material, such as a photosensitive polymer, using photolithography; and (ii) carbonization through the pyrolysis of the patterned polymer in an oxygen-free environment. The C-MEMS/NEMS process has been widely used to develop microelectronic devices for various applications, including in micro-batteries, supercapacitors, glucose sensors, gas sensors, fuel cells, and triboelectric nanogenerators. Here, recent developments of a high-aspect ratio solid and hollow carbon microstructures with SU8 photoresists are discussed. The structural shrinkage during pyrolysis was investigated using confocal microscopy and SEM. Raman spectroscopy was used to confirm the crystallinity of the structure, and the atomic percentage of the elements present in the material before and after

  13. Development of A MEMS Based Manometric Catheter for Diagnosis of Functional Swallowing Disorders

    International Nuclear Information System (INIS)

    Hsu, H Y; Hariz, A J; Omari, T; Teng, M F; Sii, D; Chan, S; Lau, L; Tan, S; Lin, G; Haskard, M; Mulcahy, D; Bakewell, M

    2006-01-01

    Silicon pressure sensors based on micro-electro-mechanical-systems (MEMS) technologies are gaining popularity for applications in bio-medical devices. In this study, a silicon piezo-resistive pressure sensor die is used in a feasibility study of developing a manometric catheter for functional swallowing disorders diagnosis. The function of a manometric catheter is to measure the peak and intrabolus pressures along the esophageal segment during the swallowing action. Previous manometric catheters used the water perfusion technique to measure the pressure changes. This type of catheter is reusable, large in size and the pressure reading is recorded by an external transducer. Current manometric catheters use a solid state pressure sensor on the catheter itself to measure the pressure changes. This type of catheter reduces the discomfort to the patient but it is reusable and is very expensive. We carried out several studies and experiments on the MEMS-based pressure sensor die, and the results show the MEMS-based pressure sensors have a good stability and a good linearity output response, together with the advantage of low excitation biasing voltage and extremely small size. The MEMS-based sensor is the best device to use in the new generation of manometric catheters. The concept of the new MEMS-based manometric catheter consists of a pressure sensing sensor, supporting ring, the catheter tube and a data connector. Laboratory testing shows that the new calibrated catheter is capable of measuring pressure in the range from 0 to 100mmHg and maintaining stable condition on the zero baseline setting when no pressure is applied. In-vivo tests are carried out to compare the new MEMS based catheter with the current version of catheters used in the hospital

  14. On the feasibility to integrate low-cost MEMS accelerometers and GNSS receivers

    Science.gov (United States)

    Benedetti, Elisa; Dermanis, Athanasios; Crespi, Mattia

    2017-06-01

    The aim of this research was to investigate the feasibility of merging the benefits offered by low-cost GNSS and MEMS accelerometers technology, in order to promote the diffusion of low-cost monitoring solutions. A merging approach was set up at the level of the combination of kinematic results (velocities and displacements) coming from the two kinds of sensors, whose observations were separately processed, following to the so called loose integration, which sounds much more simple and flexible thinking about the possibility of an easy change of the combined sensors. At first, the issues related to the difference in reference systems, time systems and measurement rate and epochs for the two sensors were faced with. An approach was designed and tested to transform into unique reference and time systems the outcomes from GPS and MEMS and to interpolate the usually (much) more dense MEMS observation to common (GPS) epochs. The proposed approach was limited to time-independent (constant) orientation of the MEMS reference system with respect to the GPS one. Then, a data fusion approach based on the use of Discrete Fourier Transform and cubic splines interpolation was proposed both for velocities and displacements: MEMS and GPS derived solutions are firstly separated by a rectangular filter in spectral domain, and secondly back-transformed and combined through a cubic spline interpolation. Accuracies around 5 mm for slow and fast displacements and better than 2 mm/s for velocities were assessed. The obtained solution paves the way to a powerful and appealing use of low-cost single frequency GNSS receivers and MEMS accelerometers for structural and ground monitoring applications. Some additional remarks and prospects for future investigations complete the paper.

  15. MEMS packaging: state of the art and future trends

    Science.gov (United States)

    Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

    1998-07-01

    Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

  16. High temperature cracking of steels: effect of geometry on creep crack growth laws

    International Nuclear Information System (INIS)

    Kabiri, M.R.

    2003-12-01

    This study was performed at Centre des Materiaux de l'Ecole des Mines de Paris. It deals with identification and transferability of high temperature creep cracking laws of steels. A global approach, based on C * and J non-linear fracture mechanics parameters has been used to characterize creep crack initiation and propagation. The studied materials are: the ferritic steels 1Cr-1Mo-1/4V (hot and cold parts working at 540 and 250 C) used in the thermal power stations and the austenitic stainless steel 316 L(N) used in the nuclear power stations. During this thesis a data base was setting up, it regroups several tests of fatigue, creep, creep-fatigue, and relaxation. Its particularity is to contain several creep tests (27 tests), achieved at various temperatures (550 to 650 C) and using three different geometries. The relevance of the C * parameter to describe the creep crack propagation was analysed by a means of systematic study of elasto-viscoplastic stress singularities under several conditions (different stress triaxiality). It has been shown that, besides the C * parameter, a second non singular term, denoted here as Q * , is necessary to describe the local variables in the vicinity of the crack tip. Values of this constraint parameter are always negative. Consequently, application of typical creep crack growth laws linking the creep crack growth rate to the C * parameter (da/dt - C * ), will be conservative for industrial applications. Furthermore, we showed that for ferritic steels, crack incubation period is important, therefore a correlation of Ti - C * type has been kept to predict crack initiation time Ti. For the austenitic stainless steel, the relevant stage is the one of the crack propagation, so that a master curve (da/dt - C * ), using a new data analysis method, was established. Finally, the propagation of cracks has been simulated numerically using the node release technique, allowing to validate analytical expressions utilised for the experimental

  17. Recent evaluations of crack-opening-area in circumferentially cracked pipes

    Energy Technology Data Exchange (ETDEWEB)

    Rahman, S.; Brust, F.; Ghadiali, N.; Wilkowski, G.; Miura, N.

    1997-04-01

    Leak-before-break (LBB) analyses for circumferentially cracked pipes are currently being conducted in the nuclear industry to justify elimination of pipe whip restraints and jet shields which are present because of the expected dynamic effects from pipe rupture. The application of the LBB methodology frequently requires calculation of leak rates. The leak rates depend on the crack-opening area of the through-wall crack in the pipe. In addition to LBB analyses which assume a hypothetical flaw size, there is also interest in the integrity of actual leaking cracks corresponding to current leakage detection requirements in NRC Regulatory Guide 1.45, or for assessing temporary repair of Class 2 and 3 pipes that have leaks as are being evaluated in ASME Section XI. The objectives of this study were to review, evaluate, and refine current predictive models for performing crack-opening-area analyses of circumferentially cracked pipes. The results from twenty-five full-scale pipe fracture experiments, conducted in the Degraded Piping Program, the International Piping Integrity Research Group Program, and the Short Cracks in Piping and Piping Welds Program, were used to verify the analytical models. Standard statistical analyses were performed to assess used to verify the analytical models. Standard statistical analyses were performed to assess quantitatively the accuracy of the predictive models. The evaluation also involved finite element analyses for determining the crack-opening profile often needed to perform leak-rate calculations.

  18. Microwave based method of monitoring crack formation

    International Nuclear Information System (INIS)

    Aman, Sergej; Aman, Alexander; Majcherek, Soeren; Hirsch, Soeren; Schmidt, Bertram

    2014-01-01

    The formation of cracks in glass particles was monitored by application of linearly polarized microwaves. The breakage behavior of glass spheres coated with a thin gold layer of about 50 nm, i.e. a thickness that is lower than the microwave penetration depth, was tested. In this way the investigation of fracture behavior of electronic circuits was simulated. A shielding current was induced in the gold layer by the application of microwaves. During the crack formation the distribution of this current changed abruptly and a scattered microwave signal appeared at the frequency of the incident microwaves. The time behavior of the scattered signal reflects the microscopic processes occurring during the fracture of the specimen. The duration of the increasing signal corresponds to the crack formation time in the tested specimen. This time was estimated as particle size divided by crack development speed in glass. An intense emission of electrons occurs during the formation of cracks. Due to this, coherent Thomson scattering of microwaves by emitted electrons becomes significant with a delay of a few microseconds after the initial phase of crack formation. In this time the intensity of the microwave signal increases. (paper)

  19. Optical MEMS: boom, bust and beyond

    Science.gov (United States)

    Ramani, Chandra Mouli

    2005-10-01

    Optical Telecommunications bandwidth, spurred by the growth of the internet, experienced unprecedented growth in the late 1990's. The creation of new enterprises was vast and the expansion of established component, system and services companies was also breathtaking. This period of speculative growth was followed in 2001-2004 by one of the most significant market crashes in history. While $20B of venture capital was invested in optical telecom in the last 10 years, the vast majority of that has been written off in the last four. Countless start-ups inaugurated with great fanfare at the end of the 20th century were unceremoniously shut down at the start of the 21st. (1) As in all speculative bubbles, innovative technologies were born and buried. Nonetheless, new capabilities emerge from the chaos and disruption; one such example is the advent of Optical MEMS (MOEMS). Its development was vigorously pursued in both academic and corporate laboratories during the boom and, in the author's view; MOEMS constitutes a powerful and versatile tool set that is an invaluable residual of the last few years. In Telecommunications, MOEMS has proven to be the technology of choice for many optical switching and wavelength management applications. (2) Variable Optical Attenuators (VOA), Wavelength Blockers (WB), Dynamic Gain Equalizers (DGE), and most recently Wavelength Selective Switches (WSS) are being used in the numerous recent network deployments. Moreover, agile networks of the future will have MOEMS at every node. This presentation will provide an overview of the history of MOEMS in Telecommunications, discuss its byproducts and project the future of the technology.

  20. Optical MEMS: past, present and future

    Science.gov (United States)

    Ramani, Chandra Mouli

    2005-09-01

    Spurred by the growth of the internet, Optical Telecommunications bandwidth, experienced unprecedented growth during late 1990's. During this time of great economic expansion, the creation of new enterprises was vast and the expansion of established component, system and services companies was breathtaking. Unfortunately, this positive economic state was short-lived. This period was followed in 2001-2004 by one of the most significant market crashes in history. During those 10 years of economic growth, about $20B in venture capital was invested in the optical telecom industry, most of this investment was lost in recent years. Many start-up industries which experienced unprecedented growth at the end of the 20th century were lost at the start of the 21st. (1) During this time many, innovative technologies were born and buried. However, many new capabilities emerged from this period of unrest; one such example is the advent of Optical MEMS (MOEMS). Many academics and corporate laboratories pursued the development of MOEMS during the economic boom and, in the author's view; MOEMS surfaced as a powerful and versatile tool set that has proved invaluable and in the last few years during economic downturn, stood the test of time. In the Telecommunications industry, for optical switching and wavelength management applications MOEMS has proven to be the technology of choice. (2) Variable Optical Attenuators (VOA), Wavelength Blockers (WB), Dynamic Gain Equalizers (DGE), and most recently Wavelength Selective Switches (WSS) are being used in the numerous recent network deployments. Moreover, agile networks of the future will have MOEMS at every node. This presentation will provide an overview of the history of MOEMS in Telecommunications, discuss its byproducts and offer a window into the future of the technology.