Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

International Nuclear Information System (INIS)

Talla, Patrick Takoukam

2011-01-01

The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 μm. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

Spectral and spatial resolution properties of photon counting X-ray detectors like the Medipix-Detector; Spektrale und bildgebende Eigenschaften photonenzaehlender Roentgendetektoren am Beispiel des Medipix-Detektors

Energy Technology Data Exchange (ETDEWEB)

Korn, A.

2007-05-14

The Medipix detector is a hybrid photon counting X-ray detector, consisting of an ASIC and a semiconducting layer as the sensor. This makes the Medipix a direct converting detector. A special feature of the Medipix is a signal processing circuit in every single pixel. This circuit amplifies the input signal triggered by a photon and then transforms the pulse into a digital signal. This early stage digitalisation is one of the main advantages of the detector, since no dark currents are integrated into the signal. Furthermore, the energy information of each single photon is partly preserved. The high number of pixels lends the detector a wide dynamic range, starting from single counts up to a rate of 1010 photons per cm2 and second. Apart from the many advantages, there are still some problems with the detector. Some effects lead to a deterioration of the energy resolution as well as the spatial resolution. The main reasons for this are two effects occuring in the detector, charge sharing and backscattering inside the detector. This study investigates the influence of those two effects on both the energy and spatial resolution. The physical causes of these effects are delineated and their impact on the detector output is examined. In contrast to high energy photon detectors, the repulsion of the charge carriers drifting inside the sensor must not be neglected in a detailed model of X-ray detectors with an energy range of 5 keV-200 keV. For the simulation of the Medipix using Monte Carlo simulations, the software ROSI was augmented. The added features allow a detailed simulation of the charge distribution, using the relevant physical effects that alter the distribution width during the drift towards the sensor electrodes as well further influences on the detector output, including electronical noise, threshold noise or the geometry of the detector. The measured energy and spatial resolution of several different models of Medipix is compared to the simulated

Spectral and spatial resolution properties of photon counting X-ray detectors like the Medipix-Detector

International Nuclear Information System (INIS)

Korn, A.

2007-01-01

The Medipix detector is a hybrid photon counting X-ray detector, consisting of an ASIC and a semiconducting layer as the sensor. This makes the Medipix a direct converting detector. A special feature of the Medipix is a signal processing circuit in every single pixel. This circuit amplifies the input signal triggered by a photon and then transforms the pulse into a digital signal. This early stage digitalisation is one of the main advantages of the detector, since no dark currents are integrated into the signal. Furthermore, the energy information of each single photon is partly preserved. The high number of pixels lends the detector a wide dynamic range, starting from single counts up to a rate of 1010 photons per cm2 and second. Apart from the many advantages, there are still some problems with the detector. Some effects lead to a deterioration of the energy resolution as well as the spatial resolution. The main reasons for this are two effects occuring in the detector, charge sharing and backscattering inside the detector. This study investigates the influence of those two effects on both the energy and spatial resolution. The physical causes of these effects are delineated and their impact on the detector output is examined. In contrast to high energy photon detectors, the repulsion of the charge carriers drifting inside the sensor must not be neglected in a detailed model of X-ray detectors with an energy range of 5 keV-200 keV. For the simulation of the Medipix using Monte Carlo simulations, the software ROSI was augmented. The added features allow a detailed simulation of the charge distribution, using the relevant physical effects that alter the distribution width during the drift towards the sensor electrodes as well further influences on the detector output, including electronical noise, threshold noise or the geometry of the detector. The measured energy and spatial resolution of several different models of Medipix is compared to the simulated

Preliminary test of an imaging probe for nuclear medicine using hybrid pixel detectors

International Nuclear Information System (INIS)

Bertolucci, E.; Maiorino, M.; Mettivier, G.; Montesi, M.C.; Russo, P.

2002-01-01

We are investigating the feasibility of an intraoperative imaging probe for lymphoscintigraphy with Tc-99m tracer, for sentinel node radioguided surgery, using the Medipix series of hybrid detectors coupled to a collimator. These detectors are pixelated semiconductor detectors bump-bonded to the Medipix1 photon counting read-out chip (64x64 pixel, 170 μm pitch) or to the Medipix2 chip (256x256 pixel, 55 μm pitch), developed by the European Medipix collaboration. The pixel detector we plan to use in the final version of the probe is a semi-insulating GaAs detector or a 1-2 mm thick CdZnTe detector. For the preliminary tests presented here, we used 300-μm thick silicon detectors, hybridized via bump-bonding to the Medipix1 chip. We used a tungsten parallel-hole collimator (7 mm thick, matrix array of 64x64 100 μm circular holes with 170 μm pitch), and a 22, 60 and 122 keV point-like (1 mm diameter) radioactive sources, placed at various distances from the detector. These tests were conducted in order to investigate the general feasibility of this imaging probe and its resolving power. Measurements show the high resolution but low efficiency performance of the detector-collimator set, which is able to image the 122 keV source with <1 mm FWHM resolution

Real-time in-vivo μ-imaging with Medipix2

International Nuclear Information System (INIS)

Dammer, J.; Frallicciardi, P.M.; Jakubek, J.; Jakubek, M.; Pospisil, S.; Prenerova, E.; Vavrik, D.; Volter, L.; Weyda, F.; Zemek, R.

2009-01-01

An X-ray micro-radiographic system based on the Medipix2 semiconductor pixel detector for dynamic high spatial resolution and for high contrast imaging has been developed. Our system is based on a micro-focus and nano-focus X-ray tube and the hybrid single-photon counting silicon pixel detector Medipix2 (matrix 256x256 sq. pixels of 55 μm pitch). This compact table-top system stands promising as a new tool in the field of small animal imaging as well as in the in-vivo observation of dynamic processes inside living organisms. The main advantages of these Medipix2 pixel detectors include: high sensitivity to low-energy X-ray photons; position sensitive and noiseless single-photon detection with preselected photon energies; single-quantum counting in each pixel performed by digital counter (therefore there is no dark current); digital integration (providing unlimited dynamic range and absolute linearity in device response to number of photons, high sensitivity and high contrast); real-time digital information, high-speed digital communication and data transfer. We improve the picture quality with the help of statistical data analysis and extended the calibration of individual pixels response. 2D and 3D radiographic images of samples demonstrate the potential and applicability of our system for precise in-vivo X-ray high-resolution dynamic diagnostic and biological studies. Obtained results are shown on small animal and organic samples.

First tests of a Medipix-1 pixel detector for X-ray dynamic defectoscopy

CERN Document Server

Vavrik, D; Visschers, J; Pospísil, S; Ponchut, C; Zemankova, J

2002-01-01

Recent theoretical damage material models describe the dynamic development of voids and microcracks in materials under plastic deformation. For these models, experimental verification is needed. We propose direct and non-destructive observation of the propagation of material damage by measuring changes in transmission of X-rays penetrating a stressed material, using a photon-counting X-ray imager. The present contribution aims to demonstrate the applicability of silicon and gallium-arsenide devices for X-ray transmission measurements with a specimen of high-ductile aluminium alloy under study. The first experiments to determine the resolution and the sensitivity of the proposed method with the Medipix-1 pixel detector are presented.

Characterization of Medipix3 With Synchrotron Radiation

CERN Document Server

Gimenez, E N; Marchal, J; Turecek, D; Ballabriga, R; Tartoni, N; Campbell, M; Llopart, X; Sawhney, K J S

2011-01-01

Medipix3 is the latest generation of photon counting readout chips of the Medipix family. With the same dimensions as Medipix2 (256 x 256 pixels of 55 mu m x 55 mu m pitch each), Medipix3 is however implemented in an 8-layer metallization 0.13 mu m CMOS technology which leads to an increase in the functionality associated with each pixel over Medipix2. One of the new operational modes implemented in the front-end architecture is the Charge Summing Mode (CSM). This mode consists of a charge reconstruction and hit allocation algorithm which eliminates event-by-event the low energy counts produced by charge-shared events between adjacent pixels. The present work focuses on the study of the CSM mode and compares it to the Single Pixel Mode (SPM) which is the conventional readout method for these kind of detectors and it is also implemented in Medipix3. Tests of a Medipix3 chip bump-bonded to a 300 mu m thick silicon photodiode sensor were performed at the Diamond Light Source synchrotron to evaluate the performan...

Medipix2 as a tool for proton beam characterization

Science.gov (United States)

Bisogni, M. G.; Cirrone, G. A. P.; Cuttone, G.; Del Guerra, A.; Lojacono, P.; Piliero, M. A.; Romano, F.; Rosso, V.; Sipala, V.; Stefanini, A.

2009-08-01

Proton therapy is a technique used to deliver a highly accurate and effective dose for the treatment of a variety of tumor diseases. The possibility to have an instrument able to give online information could reduce the time necessary to characterize the proton beam. To this aim we propose a detection system for online proton beam characterization based on the Medipix2 chip. Medipix2 is a detection system based on a single event counter read-out chip, bump-bonded to silicon pixel detector. The read-out chip is a matrix of 256×256 cells, 55×55 μm 2 each. To demonstrate the capabilities of Medipix2 as a proton detector, we have used a 62 MeV flux proton beam at the CATANA beam line of the LNS-INFN laboratory. The measurements performed confirmed the good imaging performances of the Medipix2 system also for the characterization of proton beams.

Medipix2 as a tool for proton beam characterization

Energy Technology Data Exchange (ETDEWEB)

Bisogni, M.G. [Department of Physics, University of Pisa and INFN Sezione di Pisa, Pisa (Italy); Cirrone, G.A.P.; Cuttone, G. [INFN Laboratori Nazionali del Sud, Catania (Italy); Del Guerra, A. [Department of Physics, University of Pisa and INFN Sezione di Pisa, Pisa (Italy); Lojacono, P. [INFN Laboratori Nazionali del Sud, Catania (Italy); Piliero, M.A. [Department of Physics, University of Pisa and INFN Sezione di Pisa, Pisa (Italy); Romano, F. [INFN Laboratori Nazionali del Sud, Catania (Italy); Rosso, V. [Department of Physics, University of Pisa and INFN Sezione di Pisa, Pisa (Italy)], E-mail: valeria.rosso@pi.infn.it; Sipala, V. [Department of Physics and Astronomy, University of Catania and INFN Sezione di Catania, Catania (Italy); Stefanini, A. [Department of Physics, University of Pisa and INFN Sezione di Pisa, Pisa (Italy)

2009-08-01

Proton therapy is a technique used to deliver a highly accurate and effective dose for the treatment of a variety of tumor diseases. The possibility to have an instrument able to give online information could reduce the time necessary to characterize the proton beam. To this aim we propose a detection system for online proton beam characterization based on the Medipix2 chip. Medipix2 is a detection system based on a single event counter read-out chip, bump-bonded to silicon pixel detector. The read-out chip is a matrix of 256x256 cells, 55x55 {mu}m{sup 2} each. To demonstrate the capabilities of Medipix2 as a proton detector, we have used a 62 MeV flux proton beam at the CATANA beam line of the LNS-INFN laboratory. The measurements performed confirmed the good imaging performances of the Medipix2 system also for the characterization of proton beams.

Medipix2 as a tool for proton beam characterization

International Nuclear Information System (INIS)

Bisogni, M.G.; Cirrone, G.A.P.; Cuttone, G.; Del Guerra, A.; Lojacono, P.; Piliero, M.A.; Romano, F.; Rosso, V.; Sipala, V.; Stefanini, A.

2009-01-01

Proton therapy is a technique used to deliver a highly accurate and effective dose for the treatment of a variety of tumor diseases. The possibility to have an instrument able to give online information could reduce the time necessary to characterize the proton beam. To this aim we propose a detection system for online proton beam characterization based on the Medipix2 chip. Medipix2 is a detection system based on a single event counter read-out chip, bump-bonded to silicon pixel detector. The read-out chip is a matrix of 256x256 cells, 55x55 μm 2 each. To demonstrate the capabilities of Medipix2 as a proton detector, we have used a 62 MeV flux proton beam at the CATANA beam line of the LNS-INFN laboratory. The measurements performed confirmed the good imaging performances of the Medipix2 system also for the characterization of proton beams.

Study of charge-sharing in MEDIPIX3 using a micro-focused synchrotron beam

International Nuclear Information System (INIS)

Gimenez, E N; Horswell, I; Marchal, J; Sawhney, K J S; Tartoni, N; Ballabriga, R; Campbell, M; Llopart, X; Turecek, D

2011-01-01

X-ray photon-counting detectors consisting of a silicon pixel array sensor bump-bonded to a CMOS electronic readout chip offer several advantages over traditional X-ray detection technologies used for synchrotron applications. They offer high frame rate, dynamic range, count rate capability and signal-to-noise ratio. A survey of the requirements for future synchrotron detectors carried out at the Diamond Light Source synchrotron highlighted the needs for detectors with a pixel size of the order of 50μm. Reducing the pixel size leads to an increase of charge-sharing events between adjacent pixels and, therefore, to a degradation of the energy resolution and image quality of the detector. This effect was observed with MEDIPIX2, a photon-counting readout chip with a pixel size of 55μm. The latest generation of the MEDIPIX family, MEDIPIX3, is designed to overcome this charge-sharing effect in an implemented readout operating mode referred to as Charge Summing Mode. MEDIPIX3 has the same pixel size as MEDIPIX2, but it is implemented in an 8-metal 0.13μm CMOS technology which enables increased functionality per pixel. The present work focuses on the study of the charge-sharing effect when the MEDIPIX3 is operated in Charge Summing Mode compared to the conventional readout mode, referred to as Single Pixel Mode. Tests of a standard silicon photodiode array bump-bonded to MEDIPIX3 were performed in beamline B16 at the Diamond Light Source synchrotron. A monochromatic micro-focused beam of 2.9μm x 2.2μm size at 15keV was used to scan a cluster of nine pixels in order to study the charge collection and X-ray count allocation process for each readout mode, Single Pixel Mode and Charge Summing Mode. The study showed that charge-shared events were eliminated when Medipix3 was operated in Charge Summing Mode.

Medipix3 Demonstration and understanding of near ideal detector performance for 60 & 80 keV electrons

CERN Document Server

Mir, J.A.; MacInnes, R.; Gough, C.; Plackett, R.; Shipsey, I.; Sawada, H.; MacLaren, I.; Ballabriga, R.; Maneuski, D.; O'Shea, V.; McGrouther, D.; Kirkland, A.I.

2016-01-01

In our article we report first quantitative measurements of imaging performance for the current generation of hybrid pixel detector, Medipix3, as direct electron detector. Utilising beam energies of 60 & 80 keV, measurements of modulation transfer function (MTF) and detective quantum efficiency (DQE) have revealed that, in single pixel mode (SPM), energy threshold values can be chosen to maximize either the MTF or DQE, obtaining values near to, or even exceeding, those for an ideal detector. We have demonstrated that the Medipix3 charge summing mode (CSM) can deliver simultaneous, near ideal values of both MTF and DQE. To understand direct detection performance further we have characterized the detector response to single electron events, building an empirical model which can predict detector MTF and DQE performance based on energy threshold. Exemplifying our findings we demonstrate the Medipix3 imaging performance, recording a fully exposed electron diffraction pattern at 24-bit depth and images in SPM a...

14C autoradiography with an energy-sensitive silicon pixel detector.

Science.gov (United States)

Esposito, M; Mettivier, G; Russo, P

2011-04-07

The first performance tests are presented of a carbon-14 ((14)C) beta-particle digital autoradiography system with an energy-sensitive hybrid silicon pixel detector based on the Timepix readout circuit. Timepix was developed by the Medipix2 Collaboration and it is similar to the photon-counting Medipix2 circuit, except for an added time-based synchronization logic which allows derivation of energy information from the time-over-threshold signal. This feature permits direct energy measurements in each pixel of the detector array. Timepix is bump-bonded to a 300 µm thick silicon detector with 256 × 256 pixels of 55 µm pitch. Since an energetic beta-particle could release its kinetic energy in more than one detector pixel as it slows down in the semiconductor detector, an off-line image analysis procedure was adopted in which the single-particle cluster of hit pixels is recognized; its total energy is calculated and the position of interaction on the detector surface is attributed to the centre of the charge cluster. Measurements reported are detector sensitivity, (4.11 ± 0.03) × 10(-3) cps mm(-2) kBq(-1) g, background level, (3.59 ± 0.01) × 10(-5) cps mm(-2), and minimum detectable activity, 0.0077 Bq. The spatial resolution is 76.9 µm full-width at half-maximum. These figures are compared with several digital imaging detectors for (14)C beta-particle digital autoradiography.

Comparisons between simulation and measurements taken with the Medipix3RX detector

Science.gov (United States)

McGrath, J.; Marchal, J.; Plackett, R.; Horswell, I.; Omar, D.; Gimenez, E. N.; Tartoni, N.

2014-05-01

A simulation toolkit developed for use at Diamond Light Source is presented, accompanied with experimental validation using a silicon pixel-array sensor coupled to a Medipix3RX chip controlled via the Merlin Readout System. The simulation makes use of Geant4, where photons are tracked in order to determine their position of interaction and energy deposition. Further to this, a Finite Element Methods package, Comsol, is used to model the Charge Induction Efficiencies of various sensors. Results are coupled to Geant4 simulations to provide an accurate method for computing the signals generated on each pixel within the sensor and then an algorithm to model the front-end electronics of the device. The validity of the simulation toolkit is tested by investigating charge-sharing effects using a Medipix3RX chip bump-bonded to a silicon pixel-array sensor. The dependence of the imaging parameters, on the energy threshold, is presented from both simulation and experiment for the Medipix3RX chip operated with and without the charge sharing compensation circuitry enabled. This simulation toolkit can be used to calculate image quality parameters for the next generation of detectors, including CdTe, as well as to improve data corrections on existing detectors on synchrotron beamlines.

Comparisons between simulation and measurements taken with the Medipix3RX detector

International Nuclear Information System (INIS)

McGrath, J; Marchal, J; Plackett, R; Horswell, I; Omar, D; Gimenez, E N; Tartoni, N

2014-01-01

A simulation toolkit developed for use at Diamond Light Source is presented, accompanied with experimental validation using a silicon pixel-array sensor coupled to a Medipix3RX chip controlled via the Merlin Readout System. The simulation makes use of Geant4, where photons are tracked in order to determine their position of interaction and energy deposition. Further to this, a Finite Element Methods package, Comsol, is used to model the Charge Induction Efficiencies of various sensors. Results are coupled to Geant4 simulations to provide an accurate method for computing the signals generated on each pixel within the sensor and then an algorithm to model the front-end electronics of the device. The validity of the simulation toolkit is tested by investigating charge-sharing effects using a Medipix3RX chip bump-bonded to a silicon pixel-array sensor. The dependence of the imaging parameters, on the energy threshold, is presented from both simulation and experiment for the Medipix3RX chip operated with and without the charge sharing compensation circuitry enabled. This simulation toolkit can be used to calculate image quality parameters for the next generation of detectors, including CdTe, as well as to improve data corrections on existing detectors on synchrotron beamlines

Study of charge-sharing in MEDIPIX3 using a micro-focused synchrotron beam

CERN Document Server

Gimenez, E N; Marchal, J; Turecek, D; Ballabriga, R; Tartoni, N; Campbell, M; Llopart, X; Sawhney, K J S

2011-01-01

X-ray photon-counting detectors consisting of a silicon pixel array sensor bump-bonded to a CMOS electronic readout chip offer several advantages over traditional X-ray detection technologies used for synchrotron applications. They offer high frame rate, dynamic range, count rate capability and signal-to-noise ratio. A survey of the requirements for future synchrotron detectors carried out at the Diamond Light Source synchrotron highlighted the needs for detectors with a pixel size of the order of 50 mu m. Reducing the pixel size leads to an increase of charge-sharing events between adjacent pixels and, therefore, to a degradation of the energy resolution and image quality of the detector. This effect was observed with MEDIPIX2, a photon-counting readout chip with a pixel size of 55 mu m. The lastest generation of the MEDIPIX family, MEDIPIX3, is designed to overcome this charge-sharing effect in an implemented readout operating mode referred to as Charge Summing Mode. MEDIPIX3 has the same pixel size as MEDI...

Applications and new developments in X-ray materials analysis with MEDIPIX2

International Nuclear Information System (INIS)

Bethke, K.; Vries, R. de; Kogan, V.; Vasterink, J.; Verbruggen, R.; Kidd, P.; Fewster, P.; Bethke, J.

2006-01-01

The detection system is a key part of an X-ray analysis system. Important developments in detection technology based on photon counting pixel chips, such as the MEDIPIX2 chip [1] are under way. This paper describes the results of the technology transfer collaboration with CERN and the associated MEDIPIX collaboration. Some preliminary results of some first experiments revealing basic detector properties will be presented. Furthermore, some examples of typical applications in X-ray diffraction will be shown and the expectations for later integration of pixel detectors discussed. A partnership consortium has recently been established, the partners being IMEC and CANBERRA in Belgium and NIKHEF and PANalytical in the Netherlands. A new EUREKA detector project (RELAXD: High REsolution Large Area X-ray Detector) has been initiated by the partners and approved for funding by the ministry of economic affairs in NL. Aim is to make technologies available that lead to large area pixel detectors with minimized dead spaces and high-speed data read-out. This concept will be explained

EXCALIBUR: a small-pixel photon counting area detector for coherent X-ray diffraction - Front-end design, fabrication and characterisation

Science.gov (United States)

Marchal, J.; Horswell, I.; Willis, B.; Plackett, R.; Gimenez, E. N.; Spiers, J.; Ballard, D.; Booker, P.; Thompson, J. A.; Gibbons, P.; Burge, S. R.; Nicholls, T.; Lipp, J.; Tartoni, N.

2013-03-01

Coherent X-ray diffraction experiments on synchrotron X-ray beamlines require detectors with high spatial resolution and large detection area. The read-out chip developed by the MEDIPIX3 collaboration offers a small pixel size of 55 microns resulting in a very high spatial resolution when coupled to a direct X-ray conversion segmented silicon sensor. MEDIPIX3 assemblies present also the advantages of hybrid pixel detectors working in single photon counting mode: noiseless imaging, large dynamic range, extremely high frame rate. The EXCALIBUR detector is under development for the X-ray Coherence and Imaging Beamline I13 of the Diamond Light Source. This new detector consists of three modules, each with 16 MEDIPIX3 chips which can be read-out at 100 frames per second in continuous mode or 1000 frames per second in burst mode. In each module, the sensor is a large single silicon die covering 2 rows of 8 individual MEDIPIX3 read-out chips and provides a continuous active detection region within a module. Each module includes 1 million solder bumps connecting the 55 microns pixels of the silicon sensor to the 55 microns pixels of the 16 MEDIPIX3 read-out chips. The detection area of the 3-module EXCALIBUR detector is 115 mm × 100 mm with a small 6.8 mm wide inactive region between modules. Each detector module is connected to 2 FPGA read-out boards via a flexi-rigid circuit to allow a fully parallel read-out of the 16 MEDIPIX3 chips. The 6 FPGA read-out boards used in the EXCALIBUR detector are interfaced to 6 computing nodes via 10Gbit/s fibre-optic links to maintain the very high frame-rate capability. The standard suite of EPICS control software is used to operate the detector and to integrate it with the Diamond Light Source beamline software environment. This article describes the design, fabrication and characterisation of the MEDIPIX3-based modules composing the EXCALIBUR detector.

EXCALIBUR: a small-pixel photon counting area detector for coherent X-ray diffraction - Front-end design, fabrication and characterisation

International Nuclear Information System (INIS)

Marchal, J; Horswell, I; Willis, B; Plackett, R; Gimenez, E N; Spiers, J; Thompson, J A; Gibbons, P; Tartoni, N; Ballard, D; Booker, P; Burge, S R; Nicholls, T; Lipp, J

2013-01-01

Coherent X-ray diffraction experiments on synchrotron X-ray beamlines require detectors with high spatial resolution and large detection area. The read-out chip developed by the MEDIPIX3 collaboration offers a small pixel size of 55 microns resulting in a very high spatial resolution when coupled to a direct X-ray conversion segmented silicon sensor. MEDIPIX3 assemblies present also the advantages of hybrid pixel detectors working in single photon counting mode: noiseless imaging, large dynamic range, extremely high frame rate. The EXCALIBUR detector is under development for the X-ray Coherence and Imaging Beamline I13 of the Diamond Light Source. This new detector consists of three modules, each with 16 MEDIPIX3 chips which can be read-out at 100 frames per second in continuous mode or 1000 frames per second in burst mode. In each module, the sensor is a large single silicon die covering 2 rows of 8 individual MEDIPIX3 read-out chips and provides a continuous active detection region within a module. Each module includes 1 million solder bumps connecting the 55 microns pixels of the silicon sensor to the 55 microns pixels of the 16 MEDIPIX3 read-out chips. The detection area of the 3-module EXCALIBUR detector is 115 mm × 100 mm with a small 6.8 mm wide inactive region between modules. Each detector module is connected to 2 FPGA read-out boards via a flexi-rigid circuit to allow a fully parallel read-out of the 16 MEDIPIX3 chips. The 6 FPGA read-out boards used in the EXCALIBUR detector are interfaced to 6 computing nodes via 10Gbit/s fibre-optic links to maintain the very high frame-rate capability. The standard suite of EPICS control software is used to operate the detector and to integrate it with the Diamond Light Source beamline software environment. This article describes the design, fabrication and characterisation of the MEDIPIX3-based modules composing the EXCALIBUR detector.

Medipix3RX: Characterizing the Medipix3 Redesign With Synchrotron Radiation

CERN Document Server

Gimenez, Eva N; Blaj, Gabriel; Campbell, Michael; Dolbnya, Igor; Frodjh, Erik; Horswell, Ian; Llopart, Xavier; Marchal, Julien; McGrath, John; Omar, David; Plackett, Richard; Sawhney, Kawal; Tartoni, Nicola

2015-01-01

The Medipix3RX is the latest version of the Medipix3 photon counting ASICs, which implements two new operational modes, with respect to the Medipix2 ASIC, aimed at eliminating charge shared events (referred to as Charge Summing Mode (CSM)) and at providing spectroscopic information (referred to as Colour Mode (CM)). The Medipix3RX is a redesign of the Medipix3v0 ASIC and corrects for the underperformance of CSM features observed in the previous version. This paper presents the results from synchrotron X-rays tests to evaluate the Medipix3RX ASIC performance. The newly implemented CSM algorithm eliminates the charge sharing effect at the same time as allocating the event to the readout pixel corresponding to the sensor pixel where the X-ray photon impinged. The new pixel trimming circuit led to a reduced dispersion between pixels. Further results of the linearity for all the gain modes, energy resolution and pixel uniformity are also presented.

High-speed readout of high-Z pixel detectors with the LAMBDA detector

International Nuclear Information System (INIS)

Pennicard, D.; Smoljanin, S.; Sheviakov, I.; Xia, Q.; Rothkirch, A.; Yu, Y.; Struth, B.; Hirsemann, H.; Graafsma, H.

2014-01-01

High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ''high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ''continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan

Using the Medipix3 detector for direct electron imaging in the range 60 keV to 200 keV in electron microscopy

Science.gov (United States)

Mir, J. A.; Plackett, R.; Shipsey, I.; dos Santos, J. M. F.

2017-11-01

Hybrid pixel sensor technology such as the Medipix3 represents a unique tool for electron imaging. We have investigated its performance as a direct imaging detector using a Transmission Electron Microscope (TEM) which incorporated a Medipix3 detector with a 300 μm thick silicon layer compromising of 256×256 pixels at 55 μm pixel pitch. We present results taken with the Medipix3 in Single Pixel Mode (SPM) with electron beam energies in the range, 60-200 keV . Measurements of the Modulation Transfer Function (MTF) and the Detective Quantum Efficiency (DQE) were investigated. At a given beam energy, the MTF data was acquired by deploying the established knife edge technique. Similarly, the experimental data required to determine DQE was obtained by acquiring a stack of images of a focused beam and of free space (flatfield) to determine the Noise Power Spectrum (NPS).

How good is better? A comparison between the Medipix1 and the Medipix2 chip using mammographic phantoms

International Nuclear Information System (INIS)

Pfeiffer, K.F.G.

2003-01-01

Full text: The Mixed-up chip is the successor to the Medipix 1 chip and was also developed within the framework of the Medipix Colaboration. Both chips are pixel detector readout chips working in single photon counting mode and are designed for direct conversion X-ray imaging, for which they are bump-bonded to a pixelated semiconductor sensor layer. Both assemblies used in this comparison have a 300 μm thick sensor layer made of silicon. The main changes realized in the second chip generation are the smaller pixel size of 55 μm x 55 μm, the larger number of pixels (256 x 256) and a second adjustable energy threshold which facilitates energy windowing. For comparing the two detector generations, mammographic phantoms and a suitable X-ray tube have been used. By imaging selected parts of the phantoms with both detectors under the same conditions it is possible to make a direct comparison between the imaging properties of both chips. Main aspects of the experiments were the resolution of high-contrast details and low-contrast imaging. To provide a reference point for image quality the phantoms were also imaged using standard clinical equipment. Since these measurements have been made without an anti-scatter grid, additional simulations have been performed to estimate the influence of scattered photons on the image quality

Spatial resolution of Medipix-2 device as neutron pixel detector

Czech Academy of Sciences Publication Activity Database

Jakůbek, J.; Holý, T.; Lehmann, E.; Pospíšil, S.; Uher, J.; Vacík, Jiří; Vavřík, D.

2005-01-01

Roč. 546, - (2005), s. 164-169 ISSN 0168-9002 R&D Projects: GA MŠk(CZ) 1P04LA211 Institutional research plan: CEZ:AV0Z10480505 Keywords : neutron detection * pixel detectors * neutronography Subject RIV: BG - Nuclear, Atomic and Molecular Physics, Colliders Impact factor: 1.224, year: 2005

Characterization of Medipix3 with the MARS readout and software

CERN Document Server

Ronaldson, J P; van Leeuwen, D; Doesburg, R M N; Ballabriga, R; Butler, A P H; Donaldson, J; Walsh, M; Nik, S J; Clyne, M N

2011-01-01

The Medipix3 x-ray imaging detector has been characterized using the MARS camera. This x-ray camera comprises custom built readout electronics and software libraries designed for the Medipix family of detectors. The performance of the Medipix3 and MARS camera system is being studied prior to use in real-world applications such as the recently developed MARS-CT3 spectroscopic micro-CT scanner. We present the results of characterization measurements, describe methods for optimizing performance and give examples of spectroscopic images acquired with Medipix3 and the MARS camera system. A limited number of operating modes of the Medipix3 chip have been characterized and single-pixel mode has been found to give acceptable performance in terms of energy response, image quality and stability over time. Spectroscopic performance is significantly better in charge-summing mode than single-pixel mode however image quality and stability over time are compromised. There are more modes of operation to be tested and further...

X-ray imaging with photon counting hybrid semiconductor pixel detectors

CERN Document Server

Manolopoulos, S; Campbell, M; Snoeys, W; Heijne, Erik H M; Pernigotti, E; Raine, C; Smith, K; Watt, J; O'Shea, V; Ludwig, J; Schwarz, C

1999-01-01

Semiconductor pixel detectors, originally developed for particle physics experiments, have been studied as X-ray imaging devices. The performance of devices using the OMEGA 3 read-out chip bump-bonded to pixellated silicon semiconductor detectors is characterised in terms of their signal-to-noise ratio when exposed to 60 kVp X-rays. Although parts of the devices achieve values of this ratio compatible with the noise being photon statistics limited, this is not found to hold for the whole pixel matrix, resulting in the global signal-to-noise ratio being compromised. First results are presented of X-ray images taken with a gallium arsenide pixel detector bump-bonded to a new read-out chip, (MEDIPIX), which is a single photon counting read-out chip incorporating a 15-bit counter in every pixel. (author)

The Dosepix detector—an energy-resolving photon-counting pixel detector for spectrometric measurements

CERN Document Server

Zang, A; Ballabriga, R; Bisello, F; Campbell, M; Celi, J C; Fauler, A; Fiederle, M; Jensch, M; Kochanski, N; Llopart, X; Michel, N; Mollenhauer, U; Ritter, I; Tennert, F; Wölfel, S; Wong, W; Michel, T

2015-01-01

The Dosepix detector is a hybrid photon-counting pixel detector based on ideas of the Medipix and Timepix detector family. 1 mm thick cadmium telluride and 300 μm thick silicon were used as sensor material. The pixel matrix of the Dosepix consists of 16 x 16 square pixels with 12 rows of (200 μm)2 and 4 rows of (55 μm)2 sensitive area for the silicon sensor layer and 16 rows of pixels with 220 μm pixel pitch for CdTe. Besides digital energy integration and photon-counting mode, a novel concept of energy binning is included in the pixel electronics, allowing energy-resolved measurements in 16 energy bins within one acquisition. The possibilities of this detector concept range from applications in personal dosimetry and energy-resolved imaging to quality assurance of medical X-ray sources by analysis of the emitted photon spectrum. In this contribution the Dosepix detector, its response to X-rays as well as spectrum measurements with Si and CdTe sensor layer are presented. Furthermore, a first evaluation wa...

The color of X-rays: Spectral X-ray computed tomography using energy sensitive pixel detectors

NARCIS (Netherlands)

Schioppa, E.J.

2014-01-01

Energy sensitive X-ray imaging detectors are produced by connecting a semiconductor sensor to a spectroscopic pixel readout chip. In this thesis, the applicability of such detectors to X-ray Computed Tomography (CT) is studied. A prototype Medipix based silicon detector is calibrated using X-ray

Crystal Collimation efficiency measured with the Medipix detector in SPS UA9 experiment.

CERN Document Server

Laface, E; Tlustos, L; Ippolito, V

2010-01-01

The UA9 experiment was performed in 6 MDs from May to November 2009 with the goal of studying the collimation properties of a crystal in the framework of a future exploitation in the LHC collimation system. An important parameter evaluated for the characterization of the crystal collimation is the efficiency of halo extraction when the crystal is in channeling mode. In this paper it is explained how this efficiency can be measured using a pixel detector, the Medipix, installed in the Roman Pot of UA9. The number of extracted particles counted by the Medipix is compared with the total number of circulating particles measured by the Beam Current Transformers (BCTs): from this comparison the efficiency of the system composed by the crystal, used in channeling mode, and a tungsten absorber is proved to be greater than 85%.

Characterisation of Medipix3 Silicon Detectors in a Charged-Particle Beam

CERN Document Server

Akiba, K.; Aoude, R.Tourinho; van Beuzekom, M.; Buytaert, J.; Collins, P.; Dosil Suárez, A.; Dumps, R.; Gallas, A.; Hombach, C.; Hynds, D.; John, M.; Leflat, A.; Li, Y.; Pérez-Trigo, E.; Plackett, R.; Reid, M.M.; Rodríguez Pérez, P.; Schindler, H.; Tsopelas, P.; Vázquez Sierra, C.; Velthuis, J.J.; Wysokiński, M.

2016-01-21

While designed primarily for X-ray imaging applications, the Medipix3 ASIC can also be used for charged-particle tracking. In this work, results from a beam test at the CERN SPS with irradiated and non-irradiated sensors are presented and shown to be in agreement with simulation, demonstrating the suitability of the Medipix3 ASIC as a tool for characterising pixel sensors.

Simulation of single-event energy-deposition spreading in a hybrid pixellated detector for gamma imaging

CERN Document Server

Manach, E

2002-01-01

In the framework of the Medipix2 Collaboration, a new photon-counting chip is being developed made of a 256x256 array of 55 mu m-side square pixels. Although the chip was primarily developed for semiconductor X-ray imagers, we think that this type of device could be used in applications such as decommissioning of nuclear facilities where typical sources have gamma-ray energies in the range of a few hundred keV. In order to enhance the detection efficiency in this energy range, we envisage connecting the Medipix2 chip to a CdTe or CdZnTe substrate (at least 1 mm thick). The small pixel size, the thickness of the Cd(Zn)Te substrate and the high photon energy motivate us to estimate first the spatial energy spreading following a photon interaction inside the detector. Estimations were made using the MCNP Monte Carlo package by simulating the individual energy distribution for each primary photon interaction. As an illustration of our results, simulating a 660 keV gamma source, we found that there are two pixels ...

Bio-medical X-ray imaging with spectroscopic pixel detectors

CERN Document Server

Butler, A P H; Tipples, R; Cook, N; Watts, R; Meyer, J; Bell, A J; Melzer, T R; Butler, P H

2008-01-01

The aim of this study is to review the clinical potential of spectroscopic X-ray detectors and to undertake a feasibility study using a novel detector in a clinical hospital setting. Detectors currently in development, such as Medipix-3, will have multiple energy thresholds allowing for routine use of spectroscopic bio-medical imaging. We have coined the term MARS (Medipix All Resolution System) for bio-medical images that provide spatial, temporal, and energy information. The full clinical significance of spectroscopic X-ray imaging is difficult to predict but insights can be gained by examining both image reconstruction artifacts and the current uses of dual-energy techniques. This paper reviews the known uses of energy information in vascular imaging and mammography, clinically important fields. It then presents initial results from using Medipix-2, to image human tissues within a clinical radiology department. Detectors currently in development, such as Medipix-3, will have multiple energy thresholds allo...

A Medipix3 readout system based on the National Instruments FlexRIO card and using the LabVIEW programming environment

Science.gov (United States)

Horswell, I.; Gimenez, E. N.; Marchal, J.; Tartoni, N.

2011-01-01

Hybrid silicon photon-counting detectors are becoming standard equipment for many synchrotron applications. The latest in the Medipix family of read-out chips designed as part of the Medipix Collaboration at CERN is the Medipix3, which while maintaining the same pixel size as its predecessor, offers increased functionality and operating modes. The active area of the Medipix3 chip is approx 14mm × 14mm (containing 256 × 256 pixels) which is not large enough for many detector applications, this results in the need to tile many sensors and chips. As a first step on the road to develop such a detector, it was decided to build a prototype single chip readout system to gain the necessary experience in operating a Medipix3 chip. To provide a flexible learning and development tool it was decided to build an interface based on the recently released FlexRIOTM system from National Instruments and to use the LabVIEWTM graphical programming environment. This system and the achieved performance are described in this paper.

3D track reconstruction capability of a silicon hybrid active pixel detector

Energy Technology Data Exchange (ETDEWEB)

Bergmann, Benedikt; Pichotka, Martin; Pospisil, Stanislav; Vycpalek, Jiri [Czech Technical University in Prague, Institute of Experimental and Applied Physics, Praha (Czech Republic); Burian, Petr; Broulim, Pavel [Czech Technical University in Prague, Institute of Experimental and Applied Physics, Praha (Czech Republic); University of West Bohemia, Faculty of Electrical Engineering, Pilsen (Czech Republic); Jakubek, Jan [Advacam s.r.o., Praha (Czech Republic)

2017-06-15

Timepix3 detectors are the latest generation of hybrid active pixel detectors of the Medipix/Timepix family. Such detectors consist of an active sensor layer which is connected to the readout ASIC (application specific integrated circuit), segmenting the detector into a square matrix of 256 x 256 pixels (pixel pitch 55 μm). Particles interacting in the active sensor material create charge carriers, which drift towards the pixelated electrode, where they are collected. In each pixel, the time of the interaction (time resolution 1.56 ns) and the amount of created charge carriers are measured. Such a device was employed in an experiment in a 120 GeV/c pion beam. It is demonstrated, how the drift time information can be used for ''4D'' particle tracking, with the three spatial dimensions and the energy losses along the particle trajectory (dE/dx). Since the coordinates in the detector plane are given by the pixelation (x,y), the x- and y-resolution is determined by the pixel pitch (55 μm). A z-resolution of 50.4 μm could be achieved (for a 500 μm thick silicon sensor at 130 V bias), whereby the drift time model independent z-resolution was found to be 28.5 μm. (orig.)

3D track reconstruction capability of a silicon hybrid active pixel detector

Science.gov (United States)

Bergmann, Benedikt; Pichotka, Martin; Pospisil, Stanislav; Vycpalek, Jiri; Burian, Petr; Broulim, Pavel; Jakubek, Jan

2017-06-01

Timepix3 detectors are the latest generation of hybrid active pixel detectors of the Medipix/Timepix family. Such detectors consist of an active sensor layer which is connected to the readout ASIC (application specific integrated circuit), segmenting the detector into a square matrix of 256 × 256 pixels (pixel pitch 55 μm). Particles interacting in the active sensor material create charge carriers, which drift towards the pixelated electrode, where they are collected. In each pixel, the time of the interaction (time resolution 1.56 ns) and the amount of created charge carriers are measured. Such a device was employed in an experiment in a 120 GeV/c pion beam. It is demonstrated, how the drift time information can be used for "4D" particle tracking, with the three spatial dimensions and the energy losses along the particle trajectory (dE/dx). Since the coordinates in the detector plane are given by the pixelation ( x, y), the x- and y-resolution is determined by the pixel pitch (55 μm). A z-resolution of 50.4 μm could be achieved (for a 500 μm thick silicon sensor at 130 V bias), whereby the drift time model independent z-resolution was found to be 28.5 μm.

The Measurement of Spectral Characteristics and Composition of Radiation in Atlas with MEDIPIX2-USB Devices

Science.gov (United States)

Campbell, M.; Doležal, Z.; Greiffenberg, D.; Heijne, E.; Holy, T.; Idárraga, J.; Jakůbek, J.; Král, V.; Králík, M.; Lebel, C.; Leroy, C.; Llopart, X.; Lord, G.; Maneuski, D.; Ouellette, O.; Sochor, V.; Pospíšil, S.; Suk, M.; Tlustos, L.; Vykydal, Z.; Wilhelm, I.

2008-06-01

A network of devices to perform real-time measurements of the spectral characteristics and composition of radiation in the ATLAS detector and cavern during its operation is being built. This system of detectors will be a stand alone system fully capable of delivering real-time images of fluxes and spectral composition of different particle species including slow and fast neutrons. The devices are based on MEDIPIX2 pixel silicon detectors that will be operated via active USB cables and USB-Ethernet extenders through an Ethernet network by a PC located in the USA15 ATLAS control room. The installation of 14 devices inside ATLAS (detector and cavern) is in progress.

The Measurement of Spectral Characteristics and Composition of Radiation in ATLAS with MEDIPIX2-USB Devices

CERN Document Server

Campbell, M.; Greiffenberg, D.; Heijne, E.; Holy, T.; Idárraga, J.; Jakubek, J.; Král, V.; Králík, M.; Lebel, C.; Leroy, C.; Llopart, X.; Lord, G.; Maneuski, D.; Ouellette, O.; Sochor, V.; Prospísil, S.; Suk, M; Tlustos, L.; Vykydal, Z.; Wilhelm, I.

2008-01-01

A network of devices to perform real-time measurements of the spectral characteristics and composition of radiation in the ATLAS detector and cavern during its operation is being built. This system of detectors will be a stand alone system fully capable of delivering real-time images of fluxes and spectral composition of different particle species including slow and fast neutrons. The devices are based on MEDIPIX2 pixel silicon detectors that will be operated via active USB cables and USB-Ethernet extenders through an Ethernet network by a PC located in the USA15 ATLAS control room. The installation of 14 devices inside ATLAS (detector and cavern) is in progress.

Towards a new generation of pixel detector readout chips

CERN Document Server

Campbell, M; Ballabriga, R.; Frojdh, E.; Heijne, E.; Llopart, X.; Poikela, T.; Tlustos, L.; Valerio, P.; Wong, W.

2016-01-01

The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile- ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed.

Evaluation of a photon counting Medipix3RX CZT spectral x-ray detector

Science.gov (United States)

Jorgensen, Steven M.; Vercnocke, Andrew J.; Rundle, David S.; Butler, Philip H.; McCollough, Cynthia H.; Ritman, Erik L.

2016-10-01

We assessed the performance of a cadmium zinc telluride (CZT)-based Medipix3RX x-ray detector as a candidate for micro-computed tomography (micro-CT) imaging. This technology was developed at CERN for the Large Hadron Collider. It features an array of 128 by 128, 110 micrometer square pixels, each with eight simultaneous threshold counters, five of which utilize real-time charge summing, significantly reducing the charge sharing between contiguous pixels. Pixel response curves were created by imaging a range of x-ray intensities by varying x-ray tube current and by varying the exposure time with fixed x-ray current. Photon energy-related assessments were made by flooding the detector with the tin foil filtered emission of an I-125 radioisotope brachytherapy seed and sweeping the energy threshold of each of the four charge-summed counters of each pixel in 1 keV steps. Long term stability assessments were made by repeating exposures over the course of one hour. The high properly-functioning pixel yield (99%), long term stability (linear regression of whole-chip response over one hour of acquisitions: y = -0.0038x + 2284; standard deviation: 3.7 counts) and energy resolution (2.5 keV FWHM (single pixel), 3.7 keV FWHM across the full image) make this device suitable for spectral micro-CT. The charge summing performance effectively reduced the measurement corruption caused by charge sharing which, when unaccounted for, shifts the photon energy assignment to lower energies, degrading both count and energy accuracy. Effective charge summing greatly improves the potential for calibrated, energy-specific material decomposition and K edge difference imaging approaches.

18F-FDG positron autoradiography with a particle counting silicon pixel detector.

Science.gov (United States)

Russo, P; Lauria, A; Mettivier, G; Montesi, M C; Marotta, M; Aloj, L; Lastoria, S

2008-11-07

We report on tests of a room-temperature particle counting silicon pixel detector of the Medipix2 series as the detector unit of a positron autoradiography (AR) system, for samples labelled with (18)F-FDG radiopharmaceutical used in PET studies. The silicon detector (1.98 cm(2) sensitive area, 300 microm thick) has high intrinsic resolution (55 microm pitch) and works by counting all hits in a pixel above a certain energy threshold. The present work extends the detector characterization with (18)F-FDG of a previous paper. We analysed the system's linearity, dynamic range, sensitivity, background count rate, noise, and its imaging performance on biological samples. Tests have been performed in the laboratory with (18)F-FDG drops (37-37 000 Bq initial activity) and ex vivo in a rat injected with 88.8 MBq of (18)F-FDG. Particles interacting in the detector volume produced a hit in a cluster of pixels whose mean size was 4.3 pixels/event at 11 keV threshold and 2.2 pixels/event at 37 keV threshold. Results show a sensitivity for beta(+) of 0.377 cps Bq(-1), a dynamic range of at least five orders of magnitude and a lower detection limit of 0.0015 Bq mm(-2). Real-time (18)F-FDG positron AR images have been obtained in 500-1000 s exposure time of thin (10-20 microm) slices of a rat brain and compared with 20 h film autoradiography of adjacent slices. The analysis of the image contrast and signal-to-noise ratio in a rat brain slice indicated that Poisson noise-limited imaging can be approached in short (e.g. 100 s) exposures, with approximately 100 Bq slice activity, and that the silicon pixel detector produced a higher image quality than film-based AR.

Progress on TSV technology for Medipix3RX chip

Science.gov (United States)

Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.

2017-12-01

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm×14.1 mm or 256×256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 μm original thickness, to 130 μm. The diameter of the vias is 40 μm, and the pitch between the vias is 120 μm. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.

Si and gaas pixel detectors for medical imaging applications

International Nuclear Information System (INIS)

Bisogni, M. G.

2001-01-01

As the use of digital radiographic equipment in the morphological imaging field is becoming the more and more diffuse, the research of new and more performing devices from public institutions and industrial companies is in constant progress. Most of these devices are based on solid-state detectors as X-ray sensors. Semiconductor pixel detectors, originally developed in the high energy physics environment, have been then proposed as digital detector for medical imaging applications. In this paper a digital single photon counting device, based on silicon and GaAs pixel detector, is presented. The detector is a thin slab of semiconductor crystal where an array of 64 by 64 square pixels, 170- m side, has been built on one side. The data read-out is performed by a VLSI integrated circuit named Photon Counting Chip (PCC), developed within the MEDIPIX collaboration. Each chip cell geometrically matches the sensor pixel. It contains a charge preamplifier, a threshold comparator and a 15 bits pseudo-random counter and it is coupled to the detector by means of bump bonding. Most important advantages of such system, with respect to a traditional X-rays film/screen device, are the wider linear dynamic range (3x104) and the higher performance in terms of MTF and DQE. Besides the single photon counting architecture allows to detect image contrasts lower than 3%. Electronics read-out performance as well as imaging capabilities of the digital device will be presented. Images of mammographic phantoms acquired with a standard Mammographic tube will be compared with radiographs obtained with traditional film/screen systems

Pixelized M-pi-n CdTe detector coupled to Medipix2 readout chip

CERN Document Server

Kalliopuska, J; Penttila, R; Andersson, H; Nenonen, S; Gadda, A; Pohjonen, H; Vanttajac, I; Laaksoc, P; Likonen, J

2011-01-01

We have realized a simple method for patterning an M-pi-n CdTe diode with a deeply diffused pn-junction, such as indium anode on CdTe. The method relies on removing the semiconductor material on the anode-side of the diode until the physical junction has been reached. The pixelization of the p-type CdTe diode with an indium anode has been demonstrated by patterning perpendicular trenches with a high precision diamond blade and pulsed laser. Pixelization or microstrip pattering can be done on both sides of the diode, also on the cathode-side to realize double sided detector configuration. The article compares the patterning quality of the diamond blade process, pulsed pico-second and femto-second lasers processes. Leakage currents and inter-strip resistance have been measured and are used as the basis of the comparison. Secondary ion mass spectrometry (SIMS) characterization has been done for a diode to define the pn-junction depth and to see the effect of the thermal loads of the flip-chip bonding process. Th...

Design and Characterization of 64K Pixels Chips Working in Single Photon Processing Mode

CERN Document Server

Llopart Cudie, Xavier; Campbell, M

2007-01-01

Progress in CMOS technology and in fine pitch bump bonding has made possible the development of high granularity single photon counting detectors for X-ray imaging. This thesis studies the design and characterization of three pulse processing chips with 65536 square pixels of 55 µm x 55 µm designed in a commercial 0.25 µm 6-metal CMOS technology. The 3 chips share the same architecture and dimensions and are named Medipix2, Mpix2MXR20 and Timepix. The Medipix2 chip is a pixel detector readout chip consisting of 256 x 256 identical elements, each working in single photon counting mode for positive or negative input charge signals. The preamplifier feedback provides compensation for detector leakage current on a pixel by pixel basis. Two identical pulse height discriminators are used to define an energy window. Every event falling inside the energy window is counted with a 13 bit pseudo-random counter. The counter logic, based in a shift register, also behaves as the input/output register for the pixel. Each...

Monte Carlo Studies of two Different Conversion Layers for Neutron Measurements with Medipix Silicon Detector.

CERN Document Server

Larsen, Andreas

2013-01-01

In 2007 the ventilation system of CNGS failed and investigations showed that the failure was due to Single Event Upset (SEU). Since then there has been increased interest in studies of neutron flux, that can potentially cause SEU. Two Medipix detectors have previously been installed in the CMS cavern on a test basis and have shown to work as intended[1]. More Medipix detectors will be installed to provide high resolution measurements of the particle flux in the vicinity of the CMS, focusing on measurements of the neutron flux. The measurements will provide an important basis to know what precautions to take to avoid another failure due to SEU. The measurements will also constitute a valuably reference to the FLUKA simulations of the general flux in the CMS cavern, that can potentially lead to important corrections of the simulations. Furthermore, measurements from the Medipix detectors will act as a cross check on the hadronic forward detector radiation monitoring system (HF radmon). Bonnos spheres are alread...

Merlin: a fast versatile readout system for Medipix3

International Nuclear Information System (INIS)

Plackett, R; Horswell, I; Gimenez, E N; Marchal, J; Omar, D; Tartoni, N

2013-01-01

This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in 'pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

Merlin: a fast versatile readout system for Medipix3

Science.gov (United States)

Plackett, R.; Horswell, I.; Gimenez, E. N.; Marchal, J.; Omar, D.; Tartoni, N.

2013-01-01

This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in `pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors

CERN Document Server

Heijne, E H M; Wong, W; Idarraga, J; Visser, J; Jakubek, J; Leroy, C; Turecek, D; Visschers, J; Pospisil, S; Ballabriga, R; Vykydal, Z; Vermeulen, J; Plackett, R; Heijne, E H M; Llopart, X; Boltje, D; Campbell, M

2010-01-01

Measurements are shown of GeV pions and muons in two 300 mu m thick, Si Medipix pixel detector assemblies that are stacked on top of each other, with a 25 mu m thick brass foil in between. In such a radiation imaging semiconductor matrix with a large number of pixels along the particle trail, one can determine local space vectors for the particle trajectory instead of points. This improves pattern recognition and track reconstruction, especially in a crowded environment. Stacking of sensor planes is essential for resolving directional ambiguities. Signal charge sharing can be employed for measuring positions with submicron precision. In the measurements one notices accompanying `delta' electrons that emerge outside the particle trail, far beyond the boundaries of the 55 mu m pixel cells. The frequency of such corrupted position measurements is similar to one per 2.5mm of traversed Si.

Characterisation of edgeless technologies for pixellated and strip silicon detectors with a micro-focused X-ray beam

Science.gov (United States)

Bates, R.; Blue, A.; Christophersen, M.; Eklund, L.; Ely, S.; Fadeyev, V.; Gimenez, E.; Kachkanov, V.; Kalliopuska, J.; Macchiolo, A.; Maneuski, D.; Phlips, B. F.; Sadrozinski, H. F.-W.; Stewart, G.; Tartoni, N.; Zain, R. M.

2013-01-01

Reduced edge or ``edgeless'' detector design offers seamless tileability of sensors for a wide range of applications from particle physics to synchrotron and free election laser (FEL) facilities and medical imaging. Combined with through-silicon-via (TSV) technology, this would allow reduced material trackers for particle physics and an increase in the active area for synchrotron and FEL pixel detector systems. In order to quantify the performance of different edgeless fabrication methods, 2 edgeless detectors were characterized at the Diamond Light Source using an 11 μm FWHM 15 keV micro-focused X-ray beam. The devices under test were: a 150 μm thick silicon active edge pixel sensor fabricated at VTT and bump-bonded to a Medipix2 ROIC; and a 300 μm thick silicon strip sensor fabricated at CIS with edge reduction performed by SCIPP and the NRL and wire bonded to an ALiBaVa readout system. Sub-pixel resolution of the 55 μm active edge pixels was achieved. Further scans showed no drop in charge collection recorded between the centre and edge pixels, with a maximum deviation of 5% in charge collection between scanned edge pixels. Scans across the cleaved and standard guard ring edges of the strip detector also show no reduction in charge collection. These results indicate techniques such as the scribe, cleave and passivate (SCP) and active edge processes offer real potential for reduced edge, tiled sensors for imaging detection applications.

Medipix2 based CdTe microprobe for dental imaging

International Nuclear Information System (INIS)

Vykydal, Z; Jakubek, J; Fauler, A; Fiederle, M; Zwerger, A; Svestkova, M

2011-01-01

Medical imaging devices and techniques are demanded to provide high resolution and low dose images of samples or patients. Hybrid semiconductor single photon counting devices together with suitable sensor materials and advanced techniques of image reconstruction fulfil these requirements. In particular cases such as the direct observation of dental implants also the size of the imaging device itself plays a critical role. This work presents the comparison of 2D radiographs of tooth provided by a standard commercial dental imaging system (Gendex 765DC X-ray tube with VisualiX scintillation detector) and two Medipix2 USB Lite detectors one equipped with a Si sensor (300 μm thick) and one with a CdTe sensor (1 mm thick). Single photon counting capability of the Medipix2 device allows virtually unlimited dynamic range of the images and thus increases the contrast significantly. The dimensions of the whole USB Lite device are only 15 mm × 60 mm of which 25% consists of the sensitive area. Detector of this compact size can be used directly inside the patients' mouth.

Evaluation of the charge-sharing effects on spot intensity in XRD setup using photon-counting pixel detectors

International Nuclear Information System (INIS)

Nilsson, H.-E.; Mattsson, C.G.; Norlin, B.; Froejdh, C.; Bethke, K.; Vries, R. de

2006-01-01

In this study, we examine how charge loss due to charge sharing in photon-counting pixels detectors affects the recording of spot intensity in an X-ray diffraction (XRD) setup. In the photon-counting configuration, the charge from photons that are absorbed at the boarder of a pixel will be shared between two pixels. If the threshold is high enough, these photons will not be counted whereas if it is low enough, they will be counted twice. In an XRD setup, the intensity and position of various spots should be recorded. Thus, the intensity measure will be affected by the setting of the threshold. In this study, we used a system level Monte Carlo simulator to evaluate the variations in the intensity signals for different threshold settings and spot sizes. The simulated setup included an 8keV mono-chromatic source (providing a Gaussian shaped spot) and the MEDIPIX2 photon-counting pixel detector (55 μm x 55 μm pixel size with 300μm silicon) at various detector biases. Our study shows that the charge-sharing distortion can be compensated by numerical post processing and that high resolution in both charge distribution and position can be achieved

Medipix3 array high performance read-out board for synchrotron research

International Nuclear Information System (INIS)

Tartoni, N.; Horswell, I. C.; Marchal, J.; Gimenez, E. N.; Fearn, R. D.; Silfhout, R. G. van

2010-01-01

The Medipix3 ASIC is one of the most advanced chip that is presently available to build photon counting area detectors. The capabilities of the chip include adjacent pixels charge summing circuitry to sort out the distortion due to charge sharing, simultaneous counting and read-out that enables frames to be acquired without dead time, the colour mode of operation that enables up to eight energy bands to be acquired. In order to fully exploit the capabilities of the Medipix3 chip in synchrotron research, a high performance electronic board capable of driving large arrays of chips is necessary. We propose a parallel read-out board of Medipix3 chip arrays with a scalable architecture that allows driving the Medipix3 chip in all of its modes of operation. The board functions include the control of the chip arrays, data formatting and data compression, the management of the communications with the data storage devices, and operation in various trigger modes. In addition to this the board will have some 'intelligence' embedded. This will add some very important features to the final detector such as pattern recognition, capability of variable frame duration as a function of the photon flux, feedback to other equipment and real time calculations of data relevant to experiments such as the autocorrelation function.

The Design and Implementation in $0.13\\mu m$ CMOS of an Algorithm Permitting Spectroscopic Imaging with High Spatial Resolution for Hybrid Pixel Detectors

CERN Document Server

Ballabriga, Rafael; Vilasís-Cardona, Xavier

2009-01-01

Advances in pixel detector technology are opening up new possibilities in many fields of science. Modern High Energy Physics (HEP) experiments use pixel detectors in tracking systems where excellent spatial resolution, precise timing and high signal-to-noise ratio are required for accurate and clean track reconstruction. Many groups are working worldwide to adapt the hybrid pixel technology to other fields such as medical X-ray radiography, protein structure analysis or neutron imaging. The Medipix3 chip is a 256x256 channel hybrid pixel detector readout chip working in Single Photon Counting Mode. It has been developed with a new front-end architecture aimed at eliminating the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. In the new architecture neighbouring pixels communicate with one another. Charges can be summed event-by-event and the incoming quantum can be assigned as a single hit to the pixel with the biggest charge deposit. In the case where incoming X-...

Noiseless imaging detector for adaptive optics with kHz frame rates

CERN Document Server

Vallerga, J V; Mikulec, Bettina; Tremsin, A; Clark, Allan G; Siegmund, O H W; CERN. Geneva

2004-01-01

A new hybrid optical detector is described that has many of the attributes desired for the next generation AO wavefront sensors. The detector consists of a proximity focused MCP read out by four multi-pixel application specific integrated circuit (ASIC) chips developed at CERN (â€ﾜMedipix2”) with individual pixels that amplify, discriminate and count input events. The detector has 512 x 512 pixels, zero readout noise (photon counting) and can be read out at 1 kHz frame rates. The Medipix2 readout chips can be electronically shuttered down to a temporal window of a few microseconds with an accuracy of 10 nanoseconds. When used in a Shack-Hartman style wavefront sensor, it should be able to centroid approximately 5000 spots using 7 x 7 pixel sub-apertures resulting in very linear, off-null error correction terms. The quantum efficiency depends on the optical photocathode chosen for the bandpass of interest. A three year development effort for this detector technology has just been funded as part of the...

Simulations of charge summing and threshold dispersion effects in Medipix3

International Nuclear Information System (INIS)

Pennicard, D.; Ballabriga, R.; Llopart, X.; Campbell, M.; Graafsma, H.

2011-01-01

A novel feature of the Medipix3 photon-counting pixel readout chip is inter-pixel communication. By summing together the signals from neighbouring pixels at a series of 'summing nodes', and assigning each hit to the node with the highest signal, the chip can compensate for charge-sharing effects. However, previous experimental tests have demonstrated that the node-to-node variation in the detector's response is very large. Using computer simulations, it is shown that this variation is due to threshold dispersion, which results in many hits being assigned to whichever summing node in the vicinity has the lowest threshold level. A reduction in threshold variation would attenuate but not solve this issue. A new charge summing and hit assignment process is proposed, where the signals in individual pixels are used to determine the hit location, and then signals from neighbouring pixels are summed to determine whether the total photon energy is above threshold. In simulation, this new mode accurately assigns each hit to the pixel with the highest pulse height without any losses or double counting. - Research highlights: → Medipix3 readout chip compensates charge sharing using inter-pixel communication. → In initial production run, the flat-field response is unexpectedly nonuniform. → This effect is reproduced in simulation, and is caused by threshold dispersion. → A new inter-pixel communication process is proposed. → Simulations demonstrate the new process should give much better uniformity.

Asic developments for radiation imaging applications: The medipix and timepix family

Science.gov (United States)

Ballabriga, Rafael; Campbell, Michael; Llopart, Xavier

2018-01-01

Hybrid pixel detectors were developed to meet the requirements for tracking in the inner layers at the LHC experiments. With low input capacitance per channel (10-100 fF) it is relatively straightforward to design pulse processing readout electronics with input referred noise of ∼ 100 e-rms and pulse shaping times consistent with tagging of events to a single LHC bunch crossing providing clean 'images' of the ionising tracks generated. In the Medipix Collaborations the same concept has been adapted to provide practically noise hit free imaging in a wide range of applications. This paper reports on the development of three generations of readout ASICs. Two distinctive streams of development can be identified: the Medipix ASICs which integrate data from multiple hits on a pixel and provide the images in the form of frames and the Timepix ASICs who aim to send as much information about individual interactions as possible off-chip for further processing. One outstanding circumstance in the use of these devices has been their numerous successful applications, thanks to a large and active community of developers and users. That process has even permitted new developments for detectors for High Energy Physics. This paper reviews the ASICs themselves and details some of the many applications.

X-CSIT: a toolkit for simulating 2D pixel detectors

Science.gov (United States)

Joy, A.; Wing, M.; Hauf, S.; Kuster, M.; Rüter, T.

2015-04-01

A new, modular toolkit for creating simulations of 2D X-ray pixel detectors, X-CSIT (X-ray Camera SImulation Toolkit), is being developed. The toolkit uses three sequential simulations of detector processes which model photon interactions, electron charge cloud spreading with a high charge density plasma model and common electronic components used in detector readout. In addition, because of the wide variety in pixel detector design, X-CSIT has been designed as a modular platform so that existing functions can be modified or additional functionality added if the specific design of a detector demands it. X-CSIT will be used to create simulations of the detectors at the European XFEL, including three bespoke 2D detectors: the Adaptive Gain Integrating Pixel Detector (AGIPD), Large Pixel Detector (LPD) and DePFET Sensor with Signal Compression (DSSC). These simulations will be used by the detector group at the European XFEL for detector characterisation and calibration. For this purpose, X-CSIT has been integrated into the European XFEL's software framework, Karabo. This will further make it available to users to aid with the planning of experiments and analysis of data. In addition, X-CSIT will be released as a standalone, open source version for other users, collaborations and groups intending to create simulations of their own detectors.

Development of a Schottky CdTe Medipix3RX hybrid photon counting detector with spatial and energy resolving capabilities

Energy Technology Data Exchange (ETDEWEB)

Gimenez, E.N., E-mail: Eva.Gimenez@diamond.ac.uk [Diamond Light Source, Harwell Campus, Oxforshire OX11 0DE (United Kingdom); Astromskas, V. [University of Surrey (United Kingdom); Horswell, I.; Omar, D.; Spiers, J.; Tartoni, N. [Diamond Light Source, Harwell Campus, Oxforshire OX11 0DE (United Kingdom)

2016-07-11

A multichip CdTe-Medipix3RX detector system was developed in order to bring the advantages of photon-counting detectors to applications in the hard X-ray range of energies. The detector head consisted of 2×2 Medipix3RX ASICs bump-bonded to a 28 mm×28 mm e{sup −} collection Schottky contact CdTe sensor. Schottky CdTe sensors undergo performance degrading polarization which increases with temperature, flux and the longer the HV is applied. Keeping the temperature stable and periodically refreshing the high voltage bias supply was used to minimize the polarization and achieve a stable and reproducible detector response. This leads to good quality images and successful results on the energy resolving capabilities of the system. - Highlights: • A high atomic number (CdTe sensor based) photon-counting detector was developed. • Polarization effects affected the image were minimized by regularly refreshing the bias voltage and stabilizing the temperature. • Good spatial resolution and image quality was achieved following this procedure.

Imaging properties of small-pixel spectroscopic x-ray detectors based on cadmium telluride sensors

International Nuclear Information System (INIS)

Koenig, Thomas; Schulze, Julia; Zuber, Marcus; Rink, Kristian; Oelfke, Uwe; Butzer, Jochen; Hamann, Elias; Cecilia, Angelica; Zwerger, Andreas; Fauler, Alex; Fiederle, Michael

2012-01-01

Spectroscopic x-ray imaging by means of photon counting detectors has received growing interest during the past years. Critical to the image quality of such devices is their pixel pitch and the sensor material employed. This paper describes the imaging properties of Medipix2 MXR multi-chip assemblies bump bonded to 1 mm thick CdTe sensors. Two systems were investigated with pixel pitches of 110 and 165 μm, which are in the order of the mean free path lengths of the characteristic x-rays produced in their sensors. Peak widths were found to be almost constant across the energy range of 10 to 60 keV, with values of 2.3 and 2.2 keV (FWHM) for the two pixel pitches. The average number of pixels responding to a single incoming photon are about 1.85 and 1.45 at 60 keV, amounting to detective quantum efficiencies of 0.77 and 0.84 at a spatial frequency of zero. Energy selective CT acquisitions are presented, and the two pixel pitches' abilities to discriminate between iodine and gadolinium contrast agents are examined. It is shown that the choice of the pixel pitch translates into a minimum contrast agent concentration for which material discrimination is still possible. We finally investigate saturation effects at high x-ray fluxes and conclude with the finding that higher maximum count rates come at the cost of a reduced energy resolution. (paper)

The Upgraded Pixel Detector of the ATLAS Experiment for Run-2

CERN Document Server

Ferrere, Didier; The ATLAS collaboration

2016-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

Modelling and simulation of pixelated photon counting X-ray detectors for imaging; Modellierung und Simulation physikalischer Eigenschaften photonenzaehlender Roentgenpixeldetektoren fuer die Bildgebung

Energy Technology Data Exchange (ETDEWEB)

Durst, Juergen

2008-07-22

detail for Silicon and CdTe as sensor materials. For CdTe these results are shown beside the energy response spectrum for an ideal energy deposition detector, the ideal response of a Medipix2 detector and for the charge summing mode of the Medipix3 detector. (orig.)

Equalization method for Medipix3RX

Energy Technology Data Exchange (ETDEWEB)

Rinkel, Jean, E-mail: jean.rinkel@lnls.br [Brazilian Synchrotron Light Laboratory (LNLS/CNPEM), Rua Giuseppe Máximo Scolfaro, 10.000, Caixa Postal 6192, 13083-970 Campinas, SP (Brazil); Magalhães, Debora; Wagner, Franz [Brazilian Synchrotron Light Laboratory (LNLS/CNPEM), Rua Giuseppe Máximo Scolfaro, 10.000, Caixa Postal 6192, 13083-970 Campinas, SP (Brazil); Frojdh, Erik; Ballabriga Sune, Rafael [CERN, Route de Meyrin 385, Geneva (Switzerland)

2015-11-21

This paper describes a new method of threshold equalization for X-ray detectors based on the Medipix3RX ASIC, using electrical pulses to calibrate and correct for the threshold dispersion between pixels. This method involves a coarse threshold tuning, based on two 8 bits global DACs and which sets the range of variation of the threshold values; and a fine-tuning, based on two 5-bits adjustment DACs per pixel. As our fine-tuning approach is based on a state-of-the-art methodology, our coarse tuning relies on an original theoretical model. This model takes into account the noise level of the ASIC, which varies with temperature and received radiation dose. The experimental results using 300 μm Si sensor and Kα fluorescence of Zn show a global energy resolution improvement of 14% compared to previous equalization methods. We compared these results with the best achievable global energy resolution given by the resolution of individual pixels and concluded that the remaining 14% difference was due to the discretization error limited by the number of equalization bits.

Equalization method for Medipix3RX

CERN Document Server

Rinkel, Jean; Wagner, Franz; Frojdh, Erik; Ballabriga Sune, Rafael

2015-01-01

This paper describes a new method of threshold equalization for X-ray detectors based on the Medipix3RX ASIC, using electrical pulses to calibrate and correct for the threshold dispersion between pixels. This method involves a coarse threshold tuning, based on two 8 bits global DACs and which sets the range of variation of the threshold values; and a fine-tuning, based on two 5-bits adjustment DACs per pixel. As our fine-tuning approach is based on a state-of-the-art methodology, our coarse tuning relies on an original theoretical model. This model takes into account the noise level of the ASIC, which varies with temperature and received radiation dose. The experimental results using 300 μm Si sensor and Kα fluorescence of Zn show a global energy resolution improvement of 14% compared to previous equalization methods. We compared these results with the best achievable global energy resolution given by the resolution of individual pixels and concluded that the remaining 14% difference was due to the discreti...

The color of X-rays Spectral X-ray computed tomography using energy sensitive pixel detectors

CERN Document Server

Schioppa, Enrico Junior

Energy sensitive X-ray imaging detectors are produced by connecting a semiconductor sensor to a spectroscopic pixel readout chip. In this thesis, the applicability of such detectors to X-ray Computed Tomography (CT) is studied. A prototype Medipix based silicon detector is calibrated using X-ray fluorescence. The charge transport properties of the sensor are characterized using a high energy beam of charged particles at the Super Proton Synchrotron (SPS) at the European Center for Nuclear Research (CERN). Monochromatic X-rays at the European Synchrotron Radiation Facility (ESRF) are used to determined the energy response function. These data are used to implement a physics-based CT projection operator that accounts for the transmission of the source spectrum through the sample and detector effects. Based on this projection operator, an iterative spectral CT reconstruction algorithm is developed by extending an Ordered Subset Expectation Maximization (OSEM) method. Subsequently, a maximum likelihood based algo...

Overview of the CMS Pixel Detector

CERN Document Server

Cerati, Giuseppe B

2008-01-01

The Compact Muon Solenoid Experiment (CMS) will start taking data at the Large Hadron Collider (LHC) in 2009. It will investigate the proton-proton collisions at $14~TeV$. A robust tracking combined with a precise vertex reconstruction is crucial to address the physics challenge of proton collisions at this energy. To this extent an all-silicon tracking system with very fine granularity has been built and now is in the final commissioning phase. It represents the largest silicon tracking detector ever built. The system is composed by an outer part, made of micro-strip detectors, and an inner one, made of pixel detectors. The pixel detector consists of three pixel barrel layers and two forward disks at each side of the interaction region. Each pixel sensor, both for the barrel and forward detectors, has $100 \\times 150$ $\\mu m^2$ cells for a total of 66 million pixels covering a total area of about $1~m^2$. The pixel detector will play a crucial role in the pattern recognition and the track reconstruction both...

Spatial Resolution of the Medipix-2 as Neutron Pixel Detector

Czech Academy of Sciences Publication Activity Database

Jakůbek, J.; Holý, T.; Lehmann, E.; Pospíšil, S.; Uher, J.; Vacík, J.; Vavřík, Daniel

2005-01-01

Roč. 546, - (2005), s. 164-169 ISSN 0168-9002. [International Workshop on Radiation Imaging Detectors /6./. Glasgow, Scotland, 25.07.2004-29.07.2004] Institutional research plan: CEZ:AV0Z20710524 Keywords : neutron detection * neutronography * X-ray Subject RIV: JB - Sensors, Measurment, Regulation Impact factor: 1.224, year: 2005

Operational Experience with the ATLAS Pixel Detector

CERN Document Server

Djama, Fares; The ATLAS collaboration

2017-01-01

Run 2 of the LHC collider sets new challenges to track and vertex reconstruction because of its higher energy, pileup and luminosity. The ATLAS tracking performance relies critically on the Pixel Detector. Therefore, in view of Run 2, the ATLAS collaboration has constructed the first 4-layer pixel detector in Particle Physics by installing a new pixel layer, called Insertable B-Layer (IBL). Operational experience and performance of the 4-layer Pixel Detector during Run 2 are presented.

iPadPix—A novel educational tool to visualise radioactivity measured by a hybrid pixel detector

International Nuclear Information System (INIS)

Keller, O.; Schmeling, S.; Müller, A.; Benoit, M.

2016-01-01

With the ability to attribute signatures of ionising radiation to certain particle types, pixel detectors offer a unique advantage over the traditional use of Geiger-Müller tubes also in educational settings. We demonstrate in this work how a Timepix readout chip combined with a standard 300μm pixelated silicon sensor can be used to visualise radioactivity in real-time and by means of augmented reality. The chip family is the result of technology transfer from High Energy Physics at CERN and facilitated by the Medipix Collaboration. This article summarises the development of a prototype based on an iPad mini and open source software detailed in ref. [1]. Appropriate experimental activities that explore natural radioactivity and everyday objects are given to demonstrate the use of this new tool in educational settings.

iPadPix—A novel educational tool to visualise radioactivity measured by a hybrid pixel detector

CERN Document Server

Keller, O; Müller, A; Benoit, M

2016-01-01

With the ability to attribute signatures of ionising radiation to certain particle types, pixel detectors offer a unique advantage over the traditional use of Geiger-Müller tubes also in educational settings. We demonstrate in this work how a Timepix readout chip combined with a standard 300 μ m pixelated silicon sensor can be used to visualise radioactivity in real-time and by means of augmented reality. The chip family is the result of technology transfer from High Energy Physics at CERN and facilitated by the Medipix Collaboration. This article summarises the development of a prototype based on an iPad mini and open source software detailed in ref. [1]. Appropriate experimental activities that explore natural radioactivity and everyday objects are given to demonstrate the use of this new tool in educational settings.

The pin pixel detector--neutron imaging

CERN Document Server

Bateman, J E; Derbyshire, G E; Duxbury, D M; Marsh, A S; Rhodes, N J; Schooneveld, E M; Simmons, J E; Stephenson, R

2002-01-01

The development and testing of a neutron gas pixel detector intended for application in neutron diffraction studies is reported. Using standard electrical connector pins as point anodes, the detector is based on a commercial 100 pin connector block. A prototype detector of aperture 25.4 mmx25.4 mm has been fabricated, giving a pixel size of 2.54 mm which matches well to the spatial resolution typically required in a neutron diffractometer. A 2-Dimensional resistive divide readout system has been adapted to permit the imaging properties of the detector to be explored in advance of true pixel readout electronics. The timing properties of the device match well to the requirements of the ISIS-pulsed neutron source.

Imaging properties of the Medipix2 system exploiting single and dual energy thresholds

CERN Document Server

Tlustos, Lukas; Campbell, Michael; Heijne, Erik H M; Kincade, Karla Lorraine; Llopart-Cudie, Xavier; Stejskal, Pavel

2006-01-01

Low noise, high resolution and high dose efficiency are the common requirements for most X-ray imaging applications. Especially in medical applications the dose efficiency is a necessity for detector systems. We present the imaging performance of the Medipix2 readout chip bump bonded to a 300 mu m thick Si detector as a function of the detection threshold, a free parameter not available in conventional integrating imaging systems. Spatial resolution has been measured using the modulation transfer function (MTF) and it varies between 8.2 Ip/mm and 11.0 Ip/mm at 70%. An associated measurement of noise power spectrum (NPS) permits us to derive the detective quantum efficiency (DQE) which can be as a high as 25.5 % for a broadband incoming spectrum. The influence of charge diffusion in the sensor together with threshold variation in the readout chip is discussed. Although the Medipix2 system is used in photon counting mode with a single threshold in energy, the system is also capable of counting within a given en...

Gas pixel detectors

International Nuclear Information System (INIS)

Bellazzini, R.; Baldini, L.; Brez, A.; Cavalca, F.; Latronico, L.; Massai, M.M.; Minuti, M.; Omodei, N.; Pesce-Rollins, M.; Sgro, C.; Spandre, G.; Costa, E.; Soffitta, P.

2007-01-01

With the Gas Pixel Detector (GPD), the class of micro-pattern gas detectors has reached a complete integration between the gas amplification structure and the read-out electronics. To obtain this goal, three generations of application-specific integrated circuit of increased complexity and improved functionality has been designed and fabricated in deep sub-micron CMOS technology. This implementation has allowed manufacturing a monolithic device, which realizes, at the same time, the pixelized charge-collecting electrode and the amplifying, shaping and charge measuring front-end electronics of a GPD. A big step forward in terms of size and performances has been obtained in the last version of the 0.18 μm CMOS analog chip, where over a large active area of 15x15 mm 2 a very high channel density (470 pixels/mm 2 ) has been reached. On the top metal layer of the chip, 105,600 hexagonal pixels at 50 μm pitch have been patterned. The chip has customable self-trigger capability and includes a signal pre-processing function for the automatic localization of the event coordinates. In this way, by limiting the output signal to only those pixels belonging to the region of interest, it is possible to reduce significantly the read-out time and data volume. In-depth tests performed on a GPD built up by coupling this device to a fine pitch (50 μm) gas electron multiplier are reported. Matching of the gas amplification and read-out pitch has let to obtain optimal results. A possible application of this detector for X-ray polarimetry of astronomical sources is discussed

The Layer 1 / Layer 2 readout upgrade for the ATLAS Pixel Detector

CERN Document Server

Mullier, Geoffrey; The ATLAS collaboration

2016-01-01

The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC). The increase of instantaneous luminosity foreseen during the LHC Run 2, will lead to an increased detector occupancy that is expected to saturate the readout links of the outermost layers of the pixel detector: Layers 1 and 2. To ensure a smooth data taking under such conditions, the read out system of the recently installed fourth innermost pixel layer, the Insertable B-Layer, was modified to accomodate the needs of the older detector. The Layer 2 upgrade installation took place during the 2015 winter shutdown, with the Layer 1 installation scheduled for 2016. A report of the successful installation, together with the design of novel dedicated optical to electrical converters and the software and firmware updates will be presented.

CMS Pixel Detector Upgrade

CERN Document Server

INSPIRE-00038772

2011-01-01

The present Compact Muon Solenoid silicon pixel tracking system has been designed for a peak luminosity of 1034cm-2s-1 and total dose corresponding to two years of the Large Hadron Collider (LHC) operation. With the steady increase of the luminosity expected at the LHC, a new pixel detector with four barrel layers and three endcap disks is being designed. We will present the key points of the design: the new geometry, which minimizes the material budget and increases the tracking points, and the development of a fast digital readout architecture, which ensures readout efficiency even at high rate. The expected performances for tracking and vertexing of the new pixel detector are also addressed.

ATLAS Pixel Detector Operational Experience

CERN Document Server

Di Girolamo, B; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.9% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

A silicon pixel detector prototype for the CLIC vertex detector

CERN Multimedia

AUTHOR|(INSPIRE)INSPIRE-00714258

2017-01-01

A silicon pixel detector prototype for CLIC, currently under study for the innermost detector surrounding the collision point. The detector is made of a High-Voltage CMOS sensor (top) and a CLICpix2 readout chip (bottom) that are glued to each other. Both parts have a size of 3.3 x 4.0 $mm^2$ and consist of an array of 128 x 128 pixels of 25 x 25 $\\micro m^2$ size.

CMS Barrel Pixel Detector Overview

CERN Document Server

Kästli, H C; Erdmann, W; Gabathuler, K; Hörmann, C; Horisberger, Roland Paul; König, S; Kotlinski, D; Meier, B; Robmann, P; Rohe, T; Streuli, S

2007-01-01

The pixel detector is the innermost tracking device of the CMS experiment at the LHC. It is built from two independent sub devices, the pixel barrel and the end disks. The barrel consists of three concentric layers around the beam pipe with mean radii of 4.4, 7.3 and 10.2 cm. There are two end disks on each side of the interaction point at 34.5 cm and 46.5 cm. This article gives an overview of the pixel barrel detector, its mechanical support structure, electronics components, services and its expected performance.

Operational Experience with the ATLAS Pixel Detector

CERN Document Server

Djama, Fares; The ATLAS collaboration

2017-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction imposed by the higher collision energy, pileup and luminosity that are being delivered. The ATLAS tracking performance relies critically on the Pixel Detector, therefore, in view of Run-2 of LHC, the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and an additional optical link per module was added to overcome in some layers the readout bandwidth limitation when LHC will exceed the nominal peak luminosity by almost a factor of 3. The key features and challenges met during the IBL project will be presented, as well as its operational experience and Pixel Detector performance in LHC.

Operational experience with the ATLAS Pixel Detector

CERN Document Server

Ince, T; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost element of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Diamond Pixel Detectors

International Nuclear Information System (INIS)

Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D'Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L.; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M.

2001-01-01

Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles

Diamond Pixel Detectors

Energy Technology Data Exchange (ETDEWEB)

Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D' Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L. E-mail: perera@physics.rutgers.edu; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M

2001-06-01

Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles.

A low mass pixel detector upgrade for CMS

CERN Document Server

Kästli, H C

2010-01-01

The CMS pixel detector has been designed for a peak luminosity of 10^34cm-2s-1 and a total dose corresponding to 2 years of LHC operation at a radius of 4 cm from the interaction region. Parts of the pixel detector will have to be replaced until 2015. The detector performance will be degraded for two reasons: radiation damage of the innermost layers and the planned increase of the LHC peak luminosity by a factor of 2-3. Based on the experience in planning, constructing and commissioning of the present pixel detector, we intend to upgrade the whole pixel detector in 2015. The main focus is on lowering the material budget and adding more tracking points. We will present the design of a new low mass pixel system consisting of 4 barrel layers and 3 end cap disks on each side. The design comprises of thin detector modules and a lightweight mechanical support structure using CO2 cooling. In addition, large efforts have been made to move material from the services out of the tracking region.

The Upgraded Pixel Detector of the ATLAS Experiment for Run-2 at the LHC

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00084948; The ATLAS collaboration

2016-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130 nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented using collision data.

Time-resolved and position-resolved X-ray spectrometry with a pixelated detector

Energy Technology Data Exchange (ETDEWEB)

Sievers, Peter

2012-12-07

The aim of the work presented here was to measure X-ray spectra with a pixelated detector. Due to effects in the sensor the spectrum cannot be measured directly and has to be calculated by a deconvolution of the measured data. In the scope of this work the deconvolution of the measured spectra could be enhanced considerably by - amongst other things - the introduction of the Bayesian deconvolution method. Those improvements opened the possibilities for further measurements. For the measurements the detectors of the Medipix family have been used. They are nowadays used for a wide range of applications and scientific research. Their main advantage is the very high position resolution gained by a pixel pitch of 55 μm and a high number of 65536 pixels. The Timepix detector has, in particular, two special possibilities of measurement: the ToA mode and the ToT mode. In ToA mode the arrival time of an impinging photon is measured and in ToT mode the amount of deposited charge is measured. The most common method of operation is counting the number of impinging photons that release a charge higher than a preset threshold in each pixel. As this released charge is proportional to the energy deposition of the impinging photon, one can perform energy-sensitive measurements. To perform the deconvolution of the measured energy distribution there is a need of an energy response matrix describing the detector response on radiation. For some detectors it is possible to obtain an analytic model of the response functions. Due to the high discrepancy between the impinging spectrum and the measured spectrum in case of detectors of the Medipix family, there is so far no analytic model. Thus, the detector response has to be simulated. As I could improve the precision of the measurement quite extensively, I also intended to tune the simulation with more accurate and appropriate models to gain the same level of accuracy. The results of measurement and simulation have then been compared and

Time-resolved and position-resolved X-ray spectrometry with a pixelated detector

International Nuclear Information System (INIS)

Sievers, Peter

2012-01-01

The aim of the work presented here was to measure X-ray spectra with a pixelated detector. Due to effects in the sensor the spectrum cannot be measured directly and has to be calculated by a deconvolution of the measured data. In the scope of this work the deconvolution of the measured spectra could be enhanced considerably by - amongst other things - the introduction of the Bayesian deconvolution method. Those improvements opened the possibilities for further measurements. For the measurements the detectors of the Medipix family have been used. They are nowadays used for a wide range of applications and scientific research. Their main advantage is the very high position resolution gained by a pixel pitch of 55 μm and a high number of 65536 pixels. The Timepix detector has, in particular, two special possibilities of measurement: the ToA mode and the ToT mode. In ToA mode the arrival time of an impinging photon is measured and in ToT mode the amount of deposited charge is measured. The most common method of operation is counting the number of impinging photons that release a charge higher than a preset threshold in each pixel. As this released charge is proportional to the energy deposition of the impinging photon, one can perform energy-sensitive measurements. To perform the deconvolution of the measured energy distribution there is a need of an energy response matrix describing the detector response on radiation. For some detectors it is possible to obtain an analytic model of the response functions. Due to the high discrepancy between the impinging spectrum and the measured spectrum in case of detectors of the Medipix family, there is so far no analytic model. Thus, the detector response has to be simulated. As I could improve the precision of the measurement quite extensively, I also intended to tune the simulation with more accurate and appropriate models to gain the same level of accuracy. The results of measurement and simulation have then been compared and

Iterative local Chi2 alignment algorithm for the ATLAS Pixel detector

CERN Document Server

Göttfert, Tobias

The existing local chi2 alignment approach for the ATLAS SCT detector was extended to the alignment of the ATLAS Pixel detector. This approach is linear, aligns modules separately, and uses distance of closest approach residuals and iterations. The derivation and underlying concepts of the approach are presented. To show the feasibility of the approach for Pixel modules, a simplified, stand-alone track simulation, together with the alignment algorithm, was developed with the ROOT analysis software package. The Pixel alignment software was integrated into Athena, the ATLAS software framework. First results and the achievable accuracy for this approach with a simulated dataset are presented.

Operational Experience with the ATLAS Pixel Detector

CERN Document Server

Lantzsch, Kerstin; The ATLAS collaboration

2016-01-01

Run 2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). In addition the Pixel detector was refurbished with new service quarter panels to recover about 3% of defective modules lost during run 1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning, operation and performance of the 4-layer Pixel Detector will be presented.

A Medipix quantum area detector allows rotation electron diffraction data collection from submicrometre three-dimensional protein crystals

International Nuclear Information System (INIS)

Nederlof, Igor; Genderen, Eric van; Li, Yao-Wang; Abrahams, Jan Pieter

2013-01-01

An ultrasensitive Medipix2 detector allowed the collection of rotation electron-diffraction data from single three-dimensional protein nanocrystals for the first time. The data could be analysed using the standard X-ray crystallography programs MOSFLM and SCALA. When protein crystals are submicrometre-sized, X-ray radiation damage precludes conventional diffraction data collection. For crystals that are of the order of 100 nm in size, at best only single-shot diffraction patterns can be collected and rotation data collection has not been possible, irrespective of the diffraction technique used. Here, it is shown that at a very low electron dose (at most 0.1 e − Å −2 ), a Medipix2 quantum area detector is sufficiently sensitive to allow the collection of a 30-frame rotation series of 200 keV electron-diffraction data from a single ∼100 nm thick protein crystal. A highly parallel 200 keV electron beam (λ = 0.025 Å) allowed observation of the curvature of the Ewald sphere at low resolution, indicating a combined mosaic spread/beam divergence of at most 0.4°. This result shows that volumes of crystal with low mosaicity can be pinpointed in electron diffraction. It is also shown that strategies and data-analysis software (MOSFLM and SCALA) from X-ray protein crystallography can be used in principle for analysing electron-diffraction data from three-dimensional nanocrystals of proteins

Integration of the CMS Phase 1 Pixel Detector

CERN Document Server

Kornmayer, Andreas

2018-01-01

During the extended year-end technical stop 2016/17 the CMS Pixel Detector has been replaced. The new Phase 1 Pixel Detector is designed for a luminosity that could exceed $\\text{L} = 2x10^{34} cm^{−2}s^{−1}$. With one additional layer in the barrel and the forward region of the new detector, combined with the higher hit rates as the LHC luminosity increases, these conditions called for an upgrade of the data acquisition system, which was realised based on the $\\mu$TCA standard. This contribution focuses on the experiences with integration of the new detector readout and control system and reports on the operational performance of the CMS Pixel detector.

Pixel detector readout chip

CERN Multimedia

1991-01-01

Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

The ATLAS Pixel Detector

CERN Document Server

Huegging, Fabian

2006-06-26

The contruction of the ATLAS Pixel Detector which is the innermost layer of the ATLAS tracking system is prgressing well. Because the pixel detector will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the detector near the interaction point requires excellent radiation hardness, mechanical and thermal robustness, good long-term stability for all parts, combined with a low material budget. The final detector layout, new results from production modules and the status of assembly are presented.

ATLAS ITk Pixel detector

CERN Document Server

Gemme, Claudia; The ATLAS collaboration

2016-01-01

The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenge to the ATLAS tracker. The current inner detector will be replaced with a whole silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation level are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the HL-LHC ATLA Pixel detector developments as well as the various layout options will be reviewed.

Pixelated CdZnTe drift detectors

DEFF Research Database (Denmark)

Kuvvetli, Irfan; Budtz-Jørgensen, Carl

2005-01-01

A technique, the so-called Drift Strip Method (DSM), for improving the CdZnTe detector energy response to hard X-rays and gamma-rays was applied as a pixel geometry. First tests have confirmed that this detector type provides excellent energy resolution and imaging performance. We specifically...... report on the performance of 3 mm thick prototype CZT drift pixel detectors fabricated using material from eV-products. We discuss issues associated with detector module performance. Characterization results obtained from several prototype drift pixel detectors are presented. Results of position...

Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

Energy Technology Data Exchange (ETDEWEB)

Thil, Ch., E-mail: christophe.thil@ziti.uni-heidelberg.d [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Baron, A.Q.R. [RIKEN SPring-8 Center, 1-1-1 Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5148 (Japan); Fajardo, P. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France); Fischer, P. [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Graafsma, H. [DESY, Notkestrasse 85, 22607 Hamburg (Germany); Rueffer, R. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France)

2011-02-01

The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm{sup 2} active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280{mu}mx280{mu}m size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

International Nuclear Information System (INIS)

Thil, Ch.; Baron, A.Q.R.; Fajardo, P.; Fischer, P.; Graafsma, H.; Rueffer, R.

2011-01-01

The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm 2 active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280μmx280μm size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

International Nuclear Information System (INIS)

Mathes, Markus

2008-12-01

Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10 16 particles per cm 2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 μm 2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm 2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm 2 ). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

Performance of the CMS Phase 1 Pixel Detector

CERN Document Server

Akgun, Bora

2018-01-01

It is anticipated that the LHC accelerator will reach and exceed the luminosity of L = 2$\\times$10$^{34}$cm$^{-2}$s$^{-1}$ during the LHC Run 2 period until 2023. At this higher luminosity and increased hit occupancies the CMS phase-0 pixel detector would have been subjected to severe dead time and inefficiencies introduced by limited buffers in the analog read-out chip and effects of radiation damage in the sensors. Therefore a new pixel detector has been built and replaced the phase-0 detector in the 2016/17 LHC extended year-end technical stop. The CMS phase-1 pixel detector features four central barrel layers and three end-cap disks in forward and backward direction for robust tracking performance, and a significantly reduced overall material budget including new cooling and powering schemes. The design of the new front-end readout chip comprises larger data buffers, an increased transmission bandwidth, and low-threshold comparators. These improvements allow the new pixel detector to sustain and improve t...

PixTrig: a Level 2 track finding algorithm based on pixel detector

CERN Document Server

Baratella, A; Morettini, P; Parodi, F

2000-01-01

This note describes an algorithm for track search at Level 2 based on pixel detector. Using three pixel clusters we can produce a reconstruction of the track parameter in both z and R-phi plane. These track segments can be used as seed for more sophisticated track finding algorithms or used directly, especially when impact parameter resolution is crucial. The algorithm efficiency is close to 90% for pt > 1 GeV/c and the processing time is small enough to allow a complete detector reconstruction (non RoI guided) within the Level 2 processing.

Diamond and silicon pixel detectors in high radiation environments

Energy Technology Data Exchange (ETDEWEB)

Tsung, Jieh-Wen

2012-10-15

Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10{sup 16} particles per cm{sup 2}, which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10{sup 15} particles per cm{sup 2}.

Diamond and silicon pixel detectors in high radiation environments

International Nuclear Information System (INIS)

Tsung, Jieh-Wen

2012-10-01

Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10 16 particles per cm 2 , which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10 15 particles per cm 2 .

The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

Energy Technology Data Exchange (ETDEWEB)

Backhaus, M., E-mail: malte.backhaus@cern.ch

2016-09-21

During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO{sub 2} based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

A Medipix quantum area detector allows rotation electron diffraction data collection from submicrometre three-dimensional protein crystals

Energy Technology Data Exchange (ETDEWEB)

Nederlof, Igor; Genderen, Eric van; Li, Yao-Wang; Abrahams, Jan Pieter, E-mail: abrahams@chem.leidenuniv.nl [Leiden University, Einsteinweg 55, 2333 CC Leiden (Netherlands)

2013-07-01

An ultrasensitive Medipix2 detector allowed the collection of rotation electron-diffraction data from single three-dimensional protein nanocrystals for the first time. The data could be analysed using the standard X-ray crystallography programs MOSFLM and SCALA. When protein crystals are submicrometre-sized, X-ray radiation damage precludes conventional diffraction data collection. For crystals that are of the order of 100 nm in size, at best only single-shot diffraction patterns can be collected and rotation data collection has not been possible, irrespective of the diffraction technique used. Here, it is shown that at a very low electron dose (at most 0.1 e{sup −} Å{sup −2}), a Medipix2 quantum area detector is sufficiently sensitive to allow the collection of a 30-frame rotation series of 200 keV electron-diffraction data from a single ∼100 nm thick protein crystal. A highly parallel 200 keV electron beam (λ = 0.025 Å) allowed observation of the curvature of the Ewald sphere at low resolution, indicating a combined mosaic spread/beam divergence of at most 0.4°. This result shows that volumes of crystal with low mosaicity can be pinpointed in electron diffraction. It is also shown that strategies and data-analysis software (MOSFLM and SCALA) from X-ray protein crystallography can be used in principle for analysing electron-diffraction data from three-dimensional nanocrystals of proteins.

The upgraded Pixel Detector of the ATLAS experiment for Run-2 at the Large Hadron Collider

CERN Document Server

Giordani, MarioPaolo; The ATLAS collaboration

2016-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

Energy Technology Data Exchange (ETDEWEB)

Mathes, Markus

2008-12-15

Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10{sup 16} particles per cm{sup 2} per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 {mu}m{sup 2} have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm{sup 2} and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm{sup 2}). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

LISe pixel detector for neutron imaging

Energy Technology Data Exchange (ETDEWEB)

Herrera, Elan; Hamm, Daniel [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Wiggins, Brenden [Technology Development, Y-12 National Security Complex, Oak Ridge, TN (United States); Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Milburn, Rob [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Burger, Arnold [Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Department of Life and Physical Sciences, Fisk University, Nashville, TN (United States); Bilheux, Hassina [Chemical and Engineering Materials Division, Oak Ridge National Laboratory, Oak Ridge, TN (United States); Santodonato, Louis [Instrument and Source Division, Oak Ridge National Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN (United States); Chvala, Ondrej [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Stowe, Ashley [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Technology Development, Y-12 National Security Complex, Oak Ridge, TN (United States); Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Lukosi, Eric, E-mail: elukosi@utk.edu [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States)

2016-10-11

Semiconducting lithium indium diselenide, {sup 6}LiInSe{sub 2} or LISe, has promising characteristics for neutron detection applications. The 95% isotopic enrichment of {sup 6}Li results in a highly efficient thermal neutron-sensitive material. In this study, we report on a proof-of-principle investigation of a semiconducting LISe pixel detector to demonstrate its potential as an efficient neutron imager. The LISe pixel detector had a 4×4 of pixels with a 550 µm pitch on a 5×5×0.56 mm{sup 3} LISe substrate. An experimentally verified spatial resolution of 300 µm was observed utilizing a super-sampling technique.

Operational experience of the ATLAS Pixel detector

CERN Document Server

Hirschbuehl, D; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience of the ATLAS Pixel Detector

CERN Document Server

Marcisovsky, M; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

The pin pixel detector--X-ray imaging

CERN Document Server

Bateman, J E; Derbyshire, G E; Duxbury, D M; Marsh, A S; Simmons, J E; Stephenson, R

2002-01-01

The development and testing of a soft X-ray gas pixel detector, which uses connector pins for the anodes is reported. Based on a commercial 100 pin connector block, a prototype detector of aperture 25.4 mm centre dot 25.4 mm can be economically fabricated. The individual pin anodes all show the expected characteristics of small gas detectors capable of counting rates reaching 1 MHz per pin. A 2-dimensional resistive divide readout system has been developed to permit the imaging properties of the detector to be explored in advance of true pixel readout electronics.

Development and Characterization of Diamond and 3D-Silicon Pixel Detectors with ATLAS-Pixel Readout Electronics

CERN Document Server

Mathes, Markus

2008-01-01

Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10^16 particles per cm^2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 × 50 um^2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm^2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 × 6 cm^2). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection ...

The ALICE Silicon Pixel Detector System (SPD)

CERN Document Server

Kluge, A; Antinori, Federico; Burns, M; Cali, I A; Campbell, M; Caselle, M; Ceresa, S; Dima, R; Elias, D; Fabris, D; Krivda, Marian; Librizzi, F; Manzari, Vito; Morel, M; Moretto, Sandra; Osmic, F; Pappalardo, G S; Pepato, Adriano; Pulvirenti, A; Riedler, P; Riggi, F; Santoro, R; Stefanini, G; Torcato De Matos, C; Turrisi, R; Tydesjo, H; Viesti, G; PH-EP

2007-01-01

The ALICE silicon pixel detector (SPD) comprises the two innermost layers of the ALICE inner tracker system. The SPD includes 120 detector modules (half-staves) each consisting of 10 ALICE pixel chips bump bonded to two silicon sensors and one multi-chip read-out module. Each pixel chip contains 8192 active cells, so that the total number of pixel cells in the SPD is ≈ 107. The on-detector read-out is based on a multi-chip-module containing 4 ASICs and an optical transceiver module. The constraints on material budget and detector module dimensions are very demanding.

Applying Statistical Mechanics to pixel detectors

International Nuclear Information System (INIS)

Pindo, Massimiliano

2002-01-01

Pixel detectors, being made of a large number of active cells of the same kind, can be considered as significant sets to which Statistical Mechanics variables and methods can be applied. By properly redefining well known statistical parameters in order to let them match the ones that actually characterize pixel detectors, an analysis of the way they work can be performed in a totally new perspective. A deeper understanding of pixel detectors is attained, helping in the evaluation and comparison of their intrinsic characteristics and performance

ATLAS Pixel Detector Design For HL-LHC

CERN Document Server

Smart, Ben; The ATLAS collaboration

2016-01-01

The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline. High-eta particles will therefore hit these sensors at shallow angles, leaving elongated charge clusters. The length of such a charge cluster can be used to estimate the angle of the passing particle. This information can then be used in track reconstruction to improve tracking efficiency and reduce fake rates. Inclined designs ...

Small Pixel Hybrid CMOS X-ray Detectors

Science.gov (United States)

Hull, Samuel; Bray, Evan; Burrows, David N.; Chattopadhyay, Tanmoy; Falcone, Abraham; Kern, Matthew; McQuaide, Maria; Wages, Mitchell

2018-01-01

Concepts for future space-based X-ray observatories call for a large effective area and high angular resolution instrument to enable precision X-ray astronomy at high redshift and low luminosity. Hybrid CMOS detectors are well suited for such high throughput instruments, and the Penn State X-ray detector lab, in collaboration with Teledyne Imaging Sensors, has recently developed new small pixel hybrid CMOS X-ray detectors. These prototype 128x128 pixel devices have 12.5 micron pixel pitch, 200 micron fully depleted depth, and include crosstalk eliminating CTIA amplifiers and in-pixel correlated double sampling (CDS) capability. We report on characteristics of these new detectors, including the best read noise ever measured for an X-ray hybrid CMOS detector, 5.67 e- (RMS).

New pixelized Micromegas detector for the COMPASS experiment

International Nuclear Information System (INIS)

Neyret, D; Anfreville, M; Bedfer, Y; Burtin, E; D'Hose, N; Giganon, A; Kunne, F; Magnon, A; Marchand, C; Paul, B; Platchkov, S; Vandenbroucke, M; Ketzer, B; Konorov, I

2009-01-01

New Micromegas (Micro-mesh gaseous detectors) are being developed in view of the future physics projects planned by the COMPASS collaboration at CERN. Several major upgrades compared to present detectors are being studied: detectors standing five times higher luminosity with hadron beams, detection of beam particles (flux up to a few hundred of kHz/mm 2 , 10 times larger than for the present detectors) with pixelized read-out in the central part, light and integrated electronics, and improved robustness. Studies were done with the present detectors moved in the beam, and two first pixelized prototypes are being tested with muon and hadron beams in real conditions at COMPASS. We present here this new project and report on two series of tests, with old detectors moved into the beam and with pixelized prototypes operated in real data taking condition with both muon and hadron beams.

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Lapoire, C; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as B-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification.

The ATLAS Pixel Detector operation and performance

CERN Document Server

Andreazza, A; The ATLAS collaboration

2010-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately $80 imes 10^6$~electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region. The complete Pixel Detector has been taking part in cosmic-ray data-taking since 2008. Since November 2009 it has been operated with LHC colliding beams at $sqrt{s}=900$~GeV, 2.36~TeV and 7 TeV. The detector operated with an active fraction of 97.2% at a threshold of 3500~$e$, showing a noise occupancy rate better than $10^{-9}$~hit/pixel/BC and a track association efficiency of 99%. The Lorentz angle for electrons in silicon is measured to be $ heta_mathrm{L}=12.11^circ pm 0.09^circ$ and its temperature dependence has been verified. The pulse height information from the time-over-threshold technique allows to improve the point resolution using charge sharing and to perform parti...

Spectroscopic Imaging Using Ge and CdTe Based Detector Systems for Hard X-ray Applications

Science.gov (United States)

Astromskas, Vytautas

Third generation synchrotron facilities such as the Diamond Light Source (DLS) have a wide range of experiments performed for a wide range of science fields. The DLS operates at energies up to 150 keV which introduces great challenges to radiation detector technology. This work focuses on the requirements that the detector technology faces for X-ray Absorption Fine Structure (XAFS) and powder diffraction experiments in I12 and I15 beam lines, respectively. A segmented HPGe demonstrator detector with in-built charge sensitive CUBE preamplifiers and a Schottky e- collection CdTe Medipix3RX detector systems were investigated to understand the underlying mechanisms that limit spectroscopic, imaging performances and stability and to find ways to overcome or minimise those limitations. The energy resolution and stability of the Ge demonstrator detector was found to have the required characteristics for XAFS measurements. Charge sharing was identified as a limiting factor to the resolution which is going to be addressed in the future development of a full detector system as well as reductions in electronic noise and cross-talk effects. The stability study of the Schottky CdTe Medipix3RX detector showed that polarization is highly dependent on temperature, irradiation duration and incoming flux. A new pixel behaviour called tri-phase (3-P) pixel was identified and a novel method for determining optimum operational conditions was developed. The use of the 3-P pixels as a criterion for depolarization resulted in a stable performance of the detector. Furthermore, the detector was applied in powder diffraction measurement at the I15 beam line and resulted in the detector diffraction pattern matching the simulated data. CdTe Medipix3RX and HEXITEC spectroscopic imaging detectors were applied in identification and discrimination of transitional metals for security application and K-edge subtraction for medical applications. The results showed that both detectors have potential

MediSPECT: Single photon emission computed tomography system for small field of view small animal imaging based on a CdTe hybrid pixel detector

International Nuclear Information System (INIS)

Accorsi, R.; Autiero, M.; Celentano, L.

2007-01-01

We describe MediSPECT, a new scanner developed at University and INFN Napoli, for SPECT studies on small animals with a small field of view (FOV) and high spatial resolution. The CdTe pixel detector (a 256x256 matrix of 55 μm square pixels) operating in single photon counting for detection of gamma-rays with low and medium energy (e.g. 125 I, 27-35 keV, 99m Tc, 140 keV), is bump bonded to the Medipix2 readout chip. The FOV of the MediSPECT scanner with a coded aperture mask collimator ranges from 6.3 mm (system spatial resolution 110 μm at 27-35 keV) to 24.3 mm. With a 0.30 mm pinhole the FOV ranges from 2.4 to 29 mm (where the system spatial resolution is 1.0 mm at 27-35 keV and 2.0 mm at 140 keV). MediSPECT will be used for in vivo imaging of small organs or tissue structures in mouse, e.g., brain, thyroid, heart or tumor

Charge sharing in silicon pixel detectors

CERN Document Server

Mathieson, K; Seller, P; Prydderch, M L; O'Shea, V; Bates, R L; Smith, K M; Rahman, M

2002-01-01

We used a pixellated hybrid silicon X-ray detector to study the effect of the sharing of generated charge between neighbouring pixels over a range of incident X-ray energies, 13-36 keV. The system is a room temperature, energy resolving detector with a Gaussian FWHM of 265 eV at 5.9 keV. Each pixel is 300 mu m square, 300 mu m deep and is bump bonded to matching read out electronics. The modelling packages MEDICI and MCNP were used to model the complete X-ray interaction and the subsequent charge transport. Using this software a model is developed which reproduces well the experimental results. The simulations are then altered to explore smaller pixel sizes and different X-ray energies. Charge sharing was observed experimentally to be 2% at 13 keV rising to 4.5% at 36 keV, for an energy threshold of 4 keV. The models predict that up to 50% of charge may be lost to the neighbouring pixels, for an X-ray energy of 36 keV, when the pixel size is reduced to 55 mu m.

Precision scans of the Pixel cell response of double sided 3D Pixel detectors to pion and X-ray beams

CERN Document Server

Mac Raighne, A; Crossley, M; Alianelli, L; Lozano, M; Dumps, R; Fleta, C; Collins, P; Rodrigues, E; Sawhney, K J S; Tlustos, L; Pennicard, D; Buytaert, J; Stewart, G; Parkes, C; Eklund, L; Campbell, M; Marchal, J; Akiba, K; Pellegrini, G; Llopart, X; Plackett, R; Maneuski, D; Gligorov, V V; Tartoni, N; Nicol, M; Bates, R; Gallas, A; Gimenez, E N; van Beuzekom, M; John, M

2011-01-01

Three-dimensional (3D) silicon sensors offer potential advantages over standard planar sensors for radiation hardness in future high energy physics experiments and reduced charge-sharing for X-ray applications, but may introduce inefficiencies due to the columnar electrodes. These inefficiencies are probed by studying variations in response across a unit pixel cell in a 55 m m pitch double-sided 3D pixel sensor bump bonded to TimePix and Medipix2 readout ASICs. Two complementary characterisation techniques are discussed: the first uses a custom built telescope and a 120GeV pion beam from the Super Proton Synchrotron (SPS) at CERN; the second employs a novel technique to illuminate the sensor with a micro-focused synchrotron X-ray beam at the Diamond Light Source, UK. For a pion beam incident perpendicular to the sensor plane an overall pixel efficiency of 93.0 +/- 0.5\\% is measured. After a 10 degrees rotation of the device the effect of the columnar region becomes negligible and the overall efficiency rises ...

How spectroscopic x-ray imaging benefits from inter-pixel communication

CERN Document Server

Koenig, Thomas; Hamann, Elias; Cecilia, Angelica; Ballabriga, Rafael; Campbell, Michael; Ruat, Marie; Tlustos, Lukas; Fauler, Alex; Fiederle, Michael; Baumbach, Tilo

2014-01-01

Spectroscopic x-ray imaging based on pixellated semiconductor detectors can be sensitive to charge sharing and K-fluorescence, depending on the sensor material used, its thickness and the pixel pitch employed. As a consequence, spectroscopic resolution is partially lost. In this paper, we study a new detector ASIC, the Medipix3RX, that offers a novel feature called charge summing, which is established by making adjacent pixels communicate with each other. Consequently, single photon interactions resulting in multiple hits are almost completely avoided. We investigate this charge summing mode with respect to those of its imaging properties that are of interest in medical physics and benchmark them against the case without charge summing. In particular, we review its influence on spectroscopic resolution and find that the low energy bias normally present when recording energy spectra is dramatically reduced. Furthermore, we show that charge summing provides a modulation transfer function which is almost indepen...

Pixel array detector for X-ray free electron laser experiments

Energy Technology Data Exchange (ETDEWEB)

Philipp, Hugh T., E-mail: htp2@cornell.edu [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Hromalik, Marianne [Electrical and Computer Engineering, SUNY Oswego, Oswego, NY 13126 (United States); Tate, Mark; Koerner, Lucas [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Gruner, Sol M. [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Wilson Laboratory, Cornell University, CHESS, Ithaca, NY 14853 (United States)

2011-09-01

X-ray free electron lasers (XFELs) promise to revolutionize X-ray science with extremely high peak brilliances and femtosecond X-ray pulses. This will require novel detectors to fully realize the potential of these new sources. There are many current detector development projects aimed at the many challenges of meeting the XFEL requirements . This paper describes a pixel array detector (PAD) that has been developed for the Coherent X-ray Imaging experiment at the Linac Coherent Light Source (LCLS) at the SLAC National Laboratory . The detector features 14-bit in-pixel digitization; a 2-level in-pixel gain setting that can be used to make an arbitrary 2-D gain pattern that is adaptable to a particular experiment; the ability to handle instantaneous X-ray flux rates of 10{sup 17} photons per second; and continuous frames rates in excess of 120 Hz. The detector uses direct detection of X-rays in a silicon diode. The charge produced by the diode is integrated in a pixilated application specific integrated circuit (ASIC) which digitizes collected holes with single X-ray photon capability. Each ASIC is 194x185 pixels, each pixel is 110{mu}mx110{mu}m on a side. Each pixel can detect up to 2500 X-rays per frame in low-gain mode, yet easily detects single photons at high-gain. Cooled, single-chip detectors have been built and meet all the required specifications. SLAC National Laboratory is engaged in constructing a tiled, multi-chip 1516x1516 pixel detector.

The upgraded Pixel detector and the commissioning of the Inner Detector tracking of the ATLAS experiment for Run-2 at the Large Hadron Collider

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00019188; The ATLAS collaboration

2016-01-01

Run-2 of the Large Hadron Collider (LHC) will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with the high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130~nm technology. In addition, the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during Run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. Complementing detector improvements, many improvements to Inner Detector track and vertex reconstr...

Sensor development for the CMS pixel detector

CERN Document Server

Bölla, G; Horisberger, R P; Kaufmann, R; Rohe, T; Roy, A

2002-01-01

The CMS experiment which is currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland) will contain a pixel detector which provides in its final configuration three space points per track close to the interaction point of the colliding beams. Because of the harsh radiation environment of the LHC, the technical realization of the pixel detector is extremely challenging. The readout chip as the most damageable part of the system is believed to survive a particle fluence of 6x10 sup 1 sup 4 n sub e sub q /cm sup 2 (All fluences are normalized to 1 MeV neutrons and therefore all components of the hybrid pixel detector have to perform well up to at least this fluence. As this requires a partially depleted operation of the silicon sensors after irradiation-induced type inversion of the substrate, an ''n in n'' concept has been chosen. In order to perform IV-tests on wafer level and to hold accidentally unconnected pixels close to ground potential, a resistive path between the pixe...

Status and future of the ATLAS Pixel Detector at the LHC

International Nuclear Information System (INIS)

Rozanov, Alexandre

2013-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of disks in each forward end-cap. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-on-n silicon substrates. Intensive calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. The record breaking instantaneous luminosities of 7.7×10 33 cm −2 s −1 recently surpassed at the LHC generated a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulated, the first effects of radiation damage became observable in the silicon sensors as an increase in the silicon leakage current and the change of the voltage required to fully deplete the sensor. A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014) together with the replacement of pixel services. A letter of intent was submitted for a completely new Pixel Detector after 2023, capable to take data with extremely high leveled luminosities of 5×10 34 cm −2 s −1 at the high luminosity LHC. -- Highlights: •The ATLAS Pixel Detector provides hermetic coverage with three layers with 80 million pixels. •Calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. •First effects of radiation damage became observable in the silicon sensors. •A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014). •Replacement of pixel services in 2013–2014. •A letter of intent was submitted for new Pixel Detector after 2023 for high luminosity LHC

X-ray inspection of composite materials for aircraft structures using detectors of Medipix type

International Nuclear Information System (INIS)

Jandejsek, I; Jakubek, J; Jakubek, M; Krejci, F; Soukup, P; Turecek, D; Vavrik, D; Zemlicka, J; Prucha, P

2014-01-01

This work presents an overview of promising X-ray imaging techniques employed for non-destructive defectoscopy inspections of composite materials intended for the Aircraft industry. The major emphasis is placed on non-tomographic imaging techniques which do not require demanding spatial and time measurement conditions. Imaging methods for defects visualisation, delamination detection and porosity measurement of various composite materials such as carbon fibre reinforced polymers and honeycomb sendwiches are proposed. We make use of the new large area WidePix X-ray imaging camera assembled from up to 100 edgeless Medipix type detectors which is highly suitable for this type of measurements

3D silicon pixel detectors for the High-Luminosity LHC

CERN Document Server

Lange, J.

2016-01-01

3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation.

A GaAs pixel detectors-based digital mammographic system: Performances and imaging tests results

International Nuclear Information System (INIS)

Annovazzi, A.; Amendolia, S.R.; Bigongiari, A.; Bisogni, M.G.; Catarsi, F.; Cesqui, F.; Cetronio, A.; Colombo, F.; Delogu, P.; Fantacci, M.E.; Gilberti, A.; Lanzieri, C.; Lavagna, S.; Novelli, M.; Passuello, G.; Paternoster, G.; Pieracci, M.; Poletti, M.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Testa, A.; Venturelli, L.

2007-01-01

The prototype presented in this paper is based on GaAs pixel detectors read-out by the PCC/MEDIPIX I circuit. The active area of a sensor is about 1 cm 2 therefore to cover the typical irradiation field used in mammography (18x24 cm 2 ), 18 GaAs detection units have been organized in two staggered rows of nine chips each and moved by a stepper motor in the orthogonal direction. The system is integrated in a mammographic equipment which comprehends the X-ray tube, the bias and data acquisition systems and the PC-based control system. The prototype has been developed in the framework of the Integrated Mammographic Imaging (IMI) project, an industrial research activity aiming to develop innovative instrumentation for morphologic and functional imaging. The project has been supported by the Italian Ministry of Education, University and Research (MIUR) and by five Italian High Tech companies, Alenia Marconi Systems (AMS), CAEN, Gilardoni, LABEN and Poli.Hi.Tech., in collaboration with the universities of Ferrara, Roma 'La Sapienza', Pisa and the Istituto Nazionale di Fisica Nucleare (INFN). In this paper, we report on the electrical characterization and the first imaging test results of the digital mammographic system. To assess the imaging capability of such a detector we have built a phantom, which simulates the breast tissue with malignancies. The radiographs of the phantom, obtained by delivering an entrance dose of 4.8 mGy, have shown particulars with a measured contrast below 1%

A GaAs pixel detectors-based digital mammographic system: Performances and imaging tests results

Science.gov (United States)

Annovazzi, A.; Amendolia, S. R.; Bigongiari, A.; Bisogni, M. G.; Catarsi, F.; Cesqui, F.; Cetronio, A.; Colombo, F.; Delogu, P.; Fantacci, M. E.; Gilberti, A.; Lanzieri, C.; Lavagna, S.; Novelli, M.; Passuello, G.; Paternoster, G.; Pieracci, M.; Poletti, M.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Testa, A.; Venturelli, L.

2007-06-01

The prototype presented in this paper is based on GaAs pixel detectors read-out by the PCC/MEDIPIX I circuit. The active area of a sensor is about 1 cm 2 therefore to cover the typical irradiation field used in mammography (18×24 cm 2), 18 GaAs detection units have been organized in two staggered rows of nine chips each and moved by a stepper motor in the orthogonal direction. The system is integrated in a mammographic equipment which comprehends the X-ray tube, the bias and data acquisition systems and the PC-based control system. The prototype has been developed in the framework of the Integrated Mammographic Imaging (IMI) project, an industrial research activity aiming to develop innovative instrumentation for morphologic and functional imaging. The project has been supported by the Italian Ministry of Education, University and Research (MIUR) and by five Italian High Tech companies, Alenia Marconi Systems (AMS), CAEN, Gilardoni, LABEN and Poli.Hi.Tech., in collaboration with the universities of Ferrara, Roma "La Sapienza", Pisa and the Istituto Nazionale di Fisica Nucleare (INFN). In this paper, we report on the electrical characterization and the first imaging test results of the digital mammographic system. To assess the imaging capability of such a detector we have built a phantom, which simulates the breast tissue with malignancies. The radiographs of the phantom, obtained by delivering an entrance dose of 4.8 mGy, have shown particulars with a measured contrast below 1%.

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Nachman, Benjamin Philip; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of $10^{15}$ 1 MeV $n_\\mathrm{eq}/\\mathrm{cm}^2$ and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This talk presents a digitization model that includes radiation damage effects to the ATLAS Pixel sensors for the first time. After a thorough description of the setup, predictions for basic Pixel cluster properties are presented alongside first validation studies with Run 2 collision data.

Developments of the ATLAS pixel detector

International Nuclear Information System (INIS)

Andreazza, Attilio

2004-01-01

The ATLAS silicon pixel detector is the innermost tracking device of the ATLAS experiment at the Large Hardon Collider, consisting of more than 1700 modules for a total sensitive area of about 1.7m2 and over 80 million pixel cells. The concept is a hybrid of front-end chips bump bonded to the pixel sensor. The elementary pixel cell has 50μmx400μm size, providing pulse height information via the time over threshold technique. Prototype devices with oxygenated silicon sensor and rad-hard electronics built in the IBM 0.25μm process have been tested and maintain good resolution, efficiency and timing performances even after receiving the design radiation damage of 1015neq/cm2

Silicon Sensors for the Upgrades of the CMS Pixel Detector

CERN Document Server

Centis Vignali, Matteo; Schleper, Peter

2015-01-01

The Compact Muon Solenoid (CMS) is a general purpose detector at the Large Hadron Collider (LHC). The LHC luminosity is constantly increased through upgrades of the accel- erator and its injection chain. Two major upgrades will take place in the next years. The rst upgrade involves the LHC injector chain and allows the collider to achieve a luminosity of about 2 10 34 cm-2 s-1 A further upgrade of the LHC foreseen for 2025 will boost its luminosity to 5 10 34 cm-2 s1. As a consequence of the increased luminosity, the detectors need to be upgraded. In particular, the CMS pixel detector will undergo two upgrades in the next years. The rst upgrade (phase I) consists in the substitution of the current pixel detector in winter 2016/2017. The upgraded pixel detector will implement new readout elec- tronics that allow ecient data taking up to a luminosity of 2 10 34 cm-2s-1,twice as much as the LHC design luminosity. The modules that will constitute the upgraded detector are being produced at dierent institutes. Ham...

Pixel Detectors for Particle Physics and Imaging Applications

CERN Document Server

Wermes, N

2003-01-01

Semiconductor pixel detectors offer features for the detection of radiation which are interesting for particle physics detectors as well as for imaging e.g. in biomedical applications (radiography, autoradiography, protein crystallography) or in Xray astronomy. At the present time hybrid pixel detectors are technologically mastered to a large extent and large scale particle detectors are being built. Although the physical requirements are often quite different, imaging applications are emerging and interesting prototype results are available. Monolithic detectors, however, offer interesting features for both fields in future applications. The state of development of hybrid and monolithic pixel detectors, excluding CCDs, and their different suitability for particle detection and imaging, is reviewed.

Studies on a 300 k pixel detector telescope

Science.gov (United States)

Middelkamp, Peter; Antinori, F.; Barberis, D.; Becks, K. H.; Beker, H.; Beusch, W.; Burger, P.; Campbell, M.; Cantatore, E.; Catanesi, M. G.; Chesi, E.; Darbo, G.; D'Auria, S.; Davia, C.; di Bari, D.; di Liberto, S.; Elia, D.; Gys, T.; Heijne, E. H. M.; Helstrup, H.; Jacholkowski, A.; Jæger, J. J.; Jakubek, J.; Jarron, P.; Klempt, W.; Krummenacher, F.; Knudson, K.; Kralik, I.; Kubasta, J.; Lasalle, J. C.; Leitner, R.; Lemeilleur, F.; Lenti, V.; Letheren, M.; Lopez, L.; Loukas, D.; Luptak, M.; Martinengo, P.; Meddeler, G.; Meddi, F.; Morando, M.; Munns, A.; Pellegrini, F.; Pengg, F.; Pospisil, S.; Quercigh, E.; Ridky, J.; Rossi, L.; Safarik, K.; Scharfetter, L.; Segato, G.; Simone, S.; Smith, K.; Snoeys, W.; Vrba, V.

1996-02-01

Four silicon pixel detector planes are combined to form a tracking telescope in the lead ion experiment WA97 at CERN with 290 304 sensitive elements each of 75 μm by 500 μm area. An electronic pulse processing circuit is associated with each individual sensing element and the response for ionizing particles is binary with an adjustable threshold. The noise rate for a threshold of 6000 e- has been measured to be less than 10-10. The inefficient area due to malfunctioning pixels is 2.8% of the 120 cm2. Detector overlaps within one plane have been used to determine the alignment of the components of the plane itself, without need for track reconstruction using external detectors. It is the first time that such a big surface covered with active pixels has been used in a physics experiment. Some aspects concerning inclined particle tracks and time walk have been measured separately in a beam test at the CERN SPS H6 beam.

Studies on a 300 k pixel detector telescope

International Nuclear Information System (INIS)

Middelkamp, P.; Antinori, F.; Barberis, D.

1996-01-01

Four silicon pixel detector planes are combined to form a tracking telescope in the lead ion experiment WA97 at CERN with 290 304 sensitive elements each of 75 μm by 500 μm area. An electronic pulse processing circuit is associated with each individual sensing element and the response for ionizing particles is binary with an adjustable threshold. The noise rate for a threshold of 6000 e - has been measured to be less than 10 -10 . The inefficient area due to malfunctioning pixels is 2.8% of the 120 cm 2 . Detector overlaps within one plane have been used to determine the alignment of the components of the plane itself, without need for track reconstruction using external detectors. It is the first time that such a big surface covered with active pixels has been used in a physics experiment. Some aspects concerning inclined particle tracks and time walk have been measured separately in a beam test at the CERN SPS H6 beam. (orig.)

Challenges of small-pixel infrared detectors: a review.

Science.gov (United States)

Rogalski, A; Martyniuk, P; Kopytko, M

2016-04-01

In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology-HgCdTe material systems and III-V materials (mainly barrier detectors)-have been investigated.

Operational Experience with the ATLAS Pixel Detector at LHC

CERN Document Server

Keil, M

2013-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus crucial for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via front-end chips bump-bonded to 1744 n-on-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, detector performance and measurements of radiation damage. The detector performance is excellent: more than 95% of the pixels are operational, noise occupancy and hit efficiency exceed the des...

Detector performance of the ALICE silicon pixel detector

CERN Document Server

Cavicchioli, C

2011-01-01

The ALICE Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). It consists of two barrel layers of hybrid silicon pixel detectors at radii of 39 and 76 mm. The physics targets of the ALICE experiment require that the material budget of the SPD is kept within approximate to 1\\%X(0) per layer. This has set some stringent constraints on the design and construction of the SPD. A unique feature of the ALICE SPD is that it is capable of providing a prompt trigger signal, called Fast-OR, which contributes to the L0 trigger decision. The pixel trigger system allows to apply a set of algorithms for the trigger selection, and its output is sent to the Central Trigger Processor (CTP). The detector has been installed in the experiment in summer 2007. During the first injection tests in June 2008 the SPD was able to record the very first sign of life of the LHC by registering secondary particles from the beam dumped upstream the ALICE experiment. In the following months the...

Thermal Characterization and Optimization of the Pixel Module Support Structure for the Phase-1 Upgrade of the CMS Pixel Detector

CERN Document Server

AUTHOR|(CDS)2094386; Feld, Lutz Werner

2015-01-01

The CMS (Compact Muon Solenoid) pixel detector is used in CMS for the vertex reconstruction of events in high-energy proton-proton collisions produced by the Large Hadron Collider (LHC). It is planned for the future years that the LHC will deliver significantly higher instantaneous and integrated luminosities. Therefore, also the demands and requirements for the participating detectors rise. Thus the current CMS pixel detector will be replaced by the CMS Phase-1 Upgrade Pixel Detector in the extended year-end technical stop in winter 2016/2017. As a vertex detector, the pixel detector is the innermost detector component and it is located at a short distance to the proton-proton interaction point. Therefore it has to cope with high particle hit rates and high irradiation. The heat produced due to power consumption has to be removed while using a low-mass detector design. The low-mass design of the Phase-1 Upgrade Pixel Detector will be implemented by utilizing a new two-phase CO2 cooling concept and an ultra l...

Upgrade of ATLAS ITk Pixel Detector

CERN Document Server

Huegging, Fabian; The ATLAS collaboration

2017-01-01

The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenges to the ATLAS tracker. The current inner detector will be replaced with an entirely-silicon inner tracker (ITk) which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation levels are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors and low mass global and local support structures. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the ITk ATLAS Pixel detector developments as well as different layout options will be reviewed.

The Belle II DEPFET pixel detector

Energy Technology Data Exchange (ETDEWEB)

Moser, Hans-Günther, E-mail: moser@mpp.mpg.de

2016-09-21

The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55–60) μm in the first layer and between 50 μm×(70–85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the ‘internal gate’ modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X{sub 0}). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO{sub 2} system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

Rework of flip chip bonded radiation pixel detectors

International Nuclear Information System (INIS)

Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

2008-01-01

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

Rework of flip chip bonded radiation pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

2008-06-11

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

Leakage current measurements on pixelated CdZnTe detectors

International Nuclear Information System (INIS)

Dirks, B.P.F.; Blondel, C.; Daly, F.; Gevin, O.; Limousin, O.; Lugiez, F.

2006-01-01

In the field of the R and D of a new generation hard X-ray cameras for space applications we focus on the use of pixelated CdTe or CdZnTe semiconductor detectors. They are covered with 64 (0.9x0.9 mm 2 ) or 256 (0.5x0.5 mm 2 ) pixels, surrounded by a guard ring and operate in the energy ranging from several keV to 1 MeV, at temperatures between -20 and +20 o C. A critical parameter in the characterisation of these detectors is the leakage current per pixel under polarisation (∼50-500 V/mm). In operation mode each pixel will be read-out by an integrated spectroscopy channel of the multi-channel IDeF-X ASIC currently developed in our lab. The design and functionality of the ASIC depends directly on the direction and value of the current. A dedicated and highly insulating electronics circuit is designed to automatically measure the current in each individual pixel, which is in the order of tens of pico-amperes. Leakage current maps of different CdZnTe detectors of 2 and 6 mm thick and at various temperatures are presented and discussed. Defect density diagnostics have been performed by calculation of the activation energy of the material

Commissioning and first results from the CMS phase-1 upgrade pixel detector

CERN Document Server

Sonneveld, Jorine Mirjam

2017-01-01

The phase~1 upgrade of the CMS pixel detector has been designed to maintain the tracking performance at instantaneous luminosities of $2 \\times 10^{34} \\mathrm{~cm}^{-2} \\mathrm{~s}^{-1}$. Both barrel and endcap disk systems now feature one extra layer (4 barrel layers and 3 endcap disks), and a digital readout that provides a large enough bandwidth to read out its 124M pixel channels (87.7 percent more pixels compared to the previous system). The backend control and readout systems have been upgraded accordingly from VME-based to micro-TCA-based ones. The detector is now also fitted with a bi-phase CO$_2$ cooling system that reduces the material budget in the tracking region. The detector has been installed inside CMS at the start of 2017 and is now taking data. These proceedings discuss experiences in the commissioning and operation of the CMS phase~1 pixel detector. The first results from the CMS phase~1 pixel detector with this year's LHC proton-proton collision data are presented. ...

arXiv Performance verification of the CMS Phase-1 Upgrade Pixel detector

CERN Document Server

Veszpremi, Viktor

2017-12-04

The CMS tracker consists of two tracking systems utilizing semiconductor technology: the inner pixel and the outer strip detectors. The tracker detectors occupy the volume around the beam interaction region between 3 cm and 110 cm in radius and up to 280 cm along the beam axis. The pixel detector consists of 124 million pixels, corresponding to about 2 m 2 total area. It plays a vital role in the seeding of the track reconstruction algorithms and in the reconstruction of primary interactions and secondary decay vertices. It is surrounded by the strip tracker with 10 million read-out channels, corresponding to 200 m 2 total area. The tracker is operated in a high-occupancy and high-radiation environment established by particle collisions in the LHC . The current strip detector continues to perform very well. The pixel detector that has been used in Run 1 and in the first half of Run 2 was, however, replaced with the so-called Phase-1 Upgrade detector. The new system is better suited to match the increased inst...

Semiconductor Pixel detectors and their applications in life sciences

International Nuclear Information System (INIS)

Jakubek, J

2009-01-01

Recent advances in semiconductor technology allow construction of highly efficient and low noise pixel detectors of ionizing radiation. Steadily improving quality of front end electronics enables fast digital signal processing in each pixel which offers recording of more complete information about each detected quantum (energy, time, number of particles). All these features improve an extend applicability of pixel technology in different fields. Some applications of this technology especially for imaging in life sciences will be shown (energy and phase sensitive X-ray radiography and tomography, radiography with heavy charged particles, neutron radiography, etc). On the other hand a number of obstacles can limit the detector performance if not handled. The pixel detector is in fact an array of individual detectors (pixels), each of them has its own efficiency, energy calibration and also noise. The common effort is to make all these parameters uniform for all pixels. However an ideal uniformity can be never reached. Moreover, it is often seen that the signal in one pixel can affect the neighbouring pixels due to various reasons (e.g. charge sharing). All such effects have to be taken into account during data processing to avoid false data interpretation. A brief view into the future of pixel detectors and their applications including also spectroscopy, tracking and dosimetry is given too. Special attention is paid to the problem of detector segmentation in context of the charge sharing effect.

Pixellated thallium bromide detectors for gamma-ray spectroscopy and imaging

Energy Technology Data Exchange (ETDEWEB)

Onodera, T. E-mail: tosiyuki@smail.tohtech.ac.jp; Hitomi, K.; Shoji, T.; Hiratate, Y

2004-06-01

Recently, pixellated semiconductor detectors exhibit high-energy resolution, which have been studied actively and fabricated from CdTe, CZT and HgI{sub 2}. Thallium bromide (TlBr) is a compound semiconductor characterized with its high atomic numbers (Tl=81, Br=35) and high density (7.56 g/cm{sup 3}). Thus, TlBr exhibits higher photon stopping power than other semiconductor materials used for radiation detector fabrication such as CdTe, CZT and HgI{sub 2}. The wide band gap of TlBr (2.68 eV) permits the detectors low-noise operation at around room temperature. Our studies made an effort to fabricate pixellated TlBr detectors had sufficient detection efficiency and good charge collection efficiency. In this study, pixellated TlBr detectors were fabricated from the crystals purified by the multipass zone-refining method and grown by the horizontal traveling molten zone (TMZ) method. The TlBr detector has a continuous cathode over one crystal surface and 3x3 pixellated anodes (0.57x0.57 mm{sup 2} each) surrounded by a guard ring on the opposite surface. The electrodes were realized by vacuum evaporation of palladium through a shadow mask. Typical thickness of the detector was 2 mm. Spectrometric performance of the TlBr detectors was tested by irradiating them with {sup 241}Am (59.5 keV), {sup 57}Co (122 keV) and {sup 137}Cs (662 keV) gamma-ray sources at temperature of -20 deg. C. Energy resolutions (FWHM) were measured to be 4.0, 6.0 and 9.7 keV for 59.5, 122 and 662 keV gamma-rays, respectively.

PROTON RADIOGRAPHY WITH THE PIXEL DETECTOR TIMEPIX

Directory of Open Access Journals (Sweden)

Václav Olšanský

2016-12-01

Full Text Available This article presents the processing of radiographic data acquired using the position-sensitive hybrid semiconductor pixel detector Timepix. Measurements were made on thin samples at the medical ion-synchrotron HIT [1] in Heidelberg (Germany with a 221 MeV proton beam. The charge is energy by the particles crossing the sample is registered for generation of image contrast. Experimental data from the detector were processed for derivation of the energy loss of each proton using calibration matrices. The interaction point of the protons on the detector were determined with subpixel resolution by model fitting of the individual signals in the pixelated matrix. Three methods were used for calculation of these coordinates: Hough transformation, 2D Gaussian fitting and estimate the 2D mean. Parameters of calculation accuracy and calculation time are compared for each method. The final image was created by method with best parameters.

Status of the CMS Phase I pixel detector upgrade

Energy Technology Data Exchange (ETDEWEB)

Spannagel, S., E-mail: simon.spannagel@desy.de

2016-09-21

A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

Status of the CMS Phase I Pixel Detector Upgrade

CERN Document Server

Spannagel, Simon

2016-09-21

A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase~I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

Modeling radiation damage to pixel sensors in the ATLAS detector

Science.gov (United States)

Ducourthial, A.

2018-03-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC) . As the closest detector component to the interaction point, these detectors will be subject to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC) [1], the innermost layers will receive a fluence in excess of 1015 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is essential in order to make accurate predictions for current and future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects on the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside early studies with LHC Run 2 proton-proton collision data.

Estimate of the neutron fields in ATLAS based on ATLAS-MPX detectors data

International Nuclear Information System (INIS)

Bouchami, J; Dallaire, F; Gutierrez, A; Idarraga, J; Leroy, C; Picard, S; Scallon, O; Kral, V; PospIsil, S; Solc, J; Suk, M; Turecek, D; Vykydal, Z; Zemlieka, J

2011-01-01

The ATLAS-MPX detectors are based on Medipix2 silicon devices designed by CERN for the detection of different types of radiation. These detectors are covered with converting layers of 6 LiF and polyethylene (PE) to increase their sensitivity to thermal and fast neutrons, respectively. These devices allow the measurement of the composition and spectroscopic characteristics of the radiation field in ATLAS, particularly of neutrons. These detectors can operate in low or high preset energy threshold mode. The signature of particles interacting in a ATLAS-MPX detector at low threshold are clusters of adjacent pixels with different size and form depending on their type, energy and incidence angle. The classification of particles into different categories can be done using the geometrical parameters of these clusters. The Medipix analysis framework (MAFalda) - based on the ROOT application - allows the recognition of particle tracks left in ATLAS-MPX devices located at various positions in the ATLAS detector and cavern. The pattern recognition obtained from the application of MAFalda was configured to distinguish the response of neutrons from other radiation. The neutron response at low threshold is characterized by clusters of adjoining pixels (heavy tracks and heavy blobs) left by protons and heavy ions resulting from neutron interactions in the converting layers of the ATLAS-MPX devices. The neutron detection efficiency of ATLAS-MPX devices has been determined by the exposure of two detectors of reference to radionuclide sources of neutrons ( 252 Cf and 241 AmBe). With these results, an estimate of the neutrons fields produced at the devices locations during ATLAS operation was done.

A GaAs pixel detectors-based digital mammographic system: Performances and imaging tests results

Energy Technology Data Exchange (ETDEWEB)

Annovazzi, A. [LABEN S.p.A., Vimodrone-Milan (Italy); Amendolia, S.R. [Str. Dip. di Matematica e Fisica dell' Universita, Sassari and Sezione I.N.F.N., Pisa (Italy); Bigongiari, A. [CAEN S.p.A., Viareggio-Lucca (Italy); Bisogni, M.G. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy); Catarsi, F. [CAEN S.p.A., Viareggio-Lucca (Italy); Cesqui, F. [AMS S.p.A, Rome (Italy); Cetronio, A. [AMS S.p.A, Rome (Italy); Colombo, F. [LABEN S.p.A., Vimodrone-Milan (Italy); Delogu, P. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy); Fantacci, M.E. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy); Gilberti, A. [LABEN S.p.A., Vimodrone-Milan (Italy); Lanzieri, C. [AMS S.p.A, Rome (Italy); Lavagna, S. [AMS S.p.A, Rome (Italy); Novelli, M. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy); Passuello, G. [CAEN S.p.A., Viareggio-Lucca (Italy); Paternoster, G. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy); Pieracci, M. [CAEN S.p.A., Viareggio-Lucca (Italy); Poletti, M. [LABEN S.p.A., Vimodrone-Milan (Italy); Quattrocchi, M. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy); Rosso, V. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy); Stefanini, A. [Dipartimento di Fisica ' E. Fermi' dell' Universita and Sezione I.N.F.N., Pisa (Italy)]. E-mail: arnaldo.stefanini@pi.infn.it; Testa, A. [CAEN S.p.A., Viareggio-Lucca (Italy); Venturelli, L. [AMS S.p.A, Rome (Italy)

2007-06-11

The prototype presented in this paper is based on GaAs pixel detectors read-out by the PCC/MEDIPIX I circuit. The active area of a sensor is about 1 cm{sup 2} therefore to cover the typical irradiation field used in mammography (18x24 cm{sup 2}), 18 GaAs detection units have been organized in two staggered rows of nine chips each and moved by a stepper motor in the orthogonal direction. The system is integrated in a mammographic equipment which comprehends the X-ray tube, the bias and data acquisition systems and the PC-based control system. The prototype has been developed in the framework of the Integrated Mammographic Imaging (IMI) project, an industrial research activity aiming to develop innovative instrumentation for morphologic and functional imaging. The project has been supported by the Italian Ministry of Education, University and Research (MIUR) and by five Italian High Tech companies, Alenia Marconi Systems (AMS), CAEN, Gilardoni, LABEN and Poli.Hi.Tech., in collaboration with the universities of Ferrara, Roma 'La Sapienza', Pisa and the Istituto Nazionale di Fisica Nucleare (INFN). In this paper, we report on the electrical characterization and the first imaging test results of the digital mammographic system. To assess the imaging capability of such a detector we have built a phantom, which simulates the breast tissue with malignancies. The radiographs of the phantom, obtained by delivering an entrance dose of 4.8 mGy, have shown particulars with a measured contrast below 1%.

Silicon sensors for the upgrades of the CMS pixel detector

International Nuclear Information System (INIS)

Centis Vignali, Matteo

2015-12-01

The Compact Muon Solenoid (CMS) is a general purpose detector at the Large Hadron Collider (LHC). The LHC luminosity is constantly increased through upgrades of the accelerator and its injection chain. Two major upgrades will take place in the next years. The first upgrade involves the LHC injector chain and allows the collider to achieve a luminosity of about 2.10 34 cm -2 s -1 . A further upgrade of the LHC foreseen for 2025 will boost its luminosity to 5.10 34 cm -2 s -1 . As a consequence of the increased luminosity, the detectors need to be upgraded. In particular, the CMS pixel detector will undergo two upgrades in the next years. The first upgrade (phase I) consists in the substitution of the current pixel detector in winter 2016/2017. The upgraded pixel detector will implement new readout electronics that allow efficient data taking up to a luminosity of 2.10 34 cm -2 s -1 , twice as much as the LHC design luminosity. The modules that will constitute the upgraded detector are being produced at different institutes. Hamburg (University and DESY) is responsible for the production of 350 pixel modules. The second upgrade (phase II) of the pixel detector is foreseen for 2025. The innermost pixel layer of the upgraded detector will accumulate a radiation damage corresponding to an equivalent fluence of Φ eq =2.10 16 cm -2 and a dose of ∼10 MGy after an integrated luminosity of 3000 fb -1 . Several groups are investigating sensor designs and configurations able to withstand such high doses and fluences. This work is divided into two parts related to important aspects of the upgrades of the CMS pixel detector. For the phase I upgrade, a setup has been developed to provide an absolute energy calibration of the pixel modules that will constitute the detector. The calibration is obtained using monochromatic X-rays. The same setup is used to test the buffering capabilities of the modules' readout chip. The maximum rate experienced by the modules produced in

Characterization of the CMS Pixel Detectors

CERN Document Server

Gu, Weihua

2002-01-01

In 2005 the Large Hadron Collider (LHC) will start the pp collisions at a high luminosity and at a center of mass energy of 14 TeV. The primary goal of the experimental programme is the search of the Higgs boson(s) and the supersymmetric particles. The programme is also proposed to detect a range of diverse signatures in order to provide guidance for future physics. The pixel detector system makes up the innermost part of the CMS experiment, which is one of the two general purpose detectors at the LHC. The main tasks of the system are vertex detection and flavor tagging. The high luminosity and the high particle multiplicity as well as the small bunch spacing at the LHC impose great challenges on the pixel detectors: radiation hardness of sensors and electronics, fast signal processing and a high granularity are the essential requirements. This thesis concentrates on the study of the suitability of two test stands, which are implemented to characterize the CMS pixel detectors: one is con-cerned with test puls...

Performance verification of the CMS Phase-1 Upgrade Pixel detector

Science.gov (United States)

Veszpremi, V.

2017-12-01

The CMS tracker consists of two tracking systems utilizing semiconductor technology: the inner pixel and the outer strip detectors. The tracker detectors occupy the volume around the beam interaction region between 3 cm and 110 cm in radius and up to 280 cm along the beam axis. The pixel detector consists of 124 million pixels, corresponding to about 2 m 2 total area. It plays a vital role in the seeding of the track reconstruction algorithms and in the reconstruction of primary interactions and secondary decay vertices. It is surrounded by the strip tracker with 10 million read-out channels, corresponding to 200 m 2 total area. The tracker is operated in a high-occupancy and high-radiation environment established by particle collisions in the LHC . The current strip detector continues to perform very well. The pixel detector that has been used in Run 1 and in the first half of Run 2 was, however, replaced with the so-called Phase-1 Upgrade detector. The new system is better suited to match the increased instantaneous luminosity the LHC would reach before 2023. It was built to operate at an instantaneous luminosity of around 2×1034 cm-2s-1. The detector's new layout has an additional inner layer with respect to the previous one; it allows for more efficient tracking with smaller fake rate at higher event pile-up. The paper focuses on the first results obtained during the commissioning of the new detector. It also includes challenges faced during the first data taking to reach the optimal measurement efficiency. Details will be given on the performance at high occupancy with respect to observables such as data-rate, hit reconstruction efficiency, and resolution.

The construction of the phase 1 upgrade of the CMS pixel detector

CERN Document Server

Weber, Hannsjorg Artur

2017-01-01

The innermost layers of the original CMS tracker were built out of pixel detectors arranged in three barrel layers and two forward disks in each endcap. The original CMS detector was designed for the nominal instantaneous LHC luminosity of $1\\times10^{34}\\,\\text{cm}^{-2}\\text{s}^{-1}$. Under the conditions expected in the coming years, which will see an increase of a factor two of the instantaneous luminosity, the CMS pixel detector would have seen a dynamic inefficiency caused by data losses due to buffer overflows. For this reason the CMS collaboration has installed during the recent extended end of year shutdown a replacement pixel detector. The phase-1 upgrade of the CMS pixel detector will operate at high efficiency at an instantaneous luminosity of $2\\times10^{34}\\,\\text{cm}^{-2}\\text{s}^{-1}$ with increased detector acceptance and additional redundancy for the tracking, while at the same time reducing the material budget. These goals are achieved using a new read-out chip and modified powering and rea...

First large DEPFET pixel modules for the Belle II Pixel Detector

Energy Technology Data Exchange (ETDEWEB)

Mueller, Felix; Avella, Paola; Kiesling, Christian; Koffmane, Christian; Moser, Hans-Guenther; Valentan, Manfred [Max-Planck-Institut fuer Physik, Muenchen (Germany); Andricek, Ladislav; Richter, Rainer [Halbleiterlabor der Max-Planck-Gesellschaft, Muenchen (Germany); Collaboration: Belle II-Collaboration

2016-07-01

DEPFET pixel detectors offer excellent signal to noise ratio, resolution and low power consumption with a low material budget. They will be used at Belle II and are a candidate for an ILC vertex detector. The pixels are integrated in a monolithic piece of silicon which also acts as PCB providing the signal and control routings for the ASICs on top. The first prototype DEPFET sensor modules for Belle II have been produced. The modules have 192000 pixels and are equipped with SMD components and three different kinds of ASICs to control and readout the pixels. The entire readout chain has to be studied; the metal layer interconnectivity and routings need to be verified. The modules are fully characterized, and the operation voltages and control sequences of the ASICs are investigated. An overview of the DEPFET concept and first characterization results is presented.

CVD diamond pixel detectors for LHC experiments

Energy Technology Data Exchange (ETDEWEB)

Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N

1999-08-01

This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described.

CVD diamond pixel detectors for LHC experiments

International Nuclear Information System (INIS)

Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N.

1999-01-01

This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described

Angular resolution of the gaseous micro-pixel detector Gossip

Science.gov (United States)

Bilevych, Y.; Blanco Carballo, V.; van Dijk, M.; Fransen, M.; van der Graaf, H.; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S.; Rogers, M.; Romaniouk, A.; Veenhof, R.

2011-06-01

Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO 2 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

Angular resolution of the gaseous micro-pixel detector Gossip

Energy Technology Data Exchange (ETDEWEB)

Bilevych, Y.; Blanco Carballo, V.; Dijk, M. van; Fransen, M.; Graaf, H. van der; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S. [Nikhef, P.O. Box 41882, 1009 DB Amsterdam (Netherlands); Rogers, M. [Radboud University, P.O. Box 9102, 6500HC Nijmegen (Netherlands); Romaniouk, A.; Veenhof, R. [CERN, CH-1211, Geneve 23 (Switzerland)

2011-06-15

Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO{sub 2} 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

Angular resolution of the gaseous micro-pixel detector Gossip

International Nuclear Information System (INIS)

Bilevych, Y.; Blanco Carballo, V.; Dijk, M. van; Fransen, M.; Graaf, H. van der; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S.; Rogers, M.; Romaniouk, A.; Veenhof, R.

2011-01-01

Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO 2 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Ducourthial, Audrey; The ATLAS collaboration

2017-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of $10^{15} n_{eq}/cm^2$ and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside...

Modeling radiation damage to pixel sensors in the ATLAS detector

CERN Document Server

Ducourthial, Audrey; The ATLAS collaboration

2017-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of $10^{15}n_{eq}/cm^2$ and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside ...

Modeling of Pixelated Detector in SPECT Pinhole Reconstruction.

Science.gov (United States)

Feng, Bing; Zeng, Gengsheng L

2014-04-10

A challenge for the pixelated detector is that the detector response of a gamma-ray photon varies with the incident angle and the incident location within a crystal. The normalization map obtained by measuring the flood of a point-source at a large distance can lead to artifacts in reconstructed images. In this work, we investigated a method of generating normalization maps by ray-tracing through the pixelated detector based on the imaging geometry and the photo-peak energy for the specific isotope. The normalization is defined for each pinhole as the normalized detector response for a point-source placed at the focal point of the pinhole. Ray-tracing is used to generate the ideal flood image for a point-source. Each crystal pitch area on the back of the detector is divided into 60 × 60 sub-pixels. Lines are obtained by connecting between a point-source and the centers of sub-pixels inside each crystal pitch area. For each line ray-tracing starts from the entrance point at the detector face and ends at the center of a sub-pixel on the back of the detector. Only the attenuation by NaI(Tl) crystals along each ray is assumed to contribute directly to the flood image. The attenuation by the silica (SiO 2 ) reflector is also included in the ray-tracing. To calculate the normalization for a pinhole, we need to calculate the ideal flood for a point-source at 360 mm distance (where the point-source was placed for the regular flood measurement) and the ideal flood image for the point-source at the pinhole focal point, together with the flood measurement at 360 mm distance. The normalizations are incorporated in the iterative OSEM reconstruction as a component of the projection matrix. Applications to single-pinhole and multi-pinhole imaging showed that this method greatly reduced the reconstruction artifacts.

CVD diamond pixel detectors for LHC experiments

CERN Document Server

Wedenig, R; Bauer, C; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Friedl, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Knöpfle, K T; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Pan, L S; Palmieri, V G; Pernicka, Manfred; Peitz, A; Pirollo, S; Polesello, P; Pretzl, Klaus P; Procario, M; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Runólfsson, O; Russ, J; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Stone, R; Suter, B; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Vittone, E; Wagner, A; Walsh, A M; Weilhammer, Peter; White, C; Zeuner, W; Ziock, H J; Zöller, M

1999-01-01

This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described. (9 refs).

Operational Experience and Performance with the ATLAS Pixel detector

CERN Document Server

Martin, Christopher Blake; The ATLAS collaboration

2018-01-01

The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector, that has undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the Large Hadron Collider, with record breaking instantaneous luminosities of $1.3\\times10^{34}\\text{cm}^{{-2}}\\text{s}^{{-1}}$ recently surpassed. The key status and performance metrics of the ATLAS Pixel Detector are summarized, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described, with special emphasis to radiation damage experience.

Operational Experience and Performance with the ATLAS Pixel detector

CERN Document Server

Martin, Christopher Blake; The ATLAS collaboration

2018-01-01

The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector, that has undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the Large Hadron Collider, with record breaking instantaneous luminosities of 1.3 x 10^34 cm-2 s-1 recently surpassed. The key status and performance metrics of the ATLAS Pixel Detector are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described, with special emphasis to radiation damage experience.

Small-Scale Readout System Prototype for the STAR PIXEL Detector

International Nuclear Information System (INIS)

Szelezniak, Michal; Anderssen, Eric; Greiner, Leo; Matis, Howard; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James; Vu, Chinh; Wieman, Howard

2008-01-01

Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Keil, M; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including calibration procedures, timing optimization and detector performance. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit efficiency e...

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Keil, M; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Hirschbuehl, D; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.7% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Lapoire, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Keil, M

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, timing optimization and detector performance. The detector performance is excellent: approximately 97% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Ince, T; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.8% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel detector at the LHC

CERN Document Server

Deluca, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5\\% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, ...

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Lange, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump- bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, a...

Operational experience with the ATLAS Pixel detector at the LHC

CERN Document Server

Deluca, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Precision tracking with a single gaseous pixel detector

NARCIS (Netherlands)

Tsigaridas, S.; van Bakel, N.; Bilevych, Y.; Gromov, V.; Hartjes, F.; Hessey, N.P.; de Jong, P.; Kluit, R.

2015-01-01

The importance of micro-pattern gaseous detectors has grown over the past few years after successful usage in a large number of applications in physics experiments and medicine. We develop gaseous pixel detectors using micromegas-based amplification structures on top of CMOS pixel readout chips.

Operational Experience with the CMS Pixel Detector

CERN Document Server

INSPIRE-00205212

2015-05-15

In the first LHC running period the CMS-pixel detector had to face various operational challenges and had to adapt to the rapidly changing beam conditions. In order to maximize the physics potential and the quality of the data, online and offline calibrations were performed on a regular basis. The detector performed excellently with an average hit efficiency above 99\\% for all layers and disks. In this contribution the operational challenges of the silicon pixel detector in the first LHC run and the current long shutdown are summarized and the expectations for 2015 are discussed.

STAR PIXEL detector mechanical design

Energy Technology Data Exchange (ETDEWEB)

Wieman, H H; Anderssen, E; Greiner, L; Matis, H S; Ritter, H G; Sun, X; Szelezniak, M [Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States)], E-mail: hhwieman@lbl.gov

2009-05-15

A high resolution pixel detector is being designed for the STAR [1] experiment at RHIC. This device will use MAPS as the detector element and will have a pointing accuracy of {approx}25 microns. We will be reporting on the mechanical design required to support this resolution. The radiation length of the first layer ({approx}0.3% X{sub 0}) and its distance from the interaction point (2.5 cm) determines the resolution. The design makes use of air cooling and thin carbon composite structures to limit the radiation length. The mechanics are being developed to achieve spatial calibrations and stability to 20 microns and to permit rapid detector replacement in event of radiation damage or other potential failures from operation near the beam.

Monitoring radiation damage in the ATLAS pixel detector

CERN Document Server

Schorlemmer, André Lukas; Quadt, Arnulf; Große-Knetter, Jörn; Rembser, Christoph; Di Girolamo, Beniamino

2014-11-05

Radiation hardness is one of the most important features of the ATLAS pixel detector in order to ensure a good performance and a long lifetime. Monitoring of radiation damage is crucial in order to assess and predict the expected performance of the detector. Key values for the assessment of radiation damage in silicon, such as the depletion voltage and depletion depth in the sensors, are measured on a regular basis during operations. This thesis summarises the monitoring program that is conducted in order to assess the impact of radiation damage and compares it to model predictions. In addition, the physics performance of the ATLAS detector highly depends on the amount of disabled modules in the ATLAS pixel detector. A worrying amount of module failures was observed during run I. Thus it was decided to recover repairable modules during the long shutdown (LS1) by extracting the pixel detector. The impact of the module repairs and module failures on the detector performance is analysed in this thesis.

Development of a high-speed single-photon pixellated detector for visible wavelengths

CERN Document Server

Mac Raighne, Aaron; Mathot, Serge; McPhate, Jason; Vallerga, John; Jarron, Pierre; Brownlee, Colin; O’Shea, Val

2009-01-01

We present the development of a high-speed, single-photon counting, Hybrid Photo Detector (HPD). The HPD consists of a vacuum tube, containing the detector assembly, sealed with a transparent optical input window. Photons incident on the photocathode eject a photoelectron into a large electric field, which accelerates the incident electron onto a silicon detector. The silicon detector is bump bonded to a Medipix readout chip. This set-up allows for the detection and readout of low incident photon intensities at rates that are otherwise unattainable with current camera technology. Reported is the fabrication of the camera that brings together a range of sophisticated design and fabrication techniques and the expected theoretical imaging performance. Applications to cellular and molecular microscopy are also described in which single-photon-counting abilities at high frame rates are crucial

Measurement of secondary radiation during ion beam therapy with the pixel detector Timepix

Science.gov (United States)

Martišíková, Mária; Jakubek, Jan; Granja, Carlos; Hartmann, Bernadette; Opálka, Lukáš; Pospíšil, Stanislav; Jäkel, Oliver

2011-11-01

In ion beam therapy the finite range of the ion beams in tissue and the presence of the Bragg-peak are exploited. Unpredictable changes in the patient`s condition can alter the range of the ion beam in the body. Therefore it is desired to verify the actual ion range during the treatment, preferably in a non-invasive way. Positron emission tomography (PET) has been used successfully to monitor the applied dose distributions. This method however suffers from limited applicability and low detection efficiency. In order to increase the detection efficiency and to decrease the uncertainties, in this study we investigate the possibility to measure secondary charged particles emerging from the patient during irradiation. An initial experimental study to register the particle radiation coming out of a patient phantom during the therapy was performed at the Heidelberg Ion Beam Therapy Center (HIT) in Germany. A static narrowly-focused beam of carbon ions was directed into a head phantom. The emerging secondary radiation was measured with the position-sensitive Timepix detector outside of the phantom. The detector, developed by the Medipix Collaboration, consists of a silicon sensor bump bonded to a pixelated readout chip (256 × 256 pixels with 55 μm pitch). Together with the USB-based readout interface, Timepix can operate as an active nuclear emulsion registering single particles online with 2D-track visualization. In this contribution we measured the signal behind the head phantom and investigated its dependence on the beam energy (corresponding to beam range in water 2-30 cm). Furthermore, the response was measured at four angles between 0 and 90 degrees. At all investigated energies some signal was registered. Its pattern corresponds to ions. Differences in the total amount of signal for different beam energies were observed. The time-structure of the signal is correlated with that of the incoming beam, showing that we register products of prompt processes. Such

Measurement of secondary radiation during ion beam therapy with the pixel detector Timepix

International Nuclear Information System (INIS)

Martišíková, Mária; Hartmann, Bernadette; Jäkel, Oliver; Jakubek, Jan; Granja, Carlos; Opálka, Lukáš; Pospíšil, Stanislav

2011-01-01

In ion beam therapy the finite range of the ion beams in tissue and the presence of the Bragg-peak are exploited. Unpredictable changes in the patient's condition can alter the range of the ion beam in the body. Therefore it is desired to verify the actual ion range during the treatment, preferably in a non-invasive way. Positron emission tomography (PET) has been used successfully to monitor the applied dose distributions. This method however suffers from limited applicability and low detection efficiency. In order to increase the detection efficiency and to decrease the uncertainties, in this study we investigate the possibility to measure secondary charged particles emerging from the patient during irradiation. An initial experimental study to register the particle radiation coming out of a patient phantom during the therapy was performed at the Heidelberg Ion Beam Therapy Center (HIT) in Germany. A static narrowly-focused beam of carbon ions was directed into a head phantom. The emerging secondary radiation was measured with the position-sensitive Timepix detector outside of the phantom. The detector, developed by the Medipix Collaboration, consists of a silicon sensor bump bonded to a pixelated readout chip (256 × 256 pixels with 55 μm pitch). Together with the USB-based readout interface, Timepix can operate as an active nuclear emulsion registering single particles online with 2D-track visualization. In this contribution we measured the signal behind the head phantom and investigated its dependence on the beam energy (corresponding to beam range in water 2–30 cm). Furthermore, the response was measured at four angles between 0 and 90 degrees. At all investigated energies some signal was registered. Its pattern corresponds to ions. Differences in the total amount of signal for different beam energies were observed. The time-structure of the signal is correlated with that of the incoming beam, showing that we register products of prompt processes. Such

Simulation study of pixel detector charge digitization

Science.gov (United States)

Wang, Fuyue; Nachman, Benjamin; Sciveres, Maurice; Lawrence Berkeley National Laboratory Team

2017-01-01

Reconstruction of tracks from nearly overlapping particles, called Tracking in Dense Environments (TIDE), is an increasingly important component of many physics analyses at the Large Hadron Collider as signatures involving highly boosted jets are investigated. TIDE makes use of the charge distribution inside a pixel cluster to resolve tracks that share one of more of their pixel detector hits. In practice, the pixel charge is discretized using the Time-over-Threshold (ToT) technique. More charge information is better for discrimination, but more challenging for designing and operating the detector. A model of the silicon pixels has been developed in order to study the impact of the precision of the digitized charge distribution on distinguishing multi-particle clusters. The output of the GEANT4-based simulation is used to train neutral networks that predict the multiplicity and location of particles depositing energy inside one cluster of pixels. By studying the multi-particle cluster identification efficiency and position resolution, we quantify the trade-off between the number of ToT bits and low-level tracking inputs. As both ATLAS and CMS are designing upgraded detectors, this work provides guidance for the pixel module designs to meet TIDE needs. Work funded by the China Scholarship Council and the Office of High Energy Physics of the U.S. Department of Energy under contract DE-AC02-05CH11231.

The FPGA Pixel Array Detector

International Nuclear Information System (INIS)

Hromalik, Marianne S.; Green, Katherine S.; Philipp, Hugh T.; Tate, Mark W.; Gruner, Sol M.

2013-01-01

A proposed design for a reconfigurable x-ray Pixel Array Detector (PAD) is described. It operates by integrating a high-end commercial field programmable gate array (FPGA) into a 3-layer device along with a high-resistivity diode detection layer and a custom, application-specific integrated circuit (ASIC) layer. The ASIC layer contains an energy-discriminating photon-counting front end with photon hits streamed directly to the FPGA via a massively parallel, high-speed data connection. FPGA resources can be allocated to perform user defined tasks on the pixel data streams, including the implementation of a direct time autocorrelation function (ACF) with time resolution down to 100 ns. Using the FPGA at the front end to calculate the ACF reduces the required data transfer rate by several orders of magnitude when compared to a fast framing detector. The FPGA-ASIC high-speed interface, as well as the in-FPGA implementation of a real-time ACF for x-ray photon correlation spectroscopy experiments has been designed and simulated. A 16×16 pixel prototype of the ASIC has been fabricated and is being tested. -- Highlights: ► We describe the novelty and need for the FPGA Pixel Array Detector. ► We describe the specifications and design of the Diode, ASIC and FPGA layers. ► We highlight the Autocorrelation Function (ACF) for speckle as an example application. ► Simulated FPGA output calculates the ACF for different input bitstreams to 100 ns. ► Reduced data transfer rate by 640× and sped up real-time ACF by 100× other methods.

Development of a super B-factory monolithic active pixel detector-the Continuous Acquisition Pixel (CAP) prototypes

International Nuclear Information System (INIS)

Varner, G.; Barbero, M.; Bozek, A.; Browder, T.; Fang, F.; Hazumi, M.; Igarashi, A.; Iwaida, S.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Stanic, S.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.

2005-01-01

Over the last few years great progress has been made in the technological development of Monolithic Active Pixel Sensors (MAPS) such that upgrades to existing vertex detectors using this technology are now actively being considered. Future vertex detection at an upgraded KEK-B factory, already the highest luminosity collider in the world, will require a detector technology capable of withstanding the increased track densities and larger radiation exposures. Near the beam pipe the current silicon strip detectors have projected occupancies in excess of 100%. Deep sub-micron MAPS look very promising to address this problem. In the context of an upgrade to the Belle vertex detector, the major obstacles to realizing such a device have been concerns about radiation hardness and readout speed. Two prototypes implemented in the TSMC 0.35 μm process have been developed to address these issues. Denoted the Continuous Acquisition Pixel, or CAP, the two variants of this architecture are distinguished in that CAP2 includes an 8-deep sampling pipeline within each 22.5 μm 2 pixel. Preliminary test results and remaining R and D issues are presented

Estimate of the neutron fields in ATLAS based on ATLAS-MPX detectors data

Energy Technology Data Exchange (ETDEWEB)

Bouchami, J; Dallaire, F; Gutierrez, A; Idarraga, J; Leroy, C; Picard, S; Scallon, O [Universite de Montreal, Montreal, Quebec H3C 3J7 (Canada); Kral, V; PospIsil, S; Solc, J; Suk, M; Turecek, D; Vykydal, Z; Zemlieka, J, E-mail: scallon@lps.umontreal.ca [Institute of Experimental and Applied Physics of the CTU in Prague, Horska 3a/22, CZ-12800 Praha2 - Albertov (Czech Republic)

2011-01-15

The ATLAS-MPX detectors are based on Medipix2 silicon devices designed by CERN for the detection of different types of radiation. These detectors are covered with converting layers of {sup 6}LiF and polyethylene (PE) to increase their sensitivity to thermal and fast neutrons, respectively. These devices allow the measurement of the composition and spectroscopic characteristics of the radiation field in ATLAS, particularly of neutrons. These detectors can operate in low or high preset energy threshold mode. The signature of particles interacting in a ATLAS-MPX detector at low threshold are clusters of adjacent pixels with different size and form depending on their type, energy and incidence angle. The classification of particles into different categories can be done using the geometrical parameters of these clusters. The Medipix analysis framework (MAFalda) - based on the ROOT application - allows the recognition of particle tracks left in ATLAS-MPX devices located at various positions in the ATLAS detector and cavern. The pattern recognition obtained from the application of MAFalda was configured to distinguish the response of neutrons from other radiation. The neutron response at low threshold is characterized by clusters of adjoining pixels (heavy tracks and heavy blobs) left by protons and heavy ions resulting from neutron interactions in the converting layers of the ATLAS-MPX devices. The neutron detection efficiency of ATLAS-MPX devices has been determined by the exposure of two detectors of reference to radionuclide sources of neutrons ({sup 252}Cf and {sup 241}AmBe). With these results, an estimate of the neutrons fields produced at the devices locations during ATLAS operation was done.

Estimate of the neutron fields in ATLAS based on ATLAS-MPX detectors data

Science.gov (United States)

Bouchami, J.; Dallaire, F.; Gutiérrez, A.; Idarraga, J.; Král, V.; Leroy, C.; Picard, S.; Pospíšil, S.; Scallon, O.; Solc, J.; Suk, M.; Turecek, D.; Vykydal, Z.; Žemlièka, J.

2011-01-01

The ATLAS-MPX detectors are based on Medipix2 silicon devices designed by CERN for the detection of different types of radiation. These detectors are covered with converting layers of 6LiF and polyethylene (PE) to increase their sensitivity to thermal and fast neutrons, respectively. These devices allow the measurement of the composition and spectroscopic characteristics of the radiation field in ATLAS, particularly of neutrons. These detectors can operate in low or high preset energy threshold mode. The signature of particles interacting in a ATLAS-MPX detector at low threshold are clusters of adjacent pixels with different size and form depending on their type, energy and incidence angle. The classification of particles into different categories can be done using the geometrical parameters of these clusters. The Medipix analysis framework (MAFalda) — based on the ROOT application — allows the recognition of particle tracks left in ATLAS-MPX devices located at various positions in the ATLAS detector and cavern. The pattern recognition obtained from the application of MAFalda was configured to distinguish the response of neutrons from other radiation. The neutron response at low threshold is characterized by clusters of adjoining pixels (heavy tracks and heavy blobs) left by protons and heavy ions resulting from neutron interactions in the converting layers of the ATLAS-MPX devices. The neutron detection efficiency of ATLAS-MPX devices has been determined by the exposure of two detectors of reference to radionuclide sources of neutrons (252Cf and 241AmBe). With these results, an estimate of the neutrons fields produced at the devices locations during ATLAS operation was done.

SLHC upgrade plans for the ATLAS pixel detector

International Nuclear Information System (INIS)

Sicho, Petr

2009-01-01

The ATLAS pixel detector is an 80 million channels silicon tracking system designed to detect charged tracks and secondary vertices with very high precision. An upgrade of the ATLAS pixel detector is presently being considered, enabling to cope with higher luminosity at Super Large Hadron Collider (SLHC). The increased luminosity leads to extremely high radiation doses in the innermost region of the ATLAS tracker. Options considered for a new detector are discussed, as well as some important R and D activities, such as investigations towards novel detector geometries and novel processes.

Signal height in silicon pixel detectors irradiated with pions and protons

International Nuclear Information System (INIS)

Rohe, T.; Acosta, J.; Bean, A.; Dambach, S.; Erdmann, W.; Langenegger, U.; Martin, C.; Meier, B.; Radicci, V.; Sibille, J.; Trueb, P.

2010-01-01

Pixel detectors are used in the innermost part of multi-purpose experiments at the Large Hadron Collider (LHC) and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of the detectors has been tested thoroughly up to the fluences expected at the LHC. In case of an LHC upgrade the fluence will be much higher and it is not yet clear up to which radii the present pixel technology can be used. To establish such a limit, pixel sensors of the size of one CMS pixel readout chip (PSI46V2.1) have been bump bonded and irradiated with positive pions up to 6x10 14 n eq /cm 2 at PSI and with protons up to 5x10 15 n eq /cm 2 . The sensors were taken from production wafers of the CMS barrel pixel detector. They use n-type DOFZ material with a resistance of about 3.7kΩcm and an n-side read out. As the performance of silicon sensors is limited by trapping, the response to a Sr-90 source was investigated. The highly energetic beta-particles represent a good approximation to minimum ionising particles. The bias dependence of the signal for a wide range of fluences will be presented.

ALICE Silicon Pixel Detector

CERN Multimedia

Manzari, V

2013-01-01

The Silicon Pixel Detector (SPD) forms the innermost two layers of the 6-layer barrel Inner Tracking System (ITS). The SPD plays a key role in the determination of the position of the primary collision and in the reconstruction of the secondary vertices from particle decays.

ATLAS rewards two pixel detector suppliers

CERN Multimedia

2007-01-01

Peter Jenni, ATLAS spokesperson, presented the ATLAS supplier award to Herbert Reichl, IZM director, and to Simonetta Di Gioia, from the SELEX company.Two of ATLAS’ suppliers were awarded prizes at a ceremony on Wednesday 13 June attended by representatives of the experiment’s management and of CERN. The prizes went to the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) in Berlin and the company SELEX Sistemi Integrati in Rome for the manufacture of modules for the ATLAS pixel detector. SELEX supplied 1500 of the modules for the tracker, while IZM produced a further 1300. The modules, each made up of 46080 channels, form the active part of the ATLAS pixel detector. IZM and SELEX received the awards for the excellent quality of their work: the average number of faulty channels per module was less than 2.10-3. They also stayed within budget and on schedule. The difficulty they faced was designing modules based on electronic components and sensor...

Gas filled prototype of a CdZnTe pixel detector

International Nuclear Information System (INIS)

Ramsey, B.; Sharma, D.; Sipila, H.; Gostilo, V.; Loupilov, A.

2001-01-01

CdZnTe pixel structures are currently the most promising detectors for the focal planes of hard X-ray telescopes, for astronomical observation in the range 5-100 keV. In Sharma et al. (Proc. SPIE 3765 (1999) 822) and Ramsey et al. (Nucl. Instrum. Methods A 458 (2001) 55) we presented preliminary results on the development of prototype 4x4 CdZnTe imaging detectors operated under vacuum. These pixel detectors were installed inside vacuum chambers on three-stage Peltier coolers providing detector temperatures down to -40 deg. C. A miniature sputter ion pump inside each chamber maintained the necessary vacuum of 10 -5 Torr. At a temperature of -20 deg. C we achieved an FWHM energy resolution of between 2% and 3% at 60 keV and ∼15% at 5.9 keV; however, the dependency on temperature was weak and at +20 deg. C the respective resolutions were 3% and 20%. As the detectors could be operated at room temperature without loss of their good characteristics it was possible to exclude the sputter ion pump and fill the chamber with dry nitrogen instead. We have tested a nitrogen-filled CdZnTe (5x5x1 mm 3 ) prototype having 0.65x0.65 mm 2 readout pads on a 0.75 mm pitch. The interpixel resistance at an applied voltage of 10 V was higher than 50 GΩ and the pixel leakage currents at room temperature with a bias of 200 V between each pad and the common electrode did not exceed 0.8 nA. The pixel detector inside the microassembly, which also contained the input stages of the preamplifiers, was installed on a Peltier cooler to maintain the detector temperature at +20 deg. C. To define real leakage currents of the pixels in their switched-on state we have checked the voltage on the preamplifiers feedback resistors. The resulting currents were 10-50 pA at a detector bias of 500 V. Under test, the typical energy resolution per pixel at +20 deg. C was ∼3% at energy 59.6 keV and ∼20% at energy 5.9 keV, which are similar to the values obtained in the vacuum prototype at room temperature

Advanced processing of CdTe pixel radiation detectors

Science.gov (United States)

Gädda, A.; Winkler, A.; Ott, J.; Härkönen, J.; Karadzhinova-Ferrer, A.; Koponen, P.; Luukka, P.; Tikkanen, J.; Vähänen, S.

2017-12-01

We report a fabrication process of pixel detectors made of bulk cadmium telluride (CdTe) crystals. Prior to processing, the quality and defect density in CdTe material was characterized by infrared (IR) spectroscopy. The semiconductor detector and Flip-Chip (FC) interconnection processing was carried out in the clean room premises of Micronova Nanofabrication Centre in Espoo, Finland. The chip scale processes consist of the aluminum oxide (Al2O3) low temperature thermal Atomic Layer Deposition (ALD), titanium tungsten (TiW) metal sputtering depositions and an electroless Nickel growth. CdTe crystals with the size of 10×10×0.5 mm3 were patterned with several photo-lithography techniques. In this study, gold (Au) was chosen as the material for the wettable Under Bump Metalization (UBM) pads. Indium (In) based solder bumps were grown on PSI46dig read out chips (ROC) having 4160 pixels within an area of 1 cm2. CdTe sensor and ROC were hybridized using a low temperature flip-chip (FC) interconnection technique. The In-Au cold weld bonding connections were successfully connecting both elements. After the processing the detector packages were wire bonded into associated read out electronics. The pixel detectors were tested at the premises of Finnish Radiation Safety Authority (STUK). During the measurement campaign, the modules were tested by exposure to a 137Cs source of 1.5 TBq for 8 minutes. We detected at the room temperature a photopeak at 662 keV with about 2 % energy resolution.

Status of the digital pixel array detector for protein crystallography

CERN Document Server

Datte, P; Beuville, E; Endres, N; Druillole, F; Luo, L; Millaud, J E; Xuong, N H

1999-01-01

A two-dimensional photon counting digital pixel array detector is being designed for static and time resolved protein crystallography. The room temperature detector will significantly enhance monochromatic and polychromatic protein crystallographic through-put data rates by more than three orders of magnitude. The detector has an almost infinite photon counting dynamic range and exhibits superior spatial resolution when compared to present crystallographic phosphor imaging plates or phosphor coupled CCD detectors. The detector is a high resistivity N-type Si with a pixel pitch of 150x150 mu m, and a thickness of 300 mu m, and is bump bonded to an application specific integrated circuit. The event driven readout of the detector is based on the column architecture and allows an independent pixel hit rate above 1 million photons/s/pixel. The device provides energy discrimination and sparse data readout which yields minimal dead-time. This type of architecture allows a continuous (frameless) data acquisition, a f...

Commissioning of the ATLAS pixel detector

International Nuclear Information System (INIS)

Golling, Tobias

2008-01-01

The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented

Survey of the ATLAS Pixel Detector Components

International Nuclear Information System (INIS)

Andreazza, A.; Kostyukhim, V.; Madaras, R.

2008-01-01

This document provides a description of the survey performed on different components of the ATLAS Pixel Detector at different stages of its assembly. During the production of the ATLAS pixel detector great care was put in the geometrical survey of the location of the sensitive area of modules. This had a double purpose: (1) to provide a check of the quality of the assembly procedure and assure tolerances in the geometrical assembly were met; and (2) to provide an initial point for the alignment (the so called 'as-built detector'), better than the ideal geometry. Since direct access to the sensitive area becomes more and more difficult with the progress of the assembly, the survey needed to be performed at different stages: after module loading on the local supports (sectors and staves) and after assembly of the local supports in disks or halfshells. Different techniques were used, including both optical 2D and 3D surveys and mechanical survey. This document summarizes the survey procedures, the analysis done on the collected data and how survey data are stored in case they will need to be accessed in the future

ATLAS Pixel Detector Upgrade

CERN Document Server

Flick, T; The ATLAS collaboration

2009-01-01

The first upgrade for higher luminosity at LHC for the ATLAS pixel detector is the insertion of a forth layer, the IBL. The talk gives an overview about what the IBL is and how it will be set up, as well as to give a status of the research and develoment work.

GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

Energy Technology Data Exchange (ETDEWEB)

Campbell, M. [CERN/MediPix Consortium, Geneva (Switzerland); Heijne, E.H.M. [CERN/MediPix Consortium, Geneva (Switzerland); Llopart, X. [CERN/MediPix Consortium, Geneva (Switzerland); Colas, P. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Giganon, A. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Giomataris, Y. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Chefdeville, M. [NIKHEF, Amsterdam (Netherlands); Colijn, A.P. [NIKHEF, Amsterdam (Netherlands); Fornaini, A. [NIKHEF, Amsterdam (Netherlands); Graaf, H. van der [NIKHEF, Amsterdam (Netherlands)]. E-mail: vdgraaf@nikhef.nl; Kluit, P. [NIKHEF, Amsterdam (Netherlands); Timmermans, J. [NIKHEF, Amsterdam (Netherlands); Visschers, J.L. [NIKHEF, Amsterdam (Netherlands); Schmitz, J. [University of Twente/MESA (Netherlands)

2006-05-01

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50{mu}m above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as {delta}-rays. With a gas layer thickness of only 1mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

International Nuclear Information System (INIS)

Campbell, M.; Heijne, E.H.M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A.P.; Fornaini, A.; Graaf, H. van der; Kluit, P.; Timmermans, J.; Visschers, J.L.; Schmitz, J.

2006-01-01

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1mm, the device could be applied as vertex detector, outperforming all Si-based detectors

GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

Science.gov (United States)

Campbell, M.; Heijne, E. H. M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A. P.; Fornaini, A.; van der Graaf, H.; Kluit, P.; Timmermans, J.; Visschers, J. L.; Schmitz, J.

2006-05-01

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50 μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1 mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

Leakage current measurements on pixelated CdZnTe detectors

NARCIS (Netherlands)

Dirks, B.; Blondel, C.; Daly, F.; Gevin, O.; Limousin, O.; Lugiez, F.

2006-01-01

In the field of the R&D of a new generation hard X-ray cameras for space applications we focus on the use of pixelated CdTe or CdZnTe semiconductor detectors. They are covered with 64 (0.9×0.9 mm2) or 256 (0.5×0.5 mm2) pixels, surrounded by a guard ring and operate in the energy ranging from several

Online calibrations and performance of the ATLAS Pixel Detector

CERN Document Server

Keil, M; The ATLAS collaboration

2010-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 M electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. The talk will give an overview of the calibration and performance of both the detector and its optical readout. The most basic parameter to be tuned and calibrated for the detector electronics is the readout threshold of the individual pixel channels. These need to be carefully tuned to optimise position resolution a...

Wafer-scale pixelated detector system

Science.gov (United States)

Fahim, Farah; Deptuch, Grzegorz; Zimmerman, Tom

2017-10-17

A large area, gapless, detection system comprises at least one sensor; an interposer operably connected to the at least one sensor; and at least one application specific integrated circuit operably connected to the sensor via the interposer wherein the detection system provides high dynamic range while maintaining small pixel area and low power dissipation. Thereby the invention provides methods and systems for a wafer-scale gapless and seamless detector systems with small pixels, which have both high dynamic range and low power dissipation.

Performance of the INTPIX6 SOI pixel detector

International Nuclear Information System (INIS)

Arai, Y.; Miyoshi, T.; Bugiel, Sz.; Dasgupta, R.; Idzik, M.; Kapusta, P.; Turala, M.; Kucewicz, W.

2017-01-01

Characterization of the monolithic pixel detector INPTIX6, designed at KEK and fabricated in Lapis 0.2 μ  m Fully-Depleted, Low-Leakage Silicon-On-Insulator (SOI) CMOS technology, was performed. The INTPIX6 comprises a large area of 1408 × 896 integrating type squared pixels of 12 micron pitch. In this work the performance and measurement results of the prototypes produced on lower resistivity Czochralski type (CZ-n) and high resistivity floating zone (FZ-n) sensor wafers are presented. Using 241 Am radioactive source the noise of INTPIX6 was measured, showing the ENC (Equivalent Noise Charge) of about 70 e − . The resolution calculated from the FWHM of the Iron-55 X-ray peak was about 100 e − . The radiation hardness of the SOI pixel detector was also investigated. The CZ-n type INTPIX6 received a dose of 60 krad and its performance has been continuously monitored during the irradiation.

Performance of the INTPIX6 SOI pixel detector

Science.gov (United States)

Arai, Y.; Bugiel, Sz.; Dasgupta, R.; Idzik, M.; Kapusta, P.; Kucewicz, W.; Miyoshi, T.; Turala, M.

2017-01-01

Characterization of the monolithic pixel detector INPTIX6, designed at KEK and fabricated in Lapis 0.2 μ m Fully-Depleted, Low-Leakage Silicon-On-Insulator (SOI) CMOS technology, was performed. The INTPIX6 comprises a large area of 1408 × 896 integrating type squared pixels of 12 micron pitch. In this work the performance and measurement results of the prototypes produced on lower resistivity Czochralski type (CZ-n) and high resistivity floating zone (FZ-n) sensor wafers are presented. Using 241Am radioactive source the noise of INTPIX6 was measured, showing the ENC (Equivalent Noise Charge) of about 70 e-. The resolution calculated from the FWHM of the Iron-55 X-ray peak was about 100 e-. The radiation hardness of the SOI pixel detector was also investigated. The CZ-n type INTPIX6 received a dose of 60 krad and its performance has been continuously monitored during the irradiation.

Radiation Damage Modeling for 3D Pixel Sensors in the ATLAS Detector

CERN Document Server

Wallangen, Veronica; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This poster presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS Detector.

High-speed X-ray imaging pixel array detector for synchrotron bunch isolation.

Science.gov (United States)

Philipp, Hugh T; Tate, Mark W; Purohit, Prafull; Shanks, Katherine S; Weiss, Joel T; Gruner, Sol M

2016-03-01

A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8-12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10-100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed.

Algorithms for spectral calibration of energy-resolving small-pixel detectors

International Nuclear Information System (INIS)

Scuffham, J; Veale, M C; Wilson, M D; Seller, P

2013-01-01

Small pixel Cd(Zn)Te detectors often suffer from inter-pixel variations in gain, resulting in shifts in the individual energy spectra. These gain variations are mainly caused by inclusions and defects within the crystal structure, which affect the charge transport within the material causing a decrease in the signal pulse height. In imaging applications, spectra are commonly integrated over a particular peak of interest. This means that the individual pixels must be accurately calibrated to ensure that the same portion of the spectrum is integrated in every pixel. The development of large-area detectors with fine pixel pitch necessitates automated algorithms for this spectral calibration, due to the very large number of pixels. Algorithms for automatic spectral calibration require accurate determination of characteristic x-ray or photopeak positions on a pixelwise basis. In this study, we compare two peak searching spectral calibration algorithms for a small-pixel CdTe detector in gamma spectroscopic imaging. The first algorithm uses rigid search ranges to identify peaks in each pixel spectrum, based on the average peak positions across all pixels. The second algorithm scales the search ranges on the basis of the position of the highest-energy peak relative to the average across all pixels. In test spectra acquired with Tc-99m, we found that the rigid search algorithm failed to correctly identify the target calibraton peaks in up to 4% of pixels. In contrast, the scaled search algorithm failed in only 0.16% of pixels. Failures in the scaled search algorithm were attributed to the presence of noise events above the main photopeak, and possible non-linearities in the spectral response in a small number of pixels. We conclude that a peak searching algorithm based on scaling known peak spacings is simple to implement and performs well for the spectral calibration of pixellated radiation detectors

SPIDR, a general-purpose readout system for pixel ASICs

International Nuclear Information System (INIS)

Heijden, B. van der; Visser, J.; Beuzekom, M. van; Boterenbrood, H.; Munneke, B.; Schreuder, F.; Kulis, S.

2017-01-01

The SPIDR (Speedy PIxel Detector Readout) system is a flexible general-purpose readout platform that can be easily adapted to test and characterize new and existing detector readout ASICs. It is originally designed for the readout of pixel ASICs from the Medipix/Timepix family, but other types of ASICs or front-end circuits can be read out as well. The SPIDR system consists of an FPGA board with memory and various communication interfaces, FPGA firmware, CPU subsystem and an API library on the PC . The FPGA firmware can be adapted to read out other ASICs by re-using IP blocks. The available IP blocks include a UDP packet builder, 1 and 10 Gigabit Ethernet MAC's and a 'soft core' CPU . Currently the firmware is targeted at the Xilinx VC707 development board and at a custom board called Compact-SPIDR . The firmware can easily be ported to other Xilinx 7 series and ultra scale FPGAs. The gap between an ASIC and the data acquisition back-end is bridged by the SPIDR system. Using the high pin count VITA 57 FPGA Mezzanine Card (FMC) connector only a simple chip carrier PCB is required. A 1 and a 10 Gigabit Ethernet interface handle the connection to the back-end. These can be used simultaneously for high-speed data and configuration over separate channels. In addition to the FMC connector, configurable inputs and outputs are available for synchronization with other detectors. A high resolution (≈ 27 ps bin size) Time to Digital converter is provided for time stamping events in the detector. The SPIDR system is frequently used as readout for the Medipix3 and Timepix3 ASICs. Using the 10 Gigabit Ethernet interface it is possible to read out a single chip at full bandwidth or up to 12 chips at a reduced rate. Another recent application is the test-bed for the VeloPix ASIC, which is developed for the Vertex Detector of the LHCb experiment. In this case the SPIDR system processes the 20 Gbps scrambled data stream from the VeloPix and distributes it over four

Fully integrated CMOS pixel detector for high energy particles

International Nuclear Information System (INIS)

Vanstraelen, G.; Debusschere, I.; Claeys, C.; Declerck, G.

1989-01-01

A novel type of position and energy sensitive, monolithic pixel array with integrated readout electronics is proposed. Special features of the design are a reduction of the number of output channels and of the amount of output data, and the use of transistors on the high resistivity silicon. The number of output channels for the detector array is reduced by handling in parallel a number of pixels, chosen as a function of the time resolution required for the system, and by the use of an address decoder. A further reduction of data is achieved by reading out only those pixels which have been activated. The pixel detector circuit will be realized in a 3 μm p-well CMOS process, which is optimized for the full integration of readout electronics and detector diodes on high resistivity Si. A retrograde well is formed by means of a high energy implantation, followed by the appropriate temperature steps. The optimization of the well shape takes into account the high substrate bias applied during the detector operation. The design is largely based on the use of MOS transistors on the high resistivity silicon itself. These have proven to perform as well as transistors on standard doped substrate. The basic building elements as well as the design strategy of the integrated pixel detector are presented in detail. (orig.)

Development of a cylindrical tracking detector with multichannel scintillation fibers and pixelated photon detector readout

Energy Technology Data Exchange (ETDEWEB)

Akazawa, Y.; Miwa, K.; Honda, R.; Shiozaki, T.; Chiga, N.

2015-07-01

We are developing a cylindrical tracking detector for a Σp scattering experiment in J-PARC with scintillation fibers and the Pixelated Photon Detector (PPD) readout, which is called as cylindrical fiber tracker (CFT), in order to reconstruct trajectories of charged particles emitted inside CFT. CFT works not only as a tracking detector but also a particle identification detector from energy deposits. A prototype CFT consisting of two straight layers and one spiral layer was constructed. About 1100 scintillation fibers with a diameter of 0.75 mm (Kuraray SCSF-78 M) were used. Each fiber signal was read by Multi-Pixel Photon Counter (MPPC, HPK S10362-11-050P, 1×1 mm{sup 2}, 400 pixels) fiber by fiber. MPPCs were handled with Extended Analogue Silicon Photomultipliers Integrated ReadOut Chip (EASIROC) boards, which were developed for the readout of a large number of MPPCs. The energy resolution of one layer was 28% for a 70 MeV proton where the energy deposit in fibers was 0.7 MeV.

An EUDET/AIDA Pixel Beam Telescope for Detector Development

CERN Document Server

Rubinskiy, I

2015-01-01

Ahigh resolution(σ< 2 μm) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. EUDET was a coordinated detector R&D programme for the future International Linear Collider providing test beam infrastructure to detector R&D groups. The telescope consists of six sensor planes with a pixel pitch of either 18.4 μm or 10 μmand canbe operated insidea solenoidal magnetic fieldofupto1.2T.Ageneral purpose cooling, positioning, data acquisition (DAQ) and offine data analysis tools are available for the users. The excellent resolution, readout rate andDAQintegration capabilities made the telescopea primary beam tests tool also for several CERN based experiments. In this report the performance of the final telescope is presented. The plans for an even more flexible telescope with three differentpixel technologies(ATLASPixel, Mimosa,Timepix) withinthenew European detector infrastructure project AIDA are presented.

Integration and installation of the CMS pixel barrel detector

CERN Document Server

Kastli, Hans-Christian

2008-01-01

A 66 million pixel detector has been installed in 2008 into the CMS experiment at CERN. The development and construction time took more than 10 years. In this paper the assembly of the barrel detector is described. A simple but effective method to accomplish a survey of the module positions during assembly is discussed. Furthermore the insertion and commissioning of the CMS pixel barrel detector which took place in July 2008 is illustrated.

Vertex measurement at a hadron collider. The ATLAS pixel detector

International Nuclear Information System (INIS)

Grosse-Knetter, J.

2008-03-01

The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the Pixel Detector near the interaction point requires excellent radiation hardness, fast read-out, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The new design concepts used to meet the challenging requirements are discussed with their realisation in the Pixel Detector, followed by a description of a refined and extensive set of measurements to assess the detector performance during and after its construction. (orig.)

Calibration Analysis Software for the ATLAS Pixel Detector

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00372086; The ATLAS collaboration

2016-01-01

The calibration of the ATLAS Pixel detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied together to chips with different characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

Characterisation of a single photon counting pixel system for imaging of low-contrast objects

CERN Document Server

Mikulec, B; Dipasquale, G; Schwarz, C; Watt, J

2001-01-01

In the framework of the Medipix collaboration the PCC, a single photon counting pixel chip, has been developed with the aim of improving the contrast resolution in medical imaging applications. The PCC consists of a matrix of 64x64 square pixels with 170 mm side length, each pixel comprising a 15 bit counter and a pulse height discriminator. The chip has been bump bonded to equally segmented 200 mm thick SI-LEC GaAs detectors showing a very high absorption energy for X-rays used in diagnostics. An absolute calibration of the system with a radioactive source and a synchrotron beam are described resulting in the value of the test input capacitance of ~24.7 fF. Using this value a full characterisation of the system from electrical measurements is presented. The entire system can reach a minimum threshold of ~2100 e- with ~250e- rms noise. One of the characteristics of the PCC is the possibility to adjust the thresholds of all pixels on a pixel-by-pixel basis with 3-bit precision. The threshold distribution after...

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Rossini, Lorenzo; The ATLAS collaboration

2018-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High- Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time and considers both planar and 3D sensor designs. In addition to thoroughly describing the setup, we compare predictions for basic...

The power supply system for the DEPFET pixel detector at BELLE II

International Nuclear Information System (INIS)

Rummel, Stefan

2013-01-01

The upgrade of the KEKB accelerator towards 8×10 35 cm −2 s −1 poses several challenges for the BELLE II detector. Especially the innermost detector will be faced with a significant radiation of several MRad per year as well as a high hit density. To cope with this a silicon pixel detector will be used for the inner layers of the silicon tracker. The pixel detector (PXD) consists of two layers of DEPFET active pixel sensors. The DEPFET technology has an unique set of advantages like low power dissipation in the active area, flexible device size, radiation hardness and a thinning procedure allowing to adjust the thickness of the device over a wide range. The two layers close to the interaction point together with a low material budget will improve the IP resolution by a factor of 2 compared to the previous installed silicon detector. In addition silicon stand-alone pattern recognition will be possible together with the four layers of double sided strip detectors (DSSD) of the strip detector. The PXD detector system consists of the DEPFET modules with integrated readout chips, the data handling hybrid receiving the data and sending them to compute nodes performing an online pattern recognition. Moreover the power supply system provides the supply voltages for the DEPFET from a position outside of the detector. The power distribution is designed to provide low output impedance over all frequencies and transient response with appropriate overshoots. The PXD pose several challenges to the power distribution system—number of voltages, tight requirements on regulation and noise. -- Highlights: ► The KEKB accelerator receive a luminosity upgrade towards 8×10 35 cm −2 s −1 . ► A two layer pixel detector based on the DEPFET technology will be installed. ► An improvement of a factor of 2 in. impact parameter resolution is expected. ► The 34 A dedicated power supply system for the detector is under development which aims for low noise, low output impedance

X-ray Imaging Using a Hybrid Photon Counting GaAs Pixel Detector

CERN Document Server

Schwarz, C; Göppert, R; Heijne, Erik H M; Ludwig, J; Meddeler, G; Mikulec, B; Pernigotti, E; Rogalla, M; Runge, K; Smith, K M; Snoeys, W; Söldner-Rembold, S; Watt, J

1999-01-01

The performance of hybrid GaAs pixel detectors as X-ray imaging sensors were investigated at room temperature. These hybrids consist of 300 mu-m thick GaAs pixel detectors, flip-chip bonded to a CMOS Single Photon Counting Chip (PCC). This chip consists of a matrix of 64 x 64 identical square pixels (170 mu-m x 170 mu-m) and covers a total area of 1.2 cm**2. The electronics in each cell comprises a preamplifier, a discriminator with a 3-bit threshold adjust and a 15-bit counter. The detector is realized by an array of Schottky diodes processed on semi-insulating LEC-GaAs bulk material. An IV-charcteristic and a detector bias voltage scan showed that the detector can be operated with voltages around 200 V. Images of various objects were taken by using a standard X-ray tube for dental diagnostics. The signal to noise ratio (SNR) was also determined. The applications of these imaging systems range from medical applications like digital mammography or dental X-ray diagnostics to non destructive material testing (...

Technological aspects of gaseous pixel detectors fabrication

NARCIS (Netherlands)

Blanco Carballo, V.M.; Salm, Cora; Smits, Sander M.; Schmitz, Jurriaan; Melai, J.; Chefdeville, M.A.; van der Graaf, H.

2007-01-01

Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated. SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress

Qualification of barrel pixel detector modules for the Phase 1 Upgrade of the CMS vertex detector

CERN Document Server

Kudella, Simon

2016-01-01

To withstand the higher particle rates of LHC Runs 2 and 3, with expected luminosities of up to $2\\times 10^{34}\\,\\mathrm{cm^{-2}s^{-1}}$, the current CMS pixel detector at the LHC will be replaced as part of the CMS Phase I Upgrade during the extended winter shutdown in 2016/17. The new pixel detector features a new geometry with one additional detector layer in the barrel region~(BPIX) and one pair of additional disks in the forward region~(FPIX), new digital readout chips as well as a new CO$_{2}$-based cooling system for both the barrel and forward region. The BPIX detector module production is summarized, with special focus on the different stages of quality assurance. The quality tests as well as the calibrations which all produced modules undergo in a temperature and humidity controlled environment are described. Exemplarily, the KIT/Aachen production line and its subprocesses are presented together with its quality and yields.

Low-cost bump-bonding processes for high energy physics pixel detectors

CERN Document Server

AUTHOR|(CDS)2069357; Blank, Thomas; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

2016-01-01

In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of five production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin (15 μm) gold wire is presented. This technique allows producing metal bumps with diameters down to 30 μm without using photolithography processes, which are typically required to provide suitable under bump metallization. The sh...

Construction and Tests of Modules for the ATLAS Pixel Detector

CERN Document Server

AUTHOR|(CDS)2068490

2003-01-01

The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the pixel detector near the interaction point requires excellent radiation hardness, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The pre-production phase of such pixel modules has nearly finished, yielding fully functional modules. Results are presented of tests with these modules.

Detector Modules for the CMS Pixel Phase 1 Upgrade

CERN Document Server

Zhu, De Hua; Berger, Pirmin; Meinhard, Maren Tabea; Starodumov, Andrey; Tavolaro, Vittorio Raoul

2017-01-01

The CMS Pixel phase 1 upgrade detector consists of 1184 modules with new design. An important part of the production is the module qualification and calibration, ensuring their proper functionality within the detector. This paper summarizes the qualification and calibration results of modules used in the innermost two detector layers with focus on methods using module-internal calibration signals. Extended characterizations on pixel level such as electronic noise and bump bond connectivity, optimization of operational parameters, sensor quality and thermal stress resistance were performed using a customized setup with controlled environment. It could be shown that the selected modules have on average $0.55 \\mathrm{ {}^{0\\!}\\!/\\!_{00} }\\, \\pm \\, 0.01 \\mathrm{ {}^{0\\!}\\!/\\!_{00} }\\,$ defective pixels and that all performance parameters stay within their specifications.

The Phase-2 ATLAS ITk Pixel Upgrade

CERN Document Server

Macchiolo, Anna; The ATLAS collaboration

2018-01-01

The new ATLAS ITk pixel system will be installed during the LHC Phase-II shutdown, to better take advantage of the increased luminosity of the HL-LHC. The detector will consist of 5 layers of stave-like support structures in the most central region and ring-shaped supports in the endcap regions, covering up to |η| < 4. While the outer 3 layers of the Pixel Detector are designed to operate for the full HL-LHC data taking period, the innermost 2 layers of the detector will be replaced around half of the lifetime. The ITk pixel detector will be instrumented with new sensors and readout electronics to provide improved tracking performance and radiation hardness compared to the current detector. Sensors will be read out by new ASICs based on the chip developed by the RD53 Collaboration. The pixel off-detector readout electronics will be implemented in the framework of the general ATLAS trigger and DAQ system with a readout speed of up to 5 Gb/s per data link for the innermost layers. Results of extensive tests...

Synchrotron applications of pixel and strip detectors at Diamond Light Source

International Nuclear Information System (INIS)

Marchal, J.; Tartoni, N.; Nave, C.

2009-01-01

A wide range of position-sensitive X-ray detectors have been commissioned on the synchrotron X-ray beamlines operating at the Diamond Light Source in UK. In addition to mature technologies such as image-plates, CCD-based detectors, multi-wire and micro-strip gas detectors, more recent detectors based on semiconductor pixel or strip sensors coupled to CMOS read-out chips are also in use for routine synchrotron X-ray diffraction and scattering experiments. The performance of several commercial and developmental pixel/strip detectors for synchrotron studies are discussed with emphasis on the image quality achieved with these devices. Examples of pixel or strip detector applications at Diamond Light Source as well as the status of the commissioning of these detectors on the beamlines are presented. Finally, priorities and ideas for future developments are discussed.

The CMS Pixel Detector Upgrade and R\\&D for the High Luminosity LHC

CERN Document Server

Viliani, Lorenzo

2017-01-01

The High Luminosity Large Hadron Collider (HL-LHC) at CERN is expected to collide protons at a centre-of-mass energy of 14\\,TeV and to reach an unprecedented peak instantaneous luminosity of $5 \\times 10^{34}\\,{\\rm cm}^{-2} {\\rm s}^{-1}$ with an average number of pileup events of 140. This will allow the ATLAS and CMS experiments to collect integrated luminosities of up to $3000\\,{\\rm fb}^{-1}$ during the project lifetime. To cope with this extreme scenario the CMS detector will be substantially upgraded before starting the HL-LHC, a plan known as CMS Phase-2 Upgrade. In the upgrade the entire CMS silicon pixel detector will be replaced and the new detector will feature increased radiation hardness, higher granularity and capability to handle higher data rate and longer trigger latency. In this report the Phase-2 Upgrade of the CMS silicon pixel detector will be reviewed, focusing on the features of the detector layout and on the development of new pixel devices.

The ALICE silicon pixel detector front-end and read-out electronics

CERN Document Server

Kluge, A

2006-01-01

The ALICE silicon pixel detector (SPD) comprises the two innermost barrel layers of the ALICE inner tracker system. The SPD includes 120 half staves each of which consists of a linear array of 10 ALICE pixel chips bump bonded to two silicon sensors. Each pixel chip contains 8192 active cells, so the total number of pixel cells in the SPD is ≈107. The tight material budget and the limitation in physical dimensions required by the detector design introduce new challenges for the integration of the on-detector electronics. An essential part of the half stave is a low-mass multi-layer flex that carries power, ground, and signals to the pixel chips. Each half stave is read out using a multi-chip module (MCM). The MCM contains three radiation hard ASICs and an 800 Mbit/s custom developed optical link for the data transfer between the detector and the control room. The detector components are less than 3 mm thick. The production of the half-staves and MCMs is currently under way. Test results as well as on overvie...

ATLAS SemiConductor Tracker and Pixel Detector: Status and Performance

CERN Document Server

Reeves, K; The ATLAS collaboration

2012-01-01

The Semi-Conductor Tracker (SCT) and the Pixel Detector are the key precision tracking devices in the Inner Detector of the ATLAS experiment at CERN LHC. The SCT is a silicon strip detector and is constructed of 4088 silicon detector modules for a total of 6.3 million strips. Each module is designed, constructed and tested to operate as a stand-alone unit, mechanically, electrically, optically and thermally. The SCT silicon micro-strip sensors are processed in the planar p-in-n technology. The signals from the strips are processed in the front-end ASICS ABCD3TA, working in the binary readout mode. The Pixel Detector consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In the talk the current status of the SCT and Pixel Detector will be reviewed. We will report on the operation of the detectors including an overview of the issues we encountered and the observation of significant increases in leakage currents (as expected) from bulk ...

Results from the commissioning of the ATLAS Pixel Detector

CERN Document Server

Masetti, L

2008-01-01

The Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It is an 80 million channel silicon tracking system designed to detect charged tracks and secondary vertices with very high precision. After connection of cooling and services and verification of their operation, the ATLAS Pixel Detector is now in the final stage of its commissioning phase. Calibration of optical connections, verification of the analog performance and special DAQ runs for noise studies have been performed and the first tracks in combined operation with the other subdetectors of the ATLAS Inner Detector were observed. The results from calibration tests on the whole detector and from cosmic muon data are presented.

Charge collection and absorption-limited x-ray sensitivity of pixellated x-ray detectors

International Nuclear Information System (INIS)

Kabir, M. Zahangir; Kasap, S.O.

2004-01-01

The charge collection and absorption-limited x-ray sensitivity of a direct conversion pixellated x-ray detector operating in the presence of deep trapping of charge carriers is calculated using the Shockley-Ramo theorem and the weighting potential of the individual pixel. The sensitivity of a pixellated x-ray detector is analyzed in terms of normalized parameters; (a) the normalized x-ray absorption depth (absorption depth/photoconductor thickness), (b) normalized pixel width (pixel size/thickness), and (c) normalized carrier schubwegs (schubweg/thickness). The charge collection and absorption-limited sensitivity of pixellated x-ray detectors mainly depends on the transport properties (mobility and lifetime) of the charges that move towards the pixel electrodes and the extent of dependence increases with decreasing normalized pixel width. The x-ray sensitivity of smaller pixels may be higher or lower than that of larger pixels depending on the rate of electron and hole trapping and the bias polarity. The sensitivity of pixellated detectors can be improved by ensuring that the carrier with the higher mobility-lifetime product is drifted towards the pixel electrodes

Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector

CERN Document Server

Giugliarelli, Gilberto; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This poster presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS Detector.

Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector

CERN Document Server

Wallangen, Veronica; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10$^{15}$ n$_\\mathrm{eq}$/cm$^2$ and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This work presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS detector.

Results from the Commissioning of the ATLAS Pixel Detector

CERN Document Server

Ibragimov, I

2008-01-01

The ATLAS pixel detector is the innermost tracking detector of the ATLAS experiment at the Large Hadron Collider (LHC) at CERN. It has a total active area of 1.7 m2 of silicon read out by approximately 80 million electronic channels, which will detect particle tracks and decay vertices with a very high precision. After more than 10 years of development and construction it is the first time ever the whole detector has been operated together. The paper will illustrate the detector performance and give first results from the combined ATLAS cosmics runs.

Development of 3D-DDTC pixel detectors for the ATLAS upgrade

International Nuclear Information System (INIS)

Dalla Betta, Gian-Franco; Boscardin, Maurizio; Darbo, Giovanni; Gemme, Claudia; La Rosa, Alessandro; Pernegger, Heinz; Piemonte, Claudio; Povoli, Marco; Ronchin, Sabina; Zoboli, Andrea; Zorzi, Nicola

2011-01-01

We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

Development of 3D-DDTC pixel detectors for the ATLAS upgrade

Energy Technology Data Exchange (ETDEWEB)

Dalla Betta, Gian-Franco, E-mail: dallabe@disi.unitn.it [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Boscardin, Maurizio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Darbo, Giovanni; Gemme, Claudia [INFN, Sezione di Genova, Via Dodecaneso 33, 16146 Genova (Italy); La Rosa, Alessandro; Pernegger, Heinz [CERN-PH, CH-1211 Geneve 23 (Switzerland); Piemonte, Claudio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Povoli, Marco [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Ronchin, Sabina [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Zoboli, Andrea [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Zorzi, Nicola [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy)

2011-04-21

We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

Development of 3D-DDTC pixel detectors for the ATLAS upgrade

CERN Document Server

Betta, G -F Dalla; Darbo, G; Gemme, C; La Rosa, A; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N

2011-01-01

We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are here discussed.

MPX Detectors as LHC Luminosity Monitor

CERN Document Server

Sopczak, Andre; Asbah, Nedaa; Bergmann, Benedikt; Bekhouche, Khaled; Caforio, Davide; Campbell, Michael; Heijne, Erik; Leroy, Claude; Lipniacka, Anna; Nessi, Marzio; Pospisil, Stanislav; Seifert, Frank; Solc, Jaroslav; Soueid, Paul; Suk, Michal; Turecek, Daniel; Vykydal, Zdenek

2015-01-01

A network of 16 Medipix-2 (MPX) silicon pixel devices was installed in the ATLAS detector cavern at CERN. It was designed to measure the composition and spectral characteristics of the radiation field in the ATLAS experiment and its surroundings. This study demonstrates that the MPX network can also be used as a self-sufficient luminosity monitoring system. The MPX detectors collect data independently of the ATLAS data-recording chain, and thus they provide independent measurements of the bunch-integrated ATLAS/LHC luminosity. In particular, the MPX detectors located close enough to the primary interaction point are used to perform van der Meer calibration scans with high precision. Results from the luminosity monitoring are presented for 2012 data taken at sqrt(s) = 8 TeV proton-proton collisions. The characteristics of the LHC luminosity reduction rate are studied and the effects of beam-beam (burn-off) and beam-gas (single bunch) interactions are evaluated. The systematic variations observed in the MPX lum...

Neural network based cluster creation in the ATLAS silicon pixel detector

CERN Document Server

Selbach, K E; The ATLAS collaboration

2012-01-01

The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS pixel detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

Neural network based cluster creation in the ATLAS silicon Pixel Detector

CERN Document Server

Andreazza, A; The ATLAS collaboration

2013-01-01

The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS Pixel Detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

Gamma Spectroscopy with Pixellated CdZnTe Gamma Detectors

International Nuclear Information System (INIS)

Shor, A.; Mardor, I.; Eisen, Y.

2002-01-01

Pixellated CdZnTe detectors are good candidates for room temperature gamma detection requiring spectroscopic performance with imaging capabilities. The CdZnTe materials possess high resistivity and good electron charge transport properties. The poor charge transport for the holes inherent in the CdZnTe material can be circumvented by fabricating the electrodes in any one of a number of structures designed for unipolar charge detection[1]. Recent interest in efficient gamma detection at relatively higher gamma energies has imposed more stringent demands on the CdZnTe material and on detector design and optimization. We developed at Soreq a technique where signals from all pixels and from the common electrode are processed, and then a correction is applied for improving the energy resolution and the photopeak efficiency. For illumination with an un-collimated 133 Ba source , we obtain a combined detector energy resolution of 5.0 % FWHM for the 81 keV peak, and 1.5 % FWHM for the 356 keV peak. We discuss the importance of detector material with high electron (μτ) e for thick Pixellated detectors

Geneva University: Pixel Detectors – trends and options for the future

CERN Multimedia

Geneva University

2012-01-01

GENEVA UNIVERSITY École de physique Département de physique nucléaire et corspusculaire 24, quai Ernest-Ansermet 1211 Genève 4 Tél.: (022) 379 62 73 Fax: (022) 379 69 92   Wednesday 25 April 2012 SEMINAIRE DE PHYSIQUE CORPUSCULAIRE Science III, Auditoire 1S081 30Science III, Auditoire 1S081 30 Pixel Detectors – trends and options for the future Prof. Norbert Wermes - University of Bonn  Pixel detectors have been invented in the early 90s with the advancement of micro technologies. With the advent of the LHC, big vertex detectors have demonstrated that the pixel detector type is holding many of the promises it had made before. Meanwhile new, different or just improved variants of the pixel technology are being studied for their suitability for future experiments or experiment upgrades. The talk will address the various pro's and con's comparing hybrid and monolithic pixel technologies and their su...

X-ray metrology of an array of active edge pixel sensors for use at synchrotron light sources

Science.gov (United States)

Plackett, R.; Arndt, K.; Bortoletto, D.; Horswell, I.; Lockwood, G.; Shipsey, I.; Tartoni, N.; Williams, S.

2018-01-01

We report on the production and testing of an array of active edge silicon sensors as a prototype of a large array. Four Medipix3RX.1 chips were bump bonded to four single chip sized Advacam active edge n-on-n sensors. These detectors were then mounted into a 2 by 2 array and tested on B16 at Diamond Light Source with an x-ray beam spot of 2um. The results from these tests, compared with optical metrology demonstrate that this type of sensor is sensitive to the physical edge of the silicon, with only a modest loss of efficiency in the final two rows of pixels. We present the efficiency maps recorded with the microfocus beam and a sample powder diffraction measurement. These results give confidence that this sensor technology can be used effectively in larger arrays of detectors at synchrotron light sources.

Pixelated transmission-mode diamond X-ray detector.

Science.gov (United States)

Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

2015-11-01

Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60-100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼ 1 kHz, which leads to an image sampling rate of ∼ 30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5-15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10(-2) to 90 W mm(-2). Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

LAMBDA 2M GaAs—A multi-megapixel hard X-ray detector for synchrotrons

Science.gov (United States)

Pennicard, D.; Smoljanin, S.; Pithan, F.; Sarajlic, M.; Rothkirch, A.; Yu, Y.; Liermann, H. P.; Morgenroth, W.; Winkler, B.; Jenei, Z.; Stawitz, H.; Becker, J.; Graafsma, H.

2018-01-01

Synchrotrons can provide very intense and focused X-ray beams, which can be used to study the structure of matter down to the atomic scale. In many experiments, the quality of the results depends strongly on detector performance; in particular, experiments studying dynamics of samples require fast, sensitive X-ray detectors. "LAMBDA" is a photon-counting hybrid pixel detector system for experiments at synchrotrons, based on the Medipix3 readout chip. Its main features are a combination of comparatively small pixel size (55 μm), high readout speed at up to 2000 frames per second with no time gap between images, a large tileable module design, and compatibility with high-Z sensors for efficient detection of higher X-ray energies. A large LAMBDA system for hard X-ray detection has been built using Cr-compensated GaAs as a sensor material. The system is composed of 6 GaAs tiles, each of 768 by 512 pixels, giving a system with approximately 2 megapixels and an area of 8.5 by 8.5 cm2. While the sensor uniformity of GaAs is not as high as that of silicon, its behaviour is stable over time, and it is possible to correct nonuniformities effectively by postprocessing of images. By using multiple 10 Gigabit Ethernet data links, the system can be read out at the full speed of 2000 frames per second. The system has been used in hard X-ray diffraction experiments studying the structure of samples under extreme pressure in diamond anvil cells. These experiments can provide insight into geological processes. Thanks to the combination of high speed readout, large area and high sensitivity to hard X-rays, it is possible to obtain previously unattainable information in these experiments about atomic-scale structure on a millisecond timescale during rapid changes of pressure or temperature.

X-ray micro-beam characterization of a small pixel spectroscopic CdTe detector

Science.gov (United States)

Veale, M. C.; Bell, S. J.; Seller, P.; Wilson, M. D.; Kachkanov, V.

2012-07-01

A small pixel, spectroscopic, CdTe detector has been developed at the Rutherford Appleton Laboratory (RAL) for X-ray imaging applications. The detector consists of 80 × 80 pixels on a 250 μm pitch with 50 μm inter-pixel spacing. Measurements with an 241Am γ-source demonstrated that 96% of all pixels have a FWHM of better than 1 keV while the majority of the remaining pixels have FWHM of less than 4 keV. Using the Diamond Light Source synchrotron, a 10 μm collimated beam of monochromatic 20 keV X-rays has been used to map the spatial variation in the detector response and the effects of charge sharing corrections on detector efficiency and resolution. The mapping measurements revealed the presence of inclusions in the detector and quantified their effect on the spectroscopic resolution of pixels.

The hardware of the ATLAS Pixel Detector Control System

International Nuclear Information System (INIS)

Henss, T; Andreani, A; Boek, J; Boyd, G; Citterio, M; Einsweiler, K; Kersten, S; Kind, P; Lantzsch, K; Latorre, S; Maettig, P; Meroni, C; Sabatini, F; Schultes, J

2007-01-01

The innermost part of the ATLAS (A Toroidal LHC ApparatuS) experiment, which is currently under construction at the LHC (Large Hadron Collider), will be a silicon pixel detector comprised of 1744 individual detector modules. To operate these modules, the readout electronics, and other detector components, a complex power supply and control system is necessary. The specific powering and control requirements, as well as the custom made components of our power supply and control systems, are described. These include remotely programmable regulator stations, the power supply system for the optical transceivers, several monitoring units, and the Interlock System. In total, this comprises the Pixel Detector Control System (DCS)

Tracking performance of a single-crystal and a polycrystalline diamond pixel-detector

Energy Technology Data Exchange (ETDEWEB)

Menasce, D.; et al.

2013-06-01

We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke^$-$), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Rossini, Lorenzo; The ATLAS collaboration

2018-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of 10^15 neq/cm^2 and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current and future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time and considers both planar and 3D sensor designs. In addition to thoroughly describing the setup, we compare predictions for b...

Results from the Commissioning of the ATLAS Pixel Detector

CERN Document Server

Strandberg, S

2009-01-01

The ATLAS pixel detector is a high resolution, silicon based, tracking detector with its innermost layer located only 5 cm away from the ATLAS interaction point. It is designed to provide good hit resolution and low noise, both important qualities for pattern recognition and for finding secondary vertices originating from decays of long-lived particles. The pixel detector has 80 million readout channels and is built up of three barrel layers and six disks, three on each side of the barrel. The detector was installed in the center of ATLAS in June 2007 and is currently being calibrated and commissioned. Details from the installation, commissioning and calibration are presented together with the current status.

A silicon pixel detector with routing for external VLSI read-out

International Nuclear Information System (INIS)

Thomas, S.L.; Seller, P.

1988-07-01

A silicon pixel detector with an array of 32 by 16 hexagonal pixels has been designed and is being built on high resistivity silicon. The detector elements are reverse biased diodes consisting of p-implants in an n-type substrate and are fully depleted from the front to the back of the wafer. They are intended to measure high energy ionising particles traversing the detector. The detailed design of the pixels, their layout and method of read-out are discussed. A number of test structures have been incorporated onto the wafer to enable measurements to be made on individual pixels together with a variety of active devices. The results will give a better understanding of the operation of the pixel array, and will allow testing of computer simulations of more elaborate structures for the future. (author)

Modelling of the small pixel effect in gallium arsenide X-ray imaging detectors

CERN Document Server

Sellin, P J

1999-01-01

A Monte Carlo simulation has been carried out to investigate the small pixel effect in highly pixellated X-ray imaging detectors fabricated from semi-insulating gallium arsenide. The presence of highly non-uniform weighting fields in detectors with a small pixel geometry causes the majority of the induced signal to be generated when the moving charges are close to the pixellated contacts. The response of GaAs X-ray imaging detectors is further complicated by the presence of charge trapping, particularly of electrons. In this work detectors are modelled with a pixel pitch of 40 and 150 mu m, and with thicknesses of 300 and 500 mu m. Pulses induced in devices with 40 mu m pixels are due almost totally to the movement of the lightly-trapped holes and can exhibit significantly higher charge collection efficiencies than detectors with large electrodes, in which electron trapping is significant. Details of the charge collection efficiencies as a function of interaction depth in the detector and of the incident phot...

Development of thin pixel detectors on epitaxial silicon for HEP experiments

International Nuclear Information System (INIS)

Boscardin, Maurizio; Calvo, Daniela; Giacomini, Gabriele; Wheadon, Richard; Ronchin, Sabina; Zorzi, Nicola

2013-01-01

The foreseen luminosity of the new experiments in High Energy Physics will require that the innermost layer of vertex detectors will be able to sustain fluencies up to 10 16 n eq /cm 2 . Moreover, in many experiments there is a demand for the minimization of the material budget of the detectors. Therefore, thin pixel devices fabricated on n-type silicon are a natural choice to fulfill these requirements due to their rad-hard performances and low active volume. We present an R and D activity aimed at developing a new thin hybrid pixel device in the framework of PANDA experiments. The detector of this new device is a p-on-n pixel sensor realized starting from epitaxial silicon wafers and back thinned up to 50–100 μm after process completion. We present the main technological steps and some electrical characterization on the fabricated devices before and after back thinning and after bump bonding to the front-end electronics

Development of thin pixel detectors on epitaxial silicon for HEP experiments

Energy Technology Data Exchange (ETDEWEB)

Boscardin, Maurizio, E-mail: boscardi@fbk.eu [FBK, CMM, Via Sommarive 18, I-38123 Povo, Trento (Italy); Calvo, Daniela [INFN and Dipartimento di Fisica, Università di Torino, Via Pietro Giuria, I-10125 Torino (Italy); Giacomini, Gabriele [FBK, CMM, Via Sommarive 18, I-38123 Povo, Trento (Italy); Wheadon, Richard [INFN and Dipartimento di Fisica, Università di Torino, Via Pietro Giuria, I-10125 Torino (Italy); Ronchin, Sabina; Zorzi, Nicola [FBK, CMM, Via Sommarive 18, I-38123 Povo, Trento (Italy)

2013-08-01

The foreseen luminosity of the new experiments in High Energy Physics will require that the innermost layer of vertex detectors will be able to sustain fluencies up to 10{sup 16} n{sub eq}/cm{sup 2}. Moreover, in many experiments there is a demand for the minimization of the material budget of the detectors. Therefore, thin pixel devices fabricated on n-type silicon are a natural choice to fulfill these requirements due to their rad-hard performances and low active volume. We present an R and D activity aimed at developing a new thin hybrid pixel device in the framework of PANDA experiments. The detector of this new device is a p-on-n pixel sensor realized starting from epitaxial silicon wafers and back thinned up to 50–100 μm after process completion. We present the main technological steps and some electrical characterization on the fabricated devices before and after back thinning and after bump bonding to the front-end electronics.

Module Production and Qualification for the Phase I Upgrade of the CMS Pixel Detector

CERN Document Server

AUTHOR|(CDS)2086689

2015-01-01

After consolidation of the LHC in 2013/14 its centre-of-mass energy will increase to 13TeV and the luminosity will reach $2 \\cdot 10^{34}\\, \\textnormal{cm}^{-2} \\textnormal{s}^{-1}$, which is twice the design luminosity. The latter will result in more simultaneous particle collisions, which would significantly increase the dead time of the current readout chip of the CMS pixel detector. Therefore the entire CMS pixel detector is replaced in 2016/17 and a new digital readout with larger buffers will be used to handle increasing pixel hit rates. An additional fourth barrel-layer provides more space points to improve track reconstruction. Half of the required modules for layer four is being produced at Karlsruhe Institute of Technology (KIT). This poster deals with the smallest discrete subunit of the pixel detector, the module and its assembly process. Moreover first production experience will be shown.

Neutron irradiation test of depleted CMOS pixel detector prototypes

International Nuclear Information System (INIS)

Mandić, I.; Cindro, V.; Gorišek, A.; Hiti, B.; Kramberger, G.; Mikuž, M.; Zavrtanik, M.; Hemperek, T.; Daas, M.; Hügging, F.; Krüger, H.; Pohl, D.-L.; Wermes, N.; Gonella, L.

2017-01-01

Charge collection properties of depleted CMOS pixel detector prototypes produced on p-type substrate of 2 kΩ cm initial resistivity (by LFoundry 150 nm process) were studied using Edge-TCT method before and after neutron irradiation. The test structures were produced for investigation of CMOS technology in tracking detectors for experiments at HL-LHC upgrade. Measurements were made with passive detector structures in which current pulses induced on charge collecting electrodes could be directly observed. Thickness of depleted layer was estimated and studied as function of neutron irradiation fluence. An increase of depletion thickness was observed after first two irradiation steps to 1 · 10 13 n/cm 2 and 5 · 10 13 n/cm 2 and attributed to initial acceptor removal. At higher fluences the depletion thickness at given voltage decreases with increasing fluence because of radiation induced defects contributing to the effective space charge concentration. The behaviour is consistent with that of high resistivity silicon used for standard particle detectors. The measured thickness of the depleted layer after irradiation with 1 · 10 15 n/cm 2 is more than 50 μm at 100 V bias. This is sufficient to guarantee satisfactory signal/noise performance on outer layers of pixel trackers in HL-LHC experiments.

Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

International Nuclear Information System (INIS)

Krzywda, A.; Alagoz, E.; Bubna, M.; Obertino, M.; Solano, A.; Arndt, K.; Uplegger, L.; Betta, G.F. Dalla; Boscardin, M.; Ngadiuba, J.; Rivera, R.; Menasce, D.; Moroni, L.; Terzo, S.; Bortoletto, D.; Prosser, A.; Adreson, J.; Kwan, S.; Osipenkov, I.; Bolla, G.

2014-01-01

In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×10 15 n eq /cm 2

Silicon pixel-detector R&D for CLIC

CERN Document Server

AUTHOR|(SzGeCERN)718101

2016-01-01

The physics aims at the future CLIC high-energy linear e+e- collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of a few μm, ultra-low mass (∼ 0.2% X${}_0$ per layer for the vertex region and ∼ 1 % X${}_0$ per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ∼ 10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hybrid pixel detectors with small pitch (25 μm) and analog readout are explored. For the outer trac...

Evaluation of a hybrid photon counting pixel detector for X-ray polarimetry

International Nuclear Information System (INIS)

Michel, T.; Durst, J.

2008-01-01

It has already been shown in literature that X-ray sensitive CCDs can be used to measure the degree of linear polarization of X-rays using the effect that photoelectrons are emitted with a non-isotropic angular distribution in respect to the orientation of the electric field vector of impinging photons. Up to now hybrid semiconductor pixel detectors like the Timepix-detector have never been used for X-ray polarimetry. The main reason for this is that the pixel pitch is large compared to CCDs which results in a much smaller analyzing power. On the other hand, the active thickness of the sensor layer can be larger than in CCDs leading to an increased efficiency. Therefore hybrid photon counting pixel detectors may be used for imaging and polarimetry at higher photon energies. For irradiation with polarized X-ray photons we were able to measure an asymmetry between vertical and horizontal double hit events in neighboring pixels of the hybrid photon counting Timepix-detector at room temperature. For the specific spectrum used in our experiment an average polarization asymmetry of (0.96±0.02)% was measured. Additionally, the Timepix-detector with its spectroscopic time-over-threshold-mode was used to measure the dependence of the polarization asymmetry on energy deposition in the detector. Polarization asymmetries between 0.2% at 29 keV and 3.4% at 78 keV energy deposition were determined. The results can be reproduced with our EGS4-based Monte-Carlo simulation

Geometry simulation and physics with the CMS forward pixel detector

Energy Technology Data Exchange (ETDEWEB)

Parashar, N [Purdue University Calumet, Hammond, Indiana (United States)], E-mail: Neeti@fnal.gov

2008-06-15

The Forward Pixel Detector of CMS is an integral part of the Tracking system, which will play a key role in addressing the full physics potential of the collected data. It has a very complex geometry that encompasses multilayer structure of its detector modules. This presentation describes the development of geometry simulation for the Forward Pixel Detector. A new geometry package has been developed, which uses the detector description database (DDD) interface for the XML (eXtensive Markup Language) to GEANT simulation. This is necessary for digitization and GEANT4 reconstruction software for tracking. The expected physics performance is also discussed.

Geometry simulation and physics with the CMS forward pixel detector

International Nuclear Information System (INIS)

Parashar, N

2008-01-01

The Forward Pixel Detector of CMS is an integral part of the Tracking system, which will play a key role in addressing the full physics potential of the collected data. It has a very complex geometry that encompasses multilayer structure of its detector modules. This presentation describes the development of geometry simulation for the Forward Pixel Detector. A new geometry package has been developed, which uses the detector description database (DDD) interface for the XML (eXtensive Markup Language) to GEANT simulation. This is necessary for digitization and GEANT4 reconstruction software for tracking. The expected physics performance is also discussed

Optimization of detector pixel size for stent visualization in x-ray fluoroscopy

International Nuclear Information System (INIS)

Jiang Yuhao; Wilson, David L.

2006-01-01

Pixel size is of great interest in the flat-panel detector design because of its potential impact on image quality. In the particular case of angiographic x-ray fluoroscopy, small pixels are required in order to adequately visualize interventional devices such as guidewires and stents which have wire diameters as small as 200 and 50 μm, respectively. We used quantitative experimental and modeling techniques to investigate the optimal pixel size for imaging stents. Image quality was evaluated by the ability of subjects to perform two tasks: detect the presence of a stent and discriminate a partially deployed stent from a fully deployed one in synthetic images. With measurements at 50, 100, 200, and 300 μm, the 100 μm pixel size gave the maximum contrast sensitivity for the detection experiment with the idealized direct detector. For an idealized indirect detector with a scintillating layer, an optimal pixel size was obtained at 200 μm pixel size. A channelized human observer model predicted a peak at 150 and 170 μm, for the idealized direct and indirect detectors, respectively. With regard to the stent deployment task for both detector types, smaller pixel sizes are favored and there is a steep drop in performance with larger pixels. In general, with the increasing exposures, the model and measurements give the enhanced contrast sensitivities and a smaller optimal pixel size. The effects of electronic noise and fill factor were investigated using the model. We believe that the experimental results and human observer model predications can help guide the flat-panel detector design. In addition, the human observer model should work on the similar images and be applicable to the future model and actual flat-panel implementations

Detection of secondary electrons with pixelated hybrid semiconductor detectors

International Nuclear Information System (INIS)

Gebert, Ulrike Sonja

2011-01-01

Within the scope of this thesis, secondary electrons were detected with a pixelated semiconductor detector named Timepix. The Timepix detector consists of electronics and a sensor made from a semiconductor material. The connection of sensor and electronics is done for each pixel individually using bump bonds. Electrons with energies above 3 keV can be detected with the sensor. One electron produces a certain amount of electron-hole pairs according to its energy. The charge then drifts along an electric field to the pixel electronics, where it induces an electric signal. Even without a sensor it is possible to detect an electric signal from approximately 1000 electrons directly in the pixel electronics. Two different detector systems to detect secondary electrons using the Timepix detector were investigated during this thesis. First of all, a hybrid photon detector (HPD) was used to detect single photoelectrons. The HPD consists of a vacuum vessel with an entrance window and a cesium iodine photocathode at the inner surface of the window. Photoelectrons are released from the photocathode by incident light and are accelerated in an electric field towards the Timepix detector, where the point of interaction and the arrival time of the electron is determined. With a proximity focusing setup, a time resolution of 12 ns (with an acceleration voltage of 20 kV between photocathode and Timepix detector) was obtained. The HPD examined in this thesis showed a strong dependence of the dark rate form the acceleration voltage and the pressure in the vacuum vessel. At a pressure of few 10 -5 mbar and an acceleration voltage of 20 kV, the dark rate was about 800 Hz per mm 2 area of the read out photocathode. One possibility to reduce the dark rate is to identify ion feedback events. With a slightly modified setup it was possible to reduce the dark rate to 0.5 Hz/mm 2 . To achieve this, a new photocathode was mounted in a shorter distance to the detector. The measurements where

Test-beam results of a SOI pixel detector prototype

CERN Document Server

Bugiel, Roma; Dannheim, Dominik; Fiergolski, Adrian; Hynds, Daniel; Idzik, Marek; Kapusta, P; Kucewicz, Wojciech; Munker, Ruth Magdalena; Nurnberg, Andreas Matthias

2018-01-01

This paper presents the test-beam results of a monolithic pixel-detector prototype fabricated in 200 nm Silicon-On-Insulator (SOI) CMOS technology. The SOI detector was tested at the CERN SPS H6 beam line. The detector is fabricated on a 500 μm thick high-resistivity float- zone n-type (FZ-n) wafer. The pixel size is 30 μm × 30 μm and its readout uses a source- follower configuration. The test-beam data are analysed in order to compute the spatial resolution and detector efficiency. The analysis chain includes pedestal and noise calculation, cluster reconstruction, as well as alignment and η-correction for non-linear charge sharing. The results show a spatial resolution of about 4.3 μm.

A MCM-D-type module for the ATLAS pixel detector

CERN Document Server

Becks, K H; Ehrmann, O; Gerlach, P; Gregor, I M; Pieters, P; Topper, M; Truzzi, C; Wolf, J

1999-01-01

For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel $9 detector. A module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 read out IC's, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and $9 power distribution busses. The dies are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented.

Development of the MCM-D technique for pixel detector modules

CERN Document Server

Grah, Christian

2005-01-01

This thesis treats a copper--polymer based thin film technology, the MCM-D technique and its application when building hybrid pixel detector modules. The ATLAS experiment at the LHC will be equipped with a pixel detector system. The basic mechanical units of the pixel detector are multi chip modules. The main components of these modules are: 16 electronic chips, a controller chip and a large sensor tile, featuring more than 46000 sensor cells. MCM-D is a superior technique to build the necessary signal bus system and the power distribution system directly on the active sensor tile. In collaboration with the Fraunhofer Institute for Reliability and Microintegration, IZM, the thin film process is reviewed and enhanced. The multi layer system was designed and optimized for the interconnection system as well as for the 46000 pixel contacts. Laboratory measurements on prototypes prove that complex routing schemes for geometrically optimized single chips are suitable and have negligible influence on the front--end ...

Online Calibration and Performance of the ATLAS Pixel Detector

CERN Document Server

Keil, M

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 million electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. This paper describes the tuning and calibration of the optical links and the detector modules, including measurements of threshold, noise, charge measurement, timing performance and the sensor leakage current.

Alignment of the upgraded CMS pixel detector

CERN Document Server

Schroder, Matthias

2018-01-01

The all-silicon tracking system of the CMS experiment provides excellent resolution for charged tracks and an efficient tagging of heavy-flavour jets. After a new pixel detector has been installed during the LHC technical stop at the beginning of 2017, the positions, orientations, and surface curvatures of the sensors needed to be determined with a precision at the order of a few micrometres to ensure the required physics performance. This is far beyond the mechanical mounting precision but can be achieved using a track-based alignment procedure that minimises the track-hit residuals of reconstructed tracks. The results are carefully validated with data-driven methods. In this article, results of the CMS tracker alignment in 2017 from the early detector-commissioning phase and the later operation are presented, that were derived using several million reconstructed tracks in pp-collision and cosmic-ray data. Special emphasis is put on the alignment of the new pixel detector.

New pixelized Micromegas detector with low discharge rate for the COMPASS experiment

CERN Document Server

Neyret, D.; Anfreville, M.; Bedfer, Y.; Burtin, E.; Coquelet, C.; d'Hose, N.; Desforge, D.; Giganon, A.; Jourde, D.; Kunne, F.; Magnon, A.; Makke, N.; Marchand, C.; Paul, B.; Platchkov, S.; Thibaud, F.; Usseglio, M.; Vandenbroucke, M.

2012-01-01

New Micromegas (Micro-mesh gaseous detectors) are being developed in view of the future physics projects planned by the COMPASS collaboration at CERN. Several major upgrades compared to present detectors are being studied: detectors standing five times higher luminosity with hadron beams, detection of beam particles (flux up to a few hundred of kHz/mm^{2}, 10 times larger than for the present Micromegas detectors) with pixelized read-out in the central part, light and integrated electronics, and improved robustness. Two solutions of reduction of discharge impact have been studied, with Micromegas detectors using resistive layers and using an additional GEM foil. Performance of such detectors has also been measured. A large size prototypes with nominal active area and pixelized read-out has been produced and installed at COMPASS in 2010. In 2011 prototypes featuring an additional GEM foil, as well as an resistive prototype, are installed at COMPASS and preliminary results from those detectors presented very go...

Fabrication of ATLAS pixel detector prototypes at IRST

International Nuclear Information System (INIS)

Boscardin, M.; Betta, G.-F. Dalla; Gregori, P.; Zen, M.; Zorzi, N.

2001-01-01

We report on the development of a fabrication technology for n-on-n silicon pixel detectors oriented to the ATLAS experiment at LHC. The main processing issues and some selected results from the electrical characterization of detector prototypes and related test structures are presented and discussed

Development of Small-Pixel CZT Detectors for Future High-Resolution Hard X-ray Missions

Science.gov (United States)

Beilicke, Matthias

Owing to recent breakthroughs in grazing incidence mirror technology, next-generation hard X-ray telescopes will achieve angular resolutions of between 5 and 10 arc seconds - about an order of magnitude better than that of the NuSTAR hard X-ray telescope. As a consequence, the next generation of hard X-ray telescopes will require pixelated hard X- ray detectors with pixels on a grid with a lattice constant of between 120 and 240 um. Additional detector requirements include a low energy threshold of less than 5 keV and an energy resolution of less than 1 keV. The science drivers for a high angular-resolution hard X-ray mission include studies and measurements of black hole spins, the cosmic evolution of super-massive black holes, AGN feedback, and the behavior of matter at very high densities. We propose a R&D research program to develop, optimize and study the performance of 100-200 um pixel pitch CdTe and Cadmium Zinc Telluride (CZT) detectors of 1-2 mm thickness. Our program aims at a comparison of the performance achieved with CdTe and CZT detectors, and the optimization of the pixel, steering grid, and guard ring anode patterns. Although these studies will use existing ASICs (Application Specific Integrated Circuits), our program also includes modest funds for the development of an ultra-low noise ASIC with a 2-D grid of readout pads that can be directly bonded to the 100-200 um pixel pitch CdTe and CZT detectors. The team includes the Washington University group (Prof. M. Beilicke and Co-I Prof. H.S.W. Krawczynski et al.), and co-investigator G. De Geronimo at Brookhaven National Laboratory (BNL). The Washington University group has a 10 year track record of innovative CZT detector R&D sponsored by the NASA Astronomy and Physics Research and Analysis (APRA) program. The accomplishments to date include the development of CZT detectors with pixel pitches between 350 um and 2.5 mm for the ProtoExist, EXIST, and X-Calibur hard X-ray missions with some of the best

Influence of backscattering on the spatial resolution of semiconductor X-ray detectors

International Nuclear Information System (INIS)

Hoheisel, M.; Korn, A.; Giersch, J.

2005-01-01

Pixelated X-ray detectors using semiconductor layers or scintillators as absorbers are widely used in high-energy physics, medical diagnosis, or non-destructive testing. Their good spatial resolution performance makes them particularly suitable for applications where fine details have to be resolved. Intrinsic limitations of the spatial resolution have been studied in previous simulations. These simulations focused on interactions inside the conversion layer. Transmitted photons were treated as a loss. In this work, we also implemented the structure behind the conversion layer to investigate the impact of backscattering inside the detector setup. We performed Monte Carlo simulations with the program ROSI (Roentgen Simulation) which is based on the well-established EGS4 algorithm. Line-spread functions of different fully implemented detectors were simulated. In order to characterize the detectors' spatial resolution, the modulation transfer functions (MTF) were calculated. The additional broadening of the line-spread function by carrier transport has been ignored in this work. We investigated two different detector types: a directly absorbing pixel detector where a semiconductor slab is bump-bonded to a readout ASIC such as the Medipix-2 setup with Si or GaAs as an absorbing semiconductor layer, and flat-panel detectors with a Se or a CsI converter. We found a significant degradation of the MTF compared to the case without backscattering. At energies above the K-edge of the backscattering material the spatial resolution drops and can account for the observed low-frequency drop of the MTF. Ignoring this backscatter effect might lead to misinterpretations of the charge sharing effect in counting pixel detectors

Test-beam activities and results for the ATLAS ITk pixel detector

Science.gov (United States)

Bisanz, T.

2017-12-01

The Phase-II upgrade of the LHC aims at an increase of the instantaneous luminosity up to about 5×1034 cm-2 s-1. To cope with the resulting challenges the current Inner Detector will be replaced by an all-silicon Inner Tracker (ITk) system. The Pixel Detector will have to deal with occupancies of about 300 hits/FE/s as well as a fluence of around 2×1016 neq cm-2. Various sensor layouts are under development, aiming at providing a high performance, cost effective pixel instrumentation to cover an active area of about 10 m2. These range from thin planar silicon, 3D silicon, to active CMOS sensors. After extensive characterization of the sensors in the lab, their charge collection properties and hit efficiency are measured in common testbeam campaigns, which provide valuable feedback for improvements of the layout. Testbeam measurements of the final prototypes will be used for the decision of which sensor types will be installed in ITk. The setups used in the ITk Pixel testbeam campaigns will be presented, including the common track reconstruction and analysis software. Results from the latest measurements will be shown, highlighting some of the developments and challenges for the ITk Pixel sensors.

Test-beam activities and results for the ATLAS ITk pixel detector

CERN Document Server

Bisanz, Tobias; The ATLAS collaboration

2017-01-01

The Phase-II upgrade of the LHC will result in an increase of the instantaneous luminosity up to about 5×1034 cm−2s−1. To cope with the challenges the current Inner Detector will be replaced by an all-silicon Inner Tracker (ITk) system. The Pixel Detector will have to deal with occupancies of about 300~hits/FE/s as well as a fluence of 2×1016neqcm−2. Various sensor layouts are under development, aiming at providing a high performance, cost effective pixel instrumentation to cover an active area of about 10~m2. These range from thin planar silicon, over 3D silicon, to active CMOS sensors. After extensive characterization of the sensors in the lab, their charge collection properties and hit efficiency are measured in common testbeam campaigns, which provide valuable feedback for improvements of the layout. Testbeam measurements of the final prototypes will be used for the decision of which sensor types will be installed in ITk. The setups used in the ITk Pixel testbeam campaigns will be presented, inclu...

BETAview: a digital {beta}-imaging system for dynamic studies of biological phenomena

Energy Technology Data Exchange (ETDEWEB)

Bertolucci, E.; Conti, M.; Mettivier, G.; Montesi, M.C. E-mail: montesi@na.infn.it; Russo, P

2002-02-01

We present a digital autoradiography (DAR) system, named BETAview, based on semiconductor pixel detectors and a single particle counting chip, for quantitative analysis of {beta}-emitting radioactive tracers in biological samples. The system is able to perform a real time monitoring of time-dependent biological phenomena. BETAview could be equipped either with GaAs or with Si semiconductor pixellated detectors. In this paper, we describe the results obtained with an assembly based on a Si detector, 300 {mu}m thick, segmented into 64x64 170 {mu}m size square pixels. The detector is bump-bonded to the low threshold, single particle counting chip named Medipix1, developed by a CERN-based European collaboration. The sensitive area is about 1 cm{sup 2}. Studies of background noise and detection efficiency have been performed. Moreover, time-resolved cellular uptake studies with radiolabelled molecules have been monitored. Specifically, we have followed in vivo and in real time, the [{sup 14}C]L-leucine amino acid uptake by eggs of Octopus vulgaris confirming the preliminary results of a previous paper. This opens the field of biomolecular kynetic studies with this new class of semiconductor DAR systems, whose evolution (using the Medipix2 chip, 256x256 pixels, 55 {mu}m pixel size) is soon to come.

BETAview: a digital β-imaging system for dynamic studies of biological phenomena

International Nuclear Information System (INIS)

Bertolucci, E.; Conti, M.; Mettivier, G.; Montesi, M.C.; Russo, P.

2002-01-01

We present a digital autoradiography (DAR) system, named BETAview, based on semiconductor pixel detectors and a single particle counting chip, for quantitative analysis of β-emitting radioactive tracers in biological samples. The system is able to perform a real time monitoring of time-dependent biological phenomena. BETAview could be equipped either with GaAs or with Si semiconductor pixellated detectors. In this paper, we describe the results obtained with an assembly based on a Si detector, 300 μm thick, segmented into 64x64 170 μm size square pixels. The detector is bump-bonded to the low threshold, single particle counting chip named Medipix1, developed by a CERN-based European collaboration. The sensitive area is about 1 cm 2 . Studies of background noise and detection efficiency have been performed. Moreover, time-resolved cellular uptake studies with radiolabelled molecules have been monitored. Specifically, we have followed in vivo and in real time, the [ 14 C]L-leucine amino acid uptake by eggs of Octopus vulgaris confirming the preliminary results of a previous paper. This opens the field of biomolecular kynetic studies with this new class of semiconductor DAR systems, whose evolution (using the Medipix2 chip, 256x256 pixels, 55 μm pixel size) is soon to come

Design and Performance of the CMS Pixel Detector Readout Chip

CERN Document Server

Kästli, H C; Erdmann, W; Hörmann, C; Horisberger, R P; Kotlinski, D; Meier, B; Hoermann, Ch.

2006-01-01

The readout chip for the CMS pixel detector has to deal with an enormous data rate. On-chip zero suppression is inevitable and hit data must be buffered locally during the latency of the first level trigger. Dead-time must be kept at a minimum. It is dominated by contributions coming from the readout. To keep it low an analog readout scheme has been adopted where pixel addresses are analog coded. We present the architecture of the final CMS pixel detector readout chip with special emphasis on the analog readout chain. Measurements of its performance are discussed.

The electro-mechanical integration of the NA62 GigaTracker time tagging pixel detector

CERN Document Server

Morel, M; Aglieri Rinella, G; Carassiti, V; Ceccucci, A; Daguin, J; Fiorini, M; Jarron, P; Kaplon, J; Mapelli, A; Marchetto, F; Noy, M; Nuessle, G; Perktold, L; Petagna, P; Riedler, P

2010-01-01

The NA62 GigaTracker is a low mass time tagging hybrid pixel detector operating in a beam with a particle rate of 750 MHz. It consists of three stations with a sensor size of 60 × 27mm2 containing 18000 pixels, each 300 × 300μm2. The active area is connected to a matrix of 2 × 5 pixel ASICs, which time tag the arrival of the particles with a binning of 100 ps. The detector operates in vacuum at -20 to 0°C and the material budget per station must be below 0.5% X0. Due to the high radiation environment of 2 × 1014 1 MeV neutron equivalent cm−2/yr−1 it is planned to exchange the detector modules regularly. The low material budget, cooling requirements and the request for easy module access has driven the electro-mechanical integration of the GigaTracker, which is presented in this paper

Initial Measurements on Pixel Detector Modules for the ATLAS Upgrades

CERN Document Server

Gallrapp, C; The ATLAS collaboration

2011-01-01

Delicate conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel Detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming Pixel Detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation for silicon planar and 3D pixel sensors, which give a first impression on the charge collection properties of the different sensor technologies, are presented.

Mechanical design and material budget of the CMS barrel pixel detector

Energy Technology Data Exchange (ETDEWEB)

Amsler, C; Boesiger, K; Chiochia, V; Maier, R; Meyer, Hp; Robmann, P; Scherr, S; Schmidt, A; Steiner, S [Universitaet Zuerich, Physik-Institut, Winterthurerstr. 190, CH-8057 Zuerich (Switzerland); Erdmann, W; Gabathuler, K; Horisberger, R; Koenig, S; Kotlinski, D; Meier, B; Streuli, S [Paul Scherrer Institut, CH-5232 Villigen (Switzerland); Rizzi, A [ETH Zuerich, Institute for Particle Physics, CH-8093 Zuerich (Switzerland)], E-mail: Alexander.Schmidt@cern.ch

2009-05-15

The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged particles close to the primary interaction vertex. This paper gives an overview of the mechanical requirements and design choices for the barrel pixel detector. The distribution of material in the detector as well as its description in the Monte Carlo simulation are discussed in detail.

Mechanical Design and Material Budget of the CMS Barrel Pixel Detector

CERN Document Server

Amsler, C; Chiochia, V; Erdmann, W; Gabathuler, K; Horisberger, R; König, S; Kotlinski, D; Maier, R; Meyer, H; Meier, B; Meyer, Hp; Rizzi, A; Robmann, P; Scherr, S; Schmidt, A; Steiner, S; Erdmann, W; Gabathuler, K; Horisberger, R; König, S; Kotlinski, D; Meier, B; Streuli, S; Rizzi, A

2009-01-01

The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged particles close to the primary interaction vertex. This paper gives an overview of the mechanical requirements and design choices for the barrel pixel detector. The distribution of material in the detector as well as its description in the Monte Carlo simulation are discussed in detail.

Optical data links for the ATLAS SCT and Pixel Detector

International Nuclear Information System (INIS)

Gregor, I.M.; Weidberg, A.R.; Lee, S.C.; Chu, M.L.; Teng, P.K.

2001-01-01

ATLAS (The ATLAS Technical Proposal, CERN/LHCC 94-33) is one of the large electronic particle detectors at LHC (The LHC Conceptual Design, Report- The Yellow Book, CERN/AC/95-05(LHC)) which will become operational in 2005. It is planned to use radiation tolerant optical links for the data transfer from the SemiConductor Tracker (SCT) (ATLAS Inner Detector Technical Proposal, CERN/LHCC 97-16 and CERN/LHCC 97-17). and Pixel Detector (ATLAS Pixel Detector Technical Proposal, CERN/LHCC 98-13) systems to the acquisition electronics over a distance up to 140m. The overall architecture and the performance of these optical data links are described. One of the three candidate designs for an on-detector Opto-Package is presented

Studies of mono-crystalline CVD diamond pixel detectors

CERN Document Server

Bartz, E; Atramentov, O; Yang, Z; Hall-Wilton, R; Schnetzer, S; Patel, R; Bugg, W; Hebda, P; Halyo, V; Hunt, A; Marlow, D; Steininger, H; Ryjov, V; Hits, D; Spanier, S; Pernicka, M; Johns, W; Doroshenko, J; Hollingsworth, M; Harrop, B; Farrow, C; Stone, R

2011-01-01

The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLTs mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope. Published by Elsevier B.V.

Studies of mono-crystalline CVD diamond pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Bugg, W. [University of Tennessee, Knoxville (United States); Hollingsworth, M., E-mail: mhollin3@utk.edu [University of Tennessee, Knoxville (United States); Spanier, S.; Yang, Z. [University of Tennessee, Knoxville (United States); Bartz, E.; Doroshenko, J.; Hits, D.; Schnetzer, S.; Stone, R.; Atramentov, O.; Patel, R.; Barker, A. [Rutgers University, Piscataway (United States); Hall-Wilton, R.; Ryjov, V.; Farrow, C. [CERN, Geneva (Switzerland); Pernicka, M.; Steininger, H. [HEPHY, Vienna (Austria); Johns, W. [Vanderbilt University, Nashville (United States); Halyo, V.; Harrop, B. [Princeton University, Princeton (United States); and others

2011-09-11

The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLT's mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope.

Development of the MCM-D technique for pixel detector modules

International Nuclear Information System (INIS)

Grah, C.

2005-03-01

This thesis treats a copper--polymer based thin film technology, the MCM-D technique and its application when building hybrid pixel detector modules. The ATLAS experiment at the LHC will be equipped with a pixel detector system. The basic mechanical units of the pixel detector are multi chip modules. The main components of these modules are: 16 electronic chips, a controller chip and a large sensor tile, featuring more than 46000 sensor cells. MCM-D is a superior technique to build the necessary signal bus system and the power distribution system directly on the active sensor tile. In collaboration with the Fraunhofer Institute for Reliability and Microintegration, IZM, the thin film process is reviewed and enhanced. The multi layer system was designed and optimized for the interconnection system as well as for the 46000 pixel contacts. Laboratory measurements on prototypes prove that complex routing schemes for geometrically optimized single chips are suitable and have negligible influence on the front--end chips performance. A full scale MCM-D module has been built and it is shown that the technology is suitable to build pixel detector modules. Further tests include the investigation of the impact of hadronic irradiation on the thin film layers. Single chip assemblies have been operated in a test beam environment and the feasibility of the optimization of the sensors could be shown. A review on the potential as well as the perspective for the MCM-D technique in future experiments is given

Operational Experience and Performance with the ATLAS Pixel detector

CERN Document Server

Yang, Hongtao; The ATLAS collaboration

2018-01-01

In this presentation, I will discuss the operation of ATLAS Pixel Detector during Run 2 proton-proton data-taking at √s=13 TeV in 2017. The topics to be covered include 1) the bandwidth issue and how it is mitigated through readout upgrade and threshold adjustment; 2) the auto-corrective actions; 3) monitoring of radiation effects.

Development of a High Dynamic Range Pixel Array Detector for Synchrotrons and XFELs

Science.gov (United States)

Weiss, Joel Todd

Advances in synchrotron radiation light source technology have opened new lines of inquiry in material science, biology, and everything in between. However, x-ray detector capabilities must advance in concert with light source technology to fully realize experimental possibilities. X-ray free electron lasers (XFELs) place particularly large demands on the capabilities of detectors, and developments towards diffraction-limited storage ring sources also necessitate detectors capable of measuring very high flux [1-3]. The detector described herein builds on the Mixed Mode Pixel Array Detector (MM-PAD) framework, developed previously by our group to perform high dynamic range imaging, and the Adaptive Gain Integrating Pixel Detector (AGIPD) developed for the European XFEL by a collaboration between Deustsches Elektronen-Synchrotron (DESY), the Paul-Scherrer-Institute (PSI), the University of Hamburg, and the University of Bonn, led by Heinz Graafsma [4, 5]. The feasibility of combining adaptive gain with charge removal techniques to increase dynamic range in XFEL experiments is assessed by simulating XFEL scatter with a pulsed infrared laser. The strategy is incorporated into pixel prototypes which are evaluated with direct current injection to simulate very high incident x-ray flux. A fully functional 16x16 pixel hybrid integrating x-ray detector featuring several different pixel architectures based on the prototypes was developed. This dissertation describes its operation and characterization. To extend dynamic range, charge is removed from the integration node of the front-end amplifier without interrupting integration. The number of times this process occurs is recorded by a digital counter in the pixel. The parameter limiting full well is thereby shifted from the size of an integration capacitor to the depth of a digital counter. The result is similar to that achieved by counting pixel array detectors, but the integrators presented here are designed to tolerate a

The simulation of charge sharing in semiconductor X-ray pixel detectors

CERN Document Server

Mathieson, K; O'Shea, V; Passmore, M S; Rahman, M; Smith, K M; Watt, J; Whitehill, C

2002-01-01

Two simulation packages were used to model the sharing of charge, due to the scattering and diffusion of carriers, between adjacent pixel elements in semiconductors X-ray detectors. The X-ray interaction and the consequent multiple scattering was modelled with the aid of the Monte Carlo package, MCNP. The resultant deposited charge distribution was then used to create the charge cloud profile in the finite element semiconductor simulation code MEDICI. The analysis of the current pulses induced on pixel electrodes for varying photon energies was performed for a GaAs pixel detector. For a pixel pitch of 25 mu m, the charge lost to a neighbouring pixel was observed to be constant, at 0.6%, through the energies simulated. Ultimately, a fundamental limit on the pixel element size for imaging and spectroscopic devices may be set due to these key physical principles.

Monitoring the Radiation Damage of the ATLAS Pixel Detector

CERN Document Server

Cooke, M; The ATLAS collaboration

2012-01-01

The Pixel Detector is the innermost charged particle tracking component employed by the ATLAS experiment at the CERN Large Hadron Collider (LHC). The instantaneous luminosity delivered by the LHC, now routinely in excess of 5x10^{33} cm^{-2} s^{-1}, results in a rapidly increasing accumulated radiation dose to the detector. Methods based on the sensor depletion properties and leakage current are used to monitor the evolution of the radiation damage, and results from the 2011 run are presented.

Monitoring the radiation damage of the ATLAS pixel detector

International Nuclear Information System (INIS)

Cooke, M.

2013-01-01

The pixel detector is the innermost charged particle tracking component employed by the ATLAS experiment at the CERN Large Hadron Collider (LHC). The instantaneous luminosity delivered by the LHC, now routinely in excess of 5×10 33 cm −2 s −1 , results in a rapidly increasing accumulated radiation dose to the detector. Methods based on the sensor depletion properties and leakage current are used to monitor the evolution of the radiation damage, and results from the 2011 run are presented

Tiled Array of Pixelated CZT Imaging Detectors for ProtoEXIST2 and MIRAX-HXI

Science.gov (United States)

Hong, Jaesub; Allen, Branden; Grindlay, Jonathan; Rodrigues, Barbara; Ellis, Jon Robert; Baker, Robert; Barthelmy, Scott; Mao, Peter; Miyasaka, Hiromasa; Apple, Jeff

2013-12-01

We have assembled a tiled array (220 cm2) of fine pixel (0.6 mm) imaging CZT detectors for a balloon borne wide-field hard X-ray telescope, ProtoEXIST2. ProtoEXIST2 is a prototype experiment for a next generation hard X-ray imager MIRAX-HXI on board Lattes, a spacecraft from the Agencia Espacial Brasilieira. MIRAX will survey the 5 to 200 keV sky of Galactic bulge, adjoining southern Galactic plane and the extragalactic sky with 6 ' angular resolution. This survey will open a vast discovery space in timing studies of accretion neutron stars and black holes. The ProtoEXIST2 CZT detector plane consists of 64 of 5 mm thick 2 cm × 2 cm CZT crystals tiled with a minimal gap. MIRAX will consist of 4 such detector planes, each of which will be imaged with its own coded-aperture mask. We present the packaging architecture and assembly procedure of the ProtoEXIST2 detector. On 2012, Oct 10, we conducted a successful high altitude balloon experiment of the ProtoEXIST1 and 2 telescopes, which demonstrates their technology readiness for space application. During the flight both telescopes performed as well as on the ground. We report the results of ground calibration and the initial results for the detector performance in the balloon flight.

Semiconductor pixel detectors for digital mammography

International Nuclear Information System (INIS)

Novelli, M.; Amendolia, S.R.; Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Venturelli, L.; Zucca, S.

2003-01-01

We present some results obtained with silicon and gallium arsenide pixel detectors to be applied in the field of digital mammography. Even though GaAs is suitable for medical imaging applications thanks to its atomic number, which allows a very good detection efficiency, it often contains an high concentrations of traps which decrease the charge collection efficiency (CCE). So we have analysed both electrical and spectroscopic performance of different SI GaAs diodes as a function of concentrations of dopants in the substrate, in order to find a material by which we can obtain a CCE allowing the detection of all the photons that interact in the detector. Nevertheless to be able to detect low contrast details, efficiency and CCE are not the only parameters to be optimized; also the stability of the detection system is fundamental. In the past we have worked with Si pixel detectors; even if its atomic number does not allow a good detection efficiency at standard thickness, it has a very high stability. So keeping in mind the need to increase the Silicon detection efficiency we performed simulations to study the behaviour of the electrical potential in order to find a geometry to avoid the risk of electrical breakdown

Semiconductor pixel detectors for digital mammography

Energy Technology Data Exchange (ETDEWEB)

Novelli, M. E-mail: marzia.novelli@pi.infn.it; Amendolia, S.R.; Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Venturelli, L.; Zucca, S

2003-08-21

We present some results obtained with silicon and gallium arsenide pixel detectors to be applied in the field of digital mammography. Even though GaAs is suitable for medical imaging applications thanks to its atomic number, which allows a very good detection efficiency, it often contains an high concentrations of traps which decrease the charge collection efficiency (CCE). So we have analysed both electrical and spectroscopic performance of different SI GaAs diodes as a function of concentrations of dopants in the substrate, in order to find a material by which we can obtain a CCE allowing the detection of all the photons that interact in the detector. Nevertheless to be able to detect low contrast details, efficiency and CCE are not the only parameters to be optimized; also the stability of the detection system is fundamental. In the past we have worked with Si pixel detectors; even if its atomic number does not allow a good detection efficiency at standard thickness, it has a very high stability. So keeping in mind the need to increase the Silicon detection efficiency we performed simulations to study the behaviour of the electrical potential in order to find a geometry to avoid the risk of electrical breakdown.

MPX detectors as LHC luminosity monitor

Energy Technology Data Exchange (ETDEWEB)

Sopczak, Andre; Ali, Babar; Bergmann, Benedikt; Caforio, Davide; Heijne, Erik; Pospisil, Stanislav; Seifert, Frank; Solc, Jaroslav; Suk, Michal; Turecek, Daniel [IEAP CTU in Prague (Czech Republic); Ashba, Nedaa; Leroy, Claude; Soueid, Paul [University of Montreal (Canada); Bekhouche, Khaled [Biskra University (Algeria); Campbell, Michael; Nessi, Marzio [CERN (Switzerland); Lipniacka, Anna [Bergen University (Norway)

2016-07-01

A network of 16 Medipix-2 (MPX) silicon pixel devices was installed in the ATLAS detector cavern at CERN. It was designed to measure the composition and spectral characteristics of the radiation field in the ATLAS experiment and its surroundings. This study demonstrates that the MPX network can also be used as a self-sufficient luminosity monitoring system. The MPX detectors collect data independently of the ATLAS data-recording chain, and thus they provide independent measurements of the bunch-integrated ATLAS/LHC luminosity. In particular, the MPX detectors located close enough to the primary interaction point are used to perform van der Meer calibration scans with high precision. Results from the luminosity monitoring are presented for 2012 data taken at √(s) =8 TeV proton-proton collisions. The characteristics of the LHC luminosity reduction rate are studied and the effects of beam-beam (burn-off) and beam-gas (single bunch) interactions are evaluated. The systematic variations observed in the MPX luminosity measurements are below 0.3% for one minute intervals.

Semiconductor micropattern pixel detectors a review of the beginnings

CERN Document Server

Heijne, Erik H M

2001-01-01

The innovation in monolithic and hybrid semiconductor 'micropattern' or 'reactive' pixel detectors for tracking in particle physics was actually to fit logic and pulse processing electronics with µW power on a pixel area of less than 0.04 mm2, retaining the characteristics of a traditional nuclear amplifier chain. The ns timing precision in conjunction with local memory and logic operations allowed event selection at > 10 MHz rates with unambiguous track reconstruction even at particle multiplicities > 10 cm-2. The noise in a channel was ~100 e- r.m.s. and enabled binary operation with random noise 'hits' at a level 30 Mrad, respectively.

Precision of MPX detectors as LHC luminosity monitor

Energy Technology Data Exchange (ETDEWEB)

Sopczak, Andre; Ali, Babar; Benes, Petr; Bergmann, Benedikt; Biskup, Bartolomej; Caforio, Davide; Heijne, Erik; Pospisil, Stanislav; Seifert, Frank; Solc, Jaroslav; Suk, Michal; Turecek, Daniel; Vykydal, Zdenek [IEAP CTU in Prague (Czech Republic); Asbah, Nedaa; Leroy, Claude; Soueid, Paul [University of Montreal (Canada); Campbell, Michael; Nessi, Marzio [CERN (Switzerland); Kladiva, Edward [IEP SAS Kosice (Slovakia)

2015-07-01

A network consisting of MPX detectors based on Medipix2 silicon pixel devices were originally adapted for measuring the composition and spectral characteristics of the radiation field in the ATLAS experiment and its surroundings. We demonstrate that the MPX network, which consists of 16 MPX detectors, is a self-contained luminosity monitor system. As the MPX detectors are collecting data independently of the ATLAS data-recording chain, they provide independent measurements of the bunch-integrated ATLAS/LHC luminosity. In particular, the MPX detectors close enough to the primary interaction point are used to perform van der Meer calibration scans with good precision. Results from the luminosity monitoring are presented for 2012 data taken at √(s)=8 TeV proton-proton collisions. The characteristics of the LHC luminosity reduction are studied and the effects of beam-beam (burn-off) and beam-gas (single bunch) interactions are evaluated. The variations of the MPX luminosity measurements around the fitted curve lead to a relative uncertainty on the luminosity measurement below 0.3% for one minute time intervals.

Defective pixel map creation based on wavelet analysis in digital radiography detectors

International Nuclear Information System (INIS)

Park, Chun Joo; Lee, Hyoung Koo; Song, William Y.; Achterkirchen, Thorsten Graeve; Kim, Ho Kyung

2011-01-01

The application of digital radiography detectors has attracted increasing attention in both medicine and industry. Since the imaging detectors are fabricated by semiconductor manufacturing process over large areas, defective pixels in the detectors are unavoidable. Moreover, the radiation damage due to the routine use of the detectors progressively increases the density of defective pixels. In this study, we present a method of identifying defective pixels in digital radiography detectors based on wavelet analysis. Artifacts generated due to wavelet transformations have been prevented by an additional local threshold method. The proposed method was applied to a sample digital radiography and the result was promising. The proposed method uses a single pair of dark and white images and does not require them to be corrected in gain-and-offset properties. This method will be helpful for the reliable use of digital radiography detectors through the working lifetime.

Performance Studies of Pixel Hybrid Photon Detectors for the LHCb RICH Counters

CERN Document Server

Aglieri Rinella, G; Piedigrossi, D; Van Lysebetten, A

2004-01-01

The Pixel Hybrid Photon Detector is a vacuum tube with a multi-alkali photo cathode, high voltage cross-focused electron optics and an anode consisting of a silicon pixel detector bump-bonded to a readout CMOS electronic chip fully encapsulated in the device. The Pixel HPD fulfils the requirements of the Ring Imaging Cherenkov counters of the LHCb experiment at LHC. The performances of the Pixel HPD will be discussed with reference to laboratory measurements, Cherenkov light imaging in recent beam tests, image distortions due to a magnetic field.

Research of high speed data readout and pre-processing system based on xTCA for silicon pixel detector

International Nuclear Information System (INIS)

Zhao Jingzhou; Lin Haichuan; Guo Fang; Liu Zhen'an; Xu Hao; Gong Wenxuan; Liu Zhao

2012-01-01

As the development of the detector, Silicon pixel detectors have been widely used in high energy physics experiments. It needs data processing system with high speed, high bandwidth and high availability to read data from silicon pixel detectors which generate more large data. The same question occurs on Belle II Pixel Detector which is a new style silicon pixel detector used in SuperKEKB accelerator with high luminance. The paper describes the research of High speed data readout and pre-processing system based on xTCA for silicon pixel detector. The system consists of High Performance Computer Node (HPCN) based on xTCA and ATCA frame. The HPCN consists of 4XFPs based on AMC, 1 AMC Carrier ATCA Board (ACAB) and 1 Rear Transmission Module. It characterized by 5 high performance FPGAs, 16 fiber links based on RocketIO, 5 Gbit Ethernet ports and DDR2 with capacity up to 18GB. In a ATCA frame, 14 HPCNs make up a system using the high speed backplane to achieve the function of data pre-processing and trigger. This system will be used on the trigger and data acquisition system of Belle II Pixel detector. (authors)

Hexagonal pixel detector with time encoded binary readout

International Nuclear Information System (INIS)

Hoedlmoser, H.; Varner, G.; Cooney, M.

2009-01-01

The University of Hawaii is developing continuous acquisition pixel (CAP) detectors for vertexing applications in lepton colliding experiments such as SuperBelle or ILC. In parallel to the investigation of different technology options such as MAPS or SOI, both analog and binary readout concepts have been tested. First results with a binary readout scheme in which the hit information is time encoded by means of a signal shifting mechanism have recently been published. This paper explains the hit reconstruction for such a binary detector with an emphasis on fake hit reconstruction probabilities in order to evaluate the rate capability in a high background environment such as the planned SuperB factory at KEK. The results show that the binary concept is at least comparable to any analog readout strategy if not better in terms of occupancy. Furthermore, we present a completely new binary readout strategy in which the pixel cells are arranged in a hexagonal grid allowing the use of three independent output directions to reduce reconstruction ambiguities. The new concept uses the same signal shifting mechanism for time encoding, however, in dedicated transfer lines on the periphery of the detector, which enables higher shifting frequencies. Detailed Monte Carlo simulations of full size pixel matrices including hit and BG generation, signal generation, and data reconstruction show that by means of multiple signal transfer lines on the periphery the pixel can be made smaller (higher resolution), the number of output channels and the data volume per triggered event can be reduced dramatically, fake hit reconstruction is lowered to a minimum and the resulting effective occupancies are less than 10 -4 . A prototype detector has been designed in the AMS 0.35μm Opto process and is currently under fabrication.

Development of a Detector Control System for the ATLAS Pixel detector in the HL-LHC

International Nuclear Information System (INIS)

Lehmann, N.; Kersten, S.; Zeitnitz, C.; Karagounis, M.

2016-01-01

The upgrade of the LHC to the HL-LHC requires a new ITk detector. The innermost part of this new tracker is a pixel detector. The University of Wuppertal is developing a new DCS to monitor and control this new pixel detector. The current concept envisions three parallel paths of the DCS. The first path, called security path, is hardwired and provides an interlock system to guarantee the safety of the detector and human beings. The second path is a control path. This path is used to supervise the entire detector. The control path has its own communication lines independent from the regular data readout for reliable operation. The third path is for diagnostics and provides information on demand. It is merged with the regular data readout and provides the highest granularity and most detailed information. To reduce the material budget, a serial power scheme is the baseline for the pixel modules. A new ASIC used in the control path is in development at Wuppertal for this serial power chain. A prototype exists already and a proof of principle was demonstrated. Development and research is ongoing to guarantee the correct operation of the new ASIC in the harsh environment of the HL-LHC. The concept for the new DCS will be presented in this paper. A focus will be made on the development of the DCS chip, used for monitoring and control of pixel modules in a serial power chain.

Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector

International Nuclear Information System (INIS)

Henss, Tobias

2008-12-01

In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts

Characterization of active CMOS sensors for capacitively coupled pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Hirono, Toko; Gonella, Laura; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Institute of Physics, University of Bonn (Germany); Peric, Ivan [Institut fuer Prozessdatenverarbeitung und Elektronik, Karlsruher Institut fuer Technologie, Karlsruhe (Germany)

2015-07-01

Active CMOS pixel sensor is one of the most attractive candidates for detectors of upcoming particle physics experiments. In contrast to conventional sensors of hybrid detectors, signal processing circuit can be integrated in the active CMOS sensor. The characterization and optimization of the pixel circuit are indispensable to obtain a good performance from the sensors. The prototype chips of the active CMOS sensor were fabricated in the AMS 180nm and L-Foundry 150 nm CMOS processes, respectively a high voltage and high resistivity technology. Both chips have a charge sensitive amplifier and a comparator in each pixel. The chips are designed to be glued to the FEI4 pixel readout chip. The signals from 3 pixels of the prototype chips are capacitively coupled to the FEI4 input pads. We have performed lab tests and test beams to characterize the prototypes. In this presentation, the measurement results of the active CMOS prototype sensors are shown.

Development of a serial powering scheme and a versatile characterization system for the ATLAS pixel detector upgrade

Energy Technology Data Exchange (ETDEWEB)

Filimonov, Viacheslav

2017-08-15

In order to increase the probability of new discoveries the LHC will be upgraded to the HL-LHC. The upgrade of the ATLAS detector is an essential part of this program. The entire ATLAS tracking system will be replaced by an all-silicon detector called Inner Tracker (ITk) which should be able to withstand the increased luminosity of 5 x 10{sup 34} cm{sup -2}s{sup -1}. The work presented in this thesis is focused on the ATLAS ITk pixel detector upgrade. Advanced silicon pixel detectors will be an essential part of the ITk pixel detector where they will be used for tracking and vertexing. Characterization of the pixel detectors is one of the required tasks for a successful ATLAS tracker upgrade. Therefore, the work presented in this thesis includes the development of a versatile and modular test system for advanced silicon pixel detectors for the HL-LHC. The performance of the system is verified. Single and quad FE-I4 modules functionalities are characterized with the developed system. The reduction of the material budget of the ATLAS ITk pixel detector is essential for a successful operation at high luminosity. Therefore, a low mass, efficient power distribution scheme to power detector modules (serial powering scheme) is investigated as well in the framework of this thesis. A serially powered pixel detector prototype is built with all the components that are needed for current distribution, data transmission, sensor biasing, bypassing and redundancy in order to prove the feasibility of implementing the serial powering scheme in the ITk. Detailed investigations of the electrical performance of the detector prototype equipped with FE-I4 quad modules are made with the help of the developed readout system.

Development of a serial powering scheme and a versatile characterization system for the ATLAS pixel detector upgrade

International Nuclear Information System (INIS)

Filimonov, Viacheslav

2017-08-01

In order to increase the probability of new discoveries the LHC will be upgraded to the HL-LHC. The upgrade of the ATLAS detector is an essential part of this program. The entire ATLAS tracking system will be replaced by an all-silicon detector called Inner Tracker (ITk) which should be able to withstand the increased luminosity of 5 x 10 34 cm -2 s -1 . The work presented in this thesis is focused on the ATLAS ITk pixel detector upgrade. Advanced silicon pixel detectors will be an essential part of the ITk pixel detector where they will be used for tracking and vertexing. Characterization of the pixel detectors is one of the required tasks for a successful ATLAS tracker upgrade. Therefore, the work presented in this thesis includes the development of a versatile and modular test system for advanced silicon pixel detectors for the HL-LHC. The performance of the system is verified. Single and quad FE-I4 modules functionalities are characterized with the developed system. The reduction of the material budget of the ATLAS ITk pixel detector is essential for a successful operation at high luminosity. Therefore, a low mass, efficient power distribution scheme to power detector modules (serial powering scheme) is investigated as well in the framework of this thesis. A serially powered pixel detector prototype is built with all the components that are needed for current distribution, data transmission, sensor biasing, bypassing and redundancy in order to prove the feasibility of implementing the serial powering scheme in the ITk. Detailed investigations of the electrical performance of the detector prototype equipped with FE-I4 quad modules are made with the help of the developed readout system.

Charge loss between contacts of CdZnTe pixel detectors

International Nuclear Information System (INIS)

Bolotnikov, A.E.; Cook, W.R.; Harrison, F.A.; Wong, A.-S.; Schindler, S.M.; Eichelberger, A.C.

1999-01-01

The surface of Cd 1-x Zn x Te (CZT) material has high resistivity but is not a perfect dielectric. Even a small surface conductivity can affect the electric field distribution, and therefore, the charge collection efficiency of a CZT pixel detector. The paper describes studies of this phenomenon for several contact configurations made on a single CZT detector. We have determined the maximum inter-contact separation at which the surface inter-pixel charge loss can be neglected. (author)

Development of monolithic pixel detector with SOI technology for the ILC vertex detector

Science.gov (United States)

Yamada, M.; Ono, S.; Tsuboyama, T.; Arai, Y.; Haba, J.; Ikegami, Y.; Kurachi, I.; Togawa, M.; Mori, T.; Aoyagi, W.; Endo, S.; Hara, K.; Honda, S.; Sekigawa, D.

2018-01-01

We have been developing a monolithic pixel sensor for the International Linear Collider (ILC) vertex detector with the 0.2 μm FD-SOI CMOS process by LAPIS Semiconductor Co., Ltd. We aim to achieve a 3 μm single-point resolution required for the ILC with a 20×20 μm2 pixel. Beam bunch crossing at the ILC occurs every 554 ns in 1-msec-long bunch trains with an interval of 200 ms. Each pixel must record the charge and time stamp of a hit to identify a collision bunch for event reconstruction. Necessary functions include the amplifier, comparator, shift register, analog memory and time stamp implementation in each pixel, and column ADC and Zero-suppression logic on the chip. We tested the first prototype sensor, SOFIST ver.1, with a 120 GeV proton beam at the Fermilab Test Beam Facility in January 2017. SOFIST ver.1 has a charge sensitive amplifier and two analog memories in each pixel, and an 8-bit Wilkinson-type ADC is implemented for each column on the chip. We measured the residual of the hit position to the reconstructed track. The standard deviation of the residual distribution fitted by a Gaussian is better than 3 μm.

Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

Energy Technology Data Exchange (ETDEWEB)

Puellen, Lukas

2015-02-10

In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

Development of a detector control system for the serially powered ATLAS pixel detector at the HL-LHC

International Nuclear Information System (INIS)

Puellen, Lukas

2015-01-01

In the years around 2020 the LHC will be upgraded to the HL-LHC. In terms of this upgrade, the ATLAS detector will also be upgraded. This also includes the pixel detector, the innermost of the sub-detectors in ATLAS. Thereby the powering concept of the pixel detector will be changed to reduce the material budget of the detector. From individual powering of each detector module, the concept changes to serial powering, where all modules of a powering group are connected in series. This change makes the development of a new detector control system (DCS) mandatory. Therefore, a new concept for the ATLAS pixel DCS is being developed at the University of Wuppertal. This concept is split into three paths: a safety path, a control path, and a diagnostics path. The safety path is a hard wired interlock system. The concept of this system will not differ significantly, compared to the interlock system of the current detector. The diagnostics path is embedded into the optical data read-out of the detector and will be used for detector tuning with high precision and granularity. The control path supervises the detector and provides a user interface to the hardware components. A concept for this path, including a prototype and proof-of-principle studies, has been developed in terms of this thesis. The control path consists of the DCS network, a read-out and controlling topology created by two types of ASICs: the DCS controller and the DCS chip. These ASICs measure and control all values, necessary for a safe detector operation in situ. This reduces the number of required cables and hence the material budget of the system. For the communication between these ASICs, two very fault tolerant bus protocols have been chosen: CAN bus carries data from the DCS computers, outside of the detector, to the DCS controllers at the edge of the pixel detector. For the communication between the DCS controller and the DCS chip, which is located close to each detector module, an enhanced I2C

Development of pixel detectors for SSC vertex tracking

International Nuclear Information System (INIS)

Kramer, G.; Shapiro, S.L.; Arens, J.F.; Jernigan, J.G.; Skubic, P.

1991-04-01

A description of hybrid PIN diode arrays and a readout architecture for their use as a vertex detector in the SSC environment is presented. Test results obtained with arrays having 256 x 256 pixels, each 30 μm square, are also presented. The development of a custom readout for the SSC will be discussed, which supports a mechanism for time stamping hit pixels, storing their xy coordinates, and storing the analog information within the pixel. The peripheral logic located on the array, permits the selection of those pixels containing interesting data and their coordinates to be selectively read out. This same logic also resolves ambiguous pixel ghost locations and controls the pixel neighbor read out necessary to achieve high spatial resolution. The thermal design of the vertex tracker and the proposed signal processing architecture will also be discussed. 5 refs., 13 figs., 3 tabs

A gas pixel detector for X-ray imaging

International Nuclear Information System (INIS)

Bateman, J.E.; Connolly, J.F.

1991-11-01

A simple, robust form of gas pixel detector is discussed which is based on the use of electronic connector pins as the gain elements. With a rate capability of >10 5 counts/s per pin, an X-ray imaging detector system capable of counting at global rates of the order of 10 10 counts/s is foreseen. (author)

Silicon pixel R&D for the CLIC detector

CERN Document Server

AUTHOR|(SzGeCERN)674552

2017-01-01

The physics aims at the future CLIC high-energy linear $e^{+}e^{−}$ collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The main challenges are: a point resolution of a few microns, ultra-low mass (~0.2% X$_{0}$ per layer for the vertex region and ~1% X$_{0}$ per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ~10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hybrid pixel detectors with small pitch (25 μm) and analogue readout are explored. For the outer tra...

Operational experience of ATLAS SCT and Pixel Detector

CERN Document Server

Kocian, Martin; The ATLAS collaboration

2017-01-01

The ATLAS Inner Detector based on silicon sensors is consisting of a strip detector (SCT) and a pixel detector. It is the crucial component for vertexing and tracking in the ATLAS experiment. With the excellent performance of the LHC well beyond the original specification the silicon tracking detectors are facing substantial challenges in terms of data acquisition, radiation damage to the sensors, and SEUs in the readout ASICs. The approaches on how the detector systems cope with the demands of high luminosity operation while maintaining excellent performance through hardware upgrades, software and firmware algorithms, and operational settings, are presented.

Planar sensors for the upgrade of the CMS pixel detector

International Nuclear Information System (INIS)

Rohe, T.; Bean, A.; Radicci, V.; Sibille, J.

2011-01-01

A replacement of the present CMS pixel detector with a better performing light weight four-layer system is foreseen in 2016. In the lifetime of this new system the LHC will reach and exceed its nominal luminosity of 10 34 cm -2 s -1 . Therefore the radiation hardness of all parts of the pixel system has to be reviewed. For the construction of the much larger four-layer pixel system, the replacement of the present double sided sensors by much cheaper single sided ones is considered. However, the construction of pixel modules with such sensors is challenging due to the small geometrical distance of the sensor high voltage and the ground of the readout electronics. This small distance limits the sensor bias to about 500 V in the tested samples.

CMOS Pixel Sensors for High Precision Beam Telescopes and Vertex Detectors

International Nuclear Information System (INIS)

Masi, R. de; Baudot, J.; Fontaine, J.-Ch.

2009-01-01

CMOS sensors of the MIMOSA (standing for Minimum Ionising particle MOS Active pixel sensor) series are developed at IPHC since a decade and have ended up with full scale devices used in beam telescopes and in demonstrators of future vertex detectors. The sensors deliver analogue, unfiltered, signals and are therefore limited to read-out frequencies of ∼ 1 kframe/s. Since a few years, a fast architecture is being developed in collaboration with IRFU, which aims to speed up the read-out by 1-2 orders of magnitude. The first full scale sensor based on this architecture was fabricated recently and is being tested. Made of 660,000 pixels (18 μm pitch) covering an active area of ∼ 2 cm 2 , it delivers zero-suppressed binary signals, which allow running at ∼ 10 kframes/s. It will equip the beam telescope of the E.U. project EUDET and serve as a forerunner of the sensor equipping the 2 layers of the PIXEL detector of the STAR experiment at RHIC. The contribution to the conference will overview the main features and test results of this pioneering sensor. It will next describe its evolution towards read-out frequencies approaching 100 kframes/s, as required for the vertex detectors of the CBM experiment at FAIR and at the ILC. Finally, the issue of radiation tolerance will be addressed, in the context of a newly available CMOS process using a depleted substrate. A prototype sensor was fabricated in a such CMOS process. The talk will summarise beam test results showing, for the first time, that fluences of 10 14 n eq /cm 2 may be tolerable for CMOS sensors. Overall, the talk provides an overview of the status and plans of CMOS pixel sensors at the frontier of their achievements and outreach. (author)

Limits in point to point resolution of MOS based pixels detector arrays

Science.gov (United States)

Fourches, N.; Desforge, D.; Kebbiri, M.; Kumar, V.; Serruys, Y.; Gutierrez, G.; Leprêtre, F.; Jomard, F.

2018-01-01

In high energy physics point-to-point resolution is a key prerequisite for particle detector pixel arrays. Current and future experiments require the development of inner-detectors able to resolve the tracks of particles down to the micron range. Present-day technologies, although not fully implemented in actual detectors, can reach a 5-μm limit, this limit being based on statistical measurements, with a pixel-pitch in the 10 μm range. This paper is devoted to the evaluation of the building blocks for use in pixel arrays enabling accurate tracking of charged particles. Basing us on simulations we will make here a quantitative evaluation of the physical and technological limits in pixel size. Attempts to design small pixels based on SOI technology will be briefly recalled here. A design based on CMOS compatible technologies that allow a reduction of the pixel size below the micrometer is introduced here. Its physical principle relies on a buried carrier-localizing collecting gate. The fabrication process needed by this pixel design can be based on existing process steps used in silicon microelectronics. The pixel characteristics will be discussed as well as the design of pixel arrays. The existing bottlenecks and how to overcome them will be discussed in the light of recent ion implantation and material characterization experiments.

Gas Pixel Detectors for low energy X-ray polarimetry

International Nuclear Information System (INIS)

Spandre, Gloria

2007-01-01

Gas Pixel Detectors are position-sensitive proportional counters in which a complete integration between the gas amplification structure and the read-out electronics has been reached. Various generation of Application-Specific Integrated Circuit (ASIC) have been designed in deep submicron CMOS technology to realize a monolithic device which is at the same time the charge collecting electrode and the analog amplifying and charge measuring front-end electronics. The experimental response of a detector with 22060 pixels at 80 μm pitch to polarized and un-polarized X-ray radiation is shown and the application of this device for Astronomical X-ray Polarimetry discussed

Initial Measurements On Pixel Detector Modules For The ATLAS Upgrades

CERN Document Server

Gallrapp, C; The ATLAS collaboration

2011-01-01

Sophisticated conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming pixel detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation, which give a first impression on the charge collection properties of the different sensor technologies are presented.

Charge loss between contacts of CdZnTe pixel detectors

CERN Document Server

Bolotnikov, A E; Harrison, F A; Wong, A S; Schindler, S M; Eichelberger, A C

1999-01-01

The surface of Cd sub 1 sub - sub x Zn sub x Te (CZT) material has high resistivity but is not a perfect dielectric. Even a small surface conductivity can affect the electric field distribution, and therefore, the charge collection efficiency of a CZT pixel detector. The paper describes studies of this phenomenon for several contact configurations made on a single CZT detector. We have determined the maximum inter-contact separation at which the surface inter-pixel charge loss can be neglected. (author)

Optical readout in a multi-module system test for the ATLAS pixel detector

International Nuclear Information System (INIS)

Flick, Tobias; Becks, Karl-Heinz; Gerlach, Peter; Kersten, Susanne; Maettig, Peter; Nderitu Kirichu, Simon; Reeves, Kendall; Richter, Jennifer; Schultes, Joachim

2006-01-01

The innermost part of the ATLAS experiment at the LHC, CERN, will be a pixel detector, which is presently under construction. The command messages and the readout data of the detector are transmitted over an optical data path. The readout chain consists of many components which are produced at several locations around the world, and must work together in the pixel detector. To verify that these parts are working together as expected a system test has been built up. It consists of detector modules, optoboards, optical fibres, Back of Crate cards, Readout Drivers, and control computers. In this paper, the system test setup and the operation of the readout chain are described. Also, some results of tests using the final pixel detector readout chain are given

An EUDET/AIDA Pixel Beam Telescope for Detector Development

CERN Document Server

Perrey, Hanno

2013-01-01

A high resolution ($\\sigma 2 \\sim \\mu$) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. The telescope consists of six sensor planes using Mimosa26 MAPS with a pixel pitch of $18.4 \\mu$ and thinned down to $50 \\mu$. The excellent resolution, readout rate and DAQ integration capabilities made the telescope a primary test beam tool for many groups including several CERN based experiments. Within the new European detector infrastructure project AIDA the test beam telescope will be further extended in terms of cooling infrastructure, readout speed and precision. In order to provide a system optimized for the different requirements by the user community, a combination of various pixel technologies is foreseen. In this report the design of this even more flexible telescope with three different pixel technologies (TimePix, Mimosa, ATLAS FE-I4) will be presented. First test beam results with the HitOR signal provided by the FE-I4 integrated into the trigger...

A new generation of small pixel pitch/SWaP cooled infrared detectors

Science.gov (United States)

Espuno, L.; Pacaud, O.; Reibel, Y.; Rubaldo, L.; Kerlain, A.; Péré-Laperne, N.; Dariel, A.; Roumegoux, J.; Brunner, A.; Kessler, A.; Gravrand, O.; Castelein, P.

2015-10-01

Following clear technological trends, the cooled IR detectors market is now in demand for smaller, more efficient and higher performance products. This demand pushes products developments towards constant innovations on detectors, read-out circuits, proximity electronics boards, and coolers. Sofradir was first to show a 10μm focal plane array (FPA) at DSS 2012, and announced the DAPHNIS 10μm product line back in 2014. This pixel pitch is a key enabler for infrared detectors with increased resolution. Sofradir recently achieved outstanding products demonstrations at this pixel pitch, which clearly demonstrate the benefits of adopting 10μm pixel pitch focal plane array-based detectors. Both HD and XGA Daphnis 10μm products also benefit from a global video datapath efficiency improvement by transitioning to digital video interfaces. Moreover, innovative smart pixels functionalities drastically increase product versatility. In addition to this strong push towards a higher pixels density, Sofradir acknowledges the need for smaller and lower power cooled infrared detector. Together with straightforward system interfaces and better overall performances, latest technological advances on SWAP-C (Size, Weight, Power and Cost) Sofradir products enable the advent of a new generation of high performance portable and agile systems (handheld thermal imagers, unmanned aerial vehicles, light gimbals etc...). This paper focuses on those features and performances that can make an actual difference in the field.

A pixel detector for the protein crystallography beamline at the SLS

CERN Document Server

Brönnimann, C; Eikenberry, E F; Fischer, P; Florin, S; Horisberger, R P; Lindner, Manfred; Schmitt, B; Schulze, C

2002-01-01

At the Paul Scherrer Institute a new synchrotron light source is currently under construction, the Swiss Light Source (SLS), which will be operational in summer 2001. Among the first beamlines is a high brightness, micro-focusing protein crystallography beamline. It will be equipped with a pixel detector, which has several features of interest for the next generation of protein crystallography detectors. The point spread function and the effect of charge sharing was measured with a prototype detector in a test experiment at the European Synchrotron Radiation Facility in Grenoble. The concepts of the SLS pixel detector is presented as well as test results from radiation hard prototype chips.

Characterization of imaging pixel detectors of Si and CdTe read out with the counting X-ray chip MPEC 2.3

International Nuclear Information System (INIS)

Loecker, M.

2007-04-01

Single photon counting detectors with Si- and CdTe-sensors have been constructed and characterized. As readout chip the MPEC 2.3 is used which consists of 32 x 32 pixels with 200 x 200 μm 2 pixel size and which has a high count rate cabability (1 MHz per pixel) as well as a low noise performance (55 e - ). Measurements and simulations of the detector homogeneity are presented. It could be shown that the theoretical maximum of the homogeneity is reached (quantum limit). By means of the double threshold of the MPEC chip the image contrast can be enhanced which is demonstrated by measurement and simulation. Also, multi-chip-modules consisting of 4 MPEC chips and a single Si- or CdTe-sensor have been constructed and successfully operated. With these modules modulation-transfer-function measurements have been done showing a good spatial resolution of the detectors. In addition, multi-chip-modules according to the Sparse-CMOS concept have been built and tests characterizing the interconnection technologies have been performed

Development of a counting pixel detector for 'Digitales Roentgen'

International Nuclear Information System (INIS)

Lindner, M.

2001-08-01

The development of a single photon counting X-ray imaging detector for medical applications using hybrid pixel detectors is reported. The electronics development from the first prototype derived from detector development for particle physics experiments (ATLAS) to the imaging chip MPEC (multi picture element counters) for medical applications is described. This chip consists of 32 x 32 pixels of 200 μm x 200 μm size, each containing the complete read out electronics, i.e. an amplifier, two discriminators with adjustable thresholds and two 18-bit linear feedback shift-counters allowing energy windowing for contrast increase. Results on electronics performance are shown as well as measurements with several semiconductor materials (Si, GaAs, CdTe). Important aspects like detection efficiency, sensor homogeneity, linearity and spatial resolution are discussed. (orig.)

Data acquisition at the front-end of the Mu3e pixel detector

Energy Technology Data Exchange (ETDEWEB)

Perrevoort, Ann-Kathrin [Physikalisches Institut, Universitaet Heidelberg (Germany); Collaboration: Mu3e-Collaboration

2016-07-01

The Mu3e experiment - searching for the lepton-flavour violating decay of the muon into three electrons at an unprecedented sensitivity of one in 10{sup 16} decays - is based on a pixel tracking detector. The sensors are High-Voltage Monolithic Active Pixel Sensors, a technology which allows for very fast and thin detectors, and thus is an ideal fit for Mu3e where the trajectories of low-momentum electrons at high rates are to be measured. The detector will consist of about 275 million pixels and will be operated at up to 10{sup 9} muon stops per second. Therefore, a fast and trigger-less data readout is required. The pixel sensors feature zero-suppressed data output via high-speed serial links. The data is then buffered and sorted by time on a FPGA on the front-end before being processed to the following readout stage. In this talk, the readout of the Mu3e pixel detector at the front-end is introduced. Furthermore, a first firmware implementation of this concept in a beam telescope consisting of the current pixel sensor prototype MuPix7 is presented.

DEPFET active pixel detectors for a future linear $e^+e^-$ collider

CERN Document Server

Alonso, O; Dieguez, A; Dingfelder, J; Hemperek, T; Kishishita, T; Kleinohl, T; Koch, M; Krueger, H; Lemarenko, M; Luetticke, F; Marinas, C; Schnell, M; Wermes, N; Campbell, A; Ferber, T; Kleinwort, C; Niebuhr, C; Soloviev, Y; Steder, M; Volkenborn, R; Yaschenko, S; Fischer, P; Kreidl, C; Peric, I; Knopf, J; Ritzert, M; Curras, E; Lopez-Virto, A; Moya, D; Vila, I; Boronat, M; Esperante, D; Fuster, J; Garcia Garcia, I; Lacasta, C; Oyanguren, A; Ruiz, P; Timon, G; Vos, M; Gessler, T; Kuehn, W; Lange, S; Muenchow, D; Spruck, B; Frey, A; Geisler, C; Schwenker, B; Wilk, F; Barvich, T; Heck, M; Heindl, S; Lutz, O; Mueller, Th; Pulvermacher, C; Simonis, H.J; Weiler, T; Krausser, T; Lipsky, O; Rummel, S; Schieck, J; Schlueter, T; Ackermann, K; Andricek, L; Chekelian, V; Chobanova, V; Dalseno, J; Kiesling, C; Koffmane, C; Gioi, L.Li; Moll, A; Moser, H.G; Mueller, F; Nedelkovska, E; Ninkovic, J; Petrovics, S; Prothmann, K; Richter, R; Ritter, A; Ritter, M; Simon, F; Vanhoefer, P; Wassatsch, A; Dolezal, Z; Drasal, Z; Kodys, P; Kvasnicka, P; Scheirich, J

2013-01-01

The DEPFET collaboration develops highly granular, ultra-transparent active pixel detectors for high-performance vertex reconstruction at future collider experiments. The characterization of detector prototypes has proven that the key principle, the integration of a first amplification stage in a detector-grade sensor material, can provide a comfortable signal to noise ratio of over 40 for a sensor thickness of 50-75 $\\mathrm{\\mathbf{\\mu m}}$. ASICs have been designed and produced to operate a DEPFET pixel detector with the required read-out speed. A complete detector concept is being developed, including solutions for mechanical support, cooling and services. In this paper the status of DEPFET R & D project is reviewed in the light of the requirements of the vertex detector at a future linear $\\mathbf{e^+ e^-}$ collider.

Operational experience with the CMS pixel detector in LHC Run II

CERN Document Server

Karancsi, Janos

2016-01-01

The CMS pixel detector was repaired successfully, calibrated and commissioned for the second run of Large Hadron Collider during the first long shutdown between 2013 and 2015. The replaced pixel modules were calibrated separately and show the expected behavior of an un-irradiated detector. In 2015, the system performed very well with an even improved spatial resolution compared to 2012. During this time, the operational team faced various challenges including the loss of a sector in one half shell which was only partially recovered. In 2016, the detector is expected to withstand instantaneous luminosities beyond the design limits and will need a combined effort of both online and offline teams in order to provide the high quality data that is required to reach the physics goals of CMS. We present the operational experience gained during the second run of the LHC and show the latest performance results of the CMS pixel detector.

Low mass hybrid pixel detectors for the high luminosity LHC upgrade

Energy Technology Data Exchange (ETDEWEB)

Gonella, Laura

2013-10-15

Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

Low mass hybrid pixel detectors for the high luminosity LHC upgrade

International Nuclear Information System (INIS)

Gonella, Laura

2013-10-01

Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

Three-dimensional cascaded system analysis of a 50 µm pixel pitch wafer-scale CMOS active pixel sensor x-ray detector for digital breast tomosynthesis.