WorldWideScience

Sample records for machinery refrigerators solder

  1. 46 CFR 58.20-15 - Installation of refrigerating machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Installation of refrigerating machinery. 58.20-15... AND AUXILIARY MACHINERY AND RELATED SYSTEMS Refrigeration Machinery § 58.20-15 Installation of refrigerating machinery. (a) Where refrigerating machines are installed in which anhydrous ammonia is used as...

  2. Performance of refrigerating machineries with new refrigerants; Performance des machines frigorifiques avec les nouveaux refrigerants

    Energy Technology Data Exchange (ETDEWEB)

    Bailly, A.; Jurkowski, R. [CIAT, 01 - Culoz (France)

    1997-12-31

    This paper reports on a comparative study of the thermal performances of different refrigerants like R-22, R-134a, R-404A and R-407C when used as possible substitutes for the HCFC22 refrigerant in a given refrigerating machinery equipped with compact high performance plate exchangers. Thermal performances are compared in identical operating conditions. The behaviour of the two-phase exchange coefficient is analyzed with respect to the different parameters. The composition of the mixture after one year of operation has been analyzed too and the influence of oil on the performances is studied. (J.S.)

  3. Recent evolutions of refrigerating machineries and heat pumps; Evolutions recentes des machines a froid et thermopompes

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-12-31

    This book of proceedings reports on 10 papers (or series of transparencies) concerning some recent developments about refrigerating machineries and heat pumps as used in space heating, air-conditioning and industrial refrigeration. Various aspects are developed: thermodynamic cycles, thermal performances, dimensioning, modeling, refrigerants substitution, design of flanged exchangers, compressors etc.. (J.S.)

  4. Thermo-refrigerating machineries. Classification; Machines thermofrigorifiques. Classification

    Energy Technology Data Exchange (ETDEWEB)

    Duminil, M. [Association Francaise du Froid (AFF), 75 - Paris (France)

    2002-07-01

    Thermo-refrigerating systems transfer the heat extracted from a cold source towards a heat source and consume thermal energy from a third source. This article proposes a classification of thermo-refrigerating systems in three categories: the systems with a changing state working fluid (physical change of the refrigerant: dissociable systems, integrated systems (ejection systems, sorption systems); chemical change of the refrigerant), the systems where the working fluid stays in the same physical state (dissociable systems (Brayton, Siemens, Stirling and Ericsson cycles), integrated systems (Vuilleumier cycle systems, thermochemical systems)) and the other systems (Seebeck thermoelectric generator with Peltier effect modules). Dissociable thermo-refrigerating systems are made of the grouping of two separate thermal machines: a thermal engine and a mechanical-refrigerating machine. (J.S.)

  5. Compression-absorption (resorption) refrigerating machinery. Modeling of reactors; Machine frigorifique a compression-absorption (resorption). Modelisation des reacteurs

    Energy Technology Data Exchange (ETDEWEB)

    Lottin, O.; Feidt, M.; Benelmir, R. [LEMTA-UHP Nancy-1, 54 - Vandoeuvre-les-Nancy (France)

    1997-12-31

    This paper is a series of transparencies presenting a comparative study of the thermal performances of different types of refrigerating machineries: di-thermal with vapor compression, tri-thermal with moto-compressor, with ejector, with free piston, adsorption-type, resorption-type, absorption-type, compression-absorption-type. A prototype of ammonia-water compression-absorption heat pump is presented and modeled. (J.S.)

  6. Machinery

    Institute of Scientific and Technical Information of China (English)

    2008-01-01

    @@ China Council for the Promotion of International Trade, Machin-ery Sub-Council (referred to as CCPIT MSC) & China Chamber of International Commerce, Machinery Chamber of Commerce was founded in 1988 as one of the first group of industrial trade promotion agencies approved by the governing authorities of China.

  7. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  8. Wave soldering with Pb-free solders

    Energy Technology Data Exchange (ETDEWEB)

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1995-07-01

    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  9. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  10. Solderability test system

    Energy Technology Data Exchange (ETDEWEB)

    Yost, Fred (Cedar Crest, NM); Hosking, Floyd M. (Albuquerque, NM); Jellison, James L. (Albuquerque, NM); Short, Bruce (Beverly, MA); Giversen, Terri (Beverly, MA); Reed, Jimmy R. (Austin, TX)

    1998-01-01

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  11. Solderability test system

    Energy Technology Data Exchange (ETDEWEB)

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

    1998-10-27

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  12. Reduced oxide soldering activation (ROSA) PWB solderability testing

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Hosking, F.M. [Sandia National Labs., Albuquerque, NM (United States). Physical and Joining Metallurgy Dept.; Reed, J. [Texas Instruments, Austin, TX (United States); Tench, D.M.; White, J. [Rockwell Science Center, Thousand Oaks, CA (United States)

    1996-02-01

    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  13. Lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, Iver E. (Ames, IA); Terpstra, Robert L. (Ames, IA)

    2001-05-15

    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  14. Removing Dross From Molten Solder

    Science.gov (United States)

    Webb, Winston S.

    1990-01-01

    Automatic device helps to assure good solder connections. Machine wipes dross away from area on surface of molten solder in pot. Sweeps across surface of molten solder somewhat in manner of windshield wiper. Each cycle of operation triggered by pulse from external robot. Equipment used wherever precise, automated soldering must be done to military specifications.

  15. Solder dross removal apparatus

    Science.gov (United States)

    Webb, Winston S. (Inventor)

    1992-01-01

    An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

  16. 46 CFR 58.20-20 - Refrigeration piping.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Refrigeration piping. 58.20-20 Section 58.20-20 Shipping... AND RELATED SYSTEMS Refrigeration Machinery § 58.20-20 Refrigeration piping. (a) All piping materials... chemical and physical properties as to remain ductile at the lowest operating temperature. (b)...

  17. Low temperature aluminum soldering analysis

    Energy Technology Data Exchange (ETDEWEB)

    Peterkort, W.G.

    1976-09-01

    The investigation of low temperature aluminum soldering included the collection of spread factor and dihedral angle data for several solder alloys and a study of flux effects on aluminum. Selected solders were subjected to environmental tests and evaluated on the basis of tensile strength, joint resistance, visual appearance, and metallurgical analysis. A production line method for determining adequate flux removal was developed.

  18. Malone refrigeration

    Science.gov (United States)

    Swift, G. W.

    Malone refrigeration is the use of a liquid near its critical point, without evaporation, as the working fluid in a refrigeration cycle such as the Stirling cycle. We discuss relevant properties of appropriate liquids, and we describe two Malone refrigerators. The first, which was completed several years ago, established the basic principles of use for liquids in such cycles. The second, now under construction, is a linear, free-piston machine.

  19. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

    Institute of Scientific and Technical Information of China (English)

    HAN Zong-jie; XUE Song-bai; WANG Jian-xin; ZHANG Xin; ZHANG Liang; YU Sheng-lin; WANG Hui

    2008-01-01

    Soldering experiments of quad flat package(QFP) devices were carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also with infrared reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed laser soldering time, an optimal power exists, while the optimal mechanical properties of QFP micro-joints are gained. Mechanical properties of QFP micro-joints soldered with laser soldering system are better than those of QFP micro-joints soldered with IR reflow soldering method. Fracture morphologies of QFP micro-joints soldered with laser soldering system exhibit the characteristic of tough fracture, and homogeneous and fine dimples appear under the optimal laser output power.

  20. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...... bonds were consistently found to be mechanically stronger than the carbon nanotubes....

  1. Capillary flow solder wettability test

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Rejent, J.A.

    1996-01-01

    A test procedure was developed to assess the capillary flow wettability of solders inside of a confined geometry. The test geometry was comprised of two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm, and 0.038 cm). Capillary flow was assessed by: (1) the meniscus or capillary rise of the solder within the gap, (2) the extent of void formation in the gap, and (3) the time-dependence of the risen solder film. Tests were performed with the lead-free solders.

  2. Refrigeration Showcases

    Science.gov (United States)

    1997-01-01

    Through the Technology Affiliates Program at the Jet Propulsion Laboratory (JPL), valuable modifications were made to refrigerator displays built by Displaymor Manufacturing Company, Inc. By working with JPL, Displaymor could address stiffer requirements that ensure the freshness of foods. The application of the space technology meant that the small business would be able to continue to market its cases without incurring expenses that could threaten the viability of the business, and the future of several dozen jobs. Research and development improvements in air flow distribution and refrigeration coil technology contributed greatly to certifying Displaymor's showcases given the new federal regulations. These modifications resulted in a refrigerator case that will keep foods cooler, longer. Such changes maintained the openness of the display, critical to customer visibility and accessibility, impulse buying, and cross-merchandising.

  3. Refrigeration Servicing.

    Science.gov (United States)

    Hamilton, Donald L.; And Others

    This self-study course is designed to familiarize Marine enlisted personnel with the services required to be performed on refrigeration equipment. The course contains four study units. Each study unit begins with a general objective, which is a statement of what the student should learn from the unit. The study units are divided into numbered work…

  4. Soldering Formalism Theory and Applications

    CERN Document Server

    Wotzasek, C

    1998-01-01

    The soldering mechanism is a new technique to work with distinct manifestations of dualities that incorporates interference effects, leading to new physical results that includes quantum contributions. This approach was used to investigate the cases of electromagnetic dualities, and $D\\geq 2$ bosonization. In the former context this technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. The soldered actions in any dimension leads to a master action which is duality invariant under a much bigger set of symmetries. The effects of coupling to gravity are also elaborated. In the later context, a technique is developed that solders the dual aspects of some symmetry following from the bosonisation of two distinct fermionic models, leading to new results which cannot be otherwise obtained. Exploiting this technique, the two dimensional chiral determinants with opposite chirality are soldered to reproduce either the usu...

  5. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  6. Wetting behavior of alternative solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    1993-07-01

    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  7. Refrigeration and Food Safety

    Science.gov (United States)

    ... Standard Forms FSIS United States Department of Agriculture Food Safety and Inspection Service About FSIS District Offices Careers ... Viewer (JSR 286) Actions ${title} Loading... Refrigeration and Food Safety History of Refrigeration Importance of Refrigeration Types of ...

  8. Managing Refrigerant Emissions

    Science.gov (United States)

    Access information on EPA's efforts to address ozone layer depletion by reducing emissions of refrigerants from stationary refrigeration and air conditioning systems and motor vehicle air conditioning systems.

  9. Solder Joint Health Monitoring Testbed

    Science.gov (United States)

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.

    2009-01-01

    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  10. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  11. REACH. Refrigeration Units.

    Science.gov (United States)

    Snow, Rufus; And Others

    As a part of the REACH (Refrigeration, Electro-Mechanical, Air-Conditioning, Heating) electromechanical cluster, this student manual contains individualized instructional units in the area of refrigeration. The instructional units focus on refrigeration fundamentals, tubing and pipe, refrigerants, troubleshooting, window air conditioning, and…

  12. Stirling Refrigerator

    Science.gov (United States)

    Kagawa, Noboru

    A Stirling cooler (refrigerator) was proposed in 1862 and the first Stirling cooler was put on market in 1955. Since then, many Stirling coolers have been developed and marketed as cryocoolers. Recently, Stirling cycle machines for heating and cooling at near-ambient temperatures between 173 and 400K, are recognized as promising candidates for alternative system which are more compatible with people and the Earth. The ideal cycles of Stirling cycle machine offer the highest thermal efficiencies and the working fluids do not cause serious environmental problems of ozone depletion and global warming. In this review, the basic thermodynamics of Stirling cycle are briefly described to quantify the attractive cycle performance. The fundamentals to realize actual Stirling coolers and heat pumps are introduced in detail. The current status of the Stirling cycle machine technologies is reviewed. Some machines have almost achieved the target performance. Also, duplex-Stirling-cycle and Vuilleumier-cycle machines and their performance are introduced.

  13. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1996-11-15

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  14. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1996-07-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  15. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M. [Calm (James M.), Great Falls, VA (United States)

    1999-01-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilities access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  16. Development of 18 K helium refrigeration system for CERN

    CERN Document Server

    CERN. Geneva

    2004-01-01

    The Conseil Europeen pour Ia Recherche Nucleaire (CERN) placed an order for a 1.8 K helium refrigeration system with IHI for the Large Hadron Collider project in 1999. IHI formed a consortium with Linde Kryotechnik AG (Switzerland), which has long experience with helium refrigeration systems. IHI designed and manufactured cold compressors based on leading technologies and expertise for turbo machinery. The cold compressor has the highest efficiency in the world. This paper describes the 1.8 K helium refrigeration system and performance test results at CERN. (5 refs).

  17. Refrigerating machine oil

    Energy Technology Data Exchange (ETDEWEB)

    Nozawa, K.

    1981-03-17

    Refrigerating machine oil to be filled in a sealed motorcompressor unit constituting a refrigerating cycle system including an electric refrigerator, an electric cold-storage box, a small-scaled electric refrigerating show-case, a small-scaled electric cold-storage show-case and the like, is arranged to have a specifically enhanced property, in which smaller initial driving power consumption of the sealed motor-compressor and easier supply of the predetermined amount of the refrigerating machine oil to the refrigerating system are both guaranteed even in a rather low environmental temperature condition.

  18. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  19. Die Soldering in Aluminium Die Casting

    Energy Technology Data Exchange (ETDEWEB)

    Han, Q.; Kenik, E.A.; Viswanathan, S.

    2000-03-15

    Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-rich phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.

  20. Improving machinery reliability

    CERN Document Server

    Bloch, Heinz P

    1998-01-01

    This totally revised, updated and expanded edition provides proven techniques and procedures that extend machinery life, reduce maintenance costs, and achieve optimum machinery reliability. This essential text clearly describes the reliability improvement and failure avoidance steps practiced by best-of-class process plants in the U.S. and Europe.

  1. ARTI Refrigerant Database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M. [Calm (James M.), Great Falls, VA (United States)

    1994-05-27

    The Refrigerant Database consolidates and facilitates access to information to assist industry in developing equipment using alternative refrigerants. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  2. Study on laser and hot air reflow soldering of PBGA solder ball

    Institute of Scientific and Technical Information of China (English)

    田艳红; 王春青

    2002-01-01

    Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn4 layer and remnant Au element. Needle-like AuSn4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni3Sn4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.

  3. Development of Magnetic Refrigerator

    Science.gov (United States)

    Ogiwara, Hiroyasu; Nakagome, Hideki; Kuriyama, Tohru

    A series of R & D of magnetic refrigerators has been done in order to realize an advanced type cryocooler for superconducting magnets of maglev trains and MRI medical system. As a result of efforts on both the magnetic refrigerator and superconducting magnets, a parasitic type magnetic refrigeration system was proposed.

  4. WETTABILITY STUDIES OF LEAD-FREE SOLDERS

    African Journals Online (AJOL)

    2012-03-01

    Mar 1, 2012 ... Based on this, a wettability test using copper grid was conducted on the solder alloys produced. The result shows that wetting time varied from 4 seconds to 5 seconds for the lead-free solders ... at the interfaces [4]. This study ...

  5. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  6. Magnetic refrigeration materials

    Institute of Scientific and Technical Information of China (English)

    戴闻; 沈保根; 高政祥

    2001-01-01

    Magnetic refrigeration has drawn much attention because of its greater efficiency and higher reliability than the traditional gas-cycle refrigeration technology. Recently, a kind of new materials with a giant magnetocaloric effect in the subroom temperature range, Gd5 (Six Ge1- x)4, was discovered, which boosts the search for high-performance magnetic refrigerants. However, the intermetallic compounds Gd5 (SixGe1 - x )4 belong to the first order transition materials; their performance in practical magnetic refrigeration cycles remains controversial. In this paper the developing tendency of the refrigerants are discussed on the basis of our work.

  7. Low cycle fatigue of lead free solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Schemmann, Lars; Wedi, Andre; Baither, Dietmar; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Muenster (Germany)

    2011-07-01

    Presently solders containing lead are banned from consumer electronics. Important alternatives are the Sn-Ag-Cu (SAC) solders and solders containing antimony. This work studies the isothermal low cycle fatigue properties of SAC solders and the SnSb(8) solder. For the experiments, model solder joints were produced and used. They consist of two pure copper plates joined together by a circular disk of solder. Low cycle fatigue experiments were done under displacement control. Furthermore hardness was tested by a micro indenter. In order to find an explanation for the different lifetimes of the solders, several micro structural investigations were performed. For this we used transmission and scanning electron microscopy as well as optical microscopy. The measured data showed a strong relation between lifetime and hardness of the solder alloy. We also found, that the type of solder influences the crack propagation.

  8. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    Science.gov (United States)

    2005-09-01

    controlled fatigue life, likely because of increased void -nucleation via creep-fatigue interactions. Since the solder is largely under strain-controlled...to plastically deform the solder in order to break the oxide layers and eliminate some minor voids around the NiTi particles. Figure 32... Underfill Constraint Effects during Thermomechanical Cycling of Flip Chip Solder Joints,” Journal of Electronic Materials, Vol. 31, No. 4, 2002

  9. About Solar Refrigeration

    Directory of Open Access Journals (Sweden)

    Laura Coroiu

    2008-05-01

    Full Text Available This paper has the purpose to unfold the results of all researches which proved before that the solar energy constitutes itself as an ideal resource for heating application that necessitate lower temperature,e.g. the heating of a certain space or the preparation ofthe domestic hot water. The refrigeration systems, which are based on the nontoxic refrigerants for the environment, offer a sustained advantage when compared to the other types of the refrigerants. But, whichever might be the case, the use of the energy associated to the operation of the refrigeration system and with the impact that it has upon the environment, as well as the association with its production and distribution, have often a bigger importance than the selection of the refrigerant. In order to minimize the impact which the operation of the refrigeration systems exerts upon the environment, it is recommended that there should be checked all thepossibilities of using a pure source of energy.

  10. Lead Ingestion Hazard in Hand Soldering Environments.

    Science.gov (United States)

    1984-05-01

    RD-Ai45 663 LEAD INGESTION HAZARD IN HAND SOLDERING ENVIRONMENTS i/i (U) NAVAL WEAPONS CENTER CHINA LAKE CA E R MONSALVE MAY 84 NWC-TP-6545...6545 Lead Ingestion Hazard in Hand Soldering Environments (JD CD I) by Elisabeth R. Monsalve a y- Safety and Security Department I MAY 1984 NAVAL...COVERED LEAD INGESTION HAZARD IN HAND SOLDERING ENVIRONMENTS A summary report 6. PERFORMING ONG. REPORT NUMBER 7. AUTHOR(q) I. CONTRACT O GRANT NUM6ERt

  11. Cavitation in Hydraulic Machinery

    Energy Technology Data Exchange (ETDEWEB)

    Kjeldsen, M.

    1996-11-01

    The main purpose of this doctoral thesis on cavitation in hydraulic machinery is to change focus towards the coupling of non-stationary flow phenomena and cavitation. It is argued that, in addition to turbulence, superimposed sound pressure fluctuations can have a major impact on cavitation and lead to particularly severe erosion. For the design of hydraulic devices this finding may indicate how to further limit the cavitation problems. Chapter 1 reviews cavitation in general in the context of hydraulic machinery, emphasizing the initial cavitation event and the role of the water quality. Chapter 2 discusses the existence of pressure fluctuations for situations common in such machinery. Chapter 3 on cavitation dynamics presents an algorithm for calculating the nucleation of a cavity cluster. Chapter 4 describes the equipment used in this work. 53 refs., 55 figs.,10 tabs.

  12. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1997-02-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alterative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included, though some may be added at a later date. The database identifies sources of specific information on various refrigerants. It addresses lubricants including alkylbenzene, polyalkylene glycol, polyolester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents. They are included to accelerate availability of the information and will be completed or replaced in future updates.

  13. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M. [Calm (James M.), Great Falls, VA (United States)

    1998-08-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufactures and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included, though some may be added at a later date. The database identifies sources of specific information on many refrigerants including propane, ammonia, water, carbon dioxide, propylene, ethers, and others as well as azeotropic and zeotropic blends of these fluids. It addresses lubricants including alkylbenzene, polyalkylene glycol, polyolester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents. They are included to accelerate availability of the information and will be completed or replaced in future updates.

  14. Modeling the diffusion of solid copper into liquid solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Rizvi, M.J. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)], E-mail: rm77@gre.ac.uk; Lu, H.; Bailey, C. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)

    2009-01-01

    During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn-Pb and Sn-Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn-Pb solder is 2.74 x 10{sup -10} m{sup 2}/s and for Sn-Cu solder is 6.44 x 10{sup -9} m{sup 2}/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.

  15. Organic solderability preservation evaluation. Topical report

    Energy Technology Data Exchange (ETDEWEB)

    Becka, G.A.; McHenry, M.R.; Slanina, J.T.

    1997-03-01

    An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.

  16. Soldering Chiralities; 2, Non-Abelian Case

    CERN Document Server

    Wotzasek, C

    1996-01-01

    We study the non-abelian extension of the soldering process of two chiral WZW models of opposite chiralities, resulting in a (non-chiral) WZW model living in a 2D space-time with non trivial Riemanian curvature.

  17. Shrink-Fit Solderable Inserts Seal Hermetically

    Science.gov (United States)

    Croucher, William C.

    1992-01-01

    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  18. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  19. Bacterial mitotic machineries

    DEFF Research Database (Denmark)

    Gerdes, Kenn; Møller-Jensen, Jakob; Ebersbach, Gitte

    2004-01-01

    Here, we review recent progress that yields fundamental new insight into the molecular mechanisms behind plasmid and chromosome segregation in prokaryotic cells. In particular, we describe how prokaryotic actin homologs form mitotic machineries that segregate DNA before cell division. Thus, the P...

  20. Temperature versus time curves for manual and automated soldering processes

    Energy Technology Data Exchange (ETDEWEB)

    Trent, M.A.

    1978-08-01

    Temperature-versus-time curves were recorded for various electronic components during pre-tinning, hand soldering, and drag soldering operations to determine the temperature ranges encountered. The component types investigated included a wide range of electronic assemblies. The data collected has been arranged by process and will help engineers to: (1) predetermine the thermal profile to which various components are subjected during the soldering operation; (2) decide--on the basis of component heat sensitivity and the need for thermal relief--where hand soldering would be more feasible than drag soldering; and (3) determine the optimum drag solder control parameters.

  1. Integrated environmentally compatible soldering technologies. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.

    1994-05-01

    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  2. SNL initiatives in electronic fluxless soldering

    Science.gov (United States)

    Hosking, F. M.; Frear, D. R.; Vianco, P. T.; Keicher, D. M.

    Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories (SNL), Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering.

  3. PWB solder wettability after simulated storage

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Hosking, F.M.

    1996-03-01

    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  4. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1997-02-01

    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  5. Corrosion resistance of the soldering joint of post-soldering of palladium-based metal-ceramic alloys.

    Science.gov (United States)

    Kawada, E; Sakurai, Y; Oda, Y

    1997-05-01

    To evaluate the corrosion resistance of post soldering of metal-ceramic alloys, four commercially available palladium-system metal-ceramic alloys (Pd-Cu, Pd-Ni, Pd-Ag, and Pd-Sb systems) and two types of solder (12 k gold solder and 16 k gold solder) with different compositions and melting points were used. The corrosion resistance of the soldered joint was evaluated by anodic polarization. The electrochemical characteristics of soldered surface were measured using electrochemical equipment. Declines in corrosion resistance were not detectable with Pd-Cu, Pd-Ag and Pd-Sb types, but break down at low potential occurred with Pd-Ni type.

  6. Age-aware solder performance models : level 2 milestone completion.

    Energy Technology Data Exchange (ETDEWEB)

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann

    2010-09-01

    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  7. Vibration of hydraulic machinery

    CERN Document Server

    Wu, Yulin; Liu, Shuhong; Dou, Hua-Shu; Qian, Zhongdong

    2013-01-01

    Vibration of Hydraulic Machinery deals with the vibration problem which has significant influence on the safety and reliable operation of hydraulic machinery. It provides new achievements and the latest developments in these areas, even in the basic areas of this subject. The present book covers the fundamentals of mechanical vibration and rotordynamics as well as their main numerical models and analysis methods for the vibration prediction. The mechanical and hydraulic excitations to the vibration are analyzed, and the pressure fluctuations induced by the unsteady turbulent flow is predicted in order to obtain the unsteady loads. This book also discusses the loads, constraint conditions and the elastic and damping characters of the mechanical system, the structure dynamic analysis, the rotor dynamic analysis and the system instability of hydraulic machines, including the illustration of monitoring system for the instability and the vibration in hydraulic units. All the problems are necessary for vibration pr...

  8. Accelerated fatigue testing of aluminum refrigeration press fittings for HVAC & R applications

    OpenAIRE

    Elbel, Stefan; Duggan, Michael; LaGrotta, Tony; Raj, Sharat; Hrnjak, Pega

    2016-01-01

    Failed brazed joints causing refrigerant leakage is a multi-billion dollar problem for the global HVAC&R industry. Leaks are frequently caused due to mechanical fatigue from extreme pressure cycling, temperature cycling including exposure to freeze/thaw cycles, or vibrational wear induced from rotating electrical machinery. In this study, a new, cost-effective type of press fitting suitable for a wide variety of refrigerants and applications is investigated experimentally. Three tests to acce...

  9. Computer simulation of solder joint failure

    Energy Technology Data Exchange (ETDEWEB)

    Burchett, S.N.; Frear, D.R. [Sandia National Lab., Albuquerque, NM (United States); Rashid, M.M. [Univ. of California, Davis, CA (United States)

    1997-04-01

    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  10. Evaluation technology of lead-free solders; Namari free handa zairyo ni okeru hyoka gijutsu

    Energy Technology Data Exchange (ETDEWEB)

    Yamashita, M.; Shiokawa, K. [Fuji Electric Co. Ltd., Tokyo (Japan); Ueda, A. [Fuji Electric Corporate Research and Development,Ltd., Kanagawa (Japan)

    2000-09-10

    Solders mainly composed of tin and lead are currently in widespread use in semiconductor devices. However, in view of lead influences on the human body and environmental problems, lead-free solders have been in urgent demand. In this study, aiming to improve the solderability and reliability of a tin-silver solder, one of most promising lead-free solder materials, we have investigated elements to be added. Focusing on typical lead-free tin-silver solders and tin-lead eutectic solders, this paper describes the result of investigations into the mechanical properties solderability, micro structures of the solder materials and gas analysis in soldering. (author)

  11. Pulse Tube Refrigerator

    Science.gov (United States)

    Matsubara, Yoichi

    The pulse tube refrigerator is one of the regenerative cycle refrigerators such as Stirling cycle or Gifford-McMahon cycle which gives the cooling temperature below 150 K down to liquid helium temperature. In 1963, W. E. Gifford invented a simple refrigeration cycle which is composed of compressor, regenerator and simple tube named as pulse tube which gives a similar function of the expander in Stirling or Gifford-McMahon cycle. The thermodynamically performance of this pulse tube refrigerator is inferior to that of other regenerative cycles. In 1984, however, Mikulin and coworkers made a significant advance in pulse tube configuration called as orifice pulse tube. After this, several modifications of the pulse tube hot end configuration have been developed. With those modifications, the thermodynamic performance of the pulse tube refrigerator became the same order to that of Stirling and Gifford-McMahon refrigerator. This article reviews the brief history of the pulse tube refrigerator development in the view point of its thermodynamically efficiency. Simplified theories of the energy flow in the pulse tube have also been described.

  12. The toxicity of refrigerants

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1996-07-01

    This paper presents toxicity data and exposure limits for refrigerants. The data address both acute (short-term, single exposure) and chronic (long-term, repeated exposure) effects, with emphasis on the former. The refrigerants covered include those in common use for the last decade, those used as components in alternatives, and selected candidates for future replacements. The paper also reviews the toxicity indicators used in both safety standards and building, mechanical, and fire codes. It then outlines current classification methods for refrigerant safety and relates them to standard and code usage.

  13. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA[...

  14. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  15. Microstructural evolution of eutectic Au-Sn solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon

    2002-05-31

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  16. Microstructural evolution of eutectic Au-Sn solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon [Univ. of California, Berkeley, CA (United States)

    2002-05-01

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  17. Testing of printed circuit board solder joints by optical correlation

    Science.gov (United States)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  18. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design/methodology/approach: Chan......Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design....../methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid......-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic...

  19. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    OpenAIRE

    M. Provazník; R. Koleňák

    2010-01-01

    This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2). The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  20. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  1. Thermoacoustic engines and refrigerators

    Energy Technology Data Exchange (ETDEWEB)

    Swift, G.

    1996-12-31

    This report is a transcript of a practice lecture given in preparation for a review lecture on the operation of thermoacoustic engines and refrigerators. The author begins by a brief review of the thermodynamic principles underlying the operation of thermoacoustic engines and refrigerators. Remember from thermodynamics class that there are two kinds of heat engines, the heat engine or the prime mover which produces work from heat, and the refrigerator or heat pump that uses work to pump heat. The device operates between two thermal reservoirs at temperatures T{sub hot} and T{sub cold}. In the heat engine, heat flows into the device from the reservoir at T{sub hot}, produces work, and delivers waste heat into the reservoir at T{sub cold}. In the refrigerator, work flows into the device, lifting heat Q{sub cold} from reservoir at T{sub cold} and rejecting waste heat into the reservoir at T{sub hot}.

  2. Public Refrigerated Warehouses

    Data.gov (United States)

    Department of Homeland Security — The International Association of Refrigerated Warehouses (IARW) came into existence in 1891 when a number of conventional warehousemen took on the demands of storing...

  3. Thermoacoustic engines and refrigerators

    Energy Technology Data Exchange (ETDEWEB)

    Swift, G.

    1996-12-31

    This report is a transcript of a practice lecture given in preparation for a review lecture on the operation of thermoacoustic engines and refrigerators. The author begins by a brief review of the thermodynamic principles underlying the operation of thermoacoustic engines and refrigerators. Remember from thermodynamics class that there are two kinds of heat engines, the heat engine or the prime mover which produces work from heat, and the refrigerator or heat pump that uses work to pump heat. The device operates between two thermal reservoirs at temperatures T{sub hot} and T{sub cold}. In the heat engine, heat flows into the device from the reservoir at T{sub hot}, produces work, and delivers waste heat into the reservoir at T{sub cold}. In the refrigerator, work flows into the device, lifting heat Q{sub cold} from reservoir at T{sub cold} and rejecting waste heat into the reservoir at T{sub hot}.

  4. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

    Institute of Scientific and Technical Information of China (English)

    ZHANG Shu-guang; HE Li-jun; ZHU Xue-xin; ZHANG Shao-ming; SHI Li-kai; XU Jun

    2005-01-01

    A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib (σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.

  5. Anomalous Brownian Refrigerator

    OpenAIRE

    Rana, Shubhashis; Pal, P. S.; Saha, Arnab; Jayannavar, A. M.

    2015-01-01

    We present a detailed study of a Brownian particle driven by Carnot-type refrigerating protocol operating between two thermal baths. Both the underdamped as well as the overdamped limits are investigated. The particle is in a harmonic potential with time-periodic strength that drives the particle cyclically between the baths. Each cycle consists of two isothermal steps at different temperatures and two adiabatic steps connecting them. Besides working as a stochastic refrigerator, it is shown ...

  6. Refrigeration systems and applications

    CERN Document Server

    Dincer, Ibrahim

    2010-01-01

    Refrigeration Systems and Applications, 2nd edition offers a comprehensive treatise that addresses real-life technical and operational problems, enabling the reader to gain an understanding of the fundamental principles and the practical applications of refrigeration technology. New and unique analysis techniques (including exergy as a potential tool), models, correlations, procedures and applications are covered, and recent developments in the field are included - many of which are taken from the author's own research activities in this area. The book also includes so

  7. Refrigerated display cabinets; Butikskyla

    Energy Technology Data Exchange (ETDEWEB)

    Fahlen, Per

    2000-07-01

    This report summarizes experience from SP research and assignments regarding refrigerated transport and storage of food, mainly in the retail sector. It presents the fundamentals of heat and mass transfer in display cabinets with special focus on indirect systems and secondary refrigerants. Moreover, the report includes a brief account of basic food hygiene and the related regulations. The material has been compiled for educational purposes in the Masters program at Chalmers Technical University.

  8. Solder Joint Health Monitoring Testbed System

    Science.gov (United States)

    Delaney, Michael M.

    2009-01-01

    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  9. Pb-Free Soldering Iron Temperature Controller

    Science.gov (United States)

    Hamane, Hiroto; Wajima, Kenji; Hayashi, Yoichi; Komiyama, Eiichi; Tachibana, Toshiaki; Miyazaki, Kazuyoshi

    Recently, much importance has been attached to the environmental problem. The content of two directives to better control the management of waste electronic equipment was approved. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS). These set phase-out dates for the use of lead materials contained in electronic products. Increasingly, attention is focusing on the potential use of Pb-free soldering in electronics manufacturing. It should be noted that many of the current solding irons are not suitable for Pb-free technology, due to the inferior wetting ability of Pb-free alloys compared with SnPb solder pastes. This paper presents a Pb-free soldering iron temperature controller using an embedded micro-processor with a low memory capacity.

  10. Nanocopper Based Solder-Free Electronic Assembly

    Science.gov (United States)

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.

    2014-12-01

    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  11. Bacterial mitotic machineries

    DEFF Research Database (Denmark)

    Gerdes, Kenn; Møller-Jensen, Jakob; Ebersbach, Gitte;

    2004-01-01

    Here, we review recent progress that yields fundamental new insight into the molecular mechanisms behind plasmid and chromosome segregation in prokaryotic cells. In particular, we describe how prokaryotic actin homologs form mitotic machineries that segregate DNA before cell division. Thus, the Par......M protein of plasmid R1 forms F actin-like filaments that separate and move plasmid DNA from mid-cell to the cell poles. Evidence from three different laboratories indicate that the morphogenetic MreB protein may be involved in segregation of the bacterial chromosome....

  12. Moisture and aging effects of solder wettability of copper surfaces

    Energy Technology Data Exchange (ETDEWEB)

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1996-12-01

    Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.

  13. Parametric study on the solderability of etched PWB copper

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Stevenson, J.O.; Hernandez, C.L.

    1996-10-01

    The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

  14. Lead (Pb)-Free Solder Applications

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.

    2000-08-15

    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  15. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    M S Abdul Aziz; M Z Abdullah; C Y Khor; A Jalar; M A Bakar; W Y W Yusoff; F Che Ani; Nobe Yan; M Zhou; C Cheok

    2015-10-01

    This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0° and 6°. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

  16. Solder flow over fine line PWB surface finishes

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  17. Prototype circuit boards assembled with non-lead bearing solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Rejent, J.A.

    1998-04-01

    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  18. Miscibility comparison for three refrigerant mixtures and four component refrigerants

    Energy Technology Data Exchange (ETDEWEB)

    Kang, H.M.; Pate, M.B.

    1999-07-01

    Miscibility data were taken and compared for seven different refrigerants when mixed with the same polyol ester (POE) lubricant. Four of the seven refrigerants were single-component refrigerants while three of the refrigerants were mixtures composed of various combinations of the pure refrigerants. The purpose of this research was to investigate the difference in miscibility characteristics between refrigerant mixtures and their respective component refrigerants. The POE lubricant was a penta erythritol mixed-acid type POE which has a viscosity ISO32. The four pure refrigerants were R-32, R-125, R-134a, and R-143a and the three refrigerant mixtures were R-404A, R407C, and R-410A. The miscibility tests were performed in a test facility consisting of a series of miniature test cells submerged in a constant temperature bath. The test cells were constructed to allow for complete visibility of the refrigerant/lubricant mixtures under all test conditions. The tests were performed over a concentration range of 0 to 100% and a temperature range of {minus}40 to 194 F. The miscibility test results for refrigerant mixtures are compared to component refrigerants. In all cases, the refrigerant mixtures appear to have better miscibility than their most immiscible pure component.

  19. Capillary flow of solder on chemically roughened PWB surfaces

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.

    1996-02-01

    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  20. Automatic computer-aided system of simulating solder joint formation

    Science.gov (United States)

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin

    1999-08-01

    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  1. Matrix analysis of electrical machinery

    CERN Document Server

    Hancock, N N

    2013-01-01

    Matrix Analysis of Electrical Machinery, Second Edition is a 14-chapter edition that covers the systematic analysis of electrical machinery performance. This edition discusses the principles of various mathematical operations and their application to electrical machinery performance calculations. The introductory chapters deal with the matrix representation of algebraic equations and their application to static electrical networks. The following chapters describe the fundamentals of different transformers and rotating machines and present torque analysis in terms of the currents based on the p

  2. Pumping machinery theory and practice

    CERN Document Server

    Badr, Hassan M

    2014-01-01

    Pumping Machinery Theory and Practice comprehensively covers the theoretical foundation and applications of pumping machinery. Key features: Covers characteristics of centrifugal pumps, axial flow pumps and displacement pumpsConsiders pumping machinery performance and operational-type problemsCovers advanced topics in pumping machinery including multiphase flow principles, and two and three-phase flow pumping systemsCovers different methods of flow rate control and relevance to machine efficiency and energy consumptionCovers different methods of flow rate control and relevance to machine effi

  3. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    Science.gov (United States)

    Ji, Hongjun; Wang, Qiang; Li, Mingyu

    2016-01-01

    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  4. Low Global Warming Potential Refrigerants for Commercial Refrigeration Systems

    Energy Technology Data Exchange (ETDEWEB)

    Fricke, Brian A. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Sharma, Vishaldeep [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Abdelaziz, Omar [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2017-06-01

    Supermarket refrigeration systems account for approximately 50% of supermarket energy use, placing this class of equipment among the highest energy consumers in the commercial building domain. In addition, the commonly used refrigeration system in supermarket applications is the multiplex direct expansion (DX) system, which is prone to refrigerant leaks due to its long lengths of refrigerant piping. This leakage reduces the efficiency of the system and increases the impact of the system on the environment. The high Global Warming Potential (GWP) of the hydrofluorocarbon (HFC) refrigerants commonly used in these systems, coupled with the large refrigerant charge and the high refrigerant leakage rates leads to significant direct emissions of greenhouse gases into the atmosphere. Environmental concerns are driving regulations for the heating, ventilating, air-conditioning and refrigeration (HVAC&R) industry towards lower GWP alternatives to HFC refrigerants. Existing lower GWP refrigerant alternatives include hydrocarbons, such as propane (R-290) and isobutane (R-600a), as well as carbon dioxide (R-744), ammonia (R-717), and R-32. In addition, new lower GWP refrigerant alternatives are currently being developed by refrigerant manufacturers, including hydrofluoro-olefin (HFO) and unsaturated hydrochlorofluorocarbon (HCFO) refrigerants. The selection of an appropriate refrigerant for a given refrigeration application should be based on several factors, including the GWP of the refrigerant, the energy consumption of the refrigeration system over its operating lifetime, and leakage of refrigerant over the system lifetime. For example, focusing on energy efficiency alone may overlook the significant environmental impact of refrigerant leakage; while focusing on GWP alone might result in lower efficiency systems that result in higher indirect impact over the equipment lifetime. Thus, the objective of this Collaborative Research and Development Agreement (CRADA) between

  5. ARTI Refrigerant Database

    Energy Technology Data Exchange (ETDEWEB)

    Cain, J.M. (Calm (James M.), Great Falls, VA (United States))

    1993-04-30

    The Refrigerant Database consolidates and facilitates access to information to assist industry in developing equipment using alternative refrigerants. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included. The database identifies sources of specific information on R-32, R-123, R-124, R-125, R-134, R-134a, R-141b, R-142b, R-143a, R-152a, R-245ca, R-290 (propane), R-717 (ammonia), ethers, and others as well as azeotropic and zeotropic blends of these fluids. It addresses lubricants including alkylbenzene, polyalkylene glycol, ester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents to accelerate availability of the information and will be completed or replaced in future updates.

  6. Downhole pulse tube refrigerators

    Energy Technology Data Exchange (ETDEWEB)

    Swift, G.; Gardner, D. [Los Alamos National Lab., NM (United States). Condensed Matter and Thermal Physics Group

    1997-12-01

    This report summarizes a preliminary design study to explore the plausibility of using pulse tube refrigeration to cool instruments in a hot down-hole environment. The original motivation was to maintain Dave Reagor`s high-temperature superconducting electronics at 75 K, but the study has evolved to include three target design criteria: cooling at 30 C in a 300 C environment, cooling at 75 K in a 50 C environment, cooling at both 75 K and 30 C in a 250 C environment. These specific temperatures were chosen arbitrarily, as representative of what is possible. The primary goals are low cost, reliability, and small package diameter. Pulse-tube refrigeration is a rapidly growing sub-field of cryogenic refrigeration. The pulse tube refrigerator has recently become the simplest, cheapest, most rugged and reliable low-power cryocooler. The authors expect this technology will be applicable downhole because of the ratio of hot to cold temperatures (in absolute units, such as Kelvin) of interest in deep drilling is comparable to the ratios routinely achieved with cryogenic pulse-tube refrigerators.

  7. ARTI Refrigerant Database

    Energy Technology Data Exchange (ETDEWEB)

    Cain, J.M. [Calm (James M.), Great Falls, VA (United States)

    1993-04-30

    The Refrigerant Database consolidates and facilitates access to information to assist industry in developing equipment using alternative refrigerants. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included. The database identifies sources of specific information on R-32, R-123, R-124, R-125, R-134, R-134a, R-141b, R-142b, R-143a, R-152a, R-245ca, R-290 (propane), R-717 (ammonia), ethers, and others as well as azeotropic and zeotropic blends of these fluids. It addresses lubricants including alkylbenzene, polyalkylene glycol, ester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents to accelerate availability of the information and will be completed or replaced in future updates.

  8. Multilead, Vaporization-Cooled Soldering Heat Sink

    Science.gov (United States)

    Rice, John

    1995-01-01

    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  9. Soldering and Mass Generation in Four Dimensions

    CERN Document Server

    Banerjee, R; Banerjee, Rabin; Wotzasek, Clovis

    2000-01-01

    We propose bosonised expressions for the chiral Schwinger models in four dimensions. Then, in complete analogy with the two dimensional case, we show the soldering of two bosonised chiral Schwinger models with opposite chiralities to yield the bosonised Schwinger model in four dimensions. The implications of the Schwinger model or its chiral version, as known for two dimensions, thereby get extended to four dimensions.

  10. Solderability test development. Final report. [Meniscograph tests

    Energy Technology Data Exchange (ETDEWEB)

    Jarboe, D.M.

    1977-10-01

    Operating procedures and data reduction techniques applicable to the Meniscograph (General Electric Company, Limited) were developed. Using force-time traces from tests involving various sample materials and configurations, flux types, and test temperatures, the wetting rate and contact angle were obtained through statistical treatment of the data. This information provides a means of directly correlating solderability with the physical phenomenon of wetting.

  11. Pulse tube refrigerator; Parusukan reitoki

    Energy Technology Data Exchange (ETDEWEB)

    Hozumi, Yoshikazu [University of Tsukuba, Tsukuba (Japan); Shiraishi, Masao [Hiroshima University, Hiroshima (Japan)

    1999-06-05

    In the cryogenic field, high temperature superconductivity and research and development of the peripheral technology are popular. Refrigerating machine development of the very low temperature is also one of the results. Research and development are mainly advanced as a refrigerating machine of the center for the aerospace plane installation. There is special and small very low temperature refrigerating machine called 'the pulse tube refrigerating machine' of which the practical application is also recently being attempted for the semiconductor cooling using high temperature superconductivity. At present, the basic research of elucidation of refrigeration phenomenon of pulse tube refrigerating machine and development of high-performance pulse tube refrigerating machine is carried out by experiment in the Ministry of International Trade and Industry Mechanical Engineering Lab., Agency of Industrial Sci. and Technology and numerical simulation in Chiyoda Corp. In this report, the pulse tube refrigerating machine is introduced, and the application in the chemical engineering field is considered. (NEDO)

  12. ARTI Refrigerant Database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1992-11-09

    The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air- conditioning and refrigeration equipment. The database identifies sources of specific information on R-32, R-123, R-124, R-125, R-134, R-134a, R-141b, R-142b, R-143a, R-152a, R-245ca, R-290 (propane), R- 717 (ammonia), ethers, and others as well as azeotropic and zeotropic and zeotropic blends of these fluids. It addresses lubricants including alkylbenzene, polyalkylene glycol, ester, and other synthetics as well as mineral oils. It also references documents on compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. A computerized version is available that includes retrieval software.

  13. Microwave Tissue Soldering for Immediate Wound Closure

    Science.gov (United States)

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  14. Preparation of solder pads by selective laser scanning

    Institute of Scientific and Technical Information of China (English)

    Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo

    2009-01-01

    We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprint-ing it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows: the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 mm, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.

  15. Condensation of refrigerants flowing inside smooth and corrugated tubes

    Energy Technology Data Exchange (ETDEWEB)

    Hinton, D.L. [Tennessee State Univ., Nashville, TN (United States); Conklin, J.C.; Vineyard, E.A. [Oak Ridge National Lab., TN (United States)

    1995-07-01

    Because heat exchanger thermal performance has a direct fluence on the overall cycle performance of vapor-compression refrigeration machinery,enhanced heat transfer surfaces are of interest to improve the efficiency of heat pumps and air conditioners. We investigated R-22 and a nonazeotropic refrigerant mixture (NARM) of 75% R-143a and 25% R-124 (by mass) to study their thermal performance in a condenser made of conventional smooth tubes and another condenser made of corrugated, or spirally indented, tubes. We investigated the condensing heat transfer and pressure drop characteristics in an experimental test loop model of a domestic beat pump system employing a variable speed compressor. The refrigerant circulates inside the central tube and the water circulates in the annulus. At refrigerant mass fluxes of approximately 275--300 kg/m{sup 2}s, the measured irreversible pressure drop of the corrugated surface was 23% higher than that of the smooth surface for the R-22. At refrigerant mass fluxes of 350-370 kg/m{sup 2}s, the irreversible pressure drop of the corrugated surface was 36% higher than that of the smooth surface for the NARM. The average heat transfer coefficient for the corrugated surface for R-22 was roughly 40% higher than that for the smooth tube surface at refrigerant mass fluxes of 275--295 kg/m{sup 2}s. The average heat transfer coefficient for the corrugated surface for the NARM was typically 70% higher than that for the smooth tube surface at refrigerant mass fluxes of 340--385 kg/m{sup 2}s.

  16. Refrigeration a history

    CERN Document Server

    Gantz, Carroll

    2015-01-01

    For thousands of years, humans coped with heat by harvesting and storing natural ice and devising natural cooling systems that utilized ventilation and evaporation. By the mid 1800s, people began developing huge refrigeration machines to manufacture ice. By the early 1900s, engineers developed electric domestic refrigerators, which by 1927 were affordable convenient household appliances. By then, an increasingly sophisticated public demanded more modern-looking appliances than engineers could produce, and a new breed of designers entered the manufacturing world to provide them. During the Depr

  17. Skill Sheets for Agricultural Machinery.

    Science.gov (United States)

    Iowa State Univ. of Science and Technology, Ames. Dept. of Agricultural Education.

    This set of 21 skill sheets for agricultural machinery was developed for use in high school and vocational school agricultural mechanics programs. Each sheet covers a single operational procedure for a piece of agricultural machinery, and includes: (1) a diagram, (2) a step-by-step operational procedure, (3) abilities or understandings taught, (4)…

  18. Energy efficiency in refrigerated transport

    NARCIS (Netherlands)

    Gerwen, R.J.M. van; Sluis, S.M. van der; Schiphouwer, H.

    1998-01-01

    In refrigerated road transport, 10 to 40 `)/0 of the total energy consumption is related to refrigeration. However, energy consumption and energy efficiency of refrigerated transport equipment is rarely mentioned in the discussions about energy saving, potentials in road transport. Two main approach

  19. Exergy analysis of magnetic refrigeration

    CERN Document Server

    Lucia, Umberto

    2010-01-01

    One of the main challenges of the industry today is to face its impact on global warming considering that the greenhouse effect problem is not be solved completely yet. Magnetic refrigeration represents an environment-safe refrigeration technology. The magnetic refrigeration is analysed using the second law analysis and introducing exergy in order to obtain a model for engineering application.

  20. The vapor compression refrigeration cycle

    Energy Technology Data Exchange (ETDEWEB)

    Pannkoke, T.

    1995-11-01

    This article is a review of the basic principles of a cycle widely used to create the refrigeration effect that provides both human comfort and process cooling. While a semantic differentiation often is made for cooling and dehumidifying air for human comfort (air conditioning) and cooling for products and processes (refrigeration), all mechanical cooling applications depend on the previously mentioned refrigeration effect.

  1. Refrigeration Playbook: Natural Refrigerants; Selecting and Designing Energy-Efficient Commercial Refrigeration Systems That Use Low Global Warming Potential Refrigerants

    Energy Technology Data Exchange (ETDEWEB)

    Nelson, Caleb [CTA Architects Engineers, Boise, ID (United States); Reis, Chuck [CTA Architects Engineers, Boise, ID (United States); Nelson, Eric [CTA Architects Engineers, Boise, ID (United States); Armer, James [CTA Architects Engineers, Boise, ID (United States); Arthur, Rob [CTA Architects Engineers, Boise, ID (United States); Heath, Richard [CTA Architects Engineers, Boise, ID (United States); Rono, James [CTA Architects Engineers, Boise, ID (United States); Hirsch, Adam [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Doebber, Ian [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2015-03-01

    This report provides guidance for selecting and designing energy efficient commercial refrigeration systems using low global warming potential refrigerants. Refrigeration systems are generally the largest energy end use in a supermarket type building, often accounting for more than half of a building's energy consumption.

  2. Portable refrigerant charge meter and method for determining the actual refrigerant charge in HVAC systems

    Energy Technology Data Exchange (ETDEWEB)

    Gao, Zhiming; Abdelaziz, Omar; LaClair, Tim L.

    2017-08-08

    A refrigerant charge meter and a method for determining the actual refrigerant charge in HVAC systems are described. The meter includes means for determining an optimum refrigerant charge from system subcooling and system component parameters. The meter also includes means for determining the ratio of the actual refrigerant charge to the optimum refrigerant charge. Finally, the meter includes means for determining the actual refrigerant charge from the optimum refrigerant charge and the ratio of the actual refrigerant charge to the optimum refrigerant charge.

  3. Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder

    Science.gov (United States)

    Jung, Do-Hyun; Sharma, Ashutosh; Lim, Dong-Uk; Yun, Jong-Hyun; Jung, Jae-Pil

    2017-09-01

    The addition of nanosized AlN particles to Sn-3.0 wt pctAg-0.5 wt pctCu (SAC305) lead-free solder alloy has been investigated. The various weight fractions of AlN (0, 0.03, 0.12, 0.21, 0.60 wt pct) have been dispersed in SAC305 solder matrix by a mechanical mixing and melting route. The influences of AlN nanosized particles on the microstructure, mechanical properties, and solderability ( e.g., spreadability and wettability) have been carried out. The structural and morphological features of the nanocomposite solder were characterized by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and transmission electron microscope (TEM). The experimental results show that the best combination of solderability and mechanical properties is obtained at 0.21 wt pct AlN in the solder matrix. The reinforced composite solder with 0.21 wt pct AlN nanoparticles shows ≈25 pct improvement in ultimate tensile strength (UTS), and ≈4 pct increase in the spreadability. In addition, the results of microstructural analyses of composite solders indicate that the nanocomposite solder, especially reinforced with 0.21 wt pct of AlN nanoparticles, exhibits better microstructure and improved elongation percentage, compared with the monolithic SAC305 solder.

  4. Refrigerating machine operating characteristics under various mixed refrigerant mass charges

    Energy Technology Data Exchange (ETDEWEB)

    Rozhentsev, Andrey [Far Eastern State Transport University of the Russian Federation, Seryshev street, 47, 680021 Khabarovsk (Russian Federation)

    2008-11-15

    This paper reports the results of experimental investigation of a low-temperature Joule-Thomson refrigerating machine, working by use of a non-azeotropic mixture of refrigerants and with a single-stage hermetic compressor. The temperature, hydraulic and power performance of the machine are determined experimentally in relation to the mixed refrigerant (MR) mass charge. Variations of the MR refrigerating machine operating performance with the working mixture mass charge are found to be considerably different from the analogous performance variations of a refrigerating machine charged with a pure refrigerant. The peculiarities of those relationships are analyzed theoretically. The specific value of a minimum acceptable MR mass charge for the investigated system and its correlation with internal processes in the machine loop are established as well. If the refrigerant mixture mass charges are below the minimum ones, the temperature and power performance of the MR machine differ essentially from the design performance and such operating modes are considered inadmissible. (author)

  5. Investigations on a Thermoacoustic Refrigerator

    CERN Document Server

    Dhuley, Ram C

    2016-01-01

    Thermoacoustic Refrigerators use acoustic power for generating cold temperatures. Development of refrigerators based on the thermoacoustic technology is a novel solution to the present day need of cooling, without causing environmental hazards. With added advantages such as minimal moving parts and absence of CFC refrigerants, these devices can attain low temperatures maintaining a compact size. The present work describes an in-depth theoretical analysis of standing wave thermoacoustic refrigerators. This consists of detailed parametric studies, transient state analysis, and a design using an available simulation software. Design and construction of a thermoacoustic refrigerator using a commercially available electro-dynamic motor is also presented.

  6. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    Science.gov (United States)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  7. Investigation of Solder Cracking Problems on Printed Circuit Boards

    Science.gov (United States)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  8. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    Multi-Chip module (MCM) technology is a specialized electronic packaging technology recently gaining momentum due to the miniaturization drive in the microelectronics industry. The step soldering approach is being employed in the MCM technology. This method is used to solder various levels...... of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  9. Fundamentals of Refrigeration.

    Science.gov (United States)

    Sutliff, Ronald D.; And Others

    This self-study course is designed to familiarize Marine enlisted personnel with the principles of the refrigeration process. The course contains five study units. Each study unit begins with a general objective, which is a statement of what the student should learn from the unit. The study units are divided into numbered work units, each…

  10. Education in Helium Refrigeration

    Science.gov (United States)

    Gistau Baguer, G. M.

    2004-06-01

    On the one hand, at the end of the time I was active in helium refrigeration, I noticed that cryogenics was stepping into places where it was not yet used. For example, a conventional accelerator, operating at room temperature, was to be upgraded to reach higher particle energy. On the other hand, I was a little bit worried to let what I had so passionately learned during these years to be lost. Retirement made time available, and I came gradually to the idea to teach about what was my basic job. I thought also about other kinds of people who could be interested in such lessons: operators of refrigerators or liquefiers who, often by lack of time, did not get a proper introduction to their job when they started, young engineers who begin to work in cryogenics… and so on. Consequently, I have assembled a series of lessons about helium refrigeration. As the audiences have different levels of knowledge in the field of cryogenics, I looked for a way of teaching that is acceptable for all of them. The course is split into theory of heat exchangers, refrigeration cycles, technology and operation of main components, process control, and helium purity.

  11. Anomalous creep in Sn-rich solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay

    2002-03-15

    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

  12. THERMAL PROCESS OF VACUUM FLUXLESS LASERSOLDERING AND ANALYSIS ON SOLDER SPREADING AND WETTING

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of boh fluxless SnPb solder in the vacuum surroundings and flux SnPb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder su rface tension is the important factor achieving fluxless laser soldering.

  13. Solderability preservation through the use of organic inhibitors

    Energy Technology Data Exchange (ETDEWEB)

    Sorensen, N.R.; Hosking, F.M.

    1994-12-01

    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  14. Aging, stressing and solderability of electroplated and electroless copper

    Energy Technology Data Exchange (ETDEWEB)

    Sorensen, N.R.; Hosking, F.M.

    1995-08-01

    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  15. High temperature solder alloys for underhood applications: Final report

    Energy Technology Data Exchange (ETDEWEB)

    Kern, J.A. [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Mechanical Engineering; Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Laboratories, Albuquerque, NM (United States); Weiser, M.W. [Johnson-Mathey Electronics Corp., Spokane, WA (United States)

    1996-06-01

    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  16. Recent Research Trend in Laser-Soldering Process

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Hwan Tae; Kil, Sang Cheol [Korea Institute of Science and Technology Information, Seoul (Korea, Republic of); Hwang, Woon Suk [Inha University, Incheon (Korea, Republic of)

    2009-10-15

    The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modem microjoining technology such as micro-resistance spot joining micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

  17. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  18. Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

    Institute of Scientific and Technical Information of China (English)

    XUE Song-bai; YU Sheng-lin; WANG Xu-yan; LIU lin; HU Yong-fang; YAO Li-hua

    2005-01-01

    Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.

  19. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    Directory of Open Access Journals (Sweden)

    M. Provazník

    2010-01-01

    Full Text Available This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2. The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  20. Determination of a Vapor Compression Refrigeration System Refrigerant Charge

    Institute of Scientific and Technical Information of China (English)

    YangChun-Xin; DangChao-Bin

    1995-01-01

    A physical model is established in this paper to describe the heat transfer and two phase flow of a refrigerant in the evaporator and condenser of a vapor compression refrigeration system.The model in then used to determine the refrigerant charge in vapor compression units.The model is used for a sensitivity analysis to determine the effect that varing design parameters on the refrigerant charge,The model is also used to evaluate the effect of refrigerant charge and the thermal physical properties on the refrigeration cycle,The predicted value of the refigerant charge and experimental data agree well The model and the method presented in this paper could be used to design vapour compression units such as domestic refrigeratirs and air conditioners.

  1. Superfluid thermodynamic cycle refrigerator

    Science.gov (United States)

    Swift, Gregory W.; Kotsubo, Vincent Y.

    1992-01-01

    A cryogenic refrigerator cools a heat source by cyclically concentrating and diluting the amount of .sup.3 He in a single phase .sup.3 He-.sup.4 He solution. The .sup.3 He in superfluid .sup.4 He acts in a manner of an ideal gas in a vacuum. Thus, refrigeration is obtained using any conventional thermal cycle, but preferably a Stirling or Carnot cycle. A single phase solution of liquid .sup.3 He at an initial concentration in superfluid .sup.4 He is contained in a first variable volume connected to a second variable volume through a superleak device that enables free passage of .sup.4 He while restricting passage of .sup.3 He. The .sup.3 He is compressed (concentrated) and expanded (diluted) in a phased manner to carry out the selected thermal cycle to remove heat from the heat load for cooling below 1 K.

  2. Multilayer Thermionic Refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Mahan, G.D.

    1999-08-30

    A review is presented of our program to construct an efficient solid state refrigerator based on thermionic emission of electrons over periodic barriers in the solid. The experimental program is to construct a simple device with one barrier layer using a three layers: metal-semiconductor-metal. The theoretical program is doing calculations to determine: (i) the optimal layer thickness, and (ii) the thermal conductivity.

  3. Autonomous solar refrigerator

    Energy Technology Data Exchange (ETDEWEB)

    Bougard, J.; Vokaert, D. (Faculte Polytechnique de Mons, Universite Libre de Bruxelles (Belgium))

    1982-11-01

    A compression refrigerator, fed by a flat solar pannel and composed of two thermal machines, working on a Rankine-Hirn cycle, is described. Mechanical energy is transferred by a double effect free-piston which is at the same time engine, pump, compressor and electric generator for auxiliaries. Freon R12 or R114 is used as the working fluid. Performances of a prototype are given. Investment for a classical unit, fed by a photovoltaic pannel would be more than twice.

  4. On the reversed Brayton cycle with high speed machinery

    Energy Technology Data Exchange (ETDEWEB)

    Backman, J.

    1996-12-31

    This work was carried out in the laboratory of Fluid Dynamics, at Lappeenranta University of Technology during the years 1991-1996. The research was a part of larger high speed technology development research. First, there was the idea of making high speed machinery applications with the Brayton cycle. There was a clear need to deepen the knowledge of the cycle itself and to make a new approach in the field of the research. Also, the removal of water from the humid air seemed very interesting. The goal of this work was to study methods of designing high speed machinery for the reversed Brayton cycle, from theoretical principles to practical applications. The reversed Brayton cycle can be employed as an air dryer, a heat pump or a refrigerating machine. In this research the use of humid air as a working fluid has an environmental advantage, as well. A new calculation method for the Brayton cycle is developed. In this method especially the expansion process in the turbine is important because of the condensation of the water vapour in the humid air. This physical phenomena can have significant effects on the level of performance of the application. Also, the influence of calculating the process with actual, achievable process equipment efficiencies is essential for the development of future machinery. The above theoretical calculations are confirmed with two different laboratory prototypes. (53 refs.)

  5. Japanese activities in refrigeration technology

    Science.gov (United States)

    Fujita, T.; Ohtsuka, T.; Ishizaki, Y.

    This paper reviews recent activities in refrigeration technology in Japan. The projects described are stimulated by growing industrial needs or form part of large national projects. The JNR project on the MAGLEV train is currently the most powerful activity and it demands knowledge in all the different disciplines of cryogenics in particular on various scales of refrigeration. Research activities are also directed towards the development of Stirling cycle and magnetic refrigerators for applications in a wider area.

  6. ALTERNATIVE REFRIGERANT R-134A

    Directory of Open Access Journals (Sweden)

    Rasim KARABACAK

    1997-03-01

    Full Text Available Because of the big damages on the ozone layer given by the refrigerants cloroflorocarbons that has been used up to now, new alternative gases should be developped and product at once. In this study, some informations about alternative to presently used CFCs, R-134A refrigerant's characteristics and its suitability to cooling systems is given. As it would be understood from these informations there is no objection on using alternative R-134A refrigerant

  7. Surface tension and reactive wetting in solder connections

    Energy Technology Data Exchange (ETDEWEB)

    Wedi, Andre; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Wilhelm-Klemm-Strasse 10, 48149 Muenster (Germany)

    2011-07-01

    Wetting is an important pre-requisite of a reliable solder connection. However, it is only an indirect measure for the important specific energy of the reactive interface between solder and base metallization. In order to quantify this energy, we measured wetting angles of solder drops as well as surface tension of SnPb solders under systematic variation of composition and gaseous flux at different reflow temperatures. For the latter, we used the sessile drop method placing a solder drop on a glas substrate. From the two independent data sets, the important energy of the reactive interface is evaluated based on Young's equation. Remarkably, although both, the tension between the solder and flux and the wetting angle, reveal significant dependence on solder composition. So the adhesion energy reveals distinguished plateaus which are related to different reaction products in contact to the solder. TEM analysis and calculations of phase stabilities show that there is no Cu6Sn5 for high lead concentrations. The experiments confirm a model of reactive wetting by Eustathopoulos.

  8. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...

  9. 46 CFR 169.241 - Machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Machinery. 169.241 Section 169.241 Shipping COAST GUARD... Certification Inspections § 169.241 Machinery. (a) At each inspection for certification and periodic inspection.... Mechanisms are operationally tested and visually examined. (3) Auxiliary machinery. All machinery...

  10. Regulating Power from Supermarket Refrigeration

    DEFF Research Database (Denmark)

    O'Connell, Niamh; Madsen, Henrik; Pinson, Pierre

    2014-01-01

    This paper presents an analysis of the demand response capabilities of a supermarket refrigeration system, with a particular focus on the suitability for participation in the regulating power market. An ARMAX model of a supermarket refrigeration system is identified using experimental data from...... nature of demand response from refrigeration is identified as the key consideration when considering participation in the regulating power market. It is demonstrated that by restricting the operating regions of the supermarket refrigeration system, a simple relationship can be found between the available...

  11. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    Energy Technology Data Exchange (ETDEWEB)

    Davidson, R.N.

    1996-10-01

    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  12. THERMODYNAMIC PROPERTIES OF SELECTED HFC REFRIGERANTS

    Science.gov (United States)

    Hydrofluorocarbon (HFC) refrigerants are possible alternatives to replace ozone-depleting chlorofluorocarbon and hydrochlorofluorocarbon (HCFC) refrigerants. The flammability of a proposed new refrigerant is a major consideration in assessing its utility for a particular applicat...

  13. A Study of Solder Alloy Ductility for Cryogenic Applications

    Science.gov (United States)

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.

    2013-01-01

    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  14. Hybrid microcircuit board assembly with lead-free solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    2000-01-11

    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  15. Current Status of Lead-Free Soldering and Conductive Adhesives

    Institute of Scientific and Technical Information of China (English)

    KatsuakiSuganuma

    2003-01-01

    Lead-free soldering technology took offin the Japanese market during the year 2000, and as the year 2001-03 ushered in the 21 st century, a large number of products with lead-free soldering were already appearing on store shelves. Elsewhere, EU deliberation on the draft of the WEEE/RoHS directive finalized in February 2003 and be in force in July 2006. The course had been set for adopting lead-free solder for mounting processes of parts as well, bringing the possibility of lead-free solder mounting very close to achievement. This review will provide a view of the current state of technological progress in lead-free soldering, both in Japan and abroad, and will discuss future prospects.

  16. Development of lead-free solders for hybrid microcircuits

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Vianco, P.T.; Frear, D.R.; Robinson, D.G.

    1996-01-01

    Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is responsible for designing a variety of critical, high reliability hybrid components for radars. Sandia has consequently initiated a project, as part of its Environmentally Conscious Manufacturing program, to develop low-residue, lead-free soldering for HMCs. This paper discusses the progress of that work.

  17. Refrigerator-freezer energy testing with alternative refrigerants

    Science.gov (United States)

    Vineyard, E. A.; Sand, J. R.; Miller, W. A.

    1989-07-01

    As a result of the Montreal Protocol that limits the production of ozone-depleting refrigerants, manufacturers are searching for alternatives to replace the R12 that is presently used in residential refrigerator-freezers. Before an alternative can be selected, several issues must be resolved. Among these are energy impacts, system compatibility, cost, and availability. In an effort to determine the energy impacts of some of the alternatives, energy consumption tests were performed in accordance with section 8 of the Association of Home Appliance Manufacturers (AHAM) standard for household refrigerators and household freezers. The results are presented for an 18 cubic foot (0.51 cubic meter), top-mount refrigerator-freezer with a static condenser using the following refrigerants: R12, R500, R12/Dimethyl-ether (DME), R22/R142b, and R134a. Conclusions from the AHAM test are that R500 and R12 /DME have a reduced energy consumption relative to R12 when replaced in the test unit with no modifications to the refrigeration system. Run times were slightly lower than R12 for both refrigerants indicating a higher capacity. While the R134a and R22/R142b results were less promising, changes to the refrigeration system, such as a different capillary tube or compressor, may improve performance.

  18. Non azeotrope mixing refrigerating fluids condensation outside of an horizontal tubes stack; Condensation de melanges non azeotropes de fluides frigorigenes a l'exterieur d'un faisceau de tubes horizontaux

    Energy Technology Data Exchange (ETDEWEB)

    Signe, J.Ch.

    1999-04-16

    The development of non-azeotrope mixing, as regular refrigerating fluids substitute, calls in question the experience for the design of refrigerating and cooling machinery. Studies to better understand these fluids behaviour are necessary. The aim of this thesis is the knowledge enlargement on the pure fluids and non azeotrope mixing condensation, outside of a tubes stack, and to simulate the heat transfers. The tubes stack is a condenser, type TEMA X often used in refrigerating machinery. The binary mixing HFC 134a-HFC23, allows a large sliding scale. (A.L.B.)

  19. Duality Symmetry and Soldering in Different Dimensions

    CERN Document Server

    Banerjee, R

    1997-01-01

    We develop a systematic method of obtaining duality symmetric actions in different dimensions. This technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. In all cases there are two such distinct actions. Furthermore, by soldering these distinct actions in any dimension a master action is obtained which is duality invariant under a much bigger set of symmetries than is usually envisaged. The concept of swapping duality is introduced and its implications are discussed. The effects of coupling to gravity are also elaborated. Finally, the extension of the analysis for arbitrary dimensions is indicated.

  20. Cycling Joule Thomson refrigerator

    Science.gov (United States)

    Tward, E.

    1983-01-01

    A symmetrical adsorption pump/compressor system having a pair of mirror image legs and a Joule Thomson expander, or valve, interposed between the legs thereof for providing a, efficient refrigeration cycle is described. The system further includes a plurality of gas operational heat switches adapted selectively to transfer heat from a thermal load and to transfer or discharge heat through a heat projector, such as a radiator or the like. The heat switches comprise heat pressurizable chambers adapted for alternate pressurization in response to adsorption and desorption of a pressurizing gas confined therein.

  1. Energy optimisation of domestic refrigerators

    DEFF Research Database (Denmark)

    Jakobsen, Arne; Rasmussen, Bjarne D.

    1998-01-01

    This paper describes the main results of a research project with the objective of reducing the energy consumption of domestic refrigerators by increasing the efficiency of the refrigeration system. The improvement of the system efficiency was to be obtained by:1) Introducing continuous operation...

  2. Study on wave rotor refrigerators

    Institute of Scientific and Technical Information of China (English)

    Yuqiang DAI; Dapeng HU; Meixia DING

    2009-01-01

    As a novel generation of a rotational gas wave machine, the wave rotor refrigerator (WRR) is an unsteady flow device used for refrigeration, in whose passages pressured streams directly contact and exchange energy due to the movement of pressure waves. In this paper, the working mechanism and refrigeration principle are inves-tigated based on the one-dimensional unsteady flow theory.A basic limitation on main structural parameters and operating parameters is deduced and the wave diagram of WRR to guide designing is sketched. The main influential factors are studied through an experiment. In the DUT Gas Wave Refrigeration Studying and Development Center (GWRSDC) lab, the isentropic efficiency can now reach about 65%. The results show that the WRR is a feasible and promising technology in pressured gas refrigeration cases.

  3. Performance modeling of optical refrigerators

    Energy Technology Data Exchange (ETDEWEB)

    Mills, G.; Mord, A. [Ball Aerospace and Technologies Corp., Boulder, CO (United States). Cryogenic and Thermal Engineering

    2006-02-15

    Optical refrigeration using anti-Stokes fluorescence in solids has several advantages over more conventional techniques including low mass, low volume, low cost and no vibration. It also has the potential of allowing miniature cryocoolers on the scale of a few cubic centimeters. It has been the topic of analysis and experimental work by several organizations. In 2003, we demonstrated the first optical refrigerator. We have developed a comprehensive system-level performance model of optical refrigerators. Our current version models the refrigeration cycle based on the fluorescent material emission and absorption data at ambient and reduced temperature for the Ytterbium-ZBLAN glass (Yb:ZBLAN) cooling material. It also includes the heat transfer into the refrigerator cooling assembly due to radiation and conduction. In this paper, we report on modeling results which reveal the interplay between size, power input, and cooling load. This interplay results in practical size limitations using Yb:ZBLAN. (author)

  4. Electromigration of composite Sn-Ag-Cu solder bumps

    Science.gov (United States)

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil

    2015-11-01

    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  5. Environmentally compatible solder materials for thick film hybrid assemblies

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Vianco, P.T.; Rejent, J.A.; Hernandez, C.L. [Sandia National Labs., Albuquerque, NM (United States). Materials and Process Sciences Center

    1997-02-01

    New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized.

  6. Anomalous Brownian refrigerator

    Science.gov (United States)

    Rana, Shubhashis; Pal, P. S.; Saha, Arnab; Jayannavar, A. M.

    2016-02-01

    We present a detailed study of a Brownian particle driven by Carnot-type refrigerating protocol operating between two thermal baths. Both the underdamped as well as the overdamped limits are investigated. The particle is in a harmonic potential with time-periodic strength that drives the system cyclically between the baths. Each cycle consists of two isothermal steps at different temperatures and two adiabatic steps connecting them. Besides working as a stochastic refrigerator, it is shown analytically that in the quasistatic regime the system can also act as stochastic heater, depending on the bath temperatures. Interestingly, in non-quasistatic regime, our system can even work as a stochastic heat engine for certain range of cycle time and bath temperatures. We show that the operation of this engine is not reliable. The fluctuations of stochastic efficiency/coefficient of performance (COP) dominate their mean values. Their distributions show power law tails, however the exponents are not universal. Our study reveals that microscopic machines are not the microscopic equivalent of the macroscopic machines that we come across in our daily life. We find that there is no one to one correspondence between the performance of our system under engine protocol and its reverse.

  7. Simulation of thermomechanical fatigue in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A. [Sandia National Labs., Albuquerque, NM (United States)

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  8. Albumin-genipin solder for laser tissue welding

    Science.gov (United States)

    Lauto, Antonio; Foster, John; Avolio, Albert; Poole-Warren, Laura

    2004-07-01

    Background. Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair. One of the major drawbacks of LTS is the weak tensile strength of the solder welds when compared to sutures. In this study, the possibility was investigated for a low cytotoxic crosslinker, acting on amino groups, to enhance the bond strength of albumin solders. Materials and Methods. Solder strips were welded onto rectangular sections of sheep small intestine by a diode laser. The laser delivered in continuous mode mode a power of 170 +/- 10 mW at λ=808 nm, through a multimode optical fiber (core size = 200 μm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 1 mm, area = 12 +/- 1.2 mm2). The solder incorporated 62% bovine serum albumin, 0.38% genipin, 0.25% indocyanin green dye (IG) and water. Tissue welding was also performed with a similar solder, which did not incorporate genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Results. The tensile strength of the "genipin" solder was twice as high as the strength of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N respectively; p~10-15 unpaired t-test, N=30). Discussion. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

  9. THERMODYNAMIC ANALYSIS OF REFRIGERANT MIXTURES IN VAPOR COMPRESSION REFRIGERATION SYSTEM

    Directory of Open Access Journals (Sweden)

    Erol ARCAKLIOĞLU

    2003-02-01

    Full Text Available In this study, performance analysis of vapor-compression refrigeration system with suction/liquid line heat exchanger has been realized with the calculations of the coefficient of performance, and volumetric refrigeration capacity values using different refrigerant mixtures. Refrigerants R12, R22, and R502 of CFCs, R134a, R152a, R125, R143a, and R32 of HFCs, R600a, and R290 of HCs, and their binary, ternary, and mixtures of different mass ratios have been used as working fluids. In order to decrease global pollution due to CFCs in accordance with Montreal Protocol in 1987, it is considered to use the refrigerant mixtures of HFCs, and HCs instead of CFCs (R12, R22, and R502. For this reason, the performance comparison of the new mixtures with CFC refrigerants has been done in the frame of this study. To compare the performance values, constant temperature method has been used. Thermodynamic properties of refrigerants that were used in the performance calculations have been taken from REFPROP 6.01. For this aim, new software has written in FORTRAN programing language using sub-programs of REFPROP, and all related calculations of performance have been achieved by this software.

  10. Textile Machinery: Imports Rebound Again

    Institute of Scientific and Technical Information of China (English)

    Zheng Yan

    2007-01-01

    @@ In the year of 2006, the general situation of China's textile machinery equipment imports had shown a clear sign of revival from the downward trend of two years ago, with a total annual import of 4.1 billion USD, an increase of 19.05% against the same period of 2005.

  11. Tractor & Machinery Safety. 1984 Revision.

    Science.gov (United States)

    Montana State Office of Public Instruction, Helena. Dept. of Vocational Education Services.

    This curriculum guide is intended for use in teaching an instructional unit in tractor and machinery safety that is geared toward college freshmen. Addressed in the individual lessons of the unit are the following topics: understanding the importance of safe and efficient tractor operation, understanding the characteristics of tractors, preparing…

  12. Confined vortices in flow machinery

    Science.gov (United States)

    Escudier, Marcel

    After noting such basic aspects of vortex flows as the concepts of supercritical and subcritical flow and vortex breakdown, swirling flow behavior in various practical devices is discussed. The devices in question encompass swirl-stabilized combustion in industrial combustion chambers, fluidic vortex amplifiers that may be used as large scale valves, turbomachine outlets that can efficiently divert axial throughflow in a tangential direction, 'cyclone' separators, turbine draft tube surge phenomena, and the Ranque-Hilsch refrigeration tube.

  13. Mechanical Reliability of Aged Lead-­Free Solders

    OpenAIRE

    Lewin, Susanne

    2012-01-01

    The usage of lead-­free solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards arising with the use of lead. As a consequence, lead is legally prohibited in the European Union and the industry is aiming to produce lead-free products.            The reliability of solder joints is an important issue as the failure could destroy the whole function of a product. SnAgCu is a commonly used alloy for lead-­free solders. Co...

  14. Solder technology in the manufacturing of electronic products

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1993-08-01

    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  15. Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

    Institute of Scientific and Technical Information of China (English)

    CHEN Wenxue; XUE Songbai; WANG Hui; WANG Jianxin; HAN Zongjie

    2009-01-01

    The eutectie Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quan-tity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxi-dation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti-nosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the pre-cipitation of ε-AgZn_3 from the liquid solder on preformed interracial intermetallics (Cu_5Zn_8). The peripheral AgZn_3, nodular on the Cu_5Zn_8 IMCs layer, is likely to be generated by a peritectic reaction L+γ-Ag_5Zn8→ε-AgZn_3 and the following crystallization of AgZn_3.

  16. 46 CFR 154.1720 - Indirect refrigeration.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 5 2010-10-01 2010-10-01 false Indirect refrigeration. 154.1720 Section 154.1720... § 154.1720 Indirect refrigeration. A refrigeration system that is used to cool acetaldehyde, ethylene oxide, or methyl bromide, must be an indirect refrigeration system that does not use vapor compression....

  17. Magnetic Refrigeration and the Magnetocaloric Effect

    DEFF Research Database (Denmark)

    Petersen, Thomas Frank; Pryds, Nini; Smith, Anders

    2006-01-01

    Magnetic refrigeration at room temperature is an emerging technology for refrigeration, which promises low energy consumption and is environmentalle friendly. Magnetic refrigeration is based on the magnetocaloric effect, which manifests itself as a reversibel increase in temperature when magnetic...... material are plased in a magnetic field. This paper introduces and describes magnetic refrigeration cycles and the magnetocaloric effect, and shows how magnetic refrigeration can be an alternative to vapour-compression refrigeration,. A review of the Danish research on magnetic refrigeration at Risø...

  18. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  19. Energy Savings Thanks to French Textile Machinery

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    @@ The French Textile Machinery Manufacturers' Association (UCMTF) has presented, during a seminar it organized for textile professionals and students, the spectacular energy savings achieved thanks to state of the art machinery.

  20. Italian Textile Machinery Seminar in Bangladesh

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    The Association of Italian Textile Machinery Manufacturers (ACIMIT) and the Italian Trade Commission will hold a technological seminar on "Italian textile machinery: the way to improve Bangladesh textile competitiveness"

  1. Refrigerating fluids; Fluides frigorigenes

    Energy Technology Data Exchange (ETDEWEB)

    Anon.

    1999-03-01

    Refrigerating fluids are experiencing a real revolution since few years. CFCs with their destructive effect on the ozone layer are now prohibited while HCFCs will be progressively eliminated and replaced by HFCs. However, HFCs can contribute to the increase of the greenhouse effect. The solutions proposed by thermal engineering professionals consist in the confinement of air-conditioning installations (elimination of recurrent leaks) and in the improvement of installations efficiency. HCFC fluids like the R 22 are still widely used in air-conditioning but they are supposed to be replaced by HFC fluids like the R 134a, the R 407C or the R 410A. This short paper gives a brief presentation of these fluids and of their chemical characteristics. (J.S.)

  2. Supermarket refrigerators with natural refrigerants; Supermarktkaelteanlagen mit natuerlichen Kaeltemitteln. Erfahrungsbericht

    Energy Technology Data Exchange (ETDEWEB)

    Haaf, S.; Heinbokel, B. [Linde AG, Koeln (Germany). Gechaeftsbereich Linde Kaeltetechnik

    2002-09-01

    In view of the high contribution to global warming of H-CFC refrigerants, substitution has been a key concern for several years now. Leakage protection measures were enhanced, and Linde also installed many supermarket refrigerators with natural refrigerants, i.e. ammonia, propene and carbon dioxide. The environmental and economic aspects are assessed on the basis of the experience gained, and the systems are compared with H-CFC refrigeration systems. [German] Wegen des betraechtlichen Treibhauspotentials von HFKW-Kaeltemitteln werden seit Jahren Anstrengungen unternommen, um den von diesen Stoffen ausgehenden Treibhauseffekt zu reduzieren. Neben Massnahmen zur Verminderung von Leckagen sowie zur Verringerung von Kaeltemittel-Fuellmengen wurden im Laufe der letzten 10 Jahre von Linde auch zahlreiche Kaelteanlagen mit den natuerlichen Kaeltemitteln Ammoniak, Propen und Kohlendioxid in Supermaerkten installiert. Auf Basis der gesammelten Erfahrungen wird eine Einschaetzung der umweltspezifischen und wirtschaftlichen Aspekte im Vergleich zu Anlagen mit HFKW-Kaeltemitteln vorgenommen. (orig.)

  3. High temperature solder alloys for underhood applications. Progress report

    Energy Technology Data Exchange (ETDEWEB)

    Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Labs., Albuquerque, NM (United States); Kern, J.; Weiser, M.W. [Univ. of New Mexico (United States). Dept. of Mechanical Engineering

    1995-02-01

    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  4. 30 CFR 56.14204 - Machinery lubrication.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Machinery lubrication. 56.14204 Section 56.14204 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... Equipment Safety Practices and Operational Procedures § 56.14204 Machinery lubrication. Machinery...

  5. 30 CFR 57.14204 - Machinery lubrication.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Machinery lubrication. 57.14204 Section 57.14204 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... Equipment Safety Practices and Operational Procedures § 57.14204 Machinery lubrication. Machinery...

  6. 46 CFR 176.804 - Machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Machinery. 176.804 Section 176.804 Shipping COAST GUARD... CERTIFICATION Material Inspections § 176.804 Machinery. At each initial and subsequent inspection for... ready for inspections of machinery, fuel, and piping systems, including the following: (a) Operation...

  7. 46 CFR 130.450 - Machinery alarms.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Machinery alarms. 130.450 Section 130.450 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) OFFSHORE SUPPLY VESSELS VESSEL CONTROL, AND MISCELLANEOUS EQUIPMENT AND SYSTEMS Automation of Unattended Machinery Spaces § 130.450 Machinery alarms....

  8. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders for inte......Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  9. Method of defence of solder surface from oxidization

    Directory of Open Access Journals (Sweden)

    Kurmashev Sh. D.

    2010-02-01

    Full Text Available Compositions are developed for defence of fusion solder from oxidization on the basis of mixture of glycerin, urea and powders of refractory oxides, carbides (Al2O3, TiO2, SIC, graphite. The offered compositions can be used for defence of fusion of solder from oxidization in the process of soludering and tinning of explorers, and also electric conclusions of elements of radio electronic apparatus by the method of immersion in stationary baths.

  10. Critical evaluations of lead-free solder alloys and performance comparisons

    Energy Technology Data Exchange (ETDEWEB)

    Hitch, T.T.; Palit, K.; Prabhu, A.N. [David Sarnoff Research Center, Princeton, NJ (United States)

    1996-12-31

    This paper discusses the methodology for solder alloy selection, solder preparation processes, test selection, results, and conclusions. The conclusions from this phase of study were that: (1). Solders containing significant amounts of bismuth exhibit poor fatigue life. (2). The Sn-Ag-Cu alloy was the best solder we studied for use as a replacement for Sn-Pb eutectic. A second phase of the work involved detailed study of the Sn-Ag-Cu system with other additions to determine the optimum lead-free solder compositions in terms of melting point, solderability, and mechanical properties.

  11. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    OpenAIRE

    Liu Mei Lee; Ahmad Azmin Mohamad

    2013-01-01

    This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also disc...

  12. High Efficiency Refrigeration Process Project

    Data.gov (United States)

    National Aeronautics and Space Administration — A refrigeration cycle is proposed for development which can reduce compressor work and increase cooling effect, by eliminating a portion of the irreversabilities...

  13. Microsurgical anastomosis of sperm duct by laser tissue soldering

    Science.gov (United States)

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard

    2005-04-01

    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  14. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  15. Creep properties of Pb-free solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Song, H.G.; Morris Jr., J.W.; Hua, F.

    2002-04-01

    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  16. Solderability perservative coatings: Electroless tin vs. organic azoles

    Energy Technology Data Exchange (ETDEWEB)

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1993-07-01

    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  17. Soldering in prosthodontics--an overview, part I.

    Science.gov (United States)

    Byrne, Gerard

    2011-04-01

    The fit of fixed multiunit dental prostheses (FDP), traditionally termed fixed partial dentures (FPDs), is an ongoing problem. Poorly fitting restorations may hasten mechanical failure, due to abutment caries or screw failure. Soldering and welding play an important role in trying to overcome misfit of fixed multiunit prostheses. The term FPD will be used to denote multiunit fixed dental prostheses in this review. This is the first of a series of articles that review the state of the art and science of soldering and welding in relation to the fit of cemented or screw-retained multiunit prostheses. A comprehensive archive of background information and scientific findings is presented. Texts in dental materials and prosthodontics were reviewed. Scientific data were drawn from the numerous laboratory studies up to and including 2009. The background, theory, terminology, and working principles, along with the applied research, are presented. This first article focuses on soldering principles and dimensional accuracy in soldering. There is some discussion and suggestions for future research and development. Soldering may improve dimensional accuracy or reduce the distortion of multiunit fixed prostheses. Many variables can affect the outcome in soldering technique. Research science has developed some helpful guidelines. Research projects are disconnected and limited in scope. © 2011 by The American College of Prosthodontists.

  18. Soldering of Thin Film-Metallized Glass Substrates

    Energy Technology Data Exchange (ETDEWEB)

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.

    1999-03-31

    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  19. Rare Earths and Magnetic Refrigeration

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Magnetic refrigeration is a revolutionary, efficient, environmentally friendly cooling technology, which is on the threshold of commercialization. The magnetic rare earth materials are utilized as the magnetic refrigerants in most cooling devices, and for many cooling application the Nd2Fe14B permanent magnets are employed as the source of the magnetic field. The status of the near room temperature magnetic cooling was reviewed.

  20. Short-Cycle Adsorption Refrigerator

    Science.gov (United States)

    Chan, C. K.

    1988-01-01

    Modular adsorption/Joule-Thomson-effect refrigerator offers fast regeneration; adsorption/desorption cycle time expected to be 1 minute. Pressurized hydrogen generated by bank of compressor modules during heating phase passes through system of check valves and expands in Joule-Thomson junction as it enters refrigeration chamber. Hydrogen absorbs heat from load before it is sucked out by another bank of compressor modules in cooling phase.

  1. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  2. MACHINERY

    African Journals Online (AJOL)

    Data were collected using a portable data acquisition system: SKF Microlog. Data were collected' ... Modelling (HMM) ofvibrational signals. ... trifugal pump designed for a pressure increase of. 6.6 bars at ..... These frequency amplitudes are located at the vertical. axial and .... distribution centre the residual chlorine concen-.

  3. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    Science.gov (United States)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-11-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  4. Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

    Institute of Scientific and Technical Information of China (English)

    HUANG Chun-yue; WU Zhao-hua; HUANG Hong-yan; ZHOU De-jian

    2005-01-01

    The solder joint reliability of a 0. 5 mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plastic strain range of the solder joints were determined. Based on the calculated maximum plastic strain range the thermal fatigue life of the solder joints was calculated using Coffin-Manson equation. The influences of shape parameters including volume of solder joint, pad size and stand-off on the thermal fatigue life of the solder joints were also studied. The results show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain occur at the topmost point where the solder joint intersects with the inner side of the lead. The solder joint cracks should occur firstly at this point and propagate along the interface between the solder and the lead. The solder joint with the pad size of 1.25 mm× 0.35 mm, the stand-off of 0.02 mm and the solder volume of 0. 026 mm3 has longer fatigue life than that of any others. These optimal parameters have been applied in practice to assemble the 240-pin, 0.5 mm pitch QFP.

  5. Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chang, T.-C. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Wang, J.-W. [Department of Environmental and Safety Engineering, Chung Hwa College of Medical Technology, 89 Wen-Hwa 1st Street, Jen-Te, Tainan 71703, Taiwan (China); Wang, M.-C. [Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China)]. E-mail: mcwang@cc.kuas.edu.tw; Hon, M.-H. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Da-Yeh University, 112 Shan Jean Road, Da-tsuen, Chang-hua, Taiwan (China)

    2006-09-28

    The thermal properties, microstructure corrosion and oxidation resistance of the Sn-9Zn-0.5Ag-1In lead-free solder have been investigated by differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, potentiostat and thermogravimetry. The Sn-9Zn-0.5Ag-1In solder alloy has a near-eutectic composition, it melts at 187.6 deg. C and the heat of fusion is determined as 71.3 J/g. The Sn-9Zn-0.5Ag-1In solder alloy with a corrosion potential of -1.09 V{sub SCE} and a current density of 9.90 x 10{sup -2} A/cm{sup 2}, shows a better corrosion resistance than that of the Sn-9Zn solder alloy. From the thermogravimetry analysis, the weight gain ratio of the Sn-9Zn solder alloy appears a parabolic relationship at 150 deg. C. The initial oxidation behavior of the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Ag-1In solder alloys also shows a parabolic relationship but the weight gain ratio of them appears a negative linear one after aging at 150 deg. C for 2.5 and 5 h, respectively.

  6. Refrigerant recycling apparatus, method and system

    Energy Technology Data Exchange (ETDEWEB)

    Christensen, J.P.; Gordon, R.F.

    1993-07-13

    A refrigerant recycling apparatus for recovery and purification of refrigerant is described comprising: (a) an input conduit system for connecting a refrigerant source to the refrigerant recycling apparatus; (b) a first disposable filter capable of removing moisture and particulates from the refrigerant, said disposable filter being located such that the filter is easily accessible for service; (c) a primary heat exchanger configured so as to provide heat to the refrigerant thereby causing the refrigerant to be vaporized; (d) a secondary heat exchanger for further heating of the refrigerant to further assist in vaporization of the refrigerant; (e) an expansion valve located prior in line to said primary and secondary heat exchangers for controlling the flow of the refrigerant and reducing the pressure of the refrigerant, thereby allowing the refrigerant to expand to a predominantly gaseous state; (f) a separator for removing oil from the refrigerant; (g) a compressor pump having a vacuum producing inlet and a pressure producing outlet, the pump being a hermetically sealed, lubricated-for-life positive displacement pump; (h) a condenser for cooling the refrigerant; (i) a second disposable filter for removing moisture, acids, and other particulates from the refrigerant passing there through, said disposable filter being located in an area easily accessible for servicing; (j) an interconnecting conduit system for interconnecting the input conduit system, the first and second disposable filters, the heat exchangers, the compressor pump, the condenser, the expansion valve, and the refrigerant source; (k) a moisture indicator located after the second disposable filter, for measuring the degree of moisture present within the refrigerant after the refrigerant has flowed through the second disposable filter.

  7. Strategies for Improving Enterprise Standardization Management of Tropical Crop Machinery

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    @@ There are two categories of tropical crop machinery. One comprises operation machinery that is used for planting, managing and harvesting tropical crops, while the other comprises process machinery for processing tropical crops. Tropical crop machinery is distinguished from other agricultural machinery by the special crops that such machinery cultivates and processes.

  8. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Science.gov (United States)

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan

    2016-04-01

    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  9. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

    Institute of Scientific and Technical Information of China (English)

    Fuquan LI; Chunqing WANG; Yanhong TIAN

    2006-01-01

    The interfacial phenomena of the Sn-Pb solder droplet on Au/Ni/Cu pad are investigated. A continuous AuSn2and needle-like AuSn4 are formed at the interface after the liquid state reaction (soldering). The interfacial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface.The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.

  10. Development of a new Pb-free solder: Sn-Ag-Cu

    Energy Technology Data Exchange (ETDEWEB)

    Miller, C.M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  11. A critical review of constitutive models for solders in electronic packaging

    National Research Council Canada - National Science Library

    Chen, Gang; Zhao, Xiaochen; Wu, Hao

    2017-01-01

    .... Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality...

  12. Microbial leaching of waste solder for recovery of metal.

    Science.gov (United States)

    Hocheng, H; Hong, T; Jadhav, U

    2014-05-01

    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.

  13. Analysis of solderability test methods: predicition model generation for through-hole components

    OpenAIRE

    Woods, Bobby

    2013-01-01

    peer-reviewed In order to achieve a reduction in solderability related defects on electronic components and Printed Circuit Board???s (PCB???s) in electronics manufacturing, preventive controls such as ???Dip & Look??? and ???Wetting Balance??? solderability testing need to be fully optimised to screen out all poor soldering components and PCB???s. Components and PCB???s that pass these tests should solder correctly in volume production. This thesis initially investigates the variations...

  14. Methylene blue solder re-absorption in microvascular anastomoses

    Science.gov (United States)

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.

    2003-06-01

    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  15. Reliability of lead-free solders in electronic packaging technology

    Science.gov (United States)

    Choi, Woojin

    The electromigration of flip chip solder bump (eutetic SnPb) has been studied at temperatures of 100, 125 and 150°C and current densities of 1.9 to 2.75 x 104 A/cm2. The under-bump-metallization on the chip side is thin film Al/Ni(V)/Cu and on the board side is thick Cu. By simulation, we found that current crowding occurs at the corner on the chip side where the electrons enter the solder ball. We are able to match this simulation to the real electromigration damage in the sample. The experimental result showed that voids initiated from the position of current crowding and propagated across the interface between UBM and the solder ball. The Cu-Sn intermetallic compounds formed during the reflow is known to adhere well to the thin film UBM, but they detached from the UBM after current stressing. Therefore, the UBM itself becomes part of the reliability problem of the flip chip solder joint under electromigration. Currently there is a renewed interest in Sn whisker growth owing to the introduction of Pb-free solder in electronic manufacturing. The leadframe is electroplated or finished with a layer of Pb-free solder. The solder is typically pure Sn or eutectic SnCu (0.7 atomic % Cu). It is a serious reliability concern in the use of the eutectic SnCu solder as leadframe surface finish due to the growth of long whiskers on it. The origin of the driving force of compressive stress can be mechanical, thermal, and chemical. Among them, the chemical force is the most important contribution to the whisker growth and its origin is due to the reaction between Sn and Cu to form intermetallic compound (IMC) at room temperature. For whisker or hillock growth, the surface cannot be free of oxide and it must be covered with oxide and the oxide must be a protective one so that it removes effectively all the vacancy sources and sinks on the surface. Hence, only those metals, which grow protective oxides such as Al and Sn, are known to have hillock growth or whisker growth. We

  16. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan;

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, co...

  17. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  18. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  19. Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

    NARCIS (Netherlands)

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Kusters, R.H.L.; Cauwe, M.; Groen, W.A.; Brand, J. van den

    2014-01-01

    Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthala

  20. Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Nagy E.

    2015-06-01

    Full Text Available Interfacial intermetallic compounds (IMC play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

  1. Experimental Methods in Reduced-gravity Soldering Research

    Science.gov (United States)

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

    2002-01-01

    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  2. Low-temperature solder for laser tissue welding

    Science.gov (United States)

    Lauto, Antonio; Stewart, Robert B.; Felsen, D.; Foster, John; Poole-Warren, Laura; Poppas, Dix P.

    2003-12-01

    In this study, a two layer (TL) solid solder was developed with a fixed thickness to minimize the difference in temperature across the solder (ΔT) and to weld at low temperature. Solder strips comprising two layers (65% albumin, 35% water) were welded onto rectangular sections of dog small intestine by a diode laser (λ = 808 nm). The laser delivered a power of 170 +/- 10 mW through an optical fiber (spot size approximately 1 mm) for 100 seconds. A solder layer incorporated also a dye (carbon black, 0.25%) to absorb the laser radiation. A thermocouple and an infrared thermometer system recorded the temperatures at the tissue interface and at the external solder surface, during welding. The repaired tissue was tested for tensile strength by a calibrated tensiometer. The TL strips were able to minimize ΔT (12 +/- 4°C) and control the temperature at tissue-interface. The strips fused on tissue at 55=70°C for tissue repair, which cause more irreversible thermal damage.

  3. REDUCING REFRIGERANT EMISSIONS FROM SUPERMARKET SYSTEMS

    Science.gov (United States)

    Large refrigeration systems are found in several applications including supermarkets, cold storage warehouses, and industrial processes. The sizes of these systems are a contributing factor to their problems of high refrigerant leak rates because of the thousands of connections, ...

  4. REDUCING REFRIGERANT EMISSIONS FROM SUPERMARKET SYSTEMS

    Science.gov (United States)

    Large refrigeration systems are found in several applications including supermarkets, cold storage warehouses, and industrial processes. The sizes of these systems are a contributing factor to their problems of high refrigerant leak rates because of the thousands of connections, ...

  5. Refrigeration system having dual suction port compressor

    Science.gov (United States)

    Wu, Guolian

    2016-01-05

    A cooling system for appliances, air conditioners, and other spaces includes a compressor, and a condenser that receives refrigerant from the compressor. The system also includes an evaporator that receives refrigerant from the condenser. Refrigerant received from the condenser flows through an upstream portion of the evaporator. A first portion of the refrigerant flows to the compressor without passing through a downstream portion of the evaporator, and a second portion of the refrigerant from the upstream portion of the condenser flows through the downstream portion of the evaporator after passing through the upstream portion of the evaporator. The second portion of the refrigerant flows to the compressor after passing through the downstream portion of the evaporator. The refrigeration system may be configured to cool an appliance such as a refrigerator and/or freezer, or it may be utilized in air conditioners for buildings, motor vehicles, or other such spaces.

  6. A review of pulse tube refrigeration

    Science.gov (United States)

    Radebaugh, Ray

    This paper reviews the development of the three types of pulse tube refrigerators: basic, resonant, and orifice types. The principles of operation are given. It is shown that the pulse tube refrigerator is a variation of the Stirling-cycle refrigerator, where the moving displacer is substituted by a heat transfer mechanism or by an orifice to bring about the proper phase shifts between pressure and mass flow rate. A harmonic analysis with phasors is described which gives reasonable results for the refrigeration power, yet is simple enough to make clear the processes which give rise to the refrigeration. The efficiency and refrigeration power are compared with those of other refrigeration cycles. A brief review is given of the research being done at various laboratories on both one- and two-stage pulse tubes. A preliminary assessment of the role of pulse tube refrigerators is discussed.

  7. Creep characterization of solder bumps using nanoindentation

    Science.gov (United States)

    Du, Yingjie; Liu, Xiao Hu; Fu, Boshen; Shaw, Thomas M.; Lu, Minhua; Wassick, Thomas A.; Bonilla, Griselda; Lu, Hongbing

    2017-08-01

    Current nanoindentation techniques for the measurement of creep properties are applicable to viscoplastic materials with negligible elastic deformations. A new technique for characterization of creep behavior is needed for situations where the elastic deformation plays a significant role. In this paper, the effect of elastic deformation on the determination of creep parameters using nanoindentation with a self-similar nanoindenter tip is evaluated using finite element analysis (FEA). It is found that the creep exponent measured from nanoindentation without taking into account of the contribution of elastic deformation tends to be higher than the actual value. An effective correction method is developed to consider the elastic deformation in the calculation of creep parameters. FEA shows that this method provides accurate creep exponent. The creep parameters, namely the creep exponent and activation energy, were measured for three types of reflowed solder bumps using the nanoindentation method. The measured parameters were verified using FEA. The results show that the new correction approach allows extraction of creep parameters with precision from nanoindentation data.

  8. Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Devender,; Ramanath, Ganpati, E-mail: Ramanath@rpi.edu [Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States); Lofgreen, Kelly; Devasenathipathy, Shankar; Swan, Johanna; Mahajan, Ravi [Intel Corporation, Assembly Test and Technology Development, Chandler, Arizona 85226 (United States); Borca-Tasciuc, Theodorian [Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States)

    2015-11-15

    Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides metallized with bilayers of Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5} solder and Ni barrier exhibit tenfold higher interfacial thermal conductance Γ{sub c} than that obtained with In/Ni bilayer metallization. X-ray diffraction and x-ray spectroscopy indicate that reduced interdiffusion and diminution of interfacial SnTe formation due to Ni layer correlates with the higher Γ{sub c}. Finite element modeling of thermoelectric coolers metallized with Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5}/Ni bilayers presages a temperature drop ΔT ∼ 22 K that is 40% higher than that obtained with In/Ni metallization. Our results underscore the importance of controlling chemical intermixing at solder–metal–thermoelectric interfaces to increase the effective figure of merit, and hence, the thermoelectric cooling efficiency. These findings should facilitate the design and development of lead-free metallization for pnictogen chalcogenide-based thermoelectrics.

  9. Load forecasting for supermarket refrigeration

    DEFF Research Database (Denmark)

    Bacher, Peder; Madsen, Henrik; Aalborg Nielsen, Henrik

    This report presents a study of models for forecasting the load for supermarket refrigeration. The data used for building the forecasting models consists of load measurements, local climate measurements and weather forecasts. The load measurements are from a supermarket located in a village...... in Denmark. The load for refrigeration is the sum of all cabinets in the supermarket, both low and medium temperature cabinets, and spans a period of one year. As input to the forecasting models the ambient temperature observed near the supermarket together with weather forecasts are used. Every hour...... the hourly load for refrigeration for the following 42 hours is forecasted. The forecast models are adaptive linear time-series models which are fitted with a computationally efficient recursive least squares scheme. The dynamic relations between the inputs and the load is modeled by simple transfer...

  10. Energy efficient Supermarket Refrigeration with Ejectors

    OpenAIRE

    Calvo Hoyas, Raul

    2014-01-01

    Nowadays, the use of R744 or carbon dioxide has been increased as a working fluid in many refrigerant systems. Nevertheless, one disadvantage for use this refrigerant is the thermodynamic losses produced in the refrigerant system when the fluid is throttled. These losses are increased if the refrigerant system is working in transcritical operation conditions. But, there is an option and it consists of using an ejector instead of the conventional expansion valve in order to reduce the energy l...

  11. Developing Process of Tropical Crop Machinery Standardization

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    @@ General Situation Tropical crop machinery is a new special mechanical profession, which began to develop from 1950s to 1960s in China. Because the weather, soil and farm crops varieties in tropical region are greatly different from those in the other regions, most of the traditional farm machinery can't be directly used in tropical region or on the tropical crops. Tropical crop machinery needs a special design and manufacture. So some professional research institutes and education units were set up and some enterprises were built at that time, and the profession of tropical crop machinery was formed.

  12. Membrane manipulations by the ESCRT machinery.

    Science.gov (United States)

    Odorizzi, Greg

    2015-01-01

    The endosomal sorting complexes required for transport (ESCRTs) collectively comprise a machinery that was first known for its function in the degradation of transmembrane proteins in the endocytic pathway of eukaryotic cells. Since their discovery, however, ESCRTs have been recognized as playing important roles at the plasma membrane, which appears to be the original site of function for the ESCRT machinery. This article reviews some of the major research findings that have shaped our current understanding of how the ESCRT machinery controls membrane dynamics and considers new roles for the ESCRT machinery that might be driven by these mechanisms.

  13. Load forecasting of supermarket refrigeration

    DEFF Research Database (Denmark)

    Rasmussen, Lisa Buth; Bacher, Peder; Madsen, Henrik

    2016-01-01

    This paper presents a novel study of models for forecasting the electrical load for supermarket refrigeration. The data used for building the models consists of load measurements, local climate measurements and weather forecasts. The load measurements are from a supermarket located in a village...... in Denmark. Every hour the hourly electrical load for refrigeration is forecasted for the following 42 h. The forecast models are adaptive linear time series models. The model has two regimes; one for opening hours and one for closing hours, this is modeled by a regime switching model and two different...

  14. Novel materials for laser refrigeration

    Science.gov (United States)

    Hehlen, Markus P.

    2009-02-01

    The status of optical refrigeration of rare-earth-doped solids is reviewed, and the various factors that limit the performance of current laser-cooling materials are discussed. Efficient optical refrigeration is possible in materials for which hωmax 100 ppb are believed to be the main reason for the limited laser-cooling performance in current materials. The many components of doped ZBLAN glass pose particular processing challenges. Binary fluoride glasses such as YF3-LiF are considered as alternatives to ZBLAN, and the crystalline system KPb2Cl5 :Dy3+ is identified as a prime candidate for high-efficiency laser cooling.

  15. Solar Refrigerators Store Life-Saving Vaccines

    Science.gov (United States)

    2014-01-01

    Former Johnson Space Center engineer David Bergeron used his experience on the Advanced Refrigeration Technology Team to found SunDanzer Refrigeration Inc., a company specializing in solar-powered refrigerators. The company has created a battery-free unit that provides safe storage for vaccines in rural and remote areas around the world.

  16. Heat driven refrigeration cycle at low temperatures

    Institute of Scientific and Technical Information of China (English)

    HE Yijian; HONG Ronghua; CHEN Guangming

    2005-01-01

    Absorption refrigeration cycle can be driven by low-grade thermal energy, such as solar energy, geothermal energy and waste heat. It is beneficial to save energy and protect environment. However, the applications of traditional absorption refrigeration cycle are greatly restricted because they cannot achieve low refrigeration temperature. A new absorption refrigeration cycle is investigated in this paper, which is driven by low-grade energy and can get deep low refrigeration temperature. The mixture refrigerant R23+R134a and an absorbent DMF are used as its working fluid. The theoretical results indicate that the new cycle can achieve -62℃ refrigeration temperature when the generation temperature is only 160℃. This refrigeration temperature is much lower than that obtained by traditional absorption refrigeration cycle. Refrigeration temperature of -47.3℃ has been successfully achieved by experiment for this new cycle at the generation temperature of 157℃, which is the lowest temperature obtained by absorption refrigeration system reported in the literature up to now. The theoretical and experimental results prove that new cycle can achieve rather low refrigeration temperature.

  17. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  18. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    Science.gov (United States)

    Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  19. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  20. Horizon Shells and BMS-like Soldering Transformations

    CERN Document Server

    Blau, Matthias

    2015-01-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like ...

  1. Development of alternatives to lead-bearing solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1993-07-01

    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  2. Bosonisation and Duality Symmetry in the Soldering Formalism

    CERN Document Server

    Banerjee, R

    1998-01-01

    We develop a technique that solders the dual aspects of some symmetry. Using this technique it is possible to combine two theories with such symmetries to yield a new effective theory. Some applications in two and three dimensional bosonisation are discussed. In particular, it is shown that two apparently independent three dimensional massive Thirring models with same coupling but opposite mass signatures, in the long wavelegth limit, combine by the process of bosonisation and soldering to yield an effective massive Maxwell theory. Similar features also hold for quantum electrodynamics in three dimensions. We also provide a systematic derivation of duality symmetric actions and show that the soldering mechanism leads to a master action which is duality invariant under a bigger set of symmetries than is usually envisaged. The concept of duality swapping is introduced and its implications are analysed. The example of electromagnetic duality is discussed in details.

  3. Corrosion Issues in Solder Joint Design and Service

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.

    1999-11-24

    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  4. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    Science.gov (United States)

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  5. Oils degradation in agricultural machinery

    Directory of Open Access Journals (Sweden)

    Vojtěch Kumbár

    2013-01-01

    Full Text Available Evaluating of oils condition in agricultural machinery is very important. With monitoring and evaluating we can prevent technical and economic losses. In this paper there were monitored the liquid lubricants taken from mobile thresher New Holland CX 860. Chemical and viscosity degradation of the lubricants were evaluated. Temperature dependence dynamic viscosity was observed in the range of temperature from −10 °C to 80 °C (for all oils. Considerable temperature dependence dynamic viscosity was found and demonstrated in case of all samples, which is in accordance with theoretical assumptions and literature data. Mathematical models were developed and tested. Temperature dependence dynamic viscosity was modeled using a polynomial 6th degree. The proposed models can be used for prediction of flow behavior of oils.

  6. Process characterization and control of hand-soldered printed wiring assemblies

    Energy Technology Data Exchange (ETDEWEB)

    Cheray, D.L.; Mandl, R.G.

    1993-09-01

    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  7. The impact of process parameters on gold elimination from soldered connector assemblies

    Energy Technology Data Exchange (ETDEWEB)

    VIANCO,PAUL T.; KILGO,ALICE C.

    2000-02-02

    Minimizing the likelihood of solder joint embrittlement in connectors is realized by reducing or eliminating retained Au plating and/or Au-Sn intermetallic compound formation from the assemblies. Gold removal is performed most effectively by using a double wicking process. When only a single wicking procedure can be used, a higher soldering temperature improves the process of Au removal from the connector surfaces and to a nominal extent, removal of Au-contaminated solder from the joint. A longer soldering time did not appear to offer any appreciable improvement toward removing the Au-contaminated solder from the joint. Because the wicking procedure was a manual process, it was operator dependent.

  8. High Efficiency, Low Emission Refrigeration System

    Energy Technology Data Exchange (ETDEWEB)

    Fricke, Brian A [ORNL; Sharma, Vishaldeep [ORNL

    2016-08-01

    Supermarket refrigeration systems account for approximately 50% of supermarket energy use, placing this class of equipment among the highest energy consumers in the commercial building domain. In addition, the commonly used refrigeration system in supermarket applications is the multiplex direct expansion (DX) system, which is prone to refrigerant leaks due to its long lengths of refrigerant piping. This leakage reduces the efficiency of the system and increases the impact of the system on the environment. The high Global Warming Potential (GWP) of the hydrofluorocarbon (HFC) refrigerants commonly used in these systems, coupled with the large refrigerant charge and the high refrigerant leakage rates leads to significant direct emissions of greenhouse gases into the atmosphere. Methods for reducing refrigerant leakage and energy consumption are available, but underutilized. Further work needs to be done to reduce costs of advanced system designs to improve market utilization. In addition, refrigeration system retrofits that result in reduced energy consumption are needed since the majority of applications address retrofits rather than new stores. The retrofit market is also of most concern since it involves large-volume refrigerant systems with high leak rates. Finally, alternative refrigerants for new and retrofit applications are needed to reduce emissions and reduce the impact on the environment. The objective of this Collaborative Research and Development Agreement (CRADA) between the Oak Ridge National Laboratory and Hill Phoenix is to develop a supermarket refrigeration system that reduces greenhouse gas emissions and has 25 to 30 percent lower energy consumption than existing systems. The outcomes of this project will include the design of a low emission, high efficiency commercial refrigeration system suitable for use in current U.S. supermarkets. In addition, a prototype low emission, high efficiency supermarket refrigeration system will be produced for

  9. A new active solder for joining electronic components

    Energy Technology Data Exchange (ETDEWEB)

    SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.; LUGSCHEIDER,E.; RASS,I.; HILLEN,F.

    2000-05-11

    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  10. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging

    Directory of Open Access Journals (Sweden)

    M. N. Harif

    2010-01-01

    Full Text Available Problem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique to increase the service life of future connections is not the total solution. A method must be developed for predicting the remaining service life of many joints already in use. Approach: The effect of High Temperature Storage (HTS on lead free solder joint material for ball grid array application using pull test method is studied in this study. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387, Sn2.3Ag0.08Ni0.01Co (SANC and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contains 8 balls. Results: The mean pull strength for high temperature storage is 2847.66, 2628.20 and 2613.79 g for Sn3.5Ag, SANC and SAC387, respectively. Thus, Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, Intermetallic Compound (IMC thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139, 2.3111 and 2.3931 µm. Conclusion/Recommendations: It was found that IMC thickness for SANC and Sn3

  11. Low-temperature magnetic refrigerator

    Science.gov (United States)

    Barclay, John A.

    1985-01-01

    The disclosure is directed to a low temperature 4 to 20 K. refrigeration apparatus and method utilizing a ring of magnetic material moving through a magnetic field. Heat exchange is accomplished in and out of the magnetic field to appropriately utilize the device to execute Carnot and Stirling cycles.

  12. The Olympic of Textile Machinery closed

    Institute of Scientific and Technical Information of China (English)

    2012-01-01

    The five days 2012 China International Textile Machinery Exhibition ITMA Asia Exhibition, which attracted much attention from the industry, was closed at the Shanghai New International Expo Center on June 16, more than 1300 textile enterprises from nearly 30 countries around the world gathered on the exhibition, the world’s latest textile machinery technologies, crafts and equipments were also presented one by one.

  13. 46 CFR 115.804 - Machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Machinery. 115.804 Section 115.804 Shipping COAST GUARD....804 Machinery. At each initial and subsequent inspection for certification of a vessel, the owner or managing operator shall be prepared to conduct tests and have the vessel ready for inspections of...

  14. China Textile Machinery Expresses Self-Surpassing

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    It’s difficult to imagine that any sector of the textile industry has benefited more from innovations in the past 10 years than textile machinery. Advanced textile machinery has brought new life to the production segment of the business and fulfills the essential preconditions for economically efficient textile production.

  15. Application of magnetic refrigeration and its assessment

    Energy Technology Data Exchange (ETDEWEB)

    Kitanovski, Andrej [University of Applied Sciences of Western Switzerland, Hesso, Institute of Thermal Sciences IGT-SIT, Route de Cheseaux 1, CH 1401 Yverdon-les-Bains (Switzerland)], E-mail: andrej.kitanovski@heig-vd.ch; Egolf, Peter W. [University of Applied Sciences of Western Switzerland, Hesso, Institute of Thermal Sciences IGT-SIT, Route de Cheseaux 1, CH 1401 Yverdon-les-Bains (Switzerland)

    2009-04-15

    Magnetic refrigeration has the potential to replace conventional refrigeration-with often problematic refrigerants-in several niche markets or even some main markets of the refrigeration domain. Based on this insight, for the Swiss Federal Office of Energy a list of almost all existing refrigeration technologies was worked out. Then an evaluation how good magnetic refrigeration applies to each of these technologies was performed. For this purpose a calculation tool to determine the coefficient of performance (COP) and the exergy efficiency as a function of the magnetic field strength and the rotation frequency of a rotary-type magnetic refrigerator was developed. The evaluation clearly shows that some application domains are more ideal for a replacement of conventional refrigerators by their magnetic counterparts than others. In the pre-study, four good examples were chosen for a more comprehensive investigation and working out of more detailed results. In this article, the calculation method is briefly described. COP values and exergy efficiencies of one very suitable technology, namely the magnetic household refrigerator, are presented for different operation conditions. Summarizing, it is stated that magnetic refrigeration is a serious environmentally benign alternative to some conventional cooling, refrigeration and air-conditioning technologies.

  16. 46 CFR 58.01-40 - Machinery, angles of inclination.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Machinery, angles of inclination. 58.01-40 Section 58.01... AUXILIARY MACHINERY AND RELATED SYSTEMS General Requirements § 58.01-40 Machinery, angles of inclination. (a) Propulsion machinery and all auxiliary machinery essential to the propulsion and safety of the vessel must...

  17. 46 CFR 58.01-45 - Machinery space, ventilation.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Machinery space, ventilation. 58.01-45 Section 58.01-45... MACHINERY AND RELATED SYSTEMS General Requirements § 58.01-45 Machinery space, ventilation. Each machinery space must be ventilated to ensure that, when machinery or boilers are operating at full power in...

  18. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    Science.gov (United States)

    Choi, Sunglak

    2001-07-01

    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  19. When are solar refrigerators less costly than on-grid refrigerators: A simulation modeling study.

    Science.gov (United States)

    Haidari, Leila A; Brown, Shawn T; Wedlock, Patrick; Connor, Diana L; Spiker, Marie; Lee, Bruce Y

    2017-04-19

    Gavi recommends solar refrigerators for vaccine storage in areas with less than eight hours of electricity per day, and WHO guidelines are more conservative. The question remains: Can solar refrigerators provide value where electrical outages are less frequent? Using a HERMES-generated computational model of the Mozambique routine immunization supply chain, we simulated the use of solar versus electric mains-powered refrigerators (hereafter referred to as "electric refrigerators") at different locations in the supply chain under various circumstances. At their current price premium, the annual cost of each solar refrigerator is 132% more than each electric refrigerator at the district level and 241% more at health facilities. Solar refrigerators provided savings over electric refrigerators when one-day electrical outages occurred more than five times per year at either the district level or the health facilities, even when the electric refrigerator holdover time exceeded the duration of the outage. Two-day outages occurring more than three times per year at the district level or more than twice per year at the health facilities also caused solar refrigerators to be cost saving. Lowering the annual cost of a solar refrigerator to 75% more than an electric refrigerator allowed solar refrigerators to be cost saving at either level when one-day outages occurred more than once per year, or when two-day outages occurred more than once per year at the district level or even once per year at the health facilities. Our study supports WHO and Gavi guidelines. In fact, solar refrigerators may provide savings in total cost per dose administered over electrical refrigerators when electrical outages are less frequent. Our study identified the frequency and duration at which electrical outages need to occur for solar refrigerators to provide savings in total cost per dose administered over electric refrigerators at different solar refrigerator prices. Copyright © 2017. Published

  20. High-temperature lead-free solder alternatives

    DEFF Research Database (Denmark)

    Nachiappan, Vivek Chidambaram; Hattel, Jesper Henri; Hald, John

    2011-01-01

    For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C a...

  1. Thermomechanical fatigue damage evolution in SAC solder joints

    NARCIS (Netherlands)

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.

    2007-01-01

    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  2. Porosity in collapsible Ball Grid Array solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Gonzalez, C.A. [Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering]|[Lawrence Berkeley National Lab., Berkeley, CA (United States). Materials Science Div.

    1998-05-01

    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  3. Fundamentals of wetting and spreading with emphasis on soldering

    Energy Technology Data Exchange (ETDEWEB)

    Yost, F.G.

    1991-01-01

    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  4. Horizon shells and BMS-like soldering transformations

    Science.gov (United States)

    Blau, Matthias; O'Loughlin, Martin

    2016-03-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  5. Thermomechanical fatigue damage evolution in SAC solder joints

    NARCIS (Netherlands)

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.

    2007-01-01

    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  6. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    Science.gov (United States)

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  7. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  8. Recycling of lead solder dross, Generated from PCB manufacturing

    Science.gov (United States)

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

    2011-08-01

    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  9. Roles of interfacial reaction on mechanical properties of solder interfaces

    Science.gov (United States)

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the

  10. Stochastic noise in splicing machinery.

    Science.gov (United States)

    Melamud, Eugene; Moult, John

    2009-08-01

    The number of known alternative human isoforms has been increasing steadily with the amount of available transcription data. To date, over 100 000 isoforms have been detected in EST libraries, and at least 75% of human genes have at least one alternative isoform. In this paper, we propose that most alternative splicing events are the result of noise in the splicing process. We show that the number of isoforms and their abundance can be predicted by a simple stochastic noise model that takes into account two factors: the number of introns in a gene and the expression level of a gene. The results strongly support the hypothesis that most alternative splicing is a consequence of stochastic noise in the splicing machinery, and has no functional significance. The results are also consistent with error rates tuned to ensure that an adequate level of functional product is produced and to reduce the toxic effect of accumulation of misfolding proteins. Based on simulation of sampling of virtual cDNA libraries, we estimate that error rates range from 1 to 10% depending on the number of introns and the expression level of a gene.

  11. 5-year operation experience with the 1.8 K refrigeration units of the LHC cryogenic system

    CERN Document Server

    Ferlin, G; Claudet, S; Pezzetti, M

    2015-01-01

    Since 2009, the Large Hadron Collider (LHC) is in operation at CERN. The LHC superconducting magnets distributed over eight sectors of 3.3-km long are cooled at 1.9 K in pressurized superfluid helium. The nominal operating temperature of 1.9 K is produced by eight 1.8-K refrigeration units based on centrifugal cold compressors (3 or 4 stages depending to the vendor) combined with warm volumetric screw compressors with sub-atmospheric suction. After about 5 years of continuous operation, we will present the results concerning the availability for the final user of these refrigeration units and the impact of the design choice on the recovery time after a system trip. We will also present the individual results for each rotating machinery in terms of failure origin and of Mean Time between Failure (MTBF), as well as the consolidations and upgrades applied to these refrigeration units.

  12. FORMATION AND CHANGE OF AuSn4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING

    Institute of Scientific and Technical Information of China (English)

    Y.H.Tian; C.Q.Wang

    2004-01-01

    Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was refowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.

  13. When are solar refrigerators less costly than on-grid refrigerators: A simulation modeling study☆

    Science.gov (United States)

    Haidari, Leila A.; Brown, Shawn T.; Wedlock, Patrick; Connor, Diana L.; Spiker, Marie; Lee, Bruce Y.

    2017-01-01

    Background Gavi recommends solar refrigerators for vaccine storage in areas with less than eight hours of electricity per day, and WHO guidelines are more conservative. The question remains: Can solar refrigerators provide value where electrical outages are less frequent? Methods Using a HERMES-generated computational model of the Mozambique routine immunization supply chain, we simulated the use of solar versus electric mains-powered refrigerators (hereafter referred to as “electric refrigerators”) at different locations in the supply chain under various circumstances. Results At their current price premium, the annual cost of each solar refrigerator is 132% more than each electric refrigerator at the district level and 241% more at health facilities. Solar refrigerators provided savings over electric refrigerators when one-day electrical outages occurred more than five times per year at either the district level or the health facilities, even when the electric refrigerator holdover time exceeded the duration of the outage. Two-day outages occurring more than three times per year at the district level or more than twice per year at the health facilities also caused solar refrigerators to be cost saving. Lowering the annual cost of a solar refrigerator to 75% more than an electric refrigerator allowed solar refrigerators to be cost saving at either level when one-day outages occurred more than once per year, or when two-day outages occurred more than once per year at the district level or even once per year at the health facilities. Conclusion Our study supports WHO and Gavi guidelines. In fact, solar refrigerators may provide savings in total cost per dose administered over electrical refrigerators when electrical outages are less frequent. Our study identified the frequency and duration at which electrical outages need to occur for solar refrigerators to provide savings in total cost per dose administered over electric refrigerators at different solar

  14. Available energy analysis of new tandem double-capillary tube refrigeration system for refrigerator-freezers

    Institute of Scientific and Technical Information of China (English)

    Maogang HE; Xinzhou SONG; Ying ZHANG; Jiantao ZHANG

    2008-01-01

    A new tandem double-capillary tube refri-geration system for refrigerator-freezers is proposed. A capillary tube was added between the two evaporators in the fresh and frozen food storage chests to raise the evaporation temperature of the refrigerating chamber, and reduce the heat exchange temperature difference and the available energy loss. Peng-Robinson (P-R) equation of state was adopted to calculate the thermodynamic properties of the refrigerants, and the available energy analysis of the vapor compression refrigeration cycle was programmed to calculate the thermodynamic perfor-mances of the new and the conventional refrigeration cycle of the refrigerator-freezer. The calculation results show that the available energy efficiency of the conven-tional refrigeration cycle of the refrigerator-freezer is 21.20% and 20.57%, respectively when the refrigerant is R12 and R134a, while that of the double-capillary tube refrigeration cycle of the refrigerator-freezer is 23.97% and 23.44%, respectively. By comparison, the available energy efficiency of the new refrigeration system increases by 13.07% and 13.95%, respectively.

  15. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Science.gov (United States)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-09-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  16. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Science.gov (United States)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-12-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  17. Mountain Plains Learning Experience Guide: Heating, Refrigeration, & Air Conditioning.

    Science.gov (United States)

    Carey, John

    This Heating, Refrigeration, and Air Conditioning course is comprised of eleven individualized units: (1) Refrigeration Tools, Materials, and Refrigerant; (2) Basic Heating and Air Conditioning; (3) Sealed System Repairs; (4) Basic Refrigeration Systems; (5) Compression Systems and Compressors; (6) Refrigeration Controls; (7) Electric Circuit…

  18. CO2 as a refrigerant

    CERN Document Server

    2014-01-01

    A first edition, the IIR guide “CO2 as a Refrigerant” highlights the application of carbon dioxide in supermarkets, industrial freezers, refrigerated transport, and cold stores as well as ice rinks, chillers, air conditioning systems, data centers and heat pumps. This guide is for design and development engineers needing instruction and inspiration as well as non-technical experts seeking background information on a specific topic. Written by Dr A.B. Pearson, a well-known expert in the field who has considerable experience in the use of CO2 as a refrigerant. Main topics: Thermophysical properties of CO2 – Exposure to CO2, safety precautions – CO2 Plant Design – CO2 applications – Future prospects – Standards and regulations – Bibliography.

  19. The APL Satellite Refrigerator Program.

    Science.gov (United States)

    1981-07-01

    36: Fotonic sensor fibers................................ 72 Fig. 37: Vibration levels for S/N 4.......................... 73L Fig. 38: Displacers of...available. This was later achieved by using a Fotonic sensor. 70 The noise level was measured by placing an operating unit in the center of a room...with the refrigerator in operation. To measure this displacement, a Fotonic sensor was mounted on an independent surface with the sensor probe

  20. Molecular modeling of fluoropropene refrigerants.

    Science.gov (United States)

    Raabe, Gabriele

    2012-05-17

    Different fluoropropenes are currently considered as refrigerants, either as pure compounds or as components in low GWP (global warming potential) refrigerant mixtures. Due to their limited commercial production, experimental data for the thermophysical properties of fluoropropenes and their mixtures are in general rare, which hampers the exploration of their performance in technical applications. In principle, molecular simulation can be used to predict the relevant properties of refrigerants and refrigerant blends, provided that adequate intermolecular potential functions ("force fields") are available. In our earlier work (Raabe, G.; Maginn, E. J., J. Phys. Chem. B2010, 114, 10133-10142), we introduced a transferable force field for fluoropropenes comprising the compounds 3,3,3-trifluoro-1-propene (HFO-1243zf), 2,3,3,3-tetrafluoro-1-propene (HFO-1234yf), and hexafluoro-1-propene (HFO-1216). In this paper, we provide an extension of the force field model to the trans- and cis-1,3,3,3-tetrafluoro-1-propene (HFO-1234ze(E), HFO-1234ze) and the cis-1,2,3,3,3-pentafluoro-1-propene (HFO-1225ye(Z)) as well as revised simulation results for HFO-1216. We present Gibbs ensemble simulation results on the vapor pressures, saturated densities, and heats of vaporization of these compounds in comparison with experimental results. The simulation results show that the force field model enables reliable predictions of the properties of the different fluoropropenes and also reproduces well the differing vapor-liquid coexistence and vapor pressure curve of the cis- and trans-isomers of 1,3,3,3-tetrafluoro-1-propene, HFO-1234ze and HFO-1234ze(E). For these two isomers, we also present molecular dynamics simulation studies on their local structure.

  1. Experimental Study of Air Conditioning Unit of Evaporative Cooling Assisted Mechanical Refrigeration

    Institute of Scientific and Technical Information of China (English)

    HUANG Xiang; XU Fang-cheng; WU Jun-mei

    2009-01-01

    The evaporative cooling,which assists the refrigeration machinery air-conditioning systems test-rig,has been designed.Its structure and working principle were described,and the performance test was con-ducted and analyzed.The test shows that making full use of the evaporative cooling"free cooling" in Spring and Autumn seasons can fully meet the requirements of air-conditioned comfort through the switch of the function in different seasons.Taking into account the evaporative cooling fan and pump energy consumption,compared with the traditional mechanical refrigeration system,more than 80 percent of energy can be saved,and the ener-gY efficiency ratio of the Unit(EER) is as high as 7.63.Using the two stages of indirect evaporative cooling to pre-cool the new wind in summer,under the conditions of the same air supply temperature requirements,0.83 kg/s chilled water saved can be equivalent to the traditional mechanical refrigeration system,and when the newwind ratio up to 50 percent.more than 10 percent load was reduced in mechanical refrigeration system.The overall EER increased about 35 percent.

  2. COMPARISON OF ENERGY AND EXERGY EFFICIENCIES OF ABSORPTION REFRIGERATION SYSTEM WITH MECHANICAL COMPRESSION REFRIGERATION SYSTEM

    OpenAIRE

    2005-01-01

    In this study, energy and exergy analysis of absorption refrigeration system using LiBr- water and mechanical compression refrigeration system using R134-a were performed at different evaporation temperatures. The results are presented in tables and figures.

  3. Energy Efficient Commercial Refrigeration with Carbon Dioxide Refrigerant and Scroll Expanders

    Energy Technology Data Exchange (ETDEWEB)

    Dieckmann, John [TIAX LLC, Lexington, MA (United States)

    2013-04-04

    Current supermarket refrigeration systems are built around conventional fluorocarbon refrigerants – HFC-134a and the HFC blends R-507 and R404A, which replaced the CFC refrigerants, R-12 and R-502, respectively, used prior to the Montreal Protocol phase out of ozone depleting substances. While the HFC refrigerants are non-ozone depleting, they are strong greenhouse gases, so there has been continued interest in replacing them, particularly in applications with above average refrigerant leakage. Large supermarket refrigeration systems have proven to be particularly difficult to maintain in a leak-tight condition. Refrigerant charge losses of 15% of total charge per year are the norm, making the global warming impact of refrigerant emissions comparable to that associated with the energy consumption of these systems.

  4. HeREF-2003: Helium Refrigeration Techniques

    CERN Multimedia

    2003-01-01

    CERN Technical Training 2003: Learning for the LHC ! Theory, Technology, Maintenance and Control of Helium Refrigerators HeREF-2003 is a course in the framework of the 2002 Technical Training Programme, that will provide a complete introduction to Helium refrigeration, with a practical approach to theory, technology, maintenance and control of Helium refrigeration installations. Theoretical aspects and equations will be limited to a minimum. HeREF-2003 targets an audience of technicians and operators of Helium refrigeration plants at CERN, as well as physicists and engineers needing an overview of current Helium refrigeration techniques. HeREF-2003 will address, among other, issues related to component technology, installation maintenance, process control and Helium purity. A commented visit to a couple of CERN Helium refrigeration or liquefaction plants will also take place. Duration: 7 half days (4 mornings and 3 afternoons), 6-10 October, 2003 Cost per participant: 500.- CHF Language: Bilingual English...

  5. HeREF-2003 : Helium Refrigeration Techniques

    CERN Multimedia

    2003-01-01

    CERN Technical Training 2003: Learning for the LHC ! Theory, Technology, Maintenance and Control of Helium Refrigerators HeREF-2003 is a course in the framework of the 2002 Technical Training Programme, that will provide a complete introduction to Helium refrigeration, with a practical approach to theory, technology, maintenance and control of Helium refrigeration installations. Theoretical aspects and equations will be limited to a minimum. HeREF-2003 targets an audience of technicians and operators of Helium refrigeration plants at CERN, as well as physicists and engineers needing an overview of current Helium refrigeration techniques. HeREF-2003 will address, among other, issues related to component technology, installation maintenance, process control and Helium purity. A commented visit to a couple of CERN Helium refrigeration or liquefaction plants will also take place. • Duration: 7 half days (4 mornings and 3 afternoons), 6-10 October, 2003 • Cost per participant: 500.- CHF ...

  6. High-Performance, Low Environmental Impact Refrigerants

    Science.gov (United States)

    McCullough, E. T.; Dhooge, P. M.; Glass, S. M.; Nimitz, J. S.

    2001-01-01

    Refrigerants used in process and facilities systems in the US include R-12, R-22, R-123, R-134a, R-404A, R-410A, R-500, and R-502. All but R-134a, R-404A, and R-410A contain ozone-depleting substances that will be phased out under the Montreal Protocol. Some of the substitutes do not perform as well as the refrigerants they are replacing, require new equipment, and have relatively high global warming potentials (GWPs). New refrigerants are needed that addresses environmental, safety, and performance issues simultaneously. In efforts sponsored by Ikon Corporation, NASA Kennedy Space Center (KSC), and the US Environmental Protection Agency (EPA), ETEC has developed and tested a new class of refrigerants, the Ikon (registered) refrigerants, based on iodofluorocarbons (IFCs). These refrigerants are nonflammable, have essentially zero ozone-depletion potential (ODP), low GWP, high performance (energy efficiency and capacity), and can be dropped into much existing equipment.

  7. Optimum operating regimes of common paramagnetic refrigerants

    CERN Document Server

    Wikus, P; Figueroa-Feliciano, E

    2011-01-01

    Adiabatic Demagnetization Refrigerators (ADRs) are commonly used in cryogenic laboratories to achieve subkelvin temperatures. ADRs are also the technology of choice for several space borne instruments which make use of cryogenic microcalorimeters or bolometers {[}1-4]. For these applications, refrigerants with high ratios of cooling capacity to volume, or cooling capacity to mass are usually required. In this manuscript, two charts for the simple selection of the most suitable of several common refrigerants (CAA, CMN, CPA, DGG, FAA, GGG, GLF and MAS) are presented. These graphs are valid for single stage cycles. The selection of the refrigerants is uniquely dependent on the starting conditions of the refrigeration cycle (temperature and magnetic field density) and the desired final temperature. Only thermodynamic properties of the refrigerants have been taken into account, and other important factors such as availability and manufacturability have not been considered. (C) 2011 Elsevier Ltd. All rights reserve...

  8. Not all counterclockwise thermodynamic cycles are refrigerators

    Science.gov (United States)

    Dickerson, R. H.; Mottmann, J.

    2016-06-01

    Clockwise cycles on PV diagrams always represent heat engines. It is therefore tempting to assume that counterclockwise cycles always represent refrigerators. This common assumption is incorrect: most counterclockwise cycles cannot be refrigerators. This surprising result is explored here for quasi-static ideal gas cycles, and the necessary conditions for refrigeration cycles are clarified. Three logically self-consistent criteria can be used to determine if a counterclockwise cycle is a refrigerator. The most fundamental test compares the counterclockwise cycle with a correctly determined corresponding Carnot cycle. Other criteria we employ include a widely accepted description of the functional behavior of refrigerators, and a corollary to the second law that limits a refrigerator's coefficient of performance.

  9. Environmentally friendly solders 3-4 beyond Pb-based systems

    Institute of Scientific and Technical Information of China (English)

    GAO Yuan; LIU Peng; GUO Fu; XIA Zhidong; LEI Yongping; SHI Yaowu

    2006-01-01

    Based on environmental considerations, global economic pressures, enacted by legislations in several countries, have warranted the elimination of lead from solders used in electronic applications.Sn3.5Ag, SnAgCu, and Sn0.7Cu have emerged among various lead-free candidates as the most promising solder alloys to be utilized in microelectronic industries.However, with the vast development and miniaturization of modern electronic packaging, new requirements such as superior service capabilities have been posed on lead-free solders.In order to improve the comprehensive property of the solder alloys, two possible approaches were adopted in the current research and new materials developed were patented.One approach was involved with the addition of alloying elements to make new ternary or quaternary solder alloys.Proper addition of rare earth element such as La and Ce have rendered solder alloys with improved mechanical properties, especially creep rupture lives of their joints.Another approach, the composite approach, was developed mainly to improve the service temperature capability of the solder alloys.Composite solders fabricated by mechanically incorporating various reinforcement particles to the solder paste have again exhibited enhanced properties without altering the existing processing characteristics.The recent progress and research efforts carried out on lead-free solder materials in Beijing University of Technology were reported.The effects of rare earth addition on the microstructure, processing properties, and mechanical properties were presented.The behaviors of various Sn-3.5Ag based composite solders were also explicated in terms of the roles of reinforcement particles on intermetallic growth, steady-state creep rate, the onset of tertiary creep, as well as the overall creep deformation in the solder joints.Thermomechanical fatigue (TMF) behavior of the solder alloys and composite solders were investigated with different parameters such as ramp rate

  10. Textile Machinery:Imports Rebound Again

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    In the year of 2006,the general situation of China’s textile machinery equipment imports had shown a clear sign of revival from the downward trend of two years ago,with a total annual import of 4.1 billion USD,an increase of 19.05% against the same period of 2005. Continuingly,the year of 2007 has witnessed a sustainable growth trend of textile machinery equipment imports in the first quarter and the trend definitely will be maintained through the whole year.According to statistics released from China Customs,the imports of textile machinery reached 1.098 billion USD in the first three months of 2007, up by 35.26% year-on-year. Then,why China’s textile machinery imports warm up again after two years’ cool down?

  11. A comprehensive overview of hybrid construction machinery

    Directory of Open Access Journals (Sweden)

    Jixin Wang

    2016-03-01

    Full Text Available With the increasing attention of energy saving and emission reduction technology, the recent application of hybrid powertrain technology affects the development of construction machinery industry. This article reviews these publications and provides comprehensive references. This article reviews the state-of-art for the hybrid wheel loader and excavator, which focuses on powertrain configuration, energy storage devices, and energy management strategies. The basis of classification and characteristic of each powertrain configuration are described. Advantages and disadvantages of batteries, supercapacitors, hydraulic accumulators, and flywheel used in hybrid construction machinery are summarized. The existing energy management strategies for hybrid construction machinery are also elaborated. The technological challenges and developing trends in the near future for hybrid construction machinery are discussed.

  12. Energy Savings Thanks to French Textile Machinery

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    The French Textile Machinery Manufacturers’ Association (UCMTF) has presented,during a seminar it organized for textile professionals and students,the spectacular energy savings achieved thanks to state of the art

  13. Adsorption refrigeration technology theory and application

    CERN Document Server

    Wang, Ruzhu; Wu, Jingyi

    2014-01-01

    Gives readers a detailed understanding of adsorption refrigeration technology, with a focus on practical applications and environmental concerns Systematically covering the technology of adsorption refrigeration, this book provides readers with a technical understanding of the topic as well as detailed information on the state-of-the-art from leading researchers in the field. Introducing readers to background on the development of adsorption refrigeration, the authors also cover the development of adsorbents, various thermodynamic theories, the design of adsorption systems and adsorption refri

  14. Manganese Nitride Sorption Joule-Thomson Refrigerator

    Science.gov (United States)

    Jones, Jack A.; Phillips, Wayne M.

    1992-01-01

    Proposed sorption refrigeration system of increased power efficiency combines MnxNy sorption refrigeration stage with systems described in "Regenerative Sorption Refrigerator" (NPO-17630). Measured pressure-vs-composition isotherms for reversible chemisorption of N2 in MnxNy suggest feasibility to incorporate MnxNy chemisorption stage in Joule-Thomson cryogenic system. Discovery represents first known reversible nitrogen chemisorption compression system. Has potential in nitrogen-isotope separation, nitrogen purification, or contamination-free nitrogen compression.

  15. Textile Machinery Import and Export in 2011

    Institute of Scientific and Technical Information of China (English)

    2012-01-01

    Along with the rebounded international market, in the year of 2011, the foreign trade of textile machinery industry preserved a stable development: the import amount saw a slightly decrease, while the total import and export value kept an increasing trend. According to the Customs, the export and import of textile machinery totalized 2.245 billion USD and 5.364 billion USD, increasing by 27.81% and 24.70%, respectively, comparing with the same period of time in 2010.

  16. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

  17. Significance of the non-aceatropic binary refrigerants, when used in heat pumps and refrigeration plants

    Energy Technology Data Exchange (ETDEWEB)

    Kruse, H.; Jakobs, R. (Hannover Univ. (Germany, F.R.). Abt. Kaeltetechnik)

    1977-01-01

    The use of binary refrigerants in refrigerating systems and heat pumps is more economical than the use of conventional refrigerants. They are particularly suitable for heat pumps. This is illustrated by a a test plant in the basis of thermodynamic cycles and properties.

  18. The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling

    Institute of Scientific and Technical Information of China (English)

    CHENGuohai; MAJusheng

    2004-01-01

    The method of mount strain gages is used to measure the stress/strain hysteresis loops of the solder joints under thermal cycling. The results show that different solders have different loops; the shape of the loops will change less, and finally become a line along with the thermal cycle increase. The shear module decreases along with the thermal cycling process. But the creep index of the solder joints is not sensitive to the cycling process,which fluctuates between 5 and 7. Because the elements of the solder and matrix materials diffuse during the process, the voids induced in the solder joints expand. The expansion of the voids will lead to the crystal lattice aberrance of solder crystal.

  19. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

    Science.gov (United States)

    Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak

    2017-03-01

    Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

  20. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  1. Design Guidelines For a Thermoacoustic Refrigerator

    CERN Document Server

    Dhuley, Ram C

    2016-01-01

    Development of refrigerators based on Thermoacoustic technology is a novel solution to the present day need of cooling without causing environmental hazards. With added advantages of absence of moving parts and circulating refrigerants, these devices can attain very low temperatures maintaining a compact size. The present theoretical work is based on theory of linear thermoacoustics[1]. Under the short stack and invicid assumptions, an algorithm for design of a standing wave thermoacoustic refrigerator, with main focus on the stack, is described. A stack is designed for a given cooling requirement of the refrigerator and certain chosen operation parameters.

  2. Thermoeconomic model of a commercial transcritical booster refrigeration system

    DEFF Research Database (Denmark)

    Ommen, Torben Schmidt; Elmegaard, Brian

    2011-01-01

    For cooling applications in supermarkets, booster refrigeration systems operating in both transcritical and subcritical conditions are increasingly used. A thermodynamic model of a transcritical booster refrigeration plant is tailored to match the new generation of commercial refrigeration plants...

  3. Refrigerant charge management in a heat pump water heater

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Jie; Hampton, Justin W.

    2016-07-05

    Heat pumps that heat or cool a space and that also heat water, refrigerant management systems for such heat pumps, and methods of managing refrigerant charge. Various embodiments remove idle refrigerant from a heat exchanger that is not needed for transferring heat by opening a refrigerant recovery valve and delivering the idle refrigerant from the heat exchanger to an inlet port on the compressor. The heat exchanger can be isolated by closing an electronic expansion valve, actuating a refrigerant management valve, or both. Refrigerant charge can be controlled by controlling how much refrigerant is drawn from the heat exchanger, by letting some refrigerant back into the heat exchanger, or both. Heat pumps can be operated in different modes of operation, and various components can be interconnected with refrigerant conduit. Some embodiments deliver refrigerant gas to the heat exchanger and drive liquid refrigerant out prior to isolating the heat exchanger.

  4. Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

    Science.gov (United States)

    Chriaštel'Ová, J.; Rízeková Trnková, L.; Pocisková Dimová, K.; Ožvold, M.

    2011-09-01

    Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu, and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%, 0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.% Ce addition. The morphology of the Cu6Sn5 IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness of the Cu6Sn5 IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed. For longer dipping times, Cu3Sn IMC layers located near the Cu substrate were also observed.

  5. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    OpenAIRE

    Heinemann, D.; S. Knabner; Baumgarten, D.

    2016-01-01

    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. ...

  6. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated...... with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  7. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    and mechanical properties of these potential candidate alloys with respect to the currently used high-lead content solders is made. Finally, the paper presents the superior characteristics as well as some drawbacks of these proposed high-temperature lead-free solder alternatives....... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  8. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

    Institute of Scientific and Technical Information of China (English)

    Liu Haiping; Li Ning; Bi Sifu; Li Deyu

    2007-01-01

    Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

  9. Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

    Science.gov (United States)

    Hidaka, N.; Watanabe, H.; Yoshiba, M.

    2009-05-01

    We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH) form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.

  10. Joining of Bi-2212 high- Tc superconductors and metals using indium solders

    Science.gov (United States)

    Oh, S. Y.; Kim, H. R.; Jeong, Y. H.; Hyun, O. B.; Kim, C. J.

    2007-10-01

    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of AgxIny chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of AgxIny and CuxSny was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  11. Joining of Bi-2212 high-T{sub c} superconductors and metals using indium solders

    Energy Technology Data Exchange (ETDEWEB)

    Oh, S.Y. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of); Kim, H.R.; Jeong, Y.H.; Hyun, O.B. [Superconductivity and Applications Group, Korea Electric Power Research Institute (KEPRI), Daejeon 305-380 (Korea, Republic of); Kim, C.J. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of)], E-mail: cjkim2@kaeri.re.kr

    2007-10-01

    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of Ag{sub x}In{sub y} chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of Ag{sub x}In{sub y} and Cu{sub x}Sn{sub y} was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  12. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    Energy Technology Data Exchange (ETDEWEB)

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  13. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  14. Nano Coated Lead Free Solders for Sustainable Electronic Waste Management

    Directory of Open Access Journals (Sweden)

    K. Arun Vasantha Geethan

    Full Text Available ABSTRACT Lead has been used in a wide range of applications, but in the past decades it became clear that its high toxicity could cause various problems. Studies indicate that exposure to high concentrations of lead can cause harmful damages to humans. To eliminate the usage of lead in electronic products as an initiative towards electronic waste management (e waste, lead free solders were produced with suitable methods by replacing lead. But lead free solders are not preferred as a substitute of lead because they are poor in their mechanical properties such as tensile strength, shear strength and hardness which are ultimately required for a material to resist failure.Nano-Structured materials and coatings offer the potential for Vital improvements in engineering properties based on improvements in physical and mechanical properties resulting from reducing micro structural features by factors of 100 to 1000 times compared to current engineering materials.

  15. 46 CFR 169.625 - Compartments containing diesel machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Compartments containing diesel machinery. 169.625... SCHOOL VESSELS Machinery and Electrical Ventilation § 169.625 Compartments containing diesel machinery. (a) Spaces containing machinery must be fitted with adequate dripproof ventilators, trunks,...

  16. 46 CFR 174.195 - Bulkheads in machinery spaces.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Bulkheads in machinery spaces. 174.195 Section 174.195... in machinery spaces. (a) The bulkhead in each machinery space of each OSV must be watertight to the bulkhead deck. (b) Each penetration of, and each opening in, a bulkhead in a machinery space must— (1)...

  17. 46 CFR 58.01-35 - Main propulsion auxiliary machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Main propulsion auxiliary machinery. 58.01-35 Section 58... AUXILIARY MACHINERY AND RELATED SYSTEMS General Requirements § 58.01-35 Main propulsion auxiliary machinery. Auxiliary machinery vital to the main propulsion system must be provided in duplicate unless the...

  18. 46 CFR 58.01-25 - Means of stopping machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Means of stopping machinery. 58.01-25 Section 58.01-25 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING MAIN AND AUXILIARY MACHINERY AND RELATED SYSTEMS General Requirements § 58.01-25 Means of stopping machinery. Machinery...

  19. 46 CFR 42.15-35 - Machinery space openings.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Machinery space openings. 42.15-35 Section 42.15-35... BY SEA Conditions of Assignment of Freeboard § 42.15-35 Machinery space openings. (a) Machinery space..., funnel, or machinery space ventilators in an exposed position on the freeboard or superstructure...

  20. 46 CFR 45.149 - Machinery space openings.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Machinery space openings. 45.149 Section 45.149 Shipping... Assignment § 45.149 Machinery space openings. (a) Machinery space openings in position 1 or 2 must be framed... funnel or machinery space ventilator that must be kept open for the essential operations of the ship...

  1. Refrigeration and air-conditioning

    CERN Document Server

    Hundy, G H; Welch, T C

    2008-01-01

    Now in its fourth edition, this respected text delivers a comprehensive introduction to the principles and practice of refrigeration. Clear and straightforward, it is designed for students (NVQ/vocational level) and professional HVAC engineers, including those on short or CPD courses. Inexperienced readers are provided with a comprehensive introduction to the fundamentals of the technology. With its concise style yet broad sweep the book covers most of the applications professionals will encounter, enabling them to understand, specify, commission, use and maintain these systems. Many readers w

  2. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    Science.gov (United States)

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

    2016-12-01

    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  3. Energy conservation of more than 50% in refrigerating engineering. Enhancement of energy efficiency in the meat processing industry; Energieeinsparung von mehr als 50% im Bereich der Kaeltetechnik. Energieeffizienzverbesserung in der Fleischverarbeitung

    Energy Technology Data Exchange (ETDEWEB)

    Leo, W. [IHK Berlin (Germany); Kompetenzzetnrum Energieeffizienz Kaelte- und Klimatechnik e.V. (kekk), Berlin (Germany)

    2008-04-15

    There is a vast number of refrigeration and air conditioning machinery in Germany. In the past, these plants were planned and constructed with the focus on low investment cost and good implementability of the projects. This was an appropriate approach as long as energy was available at low cost. (orig.)

  4. Energy efficient control of a refrigeration plant

    DEFF Research Database (Denmark)

    Rasmussen, Henrik; Larsen, Lars F. S.

    2009-01-01

    This paper proposes a novel method for superheat and capacity control of refrigeration systems. The new idea is to control the superheat by the compressor speed and capacity by the refrigerant flow. A new low order nonlinear model of the evaporator is developed and used in a backstepping design o...... and the methods are evaluated with respect to energy efficiency....

  5. Designing a magnet for magnetic refrigeration

    DEFF Research Database (Denmark)

    Bjørk, Rasmus

    of infinite length, are presented. Once it has been determined which properties are desirable for a magnet used in magnetic refrigeration the design of a new magnet is described. This is a high performance cylindrical magnet for use in a new magnetic refrigeration device being built at Risø DTU. This magnet...

  6. Commercial Refrigeration Technology. Florida Vocational Program Guide.

    Science.gov (United States)

    University of South Florida, Tampa. Dept. of Adult and Vocational Education.

    The program guide for commercial refrigeration technology courses in Florida identifies primary considerations for the organization, operation, and evaluation of a vocational education program. Following an occupational description for the job title for refrigeration mechanic, and its Dictionary of Occupational Titles code, are six sections…

  7. 21 CFR 1250.34 - Refrigeration equipment.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Refrigeration equipment. 1250.34 Section 1250.34 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED... SANITATION Food Service Sanitation on Land and Air Conveyances, and Vessels § 1250.34 Refrigeration...

  8. ESO2 Optimization of Supermarket Refrigeration Systems

    DEFF Research Database (Denmark)

    Petersen, Lars Norbert; Madsen, Henrik; Heerup, Christian

    Supermarket refrigeration systems consists of a number of display cases, cooling cabinets and cold rooms connected to a central compressor pack. This configuration saves energy compared to placing a compressor at each cooling site. The classical control setup of a supermarket refrigeration system...

  9. ADJUSTMENT, MAINTENANCE, AND REPAIR OF CROP HARVESTING MACHINERY. AGRICULTURAL MACHINERY--SERVICE OCCUPATIONS, MODULE NUMBER 11.

    Science.gov (United States)

    Ohio State Univ., Columbus. Center for Vocational and Technical Education.

    ONE OF A SERIES DESIGNED FOR HELPING TEACHERS PREPARE POSTSECONDARY-LEVEL STUDENTS FOR AGRICULTURAL MACHINERY SERVICE OCCUPATIONS AS PARTS MEN, MECHANICS, MECHANIC'S HELPERS, AND SERVICE SUPERVISORS, THIS GUIDE AIMS TO DEVELOP STUDENT COMPETENCY IN ADJUSTING, REPAIRING, AND MAINTAINING CROP HARVESTING MACHINERY. SUGGESTIONS FOR INTRODUCTION OF THE…

  10. A rocket-borne He-3 refrigerator

    Science.gov (United States)

    Duband, L.; Alsop, D.; Lange, A.; Kittel, P.

    A self-contained, recyclable He-3 refrigerator suitable for use in space has been developed. The refrigerator is compact, has no moving parts, and requires only electrical connections and thermal contact in order to operate from a 2 K cold stage. A charcoal adsorption pump is used to efficiently condense and cool the He-3. Sintered copper confines the He-3 to the evaporator in zero-gravity and, in fact, allows the refrigerator to operate upside-down in the laboratory. Mounted on a 2 K cold stage, the refrigerator provides 100 microwatts of cooling power at 346 mK, with a 7 hour hold time. On a 1.5 K cold stage, the lowest temperature achieved is 277 mK. The refrigerator has been vibration tested at 7.5 G amplitude from 30 to 400 Hz and 15 G amplitude from 400 to 2000 Hz.

  11. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Rejent, J.A. [Sandia National Labs., Albuquerque, NM (United States). Materials Joining Dept.

    1997-05-01

    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  12. The Vienna Nuclear Demagnetization Refrigerator

    Science.gov (United States)

    Nguyen, D. H.; Sidorenko, A.; Müller, M.; Paschen, S.; Waard, A.; Frossati, G.

    2012-12-01

    A new nuclear demagnetization system coupled to a powerful dilution refrigerator and a vector magnet was successfully built and operated. Our aim was to construct a versatile, modular cryostat, with a large experimental space providing an excellent platform for various types of ultralow temperature measurements. A powerful dilution unit allows us to cool the mixing chamber down to 3 mK and to precool a massive copper (~90 mol) nuclear stage in a field of 9 T to 8 mK in 100 h. After demagnetization the lowest temperature of the copper stage measured by a Pt thermometer was 50.9 μK in a field of 20 mT. The cryostat is integrated with a 8 T-4 T vector magnet system. The refrigerator is provided with a 50 mm central clear shot tube allowing the insertion of a top-loading probe to cool down samples for measurements inside the vector magnet bore in a reasonably short time of about 4 hours. The system will be used to study quantum critical behavior of heavy fermion compounds.

  13. Novel materials for laser refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Hehlen, Markus P [Los Alamos National Laboratory

    2009-01-01

    The status of optical refrigeration of rare-earth-doped solids is reviewed, and the various factors that limit the performance of current laser-cooling materials are discussed. Efficient optical refrigeration is possible in materials for which {Dirac_h}{omega}{sub max} < E{sub p}/8, where {Dirac_h}{omega}{sub max} is the maximum phonon energy of the host material and E{sub p} is the pump energy of the rare-earth dopant. Transition-metal and OH{sup -}impurities at levels >100 ppb are believed to be the main factors for the limited laser-cooling performance in current materials. The many components of doped ZBLAN glass pose particular processing challenges. Binary fluoride glasses such as YF{sub 3}-LiF are considered as alternatives to ZBLAN. The crystalline system KPb{sub 2}CI{sub 5} :Dy{sup 3+} is identified as a prime candidate for high-efficiency laser cooling.

  14. Sorption Refrigeration / Heat Pump Cycles

    Science.gov (United States)

    Saha, Bidyut Baran; Alam, K. C. Amanul; Hamamoto, Yoshinori; Akisawa, Atsushi; Kashiwagi, Takao

    Over the past few decades there have been considerable efforts to use adsorption (solid/vapor) for cooling and heat pump applications, but intensified efforts were initiated only since the imposition of international restrictions on the production and use of CFCs (chlorofluorocarbons) and HCFCs (hydrochlorofluorocarbons). Up to now, only the desiccant evaporative cooling system of the open type has achieved commercial use, predominantly in the United States. Closed-type adsorption refrigeration and heat pump systems are rarely seen in the market, or are still in the laboratory testing stage. Promising recent development have been made in Japan for the use of porous metal hydrides and composite adsorbents. In this paper, a short description of adsorption theories along with an overview of present status and future development trends of thermally powered adsorption refrigeration cycles are outlined putting emphasis on experimental achievements. This paper also addressed some advanced absorption cycles having relatively higher COP, and also summarizes fundamental concepts of GAX cycles and various GAX cycles developed for heat pump applications.

  15. Thermofluid Analysis of Magnetocaloric Refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Abdelaziz, Omar [ORNL; Gluesenkamp, Kyle R [ORNL; Vineyard, Edward Allan [ORNL; Benedict, Michael [GE Appliances

    2014-01-01

    While there have been extensive studies on thermofluid characteristics of different magnetocaloric refrigeration systems, a conclusive optimization study using non-dimensional parameters which can be applied to a generic system has not been reported yet. In this study, a numerical model has been developed for optimization of active magnetic refrigerator (AMR). This model is computationally efficient and robust, making it appropriate for running the thousands of simulations required for parametric study and optimization. The governing equations have been non-dimensionalized and numerically solved using finite difference method. A parametric study on a wide range of non-dimensional numbers has been performed. While the goal of AMR systems is to improve the performance of competitive parameters including COP, cooling capacity and temperature span, new parameters called AMR performance index-1 have been introduced in order to perform multi objective optimization and simultaneously exploit all these parameters. The multi-objective optimization is carried out for a wide range of the non-dimensional parameters. The results of this study will provide general guidelines for designing high performance AMR systems.

  16. Mitochondrial Machineries for Protein Import and Assembly.

    Science.gov (United States)

    Wiedemann, Nils; Pfanner, Nikolaus

    2017-03-15

    Mitochondria are essential organelles with numerous functions in cellular metabolism and homeostasis. Most of the >1,000 different mitochondrial proteins are synthesized as precursors in the cytosol and are imported into mitochondria by five transport pathways. The protein import machineries of the mitochondrial membranes and aqueous compartments reveal a remarkable variability of mechanisms for protein recognition, translocation, and sorting. The protein translocases do not operate as separate entities but are connected to each other and to machineries with functions in energetics, membrane organization, and quality control. Here, we discuss the versatility and dynamic organization of the mitochondrial protein import machineries. Elucidating the molecular mechanisms of mitochondrial protein translocation is crucial for understanding the integration of protein translocases into a large network that controls organelle biogenesis, function, and dynamics. Expected final online publication date for the Annual Review of Biochemistry Volume 86 is June 20, 2017. Please see http://www.annualreviews.org/page/journal/pubdates for revised estimates.

  17. The RNA polymerase I transcription machinery.

    Science.gov (United States)

    Russell, Jackie; Zomerdijk, Joost C B M

    2006-01-01

    The rRNAs constitute the catalytic and structural components of the ribosome, the protein synthesis machinery of cells. The level of rRNA synthesis, mediated by Pol I (RNA polymerase I), therefore has a major impact on the life and destiny of a cell. In order to elucidate how cells achieve the stringent control of Pol I transcription, matching the supply of rRNA to demand under different cellular growth conditions, it is essential to understand the components and mechanics of the Pol I transcription machinery. In this review, we discuss: (i) the molecular composition and functions of the Pol I enzyme complex and the two main Pol I transcription factors, SL1 (selectivity factor 1) and UBF (upstream binding factor); (ii) the interplay between these factors during pre-initiation complex formation at the rDNA promoter in mammalian cells; and (iii) the cellular control of the Pol I transcription machinery.

  18. Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

    OpenAIRE

    Yu, Hao

    2006-01-01

    Continuous miniaturization of electronics devices as well as increasing complexity of soldering metallurgy introduce more and more challenges to the reliability of modern electronics products. Although loading condition plays an important role, the reliability of solder interconnections is ultimately controlled by microstructures' responses to loading. It is therefore of great importance to understand and control the microstructural evolutions of solder interconnections under different loadin...

  19. Machinery condition monitoring principles and practices

    CERN Document Server

    Mohanty, Amiya Ranjan

    2015-01-01

    Find the Fault in the MachinesDrawing on the author's more than two decades of experience with machinery condition monitoring and consulting for industries in India and abroad, Machinery Condition Monitoring: Principles and Practices introduces the practicing engineer to the techniques used to effectively detect and diagnose faults in machines. Providing the working principle behind the instruments, the important elements of machines as well as the technique to understand their conditions, this text presents every available method of machine fault detection occurring in machines in general, an

  20. A review of carbon dioxide as a refrigerant in refrigeration technology

    Directory of Open Access Journals (Sweden)

    Paul Maina

    2015-09-01

    Full Text Available Tough environmental laws and stringent government policies have revolutionised the refrigeration sector, especially concerning the cycle fluid known as the refrigerant. It has been observed that only natural refrigerants are environmentally benign. When other refrigerant qualities are considered, especially those relating to toxicity and flammability, carbon dioxide emerges as the best among the natural refrigerants. However, carbon dioxide based refrigerants are not without drawbacks. Even though the use of R744 a carbon dioxide based refrigerant gas has solved the direct effect of emissions on the environment, studies to investigate the indirect effects of these systems are needed. Improvement in existing technical solutions and the formulation of additional solutions to existing R744 refrigeration problems is paramount if this technology is to be accepted by all, especially in areas with warm climates. National policies geared to green technologies are important to clear the way and provide support for these technologies. It is clear that carbon dioxide is one of the best refrigerants and as environmental regulations become more intense, it will be the ultimate refrigerant of the future.

  1. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  2. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  3. Active soft solder deposition by magnetron-sputter-ion-plating (MSIP)-PVD-process

    Energy Technology Data Exchange (ETDEWEB)

    Lugscheider, E.; Bobzin, K.; Erdle, A

    2004-01-30

    In different technical areas micro electro mechanical systems (M.E.M.S.), e.g. micro pumps, micro sensors, actuators and micro dosage systems are in use today. The components of these M.E.M.S. consist of various materials, which have to be joined. To join materials like ceramics, plastics or metals to a hybrid M.E.M.S., established joining technologies have to be adjusted. For the assembling and mounting of temperature sensible micro components, a low temperature joining process, e.g. transient liquid phase (TLP) bonding or an active soft soldering process can be performed. In this article the deposition of a low melting active soft solder by magnetron-sputter (MS)-PVD deposition with an active substrate cooling will be presented. The substrate temperatures were set and controlled by an additional cooling unit, which was integrated into the sputtering facility. In the performed experiments a substrate temperature range from -40 to +20 deg. C was investigated. The effects of these different substrate temperatures to the microstructure and the soldering suitability of the solder system were investigated by scanning electron microscopy (SEM), nanoindentation and soldering tests. The chemical composition of the deposited solder systems was examined by glow discharge optical spectroscopy (GDOS)-analysis. As a suitable substrate temperature range for deposition -10 to -20 deg. C was detected. Solder systems deposited in this temperature range showed good solder abilities.

  4. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    Science.gov (United States)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  5. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  6. Development of lead-free solders for high-temperature applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek

    -temperature applications. Unfortunately, even the substitute technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed. It is hoped that this thesis can serve...... as a valuable source of information to those interested in environmentally conscious electronic packaging....

  7. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  8. Development of a solder bump technique for contacting a three-dimensional multi electrode array

    NARCIS (Netherlands)

    Frieswijk, T.A.; Frieswijk, T.A.; Bielen, J.A.; Bielen, J.A.; Rutten, Wim; Bergveld, Piet

    1997-01-01

    The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers

  9. The automated system for technological process of spacecraft's waveguide paths soldering

    Science.gov (United States)

    Tynchenko, V. S.; Murygin, A. V.; Emilova, O. A.; Bocharov, A. N.; Laptenok, V. D.

    2016-11-01

    The paper solves the problem of automated process control of space vehicles waveguide paths soldering by means of induction heating. The peculiarities of the induction soldering process are analyzed and necessity of information-control system automation is identified. The developed automated system makes the control of the product heating process, by varying the power supplied to the inductor, on the basis of information about the soldering zone temperature, and stabilizing the temperature in a narrow range above the melting point of the solder but below the melting point of the waveguide. This allows the soldering process automating to improve the quality of the waveguides and eliminate burn-troughs. The article shows a block diagram of a software system consisting of five modules, and describes the main algorithm of its work. Also there is a description of the waveguide paths automated soldering system operation, for explaining the basic functions and limitations of the system. The developed software allows setting of the measurement equipment, setting and changing parameters of the soldering process, as well as view graphs of temperatures recorded by the system. There is shown the results of experimental studies that prove high quality of soldering process control and the system applicability to the tasks of automation.

  10. Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

    Science.gov (United States)

    Xu, Siyang; Prasitthipayong, Anya; Pickel, Andrea D.; Habib, Ashfaque H.; McHenry, Michael E.

    2013-06-01

    We demonstrate magnetic nanoparticles (MNPs) in enabling lead-free solder reflow in RF fields and improved mechanical properties that impact solder joint reliability. Here, we report on Sn-Ag-Cu (SAC) alloys. SAC solder-FeCo MNP composites with 0, 1, 2, 3, and 4 wt. % FeCo MNP and the use of AC magnetic fields to achieve localized reflow. Electron microscopy of the as-reflowed samples show a decrease in the volume of Sn dendrite regions as well as smaller and more homogeneously dispersed Ag3Sn intermetallic compounds (IMCs) with increasing MNP concentrations. Mechanical properties of the composites were measured by nanoindentation. In pure solder samples and solder composites with 4 wt. % MNP, hardness values increased from 0.18 GPa to 0.20 GPa and the modulus increased from 39.22 GPa to 71.22 GPa. The stress exponent, reflecting creep resistance, increased from 12.85 of pure solder to 16.47 for solder composites with 4 wt. % MNP. Enhanced mechanical properties as compared with the as-prepared solder joints are explained in terms of grain boundary and dispersion strengthening resulting from the microstructural refinement.

  11. Intermetallic compound layer growth kinetics in non-lead bearing solders

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.; Kilgo, A.C.; Grant, R.

    1995-04-01

    The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thorough investigation of product manufacturability and reliability. Both of these attributes can be impacted by the excessive growth of intermetallic compound (IMC) layers at the solder/substrate interface. An extensive study has documented the stoichiometry and solid state growth kinetics of IMC layers formed between copper and the lead-free solders: 96.5Sn-3.5Ag (wt.%), 95Sn-5Sb, 100Sn, and 58Bi-42Sn. Aging temperatures were 70--205 C for the Sn-based solders and 55--120 C for the Bi-rich solder. Time periods were 1--400 days for all of the alloys. The Sn/Cu, Sn-Ag/Cu, and Sn-Sb/Cu IMC layers exhibited sub-layers of Cu{sub 6}Sn{sub 5} and Cu{sub 3}Sn; the latter composition was present only following prolonged aging times or higher temperatures. The total layer growth exhibited a time exponent of n = 0.5 at low temperatures and a value of n = 0.42 at higher temperatures in each of the solder/Cu systems. Similar growth kinetics were observed with the low temperature 58Bi-42Sn solder; however, a considerably more complex sub-layer structure was observed. The kinetic data will be discussed with respect to predicting IMC layer growth based upon solder composition.

  12. Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

    Science.gov (United States)

    Chang, Hong; Chen, Hongtao; Li, Mingyu; Wang, Ling; Fu, Yonggao

    2009-10-01

    The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn2+ and the cathodic reaction product OH- meet to form Sn(OH)2, some of which can dehydrate to form more stable SnO· xH2O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

  13. Indium Corporation Introduces New Pb-Free VOC-Free Wave Solder Flux

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    The Indium Corporation of America has introduced WF-7742 Wave Solder Flux specifically designed to meet the process demands of Pb-Free manufacturing. WF-7742 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-holeelectronics assemblies.

  14. Assessment of circuit board surface finishes for electronic assembly with lead-free solders

    Energy Technology Data Exchange (ETDEWEB)

    Ray, U.; Artaki, I.; Finley, D.W.; Wenger, G.M. [Bell Labs., Princeton, NJ (United States). Lucent Technologies; Pan, T.; Blair, H.D.; Nicholson, J.M. [Ford Motor Co., Dearborn, MI (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)

    1996-10-01

    The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections.

  15. Wettability study of lead free solder paste and its effect towards multiple reflow

    Directory of Open Access Journals (Sweden)

    Idris Siti Rabiatull Aisha

    2016-01-01

    Full Text Available Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength.

  16. 46 CFR 151.40-11 - Refrigeration systems.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 5 2010-10-01 2010-10-01 false Refrigeration systems. 151.40-11 Section 151.40-11... Refrigeration systems. (a) Boiloff systems. The venting of cargo boiloff to atmosphere shall not be used as a...) Vapor compression, tank refrigeration, and secondary refrigeration systems: The required...

  17. Complex of automated equipment and technologies for waveguides soldering using induction heating

    Science.gov (United States)

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Bocharov, A. N.

    2017-02-01

    The article deals with the problem of designing complex automated equipment for soldering waveguides based on induction heating technology. A theoretical analysis of the problem, allowing to form a model of the «inductor-waveguide» system and to carry out studies to determine the form of inducing wire, creating a narrow and concentrated heat zone in the area of the solder joint. Also solves the problem of the choice of the temperature control means, the information from which is used later to generate the effective management of induction soldering process. Designed hardware complex in conjunction with the developed software system is a system of automatic control, allowing to manage the process of induction heating, to prevent overheating and destruction of the soldered products, improve the stability of induction soldering process, to improve the quality of products, thereby reducing time and material costs for the production.

  18. Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

    Science.gov (United States)

    Zeng, Kejun; Pierce, Mike; Miyazaki, Hiroshi; Holdford, Becky

    2012-02-01

    To obtain the desired performance of Pb-free packages in mechanical tests, while the solder composition should be carefully selected, the influence of metals dissolved from the soldering pad or under bump metallization (UBM) should also be taken into account. Dissolved metals such as Cu can alter the intermetallic compound (IMC) formation, not only at the local interface but also on the other side of the joint. The high rate of interfacial cracking of Sn-Ag-Cu solder joints on Ni/Au-plated pads is attributed to the high stiffness of the solder and the dual IMC structure of (Cu,Ni)6Sn5 on Ni3Sn4 at the interface. Approaches to avoid this dual IMC structure at the interface are discussed. A rule for selecting the solder alloy composition and the pad surface materials on both sides of the joints is proposed for ball grid array (BGA) packages.

  19. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.

    Science.gov (United States)

    Yu, A-Mi; Jang, Jae-Won; Lee, Jong-Hyun; Kim, Jun-Ki; Kim, Mok-Soon

    2012-04-01

    The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

  20. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  1. New refrigeration system using CO2 vapor-solid as refrigerant

    Institute of Scientific and Technical Information of China (English)

    Dongping HUANG; Guoliang DING; Hans QUACK

    2008-01-01

    A refrigerant must be in the vapor-liquid phase in a vapor-compression refrigeration system, therefore, CO2 cannot be used as a refrigerant for temperatures lower than -56℃ because solid CO2 will form under the triple point temperature of -56℃. A refrigeration system with CO2 vapor-solid particles as refrigerant is put forward, by which a temperature lower than the triple point is achieved. An adjustable nozzle, a sublimator, a high-pressure regulating valve and a low-pressure regulat-ing valve are used to replace the conventional evaporator. Theoretical cycle analysis of the refrigeration system shows that its COP can be 50% higher than that of the conventional one.

  2. Mathematical analysis of a Vuilleumier refrigerator.

    Science.gov (United States)

    Sherman, A.

    1971-01-01

    A comprehensive analysis of the Vuilleumier refrigerator was conducted. This analysis includes the effects of nonisothermal gas heat addition and rejection, hot and cold regenerator inefficiencies, conduction losses, and gas leakage losses. A computer program was written which solves the equations resulting from the analysis. The program calculates internal pressures, temperatures, and gas flow rates as functions of refrigerator crank angle, as well as overall refrigerator cooling load and power input. Comparisons between the program results and available data show good agreement, with a marked improvement over the predictions of the ideal model.

  3. Two-phase flow in refrigeration systems

    CERN Document Server

    Gu, Junjie; Gan, Zhongxue

    2013-01-01

    Two-Phase Flow in Refrigeration Systems presents recent developments from the authors' extensive research programs on two-phase flow in refrigeration systems. This book covers advanced mass and heat transfer and vapor compression refrigeration systems and shows how the performance of an automotive air-conditioning system is affected through results obtained experimentally and theoretically, specifically with consideration of two-phase flow and oil concentration. The book is ideal for university postgraduate students as a textbook, researchers and professors as an academic reference book, and b

  4. A Ross-Stirling spacecraft refrigerator

    Science.gov (United States)

    Walker, G.; Scott, M.; Zylstra, S.

    A spacecraft refrigerator was investigated capable of providing cooling for storage of food and biological samples in the temperature range 0-20 F with cooling capacity in the range of 1 to 2 kW, operating for long periods with great reliability. The system operated on the Stirling refrigeration cycle using the spacecraft life-support gases as the working fluid. A prototype spacecraft Stirling refrigerator was designed, built, and tested with air as the working fluid. The system performance was satisfactory, meeting the requirements specified above. Potential applications for the prototype unit are mentioned.

  5. Mathematical analysis of a Vuilleumier refrigerator.

    Science.gov (United States)

    Sherman, A.

    1971-01-01

    A comprehensive analysis of the Vuilleumier refrigerator was conducted. This analysis includes the effects of nonisothermal gas heat addition and rejection, hot and cold regenerator inefficiencies, conduction losses, and gas leakage losses. A computer program was written which solves the equations resulting from the analysis. The program calculates internal pressures, temperatures, and gas flow rates as functions of refrigerator crank angle, as well as overall refrigerator cooling load and power input. Comparisons between the program results and available data show good agreement, with a marked improvement over the predictions of the ideal model.

  6. Classification of refrigerants; Classification des fluides frigorigenes

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    This document was made from the US standard ANSI/ASHRAE 34 published in 2001 and entitled 'designation and safety classification of refrigerants'. This classification allows to clearly organize in an international way the overall refrigerants used in the world thanks to a codification of the refrigerants in correspondence with their chemical composition. This note explains this codification: prefix, suffixes (hydrocarbons and derived fluids, azeotropic and non-azeotropic mixtures, various organic compounds, non-organic compounds), safety classification (toxicity, flammability, case of mixtures). (J.S.)

  7. A versatile magnetic refrigeration test device.

    Science.gov (United States)

    Bahl, C R H; Petersen, T F; Pryds, N; Smith, A

    2008-09-01

    A magnetic refrigeration test device has been built and tested. The device allows variation and control of many important experimental parameters, such as the type of heat transfer fluid, the movement of the heat transfer fluid, the timing of the refrigeration cycle, and the magnitude of the applied magnetic field. An advanced two-dimensional numerical model has previously been implemented in order to help in the optimization of the design of a refrigeration test device. Qualitative agreement between the results from model and the experimental results is demonstrated for each of the four different parameter variations mentioned above.

  8. Modelling refrigerant distribution in microchannel evaporators

    DEFF Research Database (Denmark)

    Brix, Wiebke; Kærn, Martin Ryhl; Elmegaard, Brian

    2009-01-01

    The effects of refrigerant maldistribution in parallel evaporator channels on the heat exchanger performance are investigated numerically. For this purpose a 1D steady state model of refrigerant R134a evaporating in a microchannel tube is built and validated against other evaporator models. A study...... of the refrigerant distribution is carried out for two channels in parallel and for two different cases. In the first case maldistribution of the inlet quality into the channels is considered, and in the second case a non-uniform airflow on the secondary side is considered. In both cases the total mixed superheat...

  9. A versatile magnetic refrigeration test device

    DEFF Research Database (Denmark)

    Bahl, Christian Robert Haffenden; Petersen, Thomas Frank; Pryds, Nini

    2008-01-01

    A magnetic refrigeration test device has been built and tested. The device allows variation and control of many important experimental parameters, such as the type of heat transfer fluid, the movement of the heat transfer fluid, the timing of the refrigeration cycle, and the magnitude...... of the applied magnetic field. An advanced two-dimensional numerical model has previously been implemented in order to help in the optimization of the design of a refrigeration test device. Qualitative agreement between the results from model and the experimental results is demonstrated for each of the four...

  10. PIPER Continuous Adiabatic Demagnetization Refrigerator

    Science.gov (United States)

    Kimball, Mark O.; Shirron, Peter J.; Canavan, Edgar R.; James, Bryan L.; Sampson, Michael A.; Letmate, Richard V.

    2017-01-01

    We report upon the development and testing of a 4-stage adiabatic demagnetization refrigerator (ADR) capable of continuous cooling at 0.100 Kelvin. This cooler is being built to cool the detector array aboard NASA's Primordial Inflation Polarization Explorer (PIPER) observatory. The goal of this balloon mission is to measure the primordial gravitational waves that should exist if the theory of cosmological inflation is correct. At altitude, the ADR will hold the array of transition-edge sensors at 100 mK continuously while periodically rejecting heat to a 1.2 K pumped helium bath. During testing on ground, the array is held at the same temperature but heat is rejected to a 4.2 K helium bath indicating the flexibility in this coolers design.

  11. Ferroelectric Stirling-Cycle Refrigerator

    Science.gov (United States)

    Jalink, Antony, Jr. (Inventor); Hellbaum, Richard F. (Inventor); Rohrbach, Wayne W. (Inventor)

    1999-01-01

    A Stirling-cycle refrigerator has a three-pump configuration and pumping sequence, in which one pump serves as a compressor. one pump serves as an expander, and one pump serves as a displacer. The pumps are ferroelectrically actuated diaphragm pumps which are coordinated by synchronizing the ferroelectric-actuator voltages in such a way that the net effect of the displacer is to reduce the deleterious effect of dead space; that is, to circulate a greater fraction of the working fluid through the heat exchangers than would be possible by use of the compressor and expander alone. In addition. the displacer can be controlled separately to make the flow of working fluid in the heat exchangers turbulent (to increase the rate of transfer of heat at the cost of greater resistance to flow) or laminar (to decrease the resistance to flow at the cost of a lower heat-transfer rate).

  12. Quantum-enhanced absorption refrigerators

    CERN Document Server

    Correa, Luis A; Alonso, Daniel; Adesso, Gerardo

    2014-01-01

    Thermodynamics is a branch of science blessed by an unparalleled combination of generality of scope and formal simplicity. Based on few natural assumptions together with the four laws, it sets the boundaries between possible and impossible in macroscopic aggregates of matter. This triggered groundbreaking achievements in physics, chemistry and engineering over the last two centuries. Close analogues of those fundamental laws are now being established at the level of individual quantum systems, thus placing limits on the operation of quantum-mechanical devices. Here we study quantum absorption refrigerators, which are driven by heat rather than external work. We establish thermodynamic performance bounds for these machines and investigate their quantum origin. We also show how those bounds may be pushed beyond what is classically achievable, by suitably tailoring the environmental fluctuations via quantum reservoir engineering techniques. Such superefficient quantum-enhanced cooling realises a promising step t...

  13. Italian Textile Machinery Industry Focuses on Sustainability

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    As for fashion industry,Italian brands always play as one of the leaders influencing the global trends.This time,in Shanghai,the Italian textile machinery manufacturers highlight the latest proposals on sustainability and eco-friendly technology.

  14. Italian Textite Machinery Industry Focuses on Sustainability

    Institute of Scientific and Technical Information of China (English)

    Wang Ting

    2010-01-01

    @@ At the ITMA Asia+CITME 2010,which was held on June 22at the Shanghai New International Expo Centre in Shanghai,Italian textile machinery manufacturers represented one of the largest foreign delegations: 115exhibitors occupying a total surface area of about 4,000 sq.meters.

  15. Active Vibration Dampers For Rotating Machinery

    Science.gov (United States)

    Kascack, Albert F.; Ropchock, John J.; Lakatos, Tomas F.; Montague, Gerald T.; Palazzolo, Alan; Lin, Reng Rong

    1994-01-01

    Active dampers developed to suppress vibrations in rotating machinery. Essentially feedback control systems and reciprocating piezoelectric actuators. Similar active damper containing different actuators described in LEW-14488. Concept also applicable to suppression of vibrations in stationary structures subject to winds and earthquakes. Active damper offers adjustable suppression of vibrations. Small and lightweight and responds faster to transients.

  16. CCPIT Machinery Exhibition Succeeded in Kuala Lumpur

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

      From August 18 to 20, 2005, China Council for the Promotion of International Trade(CCPIT) held China Machinery and Electronics Trade Exhibition, CME 2005 in Kuala Lumpur, the capital of Malaysia on behalf of China, a good job has been done.……

  17. CCPIT Machinery Exhibition Succeeded in Kuala Lumpur

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    @@ From August 18 to 20, 2005, China Council for the Promotion of International Trade(CCPIT) held China Machinery and Electronics Trade Exhibition, CME 2005 in Kuala Lumpur, the capital of Malaysia on behalf of China, a good job has been done.

  18. Brownian machinery in physics and biology

    OpenAIRE

    Hänggi, Peter

    2001-01-01

    Brownian machinery in physics and biology. - In: Noise in physical systems and 1/f fluctuations : proceedings of the 16th internat. conference, Gainesville, Fl., 22-25 Oct. 2001 / Ed.: Gijs Bosman. - New Jersey u.a. : World Scientific, 2001. - S. 397-399

  19. Computational design of hydrogen fluid machinery

    Energy Technology Data Exchange (ETDEWEB)

    Kaupert, K.A. [Ebara Cryodynamics Div., Sparks, NV (United States)

    2001-06-01

    This paper presented computational design methods for liquid hydrogen fluid machinery for which the aerospace industry holds a particular interest. The main design points are reliability, efficiency and predictability. The methods described here were based on experience gained in the liquefied natural gas sector. The main design validation tools presented in this paper were computational fluid dynamics, computational rotordynamics, and computational stress analysis. Recent advances have made it possible to incorporate the influence of unsteady phenomena. These new design techniques make it possible to increase the reliability, efficiency and predictability of fluid machinery. A design example for an Ebara Cryodynamics multi-stage impeller/diffuser-return vane combination operating in liquefied natural gas was presented. The fluid machinery characteristics were compared for liquid hydrogen and liquefied natural gas to demonstrate the technical feasibility of industrial liquid hydrogen fluid machinery. Currently, no significant demand exists for liquid hydrogen turbomachinery except for the rocket engine industry. But the emergence of the hydrogen economy will promote the growth in liquefied natural gas and or liquid hydrogen cryogenic turbomachinery. 11 refs., 3 tabs., 6 figs.

  20. Study on Sn-Zn Solder Used in Cu-Al Soldering%用于铜铝焊接的锡锌焊料研究

    Institute of Scientific and Technical Information of China (English)

    倪广春; 张浩; 韩敏

    2013-01-01

    Lead-free electronic products led the development of lead-free solder technology. Taking cost factors into account, some copper material has been replaced by aluminum material. When ordinary Sn-Cu and Sn-Ag-Cu solder are used in soldering of Cu-Al, there is the electrochemical corrosion problems. So Sn-Zn solder is used for Cu-Al soldering. However, the joints of Sn-Zn solder are brittle and easy to crack. Focus on problems in Cu-Al soldering joint of electrical and electronic devices, put forward Sn-Zn-X alloy soldering materials, did a large number of experiments, and achieved good results.%电子产品无铅化的推广带动了无铅焊料技术的发展,考虑到成本因素,部分铜材已被铝材取代。普通的锡铜系和锡银铜系焊料在铜铝焊接时,存在电化学腐蚀问题,因此多用锡锌焊料进行焊接。但锡锌焊料的焊点脆,存在易开裂的问题。针对电工电子器件铜铝焊接点存在的问题,提出了Sn一Zn一X多元合金焊接材料,并做了大量实验,取得很好的效果。

  1. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  2. Health effects among refrigeration repair workers exposed to fluorocarbons.

    OpenAIRE

    1986-01-01

    Refrigeration repair workers may be intermittently exposed to fluorocarbons and their thermal decomposition products. A case of peripheral neuropathy (distal axonopathy) in a commercial refrigeration repairman prompted an epidemiological investigation of the health of refrigeration repair workers. No additional cases of peripheral neuropathy were identified among the 27 refrigeration repair workers studied. A reference group of 14 non-refrigeration repair workers was also studied. No differen...

  3. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  4. Pb-free Sn-Ag-Cu ternary eutectic solder

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  5. Exergetic sustainability evaluation of irreversible Carnot refrigerator

    Science.gov (United States)

    Açıkkalp, Emin

    2015-10-01

    Purpose of this paper is to assess irreversible refrigeration cycle by using exergetic sustainability index. In literature, there is no application of exergetic sustainability index for the refrigerators and, indeed, this index has not been derived for refrigerators. In this study, exergetic sustainability indicator is presented for the refrigeration cycle and its relationships with other thermodynamics parameters including COP, exergy efficiency, cooling load, exergy destruction, ecological function and work input are investigated. Calculations are conducted for endoreversible and reversible cycles and then results obtained from the ecological function are compared. It is found that exergy efficiency, exergetic sustainable index reduce 47.595% and 59.689% and rising at the COP is 99.888% is obtained for endoreversible cycle. Similarly, exergy efficiency and exergetic sustainability index reduce 90.163% and 93.711% and rising of the COP is equal to 99.362%.

  6. ENERGY STAR Certified Commercial Refrigerators and Freezers

    Data.gov (United States)

    U.S. Environmental Protection Agency — Certified models meet all ENERGY STAR requirements as listed in the Version 3.0 ENERGY STAR Program Requirements for Commercial Refrigerators and Freezers that are...

  7. COMPUTER SIMULATION OF A STIRLING REFRIGERATING MACHINE

    Directory of Open Access Journals (Sweden)

    V.V. Trandafilov

    2015-10-01

    Full Text Available In present numerical research, the mathematical model for precise performance simulation and detailed behavior of Stirling refrigerating machine is considered. The mathematical model for alpha Stirling refrigerating machine with helium as the working fluid will be useful in optimization of these machines mechanical design. Complete non-linear mathematical model of the machine, including thermodynamics of helium, and heat transfer from the walls, as well as heat transfer and gas resistance in the regenerator is developed. Non-dimensional groups are derived, and the mathematical model is numerically solved. Important design parameters are varied and their effect on Stirling refrigerating machine performance determined. The simulation results of Stirling refrigerating machine which include heat transfer and coefficient of performance are presented.

  8. Intra-molecular refrigeration in enzymes

    CERN Document Server

    Briegel, Hans J

    2009-01-01

    We present a simple mechanism for intra-molecular refrigeration, where parts of a molecule are actively cooled below the environmental temperature. We discuss the potential role and applications of such a mechanism in biology, in particular in enzymatic reactions.

  9. Fermilab energy saver refrigeration system tests

    Energy Technology Data Exchange (ETDEWEB)

    Theilacker, J.; Rode, C.; Makara, J.; Richied, D.; Leninger, M.; Ferry, R.; Mizicko, D.; Misek, J.

    1981-06-01

    The Energy Saver Refrigeration System is based on the concept of a central helium liquefier (5000 l/hr) providing liquid to 24 satellite refrigerators (966 W at 4.6/degree/K), which operate as amplifiers with a gain of 12. This concept was tested, cooling two 125 m long strings of superconducting magnets. The test was run using one satellite refrigerator operating as the ''central liquefier'', shipping liquid helium through a 250 m long transfer line to a second satellite refrigerator, which in turn cooled the magnets. In addition to testing the satellite concept, the heat loads of the magnets and transfer line were also measured. 3 refs.

  10. Vaccine refrigeration: thinking outside of the box.

    Science.gov (United States)

    McColloster, Patrick J; Martin-de-Nicolas, Andres

    2014-01-01

    This commentary reviews recent changes in Centers for Disease Control (CDC) vaccine storage guidelines that were developed in response to an investigative report by the Office of the Inspector General. The use of temperature data loggers with probes residing in glycol vials is advised along with storing vaccines in pharmaceutical refrigerators. These refrigerators provide good thermal distribution but can warm to 8 °C in less than one hour after the power is discontinued. Consequently, electric grid instability influences appropriate refrigerator selection and the need for power back-up. System Average Interruption Duration Index (SAIDI) values quantify this instability and can be used to formulate region-specific guidelines. A novel aftermarket refrigerator with a battery back-up power supply and microprocessor control system is also described.

  11. ESO2 Optimization of Supermarket Refrigeration Systems

    DEFF Research Database (Denmark)

    Petersen, Lars Norbert; Madsen, Henrik; Heerup, Christian

    Supermarket refrigeration systems consists of a number of display cases, cooling cabinets and cold rooms connected to a central compressor pack. This configuration saves energy compared to placing a compressor at each cooling site. The classical control setup of a supermarket refrigeration system...... in the supermarket. The first approach to solve this problem is to design an overall control system which coordinates the compressor capacity and the current refrigeration load. The drawback of this approach is the complexity of the single controller. The solution is investigated in the first part of the report....... A second solution is investigated where only the compressor control is considered. This controller try to feed-forward the measured disturbances, i.e. opening and closing of the cooling site AKV’s. Last a performance analysis of the refrigeration system is performed....

  12. Shuttle Kit Freezer Refrigeration Unit Conceptual Design

    Science.gov (United States)

    Copeland, R. J.

    1975-01-01

    The refrigerated food/medical sample storage compartment as a kit to the space shuttle orbiter is examined. To maintain the -10 F in the freezer kit, an active refrigeration unit is required, and an air cooled Stirling Cycle refrigerator was selected. The freezer kit contains two subsystems, the refrigeration unit, and the storage volume. The freezer must provide two basic capabilities in one unit. One requirement is to store 215 lbs of food which is consumed in a 30-day period by 7 people. The other requirement is to store 128.3 lbs of medical samples consisting of both urine and feces. The unit can be mounted on the lower deck of the shuttle cabin, and will occupy four standard payload module compartments on the forward bulkhead. The freezer contains four storage compartments.

  13. Defrost Temperature Termination in Supermarket Refrigeration Systems

    Energy Technology Data Exchange (ETDEWEB)

    Fricke, Brian A [ORNL; Sharma, Vishaldeep [ORNL

    2011-11-01

    The objective of this project was to determine the potential energy savings associated with implementing demand defrost strategies to defrost supermarket refrigerated display case evaporators, as compared to the widely accepted current practice of controlling display case defrost cycles with a preset timer. The defrost heater energy use of several representative display case types was evaluated. In addition, demand defrost strategies for refrigerated display cases as well as those used in residential refrigerator/freezers were evaluated. Furthermore, it is anticipated that future work will include identifying a preferred defrost strategy, with input from Retail Energy Alliance members. Based on this strategy, a demand defrost system will be designed which is suitable for supermarket refrigerated display cases. Limited field testing of the preferred defrost strategy will be performed in a supermarket environment.

  14. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    Science.gov (United States)

    Easton, John W.; Struk, Peter M.; Rotella, Anthony

    2008-01-01

    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  15. Acute lung injury following refrigeration coil deicing.

    Science.gov (United States)

    McKeown, Nathanael J; Burton, Brent T

    2012-03-01

    We report a case of a worker who developed ALI requiring mechanical ventilatory support after attempting to melt ice condensate by applying the flame of an oxy-acetylene torch to refrigeration coils charged with a halocarbon refrigerant in a closed environment. A discussion of possible etiologies are discussed, including phosgene, carbonyl fluoride, and nitrogen oxides. Primary prevention with adequate respiratory protection is recommended whenever deicing is performed in a closed space environment.

  16. Active Sensor Configuration Validation for Refrigeration Systems

    DEFF Research Database (Denmark)

    Hovgaard, Tobias Gybel; Blanke, Mogens; Niemann, Hans Henrik

    2010-01-01

    Major faults in the commissioning phase of refrigeration systems are caused by defects related to sensors. With a number of similar sensors available that do not differ by type but only by spatial location in the plant, interchange of sensors is a common defect. With sensors being used quite...... identify the sensor configuration. The method as such is generic and is shown in the paper to work convincingly on refrigeration systems with significant nonlinear behaviors...

  17. An optimized magnet for magnetic refrigeration

    DEFF Research Database (Denmark)

    Bjørk, Rasmus; Bahl, Christian Robert Haffenden; Smith, Anders

    2010-01-01

    A magnet designed for use in a magnetic refrigeration device is presented. The magnet is designed by applying two general schemes for improving a magnet design to a concentric Halbach cylinder magnet design and dimensioning and segmenting this design in an optimum way followed by the construction...... to the maximum energy density. The final design is characterized in terms of a performance parameter, and it is shown that it is one of the best performing magnet designs published for magnetic refrigeration....

  18. Magnetic refrigeration in space - Practical considerations

    Science.gov (United States)

    Kittel, P.

    1980-01-01

    Various schemes of using adiabatic demagnetization to provide refrigeration in the 10-1000 mK range are discussed with particular reference to the requirements for use in space. The methods considered are complete demagnetization, isothermal demagnetization, moving magnet demagnetization, and continuous refrigeration. The requirements that are important for use in space are low mass, low power dissipation, high mechanical rigidity, modular design, and ease of use.

  19. Optimizing the Thermoacoustic Pulse Tube Refrigerator Performances

    Directory of Open Access Journals (Sweden)

    E. V. Blagin

    2014-01-01

    Full Text Available The article deals with research and optimization of the thermoacoustic pulse tube refrigerator to reach a cryogenic temperature level. The refrigerator is considered as a thermoacoustic converter based on the modified Stirling cycle with helium working fluid. A sound pressure generator runs as a compressor. Plant model comprises an inner heat exchanger, a regenerative heat exchanger, a pulse tube, hot and cold heat exchangers at its ends, an inertial tube with the throttle, and a reservoir. A model to calculate the pulse tube thermoacoustic refrigerator using the DeltaEC software package has been developed to be a basis for calculation techniques of the pulse tube refrigerator. Momentum, continuity, and energy equations for helium refrigerant are solved according to calculation algorithm taking into account the porosity of regenerator and heat exchangers. Optimization of the main geometric parameters resulted in decreasing temperature of cold heat exchanger by 41,7 K. After optimization this value became equal to 115,01 K. The following parameters have been optimized: diameters of the feeding and pulse tube and heat exchangers, regenerator, lengths of the regenerator and pulse and inertial tubes, as well as initial pressure. Besides, global minimum of temperatures has been searched at a point of local minima corresponding to the optimal values of abovementioned parameters. A global-local minima difference is 0,1%. Optimized geometric and working parameters of the thermoacoustic pulse tube refrigerator are presented.

  20. Laser ablative fluxless soldering (LAFS): 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates

    Energy Technology Data Exchange (ETDEWEB)

    Peebles, H. C.; Keicher, D. M.; Hosking, F. M.; Hlava, P. F.; Creager, N. A.

    1991-01-01

    OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.

  1. Detection of micro solder balls using active thermography and probabilistic neural network

    Science.gov (United States)

    He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning

    2017-03-01

    Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

  2. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    Science.gov (United States)

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S

    2011-08-01

    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1).

  3. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Tribula, D.

    1990-06-02

    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  4. Evaluation of Scattered Wave and Stress Concentration Field in a Damaged Solder Joint

    Science.gov (United States)

    Dineva, P.; Gross, D.; Rangelov, T.

    1999-06-01

    Two different, but equally important problems for solder joint reliability are solved. The evaluation of the dynamic stress concentration field in the thin base layer of a damaged solder joint is the first one. It is considered as a rectangular plate with a central macro-crack surrounded with randomly distributed micro-cracks, subjected to uniform time-harmonic tension. The damaged solder joint state is described by the model of Gross and Zhang [1] (International Journal of Solids and Structures29, 1763-1779). The information of the stress concentration field in a damaged solder joint is important to understand the mechanisms in the base components of all electronic packages.The second problem is ultrasonic wave scattering in a solder joint damaged by micro-cracks, considered as a two-dimensional finite multi-layered system. The solution of this problem may aid the creation of the modern non-destructive evaluation method (NDEM) for a high quality control of products in electronic industry.The method of the solution of both boundary-value problems is a direct BIEM (boundary integral equation method). The numerical results obtained for a solder joint with real geometry and physical properties show how the acoustic and stress concentration fields depend on the solder joint damage state. The character of this dependence is discussed.

  5. Present Situation of Petroleum Machinery Manufacturers in China

    Institute of Scientific and Technical Information of China (English)

    Li Xilu

    2008-01-01

    Since China joined the WTO, the environment for the development of petroleum machinery industry in the country has changed a lot. As international petroleum machinery manufacturers enter into Chinese market, petroleum machinery manufacturers of the country are facing fierce competition both at home and abroad.

  6. 30 CFR 56.14205 - Machinery, equipment, and tools.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Machinery, equipment, and tools. 56.14205... NONMETAL MINE SAFETY AND HEALTH SAFETY AND HEALTH STANDARDS-SURFACE METAL AND NONMETAL MINES Machinery and Equipment Safety Practices and Operational Procedures § 56.14205 Machinery, equipment, and tools....

  7. 46 CFR 58.01-20 - Machinery guards.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Machinery guards. 58.01-20 Section 58.01-20 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) MARINE ENGINEERING MAIN AND AUXILIARY MACHINERY AND RELATED SYSTEMS General Requirements § 58.01-20 Machinery guards. Gears, couplings, flywheels...

  8. 46 CFR 109.205 - Inspection of boilers and machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Inspection of boilers and machinery. 109.205 Section 109... OPERATIONS Tests, Drills, and Inspections § 109.205 Inspection of boilers and machinery. The chief engineer or engineer in charge, before he assumes charge of the boilers and machinery of a unit shall...

  9. 29 CFR 1915.165 - Ship's deck machinery.

    Science.gov (United States)

    2010-07-01

    ... 29 Labor 7 2010-07-01 2010-07-01 false Ship's deck machinery. 1915.165 Section 1915.165 Labor... (CONTINUED) OCCUPATIONAL SAFETY AND HEALTH STANDARDS FOR SHIPYARD EMPLOYMENT Ship's Machinery and Piping Systems § 1915.165 Ship's deck machinery. (a) Before work is performed on the anchor windlass or any...

  10. 46 CFR 122.208 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Accidents to machinery. 122.208 Section 122.208 Shipping... Voyage Records § 122.208 Accidents to machinery. The owner, managing operator, or master shall report damage to a boiler, unfired pressure vessel, or machinery that renders further use of the item...

  11. 29 CFR 1915.164 - Ship's propulsion machinery.

    Science.gov (United States)

    2010-07-01

    ... 29 Labor 7 2010-07-01 2010-07-01 false Ship's propulsion machinery. 1915.164 Section 1915.164 Labor Regulations Relating to Labor (Continued) OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION... Machinery and Piping Systems § 1915.164 Ship's propulsion machinery. (a) Before work is performed on...

  12. 46 CFR 109.419 - Report of unsafe machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Report of unsafe machinery. 109.419 Section 109.419... OPERATIONS Reports, Notifications, and Records Reports and Notifications § 109.419 Report of unsafe machinery. If a boiler, unfired pressure vessel, or other machinery on a unit is unsafe to operate, the...

  13. 30 CFR 57.14205 - Machinery, equipment, and tools.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Machinery, equipment, and tools. 57.14205... NONMETAL MINE SAFETY AND HEALTH SAFETY AND HEALTH STANDARDS-UNDERGROUND METAL AND NONMETAL MINES Machinery and Equipment Safety Practices and Operational Procedures § 57.14205 Machinery, equipment, and...

  14. 46 CFR 252.33 - Hull and machinery insurance.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 8 2010-10-01 2010-10-01 false Hull and machinery insurance. 252.33 Section 252.33... Subsidy Rates § 252.33 Hull and machinery insurance. (a) Subsidy items. The fair and reasonable net premium costs (including stamp taxes) of hull and machinery, increased value, excess general...

  15. 29 CFR 1910.214 - Cooperage machinery. [Reserved

    Science.gov (United States)

    2010-07-01

    ... 29 Labor 5 2010-07-01 2010-07-01 false Cooperage machinery. 1910.214 Section 1910.214 Labor Regulations Relating to Labor (Continued) OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR OCCUPATIONAL SAFETY AND HEALTH STANDARDS Machinery and Machine Guarding § 1910.214 Cooperage machinery....

  16. 46 CFR 196.30-5 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Accidents to machinery. 196.30-5 Section 196.30-5... Reports of Accidents, Repairs, and Unsafe Equipment § 196.30-5 Accidents to machinery. (a) In the event of an accident to a boiler, unfired pressure vessel, or machinery tending to render the further use...

  17. 46 CFR 97.30-5 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Accidents to machinery. 97.30-5 Section 97.30-5 Shipping... Reports of Accidents, Repairs, and Unsafe Equipment § 97.30-5 Accidents to machinery. (a) In the event of an accident to a boiler, unfired pressure vessel, or machinery tending to render the further use...

  18. 46 CFR 185.208 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Accidents to machinery. 185.208 Section 185.208 Shipping...) OPERATIONS Marine Casualties and Voyage Records § 185.208 Accidents to machinery. The owner, managing operator, or master shall report damage to a boiler, unfired pressure vessel, or machinery that...

  19. 46 CFR 78.33-5 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 3 2010-10-01 2010-10-01 false Accidents to machinery. 78.33-5 Section 78.33-5 Shipping... Accidents, Repairs, and Unsafe Equipment § 78.33-5 Accidents to machinery. (a) In the event of an accident to a boiler, unfired pressure vessel, or machinery tending to render the further use of the...

  20. 46 CFR 185.352 - Ventilation of gasoline machinery spaces.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Ventilation of gasoline machinery spaces. 185.352 Section 185.352 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) SMALL PASSENGER VESSELS... machinery spaces. The mechanical exhaust for the ventilation of a gasoline machinery space, required...

  1. 46 CFR 130.460 - Placement of machinery alarms.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Placement of machinery alarms. 130.460 Section 130.460..., AND MISCELLANEOUS EQUIPMENT AND SYSTEMS Automation of Unattended Machinery Spaces § 130.460 Placement of machinery alarms. (a) Visible and audible alarms must be installed at the pilothouse to...

  2. 46 CFR 171.095 - Machinery space bulkhead.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Machinery space bulkhead. 171.095 Section 171.095... PERTAINING TO VESSELS CARRYING PASSENGERS Additional Subdivision Requirements § 171.095 Machinery space... transverse watertight bulkheads to separate the machinery space from the remainder of the vessel....

  3. 46 CFR 111.103-3 - Machinery space ventilation.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Machinery space ventilation. 111.103-3 Section 111.103-3...-GENERAL REQUIREMENTS Remote Stopping Systems § 111.103-3 Machinery space ventilation. (a) Each machinery space ventilation system must have two controls to stop the ventilation, one of which may be the...

  4. 33 CFR 157.39 - Machinery space bilges.

    Science.gov (United States)

    2010-07-01

    ... 33 Navigation and Navigable Waters 2 2010-07-01 2010-07-01 false Machinery space bilges. 157.39... Vessel Operation § 157.39 Machinery space bilges. (a) A tank vessel may discharge an oily mixture from a machinery space bilge that is combined with an oil cargo residue if the vessel discharges in compliance...

  5. Wettability Studies of Pb-Free Soldering Materials

    Science.gov (United States)

    Moser, Z.; Gąsior, W.; Pstruś, J.; Dębski, A.

    2008-12-01

    For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn-Ag and Sn-Ag-Cu eutectics, both with melting points higher than that of the Sn-Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn-Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler’s method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag-Sn system, enthalpies of formation of Ag3Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn-Ag-Cu-Bi-Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn-Ag-Cu system.

  6. OPTIMAL MAINTENANCE AND REPLACEMENT OF EXTRACTION MACHINERY

    Institute of Scientific and Technical Information of China (English)

    Suresh P.SETHI; Hong-Mo YEH; Rong ZHANG; Andrew K.S.JARDINE

    2008-01-01

    This paper considers a problem of optimal preventive maintenance and replacement schedule ofequipment devoted to extracting resources from known deposits. Typical examples are oil drills, mine shovels, etc. At most one replacement of the existing machinery by a new one is allowed. The problem is formulated as an optimal control problem subject to the state constraint that the remaining deposit at any given time is nonnegative. We show that the optimal preventive maintenance, production rates, and the replacement and salvage times of the existing machinery and the new one, if required, can be obtained by solving sequentially a series of free-end-point optimal control problems. Moreover, an algorithm based on this result is developed and used to solve two illustrative examples.

  7. The Autophagic Machinery in Enterovirus Infection

    Directory of Open Access Journals (Sweden)

    Jeffrey K. F. Lai

    2016-01-01

    Full Text Available The Enterovirus genus of the Picornaviridae family comprises many important human pathogens, including polioviruses, rhinovirus, enterovirus A71, and enterovirus D68. They cause a wide variety of diseases, ranging from mild to severe life-threatening diseases. Currently, no effective vaccine is available against enteroviruses except for poliovirus. Enteroviruses subvert the autophagic machinery to benefit their assembly, maturation, and exit from host. Some enteroviruses spread between cells via a process described as autophagosome-mediated exit without lysis (AWOL. The early and late phases of autophagy are regulated through various lipids and their metabolizing enzymes. Some of these lipids and enzymes are specifically regulated by enteroviruses. In the present review, we summarize the current understanding of the regulation of autophagic machinery by enteroviruses, and provide updates on recent developments in this field.

  8. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    Science.gov (United States)

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent

    2006-05-01

    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  9. Relationship between composition of mixture charged and that in circulation in an auto refrigerant cascade and a J-T refrigerator operating in liquid refrigerant supply mode

    Science.gov (United States)

    Sreenivas, Bura; Nayak, H. Gurudath; Venkatarathnam, G.

    2017-01-01

    The composition of the refrigerant mixture in circulation during steady state operation of J-T and allied refrigerators is not the same as that charged due to liquid hold up in the heat exchangers and phase separators, as well as the differential solubility of different refrigerant components in the compressor lubricating oil. The performance of refrigerators/liquefiers operating on mixed refrigerant cycles is dependent on the mixture composition. It is therefore important to charge the right mixture that results in an optimum composition in circulation during steady state operation. The relationship between the charged and circulating composition has been experimentally studied in a J-T refrigerator operating in the liquid refrigerant supply (LRS) mode and an auto refrigerant cascade refrigerator (with a phase separator) operating in the gas refrigerant supply (GRS) mode. The results of the study are presented in this work. The results show that the method presented earlier for J-T refrigerators operating in GRS mode is also applicable in the case of refrigerators studied in this work.

  10. Machinery prognostics and prognosis oriented maintenance management

    CERN Document Server

    Yan, Jihong

    2014-01-01

    This book gives a complete presentatin of the basic essentials of machinery prognostics and prognosis oriented maintenance management, and takes a look at the cutting-edge discipline of intelligent failure prognosis technologies for condition-based maintenance.  Latest research results and application methods are introduced for signal processing, reliability moelling, deterioration evaluation, residual life prediction and maintenance-optimization as well as applications of these methods.

  11. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  12. HFC perspectives in air-conditioning and refrigeration; Perspectives HFC en A/C et refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Fauvarque, P. [ELF Atochem, Centre d`Application de Lavallois, 92 (France)

    1997-12-31

    This paper is a series of transparencies dealing with the development of substitutes for the replacement of the R-22 refrigerant in air-conditioning systems (R-134a, R-407C, R-410A), and in industrial refrigeration systems of agriculture and food industry (R-134a and R-404A). (J.S.)

  13. COMPARISON OF ENERGY AND EXERGY EFFICIENCIES OF ABSORPTION REFRIGERATION SYSTEM WITH MECHANICAL COMPRESSION REFRIGERATION SYSTEM

    Directory of Open Access Journals (Sweden)

    Gülay YAKAR

    2005-02-01

    Full Text Available In this study, energy and exergy analysis of absorption refrigeration system using LiBr- water and mechanical compression refrigeration system using R134-a were performed at different evaporation temperatures. The results are presented in tables and figures.

  14. Property Analysis of the Agricultural Machinery Lubricants

    Directory of Open Access Journals (Sweden)

    Tone Ploj

    2000-03-01

    Full Text Available We need to produce enough healthy and cheap food as well as to preserve the ecologic equilibrium. This can be achived by using modern machinery and up- to-date knowledge and technology. Agricultural machinery, in which 40-60% of all funds are invested, is poorly maintained and underused. The main causes for this are poor knowledge and extensive farm land fragmentation. The fact that over 140,000 tractors in Slovenia are on average 9.6 years old, i.e. that more than 80% of overall agricultural machinery is obsolete, should be a matter of serious concern. In the paper we follow tribological conditions in particular tractor assemblies. In the first part of the paper we have treated the required conditions of tractor manufacturers in Europe and primarily in Slovenia, what has served us in the final phase of the research for elaboration of the model. In this way we have got data about the presence of particular tractor types. We have separately elaborated the necessary specifications of engine lubricants, transmission, gears, hydraulics and wet breaks. We have carried out chemical and mechanical analyses of all accessible lubricants in agricultural mechanisation. The results of the new oils were coordinated with the required specifications of tractor manufacturers and so we have got such a model, that certainly meet all lubricating requirements of our tractors.

  15. The exportomer: the peroxisomal receptor export machinery.

    Science.gov (United States)

    Platta, Harald W; Hagen, Stefanie; Erdmann, Ralf

    2013-04-01

    Peroxisomes constitute a dynamic compartment of almost all eukaryotic cells. Depending on environmental changes and cellular demands peroxisomes can acquire diverse metabolic roles. The compartmentalization of peroxisomal matrix enzymes is a prerequisite to carry out their physiologic function. The matrix proteins are synthesized on free ribosomes in the cytosol and are ferried to the peroxisomal membrane by specific soluble receptors. Subsequent to cargo release into the peroxisomal matrix, the receptors are exported back to the cytosol to facilitate further rounds of matrix protein import. This dislocation step is accomplished by a remarkable machinery, which comprises enzymes required for the ubiquitination as well as the ATP-dependent extraction of the receptor from the membrane. Interestingly, receptor ubiquitination and dislocation are the only known energy-dependent steps in the peroxisomal matrix protein import process. The current view is that the export machinery of the receptors might function as molecular motor not only in the dislocation of the receptors but also in the import step of peroxisomal matrix protein by coupling ATP-dependent removal of the peroxisomal import receptor with cargo translocation into the organelle. In this review we will focus on the architecture and function of the peroxisomal receptor export machinery, the peroxisomal exportomer.

  16. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Science.gov (United States)

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  17. Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (α), thermal cycle numbers (N) can be derived. Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

  18. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    Science.gov (United States)

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-10-13

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  19. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  20. Effect of constraint on crack propagation behavior in BGA soldered joints

    Institute of Scientific and Technical Information of China (English)

    王莉; 王国忠; 方洪渊; 钱乙余

    2001-01-01

    The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near-tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.

  1. Observations of microstructural coarsening in micro flip-chip solder joints

    Science.gov (United States)

    Barney, Monica M.; Morris, J. W.

    2001-09-01

    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  2. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  3. A cause of the non-solderability of ceramic capacitor terminations

    Science.gov (United States)

    Cozzolino, M. J.; Kumar, A.; Ewell, G. J.

    1981-01-01

    The results of an analysis into the cause of the non-solderability of multiple defective part lots from two capacitor manufacturers are described. This analysis consisted of visual, scanning electron microscopic, surface, and metalographic examinations and analyses. The results indicated that non-solderability results from areas of excess porosity in the termination which are caused by segregation of ink constituents during manufacturing. This segregation can be minimized by proper monitoring and control of process variables; where excess porosity does occur, solderability can be improved by proper precleaning of parts.

  4. Wettability study of lead free solder paste and its effect towards multiple reflow

    OpenAIRE

    Idris Siti Rabiatull Aisha; Zuleikha Siti; Abd Malek Zetty Akhtar

    2016-01-01

    Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solde...

  5. Listeria monocytogenes survival in refrigerator dill pickles.

    Science.gov (United States)

    Kim, Jin Kyung; D'Sa, Elaine M; Harrison, Mark A; Harrison, Judy A; Andress, Elizabeth L

    2005-11-01

    Listeria monocytogenes can survive and grow in refrigerated foods with pH values of approximately 4.0 to 5.0 and salt concentrations of 3 to 4%. Home-fermented refrigerator dill pickles fit this description. Contamination of this product with L. monocytogenes could cause serious problems because these items are not heated prior to consumption. L. monocytogenes survival and growth patterns were investigated in refrigerator dill pickles at 1.3, 3.8, and 7.6% salt concentrations. Pickling cucumbers were dipped into an inoculum of L. monocytogenes, brine mixtures were added, and cucumbers were held at room temperature for 1 week and then refrigerated for up to 3 months. The pH, NaCl percentage, titratable acidity percentage, and total populations of Listeria and aerobic, psychrotrophic, and lactic acid bacteria were measured at the addition of brine, after 2, 4, and 7 days of storage at room temperature, and then weekly during refrigerated storage. The initial Listeria population was 5.4 to 5.6 log CFU/cm2 on cucumber surfaces and 3.9 to 4.6 log CFU/g internally. There was an approximate 0.3- to 1-log increase during room temperature fermentation followed by a population decline during refrigerator storage, with a greater decrease in the brines with the highest NaCl concentration. Up to 49 days, the internal tissue of pickles with 1.3, 3.8, or 7.6% salt concentrations were presumptively positive for L. monocytogenes by the enrichment method, and at 91 days the surfaces of such pickles were still positive for L. monocytogenes. Populations of total aerobes and lactic acid bacteria increased during room temperature storage and decreased gradually during refrigerated storage.

  6. Refrigerated Warehouse Demand Response Strategy Guide

    Energy Technology Data Exchange (ETDEWEB)

    Scott, Doug [VaCom Technologies, San Luis Obispo, CA (United States); Castillo, Rafael [VaCom Technologies, San Luis Obispo, CA (United States); Larson, Kyle [VaCom Technologies, San Luis Obispo, CA (United States); Dobbs, Brian [VaCom Technologies, San Luis Obispo, CA (United States); Olsen, Daniel [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

    2015-11-01

    This guide summarizes demand response measures that can be implemented in refrigerated warehouses. In an appendix, it also addresses related energy efficiency opportunities. Reducing overall grid demand during peak periods and energy consumption has benefits for facility operators, grid operators, utility companies, and society. State wide demand response potential for the refrigerated warehouse sector in California is estimated to be over 22.1 Megawatts. Two categories of demand response strategies are described in this guide: load shifting and load shedding. Load shifting can be accomplished via pre-cooling, capacity limiting, and battery charger load management. Load shedding can be achieved by lighting reduction, demand defrost and defrost termination, infiltration reduction, and shutting down miscellaneous equipment. Estimation of the costs and benefits of demand response participation yields simple payback periods of 2-4 years. To improve demand response performance, it’s suggested to install air curtains and another form of infiltration barrier, such as a rollup door, for the passageways. Further modifications to increase efficiency of the refrigeration unit are also analyzed. A larger condenser can maintain the minimum saturated condensing temperature (SCT) for more hours of the day. Lowering the SCT reduces the compressor lift, which results in an overall increase in refrigeration system capacity and energy efficiency. Another way of saving energy in refrigerated warehouses is eliminating the use of under-floor resistance heaters. A more energy efficient alternative to resistance heaters is to utilize the heat that is being rejected from the condenser through a heat exchanger. These energy efficiency measures improve efficiency either by reducing the required electric energy input for the refrigeration system, by helping to curtail the refrigeration load on the system, or by reducing both the load and required energy input.

  7. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    CERN Document Server

    Koo, Ja-Myeong

    2007-01-01

    Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4 and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

  8. Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

    Science.gov (United States)

    Lai, Yi-Shao; Chiu, Ying-Ta; Chen, Jiunn

    2008-10-01

    The Cu pillar is a thick underbump metallurgy (UBM) structure developed to alleviate current crowding in a flip-chip solder joint under operating conditions. We present in this work an examination of the electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated ˜62 μm Cu onto Cu substrate pad metallization using the Sn-3Ag-0.5Cu solder alloy. Three test conditions that controlled average current densities in solder joints and ambient temperatures were considered: 10 kA/cm2 at 150°C, 10 kA/cm2 at 160°C, and 15 kA/cm2 at 125°C. Electromigration reliability of this particular solder joint turns out to be greatly enhanced compared to a conventional solder joint with a thin-film-stack UBM. Cross-sectional examinations of solder joints upon failure indicate that cracks formed in (Cu,Ni)6Sn5 or Cu6Sn5 intermetallic compounds (IMCs) near the cathode side of the solder joint. Moreover, the ~52- μm-thick Sn-Ag-Cu solder after long-term current stressing has turned into a combination of ~80% Cu-Ni-Sn IMC and ~20% Sn-rich phases, which appeared in the form of large aggregates that in general were distributed on the cathode side of the solder joint.

  9. The plastid-dividing machinery: formation, constriction and fission.

    Science.gov (United States)

    Yoshida, Yamato; Miyagishima, Shin-ya; Kuroiwa, Haruko; Kuroiwa, Tsuneyoshi

    2012-12-01

    Plastids divide by constriction of the plastid-dividing (PD) machinery, which encircles the division site. The PD machinery consists of the stromal inner machinery which includes the inner PD and filamenting temperature-sensitive mutant Z (FtsZ) rings and the cytosolic outer machinery which includes the outer PD and dynamin rings. The major constituent of the PD machinery is the outer PD ring, which consists of a bundle of polyglucan filaments. In addition, recent proteomic studies suggest that the PD machinery contains additional proteins that have not been characterized. The PD machinery forms from the inside to the outside of the plastid. The constriction seems to occur by sliding of the polyglucan filaments of the outer PD ring, aided by dynamin. The final fission of the plastid is probably promoted by the 'pinchase' activity of dynamin.

  10. Functional Nanomaterials Useful for Magnetic Refrigeration Systems

    Science.gov (United States)

    Aslani, Amir

    Magnetic refrigeration is an emerging energy efficient and environmentally friendly refrigeration technology. The principle of magnetic refrigeration is based on the effect of varying a magnetic field on the temperature change of a magnetocaloric material (refrigerant). By applying a magnetic field, the magnetic moments of a magnetic material tend to align parallel to it, and the thermal energy released in this process heats the material. Reversibly, the magnetic moments become randomly oriented when the magnetic field is removed, and the material cools down. The heating and the cooling of a refrigerant in response to a changing magnetic field is similar to the heating and the cooling of a gaseous medium in response to an adiabatic compression and expansion in a conventional refrigeration system. One requirement to make a practical magnetic refrigerator is to have a large temperature change per unit of applied magnetic field, with sufficiently wide operating temperature. So far, no commercially viable magnetic refrigerator has been built primarily due to the low temperature change of bulk refrigerants, the added burden of hysteresis, and the system's low cooling capacity. The purpose of this dissertation is to explore magnetic refrigeration system. First, the Active Magnetic Regenerator (AMR) system built by Shir et al at the GWU's Institute for Magnetics Research (IMR) is optimized by tuning the heat transfer medium parameters and system's operating conditions. Next, by reviewing literature and works done so far on refrigerants, a number of materials that may be suitable to be used in magnetic refrigeration technology were identified. Theoretical work by Bennett et al showed an enhancement in magnetocaloric effect of magnetic nanoparticles. Research was performed on functional magnetic nanoparticles and their use in magnetic refrigeration technology. Different aspects such as the size, shape, chemical composition, structure and interaction of the nanoparticle with

  11. Influence of Oil on Refrigerant Evaporator Performance

    Science.gov (United States)

    Kim, Jong-Soo; Nagata, Karsuya; Katsuta, Masafumi; Tomosugi, Hiroyuki; Kikuchi, Kouichiro; Horichi, Toshiaki

    In vapor compression refrigeration system using oil-lubricated compressors, some amount of oil is always circulated through the system. Oil circulation can have a significant influence on the evaporator performance of automotive air conditioner which is especially required to cool quickly the car interior after a period standing in the sun. An experimental investigation was carried out an electrically heated horizontal tube to measure local heat transfer coefficients for various flow rates and heat fluxes during forced convection boiling of pure refrigerant R12 and refrigerant-oil mixtures (0-11% oil concentration by weight) and the results were compared with oil free performance. Local heat transfer coefficients increased at the region of low vapor quality by the addition of oil. On the other hand, because the oil-rich liquid film was formed on the heat transfer surface, heat transfer coefficients gradually decreased as the vapor quality became higher. Average heat transfer coefficient reached a maximum at about 4% oil concentration and this trend agreed well with the results of Green and Furse. Previous correlations, using the properties of the refrigerant-oil mixture, could not predict satisfactorily the local heat transfer coefficients data. New correlation modified by oil concentration factor was developed for predicting the corresponding heat transfer coefficient for refrigerant-oil mixture convection boiling. The maximum percent deviation between predicted and measured heat transfer coefficient was within ±30%.

  12. Coefficient of Performance Enhancement of Refrigeration Cycles

    Directory of Open Access Journals (Sweden)

    Eng. Naser R. M. AL-Ajmi

    2015-03-01

    Full Text Available Refrigerator is one of the home appliance utilizing mechanical vapor compression cycle in its process. Performance of the systems become the main issue and many researches are still ongoing to evaluate and improve the efficiency of any used system. Therefore, this paper presents an experimental investigation of the performance of the refrigeration cycles. A small rrefrigerator is used as the test rig. The Coefficient of Performance (COP is studied by using different condenser designs and under varying evaporator loads. Three condenser designs are used in present work. These condensers are regular condenser of domestic refrigerator, condenser with copper plain tubes (Cond.1 and condenser with copper tubes welded with stainless steel flat plate (Cond.2. pressures and temperatures measurements of each point in the refrigeration cycle are collected in order to evaluate the refrigerator performance. The results showed that the average COP of Cond.1 and Cond.2 are increased up to 20 % and 14% respectively more than regular condenser design under no load. The evaporator load effects on the machine performance, where the COP of the machine increases with the increase of the evaporator load.

  13. Performance characteristics of pulse tube refrigerators

    Science.gov (United States)

    Huang, B. J.; Tzeng, T. M.

    In the present study experiments were carried out to investigate the performance characteristics of pulse tube refrigerators. It was found that the cool-down time tc during the transient or start-up period is dominated by the time constant of the pulse tube wall τpt and that the dynamics of a basic pulse tube (BPT) refrigerator approaches that of a first-order system. For steady state operation, the cold-end temperature TL was found to vary with τpt, and the cooling load QL increases monotonically with increasing τpt. This indicates that heat pumped by the gas from the cold to the hot end increases with decreasing hpt (i.e. less energy exchange between the gas and wall). The process of heat storage or release of the pulse tube wall is thus shown to have a negative effect on the performance of a BPT refrigerator. It was thus found experimentally that the gas compression/expansion process inside the pulse tube, which is similar to a Brayton cycle but lies between isothermal and adiabatic, can explain the performance of BPT refrigerators. The present experiment also shows that the performance of a pulse tube refrigerator at transient and steady states is mainly dominated by the time constant of the pulse tube wall τpt.

  14. Quantum heat engines and refrigerators: continuous devices.

    Science.gov (United States)

    Kosloff, Ronnie; Levy, Amikam

    2014-01-01

    Quantum thermodynamics supplies a consistent description of quantum heat engines and refrigerators up to a single few-level system coupled to the environment. Once the environment is split into three (a hot, cold, and work reservoir), a heat engine can operate. The device converts the positive gain into power, with the gain obtained from population inversion between the components of the device. Reversing the operation transforms the device into a quantum refrigerator. The quantum tricycle, a device connected by three external leads to three heat reservoirs, is used as a template for engines and refrigerators. The equation of motion for the heat currents and power can be derived from first principles. Only a global description of the coupling of the device to the reservoirs is consistent with the first and second laws of thermodynamics. Optimization of the devices leads to a balanced set of parameters in which the couplings to the three reservoirs are of the same order and the external driving field is in resonance. When analyzing refrigerators, one needs to devote special attention to a dynamical version of the third law of thermodynamics. Bounds on the rate of cooling when Tc→0 are obtained by optimizing the cooling current. All refrigerators as Tc→0 show universal behavior. The dynamical version of the third law imposes restrictions on the scaling as Tc→0 of the relaxation rate γc and heat capacity cV of the cold bath.

  15. Compression-absorption cascade refrigeration system

    Energy Technology Data Exchange (ETDEWEB)

    Fernandez-Seara, Jose; Sieres, Jaime; Vazquez, Manuel [Area de Maquinas y Motores Termicos, Escuela Tecnica Superior de Ingenieros Industriales, Universidade de Vigo, Campus Lagoas-Marcosende, 9, 36200 Vigo (Spain)

    2006-04-01

    This paper describes the study carried out to analyse a refrigeration system in cascade with a compression system at the low temperature stage and an absorption system at the high temperature stage to generate cooling at low temperatures, as well as the possibility of powering it by means of a cogeneration system. CO{sub 2} and NH{sub 3} have been considered as refrigerants in the compression stage and the pair NH{sub 3}-H{sub 2}O in the absorption stage. The analysis has been realized by means of a mathematical model of the refrigeration system implemented in a computer program and taking into account the characteristic operating conditions of a cogeneration system with gas engines. The paper presents the results obtained regarding the performance of the refrigeration system and the adaptability between the power requirements of the refrigeration system and the power supplied by the cogeneration system taking into account the present Spanish Regulations about the use of cogeneration systems. [Author].

  16. Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder

    Institute of Scientific and Technical Information of China (English)

    SHEN Jun; LIU Yongchang; GAO Houxiu

    2006-01-01

    The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment.

  17. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation...... of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  18. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah

    2016-07-01

    FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.

  19. Thermal analysis of selected tin-based lead-free solder alloys

    DEFF Research Database (Denmark)

    Palcut, Marián; Sopoušek, J.; Trnková, L.

    2009-01-01

    The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodyna......The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC...... was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves....

  20. Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples

    Institute of Scientific and Technical Information of China (English)

    Jing Han; Hongtao Chen; Mingyu Li; Chunqing Wang

    2013-01-01

    In this study,shear tests have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy (SEM) was employed to characterize the microstructures of the samples and orientation imaging microscopy (OIM) with electron backscattered diffraction (EBSD) in SEM was used to obtain crystallographic orientation of grains to provide a detailed characterization of the deformation behavior in Sn3.5Ag solder samples after shear tests.The deformation behavior in solder samples under shear stress was discussed.The experimental results suggest that the dynamic recrystallization could occur under shear stress at room temperature and recrystallized grains should evolve from subgrains by rotation.Compared with that of non-recrystallized and as-reflowed microstructures,the microhardness of the recrystallized microstructure decreased after shear tests.

  1. Joint Strength with Soldering of Al2O3 Ceramics After Ni-P Chemical Plating

    Institute of Scientific and Technical Information of China (English)

    邹贵生; 吴爱萍; 张德库; 孟繁明; 白海林; 张永清; 黎义; 巫世杰; 顾兆旃

    2004-01-01

    Ni-P alloy was chemically plated on Al2O3 ceramics to produce uniform alloy coatings at temperatures below 70℃. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170℃ for 15 min. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.

  2. Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Lee, Tae-Kyu; Liu, Bo; Zhou, Bite; Bieler, Thomas; Liu, Kuo-Chuan

    2011-09-01

    The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

  3. Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

    Science.gov (United States)

    Kanda, Yoshihiko; Kariya, Yoshiharu

    2010-02-01

    The effects of waveform symmetry on the low-cycle fatigue life of the Sn-3.0Ag-0.5Cu alloy have been investigated, using micro solder joint specimens with approximately the same volume of solder as is used in actual products. Focusing on crack initiation life, fatigue tests on Sn-Ag-Cu micro solder joints using asymmetrical triangular waveforms revealed no significant reduction in fatigue life. A slight reduction in fatigue life at low strain ranges caused by an increase in the fatigue ductility exponent, which is the result of a weakening microstructure due to loads applied at high temperature for long testing time, was observed. This was due to the fact that grain boundary damage, which has been reported in large-size specimens subjected to asymmetrical triangular waveforms, does not occur in Sn-Ag-Cu micro size solder joints with only a small number of crystal grain boundaries.

  4. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  5. Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials

    Science.gov (United States)

    Kolb, H.; Sottong, R.; Dasgupta, T.; Mueller, E.; de Boor, J.

    2017-08-01

    Low electrical and thermal contact resistances are a prerequisite for highly efficient thermoelectric generators. Likewise, certain measurement setups for characterization of thermoelectric materials rely on good-quality contacts between sample and setup. Detachable contacts are an interesting alternative to permanent contacting solutions due to ease of handling and nondestructive disassembly of valuable samples. Therefore, the applicability of gallium-based liquid metal solder as detachable contact material was studied, particularly with regard to compatibility of the solder with state-of-the-art thermoelectric materials CoSb3, Mg2Si, and FeSi2. Tungsten, nickel, chromium, and titanium were tested as protective coatings between the thermoelectric material and liquid metal solder. Electrical measurements showed that some materials form excellent and stable contacts with the solder for a limited temperature range. At higher temperatures, application of a protective layer was found to be necessary for all investigated materials. Tungsten and nickel showed promising results as protective layer.

  6. Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite

    Institute of Scientific and Technical Information of China (English)

    Jun SHEN; Yongchang LIU; Dongjiang WANG; Houxiu GAO

    2006-01-01

    A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstructural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size ofβ-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the Hall-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.

  7. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    Energy Technology Data Exchange (ETDEWEB)

    Frear, D.R.; Rashid, M.M.; Burchett, S.N.

    1993-07-01

    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  8. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    Science.gov (United States)

    Jee, Y. K.; Yu, Jin

    2010-10-01

    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  9. Overview of the use of refrigerating fluids in thermodynamical machines; Panorama de l`utilisation des fluides frigorigenes dans les machines thermodynamiques

    Energy Technology Data Exchange (ETDEWEB)

    Bernier, J. [Syrec SA (France)

    1996-12-31

    The R-22 refrigerant has been used as a substitute of chlorofluorocarbons in refrigerating machineries but its use will become prohibited very soon. This paper raises the problem of its replacement by other HFC or natural fluids. The problem of natural fluids like ammonia or propane concerns their toxicity, flammability and explosion risk. If a regulation about the greenhouse effect is defined, the performance of the installation will be the decisive parameter for the choice of a refrigerant. R-22 fluid has multiple applications from air-conditioning systems to freezing tunnels and the most suitable substitutes will be different from one application to the other. The different criteria that influence the choice of a refrigerating fluid are: the condensation pressure, the delivery temperature, the compressor volume efficiency, the volume refrigerating power, the coefficient of performance, the variation of vaporization temperature, the global greenhouse effect, the toxicity, flammability and explosive character. A comparison between several fluids has been performed with a single-stage airtight compressor of 10 m{sup 3}/h, at a 40 deg. C constant condensation temperature, a 5 deg. C overheating and a 3 deg. C under-cooling. (J.S.) 6 refs.

  10. 46 CFR 30.10-42 - Machinery space-TB/ALL.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 1 2010-10-01 2010-10-01 false Machinery space-TB/ALL. 30.10-42 Section 30.10-42...-42 Machinery space—TB/ALL. The term machinery space means any space that contains machinery and related equipment including Category A machinery spaces, propelling machinery, boilers, oil fuel...

  11. OPTIONS FOR REDUCING REFRIGERANT EMISSIONS FROM SUPERMARKET SYSTEMS

    Science.gov (United States)

    The report was prepared to assist personnel responsible for the design, construction, and maintenance of retail food refrigeration equipment in making knowledgeable decisions regarding the implementation of refrigerant-emissions-reducing practices and technologies. It characteriz...

  12. A Cold Cycle Dilution Refrigerator for Space Applications Project

    Data.gov (United States)

    National Aeronautics and Space Administration — The cold cycle dilution refrigerator is a continuous refrigerator capable of cooling to temperatures below 100 mK that makes use of a novel thermal magnetic pump....

  13. Refrigerator Optimal Scheduling to Minimise the Cost of Operation

    Directory of Open Access Journals (Sweden)

    Bálint Roland

    2016-12-01

    Full Text Available The cost optimal scheduling of a household refrigerator is presented in this work. The fundamental approach is the model predictive control methodology applied to the piecewise affine model of the refrigerator.

  14. COP improvement of refrigerator/freezers, air-conditioners, and heat pumps using nonazeotropic refrigerant mixtures

    Science.gov (United States)

    Westra, Douglas G.

    1993-01-01

    With the February, 1992 announcement by President Bush to move the deadline for outlawing CFC (chloro-fluoro-carbon) refrigerants from the year 2000 to the year 1996, the refrigeration and air-conditioning industries have been accelerating their efforts to find alternative refrigerants. Many of the alternative refrigerants being evaluated require synthetic lubricants, are less efficient, and have toxicity problems. One option to developing new, alternative refrigerants is to combine existing non-CFC refrigerants to form a nonazeotropic mixture, with the concentration optimized for the given application so that system COP (Coefficient Of Performance) may be maintained or even improved. This paper will discuss the dilemma that industry is facing regarding CFC phase-out and the problems associated with CFC alternatives presently under development. A definition of nonazeotropic mixtures will be provided, and the characteristics and COP benefits of nonazeotropic refrigerant mixtures will be explained using thermodynamic principles. Limitations and disadvantages of nonazeotropic mixtures will be discussed, and example systems using such mixtures will be reviewed.

  15. Cool sound: the future of refrigeration? Thermodynamic and heat transfer issues in thermoacoustic refrigeration

    Science.gov (United States)

    Herman, C.; Travnicek, Z.

    2006-04-01

    During the past two decades the thermoacoustic refrigeration and prime mover cycles gained importance in a variety of refrigeration applications. Acoustic work, sound, can be used to generate temperature differences that allow the transport of heat from a low temperature reservoir to an ambient at higher temperature, thus forming a thermoacoustic refrigeration system. The thermoacoustic energy pumping cycle can also be reversed: temperature difference imposed along the stack plates can lead to sound generation. In this situation the thermoacoustic system operates as a prime mover. Sound generated by means of this thermoacoustic energy conversion process can be utilized to drive different types of refrigeration devices that require oscillatory flow for their operation, such as thermoacoustic refrigerators, pulse tubes and Stirling engines. In order for a thermoacoustic refrigeration or prime mover system as well as a thermoacoustic prime mover driving a non-thermoacoustic refrigeration system to be competitive on the current market, it has to be optimized in order to improve its overall performance. Optimization can involve improving the performance of the entire system as well as its components. The paper addresses some of the thermodynamic and heat transfer issues relevant in improving the performance of the thermoacoustic system, such as optimization for maximum COP, maximum cooling load and the role of the heat exchangers. Results obtained using the two optimization criteria are contrasted in the paper to illustrate the complexity of the optimization process.

  16. Studies of intermetallic growth in Cu-solder systems and wettability at solid-liquid interfaces

    OpenAIRE

    Martin, Raymond W.

    1991-01-01

    Approved for public release; distribution is unlimited The metallurgical bond formed between tin-lead solder and the copper substrate is characterized by the formation of an intermetallic compound layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic/copper interface and its dissolution at the intermetallic/liquid solder interface. These were studied by determining the dissolution rates of the copper and the i...

  17. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    Science.gov (United States)

    Brown, Christina

    2004-01-01

    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  18. Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder

    OpenAIRE

    Horton, W. Scott.

    2006-01-01

    In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and d...

  19. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  20. Packaging of hard solder 500W QCW diode laser array

    Science.gov (United States)

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng

    2016-03-01

    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  1. Modeling of thermal processes in waveguide tracts induction soldering

    Science.gov (United States)

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Seregin, Yu N.

    2017-02-01

    The problem solving of the induction heating models development, which describe the heating of the separate structural assembly components of the waveguide path and product generally, is presented in this paper. Proposed mathematical models are based on the thermodynamics equation and on the heat balance law. The system of the heating process mathematical models, such as surge tube and flange heating, and the mathematical model of the energy distribution are presented. During the modeling process with Matlab system by using mathematical models graphs of the tube, flange and coupling heating were obtained. These design charts are confirmed by the results of the experimental study. During the experimental studies pyrometers for temperature control and a video camera for visual control of the process parameters were used. On the basis of obtained models the induction soldering process features analysis is carried out and the need of its automation by the using of the information control systems for thermal management between the connection elements is revealed.

  2. 92 K thermoacoustically driven pulse tube refrigerator

    Institute of Scientific and Technical Information of China (English)

    TANG Ke; CHEN Guobang; JIN Tao; KONG Bo; BAO Rui; QIU Limin; GAN Zhihua

    2004-01-01

    @@ A thermoacoustic prime mover, instead of a mechanical compressor, was firstly proposed in 1990 by Radebaugh and Swift et al. to drive a pulse tube refrigerator [1]. The so-called thermoacoustically driven pulse tube refrigerator (TADPTR) has a number of advantages. First,it is characterized by its long-term stable operation for it has no moving components. Besides, solar energy and waste fuel gas can be adopted as its driving source. Utilization of low-grade energy not only improves its overall thermal efficiency, but also is most attractively applicable to the case which is short of electricity but abundant in heat energy. The potential applications, such as thermoacoustic natural gas liquefier, are under development[2].It burns part of natural gas to drive a pulse tube refrigerator whose cooling capacity is then used to liquefy the rest natural gas.

  3. Materials for Room Temperature Magnetic Refrigeration

    DEFF Research Database (Denmark)

    Hansen, Britt Rosendahl

    Magnetic refrigeration is a cooling method, which holds the promise of being cleaner and more efficient than conventional vapor-compression cooling. Much research has been done during the last two decades on various magnetic materials for this purpose and today a number of materials are considered...... candidates as they fulfill many of the requirements for a magnetic refrigerant. However, no one material stands out and the field is still active with improving the known materials and in the search for a better one. Magnetic cooling is based on the magnetocaloric effect, which causes a magnetic material...... to change its temperature when a magnetic field is applied or removed. For room temperature cooling, one utilizes that the magnetocaloric effect peaks near magnetic phase transitions and so the materials of interest all have a critical temperature within the range of 250 – 310 K. A magnetic refrigerant...

  4. A new environment-friendly refrigerant

    Institute of Scientific and Technical Information of China (English)

    赵晓宇; 史琳; 朱明善; 韩礼钟

    1999-01-01

    CFCs and HCFCs, widely used in refrigeration and air-conditioning equipment, have been or will be phased out according to the revisions of the Montreal Protocol because they deplete the ozone layer. Many substitutes have been proposed, but no one has perfectly replaced the CFC end HCFC refrigerants. New generation alternatives are being investigated worldwide. According to the industrial and environmental requirements, many factors should be considered in the screening and evaluation of refrigerant alternatives. A new method is proposed using the soft algebra method——fuzzy multiple evaluation. The weights for different factors are determined mathematically and criteria values for all the objects are made dimensionless to quantitatively compare the different alternatives. A new long-term drop-in mixture alternative THR02 is developed and evaluated in a series of theoretical and experimental evaluations.THR02 is proved to be an environment-friendly, nontoxic, inflammable, drop-in alternative to CFC-12 a

  5. Model Based Control of Refrigeration Systems

    DEFF Research Database (Denmark)

    Larsen, Lars Finn Sloth

    of the supermarket refrigeration systems therefore greatly relies on a human operator to detect and accommodate failures, and to optimize system performance under varying operational condition. Today these functions are maintained by monitoring centres located all over the world. Initiated by the growing need...... for automation of these procedures, that is to incorporate some "intelligence" in the control system, this project was started up. The main emphasis of this work has been on model based methods for system optimizing control in supermarket refrigeration systems. The idea of implementing a system optimizing.......e. by degrading the performance. The method has been successfully applied on a test frigeration system for minimization of the power consumption; the hereby gained experimental results will be presented. The present control structure in a supermarket refrigeration system is distributed, which means...

  6. Short Time Cycles of Purely Quantum Refrigerators

    CERN Document Server

    Feldmann, Tova

    2012-01-01

    Four stroke Otto refrigerator cycles with no classical analogue are studied. Extremely short cycle times with respect to the internal time scale of the working medium characterize these refrigerators. Therefore these cycles are termed sudden. The sudden cycles are characterized by the stable limit cycle which is the invariant of the global cycle propagator. During their operation the state of the working medium possesses significant coherence which is not erased in the equilibration segments due to the very short time allocated. This characteristic is reflected in a difference between the energy entropy and the Von Neumann entropy of the working medium. A classification scheme for sudden refrigerators is developed allowing simple approximations for the cooling power and coefficient of performance.

  7. Exergoeconomic Analysis of a Refrigeration Cycle

    Directory of Open Access Journals (Sweden)

    Durriye Bilge

    2004-01-01

    Full Text Available The exergoeconomic theory is applied to a two stage vapour compression refrigeration cycle. An exergy-aided cost analysis, taking into account pressure drops and heat gain/loss for all of the components in the refrigeration system as well as the pipe connections, has been made. Exergoeconomic factors, showing whether the monetary expenditures mostly originate from capital investment and Operating and Maintenance (O&M costs or from exergy destruction and exergy loss, are found and shown in the form of tables. The true cost of the heat drawn from cold room, which is the product of a refrigeration sytem, has been calculated. In this way, it will be possible to reflect the cost of cold room storage to the market price of the goods completely and precisely.

  8. Systematic modelling and simulation of refrigeration systems

    DEFF Research Database (Denmark)

    Rasmussen, Bjarne D.; Jakobsen, Arne

    1998-01-01

    The task of developing a simulation model of a refrigeration system can be very difficult and time consuming. In order for this process to be effective, a systematic method for developing the system model is required. This method should aim at guiding the developer to clarify the purpose of the s......The task of developing a simulation model of a refrigeration system can be very difficult and time consuming. In order for this process to be effective, a systematic method for developing the system model is required. This method should aim at guiding the developer to clarify the purpose...... of the simulation, to select appropriate component models and to set up the equations in a well-arranged way. In this paper the outline of such a method is proposed and examples showing the use of this method for simulation of refrigeration systems are given....

  9. Basics of Low-temperature Refrigeration

    CERN Document Server

    Alekseev, A

    2014-01-01

    This chapter gives an overview of the principles of low temperature refrigeration and the thermodynamics behind it. Basic cryogenic processes - Joule-Thomoson process, Brayton process as well as Claude process - are described and compared. A typical helium laboratory refrigerator based on Claude process is used as a typical example of a low-temperature refrigeration system. A description of the hardware components for helium liquefaction is an important part of this paper, because the design of the main hardware components (compressors, turbines, heat exchangers, pumps, adsorbers, etc.) provides the input for cost calculation, as well as enables to estimate the reliability of the plant and the maintenance expenses. All these numbers are necessary to calculate the economics of a low temperature application.

  10. An adiabatic demagnetization refrigerator for SIRTF

    Science.gov (United States)

    Timbie, P. T.; Bernstein, G. M.; Richards, P. L.

    1989-02-01

    An adiabatic demagnetization refrigerator (ADR) has been proposed to cool bolometric infrared detectors on the multiband imaging photometer of the Space Infrared Telescope Facility (SIRTF). One such refrigerator has been built which uses a ferric ammonium alum salt pill suspended by nylon threads in a 3-T solenoid. The resonant modes of this suspension are above 100 Hz. The heat leak to the salt pill is less than 0.5 microW. The system has a hold time at 0.1K of more than 12 h. The cold stage temperature is regulated with a feedback loop that controls the magnetic field. A second, similar refrigerator is being built at a SIRTF prototype to fly on a ballon-borne telescope. It will use a ferromagnetic shield. The possibility of using a high-Tc solenoid-actuated heat switch is also discussed.

  11. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  12. Experimental Study of Explosion Limits of Refrigerants and Lubricants’ Mixture

    OpenAIRE

    Shi, Y.Q.; Chen, Guangming; Chen, Q.

    2012-01-01

    The explosion limits of refrigerants and lubricants’ mixture were studied. The refrigerants like R161, R1234yf and R152a are combustible. Lubricants, to a certain extent, are combustion-supporting. In many actual conditions, lubricants and refrigerants are mixed together. In this paper, a test device which can be run automatically was established according to ASTM E681-09, and the explosive experimental of refrigerants and lubricants’ mixture in some ratio was studied. By altering the proport...

  13. THE STIRLING GAS REFRIGERATING MACHINE MECHANICAL DESIGN IMPROVING

    Directory of Open Access Journals (Sweden)

    V. V. Trandafilov

    2016-02-01

    Full Text Available To improve the mechanical design of the piston Stirling gas refrigeration machine the structural optimization of rotary vane Stirling gas refrigeration machine is carried out. This paper presents the results of theoretical research. Analysis and prospects of rotary vane Stirling gas refrigeration machine for domestic and industrial refrigeration purpose are represented. The results of a patent search by mechanisms of transformation of rotary vane machines are discussed

  14. Analysis of Refrigeration Cycle Performance with an Ejector

    OpenAIRE

    Wani J. R.; Baheta Aklilu T.; Woldeyohannes Abraham D.; Hassan Suhaimi

    2016-01-01

    A conventional refrigeration cycle uses expansion device between the condenser and the evaporator which has losses during the expansion process. A refrigeration cycle with ejector is a promising modification to improve the performance of conventional refrigeration cycle. The ejector is used to recover some of the available work so that the compressor suction pressure increases. To investigate the enhancement a model with R134a refrigerant was developed. To solve the set of equations and simul...

  15. THE STIRLING GAS REFRIGERATING MACHINE MECHANICAL DESIGN IMPROVING

    Directory of Open Access Journals (Sweden)

    V. V. Trandafilov

    2016-06-01

    Full Text Available To improve the mechanical design of the piston Stirling gas refrigeration machine the structural optimization of rotary vane Stirling gas refrigeration machine is carried out. This paper presents the results of theoretical research. Analysis and prospects of rotary vane Stirling gas refrigeration machine for domestic and industrial refrigeration purpose are represented. The results of a patent search by mechanisms of transformation of rotary vane machines are discussed.

  16. THE STIRLING GAS REFRIGERATING MACHINE MECHANICAL DESIGN IMPROVING

    OpenAIRE

    V. V. Trandafilov; M.G. Khmelniuk; O. Y.Yakovleva; A. V. Ostapenko

    2016-01-01

    To improve the mechanical design of the piston Stirling gas refrigeration machine the structural optimization of rotary vane Stirling gas refrigeration machine is carried out. This paper presents the results of theoretical research. Analysis and prospects of rotary vane Stirling gas refrigeration machine for domestic and industrial refrigeration purpose are represented. The results of a patent search by mechanisms of transformation of rotary vane machines are discussed.

  17. Analysis of electric machinery and drive systems

    CERN Document Server

    Krause, Paul C; Sudhoff, Scott D; Pekarek, Steven

    2013-01-01

    Introducing a new edition of the popular reference on machine analysis Now in a fully revised and expanded edition, this widely used reference on machine analysis boasts many changes designed to address the varied needs of engineers in the electric machinery, electric drives, and electric power industries. The authors draw on their own extensive research efforts, bringing all topics up to date and outlining a variety of new approaches they have developed over the past decade. Focusing on reference frame theory that has been at the core of this work since the first edition, th

  18. The RNA polymerase I transcription machinery

    OpenAIRE

    Russell, Jackie; Zomerdijk, Joost C. B. M.

    2006-01-01

    The rRNAs constitute the catalytic and structural components of the ribosome, the protein synthesis machinery of cells. The level of rRNA synthesis, mediated by Pol I (RNA polymerase I), therefore has a major impact on the life and destiny of a cell. In order to elucidate how cells achieve the stringent control of Pol I transcription, matching the supply of rRNA to demand under different cellular growth conditions, it is essential to understand the components and mechanics of the Pol I transc...

  19. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  20. Soldering in a Reduced Gravity Environment (SoRGE)

    Science.gov (United States)

    Easton, John W.; Struk, Peter M.

    2012-01-01

    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.