WorldWideScience

Sample records for machinery refrigerators solder

  1. Performance of refrigerating machineries with new refrigerants; Performance des machines frigorifiques avec les nouveaux refrigerants

    Energy Technology Data Exchange (ETDEWEB)

    Bailly, A; Jurkowski, R [CIAT, 01 - Culoz (France)

    1998-12-31

    This paper reports on a comparative study of the thermal performances of different refrigerants like R-22, R-134a, R-404A and R-407C when used as possible substitutes for the HCFC22 refrigerant in a given refrigerating machinery equipped with compact high performance plate exchangers. Thermal performances are compared in identical operating conditions. The behaviour of the two-phase exchange coefficient is analyzed with respect to the different parameters. The composition of the mixture after one year of operation has been analyzed too and the influence of oil on the performances is studied. (J.S.)

  2. Performance of refrigerating machineries with new refrigerants; Performance des machines frigorifiques avec les nouveaux refrigerants

    Energy Technology Data Exchange (ETDEWEB)

    Bailly, A.; Jurkowski, R. [CIAT, 01 - Culoz (France)

    1997-12-31

    This paper reports on a comparative study of the thermal performances of different refrigerants like R-22, R-134a, R-404A and R-407C when used as possible substitutes for the HCFC22 refrigerant in a given refrigerating machinery equipped with compact high performance plate exchangers. Thermal performances are compared in identical operating conditions. The behaviour of the two-phase exchange coefficient is analyzed with respect to the different parameters. The composition of the mixture after one year of operation has been analyzed too and the influence of oil on the performances is studied. (J.S.)

  3. Recent evolutions of refrigerating machineries and heat pumps; Evolutions recentes des machines a froid et thermopompes

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1998-12-31

    This book of proceedings reports on 10 papers (or series of transparencies) concerning some recent developments about refrigerating machineries and heat pumps as used in space heating, air-conditioning and industrial refrigeration. Various aspects are developed: thermodynamic cycles, thermal performances, dimensioning, modeling, refrigerants substitution, design of flanged exchangers, compressors etc.. (J.S.)

  4. Recent evolutions of refrigerating machineries and heat pumps; Evolutions recentes des machines a froid et thermopompes

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-12-31

    This book of proceedings reports on 10 papers (or series of transparencies) concerning some recent developments about refrigerating machineries and heat pumps as used in space heating, air-conditioning and industrial refrigeration. Various aspects are developed: thermodynamic cycles, thermal performances, dimensioning, modeling, refrigerants substitution, design of flanged exchangers, compressors etc.. (J.S.)

  5. Compression-absorption (resorption) refrigerating machinery. Modeling of reactors; Machine frigorifique a compression-absorption (resorption). Modelisation des reacteurs

    Energy Technology Data Exchange (ETDEWEB)

    Lottin, O; Feidt, M; Benelmir, R [LEMTA-UHP Nancy-1, 54 - Vandoeuvre-les-Nancy (France)

    1998-12-31

    This paper is a series of transparencies presenting a comparative study of the thermal performances of different types of refrigerating machineries: di-thermal with vapor compression, tri-thermal with moto-compressor, with ejector, with free piston, adsorption-type, resorption-type, absorption-type, compression-absorption-type. A prototype of ammonia-water compression-absorption heat pump is presented and modeled. (J.S.)

  6. Compression-absorption (resorption) refrigerating machinery. Modeling of reactors; Machine frigorifique a compression-absorption (resorption). Modelisation des reacteurs

    Energy Technology Data Exchange (ETDEWEB)

    Lottin, O.; Feidt, M.; Benelmir, R. [LEMTA-UHP Nancy-1, 54 - Vandoeuvre-les-Nancy (France)

    1997-12-31

    This paper is a series of transparencies presenting a comparative study of the thermal performances of different types of refrigerating machineries: di-thermal with vapor compression, tri-thermal with moto-compressor, with ejector, with free piston, adsorption-type, resorption-type, absorption-type, compression-absorption-type. A prototype of ammonia-water compression-absorption heat pump is presented and modeled. (J.S.)

  7. Optimization of Ventilation and Alarm Setting During the Process of Ammonia Leak in Refrigeration Machinery Room Based on Numerical Simulation

    Directory of Open Access Journals (Sweden)

    Dongliang Liu

    2017-03-01

    Full Text Available In order to optimize the ventilation effect of ammonia leakage in the refrigeration machinery room, a food processing enterprise is selected as the subject investigated. The velocity and concentration field distribution during the process of ammonia leakage are discussed through simulation of refrigeration machinery room using CFD software. The ventilation system of the room is optimized in three aspects which are named air distribution, ventilation volume and discharge outlet. The influence of the ammonia alarm system through ventilation is also analyzed. The results show that it will be better to set the discharge outlet at the top of the plant than at the side of the wall, and the smaller of the distance between the air outlet and the ammonia gathering area, the better of the effect of ventilation will be. The air flow can be improved and the vortex flow can be reduced if the ventilation volume, the number of air vents and the exhaust velocity are reasonably arranged. Not only the function of the alarm could be ensured, but also the scope of the detection area could be enlarged if the detectors are set on the ceiling of the refrigeration units or the ammonia storage vessel.

  8. Optimization of refrigeration machinery

    Energy Technology Data Exchange (ETDEWEB)

    Wall, Goeran [University Coll. of Eskilstuna/Vaesteraas (SE)

    1991-11-01

    This paper reports the application of thermoeconomics to the optimization of a heat pump. The method is suited for application to thermodynamic processes and yields exergy losses. The marginal cost of an arbitary variable can also be calculated. The efficiencies of the compressor, condenser, evaporator and electric motor are chosen as variables to be optimized. Parameters such as the price of electricity and the temperature of the delivered heat may vary between optimizations, and results are presented for different parameter values. The results show that the efficiency of the electric motor is the most important variable. (author).

  9. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  10. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  11. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  12. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  13. Terminology for refrigerating machinery in 5 languages with definitions. CECOMAF terminology English, French, German, Italian and Spanish. Terminologie fuer kaeltetechnische Erzeugnisse in 5 Sprachen mit Definitionen. CECOMAF Terminologie English, Francais, Deutsch, Italiano, Espanol

    Energy Technology Data Exchange (ETDEWEB)

    1986-01-01

    The dictionary covers the following topics: Directions for user, alphabetical list, subject index, main groups: Refrigerating systems and plants, compressors, heat exchangers and apparatus, control and safety devices, equipment for refrigerated storage and transport, refrigerators and refrigerated cabinets, special cooling and freezing equipment, miscellaneous; definitions for the above mentioned main groups, and corrections.

  14. Thermoacoustic refrigeration

    Science.gov (United States)

    Garrett, Steven L.; Hofler, Thomas J.

    1991-12-01

    A new refrigerator which uses resonant high amplitude sound in inert gases to pump heat is described and demonstrated. The phasing of the thermoacoustic cycle is provided by thermal conduction. This 'natural' phasing allows the entire refrigerator to operate with only one moving part (the loudspeaker diaphragm). The thermoacoustic refrigerator has no sliding seals, requires no lubrication, uses only low-tolerance machine parts, and contains no expensive components. Because the compressor moving mass is typically small and the oscillation frequency is high, the small amount of vibration is very easily isolated. This low vibration and lack of sliding seals makes thermoacoustic refrigeration an excellent candidate for food refrigeration and commercial/residential air conditioning applications. The design, fabrication, and performance of the first practical, autonomous thermoacoustic refrigerator, which will be flown on the Space Shuttle (STS-42), are described, and designs for terrestrial applications are presented.

  15. Flammable refrigerants

    NARCIS (Netherlands)

    Gerwen, R.J.M. van; Verwoerd, M.; Oostendorp, P.A.

    1999-01-01

    Hydrocarbons are promising alternatives for CFC, HCFC and HFC refrigerants. Due to their flammable nature, safety aspects have to be considered carefully. The world-wide situation concerning acceptability and practical application of flammable refrigerants is becoming more and more complex and

  16. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  17. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  18. Recent investigations on refrigerants for magnetic refrigerators

    International Nuclear Information System (INIS)

    Hashimoto, T.

    1986-01-01

    In development of the magnetic refrigerator, an important problem is selection of magnetic materials as refrigerants. The main purpose of the present paper is to discuss the magnetic and thermal properties necessary for these refrigerants and to report recent investigations. Magnetic refrigerants can be expediently divided into two groups, one for the Carnottype magnetic refrigerator below 20 K and the other for the Ericsson-type refrigerator. The required physical properties of refrigerants in each type of the magnetic refrigerator are first discussed. And then, the results of recent investigations on the magnetic, thermal and magnetocaloric characters of several promising magnetic refrigerants are shown. Finally, a brief prospect of the magnetic refrigerants and refrigerators is given

  19. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  20. Improving machinery reliability

    CERN Document Server

    Bloch, Heinz P

    1998-01-01

    This totally revised, updated and expanded edition provides proven techniques and procedures that extend machinery life, reduce maintenance costs, and achieve optimum machinery reliability. This essential text clearly describes the reliability improvement and failure avoidance steps practiced by best-of-class process plants in the U.S. and Europe.

  1. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  2. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  3. Stirling Refrigerator

    Science.gov (United States)

    Kagawa, Noboru

    A Stirling cooler (refrigerator) was proposed in 1862 and the first Stirling cooler was put on market in 1955. Since then, many Stirling coolers have been developed and marketed as cryocoolers. Recently, Stirling cycle machines for heating and cooling at near-ambient temperatures between 173 and 400K, are recognized as promising candidates for alternative system which are more compatible with people and the Earth. The ideal cycles of Stirling cycle machine offer the highest thermal efficiencies and the working fluids do not cause serious environmental problems of ozone depletion and global warming. In this review, the basic thermodynamics of Stirling cycle are briefly described to quantify the attractive cycle performance. The fundamentals to realize actual Stirling coolers and heat pumps are introduced in detail. The current status of the Stirling cycle machine technologies is reviewed. Some machines have almost achieved the target performance. Also, duplex-Stirling-cycle and Vuilleumier-cycle machines and their performance are introduced.

  4. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  5. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1998-03-15

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to thermophysical properties, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air conditioning and refrigeration equipment. It also references documents addressing compatibility of refrigerants and lubricants with other materials.

  6. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M. [Calm (James M.), Great Falls, VA (United States)

    1999-01-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilities access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  7. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1996-07-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  8. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1996-11-15

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  9. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  10. Development of 18 K helium refrigeration system for CERN

    CERN Document Server

    CERN. Geneva

    2004-01-01

    The Conseil Europeen pour Ia Recherche Nucleaire (CERN) placed an order for a 1.8 K helium refrigeration system with IHI for the Large Hadron Collider project in 1999. IHI formed a consortium with Linde Kryotechnik AG (Switzerland), which has long experience with helium refrigeration systems. IHI designed and manufactured cold compressors based on leading technologies and expertise for turbo machinery. The cold compressor has the highest efficiency in the world. This paper describes the 1.8 K helium refrigeration system and performance test results at CERN. (5 refs).

  11. Cavitation in Hydraulic Machinery

    Energy Technology Data Exchange (ETDEWEB)

    Kjeldsen, M.

    1996-11-01

    The main purpose of this doctoral thesis on cavitation in hydraulic machinery is to change focus towards the coupling of non-stationary flow phenomena and cavitation. It is argued that, in addition to turbulence, superimposed sound pressure fluctuations can have a major impact on cavitation and lead to particularly severe erosion. For the design of hydraulic devices this finding may indicate how to further limit the cavitation problems. Chapter 1 reviews cavitation in general in the context of hydraulic machinery, emphasizing the initial cavitation event and the role of the water quality. Chapter 2 discusses the existence of pressure fluctuations for situations common in such machinery. Chapter 3 on cavitation dynamics presents an algorithm for calculating the nucleation of a cavity cluster. Chapter 4 describes the equipment used in this work. 53 refs., 55 figs.,10 tabs.

  12. Method and refrigerants for replacing existing refrigerants in centrifugal compressors

    International Nuclear Information System (INIS)

    Kopko, W.L.

    1991-01-01

    This patent describes a method for replacing an existing refrigerant in a centrifugal compressor. It comprises selecting a desired impeller Mach number for the centrifugal compressor; selecting a base refrigerant constituent; combining at least one additive refrigerant constituent with the base refrigerant constituent to form a replacement refrigerant having at least one physical or chemical property different from the existing refrigerant and substantially providing the desired impeller Mach number in the centrifugal compressor; and replacing the existing refrigerant with the replacement refrigerant

  13. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  14. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  15. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  16. Transition to New Refrigerants

    Science.gov (United States)

    Overview page provides information on the refrigerants that motor vehicle air conditioners have used over time, with information on environmental impacts, refrigerant fitting sizes, label colors, and alternatives to ozone-depleting substances.

  17. ARTI Refrigerant Database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M. [Calm (James M.), Great Falls, VA (United States)

    1994-05-27

    The Refrigerant Database consolidates and facilitates access to information to assist industry in developing equipment using alternative refrigerants. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern.

  18. Experience with small turbomachinery in a 400 watt refrigerator

    International Nuclear Information System (INIS)

    Fuerst, J.D.

    1996-09-01

    A refrigerator similar to one of the Fermilab Tevatron satellites was reconfigured to use turbomachinery instead of the reciprocating equipment typical of the installations. A Sulzer dry turboexpander, Creare wet turboexpander, and IHI centrifugal cold compressor have been installed and operated for about 8000 hours. Experience was gained both with the rotating machinery and with the refrigerator itself as it interfaced with the load. Equipment was set up to regulate in the same manner as the reciprocating devices had. Heat load and operating mode were adjusted and evaluations made regarding the behavior of the devices. Individual equipment performance is described as well as system behavior and overall integration of the machinery. In particular, attention is paid to the Creare wet turboexpander. This device is operated for the first time as part of a full scale refrigeration system, testing not only its performance at the design point but also its off design characteristics and behavior in transient situations

  19. Experience with small turbomachinery in a 400 watt refrigerator

    International Nuclear Information System (INIS)

    Fuerst, J.D.

    1996-01-01

    A refrigerator similar to one of the Fermilab Tevatron satellites was re-configured to use turbomachinery instead of the reciprocating equipment typical of the installations. A Sulzer dry turboexpander, Creare wet turboexpander, and IHI centrifugal cold compressor have been installed and operated for about 8000 hours. Experience was gained both with the rotating machinery and with the refrigerator itself as it interfaced with the load. Equipment was set up to regulate in the same manner as the reciprocating devices had. Heat loads and operating mode were adjusted and evaluations made regarding the behavior of the devices. Individual equipment performance is described, as well as system behavior and overall integration of the machinery. In particular, attention is paid to the Creare wet turboexpander. This device is operated for the first time as part of a full scale refrigeration system, testing not only its performance at the design point but also its off design characteristics and behavior in transient situations

  20. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  1. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  2. Bacterial mitotic machineries

    DEFF Research Database (Denmark)

    Gerdes, Kenn; Møller-Jensen, Jakob; Ebersbach, Gitte

    2004-01-01

    Here, we review recent progress that yields fundamental new insight into the molecular mechanisms behind plasmid and chromosome segregation in prokaryotic cells. In particular, we describe how prokaryotic actin homologs form mitotic machineries that segregate DNA before cell division. Thus, the P......M protein of plasmid R1 forms F actin-like filaments that separate and move plasmid DNA from mid-cell to the cell poles. Evidence from three different laboratories indicate that the morphogenetic MreB protein may be involved in segregation of the bacterial chromosome.......Here, we review recent progress that yields fundamental new insight into the molecular mechanisms behind plasmid and chromosome segregation in prokaryotic cells. In particular, we describe how prokaryotic actin homologs form mitotic machineries that segregate DNA before cell division. Thus, the Par...

  3. Vibration of hydraulic machinery

    CERN Document Server

    Wu, Yulin; Liu, Shuhong; Dou, Hua-Shu; Qian, Zhongdong

    2013-01-01

    Vibration of Hydraulic Machinery deals with the vibration problem which has significant influence on the safety and reliable operation of hydraulic machinery. It provides new achievements and the latest developments in these areas, even in the basic areas of this subject. The present book covers the fundamentals of mechanical vibration and rotordynamics as well as their main numerical models and analysis methods for the vibration prediction. The mechanical and hydraulic excitations to the vibration are analyzed, and the pressure fluctuations induced by the unsteady turbulent flow is predicted in order to obtain the unsteady loads. This book also discusses the loads, constraint conditions and the elastic and damping characters of the mechanical system, the structure dynamic analysis, the rotor dynamic analysis and the system instability of hydraulic machines, including the illustration of monitoring system for the instability and the vibration in hydraulic units. All the problems are necessary for vibration pr...

  4. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  5. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  6. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  7. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  8. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M. [Calm (James M.), Great Falls, VA (United States)

    1996-04-15

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included, though some may be added at a later date. The database identifies sources of specific information on refrigerants. It addresses lubricants including alkylbenzene, polyalkylene glycol, polyolester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents. They are included to accelerate availability of the information and will be completed or replaced in future updates. Citations in this report are divided into the following topics: thermophysical properties; materials compatibility; lubricants and tribology; application data; safety; test and analysis methods; impacts; regulatory actions; substitute refrigerants; identification; absorption and adsorption; research programs; and miscellaneous documents. Information is also presented on ordering instructions for the computerized version.

  9. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  10. Developments in magnetocaloric refrigeration

    International Nuclear Information System (INIS)

    Brueck, Ekkes

    2005-01-01

    Modern society relies on readily available refrigeration. Magnetic refrigeration has three prominent advantages compared with compressor-based refrigeration. First, there are no harmful gases involved; second, it may be built more compactly as the working material is a solid; and third, magnetic refrigerators generate much less noise. Recently a new class of magnetic refrigerant-materials for room-temperature applications was discovered. These new materials have important advantages over existing magnetic coolants: they exhibit a large magnetocaloric effect (MCE) in conjunction with a magnetic phase-transition of first order. This MCE is larger than that of Gd metal, which is used in the demonstration refrigerators built to explore the potential of this evolving technology. In the present review we compare the different materials considering both scientific aspects and industrial applicability. Because fundamental aspects of MCE are not so widely discussed, we also give some theoretical considerations. (topical review)

  11. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  12. Refrigeration and global warming

    International Nuclear Information System (INIS)

    Anon.

    1997-01-01

    Some aspects of global warming in general, and the implications for refrigerants and refrigerator efficiency in particular, are briefly considered in a question and answer format. The concepts of Global Warming Potential (GWP) and Total Equivalent Warming Impact (TEWI) are explained. GWP is an index which allows a simple comparison to be make between the warming effects of different gases on a kg to kg basis relative to carbon. The GWP depends both on the lifetime of a substance in the atmosphere and its infra-red absorption capacity. The overall warming effect of operating a refrigeration system for its entire life is measured by its TEWI. Chloroflourocarbons (CFCs) which have been widely used as refrigerants are powerful greenhouse gases with high GWPs. Because of the bank of CFCs in refrigerating systems, their levels in the atmosphere are still increasing and it will be some time before refrigerant changes will be effective in reducing the warming effects of refrigerant releases. Hydrocarbons, hydroflourocarbons and ammonia all have a part to play as substitute refrigerants. Refrigerator efficiency is very important in terms of reducing CO 2 emissions. (UK)

  13. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M. [Calm (James M.), Great Falls, VA (United States)

    1998-08-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufactures and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included, though some may be added at a later date. The database identifies sources of specific information on many refrigerants including propane, ammonia, water, carbon dioxide, propylene, ethers, and others as well as azeotropic and zeotropic blends of these fluids. It addresses lubricants including alkylbenzene, polyalkylene glycol, polyolester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents. They are included to accelerate availability of the information and will be completed or replaced in future updates.

  14. ARTI refrigerant database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1997-02-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information on older refrigerants, to assist manufacturers and those using alterative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included, though some may be added at a later date. The database identifies sources of specific information on various refrigerants. It addresses lubricants including alkylbenzene, polyalkylene glycol, polyolester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents. They are included to accelerate availability of the information and will be completed or replaced in future updates.

  15. Matrix analysis of electrical machinery

    CERN Document Server

    Hancock, N N

    2013-01-01

    Matrix Analysis of Electrical Machinery, Second Edition is a 14-chapter edition that covers the systematic analysis of electrical machinery performance. This edition discusses the principles of various mathematical operations and their application to electrical machinery performance calculations. The introductory chapters deal with the matrix representation of algebraic equations and their application to static electrical networks. The following chapters describe the fundamentals of different transformers and rotating machines and present torque analysis in terms of the currents based on the p

  16. Industrial applications of refrigeration. General considerations; Applications industrielles du froid. Generalites

    Energy Technology Data Exchange (ETDEWEB)

    Marvillet, Ch. [Ecole Centrale de Lyon, 69 - Ecully (France); Groupement pour la Recherche sur les Echangeurs Thermiques, GRETh (France)

    2001-10-01

    The refrigeration process consists in the lowering of the temperature of a product or of a process below the ambient temperature. Thus, the refrigeration process implies a heat absorption process for the production of coldness. Two ways of coldness production are considered: the mechanical refrigeration using compression or absorption cycle machineries, and the cryogenic refrigeration which requires the use of industrial fluids like liquid nitrogen, helium or CO{sub 2}. This article presents the different functions of refrigeration in industrial processes and the effects of temperature on inert or living matter (influence of temperature on the physical properties, thermodynamic state, and physico-chemical transformations of solids, bodies and substances, influence of temperature on the transformation processes of food products, mechanical refrigeration and mastery of fermentation). (J.S.)

  17. Pumping machinery theory and practice

    CERN Document Server

    Badr, Hassan M

    2014-01-01

    Pumping Machinery Theory and Practice comprehensively covers the theoretical foundation and applications of pumping machinery. Key features: Covers characteristics of centrifugal pumps, axial flow pumps and displacement pumpsConsiders pumping machinery performance and operational-type problemsCovers advanced topics in pumping machinery including multiphase flow principles, and two and three-phase flow pumping systemsCovers different methods of flow rate control and relevance to machine efficiency and energy consumptionCovers different methods of flow rate control and relevance to machine effi

  18. Safeness of radiological machinery

    International Nuclear Information System (INIS)

    Yokoyama, Shun

    1979-01-01

    The human factors affecting the safeness of radiological machinery, which are often very big and complicated machines, are described from the stand point of handling. 20 to 50% of the troubles on equipments seem to be caused by men. This percentage will become even higher in highly developed equipments. Human factors have a great influence on the safeness of radiological equipments. As the human factors, there are sensory factors and knowledge factors as well as psychological factors, and the combination of these factors causes mishandling and danger. Medical services at present are divided in various areas, and consist of the teamwork of the people in various professions. Good human relationship, education and control are highly required to secure the safeness. (Kobatake, H.)

  19. Cryogenic mixed refrigerant processes

    CERN Document Server

    Venkatarathnam, Gadhiraju

    2010-01-01

    Teaches the need for refrigerant mixtures, the type of mixtures that can be used for different refrigeration and liquefaction applications, the different processes that can be used and the methods to be adopted for choosing the components of a mixture and their concentration for different applications.

  20. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  1. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  2. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  3. Refrigerants and environment

    Science.gov (United States)

    Tsvetkov, O. B.; Laptev, Yu A.

    2017-11-01

    The refrigeration and air-conditioning industries are important sectors of the economy and represents about 15 % of global electricity consumptions. The chlorofluorocarbons also called CFCs are a class of refrigerants containing the halogens chlorine and/or fluorine on a carbon skeleton. Because of their environmental impact the Montreal Protocol was negotiated in 1987 to limit the production of certain CFCs and hydrochlirofluorocarbons (HCFCs) in developed and developing countries. The halogenated refrigerants are depleting the ozone layer also major contribution to the greenhouse effect. To be acceptable as a refrigerant a fluid must satisfy a variety of thermodynamic criteria and should be environment friendly with zero Ozone Depletion Potential and low Global Warming Potential. The perspective of a future phase down of HFCs is considered in this report taking into account a strategy for the phase out of HCFCs and perspective of choosing of various refrigerant followed by safety issues.

  4. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  5. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  6. Necrosome core machinery: MLKL.

    Science.gov (United States)

    Zhang, Jing; Yang, Yu; He, Wenyan; Sun, Liming

    2016-06-01

    In the study of regulated cell death, the rapidly expanding field of regulated necrosis, in particular necroptosis, has been drawing much attention. The signaling of necroptosis represents a sophisticated form of a death pathway. Anti-caspase mechanisms (e.g., using inhibitors of caspases, or genetic ablation of caspase-8) switch cell fate from apoptosis to necroptosis. The initial extracellular death signals regulate RIP1 and RIP3 kinase activation. The RIP3-associated death complex assembly is necessary and sufficient to initiate necroptosis. MLKL was initially identified as an essential mediator of RIP1/RIP3 kinase-initiated necroptosis. Recent studies on the signal transduction using chemical tools and biomarkers support the idea that MLKL is able to make more functional sense for the core machinery of the necroptosis death complex, called the necrosome, to connect to the necroptosis execution. The experimental data available now have pointed that the activated MLKL forms membrane-disrupting pores causing membrane leakage, which extends the prototypical concept of morphological and biochemical events following necroptosis happening in vivo. The key role of MLKL in necroptosis signaling thus sheds light on the logic underlying this unique "membrane-explosive" cell death pathway. In this review, we provide the general concepts and strategies that underlie signal transduction of this form of cell death, and then focus specifically on the role of MLKL in necroptosis.

  7. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  8. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  9. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  10. Public Refrigerated Warehouses

    Data.gov (United States)

    Department of Homeland Security — The International Association of Refrigerated Warehouses (IARW) came into existence in 1891 when a number of conventional warehousemen took on the demands of storing...

  11. Thermoacoustic engines and refrigerators

    Energy Technology Data Exchange (ETDEWEB)

    Swift, G.

    1996-12-31

    This report is a transcript of a practice lecture given in preparation for a review lecture on the operation of thermoacoustic engines and refrigerators. The author begins by a brief review of the thermodynamic principles underlying the operation of thermoacoustic engines and refrigerators. Remember from thermodynamics class that there are two kinds of heat engines, the heat engine or the prime mover which produces work from heat, and the refrigerator or heat pump that uses work to pump heat. The device operates between two thermal reservoirs at temperatures T{sub hot} and T{sub cold}. In the heat engine, heat flows into the device from the reservoir at T{sub hot}, produces work, and delivers waste heat into the reservoir at T{sub cold}. In the refrigerator, work flows into the device, lifting heat Q{sub cold} from reservoir at T{sub cold} and rejecting waste heat into the reservoir at T{sub hot}.

  12. Refrigerated display cabinets; Butikskyla

    Energy Technology Data Exchange (ETDEWEB)

    Fahlen, Per

    2000-07-01

    This report summarizes experience from SP research and assignments regarding refrigerated transport and storage of food, mainly in the retail sector. It presents the fundamentals of heat and mass transfer in display cabinets with special focus on indirect systems and secondary refrigerants. Moreover, the report includes a brief account of basic food hygiene and the related regulations. The material has been compiled for educational purposes in the Masters program at Chalmers Technical University.

  13. High temperature refrigerator

    International Nuclear Information System (INIS)

    Steyert, W.A. Jr.

    1978-01-01

    A high temperature magnetic refrigerator is described which uses a Stirling-like cycle in which rotating magnetic working material is heated in zero field and adiabatically magnetized, cooled in high field, then adiabatically demagnetized. During this cycle the working material is in heat exchange with a pumped fluid which absorbs heat from a low temperature heat source and deposits heat in a high temperature reservoir. The magnetic refrigeration cycle operates at an efficiency 70% of Carnot

  14. Refrigeration systems and applications

    CERN Document Server

    Dincer, Ibrahim

    2010-01-01

    Refrigeration Systems and Applications, 2nd edition offers a comprehensive treatise that addresses real-life technical and operational problems, enabling the reader to gain an understanding of the fundamental principles and the practical applications of refrigeration technology. New and unique analysis techniques (including exergy as a potential tool), models, correlations, procedures and applications are covered, and recent developments in the field are included - many of which are taken from the author's own research activities in this area. The book also includes so

  15. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  16. Low Global Warming Potential Refrigerants for Commercial Refrigeration Systems

    Energy Technology Data Exchange (ETDEWEB)

    Fricke, Brian A. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Sharma, Vishaldeep [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Abdelaziz, Omar [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2017-06-01

    Supermarket refrigeration systems account for approximately 50% of supermarket energy use, placing this class of equipment among the highest energy consumers in the commercial building domain. In addition, the commonly used refrigeration system in supermarket applications is the multiplex direct expansion (DX) system, which is prone to refrigerant leaks due to its long lengths of refrigerant piping. This leakage reduces the efficiency of the system and increases the impact of the system on the environment. The high Global Warming Potential (GWP) of the hydrofluorocarbon (HFC) refrigerants commonly used in these systems, coupled with the large refrigerant charge and the high refrigerant leakage rates leads to significant direct emissions of greenhouse gases into the atmosphere. Environmental concerns are driving regulations for the heating, ventilating, air-conditioning and refrigeration (HVAC&R) industry towards lower GWP alternatives to HFC refrigerants. Existing lower GWP refrigerant alternatives include hydrocarbons, such as propane (R-290) and isobutane (R-600a), as well as carbon dioxide (R-744), ammonia (R-717), and R-32. In addition, new lower GWP refrigerant alternatives are currently being developed by refrigerant manufacturers, including hydrofluoro-olefin (HFO) and unsaturated hydrochlorofluorocarbon (HCFO) refrigerants. The selection of an appropriate refrigerant for a given refrigeration application should be based on several factors, including the GWP of the refrigerant, the energy consumption of the refrigeration system over its operating lifetime, and leakage of refrigerant over the system lifetime. For example, focusing on energy efficiency alone may overlook the significant environmental impact of refrigerant leakage; while focusing on GWP alone might result in lower efficiency systems that result in higher indirect impact over the equipment lifetime. Thus, the objective of this Collaborative Research and Development Agreement (CRADA) between

  17. ARTI Refrigerant Database

    Energy Technology Data Exchange (ETDEWEB)

    Cain, J.M. (Calm (James M.), Great Falls, VA (United States))

    1993-04-30

    The Refrigerant Database consolidates and facilitates access to information to assist industry in developing equipment using alternative refrigerants. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included. The database identifies sources of specific information on R-32, R-123, R-124, R-125, R-134, R-134a, R-141b, R-142b, R-143a, R-152a, R-245ca, R-290 (propane), R-717 (ammonia), ethers, and others as well as azeotropic and zeotropic blends of these fluids. It addresses lubricants including alkylbenzene, polyalkylene glycol, ester, and other synthetics as well as mineral oils. It also references documents addressing compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. Incomplete citations or abstracts are provided for some documents to accelerate availability of the information and will be completed or replaced in future updates.

  18. Cryogenic forced convection refrigerating system

    International Nuclear Information System (INIS)

    Klee, D.J.

    1988-01-01

    This patent describes the method of refrigerating products by contact with a refrigerating gas which comprises introducing product into a refrigeration zone, contacting the product with the refrigerating gas for a sufficient time to refrigerate it to the appropriate extent and removing the refrigerated product. The improvement for producing the refrigeration gas from a liquid cryogen such that essentially all of the liquid cryogen is fully vaporized before contacting the product comprises: (a) introducing the liquid cryogen, selected from the group consisting of liquid air and liquid nitrogen, at elevated pressure into an ejector as the motive fluid to accelerate a portion of a warm refrigerating gas through the ejector while mixing the cryogen and gas to effect complete vaporization of the liquid cryogen and substantial cooling of the portion of the refrigerating gas resulting in a cold discharge gas which is above the liquefaction temperature of the cryogen; (b) introducing the cold discharge gas into a forced circulation pathway of refrigerating gas and producing a cold refrigerating gas which contacts and refrigerates product and is then at least partially recirculated; (c) sensing the temperature of the refrigerating gas in the forced circulation pathway and controlling the introduction of liquid cryogen with regard to the sensed temperature to maintain the temperature of the discharge gas above the liquefacton temperature of the cryogen utilized

  19. On the reversed Brayton cycle with high speed machinery

    Energy Technology Data Exchange (ETDEWEB)

    Backman, J.

    1996-12-31

    This work was carried out in the laboratory of Fluid Dynamics, at Lappeenranta University of Technology during the years 1991-1996. The research was a part of larger high speed technology development research. First, there was the idea of making high speed machinery applications with the Brayton cycle. There was a clear need to deepen the knowledge of the cycle itself and to make a new approach in the field of the research. Also, the removal of water from the humid air seemed very interesting. The goal of this work was to study methods of designing high speed machinery for the reversed Brayton cycle, from theoretical principles to practical applications. The reversed Brayton cycle can be employed as an air dryer, a heat pump or a refrigerating machine. In this research the use of humid air as a working fluid has an environmental advantage, as well. A new calculation method for the Brayton cycle is developed. In this method especially the expansion process in the turbine is important because of the condensation of the water vapour in the humid air. This physical phenomena can have significant effects on the level of performance of the application. Also, the influence of calculating the process with actual, achievable process equipment efficiencies is essential for the development of future machinery. The above theoretical calculations are confirmed with two different laboratory prototypes. (53 refs.)

  20. On the reversed Brayton cycle with high speed machinery

    Energy Technology Data Exchange (ETDEWEB)

    Backman, J

    1997-12-31

    This work was carried out in the laboratory of Fluid Dynamics, at Lappeenranta University of Technology during the years 1991-1996. The research was a part of larger high speed technology development research. First, there was the idea of making high speed machinery applications with the Brayton cycle. There was a clear need to deepen the knowledge of the cycle itself and to make a new approach in the field of the research. Also, the removal of water from the humid air seemed very interesting. The goal of this work was to study methods of designing high speed machinery for the reversed Brayton cycle, from theoretical principles to practical applications. The reversed Brayton cycle can be employed as an air dryer, a heat pump or a refrigerating machine. In this research the use of humid air as a working fluid has an environmental advantage, as well. A new calculation method for the Brayton cycle is developed. In this method especially the expansion process in the turbine is important because of the condensation of the water vapour in the humid air. This physical phenomena can have significant effects on the level of performance of the application. Also, the influence of calculating the process with actual, achievable process equipment efficiencies is essential for the development of future machinery. The above theoretical calculations are confirmed with two different laboratory prototypes. (53 refs.)

  1. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  2. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  3. Indirect refrigeration systems with natural refrigerants

    DEFF Research Database (Denmark)

    Knudsen, Hans Jørgen Høgaard; Christensen, Kim Gardø; Jensen, Per Henrik

    1998-01-01

    Heat transfer for boiling and condensing carbon dioxide has been investigated.Heat transfer for carbon dioxide evaporating inside pipe has been measured and compared with Shah's correlation. The measured heat transfer coefficient is much higher than the value determined with the correlation.A shell......-and-tube heat exchanger with carbon dioxide on the shell side and flow ice inside the tubes has been used to investigate the heat transfer for condensing carbon dioxide.At leats is mentioned results obtained with a frozen food display case using carbone dioxide as refrigerant....

  4. ARTI Refrigerant Database

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1992-11-09

    The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air- conditioning and refrigeration equipment. The database identifies sources of specific information on R-32, R-123, R-124, R-125, R-134, R-134a, R-141b, R-142b, R-143a, R-152a, R-245ca, R-290 (propane), R- 717 (ammonia), ethers, and others as well as azeotropic and zeotropic and zeotropic blends of these fluids. It addresses lubricants including alkylbenzene, polyalkylene glycol, ester, and other synthetics as well as mineral oils. It also references documents on compatibility of refrigerants and lubricants with metals, plastics, elastomers, motor insulation, and other materials used in refrigerant circuits. A computerized version is available that includes retrieval software.

  5. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  6. Refrigeration a history

    CERN Document Server

    Gantz, Carroll

    2015-01-01

    For thousands of years, humans coped with heat by harvesting and storing natural ice and devising natural cooling systems that utilized ventilation and evaporation. By the mid 1800s, people began developing huge refrigeration machines to manufacture ice. By the early 1900s, engineers developed electric domestic refrigerators, which by 1927 were affordable convenient household appliances. By then, an increasingly sophisticated public demanded more modern-looking appliances than engineers could produce, and a new breed of designers entered the manufacturing world to provide them. During the Depr

  7. Refrigeration Playbook: Natural Refrigerants; Selecting and Designing Energy-Efficient Commercial Refrigeration Systems That Use Low Global Warming Potential Refrigerants

    Energy Technology Data Exchange (ETDEWEB)

    Nelson, Caleb [CTA Architects Engineers, Boise, ID (United States); Reis, Chuck [CTA Architects Engineers, Boise, ID (United States); Nelson, Eric [CTA Architects Engineers, Boise, ID (United States); Armer, James [CTA Architects Engineers, Boise, ID (United States); Arthur, Rob [CTA Architects Engineers, Boise, ID (United States); Heath, Richard [CTA Architects Engineers, Boise, ID (United States); Rono, James [CTA Architects Engineers, Boise, ID (United States); Hirsch, Adam [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Doebber, Ian [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2015-03-01

    This report provides guidance for selecting and designing energy efficient commercial refrigeration systems using low global warming potential refrigerants. Refrigeration systems are generally the largest energy end use in a supermarket type building, often accounting for more than half of a building's energy consumption.

  8. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  9. Portable refrigerant charge meter and method for determining the actual refrigerant charge in HVAC systems

    Science.gov (United States)

    Gao, Zhiming; Abdelaziz, Omar; LaClair, Tim L.

    2017-08-08

    A refrigerant charge meter and a method for determining the actual refrigerant charge in HVAC systems are described. The meter includes means for determining an optimum refrigerant charge from system subcooling and system component parameters. The meter also includes means for determining the ratio of the actual refrigerant charge to the optimum refrigerant charge. Finally, the meter includes means for determining the actual refrigerant charge from the optimum refrigerant charge and the ratio of the actual refrigerant charge to the optimum refrigerant charge.

  10. Solar Powered Refrigeration System

    Science.gov (United States)

    Ewert, Michael K. (Inventor); Bergeron, David J., III (Inventor)

    2002-01-01

    A solar powered vapor compression refrigeration system is made practicable with thermal storage and novel control techniques. In one embodiment, the refrigeration system includes a photovoltaic panel, a variable speed compressor, an insulated enclosure, and a thermal reservoir. The photovoltaic (PV) panel converts sunlight into DC (direct current) electrical power. The DC electrical power drives a compressor that circulates refrigerant through a vapor compression refrigeration loop to extract heat from the insulated enclosure. The thermal reservoir is situated inside the insulated enclosure and includes a phase change material. As heat is extracted from the insulated enclosure, the phase change material is frozen, and thereafter is able to act as a heat sink to maintain the temperature of the insulated enclosure in the absence of sunlight. The conversion of solar power into stored thermal energy is optimized by a compressor control method that effectively maximizes the compressor's usage of available energy. A capacitor is provided to smooth the power voltage and to provide additional current during compressor start-up. A controller monitors the rate of change of the smoothed power voltage to determine if the compressor is operating below or above the available power maximum, and adjusts the compressor speed accordingly. In this manner, the compressor operation is adjusted to convert substantially all available solar power into stored thermal energy.

  11. Helium refrigerator for 'SULTAN'

    International Nuclear Information System (INIS)

    Arpagaus, M.; Erlach, H.; Quack, H.

    1984-01-01

    The authors describe the helium refrigerator designed for the SULTAN test facility. SULTAN (Supraleiter-Testanlage) is intended to serve for the developments and testing of high field superconducting magnets. These magnets are needed mainly for future applications in nuclear fusion. (Auth.)

  12. Helium dilution refrigerator

    International Nuclear Information System (INIS)

    1973-01-01

    A new system of continuous heat exchange for a helium dilution refrigerator is proposed. The 3 He effluent tube is concurrent with the affluent mixed helium tube in a vertical downward direction. Heat exchange efficiency is enhanced by placing in series a number of elements with an enlarged surface area

  13. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  14. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  15. Technologies of 1.8 K / 2.4 kW helium refrigerators and cold compressors for LHC

    International Nuclear Information System (INIS)

    Saji, Nobuyoshi; Yoshinaga, Seiichirou; Asakura, Hiroshi; Shimba, Toru; Honda, Tadaaki; Mori, Mikio

    2005-01-01

    For the LHC (Large Hadron Collider) project of the CERN (Conseil Europeen pour la Recherche Nucleaire), the Swiss-Japanese consortium IHI/Linde Kryotechnik AG delivered a 1.8 K helium refrigeration system. Linde has produced many helium refrigeration systems and IHI has designed and manufactured cold compressors that utilize many advanced technologies and innovative ideas for turbo machinery. The compressor has the characteristics of the highest efficiency in the world. This paper describes the 1.8 K helium refrigeration system and performance test results at CERN. (author)

  16. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  17. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  18. Superfluid thermodynamic cycle refrigerator

    Science.gov (United States)

    Swift, Gregory W.; Kotsubo, Vincent Y.

    1992-01-01

    A cryogenic refrigerator cools a heat source by cyclically concentrating and diluting the amount of .sup.3 He in a single phase .sup.3 He-.sup.4 He solution. The .sup.3 He in superfluid .sup.4 He acts in a manner of an ideal gas in a vacuum. Thus, refrigeration is obtained using any conventional thermal cycle, but preferably a Stirling or Carnot cycle. A single phase solution of liquid .sup.3 He at an initial concentration in superfluid .sup.4 He is contained in a first variable volume connected to a second variable volume through a superleak device that enables free passage of .sup.4 He while restricting passage of .sup.3 He. The .sup.3 He is compressed (concentrated) and expanded (diluted) in a phased manner to carry out the selected thermal cycle to remove heat from the heat load for cooling below 1 K.

  19. Flammability Indices for Refrigerants

    Science.gov (United States)

    Kataoka, Osami

    This paper introduces a new index to classify flammable refrigerants. A question on flammability indices that ASHRAE employs arose from combustion test results of R152a and ammonia. Conventional methods of not only ASHRAE but also ISO and Japanese High-pressure gas safety law to classify the flammability of refrigerants are evaluated to show why these methods conflict with the test results. The key finding of this paper is that the ratio of stoichiometric concentration to LFL concentration (R factor) represents the test results most precisely. In addition, it has excellent correlation with other flammability parameters such as flame speed and pressure rise coefficient. Classification according to this index gives reasonable flammability order of substances including ammonia, R152a and carbon monoxide. Theoretical background why this index gives good correlation is also discussed as well as the insufficient part of this method.

  20. Quantum-Circuit Refrigerator

    Science.gov (United States)

    MöTtöNen, Mikko; Tan, Kuan Y.; Masuda, Shumpei; Partanen, Matti; Lake, Russell E.; Govenius, Joonas; Silveri, Matti; Grabert, Hermann

    Quantum technology holds great potential in providing revolutionizing practical applications. However, fast and precise cooling of the functional quantum degrees of freedom on demand remains a major challenge in many solid-state implementations, such as superconducting circuits. We demonstrate direct cooling of a superconducting resonator mode using voltage-controllable quantum tunneling of electrons in a nanoscale refrigerator. In our first experiments on this type of a quantum-circuit refrigerator, we measure the drop in the mode temperature by electron thermometry at a resistor which is coupled to the resonator mode through ohmic losses. To eliminate unwanted dissipation, we remove the probe resistor and directly observe the power spectrum of the resonator output in agreement with the so-called P(E) theory. We also demonstrate in microwave reflection experiments that the internal quality factor of the resonator can be tuned by orders of magnitude. In the future, our refrigerator can be integrated with different quantum electric devices, potentially enhancing their performance. For example, it may prove useful in the initialization of superconducting quantum bits and in dissipation-assisted quantum annealing. We acknowledge European Research Council Grant SINGLEOUT (278117) and QUESS (681311) for funding.

  1. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  2. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  3. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  4. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  5. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  6. Non azeotrope mixing refrigerating fluids condensation outside of an horizontal tubes stack; Condensation de melanges non azeotropes de fluides frigorigenes a l'exterieur d'un faisceau de tubes horizontaux

    Energy Technology Data Exchange (ETDEWEB)

    Signe, J.Ch.

    1999-04-16

    The development of non-azeotrope mixing, as regular refrigerating fluids substitute, calls in question the experience for the design of refrigerating and cooling machinery. Studies to better understand these fluids behaviour are necessary. The aim of this thesis is the knowledge enlargement on the pure fluids and non azeotrope mixing condensation, outside of a tubes stack, and to simulate the heat transfers. The tubes stack is a condenser, type TEMA X often used in refrigerating machinery. The binary mixing HFC 134a-HFC23, allows a large sliding scale. (A.L.B.)

  7. THERMODYNAMIC PROPERTIES OF SELECTED HFC REFRIGERANTS

    Science.gov (United States)

    Hydrofluorocarbon (HFC) refrigerants are possible alternatives to replace ozone-depleting chlorofluorocarbon and hydrochlorofluorocarbon (HCFC) refrigerants. The flammability of a proposed new refrigerant is a major consideration in assessing its utility for a particular applicat...

  8. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  9. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  10. Strategies for Improving Enterprise Standardization Management of Tropical Crop Machinery

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    @@ There are two categories of tropical crop machinery. One comprises operation machinery that is used for planting, managing and harvesting tropical crops, while the other comprises process machinery for processing tropical crops. Tropical crop machinery is distinguished from other agricultural machinery by the special crops that such machinery cultivates and processes.

  11. Fermilab tevatron five refrigerator system tests

    International Nuclear Information System (INIS)

    Rode, C.; Ferry, R.; Leiniger, M.; Makara, J.; Misek, J.; Mizicko, D.; Richied, D.; Theilacker, J.

    1982-01-01

    The Fermilab Tevatron refrigeration system is described with the layout illustrated. The compressor control loops, the refrigerator control loops, and magnet control loops (two per refrigerator) are described and each illustrated. The mobile purifier is described. A five refrigerator test is presented, using two compressor buildings, satellite refrigerator concept test and the test current to the writing. The configuration of the five refrigerator test is diagramed

  12. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  13. Energy optimisation of domestic refrigerators

    DEFF Research Database (Denmark)

    Jakobsen, Arne; Rasmussen, Bjarne D.

    1998-01-01

    This paper describes the main results of a research project with the objective of reducing the energy consumption of domestic refrigerators by increasing the efficiency of the refrigeration system. The improvement of the system efficiency was to be obtained by:1) Introducing continuous operation ...

  14. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  15. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  16. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  17. Regulating Power from Supermarket Refrigeration

    DEFF Research Database (Denmark)

    O'Connell, Niamh; Madsen, Henrik; Pinson, Pierre

    2014-01-01

    the Danfoss refrigeration test centre. The complexities of modelling demand response are demonstrated through simulation. Simulations are conducted by placing the identified model in a direct-control demand response architecture, with power reference tracking using model predictive control. The energylimited......This paper presents an analysis of the demand response capabilities of a supermarket refrigeration system, with a particular focus on the suitability for participation in the regulating power market. An ARMAX model of a supermarket refrigeration system is identified using experimental data from...... nature of demand response from refrigeration is identified as the key consideration when considering participation in the regulating power market. It is demonstrated that by restricting the operating regions of the supermarket refrigeration system, a simple relationship can be found between the available...

  18. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  19. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  20. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  1. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  2. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  3. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  4. Performance of an auto refrigerant cascade refrigerator operating in gas refrigerant supply (GRS) mode with nitrogen-hydrocarbon and argon-hydrocarbon refrigerants

    Science.gov (United States)

    Gurudath Nayak, H.; Venkatarathnam, G.

    2009-07-01

    There is a worldwide interest in the development of auto refrigerant cascade (ARC) refrigerators operating with refrigerant mixtures. Both flammable and non-flammable refrigerant mixtures can be used in these systems. The performance of an ARC system with optimum nitrogen-hydrocarbon and argon-hydrocarbon mixtures between 90 and 160 K is presented in this paper.

  5. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  6. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  7. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  8. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  9. Thermoacoustic refrigerator for space applications

    Science.gov (United States)

    Garrett, Steven L.; Adeff, Jay A.; Hofler, Thomas J.

    1993-10-01

    A new spacecraft cryocooler which uses resonant high-amplitude sound waves in inert gases to pump heat is described. The phasing of the thermoacoustic cycle is provided by thermal conduction. This 'natural' phasing allows the entire refrigerator to operate with only one moving part (the loudspeaker diaphragm). A space-qualified thermoacoustic refrigerator was flown on the Space Shuttle Discovery (STS-42) in January, 1992. It was entirely autonomous, had no sliding seals, required no lubrication, used mostly low-tolerance machined parts, and contained no expensive components. Thermoacoustics is shown to be a competitive candidate for food refrigerator/freezers and commercial/residential air conditioners. The design and performance of the Space Thermo/Acoustic Refrigerator (STAR) is described.

  10. Magnetic refrigeration apparatus and method

    Science.gov (United States)

    Barclay, John A.; Overton, Jr., William C.; Stewart, Walter F.

    1984-01-01

    The disclosure relates to refrigeration through magnetizing and demagnitizing a body by rotating it within a magnetic field. Internal and external heat exchange fluids and in one embodiment, a regenerator, are used.

  11. ENERGY STAR Certified Residential Refrigerators

    Data.gov (United States)

    U.S. Environmental Protection Agency — Certified models meet all ENERGY STAR requirements as listed in the Version 5.0 ENERGY STAR Program Requirements for Residential Refrigerators and Freezers that are...

  12. Refrigeration plants for the SSCL

    International Nuclear Information System (INIS)

    McAshan, M.; Ganni, V.; Than, R.; Niehaus, T.

    1991-03-01

    The basic requirements and operating features of the collider cryogenic system have already been described in other publications. The general arrangement of the refrigeration plant and its subsystems is presented, and the issue of how to provide redundancy in the cryogenic system is addressed, and some of the basic features of the refrigeration plants are described. The collider cryogenic system design is not final yet, and this report only reflects the direction and current status of the cryogenic system design

  13. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  14. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  15. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  16. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  17. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  18. Refrigeration waste heat recovery

    Energy Technology Data Exchange (ETDEWEB)

    1983-03-01

    UK Super A Stores was built in 1972 and is part of a small indoor shopping complex linked together by a heated mall. The store has a public floor area of approximately 1,232 m{sup 2} (13,261 ft.{sup 2}) and sells the usual variety of food produce including a large selection of frozen foods. There are five lengths of refrigerated display cabinets with a total area of approximately 78 m{sup 2}. There are also some frozen food storage rooms at the back of the store. This report provides a description of a waste heat recovery system within a medium sized food store. It details how the waste heat that is produced by the conventional frozen food display cabinets, can be reused by the store's space heating system. Recommended uses for this waste heat include: diverting to the loading bays which would make the reheat coil unnecessary, diverting to the front of the shop, and heating the adjacent shopping mall. The CREDA (Conservation and Renewable Energy Demonstration Assistance) program contributed $17,444 towards the total project cost of $30,444. The project was initiated by the store owner, who is now realizing a lower annual fuel consumption, with the resulting financial savings. 11 figs., 1 tab.

  19. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  20. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  1. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  2. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  3. Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Devender,; Ramanath, Ganpati, E-mail: Ramanath@rpi.edu [Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States); Lofgreen, Kelly; Devasenathipathy, Shankar; Swan, Johanna; Mahajan, Ravi [Intel Corporation, Assembly Test and Technology Development, Chandler, Arizona 85226 (United States); Borca-Tasciuc, Theodorian [Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York 12180 (United States)

    2015-11-15

    Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides metallized with bilayers of Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5} solder and Ni barrier exhibit tenfold higher interfacial thermal conductance Γ{sub c} than that obtained with In/Ni bilayer metallization. X-ray diffraction and x-ray spectroscopy indicate that reduced interdiffusion and diminution of interfacial SnTe formation due to Ni layer correlates with the higher Γ{sub c}. Finite element modeling of thermoelectric coolers metallized with Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5}/Ni bilayers presages a temperature drop ΔT ∼ 22 K that is 40% higher than that obtained with In/Ni metallization. Our results underscore the importance of controlling chemical intermixing at solder–metal–thermoelectric interfaces to increase the effective figure of merit, and hence, the thermoelectric cooling efficiency. These findings should facilitate the design and development of lead-free metallization for pnictogen chalcogenide-based thermoelectrics.

  4. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  5. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  6. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  7. Radiation technologies in metallurgy and machinery

    International Nuclear Information System (INIS)

    Meshkov, I.N.

    1990-01-01

    Applications of electron beam accelerators for technologies in metallurgy and machinery are discussed. Processes described are provided with special industrial accelerators, developed in the Institute of Nuclear Physics, Novosibirsk. (author)

  8. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  9. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  10. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  11. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  12. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  13. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  14. Krypton based adsorption type cryogenic refrigerator

    Science.gov (United States)

    Jones, Jack A. (Inventor); Schember, Helene R. (Inventor)

    1989-01-01

    Krypton and a monolithic porous carbon such as Saran carbon are used respectively as the sorbate and sorbent of an adsorption type refrigerator to improve refrigeration efficiency and operational longevity.

  15. REDUCING REFRIGERANT EMISSIONS FROM SUPERMARKET SYSTEMS

    Science.gov (United States)

    Large refrigeration systems are found in several applications including supermarkets, cold storage warehouses, and industrial processes. The sizes of these systems are a contributing factor to their problems of high refrigerant leak rates because of the thousands of connections, ...

  16. Thermoelectric refrigerator having improved temperature stabilization means

    International Nuclear Information System (INIS)

    Falco, C.M.

    1982-01-01

    A control system for thermoelectric refrigerators is disclosed. The thermoelectric refrigerator includes at least one thermoelectric element that undergoes a first order change at a predetermined critical temperature. The element functions as a thermoelectric refrigerator element above the critical temperature, but discontinuously ceases to function as a thermoelectric refrigerator element below the critical temperature. One example of such an arrangement includes thermoelectric refrigerator elements which are superconductors. The transition temperature of one of the superconductor elements is selected as the temperature control point of the refrigerator. When the refrigerator attempts to cool below the point, the metals become superconductors losing their ability to perform as a thermoelectric refrigerator. An extremely accurate, first-order control is realized

  17. Load forecasting for supermarket refrigeration

    DEFF Research Database (Denmark)

    Bacher, Peder; Madsen, Henrik; Aalborg Nielsen, Henrik

    This report presents a study of models for forecasting the load for supermarket refrigeration. The data used for building the forecasting models consists of load measurements, local climate measurements and weather forecasts. The load measurements are from a supermarket located in a village...... in Denmark. The load for refrigeration is the sum of all cabinets in the supermarket, both low and medium temperature cabinets, and spans a period of one year. As input to the forecasting models the ambient temperature observed near the supermarket together with weather forecasts are used. Every hour...

  18. Refrigeration Cycle Design for Refrigerant Mixtures by Molecular Simulation

    Czech Academy of Sciences Publication Activity Database

    Smith, W.R.; Francová, Magda; Kowalski, M.; Nezbeda, Ivo

    2010-01-01

    Roč. 75, č. 4 (2010), s. 383-391 ISSN 0010-0765 R&D Projects: GA AV ČR IAA400720710 Grant - others:NSERC(CA) OGP1041 Institutional research plan: CEZ:AV0Z40720504 Keywords : refrigerants * molecular simulation s * vapor–liquid equilibrium Subject RIV: CF - Physical ; Theoretical Chemistry Impact factor: 0.853, year: 2010

  19. 46 CFR 154.702 - Refrigerated carriage.

    Science.gov (United States)

    2010-10-01

    ... Pressure and Temperature Control § 154.702 Refrigerated carriage. (a) Each refrigeration system must: (1) Have enough capacity to maintain the cargo vapor pressure in each cargo tank served by the system below... the purpose of this section, a “refrigeration unit” includes a compressor and its motors and controls...

  20. 49 CFR 173.174 - Refrigerating machines.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Refrigerating machines. 173.174 Section 173.174 Transportation Other Regulations Relating to Transportation PIPELINE AND HAZARDOUS MATERIALS SAFETY... Refrigerating machines. A refrigerating machine assembled for shipment and containing 7 kg (15 pounds) or less...

  1. Solar Refrigerators Store Life-Saving Vaccines

    Science.gov (United States)

    2014-01-01

    Former Johnson Space Center engineer David Bergeron used his experience on the Advanced Refrigeration Technology Team to found SunDanzer Refrigeration Inc., a company specializing in solar-powered refrigerators. The company has created a battery-free unit that provides safe storage for vaccines in rural and remote areas around the world.

  2. 46 CFR 58.01-50 - Machinery space, noise.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Machinery space, noise. 58.01-50 Section 58.01-50... MACHINERY AND RELATED SYSTEMS General Requirements § 58.01-50 Machinery space, noise. (a) Each machinery space must be designed to minimize the exposure of personnel to noise in accordance with IMO A.468(XII...

  3. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  4. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  5. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  6. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  7. High Efficiency, Low Emission Refrigeration System

    Energy Technology Data Exchange (ETDEWEB)

    Fricke, Brian A [ORNL; Sharma, Vishaldeep [ORNL

    2016-08-01

    Supermarket refrigeration systems account for approximately 50% of supermarket energy use, placing this class of equipment among the highest energy consumers in the commercial building domain. In addition, the commonly used refrigeration system in supermarket applications is the multiplex direct expansion (DX) system, which is prone to refrigerant leaks due to its long lengths of refrigerant piping. This leakage reduces the efficiency of the system and increases the impact of the system on the environment. The high Global Warming Potential (GWP) of the hydrofluorocarbon (HFC) refrigerants commonly used in these systems, coupled with the large refrigerant charge and the high refrigerant leakage rates leads to significant direct emissions of greenhouse gases into the atmosphere. Methods for reducing refrigerant leakage and energy consumption are available, but underutilized. Further work needs to be done to reduce costs of advanced system designs to improve market utilization. In addition, refrigeration system retrofits that result in reduced energy consumption are needed since the majority of applications address retrofits rather than new stores. The retrofit market is also of most concern since it involves large-volume refrigerant systems with high leak rates. Finally, alternative refrigerants for new and retrofit applications are needed to reduce emissions and reduce the impact on the environment. The objective of this Collaborative Research and Development Agreement (CRADA) between the Oak Ridge National Laboratory and Hill Phoenix is to develop a supermarket refrigeration system that reduces greenhouse gas emissions and has 25 to 30 percent lower energy consumption than existing systems. The outcomes of this project will include the design of a low emission, high efficiency commercial refrigeration system suitable for use in current U.S. supermarkets. In addition, a prototype low emission, high efficiency supermarket refrigeration system will be produced for

  8. Solar-Powered Refrigeration System

    Science.gov (United States)

    Ewert, Michael K. (Inventor); Bergeron, David J., III (Inventor)

    2002-01-01

    A solar powered vapor compression refrigeration system is made practicable with thermal storage and novel control techniques. In one embodiment, the refrigeration system includes a photovoltaic panel, a variable speed compressor, an insulated enclosure, and a thermal reservoir. The photovoltaic (PV) panel converts sunlight into DC (direct current) electrical power. The DC electrical power drives a compressor that circulates refrigerant through a vapor compression refrigeration loop to extract heat from the insulated enclosure. The thermal reservoir is situated inside the insulated enclosure and includes a phase change material. As heat is extracted from the insulated enclosure, the phase change material is frozen, and thereafter is able to act as a heat sink to maintain the temperature of the insulated enclosure in the absence of sunlight. The conversion of solar power into stored thermal energy is optimized by a compressor control method that effectively maximizes the compressor's usage of available energy. A capacitor is provided to smooth the power voltage and to provide additional current during compressor start-up. A controller monitors the rate of change of the smoothed power voltage to determine if the compressor is operating below or above the available power maximum, and adjusts the compressor speed accordingly. In this manner, the compressor operation is adjusted to convert substantially all available solar power into stored thermal energy.

  9. Magnetic refrigerator for hydrogen liquefaction

    Energy Technology Data Exchange (ETDEWEB)

    Numazawa, T [National Institute for Materials Science, Tsukuba (Japan); Kamlya, K. [Japan Atomic Energy Agency, Naka (Japan); Utaki, T. [Osaka University, Osaka (Japan); Matsumoto, K. [Kanazawa University, Kanazawa (Japan)

    2013-06-15

    This paper reviews the development status of magnetic refrigeration system for hydrogen liquefaction. There is no doubt that hydrogen is one of most important energy sources in the near future. In particular, liquid hydrogen can be utilized for infrastructure construction consisting of storage and transportation. Liquid hydrogen is in cryogenic temperatures and therefore high efficient liquefaction method must be studied. Magnetic refrigeration which uses the magneto-caloric effect has potential to realize not only the higher liquefaction efficiency > 50 %, but also to be environmentally friendly and cost effective. Our hydrogen magnetic refrigeration system consists of Carnot cycle for liquefaction stage and AMR (active magnetic regenerator) cycle for precooling stages. For the Carnot cycle, we develop the high efficient system > 80 % liquefaction efficiency by using the heat pipe. For the AMR cycle, we studied two kinds of displacer systems, which transferred the working fluid. We confirmed the AMR effect with the cooling temperature span of 12 K for 1.8 T of the magnetic field and 6 second of the cycle. By using the simulation, we estimate the total efficiency of the hydrogen liquefaction plant for 10 kg/day. A FOM of 0.47 is obtained in the magnetic refrigeration system operation temperature between 20 K and 77 K including LN2 work input.

  10. Stability of split Stirling refrigerators

    NARCIS (Netherlands)

    Waele, de A.T.A.M.; Liang, W.

    2009-01-01

    In many thermal systems spontaneous mechanical oscillations are generated under the influence of large temperature gradients. Well-known examples are Taconis oscillations in liquid-helium cryostats and oscillations in thermoacoustic systems. In split Stirling refrigerators the compressor and the

  11. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  12. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  13. Control of the Tevatron Satellite Refrigeration system

    International Nuclear Information System (INIS)

    Theilacker, J.; Chapman, L.; Gannon, J.; Hentges, M.; Martin, M.; Rode, C.H.; Zagel, J.

    1984-01-01

    This chapter describes a computerized control system for 24 satellite refrigerators which cool a six kilometer ring of superconducting magnets. The control system consists of 31 independent microprocessors operating over 400 servo loops, and a central computer system which provides monitoring, alarms, logging and changing of parameters. Topics considered include pressure measurement, flow measurement, temperature measurement, gas analysis, control valves, expansion engine controllers, and control loops. Each refrigerator has 12 active microprocessor based control loops which tune the refrigerator to one of its four operating modes: satellite, liquefier, refrigerator, and stand-by. It is suggested that optimizing the refrigerator control loops and quench recovery scheme will minimize the accelerator down time

  14. Efficiency improvement of commercial refrigeration systems

    Energy Technology Data Exchange (ETDEWEB)

    Denecke, Julius [NTNU, Trondheim (Norway); Hafner, Armin [SINTEF Energy Research, Trondheim (Norway)

    2011-07-01

    This work presents a historical review of carbon dioxide refrigeration systems. Further a literature survey is carried out to get a status of existing refrigeration technology related to supermarkets. In the next step various energy saving options are stated. A heat recovery model, basing on a R744 booster refrigeration system is established and described. Simplified demand curves for refrigeration, air conditioning and heating will base this model to calculate different heat recovery layouts. Supermarket future trends will be considered and integrated in the calculation. Finally the calculated energy consumptions will be compared with real energy consumptions of selected supermarket refrigeration systems.

  15. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  16. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  17. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  18. Evaluation of the risks linked with natural refrigerating fluids; Evaluation des risques lies aux fluides frigorigenes naturels

    Energy Technology Data Exchange (ETDEWEB)

    Guilpart, J. [Centre National Machiniste Agricole du Genie Rural des Eaux et des Forets, (Cemagref), 35 - Rennes (France). Div. Genie des Procedes Frigorifiques

    1999-07-01

    Because of their environmental impact, halogenated refrigerants are more and more replaced by `natural` refrigerants in vapor compression cycle refrigerating machineries. However, technological risks exist with these substitution fluids due to their flammability, explosibility or toxicity. Major risks can be encountered at the industrial scale and thanks to experience feedback and to several studies, a rigorous approach was settled and included in the legislative texts relative to classified installations and environment protection. Risks also exist at the scale of refrigerating installations with the use of hydrocarbon and ammonia refrigerants. This paper presents an evaluation of risks both at the industrial and at the installation scale: 1 - definition and approach of industrial risks: scenarios of major industrial accidents (boiling liquid expanding vapor explosion (BLEVE), unconfined vapor cloud explosion (UVCE), toxic gases emission); evaluation of accident effects (thermal, mechanical, noxious); 2 - calculation methods applicable to industrial installations: thermal effects (radiation intensity, exposure duration, mass of flammable product involved in the phenomenon), mechanical effects (TNT equivalent method, rupture of pressurized reservoirs), noxious effects (leaks, atmospheric dispersion); 3 - application to refrigerating installations: case of hydrocarbons (dimensioning scenarios and simplified formulae, admissible scenarios), case of ammonia. (J.S.) 20 refs.

  19. Overall performance of the duplex Stirling refrigerator

    International Nuclear Information System (INIS)

    Erbay, L. Berrin; Ozturk, M. Mete; Doğan, Bahadır

    2017-01-01

    Highlights: • Overall performance coefficient of duplex Stirling refrigerator was investigated. • A definite region for the coefficient of performance of the refrigerator in duplex Stirling is identified. • A definite region for the thermal efficiency of the heat engine in duplex Stirling is identified. • Benchmark values and design bounds of the duplex Stirling refrigerator were obtained. - Abstract: The duplex Stirling refrigerator is an integrated refrigerator consists of Stirling cycle engine and Stirling cycle refrigerator used for cooling. The equality of the work generation of the heat engine to the work consumption of the refrigerator is the primary constraint of the duplex Stirling. The duplex Stirling refrigerator is investigated thermodynamically by considering the effects of constructional and operational parameters which are namely the temperature ratios for heat engine and refrigerator, and the compression ratios for both sides. The primary concern is given to the parametric effects on the overall coefficient of performance of the duplex Stirling refrigerator. The given diagrams provide a design bounds and benchmark results that allows seeing the big picture about the cooling load and heat input relation. Moreover they ease to determine the corresponding work rate to the target cooling load. As regard to the obtained results, a definite region for coefficient of performance of the refrigerator and a definite region for the thermal efficiency of the heat engine of the duplex Stirling are identified.

  20. Environment-friendly refrigeration - Switzerland moves forward

    International Nuclear Information System (INIS)

    Stohler, F.

    2003-01-01

    This article presents an interview with Silvan Schaller, president of the Swiss Refrigeration Society SVK and head of a leading Swiss industrial refrigeration company, on the subject of the implementation of new Swiss materials legislation that regulates the use of various refrigerants. In particular, the co-operation between the Society and the regulatory authorities is stressed. The reasons behind the regulations - the protection of the environment and, in particular, the ozone layer - are discussed as are the efforts required by industry to meet them. Future refrigeration technologies and the choice of refrigerants are examined. Measures that will have to be taken by the companies in the refrigeration sector, such as the additional training of personnel and the monitoring of the disposal of wastes, are examined. For the future, the goal of reducing the energy consumption of refrigeration installations is noted

  1. Magnon-driven quantum dot refrigerators

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Yuan; Huang, Chuankun; Liao, Tianjun; Chen, Jincan, E-mail: jcchen@xmu.edu.cn

    2015-12-18

    Highlights: • A three-terminal quantum dot refrigerator is proposed. • The effects of magnetic field, applied voltage, and polarization are considered. • The region that the system can work as a refrigerator is determined. • Two different magnon-driven quantum dot refrigerators are compared. - Abstract: A new model of refrigerator consisting of a spin-splitting quantum dot coupled with two ferromagnetic reservoirs and a ferromagnetic insulator is proposed. The rate equation is used to calculate the occupation probabilities of the quantum dot. The expressions of the electron and magnon currents are obtained. The region that the system can work in as a refrigerator is determined. The cooling power and coefficient of performance (COP) of the refrigerator are derived. The influences of the magnetic field, applied voltage, and polarization of two leads on the performance are discussed. The performances of two different magnon-driven quantum dot refrigerators are compared.

  2. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  3. Machinery condition monitoring principles and practices

    CERN Document Server

    Mohanty, Amiya Ranjan

    2015-01-01

    Find the Fault in the MachinesDrawing on the author's more than two decades of experience with machinery condition monitoring and consulting for industries in India and abroad, Machinery Condition Monitoring: Principles and Practices introduces the practicing engineer to the techniques used to effectively detect and diagnose faults in machines. Providing the working principle behind the instruments, the important elements of machines as well as the technique to understand their conditions, this text presents every available method of machine fault detection occurring in machines in general, an

  4. When are solar refrigerators less costly than on-grid refrigerators: A simulation modeling study.

    Science.gov (United States)

    Haidari, Leila A; Brown, Shawn T; Wedlock, Patrick; Connor, Diana L; Spiker, Marie; Lee, Bruce Y

    2017-04-19

    Gavi recommends solar refrigerators for vaccine storage in areas with less than eight hours of electricity per day, and WHO guidelines are more conservative. The question remains: Can solar refrigerators provide value where electrical outages are less frequent? Using a HERMES-generated computational model of the Mozambique routine immunization supply chain, we simulated the use of solar versus electric mains-powered refrigerators (hereafter referred to as "electric refrigerators") at different locations in the supply chain under various circumstances. At their current price premium, the annual cost of each solar refrigerator is 132% more than each electric refrigerator at the district level and 241% more at health facilities. Solar refrigerators provided savings over electric refrigerators when one-day electrical outages occurred more than five times per year at either the district level or the health facilities, even when the electric refrigerator holdover time exceeded the duration of the outage. Two-day outages occurring more than three times per year at the district level or more than twice per year at the health facilities also caused solar refrigerators to be cost saving. Lowering the annual cost of a solar refrigerator to 75% more than an electric refrigerator allowed solar refrigerators to be cost saving at either level when one-day outages occurred more than once per year, or when two-day outages occurred more than once per year at the district level or even once per year at the health facilities. Our study supports WHO and Gavi guidelines. In fact, solar refrigerators may provide savings in total cost per dose administered over electrical refrigerators when electrical outages are less frequent. Our study identified the frequency and duration at which electrical outages need to occur for solar refrigerators to provide savings in total cost per dose administered over electric refrigerators at different solar refrigerator prices. Copyright © 2017. Published

  5. 5-year operation experience with the 1.8 K refrigeration units of the LHC cryogenic system

    CERN Document Server

    Ferlin, G; Claudet, S; Pezzetti, M

    2015-01-01

    Since 2009, the Large Hadron Collider (LHC) is in operation at CERN. The LHC superconducting magnets distributed over eight sectors of 3.3-km long are cooled at 1.9 K in pressurized superfluid helium. The nominal operating temperature of 1.9 K is produced by eight 1.8-K refrigeration units based on centrifugal cold compressors (3 or 4 stages depending to the vendor) combined with warm volumetric screw compressors with sub-atmospheric suction. After about 5 years of continuous operation, we will present the results concerning the availability for the final user of these refrigeration units and the impact of the design choice on the recovery time after a system trip. We will also present the individual results for each rotating machinery in terms of failure origin and of Mean Time between Failure (MTBF), as well as the consolidations and upgrades applied to these refrigeration units.

  6. 5-year operation experience with the 1.8 K refrigeration units of the LHC cryogenic system

    Science.gov (United States)

    Ferlin, G.; Tavian, L.; Claudet, S.; Pezzetti, M.

    2015-12-01

    Since 2009, the Large Hadron Collider (LHC) is in operation at CERN. The LHC superconducting magnets distributed over eight sectors of 3.3-km long are cooled at 1.9 K in pressurized superfluid helium. The nominal operating temperature of 1.9 K is produced by eight 1.8-K refrigeration units based on centrifugal cold compressors (3 or 4 stages depending to the vendor) combined with warm volumetric screw compressors with sub-atmospheric suction. After about 5 years of continuous operation, we will present the results concerning the availability for the final user of these refrigeration units and the impact of the design choice on the recovery time after a system trip. We will also present the individual results for each rotating machinery in terms of failure origin and of Mean Time between Failure (MTBF), as well as the consolidations and upgrades applied to these refrigeration units.

  7. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  8. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  9. CCPIT Machinery Exhibition Succeeded in Kuala Lumpur

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    @@ From August 18 to 20, 2005, China Council for the Promotion of International Trade(CCPIT) held China Machinery and Electronics Trade Exhibition, CME 2005 in Kuala Lumpur, the capital of Malaysia on behalf of China, a good job has been done.

  10. CCPIT Machinery Exhibition Succeeded in Kuala Lumpur

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

      From August 18 to 20, 2005, China Council for the Promotion of International Trade(CCPIT) held China Machinery and Electronics Trade Exhibition, CME 2005 in Kuala Lumpur, the capital of Malaysia on behalf of China, a good job has been done.……

  11. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  12. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  13. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  14. CO2 as a refrigerant

    CERN Document Server

    2014-01-01

    A first edition, the IIR guide “CO2 as a Refrigerant” highlights the application of carbon dioxide in supermarkets, industrial freezers, refrigerated transport, and cold stores as well as ice rinks, chillers, air conditioning systems, data centers and heat pumps. This guide is for design and development engineers needing instruction and inspiration as well as non-technical experts seeking background information on a specific topic. Written by Dr A.B. Pearson, a well-known expert in the field who has considerable experience in the use of CO2 as a refrigerant. Main topics: Thermophysical properties of CO2 – Exposure to CO2, safety precautions – CO2 Plant Design – CO2 applications – Future prospects – Standards and regulations – Bibliography.

  15. A compact rotating dilution refrigerator

    Science.gov (United States)

    Fear, M. J.; Walmsley, P. M.; Chorlton, D. A.; Zmeev, D. E.; Gillott, S. J.; Sellers, M. C.; Richardson, P. P.; Agrawal, H.; Batey, G.; Golov, A. I.

    2013-10-01

    We describe the design and performance of a new rotating dilution refrigerator that will primarily be used for investigating the dynamics of quantized vortices in superfluid 4He. All equipment required to operate the refrigerator and perform experimental measurements is mounted on two synchronously driven, but mechanically decoupled, rotating carousels. The design allows for relative simplicity of operation and maintenance and occupies a minimal amount of space in the laboratory. Only two connections between the laboratory and rotating frames are required for the transmission of electrical power and helium gas recovery. Measurements on the stability of rotation show that rotation is smooth to around 10-3 rad s-1 up to angular velocities in excess of 2.5 rad s-1. The behavior of a high-Q mechanical resonator during rapid changes in rotation has also been investigated.

  16. When are solar refrigerators less costly than on-grid refrigerators: A simulation modeling study☆

    Science.gov (United States)

    Haidari, Leila A.; Brown, Shawn T.; Wedlock, Patrick; Connor, Diana L.; Spiker, Marie; Lee, Bruce Y.

    2017-01-01

    Background Gavi recommends solar refrigerators for vaccine storage in areas with less than eight hours of electricity per day, and WHO guidelines are more conservative. The question remains: Can solar refrigerators provide value where electrical outages are less frequent? Methods Using a HERMES-generated computational model of the Mozambique routine immunization supply chain, we simulated the use of solar versus electric mains-powered refrigerators (hereafter referred to as “electric refrigerators”) at different locations in the supply chain under various circumstances. Results At their current price premium, the annual cost of each solar refrigerator is 132% more than each electric refrigerator at the district level and 241% more at health facilities. Solar refrigerators provided savings over electric refrigerators when one-day electrical outages occurred more than five times per year at either the district level or the health facilities, even when the electric refrigerator holdover time exceeded the duration of the outage. Two-day outages occurring more than three times per year at the district level or more than twice per year at the health facilities also caused solar refrigerators to be cost saving. Lowering the annual cost of a solar refrigerator to 75% more than an electric refrigerator allowed solar refrigerators to be cost saving at either level when one-day outages occurred more than once per year, or when two-day outages occurred more than once per year at the district level or even once per year at the health facilities. Conclusion Our study supports WHO and Gavi guidelines. In fact, solar refrigerators may provide savings in total cost per dose administered over electrical refrigerators when electrical outages are less frequent. Our study identified the frequency and duration at which electrical outages need to occur for solar refrigerators to provide savings in total cost per dose administered over electric refrigerators at different solar

  17. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  18. Optimization design of turbo-expander gas bearing for a 500W helium refrigerator

    Science.gov (United States)

    Li, S. S.; Fu, B.; Y Zhang, Q.

    2017-12-01

    Turbo-expander is the core machinery of the helium refrigerator. Bearing as the supporting element is the core technology to impact the design of turbo-expander. The perfect design and performance study for the gas bearing are essential to ensure the stability of turbo-expander. In this paper, numerical simulation is used to analyze the performance of gas bearing for a 500W helium refrigerator turbine, and the optimization design of the gas bearing has been completed. And the results of the gas bearing optimization have a guiding role in the processing technology. Finally, the turbine experiments verify that the gas bearing has good performance, and ensure the stable operation of the turbine.

  19. Thermal flow regulator of refrigerant

    International Nuclear Information System (INIS)

    Dubinskij, S.I.; Savchenko, A.G.; Suplin, V.Z.

    1988-01-01

    A thermal flow regulator of refrigerant for helium flow-type temperature-controlled cryostats based on controlling the channel hydraulic resistance due to variation of the flow density and viscosity during liquid helium transformation into the gaseous state. Behind the regulator both two-phase flow and a heated gas can be produced. The regulator resolution is (7-15)x10 -4 l/mW of liquid helium

  20. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  1. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  2. Cryogen-free dilution refrigerators

    International Nuclear Information System (INIS)

    Uhlig, K

    2012-01-01

    We review briefly our first cryogen-free dilution refrigerator (CF-DR) which was precooled by a GM cryocooler. We then show how today's dry DRs with pulse tube precooling have developed. A few examples of commercial DRs are explained and noteworthy features pointed out. Thereby we describe the general advantages of cryogen-free DRs, but also show where improvements are still desirable. At present, our dry DR has a base temperature of 10 mK and a cooling capacity of 700 μW at a mixing chamber temperature of 100 mK. In our cryostat, in most recent work, an additional refrigeration loop was added to the dilution circuit. This 4 He circuit has a lowest temperature of about 1 K and a refrigeration capacity of up to 100 mW at temperatures slightly above 1 K; the dilution circuit and the 4 He circuit can be run separately or together. The purpose of this additional loop is to increase the cooling capacity for experiments where the cooling power of the still of the DR is not sufficient to cool cold amplifiers and cables, e.g. in studies on superconducting quantum circuits or astrophysical applications.

  3. Cryogen-free dilution refrigerators

    Science.gov (United States)

    Uhlig, K.

    2012-12-01

    We review briefly our first cryogen-free dilution refrigerator (CF-DR) which was precooled by a GM cryocooler. We then show how today's dry DRs with pulse tube precooling have developed. A few examples of commercial DRs are explained and noteworthy features pointed out. Thereby we describe the general advantages of cryogen-free DRs, but also show where improvements are still desirable. At present, our dry DR has a base temperature of 10 mK and a cooling capacity of 700 μW at a mixing chamber temperature of 100 mK. In our cryostat, in most recent work, an additional refrigeration loop was added to the dilution circuit. This 4He circuit has a lowest temperature of about 1 K and a refrigeration capacity of up to 100 mW at temperatures slightly above 1 K; the dilution circuit and the 4He circuit can be run separately or together. The purpose of this additional loop is to increase the cooling capacity for experiments where the cooling power of the still of the DR is not sufficient to cool cold amplifiers and cables, e.g. in studies on superconducting quantum circuits or astrophysical applications.

  4. Superconducting tunnel-junction refrigerator

    International Nuclear Information System (INIS)

    Melton, R.G.; Paterson, J.L.; Kaplan, S.B.

    1980-01-01

    The dc current through an S 1 -S 2 tunnel junction, with Δ 2 greater than Δ 1 , when biased with eV 1 +Δ 2 , will lower the energy in S 1 . This energy reduction will be shared by the phonons and electrons. This device is shown to be analogous to a thermoelectric refrigerator with an effective Peltier coefficient π* approx. Δ 1 /e. Tunneling calculations yield the cooling power P/sub c/, the electrical power P/sub e/ supplied by the bias supply, and the cooling efficiency eta=P/sub c//P/sub e/. The maximum cooling power is obtained for eV= +- (Δ 2 -Δ 1 ) and t 1 =T 1 /T/sub c/1 approx. 0.9. Estimates are made of the temperature difference T 2 -T 1 achievable in Al-Pb and Sn-Pb junctions with an Al 2 O 3 tunneling barrier. The performance of this device is shown to yield a maximum cooling efficiency eta approx. = Δ 1 /(Δ 2 -Δ 1 ) which can be compared with that available in an ideal Carnot refrigerator of eta=T 1 /(T 2 -T 1 ). The development of a useful tunnel-junction refrigerator requires a tunneling barrier with an effective thermal conductance per unit area several orders of magnitude less than that provided by the A1 2 O 3 barrier in the Al-Pb and Sn-Pb systems

  5. Mountain Plains Learning Experience Guide: Heating, Refrigeration, & Air Conditioning.

    Science.gov (United States)

    Carey, John

    This Heating, Refrigeration, and Air Conditioning course is comprised of eleven individualized units: (1) Refrigeration Tools, Materials, and Refrigerant; (2) Basic Heating and Air Conditioning; (3) Sealed System Repairs; (4) Basic Refrigeration Systems; (5) Compression Systems and Compressors; (6) Refrigeration Controls; (7) Electric Circuit…

  6. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  7. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  8. Functional Dependence of Thermodynamic and Thermokinetic Parameters of Refrigerants Used in Mine Air Refrigerators. Part 1 - Refrigerant R407C

    Science.gov (United States)

    Nowak, Bernard; Życzkowski, Piotr; Łuczak, Rafał

    2017-03-01

    The authors of this article dealt with the issue of modeling the thermodynamic and thermokinetic properties (parameters) of refrigerants. The knowledge of these parameters is essential to design refrigeration equipment, to perform their energy efficiency analysis, or to compare the efficiency of air refrigerators using different refrigerants. One of the refrigerants used in mine air compression refrigerators is R407C. For this refrigerant, 23 dependencies were developed, determining its thermodynamic and thermokinetic parameters in the states of saturated liquid, dry saturated vapour, superheated vapor, subcooled liquid, and in the two-phase region. The created formulas have been presented in Tables 2, 5, 8, 10 and 12, respectively. It should be noted that the scope of application of these formulas is wider than the range of changes of that refrigerant during the normal operation of mine refrigeration equipment. The article ends with the statistical verification of the developed dependencies. For this purpose, for each model correlation coefficients and coefficients of determination were calculated, as well as absolute and relative deviations between the given values from the program REFPROP 7 (Lemmon et al., 2002) and the calculated ones. The results of these calculations have been contained in Tables 14 and 15.

  9. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  10. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  11. 10 CFR 431.62 - Definitions concerning commercial refrigerators, freezers and refrigerator-freezers.

    Science.gov (United States)

    2010-01-01

    ... functional characteristics that affect energy consumption. Commercial refrigerator, freezer, and refrigerator... formed by the plane of the door, when the equipment is viewed in cross-section; and (2) For equipment...

  12. HeREF-2003: Helium Refrigeration Techniques

    CERN Multimedia

    2003-01-01

    CERN Technical Training 2003: Learning for the LHC ! Theory, Technology, Maintenance and Control of Helium Refrigerators HeREF-2003 is a course in the framework of the 2002 Technical Training Programme, that will provide a complete introduction to Helium refrigeration, with a practical approach to theory, technology, maintenance and control of Helium refrigeration installations. Theoretical aspects and equations will be limited to a minimum. HeREF-2003 targets an audience of technicians and operators of Helium refrigeration plants at CERN, as well as physicists and engineers needing an overview of current Helium refrigeration techniques. HeREF-2003 will address, among other, issues related to component technology, installation maintenance, process control and Helium purity. A commented visit to a couple of CERN Helium refrigeration or liquefaction plants will also take place. Duration: 7 half days (4 mornings and 3 afternoons), 6-10 October, 2003 Cost per participant: 500.- CHF Language: Bilingual English...

  13. HeREF-2003 : Helium Refrigeration Techniques

    CERN Multimedia

    2003-01-01

    CERN Technical Training 2003: Learning for the LHC ! Theory, Technology, Maintenance and Control of Helium Refrigerators HeREF-2003 is a course in the framework of the 2002 Technical Training Programme, that will provide a complete introduction to Helium refrigeration, with a practical approach to theory, technology, maintenance and control of Helium refrigeration installations. Theoretical aspects and equations will be limited to a minimum. HeREF-2003 targets an audience of technicians and operators of Helium refrigeration plants at CERN, as well as physicists and engineers needing an overview of current Helium refrigeration techniques. HeREF-2003 will address, among other, issues related to component technology, installation maintenance, process control and Helium purity. A commented visit to a couple of CERN Helium refrigeration or liquefaction plants will also take place. • Duration: 7 half days (4 mornings and 3 afternoons), 6-10 October, 2003 • Cost per participant: 500.- CHF ...

  14. Not all counterclockwise thermodynamic cycles are refrigerators

    Science.gov (United States)

    Dickerson, R. H.; Mottmann, J.

    2016-06-01

    Clockwise cycles on PV diagrams always represent heat engines. It is therefore tempting to assume that counterclockwise cycles always represent refrigerators. This common assumption is incorrect: most counterclockwise cycles cannot be refrigerators. This surprising result is explored here for quasi-static ideal gas cycles, and the necessary conditions for refrigeration cycles are clarified. Three logically self-consistent criteria can be used to determine if a counterclockwise cycle is a refrigerator. The most fundamental test compares the counterclockwise cycle with a correctly determined corresponding Carnot cycle. Other criteria we employ include a widely accepted description of the functional behavior of refrigerators, and a corollary to the second law that limits a refrigerator's coefficient of performance.

  15. Magnetocaloric refrigeration near room temperature (invited)

    International Nuclear Information System (INIS)

    Brueck, E.; Tegus, O.; Thanh, D.T.C.; Buschow, K.H.J.

    2007-01-01

    Modern society relies on readily available refrigeration. The ideal cooling machine would be a compact, solid state, silent and energy-efficient heat pump that does not require maintenance. Magnetic refrigeration has three prominent advantages compared to compressor-based refrigeration. First, there are no harmful gases involved, second it may be built more compact as the working material is a solid and third magnetic refrigerators generate much less noise. Recently, a new class of magnetic refrigerant materials for room-temperature applications was discovered. These new materials have important advantages over existing magnetic coolants: They exhibit a large magnetocaloric effect (MCE) in conjunction with a magnetic phase transition of first order. This MCE is, larger than that of Gd metal, which is used in the demonstration refrigerators built to explore the potential of this evolving technology. In the present review, we compare the different materials considering both scientific aspects and industrial applicability

  16. Optimum operating regimes of common paramagnetic refrigerants

    CERN Document Server

    Wikus, P; Figueroa-Feliciano, E

    2011-01-01

    Adiabatic Demagnetization Refrigerators (ADRs) are commonly used in cryogenic laboratories to achieve subkelvin temperatures. ADRs are also the technology of choice for several space borne instruments which make use of cryogenic microcalorimeters or bolometers {[}1-4]. For these applications, refrigerants with high ratios of cooling capacity to volume, or cooling capacity to mass are usually required. In this manuscript, two charts for the simple selection of the most suitable of several common refrigerants (CAA, CMN, CPA, DGG, FAA, GGG, GLF and MAS) are presented. These graphs are valid for single stage cycles. The selection of the refrigerants is uniquely dependent on the starting conditions of the refrigeration cycle (temperature and magnetic field density) and the desired final temperature. Only thermodynamic properties of the refrigerants have been taken into account, and other important factors such as availability and manufacturability have not been considered. (C) 2011 Elsevier Ltd. All rights reserve...

  17. Ecological optimization for generalized irreversible Carnot refrigerators

    International Nuclear Information System (INIS)

    Chen Lingen; Zhu Xiaoqin; Sun Fengrui; Wu Chih

    2005-01-01

    The optimal ecological performance of a Newton's law generalized irreversible Carnot refrigerator with the losses of heat resistance, heat leakage and internal irreversibility is derived by taking an ecological optimization criterion as the objective, which consists of maximizing a function representing the best compromise between the exergy output rate and exergy loss rate (entropy production rate) of the refrigerator. Numerical examples are given to show the effects of heat leakage and internal irreversibility on the optimal performance of generalized irreversible refrigerators

  18. Evaluation of Virtual Refrigerant Mass Flow Sensors

    OpenAIRE

    Kim, Woohyun; Braun, James E.

    2012-01-01

    Refrigerant mass flow rate is an important measurement for monitoring equipment performance and enabling fault detection and diagnostics. However, a traditional mass flow meter is expensive to purchase and install. A virtual refrigerant mass flow sensor (VRMF) uses a mathematical model to estimate flow rate using low-cost measurements and can potentially be implemented at low cost. This study evaluates three VRMFs for estimating refrigerant mass flow rate. The first model uses a compressor ma...

  19. Adsorption refrigeration technology theory and application

    CERN Document Server

    Wang, Ruzhu; Wu, Jingyi

    2014-01-01

    Gives readers a detailed understanding of adsorption refrigeration technology, with a focus on practical applications and environmental concerns Systematically covering the technology of adsorption refrigeration, this book provides readers with a technical understanding of the topic as well as detailed information on the state-of-the-art from leading researchers in the field. Introducing readers to background on the development of adsorption refrigeration, the authors also cover the development of adsorbents, various thermodynamic theories, the design of adsorption systems and adsorption refri

  20. Open innovation and supply chain management in food machinery ...

    African Journals Online (AJOL)

    Open innovation and supply chain management in food machinery supply chain: a ... This paradigm describes a new approach to internal R&D management, which ... a picture of the adoption of open innovation in the food machinery industry.

  1. United States: refrigeration industry blows hot

    International Nuclear Information System (INIS)

    Crawford, J.

    1997-01-01

    In the framework of the Kyoto convention on global warming, the american refrigeration industries have undertaken several organizations and contacts with governments and agencies in order to explain the real issues concerning the effects of refrigerant utilization in refrigerating machines on the greenhouse effect, taking into consideration the commercial impact that a ban on certain refrigerants could have on the industry's business. They argue that HFC utilization in this industry is fundamentally non-emissive and that important improvements have been realized concerning tightness and energy consumption

  2. Rotary magnetic refrigerator for superfluid helium production

    International Nuclear Information System (INIS)

    Hakuraku, Y.; Ogata, H.

    1986-01-01

    A new rotary-magnetic refrigerator designed to obtain superfluid helium temperatures by executing a magnetic Carnot cycle is developed. A rotor containing 12 magnetic refrigerants (gadolinium-gallium-garnet) is immersed in liquid helium at 4.2 K and rotated at constant speed in a steady magnetic field distribution. Performance tests demonstrate that the new rotary refrigerator is capable of obtaining a temperature of 1.48 K. The maximum useful cooling power obtained at 1.8 K is 1.81 W which corresponds to a refrigeration efficiency of 34%

  3. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  4. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  5. The Autophagic Machinery in Enterovirus Infection.

    Science.gov (United States)

    Lai, Jeffrey K F; Sam, I-Ching; Chan, Yoke Fun

    2016-01-27

    The Enterovirus genus of the Picornaviridae family comprises many important human pathogens, including polioviruses, rhinovirus, enterovirus A71, and enterovirus D68. They cause a wide variety of diseases, ranging from mild to severe life-threatening diseases. Currently, no effective vaccine is available against enteroviruses except for poliovirus. Enteroviruses subvert the autophagic machinery to benefit their assembly, maturation, and exit from host. Some enteroviruses spread between cells via a process described as autophagosome-mediated exit without lysis (AWOL). The early and late phases of autophagy are regulated through various lipids and their metabolizing enzymes. Some of these lipids and enzymes are specifically regulated by enteroviruses. In the present review, we summarize the current understanding of the regulation of autophagic machinery by enteroviruses, and provide updates on recent developments in this field.

  6. 46 CFR 109.205 - Inspection of boilers and machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Inspection of boilers and machinery. 109.205 Section 109... OPERATIONS Tests, Drills, and Inspections § 109.205 Inspection of boilers and machinery. The chief engineer or engineer in charge, before he assumes charge of the boilers and machinery of a unit shall inspect...

  7. 46 CFR 252.33 - Hull and machinery insurance.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 8 2010-10-01 2010-10-01 false Hull and machinery insurance. 252.33 Section 252.33... Subsidy Rates § 252.33 Hull and machinery insurance. (a) Subsidy items. The fair and reasonable net premium costs (including stamp taxes) of hull and machinery, increased value, excess general average...

  8. 46 CFR 282.23 - Hull and machinery insurance.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 8 2010-10-01 2010-10-01 false Hull and machinery insurance. 282.23 Section 282.23... COMMERCE OF THE UNITED STATES Calculation of Subsidy Rates § 282.23 Hull and machinery insurance. (a) Subsidy items. The fair and reasonable net premium costs (including stamp taxes) of hull and machinery...

  9. 29 CFR 1910.215 - Abrasive wheel machinery.

    Science.gov (United States)

    2010-07-01

    ... be securely fastened to the spindle and the bearing surface shall run true. When more than one wheel... 29 Labor 5 2010-07-01 2010-07-01 false Abrasive wheel machinery. 1910.215 Section 1910.215 Labor... OCCUPATIONAL SAFETY AND HEALTH STANDARDS Machinery and Machine Guarding § 1910.215 Abrasive wheel machinery. (a...

  10. 46 CFR 97.30-5 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Accidents to machinery. 97.30-5 Section 97.30-5 Shipping... Reports of Accidents, Repairs, and Unsafe Equipment § 97.30-5 Accidents to machinery. (a) In the event of an accident to a boiler, unfired pressure vessel, or machinery tending to render the further use of...

  11. 46 CFR 196.30-5 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Accidents to machinery. 196.30-5 Section 196.30-5... Reports of Accidents, Repairs, and Unsafe Equipment § 196.30-5 Accidents to machinery. (a) In the event of an accident to a boiler, unfired pressure vessel, or machinery tending to render the further use of...

  12. Machinery prognostics and prognosis oriented maintenance management

    CERN Document Server

    Yan, Jihong

    2014-01-01

    This book gives a complete presentatin of the basic essentials of machinery prognostics and prognosis oriented maintenance management, and takes a look at the cutting-edge discipline of intelligent failure prognosis technologies for condition-based maintenance.  Latest research results and application methods are introduced for signal processing, reliability moelling, deterioration evaluation, residual life prediction and maintenance-optimization as well as applications of these methods.

  13. Refrigeration generation using expander-generator units

    Science.gov (United States)

    Klimenko, A. V.; Agababov, V. S.; Koryagin, A. V.; Baidakova, Yu. O.

    2016-05-01

    The problems of using the expander-generator unit (EGU) to generate refrigeration, along with electricity were considered. It is shown that, on the level of the temperatures of refrigeration flows using the EGU, one can provide the refrigeration supply of the different consumers: ventilation and air conditioning plants and industrial refrigerators and freezers. The analysis of influence of process parameters on the cooling power of the EGU, which depends on the parameters of the gas expansion process in the expander and temperatures of cooled environment, was carried out. The schematic diagram of refrigeration generation plant based on EGU is presented. The features and advantages of EGU to generate refrigeration compared with thermotransformer of steam compressive and absorption types were shown, namely: there is no need to use the energy generated by burning fuel to operate the EGU; beneficial use of the heat delivered to gas from the flow being cooled in equipment operating on gas; energy production along with refrigeration generation, which makes it possible to create, using EGU, the trigeneration plants without using the energy power equipment. It is shown that the level of the temperatures of refrigeration flows, which can be obtained by using the EGU on existing technological decompression stations of the transported gas, allows providing the refrigeration supply of various consumers. The information that the refrigeration capacity of an expander-generator unit not only depends on the parameters of the process of expansion of gas flowing in the expander (flow rate, temperatures and pressures at the inlet and outlet) but it is also determined by the temperature needed for a consumer and the initial temperature of the flow of the refrigeration-carrier being cooled. The conclusion was made that the expander-generator units can be used to create trigeneration plants both at major power plants and at small energy.

  14. Prediction of Dangerous Time in Case Hydrocarbon Refrigerant Leaks into Household Refrigerator Cabinet

    Science.gov (United States)

    Meguro, Takatoshi; Kaji, Nobufuji; Miyake, Kunihiro

    Hydrocarbon refrigerators are now on sale in European countries. However, hydrocarbons are flammable. A common claim is that concentration of hydrocarbon in the refrigerator could exceed the lower explosive limit by a sudden leak and then a spark ignites a flame causing overpressure. There is the need of the studies on potential risks originated from the use of flammable refrigerants. Thus, the flow rate of the fresh air into the refrigerator cabinet has been defined experimentally, and the spatial average concentration in the refrigerator cabinet has been analyzed theoretically to predict the dangerous time in excess of the lower explosive limit.

  15. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  16. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  17. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  18. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  19. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  20. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  1. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  2. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  3. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  4. TRANSPORT PROPERTIES FOR REFRIGERANT MIXTURES

    Directory of Open Access Journals (Sweden)

    V. Geller

    2014-06-01

    Full Text Available A set of models to predict viscosity and thermal conductivity of refrigerant mixtures is developed. A general model for viscosity and thermal conductivity use the three contributions sum form (the dilute-gas terms, the residual terms, and the liquid terms. The corresponding states model is recommended to predict the dense gas transport properties over a range of reduced density from 0 to 2. It is shown that the RHS model provides the most reliable results for the saturated-liquid and the compressed-liquid transport properties over a range of given temperatures from 0,5 to 0,95.

  5. Refrigeration system with clearance seals

    International Nuclear Information System (INIS)

    Holland, N. J.

    1985-01-01

    In a refrigeration system such as a split Stirling system, fluid seals associated with the reciprocating displacer are virtually dragless clearance seals. Movement of the displacer relative to the pressure variations in the working volume of gas is retarded by a discrete braking element. Because it is not necessary that the brake providing any sealing action, the brake can be designed for greater durability and less dependence on ambient and operating temperatures. Similarly, the clearance seal can be formed of elements having low thermal expansion such that the seal is not temperature dependent. In the primary embodiments the braking element is a split friction brake

  6. Refrigeration and air-conditioning

    CERN Document Server

    Hundy, G H; Welch, T C

    2008-01-01

    Now in its fourth edition, this respected text delivers a comprehensive introduction to the principles and practice of refrigeration. Clear and straightforward, it is designed for students (NVQ/vocational level) and professional HVAC engineers, including those on short or CPD courses. Inexperienced readers are provided with a comprehensive introduction to the fundamentals of the technology. With its concise style yet broad sweep the book covers most of the applications professionals will encounter, enabling them to understand, specify, commission, use and maintain these systems. Many readers w

  7. A miniaturized plastic dilution refrigerator

    International Nuclear Information System (INIS)

    Bindilatti, V.; Oliveira, N.F.Jr.; Martin, R.V.; Frossati, G.

    1996-01-01

    We have built and tested a miniaturized dilution refrigerator, completely contained (still, heat exchanger and mixing chamber) inside a plastic (PVC) tube of 10 mm diameter and 170 mm length. With a 25 cm 2 CuNi heat exchanger, it reached temperatures below 50 mK, for circulation rates below 70 μmol/s. The cooling power at 100 mK and 63 μmol/s was 45 μW. The experimental space could accommodate samples up to 6 mm in diameter. (author)

  8. Machinery Vibration Monitoring Program at the Savannah River Site

    International Nuclear Information System (INIS)

    Potvin, M.M.

    1990-01-01

    The Reactor Maintenance's Machinery Vibration Monitoring Program (MVMP) plays an essential role in ensuring the safe operation of the three Production Reactors at the Westinghouse Savannah River Company (WRSC) Savannah River Site (SRS). This program has increased machinery availability and reduced maintenance cost by the early detection and determination of machinery problems. This paper presents the Reactor Maintenance's Machinery Vibration Monitoring Program, which has been documented based on Electric Power Research Institute's (EPRI) NP-5311, Utility Machinery Monitoring Guide, and some examples of the successes that it has enjoyed

  9. 46 CFR 147.90 - Refrigerants.

    Science.gov (United States)

    2010-10-01

    .../ASHRAE 34-78 may be carried as ships' stores. (b) Refrigerants contained in a vessel's operating system... 46 Shipping 5 2010-10-01 2010-10-01 false Refrigerants. 147.90 Section 147.90 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) DANGEROUS CARGOES HAZARDOUS SHIPS' STORES Stowage and Other...

  10. 46 CFR 154.1720 - Indirect refrigeration.

    Science.gov (United States)

    2010-10-01

    ... Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) CERTAIN BULK DANGEROUS CARGOES SAFETY STANDARDS FOR SELF-PROPELLED VESSELS CARRYING BULK LIQUEFIED GASES Special Design and Operating Requirements § 154.1720 Indirect refrigeration. A refrigeration system that is used to cool acetaldehyde, ethylene...

  11. Refrigeration: Introducing energy saving opportunities for business

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2006-04-15

    In some industries, most notably food and drink and chemicals, refrigeration accounts for a significant proportion of overall site energy costs. For instance, in the industrial handling of meat, poultry and fish, it often accounts for 50% of total energy costs. In ice-cream production the proportion is 70%. In a number of commercial sectors, refrigeration also represents a significant proportion of overall energy costs. For example: Cold storage 90%; Food supermarkets 50%; Small shops with refrigerated cabinets 70% or over; Pubs and clubs 30%. Against these high costs, even a small reduction in refrigeration energy use can offer significant cost savings, resulting in increased profits. Energy saving need not be expensive. Energy savings of up to 20% can be realised in many refrigeration plant through actions that require little or no investment. In addition, improving the efficiency and reducing the load on a refrigeration plant can improve reliability and reduce the likelihood of a breakdown. Most organisations can save energy and money on refrigeration by: More efficient equipment; Good maintenance; Housekeeping and control. This publication provides an understanding of the operation of refrigeration systems, identifies where savings can be realised and will enable readers to present an informed case on energy savings to key decision makers within their organisation. (GB)

  12. Energy efficient control of a refrigeration plant

    DEFF Research Database (Denmark)

    Rasmussen, Henrik; Larsen, Lars F. S.

    2009-01-01

    This paper proposes a novel method for superheat and capacity control of refrigeration systems. The new idea is to control the superheat by the compressor speed and capacity by the refrigerant flow. A new low order nonlinear model of the evaporator is developed and used in a backstepping design...... and the methods are evaluated with respect to energy efficiency....

  13. Environmentally benign working pairs for adsorption refrigeration

    International Nuclear Information System (INIS)

    Cui Qun; Tao Gang; Chen Haijun; Guo Xinyue; Yao Huqing

    2005-01-01

    This paper begins from adsorption working pairs: water and ethanol were selected as refrigerants; 13x molecular sieve, silica gel, activated carbon, adsorbent NA and NB, proposed by authors, were selected as adsorbents, and the performance of adsorption working pairs in adsorption refrigeration cycle was studied. The adsorption isotherms of adsorbents (NA and NB) were obtained by high-vacuum gravimetric method. Desorption properties of adsorbents were analyzed and compared by thermal analysis method. The performance of adsorption refrigeration was studied on simulation device of adsorption refrigeration cycle. After presentation of adsorption isotherms, the thermodynamic performance for their use in adsorption refrigeration system was calculated. The results show: (1) the maximum adsorption capacity of water on adsorbent NA reaches 0.7 kg/kg, and the maximum adsorption capacity of ethanol on adsorbent NB is 0.68 kg/kg, which is three times that of ethanol on activated carbon, (2) the refrigeration capacity of NA-water working pair is 922 kJ/kg, the refrigeration capacity of NB-ethanol is 2.4 times that of activated carbon-methanol, (3) as environmental friendly and no public hazard adsorption working pair, NA-H 2 O and NB-ethanol can substitute activated carbon-methanol in adsorption refrigeration system using low-grade heat source

  14. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  15. Sorption compressor/mechanical expander hybrid refrigeration

    Science.gov (United States)

    Jones, J. A.; Britcliffe, M.

    1987-01-01

    Experience with Deep Space Network (DSN) ground-based cryogenic refrigerators has proved the reliability of the basic two-stage Gifford-McMahon helium refrigerator. A very long life cryogenic refrigeration system appears possible by combining this expansion system or a turbo expansion system with a hydride sorption compressor in place of the usual motor driven piston compressor. To test the feasibility of this system, a commercial Gifford-McMahon refrigerator was tested using hydrogen gas as the working fluid. Although no attempt was made to optimize the system for hydrogen operation, the refrigerator developed 1.3 W at 30 K and 6.6 W at 60 K. The results of the test and of theoretical performances of the hybrid compressor coupled to these expansion systems are presented.

  16. Compatibility of refrigerants and lubricants with elastomers

    Energy Technology Data Exchange (ETDEWEB)

    Hamed, G.R.; Seiple, R.H.

    1993-01-01

    The information contained in this report is designed to assist the air-conditioning and refrigeration industry in the selection of suitable elastomeric gasket and seal materials that will prove useful in various refrigerant and refrigeration lubricant environments. 97% of the swell measurements have been made to date. The other 3% of the measurements are contingent on availability of additional R-32. Swell behavior in the fluids have been determined using weight and in situ diameter measurements for the refrigerants and weight, diameter and thickness measurements for the lubricants. Weight and diameter measurements are repeated after 2 and 24 hours for samples removed from the refrigerant test fluids and 24 hours after removal from the lubricants.

  17. Operating Manual of Helium Refrigerator (Rev. 2)

    Energy Technology Data Exchange (ETDEWEB)

    Song, K.M.; Son, S.H.; Kim, K.S.; Lee, S.K.; Kim, M.S. [Korea Electric Power Research Institute, Taejon (Korea)

    2002-07-01

    A helium refrigerator was installed as a supplier of 20K cold helium to the cryogenic distillation system of WTRF pilot plant. The operating procedures of the helium refrigerator, helium compressor and auxiliary apparatus are described for the safety and efficient operation in this manual. The function of the helium refrigerator is to remove the impurities from the compressed helium of about 250psig, to cool down the helium from ambient temperature to 20K through the heat exchanger and expansion engine and to transfer the cold helium to the cryogenic distillation system. For the smoothly operation of helium refrigerator, the preparation, the start-up, the cool-down and the shut-down of the helium refrigerator are described in this operating manual. (author). 3 refs., 14 tabs.

  18. Novel materials for laser refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Hehlen, Markus P [Los Alamos National Laboratory

    2009-01-01

    The status of optical refrigeration of rare-earth-doped solids is reviewed, and the various factors that limit the performance of current laser-cooling materials are discussed. Efficient optical refrigeration is possible in materials for which {Dirac_h}{omega}{sub max} < E{sub p}/8, where {Dirac_h}{omega}{sub max} is the maximum phonon energy of the host material and E{sub p} is the pump energy of the rare-earth dopant. Transition-metal and OH{sup -}impurities at levels >100 ppb are believed to be the main factors for the limited laser-cooling performance in current materials. The many components of doped ZBLAN glass pose particular processing challenges. Binary fluoride glasses such as YF{sub 3}-LiF are considered as alternatives to ZBLAN. The crystalline system KPb{sub 2}CI{sub 5} :Dy{sup 3+} is identified as a prime candidate for high-efficiency laser cooling.

  19. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  20. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  1. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  2. Review of investigations in eco-friendly thermoacoustic refrigeration system

    Directory of Open Access Journals (Sweden)

    Raut Ashish S.

    2017-01-01

    Full Text Available To reduce greenhouse gas emissions, internationally research and development is intended to improve the performance of conventional refrigeration system also growth of new-fangled refrigeration technology of potentially much lesser ecological impact. This paper gives brief review of research and development in thermoacoustic refrigeration also the existing situation of thermoacoustic refrigeration system. Thermoacoustic refrigerator is a novel sort of energy conversion equipment which converts acoustic power into heat energy by thermoacoustic effect. Thermoacoustic refrigeration is an emergent refrigeration technology in which there are no moving elements or any environmentally injurious refrigerants during its working. The concept of thermoacoustic refrigeration system is explained, the growth of thermoacoustic refrigeration, various investigations into thermoacoustic refrigeration system, various optimization techniques to improve coefficient of performance, different stacks and resonator tube designs to improve heat transfer rate, various gases, and other parameters like sound generation have been reviewed.

  3. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  4. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  5. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  6. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  7. Fluid machinery application, selection, and design

    CERN Document Server

    Wright, Terry

    2013-01-01

    Published nearly a decade ago, Fluid Machinery: Performance, Analysis, and Design quickly became popular with students, professors, and professionals because of its comprehensive and comprehensible introduction to the fluid mechanics of turbomachinery. Renamed to reflect its wider scope and reorganized content, this second edition provides a more logical flow of information that will enhance understanding. In particular, it presents a consistent notation within and across chapters, updating material when appropriate. Although the authors do account for the astounding growth in the field of com

  8. Analysis of electric machinery and drive systems

    CERN Document Server

    Krause, Paul C; Sudhoff, Scott D; Pekarek, Steven

    2013-01-01

    Introducing a new edition of the popular reference on machine analysis Now in a fully revised and expanded edition, this widely used reference on machine analysis boasts many changes designed to address the varied needs of engineers in the electric machinery, electric drives, and electric power industries. The authors draw on their own extensive research efforts, bringing all topics up to date and outlining a variety of new approaches they have developed over the past decade. Focusing on reference frame theory that has been at the core of this work since the first edition, th

  9. Electrification of agricultural machinery; Elektrifizierung von Landmaschinen

    Energy Technology Data Exchange (ETDEWEB)

    Goetz, Manuel; Grad, Karl; Weinmann, Olrik [ZF Friedrichshafen AG, Friedrichshafen (Germany)

    2012-10-15

    As early as 2009, ZF exhibited a generator system for agricultural machinery at Agritechnica under the name Terra+ which consisted of an electric motor in the transmission housing. As part of the ElecTra project, the company is now presenting its first tractor prototype with this generator system at Agritechnica 2011. The project involves combining the electrification of the tractor's auxiliary systems with electric drives for an attachment. The electrification of the implement was carried out in cooperation with Amazone, manufacturer of implements for the agricultural industry. (orig.)

  10. Manufacturing A Refrigerator with Heat Recovery Unit

    Directory of Open Access Journals (Sweden)

    Mustafa Mohammed Kadhim

    2018-02-01

    Full Text Available This study aims to exploite the rejected heating energy from condenser and benefit from it to reheat the foods and other materials. It can also be employed to improve the coefficient of performance of a refrigerator at the same time by using approximately the same consumption electrical energy used to operate the compressor and refrigerator in general. This idea has been implemented by manufacturing of a refrigerator with using additional part has the same metal and condenser pipe diameters but its surface area does not exceed 40% from total surface area of the condenser and its design as an insulated cabinet from all sides to prevent heat leakage through it and located between the compressor and the condenser. Small electrical fan has been added inside this cabinet to provide a suitable air circulation and a homogenous temperature distribution inside the cabinet space. It is expected that the super heating energy of refrigerant (R134a which comes out of the compressor would be removed  inside this cabinet and this insist to condensate the refrigerant (cooling fluid with a rate higher than that used in the normal refrigerator only. Three magnetic valves have been used in order to control the refrigerant flow in state of operation the refrigerator only or to gather with heating cabinet. To measure the temperatures at each process of the simple vapor compression refrigeration cycle, nine temperature sensors at input and output of each compressor, condenser and an evaporator in additional to input of cabinet and inside it and on evaporator surface have been provided. Five pressure gages have been used to measure the value of pressure and compare it for the two states of operation. The consumption of electrical energy  can be calculated by adding an ammeter and a voltmeter and compare between the consumption energy of both states. The obtained results show that there is an improvement in the coeffecient of performance in state of operation the

  11. Energy performance of supermarket refrigeration and air conditioning integrated systems working with natural refrigerants

    International Nuclear Information System (INIS)

    Cecchinato, Luca; Corradi, Marco; Minetto, Silvia

    2012-01-01

    The current trends in commercial refrigeration aim at reducing the synthetic refrigerant charge, either by minimising the internal volume of the circuit or by utilising natural refrigerants, and at energy saving. The energy efficiency of supermarkets can be improved by optimising components design, recovering thermal and refrigerating energy, adopting innovative technology solutions, integrating the HVAC system with medium temperature and low temperature refrigeration plants and, finally, reducing thermal loads on refrigerated cases. This study aims at investigating the performance of different lay-out and technological solutions where only natural refrigerants are used and at finding the potential for improving energy efficiency over the traditional systems in different climates. In the analysis, chillers and heat pumps working with ammonia or propane, medium temperature systems working with ammonia or propane and carbon dioxide as heat transfer fluid or with carbon dioxide as the refrigerant and low temperature systems working with carbon dioxide are considered and benchmarked with a state-of-the-art HFCs based plant. The most efficient investigated solution enables an annual energy saving higher than 15% with respect to the baseline solution for all the considered climates. - Highlights: ► Different natural refrigerants supermarket HVAC and R integrated systems are analysed. ► Some of the proposed solutions offer a significant benefit over the baseline one. ► Up to 18.7% energy saving is achieved in the considered climates. ► The refrigeration unit condensation by the AC chiller offers the poorest results.

  12. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  13. Refrigerating liquid prototype for LED's thermal management

    International Nuclear Information System (INIS)

    Faranda, Roberto; Guzzetti, Stefania; Lazaroiu, George Cristian; Leva, Sonia

    2012-01-01

    The heat management is the critical factor for high performance operation of LED. A new heat management application of refrigerating liquid integrated within a fabricated prototype is proposed and investigated. A series of experiments considering different heights of liquid level were performed to evaluate the heat dissipation performance and optical characteristics of the refrigerating liquid based prototype. The results reveal that the junction temperature decreases as the level of refrigerating liquid increases. The experimental results report that the refrigerating liquid reduces the junction temperature, and can positively influence the luminous radiation performances. An optimization investigation of the proposed solution was carried out to find an optimum thermal performance. The experiments indicated that refrigerating liquid cooling is a powerful way for heat dissipation of high power LEDs, and the fabrication of prototype was feasible and useful. - Highlights: ► New heat management application of refrigerating liquid on a fabricated LED prototype. ► Thermal models setup and comparison between the classical and the new solutions. ► The impact of refrigerating liquid level on LED thermal and luminous performances. ► The relationship between different levels of liquid with LED prototype performances.

  14. Data-Driven Control of Refrigeration System

    DEFF Research Database (Denmark)

    Vinther, Kasper

    Refrigeration is used in a wide range of applications, e.g., for storage of food at low temperatures to prolong shelf life and in air conditioning for occupancy comfort. The main focus of this thesis is control of supermarket refrigeration systems. This market is very competitive and it is import......Refrigeration is used in a wide range of applications, e.g., for storage of food at low temperatures to prolong shelf life and in air conditioning for occupancy comfort. The main focus of this thesis is control of supermarket refrigeration systems. This market is very competitive...... traditionally are a pressure and a temperature sensor. In this thesis, a novel maximum slope-seeking (MSS) control method is developed. This has resulted in a control implementation, which successfully has been able to control the evaporator superheat in four widely different refrigeration system test...... problems. The method utilizes the qualitative nonlinearity in the system and harmonic analysis of a perturbation signal to reach an unknown, but suitable, operating point. Another important control task in refrigeration systems is to maintain the temperature of the refrigerated space or foodstuff within...

  15. The RNAi Inheritance Machinery of Caenorhabditis elegans.

    Science.gov (United States)

    Spracklin, George; Fields, Brandon; Wan, Gang; Becker, Diveena; Wallig, Ashley; Shukla, Aditi; Kennedy, Scott

    2017-07-01

    Gene silencing mediated by dsRNA (RNAi) can persist for multiple generations in Caenorhabditis elegans (termed RNAi inheritance). Here we describe the results of a forward genetic screen in C. elegans that has identified six factors required for RNAi inheritance: GLH-1/VASA, PUP-1/CDE-1, MORC-1, SET-32, and two novel nematode-specific factors that we term here (heritable RNAi defective) HRDE-2 and HRDE-4 The new RNAi inheritance factors exhibit mortal germline (Mrt) phenotypes, which we show is likely caused by epigenetic deregulation in germ cells. We also show that HRDE-2 contributes to RNAi inheritance by facilitating the binding of small RNAs to the inheritance Argonaute (Ago) HRDE-1 Together, our results identify additional components of the RNAi inheritance machinery whose conservation provides insights into the molecular mechanism of RNAi inheritance, further our understanding of how the RNAi inheritance machinery promotes germline immortality, and show that HRDE-2 couples the inheritance Ago HRDE-1 with the small RNAs it needs to direct RNAi inheritance and germline immortality. Copyright © 2017 by the Genetics Society of America.

  16. Availability analysis of selected mining machinery

    Directory of Open Access Journals (Sweden)

    Brodny Jarosław

    2017-06-01

    Full Text Available Underground extraction of coal is characterized by high variability of mining and geological conditions in which it is conducted. Despite ever more effective methods and tools, used to identify the factors influencing this process, mining machinery, used in mining underground, work in difficult and not always foreseeable conditions, which means that these machines should be very universal and reliable. Additionally, a big competition, occurring on the coal market, causes that it is necessary to take action in order to reduce the cost of its production, e.g. by increasing the efficiency of utilization machines. To meet this objective it should be pro-ceed with analysis presented in this paper. The analysis concerns to availability of utilization selected mining machinery, conducted using the model of OEE, which is a tool for quantitative estimate strategy TPM. In this article we considered the machines being part of the mechanized longwall complex and the basis of analysis was the data recording by the industrial automation system. Using this data set we evaluated the availability of studied machines and the structure of registered breaks in their work. The results should be an important source of information for maintenance staff and management of mining plants, needed to improve the economic efficiency of underground mining.

  17. Cell secretion machinery: Studies using the AFM

    International Nuclear Information System (INIS)

    Jena, Bhanu P.

    2006-01-01

    A new field in biology, 'nano-cell biology', has emerged from the successful use of force microscopy in understanding the structure and dynamics of cells and biomolecules, at nm resolution and in real time. Atomic force microscopy, in combination with conventional tools and approaches (electron microscopy, electrophysiology, X-ray diffraction, photon correlation spectroscopy, mass spectroscopy, biochemistry, and molecular biology), has revealed for the first time, the universal molecular machinery and mechanism of secretion in cells. Secretion occurs in all living cells and involves the delivery of intracellular products to the cell exterior. Secretory products are packaged and stored in membranous sacs or vesicles within the cell. When the cell needs to secrete these products, the secretory vesicles containing them, dock and fuse at plasma membrane-associated supramolecular structures called Porosome, to release their contents. Specialized cells for neurotransmission, enzyme secretion, or hormone release utilize a highly regulated secretory process. During secretion, swelling of secretory vesicles results in a build-up of intravesicular pressure, allowing expulsion of vesicular contents. The extent of vesicle swelling dictates the amount of vesicular contents expelled. The discovery of the porosome as the universal secretory machinery, its isolation, its structure and dynamics at nm resolution and in real time, its biochemical composition and functional reconstitution into artificial lipid membrane, have been determined. The molecular mechanism of secretory vesicle swelling, and the fusion of opposing bilayers, i.e., the fusion of secretory vesicle membrane at the base of the porosome membrane, has also been resolved

  18. Welding technologies for nuclear machinery and equipment

    International Nuclear Information System (INIS)

    Kobayashi, Masahiro; Yokono, Tomomi.

    1991-01-01

    The main welding methods applied to nuclear machinery and equipment are shielded metal arc welding, submerged arc welding, MAG welding and TIG welding. But in the last 10 years, in order to improve the reliability required for the welding of nuclear machinery and equipment, the welding technologies aiming at the reduction of heat input, the decrease of the number of welding pass and the automatic control of welding factors have been applied for the main purpose of bettering the quality and excluding human errors. The merits and the technology of narrow gap, pulsed MAG welding and melt-through welding are explained. As the automation of TIG welding, image processing type narrow gap, hot wire TIG welding and remote control type automatic TIG welding are described. For the longitudinal welding of active metal sheet products, plasma key-hole welding is applied. Since the concentration of its arc is good, high speed welding with low heat input can be done. For the stainless steel cladding by welding, electroslag welding has become to be employed in place of conventional submerged arc welding. Arc is not generated in the electroslag welding, and the penetration into base metal is small. (K.I.)

  19. Rotating Machinery Predictive Maintenance Through Expert System

    Directory of Open Access Journals (Sweden)

    M. Sarath Kumar

    2000-01-01

    Full Text Available Modern rotating machines such as turbomachines, either produce or absorb huge amount of power. Some of the common applications are: steam turbine-generator and gas turbine-compressor-generator trains produce power and machines, such as pumps, centrifugal compressors, motors, generators, machine tool spindles, etc., are being used in industrial applications. Condition-based maintenance of rotating machinery is a common practice where the machine's condition is monitored constantly, so that timely maintenance can be done. Since modern machines are complex and the amount of data to be interpreted is huge, we need precise and fast methods in order to arrive at the best recommendations to prevent catastrophic failure and to prolong the life of the equipment. In the present work using vibration characteristics of a rotor-bearing system, the condition of a rotating machinery (electrical rotor is predicted using an off-line expert system. The analysis of the problem is carried out in an Object Oriented Programming (OOP framework using the finite element method. The expert system which is also developed in an OOP paradigm gives the type of the malfunctions, suggestions and recommendations. The system is implemented in C++.

  20. 46 CFR 111.79-15 - Receptacles for refrigerated containers.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Receptacles for refrigerated containers. 111.79-15... ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Receptacles § 111.79-15 Receptacles for refrigerated containers. Receptacles for refrigerated containers must meet one of the following: (a) Each receptacle for refrigerated...

  1. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  2. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  3. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  4. Load forecasting of supermarket refrigeration

    DEFF Research Database (Denmark)

    Rasmussen, Lisa Buth; Bacher, Peder; Madsen, Henrik

    2016-01-01

    methods for predicting the regimes are tested. The dynamic relation between the weather and the load is modeled by simple transfer functions and the non-linearities are described using spline functions. The results are thoroughly evaluated and it is shown that the spline functions are suitable...... for handling the non-linear relations and that after applying an auto-regressive noise model the one-step ahead residuals do not contain further significant information....... in Denmark. Every hour the hourly electrical load for refrigeration is forecasted for the following 42 h. The forecast models are adaptive linear time series models. The model has two regimes; one for opening hours and one for closing hours, this is modeled by a regime switching model and two different...

  5. Bearing construction for refrigeration compresssor

    Science.gov (United States)

    Middleton, Marc G.; Nelson, Richard T.

    1988-01-01

    A hermetic refrigeration compressor has a cylinder block and a crankshaft rotatable about a vertical axis to reciprocate a piston in a cylinder on the cylinder block. A separate bearing housing is secured to the central portion of the cylinder block and extends vertically along the crankshaft, where it carries a pair of roller bearings to journal the crankshaft. The crankshaft has a radially extending flange which is journaled by a thrust-type roller bearing above the bearing housing to absorb the vertical forces on the crankshaft so that all three of the roller bearings are between the crankshaft and the bearing housing to maintain and control the close tolerances required by such bearings.

  6. PIPER Continuous Adiabatic Demagnetization Refrigerator

    Science.gov (United States)

    Kimball, Mark O.; Shirron, Peter J.; Canavan, Edgar R.; James, Bryan L.; Sampson, Michael A.; Letmate, Richard V.

    2017-01-01

    We report upon the development and testing of a 4-stage adiabatic demagnetization refrigerator (ADR) capable of continuous cooling at 0.100 Kelvin. This cooler is being built to cool the detector array aboard NASA's Primordial Inflation Polarization Explorer (PIPER) observatory. The goal of this balloon mission is to measure the primordial gravitational waves that should exist if the theory of cosmological inflation is correct. At altitude, the ADR will hold the array of transition-edge sensors at 100 mK continuously while periodically rejecting heat to a 1.2 K pumped helium bath. During testing on ground, the array is held at the same temperature but heat is rejected to a 4.2 K helium bath indicating the flexibility in this coolers design.

  7. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  8. Classification of refrigerants; Classification des fluides frigorigenes

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    This document was made from the US standard ANSI/ASHRAE 34 published in 2001 and entitled 'designation and safety classification of refrigerants'. This classification allows to clearly organize in an international way the overall refrigerants used in the world thanks to a codification of the refrigerants in correspondence with their chemical composition. This note explains this codification: prefix, suffixes (hydrocarbons and derived fluids, azeotropic and non-azeotropic mixtures, various organic compounds, non-organic compounds), safety classification (toxicity, flammability, case of mixtures). (J.S.)

  9. Two-phase flow in refrigeration systems

    CERN Document Server

    Gu, Junjie; Gan, Zhongxue

    2013-01-01

    Two-Phase Flow in Refrigeration Systems presents recent developments from the authors' extensive research programs on two-phase flow in refrigeration systems. This book covers advanced mass and heat transfer and vapor compression refrigeration systems and shows how the performance of an automotive air-conditioning system is affected through results obtained experimentally and theoretically, specifically with consideration of two-phase flow and oil concentration. The book is ideal for university postgraduate students as a textbook, researchers and professors as an academic reference book, and b

  10. ESO2 Optimization of Supermarket Refrigeration Systems

    DEFF Research Database (Denmark)

    Petersen, Lars Norbert; Madsen, Henrik; Heerup, Christian

    Supermarket refrigeration systems consists of a number of display cases, cooling cabinets and cold rooms connected to a central compressor pack. This configuration saves energy compared to placing a compressor at each cooling site. The classical control setup of a supermarket refrigeration system...... in the supermarket. The first approach to solve this problem is to design an overall control system which coordinates the compressor capacity and the current refrigeration load. The drawback of this approach is the complexity of the single controller. The solution is investigated in the first part of the report...

  11. Behavior of FFC refrigerants in the presence of refrigerant oils. Oelverhalten chlorfreier Kaeltemittel

    Energy Technology Data Exchange (ETDEWEB)

    Burke, M.; Kruse, H. (Hannover Univ. (Germany, F.R.). Inst. fuer Kaeltetechnik und Angewandte Waermetechnik)

    1990-01-01

    Looking for substitutes for the ozone-depleting refrigerants R12 and R22, investigations were made of the miscibility of FFC refrigerants (R23 - trifluoromethane CHF{sub 3}, R134a - tetrafluoroethane CH{sub 3}-CHF{sub 2}, and R152a - difluoroethane CH{sub 3}-CHF{sub 2}) with refrigerator oils. First experimental results reveal the refrigerants' behavior when mixed with mineral oils, alkylbenzene, PAG and ester-based oils. Mixtures of above refrigerants, especially R134a/R152a and R23/R152a as binary nonazeotropic mixtures, are considered conceivable substitutes. While addition of R23 reduces the mixture's flammability, addition of R152a improves the solubility of R134a in refrigerant oils. (orig./HW).

  12. On Development of Agricultural Machinery Operating Service in Chongqing

    Institute of Scientific and Technical Information of China (English)

    Chongjing; TAN; Shi; YANG

    2015-01-01

    Development of agricultural machinery operating service in Chongqing takes on rapid increase in number of service organizations,diversified service methods,improvement in service level,and constant service income. However,there are some problems,including unreasonable composition and small scale of service organization,imbalanced development of four service methods,low service level,and low operating income of agricultural machinery households. To accelerate development of agricultural machinery operating service in Chongqing,it is recommended to take following measures: adjusting subsidy for purchase and operation of agricultural machinery; improving fiscal and taxation and financial system; speeding up infrastructure construction,establishing agricultural machinery information network,and improving organizational form and methods of agricultural machinery operating service.

  13. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  14. Refrigerant charge management in a heat pump water heater

    Science.gov (United States)

    Chen, Jie; Hampton, Justin W.

    2014-06-24

    Heat pumps that heat or cool a space and that also heat water, refrigerant management systems for such heat pumps, methods of managing refrigerant charge, and methods for heating and cooling a space and heating water. Various embodiments deliver refrigerant gas to a heat exchanger that is not needed for transferring heat, drive liquid refrigerant out of that heat exchanger, isolate that heat exchanger against additional refrigerant flowing into it, and operate the heat pump while the heat exchanger is isolated. The heat exchanger can be isolated by closing an electronic expansion valve, actuating a refrigerant management valve, or both. Refrigerant charge can be controlled or adjusted by controlling how much liquid refrigerant is driven from the heat exchanger, by letting refrigerant back into the heat exchanger, or both. Heat pumps can be operated in different modes of operation, and segments of refrigerant conduit can be interconnected with various components.

  15. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  16. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  17. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  18. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  19. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  20. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  1. New magnetic refrigeration materials for the liquefaction of hydrogen

    International Nuclear Information System (INIS)

    Gschneidner, K.A.; Takeya, H.; Moorman, J.O.; Pecharsky, V.K.; Malik, S.K.; Zimm, C.B.

    1994-01-01

    Five heavy lanthanide ferromagnetic intermetallic compounds were studied as potential magnetic refrigerants for the liquefaction of hydrogen gas. (Dy 0.5 Er 0.5 )Al 2 and TbNi 2 appear to be better refrigerants than GdPd for a Joule-Brayton cycle refrigerator, while (Gd 0.54 Er 0.46 )AlNi seems to be a suitable refrigerant for an Ericsson cycle refrigerator

  2. 2014 German refrigeration and air conditioning meeting. Proceedings

    International Nuclear Information System (INIS)

    2014-01-01

    The proceedings of the 2014 German refrigeration and air conditioning meeting contain contributions on the following topics: cryotechnology, fundamentals and materials for the refrigeration and heat pump technology, devices and components for the refrigeration and heat pump technology, applications of refrigeration technologies, air conditioning technology and heat pump applications, cryotechnology in biology and medicine, heat transfer and ventilation, guidelines and legal topics, refrigerant fluid - oil mixtures, control and surveillance, simulation and control, ambient air.

  3. Application of Cascade Refrigeration System with Mixing Refrigerant in Cold Air Cutting

    Science.gov (United States)

    Yang, Y.; Tong, M. W.; Yang, G.; Wang, X. P.

    In the mechanical cutting process, the replacement of traditional cutting solution with cold air can avoid the pollution of environment. In order to high efficient the refrigerating device and flexible adjust the temperature of cold air, it is necessary to use cascade refrigeration system to supply cool quantity for the compressed air. The introduction of a two-component non-azeotropic mixing refrigerant into the cryogenic part of the cascade system, can effectively solve the problems of the system working at too high pressure and the volume expanding of refrigerant in case of the cascade refrigeration sets closed down. However, the filling ratio of mixing refrigerants impact on the relationships among the closing down pressure, refrigerating output and refrigerating efficiency. On the basis of computing and experiment, the optimal mixing ratio of refrigerant R22/R13 and a low temperature of -60° were obtained in this study. A cold air injecting device possessing high efficiency in energy saving has also been designed and manufactured. The cold air, generated from this cascade system and employed in a cutting process, takes good comprehensive effects on machining and cutting.

  4. ENERGY STAR Certified Commercial Refrigerators and Freezers

    Data.gov (United States)

    U.S. Environmental Protection Agency — Certified models meet all ENERGY STAR requirements as listed in the Version 4.0 ENERGY STAR Program Requirements for Commercial Refrigerators and Freezers that are...

  5. ENERGY STAR Laboratory Grade Refrigerators and Freezers

    Data.gov (United States)

    U.S. Environmental Protection Agency — Certified models meet all ENERGY STAR requirements as listed in the Version 1.0 ENERGY STAR Program Requirements for Laboratory Grade Refrigerators and Freezers that...

  6. Refrigeration system having standing wave compressor

    Science.gov (United States)

    Lucas, Timothy S.

    1992-01-01

    A compression-evaporation refrigeration system, wherein gaseous compression of the refrigerant is provided by a standing wave compressor. The standing wave compressor is modified so as to provide a separate subcooling system for the refrigerant, so that efficiency losses due to flashing are reduced. Subcooling occurs when heat exchange is provided between the refrigerant and a heat pumping surface, which is exposed to the standing acoustic wave within the standing wave compressor. A variable capacity and variable discharge pressure for the standing wave compressor is provided. A control circuit simultaneously varies the capacity and discharge pressure in response to changing operating conditions, thereby maintaining the minimum discharge pressure needed for condensation to occur at any time. Thus, the power consumption of the standing wave compressor is reduced and system efficiency is improved.

  7. Shuttle Kit Freezer Refrigeration Unit Conceptual Design

    Science.gov (United States)

    Copeland, R. J.

    1975-01-01

    The refrigerated food/medical sample storage compartment as a kit to the space shuttle orbiter is examined. To maintain the -10 F in the freezer kit, an active refrigeration unit is required, and an air cooled Stirling Cycle refrigerator was selected. The freezer kit contains two subsystems, the refrigeration unit, and the storage volume. The freezer must provide two basic capabilities in one unit. One requirement is to store 215 lbs of food which is consumed in a 30-day period by 7 people. The other requirement is to store 128.3 lbs of medical samples consisting of both urine and feces. The unit can be mounted on the lower deck of the shuttle cabin, and will occupy four standard payload module compartments on the forward bulkhead. The freezer contains four storage compartments.

  8. Defrost Temperature Termination in Supermarket Refrigeration Systems

    Energy Technology Data Exchange (ETDEWEB)

    Fricke, Brian A [ORNL; Sharma, Vishaldeep [ORNL

    2011-11-01

    The objective of this project was to determine the potential energy savings associated with implementing demand defrost strategies to defrost supermarket refrigerated display case evaporators, as compared to the widely accepted current practice of controlling display case defrost cycles with a preset timer. The defrost heater energy use of several representative display case types was evaluated. In addition, demand defrost strategies for refrigerated display cases as well as those used in residential refrigerator/freezers were evaluated. Furthermore, it is anticipated that future work will include identifying a preferred defrost strategy, with input from Retail Energy Alliance members. Based on this strategy, a demand defrost system will be designed which is suitable for supermarket refrigerated display cases. Limited field testing of the preferred defrost strategy will be performed in a supermarket environment.

  9. Auto-refrigerating cascade for superconducting applications

    International Nuclear Information System (INIS)

    Forrest, S.M.; Hall, P.H.; Missimer, D.J.

    1987-01-01

    Extremely low temperatures, in the range of 230 to 90 K, are achieved in a single circuit compression refrigeration system operated by a conventional compressor. The system relies upon a series of intermediate cooling stages. The refrigerant is a mixture and the system employs fractional condensation, distillation, phase separation and intermediate heat transfer. Each stage includes the steps of withdrawing a portion of the liquid condensate from the compressed vapor-liquid refrigerant mixture which enters the stage. The withdrawn condensate is then throttled to a lower pressure and is mixed with the refrigerant being recycled to the compressor from the final evaporator. Evaporating the throttled condensate absorbs heat from and at least partially condenses the compressed uncondensed vapor in the compressed mixture

  10. ACTIVATED CARBON/REFRIGERANT COMBINATIONS FOR ...

    African Journals Online (AJOL)

    ES Obe

    2001-03-01

    Mar 1, 2001 ... to solar adsorption refrigeration machines are estimated. ... heat, activated carbon/ammonia requires the use of advanced flat-plate collectors such as those with multiple ... the thermodynamic performance of zeolite-water.

  11. Freezing and refrigerated storage in fisheries

    National Research Council Canada - National Science Library

    Johnston, W. A

    1994-01-01

    ...; the factors affecting cold storage conditions, etc. In addition, the publication describes the methods used to calculate cold storage refrigeration loads as well as the costs of freezing and cold storage...

  12. Simulation of the Energy Saver refrigeration system

    International Nuclear Information System (INIS)

    Barton, H.R. Jr.; Nicholls, J.E.; Mulholland, G.T.

    1981-10-01

    The helium refrigeration for the Energy Saver is supplied by a Central Helium Liquefier and 24 Satellite Refrigerators installed over a 1-1/4 square mile area. An interactive, software simulator has been developed to calculate the refrigeration available from the cryogenic system over a wide range of operating conditions. The refrigeration system simulator incorporates models of the components which have been developed to quantitatively describe changes in system performance. The simulator output is presented in a real-time display which has been used to search for the optimal operating conditions of the Satellite-Central system, to examine the effect of an extended range of operating parameters and to identify equipment modifications which would improve the system performance

  13. Technical development of fluid machinery area

    International Nuclear Information System (INIS)

    Chung, Kyung Nam; Kim, Jin Young; Kim, Yang Ik

    2008-01-01

    In this paper, recent research activity of Hyundai Heavy Industries in the fluid machinery area is introduced. Technical development has been carried out in pumps, turbines, construction equipment, side thrusters, engine lubrication flow, etc. Here the technology of pumps and cooling of construction equipment will be dealt with. We have actively used computational fluid dynamics in the performance analysis of pump models and the design of new models of various industrial pumps or marine pumps. And a cooling analysis system composed of 3D flow analysis and 1D cooling analysis has been established, and applied to the design of cooling systems of new models of excavators and wheel loaders. The above mentioned technology is presented in details, and some future works are mentioned

  14. Utility machinery vibration monitoring guide: Final report

    International Nuclear Information System (INIS)

    Moore, T.T.; Thomas, C.C.

    1987-08-01

    Section I of this guide presents a methodology for developing machinery vibration monitoring programs specifically designed for application within the utility industry. The methodology is designed to enhance a monitoring program and can be used at the outset of program development or as a reference after programs have been started. Section I evaluates all aspects of the monitoring program, including Objectives and Goals, Information Type, Timing and Format, Data Analysis, Data Acquisition, Measurement and Transducer Selection, Personnel and Organization, Program Instrumentation, Program Costs, Program Justification, and Implementation of a Monitoring Program. The methodology is then applied to two host utility plants in Section II, which contains the monitoring programs developed by Gulf States Utilities and Philadelphia Electric Company using this guide. Section III contains the histories of several different types of existing utility monitoring programs. Some of the lessons learned, including the recommendations of these ''mature'' programs for persons starting new programs, are included

  15. Multiple Cylinder Free-Piston Stirling Machinery

    Science.gov (United States)

    Berchowitz, David M.; Kwon, Yong-Rak

    In order to improve the specific power of piston-cylinder type machinery, there is a point in capacity or power where an advantage accrues with increasing number of piston-cylinder assemblies. In the case of Stirling machinery where primary energy is transferred across the casing wall of the machine, this consideration is even more important. This is due primarily to the difference in scaling of basic power and the required heat transfer. Heat transfer is found to be progressively limited as the size of the machine increases. Multiple cylinder machines tend to preserve the surface area to volume ratio at more favorable levels. In addition, the spring effect of the working gas in the so-called alpha configuration is often sufficient to provide a high frequency resonance point that improves the specific power. There are a number of possible multiple cylinder configurations. The simplest is an opposed pair of piston-displacer machines (beta configuration). A three-cylinder machine requires stepped pistons to obtain proper volume phase relationships. Four to six cylinder configurations are also possible. A small demonstrator inline four cylinder alpha machine has been built to demonstrate both cooling operation and power generation. Data from this machine verifies theoretical expectations and is used to extrapolate the performance of future machines. Vibration levels are discussed and it is argued that some multiple cylinder machines have no linear component to the casing vibration but may have a nutating couple. Example applications are discussed ranging from general purpose coolers, computer cooling, exhaust heat power extraction and some high power engines.

  16. Commercial refrigeration - An overview of current status

    OpenAIRE

    Mota Babiloni, Adrián; Navarro Esbri, Joaquin; BARRAGÁN CERVERA, ÁNGEL; Moles, Francisco; Peris, Bernardo; Verdú Martín, Gumersindo Jesús

    2015-01-01

    Commercial Refrigeration comprises food freezing and conservation in retail stores and supermarkets, so, it is one of the most relevant energy consumption sectors, and its relevance is increasing. This paper reviews the most recent developments in commercial refrigeration available in literature and presents a good amount of results provided these systems, covering some advantages and disadvantages in systems and working fluids. Latest researches are focused on energy savings to reduce CO2 in...

  17. A review of linear compressors for refrigeration

    OpenAIRE

    Liang, Kun

    2017-01-01

    Linear compressor has no crank mechanism compared with conventional reciprocating compressor. This allows higher efficiency, oil-free operation, lower cost and smaller size when linear compressors are used for vapour compression refrigeration (VCR) system. Typically, a linear compressor consists of a linear motor (connected to a piston) and suspension springs, operated at resonant frequency. This paper presents a review of linear compressors for refrigeration system. Different designs and mod...

  18. A miniature adsorption3HE refrigerator

    International Nuclear Information System (INIS)

    Duband, L.; Ravex, A.; Lange, A.

    1991-01-01

    A self-contained, recyclable laboratory 3 He refrigerator has been developed. The refrigerator is very compact, portable and is designed to be safe and reliable. The unit can easily be installed on the cold plate of a superfluid 4 He cryostat. Once bolted on the cold plate, operation of the refrigerator is controlled by a single heater. In this new design the refrigerator has a cylindrical geometry. The adsorption pump is placed above the condensation point to prevent convection during the condensation phase and to improve the pumping speed. The inhibition of convection reduces the load on the 4 He bath and increases the condensation efficiency. This refrigeration technique has great potential for space applications. The absence of moving parts makes the system reliable and vibration free. Its simplicity and the absence of external components facilitate its integration on a cryostat. In fact, a rocket-borne 3 He refrigerator has already been successfully flown and has demonstrated the feasibility of this method

  19. Optimizing the Thermoacoustic Pulse Tube Refrigerator Performances

    Directory of Open Access Journals (Sweden)

    E. V. Blagin

    2014-01-01

    Full Text Available The article deals with research and optimization of the thermoacoustic pulse tube refrigerator to reach a cryogenic temperature level. The refrigerator is considered as a thermoacoustic converter based on the modified Stirling cycle with helium working fluid. A sound pressure generator runs as a compressor. Plant model comprises an inner heat exchanger, a regenerative heat exchanger, a pulse tube, hot and cold heat exchangers at its ends, an inertial tube with the throttle, and a reservoir. A model to calculate the pulse tube thermoacoustic refrigerator using the DeltaEC software package has been developed to be a basis for calculation techniques of the pulse tube refrigerator. Momentum, continuity, and energy equations for helium refrigerant are solved according to calculation algorithm taking into account the porosity of regenerator and heat exchangers. Optimization of the main geometric parameters resulted in decreasing temperature of cold heat exchanger by 41,7 K. After optimization this value became equal to 115,01 K. The following parameters have been optimized: diameters of the feeding and pulse tube and heat exchangers, regenerator, lengths of the regenerator and pulse and inertial tubes, as well as initial pressure. Besides, global minimum of temperatures has been searched at a point of local minima corresponding to the optimal values of abovementioned parameters. A global-local minima difference is 0,1%. Optimized geometric and working parameters of the thermoacoustic pulse tube refrigerator are presented.

  20. Computer modeling of commercial refrigerated warehouse facilities

    International Nuclear Information System (INIS)

    Nicoulin, C.V.; Jacobs, P.C.; Tory, S.

    1997-01-01

    The use of computer models to simulate the energy performance of large commercial refrigeration systems typically found in food processing facilities is an area of engineering practice that has seen little development to date. Current techniques employed in predicting energy consumption by such systems have focused on temperature bin methods of analysis. Existing simulation tools such as DOE2 are designed to model commercial buildings and grocery store refrigeration systems. The HVAC and Refrigeration system performance models in these simulations tools model equipment common to commercial buildings and groceries, and respond to energy-efficiency measures likely to be applied to these building types. The applicability of traditional building energy simulation tools to model refrigerated warehouse performance and analyze energy-saving options is limited. The paper will present the results of modeling work undertaken to evaluate energy savings resulting from incentives offered by a California utility to its Refrigerated Warehouse Program participants. The TRNSYS general-purpose transient simulation model was used to predict facility performance and estimate program savings. Custom TRNSYS components were developed to address modeling issues specific to refrigerated warehouse systems, including warehouse loading door infiltration calculations, an evaporator model, single-state and multi-stage compressor models, evaporative condenser models, and defrost energy requirements. The main focus of the paper will be on the modeling approach. The results from the computer simulations, along with overall program impact evaluation results, will also be presented

  1. Machinery failure analysis and troubleshooting practical machinery management for process plants

    CERN Document Server

    Bloch, Heinz P

    2012-01-01

    Solve the machinery failure problems costing you time and money with this classic, comprehensive guide to analysis and troubleshooting  Provides detailed, complete and accurate information on anticipating risk of component failure and avoiding equipment downtime Includes numerous photographs of failed parts to ensure you are familiar with the visual evidence you need to recognize Covers proven approaches to failure definition and offers failure identification and analysis methods that can be applied to virtually all problem situations Demonstr

  2. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  3. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  4. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  5. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  6. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  7. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  8. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  9. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  10. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  11. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  12. Improving the energy efficiency of industrial refrigeration systems

    International Nuclear Information System (INIS)

    Oh, Jin-Sik; Binns, Michael; Park, Sangmin; Kim, Jin-Kuk

    2016-01-01

    Various retrofit design options are available for improving the energy efficiency and economics of industrial refrigeration systems. This study considers a novel retrofit option using a mixed refrigerant (MR) in refrigeration cycles designed for use with a pure refrigerant (PR). In this way energy savings can be realized by switching refrigerants without requiring extensive and expensive reconfiguration of equipment. Hence, the aim here is to test the common thinking that equipment should always be extensively reconfigured when switching from pure to mixed refrigerants. To determine the most energy-efficient operating conditions for each refrigeration design an optimization framework is utilized linking a process simulator with an external optimization method. A case study is presented to demonstrate how the proposed process modeling and optimization framework can be applied and to illustrate the economic benefits of using the retrofit design options considered here. For the case considered in this paper, savings of shaft power required for the refrigeration cycle can be achieved from 16.3% to 27.2% when the pure refrigerant is replaced with mixed refrigerants and operating conditions are re-optimized. - Highlights: • Design methods for the design of refrigeration cycles in retrofit cases. • Consideration of mixed refrigerants to the existing multi-level pure-refrigerant cycles. • Optimization of refrigeration cycles with integrated use of a process simulator with an optimizer.

  13. 46 CFR 169.315 - Ventilation (other than machinery spaces).

    Science.gov (United States)

    2010-10-01

    ... section is satisfied, a vessel having only a natural ventilation system must satisfy the following: V/A≥1... 46 Shipping 7 2010-10-01 2010-10-01 false Ventilation (other than machinery spaces). 169.315... SCHOOL VESSELS Construction and Arrangement Hull Structure § 169.315 Ventilation (other than machinery...

  14. 29 CFR 1915.164 - Ship's propulsion machinery.

    Science.gov (United States)

    2010-07-01

    ... 29 Labor 7 2010-07-01 2010-07-01 false Ship's propulsion machinery. 1915.164 Section 1915.164 Labor Regulations Relating to Labor (Continued) OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR (CONTINUED) OCCUPATIONAL SAFETY AND HEALTH STANDARDS FOR SHIPYARD EMPLOYMENT Ship's Machinery and Piping Systems § 1915.164 Ship's...

  15. A Survey of Fish Production and Processing Machinery in Rivers ...

    African Journals Online (AJOL)

    Survey of fish production and processing machinery in Port Harcourt City Local Government Area of Rivers State, Nigeria was carried out to evaluate the followings: different machines used for fish production and processing, the most acceptable machine, effect of cost of machinery on the fish farmer, whether gender has ...

  16. 46 CFR 78.33-5 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 3 2010-10-01 2010-10-01 false Accidents to machinery. 78.33-5 Section 78.33-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) PASSENGER VESSELS OPERATIONS Reports of Accidents, Repairs, and Unsafe Equipment § 78.33-5 Accidents to machinery. (a) In the event of an accident...

  17. 46 CFR 185.208 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Accidents to machinery. 185.208 Section 185.208 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) SMALL PASSENGER VESSELS (UNDER 100 GROSS TONS) OPERATIONS Marine Casualties and Voyage Records § 185.208 Accidents to machinery. The owner, managing...

  18. 46 CFR 122.208 - Accidents to machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Accidents to machinery. 122.208 Section 122.208 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) SMALL PASSENGER VESSELS CARRYING MORE THAN 150... Voyage Records § 122.208 Accidents to machinery. The owner, managing operator, or master shall report...

  19. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  20. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  1. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  2. Relationship between composition of mixture charged and that in circulation in an auto refrigerant cascade and a J-T refrigerator operating in liquid refrigerant supply mode

    Science.gov (United States)

    Sreenivas, Bura; Nayak, H. Gurudath; Venkatarathnam, G.

    2017-01-01

    The composition of the refrigerant mixture in circulation during steady state operation of J-T and allied refrigerators is not the same as that charged due to liquid hold up in the heat exchangers and phase separators, as well as the differential solubility of different refrigerant components in the compressor lubricating oil. The performance of refrigerators/liquefiers operating on mixed refrigerant cycles is dependent on the mixture composition. It is therefore important to charge the right mixture that results in an optimum composition in circulation during steady state operation. The relationship between the charged and circulating composition has been experimentally studied in a J-T refrigerator operating in the liquid refrigerant supply (LRS) mode and an auto refrigerant cascade refrigerator (with a phase separator) operating in the gas refrigerant supply (GRS) mode. The results of the study are presented in this work. The results show that the method presented earlier for J-T refrigerators operating in GRS mode is also applicable in the case of refrigerators studied in this work.

  3. HFC perspectives in air-conditioning and refrigeration; Perspectives HFC en A/C et refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Fauvarque, P [ELF Atochem, Centre d` Application de Lavallois, 92 (France)

    1998-12-31

    This paper is a series of transparencies dealing with the development of substitutes for the replacement of the R-22 refrigerant in air-conditioning systems (R-134a, R-407C, R-410A), and in industrial refrigeration systems of agriculture and food industry (R-134a and R-404A). (J.S.)

  4. HFC perspectives in air-conditioning and refrigeration; Perspectives HFC en A/C et refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Fauvarque, P. [ELF Atochem, Centre d`Application de Lavallois, 92 (France)

    1997-12-31

    This paper is a series of transparencies dealing with the development of substitutes for the replacement of the R-22 refrigerant in air-conditioning systems (R-134a, R-407C, R-410A), and in industrial refrigeration systems of agriculture and food industry (R-134a and R-404A). (J.S.)

  5. Suitability criterion for a refrigerant for use in solar operated sorption refrigerator

    International Nuclear Information System (INIS)

    Tabassum, S.A.; Mir, M.S.

    1996-01-01

    The thermodynamics of a sorption refrigeration cycle has been discussed representing the cycle on a clapeyron digram. The minimum generation temperature required has been determined using the 'd-a' equation which represents the sorption equilibrium of the pair, and Gibbs free energy relation. The mathematical relation developed provides a totally new basis for determination of suitability of a particular refrigerant. (author)

  6. Suitability criterion for a refrigerant for use in solar operated sorption refrigerator

    Energy Technology Data Exchange (ETDEWEB)

    Tabassum, S A; Mir, M S [University of Engineering and Technology, Lahore (Pakistan). Dept. of Mechanical Engineering

    1996-06-01

    The thermodynamics of a sorption refrigeration cycle has been discussed representing the cycle on a clapeyron digram. The minimum generation temperature required has been determined using the `d-a` equation which represents the sorption equilibrium of the pair, and Gibbs free energy relation. The mathematical relation developed provides a totally new basis for determination of suitability of a particular refrigerant. (author).

  7. Review of magnetic refrigeration system as alternative to conventional refrigeration system

    Science.gov (United States)

    Mezaal, N. A.; Osintsev, K. V.; Zhirgalova, T. B.

    2017-10-01

    The refrigeration system is one of the most important systems in industry. Developers are constantly seeking for how to avoid the damage to the environment. Magnetic refrigeration is an emerging, environment-friendly technology based on a magnetic solid that acts as a refrigerant by magneto-caloric effect (MCE). In the case of ferromagnetic materials, MCE warms as the magnetic moments of the atom are aligned by the application of a magnetic field. There are two types of magnetic phase changes that may occur at the Curie point: first order magnetic transition (FOMT) and second order magnetic transition (SOMT). The reference cycle for magnetic refrigeration is AMR (Active Magnetic Regenerative cycle), where the magnetic material matrix works both as a refrigerating medium and as a heat regenerating medium, while the fluid flowing in the porous matrix works as a heat transfer medium. Regeneration can be accomplished by blowing a heat transfer fluid in a reciprocating fashion through the regenerator made of magnetocaloric material that is alternately magnetized and demagnetized. Many magnetic refrigeration prototypes with different designs and software models have been built in different parts of the world. In this paper, the authors try to shed light on the magnetic refrigeration and show its effectiveness compared with conventional refrigeration methods.

  8. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  9. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  10. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  11. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  12. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  13. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  14. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  15. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  16. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  17. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  18. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  19. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  20. Refrigerated Warehouse Demand Response Strategy Guide

    Energy Technology Data Exchange (ETDEWEB)

    Scott, Doug [VaCom Technologies, San Luis Obispo, CA (United States); Castillo, Rafael [VaCom Technologies, San Luis Obispo, CA (United States); Larson, Kyle [VaCom Technologies, San Luis Obispo, CA (United States); Dobbs, Brian [VaCom Technologies, San Luis Obispo, CA (United States); Olsen, Daniel [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

    2015-11-01

    This guide summarizes demand response measures that can be implemented in refrigerated warehouses. In an appendix, it also addresses related energy efficiency opportunities. Reducing overall grid demand during peak periods and energy consumption has benefits for facility operators, grid operators, utility companies, and society. State wide demand response potential for the refrigerated warehouse sector in California is estimated to be over 22.1 Megawatts. Two categories of demand response strategies are described in this guide: load shifting and load shedding. Load shifting can be accomplished via pre-cooling, capacity limiting, and battery charger load management. Load shedding can be achieved by lighting reduction, demand defrost and defrost termination, infiltration reduction, and shutting down miscellaneous equipment. Estimation of the costs and benefits of demand response participation yields simple payback periods of 2-4 years. To improve demand response performance, it’s suggested to install air curtains and another form of infiltration barrier, such as a rollup door, for the passageways. Further modifications to increase efficiency of the refrigeration unit are also analyzed. A larger condenser can maintain the minimum saturated condensing temperature (SCT) for more hours of the day. Lowering the SCT reduces the compressor lift, which results in an overall increase in refrigeration system capacity and energy efficiency. Another way of saving energy in refrigerated warehouses is eliminating the use of under-floor resistance heaters. A more energy efficient alternative to resistance heaters is to utilize the heat that is being rejected from the condenser through a heat exchanger. These energy efficiency measures improve efficiency either by reducing the required electric energy input for the refrigeration system, by helping to curtail the refrigeration load on the system, or by reducing both the load and required energy input.

  1. A new compressed air energy storage refrigeration system

    International Nuclear Information System (INIS)

    Wang Shenglong; Chen Guangming; Fang Ming; Wang Qin

    2006-01-01

    In this study, a new compressed air energy storage (CAES) refrigeration system is proposed for electrical power load shifting application. It is a combination of a gas refrigeration cycle and a vapor compression refrigeration cycle. Thermodynamic calculations are conducted to investigate the performance of this system. Economic analysis is performed to study the operating cost of the system, and comparison is made with a vapor compression refrigeration system and an ice storage refrigeration system. The results indicate that the CAES refrigeration system has the advantages of simple structure, high efficiency and low operating cost

  2. ARTI refrigerant database. Quarterly report, March--May 1997

    Energy Technology Data Exchange (ETDEWEB)

    Calm, J.M.

    1997-05-01

    The Refrigerant Database is an information system on alternative refrigerants, associated lubricants, and their use in air conditioning and refrigeration. It consolidates and facilitates access to property, compatibility, environmental, safety, application and other information. It provides corresponding information an older refrigerants, to assist manufacturers and those using alternative refrigerants, to make comparisons and determine differences. The underlying purpose is to accelerate phase out of chemical compounds of environmental concern. The database provides bibliographic citations and abstracts for publications that may be useful in research and design of air-conditioning and refrigeration equipment. The complete documents are not included, though some may be added at a later date.

  3. A study of alternative refrigerants for the refrigeration and air conditioning sector in Mauritius

    Science.gov (United States)

    Dreepaul, R. K.

    2017-11-01

    The most frequently used refrigerants in the refrigeration and air conditioning (RAC) sector in Mauritius are currently hydrochlorofluorocarbons (HCFC) and hydrofluorocarbons (HFC). However, because of their strong influence on global warming and the impact of HCFCs on the ozone layer, refrigerants such as ammonia (NH3), carbon dioxide (CO2) and Hydrocarbons (HC), having minimal impact on the environment, are being considered. So far, HCs have only been safely used in domestic refrigeration. Ammonia has been used mainly for industrial refrigeration whereas CO2 is still under study. In this paper, a comparative study of the various feasible alternatives is presented in a survey that was undertaken with major stake holders in the field. The retrofitting possibility of existing equipment was assessed and safety issues associated with each refrigerant were analysed. The major setback of hydrocarbons as a widely accepted refrigerant is its flammability which was considered as a major safety hazard by the majority of respondents in the survey and the main advantages are the improved equipment coefficient of performance (COP) and better TEWI factor. This resulted in a 12 % drop in energy consumption. Despite the excellent thermodynamic properties of ammonia, its use has mainly been confined to industrial refrigeration due to its toxicity. In Mauritius, the performance of ammonia in air conditioning is being evaluated on a pilot basis. The major setback of carbon dioxide as a refrigerant is the high operating pressure which is considered a safety hazard. The high initial investment cost and the lack of qualified maintenance technician is also an issue. The use of CO2 is mainly being considered in the commercial refrigeration sector.

  4. Ultimate refrigerating conditions, behavior turning and a thermodynamic analysis for absorption–compression hybrid refrigeration cycle

    International Nuclear Information System (INIS)

    Zheng Danxing; Meng Xuelin

    2012-01-01

    Highlights: ► Two novel fundamental concepts of the absorption refrigeration cycle were proposed. ► The interaction mechanism of compressor pressure increasing with other key-parameters was investigated. ► A set of optimal operating condition of hybrid refrigeration cycle was found. ► A simulation and investigation for R134a-DMF hybrid refrigeration cycle was performed. - Abstract: The absorption–compression hybrid refrigeration cycle has been considered as an effective approach to reduce the mechanical work consumption by using low-grade heat, such as solar energy. This work aims at studying the thermodynamic mechanism of the hybrid refrigeration cycle. Two fundamental concepts have been proposed, which are the ultimate refrigerating temperature (or the ultimate temperature lift) and the behavior turning. On the basis of that, the interaction mechanism of compressor pressure increasing with other key-parameters and the impact of compressor pressure increasing on the cycle performance have been investigated. The key-parameters include the concentration difference, the circulation ratio of working fluid, etc. The work points out that the hybrid refrigeration cycle performance varies with the change of compressor outlet pressure and depends on which one achieves dominance in the hybrid refrigeration cycle, the absorption sub-system or the compression sub-system. The behavior turning point during parameters changing corresponds to a maximum value of the heat powered coefficient of performance. In this case, the hybrid refrigeration cycle performance is optimal because the low-grade heat utilization is the most effective. In addition, to validate the theoretical analysis, a solar hybrid refrigeration cycle with R134a–DMF as working pair was simulated. The Peng–Robinson equation of state was adopted to calculate thermophysical properties when the reliability assessment of the prediction models on the available literature data of R134a–DMF system had been

  5. Occupational Accidents with Agricultural Machinery in Austria.

    Science.gov (United States)

    Kogler, Robert; Quendler, Elisabeth; Boxberger, Josef

    2016-01-01

    The number of recognized accidents with fatalities during agricultural and forestry work, despite better technology and coordinated prevention and trainings, is still very high in Austria. The accident scenarios in which people are injured are very different on farms. The common causes of accidents in agriculture and forestry are the loss of control of machine, means of transport or handling equipment, hand-held tool, and object or animal, followed by slipping, stumbling and falling, breakage, bursting, splitting, slipping, fall, and collapse of material agent. In the literature, a number of studies of general (machine- and animal-related accidents) and specific (machine-related accidents) agricultural and forestry accident situations can be found that refer to different databases. From the database Data of the Austrian Workers Compensation Board (AUVA) about occupational accidents with different agricultural machinery over the period 2008-2010 in Austria, main characteristics of the accident, the victim, and the employer as well as variables on causes and circumstances by frequency and contexts of parameters were statistically analyzed by employing the chi-square test and odds ratio. The aim of the study was to determine the information content and quality of the European Statistics on Accidents at Work (ESAW) variables to evaluate safety gaps and risks as well as the accidental man-machine interaction.

  6. Influence of Oil on Refrigerant Evaporator Performance

    Science.gov (United States)

    Kim, Jong-Soo; Nagata, Karsuya; Katsuta, Masafumi; Tomosugi, Hiroyuki; Kikuchi, Kouichiro; Horichi, Toshiaki

    In vapor compression refrigeration system using oil-lubricated compressors, some amount of oil is always circulated through the system. Oil circulation can have a significant influence on the evaporator performance of automotive air conditioner which is especially required to cool quickly the car interior after a period standing in the sun. An experimental investigation was carried out an electrically heated horizontal tube to measure local heat transfer coefficients for various flow rates and heat fluxes during forced convection boiling of pure refrigerant R12 and refrigerant-oil mixtures (0-11% oil concentration by weight) and the results were compared with oil free performance. Local heat transfer coefficients increased at the region of low vapor quality by the addition of oil. On the other hand, because the oil-rich liquid film was formed on the heat transfer surface, heat transfer coefficients gradually decreased as the vapor quality became higher. Average heat transfer coefficient reached a maximum at about 4% oil concentration and this trend agreed well with the results of Green and Furse. Previous correlations, using the properties of the refrigerant-oil mixture, could not predict satisfactorily the local heat transfer coefficients data. New correlation modified by oil concentration factor was developed for predicting the corresponding heat transfer coefficient for refrigerant-oil mixture convection boiling. The maximum percent deviation between predicted and measured heat transfer coefficient was within ±30%.

  7. Quantum heat engines and refrigerators: continuous devices.

    Science.gov (United States)

    Kosloff, Ronnie; Levy, Amikam

    2014-01-01

    Quantum thermodynamics supplies a consistent description of quantum heat engines and refrigerators up to a single few-level system coupled to the environment. Once the environment is split into three (a hot, cold, and work reservoir), a heat engine can operate. The device converts the positive gain into power, with the gain obtained from population inversion between the components of the device. Reversing the operation transforms the device into a quantum refrigerator. The quantum tricycle, a device connected by three external leads to three heat reservoirs, is used as a template for engines and refrigerators. The equation of motion for the heat currents and power can be derived from first principles. Only a global description of the coupling of the device to the reservoirs is consistent with the first and second laws of thermodynamics. Optimization of the devices leads to a balanced set of parameters in which the couplings to the three reservoirs are of the same order and the external driving field is in resonance. When analyzing refrigerators, one needs to devote special attention to a dynamical version of the third law of thermodynamics. Bounds on the rate of cooling when Tc→0 are obtained by optimizing the cooling current. All refrigerators as Tc→0 show universal behavior. The dynamical version of the third law imposes restrictions on the scaling as Tc→0 of the relaxation rate γc and heat capacity cV of the cold bath.

  8. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  9. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  10. Overview of the use of refrigerating fluids in thermodynamical machines; Panorama de l`utilisation des fluides frigorigenes dans les machines thermodynamiques

    Energy Technology Data Exchange (ETDEWEB)

    Bernier, J. [Syrec SA (France)

    1996-12-31

    The R-22 refrigerant has been used as a substitute of chlorofluorocarbons in refrigerating machineries but its use will become prohibited very soon. This paper raises the problem of its replacement by other HFC or natural fluids. The problem of natural fluids like ammonia or propane concerns their toxicity, flammability and explosion risk. If a regulation about the greenhouse effect is defined, the performance of the installation will be the decisive parameter for the choice of a refrigerant. R-22 fluid has multiple applications from air-conditioning systems to freezing tunnels and the most suitable substitutes will be different from one application to the other. The different criteria that influence the choice of a refrigerating fluid are: the condensation pressure, the delivery temperature, the compressor volume efficiency, the volume refrigerating power, the coefficient of performance, the variation of vaporization temperature, the global greenhouse effect, the toxicity, flammability and explosive character. A comparison between several fluids has been performed with a single-stage airtight compressor of 10 m{sup 3}/h, at a 40 deg. C constant condensation temperature, a 5 deg. C overheating and a 3 deg. C under-cooling. (J.S.) 6 refs.

  11. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  12. COP improvement of refrigerator/freezers, air-conditioners, and heat pumps using nonazeotropic refrigerant mixtures

    Science.gov (United States)

    Westra, Douglas G.

    1993-01-01

    With the February, 1992 announcement by President Bush to move the deadline for outlawing CFC (chloro-fluoro-carbon) refrigerants from the year 2000 to the year 1996, the refrigeration and air-conditioning industries have been accelerating their efforts to find alternative refrigerants. Many of the alternative refrigerants being evaluated require synthetic lubricants, are less efficient, and have toxicity problems. One option to developing new, alternative refrigerants is to combine existing non-CFC refrigerants to form a nonazeotropic mixture, with the concentration optimized for the given application so that system COP (Coefficient Of Performance) may be maintained or even improved. This paper will discuss the dilemma that industry is facing regarding CFC phase-out and the problems associated with CFC alternatives presently under development. A definition of nonazeotropic mixtures will be provided, and the characteristics and COP benefits of nonazeotropic refrigerant mixtures will be explained using thermodynamic principles. Limitations and disadvantages of nonazeotropic mixtures will be discussed, and example systems using such mixtures will be reviewed.

  13. Current fluctuations in quantum absorption refrigerators

    Science.gov (United States)

    Segal, Dvira

    2018-05-01

    Absorption refrigerators transfer thermal energy from a cold bath to a hot bath without input power by utilizing heat from an additional "work" reservoir. Particularly interesting is a three-level design for a quantum absorption refrigerator, which can be optimized to reach the maximal (Carnot) cooling efficiency. Previous studies of three-level chillers focused on the behavior of the averaged cooling current. Here, we go beyond that and study the full counting statistics of heat exchange in a three-level chiller model. We explain how to obtain the complete cumulant generating function of the refrigerator in a steady state, then derive a partial cumulant generating function, which yields closed-form expressions for both the averaged cooling current and its noise. Our analytical results and simulations are beneficial for the design of nanoscale engines and cooling systems far from equilibrium, with their performance optimized according to different criteria, efficiency, power, fluctuations, and dissipation.

  14. Modelling refrigerant distribution in microchannel evaporators

    DEFF Research Database (Denmark)

    Brix, Wiebke; Kærn, Martin Ryhl; Elmegaard, Brian

    2009-01-01

    of the refrigerant distribution is carried out for two channels in parallel and for two different cases. In the first case maldistribution of the inlet quality into the channels is considered, and in the second case a non-uniform airflow on the secondary side is considered. In both cases the total mixed superheat...... out of the evaporator is kept constant. It is shown that the cooling capacity of the evaporator is reduced significantly, both in the case of unevenly distributed inlet quality and for the case of non-uniform airflow on the outside of the channels.......The effects of refrigerant maldistribution in parallel evaporator channels on the heat exchanger performance are investigated numerically. For this purpose a 1D steady state model of refrigerant R134a evaporating in a microchannel tube is built and validated against other evaporator models. A study...

  15. Model Based Control of Refrigeration Systems

    DEFF Research Database (Denmark)

    Larsen, Lars Finn Sloth

    for automation of these procedures, that is to incorporate some "intelligence" in the control system, this project was started up. The main emphasis of this work has been on model based methods for system optimizing control in supermarket refrigeration systems. The idea of implementing a system optimizing...... control is to let an optimization procedure take over the task of operating the refrigeration system and thereby replace the role of the operator in the traditional control structure. In the context of refrigeration systems, the idea is to divide the optimizing control structure into two parts: A part...... optimizing the steady state operation "set-point optimizing control" and a part optimizing dynamic behaviour of the system "dynamical optimizing control". A novel approach for set-point optimization will be presented. The general idea is to use a prediction of the steady state, for computation of the cost...

  16. Designing a magnet for magnetic refrigeration

    DEFF Research Database (Denmark)

    Bjørk, Rasmus

    This thesis investigates the design and optimization of a permanent magnet assembly for use in a magnetic refrigeration device. The heart of magnetic refrigeration is the adiabatic temperature change in the magnetocaloric material which is caused by the magnetic field. In order to design an ideal...... magnet assembly the magnetocaloric materials and the refrigeration process itself and their properties and performance as a function of magnetic field are investigated. For the magnetocaloric materials it is the magnetization, specific heat capacity and adiabatic temperature that are investigated...... as a function of the magnetic field in order to learn the properties of the optimal magnet assembly. The performance of the AMR as a function of the synchronization and width of the magnetic field with respect to the AMR cycle, the ramp rate and maximum value of the magnetic field are investigated. Other...

  17. Basics of Low-temperature Refrigeration

    CERN Document Server

    Alekseev, A.

    2014-07-17

    This chapter gives an overview of the principles of low temperature refrigeration and the thermodynamics behind it. Basic cryogenic processes - Joule-Thomoson process, Brayton process as well as Claude process - are described and compared. A typical helium laboratory refrigerator based on Claude process is used as a typical example of a low-temperature refrigeration system. A description of the hardware components for helium liquefaction is an important part of this paper, because the design of the main hardware components (compressors, turbines, heat exchangers, pumps, adsorbers, etc.) provides the input for cost calculation, as well as enables to estimate the reliability of the plant and the maintenance expenses. All these numbers are necessary to calculate the economics of a low temperature application.

  18. Materials for Room Temperature Magnetic Refrigeration

    DEFF Research Database (Denmark)

    Hansen, Britt Rosendahl

    Magnetic refrigeration is a cooling method, which holds the promise of being cleaner and more efficient than conventional vapor-compression cooling. Much research has been done during the last two decades on various magnetic materials for this purpose and today a number of materials are considered...... candidates as they fulfill many of the requirements for a magnetic refrigerant. However, no one material stands out and the field is still active with improving the known materials and in the search for a better one. Magnetic cooling is based on the magnetocaloric effect, which causes a magnetic material...... to change its temperature when a magnetic field is applied or removed. For room temperature cooling, one utilizes that the magnetocaloric effect peaks near magnetic phase transitions and so the materials of interest all have a critical temperature within the range of 250 – 310 K. A magnetic refrigerant...

  19. Basics of Low-temperature Refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Alekseev, A [Linde AG, Munich (Germany)

    2014-07-01

    This chapter gives an overview of the principles of low temperature refrigeration and the thermodynamics behind it. Basic cryogenic processes - Joule-Thomoson process, Brayton process as well as Claude process - are described and compared. A typical helium laboratory refrigerator based on Claude process is used as a typical example of a low-temperature refrigeration system. A description of the hardware components for helium liquefaction is an important part of this paper, because the design of the main hardware components (compressors, turbines, heat exchangers, pumps, adsorbers, etc.) provides the input for cost calculation, as well as enables to estimate the reliability of the plant and the maintenance expenses. All these numbers are necessary to calculate the economics of a low temperature application.

  20. Load leveling on industrial refrigeration systems

    Science.gov (United States)

    Bierenbaum, H. S.; Kraus, A. D.

    1982-01-01

    A computer model was constructed of a brewery with a 2000 horsepower compressor/refrigeration system. The various conservation and load management options were simulated using the validated model. The savings available for implementing the most promising options were verified by trials in the brewery. Result show that an optimized methodology for implementing load leveling and energy conservation consisted of: (1) adjusting (or tuning) refrigeration systems controller variables to minimize unnecessary compressor starts, (2) The primary refrigeration system operating parameters, compressor suction pressure, and discharge pressure are carefully controlled (modulated) to satisfy product quality constraints (as well as in-process material cooling rates and temperature levels) and energy evaluating the energy cost savings associated with reject heat recovery, and (4) a decision is made to implement the reject heat recovery system based on a cost/benefits analysis.

  1. Performance characteristics of a quantum Diesel refrigeration cycle

    International Nuclear Information System (INIS)

    He Jizhou; Wang Hao; Liu Sanqiu

    2009-01-01

    The Diesel refrigeration cycle using an ideal quantum gas as the working substance is called quantum Diesel refrigeration cycle, which is different from Carnot, Ericsson, Brayton, Otto and Stirling refrigeration cycles. For ideal quantum gases, a corrected equation of state, which considers the quantum behavior of gas particles, is used instead of the classical one. The purpose of this paper is to investigate the effect of quantum gas as the working substance on the performance of a quantum Diesel refrigeration cycle. It is found that coefficients of performance of the cycle are not affected by the quantum degeneracy of the working substance, which is the same as that of the classical Diesel refrigeration cycle. However, the refrigeration load is different from those of the classical Diesel refrigeration cycle. Lastly, the influence of the quantum degeneracy on the performance characteristics of the quantum Diesel refrigeration cycle operated in different temperature regions is discussed

  2. Refrigerator Optimal Scheduling to Minimise the Cost of Operation

    Directory of Open Access Journals (Sweden)

    Bálint Roland

    2016-12-01

    Full Text Available The cost optimal scheduling of a household refrigerator is presented in this work. The fundamental approach is the model predictive control methodology applied to the piecewise affine model of the refrigerator.

  3. Retail Food Refrigeration and the Phaseout of HCFC-22

    Science.gov (United States)

    Provides information on the HCFC phaseout that is relevant to food retailers, including alternatives to the use of HCFC-22 in retail food refrigeration, other refrigerant regulations, and resources for more information.

  4. A Cold Cycle Dilution Refrigerator for Space Applications, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The cold cycle dilution refrigerator is a continuous refrigerator capable of cooling to temperatures below 100 mK that makes use of a novel thermal magnetic pump....

  5. OPTIONS FOR REDUCING REFRIGERANT EMISSIONS FROM SUPERMARKET SYSTEMS

    Science.gov (United States)

    The report was prepared to assist personnel responsible for the design, construction, and maintenance of retail food refrigeration equipment in making knowledgeable decisions regarding the implementation of refrigerant-emissions-reducing practices and technologies. It characteriz...

  6. Simulation of absorption refrigeration system for automobile application

    Directory of Open Access Journals (Sweden)

    Ramanathan Anand

    2008-01-01

    Full Text Available An automotive air-conditioning system based on absorption refrigeration cycle has been simulated. This waste heat driven vapor absorption refrigeration system is one alternate to the currently used vapour compression refrigeration system for automotive air-conditioning. Performance analysis of vapor absorption refrigeration system has been done by developing a steady-state simulation model to find the limitation of the proposed system. The water-lithium bromide pair is used as a working mixture for its favorable thermodynamic and transport properties compared to the conventional refrigerants utilized in vapor compression refrigeration applications. The pump power required for the proposed vapor absorption refrigeration system was found lesser than the power required to operate the compressor used in the conventional vapor compression refrigeration system. A possible arrangement of the absorption system for automobile application is proposed.

  7. Performance of a Throttle Cycle Refrigerator with Nitrogen-Hydrocarbon and Argon-Hydrocarbon Mixtures

    Science.gov (United States)

    Venkatarathnam, G.; Senthil Kumar, P.; Srinivasa Murthy, S.

    2004-06-01

    Throttle cycle refrigerators are a class of vapor compression refrigerators that can provide refrigeration at cryogenic temperatures and operate with refrigerant mixtures. The performance of our prototype refrigerators with nitrogen-hydrocarbon, nitrogen-hydrocarbon-helium and argon-hydrocarbon refrigerant mixtures is presented in this paper.

  8. Toxicity Data to Determine Refrigerant Concentration Limits

    Energy Technology Data Exchange (ETDEWEB)

    Calm, James M.

    2000-09-30

    This report reviews toxicity data, identifies sources for them, and presents resulting exposure limits for refrigerants for consideration by qualified parties in developing safety guides, standards, codes, and regulations. It outlines a method to calculate an acute toxicity exposure limit (ATEL) and from it a recommended refrigerant concentration limit (RCL) for emergency exposures. The report focuses on acute toxicity with particular attention to lethality, cardiac sensitization, anesthetic and central nervous system effects, and other escape-impairing effects. It addresses R-11, R-12, R-22, R-23, R-113, R-114, R-116, R-123, R-124, R-125, R-134, R-134a, R-E134, R-141b, R-142b, R-143a, R-152a, R-218, R-227ea, R-236fa, R-245ca, R-245fa, R-290, R-500, R-502, R-600a, R-717, and R-744. It summarizes additional data for R-14, R-115, R-170 (ethane), R-C318, R-600 (n-butane), and R-1270 (propylene) to enable calculation of limits for blends incorporating them. The report summarizes the data a nd related safety information, including classifications and flammability data. It also presents a series of tables with proposed ATEL and RCL concentrations-in dimensionless form and the latter also in both metric (SI) and inch-pound (IP) units of measure-for both the cited refrigerants and 66 zerotropic and azeotropic blends. They include common refrigerants, such as R-404A, R-407C, R-410A, and R-507A, as well as others in commercial or developmental status. Appendices provide profiles for the cited single-compound refrigerants and for R-500 and R-502 as well as narrative toxicity summaries for common refrigerants. The report includes an extensive set of references.

  9. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  10. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  11. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  12. Automation facilities for agricultural machinery control

    Directory of Open Access Journals (Sweden)

    A. Yu. Izmaylov

    2017-01-01

    Full Text Available The possibility of use of the automation equipment for agricultural machinery control is investigated. The authors proposed solutions on creation of the centralized unified automated information system for mobile aggregates management. In accordance with the modern requirements this system should be open, integrated into the general schema of agricultural enterprise control. Standard hardware, software and communicative features should be realized in tasks of monitoring and control. Therefore the schema should be get with use the unified modules and Russian standards. The complex multivariate unified automated control system for different objects of agricultural purpose based on block and modular creation should correspond to the following principles: high reliability, simplicity of service, low expenses in case of operation, the short payback period connected to increase in productivity, the reduced losses when harvesting, postharvest processing and storage, the improved energetic indices. Technological processes control in agricultural production is exercised generally with feedback. The example without feedback is program control by temperature in storage in case of the cooling mode. Feedback at technological processes control in agricultural production allows to optimally solve a problem of rational distribution of functions in man-distributed systems and forming the intelligent ergonomic interfaces, consistent with professional perceptions of decision-makers. The negative feedback created by the control unit allows to support automatically a quality index of technological process at the set level. The quantitative analysis of a production situation base itself upon deeply formalized basis of computer facilities that promotes making of the optimal solution. Information automated control system introduction increases labor productivity by 40 percent, reduces energetic costs by 25 percent. Improvement of quality of the executed technological

  13. THE STIRLING GAS REFRIGERATING MACHINE MECHANICAL DESIGN IMPROVING

    Directory of Open Access Journals (Sweden)

    V. V. Trandafilov

    2016-06-01

    Full Text Available To improve the mechanical design of the piston Stirling gas refrigeration machine the structural optimization of rotary vane Stirling gas refrigeration machine is carried out. This paper presents the results of theoretical research. Analysis and prospects of rotary vane Stirling gas refrigeration machine for domestic and industrial refrigeration purpose are represented. The results of a patent search by mechanisms of transformation of rotary vane machines are discussed.

  14. THE STIRLING GAS REFRIGERATING MACHINE MECHANICAL DESIGN IMPROVING

    Directory of Open Access Journals (Sweden)

    V. V. Trandafilov

    2016-02-01

    Full Text Available To improve the mechanical design of the piston Stirling gas refrigeration machine the structural optimization of rotary vane Stirling gas refrigeration machine is carried out. This paper presents the results of theoretical research. Analysis and prospects of rotary vane Stirling gas refrigeration machine for domestic and industrial refrigeration purpose are represented. The results of a patent search by mechanisms of transformation of rotary vane machines are discussed

  15. Designing a magnet for magnetic refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Bjoerk, R

    2010-03-15

    This thesis investigates the design and optimization of a permanent magnet assembly for use in a magnetic refrigeration device. The heart of magnetic refrigeration is the adiabatic temperature change in the magnetocaloric material which is caused by the magnetic field. In order to design an ideal magnet assembly the magnetocaloric materials and the refrigeration process itself and their properties and performance as a function of magnetic field are investigated. For the magnetocaloric materials it is the magnetization, specific heat capacity and adiabatic temperature that are investigated as functions of the magnetic field. Following this the process utilized by a magnetic refrigerator to provide cooling is investigated using a publicly available one dimensional numerical model. This process is called active magnetic regeneration (AMR). The aim is to determine the performance of the AMR as a function of the magnetic field in order to learn the properties of the optimal magnet assembly. The performance of the AMR as a function of the synchronization and width of the magnetic field with respect to the AMR cycle, the ramp rate and maximum value of the magnetic field are investigated. Other published magnet designs used in magnetic refrigeration devices are also evaluated, using a figure of merit based on the properties of the investigated magnetocaloric materials, to learn the properties of the best magnet designs to date. Following this investigation the Halbach cylinder, which is a hollow permanent magnet cylinder with a rotating remanent flux density, is investigated in detail as it forms the basis of many magnet designs used in magnetic refrigeration. Here the optimal dimensions of a Halbach cylinder, as well as analytical calculations of the magnetic field for a Halbach cylinder of infinite length, are presented. Once it has been determined which properties are desirable for a magnet used in magnetic refrigeration the design of a new magnet is described. This is

  16. Boiling Heat Transfer to Halogenated Hydrocarbon Refrigerants

    Science.gov (United States)

    Yoshida, Suguru; Fujita, Yasunobu

    The current state of knowledge on heat transfer to boiling refrigerants (halogenated hydrocarbons) in a pool and flowing inside a horizontal tube is reviewed with an emphasis on information relevant to the design of refrigerant evaporators, and some recommendations are made for future research. The review covers two-phase flow pattern, heat transfer characteristics, correlation of heat transfer coefficient, influence of oil, heat transfer augmentation, boiling from tube-bundle, influence of return bend, burnout heat flux, film boiling, dryout and post-dryout heat transfer.

  17. Energy analysis of a supermarket refrigeration system

    DEFF Research Database (Denmark)

    Jensen, Jakob Munch; Jakobsen, Arne; Rasmussen, Bjarne D.

    1999-01-01

    From 1995 to 1998, an energy test method for supermarket refrigeration systems was developed in a project financed by the Danish Energy Agency. The purpose of the energy test method is to provide the means for evaluating the energy efficiency of these systems. The test method requires measurements...... of air temperatures and energy consumption to be carried out on the selected supermarket refrigeration system. In addition to the measurements required by the method, more measurements of individual energy consumptions have been carried in the case described in this paper. The purpose of the additional...

  18. Dilution refrigeration with multiple mixing chambers

    International Nuclear Information System (INIS)

    Coops, G.M.

    1981-01-01

    A dilution refrigerator is an instrument to reach temperatures in the mK region in a continuous way. The temperature range can be extended and the cooling power can be enlarged by adding an extra mixing chamber. In this way we obtain a double mixing chamber system. In this thesis the theory of the multiple mixing chamber is presented and tested on its validity by comparison with the measurements. Measurements on a dilution refrigerator with a circulation rate up to 2.5 mmol/s are also reported. (Auth.)

  19. Systematic modelling and simulation of refrigeration systems

    DEFF Research Database (Denmark)

    Rasmussen, Bjarne D.; Jakobsen, Arne

    1998-01-01

    The task of developing a simulation model of a refrigeration system can be very difficult and time consuming. In order for this process to be effective, a systematic method for developing the system model is required. This method should aim at guiding the developer to clarify the purpose...... of the simulation, to select appropriate component models and to set up the equations in a well-arranged way. In this paper the outline of such a method is proposed and examples showing the use of this method for simulation of refrigeration systems are given....

  20. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  1. Literature survey of heat transfer enhancement techniques in refrigeration applications

    Energy Technology Data Exchange (ETDEWEB)

    Jensen, M.K.; Shome, B. [Rensselaer Polytechnic Inst., Troy, NY (United States). Dept. of Mechanical Engineering, Aeronautical Engineering and Mechanics

    1994-05-01

    A survey has been performed of the technical and patent literature on enhanced heat transfer of refrigerants in pool boiling, forced convection evaporation, and condensation. Extensive bibliographies of the technical literature and patents are given. Many passive and active techniques were examined for pure refrigerants, refrigerant-oil mixtures, and refrigerant mixtures. The citations were categorized according to enhancement technique, heat transfer mode, and tube or shell side focus. The effects of the enhancement techniques relative to smooth and/or pure refrigerants were illustrated through the discussion of selected papers. Patented enhancement techniques also are discussed. Enhanced heat transfer has demonstrated significant improvements in performance in many refrigerant applications. However, refrigerant mixtures and refrigerant-oil mixtures have not been studied extensively; no research has been performed with enhanced refrigerant mixtures with oil. Most studies have been of the parametric type; there has been inadequate examination of the fundamental processes governing enhanced refrigerant heat transfer, but some modeling is being done and correlations developed. It is clear that an enhancement technique must be optimized for the refrigerant and operating condition. Fundamental processes governing the heat transfer must be examined if models for enhancement techniques are to be developed; these models could provide the method to optimize a surface. Refrigerant mixtures, with and without oil present, must be studied with enhancement devices; there is too little known to be able to estimate the effects of mixtures (particularly NARMs) with enhanced heat transfer. Other conclusions and recommendations are offered.

  2. The kinematics of machinery outlines of a theory of machines

    CERN Document Server

    Reuleaux, Franz

    2012-01-01

    A classic on the kinematics of machinery, this volume was written by the Father of Kinematics. Reuleaux writes with authority and precision, developing the subject from its fundamentals. 450 figures. 1876 edition.

  3. Targeting Cell Polarity Machinery to Exhaust Breast Cancer Stem Cells

    Science.gov (United States)

    2017-10-01

    AWARD NUMBER: W81XWH-15-1-0644 TITLE: Targeting Cell Polarity Machinery to Exhaust Breast Cancer Stem Cells PRINCIPAL INVESTIGATOR: Chun-Ju...Targeting Cell Polarity Machinery to Exhaust Breast Cancer Stem Cells 5a. CONTRACT NUMBER 5b. GRANT NUMBER W81XWH-15-1-0644 5c. PROGRAM ELEMENT...Unlimited 13. SUPPLEMENTARY NOTES 14. ABSTRACT Cancer stem cells (CSCs), a cell population with acquired perpetuating self-renewal properties which

  4. Intelligence and the machinery of government: conceptualizing the intelligence community

    OpenAIRE

    Davies, PHJ

    2010-01-01

    This article argues that the failure to address intelligence agencies as public organizations part and parcel with the overt machinery of government constitutes a significant lacuna both in the specialist study of intelligence and the broader discipline of public administration studies. The role and status of intelligence institutions as aspects of the machinery of central government is examined, along with the prospects of certain key paradigms in the field for understanding those institutio...

  5. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  6. Fault diagnosis and refrigerant leak detection in vapour compression refrigeration systems

    Energy Technology Data Exchange (ETDEWEB)

    Tassou, S.A.; Grace, I.N. [Brunel University, Uxbridge (United Kingdom). Department of Mechanical Engineering

    2005-08-01

    The environmental impact of refrigeration systems can be reduced by operation at higher efficiency and reduction of refrigerant leakage. Refrigerant loss contributes both directly and indirectly to global warming through inefficient system operation, increased power consumption and greenhouse gas emissions and higher maintenance costs. Existing sensor-based leak detection methods are limited by the inability to detect gradual leakage and the need for careful sensor location. There is a requirement for a real-time performance monitoring approach to leak detection and fault diagnosis which overcomes these disadvantages. This paper reports on the development of a fault diagnosis and refrigerant leak detection system based on artificial intelligence and real-time performance monitoring. The system has been used successfully to distinguish between faulty and fault free operation, steady-state and transient operation, leakage and over charge conditions. Work currently underway is aimed at testing additional fault conditions and establishing further rules to distinguish between these patterns. (author)

  7. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  8. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  9. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  10. In vitro conjunctival incision repair by temperature-controlled laser soldering.

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-01-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  11. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  12. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  13. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  14. Modeling of in-vehicle magnetic refrigeration

    DEFF Research Database (Denmark)

    Olsen, Ulrik Lund; Bahl, Christian R.H.; Engelbrecht, Kurt

    2014-01-01

    A high-performance magnetic refrigeration device is considered as a potential technology for in-vehicle air conditioners in electric vehicles. The high power consumption of a conventional air conditioner in an electric vehicle has considerable impacts on cruising distance. For this purpose...

  15. Modeling of In-vehicle Magnetic refrigeration

    DEFF Research Database (Denmark)

    Olsen, Ulrik Lund; Bahl, Christian; Engelbrecht, Kurt

    2012-01-01

    A high-performance magnetic refrigeration device is considered as a potential technology for in-vehicle air conditioners in electric vehicles. The high power consumption of a conventional air conditioner in an electric vehicle has considerable impacts on cruising distance. For this purpose...

  16. A versatile magnetic refrigeration test device

    DEFF Research Database (Denmark)

    Bahl, Christian Robert Haffenden; Petersen, Thomas Frank; Pryds, Nini

    2008-01-01

    of the applied magnetic field. An advanced two-dimensional numerical model has previously been implemented in order to help in the optimization of the design of a refrigeration test device. Qualitative agreement between the results from model and the experimental results is demonstrated for each of the four...... different parameter variations mentioned above. (C) 2008 American Institute of Physics....

  17. Basic dynamics of split Stirling refrigerators

    NARCIS (Netherlands)

    Waele, de A.T.A.M.; Liang, W.

    2008-01-01

    The basic features of the split Stirling refrigerator, driven by a linear compressor, are described. Friction of the compressor piston and of the regenerator, and the viscous losses due to the gas flow through the regenerator matrix are taken into account. The temp. at the cold end is an input

  18. New possibilities for non-CFC refrigeration

    International Nuclear Information System (INIS)

    Lorentzen, G.; Pettersen, J.

    1992-01-01

    There is a widespread belief that the only viable refrigerants in most applications are new fluorocarbon chemicals. This trend will eventually result in emissions of several hundred thousand tons of new chemicals to the atmosphere each year, involving potential risk of unforeseen environmental effects. A number of other options exist, or may be developed. By using substances which already have a natural role in our ecosystems, some uncertainty related to the critical issue of our future environment can be avoided. By development and practical testing of a laboratory prototype it has been documented that carbon dioxide is a viable refrigerant in automobile air conditioners, completely solving all environmental problems associated with such systems. General use of CO 2 as a refrigerant may provide a number of advantages in the present situation, both from an environmental and practical point of view. It is our considered opinion that the old carbon dioxide offers a key to the complete solution of the environmental problems in many areas of refrigeration usage. 19 refs., 8 figs., 5 tabs

  19. Nuclear heat sources for cryogenic refrigerator applications

    International Nuclear Information System (INIS)

    Raab, B.; Schock, A.; King, W.G.; Kline, T.; Russo, F.A.

    1975-01-01

    Spacecraft cryogenic refrigerators require thermal inputs on the order of 1000 W. First, the characteristics of solar-electric and radioisotope heat source systems for supplying this thermal input are compared. Then the design of a 238 Pu heat source for this application is described, and equipment for shipping and handling the heat source is discussed. (LCL)

  20. Modular Modeling of a Refrigeration Container

    DEFF Research Database (Denmark)

    Kjær Sørensen, Kresten; Juel Skovrup, Morten; M. Jessen, Lars

    2015-01-01

    This paper presents the modeling of a refrigeration container for use as a reference for energy-optimizing controller design. The model is based on first principles in order to conserve mass and energy, but various assumptions are used to simplify the equations, resulting in a unified model for t...

  1. Materials for room temperature magnetic refrigeration

    Energy Technology Data Exchange (ETDEWEB)

    Rosendahl Hansen, B.

    2010-07-15

    Magnetic refrigeration is a cooling method, which holds the promise of being cleaner and more efficient than conventional vapor-compression cooling. Much research has been done during the last two decades on various magnetic materials for this purpose and today a number of materials are considered candidates as they fulfill many of the requirements for a magnetic refrigerant. However, no one material stands out and the field is still active with improving the known materials and in the search for a better one. Magnetic cooling is based on the magnetocaloric effect, which causes a magnetic material to change its temperature when a magnetic field is applied or removed. For room temperature cooling, one utilizes that the magnetocaloric effect peaks near magnetic phase transitions and so the materials of interest all have a critical temperature within the range of 250 - 310 K. A magnetic refrigerant should fulfill a number of criteria, among these a large magnetic entropy change, a large adiabatic temperature change, preferably little to no thermal or magnetic hysteresis and the material should have the stability required for long term use. As the temperature range required for room temperature cooling is some 40 - 50 K, the magnetic refrigerant should also be able to cover this temperature span either by exhibiting a very broad peak in magnetocaloric effect or by providing the opportunity for creating a materials series with varying transition temperatures. (Author)

  2. Air Conditioning and Refrigeration. Book One.

    Science.gov (United States)

    Wantiez, Gary W.

    Designed to provide students with the basic skills for an occupation in air conditioning and refrigeration, this curriculum guide includes seven major areas, each consisting of one or more units of instruction. These areas and their respective units are titled as follows: Orientation (history and development, and job opportunities), Safety…

  3. Eco-Friendly Alternative Refrigeration Systems

    Indian Academy of Sciences (India)

    Home; Journals; Resonance – Journal of Science Education; Volume 6; Issue 10. Eco-Friendly Alternative Refrigeration Systems - Magnetic and ... Author Affiliations. S S Verma1. Deptartment of Physics, Sant Longowal Institute of Engineering and Technology Longowal, District Sangrur, Punjab 148 106, India.

  4. Detecting Fan Faults in refrigerated Cabinets

    DEFF Research Database (Denmark)

    Thybo, C.; Rasmussen, B.D.; Izadi-Zamanabadi, Roozbeh

    2002-01-01

    Fault detection in supermarket refrigeration systems is an important topic due to both economic and food safety reasons. If faults can be detected and diagnosed before the system drifts outside the specified operational envelope, service costs can be reduced and in extreme cases the costly discar...

  5. High performance magnetocaloric perovskites for magnetic refrigeration

    DEFF Research Database (Denmark)

    Bahl, Christian R. H.; Velazquez, David; Nielsen, Kaspar K.

    2012-01-01

    We have applied mixed valance manganite perovskites as magnetocaloric materials in a magnetic refrigeration device. Relying on exact control of the composition and a technique to process the materials into single adjoined pieces, we have observed temperature spans above 9 K with two materials...

  6. Hybrid control of the distributed refrigeration system

    DEFF Research Database (Denmark)

    Chen, L.; Wisniewski, R.

    2010-01-01

    consumption. The paper focuses on synchronization dynamics of the refrigeration system modeled as a piecewise-affine switched system. System behaviors are analyzed using chaos theory. The synchronization phenomenon is interpreted as a stable low-period orbit; if the system has a high-order periodic orbit...

  7. The Absorption Refrigerator as a Thermal Transformer

    Science.gov (United States)

    Herrmann, F.

    2009-01-01

    The absorption refrigerator can be considered a thermal transformer, that is, a device that is analogous to the electric transformer. The analogy is based on the correspondence between the extensive quantities, entropy and electric charge and the intensive variables, temperature and electric potential. (Contains 1 footnote and 6 figures.)

  8. The absoption refrigerator as a thermal transformer

    OpenAIRE

    Herrmann, Friedrich

    2008-01-01

    The absorption refrigerator can be considered a thermal transformer, i.e. a device that is analogous to the electric transformer. The analogy is based on a correspondence between the extensive quantities entropy and electric charge and that of the intensive variables temperature and electric potential.

  9. The absorption refrigerator as a thermal transformer

    International Nuclear Information System (INIS)

    Herrmann, F

    2009-01-01

    The absorption refrigerator can be considered a thermal transformer, that is, a device that is analogous to the electric transformer. The analogy is based on the correspondence between the extensive quantities, entropy and electric charge and the intensive variables, temperature and electric potential

  10. Online load forecasting for supermarket refrigeration

    DEFF Research Database (Denmark)

    Bacher, Peder; Madsen, Henrik; Nielsen, Henrik Aalborg

    2013-01-01

    This paper presents a study of models for forecasting the load for supermarket refrigeration. The data used for building the forecasting models consists of load measurements, local climate measurements and weather forecasts. The load measurements are from a supermarket located in a village...

  11. Eco-Friendly Alternative Refrigeration Systems

    Indian Academy of Sciences (India)

    frigerants in mechanical refrigeration system has become a subject of great ..... In 1823, Seebeck discovered that a voltage drop appears across a junction (i.e., a .... delta function in the transport distribution centered about 2-3. KT from the ...

  12. Energy labelling of refrigerated display cases

    NARCIS (Netherlands)

    Sluis, S.M. van der

    1996-01-01

    Energy labelling of refrigerated display cabinets is a method to quickly assess the energy efficiency of a certain cabinet compared to the market average consumptions for similar cabinets. Labelling is also a method to obtain comparable data on cabinets from different manufacturers, which has time

  13. Analysis of refrigerant mal-distribution

    DEFF Research Database (Denmark)

    Kærn, Martin Ryhl; Elmegaard, Brian

    2009-01-01

    to be two straight tubes. The refrigerant maldistribution is then induced to the evaporator by varying the vapor quality at the inlet to each tube and the air-flow across each tube. Finally it is shown that mal-distribution can be compensated by an intelligent distributor, that ensures equal superheat...

  14. Numerical simulation of pulse-tube refrigerators

    NARCIS (Netherlands)

    Lyulina, I.A.; Mattheij, R.M.M.; Tijsseling, A.S.; Waele, de A.T.A.M.

    2004-01-01

    A new numerical model has been introduced to study steady oscillatory heat and mass transfer in the tube section of a pulse-tube refrigerator. Conservation equations describing compressible gas flow in the tube are solved numerically, using high resolution schemes. The equation of conservation of

  15. Energy consumption of small refrigerators - Information leaflet; Merkblatt Kleinkuehlschrank

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2009-07-01

    In this leaflet published by the Swiss Federal Office of Energy (SFOE), the energy consumption of small refrigerators with a capacity of less than 100 litres is reported on. Such small refrigerators are often used in hotel rooms or in campers. It is noted that, in comparison, a typical, 150 litre class A++ domestic refrigerator uses only a fraction of the amount of energy used by such small refrigerators. The results of measurements made according to EN 153 and ISO 15502 norms are discussed. Recommendations are made on the purchase and operation of these small refrigerators.

  16. Influence of the nozzle angle on refrigeration performance of a gas wave refrigerator

    Science.gov (United States)

    Liu, P.; Zhu, Y.; Wang, H.; Zhu, C.; Zou, J.; Wu, J.; Hu, D.

    2017-05-01

    A gas wave refrigerator (GWR) is a novel refrigerating device that refrigerates a medium by shock waves and expansion waves generated by gas pressure energy. In a typical GWR, the injection energy losses between the nozzle and the expansion tube are essential factors which influence the refrigeration efficiency. In this study, numerical simulations are used to analyze the underlying mechanism of the injection energy losses. The results of simulations show that the vortex loss, mixing energy loss, and oblique shock wave reflection loss are the main factors contributing to the injection energy losses in the expansion tube. Furthermore, the jet angle of the gas is found to dominate the injection energy losses. Therefore, the optimum jet angle is theoretically calculated based on the velocity triangle method. The value of the optimum jet angle is found to be 4^{circ }, 8^{circ }, and 12^{circ } when the refrigeration efficiency is the first-order, second-order, and third-order maximum value over all working ranges of jet frequency, respectively. Finally, a series of experiments are conducted with the jet angle ranging from -4^{circ } to 12^{circ } at a constant expansion ratio. The results indicate the optimal jet angle obtained by the experiments is in good agreement with the calculated value. The isentropic refrigeration efficiency increased by about 4 % after the jet angle was optimized.

  17. Applicability of ASST-A helium refrigeration system for JLab End Station Refrigerator

    Science.gov (United States)

    Hasan, N.; Knudsen, P.; Ganni, V.

    2017-12-01

    The MØLLER experiment at Jefferson Lab (JLab) is a high power (5 kW) liquid hydrogen target scheduled to be operational in the 12 GeV-era. At present, cryogenic loads and targets at three of JLab’s four experimental halls are supported by the End Station Refrigerator (ESR) - a CTI/Helix 1.5 kW 4.5 K refrigerator. It is not capable of supporting the high power target load and a capacity upgrade of the ESR cryogenic system is essential. The ASST-A helium refrigeration system is a 4 kW 4.5 K refrigerator. It was designed and used for the Superconducting Super Collider Lab (SSCL) magnet string test and later obtained by JLab after the cancellation of that project. The modified ASST-A refrigeration system, which will be called ESR-II along with a support flow from JLab’s Central Helium Liquefier (CHL) is considered as an option for the End Station Refrigerator capacity upgrade. The applicability of this system for ESR-II under varying load conditions is investigated. The present paper outlines the findings of this process study.

  18. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  19. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  20. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  1. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  2. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  3. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

    Science.gov (United States)

    Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

    2018-03-01

    The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

  4. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  5. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  6. Dissolution ad uptake of cadmium from dental gold solder alloy implants

    International Nuclear Information System (INIS)

    Bergman, B.; Bergman, M.; Soeremark, R.

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

  7. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  8. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  9. IEA Annex 26: Advanced Supermarket Refrigeration/Heat Recovery Systems

    Energy Technology Data Exchange (ETDEWEB)

    Baxter, VAN

    2003-05-19

    With increased concern about the impact of refrigerant leakage on global warming, a number of new supermarket refrigeration system configurations requiring significantly less refrigerant charge are being considered. In order to help promote the development of advanced systems and expand the knowledge base for energy-efficient supermarket technology, the International Energy Agency (IEA) established IEA Annex 26 (Advanced Supermarket Refrigeration/Heat Recovery Systems) under the ''IEA Implementing Agreement on Heat Pumping Technologies''. Annex 26 focuses on demonstrating and documenting the energy saving and environmental benefits of advanced systems design for food refrigeration and space heating and cooling for supermarkets. Advanced in this context means systems that use less energy, require less refrigerant and produce lower refrigerant emissions. Stated another way, the goal is to identify supermarket refrigeration and HVAC technology options that reduce the total equivalent warming impact (TEWI) of supermarkets by reducing both system energy use (increasing efficiency) and reducing total refrigerant charge. The Annex has five participating countries: Canada, Denmark, Sweden, the United Kingdom, and the United States. The working program of the Annex has involved analytical and experimental investigation of several candidate system design approaches to determine their potential to reduce refrigerant usage and energy consumption. Advanced refrigeration system types investigated include the following: distributed compressor systems--small parallel compressor racks are located in close proximity to the food display cases they serve thus significantly shortening the connecting refrigerant line lengths; secondary loop systems--one or more central chillers are used to refrigerate a secondary coolant (e.g. brine, ice slurry, or CO2) that is pumped to the food display cases on the sales floor; self-contained display cases--each food display case

  10. Comparison of implant-abutment interface misfits after casting and soldering procedures.

    Science.gov (United States)

    Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

    2014-04-01

    The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

  11. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  12. Theoretical study on a novel dual-nozzle ejector enhanced refrigeration cycle for household refrigerator-freezers

    International Nuclear Information System (INIS)

    Zhou, Mengliu; Wang, Xiao; Yu, Jianlin

    2013-01-01

    Highlights: • A novel dual-nozzle ejector enhanced refrigeration cycle is proposed. • The novel cycle is evaluated by using the developed mathematical model. • The results show the performances of the novel cycle could be significantly improved. • The novel cycle shows its promise in household refrigerator-freezers applications. - Abstract: In this study, a novel dual-nozzle ejector enhanced refrigeration cycle is presented for dual evaporator household refrigerator-freezers. The proposed ejector equipped with two nozzles can efficiently recover the expansion work from cycle throttling processes and enhance cycle performances. The performances of the novel cycle are evaluated by using the developed mathematical model, and then compared with that of the conventional ejector enhanced refrigeration cycle and basic vapor-compression refrigeration cycle. The simulation results show that for the given operating conditions, the coefficient of performance (COP) of the novel cycle using refrigerant R134a is improved by 22.9–50.8% compared with that of the basic vapor-compression refrigeration cycle, and the COP improvement is 10.5–30.8% larger than that of the conventional ejector enhanced refrigeration cycle. The further simulation results of the novel cycle using refrigerant R600a indicate that the cycle COP and volumetric refrigeration capacity could be significantly improved

  13. 46 CFR 91.15-1 - Standards in inspection of hulls, boilers, and machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Standards in inspection of hulls, boilers, and machinery... hulls, boilers, and machinery. In the inspection of hulls, boilers, and machinery of vessels, the..., respecting material and inspection of hulls, boilers, and machinery, and the certificate of classification...

  14. 46 CFR 189.15-1 - Standards in inspection of hulls, boilers, and machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Standards in inspection of hulls, boilers, and machinery... inspection of hulls, boilers, and machinery. In the inspection of hulls, boilers, and machinery of vessels... chapter, respecting material and construction of hulls, boilers, and machinery, and certificate of...

  15. 46 CFR 71.15-1 - Standards in inspection of hulls, boilers, and machinery.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 3 2010-10-01 2010-10-01 false Standards in inspection of hulls, boilers, and machinery..., boilers, and machinery. In the inspection of hulls, boilers, and machinery of vessels, the standards... and inspection of hulls, boilers, and machinery, and the certificate of classification referring...

  16. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  17. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  18. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  19. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

  20. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  1. 46 CFR 129.340 - Cable and wiring.

    Science.gov (United States)

    2010-10-01

    ... low temperature and high humidity, if installed in refrigerated compartments; (8) Be located outside a... as far as practicable from areas at high risk for fire, such as galleys, laundries, and machinery... flexible lead or conductor; or (4) Be splice-soldered, brazed, or welded to a flexible lead or conductor...

  2. Fault size classification of rotating machinery using support vector machine

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Y. S.; Lee, D. H.; Park, S. K. [Korea Hydro and Nuclear Power Co. Ltd., Daejeon (Korea, Republic of)

    2012-03-15

    Studies on fault diagnosis of rotating machinery have been carried out to obtain a machinery condition in two ways. First is a classical approach based on signal processing and analysis using vibration and acoustic signals. Second is to use artificial intelligence techniques to classify machinery conditions into normal or one of the pre-determined fault conditions. Support Vector Machine (SVM) is well known as intelligent classifier with robust generalization ability. In this study, a two-step approach is proposed to predict fault types and fault sizes of rotating machinery in nuclear power plants using multi-class SVM technique. The model firstly classifies normal and 12 fault types and then identifies their sizes in case of predicting any faults. The time and frequency domain features are extracted from the measured vibration signals and used as input to SVM. A test rig is used to simulate normal and the well-know 12 artificial fault conditions with three to six fault sizes of rotating machinery. The application results to the test data show that the present method can estimate fault types as well as fault sizes with high accuracy for bearing an shaft-related faults and misalignment. Further research, however, is required to identify fault size in case of unbalance, rubbing, looseness, and coupling-related faults.

  3. Fault size classification of rotating machinery using support vector machine

    International Nuclear Information System (INIS)

    Kim, Y. S.; Lee, D. H.; Park, S. K.

    2012-01-01

    Studies on fault diagnosis of rotating machinery have been carried out to obtain a machinery condition in two ways. First is a classical approach based on signal processing and analysis using vibration and acoustic signals. Second is to use artificial intelligence techniques to classify machinery conditions into normal or one of the pre-determined fault conditions. Support Vector Machine (SVM) is well known as intelligent classifier with robust generalization ability. In this study, a two-step approach is proposed to predict fault types and fault sizes of rotating machinery in nuclear power plants using multi-class SVM technique. The model firstly classifies normal and 12 fault types and then identifies their sizes in case of predicting any faults. The time and frequency domain features are extracted from the measured vibration signals and used as input to SVM. A test rig is used to simulate normal and the well-know 12 artificial fault conditions with three to six fault sizes of rotating machinery. The application results to the test data show that the present method can estimate fault types as well as fault sizes with high accuracy for bearing an shaft-related faults and misalignment. Further research, however, is required to identify fault size in case of unbalance, rubbing, looseness, and coupling-related faults

  4. Analysis of Refrigeration Cycle Performance with an Ejector

    Directory of Open Access Journals (Sweden)

    Wani J. R.

    2016-01-01

    Full Text Available A conventional refrigeration cycle uses expansion device between the condenser and the evaporator which has losses during the expansion process. A refrigeration cycle with ejector is a promising modification to improve the performance of conventional refrigeration cycle. The ejector is used to recover some of the available work so that the compressor suction pressure increases. To investigate the enhancement a model with R134a refrigerant was developed. To solve the set of equations and simulate the cycle performance a subroutine was written on engineering equation solver (EES environment. At specific conditions, the refrigerant properties are obtained from EES. At the design conditions the ejector refrigeration cycle achieved 5.141 COP compared to 4.609 COP of the conventional refrigeration cycle. This means that ejector refrigeration cycle offers better COP with 10.35% improvement compared to conventional refrigeration cycle. Parametric analysis of ejector refrigeration cycle indicated that COP was influenced significantly by evaporator and condenser temperatures, entrainment ratio and diffuser efficiency.

  5. Performance Analysis of Multipurpose Refrigeration System (MRS on Fishing Vessel

    Directory of Open Access Journals (Sweden)

    Ust Y.

    2016-04-01

    Full Text Available The use of efficient refrigerator/freezers helps considerably to reduce the amount of the emitted greenhouse gas. A two-circuit refrigerator-freezer cycle (RF reveals a higher energy saving potential than a conventional cycle with a single loop of serial evaporators, owing to pressure drop in each evaporator during refrigeration operation and low compression ratio. Therefore, several industrial applications and fish storage systems have been utilized by using multipurpose refrigeration cycle. That is why a theoretical performance analysis based on the exergetic performance coefficient, coefficient of performance (COP, exergy efficiency and exergy destruction ratio criteria, has been carried out for a multipurpose refrigeration system by using different refrigerants in serial and parallel operation conditions. The exergetic performance coefficient criterion is defined as the ratio of exergy output to the total exergy destruction rate (or loss rate of availability. According to the results of the study, the refrigerant R32 shows the best performance in terms of exergetic performance coefficient, COP, exergy efficiency, and exergy destruction ratio from among the other refrigerants (R1234yf, R1234ze, R404A, R407C, R410A, R143A and R502. The effects of the condenser, freezer-evaporator and refrigerator-evaporator temperatures on the exergetic performance coefficient, COP, exergy efficiency and exergy destruction ratios have been fully analyzed for the refrigerant R32.

  6. Modeling and calculation of open carbon dioxide refrigeration system

    International Nuclear Information System (INIS)

    Cai, Yufei; Zhu, Chunling; Jiang, Yanlong; Shi, Hong

    2015-01-01

    Highlights: • A model of open refrigeration system is developed. • The state of CO 2 has great effect on Refrigeration capacity loss by heat transfer. • Refrigeration capacity loss by remaining CO 2 has little relation to the state of CO 2 . • Calculation results are in agreement with the test results. - Abstract: Based on the analysis of the properties of carbon dioxide, an open carbon dioxide refrigeration system is proposed, which is responsible for the situation without external electricity unit. A model of open refrigeration system is developed, and the relationship between the storage environment of carbon dioxide and refrigeration capacity is conducted. Meanwhile, a test platform is developed to simulation the performance of the open carbon dioxide refrigeration system. By comparing the theoretical calculations and the experimental results, several conclusions are obtained as follows: refrigeration capacity loss by heat transfer in supercritical state is much more than that in two-phase region and the refrigeration capacity loss by remaining carbon dioxide has little relation to the state of carbon dioxide. The results will be helpful to the use of open carbon dioxide refrigeration

  7. Improvement of a thermoelectric and vapour compression hybrid refrigerator

    International Nuclear Information System (INIS)

    Astrain, D.; Martínez, A.; Rodríguez, A.

    2012-01-01

    This paper presents the improvement in the performance of a domestic hybrid refrigerator that combines vapour compression technology for the cooler and freezer compartments, and thermoelectric technology for a new compartment. The heat emitted by the Peltier modules is discharged into the freezer compartment, forming a cascade refrigeration system. This configuration leads to a significant improvement in the coefficient of operation. Thus, the electric power consumption of the modules and the refrigerator decreases by 95% and 20% respectively, with respect to those attained with a cascade refrigeration system connected with the cooler compartment. The optimization process is based on a computational model that simulates the behaviour of the whole refrigerator. Two prototypes have been built and tested. Experimental results indicate that the temperature of the new compartment is easily set up at any value between 0 and −4 °C, the oscillation of this temperature is always lower than 0.4 °C, and the electric power consumption is low enough to include this hybrid refrigerator into energy efficiency class A, according European rules and regulations. - Highlights: ► Optimization of a vapour compression and thermoelectric hybrid refrigerator. ► Two prototypes built and tested. Computational model for the whole refrigerator. ► Electric power consumption of the modules and the refrigerator 95% and 20% lower. ► New compartment refrigerated with thermoelectric technology. ► Inner temperature adjustable from 0 to −4 °C. Oscillations lower than ±0.2 °C.

  8. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  9. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  10. An optimized magnet for magnetic refrigeration

    DEFF Research Database (Denmark)

    Bjørk, Rasmus; Bahl, Christian Robert Haffenden; Smith, Anders

    2010-01-01

    A magnet designed for use in a magnetic refrigeration device is presented. The magnet is designed by applying two general schemes for improving a magnet design to a concentric Halbach cylinder magnet design and dimensioning and segmenting this design in an optimum way followed by the construction...... of the actual magnet. The final design generates a peak value of 1.24 T, an average flux density of 0.9 T in a volume of 2 L using only 7.3 L of magnet, and has an average low flux density of 0.08 T also in a 2 L volume. The working point of all the permanent magnet blocks in the design is very close...... to the maximum energy density. The final design is characterized in terms of a performance parameter, and it is shown that it is one of the best performing magnet designs published for magnetic refrigeration....

  11. A horizontal dilution refrigerator for polarized target

    International Nuclear Information System (INIS)

    Isagawa, S.; Ishimoto, S.; Masaike, A.; Morimoto, K.

    1978-01-01

    A horizontal dilution refrigerator was constructed with a view to the spin frozen target and the deuteron polarized target. High cooling power at high temperature such as 3.7 mW at 400 mK serves for overcoming a heat load of microwave to polarize the nuclear spins in the target material. The cooling power at 50 mK was 50 μW, which is sufficient to hold the high nuclear polarization for long time. The lowest temperature reached was 26 mK. The refrigerator has rather simple heat exchangers, a long stainless steel double tube heat exchanger and two coaxial type heat exchangers with sintered copper. The mixing chamber is made of polytetrafluoroethylene (TFE) and demountable so that the target material can be easily put into it. (Auth.)

  12. An optimized magnet for magnetic refrigeration

    International Nuclear Information System (INIS)

    Bjork, R.; Bahl, C.R.H.; Smith, A.; Christensen, D.V.; Pryds, N.

    2010-01-01

    A magnet designed for use in a magnetic refrigeration device is presented. The magnet is designed by applying two general schemes for improving a magnet design to a concentric Halbach cylinder magnet design and dimensioning and segmenting this design in an optimum way followed by the construction of the actual magnet. The final design generates a peak value of 1.24 T, an average flux density of 0.9 T in a volume of 2 L using only 7.3 L of magnet, and has an average low flux density of 0.08 T also in a 2 L volume. The working point of all the permanent magnet blocks in the design is very close to the maximum energy density. The final design is characterized in terms of a performance parameter, and it is shown that it is one of the best performing magnet designs published for magnetic refrigeration.

  13. The lifetime cost of a magnetic refrigerator

    DEFF Research Database (Denmark)

    Bjørk, Rasmus; Bahl, Christian R.H.; Nielsen, Kaspar Kirstein

    2016-01-01

    The total cost of a 25 W average load magnetic refrigerator using commercial grade Gd is calculated using a numerical model. The price of magnetocaloric material, magnet material and cost of operation are considered, and all influence the total cost. The lowest combined total cost with a device...... lifetime of 15 years is found to be in the range $150-$400 depending on the price of the magnetocaloric and magnet material. The cost of the magnet is largest, followed closely by the cost of operation, while the cost of the magnetocaloric material is almost negligible. For the lowest cost device...... characteristics are based on the performance of a conventional A+++ refrigeration unit. In a rough life time cost comparison between the AMR device and such a unit we find similar costs, the AMR being slightly cheaper, assuming the cost of the magnet can be recuperated at end of life....

  14. Design of refrigeration system using refrigerant R134a for macro compartment

    Science.gov (United States)

    Rani, M. F. H.; Razlan, Z. M.; Shahriman, A. B.; Yong, C. K.; Harun, A.; Hashim, M. S. M.; Faizi, M. K.; Ibrahim, I.; Kamarrudin, N. S.; Saad, M. A. M.; Zunaidi, I.; Wan, W. K.; Desa, H.

    2017-10-01

    The main objective of this study is to analyse and design an optimum cooling system for macro compartment. Current product of the refrigerator is not specified for single function and not compact in size. Hence, a refrigeration system using refrigerant R134a is aimed to provide instant cooling in a macro compartment with sizing about 150 × 150 × 250 mm. The macro compartment is purposely designed to fit a bottle or drink can, which is then cooled to a desired drinking temperature of about 8°C within a period of 1 minute. The study is not only concerned with analysing of heat load of the macro compartment containing drink can, but also focused on determining suitable heat exchanger volume for both evaporator and condenser, calculating compressor displacement value and computing suitable resistance value of the expansion valve. Method of optimization is used to obtain the best solution of the problem. Mollier diagram is necessary in the process of developing the refrigeration system. Selection of blower is made properly to allow air circulation and to increase the flow rate for higher heat transfer rate. Property data are taken precisely from thermodynamic property tables. As the main four components, namely condenser, compressor, evaporator and expansion valve are fully developed, the refrigeration system is complete.

  15. FOREWORD: 26th IAHR Symposium on Hydraulic Machinery and Systems

    Science.gov (United States)

    Wu, Yulin; Wang, Zhengwei; Liu, Shuhong; Yuan, Shouqi; Luo, Xingqi; Wang, Fujun

    2012-11-01

    The 26th IAHR Symposium on Hydraulic Machinery and Systems, will be held in Beijing, China, 19-23 August 2012. It is jointly organized by Tsinghua University, State Key Laboratory of Hydro Science and Hydraulic Engineering, China, Jiangsu University, Xi'an University of Technology, China Agricultural University, National Engineering Research Center of Hydropower Equipment and Dongfang Electric Machinery Co., Ltd. It is the second time that China hosts such a symposium. By the end of 2011, the China electrical power system had a total of 1 050 GW installed power, out of which 220 GW was in hydropower plants. The energy produced in hydropower facilities was 662.6 TWh from a total of 4,720 TWh electrical energy production in 2011. Moreover, in 2020, new hydropower capacities are going to be developed, with a total of 180 GW installed power and an estimated 708 TWh/year energy production. And in 2011, the installed power of pumped storage stations was about 25GW. In 2020, the data will be 70GW. At the same time, the number of pumps used in China is increasing rapidly. China produces about 29,000,000 pumps with more than 220 series per year. By the end of 2011, the Chinese pumping system has a total of 950 GW installed power. The energy consumed in pumping facilities was 530 TWh in 2011. The pump energy consumption accounted for about 12% of the national electrical energy production. Therefore, there is a large market in the field of hydraulic machinery including water turbines, pump turbines and a variety of pumps in China. There are also many research projects in this field. For example, we have conducted National Key Research Projects on 1000 MW hydraulic turbine, and on the pump turbines with high head, as well as on the large capacity pumps for water supply. Tsinghua University of Beijing is proud to host the 26th IAHR Symposium on Hydraulic Machinery and Systems. Tsinghua University was established in 1911, after the founding of the People's Republic of China. It

  16. Silicon spectrometer with a Peltier refrigerator

    International Nuclear Information System (INIS)

    Belcarz, E.; Chwaszczewska, J.; Hahn, G.; Nowicki, W.; Sawicka, B.; Skoczek, K.; Slapa, M.; Szymczak, M.

    1974-01-01

    This paper describes a spectrometer with a Si(Li) detector cooled by a Peltier refrigerator. The spectrometer is able to analyse samples of practically all most frequently encountered emitters of alpha, beta and low energy gamma radiation. The energy resolution were about 1.3-1.5 keV for 14 keV gamma radiation. The system can also operate in field conditions in the fluorescence analysis. (author)

  17. Cryo-refrigerators for CNS applications

    International Nuclear Information System (INIS)

    Clausen, J.; Lesser, J.; Sebastianutto, R.

    2001-01-01

    Cryo-refrigeration plants for cold neutron sources belong to the field of auxiliary plants or utility facilities of the reactor. In general, they are classified as non-nuclear and serve to dissipate the heat generated in the liquid hydrogen or deuterium from moderating the neutrons of the cold neutron source. Cryo-refrigeration plants for the temperature range of 20 K supply either refrigeration at constant temperature by means of evaporating the cryogenic coolant (usually hydrogen) or, as usual with cold sources, in a specific temperature range by means of warming-up the cryogenic coolant (usually helium) in the moderator or heat exchanger (condensation or subcooling of the deuterium). The operator's requirements to a refrigeration plant are, first of all, that the plant adjusts itself - at low-maintenance or maintenance-free - to the various operation modes at best thermodynamic efficiencies and that it offers as much operating convenience and operating safety as possible. Additional requirements are short times for cool-down, capacity adjustment, stand-by operation in order to avoid poisoning of the cold source and further operational requirements. However, these requirements are limited by mechanics, thermodynamics and financial means. For this reason, for each application a technical solution must be found which is optimally adapted to the competing requirements and which is based on a standard product of the manufacturer, if possible. The operator's different requirements have to be taken in account with regard to the design of the plant and choice of the components; economic aspects in addition also have to be considered. Wherever possible, proven standard components should be used. (orig.)

  18. Multiscale singular value manifold for rotating machinery fault diagnosis

    Energy Technology Data Exchange (ETDEWEB)

    Feng, Yi; Lu, BaoChun; Zhang, Deng Feng [School of Mechanical Engineering, Nanjing University of Science and Technology,Nanjing (United States)

    2017-01-15

    Time-frequency distribution of vibration signal can be considered as an image that contains more information than signal in time domain. Manifold learning is a novel theory for image recognition that can be also applied to rotating machinery fault pattern recognition based on time-frequency distributions. However, the vibration signal of rotating machinery in fault condition contains cyclical transient impulses with different phrases which are detrimental to image recognition for time-frequency distribution. To eliminate the effects of phase differences and extract the inherent features of time-frequency distributions, a multiscale singular value manifold method is proposed. The obtained low-dimensional multiscale singular value manifold features can reveal the differences of different fault patterns and they are applicable to classification and diagnosis. Experimental verification proves that the performance of the proposed method is superior in rotating machinery fault diagnosis.

  19. Helium refrigeration system for hydrogen liquefaction applications

    Science.gov (United States)

    Nair, J. Kumar, Sr.; Menon, RS; Goyal, M.; Ansari, NA; Chakravarty, A.; Joemon, V.

    2017-02-01

    Liquid hydrogen around 20 K is used as cold moderator for generating “cold neutron beam” in nuclear research reactors. A cryogenic helium refrigeration system is the core upon which such hydrogen liquefaction applications are built. A thermodynamic process based on reversed Brayton cycle with two stage expansion using high speed cryogenic turboexpanders (TEX) along with a pair of compact high effectiveness process heat exchangers (HX), is well suited for such applications. An existing helium refrigeration system, which had earlier demonstrated a refrigeration capacity of 470 W at around 20 K, is modified based on past operational experiences and newer application requirements. Modifications include addition of a new heat exchanger to simulate cryogenic process load and two other heat exchangers for controlling the temperatures of helium streams leading out to the application system. To incorporate these changes, cryogenic piping inside the cold box is suitably modified. This paper presents process simulation, sizing of new heat exchangers as well as fabrication aspects of the modified cryogenic process piping.

  20. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  1. Development of Low Global Warming Potential Refrigerant Solutions for Commercial Refrigeration Systems using a Life Cycle Climate Performance Design Tool

    Energy Technology Data Exchange (ETDEWEB)

    Abdelaziz, Omar [ORNL; Fricke, Brian A [ORNL; Vineyard, Edward Allan [ORNL

    2012-01-01

    Commercial refrigeration systems are known to be prone to high leak rates and to consume large amounts of electricity. As such, direct emissions related to refrigerant leakage and indirect emissions resulting from primary energy consumption contribute greatly to their Life Cycle Climate Performance (LCCP). In this paper, an LCCP design tool is used to evaluate the performance of a typical commercial refrigeration system with alternative refrigerants and minor system modifications to provide lower Global Warming Potential (GWP) refrigerant solutions with improved LCCP compared to baseline systems. The LCCP design tool accounts for system performance, ambient temperature, and system load; system performance is evaluated using a validated vapor compression system simulation tool while ambient temperature and system load are devised from a widely used building energy modeling tool (EnergyPlus). The LCCP design tool also accounts for the change in hourly electricity emission rate to yield an accurate prediction of indirect emissions. The analysis shows that conventional commercial refrigeration system life cycle emissions are largely due to direct emissions associated with refrigerant leaks and that system efficiency plays a smaller role in the LCCP. However, as a transition occurs to low GWP refrigerants, the indirect emissions become more relevant. Low GWP refrigerants may not be suitable for drop-in replacements in conventional commercial refrigeration systems; however some mixtures may be introduced as transitional drop-in replacements. These transitional refrigerants have a significantly lower GWP than baseline refrigerants and as such, improved LCCP. The paper concludes with a brief discussion on the tradeoffs between refrigerant GWP, efficiency and capacity.

  2. Structural insights into the bacterial carbon - phosphorus lyase machinery

    DEFF Research Database (Denmark)

    Seweryn, Paulina; Van, Lan Bich; Kjeldgaard, Morten

    2015-01-01

    Phosphorus is required for all life and microorganisms can extract it from their environment through several metabolic pathways. When phosphate is in limited supply, some bacteria are able to use phosphonate compounds, which require specialized enzymatic machinery to break the stable carbon......–phosphorus (C–P) bond. Despite its importance, the details of how this machinery catabolizes phosphonates remain unknown. Here we determine the crystal structure of the 240-kilodalton Escherichia coli C–P lyase core complex (PhnG–PhnH–PhnI–PhnJ; PhnGHIJ), and show that it is a two-fold symmetric hetero...

  3. Densification of chipper harvested SRC using on-farm machinery

    Energy Technology Data Exchange (ETDEWEB)

    Paulson, M.

    2003-07-01

    This report gives details of a project to density wood chips using on-farm machinery in order to avoid problems encountered in bulk handling and storage of low density short rotation cultivation (SRC) wood chips - especially as some customers can only accept baled material. Trials using different lengths of chips produced by a standard SRC harvester are described, and the failure to produce acceptable bales is reported. The potential cost of modifying equipment is deemed to make the baling of SRC chips using standard farm machinery currently not viable.

  4. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  5. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  6. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla; Brož, P.

    2012-01-01

    Roč. 48, č. 3 (2012), s. 339-346 ISSN 1450-5339 R&D Projects: GA MŠk LD11024 Institutional support: RVO:68081723 Keywords : CALPHAD method * lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.435, year: 2012

  7. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  8. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  9. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  10. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  11. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

  12. Electrochemical migration of lead-free solder alloys in Na2SO4 environment

    DEFF Research Database (Denmark)

    Medgyes, Balint; Ádám, Sándor; Tar, Lajos

    2017-01-01

    The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of...

  13. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  14. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  15. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  16. Prediction of thermodynamic properties of refrigerants using data mining

    International Nuclear Information System (INIS)

    Kuecueksille, Ecir Ugur; Selbas, Resat; Sencan, Arzu

    2011-01-01

    The analysis of vapor compression refrigeration systems requires the availability of simple and efficient mathematical formulations for the determination of thermodynamic properties of refrigerants. The aim of this study is to determine thermodynamic properties as enthalpy, entropy and specific volume of alternative refrigerants using data mining method. Alternative refrigerants used in the study are R134a, R404a, R407c and R410a. The results obtained from data mining have been compared to actual data from the literature. The study shows that the data mining methodology is successfully applicable to determine enthalpy, entropy and specific volume values for any temperature and pressure of refrigerants. Therefore, computation time reduces and simulation of vapor compression refrigeration systems is fairly facilitated.

  17. Analysis of cooldown performance for Isabelle helium refrigerator

    International Nuclear Information System (INIS)

    Wu, K.C.; Brown, D.P.; Moore, R.W.

    1982-01-01

    The cooldown performance for the ISABELLE Helium refrigerator is analyzed in terms of the relationship between refrigerator and its load. The flow diagram for ISABELLE with its redundant turbines and heat exchangers is given. Cycle description and procedure for cooldown is described with the relationship between a refrigerator and its load illustrated. Pressure vs. temperature for ISABELLE load and the efficiency for a turbine are illustrated. The procedure for modeling the refrigerator and the concepts of maximizing the cooldown capacity are described. The results and discussion are accompanied with T-S diagrams for initial stage of cooldown and refrigerator characteristic at various return temperatures. The ISABELLE refrigerator with its reduncant expanders properly used achieves cooldown capacity well beyond its steady-state capacity. The cooldown rate at this stage relies on the design safety margin, which for the ISABELLE is 50%

  18. Fault detection and diagnosis for refrigerator from compressor sensor

    Science.gov (United States)

    Keres, Stephen L.; Gomes, Alberto Regio; Litch, Andrew D.

    2016-12-06

    A refrigerator, a sealed refrigerant system, and method are provided where the refrigerator includes at least a refrigerated compartment and a sealed refrigerant system including an evaporator, a compressor, a condenser, a controller, an evaporator fan, and a condenser fan. The method includes monitoring a frequency of the compressor, and identifying a fault condition in the at least one component of the refrigerant sealed system in response to the compressor frequency. The method may further comprise calculating a compressor frequency rate based upon the rate of change of the compressor frequency, wherein a fault in the condenser fan is identified if the compressor frequency rate is positive and exceeds a condenser fan fault threshold rate, and wherein a fault in the evaporator fan is identified if the compressor frequency rate is negative and exceeds an evaporator fan fault threshold rate.

  19. Compatibility of refrigerants and lubricants with elastomers. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Hamed, G.R.; Seiple, R.H.; Taikum, Orawan

    1994-01-01

    The information contained in this report is designed to assist the air-conditioning and refrigeration industry in the selection of suitable elastomeric gasket and seal materials that will prove useful in various refrigerant and refrigeration lubricant environments. In part I of the program the swell behavior in the test fluids has been determined using weight and in situ diameter measurements for the refrigerants and weight, diameter and thickness measurements for the lubricants. Weight and diameter measurements are repeated after 2 and 24 hours for samples removed fro the refrigerant test fluids and 24 hours after removal from the lubricants. Part II of the testing program includes the evaluation of tensile strength, hardness, weight, and dimensional changes after immersion aging in refrigerant/lubricant mixtures of selected elastomer formulations at elevated temperature and pressure.

  20. Exergy analysis of refrigerators for large scale cooling systems

    Energy Technology Data Exchange (ETDEWEB)

    Loehlein, K [Sulzer Cryogenics, Winterthur (Switzerland); Fukano, T [Nippon Sanso Corp., Kawasaki (Japan)

    1993-01-01

    Facilities with superconducting magnets require cooling capacity at different temperature levels and of different types (refrigeration or liquefaction). The bigger the demand for refrigeration, the more investment for improved efficiency of the refrigeration plant is justified and desired. Refrigeration cycles are built with discrete components like expansion turbines, cold compressors, etc. Therefore the exergetic efficiency for producing refrigeration on a distinct temperature level is significantly dependent on the 'thermodynamic arrangement' of these components. Among a variety of possibilities, limited by the range of applicability of the components, one has to choose the best design for higher efficiency on every level. Some influences are being quantified and aspects are given for a optimal integration of the refrigerator into the whole cooling system. (orig.).