Kinematic viscosity of liquid Al-Cu alloys

International Nuclear Information System (INIS)

Konstantinova, N Yu; Popel, P S

2008-01-01

Temperature dependences of kinematic viscosity n of liquid Al 100-x -Cu x alloys (x = 0.0, 10.0, 17.1, 25.0, 32.2, 40.0 and 50.0 at.%) were measured. A technique based on registration of the period and the decrement of damping of rotating oscillations of a cylindrical crucible with a melt was used. Viscosity was calculated in low viscous liquids approximation. Measurements were carried out in vacuum in crucibles of BeO with a temperature step of 30 deg. C and isothermal expositions of 10 to 15 minutes during both heating up to 1100-1250 deg. C and subsequent cooling. We have discovered branching of heating and cooling curves v(T) (hysteresis of viscosity) below temperatures depending on the copper content: 950 deg. C at 10 and 17.1 at.% Cu, 1050 deg. C at 25 and 40 at.% Cu, 850 deg. C at 32.2 at.% Cu. For samples with 10 and 17.1 at.% Cu the cooling curve 'returns' to the heating one near 700 deg. C. An abnormally high spreading of results at repeated decrement measurements was fixed at heating of the alloy containing 50 at.% Cu above 1000 deg. C. During subsequent cooling the effect disappeared. Isotherms of kinematic viscosity have been fitted for several temperatures

A comparison of acoustic levitation with microgravity processing for containerless solidification of ternary Al-Cu-Sn alloy

Science.gov (United States)

Yan, N.; Hong, Z. Y.; Geng, D. L.; Wei, B.

2015-07-01

The containerless rapid solidification of liquid ternary Al-5 %Cu-65 %Sn immiscible alloy was accomplished at both ultrasonic levitation and free fall conditions. A maximum undercooling of 185 K (0.22 T L) was obtained for the ultrasonically levitated alloy melt at a cooling rate of about 122 K s-1. Meanwhile, the cooling rate of alloy droplets in drop tube varied from 102 to 104 K s-1. The macrosegregation was effectively suppressed through the complex melt flow under ultrasonic levitation condition. In contrast, macrosegregation became conspicuous and core-shell structures with different layers were formed during free fall. The microstructure formation mechanisms during rapid solidification at containerless states were investigated in comparison with the conventional static solidification process. It was found that the liquid phase separation and structural growth kinetics may be modulated by controlling both alloy undercooling and cooling rate.

Application of single pan thermal analysis to Cu-Sn peritectic alloys

International Nuclear Information System (INIS)

Kohler, F.; Campanella, T.; Nakanishi, S.; Rappaz, M.

2008-01-01

Single pan thermal analyses (SPTA) have been performed on Cu-14.5 wt.% Sn, Cu-21.3 wt.% Sn and Cu-26.8 wt.% Sn peritectic alloys. For this purpose, a SPTA assembly has been built and calibrated. As the latent heat is a function of temperature and composition during solidification of alloys, a new heat flow model coupled to a Cu-Sn thermodynamic database has been defined for the calculation of the corresponding evolutions of the solid mass fraction, f s (T). To verify the accuracy of this model, a close comparison with a microsegregation model that includes back-diffusion in the primary α-solid phase has also been conducted successfully. The thermal analyses have finally shown that the Cu-Sn phase diagram recently assessed in the review of Liu et al. is the most reliable

Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates

International Nuclear Information System (INIS)

Amore, S.; Ricci, E.; Borzone, G.; Novakovic, R.

2008-01-01

The present work was carried out in the framework of the study of new lead-free solder alloys for technical applications in electronic devices. In the focus of this characterisation the wetting behaviour of several Sn-rich alloys belonging to the In-Sn, Au-Sn and Cu-Sn systems has been studied by measuring the contact angle variations on Cu and Ni substrates as a function of time and temperature. The interface between the alloy and the substrate has been analysed by the use of optical microscopy and scanning electron microscopy combined with energy-dispersive X-ray spectrometry in order to study the reaction between the alloy and the solid substrate and the possible formation of different compounds at the interface. A remarkable effect of the two different substrates on the behaviour of the contact angle as a function of temperature and on the morphology of the interface between the liquid solder and the solid substrate was observed for the In-Sn and Cu-Sn, while the Au-Sn system shows a very similar wetting behaviour on Cu and Ni

Microstructure and properties of thermally sprayed Al-Sn-based alloys for plain bearing applications

Science.gov (United States)

Marrocco, T.; Driver, L. C.; Harris, S. J.; McCartney, D. G.

2006-12-01

Al-Sn plain bearings for automotive applications traditionally comprise a multilayer structure. Conventionally, bearing manufacturing involves casting the Al-Sn alloy and roll-bonding to a steel backing strip. Recently, high-velocity oxyfuel (HVOF) thermal spraying has been used as a novel alternative manufacturing route. The present project extends previous work on ternary Al-Sn-Cu alloys to quaternary systems, which contain specific additions for potentially enhanced properties. Two alloys were studied in detail, namely, Al-20wt.%Sn-1wt.%Cu-2wt.%Ni and Al-20wt.%Sn-1wt.%Cu-7wt.%Si. This article will describe the microstructural evolution of these alloys following HVOF spraying onto steel substrates and subsequent heat treatment. The microstructures of powders and coatings were investigated by scanning electron microscopy, and the phases were identified by x-ray diffraction. Coating microhardnesses were determined under both as-sprayed and heat-treated conditions, and by the differences related to the microstructures that developed. Finally, the wear behavior of the sprayed and heat-treated coatings in hot engine oil was measured using an industry standard test and was compared with that of previous work on a ternary alloy.

Thermodynamic properties of Al-Mn, Al-Cu, and Al-Fe-Cu melts and their relations to liquid and quasicrystal structure

International Nuclear Information System (INIS)

Zaitsev, A I; Zaitseva, N E; Shimko, R Yu; Arutyunyan, N A; Dunaev, S F; Kraposhin, V S; Lam, Ha Thanh

2008-01-01

Thermodynamic properties of molten Al-Mn, Al-Cu and Al-Fe-Cu alloys in a wide temperature range of 1123-1878 K and the whole range of concentrations have been studied using the integral effusion method and Knudsen mass spectrometry. Thermodynamic functions of melts were described by the associated solution model. The possibility of icosahedral quasicrystal (i-QC) precipitation from liquid Al-Mn and Al-Cu-Fe alloys was found to be a consequence of the existence in liquid associates (clusters). A geometric model is suggested for the structure of associates in liquid

Enthalpy of mixing of liquid Ni-Zr and Cu-Ni-Zr alloys

International Nuclear Information System (INIS)

Witusiewicz, V.T.; Sommer, F.

2000-01-01

Since the Al-Cu-Ni-Zr system is a basis for the production of bulk amorphous materials by rapid solidification techniques from the liquid state, it is of great scientific interest to determine the partial and the integral thermodynamic functions of liquid and undercooled liquid alloys. Such data, as was pointed out previously, are important in order to understand their extremely good glass-forming ability in multicomponent metallic systems as well as for processing improvements. In order to measure the thermodynamic properties of the Al-Cu-Ni-Zr quaternary, it is necessary to have reliable thermochemical data for its constituent canaries and ternaries first. In a series of articles, the authors have reported in detail the thermodynamic properties of liquid Al-Cu, Al-Ni, Cu-Ni, Cu-Zr, Al-Zr, Al-Cu-Ni, and Al-Cu-Zr alloys. This article deals with the direct calorimetric measurements of the partial and the integral enthalpies of mixing of liquid Ni-Zr and Cu-Ni-Zr alloys and the heat capacity of liquid Ni 26 Zr 74 . In a subsequent article, the authors will present similar data for the liquid ternary Al-Ni-Zr and for the liquid quaternary Al-Cu-Ni-Zr alloys

Investigation of the structure and properties of the titanium alloy of the Ti-Al-Mo-V-Fe-Cu-Zr-Sn system

International Nuclear Information System (INIS)

Moiseev, V.N.; Dolzhanskij, Yu.M.; Zakharov, Yu.I.; Znamenskaya, E.V.

1979-01-01

The alloys of martensitic type in the Ti-Al-Mo-V-Fe-Cu-Zr-Sn system after heat treatment are investigated. To determine the composition of the titanium alloy methods of mathematical planning of the experiment are applied. Results of mechanical tests of the alloys are presented, as well as coefficients of models for the properties, calculated according to these data. The investigation establishes the composition of a high-strength titanium alloy of a martensitic type, containing 4.5-60 % Al, 2.0-4.0 % Mo, 0.5-1.9 % V, 0.3-1.5 % Fe, 0.3-1.5 % Cu, 1.5-3.0 % Sn, 2.0-4.0 % Zr. The semiproducts, produced by deformation in β-field, after heat treatment have an ultimate strength >=120 kg/mm 2 , satisfactory ductility and reliability. The alloy possesses rather a high heat resistance and can be operated at 400-500 deg C

Effect of Cooling Rate on the Longitudinal Modulus of Cu3Sn Phase of Ag-Sn-Cu Amalgam Alloy (Part II

Directory of Open Access Journals (Sweden)

R. H. Rusli

2015-10-01

Full Text Available Effects of cooling rate (at the time of solidification on the elastic constants of Cu3Sn phase of Ag-Sn-Cu dental amalgam alloy were studied. In this study, three types of alloys were made, with the composition Cu-38-37 wt% Sn by means of casting, where each alloy was subjected to different cooling rate, such as cooling on the air (AC, air blown (AB, and quenched in the water (WQ. X-ray diffraction, metallography, and Scanning Electron Microscopy with Energy Dispersive Spectroscopy studies of three alloys indicated the existence of Cu3Sn phase. Determination of the modulus of elasticity of Cu3Sn (ε phase was carried out by the measurement of longitudinal and transversal waves velocity using ultrasonic technique. The result shows that Cu3Sn (ε phase on AC gives higher modulus of elasticity values than those of Cu3Sn (ε on AB and WQ. The high modulus of elasticity value will produce a strong Ag-Sn-Cu dental amalagam alloy.

Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

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Soares D.

2006-01-01

Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

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Liu Mei Lee

2013-01-01

Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

Preparation, deformation, and failure of functional Al-Sn and Al-Sn-Pb nanocrystalline alloys

Science.gov (United States)

Noskova, N. I.; Vil'Danova, N. F.; Filippov, Yu. I.; Churbaev, R. V.; Pereturina, I. A.; Korshunov, L. G.; Korznikov, A. V.

2006-12-01

Changes in the structure, hardness, mechanical properties, and friction coefficient of Al-30% Sn, Al-15% Sn-25% Pb, and Al-5% Sn-35% Pb (wt %) alloys subjected to severe plastic deformation by equal-channel angular pressing (with a force of 40 tonne) and by shear at a pressure of 5 GPa have been studied. The transition into the nanocrystalline state was shown to occur at different degrees of plastic deformation. The hardness exhibits nonmonotonic variations, namely, first it increases and subsequently decreases. The friction coefficient of the Al-30% Sn, Al-15% Sn-25% Pb, and Al-5% Sn-35% Pb alloys quenched from the melt was found to be 0.33; the friction coefficients of these alloys in the submicrocrystalline state (after equal-channel angular pressing) equal 0.24, 0.32, and 0.35, respectively. The effect of disintegration into nano-sized powders was found to occur in the Al-15% Sn-25% Pb, and Al-5% Sn-35% Pb alloys after severe plastic deformation to ɛ = 6.4 and subsequent short-time holding.

Corrosion behavior of Zr-x(Nb, Sn and Cu) binary alloys

International Nuclear Information System (INIS)

Kim, M. H.; Lee, M. H.; Park, S. Y.; Jung, Y. H.; We, M. Y.

1999-01-01

For the development of advanced zirconium alloys for nuclear fuel cladding, the corrosion behaviors of zirconium binary alloys were studied on the Zr-xNb, Zr-xSn, and Zr-xCu alloys. The corrosion test were performed in water at 360 deg C, steam at 400 deg C and LiOH at 360 deg C for 45 days. The corrosion behaviors of Zr-xNb was similar to that of Zr-xCu alloys. However, the corrosion behavior of Zr-xSn was different from Zr-xNb and Zr-xCu. The weight gain of Zr-xNb and Zr-xCu was increased with addition of alloying elements. When Sn is added to Zr matrix in range below the solubility limit, the corrosion resistance decrease with increasing Sn-content, while in the range over solubility limit, Sn has an adverse effect on the corrosion resistance. Especially, Zr-xSn alloys showed higher corrosion resistance than Zr-xNb and Zr-xCu alloys in LiOH solution

Comparison of the electrochemical performance of mesoscopic Cu2Sb, SnSb and Sn/SnSb alloy powders

International Nuclear Information System (INIS)

Zhang Ge; Huang Kelong; Liu Suqin; Zhang Wei; Gong Benli

2006-01-01

Cu 2 Sb, SnSb and Sn/SnSb mesoscopic alloy powders were prepared by chemical reduction, respectively. The crystal structures and particle morphology of Cu 2 Sb, SnSb and Sn/SnSb were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM). The electrochemical performances of the Cu 2 Sb, SnSb and Sn/SnSb electrodes were investigated by galvanostatic charge and discharge cycling and electrochemical impedance spectroscopy (EIS). The results showed the first charge and discharge capacities of SnSb and Sn/SnSb were higher than Cu 2 Sb, but after 15 cycles, the charge capacity fading rates of Cu 2 Sb, Sn/SnSb and Sn/SnSb were 26.16%, 55.33% and 47.39%, respectively. Cu 2 Sb had a better cycle performance, and Sn/SnSb multiphase alloy was prior to pure SnSb due to the existence of excessive Sn in Sn/SnSb system

Internal friction behavior of liquid Bi-Sn alloys

International Nuclear Information System (INIS)

Wu Aiqing; Guo Lijun; Liu Changsong; Jia Erguang; Zhu Zhengang

2005-01-01

Pure Bi and Sn and four Bi-Sn alloys distributed on the entire concentration range were selected for internal-friction investigation over a wide temperature range. There exist two peaks in the plots of internal friction versus temperature for liquid Sn, Bi-Sn60 and Bi-Sn90 alloys, one peak being located at about 480 - bar Cand another at about 830 - bar C. Only a single internal-friction peak at about 830 - bar C occurs in liquid Bi-Sn43 (eutectic composition). No internal-friction peak appears in liquid Bi-Sn20 alloy and pure Bi. The height of the internal-friction peaks depends on the content of Sn. The present finding suggests that Sn-rich Bi-Sn alloys may inherit the internal-friction behaviors of pure Sn, whereas Bi-rich Bi-Sn alloy seems to be like pure Bi. The position of the internal-friction peaks is frequency dependent, which resembles the internal-friction feature in structure transition in solids

Internal friction behavior of liquid Bi-Sn alloys

Energy Technology Data Exchange (ETDEWEB)

Wu Aiqing [Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, P.O. Box 1129, Hefei 230031 (China); Guo Lijun [Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, P.O. Box 1129, Hefei 230031 (China); Liu Changsong [Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, P.O. Box 1129, Hefei 230031 (China); Jia Erguang [Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, P.O. Box 1129, Hefei 230031 (China); Zhu Zhengang [Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, P.O. Box 1129, Hefei 230031 (China)]. E-mail: zgzhu@issp.ac.cn

2005-12-01

Pure Bi and Sn and four Bi-Sn alloys distributed on the entire concentration range were selected for internal-friction investigation over a wide temperature range. There exist two peaks in the plots of internal friction versus temperature for liquid Sn, Bi-Sn60 and Bi-Sn90 alloys, one peak being located at about 480{sup -}bar Cand another at about 830{sup -}bar C. Only a single internal-friction peak at about 830{sup -}bar C occurs in liquid Bi-Sn43 (eutectic composition). No internal-friction peak appears in liquid Bi-Sn20 alloy and pure Bi. The height of the internal-friction peaks depends on the content of Sn. The present finding suggests that Sn-rich Bi-Sn alloys may inherit the internal-friction behaviors of pure Sn, whereas Bi-rich Bi-Sn alloy seems to be like pure Bi. The position of the internal-friction peaks is frequency dependent, which resembles the internal-friction feature in structure transition in solids.

Phase composition of rapidly solidified Ag-Sn-Cu dental alloys

International Nuclear Information System (INIS)

Lecong Dzuong; Do Minh Nghiep; Nguyen van Dzan; Cao the Ha

1996-01-01

The phase composition of some rapidly solidified Ag-Sn-Cu dental alloys with different copper contents (6.22 wtpct) has been studied by XRD, EMPA and optical microscopy. The samples were prepared from melt-spun ribbons. The microstructure of the as-quenched ribbons was microcrystalline and consisted of the Ag sub 3 Sn, Ag sub 4 Sn, Cu sub 3 Sn and Cu sub 3 Sn sub 8 phases. Mixing with mercury (amalgamation) led to formation of the Ag sub 2 Hg sub 3, Sn sub 7 Hg and Cu sub 6 Sn sub 5 phases. The amount of copper atoms in the alloys played an important role in phase formation in the amalgams

Effect Of Compaction Pressure And Sintering Temperature On The Liquid Phase Sintering Behavior Of Al-Cu-Zn Alloy

Directory of Open Access Journals (Sweden)

Lee S.H.

2015-06-01

Full Text Available The liquid phase sintering characteristics of Al-Cu-Zn alloy were investigated with respect to various powder metallurgy processing conditions. Powders of each alloying elements were blended to form Al-6Cu-5Zn composition and compacted with pressures of 200, 400, and 600 MPa. The sintering process was performed at various temperatures of 410, 560, and 615°C in N2 gas atmosphere. Density and micro-Vickers hardness measurements were conducted at different processing stages, and transverse rupture strength of sintered materials was examined for each condition, respectively. The microstructure was characterized using optical microscope and scanning electron microscopy. The effect of Zn addition on the liquid phase sintering behavior during P/M process of the Al-Cu-Zn alloy was also discussed in detail.

Electrical resistivity at high temperatures of Heusler alloys of the Cu2MnAl sub(1-x) Sn sub (x)

International Nuclear Information System (INIS)

Grandi, T.A.

1978-01-01

The structural fase L2 1 of the Heusler alloys Cu 2 MnAl sub (1-x) Sn sub(x), with x varying between 0 and 1, was studied. X-ray diffraction, metallography and diferential termoanalysis techniques were employed. For the alloys with x = 0; 0,05; 0,10 and 0,15 the electrical resistivity measurements were performed in the temperature range 300 K [pt

Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Energy Technology Data Exchange (ETDEWEB)

Yakymovych, Andriy, E-mail: yakymovych@univie.ac.at [Department of Inorganic Chemistry – Functional Materials, University of Vienna, Währinger Str. 42, 1090 Vienna (Austria); Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo i Mephodiy Str. 8, 79005 Lviv (Ukraine); Mudry, Stepan; Shtablavyi, Ihor [Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo i Mephodiy Str. 8, 79005 Lviv (Ukraine); Ipser, Herbert [Department of Inorganic Chemistry – Functional Materials, University of Vienna, Währinger Str. 42, 1090 Vienna (Austria)

2016-09-15

Sn-Ag-Cu (SAC) alloys are commonly recognized as lead-free solders employed in the electronics industry. However, some disadvantages in mechanical properties and their higher melting temperatures compared to Pb-Sn solders prompt new research relating to reinforcement of existing SAC solders. One of the ways to reinforce these solder materials is the formation of composites with nanoparticles as filler materials. Accordingly, this study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu){sub 100−x}(nanoCo){sub x} solders with up to 0.8 wt% nano Co. The effect of nano-sized Co particles was investigated by means of differential thermal analysis (DTA), X-ray diffraction (XRD) in both liquid and solid states, and scanning electron microscopy (SEM). The experimental data of DTA are compared with available literature data for bulk Sn-3.0Ag-0.5Cu alloy to check the capability of minor nano-inclusions to decrease the melting temperature of the SAC solder. The combination of structural data in liquid and solid states provides important information about the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor Co additions and the phase formation during crystallization. Furthermore, scanning electron microscopy has shown the mutual substitution of Co and Cu atoms in the Cu{sub 6}Sn{sub 5} and CoSn{sub 3} phases, respectively. - Highlights: • Differential thermal analysis of nanocomposite (Sn-3.0Ag-0.5Cu){sub 100−x}(nanoCo){sub x} alloys. • Structural transformations of liquid Sn-3.0Ag-0.5Cu solder by minor Co additions. • Structure data of the solid quaternary (Sn-3.0Ag-0.5Cu){sub 100−x}(Co){sub x} alloys. • Substitution of Co and Cu atoms in the Cu{sub 6}Sn{sub 5} and CoSn{sub 3} phases.

Mercury embrittlement of Cu-Al alloys under cyclic loading

Science.gov (United States)

Regan, T. M.; Stoloff, N. S.

1977-01-01

The effect of mercury on the room temperature, high cycle fatigue properties of three alloys: Cu-5.5 pct Al, Cu-7.3 pct Al, and Cu-6.3 pct Al-2.5 pct Fe has been determined. Severe embrittlement under cyclic loading in mercury is associated with rapid crack propagation in the presence of the liquid metal. A pronounced grain size effect is noted under mercury, while fatigue properties in air are insensitive to grain size. The fatigue results are discussed in relation to theories of adsorption-induced liquid metal embrittlement.

Effect of alloying elements on the shape memory properties of ductile Cu-Al-Mn alloys

International Nuclear Information System (INIS)

Sutou, Y.; Kainuma, R.; Ishida, K.

1999-01-01

The effect of alloying elements on the M s temperature, ductility and the shape memory properties of Cu-Al-Mn ductile shape memory (SM) alloys was investigated by differential scanning calorimetry, cold-rolling and tensile test techniques. It was found that the addition of Au, Si and Zn to the Cu 73 -Al 17 -Mn 10 alloy stabilized the martensite (6M) phase increasing the M s temperature, while the addition of Ag, Co, Cr, Fe, Ni, Sn and Ti decreased the stability of the martensite phase, decreasing the M s temperature. The SM properties were improved by the addition of Co, Ni, Cr and Ti. (orig.)

Experimental study of the Cu-Al-Sn phase equilibria, close to the copper zone

Directory of Open Access Journals (Sweden)

Soares D.F.

2017-01-01

Full Text Available The ternary Cu-Al-Sn phase diagram is the base for several important types of alloys, with relevant industrial interest and applications. The knowledge of the melting/solidification alloys characteristics are determinant for their preparation and properties control. However, there is a lack of experimental information on the ternary phase diagram, at high temperature. In this work, several alloys, with high copper content and additions of Al, up to 10%, and Sn, up to 14% (in wt%, were studied by thermal analysis and by isothermal phase equilibria determination. The alloys liquidus and solidus lines and the binary α + β phase field, at 800°C, are presented for the studied range of compositions.

Microalloying with Cd of Antifriction Sn-Sb-Cu Alloys

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Cinca Ionel Lupinca

2012-09-01

Full Text Available In the case of bimetallic sliding linings with superior technological characteristics, the use of an antifriction ally is imposed an alloy of the type Sn-Sb-Cu, which possesses a high adherence to the steel stand and a high durability in exploitation. For this reason we use the microalloying of the antifriction alloy with cadmium. The microalloying with Cd of antifriction alloys Sn-Sb-Cu determines an increase of the adhesion property of the antifriction alloy on the steel stand. The steel stand is previously subjected to a process of degreasing with ZnCl2 and washing so that is can later be subjected to a thermal-chemical treatment of tinning.

Formation of nanocrystalline and amorphous phase of Al-Pb-Si-Sn-Cu powder during mechanical alloying

International Nuclear Information System (INIS)

Ran Guang; Zhou Jingen; Xi Shengqi; Li Pengliang

2006-01-01

Al-15%Pb-4%Si-1%Sn-1.5%Cu alloys (mass fraction, %) were prepared by mechanical alloying (MA). Phase transformation and microstructure characteristics of the alloy powders were investigated by X-ray diffraction (XRD) and transmission electron microscopy (TEM). The results show that the nanocrystalline supersaturated solid solutions and amorphous phase in the powders are obtained during MA. The effect of ball milling is more evident to lead than to aluminum. During MA, the mixture powders are firstly fined, alloyed, nanocrystallized and then the nanocrystalline partly transforms to amorphous phase. A thermodynamic model is developed based on semi-experimental theory of Miedema to calculate the driving force for phase evolution. The thermodynamic analysis shows that there is no chemical driving force to form a crystalline solid solution from the elemental components. But for the amorphous phase, the Gibbs free energy is higher than 0 for the alloy with lead content in the ranges of 0-86.8 at.% and 98.4-100 at.% and lower than 0 in range of 86.8-98.4 at.%. For the Al-2.25 at.%Pb (Al-15%Pb, mass fraction, %), the driving force for formation of amorphization and nanocrystalline supersaturated solid solutions are provided not by the negative heat of mixing but by mechanical work

A study of a stable Al-Cu-Fe quasicrystal in solid and liquid state

International Nuclear Information System (INIS)

Chen Lifan; Chen Xishen

1992-01-01

A stable Al 65 Cu 20 Fe 15 quasicrystal with an icosahedral structure is studied in solid and liquid state. It is found that the icosahedral phase in Al 65 Cu 20 Fe 15 alloy does not grow directly from the pure liquid state, but rather forms between monoclinic Al 13 Fe 4 and residual liquid state at 865degC. The melting point of the Al 65 Cu 20 Fe 15 icosahedral quasicrystal occurs at 865degC and that of the Al 65 Cu 20 Fe 15 alloy occurs at 1008degC. Moreover, the monoclinic Al 13 Fe 4 is transformed into the icosahedral phase easily at the temperature of 845degC. The icosahedral quasicrystal in Al 65 Cu 20 Fe 15 alloy has a high thermal stability even at 950degC. Above 950degC, the icosahedral structure tends to an amorphous structure. (orig.)

Surface tension of liquid Al-Cu binary alloys.

OpenAIRE

Schmitz, Julianna; Brillo, Jürgen; Egry, Ivan; Schmid-Fetzer, Rainer

2009-01-01

Surface tension data of liquid Al–Cu binary alloys have been measured contactlessly using the technique of electromagnetic levitation. A digital CMOS-camera (400 fps) recorded image sequences of the oscillating liquid sample and surface tensions were determined from analysis of the frequency spectra. Measurements were performed for samples covering the entire range of composition and precise data were obtained in a broad temperature range. It was found that the surface tensions can ...

Electronic Topological Transitions in CuNiMnAl and CuNiMnSn under pressure from first principles study

Science.gov (United States)

Rambabu, P.; Kanchana, V.

2018-06-01

A detailed study on quaternary ordered full Heusler alloys CuNiMnAl and CuNiMnSn at ambient and under different compressions is presented using first principles electronic structure calculations. Both the compounds are found to possess ferromagnetic nature at ambient with magnetic moment of Mn being 3.14 μB and 3.35 μB respectively in CuNiMnAl and CuNiMnSn. The total magnetic moment for both the compounds is found to decrease under compression. Fermi surface (FS) topology change is observed in both compounds under pressure at V/V0 = 0.90, further leading to Electronic Topological Transitions (ETTs) and is evidenced by the anomalies visualized in density of states and elastic constants under compression.

Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys

Directory of Open Access Journals (Sweden)

Sklyarchuk V.

2012-01-01

Full Text Available Surface tension and density measurements of liquid Ag-Sb-Sn alloys were carried out over a wide temperature range by using the sessile drop method. The surface tension experimental data were analyzed by the Butler thermodynamic model in the regular solution approximation. The wetting characteristics of these alloys on Cu and Ni substrates have been also determined. The new experimental results were compared with the calculated values as well as with data available in the literature.

Phase formation in multicomponent monotectic aluminium alloys

Energy Technology Data Exchange (ETDEWEB)

Mirkovic, Djordje; Groebner, Joachim; Schmid-Fetzer, Rainer [Institute of Metallurgy, Clausthal University of Technology (Germany)

2008-07-01

Alloys with a miscibility gap in the liquid state are potential materials for advanced bearings in automotive and other applications. While binary alloys, such as Al-Pb or Al-Bi, are well known, the information available for ternary monotectic Al-alloys is scarce. However, the phase formation in multicomponent alloys is not only more challenging from a scientific aspect, it is also a prerequisite for a focused development of advanced alloys. This motivated our detailed study of monotectic Al-Bi-Cu-Sn alloys including both experimental and computational thermodynamic methods. Based on the initially established systematic classification of monotectic ternary Al-alloys, the first promising monotectic reaction was observed in the ternary Al-Bi-Zn system. Further ternary systems Al-Cu-Sn, Al-Bi-Sn, Al-Bi-Cu and Bi-Cu-Sn were investigated as basis for quaternary Al-Bi-Cu-Sn alloys. Experimental investigations of phase equilibria, enthalpies and solidification microstructures were combined with thermodynamic modeling. The results demonstrate that the developed precise thermodynamic description is vital to reveal the distinct multicomponent monotectic features of pertinent phase diagrams. The solidification paths of ternary monotectic alloy systems, Al-Bi-Zn, Al-Sn-Cu and Al-Bi-Cu, were also studied using thermodynamic calculations, revealing specific details of phase formation during solidification of selected alloys.

Determination of the enthalpy of fusion and thermal diffusivity for ternary Cu_6_0_−_xSn_xSb_4_0 alloys

International Nuclear Information System (INIS)

Zhai, W.; Zhou, K.; Hu, L.; Wei, B.

2016-01-01

Highlights: • The increasing Sn content reduces the liquidus temperature. • High Sn content results in lower enthalpy of fusion by polynomial functions. • The thermal diffusivity drops from the solid toward the semi-solid state. • Undercoolability of alloys with primary Cu_2Sb phase is stronger than others. - Abstract: The liquidus and solidus temperatures, enthalpy of fusion, and the temperature dependence of thermal diffusivity for ternary Cu_6_0_−_xSn_xSb_4_0 alloys were systematically measured by DSC and laser flash methods. It is found that both the liquidus temperature and the enthalpy of fusion decrease with the rise of Sn content, and their relationships with alloy composition were established by polynomial functions. The thermal diffusivity usually drops from the solid toward the semi-solid state. The undercoolability of those liquid Cu_6_0_−_xSn_xSb_4_0 alloys with primary Cu_2Sb solid phase is stronger than the others with primary β(SnSb) intermetallic compound, and the increase of cooling rate facilitates further undercooling. Microstructural observation indicates that both of the primary Cu_2Sb and β(SnSb) intermetallic compounds in ternary Cu_6_0_−_xSn_xSb_4_0 alloys grow in faceted mode, and develop into coarse flakes and polygonal blocks.

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Science.gov (United States)

Kotadia, H. R.; Panneerselvam, A.; Mokhtari, O.; Green, M. A.; Mannan, S. H.

2012-04-01

The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0-5% Zn or 0-2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

Examination of the anisotropy of the wetting behaviour of liquid Al-Cu alloys on single crystalline oriented Al{sub 2}O{sub 3}-substrates; Untersuchung der Anisotropie im Benetzungsverhalten fluessiger Al-Cu Legierungen auf einkristallinen orientierten Al{sub 2}O{sub 3}-Substraten

Energy Technology Data Exchange (ETDEWEB)

Schmitz, Julianna

2011-02-04

The wetting behaviour of liquid Al-Cu alloys and pure metals on oriented single crystalline Al{sub 2}O{sub 3}-substrates was examined, utilising the sessile drop technique. Measurements were performed at moderate temperatures of 1100 C, where the alloys are liquid. Different Al{sub 2}O{sub 3}-surfaces were studied, which are terminated by the crystallographic planes (0001), (11 anti 20), and (1 anti 102), also called C-, A-, and R-surfaces. After deposition, pure Cu-droplets show an exponential increase of the wetting angle to a value of about 115 for all investigated Al{sub 2}O{sub 3}-surfaces. The timescale of this increase is of the order of 100 s. The effect of surface- and interfacial energies on the wetting angle is discussed considering Young's equation. The most probable reason for its time-dependence seems to be an increase of the interfacial energy due to deoxidation of the droplet. Therefore it is reasonable to regard the isotropic contact angle value as the intrinsic one of the Cu/Al{sub 2}O{sub 3} system. In contrast, the wetting angle of pure Al metal with the different Al{sub 2}O{sub 3}-substrates shows a qualitatively different behaviour. In this system, it rises from about 90 to 115 roughly for C-substrates, twice as fast as in the Cu case but to a comparable value. On the other substrates a wetting angle of about 90 establishes immediately, and no pronounced time dependence is obvious. In order to study changes in the wetting behaviour of Al-Cu-alloys, which is isotropic for Cu and anisotropic for Al-rich alloys, contact angles of Al{sub 50}Cu{sub 50}, Al{sub 30}Cu{sub 70} und Al{sub 17}Cu{sub 83} on Al{sub 2}O{sub 3} were determined. For each alloy composition the wetting angle is about 120 after 300 s. The initial values on distinct surfaces hardly differ and become non-wetting with increasing Cu-content. Hence, anisotropy decreases. To determine the work of adhesion of the solid-liquid interface, the temperature- and composition

A new Ti-Zr-Hf-Cu-Ni-Si-Sn bulk amorphous alloy with high glass-forming ability

International Nuclear Information System (INIS)

Huang, Y.J.; Shen, J.; Sun, J.F.; Yu, X.B.

2007-01-01

The effect of Sn substitution for Cu on the glass-forming ability was investigated in Ti 41.5 Zr 2.5 Hf 5 Cu 42.5-x Ni 7.5 Si 1 Sn x (x = 0, 1, 3, 5, 7) alloys by using differential scanning calorimetry (DSC) and X-ray diffractometry. The alloy containing 5% Sn shows the highest glass-forming ability (GFA) among the Ti-Zr-Hf-Cu-Ni-Si-Sn system. Fully amorphous rod sample with diameters up to 6 mm could be successfully fabricated by the copper mold casting Ti 41.5 Zr 2.5 Hf 5 Cu 37.5 Ni 7.5 Si 1 Sn 5 alloy. The activation energies for glass transition and crystallization for Ti 41.5 Zr 2.5 Hf 5 Cu 37.5 Ni 7.5 Si 1 Sn 5 amorphous alloy are both larger than those values for the Sn-free alloy. The enhancement in GFA and thermal stability after the partial replacement of Cu by Sn may be contributed to the strong atomic bonding nature between Ti and Sn and the increasing of atomic packing density. The amorphous Ti 41.5 Zr 2.5 Hf 5 Cu 37.5 Ni 7.5 Si 1 Sn 5 alloy also possesses superior mechanical properties

Systematic corrosion investigation of various Cu-Sn alloys electrodeposited on mild steel in acidic solution: Dependence of alloy composition

Energy Technology Data Exchange (ETDEWEB)

Suerme, Yavuz, E-mail: ysurme@nigde.edu.t [Department of Chemistry, Faculty of Science and Art, Nigde University, 51200 Nigde (Turkey); Guerten, A. Ali [Department of Chemistry, Faculty of Science and Art, Osmaniye Korkut Ata University, 80000 Osmaniye (Turkey); Bayol, Emel; Ersoy, Ersay [Department of Chemistry, Faculty of Science and Art, Nigde University, 51200 Nigde (Turkey)

2009-10-19

Copper-tin alloy films were galvanostatically electrodeposited on the mild steel (MS) by combining the different amount of Cu and Sn electrolytes at a constant temperature (55 deg. C) and pH (3.5). Alloy films were characterized by using the energy dispersive X-ray analysis (EDX), scanning electron microscopy (SEM), X-ray diffraction (XRD) and micrographing techniques. Corrosion behaviours were evaluated with electrochemical impedance spectrometry (EIS) and electrochemical polarization measurements. Time gradient of electrolysis process was adjusted to obtain same thickness of investigated alloys on MS. The systematic corrosion investigation of various Cu{sub x}-Sn{sub 100-x} (x = 0-100) alloy depositions on MS substrate were carried out in 0.1 M sulphuric acid medium. Results indicate that the corrosion resistance of the alloy coatings depended on the alloy composition, and the corrosion resistance increased at Cu-Sn alloy deposits in proportion to Sn ratio.

Optimization method for the study of the properties of Al-Sn binary liquid alloys

Energy Technology Data Exchange (ETDEWEB)

Shrestha, G.K. [University Department of Physics, T.M. Bhagalpur University, Bhagalpur (India); Pulchowk Campus, IOE, Tribhuvan University, Lalitpur (Nepal); Singh, B.K. [University Department of Physics, T.M. Bhagalpur University, Bhagalpur (India); Jha, I.S. [M.M.A.M. Campus, Tribhuvan University, Biratnagar (Nepal); Singh, B.P. [University Department of Physics, T.M. Bhagalpur University, Bhagalpur (India); Adhikari, D., E-mail: adksbdev@yahoo.com [M.M.A.M. Campus, Tribhuvan University, Biratnagar (Nepal)

2017-06-01

The best fit value of order energy parameter (W) has been estimated over the entire range of concentration in Al-Sn binary liquid alloy at a specified temperature to determine the thermodynamic properties and concentration fluctuations, obtained by a theoretical formalism in which the combined effect of size ratio, entropic and enthalpic effect is considered. The values of W at different temperatures have been determined by finding the temperature derivative of W which are then used for the optimization procedure in order to determine the corresponding values of excess free energy of mixing, partial excess free energy of mixing and activity of the components involved in the alloy. These parameters have been used to calculate the concentration fluctuations in long wavelength limit {S_c_c(0)} at different temperatures over the entire range of concentration which predict the stability of the alloy at different temperatures.

Coupled growth of Al-Al2Cu eutectics in Al-Cu-Ag alloys

International Nuclear Information System (INIS)

Hecht, U; Witusiewicz, V; Drevermann, A

2012-01-01

Coupled eutectic growth of Al and Al 2 Cu was investigated in univariant Al-Cu-Ag alloys during solidification with planar and cellular morphology. Experiments reveal the dynamic selection of small spacings, below the minimum undercooling spacing and show that distinct morphological features pertain to nearly isotropic or anisotropic Al-Al 2 Cu interfaces.

Interfacial phase formation of Al-Cu bimetal by solid-liquid casting method

Directory of Open Access Journals (Sweden)

Ying Fu

2017-05-01

Full Text Available The solid-liquid method was used to prepare the continuous casting of copper cladding aluminium by liquid aluminum alloy and solid copper, and the interfacial phase formation of Al-Cu bimetal at different pouring temperatures (700, 750, 800 oC was investigated by means of metallograph, scanning electron microscopy (SEM and energy dispersive spectrometry (EDS methods. The results showed that the pouring temperature of aluminum melt had an important influence on the element diffusion of Cu from the solid Cu to Al alloy melt and the reactions between Al and Cu, as well as the morphology of the Al-Cu interface. When the pouring temperature was 800 oC, there were abundant Al-Cu intermetallic compounds (IMCs near the interface. However, a lower pouring temperature (700 oC resulted in the formation of cavities which was detrimental to the bonding and mechanical properties. Under the conditions in this study, the good metallurgical bonding of Al-Cu was achieved at a pouring temperature of 750 oC.

Cu-segregation at the Q'/α-Al interface in Al-Mg-Si-Cu alloy

International Nuclear Information System (INIS)

Matsuda, Kenji; Teguri, Daisuke; Uetani, Yasuhiro; Sato, Tatsuo; Ikeno, Susumu

2002-01-01

Cu segregation was detected at the Q ' /α-Al interface in an Al-Mg-Si-Cu alloy by energy-filtered transmission electron microscopy. By contrast, in a Cu-free Al-Mg-Si alloy no segregation was observed at the interface between the matrix and Type-C precipitate

A new Ti-Zr-Hf-Cu-Ni-Si-Sn bulk amorphous alloy with high glass-forming ability

Energy Technology Data Exchange (ETDEWEB)

Huang, Y.J. [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Shen, J. [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China)]. E-mail: junshen@hit.edu.cn; Sun, J.F. [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Yu, X.B. [Lab of Energy Science and Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)]. E-mail: yuxuebin@hotmail.com

2007-01-16

The effect of Sn substitution for Cu on the glass-forming ability was investigated in Ti{sub 41.5}Zr{sub 2.5}Hf{sub 5}Cu{sub 42.5-x}Ni{sub 7.5}Si{sub 1}Sn {sub x} (x = 0, 1, 3, 5, 7) alloys by using differential scanning calorimetry (DSC) and X-ray diffractometry. The alloy containing 5% Sn shows the highest glass-forming ability (GFA) among the Ti-Zr-Hf-Cu-Ni-Si-Sn system. Fully amorphous rod sample with diameters up to 6 mm could be successfully fabricated by the copper mold casting Ti{sub 41.5}Zr{sub 2.5}Hf{sub 5}Cu{sub 37.5}Ni{sub 7.5}Si{sub 1}Sn{sub 5} alloy. The activation energies for glass transition and crystallization for Ti{sub 41.5}Zr{sub 2.5}Hf{sub 5}Cu{sub 37.5}Ni{sub 7.5}Si{sub 1}Sn{sub 5} amorphous alloy are both larger than those values for the Sn-free alloy. The enhancement in GFA and thermal stability after the partial replacement of Cu by Sn may be contributed to the strong atomic bonding nature between Ti and Sn and the increasing of atomic packing density. The amorphous Ti{sub 41.5}Zr{sub 2.5}Hf{sub 5}Cu{sub 37.5}Ni{sub 7.5}Si{sub 1}Sn{sub 5} alloy also possesses superior mechanical properties.

Surface tension modelling of liquid Cd-Sn-Zn alloys

Science.gov (United States)

Fima, Przemyslaw; Novakovic, Rada

2018-06-01

The thermodynamic model in conjunction with Butler equation and the geometric models were used for the surface tension calculation of Cd-Sn-Zn liquid alloys. Good agreement was found between the experimental data for limiting binaries and model calculations performed with Butler model. In the case of ternary alloys, the surface tension variation with Cd content is better reproduced in the case of alloys lying on vertical sections defined by high Sn to Zn molar fraction ratio. The calculated surface tension is in relatively good agreement with the available experimental data. In addition, the surface segregation of liquid ternary Cd-Sn-Zn and constituent binaries has also been calculated.

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Science.gov (United States)

Jin, S.; Valenza, F.; Novakovic, R.; Leinenbach, C.

2013-06-01

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in contact with Cu and Ni substrates has been investigated. Au-13.7Ge-15.3Sn alloy showed complete wetting on both Cu and Ni substrates. Total spreading of Au-15Ge-17Sb alloy on Cu was also observed, while the final contact angle of this alloy on Ni was about 29°. Pronounced dissolution of Cu substrates into the solder alloys investigated was detected, while the formation of Ni-Ge intermetallic compounds at the interface of both solder/Ni systems suppressed the dissolution of Ni into the solder.

In situ investigation of SnAgCu solder alloy microstructure

International Nuclear Information System (INIS)

Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

2011-01-01

Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

Wetting and interface interactions in the B4C/Al-Me (Me=Cu, Sn) systems

International Nuclear Information System (INIS)

Aizenshtein, M.; Froumin, N.; Dariel, M.P.; Frage, N.

2008-01-01

The wettability of B 4 C in contact with non-carbide and non-boride forming liquid metals (such as Cu or Sn) has been the subject of several studies. These metals do not wet boron carbide unless a reactive element is added to the melt. The present study is concerned with the addition of Al which completes the series of reactive elements added to the non-wetting metals. While Si represents the elements that form stable carbides and Ti represents the elements that form stable borides, Al belongs to the group of elements that form ternary borocarbides. The wetting experiments in the B 4 C/(Me-Al, Me=Cu, Sn) systems have shown that a ternary product, namely Al 8 B 4 C 7 was formed at the interface and that wetting is governed by the thermodynamic properties of the binary liquid system

Fragility and structure of Al-Cu alloy melts

International Nuclear Information System (INIS)

Lv Xiaoqian; Bian Xiufang; Mao Tan; Li Zhenkuan; Guo Jing; Zhao Yan

2007-01-01

The dynamic viscosity measurements are performed for Al-Cu alloy melts with different compositions using an oscillating-cup viscometer. The results show that the viscosities of Al-Cu alloy melts increase with the copper content increasing, and also have a correlation with the correlation radius of clusters, which is measured by the high-temperature X-ray diffractometer. It has also been found that the fragilities of superheated melts (M) of hypereutectic Al-Cu alloys increase with the copper content increasing. There exists a relationship between the fragility and the structure in Al-Cu alloy melts. The value of the M reflects the variation of activation energy for viscous flow

Studies of the development and characterization of the Cu-Ni-Pt and Cu-Ni-Sn alloys for electro-electronic uses

International Nuclear Information System (INIS)

Silva, Luis Carlos Elias da

2006-01-01

The Cu and its alloys have different applications in the owed modern society the excellent electric properties, thermal conductivity, resistance to the corrosion and other properties. These applications can be in valves, pipes, pots for absorption of solar energy, radiators for automobiles, current driver, electronic driver, thermostats elements and structural parts of nuclear reactors, as, for example, reels for field toroidal for a reactor of nuclear coalition. The alloys used in nuclear reactors, we can highlight Cu-Be, Cu-Sn and Cu-Pt. Ni and Co frequently are added to the Cu alloys so that the solubility is moved for temperatures more elevated with relationship to the binary systems of Cu-Sn and Cu-Pt. The addition of Ni-Pt or Ni-Sn to the Cu in the same or inferior percentages to 1,5% plus thermomechanical treatments changes the properties of the copper. We studied the electric conductivity and hardness Vickers of the Cu-Ni-Pt and Cu-Ni-Sn and compared with the electrolytic Cu. In the proposed flowcharts, breaking of the obtaining of the ingot, we proceeded with thermo mechanical treatments. (author)

The Mechanical Properties of AlSi17Cu5 Cast Alloy after Overheating and Modification of CuP Master Alloy

Directory of Open Access Journals (Sweden)

Piątkowski J.

2013-09-01

Full Text Available The paper presents the results of studies on the effect of the AlSi17Cu5 alloy overheating to atemperature of 920°C and modification with phosphorus (CuP10 on the resultingmechanical (HB, Rm, R0.2 and plastic (A5 and Z properties. It has been shown that, so-called, "timethermal treatment" (TTT of an alloy in the liquid state, consisting inoverheating the metal to about 250°C above Tliq,holding at this temperature by 30 minutes improvesthe mechanical properties. It has also been found that overheating of alloy above Tliq.enhances the process of modification, resulting in the formation of fine-grain structure. The primary silicon crystals uniformly distributed in the eutectic and characteristics ofthe α(Al solution supersaturated with alloying elements present in the starting alloy composition (Cu, Fe provide not only an increase of strength at ambient temperature but also at elevated temperature (250°C.

Investigation of new type Cu-Hf-Al bulk glassy alloys

International Nuclear Information System (INIS)

Nagy, E; Ronto, V; Solyom, J; Roosz, A

2009-01-01

In the last years new type Cu-Hf-Al ternary alloys were developed with high glass forming ability and ductility. The addition of Al to Cu-Hf alloys results in improvements in glass formation, thermal stability and mechanical properties of these alloys. We have investigated new Cu-based bulk amorphous alloys in Cu-Hf-Al ternary system. The alloys with Cu 49 Hf 42 Al 9 , Cu 46 Hf 45 Al 9 , Cu 50 Hf 42.5 Al 7.5 and Cu 50 Hf 45 Al 5 compositions were prepared by arc melting. The samples were made by centrifugal casting and were investigated by X-ray diffraction method. Thermodynamic properties were examined by differential scanning calorimetry and the structure of the crystallising phases by scanning electron microscopy. The determination of liquidus temperatures of alloys were measured by differential thermal analysis.

Split Sn-Cu Alloys on Carbon Nanofibers by One-step Heat Treatment for Long-Lifespan Lithium-Ion Batteries

International Nuclear Information System (INIS)

Shen, Zhen; Hu, Yi; Chen, Renzhong; He, Xia; Chen, Yanli; Shao, Hanfeng; Zhang, Xiangwu; Wu, Keshi

2017-01-01

Highlights: • Spilt Sn–Cu alloys and amorphous CNF anodes are introduced. • Sn–Cu–CNFs were prepared by one-step carbonization-alloying reactions. • The spilt Sn–Cu alloys consist of Cu 6 Sn 5 and Cu 3 Sn. • The coexistence of Cu 6 Sn 5 and Cu 3 Sn led to the enhanced cycle durability. - Abstract: To develop next-generation lithium-ion batteries (LIBs) with novel designs, reconsidering traditional materials with enhanced cycle stability and excellent rate performance is crucial. We herein report the successful preparation of three-dimensional (3D) composites in which spilt Sn–Cu alloys are uniformly dispersed in an amorphous carbon nanofiber matrix (Sn–Cu–CNFs) via one-step carbonization-alloying reactions. The spilt Sn–Cu alloys consist of active Cu 6 Sn 5 and inactive Cu 3 Sn, and are controllable by optimization of the carbonization-alloying reaction temperature. The 3D carbon nanofiber framework allowed the Sn–Cu–CNFs to be used directly as anodes in lithium-ion batteries without the requirement for polymer binders or electrical conductors. These composite electrodes exhibited a stable cyclability with a discharge capacity of 400 mA h g −1 at a high current density of 1.0 A g −1 after 1200 cycles, as well as an excellent rate capability, which could be attributed to the improved electrochemical properties of the Sn–Cu–CNFs provided by the buffering effect of Cu 3 Sn and the 3D carbon nanofiber framework. This one-step synthesis is expected to be widely applicable in the targeted structural design of traditional tin-based anode materials.

Enthalpy of mixing of liquid Co–Sn alloys

International Nuclear Information System (INIS)

Yakymovych, A.; Fürtauer, S.; Elmahfoudi, A.; Ipser, H.; Flandorfer, H.

2014-01-01

Highlights: • The enthalpies of mixing of liquid Co–Sn alloys between T = (673 and 1773) K. • The temperature dependence of the enthalpies of mixing was described. • Full report of measured values including polynomial coefficients. - Abstract: A literature overview of enthalpy of mixing data for liquid Co–Sn alloys shows large scattering but no clear temperature dependence. Therefore drop calorimetry was performed in the Co–Sn system at twelve different temperatures in 100 K steps in the temperature range (673 to 1773) K. The integral enthalpy of mixing was determined starting from 1173 K and fitted to a standard Redlich–Kister polynomial. In addition, the limiting partial molar enthalpy of Co in Sn was investigated by small additions of Co to liquid Sn at temperatures (673 to 1773) K. The integral and partial molar enthalpies of the Co–Sn system generally show an exothermic mixing behavior. Significant temperature dependence was detected for the enthalpies of mixing. The minimum integral enthalpy values vary with rising temperature from approx. −7820 J/mol at T = 1173 K to −1350 J/mol at T = 1773 K; the position of the minimum is between (59 and 61) at.% Co. The results are discussed and compared with literature data available for this system. X-ray studies and scanning electron microscopy of selected alloys obtained from the calorimetric measurements were carried out in order to check the completeness of the solution process

Influence of alloying element of corrosion of Zr-Nb-Sn-Fe-Cu alloy and impedance characteristics of its oxide layer

International Nuclear Information System (INIS)

Park, S. Y.; Lee, M. H.; Choi, B. K.; Jung, Y. H.; Jung, Y. H.

2000-01-01

As a part of the advanced Zr fuel cladding development program, the autoclave corrosion test was performed on the series of Zr-0.2Nb-1.1Sn-Fe-Cu and Zr-0.4Nb-0.8Sn-Fe-Cu alloys in 70 ppm LiOH solution at 360 .deg. C. The oxide characteristics were investigated by using the Electrochemical Impedance Spectroscope(EIS) method. The corrosion resistance of the alloys was evaluated from the corrosion rate determined as a function of the concentration of main alloying elements such as Nb, Sn, Fe and Cu. The equivalent circuit was composed as a result of the spectrum from EIS measurements on the oxide layer that formed at pro- and post-transition regions. By using the capacitance characteristics of equivalent circuit, the thickness of impervious layer, it's electrical resistance and characteristics of space charge layer were evaluated. The corrosion characteristics of the Zr-Nb-Sn-Fe-Cu alloys were successfully explained by applying the EIS test results

Facile synthesis of dendritic Cu by electroless reaction of Cu-Al alloys in multiphase solution

Energy Technology Data Exchange (ETDEWEB)

Wang, Ying; Liang, Shuhua, E-mail: liangxaut@gmail.com; Yang, Qing; Wang, Xianhui

2016-11-30

Highlights: • Nano- or micro-scale fractal dendritic copper (FDC) was synthesized by electroless immersing of Cu-Al alloys in CuCl{sub 2} + HCl. • FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. • Nanoscale Cu{sub 2}O was found at the edge of FDC. Nanoporous copper (NPC) can also be obtained by using Cu{sub 17}Al{sub 83} alloy. • The potential difference between CuAl{sub 2} and α-Al phase and the replacement reaction in multiphase solution are key factors. - Abstract: Two-dimensional nano- or micro-scale fractal dendritic coppers (FDCs) were synthesized by electroless immersing of Cu-Al alloys in hydrochloric acid solution containing copper chloride without any assistance of template or surfactant. The FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. Compared to Cu{sub 40}Al{sub 60} and Cu{sub 45}Al{sub 55} alloys, the FDC shows hierarchical distribution and homogeneous structures using Cu{sub 17}Al{sub 83} alloy as the starting alloy. The growth direction of the FDC is <110>, and all angles between the trunks and branches are 60°. Nanoscale Cu{sub 2}O was found at the edge of FDC. Interestingly, nanoporous copper (NPC) can also be obtained through Cu{sub 17}Al{sub 83} alloy. Studies showed that the formation of FDC depended on two key factors: the potential difference between CuAl{sub 2} intermetallic and α-Al phase of dual-phase Cu-Al alloys; a replacement reaction that usually occurs in multiphase solution. The electrochemical experiment further proved that the multi-branch dendritic structure is very beneficial to the proton transfer in the process of catalyzing methanol.

Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

Energy Technology Data Exchange (ETDEWEB)

Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

2009-05-27

The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

Effect of Sn addition on the corrosion behavior of Ti-7Cu-Sn cast alloys for biomedical applications.

Science.gov (United States)

Tsao, L C

2015-01-01

The aim of this study was to investigate the effects of Sn content on the microstructure and corrosion resistance of Ti7CuXSn (x=0-5 wt.%) samples. The corrosion tests were carried out in 0.9 wt.% NaCl solution at 25 °C. The electrochemical corrosion behavior of the Ti7CuXSn alloy samples was evaluated using potentiodynamic polarization curves, electrochemical impedance spectroscopy (EIS), and equivalent circuit analysis. The resulting impedance parameters and polarization curves showed that adding Sn improved the electrochemical corrosion behavior of the Ti7CuXSn alloy. The Ti7CuXSn alloy samples were composed of a dual-layer oxide consisting of an inner barrier layer and an outer porous layer. Copyright © 2014 Elsevier B.V. All rights reserved.

Corrosion behavior of die-cast Mg-4Al-2Sn-xCa alloy

Energy Technology Data Exchange (ETDEWEB)

Park, Kyung Chul; Kim, Byeong Ho; Kim, Kyung Ro [Defence Agency for Technology and Quality, Jinju (Korea, Republic of); Cho, Dae Hyun; Park, Ik Min [Pusan National University, Busan (Korea, Republic of)

2016-05-15

In the present work, the effect of Ca additions on microstructure and corrosion characteristics of high pressure die-cast Mg-4Al-2Sn alloy has been investigated. Mg-4Al-2Sn-xCa (x= 0, 0.3 and 0.7wt.%) alloy was prepared by using a high pressure die-casting method. Results indicated that the microstructure of Mg-4Al-2Sn alloy consisted of α-Mg, Mg{sub 17}Al{sub 12} and Mg{sub 2}Sn phase. With increase of Ca additions, CaMgSn phase was newly formed and grain size was sharply decreased. From the test results, the corrosion resistance of die-cast Mg-4Al-2Sn alloy was significantly improved by Ca addition. It is considered that stabilization of Mg(OH){sub 2} layer and refinements of microstructure with increase of Ca additions.

Cu-Nb3Sn superconducting wires prepared by ''Copper Liquid Phase Sintering method'' using the Nb-H

International Nuclear Information System (INIS)

Resende, A.T. de.

1985-01-01

Cu-30% Nb in weighting were prepared by the method of Copper sintering liquid phase the method was improved by substitution of Nb power by Nb-H powder, obtaining a high density material with good mechanical properties, which was reduced to fine. Wire, Without heat treatment. The Cu-Nb 3 Sn wires were obtained by external diffusion process depositing tin in the Cu-30%Nb wires, and by internal diffusion process using the Sn-8.5% Cu in weighting, which was reduced to rods of 3.5 mm. These Cu-30%Nb rods were enclosed in copper tubes and deformed mechanically by rotary swaging and drawing. During the drawing step some wires were fractured, that were analysed and correlated with the microstructure of the Sn-8.5 Wt% Cu alloy. External and internal diffusion samples; after a fast thermal treatment for Sn diffusion, were submited to the temperature of 700 0 C to provide the reaction between Sn and Nb, leading to the Nb 3 Sn phase. Samples with several reaction times, and its influence on T c and J c critical parameters and normal resistivity were prepared and analysed. (author) [pt

Mechanical properties of Al-Cu alloy-SiC composites

Science.gov (United States)

Anggara, B. S.; Handoko, E.; Soegijono, B.

2014-09-01

The synthesis of aluminum (Al) alloys, Al-Cu, from mixture 96.2 % Al and 3.8 % Cu has been prepared by melting process at a temperature of 1200°C. The adding 12.5 wt% up to 20 wt% of SiC on Al-Cu alloys samples has been investigated. The structure analyses were examined by X-Ray Diffractometer (XRD) and scanning electron microscope (SEM). Moreover, the morphology of Al-Cu alloys has been seen as structure in micrometer range. The hardness was measured by hardness Vickers method. According to the results, it can be assumed that the 15 wt% of SiC content is prefer content to get better quality of back to back hardness Vickers of Al-Cu alloys.

Mechanical properties of Al-Cu alloy-SiC composites

Energy Technology Data Exchange (ETDEWEB)

Anggara, B. S., E-mail: anggorobs1960@yahoo.com [Jurusan Fisika, FMIPA Universitas Negeri Jakarta, Indonesia 13220 and PPS Ilmu Material, Department Fisika, FMIPA, Universitas Indonesia (Indonesia); Handoko, E. [Jurusan Fisika, FMIPA Universitas Negeri Jakarta, 13220 (Indonesia); Soegijono, B. [PPS Ilmu Material, Department Fisika, FMIPA, Universitas Indonesia (Indonesia)

2014-09-25

The synthesis of aluminum (Al) alloys, Al-Cu, from mixture 96.2 % Al and 3.8 % Cu has been prepared by melting process at a temperature of 1200°C. The adding 12.5 wt% up to 20 wt% of SiC on Al-Cu alloys samples has been investigated. The structure analyses were examined by X-Ray Diffractometer (XRD) and scanning electron microscope (SEM). Moreover, the morphology of Al-Cu alloys has been seen as structure in micrometer range. The hardness was measured by hardness Vickers method. According to the results, it can be assumed that the 15 wt% of SiC content is prefer content to get better quality of back to back hardness Vickers of Al-Cu alloys.

Studies of the development and characterization of the Cu-Ni-Pt and Cu-Ni-Sn alloys for electro-electronic uses; Estudos do desenvolvimento e caracterizacao das ligas Cu-Ni-Pt e Cu-Ni-Sn para fins eletro-eletronicos

Energy Technology Data Exchange (ETDEWEB)

Silva, Luis Carlos Elias da

2006-07-01

The Cu and its alloys have different applications in the owed modern society the excellent electric properties, thermal conductivity, resistance to the corrosion and other properties. These applications can be in valves, pipes, pots for absorption of solar energy, radiators for automobiles, current driver, electronic driver, thermostats elements and structural parts of nuclear reactors, as, for example, reels for field toroidal for a reactor of nuclear coalition. The alloys used in nuclear reactors, we can highlight Cu-Be, Cu-Sn and Cu-Pt. Ni and Co frequently are added to the Cu alloys so that the solubility is moved for temperatures more elevated with relationship to the binary systems of Cu-Sn and Cu-Pt. The addition of Ni-Pt or Ni-Sn to the Cu in the same or inferior percentages to 1,5% plus thermomechanical treatments changes the properties of the copper. We studied the electric conductivity and hardness Vickers of the Cu-Ni-Pt and Cu-Ni-Sn and compared with the electrolytic Cu. In the proposed flowcharts, breaking of the obtaining of the ingot, we proceeded with thermo mechanical treatments. (author)

Facile synthesis of dendritic Cu by electroless reaction of Cu-Al alloys in multiphase solution

Science.gov (United States)

Wang, Ying; Liang, Shuhua; Yang, Qing; Wang, Xianhui

2016-11-01

Two-dimensional nano- or micro-scale fractal dendritic coppers (FDCs) were synthesized by electroless immersing of Cu-Al alloys in hydrochloric acid solution containing copper chloride without any assistance of template or surfactant. The FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl2 + HCl solution. Compared to Cu40Al60 and Cu45Al55 alloys, the FDC shows hierarchical distribution and homogeneous structures using Cu17Al83 alloy as the starting alloy. The growth direction of the FDC is , and all angles between the trunks and branches are 60°. Nanoscale Cu2O was found at the edge of FDC. Interestingly, nanoporous copper (NPC) can also be obtained through Cu17Al83 alloy. Studies showed that the formation of FDC depended on two key factors: the potential difference between CuAl2 intermetallic and α-Al phase of dual-phase Cu-Al alloys; a replacement reaction that usually occurs in multiphase solution. The electrochemical experiment further proved that the multi-branch dendritic structure is very beneficial to the proton transfer in the process of catalyzing methanol.

Cu-Al alloy formation by thermal annealing of Cu/Al multilayer films deposited by cyclic metal organic chemical vapor deposition

Science.gov (United States)

Moon, Hock Key; Yoon, Jaehong; Kim, Hyungjun; Lee, Nae-Eung

2013-05-01

One of the most important issues in future Cu-based interconnects is to suppress the resistivity increase in the Cu interconnect line while decreasing the line width below 30 nm. For the purpose of mitigating the resistivity increase in the nanoscale Cu line, alloying Cu with traces of other elements is investigated. The formation of a Cu alloy layer using chemical vapor deposition or electroplating has been rarely studied because of the difficulty in forming Cu alloys with elements such as Al. In this work, Cu-Al alloy films were successfully formed after thermal annealing of Cu/Al multilayers deposited by cyclic metal-organic chemical vapor deposition (C-MOCVD). After the C-MOCVD of Cu/Al multilayers without gas phase reaction between the Cu and Al precursors in the reactor, thermal annealing was used to form Cu-Al alloy films with a small Al content fraction. The resistivity of the alloy films was dependent on the Al precursor delivery time and was lower than that of the aluminum-free Cu film. No presence of intermetallic compounds were detected in the alloy films by X-ray diffraction measurements and transmission electron spectroscopy.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Directory of Open Access Journals (Sweden)

Lei Sun

2015-01-01

Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Microstructure of AlSi17Cu5 alloy after overheating over liquidus temperature

Directory of Open Access Journals (Sweden)

J. Piątkowski

2015-01-01

Full Text Available The paper presents microstructure tests of alloy AlSi17Cu5. In order to disintegrate the primary grain of silicon the so-called time-temperature transformation TTT was applied which was based on overheating the liquid alloy way over the temperature Tliq., soaking in it for 30 minutes and casting it to a casting mould. It was found that such process causes the achievement of fine-crystalline structure and primary silicon crystals take up the form of pentahedra or frustums of pyramids. With the use of X-ray microanalysis and X-ray diffraction analysis the presence of intermetallic phases Al2Cu, Al4Cu9 which are the ingredients of eutectics α - AlCu - β and phase Al9Fe2Si which is a part of eutectic α - AlFeSi - β was confirmed.

Study On Nanohardness Of Phases Occurring In ZnAl22Cu3 And ZnAl40Cu3 Alloys

Directory of Open Access Journals (Sweden)

Michalik R.

2015-06-01

Full Text Available Zn-Al alloys are mainly used due to their high tribological and damping properties. A very important issue is determination of the hardness of the phases present in the Zn-Al-Cu alloys. Unfortunately, in literature there is lack of studies on the hardness of the phases present in the alloys Zn-Al-Cu. The aim of this research was to determine the hardness of the phases present in the ZnAl22Cu3Si and ZnAl40Cu3Si alloys. The scope of the research included examination of the structure, chemical composition of selected micro-regions and hardness of phases present in the examined alloys. The research carried out has shown, that CuZn4 phase is characterized by a similar hardness as the hardness of the interdendritic areas. The phases present in the structure of ZnAl40Cu3 and ZnAl22Cu3 alloys after soaking at the temperature of 185 °C are characterized by lower hardness than the phase present in the structure of the as-cast alloys.

Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

Energy Technology Data Exchange (ETDEWEB)

Gancarz, Tomasz, E-mail: tomasz.gancarz@imim.pl [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Bobrowski, Piotr; Pstruś, Janusz [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Pawlak, Sylwia [Wroclaw Research Centre EIT+, Wroclaw (Poland)

2016-09-15

The microstructural features, thermal properties and mechanical properties of eutectic Sn–Zn alloys with varying Na content (0.1, 0.2, 0.5, 1.0 3.0 and 5.0 at. %) were examined in this study. In the scanning electron microscopy, transmission electron microscopy, and X-ray diffraction analysis data, precipitates of NaSn were observed. The addition of Na to eutectic Sn–Zn alloy improved the mechanical properties and increased electrical resistivity, and reduced the coefficient of thermal expansion; however, the melting point did not change. Wettability tests carried out using Na-doped Sn–15Zn alloys on Cu substrates showed the formation of Cu–Zn phases at the interfaces. Wettability studies were performed using flux ALU33 after 60, 180, 480, 900, 1800 and 3600 s of contact, at temperatures of 230, 250, 280 and 320 °C. The experiments were designed to demonstrate the effect of Na addition on the formation and growth kinetics of Cu{sub 5}Zn{sub 8} and CuZn{sub 4} phases, which were identified using XRDs and EDS. The addition of Na to SnZn causes a reduction in the thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate, and an increase in the activation energy of the Cu{sub 5}Zn{sub 8} phase compared to eutectic SnZn. - Highlights: • Precipitates of NaSn was observed and confirmed using TEM and XRD. • Addition Na to eutectic SnZn cussed increased the mechanical properties. • IMCs of Na–Zn and Na–Sn increased electrical resistivity and reduced the CTE. • IMCs layers CuZn{sub 4} and Cu{sub 5}Zn{sub 8} was found at the interface. • Na content changing the character of growth CuZn{sub 4} layer in SnZnNa alloys.

The electrochemical properties of melt-spun Al-Si-Cu alloys

International Nuclear Information System (INIS)

Zhang Linping; Wang Fei; Liang Pu; Song Xianlei; Hu Qing; Sun Zhanbo; Song Xiaoping; Yang Sen; Wang Liqun

2011-01-01

Highlights: → Non-equilibrium Al 75-X Si 25 Cu X alloys exhibit high lithiation storages. → The lithiation mechanism is different from melt-spun Al-Si-Mn system. → The structural evolution is mitigated in the non-equilibrium alloys. → Volume variation is alleviated due to the co-existence of Al 2 Cu, α-Si and α-Al. - Abstract: Melt spinning was used to prepare Al 75-X Si 25 Cu X (X = 1, 4, 7, 10 mol%) alloy anode materials for lithium-ion batteries. A metastable supersaturated solid solution of Si and Cu in fcc-Al, α-Si and Al 2 Cu co-existed in the alloys. Nano-scaled α-Al grains, as the matrix, formed in the as-quenched ribbons. The Al 74 Si 25 Cu 1 and Al 71 Si 25 Cu 4 anodes exhibited initial discharge specific capacities of 1539 mAh g -1 , 1324 mAh g -1 and reversible capacities above 472 mAh g -1 , 508 mAh g -1 at the 20th cycle, respectively. The specific capacities reduced as the increase of the Cu content. AlLi intermetallic compound was detected in the lithiated alloys. It is concluded that the lithiation mechanism of the Al-Si-based alloys can be affected by the third component. The structural evolution and volume variation can be mitigated due to the formation of non-equilibrium state and the co-existence of nano-scaled α-Al, α-Si, and Al 2 Cu for the present alloys.

Hot cracks formation nature in welds Al-Mg-Li and Al-Cu-Li alloy systems

International Nuclear Information System (INIS)

Ryazantsev, V.I.; Fedoseev, V.A.

1997-01-01

Mechanism of cleavage formation in alloy systems Al-Mg-Li and Al-Cu-Li welds at thermal test is proposed. This mechanism is connected with stitching spacing and stretching in direction of main deformation of intermetallic compounds inclusions and with active gases movement into the liquid phase [ru

A new dental powder from nanocrystalline melt-spun Ag-Sn-Cu alloy ribbons

International Nuclear Information System (INIS)

Do-Minh, N.; Le-Thi, C.; Nguyen-Anh, S.

2003-01-01

A new non-gamma-two dental powder has been developed from nanocrystalline melt-spun Ag-Sn-Cu alloy ribbons. The amalgam made from this powder exhibits excellent properties for dental filling. The nanocrystalline microstructure was found for the first time in as-spun and heat treated Ag(27-28)Sn(9-32) Cu alloy ribbons, using X-ray diffraction, scanning electron microscopy and energy-dispersive spectroscopy. As-spun ribbons exhibited a multi-phase microstructure with preferred existence of β (Ag 4 Sn) phase formed during rapid solidification (RS) due to supersaturating of copper (Cu) atoms and homogenous nanostructure with subgrain size of about (40-50) nm, which seems to be developed during RS process and can be caused by eutectic reaction of the Ag 3 Sn/Ag 4 Sn-Cu 3 Sn system. In heat treated ribbons the clustering of Cu atoms was always favored and stable in an ageing temperature and time interval determined by Cu content. The heat treatment led to essential changes of subgrain morphology, resulted in the appearance of large-angle boundaries with fine Cu 3 Sn precipitates and forming typical recrystallization twins. Such a microstructure variation in melt-spun ribbons could eventually yield enhanced technological, clinical and physical properties of the dental products, controlled by the ADA Specification N deg 1 and reported before. Thus, using the rapid solidification technique a new non-gamma-two dental material of high quality, nanocrystalline ribbon powder, can be produced. Copyright (2003) AD-TECH - International Foundation for the Advancement of Technology Ltd

Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate

Directory of Open Access Journals (Sweden)

Limin Zhang

2018-01-01

Full Text Available The effect of direct current (DC on the wetting behavior of Cu substrate by liquid Ga–25In–13Sn alloy at room temperature is investigated using a sessile drop method. It is found that there is a critical value for current intensity, below which the decrease of contact angle with increasing current intensity is approximately linear and above which contact angle tends to a stable value from drop shape. Current polarity is a negligible factor in the observed trend. Additionally, the observed change in contact angles is translated into the corresponding change in solid-liquid interfacial tension using the equation of state for liquid interfacial tensions. The solid-liquid interfacial tension decreases under DC. DC-induced promotion of solute diffusion coefficient is likely to play an important role in determining the wettability and solid-liquid interfacial tension under DC.

The electrochemical properties of melt-spun Al-Si-Cu alloys

Energy Technology Data Exchange (ETDEWEB)

Zhang Linping; Wang Fei; Liang Pu; Song Xianlei; Hu Qing [MOE Key Laboratory for Non-equilibrium Synthesis and Modulation of Condensed Matter, State Key Laboratory for Mechanical Behavior of Materials, Xi' an Jiaotong University, Xi' an 710049 (China); Sun Zhanbo, E-mail: szb@mail.xjtu.edu.cn [MOE Key Laboratory for Non-equilibrium Synthesis and Modulation of Condensed Matter, State Key Laboratory for Mechanical Behavior of Materials, Xi' an Jiaotong University, Xi' an 710049 (China); Song Xiaoping; Yang Sen; Wang Liqun [MOE Key Laboratory for Non-equilibrium Synthesis and Modulation of Condensed Matter, State Key Laboratory for Mechanical Behavior of Materials, Xi' an Jiaotong University, Xi' an 710049 (China)

2011-10-03

Highlights: {yields} Non-equilibrium Al{sub 75-X}Si{sub 25}Cu{sub X} alloys exhibit high lithiation storages. {yields} The lithiation mechanism is different from melt-spun Al-Si-Mn system. {yields} The structural evolution is mitigated in the non-equilibrium alloys. {yields} Volume variation is alleviated due to the co-existence of Al{sub 2}Cu, {alpha}-Si and {alpha}-Al. - Abstract: Melt spinning was used to prepare Al{sub 75-X}Si{sub 25}Cu{sub X} (X = 1, 4, 7, 10 mol%) alloy anode materials for lithium-ion batteries. A metastable supersaturated solid solution of Si and Cu in fcc-Al, {alpha}-Si and Al{sub 2}Cu co-existed in the alloys. Nano-scaled {alpha}-Al grains, as the matrix, formed in the as-quenched ribbons. The Al{sub 74}Si{sub 25}Cu{sub 1} and Al{sub 71}Si{sub 25}Cu{sub 4} anodes exhibited initial discharge specific capacities of 1539 mAh g{sup -1}, 1324 mAh g{sup -1} and reversible capacities above 472 mAh g{sup -1}, 508 mAh g{sup -1} at the 20th cycle, respectively. The specific capacities reduced as the increase of the Cu content. AlLi intermetallic compound was detected in the lithiated alloys. It is concluded that the lithiation mechanism of the Al-Si-based alloys can be affected by the third component. The structural evolution and volume variation can be mitigated due to the formation of non-equilibrium state and the co-existence of nano-scaled {alpha}-Al, {alpha}-Si, and Al{sub 2}Cu for the present alloys.

Instability of TiC and TiAl3 compounds in Al-10Mg and Al-5Cu alloys by addition of Al-Ti-C master alloy

Institute of Scientific and Technical Information of China (English)

无

2006-01-01

The performance of Al-Ti-C master alloy in refining Al-10Mg and A1-5Cu alloys was studied by using electron probe micro-analyzer (EPMA) and X-ray diffractometer (XRD) analysis.The results indicate that there are obvious fading phenomena in both Al-10Mg and Al-5Cu alloys with the addition of Al-5Ti-0.4C refiner which contains TiC and TiAl3 compounds.Mg element has no influence on the stability of TiC and TiAl3, while TiC particles in Al-10Mg alloy react with Al to form Al4C3 particles, resulting in the refinement fading.However, TiC particles are relatively stable in Al-5Cu alloy, while TiAl3 phase reacts with Al2Cu to produce a new phase Ti(Al, Cu)2, which is responsible for the refinement fading in Al-5Cu alloy.These indicate that the refinement fading will not occur only when both the TiC particles and TiAl3 compound of Al-Ti-C refiner are stable in Al alloys.

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

DEFF Research Database (Denmark)

Sopousek, J.; Palcut, Marián; Hodúlová, Erika

2010-01-01

The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...... to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry...

Functional Performances of CuZnAl Shape Memory Alloy Open-Cell Foams

Science.gov (United States)

Biffi, C. A.; Casati, R.; Bassani, P.; Tuissi, A.

2018-01-01

Shape memory alloys (SMAs) with cellular structure offer a unique mixture of thermo-physical-mechanical properties. These characteristics can be tuned by changing the pore size and make the shape memory metallic foams very attractive for developing new devices for structural and functional applications. In this work, CuZnAl SMA foams were produced through the liquid infiltration of space holder method. In comparison, a conventional CuZn brass alloy was foamed trough the same method. Functional performances were studied on both bulk and foamed SMA specimens. Calorimetric response shows similar martensitic transformation (MT) below 0 °C. Compressive response of CuZnAl revealed that mechanical behavior is strongly affected by sample morphology and that damping capacity of metallic foam is increased above the MT temperatures. The shape memory effect was detected in the CuZnAl foams. The conventional brass shows a compressive response similar to that of the martensitic CuZnAl, in which plastic deformation accumulation occurs up to the cellular structure densification after few thermal cycles.

Phase Equilibria of Sn-Co-Cu Ternary System

Science.gov (United States)

Chen, Yu-Kai; Hsu, Chia-Ming; Chen, Sinn-Wen; Chen, Chih-Ming; Huang, Yu-Chih

2012-10-01

Sn-Co-Cu ternary alloys are promising lead-free solders, and isothermal sections of Sn-Co-Cu phase equilibria are fundamentally important for the alloys' development and applications. Sn-Co-Cu ternary alloys were prepared and equilibrated at 523 K, 1073 K, and 1273 K (250 °C, 800 °C, and 1000 °C), and the equilibrium phases were experimentally determined. In addition to the terminal solid solutions and binary intermetallic compounds, a new ternary compound, Sn3Co2Cu8, was found. The solubilities of Cu in the α-CoSn3 and CoSn2 phases at 523 K (250 °C) are 4.2 and 1.6 at. pct, respectively, while the Cu solubility in the α-Co3Sn2 phase is as high as 20.0 at. pct. The Cu solubility increases with temperature and is around 30.0 at. pct in the β-Co3Sn2 at 1073 K (800 °C). The Co solubility in the η-Cu6Sn5 phase is also significant and is 15.5 at. pct at 523 K (250 °C).

Microstructure, Tensile Properties, and Corrosion Behavior of Die-Cast Mg-7Al-1Ca- xSn Alloys

Science.gov (United States)

Wang, Feng; Dong, Haikuo; Sun, Shijie; Wang, Zhi; Mao, Pingli; Liu, Zheng

2018-02-01

The microstructure, tensile properties, and corrosion behavior of die-cast Mg-7Al-1Ca- xSn ( x = 0, 0.5, 1.0, and 2.0 wt.%) alloys were studied using OM, SEM/EDS, tensile test, weight loss test, and electrochemical test. The experimental results showed that Sn addition effectively refined grains and intermetallic phases and increased the amount of intermetallic phases. Meanwhile, Sn addition to the alloys suppressed the formation of the (Mg,Al)2Ca phase and resulted in the formation of the ternary CaMgSn phase and the binary Mg2Sn phase. The Mg-7Al-1Ca-0.5Sn alloy exhibited best tensile properties at room temperature, while Mg-7Al-1Ca-1.0Sn alloy exhibited best tensile properties at elevated temperature. The corrosion resistance of studied alloys was improved by the Sn addition, and the Mg-7Al-1Ca-0.5Sn alloy presented the best corrosion resistance.

Designing a New Ni-Mn-Sn Ferromagnetic Shape Memory Alloy with Excellent Performance by Cu Addition

Directory of Open Access Journals (Sweden)

Kun Zhang

2018-02-01

Full Text Available Both magnetic-field-induced reverse martensitic transformation (MFIRMT and a high working temperature are crucial for the application of Ni-Mn-Sn magnetic shape memory alloys. Here, by first-principles calculations, we demonstrate that the substitution of Cu for Sn is effective not only in enhancing the MFIRMT but also in increasing martensitic transformation, which is advantageous for its application. Large magnetization difference (ΔM in Ni-Mn-Sn alloy is achieved by Cu doping, which arises from the enhancement of magnetization of austenite due to the change of Mn-Mn interaction from anti-ferromagnetism to ferromagnetism. This directly leads to the enhancement of MFIRMT. Meanwhile, the martensitic transformation shifts to higher temperature, owing to the energy difference between the austenite L21 structure and the tetragonal martensite L10 structure increases by Cu doping. The results provide the theoretical data and the direction for developing a high temperature magnetic-field-induced shape memory alloy with large ΔM in the Ni-Mn-Sn Heusler alloy system.

Fabrication and mechanical behavior of bulk nanoporous Cu via chemical de-alloying of Cu–Al alloys

Energy Technology Data Exchange (ETDEWEB)

Chen, Fei, E-mail: chenfei027@gmail.com [State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070 (China); Chen, Xi; Zou, Lijie; Yao, Yao; Lin, Yaojun; Shen, Qiang [State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070 (China); Lavernia, Enrique J. [Department of Chemical Engineering and Materials Science, University of California at Irvine, Irvine, CA 92697 (United States); Zhang, Lianmeng, E-mail: lmzhang@whut.edu.cn [State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070 (China)

2016-04-13

We report on a study of the influence of microstructure on the mechanical behavior of bulk nanoporous Cu fabricated by chemical de-alloying of Cu{sub 50}Al{sub 50}, Cu{sub 40}Al{sub 60}, Cu{sub 33}Al{sub 67} and Cu{sub 30}Al{sub 70} (at%) alloys. The precursor Cu–Al alloys were fabricated using arc melting and bulk nanoporous Cu was obtained by subsequent de-alloying of Cu–Al alloys in 20 wt% NaOH aqueous solution at a temperature of 65 °C. We studied the microstructure of the precursor Cu–Al alloys, as well as that of the as de-alloyed bulk nanoporous Cu, using X-ray diffraction, scanning electron microscopy and energy dispersive spectrometry. Moreover, the compressive strength of bulk nanoporous Cu was measured and the relationship between microstructure and mechanical properties was studied. Our results show that the microstructure of bulk nanoporous Cu is characterized by bi-continuous interpenetrating ligament-channels with a ligament size of 130±20 nm (for Cu{sub 50}Al{sub 50}), 170±20 nm (for Cu{sub 40}Al{sub 60}) and 160±10 nm (for Cu{sub 33}Al{sub 67}). Interestingly the microstructure of de-alloyed Cu{sub 30}Al{sub 70} is bimodal with nanopores (100's nm) and interspersed featureless regions a few microns in size. The compressive strength increased with decreasing volume fraction of porosity; as porosity increased 56.3±2% to 73.9±2%, the compressive strength decreased from 17.18±1 MPa to 2.71±0.5 MPa.

Study of properties of Cu-Y and Cu-Y-Al system alloys

International Nuclear Information System (INIS)

Shparo, N.B.; Nikolaev, A.K.; Rozenberg, V.M.

1978-01-01

Investigated were the strength properties of alloys Cu(0-1.2)% Y and Cu-(10-0.5)% Al-(0-0.5)% Y after being treated under various heat conditions and tested at temperatures of 20, 400 and 600 deg C. Yttrium additions raise the temperature of recrystallization of copper and of copper-aluminium alloys. Small additions of yttrium (0.05%) increase considerably strength of Cu-Al alloys without increasing their electric resistance. Optimum properties are attained after hardening, deformation and ageing at 400 deg C

Bulk synthesis by spray forming of Al–Cu–Fe and Al–Cu–Fe–Sn alloys containing a quasicrystalline phase

International Nuclear Information System (INIS)

Srivastava, V.C.; Huttunen-Saarivirta, E.; Cui, C.; Uhlenwinkel, V.; Schulz, A.; Mukhopadhyay, N.K.

2014-01-01

Highlights: • 40 kg Bulk material spray formed based on Al–Cu–Fe and Al–Cu–Fe + Sn. • Deposited Al–Cu–Fe alloy showed single phase bulk quasicrystals(QC). • DSC, XRD and microscopic analyses were done to ascertain the QC nature. • Sn does not help in single phase quasicrystal formation in the deposit. • The possible structural evolution mechanisms have been discussed in detail. - Abstract: In this study, Al–Cu–Fe alloys without and with the addition of Sn and containing a quasicrystalline phase were spray deposited. The spray-deposited bulk materials were characterized in terms of microstructure and hardness. The results showed that the Al 62.5 Cu 25 Fe 12.5 alloy contains the icosahedral quasicrystalline phase (i-phase) along with the minor λ-Al 13 Fe 4 phase, whereas the Al 62.5 Cu 25 Fe 12.5 + Sn alloy contains five phases: the major i-phase and the crystalline phases of Sn, θ-Al 2 Cu, λ-Al 13 Fe 4 and β-AlFe(Cu) phases. These results have been corroborated by X-ray diffraction (XRD), scanning and transmission electron microscopies (SEM and TEM) and differential scanning calorimetry (DSC). The hardness value of the Al–Cu–Fe alloy reached 10.5 GPa at 50 g load and then decreased steadily with increase in the applied load, while that for Al–Cu–Fe–Sn alloy it was originally somewhat lower, then decreased dramatically with slight increase in the applied load but stayed constant with further load increase. The hardness indentations in Al–Cu–Fe alloy introduced cracking in the material, whereas in the case of Al–Cu–Fe–Sn alloy the Sn-rich areas inhibited the crack growth. The present study provides an insight into the mechanism of phase and microstructural evolutions during spray forming of the studied alloys. Furthermore, the role of Sn in terms of microstructure and properties is highlighted

Elastocaloric effect in CuAlZn and CuAlMn shape memory alloys under compression

OpenAIRE

Qian, Suxin; Geng, Yunlong; Wang, Yi; Pillsbury, Thomas E.; Hada, Yoshiharu; Yamaguchi, Yuki; Fujimoto, Kenjiro; Hwang, Yunho; Radermacher, Reinhard; Cui, Jun; Yuki, Yoji; Toyotake, Koutaro; Takeuchi, Ichiro

2016-01-01

This paper reports the elastocaloric effect of two Cu-based shape memory alloys: Cu68Al16Zn16 (CuAlZn) and Cu73Al15Mn12 (CuAlMn), under compression at ambient temperature. The compression tests were conducted at two different rates to approach isothermal and adiabatic conditions. Upon unloading at a strain rate of 0.1 s−1 (adiabatic condition) from 4% strain, the highest adiabatic temperature changes (ΔTad) of 4.0 K for CuAlZn and 3.9 K for CuAlMn were obtained. The maximum stress and hystere...

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

OpenAIRE

Sun, Lei; Zhang, Liang

2015-01-01

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

Solidified structure of Al-Pb-Cu alloys

International Nuclear Information System (INIS)

Ikeda, Tetsuyuki; Nishi, Seiki; Kumeuchi, Hiroyuki; Tatsuta, Yoshinori.

1986-01-01

Al-Pb-Cu alloys were cast into bars or plates in different two metal mold casting processes in order to suppress gravity segregation of Pb and to achieve homogeneous dispersion of Pb phase in the alloys. Solidified structures were analyzed by a video-pattern-analyzer. Plate castings 15 to 20 mm in thickness of Al-Pb-1 % Cu alloy containing Pb up to 5 % in which Pb phase particles up to 10 μm disperse are achieved through water cooled metal mold casting. The plates up to 5 mm in thickness containing Pb as much as 8 to 10 % cast in this process have dispersed Pb particles up to 5 μm in diameter in the surface layer. Al-8 % Pb-1 % Cu alloy bars 40 mm in diameter and 180 mm in height in which gravity segregation of Pb is prevented can be cast by movable and water sprayed metal mold casting at casting temperature 920 deg C and mold moving speed 1.0 mm/s. Pb phase particles 10 μm in mean size are dispersed in the bars. (author)

Precision casting of Ti-15V-3Cr-3Al-3Sn alloy setting

OpenAIRE

Nan Hai; Liu Changkui; Huang Dong

2008-01-01

In this research, Ti-15V-3Cr-3Al-3Sn alloy ingots were prepared using ceramic mold and centrifugal casting. The Ti-15V-3Cr-3Al-3Sn setting casting, for aeronautic engine, with 1.5 mm in thickness was manufactured. The alloy melting process, precision casting process, and problems in casting application were discussed. Effects of Hot Isostatic Pressing and heat treatment on the mechanical properties and microstructure of the Ti-15V-3Cr-3Al-3Sn alloy were studied.

Development of amorphous and nanocrystalline Al65Cu35-xZrx alloys by mechanical alloying

International Nuclear Information System (INIS)

Manna, I.; Chattopadhyay, P.P.; Banhart, F.; Fecht, H.J.

2004-01-01

Mechanical alloying of Al 65 Cu 35-x Zr x (x=5, 15 and 25 at.% Zr) elemental powder blends by planetary ball milling up to 50 h yields amorphous and/or nanocrystalline products. Microstructure of the milled product at different stages of milling has been characterized by X-ray diffraction, (XRD) high-resolution transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDS). Among the different alloys synthesized by mechanical alloying, Al 65 Cu 20 Zr 15 yields a predominantly amorphous product, while the other two alloys develop a composite microstructure comprising nanocrystalline and amorphous solid solutions in Al 65 Cu 10 Zr 25 and nano-intermetallic phase/compound in Al 65 Cu 30 Zr 5 , respectively. The genesis of solid-state amorphization in Al 65 Cu 20 Zr 15 and Al 65 Cu 10 Zr 25 is investigated

Effects of Heat Treatment on the Microstructures and High Temperature Mechanical Properties of Hypereutectic Al-14Si-Cu-Mg Alloy Manufactured by Liquid Phase Sintering Process

Science.gov (United States)

Heo, Joon-Young; Gwon, Jin-Han; Park, Jong-Kwan; Lee, Kee-Ahn

2018-05-01

Hypereutectic Al-Si alloy is an aluminum alloy containing at least 12.6 wt.% Si. It is necessary to evenly control the primary Si particle size and distribution in hypereutectic Al-Si alloy. In order to achieve this, there have been attempts to manufacture hypereutectic Al-Si alloy through a liquid phase sintering. This study investigated the microstructures and high temperature mechanical properties of hypereutectic Al-14Si-Cu-Mg alloy manufactured by liquid phase sintering process and changes in them after T6 heat treatment. Microstructural observation identified large amounts of small primary Si particles evenly distributed in the matrix, and small amounts of various precipitation phases were found in grain interiors and grain boundaries. After T6 heat treatment, the primary Si particle size and shape did not change significantly, but the size and distribution of CuAl2 ( θ) and AlCuMgSi ( Q) changed. Hardness tests measured 97.36 HV after sintering and 142.5 HV after heat treatment. Compression tests were performed from room temperature to 300 °C. The results represented that yield strength was greater after heat treatment (RT 300 °C: 351 93 MPa) than after sintering (RT 300 °C: 210 89 MPa). Fracture surface analysis identified cracks developing mostly along the interface between the primary Si particles and the matrix with some differences among temperature conditions. In addition, brittle fracture mode was found after T6 heat treatment.

Effect of microstructure on corrosion behavior of Ag-30Cu-27Sn alloy in vitro media

International Nuclear Information System (INIS)

Salehisaki, Mehdi; Aryana, Maryam

2014-01-01

Highlights: • High cooling rates decrease the number of Ag intermetallic particles in Cu-rich phase. • Increasing cooling rate improves corrosion behavior of Ag-30Cu-27Sn dental alloy. • Cathode/anode ratio in Cu-rich phases determines the corrosion behavior of alloy. - Abstract: In the present work, three simple heat treatment cycles were used to study the effects of microstructure on electrochemical corrosion behavior of Ag-30Cu-27Sn dental alloy. The electrochemical impedance spectroscopy (EIS) measurements and potentiodynamic polarization tests were carried out to investigate the corrosion behavior of as-cast and heat treated samples in synthetic saliva solution. The presence of intermetallic compounds were studied by X-ray diffraction method (XRD) and scanning electron microscopy (SEM) with energy dispersive X-ray detector (EDAX). The microstructural observations and electrochemical corrosion results revealed that, increasing the cooling rate improves the corrosion behavior of under investigation samples. Improvement of the corrosion behavior is attributed to reducing the area of fine distributed Ag 3 Sn islands in the Cu-rich matrix which decrease the cathode/anode ratio of microgalvanic cells

Lattice parameter values and phase transitions for the Cu2Cd1-zMnzSnSe4 and Cu2Cd1-zFezSnSe4 alloys

International Nuclear Information System (INIS)

Moreno, E.; Quintero, M.; Morocoima, M.; Quintero, E.; Grima, P.; Tovar, R.; Bocaranda, P.; Delgado, G.E.; Contreras, J.E.; Mora, A.E.; Briceno, J.M.; Avila Godoy, R.; Fernandez, J.L.; Henao, J.A.; Macias, M.A.

2009-01-01

X-ray powder diffraction measurements and differential thermal analysis (DTA) were made on polycrystalline samples of the Cu 2 Cd 1-z Mn z SnSe 4 and Cu 2 Cd 1-z Fe z SnSe 4 alloy systems. The diffraction patterns were used to show the equilibrium conditions and to derive lattice parameter values. For Cu 2 Cd 0.8 Fe 0.2 SnSe 4 as well as for Cu 2 Cd 0.2 Fe 0.8 SnSe 4 the crystal structures were refined using the Rietveld method. It was found that the internal distortion parameter σ decreases as Cd is replaced by either Mn and/or Fe. For the Cu 2 Cd 1-z Mn z SnSe 4 and Cu 2 Cd 1-z Fe z SnSe 4 alloy systems, only two single solid phase fields, the tetragonal stannite α(I4-bar2m) and the wurtz-stannite δ (Pmn2 1 ) structures were found to occur in the diagram. In addition to the tetragonal stannite α phase extra X-ray diffraction lines due to MnSe and/or FeSe 2 were observed for as grown samples in the range 0.7 < z < 1.0. However, it was found that the amount of the extra phase decreased for the compressed samples.

Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn

Science.gov (United States)

O, M.; Suzuki, T.; Kajihara, M.

2018-01-01

The Cu/Sn system is one of the most fundamental and important metallic systems for solder joints in electric devices. To realize reliable solder joints, information on reactive diffusion at the solder joint is very important. In the present study, we experimentally investigated the kinetics of the reactive diffusion between solid Cu and liquid Sn using semi-infinite Cu/Sn diffusion couples prepared by an isothermal bonding technique. Isothermal annealing of the diffusion couple was conducted in the temperature range of 533-603 K for various times up to 172.8 ks (48 h). Using annealing, an intermetallic layer composed of Cu6Sn5 with scallop morphology and Cu3Sn with rather uniform thickness is formed at the original Cu/Sn interface in the diffusion couple. The growth of the Cu6Sn5 scallop occurs much more quickly than that of the Cu3Sn layer and thus predominates in the overall growth of the intermetallic layer. This tendency becomes more remarkable at lower annealing temperatures. The total thickness of the intermetallic layer is proportional to a power function of the annealing time, and the exponent of the power function is close to unity at all the annealing temperatures. This means that volume diffusion controls the intermetallic growth and the morphology of the Cu6Sn5/Sn interface influences the rate-controlling process. Adopting a mean value of 0.99 for the exponent, we obtain a value of 26 kJ/mol for the activation enthalpy of the intermetallic growth.

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Science.gov (United States)

Zhong, Y.; Zhao, N.; Liu, C. Y.; Dong, W.; Qiao, Y. Y.; Wang, Y. P.; Ma, H. T.

2017-11-01

As the diameter of solder interconnects in three-dimensional integrated circuits (3D ICs) downsizes to several microns, how to achieve a uniform microstructure with thousands of interconnects on stacking chips becomes a critical issue in 3D IC manufacturing. We report a promising way for fabricating fully intermetallic interconnects with a regular grain morphology and a strong texture feature by soldering single crystal (111) Cu/Sn/polycrystalline Cu interconnects under the temperature gradient. Continuous epitaxial growth of η-Cu6Sn5 at cold end liquid-Sn/(111)Cu interfaces has been demonstrated. The resultant η-Cu6Sn5 grains show faceted prism textures with an intersecting angle of 60° and highly preferred orientation with their ⟨ 11 2 ¯ 0 ⟩ directions nearly paralleling to the direction of the temperature gradient. These desirable textures are maintained even after soldering for 120 min. The results pave the way for controlling the morphology and orientation of interfacial intermetallics in 3D packaging technologies.

Stability of Cu-Precipitates in Al-Cu Alloys

Directory of Open Access Journals (Sweden)

Torsten E. M. Staab

2018-06-01

Full Text Available We present first principle calculations on formation and binding energies for Cu and Zn as solute atoms forming small clusters up to nine atoms in Al-Cu and Al-Zn alloys. We employ a density-functional approach implemented using projector-augmented waves and plane wave expansions. We find that some structures, in which Cu atoms are closely packed on {100}-planes, turn out to be extraordinary stable. We compare the results with existing numerical or experimental data when possible. We find that Cu atoms precipitating in the form of two-dimensional platelets on {100}-planes in the fcc aluminum are more stable than three-dimensional structures consisting of the same number of Cu-atoms. The preference turns out to be opposite for Zn in Al. Both observations are in agreement with experimental observations.

Microstructure and properties of an Al-Ti-Cu-Si brazing alloy for SiC-metal joining

Science.gov (United States)

Dai, Chun-duo; Ma, Rui-na; Wang, Wei; Cao, Xiao-ming; Yu, Yan

2017-05-01

An Al-Ti-Cu-Si solid-liquid dual-phase alloy that exhibits good wettability and appropriate interfacial reaction with SiC at 500-600°C was designed for SiC-metal joining. The microstructure, phases, differential thermal curves, and high-temperature wetting behavior of the alloy were analyzed using scanning electron microscopy, X-ray diffraction analysis, differential scanning calorimetry, and the sessile drop method. The experimental results show that the 76.5Al-8.5Ti-5Cu-10Si alloy is mainly composed of Al-Al2Cu and Al-Si hypoeutectic low-melting-point microstructures (493-586°C) and the high-melting-point intermetallic compound AlTiSi (840°C). The contact angle, determined by high-temperature wetting experiments, is approximately 54°. Furthermore, the wetting interface is smooth and contains no obvious defects. Metallurgical bonding at the interface is attributable to the reaction between Al and Si in the alloy and ceramic, respectively. The formation of the brittle Al4C3 phase at the interface is suppressed by the addition of 10wt% Si to the alloy.

The Effect of Increasing Sn Content on High-Temperature Mechanical Deformation of an Mg-3%Cu-1%Ca Alloy

Directory of Open Access Journals (Sweden)

Georgios S.E. Antipas

2013-11-01

Full Text Available Chill casting of magnesium alloy samples with secondary alloying elements of Cu, Ca and Sn at % w.t. concentrations in the range 1–5, 0.1–5 and 0.1–3 respectively, gave rise to appreciably enhanced resistance to high-temperature creep, while maintaining good heat conductivity. The latter was considered to be driven by Cu and Mg-Cu intermetallics while it was clear that Sn mediated the high-temperature performance, mainly via networks of Mg2Sn and MgCaSn precipitates along the Mg matrix grain boundaries. It was postulated that Sn formed intermetallics by preferential substitution of Ca atoms and, thus, did not degrade the heat conductivity by retaining Cu. The % w.t. stoichiometry with the optimum combination of heat conductivity and resistance to high-temperature creep was found to be Mg-3Cu-1Ca-0.1Sn.

Quality analysis of the Al-Si-Cu alloy castings

Directory of Open Access Journals (Sweden)

L.A. Dobrzański

2007-04-01

Full Text Available The developed design methodologies both the material and technological ones will make it possible to improve shortly the quality of materials from the light alloys in the technological process, and the automatic process flow correction will make the production cost reduction possible, and - first of all - to reduce the amount of the waste products. Method was developed for analysis of the casting defects images obtained with the X-ray detector analysis of the elements made from the Al-Si-Cu alloys of the AC-AlSi7Cu3Mg type as well as the method for classification of casting defects using the artificial intelligence tools, including the neural networks; the developed method was implemented as software programs for quality control. Castings were analysed in the paper of car engine blocks and heads from the Al-Si-Cu alloys of the AC-AlSi7Cu3Mg type fabricated with the “Cosworth” technological process. The computer system, in which the artificial neural networks as well as the automatic image analysis methods were used makes automatic classification possible of defects occurring in castings from the Al-Si-Cu alloys, assisting and automating in this way the decisions about rejection of castings which do not meet the defined quality requirements, and therefore ensuring simultaneously the repeatability and objectivity of assessment of the metallurgical quality of these alloys.

Al-Cu-Li and Al-Mg-Li alloys: Phase composition, texture, and anisotropy of mechanical properties (Review)

Science.gov (United States)

Betsofen, S. Ya.; Antipov, V. V.; Knyazev, M. I.

2016-04-01

The results of studying the phase transformations, the texture formation, and the anisotropy of the mechanical properties in Al-Cu-Li and Al-Mg-Li alloys are generalized. A technique and equations are developed to calculate the amounts of the S1 (Al2MgLi), T1 (Al2CuLi), and δ' (Al3Li) phases. The fraction of the δ' phase in Al-Cu-Li alloys is shown to be significantly higher than in Al-Mg-Li alloys. Therefore, the role of the T1 phase in the hardening of Al-Cu-Li alloys is thought to be overestimated, especially in alloys with more than 1.5% Li. A new model is proposed to describe the hardening of Al-Cu-Li alloys upon aging, and the results obtained with this model agree well with the experimental data. A texture, which is analogous to that in aluminum alloys, is shown to form in sheets semiproducts made of Al-Cu-Li and Al-Mg-Li alloys. The more pronounced anisotropy of the properties of lithium-containing aluminum alloys is caused by a significant fraction of the ordered coherent δ' phase, the deformation mechanism in which differs radically from that in the solid solution.

Correlation between the oxide impedance and corrosion behavior of Zr-Nb-Sn-Fe-Cu alloys

Science.gov (United States)

Park, Sang-Yoon; Lee, Myung-Ho; Jeong, Yong-Hwan; Jung, Youn-Ho

2004-12-01

The correlation between the oxide impedance and corrosion behavior of two series of Zr-Nb-Sn-Fe-Cu alloys was evaluated. Corrosion tests were performed in a 70 ppm LiOH aqueous solution at 360°C for 300 days. The results of the corrosion tests revealed that the corrosion behavior of the alloys depended on the Nb and Sn content. The impedance characteristics for the pre- and post-transition oxide layers formed on the surface of the alloys were investigated in sulfuric acid at room temperature. From the results, a pertinent equivalent circuit model was preferably established, explaining the properties of double oxide layers. The impedance of the oxide layers correlated with the corrosion behavior; better corrosion resistance always showed higher electric resistance for the inner layers. It is thus concluded that a pertinent equivalent circuit model would be useful for evaluating the long-term corrosion behavior of Zr-Nb-Sn-Fe-Cu alloys.

Local atomic structure of Zr-Cu and Zr-Cu-Al amorphous alloys investigated by EXAFS method

International Nuclear Information System (INIS)

Antonowicz, J.; Pietnoczka, A.; Zalewski, W.; Bacewicz, R.; Stoica, M.; Georgarakis, K.; Yavari, A.R.

2011-01-01

Research highlights: → Coordination number, interatomic distances and mean square atomic displacement in Zr-Cu and Zr-Cu-Al glasses. → Icosahedral symmetry in local atomic structure. → Deviation from random mixing behavior resulting from Al addition. - Abstract: We report on extended X-ray absorption fine structure (EXAFS) study of rapidly quenched Zr-Cu and Zr-Cu-Al glassy alloys. The local atomic order around Zr and Cu atoms was investigated. From the EXAFS data fitting the values of coordination number, interatomic distances and mean square atomic displacement were obtained for wide range of compositions. It was found that icosahedral symmetry rather than that of corresponding crystalline analogs dominates in the local atomic structure of Zr-Cu and Zr-Cu-Al amorphous alloys. Judging from bonding preferences we conclude that addition of Al as an alloying element results in considerable deviation from random mixing behavior observed in binary Zr-Cu alloys.

Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

Science.gov (United States)

Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

2018-04-01

Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects

DEFF Research Database (Denmark)

Brincker, Mads; Söhl, Stefan; Eisele, Ronald

2017-01-01

As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems...

Formation and structure of nanocrystalline Al-Mn-Ni-Cu alloys

International Nuclear Information System (INIS)

Latuch, J.; Krasnowski, M.; Ciesielska, B.

2002-01-01

This paper reports the results of the short investigation on the effect of Cu additions upon the nanocrystallization behaviour of an Al-Mn-Ni alloy. 2 at.% Cu added to the base alloy of Al 85 Mn 10 Ni 5 alloy by substitution for Mn(mischmetal). The control of cooling rate did not cause the formation of nanocrystals of fcc-Al phase. The nanocrystalline structure fcc-Al + amorphous phase in quarternary alloy was obtained by isothermal annealing and continuous heating method, but the last technique is more effective. The volume fraction, lattice parameter, and size of Al-phase were calculated. (author)

The Influence of Nickel and Tin Additives on the Microstructural and Mechanical Properties of Al-Zn-Mg-Cu Alloys

Directory of Open Access Journals (Sweden)

Haider T. Naeem

2014-01-01

Full Text Available The effects of nickel and nickel combined tin additions on mechanical properties and microstructural evolutions of aluminum-zinc-magnesium-copper alloys were investigated. Aluminum alloys containing Ni and Sn additives were homogenized at different temperatures conditions and then aged at 120°C for 24 h (T6 and retrogressed at 180°C for 30 min and then reaged at 120°C for 24 h (RRA. Comparison of the ultimate tensile strength (UTS of as-quenched Al-Zn-Mg-Cu-Ni and Al-Zn-Mg-Cu-Ni-Sn alloys with that of similar alloys which underwent aging treatment at T6 temper showed that gains in tensile strengths by 385 MPa and 370 MPa were attained, respectively. These improvements are attributed to the precipitation hardening effects of the alloying element within the base alloy and the formation of nickel/tin-rich dispersoid compounds. These intermetallic compounds retard the grain growth, lead to grain refinement, and result in further strengthening effects. The outcomes of the retrogression and reaging processes which were carried on aluminum alloys indicate that the mechanical strength and Vickers hardness have been enhanced much better than under the aging at T6 temper.

Structure and Mechanical Properties of AlSiCuMg Alloy after Thermo Processing

Directory of Open Access Journals (Sweden)

Piątkowski J.

2015-03-01

Full Text Available In the dissertation it has been shown, that so called „time-thermal treatment” (TTT of the alloy in liquid state, as overheating the metal with around 250°C above the Tliq. and detaining it in this temperature for around 30 minutes, improves the mechanical properties (HB, Rm, R0,2. It was ascertained, that overheating the AlSi17Cu5Mg alloy aids the modification, resulting with microcrystalline structure. Uniform arrangement of the Si primeval crystals in the warp, and α(Al solution type, supersaturated with alloying elements present in the base content (Cu, Mg assures not only increased durability in the ambient temperature, but also at elevated temperature (250°C, what is an advantage, especially due to the use in car industry.

The Paramagnetism of Small Amounts of Mn Dissolved in Cu-Al and Cu-Ge Alloys

Energy Technology Data Exchange (ETDEWEB)

Myers, H P; Westin, R

1963-06-15

Previous measurements of the valency of Mn in Cu-Zn alloys have been confirmed by measurements with the isoelectronic Cu-Al and Cu-Ge alloys as matrices for Mn. The valency, having the value i in pure copper, decreases slightly with increasing electron to atom ratio attaining the values 0. 9 and 0. 8 at the limiting composition in the Al and Ge alloys respectively. The apparent size of Mn in these alloys is discussed.

The Paramagnetism of Small Amounts of Mn Dissolved in Cu-Al and Cu-Ge Alloys

International Nuclear Information System (INIS)

Myers, H.P.; Westin, R.

1963-06-01

Previous measurements of the valency of Mn in Cu-Zn alloys have been confirmed by measurements with the isoelectronic Cu-Al and Cu-Ge alloys as matrices for Mn. The valency, having the value i in pure copper, decreases slightly with increasing electron to atom ratio attaining the values 0. 9 and 0. 8 at the limiting composition in the Al and Ge alloys respectively. The apparent size of Mn in these alloys is discussed

Phase diagrams of aluminium alloys of Al-Cu-Mg, Al-Mg-Si-Cu, and Al-Mg-Li system

International Nuclear Information System (INIS)

Ber, L.B.; Kaputkin, E.Ya.

2001-01-01

Isothermal diagrams of phase transformations (DPT) and temperature-time charts (TTC) of variation of electric conductivity and of mechanical features at tension were plotted following thermal treatment according to the pattern of direct hardening and ageing and according to the pattern of normal aging for D16 commercial alloy, Al-Cu-Mg model alloy of the same system, AD37 commercial alloys of Al-Mg-Si-Cu and 1424 one of Al-Li-Mg system. Phase transformations were studied by means of fluorescence electron microscopy, micro-X-ray spectral analysis, X-ray phase analysis of single crystals and polycrystals and differential scanning calorimetry. For every alloy comparison of TTC and DPT enables to clarity the mechanism of phase composition effect on features and to optimize conditions of hardening cooling and ageing [ru

Ductile shape memory alloys of the Cu-Al-Mn system

International Nuclear Information System (INIS)

Kainuma, R.; Takahashi, S.; Ishida, K.

1995-01-01

Cu-Al-Mn shape memory alloys with enhanced ductility have been developed by decreasing the degree of order in the β parent phase. Cu-Al-Mn alloys with Al contents lower than 18% exhibit good ductility with elongations of about 15% and excellent cold-workability arising from a lower degree of order in the Heusler (L21) β 1 parent phase, without any loss in their shape memory behavior. In this paper the mechanical and shape memory characteristics, such as the cold-workability, the Ms temperatures, the shape memory effect and the pseudo-elasticity of such ductile Cu-Al-Mn alloys are presented. (orig.)

Corrosion Behavior and Oxide Properties of Zr-Nb-Cu and Zr-Nb-Sn Alloy in High Dissolved Hydrogen Primary Water Chemistry

Energy Technology Data Exchange (ETDEWEB)

Lee, Yun Ju; Kim, Tae Ho; Kim, Ji Hyun [UNIST, Ulsan (Korea, Republic of)

2016-05-15

The water-metal interface is regarded as rate-controlling site governing the rapid oxidation transition in high burn-up fuel. And the zirconium oxide is made in water-metal interface and its structure and phase do an important role in terms of oxide properties. During oxidation process, the protective tetragonal oxide layer develops at the interface due to accumulated high stress during oxide growth, and it turns into non-protective monoclinic oxide with increasing oxide thickness, thus decreasing the stress. It has been reported that Nb addition was proven to be very beneficial for increasing the corrosion resistance of the zirconium alloys. From a more recent study, Cu addition in Nb containing Zirconium alloy was reported to be effective for increasing corrosion resistance in water containing B and Li. According to the previous research conducted, Zr-Nb-Cu shows better corrosion resistance than Zircaloy-4. The dissolved hydrogen (DH) concentration is the key issue of primary water chemistry, and the effect of DH concentration on the corrosion rate of nickel based alloy has been researched. However, the effect of DH on the zirconium alloy corrosion mechanism was not fully investigated. In this study, the weight gain measurement, FIB-SEM analysis, and Raman spectroscopic measurement were conducted to investigate the effects of dissolved hydrogen concentration and the chemical composition on the corrosion resistance and oxide phase of Zr-Nb-Cu alloy and Zr-Nb-Sn alloy after oxidizing in a primary water environment for 20 d. The corrosion rate of Zr-Nb-Cu alloy is slow, when it is compared to Zr-Nb-Sn alloy. In SEM images, the oxide thickness of Zr-Nb-Cu alloy is measured to be around 1.06 μm it of Zr-Nb-Sn alloy is measured to be 1.15 μm. It is because of the Segregation made by Sn solute element when Sn solute element oxidized. And according to ex situ Raman spectra, Zr-Nb-Cu alloy oxide has more tetragonal zirconium oxide fraction than Zr-Nb-Sn alloy oxide.

Diffusivities and atomic mobilities in Cu-rich fcc Al-Cu-Mn alloys

Energy Technology Data Exchange (ETDEWEB)

Yin, Ming; Du, Yong; Cui, Senlin; Xu, Honghui; Liu, Shuhong [Central South Univ., Changsha (China). State Key Laboratory of Powder Metallurgy; Zhang, Lijun [Bochum Univ. (DE). Interdisciplinary Centre for Advanced Materials Simulation (ICAMS)

2012-07-15

Via solid-solid diffusion couples, electron probe microanalysis and the Whittle and Green method, interdiffusivities in fcc Al-Cu-Mn alloys at 1 123 K were measured. The reliability of the obtained diffusivities is validated by comparing the computed diffusivities with literature data plus constraints among the diffusivities. Through assessments of experimentally determined diffusion coefficients by means of a diffusion-controlled transformations simulation package, the atomic mobilities of Al, Cu, and Mn in fcc Al-Cu-Mn alloys are obtained. Comprehensive comparisons between the model-predicted and the experimental data indicate that the presently obtained atomic mobilities can reproduce most of the diffusivities, concentration profiles, and diffusion paths reasonably. (orig.)

Multifilamentar superconductor wires of Cu-Nb-Al and Cu-Nb3Sn obtained by a new method

International Nuclear Information System (INIS)

Lima, O.F. de

1985-01-01

A new method to prepare multifilamentar wires of Cu-Nb 3 Sn which is based on power metallurgy is developed. Wires of Cu+xw%Nb++2wt%Al (x =10,30) were tinned and heat treated for Sn diffusion and reaction (T = 700 0 C), leading to the Nb 3 Sn A 15 phase. Final wires showed microfilament density around 8 x 10 4 mm -2 . The superconducting properties (T sup(c), J sup(c) x H), mechanical properties (tau x epsilon) and eletrical resistivity for Cu-Nb-Al wires were as normally expected. The Cu-Nb 3 Sn wires showed high T sub(c) approx. 17.9 K, very near that for the pure A 15 phase. J sub(c) x H curves were approx. 4 times lower than typical published results for wires prepared by other methods. The experimental evidence shows that J sub(c) increases when decreases the initial Nb particle size. (Author) [pt

Diffusion slowdown in the nanostructured liquid Ga-Sn alloy

International Nuclear Information System (INIS)

Podorozhkin, Dmitri Y.; Charnaya, Elena V.; Lee, Min Kai; Chang, Lieh-Jeng; Haase, Juergen; Michel, Dieter; Kumzerov, Yurii A.; Fokin, Alexsandr V.

2015-01-01

The diffusion of gallium in liquid Ga-Sn alloy embedded into different porous silica matrices was studied by NMR. Spin relaxation was measured for two gallium isotopes, 71 Ga and 69 Ga, at two magnetic fields. Pronounced rise of quadrupole contribution to relaxation was observed for the nanostructured alloy which increased with decreasing the pore size. The correlation time of atomic mobility was evaluated and found to be much larger than in the relevant bulk melt which evidenced a pronounced diffusion slowdown in the Ga-Sn alloy under nanoconfinement. It is shown that the diffusion was slower by a factor of 30 for the alloy within 7 nm pores. The spectral densities of electric field gradients at zero frequency were found to double for the finest pores. The Knight shift was found to decrease but slightly for the nanostructured alloy. (copyright 2015 by WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

The quasicrystalline phase formation in Al-Cu-Cr alloys produced by mechanical alloying

Energy Technology Data Exchange (ETDEWEB)

Sviridova, T.A.; Shevchukov, A.P.; Shelekhov, E.V. [National University of Science and Technology ' MISIS' , Moscow 119049 (Russian Federation); Diakonov, D.L. [Bardin Central Research Institute for the Iron and Steel Industry, Moscow 105005 (Russian Federation); Tcherdyntsev, V.V.; Kaloshkin, S.D. [National University of Science and Technology ' MISIS' , Moscow 119049 (Russian Federation)

2011-06-15

Research highlights: > Formation of decagonal quasicrystalline phase in Al-Cu-Cr alloys. > Obtained decagonal phase belongs to D{sub 3} family of decagonal quasicrystals. > Decagonal phase has 1.26 nm periodicity along 10-fold axis. > Alloys were produced by combination of mechanical alloying and subsequent annealing. > Phase composition of as-milled powders depending on annealing temperature. - Abstract: Almost single-phase decagonal quasicrystal with periodicity of 1.26 nm along 10-fold axis was produced in Al{sub 69}Cu{sub 21}Cr{sub 10} and Al{sub 72.5}Cu{sub 16.5}Cr{sub 11} alloys using combination of mechanical alloying (MA) and subsequent annealing. Phase transformations of as-milled powders depending on annealing temperature in the range of 200-800 deg. C are examined. Since the transformations can be explained based on kinetic and thermodynamic reasons it seems that applied technique (short preliminary MA followed by the annealing) permits to produce the equilibrium phases rather than metastable ones.

Study of Cu-Al-Ni-Ga as high-temperature shape memory alloys

Science.gov (United States)

Zhang, Xin; Wang, Qian; Zhao, Xu; Wang, Fang; Liu, Qingsuo

2018-03-01

The effect of Ga element on the microstructure, mechanical properties and shape memory effect of Cu-13.0Al-4.0Ni- xGa (wt%) high-temperature shape memory alloy was investigated by optical microscopy, SEM, XRD and compression test. The microstructure observation results showed that the Cu-13.0Al-4.0Ni- xGa ( x = 0.5 and 1.0) alloys displayed dual-phase morphology which consisted of 18R martensite and (Al, Ga)Cu phase, and their grain size was about several hundred microns, smaller than that of Cu-13.0Al-4.0Ni alloy. The compression test results proved that the mechanical properties of Cu-13.0Al-4.0Ni- xGa alloys were improved by addition of Ga element owing to the grain refinement and solid solution strengthening, and the compressive fracture strains were 11.5% for x = 0.5 and 14.9% for x = 1.0, respectively. When the pre-strain was 8%, the shape memory effect of 4.2 and 4.6% were obtained for Cu-13.0Al-4.0Ni-0.5 Ga and Cu-13.0Al-4.0Ni-1.0 Ga alloys after being heated to 400 °C for 1 min.

Correlation between zirconium oxide impedance and corrosion behavior of Zr-Nb-Sn-Fe-Cu alloys

International Nuclear Information System (INIS)

Park, Sang Yoon; Lee, Myung Ho; Choi, Byoung Kwon; Jeong, Yong Hwan; Jung, Youn Ho

2001-01-01

To evaluate the correlation of Zr oxide impedance and corrosion behavior of Zr-Nb-Sn-Fe-Cu alloys, the corrosion behavior of the alloys was tested in the autoclave containing 70 ppm LiOH solution at 360 .deg. C. The characteristics of the oxide on the alloys were investigated by using the electrochemical impedance spectrosocpy (EIS) method. The corrosion resistance of the alloys was evaluated from the corrosion rate determined as a function of the concentration of Nb. The equivalent circuit of the oxide was composed on the base of the spectrum from EIS measurements on the oxide layers that had formed at pre-and post-transition regions on the curve of corrosion rate. By using the capacitance characteristics of the equivalent circuit, the thickness of impervious layer, it's electrical resistance and characteristics of space charge layer were evaluated. The corrosion characteristics of the Zr-Nb-Sn-Fe-Cu alloys were successfully explained by applying the EIS test results

Elemental separation in nanocrystalline Cu-Al alloys

Science.gov (United States)

Wang, Y. B.; Liao, X. Z.; Zhao, Y. H.; Cooley, J. C.; Horita, Z.; Zhu, Y. T.

2013-06-01

Nanocrystallization by high-energy severe plastic deformation has been reported to increase the solubility of alloy systems and even to mix immiscible elements to form non-equilibrium solid solutions. In this letter, we report an opposite phenomenon—nanocrystallization of a Cu-Al single-phase solid solution by high-pressure torsion separated Al from the Cu matrix when the grain sizes are refined to tens of nanometers. The Al phase was found to form at the grain boundaries of nanocrystalline Cu. The level of the separation increases with decreasing grain size, which suggests that the elemental separation was caused by the grain size effect.

Characteristics and heat treatment of cold-sprayed Al-Sn binary alloy coatings

International Nuclear Information System (INIS)

Ning, Xian-Jin; Kim, Jin-Hong; Kim, Hyung-Jun; Lee, Changhee

2009-01-01

In this study, Al-Sn binary alloy coatings were prepared with Al-5 wt.% Sn (Al-5Sn) and Al-10 wt.% Sn (Al-10Sn) gas atomized powders by low pressure and high pressure cold spray process. The microstructure and microhardness of the coatings were characterized. To understand the coarsening of tin in the coating, the as-sprayed coatings were annealed at 150, 200, 250 and 300 o C for 1 h, respectively. The effect of annealing on microstructure and the bond strength of the coatings were investigated. The results show that Al-5Sn coating can be deposited by high pressure cold spray with nitrogen while Al-10Sn can only be deposited by low pressure cold spray with helium gas. Both Al-5Sn and Al-10Sn coatings present dense structures. The fraction of Sn in as-sprayed coatings is consistent with that in feed stock powders. The coarsening and/or migration of Sn phase in the coatings were observed when the annealing temperature exceeds 200 deg. C. Furthermore, the microhardness of the coatings decreased significantly at the annealing temperature of 250 deg. C. EDXA analysis shows that the heat treatment has no significant effect on fraction of Sn phase in Al-5Sn coatings. Bonding strength of as-sprayed Al-10Sn coating is slightly higher than that of Al-5Sn coating. Annealing at 200 o C can increase the bonding strength of Al-5Sn coatings.

The crystallisation of Cu2ZnSnS4 thin film solar cell absorbers from co-electroplated Cu-Zn-Sn precursors

International Nuclear Information System (INIS)

Schurr, R.; Hoelzing, A.; Jost, S.; Hock, R.; Voss, T.; Schulze, J.; Kirbs, A.; Ennaoui, A.; Lux-Steiner, M.; Weber, A.; Koetschau, I.; Schock, H.-W.

2009-01-01

The best CZTS solar cell so far was produced by co-sputtering continued with vapour phase sulfurization method. Efficiencies of up to 5.74% were reached by Katagiri et al. The one step electrochemical deposition of copper, zinc, tin and subsequent sulfurization is an alternative fabrication technique for the production of Cu 2 ZnSnS 4 based thin film solar cells. A kesterite based solar cell (size 0.5 cm 2 ) with a conversion efficiency of 3.4% (AM1.5) was produced by vapour phase sulfurization of co-electroplated Cu-Zn-Sn films. We report on results of in-situ X-ray diffraction (XRD) experiments during crystallisation of kesterite thin films from electrochemically co-deposited metal films. The kesterite crystallisation is completed by the solid state reaction of Cu 2 SnS 3 and ZnS. The measurements show two different reaction paths depending on the metal ratios in the as deposited films. In copper-rich metal films Cu 3 Sn and CuZn were found after electrodeposition. In copper-poor or near stoichiometric precursors additional Cu 6 Sn 5 and Sn phases were detected. The formation mechanism of Cu 2 SnS 3 involves the binary sulphides Cu 2-x S and SnS 2 in the absence of the binary precursor phase Cu 6 Sn 5 . The presence of Cu 6 Sn 5 leads to a preferred formation of Cu 2 SnS 3 via the reaction educts Cu 2-x S and SnS 2 in the presence of a SnS 2 (Cu 4 SnS 6 ) melt. The melt phase may be advantageous in crystallising the kesterite, leading to enhanced grain growth in the presence of a liquid phase

Wetting phenomena of Al-Cu alloys on sapphire below 800 deg. C

International Nuclear Information System (INIS)

Klinter, Andreas J.; Leon-Patino, Carlos A.; Drew, Robin A.L.

2010-01-01

Using a modified dispensed drop method, a decrease in contact angle on sapphire from pure aluminum to low-copper-containing Al alloys (7-12 wt.%) was found; with higher copper additions θ transitions to the non-wetting regime. Atomic force microscopy on long-term samples showed a significantly increased surface roughness beneath the drop. Using high-resolution transmission electron microscopy, the reaction product at the interface was identified as CuAl 2 O 4 for Al-7Cu and Al 2 O 3 for an Al-99.99 drop. X-ray photoelectron spectroscopy further confirmed the formation of CuAl 2 O 4 under CuAl 2 drops. Spinel formation is caused by reaction of the alloy with residual oxygen in the furnace that is transported along the interface as modeled by thermodynamic simulations. The formation of CuAl 2 O 4 causes the reduced σ sl and hence the improved wettability of sapphire by low-copper-containing alloys compared to pure aluminum. The main reason for the increase in θ with higher copper contents is the increasing σ lv of the alloy.

Calorimetric measurements of the Ca-Li liquid alloys

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Dębski A.

2017-01-01

Full Text Available The ternary Cu-Al-Sn phase diagram is the base for several important types of alloys, with relevant industrial interest and applications. The knowledge of the melting/solidification alloys characteristics are determinant for their preparation and properties control. However, there is a lack of experimental information on the ternary phase diagram, at high temperature. In this work, several alloys, with high copper content and additions of Al, up to 10%, and Sn, up to 14% (in wt%, were studied by thermal analysis and by isothermal phase equilibria determination. The alloys liquidus and solidus lines and the binary α + β phase field, at 800 °C, are presented for the studied range of compositions.

Mechanism of abnormally slow crystal growth of CuZr alloy

International Nuclear Information System (INIS)

Yan, X. Q.; Lü, Y. J.

2015-01-01

Crystal growth of the glass-forming CuZr alloy is shown to be abnormally slow, which suggests a new method to identify the good glass-forming alloys. The crystal growth of elemental Cu, Pd and binary NiAl, CuZr alloys is systematically studied with the aid of molecular dynamics simulations. The temperature dependence of the growth velocity indicates the different growth mechanisms between the elemental and the alloy systems. The high-speed growth featuring the elemental metals is dominated by the non-activated collision between liquid-like atoms and interface, and the low-speed growth for NiAl and CuZr is determined by the diffusion across the interface. We find that, in contrast to Cu, Pd, and NiAl, a strong stress layering arisen from the density and the local order layering forms in front of the liquid-crystal interface of CuZr alloy, which causes a slow diffusion zone. The formation of the slow diffusion zone suppresses the interface moving, resulting in much small growth velocity of CuZr alloy. We provide a direct evidence of this explanation by applying the compressive stress normal to the interface. The compression is shown to boost the stress layering in CuZr significantly, correspondingly enhancing the slow diffusion zone, and eventually slowing down the crystal growth of CuZr alloy immediately. In contrast, the growth of Cu, Pd, and NiAl is increased by the compression because the low diffusion zones in them are never well developed

27Al, 63Cu NMR spectroscopy and electrical transport in Heusler Cu-Mn-Al alloy powders

Science.gov (United States)

Nadutov, V. M.; Perekos, A. O.; Kokorin, V. V.; Trachevskii, V. V.; Konoplyuk, S. M.; Vashchuk, D. L.

2018-02-01

The ultrafine powder of the Heusler Cu-13,1Mn-12,6Al (wt.%) alloy produced by electrical spark dispersion (ESD) in ethanol and the pellets prepared by pressing of the powders and aged in various gas environment (air, Ar, vacuum) were studied by XRD, nuclear magnetic resonance, magnetic and electric transport methods. The constituent phases were identified as b.c.c. α-Cu-Mn-Al, f.c.c. γ-Cu-Mn-Al, Cu2MnAl, and oxides. The sizes of the coherently scattering domains (CSD) and the saturation magnetizations were in the range of 4-90 nm and 0-1.5 Am2/kg, respectively. 27Al and 63Cu NMR spectra of the powders and pellets have shown hyperfine structure caused by contributions from atomic nuclei of the constituent phases. The aging of pellets in different gas environments had effect on their phase composition but no effect on dispersion of the phases. In contrast to the as-cast alloy, electrical resistance of the pellets evidenced semiconducting behavior at elevated temperatures due to the presence of metal oxides formed on the surfaces of nanoparticles.

Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits

International Nuclear Information System (INIS)

Boettinger, W.J.; Johnson, C.E.; Bendersky, L.A.; Moon, K.-W.; Williams, M.E.; Stafford, G.R.

2005-01-01

High purity bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 μm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min of plating proved that all electrodeposits had in-plane compressive stress. In several days, the surfaces of the Sn-Cu deposits, which have the highest compressive stress, develop 50 μm contorted hillocks and 200 μm whiskers, pure Sn deposits develop 20 μm compact conical hillocks, and Sn-Pb deposits, which have the lowest compressive stress, remain unchanged. The differences between the initial compressive stresses for each alloy and pure Sn is due to the rapid precipitation of Cu 6 Sn 5 or Pb particles, respectively, within supersaturated Sn grains produced by electrodeposition. Over longer time, analysis of beam deflection measurements indicates that the compressive stress is augmented by the formation of Cu 6 Sn 5 on the bronze/Sn interface, while creep of the electrodeposit tends to decrease the compressive stress. Uniform creep occurs for Sn-Pb because it has an equi-axed grain structure. Localized creep in the form of hillocks and whiskers occurs for Sn and Sn-Cu because both have columnar structures. Compact hillocks form for the Sn deposits because the columnar grain boundaries are mobile. Contorted hillocks and whiskers form for the Sn-Cu deposits because the columnar grain boundary motion is impeded

Effects of Al-Mn-Ti-P-Cu master alloy on microstructure and properties of Al-25Si alloy

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Xu Chunxiang

2013-09-01

Full Text Available To obtain a higher microstructural refining efficiency, and improve the properties and processing ability of hypereutectic Al-25Si alloy, a new environmentally friendly Al-20.6Mn-12Ti-0.9P-6.1Cu (by wt.% master alloy was fabricated; and its modification and strengthening mechanisms on the Al-25Si alloy were studied. The mechanical properties of the unmodified, modified and heat treated alloys were investigated. Results show that the optimal addition amount of the Al-20.6Mn-12Ti-0.9P-6.1Cu master alloy is 4wt.%. In this case, primary Si and eutectic Si as well as メ-Al phase were clearly refined, and this refining effect shows an excellent long residual action as it can be heat-retained for at least 5 h. After being T6 heat treated, the morphology of primary and eutectic Si in the Al-25Si alloys with the addition of 4wt.% Al-20.6Mn-12Ti-0.9P-6.1Cu alloy changes into particles and short rods. The average grain size of the primary and eutectic Si decreases from 250 レm (unmodified to 13.83 レm and 35 レm (unmodified to 7 レm; the メ-Al becomes obviously finer and the distribution of Si phases tends to be uniform and dispersed. Meanwhile, the tensile properties are improved obviously; the tensile strengths at room temperature and 300 ìC reach 241 MPa and 127 MPa, increased by 153.7% and 67.1%, respectively. In addition, the tensile fracture mechanism changes from brittle fracture for the alloy without modification to ductile fracture after modification. Modifying the morphology of Si phase and strengthening the matrix can effectively block the initiation and propagation of cracks, thus improving the strength of the hypereutectic Al-25Si alloy.

Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure

Science.gov (United States)

Siahaan, Erwin

2017-09-01

The issues to substitute Tin-Lead Solders is concerning the health and environmental hazards that is caused by lead, and also legislative actions around the world regarding lead toxicity, which has prompted the research community to attempt to replace solder alloys for the traditional Sn-Pb alloys lead which has been used by industrial worker throughout history because it is easily extracted and refined at a relatively low energy cost and also has a range of useful properties. Traditional industry lead has been used in soldering materials for electronic applications because it has low melting point and a soft, malleable nature, when combined with tin at the eutectic composition which causes the alloy to flow easily in the liquid state and solidifies over a very small range of temperature. One of the potential candidate to replace tin-lead solder is Sn-Cu-Zn eutectic alloy as it has a lower melting temperature. Consequently, it is of interest to determine what reactions can occur in ternary systems derived from the Sn-Cu-Zn eutectic. One such system is Sn-0.7Cu-xZn. The specimen was elaborated on physical properties. The chemical content was analyzed by using Shimadzu XRD and melting point was analyzed by using Differential Scanning Calorimeter ( DSC ). The results has shown that the highest addition of Zinc content (15%Zn) will decrease the melting temperatur to 189°C compared to Sn-Pb at 183°C Increasing the amount of Zn on Sn0.7Cu-xZn alloys will decrease Cu3Sn intermetallic coumpound.

Formation of Al70Cu20Fe10 icosahedral quasicrystal by mechanically alloyed method

International Nuclear Information System (INIS)

Yin Shilong; Bian Qing; Qian Liying; Zhang Aimei

2007-01-01

The structural evolutions of the mechanically alloyed ternary Al 70 Cu 20 Fe 10 powders with the milling time and the annealing treatment have been studied by X-ray diffraction (XRD), transmission electronic microscopy (TEM) and X-ray absorption fine-structure spectroscopy (XAFS) techniques. Results show that an Al 2 Cu compound forms with short-time milling, while a Cu 9 Al 4 compound forms with long-time milling. Fe can react with Al-Cu alloy by annealing treatment. Al 7 Cu 2 Fe compound with tetragonal structure or Al (Cu, Fe) solid solution with cubic structure may form at lower temperature, while a quasicrystal phase of Al 65 Cu 20 Fe 15 alloy may form at higher temperature

On the mechanical behavior of a cryomilled Al-Ti-Cu alloy

International Nuclear Information System (INIS)

Han, Bing Q.; Lavernia, Enrique J.; Mohamed, Farghalli A.

2003-01-01

The mechanical behavior of a cryomilled Al10Ti2Cu that was later extruded was investigated in compression. The data obtained show that the strength of the extruded alloy parallel to the extrusion axis is higher than that normal to the axis. Also, a comparison between the compression behavior of the alloy and its tensile behavior reveals that there is a small asymmetry of yield strength with respect to deformation mode. Examination of the microstructure of the cryomilled alloy by means of transmission electron microscopy (TEM) indicates the presence of two phases: approximately 90% nanostructured Al(Cu) phase containing a dispersion of Al 3 Ti and 10% coarse-grained Al(Cu) phase. TEM observations indicate that as a result of the extrusion process, the larger (softer) grains of the Al(Cu) phase experience severe deformation, resulting in the development of mechanical fibering. It is suggested that the presence of coarse-grained Al(Cu) 'islands' in the matrix of the nanostructured phase and their change during extrusion into elongated bands may be responsible for the anisotropy of the mechanical properties of the extruded cryomilled Al10Ti2Cu

Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

Science.gov (United States)

Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

2004-10-01

It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

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Yee Mei Leong

2016-06-01

Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Science.gov (United States)

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

Effect of triethanolamine and heliotropin on cathodic polarization of weakly acidic baths and properties of Sn-Ag-Cu alloy electrodeposits

International Nuclear Information System (INIS)

Zhang Jinqiu; An Maozhong; Chang Limin; Liu Guiyuan

2008-01-01

The effect of triethanolamine (TEA) and heliotropin (HT) on the cathodic polarization of weakly acidic baths and the properties of Sn-Ag-Cu alloy electrodeposits were investigated. Lead-free Sn-Ag-Cu solder alloy were electrodeposited in weakly acidic baths (pH 5.5) containing Sn(CH 3 SO 3 ) 2 , AgI, Cu(CH 3 SO 3 ) 2 , K 4 P 2 O 7 , KI, hydroquinone, TEA, HT and methylsulfonic acid (MSA). The cathodic polarization of baths and the properties of electrodeposits were evaluated by Liner sweep voltammetry (LSV), scanning electron microscopy (SEM), X-ray fluorescence (XRF), X-ray diffraction (XRD), Fourier transform infrared spectrometer (FT-IR) and X-ray photoelectron spectroscopy (XPS). The results indicate that HT is a main brightening agent that increases the cathodic polarization of baths and refines the grains of electrodeposits; TEA is a complexing agent for copper ions and a brightening promoter that decreases the cathodic polarization of baths and densifies the electrodeposits. The bright, compact, and smooth Sn-Ag-Cu alloy electrodeposits contain 88-95 wt% tin, 5-10 wt% silver and 0.5-2 wt% copper. Organic compounds used in the baths neither adsorb on the electrodeposits surfaces nor are included in the electrodeposits. It can be therefore concluded that the use of both TEA and HT is better than that of them either in the process of electroplating bright Sn-Ag-Cu alloy

Wetting phenomena of Al-Cu alloys on sapphire below 800 deg. C

Energy Technology Data Exchange (ETDEWEB)

Klinter, Andreas J., E-mail: andreas.klinter@mail.mcgill.ca [Mining and Materials Engineering, McGill University, M.H. Wong Building, 3610 University Street, Montreal, QC, H3A 2B2 (Canada); Leon-Patino, Carlos A. [Instituto de Investigaciones Metalurgicas, Universidad Michoacana de San Nicolas de Hidalgo, Apdo. Postal 888, CP 58000 Morelia, Michoacan (Mexico); Drew, Robin A.L. [Faculty of Engineering and Computer Science, Concordia University, 1455 Maisonneuve Blvd, EV 2.169, Montreal, QC, H3G 1M8 (Canada)

2010-02-15

Using a modified dispensed drop method, a decrease in contact angle on sapphire from pure aluminum to low-copper-containing Al alloys (7-12 wt.%) was found; with higher copper additions {theta} transitions to the non-wetting regime. Atomic force microscopy on long-term samples showed a significantly increased surface roughness beneath the drop. Using high-resolution transmission electron microscopy, the reaction product at the interface was identified as CuAl{sub 2}O{sub 4} for Al-7Cu and Al{sub 2}O{sub 3} for an Al-99.99 drop. X-ray photoelectron spectroscopy further confirmed the formation of CuAl{sub 2}O{sub 4} under CuAl{sub 2} drops. Spinel formation is caused by reaction of the alloy with residual oxygen in the furnace that is transported along the interface as modeled by thermodynamic simulations. The formation of CuAl{sub 2}O{sub 4} causes the reduced {sigma}{sub sl} and hence the improved wettability of sapphire by low-copper-containing alloys compared to pure aluminum. The main reason for the increase in {theta} with higher copper contents is the increasing {sigma}{sub lv} of the alloy.

First-principle Calculations of Mechanical Properties of Al2Cu, Al2CuMg and MgZn2 Intermetallics in High Strength Aluminum Alloys

Directory of Open Access Journals (Sweden)

LIAO Fei

2016-12-01

Full Text Available Structural stabilities, mechanical properties and electronic structures of Al2Cu, Al2CuMg and MgZn2 intermetallics in Al-Zn-Mg-Cu aluminum alloys were determined from the first-principle calculations by VASP based on the density functional theory. The results show that the cohesive energy (Ecoh decreases in the order MgZn2 > Al2CuMg > Al2Cu, whereas the formation enthalpy (ΔH decreases in the order MgZn2 > Al2Cu > Al2CuMg. Al2Cu can act as a strengthening phase for its ductile and high Young's modulus. The Al2CuMg phase exhibits elastic anisotropy and may act as a crack initiation point. MgZn2 has good plasticity and low melting point, which is the main strengthening phase in the Al-Zn-Mg-Cu aluminum alloys. Metallic bonding mode coexists with a fractional ionic interaction in Al2Cu, Al2CuMg and MgZn2, and that improves the structural stability. In order to improve the alloys' performance further, the generation of MgZn2 phase should be promoted by increasing Zn content while Mg and Cu contents are decreased properly.

Role of aluminium concentration on the structure behaviour of Cu-Al alloys

International Nuclear Information System (INIS)

Nassar, A.M.; Taha, A.S.; Ragab, K.A.; El-Mossalamy, S.

1988-06-01

Effect of Al(5, 10, 15 and 20)% on the structure behaviour of Cu-Al alloys was investigated by both microhardness measurements and optical microscopic investigations. Pure Cu was used for comparison. The analysis of the hardness-temperature curve shows a type of dependence which obeys an empirical exponential law, but consists of several distinguishable regions. For Cu 20% Al, one region is observed, and two regions for pure Cu, while for alloys of 5 and 10% Al concentration three regions were observed. The activation energy varies between 0.03 and 0.9 ev. for these regions, depending on the Al-concentration as well as the annealing temperature. The recrystallization temperature was found to increase with increasing Al-concentration. It was also observed that Cu-20% Al alloy is very hard and brittle owing to the formation of γ2 phase, and also to phase separation as being detected from optical microscopic investigations. (author). 22 refs, 3 figs

Development of an atomic mobility database for liquid phase in multicomponent Al alloys. Focusing on binary systems

Energy Technology Data Exchange (ETDEWEB)

Wang, Shaoqing; Du, Yong; Zhang, Lijun [Central South Univ., Changsha, Hunan (China). State Key Laboratory of Powder Metallurgy; Liu, Dandan [Central South Univ., Changsha, Hunan (China). State Key Laboratory of Powder Metallurgy; Central South Univ., Changsha, Hunan (China). School of Materials Science and Engineering; Chen, Qing; Engstroem, Anders [Thermo-Calc Software AB, Stockholm (Sweden)

2013-08-15

An atomic mobility database for binary liquid phase in multicomponent Al-Cu-Fe-Mg-Mn-Ni-Si-Zn alloys was established based on critically reviewed experimental and theoretical diffusion data by using DICTRA (Diffusion Controlled TRAnsformation) software. The impurity diffusivities of the elements with limited experimental data are obtained by means of the least-squares method and semi-empirical correlations. Comprehensive comparisons between the calculated and measured diffusivities indicate that most of the reported diffusivities can be well reproduced by the currently obtained atomic mobilities. The reliability of this diffusivity database is further validated by comparing the simulated concentration profiles with the measured ones, as well as the measured main inter-diffusion coefficients of liquid Al-Cu-Zn alloys with the extrapolated ones from the present binary atomic mobility database. The approach is of general validity and applicable to establish mobility databases of other liquid alloys. (orig.)

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Energy Technology Data Exchange (ETDEWEB)

Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

2015-03-15

Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

Influence of the Si content on the microstructure and mechanical properties of Ti-Ni-Cu-Si-Sn nanocomposite alloys

Energy Technology Data Exchange (ETDEWEB)

Fornell, J., E-mail: Jordinafornell@gmail.com [Departament de Fisica, Universitat Autonoma de Barcelona, 08193 Bellaterra (Spain); Van Steenberge, N. [OCAS N.V., Pres. J.F. Kennedylaan 3, BE-9060 Zelzate (Belgium); Surinach, S.; Baro, M.D. [Departament de Fisica, Universitat Autonoma de Barcelona, 08193 Bellaterra (Spain); Sort, J. [Departament de Fisica, Universitat Autonoma de Barcelona, 08193 Bellaterra (Spain); Institucio Catalana de Recerca i Estudis Avancats (Spain)

2012-09-25

Highlights: Black-Right-Pointing-Pointer We study the effects of Si addition of Ti-Ni-Cu-Si-Sn alloy. Black-Right-Pointing-Pointer The microstructure evolution is correlated with the obtained mechanical and elastic properties. Black-Right-Pointing-Pointer Higher Young's modulus and larger hardness values are obtained in samples with higher Si contents. - Abstract: (Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4}){sub 100-x}Si{sub x} (x = 0, 2, 4 and 6) alloys were prepared by levitation melting mixtures of the high purity elements in an Ar atmosphere. Rods of 3 mm in diameter were obtained from the melt by copper mould casting. The effects of Si addition on the microstructure, elastic and mechanical properties of the Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4} alloy were investigated by scanning electron microscopy, X-ray diffraction, acoustic measurements and nanoindentation. The main phases composing the Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4} alloy are B2 NiTi, B19 Prime NiTi and tetragonal Ti{sub 2}Ni. Additional phases, like Ti{sub 5}Si{sub 3} or Ni{sub 2}Ti{sub 2}Si, become clearly visible in samples with higher Si contents. The microstructure evolution is correlated with the obtained mechanical and elastic properties. These alloys exhibit very high hardness values, which increase with the Si content, from 9 GPa (for x = 0) to around 10.5 GPa (for x = 6). The Young's modulus of Ti{sub 48}Ni{sub 32}Cu{sub 8}Si{sub 8}Sn{sub 4} (around 115 GPa) also increases significantly with Si addition, up to 160 GPa for x = 6.

Quantifying the strain-induced dissolution of precipitates in Al alloy microstructures using nuclear magnetic resonance

International Nuclear Information System (INIS)

Hutchinson, C.R.; Loo, P.T.; Bastow, T.J.; Hill, A.J.; Costa Teixeira, J. da

2009-01-01

Nuclear magnetic resonance (NMR) has been used for the first time to directly monitor the dynamic partitioning of Cu atoms from shearable precipitates into the solid solution as a function of straining at room temperature in two Al-Cu-based alloys. Al-3Cu-0.05Sn (wt.%) and Al-2.5Mg-1.5Cu (wt.%) alloys were heat-treated to provide a fine distribution of ∼5 nm Guinier-Preston (GP) zones and <1 nm Guinier-Preston-Bagaryatsky (GPB) zones, respectively, and were then subjected to rolling strains up to 100%. It is shown that in the Al-Cu-0.05Sn alloy, strains up to ∼40% can pump solute from the ∼5 nm GP zones back into solid solution for the temperature and strain-rate of deformation employed here. In the case of the Al-Cu-Mg alloy, no dissolution of the GPB zones is observed. A simple model for the strain-induced dissolution of the shearable precipitates is given and compared with the experimental results. The dependence of the Cu repartitioning process on the precipitate size is emphasized. These observations and modeling give guidelines for the design of Al-Cu-based alloys to exploit the dynamic interplay of strain-induced Cu partitioning between metastable states, e.g. solid solution and GP (or GPB) zones, for tailoring ultimate mechanical properties. It is proposed that this strain-induced phase transformation is a form of dynamically responding microstructure that can be employed to obtain aluminum alloys with well-designed microstructures.

Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer

Science.gov (United States)

Chuang, T. H.; Lin, H. J.; Chuang, C. H.; Yeh, W. T.; Hwang, J. D.; Chu, H. S.

2014-12-01

A (Pb, Sn)Te thermoelectric element plated with a Ni barrier layer and a Ag reaction layer has been joined with a Cu electrode coated with Ag and Sn thin films using a solid-liquid interdiffusion bonding method. This method allows the interfacial reaction between Ag and Sn such that Ag3Sn intermetallic compounds form at low temperature and are stable at high temperature. In this study, the bonding strength was about 6.6 MPa, and the specimens fractured along the interface between the (Pb, Sn)Te thermoelectric element and the Ni barrier layer. Pre-electroplating a film of Sn with a thickness of about 1 μm on the thermoelectric element and pre-heating at 250°C for 3 min ensures the adhesion between the thermoelectric material and the Ni barrier layer. The bonding strength is thus increased to a maximal value of 12.2 MPa, and most of the fractures occur inside the thermoelectric material. During the bonding process, not only the Ag3Sn intermetallics but also Cu6Sn5 forms at the Ag3Sn/Cu interface, which transforms into Cu3Sn with increases in the bonding temperature or bonding time.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

International Nuclear Information System (INIS)

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

2015-01-01

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

Energy Technology Data Exchange (ETDEWEB)

Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

2015-11-25

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

The Effect of Technological Parameters on the Microstructure and Mechanical Properties of AlSi17Cu4 Alloy

Directory of Open Access Journals (Sweden)

Jaroslaw PIĄTKOWSKI

2016-09-01

Full Text Available The mechanical properties (HB, HV, R0.2, Rm and plastic properties (A5, Z of AlSi17Cu4 alloy when exposed to chosen technological processes, such as modification, overheating and rapid cooling, are presented in this paper. The best combination of properties was noticed in alloy overheated for 40 minutes at 920 oC and casted into a metallic mould submerged in liquid nitrogen. Moreover, the technological stability and homogeneity of alloys were evaluated based on spread of results, expressed by standard deviation. It was proven, based on microstructure analysis, that the best effect of refinement was achieved by intensive cooling of alloy preceded by its overheating. The XRD analysis indicated that the intermetallic phases, mainly θ(Al2Cu and γ1(Al4Cu9 caused hardening of the solution, improvement in mechanical properties and technological stability.DOI: http://dx.doi.org/10.5755/j01.ms.22.3.8490

Structural and microstructural comparative analysis on metallic alloys of composition Cu{sub y%}-Ni{sub x%}-Me (Me = Sn, Cr, Al, Pt)

Energy Technology Data Exchange (ETDEWEB)

Marques, I.M.; Okazaki, A.K.; Silveira, C.R. da; Carvalhal, M.A.; Monteiro, W.A.; Carrio, J.A.G. [Physics Department, CCH, Presbyterian Mackenzie University, Materials Science and Technology Centre, Sao Paulo, SP (Brazil); Instituto de Pesquisas Energeticas e Nucleares (IPEN/CNEN-SP), Sao Paulo, SP (Brazil)], e-mail: jgcarrio@mackenzie.br

2010-07-01

This work presents a comparative study of microstructural and electrical properties of polycrystalline material Cu-Ni alloys synthesized by conventional and powder metallurgy. A sample of Cu{sub 99,33%} Ni{sub 0,23%} Pt{sub 0,43%} was produced in electric furnace with voltaic arc and various samples containing Al, Sn and Cr as third element were produced by powder metallurgy. The microstructure of the samples was studied by optical microscopy, Vickers micro hardness and x rays powder diffraction. Their electrical conductivity was measured with a milliohmeter Agilent (HP) 4338B. Refinements of the crystalline structure of the samples were performed by the Rietveld method, using the refinement program GSAS. The refinement results and Fourier differences calculations indicate that the copper matrix structure presents not significant distortions by the used amounts of the other metal atoms. The refinement of non structural parameters allowed the micro-structural characterization. The dependence of the micro-structure with thermal and mechanical treatments is studied. (author)

Structure and Mechanical Properties of Al-Cu-Fe-X Alloys with Excellent Thermal Stability.

Science.gov (United States)

Školáková, Andrea; Novák, Pavel; Mejzlíková, Lucie; Průša, Filip; Salvetr, Pavel; Vojtěch, Dalibor

2017-11-05

In this work, the structure and mechanical properties of innovative Al-Cu-Fe based alloys were studied. We focused on preparation and characterization of rapidly solidified and hot extruded Al-Cu-Fe, Al-Cu-Fe-Ni and Al-Cu-Fe-Cr alloys. The content of transition metals affects mechanical properties and structure. For this reason, microstructure, phase composition, hardness and thermal stability have been investigated in this study. The results showed exceptional thermal stability of these alloys and very good values of mechanical properties. Alloying by chromium ensured the highest thermal stability, while nickel addition refined the structure of the consolidated alloy. High thermal stability of all tested alloys was described in context with the transformation of the quasicrystalline phases to other types of intermetallics.

Thermal and Microstructure Characterization of Zn-Al-Si Alloys and Chemical Reaction with Cu Substrate During Spreading

Science.gov (United States)

Berent, Katarzyna; Pstruś, Janusz; Gancarz, Tomasz

2016-08-01

The problems associated with the corrosion of aluminum connections, the low mechanical properties of Al/Cu connections, and the introduction of EU directives have forced the potential of new materials to be investigated. Alloys based on eutectic Zn-Al are proposed, because they have a higher melting temperature (381 °C), good corrosion resistance, and high mechanical strength. The Zn-Al-Si cast alloys were characterized using differential scanning calorimetry (DSC) measurements, which were performed to determine the melting temperatures of the alloys. Thermal linear expansion and electrical resistivity measurements were performed at temperature ranges of -50 to 250 °C and 25 to 300 °C, respectively. The addition of Si to eutectic Zn-Al alloys not only limits the growth of phases at the interface of liquid solder and Cu substrate but also raises the mechanical properties of the solder. Spreading test on Cu substrate using eutectic Zn-Al alloys with 0.5, 1.0, 3.0, and 5.0 wt.% of Si was studied using the sessile drop method in the presence of QJ201 flux. Spreading tests were performed with contact times of 1, 8, 15, 30, and 60 min, and at temperatures of 475, 500, 525, and 550 °C. After cleaning the flux residue from solidified samples, the spreadability of Zn-Al-Si on Cu was determined. Selected, solidified solder/substrate couples were cross-sectioned, and the interfacial microstructures were studied using scanning electron microscopy and energy dispersive x-ray spectroscopy. The growth of the intermetallic phase layer was studied at the solder/substrate interface, and the activation energy of growth of Cu5Zn8, CuZn4, and CuZn phases were determined.

Development of Cu-Hf-Al ternary systems and tungsten wire/particle reinforced Cu48Hf43Al9 bulk metallic glass composites for strengthening

International Nuclear Information System (INIS)

Park, Joyoung; An, Jihye; Choi-Yim, Haein

2010-01-01

Stable bulk glass forming alloys can be developed over a wide range of compositions in Cu-Hf-Al ternary systems starting from the Cu 49 Hf 42 Al 9 bulk metallic glass. Ternary Cu-Hf-Al alloys can be cast directly from the melt into copper molds to form fully amorphous strips with thicknesses of 1 to 6 mm. The maximum critical diameter of the new Cu-Hf-Al ternary alloy was 6 mm. X-ray diffraction patterns were used to confirm the amorphous nature of the ternary Cu-Hf-Al alloys. To increase the toughness of these metallic glasses, we reinforced the Cu 48 Hf 43 Al 9 bulk metallic glass-forming liquid with a 50% volume fraction of tungsten particles and an 80% volume fraction of tungsten wires with diameters of 242.4 μm. Composites with a critical diameter of 7 mm and length 70 mm were synthesized. The structure of the composites was confirmed by using X-ray diffraction (XRD), and the scanning electron microscopy (SEM). The mechanical properties of the composites were studied in compression tests. The thermal stability and the crystallization processes of the Cu-Hf-Al alloys and composites were investigated by using differential scanning calorimetry (DSC). Values of the glass transition temperature (T g ), the crystallization temperature (T x ), and the supercooled liquid region (ΔT = T x - T g ) are given in this paper.

The crystallisation of Cu{sub 2}ZnSnS{sub 4} thin film solar cell absorbers from co-electroplated Cu-Zn-Sn precursors

Energy Technology Data Exchange (ETDEWEB)

Schurr, R. [Chair for Crystallography and Structural Physics, University of Erlangen-Nuernberg, Staudtstrasse 3, D-91058 Erlangen (Germany)], E-mail: schurr@krist.uni-erlangen.de; Hoelzing, A.; Jost, S.; Hock, R. [Chair for Crystallography and Structural Physics, University of Erlangen-Nuernberg, Staudtstrasse 3, D-91058 Erlangen (Germany); Voss, T.; Schulze, J.; Kirbs, A. [Atotech Deutschland GmbH, Erasmusstrasse 20, D-10553 Berlin (Germany); Ennaoui, A.; Lux-Steiner, M. [Heterogeneous Material Systems SE II, Hahn-Meitner-Institut, Glienickerstr.100, D-14109 Berlin (Germany); Weber, A.; Koetschau, I.; Schock, H.-W. [Technology SE III, Hahn-Meitner-Institut, Glienickerstr.100, D-14109 Berlin (Germany)

2009-02-02

The best CZTS solar cell so far was produced by co-sputtering continued with vapour phase sulfurization method. Efficiencies of up to 5.74% were reached by Katagiri et al. The one step electrochemical deposition of copper, zinc, tin and subsequent sulfurization is an alternative fabrication technique for the production of Cu{sub 2}ZnSnS{sub 4} based thin film solar cells. A kesterite based solar cell (size 0.5 cm{sup 2}) with a conversion efficiency of 3.4% (AM1.5) was produced by vapour phase sulfurization of co-electroplated Cu-Zn-Sn films. We report on results of in-situ X-ray diffraction (XRD) experiments during crystallisation of kesterite thin films from electrochemically co-deposited metal films. The kesterite crystallisation is completed by the solid state reaction of Cu{sub 2}SnS{sub 3} and ZnS. The measurements show two different reaction paths depending on the metal ratios in the as deposited films. In copper-rich metal films Cu{sub 3}Sn and CuZn were found after electrodeposition. In copper-poor or near stoichiometric precursors additional Cu{sub 6}Sn{sub 5} and Sn phases were detected. The formation mechanism of Cu{sub 2}SnS{sub 3} involves the binary sulphides Cu{sub 2-x}S and SnS{sub 2} in the absence of the binary precursor phase Cu{sub 6}Sn{sub 5}. The presence of Cu{sub 6}Sn{sub 5} leads to a preferred formation of Cu{sub 2}SnS{sub 3} via the reaction educts Cu{sub 2-x}S and SnS{sub 2} in the presence of a SnS{sub 2}(Cu{sub 4}SnS{sub 6}) melt. The melt phase may be advantageous in crystallising the kesterite, leading to enhanced grain growth in the presence of a liquid phase.

Structure and mechanical properties of nanostructured Al-0.3%Cu alloy

DEFF Research Database (Denmark)

Wakeel, Aneela; Huang, Tianlin; Wu, Guilin

2014-01-01

An Al-0.3%Cu alloy has been produced using extremely high purity (99.9996%) Al and OFHC Cu.The alloy was cold rolled to 98% thickness reduction, forming a stable lamellar structure that has a lamellar boundary spacing of about 200nm and a tensile strength of 225MPa. During recovery annealing at t...

Research of Mechanical Property Gradient Distribution of Al-Cu Alloy in Centrifugal Casting

Science.gov (United States)

Sun, Zhi; Sui, Yanwei; Liu, Aihui; Li, Bangsheng; Guo, Jingjie

Al-Cu alloy castings are obtained using centrifugal casting. The regularity of mechanical property gradient distribution of Al-Cu alloy castings with the same centrifugal radius at different positions is investigated. The result shows that the tensile strength, yield strength, elongation and microscope hardness exhibit the following gradient distribution characteristic — high on both sides and low on the center. The trend of mechanical property gradient distribution of Al-Cu alloy increases with the increase in the rotation speed. Moreover, the mechanical properties of casting centerline two sides have asymmetry. The reason is that the grain size of casting centerline two sides and Al2Cu phase and Cu content change correspondingly.

Thermoelastic martensite and shape memory effect in ductile Cu-Al-Mn alloys

Science.gov (United States)

Kainuma, R.; Takahashi, S.; Ishida, K.

1996-08-01

Ductile shape memory (SM) alloys of the Cu-AI-Mn system have been developed by controlling the degree of order in the β phase. Additions of Mn to the binary Cu-Al alloy stabilize the β phase and widen the single-phase region to lower temperature and lower Al contents. It is shown that Cu-Al-Mn alloys with low Al contents have either the disordered A2 structure or the ordered L21 structure with a lower degree of order and that they exhibit excellent ductility. The disordered A2 phase martensitically transforms to the disordered Al phase with a high density of twins. The martensite phase formed from the ordered L21 phase has the 18R structure. The SM effect accompanies both the A2 → Al and L21 → 18R martensitic transformations. These alloys exhibit 15 pct strain to failure, 60 to 90 pct rolling reduction without cracking, and 80 to 90 pct recovery from bend test in the martensitic condition. Experimental results on the microstructure, crystal structure, mechanical properties, and shape memory behavior in the ductile Cu-AI-Mn alloys are presented and discussed.

Unusual hardening behaviour in heavily cryo-rolled Cu-Al-Zn alloys during annealing treatment

Energy Technology Data Exchange (ETDEWEB)

Gong, Y.L. [Faculty of Science, Kunming University of Science and Technology, Kunming 650500 (China); Ren, S.Y. [Ningbo Powerway Alloy Material Co., Ltd, Ningbo 315135 (China); Zeng, S.D. [Yunnan Institute of Measuring and Testing Technology, Kunming 650228 (China); Zhu, X.K., E-mail: xk_zhu@hotmail.com [Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650500 (China)

2016-04-06

Three nanostructured Cu-Al-Zn alloys were produced via rolling at the liquid nitrogen temperature. The deformed Cu alloys were then annealed at 150–300 °C for 1 h. The two alloys with high solute content and thus with low stacking fault energy exhibit unusual annealing hardening, namely, an increase in hardness and strength and a decrease in tensile elongation after annealing at 150 and 200 °C. From X-ray diffraction (XRD) analysis and microstructural observations by transmission electron microscopy (TEM), it is found that microstrain and dislocation density decrease after annealing at 200 °C because of the recovery of dislocations and the lattice parameter decreases due to solute segregation. Meanwhile, the twin density of the two Cu alloys increases and grain size remains basically unchanged. It is shown that the formation of annealing twins and stacking faults and the segregation of solute atoms may be the main causes of unusual annealing hardening.

Precipitation and strengthening phenomena in Al-Si-Ge and Al-Cu-Si-Ge alloys

International Nuclear Information System (INIS)

Mitlin, D.; Morris, J.W.; Dahmen, U.; Radmilovic, V.

2000-01-01

The objective of this work was to determine whether Al rich Al-Si-Ge and 2000 type Al-Cu-Si-Ge alloys have sufficient hardness to be useful for structural applications. It is shown that in Al-Si-Ge it is not possible to achieve satisfactory hardness through a conventional heat treatment. This result is explained in terms of sluggish precipitation of the diamond-cubic Si-Ge phase coupled with particle coarsening. However, Al-Cu-Si-Ge displayed a uniquely fast aging response, a high peak hardness and a good stability during prolonged aging. The high hardness of the Cu containing alloy is due to the dense and uniform distribution of fine θ' precipitates (metastable Al 2 Cu) which are heterogeneously nucleated on the Si-Ge particles. High resolution TEM demonstrated that in both alloys all the Si-Ge precipitates start out, and remain multiply twinned throughout the aging treatment. Since the twinned section of the precipitate does not maintain a low index interface with the matrix, the Si-Ge precipitates are equiaxed in morphology. Copyright (2000) AD-TECH - International Foundation for the Advancement of Technology Ltd

Directional Solidification and Liquidus Projection of the Sn-Co-Cu System

Science.gov (United States)

Chen, Sinn-Wen; Chang, Jui-Shen; Pan, Kevin; Hsu, Chia-Ming; Hsu, Che-Wei

2013-04-01

This study investigates the Sn-Co-Cu ternary system, which is of interest to the electronics industry. Ternary Sn-Co-Cu alloys were prepared, their as-solidified microstructures were examined, and their primary solidification phases were determined. The primary solidification phases observed were Cu, Co, Co3Sn2, CoSn, CoSn2, Cu6Sn5, Co3Sn2, γ, and β phases. Although there are ternary compounds reported in this ternary system, no ternary compound was found as the primary solidification phase. The directional solidification technique was applied when difficulties were encountered using the conventional quenching method to distinguish the primary solidification phases, such as Cu6Sn5, Cu3Sn, and γ phases. Of all the primary solidification phases, the Co3Sn2 and Co phases have the largest compositional regimes in which alloys display them as the primary solidification phases. There are four class II reactions and four class III reactions. The reactions with the highest and lowest reaction temperatures are both class III reactions, and are L + CoSn2 + Cu6Sn5 = CoSn3 at 621.5 K (348.3 °C) and L + Co3Sn2 + CoSn = Cu6Sn5 at 1157.8 K (884.6 °C), respectively.

Effect of ageing time 200 °C on microstructure behaviour of Al-Zn-Cu-Mg cast alloys

Directory of Open Access Journals (Sweden)

Pratiwi Diah Kusuma

2017-01-01

Full Text Available Al-Zn-Cu-Mg is heat treatable alloy that can be used in many hightech applications, such as aerospace and military. The main objective of this study is to investigate the influence of ageing process in microstrucure behaviour of Al-9Zn-5Cu-4Mg cast alloy by performing SEM analysis and its correlation with hardness tests of as-cast Al-9Zn-5Cu-4Mg alloy and heat treated Al-9Zn-5Cu-4Mg cast alloy. The results show the deployment of precipitation spread over the dendrite and also the presence of second phases Mg3Zn3Al2 , Cu2FeAl7 , CuAl2, and CuMgAl2 in as-cast Al-9Zn-5Cu-4Mg alloy. The presence of all these second phases are affecting to the toughness of aluminium alloy and the presence of MgZn2 leads the impairment of hardness value of heat-treated Al-9Zn-5Cu-5Mg cast alloy.

Grain size and temperature influence on the toughness of a CuAlBe shape memory alloy

International Nuclear Information System (INIS)

Albuquerque, Victor Hugo C. de; Melo, Tadeu Antonio de A; Gomes, Rodinei M.; Lima, Severino Jackson G. de; Tavares, Joao Manuel R.S.

2010-01-01

Research highlights: → This work evaluated the capacity of a CuAlBe alloy to absorb energy until rupture. → The V-notch Charpy test was adopted at -150, -100, -50, 0, 50, 100 and 150 deg. C. → Charpy tests were complemented by DSC, DSC with optical microscope and by SEM. → First work to analyze the toughness of a CuAlBe alloy based on the Charpy test. → The results are of relevant value to enhance the understanding of the CuAlBe alloy. - Abstract: This work is a study of the influence of grain size and temperature on the toughness of CuAlBe shape memory alloys with (CuAlBeNbNi) and without NbNi (CuAlBe) grain refiner elements. The toughness analysis was based on the V-notch Charpy impact test under temperatures of -150, -100, -50, 0, 50, 100 and 150 deg. C. A statistical analysis of the results led to the conclusion that the toughness of both alloys was influenced by temperature and grain size. The CuAlBeNbNi alloy absorbed higher impact energy than the CuAlBe alloy showing that the refining elements improved the toughness of the alloy. To confirm and complement these findings, the fracture surfaces were evaluated by stereomicroscopy. Smooth homogeneous surfaces and rough heterogonous surfaces were detected for the CuAlBeNbNi and CuAlBe alloys, respectively. Predominately brittle zones were confirmed by scanning electron microscopy in both alloys. Furthermore, to determine the phase transformation temperatures and the associated microstructures, the alloys were assessed by conventional differential scanning calorimetry (DSC) and DSC with optical microscopy.

Grain size and temperature influence on the toughness of a CuAlBe shape memory alloy

Energy Technology Data Exchange (ETDEWEB)

Albuquerque, Victor Hugo C. de, E-mail: victor.albuquerque@fe.up.pt [Universidade Federal da Paraiba (UFPB), Departamento de Engenharia Mecanica (DEM), Laboratorio de Solidificacao Rapida LSR, Cidade Universitaria, S/N 58059-900 Joao Pessoa, PB (Brazil); Melo, Tadeu Antonio de A, E-mail: tadeu@lsr.ct.ufpb.br [Universidade Federal da Paraiba (UFPB), Departamento de Engenharia Mecanica (DEM), Laboratorio de Solidificacao Rapida LSR, Cidade Universitaria, S/N 58059-900 Joao Pessoa, PB (Brazil); Gomes, Rodinei M., E-mail: gomes@lsr.ct.ufpb.br [Universidade Federal da Paraiba (UFPB), Departamento de Engenharia Mecanica (DEM), Laboratorio de Solidificacao Rapida LSR, Cidade Universitaria, S/N 58059-900 Joao Pessoa, PB (Brazil); Lima, Severino Jackson G. de, E-mail: jackson@lsr.ct.ufpb.br [Universidade Federal da Paraiba (UFPB), Departamento de Engenharia Mecanica (DEM), Laboratorio de Solidificacao Rapida LSR, Cidade Universitaria, S/N 58059-900 Joao Pessoa, PB (Brazil); Tavares, Joao Manuel R.S., E-mail: tavares@fe.up.pt [Faculdade de Engenharia da Universidade do Porto (FEUP), Departamento de Engenharia Mecanica (DEMec)/Instituto de Engenharia Mecanica e Gestao Industrial INEGI, Rua Dr. Roberto Frias, S/N 4200-465 Porto (Portugal)

2010-11-25

Research highlights: {yields} This work evaluated the capacity of a CuAlBe alloy to absorb energy until rupture. {yields} The V-notch Charpy test was adopted at -150, -100, -50, 0, 50, 100 and 150 deg. C. {yields} Charpy tests were complemented by DSC, DSC with optical microscope and by SEM. {yields} First work to analyze the toughness of a CuAlBe alloy based on the Charpy test. {yields} The results are of relevant value to enhance the understanding of the CuAlBe alloy. - Abstract: This work is a study of the influence of grain size and temperature on the toughness of CuAlBe shape memory alloys with (CuAlBeNbNi) and without NbNi (CuAlBe) grain refiner elements. The toughness analysis was based on the V-notch Charpy impact test under temperatures of -150, -100, -50, 0, 50, 100 and 150 deg. C. A statistical analysis of the results led to the conclusion that the toughness of both alloys was influenced by temperature and grain size. The CuAlBeNbNi alloy absorbed higher impact energy than the CuAlBe alloy showing that the refining elements improved the toughness of the alloy. To confirm and complement these findings, the fracture surfaces were evaluated by stereomicroscopy. Smooth homogeneous surfaces and rough heterogonous surfaces were detected for the CuAlBeNbNi and CuAlBe alloys, respectively. Predominately brittle zones were confirmed by scanning electron microscopy in both alloys. Furthermore, to determine the phase transformation temperatures and the associated microstructures, the alloys were assessed by conventional differential scanning calorimetry (DSC) and DSC with optical microscopy.

Interfacial reactions in the Sb–Sn/(Cu, Ni) systems: Wetting experiments

International Nuclear Information System (INIS)

Novakovic, R.; Lanata, T.; Delsante, S.; Borzone, G.

2012-01-01

Interfacial reactions in the Sb–Sn/Cu and Sb–Sn/Ni systems have been investigated by means of wetting experiments. The wetting behaviour of two lead-free alloys, namely, Sb 2.5 Sn 97.5 and Sb 14.5 Sn 85.5 (at.%), in contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS analyses. -- Highlights: ► Sb–Sn alloys are used as high temperature lead-free solders. ► Sb–Sn alloys have good wetting properties on Cu and Ni substrates. ► Interfacial reactions and products are important for joint properties. ► Interfacial reactions/products data can be used to study the phase diagrams.

Chemical and electrical characterisation of the segregation of Al from a CuAl alloy (90%:10% wt) with thermal anneal

Energy Technology Data Exchange (ETDEWEB)

Byrne, C., E-mail: conor.byrne2@mail.dcu.ie [School of Physical Sciences, Dublin City University, Dublin 9 (Ireland); Brady, A.; Walsh, L.; McCoy, A.P.; Bogan, J. [School of Physical Sciences, Dublin City University, Dublin 9 (Ireland); McGlynn, E. [School of Physical Sciences, National Centre for Plasma Science and Technology, Dublin City University, Dublin 9 (Ireland); Rajani, K.V. [School of Electronic Engineering, Dublin City University, Dublin 9 (Ireland); Hughes, G. [School of Physical Sciences, Dublin City University, Dublin 9 (Ireland); School of Physical Sciences, National Centre for Plasma Science and Technology, Dublin City University, Dublin 9 (Ireland)

2016-01-29

A copper–aluminium (CuAl) alloy (90%:10% wt) has been investigated in relation to segregation of the alloying element Al, from the alloy bulk during vacuum anneal treatments. X-ray photoelectron spectroscopy (XPS) measurements were used to track the surface enrichment of Al segregating from the alloy bulk during in situ ultra-high vacuum anneals. Secondary ion mass spectroscopy (SIMS) indicates a build-up of Al at the surface of the annealed alloy relative to the bulk composition. Metal oxide semiconductor (MOS) CuAl/SiO{sub 2}/Si structures show a shift in flatband voltage upon thermal anneal consistent with the segregation of the Al to the alloy/SiO{sub 2} interface. Electrical four point probe measurements indicate that the segregation of Al from the alloy bulk following thermal annealing results in a decrease in film resistivity. X-ray diffraction data shows evidence for significant changes in crystal structure upon annealing, providing further evidence for expulsion of Al from the alloy bulk. - Highlights: • CuAl alloy (90%:Al 10% wt) deposited and vacuum annealed • XPS and SIMS data show segregation of Al from the alloy bulk. • Chemical changes seen indicate the reduction of Cu oxide and growth of Al Oxide. • Electrical measurements indicate a chemical change at the metal/SiO{sub 2} interface. • All data consistent with Cu diffusion barrier layer formed.

Preparation of a high strength Al-Cu-Mg alloy by mechanical alloying and press-forming

Energy Technology Data Exchange (ETDEWEB)

Tang Huaguo [State Key Laboratory of Rare Earth Utilization, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun 130022 (China); Cheng Zhiqiang [College of Resources and Environment, Jilin Agricultural University, Changchun 130118 (China); Liu Jianwei [State Key Laboratory of Rare Earth Utilization, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun 130022 (China); Ma Xianfeng, E-mail: xfma@ciac.jl.cn [State Key Laboratory of Rare Earth Utilization, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun 130022 (China)

2012-07-30

Highlights: Black-Right-Pointing-Pointer A high strength aluminum alloy of Al-2 wt.%Mg-2 wt.%Cu has been prepared by mechanical alloying and press-forming. Black-Right-Pointing-Pointer The alloy only consists of solid solution {alpha}-Al. Black-Right-Pointing-Pointer The grains size of {alpha}-Al was about 300 nm-5 {mu}m. Black-Right-Pointing-Pointer The solid solution strengthening and the grain refinement strengthening are the main reasons for such a high strength. - Abstract: A high strength aluminum alloy, with the ratio of 96 wt.%Al-2 wt.%Mg-2 wt.%Cu, has been prepared by mechanical alloying and press-forming. The alloy exhibited a high tensile strength of 780 MPa and a high microhardness of 180 HV. X-ray diffraction characterizations confirmed that the alloy only consists of a solid solution {alpha}-Al. Microstructure characterizations revealed that the grain size of {alpha}-Al was about 300 nm-5 {mu}m. The solid solution strengthening and the grain refinement strengthening were considered to be the reason for such a high strength.

Structure and Mechanical Properties of Al-Cu-Fe-X Alloys with Excellent Thermal Stability

Directory of Open Access Journals (Sweden)

Andrea Školáková

2017-11-01

Full Text Available In this work, the structure and mechanical properties of innovative Al-Cu-Fe based alloys were studied. We focused on preparation and characterization of rapidly solidified and hot extruded Al-Cu-Fe, Al-Cu-Fe-Ni and Al-Cu-Fe-Cr alloys. The content of transition metals affects mechanical properties and structure. For this reason, microstructure, phase composition, hardness and thermal stability have been investigated in this study. The results showed exceptional thermal stability of these alloys and very good values of mechanical properties. Alloying by chromium ensured the highest thermal stability, while nickel addition refined the structure of the consolidated alloy. High thermal stability of all tested alloys was described in context with the transformation of the quasicrystalline phases to other types of intermetallics.

Optical analysis of lens-like Cu{sub 2}CdSnS{sub 4} quaternary alloy nanostructures

Energy Technology Data Exchange (ETDEWEB)

Odeh, Ali Abu; Ayub, R.M. [University Malaysia Perlis, Institute of Nano Electronic Engineering, Kangar, Perlis (Malaysia); Al-Douri, Y. [University Malaysia Perlis, Institute of Nano Electronic Engineering, Kangar, Perlis (Malaysia); University of Sidi-Bel-Abbes, Physics Department, Faculty of Science, Sidi-Bel-Abbes (Algeria); Ameri, M. [Universite Djilali Liabes de Sidi Bel- Abbes, Laboratoire Physico-Chimie des Materiaux Avances (LPCMA), Sidi-Bel-Abbes (Algeria); Bouhemadou, A. [University of Setif 1, Laboratory for Developing New Materials and Their Characterization, Setif (Algeria); Prakash, Deo [SMVD University, Faculty of Engineering, School of Computer Science and Engineering, Kakryal, Katra, J and K (India); Verma, K.D. [S.V. College, Material Science Research Laboratory, Department of Physics, Aligarh, U.P. (India)

2016-10-15

Cu{sub 2}CdSnS{sub 4} quaternary alloy nanostructures with different copper concentrations (0.2, 0.4, 0.6, 0.8 and 1.0 M) were successfully synthesized on n-type silicon substrates using spin coating technique with annealing temperature at 300 C. Optical properties were analyzed through UV-Vis and Photoluminescence spectroscopies, and thus, there is a change in energy band gap with increasing Cu concentration from 0.2 to 1.0 M. The structural properties of Cu{sub 2}CdSnS{sub 4} quaternary alloy nanostructures were investigated by X-ray diffraction. The particles size and shape have a direct relationship with copper concentration. Morphological and topographical studies were carried out by using scanning electron microscopy and atomic force microscopy. The obtained results are investigated to be available in the literature for future studies. (orig.)

Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures

International Nuclear Information System (INIS)

Horváth, Barbara; Illés, Balázs; Shinohara, Tadashi

2014-01-01

Intermetallic growth mechanisms and rates are investigated in Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layer systems. An 8–10 μm thick Sn surface finish layer was electroplated onto a Cu substrate with a 1.5–2 μm thick Ni or Ag barrier layer. In order to induce intermetallic layer growth, the samples were aged in elevated temperatures: 50 °C and 125 °C. Intermetallic layer growth was checked by focused ion beam–scanning ion microscope. The microstructures and chemical compositions of the intermetallic layers were observed with a transmission electron microscope. It has been found that Ni barrier layers can effectively block the development of Cu 6 Sn 5 intermetallics. The intermetallic growth characteristics in the Sn/Cu and Sn/Ni/Cu systems are very similar. The intermetallic layer grows towards the Sn layer and forms a discrete layer. Differences were observed only in the growth gradients and surface roughness of the intermetallic layer which may explain the different tin whiskering properties. It was observed that the intermetallic layer growth mechanisms are completely different in the Ag barrier layers compared to the Ni layers. In the case of Sn/Ag/Cu systems, the Sn and Cu diffused through the Ag layer, formed Cu 6 Sn 5 intermetallics mainly at the Sn/Ag interface and consumed the Ag barrier layer. - Highlights: • Intermetallic growth was characterised in Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layer systems. • Intermetallic growth rates and roughness are similar in the Sn/Cu and Sn/Ni/Cu systems. • Sn/Ni/Cu system contains the following intermetallic layer structure Sn–Ni3Sn4–Ni3Sn2–Ni3Sn–Ni. • In the case of Sn/Ag/Cu systems the Sn and Cu diffusion consumes the Ag barrier layer. • When Cu reaches the Sn/Ag interface a large amount of Cu 6 Sn 5 forms above the Ag layer

Superplastic formability of Al-Cu-Li alloy Weldalite (TM) 049

Science.gov (United States)

Ma, Bao-Tong; Pickens, Joseph R.

1991-01-01

Extensive research during the past decade shows that several aluminum lithium alloys can be processed to attain a microstructure that enables superplasticity. The high tensile stress of Al-Cu-Li alloy Weldalite (TM) 049 in the T4 and T6 tempers offers tremendous potential for attaining exceptional post-SPF (superplastic formability) properties. The used SPF material is Weldalite, which was shown to induce SPF behavior in other Al-Cu-Li alloys. The superplastic behavior and resulting post-SPF mechanical properties of this alloy, which was designed to be the next major structural alloy for space applications, were evaluated. The results indicate that Weldalite alloy does indeed exhibit excellent superplasticity over a wide range of temperatures and strain rates and excellent post-SPF tensile strength at various potential service temperatures.

The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

Science.gov (United States)

Sungkhaphaitoon, Phairote; Plookphol, Thawatchai

2018-02-01

In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0Ag-0.5Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and thermal properties. We evaluated the effects by means of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), differential scanning calorimetry (DSC), and a universal testing machine (UTM). The results showed that a part of the Sb was dissolved in the Sn matrix phase, and the remaining one participated in the formation of intermetallic compounds (IMCs) of Ag3(Sn,Sb) and Cu6(Sn,Sb)5. In the alloy containing the highest wt pct Sb, the added component resulted in the formation of SnSb compound and small particle pinning of Ag3(Sn,Sb) along the grain boundary of the IMCs. Our tests of the Sn-3.0Ag-0.5Cu solder alloys' mechanical properties showed that the effects produced by the addition of Sb varied as a function of the wt pct Sb content. The ultimate tensile strength (UTS) increased from 29.21 to a maximum value of 40.44 MPa, but the pct elongation (pct EL) decreased from 48.0 to a minimum 25.43 pct. Principally, the alloys containing Sb had higher UTS and lower pct EL than Sb-free solder alloys due to the strengthening effects of solid solution and second-phase dispersion. Thermal analysis showed that the alloys containing Sb had a slightly higher melting point and that the addition amount ranging from 0.5 to 3.0 wt pct Sb did not significantly change the solidus and liquidus temperatures compared with the Sb-free solder alloys. Thus, the optimal concentration of Sb in the alloys was 3.0 wt pct because the microstructure and the ultimate tensile strength of the SAC305 solder alloys were improved.

Corrosion and runoff rates of Cu and three Cu-alloys in marine environments with increasing chloride deposition rate.

Science.gov (United States)

Odnevall Wallinder, Inger; Zhang, Xian; Goidanich, Sara; Le Bozec, Nathalie; Herting, Gunilla; Leygraf, Christofer

2014-02-15

Bare copper sheet and three commercial Cu-based alloys, Cu15Zn, Cu4Sn and Cu5Al5Zn, have been exposed to four test sites in Brest, France, with strongly varying chloride deposition rates. The corrosion rates of all four materials decrease continuously with distance from the coast, i.e. with decreasing chloride load, and in the following order: Cu4Sn>Cu sheet>Cu15Zn>Cu5Al5Zn. The patina on all materials was composed of two main layers, Cu2O as the inner layer and Cu2(OH)3Cl as the outer layer, and with a discontinuous presence of CuCl in between. Additional minor patina constituents are SnO2 (Cu4Sn), Zn5(OH)6(CO3)2 (Cu15Zn and Cu5Al5Zn) and Zn6Al2(OH)16CO3·4H2O/Zn2Al(OH)6Cl·2H2O/Zn5Cl2(OH)8·H2O and Al2O3 (Cu5Al5Zn). The observed Zn- and Zn/Al-containing corrosion products might be important factors for the lower sensitivity of Cu15Zn and Cu5Al5Zn against chloride-induced atmospheric corrosion compared with Cu sheet and Cu4Sn. Decreasing corrosion rates with exposure time were observed for all materials and chloride loads and attributed to an improved adherence with time of the outer patina to the underlying inner oxide. Flaking of the outer patina layer was mainly observed on Cu4Sn and Cu sheet and associated with the gradual transformation of CuCl to Cu2(OH)3Cl of larger volume. After three years only Cu5Al5Zn remains lustrous because of a patina compared with the other materials that appeared brownish-reddish. Significantly lower release rates of metals compared with corresponding corrosion rates were observed for all materials. Very similar release rates of copper from all four materials were observed during the fifth year of marine exposure due to an outer surface patina that with time revealed similar constituents and solubility properties. Copyright © 2013 The Authors. Published by Elsevier B.V. All rights reserved.

Thermal stability and primary phase of Al-Ni(Cu)-La amorphous alloys

International Nuclear Information System (INIS)

Huang Zhenghua; Li Jinfu; Rao Qunli; Zhou Youhe

2008-01-01

Thermal stability and primary phase of Al 85+x Ni 9-x La 6 (x = 0-6) and Al 85 Ni 9-x Cu x La 6 (x = 0-9) amorphous alloys were investigated by X-ray diffraction and differential scanning calorimeter. It is revealed that replacing Ni in the Al 85 Ni 9 La 6 alloy by Cu decreases the thermal stability and makes the primary phase change from intermetallic compounds to single fcc-Al as the Cu content reaches and exceeds 4 at.%. When the Ni and La contents are fixed, replacing Al by Cu increases the thermal stability but also promotes the precipitation of single fcc-Al as the primary phase

Characterization of Al-Cu-Mg-Ag Alloy RX226-T8 Plate

Science.gov (United States)

Lach, Cynthia L.; Domack, Marcia S.

2003-01-01

Aluminum-copper-magnesium-silver (Al-Cu-Mg-Ag) alloys that were developed for thermal stability also offer attractive ambient temperature strength-toughness combinations, and therefore, can be considered for a broad range of airframe structural applications. The current study evaluated Al-Cu-Mg-Ag alloy RX226-T8 in plate gages and compared performance with sheet gage alloys of similar composition. Uniaxial tensile properties, plane strain initiation fracture toughness, and plane stress tearing resistance of RX226-T8 were examined at ambient temperature as a function of orientation and thickness location in the plate. Properties were measured near the surface and at the mid-plane of the plate. Tensile strengths were essentially isotropic, with variations in yield and ultimate tensile strengths of less than 2% as a function of orientation and through-thickness location. However, ductility varied by more than 15% with orientation. Fracture toughness was generally higher at the mid-plane and greater for the L-T orientation, although the differences were small near the surface of the plate. Metallurgical analysis indicated that the microstructure was primarily recrystallized with weak texture and was uniform through the plate with the exception of a fine-grained layer near the surface of the plate. Scanning electron microscope analysis revealed Al-Cu-Mg second phase particles which varied in composition and were primarily located on grain boundaries parallel to the rolling direction. Fractography of toughness specimens for both plate locations and orientations revealed that fracture occurred predominantly by transgranular microvoid coalescence. Introduction High-strength, low-density Al-Cu-Mg-Ag alloys were initially developed to replace conventional 2000 (Al-Cu-Mg) and 7000 (Al-Zn-Cu-Mg) series aluminum alloys for aircraft structural applications [1]. During the High Speed Civil Transport (HSCT) program, improvements in thermal stability were demonstrated for candidate

Lead-free soldering: Investigation of the Cu-Sn-Sb system along the Sn:Sb = 1:1 isopleth

Energy Technology Data Exchange (ETDEWEB)

Yuan, Y. [State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan 410083 (China); Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy); Borzone, G., E-mail: borzone@chimica.unige.it [Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy); Zanicchi, G.; Delsante, S. [Department of Chemistry and Industrial Chemistry, University of Genoa, INSTM UdR Genoa, Via Dodecaneso 31, I-16146 Genoa (Italy)

2011-02-03

Research highlights: > In the electronics industry, the solder alloys commonly used for assembly belong to the Sn-Pb system. Fulfilment of the EU RoHS (reduction of hazardous substances) requires the development of new lead-free alloys for applications in electronics, with the same or possibly better characteristics than the traditional Sn-Pb alloys. > This research concerns the investigation of the constitutional properties of the Cu-Sn-Sb system which is considered as lead-free replacement for high-temperature applications. - Abstract: The Cu-Sn-Sb system has been experimentally investigated by a combination of optical microscopy, differential scanning calorimetry (DSC) and electron probe microanalysis (EPMA). DSC was used to identify a total number of five invariant ternary reactions and the Sn:Sb = 1:1 isopleth section up to 65 at.% Cu was constructed by combining the DSC data with the EPMA analyses of annealed alloys and literature information. The composition limits of the binary phases were detected.

Study of the properties of internal oxidized Cu - Al - Ti - Hf alloys

International Nuclear Information System (INIS)

Solopov, V.I.; Daneliya, E.P.; Daneliya, G.V.; Lebasova, O.P.

1982-01-01

Investigation results of mechanical properties and electric conductivity of rods of internally oxidized alloys Cu-Al-Ti-Hf depending on chemical composition, varying in the limits ensuring the formation of disperse enough and evenly distributed over the volume oxide phase. (0-1%Al, 0-0.5%Ti, 0-0.3%Hf, the restcopper), in the process of internal oxidation are presented. Internally oxidized alloys Cu-Al-Ti-Hf have increased strength properties with insignificant increase of specific electric resistance as compared with the known internally oxidized alloys Cu-Al. At that, the best combination of physicomechanical properties is achieved at small contents of titanium (0.01-0.05%) and hafnium (0.01-0.1%)

Severe plastic deformation of copper and Al-Cu alloy using multiple channel-die compression

International Nuclear Information System (INIS)

Parimi, A.K.; Robi, P.S.; Dwivedy, S.K.

2011-01-01

Research highlights: → SPD of copper and Al-Cu alloy by multiple channel-die compression tests.→ Extensive grain refinement resulting in nano-sized grains after SPD. → Investigation of micro-structure using optical microscope and SEM. → Shear band formation as the failure mechanism in the two phase Al-Cu alloy. → Difficulty in obtaining SPD for Al-Cu alloy in this method. -- Abstract: Severe plastic deformation studies of copper and Al-Cu alloy by multiple channel-die compression tests were investigated. The materials were tested under plane strain condition by maintaining a constant strain rate of 0.001/s. Extensive grain refinement was observed resulting in nano-sized grains after severe plastic deformation with concomitant increase in flow stress and hardness. The microstructural investigation of the severely deformed materials was investigated using optical microscope and scanning electron microscope. Shear band formation was identified as the failure mechanism in the two phase Al-Cu alloy. The results indicate difficulty in obtaining severe plastic deformation for alloys having two phase micro-structure.

Stability of an amorphous alloy of the Mm-Al-Ni-Cu system

Directory of Open Access Journals (Sweden)

Carlos Triveño Rios

2012-10-01

Full Text Available An investigation was made of the stability of melt-spun ribbons of Mm55Al25Ni10Cu10 (Mm = Mischmetal amorphous alloy. The structural transformations that occurred during heating were studied using a combination of X-ray diffraction (XRD and differential scanning calorimetry (DSC. Crystallization took place through a multi-stage process. The first stage of transformation corresponded to the formation of a metastable phase followed by cfc-Al precipitation, while in the second stage, exothermic transformations led to the formation of complex and unidentified Mm(Cu, Ni and MmAl(Cu, Ni phases. The transformation curves recorded from isothermal treatments at 226 °C and 232 °C indicated that crystallization occurred through nucleation and growth, with diffusion-controlled growth occurring in the first crystallization stage. The supercooled liquid region, ∆Tx, at 40 K/min was ~80 K. This value was obtained by the substitution of Mm (=Ce + La + Nd + Pr for La or Ce, saving chemical element-related costs.

L10 ordered structures in Al-Cu-(Mg) alloys at the early stages of elevated temperature aging

Energy Technology Data Exchange (ETDEWEB)

Fuzhong, X.; Mingpu, W.

2016-07-01

This study concerns the precipitation structures of Al-3Cu and Al-3Cu-1.78Mg (wt. %) alloys at the early stages of elevated temperature aging. The Al-3Cu and Al-3Cu-1.78 Mg alloys were solution treated at 540 °C and 500 °C for 2 h, respectively, and then aged at 190 °C for 2 min. The precipitation structures in aged Al-3Cu-(1.78Mg) alloys were characterized by Transmission Electron Microscopy (TEM) and High Resolution Transmission Electron Microscopy (HTREM). 001 zone axis Selected area electron diffraction patterns indicate that L10 ordered structures are formed in the two aged alloys. HRTEM experiments reveal the partial dislocations on the interfaces of L10 ordered structures. From comparing experimental results with that in the literature, it is concluded that the L10 ordered structures in aged Al-3Cu alloy consist of Al and Cu atoms, and they are comprised by Al, Cu and Mg atoms together in the aged Al-3Cu-1.78Mg alloy. On the basis of precipitate growing thermodynamics, it is thought the L10 ordered structures act as nuclei for GP zones in Al-Cu-(Mg) alloys during aging. (Author)

L10 ordered structures in Al-Cu-(Mg) alloys at the early stages of elevated temperature aging

International Nuclear Information System (INIS)

Fuzhong, X.; Mingpu, W.

2016-01-01

This study concerns the precipitation structures of Al-3Cu and Al-3Cu-1.78Mg (wt. %) alloys at the early stages of elevated temperature aging. The Al-3Cu and Al-3Cu-1.78 Mg alloys were solution treated at 540 °C and 500 °C for 2 h, respectively, and then aged at 190 °C for 2 min. The precipitation structures in aged Al-3Cu-(1.78Mg) alloys were characterized by Transmission Electron Microscopy (TEM) and High Resolution Transmission Electron Microscopy (HTREM). 001 zone axis Selected area electron diffraction patterns indicate that L10 ordered structures are formed in the two aged alloys. HRTEM experiments reveal the partial dislocations on the interfaces of L10 ordered structures. From comparing experimental results with that in the literature, it is concluded that the L10 ordered structures in aged Al-3Cu alloy consist of Al and Cu atoms, and they are comprised by Al, Cu and Mg atoms together in the aged Al-3Cu-1.78Mg alloy. On the basis of precipitate growing thermodynamics, it is thought the L10 ordered structures act as nuclei for GP zones in Al-Cu-(Mg) alloys during aging. (Author)

Grain refining of Al-4.5Cu alloy by adding an Al-30TiC master alloy

Energy Technology Data Exchange (ETDEWEB)

Sato, Kazuaki [Toyota Motor Corp., Shizuoka (Japan). Materials Engineering Div. III; Flemings, M.C. [Massachusetts Inst. of Tech., Cambridge, MA (United States). Dept. of Materials Science and Engineering

1998-06-01

A particulate Al-30 wt pct TiC composite was employed as a grain refiner for the Al-4.5 wt pct Cu alloy. The composite contains submicron TiC particles. The addition of the TiC grain refiner to the metal alloy in the amount of 0.1 Ti wt pct effected a remarkable reduction in the average grain size in Al-4.5 wt pct Cu alloy castings. With the content of over 0.2 Ti wt pct, the grain refiner maintained its refining effectiveness even after a 3,600-second holding time at 973 K. The TiC particles in the resulting castings were free of interfacial phases. It is concluded that the TiC are the nucleating agents and that they are resistant to the fading effect encountered with most grain refiners.

In-situ XRD study of alloyed Cu2ZnSnSe4-CuInSe2 thin films for solar cells

International Nuclear Information System (INIS)

Hartnauer, Stefan; Wägele, Leonard A.; Jarzembowski, Enrico; Scheer, Roland

2015-01-01

We investigate the growth of Cu 2 ZnSnSe 4 -CuInSe 2 (CZTISe) thin films using a 2-stage (Cu-rich/Cu-free) co-evaporation process under simultaneous application of in-situ angle dispersive X-ray diffraction (XRD). In-situ XRD allows monitoring the phase formation during preparation. A variation of the content of indium in CZTISe leads to a change in the lattice constant. Single phase CZTISe is formed in a wide range, while at high In contents a phase separation is detected. Because of different thermal expansion coefficients, the X-ray diffraction peaks of ZnSe and CZTISe can be distinguished at elevated substrate temperatures. The formation of ZnSe appears to be inhibited even for low indium content. In-situ XRD shows no detectable sign for the formation of ZnSe. First solar cells of CZTISe have been prepared and show comparable performance to CZTSe. - Highlights: • In-situ XRD study of two-stage co-evaporated Cu 2 ZnSnSe 4 -CuInSe 2 alloyed thin films. • No detection of ZnSe with in-situ XRD due to Indium incorporation • Comparable efficiency of alloyed solar cells

The roles of Al2Cu and of dendritic refinement on surface corrosion resistance of hypoeutectic Al-Cu alloys immersed in H2SO4

International Nuclear Information System (INIS)

Osorio, Wislei R.; Spinelli, Jose E.; Freire, Celia M.A.; Cardona, Margarita B.; Garcia, Amauri

2007-01-01

Al-Cu alloys castings can exhibit different corrosion responses at different locations due to copper content and to the resulting differences on microstructural features and on Al 2 Cu fractions. The aim of this study was to investigate the influence of Al 2 Cu intermetallic particles associated to the dendritic arm spacings on the general corrosion resistance of three different hypoeutectic Al-Cu alloys samples in sulfuric acid solution. The cast samples were produced using a non-consumable tungsten electrode furnace with a water-cooled copper hearth under argon atmosphere. The typical microstructural pattern was examined by using electronic microscopy techniques. In order to evaluate the surface corrosion behavior of such Al-Cu alloys, corrosion tests were performed in a 0.5 M sulfuric acid solution at 25 deg. C by using an electrochemical impedance spectroscopy (EIS) technique and potentiodynamic polarization curves. An equivalent circuit was also used to provide quantitative support for the discussions and understanding of the corrosion behavior. It was found that Al 2 Cu has a less noble corrosion potential than that of the Al-rich phase. Despite that, dendrite fineness has proved to be more influent on corrosion resistance than the increase on alloy copper content with the consequent increase on Al 2 Cu fraction

Moessbauer study of the ageing effects on the structure of CuZnSn shape memory alloy

International Nuclear Information System (INIS)

Frackowiak, J.E.; Dutkiewicz, J.; Morgiel, J.

1986-01-01

Using the 119 Sn Moessbauer spectroscopy the study of ageing effects on the structure of a CuZnSn shape memory alloy was performed. Two stages of ageing at 200 0 C were observed. The first stage is connected with formation of DO 3 structure and the second stage with precipitation of α and γ phases. (Auth.)

In Situ Synthesis of Al-Si-Cu Alloy During Brazing Process and Mechanical Property of Brazing Joint

Directory of Open Access Journals (Sweden)

LONG Wei-min

2016-06-01

Full Text Available The Al-Si-Cu alloy system is considered to be a promising choice of filler metal for aluminium alloys brazing due to its high strength and low melting point. The greatest obstacle is its lack of plastic forming ability and being difficult to be processed by conventional methods. This disadvantage is ascribed to the considerable amount of brittle CuAl2 intermetallic compound which forms when alloy composition is around the ternary eutectic point. In order to overcome this deficiency, authors of this article proposed to synthesize Al-Si-Cu filler metal by using in situ synthesis method, and the structure and properties of brazing joints were studied. The results show that AlSi alloy is used as the wrap layer, and CuAl alloy is used as the powder core in the composite brazing wire, the two alloys have similar melting points. The machinability of the composite brazing wire is much superior to the traditional Al-Si-Cu filler metal. During the induction brazing of 3A21 alloy, when using AlSi-CuAl composite filler wire, AlSi and CuAl alloys melt almost simultaneously, then after short time holding, Al-Si-Cu braze filler is obtained, the brazing seam has uniform composition and good bonding interface, also, the shearing strength of the brazing joints is higher than the joint brazed by conventional Al-Si-Cu filler metal.

Particle Based Alloying by Accumulative Roll Bonding in the System Al-Cu

Directory of Open Access Journals (Sweden)

Mathias Göken

2011-11-01

Full Text Available The formation of alloys by particle reinforcement during accumulative roll bonding (ARB, and subsequent annealing, is introduced on the basis of the binary alloy system Al-Cu, where strength and electrical conductivity are examined in different microstructural states. An ultimate tensile strength (UTS of 430 MPa for Al with 1.4 vol.% Cu was reached after three ARB cycles, which almost equals UTS of the commercially available Al-Cu alloy AA2017A with a similar copper content. Regarding electrical conductivity, the UFG structure had no significant influence. Alloying of aluminum with copper leads to a linear decrease in conductivity of 0.78 µΩ∙cm/at.% following the Nordheim rule. On the copper-rich side, alloying with aluminum leads to a slight strengthening, but drastically reduces conductivity. A linear decrease of electrical conductivity of 1.19 µΩ∙cm/at.% was obtained.

Structure and Mechanical Properties of Al-Cu-Fe-X Alloys with Excellent Thermal Stability

OpenAIRE

Školáková, Andrea; Novák, Pavel; Mejzlíková, Lucie; Průša, Filip; Salvetr, Pavel; Vojtěch, Dalibor

2017-01-01

In this work, the structure and mechanical properties of innovative Al-Cu-Fe based alloys were studied. We focused on preparation and characterization of rapidly solidified and hot extruded Al-Cu-Fe, Al-Cu-Fe-Ni and Al-Cu-Fe-Cr alloys. The content of transition metals affects mechanical properties and structure. For this reason, microstructure, phase composition, hardness and thermal stability have been investigated in this study. The results showed exceptional thermal stability of these allo...

Simultaneous increase in strength and ductility by decreasing interface energy between Zn and Al phases in cast Al-Zn-Cu alloy.

Science.gov (United States)

Han, Seung Zeon; Choi, Eun-Ae; Park, Hyun Woong; Lim, Sung Hwan; Lee, Jehyun; Ahn, Jee Hyuk; Hwang, Nong-Moon; Kim, Kwangho

2017-09-22

Cast-Al alloys that include a high amount of the second element in their matrix have comparatively high strength but low ductility because of the high volume fraction of strengthening phases or undesirable inclusions. Al-Zn alloys that have more than 30 wt% Zn have a tensile strength below 300 MPa, with elongation under 5% in the as-cast state. However, we found that after substitution of 2% Zn by Cu, the tensile strength of as-cast Al-Zn-Cu alloys was 25% higher and ductility was four times higher than for the corresponding Al-35% Zn alloy. Additionally, for the Al-43% Zn alloy with 2% Cu after 1 h solution treatment at 400 °C and water quenching, the tensile strength unexpectedly reached values close to 600 MPa. For the Al-33% Zn alloy with 2% Cu, the tensile strength was 500 MPa with 8% ductility. The unusual trends of the mechanical properties of Al-Zn alloys with Cu addition observed during processing from casting to the subsequent solution treatment were attributed to the precipitation of Zn in the Al matrix. The interface energy between the Zn particles and the Al matrix decreased when using a solution of Cu in Zn.

EFFECTS OF TIN ON HARDNESS, WEAR RATE AND COEFFICIENT OF FRICTION OF CAST CU-NI-SN ALLOYS

Directory of Open Access Journals (Sweden)

S. ILANGOVAN

2013-02-01

Full Text Available An investigation was carried out to understand the effects of Sn on hardness, wear rate and the coefficient of friction of spinodal Cu-Ni-Sn alloys. Alloys of appropriate compositions were melted in a crucible furnace under argon atmosphere and cast into sand moulds. Solution heat treated and aged specimens were tested for hardness, wear rate and the coefficient of friction. It was found that the hardness increases when the Sn content increases from 4% to 8% in the solution heat treated conditions. The peak aging time is found to decrease with an increase in the Sn content. Further, the coefficient of friction is independent of hardness whereas the wear rate decreases linearly with hardness irrespective of Sn content.

Effect of mushy state rolling on age-hardening and tensile behavior of Al-4.5Cu alloy and in situ Al-4.5Cu-5TiB2 composite

International Nuclear Information System (INIS)

Siddhalingeshwar, I.G.; Herbert, M.A.; Chakraborty, M.; Mitra, R.

2011-01-01

Research highlights: → Mushy state rolling of composites reduces peak-aging times to ∼7.5-10% of that of as-cast alloy. → Uniform Cu atom distribution achieved in matrices by mushy state rolling enhances aging kinetics. → Uniform precipitate distribution obtained by mushy state rolling leads to higher microhardness. → Peak-age tensile strength and strain hardening rates are found to increase on mushy state rolling. - Abstract: The effect of mushy state rolling on aging kinetics of stir-cast Al-4.5Cu alloy and in situ Al-4.5Cu-5TiB 2 composite and their tensile behavior in solution-treated (495 deg. C) or differently aged (170 deg. C) conditions, has been investigated. As-cast or pre-hot rolled alloy and composite samples were subjected to single or multiple mushy state roll passes to 5% thickness reduction at temperatures for 20% liquid content. Peak-aging times of mushy state rolled composite matrices have been found as ∼7.5-10% of that of as-cast alloy. Such enhancement in aging kinetics is attributed to homogeneity in Cu atom distribution as well as increase in matrix dislocation density due to thermal expansion coefficient mismatch between Al and TiB 2 , matrix grain refinement and particle redistribution, achieved by mushy state rolling. Uniform precipitate distribution in mushy state rolled composite matrices leads to greater peak-age microhardness with higher yield and ultimate tensile strengths than those in as-cast alloy and composite.

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

Science.gov (United States)

Jang, Guh-Yaw; Duh, Jenq-Gong

2005-01-01

The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

Effect of Sn addition on the microstructure and deformation behavior of Mg-3Al alloy

International Nuclear Information System (INIS)

Suh, Byeong-Chan; Kim, Jae H.; Bae, Jun Ho; Hwang, Ji Hyun; Shim, Myeong-Shik; Kim, Nack J.

2017-01-01

Mg alloys generally suffer from their poor formability at low temperatures due to their strong basal texture and a lack of adequate deformation systems. In the present study, a small amount of Sn was added instead of Zn to Mg-3Al alloy to modify its deformation behavior and improve the stretch formability. Microstructural examinations of the deformed Mg-3Al-1Sn (AT31) alloy by electron backscatter diffraction and transmission electron microscopy show that prismatic slip is quite active during deformation, resulting in much lower r-values and planar anisotropy than the counterpart Mg-3Al-1Zn (AZ31) alloy. Polycrystal plasticity simulation based on visco-plasticity self-consistent (VPSC) model also shows that prismatic slip is the dominant deformation mode in AT31 alloy besides basal slip. As a consequence, AT31 alloy shows a much higher stretch formability than AZ31 alloy. On the other hand, AZ31 alloy shows the development of intense shear bands during stretch forming, and these shear bands act as crack propagating paths, limiting the stretch formability of AZ31 alloy.

Study of an Al-Si-Cu HPDC alloy with high Zn content for the production of components requiring high ductility and tensile properties

Energy Technology Data Exchange (ETDEWEB)

Vicario, Iban; Egizabal, Pedro; Galarraga, Haize; Plaza, Luis Maria; Crespo, Inigo [Fundacion Tecnalia Research and Innovation, Donostia-San Sebastien (Spain). Dept. of foundry processes

2013-04-15

Conventional high-pressure die casting aluminium components present certain limitations in terms of mechanical properties attainable due to the intrinsic porosity of the castings as well as the presence of iron-based brittle intermetallic phases. The present work approaches the increase in ductility and tensile strength through the analysis of the effect of the alloying elements of AlSi alloys used for high-pressure die casting. The combination of alloying elements providing the best results in terms of ductility and tensile strength were eventually selected to produce a batch of components that were thoroughly tested. The final alloy had a composition of Si 8.21, Fe 0.78, Cu 1.53, Mn 0.64, Mg 0.46, Ni 0.07, Zn 3.37, Pb 0.34, Sn 0.27, Ti 0.18 and Cr 0.04wt.%. The selected alloy performance was compared to that of the commercial AlSi9Cu3 and Silafont {sup registered} 36 alloys.

Corrosion mechanism of Al, Al–Zn and Al–Zn–Sn alloys in 3 wt.% NaCl solution

International Nuclear Information System (INIS)

Khireche, S.; Boughrara, D.; Kadri, A.; Hamadou, L.; Benbrahim, N.

2014-01-01

Highlights: • We elaborate Al–5Zn–xSn sacrificial anodes (x = 0.1%, 0.2% and 0.4%). • Increasing Sn amount does activate Al alloys. • The anode dissolution in NaCl initiates at precipitations where Sn is enriched. • Sn enhances uniform attack on the surface of the Al alloy. • Al–Zn–Sn anodes perform better than the Al–Zn anode. - Abstract: The effect of zinc and tin addition to pure aluminum was investigated in 3 wt.% NaCl solution. The corrosion behavior of the elaborated samples (Al, Al–Zn and Al–Zn–Sn) was studied by open circuit potential, Tafel plot and electrochemical impedance spectroscopy. For the microstructure characterization, Scanning Electron Microscopy and Energy Dispersive X-ray Spectroscopy were used. The aluminum activation increases in the following order: Al < Al–5Zn < Al–5Zn–0.1Sn < Al–5Zn–0.2Sn < Al–5Zn–0.4Sn. The impedance measurements and the microscopic observations confirmed the great activity of Al–Zn and Al–Zn–Sn compared to pure Al. The segregation at the grain boundaries leads to intergranular corrosion

Effect of Al2Cu precipitates size and mass transport on the polarisation behaviour of age-hardened Al-Si-Cu-Mg alloys in 0.05 M NaCl

International Nuclear Information System (INIS)

Vieira, A.C.; Pinto, A.M.; Rocha, L.A.; Mischler, S.

2011-01-01

Research highlights: → Influence of the size distribution of Al-Cu phases on the electrochemical behaviour of well defined alloys under controlled mass transport conditions (RDE). → Oxygen reduction occurs only the Al 2 Cu phases. → Thinner Al-Cu grains the oxygen reduction current deviates at high rotation rates from the Levich behaviour. - Abstract: The electrochemical behaviour of age-hardened Al-Si-Cu-Mg alloys was investigated in a 0.05 M NaCl solution under controlled mass transport conditions using a rotating disk electrode. This work aimed at getting better understanding of the effect of the alloy microstructure, in particular the size distribution of Al 2 Cu phase, on the corrosion behaviour of the alloy. Three different size distributions of the Al 2 Cu phase were obtained through appropriate heat treatments. The cathodic reduction of oxygen was found to occur mainly on the Al 2 Cu phases acting as preferential cathodes. Small sized Al 2 Cu phases were found to promote at high rotation rates a transition from a 4 electron to a 2 electron dominated oxygen reduction mechanisms.

Control of segregation in squeeze cast Al-4.5Cu binary alloy

Energy Technology Data Exchange (ETDEWEB)

Durrant, G. [Oxford Univ. (United Kingdom). Dept. of Materials; Gallerneault, M. [Alcan International Ltd., Kingston, ON (Canada); Cantor, B. [Oxford Univ. (United Kingdom). Dept. of Materials

1997-10-01

The high pressure applied in squeeze casting allows Al alloys of wrought composition to be cast to near net-shape, although their long freezing range leads to the segregation of alloying elements. In this paper we present results on the squeeze casting and gravity casting of a model Al-4.5 wt%Cu alloy. Squeeze cast Al-4.5Cu has a normal segregation pattern with eutectic macrosegregates towards the centre of the billet, whereas gravity cast material has a typical inverse segregation pattern. Normal segregation in squeeze cast Al-4.5Cu is due to large temperature gradients during solidification. Segregation can be minimized by releasing the applied pressure during solidification to allow backflow of the interdendritic fluid, or by the addition of grain refiner to remove the large columnar dendritic growth structure. (orig.)

The effect of zinc on the microstructure and phase transformations of casting Al-Cu alloys

Directory of Open Access Journals (Sweden)

Manasijević Ivana I.

2016-01-01

Full Text Available Copper is one of the main alloying elements for aluminum casting alloys. As an alloying element, copper significantly increases the tensile strength and toughness of alloys based on aluminum. The copper content in the industrial casting aluminum alloys ranges from 3,5 to 11 wt.%. However, despite the positive effect on the mechanical properties, copper has a negative influence on the corrosion resistance of aluminum and its alloys. In order to further improve the properties of Al-Cu alloys they are additional alloyed with elements such as zinc, magnesium and others. In this work experimental and analytical examination of the impact of zinc on the microstructure and phase transformations of Al-Cu alloys was carried out. In order to determine the effect of the addition of zinc to the structure and phase transformations of Al-Cu alloys two alloys of Al-Cu-Zn system with selected compositions were prepared and then examined using scanning electron microscopy with energy-dispersive spectroscopy (SEM-EDX. The experimental results were compared with the results of thermodynamic calculations of phase equilibria.

Preparation and Properties of Mg-Cu-Y-Al bulk Amorphous Alloys

DEFF Research Database (Denmark)

Pryds, Nini; Eldrup, Morten Mostgaard; Ohnuma, M.

2000-01-01

Bulk amorphous (Mg(1-gamma)Al(gamma))(60)CU(30)Y(10) alloys were prepared using a relatively simple technique of rapid cooling of the melt in a copper wedge mould. The temperature vs, time was recorded during the cooling and solidification process of the melt and compared with a spacial and tempo......Bulk amorphous (Mg(1-gamma)Al(gamma))(60)CU(30)Y(10) alloys were prepared using a relatively simple technique of rapid cooling of the melt in a copper wedge mould. The temperature vs, time was recorded during the cooling and solidification process of the melt and compared with a spacial...... temperatures in specimens containing a few percent Al. The alloy with no Al crystallises apparently without the formation of nanoparticles. The critical cooling rate for the formation of an amorphous Mg(60)CU(30)Y(10) specimen was determined experimentally by a combination of DSC data and temperature vs, time...

Eutectic crystallization behavior of new Zr48Cu36Al8Ag8 alloy with high glass-forming ability

International Nuclear Information System (INIS)

Zhang, Q S; Zhang, W; Xie, G Q; Inoue, A

2009-01-01

A water quenching method is used to produce as-cast Zr 48 Cu 36 Al 8 Ag 8 rods with diameters from 20 mm to 25 mm. The microstructures of the as-cast samples were investigated by X-ray diffraction, optical microscopy and scanning electron microscopy. Furthermore, the crystallization behavior of the Zr 48 Cu 36 Al 8 Ag 8 glassy alloy was examined by XRD and transmission electron microscopy. Based on the results obtained one can assume that the simultaneous precipitation of the Zr 2 Cu+AlCu 2 Zr eutectic phases is the possible reason for the high stabilization of the quaternary Zr 48 Cu 36 Al 8 Ag 8 supercooled liquid.

Calculation of Gibbs energy of Zr-Al-Ni, Zr-Al-Cu, Al-Ni-Cu and Zr-Al-Ni-Cu liquid alloys based on quasiregular solution model

International Nuclear Information System (INIS)

Li, H.Q.; Yang, Y.S.; Tong, W.H.; Wang, Z.Y.

2007-01-01

With the effects of electronic structure and atomic size being introduced, the mixing enthalpy as well as the Gibbs energy of the ternary Zr-Al-Cu, Ni-Al-Cu, Zr-Ni-Al and quaternary Zr-Al-Ni-Cu systems are calculated based on quasiregular solution model. The computed results agree well with the experimental data. The sequence of Gibbs energies of different systems is: G Zr-Al-Ni-Cu Zr-Al-Ni Zr-Al-Cu Cu-Al-Ni . To Zr-Al-Cu, Ni-Al-Cu and Zr-Ni-Al, the lowest Gibbs energy locates in the composition range of X Zr 0.39-0.61, X Al = 0.38-0.61; X Ni = 0.39-0.61, X Al = 0.38-0.60 and X Zr = 0.32-0.67, X Al = 0.32-0.66, respectively. And to the Zr-Ni-Al-Cu system with 66.67% Zr, the lowest Gibbs energy is obtained in the region of X Al = 0.63-0.80, X Ni = 0.14-0.24

Predictive calculation of phase formation in Al-rich Al-Zn-Mg-Cu-Sc-Zr alloys using a thermodynamic Mg-alloy database

International Nuclear Information System (INIS)

Groebner, J.; Rokhlin, L.L.; Dobatkina, T.V.; Schmid-Fetzer, R.

2007-01-01

Three series of Al-rich alloys in the system Al-Zn-Mg-Cu-Sc-Zr and the subsystems Al-Zn-Mg-Cu-Sc and Al-Zn-Mg-Sc were studied by thermodynamic calculations. Phase formation was compared with experimental data obtained by DTA and microstructural analysis. Calculated phase diagrams, phase amount charts and enthalpy charts together with non-equilibrium calculations under Scheil conditions reveal significant details of the complex phase formation. This enables consistent and correct interpretation of thermal analysis data. Especially the interpretation of liquidus temperature and primary phase is prone to be wrong without using this tool of computational thermodynamics. All data are predictions from a thermodynamic database developed for Mg-alloys and not a specialized Al-alloy database. That provides support for a reasonable application of this database for advanced Mg-alloys beyond the conventional composition ranges

Predictive calculation of phase formation in Al-rich Al-Zn-Mg-Cu-Sc-Zr alloys using a thermodynamic Mg-alloy database

Energy Technology Data Exchange (ETDEWEB)

Groebner, J. [Institute of Metallurgy, Clausthal University of Technology, Robert-Koch Strasse 42, D-38678 Clausthal-Zellerfeld (Germany); Rokhlin, L.L. [Baikov Institute of Metallurgy and Materials Science, Leninsky prosp. 49, 119991 GSP-1, Moscow (Russian Federation); Dobatkina, T.V. [Baikov Institute of Metallurgy and Materials Science, Leninsky prosp. 49, 119991 GSP-1, Moscow (Russian Federation); Schmid-Fetzer, R. [Institute of Metallurgy, Clausthal University of Technology, Robert-Koch Strasse 42, D-38678 Clausthal-Zellerfeld (Germany)]. E-mail: schmid-fetzer@tu-clausthal.de

2007-05-16

Three series of Al-rich alloys in the system Al-Zn-Mg-Cu-Sc-Zr and the subsystems Al-Zn-Mg-Cu-Sc and Al-Zn-Mg-Sc were studied by thermodynamic calculations. Phase formation was compared with experimental data obtained by DTA and microstructural analysis. Calculated phase diagrams, phase amount charts and enthalpy charts together with non-equilibrium calculations under Scheil conditions reveal significant details of the complex phase formation. This enables consistent and correct interpretation of thermal analysis data. Especially the interpretation of liquidus temperature and primary phase is prone to be wrong without using this tool of computational thermodynamics. All data are predictions from a thermodynamic database developed for Mg-alloys and not a specialized Al-alloy database. That provides support for a reasonable application of this database for advanced Mg-alloys beyond the conventional composition ranges.

Enthalpy of mixing of liquid Ag–Bi–Cu alloys at 1073 K

International Nuclear Information System (INIS)

Fima, Przemysław; Flandorfer, Hans

2014-01-01

Highlights: • Partial and integral mixing enthalpies of liquid Ag–Bi–Cu alloys were determined. • Integral mixing enthalpies are small and endothermic, similar to limiting binaries. • The ternary data were fitted on the basis of Redlich–Kister–Muggianu model. - Abstract: The Ag–Bi–Cu system is among those ternary systems which have not been fully studied yet, in particular the thermodynamic description of the liquid phase is missing. Partial and integral enthalpies of mixing of liquid ternary Ag–Bi–Cu alloys were determined over a broad composition range along six sections: x(Ag)/x(Bi) = 0.25, 1, 4; x(Ag)/x(Cu) = 1.5; x(Bi)/x(Cu) = 1.86, 4. Measurements were carried out at 1073 K using two Calvet type microcalorimeters and drop calorimetric technique. It was found that integral enthalpies of mixing are small and endothermic, similarly to limiting binary alloys. The ternary data were fitted on the basis of an extended Redlich–Kister–Muggianu model for substitutional solutions. There are no significant additional ternary interactions

Solidification paths of multicomponent monotectic aluminum alloys

Energy Technology Data Exchange (ETDEWEB)

Mirkovic, Djordje; Groebner, Joachim [Clausthal University of Technology, Institute of Metallurgy, Robert-Koch-Street 42, D-38678 Clausthal-Zellerfeld (Germany); Schmid-Fetzer, Rainer [Clausthal University of Technology, Institute of Metallurgy, Robert-Koch-Street 42, D-38678 Clausthal-Zellerfeld (Germany)], E-mail: schmid-fetzer@tu-clausthal.de

2008-10-15

Solidification paths of three ternary monotectic alloy systems, Al-Bi-Zn, Al-Sn-Cu and Al-Bi-Cu, are studied using thermodynamic calculations, both for the pertinent phase diagrams and also for specific details concerning the solidification of selected alloy compositions. The coupled composition variation in two different liquids is quantitatively given. Various ternary monotectic four-phase reactions are encountered during solidification, as opposed to the simple binary monotectic, L' {yields} L'' + solid. These intricacies are reflected in the solidification microstructures, as demonstrated for these three aluminum alloy systems, selected in view of their distinctive features. This examination of solidification paths and microstructure formation may be relevant for advanced solidification processing of multicomponent monotectic alloys.

Investigation of thermal, mechanical and magnetic behaviors of the Cu-11%Al alloy with Ag and Mn additions

International Nuclear Information System (INIS)

Silva, R.A.G.; Paganotti, A.; Gama, S.; Adorno, A.T.; Carvalho, T.M.; Santos, C.M.A.

2013-01-01

The investigation of thermal, mechanical and magnetic behaviors of the Cu-11%Al, Cu-11%Al-3%Ag, Cu-11%Al-10%Mn and Cu-11%Al-10%Mn-3%Ag alloys was made using microhardness measurements, differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersion X-ray spectroscopy and magnetic moment change with applied field measurement. The results indicated that the Mn addition changes the phase stability range, the microhardness values and makes undetectable the eutectoid reaction in annealed Cu-11%Al and Cu-11%Al-3%Ag alloys while the presence of Ag does not modify the phase transformation sequence neither microhardness values of the annealed Cu-11%Al and Cu-11%Al-10%Mn alloys, but it increases the magnetic moment of this latter at about 2.7 times and decreases the rates of eutectoid and peritectoid reactions of the former. - Highlights: ► The microstructure of Cu-Al alloy is modified in the Ag presence. ► (α + γ) phase is stabilized down to room temperature when Ag is added to Cu-Al alloy. ► Ag-rich phase modifies the magnetic characteristics of Cu–Al–Mn alloy.

Corrosion Inhibition Study of Al-Cu-Ni Alloy in Simulated Sea-Water ...

African Journals Online (AJOL)

A study on the inhibition of Al-Cu-Ni alloy in simulated sea-water environment was investigated using Sodium Chromate as inhibitor. The inhibitor concentration was varied as control, 0.25, 0.5, 1.0, 1.5 and 2.0 Molar. Al-Cu-Ni alloy was sand cast into cylindrical bars of 20 mm x 300 mm dimension. The corrosion of the ...

Effect of tellurium on machinability and mechanical property of CuAlMnZn shape memory alloy

International Nuclear Information System (INIS)

Liu Na; Li Zhou; Xu Genying; Feng Ze; Gong Shu; Zhu Lilong; Liang Shuquan

2011-01-01

Highlights: → A novel free-machining Cu-7.5Al-9.7Mn-3.4Zn-0.3Te (wt.%) shape memory alloy has been developed. → The size of dispersed particles with richer Te is 2-5 μm. → The CuAlMnZnTe alloy has good machinability which approached that of BZn15-24-1.5 due to the addition of Te. → Its shape memory property keeps the same as that of CuAlMnZn alloy with free Te. → The CuAlMnZn shape memory alloy with and without Te both have good ductile as annealed at 700 deg. C for 15 min. - Abstract: The microstructure transition, shape memory effect, machinability and mechanical property of the CuAlMnZn alloy with and without Te have been studied using X-ray diffraction analysis, chips observation and scanning electron microscopy (SEM), tensile strength test and differential scanning calorimeter (DSC), and semi-quantitative shape memory effect (SME) test. The particles with richer Te dispersedly distributed in grain interior and boundary with size of 2-5 μm. After the addition of Te, the CuAlMnZnTe alloy machinability has been effectively increased to approach that of BZn15-24-1.5 and its shape memory property remains the same as the one of CuAlMnZn alloy. The CuAlMnZn shape memory alloys with and without Te both have good ductility as annealed at 700 deg. C for 15 min.

Solidification analysis of a centrifugal atomizer using the Al-32.7wt.% Cu alloy

Energy Technology Data Exchange (ETDEWEB)

Osborne, Matthew G. [Iowa State Univ., Ames, IA (United States)

1998-02-23

A centrifugal atomizer (spinning disk variety) was designed and constructed for the production of spherical metal powders, 100-1,000 microns in diameter in an inert atmosphere. Initial atomization experiments revealed the need for a better understanding of how the liquid metal was atomized and how the liquid droplets solidified. To investigate particle atomization, Ag was atomized in air and the process recorded on high-speed film. To investigate particle solidification, Al-32.7 wt.% Cu was atomized under inert atmosphere and the subsequent particles were examined microscopically to determine solidification structure and rate. This dissertation details the experimental procedures used in producing the Al-Cu eutectic alloy particles, examination of the particle microstructures, and determination of the solidification characteristics (e.g., solidification rate) of various phases. Finally, correlations are proposed between the operation of the centrifugal atomizer and the observed solidification spacings.

Microstructures and Properties Evolution of Al-Cu-Mn Alloy with Addition of Vanadium

Directory of Open Access Journals (Sweden)

Fansheng Meng

2016-12-01

Full Text Available The effect of the vanadium addition on the microstructure, the precipitation behavior, and the mechanical properties of the Al-5.0Cu-0.4Mn alloy has been studied. The as-cast Al-5.0Cu-0.4Mn alloy was produced by squeeze casting and the heat treatment was carried out following the standard T6 treatment. It is shown that, with the addition of V, grain refinement of aluminum occurred. During heat treatment, the addition of V accelerates the precipitation kinetics of θ′ (Al2Cu phase along the grain boundaries, and promotes the growth rate of the θ′ in the α(Al matrix. Meanwhile, the addition of V retards the precipitation of T (Al20Cu2Mn3 phase. The tensile strength of the Al-5.0Cu-0.4Mn alloy increases with the increase of V content, which can be explained by combined effects of the solid solution strengthening and precipitate strengthening. However, excessively high V addition deteriorates the mechanical properties by forming brittle coarse intermetallic phases.

Time Temperature-Precipitation Behavior in An Al-Cu-Li Alloy 2195

Science.gov (United States)

Chen, P. S.; Bhat, B. N.

1999-01-01

Al-Cu-Li alloy 2195, with its combination of good cryogenic properties, low density, and high modulus, has been selected by NASA to be the main structural alloy of the Super Light Weight Tank (SLWT) for the Space Shuttle. Alloy 2195 is strengthened by an aging treatment that precipitates a particular precipitate, labeled as T1(Al2CuLi). Other phases, such as GP zone, (theta)', (theta)", theta, (delta)', S' are also present in this alloy when artificially aged. Cryogenic strength and fracture toughness are critical to the -SLWT application, since the SLWT will house liquid oxygen and hydrogen. Motivation for the Time-Temperature-Precipitation (TTP) study at lower temperature (lower than 350 F) comes in part from a recent study by Chen, The study found that the cryogenic fracture toughness of alloy 2195 is greatly influenced by the phases present in the matrix and subgrain boundaries. Therefore, the understanding of TTP behavior can help develop a guideline to select appropriate heat treatment conditions for the desirable applications. The study of TTP behavior at higher temperature (400 to 1000 F) was prompted by the fact that the SLWT requires a welded construction. Heat conduction from the weld pool affects the microstructure in the heat-affected zone (HAZ), which leads to changes in the mechanical properties. Furthermore, the SLWT may need repair welding for more than one time and any additional thermal cycles will increase precipitate instability and promote phase transformation. As a result considerable changes in HAZ microstructure and mechanical properties are expected during the construction of the SLWT. Therefore, the TTP diagrams can serve to understand the thermal history of the alloy by analyzing the welded microstructure. In the case welding, the effects of thermal cycles on the microstructure and mechanical properties can be predicted with the aid of the TTP diagrams. The 2195 alloy (nominally Al + 4 pct Cu + 1 pct Li + 0.3 pct Ag + 0.3 pct Mg + 0

Fatigue and creep deformed microstructures of aged alloys based on Al-4% Cu-0.3% Mg

International Nuclear Information System (INIS)

Reddy, A. Somi

2008-01-01

The addition of 0.4 wt.% of silver or cadmium to the alloy Al-4% Cu-0.3% Mg which has a high Cu:Mg ratio, changes the nature, morphology and dispersion of the precipitates that forms on age hardening at medium temperatures such as 150-200 o C. Fatigue and creep tests were carried out on alloys aged to peak strength at 170 o C. The tensile properties of the alloys aged at 170 o C increased in the order Al-4% Cu, Al-4% Cu-0.3% Mg, Al-4% Cu-0.3% Mg-0.4% Cd, and Al-4% Cu-0.3% Mg-0.4% Ag. Despite differences in their microstructures and tensile properties, the fatigue performance of the alloys was relatively unaffected. Fatigue behaviour was similar in each case and the alloys showed identical fatigue limits. Major differences were observed in the creep performance of the alloys creep tested at 150 o C in the peak strength condition age hardened at 170 o C. Creep performance of the alloys increased in the order of their tensile properties. The purpose of the present work was to discuss the fatigue and creep deformed microstructure of these alloys

Effect of Recrystallization and Natural Aging on Mechanical Properties of Al-Zn-Mg-Cu-Sc Alloys

International Nuclear Information System (INIS)

Yu, Min Kyu; Hong, Soon Hyung; Kwon, Oh Yeol; Lee, Yong Yeon

2015-01-01

In this study, the recrystallization volume fraction of the Al-Zn-Mg-Cu-Sc alloy after solid solution heat treatment varied with different temperatures (445℃ - 465℃). The highest elongation of the Al-Zn-Mg-Cu-Sc alloy was obtained at 465℃. Further, the hardness and strength of the solid solution heat treated Al-Zn-Mg-Cu-Sc alloy increased at room temperature due to G.P zone precipitates. The results confirmed that we can obtain advanced mechanical properties for the Al-Zn-Mg-Cu-Sc alloy from solid solution heat treatment and natural aging.

Microstructure and corrosion resistance of Sm-containing Al-Mn-Si-Fe-Cu alloy

Directory of Open Access Journals (Sweden)

Han Yuyin

2017-12-01

Full Text Available Optimizing alloy composition is an effective way to improve physical and chemical properties of automobile heat exchanger materials.A Sm-containing Al-Mn-Si-Fe-Cu alloy was investigated through transmission electron microscopy,scanning electron microscopy,and electrochemical measurement.Experimental results indicated that main phases distributed in the alloy wereα-Al(Mn,FeSi,Al2Sm and Al10Cu7Sm2.Alloying with Sm element could refine the precipitated α-Al(Mn,FeSi phase.Polarization testing results indicated that the corrosion surfacewas mainly composed of pitting pits and corrosion products.Sea water acetic acid test(SWAAT showed that corrosion loss increased first and then slowed downwith increase of the corrosion time.

Derivative thermo analysis of the near eutectic Al-Si-Cu alloy

Directory of Open Access Journals (Sweden)

L.A. Dobrzański

2008-12-01

Full Text Available For determining of the dependence between cooling Speer, chemical composition and structure of the Al–Si–Cu aluminium cast alloy the thermo-analysis was carried out, using the UMSA device (Universal Metallurgical Simulator and Analyzer, next the optical and electron scanning microscopy was used for investigation of the structure, phase and chemical composition of the AC-AlSi7Cu3Mg grade Al cast alloy also using the EDS microanalysis as well the EBSD technique.

Density of Ni-Al Alloys in Liquid and Solid-Liquid Coexistence State Measured by a Modified Pycnometric Method

Institute of Scientific and Technical Information of China (English)

Liang FANG; Feng XIAO; Zushu LI; Zainan TAO

2004-01-01

The density of Ni-Al alloys in both liquid state and solid-liquid coexistence state was measured with a modified pycnometric method. It was found that the density of NI-Al alloys decreases with increasing temperature and Al concentration in the alloys. The molar volume of liquid Ni-Al binary alloys increases with the increase of temperature and Al concentration. The partial molar volume of Al in NI-Al binary alloy was calculated approximately. The molar volume of liquid NI-Al alloy determined in the present work shows a negative deviation from the ideal linear molar volume.

Search for high entropy alloys in the X-NbTaTiZr systems (X = Al, Cr, V, Sn)

Energy Technology Data Exchange (ETDEWEB)

Poletti, Marco Gabriele, E-mail: marcogabriele.poletti@unito.it [Dipartimento di Chimica, Università di Torino, Via P. Giuria 7, 10125 Torino (Italy); Fiore, Gianluca [Dipartimento di Chimica, Università di Torino, Via P. Giuria 7, 10125 Torino (Italy); Szost, Blanka A. [Strategic and Emerging Technologies Team (TEC-TS), European Space Agency, ESTEC, 1 Keplerlaan, 2201 AZ Noordwijk (Netherlands); Battezzati, Livio [Dipartimento di Chimica, Università di Torino, Via P. Giuria 7, 10125 Torino (Italy)

2015-01-25

Highlights: • Composition of refractory high entropy alloys predicted. • Solid solutions found in VNbTaTiZr and AlNbTaTiZr. • Alloys containing Cr and Sn are multi-phased. - Abstract: High entropy alloys, i.e. solid solution phases, are sought in the X-NbTaTiZr equiatomic system where the X element was chosen as Al, Cr, V and Sn by applying recent criteria based on size and electronegativity mismatch of alloy components, number of itinerant and total valence electrons, and the temperature at which the free energy of mixing changes at the alloy composition. The alloys containing V and Al are mostly constituted by solid solutions in good agreement with prediction.

Self-forming Al oxide barrier for nanoscale Cu interconnects created by hybrid atomic layer deposition of Cu–Al alloy

Energy Technology Data Exchange (ETDEWEB)

Park, Jae-Hyung; Han, Dong-Suk; Kang, You-Jin [Division of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of); Shin, So-Ra; Park, Jong-Wan, E-mail: jwpark@hanyang.ac.kr [Division of Materials Science and Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of)

2014-01-15

The authors synthesized a Cu–Al alloy by employing alternating atomic layer deposition (ALD) surface reactions using Cu and Al precursors, respectively. By alternating between these two ALD surface chemistries, the authors fabricated ALD Cu–Al alloy. Cu was deposited using bis(1-dimethylamino-2-methyl-2-butoxy) copper as a precursor and H{sub 2} plasma, while Al was deposited using trimethylaluminum as the precursor and H{sub 2} plasma. The Al atomic percent in the Cu–Al alloy films varied from 0 to 15.6 at. %. Transmission electron microscopy revealed that a uniform Al-based interlayer self-formed at the interface after annealing. To evaluate the barrier properties of the Al-based interlayer and adhesion between the Cu–Al alloy film and SiO{sub 2} dielectric, thermal stability and peel-off adhesion tests were performed, respectively. The Al-based interlayer showed similar thermal stability and adhesion to the reference Mn-based interlayer. Our results indicate that Cu–Al alloys formed by alternating ALD are suitable seed layer materials for Cu interconnects.

Self-forming Al oxide barrier for nanoscale Cu interconnects created by hybrid atomic layer deposition of Cu–Al alloy

International Nuclear Information System (INIS)

Park, Jae-Hyung; Han, Dong-Suk; Kang, You-Jin; Shin, So-Ra; Park, Jong-Wan

2014-01-01

The authors synthesized a Cu–Al alloy by employing alternating atomic layer deposition (ALD) surface reactions using Cu and Al precursors, respectively. By alternating between these two ALD surface chemistries, the authors fabricated ALD Cu–Al alloy. Cu was deposited using bis(1-dimethylamino-2-methyl-2-butoxy) copper as a precursor and H 2 plasma, while Al was deposited using trimethylaluminum as the precursor and H 2 plasma. The Al atomic percent in the Cu–Al alloy films varied from 0 to 15.6 at. %. Transmission electron microscopy revealed that a uniform Al-based interlayer self-formed at the interface after annealing. To evaluate the barrier properties of the Al-based interlayer and adhesion between the Cu–Al alloy film and SiO 2 dielectric, thermal stability and peel-off adhesion tests were performed, respectively. The Al-based interlayer showed similar thermal stability and adhesion to the reference Mn-based interlayer. Our results indicate that Cu–Al alloys formed by alternating ALD are suitable seed layer materials for Cu interconnects

Evolution of rapidly solidified NiAlCu(B) alloy microstructure.

Science.gov (United States)

Czeppe, Tomasz; Ochin, Patrick

2006-10-01

This study concerned phase transformations observed after rapid solidification and annealing at 500, 700 and 800 degrees C in 56.3 Ni-39.9 Al-3.8 Cu-0.06 B (E1) and 59.8 Ni-36.0 Al-4.3 Cu-0.06 B (E2) alloys (composition in at.%). Injection casting led to a homogeneous structure of very small, one-phase grains (2-4 microm in size). In both alloys, the phase observed at room temperature was martensite of L1(0) structure. The process of the formation of the Ni(5)Al(3) phase by atomic reordering proceeded at 285-394 degrees C in the case of E1 alloy and 450-550 degrees C in the case of E2 alloy. Further decomposition into NiAl (beta) and Ni(3)Al (gamma') phases, the microstructure and crystallography of the phases depended on the path of transformations, proceeding in the investigated case through the transformation of martensite crystallographic variants. This preserved precise crystallographic orientation between the subsequent phases, very stable plate-like morphology and very small beta + gamma' grains after annealing at 800 degrees C.

Density and atomic volume in liquid Al-Fe and Al-Ni binary alloys

Energy Technology Data Exchange (ETDEWEB)

Plevachuk, Yu. [Ivan Franko National Univ., Lviv (Ukraine). Dept. of Metal Physics; Egry, I.; Brillo, J.; Holland-Moritz, D. [Deutsches Zentrum fuer Luft- und Raumfahrt, Koeln (Germany). Inst. fuer Raumsimulation; Kaban, I. [Chemnitz Univ. of Technolgy (Germany). Inst. of Physics

2007-02-15

The density of liquid Al-Fe and Al-Ni binary alloys have been determined over a wide temperature range by a noncontact technique combining electromagnetic levitation and optical dilatometry. The temperature and composition dependences of the density are analysed. A negative excess volume correlates with the negative enthalpy of mixing, compound forming ability and chemical short-range ordering in liquid Al-Fe and Al-Ni alloys. (orig.)

Evaluation of the microstructure of Al-Cu-Li-Ag-Mg Weldalite (tm) alloys, part 4

Science.gov (United States)

Pickens, Joseph R.; Kumar, K. S.; Brown, S. A.; Gayle, Frank W.

1991-01-01

Weldalite (trademark) 049 is an Al-Cu-Li-Ag-Mg alloy designed to have ultrahigh strength and to serve in aerospace applications. The alloy displays significantly higher strength than competitive alloys in both naturally aged and artificially aged tempers. The strengthening phases in such tempers have been identified to, in part, explain the mechanical properties attained. In general, the alloy is strengthened by delta prime Al3Li and Guinier-Preston (GP) zones in the naturally aged tempers. In artificially aged tempers in slightly underaged conditions, strengthening is provided by several phases including GP zones, theta prime Al2Cu, S prime Al2CuMg, T(sub 1) Al2CuLi, and possibly a new phase. In the peak strength artificially aged tempers, T(sub 1) is the predominant strengthening phase.

Differential Scanning Calorimetry and Thermodynamic Predictions—A Comparative Study of Al-Zn-Mg-Cu Alloys

Directory of Open Access Journals (Sweden)

Gernot K.-H. Kolb

2016-08-01

Full Text Available Al-Zn-Mg-Cu alloys are widely used in aircraft applications because of their superior mechanical properties and strength/weight ratios. Commercial Al-Zn-Mg-Cu alloys have been intensively studied over the last few decades. However, well-considered thermodynamic calculations, via the CALPHAD approach, on a variation of alloying elements can guide the fine-tuning of known alloy systems and the development of optimized heat treatments. In this study, a comparison was made of the solidus temperatures of different Al-Zn-Mg-Cu alloys determined from thermodynamic predictions and differential scanning calorimetry (DSC measurements. A variation of the main alloying elements Zn, Mg, and Cu generated 38 experimentally produced alloys. An experimental determination of the solidus temperature via DSC was carried out according to a user-defined method, because the broad melting interval present in Al-Zn-Mg-Cu alloys does not allow the use of the classical onset method for pure substances. The software algorithms implemented in FactSage®, Pandat™, and MatCalc with corresponding commercially available databases were deployed for thermodynamic predictions. Based on these investigations, the predictive power of the commercially available CALPHAD databases and software packages was critically reviewed.

Study of the ternary alloy systems Al-Ni-Fe and Al-Cu-Ru with special regard to quasicrystalline phases

International Nuclear Information System (INIS)

Lemmerz, U.

1996-07-01

Two ternary alloy-systems, the Al-Ni-Fe system and the Al-Cu-Ru system were studied with special regard to quasicrystalline phases. Isothermal sections were established in both systems in the stoichiometric area of the quasicrystalline phase. In the Al-Ni-Fe system a new stable decagonal phase was found. Its stoichiometric range is very small around Al 71.6 Ni 23.0 Fe 5.4 . The temperature range in which it is stable lies between 847 and 930 C. The decagonal phase undergoes a eutectoid reaction to the three crystalline phases Al 3 Ni 2 , Al 3 Ni and Al 13 Fe 4 at 847 C. It melts peritectically at 930 C forming Al 13 Fe 4 , Al 3 Ni 2 and a liquid. The investigations in the Al-Cu-Ru system concentrated on the phase equilibria between the icosahedral phase and its neighbouring phases in a temperature range between 600 and 1000 C. The icosahedral phase was observed in the whole temperature range. The investigated stoichiometric area extends down to Al contents of 45%, which allows the fields of existence to be determined for the ternary phases α-AlCuRu, the icosahedral phase and Al 7 Cu 2 Ru. Binary phases were determined down to the upper (high Al content) border of AlRu. No hitherto unknown phase was observed in the investigated area. Rietveld analyses were carried out on α-AlCuRu and Al 7 Cu 2 Ru showing some discrepancies from the α-AlMnSi structure taken as a base for α-AlCuRu and confirming the Al 7 Cu 2 Fe structure for Al 7 Cu 2 Ru. (orig.)

Structure and phase composition of Al-Ce-Cu system alloys in range of quasi-binary Al-Al8CeCu4 section

International Nuclear Information System (INIS)

Belov, N.A.; Khvan, A.V.

2007-01-01

The phase diagram of the Al-Cu-Ce system in the quasibinary section area of Al-Al 8 CeCu 4 has been investigated by metallographic, thermal, micro-X-ray spectral and X-ray structural analyses. The parameters of the eutectic reaction L→(Al)+CeCu 4 Al 8 : T=610 Deg C were found out; the composition was 14% Cu and 7% Ce. This eutectics is of a disperse structure and the ternary compound contained is capable of fragmentation and spheroidizing in the heating process (starting from 540 Deg C). It was demonstrated that the area of optimal (Al)+CeCu 4 Al 8 eutectics-based alloy compositions was within the narrow limits. That is related to the fact that at a comparatively little variation of the Cu:Ce=2 ratio solidus sharply decreases and, as a result, the crystallization interval considerably extends [ru

The Refining Mechanism of Super Gravity on the Solidification Structure of Al-Cu Alloys

Directory of Open Access Journals (Sweden)

Yuhou Yang

2016-12-01

Full Text Available There is far less study of the refining effect of super gravity fields on solidification structures of metals than of the effects of electrical currents, magnetic and ultrasonic fields. Moreover, the refining mechanisms of super gravity are far from clear. This study applied a super gravity field to Al-Cu alloys to investigate its effect on refining their structures and the mechanism of interaction. The experimental results showed that the solidification structure of Al-Cu alloys can be greatly refined by a super gravity field. The major refining effect was mainly achieved when super gravity was applied at the initial solidification stage; only slight refinement could be obtained towards the end of solidification. No refinement was obtained by the super gravity treatment on pure liquid or solid stages. The effectiveness of super gravity results from its promoting the multiplication of crystal nuclei, which we call “Heavy Crystal Rain”, thereby greatly strengthening the migration of crystal nuclei within the alloy. Increasing the solute Cu content can increase nucleation density and restrict the growth of crystals, which further increases the refining effect of super gravity. Within this paper, we also discuss the motile behavior of crystals in a field of super gravity.

Grain refinement of Al-Si9.8-Cu3.4 alloy by novel Al-3.5FeNb-1.5C master alloy and its effect on mechanical properties

Science.gov (United States)

Apparao, K. Ch; Birru, Anil Kumar

2018-01-01

A novel Al-3.5FeNb-1.5C master alloy with uniform microstructure was prepared using a melt reaction process for this study. In the master alloy, basic intermetallic particles such as NbAl3, NbC act as heterogeneous nucleation substrates during the solidification of aluminium. The grain refining performance of the novel master alloy on Al-Si9.8-Cu3.4 alloy has also been investigated. It is observed that the addition of 0.1 wt.% of Al-3.5FeNb-1.5C master alloy can induce very effective grain refinement of the Al-Si9.8-Cu3.4 alloy. The average grain size of α-Al is reduced to 22.90 μm from about 61.22 μm and most importantly, the inoculation of Al-Si9.8-Cu3.4 alloy with FeNb-C is not characterised by any visible poisoning effect, which is the drawback of using commercial Al-Ti-B master alloys on aluminium cast alloys. Therefore, the mechanical properties of the Al-Si9.8-Cu3.4 alloy have been improved obviously by the addition of the 0.1 wt.% of Al-3.5FeNb-1.5C master alloy, including the yield strength and elongation.

The physical metallurgy of mechanically-alloyed, dispersion-strengthened Al-Li-Mg and Al-Li-Cu alloys

Science.gov (United States)

Gilman, P. S.

1984-01-01

Powder processing of Al-Li-Mg and Al-Li-Cu alloys by mechanical alloying (MA) is described, with a discussion of physical and mechanical properties of early experimental alloys of these compositions. The experimental samples were mechanically alloyed in a Szegvari attritor, extruded at 343 and 427 C, and some were solution-treated at 520 and 566 C and naturally, as well as artificially, aged at 170, 190, and 210 C for times of up to 1000 hours. All alloys exhibited maximum hardness after being aged at 170 C; lower hardness corresponds to the solution treatment at 566 C than to that at 520 C. A comparison with ingot metallurgy alloys of the same composition shows the MA material to be stronger and more ductile. It is also noted that properly aged MA alloys can develop a better combination of yield strength and notched toughness at lower alloying levels.

High strength and utilizable ductility of bulk ultrafine-grained Cu-Al alloys

Science.gov (United States)

An, X. H.; Han, W. Z.; Huang, C. X.; Zhang, P.; Yang, G.; Wu, S. D.; Zhang, Z. F.

2008-05-01

Lack of plasticity is the main drawback for nearly all ultrafine-grained (UFG) materials, which restricts their practical applications. Bulk UFG Cu-Al alloys have been fabricated by using equal channel angular pressing technique. Its ductility was improved to exceed the criteria for structural utility while maintaining a high strength by designing the microstructure via alloying. Factors resulting in the simultaneously enhanced strength and ductility of UFG Cu-Al alloys are the formation of deformation twins and their extensive intersections facilitating accumulation of dislocations.

Pitting corrosion of Al and Al-Cu alloys by ClO4- ions in neutral sulphate solutions

International Nuclear Information System (INIS)

Amin, Mohammed A.; Abd El Rehim, Sayed S.; Moussa, S.O.; Ellithy, Abdallah S.

2008-01-01

The influence of various concentrations of NaClO 4 , as a pitting corrosion agent, on the corrosion behaviour of pure Al, and two Al-Cu alloys, namely (Al + 2.5 wt% Cu) and (Al + 7 wt% Cu) alloys in 1.0 M Na 2 SO 4 solution was investigated by potentiodynamic polarization and potentiostatic techniques at 25 deg. C. Measurements were conducted under the influence of various experimental conditions, complemented by ex situ energy dispersive X-ray (EDX) and scanning electron microscopy (SEM) examinations of the electrode surface. In free perchlorate sulphate solutions, for the three Al samples, the anodic polarization exhibits an active/passive transition. The active dissolution region involves an anodic peak (peak A) which is assigned to the formation of Al 2 O 3 passive film on the electrode surface. The passive region extends up to 1500 mV with almost constant current density (j pass ) without exhibiting a critical breakdown potential or showing any evidence of pitting attack. For the three Al samples, addition of ClO 4 - ions to the sulphate solution stimulates their active anodic dissolution and tends to induce pitting corrosion within the oxide passive region. Pitting corrosion was confirmed by SEM examination of the electrode surface. The pitting potential decreases with increasing ClO 4 - ion concentration indicating a decrease in pitting corrosion resistance. The susceptibility of the three Al samples towards pitting corrosion decreases in the order: Al > (Al + 2.5 wt% Cu) alloy > (Al + 7 wt% Cu) alloy. Potentiostatic measurements showed that the rate of pitting initiation increases with increasing ClO 4 - ion concentration and applied step anodic potential, while it decreases with increasing %Cu in the Al samples. The inhibitive effect of SO 4 2- ions was also discussed

Band structure of the quaternary Heusler alloys ScMnFeSn and ScFeCoAl

Science.gov (United States)

Shanthi, N.; Teja, Y. N.; Shaji, Shephine M.; Hosamani, Shashikala; Divya, H. S.

2018-04-01

In our quest for materials with specific applications, a theoretical study plays an important role in predicting the properties of compounds. Heusler alloys or compounds are the most studied in this context. More recently, a lot of quaternary Heusler compounds are investigated for potential applications in fields like Spintronics. We report here our preliminary study of the alloys ScMnFeSn and ScFeCoAl, using the ab-initio linear muffin-tin orbital method within the atomic sphere approximation (LMTO-ASA). The alloy ScMnFeSn shows perfect half-metallicity, namely, one of the spins shows a metallic behaviour and the other spin shows semi-conducting behaviour. Such materials find application in devices such as the spin-transfer torque random access memory (STT-MRAM). In addition, the alloy ScMnFeSn is found to have an integral magnetic moment of 4 µB, as predicted by the Slater-Pauling rule. The alloy ScFeCoAl does not show half-metallicity.

Corrosion Inhibition Study of Al-Cu-Ni Alloy in Simulated Sea-Water ...

African Journals Online (AJOL)

Akorede

ABSTRACT: A study on the inhibition of Al-Cu-Ni alloy in simulated ... which the percentage of Copper, and Nickel were kept .... proceed based on equation of reaction in eqn (4). Al .... Sodium-Modified A356.0-Type Al-Si-Mg Alloy in Simulated.

Solid solution in Al-4.5 wt% Cu produced by mechanical alloying

International Nuclear Information System (INIS)

Fogagnolo, J.B.; Amador, D.; Ruiz-Navas, E.M.; Torralba, J.M.

2006-01-01

Mechanical alloying has been used to produce oxide dispersion strengthened alloys, intermetallic compounds, aluminium alloys and to obtain nanostructured and amorphous materials, as well as to extend the solid solution limit. In this work, Al and Cu elemental powders were subjected to high-energy milling to produce Al-4.5 wt% Cu powder alloy. The powders obtained were characterized by scanning electron microscopy, X-ray diffraction (XRD) and differential scanning calorimetry (DSC), aiming to explore if the copper is present in solid solution or as small particles after high-energy milling. Related to the formation of a supersaturated solid solution, the results of scanning electron microscopy and X-ray diffraction are non-conclusive: the copper could be dispersed with a very small size, undetectable to both techniques. The Al 2 Cu precipitation at temperatures between 160 and 230 deg. C, verified by DSC and XRD analyses, substantiated that mechanical alloying had produced a supersaturated solid solution of copper in aluminium. The crystallite size as a function of milling time and annealing temperature was also determined by X-ray techniques

Alloying of Yb-Cu and Yb-Ag utilizing liquid ammonia metal solutions of ytterbium

International Nuclear Information System (INIS)

Imamura, H.; Yoshimura, T.; Sakata, Y.

2003-01-01

In the course of the studies on preparation of novel compounds using the dissolution of Eu or Yb metals in liquid ammonia, the formation of Yb-Cu and Yb-Ag intermetallic films has been found. When Cu or Ag metal powders were placed in a reactor containing a solution of Yb metal in liquid ammonia, the dissolved Yb readily react with the Cu or Ag metal particles to form surface alloy compounds. X-ray diffraction of Yb-Cu showed that upon thermal treatment above 673 K, the Yb metal deposited on the Cu particles reacted together to be transformed into the YbCu 6.5 intermetallic compound. A characteristic endothermic peak at 749 K, due to alloying of Yb-Cu, was observed by the differential scanning calorimeter measurements. By use of the high reactivity of liquid ammonia metal solutions of ytterbium, it was found that the ytterbium intermetallic films were readily formed under mild conditions. Yb-Cu and Yb-Ag exhibited enhanced catalytic activity for the hydrogenation of ethene as a result of alloying

Thermodynamic properties of liquid copper-indium-tin alloys determined from e.m.f. measurements

International Nuclear Information System (INIS)

Jendrzejczyk-Handzlik, Dominika; Gierlotka, Wojciech; Fitzner, Krzysztof

2009-01-01

The thermodynamics properties of liquid Cu-In-Sn alloys were determined using solid oxide galvanic cells with zirconia electrolyte: (I)Re+kanthal,Cu x -In y -Sn (1-x-y) ,'In 2 O 3 '//ZrO 2 +(Y 2 O 3 )//NiO,Ni,Pt in the temperature range (973 to 1223) K. Applied In 2 O 3 can be either pure or in the solid solutions with SnO 2 . Thermodynamics properties of the liquid phase were described by the Redlich-Kister-Muggianu formula. Using the commercial software different phase relations in the ternary system were calculated and compared with experimental data found in the literature

Construction and evaluation of multi-component Zn-Al based bearing alloys (Zn-Al-Si, Zn-Al-Cu)

International Nuclear Information System (INIS)

Shahmiri, M.; Shahin, K.

2001-01-01

Zn-Al based alloys, with excellent mechanical properties, are finding increasing applications in various industries, especially bearing and bushing fields. Observed dimensional instabilities, in their multicomponent systems, (e. g. Zn-Al-Si and, Zn-Al Si-Cu), is believed to be as the result of some kinds of phase transformation, due to the temperature variations, while in service. Profound understanding of the phase transformations due to the temperature variation, requires detailed evaluations of the isothermal sections of the multi-components phase diagrams of Zn-Al-Si and, Zn-Al-Si-Cu alloy systems. In the present article, the isothermal sections of the aforementioned ternary and quaternary systems in the solid state regions have been investigated and observed phase transitions have been critically evaluated

Thermomechanical Treatments on High Strength Al-Zn-Mg(-Cu) Alloys

National Research Council Canada - National Science Library

Di Russo, E; Conserva, M; Gatto, F

1974-01-01

An investigation was carried out to determine the metallurgical properties of Al-Zn-Mg and Al-Zn-Mg-Cu alloy products processed according to newly developed Final Thermomechanical Treatments (FTMT) of T-AHA type...

Influence of Mn on the tensile properties of SSM-HPDC Al-Cu-Mg-Ag alloy A201

CSIR Research Space (South Africa)

Müller, H

2011-03-01

Full Text Available A201 aluminium alloy is a high strength casting alloy with a nominal composition of Al-4.6Cu-0.3Mg-0.6Ag. It is strengthened by the O(Al2Cu) phase and the ’(Al2Cu) phase during heat treatment. Further strengthening of this alloy system can...

Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

Science.gov (United States)

Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

2018-03-01

The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

Effects of Alloying Elements on Room and High Temperature Tensile Properties of Al-Si Cu-Mg Base Alloys =

Science.gov (United States)

Alyaldin, Loay

In recent years, aluminum and aluminum alloys have been widely used in automotive and aerospace industries. Among the most commonly used cast aluminum alloys are those belonging to the Al-Si system. Due to their mechanical properties, light weight, excellent castability and corrosion resistance, these alloys are primarily used in engineering and in automotive applications. The more aluminum is used in the production of a vehicle, the less the weight of the vehicle, and the less fuel it consumes, thereby reducing the amount of harmful emissions into the atmosphere. The principal alloying elements in Al-Si alloys, in addition to silicon, are magnesium and copper which, through the formation of Al2Cu and Mg2Si precipitates, improve the alloy strength via precipitation hardening following heat treatment. However, most Al-Si alloys are not suitable for high temperature applications because their tensile and fatigue strengths are not as high as desired in the temperature range 230-350°C, which are the temperatures that are often attained in automotive engine components under actual service conditions. The main challenge lies in the fact that the strength of heat-treatable cast aluminum alloys decreases at temperatures above 200°C. The strength of alloys under high temperature conditions is improved by obtaining a microstructure containing thermally stable and coarsening-resistant intermetallics, which may be achieved with the addition of Ni. Zr and Sc. Nickel leads to the formation of nickel aluminide Al3Ni and Al 9FeNi in the presence of iron, while zirconium forms Al3Zr. These intermetallics improve the high temperature strength of Al-Si alloys. Some interesting improvements have been achieved by modifying the composition of the base alloy with additions of Mn, resulting in an increase in strength and ductility at both room and high temperatures. Al-Si-Cu-Mg alloys such as the 354 (Al-9wt%Si-1.8wt%Cu-0.5wt%Mg) alloys show a greater response to heat treatment as a

Enthalpy of mixing of liquid Cu-Fe-Hf alloys at 1873 K

Energy Technology Data Exchange (ETDEWEB)

Agraval, Pavel; Turchanin, Mikhail [Donbass State Engineering Academy, Kramatorsk (Ukraine). Metallurgical Dept.; Dreval, Liya [Donbass State Engineering Academy, Kramatorsk (Ukraine). Metallurgical Dept.; Materials Science International Services GmbH (MSI), Stuttgart (Germany)

2016-12-15

In the ternary Cu-Fe-Hf system, the mixing enthalpies of liquid alloys were investigated at 1873 K using a high-temperature isoperibolic calorimeter. The experiments were performed along the sections x{sub Cu}/x{sub Fe} = 3/1, 1/1 at x{sub Hf} = 0-0.47 and along the section x{sub Cu}/x{sub Fe} = 1/3 at x{sub Hf} = 0-0.13. The limiting partial enthalpies of mixing of undercooled liquid hafnium in liquid Cu-Fe alloys, Δ{sub mix} anti H{sub Hf}{sup ∞}, are (-122 ± 9) kJ mol{sup -1} (section x{sub Cu}/x{sub Fe} = 3/1), (-106 ± 9) kJ mol{sup -1} (section x{sub Cu}/x{sub Fe} = 1/1), and (-105 ± 2) kJ mol{sup -1} (section x{sub Cu}/x{sub Fe} = 1/3). In the investigated composition range, the integral mixing enthalpies are sign-changing. For the integral mixing enthalpy, an analytical expression was obtained by the least squares fit of the experimental results using the Redlich-Kister-Muggianu polynomial.

Lattice parameter values and phase transitions for the Cu{sub 2}Cd{sub 1-z}Mn{sub z}SnSe{sub 4} and Cu{sub 2}Cd{sub 1-z}Fe{sub z}SnSe{sub 4} alloys

Energy Technology Data Exchange (ETDEWEB)

Moreno, E. [Centro de Estudios de Semiconductores, Departamento de Fisica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Quintero, M., E-mail: mquinter@ula.v [Centro de Estudios de Semiconductores, Departamento de Fisica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Morocoima, M.; Quintero, E.; Grima, P.; Tovar, R.; Bocaranda, P. [Centro de Estudios de Semiconductores, Departamento de Fisica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Delgado, G.E.; Contreras, J.E. [Laboratorio de Cristalografia, Departamento de Quimica, Facultad de Ciencias, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Mora, A.E.; Briceno, J.M.; Avila Godoy, R.; Fernandez, J.L. [Laboratorio de Analisis Quimico y Estructural de Materiales, Departamento de Fisica, Universidad de Los Andes, Merida 5101 (Venezuela, Bolivarian Republic of); Henao, J.A.; Macias, M.A. [Grupo de Investigacion en Quimica Estructural (GIQUE), Facultad de Ciencias, Escuela de Quimica, Universidad Industrial de Santander, Apartado aereo 678, Bucaramanga (Colombia)

2009-11-03

X-ray powder diffraction measurements and differential thermal analysis (DTA) were made on polycrystalline samples of the Cu{sub 2}Cd{sub 1-z}Mn{sub z}SnSe{sub 4} and Cu{sub 2}Cd{sub 1-z}Fe{sub z}SnSe{sub 4} alloy systems. The diffraction patterns were used to show the equilibrium conditions and to derive lattice parameter values. For Cu{sub 2}Cd{sub 0.8}Fe{sub 0.2}SnSe{sub 4} as well as for Cu{sub 2}Cd{sub 0.2}Fe{sub 0.8}SnSe{sub 4} the crystal structures were refined using the Rietveld method. It was found that the internal distortion parameter sigma decreases as Cd is replaced by either Mn and/or Fe. For the Cu{sub 2}Cd{sub 1-z}Mn{sub z}SnSe{sub 4} and Cu{sub 2}Cd{sub 1-z}Fe{sub z}SnSe{sub 4} alloy systems, only two single solid phase fields, the tetragonal stannite alpha(I4-bar2m) and the wurtz-stannite delta (Pmn2{sub 1}) structures were found to occur in the diagram. In addition to the tetragonal stannite alpha phase extra X-ray diffraction lines due to MnSe and/or FeSe{sub 2} were observed for as grown samples in the range 0.7 < z < 1.0. However, it was found that the amount of the extra phase decreased for the compressed samples.

Newly developed EMF cell with zirconia solid electrolyte for measurement of low oxygen potentials in liquid Cu-Cr and Cu-Zr alloys

Directory of Open Access Journals (Sweden)

Katayama I.

2012-01-01

Full Text Available In order to measure the very low oxygen potential by use of stabilized zirconia solid electrolyte emf method, a new cell construction was devised. The idea was based on Janke but a zirconia rod was used instead of the zirconia crucible which contacts liquid alloy electrode. The cell was used for determination of the oxygen potentials in liquid dilute Cu-Cr and Cu-Zr alloys. The reference electrode was Cr,Cr2O3. Emf measurements were performed in the temperature range of 1400-1580K and composition range of 0.198-3.10at%Cr-Cu alloys, and 1380-1465K, 0.085-0.761at%Zr-Cu alloys. The composition of liquid alloys were determined by picking up from the liquid alloys and ICP analysis. By use of the newly devised cell construction in this study, stable emf values were obtained at each temperature and alloy composition. Emf values were corrected by using the parameter for electronic contribution of the YSZ. Activity of Cr obeys Henry’s law and activity coefficient at infinitely dilute alloys of Cr in Cu-Cr alloys are: lng0 Cr =(3.80 at 1423K, (3.57 at 1473K, (3.38 at 1523K and (3.20 at 1573K. At 1423 K activity coefficient of Zr at infinitely diluted alloy is lnγo Zr = -4.0.

Investigation of Microstructure in Solid State Welded Al-Cu-Li alloy

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No Kookil

2016-01-01

Full Text Available Al-Li alloys have been extensively used in aerospace vehicle structure since the presence of lithium increases the modulus and reduce the density of the alloy. Especially the third generation Al-Cu-Li alloy shows enhanced fracture toughness at cryogenic temperatures so that the alloy has been used on the fuel tank of space launchers, like Super Lightweight External Tank of the Space Shuttle. Since the commercial size of the plate cannot accommodate the large tank size of the launcher, joining several pieces is required. However, lithium is highly reactive and its compounds can decompose with heat from conventional fusion welding and form different types of gases which result in formation of defects. In this study, the microstructure change is investigated after solid state welding process to join the Al-Cu-Li sheets with optical and transmission electron microscopic analysis of precipitates.

Similar and dissimilar friction welding of Zr-Cu-Al bulk glassy alloys

International Nuclear Information System (INIS)

Shin, Hyung-Seop; Park, Jung-Soo; Jung, Yoon-Chul; Ahn, Jung-Ho; Yokoyama, Yoshihiko; Inoue, Akihisa

2009-01-01

The friction welding of three kinds of Zr-Cu-Al bulk glassy alloys (BGAs) which show eutectic or hypoeutectic compositions to similar and dissimilar BGAs and crystalline metals has been tried. The shape and volume of the protrusion formed at the weld interface were investigated. In order to characterize the friction welded interface, micrographic observation and X-ray diffraction analysis on the weld cross-section were carried out. A successful joining of Zr-Cu-Al bulk glassy alloys to similar and dissimilar BGAs was achieved without occurrence of crystallizations at the weld interface through the precise control of friction conditions. In addition, the joining of Zr 50 Cu 40 Al 10 BGA to crystalline alloys was tried, but it was only successful for specific material combinations. The residual strength after welding of dissimilar BGAs was evaluated by the four-point bending test.

Grain Refinement of Al-Si-Fe-Cu-Zn-Mn Based Alloy by Al-Ti-B Alloy and Its Effect on Mechanical Properties.

Science.gov (United States)

Yoo, Hyo-Sang; Kim, Yong-Ho; Jung, Chang-Gi; Lee, Sang-Chan; Lee, Seong-Hee; Son, Hyeon-Taek

2018-03-01

We investigated the effects of Al-5.0wt%Ti-1.0wt%B addition on the microstructure and mechanical properties of the as-extruded Al-0.15wt%Si-0.2wt%Fe-0.3wt%Cu-0.15wt%Zn-0.9wt%Mn based alloys. The Aluminum alloy melt was held at 800 °C and then poured into a mould at 200 °C. Aluminum alloys were hot-extruded into a rod that was 12 mm in thickness with a reduction ratio of 38:1. AlTiB addition to Al-0.15Si-0.2Fe-0.3Cu-0.15Zn-0.9Mn based alloys resulted in the formation of Al3Ti and TiB2 intermetallic compounds and grain refinement. With increasing of addition AlTiB, ultimate tensile strength increased from 93.38 to 99.02 to 100.01 MPa. The tensile strength of the as-extruded alloys was improved due to the formation of intermetallic compounds and grain refinement.

Tem Observation Of Precipitate Structures In Al-Zn-Mg Alloys With Additions Of Cu/Ag

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Watanabe K.

2015-06-01

Full Text Available Al-Zn-Mg alloy has been known as one of the aluminum alloys with the good age-hardening ability and the high strength among commercial aluminum alloys. The mechanical property of the limited ductility, however, is required to further improvement. In this work, three alloys, which were added Cu or Ag into the Al-Zn-Mg alloy, were prepared to compare the effect of the additional elements on the aging behavior. The content of Ag and Cu were 0.2at.% and the same as, respectively. Ag or Cu added alloy showed higher maximum hardness than base alloy. The particle shape and rod shape precipitates were observed in all alloys peak-aged at 423K. According to addition of Ag or Cu, the number density of the precipitates increased higher than that of base alloy.

Low Cycle Mechanical and Fatigue Properties of AlZnMgCu Alloy

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Pysz S.

2016-03-01

Full Text Available The article presents the analysis of properties of the high-strength AlZnMgCu (abbr AlZn aluminium alloy and estimates possibilities of its application for responsible structures with reduced weight as an alternative to iron alloy castings. The aim of the conducted studies was to develop and select the best heat treatment regime for a 7xx casting alloy based on high-strength materials for plastic working from the 7xxx series. For analysis, wrought AlZnMgCu alloy (7075 was selected. Its potential of the estimated as-cast mechanical properties indicates a broad spectrum of possible applications for automotive parts and in the armaments industry. The resulting tensile and fatigue properties support the thesis adopted, while the design works further confirm these assumptions.

Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

Directory of Open Access Journals (Sweden)

Hwang Jun Ho

2017-06-01

Full Text Available Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.

The roles of Al{sub 2}Cu and of dendritic refinement on surface corrosion resistance of hypoeutectic Al-Cu alloys immersed in H{sub 2}SO{sub 4}

Energy Technology Data Exchange (ETDEWEB)

Osorio, Wislei R. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Spinelli, Jose E. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Freire, Celia M.A. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Cardona, Margarita B. [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil); Garcia, Amauri [Department of Materials Engineering, State University of Campinas, UNICAMP, P.O. Box 6122, 13083-970 Campinas, SP (Brazil)]. E-mail: amaurig@fem.unicamp.br

2007-09-27

Al-Cu alloys castings can exhibit different corrosion responses at different locations due to copper content and to the resulting differences on microstructural features and on Al{sub 2}Cu fractions. The aim of this study was to investigate the influence of Al{sub 2}Cu intermetallic particles associated to the dendritic arm spacings on the general corrosion resistance of three different hypoeutectic Al-Cu alloys samples in sulfuric acid solution. The cast samples were produced using a non-consumable tungsten electrode furnace with a water-cooled copper hearth under argon atmosphere. The typical microstructural pattern was examined by using electronic microscopy techniques. In order to evaluate the surface corrosion behavior of such Al-Cu alloys, corrosion tests were performed in a 0.5 M sulfuric acid solution at 25 deg. C by using an electrochemical impedance spectroscopy (EIS) technique and potentiodynamic polarization curves. An equivalent circuit was also used to provide quantitative support for the discussions and understanding of the corrosion behavior. It was found that Al{sub 2}Cu has a less noble corrosion potential than that of the Al-rich phase. Despite that, dendrite fineness has proved to be more influent on corrosion resistance than the increase on alloy copper content with the consequent increase on Al{sub 2}Cu fraction.

Effect Of SiC Particles On Sinterability Of Al-Zn-Mg-Cu P/M Alloy

Directory of Open Access Journals (Sweden)

Rudianto H.

2015-06-01

Full Text Available Premix Al-5.5Zn-2.5Mg-0.5Cu alloy powder was analyzed as matrix in this research. Gas atomized powder Al-9Si with 20% volume fraction of SiC particles was used as reinforcement and added into the alloy with varied concentration. Mix powders were compacted by dual action press with compaction pressure of 700 MPa. High volume fraction of SiC particles gave lower green density due to resistance of SiC particles to plastic deformation during compaction process and resulted voids between particles and this might reduce sinterability of this mix powder. Sintering was carried out under ultra high purity nitrogen gas from 565°-580°C for 1 hour. High content of premix Al-5.5Zn-2.5Mg-0.5Cu alloy powder gave better sintering density and reached up to 98% relative. Void between particles, oxide layer on aluminum powder and lower wettability between matrix and reinforcement particles lead to uncompleted liquid phase sintering, and resulted on lower sintering density and mechanical properties on powder with high content of SiC particles. Mix powder with wt90% of Alumix 431D and wt10% of Al-9Si-vf20SiC powder gave higher tensile strength compare to another mix powder for 270 MPa. From chemical compositions, sintering precipitates might form after sintering such as MgZn2, CuAl2 and Mg2Si. X-ray diffraction, DSC-TGA, and SEM were used to characterize these materials.

Internal friction in Al alloys after neutron irradiation at low temperature

International Nuclear Information System (INIS)

Takamura, S.; Kobiyama, M.

1985-01-01

Internal friction and elastic modulus of dilute Al alloys have been measured after fast neutron irradiation at about 5 K. The internal friction spectra in Al-Pb, Al-Si, Al-Zn, Al-Ag, Al-Sn and Al-In are very similar. This result suggests that the configuration of the interstitial-solute atom complex in these alloys is very similar. In Al-Mg, the main complexes have the configuration with nearly symmetry, but its internal friction spectrum is different from that of the above-mentioned alloys. The internal friction spectra and their annealing behavior in Al-Be, Al-Mn, Al-Fe and Al-Cu demonstrate that the configuration of their interstitial-solute atom complex seems to be different from each other and the main complex in these alloys is immobile until stage III. (author)

L10 ordered structures in Al-Cu-(Mg alloys at the early stages of elevated temperature aging

Directory of Open Access Journals (Sweden)

Fuzhong, Xia

2016-09-01

Full Text Available This study concerns the precipitation structures of Al-3Cu and Al-3Cu-1.78Mg (wt. % alloys at the early stages of elevated temperature aging. The Al-3Cu and Al-3Cu-1.78 Mg alloys were solution treated at 540 °C and 500 °C for 2 h, respectively, and then aged at 190 °C for 2 min. The precipitation structures in aged Al-3Cu-(1.78Mg alloys were characterized by Transmission Electron Microscopy (TEM and High Resolution Transmission Electron Microscopy (HTREM. 001 zone axis Selected area electron diffraction patterns indicate that L10 ordered structures are formed in the two aged alloys. HRTEM experiments reveal the partial dislocations on the interfaces of L10 ordered structures. From comparing experimental results with that in the literature, it is concluded that the L10 ordered structures in aged Al-3Cu alloy consist of Al and Cu atoms, and they are comprised by Al, Cu and Mg atoms together in the aged Al-3Cu-1.78Mg alloy. On the basis of precipitate growing thermodynamics, it is thought the L10 ordered structures act as nuclei for GP zones in Al-Cu-(Mg alloys during aging.En este trabajo se estudian las estructuras de precipitación en Al-3Cu y Al-3Cu-1,78Mg (% en peso en los estados iniciales de envejecimiento a temperatura elevada. Las aleaciones Al-3Cu y Al-3Cu-1.78 Mg fueron sometidas a un tratamiento térmico de solución de 2 h a 540 °C y 500 °C, respectivamente, y posteriormente envejecidas 2 min a 190 °C. Las estructuras de precipitación en Al-3Cu-(1.78Mg envejecido fueron caracterizadas por microscopía electrónica de transmisión (TEM y por microscopía electrónica de transmisión de alta resolución (HTREM. Los diagramas de difracción de electrones de área seleccionada indican que se forman estructuras ordenadas L10 en las dos aleaciones envejecidas. Experimentos de HRTEM revelan la presencia de dislocaciones parciales en las intercaras de las estructuras L10 ordenadas. Comparando estos resultados experimentales con la

Corrosion behavior of cast Ti-6Al-4V alloyed with Cu.

Science.gov (United States)

Koike, Marie; Cai, Zhuo; Oda, Yutaka; Hattori, Masayuki; Fujii, Hiroyuki; Okabe, Toru

2005-05-01

It has recently been found that alloying with copper improved the inherently poor grindability and wear resistance of titanium. This study characterized the corrosion behavior of cast Ti-6Al-4V alloyed with copper. Alloys (0.9 or 3.5 mass % Cu) were cast with the use of a magnesia-based investment in a centrifugal casting machine. Three specimen surfaces were tested: ground, sandblasted, and as cast. Commercially pure titanium and Ti-6Al-4V served as controls. Open-circuit potential measurement, linear polarization, and potentiodynamic cathodic polarization were performed in aerated (air + 10% CO(2)) modified Tani-Zucchi synthetic saliva at 37 degrees C. Potentiodynamic anodic polarization was conducted in the same medium deaerated by N(2) + 10% CO(2). Polarization resistance (R(p)), Tafel slopes, and corrosion current density (I(corr)) were determined. A passive region occurred for the alloy specimens with ground and sandblasted surfaces, as for CP Ti. However, no passivation was observed on the as-cast alloys or on CP Ti. There were significant differences among all metals tested for R(p) and I(corr) and significantly higher R(p) and lower I(corr) values for CP Ti compared to Ti-6Al-4V or the alloys with Cu. Alloying up to 3.5 mass % Cu to Ti-6Al-4V did not change the corrosion behavior. Specimens with ground or sandblasted surfaces were superior to specimens with as-cast surfaces. (c) 2005 Wiley Periodicals, Inc.

Gibbsian and radiation-induced segregation in Cu--Li and Al--Li alloys

International Nuclear Information System (INIS)

Gruen, D.M.; Krauss, A.R.; Susman, S.; Venugopalan, M.; Ron, M.

1983-01-01

Previous experiments on segregation in dilute alloys of lithium in aluminum have demonstrated rapid enrichment of lithium in the uppermost monolayer, as well as a slower buildup in the subsurface region as a result of radiation-induced segregation effects during sputtering. Surface and subsurface enrichment of lithium in copper and aluminum alloys has been observed by secondary ion mass spectroscopy (SIMS), Auger electron spectroscopy (AES), and x-ray photoemission spectroscopy (XPS). The activation energies for lithium diffusion in Cu and Al have been measured and segregation kinetics are compared for dilute alloys of Li in Cu and Al, and a high lithium content copper alloy. The results are interpreted in terms of both Gibbsian and radiation-induced segregation effects

Recovery of the mechanical properties on the Al-4wt%Cu alloy

International Nuclear Information System (INIS)

Chemingui, M; Kassis, K; Khitouni, M; Masmoudi, J; Kolsi, A W

2010-01-01

The recovery of the mechanical properties on the Al-4%wtCu alloy was investigated by indentation after cold rolling. The microstructural evolution was performed using optical and scanning electron microscopies. The annealing at 200 deg. C of the quenched and rolled alloy gives higher mechanical qualities. At temperatures up to 200 deg. C, the alloy has no softening by recovery, but on the contrary a hardening behaviour was observed. This later is attributed to the presence of the intermediate θ'' and θ' phases. Nevertheless, the ageing in high temperature product the coalescence of iron particles and of Al 2 Cu precipitates. These phases are essentially localized in the grain boundaries, which caused the damage of the alloy.

Creep behaviour of a casting titanium carbide reinforced AlSi12CuNiMg piston alloy at elevated temperatures; Hochtemperaturkriechverhalten der schmelzmetallurgisch hergestellten dispersionsverstaerkten Kolbenlegierung AlSi12CuNiMg

Energy Technology Data Exchange (ETDEWEB)

Michel, S.; Scholz, A. [Zentrum fuer Konstruktionswerkstoffe, TU Darmstadt (Germany); Tonn, B. [Institut fuer Metallurgie, TU Clausthal (Germany); Zak, H.

2012-03-15

This paper deals with the creep behaviour of the titanium carbide reinforced AlSi12CuNiMg piston alloy at 350 C and its comparison to the conventional AlSi12Cu4Ni2MgTiZr piston alloy. With only 0,02 vol-% TiC reinforcement the creep strength and creep rupture strength of the AlSi12CuNiMg piston alloy are significantly improved and reach the level of the expensive AlSi12Cu4Ni2MgTiZr alloy. (Copyright copyright 2012 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

HRTEM characterization of melt-spun Al-Si-Cu-Mg alloys solidified at different rates

International Nuclear Information System (INIS)

Alfonso, Ismeli; Maldonado, Cuauhtemoc; Medina, Ariosto; Gonzalez, Gonzalo; Bejar, Luis

2006-01-01

Six quaternary alloys Al-6Si-3Cu-xMg (x = 0.59, 3.80 and 6.78 wt.%) were produced by melt spinning using two different tangential speeds of the copper wheel (30 and 45 ms -1 ), and characterized using optical microscopy (OM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD) and microhardness. At 30 ms -1 , XRD and TEM investigations revealed the presence of Al 2 Cu (θ) for the alloy with 0.59%Mg and Al 5 Cu 2 Mg 8 Si 6 (Q) for the alloys with 3.80 and 6.78%Mg. The increase in microhardness of the alloys with higher Mg content is attributed to the presence of nanosized a-Al particles and a higher content of Q nanoparticles. At 45 ms -1 the alloying element content in solid solution is increased due to the fact that the quantity of free second phases (θ and Q nanoparticles) has decreased. For this rotation speed, amorphous regions of α -Al were observed, increasing microhardness compared to the 30 ms -1 ribbons

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

International Nuclear Information System (INIS)

Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

2007-01-01

In this paper, the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu 5 Zn 8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer, although the reflow soldering temperature of Sn-Zn-Bi (240 o C) was lower than that of Sn-Ag-Bi (250 o C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu, Ni) 6 Sn 5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface, and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems, indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 o C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu, Ni) 6 Sn 5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side, however the growth of the complex alloy including Sn, Ni, Cu and Zn on the Ni(P)/Cu metallization was suppressed

Phase formation in as-solidified and heat-treated Al-Si-Cu-Mg-Ni alloys: Thermodynamic assessment and experimental investigation for alloy design

Energy Technology Data Exchange (ETDEWEB)

Farkoosh, A.R., E-mail: amir.rezaeifarkoosh@mail.mcgill.ca [Department of Mining and Materials Engineering, McGill University, 3610 University, Aluminum Research Center - REGAL, Montreal, Quebec, Canada H3A 2B2 (Canada); Javidani, M. [Laval University, Department of Mining, Metallurgy and Materials Engineering, Aluminum Research Center - REGAL, 1065 Ave de la Medecine, Quebec, Canada G1V 0A6 (Canada); Hoseini, M. [Department of Mining and Materials Engineering, McGill University, 3610 University, Aluminum Research Center - REGAL, Montreal, Quebec, Canada H3A 2B2 (Canada); Larouche, D. [Laval University, Department of Mining, Metallurgy and Materials Engineering, Aluminum Research Center - REGAL, 1065 Ave de la Medecine, Quebec, Canada G1V 0A6 (Canada); Pekguleryuz, M. [Department of Mining and Materials Engineering, McGill University, 3610 University, Aluminum Research Center - REGAL, Montreal, Quebec, Canada H3A 2B2 (Canada)

2013-02-25

Highlights: Black-Right-Pointing-Pointer Phase formation in Al-Si-Ni-Cu-Mg-Fe system have been investigated. Black-Right-Pointing-Pointer T-Al{sub 9}FeNi, {gamma}-Al{sub 7}Cu{sub 4}Ni, {delta}-Al{sub 3}CuNi and {epsilon}-Al{sub 3}Ni are formed at different Ni levels. Black-Right-Pointing-Pointer Thermally stable Ni-bearing precipitates improved the overaged hardness. Black-Right-Pointing-Pointer It was found that Ni:Cu and Ni:Fe ratios control the precipitation. Black-Right-Pointing-Pointer {delta}-Al{sub 3}CuNi phase has more contribution to strength compare to other precipitates. - Abstract: Thermodynamic simulations based on the CALPHAD method have been carried out to assess the phase formation in Al-7Si-(0-1)Ni-0.5Cu-0.35Mg alloys (in wt.%) under equilibrium and non-equilibrium (Scheil cooling) conditions. Calculations showed that the T-Al{sub 9}FeNi, {gamma}-Al{sub 7}Cu{sub 4}Ni, {delta}-Al{sub 3}CuNi and {epsilon}-Al{sub 3}Ni phases are formed at different Ni levels. By analyzing the calculated isothermal sections of the phase diagrams it was revealed that the Ni:Cu and Ni:Fe ratios control precipitation in this alloy system. In order to verify the simulation results, microstructural investigations in as-cast, solution treated and aged conditions were carried out using electron probe microanalysis (EPMA), scanning electron microscopy (SEM), X-ray diffraction (XRD) and transmission electron microscopy (TEM). Furthermore, cooling curve analysis (CCA) was also performed to determine the freezing range of the new alloys and porosity formation during solidification. Hardness measurements of the overaged samples showed that in this alloy system the {delta}-Al{sub 3}CuNi phase has a greater influence on the overall strength of the alloys compared to the other Ni-bearing precipitates.

Low Temperature Mechanical Properties of Scandium-Modified Al-Zn-Mg-Cu Alloys

National Research Council Canada - National Science Library

Senkov, O

2002-01-01

Tensile properties of three wrought alloys, (1) Al-10Zn-3Mg-1.2Cu-0.15Zr, (2) Al-10Zn-3Mg-1.2Cu-0.15Zr-0.39Mn-0.49Sc, and (3) Al-12Zn-3Mg-1.2Cu-0.15Zr-0.39Mn-0.49Sc were studied in T6 and T7 conditions at 298K and 77K...

Research on Zr50Al15-xNi10Cu25Yx amorphous alloys prepared by mechanical alloying with commercial pure element powders

International Nuclear Information System (INIS)

Long Woyun; Ouyang Xueqiong; Luo Zhiwei; Li Jing; Lu Anxian

2011-01-01

Amorphous Zr 50 Al 15-x Ni 10 Cu 25 Y x alloy powders were fabricated by mechanical alloying at low vacuum with commercial pure element powders. The effects on glass forming ability of Al partial substituted by Y in Zr 50 Al 15 Ni 10 Cu 25 and thermal stability of Si 3 N 4 powders addition were investigated. The as-milled powders were characterized by X-ray diffraction, scanning electron microscopy and differential scanning calorimeter. The results show that partial substitution of Al can improve the glass forming ability of Zr 50 Al 15 Ni 10 Cu 25 alloy. Minor Si 3 N 4 additions raise the crystallization activation energy of the amorphous phase and thus improve its thermal stability. -- Research Highlights: → ZrAlNiCu amorphous alloys can be synthesized by MA in low cost. → Appropriate amount of Al substituted by Y in ZrAlNiCu alloy can improve its glass forming ability. → A second phase particle addition helps to improve the thermal stability of the amorphous matrix.

Effect of CeLa addition on the microstructures and mechanical properties of Al-Cu-Mn-Mg-Fe alloy

International Nuclear Information System (INIS)

Du, Jiandi; Ding, Dongyan; Xu, Zhou; Zhang, Junchao; Zhang, Wenlong; Gao, Yongjin; Chen, Guozhen; Chen, Weigao; You, Xiaohua; Chen, Renzong; Huang, Yuanwei; Tang, Jinsong

2017-01-01

Development of high strength lithium battery shell alloy is highly desired for new energy automobile industry. The microstructures and mechanical properties of Al-Cu-Mn-Mg-Fe alloy with different CeLa additions were investigated through optical microscopy (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), Rietveld refinement and tensile testing. Experimental results indicate that Al 8 Cu 4 Ce and Al 6 Cu 6 La phases formed due to CeLa addition. Addition of 0.25 wt.% CeLa could promote the formation of denser precipitation of Al 20 Cu 2 Mn 3 and Al 6 (Mn, Fe) phases, which improved the mechanical properties of the alloy at room temperature. However, up to 0.50 wt.% CeLa addition could promote the formation of coarse Al 8 Cu 4 Ce phase, Al 6 Cu 6 La phase and Al 6 (Mn, Fe) phase, which resulted in weakened mechanical properties. - Highlights: •Al-Cu-Mn-Mg-Fe alloys with different CeLa addition were fabricated through casting and rolling. •Al 8 Cu 4 Ce and Al 6 Cu 6 La phases formed after CeLa addition. •Addition of 0.25 wt.% CeLa promoted formation of denser precipitates of Al 20 Cu 2 Mn 3 and Al 6 (Mn, Fe). •Mechanical properties of the alloy was improved after 0.25 wt.% CeLa addition.

A thermodynamic prediction for microporosity formation in aluminum-rich Al-Cu alloys

Science.gov (United States)

Poirier, D. R.; Yeum, K.; Maples, A. L.

1987-01-01

A computer model is used to predict the formation and degree of microporosity in a directionally solidified Al-4.5 wt pct Cu alloy, considering the interplay between solidification shrinkage and gas porosity. Macrosegregation theory is used to determine the local pressure within the interdendritic liquid. Results show interdendritic porosity for initial hydrogen contents in the 0.03-1 ppm range, and none below contents of 0.03. An increase in either the thermal gradient or the solidification rate is show to decrease the amount of interdendritic porosity.

Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

Science.gov (United States)

Reeve, Kathlene N.; Handwerker, Carol A.

2018-01-01

The limited number of independent β-Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β-Sn grain size have major effects on overall solder performance and reliability. This study analyzes whether additions of Al to Sn-Cu and Sn-Cu-Ag alloys can be used to change the grain size, morphology, and twinning structures of atomized (as-solidified) and re-melted (reflowed) β-Sn dendrites as determined using scanning electron microscopy and electron backscatter diffraction for as-solidified and reflow cycled (20-250°C, 1-5 cycles) Sn-Cu-Al and Sn-Ag-Cu-Al drip atomized spheres (260 μm diameter). The resulting microstructures were compared to as-solidified and reflow cycled Sn-Ag-Cu spheres (450 μm diameter) as well as as-solidified Sn-Ag-Cu, Sn-Cu, and Sn-Ag microstructures from the literature. Previous literature observations reporting reductions in undercooling and β-Sn grain size with Al micro-alloying additions could not be correlated to the presence of the Cu9Al4 phase or Al solute. The as-solidified spheres displayed no change in β-Sn dendrite structure or grain size when compared to non-Al-modified alloys, and the reflow cycled spheres produced high undercoolings (22-64°C), indicating a lack of potent nucleation sites. The current findings highlighted the role of Ag in the formation of the interlaced twinning structure and demonstrated that with deliberate compositional choices, formation of the alloy's β-Sn grain structure (cyclical twinning versus interlaced twinning) could be influenced, in both the as-solidified and reflow cycled states, though still not producing the fine-grain sizes and multiple orientations desired for improved thermomechanical properties.

Generalized planar fault energies and twinning in Cu-Al alloys

Science.gov (United States)

Kibey, S.; Liu, J. B.; Johnson, D. D.; Sehitoglu, H.

2006-11-01

We report ab initio density functional theory calculations of generalized planar fault energies of fcc Cu -xAl (x =0, 5.0, and 8.3at.%) alloys. We investigate the effects of substitutional solute Al on the unstable intrinsic γus and twin γut stacking fault energies (SFEs). Our results reveal an increased tendency of Cu-Al to deform preferentially by twinning with increasing Al content, consistent with experiment. We attribute this mechanical behavior to appreciable lowering of the twinning barrier γut, along with the stable intrinsic and twin SFEs.

Li-atoms-induced structure changes of Guinier–Preston–Bagaryatsky zones in AlCuLiMg alloys

Energy Technology Data Exchange (ETDEWEB)

Duan, S.Y.; Le, Z.; Chen, Z.K.; Gao, Z. [Center for High-Resolution Electron Microscopy, College of Materials Science and Engineering, Hunan University, Changsha, Hunan 410082 (China); Chen, J.H., E-mail: jhchen123@hnu.edu.cn [Center for High-Resolution Electron Microscopy, College of Materials Science and Engineering, Hunan University, Changsha, Hunan 410082 (China); Advanced Research Center, Central South University, Changsha 410083 (China); Ming, W.Q.; Li, S.Y.; Wu, C.L. [Center for High-Resolution Electron Microscopy, College of Materials Science and Engineering, Hunan University, Changsha, Hunan 410082 (China); Yan, N. [Advanced Research Center, Central South University, Changsha 410083 (China)

2016-11-15

Guinier–Preston–Bagaryatsky (GPB) zones are the well-known strengthening precipitates of AlCuMg alloys formed upon thermal ageing. Here we report that when formed in AlCuLiMg alloys the GPB zones can change significantly in morphology and structure. It is shown that though they do still consist of Al, Cu and Mg elements fundamentally, the GPB zones in AlCuLiMg alloys have a rather different structure due to a featured Li-segregation at their interfaces with the matrix and possible Li-replacement of partial Mg atoms in the structure. As such the Li-containing GPB zones often develop from one-dimensional to quasi-two-dimensional precipitates. - Highlights: • We observe Guinier–Preston–Bagaryatsky zone variants in AlCuLiMg alloys. • We obtain atomic-resolution images of the precipitates and model their structures. • Li-atoms play a key role in modifying the structure of these precipitate variants.

Influences of alloying elements and oxygen on the stability and elastic properties of Mg17Al12

International Nuclear Information System (INIS)

Dai, Jianhong; Song, Yan; Yang, Rui

2014-01-01

Highlights: • Most alloying elements stabilize Mg 17 Al 12 with negative occupation energy. • The alloying element and oxygen co-existed Mg 17 Al 12 are stable. • Strong bonding interactions existed between alloying element and host atoms. - Abstract: Influence of alloying elements (Ca, Mn, Ni, Cu, Zn, Zr, Sn, and La) and oxygen on stability and elastic properties of Mg 17 Al 12 has been studied by first principles total energy calculations. The occupation preferences of oxygen and alloying elements in Mg 17 Al 12 are identified. Ca, Zr, and La tend to substitute for Mg atoms, Zn, Cu, and Ni prefer to occupy Al site, and Mn and Sn show positive occupation energy for substituting both Mg and Al atoms. The impurity oxygen prefers to occupy interstitial sites surrounded by four Mg atoms regardless the presence of alloying elements in this system. Elastic constants were estimated to evaluate the mechanical stability of alloyed systems. The results show that alloys which own negative occupation energy also satisfy the mechanical stability criteria. Electronic structures were analyzed to clarify the intrinsic mechanisms of how alloying elements and oxygen influence the stability of Mg 17 Al 12 . The stabilization effect of alloying elements and oxygen was found to originate from the strong bonding interaction with the matrix

The response of macrophages to a Cu-Al-Ni shape memory alloy.

Science.gov (United States)

Colić, Miodrag; Tomić, Sergej; Rudolf, Rebeka; Anzel, Ivan; Lojen, Gorazd

2010-09-01

Cu-Al-Ni shape memory alloys (SMAs) have been investigated as materials for medical devices, but little is known about their biocompatibility. The aim of this work was to study the response of rat peritoneal macrophages (PMØ) to a Cu-Al-Ni SMA in vitro, by measuring the functional activity of mitochondria, necrosis, apoptosis, and production of proinflammatory cytokines. Rapidly solidified (RS) thin ribbons were used for the tests. The control alloy was a permanent mold casting of the same composition, but without the shape memory effect. Our results showed that the control alloy was severely cytotoxic, whereas RS ribbons induced neither necrosis nor apoptosis of PMØ. These findings correlated with the data that RS ribbons are significantly more resistant to corrosion compared to the control alloy, as judged by the lesser release of Cu and Ni in the conditioning medium. However, the ribbons generated intracellular reactive oxygen species and upregulated the production of IL-6 by PMØ. These effects were almost completely abolished by conditioning the RS ribbons for 5 weeks. In conclusion, RS significantly improves the corrosion stability and biocompatibility of Cu-Al-Ni SMA. The biocompatibility of this functional material could be additionally enhanced by conditioning the ribbons in cell culture medium.

The influence of chemical composition on the properties and structure Al-Si-Cu(Mg) alloys

OpenAIRE

M. Kaczorowski; A. Krzyńska

2007-01-01

The mechanical properties of different chemical composition AlSiCuMg type cast alloys after precipitation hardening are presented. The aim of the study was to find out how much the changes in chemistry of aluminum cast alloys permissible by EN-PN standards may influence the mechanical properties of these alloys. Eight AlSi5Cu3(Mg) type cast alloys of different content alloying elements were selected for the study. The specimens cut form test castings were subjected to precipitation hardening ...

Effect of iron content on the structure and mechanical properties of Al25Ti25Ni25Cu25 and (AlTi)60-xNi20Cu20Fex (x=15, 20) high-entropy alloys

International Nuclear Information System (INIS)

Fazakas, É.; Zadorozhnyy, V.; Louzguine-Luzgin, D.V.

2015-01-01

Highlights: • Three new refractory alloys namely: Al 25 Ti 25 Ni 25 Cu 25 , Al 22.5 Ti 22.5 Ni 20 Cu 20 Fe 15 and Al 20 Ti 20 Ni 20 Cu 20 Fe 20 , were produced by induction-melting and casting. • This kind of alloys exhibits high resistance to annealing softening. • Most the alloys in the annealed state possess even higher Vickers microhardness than the as-cast alloys. • The Al 22.5 Ti 22.5 Ni 20 Cu 20 Fe 15 and Al 20 Ti 20 Ni 20 Cu 20 Fe 20 alloys annealed at 973 K show the highest compressive stress and ductility values. - Abstract: In this work, we investigated the microstructure and mechanical properties of Al 25 Ti 25 Ni 25 C u25 Al 22.5 Ti 22.5 Ni 20 Cu 20 Fe 15 and Al 20 Ti 20 Ni 20 Cu 20 Fe 20 high entropy alloys, produced by arc melting and casting in an inert atmosphere. The structure of these alloys was studied by X-ray diffractometry and scanning electron microscopy. The as-cast alloys were heat treated at 773, 973 and 1173 K for 1800 s to investigate the effects of aging on the plasticity, hardness and elastic properties. Compared to the conventional high-entropy alloys the Al 25 Ti 25 Ni 25 Cu 25 , Al 22.5 Ti 22.5 Ni 20 Cu 20 Fe 15 and Al 20 Ti 20 Ni 20 Cu 20 Fe 20 alloys are relatively hard and ductile. Being heat treated at 973 K the Al 22.5 Ti 22.5 Ni 20 Cu 20 Fe 15 alloy shows considerably high strength and relatively homogeneous deformation under compression. The plasticity, hardness and elastic properties of the studied alloys depend on the fraction and intrinsic properties of the constituent phases. Significant hardening effect by the annealing is found.

Influence of Solution Heat Treatment on Structure and Mechanical Properties of ZnAl22Cu3 Alloy

Directory of Open Access Journals (Sweden)

Michalik R.

2016-09-01

Full Text Available The influence of solution heat treatment at 385°C over 10 h with cooling in water on the structure, hardness and strength of the ZnAl22Cu3 eutectoid alloy is presented in the paper. The eutectoid ZnAl22Cu3 alloy is characterized by a dendritic structure. Dendrites are composed of a supersaturated solid solution of Al in Zn. In the interdendritic spaces a eutectoid mixture is present, with an absence of the ε (CuZn4 phase. Solution heat treatment of the ZnAl22Cu3 alloy causes the occurrence of precipitates rich in Zn and Cu, possibly ε phase. Solution heat treatment at 385°C initially causes a significant decrease of the alloy hardness, although longer solution heat treatment causes a significant increase of the hardness as compared to the as-cast alloy.

Eutectic Al-Si-Cu-Fe-Mn alloys with enhanced mechanical properties at room and elevated temperature

International Nuclear Information System (INIS)

Wang, E.R.; Hui, X.D.; Chen, G.L.