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Sample records for layered copper oxychloride

  1. Genotoxicity and cytotoxicity of copper oxychloride in cultured human lymphocytes using cytogenetic and molecular tests.

    Science.gov (United States)

    Bayram, Suleyman; Genc, Ahmet; Buyukleyla, Mehmet; Rencuzogullari, Eyyup

    2016-10-01

    The genotoxicity of copper oxychloride was investigated in human lymphocytes using chromosome aberration (CA) and micronucleus (MN) tests and the randomly amplified polymorphic DNA-polymerase chain reaction technique. The lymphocytes were treated with 3, 6, and 12 µg/mL of copper oxychloride for 24 and 48 h. Copper oxychloride increased CA and abnormal cells in a dose-dependent manner. The frequency of MN and micronucleated binuclear cells also increased at all concentrations and treatment periods. However, copper oxychloride cytotoxicity, observed through lower mitotic and nuclear division index, was significantly lower only at the higher concentrations (6 and 12 µg/mL). Copper oxychloride increased the polymorphic bands and decreased genomic template stability. In conclusion, in this study it was confirmed that copper oxychloride has genotoxic potential for human lymphocytes in vitro. Additionally, caution is advised for its use as a fungicide, because it may increase the risk of exposure through the food chain.

  2. Detachment of sprayed colloidal copper oxychloride-metalaxyl fungicides by a shallow water flow.

    Science.gov (United States)

    Pose-Juan, Eva; Paradelo-Pérez, Marcos; Rial-Otero, Raquel; Simal-Gándara, Jesus; López-Periago, José E

    2009-06-01

    Flow shear stress induced by rainfall promotes the loss of the pesticides sprayed on crops. Some of the factors influencing the losses of colloidal-size particulate fungicides are quantified by using a rotating shear system model. With this device it was possible to analyse the flow shear influencing washoff of a commercial fungicide formulation based on a copper oxychloride-metalaxyl mixture that was sprayed on a polypropylene surface. A factor plan with four variables, i.e. water speed and volume (both variables determining flow boundary stress in the shear device), formulation dosage and drying temperature, was set up to monitor colloid detachment. This experimental design, together with sorption experiments of metalaxyl on copper oxychloride, and the study of the dynamics of metalaxyl and copper oxychloride washoff, made it possible to prove that metalaxyl washoff from a polypropylene surface is controlled by transport in solution, whereas that of copper oxychloride occurs by particle detachment and transport of particles. Average losses for metalaxyl and copper oxychloride were, respectively, 29 and 50% of the quantity applied at the usual recommended dosage for crops. The key factors affecting losses were flow shear and the applied dosage. Empirical models using these factors provided good estimates of the percentage of fungicide loss. From the factor analysis, the main mechanism for metalaxyl loss induced by a shallow water flow is solubilisation, whereas copper loss is controlled by erosion of copper oxychloride particles.

  3. Formation of copper oxychloride and reactive oxygen species as causes of uterine injury during copper oxidation of Cu-IUD.

    Science.gov (United States)

    Beltran-Garcia, M J; Espinosa, A; Herrera, N; Perez-Zapata, A J; Beltran-Garcia, C; Ogura, T

    2000-02-01

    The lining of the uterus and cervix might be injured by a variety of oxidation products of Cu in a Cu-IUD, including cuprous ions, dissolved and precipitated cupric ions, and reactive oxygen species such as superoxide radicals, hydrogen peroxide, and hydroxyl radicals. In this study, the human amnious WISH cell line was employed as a model of uterine cells in the presence of copper. The cell viability was decreased by elemental copper, which was alleviated up to 70% by the addition of catalase. The addition of copper oxychloride caused cell death in a dose-dependent manner. Hydroxyl radicals in the presence of copper were determined by the formation of malondialdehyde. Soluble cuprous chloride complexes are formed in the uterus by slowly entering oxygen. The complexes are partly oxidized to insoluble copper oxychloride. which damages the endometrium. Unoxidized cuprous ions migrate to the oxygen-rich cervix and are oxidized to copper oxychloride, causing cervix damage.

  4. Response of the microbial community to copper oxychloride in acidic sandy loam soil.

    Science.gov (United States)

    Du Plessis, K R; Botha, A; Joubert, L; Bester, R; Conradie, W J; Wolfaardt, G M

    2005-01-01

    Determining the response of different microbial parameters to copper oxychloride in acidic sandy loam soil samples using cultivation-dependent and direct microscopic techniques. Culturable microbial populations were monitored for 245 days in a series of soil microcosms spiked with different copper oxychloride concentrations. Microbial populations responded differently to additional Cu. Protistan numbers and soil metabolic potential decreased. Experiments with more soil samples revealed that metabolic potential was not significantly affected by protista was noted in soil containing only 15 mg kg(-1) EDTA-extractable Cu. The negative impact on protistan numbers was less severe in soils with a higher phosphorous and zinc content. Bacterial populations responded differently, and protista were most sensitive to elevated Cu levels. Protistan numbers in soil from uncultivated land were higher and seemed to be more sensitive to additional Cu than the numbers of these organisms in soil originating from cultivated land. Protistan sensitivity to small increases in Cu levels demonstrates the vulnerability of the soil ecosystem to Cu perturbations, especially when the importance of protista as link in the flow of energy between trophic levels is considered.

  5. Human and soil exposure during mechanical chlorpyrifos, myclobutanil and copper oxychloride application in a peach orchard in Argentina.

    Science.gov (United States)

    Berenstein, Giselle; Nasello, Soledad; Beiguel, Érica; Flores, Pedro; Di Schiena, Johanna; Basack, Silvana; Hughes, Enrique A; Zalts, Anita; Montserrat, Javier M

    2017-05-15

    The objective of this study was to measure the impact of the mechanized chlorpyrifos, copper oxychloride and myclobutanil application in a small peach orchard, on humans (operators, bystanders and residents) and on the productive soil. The mean Potential Dermal Exposure (PDE) of the workers (tractor drivers) was 30.8mL·h(-1)±16.4mL·h(-1), with no specific pesticide distribution on the laborers body. Although the Margin of Safety (MOS) factor for the application stage were above 1 (safe condition) for myclobutanil and cooper oxycloride it was below 1 for chlorpyrifos. The mix and load stage remained as the riskier operation. Pesticide found on the orchard soil ranged from 5.5% to 14.8% of the total chlorpyrifos, copper oxychloride and myclobutanil applied. Pesticide drift was experimentally measured, finding values in the range of 2.4% to 11.2% of the total pesticide applied. Using experimental drift values, bystander (for one application), resident (for 20 applications) and earthworm (for one application) risk indicators (RIs) were calculated for the chlorpyrifos plus copper oxychloride and for myclobutanil treatments for different distances to the orchard border. Earthworm RI was correlated with experimental Eisenia andrei ecotoxicological assays (enzymatic activities: cholinesterases, carboxylesterases and glutathione S-transferases; behavioral: avoidance and bait-lamina tests) with good correlation. Copyright © 2017 Elsevier B.V. All rights reserved.

  6. Copper oxychloride fungicide and its effect on growth and oxidative stress of potato plants.

    Science.gov (United States)

    Ferreira, Leonardo Cesar; Scavroni, Joseane; da Silva, João Renato Vaz; Cataneo, Ana Catarina; Martins, Dagoberto; Boaro, Carmen Sílvia Fernandes

    2014-06-01

    Excess copper in plants causes physiological alterations that lead to crop productivity losses. However, cupric fungicides have been utilized in the control of Alternaria solani and Phytophthora infestans fungi, which cause early blight and late blight in potato, respectively. Thus, this study aimed to investigate the effect of different copper oxychloride levels on potato plants through some biochemical and physiological parameters. The fungicide was applied at the recommended level (2.50gL(-1)), at a reduced level (1.25gL(-1)), and at 5.00gL(-1), to simulate spraying in the field twice during the same period with the recommended level. The results revealed that superoxide dismutase (SOD, EC 1.15.1.1) protected plants against oxidative stress at the beginning of the cycle since lipoperoxide levels were low in that period. In addition, increased SOD activity positively correlated with increased usable leaf area for photosynthesis (leaf area ratio, LAR), photosynthetic effectiveness (net assimilation rate, NAR), and growth relative to pre-existing dry matter (relative growth rate, RGR). Concomitantly, there was a negative correlation between lipoperoxide levels and LAR and RGR. Plants randomly sprayed twice in the same period with the level recommended for potato crop protection in the field do not present damage regarding their development. However, additional studies are needed in order to reduce the use of copper fungicides in the control of early and late blight in potato crop production, then decreasing the release of copper in the environment. Copyright © 2014 Elsevier Inc. All rights reserved.

  7. Behaviour of metalaxyl as copper oxychloride-metalaxyl commercial formulation vs. technical grade-metalaxyl in vineyards-devoted soils.

    Science.gov (United States)

    Pose-Juan, E; Rial-Otero, R; Paradelo, M; Simal-Gándara, J; Arias, M; López-Periago, J E

    2010-02-15

    The objective of this work is to asses the sorption of metalaxyl applied as a copper oxychloride (CO)-metalaxyl formulation, for a set of selected soils devoted to vineyards. The method involved batch incubation of soils suspended with a commercial copper oxychloride-metalaxyl-based fungicide in 0.01M CaCl(2). Afterwards, the metalaxyl concentration remaining in solution was determined by high-performance liquid chromatography (HPLC). The amount of dissolved metalaxyl in the fungicide suspension depends mainly on the soil pH, its potential acidity, and the cation exchange capacity. Of the approx. 20% metalaxyl retained by the solid colloids, the effect of organic matter colloids in soils (15-20 mg kg(-1)) had a poor contribution (six times lower) than the copper oxychloride colloids (40%, w/w) in the commercial fungicide formulation (100-130 mg kg(-1)). When comparing these retention data with the behaviour of metalaxyl used as a technical grade fungicide of about 100% purity (10-15 mg kg(-1) in solids), it is clear that the commercial formulation increases a 30% retention of metalaxyl by soil (15-20 mg kg(-1) in solids). The overall effect of the metalaxyl formulation plus soil show values of 10 times higher retention than technical grade-metalaxyl plus soil. Commercial formulation can decrease the mobility of soluble metalaxyl in agricultural soils with regard to the expected values obtained from batch studies using analytical grade-metalaxyl. Therefore, the effect of surfactants should be considered in the assessment of water contamination by the pesticides used in agriculture.

  8. Enhanced reactive adsorption of hydrogen sulfide on the composites of graphene/graphite oxide with copper (hydr)oxychlorides.

    Science.gov (United States)

    Mabayoje, Oluwaniyi; Seredych, Mykola; Bandosz, Teresa J

    2012-06-27

    Composites of copper (hydr)oxychlorides with graphite oxide or graphene were synthesized and used as adsorbents of hydrogen sulfide at dynamic conditions at ambient temperatures. The materials were extensively characterized before and after adsorption in order to link their performance to the surface features. X-ray diffraction, FTIR, thermal analysis, TEM, SEM/EDX, and adsorption of nitrogen were used. It was found that the composite with graphene has the most favorable surface features enhancing reactive adsorption of hydrogen sulfide. The presence of moisture in the H2S stream has a positive effect on the removal process owing to the dissociation process. H2S is retained on the surface via a direct replacement of OH groups and via acid-base reactions with the copper (hydr)oxide. Highly dispersed reduced copper species on the surface of the composite with graphene enhance activation of oxygen and cause formation of sulfites and sulfates. Higher conductivity of the graphene phase than that of graphite oxide helps in electron transfer in redox reactions.

  9. Application of Trichoderma harzianum (T22) and Trichoderma atroviride (P1) as plant growth promoters, and their compatibility with copper oxychloride

    Institute of Scientific and Technical Information of China (English)

    Francesco Vinale; Gaetano D' Ambrosio; Khalid Abadi; Felice Scala; Roberta Marra; David Turrà; Sheridan L Woo; Matteo Lorito

    2004-01-01

    @@ Trichoderma strains are used in agriculture because they provide to the plants the following benefits:i) are rhizosphere competence and establish stable rhizosphere microbial communities; ii) control plant disease caused by pathogenic and competitive microflora, by using a variety of mechanisms; iii)improve vegetative growth, root development and yield; iv) make nutrients more available to the plant. In this work we have investigated the ability of T. harzianum T22 and T. atroviride P1 to improve plant growth of locally important horticultural crops: lettuce, tomatoes and peppers and to prevent disease in the greenhouse and field. The effect of the Trichoderma treatment was evaluated by determining the weight of fresh and dry roots and above ground plant biomass, measuring plants height, counting the number of emerged leaves (lettuce, tomatoes and peppers) and quantifying production (tomatoes and peppers). No disease symptoms were found during production, although Fusarium sp. strains pathogenic to tomato were detected in the soil. Compounds containing copper oxychloride are frequently used for fungal disease control in agriculture. In order to investigate the compatibility of T. harzianum T22 and T. atroviride P1 with copper oxychloride applications, the effect on mycelia growth was monitored in both liquid and solid medium. In general, the tests indicated a high level of tolerance of the Trichoderma strains to concentrations of copper oxychloride varying from 0.1 to 5 mmol/L.

  10. Conclusion on the peer review of the pesticide risk assessment of confirmatory data submitted for the active substance Copper (I, copper (II variants namely copper hydroxide, copper oxychloride, tribasic copper sulfate, copper (I oxide, Bordeaux mixture

    Directory of Open Access Journals (Sweden)

    European Food Safety Authority

    2013-06-01

    Full Text Available The conclusions of the European Food Safety Authority (EFSA following the peer review of the initial risk assessment carried out by the competent authority of the rapporteur Member State France, for the pesticide active substance copper (I, copper (II variants (formerly referred to as copper compounds are reported. The context of the peer review was that requested by the European Commission following the submission and evaluation of confirmatory environmental fate and behaviour and ecotoxicology data. The conclusions were reached on the basis of the evaluation of the representative uses of copper (I, copper (II variants as a fungicide/bactericide on grapes and tomatoes. The reliable endpoints concluded as being appropriate for use in regulatory risk assessment, derived from the available studies and literature in the dossier peer reviewed, are presented. Concerns are identified.

  11. Synthesis and structure of Ba 6Co 6ClO 16, a new cobalt oxychloride with a layered perovskite-related structure

    Science.gov (United States)

    Tancret, Nathalie; Roussel, Pascal; Abraham, Francis

    2005-10-01

    Well-developed single crystals of the title compound were prepared using a BaCl 2 flux and investigated by X-ray diffraction methods using Mo( Kα) radiation and a Charge Coupled Device (CCD) detector. The crystal structure was solved and refined in the hexagonal symmetry with P6¯m2 space group, a=5.6698(2) Å and c=14.4654(5) Å to a final R1=0.022 for 44 parameters with 1418 individual reflections. The structure of Ba 6Co 6ClO 16, which is related to the 6H-perovkite-type structure of BaMnO 2.88, is formed by the periodic stacking along [001] of five [BaO 3] layers separated by a [BaOCl] with a ( hhhchc) stacking sequence. The [BaO 3] stacking creates tetranuclear face sharing octahedra units Co 4O 15 containing Co(III) connected by dimers of corner-sharing CoO 4 tetrahedra. This new oxychloride belongs to the family of compounds formulated as [BaOCl] M' 2[Ba n+1M nO 3n+3] where n represents the thickness of the octahedral string in hexagonal perovskite slabs.

  12. Magnesium oxychloride cement concrete

    Indian Academy of Sciences (India)

    A K Misra; Renu Mathur

    2007-06-01

    The scope of magnesium oxychloride (MOC) cement in concrete works has been evaluated. MOC cement concrete compositions of varying strengths having good placing and finishing characteristics were prepared and investigated for their compressive and flexural strengths, -values, abrasion resistance etc. The durability of MOC concrete compositions against extreme environmental conditions viz. heating–cooling, freezing–thawing, wetting–drying and penetration and deposition of salts etc were investigated. The results reveal that MOC concrete has high compressive strength associated with high flexural strength and the ratio of compressive to flexural strength varies between 6 and 8. The elastic moduli of the compositions studied are found to be 23–85 GPa and the abrasion losses between 0.11 and 0.20%. While alternate heating–cooling cycles have no adverse effect on MOC concrete, it can be made durable against freezing–thawing and the excessive exposure to water and salt attack by replacing 10% magnesium chloride solution by magnesium sulphate solution of the same concentration.

  13. Layered perovskite-related ruthenium oxychlorides: crystal structure of two new compounds Ba 5Ru 2Cl 2O 9 and Ba 6Ru 3Cl 2O 12

    Science.gov (United States)

    Tancret, N.; Roussel, P.; Abraham, F.

    2004-03-01

    Single crystals of the title compounds were prepared using a BaCl 2 flux and investigated by X-ray diffraction methods using Mo Kα radiation and a charge coupled device (CCD) detector. The crystal structures of these two new compounds were solved and refined in the hexagonal symmetry with space group P6 3/ mmc, a=5.851(1) Å, c=25.009(5) Å, ρcal=4.94 g cm -3, Z=2 to a final R1=0.069 for 20 parameters with 312 reflections for Ba 5Ru 2Cl 2O 9 and space group P 3¯m1 , a=5.815(1) Å, c=14.915(3) Å, ρcal=5.28 g cm -3, Z=1 to a final R1=0.039 for 24 parameters with 300 reflections for Ba 6Ru 3Cl 2O 12. The structure of Ba 5Ru 2Cl 2O 9 is formed by the periodic stacking along [001] of three hexagonal close-packed BaO 3 layers separated by a double layer of composition Ba 2Cl 2. The BaO 3 stacking creates binuclear face-sharing octahedra units Ru 2O 9 containing Ru(V). The structure of Ba 6Ru 3Cl 2O 12 is built up by the periodic stacking along [001] of four hexagonal close-packed BaO 3 layers separated by a double layer of composition Ba 2Cl 2. The ruthenium ions with a mean oxidation degree +4.67 occupy the octahedral interstices formed by the four layers hexagonal perovskite slab and then constitute isolated trinuclear Ru 3O 12 units. These two new oxychlorides belong to the family of compounds formulated as [Ba 2Cl 2][Ba n+1 Ru nO 3 n+3 ], where n represents the thickness of the octahedral string in hexagonal perovskite slabs.

  14. Wetting layer of copper on the tantalum (001) surface

    Science.gov (United States)

    Dupraz, Maxime; Poloni, Roberta; Ratter, Kitti; Rodney, David; De Santis, Maurizio; Gilles, Bruno; Beutier, Guillaume; Verdier, Marc

    2016-12-01

    The heteroepitaxial interface formed by copper deposited onto the tantalum (001) surface is studied by surface x-ray diffraction and ab initio calculations. The analysis of the crystal truncation rods reveals the presence of a wetting layer of copper made of two atomic planes pseudomorphic to the tantalum substrate, with the upper most atomic planes significantly deformed. These findings are in total agreement with the results of density-functional-theory calculations. The presence of the wetting layer confirms a Stranski-Krastanov growth mode and is thought to explain the extremely fast atomic diffusion of copper during the dewetting process in the solid state at high temperature.

  15. Stability and `volatility ` of element 104 oxychloride

    Energy Technology Data Exchange (ETDEWEB)

    Eichler, B.; Gaeggeler, H.W. [Paul Scherrer Inst. (PSI), Villigen (Switzerland)

    1997-09-01

    The formation enthalpies {Delta}H{sup *} of solid and gaseous oxychlorides of element 104 from free atoms were estimated by extrapolation. Stability and volatility of these compounds are compared to those of the homologous and neighbouring elements in the periodic system. It can be supposed that in a gas adsorption chromatographic process with oxygen containing chlorinating carrier gas the transport with the carrier gas flow occurs in the chemical state 104Cl{sub 4}. Only in the absorbed state the compound 104OCl{sub 2} is formed. (author) 1 fig., 3 refs.

  16. Tailoring capping layers to reduce stress gradients in copper metallization

    Science.gov (United States)

    Murray, Conal E.; Priyadarshini, Deepika; Nguyen, Son; Ryan, E. Todd

    2016-12-01

    Capping layers for back-end-of-line metallization, which primarily serve as diffusion barriers to prevent contamination, also play a role in mitigating electromigration in the underlying conductive material. Stress gradients can be generated in copper metallization due to the conditions associated with the capping process. To study the effects of deposition and subsequent annealing on the mechanical response of copper films with various capping schemes, we employed a combination of conventional and glancing incidence X-ray diffraction techniques to quantify the stress gradient maxima. The Cu films with dielectric caps, such as silicon nitride, can exhibit large gradients that decrease slightly with thermal cycling. However, Co and TaN-based metallic capping layers create significantly lower stress gradient maxima in copper features both before and after annealing. The different evolution of stress gradients in Cu films with dielectric and metallic caps due to thermal cycling reveals the interaction of dislocation-mediated, plastic deformation with the cap/Cu interface.

  17. Effect of aluminium phosphate as admixture on oxychloride cement

    Indian Academy of Sciences (India)

    M P S Chandrawat; R N Yadav

    2000-02-01

    The effect of admixing of aluminium phosphate on oxychloride cement in the matrix has been investigated. It is shown that aluminium phosphate retards the setting process of the cement and improves water-tightness.

  18. Layer-by-Layer Nanoassembly of Copper Indium Gallium Selenium Nanoparticle Films for Solar Cell Applications

    OpenAIRE

    Hemati, A; Shrestha, S; M. Agarwal; K. Varahramyan

    2012-01-01

    Thin films of CIGS nanoparticles interdigited with polymers have been fabricated through a cost-effective nonvacuum film deposition process called layer-by-layer (LbL) nanoassembly. CIGS nanoparticles synthesized by heating copper chloride, indium chloride, gallium chloride, and selenium in oleylamine were dispersed in water, and desired surface charges were obtained through pH regulation and by coating the particles with polystyrene sulfonate (PSS). Raising the pH of the nanoparticle disper...

  19. Atomic layer deposition of copper sulfide thin films

    Energy Technology Data Exchange (ETDEWEB)

    Schneider, Nathanaelle, E-mail: n.schneider@chimie-paristech.fr; Lincot, Daniel; Donsanti, Frédérique

    2016-02-01

    Atomic Layer Deposition (ALD) of copper sulfide (Cu{sub x}S) thin films from Cu(acac){sub 2} (acac = acetylacetonate = 2,4-pentanedionate) and H{sub 2}S as Cu and S precursors is reported. Typical self-saturated reactions (“ALD window”) are obtained in the temperature range T{sub dep} = 130–200 °C for an average growth per cycle (GR) = 0.25 Å/cycle. The morphology, crystallographic structure, chemical composition, electrical properties and optical band gap of thin films were investigated using scanning electronic microscopy (SEM), X-ray diffraction under Grazing Incidence conditions (GI-XRD), X-ray reflectivity (XRR), energy dispersive spectrometry (EDS), Hall effect measurements, and UV–vis spectroscopy. The obtained copper sulfide films are heavily p-doped (charge carrier concentration ~ 10{sup 21} –10{sup 22} cm{sup −3}) with optical band gaps in the range of 2.2–2.5 eV for direct and 1.6–1.8 eV for indirect band gaps. Depending on the number of ALD cycles, multiphase compounds (made of digenite Cu{sub 1.8}S, chalcocite Cu{sub 2}S, djurleite Cu{sub 31}S{sub 16} and covellite CuS) or single-phase digenite Cu{sub 1.8}S films are obtained via a growth mechanism that involves in-situ copper reduction and loss of sulfur by evaporation. - Highlights: • Cu{sub x}S films were synthesized by atomic layer deposition from Cu(acac){sub 2} and H{sub 2}S. • Self-saturated reactions at T{sub dep} = 130–200 °C for growth = 0.25 Å/cycle • Multi- or single- phase films are obtained depending on the number of cycles. • Growth mechanism involves copper reduction and loss of sulfur by evaporation.

  20. AC over-current characteristics of YBCO coated conductor with copper stabilizer layer considering insulation layer

    Science.gov (United States)

    Du, H.-I.; Kim, M.-J.; Kim, Y.-J.; Lee, D.-H.; Han, B.-S.; Song, S.-S.

    2010-11-01

    Compared with the first-generation BSCCO wire, the YBCO thin-film wire boasts low material costs and high Jc and superior magnetic-field properties, among other strengths. Meanwhile, the previous BSCCO wire material for superconducting cables has been researched on considerably with regard to its post-wire quenching characteristics during the application of an alternating over-current. In this regard, the promising YBCO thin-film wire has yet to be further researched on. Moreover, still lacking is research on the YBCO thin-film wire with insulating layers, which is essential in the manufacture of superconducting cables, along with the testing of the application of an alternating over-current to the wire. In this study, YBCO thin-film wires with copper-stabilizing layers were used in testing alternating over-current application according to the presence or absence of insulating layers and to the thickness of such layers, to examine the post-quenching wire resistance increase and quenching trends. The YBCO thin-film wire with copper-stabilizing layers has a critical temperature of 90 K and a critical current of 85 A rms. Moreover, its current application cycle is 5.5 cycles, and its applied currents are 354, 517, 712, and 915 A peak. These figures enabled the YBCO thin-film wires with copper-stabilizing layers to reach 90, 180, 250, and 300 K, respectively, in this study. These temperatures serve as a relative reference to examine the post-quenching wire properties following the application of an alternating over-current.

  1. Microstructure and properties of pure iron/copper composite cladding layers on carbon steel

    Science.gov (United States)

    Wan, Long; Huang, Yong-xian; Lü, Shi-xiong; Huang, Ti-fang; Lü, Zong-liang

    2016-08-01

    In the present study, pure iron/copper composite metal cladding was deposited onto carbon steel by tungsten inert gas welding. The study focused on interfacial morphological, microstructural, and mechanical analyses of the composite cladding layers. Iron liquid-solid-phase zones were formed at copper/steel and iron interfaces because of the melting of the steel substrate and iron. Iron concentrated in the copper cladding layer was observed to exhibit belt, globule, and dendrite morphologies. The appearance of iron-rich globules indicated the occurrence of liquid phase separation (LPS) prior to solidification, and iron-rich dendrites crystallized without the occurrence of LPS. The maximum microhardness of the iron/steel interface was lower than that of the copper/steel interface because of the diffusion of elemental carbon. All samples fractured in the cladding layers. Because of a relatively lower strength of the copper layer, a short plateau region appeared when shear movement was from copper to iron.

  2. Laser beam steering approaches for microstructuring of copper layers

    Science.gov (United States)

    Mur, Jaka; Podobnik, Boštjan; Poberaj, Igor

    2017-02-01

    We have investigated the process of copper layer ablation with a tightly focused Q-switched 532 nm laser. Focusing 40 ns long laser pulses to a micrometer-sized spot results in high energy density and gives rise to ablation phenomena not seen during laser processing with larger beam diameters. Use of acousto-optic deflectors (AODs) enabled us to test different laser beam steering approaches in terms of choosing the position for each laser pulse independently of the previous pulses. Random addressing of desired positions across a microstructure proved to be the most efficient method compared to various scanning approaches. Assigning a random order to the spatial sequence of laser pulses resulted in the fastest microstructuring process and featured lowest residual heating of the substrate.

  3. Fabrication of Nanostructured Electroforming Copper Layer by Means of an Ultrasonic-assisted Mechanical Treatment

    Institute of Scientific and Technical Information of China (English)

    Liao Qiang; Li Weiping; Liu Huicong; Zhu Liqun

    2010-01-01

    Electroformed copper layer with nanostructure is obtained using a subsequent mechanical treatment under the conditions of ultrasonic vibration according to the demand of high performance material in aeronautics.The microstructure of the electro-formed copper layer is observed by optical microscope (OM),scanning electron microscope (SEM) and transmission electron microscope (TEM).The tensile strength is evaluated with a tensile tester.It is found that bulk crystal of electroformed copper's surface layer is changed to nanocrystals (about 10 nm in size) after the ultrasonic-assisted mechanical treatment (UMT) but the whole monocrystalline structure still remains.The tensile strength exhibited by the new copper layer is two times better than the regular electroformed copper layer,while the fracture strain remains constant.In addition,the strengthening mechanism of UMT process is proved to be dislocation strengthening mechanism.

  4. The Microstructure and Wear Resistance of a Copper Matrix Composite Layer on Copper via Nitrogen-Shielded Arc Cladding

    Directory of Open Access Journals (Sweden)

    Yinan Li

    2016-12-01

    Full Text Available A TiN and TiN·Ti2Cu reinforced copper matrix composite layer was cladded onto a T3 copper substrate to improve the anti-wear performance of copper products by means of the nitrogen-shielded gas tungsten arc cladding method (N2-GTAC. Better than the traditional preparation method of TiN, the TiN particles in the cladding layer were in situ generated using N atoms of shielding gas and Ti atoms of pre-deposited metal powders. In addition, the composite phase TiN·Ti2Cu occurred in the cladding layer, which also had a positive effect on anti-wearing. As Ti increased, the amount and grain size of TiN·Ti2Cu and TiN increased as a result. The hardness of the cladding layer increased with the increasing amount of reinforced phase generated in the layer. The hardness of the layer reached a maximum of 410 HV, which is nearly 5.1 times greater than that of copper. The TiN·Ti2Cu- and TiN-reinforced phases improved the wear resistance of the cladding layers. The cladding layer with 15 wt % Ti had the longsest launch stage (600 s and the lowest fiction coefficient (0.56.

  5. Dry air effects on the copper oxides sensitive layers formation for ethanol vapor detection

    Energy Technology Data Exchange (ETDEWEB)

    Labidi, A., E-mail: Ahmed_laabidi@yahoo.fr [URPSC (UR 99/13-18) Unite de Recherche de Physique des Semiconducteurs et Capteurs, IPEST, Universite de Carthage, BP 51, La Marsa 2070, Tunis (Tunisia); Bejaoui, A.; Ouali, H. [URPSC (UR 99/13-18) Unite de Recherche de Physique des Semiconducteurs et Capteurs, IPEST, Universite de Carthage, BP 51, La Marsa 2070, Tunis (Tunisia); Akkari, F. Chaffar [Laboratoire de Photovoltaique et Materiaux Semi-conducteurs, ENIT, Universite de Tunis el Manar, BP 37, Le belvedere 1002, Tunis (Tunisia); Hajjaji, A.; Gaidi, M. [Laboratoire de Photovoltaique, Centre de Recherches et de technologies de l' energie, Technopole de Borj-Cedria, BP 95, 2050 Hammam-Lif (Tunisia); Kanzari, M. [Laboratoire de Photovoltaique et Materiaux Semi-conducteurs, ENIT, Universite de Tunis el Manar, BP 37, Le belvedere 1002, Tunis (Tunisia); Bessais, B. [Laboratoire de Photovoltaique, Centre de Recherches et de technologies de l' energie, Technopole de Borj-Cedria, BP 95, 2050 Hammam-Lif (Tunisia); Maaref, M. [URPSC (UR 99/13-18) Unite de Recherche de Physique des Semiconducteurs et Capteurs, IPEST, Universite de Carthage, BP 51, La Marsa 2070, Tunis (Tunisia)

    2011-09-15

    The copper oxide films have been deposited by thermal evaporation and annealed under ambient air and dry air respectively, at different temperatures. The structural characteristics of the films were investigated by X-ray diffraction. They showed the presences of two hydroxy-carbonate minerals of copper for annealing temperatures below 250 deg. C. Above this temperature the conductivity measurements during the annealing process, show a transition phase from metallic copper to copper oxides. The copper oxides sensitivity toward ethanol were performed using conductivity measurements at the working temperature of 200 deg. C. A decrease of conductivity was observed under ethanol vapor, showing the p-type semi-conducting characters of obtained copper oxide films. It was found that the sensing properties of copper oxide toward ethanol depend mainly on the annealing conditions. The best responses were obtained with copper layers annealed under dry air.

  6. Buffer layers on rolled nickel or copper as superconductor substrates

    Science.gov (United States)

    Paranthaman, Mariappan; Lee, Dominic F.; Kroeger, Donald M.; Goyal, Amit

    2000-01-01

    Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /CeO.sub.2 /Ni, RE.sub.2 O.sub.3 /Ni (RE=Rare Earth), and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /CeO.sub.2 /Cu, RE.sub.2 O.sub.3 /Cu, and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

  7. Characterization of hafnium oxide resistive memory layers deposited on copper by atomic layer deposition

    Energy Technology Data Exchange (ETDEWEB)

    Briggs, B.D.; Bishop, S.M. [SUNY College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, NY 12203 (United States); Leedy, K.D. [Air Force Research Laboratory, 2241 Avionics Circle, Wright Patterson Air Force Base, Dayton, OH 45433 (United States); Cady, N.C., E-mail: ncady@albany.edu [SUNY College of Nanoscale Science and Engineering, 255 Fuller Road, Albany, NY 12203 (United States)

    2014-07-01

    Hafnium oxide-based resistive memory devices have been fabricated on copper bottom electrodes. The HfO{sub x} active layers in these devices were deposited by atomic layer deposition (ALD) at 250 °C with tetrakis(dimethylamido)hafnium(IV) as the metal precursor and an O{sub 2} plasma as the reactant. Depth profiles of the HfO{sub x} by X-ray photoelectron spectroscopy and secondary ion mass spectroscopy revealed a copper concentration on the order of five atomic percent throughout the HfO{sub x} film. In addition to the Cu doped HfO{sub x}, a thin layer (20 nm) of Cu{sub x}O is present at the surface. This surface layer is believed to have formed during the ALD process, and greatly complicates the analysis of the switching mechanism. The resistive memory structures fabricated from the ALD HfO{sub x} exhibited non-polar resistive switching, independent of the top metal electrode (Ni, Pt, Al, Au). Resistive switching current voltage (I–V) curves were analyzed using Schottky emission and ionic hopping models to gain insight into the physical mechanisms underpinning the device behavior. During the forming process it was determined that, at voltages in excess of 2.5 V, an ionic hopping model is in good agreement with the I–V data. The extracted ion hopping distance ∼ 4 Å was within the range of interatomic spacing of HfO{sub 2} during the forming process consistent with ionic motion of Cu{sup 2+} ions. Lastly the on state I–V data was dominated at larger voltages by Schottky emission with an estimated barrier height of ∼ 0.5 eV and a refractive index of 2.59. The consequence of the Schottky emission analysis indicates the on state resistance to be a product of a Pt/Cu{sub 2}O/Cu filament(s)/Cu{sub 2}O/Cu structure. - Highlights: • HfO{sub 2} was grown via atomic layer deposition at 250 and 100 °C on Cu substrates. • A Cu{sub 2}O surface layer and Cu doping were observed in post-deposition of HfO{sub 2}. • Resistive memory devices were fabricated and

  8. Hot-Wire Chemical Vapor Deposition of Few-Layer Graphene on Copper Substrates

    Science.gov (United States)

    Soler, Víctor-Manuel Freire; Badia-Canal, Jordi; Roca, Carles Corbella; Miralles, Esther Pascual; Serra, Enric Bertran; Bella, José-Luís Andújar

    2013-01-01

    Chemical vapor deposition (CVD) of graphene on copper is an efficient technology for producing high-quality graphene for large areas. The objective of this work is to deposit graphene/few-layer graphene (FLG) using different types of copper substrate by a new hot-wire CVD process. We carried out the processes at temperatures below 1000 °C with acetylene (C2H2) as a precursor gas. After a general characterization of the samples, the results mostly indicate the formation of FLG on copper samples by this method. Nevertheless, the presence of pure, crystalline, and sufficiently flat surfaces is needed for depositing high-quality graphene layers.

  9. Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices

    Energy Technology Data Exchange (ETDEWEB)

    Waechtler, Thomas

    2010-05-25

    Copper-based multi-level metallization systems in today's ultralarge-scale integrated electronic circuits require the fabrication of diffusion barriers and conductive seed layers for the electrochemical metal deposition. Such films of only several nanometers in thickness have to be deposited void-free and conformal in patterned dielectrics. The envisaged further reduction of the geometric dimensions of the interconnect system calls for coating techniques that circumvent the drawbacks of the well-established physical vapor deposition. The atomic layer deposition method (ALD) allows depositing films on the nanometer scale conformally both on three-dimensional objects as well as on large-area substrates. The present work therefore is concerned with the development of an ALD process to grow copper oxide films based on the metal-organic precursor bis(trin- butylphosphane)copper(I)acetylacetonate [({sup n}Bu{sub 3}P){sub 2}Cu(acac)]. This liquid, non-fluorinated {beta}-diketonate is brought to react with a mixture of water vapor and oxygen at temperatures from 100 to 160 C. Typical ALD-like growth behavior arises between 100 and 130 C, depending on the respective substrate used. On tantalum nitride and silicon dioxide substrates, smooth films and selfsaturating film growth, typical for ALD, are obtained. On ruthenium substrates, positive deposition results are obtained as well. However, a considerable intermixing of the ALD copper oxide with the underlying films takes place. Tantalum substrates lead to a fast self-decomposition of the copper precursor. As a consequence, isolated nuclei or larger particles are always obtained together with continuous films. The copper oxide films grown by ALD can be reduced to copper by vapor-phase processes. If formic acid is used as the reducing agent, these processes can already be carried out at similar temperatures as the ALD, so that agglomeration of the films is largely avoided. Also for an integration with subsequent

  10. Layer-by-Layer Nanoassembly of Copper Indium Gallium Selenium Nanoparticle Films for Solar Cell Applications

    Directory of Open Access Journals (Sweden)

    A. Hemati

    2012-01-01

    Full Text Available Thin films of CIGS nanoparticles interdigited with polymers have been fabricated through a cost-effective nonvacuum film deposition process called layer-by-layer (LbL nanoassembly. CIGS nanoparticles synthesized by heating copper chloride, indium chloride, gallium chloride, and selenium in oleylamine were dispersed in water, and desired surface charges were obtained through pH regulation and by coating the particles with polystyrene sulfonate (PSS. Raising the pH of the nanoparticle dispersion reduced the zeta-potential from +61 mV at pH 7 to −51 mV at pH 10.5. Coating the CIGS nanoparticles with PSS (CIGS-PSS produced a stable dispersion in water with −56.9 mV zeta-potential. Thin films of oppositely charged CIGS nanoparticles (CIGS/CIGS, CIGS nanoparticles and PSS (CIGS/PSS, and PSS-coated CIGS nanoparticles and polyethylenimine (CIGS-PSS/PEI were constructed through the LbL nanoassembly. Film thickness and resistivity of each bilayer of the films were measured, and photoelectric properties of the films were studied for solar cell applications. Solar cell devices fabricated with a 219 nm CIGS film, when illuminated by 50 W light-source, produced 0.7 V open circuit voltage and 0.3 mA/cm2 short circuit current density.

  11. Microstructure and properties of pure iron/copper composite cladding layers on carbon steel

    Institute of Scientific and Technical Information of China (English)

    Long Wan; Yong-xian Huang; Shi-xiong L; Ti-fang Huang; Zong-liang L

    2016-01-01

    In the present study, pure iron/copper composite metal cladding was deposited onto carbon steel by tungsten inert gas welding. The study focused on interfacial morphological, microstructural, and mechanical analyses of the composite cladding layers. Iron liq-uid–solid-phase zones were formed at copper/steel and iron interfaces because of the melting of the steel substrate and iron. Iron concentrated in the copper cladding layer was observed to exhibit belt, globule, and dendrite morphologies. The appearance of iron-rich globules indicated the occurrence of liquid phase separation (LPS) prior to solidification, and iron-rich dendrites crystallized without the occurrence of LPS. The maximum microhardness of the iron/steel interface was lower than that of the copper/steel interface because of the diffusion of elemental carbon. All samples fractured in the cladding layers. Because of a relatively lower strength of the copper layer, a short plateau region ap-peared when shear movement was from copper to iron.

  12. Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication

    Energy Technology Data Exchange (ETDEWEB)

    Weihs, Timothy P. (Baltimore, MD); Barbee, Jr., Troy W. (Palto Alto, CA)

    2002-01-01

    Cubic or metastable cubic refractory metal carbides act as barrier layers to isolate, adhere, and passivate copper in semiconductor fabrication. One or more barrier layers of the metal carbide are deposited in conjunction with copper metallizations to form a multilayer characterized by a cubic crystal structure with a strong (100) texture. Suitable barrier layer materials include refractory transition metal carbides such as vanadium carbide (VC), niobium carbide (NbC), tantalum carbide (TaC), chromium carbide (Cr.sub.3 C.sub.2), tungsten carbide (WC), and molybdenum carbide (MoC).

  13. Monolayers and mixed-layers on copper towards corrosion protection

    Energy Technology Data Exchange (ETDEWEB)

    Sinapi, F. [Fonds pour la Formation a la Recherche dans l' Industrie et dans l' Agriculture, Rue d' Egmont 5, B-1000 Brussels (Belgium); Julien, S.; Auguste, D.; Hevesi, L.; Delhalle, J. [Laboratory of Chemistry and Electrochemistry of Surfaces, University of Namur, FUNDP, Rue de Bruxelles, 61, B-5000 Namur (Belgium); Mekhalif, Z. [Laboratory of Chemistry and Electrochemistry of Surfaces, University of Namur, FUNDP, Rue de Bruxelles, 61, B-5000 Namur (Belgium)], E-mail: zineb.mekhalif@fundp.ac.be

    2008-05-01

    In order to improve the protection abilities of (3-mercaptopropy)trimethoxysilane (MPTS) self-assembled monolayers on copper surfaces, mixed monolayers have been formed successfully by successive immersions in MPTS and in n-dodecanethiol (DT). A newly synthesised molecule, (11-mercaptoundecyl)trimethoxysilane (MUTS), has also been employed to form a thicker organic film on copper surfaces and, thereby, enhance the inhibitory action of the coating. The grafting has been confirmed by X-ray photoelectron spectroscopy (XPS), polarization modulation infrared reflection adsorption spectroscopy (PM-IRRAS) and water contact angle. The protective efficiency of each protective organic film has been evidenced by cyclic voltammetry (CV) and polarization curve measurements (CP). It was shown that the MUTS and unhydrolyzed MPTS/DT films exhibited significant corrosion protection properties.

  14. Microstructure in electrodeposited copper layers; the role of the substrate

    DEFF Research Database (Denmark)

    Rasmussen, Anette Alsted; Jensen, Jens Dahl; Horsewell, Andy

    2001-01-01

    -crystalline Ni-P layer. The evolutions of surface topography, morphology and crystallographic texture in the layers were investigated with scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction analysis, respectively. Distinct surface topographies were observed for Cu...... layers deposited on the Au and Ni-P substrates. Deposition onto the Au substrate resulted in a very smooth surface of Cu layers, whereas the Ni-P substrate caused an irregular surface for 3-microns-thick layers of Cu. The crystallographic texture in the Cu layers in the first few micrometres depended...... stongly on the crystallographic texture in the substrate. The Cu crystallites inherited the lll-orientation of the Au substrate, whilst no preferred crystallographic orientation was observed in the Cu crystallites on the nano-crystalline Ni-P substate. For Cu layers thicker than 3 microns a lll...

  15. Tensile mechanical properties of nano-layered copper/graphene composite

    Science.gov (United States)

    He, Yezeng; Huang, Feng; Li, Hui; Sui, Yanwei; Wei, Fuxiang; Meng, Qingkun; Yang, Weiming; Qi, Jiqiu

    2017-03-01

    The solidification of two-dimensional liquid copper confined to graphene layers has been studied using molecular dynamics simulations. The results clearly show that the liquid copper undergoes an obvious transition to a crystal film with the decrease of temperature, accompanied by dramatic change in potential energy and radial distribution function. Moreover, five different simulation models are used to investigate the effects of the number of graphene layers on the mechanical properties of the composites. It is found that the strength and plasticity of the composites have been improved significantly.

  16. Atomic layer deposition of copper and copper silver films using an electrochemical process

    Energy Technology Data Exchange (ETDEWEB)

    Fang, J.S., E-mail: jsfang@nfu.edu.tw [Department of Materials Science and Engineering, National Formosa University, Huwei 63201, Taiwan (China); Liu, Y.S. [Department of Materials Science and Engineering, National Formosa University, Huwei 63201, Taiwan (China); Chin, T.S. [Department of Materials Science and Engineering, Feng Chia University, Taichung 40724, Taiwan (China)

    2015-04-01

    This paper describes the formation and properties of Cu and Cu(Ag) films on a Ru/Si substrate using electrochemical atomic layer deposition. The process was performed layer-by-layer using underpotential deposition (UPD) and surface-limited redox reactions. The first Cu atomic layer was deposited on the Ru/Si substrate via UPD. Using UPD, atomic layered of Pb, which acts as a sacrificial layer, was applied on the Cu layer. Then, a Cu{sup 2+} solution was flushed into the cell at an open-circuit potential, and the Pb layer was exchanged for Cu via redox replacements. The above sequences were repeated 500 times to form a Cu film. The Cu(Ag) alloy films were formed using Cu–UPD and Ag–UPD in predetermined sequences. The lowest electrical resistivity achieved was 3.6 and 2.2 μΩ cm for the Cu film and Cu(Ag) film, respectively, after annealing at 400 °C. Due to the self-limiting reactions, the process has the ability to deposit atomic layers to meet the requirement of Cu interconnects. - Highlights: • Layer-by-layer growth of Cu and Cu(Ag) films are prepared using electrochemical atomic layer deposition. • Cu coverage is from 0.33 to 0.51 ML for each deposition cycle in different NaCl concentrations. • The process can be applied in Cu interconnections.

  17. The implications of copper fungicide usage in vineyards for earthworm activity and resulting sustainable soil quality

    NARCIS (Netherlands)

    Eijsackers, H.J.P.; Beneke, P.; Maboeta, M.; Louw, J.P.E.; Reinecke, A.J.

    2005-01-01

    To investigate the impact of copper-containing fungicides (copper oxychloride) on earthworms in South African vineyards, field inventories of earthworms in and between vine rows were carried out and compared to directly adjacent grassland. Also copper content, pH, organic matter content, and soil po

  18. Structure and Magnetoresistive Properties of Thee-layer Film Systems Based on Permalloy and Copper

    Directory of Open Access Journals (Sweden)

    Yu.O. Shkurdoda

    2016-06-01

    Full Text Available Structural and phase composition and magnetoresistive properties of three-layer film systems based on permalloy and copper were investigated. The samples were obtained by layer by layer condensation method with followed heat treatment to the 300-700 K temperature range. Shown that the spin-dependent scattering of electrons realizing in the range of layer thicknesses (dCu = 6-15 nm and dPy = 25-40 nm of the condensed and annealed at 400 K samples. The Maximum GMR observed after annealing the samples at 400 K and annealing to 550 K leads to anisotropic magnetoresistance occurrence.

  19. Structural, morphology and electrical properties of layered copper selenide thin film

    Science.gov (United States)

    Ying Chyi Liew, J.; Talib, Zainal; Mahmood, W.; Yunus, M.; Zainal, Zulkarnain; Halim, Shaari; Moksin, Mohd; Yusoff, Wan; Pah Lim, K.

    2009-06-01

    Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed.

  20. Electrochemical atomic layer deposition of copper nanofilms on ruthenium

    Science.gov (United States)

    Gebregziabiher, Daniel K.; Kim, Youn-Geun; Thambidurai, Chandru; Ivanova, Valentina; Haumesser, Paul-Henri; Stickney, John L.

    2010-04-01

    As ULSI scales to smaller and smaller dimensions, it has become necessary to form layers of materials only a few nm thick. In addition, trenches are now being incorporated in ULSI formation which require conformal coating and will not be amenable to CMP. Atomic layer deposition (ALD) is being developed to address such issues. ALD is the formation of materials layer by layer using self-limiting reactions. This article describes the formation of Cu seed layers (for the Cu damascene process) on a Ru barrier layer. The deposit was formed by the electrochemical analog of ALD, using electrochemical self-limiting reactions which are referred to as underpotential deposition (UPD). Monolayer restricted galvanic displacement was used to form atomic layers of Cu. First Pb UPD was deposited, forming a sacrificial layer, and then a Cu +2 solution was flushed into the cell and Pb was exchanged for Cu. A linear dependence was shown for Cu growth over 8 ALD cycles, and STM showed a conformal deposition, as expected for an ALD process. Relative Cu coverages were determined using Auger electron spectroscopy, while absolute Cu coverages were obtained from coulometry during oxidative stripping of the deposits. Use of a Cl - containing electrolyte results in Cu deposits covered with an atomic layer of Cl atoms, which have been shown to protect the surfaced from oxidation during various stages of the deposition process. The 10 nm thick Ru substrates were formed on Si(1 0 0) wafers, and were partially oxidized upon receipt. Electrochemical reduction, prior to Cu deposition, removed the oxygen and some traces of carbon, the result of transport. Ion bombardment proved to clean all oxygen and carbon traces from the surface.

  1. Metamagnetism in hydrophobically induced carboxylate (phenylmalonate)-bridged copper(II) layers.

    Science.gov (United States)

    Pasán, Jorge; Sanchiz, Joaquín; Ruiz-Pérez, Catalina; Campo, Javier; Lloret, Francesc; Julve, Miguel

    2006-07-21

    Self-assembly of copper(l) ions, phenylmalonate and pyrimidine yields the layered compound [Cu(pym)(Phmal)n (1) where intralayer ferro- and interlayer antiferromagnetic interactions occur with three-dimensional antiferromagnetic ordering at T(c) = 2.15 K.

  2. Microstructure in electrodeposited copper layers; the role of the substrate

    DEFF Research Database (Denmark)

    Rasmussen, Anette Alsted; Jensen, Jens Dahl; Horsewell, Andy

    2001-01-01

    stongly on the crystallographic texture in the substrate. The Cu crystallites inherited the lll-orientation of the Au substrate, whilst no preferred crystallographic orientation was observed in the Cu crystallites on the nano-crystalline Ni-P substate. For Cu layers thicker than 3 microns a lll...

  3. Large pore volume mesoporous copper particles and scaffold microporous carbon material obtained from an inorganic-organic nanohybrid material, copper-succinate-layered hydroxide.

    Science.gov (United States)

    Ghotbi, Mohammad Yeganeh; Bagheri, Narjes; Sadrnezhaad, S K

    2011-10-01

    Copper-succinate-layered hydroxide (CSLH), a new nanohybrid material, was synthesized as an inorganic-organic nanohybrid, in which organic moiety was intercalated between the layers of a single cation layered material, copper hydroxide nitrate. Microporous scaffold carbon material was obtained by thermal decomposition of the nanohybrid at 500 °C under argon atmosphere followed by acid washing process. Furthermore, the heat-treated product of the nanohybrid at 600 °C was ultrafine mesoporous metallic copper particles. The results of this study confirmed the great potential of CSLH to produce the carbon material with large surface area (580 m(2)/g) and high pore volume copper powder (2.04 cm(3)/g).

  4. Low-temperature atomic layer deposition of copper(II) oxide thin films

    Energy Technology Data Exchange (ETDEWEB)

    Iivonen, Tomi, E-mail: tomi.iivonen@helsinki.fi; Hämäläinen, Jani; Mattinen, Miika; Popov, Georgi; Leskelä, Markku [Laboratory of Inorganic Chemistry, Department of Chemistry, University of Helsinki, P.O. Box 55, FI-00014 Helsinki (Finland); Marchand, Benoît; Mizohata, Kenichiro [Division of Materials Physics, Department of Physics, University of Helsinki, P.O. Box 43, FI-00014 Helsinki (Finland); Kim, Jiyeon; Fischer, Roland A. [Chair of Inorganic Chemistry II, Ruhr-University Bochum, Universitätsstrasse 150, 44780 Bochum (Germany)

    2016-01-15

    Copper(II) oxide thin films were grown by atomic layer deposition (ALD) using bis-(dimethylamino-2-propoxide)copper [Cu(dmap){sub 2}] and ozone in a temperature window of 80–140 °C. A thorough characterization of the films was performed using x-ray diffraction, x-ray reflectivity, UV‐Vis spectrophotometry, atomic force microscopy, field emission scanning electron microscopy, x-ray photoelectron spectroscopy, and time-of-flight elastic recoil detection analysis techniques. The process was found to produce polycrystalline copper(II) oxide films with a growth rate of 0.2–0.3 Å per cycle. Impurity content in the films was relatively small for a low temperature ALD process.

  5. Modelling of fast jet formation under explosion collision of two-layer alumina/copper tubes

    Directory of Open Access Journals (Sweden)

    I Balagansky

    2017-09-01

    Full Text Available Under explosion collapse of two-layer tubes with an outer layer of high-modulus ceramics and an inner layer of copper, formation of a fast and dense copper jet is plausible. We have performed a numerical simulation of the explosion collapse of a two-layer alumina/copper tube using ANSYS AUTODYN software. The simulation was performed in a 2D-axis symmetry posting on an Eulerian mesh of 3900x1200 cells. The simulation results indicate two separate stages of the tube collapse process: the nonstationary and the stationary stage. At the initial stage, a non-stationary fragmented jet is moving with the velocity of leading elements up to 30 km/s. The collapse velocity of the tube to the symmetry axis is about 2 km/s, and the pressure in the contact zone exceeds 700 GPa. During the stationary stage, a dense jet is forming with the velocity of 20 km/s. Temperature of the dense jet is about 2000 K, jet failure occurs when the value of effective plastic deformation reaches 30.

  6. Zirconium Oxychloride as a Novel Mordant for Natural Dyeing of Wool Yarns

    Directory of Open Access Journals (Sweden)

    M. Forouharshad

    2013-01-01

    Full Text Available Zirconium oxychloride, a well-known flame retardant, is introduced as a novel mordant for wool dyeing. This has been indicated by mordanting of wool yarns with zirconium oxychloride in different conditions and then dyeing with madder as a famous natural dye. The tenacity, color coordinates, washing, and light fastnesses of the dyed wool confirmed the positive influence of zirconium oxychloride as a useful mordant for wool dyeing with a low impact on the color coordinates. Further, an appropriate washing and light fastness were obtained for the zirconium-oxychloride-mordanted wool yarns. The central composite design (CCD was used to design the experiments with four variables on the results of tensile strength. Statistical analysis confirmed the optimum conditions obtained through the experimental results.

  7. Treatment with coated layer double hydroxide clays decreases the toxicity of copper-contaminated water.

    Science.gov (United States)

    Blake, Deanne; Nar, Mangesh; D'Souza, Nandika Anne; Glenn, J Brad; Klaine, Stephen J; Roberts, Aaron P

    2014-05-01

    Copper is a common pollutant found in watersheds that exerts toxic effects on both invertebrates and vertebrates. Layer double hydroxide (LDH) clays are able to adsorb a wide range of contaminants through ion-exchange mechanisms. Coating LDH clays with various materials alters the aggregation of clay particles into the nano-size range, thus increasing relative surface area and offering great potential for contaminant remediation. The goal of this study was to determine if treatment with coated LDH clays decreases the toxicity of copper-containing solutions to Daphnia magna. Four LDH clays with different coatings used to alter hydrophobicity were as follows: used: Na(+) montmorillonite, Zn-Al LDH-nitrate, Zn-Al LDH-stearate, and Zn-Al LDH-carbonate. It was determined that coated LDH clays decreased copper toxicity by decreasing bioavailability and that smaller aggregate sizes decreased bioavailability the most. 96 h LC50 values increased by as much as 4.2 times with the treatment of the solutions with 100 mg/L LDH clay. Copper analysis of the clay and solutions indicated that the clays work by decreasing copper bioavailability by way of a binding mechanism. Coated LDH clays hold promise as a small-scale remediation tool or as an innovative tool for toxicity identification and evaluation characterization of metals.

  8. Copper conducting electrode with nickel as a seed layer for selective emitter crystalline silicon solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Rehman, Atteq ur; Shin, Eun Gu; Lee, Soo Hong [Sejong University, Seoul (Korea, Republic of)

    2014-09-15

    In this research, we investigated selective emitter formation with a single-step photolithography process having a metallization scheme composed of nickel/copper metal stacks. The nickel seed layers were deposited by applying the electroless deposition process while copper was formed by light induced electro-plating arrangements as the main conducting electrode. The electroless deposition of nickel, along with a sintering process, was employed to create a diffusion barrier between copper and silicon. The nickel metal stack below the copper-conducting electrode also helped in lowering the sheet resistance and improving the contact adhesion. The nickel used as a seed layer was successfully demonstrated in the fabrication of a homogeneous 60 Ω/ emitter and selective emitter cells. Lower series resistances of 0.165 Ω and 0.253 Ω were achieved for the selective emitter and the homogeneous emitter cells, respectively. The best cell efficiency of 18.37% for the selective emitter solar cell was achieved, with average cell efficiencies of 18.17% and 17.3% for the selective emitter and the homogeneous emitter cells, respectively. An approximate efficiency increase of about 0.8% was recorded for the selective emitter solar cells.

  9. Digenite Nanosheets Synthesized by Thermolysis of Layered Copper-Alkanethiolate Frameworks.

    Science.gov (United States)

    Bryks, Whitney; Lupi, Eduardo; Ngo, Charles; Tao, Andrea R

    2016-10-06

    Copper sulfide nanocrystals support localized surface plasmon resonances in the near-infrared wavelengths and have significant potential as active plasmonic nanomaterials due to the tunability of this optical response. While numerous strategies exist for synthesizing copper sulfide nanocrystals, few methods result in nanocrystals with both controlled morphological shapes and crystallinity. Here, we synthesize and characterize ultrathin (thermolysis, utilizing Cu alkanethiolates as single-source precursors. Layered Cu alkanethiolate precursors adopt a highly ordered structure which can be further stabilized in the presence of Cl(-) and also serve to template the formation of nanosheets. We show that, in the absence of Cl(-), only isotropic and disk-like Cu2-xS nanocrystals form. These findings offer further insight into the use of layered metal-organic single-source precursors as templates for anisotropic nanocrystal growth.

  10. Enhancement of absorption in vertically-oriented graphene sheets growing on a thin copper layer

    Science.gov (United States)

    Rozouvan, Tamara; Poperenko, Leonid; Kravets, Vasyl; Shaykevich, Igor

    2017-02-01

    The optical properties and surface structure of graphene films grown on thin copper Cu (1 μm) layer using chemical vapour deposition method were investigated via spectroscopic ellipsometry and nanoscopic measurements. Angle variable ellipsometry measurements were performed to analyze the features of dispersion of the complex refractive index and optical conductivity. It was observed significant enhancement of the absorption band in the vertically-oriented graphene sheets layer with respect to the bulk graphite due to interaction between excited localized surface plasmon at surface of thin Cu layer and graphene's electrons. Scanning tunneling microscopy measurements with atomic spatial resolution revealed vertical crystal lattice structure of the deposited graphene layer. The obtained results provide direct evidence of the strong influence of the growing condition and morphology of nanostructure on electronic and optical behaviours of graphene film.

  11. Using copper substrate to enhance electron field emission properties of carbon nanotube/diamond double-layered structure

    Science.gov (United States)

    Yang, Lezhi; Sujith Kumar, C. S.; Li, Yuan-shi; Niakan, Hamid; Zhang, Chunzi; Hirose, Akira; Aravind, Suresh; Yang, Qiaoqin

    2015-01-01

    Vertically aligned carbon nanotube (CNT)/diamond double-layered structure was synthesized on copper (Cu) substrate by hot-filament chemical vapor deposition. The structure was characterized by scanning electron microscopy, transmission electron microscopy, and Raman spectroscopy. The results show that the diamond layer has good adhesion to the Cu substrate and the CNTs have direct contact with the diamond layer. Field electron emission measurement shows that the double-layered structure on copper has very good emission stability and a much lower turn-on field than that on silicon (Si).

  12. Experimental analysis of nanofluid pool boiling heat transfer in copper bead packed porous layers

    Science.gov (United States)

    Chen, Wei; Wang, Ji

    2017-03-01

    Coupling the nanofluid as working fluid and the copper beads packed porous structure on heating surface were employed to enhance the pool boiling heat transfer by changing the fluid properties with the adjunction of nanoparticles in liquid and altering the heating surface with a bead porous layer. Due to the higher thermal conductivity, the copper beads served as an extended heating surface and the boiling nucleation sites rose, but the flow resistance increased. The CuO-water and SiO2-water nanofluids as well as the pure water were respectively employed as working fluids in the pool boiling experiments. Comparing with the base fluid of water, the higher thermal conductivity and lower surface tension occur in the nanofluids and those favor the boiling heat transfer, but the higher viscosity and density of nanofluids serve as deteriorative factors. So, the concentration region of the nanofluids should be chosen properly. The maximum relative error between the collected experimental data of the pure water on a flat surface and the theoretical prediction of pool boiling using the Rohsenow correlation was less than 12 %. The comparisons of the pool boiling heat transfer characteristics were also conducted between the pure water and the nanofluids respectively on the horizontal flat surface and on the heating surface packed with a copper bead porous layer. Besides, the boiling bubble generation, integration and departure have a great affect on the pool boiling and were recorded with a camera in the bead stacked porous structures at different heat flux.

  13. Graphene-copper composite with micro-layered grains and ultrahigh strength

    Science.gov (United States)

    Wang, Lidong; Yang, Ziyue; Cui, Ye; Wei, Bing; Xu, Shichong; Sheng, Jie; Wang, Miao; Zhu, Yunpeng; Fei, Weidong

    2017-02-01

    Graphene with ultrahigh intrinsic strength and excellent thermal physical properties has the potential to be used as the reinforcement of many kinds of composites. Here, we show that very high tensile strength can be obtained in the copper matrix composite reinforced by reduced graphene oxide (RGO) when micro-layered structure is achieved. RGO-Cu powder with micro-layered structure is fabricated from the reduction of the micro-layered graphene oxide (GO) and Cu(OH)2 composite sheets, and RGO-Cu composites are sintered by spark plasma sintering process. The tensile strength of the 5 vol.% RGO-Cu composite is as high as 608 MPa, which is more than three times higher than that of the Cu matrix. The apparent strengthening efficiency of RGO in the 2.5 vol.% RGO-Cu composite is as high as 110, even higher than that of carbon nanotube, multilayer graphene, carbon nano fiber and RGO in the copper matrix composites produced by conventional MLM method. The excellent tensile and compressive strengths, high hardness and good electrical conductivity are obtained simultaneously in the RGO-Cu composites. The results shown in the present study provide an effective method to design graphene based composites with layered structure and high performance.

  14. Graphene-copper composite with micro-layered grains and ultrahigh strength

    Science.gov (United States)

    Wang, Lidong; Yang, Ziyue; Cui, Ye; Wei, Bing; Xu, Shichong; Sheng, Jie; Wang, Miao; Zhu, Yunpeng; Fei, Weidong

    2017-01-01

    Graphene with ultrahigh intrinsic strength and excellent thermal physical properties has the potential to be used as the reinforcement of many kinds of composites. Here, we show that very high tensile strength can be obtained in the copper matrix composite reinforced by reduced graphene oxide (RGO) when micro-layered structure is achieved. RGO-Cu powder with micro-layered structure is fabricated from the reduction of the micro-layered graphene oxide (GO) and Cu(OH)2 composite sheets, and RGO-Cu composites are sintered by spark plasma sintering process. The tensile strength of the 5 vol.% RGO-Cu composite is as high as 608 MPa, which is more than three times higher than that of the Cu matrix. The apparent strengthening efficiency of RGO in the 2.5 vol.% RGO-Cu composite is as high as 110, even higher than that of carbon nanotube, multilayer graphene, carbon nano fiber and RGO in the copper matrix composites produced by conventional MLM method. The excellent tensile and compressive strengths, high hardness and good electrical conductivity are obtained simultaneously in the RGO-Cu composites. The results shown in the present study provide an effective method to design graphene based composites with layered structure and high performance. PMID:28169306

  15. The Influence of Impurities and Metallic Capping Layers on the Microstructure of Copper Interconnects

    Science.gov (United States)

    Rizzolo, Michael

    As copper interconnects have scaled to ever smaller dimensions on semiconductor devices, the microstructure has become increasingly detrimental for performance and reliability. Small grains persist in interconnects despite annealing at high temperatures, leading to higher line resistance and more frequent electromigration-induced failures. Conventionally, it was believed that impurities from the electrodeposition pinned grain growth, but limitations in analytical techniques meant the effect was inferred rather than observed. Recent advances in analytical techniques, however, have enabled this work to quantify impurity content, location, and diffusion in relation to microstructural changes in electroplated copper. Surface segregation of impurities during the initial burst of grain growth was investigated. After no surface segregation was observed, a microfluidic plating cell was constructed to plate multilayer films with regions of intentionally high and low impurity concentrations to determine if grain growth could be pinned by the presence of impurities; it was not. An alternate mechanism for grain boundary pinning based on the texture of the seed layer is proposed, supported by time-resolved transmission electron microscopy and transmission electron backscatter diffraction data. The suggested model posits that the seed in narrow features has no preferred orientation, which results in rapid nucleation of subsurface grains in trench regions prior to recrystallization from the overburden down. These rapidly growing grains are able to block off several trenches from the larger overburden grains, inhibiting grain growth in narrow features. With this knowledge in hand, metallic capping layers were employed to address the problematic microstructure in 70nm lines. The capping layers (chromium, nickel, zinc, and tin) were plated on the copper overburden prior to annealing to manipulate the stress gradient and microstructural development during annealing. It appeared that

  16. Copper iodide as inorganic hole conductor for perovskite solar cells with different thickness of mesoporous layer and hole transport layer

    Science.gov (United States)

    Huangfu, Minzan; Shen, Yue; Zhu, Gongbo; Xu, Kai; Cao, Meng; Gu, Feng; Wang, Linjun

    2015-12-01

    This study is the first to report the preparation of Copper iodide (CuI) thick films by means of convenient airbrush process and their application as inorganic hole transport layers (HTL) in organo-lead halide perovskite-based solar cells. CuI thick films exhibit high conductivity, wide-band-gap and solution-processable. Organo-lead halide perovskite solar cells with different thickness of mesoporous layers and CuI hole transport layers were fabricated. Performance of the cells were mainly controlled by the thickness of TiO2 mesoporous layers. Under optimized conditions, a power conversion efficiency of 5.8% has been achieved with short-circuit current density JSC of 22.3 mA/cm2, open-circuit voltage VOC of 614 mV and fill factor of 42%. However, the VOC remains low in comparison with the state of the art perovskite-based solar cells, which is attributed to the high recombination in CuI devices as determined by impedance spectroscopy.

  17. Tolerance and bioaccumulation of copper by the entomopathogen Beauveria bassiana (Bals.-Criv.) Vuill. exposed to various copper-based fungicides.

    Science.gov (United States)

    Martins, Fátima; Soares, Maria Elisa; Oliveira, Ivo; Pereira, José Alberto; de Lourdes Bastos, Maria; Baptista, Paula

    2012-07-01

    This work evaluates for the first time the relationships between copper-tolerance, -solubilization and -bioaccumulation in the entomopathogen Beauveria bassiana exposed to Bordeaux mixture, copper oxychloride or copper hydroxide. Bordeaux mixture was highly detrimental to fungus, by inhibiting the growth totally at the recommended dose (RD) and 2×RD. Copper hydroxide and copper oxychloride were found to be less toxic, reducing fungus growth, sporulation and conidial germination in an average of 29  %, 30 % and 58 %, respectively. These two copper forms were the easiest to solubilize, to precipitate and the most accumulated by B. bassiana, suggesting the involvement of all these processes on fungus copper-tolerance.

  18. Effect of Mixing on Properties and Microstructure of Magnesium Oxychloride Cement

    Institute of Scientific and Technical Information of China (English)

    HE Zhenhui; YANG Hongjian; SONG Hui; GUO Tao; WU Songyi

    2016-01-01

    This paper investigated the effect of mixing on the properties of magnesium oxychloride cement, such as ap-parent viscosity, setting time, compressive strength, and specific strength as well. The phase composition and crystallo-graphic structure of the cement were determined by X-ray diffraction and scanning electron microscopy. The results in-dicate that the increases of stirring rate and mixing time change apparent viscosity distinctly, shorten setting time and enhance mechanical property. Magnesium oxychloride cement after mixing for 20 min exhibits the optimal mechanical performance. The effect of stirring rate on the phase composition of magnesium oxychloride cement dominates over the effect of mixing time. The increases of stirring rate and mixing time can increase the dispersion state and accelerate the neutralization, thus promoting the strength of magnesium oxychloride cement due to the formation of stable 5·1·8 phase, needle-like crystals and continuous crystalline structure in the whole cement matrix. The properties and microstructure of magnesium oxychloride cement at a stirring rate of 280 rpm are better than those at 140 rpm.

  19. Effect of Mixing on Properties and Microstructure of Magnesium Oxychloride Cement

    Institute of Scientific and Technical Information of China (English)

    HE; Zhenhui; YANG; Hongjian; SONG; Hui; GUO; Tao; WU; Songyi

    2016-01-01

    This paper investigated the effect of mixing on the properties of magnesium oxychloride cement, such as apparent viscosity, setting time, compressive strength, and specific strength as well. The phase composition and crystallographic structure of the cement were determined by X-ray diffraction and scanning electron microscopy. The results indicate that the increases of stirring rate and mixing time change apparent viscosity distinctly, shorten setting time and enhance mechanical property. Magnesium oxychloride cement after mixing for 20 min exhibits the optimal mechanical performance. The effect of stirring rate on the phase composition of magnesium oxychloride cement dominates over the effect of mixing time. The increases of stirring rate and mixing time can increase the dispersion state and accelerate the neutralization, thus promoting the strength of magnesium oxychloride cement due to the formation of stable 5·1·8 phase, needle-like crystals and continuous crystalline structure in the whole cement matrix. The properties and microstructure of magnesium oxychloride cement at a stirring rate of 280 rpm are better than those at 140 rpm.

  20. Effect of Mo Ion Implantation on Stability of Nanocrystalline Copper Surface Layers

    Directory of Open Access Journals (Sweden)

    XI Yang

    2016-08-01

    Full Text Available The surface of pure copper was modified using the surface mechanical attrition treatment (SMAT method, and molybdenum ions were implanted in the nanosurface using a metal vapor vacuum arc (MEVVA. The results of the SMAT were observed by optical microscopy (OM, X-ray diffraction (XRD and scanning electron microscopy (SEM. An obvious nanocrystalline layer and a deformation region exist on the surface. The size of the nanocrystalline layer was characterized using atomic force microscopy (AFM. The results indicate remarkable suppression on grain size, the nanocrystalline layer grows to 163nm after annealing and reduces to only 72nm due to the Mo ion implantation. In addition, the hardness of the topmost surface of the material is 3.5 times that of the SMATed copper, which is about 7 times of the value of the matrix. The above improvements most likely result from the dispersion of the Mo ions and the reactions of the crystal defects due to the SMAT and ion implantation.

  1. Thermal chemistry of copper acetamidinate atomic layer deposition precursors on silicon oxide surfaces studied by XPS

    Energy Technology Data Exchange (ETDEWEB)

    Yao, Yunxi; Zaera, Francisco, E-mail: zaera@ucr.edu [Department of Chemistry, University of California, Riverside, California 92521 (United States)

    2016-01-15

    The thermal surface chemistry of copper(I)-N,N′-di-sec-butylacetamidinate, [Cu({sup s}Bu-amd)]{sub 2}, a metalorganic complex recently proposed for the chemical-based deposition of copper films, has been characterized on SiO{sub 2} films under ultrahigh vacuum conditions by x-ray photoelectron spectroscopy (XPS). Initial adsorption at cryogenic temperatures results in the oxidation of the copper centers with Cu 2p{sub 3/2} XPS binding energies close to those seen for a +2 oxidation state, an observation that the authors interpret as the result of the additional coordination of oxygen atoms from the surface to the Cu atoms of the molecular acetamidinate dimer. Either heating to 300 K or dosing the precursor directly at that temperature leads to the loss of one of its two ligands, presumably via hydrogenation/protonation with a hydrogen/proton from a silanol group, or following a similar reaction on a defect site. By approximately 500 K the Cu 2p{sub 3/2}, C 1s, and N 1s XPS data suggest that the remaining acetamidinate ligand is displaced from the copper center and bonds to the silicon oxide directly, after which temperatures above 900 K need to be reached to promote further (and only partial) decomposition of those organic moieties. It was also shown that the uptake of the Cu precursor is self-limiting at either 300 or 500 K, although the initial chemistry is somewhat different at the two temperatures, and that the nature of the substrate also defines reactivity, with the thin native silicon oxide layer always present on Si(100) surfaces being less reactive than thicker films grown by evaporation, presumably because of the lower density of surface nucleation sites.

  2. Copper zinc tin sulfide layers prepared from solution processable metal dithiocarbamate precursors

    Energy Technology Data Exchange (ETDEWEB)

    Edler, Michael [Institute for Chemistry and Technology of Materials, Graz University of Technology, Stremayrgasse 9, 8010 Graz (Austria); Christian Doppler Laboratory for Nanocomposite Solar Cells, Graz University of Technology and NanoTecCenter Weiz, Forschungsgesellschaft mbH (Austria); Rath, Thomas, E-mail: thomas.rath@tugraz.at [Institute for Chemistry and Technology of Materials, Graz University of Technology, Stremayrgasse 9, 8010 Graz (Austria); Christian Doppler Laboratory for Nanocomposite Solar Cells, Graz University of Technology and NanoTecCenter Weiz, Forschungsgesellschaft mbH (Austria); Schenk, Alexander [Institute for Chemistry and Technology of Materials, Graz University of Technology, Stremayrgasse 9, 8010 Graz (Austria); Fischereder, Achim [Institute for Chemistry and Technology of Materials, Graz University of Technology, Stremayrgasse 9, 8010 Graz (Austria); Christian Doppler Laboratory for Nanocomposite Solar Cells, Graz University of Technology and NanoTecCenter Weiz, Forschungsgesellschaft mbH (Austria); Haas, Wernfried [Christian Doppler Laboratory for Nanocomposite Solar Cells, Graz University of Technology and NanoTecCenter Weiz, Forschungsgesellschaft mbH (Austria); Institute for Electron Microscopy and Fine Structure Research, Graz University of Technology, Steyrergasse 17, 8010 Graz (Austria); Edler, Matthias [Chair of Chemistry of Polymeric Materials, University of Leoben, Otto Gloeckel-Strasse 2, 8700 Leoben (Austria); Chernev, Boril [Institute for Electron Microscopy and Fine Structure Research, Graz University of Technology, Steyrergasse 17, 8010 Graz (Austria); Kunert, Birgit [Institute of Solid State Physics, Graz University of Technology, Petersgasse 16, 8010 Graz (Austria); Hofer, Ferdinand [Institute for Electron Microscopy and Fine Structure Research, Graz University of Technology, Steyrergasse 17, 8010 Graz (Austria); and others

    2012-10-15

    In this contribution we present a solution based route toward copper zinc tin sulfide - CZTS - layers using metal dithiocarbamate precursors. We focus on the synthesis of the precursor materials as well as on the fabrication of thin CZTS layers at low temperatures of 350 Degree-Sign C and their characterization. Powder X-ray diffraction measurements show that a precursor solution containing an excess of the zinc precursor, compared to the Cu and Sn precursors, has to be used to obtain CZTS films without secondary phases. Thus, the prepared films are Zn-rich, which is beneficial for solar cell applications. Raman as well as X-ray photoelectron spectroscopy studies confirm the formation of CTZS. No clear evidence for free ZnS has been found. Electron microscopy shows agglomerates of 10 nm-sized crystallites forming spherical particles with a diameter between 50 nm and 400 nm. The prepared films possess high optical absorption (>1.10{sup 4} cm{sup -1}) and an optical band gap of approximately 1.6 eV. Highlights: Black-Right-Pointing-Pointer CZTS layers are prepared from metal dithiocarbamate precursor solu-tions. Black-Right-Pointing-Pointer No additional sulfur sources or capping agents are necessary. Black-Right-Pointing-Pointer Prepared CZTS layers are zinc rich. Black-Right-Pointing-Pointer CZTS layers show a high absorption coefficient and a band gap of 1.6 eV.

  3. Heat load behaviors of plasma sprayed tungsten coatings on copper alloys with different compliant layers

    Energy Technology Data Exchange (ETDEWEB)

    Chong, F.L. [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031 (China)], E-mail: flch@ipp.ac.cn; Chen, J.L.; Li, J.G. [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031 (China); Hu, D.Y.; Zheng, X.B. [Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200051 (China)

    2008-04-15

    Plasma sprayed tungsten (PS-W) coatings with the compliant layers of titanium (Ti), nickel-chromium-aluminum (NiCrAl) alloys and W/Cu mixtures were fabricated on copper alloys, and their properties of the porosity, oxygen content, thermal conductivity and bonding strength were measured. High heat flux tests of actively cooled W coatings were performed by means of an electron beam facility. The results indicated that APS-W coating showed a poorer heat transfer capability and thermo-mechanical properties than VPS-W coating, and the compliant layers improved W coating performance under the heat flux load. Among three compliant layers, W/Cu was the preferable because of its better effects on heat removal and stress alleviating. The optimization of W/Cu compliant layer found that 0.1 mm and 25 vol.%W was optimum compliant layer structure for 1 mm W coating, which induced a 23% reduction of the maximum stress compared to the sharp interface, and the plastic strain was reduced to 0.01% from 1.55%.

  4. Heat load behaviors of plasma sprayed tungsten coatings on copper alloys with different compliant layers

    Science.gov (United States)

    Chong, F. L.; Chen, J. L.; Li, J. G.; Hu, D. Y.; Zheng, X. B.

    2008-04-01

    Plasma sprayed tungsten (PS-W) coatings with the compliant layers of titanium (Ti), nickel-chromium-aluminum (NiCrAl) alloys and W/Cu mixtures were fabricated on copper alloys, and their properties of the porosity, oxygen content, thermal conductivity and bonding strength were measured. High heat flux tests of actively cooled W coatings were performed by means of an electron beam facility. The results indicated that APS-W coating showed a poorer heat transfer capability and thermo-mechanical properties than VPS-W coating, and the compliant layers improved W coating performance under the heat flux load. Among three compliant layers, W/Cu was the preferable because of its better effects on heat removal and stress alleviating. The optimization of W/Cu compliant layer found that 0.1 mm and 25 vol.%W was optimum compliant layer structure for 1 mm W coating, which induced a 23% reduction of the maximum stress compared to the sharp interface, and the plastic strain was reduced to 0.01% from 1.55%.

  5. Suppression of conductivity deterioration of copper thin films by coating with atomic-layer materials

    Science.gov (United States)

    Cuong, Nguyen Thanh; Okada, Susumu

    2017-03-01

    Theoretical calculations are performed to explore the electronic structures and electron conducting properties of copper (Cu) thin films coated with graphene or h-boron-nitride (h-BN) layers. The Shockley surface states of Cu surfaces are preserved by the graphene and h-BN coatings which prevent the surface oxidation of Cu because of the weak interaction between the Cu surface and graphene or the h-BN layers. Furthermore, the Shockley surface states in Cu thin films possess quasi-two dimensional free-electron characteristics and exhibit a high conductivity of 1.62 × 107 (Ωm)-1 at room temperature. These hybrid structures may be suitable as interconnects in memory devices that can stably store data for long periods.

  6. Efficient organic solar cells using copper(I) iodide (CuI) hole transport layers

    Energy Technology Data Exchange (ETDEWEB)

    Peng, Ying [Key Laboratory of Luminescence and Optical Information, Ministry of Education, Institute of Optoelectronic Technology, Beijing Jiaotong University, Beijing 100044 (China); Department of Physics and Centre for Plastic Electronics, Blackett Laboratory, Imperial College London, London SW7 2AZ (United Kingdom); Yaacobi-Gross, Nir; Perumal, Ajay K.; Faber, Hendrik A.; Bradley, Donal D. C.; Anthopoulos, Thomas D., E-mail: zhqhe@bjtu.edu.cn, E-mail: t.anthopoulos@imperial.ac.uk [Department of Physics and Centre for Plastic Electronics, Blackett Laboratory, Imperial College London, London SW7 2AZ (United Kingdom); Vourlias, George; Patsalas, Panos A. [Department of Physics, Laboratory of Applied Physics, Aristotle University of Thessaloniki, GR-54124 Thessaloniki (Greece); He, Zhiqun, E-mail: zhqhe@bjtu.edu.cn, E-mail: t.anthopoulos@imperial.ac.uk [Key Laboratory of Luminescence and Optical Information, Ministry of Education, Institute of Optoelectronic Technology, Beijing Jiaotong University, Beijing 100044 (China)

    2015-06-15

    We report the fabrication of high power conversion efficiency (PCE) polymer/fullerene bulk heterojunction (BHJ) photovoltaic cells using solution-processed Copper (I) Iodide (CuI) as hole transport layer (HTL). Our devices exhibit a PCE value of ∼5.5% which is equivalent to that obtained for control devices based on the commonly used conductive polymer poly(3,4-ethylenedioxythiophene): polystyrenesulfonate as HTL. Inverted cells with PCE >3% were also demonstrated using solution-processed metal oxide electron transport layers, with a CuI HTL evaporated on top of the BHJ. The high optical transparency and suitable energetics of CuI make it attractive for application in a range of inexpensive large-area optoelectronic devices.

  7. Efficient organic solar cells using copper(I) iodide (CuI) hole transport layers

    Science.gov (United States)

    Peng, Ying; Yaacobi-Gross, Nir; Perumal, Ajay K.; Faber, Hendrik A.; Vourlias, George; Patsalas, Panos A.; Bradley, Donal D. C.; He, Zhiqun; Anthopoulos, Thomas D.

    2015-06-01

    We report the fabrication of high power conversion efficiency (PCE) polymer/fullerene bulk heterojunction (BHJ) photovoltaic cells using solution-processed Copper (I) Iodide (CuI) as hole transport layer (HTL). Our devices exhibit a PCE value of ˜5.5% which is equivalent to that obtained for control devices based on the commonly used conductive polymer poly(3,4-ethylenedioxythiophene): polystyrenesulfonate as HTL. Inverted cells with PCE >3% were also demonstrated using solution-processed metal oxide electron transport layers, with a CuI HTL evaporated on top of the BHJ. The high optical transparency and suitable energetics of CuI make it attractive for application in a range of inexpensive large-area optoelectronic devices.

  8. Determination of sulphur and copper depth distribution in patina layers using nuclear reaction techniques

    Energy Technology Data Exchange (ETDEWEB)

    Kalliabakos, G.; Kossionides, S.; Misailides, P.; Papadopoulos, C.T.; Vlastou, R. E-mail: vlastou@central.ntua.gr

    2000-10-01

    A method for Cu and S profiling in patina layers was developed by applying a combination of nuclear reaction analysis (NRA) and Rutherford backscattering spectroscopy (RBS). The copper profiling was performed by using the 1327 keV {gamma}-ray deexciting the third excited state to the ground state of {sup 63}Cu produced by the reaction {sup 63}Cu(p,p{sup '}{gamma}){sup 63}Cu. For the determination of sulphur the 2230 keV {gamma}-ray was used deexciting the first excited state to the ground state of {sup 32}S formed through the reaction {sup 32}S(p,p{sup '}{gamma}){sup 32}S, which exhibits three sharp resonances at projectile energies 3.094, 3.195 and 3.379 MeV. The relevant cross-sections were measured in the energy range between 3.0 and 3.7 MeV in steps of 20 keV at 125 deg. to the incident proton beam direction. The technique was tested using artificially produced and natural copper patina layers. Supporting information on the depth distribution of the constituent elements of the patina samples was obtained by p-RBS (E{sub p}: 1.5 MeV, {theta}: 160 deg.)

  9. Effects of Implant Copper Layer on Diamond Film Deposition on Cemented Carbides

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    The deposition of high-quality diamond films and their adhesion on cemented carbides are strongly influenced by the catalytic effect of cobalt under typical deposition conditions.Decreasing Co content on the surface of the cemented carbide is often used for the diamond filmdeposition. But the leaching of Co from the WC-Co substrate leading to a mechanical weak surface often causes a poor adhesion. In this paper we adopted an implant copper layer preparedby vaporization to improve the mechanical properties of the Co-leached substrate. The diamondfilms were grown by microwave plasma chemical vapor deposition from CH4 :H2 gas mixture. Thecross section and the morphology of the diamond film were characterized by scanning electronmicroscopy (SEM). The non-diamond content in the film was analyzed by Raman spectroscopy.The effects of pretreatment on the concentrations of Co and Cu near the interfacial region wereexamined by energy dispersive spectrum (EDS) equipped with SEM. The adhesion of the diamondon the substrate was evaluated with a Rockwell-type hardness tester. The results indicate that thediamond films prepared with implant copper layer have a good adhesion to the cemented carbidesubstrate due to the recovery of the mechanical properties of the Co-depleted substrate after thecopper implantation and the formation of less amorphous carbon between the substrate and thediamond film.

  10. Influence of Copper Layer Content in the Elastic and Damping Behavior of Glass-Fiber/Epoxy-Resin Composites

    Science.gov (United States)

    Carneiro, V. H.; Capela, P.; Teixeira, J. C.; Teixeira, S.; Cerqueira, F.; Macedo, F.; Ribas, L.; Soares, D.

    2016-12-01

    The impact in the elastic behavior and internal friction, caused by the introduction of Copper layers in Glass-Fiber/Epoxy Resin composites and temperature effects, were studied and evaluated recurring to Dynamic Mechanical Analysis. It is shown that the introduction of Copper layers increases the storage modulus of the composites and delays their glass transition temperature, however, it allows a faster transformation. Additionally, it is concluded that the introduction of Copper layers elevates the internal friction during the glass transition phase by the inversion of the deformation mechanism due to thermal expansion and increase in the Poisson's ratio of the epoxy resin to a value near 0.5 where its deformation is approximately isochoric. This increase in damping capacity is relevant in application with cyclic fatigue and mechanical vibration.

  11. Magnetic characterization of the nickel layer protecting the copper wires in harsh applications

    Directory of Open Access Journals (Sweden)

    Roger Daniel

    2017-06-01

    Full Text Available High Temperature (HT° motor coils open new perspectives for extending the applications of electrical motors or generators to very harsh environments or for designing very high power density machines working with high internal temperature gradients. Over a temperature of 300°C, the classic enameled wire cannot work permanently, the turn-to-turn insulation must be inorganic and made with high temperature textiles or vitro-ceramic compounds. For both cases, a diffusion barrier must protect the copper wire against oxidation. The usual solution consists of adding a nickel layer that yields an excellent chemical protection. Unfortunately, the nickel has ferromagnetic properties that change a lot the skin effect in the HT wire at high frequencies. For many applications such as aeronautics, electrical machines are always associated with PWM inverters for their control. The windings must resist to high voltage short spikes caused by the fast fronted pulses imposed by the feeding inverter. The nickel protection layer of the HT° inorganic wire has a large influence on the high frequency behavior of coils and, consequently, on the magnitude of the voltage spikes. A good knowledge of the non-linear magnetic characteristics of this nickel layer is helpful for designing reliable HT inorganic coils. The paper presents a method able to characterize non-linear electromagnetic properties of this nickel layer up to 500°C.

  12. Efficient electron-induced removal of oxalate ions and formation of copper nanoparticles from copper(II oxalate precursor layers

    Directory of Open Access Journals (Sweden)

    Kai Rückriem

    2016-06-01

    Full Text Available Copper(II oxalate grown on carboxy-terminated self-assembled monolayers (SAM using a step-by-step approach was used as precursor for the electron-induced synthesis of surface-supported copper nanoparticles. The precursor material was deposited by dipping the surfaces alternately in ethanolic solutions of copper(II acetate and oxalic acid with intermediate thorough rinsing steps. The deposition of copper(II oxalate and the efficient electron-induced removal of the oxalate ions was monitored by reflection absorption infrared spectroscopy (RAIRS. Helium ion microscopy (HIM reveals the formation of spherical nanoparticles with well-defined size and X-ray photoelectron spectroscopy (XPS confirms their metallic nature. Continued irradiation after depletion of oxalate does not lead to further particle growth giving evidence that nanoparticle formation is primarily controlled by the available amount of precursor.

  13. Sr2(Nd, Ce)2MCu2O9, M=Al, Co, Ga. A new layered copper oxide structure type

    NARCIS (Netherlands)

    Cava, R.J.; Zandbergen, H.W.; Krajewski, J.J.; Peck Jr., W.F.; Hessen, B.; Dover, R.B. Van; Cheong, S.-W.

    1992-01-01

    A new layered copper oxide structure type is reported based on the ordered interleaving of AlO4, CoO4 or GaO4 tetrahedra between the apices of copper oxide pyramids, and an (Nd, Ce)2O2 fluorite layer between the bases of the pyramids. Despite the structural similarities to the recently reported Sr2(

  14. Low band gap polymeric solar cells using solution-processable copper iodide as hole transporting layer

    Science.gov (United States)

    Chaudhary, Neeraj; Kesari, J. P.; Chaudhary, Rajiv; Patra, Asit

    2016-08-01

    In the present work, we have shown the performance of solution-processable copper iodide (CuI) as an alternative hole transporting layer (HTL) for polymeric solar cells. Optical spectra of the CuI thin film reveal highly transparent and practically no absorption in the range vis-NIR region (450-1110 nm). X-ray diffraction (XRD) patterns of CuI exhibits as a p-type semiconductor as well as crystalline nature. The photovoltaic devices were fabricated using PCDTBT and PTB7 as donor materials blended with PC71BM as an acceptor material. The power conversion efficiencies (PCEs) based on CuI as an HTL have been achieved to up to 3.04% and 4.48% for PCDTBT and PTB7 based donor materials respectively with a configuration based on ITO/CuI(40 nm)/active layer (60 nm)/Al (120 nm). This study clearly indicated that the devices made with CuI as an HTL showed superior performance than the device fabricated from PEDOT:PSS layer as an HTL. Morphological characterization of the HTL using scanning electron microscopy (SEM) and atomic force microscope (AFM) were carried for better understanding.

  15. Controlled growth of few-layer hexagonal boron nitride on copper foils using ion beam sputtering deposition.

    Science.gov (United States)

    Wang, Haolin; Zhang, Xingwang; Meng, Junhua; Yin, Zhigang; Liu, Xin; Zhao, Yajuan; Zhang, Liuqi

    2015-04-01

    Ion beam sputtering deposition (IBSD) is used to synthesize high quality few-layer hexagonal boron nitride (h-BN) on copper foils. Compared to the conventional chemical vapor deposition, the IBSD technique avoids the use of unconventional precursors and is much easier to control, which should be very useful for the large-scale production of h-BN in the future.

  16. Thermal Annealing Effect on Poly(3-hexylthiophene: Fullerene:Copper-Phthalocyanine Ternary Photoactive Layer

    Directory of Open Access Journals (Sweden)

    H. Derouiche

    2013-01-01

    Full Text Available We have fabricated poly(3-hexylthiophene (P3HT/copper phthalocyanine (CuPc/fullerene (C60 ternary blend films. This photoactive layer is sandwiched between an indium tin oxide (ITO/poly(3,4-ethylenedioxythiophene:poly(styrene sulfonate (PEDOT/PSS photoanode and a bathocuproine (BCP/aluminium photocathode. The thin films have been characterized by atomic force microscope (AFM and ultraviolet/visible spectroscopy in order to study the influence of P3HT doping on the morphological and optical properties of the photoactive layer. We have also compared the characteristics of three different organic solar cells: ITO/PEDOT:PSS/CuPc0.5:C600.5/BCP/Al and ITO/PEDOT:PSS/P3HT0.3:CuPc0.3:C600.4/BCP/Al with and without annealing. Both structures show good photovoltaic behaviour. Indeed, the incorporation of P3HT into CuPc:C60 thin film improves all the photovoltaic characteristics. We have also seen that thermal annealing significantly improves the optical absorption ability and stabilizes the organic solar cells making it more robust to chemical degradation.

  17. Evaluation of the Mechanical Properties of Multi-nano Layered Copper-Nickel Thin Film by the Dynamic-Nano Indentation Method

    Science.gov (United States)

    Choi, Yong

    2016-11-01

    The dynamic nano-indentation method was applied to study the effect of interface moving behavior with heat treatment on the nano-mechanical properties of multi-nano-layered copper-nickel thin film. Layer-by-layer depositions of copper and nickel of nano-sized thickness were prepared by two-step pulse electro-deposition in a modified copper-nickel sulfate bath at 25°C. The multi-layered copper-nickel thin sheet was composed of a 20-nm-thick copper-rich nickel phase, and a 25-nm-thick nickel-rich copper phase. Thermal vacuum annealing influenced the interface morphology between copper and nickel nano-layers. Inter-diffusion mainly occurred after annealing at 500°C for 6 h. The interface disappeared after annealing at 600°C to form a completely solid solution. Thermal annealing reduced the nano-hardness and elastic recovery. The average nano-hardness of the multi-layered nano-copper-nickel thin film for the specimens of as-received, 300°C, 500°C and 600°C were 7.9 Gpa, 6.1 Gpa, 4.7 Gpa and 3.0 GPa, respectively. The elastic stiffness was 15.77 × 104 Nm-1 for the as-received specimen, which finally became 2.98 × 104 Nm-1 for the specimen after annealing at 600°C for 6 h.

  18. Surface layer structure and average contact temperature of copper-containing materials under dry sliding with high electric current density

    Science.gov (United States)

    Fadin, V. V.; Aleutdinova, M. I.; Rubtsov, V. Ye.; Aleutdinov, K. A.

    2016-11-01

    Dry sliding of copper and powder composites of Cu-Fe and Cu-Fe-graphite compositions against 1045 steel under electric current of contact density higher than 250 A/cm2 has been studied, which demonstrated the change in surface layer structure and formation of tribolayer consisting of iron, copper and FeO oxide. Signs of quasi-viscous flow of worn surface were observed. It was noted that the thin contact layer containing about 40 at % of oxygen and 40% of Fe was the main factor decreasing the adhesion interaction. It was affirmed that the introduction of graphite into the primary structure of the composite leads to rather low content of FeO oxide and to the increased tendency of surface layer to catastrophic deterioration under sliding with contact current density of about 300 A/cm2. The temperature of contact did not exceed 400°C.

  19. Low-cost copper complexes as p-dopants in solution processable hole transport layers

    Energy Technology Data Exchange (ETDEWEB)

    Kellermann, Renate [Department for Materials Science and Engineering, Chair for Materials for Electronics and Energy Technology, Friedrich-Alexander-University Erlangen-Nuremberg, Erlangen 91058 (Germany); Siemens AG – Corporate Technology, Guenther-Scharowsky-Str. 1, Erlangen 91058 (Germany); Taroata, Dan; Maltenberger, Anna; Hartmann, David; Schmid, Guenter [Siemens AG – Corporate Technology, Guenther-Scharowsky-Str. 1, Erlangen 91058 (Germany); Brabec, Christoph J. [Department for Materials Science and Engineering, Chair for Materials for Electronics and Energy Technology, Friedrich-Alexander-University Erlangen-Nuremberg, Erlangen 91058 (Germany)

    2015-09-07

    We demonstrate the usage of the Lewis-acidic copper(II)hexafluoroacetylacetonate (Cu(hfac){sub 2}) and copper(II)trifluoroacetylacetonate (Cu(tfac){sub 2}) as low-cost p-dopants for conductivity enhancement of solution processable hole transport layers based on small molecules in organic light emitting diodes (OLEDs). The materials were clearly soluble in mixtures of environmentally friendly anisole and xylene and spin-coated under ambient atmosphere. Enhancements of two and four orders of magnitude, reaching 4.0 × 10{sup −11} S/cm with a dopant concentration of only 2 mol% Cu(hfac){sub 2} and 1.5 × 10{sup −9} S/cm with 5 mol% Cu(tfac){sub 2} in 2,2′,7,7′-tetra(N,N-ditolyl)amino-9,9-spiro-bifluorene (spiro-TTB), respectively, were achieved. Red light emitting diodes were fabricated with reduced driving voltages and enhanced current and power efficiencies (8.6 lm/W with Cu(hfac){sub 2} and 5.6 lm/W with Cu(tfac){sub 2}) compared to the OLED with undoped spiro-TTB (3.9 lm/W). The OLED with Cu(hfac){sub 2} doped spiro-TTB showed an over 8 times improved LT{sub 50} lifetime of 70 h at a starting luminance of 5000 cd/m{sup 2}. The LT{sub 50} lifetime of the reference OLED with PEDOT:PSS was only 8 h. Both non-optimized OLEDs were operated at similar driving voltage and power efficiency.

  20. Bifunctional sensor of pentachlorophenol and copper ions based on nanostructured hybrid films of humic acid and exfoliated layered double hydroxide via a facile layer-by-layer assembly.

    Science.gov (United States)

    Yuan, Shuang; Peng, Dinghua; Hu, Xianluo; Gong, Jingming

    2013-06-27

    A new, highly sensitive bifunctional electrochemical sensor for the simultaneous determination of pentachlorophenol (PCP) and copper ions (Cu(2+)) has been developed, where organic-inorganic hybrid ultrathin films were fabricated by alternate assembly of humic acid (HA) and exfoliated Mg-Al-layered double hydroxide (LDH) nanosheets onto ITO substrates via a layer-by-layer (LBL) approach. The multilayer films were then characterized by means of UV-vis spectrometry, scanning electron microscopy (SEM), and atomic force microscope (AFM). These films were found to have a relatively smooth surface with almost equal amounts of HA incorporated in each cycle. Its electrochemical performance was systematically investigated. Our results demonstrate that such a newly designed (LDH/HA)n multilayer films, combining the individual properties of HA (dual recognition ability for organic herbicides and metal ions) together with LDH nanosheets (a rigid inorganic matrix), can be applied to the simultaneous analysis of PCP and Cu(II) without interference from each other. The LBL assembled nanoarchitectures were further investigated by X-ray photoelectron spectroscopy (XPS) and infrared spectroscopy (IR), which provides insight for bifunctional sensing behavior. Under the optimized conditions, the detection limit was found to be as low as 0.4 nM PCP, well below the guideline value of PCP in drinking water (3.7 nM) set by the United States Environmental Protection Agency (U.S. EPA), and 2.0 nM Cu(2+), much below the guideline value (2.0 mg L(-1), ~31.2 nM) from the World Health Organization (WHO), respectively. Toward the goal for practical applications, this simple and cost-effective probe was further evaluated by monitoring PCP and Cu(II) in water samples.

  1. Structural And Electrical Properties Of The Selected Rare-Earth Oxychlorides

    Directory of Open Access Journals (Sweden)

    Dziubaniuk M.

    2015-09-01

    Full Text Available The preparation and sintering conditions of the selected rare-earth oxychlorides REOCl (Re=La, Nd, Sm, Gd were determined. The purity of materials phase compositions was confirmed by X-ray diffraction method. Further analysis of the data enabled lattice parameters and average grain size determination. The electrical properties of the single phase REOCl materials were investigated by Electrochemical Impedance Spectroscopy in wide temperature range in atmospheric air. The spectra were analyzed by the equivalent circuit fitting. Basing on the values of equivalent circuits parameters the specific conductivities were calculated and presented in the Arrhenius coordinates. Energies of activation were calculated. The determined structural and electrical properties of four different rare-earth oxychlorides were directly compared.

  2. Effect of treatment time on characterization and properties of nanocrystalline surface layer in copper induced by surface mechanical attrition treatment

    Indian Academy of Sciences (India)

    Farzad Kargar; M Laleh; T Shahrabi; A Sabour Rouhaghdam

    2014-08-01

    Nanocrystalline surface layers were synthesized on pure copper by means of surface mechanical attrition treatment (SMAT) at various treatment times. The microstructural features of the surface layers produced by SMAT were systematically characterized by optical microscopy (OM), transmission electron microscopy (TEM) and X-ray diffraction (XRD) analysis. Hardness and surface roughness measurements were also carried out. It is found that the thickness of the deformed layer increased from 50 to 500 m with increasing treatment time from 10 to 300 min, while the average grain size of the top surface layer decreased from 20 to 7 nm. Hardness of the all SMATed samples decreased with depth. Furthermore, the hardness of the top surface layer of the SMATed samples was at least two times higher than that of the un-treated counterpart. Surface roughness results showed different trend with treatment time. Amounts of PV and a values first sharply increased and then decreased.

  3. Silver-Copper Nanoalloy Catalyst Layer for Bifunctional Air Electrodes in Alkaline Media.

    Science.gov (United States)

    Wu, Xiaoqiang; Chen, Fuyi; Jin, Yachao; Zhang, Nan; Johnston, Roy L

    2015-08-19

    A carbon-free and binder-free catalyst layer composed of a Ag-Cu nanoalloy on Ni foam was used as the air cathode in a zinc-air battery for the first time. The Ag-Cu catalyst was prepared using pulsed laser deposition. The structures of the catalysts were found to consist of crystalline Ag-Cu nanoalloy particles with an average size of 2.58 nm embedded in amorphous Cu films. As observed in the X-ray photoelectron spectra, the Ag 3d core levels shifted to higher binding energies, whereas the Cu 2p core levels shifted to lower binding energies, indicating alloying of the silver and copper. Rotating disk electrode measurements indicated that the oxygen reduction reaction (ORR) proceeded through a four-electron pathway on the Ag50Cu50 and Ag90Cu10 nanoalloy catalysts in alkaline solution. Moreover, the catalytic activity of Ag50Cu50 in the ORR is more efficient than that of Ag90Cu10. By performing charge and discharge cycling measurements, the Ag50Cu50 catalyst layer was confirmed to have a maximum power density of approximately 86.3 mW cm(-2) and an acceptable cell voltage at 0.863 V for current densities up to 100 mA cm(-2) in primary zinc-air batteries. In addition, a round-trip efficiency of approximately 50% at a current density of 20 mA cm(-2) was also obtained in the test.

  4. Evolution of electronic states in n-type copper oxide superconductor via electric double layer gating.

    Science.gov (United States)

    Jin, Kui; Hu, Wei; Zhu, Beiyi; Kim, Dohun; Yuan, Jie; Sun, Yujie; Xiang, Tao; Fuhrer, Michael S; Takeuchi, Ichiro; Greene, Richard L

    2016-01-01

    The occurrence of electrons and holes in n-type copper oxides has been achieved by chemical doping, pressure, and/or deoxygenation. However, the observed electronic properties are blurred by the concomitant effects such as change of lattice structure, disorder, etc. Here, we report on successful tuning the electronic band structure of n-type Pr2-xCexCuO4 (x = 0.15) ultrathin films, via the electric double layer transistor technique. Abnormal transport properties, such as multiple sign reversals of Hall resistivity in normal and mixed states, have been revealed within an electrostatic field in range of -2 V to + 2 V, as well as varying the temperature and magnetic field. In the mixed state, the intrinsic anomalous Hall conductivity invokes the contribution of both electron and hole-bands as well as the energy dependent density of states near the Fermi level. The two-band model can also describe the normal state transport properties well, whereas the carrier concentrations of electrons and holes are always enhanced or depressed simultaneously in electric fields. This is in contrast to the scenario of Fermi surface reconstruction by antiferromagnetism, where an anti-correlation is commonly expected.

  5. Evolution of electronic states in n-type copper oxide superconductor via electric double layer gating

    Science.gov (United States)

    Jin, Kui; Hu, Wei; Zhu, Beiyi; Kim, Dohun; Yuan, Jie; Sun, Yujie; Xiang, Tao; Fuhrer, Michael S.; Takeuchi, Ichiro; Greene, Richard. L.

    2016-01-01

    The occurrence of electrons and holes in n-type copper oxides has been achieved by chemical doping, pressure, and/or deoxygenation. However, the observed electronic properties are blurred by the concomitant effects such as change of lattice structure, disorder, etc. Here, we report on successful tuning the electronic band structure of n-type Pr2−xCexCuO4 (x = 0.15) ultrathin films, via the electric double layer transistor technique. Abnormal transport properties, such as multiple sign reversals of Hall resistivity in normal and mixed states, have been revealed within an electrostatic field in range of −2 V to + 2 V, as well as varying the temperature and magnetic field. In the mixed state, the intrinsic anomalous Hall conductivity invokes the contribution of both electron and hole-bands as well as the energy dependent density of states near the Fermi level. The two-band model can also describe the normal state transport properties well, whereas the carrier concentrations of electrons and holes are always enhanced or depressed simultaneously in electric fields. This is in contrast to the scenario of Fermi surface reconstruction by antiferromagnetism, where an anti-correlation is commonly expected. PMID:27221198

  6. Effects of Au nanoparticle addition to hole transfer layer in organic solar cells based on copper naphthalocyanine and fullerene

    Directory of Open Access Journals (Sweden)

    Akihiko Nagata

    2014-06-01

    Full Text Available Organic solar cells based on copper naphthalocyanine (CuNc and fullerene (C60 were fabricated, and their photovoltaic properties were investigated. C60 and CuNc were used as n-type and p-type semiconductors, respectively. In addition, the effect of Au nanoparticle addition on a hole transfer layer was investigated, and the power conversion efficiency of the devices was improved after blending the Au nanoparticles into the hole transport layer. Nanostructures of Au nanoparticles were investigated by transmission electron microscopy and X-ray diffraction. Energy levels of molecules were calculated by molecular orbital calculations, and the nanostructure and electronic properties were discussed.

  7. Effects of Au nanoparticle addition to hole transfer layer in organic solar cells based on copper naphthalocyanine and fullerene

    Institute of Scientific and Technical Information of China (English)

    Akihiko Nagata; Takeo Okun; Tsuyoshi Akiyaman; Atsushi Suzuki

    2014-01-01

    Organic solar cells based on copper naphthalocyanine (CuNc) and fullerene (C60) were fabricated, and their photovoltaic properties were investigated. C60 and CuNc were used as n-type and p-type semiconductors, respectively. In addition, the effect of Au nanoparticle addition on a hole transfer layer was investigated, and the power conversion efficiency of the devices was improved after blending the Au nanoparticles into the hole transport layer. Nanostructures of Au nanoparticles were investigated by transmission electron microscopy and X-ray diffraction. Energy levels of molecules were calculated by molecular orbital calculations, and the nanostructure and electronic properties were discussed.

  8. Effect of native oxide layers on copper thin-film tensile properties: A reactive molecular dynamics study

    Energy Technology Data Exchange (ETDEWEB)

    Skarlinski, Michael D., E-mail: michael.skarlinski@rochester.edu [Materials Science Program, University of Rochester, Rochester, New York 14627 (United States); Quesnel, David J. [Materials Science Program, University of Rochester, Rochester, New York 14627 (United States); Department of Mechanical Engineering, University of Rochester, Rochester, New York 14627 (United States)

    2015-12-21

    Metal-oxide layers are likely to be present on metallic nano-structures due to either environmental exposure during use, or high temperature processing techniques such as annealing. It is well known that nano-structured metals have vastly different mechanical properties from bulk metals; however, difficulties in modeling the transition between metallic and ionic bonding have prevented the computational investigation of the effects of oxide surface layers. Newly developed charge-optimized many body [Liang et al., Mater. Sci. Eng., R 74, 255 (2013)] potentials are used to perform fully reactive molecular dynamics simulations which elucidate the effects that metal-oxide layers have on the mechanical properties of a copper thin-film. Simulated tensile tests are performed on thin-films while using different strain-rates, temperatures, and oxide thicknesses to evaluate changes in yield stress, modulus, and failure mechanisms. Findings indicate that copper-thin film mechanical properties are strongly affected by native oxide layers. The formed oxide layers have an amorphous structure with lower Cu-O bond-densities than bulk CuO, and a mixture of Cu{sub 2}O and CuO charge character. It is found that oxidation will cause modifications to the strain response of the elastic modulii, producing a stiffened modulii at low temperatures (<75 K) and low strain values (<5%), and a softened modulii at higher temperatures. While under strain, structural reorganization within the oxide layers facilitates brittle yielding through nucleation of defects across the oxide/metal interface. The oxide-free copper thin-film yielding mechanism is found to be a tensile-axis reorientation and grain creation. The oxide layers change the observed yielding mechanism, allowing for the inner copper thin-film to sustain an FCC-to-BCC transition during yielding. The mechanical properties are fit to a thermodynamic model based on classical nucleation theory. The fit implies that the oxidation of the

  9. Role of graphene layers on the radiation resistance of copper-graphene nanocomposite: Inhibiting the expansion of thermal spike

    Science.gov (United States)

    Huang, Hai; Tang, Xiaobin; Chen, Feida; Liu, Jian; Chen, Da

    2017-09-01

    Metal-graphene nanocomposites are expected to have excellent radiation resistance. The intrinsic role of the graphene layers (GrLs) in their performance has not been fully understood. Five copper-graphene nanocomposite (CGNC) systems were used to investigate the detailed mechanisms underpinning this behaviour by atomistic simulation. Results showed that GrLs can reduce the formation, growth, and intensity of the thermal spike of CGNC; this effect became more evident with the increasing number of layers of graphene. The role of the GrLs can be explained by three mechanisms: first, the ultra-strength C-C bonds of graphene hindered the penetration of high-energy atoms, second, the number of recoiled atoms decreased with the increasing number of layers of graphene, and third, the energy dissipation along the graphene planes also indirectly weakened the damage caused to the entire system. These mechanisms may provide a pathway to prevent material degradation in extreme radiation environments.

  10. Rapid and Efficient Synthesis of ω-Alkylenediphosphoric Acids from Phosphorus Oxychloride

    Directory of Open Access Journals (Sweden)

    Dalila Meziane

    2016-01-01

    Full Text Available The aim of this investigation was to develop an efficient, rapid, and selective method for the synthesis of ω-alkylenediphosphoric acids (HO2(OP-O-CH2n-O-P(O(OH2 from reaction of several diols with phosphorus oxychloride. The reaction was investigated using three methodologies: (i presence of a base, (ii classical heating, and (iii use of microwave irradiation. Influence of reaction temperature and molar ratio of reagents, as well as the nature of the solvent, was studied using these three different methods.

  11. Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper.

    Science.gov (United States)

    Wang, Quanlong; Bai, Qingshun; Chen, Jiaxuan; Su, Hao; Wang, Zhiguo; Xie, Wenkun

    2015-12-01

    Large-scale molecular dynamics simulation is performed to study the nano-cutting process of single crystal copper realized by single-point diamond cutting tool in this paper. The centro-symmetry parameter is adopted to characterize the subsurface deformed layers and the distribution and evolution of the subsurface defect structures. Three-dimensional visualization and measurement technology are used to measure the depth of the subsurface deformed layers. The influence of cutting speed, cutting depth, cutting direction, and crystallographic orientation on the depth of subsurface deformed layers is systematically investigated. The results show that a lot of defect structures are formed in the subsurface of workpiece during nano-cutting process, for instance, stair-rod dislocations, stacking fault tetrahedron, atomic clusters, vacancy defects, point defects. In the process of nano-cutting, the depth of subsurface deformed layers increases with the cutting distance at the beginning, then decreases at stable cutting process, and basically remains unchanged when the cutting distance reaches up to 24 nm. The depth of subsurface deformed layers decreases with the increase in cutting speed between 50 and 300 m/s. The depth of subsurface deformed layer increases with cutting depth, proportionally, and basically remains unchanged when the cutting depth reaches over 6 nm.

  12. Direct electroplating of copper on tantalum from ionic liquids in high vacuum: origin of the tantalum oxide layer.

    Science.gov (United States)

    Schaltin, Stijn; D'Urzo, Lucia; Zhao, Qiang; Vantomme, André; Plank, Harald; Kothleitner, Gerald; Gspan, Christian; Binnemans, Koen; Fransaer, Jan

    2012-10-21

    In this paper, it is shown that high vacuum conditions are not sufficient to completely remove water and oxygen from the ionic liquid 1-ethyl-3-methylimidazolium chloride. Complete removal of water demands heating above 150 °C under reduced pressure, as proven by Nuclear Reaction Analysis (NRA). Dissolved oxygen gas can only be removed by the use of an oxygen scavenger such as hydroquinone, despite the fact that calculations show that oxygen should be removed completely by the applied vacuum conditions. After applying a strict drying procedure and scavenging of molecular oxygen, it was possible to deposit copper directly on tantalum without the presence of an intervening oxide layer.

  13. Underwater Superoleophobicity Induced by the Thickness of the Thermally Grown Porous Oxide Layer on C84400 Copper Alloy

    Directory of Open Access Journals (Sweden)

    Aniedi Nyong

    2014-02-01

    Full Text Available The underwater contact angle behavior on oxide layers of varying thicknesses was studied. These oxide layers were grown by thermally oxidizing C84400 copper alloys in N2-0.75 wt.% O2 and N2-5 wt.% O2 gas mixtures at 650 °C. Characterization of the oxidized specimens was effected using X-ray diffraction, scanning electron microscope (SEM and contact angle goniometer. The results from the X-ray diffraction analyses confirmed the formation of CuO, ZnO and PbO. The average sizes of the oxide granules were in the range of 70 nm to 750 nm, with the average thickness of the oxide layer increasing with the increase in the weight percent of oxygen in the N2-O2 gas mixtures. The results showed that the oxide layer growth followed the parabolic law. The underwater oil contact angles increased, due to the change in the surface morphology and porosity of the oxide layer. The small sizes and irregular packing of the oxide granules cause hierarchical rough surface layers with pores. The estimated pore sizes, in the range of 88 ± 40 to 280 ± 76, were predominant on the oxide layers of the samples processed in the N2-5 wt.% O2 gas mixture. The presence of these pores caused an increase in the porosities as the thickness of the oxide layers increased. At oxide layer thickness above 25 microns, the measured contact angle exceeded 150° as underwater superoleophobicity was recorded.

  14. Thin-layer heap bioleaching of copper flotation tailings containing high levels of fine grains and microbial community succession analysis

    Science.gov (United States)

    Hao, Xiao-dong; Liang, Yi-li; Yin, Hua-qun; Liu, Hong-wei; Zeng, Wei-min; Liu, Xue-duan

    2017-04-01

    Thin-layer heap bioleaching of copper flotation tailings containing high levels of fine grains was carried out by mixed cultures on a small scale over a period of 210 d. Lump ores as a framework were loaded at the bottom of the ore heap. The overall copper leaching rates of tailings and lump ores were 57.10wt% and 65.52wt%, respectively. The dynamic shifts of microbial community structures about attached microorganisms were determined using the Illumina MiSeq sequencing platform based on 16S rRNA amplification strategy. The results indicated that chemolithotrophic genera Acidithiobacillus and Leptospirillum were always detected and dominated the microbial community in the initial and middle stages of the heap bioleaching process; both genera might be responsible for improving the copper extraction. However, Thermogymnomonas and Ferroplasma increased gradually in the final stage. Moreover, the effects of various physicochemical parameters and microbial community shifts on the leaching efficiency were further investigated and these associations provided some important clues for facilitating the effective application of bioleaching.

  15. Modification of surface layers of copper under the action of the volumetric discharge initiated by an avalanche electron beam in nitrogen and CO2 at atmospheric pressure

    Science.gov (United States)

    Shulepov, M. A.; Akhmadeev, Yu. Kh.; Tarasenko, V. F.; Kolubaeva, Yu. A.; Krysina, O. V.; Kostyrya, I. D.

    2011-05-01

    The results of experimental investigations of the action of the volumetric discharge initiated by an avalanche electron beam on the surface of copper specimens are presented. The volumetric (diffuse) discharge in nitrogen and CO2 at atmospheric pressure was initiated by applying high voltage pulses of nanosecond duration to a tubular foil cathode. It has been found that the treatment of a copper surface by this type of discharge increases the hardness of the surface layer due to oxidation.

  16. Flame retardant wool using zirconium oxychloride in various acidic media optimized by RSM

    Energy Technology Data Exchange (ETDEWEB)

    Forouharshad, M., E-mail: Forouharmahdi@gmail.com [Textile Department, Islamic Azad University South Tehran Branch, Tehran (Iran, Islamic Republic of); Montazer, M., E-mail: tex5mm@aut.ac.ir [Textile Department, Center of Excellence, Amirkabir University of Technology, Tehran (Iran, Islamic Republic of); Moghadam, M.B. [Department of Statistics, Allameh-Tabataba' i University, Tehran (Iran, Islamic Republic of); Saligheh, O. [Textile Department, Islamic Azad University South Tehran Branch, Young Researchers Club, Tehran (Iran, Islamic Republic of)

    2011-03-20

    Research highlights: {yields} We investigate effect of ZrOCl{sub 2} and HCl on the flame retardancy of wool fabric. {yields} The response surface methodology uses for the experimental plan with. {yields} The thermal degradation studies by thermal analysis, LOI and vertical flame test. {yields} The fabric surfaces observe by SEM. {yields} Results show an increase in the decomposition temperature, residual mass and LOI. - Abstract: The flame retardant wool was prepared using zirconium oxychloride with various acids. The thermal degradation of wool treated with the flame retardant synergistic system, zirconium oxychloride, citric acid and hydrochloric acid, was studied by thermal analysis, mass loss, limiting oxygen index (LOI) and vertical flame test. The fabric surfaces were also observed by SEM. The wool treated with the flame-retardant shows an increase in the decomposition temperature, residual mass and LOI. Also the wool treated with hydrochloric acid showed improved flame retardant properties compared to the use of formic acid. The response surface methodology (RSM) was also used for the experimental plan with four variables on the results of flame retardancy. The statistical analysis confirms the optimum conditions obtained by the experimental results.

  17. pH-regulated antimony oxychloride nanoparticle formation on titanium oxide nanostructures: a photocatalytically active heterojunction

    KAUST Repository

    Buchholcz, Balázs

    2017-02-06

    Improving the catalytic activity of heterogeneous photocatalysts has become a hot topic recently. To this end, considerable progress has been made in the efficient separation of photogenerated charge carriers by e.g. the realization of heterojunction photocatalysts. V-VI-VII compound semiconductors, namely, bismuth oxyhalides, are popular photocatalysts. However, results on antimony oxyhalides [SbOX (X = Br, Cl, I)], the very promising alternatives to the well-known BiOX photomodifiers, are scarce. Here, we report the successful decoration of titanium oxide nanostructures with 8-11 nm diameter SbOX nanoparticles for the first time ever. The product size and stoichiometry could be controlled by the pH of the reactant mixture, while subsequent calcination could transform the structure of the titanate nanotube (TiONT) support and the prepared antimony oxychloride particles. In contrast to the ease of composite formation in the SbOX/TiONT case, anatase TiO could not facilitate the formation of antimony oxychloride nanoparticles on its surface. The titanate nanotube-based composites showed activity in a generally accepted quasi-standard photocatalytic test reaction (methyl orange dye decolorization). We found that the SbOCl/TiONT synthesized at pH = 1 is the most active sample in a broad temperature range.

  18. Binary molecular layers of C-60 and copper phthalocyanine on Au(111) : Self-organized nanostructuring

    NARCIS (Netherlands)

    Stöhr, Meike; Wagner, Thorsten; Gabriel, Markus; Weyers, Bastian; Möller, Rolf

    2001-01-01

    The binary molecular system of C-60 and copper phthalocyanine(CuPc) molecules has been investigated by scanning tunneling microscopy (STM) at room temperature and at 50 K. As substrate Au(111) was chosen. When C-60 and CuPc molecules are sequentially deposited, it is found that well-ordered domains

  19. Binary molecular layers of C-60 and copper phthalocyanine on Au(111) : Self-organized nanostructuring

    NARCIS (Netherlands)

    Stöhr, Meike; Wagner, Thorsten; Gabriel, Markus; Weyers, Bastian; Möller, Rolf

    The binary molecular system of C-60 and copper phthalocyanine(CuPc) molecules has been investigated by scanning tunneling microscopy (STM) at room temperature and at 50 K. As substrate Au(111) was chosen. When C-60 and CuPc molecules are sequentially deposited, it is found that well-ordered domains

  20. Binary molecular layers of C-60 and copper phthalocyanine on Au(111) : Self-organized nanostructuring

    NARCIS (Netherlands)

    Stöhr, Meike; Wagner, Thorsten; Gabriel, Markus; Weyers, Bastian; Möller, Rolf

    2001-01-01

    The binary molecular system of C-60 and copper phthalocyanine(CuPc) molecules has been investigated by scanning tunneling microscopy (STM) at room temperature and at 50 K. As substrate Au(111) was chosen. When C-60 and CuPc molecules are sequentially deposited, it is found that well-ordered domains

  1. Atomic motions in the layered copper pseudochalcogenide CuNCN indicative of a quantum spin-liquid scenario

    Science.gov (United States)

    Tchougréeff, Andrei L.; Stoffel, Ralf P.; Houben, Andreas; Jacobs, Philipp; Dronskowski, Richard; Pregelj, Matej; Zorko, Andrej; Arčon, Denis; Zaharko, Oksana

    2017-06-01

    We explore the thermodynamic properties of the layered copper(II) carbodiimide CuNCN by heat-capacity measurements and investigate the corresponding thermal atomic motions by means of neutron powder diffraction as well as inelastic neutron scattering. The experiments are complemented by a combination of density-functional calculations, phonon analysis and analytic theory. The existence of a soft flexural mode—bending of the layers, characteristic for the material structure—is established in the phonon spectrum of CuNCN by giving characteristic temperature-dependent contributions to the heat capacity and atomic displacement parameters. The agreement with the neutron data allows us to extract a residual—on top of the lattice—presumably spinon contribution to the heat capacity \\propto {{T}2} , speaking in favor of the spin-liquid picture of the electronic phases of CuNCN.

  2. Characteristics of damaged layer in micro-machining of copper material

    Institute of Scientific and Technical Information of China (English)

    Dong-Hee KWON; Jeong-Suk KIM; Myung-Chang KANG; Se-Hun KWON; Jong-Hwan LEE

    2009-01-01

    The study on damaged layer is necessary for improving the machinability in micro-machining because the damaged layer affects the micro mold life and micro machine parts. This study examined the ultra-precision micro-machining characteristics, such as cutting speed, feed rate and cutting depth, of a micro-damaged layer produced by an ultra-high speed air turbine spindle. The micro cutting force, surface roughness and plastic deformation layer were investigated according to the machining conditions. The damaged layer was measured using optical microscope on samples prepared through metallographic techniques. The scale of the damaged layer depends on the cutting process parameters, particularly, the feed per tooth and axial depth of the cut. According to the experimental results, the depth of the damaged layer is increased by increasing the feed per tooth and cutting depth, also the damaged layer occurs less in down-milling compared with up-milling during the micro-machining operation.

  3. 3D-copper oxide and copper oxide/few-layer graphene with screen printed nanosheet assembly for ultrasensitive non-enzymatic glucose sensing

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Zhimei [Tianjin Key Laboratory of Film Electronic and Communicate Devices, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Advanced Materials and Printed Electronics Center, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Pan, Peng, E-mail: panpeny@163.com [Tianjin Key Laboratory of Film Electronic and Communicate Devices, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Advanced Materials and Printed Electronics Center, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Liu, Xuewen [Tianjin Key Laboratory of Film Electronic and Communicate Devices, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Advanced Materials and Printed Electronics Center, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Yang, Zhengchun; Wei, Jun [Advanced Materials and Printed Electronics Center, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Wei, Zhen, E-mail: weizhenxinxi@163.com [Tianjin Key Laboratory of Film Electronic and Communicate Devices, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China); Advanced Materials and Printed Electronics Center, School of Electronics Information Engineering, Tianjin University of Technology, Tianjin, 300384 (China)

    2017-02-01

    Screen-printed copper oxide (CuO) and CuO/few-layer graphene on graphite electrodes were used to fabricate the ultrasensitive nonenzymatic glucose biosensors. Flower-like CuO and flower-like CuO/few-layer graphene composites were prepared by screen-printing method and characterized by X-ray diffraction (XRD), field-emission scanning electron microscopy (FESEM), and high-resolution transmission electron microscopy (HETEM). On the basis of their cyclic voltammetry (CV) and chronoamperometry results, it was concluded that the addition of graphene to CuO significantly improved the performance of the fabricated glucose sensors, exhibiting high and reproducible sensitivity of 3120 μAmM{sup −1} cm{sup −2} with three linear ranges from 4 μM to 13.5 mM and the detection limit of 4 μM (S/N = 3) in a fast response time of 2 s. In addition, the fabricated sensors could effectively avoid the disturbance by interferents, such as Ascorbic Acid (AA), Uric Acid (UA), and Dopamine (DA). Most importantly, the testing results of real blood serum samples demonstrated that the electrodes were applicable and acceptable for the determination of glucose concentrations in human serum. The efficiencies of two non-enzymatic glucose biosensors for glucose determination were comparable with that of a commercial enzymatic sensor. - Highlights: • The method 2D nanosheet turns to 3D microflower by using screen printing was proposed. • Few-layer graphene added improved the sensor’s performance on base of CuO functional material. • Two ultrasensitive non-enzymatic glucose sensors were successfully fabricated. • The proposed sensor shows a high sensitivity of 3120 μA mM{sup −1} cm{sup −2}.

  4. Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles

    Science.gov (United States)

    Satoh, Toshikazu; Ishizaki, Toshitaka; Akedo, Kunio

    2017-02-01

    Pressure-free Cu nanoparticle bonding between two Cu plates with an Ag adhesive layer was examined. Insertion of the Ag adhesive layer considerably enhanced the bonding strength at firing temperatures between 523 K and 673 K. The bonding strength generally increased with the firing temperature. The strength enhancement of the Ag adhesive layer was observed even for a very thin (3 nm) Ag layer, and there was no obvious dependence of the thickness of the Ag layer on the bonding strength for Ag layers of thickness up to 200 nm. Ag atoms from the adhesive layer diffused away to the bonding layer with an increase in the firing temperature. The elemental mapping images showed that the Ag had two morphologies: thin Ag layers existing between particulate Cu grains, and fine Ag particles dispersed in coarse Cu crystals. The microstructure near the interface between the Cu nanoparticle bonding layer and Cu plate used as the substrate suggests that the enhancement effect of the Ag layer originates in the active migration of the Ag layer itself.

  5. Analysis of the electrolyte convection inside the concentration boundary layer during structured electrodeposition of copper in high magnetic gradient fields.

    Science.gov (United States)

    König, Jörg; Tschulik, Kristina; Büttner, Lars; Uhlemann, Margitta; Czarske, Jürgen

    2013-03-19

    To experimentally reveal the correlation between electrodeposited structure and electrolyte convection induced inside the concentration boundary layer, a highly inhomogeneous magnetic field, generated by a magnetized Fe-wire, has been applied to an electrochemical system. The influence of Lorentz and magnetic field gradient force to the local transport phenomena of copper ions has been studied using a novel two-component laser Doppler velocity profile sensor. With this sensor, the electrolyte convection within 500 μm of a horizontally aligned cathode is presented. The electrode-normal two-component velocity profiles below the electrodeposited structure show that electrolyte convection is induced and directed toward the rim of the Fe-wire. The measured deposited structure directly correlates to the observed boundary layer flow. As the local concentration of Cu(2+) ions is enhanced due to the induced convection, maximum deposit thicknesses can be found at the rim of the Fe-wire. Furthermore, a complex boundary layer flow structure was determined, indicating that electrolyte convection of second order is induced. Moreover, the Lorentz force-driven convection rapidly vanishes, while the electrolyte convection induced by the magnetic field gradient force is preserved much longer. The progress for research is the first direct experimental proof of the electrolyte convection inside the concentration boundary layer that correlates to the deposited structure and reveals that the magnetic field gradient force is responsible for the observed structuring effect.

  6. The structure and phase composition of the surface layer of the samples during the processing of VT-10 titanium alloys by copper ions

    Science.gov (United States)

    Kalashnikov, Mark P.; Fedorischeva, Marina V.; Nikonenko, Alisa V.; Bozhko, Irina A.; Sergeev, Victor P.

    2016-11-01

    The phase composition, structure and morphology of the surface of VT-10 titanium modified by copper ions have been investigated by X-ray, SEM and TEM. It has been established that there are intermetallide phases of Cu-Ti equilibrium diagram in the surface layer during the treatment of VT-10 titanium by copper ions. The modified surface layer in the cross section is divided into two layers: up to 1 µm in thickness and from 1µm up to 4.5-5.0 µm, depending on the treatment time. Two-level micro and nanoporous nanocrystalline structure was formed in the modified layer. It was found that the phase structure and the morphology of the surface layers of VT-10 alloys depend on the treatment time.

  7. Oscillatory Changes of the Heterogeneous Reactive Layer Detected with the Motional Resistance during the Galvanostatic Deposition of Copper in Sulfuric Solution.

    Science.gov (United States)

    Cuenca, Alejandro; Agrisuelas, Jerónimo; García-Jareño, José J; Vicente, Francisco

    2015-11-24

    Metallic copper was galvanostatically deposited on quartz|gold resonant electrodes by applying a constant current in a 0.5 M CuSO4/0.1 M H2SO4 aqueous solution. Galvanostatic copper deposition is one of the best methodologies to calibrate the electrochemical quartz crystal microbalances (EQCM), a gravimetric sensor to evaluate changes in mass during the electrochemical reactions through the Sauerbrey equation. The simultaneous measurement of mass, current density, and motional resistance by an EQCM with motional resistance monitoring allows us to characterize the processes occurring on the electrode surface and at the interfacial regions with unprecedented detail. During the galvanostatic copper deposition, Cu(H2O)4(OH)2 is accumulated close to the copper surface, generating a passive layer. This passive layer can act as Cu(2+) reservoir for the Cu(2+) → Cu process since the copper deposition is not affected. The analysis of motional resistance evolution in different experimental conditions reveals that the passive layer is formed by the reaction of oxidizing agents generated at the counter electrode with the metallic copper surface. The simplistic Cu(2+) → Cu process is completed with a more detailed mechanism, which includes the passive layer formation/dissolution and the transport of species from the counter electrode surface (Pt) to the working electrode surface. The results further support the calibration procedure of EQCM by the galvanostatic deposition of copper in sulfuric solutions. However, we suggest applying high current densities, separating the counter electrode and quartz|gold resonant electrode about 0.5 cm, and keeping oxygen in solution for the EQCM calibration. Moreover, the better interval time to calculate the Sauerbrey's constant from charge and resonant frequency data is between 150 and 300 s.

  8. Unsteady boundary layer flow and heat transfer over an exponentially shrinking sheet with suction in a copper-water nanofluid

    Institute of Scientific and Technical Information of China (English)

    Aurang Zaib; Krishnendu Bhattacharyya; Sharidan Shafie

    2015-01-01

    An analysis of unsteady boundary layer flow and heat transfer over an exponentially shrinking porous sheet filled with a copper-water nanofluid is presented. Water is treated as a base fluid. In the investigation, non-uniform mass suction through the porous sheet is considered. Using Keller-box method the transformed equations are solved numerically. The results of skin friction coefficient, the local Nusselt number as well as the velocity and temperature profiles are presented for different flow parameters. The results showed that the dual non-similar solutions exist only when certain amount of mass suction is applied through the porous sheet for various unsteady parameters and nanoparticle volume fractions. The ranges of suction where dual non-similar solution exists, become larger when values of unsteady parameter as well as nanoparticle volume fraction increase. So, due to unsteadiness of flow dynamics and the presence of nanoparticles in flow field, the requirement of mass suction for existence of solution of boundary layer flow past an exponentially shrinking sheet is less. Furthermore, the velocity boundary layer thickness decreases and thermal boundary layer thickness increases with increasing of nanoparticle volume fraction in both non-similar solutions. Whereas, for stronger mass suction, the velocity boundary layer thickness becomes thinner for the first solution and the effect is opposite in the case of second solution. The temperature inside the boundary layer increases with nanoparticle volume fraction and decreases with mass suction. So, for the unsteadiness and for the presence of nanoparticles, the flow separation is delayed to some extent.

  9. Work-function oscillations during the surfactant induced layer-by-layer growth of copper on oxygen precovered Ru(0001)

    Science.gov (United States)

    Schmidt, M.; Wolter, H.; Wandelt, K.

    1994-04-01

    In the present work the Cu-film growth on a clean and an oxygen precovered Ru(0001) surface, as monitored with dynamical work function measurements (ΔΦ measurements) during the Cu evaporation using a special Kelvin-probe is compared. For Cu adsorption on the clean surface the observed temperature dependence of the ΔΦ measurements is understood in terms of a change of the growth structure of the Cu films from layer-by-layer growth up to ~ 3 ML at ~ 600 K to a 3D-growth mode at ~ 400 K. In turn, as recently reported, in the case of Cu adsorption on the oxygen-precovered surface at ~ 400 K remarkable ΔΦ oscillations are observed, which could be resolved over many periods clearly indicating a layer-wise growth of high quality at this temperature. Furthermore, in the present paper we report on new and detailed results about the dependence of the ΔΦ oscillations on the oxygen precoverage as well as the Cu deposition rate.

  10. Effects of Copper-based Compounds, Antibiotics and a Plant Activator on Population Sizes and Spread of Clavibacter michiganensis subsp. michiganensis in Greenhouse Tomato Seedlings

    Directory of Open Access Journals (Sweden)

    Svetlana Milijašević

    2009-01-01

    Full Text Available Three copper-based compounds (copper hydroxide, copper oxychloride, copper sulphate, two antibiotics (streptomycin and kasugamycin and a plant activator (ASM significantly reduced population sizes and spread of C. michiganensis subsp. michiganensis among tomatoseedlings in the greenhouse. Streptomycin had the best effect in reducing pathogen population size in all sampling regions. Moreover, this antibiotic completely stopped the spread of C. michiganensis subsp. michiganensis in the region most distant from the inoculumfocus. Copper hydroxide mixed with streptomycin significantly limited the pathogen population, compared with copper hydroxide alone, the other copper-based compounds, ASM and kasugamycin. However, combining streptomycin with copper hydroxide did notcontribute to its greater efficacy against the pathogen population. Copper-based compounds, in general, were less effective in limiting pathogen population sizes than the other treatments in all three sampling regions, primarily copper oxychloride and the combinationof copper hydroxide and mancozeb. Among copper compounds, copper hydroxide was the most prominent in reducing the bacterial population, especially in the region closest to the inoculum focus, while its combination with mancozeb did not improve the effects. Kasugamycin significantly limited pathogen population size, compared to copper bactericides, but it was less effective than the other antibiotic compound, i.e. streptomycin. The plant activator ASM significantly reduced population density, and it was more effectivewhen used three days prior to inoculation than six days before inoculation.

  11. Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(ii) acetylacetonate: a combined first-principles and reactive molecular dynamics study.

    Science.gov (United States)

    Hu, Xiao; Schuster, Jörg; Schulz, Stefan E; Gessner, Thomas

    2015-10-28

    Atomistic mechanisms for the atomic layer deposition using the Cu(acac)2 (acac = acetylacetonate) precursor are studied using first-principles calculations and reactive molecular dynamics simulations. The results show that Cu(acac)2 chemisorbs on the hollow site of the Cu(110) surface and decomposes easily into a Cu atom and the acac-ligands. A sequential dissociation and reduction of the Cu precursor [Cu(acac)2 → Cu(acac) → Cu] are observed. Further decomposition of the acac-ligand is unfavorable on the Cu surface. Thus additional adsorption of the precursors may be blocked by adsorbed ligands. Molecular hydrogen is found to be nonreactive towards Cu(acac)2 on Cu(110), whereas individual H atoms easily lead to bond breaking in the Cu precursor upon impact, and thus release the surface ligands into the gas-phase. On the other hand, water reacts with Cu(acac)2 on a Cu2O substrate through a ligand-exchange reaction, which produces gaseous H(acac) and surface OH species. Combustion reactions with the main by-products CO2 and H2O are observed during the reaction between Cu(acac)2 and ozone on the CuO surface. The reactivity of different co-reactants toward Cu(acac)2 follows the order H > O3 > H2O.

  12. Improved Performance of Fluorinated Copper Phthalocyanine Thin Film Transistors Using Para-hexaphenyl as the Inducing Layer

    Institute of Scientific and Technical Information of China (English)

    MA Feng; WANG Shi-Rong; LI Xiang-Gao; YAN Dong-Hang

    2011-01-01

    We demonstrate n-type organic thin film transistors (OTFTs) employing copper hexadecafluorophthalocyanine (CuPcF16 ) as the active layer and para-hexaphenyl (p-6p) as the inducing layer.Compared with the CuPcF16-based OTFTs without the p-6p inducing layer,the performance of the CuPcF16 /p-6p OTFTs is greatly improved.The charge carrier field-effect mobility μ,on-off current ratio Ion/ Ioff and threshold voltage VT of the CuPcF16/p-6p OTFTs are 0.07cm2/V·s,1.61 × 105 and 6.28 V,respectively,approaching the level of a single crystal device.The improved performance is attributed to the introduction of p-6p to form a highly oriented and continuous film of CuPcF16 with the molecular π-π stack direction parallel to the substrate.Organic thin film transistors have received a wide interest because of their potential applications in displays,logic circuits,sensors and lightemitting devices.[1-4] Although the performance of p-type pentacene-based organic thin film transistors (OTFTs) has reached the α-Si level,[5] the mobility of n-channel OTFTs with air stability is still relatively low.Fluorinated copper phthalocyanine (CuPcF16) is one of a few air-stable n-type organic semiconductors with a low electron field-effect mobility.To improve the performance of CuPcF16-based OTFTs,Yan et al.[5] employed an organic heterojunction buffer layer to decrease the contact resistance of organic/metal.%We demonstrate n-type organic thin film transistors (OTFTs) employing copper hexadecafiuorophthalocyanine (CuPcF16) as the active layer and para-hexaphenyl (p-6p) as the inducing layer. Compared with the CuPcF16-based OTFTs without thep-6p inducing layer, the performance of the CuPcF16/p-6p OTFTs is greatly improved. The charge carrier Reid-effect mobility μ, on-off current ratio Ion/Ioff and threshold voltage Vt of the CuPcF16/p-6p OTFTs are 0.07cm2/V-s, 1.61 x 105 and 6.28 V, respectively, approaching the level of a single crystal device. The improved performance is attributed to

  13. Effects of disorder state and interfacial layer on thermal transport in copper/diamond system

    Energy Technology Data Exchange (ETDEWEB)

    Sinha, V., E-mail: vikas.sinha.1.ctr@us.af.mil [Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, Ohio 45433 (United States); UES, Inc., 4401 Dayton-Xenia Road, Dayton, Ohio 45432 (United States); Gengler, J. J. [Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, Ohio 45433 (United States); Spectral Energies, LLC, 5100 Springfield Street, Suite 301, Dayton, Ohio 45431 (United States); Muratore, C. [Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, Ohio 45433 (United States); University of Dayton Research Institute, 300 College Park, Dayton, Ohio 45469 (United States); Spowart, J. E. [Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base, Ohio 45433 (United States)

    2015-02-21

    The characterization of Cu/diamond interface thermal conductance (h{sub c}) along with an improved understanding of factors affecting it are becoming increasingly important, as Cu-diamond composites are being considered for electronic packaging applications. In this study, ∼90 nm thick Cu layers were deposited on synthetic and natural single crystal diamond substrates. In several specimens, a Ti-interface layer of thickness ≤3.5 nm was sputtered between the diamond substrate and the Cu top layer. The h{sub c} across Cu/diamond interfaces for specimens with and without a Ti-interface layer was determined using time-domain thermoreflectance. The h{sub c} is ∼2× higher for similar interfacial layers on synthetic versus natural diamond substrate. The nitrogen concentration of synthetic diamond substrate is four orders of magnitude lower than natural diamond. The difference in nitrogen concentration can lead to variations in disorder state, with a higher nitrogen content resulting in a higher level of disorder. This difference in disorder state potentially can explain the variations in h{sub c}. Furthermore, h{sub c} was observed to increase with an increase of Ti-interface layer thickness. This was attributed to an increased adhesion of Cu top layer with increasing Ti-interface layer thickness, as observed qualitatively in the current study.

  14. Effects of Copper Doping on Dielectric and A.C. Conductivity in Layered Sodium Tri-Titanate Ceramic

    Science.gov (United States)

    Shripal; Dwivedi, Shailja; Singh, Rakesh; Tandon, R. P.

    2013-09-01

    Electron paramagnetic resonance (EPR) spectra of 0.01, 0.1 and 1.0 molar percentage (mp) of CuO doped derivatives of layered Na2Ti3O7 ceramic have been reported. The results show that copper substitutes as Cu2+ at Ti4+ octahedral sites. From the dependence of loss tangent (tan δ) and the relative permittivity (ɛ‧) on temperature and frequency, it is concluded that all the derivatives are of polar nature. The relaxation peaks at lower temperatures have been attributed to the presence of different types of dipoles, whereas peaks in the higher temperature region indicate possible ferroelectric phase transition. The dependence of conductivity on temperature show that electron hopping (polaron) conduction exists in a wide span of temperature range. However, the associated interlayer ionic conduction exists in a small temperature range. Interlayer alkali ion hopping mechanism of conduction has been proposed toward higher temperatures. The conductivity versus frequency plots reveal that the polaron conduction plays a prominent role toward the lower temperature side that diminishes with the rise in temperature. The most probable relaxation times for 0.01 and 0.1 mp CuO doped derivatives are almost same but it records an increased value for 1.0 mp doped material. This again attributes to the possible change in the symmetry of copper environment.

  15. Controlling the Performance of P-type Cu2O/SnO Bilayer Thin-Film Transistors by Adjusting the Thickness of the Copper Oxide Layer

    KAUST Repository

    Al-Jawhari, Hala A.

    2014-11-11

    The effect of copper oxide layer thickness on the performance of Cu2O/SnO bilayer thin-film transistors was investigated. By using sputtered Cu2O films produced at an oxygen partial pressure, Opp, of 10% as the upper layer and 3% Opp SnO films as the lower layer we built a matrix of bottom-gate Cu2O/SnO bilayer thin-film transistors of different thickness. We found that the thickness of the Cu2O layer is of major importance in oxidation of the SnO layer underneath. The thicker the Cu2O layer, the more the underlying SnO layer is oxidized, and, hence, the more transistor mobility is enhanced at a specific temperature. Both device performance and the annealing temperature required could be adjusted by controlling the thickness of each layer of Cu2O/SnO bilayer thin-film transistors.

  16. Effects of EVA Latex on the Properties of Glass-fiber/ Magnesium-oxychloride Cement Composites

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    The effects of Ethylene- Vinyl Acetate copolymer ( EVA ) latex as an additive or a glass fiber sur face modifier on the properties of Glass- Fiber ( GF ) / Magnesium Oxychloride Cement ( MOC ) composites was studied.The mechanical properties, water resistance and aging resistance of the cured GF/ MOC composites were estimated and chemical ingredients analysis and morphological study of the GF/ MOC composites were also performed.It is found that EVA added to the MOC matrix could substantially improve the interfacial adhesion, water resistance and aging resistance of GF / MOC composites.EVA treatment on glass fibers resulted in decreasing initial flexural strength of GF/ MOC composites while enhancing the soft coefficients.In addition, the drying time and dilution of the EVA treatment on glass fibers also had an obvious effect on the properties of GF/ MOC composites.GF / MOC composites.

  17. Copper Benzenetricarboxylate Metal-Organic Framework Nucleation Mechanisms on Metal Oxide Powders and Thin Films formed by Atomic Layer Deposition.

    Science.gov (United States)

    Lemaire, Paul C; Zhao, Junjie; Williams, Philip S; Walls, Howard J; Shepherd, Sarah D; Losego, Mark D; Peterson, Gregory W; Parsons, Gregory N

    2016-04-13

    Chemically functional microporous metal-organic framework (MOF) crystals are attractive for filtration and gas storage applications, and recent results show that they can be immobilized on high surface area substrates, such as fiber mats. However, fundamental knowledge is still lacking regarding initial key reaction steps in thin film MOF nucleation and growth. We find that thin inorganic nucleation layers formed by atomic layer deposition (ALD) can promote solvothermal growth of copper benzenetricarboxylate MOF (Cu-BTC) on various substrate surfaces. The nature of the ALD material affects the MOF nucleation time, crystal size and morphology, and the resulting MOF surface area per unit mass. To understand MOF nucleation mechanisms, we investigate detailed Cu-BTC MOF nucleation behavior on metal oxide powders and Al2O3, ZnO, and TiO2 layers formed by ALD on polypropylene substrates. Studying both combined and sequential MOF reactant exposure conditions, we find that during solvothermal synthesis ALD metal oxides can react with the MOF metal precursor to form double hydroxy salts that can further convert to Cu-BTC MOF. The acidic organic linker can also etch or react with the surface to form MOF from an oxide metal source, which can also function as a nucleation agent for Cu-BTC in the mixed solvothermal solution. We discuss the implications of these results for better controlled thin film MOF nucleation and growth.

  18. Capacitance of the double electrical layer on the copper-group metals in molten alkali metal halides

    Science.gov (United States)

    Kirillova, E. V.; Stepanov, V. P.

    2016-08-01

    The electrochemical impedance is measured to study the capacitance of the double electrical layer of metallic Au, Ag, and Cu as a function of potential and temperature in nine molten salts, namely, the chlorides, bromides, and iodides of sodium, potassium, and cesium. The C- E curve of a gold electrode has an additional minimum in the anodic branch. This minimum for silver is less pronounced and is only observed at low ac signal frequencies in cesium halides. The additional minimum is not detected for copper in any salt under study. This phenomenon is explained on the assumption that the adsorption of halide anions on a positively charged electrode surface has a predominantly chemical rather than an electrostatic character. The specific adsorption in this case is accompanied by charge transfer through the interface and the formation of an adsorbent-adsorbate covalent bond.

  19. Boundary layer flow and heat transfer on a moving plate in a copper-water nanofluid using Buongiorno model

    Science.gov (United States)

    Bakar, Nor Ashikin Abu; Bachok, Norfifah; Arifin, Norihan Md.

    2016-06-01

    The study of the steady two dimensional boundary layer flow of a copper (Cu)-water nanofluid on a moving plate is investigated. The assumption is the plate moves in the same or opposite direction to the free stream. The nonlinear partial differential equations are transformed into nonlinear ordinary differential equations using a similarity variables,then a shooting technique is used to solved it numerically. The numerical results for skin friction coefficient, the local Nusselt number, the local Sherwood number as well as the velocity, temperature and concentration profiles are obtained. The effect of nanoparticle volume fraction, Brownian motion and thermophoresis parameters on heat transfer are examined. The results show that the local Nusselt number and the local Sherwood number increase with increasing in the Brownian motion parameter Nb and thermophoresis parameter Nt.

  20. Luminescence spectroscopy of rare earth-doped oxychloride lead borate glasses

    Energy Technology Data Exchange (ETDEWEB)

    Pisarski, Wojciech A., E-mail: Wojciech.Pisarski@us.edu.p [University of Silesia, Institute of Chemistry, Szkolna 9, 40-007 Katowice (Poland); Pisarska, Joanna [University of Silesia, Institute of Chemistry, Szkolna 9, 40-007 Katowice (Poland); Lisiecki, RadosLaw [Institute of Low Temperature and Structure Research, Polish Academy of Sciences, Okolna 2, 50-422 WrocLaw (Poland); Grobelny, Lukasz [University of Silesia, Institute of Chemistry, Szkolna 9, 40-007 Katowice (Poland); Dominiak-Dzik, Grazyna; Ryba-Romanowski, Witold [Institute of Low Temperature and Structure Research, Polish Academy of Sciences, Okolna 2, 50-422 WrocLaw (Poland)

    2011-04-15

    Ln-doped oxychloride lead borate glasses were studied using luminescence spectroscopy. Rare earth ions were limited to trivalent Pr{sup 3+}, Tm{sup 3+}, Eu{sup 3+} and Er{sup 3+}. Luminescence spectra were registered, which correspond to {sup 3}P{sub 0}-{sup 3}H{sub 4} and {sup 1}D{sub 2}-{sup 3}H{sub 4} transitions of Pr{sup 3+}, {sup 1}G{sub 4}-{sup 3}H{sub 5} and {sup 1}G{sub 4}-{sup 3}F{sub 4} transitions of Tm{sup 3+}, {sup 5}D{sub 0}-{sup 7}F{sub J} (J=0, 1, 2, 3, 4) transitions of Eu{sup 3+} and {sup 4}S{sub 3/2},{sup 2}H{sub 11/2}-{sup 4}I{sub 15/2} and {sup 4}I{sub 13/2}-{sup 4}I{sub 15/2} transitions of Er{sup 3+}. Luminescence decays from the excited states of Ln{sup 3+} ions were analyzed in detail. The experimental results indicate that relatively high phonon energy of the host gives important contribution to the excited state relaxation of rare earth ions. - Research Highlights: {yields}Lead borate glasses modified by PbCl{sub 2} were synthesized. {yields}Luminescence of Pr{sup 3+}, Tm{sup 3+}, Eu{sup 3+} and Er{sup 3+} ions in multicomponent oxychloride glasses was registered. {yields}From decay curves luminescence lifetimes for the excited states of rare earth ions were determined. {yields}The relatively high phonon energy of the host gives important contribution to the excited state relaxation of rare earth ions.

  1. Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates

    Science.gov (United States)

    Paranthaman, Mariappan; Goyal, Amit; Kroeger, Donald M.; List, III, Frederic A.

    2002-01-01

    Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.

  2. MgO buffer layers on rolled nickel or copper as superconductor substrates

    Science.gov (United States)

    Paranthaman, Mariappan; Goyal, Amit; Kroeger, Donald M.; List, III, Frederic A.

    2001-01-01

    Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.

  3. Diquat associated with copper sources for algae control: Efficacy and ecotoxicology.

    Science.gov (United States)

    Garlich, Nathalia; Da Cruz, Claudinei; Da Silva, Adilson F; Carraschi, Silvia P; Malaspina, Igor C; Pitelli, Robinson A; Bianco, Silvano

    2016-01-01

    The aims of this research were to evaluate the efficacy of copper oxychloride (CuCl2.3Cu(OH)2), copper hydroxide (Cu(OH)2) and diquat (1.1'-ethylene-2.2'-bipyridyldiylium dibromide), isolated and in association with 0.1% of both copper sources, in the control of the unicellular algae Ankistrodesmus gracilis and the filamentous algae Pithophora kewesis, and to determine the acute toxicity of the tested chemicals in Hyphressobrycon eques, Pomacea canaliculata, Lemna minor and Azolla caroliniana. The efficacy was estimated by the methods of chlorophyll a and pheophytin a readings, changed into growth inhibition percentage. Both algae were exposed to the following concentrations: 0.2; 0.4; 0.8; 1.2 mg L(-1) of diquat and its association with the copper sources; and 0.1; 0.3; 0.5; 0.7; 1.0 and 1.5 mg L(-1) in the isolated applications of copper hydroxide and copper oxychloride. An untreated control was kept. The acute toxicity was estimatedby 50% lethal concentration (LC50). The copper sources were effective for A. gracilis control, at rates as high as 0.1 mg L(-1) (>95% efficacy). Isolated diquat and its association with copper hydroxide were both effective at rates as high as 0.4 mg L(-1), with 95 and 88% control efficacy, respectively. The copper oxychloride was effective at 0.2 mg L(-1), with 93% efficacy. None of the tested chemicals and associations was effective on P. kewesis control. The most sensitive non target organism to the tested chemicals was L. minor; the less sensitive was H. eques.

  4. A study on the optics of copper indium gallium (di)selenide (CIGS) solar cells with ultra-thin absorber layers

    NARCIS (Netherlands)

    Xu, M.; Wachters, A.J.H.; Deelen, J. van; Mourad, M.C.D.; Buskens, P.J.P.

    2014-01-01

    We present a systematic study of the effect of variation of the zinc oxide (ZnO) and copper indium gallium (di)selenide (CIGS) layer thickness on the absorption characteristics of CIGS solar cells using a simulation program based on finite element method (FEM). We show that the absorption in the

  5. A study on the optics of copper indium gallium (di)selenide (CIGS) solar cells with ultra-thin absorber layers

    NARCIS (Netherlands)

    Xu, M.; Wachters, A.J.H.; Van Deelen, J.; Mourad, M.C.D.; Buskens, P.J.P.

    2014-01-01

    We present a systematic study of the effect of variation of the zinc oxide (ZnO) and copper indium gallium (di)selenide (CIGS) layer thickness on the absorption characteristics of CIGS solar cells using a simulation program based on finite element method (FEM). We show that the absorption in the CIG

  6. Copper dusting effects on perpendicular magnetic anisotropy in Pt/Co/Pt tri-layers

    Directory of Open Access Journals (Sweden)

    Vineeth Mohanan Parakkat

    2016-05-01

    Full Text Available The effect of Cu dusting on perpendicular magnetic anisotropy of sputter grown Pt/Co/Pt stack in which the Cu layer is in proximity with that of Co is investigated in this work. We used magneto optic Kerr effect microscopy measurements to study the variation in the reversal mechanisms in films with Co thicknesses below 0.8nm by systematically varying their perpendicular magnetic anisotropy using controlled Cu dusting. Cu dusting was done separately above and below the cobalt layer in order to understand the role of bottom and top Pt layers in magnetization reversal mechanisms of sputtered Pt/Co/Pt stack. The introduction of even 0.3nm thick Cu layer below the cobalt layer drastically affected the perpendicular magnetic anisotropy as evident from the nucleation behavior. On the contrary, even a 4nm thick top Cu layer had little effect on the reversal mechanism. These observations along with magnetization data was used to estimate the role of top and bottom Pt in the origin of perpendicular magnetic anisotropy as well as magnetization switching mechanism in Pt/Co/Pt thin films. Also, with an increase in the bottom Cu dusting from 0.2 to 0.4nm there was an increase in the number of nucleation sites resulting in the transformation of domain wall patterns from a smooth interface type to a finger like one and finally to maze type.

  7. Copper dusting effects on perpendicular magnetic anisotropy in Pt/Co/Pt tri-layers

    Science.gov (United States)

    Parakkat, Vineeth Mohanan; Ganesh, K. R.; Anil Kumar, P. S.

    2016-05-01

    The effect of Cu dusting on perpendicular magnetic anisotropy of sputter grown Pt/Co/Pt stack in which the Cu layer is in proximity with that of Co is investigated in this work. We used magneto optic Kerr effect microscopy measurements to study the variation in the reversal mechanisms in films with Co thicknesses below 0.8nm by systematically varying their perpendicular magnetic anisotropy using controlled Cu dusting. Cu dusting was done separately above and below the cobalt layer in order to understand the role of bottom and top Pt layers in magnetization reversal mechanisms of sputtered Pt/Co/Pt stack. The introduction of even 0.3nm thick Cu layer below the cobalt layer drastically affected the perpendicular magnetic anisotropy as evident from the nucleation behavior. On the contrary, even a 4nm thick top Cu layer had little effect on the reversal mechanism. These observations along with magnetization data was used to estimate the role of top and bottom Pt in the origin of perpendicular magnetic anisotropy as well as magnetization switching mechanism in Pt/Co/Pt thin films. Also, with an increase in the bottom Cu dusting from 0.2 to 0.4nm there was an increase in the number of nucleation sites resulting in the transformation of domain wall patterns from a smooth interface type to a finger like one and finally to maze type.

  8. Electrical nanocharacterization of copper tetracyanoquinodimethane layers dedicated to resistive random access memories

    Science.gov (United States)

    Deleruyelle, Damien; Muller, Christophe; Amouroux, Julien; Müller, Robert

    2010-06-01

    The local electrical properties of copper tetracyanoquinodimethane (CuTCNQ)/HfO2/Pt stacks were investigated thanks to conductive-atomic force microscopy (AFM) measurements. Local I-V and I-t spectroscopy evidenced repeatable and reversible bipolar electrical switching (SET and RESET operations) at the nanometer scale beneath the AFM tip. Experimental results suggest that resistive switching is due to the creation/dissolution of conductive filaments bridging the CuTCNQ surface to the AFM tip. A physical model based on the migration of Cu+ ions within a nanogap and the growth of a conductive filament shows an excellent agreement with the experimental results during SET operation achieved at nanoscale.

  9. Spray- and spin-assisted layer-by-layer assembly of copper nanoparticles on thin-film composite reverse osmosis membrane for biofouling mitigation.

    Science.gov (United States)

    Ma, Wen; Soroush, Adel; Van Anh Luong, Tran; Brennan, Gregory; Rahaman, Md Saifur; Asadishad, Bahareh; Tufenkji, Nathalie

    2016-08-01

    Copper nanoparticles (CuNPs) have long been considered as highly effective biocides; however, the lack of suitable methods for loading CuNPs onto polymeric membranes is recognized as being one of the primary reasons for the limited research concerning their application in membrane industries. A highly efficient spray- and spin-assisted layer-by-layer (SSLbL) method was developed to functionalize the TFC polyamide RO membranes with controllable loading of CuNPs for biofouling control. The SSLbL method was able to produce a uniform bilayer of polyethyleneimine-coated CuNPs and poly(acrylic) acid in less than 1 min, which is far more efficient than the traditional dipping approach (25-60 min). The successful loading of CuNPs onto the membrane surface was confirmed by XPS analysis. Increasing the number of bilayers from 2 to 10 led to an increased quantity of CuNPs on the membrane surface, from 1.75 to 23.7 μg cm(-2). Multi-layer coating exhibited minor impact on the membrane water permeation flux (13.3% reduction) while retaining the original salt rejection ability. Both static bacterial inactivation and cross-flow filtration tests demonstrated that CuNPs could significantly improve anti-biofouling property of a polyamide membrane and effectively inhibit the permeate flux reduction caused by bacterial deposition on the membrane surface. Once depleted, CuNPs can also be potentially regenerated on the membrane surface via the same SSLbL method.

  10. Copper(II) Schiff base complexes and their mixed thin layers with ZnO nanoparticles

    Indian Academy of Sciences (India)

    MAGDALENA BARWIOLEK; ROBERT SZCZĘSNY; EDWARD SZŁYK

    2016-07-01

    Cu(II) complexes with Schiff bases derived from ethylenediamine (en) and 2-pyridinecarboxaldehyde (pyca), 2,5-dimethoxybenzaldehyde (dmbaH) or 4-imidazolecarboxaldehyde (4Him) were obtained and studied by elemental analysis, UV-VIS and IR spectra. Zinc oxide was synthesized using a simple homogeneous precipitation method with zinc acetate as a starting material. Thin layers of the studied Cu(II) complexes were deposited on Si(111) or ZnO/Si(111) substrates by a spin coating method and characterized with a scanningelectron microscopy (SEM/EDS), atomic force microscopy (AFM) and fluorescence spectroscopy. For Cu(II) layers the most intensive fluorescence bands due to intra-ligand transitions were observed between 462 and 503 nm. The fluorescence intensity of thin layers was corelated to the rotation speed. In the case of the [Cu(II)(en(4Him)₂)Cl₂](2a)/ZnO/Si and [Cu(en(dmbaH)₂)Cl₂](3a)/ZnO/Si layers the quenching of the emission band from ZnO at 440 nm (λex = 330 nm) associated with various intrinsic or extrinsic lattice defects was noted.

  11. Facile synthesis of light harvesting semiconductor bismuth oxychloride nano photo-catalysts for efficient removal of hazardous organic pollutants.

    Science.gov (United States)

    Seddigi, Zaki S; Gondal, Mohammed A; Baig, Umair; Ahmed, Saleh A; Abdulaziz, M A; Danish, Ekram Y; Khaled, Mazen M; Lais, Abul

    2017-01-01

    In the present work, bismuth oxychloride nanoparticles-a light harvesting semiconductor photocatalyst-were synthesized by a facile hydrolysis route, with sodium bismuthate and hydroxylammonium chloride as the precursor materials. The as-synthesized semiconductor photocatalysts were characterized using X-ray diffraction analysis, Fourier transform infra-red spectroscopy, Raman spectroscopy, Field emission scanning electron microscopy, X-ray photoelectron spectroscopy and Photoluminescence spectroscopy techniques. The crystal structure, morphology, composition, and optical properties of these facile synthesized bismuth oxychloride nanoparticles (BiOCl NPs) were compared to those of traditional bismuth oxychloride. In addition, the photocatalytic performance of facile-synthesized BiOCl NPs and traditional BiOCl, as applied to the removal of hazardous organic dyes under visible light illumination, is thoroughly investigated. Our results reveal that facile-synthesized BiOCl NPs display strong UV-Vis light adsorption, improved charge carrier mobility and an inhibited rate of charge carrier recombination, when compared to traditional BiOCl. These enhancements result in an improved photocatalytic degradation rate of hazardous organic dyes under UV-Vis irradiance. For instance, the facile-synthesized BiOCl NPs attained 100% degradation of methylene blue and methyl orange dyes in approximately 30 mins under UV-Vis irradiation, against 55% degradation for traditional BiOCl under similar experimental conditions.

  12. Facile synthesis of light harvesting semiconductor bismuth oxychloride nano photo-catalysts for efficient removal of hazardous organic pollutants

    Science.gov (United States)

    Seddigi, Zaki S.; Baig, Umair; Ahmed, Saleh A.; Abdulaziz, M. A.; Danish, Ekram Y.; Khaled, Mazen M.; Lais, Abul

    2017-01-01

    In the present work, bismuth oxychloride nanoparticles–a light harvesting semiconductor photocatalyst–were synthesized by a facile hydrolysis route, with sodium bismuthate and hydroxylammonium chloride as the precursor materials. The as-synthesized semiconductor photocatalysts were characterized using X-ray diffraction analysis, Fourier transform infra-red spectroscopy, Raman spectroscopy, Field emission scanning electron microscopy, X-ray photoelectron spectroscopy and Photoluminescence spectroscopy techniques. The crystal structure, morphology, composition, and optical properties of these facile synthesized bismuth oxychloride nanoparticles (BiOCl NPs) were compared to those of traditional bismuth oxychloride. In addition, the photocatalytic performance of facile-synthesized BiOCl NPs and traditional BiOCl, as applied to the removal of hazardous organic dyes under visible light illumination, is thoroughly investigated. Our results reveal that facile-synthesized BiOCl NPs display strong UV-Vis light adsorption, improved charge carrier mobility and an inhibited rate of charge carrier recombination, when compared to traditional BiOCl. These enhancements result in an improved photocatalytic degradation rate of hazardous organic dyes under UV-Vis irradiance. For instance, the facile-synthesized BiOCl NPs attained 100% degradation of methylene blue and methyl orange dyes in approximately 30 mins under UV-Vis irradiation, against 55% degradation for traditional BiOCl under similar experimental conditions. PMID:28245225

  13. Copper variation in Cu(In,Ga)Se{sub 2} solar cells with indium sulphide buffer layer

    Energy Technology Data Exchange (ETDEWEB)

    Spiering, S., E-mail: stefanie.spiering@zsw-bw.de [Zentrum für Sonnenenergie- und Wasserstoff-Forschung (ZSW) Baden-Wuerttemberg, Industriestrasse 6, 70565 Stuttgart (Germany); Paetel, S.; Kessler, F. [Zentrum für Sonnenenergie- und Wasserstoff-Forschung (ZSW) Baden-Wuerttemberg, Industriestrasse 6, 70565 Stuttgart (Germany); Igalson, M.; Abdel Maksoud, H. [Warsaw University of Technology (WUT), Faculty of Physics, Koszykowa 75, 00-662 Warszawa (Poland)

    2015-05-01

    In the manufacturing of Cu(In,Ga)Se{sub 2} (CIGS) thin film solar cells the application of a buffer layer on top of the absorber is essential to obtain high efficiency devices. Regarding the roll-to-roll production of CIGS cells and modules a vacuum deposition process for the buffer is preferable to the conventional cadmium sulphide buffer deposited in a chemical bath. Promising results have already been achieved for the deposition of indium sulphide buffer by different vacuum techniques. The solar device performance is very sensitive to the conditions at the absorber-buffer heterojunction. In view of optimization we investigated the influence of the Cu content in the absorber on the current-voltage characteristics. In this work the integral copper content was varied between 19 and 23 at.% in CIGS on glass substrates. An improvement of the cell performance by enhanced open circuit voltage was observed for a reduction to ~ 21 at.% when thermally evaporated indium sulphide was applied as the buffer layer. The influence of stoichiometry deviations on the transport mechanism and secondary barriers in the device was studied using detailed dark and light current-voltage analysis and admittance spectroscopy and compared to the reference CdS-buffered cells. We conclude that the composition of the absorber in the interface region affects current transport in In{sub x}S{sub y}-buffered and CdS-buffered cells in different ways hence optimal Cu content in those two types of devices is different. - Highlights: • Influence of Cu-variation in CIGS cells with In{sub x}S{sub y} buffer layer on cell performance • Enhanced efficiency by slight reduction of Cu-content to 21 at.% • Contribution of tunnelling-enhanced interface recombination for higher Cu-content.

  14. Porphyrin-Based Molecular Multilayer Films Assembled via Copper(I)-Azide-Alkyne Cycloaddition Coupled Layer-by-Layer Method for Light Harvesting Applications

    Science.gov (United States)

    Krawicz, Alexandra

    We have developed a Layer-by-Layer (LbL) method for the fabrication of thin-film molecular multilayers on electron-beam evaporated Au surfaces. Copper(I)-catalyzed azide-alkyne cycloaddition (CuAAC) coupling reactions were used for initial surface attachment and subsequent LbL deposition. The molecular multilayer films comprised of porphyrins and multi-azido linkers were assembled and characterized with a multitude of surface techniques. The electrochemical and photophysical properties of the thin-films can be tuned through synthetic modification of the individual building blocks, resulting in new porphyrin multilayers. These films have applications as light-harvesting arrays in Dye-Sensitized Solar Cells (DSSC), molecular electronics, and sensors. Herein, we demonstrate the reproducible growth trends and optical properties of multilayer films on Au surfaces modified with an azido-terminated alkanethiol self-assembled monolayer. Multilayer growth was followed by UV-Vis absorption and specular reflectance spectroscopy. Film thickness and optical constants were obtained through spectroscopic ellipsometry. The resulting extinction coefficients were consistent with typical porphyrin absorption spectra. The multilayers show consistent linear growth in absorbance and film thickness over tens of layers as well as continuity and moderate ordering in their molecular structure. This flexible molecular LbL technique has the potential to control the nanoscale structure and function of the thin films. Topology and local surface roughness were examined by TM-AFM, and elemental composition found by X-ray Photoelectron Spectroscopy (XPS) was consistent with the expected morphology of the porphyrin based films assembled on Au surfaces. Additionally, the copper content of the resulting films was quantified by XPS, and the utility of ethylenediaminetetraacetic acid disodium salt (Na2EDTA) was examined to remove the adventitious Cu catalyst. The gold supported multilayers were

  15. Graphitization of self-assembled monolayers using patterned nickel-copper layers

    Science.gov (United States)

    Yang, Gwangseok; Kim, Hong-Yeol; Kim, Jihyun

    2017-07-01

    Controlling the optical and electrical properties of graphene is of great importance because it is directly related to commercialization of graphene-based electronic and optoelectronic devices. The development of a spatially controlled layer-tunable and direct growth method is a favored strategy because it allows for the manipulation of the optical and electrical properties of graphene without complex processes. Here, patterned Ni on Cu layers is employed to achieve spatially thickness-tuned graphene because its thickness depends on the carbon solubility of catalytic metals. Transfer-free graphene is directly grown on an arbitrary target substrate by using self-assembled monolayers as the carbon source. The optical transmittance at a wavelength of 550 nm and the sheet resistance of graphene are adjusted from 65.0% and 2.33 kΩ/◻ to 85.8% and 7.98 kΩ/◻, respectively. Ambipolar behavior with a hole carrier mobility of 3.4 cm2/(V.s) is obtained from the fabricated device. Therefore, a spatially controlled layer-tunable and transfer-free growth method can be used to realize advanced designs for graphene-based optical and electrical devices.

  16. Co-solvent enhanced zinc oxysulfide buffer layers in Kesterite copper zinc tin selenide solar cells.

    Science.gov (United States)

    Steirer, K Xerxes; Garris, Rebekah L; Li, Jian V; Dzara, Michael J; Ndione, Paul F; Ramanathan, Kannan; Repins, Ingrid; Teeter, Glenn; Perkins, Craig L

    2015-06-21

    A co-solvent, dimethylsulfoxide (DMSO), is added to the aqueous chemical "bath" deposition (CBD) process used to grow ZnOS buffer layers for thin film Cu2ZnSnSe4 (CZTSe) solar cells. Device performance improves markedly as fill factors increase from 0.17 to 0.51 upon the co-solvent addition. X-ray photoelectron spectroscopy (XPS) analyses are presented for quasi-in situ CZTSe/CBD-ZnOS interfaces prepared under an inert atmosphere and yield valence band offsets equal to -1.0 eV for both ZnOS preparations. When combined with optical band gap data, conduction band offsets exceed 1 eV for the water and the water/DMSO solutions. XPS measurements show increased downward band bending in the CZTSe absorber layer when the ZnOS buffer layer is deposited from water only. Admittance spectroscopy data shows that the ZnOS deposited from water increases the built-in potential (Vbi) yet these solar cells perform poorly compared to those made with DMSO added. The band energy offsets imply an alternate form of transport through this junction. Possible mechanisms are discussed, which circumvent the otherwise large conduction band spike between CZTSe and ZnOS, and improve functionality with the low-band gap absorber, CZTSe (Eg = 0.96 eV).

  17. Layer-by-Layer Fabrication of Porphyrin Multilayer Films via Copper(I)-Catalyzed Azide-Alkyne Cycloaddition: Film Properties and Applications in Dye-Sensitized Solar Cells

    Science.gov (United States)

    Palomaki, Peter Karl Bunk

    Solar energy may be the only renewable source of energy available to the human race that could provide the energy we require while at the same time minimizing negative impacts on the planet and population. These characteristics may be instrumental in diminishing the potential for societal conflict. In order for photovoltaic devices to succeed on a global scale, research and development must lead to reduced costs and/or increased efficiency. Dye-Sensitized Solar Cells (DSSCs) are one class of nextgeneration photovoltaic technologies with the potential to realize these goals. Herein, I describe efforts towards developing a new light harvesting array of chromophores assembled on oxide substrates using copper(I)-catalyzed azide-alkyne cycloaddition (CuAAC or ‘click’ chemistry) that could prove useful in improving DSCC performance while maintaining low cost and simple fabrication. Specifically, molecular multilayers of porphyrin-based chromophores have been fabricated via sequential selflimiting CuAAC reactions to generate multilayered light harvesting films. Films of synthetic porphyrins, perylenes, and mixtures of the two are constructed in order to highlight the versatility of this molecular layer-by-layer (LbL) technique. Characterization in the form of electrochemical techniques, UV-Visible spectroscopy, infrared spectroscopy (IR), and water contact angle all indicate that the films are reacting as expected. Film thickness and morphology are investigated using X-ray reflectivity showing that film growth displays a high degree of linearity, while the roughness increases with thickness. Growth angles based on the porphyrin plane are estimated via a comparison of molecular models and experimentally determined thickness measurements. A more finite measurement of growth angle (and as a result the primary bonding mode) is determined by grazing angle IR spectroscopy. Blocking layer studies suggest that the films could be useful as a self-passivating layer in DSSCs to

  18. Durable Corrosion Resistance of Copper Due to Multi-Layer Graphene

    Directory of Open Access Journals (Sweden)

    Abhishek Tiwari

    2017-09-01

    Full Text Available Ultra-thin graphene coating has been reported to provide considerable resistance against corrosion during short-term exposures, however, there is great variability in the corrosion resistance due to graphene coating in different studies. It may be possible to overcome the problem of hampered corrosion protection ability of graphene that is caused due to defective single layer graphene by applying multilayer graphene. Systematic electrochemical characterization showed that the multilayer graphene coating developed in the study provided significant corrosion resistance in a chloride solution and the corrosion resistance was sustained for long durations (~400 h, which is attributed to the multilayer graphene.

  19. Porous layered and open-framework mixed-valence copper tellurites

    Science.gov (United States)

    Markovski, Mishel R.; Siidra, Oleg I.; Kayukov, Roman A.; Nazarchuk, Evgeni W.

    2016-11-01

    |Cu+Cl3|[Cu2+2(TeO3)] (1), |Cu+1.7Cl3.8|[Cu2+4O(TeO3)2] (2) and Tl+2[Cu2+2Te6+Te4+6O18] (3) were obtained by CVT and hydrothermal methods in CuCl-CuCl2-TeO2 and Tl2CO3-CuO-TeO2 systems. 1 demonstrates layered topology with pores (1×0.65 nm), whereas 2 has open-framework structural architecture with two-dimensional system of channels (1.16×0.74 nm). Channels in open-framework of 3 are occupied by Tl+ cations. 'Host-guest' structural organization of 1 and 2 with host Cu2+-tellurite units of different dimensionality formed by oxocentered OCu4 tetrahedra and OCu2Te triangles and guest Cu+-chloride species is the result of formation from gases in CVT reactions. Oxocentered units determine basic topologies of the structures of 1 and 2 and influence their stability and properties. [Te6+Te4+6O18]6- polytellurite-tellurate framework in 3 can be represented as consisting of Kagome-like layers.

  20. Mechanism for the atomic layer deposition of copper using diethylzinc as the reducing agent: a density functional theory study using gas-phase molecules as a model.

    Science.gov (United States)

    Dey, Gangotri; Elliott, Simon D

    2012-09-06

    We present theoretical studies based on first-principles density functional theory calculations for the possible gas-phase mechanism of the atomic layer deposition (ALD) of copper by transmetalation from common precursors such as Cu(acac)(2), Cu(hfac)(2), Cu(PyrIm(R))(2) with R = (i)Pr and Et, Cu(dmap)(2), and CuCl(2) where diethylzinc acts as the reducing agent. An effect on the geometry and reactivity of the precursors due to differences in electronegativity, steric hindrance, and conjugation present in the ligands was observed. Three reaction types, namely, disproportionation, ligand exchange, and reductive elimination, were considered that together comprise the mechanism for the formation of copper in its metallic state starting from the precursors. A parallel pathway for the formation of zinc in its metallic form was also considered. The model Cu(I) molecule Cu(2)L(2) was studied, as Cu(I) intermediates at the surface play an important role in copper deposition. Through our study, we found that accumulation of an LZnEt intermediate results in zinc contamination by the formation of either Zn(2)L(2) or metallic zinc. Ligand exchange between Cu(II) and Zn(II) should proceed through a Cu(I) intermediate, as otherwise, it would lead to a stable copper molecule rather than copper metal. Volatile ZnL(2) favors the ALD reaction, as it carries the reaction forward.

  1. Characterization of copper selenide thin film hole-injection layers deposited at room temperature for use with p-type organic semiconductors

    Science.gov (United States)

    Hiramatsu, Hidenori; Koizumi, Ikue; Kim, Ki-Beom; Yanagi, Hiroshi; Kamiya, Toshio; Hirano, Masahiro; Matsunami, Noriaki; Hosono, Hideo

    2008-12-01

    Copper selenide, CuxSe(x ˜2), was examined as a hole-injection layer for low-temperature organic devices. Crystalline CuxSe films grown at room temperature with atomically flat surfaces exhibited metallic conduction with a high electrical conductivity of 4.5×103 S/cm, a hole concentration of 1.4×1022 cm-3, and a mobility of 2.0 cm2/(V s). Analysis of the free carrier absorption using the Drude model estimated the effective mass of a hole as 1.0me. Photoemission spectroscopy measurements of the interfaces between CuxSe and organic hole transport layers, N ,N'-bis(naphthalen-1-yl)-N ,N'-bis(phenyl) benzidine (NPB) and copper phthalocyanine (CuPc), verified that the hole-injection barriers of these interfaces (0.4 eV for NPB and 0.3 eV for CuPc) are smaller than that of a conventional indium tin oxide (ITO) hole-injection electrode/NPB interface (0.6 eV) but are comparable to that of an ITO electrode/CuPc interface (0.3 eV). Hole-only devices using the CuxSe layer as a hole-injection anode exhibited very low threshold voltages (0.4-0.5 V) and nearly Ohmic characteristics. The NPB layer on the CuxSe layer was found to be highly doped at 1017-1019 cm-3, probably due to copper diffusion, while the CuPc layer is nearly intrinsic with a doping concentration lower than 1015 cm-3. These results indicated that a CuxSe film combined with CuPc is a promising candidate for a low-voltage hole-injection anode or a buffer layer in low-temperature devices such as organic light-emitting diodes and thin film transistors.

  2. Influence of heat treatment on indium-tin-oxide anodes and copper phthalocyanine hole injection layers in organic light-emitting diodes

    Energy Technology Data Exchange (ETDEWEB)

    Fenenko, Larysa [Department of Photonics Materials Science, Chitose Institute of Science and Technology (CIST), 758-65 Bibi, Chitose, Hokkaido 066-8655 (Japan) and Department of Optoelectronics, V. E. Lashkaryov Institute of Semiconductor Physics of NASU, 41 Nauky Ave., Kyiv 03128 (Ukraine) and Center for Future Chemistry, Kyushu University, 744 Motooka, Nishi, Fukuoka 819-0395 (Japan)]. E-mail: adachi@cstf.kyushu-u.ac.jp; Adachi, Chihaya [Department of Photonics Materials Science, Chitose Institute of Science and Technology (CIST), 758-65 Bibi, Chitose, Hokkaido 066-8655 (Japan); Center for Future Chemistry, Kyushu University, 744 Motooka, Nishi, Fukuoka 819-0395 (Japan)

    2007-04-09

    Modifications of indium-tin-oxide (ITO) and copper phthalocyanine (CuPc) layers by heat treatment aimed at lowering driving voltage in organic light-emitting diodes (OLEDs) are examined. Significant changes were observed in the surface morphology and carrier injection properties of ITO and CuPc layers after annealing at T = 250 deg. C for 0-60 min in a glove box. In the case of ITO annealing, although the ITO work function gradually decreased and the surface of the ITO layer became smoother than that of an unannealed ITO layer, we observed an appreciable decrease in the driving voltage with an increase in annealing time. In the case of CuPc annealing, on the other hand, we observed deterioration of the OLED's characteristics. All devices demonstrated an increase in driving voltage due to the pronounced crystallization of the CuPc layer.

  3. Investigation of the ablation of zinc oxide thin films on copper-indium-selenide layers by ps laser pulses

    Science.gov (United States)

    Heise, Gerhard; Dickmann, Marcel; Domke, Matthias; Heiss, Andreas; Kuznicki, Thomas; Palm, Jörg; Richter, Isabel; Vogt, Helmut; Huber, Heinz P.

    2011-07-01

    The selective laser structuring of zinc oxide thin films, which serve as the transparent negative electrodes of copper-indium-selenide (CIS) thin film solar cells, is of great common interest as it can replace the mechanical scribing of the so-called pattern 3 (P3) process step for the monolithic serial interconnection of these cells. We present an investigation of the single-pulse ablation behavior of zinc oxide thin films on glass substrates and on CIS layers and of trench scribing with 10-ps laser pulses at 1064 nm and at 532 nm. We show that the ablation behavior strongly depends on the properties of the underling substrate and that the energy required to ablate a specific volume using induced laser processes (often referred to as `lift off') is considerably reduced compared to the direct ablation of zinc oxide. With laser powers below 2 W at a wavelength of 1064 nm process speeds of 6 m/s for the P3 process have been achieved.

  4. Yield strengths and stress induced crackles in copper films:effects of substrate and passivated layer

    Institute of Scientific and Technical Information of China (English)

    Zhang Jian-Min; Xu Ke-Wei

    2004-01-01

    Yield strengths in unpassivated and 530 nm TiN passivated Cu films deposited on Ti, high-speed steel and Ni substrates have been measured by x-ray diffraction (XRD) in combination with the four-point bending method. The results show that, although the texture and average grain size, investigated by XRD and transmission electron microscopy respectively, do not vary with different substrate, the yield strength of the Cu film increases obviously when a thin passivated layer is present and varies slightly with substrates. Many crackles appear in the passivated Cu film on Ti substrate but do not appear in other samples. The experimental results have been explained satisfactorily with an expression for the yield strength of thin films given previously.

  5. Chemical synthesis and characterization of bismuth oxychloride BiOCl nanoparticles

    Science.gov (United States)

    Ascencio-Aguirre, Francisco Miguel; Bazán-Díaz, Lourdes; Mendoza-Cruz, Rubén; Santana-Vázquez, Maricela; Ovalle-Encinia, Oscar; Gómez-Rodríguez, Alfredo; Herrera-Becerra, Raúl

    2017-03-01

    Bismuth oxychloride (BiOCl) nanoparticles were synthesized using bismuth nitrate pentahydrate (Bi (NO3)3*5H2O) and tannic acid (C76H52O46), the latter playing the role of stabilizing agent in a highly acid environment. For the characterization of the particles several techniques were used. The X-ray diffraction patterns (XRD) confirmed the formation of BiOCl nanocrystals with an average size of 15.33 ± 0.16 nm. Raman spectroscopy showed the characteristic A1g and Eg vibrational normal modes of BiOCl. Through electron microscopy studies (SEM and TEM) the formation of nanosized particles was confirmed. The average particle size measured from TEM images was 22.11 ± 0.29 nm, in good agreement with the one calculated from XRD data. The synthesis method was performed in aqueous solution and it represents an easy and low-cost protocol for the production of BiOCl nanoparticles.

  6. Characterization of optical transitions of Eu3+ in lanthanum oxychloride nanophosphor

    Institute of Scientific and Technical Information of China (English)

    A. Choubey; S. Som; M. Biswas; S.K. Sharma

    2011-01-01

    This paper presented the studies on the optical properties and calculation of spectral parameters of europium doped lanthanum oxychloride nanophosphor for their possible applications in optoelectronic devices. The compound was doped with 0.1 mol% Eu3+ ions. The X-ray diffraction study of prepared sample suggested the tetragonal structure with particle size in the range of 18-21 nm. The photoluminescence (PL) emission spectra showed the bright emission in orange-red region from 580 to 630 nm. The most intense emission peak at 621 nmwas due to transition 5D0→7F2 in energy levels of Eu3+ ions. The spectral parameters were calculated from the absorption and emission spectra using Judd-Ofelt intensity parameters. The calculated values of the oscillator strength corresponding to the three transitions 7F1→2D1, 7F1→SD2 and 7F0→5D2 observed at 535, 472 and 465 nm in absorption spectra were 0.30×10-6, 1.36×106 and 0.63×10-6, respectively. The value of transi tion probability (A), stimulated emission cross-sect1on (σEP) and radiative lifetime (τrad) corresponding to 621 nm emission peak (transition 5D0→7F2) were 308 s-1, 1.22× 10-21 cm2 and 3.24×10-3 s, respectively.

  7. A study of structure-property relationships in layered copper oxides

    CERN Document Server

    Hyatt, N

    2000-01-01

    described in Chapter Five. This investigation demonstrates that several intimate structure-compressibility relationships exist in these materials. Chapter Six continues the theme of high pressure crystallography, and examines, in detail, the crystal structure of HgBa sub 2 CuO sub 4 sub + subdelta using high pressure neutron diffraction methods. This study indicates that the pressure induced increase in T sub c observed in HgBa sub 2 CuO sub 4 sub + subdelta, may be related to pressure induced relief of structural strain at the interface between the rock-salt and perovskite type layers of this material. Chapter Seven examines the crystal structure of Hg sub 0 sub . sub 8 Cr sub 0 sub . sub 2 Ba sub 2 CuO sub 4 sub + subdelta under ambient and applied pressure. This study shows that significant distortions arise in the crystal structure of HgBa sub 2 CuO sub 4 sub + subdelta when linear HgO sub 2 units are substituted by tetrahedral CrO sub 4 units. Finally, Chapter Eight describes a simple method for the fabr...

  8. Acetylene black incorporated layered copper sulfide nanosheets for high-performance supercapacitor

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Ke-Jing, E-mail: kejinghuang11@163.com; Zhang, Ji-Zong; Jia, Yu-Ling; Xing, Ke; Liu, Yan-Ming

    2015-08-25

    Highlights: • CuS/AB composites were synthesized by a simple solvothermal route. • Supercapacitor electrode based on CuS/AB was fabricated. • Microstructures and electrochemical properties of the electrodes were evaluated. • CuS/AB electrode exhibited ultrahigh specific capacitance and good cycling stability. - Abstract: Two-dimensional transition metal chalcogenides are attracting increasing attention in energy storage due to their unique structures and electronic properties. CuS has been demonstrated with a metal-like electronic conductivity and a high theoretical capacity. In this work, a facile strategy was reported for one-step synthesis of acetylene black (AB) incorporated layered CuS nanosheet via a simple solvothermal route. X-ray diffraction, Raman spectroscopy, scanning electron microscopy and transmission electron microscopy were used to investigate the morphologies and microstructures of the as-prepared materials. Electrochemical data showed that the CuS/AB composites displayed a high specific capacitance of 2981 F/g at 1.0 A/g and retained 64.6% (1924.5 F/g) at a high current density of 20 A/g, indicative of good rate capability. Furthermore, the composites retained approximately 92% of the initial specific capacitance after 600 cycles at a current density of 1.0 A/g, demonstrating good cycling stability. The outstanding electrochemical properties of the CuS/AB composite suggested that it had great potential for practical applications in high-performance supercapacitors and the present synthesis strategy maybe readily extended to the preparation of other composites based on CuS for potential applications in energy storage and conversion devices.

  9. Crystal Structure And Magnetic Property of the Complex of Hydrogen-bonded Two-dimensional Layer Copper(Ⅱ) Acrylate with Trimethyl Phosphate

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    @@ Copper carboxylate complexes play an important role in catalysing the enzymatic activities[1-4], and the phosphate has an especial use in DNA recognition[5]. Indeed the report about copper carboxylate complexes with phosphate ligands is rare. A chain structure supramolecule [Cu2(CH2CH-COO)4(H2O)2]n has been reported recently[6], in which a Cu2(CH2CH-COO)4(H2O)2 unit is linked by four O(water)-H...O(carboxyl) hydrogen bonds with two adjacent units(Fig.1). In this work a layer structure complex {Cu2(CH2CH-COO)4(H2O)2[OP(OCH3)3]}n was synthesized by means of hydrogen-bonded assembly approach between complex [Cu2(CH2CH-COO)4(H2O)2]n with trimethyl phosphate(TMP).

  10. Local thermal property analysis by scanning thermal microscopy of an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment

    Energy Technology Data Exchange (ETDEWEB)

    Guo, F.A. [Suzhou Institute for Nonferrous Metals Processing Technology, No. 200 Shenxu Road, Suzhou Industrial Park, Suzhou 215021 (China) and Unite de Thermique et d' Analyse Physique, Laboratoire d' Energetique et d' Optique, Universite de Reims, BP 1039, 51687 Reims Cedex 2 (France)]. E-mail: guofuan@yahoo.com; JI, Y.L. [Suzhou Institute for Nonferrous Metals Processing Technology, No. 200 Shenxu Road, Suzhou Industrial Park, Suzhou 215021 (China); Trannoy, N. [Unite de Thermique et d' Analyse Physique, Laboratoire d' Energetique et d' Optique, Universite de Reims, BP 1039, 51687 Reims Cedex 2 (France); Lu, J. [LASMIS, Universite de Technologie de Troyes, 12 Rue Marie Curie, Troyes 10010 (France)

    2006-06-15

    Scanning thermal microscopy (SThM) was used to map thermal conductivity images in an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment (SMAT). It is found that the deformed surface layer shows different thermal conductivities that strongly depend on the grain size of the microstructure: the thermal conductivity of the nanostructured surface layer decreases obviously when compared with that of the coarse-grained matrix of the sample. The role of the grain boundaries in thermal conduction is analyzed in correlation with the heat conduction mechanism in pure metal. A theoretical approach, based on this investigation, was used to calculate the heat flow from the probe tip to the sample and then estimate the thermal conductivities at different scanning positions. Experimental results and theoretical calculation demonstrate that SThM can be used as a tool for the thermal property and microstructural analysis of ultrafine-grained microstructures.

  11. Structural studies of copper(II) complexes with 2-(2-aminoethyl)pyridine derived Schiff bases and application as precursors of thin organic-inorganic layers.

    Science.gov (United States)

    Barwiolek, Magdalena; Szlyk, Edward; Berg, Andrzej; Wojtczak, Andrzej; Muziol, Tadeusz; Jezierska, Julia

    2014-07-14

    Cu(ii) complexes with Schiff bases derived from 2-pyridin-2-ylethanamine were obtained and characterized by UV-Vis, fluorescence, and IR spectra. The X-ray crystal structures determined for [Cu(ii)(epy(di-t-Buba))Cl] × 0.042H2O and [Cu(ii)(epy(di-t-Buba))O2CCH3] revealed tetrahedral distortion of the Cu(ii) coordination sphere in the solid phase. For both molecules the Cu(ii) ions were found in tetragonal environments, as was confirmed by the values of EPR g-matrix diagonal components. The thermal properties of the complexes and the gas phase composition were studied by TG/IR techniques. Thin layers of the studied copper(ii) complexes were deposited on Si(111) by a spin coating method and characterized by scanning electron microscopy (SEM/EDS), atomic force microscopy (AFM) and fluorescence spectra. For copper(ii) layers the most intensive fluorescence band from intra-ligand transition was observed between 498 and 588 nm. The layers' fluorescence intensity was related to the rotation speed and deposition time.

  12. Effect of the Inclusion of Organic Copper, Manganese, And Zinc in The Diet of Layers on Mineral Excretion, Egg Production, and Eggshell Quality

    Directory of Open Access Journals (Sweden)

    LSS Carvalho

    2015-12-01

    Full Text Available ABSTRACT This study aimed at evaluating the replacement of inorganic copper, manganese, and zinc sources by organic sources in the diet of laying hens during the second laying cycle in trace mineral excretion, egg production, and eggshell quality. Two hundred and fifty 100-week-old Dekalb hens were distributed according to a completely randomized design into five treatments with five replicates of ten birds each. The control treatment consisted of a basal diet with all trace minerals in the inorganic form. The other treatments consisted of a basal diet with a mixture of the minerals copper, manganese, and zinc in the organic form with concentrations of 100%, 90%, 80%, and 70% of the levels of inclusion of inorganic mineral sources in the control treatment. Trace mineral excretion was determined in five layers per treatment by the method of total excreta collection. Excreta trace mineral contents were determined by atomic absorption spectrophotometry. Egg production and eggshell quality were determined by the mass of the eggs and the egg specific gravity, respectively. For all trace minerals examined, the dietary supplementation with organic sources reduced trace mineral excretion compared with the control group, even at 70% inclusion level, without compromising egg production or eggshell quality. The replacement of the inorganic trace mineral sources by organics source effectively reduced the excretion of copper, manganese, and zinc by laying hens in the second laying cycle.

  13. A vapor-phase deposited polymer film to improve the adhesion of electroless-deposited copper layer onto various kinds of substrates.

    Science.gov (United States)

    You, Jae Bem; Kim, Shin Young; Park, Yong Jin; Ko, Young Gwan; Im, Sung Gap

    2014-01-28

    The adhesion of electrodeposited metal film to polymeric circuit board substrate is one of the key elements to successful miniaturization of electronic devices. However, as the size of the circuit pattern continuously decreases, a novel method is urgently required to increase the adhesion of the metal film on the substrate, especially on the smooth surface, which is critical to decrease the minimum feature size of the metal pattern. In this research, we developed an adhesion promoter layer by depositing metal chelating poly(4-vinylpyridine) (P4VP) film onto various organic and inorganic substrates via initiated chemical vapor deposition process (iCVD) to enhance the adhesion between the electroless deposited copper (Cu) layer and the substrate. The highest peel strength obtained between the electroless deposited Cu layer and P4VP coated substrate was 1.22 kgf/cm. Many advantageous characteristics of the adhesion promoter layer, including extreme thinness, the improved adhesion strength, conformal coverage, scalability of the deposition process, and short process time, will prompt the applicability of this adhesion promoter layer to industrial scale production.

  14. Iron oxychloride (FeOCl): an efficient Fenton-like catalyst for producing hydroxyl radicals in degradation of organic contaminants.

    Science.gov (United States)

    Yang, Xue-jing; Xu, Xi-meng; Xu, Jing; Han, Yi-fan

    2013-10-30

    An iron oxychloride (FeOCl) catalyst was developed for oxidative degradation of persistent organic compounds in aqueous solutions. Exceptionally high activity for the production of hydroxyl radical (OH·) by H2O2 decomposition was achieved, being 2-4 orders of magnitudes greater than that over other Fe-based heterogeneous catalysts. The relationship of catalyst structure and performance has been established by using multitechniques, such as XRD, HRTEM, and EPR. The unique structural configuration of iron atoms and the reducible electronic properties of FeOCl are responsible for the excellent activity. This study paves the way toward the rational design of relevant catalysts for applications, such as wastewater treatment, soil remediation, and other emerging environmental problems.

  15. Preparation and Analysis of Complex Barrier Layer of Heterocyclic and Long-Chain Organosilane on Copper Alloy Surface

    Directory of Open Access Journals (Sweden)

    Qian Zhao

    2016-07-01

    Full Text Available A single electrodeposited film of 6-(3-triethoxysilylpropylamino-1,3,5-triazine-2,4-dithiol monosodium (TES on a copper alloy surface was prepared by the galvanostatic method, then octyl-triethoxysilane (OTES or hexadecyl-trimethoxysilane (HDTMS was used to modify the electrodeposited film by the self-assembled technique to fabricate the complex film. The electrodeposition process was inferred by cyclic voltammetry. The single and complex films were characterized by means of contact angle, cyclic voltammetry, Fourier transform infrared spectroscopy (FT-IR, potentiodynamic polarization, electrochemical impedance spectroscopy (EIS and scanning electron microscope (SEM. The results showed that the contact angle of the complex film covering the copper alloy surface was up to 118.1° compared with 89.4° of the bare copper alloy. The cyclic voltammogram, polarization curves and EIS indicated that the anti-corrosion performance of complex film was better than that of single electrodeposited TES film, and the protection efficiency was up to 90.2%.

  16. Selective extraction and release using (EDTA-Ni)-layered double hydroxide coupled with catalytic oxidation of 3,3',5,5'-tetramethylbenzidine for sensitive detection of copper ion.

    Science.gov (United States)

    Tang, Sheng; Chang, Yuepeng; Chia, Guo Hui; Lee, Hian Kee

    2015-07-23

    Copper is an important heavy metal in various biological processes. Many methods have been developed for detecting of copper ions (Cu(2+)) in aqueous samples. However, an easy, cheap, selective and sensitive method is still desired. In this study, a selective extraction-release-catalysis approach has been developed for sensitive detection of copper ion. Ethylenediaminetetraacetic acid (EDTA) chelated with nickel ion (Ni(2+)) were intercalated in a layered double hydroxide via a co-precipitation reaction. The product was subsequently applied as sorbent in dispersive solid-phase extraction for the enrichment of Cu(2+) at pH 6. Since Cu(2+) has a stronger complex formation constant with EDTA, Ni(2+) exchanged with Cu(2+) selectively. The resulting sorbent containing Cu(2+) was transferred to catalyze the 3,3',5,5'-tetramethylbenzidine oxidation reaction, since Cu(2+) could be released by the sorbent effectively and has high catalytic ability for the reaction. Blue light emitted from the oxidation product was measured by ultraviolet-visible spectrophotometry for the determination of Cu(2+). The extraction temperature, extraction time, and catalysis time were optimized. The results showed that this method provided a low limit of detection of 10nM, a wide linear range (0.05-100μM) and good linearity (r(2)=0.9977). The optimized conditions were applied to environmental water samples. Using Cu(2+) as an example, this work provided a new and interesting approach for the convenient and efficient detection of metal cations in aqueous samples. Copyright © 2015 Elsevier B.V. All rights reserved.

  17. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

    Directory of Open Access Journals (Sweden)

    Pan Yi

    2017-02-01

    Full Text Available The electrochemical migration (ECM behavior of copper-clad laminate (PCB-Cu and electroless nickel/immersion gold printed circuit boards (PCB-ENIG under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed.

  18. Characterisation of corrosion layers formed under burial environment of copper-based Greek and Roman coins from Pompeii

    Science.gov (United States)

    Pronti, Lucilla; Felici, Anna Candida; Alesiani, Marcella; Tarquini, Ombretta; Bracciale, Maria Paola; Santarelli, Maria Laura; Pardini, Giacomo; Piacentini, Mario

    2015-10-01

    This paper reports on a study carried out on patinas covering copper-based Greek and Roman coins found in the archaeological excavation of Regio VIII.7.1-15 in Pompeii (Italy). Since in cultural heritage ancient artefacts should not be damaged, non-destructive and micro-destructive techniques have been used to identify typical and uncommon compounds and to characterize the surface morphology. The chlorine content of light green patinas and the presence of typical minerals allowed us to identify the bronze disease. Coins from the same stratigraphic unit have shown different morphologies of corrosion, probably due to different micro-environmental conditions.

  19. Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Young-Soon [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Kim, Hyung-Il [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Cho, Joong-Hee [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Seo, Hyung-Kee [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Dar, M.A. [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Shin, Hyung-Shik [Thin Film Technology Lab, School of Chemical Engineering, Chonbuk National University, Jeonju 561756 (Korea, Republic of); Ten Eyck, Gregory A. [Department of Physics, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States); Lu, Toh-Ming [Department of Physics, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States); Senkevich, Jay J. [Brewer Science Inc., Rolla, MO 65401 (United States)]. E-mail: jsenkevich@brewerscience.com

    2006-02-25

    Electroless Cu was investigated on refractory metal, W and TaN {sub X}, and Ir noble metal substrates with a plasma-assisted atomic layer deposited palladium layer for the potential back-end-of-the-line (BEOL) metallization of advanced integrated devices. The sodium and potassium-free Cu electroless bath consisted of: ethylenediamine tetraacetic acid (EDTA) as a chelating agent, glyoxylic acid as a reducing agent, and additional chemicals such as polyethylene glycol, 2,2'-dipyridine and RE-610 as surfactant, stabilizer and wetting agent respectively. The growth and chemical characterization of the Cu films was carried out with a field emission scanning electron microscope (FE-SEM), X-ray photoelectron spectroscopy (XPS), and Rutherford backscattering spectrometry (RBS). Group VIII metals such as Pt, Pd, etc., are stable in the electroless bath and catalytic towards the oxidation of glyoxylic acid and therefore work well for the electroless deposition of Cu. From RBS analysis, the amount of carbon and oxygen in Cu films were less than 1-3%. The Cu films were electroless deposited at 45-50 deg. C on patterned tantalum nitride with plasma-assisted atomic layer deposited (PA-ALD) Pd as a catalytic layer. Electroless Cu trench fill was successful with ultrasonic vibration, RE-610, and lowering the temperature to 45-50 deg. C on TaN {sub X} with the PA-ALD Pd catalytic layer.

  20. Textured tape substrates from binary copper alloys with vanadium and yttrium for the epitaxial deposition of buffer and superconducting layers

    Science.gov (United States)

    Khlebnikova, Yu. V.; Rodionov, D. P.; Egorova, L. Yu.; Suaridze, T. R.

    2016-05-01

    The structure of tapes of binary Cu-0.6 wt % V and Cu-1 wt % Y alloys and texturing process of them in the course of cold deformation by rolling to 99% and subsequent recrystallizing annealing have been studied. The possibility of achieving the perfect cube texture in thin tapes made from binary copper-based alloys with vanadium and yttrium additions has in principle been shown. This opens the prospect of using them as substrates when manufacturing tapes of second-generation high-temperature superconductors. Optimum annealing conditions for the studied alloys have been determined, which have made it possible to produce the perfect biaxial texture with a content of cube {001} ± 10° grains on the surfaces of textured tapes of more than 95%.

  1. Insight into Bio-metal Interface Formation in vacuo: Interplay of S-layer Protein with Copper and Iron

    Science.gov (United States)

    Makarova, Anna A.; Grachova, Elena V.; Neudachina, Vera S.; Yashina, Lada V.; Blüher, Anja; Molodtsov, Serguei L.; Mertig, Michael; Ehrlich, Hermann; Adamchuk, Vera K.; Laubschat, Clemens; Vyalikh, Denis V.

    2015-03-01

    The mechanisms of interaction between inorganic matter and biomolecules, as well as properties of resulting hybrids, are receiving growing interest due to the rapidly developing field of bionanotechnology. The majority of potential applications for metal-biohybrid structures require stability of these systems under vacuum conditions, where their chemistry is elusive, and may differ dramatically from the interaction between biomolecules and metal ions in vivo. Here we report for the first time a photoemission and X-ray absorption study of the formation of a hybrid metal-protein system, tracing step-by-step the chemical interactions between the protein and metals (Cu and Fe) in vacuo. Our experiments reveal stabilization of the enol form of peptide bonds as the result of protein-metal interactions for both metals. The resulting complex with copper appears to be rather stable. In contrast, the system with iron decomposes to form inorganic species like oxide, carbide, nitride, and cyanide.

  2. SEMICONDUCTOR DEVICES Low voltage copper phthalocyanine organic thin film transistors with a polymer layer as the gate insulator

    Science.gov (United States)

    Xueqiang, Liu; Weihong, Bi; Tong, Zhang

    2010-12-01

    Low voltage organic thin film transistors (OTFTs) were created using polymethyl-methacrylate-co g-lyciclyl-methacrylate (PMMA-GMA) as the gate dielectric. The OTFTs performed acceptably at supply voltages of about 10 V. From a densely packed copolymer brush, a leakage current as low as 2 × 10-8 A/cm2 was obtained. From the measured capacitance—insulator frequency characteristics, a dielectric constant in the range 3.9-5.0 was obtained. By controlling the thickness of the gate dielectric, the threshold voltage was reduced from -3.5 to -2.0 V. The copper phthalocyanine (CuPc) based organic thin film transistor could be operated at low voltage and 1.2 × 10-3 cm2/(V·s) mobility.

  3. Investigation of defects in ultra-thin Al{sub 2}O{sub 3} films deposited on pure copper by the atomic layer deposition technique

    Energy Technology Data Exchange (ETDEWEB)

    Chang, M.L.; Wang, L.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Lin, H.C., E-mail: hclinntu@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Chen, M.J., E-mail: mjchen@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan (China); Lin, K.M. [Department of Materials Science and Engineering, Feng Chia University, No. 100, Wenhwa Road, Seatwen, Taichung 40724, Taiwan (China)

    2015-12-30

    Graphical abstract: Some residual OH ligands originating from incomplete reaction between TMA and surface species of OH* during ALD process induce the defects in deposited Al{sub 2}O{sub 3} films. Three possible types of defects are suggested. The analytic results indicate the defects are Type-I and/or Type-II but do not directly expose the substrate, like pinholes (Type-III). - Highlights: • Oxidation trials were conducted to investigate the defects in ultra-thin Al{sub 2}O{sub 3} films deposited ALD technique on pure copper. • The residual OH ligands in the deposited Al{sub 2}O{sub 3} films induce looser micro-structure which has worse oxidation resistance. • Superficial contamination particles on substrate surface are confirmed to be one of nucleation sites of the defects. - Abstract: Al{sub 2}O{sub 3} films with various thicknesses were deposited by the atomic layer deposition (ALD) technique on pure copper at temperatures of 100–200 °C. Oxidation trials were conducted in air at 200 °C to investigate the defects in these films. The analytic results show that the defects have a looser micro-structure compared to their surroundings, but do not directly expose the substrate, like pinholes. The film's crystallinity, mechanical properties and oxidation resistance could also be affected by these defects. Superficial contamination particles on the substrate surface are confirmed to be nucleation sites of the defects. A model for the mechanism of defect formation is proposed in this study.

  4. Metallicity of Ca{sub 2}Cu{sub 6}P{sub 5} with single and double copper-pnictide layers

    Energy Technology Data Exchange (ETDEWEB)

    Li, Li, E-mail: lil2@ornl.gov [Materials Science & Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831 (United States); Parker, David [Materials Science & Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831 (United States); Chi, Miaofang [Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, TN 37831 (United States); Tsoi, Georgiy M.; Vohra, Yogesh K. [Department of Physics, University of Alabama at Birmingham, Birmingham, AL 35294 (United States); Sefat, Athena S., E-mail: sefata@ornl.gov [Materials Science & Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831 (United States)

    2016-06-25

    We report thermodynamic and transport properties, and also theoretical calculations, for Cu-based compound Ca{sub 2}Cu{sub 6}P{sub 5} and compare with CaCu{sub 2-δ}P{sub 2}. Both materials have layers of edge-sharing copper pnictide tetrahedral CuP{sub 4}, similar to Fe–As and Fe–Se layers (with FeAs{sub 4}, FeSe{sub 4}) in the iron-based superconductors. Despite the presence of this similar transition-metal pnictide layer, we find that both Ca{sub 2}Cu{sub 6}P{sub 5} and CaCu{sub 2-δ}P{sub 2} have temperature-independent magnetic susceptibility and show metallic behavior with no evidence of either magnetic ordering or superconductivity down to 1.8 K CaCu{sub 2-δ}P{sub 2} is slightly off-stoichiometric, with δ = 0.14. Theoretical calculations suggest that unlike Fe 3d-based magnetic materials with a large density of states (DOS) at the Fermi surface, Cu have comparatively low DOS, with the majority of the 3d spectral weight located well below Fermi level. The room-temperature resistivity value of Ca{sub 2}Cu{sub 6}P{sub 5} is only 9 μΩ-cm, due to a substantial plasma frequency and an inferred electron-phonon coupling λ of 0.073 (significantly smaller than that of metallic Cu). Also, microscopy result shows that Cu–Cu distance along the c-axis within the double layers can be very short (2.5 Å), even shorter than metallic elemental copper bond (2.56 Å). The value of dρ/dT for CaCu{sub 2-δ}P{sub 2} at 300 K is approximately three times larger than in Ca{sub 2}Cu{sub 6}P{sub 5}, which suggests the likelihood of stronger electron-phonon coupling. This study shows that the details of Cu–P layers and bonding are important for their transport characteristics. In addition, it emphasizes the remarkable character of the DOS of ‘122’ iron-based materials, despite much structural similarities. - Highlights: • A comprehensive study on Cu-based compound Ca{sub 2}Cu{sub 6}P{sub 5} and compare with CaCu{sub 2-δ}P{sub 2}. • Both materials have layers of

  5. Physical, thermal, structural and optical absorption studies of vanadyl doped magnesium oxy-chloride bismo-borate glasses

    Directory of Open Access Journals (Sweden)

    M.S. Dahiya

    2015-06-01

    Full Text Available Oxy-chloride bismuth-borate glasses with composition xMgCl2·(30 − xMgO·20Bi2O3·50B2O3 containing 2 mol% doping of V2O5 (x = 12, 15, 20, 25 and 30 are prepared by melt-quenching technique. The structural, thermal and optical behaviors are explained by analyzing the data obtained from density (D, molar volume (Vm, theoretical optical basicity (Λth, differential scanning calorimetry (DSC, FTIR and UV–vis results. A decrease in D and increase in Vm (except for sample MBV3 for which D is maximum on increasing chloride content suggests the formation of non-bridging oxygen atoms. Maximum glass transition temperature (Tg and crystallization temperature (Tx have been observed for sample MBV3. The glass stability (S and stability ratio (S/Tg have been calculated from the values of Tg and Tx and both are having maximum values for sample MBV3. Study of the FTIR spectra in the mid-IR range reveals the presence of both triangular and tetrahedral coordinated boron. The optical studies through UV–vis spectral analysis show non-sharp edge. The optical band gap (Eg is also maximum for sample MBV3.

  6. Perpendicular Giant Magnetoresistance and Magnetic Properties of Co/Cu Nanowire Arrays Affected by Period Number and Copper Layer Thickness

    Directory of Open Access Journals (Sweden)

    Juan Han

    2016-01-01

    Full Text Available One-dimensional magnetic nanowires have attracted much attention in the last decades due to their unique physical properties and potential applications in magnetic recording and spintronics. In this work, ordered arrays of Co/Cu multilayered nanowires which can be exploited to develop magnetoresistive sensors were successfully prepared using porous anodic alumina (PAA templates. The structure and morphology of the multilayered nanowire arrays were characterized by transmission electron microscopy and scanning electron microscopy. The nanowire arrays are highly ordered and the average diameter is about 50 nm, which is controlled by the pore diameter of the PAA templates. The influences of period number and Cu layer thickness on the magnetic and the giant magnetoresistance (GMR properties were investigated. The coercivity and remanence ratio increase first and then gradually tend to be stable with the increase of period number and the Cu layer thickness, while the GMR ratio increases first and then decreases with the increase of the period number accompanied by an oscillatory behavior of GMR as the Cu layer thickness changes, which are ascribed to the spin dependence electron scattering in the multilayers. The optimum GMR of −13% appears at Co (50 nm/Cu (5 nm with 200 deposition cycles in our experimental conditions.

  7. Hydroxyethyl cellulose doped with copper(II) phthalocyanine-tetrasulfonic acid tetrasodium salt as an effective dual functional hole-blocking layer for polymer light-emitting diodes

    Science.gov (United States)

    Wu, Cheng-Liang; Chen, Yun

    2017-07-01

    We report a doping method to improve the performance of solution-processed polymer light-emitting diodes (PLEDs). Doping 12 wt% copper(II) phthalocyanine-tetrasulfonated acid tetrasodium salt (TS-CuPc) into hydroxyethyl cellulose (HEC) as a dual functional hole-blocking layer (df-HBL) of multilayer PLED (glass/ITO/PEDOT:PSS/HY-PPV/TS-CuPc-doped HEC/LiF/Al) significantly enhanced maximum luminance, maximum current and power efficiency over that without the df-HBL (10,319 cd/m2, 2.98 cd/A and 1.24 lm/W) to (29,205 cd/m2, 13.27 cd/A and 9.56 lm/W). CV measurements reveal that HEC possesses a powerful hole-blocking capability. Topography and conductivity AFM images show that doping TS-CuPc increases the interfacial contact area and interfacial conductivity, which can overcome the insulating nature of HEC and thus further facilitate electron injection. Enhancements in device performance are attributed to the improved carrier balance and recombination in the presence of df-HBL, confirmed in electron-only and hole-only devices. Moreover, apparently raised open-circuit voltages provide further evidence that enhanced electron injection is indeed realized by the df-HBL. This study demonstrates an effective approach to develop highly efficient PLEDs.

  8. Solution-processed inorganic copper(I) thiocyanate (CuSCN) hole transporting layers for efficient p–i–n perovskite solar cells

    KAUST Repository

    Zhao, Kui

    2015-08-27

    CuSCN is a highly transparent, highly stable, low cost and easy to solution process HTL that is proposed as a low cost replacement to existing organic and inorganic metal oxide hole transporting materials. Here, we demonstrate hybrid organic-inorganic perovskite-based p-i-n planar heterojunction solar cells using a solution-processed copper(I) thiocyanate (CuSCN) bottom hole transporting layer (HTL). CuSCN, with its high workfunction, increases the open circuit voltage (Voc) by 0.23 V to 1.06 V as compared with devices based on the well-known poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) (0.83 V), resulting in a superior power conversion efficiency (PCE) of 10.8% without any notable hysteresis. Photoluminescence measurements suggest a similar efficiency of charge transfer at HTL/perovskite interface as PEDOT:PSS. However, we observe more efficient light harvesting in the presence of CuSCN at shorter wavelengths despite PEDOT:PSS being more transparent. Further investigation of the microstructure and morphology reveals differences in the crystallographic texture of the polycrystalline perovskite film, suggesting somewhat modified perovskite growth on the surface of CuSCN. The successful demonstration of the solution-processed inorganic HTL using simple and low temperature processing routes bodes well for the development of reliable and efficient flexible p-i-n perovskite modules or for integration as a front cell in hybrid tandem solar cells.

  9. Uptake of seed-applied copper by maize and the effects on seed vigor

    Directory of Open Access Journals (Sweden)

    Marcos Altomani Neves Dias

    2015-01-01

    Full Text Available Seed treatment is a low-cost and efficacious method to deliver a diversity of compounds to field crops. This study evaluated the uptake of seed-applied Cu by maize and the effect on seed vigor. The treatments were composed of a control (untreated seeds and five dosages of Cu: 0.11, 0.22, 0.44, 0.88 and 1.76 mg Cu seed–1, applied as cuprous oxide and copper oxychloride formulations. Seedling emergence and the speed of seedling emergence were determined in three periods: 1, 60 and 120 days after Cu application. Evaluations of root and shoot dry mass, Cu tissue concentration and efficiencies of Cu uptake and incorporation were conducted with two-leaf stage maize plants. Seed-applied Cu reduces the speed of maize seedling emergence, while the final emergence percentage is not affected. Shoot dry mass tends to increase with the application of Cu, while there is no interference on root dry mass within the dosages tested. Cu tissue concentration of both roots and shoots increases as higher dosages of Cu are applied to seeds, with higher accumulation in roots. Cuprous oxide promotes higher uptake of Cu by maize roots compared to copper oxychloride.

  10. Copper hypersensitivity.

    Science.gov (United States)

    Fage, Simon W; Faurschou, Annesofie; Thyssen, Jacob P

    2014-10-01

    The world production of copper is steadily increasing. Although humans are widely exposed to copper-containing items on the skin and mucosa, allergic reactions to copper are only infrequently reported. To review the chemistry, biology and accessible data to clarify the implications of copper hypersensitivity, a database search of PubMed was performed with the following terms: copper, dermatitis, allergic contact dermatitis, contact hypersensitivity, contact sensitization, contact allergy, patch test, dental, IUD, epidemiology, clinical, and experimental. Human exposure to copper is relatively common. As a metal, it possesses many of the same qualities as nickel, which is a known strong sensitizer. Cumulative data on subjects with presumed related symptoms and/or suspected exposure showed that a weighted average of 3.8% had a positive patch test reaction to copper. We conclude that copper is a very weak sensitizer as compared with other metal compounds. However, in a few and selected cases, copper can result in clinically relevant allergic reactions.

  11. Copper transport.

    Science.gov (United States)

    Linder, M C; Wooten, L; Cerveza, P; Cotton, S; Shulze, R; Lomeli, N

    1998-05-01

    In adult humans, the net absorption of dietary copper is approximately 1 mg/d. Dietary copper joins some 4-5 mg of endogenous copper flowing into the gastrointestinal tract through various digestive juices. Most of this copper returns to the circulation and to the tissues (including liver) that formed them. Much lower amounts of copper flow into and out of other major parts of the body (including heart, skeletal muscle, and brain). Newly absorbed copper is transported to body tissues in two phases, borne primarily by plasma protein carriers (albumin, transcuprein, and ceruloplasmin). In the first phase, copper goes from the intestine to the liver and kidney; in the second phase, copper usually goes from the liver (and perhaps also the kidney) to other organs. Ceruloplasmin plays a role in this second phase. Alternatively, liver copper can also exit via the bile, and in a form that is less easily reabsorbed. Copper is also present in and transported by other body fluids, including those bathing the brain and central nervous system and surrounding the fetus in the amniotic sac. Ceruloplasmin is present in these fluids and may also be involved in copper transport there. The concentrations of copper and ceruloplasmin in milk vary with lactational stage. Parallel changes occur in ceruloplasmin messenger RNA expression in the mammary gland (as determined in pigs). Copper in milk ceruloplasmin appears to be particularly available for absorption, at least in rats.

  12. Surface modification of inorganic layer compound with organic compound and preparation of thin films

    Science.gov (United States)

    Tagaya, Hideyuki; Morioka, Hiroyuki; Ogata, Sumikazu; Karasu, Masa; Kadokawa, Jun-ichi; Chiba, Koji

    1997-11-01

    Water treated Zn/Al layered double hydroxide (LDH) was prepared by the reaction of LDH oxide and water. By the reaction of the water treated Zn/Al LDH or amorphous metal hydroxide and organic oxychloride, surface modified inorganic layer compounds were prepared. Their layer structures were similar to those of the orginal LDHs except the reaction product of amorphous metal hydroxide and benzoyl chloride. Interlayer spacings of the reaction products were 0.77 to 2.67 nm depending on the size and number of function groups of organic compounds.

  13. Influence of pH and soil copper on adsorption of metalaxyl and penconazole by the surface layer of vineyard soils.

    Science.gov (United States)

    Arias, M; Paradelo, M; López, E; Simal-Gándara, J

    2006-10-18

    The upper horizons of old vineyard soils have substantial copper contents due to the traditional use of copper-based fungicides. Total copper levels in eight vineyard soils in the Rías Baixas area of Galicia (northwestern Spain) ranged from 60 to 560 mg kg(-1) (mean +/- SD = 206 +/- 170 mg kg(-1)). The adsorption of the fungicides metalaxyl (pK(a) = 1.41) and penconazole (pK(a) = 2.83) by these soils was determined using fungicide solutions of pH 2.5 and 5.5, and desorption of fungicide adsorbed at pH 5.5 was also determined. In all cases, Freundlich equations were fitted to the data with R (2) > 0.96. Penconazole was adsorbed and retained more strongly than metalaxyl, with K(F) values more than an order of magnitude greater. In the desorption experiments, both fungicides exhibited hysteresis. Soil copper content hardly affected the adsorption of metalaxyl, but K(F) values for adsorption of penconazole increased at a rate of about 0.1 mL(n) (microg of penconazole)(1-n) (microg of Cu)(-1), which is attributed to the formation of Cu(2+)-penconazole complexes with greater affinity for soil colloids than penconazole itself. Because the dependence of K(F) for penconazole adsorption on copper content was the same at both pH values, complex formation appears not to have been affected by the solubilization of 6-17% of soil copper at pH 2.5. A similar copper dependence, or lack of dependence, was observed when 100-1000 mg kg(-1) of copper was added as Cu(NO(3))(2).2H(2)O to the solutions from which the fungicides were adsorbed.

  14. Copper hypersensitivity

    DEFF Research Database (Denmark)

    Fage, Simon W; Faurschou, Annesofie; Thyssen, Jacob P

    2014-01-01

    hypersensitivity, a database search of PubMed was performed with the following terms: copper, dermatitis, allergic contact dermatitis, contact hypersensitivity, contact sensitization, contact allergy, patch test, dental, IUD, epidemiology, clinical, and experimental. Human exposure to copper is relatively common...

  15. ENVIRONMENTAL RISK ASSESSMENT OF SOME COPPER BASED FUNGICIDES ACCORDING TO THE REQUIREMENTS OF GOOD LABORATORY PRACTICE

    Directory of Open Access Journals (Sweden)

    Marga GRĂDILĂ

    2015-10-01

    Full Text Available The paper presents data demonstrating the functionality of biological systems reconstituted with aquatic organisms developed under Good Laboratory Practice testing facility within Research - Development Institute for Plant Protection Bucharest for environmental risk assessment of four fungicides based on copper, according to Good Laboratory Practice requirements. For risk assessment, according to GLP were made the following steps: Good Laboratory Practice test facility was established, we have ensured adequate space for growth, acclimatization and testing for each test species, it was installed a complex water production instalation needed to perform tests, it was achieved control system for checking environmental conditions and have developed specific operating procedures that have been accredited according to Good Laboratory Practice.The results showed that biological systems model of the Good Laboratory Practice test facility in Research - Development Institute for Plant Protection meet the requirements of Organisation for Economic Co-operation and Development Guidelines regarding GLP, and after testing copper-based fungicides in terms of acute toxicity Cyprinus carpio and to Daphnia magna revealed that three of them (copper oxychloride, copper hydroxide and copper sulphate showed ecological efficiency, ie low toxicity. Metallic copper based fungicides showed a higher toxicity, resulting in fish toxicity symptoms: sleep, sudden immersion, faded, weakness, swimming in spiral, lack of balance, breathing slow and cumbersome, spasms and mortality.

  16. The preparation of water resistance magnesium oxychloride cement/glass fiber composite materials%耐水氯氧镁水泥/玻璃纤维复合材料的研制

    Institute of Scientific and Technical Information of China (English)

    郑亚林; 刘涛; 刘旭华; 林海燕; 阳勇福; 王玉江

    2013-01-01

    通过添加外加剂,对氯氧镁水泥进行改性,制备耐水氯氧镁水泥/玻璃纤维复合材料,实验结果表明:单一外加剂在氯氧镁水泥中有最佳掺量;磷酸的加入,可以增加氯氧镁水泥/玻璃纤维复合材料的耐水性能;减水剂与FeSO4的交互作用显著,当减水剂用量为0.25%、FeSO4用量为1.5%时复合材料的强度最高,耐水性能良好;通过外加剂的复配,可以制备耐水的氯氧镁水泥/玻璃纤维复合材料.%Magnesium oxychloride cement was modified with additive,and the water resistant magnesium oxychloride cement/glass fiber composite materials were prepared.Test results showed that:a single admixture in magnesium oxychloride cement had the best dosage; the properties of the magnesium oxychloride cement/glass fiber composite material could be increased with phosphoric acid; the interaction of water reducing agent and FeSO4 was significant,when superplasticizer dosage was 0.25% and FeSO4 dosage was 1.5%,the intensity of composite material was the highest,and water resistance was very well.The high strength,water resistance magnesium oxychloride cement/glass fiber composite material the could be prepared with additive compound

  17. 锌镍合金用于载体支撑超薄铜箔剥离层的研究%Study on Zn-Ni Alloy Used for Stripping Layer of Ultra-thin Copper Foil with Carrier Foil

    Institute of Scientific and Technical Information of China (English)

    邓庚凤; 黄崛起; 赖远腾; 徐鹏

    2013-01-01

    High-zinc and low-nickel alloy coating used for stripping layer on 35 μm ultra-thin copper foil as carrier foil was electrodeposited. Ultra-thin copper foil was electrodeposited in pyrophosphate solution, and then ultra-thin copper carrier foil was prepared. The effects of ratio of zinc sulfate and nickel sulfate, dosage of complexing agent of potassium pyrophosphate trihydrate, dosage of additives of gelatin on the properties of stripping layer were investigated. The results show that zinc and nickel can be co-electroplated under the conditions including zinc sulfate of 12 g/L, nickel sulfate of 6 g/L, potassium pyrophosphate trihydrate of 0. 5 mol/L, gelatin of 0. 2 g/L and sodium dodecyl benzene sulfonate 0. 2~0. 3 g/L. Peelable strength between ultra-thin copper foil and carrier copper foil is stable and can reach 4. 7 N/cm when zinc-nickel alloy is used as a stripping layer.%在35μm载体铜箔上电镀一层高锌低镍合金镀层作为剥离层,再在焦磷酸盐液中电沉积超薄铜箔层,最后制得载体支撑超薄铜箔.考察了镀液硫酸锌和硫酸镍的配比、焦磷酸钾络合剂及明胶添加剂等对剥离层性能的影响.结果表明,在剥离层镀液中Zn2+∶Ni2+=4∶1,焦磷酸钾0.5 mol/L,明胶0.2g/L,十二烷基苯磺酸钠0.2~0.3 g/L条件下,锌和镍能够共同沉积,该镀层作为剥离层后剥离效果良好,载体箔和超薄铜箔间的剥离强度较稳定,可以达到4.7 N/cm.

  18. Modeling the influence of raindrop size on the wash-off losses of copper-based fungicides sprayed on potato (Solanum tuberosum L.) leaves.

    Science.gov (United States)

    Pérez-Rodríguez, Paula; Paradelo, Marcos; Rodríguez-Salgado, Isabel; Fernández-Calviño, David; López-Periago, José Eugenio

    2013-01-01

    Modeling the pesticide wash-off by raindrops is important for predicting pesticide losses and the subsequent transport of pesticides to soil and in soil run-off. Three foliar-applied copper-based fungicide formulations, specifically the Bordeaux mixture (BM), copper oxychloride (CO), and a mixture of copper oxychloride and propylene glycol (CO-PG), were tested on potato (Solanum tuberosum L.) leaves using a laboratory raindrop simulator. The losses in the wash-off were quantified as both copper in-solution loss and copper as particles detached by the raindrops. The efficiency of the raindrop impact on the wash-off was modeled using a stochastic model based on the pesticide release by raindrops. In addition, the influence of the raindrop size, drop falling height, and fungicide dose was analyzed using a full factorial experimental design. The average losses per dose after 14 mm of dripped water for a crop with a leaf area index equal to 1 were 0.08 kg Cu ha(-1) (BM), 0.3 kg Cu ha(-1) (CO) and 0.47 kg Cu ha(-1) (CO-PG). The stochastic model was able to simulate the time course of the wash-off losses and to estimate the losses of both Cu in solution and as particles by the raindrop impacts. For the Cu-oxychloride fungicides, the majority of the Cu was lost as particles that detached from the potato leaves. The percentage of Cu lost increased with the decreasing raindrop size in the three fungicides for the same amount of dripped water. This result suggested that the impact energy is not a limiting factor in the particle detachment rate of high doses. The dosage of the fungicide was the most influential factor in the losses of Cu for the three formulations studied. The results allowed us to quantify the factors that should be considered when estimating the losses by the wash-off of copper-based fungicides and the inputs of copper to the soil by raindrop wash-off.

  19. Explosive compact-coating of tungsten–copper alloy to a copper surface

    Science.gov (United States)

    Chen, Xiang; Li, Xiaojie; Yan, Honghao; Wang, Xiaohong; Miao, Yusong

    2017-03-01

    This study proposed a new method for coating tungsten–copper alloy to copper surface. First, the tungsten–copper alloy powder was pre-compacted to the copper surface. Then, the powder in the hydrogen atmosphere was sintered, and the pre-compacted powder was compacted by explosive compact-coating. Finally, diffusion sintering was conducted to improve the density of the coating layer. The theoretical density of the coating reached 99.3%. Microstructure characteristics indicated that tungsten and copper powders were well mixed. Tungsten particles were larger than copper particles. Scanning electron microscope (SEM) fracture surface analysis was different from the traditional fracture of metals. Coating and substrate joint surfaces, which were analyzed by SEM, indicated that the tungsten–copper alloy was sintered on the copper surface. The hardness of the coating layer was 197.6–245.2 HV, and the hardness of the substrate was approximately 55 HV.

  20. High-strength braze joints between copper and steel

    Science.gov (United States)

    Kuhn, R. F.

    1967-01-01

    High-strength braze joints between copper and steel are produced by plating the faying surface of the copper with a layer of gold. This reduces porosity in the braze area and strengthens the resultant joint.

  1. Mechanism of copper selenide growth on copper-oxide selenium system

    Science.gov (United States)

    Ishikawa, Y.; Kido, O.; Kimura, Y.; Kurumada, M.; Suzuki, H.; Saito, Y.; Kaito, C.

    2004-01-01

    Transmission electron microscopy was used to study spontaneous copper selenide formation on Cu particles covered with an oxide layer. Even if the copper particle surface was covered with a Cu 2O layer, selenides were formed by diffusion through the metal oxide layer. For a particle size less than 50 nm, selenide was formed in Cu particles by the diffusion of Se atoms passing through the Cu 2O layer. For particles larger than 100 nm in size, selenide was formed in Se film. It was also found that the thickness of the Cu 2O layer on the surface of Cu particle accelerated diffusion of Se atoms to the copper particle.

  2. Reactivity test between beryllium and copper

    Energy Technology Data Exchange (ETDEWEB)

    Kawamura, H. [Japan Atomic Energy Research Institute, Ibaraki-ken (Japan); Kato, M. [NGK Insulators, Ltd., Aichi-ken (Japan)

    1995-09-01

    Beryllium has been expected for using as plasma facing material on ITER. And, copper alloy has been proposed as heat sink material behind plasma facing components. Therefore, both materials must be joined. However, the elementary process of reaction between beryllium and copper alloy does not clear in detail. For example, other authors reported that beryllium reacted with copper at high temperature, but it was not obvious about the generation of reaction products and increasing of the reaction layer. In the present work, from this point, for clarifying the elementary process of reaction between beryllium and copper, the out-of-pile compatibility tests were conducted with diffusion couples of beryllium and copper which were inserted in the capsule filled with high purity helium gas (6N). Annealing temperatures were 300, 400, 500, 600 and 700{degrees}C, and annealing periods were 100, 300 and 1000h. Beryllium specimens were hot pressed beryllium, and copper specimens were OFC (Oxygen Free Copper).

  3. The Effective Electrolytic Recovery of Dilute Copper from Industrial Wastewater

    Directory of Open Access Journals (Sweden)

    Teng-Chien Chen

    2013-01-01

    Full Text Available Electroplating copper industry was discharged huge amount wastewater and cause serious environmental and health damage in Taiwan. This research applied electrical copper recovery system to recover copper metal. In this work, electrotreatment of a industrial copper wastewater ([Cu] = 30000 mg L−1 was studied with titanium net coated with a thin layer of RuO2/IrO2 (DSA reactor. The optimal result for simulated copper solution was 99.9% copper recovery efficiency in current density 0.585 A/dm2 and no iron ion. Due to high concentration of iron and chloride ions in real industrial wastewater, the copper recovery efficiency was down to 60%. Although, the copper recovery efficiency was not high as simulated copper solution, high environmental economic value was included in the technology. The possibility of pretreating the wastewater with iron is the necessary step, before the electrical recovery copper system.

  4. Plating Layer Structure and Property of Silver-Coated Copper Power with High Silver Content%高银含量银包铜粉镀层结构及性能研究

    Institute of Scientific and Technical Information of China (English)

    胡磊; 朱晓云

    2012-01-01

    采用化学镀法制备具有高银含量、一定厚度、致密性好的银包铜粉,用SEM、XRD、粒度分布仪、数字欧姆表和差热分析仪表征了镀银铜粉和原始铜粉的表面形貌、表面结构及导电性能.结果表明:高银含量银包铜粉表面镀层致密性好、包覆完全,包覆层厚度达到336 nm,同时具有较好的导电性和抗氧化性.%The silver-coated copper powder with high silver content, a silver layer of certain thickness and high density was prepared by chemistry plating reaction. The surface morphology, structure and conductivity of the coated powder and the initial powder were characterized by SEM, XRD, LSPSDA, DOM and TG-DTA. Results show that the surface of the silver-coated copper power with high silver content is dense and coated completely, and the coating thickness is up to 336 nm. The powder has good conductivity and oxidation resistance.

  5. In situ synchrotron X-ray diffraction investigation of the evolution of a PbO₂/PbSO₄ surface layer on a copper electrowinning Pb anode in a novel electrochemical flow cell.

    Science.gov (United States)

    Clancy, Marie; Styles, Mark J; Bettles, Colleen J; Birbilis, Nick; Chen, Miao; Zhang, Yansheng; Gu, Qinfen; Kimpton, Justin A; Webster, Nathan A S

    2015-03-01

    This paper describes the quantitative measurement, by in situ synchrotron X-ray diffraction (S-XRD) and subsequent Rietveld-based quantitative phase analysis and thickness calculations, of the evolution of the PbO2 and PbSO4 surface layers formed on a pure lead anode under simulated copper electrowinning conditions in a 1.6 M H2SO4 electrolyte at 318 K. This is the first report of a truly in situ S-XRD study of the surface layer evolution on a Pb substrate under cycles of galvanostatic and power interruption conditions, of key interest to the mining, solvent extraction and lead acid battery communities. The design of a novel reflection geometry electrochemical flow cell is also described. The in situ S-XRD results show that β-PbO2 forms immediately on the anode under galvanostatic conditions, and undergoes continued growth until power interruption where it transforms to PbSO4. The kinetics of the β-PbO2 to PbSO4 conversion decrease as the number of cycles increases, whilst the amount of residual PbO2 increases with the number of cycles due to incomplete conversion to PbSO4. Conversely, complete transformation of PbSO4 to β-PbO2 was observed in each cycle. The results of layer thickness calculations demonstrate a significant volume change upon PbSO4 to β-PbO2 transformation.

  6. Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria

    DEFF Research Database (Denmark)

    Elguindi, J; Moffitt, S; Hasman, Henrik

    2010-01-01

    The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by the influx of copper ions into the cells, but the exact mechanism is not fully understood. This study showed that the kinetics of contact killing of copper surfaces depended greatly on the amount...... of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper ion-resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing...... of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper...

  7. Electroless nickel alloy deposition on SiO2 for application as a diffusion barrier and seed layer in 3D copper interconnect technology.

    Science.gov (United States)

    Kim, Tae-Yoo; Son, Hwa-Jin; Lim, Seung-Kyu; Song, Young-Il; Park, Hwa-Sun; Suh, Su-Jeong

    2014-12-01

    Electroless Ni-P films were investigated with the aim of application as barrier and seed layers in 3D interconnect technology. Different shapes of blind-via holes were fabricated with a deep reactive ion etcher and SiO2 formed on these holes as an insulating layer. The surface of the substrate has been made hydrophilic by O2 plasma treatment with 100 W of power for 20 min. Electroless Ni-P films were deposited as both a diffusion barrier and a seed layer for Cu filling process. Prior to plating, substrates were activated in a palladium chloride solution after sensitization in a tin chloride solution with various conditions in order to deposit uniform films in TSV. After the formation of the electroless barrier layer, electro Cu was plated directly on the barrier layer. Ni-P films fabricated in blind-via holes were observed by scanning electron microscope. Energy dispersive spectroscopy line scanning was carried out for evaluating the diffusion barrier properties of the Ni-P films. The electroless Ni-P layer worked well as a Cu diffusion barrier until 300 degrees C. However, Cu ions diffused into barrier layer when the annealing temperature increases over 400 degrees C.

  8. Progress in Polyimide Films for Two-Layer Type Flexible Copper Clad Laminate%二层型挠性覆铜板用聚酰亚胺的研究进展

    Institute of Scientific and Technical Information of China (English)

    刁恩晓; 李帆; 舒适; 肖炳瑞; 黄永发; 王平; 刘峰

    2015-01-01

    The fast development of electronic industry puts forward higher requirements for the property of flexible copper clad laminate (FCCL). The research progress of two-layer type FCCL, which using polyimide film as substract, was reviewed from improving the adhesive property, dielectric property and heat resistance, and the research directions of two-layer type FCCL were proposed.%电子行业的快速发展对二层型挠性覆铜板的性能提出了更高的要求,针对以聚酰亚胺薄膜为基底材料的二层型挠性覆铜板,分别从改善粘结性能、介电性能和耐热性能3个方面综述了二层型挠性覆铜板的研究进展,并展望了二层型挠性覆铜板的研究方向。

  9. Biosorption of uranium and copper by Bacillus Sphaericus JG-A12 cells, spores and S-layer proteins embedded in sol-gel ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Raff, J.; Soltmann, U.; Boettcher, H. [Arbeitsgruppe Funktionelle Schichten, GMBU e.V., Dresden (Germany); Matys, S.; Pompe, W. [Inst. fuer Materialwissenschaft, Technische Univ. Dresden (Germany); Selenska-Pobell, S.

    2002-05-01

    Vegetative cells, spores and stabilized S-layer sheets of B. sphaericus JG-A12 were embedded in SiO{sub 2} bulk particles using sol-gel techniques. In sorption experiments the metal binding capacity of the free biocomponents and the corresponding biological ceramics were compared. (orig.)

  10. Effects of Rolling Reduction and Strength of Composed Layers on Bond Strength of Pure Copper and Aluminium Alloy Clad Sheets Fabricated by Cold Roll Bonding

    Directory of Open Access Journals (Sweden)

    Yoji Miyajima

    2014-01-01

    Full Text Available Three types of clad sheets, Cu/Al, Cu/AA5052, and Cu/AA5083, were produced by cold roll bonding with the rolling reduction of 50% and 75%. Tensile shear tests which give tensile shear strength were performed in order to assess the bond strength. Scanning electron microscopy was performed on the fractured interface produced by the tensile shear tests, which suggests that the fracture occurs within the Al alloy layer. The tensile shear strengths considering the area fraction of deposit of Al alloy on Cu side were compared with the shear stress converting from the ultimate tensile strengths. As a result, the tensile shear strength of the clad sheets is attributed to the shear strength of Al alloy layer close to the well bonded interface. A simple model was proposed that explains the effects of the rolling reduction and area fraction of deposit of Al alloy.

  11. Crystal structure and characterization of a novel layered copper-lithium phosphonate with antiferromagnetic intrachain Cu(II)···Cu(II) interactions

    Science.gov (United States)

    Abdelbaky, Mohammed S. M.; Amghouz, Zakariae; Blanco, David Martínez; García-Granda, Santiago; García, José R.

    2017-04-01

    Novel metal phosphonate [CuLi(PPA)] [H3PPA=3-phosphonopropionic acid] was synthesized hydrothermally and characterized by single-crystal X-ray diffraction, powder X-ray diffraction, scanning electron microscopy, infrared spectroscopy, and thermogravimetric analysis. It crystallizes in the space group C2/c, with cell parameters a=21.617(2) Å, b=4.9269(2) Å, c=14.342(1) Å, β=132.3(2)°, and Z=8. Its framework is built up from a main trimer, acting as a secondary building unit (SBU), which is formed by vertex-shared between two {LiO4} and one {Cu(1)O4} polyhedra. These units repeat along b-axis forming infinite inorganic chains, these chains are in turn cross-linked by corner sharing with {Cu(2)O4} polyhedra to produce inorganic layers lying in the bc-plane. The neighboring layers are connected through the PPA ligand, leading to a 3D pillared-layered structure. The topological analysis reveals that the compound exhibits 3,4,10-c net. Finally, magnetic susceptibility measurement of this compound over the temperature range of 2-300 K reveals the occurrence of weak antiferromagnetic intrachain interactions.

  12. 镁氯胶凝材料复合改性的研究%Research on the compound modification on magnesium oxychloride cement

    Institute of Scientific and Technical Information of China (English)

    王路明

    2012-01-01

    在对磷酸、粉煤灰分别改性研究的基础上,采取磷酸、粉煤灰及苯丙乳液对镁氯胶凝材料耐水性进行复合改性。研究结果表明,同时掺入20%粉煤灰、1%磷酸及5%苯丙乳液,可有效提高5.1.8主晶相在水中的稳定性,提高材料的密实度和抗水性能;水泥石的软化系数及早期强度均得到显著提高,分别达到0.90和48.6MPa;浸水28d抗压强度衰减较小,保持64.4MPa的高水平。综合改性效果显著。%On the basis of the research on the modification on magnesium oxychloride cement(MOC) with fly ash and phosphate,the phosphate,fly ash and styrene-acrylic emulsion were adopted to improve the water resistance of MOC.The results show that,while adding 20wt% fly ash,1wt% phosphate and 5wt% styrene acrylic emulsion to the cement,the stability of the main crystal phase 5·1·8 in water and the density and water resistance of the cement were improved effectively,and the softening coefficient and early strengh of the cement were greatly improved,respectively reaching 0.90 and 48.6MPa.After a 28d of water immersion test,the compressive strength lost a little,maintaining 64.4MPa.The comprehensive modification effect is remarkable.

  13. Carbon thin films deposited by the magnetron sputtering technique using cobalt, copper and nickel as buffer-layers; Filmes finos de carbono depositados por meio da tecnica de magnetron sputtering usando cobalto, cobre e niquel como buffer-layers

    Energy Technology Data Exchange (ETDEWEB)

    Costa e Silva, Danilo Lopes

    2015-11-01

    In this work, carbon thin films were produced by the magnetron sputtering technique using single crystal substrates of alumina c-plane (0001) and Si (111) and Si (100) substrates, employing Co, Ni and Cu as intermediate films (buffer-layers). The depositions were conducted in three stages, first with cobalt buffer-layers where only after the production of a large number of samples, the depositions using cooper buffer-layers were carried out on Si substrates. Then, depositions were performed with nickel buffer layers using single-crystal alumina substrates. The crystallinity of the carbon films was evaluated by using the technique of Raman spectroscopy and, then, by X-ray diffraction (XRD). The morphological characterization of the films was performed by scanning electron microscopy (SEM and FEG-SEM) and high-resolution transmission electron microscopy (HRTEM). The XRD peaks related to the carbon films were observed only in the results of the samples with cobalt and nickel buffer-layers. The Raman spectroscopy showed that the carbon films with the best degree of crystallinity were the ones produced with Si (111) substrates, for the Cu buffers, and sapphire substrates for the Ni and Co buffers, where the latter resulted in a sample with the best crystallinity of all the ones produced in this work. It was observed that the cobalt has low recovering over the alumina substrates when compared to the nickel. Sorption tests of Ce ions by the carbon films were conducted in two samples and it was observed that the sorption did not occur probably because of the low crystallinity of the carbon films in both samples. (author)

  14. Effects of Rolling Reduction and Strength of Composed Layers on Bond Strength of Pure Copper and Aluminium Alloy Clad Sheets Fabricated by Cold Roll Bonding

    OpenAIRE

    Yoji Miyajima; Kotaro Iguchi; Susumu Onaka; Masaharu Kato

    2014-01-01

    Three types of clad sheets, Cu/Al, Cu/AA5052, and Cu/AA5083, were produced by cold roll bonding with the rolling reduction of 50% and 75%. Tensile shear tests which give tensile shear strength were performed in order to assess the bond strength. Scanning electron microscopy was performed on the fractured interface produced by the tensile shear tests, which suggests that the fracture occurs within the Al alloy layer. The tensile shear strengths considering the area fraction of deposit of Al al...

  15. Copper-vapor-assisted chemical vapor deposition for high-quality and metal-free single-layer graphene on amorphous SiO2 substrate.

    Science.gov (United States)

    Kim, Hyungki; Song, Intek; Park, Chibeom; Son, Minhyeok; Hong, Misun; Kim, Youngwook; Kim, Jun Sung; Shin, Hyun-Joon; Baik, Jaeyoon; Choi, Hee Cheul

    2013-08-27

    We report that high-quality single-layer graphene (SLG) has been successfully synthesized directly on various dielectric substrates including amorphous SiO2/Si by a Cu-vapor-assisted chemical vapor deposition (CVD) process. The Cu vapors produced by the sublimation of Cu foil that is suspended above target substrates without physical contact catalyze the pyrolysis of methane gas and assist nucleation of graphene on the substrates. Raman spectra and mapping images reveal that the graphene formed on a SiO2/Si substrate is almost defect-free and homogeneous single layer. The overall quality of graphene grown by Cu-vapor-assisted CVD is comparable to that of the graphene grown by regular metal-catalyzed CVD on a Cu foil. While Cu vapor induces the nucleation and growth of SLG on an amorphous substrate, the resulting SLG is confirmed to be Cu-free by synchrotron X-ray photoelectron spectroscopy. The SLG grown by Cu-vapor-assisted CVD is fabricated into field effect transistor devices without transfer steps that are generally required when SLG is grown by regular CVD process on metal catalyst substrates. This method has overcome two important hurdles previously present when the catalyst-free CVD process is used for the growth of SLG on fused quartz and hexagonal boron nitride substrates, that is, high degree of structural defects and limited size of resulting graphene, respectively.

  16. Tarnished copper IUDs still safe and effective.

    Science.gov (United States)

    1989-01-01

    Due to the presence of tarnish on copper T 380A (TCU 380A) intrauterine devices (IUDs) still in their wrappers, family planning providers in developing countries were concerned over their safety and effectiveness. This article explains why there is tarnish on the copper IUDs and why these IUDs are still sterile as long as their packaging is intact. The Population Council and Finishing Enterprises, the developer and the manufacturer of the devise respectively, along with several chemists, have determined that the tarnishing in no way reflects the sterility of the IUD. The IUD packages are permeable to gases but impermeable to microorganisms so that packages of IUDs can be sterilized with ethylene oxide and then stay sterile because no microorganisms can get to the IUD. Tarnishing is caused by the normal oxidation of copper which gives a surface layer of copper oxide. Normally, this surface layer is too thin to be visible, but 10% of the time a thicker layer of copper oxide or what is called "tarnishing" develops on copper IUDs. Copper IUDs have the same efficiency whether or not they are tarnished. Finishing Enterprises is now conducting research on how to slow down the oxidation process.

  17. Aspects of the SrO-CuO-TiO2 Ternary System Related to the Deposition of SrTiO3 and Copper-Doped SrTiO3 Thin-Film Buffer Layers

    Energy Technology Data Exchange (ETDEWEB)

    A. Ayala

    2004-12-20

    YBa{sub 2}Cu{sub 3}O{sub 7-{delta}} (YBCO) coated conductors are promising materials for large-scale superconductivity applications. One version of a YBCO coated conductor is based on ion beam assisted deposition (IBAD) of magnesium oxide (MgO) onto polycrystalline metal substrates. SrTiO{sub 3} (STO) is often deposited by physical vapor deposition (PVD) methods as a buffer layer between the YBCO and IBAD MgO due to its chemical stability and lattice mismatch of only {approx}1.5% with YBCO. In this work, some aspects of the stability of STO with respect to copper (Cu) and chemical solution deposition of STO on IBAD MgO templates were examined. Solubility limits of Cu in STO were established by processing Cu-doped STO powders by conventional bulk preparation techniques. The maximum solubility of Cu in STO was {approx}1% as determined by transmission electron microscopy (TEM) and Rietveld refinements of x-ray diffraction (XRD) data. XRD analysis, performed in collaboration with NIST, on powder compositions on the STO/SrCuO{sub 2} tie line did not identify any ternary phases. SrCu{sub 0.10}Ti{sub 0.90}O{sub y} buffer layers were prepared by pulsed laser deposition (PLD) and CSD on IBAD MgO flexible metallic textured tapes. TEM analysis of a {approx}100 nm thick SrCu{sub 0.10}Ti{sub 0.90}O{sub y} buffer layer deposited by PLD showed a smooth Cu-doped STO/MgO interface. A {approx}600 nm thick YBCO film, deposited onto the SrCu{sub 0.10}Ti{sub 0.90}O{sub y} buffer by PLD, exhibited a T{sub c} of 87 K and critical current density (J{sub c}) of {approx}1 MA/cm{sup 2}. STO and Cu-doped STO thin films by CSD were {approx}30 nm thick. The in plane alignment (FWHM) after deposition of the STO improved by {approx}1{sup o} while it degraded by {approx}2{sup o} with the SrCu{sub 0.05}TiO{sub y} buffer. YBCO was deposited by PLD on the STO and SrCu{sub 0.05}TiO{sub y} buffers. The in plane alignment (FWHM) of the YBCO with the STO buffer layer slightly improved while that of the

  18. CIGS薄膜太阳能电池无镉缓冲层制备方法的研究现状%Deposition Technologies of Cd-Free Buffer Layers in Solar Cells Made of Copper Indium Gallium Diselenide Films

    Institute of Scientific and Technical Information of China (English)

    霍晓旭; 莫晓亮; 陈国荣

    2012-01-01

    The latest progress in the development of deposition technology of the Cd-free buffer layers in the solar cells made of copper indium gallium diselenide(CIGS) films was tentatively reviewed.The discussions focused on three topics: first, the film growth techniques and related properties of the three alternative Cd-free buffer layer materials (In2S3,ZnS,and Zn1-xMgxO) ; next,the possible impacts of the three alternative films and their deposition techniques on the fabrication and performance of the solar cells; finally, the development trends of the Cd-free layers in fabricating the CIGS solar cells.The strengths and weaknesses of the techniques, including the chemical bath deposition(CBD) , atomic layer deposition (AID) and sputtering depositions, on industrial scale production were evaluated in a thought-provoking way. We suggest that the sputtering deposition be most feasible to large scale industrial production. The technical problems to be solved were also discussed.%回顾了近年来CIGS薄膜太阳能电池无镉缓冲层的研究进展;着重介绍了In2S3,ZnS,Zn1-xMgxO三种可替代CdS缓冲层材料的常用制备方法及相关特性,并且对应给出了每种材料和方法获得的电池组件效率.展望了无镉缓冲层的发展前景,分析了化学水浴、原子层沉积、溅射三种缓冲层沉积技术各自在大规模工业化应用中的优劣势.认为溅射沉积技术是现阶段最理想的工业化制备技术,同时指出了无镉缓冲层在大规模工业化应用中亟需解决的问题.

  19. Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    Science.gov (United States)

    Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan; Sowade, Enrico; Baumann, Reinhard R.; Feng, Zhe-Sheng

    2017-02-01

    A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

  20. 原子层沉积氧化锌应用于铜铟镓硒太阳能电池缓冲层的研究%Study on Application of Atomic Layer Depositing Zinc Oxide for Buffer Layer to Copper Indium Gallium Selenium Solar Battery

    Institute of Scientific and Technical Information of China (English)

    廖荣; 张海燕; 谢佳亮; 杨铁铮; 罗文中; 胡伟

    2013-01-01

    A zinc oxide thin-film was deposited on soda lime glass with the method of atomic layer deposition (ALD),and field emission scanning electron microscope and X-ray diffractometer were employed to analyze the surface appearance and phase of the sample.The results show that the nanoparticle of ZnO is hexangular wurtzite structure and the size of particle is 30-60 nm.The measured thickness of ZnO thin-film is only 50 nm,which can meet the requirement of buffer layer.Transmittance of the thin-film in visible light area is more than 90%.Using atomic layer deposited zinc oxide thin-film as buffer layer of copper indium gallium selenium (CIGS) solar battery,it can be found that the zinc oxide layer covers the CIGS layer tightly,and that the photoelectric conversion efficiency of battery is high,so it can fully replace the toxic CdS as buffer layer.%用原子层沉积法在钠钙玻璃上沉积氧化锌薄膜,利用场发射扫描电镜和X射线衍射(XRD)等对样品表面形貌和物相进行分析,结果表明得到的ZnO纳米颗粒为六角纤锌矿结构,颗粒的尺寸在30~60 nm之间;测得的ZnO薄膜厚度仅50 nm,符合缓冲层要求;薄膜在可见光区域透射率达90%以上;使用原子层沉积氧化锌薄膜作铜铟镓硒太阳能电池的缓冲层,TEM显示氧化锌层完好、致密地覆盖在CIGS层上,电池的光电转换效率较高,完全可以替代有毒的CdS作缓冲层.

  1. A new potential NLO compound with a supramolecular layered structure: aqua(hexamethylenetetramine-κN)(iminodiacetato-κ3O,N,O')copper(II).

    Science.gov (United States)

    He, Jiao-Jiao; Chai, Wen-Xiang; Song, Li; Niu, Feng; Fang, Xiao-Bin

    2012-08-01

    In the noncentrosymmetric title compound, [Cu(C(4)H(5)NO(4))(C(6)H(12)N(4))(H(2)O)] or [Cu(IDA)(HMTA)(H(2)O)], where IDA is iminodiacetate and HMTA is hexamethylenetetramine, the asymmetric unit consists of a whole mononuclear neutral molecule, where the Cu(II) cation is coordinated by two carboxylate O atoms and one N atom from the IDA ligand, by one N atom from the HMTA ligand and by the O atom of the coordinated water molecule, giving rise to a CuN(2)O(3) distorted square-pyramidal coordination geometry. The IDA and HTMA ligands adopt terminal tri- and monocoordinated modes, respectively. All adjacent molecules within the ac plane are connected to each other via two pairs of O-H···O and one N-H...O hydrogen bond, forming a (4,4) supramolecular two-dimensional network. In the unit cell, these layers stack alternately in an …ABABAB… sequence along the b axis. The optical absorption properties of this compound have been studied on powder samples, which had previously been examined by powder X-ray diffraction.

  2. 氯氧镁水泥耐水性能改善研究%Research on improving the water resistance of magnesium oxychloride cement

    Institute of Scientific and Technical Information of China (English)

    冯扣宝; 王路明; 陈雪霏

    2015-01-01

    On the basis of the research on the modification on magnesium oxychloride cement (MOC) with phos‐phoric acid ,fly ash and calcium stearate respectively ,then phosphoric acid ,fly ash and calcium stearate or phosphoric acid ,fly ash and styrene‐acrylic emulsion were adopted to improve the water resistance of MOC . The results show that ,while adding 1wt% phosphoric acid ,20wt% fly ash and 1wt% calcium stearate or 1wt% styrene‐acrylic emulsion to the cement ,the stability of 5 ・1・8 main phase in water ,the density and water resistance of the cement were improved effectively ,among them ,phosphoric acid ,fly ash and styrene‐acrylic emulsion as compound modifiers are the best .Compressive strength of optimal modified specimen cured 3 and 7 d could reach 63 4. ,75 1. MPa respectively .softening coefficient were up to 0 9. ,when soaked in water 7 d ,compressive strength still can maintain 68 1. MPa ,improving 60 2.% compared with the blank .Compound modification effect is remarkable .%在磷酸、粉煤灰、硬脂酸钙单一改性研究的基础上,采取磷酸、粉煤灰、硬脂酸钙和磷酸、粉煤灰、苯丙乳液两种复合体系分别对氯氧镁水泥进行复合改性。结果表明,同时掺入1%磷酸、20%粉煤灰和1%硬脂钙或1%苯丙乳液均可有效提高5・1・8主晶相在水中的稳定性,提高材料的密实度和耐水性能,其中以磷酸、粉煤灰及苯丙乳液三者复合改性效果最佳;最优改性试样的3及7d强度分别高达634.,751.MPa,软化系数高达0.9,浸水7 d,泡水强度保持在681. M Pa ,较空白样提升了60.2%,复合改性效果显著。

  3. Two novel Krebs-type polyoxoanions [Cu I2(WO 2) 2(β-XW 9O 33) 2] 12- (X = Sb III, Bi III) resulting in 2D layer structures linked by copper(I) ions and copper(II) complex groups

    Science.gov (United States)

    Zhang, Wei; Liu, Shuxia; Feng, Dan; Zhang, Chundan; Sun, Ping; Ma, Fengji

    2009-11-01

    Two sandwich-type organic-inorganic hybrid polyoxotungstates [enH 2] 5[Cu II(en) 2][Cu I2(WO 2) 2(β-SbW 9O 33) 2]·16H 2O ( 1) and [enH 2] 5[Cu II(en) 2][Cu I2(WO 2) 2(β-BiW 9O 33) 2]·22H 2O ( 2) (en = ethylenediamine) have been synthesized hydrothermally and structurally characterized by elemental analyses, IR spectra, thermal stability analyses, X-ray powder diffraction, and single-crystal X-ray diffraction. The polyoxoanions in 1 and 2 are composed of two trivacant (B-β-XW 9O 33) 9- (X = Sb III ( 1), Bi III ( 2)) subunits joined together by two Cu(I) ions and two W(VI) ions resulting in two novel Krebs-type sandwich structures. These polyoxoanions are further connected by Cu(I) ions and [Cu II(en) 2] 2+ coordination cations, and afford the first copper(I)-linked 2D layer structure constructed from Krebs-type polyoxotungstates. Additionally, the electrochemical behavior and electrocatalysis of 1 and 2 modified carbon paste electrodes (CPEs) have been studied. The results indicate that they have good electrocatalytic activities toward the reduction of nitrite.

  4. Aluminium or copper substrate panel for selective absorption of solar energy

    Science.gov (United States)

    Roberts, M. L.; Sharpe, M. H.; Krupnick, A. C. (Inventor)

    1979-01-01

    A method for making panels which selectively absorb solar energy is disclosed. The panels are comprised of an aluminum substrate, a layer of zinc thereon, a layer of nickel over the zinc layer and an outer layer of solar energy absorbing nickel oxide or a copper substrate with a layer of nickel thereon and a layer of solar energy absorbing nickel oxide distal from the copper substrate.

  5. Fully additive copper metallization on BCB

    Energy Technology Data Exchange (ETDEWEB)

    Stolle, T. [FhG-IZM Berlin (Germany); Schwencke, B.; Reichl, H.

    2000-07-01

    A fully additive copper metallization process on benzocyclobutene cyclotene trademark (BCB) has been investigated for application in MCM-D technology. The process consists of surface pretreatment of the BCB basic layer by reactive ion etching (RIE), spin-coating and photopatterning of an organic seed layer by broad-band I-line photolithography followed by developing and activation steps. The metallization of the seed patterns is performed by a 2-step process by means of electroless copper baths. A height of about 5 {mu}m selectively deposited copper can be achieved. The electrical conductivity of patterns is in the range of 80% - 85% of the bulk conductivity of pure copper. Adhesive strength tests during accelerated aging show good adhesion of copper to the BCB surface, which is influenced by RIE pretreatment, exposure dose and thermal load. Shear experiments performed with optimal treated 200 x 200 {mu}m bumps show shear forces > 150 cN. Design rules have to take into account the lateral growth of copper patterns, which is nearly equal to the vertical growth. Real spaces of {>=} 30 {mu}m between copper lines are possible. The process is considered as a low cost technology because of replacing of sputter technique, few process steps and waste reduction. (orig.)

  6. Graphene-protected copper and silver plasmonics

    DEFF Research Database (Denmark)

    Kravets, V. G.; Jalil, R.; Kim, Y. J.

    2014-01-01

    suitable for plasmonic applications. To this end, there has been a continuous search for alternative plasmonic materials that are also compatible with complementary metal oxide semiconductor technology. Here we show that copper and silver protected by graphene are viable candidates. Copper films covered...... with one to a few graphene layers show excellent plasmonic characteristics. They can be used to fabricate plasmonic devices and survive for at least a year, even in wet and corroding conditions. As a proof of concept, we use the graphene-protected copper to demonstrate dielectric loaded plasmonic...... waveguides and test sensitivity of surface plasmon resonances. Our results are likely to initiate wide use of graphene-protected plasmonics....

  7. Surface films and corrosion of copper

    Energy Technology Data Exchange (ETDEWEB)

    Hilden, J.; Laitinen, T.; Maekelae, K.; Saario, T.; Bojinov, M. [VTT Manufacturing Technology, Espoo (Finland)

    1999-03-01

    In Sweden and Finland the spent nuclear fuel is planned to be encapsulated in cast iron canisters that have an outer shield made of copper. The copper shield is responsible for the corrosion protection of the canister construction. General corrosion of the copper is not expected to be the limiting factor in the waste repository environment when estimating the life-time of the canister construction. However, different forms of localised corrosion, i.e. pitting, stress corrosion cracking, or environmentally assisted creep fracture may cause premature failure of the copper shield. Of the probable constituents in the groundwater, nitrites, chlorides, sulphides and carbonates have been suggested to promote localised corrosion of copper. The main assumption made in planning this research program is that the surface films forming on copper in the repository environment largely determine the susceptibility of copper to the different forms of localised corrosion. The availability of reactants, which also may become corrosion rate limiting, is investigated in several other research programs. This research program consists of a set of successive projects targeted at characterising the properties of surface films on copper in repository environment containing different detrimental anions. A further aim was to assess the significance of the anion-induced changes in the stability of the oxide films with regard to localised corrosion of copper. This report summarises the results from a series of investigations on properties of surface films forming on copper in water of pH = 8.9 at temperature of 80 deg C and pressure of 2 MPa. The main results gained so far in this research program are as follows: The surface films forming on copper in the thermodynamic stability region of monovalent copper at 80 deg C consist of a bulk part (about 1 mm thick) which is a good ionic and electronic conductor, and an outer, interfacial layer (0.001 - 0.005 mm thick) which shows p-type semiconductor

  8. Copper allergy from dental copper amalgam?

    Science.gov (United States)

    Gerhardsson, Lars; Björkner, Bert; Karlsteen, Magnus; Schütz, Andrejs

    2002-05-06

    A 65-year-old female was investigated due to a gradually increasing greenish colour change of her plastic dental splint, which she used to prevent teeth grinding when sleeping. Furthermore, she had noted a greenish/bluish colour change on the back of her black gloves, which she used to wipe her tears away while walking outdoors. The investigation revealed that the patient had a contact allergy to copper, which is very rare. She had, however, had no occupational exposure to copper. The contact allergy may be caused by long-term exposure of the oral mucosa to copper from copper-rich amalgam fillings, which were frequently used in childhood dentistry up to the 1960s in Sweden. The deposition of a copper-containing coating on the dental splint may be caused by a raised copper intake from drinking water, increasing the copper excretion in saliva, in combination with release of copper due to electrochemical corrosion of dental amalgam. The greenish colour change of the surface of the splint is probably caused by deposition of a mixture of copper compounds, e.g. copper carbonates. Analysis by the X-ray diffraction technique indicates that the dominant component is copper oxide (Cu2O and CuO). The corresponding greenish/bluish discoloration observed on the back of the patient's gloves may be caused by increased copper excretion in tears.

  9. Copper Products Capacity Expansion Stimulate the Copper Consumption

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    <正>The dramatic growth of copper consumption in China can directly be seen from the expansion of copper products capacity.According to sta- tistics,in the past 4 years,the improvement on the balance of trade on copper bar,copper,and copper alloy and copper wire & cable has driven the growth of copper consumption a lot.

  10. Thickness Effect of Micro Speaker Copper Coil Fabrication Process

    Directory of Open Access Journals (Sweden)

    F. L. AYAT

    2011-07-01

    Full Text Available This paper present the advantage of using electroplating for making the thick layer of copper over the sputtering. The purpose of this paper is to fabricate the copper coil for microspeaker. The design and simulation of this copper coil shows that the 15 um thickness is needed. In order to fabricate this coil, copper plating is used. The electro-deposition process is well suited to make films of metals such as copper, gold and nickel. The films can be made in any thickness from ~1 µm to >100 µm. The deposition is best controlled when used with an external electrical potentiostate. However, it requires electrical contact to the substrate when immersed in the liquid bath. In any process, the surface of the substrate must have an electrically conducting coating before the deposition can be done. The result of this experimental research shows the easy and cheap way to fabricate the thick layer of copper for microspeacker fabrication.

  11. Antwerp Copper Plates

    DEFF Research Database (Denmark)

    Wadum, Jørgen

    1999-01-01

    In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes.......In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes....

  12. Adsorption of 2-mercaptobenzothiazole on copper surface from phosphate solutions

    Science.gov (United States)

    Kazansky, L. P.; Selyaninov, I. A.; Kuznetsov, Yu. I.

    2012-07-01

    Analysis of the electrochemical and XPS results has shown that adsorption of 2-mercaptobenzothiazole (MBT) on copper electrodes in neutral phosphate solutions proceeds through the formation of the chemical bonds by copper (I) cations with exo-sulfur and nitrogen atoms. A protection layer formed of Cu(I)MBT complex prevents precipitation of copper (II) phosphate on a copper surface. The thickness of the surface film consisting of a complex [Cu(I)MBT]n (having probably polymeric nature), where MBT acts as at least three-dentate ligand, increases depending on the exposure time, reaching 8-9 nm after immersing for 12 h in test solution. Even in a case of the preliminary formation of copper (II) phosphate on the copper electrode at the anodic potential addition of small amounts of MBT results in complete removal of copper (II) phosphate from the surface.

  13. Copper and copper proteins in Parkinson's disease.

    Science.gov (United States)

    Montes, Sergio; Rivera-Mancia, Susana; Diaz-Ruiz, Araceli; Tristan-Lopez, Luis; Rios, Camilo

    2014-01-01

    Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson's disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson's disease and that a mutation in ATP7B could be associated with Parkinson's disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology.

  14. Electrochemical and Spectroscopic Study of Benzotriazole Films Formed on Copper, Copper-zinc Alloys and Zinc in Chloride Solution

    OpenAIRE

    Milošev, I.; Kosec, T.

    2009-01-01

    The formation of protective layers on copper, zinc and copper-zinc (Cu-10Zn and Cu-40Zn) alloys at open circuit potential in aerated, near neutral 0.5 M NaCl solution containing benzotriazole (BTA) was studied using potentiodynamic measurements, electrochemical impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS). The addition of benzotriazole affects the dissolution of the materials investigated. Benzotriazole, generally known as an inhibitor of copper corrosion, is als...

  15. Adsorption of copper to different biogenic oyster shell structures

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Qiong; Chen, Jie [College of Materials Science and Engineering, Fuzhou University, New Campus, Minhou, Fujian Province 350108 (China); Clark, Malcolm [Marine Ecology Research Centre, School of Environment, Science and Engineering, Southern Cross University, P.O. Box 157, Lismore, NSW 2480 (Australia); Yu, Yan, E-mail: yuyan_1972@126.com [College of Materials Science and Engineering, Fuzhou University, New Campus, Minhou, Fujian Province 350108 (China)

    2014-08-30

    Graphical abstract: - Highlights: • Adsorption of copper to waste oyster shell occurs rapidly at pH 5.5. • Copper adsorbs to the different structures of oyster shell at different rates. • The prismatic layer dominates copper sorption rather than the nacreous layer. • SEM analysis shows a porous open network structure to the prismatic layer. • Surface ζ-potentials establish electrostatic attraction to drive copper sorption. - Abstract: The removal of copper from solution by oyster shell powder was investigated for potential wastewater treatment uses. In particular, adsorption behavior differences between the prismatic (PP) and nacreous (NP) shell layers, and how this affects copper removal, were investigated. Experimental results indicated that copper adsorption was highly pH-dependent with optimal copper removal at pH 5.5, where the powdered whole raw shell (RP) removed up to 99.9% of the copper within 24 h at a 10 mg/L initial copper concentration. Langmuir and Freundlich models were used to analyze the isotherm PP, NP and RP data. These results showed a strong homogeneous Langmuir model for low initial copper concentrations (5–30 mg/L) to both RP and PP layer, while strong agreement with a heterogeneous Freundlich model for high initial copper concentrations (30–200 mg/L); nevertheless, a homogeneous Langmuir model provided the best fit for the more dense NP layer across the initial concentration range (5–200 mg/L). The distribution coefficient (K{sub d}) value of PP layer for each initial concentration investigated was substantially higher than the NP layer and it was also found that the PP layer dominated the adsorption process with an adsorption capacity of 8.9 mg/g, while the adsorption capacity of the NP layer was 2.6 mg/g. These differences are believed to be because of the more porous structure of the PP layer, which was confirmed by scanning electron microscopy, infrared spectroscopy, energy-dispersive X-ray spectroscopy, and

  16. Material characterization of ancient Indian copper

    Indian Academy of Sciences (India)

    A Srivastava; R Balasubramaniam

    2003-10-01

    A chalcolithic (2350–1800 BC) copper chisel from Balathal has been characterized by X-ray diffraction, microstructural and electrochemical methods. The surface patina was composed of sulfates and oxysulfates in the outer layers while the inner layers were rich in copper oxides. The chisel exhibited smaller grain sizes near two of the surfaces while the structure in the interior was equiaxed. The deformed grains and inclusions near the surfaces and variation in the microhardness of the sample from different faces proved that the copper chisel was processed by cold deformation after initial casting of the square cross-section chisel. The electrochemical behaviour of chalcolithic Cu has been compared with that of a modern Cu sample by potentiodynamic polarization studies. The corrosion rate of chalcolithic Cu in aerated 3.5% NaCl solution was only marginally higher than that of modern Cu. The higher rate of corrosion has been attributed to the presence of second phase sulfide inclusions. The excellent condition of preservation of the 3800-year-old copper object, with no indications of stress corrosion cracking, suggests that pure copper or copper-based materials can be seriously considered as candidate canister materials for long-term underground storage of nuclear wastes in underground repositories.

  17. Crystallization of copper metaphosphate glass

    Science.gov (United States)

    Bae, Byeong-Soo; Weinberg, Michael C.

    1993-01-01

    The effect of the valence state of copper in copper metaphosphate glass on the crystallization behavior and glass transition temperature has been investigated. The crystallization of copper metaphosphate is initiated from the surface and its main crystalline phase is copper metaphosphate (Cu(PO)3),independent of the (Cu sup 2+)/(Cu(total)). However, the crystal morphology, the relative crystallization rates, and their temperature dependences are affected by the (Cu sup 2+)/(Cu (total)) ratio in the glass. On the other hand, the totally oxidized glass crystallizes from all over the surface. The relative crystallization rate of the reduced glass to the totally oxidized glass is large at low temperature, but small at high temperature. The glass transition temperature of the glass increases as the (Cu sup 2+)/(Cu(total)) ratio is raised. It is also found that the atmosphere used during heat treatment does not influence the crystallization of the reduced glass, except for the formation of a very thin CuO surface layer when heated in air.

  18. Role of copper oxides in contact killing of bacteria.

    Science.gov (United States)

    Hans, Michael; Erbe, Andreas; Mathews, Salima; Chen, Ying; Solioz, Marc; Mücklich, Frank

    2013-12-31

    The potential of metallic copper as an intrinsically antibacterial material is gaining increasing attention in the face of growing antibiotics resistance of bacteria. However, the mechanism of the so-called "contact killing" of bacteria by copper surfaces is poorly understood and requires further investigation. In particular, the influences of bacteria-metal interaction, media composition, and copper surface chemistry on contact killing are not fully understood. In this study, copper oxide formation on copper during standard antimicrobial testing was measured in situ by spectroscopic ellipsometry. In parallel, contact killing under these conditions was assessed with bacteria in phosphate buffered saline (PBS) or Tris-Cl. For comparison, defined Cu2O and CuO layers were thermally generated and characterized by grazing incidence X-ray diffraction. The antibacterial properties of these copper oxides were tested under the conditions used above. Finally, copper ion release was recorded for both buffer systems by inductively coupled plasma atomic absorption spectroscopy, and exposed copper samples were analyzed for topographical surface alterations. It was found that there was a fairly even growth of CuO under wet plating conditions, reaching 4-10 nm in 300 min, but no measurable Cu2O was formed during this time. CuO was found to significantly inhibit contact killing, compared to pure copper. In contrast, thermally generated Cu2O was essentially as effective in contact killing as pure copper. Copper ion release from the different surfaces roughly correlated with their antibacterial efficacy and was highest for pure copper, followed by Cu2O and CuO. Tris-Cl induced a 10-50-fold faster copper ion release compared to PBS. Since the Cu2O that primarily forms on copper under ambient conditions is as active in contact killing as pure copper, antimicrobial objects will retain their antimicrobial properties even after oxide formation.

  19. Removal of copper from a copper sulphate solution using an ultrasonic-electrolysis process

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    The application of ultrasonic-electrolysis process for the removal of copper is studied.In the ultrasonic field cavitation acts as jets and agitates the solution and breaks the barrier layer between the cathode surface and the bulk of the solution.Thus increases metal deposition on the cathode surface.The results show that an ultrasonic field is successful for the removal of low copper concentrations in solution.

  20. Removal of copper from a copper sulphate solution using an ultrasonic-electrolysis process.

    Science.gov (United States)

    Farooq, Robina; Wang, Y; Shaukat, S F; Donaldson, J; Chaudhary, A J

    2002-07-01

    The application of ultrasonic-electrolysis process for the removal of copper is studied. In the ultrasonic field cavitation acts as jets and agitates the solution and breaks the barrier layer between the cathode surface and the bulk of the solution. Thus increases metal deposition on the cathode surface. The results show that an ultrasonic field is successful for the removal of low copper concentrations in solution.

  1. Effect of ultrasound on the removal of copper from the model solutions for copper electrolysis process.

    Science.gov (United States)

    Farooq, Robina; Wang, Y; Lin, F; Shaukat, S F; Donaldson, J; Chouhdary, A J

    2002-07-01

    A novel combination of an ultrasonic field with electrolysis for the removal of copper is studied. In the ultrasonic field, cavitation acts as jets and agitates the solution and breaks the barrier layer between the cathode surface and the bulk of the solution, thus increases the metal deposition on the cathode surface. The results show that an ultrasonic field is successful for the removal of low copper concentrations in solution.

  2. Studies on Cementation of Tin on Copper and Tin Stripping from Copper Substrate

    Directory of Open Access Journals (Sweden)

    Rudnik E.

    2016-06-01

    Full Text Available Cementation of tin on copper in acid chloride-thiourea solutions leads to the formation of porous layers with a thickness dependent on the immersion time. The process occurs via Sn(II-Cu(I mechanism. Chemical stripping of tin was carried out in alkaline and acid solutions in the presence of oxidizing agents. It resulted in the dissolution of metallic tin, but refractory Cu3Sn phase remained on the copper surface. Electrochemical tin stripping allows complete tin removal from the copper substrate, but porosity and complex phase composition of the tin coating do not allow monitoring the process in unambiguous way.

  3. 层间水分子含量对铜铁水滑石超分子作用力的影响%Influence of Interlayer Water Content on Supermolecular Interaction of Copper-Iron Layered Double Hydroxides

    Institute of Scientific and Technical Information of China (English)

    施炜; 胡军; 倪哲明; 李远; 刘娇

    2012-01-01

    A periodic interaction model was proposed for the copper-iron layered double hydroxides, CusFe-LDHs-yHzO (y=0-2). Based on density functional theory, the geometry of Cu3Fe-LDHs-yH2O was optimized using the CASTEP program. The distribution of NOi and H3O in the interlayer and the supermolecular interaction between host and guest was investigated by analyzing the geometric parameters, hydrogen-bonding, charge populations and stepwise hydration energy. Results indicated that when NO3 and H;O were inserted into the layers of the Cu3Fe-LDHs, there was a strong supramolecular interaction between the host layer and the guest, including hydrogen-bonding and electrostatic interaction. Hydrogen-bonding was superior to the electrostatic interaction in the hydration process. The strength of hydrogen bonding was ordered as Layer-Anion (L-A) > Anion-Water (A-W) > Layer-Water (L-W) > Water -Water (W-W). In Cu3Fe-LDHs-yH;O, the interlayer distance decreased slightly and then increased significantly with an increase in the number of interlayer water molecules. The Cu - O octahedral forms were stretched gradually because of the increased Jahn - Teller effect of Cu2'. The absolute value of the hydration energy decreased gradually with an increase in the number of water molecules. This suggested that the hydration of CujFe-LDHs reached a saturation state. The geometry of Cu3Fe-LDHs-1H2O is close to hexagonal where the metal distortion of the layer is weakest and the stability is strongest; the interlayer distance agrees the experimental value, therefore CujFe-LDHs-IH2O is a stable configuration.%构建铜铁水滑石[Cu3Fe-LDHs-yH2O(y=0-2)]周期性计算模型,采用密度泛函理论(DFT),选取CASTEP程序模块,对体系进行几何全优化.从结构参数、氢键、Mulliken电荷布居、逐级水合能等角度研究了层间NO3-和H2O的分布形态及其与水滑石(LDHs)层板的超分子作用,探究了水分子数目对体系姜-泰勒效应的影响.结果表明:Cu3Fe

  4. Influence of glyphosate on the copper dissolution in phosphate buffer

    Science.gov (United States)

    Coutinho, C. F. B.; Silva, M. O.; Machado, S. A. S.; Mazo, L. H.

    2007-01-01

    The electrochemical behavior of copper microelectrode in phosphate buffer in the presence of glyphosate was investigated by electrochemical techniques. It was observed that the additions of glyphosate in the phosphate buffer increased the anodic current of copper microelectrode and the electrochemical dissolution was observed. This phenomenon could be associated with the Cu(II) complexation by glyphosate forming a soluble complex. Physical characterization of the surface showed that, in absence of glyphosate, an insoluble layer covered the copper surface; on the other hand, in presence of glyphosate, it was observed a corroded copper surface with the formation of glyphosate complex in solution.

  5. Temperature and Copper Concentration Effects on the Formation of Graphene-Encapsulated Copper Nanoparticles from Kraft Lignin

    Directory of Open Access Journals (Sweden)

    Weiqi Leng

    2017-06-01

    Full Text Available The effects of temperature and copper catalyst concentration on the formation of graphene-encapsulated copper nanoparticles (GECNs were investigated by means of X-ray diffraction, Fourier transform infrared spectroscopy-attenuated total reflectance, and transmission electron microscopy. Results showed that higher amounts of copper atoms facilitated the growth of more graphene islands and formed smaller size GECNs. A copper catalyst facilitated the decomposition of lignin at the lowest temperature studied (600 °C. Increasing the temperature up to 1000 °C retarded the degradation process, while assisting the reconfiguration of the defective sites of the graphene layers, thus producing higher-quality GECNs.

  6. Thermoelectric Study of Copper Selenide

    Science.gov (United States)

    Yao, Mengliang; Liu, Weishu; Ren, Zhifeng; Opeil, Cyril

    2014-03-01

    Nanostructuring has been shown to be an effective approach in reducing lattice thermal conductivity and improving the figure of merit of thermoelectric materials. Copper selenide is a layered structure material, which has a low thermal conductivity and p-type Seebeck coefficient at low temperatures. We have evaluated several hot-pressed, nanostructured copper selenide samples with different dopants for their thermoelectric properties. The phenomenon of the charge-density wave observed in the nanocomposite, resistivity, Seebeck, thermal conductivity and carrier mobility will be discussed. Funding for this research was provided by the Solid State Solar - Thermal Energy Conversion Center (S3TEC), an Energy Frontier Research Center sponsored by the DOE, Office of Basic Energy Science, Award No. DE-SC0001299/ DE-FG02-09ER46577.

  7. Electrochemical nucleation and growth of copper and copper alloys

    Science.gov (United States)

    Shao, Wenbo

    This dissertation aims to contribute to a fundamental understanding of the physicochemical processes occurring in electrochemical nucleation and growth. To this end, the effects of various anions (chloride (Cl-), sulfate (SO42-) and sulfamate (NH2SO 3-)) on the electrochemical kinetics and the mechanism of copper reduction, as well as on the microstructure of the resulting films, were studied. On the basis of this work, the deposition of copper alloys (Cu-Ag with positive heat of mixing, Cu-Au with negative heat of mixing) was investigated with the main objective to achieve an insight on the role of solid state thermodynamics on the electrocrystallization process. Chloride ions cause two competing effects: at low chloride concentration the formation of an adsorbed chloride layer introduces an additional reaction pathway, resulting in an overall depolarization of the reduction process with no significant change of the Tafel slope. At high chloride concentration, complexation phenomena induce a cathodic polarization of the deposition process and a decrease in the Tafel slope. Chlorides cause a decrease in the density and an increased size of copper nuclei. Sulfamate depolarizes copper reduction the most and results in the largest nucleus density. Chloride promotes the faceting, and dendritic growth of copper deposits along direction by introducing interfacial anisotropy. Addition of Ag in the solution or in the electrode substrate enhances copper deposition and results in an additional reduction peak. Codeposition of Cu-Ag increases nucleus density and decreases nucleus size. Such enhancement of copper deposition, the increase in nucleus density and the decrease in nucleus size by Ag could be due to the continued formation of a surface alloy of Cu-Ag and the fast interface dynamics of Ag deposition. Cu can be underpotentially codeposited in the Cu-Au alloy. Homogeneous solid solutions are grown under conditions of underpotential deposition of Cu, while precipitation

  8. Synthesis of copper nanoparticles in polycarbonate by ion implantation

    Indian Academy of Sciences (India)

    Annu Sharma; Suman Bahniwal; Sanjeev Aggarwal; S Chopra; D Kanjilal

    2011-07-01

    Copper nanoparticles have been synthesized in polycarbonate by 75 KeV Cu– ion implantation with various doses ranging from 6.4 × 1015 to 1.6 × 1017 ions/cm2 with a beam current density of 800 nA/cm2. The composites formed were structurally characterized using Ultraviolet-Visible (UV-Visible) absorption spectroscopy. The appearance of particle plasmon resonance peak, characteristic of copper nanoparticles at 603 nm in absorption spectra of polycarbonate implanted to a dose of 1.6 × 1017 ions/cm2, indicates towards the formation of copper nanoparticles in polycarbonate. Transmission electron microscopy further confirms the formation of copper nanoparticles having size ∼ 3.15 nm. The formation of copper nanoparticles in the layers carbonized by Cu– implantation has been discussed. The synthesized copper-polycarbonate nanocomposite has been found to be more conducting than polycarbonate as ascertained using current–voltage characteristics.

  9. Potassium sorbate-A new aqueous copper corrosion inhibitor

    Energy Technology Data Exchange (ETDEWEB)

    Abelev, Esta [Department of Materials Engineering, Technion-Israel Institute of Technology, Haifa 32000 (Israel); Starosvetsky, David [Department of Materials Engineering, Technion-Israel Institute of Technology, Haifa 32000 (Israel); Ein-Eli, Yair [Department of Materials Engineering, Technion-Israel Institute of Technology, Haifa 32000 (Israel)]. E-mail: eineli@tx.technion.ac.il

    2007-01-01

    This work presents the novel nature of 2,4-hexadienoic acid potassium salt (potassium sorbate (KCH{sub 3}CH=CHCH=CHCO{sub 2})) as an effective copper aqueous corrosion inhibitor. The influence of pH and potassium sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in potassium sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of potassium sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-sorbate at the metal surface.

  10. Magnetic Effect during Copper Electroplating Using Electrochemical Impedance Spectroscopy

    Science.gov (United States)

    Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Hwang, Gwo-Jen; Wang, Ying-Lang

    2009-07-01

    In this paper, the effect of the intensity of the magnetic field on copper electroplating was investigated. Our results indicate that the variation of the magnetic field on the surface of the cathode electrode affected the electroplating rate of the electroplated copper film. By increasing the intensity of the magnetic field, the copper-electroplating rate increases. However, the magnetic field did not affect the grain sizes or shapes of the copper electroplated films. Electrochemical impedance spectroscopy (EIS) was used to analyze the electrochemical effect of the magnetic field during the copper electroplating process. Cyclic-voltammetry stripping, and cell voltage versus plating time were examined to clarify the acceleration behavior of the magnetic field. The proposed equivalent circuit shows that the magnetic field enhanced the copper-electroplating rate by decreasing the charge-transfer resistance as well as the resistance of the diffusion layer.

  11. [Copper pathology (author's transl)].

    Science.gov (United States)

    Mallet, B; Romette, J; Di Costanzo, J D

    1982-01-30

    Copper is an essential dietary component, being the coenzyme of many enzymes with oxidase activity, e.g. ceruloplasmin, superoxide dismutase, monoamine oxidase, etc. The metabolism of copper is complex and imperfectly known. Active transport of copper through the intestinal epithelial cells involves metallothionein, a protein rich in sulfhydryl groups which also binds the copper in excess and probably prevents absorption in toxic amounts. In hepatocytes a metallothionein facilitates absorption by a similar mechanism and regulates copper distribution in the liver: incorporation in an apoceruloplasmin, storage and synthesis of copper-dependent enzymes. Metallothioneins and ceruloplasmin are essential to adequate copper homeostasis. Apart from genetic disorders, diseases involving copper usually result from hypercupraemia of varied origin. Wilson's disease and Menkes' disease, although clinically and pathogenetically different, are both marked by low ceruloplasmin and copper serum levels. The excessive liver retention of copper in Wilson's disease might be due to increased avidity of hepatic metallothioneins for copper and decreased biliary excretion through lysosomal dysfunction. Menkes' disease might be due to low avidity of intestinal and hepatic metallothioneins for copper. The basic biochemical defect responsible for these two hereditary conditions has not yet been fully elucidated.

  12. X-ray reflection anomalous fine structure analysis of the stability of permalloy/copper multilayers

    Energy Technology Data Exchange (ETDEWEB)

    Luo, G.M.; Mai, Z.H.; Hase, T.P.A. E-mail: t.p.a.hase@dur.ac.uk; Fulthorpe, B.D.; Tanner, B.K.; Marrows, C.H.; Hickey, B.J

    2001-05-01

    We report the application of reflection anomalous fine structure analysis to the study of the changes in the layer density and local environment in sputtered permalloy/copper multilayers. By fitting the smoothly varying component of the plot of multilayer Bragg peak intensity versus incident X-ray energy, we find a strained permalloy layer at the permalloy/copper but not the copper/permalloy interface. The density difference between copper and strained permalloy layers increases on annealing at 275 deg. C and from the oscillatory component of the spectrum, we show that it is the nearest-neighbour distance around the Ni atoms which decreases.

  13. [Copper IUDs (author's transl)].

    Science.gov (United States)

    Thiery, M

    1983-10-01

    Following initial development of the Grafenberg ring in the 1920's, IUDs fell into disuse until the late 1950s, when plastic devices inserted using new technology began to gain worldwide acceptance. Further research indicated that copper had a significant antifertility effect which increased with increasing surface area, and several copper IUDs were developed and adapted, including the Copper T 200, the Copper T 220C, and the Copper T 380 A, probably the most effective yet. The Gravigard and Multiload are 2 other copper devices developed according to somewhat different principles. Copper devices are widely used not so much because of their great effectiveness as because of their suitability for nulliparous patients and their ease of insertion, which minimizes risk of uterine perforation. Records of 2584 women using Copper IUDs for 7190 women-years and 956 women using devices without copper for 6059 women-years suggest that the copper devices were associated with greater effectiveness and fewer removals for complications. Research suggests that the advantages of copper IUDs become more significant with increased duration of use. Contraindications to copper devices include allergy to copper and hepatolenticular degeneration. No carcinogenic or teratogenic effect of copper devices has been found, but further studies are needed to rule out other undesirable effects. Significant modifications of copper devices in recent years have been developed to increase their effectiveness, prolong their duration of usefulness, facilitate insertion and permit insertion during abortion or delivery. The upper limit of the surface area of copper associated with increased effectiveness appears to be between 200-300 sq mm, and at some point increases in copper exposure may provoke expulsion of the IUD. The duration of fertility inhibition of copper IUDs is usually estimated at 2-3 years, but recent research indicates that it may be 6-8 years, and some devices may retain copper surface

  14. Nanoscale Copper and Copper Compounds for Advanced Device Applications

    Science.gov (United States)

    Chen, Lih-Juann

    2016-12-01

    Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu2S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu3Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se2 nanotip arrays for high-efficiency solar cell, multilevel Cu2S resistive memory, superlattice Cu2S-Ag2S heterojunction diodes, and facet-dependent Cu2O diode.

  15. Impedance and XPS study of benzotriazole films formed on copper, copper-zinc alloys and zinc in chloride solution

    Energy Technology Data Exchange (ETDEWEB)

    Kosec, Tadeja; Merl, Darja Kek [Jozef Stefan Institute, Department of Physical and Organic Chemistry, Jamova 39, 1000 Ljubljana (Slovenia); Milosev, Ingrid [Jozef Stefan Institute, Department of Physical and Organic Chemistry, Jamova 39, 1000 Ljubljana (Slovenia); Orthopaedic Hospital Valdoltra, Jadranska c. 31, 6280 Ankaran (Slovenia)], E-mail: ingrid.milosev@ijs.si

    2008-07-15

    The formation of protective layers on copper, zinc and copper-zinc (Cu-10Zn and Cu-40Zn) alloys at open circuit potential in aerated, near neutral 0.5 M NaCl solution containing benzotriazole was studied using electrochemical impedance spectroscopy (EIS) and X-ray photoelectron spectroscopy (XPS). Benzotriazole (BTAH), generally known as an inhibitor of copper corrosion, also proved to be an efficient inhibitor for copper-zinc alloys and zinc metal. The surface layers formed on alloys in BTAH-inhibited solution comprised both polymer and oxide components, namely Cu(I)BTA and Zn(II)BTA polymers and Cu{sub 2}O and ZnO oxides, as proved by the in-depth profiling of the layers formed. A tentative structural model describing the improved corrosion resistance of Cu, Cu-xZn alloys and Zn in BTAH containing chloride solution is proposed.

  16. Characteristics and antimicrobial activity of copper-based materials

    Science.gov (United States)

    Li, Bowen

    antibacterial activity than copper vermiculite against E. coli. With 200 ppm exfoliated copper vermiculite in bacteria suspension (4.68 ppm of metal copper), the reduction of viable bacteria are 99.8% at 1 hour, and >99.9% at 2 hours. With 10 ppm exfoliated copper vermiculite in bacteria dilution (0.234 ppm of copper atoms), the reduction of viable E. coli reached 98.7% at 1 hour, and >95.6% at 2 hours. Molds have the potential to cause health problems, such as allergic reactions, irritations, and mycotoxins, and damage to buildings, historic relics, properties, etc. Since copper has better antifungal property, an initial antifungal activity of copper vermiculite was evaluated in this study. Fat-free milk was used to develop molds in the test samples by saturated samples. Incubated at 36°C for 48 hours, all of the surfaces of untreated control samples, including micron-sized vermiculite, exfoliated vermiculite, bentonite, and kaolin, have been covered by thick mold layers. However, there were no mold showed on copper vermiculite and exfoliated copper vermiculite. Even after the incubation was lasted for 10 days, copper vermiculite and exfoliated copper vermiculite did not show any mold on the surface. These results exhibited copper vermiculite has excellent antifungal activities against mold. Stability of copper ions in copper vermiculite was measured by aqueous leaching process. Copper vermiculite and exfoliated copper vermiculite were put into distilled water in a ratio of 2.0g/100ml, and then implemented leaching processes by continuously shaking (leaching) and statically storing (soaking) for desired periods of time, respectively. According to the analytic result by inductively coupled plasma spectroscopy (ICP), the major metals released were copper, magnesium, iron, silicon, and aluminum. The release rate of copper depends on the environmental conditions. Under the dynamic leaching condition, all the major elements had shown linear leaching rates, and slowly increases

  17. Handling of Copper and Copper Oxide Nanoparticles by Astrocytes.

    Science.gov (United States)

    Bulcke, Felix; Dringen, Ralf

    2016-02-01

    Copper is an essential trace element for many important cellular functions. However, excess of copper can impair cellular functions by copper-induced oxidative stress. In brain, astrocytes are considered to play a prominent role in the copper homeostasis. In this short review we summarise the current knowledge on the molecular mechanisms which are involved in the handling of copper by astrocytes. Cultured astrocytes efficiently take up copper ions predominantly by the copper transporter Ctr1 and the divalent metal transporter DMT1. In addition, copper oxide nanoparticles are rapidly accumulated by astrocytes via endocytosis. Cultured astrocytes tolerate moderate increases in intracellular copper contents very well. However, if a given threshold of cellular copper content is exceeded after exposure to copper, accelerated production of reactive oxygen species and compromised cell viability are observed. Upon exposure to sub-toxic concentrations of copper ions or copper oxide nanoparticles, astrocytes increase their copper storage capacity by upregulating the cellular contents of glutathione and metallothioneins. In addition, cultured astrocytes have the capacity to export copper ions which is likely to involve the copper ATPase 7A. The ability of astrocytes to efficiently accumulate, store and export copper ions suggests that astrocytes have a key role in the distribution of copper in brain. Impairment of this astrocytic function may be involved in diseases which are connected with disturbances in brain copper metabolism.

  18. The Unusual Colour of Copper Deposited on a Graphite Electrode in an Aqueous Solution of CuSO[subscript 4

    Science.gov (United States)

    Petrusevski, Vladimir M.; Stojanovska, Marina

    2010-01-01

    The colour of the copper layer deposited on a graphite electrode during electrolysis of an aqueous solution of copper(II) sulfate looks whitish-grey when inspected in situ. Taking the electrode out of the solution reveals the familiar orange-red colour of deposited copper. The explanation is found in terms of the almost ideal complementary colours…

  19. The formation of copper sulphide semiconductors inside Langmuir–Blodgett films of Cu(II) ion complexes

    NARCIS (Netherlands)

    Werkman, P.J.; Wieringa, R.H.; Schouten, A.J.

    1998-01-01

    The fabrication of layers of copper sulphide within multilayers of copper complexes of the amphiphile 4-(10,12-pentacosadiynamido methyl pyridine, by diffusion of H2S into the multilayers, was studied by UV–VIS spectroscopy. XPS measurements revealed that copper sulphides can be synthesised which di

  20. The Unusual Colour of Copper Deposited on a Graphite Electrode in an Aqueous Solution of CuSO[subscript 4

    Science.gov (United States)

    Petrusevski, Vladimir M.; Stojanovska, Marina

    2010-01-01

    The colour of the copper layer deposited on a graphite electrode during electrolysis of an aqueous solution of copper(II) sulfate looks whitish-grey when inspected in situ. Taking the electrode out of the solution reveals the familiar orange-red colour of deposited copper. The explanation is found in terms of the almost ideal complementary colours…

  1. Canine models of copper toxicosis for understanding mammalian copper metabolism

    OpenAIRE

    Fieten, Hille; Leegwater, Peter A. J.; Watson, Adrian L.; Rothuizen, Jan

    2011-01-01

    Hereditary forms of copper toxicosis exist in man and dogs. In man, Wilson’s disease is the best studied disorder of copper overload, resulting from mutations in the gene coding for the copper transporter ATP7B. Forms of copper toxicosis for which no causal gene is known yet are recognized as well, often in young children. Although advances have been made in unraveling the genetic background of disorders of copper metabolism in man, many questions regarding disease mechanisms and copper homeo...

  2. Hair copper in intrauterine copper device users.

    Science.gov (United States)

    Thiery, M; Heyndrickx, A; Uyttersprot, C

    1984-03-01

    The antifertility effect of copper-bearing IUDs is based on continuous release of copper, which is a result of the reaction between the metal and the uterine secretions. Released cupric ions collect in the endometrium and in the uterine fluid but significant accumulation has not been found in the bloodstream or elsewhere. Following Laker's suggestion that hair be used for monitoring essential trace elements, e.g., copper, we checked the copper content of the hair of women wearing copper-bearing IUDs. Samples of untreated pubic hair removed by clipping before diagnostic curettage were obtained from 10 young (24-34 years old), white caucasian females who until then had been wearing an MLCu250 IUD for more than 1 year. Pubes from 10 comparable (sex, age, race) subjects who had never used a Cu-containing device served as controls. The unwashed material was submitted to the toxicology laboratory, where the copper content was assessed by flameless atomic absorption, a technique whose lower limit of measurement lies at a concentration of 0.05 mcg Cu/ml fluid (50 ppb). Hair samples were washed to remove extraneous traces of metal according to the prescriptions of the International Atomic Energy Agency, weighed, and mineralized, after which a small volume (10 mcl) of the diluted fluid was fed into the graphite furnace. Each sample (75-150 mg) was analyzed 4 times, both before and after washing. Since the cleaning procedure reduces the weight of the sample (mainly by the removal of fat, dust, etc.) this explains why the percentage copper content of washed hair is higher than that of unwashed hair belonging to the same subject. The results indicate that there was no significant difference (Mann-Whitney U test) between the mean copper levels of both unwashed and washed pubes from women who were using or had never used an MLCu250 IUD. We therefore conclude that the use of this copper-containing device is not associated with significant accumulation of copper in (pubic) hair.

  3. Graphene-protected copper and silver plasmonics

    Science.gov (United States)

    Kravets, V. G.; Jalil, R.; Kim, Y.-J.; Ansell, D.; Aznakayeva, D. E.; Thackray, B.; Britnell, L.; Belle, B. D.; Withers, F.; Radko, I. P.; Han, Z.; Bozhevolnyi, S. I.; Novoselov, K. S.; Geim, A. K.; Grigorenko, A. N.

    2014-01-01

    Plasmonics has established itself as a branch of physics which promises to revolutionize data processing, improve photovoltaics, and increase sensitivity of bio-detection. A widespread use of plasmonic devices is notably hindered by high losses and the absence of stable and inexpensive metal films suitable for plasmonic applications. To this end, there has been a continuous search for alternative plasmonic materials that are also compatible with complementary metal oxide semiconductor technology. Here we show that copper and silver protected by graphene are viable candidates. Copper films covered with one to a few graphene layers show excellent plasmonic characteristics. They can be used to fabricate plasmonic devices and survive for at least a year, even in wet and corroding conditions. As a proof of concept, we use the graphene-protected copper to demonstrate dielectric loaded plasmonic waveguides and test sensitivity of surface plasmon resonances. Our results are likely to initiate wide use of graphene-protected plasmonics. PMID:24980150

  4. China Copper Processing Industry Focus

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    <正>1. Market Consumption The ’China Factor’ and Copper Price Fluctuation We all know China is an enormous consumer of copper,but the exact levels of consumption and where the copper has gone remains a mystery.

  5. Biogenic nanoparticles: copper, copper oxides, copper sulphides, complex copper nanostructures and their applications.

    Science.gov (United States)

    Rubilar, Olga; Rai, Mahendra; Tortella, Gonzalo; Diez, Maria Cristina; Seabra, Amedea B; Durán, Nelson

    2013-09-01

    Copper nanoparticles have been the focus of intensive study due to their potential applications in diverse fields including biomedicine, electronics, and optics. Copper-based nanostructured materials have been used in conductive films, lubrification, nanofluids, catalysis, and also as potent antimicrobial agent. The biogenic synthesis of metallic nanostructured nanoparticles is considered to be a green and eco-friendly technology since neither harmful chemicals nor high temperatures are involved in the process. The present review discusses the synthesis of copper nanostructured nanoparticles by bacteria, fungi, and plant extracts, showing that biogenic synthesis is an economically feasible, simple and non-polluting process. Applications for biogenic copper nanoparticles are also discussed.

  6. An XPS study of copper corrosion originated by formic acid vapour at 40% and 80% relative humidity

    Energy Technology Data Exchange (ETDEWEB)

    Cano, E.; Torres, C.L.; Bastidas, J.M. [National Centre for Metallurgical Research (CSIC), Madrid (Spain)

    2001-09-01

    Copper corrosion products originated by the action of formic acid vapours at 40% and 80% relative humidity for a period of 21 days were analysed. Three formic vapour concentration levels (10, 100 and 300 ppm) were generated in laboratory tests at 30 C. The corrosion product layers were characterised using X-ray photoelectron spectroscopy (XPS) in conjunction with Ar{sup +}-ion sputtering. The components identified in the patina layers were cuprite (Cu{sub 2}O), copper hydroxide (Cu(OH){sub 2}) and copper formate (Cu(HCOO){sub 2}). Copper formate was formed by a complex mechanism including copper hydroxide and formic acid. (orig.)

  7. Acid leaching of oxide-sulphide copper ore prior the flotation: A way for an increased metal recovery

    Directory of Open Access Journals (Sweden)

    Sokić Miroslav D.

    2015-01-01

    Full Text Available Copper mine "Cerovo"- East Serbia as well as the other ore bodies in its vicinity contain a significant amount of oxide copper minerals in their uper layers (>40%. Processing of such mixed ores by the existing concentration technologies leads to a substantial copper losses (<60%. Reduction of "oxide copper", by acid leaching prior the flotation concentration, can increase the overall copper efficiency up to more than 70% in the single-stage leaching, achieving an efficiency in the flotation concentration stage higher than 75%. Based on the performed experimental results the flow sheet for processing of the mixed oxide-sulphide copper ore is proposed.

  8. Copper and silver halates

    CERN Document Server

    Woolley, EM; Salomon, M

    2013-01-01

    Copper and Silver Halates is the third in a series of four volumes on inorganic metal halates. This volume presents critical evaluations and compilations for halate solubilities of the Group II metals. The solubility data included in this volume are those for the five compounds, copper chlorate and iodate, and silver chlorate, bromate and iodate.

  9. Coping with copper

    DEFF Research Database (Denmark)

    Nunes, Ines; Jacquiod, Samuel; Brejnrod, Asker

    2016-01-01

    Copper has been intensively used in industry and agriculture since mid-18(th) century and is currently accumulating in soils. We investigated the diversity of potential active bacteria by 16S rRNA gene transcript amplicon sequencing in a temperate grassland soil subjected to century-long exposure......, suggesting a potential promising role as bioindicators of copper contamination in soils....

  10. Process of direct copper plating on ABS plastics

    Energy Technology Data Exchange (ETDEWEB)

    Wang Guixiang [Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001 (China)]. E-mail: wgx0357@126.com; Li Ning [Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001 (China); Hu Huili [Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001 (China); Yu Yuanchun [Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001 (China)

    2006-11-15

    The processes of direct copper plating on ABS plastics were investigated by atomic force microscopy (AFM), ultraviolet-visible absorption spectrometry (UV-vis) and X-ray fluorescence spectroscopy (XRF) techniques. The substrates were etched by CrO{sub 3}/H{sub 2}SO{sub 4} solution containing Pd{sup 2+} ions, catalyzed by Pd/Sn colloids solution and accelerated in an alkaline solution containing copper ions. The Pd{sup 2+} ions in etching solution can reduce the surface roughness and enhance the colloids adsorption. The good dispersivity colloids have excellent catalysis and its UV-vis peaks broaden. After acceleration, when the stability of Cu{sup 2+}-complex is relatively low, Sn{sup 2+} was oxidized by Cu{sup 2+} in the alkaline solution meanwhile Cu{sub 2}O can be formed. The disproportionation reaction of Cu{sub 2}O will proceed and metallic copper forms between the Pd particles, so the conductivity of ABS surface increased. The copper particles play an important role in determining the uniformity of the propagation of copper plating. The particles of copper plating layer were uniformity and fine. The atomic concentration and the thickness of copper layer were analyzed by XRF.

  11. Preparation and structure of carbon encapsulated copper nanoparticles

    Science.gov (United States)

    Hao, Chuncheng; Xiao, Feng; Cui, Zuolin

    2008-01-01

    Carbon-encapsulated copper nanoparticles were synthesized by a modified arc plasma method using methane as carbon source. The particles were characterized in detail by transmission electron microscope, high-resolution transmission electron microscopy, selected-area electron diffraction, X-ray diffraction, thermogravimetric and differential scanning calorimetry. The encapsulated copper nanoparticles were about 30 nm in diameter with 3-5 nm graphitic carbon shells. The outside graphitic carbon layers effectively prevented unwanted oxidation of the copper inside. The effect of the ratio of He/CH4 on the morphologies and the formation of the carbon shell were investigated.

  12. Preparation and structure of carbon encapsulated copper nanoparticles

    Energy Technology Data Exchange (ETDEWEB)

    Hao Chuncheng, E-mail: clx@qust.edu.cn; Xiao Feng; Cui Zuolin [Qingdao University of Science and Technology, Shandong Key Lab for Nanostructured Materials (China)

    2008-01-15

    Carbon-encapsulated copper nanoparticles were synthesized by a modified arc plasma method using methane as carbon source. The particles were characterized in detail by transmission electron microscope, high-resolution transmission electron microscopy, selected-area electron diffraction, X-ray diffraction, thermogravimetric and differential scanning calorimetry. The encapsulated copper nanoparticles were about 30 nm in diameter with 3-5 nm graphitic carbon shells. The outside graphitic carbon layers effectively prevented unwanted oxidation of the copper inside. The effect of the ratio of He/CH{sub 4} on the morphologies and the formation of the carbon shell were investigated.

  13. Method for forming a barrier layer

    Energy Technology Data Exchange (ETDEWEB)

    Weihs, Timothy P. (Baltimore, MD); Barbee, Jr., Troy W. (Palo Alto, CA)

    2002-01-01

    Cubic or metastable cubic refractory metal carbides act as barrier layers to isolate, adhere, and passivate copper in semiconductor fabrication. One or more barrier layers of the metal carbide are deposited in conjunction with copper metallizations to form a multilayer characterized by a cubic crystal structure with a strong (100) texture. Suitable barrier layer materials include refractory transition metal carbides such as vanadium carbide (VC), niobium carbide (NbC), tantalum carbide (TaC), chromium carbide (Cr.sub.3 C.sub.2), tungsten carbide (WC), and molybdenum carbide (MoC).

  14. Kunpeng Copper:The largest Copper Smelting Company of Sichuan

    Institute of Scientific and Technical Information of China (English)

    2011-01-01

    <正>On September 9,Liangshan Mining Company’s 100,000 tons/year cathode copper project kicked off.It is another key project of the company following the successful launch of the 100,000 tons/year anode copper project.Based on ISA copper smelting technology of the largest open-cast copper mine in southwest China,

  15. Photoemission study of the adsorption of benzotriazole on copper

    Energy Technology Data Exchange (ETDEWEB)

    Fang, B.S.

    1985-01-01

    A photoemission study was performed on the chemisorption of benzotriazole (BTA) on polycrystalline copper (clean and oxidized) surfaces to understand the corrosion inhibition mechanism. The energy distribution curves indicate benzotriazole bonding to copper through nitrogen lone pair orbitals. They also disagree with the models which suggest that the benzotriazole molecular plane is oriented parallel to the copper surface by showing a lack of ..pi..-d interaction. The observed chemisorption of benzotriazole on atomically clean copper surfaces at room temperature suggests that an oxide layer is not necessary for the adsorption of benzotriazole. No structural difference was observed in the photoemission studies on BTA-clean copper and BTA-cuprous oxide surface film. This result demonstrates the major role of the copper atom upon benzotriazole adsorption. A new model of the CuBTA chemisorbed structure is presented. The Cu-BTA polymer is formed by strong charge-transfer interactions between benzotriazole molecules instead of by BTA-Cu-BTA connections. It successfully interprets the experimental results from solubility and tarnish resistance tests on adsorbed films on copper surfaces. It also gives a reasonable explanation for the different inhibition coefficients among BTA-treated copper single crystal surfaces. Mechanisms are suggested for the benzotriazole inhibition mechanisms.

  16. Posttranslational regulation of copper transporters

    NARCIS (Netherlands)

    van den Berghe, P.V.E.

    2009-01-01

    The transition metal copper is an essential cofactor for many redox-active enzymes, but excessive copper can generate toxic reactive oxygen species. Copper homeostasis is maintained by highly conserved proteins, to balance copper uptake, distribution and export on the systemic and cellular level. Th

  17. Fabricating Copper Nanotubes by Electrodeposition

    Science.gov (United States)

    Yang, E. H.; Ramsey, Christopher; Bae, Youngsam; Choi, Daniel

    2009-01-01

    Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.

  18. [Copper and the human body].

    Science.gov (United States)

    Krízek, M; Senft, V; Motán, J

    1997-11-19

    Copper is one of the essential trace elements. It is part of a number of enzymes. Deficiency of the element is manifested by impaired haematopoesis, bone metabolism, disorders of the digestive, cardiovascular and nervous system. Deficiency occurs in particular in patients suffering from malnutrition, malabsorption, great copper losses during administration of penicillamine. Sporadically copper intoxications are described (suicidal intentions or accidental ingestion of beverages with a high copper content). Acute exposure to copper containing dust is manifested by metal fume fever. Copper salts can produce local inflammations. Wilson's disease is associated with inborn impaired copper metabolism. In dialyzed patients possible contaminations of the dialyzate with copper must be foreseen as well as the possible release of copper from some dialyzation membranes. With the increasing amount of copper in the environment it is essential to monitor the contamination of the environment.

  19. Investigation of peptide based surface functionalization for copper ions detection using an ultrasensitive mechanical microresonator

    DEFF Research Database (Denmark)

    Cagliani, Alberto; Fischer, Lee MacKenzie; Rasmussen, Jakob Lyager

    2011-01-01

    In the framework of developing a portable label-free sensor for multi arrayed detection of heavy metals in drinking water, we present a mechanical resonator-based copper ions sensor, which uses a recently synthesized peptide Cysteine–Glycine–Glycine–Histidine (CGGH) and the l-Cysteine (Cys) peptide...... devices to detect a concentration of 10μM of copper in water, we regenerate the surface by removing the copper ions from the functionalization layer using EDTA....

  20. The Interaction of Polycrystalline Copper Films with Dilute Aqueous Solutions of Cupric Chloride

    Science.gov (United States)

    1989-10-01

    in atmosphere has always been of interest because of the extensive use of copper and brass in buildings and statues, for example. A study by Pinnel et...solution and the sample surface layer have been reported with no mention of the microstructure of the copper sample except for a few cases where chemical...used as a substrate when the deposited film will be removed for mechanical testing. In this case , the copper film was removed prior to characterization

  1. Targeting copper in cancer therapy: 'Copper That Cancer'.

    Science.gov (United States)

    Denoyer, Delphine; Masaldan, Shashank; La Fontaine, Sharon; Cater, Michael A

    2015-11-01

    Copper is an essential micronutrient involved in fundamental life processes that are conserved throughout all forms of life. The ability of copper to catalyze oxidation-reduction (redox) reactions, which can inadvertently lead to the production of reactive oxygen species (ROS), necessitates the tight homeostatic regulation of copper within the body. Many cancer types exhibit increased intratumoral copper and/or altered systemic copper distribution. The realization that copper serves as a limiting factor for multiple aspects of tumor progression, including growth, angiogenesis and metastasis, has prompted the development of copper-specific chelators as therapies to inhibit these processes. Another therapeutic approach utilizes specific ionophores that deliver copper to cells to increase intracellular copper levels. The therapeutic window between normal and cancerous cells when intracellular copper is forcibly increased, is the premise for the development of copper-ionophores endowed with anticancer properties. Also under investigation is the use of copper to replace platinum in coordination complexes currently used as mainstream chemotherapies. In comparison to platinum-based drugs, these promising copper coordination complexes may be more potent anticancer agents, with reduced toxicity toward normal cells and they may potentially circumvent the chemoresistance associated with recurrent platinum treatment. In addition, cancerous cells can adapt their copper homeostatic mechanisms to acquire resistance to conventional platinum-based drugs and certain copper coordination complexes can re-sensitize cancer cells to these drugs. This review will outline the biological importance of copper and copper homeostasis in mammalian cells, followed by a discussion of our current understanding of copper dysregulation in cancer, and the recent therapeutic advances using copper coordination complexes as anticancer agents.

  2. 低品级菱镁矿制耐水氯氧镁胶凝材料的研制%The Preparation of Water-resistant Magnesium Oxychloride Cement Made with Low-grade Magnesite

    Institute of Scientific and Technical Information of China (English)

    陈后维; 章祥林; 靳廷甲; 徐建

    2015-01-01

    用粉煤灰、磷酸、硫酸铝、有机硅防水剂以及活性氧化镁含量为34.91%的低品级轻烧氧化镁研制出一种耐水氯氧镁胶凝材料,并对镁质材料的强度、耐水性能进行了测试。通过分析粉晶X RD衍射图样和断面微观结构对镁质材料的耐水机理进行了研究。研究结果表明改性过的镁质材料具有优良的耐水性能,其28d软化系数从0.76提高到了1.01。该方法充分利用了低品级菱镁矿资源,为镁质胶凝材料的制备提供了新思路。%A kind of water‐resistant magnesium oxychloride cement (MOC) were made by fly ash , phosphoric acid ,aluminum sulfate ,organosilicon water‐proofing agent and low‐grade light burned magnesium oxide contains 34 .91% active magnesium oxide .The materials'strength and water resist‐ance were tested .Crystal powder XRD analysis and fracture surface SEM analysis were applied to study the materials'water‐tolerant mechanism .The results showed that the improved magnesia mate‐rials had fine water resistance ,soft coefficient raised from 0 .76 to 1 .01 .This method could take full advantage of low‐grade magnesite and provides a new method to prepare magnesia cementing materi‐als .

  3. Growth of Cu thin films by the successive ionic layer adsorption and reaction (SILAR) method

    Energy Technology Data Exchange (ETDEWEB)

    Lindroos, S.; Ruuskanen, T.; Ritala, M.; Leskelae, M

    2004-07-22

    Copper thin films were grown on reduced indium tin oxide, molybdenum and polymer substrates using successive ionic layer adsorption and reaction (SILAR) method. Copper films were grown sequentially in a controlled way using simple copper salt and basic solution of formaldehyde as precursors. The copper films were polycrystalline with no preferred orientation as characterised by X-ray diffraction. On all substrates, the growth was clearly island growth in the beginning but after the whole surface was covered, the growth was more homogeneous.

  4. a Photoemission Study of the Adsorption of Benzotriazole on Copper.

    Science.gov (United States)

    Fang, Bo-Shung

    1985-12-01

    A photoemission study was performed on the chemisorption of benzotriazole (BTA) on polycrystalline copper (clean and oxidized) surfaces to understand the corrosion inhibition mechanism. The energy distribution curves indicate benzotriazole bonding to copper through nitrogen lone pair orbitals. They also disagree with the models which suggest that the benzotriazole molecular plane is oriented parallel to the copper surface by showing a lack of (pi)-d interaction. The observed chemisorption of benzotriazole on atomi- cally clean copper surfaces at room temperature suggests that an oxide layer is not necessary for the adsorption of benzotriazole. No structural difference was observed in the photoemission studies on BTA-clean copper and BTA-cuprous oxide surface film. This results demonstrates the major role of the copper atom upon benzotriazole adsorption. A new model of the CuBTA chemisorbed structure is presented. The Cu-BTA polymer is formed by strong charge -transfer interac- tions between benzotriazole molecules instead of by BTA-Cu-BTA connections. It successfully interprets the experimental results from solubility and tarnish resistance tests on adsorbed films on copper surfaces. It also gives a reasonable explanation for the different inhibition coefficients among BTA-treated copper single crystal surfaces. This study leads to an understanding of the benzotriazole inhi- bition mechanism: (1) All the copper atoms can be bound to BTA nitrogen atoms and the absence of active surface sites prevents attack by corrosive ions. (2) The BTA molecule stands vertically, or nearly so, to the copper surface, but still allows the formation of a compact protective surface film. (3) The strong infinite polymer. chains stabilize the protective film and strengthen its inhibition capability. ('1)DOE Report IS-T-1196. This work was performed under contract No. W-7405-Eng-82 with the U.S. Department of Energy.

  5. LEP copper accelerating cavities

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    These copper cavities were used to generate the radio frequency electric field that was used to accelerate electrons and positrons around the 27-km Large Electron-Positron (LEP) collider at CERN, which ran from 1989 to 2000. The copper cavities were gradually replaced from 1996 with new superconducting cavities allowing the collision energy to rise from 90 GeV to 200 GeV by mid-1999.

  6. Copper wire bonding

    CERN Document Server

    Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

    2014-01-01

    This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

  7. Structural properties of produced CuO/NiO/glass thin layers Produced by chemical method

    Directory of Open Access Journals (Sweden)

    A. Ramezani

    2016-12-01

    Full Text Available Nickel Oxide and Copper oxide on Nickel Oxide thin layers were produced by chemical bath deposition method. There nano structures were investigated by SEM and EDAX analysis. By producing CuO/NiO/glass sandwich layers nano structure of NiO/glass layer changed and fraction of voids decreases. In sandwich layer physical property of outer layer was dominant

  8. Standard Specification for Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper-Nickel-Tin Alloy Sheet and Strip

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2015-01-01

    Standard Specification for Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper-Nickel-Tin Alloy Sheet and Strip

  9. Smelting reduction and kinetics analysis of magnetic iron in copper slag using waste cooking oil.

    Science.gov (United States)

    Li, Bo; Wang, Xubin; Wang, Hua; Wei, Yonggang; Hu, Jianhang

    2017-05-25

    To improve the recovery of copper, the viscosity of copper molten slag is decreased by the reduction of magnetic iron, which, in turn, accelerates the settling and separation of copper droplets from the slag. A new technology is proposed in which waste cooking oil is used as a reductant to reduce magnetic iron in the copper smelting slag and consequently reduce carbon emissions in the copper smelting process. A kinetic model of the reduction of magnetic iron in copper slag by waste cooking oil was built using experimental data, and the accuracy of the model was verified. The results indicated that the magnetic iron content in the copper slag decreased with increasing reduction time and an increase in temperature more efficiently reduced magnetic iron in the copper slag. The magnetic iron in the copper slag gradually transformed to fayalite, and the viscosity of the copper molten slag decreased as the magnetic iron content decreased during the reduction process. The reduction of magnetic iron in the copper molten slag using waste cooking oil was a first-order reaction, and the rate-limiting step was the mass transfer of Fe3O4 through the liquid boundary layer.

  10. Hybrid Copper-Silver Conductive Tracks for Enhanced Oxidation Resistance under Flash Light Sintering.

    Science.gov (United States)

    Yim, Changyong; Sandwell, Allen; Park, Simon S

    2016-08-31

    We developed a simple method to prepare hybrid copper-silver conductive tracks under flash light sintering. The developed metal nanoparticle-based ink is convenient because its preparation process is free of any tedious washing steps. The inks were composed of commercially available copper nanoparticles which were mixed with formic acid, silver nitrate, and diethylene glycol. The role of formic acid is to remove the native copper oxide layer on the surface of the copper nanoparticles. In this way, it facilitates the formation of a silver outer shell on the surface of the copper nanoparticles through a galvanic replacement. In the presence of formic acid, the copper nanoparticles formed copper formate, which was present in the unsintered tracks. However, under illumination by a xenon flash light, the copper formate was then converted to copper. Moreover, the resistance of the copper-only films increased by 6 orders of magnitude when oxidized at high temperatures (∼220 °C). However, addition of silver nitrate to the inks suppressed the oxidation of the hybrid copper-silver films, and the resistance changes in these inks at high temperatures were greatly reduced. In addition, the hybrid inks proved to be advantageous for use in electrical circuits as they demonstrated a stable electrical conductivity after exposure to ambient air at 180 °C.

  11. Radiation induced corrosion of copper for spent nuclear fuel storage

    Science.gov (United States)

    Björkbacka, Åsa; Hosseinpour, Saman; Johnson, Magnus; Leygraf, Christofer; Jonsson, Mats

    2013-11-01

    The long term safety of repositories for radioactive waste is one of the main concerns for countries utilizing nuclear power. The integrity of engineered and natural barriers in such repositories must be carefully evaluated in order to minimize the release of radionuclides to the biosphere. One of the most developed concepts of long term storage of spent nuclear fuel is the Swedish KBS-3 method. According to this method, the spent fuel will be sealed inside copper canisters surrounded by bentonite clay and placed 500 m down in stable bedrock. Despite the importance of the process of radiation induced corrosion of copper, relatively few studies have been reported. In this work the effect of the total gamma dose on radiation induced corrosion of copper in anoxic pure water has been studied experimentally. Copper samples submerged in water were exposed to a series of total doses using three different dose rates. Unirradiated samples were used as reference samples throughout. The copper surfaces were examined qualitatively using IRAS and XPS and quantitatively using cathodic reduction. The concentration of copper in solution after irradiation was measured using ICP-AES. The influence of aqueous radiation chemistry on the corrosion process was evaluated based on numerical simulations. The experiments show that the dissolution as well as the oxide layer thickness increase upon radiation. Interestingly, the evaluation using numerical simulations indicates that aqueous radiation chemistry is not the only process driving the corrosion of copper in these systems.

  12. Diffuse emission and control of copper in urban surface runoff.

    Science.gov (United States)

    Boller, M A; Steiner, M

    2002-01-01

    Copper washed off from roofs and roads is considered to be a major contribution to diffuse copper pollution of urban environments. In order to guarantee sustainable protection of soils and water, the long-term strategy is to avoid or replace copper containing materials on roofs and fagades. Until achievement of this goal, a special adsorber system is suggested to control the diffuse copper fluxes by retention of copper by a mixture of granulated iron-hydroxide (GEH) and calcium carbonate. Since future stormwater runoff concepts are based on decentralised runoff infiltration into the underground, solutions are proposed which provide for copper retention in infiltration sites using GEH adsorption layers. The example of a large copper façade of which the runoff is treated in an adsorption trench reveals the first full-scale data on façade runoff and adsorber performance. During the first year of investigation average façade runoff concentrations in the range of 1-10 mg Cu/l are reduced by 96-99% in the adsorption ditch.

  13. Copper nano-clusters prepared by one-step electrodeposition and its application on nitrate sensing

    Directory of Open Access Journals (Sweden)

    Y. Li

    2015-04-01

    Full Text Available This paper describes the fabrication and characterization of copper nano-clusters prepared by a simple one-step electrodeposition process on platinum microelectrode, and the application for nitrate determination. The one-step electrodepostion process was performed by chronoamperometry scan in acidic copper sulphate electrolyte directly. The SEM and electrochemical examination showed that the morphologies and microstructures of deposited copper layers can be precisely controlled by using different deposition voltages. It was found that the copper layer is porous when the deposition voltage is higher than -500 mV, and this porous layer has a larger effective surface area compared with the corresponding smooth flat copper layer deposited under voltage less than -300 mV. Under the optimized deposition voltage, copper clusters constructed by uniform nanoparticles with an average diameter of about 100 nm can be obtained. The mechanism of electrodeposition process for this method was also speculated. The copper layers deposited under different voltages are used in a series of tests in order to evaluate their performance for nitrate sensing. The experimental results reveal that the microelectrode modified by fixed potential deposition under -700 mV had a higher sensitivity of 39.31 μA/mmolL−1 for nitrate detection within the concentration ranging from 0.1 mmolL−1 to 4.0 mmolL−1.

  14. Evolution of the microstructure in nanocrystalline copper electrodeposits during room temperature storage

    DEFF Research Database (Denmark)

    Pantleon, Karen; Somers, Marcel A. J.

    2007-01-01

    and continued with an unprecedented time resolution until stationary values of the recorded data were obtained. Independent of the copper layer thickness, the as-deposited microstructure consisted of nanocrystalline grains with orientation dependent crystallite sizes. Orientation dependent grain growth...

  15. Brazing open cell reticulated copper foam to stainless steel tubing with vacuum furnace brazed gold/indium alloy plating

    Science.gov (United States)

    Howard, Stanley R.; Korinko, Paul S.

    2008-05-27

    A method of fabricating a heat exchanger includes brush electroplating plated layers for a brazing alloy onto a stainless steel tube in thin layers, over a nickel strike having a 1.3 .mu.m thickness. The resultant Au-18 In composition may be applied as a first layer of indium, 1.47 .mu.m thick, and a second layer of gold, 2.54 .mu.m thick. The order of plating helps control brazing erosion. Excessive amounts of brazing material are avoided by controlling the electroplating process. The reticulated copper foam rings are interference fit to the stainless steel tube, and in contact with the plated layers. The copper foam rings, the plated layers for brazing alloy, and the stainless steel tube are heated and cooled in a vacuum furnace at controlled rates, forming a bond of the copper foam rings to the stainless steel tube that improves heat transfer between the tube and the copper foam.

  16. Copper and Copper Proteins in Parkinson’s Disease

    OpenAIRE

    Sergio Montes; Susana Rivera-Mancia; Araceli Diaz-Ruiz; Luis Tristan-Lopez; Camilo Rios

    2014-01-01

    Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased pr...

  17. Jiangxi Copper Plans to Increase its Refined Copper Output

    Institute of Scientific and Technical Information of China (English)

    2011-01-01

    <正>According to news published on March 30th, China’s largest copper producer--Jiangxi Copper alleged in its 2010 Financial Report Statement that it plans to improve its output of refined copper by 4.4% in 2011, to increase from 900,000 tonnes last year to 940,000 tons.

  18. [Copper metabolism and genetic disorders].

    Science.gov (United States)

    Shimizu, Norikazu

    2016-07-01

    Copper is one of essential trace elements. Copper deficiency lead to growth and developmental failure and/or neurological dysfunction. However, excess copper is also problems for human life. There are two disorders of inborn error of copper metabolism, Menkes disease and Wilson disease. Menkes disease is an X linked recessive disorder with copper deficiency and Wilson disease is an autosomal recessive disorder with copper accumulation. These both disorders result from the defective functioning of copper transport P-type ATPase, ATP7A of Menkes disease and ATP7B of Wilson disease. In this paper, the author describes about copper metabolism of human, and clinical feature, diagnosis and treatment of Menkes disease and Wilson disease.

  19. Air-stable silver-coated copper particles of sub-micrometer size.

    Science.gov (United States)

    Jung, D S; Lee, H M; Kang, Y C; Park, S B

    2011-12-15

    Silver-coated copper particles with various silver loading were prepared by a direct liquid-to-particle conversion process in spray pyrolysis reactor system. The prepared particles were completely densified at 900°C within a residence time of 2.1 s and had core-shell structure, of which formation mechanism was proposed. The mean diameter of particles was 0.45 μm. Copper particles of 20 wt.% of silver loading were stable under air and 95% of copper remained as metallic copper even after 1 month of exposure to air. This enhanced air-stability contributed to the enhanced electrical property of conductive film obtained from the coated particles. The conductive film obtained from 15 wt.% of silver-coated copper particles had a sheet resistance of 1.2 mΩ square(-1). This low resistance resulted from the lack of oxide layer and low sintering temperature of silver layer.

  20. Blanch Resistant and Thermal Barrier NiAl Coating Systems for Advanced Copper Alloys

    Science.gov (United States)

    Raj, Sai V. (Inventor)

    2005-01-01

    A method of forming an environmental resistant thermal barrier coating on a copper alloy is disclosed. The steps include cleansing a surface of a copper alloy, depositing a bond coat on the cleansed surface of the copper alloy, depositing a NiAl top coat on the bond coat and consolidating the bond coat and the NiAl top coat to form the thermal barrier coating. The bond coat may be a nickel layer or a layer composed of at least one of copper and chromium-copper alloy and either the bond coat or the NiAl top coat or both may be deposited using a low pressure or vacuum plasma spray.

  1. A Novel RF Inductor Fabricated Through MEMS Processing and Electroless Copper Plating

    Institute of Scientific and Technical Information of China (English)

    LIYi; WUWengang; HAOYilong

    2005-01-01

    A novel radio-frequency inductor with single-crystal-silicon spiral structure suspended on glass substrate is reported. The inductor is fabricated by using an improved silicon-glass anodic bonding and deep etching releasing process combined with electroless copper plating technology. The newly developed process is proved simple, stable and easily controlled. Based on the process, the performances of the inductor, such as quality factor, inductance and operating frequency, can be adjusted by changing the structure parameters. Through the electroless copper plating, the silicon spiral structure of the inductor is encapsulated completely by highly conformal copper film. Furthermore, a thin nickel film is plated on the top of the copper layer for passivation and measurement convenience. The thickness of copper and nickel layers influences the characteristics of the inductors largely. The fabricated inductor exhibits high performances. Its quality factor has reached 27 at the frequency arrange from 9 to 11GHz.

  2. Water Resistance, Hydration Product and Microstructure of Glass Fiber Reinforced Magnesium Oxychloride Cement Exterior Wall Cladding%玻镁外墙挂板的抗水性、水化产物和微观结构

    Institute of Scientific and Technical Information of China (English)

    董金美; 余红发; 刘倩倩; 李颖; 林启红

    2011-01-01

    Bending mechanical properties and deformations in natural state and wet state under water of common and high-performance glass fiber reinforced magnesium oxychloride cement ( GRMC ) exterior wall cladding were tested in this study. Hydration product components and microstructure were observed by X-ray diffraction ( XRD ) and scanning electron microscopy ( SEM). The results indicated that, in wet state under water, the main hydration product 5 ·1 ·8 was hydrolysed, microstructure is destroyed and bending strength is decreased for common GRMC exterior wall cladding. For high-performance GRMC exterior wall cladding with a complex water-repellent admixture and mixed minerals, the main hydration product 3 ·1 ·8 is stable existing in cement matrix and microstructure has been changed little. The sample reveals high water resistance. So, hydration product components and microstructure stability of GRMC exterior wall cladding are important prerequisites for high water resistance.%试验测定了普通玻镁外墙挂板、掺加复合抗水外加剂和矿物掺合料的高性能玻镁外墙挂板在自然和浸水状态下的弯曲力学性能和变形性能,并运用X射线衍射仪(XRD)和扫描电镜(SEM)分析了水化产物的组成和微观结构特征.结果表明:在浸水条件下,普通玻镁外墙挂板的主要水化产物5 ·1·8相发生了分解,破坏了微观结构,导致其抗弯强度降低;而掺加复合抗水外加剂和矿物掺合料的高性能玻镁外墙挂板的水化产物5·1·8相保持稳定,微观结构未发生变化,显示出较高的抗水性.因此,玻镁外墙挂板的水化产物组成和微观结构的稳定性是确保其抗水性的重要前提.

  3. X-Ray diffraction Investigation of Electrochemically Deposited Copper

    DEFF Research Database (Denmark)

    Pantleon, Karen; Jensen, Jens Dahl; Somers, Marcel A.J.

    2004-01-01

    Copper layers were deposited from acidic electrolytes containing different amounts of organic additives, designed for the formation of Cu-interconnect structures. Amorphous Ni-P substrates allow to study the unbiased growth of the electrodeposits. The crystallographic texture was investigated...

  4. Compound Hertzian Chain Model for Copper-Carbon Nanocomposites' Absorption Spectrum

    CERN Document Server

    Kokabi, Alireza; Saeedi, Saman; Moftakharzadeh, Ali; Vesaghi, Mohammad Ali; Fardmanesh, Mehdi

    2011-01-01

    The infrared range optical absorption mechanism of Carbon-Copper composite thin layer coated on the Diamond-Like Carbon (DLC) buffer layer has been investigated. By consideration of weak interactions between copper nanoparticles in their network, optical absorption is modeled using their coherent dipole behavior induced by the electromagnetic radiation. The copper nanoparticles in the bulk of carbon are assumed as a chain of plasmonic dipoles, which have coupling resonance. Considering nearest neighbor interactions for this metallic nanoparticles, surface plasmon resonance frequency ({\\omega}\

  5. Growth of ∼5 cm2V−1s−1 mobility, p-type Copper(I oxide (Cu2O films by fast atmospheric atomic layer deposition (AALD at 225°C and below

    Directory of Open Access Journals (Sweden)

    D. Muñoz-Rojas

    2012-12-01

    Full Text Available Phase pure, dense Cu2O thin films were grown on glass and polymer substrates at 225°C by rapid atmospheric atomic layer deposition (AALD. Carrier mobilities of 5 cm2V−1s−1 and carrier concentrations of ∼1016 cm−3 were achieved in films of thickness 50 - 120 nm, over a >10 cm2 area. Growth rates were ∼1 nm·min−1 which is two orders of magnitude faster than conventional ALD.. The high mobilities achieved using the atmospheric, low temperature method represent a significant advance for flextronics and flexible solar cells which require growth on plastic substrates.

  6. Chinese Copper Manufacturers Expand Overseas

    Institute of Scientific and Technical Information of China (English)

    2013-01-01

    <正>In 2012,China’s apparent copper consumption reached 8.84 million tons,accounting for 43%of the global total demand.Spurred by strong demand,China’s copper smelting capacity roars with annual average growth in domestic copper smelting capacity reaching approx-

  7. Fabrication and Characterization of Metallic Copper and Copper Oxide Nanoflowers

    Directory of Open Access Journals (Sweden)

    *H. S. Virk

    2011-12-01

    Full Text Available Copper nanoflowers have been fabricated using two different techniques; electro-deposition of copper in polymer and anodic alumina templates, and cytyltrimethal ammonium bromide (CTAB-assisted hydrothermal method. Scanning Electron Microscope (SEM images record some interesting morphologies of metallic copper nanoflowers. Field Emission Scanning Electron Microscope (FESEM has been used to determine morphology and composition of copper oxide nanoflowers. X-ray diffraction (XRD pattern reveals the monoclinic phase of CuO in the crystallographic structure of copper oxide nanoflowers. There is an element of random artistic design of nature, rather than science, in exotic patterns of nanoflowers fabricated in our laboratory.

  8. Method for fabrication of ceramic dielectric films on copper foils

    Science.gov (United States)

    Ma, Beihai; Narayanan, Manoj; Dorris, Stephen E.; Balachandran, Uthamalingam

    2015-03-10

    The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250.degree. C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450.degree. C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750.degree. C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired.

  9. Aspects of the SrO-CuO-TiO2 Ternary System Related to the Deposition of SrTiO3 and Copper-Doped SrTiO3 Thin-Film Buffer Layers

    Energy Technology Data Exchange (ETDEWEB)

    Ayala, Alicia [Univ. of New Mexico, Albuquerque, NM (United States)

    2004-12-20

    YBa2Cu3O27-δ (YBCO) coated conductors are promising materials for large-scale superconductivity applications. One version of a YBCO coated conductor is based on ion beam assisted deposition (IBAD) of magnesium oxide (MgO) onto polycrystalline metal substrates. SrTiO3 (STO) is often deposited by physical vapor deposition (PVD) methods as a buffer layer between the YBCO and IBAD MgO due to its chemical stability and lattice mismatch of only ~1.5% with YBCO. In this work, some aspects of the stability of STO with respect to copper (Cu) and chemical solution deposition of STO on IBAD MgO templates were examined. Solubility limits of Cu in STO were established by processing Cu-doped STO powders by conventional bulk preparation techniques. The maximum solubility of Cu in STO was ~1% as determined by transmission electron microscopy (TEM) and Rietveld refinements of x-ray diffraction (XRD) data. XRD analysis, performed in collaboration with NIST, on powder compositions on the STO/SrCuO2 tie line did not identify any ternary phases. SrCu0.10T0.90Oy buffer layers were prepared by pulsed laser deposition (PLD) and CSD on IBAD MgO flexible metallic textured tapes. TEM analysis of a ~100 nm thick SrCu0.10Ti0.90Oy buffer layer deposited by PLD showed a smooth Cu-doped STO/MgO interface. A ~600 nm thick YBCO film, deposited onto the SrCu0.10Ti0.90Oy buffer by PLD, exhibited a Tc of 87 K and critical current density (Jc) of ~1 MA/cm2. STO and Cu-doped STO thin films by CSD were ~30 nm thick. The in plane alignment (FWHM) after deposition of the STO improved by ~1° while it degraded by ~2° with the SrCu0.05TiOy buffer. YBCO was deposited by PLD on the STO and SrCu0.05TiOy buffers. The in plane alignment (FWHM) of the YBCO with the STO buffer layer

  10. Copper and Copper Proteins in Parkinson’s Disease

    Directory of Open Access Journals (Sweden)

    Sergio Montes

    2014-01-01

    Full Text Available Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson’s disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson’s disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson’s disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson’s disease and that a mutation in ATP7B could be associated with Parkinson’s disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology.

  11. The interaction between concrete pavement and corrosion-induced copper runoff from buildings.

    Science.gov (United States)

    Bahar, B; Herting, G; Wallinder, I Odnevall; Hakkila, K; Leygraf, C; Virta, M

    2008-05-01

    Changes in chemical speciation of copper and the capacity of concrete pavement to retain copper in runoff water from external buildings have been investigated at urban field conditions, and in parallel laboratory experiments simulating outdoor scenarios. The research study showed the concrete surface to form a copper rich surface layer ( approximately 50 microm thick) upon exposure, and a high capacity to significantly reduce the bioavailable fraction of released copper (20-95%). The retention capacity of copper varied between 5 and 20% during single runoff events in the laboratory, and between 10 and 40% of the total copper release during single natural runoff events. The capacity to retain and reduce the bioavailable fraction of non-retained copper increased with increasing wetness of the concrete surfaces, increasing pH of the runoff water and decreasing flow rates. Bioassay testing with bacterial and yeast bioreporters showed the bioavailable fraction of non-retained copper to be significantly lower than the total copper concentration in the runoff water, between 22 and 40% for bacteria and between 8 and 31% for yeast. The application of generated data to simulate a fictive outdoor scenario, suggests a significant reduction of bioavailable and total copper to background values during environmental entry as a result of dilution, and the interaction with solid surfaces, organic matter and complexing agents already in the drainage system.

  12. Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration

    Science.gov (United States)

    Mengting, Jiang; Yuling, Liu; Haobo, Yuan; Guodong, Chen; Weijuan, Liu

    2014-11-01

    A novel alkaline copper slurry that possesses a relatively high planarization performance is investigated under a low abrasive concentration. Based on the action mechanism of CMP, the feasibility of using one type of slurry in copper bulk elimination process and residual copper elimination process, with different process parameters, was analyzed. In addition, we investigated the regular change of abrasive concentration effect on copper and tantalum removal rate and within wafer non-uniformity (WIWNU) in CMP process. When the abrasive concentration is 3 wt%, in bulk elimination process, the copper removal rate achieves 6125 Å/min, while WIWNU is 3.5%, simultaneously. In residual copper elimination process, the copper removal rate is approximately 2700 Å/min, while WIWNU is 2.8%. Nevertheless, the tantalum removal rate is 0 Å/min, which indicates that barrier layer isn't eliminated in residual copper elimination process. The planarization experimental results show that an excellent planarization performance is obtained with a relatively high copper removal rate in bulk elimination process. Meanwhile, after residual copper elimination process, the dishing value increased inconspicuously, in a controllable range, and the wafer surface roughness is only 0.326 nm (sq slurry show almost no major differences with two kinds of commercial acid slurries after polishing. All experimental results are conducive to research and improvement of alkaline slurry in the future.

  13. Industrial experiment of copper electrolyte purification by copper arsenite

    Institute of Scientific and Technical Information of China (English)

    ZHENG Ya-jie; XIAO Fa-xin; WANG Yong; LI Chun-hua; XU Wei; JIAN Hong-sheng; MA Yut-ian

    2008-01-01

    Copper electrolyte was purified by copper arsenite that was prepared with As2O3. And electrolysis experiments of purified electrolyte were carried out at 235 and 305 A/m2, respectively. The results show that the yield of copper arsenite is up to 98.64% when the molar ratio of Cu to As is 1.5 in the preparation of copper arsenite. The removal rates of Sb and Bi reach 74.11% and 65.60% respectively after copper arsenite is added in electrolyte. The concentrations of As, Sb and Bi in electrolyte nearly remain constant during electrolysis of 13 d. The appearances of cathode copper obtained at 235 and 305 A/m2 are slippery and even, and the qualification rate is 100% according to the Chinese standard of high-pure cathode copper(GB/T467-97).

  14. Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

    Energy Technology Data Exchange (ETDEWEB)

    Curtis, Calvin J; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S

    2014-11-04

    Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

  15. Reduction and Oxidation of Copper Oxide Thin Films and Thermal Stability Issues in Copper-Based Metallization.

    Science.gov (United States)

    Li, Jian

    This thesis investigates the oxidation and reduction of Cu-oxides and thermal induced reactions of Cu with metals. The combination of ^{16}O( alpha,alpha)^{16}O oxygen resonance and transmission electron microscopy (TEM) provides an effective method of studying the oxidation and reduction of copper oxide thin films. A discontinuous morphology of grain growth of Cu_2O in found in the CuO matrix during reduction. The migration of the Cu_2O-CuO phase boundary is induced by oxygen diffusion along the moving boundary. Grain growth is the dominant process in the transformation from CuO to Cu_2O; nucleation is the dominant process in the reverse transformation, i.e. from Cu_2O to CuO. The reduction and oxidation of copper oxides are asymmetrical; the latter is significantly faster. The metastable phase Cu _4O_3 was formed by ion milling CuO. Carbon and refractory metals such as Ti or Zr can enhance the reduction rate of CuO. Three topics relating to thermal stability issues in Cu-based metallization were investigated: (1) texturing in electroless copper films on epitaxial copper seed layers; (2) predicting first phase formation in Cu/metal bilayer structures; and (3) encapsulation of Cu fine line structures with TiN. (100)- and (111)-textured copper layers were deposited by electroless plating on copper seed layers grown epitaxially on Si (100) and Si (111) substrates, respectively. (111) -textured copper films are more oxidation-resistant. Rutherford backscattering spectrometry (RBS) and in situ transmission electron microscopy (TEM) were used to determine phase formation in Cu-M (M = Ti, Zr, Mg, Sb, Pd and Pt) bilayer systems. An effective heat of formation rule was employed to predict first phase formation in these systems. A TiN-encapsulated copper structure was made by annealing a Cu-10at%Ti alloy film evaporated on a SiO _2/Si(100) substrate at 550^ circC in an NH_3 ambient. Fast heating rates (70^circC/min.) to 550^circC can effectively suppress the formation of Cu

  16. High catalytic activity of oriented 2.0.0 copper(I) oxide grown on graphene film

    Science.gov (United States)

    Primo, Ana; Esteve-Adell, Ivan; Blandez, Juan F.; Dhakshinamoorthy, Amarajothi; Álvaro, Mercedes; Candu, Natalia; Coman, Simona M.; Parvulescu, Vasile I.; García, Hermenegildo

    2015-10-01

    Metal oxide nanoparticles supported on graphene exhibit high catalytic activity for oxidation, reduction and coupling reactions. Here we show that pyrolysis at 900 °C under inert atmosphere of copper(II) nitrate embedded in chitosan films affords 1.1.1 facet-oriented copper nanoplatelets supported on few-layered graphene. Oriented (1.1.1) copper nanoplatelets on graphene undergo spontaneous oxidation to render oriented (2.0.0) copper(I) oxide nanoplatelets on few-layered graphene. These films containing oriented copper(I) oxide exhibit as catalyst turnover numbers that can be three orders of magnitude higher for the Ullmann-type coupling, dehydrogenative coupling of dimethylphenylsilane with n-butanol and C-N cross-coupling than those of analogous unoriented graphene-supported copper(I) oxide nanoplatelets.

  17. Copper content and distribution in vineyard soils of central Serbia

    Directory of Open Access Journals (Sweden)

    Jordana Ninkov

    2014-04-01

    Full Text Available This research studied the copper content of vineyard soils as affected by the long-term use of copper-based fungicides. The soil samples were taken from individual vineyards located in the central region of Serbia, from two depths: 0-30 and 30-60 cm. At the same time, at each site, control samples were collected from a nearby forest in order to determine the background concentrations. The pseudototal (CuT and available (CuEDTA copper content were analysed in 60 soil samples in total, 46 of which represented vineyard soils and 14 control samples. The maximum value of copper was 200.1 mg/kg of pseudototal and 82.1 mg/kg of available copper. Comparison of the copper content in vineyards to the background concentrations of control samples clearly confirmed anthropogenic influence. Out of 46 vineyard soil samples, about one half (22 of them had the CuT concentration above the critical level of 60 mg/kg. Eleven samples had the pseudototal content over the MAC of 100 mg/kg. Anthropogenic influence was also confirmed on the basis of copper bioavailability and copper distribution along the soil profile. Available content of over 50 mg/kg was found in 8 out of 46 analysed samples of vineyard soils. According to the percentage contribution of available CuEDTA to pseudototalCuT, half of the samples were above 36%, which is potentially phytotoxic. The concentration of copper was the highest in the surface layer in the vineyard soil samples. A check of the background Cu levels has shown that the distribution of CuT and CuEDTA is uniform throughout the soil profile. Data from some of the analysed plots indicate that the process of erosion is under way at the site. The soil on lower-lying terrain has been found to be more exposed to copper pollution than the soil of higher terrain. Since copper at the surveyed sites is very persistent and accumulates in a short period of time, focus should be placed on the preventive measures of reducing the use of copper

  18. The Effect of Copper

    African Journals Online (AJOL)

    higher (p<0.05) in the broodfish fed CSD0 and CSD1 diets than the other diets. Exposure of Clarias gariepinus fish to copper in water, at concentrations above 1.0mg CuSO4/g elicits adverse ... introduction of a toxicant to an aquatic system ..... Toxicity of four commonly used agrochemicals on. Oreochromis niloticus (L) fry.

  19. Antibacterial Carbon Nanotubes by Impregnation with Copper Nanostructures

    Science.gov (United States)

    Palza, Humberto; Saldias, Natalia; Arriagada, Paulo; Palma, Patricia; Sanchez, Jorge

    2017-08-01

    The addition of metal-based nanoparticles on carbon nanotubes (CNT) is a relevant method producing multifunctional materials. In this context, CNT were dispersed in an ethanol/water solution containing copper acetate for their impregnation with different copper nanostructures by either a non-thermal or a thermal post-synthesis treatment. Our simple method is based on pure CNT in an air atmosphere without any other reagents. Particles without thermal treatment were present as a well-dispersed layered copper hydroxide acetate nanostructures on CNT, as confirmed by scanning and transmission (TEM) electron microscopies, and showing a characteristic x-ray diffraction peak at 6.6°. On the other hand, by thermal post-synthesis treatment at 300°C, these layered nanostructures became Cu2O nanoparticles of around 20 nm supported on CNT, as confirmed by TEM images and x-ray diffraction peaks. These copper nanostructures present on the CNT surface rendered antibacterial behavior to the resulting hybrid materials against both Staphylococcus aureus and Escherichia coli. These findings present for the first time a simple method for producing antibacterial CNT by direct impregnation of copper nanostructures.

  20. Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability.

    Science.gov (United States)

    Magdassi, Shlomo; Grouchko, Michael; Kamyshny, Alexander

    2010-09-08

    In the past few years, the synthesis of Cu nanoparticles has attracted much attention because of its huge potential for replacing expensive nano silver inks utilized in conductive printing. A major problem in utilizing these copper nanoparticles is their inherent tendency to oxidize in ambient conditions. Recently, there have been several reports presenting various approaches which demonstrate that copper nanoparticles can resist oxidation under ambient conditions, if they are coated by a proper protective layer. This layer may consist of an organic polymer, alkene chains, amorphous carbon or graphenes, or inorganic materials such as silica, or an inert metal. Such coated copper nanoparticles enable achieving high conductivities by direct printing of conductive patterns. These approaches open new possibilities in printed electronics, for example by using copper based inkjet inks to form various devices such as solar cells, Radio Frequency Identification (RFID) tags, and electroluminescence devices. This paper provides a review on the synthesis of copper nanoparticles, mainly by wet chemistry routes, and their utilization in printed electronics.

  1. Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability

    Directory of Open Access Journals (Sweden)

    Shlomo Magdassi

    2010-09-01

    Full Text Available In the past few years, the synthesis of Cu nanoparticles has attracted much attention because of its huge potential for replacing expensive nano silver inks utilized in conductive printing. A major problem in utilizing these copper nanoparticles is their inherent tendency to oxidize in ambient conditions. Recently, there have been several reports presenting various approaches which demonstrate that copper nanoparticles can resist oxidation under ambient conditions, if they are coated by a proper protective layer. This layer may consist of an organic polymer, alkene chains, amorphous carbon or graphenes, or inorganic materials such as silica, or an inert metal. Such coated copper nanoparticles enable achieving high conductivities by direct printing of conductive patterns. These approaches open new possibilities in printed electronics, for example by using copper based inkjet inks to form various devices such as solar cells, Radio Frequency Identification (RFID tags, and electroluminescence devices. This paper provides a review on the synthesis of copper nanoparticles, mainly by wet chemistry routes, and their utilization in printed electronics.

  2. Presenilin promotes dietary copper uptake.

    Directory of Open Access Journals (Sweden)

    Adam Southon

    Full Text Available Dietary copper is essential for multicellular organisms. Copper is redox active and required as a cofactor for enzymes such as the antioxidant Superoxide Dismutase 1 (SOD1. Copper dyshomeostasis has been implicated in Alzheimer's disease. Mutations in the presenilin genes encoding PS1 and PS2 are major causes of early-onset familial Alzheimer's disease. PS1 and PS2 are required for efficient copper uptake in mammalian systems. Here we demonstrate a conserved role for presenilin in dietary copper uptake in the fly Drosophila melanogaster. Ubiquitous RNA interference-mediated knockdown of the single Drosophila presenilin (PSN gene is lethal. However, PSN knockdown in the midgut produces viable flies. These flies have reduced copper levels and are more tolerant to excess dietary copper. Expression of a copper-responsive EYFP construct was also lower in the midgut of these larvae, indicative of reduced dietary copper uptake. SOD activity was reduced by midgut PSN knockdown, and these flies were sensitive to the superoxide-inducing chemical paraquat. These data support presenilin being needed for dietary copper uptake in the gut and so impacting on SOD activity and tolerance to oxidative stress. These results are consistent with previous studies of mammalian presenilins, supporting a conserved role for these proteins in mediating copper uptake.

  3. Dynamic Shock Compression of Copper to Multi-Megabar Pressure

    Science.gov (United States)

    Haill, T. A.; Furnish, M. D.; Twyeffort, L. L.; Arrington, C. L.; Lemke, R. W.; Knudson, M. D.; Davis, J.-P.

    2015-11-01

    Copper is an important material for a variety of shock and high energy density applications and experiments. Copper is used as a standard reference material to determine the EOS properties of other materials. The high conductivity of copper makes it useful as an MHD driver layer in high current dynamic materials experiments on Sandia National Laboratories Z machine. Composite aluminum/copper flyer plates increase the dwell time in plate impact experiments by taking advantage of the slower wave speeds in copper. This presentation reports on recent efforts to reinstate a composite Al/Cu flyer capability on Z and to extend the range of equation-of-state shock compression data through the use of hyper-velocity composite flyers and symmetric planar impact with copper targets. We will present results from multi-dimensional ALEGRA MHD simulations, as well as experimental designs and methods of composite flyer fabrication. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Company, for the U.S. DOE's National Nuclear Security Administration under contract DE-AC04-94AL85000.

  4. Comparative characteristics of copper, copper chloride, and copper bromide vapor lasers

    Energy Technology Data Exchange (ETDEWEB)

    Kazarian, M.A.; Petrash, G.G.; Trofimov, A.N.

    1980-03-01

    The paper reports the results of a comparative study of copper and copper halide vapor lasers emitting in a repetitively-pulsed regime. Copper chloride and copper bromide vapor lasers are found to have identical lasing characteristics under any excitation conditions. These characteristics are different from those of a copper vapor laser. An average lasing power of 13 W has been obtained for all lasers studied for an efficiency of 1%. It is shown that the choice of a laser will largely depend on the laser design suitability for a specific application.

  5. Number of CuO{sub 2} layers dependence of magnetic quantum criticality in homogeneously doped high-T{sub c} copper oxides: A {sup 63}Cu-NMR study on four-layered high-T{sub c} compounds HgBa{sub 2}Ca{sub 3}Cu{sub 4}O{sub 8+y}

    Energy Technology Data Exchange (ETDEWEB)

    Itohara, Keita, E-mail: itohara@nmr.mp.es.osaka-u.ac.j [Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8531 (Japan); Shimizu, Sunao; Mukuda, Hidekazu; Kitaoka, Yoshio [Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8531 (Japan); Shirage, Parasharam M.; Kito, Hijiri; Iyo, Akira [National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305-8568 (Japan)

    2010-12-15

    We report {sup 63}Cu-NMR/NQR studies on Hg-based four-layered compounds HgBa{sub 2}Ca{sub 3}Cu{sub 4} O{sub 8+y} (Hg-1234) with T{sub c}=123, 110, and 95 K. The {sup 63}Cu Knight shift measurements have revealed that the carrier density (N{sub h}) monotonously decreases with decreasing T{sub c}. Although static magnetic order was not observed at N{sub h}=0.15 for the IP with T{sub c}=95K, it was revealed that antiferromagnetic correlations critically develop, preventing from observing the NMR spectrum below {approx}200 K far above T{sub c}. Thus, we deduce that a magnetic quantum critical point, where an AFM order collapses, may exist at slightly less than N{sub h{approx}}0.15 in the Hg-based four-layered compounds, which is lower than that in Hg-based five-layered compounds, N{sub h{approx}}0.17. This result suggests that a magnetic interlayer coupling, which stabilizes an AFM order, becomes weaker in the four-layered compounds than in five-layered compounds.

  6. Investigation of Aluminum-Copper Tube Hydroforming with Axial Feeding

    Science.gov (United States)

    Parto D., M.; Seyedkashi, S. M. H.; Liaghat, Gh.; Naeini, H. Moslemi; Panahizadeh R., V.

    2011-01-01

    Hydroforming of a two-layered Aluminum-Copper tube is investigated numerically and experimentally. Pressure is applied through a nonlinear path along with symmetrical axial feeding. ABAQUS/Explicit commercial code is used for finite element simulation of the process. ASTM C11000 Copper alloy is used as inner layer and ASTM AA1050A Aluminum alloy is used as outer layer. The simulation results show that the part can be successfully formed under internal pressure of 40 MPa with 8 mm axial displacement. Stress distributions on both inner and outer tubes are compared and maximum thinning on their wall is also discussed. Different friction conditions are applied on the process using different coefficients of friction and their effects are investigated on thinning percentage of inner and outer tubes and also on axial feeding. It is observed that finite element results are in good agreement with experimental results.

  7. Method for fabrication of ceramic dielectric films on copper foils

    Energy Technology Data Exchange (ETDEWEB)

    Ma, Beihai; Narayanan, Manoj; Dorris, Stephen E.; Balachandran, Uthamalingam

    2017-06-14

    The present invention provides copper substrate coated with a lead-lanthanum-zirconium-titanium (PLZT) ceramic film, which is prepared by a method comprising applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250.degree. C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450.degree. C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750.degree. C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas.

  8. Production of ultrahigh purity copper using waste copper nitrate solution.

    Science.gov (United States)

    Choi, J Y; Kim, D S

    2003-04-25

    The production of ultrahigh purity copper (99.9999%) by electrolysis in the presence of a cementation barrier has been attempted employing a waste nitric copper etching solution as the electrolyte. The amount of copper deposited on the cathode increased almost linearly with electrolysis time and the purity of copper was observed to increase as the electrolyte concentration was increased. At some point, however, as the electrolyte concentration increased, the purity of copper decreased slightly. As the total surface area of cementation barrier increased, the purity of product increased. The electrolyte temperature should be maintained below 35 degrees C in the range of investigated electrolysis conditions to obtain the ultrahigh purity copper. Considering that several industrial waste solutions contain valuable metallic components the result of present study may support a claim that electrowinning is a very desirable process for their treatment and recovery.

  9. A laboratory study of the effect of acetic acid vapor on atmospheric copper corrosion

    Energy Technology Data Exchange (ETDEWEB)

    Lopez-Delgado, A.; Cano, E.; Bastidas, J.M.; Lopez, F.A. [Centro Nacional de Investigaciones Metalurgicas, Madrid (Spain)

    1998-12-01

    A study was made of the copper corrosion rate and corrosion products originated by the action of acetic acid vapor at 100% relative humidity. Copper plates were exposed to an acetic acid contaminated atmosphere for a period of 21 days. Five acetic vapor concentration levels were used. The copper corrosion rate was in the range of 1 to 23 mg/dm{sup 2} day. The corrosion-product layers were characterized using electrochemical, X-ray powder diffraction, Fourier transform infrared spectrometry, and scanning electron microscopy techniques. Thermal and calorimetric studies were also performed. Some of the compounds identified were cuprite (Cu{sub 2}O), copper acetate hydrate [Cu(CH{sub 3}COO){sub 2}{center_dot}2H{sub 2}O], and copper hydroxide acetate [Cu{sub 4}(OH)(CH{sub 3}COO){sub 7}{center_dot}2H{sub 2}O]. This last compound was also characterized. The thickness of the patina layers was 4 to 8 nm for amorphous cuprite, 11 to 48 nm for cuprite, and 225 nm for copper acetate. The patina, in which the cementation process of different corrosion-product layers plays an important role, is formed by the reaction of acetic vapor with copper through porous cuprite paths.

  10. Oxalic acid based chemical systems for electrochemical mechanical planarization of copper

    Science.gov (United States)

    Lowalekar, Viral Pradeep

    In an ECMP process, a wafer is anodically baised during polishing. The electrical potential is the driving force to oxidize copper metal to ions. Copper ions then react with chemistry in the electrolyte to go in solution or form a passivation layer on the surface. The passivation layer is removed by a very low downforce (0.5--1 psi), causing copper to electrochemically dissolve in solution. Passive film formation during copper ECMP is key to the success of this process, since passivation reduces dissolution in the recessed areas, while elevations on the copper surface in direct contact with the ECMP pad are electrochemically planarized. If no passive film forms, then copper removal will be conformal from the elevated and recessed areas, and planarity will be lost. Chemical formulations for the electrochemical mechanical planarization (ECMP) of copper must contain constituents that are stable at anodic potentials. A key component of the formulation is a corrosion inhibitor, which is required to protect low lying areas while higher areas are selectively removed. Organic compounds, which adsorb on copper at low overpotentials and form a film by oxidation at higher overpotentials, may be particularly useful for ECMP. The main goal of the research reported in this dissertation is to understand and develop oxalic acid-based chemical systems suitable for ECMP of copper through electrochemical and surface investigations. Special attention was paid to the development of an inhibitor, which can function under applied potential conditions. Physical methods such as profilometry and four point probe were used to obtain copper removal rates. An organic compound, thiosalicylic acid (TSA), was identified and tested as a potential corrosion inhibitor for copper. TSA offers better protection than the conventionally used benzotriazole (BTA) by oxidizing at high anodic potentials to form a passive film on the copper surface. The passive film formed on the copper surface by addition of

  11. Tongling:Copper Industry Giant Takes Shape

    Institute of Scientific and Technical Information of China (English)

    2011-01-01

    <正>Centering on the strategic goal of building "World Copper Capital", Tongling constantly extends its product lines and improves the copper industry chain. Now, the copper industry with a production value of RMB 100 billion has taken shape.As the largest copper wire rod manufacturer in Asia, Tongling Quanwei Copper Technologies Co., Ltd., upon its moving into the local market,

  12. Multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates.

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Ken Shuang

    2004-11-01

    This report documents the author's efforts in the deterministic modeling of copper-sulfidation corrosion on non-planar substrates such as diodes and electrical connectors. A new framework based on Goma was developed for multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates. In this framework, the moving sulfidation front is explicitly tracked by treating the finite-element mesh as a pseudo solid with an arbitrary Lagrangian-Eulerian formulation and repeatedly performing re-meshing using CUBIT and re-mapping using MAPVAR. Three one-dimensional studies were performed for verifying the framework in asymptotic regimes. Limited model validation was also carried out by comparing computed copper-sulfide thickness with experimental data. The framework was first demonstrated in modeling one-dimensional copper sulfidation with charge separation. It was found that both the thickness of the space-charge layers and the electrical potential at the sulfidation surface decrease rapidly as the Cu{sub 2}S layer thickens initially but eventually reach equilibrium values as Cu{sub 2}S layer becomes sufficiently thick; it was also found that electroneutrality is a reasonable approximation and that the electro-migration flux may be estimated by using the equilibrium potential difference between the sulfidation and annihilation surfaces when the Cu{sub 2}S layer is sufficiently thick. The framework was then employed to model copper sulfidation in the solid-state-diffusion controlled regime (i.e. stage II sulfidation) on a prototypical diode until a continuous Cu{sub 2}S film was formed on the diode surface. The framework was also applied to model copper sulfidation on an intermittent electrical contact between a gold-plated copper pin and gold-plated copper pad; the presence of Cu{sub 2}S was found to raise the effective electrical resistance drastically. Lastly, future research needs in modeling atmospheric copper sulfidation are discussed.

  13. Spray pyrolysed Cu2ZnSnS4/In2S3 thin film solar cell: Effect of varying copper concentration on cell parameters

    Science.gov (United States)

    Menon, M. R. Rajesh; Rajeshmon, V. G.; Thomas, Titu; Kartha, C. Sudha; Vijayakumar, K. P.

    2016-05-01

    A double layer Cu2ZnSnS4 absorber was employed for the first time to improve the performance of spray pyrolysed Cu2ZnSnS4/In2S3 thin film solar cell. Copper concentration in the two layers of Cu2ZnSnS4 was adjusted and effect on performance parameters was studied. It was observed that higher copper concentration in the absorber layer adjacent to the electrode is beneficial for device performance, whereas, lower copper concentration in absorber layer near to the junction has detrimental effect on the device properties.

  14. Influence of oxygen, albumin and pH on copper dissolution in a simulated uterine fluid.

    Science.gov (United States)

    Bastidas, D M; Cano, E; Mora, E M

    2005-06-01

    The aim of this paper is to study the influence of albumin content, from 5 to 45 g/L, on copper dissolution and compounds composition in a simulated uterine solution. Experiments were performed in atmospheric pressure conditions and with an additional oxygen pressure of 0.2 atmospheres, at 6.3 and 8.0 pH values, and at a temperature of 37 +/- 0.1 degrees C for 1, 3, 7, and 30 days experimentation time. The copper dissolution rate has been determined using absorbance measurements, finding the highest value for pH 8.0, 35 g/L albumin, and with an additional oxygen pressure of 0.2 atmospheres: 674 microg/day for 1 day, and 301 microg/day for 30 days. X-ray photoelectron spectroscopy (XPS) results show copper(II) as the main copper oxidation state at pH 8.0; and copper(I) and metallic copper at pH 6.3. The presence of albumin up to 35 g/L, accelerates copper dissolution. For high albumin content a stabilisation on the copper dissolution takes place. Corrosion product layer morphology is poorly protective, showing paths through which copper ions can release.

  15. Kinetics of copper ion absorption by cross-linked calcium polyacrylate membranes

    Science.gov (United States)

    Philipp, W. H.; May, C. E.

    1983-01-01

    The absorption of copper ions from aqueous copper acetate solutions by cross-linked calcium acrylate membranes was found to obey parabolic kinetics similar to that found for oxidation of metals that form protective oxide layers. For pure calcium polyacrylate membranes the rate constant was essentially independent of copper acetate concentration and film thickness. For a cross-linked copolymer film of polyvinyl alcohol and calcium polyacrylate, the rate constant was much greater and dependent on the concentration of copper acetate. The proposed mechanism in each case involves the formation of a copper polyacrylate phase on the surface of the membrane. The diffusion of the copper ion through this phase appears to be the rate controlling step for the copolymer film. The diffusion of the calcium ion is apparently the rate controlling step for the calcium polyacrylate. At low pH, the copper polyacrylate phase consists of the normal copper salt; at higher pH, the phase appears to be the basic copper salt.

  16. Electron emission from a double-layer metal under femtosecond laser irradiation

    Energy Technology Data Exchange (ETDEWEB)

    Li, Shuchang; Li, Suyu; Jiang, Yuanfei; Chen, Anmin, E-mail: amchen@jlu.edu.cn; Ding, Dajun; Jin, Mingxing, E-mail: mxjin@jlu.edu.cn

    2015-01-01

    In this paper we theoretically investigate electron emission during femtosecond laser ablation of single-layer metal (copper) and double-layer structures. The double-layer structure is composed of a surface layer (copper) and a substrate layer (gold or chromium). The calculated results indicate that the double-layer structure brings a change to the electron emission from the copper surface. Compared with the ablation of a single-layer, a double-layer structure may be helpful to decrease the relaxation time of the electron temperature, and optimize the electron emission by diminishing the tailing phenomenon under the same absorbed laser fluence. With the increase of the absorbed laser fluence, the effect of optimization becomes significant. This study provides a way to optimize the electron emission which can be beneficial to generate laser induced ultrafast electron pulse sources.

  17. Direct Production of Copper

    Science.gov (United States)

    Victorovich, G. S.; Bell, M. C.; Diaz, C. M.; Bell, J. A. E.

    1987-09-01

    The use of commercially pure oxygen in flash smelting a typical chalcopyrite concentrate or a low grade comminuted matte directly to copper produces a large excess of heat. The heat balance is controlled by adjusting the calorific value of the solid feed. A portion of the sulfide material is roasted to produce a calcine which is blended with unroasted material, and the blend is then autogeneously smelted with oxygen and flux directly to copper. Either iron silicate or iron calcareous slags are produced, both being subject to a slag cleaning treatment. Practically all of the sulfur is contained in a continuous stream of SO2 gas, most of which is strong enough for liquefaction. A particularly attractive feature of these technologies is that no radically new metallurgical equipment needs to be developed. The oxygen smelting can be carried out not only in the Inco type flash furnace but in other suitable smelters such as cyclone furnaces. Another major advantage stems from abolishion of the ever-troublesome converter aisle, which is replaced with continuous roasting of a fraction of the copper sulfide feed.

  18. Hindered rotation of a copper phthalocyanine molecule on C60 : Experiments and molecular mechanics calculations

    NARCIS (Netherlands)

    Fendrich, M.; Wagner, Th.; Stöhr, M.; Möller, R.

    2006-01-01

    If copper phthalocyanine (CuPc) molecules are deposited on a Au(111) surface covered with a monolayer of C60, the molecules are found to adsorb individually onto the close-packed layer of C60. As the adsorption site of the CuPc is not symmetric with respect to the underlying C60 layer, the CuPc mole

  19. Hindered rotation of a copper phthalocyanine molecule on C60 : Experiments and molecular mechanics calculations

    NARCIS (Netherlands)

    Fendrich, M.; Wagner, Th.; Stöhr, M.; Möller, R.

    2006-01-01

    If copper phthalocyanine (CuPc) molecules are deposited on a Au(111) surface covered with a monolayer of C60, the molecules are found to adsorb individually onto the close-packed layer of C60. As the adsorption site of the CuPc is not symmetric with respect to the underlying C60 layer, the CuPc

  20. Laser forming of structures of zinc oxide on a surface of products from copper alloys

    Science.gov (United States)

    Abramov, D. V.; Gorudko, T. N.; Koblov, A. N.; Nogtev, D. S.; Novikova, O. A.

    Laser formation of a protective zinc oxide layer on a surface of products from copper alloys is present. This layer is formed with using of carbon nanotubes. Destructions of the basic material are avoided or minimized at laser nanostructuring of product surfaces. Such laser processing can be made repeatedly. Offered covering have self-clearing and water-repellent properties.

  1. Copper corrosion experiments under anoxic conditions

    Energy Technology Data Exchange (ETDEWEB)

    Ollila, Kaija [VTT Technical Research Centre of Finland, Espoo (Finland)

    2013-06-15

    This report gives results from the corrosion experiments with copper under anoxic conditions. The objective was to study whether hydrogen-evolving corrosion reaction could occur. Copper foil samples were exposed in deaerated deionized water in Erlenmeyer flasks in the glove box with inert atmosphere. Four corrosion experiments (Cu1, Cu2, Cu3 and Cu4) were started, as well as a reference test standing in air. Cu1 and Cu2 had gas tight seals, whereas Cu3 and Cu4 had palladium foils as hydrogen permeable enclosure. The test vessels were stored during the experiments in a closed stainless steel vessel to protect them from the trace oxygen of the gas atmosphere and light. After the reaction time of three and a half years, there were no visible changes in the copper surfaces in any of the tests in the glove box, in contrast the Cu surfaces looked shiny and unaltered. The Cu3 test was terminated after the reaction time of 746 days. The analysis of the Pd-membrane showed the presence of H2 in the test system. If the measured amount of 7.2{center_dot}10{sup 5} mol H{sub 2} was the result of formation of Cu{sub 2}O this would correspond to a 200 nm thick corrosion layer. This was not in agreement with the measured layer thickness with SIMS, which was 6{+-}1 nm. A clear weight loss observed for the Cu3 test vessel throughout the test period suggests the evaporation of water through the epoxy sealing to the closed steel vessel. If this occurred, the anaerobic corrosion of steel surface in humid oxygen-free atmosphere could be a source of hydrogen. A similar weight loss was not observed for the parallel test (Cu4). The reference test standing in air showed visible development of corrosion products.

  2. Relative bioavailability of copper in tribasic copper chloride to copper in copper sulfate for laying hens based on egg yolk and feather copper concentrations.

    Science.gov (United States)

    Kim, J W; Kim, J H; Shin, J E; Kil, D Y

    2016-07-01

    This experiment was conducted to determine the relative bioavailability (RBV) of Cu in tribasic copper chloride (TBCC) to Cu in copper sulfate (monohydrate form; CuSO4·H2O) for layer diets based on egg yolk and feather Cu concentrations. A total of 252, 72-wk-old Hy-Line Brown laying hens were allotted to 1 of 7 treatments with 6 replicates consisting of 6 hens per replicate in a completely randomized design. Hens were fed corn-soybean meal-based basal diets supplemented with 0 (basal), 100, 200, or 300 mg/kg Cu from CuSO4 or TBCC for 4 wk. Results indicated that egg production, egg weight, and egg mass were not affected by dietary treatments. However, increasing inclusion levels of Cu in diets from CuSO4 decreased (P hens fed diets containing CuSO4 than for hens fed diets containing TBCC. The values for the RBV of Cu in TBCC to Cu in CuSO4 based on log10 transformed egg yolk and feather Cu concentrations were 107.4% and 69.5%, respectively. These values for the RBV of Cu in TBCC did not differ from Cu in CuSO4 (100%). The RBV measured in egg yolk did not differ from the RBV measured in feather. In conclusion, the RBV of Cu in TBCC to Cu in CuSO4 can be determined using Cu concentrations of egg yolk and feathers although the values depend largely on target tissues of laying hens. For a practical application, however, the RBV value of Cu in TBCC to Cu in CuSO4 could be 88.5% when the RBV values determined using egg yolk and feather Cu concentrations were averaged.

  3. Model for the electrostatic response of the copper{endash}water interface

    Energy Technology Data Exchange (ETDEWEB)

    Walbran, S.; Mazzolo, A.; Halley, J.W. [School of Physics and Astronomy, University of Minnesota, Minneapolis, Minnesota 55455 (United States); Price, D.L. [Physics Department, University of Memphis, Memphis, Tennessee 38152 (United States)

    1998-11-01

    We present a model for the electrostatic response of the copper{endash}water interface, which takes into account the electronic, Stern layer, and double layer contributions. The electronic and Stern layer contributions are not separated, but are modeled together using a direct dynamics model of the copper{endash}water interface which we introduced earlier. The boundary condition for the double layer contribution is chosen to be consistent with electric fields calculated explicitly from the molecular dynamics simulation. We find results which are consistent with some experimental results for the capacitance of the low-index surfaces of copper. A remarkable feature of the results is that the calculated macroscopic electric field is much more effectively screened near the interface than it is in classical molecular dynamics models. {copyright} {ital 1998 American Institute of Physics.}

  4. Unsupported single-atom-thick copper oxide monolayers

    Science.gov (United States)

    Yin, Kuibo; Zhang, Yu-Yang; Zhou, Yilong; Sun, Litao; Chisholm, Matthew F.; Pantelides, Sokrates T.; Zhou, Wu

    2017-03-01

    Oxide monolayers may present unique opportunities because of the great diversity of properties of these materials in bulk form. However, reports on oxide monolayers are still limited. Here we report the formation of single-atom-thick copper oxide layers with a square lattice both in graphene pores and on graphene substrates using aberration-corrected scanning transmission electron microscopy. First-principles calculations find that CuO is energetically stable and its calculated lattice spacing matches well with the measured value. Furthermore, free-standing copper oxide monolayers are predicted to be semiconductors with band gaps ∼3 eV. The new wide-bandgap single-atom-thick copper oxide monolayers usher a new frontier to study the highly diverse family of two-dimensional oxides and explore their properties and their potential for new applications.

  5. Preparation and characterization of copper-doped cobalt oxide electrodes.

    Science.gov (United States)

    Rosa-Toro, A La; Berenguer, R; Quijada, C; Montilla, F; Morallón, E; Vazquez, J L

    2006-11-30

    Cobalt oxide (Co3O4) and copper-doped cobalt oxide (CuxCo(3-x)O4) films have been prepared onto titanium support by the thermal decomposition method. The electrodes have been characterized by different techniques such as cyclic voltammetry, scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy (XPS). The effect on the electrochemical and crystallographic properties and surface morphology of the amount of copper in the oxide layer has been analyzed. The XPS spectra correspond to a characteristic monophasic Cu-Co spinel oxides when x is below 1. However, when the copper content exceeds that for the stoichiometric CuCo2O4 spinel, a new CuO phase segregates at the surface. The analysis of the surface cation distribution indicates that Cu(II) has preference for octahedral sites.

  6. Mechanochemical reactions on copper-based compounds

    NARCIS (Netherlands)

    Castricum, H.L.; Bakker, H.; Poels, E.K.

    1999-01-01

    Mechanochemical reactions of copper and copper oxides with oxygen and carbon dioxide are discussed, as well as decomposition and reduction of copper compounds by mechanical milling under high-vacuum conditions.

  7. Oxidation Mechanism of Copper Selenide

    Science.gov (United States)

    Taskinen, Pekka; Patana, Sonja; Kobylin, Petri; Latostenmaa, Petri

    2014-09-01

    The oxidation mechanism of copper selenide was investigated at deselenization temperatures of copper refining anode slimes. The isothermal roasting of synthetic, massive copper selenide in flowing oxygen and oxygen - 20% sulfur dioxide mixtures at 450-550 °C indicate that in both atmospheres the mass of Cu2Se increases as a function of time, due to formation of copper selenite as an intermediate product. Copper selenide oxidises to copper oxides without formation of thick copper selenite scales, and a significant fraction of selenium is vaporized as SeO2(g). The oxidation product scales on Cu2Se are porous which allows transport of atmospheric oxygen to the reaction zone and selenium dioxide vapor to the surrounding gas. Predominance area diagrams of the copper-selenium system, constructed for selenium roasting conditions, indicate that the stable phase of copper in a selenium roaster gas with SO2 is the sulfate CuSO4. The cuprous oxide formed in decomposition of Cu2Se is further sulfated to CuSO4.

  8. Copper and copper-nickel-alloys - An overview

    Energy Technology Data Exchange (ETDEWEB)

    Klassert, Anton; Tikana, Ladji [Deutsches Kupferinstitut e.V. Am Bonneshof 5, 40474 Duesseldorf (Germany)

    2004-07-01

    With the increasing level of industrialization the demand for and the number of copper alloys rose in an uninterrupted way. Today, the copper alloys take an important position amongst metallic materials due to the large variety of their technological properties and applications. Nowadays there exist over 3.000 standardized alloys. Copper takes the third place of all metals with a worldwide consumption of over 15 millions tons per year, following only to steel and aluminum. In a modern industrial society we meet copper in all ranges of the life (electro-technology, building and construction industry, mechanical engineering, automotive, chemistry, offshore, marine engineering, medical applications and others.). Copper is the first metal customized by humanity. Its name is attributed to the island Cyprus, which supplied in the antiquity copper to Greece, Rome and the other Mediterranean countries. The Romans called it 'ore from Cyprus' (aes cyprium), later cuprum. Copper deposited occasionally also dapper and could be processed in the recent stone age simply by hammering. Already in early historical time copper alloys with 20 to 50 percent tin was used for the production of mirrors because of their high reflecting power. Although the elementary nickel is an element discovered only recently from a historical perspective, its application in alloys - without any knowledge of the alloy composition - occurred at least throughout the last 2.000 years. The oldest copper-nickel coin originates from the time around 235 B.C.. Only around 1800 AD nickel was isolated as a metallic element. In particular in the sea and offshore technology copper nickel alloys found a broad field of applications in piping systems and for valves and armatures. The excellent combination of characteristics like corrosion resistance, erosion stability and bio-fouling resistance with excellent mechanical strength are at the basis of this success. An experience of many decades supports the use

  9. Obtenção de filmes espessos de seleneto de cobre sobre carbono vítreo, ouro, titânio e cobre Obtaining copper selenide thick films on vitreous carbon, gold, titanium and copper

    OpenAIRE

    Adriano César Rabelo; Tatiane Moraes Arantes; Otávio Luiz Bottecchia

    2007-01-01

    Copper selenide (berzelianite) films were prepared on the title substrates using the chemical bath deposition technique (CBD). Film composition was determined by energy dispersion of x-rays. The kinetics of film growth is parabolic and film adherence limits the film thickness. On titanium, copper selenide forms islands that do not completely cover the surface, unless the substrate is prepared with a tin oxide layer; film composition also depends on the titanium oxide layer. On vitreous carbon...

  10. Biochar and compost as amendments in copper-enriched vineyard soils - stabilization or mobilization of copper?

    Science.gov (United States)

    Soja, Gerhard; Fristak, Vladimir; Wimmer, Bernhard; Bell, Stephen; Chamier Glisczinski, Julia; Pardeller, Georg; Dersch, Georg; Rosner, Franz; Wenzel, Walter; Zehetner, Franz

    2016-04-01

    Copper is an important ingredient for several fungicides that have been used in agriculture. For organic viticulture, several diseases as e.g. downy mildew (Plasmopara viticola) can only be antagonized with Cu-containing fungicides. This long-lasting dependence on Cu-fungicides has led to a gradual Cu enrichment of vineyard soils in traditional wine-growing areas, occasionally exceeding 300 mg/kg. Although these concentrations do not affect the vines or wine quality, they may impair soil microbiological functions in the top soil layer or the root growth of green cover plants. Therefore measures are demanded that reduce the bioavailability of copper, thereby reducing the ecotoxicological effects. The use of biochar and compost as soil amendment has been suggested as a strategy to immobilize Cu and reduce the exchangeable fractions. This study consisted of lab and greenhouse experiments that were designed to test the sorption and desorption behavior of copper in vineyard soils with or without biochar and/or compost as soil amendment. Slightly acidic soils (pHalkaline soils. The analyses of leachate waters of microlysimeter experiments showed that the biochar effects were more evident for a reduction of the ionic form Cu2+ than for total soluble copper, even in alkaline soils. Biochar modified with citric or tartaric acid did not significantly decrease the solubility of copper based on total dissolved concentrations although CEC was higher than in unmodified biochar. Treatments consisting of compost only or that had an equal amount of compost and biochar rather had a mobilizing effect on biochar. Sorption experiments with different DOC concentrations and biochar, however, showed a positive effect on copper sorption. Apparently in vineyard soils the predisposition to form organic-Cu-complexes may outbalance the binding possibilities of these complexes to biochar, occasionally resulting in enhanced mobilization. Presumably immobilization of copper with biochar would

  11. Removal of copper from ferrous scrap

    Science.gov (United States)

    Blander, Milton; Sinha, Shome N.

    1990-01-01

    A process for removing copper from ferrous or other metal scrap in which the scrap is contacted with a polyvalent metal sulfide slag in the presence of an excess of copper-sulfide forming additive to convert the copper to copper sulfide which is extracted into the slag to provide a ratio of copper in the slag to copper in the metal scrap of at least about 10.

  12. Variations of serum copper values in pregnancy

    OpenAIRE

    Vukelić Jelka; Kapamadžija Aleksandra; Petrović Đorđe; Grujić Zorica; Novakov-Mikić Aleksandra; Kopitović Vesna; Bjelica Artur

    2012-01-01

    Introduction. Copper is essential micronutrient and has an important role in the human body. The serum copper increases during pregnancy and is doubled at full term. Lower levels of serum copper in pregnancy are connected with some pathological conditions. Objective. The aim of this study was to estimate the levels of serum copper in normal and pathological pregnancies, comparing them with values of serum copper in non-pregnant women, to determine if serum copper is lower in some pathol...

  13. Copper/bamboo fabric composite prepared via a silver catalytic electroless deposition process for electromagnetic shielding

    Energy Technology Data Exchange (ETDEWEB)

    Liang, Qian; Lu, Yinxiang [Fudan Univ., Shanghai (China). Dept. of Materials Science

    2013-09-15

    Copper/bamboo fabric composite prepared via a silver catalytic electroless plating process is reported. The microstructure of the composite was analyzed by means of scanning electron microscopy, which illustrated that the copper coating was composed of spherical particles and clusters. The composition and chemical state of the metal layer were measured using X-ray diffraction and energy-dispersive X-ray analysis spectra; copper and a small amount of nickel were detected. Mechanical properties were measured based on a standard (ISO 13934-1:1999) for the fabrics with and without copper coating. The breaking force for the composite was improved by about 16.8% compared to uncoated bamboo fabric. The electromagnetic interference shielding effectiveness of the composite was more than 40 dB at frequencies ranging from 0.2 to 1000MHz. The copper coating on bamboo fabric passed the Scotch {sup registered} -tape test. (orig.)

  14. Nickel, copper and cobalt coalescence in copper cliff converter slag

    Directory of Open Access Journals (Sweden)

    Wolf A.

    2016-01-01

    Full Text Available The aim of this investigation is to assess the effect of various additives on coalescence of nickel, copper and cobalt from slags generated during nickel extraction. The analyzed fluxes were silica and lime while examined reductants were pig iron, ferrosilicon and copper-silicon compound. Slag was settled at the different holding temperatures for various times in conditions that simulated the industrial environment. The newly formed matte and slag were characterized by their chemical composition and morphology. Silica flux generated higher partition coefficients for nickel and copper than the addition of lime. Additives used as reducing agents had higher valuable metal recovery rates and corresponding partition coefficients than fluxes. Microstructural studies showed that slag formed after adding reductants consisted of primarily fayalite, with some minute traces of magnetite as the secondary phase. Addition of 5 wt% of pig iron, ferrosilicon and copper-silicon alloys favored the formation of a metallized matte which increased Cu, Ni and Co recoveries. Addition of copper-silicon alloys with low silicon content was efficient in copper recovery but coalescence of the other metals was low. Slag treated with the ferrosilicon facilitated the highest cobalt recovery while copper-silicon alloys with silicon content above 10 wt% resulted in high coalescence of nickel and copper, 87 % and 72 % respectively.

  15. Study of Copper Substitute in High Copper Price Market Environment

    Institute of Scientific and Technical Information of China (English)

    2011-01-01

    <正>The high price of copper drives up industry cost,also it is difficult for terminal products to raise price to transfer the cost pressure brought by increase in copper price,as a result downstream consumption markets instead try to seek

  16. Fixation Property of Copper Triazole Wood Preservatives

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    According to AWPA E11-2006 standard,copper fixation rates of several copper-based formulations,such as ammoniacal copper,amine copper,and ammoniacal-ethanolamine copper,as well as alkaline copper quaternary(ACQ),were tested and compared in this paper.And the fixation rates of tebuconazole(TEB) and propiconazole(PPZ) in several formulations,such as copper azole,emulsified type and solvent type,were also compared.The determination of copper content in the leachate was analyzed by atomic absorption spectrom...

  17. INTERACTION OF COPPER BASED PRESERVATIVES WITH WOOD

    Directory of Open Access Journals (Sweden)

    Ali Temiz

    2004-11-01

    Full Text Available Copper is highly toxic to fungi and the element is widely used in many preservative formulations over 50 years. The interactions of wood and copper-based preservatives impact both the performance and the environment aspects of treated wood. Copper might be present in treated wood as coppercellulose complex, copper-lignin complex, and crystalline or amorphous inorganic/organic copper compounds. In this review; it was aimed to investigate the interactions of wood and copper-based preservatives, Copper Adsorpsion factors and copper forms in treated wood

  18. Electroleaching of Copper Waste with Recovery of Copper by Electrodialysis

    Directory of Open Access Journals (Sweden)

    Nuñez P.

    2013-04-01

    Full Text Available A new process to leach and recover copper from solid waste using electric fields was designed. The leaching with electro migration is presented as an alternative to traditional leaching. Preliminary data indicate that the copper ion migration is facilitated by using the electrical potential difference; therefore applying a potential difference in the processes of leaching facilitates the removal of copper. This is especially useful when mineral concentrations are very low. Different phenomena associated with transport of copper in solution are studied to generate a model able predict the state of the copper ion concentration in time. A kinetic model for the process was developed and fitted very well the experimental data.

  19. Synthesis of copper/copper oxide nanoparticles by solution plasma

    Science.gov (United States)

    Saito, Genki; Hosokai, Sou; Tsubota, Masakatsu; Akiyama, Tomohiro

    2011-07-01

    This paper describes the synthesis of copper/copper oxide nanoparticles via a solution plasma, in which the effect of the electrolyte and electrolysis time on the morphology of the products was mainly examined. In the experiments, a copper wire as a cathode was immersed in an electrolysis solution of a K2CO3 with the concentration from 0.001 to 0.50 M or a citrate buffer (pH = 4.8), and was melted by the local-concentration of current. The results demonstrated that by using the K2CO3 solution, we obtained CuO nanoflowers with many sharp nanorods, the size of which decreased with decreasing the concentration of the solution. Spherical particles of copper with/without pores formed when the citrate buffer was used. The pores in the copper nanoparticles appeared when the applied voltage changed from 105 V to 130 V, due to the dissolution of Cu2O.

  20. Analysis of peel strength of consisting of an aluminum sheet, anodic aluminum oxide and a copper foil laminate composite

    Science.gov (United States)

    Shin, Hyeong-Won; Lee, Hyo-Soo; Jung, Seung-Boo

    2017-01-01

    Laminate composites consisting of an aluminum sheet, anodic aluminum oxide, and copper foil have been used as heat-spreader materials for high-power light-emitting diodes (LEDs). These composites are comparable to the conventional structure comprising an aluminum sheet, epoxy adhesives, and copper foil. The peel strength between the copper foil and anodic aluminum oxide should be more than 1.0 kgf/cm in order to be applied in high-power LED products. We investigated the effect of the anodic aluminum oxide morphology and heat-treatment conditions on the peel strength of the composites. We formed an anodic aluminum oxide layer on a 99.999% pure aluminum sheet using electrochemical anodization. A Ti/Cu seed layer was formed using the sputtering direct bonding copper process in order to form a copper circuit layer on the anodic aluminum oxide layer by electroplating. The developed heat spreader, composed of an aluminum layer, anodic aluminum oxide, and a copper circuit layer, showed peel strengths ranging from 1.05 to 3.45 kgf/cm, which is very suitable for high-power LED applications.

  1. Studies of copper transport in mammalian cells using copper radioisotopes

    Energy Technology Data Exchange (ETDEWEB)

    Camakaris, J.; Voskoboinik, I.; Brooks, H.; Greenough, M. [University of Melbourne, Parkville, VIC (Australia). Department of Genetics; Smith, S. [Australian Nuclear Science and Technology Organisation, Lucas Heights, NSW (Australia). Radiopharmaceuticals Division; Mercer, J. [Deakin University, Clayton, VIC (Australia). Centre of Cellular and Molecular Biology

    1998-12-31

    The trace element copper poses a major problem for all organisms. It is essential as a number of vital enzymes require it. Copper deficiency can lead to neurological disorders, osteoporosis and weakening of arteries. However Cu is also highly toxic and homeostatic mechanisms have evolved to maintain Cu at levels which satisfy requirements but do not cause toxicity. Toxicity is mediated by the oxidative capacity of Cu and its ability to generate toxic free radicals. There are several acquired and inherited diseases due to either Cu toxicity or Cu deficiency. The study of these diseases facilitates identification of genes and proteins involved in copper homeostasis, and this in turn will provide rational therapeutic approaches. Using the copper radioisotopes {sup 64}Cu (t1/2 = 12.8 hr) and {sup 67}Cu (t1/2 = 61 hr) we have developed a number of systems for studying copper transport in mammalian cells. These include investigation of copper uptake, copper efflux and ligand blot assays for Cu-binding proteins. Our studies have focused on Menkes disease which is an inherited and usually lethal copper deficiency disorder in humans. We have demonstrated that the Menkes protein is directly involved as a copper efflux pump in mammalian cells. Using cells overexpressing the Menkes protein we have provided the first biochemical evidence that this functions as a Cu translocating (across the membrane) P-type ATPase (Voskoboinik et al., FEBS Letters, in press). These studies were carried out using purified plasma membrane vesicles. We are now carrying out structure- function studies on this protein using targeted mutations and assaying using the radiocopper vesicle assay. Recently we have commenced studies on the role of amyloid precursor protein (APP) in copper transport and relationship of this to Alzheimers disease

  2. Evaluation of copper ion of antibacterial effect on Pseudomonas aeruginosa, Salmonella typhimurium and Helicobacter pylori and optical, mechanical properties

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Young-Hwan [School of Materials Science and Engineering, University of Yonsei, Seoul (Korea, Republic of); Choi, Yu-ri; Kim, Kwang-Mahn [Department and Research Institute of Dental Biomaterials and Bioengineering, College of Dentistry, University of Yonsei, Seoul (Korea, Republic of); Choi, Se-Young, E-mail: sychoi@yonsei.ac.kr [School of Materials Science and Engineering, University of Yonsei, Seoul (Korea, Republic of)

    2012-02-01

    Antibacterial effect on Pseudomonas aeruginosa, Salmonella typhimurium and Helicobacter pylori of copper ion was researched. Also, additional effects of copper ion coating on optical and mechanical properties were researched as well. Copper ion was coated on glass substrate as a thin film to prevent bacteria from growing. Cupric nitrate was used as precursors for copper ion. The copper ion contained sol was deposited by spin coating process on glass substrate. Then, the deposited substrates were heat treated at the temperature range between 200 Degree-Sign C and 250 Degree-Sign C. The thickness of deposited copper layer on the surface was 63 nm. The antibacterial effect of copper ion coated glass on P. aeruginosa, S. typhimurium and H. pylori demonstrated excellent effect compared with parent glass. Copper ion contained layer on glass showed a similar value of transmittance compared with value of parent glass. The 3-point bending strength and Vickers hardness were 209.2 MPa, 540.9 kg/mm{sup 2} which were about 1.5% and 1.3% higher than the value of parent glass. From these findings, it is clear that copper ion coating on glass substrate showed outstanding effect not only in antibacterial activity but also in optical and mechanical properties as well.

  3. Evaluation of copper ion of antibacterial effect on Pseudomonas aeruginosa, Salmonella typhimurium and Helicobacter pylori and optical, mechanical properties

    Science.gov (United States)

    Kim, Young-Hwan; Choi, Yu-ri; Kim, Kwang-Mahn; Choi, Se-Young

    2012-02-01

    Antibacterial effect on Pseudomonas aeruginosa, Salmonella typhimurium and Helicobacter pylori of copper ion was researched. Also, additional effects of copper ion coating on optical and mechanical properties were researched as well. Copper ion was coated on glass substrate as a thin film to prevent bacteria from growing. Cupric nitrate was used as precursors for copper ion. The copper ion contained sol was deposited by spin coating process on glass substrate. Then, the deposited substrates were heat treated at the temperature range between 200 °C and 250 °C. The thickness of deposited copper layer on the surface was 63 nm. The antibacterial effect of copper ion coated glass on P. aeruginosa, S. typhimurium and H. pylori demonstrated excellent effect compared with parent glass. Copper ion contained layer on glass showed a similar value of transmittance compared with value of parent glass. The 3-point bending strength and Vickers hardness were 209.2 MPa, 540.9 kg/mm2 which were about 1.5% and 1.3% higher than the value of parent glass. From these findings, it is clear that copper ion coating on glass substrate showed outstanding effect not only in antibacterial activity but also in optical and mechanical properties as well.

  4. Monitoring Method for Blast Furnace Wall With Copper Staves

    Institute of Scientific and Technical Information of China (English)

    CHENG Su-sen; QIAN Liang; ZHAO Hong-bo

    2007-01-01

    A monitoring method that has been designed for the first time for blast furnace wall with copper staves manufactured in China was introduced. Combining the method of "inverse problem" and the concept "non-inverse problem", the monitoring program for blast furnace wall with copper staves has been realized, which can be used to calculate online the accretion thickness and temperature of hot surface of copper staves after obtaining the values of thermocouples of copper staves. The accretion state obtained in the actual investigation has proved that the result of the program is correct. The monitoring program shows that the accretion would easily fluctuate when the accretion layer is extremely thick or thin, thereby the stable and smooth operation of the blast furnace is hindered. By maintaining appropriate accretion thickness, both long campaigns and high productivity of the blast furnace can be achieved; furthermore, it can also optimize the operation of blast furnace and maximize its production. Approximately 30-50 mm in thickness of accretion layer is maintained on the wall of Shougang blast furnace 2, which can meet the requirement for obtaining both long campaign and high productivity.

  5. A Plasmodium falciparum copper-binding membrane protein with copper transport motifs

    OpenAIRE

    Choveaux David L; Przyborski Jude M; Goldring JP

    2012-01-01

    Abstract Background Copper is an essential catalytic co-factor for metabolically important cellular enzymes, such as cytochrome-c oxidase. Eukaryotic cells acquire copper through a copper transport protein and distribute intracellular copper using molecular chaperones. The copper chelator, neocuproine, inhibits Plasmodium falciparum ring-to-trophozoite transition in vitro, indicating a copper requirement for malaria parasite development. How the malaria parasite acquires or secretes copper st...

  6. Nanocrystalline copper based microcomposites

    OpenAIRE

    J.P. Stobrawa; Z.M. Rdzawski; W. Głuchowski; J. Domagała-Dubiel

    2012-01-01

    Purpose: The aim of this work was to investigate microstructure, mechanical properties and deformation behavior of copper microcomposites: Cu- Y2O3, Cu- ZrO2 and Cu-WC produced by powder metallurgy techniques.Design/methodology/approach: Tests were made with Cu-Y2O3, Cu-ZrO2 and Cu-WC microcomposites containing up to 2% of a strengthening phase. The materials were fabricated by powder metallurgy techniques, including milling of powders, followed by their compacting and sintering. The main mec...

  7. The Bauschinger Effect in Copper

    DEFF Research Database (Denmark)

    Pedersen, Ole Bøcker; Brown, L .M.; Stobbs, W. M.

    1981-01-01

    A study of the Bauschinger effect in pure copper shows that by comparison with dispersion hardened copper the effect is very small and independent of temperature. This suggests that the obstacles to flow are deformable. A simple composite model based on this principle accounts for the data semi...

  8. Analysis of Historic Copper Patinas. Influence of Inclusions on Patina Uniformity

    Directory of Open Access Journals (Sweden)

    Tingru Chang

    2017-03-01

    Full Text Available The morphology and elemental composition of cross sections of eight historic copper materials have been explored. The materials were taken from copper roofs installed in different middle and northern European environments from the 16th to the 19th century. All copper substrates contain inclusions of varying size, number and composition, reflecting different copper ores and production methods. The largest inclusions have a size of up to 40 μm, with most inclusions in the size ranging between 2 and 10 μm. The most common element in the inclusions is O, followed by Pb, Sb and As. Minor elements include Ni, Sn and Fe. All historic patinas exhibit quite fragmentized bilayer structures, with a thin inner layer of cuprite (Cu2O and a thicker outer one consisting mainly of brochantite (Cu4SO4(OH6. The extent of patina fragmentation seems to depend on the size of the inclusions, rather than on their number and elemental composition. The larger inclusions are electrochemically nobler than the surrounding copper matrix. This creates micro-galvanic effects resulting both in a profound influence on the homogeneity and morphology of historic copper patinas and in a significantly increased ratio of the thicknesses of the brochantite and cuprite layers. The results suggest that copper patinas formed during different centuries exhibit variations in uniformity and corrosion protection ability.

  9. Effects of copper(II) and copper oxides on THMs formation in copper pipe.

    Science.gov (United States)

    Li, Bo; Qu, Jiuhui; Liu, Huijuan; Hu, Chengzhi

    2007-08-01

    Little is known about how the growth of trihalomethanes (THMs) in drinking water is affected in copper pipe. The formation of THMs and chlorine consumption in copper pipe under stagnant flow conditions were investigated. Experiments for the same water held in glass bottles were performed for comparison. Results showed that although THMs levels firstly increased in the presence of chlorine in copper pipe, faster decay of chlorine as compared to the glass bottle affected the rate of THMs formation. The analysis of water phase was supplemented by surface analysis of corrosion scales using X-ray photoelectron spectroscopy (XPS), scanning electron microscope (SEM) and energy dispersive spectroscopy (EDX). The results showed the scales on the pipe surface mainly consisted of Cu(2)O, CuO and Cu(OH)(2) or CuCO(3). Designed experiments confirmed that the fast depletion of chlorine in copper pipe was mainly due to effect of Cu(2)O, CuO in corrosion scales on copper pipe. Although copper(II) and copper oxides showed effect on THMs formation, the rapid consumption of chlorine due to copper oxide made THM levels lower than that in glass bottles after 4h. The transformations of CF, DCBM and CDBM to BF were accelerated in the presence of copper(II), cupric oxide and cuprous oxide. The effect of pH on THMs formation was influenced by effect of pH on corrosion of copper pipe. When pH was below 7, THMs levels in copper pipe was higher as compared to glass bottle, but lower when pH was above 7.

  10. Condition of copper and organic matter in the soil contaminated with metal remediation of humic substances.

    Science.gov (United States)

    Kolchanova, Kseniia; Barsova, Natalia; Motuzova, Galina; Stepanov, Andrey; Karpukhin, Mikhail

    2017-04-01

    The aim of this study was to investigate the forms of copper and transformation of organic matter in the soil under the influence of humic substances (potassium humate, which was obtained from coal). The object of research was the top layer of soil model field experience. Field experiments were carried out in 10-liter plastic containers.The upper layers were constructed artificially as mixture of loam, sand and peat. Below it was a layer of loam, then gravel and under it we installed lysimeters. The experiment was conducted in 3 settings: 1) control, 2) control + Cu, and 3) control + Cu + potassium humate . Copper was deposited into upper layer at soil column construction as dry powder (CuSO4*5H2O), which is 1000mg per kg. Humic substance was introduced on surface as liquid form. The focus was the state of the copper and organic matter of solid and liquid phase. In the solid phase pH, carbon content, the molecular-mass distributions for the organic matter, total (HNO3 conc.+ H2O2; decomposition in a microwave oven) and acid-soluble (1H HNO3) copper content, sequential extraction of copper (1 M MgCl2, acetate buffer pH 4,8 (AAB), 1% EDTA) were determined. For liquid phase characteristics aqueous extract was obtained and identified therein: pH, total activity and copper content and water-soluble organic matter(WOM) amphiphilic properties. The introduction of copper is accompanied by a decrease in pH in soils from 7 to 6,3. The introduction of the humic substance softens this effect. Introducing humic preparation gives an increase in carbon at 0.5%. HS and copper has no significant effect on the molecular-mass distribution of solid organic matter. Only about 4% introduced copper accounted for the exchangeable form (MgCl2) for the variant only copper contaminated. Copper, mainly precipitated as hydroxides, moved in an AAB extract. And compared with the exchangeable forms its quantity increases by 10 times. Still more copper goes into an extract of EDTA, about half of

  11. Copper: From neurotransmission to neuroproteostasis

    Directory of Open Access Journals (Sweden)

    Carlos M Opazo

    2014-07-01

    Full Text Available Copper is critical for the Central Nervous System (CNS development and function. In particular, different studies have shown the effect of copper at brain synapses, where it inhibits Long Term Potentation (LTP and receptor pharmacology. Paradoxically, according to recent studies copper is required for a normal LTP response. Copper is released at the synaptic cleft, where it blocks glutamate receptors, which explain its blocking effects on excitatory neurotransmission. Our results indicate that copper also enhances neurotransmission through the accumulation of PSD95 protein, which increase the levels of AMPA receptors located at the plasma membrane of the post-synaptic density. Thus, our findings represent a novel mechanism for the action of copper, which may have implications for the neurophysiology and neuropathology of the CNS. These data indicate that synaptic configuration is sensitive to transient changes in transition metal homeostasis. Our results suggest that copper increases GluA1 subunit levels of the AMPA receptor through the anchorage of AMPA receptors to the plasma membrane as a result of PSD-95 accumulation. Here, we will review the role of copper on neurotransmission of CNS neurons. In addition, we will discuss the potential mechanisms by which copper could modulate neuronal proteostasis (neuroproteostasis in the CNS with focus in the Ubiquitin Proteasome System, which is particularly relevant to neurological disorders such Alzheimer’s disease (AD where copper and protein dyshomeostasis may contribute to neurodegeneration. An understanding of these mechanisms may ultimately lead to the development of novel therapeutic approaches to control metal and synaptic alterations observed in AD patients.

  12. Electronic conduction and electrocatalysis by supramolecular tetraruthenated copper porphyrazine films

    Energy Technology Data Exchange (ETDEWEB)

    Matsumoto, Marcio Y.; Toyama, Marcos M.; Mayer, Ildemar; Winnischofer, Herbert; Araki, Koiti; Toma, Henrique E. [Universidade de Sao Paulo (USP), SP (Brazil). Inst. de Quimica

    2009-07-01

    A new tetraruthenated copper(II)-tetra(3,4-pyridyl)porphyrazine species, [CuTRPyPz]{sup 4+}, has been synthesized and fully characterized by means of analytical, spectroscopic and electrochemical techniques. This {pi}-conjugated system contrasts with the related meso-tetrapyridylporphyrins by exhibiting strong electronic interaction between the coordinated peripheral complexes and the central ring. Based on favorable {pi}-stacking and electrostatic interactions, layer-by-layer assembled films were successfully generated from the appropriate combination of [CuTRPyPz]{sup 4+} with copper(II)-tetrasulfonated phtalocyanine, [CuTSPc]{sup 4-}. Their conducting and electrocatalytic properties were investigated by means of impedance spectroscopy and rotating disc voltammetry, exhibiting metallic behavior near the Ru(III/II) redox potential, as well as enhanced catalytic activity for the oxidation of nitrite and sulphite ions. (author)

  13. Charge Transfer Properties Through Graphene Layers in Gas Detectors

    CERN Document Server

    Thuiner, P; Jackman, R.B.; Müller, H.; Nguyen, T.T.; Oliveri, E.; Pfeiffer, D.; Resnati, F.; Ropelewski, L.; Smith, J.A.; van Stenis, M.; Veenhof, R.

    2015-01-01

    Graphene is a single layer of carbon atoms arranged in a honeycomb lattice with remarkable mechanical, electrical and optical properties. For the first time graphene layers suspended on copper meshes were installed into a gas detector equipped with a gaseous electron multiplier. Measurements of low energy electron and ion transfer through graphene were conducted. In this paper we describe the sample preparation for suspended graphene layers, the testing procedures and we discuss the preliminary results followed by a prospect of further applications.

  14. Fiber laser welding of austenitic steel and commercially pure copper butt joint

    Science.gov (United States)

    Kuryntsev, S. V.; Morushkin, A. E.; Gilmutdinov, A. Kh.

    2017-03-01

    The fiber laser welding of austenitic stainless steel and commercially pure copper in butt joint configuration without filler or intermediate material is presented. In order to melt stainless steel directly and melt copper via heat conduction a defocused laser beam was used with an offset to stainless steel. During mechanical tests the weld seam was more durable than heat affected zone of copper so samples without defects could be obtained. Three process variants of offset of the laser beam were applied. The following tests were conducted: tensile test of weldment, intermediate layer microhardness, optical metallography, study of the chemical composition of the intermediate layer, fractography. Measurements of electrical resistivity coefficients of stainless steel, copper and copper-stainless steel weldment were made, which can be interpreted or recalculated as the thermal conductivity coefficient. It shows that electrical resistivity coefficient of cooper-stainless steel weldment higher than that of stainless steel. The width of intermediate layer between stainless steel and commercially pure copper was 41-53 μm, microhardness was 128-170 HV0.01.

  15. Investigation of Copper Ammonia Leaching from Smelter Slags: Characterization, Leaching and Kinetics

    Science.gov (United States)

    Bidari, Ehsan; Aghazadeh, Valeh

    2015-10-01

    Although ammonia leaching of copper from slags has been reported generally as a part of copper slag utilization methods, but no detailed studies have been reported in the literature. In this research, we tried to investigate the effect of different parameters on ammonia leaching of copper from copper smelting slag by identifying different copper-bearing phases and following them during leaching time. Mineralogical characterization of the smelting slag (1.7 pct Cu) was done using X-ray fluorescence, X-ray diffraction, optical microscopy, diagnostic leaching tests, and scanning electron microscopy. The characterization studies indicated that main copper-bearing species are soluble copper oxides and chalcocite along with minor amount of covellite, bornite, blister copper particles, and chalcopyrite. It was also found that only approximately 0.2 pct Cu was present in the insoluble bulk silicate phases. These results suggest that approximately 88 pct of the total copper of slag could be extracted by ammonia sulfide leaching. Leaching tests were carried out and the effects of various parameters, namely pH, ammonia concentration, temperature, presence of oxygen, stirring speed, and pulp density were examined on copper leaching. The temperature and stirring speed had the most pronounced effect on the copper leaching, whereas ammonia affected the leaching yield at low concentrations of ammonia. It was found that 78 pct of Cu could be extracted within 4 hours and under optimum conditions: T = 343 K (70 °C), 2M ammonia, pH 10.5, stirring speed = 900 rpm, pulp density = 10 pct ( w s/ v). The kinetic data were analyzed with the shrinking core models, and it was found that the leaching process is controlled by both the interfacial transfer and diffusion across the product layer and the activation energy is calculated to be 49.4 kJ mol-1.

  16. Nonmixing layers

    Science.gov (United States)

    Gaillard, Pierre; Giovangigli, Vincent; Matuszewski, Lionel

    2016-12-01

    We investigate the impact of nonideal diffusion on the structure of supercritical cryogenic binary mixing layers. This situation is typical of liquid fuel injection in high-pressure rocket engines. Nonideal diffusion has a dramatic impact in the neighborhood of chemical thermodynamic stability limits where the components become quasi-immiscible and ultimately form a nonmixing layer. Numerical simulations are performed for mixing layers of H2 and N2 at a pressure of 100 atm and temperature around 120-150 K near chemical thermodynamic stability limits.

  17. Highly Stable Transparent Electrodes Made from Copper Nanotrough Coated with AZO/Al2O3.

    Science.gov (United States)

    Li, Peng; Yan, Xingzhen; Ma, Jiangang; Xu, Haiyang; Liu, Yichun

    2016-04-01

    Due to their high flexibility, high conductivity and high transparency in a wide spectrum range, metal nanowires and meshes are considered to be two of the most promising candidates to replace the traditional transparent conducting films, such as tin doped indium oxide. In this paper, transparent conducting films made from copper nanotroughs are prepared by the electrospinning of polymer fibers and subsequent thermal evaporation of copper. The advantages of the technique include low junction resistance, low cost and low preparation temperature. Although the copper nanotrough transparent conducting films exhibited a low sheet resistance (19.2 Ω/sq), with a high transmittance (88% at 550 nm), the instability of copper in harsh environments seriously hinders its applications. In order to improve the stability of the metal transparent conducting films, copper nanotroughs were coated with 39 nm thick aluminum-doped zinc oxide and 1 nm thick aluminum oxide films by atomic layer deposition. The optical and electrical measurements show that coating copper nanotrough with oxides barely reduces the transparency of the films. It is worth noting that conductive oxide coating can effectively protect copper nanotroughs from thermal oxidation or acidic corrosion, whilst maintaining the same flexibility as copper nanotroughs on its own.

  18. Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry

    Science.gov (United States)

    Cheng, Jie; Wang, Tongqing; He, Yongyong; Lu, Xinchun

    2015-05-01

    The material removal mechanism of copper in a periodate-based slurry during barrier layer chemical mechanical polishing (CMP) has not been intensively investigated. This paper presents a study of the copper surface film chemistry and mechanics in a periodate-based slurry. On this basis, the controlling factor of the copper CMP material removal mechanism is proposed. The results show that the chemical and electrochemical reaction products on the copper surface are complex and vary considerably as a function of the solution pH. Under acidic conditions (pH 4) the copper surface underwent strong chemical dissolution while the corrosion was mild and uniform under alkaline conditions (pH 11). The corrosion effect was the lowest in near neutral solutions because the surface was covered with non-uniform Cu(IO3)2·H2O/Cu-periodate/copper oxides films, which had better passivation effect. The surface film thickness and mechanical removal properties were studied by AES and AFM nano-scratch tests. Based on the combined surface film analysis and CMP experiment results, it can be concluded that the controlling factor during copper CMP in a periodate-based slurry is the chemical-enhanced mechanical removal of the surface films. The periodate-based slurry should be modified by the addition of corrosion inhibitors and complexing agents to achieve a good copper surface quality with moderate chemical dissolution.

  19. Surface ordering during underpotential deposition of lead on copper

    Science.gov (United States)

    Vasiljevic, Natasa

    Recently there has been an increased fundamental and practical interest in studies of ultra-thin films in systems with large atomic size mismatch. For those systems interesting surface stress-driven phenomena are observed, such as surface-confined alloying resulting in self-assembly and ordering of domain structures. The system of interest in the present study is the electrochemical deposition of lead on copper that has an atomic size mismatch of 37%. This system shows no bulk alloying and has been thoroughly examined in ultra high vacuum (UHV). Electrodeposition of lead on copper starts by formation of one epitaxial monolayer in the potential region positive with respect to the reversible potential of bulk lead deposition, a phenomenon known in electrochemistry as underpotential deposition (UPD). On copper (111), in-situ STM results have shown (4 x 4) Moire structure of the complete lead monolayer, a structure identical to that observed in UHV. Following stripping of the lead monolayer, STM results revealed nano-organization of the topmost copper layer. Depending on the solution pH value, different types of nanoscale organization have been observed: (i) a Moire pattern of anion-induced reconstruction of the top copper layer, and (ii) a star pattern dislocation network. Additional experiments in lead-free aerated and deaerated solutions at different pH values suggest that observed structures are results of lead-assisted oxy-anion adsorption in which lead plays a catalytic role. On copper (100), the lead UPD process features coverage-dependent phase behavior identical to that observed in UHV. As a function of lead coverage, phases corresponding to a dilute random alloy phase and ordered surface alloy phase that appears at a surface coverage ratio of three lead atoms to eight copper atoms are observed. With increasing lead coverage, lead dealloys from this ordered phase resulting in the formation of a c(2 x 2) lead overlayer phase that transforms with increasing lead

  20. Underwater explosive welding of thin tungsten foils and copper

    Science.gov (United States)

    Manikandan, P.; Lee, J. O.; Mizumachi, K.; Mori, A.; Raghukandan, K.; Hokamoto, K.

    2011-11-01

    This study demonstrates the ability to clad pure tungsten foils on copper plate using underwater shock waves generated by the detonation of explosive. Microstructural characterization revealed that a higher preset inclination results in wavy morphology. Weld formed at lower inclination exhibit a planar interfacial layer comprising fine grained particles of both components. The plastic flow of tungsten is ascribed to the synergistic influence of high pressure and high strain rate at the collision point.

  1. Effect of Copper on the Carrier Lifetime in Black Silicon

    DEFF Research Database (Denmark)

    Porte, Henrik; Turchinovich, Dmitry; Persheyev, Saydulla;

    2011-01-01

    Black silicon is produced by laser annealing of a-Si:H films. During annealing, silicon microstructures are formed on the surface. We use time-resolved terahertz spectroscopy to study the photoconductivity dynamics in black silicon. We find that when a copper film is deposited on top of the a-Si:......-Si:H layer prior to laser annealing, the carrier lifetime of black silicon is significantly reduced....

  2. Jiangxi Copper Corporation Builds 900,000-Ton Copper Production Capacity

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    <正>The Eastward Refined Copper Expansion Pro- ject of Guixi Smelting Plant under Jiangxi Copper Corporation has output its first lot of Copper cathode,marking the company’s pos- session of a 900,000-ton copper production ca- pacity.Thus the company further strengthens its position as the top 3 of the copper world.

  3. Formation of CuxS Layers on Polypropylene Sulfurized by Molten Sulfur

    Directory of Open Access Journals (Sweden)

    Rasa ALABURDAITĖ

    2011-11-01

    Full Text Available The processes of formation of electrically conductive layers of copper sulfides CuxS by the sorption-diffusion method on polypropylene (PP using molten sulfur as sulfurizing agent was investigated. The amount of sorbed sulfur increased with the increase of the duration of treatment. Copper sulfide layers were formed on the surface of polypropylene after the treatment of sulfurized polymer with Cu(II/I salt solution. The amount of copper sulfide in layer increased with the increase of treatment duration in copper salt solution. XRD spectra of PP films treated for 3 min with molten sulfur and then with Cu(II/I salt solution for the different time showed that the copper sulfide phases, mostly digenite, Cu2-xS and a-chalcocite, Cu2S were formed in the layers. Electromotive force measurement results confirmed the composition of formed CuxS layers on PP. The phase composition of layers also changed after the annealing. The value of electrical resistance of copper sulfide layers on PP varied from 20 W/cm2 to 80 W/cm2 and after annealing at 80 °C - in the interval of 10 W/cm2 - 60 W/cm2.http://dx.doi.org/10.5755/j01.ms.17.4.776

  4. Formation of CuxS Layers on Polypropylene Sulfurized by Molten Sulfur

    Directory of Open Access Journals (Sweden)

    Rasa ALABURDAITĖ

    2011-11-01

    Full Text Available The processes of formation of electrically conductive layers of copper sulfides CuxS by the sorption-diffusion method on polypropylene (PP using molten sulfur as sulfurizing agent was investigated. The amount of sorbed sulfur increased with the increase of the duration of treatment. Copper sulfide layers were formed on the surface of polypropylene after the treatment of sulfurized polymer with Cu(II/I salt solution. The amount of copper sulfide in layer increased with the increase of treatment duration in copper salt solution. XRD spectra of PP films treated for 3 min with molten sulfur and then with Cu(II/I salt solution for the different time showed that the copper sulfide phases, mostly digenite, Cu2-xS and a-chalcocite, Cu2S were formed in the layers. Electromotive force measurement results confirmed the composition of formed CuxS layers on PP. The phase composition of layers also changed after the annealing. The value of electrical resistance of copper sulfide layers on PP varied from 20 W/cm2 to 80 W/cm2 and after annealing at 80 °C - in the interval of 10 W/cm2 - 60 W/cm2.http://dx.doi.org/10.5755/j01.ms.17.4.776

  5. Secondary Copper Industry Entered Rapid Growth Period

    Institute of Scientific and Technical Information of China (English)

    2016-01-01

    In China’s copper output,secondary copper accounts for about 40%,for power cable industry,the usage percentage of secondary copper is about 50%.Under the favorable policy of the government to vigorously support recycling industry,secondary copper rod enterprises begin to expand,and are confident toward the industry’s potentials.

  6. Unravelling the Chemical Nature of Copper Cuprizone

    OpenAIRE

    Messori, L.; Casini, A.; C.Gabbiani; Sorace, L.; Muniz-Miranda, M.; Zatta, P

    2007-01-01

    During the last 50 years, formation of the highly chromogenic copper cuprizone complex has been exploited for spectrophotometric determinations of copper although the precise chemical nature of the resulting species has never been ascertained; we eventually show here, in contrast to current opinion, that copper cuprizone is a copper(III) complex.

  7. An analysis of copper transport in the insulation of high voltage transformers

    CERN Document Server

    Whitfield, T B

    2001-01-01

    Measurements of surface concentrations by XPS correlate well with measurements made with atomic absorption spectroscopy on solutions of extracts of the contaminated paper. The laboratory measurements have allowed determination of the diffusion coefficients and activation energy for the transport process and thus give a basis for interpretation of the diffusion profiles found in the transformer in terms of time and temperature of operation. The diffusion process is temperature dependant. The results have been used to produce long term prediction curves. Examination of the paper insulation and copper stress braiding during stripdown of a number of Current Transformers (FMK type 400kV) has revealed the presence of dark deposits. Copper foils are often interspersed within layers of paper insulation and mineral oil found in transformer windings. The dark deposits were often found in association with these foils, affecting several layers of paper in addition to the layer in contact with the copper foil. This thesis...

  8. Boiling heat transfer on single phosphor bronze and copper mesh microstructures

    Directory of Open Access Journals (Sweden)

    Orman Łukasz J.

    2014-03-01

    Full Text Available The paper presents experimental results of boiling heat transfer of distilled water and ethyl alcohol on surfaces covered with single layers of wire mesh structures made of phosphor bronze and copper. For each material two kinds of structures have been considered (higher and lower in order to determine the impact of the height of the structure on boiling heat transfer. The wire diameter of the copper meshes was 0,25 mm and 0,32 mm, while of the bronze meshes: 0,20 mm and 0,25 mm. The structures had the same mesh aperture (distance between the wires – 0,50 mm for copper and 0,40 for bronze but different wire diameter and, consequently, different height of the layers. The tests have been performed under ambient pressure in the pool boiling mode. The obtained results indicate a visible impact of the layer height on the boiling heat transfer performance of the analysed microstructures.

  9. Stress corrosion cracking of copper canisters

    Energy Technology Data Exchange (ETDEWEB)

    King, Fraser (Integrity Corrosion Consulting Limited (Canada)); Newman, Roger (Univ. of Toronto (Canada))

    2010-12-15

    A critical review is presented of the possibility of stress corrosion cracking (SCC) of copper canisters in a deep geological repository in the Fennoscandian Shield. Each of the four main mechanisms proposed for the SCC of pure copper are reviewed and the required conditions for cracking compared with the expected environmental and mechanical loading conditions within the repository. Other possible mechanisms are also considered, as are recent studies specifically directed towards the SCC of copper canisters. The aim of the review is to determine if and when during the evolution of the repository environment copper canisters might be susceptible to SCC. Mechanisms that require a degree of oxidation or dissolution are only possible whilst oxidant is present in the repository and then only if other environmental and mechanical loading conditions are satisfied. These constraints are found to limit the period during which the canisters could be susceptible to cracking via film rupture (slip dissolution) or tarnish rupture mechanisms to the first few years after deposition of the canisters, at which time there will be insufficient SCC agent (ammonia, acetate, or nitrite) to support cracking. During the anaerobic phase, the supply of sulphide ions to the free surface will be transport limited by diffusion through the highly compacted bentonite. Therefore, no HS. will enter the crack and cracking by either of these mechanisms during the long term anaerobic phase is not feasible. Cracking via the film-induced cleavage mechanism requires a surface film of specific properties, most often associated with a nano porous structure. Slow rates of dissolution characteristic of processes in the repository will tend to coarsen any nano porous layer. Under some circumstances, a cuprous oxide film could support film-induced cleavage, but there is no evidence that this mechanism would operate in the presence of sulphide during the long-term anaerobic period because copper sulphide

  10. Secondary Copper Consumption and Location in China

    Institute of Scientific and Technical Information of China (English)

    2004-01-01

    <正> China is short of copper resources and is alsothe second largest copper consuming country inthe world.The way to overcome the contradic-tion between the resource shortage and fastgrowth in consumption is to import copper rawmaterial in large quantities.Since the 1990’s,China’s import quantity of copper scrap hasincreased considerably.During the last twoyears,China has imported copper scrap worthof US$2.25 billion,1.32 times of the value ofimported copper concentrates in the same pe-riod.China is one of the biggest copper scrap

  11. A novel technique for making self-encapsulated and self-aligned copper films

    Energy Technology Data Exchange (ETDEWEB)

    Chugh, Amit; Tiwari, Ashutosh; Kvit, A.; Narayan, J

    2003-09-25

    We provide a method to grow self-aligned epitaxial MgO/Cu/MgO films on silicon substrates by pulsed laser deposition (PLD) technique. Here, a thin layer of Cu/Mg (Mg 5%) is deposited using a PLD over Si (100) specimens, followed by annealing at 500 deg. C in a controlled oxygen environment resulting in the segregation of Mg on either side of the copper film. Mg on the upper side of copper reacts with ambient oxygen and on the lower side with the adsorbed oxygen in the substrate to form layers of MgO. High-resolution transmission electron microscopy (HRTEM) measurements showed thin layers of MgO formed on either side of the copper films. The lower MgO layer acts as a diffusion barrier and inhibits the diffusion of Cu into the system while the upper MgO layer acts as a passivating layer and protects copper against oxidation. This approach can also be used to grow high quality epitaxial YBa{sub 2}Cu{sub 3}O{sub 7-{delta}} films with MgO acting as a buffer for the superconducting device applications.

  12. An Introduction to Copper Deposits in China

    Institute of Scientific and Technical Information of China (English)

    1999-01-01

    There are 11 genetic types of copper deposit in China, three of which (porphyry,contact metasomatic and VMS types) are the most important. The copper deposits distribute widely both temporally and spatially in China. The features of copper ores in China are mostly poor in copper tenor and complex in metal associated. The copper metallogeny in China predominantly occurs in three metallogenic megadomains, namely the circum-Pacific, the paleo-Asian and the Tethys-Himalayan.

  13. Hydrostatic Microextrusion of Steel and Copper

    Science.gov (United States)

    Berti, Guido; Monti, Manuel; D'Angelo, Luciano

    2011-05-01

    The paper presents an experimental investigation based on hydrostatic micro extrusion of billets in low carbon steel and commercially pure copper, and the relevant results. The starting billets have a diameter of 0.3 mm and are 5 mm long; a high pressure generator consisting of a manually operated piston screw pump is used to pressurize the fluid up to 4200 bar, the screw pump is connected through a 3-way distribution block to the extrusion die and to a strain gauge high pressure sensor. The sensor has a full scale of 5000 bar and the extrusion pressure is acquired at a sampling rate of 2 kHz by means of an acquisition program written in the LabVIEW environment. Tests have been conducted at room temperature and a lubricant for wire drawing (Chemetall Gardolube DO 338) acts both as the pressurizing fluid and lubricant too. In addition, billets were graphite coated. Different fluid pressures and process durations have been adopted, resulting in different extrusion lengths. The required extrusion pressure is much higher than in non-micro forming operations (this effect is more evident for steel). On the cross section of the extruded parts, hardness and grain size distribution have been measured, the former through Vickers micro hardness (10 g load) tests. In the case of the extrusion of copper, the material behaves as in microdrawing process. In the case of the extrusion of steel, the hardness increases from the core to the surface as in the drawing process, but with lower values. The analysis evidenced the presence of the external layer, but its thickness is about 1/3 of the external layer in the drawn wire and the grains appear smaller than in the layer of the drawn wire. The extruding force required along the extruding direction is higher (22-24 N) than the drawing force along the same direction (12 N): being the material, the reduction ratio, the die sliding length the same in both cases, the higher extrusion force should be caused by a higher tangential friction

  14. Additive and Photochemical Manufacturing of Copper

    Science.gov (United States)

    Yung, Winco K. C.; Sun, Bo; Meng, Zhengong; Huang, Junfeng; Jin, Yingdi; Choy, Hang Shan; Cai, Zhixiang; Li, Guijun; Ho, Cheuk Lam; Yang, Jinlong; Wong, Wai Yeung

    2016-12-01

    In recent years, 3D printing technologies have been extensively developed, enabling rapid prototyping from a conceptual design to an actual product. However, additive manufacturing of metals in the existing technologies is still cost-intensive and time-consuming. Herein a novel platform for low-cost additive manufacturing is introduced by simultaneously combining the laser-induced forward transfer (LIFT) method with photochemical reaction. Using acrylonitrile butadiene styrene (ABS) polymer as the sacrificial layer, sufficient ejection momentum can be generated in the LIFT method. A low-cost continuous wave (CW) laser diode at 405 nm was utilized and proved to be able to transfer the photochemically synthesized copper onto the target substrate. The wavelength-dependent photochemical behaviour in the LIFT method was verified and characterized by both theoretical and experimental studies compared to 1064 nm fiber laser. The conductivity of the synthesized copper patterns could be enhanced using post electroless plating while retaining the designed pattern shapes. Prototypes of electronic circuits were accordingly built and demonstrated for powering up LEDs. Apart from pristine PDMS materials with low surface energies, the proposed method can simultaneously perform laser-induced forward transfer and photochemical synthesis of metals, starting from their metal oxide forms, onto various target substrates such as polyimide, glass and thermoplastics.

  15. Additive and Photochemical Manufacturing of Copper.

    Science.gov (United States)

    Yung, Winco K C; Sun, Bo; Meng, Zhengong; Huang, Junfeng; Jin, Yingdi; Choy, Hang Shan; Cai, Zhixiang; Li, Guijun; Ho, Cheuk Lam; Yang, Jinlong; Wong, Wai Yeung

    2016-12-21

    In recent years, 3D printing technologies have been extensively developed, enabling rapid prototyping from a conceptual design to an actual product. However, additive manufacturing of metals in the existing technologies is still cost-intensive and time-consuming. Herein a novel platform for low-cost additive manufacturing is introduced by simultaneously combining the laser-induced forward transfer (LIFT) method with photochemical reaction. Using acrylonitrile butadiene styrene (ABS) polymer as the sacrificial layer, sufficient ejection momentum can be generated in the LIFT method. A low-cost continuous wave (CW) laser diode at 405 nm was utilized and proved to be able to transfer the photochemically synthesized copper onto the target substrate. The wavelength-dependent photochemical behaviour in the LIFT method was verified and characterized by both theoretical and experimental studies compared to 1064 nm fiber laser. The conductivity of the synthesized copper patterns could be enhanced using post electroless plating while retaining the designed pattern shapes. Prototypes of electronic circuits were accordingly built and demonstrated for powering up LEDs. Apart from pristine PDMS materials with low surface energies, the proposed method can simultaneously perform laser-induced forward transfer and photochemical synthesis of metals, starting from their metal oxide forms, onto various target substrates such as polyimide, glass and thermoplastics.

  16. The interfacial structure of plated copper alloy resistance spot welded joint

    Science.gov (United States)

    Wu, Jingwei; Zhai, Guofu; Chen, Qing; Wang, Jianqi; Ren, Gang

    2008-09-01

    Plated copper alloys are widely used in electron industry. The plating lay caused the farther decreasing of the welding property of copper alloys, whose intrinsic weldability was poor. In this paper, the bronze and brass specimens with nickel-tin double plating layer were joined by resistance spot welding method. The microstructure and peel strength of the joints were investigated. The experiment results show that a sandwich-like structure was obtained in the faying surface after welding, and the nickel plating layer thickness had severe effect on the reliability of the joints.

  17. The interfacial structure of plated copper alloy resistance spot welded joint

    Energy Technology Data Exchange (ETDEWEB)

    Wu Jingwei [Xiamen Hongfa Electroacoustic Co., Ltd, 361021 Xiamen (China); Harbin Institute of Technology, 150001 Harbin (China)], E-mail: jingweiwu.hit@gmail.com; Zhai Guofu [Harbin Institute of Technology, 150001 Harbin (China); Chen Qing; Wang Jianqi; Ren Gang [Xiamen Hongfa Electroacoustic Co., Ltd, 361021 Xiamen (China)

    2008-09-15

    Plated copper alloys are widely used in electron industry. The plating lay caused the farther decreasing of the welding property of copper alloys, whose intrinsic weldability was poor. In this paper, the bronze and brass specimens with nickel-tin double plating layer were joined by resistance spot welding method. The microstructure and peel strength of the joints were investigated. The experiment results show that a sandwich-like structure was obtained in the faying surface after welding, and the nickel plating layer thickness had severe effect on the reliability of the joints.

  18. Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper

    Science.gov (United States)

    Cook, Benjamin S.; Fang, Yunnan; Kim, Sangkil; Le, Taoran; Goodwin, W. Brandon; Sandhage, Kenneth H.; Tentzeris, Manos M.

    2013-09-01

    A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin®) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to allow for electroless deposition of a compact and conformal layer of copper in the inkjet-derived pattern. Meander monopole antennas comprised of such electroless-deposited copper patterns on paper exhibited comparable performance as for antennas synthesized via inkjet printing of a commercially-available silver nanoparticle ink. However, the solution-based patterning and electroless copper deposition process avoids nozzle-clogging problems and costs associated with noble metal particle-based inks. This process yields compact conductive copper layers without appreciable oxidation and without the need for an elevated temperature, post-deposition thermal treatment commonly required for noble metal particle-based ink processes. This low-cost copper patterning process is readily scalable on virtually any substrate and may be used to generate a variety of copper-based microwave devices on flexible, paper-based substrates.

  19. Acceleration Life Test and Microscopic Mechanism of High Performance Glass Fiber Reinforced Magnesium Oxychloride Cement%高性能玻璃纤维增强氯氧镁水泥的加速寿命试验与微观机理

    Institute of Scientific and Technical Information of China (English)

    余红发; 董金美; 刘倩倩; 李颖; 林启红

    2012-01-01

    利用SIC( strand in cement)试验方法,测定了玻璃纤维增强氯氧镁水泥(glass fiber reinforced magnesium oxychloride cement,GRMC)板材在80℃热水加速老化试验条件下的弯曲强度变化,研究了其加速试验寿命,并运用XRD、DSC -TG、FT-IR和SEM分析其水化产物组成和微观结构形貌,观察了玻璃纤维在氯氧镁水泥基体中的腐蚀特征.结果表明:未添加任何改性剂的普通GRMC在80℃热水加速老化2.5d后,其主要水化产物5·1 ·8大量分解,物相以叶片状的Mg( OH)2为主,促使玻璃纤维被基体腐蚀,导致力学性能急剧下降,预期使用寿命不超过4y.掺加复合抗水外加剂和矿渣的高性能GRMC由于5·1 ·8相的稳定存在和玻璃纤维不被腐蚀,在加速老化试验条件下的强度保留率高达60%以上,预期使用寿命超过了50 y.因此,5·1 ·8的稳定存在是保证高性能GRMC的玻璃纤维稳定性和长期耐久性的重要基础.%Bending strength change of glass fiber reinforced magnesium oxychloride cement (GRMC) board at 80 °C hot water accelerated aging was tested by the strand-in-cement ( SIC) method. Hydration product component, microscopic structure and corrosion feature of glass fibers in the oxychloride magnesium cement matrix were observed by XRD, DSC-TG, FT-IR and SEM. The results showed that its main hydration product 5·1·8 was hydrolysed and Mg(OH)2 became the main phase for common GRMC board after accelerated aging 2. 5 d at 80 °C. Hot water which led to the corrosion of glass fiber caused by matrix and rapid degradation of mechanical property , so the expected service life was not more than 4 years. For high performance GRMC board doped with compound water-repellent admixtures and slag,strength retention was higher than 60% at accelerated aging state because of the stability of 5 · 1 · 8 and noncorrision of glass fiber. Its expected service life exceeded 50 years. So, the stability of 5 · 1 · 8 was the important factor

  20. Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors

    Energy Technology Data Exchange (ETDEWEB)

    Curtis, Calvin J [Lakewood, CO; Miedaner, Alexander [Boulder, CO; Van Hest, Maikel [Lakewood, CO; Ginley, David S [Evergreen, CO; Nekuda, Jennifer A [Lakewood, CO

    2011-11-15

    Liquid-based indium selenide and copper selenide precursors, including copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent, are used to form crystalline copper-indium-selenide, and/or copper indium gallium selenide films (66) on substrates (52).

  1. The Revovery of Copper and Cobalt from Oxidized Copper Ore and Converter Slag

    OpenAIRE

    ZİYADANOĞULLARI, Berrin; ZİYADANOĞULLARI, Recep

    1999-01-01

    The aim of this study was to develop a method for obtaining copper and cobalt from oxidized copper ore and converter slag. In order to convert the copper and cobalt into sulfate compounds the main step was to roast the samples obtained by sulfurization and transfer the samples into solution. First the oxidized copper ore was roasted, followed by the mixture of converter slag and oxidized copper ore. Since the levels of copper and cobalt were low, the sulfurization process was carri...

  2. Genome Sequences of Two Copper-Resistant Escherichia coli Strains Isolated from Copper-Fed Pigs

    DEFF Research Database (Denmark)

    Lüthje, Freja L.; Hasman, Henrik; Aarestrup, Frank Møller;

    2014-01-01

    The draft genome sequences of two copper-resistant Escherichia coli strains were determined. These had been isolated from copper-fed pigs and contained additional putative operons conferring copper and other metal and metalloid resistances.......The draft genome sequences of two copper-resistant Escherichia coli strains were determined. These had been isolated from copper-fed pigs and contained additional putative operons conferring copper and other metal and metalloid resistances....

  3. Majorana Electroformed Copper Mechanical Analysis

    Energy Technology Data Exchange (ETDEWEB)

    Overman, Nicole R.; Overman, Cory T.; Kafentzis, Tyler A.; Edwards, Danny J.; Hoppe, Eric W.

    2012-04-30

    The MAJORANA DEMONSTRATOR is a large array of ultra-low background high-purity germanium detectors, enriched in 76Ge, designed to search for zero-neutrino double-beta decay. The DEMONSTRATOR will utilize ultra high purity electroformed copper for a variety of detector components and shielding. A preliminary mechanical evaluation was performed on the Majorana prototype electroformed copper material. Several samples were removed from a variety of positions on the mandrel. Tensile testing, optical metallography, scanning electron microscopy, and hardness testing were conducted to evaluate mechanical response. Analyses carried out on the Majorana prototype copper to this point show consistent mechanical response from a variety of test locations. Evaluation shows the copper meets or exceeds the design specifications.

  4. Hereditary iron and copper deposition

    DEFF Research Database (Denmark)

    Aaseth, Jan; Flaten, Trond Peder; Andersen, Ole

    2007-01-01

    can be successfully treated, emphasizing the importance of early diagnosis. Serum ferritin values, transferrin saturation and genetic analysis are used when diagnosing haemochromatosis. The diagnostics of Wilson's disease depends on the use of urinary copper values, serum ceruloplasmin and liver...

  5. Study of sintering behavior of vapor forms of 1-octanethiol coated copper nanoparticles for application to ink-jet printing technology.

    Science.gov (United States)

    Kwon, Jinhyeong; Park, Shinyoung; Haque, Md Mominul; Kim, Young-Seok; Lee, Caroline Sunyong

    2012-04-01

    Sub-50 nm copper nanoparticles coated with sub-5 nm 1-octanethiol layer for oxidation inhibition were examined to confirm the 1-octanethiol removal temperature as the sub-50 nm copper nanoparticles are sintered. As a result, 1-octanethiol Self-Assembled Multi-layers (SAMs) on sub-50 nm copper nanoparticles were successfully removed before sintering of copper nanoparticles so that a high density of copper line could be obtained. Finally, the line resistivity was measured and compared to verify the effect of sintering in different atmospheres. As a result, electrical resistivity of the copper pattern sintered in hydrogen atmosphere was measured at 6.96 x 10(-6) ohm-cm whereas that of the copper pattern sintered in mixed gas atmosphere was measured at 2.62 x 10(-5) ohm-cm. Thus, sintering of copper patterns was successfully done to show low electrical resistivity values. Moreover, removal of 1-octanethiol coating after sintering process was confirmed using X-ray photoelectron spectroscopy (XPS) analysis. By showing no sulfur content, XPS results indicate that 1-octanethiol is completely removed. Therefore, the vapor form of 1-octanethiol coating layers can be safely used as an oxidation inhibition layer for low temperature sintering processes and ink-jet applications.

  6. Technology and Properties of Layered Composites as Coatings for Heat Transfer Enhancement

    Science.gov (United States)

    Chatys, R.; Orman, Ł. J.

    2017-07-01

    The mechanical properties of porous structures consisting of copper wires reinforced with carbon and glass fibers for assessment of the adhesion strength of the porous structure produced and cohesion between components of the structures investigated, which are used for heat exchangers, are considered. The internal structure of bonds between their elements was analyzed by metallographic techniques. The statistical relationships for bonds between layers are given. The auxiliary characteristics of technology connected with the "hydrogen disease" of copper are discussed. Specimens were tested for characteristics of their tensile strength. The thermal performance of sintered heat exchangers was also investigated on brass-copper, bronze-copper, and copper-copper samples. The nucleate boiling mode of heat transfer was selected for experiments with distilled water and ethyl alcohol as working fluids.

  7. Effect of acrylonitrile on the electrode processes ivolving copper cations

    Directory of Open Access Journals (Sweden)

    Viktor F. Vargalyuk

    2016-03-01

    Full Text Available Based on the results of cyclic voltammetry and study of deposits morphology, it has been shown that acrylonitrile does not have significant effect on the mechanism of Cu2+ + 2ē → Cu0 reaction. This distinguishes acrylonitrile from the unsaturated polyfunctional organic substances (acrylic acid, acrylamide which forms stable complexes with Cu2+ ions. Acrylonitrile just inhibits cathodic process by adsorbing on the surface of electrode thus blocking its active sites. But the presence of acrylonitrile significantly changes the mechanism of the anodic process. It has been found that acrylonitrile interacts with surface copper atoms thus forming thermodynamically stable [Cu π-AN]0 π‑complexes. Ionization potential of these π‑complexes is more negative if compare to copper atoms. As the result acceleration of anodic process takes place in the low polarization area. However, since the chemisorption is a slow process the presence of acrylonitrile mainly affects dissolution of the first surface layers of copper atoms. Further ionization of copper atoms runs out directly and requires higher polarization.

  8. Use of copper radioisotopes in investigating disorders of copper metabolism

    Energy Technology Data Exchange (ETDEWEB)

    Camakaris, J.; Voskoboinik, I.; Brooks, H.; Greenough, M. [University of Melbourne, Parkville, VIC (Australia). Department of Genetics; Smith, S. [Australian Nuclear Science and Technology Organisation (ANSTO), Lucas Heights, NSW (Australia). Radiopharmaceuticals Division; Mercer, J. [Deakin University, Rusden Campus, Clayton, VIC (Australia). Centre of Cellular and Molecular Biology

    1998-12-31

    Full text: Copper is an essential trace element for life as a number of vital enzymes require it. Copper deficiency can lead to neurological disorders, osteoporosis and weakening of arteries. However Cu is also highly toxic and homeostatic mechanisms have evolved to maintain Cu at levels which satisfy requirements but do not cause toxicity. Toxicity is mediated by the oxidative capacity of Cu and its ability to generate toxic free radicals. There are several acquired and inherited diseases due to either Cu toxicity or Cu deficiency. The study of these diseases facilitates identification of genes and proteins involved in copper homeostasis, and this in turn will provide rational therapeutic approaches. Our studies have focused on Menkes disease in humans which is an inherited and usually lethal copper deficiency. Using copper radioisotopes {sup 64}Cu (t 1/2 = 12.8 hr) and {sup 67}Cu (t 1/2 = 61 hr) we have studied the protein which is mutated in Menkes disease. This is a transmembrane copper pump which is responsible for absorption of copper into the body and also functions to pump out excess Cu from cells when Cu is elevated. It is therefore a vital component of normal Cu homeostasis. We have provided the first biochemical evidence that the Menkes protein functions as a P-type ATPase Cu pump (Voskoboinik et al., FEBS Letters, in press) and these data will be discussed. The assay involved pumping of radiocopper into purified membrane vesicles. Furthermore we have transfected normal and mutant Menkes genes into cells and are carrying out structure-function studies. We are also studying the role of amyloid precursor protein (APP) as a Cu transport protein in order to determine how Cu regulates this protein and its cleavage products. These studies will provide vital information on the relationship between Cu and APP and processes which lead to Alzheimers disease

  9. Improving Beneficiation of Copper and Iron from Copper Slag by Modifying the Molten Copper Slag

    Directory of Open Access Journals (Sweden)

    Zhengqi Guo

    2016-04-01

    Full Text Available In the paper, a new technology was developed to improve the beneficiation of copper and iron components from copper slag, by modifying the molten slag to promote the mineralization of valuable minerals and to induce the growth of mineral grains. Various parameters, including binary basicity, dosage of compound additive, modification temperature, cooling rate and the end point temperature of slow cooling were investigated. Meanwhile, optical microscope, scanning electron microscope and energy dispersive spectrometer (SEM-EDS was employed to determine the mineralogy of the modified and unmodified slag, as well as to reveal the mechanisms of enhancing beneficiation. The results show that under the proper conditions, the copper grade of rougher copper concentrate was increased from 6.43% to 11.04%, iron recovery of magnetic separation was increased significantly from 32.40% to 63.26%, and other evaluation indexes were changed slightly, in comparison with unmodified copper slag. Moreover, matte and magnetite grains in the modified slag aggregated together and grew obviously to the mean size of over 50 μm, resulting in an improvement of beneficiation of copper and iron.

  10. Electrochemical behaviour of copper in N,N-dimethylformamide + 0.5 M potassium perchlorate solution

    Directory of Open Access Journals (Sweden)

    S. MENTUS

    2000-09-01

    Full Text Available The electrochemical deposition and dissolution of copper in 0.0025 M CuSO4 + N,N-dimethylformamide + 0.5 M KClO4 solution was examined by the rotating disc and potentiodynamic methods. Both platinum and copper were used as working electrodes. A wide polarization range –1 to +2 V vs. SCE, and several temperatures between 25 and 55°C were encompased. The Cu/electrolyte interface was found to be permanently out of equilibrium, as a consequence of the development of a passivating layer. In accordance with the classic theory of a copper electrode in acidified aqueous solutions, the cathodic and anodic Tafel lines of metallic copper define a unique value of the exchange current density, however, their slopes do not correspond to the classic theory.

  11. The Origin of High Thermal Conductivity and Ultralow Thermal Expansion in Copper-Graphite Composites.

    Science.gov (United States)

    Firkowska, Izabela; Boden, André; Boerner, Benji; Reich, Stephanie

    2015-07-08

    We developed a nanocomposite with highly aligned graphite platelets in a copper matrix. Spark plasma sintering ensured an excellent copper-graphite interface for transmitting heat and stress. The resulting composite has superior thermal conductivity (500 W m(-1) K(-1), 140% of copper), which is in excellent agreement with modeling based on the effective medium approximation. The thermal expansion perpendicular to the graphite platelets drops dramatically from ∼20 ppm K(-1) for graphite and copper separately to 2 ppm K(-1) for the combined structure. We show that this originates from the layered, highly anisotropic structure of graphite combined with residual stress under ambient conditions, that is, strain-engineering of the thermal expansion. Combining excellent thermal conductivity with ultralow thermal expansion results in ideal materials for heat sinks and other devices for thermal management.

  12. Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate

    Institute of Scientific and Technical Information of China (English)

    TIAN Yan-hong; WANG Chun-qing; Y. Norman ZHOU

    2008-01-01

    The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.

  13. Electrocrystallizations of copper on glassy carbon in CuCl2 silica sol and aqueous solutions

    Institute of Scientific and Technical Information of China (English)

    Yan Yan Feng; Min Gu; Yun Gui Du

    2012-01-01

    Electrocrystallizations of copper from both CuCl2 silica sol and aqueous solutions were studied by the chronoamperometry technique.It was found that current density contributions of the double-layer charging (iDL) in current-time transients (CTTs) from both of the solutions were large.An adsorption-nucleation based model was proposed to analyze quantitatively the CTTs,by which copper electrocrystallization mechanism was characterized as progressive nucleation with 3D growth (3DP) under diffusion control.The diffusion coefficient of copper ions and the AN∞ products in aqueous solutions were larger than that in silica sols,which indicated that copper nucleation was inhibited in sol solution.The large iDL may be resulted from the adsorption of chloride ions on the electrode surface.

  14. High performance transparent conductor of graphene wrapped copper/nickel microgrids

    Science.gov (United States)

    Wu, Wei; Tassi, Nancy G.; Walls, Dennis J.; Zhang, Lei; Willner, Bruce

    2014-12-01

    A high performance, highly stable transparent conducting structure based on microscale copper/nickel grids wrapped with graphene is presented. Graphene is selectively deposited on the surfaces of the microgrids by atmospheric pressure chemical vapor deposition method. The optical transmittance of the copper/nickel microgrid sample is ˜80% over the visible and near-infrared spectra with a very small sheet resistance of ˜0.58 Ω/sq. After the high temperature deposition of graphene, the sample's transmittance increases to be ˜90% due to the line width reduction of the microgrids while the sheet resistance also increases to ˜5 Ω/sq. The graphene layer is deposited to keep the copper/nickel surfaces from being oxidized in the air. Both stability testing and composition spectra results confirm the long-term stability of the copper/nickel microgrids wrapped with graphene.

  15. Effects of Copper and Titanium Elements on the Coating's Properties of Hot-Dipping-Aluminum Steel

    Institute of Scientific and Technical Information of China (English)

    JIA Wei-ping; MA Yun-long; HU Lin; KE Wei

    2004-01-01

    The steel plates for testing obtained a clean and fresh surface after degreasing by alkali and acidity and to be protested from reoxidation by being dipped into liquid wax. The results after hot dipping experiments in lab. showed that a complete aluminized coat with a good property could be obtained under a condition of hot-dipping temperature at about 730 ℃, hot -dipping time at about 2 minutes. It was found that the transition layer was mainly composed of Fe2 Al5 intermetallic compound by SEM (Scanning Electronic Microscope) observation. Effects of elements copper and titanium in aluminum coating on adherence quality, corrosion resistance performance and thickness of the transition layer were investigated, the following results were drawn: The adherence quality is strongly enhancedby copper element and gives the best performance at the 2% mass percent content of copper, while it is almost indifferent with titanium content. The corrosion resistance property is enhanced by titanium and is deteriorated by copper, when the mass percent content of titaniumis 0.3% , the coating exhibits the best anti-corrosion performance. At present condition, both copper and titanium make transition layer thinner.

  16. Renal cortex copper concentration in acute copper poisoning in calves

    Directory of Open Access Journals (Sweden)

    Luis E. Fazzio

    2012-01-01

    Full Text Available The aim of this study was to estimate the diagnostic value of renal cortex copper (Cu concentration in clinical cases of acute copper poisoning (ACP. A total of 97 calves that died due to subcutaneous copper administration were compiled in eleven farms. At least, one necropsy was conducted on each farm and samples for complementary analysis were taken. The degree of autolysis in each necropsy was evaluated. The cases appeared on extensive grazing calf breeding and intensive feedlot farms, in calves of 60 to 200 kg body weight. Mortality varied from 0.86 to 6.96 %, on the farms studied. The first succumbed calf was found on the farms between 6 and 72 hours after the susbcutaneous Cu administration. As discrepancies regarding the reference value arose, the local value (19.9 parts per million was used, confirming the diagnosis of acute copper poisoning in 93% of the analyzed kidney samples. These results confirm the value of analysis of the cortical kidney Cu concentration for the diagnosis of acute copper poisoning.

  17. Copper metallurgy at the crossroads

    Directory of Open Access Journals (Sweden)

    Habashi F.

    2007-01-01

    Full Text Available Copper technology changed from the vertical to the horizontal furnace and from the roast reaction to converting towards the end of the last century. However, the horizontal furnace proved to be an inefficient and polluting reactor. As a result many attempts were made to replace it. In the past 50 years new successful melting processes were introduced on an industrial scale that were more energy efficient and less polluting. In addition, smelting and converting were conducted in a single reactor in which the concentrate was fed and the raw copper was produced. The standing problem in many countries, however, is marketing 3 tonnes of sulfuric acid per tonne of copper produced as well as emitting large amounts of excess SO2 in the atmosphere. Pressure hydrometallurgy offers the possibility of liberating the copper industry from SO2 problem. Heap leaching technology has become a gigantic operation. Combined with solvent extraction and electrowinning it contributes today to about 20% of copper production and is expected to grow. Pressure leaching offers the possibility of liberating the copper industry from SO2 problem. The technology is over hundred years old. It is applied for leaching a variety of ores and concentrates. Hydrothermal oxidation of sulfide concentrates has the enormous advantage of producing elemental sulfur, hence solving the SO2 and sulfuric acid problems found in smelters. Precipitation of metals such as nickel and cobalt under hydrothermal conditions has been used for over 50 years. It has the advantage of a compact plant but the disadvantage of producing ammonium sulfate as a co-product. In case of copper, however, precipitation takes place without the need of neutralizing the acid, which is a great advantage and could be an excellent substitute for electrowinning which is energy intensive and occupies extensive space. Recent advances in the engineering aspects of pressure equipment design open the door widely for increased

  18. Effects of processing conditions and ambient environment on the microstructure and fracture strength of copper/niobium/copper interlayer joints for alumina

    Energy Technology Data Exchange (ETDEWEB)

    Marks, Robert Alan [Univ. of California, Berkeley, CA (United States)

    1999-12-01

    Partial transient liquid phase (PTLP) bonding is a technique which can be used to join ceramics with metals and is used to form niobium-based joints for alumina. The principal advantage to PTLP bonding is that it enables refractory joints to be fabricated at temperatures below those typically required by solid state diffusion bonding. A thorough review of the important parameters (chemical compatibility, thermal expansion match, sufficient wettability of the liquid phase on the solid phases) in choosing a joining material for ceramics by the PTLP method is provided. As in conventional PTLP joining, the current study uses thin (=3 μm) copper layers sandwiched between the alumina (bulk) and niobium (127 μm). However, unlike the case of copper/nickel/copper obium is limited. Consequently, the copper is not entirely dissolved in the process, resulting in a two phase (copper-rich and niobium-rich phases) microstructure. Different processing conditions (temperature and applied load) result in different morphologies of the copper-rich and niobium-rich phases at the interface. These different microstructures exhibit distinct strength characteristics. Extended annealing of as-processed joints can influence the strengths differently depending on the ambient partial oxygen pressure at the annealing temperature. The focus of this work is to correlate processing conditions, microstructure, and resulting joint strength. Under optimum processing conditions (1400°C, 2.2 MPa), joints with strengths in excess of 200 MPa at 1200°C are fabricated.

  19. Obtenção de filmes espessos de seleneto de cobre sobre carbono vítreo, ouro, titânio e cobre Obtaining copper selenide thick films on vitreous carbon, gold, titanium and copper

    Directory of Open Access Journals (Sweden)

    Adriano César Rabelo

    2007-04-01

    Full Text Available Copper selenide (berzelianite films were prepared on the title substrates using the chemical bath deposition technique (CBD. Film composition was determined by energy dispersion of x-rays. The kinetics of film growth is parabolic and film adherence limits the film thickness. On titanium, copper selenide forms islands that do not completely cover the surface, unless the substrate is prepared with a tin oxide layer; film composition also depends on the titanium oxide layer. On vitreous carbon, CBD and mechanical immobilization techniques lead to films with similar resistances for the electron transfer across the film/substrate interface. On gold, composition studies revealed that film composition is always the same if the pH is in the range from 8 to 12, in contrast to films prepared by an ion-ion combination route. On copper, a new procedure for obtaining copper selenide films as thick as 5 µm has been developed.

  20. The Impedance of Multi-layer Vacuum Chambers

    CERN Document Server

    Vos, L

    2003-01-01

    Many components of the LHC vacuum chamber have multi-layered walls : the copper coated cold beam screen, the titanium coated ceramic chamber of the dump kickers, the ceramic chamber of the injection kickers coated with copper stripes, only to name a few. Theories and computer programs are available for some time already to evaluate the impedance of these elements. Nevertheless, the algorithm developed in this paper is more convenient in its application and has been used extensively in the design phase of multi-layer LHC vacuum chamber elements. It is based on classical transmission line theory. Closed expressions are derived for simple layer configurations, while beam pipes involving many layers demand a chain calculation. The algorithm has been tested with a number of published examples and was verified with experimental data as well.

  1. Copper corrosion mechanism in the presence of formic acid vapor for short exposure times

    Energy Technology Data Exchange (ETDEWEB)

    Bastidas, J.M.; Lopez-Delgado, A.; Cano, E.; Polo, J.L.; Lopez, F.A.

    2000-03-01

    The rate of copper corrosion originated by the action of formic acid vapors at 100% relative humidity was studied. Five formic vapor concentration levels (10, 50, 100, 200, and 300 ppm) were used. A copper corrosion rate of up to 1,300 mg/m{sup 2} d was measured for a period of 21 days using a gravimetric method. The patina layers were characterized using cathodic reduction, X-ray powder diffraction. Fourier transform infrared spectrometry, and scanning electron microscopy techniques. Some of the components identified in the corrosion-product layers were cuprite (Cu{sub 2}O), cupric hydroxide hydrate [Cu(OH){sub 2}{sm_bullet}H{sub 2}O], and copper formate hydrate [Cu(HCOO){sub 2}{sm_bullet}4H{sub 2}O]. The latter was formed by both cupric hydroxide and formic acid-cuprous ion complex mechanisms.

  2. Ordered assembly of alpha-quinquethiophene on a copper oxide nanotemplate.

    Science.gov (United States)

    Cicoira, Fabio; Miwa, Jill A; Melucci, Manuela; Barbarella, Giovanna; Rosei, Federico

    2006-11-01

    The organic semiconductor alpha-quinquethiophene (T5) is used as the active layer in organic field-effect transistors. We have investigated the adsorption of T5 on the (110) surface of copper and on the CuO nanotemplate formed by the high-temperature exposure of Cu(110) to molecular oxygen. The results were obtained with high-resolution scanning tunneling microscopy (STM) under ultra-high-vacuum (UHV) conditions. The adsorption of T5 on copper is an important model system because it mimics the active-layer-electrode interface in organic devices. The molecules were observed to adsorb onto both the pristine Cu(110) surface and the CuO nanotemplate, showing a greater affinity for the pristine copper surface. Surprisingly, however, the T5 molecules assembled with a much higher degree of long-range order on the oxygen-passivated portion of the surface.

  3. Recovery of Pb-Sn Alloy and Copper from Photovoltaic Ribbon in Spent Solar Module

    Science.gov (United States)

    Lee, Jin-Seok; Ahn, Young-Soo; Kang, Gi-Hwan; Wang, Jei-Pil

    2017-09-01

    This research was attempted to recover metal alloy and copper from photovoltaic ribbon (PV ribbon) of spent solar module by means of thermal treatment. In this study, thermal method newly proposed was applied to remove coating layer composed of tin and lead and separate copper substrate. Using thermal treatment under reductive gas atmosphere with CH4 gas coating layer was easily melted down at the range of temperature of 700 °C to 800 °C. In the long run, metal alloy and copper substrate were successfully obtained and their chemical compositions were examined by inductively coupled plasma mass spectrometry (ICP-MS), scanning electron microscopy (SEM) and energy dispersive x-ray Spectroscopy (EDS).

  4. Copper-Coated Liquid-Crystalline Elastomer via Bioinspired Polydopamine Adhesion and Electroless Deposition.

    Science.gov (United States)

    Frick, Carl P; Merkel, Daniel R; Laursen, Christopher M; Brinckmann, Stephan A; Yakacki, Christopher M

    2016-12-01

    This study explores the functionalization of main-chain nematic elastomers with a conductive metallic surface layer using a polydopamine binder. Using a two-stage thiol-acrylate reaction, a programmed monodomain is achieved for thermoreversible actuation. A copper layer (≈155 nm) is deposited onto polymer samples using electroless deposition while the samples are in their elongated nematic state. Samples undergo 42% contraction when heated above the isotropic transition temperature. During the thermal cycle, buckling of the copper layer is seen in the direction perpendicular to contraction; however, transverse cracking occurs due to the large Poisson effect experienced during actuation. As a result, the electrical conductivity of the layer reduced quickly as a function of thermal cycling. However, samples do not show signs of delamination after 25 thermal cycles. These results demonstrate the ability to explore multifunctional liquid-crystalline composites using relatively facile synthesis, adhesion, and deposition techniques.

  5. In-situ investigation of the microstructure evolution in nanocrystalline copper electrodeposits at room temperature

    DEFF Research Database (Denmark)

    Pantleon, Karen; Somers, Marcel A. J.

    2006-01-01

    The microstructure evolution in copper electrodeposits at room temperature (self-annealing) was investigated by means of x-ray diffraction analysis and simultaneous measurements of the electrical resistivity as a function of time. In situ studies were started immediately after deposition...... growth, crystallographic texture changes by multiple twinning, and a decrease of the electrical resistivity occurred as a function of time at room temperature. The kinetics of self-annealing is strongly affected by the layer thickness: the thinner the layer, the slower the microstructure evolution is...... of the various thick layers and continued with a unique time resolution until stabilization of the recorded data occurred. Independent of the copper layer thickness, the as-deposited microstructure consisted of nanocrystalline grains with orientation dependent crystallite sizes. Orientation dependent grain...

  6. 21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

    Science.gov (United States)

    2010-04-01

    ... (chlorophyllin-copper complex). 73.1125 Section 73.1125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color additive potassium sodium copper chlorophyllin is a green to black powder obtained from chlorophyll...

  7. 21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). 73.2125 Section 73.2125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity...

  8. Testing Corrosion Inhibitors for the Conservation of Archaeological Copper and Copper Alloys

    Directory of Open Access Journals (Sweden)

    Robert B. Faltermeier

    1997-11-01

    Full Text Available This is a synopsis of the Ph.D. research undertaken at the Institute of Archaeology, University College London. The aim was to evaluate corrosion inhibitors for use in the conservation of copper and copper alloy archaeological artefacts. The objective of this work was to acquire an insight into the performance of copper corrosion inhibitors, when applied to archaeological copper.

  9. Underwater explosive welding of thin tungsten foils and copper

    Energy Technology Data Exchange (ETDEWEB)

    Manikandan, P., E-mail: manikandan_exp@yahoo.com [Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555 (Japan); Lee, J.O.; Mizumachi, K. [Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555 (Japan); Mori, A. [Department of Mechanical Engineering, Sojo University, 4-22-1 Ikeda, Kumamoto 860-0082 (Japan); Raghukandan, K. [Department of Manufacturing Engineering, Annamalai University, Annamalainagar, Cuddalore District, Tamilnadu 608 002 (India); Hokamoto, K. [Shock Wave and Condensed Matter Research Center, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555 (Japan)

    2011-11-15

    Highlights: > Underwater explosive welding was used to clad tungsten and copper. > The preset inclination was varied and the microstructure was observed. > Microstructure reveals a clear wavy interface for higher preset inclination. > High pressure and high strain rate leads to plastic flow of tungsten. - Abstract: This study demonstrates the ability to clad pure tungsten foils on copper plate using underwater shock waves generated by the detonation of explosive. Microstructural characterization revealed that a higher preset inclination results in wavy morphology. Weld formed at lower inclination exhibit a planar interfacial layer comprising fine grained particles of both components. The plastic flow of tungsten is ascribed to the synergistic influence of high pressure and high strain rate at the collision point.

  10. Copper red glazes: a coating with two families of particles

    CERN Document Server

    Cuvelier, Pierre-Antoine; Chaudanson, Damien; Lafait, Jacques; Nitsche, S; 10.1007/s00339-011-6707-3

    2013-01-01

    In order to explain the origin of the deep red color of copper glazes on ceramics, a ceramist has elaborated, by firing under reducing atmosphere, a significant number of tiles. The analysis of the structure and composition of a representative sample by TEM and EELS, followed by an optical characterization and an optical modeling using the radiative transfer approach (four-flux model) have enabled a comprehensive explanation of the origin of the color in these glazes. The presence of two families of copper nanoparticles in the vitreous matrix. The first, purely absorbing, of diameter 10-50 nm, essentially creates color by a substractive process. The second, due to its larger diameter, 100 nm or more, mainly acts on color by scattering of the visible light. Both act competitively in the layer. A color chart of all the hues which can be reached by this technique has eventually been theoretically calculated.

  11. Erosion of Copper Target Irradiated by Ion Beam

    CERN Document Server

    Polosatkin, S V; Grishnyaev, E S; Konstantinov, S G; Shoshin, A A

    2012-01-01

    Erosion of copper target irradiated by deuterium ion beam with ultimate fluence is studied. The target originally destined for neutron generation represents bulk copper substrate covered by 3-\\mum titanium layer. The target was irradiated by deuterium ion beam generated in Bayard-Alpert type ion source with energy of ions 17.5 keV/nuclear. Maximal fluence in the center of the target achieves 2.5x10^23atoms/cm^2. Measurements of the profile of irradiated target and estimation of fluence shows that physical sputtering is a dominating process that determines the target erosion Most interesting feature is growth of \\mum-size tadpole-shaped structures, localized in the cracks of the surface. RFA analysis of these structures showed extremely large (up to 60%at.) carbon content.

  12. Investigations of Interface Properties in Copper-Silicon Carbide Composites

    Directory of Open Access Journals (Sweden)

    Chmielewski M.

    2017-06-01

    Full Text Available This paper analyses the technological aspects of the interface formation in the copper-silicon carbide composite and its effect on the material’s microstructure and properties. Cu-SiC composites with two different volume content of ceramic reinforcement were fabricated by hot pressing (HP and spark plasma sintering (SPS technique. In order to protect SiC surface from its decomposition, the powder was coated with a thin tungsten layer using plasma vapour deposition (PVD method. Microstructural analyses provided by scanning electron microscopy revealed the significant differences at metal-ceramic interface. Adhesion force and fracture strength of the interface between SiC particles and copper matrix were measured. Thermal conductivity of composites was determined using laser flash method. The obtained results are discussed with reference to changes in the area of metal-ceramic boundary.

  13. Investigation on a Roman copper alloy artefact from Pompeii (Italy).

    Science.gov (United States)

    Baraldi, Pietro; Baraldi, Cecilia; Ferrari, Giorgia; Foca, Giorgia; Marchetti, Andrea; Tassi, Lorenzo

    2006-01-01

    A selection of samples, obtained from a particular copper-alloy domestic artefact of Roman style from Pompeii, has been analysed by using different techniques (IR, Raman, SEM-EDX, FAAS), in order to investigate the chemical nature and composition of the metals utilised for such manufacturing pieces. The surface analysis of the bright red metallic microfragments conducted by different analytical techniques, emphasises the presence of pure unalloyed copper and confirms the absence of other metallic species on the upper layers. On the contrary, the mapping analysis of the section of the laminar metal of the investigated sample shows a consistent enrichment in tin content. Finally, destructive analysis by FAAS confirms that the artefact looks like a bronze metal alloy, with a medium Sn content of about 6.5%.

  14. Electrochemical behavior of different shelled microcapsule composite copper coatings

    Science.gov (United States)

    Xu, Xiu-Qing; Guo, Yan-Hong; Li, Wei-Ping; Zhu, Li-Qun

    2011-06-01

    Copper/liquid microcapsule composite coatings with polyvinyl alcohol (PVA), gelatin or methyl cellulose (MC) as shell materials were prepared by electrodeposition. The influence of shell materials on the corrosion resistance of the composite coatings in 0.1 M H2SO4 was investigated by means of electrochemical techniques, scanning electron microscopy (SEM), and energy dispersion spectrometry (EDS). The results show that the participation of microcapsules can enhance the corrosion resistance of the composite coatings compared with the traditional copper layer. Based on the analysis of electrochemical test results, the release ways of microcapsules were deduced. Gelatin and MC as the shell materials of microcapsules are easy to release quickly in the composite coating. On the contrary, the releasing speed of PVA microcapsules is relatively slow due to their characteristics.

  15. The link between copper and Wilson's disease.

    Science.gov (United States)

    Purchase, Rupert

    2013-01-01

    Wilson's disease (hepatolenticular degeneration) is a rare inherited autosomal recessive disorder of copper metabolism leading to copper accumulation in the liver and extrahepatic organs such as the brain and cornea. Patients may present with combinations of hepatic, neurological and psychiatric symptoms. Copper is the therapeutic target for the treatment of Wilson's disease. But how did copper come to be linked with Wilson's disease? The answer encompasses a study of enzootic neonatal ataxia in lambs in the 1930s, the copper-chelating properties of British Anti-Lewisite, and the chemical analysis for copper of the organs of deceased Wilson's disease patients in the mid-to-late 1940s. Wilson's disease is one of a number of copper-related disorders where loss of copper homeostasis as a result of genetic, nutritional or environmental factors affects human health.

  16. Determination of copper in clarified apple juices.

    Science.gov (United States)

    Zeiner, Michaela; Juranović Cindrić, Iva; Kröppl, Michaela; Stingeder, Gerhard

    2010-03-24

    Inorganic copper compounds are not considered as synthetic fertilizers for apple trees as they are traditional fertilizers. Thus, they are used in organic farming for soil or foliar applications. The European Union is for health reasons interested in reducing copper in apple orchards. Because the fertilizer application rate affects the nutrition of apples, the applied copper might also be reflected in the copper concentration of apple juices. Thus, the determination of copper is of concern for investigating the application of copper-containing fertilizers. Samples of clarified apple juice commercially available in the European market were analyzed for their copper content. Prior to quantification by inductively coupled plasma-optical emission spectrometry, the juices were processed by a microwave-assisted digestion system using HNO(3). All samples were also measured directly after dilution with HNO(3). The copper concentrations measured using both methods were all below the limit of detection (17 microg/L).

  17. Synthesis of aminoarenethiolato-copper(I) complexes

    NARCIS (Netherlands)

    Sperotto, E.; van Klink, G.P.M.; van Koten, G.

    2008-01-01

    Copper(I)-mediated reactions have recently become the choice for large industrial scale applications, since copper is environmentally friendly and cheaper than other transition metals already explored. However, most organocopper compounds still present several limitations including the sensitivity t

  18. Global assessment of undiscovered copper resources

    Data.gov (United States)

    U.S. Geological Survey, Department of the Interior — Deposits, prospects, and permissive tracts for porphyry and sediment-hosted copper resources worldwide, with estimates of undiscovered copper resources. pCu_tracts...

  19. EFFECT OF COPPER ON PASSIVITY AND CORROSION ...

    African Journals Online (AJOL)

    2014-06-30

    Jun 30, 2014 ... metallic copper enriched on the surface film of austenitic stainless ... Dispersed inclusions of this phase can influence the stability of .... two microstructures showed that copper concentration possessed a non-uniform chemical.

  20. Copper tolerance and virulence in bacteria

    Science.gov (United States)

    Ladomersky, Erik; Petris, Michael J.

    2015-01-01

    Copper (Cu) is an essential trace element for all aerobic organisms. It functions as a cofactor in enzymes that catalyze a wide variety of redox reactions due to its ability to cycle between two oxidation states, Cu(I) and Cu(II). This same redox property of copper has the potential to cause toxicity if copper homeostasis is not maintained. Studies suggest that the toxic properties of copper are harnessed by the innate immune system of the host to kill bacteria. To counter such defenses, bacteria rely on copper tolerance genes for virulence within the host. These discoveries suggest bacterial copper intoxication is a component of host nutritional immunity, thus expanding our knowledge of the roles of copper in biology. This review summarizes our current understanding of copper tolerance in bacteria, and the extent to which these pathways contribute to bacterial virulence within the host. PMID:25652326

  1. Copper-gold nanoparticles: Fabrication, characteristic and application as drug carriers

    Energy Technology Data Exchange (ETDEWEB)

    Woźniak-Budych, Marta J., E-mail: marta.budych@amu.edu.pl; Langer, Krzysztof; Peplińska, Barbara; Przysiecka, Łucja; Jarek, Marcin; Jarzębski, Maciej; Jurga, Stefan

    2016-08-15

    In this investigation, the fabrication of porous core/shell nanostructures consisting of copper (core) and copper-gold nanoalloy (shell) for medical applications is presented. As a core triangular-shaped copper nanoparticles were used. The porous bimetallic nanoshell was prepared via galvanic reaction in the presence of oil-in water emulsion. It was proved that porous nanoalloy layer can be prepared at pH 7 and in the presence 0.1% and 0.5% oil-in water emulsion. The porous structure fabrication was mainly determined by volume fraction of hexadecane to acetone in the oil-in water emulsion and Zeta-potential of emulsion droplets (pH of emulsion). The influence of emulsion droplets size before galvanic reaction on porous structure preparation was negligible. It was found that doxorubicin could be easily introduced and released from porous core/shell nanostructures, due to spontaneous adsorption on the copper-gold nanoporous surface. The in vitro test showed that cytotoxic effect was more prominent once the doxorubicin was adsorbed on the porous copper-gold nanocarriers. It was demonstrated, that doxorubicin-loaded copper-gold nanostructures caused inhibition cell proliferation and viability of cancer cells, in a concentration-dependent manner. The results indicates that presented coper-gold nanocarrier have potential to be used in targeted cancer therapy, due to its porous structure and cytotoxic effect in cancer cells. - Highlights: • Porous copper-gold nanostructure as a cytostatic drug carrier was prepared. • Kinetics and thermodynamics of drug adsorption were studied. • DOX-loaded copper-gold nanoparticles showed a pH-controlled release rate. • DOX-loaded copper-gold NPs caused inhibition cell proliferation of cancer cells. • The Cu-Au NPs could serve as a theranostic platform for biomedical applications.

  2. 八羧基铜酞菁修饰海藻酸钠阳膜层制备CuPc(COOH)_8-SA/mCS双极膜及其表征%Preparation and Characterization of CuPc(COOH)_8-SA/mCS Bipolar Membrane Modified by Copper Octocarboxyphthalocyanine in Cation Layer

    Institute of Scientific and Technical Information of China (English)

    陈日耀; 陈震; 郑曦; 陈晓; 张娟灵

    2009-01-01

    In this paper,the sodium alginate(SA)cation layer was modified by copper octocarboxyphthalocyanine (CuPc(COOH)_8),then the CuPc(COOH)_8-SA and chitosan(CS)were modified by Fe~(3+)and ghtaraldehyde as linking reagents to prepare CuPc(COOH)-8-SA/mCS bipolar membrane(BPM).The FTIR and SEM were used to characterize the CuPc(COOH)_8-SMmCS BPM.The CuPc(COOH)-8 can promote water splitting at the interlayer of the CuPc (COOH)_8-SA/mCS BPM.For comparison with the CuPc(COOH)_8-SA/mCS BPM,the mSA/mCS BPMs modified by Fe~(3+)and ferrocene were prepared.The experimental results showed that the ion exchange capacity and hydrogen ion transmigration rate of the CuPc(COOH)_8-SA cation exchange membrane were increased.In comparison with the mSA/mCS BPM modified by Fe~(3+)or ferrocene,the membrane impedance,IR drop and swelling degree of the CuPc(COOH)_8-SA/mCS BPM were decreased.The BPM was stable in an acid solution(c_(H~+)<8 mol·L~(-1).%在海藻酸钠(SA)中添加八羧基铜酞菁(CuPc(COOH)_8),并分别用Fe~(3+)离子和戊二醛作为交联剂对海藻酸钠一八羧基铜酞菁阳膜层和壳聚糖(CS)阴膜层进行改性,制备了八羧基铜酞菁-海藻酸钠/改性壳聚糖双极膜(CuPe(COOH)_8-SA/BPM).在海藻酸钠中添加八羧基铜酞菁以促进中间层中水的解离.用FTIR、SEM等对制备的CuPc(COOH)_8-SMmCS双极膜进行了表征.作为比对,制备了Fe~(3+)离子改性的Fe-SA/mCS双极膜和二茂铁(Fc)离子改性的Fc-SA/mCS双极膜.实验结果表明,CuPc(COOH)8-SA阳离子交换膜的离子交换容量、H+离子透过率均获得提高.与Fe~(3+)离子改性或二茂铁离子改性的mSA/mCS双极膜相比,CuPc(COOH)_8-SA/mCS双极膜的阻抗、电阻压降(IR降)和溶胀度降低,在H+离子浓度低于8 mol·L~(-1)的酸溶液中具有稳定的工作性能.

  3. Preparation of Pure Copper Powder from Acidic Copper Chloride Waste Etchant

    Institute of Scientific and Technical Information of China (English)

    2008-01-01

    The method for the recycling of copper from copper chloride solution was developed. This process consists of extraction of copper, purification and particle size reduction. In the first step, reductive metal scraps were added to acidic copper chloride waste enchants produced in the PCB industry to obtain copper powder.Composition analysis showed that this powder contained impurities such as Fe, Ni, and water. So, drying and purification were carried out by using microwave and a centrifugal separator. Thereby the copper powder had a purity of higher than 99% and spherical form in morphology. The copper powder size was decreased by ball milling.

  4. Coating of a steel wire with copper

    Science.gov (United States)

    Vdovin, K. N.; Dubskii, G. A.; Nefed'ev, A. A.; Derevyanko, D. V.

    2016-03-01

    The process of coating of a steel wire with liquid copper at a high speed (>1 m/s) is considered. The results of long-term studies of copperizing under laboratory conditions and electron-microscopic investigation of the copper-steel adhesion are used to develop a mathematical model for coating of a steel wire with copper and to create a commercial setup to implement this process.

  5. Canine Models for Copper Homeostasis Disorders

    OpenAIRE

    Xiaoyan Wu; Leegwater, Peter A. J.; Hille Fieten

    2016-01-01

    Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and neurological impairments. A lack in genotype-phenotype correlation in Wilson disease points toward the influence of environmental factors or modifying genes. In a number of Non-Wilsonian forms of copper me...

  6. 49 CFR 192.279 - Copper pipe.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 3 2010-10-01 2010-10-01 false Copper pipe. 192.279 Section 192.279... Copper pipe. Copper pipe may not be threaded except that copper pipe used for joining screw fittings or... heavier wall pipe listed in Table C1 of ASME/ANSI B16.5. [Amdt. 192-62, 54 FR 5628, Feb. 6, 1989, as...

  7. Modulation of tau phosphorylation by environmental copper

    OpenAIRE

    Voss, Kellen; Harris, Christopher; Ralle, Martina; Duffy, Megan; Murchison, Charles; Joseph F. Quinn

    2014-01-01

    Background The transition metal copper enhances amyloid β aggregation and neurotoxicity, and in models of concomitant amyloid and tau pathology, copper also promotes tau aggregation. Since it is not clear if the effects of environmental copper upon tau pathology are dependent on the presence of pathological amyloid β, we tested the effects of copper overload and complexing in disease models which lack pathological amyloid β. Methods We used cell culture and transgenic murine models to test th...

  8. Canine Models for Copper Homeostasis Disorders

    OpenAIRE

    Xiaoyan Wu; Leegwater, Peter A.J.; Hille Fieten

    2016-01-01

    Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and neurological impairments. A lack in genotype-phenotype correlation in Wilson disease points toward the influence of environmental factors or modifying genes. In a number of Non-Wilsonian forms of copper me...

  9. Tensile behavior of nanocrystalline copper

    Energy Technology Data Exchange (ETDEWEB)

    Sanders, P.G.; Weertman, J.R. [Northwestern Univ., Evanston, IL (United States). Dept. of Materials Science and Engineering; Eastman, J.A. [Northwestern Univ., Evanston, IL (United States). Dept. of Materials Science and Engineering]|[Argonne National Lab., IL (United States). Materials Science Div.

    1995-11-01

    High density nanocrystalline copper produced by inert gas condensation was tested in tension. Displacements were measured using foil strain gauges, which greatly improved the accuracy of the strain data. The Young`s modulus of nanocrystalline copper was found to be consistent with that of coarse-grained copper. Total elongations of {approx} 1% were observed in samples with grain sizes less than 50 nm, while a sample with a grain size of 110 nm exhibited more than 10% elongation, perhaps signifying a change to a dislocation-based deformation mechanism in the larger-grained material. In addition, tensile tests were performed as a function of strain rate, with a possible trend of decreased strength and increased elongation as the strain rate was decreased.

  10. Monitoring copper in Wilson's disease.

    Science.gov (United States)

    Walshe, J M

    2010-01-01

    Monitoring copper metabolism in patients with Wilson's disease is not an exact science. At present, there are no simple methods of estimating the total body load of this metal. Indirect methods must therefore be used. A survey of the current literature shows that most approaches rely on the determination of blood and urine copper concentration. Both these should decrease with treatment. In parallel with decreased copper concentration, there should be subsequent improvement in more routine laboratory tests including liver and renal function, blood count parameters, and clotting factors. Lack of compliance is revealed by a reversal of this trend. This chapter critically reviews current testing methods and describes other approaches that may be helpful.

  11. Mechanochemical reduction of copper sulfide

    DEFF Research Database (Denmark)

    Balaz, P.; Takacs, L.; Jiang, Jianzhong

    2002-01-01

    The mechanochemical reduction of copper sulfide with iron was induced in a Fritsch P-6 planetary mill, using WC vial filled with argon and WC balls. Samples milled for specific intervals were analyzed by XRD and Mossbauer spectroscopy. Most of the reaction takes place during the first 10 min...... of milling and only FeS and Cu are found after 60 min. The main chemical process is accompanied by phase transformations of the sulfide phases as a result of milling. Djurleite partially transformed to chalcocite and a tetragonal copper sulfide phase before reduction. The cubic modification of FeS was formed...... first, transforming to hexagonal during the later stages of the process. The formation of off-stoichiometric phases and the release of some elemental sulfur by copper sulfide are also probable....

  12. Copper tolerance of Trichoderma species

    Directory of Open Access Journals (Sweden)

    Jovičić-Petrović Jelena

    2014-01-01

    Full Text Available Some Trichoderma strains can persist in ecosystems with high concentrations of heavy metals. The aim of this research was to examine the variability of Trichoderma strains isolated from different ecosystems, based on their morphological properties and restriction analysis of ITS fragments. The fungal growth was tested on potato dextrose agar, amended with Cu(II concentrations ranging from 0.25 to 10 mmol/l, in order to identify copper-resistant strains. The results indicate that some isolated strains of Trichoderma sp. show tolerance to higher copper concentrations. Further research to examine the ability of copper bioaccumulation by tolerant Trichoderma strains is needed. [Projekat Ministarstva nauke Republike Srbije, br. TR 31080 i br. III 43010

  13. Study of Titanizing the Surface of Copper Substrates by the Double Glow Discharge Plasma Surface Alloying Technique

    Institute of Scientific and Technical Information of China (English)

    Zhang Yuefei; Chen Fei; Lü Junxia; Su Yongan; Xu Zhong

    2005-01-01

    This paper discusses a study in which Ti surface alloying has been performed on copper substrates by means of a double glow discharge plasma surface alloying technique. The micro-structure, the phase structure, the micro-hardness and the distribution of Ti concentration of alloying layer were investigated in detail by XRD, SEM and so on. The effect of process parameters on the alloying layer was studied. The experimental results show that a Ti solid solution with the precipitation Cu4Ti alloying layer has been formed on the copper surface. The thickness of the alloying layer is about 120μm and the surface titanium concentration gradually decreases from w (Ti) = 87% to w (Ti) = 4%. The micro-hardness of the alloying layer is between 300 HV ~ 800 HV. Source sputtering, surface absorption, ion bombarding and high temperature diffusion are the major factors that affect the alloying layer.

  14. Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment

    Institute of Scientific and Technical Information of China (English)

    ZHANG Zhongbao; XU Shaofan

    2007-01-01

    In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature (62-65 ℃) with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2. The optimum procedure before plating aimed to add activated sites and the adjustment of the tradifonal composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 μm/h. X-ray diffraction (XRD) indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.

  15. Impact of atmospheric species on copper indium gallium selenide solar cell stability: An overview

    NARCIS (Netherlands)

    Theelen, M.

    2016-01-01

    An overview of the measurement techniques and results of studies on the stability of copper indium gallium selenide (CIGS) solar cells and their individual layers in the presence of atmospheric species is presented: in these studies, Cu(In,Ga)Se2 solar cells, their molybdenum back contact, and their

  16. The Corrosion Behavior of Stainless Steels and Copper Alloys Exposed to Natural Seawater

    Science.gov (United States)

    1991-01-01

    significant changes of the corrosion potential (Ecw) or surface properties. Rotating cylinder experiments indicated that both E., and corrosion rates for...and inorganic chloride corrosion layer that contained alloying elements; a biof ilm; and crystalline, spherical phosphate-rich deposits. All copper...nichtrostendem Stahl und bacteria and diatoms that did not cause significant changes of the Titan entstehenden dfinnen Biofilme bestanden aus

  17. THE STUDIES OF THE CURING OF AN EPOXY RESIN ON COPPER WIRE BY FTIR EXTERNAL REFLECTION SPECTROSCOPY

    Institute of Scientific and Technical Information of China (English)

    XUE Gi; LIU Shiying; JIANG Shangen

    1988-01-01

    The epoxy coating on copper wire has been studied by a modified sampling technique using Fourier transform infrared (FTIR) diffuse reflectance attachment. As the wire axis was parallel to the incident plane, a reflection spectrum of thin layer coating on a copper wire can be obtained. The study found that imidazole, especially the acetic acid treated imidazole, can be used as an effective curing catalyst of the epoxy resin on copper. This is the first report about the IR study of coatings on metal wires.

  18. Growth of a Copper-Gold Alloy Phase by Bulk Copper Electrodeposition on Gold Investigated by In Situ STM

    DEFF Research Database (Denmark)

    Andersen, Jens Enevold Thaulov; Møller, Per

    1995-01-01

    Simultaneous in situ scanning tunneling microscopy measurements and recordings of voltammograms were used to study in real time the initial cycles of potentiostatic copper electrodeposition and subsequent dissolution on a clean gold polycrystalline electrode. The cycles were carried out by sweeping...... the potential in the double-layer charging region from 500 to -100 mV and back to 500 mV at a sweep rate of 1 mV/s in an acidified copper sulfate electrolyte (0.01M H2SO4, 0.01M CuSO4, and Millipore water). After completion of the first cycle the gold surface had recrystallized and nuclei of an alloy phase were...... formed. After completion of subsequent cycles the distribution of crystallite dimensions and the shape of the crystallites changed and the growth was compared with features of concomitant voltammograms. Relations between charge densities and potentials were deduced from data of the voltammograms. A shift...

  19. Analysis of Ta-based Barrier Layer of Cu-interconnect by Second Ion Mass Spectrometry%Cu互连工艺中Ta基扩散阻挡层的二次离子质谱剖析

    Institute of Scientific and Technical Information of China (English)

    曹永明; 方培源; 姜蕾

    2004-01-01

    With the development of deep submicron integrated circuits (IC), copper metallization has been a replacement for conventional aluminum metallization in high density IC manufacture. But Cu is quite mobile in Si and has poor adhesion to Si or SiO2, which could degrade the performance of copper interconnect. Therefore, a diffusion barrier layer between copper interconnect and Si device is necessary. In this paper, Ta-based barrier layers are deposited on Si substrate with deposition technology of magnetron sputtering. The depth profile of copper interconnect and Ta-diffusion barrier layer are investigated by second ion mass spectrometry(SIMS).

  20. LIWU Copper Plans to Get Listed

    Institute of Scientific and Technical Information of China (English)

    2012-01-01

    <正>According to recently-released "Notice con-cerning Environmental Protection Checks for IPO of Sichuan LIWU Copper Co., Ltd.", Sichuan LIWU Copper Co., Ltd. (hereinafter referred to as LIWU Copper) plans to issue 68 million shares, and all the funds raised will be

  1. Canine Models for Copper Homeostasis Disorders

    NARCIS (Netherlands)

    Wu, Xiaoyan; Leegwater, Peter A J|info:eu-repo/dai/nl/074236539; Fieten, Hille|info:eu-repo/dai/nl/314112596

    2016-01-01

    Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and neurolog

  2. Extra-Hepatic Storage of Copper

    DEFF Research Database (Denmark)

    Heydorn, Kaj; Damsgaard, Else; Horn, N.

    1975-01-01

    The distribution of copper among the organs of an aborted, male foetus, expected to develop Menkes' syndrome, was entirely different from the distribution in 4 normal foetuses. Copper concentrations determined by neutron activation analysis showed a considerably reduced content in the liver......, but increased concentrations in the other organs analysed; total foetal copper was normal....

  3. Quanwei Copper Processing Base Put Into Operation

    Institute of Scientific and Technical Information of China (English)

    2009-01-01

    <正>Quanwei (Tongling) Copper Co.,Ltd’s copper processing base in Tongling of Anhui Province has been put into operation at the end of De- cember last year. It is reported that the copper processing project, invested by Zhengwei (Shenzhen) Technology

  4. Study on copper adsorption on olivine

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    The copper adsorption on olivine supplied by A/S Olivine production plant at Aheim in western Norway has been studied. The factors which affect the uptake of copper have been evaluated. The results reveal that the equilibrium pH in aqueous solution has the greatest influence on the copper adsorption thanks to the competitive adsorption between proton and copper ions, and the adsorption of copper to olivine increases rapidly with the pH increasing from 4 to 6. The initial copper concentration and olivine dose also possess significant effect on copper adsorption. The adsorption efficieny of copper increases with the increase of olivine dose or the decrease of initial copper concentration at the same pH. The ionic strength effect on the adsorption has also been investigated, but it owns little effect on the adsorption process of copper due to the formation of inner sphere surface complexation of copper on olivine. The experimental data show that olivine has a high acid buffer capacity and is an effective adsorbent for copper.

  5. Canine Models for Copper Homeostasis Disorders

    NARCIS (Netherlands)

    Wu, Xiaoyan; Leegwater, Peter A J; Fieten, Hille

    2016-01-01

    Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and neurolog

  6. Preparation of Copper-loaded Microcapsule Formulations

    Directory of Open Access Journals (Sweden)

    Nenad Jalšenjak

    2011-06-01

    Full Text Available Novel copper-loaded chitosan or chitosan/alginate based microcapsules formulations have been presented. It was shown that prolonged release of copper from microcapsules accompanied with possible prolonged presence of copper on leaves is useful in crop protection.

  7. Preparation of Copper-loaded Microcapsule Formulations

    Directory of Open Access Journals (Sweden)

    Nenad Jalšenjak

    2014-02-01

    Full Text Available Novel copper-loaded chitosan or chitosan/alginate based microcapsules formulations have been presented. It was shown that prolonged release of copper from microcapsules accompanied with possible prolonged presence of copper on leaves is useful in crop protection.

  8. Canine Models for Copper Homeostasis Disorders

    NARCIS (Netherlands)

    Wu, Xiaoyan; Leegwater, Peter A J; Fieten, Hille

    2016-01-01

    Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and

  9. Copper coating specification for the RHIC arcs

    Energy Technology Data Exchange (ETDEWEB)

    Blaskiewicz, M.

    2010-12-01

    Copper coating specifications for the RHIC arcs are given. Various upgrade scenarios are considered and calculations of resistive wall losses in the arcs are used to constrain the necessary quality and surface thickness of a copper coating. We find that 10 {mu}m of high purity copper will suffice.

  10. Distribution of Copper in Rats Submitted to Treatment With Copper Aspirinate

    OpenAIRE

    LIU, Weiping; Yang, Yikun; Xiong, Huizhou; Lu, Ying; Yang, Rong

    1998-01-01

    The distribution of copper in Sprague – Dawley rats following a three month oral administration of 0,10 or 50mg/kg copper aspirinate has been investigated. Metal content was determined by ICP – AES in blood, brain, kidney, liver, lung, spleen, and dejection. The results show that treatment with copper aspirinate did not cause accumulation of copper in rats and excess ingested copper was excreted through feces.

  11. Chinalco Straightened Out Copper Assets, and Delegated Stock Equity of Yunnan Copper

    Institute of Scientific and Technical Information of China (English)

    2014-01-01

    <正>Immediately after the news that Chinalco transferred 58%stock equity of Yunnan Copper Group to its wholly-owned subsidiary China Copper Corporation Limited free of charge was disclosed on July 9,many individual investors couldn’t help but to think:Does it mean China Copper Corporation Limited will assemble assets for overall listing?At present,among main copper business companies under China Copper Corporation

  12. A copper vapor laser by using a copper-vapor-complex reaction at a low temperature

    OpenAIRE

    Kano, Toshiyuki; Taniguchi, Hiroshi; Saito, Hiroshi

    1987-01-01

    A copper vapor laser performance by using ametal-vapor-complex reaction (Cu+AlBr3) is reported. The laser operation is obtained at a low temperature without externalheating because of the AlBr3 vapors evaporating at a room temperature. The copper vapor laser using this metal-vapor-complex reaction has an advantage of deposition-free of a metallic copper to the laser tube wall, which is different from the copper halide and the organometallic copper lasers.

  13. Copper metabolism and copper-mediated alterations in the metabolism of cultured astrocytes

    OpenAIRE

    Scheiber, Ivo Florin

    2012-01-01

    Copper is an essential element that is required for a variety of important cellular functions. Since not only copper deficiency, but also excess of copper can seriously affect cellular functions, cellular copper metabolism is tightly regulated. Disturbances of copper homeostasis are the underlying defect of the inherited diseases Menkes and Wilson s disease and have also been linked to several neurodegenerative diseases including Alzheimer s disease and Parkinson s disease. Known astrocytes f...

  14. Influence of pulse ratio on codeposition of copper species with calcium phosphate coatings on titanium by means of electrochemically assisted deposition.

    Science.gov (United States)

    Wolf-Brandstetter, Cornelia; Oswald, Steffen; Bierbaum, Susanne; Wiesmann, Hans-Peter; Scharnweber, Dieter

    2014-01-01

    Aim of this study was to combine the well-known biocompatibility and ostoeconductivity of thin calcium phosphate coatings on titanium with proangiogenic signals from codeposited copper species. Copper species could be integrated in mineral layers based on hydroxyapatite by means of electrochemically assisted deposition from electrolytes containing calcium, phosphate, and copper ions. Different combinations of duration and intensity of galvanostatic pulses result in different amounts of deposited calcium phosphate and of copper species even for the same applied total charge. Absolute amounts of copper varied between 2.1 and 6.9 μg/cm², and the copper was distributed homogeneously as shown by EDX mapping. The presence of copper did not change the crystalline phase of deposited calcium phosphate (hydroxyapatite) but provoked a significant decrease in deposited amounts by factor 3 to 4. The copper was deposited mainly as Cu(I) species with a minor fraction of basic copper phosphates. Reduction of copper occurred not only at the surface of titanium but also within the hydroxyapatite coating due to the reaction with hydrogen produced by the electrolysis of water during the cathodic polarization of the substrate.

  15. RF screening by thin resistive layers

    CERN Document Server

    Caspers, Friedhelm; González, C; Jensen, E; Keil, Eberhard; Morvillo, M; Ruggiero, F; Schröder, G; Zotter, Bruno W; Dyachkov, M

    1999-01-01

    We discuss the results of recent impedance measurements for an LHC dump kicker prototype, performed at CERN using the coaxial wire method. The kicker design includes a vacuum barrier consisting of a ceramic chamber internally coated with a thin metallic layer having good electric contact with the external beam pipe. For the bench test the coated ceramic tube was replaced by a kapton foil with a 0.2 \\mu\\m copper layer having the same DC resistance of 0.7 Ømega\\m. The measurements show that this resistive coating provides a very effective RF screening down to frequencies below 1 MHz, where the skin depth is two orders of magnitude larger than the layer thickness and one could expect full penetration of the electromagnetic fields. We also present simulation results and analytic considerations in agreement with the measurements, showing that the return currents almost entirely flow through the copper layer down to frequencies where the reactive impedance of the kicker elements located behind it becomes comparabl...

  16. Electrochemical behaviour of alkaline copper complexes

    Indian Academy of Sciences (India)

    C L Aravinda; S M Mayanna; V R Muralidharan

    2000-10-01

    A search for non-cyanide plating baths for copper resulted in the development of alkaline copper complex baths containing trisodium citrate [TSC] and triethanolamine [TEA]. Voltammetric studies were carried out on platinum to understand the electrochemical behaviour of these complexes. In TSC solutions, the deposition of copper involves the slow formation of a monovalent species. Adsorption of this species obeys Langmuir isotherm. In TEA solutions the deposition involves the formation of monovalent ions obeying the non-activated Temkin isotherm. Conversion of divalent to monovalent copper is also slow. In TEA and TSC alkaline copper solutions, the predominant species that undergo stepwise reduction contain only TEA ligands

  17. Soft chemical control of the crystal and magnetic structure of a layered mixed valent manganite oxide sulfide

    Directory of Open Access Journals (Sweden)

    Jack N. Blandy

    2015-04-01

    Full Text Available Oxidative deintercalation of copper ions from the sulfide layers of the layered mixed-valent manganite oxide sulfide Sr2MnO2Cu1.5S2 results in control of the copper-vacancy modulated superstructure and the ordered arrangement of magnetic moments carried by the manganese ions. This soft chemistry enables control of the structures and properties of these complex materials which complement mixed-valent perovskite and perovskite-related transition metal oxides.

  18. Surface investigation of naturally corroded gilded copper-based objects

    Science.gov (United States)

    Ingo, G. M.; Riccucci, C.; Lavorgna, M.; Salzano de Luna, M.; Pascucci, M.; Di Carlo, G.

    2016-11-01

    Gold and silver coated copper-based artefacts subjected to long-term natural corrosion phenomena were studied by means of the combined use of X-ray photoelectron spectroscopy (XPS), scanning electron microscopy coupled with energy dispersive X-ray spectroscopy (SEM + EDS), and optical microscopy (OM). The results allowed the identification of the chemistry and structure of the Au or Ag layers deposited by fire-gilding or mercury-silvering and the determination of the corrosion products formed due to interaction with the surrounding environment. Different degradation phenomena of the noble metal layer and copper substrate are induced by the presence of chlorine, sulphur and phosphorous and they are boosted by the metal galvanic coupling which makes gilded-metal art works unstable from a chemico-physical point of view. The SEM + EDS and OM results also suggest that particular care must be used during the removal of the encrustations and of the external corrosion products to avoid the loss of the remains of the noble layer often floating or embedded in the corrosion products. Furthermore, in order to avoid the reaction between nantokite (CuCl) and moisture the use no or low toxic inhibitors is suggested to avoid further severe degradation phenomena enhancing the long-lasting chemico-physical stability of these precious artefacts and giving them a greater chance of survival.

  19. Copper chloride electrolyzer for the production of hydrogen via the copper-chlorine thermochemical cycle

    Science.gov (United States)

    Roy, Rahul Dev

    Hydrogen is considered a key element in solving the upcoming energy crisis, it is not the primary fuel source but an "energy carrier" similar to electricity and has to be produced using some other hydrogen rich source. Thermochemical water decomposition is a promising alternative to steam-methane reforming and electrolytic water splitting for a sustainable method of large-scale hydrogen production. The Copper-Chlorine thermochemical cycle is one of prime contenders among all the other thermochemical cycles being studied because of its low energy requirements compared to others and mild operating conditions, therefore making it available to be readily integrated to the available nuclear reactors or solar energy installations. This present work focuses on the study and development of a proton exchange membrane (PEM) electrolyzer cell for the Copper-Chlorine thermo chemical cycle to obtain a better understanding through experiments and models of this process. Different operating and design parameters such as temperature, flow rate, current density, membranes and gas diffusion layers were considered to reduce the voltage and hence increase the efficiency of the electrolyzer. The effects of catalyst and mass transfer were studied on the thin film electrode using a rotating disk electrode (RDE) setup. A mathematical model was also developed to monitor the performance of the electrolyzer by predicting the change in concentration of copper chloride in the system with respect to time. It is observed that flow rate and temperature plays a major role in decreasing the voltage drop. There was no effect of catalyst in the anode when compared to a bare anode at lower flow rates; but at higher flow rates there was significant decrease in voltage drop when a carbon cloth was placed at the anode end. High surface area carbon black has comparable activity towards CuCl oxidation with conventional catalyst like Platinum or Ruthenium oxide. It is also seen that mass transfers possess a

  20. Spectroscopic studies of copper enzymes

    Energy Technology Data Exchange (ETDEWEB)

    Dooley, D.M.; Moog, R.; Zumft, W.; Koenig, S.H.; Scott, R.A.; Cote, C.E.; McGuirl, M.

    1986-05-01

    Several spectroscopic methods, including absorption, circular dichroism (CD), magnetic CD (MCD), X-ray absorption, resonance Raman, EPR, NMR, and quasi-elastic light-scattering spectroscopy, have been used to probe the structures of copper-containing amine oxidases, nitrite reductase, and nitrous oxide reductase. The basic goals are to determine the copper site structure, electronic properties, and to generate structure-reactivity correlations. Collectively, the results on the amine oxidases permit a detailed model for the Cu(II) sites in these enzymes to be constructed that, in turn, rationalizes the ligand-binding chemistry. Resonance Raman spectra of the phenylhydrazine and 2,4-dinitrophenyl-hydrazine derivatives of bovine plasma amine oxidase and models for its organic cofactor, e.g. pyridoxal, methoxatin, are most consistent with methoxatin being the intrinsic cofactor. The structure of the Cu(I) forms of the amine oxidases have been investigated by X-ray absorption spectroscopy (XAS); the copper coordination geometry is significantly different in the oxidized and reduced forms. Some anomalous properties of the amine oxidases in solution are explicable in terms of their reversible aggregation, which the authors have characterized via light scattering. Nitrite and nitrous oxide reductases display several novel spectral properties. The data suggest that new types of copper sites are present.

  1. Copper complexes as chemical nucleases

    Indian Academy of Sciences (India)

    Akhil R Chakravarty; Pattubala A N Reddy; Bidyut K Santra; Anitha M Thomas

    2002-08-01

    Redox active mononuclear and binuclear copper(II) complexes have been prepared and structurally characterized. The complexes have planar N-donor heterocyclic bases like 1,10-phenanthroline (phen), dipyridoquinoxaline (dpq) and dipyridophenazine (dppz) ligands that are suitable for intercalation to B-DNA. Complexes studied for nuclease activity have the formulations [Cu(dpq)2(H2O)] (ClO4)2.H2O (1), [{CuL(H2O)}2(-ox)](ClO4)2 (L = bpy, 2; phen, 3; dpq, 4; and dppz, 5) and [Cu(L)(salgly)] (L = bpy, 6; phen, 7; dpq, 8; and dppz, 9), where salgly is a tridentate Schiff base obtained from the condensation of glycine and salicylaldehyde. The dpq complexes are efficient DNA binding and cleavage active species. The dppz complexes show good binding ability but poor nuclease activity. The cleavage activity of the bis-dpq complex is significantly higher than the bis-phen complex of copper(II). The nuclease activity is found to be dependent on the intercalating nature of the complex and on the redox potential of the copper(II)/copper(I) couple. The ancillary ligand plays a significant role in binding and cleavage activity.

  2. Copper proteomes, phylogenetics and evolution.

    Science.gov (United States)

    Decaria, Leonardo; Bertini, Ivano; Williams, Robert J P

    2011-01-01

    This paper is a continuation of our study of the connection between the changing environment and the changing use of particular elements in organisms in the course of their combined evolution (Decaria, Bertini and Williams, Metallomics, 2010, 2, 706). Here we treat the changes in copper proteins in historically the same increasingly oxidising environmental conditions. The study is a bioinformatic analysis of the types and the numbers of copper domains of proteins from 435 DNA sequences of a wide range of organisms available in NCBI, using the method developed by Andreini, Bertini and Rosato in Accounts of Chemical Research 2009, 42, 1471. The copper domains of greatest interest are found predominantly in copper chaperones, homeostatic proteins and redox enzymes mainly used outside the cytoplasm which are in themselves somewhat diverse. The multiplicity of these proteins is strongly marked. The contrasting use of the iron and heme iron proteins in oxidations, mostly in the cytoplasm, is compared with them and with activity of zinc fingers during evolution. It is shown that evolution is a coordinated development of the chemistry of elements with use of novel and multiple copies of their proteins as their availability rises in the environment.

  3. CopperCore Service Integration

    Science.gov (United States)

    Vogten, Hubert; Martens, Harrie; Nadolski, Rob; Tattersall, Colin; van Rosmalen, Peter; Koper, Rob

    2007-01-01

    In an e-learning environment there is a need to integrate various e-learning services like assessment services, collaboration services, learning design services and communication services. In this article we present the design and implementation of a generic integrative service framework, called CopperCore Service Integration (CCSI). We will…

  4. Negative lattice expansion from the superconductivity--antiferromagnetism crossover in ruthenium copper oxides.

    Science.gov (United States)

    McLaughlin, A C; Sher, F; Attfield, J P

    2005-08-11

    The mechanism of high-transition-temperature (high-T(c)) superconductivity in doped copper oxides is an enduring problem. Antiferromagnetism is established as the competing order, but the relationship between the two states in the intervening 'pseudogap' regime has become a central puzzle. The role of the crystal lattice, which is important in conventional superconductors, also remains unclear. Here we report an anomalous increase of the distance between copper oxide planes on cooling, which results in negative thermal volume expansion, for layered ruthenium copper oxides that have been doped to the boundary of antiferromagnetism and superconductivity. We propose that a crossover between these states is driven by spin ordering in the ruthenium oxide layers, revealing a novel mechanism for negative lattice expansion in solids. The differences in volume and lattice strain between the distinct superconducting and antiferromagnetic states can account for the phase segregation phenomena found extensively in low-doped copper oxides, and show that Cooper pair formation is coupled to the lattice. Unusually large variations of resistivity with magnetic field are found in these ruthenium copper oxides at low temperatures through coupling between the ordered Ru and Cu spins.

  5. Electroless Plating of Carbon Nanotubes with Copper%碳纳米管的化学镀铜

    Institute of Scientific and Technical Information of China (English)

    凤仪; 袁海龙

    2004-01-01

    A simple chemical method was employed to coat carbon nanotubes with a layer of copper. Due to the hydrophobic nature, large surface curvature, small diameter and large aspect ratio, it is difficult to gain continuous electroless plating layer on the surface of carbon nanotubes. In this paper, a series methods (oxidization, sensitization and activation) are used to add active sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath and operating condition can decelerate electroless plating rate. The samples before and after coating were analyzed using transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that the surface of carbon nanotubes was successfully coated with continuous layer of copper, which lays a good foundation for applying carbon nanotubes in composites.

  6. Deposition of Antimicrobial Copper-Rich Coatings on Polymers by Atmospheric Pressure Jet Plasmas

    Directory of Open Access Journals (Sweden)

    Jana Kredl

    2016-04-01

    Full Text Available Inanimate surfaces serve as a permanent reservoir for infectious microorganisms, which is a growing problem in areas in everyday life. Coating of surfaces with inorganic antimicrobials, such as copper, can contribute to reduce the adherence and growth of microorganisms. The use of a DC operated air plasma jet for the deposition of copper thin films on acrylonitrile butadiene styrene (ABS substrates is reported. ABS is a widespread material used in consumer applications, including hospitals. The influence of gas flow rate and input current on thin film characteristics and its bactericidal effect have been studied. Results from X-ray photoelectron spectroscopy (XPS and atomic force microscopy confirmed the presence of thin copper layers on plasma-exposed ABS and the formation of copper particles with a size in the range from 20 to 100 nm, respectively. The bactericidal properties of the copper-coated surfaces were tested against Staphylococcus aureus. A reduction in growth by 93% compared with the attachment of bacteria on untreated samples was observed for coverage of the surface with 7 at. % copper.

  7. A novel compound cleaning solution for benzotriazole removal after copper CMP

    Science.gov (United States)

    Zhangbing, Gu; Yuling, Liu; Baohong, Gao; Chenwei, Wang; Haiwen, Deng

    2015-10-01

    After the chemical mechanical planarization (CMP) process, the copper surface is contaminated by a mass of particles (e.g. silica) and organic residues (e.g. benzotriazole), which could do great harm to the integrated circuit, so post-CMP cleaning is essential. In particular, benzotriazole (BTA) forms a layer of Cu-BTA film with copper on the surface, which leads to a hydrophobic surface of copper. So an effective cleaning solution is needed to remove BTA from the copper surface. In this work, a new compound cleaning solution is designed to solve two major problems caused by BTA: one is removing BTA and the other is copper surface corrosion that is caused by the cleaning solution. The cleaning solution is formed of alkaline chelating agent (FA/O II type), which is used to remove BTA, and a surfactant (FA/O I type), which is used as a corrosion inhibitor. BTA removal is characterized by contact angle measurements and electrochemical techniques. The inhibiting corrosion ability of the surfactant is also characterized by electrochemical techniques. The proposed compound cleaning solution shows advantages in removing BTA without corroding the copper surface. Project supported by the Special Project Items No.2 in National Long-Term Technology Development Plan, China (Nos. 2009ZX02308-003, 2014ZX02301003-007).

  8. Effect of process parameters on coating composition of cathodic-plasma-electrolysis-treated copper

    Indian Academy of Sciences (India)

    ASIYEH HABIBI; S MOHAMMAD MOUSAVI KHOIE; FARZAD MAHBOUBI; MUSTAFA URGEN

    2017-04-01

    Cathodic plasma electrolysis is a novel technique to form nanostructured layers on metallic surfaces by application of high voltage in a suitable aqueous electrolyte. In the present study, copper is treated by plasma electrolysisin 50 vol% ethanol electrolyte and coatings comprising carbon nanostructure and copper oxide are formed on the copper. The effect of some process parameters such as electrical conductivity, volume and temperature of electrolyte and ratio of anode to cathode surface area on current–voltage behaviour and subsequently coating compositions are investigated at 150V deposition voltage. The composition and morphology of these coatings are characterized by X-ray diffraction, Raman spectroscopy and scanning electron microscopy. Different current–voltage behaviours, temperatures of substrate and the contents and energies of radicals and ions around the substrate by changes in the mentioned parameters cause different compositions from 100 vol% copper oxide to different ratios of copper oxide to carbon, the structure changing from amorphous to graphitic structure in carbon and amorphous to cubic morphology in copper oxide on the substrate. Therefore, the understanding of cathodic plasma electrolysiscan be developed.

  9. Evaluate of head loss, sediment value and copper removal in sand media (rapid sand filter

    Directory of Open Access Journals (Sweden)

    Daneshi Navab

    2014-06-01

    Full Text Available Along with the technology development and increasing consumption of water resources, we are experiencing low qualities in the mentioned resources. Copper brings about serious environment al pollution, threatening human health and ecosystem. This metal found variously in water resources and industrial activities. Therefore, it needs to treat the water resources from these excessive amounts. Different methods have used for this reason but the most used method during recent years has been the absorption by economic absorbers such as sand. Rapid sand filters usually used in water and wastewater treatment plants for water clarification. In this research, a single layer gravity rapid sand filter has used to reduce different concentrations of copper. sediment value and head loss arising in filter media is simulated by using combination of Carman-Kozeny, Rose and Gregory models in different discharges of rapid sand filter. Results have shown that with increasing in discharge and decreasing in input copper concentration, arriving time to given head loss, is increasing. In addition, results demonstrated that with increasing in copper concentration in influent, removal efficiency is decreasing somewhat. Results of this research can applied in an appropriate design of rapid sand filter to copper removal, a prediction of rapid sand filter ability to copper removal and an estimation of arising head loss during filter work thus evaluating of time interval backwash. DOI: http://dx.doi.org/10.3126/ije.v3i2.10641 International Journal of the Environment Vol.3(2 2014: 276-286

  10. Study on copper complexing ligand concentrations in several China's coastal waters

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Copper complexing ligand concentrations in the Daya Bay, Qingdao coast, Jiaozhou Bay, South China Sea and Huanghe Estuary waters were determined by the anodic stripping voltammetry technique. The distribution regularity and the relationship with other parameters were discussed. The results were as follows: Copper complexing ligand concentrations of the South China Sea were a little higher than those of other sea areas, and they were apparently higher than those of the ocean. Compared with the subsurface layer (SSL) in the sea surface microlayer copper complexing ligand concentrations showed an enrichment phenomenon, of which the mechanism is similar to dissolved organic matter. The metal complexing ligand concentration profiles of the South China Sea showed that the value in the sea surface was the highest, then it decreased with depth accruing, and a higher value appeared at the bottom. Copper complexing ligand concentrations were higher than those of cadmium and lead. Ligands in each sea area exhibited a complicated property. In short, the distribution regularity of copper complexing ligand concentrations in China' s coastal waters was consistent with that of other regions in the world. Meanwhile, the positive relationship between the copper complexing ligand concentrations and biological oxygen demand, chemical oxygen demand, dissolved organic carbon, and viscosity were found clearly.

  11. Friction stir welding of copper alloys

    Institute of Scientific and Technical Information of China (English)

    Liu Shuhua; Liu Meng; Wang Deqing; Xu Zhenyue

    2007-01-01

    Copper plates,brass plates and copper/brass plates were friction stir welded with various parameters. Experimental results show that the microstructure of the weld is characterized by its much finer grains as contrasted with the coarse grains of parent materials and the heat-affected zones are very narrow. The microhardness of the copper weld is a little higher than that of parent plate. The microhardness of brass weld is about 25% higher than that of parent material. The tensile strength of copper joints increases with increasing welding speed in the test range. The range of parameters to obtain good welds for copper is much wider than that for brass. When different materials were welded, the position of copper plate before welding affected the quality of FSW joints. If the copper plate was put on the advancing side of weld, the good quality of weld could be got under proper parameters.

  12. Catastrophic Oxidation of Copper: A Brief Review

    Science.gov (United States)

    Belousov, V. V.; Klimashin, A. A.

    2012-10-01

    A brief review of the current understanding of copper accelerated oxidation in the presence of low-melting oxides (Bi2O3, MoO3, and V2O5) is given. Special attention is paid to the kinetics, thermodynamics, and mechanisms of accelerated oxidation of copper. The mechanisms of two stages (fast and superfast) of the copper accelerated oxidation are considered. It is shown that the fast oxidation of copper occurs by a diffusion mechanism. Oxygen diffusion along the liquid channels in the oxide scale is the rate-limiting step in the overall mechanism. The superfast oxidation of copper occurs by a fluxing mechanism. Realization of the particular mechanism depends on the mass ratio of low-melting oxide to the metal. The mass ratios of low-melting oxide to the metal and the oxygen partial pressures for superfast oxidation of copper are established. A model of the fast oxidation of copper is discussed.

  13. Process Of Bonding Copper And Tungsten

    Science.gov (United States)

    Slattery, Kevin T.; Driemeyer, Daniel E.

    1999-11-23

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  14. Radiation resistance of copper alloys at high exposure levels

    Energy Technology Data Exchange (ETDEWEB)

    Garner, F.A. (Pacific Northwest Lab., Richland, WA (USA)); Zinkle, S.J. (Oak Ridge National Lab., TN (USA))

    1990-08-01

    Copper alloys are currently being considered for high heat flux applications in fusion power devices. A review is presented of the results of two separate series of experiments on the radiation response of copper and copper alloys. One of these involved pure copper and boron-doped copper in the ORR mixed spectrum reactor. The other series included pure copper and a wide array of copper alloys irradiated in the FFTF fast reactor 16 refs., 13 figs.

  15. Abnormal Copper Homeostasis: Mechanisms and Roles in Neurodegeneration

    OpenAIRE

    Mario Manto

    2014-01-01

    As a cofactor of proteins and enzymes involved in critical molecular pathways in mammals and low eukaryotes, copper is a transition metal essential for life. The intra-cellular and extra-cellular metabolism of copper is under tight control, in order to maintain free copper concentrations at very low levels. Copper is a critical element for major neuronal functions, and the central nervous system is a major target of disorders of copper metabolism. Both the accumulation of copper and copper d...

  16. Smelting chlorination method applied to removal of copper from copper slags

    Institute of Scientific and Technical Information of China (English)

    李磊; 王华; 胡建杭

    2015-01-01

    In order to reasonably utilize the iron resources of copper slags, the smelting chlorination process was used to remove copper from copper slags. Higher holding temperature and O2 flow rate are beneficial to increasing copper removal rate. However, the Cu2O mode is formed by the reaction of surplus O2 and CuCl with O2 flow rate increasing over 0.4 L/min, causing CuCl volatilization rate and copper removal rate to decrease. The resulting copper removal rate of 84.34%is obtained under the optimum conditions of holding temperature of 1573 K, residence time of 10 min, CaCl2 addition amount of 0.1 (mass ratio of CaCl2 and the copper slag) and oxygen flow rate of 0.4 L/min. The efficient removal of copper from copper slags through chlorination is feasible.

  17. Grain Refinement of Deoxidized Copper

    Science.gov (United States)

    Balart, María José; Patel, Jayesh B.; Gao, Feng; Fan, Zhongyun

    2016-10-01

    This study reports the current status of grain refinement of copper accompanied in particular by a critical appraisal of grain refinement of phosphorus-deoxidized, high residual P (DHP) copper microalloyed with 150 ppm Ag. Some deviations exist in terms of the growth restriction factor ( Q) framework, on the basis of empirical evidence reported in the literature for grain size measurements of copper with individual additions of 0.05, 0.1, and 0.5 wt pct of Mo, In, Sn, Bi, Sb, Pb, and Se, cast under a protective atmosphere of pure Ar and water quenching. The columnar-to-equiaxed transition (CET) has been observed in copper, with an individual addition of 0.4B and with combined additions of 0.4Zr-0.04P and 0.4Zr-0.04P-0.015Ag and, in a previous study, with combined additions of 0.1Ag-0.069P (in wt pct). CETs in these B- and Zr-treated casts have been ascribed to changes in the morphology and chemistry of particles, concurrently in association with free solute type and availability. No further grain-refining action was observed due to microalloying additions of B, Mg, Ca, Zr, Ti, Mn, In, Fe, and Zn (~0.1 wt pct) with respect to DHP-Cu microalloyed with Ag, and therefore are no longer relevant for the casting conditions studied. The critical microalloying element for grain size control in deoxidized copper and in particular DHP-Cu is Ag.

  18. The copper metallome in prokaryotic cells.

    Science.gov (United States)

    Rensing, Christopher; McDevitt, Sylvia Franke

    2013-01-01

    As a trace element copper has an important role in cellular function like many other transition metals. Its ability to undergo redox changes [Cu(I) ↔ Cu(II)] makes copper an ideal cofactor in enzymes catalyzing electron transfers. However, this redox change makes copper dangerous for a cell since it is able to be involved in Fenton-like reactions creating reactive oxygen species (ROS). Cu(I) also is a strong soft metal and can attack and destroy iron-sulfur clusters thereby releasing iron which can in turn cause oxidative stress. Therefore, copper homeostasis has to be highly balanced to ensure proper cellular function while avoiding cell damage.Throughout evolution bacteria and archaea have developed a highly regulated balance in copper metabolism. While for many prokaryotes copper uptake seems to be unspecific, others have developed highly sophisticated uptake mechanisms to ensure the availability of sufficient amounts of copper. Within the cytoplasm copper is sequestered by various proteins and molecules, including specific copper chaperones, to prevent cellular damage. Copper-containing proteins are usually located in the cytoplasmic membrane with the catalytic domain facing the periplasm, in the periplasm of Gram-negative bacteria, or they are secreted, limiting the necessity of copper to accumulate in the cytoplasm. To prevent cellular damage due to excess copper, bacteria and archaea have developed various copper detoxification strategies. In this chapter we attempt to give an overview of the mechanisms employed by bacteria and archaea to handle copper and the importance of the metal for cellular function as well as in the global nutrient cycle.

  19. Variations of serum copper values in pregnancy

    Directory of Open Access Journals (Sweden)

    Vukelić Jelka

    2012-01-01

    Full Text Available Introduction. Copper is essential micronutrient and has an important role in the human body. The serum copper increases during pregnancy and is doubled at full term. Lower levels of serum copper in pregnancy are connected with some pathological conditions. Objective. The aim of this study was to estimate the levels of serum copper in normal and pathological pregnancies, comparing them with values of serum copper in non-pregnant women, to determine if serum copper is lower in some pathological pregnancies and if this is of some importance. Methods. A total of 2170 plasma samples for copper analyses were made in the following groups: healthy non-pregnant women; healthy pregnant women from the 5th-40th gestational week, during the first delivery stage and during the first three postpartum weeks, in pregnant women with habitual abortion, imminent abortion, abortion in progress, missed abortion (9th-24th weeks, missed labour and premature rupture of membranes (29th-40th weeks. Levels of serum copper were determined by colorimetric technique of bathocuproin with disulphate as a chromogen. Results. Serum copper values in non-pregnant women range from 11.6-25.8 μmol/L. In healthy pregnant women, there is a constant trend of the increase of serum copper. The mean serum copper values revealed three significant peaks at the 22nd, 27th and 35th gestational week. Serum copper values in the patients with some pathological pregnancies in relation to the serum copper values of the healthy pregnant women were significantly lower. Conclusion. Serum copper values can be used as an indicator of some pathological pregnancies.

  20. Variations of serum copper values in pregnancy.

    Science.gov (United States)

    Vukelić, Jelka; Kapamadzija, Aleksandra; Petrović, Djordje; Grujić, Zorica; Novakov-Mikić, Aleksandra; Kopitović, Vesna; Bjelica, Artur

    2012-01-01

    Copper is essential micronutrient and has an important role in the human body. The serum copper increases during pregnancy and is doubled at full term. Lower levels of serum copper in pregnancy are connected with some pathological conditions. The aim of this study was to estimate the levels of serum copper in normal and pathological pregnancies, comparing them with values of serum copper in non-pregnant women, to determine if serum copper is lower in some pathological pregnancies and if this is of some importance. A total of 2170 plasma samples for copper analyses were made in the following groups: healthy non-pregnant women; healthy pregnant women from the 5th-40th gestational week, during the first delivery stage and during the first three postpartum weeks, in pregnant women with habitual abortion, imminent abortion, abortion in progress, missed abortion (9th-24th weeks), missed labour and premature rupture of membranes (29th-40th weeks). Levels of serum copper were determined by colorimetric technique of bathocuproin with disulphate as a chromogen. Serum copper values in non-pregnant women range from 11.6-25.8 micromol/L. In healthy pregnant women, there is a constant trend of the increase of serum copper. The mean serum copper values revealed three significant peaks at the 22nd, 27th and 35th gestational week. Serum copper values in the patients with some pathological pregnancies in relation to the serum copper values of the healthy pregnant women were significantly lower. Serum copper values can be used as an indicator of some pathological pregnancies.

  1. Spectroelectrochemical characterisation of copper salen-based polymer modified electrode

    OpenAIRE

    Martins, Madga; Vilas-Boas, Miguel; de Castro, B; Hillman, A.R.; Freire, C.

    2005-01-01

    Electrogenerated polymers based on copper salen-type complexes were characterised electrochemically and by in situ UV–vis and ex situ EPR spectroscopy. The films, poly[Cu(salen)] and poly[Cu(saltMe)], exhibit reversible oxidative electrochemical behaviour in a wide potential range (0.0–1.5 V). Different regimes for charge transport behaviour are accessed by manipulation of film thickness and experimental time scale: thin films (surface concentration, Γ < ca. 80 nmol cm−2) show thin-layer/surf...

  2. First prototype Copper-Niobium RF Superconducting Cavity

    CERN Multimedia

    1983-01-01

    This is the first RF superconducting cavity made of copper with a very thin layer of pure niobium deposited on the inner wall by sputtering. This new developpment lead to a considerable increase of performance and stability of superconducting cavities and to non-negligible economy. The work was carried out in the ISR workshop. This technique was adopted for the LEP II accelerating cavities. At the centre is Cristoforo Benvenuti, inventor of this important technology, with his assistants, Nadia Circelli and Max Hauer, carrying the sputtering electrode. See also 8209255, 8312339.

  3. A Plasmodium falciparum copper-binding membrane protein with copper transport motifs

    Directory of Open Access Journals (Sweden)

    Choveaux David L

    2012-11-01

    Full Text Available Abstract Background Copper is an essential catalytic co-factor for metabolically important cellular enzymes, such as cytochrome-c oxidase. Eukaryotic cells acquire copper through a copper transport protein and distribute intracellular copper using molecular chaperones. The copper chelator, neocuproine, inhibits Plasmodium falciparum ring-to-trophozoite transition in vitro, indicating a copper requirement for malaria parasite development. How the malaria parasite acquires or secretes copper still remains to be fully elucidated. Methods PlasmoDB was searched for sequences corresponding to candidate P. falciparum copper-requiring proteins. The amino terminal domain of a putative P. falciparum copper transport protein was cloned and expressed as a maltose binding fusion protein. The copper binding ability of this protein was examined. Copper transport protein-specific anti-peptide antibodies were generated in chickens and used to establish native protein localization in P. falciparum parasites by immunofluorescence microscopy. Results Six P. falciparum copper-requiring protein orthologs and a candidate P. falciparum copper transport protein (PF14_0369, containing characteristic copper transport protein features, were identified in PlasmoDB. The recombinant amino terminal domain of the transport protein bound reduced copper in vitro and within Escherichia coli cells during recombinant expression. Immunolocalization studies tracked the copper binding protein translocating from the erythrocyte plasma membrane in early ring stage to a parasite membrane as the parasites developed to schizonts. The protein appears to be a PEXEL-negative membrane protein. Conclusion Plasmodium falciparum parasites express a native protein with copper transporter characteristics that binds copper in vitro. Localization of the protein to the erythrocyte and parasite plasma membranes could provide a mechanism for the delivery of novel anti-malarial compounds.

  4. Accumulation and hyperaccumulation of copper in plants

    Science.gov (United States)

    Adam, V.; Trnkova, L.; Huska, D.; Babula, P.; Kizek, R.

    2009-04-01

    Copper is natural component of our environment. Flow of copper(II) ions in the environment depends on solubility of compounds containing this metal. Mobile ion coming from soil and rocks due to volcanic activity, rains and others are then distributed to water. Bio-availability of copper is substantially lower than its concentration in the aquatic environment. Copper present in the water reacts with other compounds and creates a complex, not available for organisms. The availability of copper varies depending on the environment, but moving around within the range from 5 to 25 % of total copper. Thus copper is stored in the sediments and the rest is transported to the seas and oceans. It is common knowledge that copper is essential element for most living organisms. For this reason this element is actively accumulated in the tissues. The total quantity of copper in soil ranges from 2 to 250 mg / kg, the average concentration is 30 mg / kg. Certain activities related to agriculture (the use of fungicides), possibly with the metallurgical industry and mining, tend to increase the total quantity of copper in the soil. This amount of copper in the soil is a problem particularly for agricultural production of food. The lack of copper causes a decrease in revenue and reduction in quality of production. In Europe, shows the low level of copper in total 18 million hectares of farmland. To remedy this adverse situation is the increasing use of copper fertilizers in agricultural soils. It is known that copper compounds are used in plant protection against various illnesses and pests. Mining of minerals is for the development of human society a key economic activity. An important site where the copper is mined in the Slovakia is nearby Smolníka. Due to long time mining in his area (more than 700 years) there are places with extremely high concentrations of various metals including copper. Besides copper, there are also detected iron, zinc and arsenic. Various plant species

  5. Jiangxi Copper and Yates Joined Hands in High-Grade Copper Foil Project Construction

    Institute of Scientific and Technical Information of China (English)

    2004-01-01

    <正> The construction of a large-scale copper foilproject recently started in the High-Tech De-velopment Zone of Nanchang,the capital ofJiangxi Province.This new copper foil factory,with a designed annual production capacity of6,000 tons of high-grade copper foil,is a jointventure project between Jiangxi Copper Group,the No.1 copper producer in China,and YatesInc.,a leading US copper product company andthe world’s first electrical circuit board maker.

  6. Electrochemical in-situ impregnation of wood using a copper nail as source for copper

    DEFF Research Database (Denmark)

    Ottosen, Lisbeth M.; Block, Thomas; Nymark, Morten

    2011-01-01

    A new method for copper impregnation of wood in structures was suggested and tested in laboratory scale with specimen of new pine sapwood. A copper nail and a steel screw were placed in the wood, and an electric direct current field was applied, so the copper nail was anode and the screw...... was cathode. At the anode, copper ions were generated. The copper ions were transported into the wood by electromigration (movement of ions in an applied electric field) towards the cathode, and a volume between the two electrodes was thereby impregnated. Copper also moved to a lesser degree in the opposite...

  7. Antibacterial and corrosive properties of copper implanted austenitic stainless steel

    Institute of Scientific and Technical Information of China (English)

    Juan Xiong; Bo-fan Xu; Hong-wei Ni

    2009-01-01

    Copper ions were implanted into austenitic stainless steel (SS) by metal vapor vacuum arc with a energy of 100 keV and an ions dose range of (0.5-8.0)x 1017 cm-2. The Cu-implanted SS was annealed in an Ar atmosphere furnace. Glancing X-ray diffraction (GXRD), transmission electron microscopy (TEM) and Auger electron spectroscopy (AES) were used to reveal the phase com-positions, microstructures, and concentration profiles of copper ions in the implanted layer. The results show that the antibacterialproperty of Cu-implanted SS is attributed to Cu9.9Fe0.1 which precipitated as needles. The depth of copper in Cu-implanted SS with annealing treatment is greater than that in Cu-implanted SS without annealing treatment, which improves the antibacterial property against S. Aureus. The salt wetting-drying combined cyclic test was used to evaluate the corrosion-resistance of antibacterial SS, and the results reveal that the antibacterial SS has a level of corrosion-resistance equivalent to that of un-implanted SS.

  8. Pool boiling heat transfer of deionized and degassed water in packed-perforated copper beads

    Science.gov (United States)

    Wen, Mao-Yu; Jang, Kuang-Jang; Ho, Ching-Yen

    2016-11-01

    Nucleate pool boiling with porous media made of perforated copper beads as the enhanced structure is conducted in saturated, deionized and degassed water. Data are taken at an atmospheric pressure (saturation temperature of 100 °C) and at heat fluxes from 4500 to 72,300 W/m2 while increasing the heat flux. The bead-packed structure is heated on the bottom. The layer of loose particles on the heated surface is free to move under the action of bulk liquid convection and vapor nucleation. The effects of the weight (number), size and layers of the free particles are experimentally explored using copper particles for different copper bead diameters which were 2, 3, 4 and 5 mm. The boiling enhancement is closely related to the particle weight, size and layers, and the heat flux applied. The results show that free particles are presented to have a distinct advantage in boiling heat transfer, resulting in an average increase in the heat transfer coefficient of 126 % relative to the flat plate without particles. In order to obtain insight into the fluid boiling phenomena, flow visualization is also made to observe the detailed fluid boiling characteristics of the copper particles present. The visualizations show that bubble nucleation preferentially occurs at the narrow corner cavities formed between the free particles and the heated surface.

  9. Copper laminated composites reinforced with Al2O3 nanoparticles by suspension method and hot pressing

    Science.gov (United States)

    Roudini, G.; Ghahfarokhi, A. Rasti; Behzadmehr, A.

    2017-05-01

    Laminated composite of copper with alumina nanoparticle reinforcements has application such as electrical industries. Electrical junctions should have high electrical, thermal conductivity with good mechanical strength. In this research the layers interface of pure copper were reinforced by alumina nanoparticles. For the production of the composite, first alumina nanoparticles were dispersed on Cu layers by suspension method and then the layers were hot pressed at 950°C under 20 MPa pressure. After composite making, the microstructure, the tensile and impact of these composite were studied. The results showed that by increasing amount of alumina nanoparticles up to 0. 5 wt %, tensile and impact strength were increased and for the composites with more than 0.5 wt % because of agglomeration of nanoparticles, these properties were decreased.

  10. Formation of TiN-encapsulated copper structures in a NH3 ambient

    Science.gov (United States)

    Li, Jian; Mayer, J. W.; Shacham-Diamand, Y.; Colgan, E. G.

    1992-06-01

    A TiN-encapsulated copper structure was made by annealing a Cu-10 at. %Ti alloy film evaporated on a SiO2/Si(100) substrate at 550 °C in a NH3 ambient. A fast heating rate (70 °C/min) to 550 °C can effectively suppress the formation of Cu3Ti and enhance the TiNx formation near the surface of the copper film. Oxygen incorporation in the TiNx layer was found by Auger depth profiling measurement. This self-encapsulated Cu structure exhibits good adhesion to SiO2 and oxidation resistance.

  11. Effective phototransformation in a heterostructure based on copper(I) oxide and cadmium tin oxide

    Science.gov (United States)

    Shelovanova, G. N.; Patrusheva, T. N.

    2017-02-01

    We present a heterostructure consisting of anodic copper oxide Cu2O on a copper substrate and a transparent Cd-Sn-O conducting film for use in solar cells. Focusing on simplicity and the availability of film fabrication techniques, we chose anodic oxidation for forming the Cu2O film and the extraction-pyrolysis technique for forming the transparent Cd-Sn-O conducting layer. We demonstrate the possibility of considerable enhancement of the phototransformation efficiency in the Cu-Cu2O/Cd-Sn-O structure over this parameter in the Cu-Cu2O structure.

  12. High-Density Chemical Intercalation of Zero-Valent Copper into Bi 2 Se 3 Nanoribbons

    KAUST Repository

    Koski, Kristie J.

    2012-05-09

    A major goal of intercalation chemistry is to intercalate high densities of guest species without disrupting the host lattice. Many intercalant concentrations, however, are limited by the charge of the guest species. Here we have developed a general solution-based chemical method for intercalating extraordinarily high densities of zero-valent copper metal into layered Bi 2Se 3 nanoribbons. Up to 60 atom % copper (Cu 7.5Bi 2Se 3) can be intercalated with no disruption to the host lattice using a solution disproportionation redox reaction. © 2012 American Chemical Society.

  13. Mineral formation on metallic copper in a `future repository site environment`

    Energy Technology Data Exchange (ETDEWEB)

    Amcoff, Oe.; Holenyi, K.

    1996-04-01

    Since reducing conditions are expected much effort has been concentrated on Cu-sulfides and CuFe-sulfides. However, oxidizing conditions are also discussed. A list of copper minerals are included. It is concluded that mineral formation and mineral transitions on the copper canister surface will be governed by kinetics and metastabilities rather than by stability relations. The sulfides formed are less likely to form a passivating layer, and the rate of sulfide growth will probably be governed by the rate of transport of reacting species to the canister surface. A series of tests are recommended, in an environment resembling the initial repository site conditions. 82 refs, 8 figs.

  14. Copper deposition and its replacement by platinum on a gold electrode

    Energy Technology Data Exchange (ETDEWEB)

    Misicak, Daniel; Ruthenburg, Travis C. [Department of Chemistry, University of California, Davis, CA 95616 (United States); Fawcett, W. Ronald, E-mail: wrfawcett@ucdavis.ed [Department of Chemistry, University of California, Davis, CA 95616 (United States)

    2010-11-01

    The decoration of single crystal gold electrodes with platinum using underpotential deposited copper as an intermediate has been studied in detail. It was found that a significant fraction of the copper is lost in the transfer process from the upd cell to the exchange cell. In addition the surface of the gold is not covered uniformly by the platinum. Nevertheless, acceleration of the electroreduction of oxygen was observed with a loading of 0.14 {mu}g cm{sup -2}. The structure of the decorating layer was studied by scanning electron microscopy and atomic force microscopy.

  15. Using surface plasmon resonances to test the durability of silver copper films

    Science.gov (United States)

    Bussjager, Rebecca J.; MacLeod, H. Angus

    1996-09-01

    Silver has high reflectivity in the visible and infrared but cannot be used fully because of its distressing lack of durability. A technique that uses the surface plasmon resonance phenomenon offers a sensitive method for studying the corrosion of silver and assessing improvements. It has been used in the investigation of the effects of flashing a thin layer, approximately 1 nm thick, of copper over silver in an attempt at cathodic protection. Tests include exposing silver and silver-copper films to air, 94% relative humidity, water, and hydrogen sulfide.

  16. Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Ramirez, Mauricio, E-mail: mauricio.ramirez2@de.bosch.com [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany); Henneken, Lothar [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Virtanen, Sannakaisa [Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany)

    2011-05-15

    The oxide formation on thin copper films deposited on Si wafer was studied by XPS, SEM and Sequential Electrochemical Reduction Analysis SERA. The surfaces were oxidized in air with a reflow oven as used in electronic assembly at temperatures of 100 deg. C, 155 deg. C, 200 deg. C, 230 deg. C and 260 deg. C. The SERA analyses detected only the formation of Cu{sub 2}O but the XPS analysis done for the calibration of the SERA equipment proved also the presence of a CuO layer smaller than 2 nm above the Cu{sub 2}O oxide. The oxide growth follows a power-law dependence on time within this temperature range and an activation energy of 33.1 kJ/mol was obtained. The wettability of these surfaces was also determined by measuring the contact angle between solder and copper substrate after the soldering process. A correlation between oxide thickness and wetting angle was established. It was found that the wetting is acceptable only when the oxide thickness is smaller than 16 nm. An activation energy of 27 kJ/mol was acquired for the spreading of lead free solder on oxidized copper surfaces. From wetting tests on copper surfaces protected by Organic Solderability Preservatives (OSP), it was possible to calculate the activation energy for the thermal decomposition of these protective layers.

  17. Tribo-chemical mechanisms of copper chemical mechanical planarization (CMP) - Fundamental investigations and integrated modeling

    Science.gov (United States)

    Tripathi, Shantanu

    inhibiting solutions, in particular to rule out capacitive charging beyond 1ms. Chronoamperometry of copper in acidic aqueous glycine solution containing the corrosion inhibitor benzotriazole (BTA) (a system that undergoes inhibition) displayed a very consistent current decay behavior at all potentials (current was inversely related to the square root of time). This, along with the scan rate dependent polarization data, indicated that the likely controlling step of the inhibition reaction was diffusion of BTA to the surface. EIS data indicated the presence of very thick inhibitor film at anodic potentials. In basic aqueous glycine solution, copper (a system that undergoes passivation, and is believed to induce mechanisms similar to those operating in weakly acidic hydrogen peroxide slurries) displayed similar chronoamperometric behavior for all anodic potentials for the first second or so. Thereafter, the current densities at active potentials settled to values around those expected from polarization curves, whereas the current densities at passive potentials continued to decline. Oxidized copper species typically formed at 'active' potentials were found to cause significant current decay at active potentials and at passive potentials before more protective passive films form. This was established from galvanostatic experiments; chronoamperometry behavior for different pre-step potentials indicating a role of passivation precursors; and distinctive EIS behavior at 'active' potentials. The second important component of the integrated tribo-chemical model, namely the mechanical properties of passive films on copper, was investigated using an environmental atomic force microscope (AFM). From the material removal response, the presence of a threshold abrasive force for removal of passive film was found. The removal per abrasive stroke was found to be less than an atomic layer, consistent with the prediction made by theoretical calculations on interaction frequency; this implies

  18. Radiocopper for the imaging of copper metabolism.

    Science.gov (United States)

    Hueting, Rebekka

    2014-04-01

    The redox-active transition metal copper is an essential trace element for growth and development and serves as a structural or catalytic cofactor for many enzymes in a range of physiological processes. Mammalian copper homeostasis is tightly regulated, and an imbalance in copper metabolism is implicated in various pathological disorders. Radioactive copper isotopes, in particular (64) Cu (t1/2  = 12.7 h) and (67) Cu (t1/2  = 62.01 h), have made important contributions to the understanding of copper metabolism in health and disease. This review gives a brief account of how radiolabelled copper(II) salts and bioreductive copper complexes have been used to trace copper uptake, transport and efflux in vitro and in vivo. Recently, positron emission tomography (PET) has emerged as a noninvasive tool to image copper metabolism in living subjects and (64) Cu-PET is investigated for the study of copper-related neurological disorders, genetic diseases and cancer.

  19. Canine Models for Copper Homeostasis Disorders

    Directory of Open Access Journals (Sweden)

    Xiaoyan Wu

    2016-02-01

    Full Text Available Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and neurological impairments. A lack in genotype-phenotype correlation in Wilson disease points toward the influence of environmental factors or modifying genes. In a number of Non-Wilsonian forms of copper metabolism, the underlying genetic defects remain elusive. Several pure bred dog populations are affected with copper-associated hepatitis showing similarities to human copper metabolism disorders. Gene-mapping studies in these populations offer the opportunity to discover new genes involved in copper metabolism. Furthermore, due to the relatively large body size and long life-span of dogs they are excellent models for development of new treatment strategies. One example is the recent use of canine organoids for disease modeling and gene therapy of copper storage disease. This review addresses the opportunities offered by canine genetics for discovery of genes involved in copper metabolism disorders. Further, possibilities for the use of dogs in development of new treatment modalities for copper storage disorders, including gene repair in patient-derived hepatic organoids, are highlighted.

  20. Canine Models for Copper Homeostasis Disorders.

    Science.gov (United States)

    Wu, Xiaoyan; Leegwater, Peter A J; Fieten, Hille

    2016-02-04

    Copper is an essential trace nutrient metal involved in a multitude of cellular processes. Hereditary defects in copper metabolism result in disorders with a severe clinical course such as Wilson disease and Menkes disease. In Wilson disease, copper accumulation leads to liver cirrhosis and neurological impairments. A lack in genotype-phenotype correlation in Wilson disease points toward the influence of environmental factors or modifying genes. In a number of Non-Wilsonian forms of copper metabolism, the underlying genetic defects remain elusive. Several pure bred dog populations are affected with copper-associated hepatitis showing similarities to human copper metabolism disorders. Gene-mapping studies in these populations offer the opportunity to discover new genes involved in copper metabolism. Furthermore, due to the relatively large body size and long life-span of dogs they are excellent models for development of new treatment strategies. One example is the recent use of canine organoids for disease modeling and gene therapy of copper storage disease. This review addresses the opportunities offered by canine genetics for discovery of genes involved in copper metabolism disorders. Further, possibilities for the use of dogs in development of new treatment modalities for copper storage disorders, including gene repair in patient-derived hepatic organoids, are highlighted.